An LCD projector for projecting an image displayed on an LCD of the electrooptic-effect type on a projection screen is disclosed. The LCD projector has a polarization beam-splitting optical system which is disposed in the optical path of a projection beam between a light source and the LCD. The optical system has a plurality of optical subsystems and at least one optical rotator. Each optical subsystem has a reflecting device and a polarization beam splitter arrangement provided with a polarization beam-splitting plane arrangement. The polarization beam splitter arrangement and the beam-splitting plane arrangement are arrangements of one or more polarization beam splitters and of one or more polarization beam-splitting planes, respectively. The beam-splitting plane arrangements provided in the plurality of the optical subsystems are disposed in the optical path of the projection beam and oriented with respect to the projection beam so as to define planes of incidence parallel to each other. The reflecting device is made up of one or more reflectors oriented so that the s-polarized component reflected on the polarization beam-splitting plane arrangement is deflected toward a prescribed region of the incidence surface of the LCD. The optical rotator makes parallel the directions of the s- and p-polarized components delivered from the optical system.

1. Field of the invention
The present invention relates to an LCD (liquid crystal display) projector to project an enlarged picture of an image displayed on an LCD to a projection screen.
2. Description of the related art
LCD projectors have been of wide interest because of their compactness and ease of installation. FIG. 1 shows an example of a prior art LCD projector. The LCD projector is basically made up of light source 51, LCD element (hereafter, referred to as LCD) 52 and projection lens 55. In the case that a twisted-nematic (TN) mode LCD is used as LCD element 52, polarizer 53 and analyzer 54 are arranged in front of and behind LCD 52, respectively. The arrangement is shown as TN-LCD 50 in FIG. 1. Light source 51 is composed of a parabolic mirror and a lamp located at the focus of the mirror, thereby emitting a light beam parallel to the optical axis of the parabolic mirror. The beam will be referred to-as projection beam 57 below. The component of projection beam 57 polarized parallel to the optic axis of polarizer 53, when it is incident on polarizer 53, undergoes intensity modulation corresponding to the display image generated on LCD 52. The major part of the perpendicularly polarized component, however, is absorbed by polarizer 53, thereby causing heat generation.
It has been common, in order to obtain a projected picture of high contrast and high quality, that LCD 52 is made of an active matrix of pixels, each provided with a switching element. While LCD 52 has the advantage of allowing a large-sized projection picture to be readily obtained with a small-sized LCD, a problem is that the switching elements and opaque electrode films provided in the active matrix prevent transmission of projection beam 57 through LCD 52, which deteriorates the light-utilization efficiency of the LCD projector, thus causing the projected picture to be dark or less luminant.
While the failure in luminance of the projected picture described above may be remedied by using a bright light source, the use of a bright light source causes another problem when the TN-LCD is used: since the perpendicular component of the projection beam (the light component polarized perpendicular to the optic axis of polarizer 53) is absorbed by polarizer 53 causing heat generation which increases as the light source is brighter, the bright light source causes deterioration of the polarizer due to a temperature rise caused by heat generation.
In order to solve this problem, S. Shikama et al. presented a novel polarization beam-splitting optical device, published in Proceedings of Eurodisplay 1990, Report of The Tenth International Display Research Conference, pages 64 through 67. FIG. 2 shows the optical layout of the Shikama et al. optical device. The optical device is made up of polarization beam splitter (PBS) 61, mirror 62 and halfwave plate 63. PBS 61 has polarization beam-splitting plane (PBSP) 64, which is oriented with respect to projection beam 57 so that the plane of incidence is parallel to the optic axis of polarizer 53. Thus the p-polarized component of projection beam 57 transmitted through PBSP 64 passes through polarizer 53. Mirror 62 is disposed on the optical path of the s-polarized component reflected on PBSP 64 and is oriented so that the s-polarized component is deflected toward the predetermined region of the incidence surface of polarizer 53. Halfwave plate 63 is disposed in the optical path of the s-polarized component reflected on mirror 62 with its optic axis making an angle of 45.degree. with the direction of polarization of the s-polarized component. Thus the s-polarized component is optically rotated to be a p-polarized light, which is then transmitted through polarizer 53. The advantages of the Shikama et al. optical device are that, since approximately 99% of projection beam 57 is delivered from their polarization beam-splitting optical device as a p-polarized beam, the brightness of the projected image is markedly improved, and that, since the s-polarized component impinged on polarizer 53 is only a small part of projection beam 57, heat generation in the polarizer due to absorption of the perpendicular component becomes far less, which allows a high intensity light source to be used without any substantial temperature rise.
While the Shikama et al. optical device provides a way of obtaining a bright projection image, a further problem has been left unsolved related to the illuminance distribution on the incidence surface of LCD element 52. FIG. 3 shows diagrams for illustrating the manner of illuminating the incidence surface of TN-LCD 50 in the LCD projector shown in FIG. 1: FIG. 3(A) is a plan view illustrating the optical path of projection beam 57, FIG. 3(B) illustrates the light-utilization efficiency for an oblong incidence surface, and FIG. 3(C) shows the illuminance curve on the same surface as FIG. 3(B).
Projection beam 57 emitted from light source 51 is perpendicularly incident on the incidence surface of TN-LCD 50 with an optical path parallel to the axis of the parabolic mirror. Since projection beam 57 has a circular cross section, the part of projection beam 57 surplus to the incidence surface (hatched with oblique lines in FIG. 3(B)) is unutilized to illuminate LCD 52. This unutilized part of projection beam 57 increases as the shape of the incidence surface differs from that of the incident-beam cross section on the incidence surface. Hereafter, the former and latter shapes will be referred to as the incidence-surface shape and the incident-beam shape, respectively. In FIG. 3(B), the incidence- surface shape is an oblong rectangle and the incident-beam shape is a circle.
It has been widely known that, when an image is projected on a large projection screen, use of an oblong or wide screen as used in a movie is preferable, because this wide projection do not cause watchers to be fatigued and serves to make a forceful impression on the watchers as well as to appeal to their emotions. This is the case in a television image plane. Specifically, a high-definition television receiver, which is capable of producing a high-quality and high-resolution image, has an image plane of an aspect ratio of 9 : 16, more oblong than the aspect ratio 3 : 4 adopted in an ordinary television receiver.
When wide projection is desired in an LCD projector, an LCD element with an oblong rectangular image plane is employed. In this case, projection beam 57 has to have a cross-sectional diameter equal to or larger than that of the circumscribed circle of the incidence surface in order that the whole incidence surface is illuminated, as shown in FIG. 3(B). Since the part of the projection beam outside the oblong rectangular incidence surface, i.e., the part unutilized for image projection, increases as the aspect ratio of the incidence surface deviates from 1, light utilization efficiency decreases, this an average illuminance of the incidence surface decreases as the incidence surface becomes more oblong. Further, since the circumscribed circle diameter for a constant area of the incidence surface increases as the aspect ratio deviates from 1, the difference between the illuminances in the central and side regions of the incidence surface tends to be more prominent, as the incidence plane is more oblong, as is seen from FIG. 3(C). This difference in illuminance causes a difference in luminance of the projected picture, further causing the quality of the projected picture to be lowered.


Described herein are methods of treating a female subject in need of in vitro fertilization to become pregnant by detecting a loss of non-atretic follicles in the female subject and providing in vitro fertilization to the female subject.

A basic doctrine of reproductive biology, which states that mammalian females lose the capacity for germ-cell renewal during fetal life, has only recently been successfully challenged by Johnson et al., (2004) Nature 428: 145. Johnson et al. are the first to conclusively demonstrate that juvenile and adult mouse ovaries possess mitotically active germ cells that, based on rates of oocyte degeneration and clearance, sustain oocyte and follicle production in the postnatal mammalian ovary.
It has been recently determined that the precursors of germ cells are not confined exclusively to the ovaries. Germ cell marker genes have now been identified in cells derived from bone marrow. In addition, transplantation of bone marrow to a conditioned host allowed for bone marrow cell development into new oocytes within the ovary.
Umbilical cord blood from newborn infants is a known reservoir of stem cells that may contribute to a variety of somatic cell lineages, including hematopoietic precursors (for reviews see Korbling and Anderlini 2001 Blood 98: 2900-2908; Ho and Punzel, 2003 J Leukoc Biol 73: 547-555; Sanchez-Ramos 2002 J Neurosci Res 69: 880-893; Lee 2004 Blood 103:1669-75). Cord blood samples are easily and safely collected and may be stored for future therapeutic use (Rogers and Casper 2004 Sexuality, Reproduction & Menopause 2: 64-70); further, their availability to individual patients offers a potential source of perfectly-matched donor cells. It was heretofore unknown whether peripheral blood, such as cord blood also contained germ cell precursors.

Methods of treating female subjects in need of in vitro fertilization


A gated voltage controlled oscillator has four identically structured delay cells, each of the delay cells having the same output load by connecting to the same number of inputs of other ones of the delay cells. Optionally a four phase sampling clock selects from the delay cell output and samples, at a four phase sampler, an input signal. Optionally an edge detector synchronizes the phase of the gated voltage controlled oscillator to coincide with NRZ bits. Optionally a variable sampling rate selects different phases from the delay cells to selectively sample NRZ bits at a lower rate. Optionally, a pulse width modulation (PWM) mode synchronizes a phase of the sampling clock to sample PWM symbols and recover encoded bits.

A signaling technique referred to as "non-return-to-zero" or "NRZ" signaling concatenates adjacent bits without inserting a "return-to-zero" (RZ) or other transition between the bits. In NRZ signaling transitions occur only when the data value changes, for example from a binary "0" to a binary "1." Therefore, not having a transition with each bit for a sampling reference, the NRZ signal receiver must locally generate a sampling clock, and can only use data transitions for synchronization. NRZ signaling, however, requires for any given bit rate approximately one-half the bandwidth required by RZ signaling.
Conventional techniques exist for an NRZ receiver to locally generate a sampling clock synchronized in frequency and phase to the data in the NRZ signal. One such technique generates a sampling clock at a frequency equal to the bit rate of the NRZ signal, for example using a phase-lock-loop (PLL) fed by a local reference oscillator. In one such technique the NRZ signal is supplied to the signal input of a sampler that, in turn, is triggered by the locally generated sampling clock. However, since the locally generated sampling clock is at the NRZ signal bit rate, when the latter is increased to a high rate the former must be increased in turn. Generation of high frequency sampling clocks can incur costs in terms of power consumption and in circuit considerations such as signal path transmission line quality, requirements for noise isolation, in addition to reduced fabrication tolerance. Further, NRZ data can be communicated in a burst mode, requiring fast lock time, without benefit of a preamble.
Another conventional technique for recovering NRZ data entails generating a local clock having a frequency that is a fraction, i.e., 1/N (N generally being an integer) of the bit rate and, in combination, generating an N-phase sampling clock based on that 1/N rate clock. The N-phase sampling clock can trigger N samplers receiving the NRZ signal. However, conventional generation of N-phase sampling clocks generally requires a significant number of circuit blocks or cells, including voltage-controlled delay elements, multiplexers, and logic, with associated interconnects. Various ones of the circuit blocks or cells, in particular the voltage controlled delay elements, are connected in cascade, with tap-offs placed at various ones of the interconnects. N of the tap-off are, in turn, the N phases of the sampling clock. In this conventional generation of an N-phase sampling there are differences in configuration among the voltage controlled delay elements, as well in the loading at the outputs of different ones of the elements. However, since the relative delay among the voltage controlled delay elements establishes the different phases of the N-phase sampling clock, such differences in their configuration and output loading can result in non-uniform phase differences between the N clock phases. The non-uniform phase difference can, in turn, result in a timing offset between the ideal sampling instant of the NRZ signal and the actual sampling instant. Compensation circuitry can be included, but this can itself introduce complications in circuit structure. Also, since the compensation circuitry and the voltage controlled delay elements generally have different structure, process variances can produce non-uniform shifts in delay, which can result in the compensation circuitry introducing the very problem it was intended to correct.
The objective is to reduce power consumption further, and one way would be to increase the data rate by sampling four parallel data in a single clock cycle with multiple phases. This has been done before, but required significantly more than four multiplexers.

Apparatus and method for recovering burst-mode pulse width modulation (PWM) and non-return-to-zero (NRZ) data


A method of forming a lithographic mask that comprises the steps of obtaining a first substrate having a first base and a first layer over the first base. The first layer is patterned, as is at least a portion of the entire thickness of the first base to form a first pattern. A second substrate having a second base is obtained and a second layer is formed over the second base. A third layer is formed over the second layer. The third layer is patterned to form an attenuating pattern corresponding to a semiconductor device feature pattern and the first and second substrates are bonded after patterning the first layer. The second base is etched to remove the entire thickness of the second base corresponding to the first pattern. The steps need not be sequential in the above method.

Lithography processes are used to transfer patterns from a mask to a semiconductor device. As feature sizes on semiconductor devices decrease into the submicron range, there is a need for new lithography processes to pattern high-density semiconductor devices. Projection electron-beam lithography is a well-known reduction technique for patterning semiconductor devices. In general, a projection electron-beam lithography system scans a beam across a mask to create an image on the semiconductor device. Electron optics can be inserted to provide a means of image reduction. One particular type of projection electron beam lithography is known as Scattering with Angular Limitation in Projection Electron-Beam Lithography developed by Lucent Technologies, Incorporated of Murray Hill, New Jersey. The basic principles of this technique are illustrated in prior art FIG. 1.
From prior art FIG. 1, a mask 10 having a patterned scattering layer 14 is provided on membrane 12, through which an electron beam is projected as represented by the flux arrows 13. The patterned scattering layer 14 produces more electron scattering than the membrane 12 as a result of the difference in atomic numbers between the composition of the patterned scattering layer 14 and the membrane 12, i.e., the patterned scattering layer 14 has a higher atomic number than that of the membrane 12. The scattering effect 16 of the electron beam through portions of the mask 10 is illustrated in FIG. 1. As shown, those portions of the electron beam that pass through the patterned scattering layer 14 tend to be scattered through larger angles, as depicted by the scattering effect 16, when compared with those less scattered portions 17 that pass between unpatterned portions of the scattering layer 14.
As shown, the electron beam that passes through the mask 10 is focused through an electron focusing system represented by lens 20. The electron beam then passes through back focal plane filter 30 having an aperture 18 that is provided to permit passage of those portions of the electron beam that were not scattered by the patterned scattering layer 14 of the mask 10 through some finite angle. The electron beam is then projected onto a semiconductor wafer 40 having a plurality of die 42 and a resist layer 44 spun on the semiconductor wafer 40 by conventional techniques. The electron beam forms a high contrast image including areas of low intensity formed by those scattered portions 16 of the electron beam that pass through patterned portions of the mask 10, and areas of relatively high intensity formed by those less scattered portions 17 of the electron beam that pass through the unpatterned areas of the mask 10. In this way, a high-resolution image may be projected onto the resist layer 44, which is then developed to form an exposed resist layer. The patterned resist layer 44 may be used as an etch mask for the underlying material. It is noted that the electron optics of the system may be adjusted so as to provide a reduction in image size, typically 4X or one-fourth the image size on the mask 10.
A typical mask fabrication methodology using Scattering With Angular Limitation In Projection Electron-Beam Lithography is shown in prior art FIG. 2. FIG. 2 depicts cross-sectional views of processing steps applied to the same semiconductor wafer to form a mask. The methodology begins at step 50 by providing a silicon wafer 51, the silicon wafer having a silicon wafer top surface 53 and a silicon wafer bottom surface 52. At step 60, the silicon wafer 51 is processed to form a silicon nitride film 61 that is deposited around the silicon wafer 51, on both the top 53 and bottom 52 surfaces, using conventional low pressure chemical vapor deposition (LPCVD). The silicon nitride film 61 is typically called a membrane film, such as membrane 12 of FIG. 1, on which a scattering layer, such as the patterned scattering layer 14 of FIG. 1, will be formed. At step 70, two other films are deposited, using conventional sputtering techniques, to form an etch stop layer 72, such as a chromium layer, and a scatterer film 71, such as a tungsten layer, above the etch stop layer 72. The etch stop layer 72 is used to prevent an etch species, used during the patterning of the scatterer film 71, to "attack" the silicon nitride film 61. In step 80, a sacrificial layer 81, typically a chromium layer, is deposited on the scatterer film 71 to protect the layers between the sacrificial layer 81 and the silicon wafer top surface 53 from defects and film scratches when the silicon wafer bottom surface 52 is processed.
At step 90, the silicon wafer 51 has been "flipped" so that the silicon wafer bottom surface 52 may be processed and a resist layer 91 has been spun onto the silicon nitride film 61 on the silicon wafer bottom surface 52. Then at step 100, the resist layer 91 has been patterned, such as with an aligner, stepper or electron beam tool, and then developed. At step 110, the silicon nitride layer 61 has been etched down to the silicon wafer bottom surface 52. At step 120, the resist layer 91 has been removed and the silicon wafer 51 has been etched down to the silicon nitride film 61 on the silicon wafer top surface 53. it should be noted that since the silicon wafer 51 has been etched through in step 120, the silicon nitride film 61 on the silicon wafer top surface 53 now becomes a plurality of free standing membranes, and, as such, the remaining process steps occur on membranes only. Next, at step 125, the wafer, which contains a plurality of membranes, has been "flipped" to process the layers on the silicon wafer top surface 53 and the sacrificial layer 81 has been removed leaving the scatterer film 71 forming a "blank mask". At step 140, a second resist layer 141 has been spun on the scatterer film 71 in order to form a pattern on the scatterer film 71. At step 150, the resist is patterned and developed. Then, at step 160, the second resist layer 141 is used as a mask to define the scatterer film 71 and the resist 141 is removed. Thus, at step 160, the mask is completed. Prior art FIG. 2A is an exploded view of the mask at step 160 depicting the patterned scatterer film 71 positioned between "struts" (i.e. patterned silicon nitride film 61 on silicon wafer bottom surface 52 and silicon wafer 51).
Certain problems exist with the mask fabrication methodology shown in prior art FIG. 2. First, this methodology has a long turn around time (TAT). This is due to several factors. One factor is that processing must sequentially be carried out first on one side of the wafer and then on the other side. It is not possible to simultaneously do both. Another factor that produces a long TAT is that additional steps are required using this methodology due to the deposition and removal of protective layers such as in steps 80 and 125 of FIG. 2 that apply and remove the sacrificial layer 81. The additional steps contribute to a long TAT, in addition to higher defects due to additional handling of the silicon wafer and thereby causing a lower yield.
A further problem with the methodology of FIG. 2 is that the mask being formed in FIG. 2 is easily damaged which may reduce the wafer yield. This is because, at steps 140, 150 and 160, all processes must be carried out on very thin (approximately 1,000 .ANG.) membranes, which is very difficult to do and which could easily lead to a broken membrane. Additionally, since the silicon wafer is being processed on both sides, that is the silicon wafer top surface 53 and the back surface 52, care must be taken in handling the wafer so that neither surface is damaged. This results in the use of manual tweezers or an equivalent peripheral device that does not adhere to either side of the silicon wafer that is being processed. As such, the handling of a device undergoing the methodology of FIG. 2 is difficult which may produce a long TAT or low yield. Also, all the problems listed above become even more difficult as the wafer sizes increase and therefore additional membranes may be damaged. A need therefore exists for a mask fabrication methodology that avoids the problems listed above.


A static safety analysis for control-flow linearization receives a control flow graph (CFG) and an intermediate representation of a computer program, and identifies, for a given loop, all memory load instructions belonging to one side of a diamond-shape structure in the CFG. For each representation of an address of each memory load instruction identified, determining whether it is used on all other sides of the diamond-shape structure. Responsive to determining each representation of an address of each memory load instruction on the one side of the diamond-shape structure is used on all other sides of the diamond-shape structure, determining whether an immediate predecessor of a top of the diamond-shape structure for the given loop post-dominates a header of the given loop. Responsive to determining the immediate predecessor of the top of the diamond-shape structure for the given loop post-dominates the header of the given loop, affirming safety of linearization.

The present invention relates to control flow usage in computer programs, and more specifically, to control-flow linearization of computer programs in a data processing system. Control-flow dependencies introduced by branches and switches within a computer program are major inhibitors to compiler optimizations, such as vectorization. Control-flow linearization is a classic technique for eliminating conditional branches that combines multiple paths of control flow of a respective computer program into a single path of conditional instructions. By converting conditional code into predicated execution, control-flow linearization exposes further optimization opportunities, including loop vectorization.

Static safety analysis for control-flow linearization

International Business Machines Corporation


The present invention is provided with sensor body (2) having a long plate shape, measurement part (3) provided in a front end section of sensor body (2), and connection terminal (4) provided in a rear end section of sensor body (2). Close contact prevention parts (10) having the same plate shape are provided in the same position of both a front surface and a back surface of sensor body (2), the position not overlapping with a position of a center of gravity of sensor body (2), measurement part (3), and connection terminal (4). A length in a longitudinal direction of sensor body (2) of close contact prevention parts (10) is shorter than a length thereof orthogonal to the longitudinal direction.

A configuration of a conventional organism sample measurement sensor, such as a blood sugar level sensor, is as follows.
That is, as shown in FIG. 15, conventional blood sugar level sensor 101 includes sensor body 102 having a long plate shape, measurement part 103 provided in a front end section of the sensor body, connection terminal 104 provided in a rear end section of the sensor body, and a connection part (not shown) connecting measurement part 103 and connection terminal 104. A plurality of blood sugar level sensors 101 are housed in a housing container having a bottomed cylindrical shape (for instance, see Patent Literature 1).
However, the conventional organism sample measurement sensor and the housing container that houses the same have very low convenience.
That is, blood sugar level sensor 101 as the conventional organism sample measurement sensor has sensor body 102 having a long plate shape, and as described above, a plurality of blood sugar level sensors 101 are housed in the housing container having a bottomed cylindrical shape (not shown) to be overlapped and in close contact with each other. It is difficult to draw blood sugar level sensors 101 that are overlapped and in close contact with each other out of the housing container one by one. Sometimes, a plurality of blood sugar level sensors 101 can be taken out to drop one or more of them.
Consequently, a user needs to slowly and carefully draw one blood sugar level sensor 101 out of the housing container. As a result, blood sugar level sensor 101 as the organism sample measurement sensor cannot be easily taken out of the housing container.
Accordingly, an object of the present invention is to easily take an organism sample measurement sensor out of a housing container.

Organism sample measurement sensor and housing container that houses same


A liquid container with a spout is disclosed. A composite sheet for the container body comprises an innermost layer of a low-smelly and low-adsorbent resin and an outermost layer of a polyolefine resin. A sealing film comprising a liquid-contacting layer and a sealing layer both made of the low-smelly and low-adsorbent resin seals a spouting hole in the container body from inside the container body. The container body and the spout sandwich a connecting film and a spout-attached film. The connecting film has a hole in alignment with and adjoining the hole in the container body. The connecting film comprises an innermost layer of a polyolefine resin and an outermost layer of the same resin as the innermost resin of the container body. The connecting film is heatsealed to the outermost layer of the container body. The spout-attached film has a hole in alignment with and adjoining the hole in the container body. The hole in the spout-attached film has a smaller diameter than the hole in the container body. The spout-attached film comprises an outermost layer of a polyolefine resin and an innermost layer of the same resin as the innermost layer of the container body. The spout-attached film is heatsealed to an area between the connecting film and the sealing film so that the edge of the rear hole in the spout-attached film is positioned on a portion of the outermost layer of the sealing film adjoining the hole in the container body.

1. Field of the Invention
The present invention relates to an improvement in a liquid container made of a composite sheet and having a spout attached to the exterior surface of the container body.
2. Background Art
As well known, liquid containers made of a composite sheet comprising a paper layer as the core and resin films laminated on the front and back surfaces of the paper layer are widely used as containers filled with juice, milk, mineral water, alcoholic drink and the like. Spouts of the liquid containers are classified into an exterior type of which a spout is attached to an exterior surface of a liquid container and an interior type of which a spout is inserted from inside a liquid container into a hole in the composite sheet and attached to an interior surface of the liquid container. The exterior type is superior in productivity and on the other hand the interior type is superior in appearance.
There is well known as the exterior type liquid container with a spout a liquid container of Japanese examined utility model application publication SHO.58-37828. In the structure of this liquid container, a sealing film b, as shown in FIG. 2, seals from inside the container body a a circular hole H serving as a spout-attached portion of the container body a. This liquid container involves a problem that since an opening of the sealing film b by means of an opening blade d of a plug c, causes the edge surface of the paper core of the composite sheet defining the hole H in the container body a to contact a liquid content in the liquid container to be swollen the liquid container is degraded in strength and/or deformed.
FIG. 3 shows a liquid container with a spout of Japanese examined utility model application publication SHO.63-18582 for overcoming this problem. In the structure of this liquid container, an annular spout-attached film e having a smaller diameter than the hole H in the container body a is sandwiched between the container body a and the spout c to ensure the attachment of the spout c to the container body a. The spout-attached film e also is bonded to the outer surface of the sealing film b to prevent the edge surface of the paper core of the composite sheet defining the hole H in the container body a from a contact with a liquid content in the liquid container.
These liquid containers are made of a composite sheet the opposite surfaces of which are covered with a polyolefine resin of high heatsealability, for example, polyethylene resin (referred to as PE resin hereinafter). Since PE resin tends to adsorb an aromatic component of an orange juice or the like and oxidation and decomposition of PE resin create a peculiar smell, the odor and the flavor of liquid content tend to be unbalanced.
There are known as resins adsorbing a small quantity of an aromatic component and creating a small quantity of smell polyester resin and ethylene-vinyl alcohol copolymer resin. Since these low-smelly and low-adsorbent resins have a poor heatsealability to polyolefine resin, it is difficult that the prior art sealing film b seals the hole H in the container body a from inside the container body a when the innermost layer of the container body a constituting a liquid-contacting layer is made of one of the low-smelly and low-adsorbent resins.
To overcome this problem, the present applicants proposed a liquid container with a spout in Japanese utility model application HEI.3-6431. FIG. 4 shows this liquid container with the spout. In the structure of this liquid container, the container body a is made of a composite sheet, the composite sheet comprising the core f, an outermost layer g of PE resin on the core f and an innermost layer h of polyester resin (i.e. a low-smelly and low-adsorbent resin) on the core f. A sealing film b is bonded to a portion of the innermost layer h of the container body a surrounding the hole H so that the composite sheet of the container body a and the sealing film b sandwich a connecting film i having a hole with a diameter equal to or slightly larger than that of the hole H. An annular spout-attached film e having a circular hole with a diameter than the hole H is bonded to a part of the outermost layer g surrounding the hole H, to the edge surfaces of the hole H and the hole in the connecting film i, and to a part of the outermost layer of the sealing film b. A spout c is attached to the spout-attached film e.
The connecting film i comprises the core, an outermost layer 1 of polyester resin adjoining the inner-most layer h of the container body a and an innermost layer k of PE resin adjoining the sealing film b. The outermost layer j of the connecting film is heatsealed to the innermost layer h of the container body a with both the outermost layer 1 and the innermost layer h made of polyester resin.
The sealing film b comprises the core, an outermost layer 1 of PE resin adjoining the connecting film i and an innermost layer m of polyester resin. The outermost layer 1 of the sealing film b is heatsealed to the innermost layer k of the connecting film i.
The spout-attached film e comprises the core, an outermost layer n of PE resin (the same resin as the spout c) adjoining the spout c and an innermost layer o of PE resin adjoining the container body a. The spout-attached film e, as described above, extends from the part of the container body a surrounding the hole H to the sealing film b and is heatsealed to the spout c, the container body a, the connecting film i and the sealing film b.
In the structure in which the spout-attached film is attached to the exterior surface of the container body and the connecting film and the sealing film are arranged on the interior surface side of the container body, there may be problems in that since portions of the sealing film and the connecting film frequently contacting a liquid content must be made of a polyolefine resin (e.g. PE resin) these portions tend to adsorb an aromatic component and the smell of the polyolefine resin tends to transfer to the liquid content.
In addition, since the natures of the innermost and outermost layers of the sealing film are different, the sealing film tends to wrinkle during heatsealing of the sealing film and the connecting film. The spout-attached film thus is insufficiently heatsealed to the sealing film which has wrinkled. The heatsealed Joint between the two films tends to cause a pinhole. Therefore, there may be a problem that the liquid content possibly infiltrates the container body after the liquid content is spouted through an opened sealing film and therefore the hole in the container body.


The invention relates to a packaging machine for inserting articles which are prepackaged in bags, into folding boxes in an insertion area. The bags can be inserted via an opening cross-section of the box which is able to be at least partially covered by an essentially flat top flap. A device having a receiving area for a top flap of a box is provided in the insertion area. The top flap is, in the insertion area, positioned in the receiving area and is kept in a convex shape so that, at least during the insertion of the bag and of the box when the top flap is convexly shaped, the opening cross-section of the box is larger than when the top flap is flat.

1. Field of the Invention
The invention relates to an improved packaging machine for inserting product to be packaged into packaging means, in particular for inserting a product packed in bags into preferably folding boxes.
The invention relates to a packaging machine for inserting product to be packaged into packaging means, in particular for inserting a product packed in bags into preferably folding boxes, as generically defined in further detail by the preamble to claim 1.
2. Description of the Prior Art
Fundamentally, a package or packaging means represents a separable wrapping of goods or a product to be packaged that makes it possible for the goods or product to be packaged, closed, and prepared for shipment. Moreover, packaging means are intended to simplify the production process in such a way that no further transfer operations occur. In addition, packaging means should also be usable as advertising media and should protect the product to be packaged against pressure, impact, moisture, and temperature; it should make storage easier; it should optimize portability and the use of space; it should make handling easier during sale; and it should assure that the package is suitably identified as to fragility, perishability, or danger, or for the sake of simpler or even automatable completion of orders.
For packaging product to be packaged, packaging machines or machines and systems are used for partially or fully automatic production of a package, for packing or dispensing certain quantities of a product, and for decoration and labeling of the package. Numerous versions of packaging machines exist; each type of machine is customized to the processing of certain packaging materials and to the use of special technologies. Depending on the material to be packaged, distinctions are made among machines for liquids, for pastelike, doughy and viscous compositions, for bulk goods, for individual parts, for solid parts, for parcels, or the like. Given the sometimes extensive work operations in the packaging system, machines suitable for the various operations are lined up in succession.
The first work step includes the fabrication and preparation of the package for receiving the goods. Bags, cups, small tubes, or the like are created from strips of paper, metal or plastic film by means of adhesive bonding, welding, and shaping. Ampules are sterilized; folding boxes are stamped out and prepared. Next, the material to be filled, or product to be packaged, is metered and introduced into the intended package. Metering in terms of the volume, mass, or number of parts is done by means of controlled valves, metering screws, weighing devices, and apportioning devices. Next, the package is closed, to suit the material filling it and the packaging material; this can be done by folding, glueing, welding, and the insertion or application of a closure in a natural atmosphere, in a vacuum, or in an inert gas environment.
A second packaging operation often follows, during which the packed goods are wrapped for instance with instructions for use and a folding box.
Particularly during the second packaging operation, the possibility exists that the product to be packaged to be introduced into the packaging means will have a larger cross section than the opening cross section of the packaging means. Especially with products such as bottles or tubes, as well as bags, that have nonhomogeneous surfaces, the height of the product to be packaged is greater than that of the packaging means, which puts undesirable restrictions on a packaging operation.
To reduce or eliminate the limitation of the packaging operation, in the industry a change has been made so that packaging means embodied as folding boxes are opened wider on a top side by means of one or more vacuum devices, so that the opening cross section of a folding box can be enlarged in a manner that improves the packaging operation.
In packaging machines that operate intermittently, opening a folding box more widely by means of vacuum devices is done while a conveyor device for furnishing packaging means is at a standstill in the area of an insertion zone, where the product to be packaged is introduced into the packaging means.
However, it is disadvantageous that the operation of widening a folding box is done before the product to be packaged is actually inserted into the opened folding box, and once the product to be packaged has been inserted, the vacuum device or devices must be detached from the folding box before the filled folding box call be transported onward in the packaging machine. This undesirably lengthens the dwell time of the folding box in the insertion zone of the packaging machine, thus lessening the throughput of the packaging machine.
If worsening of the throughput of a packaging machine is to be avoided, then a shorter packaging time is available for the insertion operation. Since during the packaging the insertion operation itself is a very time-dependent, sensitive operation, problems that are exacerbated by speeded-up procedures easily occur during this phase, and hence shortening the cycle time of the insertion operation makes the packaging machine more vulnerable to problems.
A prerequisite of widening a folding box by means of a vacuum device is a nonpositive engagement between the vacuum device and the folding box; the nonpositive engagement is affected by various factors, such as the cardboard quality, pressure drop, wear of the suction device, or dirt. However, these factors disadvantageously mean that the operation of widening a folding box cannot be performed with the same quality throughout a packaging process.
In addition, the position of a top flap of a folding box is indefinite, and if the positioning is unfavorable, it can impair both the process of inserting the product to be packaged into the folding box and the operation of widening the folding box itself. If widening and cross-sectional enlargement of a folding box by means of vacuum devices is to be feasible at all, the top flap must be located in a position that is parallel to the top side of the folding box. This is due to the fact that in positions in which the top flap, in the area of a creased edge, is pivoted relative to the surface of the folding box in such a way that the top flap and the surface of the folding box form an angle smaller than 180°, the top flap stabilizes the creased edge and hinders the desired enlargement of the opening cross section of the folding box by means of vacuum devices.
In order nevertheless to be able to perform widening of a folding box even at disadvantageous positions of the top flap, the widening operation is performed during the operation of inserting product to be packaged into the folding box; an insertion device that is located above the product to be packaged is introduced, during the insertion operation, into the folding box before the product to be packaged in order to widen the opening cross section of the folding box.
However, it is then disadvantageous that the insertion device must be in the lead, ahead of the actual insertion of the product to be packaged, and must be moved out of the folding box before the product to be packaged is inserted; this kind of procedure is therefore characterized by being highly dynamic and must be performed with extreme precision, if damage to the packaging means or to the product to be packaged is to be avoided.
Both widening by means of a vacuum and widening a folding box by lifting one side of the box from its underside have the disadvantage that during an insertion operation, a top flap is not necessarily located in a verifiable position relative to the associated surface of the folding box, so that upon disadvantageous stabilization of the creased edge during the operation of widening the folding box, impermissibly strong deformation forces may have to be exerted under some circumstances, and these can cause damage to the folding box.
The present invention therefore has the object of making a packaging machine available by means of which the aforementioned disadvantages are avoided in a simple and economical way.

Packaging machine for inserting an article to be packaged into a package


A reconstitutable surfactant-based powder has good solubility in water and forms a stable gel when dispersed in water. The reconstitutable surfactant-based powder consists of a polymer/gum system and a dry powder extract.

Personal care or toiletries are consumer products used in personal hygiene and for beautification. Traditionally, most of these products are sold as liquid products. The major disadvantages with respect to liquid products are in terms of storage, packaging, the degree of preservation required, and convenience of use. Further, since liquid are mainly water based there is a chance of leakage arising out of improper handling during transportation or sudden bumping of the vehicle while trading a particularly uneven road. Further, Liquid cleansing products typically are sold in bottles. The cost of the bottle frequently contributes significantly to the overall cost of the product.
With a view of overcoming these drawbacks posed by liquid detergents, inventors have come up with a solution which constitutes usage of powder. However, usage of powder has its own set of disadvantages which may encompass soap residues left behind on your clothes, after washing. This leads to a need of follow-up wash (es).
Therefore, an ideal solution would be to devise a product which combines advantages of both powder and liquid, while simultaneously minimising the individual disadvantages posed by the powder and liquid products.
One solution for above problems is provided by EP1574203 (EP '203). Accordingly, the product as disclosed in EP '203 is a rehydratable personal care product which is converted to liquid as and when required. Since, the end-user product is a liquid product, the disadvantage of liquid as enumerated hereinbefore are not completely eliminated.
Therefore, the best solution would be to overcome all the disadvantages as listed above would be to devise a product which does not form a liquid after reconstitution. This could be achieved by forming a gel as an end-use product.
Hence, the current inventors have invented a novel product which is a solid while transportation and can be converted to a more usable gel formulation.


A table extender for a milling machine which includes upper and lower work support members with the lower work support mounted on the table or bed of a milling machine and a pair of shot pins moveably mounted in the lower work support and engageable in openings in the upper work support. The upper work support is moveable on slides relative to the lower work support and a locking handle is provided so as to lock and unlock the shot pins to allow the upper and lower work supports to be moved relative to each other.

1. Field of the Invention
This invention relates in general to a table extender for a milling machine.
2. Description of Related Art
In milling machines, it is necessary to attach a workpiece to a table or bed which positions and holds the workpiece so that a machine tool can be used to form the workpiece. Often times it is necessary to do milling or cutting over a substantial distance on the workpiece and it has previously been necessary under such conditions to unclamp the workpiece from the workpiece support and move it and reposition it.


A monolithic, environmentally stable Mach-Zehnder device is formed by threading first and second dissimilar optical fibers through the bore of a glass tube. The tube is evacuated and heated to collapse it onto the fibers. The tube is further heated and stretched at two spaced locations to form two couplers that are joined by the two optical fibers. The fibers have different propagation constants in the region between the two couplers, whereby there is a relative delay in the optical signal propagating in one of the fibers with respect to the optical signal propagating in the other fiber.

The present invention relates to environmentally stable Mach-Zehnder devices and to methods of making such devices.
There is an emerging need for narrowband wavelength division multiplex (WDM) couplers and filters. Such devices are needed in the 1550 nm window for modifying the gain spectrum of erbium fiber amplifiers. They will also be widely used in trunk lines as well as in fiber-to-the-subscriber architectures.
There is a need for both wavelength tunable components and fixed wavelength components. In an all optical network, for example, the device can be tuned at the receiver end in order to detect the desired incoming signal. In a second approach, tunable lasers are used to send a plurality of signals, and the desired signal is detected by employing a receiver having a fixed filter. The transmission system could also employ both fixed lasers and filters. The wavelength separation capabilities of such filters needs to be on the order of tens of nanometers to as small as a nanometer. Moreover, these components will need to be environmentally stable and very reliable.
The Mach-Zehnder filter is known for its narrowband wavelength capabilities. It has been proposed that filters having pass bands as narrow as 1 nm be formed by connecting two evanescent couplers with unequal fiber lengths between them. See OFC Conference on Optical Fiber Communication, Minitutorial Sessions, Jan. 22-26, 1990, page 256 (part of a presentation on "Dense WDM Techniques" by C. A. Brackett). It is difficult to achieve reproducibility and environmental stability with this approach, since the connecting fibers are subject to external destabilizing conditions such as temperature changes and random bending forces.

Environmentally stable monolithic Mach-Zehnder device


An implantable pressure-activated microvalve is disclosed. The valve includes a chamber that can be coupled to an external reservoir. A deflectable diaphragm is fluidically coupled to the chamber and arranged such that pressure of an in vivo fluid will bear against the deflectable diaphragm. When the pressure exceeds a selected threshold, the diaphragm deflects and allows material within the chamber to mix with the in vivo fluid.

This application claims the priority of an earlier filed co-pending provisional Patent Application Serial No. 60/370,819, filed Apr. 8, 2002 entitled IMPLANTABLE PRESSURE-ACTIVATED MICROVALVE.
Current medical treatments are aided by a vast array of methods and devices for delivering substances, such as medicines, to a patient. One example of such systems is the implantable drug delivery system. However, generally, most implantable drug delivery systems are relatively complex and costly. Usually the cost of such systems is tolerated because implantable drug delivery is of such importance and/or convenience. However, a device and method that could provide at least some of the benefits of implantable drug delivery with significantly reduced costs would benefit patients.


An electrical connector may include a connector housing and a terminal tray. The terminal tray may include a tray body having a latch extending therefrom. The connector housing may define a latch receiving window. The latch and latch receiving window may be disposed such that the latch engages the latch receiving window only when the terminal tray is received in the housing in a preferred orientation. The terminal tray may include an electrically conductive contact having a board receiving end adapted to receive a printed circuit board and to exert sufficient pressure on the printed circuit board to retain the printed circuit board between the contact and the tray body. The connector may also include a plurality of cables bundled by a band, such as double-sided tape, such that respective portions of the cables are restrained from movement relative to one another.

Input/output (I/O) cable connectors may be used for electrically connecting a computer with an external component, such as a printer, scanner, or the like.
Some such connectors include one or more terminal trays that include respective linear arrays of electrical contacts. The electrical contacts may be signal contacts, ground contacts, or a combination of signal and ground contacts. Typically, a plurality of such terminal trays are arranged relative to one another such that a two-dimensional contact array is formed. In such an arrangement, it may be desirable to orient certain of the terminal trays in certain ways. Failure to orient one or more trays in the desired way may result in the manufacture of a faulty connector. It would be desirable, therefore, if terminal trays were available that minimized or eliminated the possibility of assembling the connector with a terminal tray in an undesired orientation.
Some such connectors include a printed circuit board (PCB), such as an equalizer card, for example. Typically, each electrical contact is soldered to a corresponding contact pad on the PCB. Such soldering may be labor intensive and expensive. It would be desirable, therefore, if connectors were available wherein the PCB could be retained within the connector without the need for soldering the PCB to the contacts.
Some such connectors include interfaces to one or more cables. Such cables typically include an electrical conductor encapsulated in a polymer coating. It is often desirable to bundle a plurality of such cables together, and to bundle them together in a manner that limits stress on the cables.

High speed, high signal integrity electrical connectors


The present invention provides a method for detecting a mutation in a nucleic acid molecule which comprises contacting the nucleic acid molecule with a probe. The probe comprises two covalently linked nucleic acid segments under conditions such that the unlinked end of each segment of the probe is capable of hybridizing with the nucleic acid molecule. This mixture is then contacted with a ligase under conditions such that the two hybridized probe segments will ligate and bind the nucleic acid molecule if the nucleic acid molecule contains the mutation. One would then determine the presence of bound nucleic acid molecule(s) and thereby detect the mutation in the nucleic acid molecule.

Throughout this application, various publications are referenced by author and date. Full citations for these publications may be found listed alphabetically at the end of the specification immediately preceding the claims. The disclosures of these publications in their entireties are hereby incorporated by reference into this application in order to more fully describe the state of the art as known to those skilled therein as of the date of the invention described and claimed herein.
There is a need to improve methods to detect mutations in DNA rapidly and efficiently. The main impetus behind this need is the realization that many heritable diseases in identified genes are associated with numerous different mutations (often point mutations). For example, the genes associated with hemoglobinopathies (.alpha.- and .beta.-globin genes) and with cystic fibrosis (a chloride transmembrane regulator gene) have now been associated with literally hundreds of documented point mutations. While in some cases such patients harbor a single, "common," mutation that is present at high frequency in the population, many patients carry the rarer mutations, which are more difficult to identify.
Previously, a typical screen for a pathogenic point mutation involves one of three approaches: (1) Single-stranded conformation polymorphism (SSCP) analysis is used to identify a gene region containing a potential polymorphic site, followed by polymerase chain reaction (PCR) and sequence analysis to identify and/or confirm the mutation.
(2) If one wants to investigate a specific mutation, the gene region can be amplified by PCR directly (without prior SSCP analysis), and the PCR product is either sequenced or subjected to restriction fragment length polymorphism (RFLP) analysis to confirm the presence of the mutation. A diagnostic method for a specific target nucleotide involving digestion of double-stranded sample nucleic acid in solution with a restriction enzyme, followed by detection of specifically sized fragments on filter paper, is discussed in U.S. Pat. No. 4,766,062 to Diamond et al. The presence of the single base substitution causative of sickle cell anemia abolishes a specific site for restriction enzyme cleavage, and thereafter two specifically sized small fragments which are usually detected are then detected in reduced amounts (for sickle cell trait) or cease to be detected (for sickle cell anemia).
(3) One can replace the RFLP analysis with the "ligase chain reaction" (LCR), in which the PCR is performed following sequence-specific ligation of two primers to each other, one of which is perfectly complementary only to the sequence containing the mutation (usually at the last 3'! nucleotide of the primer).
In all three cases, PCR is the usual starting point of the analysis, followed by analyses on gels. This work is time consuming and relatively expensive. For example, in order to assay for the presence of 100 point mutations in a given sample, one must perform 100 PCR reactions and 100 restriction digestions, followed by gel analyses. A more desirable way of assaying for the 100 mutations would be to analyze them all at once, perhaps using a "dipstick" type of test. The elimination of the LCR/PCR amplification step would also be desirable. In addition, chain reactions, e.g. LCR/PCR may present cross contamination problems.

Method to detect mutations in a nucleic acid using a hybridization-ligation procedure

The Trustees of Columbia University in the city of New York


The servo field includes at least one sub-field of prerecorded information that simultaneously provides (i) data for a first servo function and (ii) data for at least one other servo function. In another embodiment, a prerecorded embedded servo field includes a first sub-field of prerecorded information that simultaneously provides (i) automatic gain control data for a third sub-field and (ii) data for a first servo function, and a second sub-field of prerecorded information that simultaneously provides (i) automatic gain control (AGC) data for the third sub-field and (ii) data for a second servo function. Since the first and the second sub-fields in the servo field of this invention are used for AGC and another servo function, the sub-fields are arranged within the servo field so that the sub-field that requires the least precise AGC control is first and the sub-field that requires the most precise AGC control is last. To provide AGC data for the first sub-field in the servo field of this invention, AGC data is contained in a write-to-read transition area of the data region preceding the first servo sub-field. The sector mark field of this invention is immune to single bit errors. Specifically, the sub-field used for synchronization is designed so that servo synchronization timing is not lost due to a single bit error in the synchronization sub-field or in the sub-fields preceding the synchronization sub-field.

1. Field of the Invention
This invention relates generally to reading and writing data on a magnetic storage medium and in particular to reading and writing data at a predetermined location on a magnetic storage medium by using servo information embedded within the data.
2. Prior Art
Typically, a disk drive contains one or more circular planar disks that are coated on each side with a magnetic medium. The disk or disks are mounted on a spindle that extends through the center of each disk so that the disks may be rotated at a predetermined speed, usually about 3600 rpm. Usually, one read/write head is associated with each side of the disk that is coated with a magnetic medium. The read/write head flies a small distance above the disk surface as the disk rotates. The read/write head, in response to signals from electronics associated with the disk drive, writes data at a predetermined location in the magnetic medium. Similarly, the read/write head, in response to other signals from the disk drive electronics, reads the data stored at a predetermined location.
The configuration of the data on the magnetic surface is instrumental in the operation of the disk drive. Data are recorded by the read/write head in concentric circular tracks on the disk. Corresponding tracks on different disk surfaces are cylindrically aligned.
Typically, each track is segmented into one or more parts that are referred to as sectors. Thus, the disk drive must move the read/write head radially across the disk surface to locate the track for reading or writing data and then must follow that track circumferentially until the desired sector passes under the read/write head. Hence, the read/write head is positioned at a predetermined radial and circumferential position over the disk surface.
In a disk drive, each read/write head is usually affixed by an arm to an actuator and the actuator is moved so that the read/write head is moved radially to a specified track. This operation is referred to as a track seek, or sometimes just a seek. In an open-loop disk drive, a stepper motor is used to move the actuator while in a closed-loop disk drive a servo system is used to move the actuator.
Many different servo systems have been developed for use in hard disk drives. In a servo system, the read/write head reads a servo pattern contained in a servo field to determine the radial and circumferential position of the read/write head relative to the disk. The information that is read is provided to the disk drive control loop electronics which in turn repositions the read/write head as necessary based on that information. Good servo control is essential for reliable storage and retrieval of data on rotating memory storage devices such as hard disk drives.
The servo pattern within the servo field is the key to good servo control. The servo pattern must provide the control loop electronics with an accurate read/write head position, both radially and circumferentially relative to the disk. Typically, for radial positioning, two sub-fields, i.e., a cylinder address sub-field and a position sub-field, within the servo field have been used. Usually, these sub-fields are positioned adjacent to one another in the servo field.
The cylinder address sub-field contains a Gray code pattern that (i) identifies the track containing the servo field and (ii) is a coarse radial position indicator. The Gray code track number pattern is a set of magnetic dibits that contain the track address. As is known to those skilled in the art, the track addresses are addresses that are encoded using a Gray code sequence so that any decoding uncertainty is limited to plus or minus one half track. With the Gray code, only one bit in the track address changes from track to track.
The position sub-field is usually adjacent to the cylinder address sub-field and consists of a magnetic pattern that generates a series of pulses. The disk drive electronics detects the peak of each of the series of pulses. When the read/write head is radially centered over the track, the peak amplitude of pulses adjacent to and on both sides of the center of the track are equal. The difference between the peak amplitude of adjacent pulses corresponds directly to the amount the read/write head is off from the center of the track. Hence, the position sub-field is a fine radial position locator for the radial positioning of the read/write head.
The circumferential positioning information in the servo field is also broken into course and fine position information. Typically, an index sub-field, that consists of one or more bits, is used as a course locator of a point along the circumference of a track. The index bits usually are used to identify only one sector on a track that may contain for example 72 sectors.
A more precise indicator of circumferential position if provided by the sector mark sub-field within the servo field, which is used to precisely identify the location of each sector in a track. A sector mark bit in the sector mark sub-field is used to generate a signal at a precise location. To locate a particular circumferential position, the number of sector mark signals that occur after an index signal are counted. Since the sector mark signal is a precise circumferential positioning mark, it is used by the disk drive spin control hardware as a tachometer signal to control the speed of the disk relative to the read/write head.
One type of servo system is an embedded servo system where a servo field identifying the circumferential and radial data location is placed in front of each data sector in a track. One example of an embedded servo pattern is given in U.S. Pat. No. 4,823,212 issued to Knowles et al. on Apr. 18, 1989 where each track is divided into an equal number of sectors. Each sector includes a section of servo code, referred to as a servo field 100, at the beginning of the sector. Servo field 100 demonstrates each of the general features discussed above.
Each servo field 100 is the same length and includes, starting at its leading edge, a write splice sub-field 101, an automatic gain control (AGC) sub-field 102, a sector mark sub-field 103, an index sector identifier 104, a defect bit 105, a Gray code track number sub-field 106, and a track position sub-field 107 followed by another write splice sub-field. Servo field 100 is preceded and followed by data regions 110 and 111, respectively. As explained more completely below, AGC sub-field 102 is actually divided into two parts. The first part is a write-to-read transition zone and the second part provides the actual AGC data.
FIG. 1B is a flat view of the magnetic dibits in one servo field in tracks 3 to 6 of the disk. The other servo fields and data fields have the same general structure as illustrated by the block diagram of FIG. 1A. FIG. 1C is the signal pattern generated when the information in track 3 is read.
Write splice sub-fields are used to compensate for disk rotational speed variations so that servo field 100 is not overwritten by data. The AGC portion of automatic gain control sub-field 102 is used to normalize the signals from the read/write head so that subsequent servo information is properly detected and processed. Sector mark sub-field 103 was described above. Index sector sub-field 104 was also described above. Defect bit 105 is used to indicate that the data region associated with servo field 100 is defective. Finally, track position sub-field 107 is used to generate signals that are used for track following, as described above. The relative position of the various sub-fields within servo field 100 are typical for an embedded servo system.
Several different approaches have been used in the track position sub-field of the servo field to encode information that results in accurate track following. For examples of track positioning techniques, see U.S. Pat. No. 4,823,212 issued to Knowles et al. on Apr. 18, 1989; U.S. Pat. No. 4,530,019 issued to Penniman on Jul. 16, 1985; U.S. Pat. No. 4,424,543 issued to Lewis et al. on Jan. 3, 1984; and U.S. Pat. No. 4,669,004 issued to Moon et al. on May 26, 1987, which are incorporated herein by reference in their entirety.
To obtain the position information contained in a servo field 100, the disk drive read channel must be prepared so that the information in servo field 100 is accurately detected and read. Not only must the disk drive read channel be prepared, but also the pattern read must be synchronized with the disk drive detection hardware so that the information in servo field 100 can be read and stored.
There are two factors in preparing the read channel. First, adequate time is required for the automatic gain control circuitry to adjust for gain differences between the gain in the prior operation and the gain in servo field 100. Second, if servo field 100 follows a write operation, a write-to-read settling time is required for the disk drive electronics to shift the mode of operation.
Another important factor in AGC control is the amount of AGC data in the servo field. For example, AGC field 102 includes 63 bits of AGC data where a bit is defined as the minimum period of time between adjacent peaks of opposite polarity in the signal trace (FIG. 1C). However, only thirty-six of these bits are actually used for AGC control. (See FIG. 6B of U.S. Pat. No. 4,823,212 of Knowles and Kier issued on Apr. 18, 1989.) The other twenty-seven bits are used for write-to-read settling and are not used for AGC.
In low power computers, the power to the disk drive read channel is frequently turned off over the data region of each sector when the disk drive is idle. When the read channel is turned off, the AGC level is lost. Typically, thirty-six bits of AGC data are insufficient to reestablish an accurate AGC level. Thus, while servo pattern 100 is adequate for larger disk drives that have other than a battery power supply, the pattern will not provide reliable AGC levels for battery powered disk drives that power down the read channel.
The embedded servco patterns are written on the same disk real estate that is used for data storage. Consequently, increasing the AGC field to permit reduced power operation limits the amount of data that can be stored on the disk. While this problem is widely recognized, the accuracy required for radial and circumferential positioning has required that such overhead be absorbed.

Embedded servo system for low power disk drives


In order to make available a crosslinking agent for ethylene acrylate (AEM) and polyacrylate (ACM) elastomers, which is equivalent to the crosslinking agents containing guanidine that have been used until now, but which does without the teratogenically acting guanidines which are toxologically hazardous, it is proposed that the crosslinking agent for diaminically crosslinkable AEM and ACM elastomers comprise a diamine crosslinker, an accelerator selected from 1,8-diazabicyclo-5,4,0-undec-7-ene (DBU), derivatives and salts thereof, and a moderator of the pyrrolidone type.

The invention relates to a crosslinking agent for diaminically crosslinkable ethylene acrylate and polyacrylate elastomers. Ethylene acrylate elastomers are referred to hereinbelow as AEM elastomers and polyacrylate elastomers as ACM elastomers.
AEM and ACM elastomers are relatively inexpensive elastomeric materials which are usable in a large number of applications, in particular, also in the area of seals. The two elastomers may also be used in mixtures with one another as an elastomeric material.
Those AEM and ACM elastomers which are accessible to diaminic crosslinking comprise so-called cure site monomer units whose content in the elastomer is normally approximately 1 to approximately 5 phr.
The possibilities for use of these elastomeric materials in the area of seals range from static seals such as, for example, cylinder head, valve cover or oil sump gaskets, seals for manual transmissions and automatic transmissions, O-rings, seals in the area of intake manifolds and exhaust gas recirculations to dynamically stressed sealing elements such as, for example, piston sealing rings, in particular, also so-called bonded piston seals.
AEM elastomers are obtainable, for example, from DuPont under the trade name VAMAC®. ACM elastomers are sold by Zeon Chemicals, for example, under the trade names Nipol® and HyTemp®.
In addition, Tohpe Corporation, Unimatec and Nippon Mectron offer diaminically crosslinkable elastomers of the ACM type.
Conventionally, diaminically crosslinkable AEM and ACM elastomers are crosslinked with crosslinking agents such as, for example, hexamethylene diamine carbamate, N,N-dicinnamylide diamine carbamate, 4,4-diaminodicyclohexylmethane, m-xylene diamine, 4,4-diaminodiphenylmethane, 4,4-diaminodiphenyl ether and 2,2-bis[4-(4-amino-phenoxy)phenyl]propane, which can be used individually or in mixtures. Other suitable diamine crosslinking agents belong to the group of hexamethylene diamines.
The aforementioned crosslinking systems are used together with an accelerator, which is preferably taken from substances of the guanidine group, to which, in particular, the accelerators OTBG, DOTG, DPG and/or biguanidine belong.
For some time, these accelerators have been classified as toxicologically hazardous. They also act teratogenically upon contact with the skin.
In view of the European Union REACH Regulation, availability of such accelerators in the future appears questionable.
Tertiary amines such as, for example, 1,8-diazabicyclo-5,4,0-undec-7-ene (DBU), have been suggested as alternatives to these accelerators, but they do not constitute an equivalent alternative to the guanidine accelerators since they result in inferior elastic properties of the crosslinked elastomer, with the same crosslinker component content, and, in particular, the compression set at elevated temperatures suffers considerably.
Furthermore, the storage stability of these accelerators in comparison with the guanidine accelerators in the finished mixture of the elastomer with the crosslinking system is significantly reduced.
The object of the invention is to propose a crosslinking agent for AEM and ACM elastomers, which is equivalent to the crosslinking agents containing guanidine that have been used until now, but which does without the teratogenically acting guanidines which are toxicologically hazardous.


The disclosure generally relates to an exemplary cooling system for an enclosure that can house an electrical network protection element and provide protection to the electrical network protection element against damage in various environments such as when the enclosure is placed in an underground vault that may be flooded during rain, or when a liquid (oil, for example) comes in contact with the enclosure. The exemplary cooling system may include a coolant reservoir, one or more false walls coupled to the exterior of the enclosure, one or more pancake panels coupled to the false walls through one or more header pipes, and one or more coolant pipes for circulating coolant from the coolant reservoir, through the one or more pancake panels, false walls, and header pipes, and back to the coolant reservoir. The cooling system may only be in contact with the exterior portion of the enclosure. That is, the cooling system may not directly contact the electronics within the enclosure.

An electrical protection element such as a circuit breaker or a fuse is typically used to protect a circuit, a device, or a system from being damaged due to an abnormal condition such as an over-voltage condition or an over-current condition. The characteristics of the electrical protection element are defined in large part by the nature of the application where the electrical protection element is used. Thus, a small fuse may be adequate to protect an electronic circuit board while a heavy-duty circuit breaker may be required to protect a transformer in an electric utility facility. Furthermore, the fuse used in the electronic circuit board may be selected without any undue attention being paid to a water-proofing aspect of the fuse. On the other hand, the heavy-duty circuit breaker may require specific attention to be paid to environmental factors such as temperature, humidity, and moisture, because the transformer may be exposed to natural elements such as the sun, rain, and snow. Consequently, in such applications, the electrical protection element may be placed inside a protective housing such as a utility hut or a water-proof enclosure.
In some cases, an electrical protection element may be housed inside a water-proof enclosure that is installed inside an underground structure. While it is expected that water would not normally flow into the underground structure, in some situations such as during heavy rainfall, water may enter the underground structure. The water-proof enclosure must therefore be constructed to prevent this water from coming in contact with the electrical protection element.
In some other cases, an electrical protection element may be housed inside a water-proof enclosure that is submerged under water, such as a body of water. Here again, the water-proof enclosure must be constructed to prevent water from coming in contact with the electrical protection element.
The water-proof enclosure must however, allow a person such as a technician, to open the water-proof enclosure in order to gain access to the electrical protection element for various reasons, such as to replace parts or to make a visual inspection of the electrical protection element. Consequently, such conflicting requirements should be taken into consideration when designing a water-proof enclosure. Some conventional solutions fail to satisfy at least some of these conflicting requirements, thereby exposing the electrical protection element to potential damage and/or making it difficult for a technician to access the electrical protection element.
Additionally, temperatures inside the housing may be maintained to prevent overheating of the breaker's relays, circuit boards, and wiring insulation to prevent dielectric insulation failure on those components controlling the disconnecting contacts protecting the transformer. A breaker electrical component dielectric insulation failure may cause the network protector to not properly work, for example, either through short circuit or melting resulting in transformer failure. Conventional protector temperatures may be maintained by tank housing material and fin applications due to its passive heat transfer nature. Pumps and fans may not be allowed in the utility industry due to housing being submerged, the environment having high levels of corrosion water, and the housing having to be maintenance free.

Cooling system for enclosure for electrical network protection element


An apparatus for supplying a respiratory gas includes a blowing device for delivering the respiratory gas, a housing device having a bottom region, a top surface region and a side region extending upwardly between the top surface region and the cover region, as well as a connecting device for connecting a humidifying apparatus. The connecting device is arranged in the side region of the apparatus in such a way that the humidifying apparatus can be laterally coupled thereto. The humidifying apparatus may include a partial amount discharge device for passing a partial amount of the liquid pre-stored in a liquid storage space into a humidifying region. A respiration tube includes a connecting plug structure which has both a respiratory gas connecting portion and a pressure measuring tube connecting portion.

1. Field of the Invention
The invention concerns an apparatus for supplying a respiratory gas under an increased pressure comprising a blowing device for delivering the respiratory gas, a housing device for receiving the blowing device and a connecting device for connection of a humidifying apparatus for humidifying the respiratory gas delivered by the delivery device. The invention further concerns a humidifying apparatus for humidifying a respiratory gas as well as a respiratory gas tube or hose and a connecting apparatus therefor.
2. Description of Related Art
Apparatuses for supplying a respiratory gas under an increased pressure are used in particular in the field of sleep therapy for dealing with sleep-related respiratory disturbances. Supplying the respiratory gas under a predetermined increased pressure, usually in the range of between 5 and 20 mbar, provides for pneumatic splinting of the upper respiratory tracts of a patient, in a physiologically well compatible fashion, whereby it is possible to effectively prevent obstruction in that respiratory tract region.
Usually the respiratory gas is formed directly from the ambient air which is preferably sucked in by way of a filter device. In dependence on the climatic conditions which fluctuate in particular due to the time of year involved, it has proven to be advantageous for the respiratory gas which is supplied to the patient, for example by way of a blowing device, under a regulated, possibly alternating pressure, to be humidified from time to time. For that purpose it is possible to insert a humidifying device into the respiratory gas path between the blowing device and the respiratory mask, for example by way of an intermediate hose portion. CPAP-units with an integrated humidifying apparatus are also known.
In the case of the humidifying apparatuses which are only inserted into a hose line however, there is frequently the problem of inadequate strength and stability. In the case of CPAP-units with an integrated humidifying apparatus the latter has to be constantly taken around, even if there is temporarily no need for humidification of the respiratory gas.


A method is provided for evaluating trace signal coupling in an electronic design (e.g., a package design). In the method, one or more trace signal coupling rules are formulated. One or more trace pairs designed to carry differential signals are then processed to determine whether the inter-trace spacing between the trace pairs violates the trace signal coupling rules. An indicator (e.g., a DRC and/or a report) is generated to identify violated trace signal coupling rules. Processing of the electronic design may be scoped according one or a group of signal nets, or one or a group of levels of the package design.

Prior art computer aided design (CAD) software is known to include complimentary tool suites for designing and analyzing the package of a die, e.g., a microprocessor. A "package" is the physical interconnection between the die and, for example, a printed circuit board (PCB). A typical package has several interconnected layers between its top level (L1), which connects to the die, and its bottom level (L2), which connects to the PCB.
A package "design" is a hierarchical and symbolic digital model of the package circuit. Those skilled in the art appreciate that hardware description languages (HDLs) may be used to formulate this digital model. The digital model consists of linked design elements that simulate the package circuit. The design elements are for example digital representations of the transistors, resistors, logic gates, traces (i.e., intra-level conductors), capacitors, vias (i.e., inter-level connectors), and wire bonds that make up the simulated schematic circuit.
The design elements and interconnections are collated and defined in a design database, which is a textual representation of the package design. The design database may further describe the package design in terms of higher-level cells consisting of two or more design elements, and the connections between cells. Each "net" in the package design describes the linked conductors (e.g., traces of a level and vias between levels) that form a circuit between an input and an output of the package. The CAD software may automatically route traces within a given level of the package design; it may further automatically route traces in a level and between vias of the package design.
The design database is processed by the CAD software to perform circuit simulation. The CAD software is for example used to model a signal through the package and over a net (i.e., a "signal net"). Substrate laminate technologies and bond interconnections may also be evaluated through the CAD software.
One exemplary prior art CAD software is Advanced Package Designer (APD) from Cadence Design Systems, Inc., of San Jose, Calif. Such CAD software is known to include verification procedures and dynamic feedback that evaluate design accuracy against a set of physical and electrical design rules, or constraints. Physical design constraints help to ensure manufacturability; electrical design constraints help to ensure electrical specifications of the design. By way of example, this CAD software generates a Design Rule Check (DRC) indicating whether the design meets the various constraints. The prior art CAD software also provides a graphical user interface to view all or part of the package design in two dimensions, for example in a flat or perspective rendition, or with levels overlaid relative to one another.
FIG. 1 illustrates one prior art system 10 for designing a package with prior art CAD software 12. CAD software 12 is stored within a computer 14, initially within a storage unit 16. A processor 18 of computer 14 operates CAD software in response to user inputs at an input interface 20 (e.g., a computer keyboard and mouse). As those skilled in the art appreciate, when initialized, CAD software 12 may also load into internal memory 22 of computer 14. A human designer at input interface 20 then controls CAD software 12, through processor 18, to create a package design 24, also stored within memory 22. The designer can command processor 18 and CAD software 12 to graphically show package design 24 at a graphical user interface 26 (e.g., a computer monitor) of system 10. Illustratively, package design 24 is graphically depicted on a display 28 of graphical user interface 26 as a five-level package model 24A shown in FIG. 2.
FIG. 2 illustrates detail of graphical model 24A. L1 of model 24A couples with a die, and L2 of model 24A couples with a PCB. Levels I(1), I(2) and I(3) of model 24A represent intermediate levels of package design 24. Levels L1, I(1), I(2), I(3), L2 are shown as distinct elements and without proper or to-scale orientation for ease of illustration. An illustrative signal net 30A is shown from an input connector 32A to an output connector 34A of model 24A. Signal net 30A traverses design elements in the form of traces and vias between connectors 32A, 34A: via 35A from connector 32A of L1 to trace 36A of I(1); trace 36A within I(1) from via 35A to via 38A; via 38A from trace 36A of I(1) to trace 40A of I(2); trace 40A within I(2) from via 38A to via 42A; via 42A from trace 40A of I(2) to trace 44A of I(3); trace 44A within I(3) from via 42A to via 46A, which terminates at connector 34A of L2.
Another signal net 30B is shown from an input connector 32B to an output connector 34B of model 24A. Signal net 30B traverses design elements in the form of traces and vias between connectors 32B, 34B: via 35B from connector 32B of L1 to trace 36B of I(1); trace 36B within I(1) from via 35B to via 38B; via 38B from trace 36B of I(1) to trace 40B of I(2); trace 40B within I(2) from via 38B to via 42B; via 42B from trace 40B of I(2) to trace 44B of I(3); trace 44B within I(3) from via 42B to via 46B, which terminates at connector 34B of L2.
With further regard to FIG. 1, CAD software 12 is also operable to generate a design database 50. In one example, design database 50 textually defines signal nets 30A and 30B of FIG. 2: signal net 30A is defined by connectors 32A, 34A, traces 36A, 40A, 44A, and vias 35A, 38A, 42A, 46A; signal net 30B is defined by connectors 32B, 34B, traces 36B, 40B, 44B, and vias 35B, 38B, 42B, 46B. Design database 50 also includes parameters (often called a "netlist") to set physical package dimensions and to ensure that signal nets 30A and 30B have start and end points (i.e., connectors 32A, 34A for signal net 30A, and connectors 32B, 34B for signal net 30B). A designer can manipulate design database 50 to develop the desired package design 24.
CAD software 12 utilizes design rules 52 to generate one or more DRCs 54 in the event that a design element or signal net of package design 24 exceeds a manufacturing constraint or electrical specification. By way of example, design rules 52 may specify that a trace width of trace 36 is 20 μm, to ensure manufacturability. If a designer of package 24 implements trace 36A with 10 μm, for example, then CAD software 12 generates a DRC 54A, which may be graphically displayed on model 24A, as shown in FIG. 2. The user is thus made aware that a problem may exist with trace 36A.
Those skilled in the art appreciate that package design 24 often has more than the five levels illustrated in model 24A; however only five levels are shown in FIG. 2 for ease of illustration. For example, it is common that package design 24 include ground levels between each level with signal traces (I(1), I(2) and I(3); however these ground levels are not shown to simplify illustration. Those skilled in the art also appreciate that package design 24 also typically has many more signal nets and other design elements than illustrated signal nets 30A and 30B. For example, package design 24 typically includes many other traces and vias (not shown) within package model 24A.
Signal nets 30A, 30B are also illustrated close together with substantially similar form (e.g., traces 40A, 40B are substantially parallel) to illustrate that signal net pair 30A, 30B operates to transfer differential signals through package design 24. As those skilled in the art appreciate, differential signals provide benefits to electronic circuits, for example to provide enhanced signal discrimination, to reduce susceptibility to interference, and/or to accurately process bipolar signals. FIG. 2 also illustrates that traces of signal nets 30A, 30B sometimes deviate from one another within a given level. For example, in level I(1), trace 36B has four trace deviations 50 forming trace segments 36B(1)–36B(4), while trace 36A has one trace deviation 50 forming trace segments 36A(1) and 36A(2). Another deviation between signal nets 30A, 30B also clearly occurs in level I(3). In I(3), trace 44B has three trace deviations 50 forming trace segments 44B(1)–44B(3), while trace 44A has one trace deviation 50 forming trace segments 44A(1), 44A(2).
FIG. 3 illustrates package model 24A in a side view. FIG. 3 further illustrates how package design 24 connects between a die 80 and a PCB 82. Connector 32A is for example a pad that connects with a solder ball 84A of die 80; connector 34A is for example a pad that connects with signal wires of PCB 82. Similarly, connector 32B is for example a pad that connects with a solder ball 84B of die 80; connector 34B is for example a pad that connects with signal wires of PCB 82. As shown, signal nets 30A, 30B illustrate an exemplary pair of conductors suitable for transferring a differential signal from die 80 to PCB 82. Trace deviations 50 are not shown in FIG. 3 since they occur within a given layer.
The increased complexity of the modem die has correspondingly increased the complexity of the package design. An example of a complex die includes a Precision Architecture—Reduced Instruction Set Computer (PA-RISC) processor produced by Hewlett Packard Corporation, which has over one billion components. The package for the PA-RISC processor must maintain high signal integrity through its signal nets; this is especially true when the signal integrity involves differential signals. However the prior art CAD software does not simulate this signal integrity as required by the corresponding die. Accordingly, the package may be physically manufactured, at great expense, before the designer learns that the package is not suitable for operation with the die. More particularly, though the DRCs generated by the prior art CAD software may assist in manufacturability; they do not, however, warn the designer of signal net incompatibilities between the die and the package. In one example, prior art CAD software 12 does not evaluate the spacing or signal coupling between a pair of traces designed to carry differential signals of the package; if this spacing varies too much, the differential signal can decouple within the layer and induce common mode noise or other undesirable artifacts.

System and method for evaluating signal coupling between differential traces in a package design

Hewlett-Packard Development Company, L.P.