Provided is a method of reliably reducing power consumption of a computer, while promoting prompt compilation of a source code and execution of an output code. The method according to this invention includes the steps of: reading a code which is preset and analyzing an amount of operation of the CPU and an access amount with respect to the cache memory based on the code; obtaining an execution rate of the CPU and an access rate with respect to the cache memory based on the amount of operation and the access amount; determining an area in which the access rate with respect to the cache memory is higher than the execution rate of the CPU, based on the code; adding a code for enabling the power consumption reduction function to the area; and generating an execution code executable on the computer, based on the code.

This invention relates to a technique for efficiently operating a plurality of CPUs, in particular, a compiler which generates a program for performing a parallel processing.
In recent years, along with microfabrication of a semiconductor device due to the advancement of a semiconductor manufacturing technology, it has become possible to integrate an enormous number of transistors. The advancement of the semiconductor manufacturing technology has also raised the clock frequency at which a CPU (processor) operates. However, power consumption of the CPU and power consumption during standby due to leakage currents have also been increased. Therefore, studies have been made to improve a processing capability of a CPU with a minimum consumption of power.
In particular, in a case of, for example, a large-scale parallel computer in which several tens and hundreds of CPUs are used to perform a parallel processing, a considerable amount of electric power is required. In addition, it is also necessary to deal with a large amount of heat radiated from the computers, the heat being equivalent to the electric power.
In order to reduce the power consumption of a CPU, a CPU having a power saving mechanism (power consumption reduction function) capable of dynamically varying a clock frequency and an operating voltage of the CPU is becoming popular. According to a CPU of this type, the clock frequency and the operating voltage are shifted to a minimum value during idle time, while the clock frequency and the operating voltage are shifted to a maximum value only at a heavy load. There has also been known another CPU in which the clock frequency and the operating voltage are shifted in stages according to load conditions. The shifting of the clock frequency and the operating voltage can be controlled based on a predetermined command issued with respect to the CPU from an OS or from an application through an OS.
As regards a program executed on a computer including a CPU having the above-mentioned power saving mechanism, there has been known a technique of embedding a code for functioning the power saving mechanism into an execution code obtained through compilation in which a source code is converted into the execution code (see, for example, JP 2003-44289 A).
According to the technique, first, a user program (source code) to which a parameter has been preset is inputted into a compiler, and the compiler outputs a provisional code (assembler). Next, the provisional code is executed and the execution state is stored as a profile.
Then, the user program is compiled with reference to the profile obtained by the execution of the provisional code, to thereby generate an output code as intended. The compiler refers to the profile so that the compiler can generate an optimal output code (load module) with consideration given to heat to be radiated from the CPU, based on the use state of the resource of the computer.

Method and program for generating execution code for performing parallel processing


In an apparatus including a joint test action group (JTAG) authentication device, and a JTAG authentication method using the apparatus, the apparatus includes a joint test action group (JTAG) authentication device, the apparatus comprising a JTAG access circuit that determines whether to access a JTAG-compliant device according to a predetermined protocol that governs the JTAG-compliant device and the apparatus, wherein the JTAG access circuit at least one of inactivates at least one of inner bus lines and inner units and activates the at least one of the inner bus lines and the inner units according to whether the JTAG-compliant device is accessed.

1. Field
The inventive concept relates to an apparatus that determines whether the apparatus should access a joint test action group (JTAG) device, and more particularly, to an apparatus including a JTAG authentication device which is capable of performing authentication using a JTAG access circuit without correcting a JTAG controller mounted in the apparatus, and a method of authenticating the JTAG-compliant device using the apparatus.
2. Description of Related Art
A JTAG-compliant device can be used as a debugger when designing an embedded system. The JTAG-compliant device can check data stored in a memory of a device, and/or check input/output data, and/or check the states of functional blocks which are to be debugged, via a test access port (TAP) installed in the device. However, the JTAG-compliant device may also be used to extract important data of the device, sometimes which for illicit or malicious purposes.
In addition, there is trouble when a TAP controller is corrected in order to overcome the abovementioned problems. For example, in the case of a device that uses a core such as Advanced RISC Machines (ARM), a designer of the device may consider correcting inner circuits of the core. However, correcting such circuits is risky. Moreover, if there is no authority to correct the core, correction may not be possible.
Accordingly, a new authentication circuit needs to be added while obviating the need to correct the circuits.

Apparatus and method of authenticating joint test action group (JTAG)


Disclosed are methods and compositions for repolarizing a tumor associated macrophage (TAM) from M2 to M1 comprising administering to a subject in need thereof an effective dose of a compound comprising a dextran backbone and one or more CD206 targeting moieties conjugated thereto. In certain aspects, the compound further comprises a therapeutic agent selected from: paclitaxel, gemcitabine, lapatinib, and doxorubicin. In further aspect, the therapeutic agent comprises a chelator and at least one metal ion. In certain implementations, the at least one metal ion comprises at least one Cu(II) ions.

Cancer is the second leading cause of deaths in the USA, accounting for nearly one of every four deaths. Cancer is characterized by the unregulated growth and cell division of cancer cells. However, cancers benefit enormously from chronic maladaptive immune responses to tumors and macrophages are a key mediator of that maladaptive response. In general, macrophages respond to various stimuli in their local microenvironment by altering their expression patterns for many genes, potentially hundreds. Such phenotypically altered macrophages are said to be activated macrophages. Depending upon which stimuli a macrophage is responding to, a wide range of activated phenotypic states can be attained. Among those genes that are differentially expressed upon macrophage activation are cell surface markers (such as the macrophage mannose receptor, CD206) and various cytokines, enzymatic pathways leading to the generation of reactive oxygen species (ROS), and other signaling molecules that can regulate the behavior of other components of the immune system, such as T lymphocytes (T-cells). When first described, activated macrophages were divided into two phenotypes: classically activated, called M1, which is highly proinflammatory, and alternatively activated, called M2, which is immunosuppressive and promotes wound healing. It is now understood that a strictly dichotomous classification of activated macrophage phenotypes is overly simplistic and does not represent the true plasticity of macrophage responses to stimuli from their microenvironments; however, the concept that activated macrophages can influence a local immune response by being either proinflammatory (M1-like) or immunosuppressive (M2-like) continues to have utility when describing the role of macrophages in various pathological states.
Tumor associated macrophages (TAMs) are abundant in tumors and highly significant contributors to the maladaptive immune response associated with cancer. While both M1-like and M2-like TAMs are known, the large majority of TAMs residing in or near established tumors are immunosuppressive, M2-like activated macrophages. Importantly, these M2-like TAMs are frequently identified in immunohistochemical evaluations of tumors by their high expression of CD206 (i.e. are CD206+). M2-like TAMs suppress T-cells by expressing IL-10, TGF-β, and PD-L1, and promote tumor angiogenesis and metastases.
There is a need in the art for compositions and methods that induce the phenotypic change of the M2-like TAMs to M1-like TAMs in order to treat cancer with greater efficacy and lower toxicity.

Compositions and methods for altering macrophage phenotype


An input device includes a supporting unit which is provided with first shafts, and a rotating unit is connected to the first shafts in a rotatable manner. In addition, an operating unit is provided with second shafts, and the rotating unit is also connected to the second shafts in a rotatable manner. When the operating unit is at an operating position, it is closely attached to an input unit provided on the front surface of a mobile phone. When the operating unit is at a stored position, the second shafts of the operating unit is moved from the front side of a mobile phone to the back side thereof, so that the operating unit is closely attached to the back surface of the mobile phone.

1. Field of the Invention
The present invention relates to an input device which is connected to a mobile communication terminal such as a mobile phone and with which characters can be input easily.
2. Description of the Related Art
In mobile terminals such as mobile phones and personal digital assistants (PDAs), characters are usually input by the following methods. In mobile phones, characters are input by using a numeric keypad (a group of keys including number keys and keys for the four basic operators). Japanese characters, for example, are input in the form of kana characters (Japanese syllabic alphabet, and there are two types: hiragana and katakana) or romaji (writing system based on Roman characters used to represent Japanese text). In PDAs, characters are input by writing each character on a liquid crystal display with a pen-type input device. In addition, keyboard-type input devices with a plurality of keys arranged thereon are sold separately, and are used for inputting characters by connecting them to the mobile terminals.
FIG. 6 is a perspective view of a known keyboard-type input device and a mobile terminal to which the keyboard-type input device is connected. With reference to FIG. 6, an input device 50 includes an operating unit 51 provided with a plurality of operation keys 52 and a connecting cable 53 which extends from the operating unit 51. The connecting cable 53 is provided with a connecter 54 at the distal end thereof, and the connecter 54 is attached to a connecting port 61 formed at the bottom end of a mobile terminal 60 in a detachable manner. The mobile terminal 60 includes an input unit 62 and a display unit 63.
In the input device 50, kana characters and romaji can be input by operating the operation keys 52. When the operation keys 52 are pressed, operating data is transmitted to the mobile terminal 60, and character strings are displayed on the display unit 63. Then, the character strings are converted into transmission data, which is transmitted from the mobile terminal 60 to other mobile terminals.
However, mobile terminals of the known art have the following problems.
When characters are input to a mobile phone without an input device connected thereto, a single key must be pressed up to five times in order to input a single hiragana character or katakana character, and a single key must be pressed up to three or four times in order to input a single alphabet character. Therefore, a relatively large input time is required. When characters are input to a PDA without an input device connected thereto, there is a problem in that characters are not recognized reliably. In addition, a large input time is also required in this case.
In the case in which the input device 50 shown in FIG. 6 is used, the operation to connect and disconnect the input device 50 to/from the mobile terminal is cumbersome. In addition, since the input device 50 and the mobile terminal 60 are connected to each other with the connecting cable, the user cannot input characters easily and smoothly while holding both the input device 50 and the mobile terminal 60. Furthermore, since the input device 50 must be disconnected from the mobile terminal 60 and carried separately when it is not being used, the input device 50 is not carried conveniently.

Input device connected to mobile communication terminal with which characters can be input easily


Device for controling an electrical motor mounted on the crossarm of a bridge circuit whose motor current is controllable with semiconductor components formed in a first bridge branch by an electromagnetic switching device and in a second bridge branch by two serially switched, opposite-phase timed semiconductor switches. The opposite-phase timing of both semiconductor switches creates an active freewheeling branch, thereby making a freewheeling diode unnecessary.

Bridge circuits with an electrical motor mounted in the crossarm are known from various power electronic circuits. A so-called full-bridge circuit normally consists of four electronic circuits in the bridge branches, of which two at a time are switched in a bridge branch between the supply voltage and the mass. These switches allow to control not only the direction of the motor current in the crossarm but also its magnitude, making it possible to operate the drive system in all four quadrants of the rotational speed-torque-family of curves.
In automobile technology such bridge circuits are used with comfort systems and serve for example as a drive system for separately controlled power windows, seat adjustors, sliding roofs or belt rollers. With an electrical power window it is necessary, for safety reasons and over a certain range of adjustment, to have an effective protection against being caught in it. The drive system is therefore designed in such a way that the sense of rotation of the motor is reversed as soon as a slowdown in rotation is detected. For a spring rate of 10 Newton per millimeter the squeezing force may not exceed 100 Newton. This function is ensured by an electronic control that monitors the engine revolutions during the adjustment. The control is often installed away from the center and integrated into the power window motor, minimizing thereby the need for wiring within the vehicle. The speed of the adjustment drive is regulated by a semiconductor device switched into the supply line to the battery, for example a timed power field effect transistor, also called chopper. So-called polarity-reversing relays are used to reverse the polarity of the motor. These are electromechanical polarity-reversing devices consisting of two electromagnetic systems, of which one operating contact each is connected to the crossarm of the bridge circuit and in which one inoperative contact each is switched into a bridge branch. One electromechanical polarity-reversing relay such as normally used for drive devices in motor vehicles, is described in EP 055 6 540 B 1.
When timing a direct-current motor mounted in the crossarm of a bridge circuit, so-called freewheeling diodes are necessary that take over the motor current during those switching phases during which the chopper severs the connection to the battery. These freewheeling diodes are connected in parallel to the bridge branches. A freewheeling diode is an additional component that causes additional costs and requires the corresponding mounting space on the controller. However, if the controller is integrated into the motor housing, the mounting space is very limited. Also, there is substantial cost pressure on all control electronics, as there is also on other components of the drive system. Efforts are always undertaken during the development phase to achieve the desired functionality with the lowest number of components and the least expensive components.

Device and method for controlling an electrical motor mounted on the crossarm of a bridge circuit


A carrier tape for electrical components is provided comprising a tape having a length and a plurality of cavities along the length of the tape. Each cavity comprises inner side walls and a bottom surface and is capable of containing an electrical component.

The present invention relates to a carrier tape for electronic components.
European patent document EP 1 264 779 discloses a packing tape assembly which comprises a tape substrate with openings. A box, which is formed by folding paper, is inserted into each opening to create a receiving pocket for an electronic component.
Japanese patent document JP 8058877 discloses a carrier tape in which a cover strip is heat sealed to the carrier tape on one edge of the carrier tape and fixed by an openable fastener on the other edge of the carrier tape.
These carriers are very expensive and inconvenient for packing and transporting electronic components.


A light-emitting cavity device comprising: a pair of mirrors spaced apart to define a resonant cavity; a luminescent layer located in the cavity; and a control layer located in the cavity and controllable to adjust the resonance wavelength of the cavity and thereby spectrally redistribute the energy emitted by the luminescent layer.

This invention relates to tuneable microcavities, and especially their use in luminescent devices.
FIG. 1 shows a planar microcavity. This is a Fabry-Perot resonator with two mirrors 1,2 spaced apart by a cavity 3 which contains a photon-emitting material 4. The mirror separation is of the order of the optical wavelength, so that the resonant frequency of the cavity corresponds to an optical frequency. Such a structure therefore has a narrow emission spectrum, allowing emission only at the resonance wavelength(s) of the cavity. It is also capable of enhancing the emission at a certain wavelength compared to the free-space emission of the luminescent material (see J. Gruner et al. J Appl. Phys. 80, 207 (1996)). These properties have proved to be useful for light-emitting devices based on broad bandwidth emitters such as organic molecular or polymeric materials, providing the improved colour purity and spectral tuneability required for multi-colour display applications (see U. Lemmer et al. Appl. Phys. Lett. 66, 1301 (1996); H. F. Wittmann et al. Adv. Mater. 6, 541 (1995); and A. Dodabalapur et al. Electronics Letters 30, 1000 (1994)).
One type of electroluminescent device is described in PCT/WO90/13148, the contents of which are incorporated herein by reference. The basic structure of this device is a light-emitting polymer film (for instance a film of a poly(p-phenylenevinylene)--"PPV") sandwiched between two electrodes, one of which injects electrons and the other of which injects holes. It is believed that the electrons and holes excite the polymer film, emitting photons. These devices have potential as flat panel displays.
In more detail, such an organic electroluminescent device ("OLED") typically comprises an anode for injecting the positive charge carriers, a cathode for injecting the negative charge carriers and, sandwiched between the electrodes, at least one organoluminescent layer. The anode is typically a layer of indium-tin oxide ("ITO") which is deposited on a glass substrate. The organic layer(s) are then deposited on the anode and the cathode is then deposited on the organic layer(s) by, for example, evaporating or sputtering. The device is then packaged for protection.
Organic light emitting devices have been incorporated in microcavity structures (see the papers by Lemmer et al. and Wittmann et al.). It has been shown that by using different thicknesses of a patterned inert filler it is possible to fabricate microcavity light-emitting devices with emission peaks from 490 nm to 630 nm from a single organic semiconductor (see the paper by Dodabalapur et al.). However, in such devices the resonance wavelength, and hence the emission colour, is fixed when the device is fabricated. Therefore, the colour (for instance of an individual pixel in a multi-pixel display) cannot be varied independently and/or externally after fabrication.


A ferroelectric semiconductor device (10) and a method of manufacturing the ferroelectric semiconductor device (10). The ferroelectric semiconductor device (10) has a layer (15) of ferroelectric material disposed on a semiconductor substrate (11) and a gate structure (27) formed on the semiconductor substrate (11). A source region (23) and a drain region (24) are formed on the semiconductor substrate such that the source region (23) and the drain region (24) are laterally spaced apart from the gate structure (27).

The present invention relates, in general, to semiconductor devices, and more particularly, to ferroelectric semiconductor devices.
Ferroelectric materials have been used to form electrical components such as non-volatile memories, capacitors, and optical guided wave devices. For example, in non-volatile semiconductor devices a ferroelectric material is deposited on a substrate oxide overlying a semiconductor substrate. Then, a gate material is deposited on the ferroelectric material. The gate material and the ferroelectric material are etched to form a gate structure. Source/drain regions are formed by implanting an impurity material into the semiconductor substrate, wherein the source/drain regions are self-aligned to the gate structure.
A drawback in the manufacture of ferroelectric semiconductor devices having self-aligned source/drain regions is that these regions may extend under the gate structure. The extension of the source/drain regions under the gate structure increases the capacitance of the ferroelectric semiconductor device, thereby degrading its frequency performance.
Additionally, the implantation of the source/drain region requires a high temperature anneal for the activation of the implant. This high temperature anneal is detrimental to the ferroelectric material.
Accordingly, it would be advantageous to have a ferroelectric device and a method for manufacturing the ferroelectric device that eliminates the need for the implanted source/drain region.


An interference check device includes a model-number upper-limit input unit to which a model upper-limit number of geometric models allocated to a modeling target of interference check is input, a modeling unit generating model candidates from the modeling target using geometric models equal to or less than the model upper limit number, a processing-computation-amount upper-limit setting unit setting a computation upper-limit amount of interference check based on a computation processing amount required for each process performed by a controller controlling the modeling target, a minimum-enclosure-volume-model determination unit determining a model candidate having smallest model enclosure volume as a model for the modeling target from the model candidates that can perform calculation processing of interference check with equal to or less than the computation upper-limit amount, and an interference check unit performing interference check between models using determined model.

An interference check device is a device that checks for the possibility of collisions between an industrial robot and peripheral devices thereof in order to prevent occurrence of collisions. By checking for the possibility of a collision, if there is a possibility of a collision, the interference check device outputs an appropriate command value (a command value for stopping a robot or correcting the motion trajectory thereof) to a robot or the like, thereby preventing occurrence of a collision. Particularly, in an interference check device that performs an online interference check even when a robot is in operation, the actual detailed shapes of the industrial robot and peripheral devices thereof are not used, but are replaced by models (for example, a spherical body or a cylindrical body) that enable easy and fast calculation processing of an interference check in order to perform an interference check between the models.
When replacing a modeling target (an object) such as a robot body with a model, the interference check device divides the modeling target into a plurality of regions in advance while taking into consideration the number of movable axes of joints (flexibility of a mechanism) or the like. The interference check device arranges the model such that each region is enclosed by a simple geometric model (such as a spherical body, a cylindrical body, a cuboid, or a polyhedron), referred to as a "primitive". Further, the interference check device calculates the shortest distance between the respective primitives and if the shortest distance becomes shorter than 0 or a predetermined distance set in advance, the interference check device determines that "interference will occur" and outputs a stop command to start a stop operation.
A specific model generation method for a modeling target is described here. Modeling requires that "a modeling target is enclosed in a state where a model is larger than the modeling target". Regarding enclosure of the target, if the target is enclosed within an excess space and the model setting is too large, it causes an erroneous determination that "interference has occurred", although there is no possibility of interference between the targets. Therefore, when modeling is performed, it is important to effectively enclose the entire target by using a model having a small excess space.
As a model used for an interference check, a method of using a spherical body having advantageous unit determination calculation cost has been used hitherto. Even when a determination between spherical bodies is performed, if the possibility of interference is determined for all the models being present, the calculation cost increases by as much as the combinations of the models. Accordingly, in order to increase the efficiency of calculation processing, a method of determining the possibility of interference not for all the models at all times but determining in detail only for a portion having a possibility of interference has been proposed.
According to this method, for example, a model having a large radius and roughly modeled by a small number of models and a model having a small radius and modeled in detail by a large number of models are prepared hierarchically with respect to a robot. By adopting a method of performing a determination of interference between rough models first, and if there is a possibility of interference, performing a determination of interference between detailed models, the calculation cost is reduced with high accuracy (for example, see Patent Literature 1).
In a field where an offline or online interference check of a robot or the like is required, it is desired to perform the interference check by using a model that is modeled accurately as described above.


Provided is a backpack working machine with excellent operability and durability, the machine having a configuration in which a blower is mounted on a backpack frame with a vibration isolation device interposed therebetween, and a drive source and a fuel tank are attached to the blower. The machine includes a backpack frame with a backrest portion, the backrest portion being adapted to abut an operator's back, a blower mounted on the backrest portion with a vibration isolation device interposed therebetween, an engine attached to the blower for driving the blower, and a fuel tank that stores a fuel to be supplied to the engine. The fuel tank is attached to the blower such that the fuel tank is located at at least one of a position below the engine or on a lateral side of the engine.

Technical Field
The present invention relates to a backpack working machine, and for example, relates to a backpack air-blow working machine for performing a variety of operations by driving a blower with an engine to blow air while being carried on the operator's back.
Background Art
Conventionally, hand-guided air-blow working machines (for example, Patent Document 1) and backpack air-blow working machines (for example, Patent Document 2) are known as air-blow working machines for performing an operation of gathering fallen leaves, rubbishes, and the like by driving a blower with a drive source, such as an engine, to blow air.
Among the aforementioned air-blow working machines, the hand-guided air-blow working machine has a configuration in which a drive source for driving a blower for blowing air, a fuel tank that stores a fuel to be supplied to the drive source, and the like are integrally attached to the blower. Thus, the operator is able to perform the aforementioned operation while carrying the air-blow working machine by gripping a handle portion that is provided above the blower, for example.
Meanwhile, the backpack air-blow working machine typically has a configuration in which, as disclosed in Patent Document 2, a blower is mounted on a backpack frame with a vibration isolation device, such as a spring suspension, interposed therebetween, and a drive source for driving the blower is attached to the blower, and further, a fuel tank that stores a fuel to be supplied to the drive source is attached to the backpack frame. Thus, the operator is able to perform the aforementioned operation while carrying the air-blow working machine on his/her back with shoulder straps and the like that are provided on the backpack frame. As described above, in the conventional backpack air-blow working machine, the comfort of the operator who uses the air-blow working machine is improved and a load imposed on the vibration isolation device is reduced by mounting the drive source (i.e., engine) and the blower, which can be sources of vibration, on the backpack frame with the vibration isolation device interposed therebetween, while attaching the fuel tank, which is not a source of vibration, directly to the backpack frame, thereby reducing the weight of the constituent portion that is connected to the vibration isolation device attached to the backpack frame.
However, when the drive source is mounted on the backpack frame with the vibration isolation device interposed therebetween while the fuel tank is directly attached to the backpack frame, there is a problem in that the relative positions of the drive source and the fuel tank may change due to vibration and the like of the drive source when the drive source is in use (in particular, when the drive source starts to be used), for example, and thus, a load may be imposed on a fuel pipe for supplying a fuel from the fuel tank to the drive source.
To address such a problem, Patent Document 3 discloses a backpack air-blow working machine with a configuration in which a blower is mounted on a backpack frame with a vibration isolation device made of rubber interposed therebetween, and a drive source and a fuel tank are integrally attached to the rear surface of a fan casing of the blower.


A mount insulator is structured by a core metal body, installed at a fixed side and including an almost flat intermediate flange section having a piercing hole at an axial center section and a ring-shaped wall section extensively provided at the outer periphery of the intermediate flange in the direction of both sides crossing the intermediate section, and a mount elastic body section integrally fixed and formed with both sides of the intermediate flange section, an inner peripheral surface of the piercing hole and an inner peripheral surface of the ring-shaped wall section, and including an extension section expanded in a direction to cross the intermediate flange section and projecting from both wall sections, and a piercing supporting hole provided at the inner periphery side of the piercing hole of the intermediate flange section and piercing through between end surfaces of both extension sections of smaller diameter than that of the piercing hole and almost concentric with the piercing hole for piercingly support the axis section of a material to be mounted. Therefore, it is possible to restrict damaging of the mount insulator and generation of abnormal noise.

The present invention relates to a mount insulator to be used for elastically supporting a shock absorber of a suspension at the car body side.
This type of mount insulator has so far been provided between the upper section of the shock absorber and the car body side. The shock absorber is structured by a rod section and a cylinder section. A rear spring bumper is provided to surround the shock absorber, and a first retainer, the shock absorber and a second retainer are provided in a stacked state at the upper section of the rear spring bumper. The rod section passes through the first retainer, the shock absorber and the second retainer, and at the upper portion of the second retainer, and a nut is fastened to a male screw section formed at the front end of the rod section. By the fastening of this nut, a mount insulator is mounted between the first retainer and the second retainer. A coiled spring is provided outside the shock absorber. The upper and lower positions of the coiled spring are restricted by coiled spring receiver provided at a cylinder section of the shock absorber and by the mount insulator.
The mount insulator is structured by a core metal body fixed to a strut housing at the car body side, a rubber elastic section having a piercing hole (viz., through hole), and an inner cylinder section mounted in the piercing hole of the elastic body section and having the rod section pierced (viz. disposed) through a bore section of the inner cylinder section.
The core metal body is formed in approximately a disk shape, and a hole section having a larger diameter than the outer diameter of the inner cylinder is provided at approximately the center portion of the core metal body. A rising section projecting upwards is provided at the periphery of the hole section. The outer periphery side of the core metal body structures a spring sheet section.
A mount elastic body section of the elastic body section is fixedly formed on both the upper and lower surfaces of the core metal body, on an inner periphery surface of the hole section and the rising section, and on the outer periphery surface of the inner cylinder section respectively. A spring receiving elastic body is fixedly formed on the lower surface of the spring sheet section. The spring receiving elastic body is integrated with the mount elastic body to structure the elastic body section. The mount elastic body section is expansively formed in the axial direction of the inner cylinder section, and the upper and lower ends of the inner cylinder and the mount elastic body section are on almost the same plane.
The mount insulator is mounted in the state that the rod section is inserted in the inner cylinder section and that the inner cylinder section and the mount elastic body section are sandwiched between the first and second retainers. In the spring sheet section, the coiled spring is received by the spring receiving elastic body section. Accordingly, both the shock absorber and the coiled spring are elastically supported by the strut housing at the car body side.
However, since the core metal body is formed in almost a disk shape in the above-described type of mount insulator, the mount elastic body section is easily deformed to escape in the lateral direction. Therefore, when a force is applied in a direction perpendicular to the axis of the rod section due to the entangled stiffness of a lower bush of the shock absorber, the rod section and the inner cylinder section are inclined to the lateral direction with respect to the core metal body fixed to the strut housing. Accordingly, since the mount elastic body section is strongly compressed between the rising section of the core metal body and the inner cylinder section, there is a problem that the mount elastic body section is easily damaged. Particularly, since the rising section becomes an edge, the mount elastic body section is easily damaged.
Further, since the mount insulator integrally holds the inner cylinder section and is sandwiched by the retainers on both sides, it is not possible to apply a preliminary pressure to the mount elastic body section even if the nut is fastened. Accordingly, there arises a problem that the retainers and the upper and lower ends of the mount elastic body section are brought into contact with each other or are separated from each other when a damping force of the shock absorber is applied or when a force is applied in upward and downward directions by the rear spring bumper. This further leads to such problems that abnormal noise is generated and that the mount elastic body section is damaged by sands that enter in the gap between the retainers and the upper and lower ends of the mount elastic body section.


Memory cell arrays, in which memory cells are arranged in a matrix, are divided into a plurality of blocks. In a semiconductor memory device having the memory cell arrays, load circuits are connected to bus lines and the memory cell arrays. The number of load circuits is the same as that of the memory cell arrays. Thus, the load circuits function to supply the same amount of current to the bus lines, whatever block is activated in a writing operation. Therefore, writing characteristics of all the memory cell array blocks are the same.

The present invention relates to a data-readable/writable semiconductor memory device using a MOS transistor as a memory element.
As shown in FIG. 1, a nonvolatile transistor used as a memory cell of an EEPROM for electrically erasing data is formed of two polycrystalline silicon layers insulated from each other by an insulating film.
A first polycrystalline silicon layer forms a floating gate 701 and a second polycrystalline silicon layer forms a control gate 702. A reference numeral 703 denotes a source, 704 a drain, 705 a silicon substrate, 706 a contact hole and 707 a data line formed of Al (aluminum). The data line 707 is connected to the drain 704 through a contact hole 706.
Operations of writing, reading and erasing data in the memory cell having the aforementioned structure will be described below.
A writing operation is performed by setting a drain potential V.sub.D to 5.5V, a control gate potential V.sub.CG to 10V and a source potential V.sub.S to 0V, and injecting hot electrons into the floating gate.
An erasing operation is performed by setting a control gate potential V.sub.CG to -7V and setting a drain potential V.sub.D in a floating state, and applying a voltage of, for example, 6.5V to the source. At this time, electrons are extracted from the floating gate to the source by tunnel effect.
A reading operation is performed by setting a control gate potential V.sub.CG to -7V, a drain potential V.sub.D to 0.8V, and a source potential V.sub.S to 0V. At this time, if the memory data in the memory cell is "0" (write state), substantially no current flows between the source and the drain. If the memory data is "1" (erase state), a cell current of about 60 .mu. A flows between the source and the drain.
Memory cell arrays including memory cells as described above are arranged as shown in FIG. 2, divided into blocks B.sub.0 to B.sub.j, each including memory cell arrays IO.sub.0 to IO.sub.i, so that data can be partially written and erased. The term "block" means a unit for performing writing/erasing operations.
In FIG. 2, the memory cell arrays IO.sub.0 to IO.sub.i, divided into blocks, are respectively connected to data bus lines DL.sub.0 to DL.sub.i through column gates 11. The data bus lines DL.sub.0 to DL.sub.i are respectively connected to buffer circuits 13.sub.0 to 13.sub.i through, for example, sense amplifiers 12.sub.0 to 12.sub.i.
The data bus lines DL.sub.0 to DL.sub.i are respectively connected to load circuits 14.sub.0 to 14.sub.i, each having a comparatively large-size transistor. The load circuits are collected in a group away from the memory cell arrays. Therefore, due to parasitic resistance of the data bus lines DL.sub.0 to DL.sub.i, a difference in potential drop is made between the block B.sub.0 near the group of load circuits and a block B.sub.j far from them. Accordingly, the writing characteristic in the former block is different from that of the latter.
FIG. 3 is a circuit diagram showing a structure of a load circuit 14.sub.i of the load circuits 14.sub.0 to 14.sub.i.
The load circuit comprises a load transistor circuit, in which an N-channel MOS transistor Tr is connected between a power source VPOWER and a data line DL.sub.i.
A gate input PRGH.sub.i input to the transistor Tr is high in potential, when write data to be supplied to a memory cell is "0". At this time, the drain potential is transmitted to the memory cell. On the other hand, when write data is "1", the gate input PRGH.sub.i is equal to a ground potential. At this time, the drain of the memory cell is in a floating state, and therefore no writing operation is performed.
As described above, the prior art has the following drawbacks.
In the conventional semiconductor memory device, since the load circuits (comparatively great load circuits), functioning in a writing operation, are collected in a group away from the memory cell arrays and connected to the corresponding blocks of the memory cell arrays only by the data bus lines, a difference in writing characteristic is made between a block near the group of load circuits and a block far from them, due to parasitic resistance of the data bus lines.


A 360° camera can be embedded within a fire pull station of a fire alarm system, the fire alarm system can include at least one of a fire detection component, a signaling component, and control panel. The fire pull station can include a mounting bracket and a housing. The mounting bracket can securely affixes the station to a surface. The housing can include of at least one of a power source, a pull, and a circuitry. The 360° camera can include an image sensor and a 360° lense array. The camera can obtain electrical power from the power source of the station.

The present invention relates to the field of panoramic photography and, more particularly, to integrating a 360° panoramic camera within a fire pull station.
Criminal activity and surveillance activities are often locked in an arms race to counter each other. As criminal and criminal activity becomes increasingly sophisticated, surveillance activities must continue to stay current. Many surveillance options frequently include cameras which can monitor a field of view for illegal and/or suspicious activity. However, many of these cameras have too limited of a field of view which criminals can easily exploit.
Further, cameras are often easily detected by experienced and inexperienced criminals and are frequently destroyed or disabled. This renders the camera and surveillance data/opportunities useless. Often cameras hidden within plain sight (e.g., disguised as innocuous objects) frequently thwart criminals. However, these objects are often decoy objects with little or no functionality. What is needed is a solution for exploiting the hidden nature of decoys and improving traditional surveillance limitations.

Integrating a 360 degree panoramic camera within a fire pull station


A keystone jack (10) includes a cover body (1), a lining body (2), a carrier body (3), a printed circuit board (4), a housing (5), and a flap (6). The cover body (1) includes a space (11). The space (11) includes a cruciform partition with an elongated partition plate (13) perpendicular interlaced a short partition plate (14). The lining body (2) has two edges (21). A connection part (22) is between the two edges (21). A stud (23) and a separation plate (24) are between the connection part (22) and the two edges (21). The stud (23) has a first channel (231). The separation plate (24) has a second channel. When the lining body (2) is installed in the space (11), the elongated partition plate (13) and the short partition plate (14) in the space (11) are through the first channel (231), the second channel (242), and the opening (25) to form a double-cross isolation structure. When the keystone jack (10) is used, the electricity is more stable, and the crosstalk interferences are decreasing, and the impedance is more stable, and the electronic signals are not decayed.

1. Field of the Invention
The present invention relates to a jack and in particular to a keystone jack with a double-cross isolation structure to avoid the crosstalk phenomenon.
2. Description of Prior Art
When the electronic signals are transmitted along the layouts of the printed circuit board, the electromagnetic waves of the electronic signals are transmitted from one side of the integrated circuit to another side of the integrated circuit along the layouts of the printed circuit board as well, so the crosstalk happens. Due to the electromagnetic induction, the voltages and the currents are varied transiently by the electromagnetic waves in the transmission process.
The electromagnetic waves are induced by the electric fields and the magnetic fields with time variation. In fact, the electric fields and the magnetic fields exist not only in each kind of layouts in the printed circuit board. The energy of a plenty of electromagnetic waves exists outside the layouts. So when the electronic signals are transmitted along the lead wire and there are other wiring lines nearby, other wiring lines will be impacted by the electric fields and the magnetic fields of the electronic signals.
According to the Maxwell equation, the electric fields and the magnetic fields will induce the voltages and the currents in the lead wire nearby, so the electric fields and the magnetic fields induced from the transmission process of the electronic signals will cause the electronic signal interferences. This phenomenon is called the crosstalk phenomenon.
Beside the crosstalk phenomenon in the printed circuit board mentioned above, the crosstalk phenomenon exists in the conventional keystone jacks or other connectors as well. The distance of the pins of the puncturing terminals is short because the volume of the keystone jack is small. The core wires are closed because the distance of the pins of the puncturing terminals is short, so that the electricity is not stable when the electronic signals are transmitted. The electromagnetic waves induced by the puncturing terminals will impact the puncturing terminals nearby, so that the impedance characteristics are not stable and the transmission signals are decayed.


A method of manufacturing a semiconductor body (1), whereby a carrier wafer (2) with an optically smooth main surface (3) is provided with a semiconducting top layer (4) in that the main surface (3) is brought into contact with an optically smooth main surface (5) of a monocrystalline semiconductor wafer (6), a permanent bond being formed, after which the semiconductor wafer (6) is made thin by means of a grinding process and a polishing process in that order. The semiconductor wafer (6) is made thin in the polishing process in that the exposed main surface (9) of the carrier wafer (2) is made wear-resistant, and in that then the carrier wafer (2) bonded to the semiconductor wafer (6) is arranged between two plane polishing discs (10) and (11) provided with a polishing liquid, upon which these polishing discs (10, 11) and the exposed main surfaces (8, 9) are moved relative to one another. It is achieved by this that a semiconductor body (1) with a carrier wafer (2) and a top layer (4) can be manufactured in a simple manner suitable for mass production. It is also found that a top layer (4) with smaller layer thickness variations can be manufactured.

The invention relates to a method of manufacturing a semiconductor body whereby a carrier wafer having an optically smooth main surface is provided with a semiconducting top layer in that the main surface is brought into contact with an optically smooth main surface of a monocrystalline semiconductor wafer so that a permanent bond is formed, after which the semiconductor wafer is made thin by means of a grinding process followed by a polishing process.
Such a method may be used, for example, for manufacturing a semiconductor body having a carrier wafer and a top layer of different doping types or with different concentrations of doping atoms. A semiconductor body having an insulating or electrically conducting intermediate layer between the top layer and the carrier wafer can also be made by the method in that the carrier wafer or the semiconducting wafer is provided with the insulating or well conducting layer before the bond is made. Semiconductor elements may be provided in the top layer. The carrier wafer is connected to the semiconductor wafer by means of wringing whereby the optically smooth main surfaces of the wafers are brought into contact with one another, after which a reinforced permanent connection is made by means of a heat treatment ("wafer bonding"). After that, the semiconductor slice is first made thin in the grinding process, by which much material is taken off quickly, from a thickness of approximately 500 .mu.m down to a thickness of approximately 50 .mu.m, after which the eventual layer thickness of approximately 5 .mu.m is achieved slowly, but with great precision, in the polishing process.
European Patent Application 337556 discloses a method of the kind mentioned in the opening paragraph whereby the carrier wafer is fastened to a support body by means of a wax (cement) after wafer bonding, upon which the semiconductor wafer is ground and polished under the supply of a grinding or polishing liquid.
During the polishing process, when the thickness of the top layer is reduced from approximately 50 .mu.m to approximately 5 .mu.m, a support body with a very high geometric precision is required. Fastening of the wafers on the support body must also take place with very high accuracy. The known method described has the disadvantage that the use of a support body on which the two bonded wafers are to be fastened is inconvenient during polishing of the wafer in mass manufacture.

Metod of manufacturing a semiconductor body using a carrier wafer and a monocrystalline semiconducting top layer


An inverter control microcomputer 10 comprises AD converters 21–23, a selector control circuit 31, and a selector 32. The selector 32 selects three analog signals from among inputted seven analog signals in accordance with control from the selector control circuit 31. A control signal generation section, which comprises a CPU 11 and an inverter control signal generation circuit 17, generates a motor control signal Cntl based on three digital values obtained by the respective AD converters 21–23. By performing AD conversion concurrently for arbitrary three analog signals, it is possible to eliminate a phase shift between the detected analog signals and perform motor control with high precision. Thus, it is possible to detect an analog signal necessary for control of a motor, etc., at an appropriate timing without increasing the number of AD converters.

1. Field of the Invention
The present invention relates to an inverter control device incorporating an AD converter, and an inverter control method.
2. Description of the Background Art
FIGS. 15A and 15B are illustrations each showing a configuration of a conventional inverter control microcomputer. An inverter control microcomputer 101 as shown in FIG. 15A includes a CPU 11, a ROM 12, a RAM 13, a timer 14, a serial port 15, a general-purpose I/O port 16, an inverter control signal generation circuit 17, and an AD converter 121. The inverter control microcomputer 101 is used as an element incorporated in a motor control device, which will be described below (see FIG. 2).
Conventionally, in order to conserve energy, a method for converting a position detection signal (analog signal) to a digital value by the AD converter incorporated in the inverter control microcomputer is adopted in the motor control device. In this method, an analog position detection signal is inputted to the inverter control microcomputer, and the AD converter incorporated in the inverter control microcomputer converts the inputted analog signal to a digital value. Next, the CPU incorporated in the inverter control microcomputer calculates a position of the rotor of the motor based on the obtained digital value. Next, the inverter control signal generation circuit incorporated in the inverter control microcomputer generates a motor control signal based on the obtained position information. The motor is controlled by the control signal generated as described above.
Here, in the case where a three-phase motor is used, it is preferable that two analog signals be used as position detection signals. However, the inverter control microcomputer 101 as shown in FIG. 15A has only one AD converter 121, whereby AD conversion cannot be performed concurrently for two analog signals. As a result, in the inverter control microcomputer 101, two analog signals are detected at slightly shifted time points. However, if there is a time lag between detection times of two analog signals, it is impossible to perform high-precision motor control because the motor is always running.
In order to solve the above-described problem, as shown in FIG. 15B, an inverter control microcomputer 102 having two AD converters 121 and 122 has been put into practical use. The inverter control microcomputer 102 can perform AD conversion concurrently for two-phase current values (U-phase motor current Iu and V-phase motor current Iv). Thus, it is possible to perform motor control with high precision.
Also, along with the enforcement of amendments to the Laws concerning the Rational Use of Energy and regulations on mains harmonics, a method for performing motor inverter control using a factor other than two-phase current values has been studied. Specifically, a method for enhancing the efficiency of motor inverter control by detecting a motor voltage and a power supply voltage in addition to motor currents has been studied. The Applicant of the present application has already proposed a semiconductor device for performing inverter control provided with more than two AD converters in Japanese Laid-Open Patent Publication No. 2002-165476 gazette.
For example, assume that the semiconductor device as described in the above gazette is used for detecting two-phase motor currents (U-phase motor current Iu and V-phase motor current Iv) and two-phase motor voltages (U-phase motor voltage Vu and V-phase motor voltage Vv). In this case, as shown in FIG. 16, by performing analog signal selection using two multiplexers 131 and 132 for selecting one output signal from among two input signals, it is possible to concurrently detect two-phase motor currents or two-phase motor voltages. However, the AD converters 121 and 122 need a predetermined time to perform AD conversion. Thus, in the configuration as shown in FIG. 16, it is impossible, for example, to concurrently detect the U-phase motor current Iu and the U-phase motor voltage Vu, and it is necessary to detect the U-phase motor voltage Vu after detecting the U-phase motor current Iu.
The easiest method of solving the above problem is to incorporate more AD converters into the inverter control microcomputer. For example, as shown in FIG. 17, it is possible to perform AD conversion concurrently for two-phase motor currents and two-phase motor voltages by separately inputting the two-phase motor currents and the two-phase motor voltages to different AD converters 121 to 124 via respective multiplexers 133 to 136. However, the configuration as shown in FIG. 17 has a drawback in that a cost of the inverter control microcomputer is increased with an increase in the number of AD converters.

Inverter control device and inverter control method

Matsushita Electric Industrial Co., Ltd.


Photo-sensitive element for electro-optical sensors, including at least a photodiode able to generate a current that is function of the incident light, a conversion circuit able to convert the current generated into a voltage signal, a comparator able to commute if the voltage signal reaches or exceeds a determinate threshold signal, and at least a measuring and memorization element able to measure and memorize the temporal instant of commutation of the comparator and able to be driven by a reference signal in order to render available to an output line a signal estimating the incident light. The reference signal is of the type that can be programmed from outside.

Electro-optical sensors are known, consisting of a plurality of photo-sensitive element or pixels, able to detect light signals and to transmit them, in the form of electric signal, to a calculator which processes them and obtains images from them. The images are then transmitted to display devices able to allow a user to see the images or information deriving therefrom.
The optical sensors were previously made using CCD technology (Charged-Coupled Device), which guarantees a very satisfactory image quality in the presence of well-controlled lighting, but which does not allow to operate in an optimum manner when there is a highly differentiated light inside the same scene, that is, with an input signal having high dynamics, more than 120 dB.
Furthermore, CCDs are not very versatile from various viewpoints: they cannot easily be integrated with complex driving circuits in a single silicon support, the so-called microchip, and it is not possible to arbitrarily select a sub-window inside the matrix sensor.
To overcome some of these disadvantages of CCDs, optical sensors have been developed based on the CMOS type silicon technology (Complementary Metal Oxide Semiconductor), able to offer a good result even in conditions of very diversified lighting inside the same scene (see, for example, Seger, Graf, Landgraf—"Vision assistance in Scene with extreme Contrast"—IEEE Micro, vol. 13 page 50, February 1993).
This result can be obtained through a compression on logarithmic scale of the signal inside the photo-sensitive element. However, this conversion, obtained for example by connecting to the photo-sensitive element junction a MOS type transistor in diode configuration, as described in U.S. Pat. No. 5,608,204, suffers from the fundamental disadvantage of providing a low image definition in the event of low lighting.
High-resolution images are obtained by means of a linear reading of the photo-sensitive element; this technique, however, has the disadvantage that it does not give the possibility of obtaining good quality images in conditions of very diversified lighting inside the same scene.
To overcome this limitation, techniques are known which allow to extend the interval of visible light inside the same scene.
These techniques are very different from each other and allow to obtain information on a linear scale in conditions of low lighting, which guarantees high definition, and linear or compressed information on different scales, according to the technique used, in conditions of average-to-high luminosity.
It is also possible to distinguish between techniques that use information contained inside a single image or those which combine information arriving from several images obtained with different exposure times, in this case called multi-integration.
Among the various alternatives that exploit information contained inside the same scene, the technique is known which uses a linear output for low lighting and obtains information at the instant when there is saturation of the linear signal in order to map the average-to-high luminosity. In order to do this, a comparator is used which commutes at the instant when the linear signal reaches a threshold identified by the comparator as the saturation level. As consequence of this commutation, two reference signals are stored inside two analog memories (C1, C2). The reference signals are generated outside, in fixed and pre-determined views. From the combination of the two stored signals it is possible to obtain information for luminosity which would not be mappable by exploiting the linear signal. It should be noted that the information found from the memories C1 and C2 can be combined, but this information is totally separated from what is obtained through the linear output which, at the moment the comparator starts up, becomes insignificant.
The implementation of this known technique, using two fixed reference slopes employed in a combined manner, has the disadvantage, however, that it is necessary to realize a bulky photo-sensitive element and is therefore difficult to exploit for industrial devices, which require a high level of integration in order to achieve high-performance pixels integrated into a single silicon chip.
One purpose of the invention is to achieve a photo-sensitive element for electro-optical sensors which can be integrated into a silicon support element, or substrate, of limited size, achieving a microchip, and which is suitable to provide good-quality images at a high repetition frequency both in the case of low lighting and also in the case of an input signal characterized by high dynamics.
The Applicant has devised, tested and embodied the present invention to overcome the shortcomings of the state of the art and to obtain these and other purposes and advantages.

Photo-sensitive element used in electro-optical sensors to detect and convert incident light into an electrical signal


A contact process for manufacture of sulfuric acid in which the vapor phase heat of formation of sulfuric acid in the sulfur trioxide conversion gas and the heat of absorption of SO3 in sulfuric acid is recovered by transfer of heat from the absorption acid to high pressure boiler feed water that is fed to a waste heat boiler where steam is generated at a pressure of at least 40 bar by transfer of heat from sulfur dioxide combustion gas.

The contact process for manufacturing sulfuric acid is highly exothermic in several of its operations. Large amounts of reaction heat are generated in the combustion of a sulfur source, e.g., elemental sulfur, hydrogen sulfide, or a metal sulfide with an excess of oxygen to produce a gas containing sulfur dioxide and oxygen. Further substantial amounts of energy are generated in the catalytic conversion of sulfur dioxide to sulfur trioxide and in the absorption of sulfur trioxide into an aqueous absorption liquid comprising sulfuric acid to afford net production of sulfuric acid.
In the manufacture of sulfuric acid, it has long been conventional to recover the heat of combustion of the sulfur source by passing the combustion gas through a waste heat boiler. Because the combustion gas temperature is typically very high, high pressure steam, e.g., at 40 to 70 bar is generated in the waste heat boiler.
It has also been conventional to recover the heat of oxidation of sulfur dioxide to sulfur trioxide. Typically, combustion gas exiting the waste heat boiler is passed through a converter that comprises several successive conversion stages in each of which the gas stream comprising sulfur dioxide and oxygen is passed over a catalyst for the conversion reaction. For recovery of the heat of oxidation of sulfur dioxide to sulfur trioxide, conversion gas exiting the catalytic converter is typically passed through another waste heat boiler, a steam superheater and/or an economizer for heating boiler feed water for the waste heat boiler. Commonly, the conversion gas exiting the penultimate stage of a multi-stage converter is directed to an interpass absorption tower in which SO3 contained in the gas is absorbed into sulfuric acid, thereby enhancing the driving force for conversion of SO2 to SO3 in the converter stage to which the gas stream is returned from the interpass absorber. The gas must be cooled before entering the interpass absorber, which may be accomplished in an economizer as noted above, and/or by passage through gas to gas heat exchangers wherein a stream returning from the interpass absorber is reheated by transfer of heat from a gas stream exiting the same or another converter stage. The returning gas is reheated to a temperature at which further conversion can occur in the converter stage to which the gas is returned.
In addition to the heat generated by combustion of sulfur and oxidation of sulfur dioxide to sulfur trioxide, a substantial increment of energy is generated by absorption of sulfur trioxide from the conversion gas into a sulfuric acid stream for production of sulfuric acid from SO3. Until the 1980s, this increment of heat, which represents in the neighborhood of 25% of the total heat generated in the contact sulfuric acid process, was wasted to the atmosphere or used only in low level applications such as district heating. Absorption acid coolers constructed of stainless steel were typically operated at a maximum inlet temperature in the neighborhood of 110° C., more typically about 80° C.
U.S. Pat. Nos. 4,576,813 and 4,670,242 describe processes in which an SO3 absorber and absorption acid cooler could be operated to heat a cooling fluid to a temperature of 120° C. or higher by maintaining the strength of the sulfuric acid stream exiting the absorber at a concentration of 98.5% or higher, preferably 99% or higher, and recovering the heat of absorption in a heat exchanger in which the heat transfer surfaces wetted by the acid were constructed of properly selected Fe/Cr alloys.
In the processes described in U.S. Pat. Nos. 4,576,813 and 4,670,242, sulfur is burned in dry air to produce a dry SO2-bearing gas stream containing excess oxygen, and the SO2 stream is passed through a converter to produce a dry SO3-bearing gas stream that is directed to an absorption tower where it is contacted with sulfuric acid for high temperature absorption of the SO3. Absorption acid from the high temperature tower, commonly referred to as a "heat recovery tower," is circulated through an external shell and tube heat exchanger comprising tubes constructed of an appropriate Fe/Cr alloy. In the heat exchanger, heat is transferred to a heat transfer fluid and recovered in useful form. In commercial implementation of the processes described in U.S. Pat. Nos. 4,576,813 and 4,670,242, heat transferred from the absorption acid generates medium pressure steam that is useful in power generation and/or in co-ordinate process operations.
Typically, the high temperature absorber functions as an interpass tower from which the SO3-depleted SO2 stream is returned to a further converter stage to produce a further SO3 conversion gas stream that is then directed to a final absorption tower. To maximize SO3 recovery and minimize sulfuric acid mist, the final absorption tower is ordinarily operated at relatively modest temperature, for example, about 80° C.
U.S. Pat. No. 5,118,490 describes the recovery of SO3 absorption heat from "wet gas." The reference discloses options for heating boiler feed water by transfer of heat from heat recovery absorption system (HRS) acid. Boiler feed water for the heat recovery system boiler 15 can be preheated in heat exchanger 19 by HRS acid exiting intermediate pressure boiler 15. Boiler feed water for the sulfur dioxide combustion gas waste heat boiler can be heated with high temperature HRS acid by dividing the acid stream exiting the high temperature absorber between HRS boiler 15 and another heat exchanger 21 for preheating high pressure boiler feed water. The HRS acid preferably leaves the absorber at a temperature greater than 200° C. (392° F.), and steam is preferably generated at ≧450 kPa in HRS boiler 15. In other embodiments, the '490 patent discloses that heat exchangers 15 and 21 can be operated in series, in which case the acid typically flows first through exchanger 21.
U.S. Pat. No. 5,130,112 describes a process in which the energy recovered from the SO3 absorption operation is enhanced by injection of steam into the SO3 conversion gas stream prior to absorption. After steam injection, the conversion gas is preferably passed through an economizer, more preferably a condensing economizer, prior to entry into the absorber. The bulk of the HRS acid exiting HRS boiler 107 is recycled as absorption acid for HRS absorption zone 133, but a fraction 137 is transferred to final absorber 157 as makeup to compensate for product acid withdrawn from the final absorption circuit. The latter fraction passes in series through heat exchangers 139 and 141, in each of which the forward flow acid fraction is further cooled by transfer of heat to boiler feed water. In heat exchanger 141, boiler feed water for both the HRS boiler and the SO2 combustion gas waste heat boiler is preheated to 131° C. (268° F.). Boiler feed water exiting exchanger 141 passes through de-aerator 165 and then is divided between the HRS boiler and the waste heat boiler. The fraction flowing to the HRS boiler passes through heat exchanger 139 where it is heated to 184° C. (363° F.) by transfer of heat from the forward flow HRS acid fraction. The other fraction (at 138° C.; 280° F.) flows through heat exchanger 155 where it is heated by transfer of heat from final stage conversion gas and then through condensing economizer 131 where it is further heated by transfer of heat from third stage conversion gas.
U.S. Pat. No. 4,996,038 describes a process in which dilution water can be added as a vapor to the circulating acid, optionally within the tower. Both U.S. Pat. No. 4,996,038 and U.S. Pat. No. 5,538,707 describe heat recovery in an absorption tower comprising a primary absorption zone into which the SO3 gas stream is initially introduced and a secondary absorption zone, above the primary zone, in which the gas stream is cooled and residual SO3 recovered. Boiler feed water is preheated at relatively low temperatures by transfer of heat from acid circulating through the final absorption tower of an interpass process, and by transfer of heat from acid circulating through the drying tower.
PCT Application WO 2011/139390 describes sulfuric acid manufacturing processes wherein increased fractions of water vapor are introduced into the SO3 conversion gas entering a high temperature absorber, thereby increasing the molar ratio of water vapor to sulfur trioxide to 0.40 or higher. Introduction of water vapor increases the quantity of intermediate pressure steam that may be generated per ton of sulfuric acid produced by transfer of heat from the absorption acid exiting the heat recovery system boiler. This application also discusses the option of extracting further energy from absorption acid exiting the heat recovery system boiler by directing it to one or more auxiliary heat exchanger(s) for heating and/or de-aerating boiler feed water. The boiler feed water is heated to a temperature typically in the range of 180° C. (356° F.), but the major fraction of the absorption heat is extracted in the heat recovery system boiler, thus, limiting the extent to which boiler feed water can be heated by transfer of heat from the absorption acid downstream of the boiler.

Recovery of sulfur trioxide heat of absorption


A bandaging material in the form of a linear structure. The material has a first layer formed by a composite containing a thermoplastic polymer selected from the group of polymers and mixtures thereof, and a woody material derived from platy or granular wood particles having a minimum average size in one dimension of 0.1 mm. The material further has a second layer of a textile material having a first and a second surface. The first layer is superposed on the second layer in such a way that the first layer is essentially attached only to the first surface of said second layer. In this way, a bandaging material is obtained which has a suitably small self-adhesion which allows for it being coiled to a roll without force during manufacturing process. The bandaging material can further be uncoiled smoothly by hand followed by subsequent applying of it around limb at application temperature without delamination.

1. Field of Invention
The present invention relates, in general, to the forming of a structure on or around a body part of an animal or human being. More specifically, it relates to the field of orthopedic bandaging materials, methods of making the same and uses thereof. Described herein is also a method of using a novel bandaging material in immobilization of a fractured body part.
2. Description of Related Art
Splinting and casting are the two most common methods of externally immobilizing orthopedic injuries. Splinting is the preferred method in the acute short term care setting since a non-circumferential treatment method allows natural swelling, which occurs during the initial inflammatory phase. Furthermore, a splint can be removed more easily than a circumferential cast, allowing regular inspections of the injury site.
However, splinting is not an appropriate treatment method when fractures are potentially unstable (e.g. fractures requiring reduction, segmental or spiral fractures, dislocation fractures) and can be utilized only for acute immobilization to allow swelling while awaiting definitive care. Casting is therefore the mainstay of treatment for most fractures because it generally provides more effective immobilization of the injury. However, this technique requires more skill and time to apply and has a higher risk of complications if not applied properly (e.g. skin breakdown, necrosis, and compartment syndrome).
Both immobilization methods are applicable for several different types of fractures and therefore skin lesions, soft-tissue injuries, and neurovascular status of the involved extremity are carefully documented before selecting splint or cast application.
The materials utilized for commonly used large volume casting applications include the following:                plain-weave gauze fabrics coated with calcium sulphate hemi-hydrate;        knitted fibreglass substrates impregnated with a polyurethane resin; and        knitted polyester fabrics, impregnated with a clear polyurethane resin
Although casts manufactured of synthetic materials (DE 26 51 089, U.S. Pat. No. 4,376,438) are lighter, more durable and water resistant than plaster-of-Paris casts (WO 0035501), they are not superior in all respects. Many of the materials are toxic or at least difficult to dispose of. However, also their properties of use are in to some degree inadequate. For example, certain of the synthetic casting materials are considered more difficult to apply than plaster-of-Paris, and the conformability of the synthetic casting materials is reportedly inferior to that of plaster-of-Paris.
A cast which is poorly moulded will loosen more rapidly as soft tissue swelling resolves, and therefore use of synthetic casting materials is not recommended when there is an extensive soft tissue swelling. Also the problem of internal ridging predisposing to skin rubbing occurs more frequently in synthetic casts. In the case of lower limb walking casts, the lower weight of synthetic casts may not have significant dividends in terms of a reduction in the energy required to walk, as other factors, such as the angle of ankle fixation, have been shown to be more important than cast weight.
In addition to the above mentioned synthetic polyurethane products, various composites consisting of polycaprolactone homopolymers (PCLs) and fibrous materials are potentially interesting materials for orthopedic applications (WO 94/03211, WO 2007/035875 and US 2008/0262400). The PCLs have good strength properties and are biologically degradable. However, the PCL/fibrous material combinations do not meet all requirements of casting roll tape material. On the contrary, PCL-natural fiber composites have several disadvantages in a roll form like easy de-laminating feature after hardening, low dimensional stability during heating to application temperature, at application temperature (e.g. Cobracast) polymer particles will attach to skin requiring washing, and difficult coiling procedure at application temperature. Also excess of flexibility is found disadvantageous for circumferential casting applications; may cause easily pressure sores.
It is an object of the present invention to eliminate at least a part of the problems related to conventional splinting systems (in particular for circumferential application) and the above-mentioned problems of current products related either to their toxicity, complexity of structures and use or insufficient rigidity for splinting the limbs and body extremities.


An impeller includes a disk that has tubular first and second disk members, a blade that is integrally provided with the second disk member, and a cover that is integrally provided with the blade and covers the blade. The first disk member has a ring-shaped recessed portion therein. The second disk member has a ring-shaped engaging portion that is configured to engage with the first disk member by being inserted into the recessed portion. A first shrink-fitting portion is provided in a boundary portion between an outer circumferential surface of the engaging portion and an inner circumferential surface of the recessed portion that comes into contact with the outer circumferential surface.

For example, a rotary machine used in an industrial compressor, a centrifugal chiller, a small-sized gas turbine, and the like, has an impeller having a disk fixed to a rotating body to which a plurality of blades are attached. The rotary machine configured as described above gives pressure energy and velocity energy to a gas by rotating the impeller.
As the impeller, a so-called closed impeller, in which a disk and a blade are integrated and a cover is integrally provided with the blade, is known (for example, refer to Patent Documents 1 to 3).

Impeller, rotary machine, method for manufacturing impeller, and method for manufacturing rotary machine

MITSUBISHI HEAVY INDUSTRIES COMPRESSOR CORPORATION


A fibrous carbon nanostructure dispersion liquid having excellent dispersibility of fibrous carbon nanostructures is provided. A fibrous carbon nanostructure dispersion liquid comprises: fibrous carbon nanostructures with a tap density of 0.024 g/cm3 or less; and a solvent.

In recent years, fibrous carbon materials and especially fibrous carbon nanostructures such as carbon nanotubes (hereafter also referred to as "CNTs") have been attracting attention as materials excellent in electrical conductivity, thermal conductivity, and mechanical characteristics.
However, fibrous carbon nanostructures such as CNTs are fine structures with diameters in nanometer size, and therefore are poor in handleability and processability when used alone. Accordingly, for example, it has been proposed to produce a solution having CNTs dispersed therein, apply the solution to a substrate or the like to cause a plurality of CNTs to aggregate in film form and thus form a carbon nanotube film (hereafter also referred to as "CNT film") which is also called "buckypaper", and use the CNT film as a conductive film or the like. As the coating liquid having CNTs dispersed therein, for example, a coating liquid obtained by dispersing CNTs of high purity in a solvent is known (see PTL 1).

Fibrous carbon nanostructure dispersion liquid


A plasma display panel (PDP) driving method and a PDP gray-representing method for improving representation performance of low gray scales is disclosed. A voltage rising from a low level voltage to a reset voltage of a reset period of a subsequent subfield is applied to a scan electrode, without having a sustain period, after performing an address operation of the subfield with the minimum weight. The discharge cell selected in the address period of the minimum weight is discharged in an initial part of the gradually rising voltage.

1. Field of the Invention
The present invention relates to a driving method for a plasma display panel (PDP). More specifically, the present invention relates to a PDP driving method for improving the ability to represent low gray scales.
2. Discussion of the Related Art
A PDP is a flat display panel that shows characters or images using plasma generated by gas discharge. PDPs may include millions of pixels in a matrix format, where the PDP's size determines the number of pixels. Referring to FIG. 1 and FIG. 2, a typical PDP structure will now be described.
FIG. 1 shows a partial perspective view of a PDP, and FIG. 2 schematically shows a PDP electrode arrangement.
As shown in FIG. 1, the PDP includes glass substrates 1 and 6 sealed together with a predetermined gap therebetween. Scan electrodes 4 and sustain electrodes 5 are formed in parallel pairs on the glass substrate 1, and they are covered with a dielectric layer 2 and a protection film 3. A plurality of address electrodes 8 is formed on the glass substrate 6, and they are covered with an insulating layer 7. Barrier ribs 9 are formed on the insulating layer 7 between the address electrodes 8, and phosphors 10 are formed on the surface of the insulating layer 7 and between the barrier ribs 9. The glass substrates 1 and 6 are provided facing each other with discharge spaces 11 formed between them. A portion of the discharge space 11 between an address electrode 8 and a crossing part of a pair of a scan electrode 4 and a sustain electrode 5 forms a discharge cell 12.
As shown in FIG. 2, the PDP electrodes have an n×m matrix format. The address electrodes A1 to Am are arranged in the column direction, and n scan electrodes Y1 to Yn and n sustain electrodes X1 to Xn are arranged in pairs in the row direction.
A subfield in the typical PDP driving method includes a reset period, an address period, a sustain period, and an erase period (waveforms within a subfield will be described for ease of description.)
In the reset period, charge states of the display cells are reset so that address operations may be effectively performed. In the address period (also known as a scan period or a write period), cells which are to be turned on are selected, and wall charges are accumulated in the selected cells (addressed cells). In the sustain period, a discharge for displaying actual images is performed. In the erase period, the wall charges on the cells are reduced, and the sustain discharge is terminated.
FIG. 3 shows a conventional PDP driving waveform and a quantity of light emitted by a subfield.
As shown in the conventional PDP driving method, a minimum unit of light, is a light of the subfield with a weight of 1. It is represented as the sum of the light generated during the address period, the sustain period, and the reset period of the second subfield, which is immaterial. In other words, in the period of the first subfield, an address discharge (address light) forms positive wall charges at the scan electrode in the address period. The voltage at the scan electrode Y is set higher than the voltage at the sustain electrode X, to apply a sustain discharge voltage of Vs between them, thereby performing a sustain discharge (sustain light) in the sustain period. Next, the minimum unit of light is represented through a reset operation of the reset period of the second subfield. In this instance, the light emitted in the reset period is a bit less, so it is immaterial. The light for representing the second subfield (the weight of 2) is represented through the address discharge (address light) and the three sustain discharges (the sustain discharge voltage of Vs alternately applied to the scan electrode Y and the sustain electrode X) in the sustain period.
Therefore, since the minimum unit of light in the conventional PDP driving method includes light generated from an address discharge (address light) and a sustain discharge (sustain light), it is restricted in realizing the lower brightness. Further, since high Xe is currently used to increase emission efficiency, which increases the light generated by a single sustain discharge, a much lower minimum unit of light may be required to increase the representation performance of the low gray scales. Also, big differences of the representation performance of the low gray scales may be generated according to the brightness per sustain discharge pulse when representing low gray scales with few sustain discharge pulses.

Plasma display panel driving method, plasma display panel gray displaying method, and plasma display device