An optical reading device comprising a housing for receiving a test plate on which, according to a fixed pattern, test substances can be provided, which reading device further comprises optical conversion elements for converting light coming from a test substance into a measuring signal which corresponds to a predetermined parameter of the test substance. The optical conversion elements comprise light-receiving areas configured in a pattern which corresponds to the pattern of the test plate. Due to the invention, it becomes possible to measure, in a non-invasive manner, an oxygen concentration in a test substance, such as a cell culture, without the oxygen content being disturbed by mechanical vibrations. As a result, in a reliable manner, measurements on substances can be performed for determining the toxicity and/or uptake or degradation rate in living cells.

The invention relates to an optical reading device, comprising a housing for receiving a test plate for testing test substances provided in a predetermined pattern on the test plate, and optical conversion elements for converting light, coming from the test substances, into a measuring signal which corresponds to a predetermined parameter of the test substances.
Such a reading device is known, for instance, from U.S. Pat. No. 4,810,096 and is used for determining absorption of light of test compounds which are received in a so-called microtitre plate, a transparent test plate manufactured from glass or a plastic and provided with a regular pattern of wells in which test substances can be provided, such as pharmaco-active substances or cell cultures.
A disadvantage of the known reading device is that it comprises moving parts, which have to be adjusted so that respective test positions in a microtitre plate can be read. This adjustment is complicated and can vary per plate or over time. Moreover, the mechanism is susceptible to maintenance. Further, the transport to the device, and its moving parts during testing, cause unnecessary disturbances in test substances, which is detrimental when it affects the test results if, for instance, the oxygen balances in the test substances are disturbed.


Implementations relate to detecting spherical images. In some implementations, a computer-executed method includes obtaining an image, examining at least one characteristic of the image, and determining that the image is a spherical image based on the at least one examined characteristic. The method modifies metadata associated with the image to designate the image for spherical display.

The popularity and convenience of digital cameras as well as the widespread use of Internet communications have caused user-produced images such as photographs to become ubiquitous. Some cameras are able to capture or create panoramic images showing wide-angle views of the physical space around the camera. Panoramic images can be created in different ways. For example, views from the camera at different angles around the camera can be captured in succession and/or at about the same time, depending on the number of lenses included in the camera. In some cases, images of adjacent scenes can be stitched together to create a panoramic image. Panoramic images can also be of a variety of different types, including flat, cylindrical, cubic, and spherical. Spherical images can be viewed as if projected onto the inside of a sphere, allowing a full view of the physical space captured around the camera in all directions.


A re-inker mechanism is described for replenishing ink in a ribbon by increasing the contact force between an ink supply roller and a transfer roller as the weight of the ink supply roller decreases. This is accomplished by locating the transfer roller rotatably in a fixed position and locating the ink supply roller somewhat beneath the transfer roller on a support that is movable. A biasing force is attached to the ink supply roller to urge the ink supply roller against the transfer roller with a force sufficient to overcome the weight of the ink supply roller and to provide a predetermined contact force between the ink supply roller and the transfer roller, so that as the ink is used, the weight of the ink supply roller decreases and the contact force with the transfer roller increases.

1. Field of the Invention
The present invention, generally, relates to ribbon re-inking devices and, more particularly, to a new and improved mechanism by which ink is transferred from an ink reservoir for replenishing the ribbon under a measure of control.
Usually, today, a supply of ink in a pad of porous material is maintained in close contact with a ribbon in a wiping or a rolling action under substantially constant pressure to replenish the ink as the ribbon is used. It is the custom to form such porous material as a circular roller and to mount it within the ribbon cartridge where it is maintained in contact with the ribbon, thereby extending the operating life of the ribbon.
2. Description of the Prior Art
One practice that has found favor in the art today uses a second roller intermediate the porous ink-filled roller, and this roller is called a"transfer" roller.
The ribbon is wrapped part way around the peripheral surface of the transfer roller with the re-inking roller in contact with a different part of the periphery of the transfer roller. Actually, the transfer roller and the re-inking roller are supported rotatably on their own shafts.
Since the re-inking roller and the transfer roller are in contact with each other, as one turns, so turns the other. Thus, as the ribbon is moved by the apparatus using it, this action provides the motive power for turning both the transfer roller and the re-inking roller. Whether such a ribbon is used in a typing apparatus or in an impact printer apparatus, it is the practice today to provide some form of ink replenishing supply.
In impact printer apparatus, it is current practice to augment the supply of ink in the ribbon. This additional ink is contained in a reservoir formed of porous, sponge-like material in the shape of a circular roller, and the transfer roller is located between the ribbon and this ink supply roller.
It is also current practice for such impact printers to enclose both the ribbon and the re-inking mechanism in a cartridge. These cartridges, however, have not been a panacea in extending the operating life of the ribbon, because they have had their own problems.
The patented prior art describes several arrangements for re-inking devices. For example, U.S. Pat. No. 2,770,215 to Knight describes an early form of a device for furnishing ink continuously to an inked ribbon.
U.S. Pat. No. 4,536,098 to Sheehan et al. describes a ribbon cartridge with a re-inking mechanism to extend the life of the ribbon.
U.S. Pat. No. 4,913,571 to Bulson et al. describes a ribbon cartridge with a re-inking roller and transfer roller assembly arranged to prevent a failure due to a long period of non-use. This patent is assigned to the Assignee of the present invention.
While the structural arrangements of these prior devices, at first appearance, have similarities with the present invention, they differ in material respects. These differences, which will be described in more detail presently, are important for the effective use of the invention to achieve its advantages.

International Business Machines Corporation


Systems and methods for treating a vessel include devices having a main elongated element with a balloon at its distal end, an auxiliary elongated element wherein a distal end of the auxiliary elongated element is proximal to the balloon, and a core wire having a internal core wire portion and an external core wire portion, wherein the external core wire portion is external to the balloon. In some embodiments, a distal connecting element is attached to the distal end of the balloon. In some embodiments, the distal connecting element is positioned at a rotational distance from the auxiliary elongated element. In some embodiments, the balloon is a fixed wire balloon. Inflation of the balloon causes guidewires positioned within the device and external core wires to be pushed up against the lesion, providing a focused force for cracking the lesion.

Balloon dilatation catheters are used to treat lesions in vessels. However, difficulties are encountered in navigating tortuous anatomy and safely crossing very tight lesions. Moreover, some lesions are difficult to crack using just a balloon, and require a focused force to enable cracking of the lesion at safe inflation pressures.
An example of a system used to provide enhanced force is disclosed in U.S. Pat. No. 6,394,995 to Solar et al. Disclosed therein is a system having a flexible advancement member with a tracking member slidable over a guidewire, and a balloon having a distal end attached to the tracking member. However, this type of system provides limited focused force, does not address bifurcation lesions, and lacks pushability and maneuverability.
It is therefore an object of the present invention to provide enhanced balloon dilatation catheter systems and methods with improved maneuverability and multiple treatment options.

Systems and methods for treating a vessel using focused force


Even in the case of a bar-like small terminal connection, its strength is retained. In (a), a strip (21) made, for example, of a thin metal sheet having a thickness of 0.2 mm and a predetermined width is collapsed by rolling to a thickness of 0.16 mm as in (b). Subsequently, as in (c), the longitudinal opposite sides (22, 23) of the strip (21) are erected with respect to the base plate (24), then inwardly bent, as in (d), and folded onto the base (24), as in (e). Further, the folded opposite sides (22, 23) are erected together with the base plate (24) into a closely contacted state, whereupon as in (f), the folded body is mechanically compressed from all sides into a form having a 0.64-mm square cross section.

In recent years, with the increase in an amount of information to be treated by various kinds of electric equipments, a smaller and more compact electric connector has been desired and, thus, a male type connecting terminal of a smaller size has been required. For this requirement, a tip portion of a male type connecting terminal with a square cross section having a side of 0.64 mm has been developed as a standard male type connecting terminal.
A small male type rod-like connecting terminal of this kind is disclosed in JPA 11-329545, in which a tip portion has a rectangular cross section. FIG. 5 shows this known male type rod-like connecting terminal while a portion thereof has been dispensed with for the sake of clarity. The connecting terminal 1 is integrally formed by bending a thin conductive metal plate and includes a rod-like terminal connecting portion 2 which is to be electrically coupled with a corresponding female type connecting terminal. The connecting terminal further includes a U-shaped wire clamping portion to which is clamped an electric wire extending in an opposite direction to the terminal connecting portion 2.
In the known male type connecting terminal, the connecting terminal portion 2 has a hollow cylindrical shape as illustrated in FIG. 6. That is to say, the connecting terminal portion 2 is formed by bending a metal plate to have a given thickness.
The above mentioned terminal connecting portion 2 of the male type rod-like connecting terminal 1, however, is relatively delicate against force and vibration added up and down and, moreover, has such a drawback that it might be bent and in an extreme case, might be broken at a root portion of the terminal connecting portion 2 when strong force and vibration are continuously applied, because the terminal portion is relatively flat and metal plates standing side by side are limited in number and in width.
In addition, upon forming a hollow portion by bending a metal plate, a cost of manufacturing a mold becomes expensive especially for a super-small connecting terminal.
It is an object of the present invention to provide a male type rod-like connecting terminal, in which the above mentioned problems can be removed and a mechanical strength of a terminal connecting portion can be increased, even though the connecting terminal having a very small size is formed by bending a thin metal plate.
It is another object of the present invention to provide a method of manufacturing the above mentioned male type rod-like connecting terminal.

Male bar-like connection terminal and method of producing the same


A display unit comprising a plurality of vertical truss members anchored to a floor surface; a plurality of horizontal rails attached to the vertical truss members thereby forming a frame; a horizontal track anchored to a floor surface in front of the vertical truss members; a plurality of cantilever supports attached across the top of the frame, the cantilever supports each having a front portion providing an upper frame and lower frame; a plurality of upper rectangular panels mounted in a first row adjacent one another in the upper frames; a plurality of lower rectangular panels mounted in the lower frames adjacent one another a second row below the first row; first and second side panels anchored to the floor track and to a plurality of the horizontal rails; a plurality of cabinets located adjacent one another between the first and second side panels and anchored to the floor track and at least one of said horizontal rails; and a plurality of display panels disposed between the top surfaces of the cabinets and the lower edges of the lower rectangular panels.

1. Field
The subject disclosure relates to display systems and more particularly to a large display structure useful in retail display environments and featuring easily assembleable, changeable, movable, and replaceable components. Such a display may be particularly adapted in various embodiments to display paint and other coating products, as well as advertising and interactive digital displays.
2. Related Art
Display assemblies have been used for displaying various items in retail environments. One example of such display assemblies is presented in U.S. Pat. No. 7,789,472 assigned to the present assignee, Behr Process Corporation.


A cryptographic device comprises a data stream interceptor, a main controller receiving input from the data stream interceptor, and a pair of data generating and storage controllers adapted to perform data transfer protocols with corresponding peer controllers of a data generating device and a data storage device, respectively, on command from the main controller. The cryptographic device further comprises a cipher engine programmed to transparently encrypt and decrypt data streams flowing between the data generating device and data storage device on command from the main controller. The cryptographic device does not utilize system resources associated with the data generating and storage devices during operation.

Encryption is a security technology designed to preserve the privacy and confidentiality of sensitive data that is being stored or transmitted. Sensitive data is routinely stored unencrypted on desktop computers, workstations, notebooks, personal digital assistants (PDAs), cellular telephones, and the like. The hard drives of notebooks are especially at risk as the computers are frequently used in non-secure environments and may be relatively easily removed by an unauthorized user. Computer hard drives may contain strategic data, patent applications, patent drawings, litigation documents, consumer lists, private health care information, payroll data and other types of sensitive data. Users frequently store unencrypted passwords and access codes to corporate networks on notebooks, which may compromise corporate network security. Statistics compiled annually by the FBI show that network security breaches are to a significant extent being perpetrated by employees or contractors who have or can gain access to sensitive data on an intranet. Moreover, unattended desktop PCs become frequent targets for unauthorized users attempting to gain illicit entry into a private network.
Comparatively few cryptographic applications have been developed to protect data, with most of the applications being software-based applications adapted to perform file-level cryptography. File-level cryptography can also be done by various hardware devices such as PCMCIA cards or external ASIC-based devices. On the surface, encrypting only selected files instead of entire hard drives seems to make sense since not all data is confidential. However, file cryptography is inherently slow because the entire file must be decrypted before any portion of the file can be presented to the user. Also, file encryption normally ignores the temporary and swap files that are automatically created and stored in clear text on the hard drive. Worse still, file encryption frequently results in compromised overall system performance, and requires manual intervention by users who may become confused and frustrated by the number of requisite interactive steps embedded in the application. From an organizational point of view, the lack of automatic and transparent cryptographic operation makes it inherently difficult to enforce data security policies on computers, mobile communication devices and networks alike. Furthermore, the level of security attainable with file-level cryptography is questionable, since file encryption programs run under the control of the computer operating system (OS) and the OS lacks sufficient access control. If an unauthorized user were capable of subverting the OS, subverting the file-level cryptography application would be entirely feasible as well. Although PCMCIA encryption cards and external ASIC encryption devices have been designed to provide greater key security and to improve performance, these devices have had only marginal success and suffer from a variety of compatibility issues. It, therefore, becomes increasingly clear that conventional cryptography applications are not suitable for organizations and/or individuals requiring optimized security, convenience and uncompromised system performance.


Provided is a window shading system including a means for shading one or more windows; a means for manually controlling at least one window shading setting; one or more sensors; a processor; and a tangible, non-transitory, machine readable medium storing instructions that when executed by the processor effectuates operations including capturing, with the one or more sensors, environmental data of surroundings; predicting, with the processor, the at least one window shading setting using a learned function of an artificial neural network that relates the environmental data to the at least one window shading setting; and, applying, with the processor, the at least one window shading setting predicted to the window shading system.

Window shades are important as they help control temperature and brightness within an area by adjusting the amount of sunlight coming through a window. Further window shades provide privacy by limiting visibility through a window. Traditionally window shades are physical objects that are used to cover windows and are manually adjusted to control the amount of visibility and sunlight coming through the window. With advances in technology, nanotechnology has been used as an alternative method for window shading. For example, electrified gel can be used to change the tint of a window and control the amount of visibility and sunlight coming through the window. However, adjusting the amount of visibility and sunlight coming through a window remains a manual task.

Artificial neural network based controlling of window shading system and method


A level adjustment method is applicable to an audio processing apparatus having a plurality of amplifiers corresponding to three or more of input channels of an audio signal for amplifying signal levels of the respective input channels. The level adjustment method is carried out by a group arrangement process of arranging the plurality of the input channels into one or more group, and a group control process of controlling each group such as to decrease an amplification rate of all the amplifiers corresponding to the input channels belonging to the same group as a maximal one of the signal levels of the input channels belonging to the same group increases. Typically, the group arrangement process is applied to an audio signal of a surround system having at least six input channels including a left channel, a right channel, a left surround channel, a right surround channel, a center channel and an LFE channel.

1. Technical Field of the Invention
The present invention relates to a level adjustment method, a level adjustment program, and an audio processing apparatus suitably used for a 5.1 channel sound system.
2. Prior Art
An audio processing apparatus such as a mixer is provided with effects such as a compressor that applies a specified signal processing to audio signals. Here, the compressor detects an input signal level and, if the detected level exceeds a specified value (threshold Th), attenuates the level for an excess portion to compress the dynamic range. The details are disclosed in Japanese Patent Application Laid-Open Publication No. 8-122366. In addition, there is provided a stereo compressor that detects one level from either or both of a left signal L and a right signal R, and controls the L and R levels based on the detected level.
On the other hand, there is provided a 5.1 channel mixer, making it possible to appropriately mix a plurality of input signals and generate a multi-channel signal.
However, the conventional stereo compressor can cooperatively process two channels at the most. Therefore, it is difficult to appropriately process multi-channel signals for use with the 5.1 channel sound system and the like.

Digital compressor for multi-channel audio system


Methods and systems for processing signals in a communication system are disclosed and may include pipelining processing of a received HSDPA bitstream within a single chip. The pipelining may include calculating a memory address for a current portion of a plurality of information bits in the received HSDPA bitstream, while simultaneously storing on-chip, a portion of the plurality of information bits in the received bitstream that is subsequent to the current portion. A portion of the plurality of information bits in the received HSDPA bitstream that is previous to the current portion may be decoded during the calculating and the storing. The calculation of the memory address for the current portion of the plurality of information bits may be achieved without the use of a buffer. Processing of the plurality of information bits may be partitioned into a functional data processing path and a functional address processing path.

Mobile communication has changed the way people communicate and mobile phones have been transformed from a luxury item to an essential part of every day life. The use of mobile phones today is generally dictated by social situations, rather than being hampered by location or technology. While voice connections fulfill the basic need to communicate, and mobile voice connections continue to filter even further into the fabric of every day life, the mobile Internet is the next step in the mobile communication revolution. The mobile Internet is poised to become a common source of everyday information, and easy, versatile mobile access to this data will be taken for granted.
Third generation (3G) cellular networks have been specifically designed to fulfill these future demands of the mobile Internet. As these services grow in popularity and usage, factors such as cost efficient optimization of network capacity and quality of service (QoS) will become even more essential to cellular operators than it is today. These factors may be achieved with careful network planning and operation, improvements in transmission methods, and advances in receiver techniques. To this end, carriers need technologies that will allow them to increase downlink throughput and, in turn, offer advanced QoS capabilities and speeds that rival those delivered by cable modem and/or DSL service providers. In this regard, networks based on wideband CDMA (WCDMA) technology may make the delivery of data to end users a more feasible option for today's wireless carriers.
The General Packet Radio Service (GPRS) and Enhanced Data rates for GSM (EDGE) technologies may be utilized for enhancing the data throughput of present second generation (2G) systems such as GSM. The GSM technology may support data rates of up to 14.4 kilobits per second (Kbps), while the GPRS technology may support data rates of up to 115 Kbps by allowing up to 8 data time slots per time division multiple access (TDMA) frame. The GSM technology, by contrast, may allow one data time slot per TDMA frame. The EDGE technology may support data rates of up to 384 Kbps. The EDGE technology may utilizes 8 phase shift keying (8-PSK) modulation for providing higher data rates than those that may be achieved by GPRS technology. The GPRS and EDGE technologies may be referred to as "2.5G" technologies.
The UMTS technology with theoretical data rates as high as 2 Mbps, is an adaptation of the WCDMA 3G system by GSM. One reason for the high data rates that may be achieved by UMTS technology stems from the 5MHz WCDMA channel bandwidths versus the 200 KHz GSM channel bandwidths. The HSDPA technology is an Internet protocol (IP) based service, oriented for data communications, which adapts WCDMA to support data transfer rates on the order of 10 megabits per second (Mbits/s). Developed by the 3G Partnership Project (3GPP) group, the HSDPA technology achieves higher data rates through a plurality of methods. For example, many transmission decisions may be made at the base station level, which is much closer to the user equipment as opposed to being made at a mobile switching center or office. These may include decisions about the scheduling of data to be transmitted, when data is to be retransmitted, and assessments about the quality of the transmission channel. The HSDPA technology utilizes variable coding rates and supports 16-level quadrature amplitude modulation (16-QAM) over a high-speed downlink shared channel (HS-DSCH), which permits a plurality of users to share an air interface channel
In some instances, HSDPA may provide a two-fold improvement in network capacity as well as data speeds up to five times (over 10 Mbit/s) higher than those in even the most advanced 3G networks. HSDPA may also shorten the roundtrip time between network and terminal, while reducing variances in downlink transmission delay. These performance advances may translate directly into improved network performance and higher subscriber satisfaction. Since HSDPA is an extension of the GSM family, it also builds directly on the economies of scale offered by the world's most popular mobile technology. HSDPA may offer breakthrough advances in WCDMA network packet data capacity, enhanced spectral and radio access networks (RAN) hardware efficiencies, and streamlined network implementations. Those improvements may directly translate into lower cost-per-bit, faster and more available services, and a network that is positioned to compete more effectively in the data-centric markets of the future.
The capacity, quality and cost/performance advantages of HSDPA yield measurable benefits for network operators, and, in turn, their subscribers. For operators, this backwards-compatible upgrade to current WCDMA networks is a logical and cost-efficient next step in network evolution. When deployed, HSDPA may co-exist on the same carrier as the current WCDMA Release 99 services, allowing operators to introduce greater capacity and higher data speeds into existing WCDMA networks. Operators may leverage this solution to support a considerably higher number of high data rate users on a single radio carrier. HSDPA makes true mass-market mobile IP multimedia possible and will drive the consumption of data-heavy services while at the same time reducing the cost-per-bit of service delivery, thus boosting both revenue and bottom-line network profits. For data-hungry mobile subscribers, the performance advantages of HSDPA may translate into shorter service response times, less delay and faster perceived connections. Users may also download packet-data over HSDPA while conducting a simultaneous speech call.
HSDPA may provide a number of significant performance improvements when compared to previous or alternative technologies. For example, HSDPA extends the WCDMA bit rates up to 10 Mbps, achieving higher theoretical peak rates with higher-order modulation (16-QAM) and with adaptive coding and modulation schemes. The maximum QPSK bit rate is 5.3 Mbit/s and 10.7 Mbit/s with 16-QAM. Theoretical bit rates of up to 14.4 Mbit/s may be achieved with no channel coding. The terminal capability classes range from 900 kbits/s to 1.8 Mbit/s with QPSK modulation and 3.6 Mbit/s and up with 16-QAM modulation. The highest capability class supports the maximum theoretical bit rate of 14.4 Mbit/s.
Implementing advanced wireless technologies, such as WCDMA and/or HSDPA, may still require overcoming some architectural hurdles because of the very high speed, and wide bandwidth data transfers that may be supported by such wireless technologies. For example, an HSDPA Category 8 supports 7.2 Mbit/s of peak data throughput rate. Furthermore, various antenna architectures, such as multiple-input multiple-output (MIMO) antenna architectures, as well as multipath processing receiver circuitry may be implemented within a handheld device to process the high speed HSDPA bitstream. However, the implementation of HSDPA-enabled devices that provide higher data rates and lower latency to users may result in increased power consumption, implementation complexity, mobile processor real estate, and ultimately, increased handheld device size.
Further limitations and disadvantages of conventional and traditional approaches will become apparent to one of skill in the art, through comparison of such systems with the present invention as set forth in the remainder of the present application with reference to the drawings.

Method and system for HSDPA bit level processor engine


A transmission control device includes a subcarrier selector configured to select one or more subcarriers for transmitting an error correction code for correcting data, from a plurality of subcarriers having different transmission capacities, each of the plurality of subcarriers used for transmitting either of the data and the error correction code, in accordance with an amount of data of the error correction code and transmission capacities respectively assigned to the plurality of subcarriers.

With a growing demand for communication, optical networks utilizing a wavelength division multiplexing (WDM) technology have become widespread. The WDM technology is a technology in which multiple optical signals each of which has a different wavelength are multiplexed and transmitted. With the WDM technology, for example, multiplexing is performed on optical signals of a transmission rate of 40 Gbps×40 waves, so that a multi-wavelength optical signal of 1.6 Tbps is able to be transmitted.
Examples of a way for error correction in a WDM transmission system include forward error correction (FEC). The FEC exhibits an error correction capability that is in accordance with the redundancy and the code modulation scheme.
As regards the FEC, for example, Japanese Laid-open Patent Publication No. 2003-229815 discloses a WDM transmission system in which FEC data is assigned to wavelength light that is different from that to which main signal data is assigned, and the FEC data is transmitted as an independent signal. With the WDM transmission system, FEC data is not appended to the end of the main signal data. For this reason, it is pointed out that the transmission speed is reduced and the cost of the system is also reduced. Moreover, the WDM transmission system makes it possible to draw a clear distinction between the main signal and the FEC signal. This facilitates the error correction process.
In the WDM transmission system, however, while the transmission capacities of wavelength light are fixed to the same, the amount of FEC data is determined in accordance with the code modulation scheme of FEC and the amount of the main signal data, independently of the transmission capacities of wavelength light. The transmission capacity of the wavelength light assigned to the FEC data is sometimes left over. Accordingly, the above WDM transmission system has a problem in that the transmission efficiency is low.

Transmission control device, transmission system, and transmission method


A dosage form article suitable for oral administration, comprising more than one compartments each delimited by a plurality of distinct segments selected from the group consisting of body parts, cap parts and combinations thereof. The dosage form article comprises: at least one first body part and at least one first cap part each comprising inner and outer surfaces, wherein the first body and cap parts are telescopically engageable; and at least one second body part, comprising inner and outer surfaces, being telescopically engageable with the at least one first body or cap parts or both. The at least one of the second body parts is arranged within the at least one first body part or cap part or both such that a distinct first compartment is formed between the outer surface of the second body part and the inner surface of the first body part or cap part or both.

Capsule technology continues to be subject to development and improvements. In its basic form, standard containers for pharmaceuticals or other powdered, granular or liquid substances (generally referred to as telescope-type or two-piece capsules) include a tubular-shaped and/or cylindrically-shaped first part, namely a cap part, which is closed on one end and open on the other opposite end. A tightly fitting second part of similar shape, namely the body part, is of smaller diameter than the cap part and is typically telescopically engaged therein to form the overall dosage form or two-piece capsule. Similar capsule technology may be used to generate multi-compartment capsules.
Multi-compartment dosage form articles of the above type are known, and are generally used for storing one or more incompatible components therein.
Some multi-compartment dosage forms are in the form of multiple two-piece capsules stored within one another. Generally this involves a larger two-piece capsule forming the outer shell of the dosage form and one or more smaller two-piece capsules therein storing different mediums therein. An example of this arrangement is described in EP1 301 178B1. Disadvantages of this arrangement include dislocation of the inner capsules with respect to the outer capsule which may result in damage of the content and/or capsules themselves during handling, overall size limitations of the dosage form, and the need for complex filling processes.
Other multi-compartment dosage forms, such as described in EP2 211 820B1, are in the form of two-piece capsules with a main cap and a main body being joined to form a first compartment and a further body joined to the outer surface of the aforementioned main body to form a second compartment. Disadvantages of this arrangement include increased overall volume size of the dosage form (particularly overall length of the same) which may be undesirable for swallowability, risk of premature disengagement of the further body from the main body with subsequent spill of the content during handling, as well as requiring complex filling processes in order to fill and assemble the final product.
Therefore there still remains a need for a dosage form article that overcomes the problems of the prior art and in particular allows for a multi-compartment capsule that minimizes overall size of the dosage form, and/or improved resistance during handling, and/or simplifies assembly and filling processes of the same.


One or more memory systems, architectural structures, and/or methods of storing information in memory devices is disclosed to improve the data bandwidth and or to reduce the load on the communication links. The system may include one or more memory devices, one or more memory control circuits and one or more data buffer circuits. The memory system, architectural structure and/or method improves the ability of the communications links to transfer data downstream to the data buffer circuits. The memory control circuit receives a store command and a store data tag (Host tag) from a Host and sends the store data command and the store data tag to the data buffer circuits. No store data tag or control signal is sent over the communication links between the Host and the data buffer circuits, only data is sent over the communication links between the Host and the data buffer circuits.

The present invention relates to memory systems and more particularly distributed buffer memory systems.
With recent advancement of information technology and wide use of the Internet to store and process information, more and more demands are placed on the acquisition, processing, storage and dissemination of information by computing systems. Computing systems are being developed to increase the speed at which the computers are able to execute increasingly complex applications for business, personal use, and entertainment. Overall computer system performance is affected by each of the key elements of the computer structure, including the performance/structure of the processors, any memory caches, input/output (I/O) subsystems, efficiency of the memory control functions, the performance of the memory devices and systems, and any associated memory interface elements, and the type and structure of the memory interconnect interfaces.
The constantly increasing speed of processors which execute increasingly complex applications places more rigorous performance demands on all of the other subsystems in the computer, including the memory subsystem, where data is stored, accessed, and updated numerous times during the operation of a software application. The time consumed by memory read/write operations is a major factor in the ultimate speed and efficiency of a computer system. The memory subsystem of most computers is normally operated by a memory controller. The task of memory controllers is to move data between the computer's memory subsystem and its one or more processors as quickly and efficiently as possible. A computer's memory subsystem often comprises memory modules, usually one or more dual in-line memory modules (DIMMs) that include several dynamic random access memory (DRAM) devices.
In many memory subsystems, a memory controller may control multiple memory channels, where each channel may include one or more Dual In-line Memory Modules (DIMMs), where the DIMMs may be arranged in one or more ranks. Computing demands require the ability to access an increasing number of higher density memory devices at faster and faster access speeds.
Extensive research and development efforts are invested by the industry to create improved and or innovative solutions to maximize overall system performance by improving the memory system/subsystem design and/or structure and the methods by which the memory system/subsystem operates. Such efforts have resulted in the development of distributed memory systems, distributed buffer memory systems, registered DIMMs (RDIMMs) and load reduced DIMMs (LRDIMMs), and other systems, specifications and standards such as, for example, DDR4 and DDR5, which provide for increased memory performance.
In one example, a distributed memory system may include a plurality of memory devices, one or more Address Chips (AC), also known as memory control circuits, and a plurality of data buffer or data (DC) circuits. There are communication links or buses between a Host processor and the memory control circuits and data buffer circuits. There is also a communication link or bus from the memory control circuits to the data buffer circuits. There are also communication links between the memory devices, e.g., DRAMS, and the memory control circuits and the data buffer circuits. Bandwidth limitations on communication links can affect performance of memory systems. The amount of data, command, control and response signals sent over communication links and busses between the Host, the memory control circuits, the data buffer circuits, and the memory devices, which includes the bandwidth allocated to transmit store data control functions, e.g., store data address tags and locations, impacts performance of memory systems.

Address/command chip controlled data chip address sequencing for a distributed memory buffer system

International Business Machines Corporation


A method for ensuring the security of subscriber cards, includes the following steps: setting a security key in the subscriber card, and setting a verification equipment and storing the security key in the verification equipment; the subscriber card authenticating the verification equipment according to the security key before responding to relevant access request; if the authentication succeeds, the relevant access is permitted; otherwise, the relevant access is refused. With the present invention, the security of the subscriber card is guaranteed without using a PIN code, which is very convenient for the subscriber.

1. Field of the Invention
The present invention relates to information security techniques, more particularly to a method for ensuring the security of a subscriber card.
2. Background of the Invention
At present, information access of a subscriber card in a mobile terminal, such as a Subscriber Identify Module (SIM) card, is protected by a Personal Identification Number (PIN) code. Specifically, when the PIN code is set for the subscriber card, the access to the subscriber card is protected by the PIN code, i.e., if the PIN code is set, the cell phone will prompt the subscriber to input the PIN code to start up the cell phone.
Although information in the subscriber card can be protected by setting a PIN code, it is not widely acceptable by the subscribers. Because the subscriber has to input the PIN code each time accessing the card, i.e., each time starts up the cell phone. Therefore, the existing PIN code of the subscriber card does not work to ensure the security of the subscriber card due to most subscribers not willing to use the PIN code. Thus the PIN code becomes useless. Just as any regulation and legal clause, no matter how precise they are, they must have operability.

Method for ensuring security of subscriber card


A heated garment system in one embodiment includes a jacket, a wiring circuit embedded within the jacket and configured to generate heat, a battery assembly configured to removably couple with the wiring circuit, the battery assembly including a power button for selectively applying power to the wiring circuit, and a battery holder configured to removably receive the battery assembly.

Workers, hunters, hikers, and other individuals are frequently required to be in locations which expose the individuals to extreme weather. In conditions where the individual is exposed to cold weather, the individual frequently needs to don several layers of clothing in order to stay warm. Such layering, while effective, can significantly hinder the ability of the individual to perform tasks. Moreover, layering typically cannot be accomplished for extremities such as the hands and ears. Accordingly, even when wearing gloves, an individual can become uncomfortably and even dangerously cold.
What is needed is cold weather gear which provides warmth without requiring excessive layering of garments.


The present invention relates to mutant proline-and-arginine rich (PR) peptides with defined structural characteristics for use in inhibiting mammalian 20S proteasome activity and modulating expression of genes regulating the NF-κB pathway. Mutant PR peptides of the present invention differ from wild-type PR peptides by having at least one to three amino acid substitutions, wherein at least one of the amino acid residues at position one, two or three of the mutant PR peptide is positively charged.

Blood vessels grow in response to tissue injury and ischemia via angiogenesis, arteriogenesis and vasculogenesis. Transcriptional activation of a number of angiogenesis-related genes including VEGF, VEGF receptors such as flt-1 and neuropilin-1, and PDGF-B, and angiopoietin among others (Semenza (2000) Biochem. Pharmacol. 59:47-53) are regulated by hypoxia-inducible factor (HIF)-1α. Further, macrophages secrete numerous proteins including cytokines (IL-2 and TNF-α) and matrix metalloproteinases (Sunderkotter, et al. (1991) Pharmacol. Ther. 51:195-216; Gordon, et al. (1995) Curr. Opin. Immunol. 7:24-33; Arras, et al. (1998) Basic Res. Cardiol. 93:97-107). Among these is PR39, a cathelin-like "proline-and-arginine rich peptide" (PARP) originally isolated from pig intestine for its antimicrobial property (Agerberth, et al. (1996) Vet. Immunol. Immunopathol. 54:127-31; Agerberth, et al. (1991) Eur. J. Biochem. 202:849-54). PR39 and its homologs are found in the wound fluid of many animals as well as along the border of acute myocardial infarction (Gallo, et al. (1994) Proc. Natl. Acad. Sci. USA 91:11035-9). Secreted as a prepropeptide, the mature 39 amino acid C-terminal polypeptide chain (PR39) is produced by rapid cleavage of a canonical leader sequence (Gudmundsson, et al. (1995) Proc. Natl. Acad. Sci. USA 92:7085-9). PR39 crosses cell membranes readily, and is reported to bind to SH3 domains of cytosolic component of NADPH oxidase complex, protein p47phox15 and a signaling adaptor protein p130Cas9 (Gudmundsson, et al. (1995) supra; Chan & Gallo (1998) J. Biol. Chem. 273:28978-85; Chan, et al. (2001) J. Invest. Dermatol. 116:230-5).
PR39 is composed of 39 amino acids and induces angiogenesis and reduces inflammation in mouse models. PR39 is suggested to induce angiogenesis by acting along the VEGF and FGF pathway. PR39 also selectively inhibits the degradation of proteins including HIF-1α and IκBα, presumably by binding to the α7 subunit of the 20S proteasome. U.S. Patent Application Publication No. 20040009463 discloses a method for PR39 peptide-mediated selective inhibition of IκBα, and certain PR39-derived oligopeptides. A peptide composed of the first eleven amino acid residues of PR39, namely PR11, is also able to inhibit the 20S proteasome, albeit with a reduced Ki.
Studies have shown that PR39 stimulates angiogenesis in vitro and in vivo. Transgenic expression in cardiac myocytes results in increased vessel numbers and reduced coronary resistance (Li, et al. (2000) Nat. Med. 6:49-55). These effects appear to derive from the inhibition of HIF-1α degradation, which results in increased VEGF expression. PR39 also increases the expression of FGFR1 and syndecan-4, another FGF-2 signaling protein (Volk, et al. (1999) J. Biol. Chem. 274:24417-24; Li, et al. (1997) Circ. Res. 81:785-96), suggesting that PR39 may also induce angiogenesis via FGF pathway. PR39 appears to function by binding to the non-catalytic α7 subunit of 20S proteasome and inhibiting the degradation of another key intracellular protein, NF-κB inhibitor, IκBα (Gao, et al. (2000) J. Clin. Invest. 106:439-48).
Non-lysosomal degradation of cellular proteins occurs by the action of E1, E2 and E3 enzymes that result in the tetra-ubiquitinylation of target proteins and their proteolysis by the enzymatic activities residing within the central chamber of the 20S proteasomes. Ubiquitin and ubiquitin-like proteins are responsible for regulating numerous cellular pathways including the cell division cycle, transcription, protein sorting in the secretory pathway, membrane protein transport, endocytosis, nuclear transport, and signal transduction. The identification and analyses of inhibitors of proteasome are, therefore, of immense value to treat a variety of diseases, e.g., cancer, autoimmune diseases, muscle wasting, and inflammation. One example of a successful proteasome-based drug is the boronate, bortesomib (VELCADE™). This, and a variety of other agents currently in clinical testing act by blocking the enzymatic activities resident within the 20S proteasome resulting in the cessation of proteolysis of all substrate proteins and triggering apoptosis.
Cylindrical 20S proteasomes of eukaryotes, at approximately 700 kDalton mass, are composed of two heptameric inner rings of β-subunits and two heptameric outer rings of α-subunits. Thus, it is not surprising that a majority of proteasome inhibitors target the active sites that are exclusively associated with the β-subunits. The α-subunits are not known to possess proteolytic activity. It is remarkable, then, that the association of PARP with the α7 subunit of 20S proteasome should function to selectively inhibit proteolytic degradation of polypeptide chains such as IκBα. Atomic force microscopic investigations reveal that the 20S proteasome undergoes a gross structural change upon binding PR39. However, this does not sufficiently explain the mechanism of selective inhibition by PARP or the basis of PARP-proteasome interactions.

Mutant proline-and-arginine rich peptides and methods for using the same

Board of Regents University of Texas System


A network security system employing multiple levels of processing to identify security threats. Multiple host machines may each contain an agent that detects possibilities of security threats based on raw data sensed locally at that host. The hosts may share information obtained from local analysis and each host may use information generated at one or more other hosts, in combination with information generated locally, to identify a security concern, indicating with greater certainty that a security threat exists. Based on security concerns generated by multiple hosts, a security threat may be to indicated and protective action may be taken.

Intrusion detection is the practice of identifying inappropriate, unauthorized, or malicious activity in computer systems. Systems designed for intrusion detection typically monitor for security breaches perpetrated by external attackers as well as by insiders using the computer system or a computer network. As computer systems become increasingly interconnected through networking, intruders and attackers are provided with greater opportunities for gaining unauthorized access while avoiding detection. As a result of widespread cooperative use of shared computing resources, for example in corporate network environments, intrusion detection systems (IDS) are commonly tasked with monitoring complex system organizations and detecting intrusions to network segments including multiple computing machines and/or devices.
FIG. 1 illustrates a simple computing network, for example in a business office, which includes multiple electronic machines and/or devices of various types, such as personal computers 105, office workstations 110, mass storage subsystems and servers 115, and printers/copiers/fax machines 120. The various devices are connected through a network to form an integrated environment in which information can be generated, accessed and shared among the legitimate users of the business environment. In such a network, a potential intruder can attempt to compromise any of a number of interconnected machines and/or devices in order to gain access to the network 100 as a whole.
In order to detect such attack attempts, some existing implementations of IDS install a host-based sensor at each of the machines within the network to be monitored. Such host-based intrusion detection system (HIDS) sensors are typically loaded in software onto a host system such as a computer to monitor the traffic (some of which may be encrypted) going in and out of the host. Anomalous traffic patterns or known attack signatures could signal an external attack on the host, an unauthorized use originating from the host, or an internal attack originating from an infected or otherwise compromised host. Some HIDS sensors may also monitor files and processes internal to the host system to watch for suspicious use of the host itself. If known suspicious activity is detected at the host, some HIDS will typically generate an alert to be sent throughout the network as a notification of a detected intrusion.
Other existing forms of IDS focus monitoring on an entire network segment rather than on individual hosts. Such network-based intrusion detection systems (NIDS) are typically installed as physical devices positioned at locations within the network where they can monitor all network traffic entering and exiting the network segment. For example, a NIDS sensor is often implemented as a physical NIDS device 140 placed just behind a firewall 160 protecting a network segment 100, as illustrated in FIG. 1, such that all traffic going in and out of the network segment must pass through and be scanned by the NIDS. The NIDS typically operates at the lower layers of the protocol stack to watch for suspicious network traffic patterns such as connection attempts to known frequently attacked ports, anomalous combinations in packet headers, and known attack signature patterns in unencrypted packets.
In addition to intrusion detection, some network security systems also incorporate intrusion protection systems (IPS) which are capable of reacting to detected security breaches to protect the network. For example, a network-based IPS could drop suspicious unencrypted packets or block a suspected intruder from communicating with the network. A host-based IPS could prevent unauthorized changes to files or code residing on the host system, and could deny access to the host by suspicious users or applications.

This patent is subject to a terminal disclaimer.

Network intrusion detection with distributed correlation


An apparatus and method for adhesively bonding a back surface of a substrate to an active surface of at least one semiconductor die having adhesive tape interposed therebetween. A wetting agent layer is provided on at least one of the back surface of the substrate and the active surface of at least one semiconductor die. The wetting agent layer interacts with an adhesive on the adhesive tape when the substrate is heated so that the substrate is adhesively bonded to at least one semiconductor die. The interaction of the wetting agent layer allows the adhesive tape to bond thereto at a lower temperature than that of the conventional bonding methods, and more importantly, enhances adhesion thereto.

1. Field of the Invention
The present invention relates to a xe2x80x9cchip-over-boardxe2x80x9d semiconductor assembly, a type of xe2x80x9cchip-on-boardxe2x80x9d (COB) semiconductor assembly. More specifically, the present invention relates to a method and apparatus for attaching a semiconductor device to a substrate for the subsequent wire bonding of the bond pads on the active surface of the semiconductor device to circuits of the substrate.
2. State of the Art
Definitions: The following terms and acronyms will be used throughout the application and are defined as follows:
BGAxe2x80x94Ball Grid Array: An array of minute solder balls disposed on an attachment surface of a semiconductor die wherein the solder balls are refluxed for simultaneous attachment and electrical communication of the semiconductor die to a printed circuit board. A BGA may also be disposed on the printed circuit board. Conductive polymer balls or bumps may also be employed.
COBxe2x80x94Chip-On-Board: The techniques used to attach semiconductor die to a printed circuit board or other suitable substrate. In this instance, COB also refers to a semiconductor die attached to a printed circuit board or substrate having an aperture therein for wire bonds to extend therethrough from the bond pads on the semiconductor die to circuits of the printed circuit board or substrate.
Flip-Chip: A semiconductor chip or semiconductor die having a pattern or array of terminations spaced around the active surface of the chip or die for face-down mounting of the chip or die to a substrate.
Flip-Chip Attachment: A method of attaching a semiconductor die to a substrate in which the die is inverted so that the connecting conductor pads on the face of the device are set on mirror-image pads on the substrate and bonded by solder reflux or a conductive polymer curing.
Wire Bonding: Conductive wires attached between the bond pads on the active surface of a semiconductor die and the circuits of a circuit board or lead frame to form an electrical connection therebetween.
TABxe2x80x94Tape-Automated-Bonding. Conductive traces are formed on a dielectric film such as a polyimide (the structure also being termed a xe2x80x9cflex circuitxe2x80x9d). The film is precisely placed to electrically connect a die and a circuit board or lead frame through the traces. Multiple connections are simultaneously effected.
Glob Top: A glob of encapsulant material (usually epoxy or silicone or a combination thereof) surrounding a semiconductor die in a COB assembly.
PGAxe2x80x94Pin Grid Array: An array of small pins extending substantially perpendicular from the major plane of a semiconductor die, wherein the pins conform to a specific arrangement on a printed circuit board or other substrate for attachment thereto.
SLICCxe2x80x94Slightly Larger than Integrated Circuit Carrier: An array of minute solder balls disposed on an attachment surface of a semiconductor die similar to a BGA, but having a smaller solder ball pitch and diameter than a BGA.
State-of-the-art COB technology generally consists of three techniques for attaching semiconductor die to a substrate: flip-chip attachment, wire bonding, and TAB.
Flip-chip attachment consists of attaching a semiconductor die, generally having a BGA, a SLICC or a PGA, to a printed circuit board. With the BGA or the SLICC, the solder ball arrangement on the semiconductor die must be aligned with the connecting bond pads on the printed circuit board such that precise connection is made. After proper alignment, the semiconductor die is bonded to the printed circuit board by reflowing the solder balls. With the PGA, the pin arrangement of the semiconductor die must be a mirror-image of the pin recesses on the printed circuit board. After insertion, the semiconductor die is generally bonded by soldering the pins into place. An underfill encapsulant is then generally disposed between the semiconductor die and the printed circuit board for environmental protection and to enhance the attachment of the die to the board.
Wire bonding, unlike flip-chip attachment, generally begins with attaching either the active surface or the backside of a semiconductor die to the surface of a printed circuit board with an appropriate adhesive, such as an epoxy. In wire bonding, a plurality of bond wires are attached, one at a time, to each bond pad on the semiconductor die and extend to a corresponding lead or trace end of a circuit on the printed circuit board. The bond wires are generally attached through one of three industry-standard wire bonding techniques: ultrasonic bondingxe2x80x94using a combination of pressure and ultrasonic vibration bursts to form a metallurgical cold weld; thermocompression bondingxe2x80x94using a combination of pressure and elevated temperature to form a weld; and thermosonic bondingxe2x80x94using a combination of pressure, elevated temperature, and ultrasonic vibration bursts. The semiconductor die may be oriented either face up or face down (with its active surface and bond pads either up or down with respect to the circuit board) for wire bonding, although face-up orientation has been more common.
In TAB semiconductor assemblies, ends of metal leads carried on an insulating tape, such as a polyimide, are attached to the bond pads on the semiconductor die and to corresponding lead or trace ends on the printed circuit board. An encapsulant, or plastic resin, is generally used to cover the bond wires and metal tape leads to prevent contamination, aid mechanical attachment of the assembly components, and increase long-term reliability of the electronics with reasonably low-cost materials.
A common manner of forming the encapsulant or plastic package about a semiconductor die assembly is molding and, more specifically, transfer molding. In this process (and with specific reference to COB die assemblies), after the semiconductor die is attached to the substrate (i.e., FR-4 printed circuit board), the semiconductor die assembly is placed in a mold cavity in a transfer molding machine. The semiconductor die assembly is thereafter encapsulated in a thermosetting polymer which, when heated, reacts irreversibly to form a highly cross-linked matrix no longer capable of being re-melted. In addition, another common manner of forming encapsulants for COB assemblages is xe2x80x9cglob topxe2x80x9d polymeric encapsulation. Glob top encapsulation can be applied by dispensing suitably degassed material from a reservoir through a needle-like nozzle onto the semiconductor die assembly.
The thermosetting polymer of transfer molding generally is comprised of three major components: an epoxy resin, a hardener (including accelerators), and a filler material. Other additives such as flame retardants, mold release agents and colorants are also employed in relatively small amounts. Furthermore, glob top encapsulation can comprise a nonlinear thixotropic material that also includes fillers to achieve the desired degree of thixotropy.
As previously set forth, bonding a semiconductor die to the surface of a substrate for wire bonding chip-on-board and TAB chip-on-board semiconductor assemblies is well known in the art. However, there are problems in the bonding process thereof, and specifically, problems associated with heating the adhesive between the semiconductor die and the substrate. In particular, the substrate is heated to a temperature so that the adhesive flows and then cures to thereby bond the die to the substrate with the cured adhesive therebetween. Some of the problems associated with heating the substrate at the temperature required to flow the adhesive are generally as follows: first, thermal stress exists in the interface between the adhesive and the semiconductor die and the adhesive and the substrate; and second, undesirable outgassing of a solder mask material layering a BGA on the substrate. These problems may result in health and contamination issues, and more importantly, potential detachment of the semiconductor die.
In U.S. Pat. No. 5,972,739, there is illustrated a semiconductor chip attached to a printed circuit board using a sheet of B-stage thermosetting resin having a filler therein, such as particles, fibers, or nonwoven fabric, wherein the active surface, or other surfaces, of the semiconductor chip is treated with a solution of a silane-coupling agent. The bumps on the active surface of the semiconductor chip extend through holes in the B-stage thermosetting resin to contact circuits on the printed circuit board.
In U.S. Pat. No. 5,348,607, a mixture for affixing dice to a substrate is illustrated. The mixture includes a thermoplastic polyimide, a solvent for the polyimide, and a solvent which does not dissolve the polyimide but adds thixotropicity to the mixture. The mixture is applied to the substrate, the dice are placed thereon, and the solvents are evaporated to bond the dice to the substrate. A poor solvent for the polyimide, spread over the dice and exposed portions of die attach material, causes some polyimide to precipitate out of the solution in the exposed portions of the die attach material to form a grid that extends between the dice and prevents the dice from xe2x80x9cswimming togetherxe2x80x9d during the high temperature processing. In a solvent die attachment method, the substrate is first coated with a mixture of die attach material and then the mixture is dried. Spraying a solvent over the die attach material causes the material to soften so that the dice applied thereto may adhere. The die attach material is then dried to form the bond.
U.S. Pat. Nos. 5,990,545 and 5,866,949 illustrates a semiconductor die in a chip-scale ball grid array having a nonpolymer layer or support structure positioned between a semiconductor die and a substrate.
U.S. Pat. Nos. 5,977,226 and 5,914,186 illustrate a vacuum dispensable silicone composition having low outgassing properties suitable for use in chip-scale packages and a high temperature antistatic pressure-sensitive adhesive tape.
In U.S. Pat. Nos. 5,994,772, 5,977,632, 5,929,521, and 5,892,277, various types of semiconductor attachments for attaching and electrically connecting a semiconductor die to a substrate are illustrated.
Based on the foregoing, it would be advantageous to develop a method for attaching a semiconductor die to a substrate at lower temperatures than that done conventionally, and thus, prevent the problems as discussed previously.
The present invention relates to a method and apparatus for bonding an active surface of a semiconductor die to the back surface of a substrate, the substrate having an aperture therethrough for the wire bonds between the bond pads on the active surface of the semiconductor die and the circuits on the front surface to pass through the aperture. Subsequently, the aperture is filled with an encapsulant material, as well as the portions of the wires of the wire bonds being encapsulated. The present invention is directed to a method and apparatus for bonding the active surface of the semiconductor die to the substrate using an adhesive tape therebetween. The method and apparatus includes pretreating the back surface of the substrate and/or the active surface of the semiconductor die with a wetting/adhesion promotion agent layer. The wetting/adhesion promotion agent layer is applied to at least a portion of the back surface of the substrate and/or portions of the active surface of the semiconductor die.
In the present invention, the wetting/adhesion promotion agent layer is directed to increase the surface tension thereof to promote adhesion of the substrate and/or semiconductor die. In addition, by increasing the surface tension, the substrate may be heated at a lower temperature in order for an adhesive on the adhesive tape to flow. In this manner, the present invention provides a decrease in thermal stress in the interface between the semiconductor die and substrate. Further, the lower temperature provides a decrease in the potential for out-gassing from the adhesive used on the tape for attaching the semiconductor die to the substrate during BGA attachment of the substrate and semiconductor die to another substrate. Accordingly, the present invention provides enhanced adhesion between a semiconductor die and a substrate than that provided conventionally.
In addition, the wetting/adhesion promotion agent layer in the present invention may comprise a silane-coupling agent, titanate-coupling agent, and/or a solvent. The wetting/adhesion promotion agent layer may comprise one or more layers and may be applied using a dispensing method, a brushing method, a spraying method, and/or a screen printing method.
In a preferred embodiment, the present invention is directed to bonding a semiconductor die to a substrate for the use of wire bonding chip-on-board semiconductor assemblies.
Alternately, the method and apparatus of the present invention may be directed to pretreating any type of semiconductor device, bare or packaged, and any type of substrate with a wetting agent layer to enhance bonding between multiple substrates, semiconductor devices, and/or a semiconductor die to a substrate, particularly where adhesive tape is used to secure the semiconductor device to a substrate.

Substrates and assemblies including pre-applied adhesion promoter


Methods for the site-selective growth of horizontal nanowires are provided. According to the methods, horizontal nanowires having a predetermined length and diameter can be grown site-selectively at desired sites in a direction parallel to a substrate to fabricate a device with high degree of integration. Further provided are nanowires grown by the methods and nanodevices comprising the nanowires.

1. Field of the Invention
The present invention relates to methods for the site-selective growth of horizontal nanowires, nanowires grown by the methods, and nanodevices comprising the nanowires. More particularly, the present invention relates to methods for the site-selective growth of horizontal nanowires having a predetermined length and diameter at desired sites in a direction parallel to a substrate to fabricate a device with high degree of integration, nanowires grown by the methods, and nanodevices comprising the nanowires.
2. Description of the Related Art
Nanowires are linear materials whose diameter is in the nanometer range (1 nm=10−9 m) and whose length is several hundred nanometers or on the order of micrometers or millimeters. Nanowires exhibit various physical properties depending on their diameter and length. Nanowires can find various applications in highly integrated devices due to their small size. Nanowires offer advantages in that electron mobility characteristics in particular directions and optical properties, such as polarization, inherent to nanowires can be utilized.
Chemical vapor deposition (CVD), laser ablation, methods using templates and other methods have been employed to prepare nanowires. Such conventional methods have a problem in that nanowires are randomly grown, resulting in non-uniform diameter and length distributions.
Extensive research on nanowires has been made in nanotechnology fields, including photonic devices, transistors and memory devices. Devices using semiconductor nanowires have hitherto been fabricated by bottom-up approaches. According to the bottom-up approaches, nanowires are arranged on substrates by a suitable technique, such a nanomanipulation, hydrodynamic alignment, alignment by imprinting, or alignment using hydrophilicity and/or hydrophobicity of liquid, followed by planar lithography to form connection points. However, the integration technologies are not suitable for the fabrication of large-scale integrated devices for industrial application. Current research on the integration technology of nanowires is unsatisfactory and more research is still needed.
Although small-size devices can be fabricated using nanowires, technology to selectively arrange nanowires at desired sites on substrates to fabricate devices has not yet been put to practical use.

Methods for site-selective growth of horizontal nanowires, nanowires grown by the methods and nanodevices comprising the nanowires

Seoul National University Industry Foundation


A staggered fin array has a plurality of dissipation fins disposed upright on a substrate. Each dissipation fin has at least one staggered structure at one side or on opposite sides thereof. The staggered structure has two stair structures. Each stair structure has many step surfaces parallel to the airflow direction. An interval surface is formed between adjacent step surfaces. The interval surface is designed as an opening. No more than two leading ledges, formed by the openings, are formed in a single airflow route.

1. Field of Invention
The present invention relates to a fin array for heat dissipation. More particularly, the present invention relates to a fin array applied in a notebook computer.
2. Description of Related Art
As notebook PCs become thinner, there is less and less space for heat convection and heat dissipation design inside the case housing of the notebook PC. When it comes to high-frequency components, such as the CPU (central processing unit) and graphics processing chip, the heat dissipation design hits a bottleneck. Thus, the mainstream framework of heat dissipation design is to enhance average convection co-efficiency between heat dissipation and a centrifugal fan by increasing airflow output of the centrifugal fan.
FIG. 1A illustrates a perspective view of a conventional heat dissipation fin array. When cooling air 102 passes by a conventional extruded aluminum fin set 100 as illustrated in FIG. 1A, a Poiseuille airflow 104 is created. Such a Poiseuille airflow 104 can generate a noise spectrum distribution 106 as illustrated in FIG. 1B. A higher summit point 106a of generated noise spectrum distribution 106 means a more uncomfortable noise is created.
When heat dissipation efficiency is enhanced, airflow is essentially accelerated. The stronger the airflow is, the more turbulent and noisy the wake flow is. Thus, a notebook PC manufacturer faces a challenge between noise and heat dissipation efficiency.


A multi-antenna receiving and processing circuit assembly is disclosed to include multiple antennas for receiving wireless signals, multiple pre-processing units respectively electrically connected to the antennas, a matching circuit electrically connected to the pre-processing units for matching signals from the pre-processing units into a matching signal, a post-processing unit electrically connected to the matching circuit for processing the matching signal from the matching circuit through a single intermediate frequency signal and into a plurality of audio frequency signals respective to each antenna, and an output circuit electrically connected to the post-processing unit for outputting the audio frequency signals to external audio output devices.

1. Field of the Invention
The present invention relates generally to audio signal processing and more specifically, to a multi-antenna receiving and processing circuit assembly.
2. Description of the Related Art
There are known wireless transmission devices that use multiple antennas to receive different signals. However, these conventional wireless transmission devices commonly use two independent processing circuits to convert different input signals into different audio signals for output. Because two independent processing circuits are used, the circuit design of the aforesaid conventional wireless transmission devices is complicated, resulting in a high manufacturing cost and big device size.

Multi-antenna receiving and processing circuit assembly


A technique for improving the computational time for performing a non-maximum suppression operation may include receiving a request to perform a non-maximum suppression operation on a set of candidate predictions of a computing task, and performing a statistical analysis on a set of confidence scores corresponding to the set of candidate predictions to determine a standard deviation of the set of confidence scores. A confidence score threshold can be determined based on the standard deviation. Candidate predictions having a confidence score below the confidence score threshold can then be discarded to form a reduced set of candidate predictions. Additional candidate predictions can be discarded from the reduced set of candidate predictions based on an intersection-over-union overlap metric, and the remaining candidate predictions from the reduced set of candidate predictions can be provided as a result of the non-maximum suppression operation.

Artificial neural networks are computing systems with an architecture based on biological neural networks. Artificial neural networks can be trained, using training data, to learn how to perform a certain computing task for an application. The trained artificial neural network can then perform the computing task, for example, to generate an inference from input data. Computing tasks that neural networks can perform may include human-like functions such as visual and audial perception.

Workload reduction for non-maximum suppression operation


A package for dispensing a fluent material contained in the package. The package can include a first polymeric sidewall having a first perimeter and a second polymeric sidewall having a second perimeter, the first and second polymeric sidewalls being joined at least along a portion of the first and second perimeters to define a flexible pouch having an interior compartment for a contained fluent material in an equilibrium pressure state. An opening permits fluid communication through the first opening upon the contained fluent material being in a positive pressure state greater than the equilibrium pressure state. The opening can have a magnetic valve, the magnetic valve having a first magnetic region and an opposing second magnetic region. The first magnetic region and second magnetic region can be in a separable magnetically contacting state to alternately permit and prevent fluid communication of the fluent material.

Packaging for dispensing fluent materials like powders and relatively high viscosity fluids such as such as lotions, creams, pastes, and the like, can be challenging. Being able to dispense out an amount of fluent material desired through an opening in a controlled manner and being able to stop the fluid flow at will in a commercially viable manner can be problematic. In addition, dispensing fluent materials can result in the product being contaminated. Fluent dispensers can fail to seal in the fluent material and the product can clog or interrupt the seal during multiple uses. Further, often packaging for dispensing fluent materials requires two-handed operation to open, dispense, and/or close the package.
There remains an unmet need, therefore, for packaging that permits controlled dispensing of fluent materials.
Further, there remains an unmet need for a package capable of dispensing fluent materials that can resist contamination through multiple uses.
Further, there remains an unmet need for a package that can open to dispense fluent materials and subsequently be closed in a one-handed operation.
Additionally, there remains an unmet need for packaging for dispensing a fluid contained in the package that can be manufactured in a commercially viable manner.


In a phase-locked loop comprising a phase detector (1), a loop filter (5) and a controlled oscillator (17) which are arranged on a common integrated circuit, interferences coupled into the substrate of the integrated circuit by other parts of the circuit are suppressed. In a first embodiment of the invention, this object is achieved in that the controlled oscillator (17) is preceded by a capacitive voltage divider (9) which comprises at least two capacitances (10, 12), the controlled oscillator (17) is controlled in dependence upon the output signal of the capacitive voltage divider (9), and the capacitive voltage divider (9), together with the phase detector (1), the loop filter (5) and the controlled oscillator (17) is arranged on an integrated circuit. In accordance with a second embodiment of the invention, the reduction of interference is achieved in that the controlled oscillator (17) has a differential structure and comprises at least two voltage-controlled current sources (18, 19) whose circuits are coupled to a power supply potential and to a substrate on which the integrated circuit is arranged, the controlled oscillator (17) has an output stage (20) which is arranged behind the voltage-controlled current sources (18, 19) and generates two differential digital signals in dependence upon the differential signals applied thereto, which differential digital signals are generated with a high edge steepness by means of switching between two potentials and are applied to amplifier stages (56, 57) which are arranged between power supply potential and reference potential and supply two differential output signals operating at reference potential.

The invention relates to a phase-locked loop comprising a phase detector, a loop filter and a controlled oscillator which are realized on an integrated circuit.
Such a fully integrated phase-locked loop is known from, for example the Philips ICs SAA 7196, SAA 7110 and SAA 7111. In phase-locked loops (PLL) of this type, the problem occurs that interference voltages within the integrated circuit are coupled into the elements of the phase-locked loop, ie the phase detector, the loop filter and/or the controlled oscillator, as well as further possible PLL circuit elements. An integrated circuit is built on a substrate which is provided with further layers in which the circuits are realized. The circuits themselves are not directly connected to the substrate but signals from the circuits built on the substrate are applied to the substrate by means of capacitive couplings. This is also effected in a reverse manner, ie these interferences from the substrate are coupled into other circuit elements again. This problem may be aggravated in that analog as well as digital circuits are built on such an integrated circuit. Digital circuits generally operate with signals having relatively steep edges which are capacitively coupled into the substrate in a particularly intensive way. These signals are then also coupled via capacitive couplings into analog circuits built on the substrate. Interferences then clearly become manifest in the analog circuits and in the signals conveyed by these circuits. For a phase-locked loop of the type described above, this means that the output signal is superimposed by phase fluctuations, generally referred to as jitter. This is generally undesirable.

Phase-locked loop with capacitive voltage divider for reducing jitter


The present disclosure provides methods, reagents, systems, and devices that target β lactamase as a biomarker for the sensitive and specific detection of tuberculosis-complex bacteria. Specifically, the present disclosure relates to methods and compositions for the detection of specific β-lactamase protein and nucleic acid sequences to indicate the presence of tuberculosis-complex bacteria.

As described above in part II, β-lactamase (BlaC) can be a useful biomarker for tuberculosis-complex bacteria. As further described, in silico analysis of all available β-lactamase sequences demonstrated that β-lactamases are conserved in TB-complex bacteria, yet are unique as compared to all other non-TB-complex sequences, including eukaryotes and prokaryotes. Accordingly, the present discussion validates the concept that TB-complex bacteria can be specifically detected by virtue of the unique nucleic acid sequence.
Method and Results
BeaconDesign 8.0 was used to design optimal primer and beacon sets with the annealing temperature of the beacon being at least 9° C. above the Tm of the primers. Five primer and beacon sets were identified (see Table 2, above). The beacon for each set was subjected to nBLAST, that includes all eukaryotes and prokaryotes currently sequenced for a total of over 20 million sequences and >50 billion nucleotides as of Nov. 11, 2013 (not shown). The beacon probe showing the lowest E-value and maximum query coverage is SEQ ID NO:9 (Table 2, row 3), which was used in conjunction with the primers with sequences set forth in SEQ ID NOS: 18 and 27, as the probe of choice due to its lowest similarity to non-mycobacterial sequences. Thus, probe 3 (set forth in SEQ ID NO:9) was the best of the five beacons designed using the BeaconDesign software and was selected in conjunction with the corresponding primers (see Table 2, row 3) for synthesis, characterization, and validation in detection assays using chromosomal DNA from humans, Mtb and various bacterial pathogens, including M. marinum, M. avium, Pseudomonas, Staphylococcus, and others. The selected probe and primer set were ordered from Integrated DNA technologies and used for the real-time experiments.
Mycobacterial DNA was extracted from BCG cultured in 100 ml M-OADC-Tw media at 37° C. until an OD600 of 0.8 was achieved. The cells were pelleted out by centrifugation at 3500 rpm for 15 min and re-suspended in minimal amount of saline solution (0.9%). Cell lysis was achieved by addition of 500 μL of acid washed beads in 750 μL of TE buffer per 250 μL of re-suspended pellet, followed by vortexing. Lysed cells were centrifuged at 10,000 rpm for 10 min and the supernatant was collected. RNAseA was added to the supernatant to a final concentration of 0.1 mg/mL followed by incubation at 37° C. for 1 hr in order to eliminate RNA contamination from the supernatant. Equal volumes of phenol-chloroform-isoamyl alcohol was added to the supernatant and incubated for four minutes with gentle rocking followed by centrifugation at 10,000 rpm for 10 min. The supernatant was collected and DNA was precipitated by adding 3 M NaOAc in the ratio of 1:10 and two volumes of cold ethanol. The precipitated DNA was then pelleted out by high speed centrifugation (13,000 rpm) followed by 70% ethanol washes. The DNA pellet was dissolved in TE and stored at 4° C. for further use. DNA concentration and quality of the extracted DNA was determined.
The concentration of extracted Mycobacterial DNA was estimated to be 455 ng/μl. 1:10 dilution of this sample was loaded onto an agarose gel to visually establish DNA quality (not shown).
Molecular Beacon real-time PCR was carried out using the selected set of primers and probe (see Table 2, row 3). The PCR reaction contained 10 to 100 ng of BCG DNA, 7 mmol/L final concentration of MgCl2, 200 μmol/L concentration of dNTP, 2.5 U of taq DNA polymerase, 0.2 μmol/L final concentrations of the primer pair and 0.2 μmol/L final concentration of the beacon. The PCR was performed on the Applied Biosystem, step one real-time PCR system, using the following cycling conditions: 95° C. for 3 min, followed by 50 cycles of 94° C. for 20 s, 42° C. for 20 s, and 72° C. for 20 s. Each sample was loaded as duplicates for technical controls.
Real-time amplification using the beacon was carried out and the results are summarized in Table 3. A minimum of 10 ng of DNA per well was detected, which was the genomic equivalent of 2×106 Mycobacterium cells. Representative amplification plot for 10 ng and 50 ng DNA per well have been shown in FIG. 8.
TABLE 3Cycle number at which detection was possiblefor various concentrations of DNADNA concentration (ng)Cycle numbera1035 ± 0.045037 ± 0.3 100NDbaNumber of cycles at which the fluorescence generated by the cleavage of the beacon hairpin due to amplification by the primer set was detectable above the background.bNot detected
Additionally, RNA was extracted and cDNA was synthesized from various bacterial samples including MRSA, E. coli, Salmonella, Mycobacterium smegmatis, Pseudomonas PAO1 and Bacillus. Briefly, the bacterial cells were lysed using TRIzol reagent (Invitrogen). RNA samples were treated with RNase-free DNase I (Promega), followed by purification using the RNeasy Mini Kit (Qiagen). The concentration of RNA was estimated using a NanoDrop ND-1000 spectrophotometer (version 3.1.0; Thermo Fisher Scientific). Reverse-transcription reactions on total RNA were performed using the First Strand cDNA Synthesis Kit (Invitrogen) with random decamers.
Real-time PCR was carried out using the synthesized cDNA and the designed Beacon. No signal was observed with cDNA corresponding to the various bacteria (not shown), suggesting that the designed probes as expected were specific for the mycobacterial complex.
To further improve the threshold for detection (e.g., to facilitate reliable and specific detection of lower amounts of TB-complex bacteria in a sample), bacterial genomic DNA yields can be enhanced through achieving enhanced bacterial cell lysis. Furthermore, an improved detection threshold can be achieved through enhanced DNA isolation and purification techniques. This is a useful improvement and consideration the observation that DNA concentrations higher than 50 ng did not give provide signal (not shown). This result implied that there was a considerable amount of impurity in the extracted DNA sample and at higher concentrations these impurities inhibited the real-time PCR assay.

Beta lactamase as biomarker for the specific detection of tuberculosis-complex bacteria


A dosage inhaler includes an active liquid container, which contains a liquid having an active ingredient dissolved therein, and an atomizer by which the liquid is transformed into an aerosol and can be introduced into an aerosol dome, in which there is a baffle plate and to which an inlet tube and an outlet tube are attached, and an electronic control. The atomizer can be intermittently operated by a user and the user command readout is visible to the user. The generation of the amount of aerosol inside, and below, the aerosol dome is able to be separated in time from its eventual inhalation by the user.

1. Technical Field of the Invention
The invention relates to a dosing inhaler, consisting of an active liquid container, which contains a liquid having an active substance dissolved therein, and an atomizer, by means of which the liquid can be transformed into an aerosol and introduced into an aerosol dome, in which a baffle plate is arranged, and to which a supply-air tube and an exhaust-air tube are connected, and an electronic control.
2. Description of the Prior Art
The inhalation of active substances that are dissolved in water and inhaled as a fine mist has long been well known as a method of administering active substances, particularly in the medical field. The finer the droplets, the greater is the proportion that is transported deep into the lung with the respiratory air. In the prior art, a mist is generated by means of an ultrasonic oscillator. It is either arranged on the base of the vessel with the active liquid, and generates on the surface of said liquid a spray that isolates a mist so fine that it behaves as smoke and can therefore be easily entrained with the air stream. It is necessary that, to separate out aerosol droplets larger than about 10 microns, the air stream must be diverted at least twice. To this end, a baffle plate is arranged above the ultrasonic spray. A downwardly open, hollow truncated cone has been found most effective. The droplets rise into this truncated cone and are set into turbulence in the centre of the cone, the larger drops being removed from the mist and falling backing into the active liquid container. Only the very finest drops are entrained with the air stream and transported around the edge of the baffle either via a narrow slit or through calibrated openings into the exhaust air channel. At this point, further undesirably large droplets are separated out.
Particularly efficient is the principle of active substance transport into the lung by means of an aerosol, as a result of the very small droplets that are possible with ultrasonic atomizers. It can be proven that droplets below a minimum size are completely absorbed into the lung sacs and transferred to the blood.
However, a severe weakness is the exact dosage of the active substance. Though it is also a principal advantage of inhalation that, in comparison to all other methods of administration of drugs, very small amounts, in absolute terms, are required, it is primarily only a psychological problem that, of the active liquid, a residue of the order of single-digit percentages remains in the active substance container. If the amount falls below this minimum quantity, the ultrasonic oscillation no longer generates a spray and also does not form water droplets any longer.
However, this minimum amount can be calculated in advance with good accuracy and therefore only the dosage to be administered can be added.
With the exact dosage of the active substance amount actually absorbed by the patient, according to the prior art, the most serious problem is the patient's respiratory behaviour, which can be neither monitored nor controlled with the equipment known in the prior art. Unlike oral administration—in which an unwilling and/or debilitated and/or unconcentrated patient either takes the medication dose completely, or doesn't take it at all, however it is only in a practically negligible number of cases that he accidentally takes a partial dose—with the inhalers of the prior art, it is very often the case that only a part of the active substance dose transformed into the aerosol is actually taken by the patient. The rest is either transformed from the aerosol state back into a liquid, or, because of insufficient air velocity, is deposited in the tube systems of the inhaler or only passes as far as the patient's mouth/throat area. In simple devices without supply air and respiratory valve, it can also occur that the patient does not inhale the aerosol, but also blows it out of the device into the environment.


A nonaqueous electrolyte secondary battery is provided. The nonaqueous electrolyte secondary battery includes a cathode; an anode containing at least an anode active material and a conductive agent; and a nonaqueous electrolyte, wherein the anode has an anode mixture, the anode mixture containing 1.5 wt % or more to 10 wt % or less aluminum oxide which has an average particle diameter of 0.1 μm or more to 5.0 μm or less.

The present application relates to nonaqueous electrolyte secondary batteries, and in particular, to a lithium ion secondary battery using a lithium complex oxide as an electrode material.
In recent years, with the remarkable progress of mobile electronics technology, mobile electronics devices such as cellular phones and notebook PCs are increasingly recognized as fundamental technologies supporting the advanced information-oriented society. Further, research and development aimed at sophistication of these devices are being vigorously made, simultaneously electric power consumption of electron devices is growing steadily. On the other hand, these electronics devices should work for long hours, consequently secondary batteries for driving these devices are desired to have higher energy density.
The energy density of a battery is preferably higher from the viewpoints of occupying volume and weight of the battery in electronics devices. For satisfying the demand, at present, nonaqueous electrolyte secondary batteries, in particular, lithium ion secondary batteries utilizing doping/dedoping of lithium ions are included in most devices due to their excellent energy density.
In common cases, a lithium ion secondary battery has, for example, a cathode including a cathode collector having formed thereon a cathode active material layer using a lithium complex oxide such as lithium cobaltate, and, for example, an anode including an anode collector having formed thereon an anode active material layer using a carbon material, and is used at an operating voltage of 2.5 V to 4.20 V. The terminal voltage of a single cell can be increased up to 4.20 V largely owing to the excellent electrochemical stability of the nonaqueous electrolyte material, separator, and others.
However, in a lithium ion secondary battery as described above which operates at a maximum voltage of 4.20 V, the entire theoretical capacity of the cathode active material contained therein such as lithium cobaltate is not thoroughly utilized for discharging and charging, and only about 60% of the capacity is utilized. Therefore, for further improving the battery characteristic of a secondary battery, a lithium ion secondary battery described in International Publication No. WO 03/019713 has an increased charge cutoff voltage of 4.25 V or higher.
It is known that the above-described battery has a charged voltage of 4.25 V or higher, which increases the amount of doped/dedoped lithium between the layers of a carbon material to impart a larger capacity and higher energy density to the lithium ion secondary battery.
On the other hand, a higher energy density tends to raise the peak temperature inside the battery in case of abnormal heat generation. When a short circuit current is passed through a battery because of misuse or destructive test, Joule heat is generated. The amount of such heat is further growing in the development for increasing the energy density of the past.
Heretofore, large-capacity lithium ion secondary batteries have been improved in their characteristics and reliability by adding aluminum or the like to the battery system.
For example, a battery described in Japanese Patent No. 3552361 prevents the influences of internal short-circuit in a large-capacity lithium ion secondary battery from extending to between adjacent cathode and anode, and prevents direct short-circuit of the cathode and anode.
In Japanese Patent No. 3552361, an interface where the cathode is not opposed to the anode is provided, and a heat resistant layer is provided on the interface by spraying powder of a metal oxide such as aluminum oxide (Al2O3) by, for example, plasma spraying. The heat resistant layer prevents the influences of internal short-circuit from extending to between the adjacent cathode and anode. In addition, even when fusion or decomposition of the separator is caused by heat, the layer secures electrical insulation between the cathode and anode, and prevents direct short-circuit of the cathode and anode.
However, the layer of an anode active material during charging may cause exothermic reaction when subjected to heat generated by abnormal use or misuse, or other electric heat generated in the battery system. Therefore, the heat resistant layer provided on the interface between the cathode and anode contributes to stabilize the inside of the battery, but does not decrease the temperature in the battery in case of abnormal heat generation.
Besides, the addition of aluminum oxide or other substances devoid of active material capacity to a battery system causes the decrease in the volume efficiency, and the increase in resistance and thus deteriorates the load characteristic, which makes it difficult to strike a balance between battery characteristic and reliability.

Nonaqueous electrolyte secondary battery