A semiconductor device including a plurality of input/output cells and having a first bond pad and at least one second bond pad coupled to each input/output cell. The first bond pads comprise a first pattern, and the at least second bond pads comprise at least one second pattern, wherein the at least one second pattern is different from or the same as the first pattern. Either the first bond pads, the at least second bond pads, or both, may be used to electrically couple the input/output cells of the semiconductor device to leads of an integrated circuit package or other circuit component.

Semiconductor devices are fabricated by forming active devices on or within a semiconductor wafer or work piece. Hundreds or thousands of integrated circuits or die are typically manufactured on a single work piece. Typically, a plurality of insulating, conductive, and semiconductive material layers are sequentially deposited and patterned over the workpiece to form the integrated circuits. One of the uppermost-formed material layers typically comprises a layer for bond pads that make electrical connection to the underlying active areas and components within the workpiece. After the integrated circuits are formed on the workpiece, the semiconductor wafer is then singulated into individual die. In most applications, each individual die is then packaged into an integrated circuit package. Integrated circuit packages may be adapted to contain one individual die, or they may be adapted to contain a plurality of individual die, for example, in the case of multi-chip modules.
A prior art packaged integrated circuit 11 is shown in FIG. 1. The packaged integrated circuit 11 includes a package 13 which may comprise plastic or metal, as examples. A plurality of leads 15 are disposed along the sides of the package 13 as shown, although alternatively, the leads 15 may be disposed on the top or the bottom surfaces of the package 13 (not shown). The leads 15 may be arranged in many different types of configurations, as is well known in the art.
An integrated circuit die 17 or semiconductor device is disposed within the package 13. The semiconductor device 17 has a plurality of bond pads 19 disposed on a surface of the semiconductor device 17. To make electrical connection from the bond pads 19 of the semiconductor device to the leads 15, wiring 21 is typically used. The wiring 21 is often referred to in the art as wire bonds, which may be soldered or spot-welded to a bond pad 19 on a semiconductor device 17 at one end, and routed to and bonded to a lead 15 of the integrated circuit package 13 at the other end. The semiconductor device 17 shown in FIG. 1 includes bond pads 19 disposed on a top surface thereof. Alternatively, the bond pads 19 may be disposed on the bottom surface or other areas of the semiconductor device 17. The bond pads 19 may be arranged in a variety of patterns.
FIGS. 2 and 3 are exemplary of two of the several different types of bond pad patterns used in the semiconductor industry. FIG. 2 shows a top view of a portion of a semiconductor device 100, wherein bond pads 104a and 104b are positioned in a traditional bond pad pattern. The semiconductor device 100 includes a plurality of input/output cells 102a and 102b formed in an upper layer of the semiconductor device 100. The input/output cells 102a and 102b are electrically coupled to active areas within a semiconductor workpiece, not shown. The active areas may reside beneath the input/output cells 102a and 102b, or they may be coupled to the input/output cells 102a and 102b using conductive lines beneath or located to the side of the input/output cells 102a and 102b, for example.
In a traditional bond pad pattern, the bond pads 104a and 104b are staggered and are disposed to the side of the input/output cells 102a and 102b, as shown. The bond pads 104a and 104b are typically coupled to the input/output cells 102a and 102b, respectively, by one or more conductive pins 106a/108a and 106b/108b, respectively. In the prior art semiconductor device 100 shown, there is one bond pad 104a or 104b for each input/output cell 102a and 102b, respectively. Conductive pins 108a and 108b typically are formed in the same interconnect layer as the bond pads 104a and 104b, while conductive pins 106a and 106b may, for example, partially reside in a via layer.
FIG. 3 shows another type of bond pad pattern, referred to in the art as a circuit under pad (CUP) bonding style. In this semiconductor device 120, the bond pads 122a and 122b are disposed directly over an associated input/output cell 102a and 102b, respectively, as shown. Again, one or more conductive pins 124a/126a and 124b/126b may be used to electrically couple each input/output cell 102a and 102b to the bond pads 122a and 122b, respectively.
One problem in the manufacturing and packaging of semiconductor devices is that the semiconductor devices must be selected according to the pattern of the bond pad desired. For example, when designing circuits, a designer must select whether the traditional bond pad style device 100 as shown in FIG. 2 or a CUP bonding pad style device 120 as shown in FIG. 3 will be used in the circuit design. Semiconductor device manufacturers are often required to provide many types of bond style patterns in order to accommodate their customers' needs. This results in increased costs for the semiconductor device manufacturer because of the many different bond pad pattern designs in use in the industry today. Each different bond pad pattern requires a different lithography mask for patterning the bond pads, for example.
Thus, what is needed in the art is a bond pad scheme that gives circuit designers increased choices of bond pad designs, and reduces the number of bond pad patterns that semiconductor device manufacturers are required to manufacture.

Semiconductor device with two or more bond pad connections for each input/output cell and method of manufacture thereof

Taiwan Semiconductor Manufacturing Company, Ltd.


Embodiments of laminated stator cores suitable for usage in high temperature applications are provided, as are embodiments of methods for manufacturing high temperature laminated stator core. In one embodiment, the method includes obtaining a plurality of coated laminates each comprising a laminate over which a coating precursor layer is formed. The coating precursor layer contain inorganic dielectric particles having a softening point. The plurality of coated laminates are arranged in a laminate stack, which is then fired at temperatures equal to or greater than the softening point of the inorganic dielectric particles. During firing, a compressive force is applied to the laminate stack sufficient to consolidate the inorganic dielectric particles into a plurality of coherent interlaminate dielectric layers electrically insulating and bonding together the plurality of coated laminates as the high temperature laminated stator core.

Electromagnetic devices, such as motors, sensors, generators, and actuators, commonly include spoked stator cores supporting a number of electromagnetic coils. During operation of the electromagnetic device, the electromagnetic coils magnetically interact with a rotor to provide the desired transducer functionality, such as converting electrical signals to rotor rotation, converting rotor rotation to electrical signals, or converting rotor rotation to power generation. The electromagnetic coils are wound around or inserted over the spokes or posts of the stator core, which is at least partially composed of a magnetically-permeable alloy, such as an electrical steel. Cost savings can be realized by producing the stator core as a monolithic structure composed entirely of the magnetically-permeable alloy. Alternatively, the stator core can be produced from laminated stack of magnetically-permeable plates or "laminations," which are separated by intervening dielectric layers (referred to herein as "interlaminate dielectric layers"). While more costly than solid stator cores, laminated stator cores can significantly reduce eddy current loses and, in turn, enhance the efficiency and power density of the electromagnetic device into which the stator core is integrated. As conventionally produced, however, laminated stator cores are generally unsuitable for usage in high temperature applications, such as applications characterized by operating temperatures exceeding about 260 degrees Celsius (° C.) or about 500 degrees Fahrenheit (° F.).
Any one of a number of factors can contribute to the temperature limitations of conventional laminated stator cores. In many cases, laminated stator core temperature limitations are due to the presence of organic dielectric materials within the stator core. As do organic materials, generally, such organic dielectric materials tend to breakdown and decompose at elevated temperatures exceeding the aforementioned threshold. Other factors that can limit the thermal tolerances of laminated stator cores include degradation of the electrically-insulative properties of the interlaminate dielectric due to unfavorable interactions with the laminate alloy under high temperature operating conditions (e.g., mass migration of metal ions from the laminate into the dielectric) and/or the rapid oxidation of the laminates when exposed to air under high temperature conditions. In the majority of applications, such temperature limitations are immaterial as the laminated stator cores are not exposed to such highly elevated operating temperatures. However, in applications wherein the stator cores are subject to such temperatures, the thermal capabilities of conventional laminated stator cores can be undesirably limiting. Such applications can include, but are not limited to, utilization of the laminated stator cores within electromagnetic devices, such as motors, sensors, actuators, generators, or magnetic bearings, deployed within the hot section of a gas turbine engine.
There thus exists an ongoing demand for the provision of laminated stator cores capable of prolonged and reliable operation in highly elevated temperature environments, such as environments characterized by temperatures exceeding about 260° C. (˜500° F.) and, possibly, approaching or exceeding about 500° C. (˜930° F.). It is also desirable to provide embodiments of a method for manufacturing such high temperature laminated stator cores. Other desirable features and characteristics of the present invention will become apparent from the subsequent Detailed Description and the appended Claims, taken in conjunction with the accompanying Drawings and the foregoing Background.

High temperature laminated stator cores and methods for the manufacture thereof


A ceiling fan comprising upper and lower transparent dome-shaped light housings connected together by an annular ring. A neon light is positioned about the fan motor between the light housings such that illumination from the neon tube shines therethrough. Power supply electrical wires extend from the ceiling through the down rod of the fan, then through the hollow shaft of the motor into a switch housing. A light circuit is positioned within the switch housing and connected to the power supply electrical wires. High voltage electrical wires extend from the light circuit through the hollow shaft and to the neon light for powering the neon tube to cause illumination thereof.

1. Field of the Invention
This invention relates to ceiling fans. More particularly, this invention relates to ceiling fans including a neon light.
2. Description of the Background Art
Motor driven fans suspended from the ceiling were used extensively in homes in the United States to provide air circulation before the introduction and popularization of central cooling units.
When the energy crisis dawned in the 1970's, the cost of a kilowatt hour skyrocketed in price and consumers searched for ways to reduce their heating and cooling costs. It has been well established that properly circulated air will raise the overall thermal efficiency of the home air conditioning and cooling system and hence, reduce the cost of maintaining a home at a desired comfort level year-round. Thus, ceiling fans were repopularized in the 1970's.
Indeed, ceiling fans have become so popular that competitiveness in the industry often depends upon the aesthetic features of one ceiling fan versus another. Hence, ceiling fans are usually designed with aesthetically pleasing motor housings and fan blades. Furthermore, a large variety of stylized lights are being designed which may be readily connected to the ceiling fan's switch housing. Most predominantly, such light kits comprise three of four stylized bulb reflectors (for conventional incandescent bulbs), each of which may be pivoted in a different direction for spot lighting.
As a substitute for incandescent lighting, it has recently been proposed to further enhance the aesthetic features of ceiling fans by incorporating neon light tubes into the structure of the fan. For example, in U.S. Pat. No. 5,028,206 entitled "Illuminated Ceiling Fan", issued Jul. 2, 1991, a neon ceiling fan is disclosed including a plurality of neon tubes positioned about each of the fan blades, about the outer periphery of the motor housing, and vertically along the down rod which supports the fan from the ceiling. Unfortunately, a significant safety hazard is created by such positioning in the sense that the neon tubes are exposed and may be readily burst if a consumer (e.g. person or child) accidentally hits the fan with a broom or a toy. Furthermore, the positioning of the neon tubes about the fan blades subjects the neon tubes to excessive centrifugal forces as the fan blades rotate during use. Finally, in order to comply with typical safety standards, such as Underwriters Laboratory (UL), the high-voltage connections to each of the neon tubes must be appropriately insulated and sealed from tampering by the consumer.
Therefore, it is an object of this invention to provide an apparatus which overcomes the aforementioned inadequacies of the prior art devices and provides an improvement which is a significant contribution to the advancement of the ceiling fan art.
Another object of this invention is to provide a ceiling fan comprising an upper and lower dome-shaped housing, means for connecting the upper and lower light housings together to create a space therebetween, motor means positioned within the space between the light housings, the motor means having a rotatable rotor, means for non-rotatably connecting the motor means to a down rod through which extends electrical wires for supplying power to the motor means, a plurality of fan blades connected to the rotatable rotor for rotation when the motor means is powered, a switch housing, switch means contained within the switch housing for controlling the operation of the motor means, at least one neon light positioned within the space between the light housings, the light housings permitting illumination from the neon tube to shine therethrough, and circuit means positioned within the switch housing for powering the neon tube to cause illumination thereof.
Another object of this invention is to provide the ceiling fan as noted above wherein the circuit means comprises in combination means for transforming conventional 120 volt AC power to a high voltage DC power, means for pulsing the high voltage DC power to create substantially AC power at a higher frequency, and means for supplying the AC power at the higher frequency to terminals on the neon tube.
The foregoing has outlined some of the more pertinent objects of the invention. These objects should be construed to be merely illustrative of some of the more prominent features and applications of the intended invention. Many other beneficial results can be obtained by applying the disclosed invention in a different manner or modifying the invention within the scope of the disclosure. Accordingly, other objects and a fuller understanding of the invention may be had by referring to the summary of the invention and the detailed description of the preferred embodiment in addition to the scope of the invention defined by the claims taken in conjunction with the accompanying drawings.

Chien Luen Industries Company, Ltd., Inc.


A light guiding component is provided in an eyeball tracking module which includes a first substrate and a second substrate disposed opposite to each other, a first electrode disposed on the first substrate, a second electrode disposed on the second substrate, and at least one liquid crystal structure disposed between the first electrode and the second electrode. The liquid crystal structure includes liquid crystal molecules. The first electrode and the second electrode are configured to control a deflection direction of the liquid crystal molecules with an applied voltage, such that a light ray incident to the light guiding component, which meets a threshold condition, is emitted along a predetermined direction.

Eyeball tracking technology is a technique that utilizes various detection methods such as mechanical, electronic, and optical to obtain a current "gaze direction" of a subject. With the rapid development of computer vision, artificial intelligence technology, and digital technology, eye tracking technology has become a hot research field, and has been widely used in the field of human-computer interaction. For example, it can be applied to virtual reality, augmented reality, vehicle assisted driving, user experience, cognitive impairment diagnosis and other fields.

Light guiding component and manufacturing method thereof, eyeball tracking module and method, video eyeglass

Beijing BOE Optoelectronics Technology Co., Ltd.


A keyboard system for activating equipment to be operated, including: a keyboard for generating activation signals, a wireless transmitter for wirelessly transmitting the activation signals; and a receiver connectable to the equipment to be operated for receiving the activation signals from the transmitter.

1. Field of the Invention
The invention relates to a keyboard, in particular a membrane keyboard, for the activation of equipment to be operated, in particular for the activation of a PC (personal computer).
2. Description of the Prior Art
Stationary operator control panels are used in all areas of technology. Operator control panels with membrane keyboards have been increasingly used for years. In the last twenty years, constant innovative development of these membrane keyboards has made this reliable electronic component become an important interface for data input and for man-machine dialog. The connection of the keys takes place by means of the membrane cable and can be made to be any length. Up to now, the end of the membrane cable has been designed either for direct or indirect plug connections. Consequently, its use is restricted to stationary applications and is preferably in the areas of automation, mechanical engineering, control technology, measuring technology, medical technology, communication technology and office automation.

Keyboard, in particular a membrane keyboard


A vehicle window opening and closing control device has a driver seat unit that is provided in a driver seat of a vehicle, and a sub-switch that is provided in a seat other than the driver seat. The driver seat unit includes a main switch that operates opening and closing of a first window of the driver seat and a second window of the seat other than the driver seat and a controller that controls a driver seat motor provided in the driver seat and an other-seat motor provided in the seat other than the driver seat to perform manual opening and closing and automatic opening and closing of the first and second windows based on the operation of the main switch. The sub-switch is a switch that performs only the manual opening and closing of the second window using the other-seat motor.

1. Technical Field
The present invention relates to a control device that opens and closes a vehicle window, particularly to a window opening and closing control device that can open and close all windows of seats by a switch operation at a driver seat.
2. Related Art
In a power window device that opens and closes a window of a vehicle using an electric motor, the motor is rotated in a normal rotation direction or a reverse rotation direction to open and close the window according to an operation situation of an operation switch. For example, the motor is driven in the normal rotation direction to close the window when the operation switch is operated onto an UP side (a window closing side), and the motor is driven in the reverse rotation direction to open the window when the operation switch is operated onto a DOWN side (a window opening side). Based on a signal from the operation switch, the normal rotation and the reverse rotation of the motor are controlled by switching a direction of a current passed through the motor in a motor driving circuit.
Generally, in an automobile, the operation switches are provided in each of a driver seat and other seats (such as a passenger seat, a left rear seat, and a right rear seat) other than the driver seat. The operation switch provided in the driver seat (a main switch) includes other seat switches that remotely control the opening and closing of the windows of the other seats such as the passenger seat in addition to a driver seat switch that operates the opening and closing of the window of the driver seat. The operation switch provided in each of other seats (a sub-switch) operates only the opening and closing of the window of the seat. A controller is provided in order to control the opening and closing of the window based on the operation of the main switch or the sub-switch. The vehicle window opening and closing control device is also equipped with a function of detecting a foreign substance caught in the window to stop window closing action or to invert the window closing action to window opening action.
Japanese Unexamined Patent Publication No. 2008-19625 discloses a window opening and closing control device, in which the controller is provided in each of the main switch of the driver seat and the sub-switches of the other seats and each controller manually or automatically drives the motor according to the switch operation of each seat. In the window opening and closing control device, the controllers of the seats are connected to one another by a serial communication line. In the case that the window opening and closing operation of each of the other seats is performed using the main switch of the driver seat, the controller of the driver seat conducts communication with the controller of the corresponding seat through the serial communication line, and the controller of the corresponding seat drives and controls the motor. Although the detection of the catch is not described in Japanese Unexamined Patent Publication No. 2008-19625, a sensor that detects a position of the window is disposed in each seat, and the controller of each seat possibly receives an output of the sensor to detect the catch.
Japanese Unexamined Patent Publication No. 6-343279 discloses a window opening and closing control device in which one controller receives the output from the main switch of the driver seat or the sub-switch of each of other seats to control a window driving motor of each seat. In the window opening and closing control device, the catch is detected based on a detection result (a current value) of the current passed through the motor and a detection result of the window position by an encoder.
Japanese Unexamined Patent Publication No. 2009-108493 discloses a window opening and closing control device in which a ripple of the current passed through the motor is detected and the number of rotations of the motor is calculated based on the detection result to control the opening and closing of the window. In the window opening and closing control device, the current passed through motor is monitored during the window closing action, a determination that the catch is generated is made when the current value exceeds a predetermined threshold, and the motor is rotated in a reverse direction to open the window.
Japanese Unexamined Patent Publication No. 2012-82647 discloses a window opening and closing control device in which a control unit (a driver seat unit) on the driver seat side and a control unit (other-seat unit) on the other-seat side are connected to each other by a single signal line. In the window opening and closing control device, when the window opening and closing operation is performed by the driver seat unit, the direction of the current passed through the motor is switched using contacts of a window closing switch and a window opening switch of the other-seat unit. The detection of the catch is not described in Japanese Unexamined Patent Publication No. 2012-82647.
One or more embodiments of the present invention constructs a window opening and closing control device, which has a simple configuration in which the number of wirings between a driver seat and a seat other than the driver seat is decreased, can perform manual action and automatic action of windows of all the seats from the driver seat unit, and can detect the catch in the windows of all the seats by the driver seat unit.

Vehicle window opening and closing control device


A highly efficient pelletizing system for making thermoplastic micropellets includes and extruder for extruding molten thermoplastic into thermoplastic strands. A rotor cuts the strands into micropellets. The rotor has more than four teeth per inch and operates at a very high speed.

This invention relates to plastic strand granulation and, more specifically, to an improved rotary helical cutter and method for manufacturing thermoplastic micropellets.
Thermoplastic micropellets are similar to thermoplastic pellets, but are much smaller. Micropellets have a diameter of about 0.020 inches and a length of about 0.020 inches. Thermoplastic micropellets have many uses. For example, micropellets are used as a blasting media.
Thermoplastic pellets are produced by extruding a thermoplastic strand. After cooling, the strand is send to a granulator. Within the granulator, a rotor cuts the thermoplastic strands into pellets.
Granulators for making traditional pellets have been used to make the thermoplastic micropellets. The results have not been entirely satisfactory.
Because traditional thermoplastic pellets are often melted before being formed into a final product, the shape and size of the pellets could vary without cause for concern. Micropellets, on the other hand, are an end product. Because they are often used as a projectile in a machine, the tolerances for the shape of the micropellet are much higher.
The waste from conventional granulators has been very high. To achieve even this modest level of yield, the machines must operate relatively slowly. Such a low yield coupled with a relatively slow operating speed results in increased costs in manufacturing micropellets as well as delays in production.
An improved apparatus and method for manufacturing micropellets at high efficiency and with an increased speed is highly desirable.

System and apparatus for manufacturing thermoplastic micropellets


Disclosed are a flexible wiring board in which the thickness of at least one part of the insulating film support to be bent in actual use of the board is made thinner than that of the other parts of it and the surfaces of the conductive patterns containing the part to be bent are covered each with a silicone rubber coveray, and a method of preparing the board. The board has sufficient flexibility enough to be well bent at the determined part in actual use thereof with ensuring the reliability of connection at the bent part.

As a means of connecting an electrode terminal of a tabular display device having liquid crystals or electro-luminescent elements and a driving electronic circuit board (hereinafter referred to as an "external board"), in general, a flexible wiring board is used. For the purpose of making devices small-sized and lightweight, a method of loading driving IC chips onto a flexible tape carrier by means of TAB (tape automated bonding) technique and connecting the tape carrier, which is used as a flexible wiring board, and an external board is widely used. In any case, such a flexible wiring board (or tape carrier) is frequently bent in actual use thereof for connecting it with an external board as arranged on the back of a display device for the purpose of attaining close contact between the connected parts with each other.
The flexibility of a conventional flexible wiring board is insufficient for using it as a bent form. Therefore, in such a conventional flexible wiring board as shown in FIG. 5, the insulator film (1) in the part to be bent is removed to form a through-hole (8b) so as to ensure the flexibility of the part before the board is bent. However, in a flexible wiring board having a through-hole through the insulator film in the part to be bent, since the conductive pattern (3) is exposed in the bent part (8), the exposed part is susceptable to short-circuiting or wire-cutting. Where a complete through-hole is formed along the whole of the part of the board to be bent, the tensile strength of the board would lower at the part having the through-hole, so that there occurs another problem that the board itself would be broken during handling.
In a conventional flexible wiring board, in general, a conductive pattern formed on an insulator film is covered with a cover layer (6) of an epoxy resist for the purpose of preventing lowering of the function of the conductor due to adhesion of dust or water to the surface of the pattern. However, the cover layer is often cracked when the board is bent so that dust or water can penetrate into the pattern through the cracks to also cause short-circuiting or breaking and corrosion of the conductor.

Flexible wiring board and method of preparing the same


The apparatus includes a riveting assembly (10) which includes a rivet die (18) having a concave configuration which is brought into contact with one end of a rivet to be upset. The die (18) is driven into a rivet end by a rivet ram (16) a first time, resulting in an interference fit between the rivet shank and the part being riveted. When the die (18) is withdrawn, the newly formed rivet head will in some instances expand outwardly away from the surface of the part, leaving a gap between the formed end of the rivet and the part. A second strike assembly includes an L-shaped second strike element (28) which is moved between the die (18) and the rivet head. The ram (16) is then driven a second time, forcing the second strike element (28) against the formed end of the rivet, forcing the formed end of the rivet to flow outwardly and toward the part, resulting in the filling of the gap between the rivet head and the surface of the part.

Fatigue life has always been a significant concern with respect to rivets in high performance applications, such as on an aircraft. It is known that fatigue life can be increased for aircraft applications, often significantly, by an interference fit between the rivet and the particular aircraft part in which the rivet is installed. An interference fit is obtained with a rivet which is initially somewhat smaller than the diameter of the opening in the aircraft part hole and requires significant opposing pressure during rivet installation in the axial dimension of the rivet, i.e. longitudinally of the rivet, and with specially shaped rivet die at each end of the rivet. The dies are positioned on the ends of opposing rivet rams which produce the rivet upset. The interference fit results in the diameter of the opening in the aircraft part being slightly increased, with the aircraft part material in the vicinity of the hole being maintained in a state of compression which in turn results in an enhanced fatigue life.
One undesirable consequence of an interference fit, particularly when automatic riveting machines are used, is the phenomenon known as rivet shanking, also referred to as "head-gapping". Rivet shanking occurs when the rivet forming die on the end of the ram is moved away from the head of a rivet after the rivet has been installed. The head of the rivet will, under certain conditions, move or rebound slightly away from the surface of the part once the forming die is withdrawn, leaving a space (a gap) between the underside of the rivet head and the part surface. The gap distance, i.e. the distance between the underside of the rivet head and the aircraft part, will vary from rivet to rivet, but can exceed the maximum gap allowable by aircraft manufacturers, which is typically between 0.0015 and 0.0030 inches. This phenomenon is often referred to as rivet shanking because the shank of the rivet, which is the cylindrical portion thereof, is in the opening in the part and a rivet is rejected if the inspector can slide a feeler gauge of a particular thickness, such as 0.002, underneath the head of the rivet to contact the shank.
Typically, the tendency toward shanking is increased when the ratio of rivet length to rivet diameter is relatively large. Further, the newer aluminum alloys used in aircraft, while possessing higher strength, are also more elastic, resulting in an increase in shanking.
There have been many different attempts, several quite sophisticated and complex, to solve the rivet shanking problem. However, to date, no method has been particularly successful.

Apparatus and method to prevent rivet shanking


A binder composition for nonaqueous battery electrodes essentially contains (A) an ethylenically unsaturated monomer and (B) a surfactant, and further satisfies any two or more conditions of the following (I) to (III): (I) (A) the ethylenically unsaturated monomer includes (a) a phosphoric acid group-containing ethylenically unsaturated monomer; (II) (B) the surfactant comprises (b) a phosphoric acid group-containing surfactant; and (III) the composition including (C) a neutralizing agent containing an alkali metal compound and/or an alkali earth metal compound.

Typical examples of nonaqueous batteries include lithium ion secondary batteries. The nonaqueous batteries are used, in terms of reduction in size and weight of power sources, as power sources for notebook personal computers, mobile telephones, electric power tools, and electronic communications equipment. Recently, they have also used, from the point of view of their applicability to environmental vehicles, for electric vehicles and hybrid electric vehicles. Under such circumstances, higher output, higher capacity, and longer life of the nonaqueous batteries is strongly desired.
The nonaqueous battery is a secondary battery comprising a positive electrode using a metal oxide or the like as an active material, a negative electrode using a carbon material such as graphite as an active material, and an electrolyte solvent with a carbonate or a flame-retardant ionic liquid as a main ingredient, in which charge and discharge of the battery is performed by the movement of ions between the positive electrode and the negative electrode. Particularly, the positive electrode is obtained by coating the surface of a positive electrode collector such as aluminum foil with a slurry comprising a metal oxide and a binder, drying the coating, and then cutting the coated positive electrode collector to a suitable size. The negative electrode is obtained by coating the surface of a negative electrode collector such as copper foil with a slurry comprising a carbon material and a binder, drying the coating, and then cutting the coated negative electrode collector to a suitable size. Therefore, each binder has a role of binding active materials to each other and binding an active material to a collector to prevent peeling of active materials from a collector.
As the binder, a polyvinylidene fluoride (PVDF)-based binder using N-methyl-2-pyrrolidone (NMP) of an organic solvent system as a solvent is well known (PTL 1). However, this binder has a low binding property between active materials and between an active material and a collector, and a large amount of binder is required for practical use. As a result, the capacity of the resulting nonaqueous battery is reduced, which is a defect. In addition, since an expensive organic solvent NMP is used for binders, there is a problem also in the price of end products and the preservation of work environment during the production of a slurry or a collector.
As a method for solving these problems, the development of a water-dispersed binder has been advanced. For example, there is known a styrene-butadiene rubber (SBR)-based aqueous dispersion in which carboxymethyl cellulose (CMC) is used in combination as a thickener (PTL 2). Since this SBR-based dispersion is an aqueous dispersion, it is inexpensive and advantageous from the point of view of the preservation of work environment. Further, since the binding property between active materials and between an active material and a collector is relatively satisfactory, electrodes can be produced by using a smaller amount of the SBR-based dispersion than the amount of the PVDF-based binder. As a result, there is an advantage that higher output and higher capacity of nonaqueous batteries can be achieved. From these advantages, the SBR-based dispersion is widely used as a binder for nonaqueous battery electrodes.
However, also in this binder, the binding property between active materials and between an active material and a collector is not necessarily sufficient, and when an electrode is produced with a small amount of binder, a part of an active material is peeled off in the step of cutting a collector, which is problematic. Further, the SBR-based binder has low elution resistance and swelling resistance to a nonaqueous solvent used for electrolytes and thus has a problem that longer life cannot be achieved for a nonaqueous battery obtained by using the binder.
Under such a background, PTL 3 proposes a method involving using a non-diene-based polymer essentially comprising of styrene and an ethylenically unsaturated carboxylic acid ester as a water-dispersed binder instead of conventional SBR. It is disclosed that when this binder is used, the binding property between active materials and between an active material and a collector is satisfactory, and that a charge-discharge cycle property is improved. However, there is still room for improvement in the electrolyte resistance and charge-discharge cycle property.
Further, PTLs 4 to 6 proposes that an acidic group-containing ethylenically unsaturated monomer is polymerized and used as a binder for secondary battery electrodes. They mention, as the acidic group-containing ethylenically unsaturated monomer, a carboxylic group-containing ethylenically unsaturated monomer, a sulfuric acid containing ethylenically unsaturated monomer and a phosphoric acid group-containing ethylenically unsaturated monomer. However, there is still room for improvement in the charge-discharge cycle property.

Composition for binder for non-aqueous cell electrode, binder for non-aqueous cell electrode, composition for non-aqueous cell electrode, non-aqueous cell electrode, and non-aqueous cell


A method is disclosed to add functionality to a terminal of a high voltage integrated circuit without the penalty of additional high voltage circuitry. The benefit is that alternative modes of operation can be selected for testing, trimming parameters of the integrated circuit, or any other purpose without the cost of an additional terminal. In one embodiment, ordinary low voltage circuitry monitors the voltage on the terminal that normally is exposed to high voltage. The configuration of a simple voltage detector and an ordinary latch allows easy entry into the test and trimming mode when the integrated circuit is not in the intended application, but prohibits entry into the test and trimming mode when the integrated circuit operates in the intended application.

1. Field of the Invention
The present invention relates generally to integrated circuits, and more specifically, the present invention relates to integrated circuits that switch high voltages in power converters.
2. Background Information
It is a common practice in the design of integrated circuits to include functions and modes of operation that are not used when the integrated circuit is in its intended application. These alternative modes of operation may be used instead for a variety of purposes in the production of the integrated circuits and in the maintenance of equipment that uses them. For example, it may be desirable to operate the integrated circuit at special frequencies, voltages or currents that reduce the time to test the device or that increase the accuracy and reliability of testing. The manufacturing process of some integrated circuits includes an adjustment or trimming of internal parameters after the integrated circuit is assembled as part of the final test. Final adjustment may be accomplished by selecting a special trimming mode of the integrated circuit. While in the trimming mode, parameters may be adjusted by appropriate manipulation of signals at the terminals of the integrated circuit. The trimming mode may then be disabled after the adjustments are completed.
An alternative mode of operation could also be an alternative normal mode of operation, as distinguished from a test mode or a trimming mode. A normal mode of operation is one in which the integrated circuit operates in its intended application. An alternative mode of operation that is also a normal mode of operation might relate to the frequency of a switching power supply. For example, one normal mode of operation could use a fixed frequency whereas another normal mode of operation could use a variable frequency. Some integrated circuits are field programmable, such that the user in each specific application may select the particular mode of operation.
The technology of most integrated circuits limits the voltage on the terminals to the maximum power supply voltage for the device, which is typically about 40 volts, but can vary depending on the manufacturing process and the feature size of the devices that comprise the integrated circuit. The voltage is measured with respect to a ground reference terminal that is usually a power supply terminal. The ground reference terminal is typically at the most negative electrical potential of the integrated circuit. In the subsequent discussion, such voltages that are usually less than about 40 volts are referred to as using ordinary low voltages. Terminals that can withstand a maximum voltage less than about 40 volts are referred to as low voltage terminals. Terminals that can withstand a maximum voltage substantially greater than about 40 volts are referred to as high voltage terminals.
Some terminals of the integrated circuit may be limited to a substantially lower voltage than the maximum power supply voltage. In the integrated circuits that are limited to ordinary low voltages, virtually any terminal of the device can be used to select alternative modes of operation without difficulty because only low voltage circuits are required to monitor the state of any terminal and to respond to any voltages that may be applied to the terminal.
Not all integrated circuits operate from low voltages. In the category of high voltage integrated circuits at least one terminal is exposed to high voltage in the intended application. These devices typically integrate ordinary low voltage circuitry with a high voltage power semiconductor. The high voltage terminal operates at voltages typically greater than 100 volts, which is substantially greater than the other terminals will tolerate without damage. A common application for high voltage integrated circuits is in switching power supplies. For applications in off-line alternating current (AC)-direct current (DC) power supplies, the voltage at the high voltage terminal can be in the neighborhood of 700 volts.
It will be recognized by one skilled in the art that the distinction between high voltage terminals and low voltage terminals is fundamentally one of relative voltage and not absolute voltage. For example, an integrated circuit technology may use materials or geometries such that ordinary low voltages are less than 1 volt, and any voltage greater than 10 volts is considered to be high voltage.
An objective in the design of integrated circuits is to realize the desired functions at the lowest cost. Two factors that influence the cost of the integrated circuit are the amount of semiconductor material and the number of terminals. Since high voltage devices are larger and therefore use more semiconductor material than low voltage devices, it is advantageous to minimize the number of circuits that are exposed to high voltage in the integrated circuit. It is also advantageous to use each terminal of the integrated circuit for as many functions as possible to minimize the number of terminals.

Method and apparatus for mode selection for high voltage integrated circuits


Although various embodiments of the method and apparatus of the present invention have been illustrated in the accompanying Drawings and described in the foregoing Detailed Description, it will be understood that the invention is not limited to the embodiments disclosed, but is capable of numerous rearrangements, modifications and substitutions without departing from the spirit of the invention as set forth herein.

1. Field of the Invention
The present invention is directed to automated test equipment (ATE) systems and in particular, to a method, system, and circuitry used to provide digital signal deskew between channels.
2. Background of the Invention
The fundamental operation of an ATE (automatic test equipment) system is to apply stimulus to a device under test (DUT) and capture the response of the DUT to that stimulus. During a digital test, this process consists of applying stimulus vectors—or patterns—to the DUT, waiting for the DUT to produce a stable response to the stimulus, and comparing the response to an expected pattern. Most ATE systems provide a way for the test programmer to control the timing of the response capture with respect to the stimulus. In addition, some ATEs provide the programmer the ability to manually move individual stimulus and response channels with respect to the other channels.
Excessive skew between the various channels of an ATE decreases the maximum pattern (vector) rate of the ATE system. The maximum pattern rate is one factor that can affect device test throughput. The reason the skew between ATE channels has an impact on vector rate can be seen by looking at FIG. 1.
Looking at FIG. 1, the stimulus to the DUT is applied by drivers. Signals arrive at the DUT at different times depending on individual driver speed. Once the signal from the slowest driver arrives, the DUT settling time can begin. The DUT response is captured by receivers in the ATE. Once the slowest receiver has captured the DUT response, the next vector period can begin. The minimum pattern application period (or maximum pattern application rate) is equal to the sum of the driver skew, DUT settling time, and receiver skew. In addition, an ATE system may have other restrictions that increase this minimum period.
The reality and practicality of the situation is that an ATE system may be providing and receiving test patterns and other related signals on thousands of channels connected to a device under test (DUT). Because of physical limitations of the electronic drivers, receivers and signal paths, there is a need to calibrate or deskew the multiple channels on the ATE so that they all are driving at the same moment in time and then also sampling signals from the DUT such that the ATE receives data on channels from the DUT at the same time.
In some cases, in order to test certain aspects of a DUT, it is desirable for a test programmer to intentionally add skew between channels in a controlled fashion. For example, if one ATE channel is supplying a clock to a flip-flop on the DUT and another ATE channel is supplying the data for that flip-flop, the skew between the two channels must be carefully controlled to make sure no setup or hold time specifications are violated. In general, this capability requires very tight control of the skew between ATE channels. Such control of skew cannot be achieved unless the skew of each channel of the ATE has been carefully calibrated to be known or minimal.
During ATE operation, and in order to provide channel-to-channel deskew or controlled skew between channels, most ATE incorporates individual channel or per-pin programmable delay elements. For drive channels, these delay elements are used to move the point in time at which a stimulus is applied to the DUT (hereinafter called the drive edge). For receive channels, similar delay elements control the point in time the DUT response is captured by the ATE (hereinafter the receive edge).
The delay elements used can take many forms, including transmission lines of adjustable length, commercial delay lines (usually consisting of cascaded L/C networks), and chains of logic gates. Any of these implementations will have variations in delay due to temperature, manufacturing process variations, power supply variations, and so forth. Because of these variations, each delay line must be characterized—or calibrated—so that the delays requested by the test programmer can be accurately set by the ATE software. This calibration must typically be repeated when the operating temperature of the system changes.
In the past, one technique used for the calibration of the drive/receive edges and signals was to use a separate instrument, along with the ATE, called a time interval analyzer. A time interval analyzer is basically a device that accurately measures the amount of time that elapses between two signal events. Each channel is routed to the time interval analyzer so that any delay or skew on the channel can be measured with respect to a common reference signal. This technique of calibrating the drive/receive edges of all the channels of an ATE have various disadvantages. One disadvantage is that calibration of the channels must be done in a serial fashion. That is, each channel driver and each channel receiver must be individually measured one after another. Second, a very expensive time interval analyzer is required to achieve the high amount of accuracy desired. Thirdly, the ATE must have a special infrastructure so that each channel (there may be thousands of channels) has a well matched or characterized path to the time interval analyzer so that no additional skew is inadvertently added to any channel.
What is needed is an ATE where the calibration is done for each channel in a parallel manner thereby decreasing calibration time and possible error due to environmental changes (e.g., temperature changes). Furthermore, what is needed is an ATE that does not require an external expensive time interval analyzer instrument to help calibrate the drive and receive edges of the ATE system.

Built-in waveform edge deskew using digital-locked loops and coincidence detectors in an automated test equipment system


Techniques are provided for optimizing performance of a processor. The techniques may be embodied as a method, an electronic device or a computer-readable storage media with instructions executable to perform the method. In summary, processing operations performed by a processor are identified. Each of the processing operations is evaluated to determine a resulting thermal profile associated with each of the processing operations. Based on the thermal profile associated with each of the processing operations, one or more of the processing operations are grouped in a set of processing operations to be performed together between idle times of the processor. The processing operations in the set are performed at a second speed that is higher than a first speed.

Many next generation electronic devices are being configured as always-on always-connected (AOAC) devices. Since these devices remain "on" for long durations of time, it is important to maximize the power consumption of these devices. However, high thermal profiles due to heat dissipation within the devices drain the battery lifetime and degrade performance of the devices. The Converge Platform Power Management (CPPM) protocol attempts to minimize power consumption of AOAC devices by assigning processing components to corresponding processing states that have varying power loads.


An economical branch pipe liner bag is provided. The branch pipe liner bag allows for a reduction in manufacturing cost, stabilized quality, and mass-production, and does not have any portion to be wasted when used. One end of a tubular resin absorbent material impregnated with an unhardened hardenable resin is outwardly folded and pressed to form an extension which is sandwiched between separate flange forming members to form a flange at the one end of the tubular resin absorbent material, thus constructing the branch pipe liner bag. Since the branch pipe liner bag has the flange formed at one end by integrally coupling the flange forming members, which are members separate from the tubular resin absorbent material, the flange forming members can be mechanically mass-produced independently of the tubular resin absorbent material, with the result that a manufacturing cost of these flange forming members is reduced, and consequently a manufacturing cost of the branch pipe liner bag is reduced.

1. Field of the Invention
The present invention relates generally to branch pipe lining techniques, and more particularly, to a branch pipe liner bag for lining the inner wall of a branch pipe. The present invention is also directed to a pipe lining method for lining a branch pipe and a main pipe.
2. Description of the Related Art
When a branch pipe of passageways or the like is lined, a branch pipe liner bag 101 having a flange 106 formed on one end thereof, as illustrated in FIG. 12, is used. The flange 106 is kept in close contact with the periphery of a branch pipe opening (a portion of a branch pipe 121 open to a main pipe 120) of a main pipe (sewerage line) 120, and the branch pipe liner bag 101 is everted upwardly into the branch pipe 121 by a fluid pressure, as indicated by broken lines in FIG. 12.
Then, after the branch pipe liner bag 101 is fully everted into the branch pipe 121, the branch pipe liner bag 101 is kept pressed onto the inner wall of the branch pipe 121, and a thermosetting resin impregnated in the branch pipe liner bag 101 is hardened. In this way, the branch pipe 121 is lined with the hardened branch pipe liner bag 101.
Conventionally, the branch pipe liner bag 101 has been manufactured by outwardly folding one end of a tubular resin absorbent material made of unwoven fabric or the like, impregnating a hardenable resin into the folded portion, and hardening the impregnated hardenable resin to integrally form the flange 106 (see, for example, Japanese Patent No. 2,528,430).
However, since the conventional branch pipe liner bag 101 is integrally formed with the flange 106 at one end thereof, its manufacturing must rely on manual works of craftsmen. This form of manufacturing implies problems of inaptitude for stabilized quality and mass production as well as a high manufacturing cost.
In addition, when branch pipe liner bags are to be manufactured for stock, they are manufactured slightly longer than actual lengths thereof so as to support a variety of different lengths of branch pipes. Therefore, during a lining operation, a branch pipe liner bag is cut to the actual length of a branch pipe which is to be lined, so that a portion of a branch pipe liner bag is wasted without serving for lining, causing a problem from an economical point of view.
Incidentally, when the branch pipe 121 has been lined as illustrated in FIG. 12, a main pipe liner bag 133 is everted into the main pipe 120 by a fluid pressure as illustrated in FIG. 13. Then, after the eversion of the main pipe liner bag 133 into the main bag 120 is completed, a hardenable resin impregnated in the main pipe liner bag 133 is hardened to line the main pipe 120. Finally, a portion of the main pipe liner bag 133 blocking the branch pipe opening is cut by a cutter, not shown, to allow the branch pipe 121 to communicate with the main pipe 120, as illustrated in FIG. 14, thus completing a sequence of lining operations for the branch pipe 121 and the main pipe 120.
In the conventional pipe lining method mentioned above, however, since the flange 106 of the branch pipe liner bag 101 is not always joined completely with the main pipe liner bag 133, underground water or the like is likely to introduce into the pipes from the joint of the flange 106 and the main pipe liner bag 133.

Branch pipe liner bag and pipe lining method


Variable focal length lens system comprises two adjacent lens units, one stationary, the other movable. These lens units are in order from an object side towards an image side. (i) A first lens unit possessing divergent refractive power. The first lens unit is the front most lens unit. It consists of a single negative lens component.. (ii) A second lens unit possessing convergent refractive power. The second lens unit, includes at least two positive power lens components and an aperture stop.

1. Field of the Invention
This invention relates to variable focal length lens systems consisting of a first lens unit possessing divergent refractive power and a movable second lens unit possessing convergent refractive power.
2. Description of the Prior Art
Variable focal length lens systems having a first divergent lens unit and a second convergent lens units are known. Such lens systems are disclosed in U.S. Pat. Nos. 4,099,844; 3,942,874 and 3,466,113. However, these lens system have an additional, third lens unit. These additional lens units increase the complexity and the cost of these lens systems. Each of these lens systems has six lens elements.
U.S. Pat. No. 4,585,314 discloses a verifocal lens system with a stationary first unit having divergent refractive power and a movable second unit possessing convergent refractive power. This lens system also comprises six lens elements. In addition this lens system is unfit for use as a taking lens (an objective lens) in a camera because it accepts a maximum full field angle of only 38 degrees.
U.S. Pat. No. 5,278,698 discloses magnifying projecting lens systems, some of which having a variable focal length. More specifically, the lens systems of embodiments 17-21 consist of a negative first lens unit (referred to as a negative first lens group), a positive second lens unit (referred to as a positive second lens group) and, a positive third lens unit (referred to as a positive third lens group). Although some of the embodiments have as few as four lens elements (see embodiment 19), all three of the lens units move in order to provide a variable focal length system. The patent states (col. 9, lns. 67,68 and col. 10, ln. 1) that "The focal length is changed by changing a distance between the second lens group and the third lens group and by moving the whole lens! system." Finally, these lens systems accept a field angle of only 50 degrees, have an F-number of F/4.8 to F/5.9, and have a zoom ratio of only 1.5.
Further need exists for a simple variable focal length (verifocal) lens system that has only one zooming lens unit, accepts a field angle of at least 60 degrees, provides larger numerical apertures and is capable of zoom ratios over 1.5, and that also has a small number of lens elements.

Variable focal length lens system having a divergent front lens unit


A surgical sleeve which includes an array of spaced apart protuberances on an interior wall surface. The spaced protuberance reduce the surface contact between the sleeve and the tip and define a network of generally uniform channels through which fluid may flow, irrespective of pressure applied to the sleeve. As a result, the sleeve is able to provide fluid flow which is better able to remove heat from the tip and provide a more uniform irrigation of the eye.

The natural crystalline lens of the eye plays a primary role in focusing light onto the retina for proper vision. However, the natural lens at times is replaced with an artificial lens to make a refractive correction or because of damage or injury to the natural lens. Under these circumstances, the natural lens is surgically removed from the eye.
Surgical procedures which require only a small incision to be made in the eye have been developed for removing the natural lens. In accordance with these procedures, a slender cutting tip of a surgical instrument is inserted through the incision to engage the natural lens. The cutting tip is typically subjected to ultrasonic vibrations to emulsify the lens (e.g., phacoemulsification). The emulsified portions of the lens are then aspirated from the eye through a central bore in the tip. A silicone sleeve surrounds the tip to define an annular conduit for the passage of fluid to cool the tip and irrigate the eye.
During an operation, the surgical instrument is manipulated to remove the entire lens. Because of this movement, the sleeve can at time become pinched between the tip and the tissue of the eye. The frictional contact between the sleeve and the vibrating tip can generate a significant mount of heat in the sleeve. The tissue of the eye is sensitive and can be damaged by the heat in a matter of a few seconds.
Efforts to alleviate the risk of burning the tissue have included such devices as described in U.S. Pat. No. 4,808,154 to Freeman. The Freeman device has longitudinal ribs formed along the interior of the sleeve. The ribs are intended to isolate portions of the wall from the tip to reduce the frictional contact, and provide channels to direct fluid flow about the tip. However, if the conduit becomes partially occluded by material within the eye, the flow of fluid along an entire length of the tip can be lost. Moreover, manipulation of the surgical instrument nay cause the sleeve to twist, which results in the ribs being drawn together thereby closing the channels. Clearly, the partial or complete blocking of the fluid passages will only exacerbate the problems associated with overheating of the surgical site.
U.S. Pat. No. 5,188,589 to Wypych discloses a sleeve wherein the interior surface surrounding the tip is provided with a rough texture of random bangs and pits. The bumps and pits are formed by acid etching or bead or sand blasting of the mold to form a roughened texture having a relieved or sandpaper-like appearance. This construction reduces the frictional contact between the sleeve and the tip, and provides passages (i.e., the pits) through which the fluid can flow about the tip even when compressed. However, the construction of the roughened texture creates blind and constricted passages which increase fluid resistance and hamper proper fluid flow.


A packaging unit which permits the storage and application of a liquid or pasty product to a base includes at least one reservoir containing the product to be applied and an applicator associated with the reservoir. The applicator includes, on the one end, an application element and, on the other end, a gripping member. The application element of an applicator is capable of being accommodated in an associated reservoir and is detachable from the reservoir. A sealing member is provided between the reservoir and its associated applicator to allow the reservoir to be obturated by the associated applicator for an appropriate positioning of the gripping member relative to the reservoir. The reservoir is contained in a shell which provides free access to the opening of the reservoir, the obturation of the reservoir is obtained when the corresponding application element is accommodated in the reservoir by compressing the sealing member of the reservoir by the positioning of the gripping member of the application element along the shell.

1. Field of the Invention
The present invention concerns a packaging unit permitting the storage and application of a liquid or pasty product to a base, in particular the application of makeup, or of a hair product to the skin, to the keratinous fibers or to the nails of a user. Such a packaging unit can be used, for example, for applying a reinforcing agent also called mascara to the eyelashes, or for applying an eyeliner, an eye shadow, a nail varnish or the like.
2. Discussion of the Background
A packaging unit for makeup, or for a hair product, generally comprises a reservoir containing the product to be applied and also a detachable applicator which is intended to close the reservoir. The applicator comprises a gripping means which allows the user to manipulate it and also an application element, for example, a stem, at the free end whereof there is fixed a brush, a pencil brush or the like.
In the position where the applicator closes the reservoir, the application element dips into the reservoir; when the applicator is separated from its associated reservoir, the pencil brush or the like, takes up a certain quantity of the product which can then be applied to the base for which it is intended.
Since such a packaging unit is generally placed in a handbag or a makeup pouch, it must be of as small a size as possible. Moreover, it must be convenient to use, both from the point of view of its being opened, and during application of the make-up product.
To satisfy the requirements mentioned above, a packaging unit of this type has already been proposed in FR-A-2 701 196, comprising a reservoir containing the product to be applied and a detachable applicator intended to close the reservoir, the applicator having a closing bearing surface intended to cooperate with a seat arranged opposite the opening of the reservoir. In this packaging unit a handle, allowing the applicator to be gripped, is articulated around a pin carried by the application element, this handle being constituted by a shackle whose dimensions are such that, in the completely folded-back position of the handle, the shackle surrounds the reservoir and cooperates with the bottom of the reservoir to ensure sealing of the closure of the reservoir by the applicator. In this device, the reduction in bulk is substantial since, in the storage position, the handle of the applicator is folded back around the reservoir instead of projecting relative to the reservoir and being generally in the extension of the latter.
In French Patent Application FR-A-2738126, there has also been proposed a portable packaging unit for mascara, comprising a reservoir and an applicator provided with a flat handle and a bristle portion mounted on this handle, the applicator being capable of closing the reservoir. In this embodiment, the length of the reservoir is substantially equal to that of the bristle portion, the portion being fixed directly to the handle, entailing a limitation of the bulk of the packaging unit.
However, in this prior art, the reservoirs of these packaging units always have a shape appropriate for cooperation with the applicator and it is not possible to use reservoirs of a conventional shape, that is to say, a cylindrical shape, in particular for constituting refills. This results in a relatively high price, and it would be desirable if one could reduce it.

Packaging unit permitting the storage and the application of a liquid or pasty product to a base


A portable information handling system powered through a docking station charges an internal battery based on available power sensed at the docking station and communicated to a charger of the information handling system. A dock sensor on the information handling system selectively interfaces a local power sensor if the information handling system is not docked or a docking station sensor if the information handling system is docked. Available power sensed at the docking station is communicated to a battery charger of the information handling system by a differential wire pair interfaced through a docking connector.

1. Field of the Invention
The present invention relates in general to the field of information handling system power, and more particularly to a system and method for powering docked portable information handling systems.
2. Description of the Related Art
As the value and use of information continues to increase, individuals and businesses seek additional ways to process and store information. One option available to users is information handling systems. An information handling system generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes thereby allowing users to take advantage of the value of the information. Because technology and information handling needs and requirements vary between different users or applications, information handling systems may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated. The variations in information handling systems allow for information handling systems to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, or global communications. In addition, information handling systems may include a variety of hardware and software components that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.
The increased capability of processing components used to build information handling systems has resulted in a trend towards reducing the footprint of information handling systems. In particular, this trend is illustrated in the increased adoption by end users of portable information handling systems as replacements for desktop or other types of fixed systems. Portable information handling systems have an integrated display and power system so that an end user can use the system independent of assets external to the system's chassis, such as external peripherals and power adapters. End users have increasingly opted for the convenience of portability, especially as improved component performance has made the performance of portable information handling system comparable to desktop systems. However, portable information handling systems cannot operate indefinitely independent of external assets. For instance, the battery that powers portable information handling systems typically must recharge with an external power source after a couple of hours of operation. In addition, end users tend to periodically interface with peripherals, such as external displays, printers and keyboards. External peripherals sometimes provide a more convenient interface for an information handling system, such as a display with a larger viewable area than an integrated display or a keyboard with a more comfortable keypad than an integrated keyboard.
One convenient way for end users to interface a portable information handling system with external peripherals is to use a docking station. A docking station typically has a cradle that accepts a portable information handling system, such as with a connector sized to couple to a connector at the back of the information handling system. The docking station connector interfaces the portable information handling system with peripherals that are coupled to the docking station, such as an external display, an external keyboard or an external power source. Essentially, the docking station converts the portable information handling into a desktop system when an end user slides the portable system into the docking station cradle. The docking station interfaces with an AC power source and includes an adapter that converts the AC power into DC power for use by the portable information handling system's internal power system. Generally, the portable information handling system's own external AC adapter cannot connect to the portable system when the portable system is docked. The portable information handling system typically includes charger integrated circuit that uses the docking station external power to run the portable information handling system and also to charge the internal battery.
One difficulty with a docking station is that each information handling system peripheral function supported by the docking station has to have pins in the connector to interface with the information handling system. Each docking station pin adds to the expense and complexity of the information handling system, such as by taking up space on printed circuit boards of the information handling system. In the case of the power system, multiple docking station pins are typically used. For example, to prevent the information handling system battery charger from exceeding the docking station AC adapter power rating, the battery charger generally has to measure the total power used by the portable information handling system and the docking station electronics. This measurement typically requires routing of the docking station power source voltage straight to the portable information handling system through a sense element and then back to the docking station. The sense element measures the total power consumed by the docking station and the portable information handling system but uses an extra set of pins for power communication. If an actual voltage measurement is not made by the charger, an estimate of power used by the docking station may be used, however, the estimate will generally have to include excess power to avoid exceeding the docking station capability. The use of a higher powered adapter in the docking station gives more room for fudging power consumption, however, typically increases the cost of the docking station.

System and method for powering docked portable information handling system


Disclosed is an improved brake-and-accelerator pedal assembly for an automobile driving use. In order to attain natural, smooth foot control, an accelerator pedal is fixed swingably in lateral direction to a selected stationary part of the automobile body, and is resiliently urged toward the brake pedal just above the right side of the brake pedal, whereby acceleration drive is controlled by rotating driver's foot about the heel to push the accelerator pedal laterally. This arrangement permits a driver to operate the accelerator pedal simply by turning the toe a little about the heel of the foot with the foot remaining on the brake pedal.

1. Field of the Invention
The present invention relates to a brake-and-accelerator pedal assembly for an automobile driving use, and particularly a brake-and-accelerator pedal assembly which is designed in an attempt to improve the operating facility, and quick and safety-assuring operation.
2. Description of Related Art
In an attempt to improve the operating facility, and quick and safety-assuring operation of different pedal mechanisms in the driver's seat a variety of proposals have been offered as for instance follows: John L. Millar et al proposed a brake pedal-and-foot rest hinged link connection (U.S. Pat. No. 3,108,651); and H. J. Cocks proposed an accelerator pedal-and-foot rest combination (U.S. Pat. No. 1,715,336).
The former proposal is an improvement of the brake pedal designed for automatic automobiles, reducing the braking stroke to the extent that the braking operation may be permitted while the foot remains on the foot rest. In the latter proposal the free end of the rotatable foot rest remains on the accelerator pedal, which is adapted to be operated by applying a pressure to the free end of the rotatable foot rest with the foot.
Another proposal offered by Nsin-Hsin Lo is a longitudinal arrangement of accelerator pedal, foot stand and brake pedal in the order named (U.S. Pat. No. 4,802,381). Particularly, the foot stand is fixed to the floor, and the accelerator pedal is ahead of the foot stand and the brake pedal is behind the foot stand. This arrangement permits the driver to operate the accelerator pedal with the toe and the brake pedal with the heel of the driver's foot.
An improvement proposed by John L. Millar et al (U.S. Pat. No. 3,108,651) is directed only to a brake pedal whereas an improvement proposed by H. J. Cocks is directed only to an accelerator pedal. These improvements are not directed to the designing of facilitating the switching from the operation of the brake pedal to the operation of the accelerator pedal or vice versa. These pedals are operated independently by moving the driver's leg about the hip joint to shift the foot from the brake pedal to the accelerator pedal or vice versa. This is a relatively large movement, and accordingly the switching is not quick. Still disadvantageously, the driver's posture is liable to somewhat change and lose balance. When changing ordinary automobiles to automatic ones drivers are liable to be anxious about putting their feet on wrong foot pedals in driving.
An improvement proposed by Nsin-Hsin Lo (U.S. Pat. No. 4,802,381) is directed to the smooth, quick switching between braking and accelerating operations. It, however, requires a relatively large amplitude of back-and-forth inclination of the driver's foot about the arch of the foot to assure reliable operation. As a matter of fact, however, the range within which the driver can incline his foot about the arch of the foot is very limited, and accordingly the actual strokes both of the brake and accelerator pedals must be reduced to a possible minimum. As a consequence, a very delicate and accurate operation is required both in acceleration and wheel braking. In this connection it is most likely that in case of emergency drivers cannot perform a required fine control. Still disadvantageously, drivers cannot put their heels on the floor, and therefore, their postures are not stable, and drivers will get tired easily in driving.

Taimei-machi, Tamana-gun, Kumamoto-ken, 869-02


In an image processing apparatus including a display device for displaying a binary image stored in a display binary memory and a printer for printing a binary image stored in a printing binary memory, a multi-value-binary conversion circuit for converting a multivalued image stored in a multivalued memory into a binary image is selectively connected to the display binary image memory or the printing binary image memory while arbitration between a display request and a printing request is performed. The multi-value-binary conversion circuit is commonly used for display and printing.

1. Field of the Invention
The present invention relates to an image processing apparatus having display and printing devices to output a binary image.
2. Related Background Art
A conventional computer basically prints only characters.
A character code is sent from a conventional computer to a printer, the character code is converted into a character bit image, and the character bit image is output using a printing head, laser scanning, and the like. In recent years, computer processing capacity has been remarkably increased, and graphics using a color image such as a natural image can be expressed.
A color image cannot be printed using simple binary colors. A natural expression of a color image cannot be achieved without expressing it as a multivalued image.
It is, however, difficult for many printers such as an ink-jet printer to perform multivalued expressions due to their structural limitations. For this reason, multivalued expressions (halftone expressions) must be achieved by binary printing.
To print a color image such as a natural image, multi-value-binary conversion is performed, and then the converted image is printed.
To display a color image, a multivalued display operation is generally performed because a display device such as a CRT can easily perform multivalued expression. It is, however, difficult for a passive matrix flat display device such as a low-cost LCD to perform multivalued expression.
Software processing cannot be standardized due to different multivalued data expression methods in display and printing, resulting in inconvenience.
In displaying a high-resolution image, multivalued expressions cause a decrease in display speed or an increase in file size because the multivalued expressions require a large memory capacity. For example, to perform a 24-bit display (using, e.g. 8-bit R, G, and B components) at a resolution of 200 dpi in an A4 size, a frame memory requires a capacity of 12 Mbytes. This capacity causes overload of the state-of-the-art computer processing capacity.
Printing and display resolutions have been increasing year by year. When a multivalued image is displayed and printed, the memory and processing capacities required are assumed to increase in arithmetic progression.
It is convenient to express a multivalued image in a binary system in printing and displaying a high-resolution image. To express a multivalued image in a binary system, a halftone expression method such as a dither method or an error diffusion method must be used. This method requires processing between pixels constituting an image (i.e., produces for each pixel a value which is based on the input values of several pixels), and a considerably large processing capacity is required to perform this pixel processing using only software (i.e., without at least some dedicated hardware).
For this reason, multi-value-binary conversion is generally performed by hardware.
Various figures and outline fonts used in vector graphics commands can be drawn at a higher speed using an external figure drawing processor than using a printing source computer or the internal processor of a printer.
Judging from the above circumstances, display and printing operations must be efficiently processed in one block, which functions as various circuits, in favor of a high-speed operation. However, the image display and printing operations are not always simultaneously performed, and different images may be displayed. Therefore, a multi-value-binary conversion circuit must independently perform display processing and printing processing.

Image processing apparatus for converting multivalued image into binary image and outputting binary image


The present invention provides a novel human tumor suppressor (NHTS) and polynucleotides which identify and encode NHTS. The invention also provides genetically engineered expression vectors and host cells comprising the nucleic acid sequences encoding NHTS and a method for producing NHTS. The invention also provides for agonists, antibodies, or antagonists specifically binding NHTS, and their use, in the prevention and treatment of diseases associated with expression of NHTS. Additionally, the invention provides for the use of antisense molecules to polynucleotides encoding NHTS for the a treatment of diseases associated with the expression of NHTS. The invention also provides diagnostic assays which utilize the polynucleotide, or fragments or the complement thereof, and antibodies specifically binding NHTS.

When tumorigenic and non-tumorigenic cells are fused in culture, the resulting hybrid cells are usually non-tumorigenic. Loss of tumorigenicity is attributed to heritable factors within the non-tumorigenic cell which suppress tumor development. Several tumor suppressors including the retinoblastoma gene and p53 have been characterized and are of great interest to researchers and clinicians seeking to investigate and control cancer growth. Both the retinoblastoma gene and p53 have become candidates for the development of cancer therapeutics (Knudson, A. G. (1993) Proc. Natl. Acad. Sci. 90: 10914-21; Antelman, D. et al. (1995) Oncogene 10: 697-704; and Hamada, K. et al. (1996) Cancer Res. 56: 3047-54).
One of the genes which suppresses tumorigenesis, tsg101, was recently identified in mouse (Li, L. and S. N. Cohen (1996) Cell 85:319-329). Antisense RNA was used to disrupt transcribed genes throughout the genome of mouse 3T3 fibroblasts. Homozygous functional disruption caused oncogenesis, and the oncogenic cells, in turn, produced metastatic tumors in nude mice. Removal of the transactivating RNA allowed Li and Cohen (supra) to study and characterize genes with tumor suppressor activity.
Tsg 101 was identified using this methodology and cloned from a mouse NIH 3T3 cell cDNA library. The predicted protein has 381 amino acids; an alpha-helix domain which has identity with cc2; a stathmin interaction domain; a proline-rich region which precedes a leucine zipper motif; a zinc finger signature (residues 73-83); seven potential protein kinase C phosphorylation sites (11, 38, 85, 88, 215, 225, 357); five potential casein kinase II phosphorylation sites (38, 210, 249, 265, 290); two potential N myristoylation sites (55 and 156); and three potential N glycosylation sites (44, 150, 297). Oncogenesis was observed when the activity of tsg101 was knocked out by introducing a synthesized, tsg101 antisense RNA into native NIH 3T3 cells.
The zinc finger and leucine zipper motifs of tsg101 may allow the protein to function as a transcription factor; however, Li and Cohen (supra) suggest tsg101 may interact with stathmin (oncogene 18), a cytosolic phosphoprotein that functions in cell growth and differentiation. Stathimin is known to be phosphorylated in response to growth and differentiation factors during cell cycle transitions, embryonic development, T cell activation, and tissue regeneration. Stathmin expression increases in acute leukemia, highly malignant lymphoma and neuroblastoma and in cells overexpressing tsg101 (Li and Cohen, supra).
Mutations in tumor suppressor genes are a common feature of many cancers and often appear to affect a critical step in the pathogenesis and progression of tumors. Accordingly, Chang, F. et al. (1995; J. Clin. Oncol. 13: 1009-1022) suggest that it may be possible to use either the gene or an antibody to the expressed protein 1) to screen patients at increased risk for cancer, 2) to aid in diagnosis made by traditional methods, and 3) to assess the prognosis of individual cancer patients. In addition, Hamada et al. (supra) are investigating the introduction of p53 into cervical cancer cells via an adenoviral vector as an experimental therapy for cervical cancer.
Polynucleotides and polypeptides related to tsg101 satisfy a need in the art by providing compositions useful in the diagnosis, prevention, and treatment of cancer and autoimmune diseases.


A protective wristband with integrally woven inner and outer layers of an absorbent stretchable fabric material to provide an endless generally hollow interior, and a cushioned shield disposed between the layers such that the shield is concealed to provide the appearance of a conventional, unprotective wristband.

The wrist is a delicate instrument that is readily injured. For example, in softball or baseball the wrist is easily bruised or even broken by a sharp grounder taking a bad hop and striking the inside of the wrist. The inside of the wrist typically lies exposed, unprotected by a glove.
The prior art includes the Gould U.S. Pat. No. 4,541,127 which discloses a baseball protection device having a pad of pliable, shock-absorbent material and a sheet of hard, semi-rigid material, such as acetate plastic, superimposed on the pad. The pad and sheet are encased in a durable material such as leather or rawhide. The pad and sheet are secured to the wrist with a stretchable fabric, such as a blended fabric of elastic and perspiration-absorbing terry cloth, which is sewn to the outermost side edges of the pad and sheet.
The Campana U.S. Pat. No. 4,896,378 discloses a protective wrist band which particularly relates to protecting a mechanic's wrist. The wrist band includes an inner layer of porous, absorbent fabric material and a thicker shock-absorbing layer of a resilient, fluid-impervious, rubber-like closed cell material. The wrist band is secured above the wrist utilizing hook-and-loop fastening systems.
The Klose U.S. Pat. No. 3,598,408 discloses a wristlet and web protector with an athletic item engaging pad. The pad is secured to and within the area of the palm portion of a hand for engaging a bowling ball, golf club and the like.
The prior art also includes commercially available wrist protectors such as the HOT SHOT.TM. available from Mizuno marketed under U.S. Pat. No. 4,541,127.


Embodiments provide systems, methods, apparatus, and computer program products for selecting codec parameters to satisfy one or more operating constraints. An example method performed by a network component that facilitates a communication session set-up process among endpoints in a communication network, the method includes: during the communication session set-up process, determining a utilization factor of the network component; selecting a value for sampling frequency associated with a first codec in response to determining the utilization factor; negotiating use of the first codec and the value for sampling frequency with a first endpoint and negotiating use of a second codec with a second endpoint; and transcoding a media stream of a communication session between the first endpoint and the second endpoint according to the first codec and the value for sampling frequency and the second codec.

Internet protocol (IP) networks and other types of networks can be used to carry data for different types of calls. Various types of calls include voice and video communications and conferencing, and streaming services including audio and video streaming. Audio and video data are typically encoded for transmission via these networks by one or more codecs along the way. A codec may include hardware or software used to encode and decode data, such as audio and/or video data in a signal. A media gateway/media gateway controller and/or a session border controller, located along a network path between the two endpoints, may perform different types of services for the transmission of calls, including transcoding and encryption.
The impact on the internal resources available to the network component varies, depending upon the codec(s) used. Depending upon which codecs are used, transcoding or other services may be necessary at the network component. As the volume of media traffic carried by communications networks continues to increase, the need for network components to provide ever greater capability to handle media traffic in a manner that more efficiently uses resources internal to network components increases as well.
For instance, conventional network systems may be designed with a worst-case scenario in mind, purposefully over-built to avoid dropping calls or providing unacceptable quality to customers. In one example, a network carrier may expect a certain number of calls during certain peak times and may estimate an amount of computing resources at the transcoding components to service those calls during peak times. This estimate may lead to building the carrier's infrastructure to support expected peak time loads. There is a need for systems that use transcoding resources more efficiently, especially during peak times.

System, methods, and computer program products for selecting codec parameters


A fold-type cellular phone has a top unit, a bottom unit and a hinge coupling together the top unit and the bottom unit while allowing the top unit to turn and swivel with respect to the bottom unit. The top unit is first unfolded from a first folded position to an attitude angle of 160 to 170 degrees, and swiveled by 180 degrees to be folded onto the bottom unit in a second folded position at an attitude angle of 180 degrees. The swivel movement of the top unit causes a cam assembly to turn the top unit from the attitude angle of 160–170 degrees to an attitude angle of 180 degrees in the second folded position, thereby allowing the top unit to assume a suitable attitude with respect to the bottom unit.

(a) Field of the Invention
The present invention relates to a fold-type data processing apparatus having a hinge and, more particularly, to a fold-type data processing apparatus, such as cellular phone, hand-held personal computer and portable data assistant, having a hinge mechanism therein.
(b) Description of the Related Art
Recent cellular phones have a variety of functions in addition to the conventional telephone function, such as internet browser, e-mail and schedule management functions. Thus, the cellular phone may be referred to as a portable data processing apparatus or personal data assistant. This fact necessitates the cellular phone to have a larger-size display unit to display thereon a larger amount of image information including figures as well as characters and numerals.
To solve a trade-off between a larger-size screen for the display unit and a smaller weight of the cellular phone as encountered in the conventional technique, a fold-type structure is increasingly used for the chassis of the cellular phone. In general, the fold-type structure of the cellular phone is such that the chassis of the cellular phone has a top chassis section (top unit) and a bottom chassis section (bottom unit) coupled together via a hinge, and the display unit and the keyboard are exposed for operation by unfolding the top chassis section with respect to the bottom chassis section. A fold-type structure has been proposed wherein the screen of the display unit is exposed in a folded position of the chassis for allowing the cellular phone to function as an e-mail or browser unit without switch-ON of the telephone function.
JP Patent Publication 11(1999)-215218 (first publication) describes a fold-type structure of the cellular phone wherein the top chassis section mounting thereon a display unit and the bottom chassis section mounting thereon a keyboard are coupled together via a ball joint for allowing swiveling of the top chassis section in any direction with respect to the bottom chassis section.
In the fold-type structure described in the first publication, it is difficult to fix the relative attitude of the top chassis section with respect to the bottom chassis section during an unfolded position thereof, because both the sections are coupled via the ball joint. This rather hinders the user from handling the cellular phone comfortably.
JP Patent Publication 2002-158758 (second publication) describes a fold-type structure of the cellular phone, wherein the top chassis section mounting thereon a display unit and the bottom chassis section mounting thereon a keyboard are coupled together for allowing swiveling of the top chassis section with respect to the bottom chassis section so that the operating planes of the display unit and the keyboard are directed in the same direction.
In the fold-type structure described in the second publication, if one of the chassis sections is swiveled with respect to the other, with surface portions of both the chassis sections being in contact with one another, the contacted surface portions may have mechanical damages thereon. This problem is common to the fold-type structure described in the first publication.

Fold-type data processing apparatus having a hinge


A wafer level semiconductor package includes a semiconductor chip having a circuit part. A bonding pad group is disposed in the semiconductor chip and included in the bonding pad group is a power pad that is electrically connected to the circuit part. An internal circuit pattern is disposed at a side of the bonding pad group. An additional power pad is disposed at a side of the bonding pad group, and the additional power pad is electrically connected to the circuit part. An insulation layer pattern is disposed over the semiconductor chip, and the insulation layer includes openings that expose the power pad, the internal circuit pattern, and the additional power pad. A redistribution is disposed over the insulation layer pattern, and the redistribution is electrically connected to at least two of the power pad, the internal circuit pattern, and the additional power pad.

The present invention relates generally to a wafer level semiconductor package and a method for manufacturing the same.
Recent developments have lead to semiconductor chips with a high integration density of data and fast data processing speed. These semiconductor chips must find a way to prevent the generation of heat caused when the semiconductor chip with the high integration density of data and the fast data processing speed operates, as the heat causes a lowering in the performance of the semiconductor chip. In order to prevent the generation of heat, most recently developed semiconductor chips are required to have a low voltage operation characteristic.
In order to satisfy the low voltage operation characteristic of the semiconductor chip, the semiconductor chip requires a larger number of power supplying pads. However, semiconductor chips have a limited area, making it difficult to form the larger number of power supplying pads. In addition, the size of the semiconductor chip increases when a larger number of power supplying pads is formed in the semiconductor chip.
Additionally, internal wiring of the semiconductor chip is used to provide power to a specific portion of the semiconductor chip, e.g. an edge portion of the semiconductor chip. In this case, a problem occurs, in that sufficient power cannot be provided to the edge portion of the semiconductor chip through the internal wiring of the semiconductor chip.

Wafer level semiconductor package and method for manufacturing the same