Device and process for oscillation insulation in a transmission path. The device includes a first body structured and arranged to undergo an oscillation movement, at least one rigid connection element, a second body connected to the first body via the at least one rigid connection element, and an actuator device attached to the at least one connection element. A sensor unit is arranged in an interface area of the at least one connection element, and a regulator unit, connected to the sensor unit, is arranged to control the actuator device to perform an elastic deformation equivalent to an oscillation movement of the first body. The instant abstract is neither intended to define the invention disclosed in this specification nor intended to limit the scope of the invention in any way.

1. Field of the Invention
The present invention relates to a device and process for oscillation insulation in a transmission path having a first body that performs an oscillation movement, a second body that is connected to the first body via at least one rigid connection element, an actuator device that is arranged on the at least one connection element, a sensor unit, and a regulator unit. The invention is used for oscillation reduction or vibration reduction in helicopters.
2. Discussion of Background Information
The problem of the transmission of oscillation movements of a vibrating body to a second body connected thereto via a rigid connection element occurs in technology wherever machine vibrations and machine oscillations are generated by a source. The transmission of these oscillations and vibrations (usually called structure-borne noise) to elements rigidly connected to the source is hereby very disturbing in general.
As is known, in helicopters the main transmission gear is connected via several support structures, the so-called struts, to the upper side of the cell structure of a cockpit. This support structure or the strut are to be considered in a generalized manner as a connection element. This is thereby a rigid connection element. This connection element represents a transmission path. The main transmission gear and engine, rotor and auxiliary units generate vibrations that are passed into the cell structure of the cockpit via the struts. The disturbing high-frequency gearing vibrations are the determining factor for noise disturbance and arise through gear tooth engagement. A gearing has several pairs of gear wheels, the engagement of which leads to marked oscillations and the associated noise peaks at discrete frequencies in the range of approx. 500-4000 Hz. These noise peaks often exceed the background noise in the helicopter by 10-20 dB (FIG. 1) and thus also dominate the overall noise level. In addition, discrete frequencies are experienced as very disturbing, even if the noise level is otherwise at a low level. Further i.a. discrete frequencies are generated by the engine, the rotor and auxiliary units and likewise passed into the cabin via the gearing struts. The overall noise level (integrated over the entire frequency range) in a conventional standard helicopter is between 85-90 dBA. The gearing-induced vibrations are thus the main cause of serious noise disturbance in the cockpit.
Various arrangements and systems have been proposed to reduce this noise disturbance. U.S. Pat. No. 6,105,900 and U.S. Pat. No. 6,138,947, for example, describe an active noise control system that minimizes the undesirable acoustic noise in a helicopter cockpit. This noise is caused to a great extent by vibrations of the main transmission gear that is connected to the cell structure of the cockpit. The main transmission gear is connected to the cell structure of the cockpit by means of individual attachment feet. The individual attachment foot features a flange in the area of the interface between attachment foot and cell structure. An oscillation actuator for generating mechanical oscillations is in turn arranged on this flange. The oscillation actuator generates oscillations through the movement of an inertial mass, which oscillations are passed into the struts from the actuator via the flange and superimposed on the oscillations generated by the main transmission gear, so that a marked reduction of the resulting oscillation ensues from a superimposition of both oscillations. As a result, the noise is reduced in the cockpit of the helicopter. The known noise control system is thus based on a counter-control principle. The oscillations first introduced are detected and compensated for by means of a corresponding counter-vibration through destructive interference. However, this means that in any case undesirable forces are first introduced into the cockpit which forces are then compensated again through the targeted introduction of corresponding counter-forces that are fed in via an intake surface of the flange acting virtually in a selective manner. The known noise control system thus has the disadvantage that in any case the support structure (strut) and the cell structure of the cockpit are acted on with forces. Furthermore, the relatively high weight of the oscillation actuators is disadvantageous. It is also disadvantageous that several flanges are necessary on one support structure.
U.S. Pat. No. 6,224,014 B1 describes the reduction of noise that occurs in the helicopter due to various vibration sources (gearing, engine, rotor). The actuators are oscillation actuators that have an inertial mass to be moved. The vibration force generated by the oscillation actuator is destructively superimposed on the disturbing oscillation and not insulated from the cell structure.
European Patent Application No. EP 0 774 411 takes into consideration purely the reduction of vibration and not the reduction of noise in the cockpit which is caused by the higher-frequency oscillations of the main transmission gear. The known document considers oscillations that occur through the rotating main rotor (column 9, line 39 ff). These oscillations lie at fairly low frequencies (approx. 20-30 Hz) and are therefore not relevant in terms of noise.
Furthermore, German Patent Application No. DE 198 13 959 A1 discloses a device for suppressing structure-borne noise that reduces the transmission of machine vibrations and machine oscillations through a support structure to a cell or a component with the simplest possible construction and with relatively low integration costs. There, too, the cell or the component is, e.g., the cockpit of a helicopter. DE 198 13 959 A1 teaches that the device for structure-borne noise suppression contains at least one piezo actuator that introduces oscillations into the support structure in order essentially to block the structure-borne noise transmission path to the structure to be insulated and to compensate for the noise excitation more effectively by means of the available and excited system dimensions of the noise generator. The piezo actuator installed on the support structure thereby effects a force introduction over a relatively large surface area of the support structure. The support structure can be arranged, e.g., between the main transmission gear of a rotor and a cell structure of the cockpit of a helicopter. In this case the support structure is embodied as one or more gearing struts. The piezo actuator is arranged essentially along the entire circumference of the strut and has a defined extension in the axial direction of the strut.
However, German Patent Application No. DE 198 13 959 A1 does not provide any information on how such a device for suppressing structure-borne noise can be effectively used in an overall system or on how the regulation and control occur, taking into consideration the interaction of the individual parts and components in an overall system.


A vision prosthesis includes an optical element having a surface that is shaped to be positioned near a cornea of an eye, and a magnetic element embedded in the optical element.

Loss of visual acuity from refractive errors in a person's vision can be caused by conditions such as hyperopia and myopia. Some restoration of visual acuity can be provided by spectacles or contact lenses. Loss of visual acuity can also be caused by wavefront aberrations due to irregularities in the eye (e.g., in the cornea or in the natural crystalline lens). The lenses in spectacles, unlike contact lenses, have a stable orientation with respect to the eye, and can therefore be used to correct asymmetric wavefront aberration. Some "toric contact lenses" are ballasted to reduce rotation in the eye. Some irregularities in the cornea such as astigmatism can be partially corrected by a hard contact lens that conforms the cornea to the shape of the lens.


A steering wheel of a transportation device includes controls positioned on the wheel. The controls are operable by operator's fingers and may be connected to the various electrical and electronic devices of the transportation device. Further, in one of the embodiments, controls are positioned on a circular grip member of the wheel. In one of the embodiments, the steering wheel includes a display positioned on the hub-like connecting member of the wheel, which can show radio frequency, time, temperature, etc.

The present invention relates to steering wheel and, more particularly, to a steering wheel having controls for various devices located on the wheel or in close proximity to the wheel.
It is desirable to have controls positioned on the steering wheel. For example, it is highly inconvenient and even dangerous to change a radio station while operating an automobile, a boat, an airplane, etc. The radio is located on a dashboard at a distance from the steering wheel. To change a radio station in, e.g., a car, a driver have to take a look at the radio and either to reach for a radio handle or knob to tune to a station, or to look for the proper knob to push to get tuned to the pre-set station. All these operations require that a driver stops looking at the road for certain period of time. In addition, it is quite inconvenient for a driver to stretch his hand to the radio while holding the steering wheel. This inconvenience is even greater if a driver is wearing a seat belt. The same inconvenience occurs when a driver tries to reach the air conditioner or heater controls located on the dashboard, and change either the temperature inside the cabin, or the mode the air conditioner or heater are working in. Same applies for turning on a defogger or a defroster, or any other device located in a transportation device.


This invention relates to novel lactams having the formula (I):

Alzheimer's disease (AD) is a degenerative brain disorder characterized clinically by progressive loss of memory, temporal and local orientation, cognition, reasoning, judgment and emotionally stability. AD is a common cause of progressive dementia in humans and is one of the major causes of death in the United States. AD has been observed in all races and ethnic groups worldwide, and is a major present and future health problem. No treatment that effectively prevents AD or reverses the clinical symptoms and underlying pathophysiology is currently available (for review, Dennis J. Selkoe; Cell Biology of the amyloid (beta)-protein precursor and the mechanism of Alzheimer's disease, Annu Rev Cell Biol, 1994, 10: 373–403).
Histopathological examination of brain tissue derived upon autopsy or from neurosurgical specimens in effected individuals revealed the occurrence of amyloid plaques and neurofibrillar tangles in the cerebral cortex of such patients. Similar alterations were observed in patients with Trisomy 21 (Down's syndrome), and hereditary cerebral hemorrhage with amyloidosis of the Dutch-type. Neurofibrillar tangles are nonmembrane-bound bundles of abnormal proteinaceous filaments and biochemical and immunochemical studies led to the conclusion that their principle protein subunit is an altered phosphorylated form of the tau protein (reviewed in Selkoe, 1994).
Biochemical and immunological studies revealed that the dominant proteinaceous component of the amyloid plaque is an approximately 4.2 kilodalton (kD) protein of about 39 to 43 amino acids. This protein was designated Aβ, β-amyloid peptide, and sometimes β/A4; referred to herein as Aβ. In addition to its deposition in amyloid plaques, Aβ is also found in the walls of meningeal and parenchymal arterioles, small arteries, capillaries, and sometimes, venules. Aβ was first purified and a partial amino acid reported in 1984 (Glenner and Wong, Biochem. Biophys. Res. Commun. 120: 885–890). The isolation and sequence data for the first 28 amino acids are described in U.S. Pat. No. 4,666,829.
Compelling evidence accumulated during the last decade revealed that Aβ is an internal polypeptide derived from a type 1 integral membrane protein, termed P amyloid precursor protein (APP). β APP is normally produced by many cells both in vivo and in cultured cells, derived from various animals and humans. Aβ is derived from cleavage of β APP by as yet unknown enzyme (protease) system(s), collectively termed secretases.
The existence of at least four proteolytic activities has been postulated. They include β secretase(s), generating the N-terminus of Aβ, α secretase(s) cleaving around the 16/17 peptide bond in Aβ, and γ secretases, generating C-terminal Aβ fragments ending at position 38, 39, 40, 42, and 43 or generating C-terminal extended precursors which are subsequently truncated to the above polypeptides.
Several lines of evidence suggest that abnormal accumulation of Aβ plays a key role in the pathogenesis of AD. Firstly, Aβ is the major protein found in amyloid plaques. Secondly, Aβ is neurotoxic and may be causally related to neuronal death observed in AD patients. Thirdly, missense DNA mutations at position 717 in the 770 isoform of β APP can be found in effected members but not unaffected members of several families with a genetically determined (familiar) form of AD. In addition, several other β APP mutations have been described in familiar forms of AD. Fourthly, similar neuropathological changes have been observed in transgenic animals overexpressing mutant forms of human β APP. Fifthly, individuals with Down's syndrome have an increased gene dosage of β APP and develop early-onset AD. Taken together, these observations strongly suggest that Aβ depositions may be causally related to the AD.
It is hypothesized that inhibiting the production of Aβ will prevent and reduce neurological degeneration, by controlling the formation of amyloid plaques, reducing neurotoxicity and, generally, mediating the pathology associated with Aβ production. One method of treatment methods would therefore be based on drugs that inhibit the formation of Aβ in vivo.
Methods of treatment could target the formation of Aβ through the enzymes involved in the proteolytic processing of β amyloid precursor protein. Compounds that inhibit β or γsecretase activity, either directly or indirectly, could control the production of Aβ. Advantageously, compounds that specifically target γ secretases, could control the production of Aβ. Such inhibition of β or γ secretases could thereby reduce production of Aβ, which, thereby, could reduce or prevent the neurological disorders associated with Aβ protein.

Hydroxyalkanoylaminolactams and related structures as inhibitors of Aβ protein production

Abstract: to their pharmaceutical compositions and to their methods of use. These novel compounds inhibit the processing of amyloid precursor protein and, more specifically, inhibit the production of Aβ-peptide, thereby acting to prevent the formation of neurological deposits of amyloid protein. More particularly, the present invention relates to the treatment of neurological disorders related to β-amyloid production such as Alzheimer's disease and Down's Syndrome.


A vehicle door hinge structure includes a first bracket, a second bracket, a hinge arm and a compressible check structure. The hinge arm has a first end that s attached to the first bracket for pivoting movement about a first pivot axis. The second bracket is attached to a second end of the hinge arm for pivoting movement about a second pivot axis. The compressible check structure is fixed in position to the first bracket. The compressible check structure is adjacent to and spaced apart from a stop surface of the first bracket. The compressible check structure extends upward away from a surface of the first bracket in an uncompressed state. However, a movement limiting surface of the hinge arm contacts and compresses the compressible check structure during a portion of movement of the hinge arm.

A vehicle door can include a check structure that assists in retaining the door in one or more open positions after the door is moved from a closed position to an open position. Typically, the check structure includes a movement restricting mechanism that applies a force on the door to keep the door in one or more predetermined positions when opened. However, such check structures are not usually effective in all circumstances, such as when the vehicle is parked on a hill where the force of gravity can sometimes be sufficient to overcome the force of the check structure, thereby urging the door back to the closed position.


A method and apparatus for analyzing a telecommunications network and providing data based on such analysis first receives physical topology data for the network based on nodes and their connections in the network. Thereafter, the method and apparatus identify several inter-node configurations in the network. Preferably, the method and apparatus identify six inter-node configurations: stranded network non-rings, non-ring network spurs, stranded network rings, spur nodes with path diversity, network segments with pass-through nodes, and network segments without pass-through nodes. From these six identified inter-node configurations, the method and apparatus identify failure spans or maximum lengths in a network that can be singularly restored. As a result, the six identified inter-node configurations or failure spans can be employed to reduce the processing time required under network restoration systems, and thus can be used to minimize the time required to isolate a failure and generate a restoral route in the network.

In the telecommunications field, particularly in long distance networks, long distance network providers continually strive to increase the traffic carrying capability of their transmission medium. For example, since fiber optic cables have increased bandwidth over known twisted pair or copper wire cables, fiber optic cables are used increasingly for connecting network stations and other network elements. As a result, a greater number of stations or network elements can be connected over a fewer number of fiber optic cables, as opposed to prior cables.
Unfortunately, if one or more of the fiber optic cables fail, massive disruption of services to a large number of network customers and users can result. Network service providers or telecommunications carriers therefore strive to quickly and economically restore traffic effected by these disruptions or "outages." Restoring network outages generally requires four steps: (1) detecting the network failure, (2) isolating the location of the failure in the network, (3) determining a traffic restoral route, and (4) implementing the restoral route. Network restoration must be executed quickly to ensure minimal interruption of network traffic. Therefore, nearly all telecommunications carriers wish to restore traffic within a few seconds or less. The telecommunications carriers typically restore the highest priority network elements first, and as many of such elements as possible within a short period of time.
Currently, telecommunications carriers simulate possible failures, determine restoral routes, and develop a "pre-plan" by collecting large amounts of data reflecting the logical topology of the network. The collected data is often retrieved from network engineering databases which reflect the logical construction of the network, such as indicating the connections and paths of all network traffic trunks. An engineer or network analyst analyses the collected data, compares the collected data to the geographic or physical layout location of the network, and then generates the pre-plans therefrom. Since the pre-plans are developed prior to any failure in the network, when a failure does occur, a plan already exists for restoring traffic affected by the failure. In general, a pre-plan corresponds to a segment of the network that can incur a failure. If that segment fails, then the corresponding pre-plan is retrieved, and its restoral route implemented.
To determine where in the network a failure has occurred, a central location often receives various alarms from the network, which are generated in response to the failure. With the aid of numerous algorithms performed to correlate the various alarms based on trunk topology, the analyst must then match the alarms to a physical network topology to isolate the location of the failure within the network. After locating the failure, the analyst can then identify the appropriate pre-plan. For example, by locating the failure on a physical map of the network, the analyst can then identify an alternative route that restores all failed traffic, without sacrificing other traffic or creating new outages. Locating a failure within the network requires extensive processing, particularly with large networks. Such extensive processing necessarily requires processing time, and therefore increases the delay in restoring the network following the failure.
Telecommunications carriers have handled network outages by simulating different failure scenarios in advance. Based on the scenarios, the telecommunications carriers establish scenarios with appropriate instructions (or pre-plans) that can be used at various stations of the network to establish restoral routes to recover from the network outage. Since the number of possible failures in a network necessarily increases as the size of the network increases, a large number of pre-plans are required. Furthermore, since technological improvements allow network topologies to change relatively quickly and easily, and as a network grows, such networks are not static. As a result, pre-plans must be continually be reevaluated, and new pre-plans created.

Method and apparatus for determining maximum network failure spans forrestoration


A multi-slope handoff algorithm for controlling dynamic communication quality in wireless communications is proposed to let a mobile node adjust the handoff slope according to different communication connection situations for setting the optimum add/drop connection trigger thresholds. The algorithm comprises the following steps. First, a mobile node receives pilot strengths of its service pilot and nearby pilots to produce an aggregate strength. Next, the mobile node determines whether to perform handoff according to the magnitude of the aggregate strength. The handoff action is then controlled by multi-slope handoff operations to set an appropriate slope and to calculate the add/drop connection trigger thresholds when performing handoff. Finally, the pilot to be connected is selected based on the communication quality at that time. In this way, the quality of the communication service can be enhanced, the connection power consumption can be lowered, and the communication channel usage can be reduced.

In all wireless communication systems, the motion of a user will cause the handoff of the associated communication connection. How to effectively design the communication handoff technique concerns whether the communication handoff is successful and effective distribution of resources of the communication system.
In a wireless network communication system, when a mobile node (MN) performs mobile communication in the system and enters from a cell into another cell, there will be a cell handoff. The handoff can be generally divided into a hard handoff and soft handoff. In the hard handoff, the MN only connects to a base station from start to end of the handoff. The communication quality in the handoff process can't be guaranteed. On the other hand, in the soft handoff, the MN keeps contact with several base stations simultaneously and selects the strongest signal for communication. Although the communication quality during handoff is better, the required system resources are more than that in the hard handoff.
In the first conventional handoff algorithm-signal strength handoff (SSHO), base stations only detect the signal strength of MN for the handoff. Because factors like loading and stability of the communication system aren't taken into account, once a base station adds a new MN into its range, instability of fading channel will cause instability of the communication quality.
A second conventional handoff algorithm-IS95A belongs to code division multiple access handoff techniques, as shown in FIG. 1. This algorithm compares the pilot strength of a nearby base station in a neighbor list table with a fixed communication handoff add threshold to determine whether to handoff to the nearby base station. Contrarily, if the pilot strength of a service base station is lower than a fixed communication handoff drop threshold for a fixed duration, the service base station will be removed from the neighbor list table and its data communication connection. Under different communication connection qualities, however, the same communication handoff thresholds are used as the handoff trigger control mechanism. Therefore, the actual communication connection quality and the required system resources can't be effectively detected and controlled.
A third conventional handoff algorithm makes use of behavior aggregate handoff (BAHO) technique, usually the IS-95B/cdma2000 technique. An aggregate Ec/Io strength is used to set trigger thresholds. When a MN handoffs from an original service base station to a nearby base station, the MN will perform dynamic communication quality control as the linear formula shown in FIG. 2. However, because the parameter aggregate Ec/Io strength has different performance behaviors under different number of connection paths, only using the aggregate Ec/Io strength as the parameter without considering factors like downlink interference and stability caused by the loading of the communication system can't effectively maintain the connection quality. The downlink means transmission from a base station to a mobile phone.
In order to avoid an unsuccessful connection, new legs are largely added in. A new leg is added in under a bad communication connection to improve the communication quality strength. Due to the increase of downlink interference, the communication quality can't necessarily be improved. Adding a new leg may improve the connection quality but at the cost of increasing overall system interference. If the communication quality of the new leg is unstable, the improvement to the connection quality is none. In view of this, the present invention proposes a multi-slope handoff algorithm for controlling dynamic communication quality in wireless communications. Only legs with reasonable strengths are added in to produce positive contribution for the final connection quality and conform to the nonlinear relationship between the communication quality and connection channel.

Multi-slope handoff algorithm for controlling dynamic communication quality in wireless communications


A gas-tube arrester includes an arrester body containing an inert gas and having first and second electrodes positioned in spaced, facing relationship to each other and separated by an insulator. An insulating, heat-resistant film is in contact with the first electrode and has an opening and a plurality of small holes. A metal plate layered on the insulating film has an opening communicating with the opening of the insulating film. A low-melting point metal plate layered on the metal plate to cover the openings has a melting point lower than a softening temperature of the insulating film. A conductive leaf spring is electrically connected to the second electrode and presses the low-melting point metal plate toward the metal plate, so that, when a high voltage is applied between the first and second electrodes, an electrical discharge occurs between the first and second electrodes through the small holes of the insulating films, and whereby when the low-melting point metal plate is fused by heat of the arrester body, the fused metal will flow through the openings to electrically connect the leaf spring to the first electrode.

1. Field of the Invention
The present invention relates to a gas-tube arrester, and more particularly, to a gas-tube arrester in which line electrodes and an earth electrode are positioned in spaced, facing relationship to and each other with insulators interposed therebetween.
2. Description of the Related Art
First of all, some examples of gas-tube arresters known in the prior art will be explained with reference to FIGS. 1 to 5.
An arrester 200 shown in FIG. 1 is mounted on a telephone line or other communication line to protect the communication equipment from lightning or other external electrical surge. For the arrester 200, as shown in FIG. 2, a gas-tight arrester body 220, in which argon or other inert gas is contained and line electrodes 206 and an earth electrode 208 are arranged with insulators 210 interposed therebetween, is often employed.
If a power supply cable line e.g., at 100, 200, or 6600 Volt. AC) is in contact with a telephone line repeatedly, a high voltage is repeatedly applied to the arrester body 220. Then, an electric discharge continues in the arrester body 220. Eventually, the arrester 200 may become overheated and cause a fire or other disaster.
As a precaution for preventing the arrester 200 from overheating, as shown in FIGS. 1 and 2, an insulating film 204 made of polyester or other thermoplastic resin is placed between the arrester body 220 and a conductive leaf spring 202, the latter attached on the outer circumferential surface of the arrester body 220. Thus, a fail-safe mechanism is implemented in the arrester 200.
Using the arrester 200 having this kind of fail-safe mechanism, when a high voltage is applied repeatedly and an electric discharge continues in the arrester body 220, the arrester 200 will then be overheated. Then, the insulating film 204 made of a thermoplastic resin is fused by the heat of the arrester body 220. Then, the conductive leaf spring 202 is urged into contact the line electrodes 206 and the earth electrode 208 and electrically connects the line electrodes 206 and earth electrode 208. Therefore, the earth electrode 208 and line electrodes 206 are electrically shorted. This stops the consecutive electric discharge in the arrester body 220. Consequently, a fire resulting from the overheated arrester 200 can be avoided.
However, in the arrester 200 having only such a fail-safe mechanism as shown in FIGS. 1 and 2, if the argon or other inert gas contained in the arrester body 220 leaks for some reason, even if an external surge is applied to the arrester 200, an electric discharge cannot occur in the arrester body 220. This may damage the communication equipment or other unit of a communication system.
To cope with the foregoing drawback, Japanese Unexamined Patent Publication (Kokai) No. 53-52961 (U.S. Pat. No. 4,212,047) has proposed an arrester having both a vent-safe mechanism and a fail-safe mechanism as shown in FIG. 3.
In the arrester of FIG. 3, insulating films 204a and 204b, clamped between line electrodes 206 and a conductive leaf spring 202 which is electrically coupled to an earth electrode 208, have respective slits 212 and 212.
Owing to the slits 212, as shown in FIG. 4, a space, defined by the thickness of the insulating films 204a and 204b, is formed between the conductive leaf spring 202 and the line electrodes 206.
In the gas-tube arrester shown in FIGS. 3 and 4, a fail-safe mechanism and a vent-safe mechanism are implemented.
To be more specific, when an arrester body is heated due to consecutive electric discharges in the arrester body, a fail-safe mechanism operates. That is to say, the insulating films, made of a thermoplastic resin, fuse and a conductive leaf spring electrically connects the line electrodes and an earth electrode thereby to stop the consecutive electric discharges. This prevents the occurrence of a fire.
If argon or other inert gas contained in the arrester body leaks, a discharge cannot occur in the arrester body. In this case, if an external surge is applied to the arrester, the spaces formed by the slits 212 disposed at the tops of the line electrodes 206 (FIG. 4) induce an electric discharge between the line electrodes 206 and the conductive leaf spring 202. Thus, a vent-safe mechanism operates.
However, in the arrester shown in FIGS. 3 and 4, the temperature of the arrester body increases due to consecutive discharges. Even if the insulating films fuse to thereby bring the conductive leaf spring into contact with the line electrodes and thus the fail-safe mechanism operates, the contact resistance is still high because the conductive leaf spring and the line electrodes are brought into contact merely with the spring force of the conductive leaf spring.
A temperature cycle test was conducted in the range from -40.degree. C. to +60.degree. C. to test the gas-tube arresters of this kind, in which a conductive leaf spring comes into contact with line electrodes. However, in some samples of the arresters the contact between the conductive leaf spring and line electrodes could not be attained. As a result, it was found that a fail-safe function, which is based on a permanent contact, could not be guaranteed.
In an effort to guarantee the fail-safe function, the present inventor has tested the arrester shown in FIG. 5 which has been proposed in Japanese Unexamined Patent Publication (Kokai) NO. 53-52960 (U.S. Pat. No. 4,062,054).
In the arrester shown in FIG. 5, insulating films 205a and 205b having heat resistance (insulating film 205b is not shown) are used instead of the insulating films 204a and 204b shown in FIG. 3, and a solder plate 211 for shielding a slit 212 is placed between each of the insulating films 205a and 205b, and a conductive leaf spring 202.
The fail-safe mechanism of the foregoing arrester operates in such a manner than, when the solder plates 211 are fused by heat developed in the arrester 220, the fused solder forms a connection between each of line electrodes 206 and the conductive leaf spring 202. This connection is achieved reliably by the fused solder. Therefore, the function of the fail-safe mechanism can make a reliable connection.
However, in the arrester shown in FIG. 5, the soft solder plates 211 are always pressed by the conductive leaf spring 202. Therefore, portions of the solder plates 202 that are shielding the slits 212 warp gradually toward the line electrodes 206. The solder plates 211 and line electrodes 206 may come into contact unexpectedly. Thus, the arrester cannot assure total reliability.


There is provided a method for transmitting data to a multicast group including a plurality of receivers by using an X-cast mode, comprising the steps of transmitting an X-cast IP data packet having a X-cast header including addresses of a destination router and the multicast group, wherein the destination router is connected to the receivers, converting the X-cast IP data packet to a multicast IP data packet in the destination router and sending the multicast IP data packet to the receivers, wherein an IP header of the multicast IP data has the address of the multicast group. The source router can transmit an IP data packet to a multicast group having a medium or large number of receivers by using the X-cast mode.

In an IP (Internet Protocol) network, two modes are conventionally used for the transmission of data; one is a unicast mode and the other is a multicast method. In the unicast mode, an address of an expected data receiver is specified in a header of an IP data packet to be transmitted, and routers in the network transmit the IP data packet to the specified address. In the multicast mode, on the other hand, a group address for a number of expected data receivers are identified in a header of an IP data packet, so that the routers in the network make copies of the IP data packet and transmit the copied data to the number of receivers, simultaneously. Thus, the unicast mode is used for a one-to-one transmission of data while the multicast mode is used for a one-to-many transmission of data.
The multicast mode is widely used to provide information to be shared by a plurality of receivers, e.g., information on a movie. However, in the multicast mode, an overload situation is frequently caused since the routers in the network perform a multicast routing to the number of receivers or other routers by copying the IP data. Further, while the multicast mode is highly efficient for the transmission of the same data to a number of receivers, it is inefficient in case that the number of receivers is expected to be only a few, e.g., in cases such as a multi-user telephonic communication in the Internet Telephony, a network game, a multi-user audio-video conference.
An X-cast technique is developed for solving a problem of inefficiency of multicast technique when used for a multicast group having a few receivers. In the X-cast mode, a source (or a sender) provides an X-cast packet. The X-cast packet includes an X-cast header located between an IP header and a TCP (Transmission Control Protocol) header. The IP header has information indicating the X-cast mode and the X-cast header has addresses of receivers. By using the addresses in the X-cast header, the routers in the network decide paths or next routers through which the X-cast packet is transmitted to the receivers.
In the X-cast mode, a destination router (a router connected to receivers designated by addresses in the X-past header) routes an IP data packet to the receivers by using the unicast mode. As described above, routers in the X-cast mode does not multicast IP data packets so that the load of the routers is decreased. Further, in the X-cast mode, data transmission to a group of a few receivers can be performed in efficient manner.
However, in the X-cast mode, a source must know the addresses of receivers to send a data packet in advance of transmitting the data packet. Further, the X-cast mode is suitable only for transmitting a data packet to a multicast group having a few receivers since the length of an X-cast packet header is proportional to the number of the receivers belonging to the multicast group.

Method for transmitting data by using X-cast mode

Electronics and Telecommunications Research Institute


An apparatus for decontaminating ground areas where toxic chemicals are buried includes a plurality of spaced electrodes located in the ground and to which a voltage is applied for bringing about current flow. Power delivered to the ground volatilizes the chemicals that are then collected and directed to a gas treatment system. A preferred form of the invention employs high voltage arc discharge between the electrodes for heating a ground region to relatively high temperatures at relatively low power levels. Electrodes according to the present invention are provided with preferentially active lower portions between which current flows for the purpose of soil heating or for soil melting and vitrification. Promoting current flow below ground level avoids predominantly superficial treatment and increases electrode life.

A substantial number o ground contaminated areas exist, especially as the result of industrial disposal, which either threaten populated areas or which cannot be used for conventional purposes. Temporary storage methods and or/soil heating techniques have been proposed for treating contaminated soils containing dioxins, PCB'S, hydrocarbons and the like. Soil heating can drive off volatile substances but some methods of heating the soil, e.g. radio frequency heating, can be expensive or incapable of heating to the desired depth for removing large quantities of contaminants. In Brouns et al U.S. Pat. No. 4,376,598, in situ vitrification of soil is described wherein sufficient electrical energy is applied via electrodes in the ground for converting the soil itself to a conductive, i.e., liquid, state which is then allowed to harden into a vitrified mass. According to the latter method, non-volatile contaminant substances are stabilized as vitrified material, and volatile materials are driven off or pyrolyzed. However, electrical power requirements in melting the soil can be substantial.
For the purpose of carrying out complete in-situ vitrification of the soil, or in heating of the soil to temperatures for driving off contaminants, pairs of metal electrodes can be driven into the ground and connected to a source of power. Electrical discharge or current flow then tends to take place at the surface, whereby a relatively large area is liquefied or treated near ground level, but lower regions are less effectively penetrated. Lower melted soil resistance encountered near the surface during in-situ vitrification is believed to promote spreading of the treatment area adjacent the surface as compared with treatment to a greater depth. Subjecting the electrodes to high operating temperatures and corrosive environments for extended periods of time reduces electrode life. The electrodes can deteriorate rapidly as a result of emphasizing surface treatment because of oxidation as well as because of diffusion of materials into the electrodes, recrystallization of the electrode material, and/or metal reduction and pitting.

Apparatus for in situ heating and vitrification


A sealed battery includes an ultrasonic fusion process whereby layers of a positive electrode substrate exposed portion are ultrasonically fused to form a positive electrode fused portion at the positive electrode substrate exposed portion, and layers of a negative electrode substrate exposed portion are ultrasonically fused to form a negative electrode fused portion at the negative electrode substrate exposed portion; and an electrode body formation process whereby a high-energy beam is directed at the positive electrode fused portion to weld a positive electrode collector to the positive electrode fused portion, and a high-energy beam is directed at the negative electrode fused portion to weld a negative electrode collector to the negative electrode fused portion, thus forming an electrode body in which a positive electrode collector is welded to one end of the electrode group and a negative electrode collector is welded to the other end.

1. Technical Field
The present invention relates to a sealed battery such as a lithium ion battery or alkali battery, and more particularly to a method for manufacturing a sealed battery in which a metal case houses an electrode group that has a portion with the positive electrode substrates exposed formed at one end, and a portion with the negative electrode substrates exposed formed at the other end.
2. Related Art
In recent times, lithium secondary batteries with high energy density (Wh/kg) have been developed as power sources used in portable electronic and communication equipment such as mobile telephones, notebook personal computers and small-size video cameras, and as power sources for hybrid vehicles (HEVs) and electric vehicles (EVs). Among such batteries, particular attention is being focused on sealed batteries, which have high volumetric energy density (Wh/l).
Batteries of this kind, an example of which is disclosed in JP-A-7-326336, are manufactured in the following manner. First, positive electrode mixture containing positive electrode active material is applied to positive electrode substrates (normally aluminum foil) to make positive electrode plates, and negative electrode mixture containing negative electrode active material is applied to negative electrode substrates (normally copper foil) to make negative electrode plates. Then the positive electrode plates and negative electrode plates obtained are stacked alternately with separators interposed, forming a flattened electrode group, which is put into a flattened prismatic case, into which nonaqueous electrolyte is poured, resulting in a prismatic battery.
In the flattened electrode group manufactured in the manner described above, as shown in FIG. 4 for example, at one end there are formed positive electrode substrate exposed portions (portions where positive electrode mixture was not applied) 51a extending from positive electrode plates 51, and at the other end there are formed negative electrode substrate exposed portions (portions where negative electrode mixture was not applied) 52a extending from negative electrode plates 52. Subsequently, a positive electrode collecting lead (positive electrode collector) 53 is deposed at the bottom of the positive electrode substrate exposed portions 51a, and an ultrasonic welding device 60 composed of an ultrasonic horn 61 and an ultrasonic transmitter 62 is made ready. Then the ultrasonic horn 61 is pressed against the top of the positive electrode substrate exposed portions 51a, and by causing the ultrasonic transmitter 62 connected to the ultrasonic horn 61 to ultrasonically vibrate, the positive electrode collecting lead 53 is welded to the positive electrode substrate exposed portions 51a.
Also, a negative electrode collecting lead (negative electrode collector) 54 is deposed at the bottom of the negative electrode substrate exposed portions 52a, and the ultrasonic horn 61 is pressed against the top of the negative electrode substrate exposed portions 52a, and by causing the ultrasonic transmitter 62 connected to the ultrasonic horn 61 to ultrasonically vibrate, the negative electrode collecting lead 54 is welded to the negative electrode substrate exposed portions 52a. In this way, an electrode body 50 is obtained in which the positive electrode collecting lead 53 and negative electrode collecting lead 54 are welded to the two ends of the flattened electrode group. Then the electrode body 50 thus obtained is put inside a flattened prismatic case, after which the positive lead 53 is welded to a positive terminal portion 55 of a sealing plate, and the negative lead 54 to a negative terminal portion 56 thereof. Next, the sealing plate is welded to the case's mouth, a particular electrolyte is poured through a pour hole formed in the sealing plate, and the pour hole is sealed. Thereupon, manufacture of the prismatic battery is complete.
However, in the ultrasonic joining of the positive electrode substrate exposed portions 61a to the positive electrode collecting lead (positive electrode collector) 53, or the ultrasonic joining of the negative electrode substrate exposed portions 52a to the negative electrode collecting lead (negative electrode collector) 54, it has been necessary, in order to join integrally the layers of each substrate exposed portion to the respective collecting lead, to deliver high outputs of ultrasonic energy according as the number of substrates stacked increases.
But when, in order to render the battery high-output, it has been attempted to increase the number of electrode plates (substrates) stacked, and at the same time to satisfy the joining conditions, there has been the problem that excessive stress is exerted on the join portions and surrounding areas, which fracture due to insufficient strength of the electrode plates (substrates) constituting the electrode body. Particularly in the case of a lithium ion secondary battery, which generally uses aluminum foil and copper foil for the substrates, it has been problematic to obtain a completely joined state without causing damage to the electrode plates (substrates), because such materials are problematic to join.
Accordingly, it was proposed in JP-A-2001-38475 to join the collecting leads to the stack integrally by providing projections in the collecting leads and applying the ultrasonic vibration with the projections superposed over the stack. As FIG. 5 shows, in the method of joining to the stack that was proposed in JP-A-2001-38475, ultrasonic vibration is applied to a stack 71 having, formed at one end, positive electrode substrate exposed portions (portions where positive electrode mixture was not applied) 71a extending from the positive electrode plates, and formed at the other end, negative electrode substrate exposed portions (portions where negative electrode mixture was not applied) 71b extending from the negative electrode plates, and to collecting leads 73, 74 that are superposed over the substrate exposed portions 71a, 71b of the stack 71, so as to fuse the layers of each substrate exposed portion 71a, 71b and join the collecting leads 73 and 74 to the substrate exposed portions 71a and 71b respectively of the stack 71.
Each collecting lead 73, 74 has a protrusion 73a, 74a that projects from the portion that is superposed over the stack 71, and the ultrasonic vibration is applied with the protrusions 73a, 74a pushed against the substrate exposed portions 71a, 71b of the stack 71. In this way, by providing protrusions 73a, 74a on the surfaces 73b, 74b of the collecting leads 73, 74 that join with the substrate exposed portions 71a, 71b of the stack 71, it is contrived to have the ultrasonic amplitude energy of the ultrasonic joining method locally absorbed and diffused, and thus to raise to a high level the efficiency of the ultrasonic joining process. As a result, heat emission, fractures and "bite-in" by the horn in the stack 71's joining portions and surrounding areas are curbed, so that the joining surfaces are rendered high-quality.
However even when, as proposed in JP-A-2001-38475, it has been contrived to have the ultrasonic amplitude energy locally absorbed and diffused by providing protrusions 73a, 74a on the surfaces 73b, 74b of the collecting leads 73, 74 that join with the substrate exposed portions 71a, 71b of the stack 71, there have occurred problems such as rupturing of the electrode plates (substrates) constituting the electrode body, since excessive stress is exerted on the joining portions and surrounding areas. A readily conceivable alternative to the ultrasonic joining method in this case is the laser welding method, which however requires the use of a laser welding machine of high output in order to laser-weld the stack and collecting leads simultaneously, and therefore has resulted in problems such as described below.
Specifically, there has been the problem that since the welding is high-output, it is problematic to shorten the duration (takt time) of the welding process, and therefore the equipment costs increase. There has also been the problem that because it is problematic to shorten the takt time with high output, thermal effects are exerted on the separator and other parts present in the proximity of the welds. Further, there is danger that when the high-output laser beam is shone, welding spatter will be liable to occur, and welding dust could adhere to the electrode body or the interior of the processing equipment, resulting in internal short-circuits or other troubles.


A method and apparatus for testing radio-frequency antenna elements are disclosed. In one embodiment, the apparatus comprises: a frame having a platform to support an array of radio-frequency (RF) antenna elements of a flat panel antenna having antenna elements; a first antenna to transmit microwave energy to subsets of RF antenna elements of the segment and to receive reflected microwave energy from the subsets of RF antenna elements; a filter between the segment and the first antenna, the filter comprising an opening positioned over each of the subsets of RF antenna elements at different times to expose said each of the subsets of RF antenna elements to microwave energy transmitted by the first antenna; a second antenna to receive microwave energy transmitted though the subsets of RF antenna elements at the different times; a controller coupled to the subsets of RF antenna elements and to provide at least one stimulus or condition to the subsets of RF antenna elements; and an analyzer to provide stimulus to the subsets of RF antenna elements and to measure a characteristic of the array using one or both of the first antenna and second antenna.

Satellite communications involve transmission of microwaves. Such microwaves can have small wavelengths and be transmitted at high frequencies in the gigahertz (GHz) range. Antennas can produce focused beams of high-frequency microwaves that allow for point-to-point communications having broad bandwidth and high transmission rates. A measurement that can be used to determine if an antenna is properly functioning is a microwave frequency response. This is a quantitative measure of the output spectrum of the antenna in response to a stimulus or signal. It can provide a measure of the magnitude and phase of the output of the antenna as a function of frequency in comparison to the input stimulus or signal. Determining the microwave frequency response for an antenna is a useful performance measure for the antenna.
Some antenna apertures are constructed using radio-frequency (RF) antenna segments. These apertures have thousands of RF antenna elements that form an array. Each of the antenna elements is addressed individually to generate a desired RF wave. Testing such antenna elements to identify RF antenna elements operating incorrectly is difficult when the measured response is an average response of all the RF elements in a segment unless many elements (e.g., 2-4%, 100-200 elements, etc.) are deficient.


In some aspects of the invention, a load state detecting circuit is configured so that a threshold voltage for determining the size of a load of a DC-DC converter is set in the load state detecting circuit based on a maximum value of an output voltage of a power factor correction converter in an operation-stopped state of the power factor correction converter, so that the load state detecting circuit outputs an operation-enable signal when a feedback voltage indicating the size of the load of the DC-DC converter exceeds the threshold voltage. Thus, by way of some aspects of the invention, it is possible to provide a switching power supply device which can control enabling and stopping operation of a power factor correction converter reliably in accordance with a load state of a DC-DC converter obtaining a predetermined DC output voltage by switching an output voltage of the correction converter.

1. Field of the Invention
Embodiments of the invention relate to switching power supply devices.
2. Description of the Related Art
To secure stability and safety of a commercial power system, a switching power supply device which consumes power higher than 75 W is typically obligated to make power factor correction. Therefore, there has been recently proposed a switching power supply device equipped with a small-sized and highly efficient power factor correction converter (PFC) and a DC-DC converter which converts a DC voltage obtained from the power factor correction converter into a DC output voltage in accordance with specifications of a load (see, for example, Japanese patent publication no. JP-A-2007-288855). A quasi-resonant converter (QR) low in load imposed on a secondary-side rectifier diode is often used as this type DC-DC converter when the rated load is about 100 W.
FIG. 6 is a diagram of schematic configuration of a switching power supply device 1 equipped with a power factor correction converter 2 and a DC-DC converter (quasi-resonant converter) 3. In FIG. 6, the reference numeral 4 designates a rectifier circuit which rectifies AC power fed from a commercial power supply 5 and inputs the rectified AC power to the power factor correction converter 2, and the reference numeral 6 designates a noise filter which is interposed between the rectifier circuit 4 and the commercial power supply 5.
The power factor correction converter 2 schematically has an inductor L1 which is connected to the rectifier circuit 4, a switching element Q1 which forms a current path through the inductor L1 between the switching element Q1 and the rectifier circuit 4 when the switching element Q1 is on, and a diode D1 which forms a current path between the inductor L1 and an output capacitor C2 when the switching element Q1 is off. A control circuit IC1 controls a current flowing in the inductor L1 by driving the switching element Q1 on/off to thereby obtain a stabilized DC voltage Vb.
The reference signs R1 and R2 designate resistors which divide and detect the DC voltage Vb obtained by the output capacitor C2 and feed the detected DC voltage Vb back to the control circuit IC1. The reference sign R3 designates a shunt resistor for detecting a current (load current) flowing through the switching power supply device 1. Operation of the thus configured power factor correction converter 2 and effects and functions thereof have been introduced in detail, as in, for example, Japanese patent publication no. JP-A-2010-220330 etc.
The DC-DC converter (quasi-resonant converter) 3 schematically has a switching element Q2 which is connected in series with a primary winding P1 of an isolation transformer T to which the output (DC voltage Vb) of the power factor correction converter 2 is applied, a resonant capacitor C4 which is provided in parallel with the switching element Q2, and an output capacitor C5 which is connected to a secondary winding S1 of the isolation transformer T through a rectifier diode D2. A control circuit IC2 generates quasi-resonance between leakage inductance of the isolation transformer T and the resonant capacitor C4 by driving the switching element Q2 on/off to thereby generate a predetermined DC output voltage Vo.
The reference signs R5 and R6 designate resistors which divide and detect a DC output voltage Vo obtained by the output capacitor C5 and feed the detected DC output voltage Vo back to the control circuit IC2 through a feedback circuit FB. The reference sign R4 designates a shunt resistor for detecting a current flowing in the switching element Q2. The DC-DC converter 3 is configured to detect a ZCD voltage generated at an auxiliary winding P2 of the isolation transformer T to thereby control turn-on timing of the switching element Q2. Operation of the thus configured DC-DC converter (quasi-resonant converter) 3 and effects and functions thereof have been introduced in detail, as in, for example, Japanese patent publication no. JP-A-2011-15570 etc.
Incidentally, a load state detecting circuit 7 which detects a load state and outputs an operation-enable signal EN for the power factor correction converter 2 to enable or stop operation of the power factor correction converter 2 is provided in the DC-DC converter 3. An operation control circuit 8 which enables or stops operation of the power factor correction converter 2 in accordance with the operation-enable signal EN is provided in the power factor correction converter 2. The load state detecting circuit 7 eliminates the loss in the power factor correction converter 2 by stopping operation (working) of the power factor correction converter 2, for example, at a light load state in which the input electric power is lower than 75 W. In this manner, the load state detecting circuit 7 plays a role of improving the conversion efficiency of the power factor correction converter 2.
Such a load state detecting circuit 7 is configured, for example, as shown in FIG. 7 and is embedded in the control circuit IC2. The load state detecting circuit 7 has a comparator (light load detecting circuit) 7b which sets a flip-flop 7a by determining that the state is a light load state when the feedback voltage FB used for the on/off control of the switching element Q2 in the DC-DC converter 3 is lower than a preset first threshold voltage Vref1, and a comparator (normal load detecting circuit) 7c which resets the flip-flop 7a by determining that the state is a normal load state when the feedback voltage FB is larger than a second threshold voltage Vref2 (>Vref1) which will be described later. The output of the flip-flop 7a is delayed by means of a delay circuit 7d using charging/discharging of a capacitor Ct to make control to set/reset a flip-flop 7e. Thus, the operation-enable signal EN is obtained as a set output of the flip-flop 7e.
The delay circuit 7d has the capacitor Ct charged by a constant current source It, and a switching element S which is provided in parallel with the capacitor Ct. When the output of the flip-flop 7a is [H], the switching element S is operated to be off (shut off) so that the capacitor Ct is charged. When the output of the flip-flop 7a is [L], the switching element S is operated to be on (conductive) so that electric charge stored in the capacitor Ct is discharged through a resistor Rt. The delay circuit 7d further has a comparator 7f which resets the flip-flop 7e when a charged voltage Vd of the capacitor Ct is higher than a reference voltage Vth2, and a comparator 7g which sets the flip-flop 7e when the charged voltage Vd is lower than a reference voltage Vth1.
Operation of the load state detecting circuit 7 configured thus will be described briefly as follows. When a load Po becomes light so that the feedback voltage FB decreases accordingly to be lower than the first threshold voltage Vref1 as in a waveform diagram of the operation of the load state detecting circuit 7 shown in FIG. 8, the flip-flop 7a is set. Then, the switching element S of the delay circuit 7d is turned off due to the setting of the flip-flop 7a so that the capacitor Ct is charged with charging characteristic determined based on the capacitance of the capacitor Ct and a constant current fed from the constant current source It. When the charged voltage Vd of the capacitor Ct is higher than the reference voltage Vth2 after the passage of a predetermined time Td-off, the flip-flop 7e is reset so that the operation-enable signal EN turns to [L] to thereby make control to stop the operation of the power factor correction converter 2.
When the operation (working) of the power factor correction converter 2 is stopped in this manner, the output voltage Vb of the power factor correction converter 2 is reduced gradually and then settled down to a voltage determined based on an AC voltage Vac applied from the commercial power supply 5. The output voltage Vb of the power factor correction converter 2 on this occasion changes periodically in a cycle based on rectification of the AC voltage Vac and with a change width determined based on the size of the load Po and the capacitance of the output capacitor C1.
When the load Po becomes heavy in a state where operation of the power factor correction converter 2 is stopped, the feedback voltage FB in the DC-DC converter 3 becomes high in accordance with the size of the load Po. When the feedback voltage FB is higher than the second threshold voltage Vref2, the flip-flop 7a is reset so that electric charge stored in the capacitor Ct of the delay circuit 7d is discharged. When the charged voltage Vd of the capacitor Ct is lower than the reference voltage Vth1 after the passage of a predetermined time Td-on, the flip-flop 7e is set so that the operation-enable signal EN turns to [H]. As a result, operation of the power factor correction converter 2 is enabled so that working of the power factor correction converter 2 is restarted.
In a state where operation of the power factor correction converter 2 is stopped, the DC voltage Vb obtained by the output capacitor C2 of the power factor correction converter 2 changes periodically with a change width determined based on the size of the load Po and the capacitance of the output capacitor C1 as described above. Therefore, because attention has been heretofore entirely paid to the fact that a bottom voltage Vb-min of the DC voltage Vb changes dependently on the size of the load Po, the second threshold voltage Vref2 to be compared with the feedback voltage FB has been set based on the minimum value (bottom voltage Vb-min) of the DC voltage Vb.
However, when the AC voltage Vac is lower than a defined voltage (for example, 100 V) or when the capacitance of the output capacitor C1 is low, the feedback voltage FB increases as the aforementioned DC voltage Vb decreases even if there is no change in the size of the load Po. Then, there may arise a situation that the feedback voltage FB exceeds the second threshold voltage Vref2 set based on the minimum value (bottom voltage Vb-min) of the DC voltage Vb as described above and this situation may be detected as an increase of the load Po by mistake. For this reason, there is a problem that the increase of the feedback voltage FB caused by the increase of the load Po cannot be detected reliably.
As shown in FIG. 9, for explaining the relation between the feedback voltage FB and the DC voltage Vb depending on the AC voltage Vac when, for example, the load Po is 30 W (fixed), the feedback voltage FB increases as the DC voltage Vb decreases. When, for example, the output voltage Vb decreases to be not higher than about 85 Vdc, the feedback voltage FB always exceeds the second threshold voltage Vref2 set as described above though the load Po is fixed to a light load state as shown in FIG. 9.
Then, the comparator 7c detects this state, resets the flip-flop 7a, and sets the flip-flop 7e as described above, so that the operation-enable signal EN turns to [H]. As a result, the power factor correction converter 2 shifts to an operating state in accordance with the operation-enable signal EN even if there is no change in the size of the load Po. In other words, when the DC voltage Vb decreases with the decrease of the AC voltage Vac, there arises such a disadvantage that it is impossible to make the originally intended control in such a manner that the increase of the load Po is detected in an operation-stopped state of the power factor correction converter 2 to thereby restart operation of the power factor correction converter 2. Thus, as described above, there is a need in the art for an improved switching power supply device.


A semiconductor memory includes a plurality of main bit lines led to sense amplifiers and arranged in a row, direction, a first group of sub bit lines interposed between the memory banks and connected to the main bit lines through a first group of selection transistors, and a second group of sub bit lines interposed between the memory banks and the first group of sub bit lines and connected to a common ground line through a second group of selection transistors.

1. Field of the Invention
The invention relates in general to nonvolatile semiconductor memory devices and more particularly to a memory employing flat-type memory cells.
2. Description of the Prior Art
Read only memories, generally referred to as nonvolatile memories, typically have memory cell arrangements which are classified as NOR-typed or NAND-typed cell arrays in accordance with logic circuit definitions. The NOR-typed cell array has the advantage of obtaining efficient current drive capability, but it causes a shortage of space by its cell size. The advantage and disadvantages are reversed in the NAND-typed cell array. Due to the relative strength and weakness of the two cell array types, a flat-type cell array has been proposed as a successful solution for the read only memories. The flat-type cell array is, in digital logic standard, a kind of NOR-typed arrangement.
Nonvolatile memories having the flat-type memory cell array have been disclosed in several articles, e.g., "12-Mb ROM Design Using Bank Select Architecture" (88 SYMPOSIUM ON VLSI CIRCUITS, VI-7, pp.85-86). The architecture of the memory cell array of the preceding article is shown in FIG. 1, wherein memory cell blocks are selected by activating selection signals SOm (for odd columns) and SEm (for even columns) where SOm-1 and SEm+1 conduct for adjacent memory blocks. Bit lines are classified into main bit line MBi-1 to MBi+2 and sub bit lines SB2i-3 to SB2i+4. Every two sub bit lines are subjected to one main bit line, and main bit lines MBi-1 and MBi+1 act as virtual ground lines.
During a read operation, in order to select a memory cell, for example, RC13, power supply voltage Vcc is applied to word line WL1 and ground voltage Vss is applied to other word lines WL2 to WLn. Main bit line MBi-1 is connected to Vss while main bit line MBi is being activated. The discharging current at the forced condition flows starting from main bit line MBi, and then through odd column selection transistor T05, sub bit line SB2i-1, memory cell RC14, even column selection transistor TE5, main bit line MBi-1, column gate transistor TY1, ground selection transistor TG1 and Vss, and in that order. Sense amplifier, connected to MBi through column gate transistor TY2, generates a data bit "1" or "0" from detecting a voltage level on MBi which is determined by a threshold voltage of selected memory cell RC13.
Assuming that when a read operation is conducted for memory cell RCn2 with a threshold voltage VT ranged from 0V to Vcc (0<VT<Vcc; hereinafter, such a memory cell may be called "on-cell"), MBi is pulled down and then sense amplifier SAx reads "0". The discharging current at this time flows, as shown with the broken line in FIG. 1, starting from main bit line MBi, odd column selection transistor T05, sub bit line SB2i-1, memory cell RCn2, odd column selection transistor T03, main bit line MBi-1, column gate transistor TY1, ground selection transistor TG1 and Vss, in that order.
Since sources and drains of the adjacent memory cells are connected to diffusion regions which are formed in a semiconductor bulk (or substrate), a voltage drop, caused by conductive on-cells, is substantially made up throughout the resistance in diffusion regions by which the sub bit line is constructed. Thus, the amount of the current flowing through the on-cell (e.g., RCn2) is delimited by the diffusion resistance involved in the source and drain regions as well as the sub bit lines. A more detailed description of the current where a piece of information is read out from memory cell RCn2 is provided with reference to FIG. 2. In this case, as shown in FIG. 2, the aforementioned current meets resistance r2 of a partial diffusion region which connects odd column selection transistor T05 to memory cell RCn2 and resistance r1 of a partial diffusion region which connects memory cell RCn2 to odd column selection transistor T03.
While, assuming that when another read operation is being conducted for memory cell RC12 with a threshold voltage larger than Vcc (VT>Vcc; hereinafter, such a memory cell may be called as "off-cell"), main bit line MBi must be pulled up to a high level of voltage and thereby sense amplifier SAx must detect "1" from the main bit line MBi. But, if other memory cells RC13 to RC17 connected to word line WL1 which activates the memory cell RC12 are held up in an on-cell, the current from sense amplifier SAx flows into adjacent main bit lines (e.g., MBi+1, MBi+2, . . . ) through the adjacent memory cells connected to W11 and odd column selection transistors responding to odd column selection signal SOm, while there is no current path towards the main bit line MBi-1 due to the nonconductive memory cell RC12. The unwanted current entrance into the adjacent bit lines makes it difficult for the main bit line MBi to retain the high level, so that a read-out time for data bit "1" becomes longer in proportion to the current amount induced thereby.
The current degradation due to the parasitic resistances of the diffusion regions has been considered in U.S. Pat. No. 5,280,442 (hereinafter the '442 patent) which powers the degradation rate of sensing current. FIG. 3 illustrates the architecture of memory cell array disclosed in the '442 patent, using the same dimensions of FIG. 1. In FIG. 3, memory blocks are arranged in the row direction, each memory block being numbered with odd and even numbers therein, and sub bit lines SB2i-3 to SB2i+4 are interposed between the memory blocks. Each sub bit line is connected in common to memory cells of adjacent memory blocks, and main bit lines MBi-1 to MBi+2, arranged in parallel with the sub bit lines, are positioned in columns by groups of two. One main bit line is connected to the three sub bit lines, such that main bit line Mbi-1 is connected to SB2i-3 through odd column selection transistor TOi-1 at node NOi-1, to SB2i-1 through TEi at node NEi-1 and directly to SB2i-2. When memory cell RCn2 of FIG. 3 is selected, the current path is formed, as shown in FIG. 3, through main bit line MBi, odd column selection transistor TOi, sub bit line SB2i-1, memory cell RCn2, main bit line MBi-1 and Vss, and in this order.
FIG. 4 shows a more advanced configuration which provides a better current drivability compared to the configuration shown in FIG. 2, in which the sensing current flows through two transistors and parasitic resistances. However, the circuit architecture as shown in FIG. 3 has at least a bit line capacitance value of at least four times that of the bit line capacitance value in FIG. 1, at a node (e.g., NOi) at which the main bit line and sub bit line are coupled to each other (note that main bit line of FIG. 1 is just connected to source and drain diffusion regions between cell transistors). A main bit line is connected to a sub bit line coupled to source and drain diffusion regions between adjacent cell transistors, and further to such two sub bit lines. Therefore, assuming that memory cell RC12 is selected and is on off-cell, when main bit line MBi goes to a high level and thereafter the data bit is read out as "1" from a sense amplifier corresponding to the main bit line MBi, the increased capacitance engaged in the main bit line causes the read-out time for "1" to be longer than that of the arrangement shown in FIG. 1.
Even in the architecture shown in FIG. 3, as the architecture shown in FIG. 1, unwanted leak current may flow toward a non selected adjacent main bit line through memory cell transistors and odd column selection transistors during a read operation for an on-cell.
With the circuit arrangements of the cell arrays depicted either in FIG. 1 or in FIG. 3, the enhancement the read-out speed for data (particularly for "1") stored in memory cells is still under development for the numerous reasons mentioned heretofore, and the above mentioned problems are also applicable to high density and fast nonvolatile memories.


A carrying device includes a rack and a platform. The platform that loads goods, is moveably arranged on a handle of the rack. The carrying device further includes a sensor that detects the goods loaded on the platform, a motor that is connected to the platform, and a controlling unit that controls the motor drive the platform to move relative to the handle with a predetermined distance, according to whether the sensor detects the goods loaded on the platform.

1. Technical Field
Embodiments of the present disclosure relate to a device control technology, and more particularly, to a carrying device and a method of controlling a movement direction of the carrying device.
2. Description of Related Art
A carrying device, such as a cart, can be used to load goods. A typical carrying device has a platform capable of moving upwards and downwards for facilitating loading goods placed thereon. However, the upwards and downwards movement of the platform is usually implemented by manual operations, which is not convenient. Therefore, there is room for improving the control of the carrying device.


An exemplary system includes a first user device associated with a first user and a second user device associated with a second user. The first user device is configured to detect a request input by the first user to share media content being processed by the user device with the second user, generate an invite message including data configured to be utilized by the second user device to access the media content, and send the invite message to the second user device by way of a messaging service. The second user device is configured to receive the invite message from the first user device by way of the messaging service, determine that the invite message is associated with a media sharing service, and perform one or more operations to facilitate access to the media content by the second user. Corresponding methods, systems, and apparatus are also disclosed.

As digital media, data communication, and electronic device technologies have advanced, the sharing of media content between users has become commonplace. As an example, a user of a mobile device such as a mobile phone may capture video footage of a scene and upload the video to a website (e.g., YouTube, Facebook, a blog, etc.) for access by users of web-enabled electronic devices. When a user accesses the uploaded video, the user is able to view a playback of the previously captured scene.
However, there remains room to improve upon conventional media sharing technologies. For example, conventional technologies for sharing media content between users are limited to specific types of electronic devices, communication networks, digital media formats, and/or configurations (e.g., point-to-point configurations). In some cases, certain electronic devices (e.g., certain set-top box and/or other in-home consumer electronic devices) that are well-equipped to access and play back media content are not equipped nor positioned to access and/or use conventional technologies to participate in sharing of media content such as user-generated live video, for example.

Systems and methods for sharing media content between users


An apparatus for producing a purified aqueous hydrogen peroxide solution. The apparatus includes at least one purifier tower packed with an ion exchange resin, a chelate resin or an adsorption resin for receiving a charged aqueous hydrogen peroxide solution containing impurities so as to effect contact thereof with the ion exchange resin, chelate resin or adsorption resin, thereby purifying the charged aqueous hydrogen peroxide solution, which apparatus further comprises a feed pump of given output capable of causing the charged aqueous hydrogen peroxide solution to flow to the purifier tower, a flow sensor capable of sensing a flow rate of charged aqueous hydrogen peroxide solution being fed to the purifier tower by means of the feed pump, and a flow control unit capable of controlling the output of the feed pump on the basis of a detection result of the flow sensor so as to maintain the flow of charged aqueous hydrogen peroxide solution being fed to the purifier tower at a constant rate.

An aqueous hydrogen peroxide solution is widely used in many fields, for example, for bleaching paper and pulp and as a component in chemical polishing fluids. In recent years, the aqueous hydrogen peroxide solution has increasingly been used in the electronic industry, for example, as a cleaning agent for silicon wafers and as a cleaning agent in production processes of semiconductors. Accordingly, there is a demand for an aqueous hydrogen peroxide solution of enhanced quality in purity as obtained by minimizing the content of various impurities in the aqueous hydrogen peroxide solution.
Generally, hydrogen peroxide is now produced exclusively by the anthraquinone process. In the anthraquinone process, first, a derivative of anthraquinone, such as a 2-alkylanthraquinone, is hydrogenated into anthrahydroquinone in the presence of a hydrogenation catalyst in a water-insoluble solvent. Subsequently, the catalyst is removed, and the reaction product is oxidized with air. Thus, not only is the original 2-alkylanthraquinone regenerated but also hydrogen peroxide is produced at the same time. The produced hydrogen peroxide is extracted from the oxidation product with water to thereby obtain an aqueous solution containing hydrogen peroxide. This process is generally known as the anthraquinone autoxidation process. The aqueous hydrogen peroxide solution produced by the anthraquinone autoxidation process contains inorganic ion/compound impurities, such as Al, Fe, Cr, Na and Si, attributed to, for example, the materials constituting the apparatus. Therefore, the aqueous hydrogen peroxide solution is subjected to purification operation for removing such impurities to thereby attain a high purity in accordance with the required quality in particular use.
Especially in the electronic industry, an extremely high purity is required for the aqueous hydrogen peroxide solution. It is required that, in the aqueous hydrogen peroxide solution, the content of organic impurities be not greater than 10 ppm and the content of metal ion impurities be not greater than 1 ppb. For the removal of impurities from the aqueous hydrogen peroxide solution, it is generally known to employ an ion exchange resin, a chelate resin, an adsorption resin or the like. When the removal of impurities is carried out on an industrial scale with the use of such a resin, there is commonly employed the continuous liquid pass method (tower process) which ensures high operation efficiency and high removing efficiency.
The purification of aqueous hydrogen peroxide solution by the tower process involves such a problem that bubbles are formed by autolysis of hydrogen peroxide, which is a property peculiar to hydrogen peroxide, and the bubbles stick to resin circumstances to thereby lower purification efficiency, i.e., impurity removing efficiency.
As a means for solving this problem, for example, Japanese Patent Laid-open Publication No. 9(1997)-77504 discloses a process in-which an upper part of an ion exchange resin tower is pressurized so as to increase the solubility of bubbles formed by autolysis of hydrogen peroxide, thereby eliminating bubbles from the purifier tower.
However, the process disclosed in Japanese Patent Laid-open Publication No. 9(1997)-77504 has a drawback in that the content of metal ion impurities in purified aqueous hydrogen peroxide solution is 1 ppb, which is not necessarily satisfactory level, and that quality reproducibility is poor. Moreover, when the operation time is prolonged, it may occur that bubbles are accumulated in the ion exchange resin tower with the result that the area of contact between ion exchange resin and aqueous hydrogen peroxide solution is decreased, or the complete adsorption band (part where the adsorption of impurity ions has been completed) or exchange band (part where ion exchange is being performed) of ion exchange resin is disordered. Consequently, satisfactory removal of impurities may be inhibited, and further the passing of aqueous hydrogen peroxide solution may be hindered to thereby bring about problems such as pressurization and temperature rise within the ion exchange resin tower.
In these circumstances, the inventors have made extensive and intensive studies with a view toward solving the above problems. As a result, it has been found that, when the aqueous hydrogen peroxide solution is purified by controlling the output of a feed pump for charged aqueous hydrogen peroxide solution in cooperation with a flow sensor capable of sensing a flow rate of charged aqueous hydrogen peroxide solution being fed to a purifier tower so as to bring the charged aqueous hydrogen peroxide solution into contact with an ion exchange resin while maintaining the flow of charged aqueous hydrogen peroxide solution at a constant rate, the impurities of aqueous hydrogen peroxide solution can be removed to the order of ppt (parts per 1012). It has also been found that, in this purification process, not only is the reproducibility of impurity removing level very high but also the pressurization and temperature rise during purification can be avoided to thereby realize a safe purification of aqueous hydrogen peroxide solution. The present invention has been completed on the basis of these findings.
When the aqueous hydrogen peroxide solution is purified by bringing the aqueous hydrogen peroxide solution into contact with an ion exchange resin, a chelate resin or an adsorption resin while maintaining the flow of aqueous hydrogen peroxide solution being fed to the purifier tower at a constant rate according to the present invention, sticking of bubbles to the ion exchange resin, etc. within the purifier tower can be suppressed. Further, in this purification process, not only can the leaving of bubbles in the purifier tower be avoided but also disordering of the complete adsorption band or ion exchange band can be suppressed. Still further, in this purification process, the aqueous hydrogen peroxide solution can be easily passed through the purifier tower. Thus, a purification efficiency of aqueous hydrogen peroxide solution is high.
It is an object of the present invention to provide an apparatus for producing a purified aqueous hydrogen peroxide solution, which process is free from any disordering of ion exchange band during purification, free from bubbles remaining in a purifier tower and free from any pressurization or temperature rise within the purifier tower to thereby enable effecting a safe and efficient contract of aqueous hydrogen peroxide solution with an ion exchange resin or the like.

Apparatus for producing purified aqueous hydrogen peroxide solution


A method of processing groups of envelopes that have contents contained therein. The method prints information on at least one side of an envelope and then separates that side from the rest of the envelope. The contents of each envelope are then placed adjacent to the separated side and assembled in series with other separated sides and contents. When the separated sides and contents are assembled, the separated sides act as a boundary between other envelopes, thus preventing the contents of the envelopes from becoming commingled with contents from other envelopes. The printed information on the separated side of the envelope provides an audit trail for subsequent processing.

In the field of automatic teller machines such as those found at banks, deposits are often made using a standard envelope. The envelope can contain a single check for deposit, multiple checks for deposit, deposit slips, cash currency, letters to the bank and a wide variety of printed and other matter. When a deposit envelope is inserted into an ATM, the ATM usually prints on the envelope a transaction number, the ATM's identification number, the receipt time and date, as well as account information. Afterwards, the envelope is directed to a bin where hundreds of transactions are stored. The envelopes are then subsequently bagged and brought to a processing station.
In traditional bulk mail processing, large quantities of envelopes can be processed using automated means, as exemplified in Stevens U.S. Pat. Nos. 5,518,121, 5,464,099, 5,460,273, Simjian U.S. Pat. Nos. 3,295,139, and 3,266,626. These automated means are capable of, among others, opening the envelopes, extracting their contents and then arranging the contents for further processing. However, due to the extremely wide variety of materials that can be placed in ATM deposit envelopes, the aforementioned automated means are not efficient. In addition, the aforementioned means are not well suited where it would be preferable to trace ATM envelope contents back to the ATM machine where it was deposited. This is because they do not include means for keeping an identification number or numbers with the contents of the envelopes as they are moved along the processing stream. Tracing ATM envelope contents would be extremely important in bank transactions that are monitored by the Federal and State government, which must meet certain standards. Therefore, ATM envelope processing has mostly been accomplished by hand and not by automated means, thereby increasing the cost associated with such processing.
What is desired therefore is an efficient automated method for processing ATM envelopes that can reduce labor expense and increase audit control.

Method for the automated processing of ATM envelopes


Software code of a software system (e.g., a software stack) may be verified as conforming to a specification. A high-level language implementation of the software system may be compiled using a compiler to create an assembly language implementation. A high-level specification corresponding to the software system may be translated to a low-level specification. A verifier may verify that the assembly language implementation functionally conforms to properties described in the low-level specification. In this way, the software system (e.g., a complete software system that includes an operating system, device driver(s), a software library, and one or more applications) may be verified at a low level (e.g., assembly language level).

When a user submits personal data to a remote service (e.g., cloud-based service), there is no guarantee that the personal data will remain secure or even that the service will produce correct results. At best, the service may have a privacy policy and limit the liability of the service in case of a data breach. However, recent headlines have provided examples of how vulnerability in an operating system, a library, or an application (e.g., software application) may enable personal data to be accessed.

Automated verification of a software system


An apparatus and a method is provided for verifying the setup of a current computer in need of repair, parsing and updating a previously created activity log file to provide usable steps that refer to the appropriate configuration settings for the computer being repaired. The method includes obtaining an indication of a problem on a remote computer, reviewing stored log files to determine if an old log file associated with the problem exists and if the old log file does not exist, creating a new log file to store steps associated with repair operations. The method also includes if the old log file exists, retrieving the old log file and obtaining the remote computer configurations, parsing the old log file to identify references to configuration settings and comparing the configuration settings in the old log file with the remote computer configuration. The method further includes updating at least one configuration setting of the old log file to reflect the remote computer configuration, if the at least one configuration setting in the old log file is different from the remote computer configuration and executing steps in the old log file to solve the problem on the remote computer.

1. Field of the Invention
The present invention is directed to an apparatus and method for verifying the configuration of a computer and for customizing a previously created log activity file, including steps implemented during repair of another computer, to reflect usable steps with appropriate references to correct locations and/or components on the computer.
2. Description of the Related Art
In order to repair a computer located at a remote site, help desk support agents usually log into the computer remotely and take over operations of the computer. When help desk support agents remotely take over operations of the computer, various steps may be implemented. These steps may be monitored and logged into an activity file by an underlying event detector. Such logged activities are associated with the configuration of the computer being repaired. For example, the logged activities may reference an application in a specific location, as determined based on the current configuration of the computer. The logged activity file may be used as a later time by other help desk support agents trying to resolve similar problems. The logged activity file may also be used by customers, as a self-help tool, to resolve computer problems without support from help desk support agents.
One problem agents and customers encounter when reusing associated logged activity file is that the logged activities may not be compatible with the configuration settings on the computer being repaired by the agents or customers. It is well known to those skilled in the art that computer configurations across different computers, or even on the same computer at different points, may vary significantly. For example, various references in the logged activity file to specific computer applications, icons and/or shortcuts may not be available on the computer being repaired. In another example, various references in the logged activity file to computer applications, icons and/or shortcuts may not match the current configuration on the computer being repaired. Thus, such activity logs cannot be readily re-used by agents and/or customers unless a match is made between the current configuration on the computer being repaired and those listed in the logged activity file.
Requiring agents and/or customers to match the current configuration on the computer being repaired with those listed in the logged activity file not only takes time, it may also result in a fruitless effort. For example, an icon referred to in the logged activity file may not exist on the computer being repaired. In another example, although the icon may be available on the computer being repaired, the icon may be stored under a different name.

Customization and reuse of logged agent activity during remote take over help session

International Business Machines Corporation


The present invention provides an Active Matrix Organic Light Emitting Diode (AMOLED) pixel unit circuit, a display panel and an electronic product for integrating a touch screen circuit into the AMOLED pixel unit circuit and producing an AMOLED display panel having the functionality of a touch screen. The AMOLED pixel unit circuit comprises a driving module, configured to amplify a sensing signal generated by a touch sensing module, output the sensing signal through a sensing signal output module, and drive a light emitting module; the light emitting control module, configured to control the light emitting module to emit light; a threshold compensation module, configured to compensate a threshold voltage of the driving module; the touch sensing module, configured to generate the sensing signal and output the sensing signal to the driving module; and the sensing signal output module, configured to output the sensing signal amplified by the driving module.

The technology of Touch Screen Panel (TSP) in Cell is to manufacture a TSP sensor and a driving circuit thereof on an array substrate using an array process. The TSP sensor is integrated with a liquid crystal cell of a Liquid Crystal Display (LCD) panel so that the product is light and thin and has versatile functionalities. Therefore, the reliability of the TSP is effectively improved.
FIG. 1 (a) and FIG. 1 (b) shows a basic light sensitive TSP in Cell circuit in prior art. As shown in FIG. 1(a), the sensor senses light using a photodiode D1 and generates electric leakage to detect a touch signal. As shown in FIG. 1(b), the sensor senses light using a sensitive capacitor C2 and detects the touch signal by the coupling of the sensitive capacitor and the change of the capacitor. Thin-Film Transistor (TFT) T1 functions as an amplifying transistor to amplify the voltage change across D1 after detecting the touch signal, increase the capability to driving the output of the TSP in Cell circuit, so that an external readout circuit for TSP may correctly read out the detection result.
Compared with a traditional liquid crystal panel, an Active Matrix Organic Light Emitting Diode (AMOLED) has characteristics of rapider response, higher contrast ratio, and wider angle of view or the like. Pixels of AMOLED are driven to emit light and display by a related driving circuit on the array substrate. FIG. 2 is a diagram showing an embodiment of the AMOLED pixel unit circuit.
If the TSP in cell circuit shown in FIG. 1 (a) or FIG. 1 (b) is simply integrated into the AMOLED pixel unit circuit as shown in FIG. 2, except for the existing five TFTs and two capacitors, three TFTs and one capacitor is required to be added, and except for the existing three control signals and two power sources, three control signals are required to be added to the control signal lines. However, the pixels of the AMOLED do not have enough space for the addition of these TFTs and signal lines. Therefore, in the prior art, the TSP in Cell circuit cannot be integrated into the AMOLED pixel unit circuit.

Active matrix organic light emitting diode pixel unit circuit, display panel and electronic product

CHENGDU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.