A spray powder-coating apparatus fitted with an electronic control system (21) regulating the air flows (20, 43) to an injector (4) as a function of setpoints (m) for the rates of powder to be moved, and as a function of a setpoint (GV) for the total rate of air passing through the nozzle, by means of motor-driven adjustable throttles (18, 19, 44, 45), preferably also as a function of the actual values (89, 90) of the regulated air flows (20, 43).

The invention relates to spray powder-coating apparatus defined in the preamble of claim 1.
Such a spray powder-coating apparatus is known from the European patent document 0 686 430 A.
The European patent document 0 636 420 discloses spray powder-coating apparatus fitted with an electronic regulating system generating setpoint signals for the required rate of powder, i.e. the quantity of powder per unit time, as a function of a setpoint value, and for the rate of total air to be conveyed, i.e. the quantity of total air per unit time, which is required to move the powder, said setpoints being applied to pressure regulators which then correspondingly regulate the feed of conveyance air and of supplemental air to an injector. The setpoint signals from the regulation system are construed as setpoint values by the regulators and are utilized in relation to the actual values of the conveyance air or of the supplemental air to regulate said conveyance or supplemental air. Volumetric regulators may also be used instead of the pressure regulators.
A pneumatic powder conveyance system is known from U.S. Pat. No. 4,747,731 (corresponding to the European patent documents 0 239 331 A and 0 423 850 A), which comprises 2 injectors of which the main injector is mounted at the downstream end and an auxiliary injector is mounted at the upstream end of a powder aspirating tube.
It is known from U.S. Pat. No. 5,186,388 to measure the partial vacuum in the partial-vacuum zone of an injector and to use this measurement as being the powder rate. It is known from U.S. Pat. No. 4,544,306 to use a measuring tube having one end open to the atmosphere and another open end opening into a powder/air duct to measure the pressure therein. Depending on the pressure relative to atmospheric generated by the powder/air flow, a valve shall be opened or closed at the powder feeding outlet situated at the lower funnel-shaped end of a powder supply cart.
Air dividers are known from U.S. Pat. No. 3,625,404 and from German patent document 44 09 493 A which contain a throttling valve in a conveyance air line and a throttling valve in a supplemental air line, said valves being mechanically coupled to each other. To the extent one of said valves shall close the other one shall open.
The objective of the present invention is to create accurate and stable regulation of the pneumatically conveyed flow of powder as a function of a manually or automatically preset setpoint value for the rate of applied powder, without thereby requiring expensive pressure regulators or volumetric controls.
This problem is solved by the invention by means of the features of claim 1.
The invention offers economical apparatus of simple design which enables automated and accurate regulation of a powder/air flow and allowing stable air flow of powder/air, free of pulsations, from start to shutdown.
The concepts of values such as xe2x80x9creference value, actual value, and/or setpoint value . . .xe2x80x9d used in the present disclosure shall denote, depending on the desired design of the apparatus, the value at a point or of a range of values. However even as regards a value at a point, the tolerance-entailed fluctuations in value still shall be within the scope of the invention.


A fuel cell including an anode-side catalyst coated membrane and a cathode-side catalyst coated membrane. At least a portion of a reduced-permeability layer is disposed between the ionically conductive membrane and the anode-side and cathode-side gas diffusion media, wherein the reduced-permeability layer is formed of a material that has a permeability that is less than a permeability of the ionically conductive member. The reduced-permeability layer may also be formed of a material that is softer than the ionically conductive membrane.

Fuel cells are being developed as a power source for electric vehicles and other applications. Fuel cells are known to include a variety of components including a proton exchange membrane, an anode, a cathode and gas distribution elements.
Fuel cells typically include a proton exchange or polymer electrolyte membrane (PEM) sandwiched between a cathode catalyst layer and an anode layer to form a membrane electrode assembly (MEA). Gas diffusion media (GDM) engage each of the cathode catalyst layer and the anode catalyst layer. The catalyst layers may be coated on the GDM, and such a structure is known as catalyst-coated diffusion media (CC-DM). Alternatively, the catalyst may be coated on the PEM, and such a structure is known as catalyst-coated membrane (CCM).
Heretofore, edge-protection using subgaskets have been applied in both CC-DM and CCM fuel cells. FIG. 1 illustrates a prior art CC-DM 30 which includes a first GDM 17 having an anode catalyst layer 14 coated thereon. A second GDM 18 having a cathode catalyst layer 16 coated thereon is also provided. A proton exchange membrane 12 is provided and a first subgasket 20 is positioned to cover a portion of the upper surface of the membrane 12 along the periphery thereof. A second subgasket 22 is positioned to cover a portion of the lower surface of the membrane 12 along the periphery thereof. The proton exchange membrane 12, first subgasket 20 and second subgasket are interposed between the anode CC-DM and cathode CC-DM.
FIG. 2 illustrates a prior art CCM 10 which include a proton exchange membrane 12 having a anode catalyst layer 14 coated on an upper surface of the membrane 12, and a cathode catalyst layer 16 coated on a lower surface of the membrane 12. A first subgasket 20 is positioned to cover a portion of the membrane 12 and a portion of the anode catalyst layer 14 along the peripheral edge of each. In a like manner, a second subgasket 22 is positioned to cover a portion of the membrane 12 and a portion of the cathode catalyst layer 16 along the peripheral edge of each. A tenting region, 24, may be formed and is defined by a small void between the GDM 17 or 18 and the anode 14 or cathode 16, respectively.
Durability testing, graphically illustrated in FIG. 3, has shown that prior-art CCMs, as depicted in FIG. 2 are considerably less durable than CC-DMs. CC-DMs routinely outlast CCMs in harsh conditions such as 95° C., 300 kPa (abs) and 75/50% Relative Humidity. As shown in FIG. 3, the beneficial effect of edge-protection in prior art CCMs is relatively minor (125 hours for edge-protected vs. 100 for un-protected). However, in the case of prior art CC-DMs there is a 3-fold increase in the lifetime of the MEAs from 300 to 900 hours for unprotected versus protected CC-DMs.
The present invention provides alternatives to the prior art.

Edge-protected catalyst-coated membrane electrode assemblies


A method of integrating clinical trial data into a form required by a standards based data format. Annotations may be made to a case report form (CRF) designed for a clinical trial that map report form data to standards compliant data. The annotations may be stored in, and then applied to data captured using that particular case report form to produce standards compliant data for that particular clinical trial. The data sets produced may then be validated as being standards compliant.

In the US, and most other industrial countries, pharmaceuticals are strictly regulated by government agencies such as the US Food and Drug Administration (FDA). Part of this regulation requires that pharmaceutical and medical companies conduct extensive clinical research in order to demonstrate the safety and efficacy of new drugs and devices before they can be approved for commercial use.
These clinical trials are typically costly and time consuming and usually involve significant amounts of data. In order to speed up, and reduce the cost of, clinical trials and their evaluation, the FDA is attempting to implement standardization of the data that is electronically submitted to them as regulatory submissions for evaluation.
In particular, they are attempting to standardize on the Clinical Data Interchange Standards Consortium (CDISC)'s Study Data Tabulation Model (SDTM).
A problem facing the pharmaceutical and medical industry is that currently clinical, non-clinical, lab and healthcare data exists in multiple physical formats, with datasets typically having heterogeneous syntax and semantics. The data may also be located across multiple geographical locations and organizations, and may exist at different stage of the clinical research life cycle. All of these factors make it difficult to assemble and aggregate such data for regulatory submissions.

Method for optimizing clinical data standardization


Disclosed is a biodegradable composition characterized by compounding yeast (A) and biodegradable plastic (B) at a particular proportion. The purpose is to provide a biodegradable composition having very good biodegradability and additional fertilizer effect, making good use of the characteristics of yeast.

The present invention relates to a composition useful as a biodegradable material.
In recent years, an interest in xe2x80x9cbiodegradable plasticxe2x80x9d is very high. The biodegradable plastic referred to so in the invention means xe2x80x9ca plastic that can be used similarly to ordinary plastics during use, becomes low-molecular compounds through the participation of microbes or moisture in the natural world after use, and finally decomposes into water and carbon dioxidexe2x80x9d, and is expected particularly to be applied in the fields of agriculture and forestry. For example, when applying to multifilm, if the film is unnecessary to be collected after harvest and it can be degraded only by plowing back, the labor saving will be possible. However, traditional biodegradable plastics have such problems that the biodegradation rate is not necessarily enough, and the like.
With respect to the biodegradable material capable of converting to film, moldings, etc., the purpose of the invention is to provide a biodegradable composition that allows drastic labor saving particularly in the fields of agriculture and forestry, because of easy biodegradation and additional fertilizer effect etc. as well, and a method of producing the same.
As a result of diligent investigations, the inventors have found that a composition obtainable by formulating yeast and biodegradable plastic at a particular proportion can solve the subject as described above, leading to the completion of the invention.
The invention relates to a biodegradable composition comprising yeast (A) and biodegradable plastic (B) at a particular proportion. The purpose is to provide a biodegradable composition having very good biodegradability and additional fertilizer effect, making good use of the characteristics of yeast.
The yeast (A) to be used in the invention is not particularly restricted, and baker""s yeast, alcohol yeast, sake yeast, further brewer""s yeast produced in large quantities, and the like can be used.
As the examples of such yeasts, Saccharomyces cerevisiae (IFO 1954, IFO 0309, IAM 4274), Candida utilis (IFO 0619, ATCC 15239), Torulopsis nodaensis (IFO 1942), Torulopsis stellata (IFO 1953), Hansenula anomala (IFO 1150), etc. are mentioned.
Moreover, yeasts after treatment of extraction etc. such as yeast after extracted nucleic acid (denucleated yeast) are also useful.
The yeast can be used as a lump of yeast, but it is preferable for yeast to be in the shape of passing through a screen with mesh opening of 53 xcexcm by pulverization etc. In the case of yeast in the shape of not passing through a screen with mesh opening of 53 xcexcm, the flexibility of film becomes poor when converting to film. More preferable is a yeast in the shape of passing through a screen with mesh opening of 38 xcexcm.
The yeast contains nitrogen, phosphoric acid and potassium being three big components of fertilizer in abundance and is an organic fertilizer with very high composting effect. Moreover, amino acid In the yeast is taken into the plant body and has also an action of increasing flavor.
Furthermore, the cell wall of yeast consisting of polysaccharides such as glucan and mannan is subject to decomposition in the soil, and the decomposed products are conducive to useful microbes in soil as sugar sources to take part in the propagation thereof, thus bringing about a thickening effect on fruits.
For the biodegradable plastic (B) to be used in the invention, the thermoplastic biodegradable resins known currently as biodegradable plastics are usable, and, for example, resins produced by microbes such as polyhydroxybutyrate, chemically synthesized resins such as polycaprolactone, poly(butylene succinate), poly(butylene succinatexc2x7adipate), poly(ethylene succinate), poly(glycolic acid), poly(lactic acid) and poly(vinyl alcohol), and further resins obtained by modifying natural products such as cellulose acetate and thermally plasticized starch are usable. In particular, biodegradable polyester is preferable from the aspect of physical properties. As the biodegradable polyesters, polycaprolactone, poly(butylene succinate), poly(butylene succinatexc2x7adipate), poly(ethylene succinate), poly(glycolic acid), poly(lactic acid), etc. as described above are mentioned. These can be used also by combining two or more kinds.
It is required that the formulating proportion of yeast (A) to biodegradable plastic (B) is within a range of following general formula 1. Besides, in the invention, these indicate dry weights.
A: 90xcx9c10 parts by weight B: 10xcx9c90 parts by weight
A+B=100 parts by weightxe2x80x83xe2x80x83General formula 1
If the proportion of yeast (A) exceeds 90 parts by weight, then the flexibility cannot be obtained at all when converting to moldings, and, in particular, when converting to film etc., the use becomes difficult. Also, if the proportion of yeast (A) is under 10 parts by weight, then the promotion of biodegradation rate becomes insufficient. More preferable is a range of general formula 2.
A: 50xcx9c10 parts by weight B: 50xcx9c90 parts by weight
A+B=100 parts by weightxe2x80x83xe2x80x83General formula 2
The inventive composition allows to adjust the biodegradation rate depending on the uses. For example, when the biodegradation rate is too fast depending on the use, it is possible to make the biodegradation rate slower, by additionally formulating lignin with low hydrophilicity, than that before formulation. The formulation level of lignin is preferable to be within a range of not exceeding 40 parts by weight based on 100 parts by weight of yeast used. If exceeding 40 parts by weight, then the inhibitory effect of the biodegradation becomes significant. Moreover, since lignin is used for the purpose of inhibiting the biodegradation, lignin with lower hydrophilicity is advantageous. Lignin with higher hydrophilicity will be dissolved out with rainwater to inversely promote the biodegradation of moldings. Concretely, the content of organic sulfur in lignin is preferable to be 3% by weight or less. The content of organic sulfur indicates the extent of hydrophilicity of lignin and becomes an index of solubility into water.
The inventive composition can be used in combination with natural high-molecular polysaccharides and their derivatives produced industrially in large quantities such as cellulose, starch and chitin-chitosan, within a range of not deviating from the gist of the invention. As the celluloses, wood pulp fibers manufactured through sulfite process and kraft process, regenerated cellulose, cotton, raw cotton, etc. can be mentioned and wood pulp fibers produced in large quantities are preferable. Moreover, mechanical pulp, wood flour, bamboo flour, etc. containing relatively more lignin are also usable. Furthermore, in the invention, plasticizer, blowing agent, dye and pigment, agricultural chemicals, etc. used commonly can also be added, if need be, for use. Fertilizer component may be added additionally. The addition levels thereof are determined appropriately depending on the purposes, but it is preferable to be within a range of not exceeding 80 parts by weight based on 100 parts by weight of the inventive biodegradable composition.
The inventive biodegradable composition is ordinarily converted to moldings, after yeast and biodegradable plastic are formulated at a fixed proportion and kneaded. The kneading equipment and molding equipment used are not particularly restricted and equipments known hitherto can be used.
For example, as the kneading equipments, roll mill, intensive mixer, single-screw extruder, double-screw extruder, etc. are mentioned. It is required to set the kneading temperature over the melting point of biodegradable plastic for melting and kneading, but it can be altered appropriately depending on the characteristics of raw material, formulation ratio, kneading situation, etc.
Moreover, if the yeast and biodegradable plastic are molten and kneaded in the presence of 3 to 20% by weight of moisture based on yeast, then the mixing is performed more homogeneously, which is preferable. To say further, the moisture is preferable to be 5 to 18% by weight. The moisture is supplied to the mixing system from that contained in yeast beforehand, but it can be supplied from outside upon kneading as well. When the moisture exists, the yeast exhibits a plasticizing effect. If the moisture is under 3% by weight, then the homogenization between yeast and biodegradable resin becomes insufficient and, if over 20% by weight, the physical properties decrease when converted to film etc. Besides, the quantity of moisture means % by weight based on the dry weight of yeast.
When the moisture exists as described above, it is preferable to use biodegradable plastic with melting point of not higher than 120xc2x0 C. as the biodegradable plastic (B). As the biodegradable plastics with melting point of not higher than 120xc2x0 C., for example, polycaprolactone, poly(butylene succinate), poly(butylene succinate adipate), poly(ethylene succinate), etc. are mentioned. Besides, the melting point in the invention can be measured using differential scanning calorimeter, according to JIS K7121.
Moreover, as the methods for molding, for example, casting process (solution casting process), extrusion process (melt extrusion process) using T die or inflation die, calender process, biaxial drawing process, etc. are mentioned. Furthermore, surface oxidation, laminating, coating, vacuum metallizing, antistatic treatment, foaming treatment, etc. are also possible.
Besides, when the inventive biodegradable resin composition is molded into film etc., if the moisture exists in large quantities, the film will be foamed, hence it is preferable to keep the excess moisture removed. In this case, it is possible to cope appropriately by means of suction dewatering during kneading with extruder etc., and the like.
The processed composition can be used, for example, for the agricultural materials such as multifilm for agriculture, seedling pot, sandbag and vegetation mat, and for the uses known hitherto such as compost bag, loose buffer, draining bag, thermal insulator, water retentive sheet and tape.
In following, the invention will be illustrated more concretely based on examples, but the invention is not confined to that range. Besides, part and % in the examples indicate part by weight and % by weight, respectively, so long as there is no notice particularly.
Test Items and Testing Methods
(1) Test of Biodegradability
Specimens were laid under ground and collected after 3 weeks and 6 weeks to judge the state visually.
◯: Specimen retaining no traces of original shape,
xcex94: Specimen with broken places recognized,
X: Specimen with little change recognized.
Testing site: Testing field of Research Laboratory of Chemicals Development, Nippon Paper Industries Co., Ltd. Iida-machi, Iwakuni-shi, Yamaguchi-ken
(2) Tensile Stretch at Breaking Point of Film
The tensile stretch (%) at breaking point of specimen was measured under following conditions.
When film was broken immediately without stretch after start of test, the tensile stretch at breaking point was put at 100%.
Tester: Tensile tester (Tensilon, from Toyo Seiki)
Speed: 100 mm/min
Load cell: 100 kg
Span: 30 mm
Temperature: 23xc2x0 C.
Humidity: 50%

Biodegradable composition and method of producing the same


For flow measurement a device with a compact housing and a fixable hinged cover has a measuring channel for inserting a flexible tube such that it becomes deformed in a defined way. The measuring channel extends over the entire width of the housing. A measuring cell arranged in the center of the measuring channel has                four ceramics I, II, III, IV, integrated in a sound-decoupled way and facing each other diagonally in pairs, which are placed in lateral parts on the left and on the right of the measuring cell, and a base plate limiting the measuring cell downwards in the direction of an installation space for an electric evaluation system, wherein the base plate also limits the remaining area of the measuring channel from below.

Prior art may be exemplified by products of the companies em-tec GmbH, D-86923 Finning or Transonic Systems Inc., New York 14850, USA.
Thus, the company em-tec GmbH offers a clamp-on transducer for measuring a flow in extracorporeal tubing systems, as available for checking on the website http://www.em-tec.de of said company. The sensor placed in a housing is clamped on a tube by a click closure, and the measurement is thus taken non-invasively. Applications can be found in medicine, e. g. in measurements which have to be taken at a heart-lung machine in intensive care medicine.
A similar transducer is mentioned as a bypass flowmeter and tubing sensor by the company Transonic Systems Inc., as described in HT100 Bypass Flowmeter & Tubing Sensor, "Surgery/ICU Products" on the website http://www.transonic.com.
This solution also uses a clamp-on tubing sensor, which may be sterilized and attached to flexible tubes in operating theatres. Here, a section of a flexible tube is located in a measuring channel, without applying external mechanical pressure, wherein the ultrasonic signals are coupled in the direction of the liquid flow or against it.
The previously known solutions of the prior art, as exemplified above, make use of an arrangement of clamp-on sensors in which transmitter/receiver transducer and the electronic evaluation system are physically separated, which may cause crosstalk of the signals on the connection line between them. A measurement on smaller tube sizes has not been offered so far.
The disadvantages of the examples of the prior art, as mentioned above, must therefore be overcome.
Therefore, the object of the invention is to propose a device for the contactless flow measurement of fluids for applications in medicine, industry and others, in which the sound emitting and receiving ceramics (piezoelectric elements) are integrated in such way that they are decoupled from the other components, to the end that the signals of the ceramics do not interfere with each other, fewer transverse vibrations or directional effects are caused by using composite ceramics with an optimized width/thickness ratio, and a comparatively simple electronic evaluation system—without using an A/D transducer—is provided for the device as well as the measuring space in the housing of the device should embodied as a measuring channel in such way that, by exchanging few components in the sense of a modular concept, the insertion of a flexible tube within a defined range of usable diameters into the preferably rectangular measuring channel is made in such way that the surface for coupling sound signals into the fluid flowing in a flexible tube is as large as possible, wherein the assessment of received measurement signals should bring a high level of significance—even in consideration of a varying temperature and therefore a different viscosity of the fluid flowing through the flexible tube.
The object of the invention is achieved as follows, referring to patent claim 1 with regard to the basic inventive concept. Further embodiments of the invention are shown in claims 2 through 8.
The device is basically designed as a sensor for measuring the flow rate of a sound-transparent medium in a flexible tube of a low diameter, preferably within an outside diameter range of at least 3.5 mm, in a so-called clamp-on design.
It consists of a compact, in particular plastic housing with a hinged cover made of the same material, attached to its top side, which is fixed by means of a spring-loaded rest hook in the closed state of the housing. On the outside of the housing, opposite the closure of the hinged cover, there is a service interface for the connection to peripheral imaging systems or for voltage supply, as the case may be.
When the hinged cover is opened, a rectangular measuring channel, open to the outside, which extends over the entire width of this surface, becomes visible in the upper area of the housing. Its dimensioning is made in such way that a flexible tube of a defined diameter may be inserted by slight mechanical pressure, through which the wall of the flexible tube fits to the walls of the measuring channel and the underside of the hinged cover covering the measuring channel from above in a rectangular shape when the hinged cover is closed. In the centre of the measuring channel, in the upper housing area limiting the compact housing to the top, there is a measuring cell with ceramics (piezoelectric elements) facing each other diagonally in pairs, which are held in lateral parts, which measuring cell is limited from below by a base plate in the installation space of the compact housing. The base plate in its consistency also forms a bottom limiting the measuring channel overall.
Furthermore, a feature of the invention can bee seen in that the housing of the device has distances at least twice as long in relation the width of the measuring channel for a tube inlet and for a tube outlet for inserting the flexible tube. In this way, a tube inlet or outlet of a defined length, as a section of the measuring channel, contributes to calming the fluid flowing through the flexible tube, which improves measuring stability.
In order that a measuring result of received signals always gives a real picture of the flow volume of a sound-transparent fluid, also the temperature of the latter must be considered because temperature-related changes in viscosity can accelerate or slow down the flow. Therefore, a temperature sensor, the measuring values of which are used as a coefficient for determining the flow volume by way of calculation, is attached to one side of the measuring cell.
An outstanding feature of the invention is that the measuring channel may be enlarged in its cross-section—without changing its width—, starting from a square up to a standing rectangle, by the modular exchange of the base plate, which limits the measuring channel and the measuring cell on the bottom side, which allows to detect flexible tubes with a low outside diameter, from at least 3.5 mm and beyond, within defined limits.
Therein, the dimensions of the measuring cell, consisting in particular of the ceramics integrated into the lateral parts at a defined distance, remain unchanged to the extent technically reasonable. The ceramics are in particular designed as composite ceramics, and the individual elements of the measuring cell are not connected to each other in a compact casting. A joint casting with the electronic evaluation system, which is located below the measuring cell in the installation space for electronic modules, is not present either. Such decoupled design of the device, which may also be regarded as a miniaturisation in this order, avoids negative influences on the sending and receiving of measuring signals by crosstalk of the ceramics.
In addition, for improving the measuring quality, it is provided that the compact housing of the device together with the hinged cover is made of a material which provides shielding against electromagnetic waves from the environment. An appropriate plastic material is suitable for this.
Below the measuring cell there is an installation space for electronic components in the housing of the device.
It comprises:                a) a multiplexer for a transmitted signal,        b) a multiplexer for a received signal,        c) an adjustable amplifier for received signals in connection with a zero-crossing comparator,        d) a time to digital converter (TDC), which is configured and controlled by a microcontroller (MC),        e) a transmitter,        f) a microcontroller (MC) as central control unit,        g) an output circuit,        h) a service interface, and        i) an operating voltage supply.

Device for the contactless flow measurement of fluids in flexible tubes


A method for fabricating a field emission structure is disclosed. A first dielectric layer and a second material layer are disposed over a substrate and at least one emitter tip thereon. Planarization of the second layer exposes regions of the first layer that cover the emitter tip, which regions may then be removed through the second layer. Substantially removal of the second layer reduces any conductive defects that protrude from a surface of the first layer. A third, dielectric layer and fourth, grid layer are then formed. Planarization of the fourth layer forms grid openings and exposes dielectric material of the third layer which overlies the emitter tip. Dielectric material of one or both underlying layers may then be removed to expose the outer surfaces of the emitter tip.

1. Field of the Invention
The present invention relates to methods of fabricating field emission arrays including planarized grids. Particularly, the present invention relates to field emission array fabrication methods that facilitate optimization of the size of grid openings above each of the emitter tips thereof. The present invention also relates to field emission arrays fabricated in accordance with the method of the present invention.
2. Background of the Related Art
Typically, field emission displays (xe2x80x9cFEDsxe2x80x9d) include an array of pixels, each of which includes one or more substantially conical emitter tips. The array of pixels of a field emission display is typically referred to as a field emission array. Each of the emitter tips is electrically connected to a negative voltage source by means of a cathode conductor line, which is also typically referred to as a column line.
Another set of electrically conductive lines, which are typically referred to as row lines or as gate lines, extends over the pixels of the field emission array. Row lines typically extend across a field emission display substantially perpendicularly to the direction in which the column lines extend. Accordingly, the paths of a row line and of a column line typically cross proximate (e.g., above and below, respectively) the location of an emitter tip. The row lines of a field emission array are electrically connected to a relatively positive voltage source. Thus, as a voltage is applied across the column line and the row line, electrons are emitted by the emitter tips and accelerated through an opening in the row line.
As electrons are emitted by emitter tips and accelerate past the row line that extends over the pixel, the electrons are directed toward a corresponding pixel of a relatively positively charged electro-luminescent panel of the field emission display, which is spaced apart from and substantially parallel to the field emission array. As electrons impact a pixel of the electro-luminescent panel, the pixel is illuminated. The degree to which the pixel is illuminated depends upon the number of electrons that impact the pixel.
An exemplary method of fabricating field emission arrays is taught in U.S. Pat. No. 5,372,973 (hereinafter xe2x80x9cthe ""973 patentxe2x80x9d), issued to Trung T. Doan et al. on Dec. 13, 1994. The field emission array fabrication method of the ""973 patent includes an electrically conductive grid, or gate, disposed over the surface thereof and including apertures substantially above each of the emitter tips of the field emission array. While the electrically conductive grid of the field emission array disclosed in the ""973 patent is fabricated from an electrically conductive material such as chromium, field emission arrays that include grids of semiconductive material, such as silicon, are also known. Known processes, including chemical mechanical planarization (xe2x80x9cCMPxe2x80x9d) and a subsequent mask and etch, are employed to provide a substantially planar grid surface and to define grid openings or apertures therethrough, which are positioned above each of the emitter tips.
The process of the ""973 patent is, however, somewhat undesirable in that upon optimization of either the thickness of the dielectric layer or the diameters of the grid openings, the other may not be optimized. Moreover, as the process of the ""973 patent employs layers of dielectric material that are subsequently covered by a grid material without any intervening process steps (e.g., planarization of any imperfections and disposal of another layer of dielectric material thereover), electrically conductive imperfections that may extend through the dielectric material from the substrate to the grid are typically not removed by intervening process steps.
Accordingly, there is a need for a field emission array fabrication process that facilitates optimization of both the diameter of grid openings and the thickness of the dielectric layer thereof. There is also a need for a field emission array fabrication process that reduces the incidence of electrically conductive imperfections that extend from the substrate to the grid and that, thereby, reduces the likelihood of electrical shorts during use of the field emission array.
The present invention includes a method of fabricating field emission arrays that include planarized grids. The field emission array fabrication method of the present invention employs two dielectric layer disposition processes and two planarization processes on the dielectric layers to facilitate optimization of the size of the grid openings above each of the emitter tips thereof.
According to the present invention, the column lines, emitter tips, and their associated electrical componentry may be fabricated by known processes. A layer of dielectric material, which is also referred to herein as a first layer or as a first dielectric layer, is then disposed over the substrate and the emitter tips. The thickness of the layer of dielectric material is preferably less than the height of the emitter tips. Known processes, such as chemical vapor deposition techniques or oxide growth processes, may be employed to dispose the layer of dielectric material over the substrate and the emitter tips.
Another layer, which is also referred to herein as a second layer, and which includes a material that is preferably planarizable and that is selectively etchable with respect to the dielectric material of the underlying layer and with respect to the material of the substrate and emitter tips, is disposed over the layer of dielectric material. The planarizable, selectively etchable layer may be disposed over the layer of dielectric material by known processes, such as by physical vapor deposition or chemical vapor deposition.
The second layer may be planarized by known processes, such as by chemical-mechanical planarization or chemical-mechanical polishing (xe2x80x9cCMPxe2x80x9d). Upon planarization of the second layer, portions of the first layer disposed above each of the emitter tips are preferably exposed through the second layer.
Dielectric material of the exposed portions of the first layer may be removed from the top portions of the emitter tips by known processes. For example, the second layer may be employed as an etch mask and the dielectric material of the first layer exposed through the second layer may be etched substantially from at least the top portions of the emitter tips by known processes and with known etchants that will remove the dielectric material with selectivity over the material of the second layer. Alternatively, a mask may be disposed over the field emission array as known in the art, and the dielectric material that is exposed through the second layer may be removed by known etching processes. Preferably, the etchants employed to remove dielectric material from the emitter tips will remove the dielectric material with selectivity over the material of the emitter tips.
The material of the second layer may be removed from above the first layer. As the material of the second layer is removed, electrical imperfections, such as conductive paths (e.g., pieces of metal or holes) through the dielectric material of the first layer, which are also referred to herein as defects, are preferably confined to the first layer.
Another layer of dielectric material, which is also referred to herein as a third layer or as a second dielectric layer, may be disposed over the first layer and over the exposed portions of the emitter tips. The combined thicknesses of the first layer and the third layer are preferably substantially the same as a desired dielectric layer thickness of the field emission array. As the thickness of the third layer, at least in part, determines the size (e.g., diameter) of the grid openings over each of the emitter tips, the thickness of the third layer preferably corresponds to a desired size of the grid openings. Known dielectric material deposition techniques, such as chemical vapor deposition, may be employed to dispose the third layer over the field emission array.
A layer of semiconductive material or conductive material, which is also referred to herein as a fourth layer or as a grid layer, is disposed over the third layer. The material of the fourth layer is preferably a planarizable material.
The fourth layer may be planarized by known processes, such as by chemical-mechanical planarization or by chemical-mechanical polishing techniques, to form the grid of the field emission array. As the fourth layer is planarized and dielectric material of the third layer is exposed therethrough, grid openings are formed through the fourth layer. Planarization may continue until the grid openings are of the desired size (e.g., diameter).
Dielectric material of regions of the third layer that are exposed through the grid openings and of the first layer and the third layer that contact the emitter tips may be removed through the grid openings by known processes, such as by etching. Preferably, the etchants that are employed to remove dielectric material will etch the dielectric material with selectivity over at least the materials of the substrate and of the emitter tips. The etchants may also be selective for the dielectric material over the material of the fourth layer. If the etchants employed selectively etch the dielectric material of the first and third layers with selectivity over the material of the fourth layer, the fourth layer may be employed as an etch mask. Alternatively, a mask may be disposed over the fourth layer, as known in the art, to facilitate the removal of dielectric material from selected regions of the third layer.
Row lines may then be fabricated by known processes over the planarized grid of the field emission array and the field emission array assembled with other field emission display components, such as an electro-luminescent display screen and housing, as known in the art.
Other features and advantages of the present invention will become apparent to those of skill in the art through a consideration of the ensuing description, the accompanying drawings, and the appended claims.

Field emission arrays and method of fabricating same to optimize the size of grid openings and to minimize the occurrence of electrical shorts


A sole, ribbed or slide chair plate for a foot of a railroad rail provided with two spaced flat bearing surfaces between which is a concave surface allowing for non tipping of the rail when in place if the bottom of the rail has a convex surface and a shim fitting on top of the plate having a top surface composed of two spaced flat bearing surfaces between which is a concave surface.

The present invention relates to a modification to foot supports for railroad rails that are used in track systems (rails and switches), this being arranged in the vicinity of rail-securing devices on ties or similar track-holding elements. In this connection, a sole plate or a ribbed plate, respectively, a slide chair plate or the like, or simply a shim can be provided, the sole plate or ribbed plate, slide chair plate or shim this lying on the top of the tie or the like and being secured to the by means of coach bolts or the like.
The railroad rails that are used for track construction are designed as so-called wide bottom flange rails that are of a modified T cross-section, the rail head being of a mushroom-shaped cross-section. Such wide-bottom flange rails are known, for example, by the designations UIC54 or UIC60, respectively, as well as S 49 or S 54 shapes, etc., and have a cross-section that is symmetrical about their vertical axis y--y. The axis of symmetry y--y is perpendicular to the centroidal axis x--x of a wide-bottom flange rail. The centroidal axis x--x is located at a considerable distance (approximately 10 mm) beneath the half total height of the rail cross-section. These wide-bottom flange rails are rolled with the Y-axis horizontal. This method, used to roll the wide-bottom flange rails--which is governed by the configuration of the profile--results of necessity in the fact that their (underside) foot support area undergoes a slightly convex-crowned shaping towards the vertical axis y--y. Because of this, in contrast to a horizontal ideal plane, the rail foot supporting surface has a crown in the area of the vertical axis y--y, and this can amount to 0.2 and 0.4 mm. It is difficult and unusual to eliminate this crown by way of alignment.
Because of this crowning of its foot support surfaces, which is caused by rolling technology, the wide-bottom flange rails that are used in track systems stand in a way that is mechanically unstable on the associated sole plates or on the shims, respectively, e.g., in the case of concrete ties, or on ribbed plates.
This unstable rail position is particularly critical if the supporting surfaces, in the case of ribbed plates on wooden ties, for example, is not flat but rather deformed in a more or less convex shape that is opposite to the crowning of the rail foot supporting surface, for then, for all practical purposes, two oppositely curved surfaces are in contact only on a line that extends along a common apex. Since both the convexity of the rail foot supporting surface as well as that of the supporting surface on the sole plate that faces towards this result in a crown, it is impossible to achieve an exact and stable starting position for bracing the rail feet by means of a rail attachment device. For this reason, when the rail attachment device is tightened, their vertical axis of symmetry y--y can tip either inwards or outwards by an amount that depends on the crowning, and this can lead to a reduction or enlargement of the cross-rail distance (track) in the rail section or in switches.
The crowning that occurs in the rail foot supporting surface and the sole plate leads to a further disadvantage in that--particularly in the case of interior curve or exterior curve switches that are subjected to heavy loads--the edges of the rail foot sink into the inner bearing surface of the outer ribs of the sole plates that are used very rapidly and very deep, as a result of the tilting movements that are caused by the unstable position of the rails. This fact leads not only to an uncontrolled and thus hazardous widening of the track width in the track, but also to the fact that the ribbed plates, and in particular the ribbed sliding chair plates, become unserviceable very quickly and thus have to be replaced, sometimes after they have been installed for only a short time.
A further disadvantage that occurs as a result of convex supporting surfaces is that the rails can move sideways as a result of forces applied by the wheels. The rotation of the rail head that is caused by this changes the geometry of the line of contact between the wheel and the rail. The rolling characteristics of rolling stock can be affected very adversely because of this, particularly at high speeds.
In consideration of the disadvantages described above, which result from the use of railroad rails that are rolled when horizontal and used for track construction, it is the task of the present invention to create a modification for the foot supports for railroad rails with the typical characteristics described in the introduction hereto, and which, using simple means and, for all practical purposes, with no extra cost ensure a stable positioning of railroad rails relative to the other functional elements of track systems and switches, particularly in the vicinity of the rail attachment points on ties or corresponding track-securing elements.

Foot support modification for railroad rails


A multi-conductor flat cable connector having a base carrying insulation stripping contact elements, a cover and a pair of metal latching legs retained on the cover. The base has cover guides at its ends which slidably mate with the ends of the cover and the latching legs latch the cover to the base in an open position to accept the flat cable and a closed position where conductors of the cable are connected by the contact elements. A pair of shearable latch stops, one at each end of the base, are contacted by portions of the latching legs when the connector is in an open position to hold the connector in the open position. The latch stops are sheared by the latching legs as the base and cover are forced together to connect a flat cable between them.

Multi-conductor flat cable connectors have generally included a base carrying insulation stripping contacts and a cover. The cover and base are shipped and stored unassembled and are assembled on a flat cable by the user. The user must thus handle two parts to apply the connector to the cable, which adds to assembly time, and one of the parts may be lost in shipment and storage.
More recently flat cable connectors have been made to be preassembled so that they are shipped and stored with the cover retained on the base. In the preassembled or open position the flat cable can be slid between the cover and the base and the cover and base are then forced together to force the cable into the contacts on the base. Such connectors are disclosed in U.S. Pat. Nos. 4,006,957 and 4,145,103. Plastic latches formed to hold the connector in the open position and the closed position, as disclosed in U.S. Pat. No. 4,006,957, have been subject to breakage. The metal latch clip of U.S. Pat. No. 4,145,103 is an improvement. However, when the connector of that patent is in the open position the cover and clip readily pivot on the base making it difficult to slide the cable between the cover and the base. Moreover, in the connectors of both patents the cover can be pushed into the base with only light pressure. Often, the cover is accidentally pushed onto the base before a cable is inserted between them requiring disassembly of the connector if it is to be used.

Minnesota Mining and Manufacturing Company


A laser module including a first housing which encloses a semiconductor laser device, a support, a fiber sleeve for holding an optical fiber, a lens, and an isolator. The isolator and the fiber sleeve are jointly arranged within a second housing which is an integral holder holding both the isolator and the fiber sleeve.

Semiconductor lasers are used in many different applications, such as in optical fiber communications, where they can be used at the interface between the electronic signal processing circuitry and the optical transmission lines. The semiconductor laser device generates light that is transmitted through the optical fiber. For this purpose, a semiconductor laser package or module includes the semiconductor laser device and a portion of the optical fiber, as well as other optical components, including at least one lens and at least one isolator. These components are held at fixed positions within the module so as to assure that the light generated by the laser device is effectively coupled into the optical fiber at an end of the optical fiber. The process of aligning an optical fiber to a laser device and fixing it in place is sometimes referred to as fiber pigtailing. Currently in the industry, there are two types of form factors for laser packages or modules. One is the coaxial or TO (transistor outline) package and the other is the flat pack. The flat pack form factor package includes arrangements such as butterfly packages, mini-tail packages, mini-dil packages, etc.).
Flat form factor laser modules basically comprise a set of components, including a semiconductor laser device, a lens, and isolator and a fiber sleeve holding an optical fiber. These components can be mounted on some kind of support or optical bench which is housed inside a box-like hermetically sealed housing, and the laser device (such as the laser diode) and its related circuitry, sometimes referred to as a laser block, are electrically connected to one or more pins, which can extend laterally from the housing (such as in the so-called butterfly laser modules).
FIG. 1 shows one possible configuration of some of the above-mentioned elements: a laser block 11 (including a semiconductor laser device 1 such as a laser diode, having a light-emitting surface or end), an optical lens 2 arranged in a lens holder 21, an isolator 3A arranged in an isolator holder 3B, and an optical fiber sleeve 4 (also known in the art as a ferrule, basically made up of a rigid tube) arranged in a sleeve holder 4A, are all arranged on an L-shaped support. The lens 2 is arranged for focusing the light emitted by the laser device onto an end of an optical fiber (not shown in FIG. 1) and the isolator is arranged to prevent light from being reflected back towards the laser device from the optical fiber end and the surrounding parts of the assembly. Suitable lenses, isolators and fiber sleeves (or ferrules) are well known in the art and there is no need to further describe these elements here.
In the semiconductor laser module, the assembly illustrated in FIG. 1 can be placed on a cooling device, such as a thermo-electric cooler (TEC) or Peltier effect element, which can be used to control the temperature of the laser device the permit higher performance and/or operation over a greater power range.

Laser module including jointly arranged isolator and fiber sleeve


A multi-function device for immobilizing a patient for administration of medical treatment and transportation to a medical facility. The device has an inflatable base which supports the patient. Inflatable air channels extend around the periphery of the base and when inflated will converge inwardly and will engage the head and body of the patient to restrain the individual. Additional cross body straps may be provided a well as lift straps for air evacuation. The peripheral air channels have access areas so the patient may be accessed for administration of medical procedures such as an IV attachment of a blood pressure cup. The device is made from a durable fabric material and is rapidly inflated by a self inflation device.

It is customary emergency medical practice to immobilize individuals who have suffered trauma, particularly trauma to the regions of the head, neck and back. Movement of individuals with injuries in these areas can be particularly perilous and, if improperly administered, can result in further injury, paralysis and even death. Typical situations which involve injuries which require attending emergency medical personnel to immobilize the patient are automobile accidents, falls, skiing accidents and combative patients. Generally the individual must be first stabilized and placed in a horizontal position. Conventional practice is to support the individual on a backboard. Such backboards are usually rigid, planar devices fabricated of wood, metal or plastic. The customary use of a backboard involves placing the board next to the injured patient, gently moving the patient onto the backboard and then securing the patient on the backboard, usually with straps, in order to minimize or prevent movement during initial medical treatment and transportation to a medical facility.
Various prior art patents can be found which disclose various modifications of the conventional backboard.
U.S. Pat. No. 3,897,777;U.S. Pat. No. 4,301,791;U.S. Pat. No.4,621,382U.S. Pat. No. 5,311,882;U.S. Pat. No. 5,560,059;U.S. Pat. No.6,053,534U.S. Pat. No. 6,425,399;U.S. Pat. No. 4,067,075;U.S. Pat. No.4,466,145U.S. Pat. No. 5,016,620;U.S. Pat. No. 5,433,741;U.S. Pat. No.5,826,583U.S. Pat. No. 6,138,306
However, it has long been recognized that it would be advantageous to provide an emergency immobilization and restraint device which would provide support and stabilization during initial assessment of the patient's condition and administration of medical procedures, as well as during subsequent evacuation and transportation to a hospital facility. Further, there also exists the need for a device of this type which is quickly deployable, comfortable for the patient, which will securely immobilize the patient and yet accommodate administration of necessary medical procedures.
There also exists a need for a multi-function immobilization device which may be used in a wide variety of emergency situations, including accidents such as vehicle collisions, falls, airplane accidents and sport-related injuries. These situations often involve and require treatment and transportation from snow conditions, water environments and sometimes require air evacuation of the injured.
Accordingly, in recognition of the various deficiencies of prior art devices and the needs set forth above, the present invention provides a versatile immobilization device which can be used in numerous situations and environments where a patient has suffered injury or trauma, which device will facilitate immediate assessment and treatment of the patient and provide immobilization for patient removal and transportation to a hospital location.

Multi-function patient immobilization device


The disclosure provides a safe input browser, an operation method thereof, and a computer system having the safe input browser. Upon receiving a command for activating the safe input browser, the pointed site of a specific website is guided to the safe input browser to be linked thereto, so that only web pages of the specific site liked thereto will be shown. Accordingly, users can logon into their frequently used and visited network services to prevent incidents of data theft. Further, the safe input browser supports keyboard inputs with the security encryption function to prevent data from being hacked and side-recorded. It can be further connected to specific sites by a virtual personal network (VPN) or a private line network to prevent attacks of denial of service (DOS) or distributed denial of service (DDOS), thereby facilitating convenience and safety of network transactions.

1. Field of the Invention
The present disclosure relates to a safe web page linking mechanism, and, more particularly, to a safe input browser which can link to specific sites, an operation method of the safe input browser, and a computer system having the safe input browser.
2. Description of the Prior Art
With the booming of Internet, more and more trades can be carried out via Internet. The Internet trader can use personal electronic equipment to link to relative web pages for shopping, paying fees, transferring, or the likes, so as to reduce the limitation of time and location, to facilitate the entire convenience of transactions.
More particularly, as long as the trade web sites permit, the transaction is available in any time. If a trader has electronic equipment which can access to Internet, then one can do transactions in any place. However, in spite of high convenience of web trading, for trading websites and traders, the most important issue is still about availability of web service and trading security. Under frequently using of Internet, there are more and more illegal activities spread on Internet, such as fraud, data theft, and so on. For example, a trader will input the account, password, ATM or credit card numbers in transaction. If these information are steal, then we might lose our property, wherein these illegal means including stealing the users' account and password by keyboard capturing and web side-recording, or swindling personal sensitive information by a fake or phishing website, are very common, but hard to be prevented. For example, a phishing website is a fake website whose look and address are almost identical to the legitimate one, so the user will be hard to identify the phishing website is a fake one, resulting in theft of personal sensitive information. The linkage of the fake website can be provided by search engine, an email from forger, or other websites. No matter what, the user may be lack of awareness of the authenticity of the verified link, so phishing is really a threat. Pharming is similar to phishing, but the difference between them is that user cannot identify the authenticity of the website according to the address bar. Since the user browses a website with a legitimate address, the website will be redirected to a phishing website because the local or remote DNS or proxy setting is modified by hacker, however. Therefore, it is very difficult for user to prevent such cyber crimes. With regard to web side-recording, that might side-record all of the data during data transmission. It is hard for user to prevent the Internet hacker activities aforesaid, and these activities also slow down the development of the scope of network transactions.
With regard to sensitive information, such as user account and password, security is an important issue. In addition, attacks of denial of service (DOS) or distributed denial of service (DDOS) is also a big problem. According to a foreign investigation, a website being attacked will cost 1 million dollars on average to deal with the attack, some money is paid for hacker's blackmail, and some is paid for flow cleaning company, namely, renting faster Internet equipment and service to fail the DOS from hackers. However, the flow cleaning service is quite expensive.
Therefore, to find a mechanism for reducing Internet fraud and protecting from DOS or DDOS to let Internet trading can be done smoothly and safely is an important issue for a person skilled in the art.

Safe input browser, operation method thereof, and computer system having the safe input browser


A gas supply apparatus, for use in a semiconductor device manufacturing process, provides a showerhead for evenly supplying various kinds of gases to a reaction chamber. The gas supplying apparatus for use in the formation of a thin film of a semiconductor device includes a first porous plate having a plurality of first holes formed throughout its surface, and a central bore formed at its center; and a second porous plate having first projections which are regularly formed throughout its central portion, and second projections which contain depressions continuously formed around the first projections. The gas supplying apparatus evenly distributes gas into the reaction chamber, thereby improving the uniformity of the film thickness to be grown on a substrate.

The present invention relates to an apparatus for use in the manufacture of a semiconductor device, and more particularly, to a gas supplying apparatus for evenly supplying various gases to a reaction chamber.
The different manufacturing processes of a semiconductor device employ an assortment of apparatuses using various gases which are often toxic and/or reactive. Thus, an apparatus for performing such gas treatment processes requires numerous safety devices, especially for guarding against gas leaks. On the other hand, to manufacture reliable devices, the apparatus should precisely control the amount of gas flow, in addition to preventing the leakage of hazardous gases.
In an apparatus as above, the gas is supplied to the reaction chamber from a main gas reservoir via a main gas line and individual gas lines and is used for growing a film. Thus, it is important to keep the gas lines clean and ensure that the gases do not react with one another until being supplied to the reaction chamber, such that the reaction occurs only in the reaction chamber.
Among semiconductor processing apparatuses, a chemical vapor deposition (CVD) apparatus is widely used for growing many kinds of film. The CVD method is used for forming a thin film or an epitaxial layer on a semiconductor substrate by a chemical reaction after decomposing a compound in a vapor state. The CVD process is different from other semiconductor device manufacturing processes in that a thin layer can be formed by introducing a gas to a reaction chamber. Here, an effective CVD reaction occurs over a wide temperature range (about 100.degree.-1200.degree. C.), and plasma energy by radio frequency (RF) power, optical energy (e.g., a laser or ultraviolet light) and heat are used for decomposing the introduced gas. Also, the semiconductor substrate is heated to promote the reaction of the decomposed atom or molecule and to control the physical properties of the formed film.
Generally speaking, the CVD method is divided into an atmospheric pressure CVD (APCVD) method and a low pressure CVD (LPCVD) method, according to the degree of vacuum in the reaction chamber during the process.
Recently, CVD methods have been adopted extensively in the semiconductor industry due to certain distinct merits: (a) silicon epitaxial layers can be formed with the desired thicknesses and resistances, (b) polysilicon, silicon oxide and silicon nitride layers can be obtained at low cost, and (c) the silicon oxide and silicon nitride layers (for the protection of silicon devices) can be formed at relatively low temperatures.
A physicochemical characteristic of the thin layer obtained by the CVD method is determined by the construction of the substrate (e.g., amorphous, polycrystalline or crystal) on which a thin film is deposited and the deposition conditions (i.e., temperature, growing rate, pressure, etc.). Generally, the above variables affect the surface mobility of the deposited atoms, thereby determining the construction and other characteristics of the film.
Here, two CVD apparatuses and their gas supply methods (disclosed in Japanese Patent Applications Nos. 89-264258 and 92-7825) will be described. The conventional CVD apparatuses are shown in FIGS. 1 and 2.
First, FIG. 1 is a diagram schematically showing the construction of a CVD apparatus using plasma.
As shown in FIG. 1, the plasma CVD apparatus comprises a reaction chamber 12, a susceptor 14 disposed horizontally inside the reaction chamber, and a shower head 19. Here, a silicon substrate 13 is seated on the susceptor 14. Situated above reaction chamber 12, a first gas supply pipe 15 is connected to shower head 19 and a first mass flow controller 16 controls the amount of gas flowing in the first gas supply pipe. Also, a booster pump 11 and a rotary pump 10 are connected beneath reaction chamber 12 for controlling the pressure and drawing off the gas within the reaction chamber. Provided on one side of reaction chamber 12, an incubator 18 generates gas by evaporating the liquid in a liquid source 17, and a second gas supply pipe 20 introduces the gas from the liquid source, the amount of which is controlled by a second mass flow controller 21.
Next, FIG. 2 is a diagram schematically showing the constitution of the conventional LPCVD apparatus.
Referring to FIG. 2, the LPCVD apparatus comprises a reaction chamber 33, a susceptor 25 disposed horizontally inside the reaction chamber, a shower head 32, and a heating block 29 for heating a silicon substrate 28 seated on the susceptor. Situated above reaction chamber 33, a first gas supply pipe 34 is connected to shower head 32, and an RF generating apparatus 31 is connected to the first gas supply pipe. Also, a mass flow controller 27 controls the amount of gas flowing in the first gas supply pipe 34. A booster pump 24 and a rotary pump 23 are connected beneath reaction chamber 33 for controlling the pressure and drawing off the gas within the reaction chamber. Provided above and to the side of reaction chamber 33, an incubator 30 generates gas by evaporating the liquid in a liquid source 22, and a second gas supply pipe 26 introduces the gas from the liquid source.
As above, both ga supply methods of the conventional CVD apparatuses shown in FIGS. 1 and 2 prevent the gases from interacting before reaching the reaction chamber. The above methods are generally employed for the purpose of preventing particle generation or the clogging of the gas supply pipes; problems which are the result of the gases becoming mixed prematurely and thus reacting with each other outside the reaction chamber. In these methods, however, the gas is not distributed evenly inside the reaction chamber, and as a result, the uniformity of the film thickness grown on the substrate is adversely affected.

Showerhead for a gas supplying apparatus


A system and method for efficiently interconnecting a plurality of ICs, thereby improving the electrical performance of the overall system while reducing contact degradation due to stress that results from differences in the coefficients of thermal expansion of the various components during thermal cycling.

The present invention relates to the packaging of semiconductor devices, and more particularly to a system and method for interconnecting integrated circuits (ICs) on a semiconductor substrate.
Electronic systems typically are manufactured from two or more ICs to provide complete system function. Until recently the limitations on performance and number of I/O pins were not significant for the vast majority of applications. However, as more devices are integrated in a single IC and as clock speeds increase, limitations on performance and number of I/O pins would be of paramount concern to semiconductor manufacturers. This is because the overall performance of the system is based on multiple ICs is a function of the performance of the individual ICs and of the performance of the signals between the ICs. The performance of the signals between the ICs is in turn a function of the number of signals and the electrical characteristics of the means used to connect the I/O pins of the ICs. A more efficient means for interconnecting ICs is, therefore, becoming an important influence on the cost, size, performance, weight, and efficiency of electronic systems.
Currently, the most common method used for interconnecting ICs is to first package the individual ICs, and then mount the packaged ICs on a substrate such as a printed circuit board. The size of the package is typically several times larger than the IC and is often manufactured from a metal lead frame and protected within a plastic molded case. The packaged ICs are then placed and soldered to a printed circuit board to create a complete electronic system. The advantages of the current method include low cost and protection of the IC during subsequent handling. In addition, the package acts as a standardized carrier for testing of the IC, such that design changes to the printed circuit board may be made cheaply and quickly. Assembly of the IC to the printed circuit board may further be automated. Finally, the current system allows rework of the printed circuit.
A more efficient method of interconnecting ICs has been demonstrated with the use of flip-chip technology in which a silicon substrate having metallization is connected to an integrated circuit via solder connections. This type of coupling between the integrated circuit and the substrate allows increasing the number of I/O pins, compared to other interconnect technology. A drawback with traditional flip-chip technologies concerns the degradation of the electrical connections subsequent to repeated thermal cycling.
What is needed, therefore, is a mounting technique for integrated circuits that facilitates increased I/Os while avoiding thermal degradation of the I/C substrate interface.

System and method for packaging integrated circuits


The mechanism of the inhibition of advanced glycosylation by aminoguanidine and other hydrazine type compounds was investigated using a solution of one or two molecules of aminoguanidine or other hydrazine type compound incubated with an Amadori product (1-propylamine-1-deoxy-D-fructose) under physiological conditions. This inhibition was found to proceed through the reactive intermediate 1-propylamino-1, 4-dideoxyosone to form the corresponding triazine and the dehydrazone of 1,4-dideoxyglucosone, respectively.. The triazine and dehydrazone products are useful as macrophage stimulants to activate a macrophage to effect removal of advanced glycosylation endproducts (AGEs). Additionally, they can be used in a variety of investigative methods in an effort to measure the extent of nonenzymatic glycosylation of a protein sample wherein aminoguanidine or other hydrazine-type compound is or was present during the glycosylation process.

1. Field of the Invention
The present invention is directed generally to the reaction that occurs between glucose and proteins, and more specifically, to the identification of a new group of compounds which form during nonenzymatic browning and whose existence became apparent by the studies of the inhibition of this reaction by aminoguanidine and its related analogs.
2. Description of the Prior Art
About eighty years ago, Louis Maillard first investigated the reaction of reducing sugars with the free amino groups of amino acids and proteins. This complicated reaction, termed the Maillard reaction, or non-enzymatic browning, is responsible for the aroma and taste in cooked or preserved foods.
This reaction is initiated by the reaction of primary amines (from amino acids, proteins and nucleic acids) with sugars to form imines (Schiff bases) which undergo a rearrangement to form Amadori products (AP) (see Scheme 1, below). Further rearrangements of the Amadori product are responsible for the browning and fluorescent products which lead to the formation of advanced glycosylation endproducts (AGEs). ##STR1##
Over the last fifteen years, it has been demonstrated that the Maillard reaction also occurs in vivo. A variety of proteins, such as hemoglobin, lens crystallins, connective tissue collagen, glomerular basement membrane and nerve tissue proteins, are modified by glucose in normal individuals. In diabetic patients the level of Amadori product is generally 2-3 fold higher than non-diabetics. Thus, the advanced glycosylation endproducts from Amadori product play an important role in the pathogenesis of the complications in diabetes and aging.
The chemistry of AGE formation is not yet well understood because of its extreme complexity. A variety of Maillard compounds have been identified from incubations prepared at high temperature or under acidic conditions. There is little structural information about Maillard compounds which form under physiological conditions. In 1986, Brownlee et al. found aminoguanidine to be an effective inhibitor of advanced glycosylation. Later it was shown that aminoguanidine-treated diabetic animals had significantly less collagen-linked fluorescence and crosslinking in the vascular wall than the untreated ones. Presently, aminoguanidine has displayed excellent efficacy in treating a variety of diabetic complications and is undergoing clinical efficacy trials.
The precise mechanism by which aminoguanidine and its analogs prevent advanced glycosylation is unknown. Several deoxydiketoses are detected as the degradation products of the Amadori products at various pHs and at elevated temperature, for example, 1-deoxyglucosone, 3-deoxyglucosone and 4-deoxyglucosone (see Scheme 2 below). In most studies to date, these compounds have been obtained under non-physiological conditions (high concentrations, low pH and high temperature). For example, 3-deoxyglucosone was formed preferably under acidic conditions. Furthermore, these compounds are very unstable and proof of their existence is often via chemical derivatization. ##STR2##

1,2,4-triazine products resulting from the inhibition of advanced glycosylation


A parking assistance method including: setting a target parking position of a vehicle on the basis of a circumferential situation of the vehicle detected by a circumferential situation detection sensor; determining a communication situation between an operation device configured to receive an operation by an operator outside the vehicle and transmit an instruction signal corresponding to the operation and a communication device mounted on the vehicle and configured to receive the instruction signal; limiting the operation for manually adjusting the target parking position in the operation device depending on the communication situation; transmitting, when the target parking position is adjusted, the instruction signal for moving the target parking position to the communication device; and parking the vehicle by the automatic driving in the target parking position moved depending on the instruction signal received at the communication device.

A technology for adjusting a parking position using a remote operation device outside a vehicle interior is described in Japanese Patent Application Publication No. JP 2006-306233 A.
When a communication situation between an operation device existing outside a vehicle and the vehicle is bad, a communication speed between the operation device and the vehicle decreases. Thus, the operability of the operation device sometimes decreases due to the decrease in the communication speed. The foregoing decrease in the operability of the operation device is generated because arrival of an instruction signal corresponding to an operation performed in the operation device is delayed due to the decrease in the communication speed, for example.
For example, when the arrival of the instruction signal is delayed, the responsiveness for the operation performed in the operation device decreases. Thus, an operator mistakenly believes that the operation is not received, and sometimes repeats the same operation. Consequently, an excessive operation is performed, thereby leading to a result that the operator does not intend, and the operator feels unhandiness of the operation device.
As just described, the decrease in the operability of the operation device possibly provides a feeling of discomfort for the operator.
An object of the present invention is, when a target parking position is manually adjusted in an operation device configured to park a vehicle by a remote operation, to reduce a feeling of discomfort that an operator feels due to a decrease in operability of the operation device in association with deterioration in a communication situation between the operation device and the vehicle.

Parking assistance method and parking assistance device


A storage subsystem has a plurality of storage devices. An indication of failure of at least one of the plurality of storage devices is detected. In response to detecting the indication of failure, monitoring is performed for a further condition. According to the monitored further condition, it is determined whether the at least one storage device has failed or whether communication has been lost to the storage subsystem. In response to determining that communication has been lost, state information of the storage subsystem is preserved to enable restoration of the storage subsystem after communication to the storage subsystem is recovered.

A storage subsystem can be implemented with multiple (e.g. an array of) physical storage devices. A storage volume, which is a logical unit of data, can be implemented across plural physical storage devices. One reason for implementing a storage volume across plural physical storage devices is to provide redundancy, such as redundancy based on mirroring data (in which data of a first storage device is copied to a second storage device to provide redundancy). Another form of redundancy is parity-based redundancy (in which parity information of data stored in a group of storage devices is kept in another storage device). By providing redundancy, if a physical storage device (or any part of a physical storage device) from the multiple physical storage devices were to fail, then the data stored in the storage subsystem can still be recovered under certain conditions.
With a conventional storage subsystem, it may be difficult to recover from a failure condition in which communication is lost to the entire storage subsystem. Typically, when communication to an entire storage subsystem is lost, a manual process is used to attempt to recover the storage subsystem. Such a manual process of storage subsystem recovery is labor-intensive and time-consuming.

Preserving state information of a storage subsystem in response to communication loss to the storage subsystem

Hewlett-Packard Development Company, L.P,


The multi-sheet, folded printed product arranged on the supporting member is penetrated by a penetration tool, from the direction of a supporting member. A pressure-exerting element acts on the printed product with a lateral compressive force. This results in a widening of the through-passage produced through the printed product. Upon withdrawal into the rest position of the penetration tool, adhesive present on the surface of the penetration tool is transferred onto the sheets in the through-passage. Once the lateral compressive force has been eliminated, the through-passage closes, which results in good distribution of the adhesive and reliable adhesive bonding.

The present invention relates to a process and to an apparatus for the adhesive connection of the sheets of a multi-sheet, folded printed product, such as a periodical, newspaper, brochure or the like.
A process and an apparatus of this type is described in U.S. patent application Ser. No. 08/258,096, now abandoned corresponding to Swiss CH patent application No. 01 754/93-7 and to EP patent application No. 94 107 767.9. In this disclosed arrangement, the printed product is arranged astride a saddle-like support. A carrying bar with penetration tools in the form of drive-in or boring needles is located above the support. In producing the adhesive connection, a pressing device is first lowered onto the printed product in order to hold the latter, in a defined manner, in abutment against the support. By lowering the penetration tools, through-passages are produced through the fold of the printed product. Upon forming the through-passages or upon withdrawal of the penetration tools, adhesive applied onto the outer side of the penetration tools is transferred onto the sheets over the entire length of the through-passages in order to produce punctiform adhesive bonding. These documents also disclose that the penetration tools could also be arranged on the support instead of being arranged on the carrying bar. The result would be that the drive-in movement would take place from bottom to top i.e. from the inner side of the printed product to the outer side thereof. In this arrangement, however, there is the danger that, upon withdrawal of the penetration tool which has adhesive on its surface, adhesive is rubbed off on the outer side of the outermost sheet and that adhesive is drawn in onto the inner side of the innermost sheet. If the printed product is not fully folded immediately after the introduction of the adhesive, the printed product may no longer be able to be fully folded or no longer be able to be opened fully due to the halves of the innermost sheet sticking together adjacent to the fold. Furthermore, the support may be soiled by adhesive if the printed product is moved along the support after the adhesive is introduced. Adhesive rubbed off on the outer side of the printed product may soil other printed products or parts of the apparatus. Further processing may also be impaired. For example, during stacking of printed products, adhesive which has not yet dried may result in the printed products sticking together.
An object of the present invention is thus to provide a process and an apparatus for the adhesive connection of the sheets of a multi-sheet folded printed product, wherein the adhesive is transferred onto the sheets exclusively in a through-passage.

Process and apparatus for the adhesive connection of the sheets of a multi-sheet folded printed product


A disk drive is disclosed comprising a disk for storing initial host requested (IHR) data requested by a host computer during a start-up process of the host computer, a head actuated radially over the disk, and a non-volatile semiconductor memory (NVSM) for caching at least part of the IHR data. The disk drive transmits the cached IHR data from the NVSM to the host computer during the start-up process thereby avoiding the delay associated with initializing the mechanics of the disk drive as well as conserving battery power for mobile applications.

1. Field of the Invention
The present invention relates to disk drive for computer systems. More particularly, the present invention relates to a disk drive that caches initial host requested data in non-volatile semiconductor memory to reduce start-up time of a host computer.
2. Description of the Prior Art
Computer systems such as personal computers (PCs) execute an operating system that is typically stored on a disk of a disk drive. When powered on during an operating system (OS) boot, the host computer reads the OS boot data from the disk drive as part of a "start-up" process. In mobile computing applications, such as with laptop computers, the host computer may enter a "hibernation" mode to conserve power by powering down the disk drive and other components. Before entering the hibernation mode an "image" of the host computer's memory representing an operating state (e.g., OS boot data, application data, video graphics data) is 18 stored as a file on the disk drive. When the host computer "wakes" from the hibernation mode the operating state is restored during the start-up process by reading the image file from the disk. Desktop computers may also implement a hibernation mode as disclosed in U.S. Pat. No. 6,209,088 which is incorporated herein by reference.
When the disk drive is powered on (in connection with booting or waking the host computer) the disk drive must perform a mechanical initialization process wherein the disk is spun up to an operating speed and the mechanics calibrated (e.g., calibrating the servo system) before the data stored on the disk can be accessed, creating an undesirable delay during the start-up process. This delay is apparent to the end user in various applications, such as desktop computing, enterprise computing, mobile computing, and game computing. The start-up process also consumes power in mobile applications due to the mechanical components consuming power, such as a voice coil motor actuating a head while reading the initial host requested data from the disk.
There is, therefore, a need to reduce the start-up time of a host computer as well as reduce power consumption in mobile devices employing a hard drive.

Disk drive caching initial host requested data in non-volatile semiconductor memory to reduce start-up time of a host computer


A controller includes a control unit which stops a transfer mechanism in a case where the value of a deterioration indication parameter has exceeded a preset threshold, and determines whether or not an event in which the value of the deterioration indication parameter has exceeded the preset threshold is attributed to deterioration of the transfer mechanism which has progressed over time based on a change pattern of time series data of the value of the deterioration indication parameter, and causes the transfer mechanism to operate at a reduced operation speed, in a case where the control unit determines that the event in which the value of the deterioration indication parameter has exceeded the preset threshold is attributed to the deterioration of the transfer mechanism which has progressed over time.

Examples of conventional techniques for determining deterioration of a transfer device are as follows. For example, Patent Literature 1 discloses a deterioration detecting device of a driving mechanism, which detects at least one of a position of a movable member of a motor and a current flowing through a driving source and determines a deterioration state of the driving mechanism based on at least one of a change in the detected position with respect to a target position of the movable member and the detected current.
Patent Literature 2 discloses a monitoring device of a substrate transfer system, which compares data corresponding to a target position of a movable member to data corresponding to an actual position of the movable member which is detected by a detecting means, finds a deviation between these data, and determines that the operation of the transfer system has an abnormality in a case where the deviation exceeds a predetermined allowable range.


A rain sensor for use with an irrigation control system includes a position sensing element. A moisture absorptive element is supported for receiving rainfall. An actuating element is mechanically connected to the moisture absorptive element for movement adjacent the position sensing element as the moisture absorptive element expands and contracts to thereby induce a change in the position sensing element that can be used to generate an interrupt signal without any mechanical connection between the moisture absorptive element and the position sensing element.

The present invention relates to irrigation systems, and more particularly, to rain sensors which interrupt the execution of a watering program by an electronic irrigation controller during periods of rainfall.
In many areas of the world, it is necessary to irrigate crops and landscaping due to inadequate seasonal rainfall. Within the past several decades electronically controlled irrigation systems have come into widespread use. They typically include a micro-processor based irrigation controller which executes a stored watering program for turning on and off valves connected to supply lines equipped with sprinklers. The watering program typically activates various zones during run cycles measured in minutes on selected days of the week. The watering program can be adjusted to accommodate seasonal variations in rainfall. However, due to the unpredictability of weather patterns in general, it is desirable to connect a rain or moisture sensor to an electronic irrigation controller so that the sprinklers will not be turned on while it is raining, and for some time period thereafter before the rainfall has either evaporated or soaked into the ground. By interrupting a watering program of an electronic irrigation controller during, and shortly after, a period of rainfall, both purified and reclaimed water can be conserved thus lessening the demand on purification plants, reservoirs and other artificial delivery systems.
Rain sensors and moisture responsive actuators have been developed for use in connection with electronic irrigation controllers. One type of rain sensor operates in response to the weight of rainfall collected in a receptacle. However, this type of rain sensor is adversely affected by wind conditions and the collection of debris, and is too slow in reactivating the watering program. Its evaporative rate is not adjustable. Subterranean moisture sensors have also been developed for use with irrigation controllers. However, they are expensive, unreliable and subject to breakdowns. Rainfall sensors have also been developed which utilize infrared emitter and detector devices that optically detect the presence of collected rainfall. See for example U.S. Pat. No. 5,836,339 of Klever et al. entitled RAINDROP COUNTER AND CONTROL SYSTEM FOR IRRIGATION CONTROL SYSTEMS. However, these devices are relatively complex and expensive. Another category of rain sensor which has been widely commercialized under the MINI-CLIK® trademark utilizes a plurality of stacked discs made of a hygroscopic material. The discs expand in response to contact with rain water to depress a spring biased switch to deactivate the watering program of the electronic irrigation controller. When the rain stops, the hygroscopic discs eventually dry out and contract, thereby releasing the switch to re-activate the watering program. See for example U.S. Pat. No. 3,808,385 of Klinefelter entitled MOISTURE RESPONSIVE SWITCH ACTUATOR.
A principal drawback of rain sensors that utilize hygroscopic material lies in the fact that they require that an electrical switch be connected mechanically to the hygroscopic material. This allows the physical expansion of the hygroscopic material during rain fall, and subsequent contraction of the hygroscopic material during sunny conditions, to actuate the electrical switch between OFF and ON states to thereby generate the watering program interrupt and resume signals. The required mechanical connection between the electrical switch and the hygroscopic material necessarily entails some sort of elastomeric seal, boot or other waterproof flexible interface between an actuating element, such as a lever or pushbutton and a watertight case enclosing the movable conductive contacts of the electrical switch. Over time this elastomeric interface degrades, eventually allowing moisture to enter the watertight case. This leads to corrosion and other failures associated with the movable conductive contacts of the electrical switch. As a result, the irrigation controller may end up commanding the stations of the irrigation system to water during rainfall and/or fail to resume watering after it has been several days since rainfall and watering is required to prevent turf from browning and plants from dying. Thus there is a need for an improved rain sensor that will overcome the shortcomings of the interrupt system disclosed in U.S. Pat. No. 6,452,499 granted to Runge et al. on Sep. 17, 2002 entitled WIRELESS ENVIRONMENTAL SENSOR SYSTEM. The system of Runge et al. employs a rain sensor requiring an electrical switch connected mechanically to the hygroscopic material.

Moisture absorptive rain sensor with sealed position sensing element for irrigation watering program interrupt


The invention relates to a method for manufacturing components from critical cold forming of light metal strip, preferably naturally hard Al alloys of the AlMg or AlMg--Mn types, in which the desired component is manufactured from the strip by at least one cold forming step and the plasticity is improved before the cold forming by means of a soft annealing. According to the invention, it is proposed that the region of the longitudinal edges of the cold-slit strips is heated in a depth in the strip width of at least 1 mm to a maximum of 10 mm in such a way that a temperature of over 150.degree. C. is reached over a time span of more than 0.1 seconds to a maximum of 10 seconds.

1. Field of the Invention
The invention relates to a method for manufacturing components from light metal strip.
2. Description of the Prior Art
In a light metal strips of naturally hard Al alloys, in particular of the AlMg or AlMg--Mn types, problems occur during cold forming at the cut edges from slitting, attributable not only to the microcracks caused by the slitting but also in particular to the cold hardening brought about as a result. To ensure greatest possible plasticity, the entire sheet bars are soft-annealed in the stack or the entire coil is soft-annealed in a so-called bell-type furnace. During drawing off of the strip from the soft-annealed coil, the coil curvature is straightened until flat. This straightening produces a certain additional cold hardening, which leads to a further increase in the yield strength and reduction in stress. What is disadvantageous in the known methods is the amount of energy and time expended for the soft-annealing of the entire material.
DE 3247698 C2 discloses an intermediate annealing of strip of an AlMgMn alloy. This intermediate annealing, which takes place between two successive cold rolling passes, is carried out as coil annealing at a temperature of 300 to 410.degree. C. during a period of 1/2 to 8 hours. Alternatively, the annealing may also take place at 300 to 400.degree. C. as continuous strip annealing for a period of 2 seconds to 2 minutes. Both annealing methods expend considerable amounts of energy (time, temperature) and the handling effort is also considerable. The last-mentioned annealing method for continuous strip annealing also requires enormous expenditure on equipment.
DE 4313543 C1 discloses a method for the heat treatment of continuous light-metal strips. For thin-walled strips with a thickness of 0.02 to 1.5 mm in particular, problems occur in the edge region in cases of high through-running speeds and/or great strip widths. The edge regions often become wavy, which may disrupt later processing. This edge region effect can be avoided if more heat is supplied per unit area to the edge regions of the strip than to the central region of the strip, at least over part of the treatment zone. This type of annealing corresponds in principle to continuous strip annealing with a steeper temperature gradient in the edge region to avoid wave formation. The already known disadvantages of continuous strip annealing likewise apply here.

Method for manufacturing components by critical formation of light metal strip


A Group III nitride compound semiconductor light-emitting element has a reflecting surface on a side opposite to a main light-emitting surface of the element viewed from a light-emitting layer. The reflecting surface is inclined to surfaces of growth of semiconductor layers. Light emitted from the light-emitting layer is reflected by the reflecting surface, so that the reflected light emerges from side surfaces of the light-emitting element to the outside without passing through the semiconductor layers (particularly, the light-emitting layer).

1. Field of the Invention
The present invention relates to a Group III nitride compound semiconductor light-emitting element.
2. Description of the Related Art
A Group III nitride compound semiconductor light-emitting element is fixed to a support such as a lead frame. Light emitted from a light-emitting layer of the light-emitting element contains a light component advancing toward a main light-emitting surface of the light-emitting element, and a light component advancing toward a side (the support side) opposite to the main light-emitting surface. Incidentally, a general type light-emitting element is formed so that an electrode surface is used as a main light-emitting surface whereas a flip chip type light-emitting element is formed so that a substrate surface is used as a main light-emitting surface.
A reflecting layer was heretofore provided so that light advancing toward the support side could be reflected toward the main light-emitting surface side in order to use the light effectively as referred in the following documents. Unexamined Japanese Patent Publication No. 2000-286445 Unexamined Japanese Patent Publication No. Hei-8-102549 Unexamined Japanese Patent Publication No. Hei-9-36427
In such a light-emitting element, the reflecting surface is flat. Accordingly, light reflected by the reflecting surface (hereinafter referred to as "reflected light" occasionally) passes through semiconductor layers and emerges from the main light-emitting surface to the outside.
The present inventors have made an eager examination to attain improvement in light-emitting efficiency of the light-emitting element. As a result, it has been found that light-reflected by the reflecting surface may be absorbed particularly to the light-emitting layer when the light passes through the semiconductor layers, and that this absorption is a cause of lowering in light-emitting efficiency.