A carrier conveying apparatus comprises a first carrier rest for placing carriers thereon, a second carrier rest to which the carriers are conveyed, a carrier holding member for holding a plurality of carriers at a time from below, a liftably moving mechanism for liftably moving the carrier holding member and a horizontally moving mechanism provided over a distance from below the first carrier rest to a position below the second carrier rest to horizontally move the carrier holding member and liftably moving mechanism. The liftably moving mechanism lifts the carrier holding member from below the first carrier rest and hence lifts the carriers placed on the first carrier rest in a manner to hold them by the carrier holding member. Then the horizontally moving means horizontally moves the carrier holding member and liftably moving mechanism to a position above the second carrier rest. Then the liftably moving mechanism lowers the carrier holding member to place the carriers on the second carrier rest.

1. Field of the Invention
The present invention relates to a carrier conveying apparatus.
2. Description of the Prior Art
In a semiconductor heat-treating device, etc., a carrier conveying apparatus has been employed which conveys a carrier with a plurality of semiconductor wafers substantially vertically held in a spaced-apart relation.
An apparatus having a gripping means for gripping carriers from above is conventionally known as a carrier conveying apparatus. The carriers are conveyed by a gripping means-equipped carrier conveying apparatus as will be set out below. First, the gripping means is moved, by liftably moving means and horizontally moving means, to a desired height above the carrier. Then, the gripping means is opened at the desired position and lower toward the carrier. The gripping means, upon reaching a given position, stops its lowering and grips the carrier by closing the gripping means. The gripping means is moved in a lifting motion and in a horizontal motion with the carrier gripped thereby. The gripping means, upon reaching a desired position, releases the carrier with the gripping means opened and place the carrier in place.
In the case where the carrier is gripped and conveyed to the predetermined position, for example, dust, etc., is raised upon the opening and closing operate the gripping means from a sliding part of the gripping means, falling on the surfaces of wafers in the carrier. In this way, the dust is deposited there. As a result, drop in the yield of semiconductor devices, which are finished products, results.


The present invention is a heteroaromatic substituted amide showing antagonist activity to neurokinin 1 (NK-1, substance P) receptors.

The present invention is generally related to novel heteroaromatic substituted amide compounds and more particularly to heteroaromatic substituted amide compounds showing antagonist activity to neurokinin 1 (NK-1, substance P) receptors.
The neuropeptide receptor for substance P (NK-1) is widely distributed throughout the mammalian nervous system (especially brain and spinal ganglia), the circulatory system and peripheral tissues (especially the duodenum and jejunum) and are involved in regulating a number of diverse biological processes. The central and peripheral actions of the mammalian tachykinin substance P have been associated with numerous inflammatory conditions including migraine, rheumatoid arthritis, asthma, and inflammatory bowel disease as well as mediation of the emetic reflex and the modulation of central nervous system (CNS) disorders such as Parkinson""s disease (Neurosci. Res., 1996, 7, 187-214), anxiety (Can. J. Phys., 1997, 75, 612-621) and depression (Science, 1998, 281, 1640-1645).
xe2x80x9cTachykinin Receptor and Tachykinin Receptor Antagonistsxe2x80x9d, J. Auton. Pharmacol., 13, 23-93, 1993 reviews evidence for the usefulness of tachykinin receptor antagonists in pain, headache, especially migraine, Alzheimer""s disease, multiple sclerosis, attenuation of morphine withdrawal, cardiovascular changes, oedema, such as oedema caused by thermal injury, chronic inflammatory diseases such as rheumatoid arthritis, asthma/bronchial hyperreactivity and other respiratory diseases including allergic rhinitis, inflammatory diseases of the gut including ulcerative colitis and Crohn""s disease, ocular injury and ocular inflammatory diseases. The neurokinin-1 receptor antagonists are also known to be useful for the treatment of motion sickness and for treatment of induced vomiting.
Furthermore, Neurokinin 1 receptor antagonists are being developed for the treatment of a number of physiological disorders associated with an excess or imbalance of tachykinin, in particular substance P. Examples of conditions in which substance P has been implicated include disorders of the central nervous system such as anxiety, depression and psychosis (WO 95/16679, WO 95/18124 and WO 95/23798).
In addition, a paper published in The New England Journal of Medicine, Vol. 340, No. 3 190-195, 1999 describes the reduction of cisplatin-induced emesis by a selective neurokinin-1-receptor antagonist.
U.S. Pat. No. 5,972,938 discloses a method for treating a psychoimmunologic or a psychosomatic disorder by administration of a tachykinin receptor, such as NK-1 receptor antagonist.
The usefulness of neurokinin 1 receptor antagonists for the treatment of certain forms of urinary incontinence is further described in xe2x80x9cNeuropeptides, 32(1), 1-49, (1998)xe2x80x9d and xe2x80x9cEur. J. Pharmacol., 383(3), 297-303, (1999)xe2x80x9d.
A 4-phenyl-pyridine compound, related to compounds disclosed in the present application, is disclosed in U.S. app. Ser. No. 09/507,456 (EP 1,035,115).
The present invention relates to compounds having the formulae
wherein
R1 is xe2x80x83xe2x80x94NH(CH2)2OH or xe2x80x94NR3C(O)R4;
R2 is methyl or chloro;
R3 is hydrogen or methyl;
R4 is lower alkyl or lower cycloalkyl;
R is hydrogen or xe2x80x94(CH2)2OH; and
n is 1 or 2
or a pharmaceutically acceptable acid addition salt thereof.
The compounds of formulae IA and IB can also be used in form of their prodrugs. Examples are esters, N-oxides, phosphate esters, glycoamide esters, glyceride conjugates and the like. The prodrugs may add to the value of the present compound""s advantages in adsorption, pharmacokinetics in distribution and transport to the brain.
The compounds of formulae IA and IB and their salts are characterized by valuable therapeutic properties. It has been surprisingly found that the compounds of the present invention are antagonists of the Neurokinin 1 (NK-1, substance P) receptor. Substance P is a naturally occurring undecapeptide belonging to the tachykinin family of peptides, the latter being so-named because of their prompt contractile action on extravascular smooth muscle tissue. The receptor for substance P is a member of the superfamily of G protein-coupled receptors therefore, the compounds of the invention can be used to treat diseases associated with an excess or imbalance of tachykinin, in particular substance P. Examples of conditions in which substance P has been implicated include disorders of the central nervous system such as anxiety, depression and psychosis.
The following definitions of the general terms used in the present description apply irrespective of whether the terms in question appear alone or in combination. As used herein, the term xe2x80x9clower alkylxe2x80x9d denotes a straight- or branched-chain alkyl group containing from 1-7 carbon atoms, for example, methyl, ethyl, propyl, isopropyl, n-butyl, i-butyl, t-butyl and the like. Preferred lower alkyl groups are groups with 1-4 carbon atoms. Particularly preferred are methyl groups. The term xe2x80x9ccycloalkylxe2x80x9d denotes a saturated carbocyclic group, containing 3-6 carbon atoms. A preferred cycloalkyl group is cyclopropyl.
Exemplary preferred are compounds of formula IA, in which R2 is methyl, for example the following compounds:
N-(3,5-bis-trifluoromethyl-benzyl)-N-methyl-4-o-tolyl-6-[1,2,4]triazol-1-yl-nicotinamide,
N-(3,5-bis-trifluoromethyl-benzyl)-6-(2-hydroxy-ethylamino)-N-methyl-4-o-tolyl-nicotinamide,
4-hydroxy-4xe2x80x2-o-tolyl-3,4,5,6-tetrahydro-2H-[1,2xe2x80x2]bipyridinyl-5xe2x80x2-carboxylic acid (3,5-bis-trifluoromethyl-benzyl)-methyl-amide,
4-(2-hydroxy-ethoxy)-4xe2x80x2-o-tolyl-3,4,5,6-tetrahydro-2H-[1,2xe2x80x2]bipyridinyl-5xe2x80x2-carboxylic acid (3,5-bis-trifluoromethyl-benzyl)-methyl-amide or
(R)-N-(3,5-bis-trifluoromethyl-benzyl)-6-(3-hydroxy-pyrrolidin-1-yl)-N-methyl-4-o-tolyl-nicotinamide.
Further preferred are compounds of formula IA, in which R2 is chloro.
An example of such compound is:
4xe2x80x2-(2-chloro-phenyl)-4-hydroxy-3,4,5,6-tetrahydro-2H-[1,2xe2x80x2]bipyridinyl-5xe2x80x2-carboxylic acid (3,5-bis-trifluoromethyl-benzyl)-methyl-amide
Exemplary preferred are compounds of formula IB, in which R2 is methyl, for example the following compounds:
2-(3,5-bis-trifluoromethyl-phenyl)-N-[6-(2-hydroxy-ethylamino)-4-o-tolyl-pyridin-3-yl]-N-methyl-isobutyramide,
2-(3,5-bis-trifluoromethyl-phenyl)-N-[6-(2,3-dihydro-[1,4]oxazin-4-yl)-4-o-tolyl-pyridin-3-yl]-N-methyl-isobutyramide,
N-(6-acetylamino-4-o-tolyl-pyridin-3-yl)-2-(3,5-bis-trifluoromethyl-phenyl)-N-methyl-isobutyramide,
N-[6-(acetyl-methyl-amino)-4-o-tolyl-pyridin-3-yl]-2-(3,5-bis-trifluoromethyl-phenyl)-N-methyl-isobutyram
cyclopropanecarboxylic acid (5-{[2-(3,5-bis-trifluoromethyl-phenyl)-2-methyl-propionyl]-methyl-amino}-4-o-tolyl-pyridin-2-yl)-amide,
cyclopropanecarboxylic acid (5-{[2-(3,5-bis-trifluoromethyl-phenyl)-2-methyl-propionyl]-methyl-amino}-4-o-tolyl-pyridin-2-yl)-methyl-amide or
2-(3,5-bis-trifluoromethyl-phenyl)-N-(6-imidazol-1-yl-4-o-tolyl-pyridin-3-yl)-N-methyl-isobutyramide.
Further preferred are compounds of formula IB, in which R2 is chloro, for example the following compound:
2-(3,5-bis-trifluoromethyl-phenyl)-N-[4-(2-chloro-phenyl)-6-(2-hydroxy-ethylamino)-pyridin-3-yl]-N-methyl-isobutyramide.
Also preferred are compounds of formula 1B, in which R1 is xe2x80x94NH(CH)2OH. Also for formula 1B, R1 is preferred as xe2x80x94NR3C(O)R4, R3 is methyl and R4 is lower alkyl. R4 being methyl is particularly preferred. Additionally, R4 is preferred as cycloalkyl, particularly cyclopropyl. Additionally, for formula 1B, R1 is preferred as a heterocycle, with oxazine and imidazole being preferred heterocycles when R2 is methyl.
The present compounds of formulae IA and IB and their pharmaceutically acceptable salts can be prepared by methods known in the art, for example, by processes described below, which process comprises
reacting a compound of formula
with a compound of formula
to a compound of formula
wherein R1 and R2 have the significances given above, or
reacting a compound of formula
with a compound of formula
to give a compound of formula
wherein R1 and R2 have the significances given above, or reacting a compound of formula
with a compound of formula
to a compound of formula
wherein Z is Cl, Br, I, xe2x80x94OS(O)2C6H4CH3 or xe2x80x94OS(O)2CH3 and the other definitions of substituents are given above, or
reacting a compound of formula
with a compound of formula
R1H XIV
to a compound of formulae
wherein the definition of substituents is given above, and
if desired, converting the compound obtained into a pharmaceutically acceptable acid addition salt.
In accordance with process variant a) DIPEA (N-ethyldiisopropyl-amine) is added to a mixture of a compound of formula II and a compound of formula III in dichloromethane and the mixture is stirred at temperatures between 35-40xc2x0 C. The desired compound of formula IB is isolated after purification in good yields.
Process variant b) describes the reaction of a compound of formula IV with a compound of formula V to a compound of formula IA. The reaction is carried out in conventional manner, for example in a solvent, such as a mixture of toluene and triethylamine. The mixture is refluxed for about 1 hour.
Process variant c) describes the reaction of a compound of formula VI with a compound of formula VII to a compound of formula IA. This reaction is carried out by deprotonation of a compound of formula VI with KHMDS (potassium hexamethyldisilazide) and subsequent addition of a compound of formula VII. A suitable solvent is tetrahydrofuran. The reaction is carried out at room temperature.
A further method for the preparation of a compound of formula IA or IB is described in process variant d). A compound of formulae VIII or IX is treated with a compound of formula XIV, which is, for example, 1,2,4-triazole, ethanolamine, 4-hydroxypiperidine, (R)-3-pyrrolidinol or morpholine. The reaction is carried out in THF, usually at 80-140xc2x0 C.
The salt formation is effected at room temperature in accordance with methods which are known per se and which are familiar to any person skilled in the art. Not only salts with inorganic acids, but also salts with organic acids come into consideration. Hydrochlorides, hydrobromides, sulphates, nitrates, citrates, acetates, maleates, succinates, methan-sulphonates, p-toluenesulphonates and the like are examples of such salts.
The following schemes 1-3 describe the processes for preparation of compounds of formulae IA and IB in more detail. The starting materials are known compounds or may be prepared according to methods known in the art.
In the schemes the following abbreviations have been used:

The definition of substituents is described above.
The definition of substituents is described above.
The definition of substituents is described above.
The most preferred indications in accordance with the present invention are those, which include disorders of the central nervous system, for example the treatment or prevention of certain depressive disorders or emesis by the administration of NK-1 receptor antagonists. A major depressive episode has been defined as being a period of at least two weeks during which, for most of the day and nearly every day, there is either depressed mood or the loss of interest or pleasure in all, or nearly all activities.
As mentioned earlier, the compounds of formulae IA and IB and their pharmaceutically usable addition salts possess valuable pharmacological properties. It has been found that the compounds of the present invention are antagonists of the Neurokinin 1 (NK-1, substance P) receptor.
The compounds were investigated in accordance with the tests given hereinafter.
The affinity of test compounds for the NK1 receptor was evaluated at human NK1 receptors in CHO cells infected with the human NK1 receptor (using the Semliki virus expression system) and radiolabelled with [3H]substance P (final concentration 0.6 nM). Binding assays were performed in HEPES buffer (50 mM, pH 7.4) containing BSA (0.04 %) leupeptin (8 xcexcg/ml), MnCl2 (3 mM) and phosphoramidon (2 xcexcM). Binding assays consisted of 250 xcexcl of membrane suspension (1.25xc3x97105 cells/assay tube), 0.125 xcexcl of buffer of displacing agent and 125 xcexcl of [3H]substance P. Displacement curves were determined with at least seven concentrations of the compound. The assay tubes were incubated for 60 min at room temperature after which time the tube contents were rapidly filtered under vacuum through GF/C filters presoaked for 60 min with PEI (0.3%) with 2xc3x972 ml washes of HEPES buffer (50 mM, pH 7.4). The radioactivity retained on the filters was measured by scintillation counting. All assays were performed in triplicate in at least 2 separate experiments.
The affinity to the NK-1 receptor, given as pKi, is in the scope of 8.40-9.24 for the described exemplary compounds of the present invention.
The compounds the present invention of formulae IA and IB as well as their pharmaceutically usable acid addition salts can be used as medicaments, e.g. in the form of pharmaceutical preparations. The pharmaceutical preparations can be administered orally, e.g. in the form of tablets, coated tablets, dragxc3xa9es, hard and soft gelatine capsules, solutions, emulsions or suspensions. The administration can, however, also be effected rectally, e.g. in the form of suppositories, or parenterally, e.g. in the form of injection solutions.
The compounds of formulae IA and IB and their pharmaceutically usable acid addition salts can be processed with pharmaceutically inert, inorganic or organic excipients for the production of tablets, coated tablets, dragees and hard gelatine capsules. Lactose, cornstarch or derivatives thereof, talc, stearic acid or its salts etc. can be used as such excipients e.g. for tablets, dragees and hard gelatine capsules.
Suitable excipients for soft gelatine capsules are e.g. vegetable oils, waxes, fats, semi-solid and liquid polyols etc.
Suitable excipients for the manufacture of solutions and syrups are e.g. water, polyols, saccharose, invert sugar, glucose etc.
Suitable excipients for injection solutions are e.g. water, alcohols, polyols, glycerol, vegetable oils etc.
Suitable excipients for suppositories are e.g. natural or hardened oils, waxes, fats, semi-liquid or liquid polyols etc.
Moreover, the pharmaceutical preparations can contain preservatives, solubilizers, stabilizers, wetting agents, emulsifiers, sweeteners, colorants, flavorants, salts for varying the osmotic pressure, buffers, masking agents or antioxidants. They can also contain still other therapeutically valuable substances.
The dosage can vary within wide limits and will, of course, be fitted to the individual requirements in each particular case. In general, the effective dosage for oral or parenteral administration is between 0.01-20 mg/kg/day, with a dosage of 0.1-10 mg/kg/day being preferred for all of the indications described. The daily dosage for an adult human being weighing 70 kg accordingly lies between 0.7-1400 mg per day, preferably between 7 and 700 mg per day.
The following Examples illustrate the present invention without limiting it. All temperatures are given in degrees Celsius.

Heteroaromatic substituted amides with antagonistic activity to neurokinin 1 receptors


A dynamo-electric machine has a stator with a primary winding and a rotor with a field magnet and a shaft. the field magnet includes a first field magnet having diferent polarity magnetic poles sequentially arranged in a rotation direction and a second field magnet having diferent polarity magnetic poles sequentially arranged in a rotation direction. The machine further has a mechanism for shifting the first and the second field magnets in axial and rotation directions.

The present invention relates to a dynamo-electric machine which uses a permanent magnet for field system, and particularly to a method and a dynamo-electric machine for performing the drive and regeneration in a carrier system or transport system.
In a permanent magnet field type dynamo-electric machine of the prior art, an induced electromotive force E is determined by a constant magnetic flux Φ generated by a permanent magnet arranged in a rotor and a rotating angular speed ω of the dynamo-electric machine. That is, when the rotating angular speed ω (rotating speed) of the dynamo-electric machine is increased, the induced electromotive force is proportionally increased.
Accordingly, high torque can be obtained in a low-speed range, but operation in a high-speed range is difficult because the variable range of rotating speed is narrow. Therefore, it may be considered that the high-speed operation range is widened using a field weakening control technology.
Further, the mechanism which uses the centrifugal force by the spring and the governor is disclosed in the Japnese Patent application Laid-open No. 2000-155262 as a method of weakening the field by the magnetic flux generated by permanent magnets.
The method of widening the high speed operation range using the field weakening control technology described above has limitations of heat generation and efficiency decrease due to weakening field current.
Further, the structure of the spring and the governor becomes complex in the method disclosed in the Japanese Patent Application No. 2000-155262.

Dynamo-electric machine having a rotor with first and second axially or rotationally displaceable field magnets


A system and method for printing includes a transfer belt configured to transfer toner from a photoconductive drum of a toner-based printer to a paper. A transfer platen positions at least a portion of the transfer belt to be in proximity to a photoconductive drum. For color printing, a transfer platen is associated with a corresponding photoconductive drum for each distinct color of toner. The transfer platen is shaped to improve the transfer of toner from the photoconductive drum to the transfer belt. The transfer platen is substantially fixed in a non-rotatable position. The transfer platen includes electrically conductive foam. The transfer platen includes a low friction conductive top layer over the electrically conductive foam.

Document processing devices include printers, copiers, scanners and e-mail gateways. More recently, devices employing two or more of these functions are found in office environments. These devices are referred to as multifunction peripherals (MFPs) or multifunction devices (MFDs). As used herein, MFP means any of the forgoing.
Toner-based print engines of MFPs utilize a transfer belt unit (TBU) as part of the printing function. Toner is selectively attracted onto one or more photoconductive drums of an electrostatic process unit (EPU) in accordance with an image to be printed. The transfer belt transfers the toner from the photoconductive drums onto the paper, after which the transferred toner is then fused by heat onto the paper and delivered to a tray for retrieval by a user.
In black and white printers, a single photoconductive drum is used, while in color printers four or more photoconductive drums are used. Each photoconductive drum successively places toner of a particular color, such as yellow, magenta, cyan, or black, onto the transfer belt in accordance with the image to be printed. After the transfer belt has passed each photoconductive drum, the transfer belt has the entire image to be printer which is then transferred to the paper and fused to the paper by heat.
In order to transfer the toner between a photoconductive drum and the transfer belt, the transfer belt is electrically charged and brought within close proximity to the photoconductive drum so that toner from the photoconductive drum is attracted to the transfer belt. To maintain positional accuracy of the transfer belt relative to the photoconductive drum, a transfer roller is placed against the transfer belt opposite to the photoconductive drum. Each transfer roller ensures that the transfer belt is close enough to the photoconductive drum to allow most, if not all, of the toner from the photoconductive drum to move onto the transfer belt.
However, transfer rollers require periodic maintenance as bearings can wear or become clogged with stray toner. Also, because each transfer roller has a fixed diameter, the placement of multiple transfer rollers in a color printer places design constraints on the printer which must accommodate all of the transfer rollers. Smaller transfer rollers can reduce design constraints. However, smaller transfer rollers have surfaces with greater arcs than larger transfer rollers. Smaller transfer rollers can reduce the area of the transfer belt that is immediately proximate to each photoconductive drum, which also has an arced surface, which can affect the effectiveness of the transfer of toner from the photoconductive drum to the transfer belt.


Magnetic material comprising magnetic iron oxide modified with at least about 0.5 weight % cobalt, based on the weight of total product which when combined with a binder at a 75% by weight loading forms a magnetic recording member having an orientation ratio and coercivity value that corresponds to a coordinate value equal to or above the coordinate values on the FIGURE and an M-factor value between about -1.0 and +1.0. The magnetic material is preferred in which the amount of cobalt present is from about 0.5 to about 5.0 weight % based on the weight of total product and in which chromium is also present in an amount of from about 0.1 to about 0.3 weight percent based on the weight of total product. A magnetic impulse record member having such a magnetic material dispersed in a binding medium is also claimed.

This invention relates to iron oxide particles useful as magnetic recording materials. In particular the invention relates to iron oxides which are surface modified with cobalt and, at times, with other metal ions such as chromium and ferrous ions.
The literature is replete with materials which are surface modified with cobalt and oftentimes with other metals such as chromium. For example, the following U.S. patents discuss such materials: U.S. Pat. Nos. 4,066,564; 4,066,565; 4,069,164; and 4,071,654. There are also references to such magnetic materials in foreign patent applications. For exaple, Japanese applications Nos. 51-38094, 51-38095, 51-38096, 52-24237, 49475/74, 44040/73 and 87397/73 all make reference to such materials.
While the above named patents and applications represent a continuum in the advance of the art of magnetic materials which are surface modified, it is the present invention which provides a cobalt modified magnetic iron oxide for magnetic recording which has a minimal degradation of orientation ratio even at relatively high cobalt levels. Such degradation usually occurs when one increases the cobalt level in order to increase the coercivity (Hc). A further object of the present invention is to provide a cobalt modified magnetic iron oxide with yet another superior characteristic which we have termed M-factor. This characteristic is related to magnetostriction and it will be fully defined further in this application.


A method for automated generation and provision of at least one client/server-based software application having a user interface for a user is provided. The method provides at least the following: an application platform, which a user can log into, at least one client-specific database in which data can be stored, at least one application model stored in the client-specific database for generating the at least one software application, which application model is used to describe the functionality of the software application, a user interface and the data structure in a machine-processable form, and a model engine on the application platform for accessing data in the client-specific database.

The present invention relates in particular to a method and to a computer-implemented device for automated generation and provision of at least one client/server-based, preferably web-based, software application having a user interface for a user.
The conventional approach to creating and providing software applications for use is based on methods and techniques in which software applications are first created by programming and then installed and put into use in an operating environment.
In this approach, software developers first define the business data structure in a specific data model (class model), design the program architecture and put or "translate" the algorithms to be used into programming language (source code). The software developers are usually assisted at each stage by software technologies, procedures and tools that simplify or partly automate the implementation of individual steps in the process.
The prior art in this field is, for example, the "Model-Driven Software Development" (MDSD)/"Model Driven Architecture" (MDA) approach, which in terms of tools is often assisted by integrated development environments (IDE) or frameworks. In Model Driven Software Development, the architecture of the application to be created and parts of the source code (class model) are generated from a model (diagram in the graphical "Unified Modeling Language" or UML diagram for short). Frameworks here provide the structure within which the programmer creates an application, i.e. frameworks usually define the application architecture, the control flow of the application and the interfaces for the specific classes, which must be created and registered by the programmer. The design patterns used in the framework are one of the factors that influence the structure of the custom application. The parts of the source code generated by the MDSD method using the IDE or the framework must still be programmed further, and source code must be added for the (graphical) user interface (GUI), the database interface and further interfaces.
After generation, further programming and adding further code, the source code must be translated into machine code by a compiler in order to make the program machine-readable and hence executable.
Likewise when there are any changes to existing software, the source code must be repeatedly regenerated, bundled into a program and transferred to the runtime environment.
Finally, the created or modified software must be installed on a computer, if necessary configured, and activated in order for the users to be able to use it.
To summarize, in conventional techniques for developing and providing client/server-based, preferably web-based, applications it is hence necessary to:                use tools first to program the source code of the application, which includes, inter alia, the commands to the processor, which controls the subsequent application program,        use tools to translate the source code into machine-readable code and to bundle/compile into an application program,        install the application program on a computer, and        use a runtime environment to launch and control the application program at runtime.
All current methods and techniques of software development and provision hence have in common that to create or modify software applications, the application logic of a software application must be defined and modeled before the source code can be translated into machine code and the resultant software application can be installed and provided for use. This process is often time-consuming and also is only possible with programming knowledge and hence normally only possible with software experts.
Greater flexibility and adaptability can be achieved by using "business rules" and/or expert systems. These can be used to control, within certain limits, the behavior of a software application at runtime, and to modify said behavior without compiling. This facility, however, is restricted to the application behavior only. It is hence not possible to control all the other elements and aspects of an application (stored data, application logic, interface). Furthermore, the flexibility that can be achieved with this facility relates solely to software applications that already exist and in which the rule-based technology is implemented. It hence cannot be used for flexible generation of entirely new applications.
For larger server-based and database-based software systems, e.g. often in company solutions, there is the additional factor that in addition to programming knowledge, there is also a need for specific IT experience for installation and launching, which requires additional IT experts.
In the various departments and administration of organizations of any size, however, which face the need for greater agility, there is an increasing demand for fast availability of software solutions for pressing tasks and problems, whether through entirely new applications or by adapting existing applications to changed requirements and circumstances. This also applies to a demand for solutions that are required only in the short term or need to be deployed only in the interim or for a specific project.
The users, however, are not normally capable of solving the technical questions associated with creating, providing and operating the applications. The current methods and technologies of software creation and provision are hence little suited in particular to organizations that must remain agile in an increasingly competitive environment.

Method and device for the automated production and provision of at least one software application


A map holder is attached to a ski pole. The map is attached to the left side of the planar material of the holder using adhesive tabs. The map is attached to the right side of the planar material of the holder using a strap. The strap is free floating in its midregion relative the planar material. The map is attached to the free floating region of the strap which allows the map to roll up free floating on its own radius.

1. Field of the Invention
The invention relates to a map holder and more particularly a map holder for attachment to a ski pole.
2. Description of the Prior Art
U.S. Pat. No. 764,301 discloses a spring map roller that allows an enclosed document or map to be rolled out like a shade for viewing. The patent fails to specifically disclose the use of a strap on a planar material backing that allows the document to roll up free floating on its own radius. The document of the patent is attached directly to the roller and is not readily replaced by a different document on a backing that supports the document in use and when rolled up.
U.S. Pat. No. 764,997 discloses a cane comprising a spring loaded roller that allows a map or document to be rolled out for viewing. This patent suffers the same deficiencies as the above patent.


A part time four wheel drive vehicle has an axle disconnect in its auxiliary drive axle. The axle disconnect has a clutch sleeve non-rotatably and translatably mounted on an inner axle shaft so that the clutch sleeve translates between a first position where clutch teeth of the clutch sleeve engage clutch teeth of an outer axle shaft and a second position where the clutch teeth disengage. The clutch sleeve includes an integral annular piston that is part of a coaxial motor that shifts the clutch sleeve from one position to the other in conjunction with a return spring. The vacuum motor communicates with an external vacuum source and the axle disconnect includes a float valve for sealing a vacuum port of the vacuum motor to protect the external vacuum source against contamination if the vacuum motor is filled with lubricant in the axle housing leaking into the vacuum motor housing.

This invention relates generally to axle disconnects for part-time four wheel drive vehicles and more particularly to vacuum operated axle disconnects.
U.S. Pat. No. 5,105,900 granted to Randy W. Adler and David Sperduti Apr. 21, 1992 discloses a part time four wheel drive vehicle that includes an axle disconnect mechanism in a front axle assembly. The axle disconnect mechanism includes a vacuum motor and a shift fork assembly. The vacuum motor communicates with a vacuum source (not shown) that is controlled by a two position solenoid valve. The fork shift assembly under control of the vacuum motor controls the axial shifting of a clutch collar between positions corresponding to coupled and uncoupled operating modes.
U.S. Pat. No. 5,102,902 granted to Robert J. Wilson and Randolph C. Williams Apr. 21, 1992 discloses the same axle disconnect mechanism.
The two systems have the common drawback of an externally mounted vacuum motor that requires considerable extra space particularly when vehicle suspension travel is taken into account. The use of an externally mounted vacuum motor also necessitates the use of a fork shift assembly which adds to the cost and complexity of the prior art arrangement exemplified by these two patents.
U.S. Pat. No. 5,123,513 granted to Harry A. Petrak Jun. 23, 1992 also discloses a part time four wheel drive vehicle that includes an axle disconnect in the front axle assembly. This axle disconnect is operated by a power shift mechanism. The power shift mechanism includes sealed envelopes in the form of expandable and contractible compartments that shift the axle disconnect into and out of engagement in response to a remote control valve. The sealed envelopes are located in the axle housing encircling a shiftable drive gear as shown in FIG. 7 of the patent. The shiftable drive gear couples and uncouples inner and outer drive shafts.
This arrangement does not require the extra space and fork shift assembly of the previous arrangement. However, this arrangement requires two sealed envelopes and several other parts operatively connecting the sealed envelopes with the shiftable drive gear. Consequently this arrangement is also complex and expensive to produce particularly when the difficulty of assembly is taken into account.


Apparatus is disclosed for determining, with improved accuracy, the back vertex power of a hydrated soft contact lens. The increased accuracy is determined by sequentially using several optical modes to provide additional information needed to accurately calculate back vertex power. Lens thickness, sagittal height and posterior radius values are also accurately obtained with the apparatus.. Optionally, a mode for determining lens radius and thickness is also disclosed.

The present invention relates to an instrument for measuring contact lens parameters and more particularly to an instrument for accurately measuring contact lenses while immersed in a solution of known refractive index, e.g., saline solution.
The soft contact lens industry, as well as doctors prescribing soft contact lenses, have been confronted with an inability to accurately determine the essential parameters of soft contact lenses after hydration. Previously, most soft contact lens parameters were determined by the industry while the lens was in the "hard" or unhydrated state. The values thus determined are subsequently converted to "expected parameters" based upon calculated changes occurring during hydration. While in the hard stage, the contact lens may be measured using conventional instruments for measuring hard contact lenses.
The practice of determining parameters of a soft contact lens by determinations made while it is in the unhydrated or "hard" stage is fraught with disadvantages. Most of these disadvantages result from unpredictable and inconsistent variations between lenses when hydrated. Since soft contact lenses rapidly lose water of hydration and are extremely flexible and susceptible to distortion when in the hydrated state, instruments for measuring hard contact lenses cannot accurately determine the parameters of a hydrated soft contact lens. For example, dial indicators which are normally used to determine the thickness of a hard contact lens or an unhydrated soft contact lens, but they compress a hydrated soft contact lens producing inaccurate results. Also the index of refraction change with the water content, and power measurements are inaccurate and unreproducible unless the soft lens is immersed.
There exist some devices for approximating the parameters of hydrated soft lenses but these are highly dependent on operator skill, the operator's ability to interpolate and the assumption that ordinary focimeters can accurately measure the power of an immersed lens.
As explained in an article by L. Wray, the Ophthalmic Optician, Apr. 1, 1972, pgs. 256, 261-264 and Apr. 15, 1972, pgs. 301-304 and 309-311, the relatively simple formula for vertex power (front and back) used for air-lens interfaces will not provide the requisite accuracy of calculated vertex power for an immersed lens. The lens thickness and the power of each surface are essential factors in accurately measuring immersed hydrated contact lenses. Without accurate values for these factors, the power computation may have an error greater than 0.5 diopter. The problems of obtaining accurate values for thickness, radii and power are also discussed in the article.
U.S. Pat. No. 3,804,523 relates to a conventional radiuscope for measuring the thickness of hydrophilic contact lenses using a special lens support. The lenses are not immersed during measurement.
U.S. Pat. No. 3,985,445 relates to an optical instrument for measuring the power of an immersed hydrophilic contact lens. Lens power is determined by a scale showing the position of a target projected along the optical axis through the lens to a reference plane in an observation system. This patent erroneously teaches the calculation of lens power using the same formula used to calculate lens power when the lens is in air. As discussed hereinabove, lens thickness and anterior surface radius are necessary for an accurate determination of lens power when the lens is measured while immersed in a liquid.
It is an object of the present invention to accurately measure the parameters of an immersed, hydrated, soft contact lens.
It is another object of the present invention to overcome the disadvantages of the prior art devices.
It is still another object of the present invention to provide a single device for accurately measuring back vertex power, thickness and posterior lens radius of hydrated soft contact lenses.

Instrument for optically measuring soft contact lens parameters


A munitions dispenser employs a plurality of launch tubes mounted in an array as a segmented dispenser assembly. Each tube in the array is configured to carry a selected munition releasably coupled in a cylindrical bore of the tube for substantially vertical release through a lower aperture. A frame, mountable to an air vehicle, carries the array of launch tubes. A skin covers the array of launch tubes with the skin and frame with the array configured for nested engagement of multiple segmented assemblies.

Field
Embodiments of the disclosure relate generally to the field of air dropped munitions and more particularly to a dispenser for vertical deployment of mortar type munitions from unmanned aerial vehicles.
Background
Armed unmanned aerial vehicles (UAVs) are currently in service. The majority carry a low number of missiles or other ordinance and are not generally used in a Close Air Support (CAS) role. Existing mortar pod munitions segments use one or more door assemblies that are opened and closed with an internal rack assembly that suspends munitions in a conventional horizontal position to be released after the doors are opened. This method to dispense munitions may add weight and cost to the dispenser.
It is therefore desirable to provide simplified dispenser mountable to a UAV for carriage and release of multiple munitions applicable to a CAS role.

Vertical drop segmented munitions dispenser


A vehicular control apparatus includes at least one electronic control unit. The at least one electronic control unit is configured to recognize a first preceding vehicle in a driving lane and to calculate a first target acceleration of the vehicle. The at least one electronic control unit is also configured to recognize a second preceding vehicle in an adjacent lane, and to calculate a second target acceleration of the vehicle. The at least one electronic control unit is configured to acquire lane change information of the vehicle, and to select the smaller of the first target acceleration and the second target acceleration as a target acceleration of the vehicle. The at least one electronic control unit is configured to control a speed of the vehicle in a lane change period by using the selected target acceleration.

1. Technical Field
The present disclosure relates to a vehicular control apparatus.
2. Description of Related Art
In Japanese Patent Application Publication No. 2003-63273 (JP 2003-63273 A), there is described a control apparatus that realizes overtaking through automatic driving during automatic speed control. The control apparatus targets a preceding vehicle (a first preceding vehicle) running in front of a vehicle in a driving lane, and causes the vehicle to follow this preceding vehicle. The control apparatus determines whether or not there is another vehicle behind and beside the vehicle in an adjacent lane in overtaking the first preceding vehicle. Then, the control apparatus stops the vehicle from overtaking the first preceding vehicle when there is another vehicle behind and beside the vehicle in the adjacent lane, and causes the vehicle to overtake the first preceding vehicle when there is no other vehicle behind and beside the vehicle in the adjacent lane.


A clamping mechanism for removably attaching a fabric to a foraminous element having generally a plank shape. A form-drain is a hollow, foraminous, plank-shaped conduit. The clamp of the invention is a semi-rigid strip of material such as polyvinylchloride. From the strip depend orthogonal projections which form, in a first model, a U-form of shallow definition; this is the "cap" model and is used to capture a fabric between it and the top surface of the form-drain. An alternate embodiment realizes the same strip with depending orthogonal studs (as projections). Projections of both embodiments include mechanisms to impede retrograde motion of the clamp once it is installed on the form-drain. In anticipation of changes to the form-drain, alternate models of the invention have been presented.

1. Field of the Invention
This invention relates generally to mechanisms that secure a fabric to a rigid object and, in particular, to a clamping mechanism that, through a mating process, removably fixes a filter fabric to a foraminous concrete form. Although incorporating the use of adhesives, in but a single instance, such are generally exchewed in the instant invention.
2. Discussion of Relevant Art
Throughout the art, numerous methods and techniques have been used to secure fabrics, of varying mesh, to objects such as frames, screens, etcs. Our patent, U.S. Pat. No. 5,466,092 discloses one such method that involves the use of adhesives. Although quite successful, there unfortunately exists the necessity of fixing form-drain filters during inclement weather, such as periods of rain/sleet. During such times, moisture accumulating on form-drain surfaces, although not constituting a major impediment, nonetheless can inhibit adhesion of the adhesive-coated margins of fabric to the form-drain. Thus, it was incumbent upon us to provide a purely physical means of securing the fabric, irrespective of enviromental conditions.
In a patent entitled: FILTER, U.S. Pat. No. 445,223, there is disclosed an elongated frame member that is defined by a U-shaped cross-section. The legs of the member are considerably longer than the base (of the U) because the member is primarily a frame element that, as an expedient, "caps" the edges of the structural backing. The underlying backing does not serve as a concrete construction form. Most significantly, the long legs, necessary for strength and rigidity, cover a goodly number of the mesh holes (Cf.,foramens); a feature we found to be unsatisfactory for our purposes.
U.S. Pat. No. 1,172,724 sets forth a C-shaped (cross-section) clamping member for securing a fabric to a bed frame. This member is a mattress feature known as piping and consists in relatively stiff metallic strips, hence "piping". Although the morphology of the clamp is more desirable for our purposes, the device at issue lacks the mating ability we desire, and achieve, between clamp and form-drain. Further, its ends are curvate, a feature we cannot tolerate with the use of the rigid, straight form-drain.
Similar in style and function to '724 is the clamp shown in U.S. Pat. No. 1,719,532. This clamp is rigid, metallic and essentially curvate, having also a U-form or cross-section. It suffers the same limitations as '724, for our purposes.
A clamping structure consisting of a flexible molding having projecting fasteners is disclosed in U.S. Pat. No. 1,221,444. A molding strip consisting of leather or other flexible materials is multiply cut or diagonally split along its length and nail fasteners are placed therein (perpendicularly) to project at right angles (orthogonally) from the strip. The splits or cuts are then cemented or otherwise resecured to the strip. The purpose of this nail-projecting article is to be self-securable (it is a molding) to another article such a baseboard, furniture, automobile bodies or the like. This could serve as a clamp of sorts, but in '444 no such suggestion is made.
Somewhat analogous to '444, U.S. Pat. No. 2,684,776 relates to a flexable strip of material that contains head-driveable fasteners, such as nails, spaced at predetermined distances by embedment in the strip, which is transparent. After the fasteners are driven, the strip is pulled free, having performed the dual function of workpiece protection (from misdirected blows) and fastener spacing. A significant distinction between the strip (molding) of '776 and our invention is that this strip cannot conceivably serve as a clamp, it merely resembles our invention in the patent drawings.
Our searches of Patent Office records and various catalogs disclosed no other relevant art. We therefore set forth, in this paper, our clamping concept that serves as an alternative to the aforementioned adhesively secured form-drain filter.
3. Incorporation by Reference
For both provision of background, as well as useful details and prior art information, our U.S. patent no. (to be provided upon issue), and previously discussed U.S. Pat. Nos. 445,223 (FIG. 1); U.S. Pat. No. 1,172,724 (FIGS. 3 and 4); U.S. Pat. No. 1,221,444 (FIGS. 1-6); U.S. Pat. No. 1,719,532 (FIGS. 4-6); and U.S. Pat. No. 2,684,776 (FIGS. 1-3 and columns 1 and 2), are hereby incorporated by reference.


A system configured to facilitate user customization of the distribution of virtual items usable in a virtual space. Virtual items may be distributed via probability item bundles. Probability item bundles may be associated with a set of potential awards. The potential awards included in the set of potential awards may be individually associated with a probability of being distributed once the probability item bundle is activated by a user. Customization of probability item bundles may comprise facilitating user selection of the potential awards included in the sets of potential awards of the probability item bundles.

Users may access virtual spaces via client computing platforms. A virtual space may include an online game taking place within the virtual space. Virtual items usable within the virtual space and/or online game taking place within the virtual space may be distributed to users through various mechanisms. Virtual items may include one or more of a virtual weapon, a tool, a food, a currency, a reward, a bonus, health, a potion, an enhancement, a mount, a power-up, a speed-up, clothing, a vehicle, an anatomical feature of a character or game entity, a troop or troop type, a pet, a virtual resource, and/or other virtual items and/or goods.
Virtual items may be distributed to users via probability item bundles offered for sale through a virtual shop interface. Probability item bundles may be associated with a set of potential awards. The potential awards included in the set of potential awards may be individually associated with a probability of being distributed (e.g., won) once the probability item bundle is activated by a user.

This patent is subject to a terminal disclaimer.


Disclosed herein is an antibody that binds to a voltage sensor paddle (VSP) of Nav1.7. Also disclosed herein are methods of treating pain, itch, neurogenic inflammation, or cough in a subject in need thereof. The methods include administrating the antibody to the subject.

Voltage-gated sodium (Nav) channels are responsible for the upstroke of the action potential in excitable cells. Nav channels contain tetrameric repeats (i.e., DI to DIV) and each repeat is composed of six transmembrane helices or segments (i.e., segments S1 to S6). The first four segments (S1-S4) comprise a voltage-sensor domain (VSD), in which segment S4 moves in response to a change in membrane potential. Particularly, segment S4 contains an arginine residue that senses the change in membrane potential, and together with the carboxy (C)-terminal half of the segment S3, forms a helix-turn (loop)-helix known as the voltage sensor paddle. The segments S5 and S6 from each tetrameric repeat D1-DIV form a pore domain when the tetrameric repeats D1-DIV are assembled together. Accordingly, the pore domain is opened, closed, and inactivated (i.e., gated) by the movement of the voltage sensor paddle in response to the change in membrane potential.
Humans possess nine highly homologous Nav channel subtypes (i.e., Nav1.1 to Nav1.9), each of which play a distinct role in various tissues, for example, neurons and myocytes to affect nerve and cardiac excitability, respectively. Dysregulation of Nav channel subtypes leads to numerous diseases including cardiac arrhythmia, epilepsy, ataxia, periodic paralysis, and pain disorder. Nav channels are the targets of various drugs, for example, anti-convulsants, local anesthetics, anti-arrhythmics, and analgesics. These drugs often bind an open-inactivated state of the Nav channel. These drugs, however, exhibit poor selectivity among the nine Nav channel subtypes, and thus, non-selective targeting of multiple Nav channel subtypes can lead to off-target effects, which in turn, lead to severe side effects (e.g., cardiac toxicity).
Accordingly, a need exists for the identification and development of new molecules that are selective for one Nav channel subtype over the other eight Nav channel subtypes. Such selectively would allow for the treatment of disease associated with a Nav channel subtype and the prevention of off-target effects that lead to unwanted and serious side effects.


A key switch and resilient actuator assembly that includes an electrical switching region and a hollow open ended actuator cover of elastomeric material overlaying the switching region with the open end of the actuator cover in surrounding relationship with the switching region. The actuator cover includes a first wall portion shaped to provide substantially linear resistive force during compression displacement of the cover toward the switching region and to provide substantially linear restoring force during expansion displacement of the actuator cover away from the switching region. The actuator cover further includes a second wall portion shaped to undergo buckling toward the switching region at a predetermined compression displacement and to undergo unbuckling away from the switching region at a predetermined expansion displacement that is smaller in total displacement than the predetermined compression displacement. The actuator cover also includes an interior portion positioned and sized to move into the switching region at the buckling of the second wall portion and to move out of the switching region at the unbuckling of the second wall portion.

This invention relates to key switching and more particularly to a resilient key switch actuator and assembly that provides a tactile feel to an operator.
Individual key switches and keyboards using them find wide use in such diverse product applications as data input terminals, typewriters, computer keyboards, cash registers, and calculators. Individual keys usually have alphanumeric characters or other symbols inscribed on them. When an operator depresses a key, its associated key switch closes a circuit. And the closed circuit provides an electric output that may be stored or that may cause performance of some operation, such as issuing a character.
It is highly desirable to provide key switches with a resilient actuator arrangement that provides a tactile feel to an operator during a key stroke. This tactile feel is established by a key switch using a resilient actuator that effects a steep drop-off in reactive or resistive force. This drop-off indicates to an operator that switch closing or triggering has been made.
At present there are three major approaches to resilient key switch actuator arrangements. The operation of these approaches is generally indicated in the three force displacement curves shown in FIGS. 1-3.
FIG. 1 shows a force displacement curve for a keyboard key switch using what is referred as a linear type actuator arrangement. As indicated in FIG. 1, reactive or resistive force increases at a particular slope from point "a" to point "b" as an operator depresses a key. At point "b" switch triggering begins. Thereafter, reactive force continues to increase with compression displacement from points "b" to "c", but at an increased slope. As the operator releases the key, restoring force of the actuator moves the actuator in expansion toward its initial position generally along the same curve, but in the opposite direction.
FIG. 2 shows a force displacement curve for a keyboard key switch using what is referred to as a tactile type actuator arrangement. As indicated in FIG. 2, reactive or restive force typically increases from point "a" to a maximum resistive force location at point "b" as an operator depresses a key. At location "b" reactive force drops-off quickly (tactile drop-off) with a small amount of displacement to provide the operator with a tactile feel. The tactile drop-off continues until switch triggering begins at point "c". Thereafter, reactive force continues to increase with compressive displacement from point "c" to point "d". As the operator begins to release the key, restoring force moves the arrangement in expansion toward its initial position generally along the same curve, but in the opposite direction.
FIG. 3 shows a force displacement curve for a keyboard key switch using what is referred to as a hysteresis type actuator arrangement, which represents the third major approach. As indicated in FIG. 3, reactive force increases in a substantially linear way from point "a" to a point of maximum reactive force at point "b" as an operator depresses a key. At point "b" reactive force plummets or vertically drops-off to point "c" with little, if any, further displacement. This precipitous tactile drop-off provides the operator with a pronounced tactile feel. And at point "c" switch triggering begins. Thereafter, reactive force increases as the operator continues compression displacement from point "c" to point "d". As the operator begins to release the key, initial expansion displacement takes place along the same curve, but in the opposite direction-that is total displacement moves from point "d" to point "c". But thereafter the return or expansion displacement path is different from the initial or compression displacement path. As indicated by the dashed lines, the return path moves past point "c" to a smaller total displacement at point "e". At point "e" there is an abrupt vertical increase in restoring force with little, if any, change in displacement. This abrupt increase is shown in dashed lines from point "e" to point "f". This places the restoring force at point "f", which is located at a lower force level on the initial path than the level of reactive force at tactile drop-off (point "b").
The phenomenon known as hysteresis, which operates along a return path different from an initial path, is the basis for a key switch closure that reduces the problem of bouncing. As shown in FIG. 3, reduced bouncing is accomplished by tactile drop-off occurring during compression displacement from point "b" to point "c", which initiates switch closure, and by abrupt increase occurring during expansion displacement from point "e" to point "f" by restoring force, which initiates switch opening.
While there has been a variety of approaches employed to improve each of the three types actuator arrangements discussed, they all still tend to have deficiencies in one aspect or an other, including such things as: mechanical breakdown of parts (such as springs), high cost of manufacture (both piece cost and assembly cost), and undesirable chattering or bouncing requiring additional "de-bouncing" techniques. Consequently, there has been a variety of efforts in the art to overcome these deficiencies. But the need continues.
Experience has shown that in most instances key switches using a hysteresis type actuator provides significant advantages over actuator arrangements using the other two approaches, particularly in tactile feel and "de-bouncing". But prior art hysteresis arrangements use both springs and cups and are plagued by the same types of deficiencies as other resilient key switch response arrangements. Consequently, hysteresis type actuators have problems and are expensive to manufacture. They can involve over two hundred parts per keyboard. And these many parts can contribute to breakdowns over the life of the product.
Accordingly, there is a need for a simple and more effective hysteresis type key switch actuator arrangement.


A method of reclaiming railroad spikes is disclosed in which the used spikes are collected and initially manually sorted to separate the bent and straight reclaimable spikes and to eliminate those damaged beyond reclaiming. The bent spikes are placed in a press and straightened, then the straight and straightened spikes are dumped into a sound insulated, sealed drum type tumbler and tumbled until clean and ready for reuse. The straightening press, tumbler, and a hoist for handling portable bins of spikes are mounted on a car moveable over railroad tracks and movement is controlled either by an operator who walks along the right of way collecting and sorting previously pulled spikes or the operator on the machine. The car is provided with a platform at its rear end for supporting the portable bins.

1. Field of the Invention
This invention relates to the reclaiming of used railroad spikes, and to an improved high speed, highly efficient method of and apparatus for reclaiming used railraod spikes by straightening and/or tumble cleaning the used spikes.
2. Description of the Prior Art
The reclaiming of used railroad spikes has, in the past, generally been limited to a manual operation employing a driven wire brush wheel or similar abrading tool to clean the spikes which were hand held during the cleaning operation. Spikes which were not too severely bent were sometimes straightened, again one at a time, by an impacting or pressing operation. Such manual reclaiming methods are very slow and hazardous to the operator. As a result, it generally has not been considered economically feasible to reclaim used railroad spikes and it has become common practice to discard the used spikes along the railroad right of way as they are pulled, or to collect them only for scrap value. As a result, power equipment currently used to pull spikes normally does not collect or save the spikes, but rather discards them onto the roadbed as they are pulled. Many millions of dollars worth of spikes are currently being scrapped or discarded annually in the United States alone.
In recent years, the cost of new railroad spikes has increased dramatically, making them an increasingly important element in the cost of track reconstruction and maintenance. Despite this, the increasing labor costs of the prior art manual reclaiming processes have been such that the used spikes have continued to be discarded. One factor in this has been the labor requirement and expense of collecting the used spikes and returning them to a central shop location for manual reclaiming before being returned to the steel or tie gang for use.
In view of the foregoing, it is a primary object of the present invention to provide an improved process of and apparatus for the high speed, efficient reclaiming of used railroad spikes.
Another object of the invention is to provide such a method and apparatus whereby used railraod spikes may be reclaimed and reused at the job site.
Another object of the invention is to provide such a method and apparatus which provides an increased salvage rate.
Another object of the invention is to provide such a method and apparatus which is substantially free of personnel hazards.

Method of reclaiming used railroad spikes


A calculator apparatus 10 includes the standard calculator mode and several other modes functions namely; a pressure-temperature conversion, a temperature-to-pressure conversion based on refrigerant, a relative humidity reading based on input of the dry bulb and wet bulb temperature; and a flow-energy rate conversion mode based upon a selected fuel meter dial and Metric or English units. In addition, a Fahrenheit-to-centigrade conversion and a centigrade-to-Fahrenheit conversion functions are incorporated. The calculator includes a keyboard 18, a microprocessor 16, a timer 26, a power source 12, a switch 14 and a display screen 22.

Furnaces and refrigeration units are relatively high maintenance units. It is important to maintain refrigeration and heating units in top condition to save on energy costs, to prolong the life of the unit, and to provide a dependable source of cooled or heated air.
Furnaces commonly need replacement because they are operated over their rated capacity. When a furnace is operating above its rated capacity, the fuel flow into the furnace is great enough to create a flame sufficiently hot to cause damage to the interior parts including the burner. Furthermore, since furnaces are commonly rated in terms of energy rate such as btu's per hour, and not fuel flow rate in cubic feet of gas, it is tedious to manually perform the equation for converting the fuel flow to consuming energy rate (referred to as the firing rate) of the unit.
Because service people who service furnaces also service refrigeration units, they also commonly carry charts that convert refrigerant pressure to a refrigerant temperature based upon the particular refrigerant and conversely convert refrigerant temperature to a refrigerant pressure. Additional charts are also used to find relative humidity based upon dry bulb and wet bulb temperatures. These charts are established from well known equations.
What is needed is a calculator apparatus that can eliminate the need for various charts. It is desirable to have a calculator apparatus that can easily calculate the conversion equations and convert fuel flow into an energy rate based upon the movement of an energy dial such that a single operator can time fuel flow and calculate the energy rate of consumption from the timed fuel flow. Furthermore, it is desired to have a calculator that converts line pressure of refrigerant into temperature and temperature into a pressure within the refrigerant line. Furthermore, it is also desirable to have the calculator able to calculate relative humidity based upon dry bulb and wet bulb temperature inputs.

Portable calculator for refrigeration heating and air conditioning equipment service


A method of making semiconductor devices comprising the steps of: preparing non-defective individual film packages having good quality, wherein leads are formed and a semiconductor chip is mounted on each of the film packages; attaching each of the non-defective individual packages to each of mounting portions of a plate; and cutting the plate into separate pieces, each of the separated pieces corresponding to each of the mounting portions on which each of the non-defective individual film packages is mounted.

1. Field of the Invention
The present invention relates to a semiconductor device, a method of fabricating the same, and an electronic apparatus.
2. Description of Related Art
In the microminiaturization of semiconductor devices, a bare chip mounting arrangement is regarded as an ideal form of assembly. However, since quality assurance and the handling of a bare chip are difficult in practice, the chip is assembled in a package during semiconductor device fabrication. As one of the package forms meeting the need for high pin counts, a ball grid array (BGA) type package has been developed recently. On a substrate of the BGA type package, external terminal bumps are arranged in an area array to permit surface mounting.
As one kind of BGA type package, a tape ball grid array (T-BGA) package in which a flexible substrate (film carrier tape) is used as a base in fabrication with a tape automated bonding (TAB) technique has been used. Using the advantageous features of the film carrier tape, a T-BGA packaging technique can provide fine-pitch, high-pin-count semiconductor devices.
Since the film carrier tape is liable to warp due to lack of rigidity, however, attaching a reinforcing sheet (stiffener) is required. In the process of semiconductor device fabrication, a stiffener is attached to an individual piece of film carrier tape punched out after each semiconductor chip is mounted on the film carrier tape. More particularly, the film carrier tape is punched out into separate pieces, the pieces are inspected, and then the stiffener is attached only to the non-defective pieces with good quality. In this manner, production yields can be increased since defective pieces of film are rejected prior to attaining the finished product.
After this process, individual pieces of film must be handled in subsequent steps such as bump formation, resulting in trouble in fabrication.
It is therefore an object of the present invention to obviate the above-mentioned drawback by providing a method of fabricating T-BGA packages which are suitable for mass-production and easy to handle, a semiconductor device fabricated by this method, and an electronic apparatus containing the semiconductor device thus fabricated.
(1) According to a first aspect of the present invention, there is provided a method of making semiconductor devices, comprising the steps of:
preparing non-defective individual film packages having good quality, wherein each of the non-defective individual film packages has a flexible substrate on which a wiring pattern is formed and a semiconductor chip having electrodes that are connected to the wiring pattern;
attaching each of the non-defective individual film packages to each of mounting regions of a reinforcing member; and
cutting the reinforcing member into separate pieces, each of the separated pieces corresponding to each of the mounting regions on which each of the non-defective individual film packages is mounted.
In this method, the reinforcing member represents any part serving to prevent a film carrier tape from warping or bowing (to ensure planarity). As a reinforcing member, a so-called stiffener is often used in the semiconductor device fabrication.
A plurality of mounting regions are provided on the reinforcing member and an individual film package is attached to each of them. Since a plurality of individual film packages forming a plurality of semiconductor devices are integrated with the reinforcing member, the subsequent steps can be carried out on a mass-production line.
Further, where each individual film package is accurately attached to each mounting region of the reinforcing member, a relative positional relation between the reinforcing member and the individual film packages is fixed, thus improving the positional accuracy.
Furthermore, the semiconductor chips are mounted on only non-defective individual film packages having good quality. Therefore, in the subsequent steps after the non-defective individual film packages with good quality are selected (more specifically in the subsequent steps after the non-defective individual film packages are attached to the reinforcing member), production yields can be increased substantially.
(2) The method of making semiconductor devices of the present invention may further comprise, before the non-defective individual film packages are prepared, the steps of:
mounting the semiconductor chip on each of predetermined areas in a film carrier tape having the wiring pattern formed on each of the predetermined areas,
punching out the film carrier tape into individual film packages, and
selecting the non-defective individual film packages having good quality from the individual film packages through inspection.
Since the TAB process is applied to this method, an existing TAB process production line may be used and the advantageous features of the TAB process can be utilized.
The method of making semiconductor devices may further comprise a step of molding a region including a connecting portion between the semiconductor chip and the film carrier tape with a resin.
(3) In the method of making semiconductor devices of the present invention, after each of the non-defective individual film packages is attached to each of the mounting regions of the reinforcing member, the subsequent steps may be carried out on a production line for plastic ball grid array (P-BGA) type packages.
On the P-BGA package production line, such processes as marking, ball (bump) formation, cleaning, separation into product pieces and appearance inspection can be carried out.
The P-BGA package is fabricated on the base of a printed circuit board. A plurality of semiconductor chips are mounted on the printed circuit board, and then the printed circuit board is punched out into separate product pieces, each of which corresponds to each semiconductor chip.
The method of the present invention can utilize the P-BGA package production line by using the reinforcing member having a plurality of individual film packages attached thereon in lieu of the printed circuit board. Thus, when an existing production line for P-BGA packages is available, no investment in new facilities is required thereby reducing manufacturing cost.
(4) The method of making semiconductor devices of the present invention may further comprise the step of forming external electrodes on the wiring pattern, after the step of attaching each of the non-defective individual film packages to each of the mounting regions of the reinforcing member, and before the step of cutting the reinforcing member.
Before the reinforcing member is cut into pieces, the plurality of non-defective individual film packages are attached thereon. Since external electrodes are formed in this time, the external electrodes can be formed on the plurality of non-defective individual film packages simultaneously or in succession, thus reducing fabrication time.
(5) In the method of making semiconductor devices of the present invention, a slot may be formed along a cutting line for the reinforcing member so as to enclose each of the mounting regions that is supported only by at least one supporting portion; and the step of cutting the reinforcing member may be carried out by cutting the supporting portion.
Since only the supporting portion is cut, a reinforcing member made of a rigid material could be easily cut. Further, deformation of the mounting region of the reinforcing member can be prevented to ensure planarity of the individual film packages attached thereon.
(6) The method of making semiconductor devices of the present invention may further comprise, after the step of attaching each of the non-defective individual film packages to each of the mounting regions of the reinforcing member, and before the step of cutting the reinforcing member, the step of attaching a heat spreading member to a region including the semiconductor chip.
The heat spreading member is used to efficiently dissipate heat from the semiconductor chip, and it is attached to the semiconductor chip as required depending on the amount of heat to be produced. Before the reinforcing member is cut into separate pieces, a plurality of semiconductor chips are attached thereon. It is therefore possible to attach a plurality of heat spreading members to the semiconductor chips simultaneously.
(7) In the method of making semiconductor devices of the present invention, an edge portion of the heat spreading member may be disposed inside the cutting line for the reinforcing member; and in the step of cutting the reinforcing member, both sides of the reinforcing member may be clamped by a pair of holding members at the position that is outside the heat spreading member and inside the cutting line for the reinforcing member, enabling the shear force to be applied to the reinforcing member to be cut at the position that is outside the holding members.
Since the vicinity of the cutting line for the reinforcing member is held by the holding members, the reinforcing member can be prevented from being distorted at the cutting. Therefore, the planarity of the individual film packages can be ensured, resulting in satisfactory mounting of external electrodes.
(8) In the method of making semiconductor devices of the present invention, when a slot is formed along a cutting line for the reinforcing member so as to enclose each of the mounting regions that is supported only by at least one supporting portion,
an outline of the heat spreading member may be approximately aligned with an edge of the slot on the side of each of the mounting regions, the heat spreading member being disposed inside a connecting portion in each of the mounting regions connecting with the supporting portion; and
in the step of cutting the reinforcing member, both sides of the reinforcing member may be clamped by a pair of holding members at the position that is outside the heat spreading member and inside a cutting line for the supporting portion, enabling the shear force to be applied to the supporting portion at the position that is outside the holding members.
Since the vicinity of the cutting line for the supporting portion of the reinforcing member is held by the holding members, the reinforcing member can be prevented from being distorted at the cutting.
(9) In the method of making semiconductor devices of the present invention, when a slot is formed along a cutting line for the reinforcing member so as to enclose each of the mounting regions that is supported only by at least one supporting portion,
the heat spreading member may be superposed on-the reinforcing member and have a planar configuration to cover the slot, each of the mounting regions, and the supporting portion of the reinforcing member; and the heat spreading member may be cut together with the reinforcing member.
A plurality of semiconductor chips are mounted on the reinforcing member. By superposing the heat spreading member having a planar configuration on the reinforcing member, the heat spreading members can be attached to a plurality of semiconductor chips simultaneously. Thus, the time required for aligning and attaching the heat spreading member can be reduced.
(10) In the method of making semiconductor devices of the present invention, the heat spreading member and the reinforcing member may be provided with convex and concave portions to be engaged mutually. The heat spreading member and the reinforcing member can be thus aligned with ease.
(11) According to a second aspect of the present invention, there is provided a semiconductor device fabricated by using the abovementioned method.
(12) According to a third aspect of the present invention, there is provided a circuit board on which is mounted the abovementioned semiconductor device.
(13) According to a fourth aspect of the present invention, there is provided an electronic apparatus including the abovementioned circuit board.

Method of making semiconductor devices, semiconductor device, circuit board, and electronic apparatus


An ethylene copolymer composition comprising an ethylene/.alpha.-olefin copolymer [A-I] which has a density, a melt flow rate (MFR), an amount of a n-decane-soluble portion in the specific ranges and whose melt tension (MT) at 190.degree. C. and MFR satisfy the relation MT>2.2.times.MFR.sup.-0.84 and one (co)polymer selected from the group consisting of [B-1] a low-density polyethylene obtained by high-pressure radical polymerization, [B-2] a crystalline polyolefin and [B-3] an olefin type elastomer. Also disclosed is an ethylene copolymer composition comprising an ethylene/.alpha.-olefin copolymer composition and the low-density polyethylene [B-1] obtained by high-pressure radical polymerization, said ethylene/.alpha.-olefin copolymer composition comprising ethylene/.alpha.-olefin copolymers [A-2] and [A-3] both having physical properties similar to those of the above ethylene/.alpha.-olefin copolymer [A-1] and having intrinsic viscosities different from each other. Further disclosed is an ethylene copolymer composition comprising an ethylene/.alpha.-olefin copolymer [A-4] which has a density, a melt flow rate (MFR), a weight of a n-decane-soluble portion in the specific ranges and whose melt tension (MT) at 190.degree. C. and MFR satisfy the relation MT<2.2.times.MFR.sup.-0.84, and one (co)polymer selected from the above group consisting of [B-1], [B-2] and [B-3]. Still further disclosed is an ethylene copolymer composition comprising an ethylene/.alpha.-olefin copolymer composition and a low-density polyethylene [B-4] obtained by high-pressure radical polymerization, said ethylene/.alpha.-olefin copolymer composition comprising ethylene/.alpha.-olefin copolymers [A-5] and [A-6] both having physical properties similar to those of the above ethylene/.alpha.-olefin copolymer [A-4] and having intrinsic viscosities different from each other. The ethylene copolymer compositions of the invention are excellent in heat stability and moldability, and able to form films of high transparency, high mechanical strength and anti-blocking resistance.

Ethylene copolymers have heretofore been molded by various molding methods, and used in many fields. The requirement for the characteristics of the ethylene copolymers differs depending on the molding methods and uses. For example, when an inflation film is molded at a high speed, it is necessary to select an ethylene copolymer having a high melt tension compared with its molecular weight in order to stably conduct high speed molding without fluctuation or tearing of bubbles. An ethylene copolymer is required to have similar characteristics in order to prevent sag or tearing in blow molding, or to suppress width shortage to the minimum range in T-die molding.
Further, in extrusion molding, it is important to have small stress under high shearing during extrusion in order to improve quality of molded article and reduce electric power consumption at molding.
On the other hand, Japanese Patent L-O-P Nos. 90810/1981 and 106806/1985 propose a method for improving moldability by improving the melt tension and blow ratio (die/swell ratio) of ethylene polymers obtained by using Ziegler type catalysts, especially a titanium type catalyst.
The ethylene polymers obtained by using a titanium catalyst, however, especially the low density ethylene polymers generally have problems such as their broad composition distribution and stickiness of their molded articles such as films.
Of the ethylene polymers prepared by using the Ziegler type catalysts, those obtained by using chromium type catalysts are relatively excellent in melt tension but has a defect of poor heat stability. This is thought to be caused by that the chain terminals of the ethylene polymers prepared by using the chromium type catalysts tend to become unsaturated bonds.
It is known that the ethylene polymers obtained by using a metallocene catalyst from among the Ziegler type catalysts have merits such as a narrow composition distribution and a low stickiness of their molded articles such as films. However, it is described in, for example Japanese Patent L-O-P. No. 35007/1985, that an ethylene polymer obtained by using a zirconocene compound formed from a cyclopentadienyl derivative contains one terminal unsaturated bond per molecule, and hence this ethylene polymer is presumably poor in heat stability similarly to the above-mentioned ethylene polymer obtained by using the chromium type catalyst. Further, because of its narrow composition distribution, this ethylene polymer might show poor flowability during the extrusion molding.
Accordingly, the advent of ethylene polymers having a small stress under the high-shear region, a good heat stability, a high mechanical strength and a narrow composition distribution will industrially be of great value.
The present inventors have earnestly studied in the light of the circumstances as described above. As a result, they have found that the ethylene/.alpha.-olefin copolymer obtained by copolymerizing ethylene with an .alpha.-olefin of 3 to 20 carbon atoms in the presence of a specific catalyst for olefin polymerization has a density, a melt flow rate (MFR), a temperature (Tm) at which its endothermic curve measured by a differential scanning calorimeter (DSC) shows the maximum peak, a flow index (FI) and an amount of a decane-soluble portion in the specific ranges, and the melt tension (MT) at 190.degree. C. and the melt flow rate (MFR) satisfy the relation MT>2.2.times.MFR.sup.-0.84. The present inventors have also found that such an ethylene/.alpha.-olefin copolymer [A-1] as mentioned above is excellent in melt tension and heat stability and has a narrow composition distribution. However, the ethylene/.alpha.-olefin copolymer [A-1] is not always well-balanced between the melt tension and the flowability, so that a problem sometimes occurs when the copolymer is subjected to extrusion molding to form a film.
The present inventors have further studied and found that the following ethylene copolymer compositions (1) to (4) are excellent in heat stability, melt tension and flowability under the high-shear region, and films obtained from these compositions are excellent in transparency, mechanical strength and blocking resistance.
(1) An ethylene copolymer composition comprising the aforesaid ethylene/.alpha.-olefin copolymer [A-1] and a specific low-density polyethylene [B-1] obtained by high-pressure radical polymerization.
(2) An ethylene copolymer composition comprising the aforesaid ethylene/.alpha.-olefin copolymer [A-1] and a specific crystalline polyolefin [B-2].
(3) An ethylene copolymer composition comprising the aforesaid ethylene/.alpha.-olefin copolymer [A-1] and a specific olefin type elastomer [B-3].
(4) An ethylene copolymer composition comprising an ethylene/.alpha.-olefin copolymer composition and a specific low-density polyethylene [B-1] obtained by high-pressure radical polymerization, said ethylene/.alpha.-olefin copolymer composition comprising an ethylene/.alpha.-olefin copolymer [A-2] having physical properties similar to those of the aforesaid ethylene/.alpha.-olefin copolymer [A-1] and an intrinsic viscosity [.eta.] in the specific range and an ethylene/.alpha.-olefin copolymer [A-3] having physical properties similar to those of the aforesaid ethylene/.alpha.-olefin copolymer [A-1] and an intrinsic viscosity [.eta.] in the specific range.
Further, the present inventors have found that an ethylene/.alpha.-olefin copolymer [A-4] obtained by copolymerizing ethylene with an .alpha.-olefin of 3 to 20 carbon atoms in the presence of a specific olefin polymerization catalyst which is different from the aforementioned olefin polymerization catalyst has a density, a melt flow rate (MFR), a temperature (Tm) at which its endothermic curve measured by a differential scanning calorimeter (DSC) shows the maximum peak and an amount of its decane-soluble portion in the specific ranges, and the melt tension (MT) at 190.degree. C. and the melt flow rate (MFR) satisfy the relation MT.ltoreq.2.2.times.MFR.sup.-0.84. The present inventors have also found that this ethylene/.alpha.-olefin copolymer [A-4] is excellent in heat stability and has a narrow composition distribution.
As the result of further studies, the present inventors have found that the following ethylene copolymer compositions (5) to (8) are excellent in heat stability and melt tension, and films obtained from these compositions are excellent in transparency, mechanical strength and blocking resistance.
(5) An ethylene copolymer composition comprising the above-mentioned ethylene/.alpha.-olefin copolymer [A-4] and a specific low-density polyethylene [B-4] obtained by high-pressure radical polymerization.
(6) An ethylene copolymer composition comprising the above-mentioned ethylene/.alpha.-olefin copolymer [A-4] and a specific crystalline polyolefin [B-2].
(7) An ethylene copolymer composition comprising the above-mentioned ethylene/.alpha.-olefin copolymer [A-4] and a specific olefin type elastomer [B-3].
(8) An ethylene copolymer composition comprising an ethylene/.alpha.-olefin copolymer composition and a specific low-density polyethylene [B-4] obtained by high-pressure radical polymerization, said ethylene/.alpha.-olefin copolymer composition comprising an ethylene/.alpha.-olefin copolymer [A-5] having physical properties similar to those of the above-mentioned ethylene/.alpha.-olefin copolymer [A-4] and an intrinsic viscosity [.eta.] in the specific range and an ethylene/.alpha.-olefin copolymer [A-6] having physical properties similar to those of the above-mentioned ethylene/.alpha.-olefin copolymer [A-4] and an intrinsic viscosity [.eta.] in the specific range.
Thus, the present inventors have accomplished the invention.


A method for manufacturing a micromechanical component having a substrate and having a cap connected to the substrate and enclosing with the substrate a first cavity is provided, a first pressure existing, and a first gas mixture having a first chemical composition being enclosed, in the first cavity, in a first method step an access opening that connects the first cavity to an environment of the micromechanical component being constituted in the substrate or in the cap, in a second method step the first pressure and/or the first chemical composition being established in the first cavity, in a third method step the access opening being sealed with the aid of a laser by the introduction of energy or heat into an absorbing portion of the substrate or of the cap, the introduction of energy or heat being controlled by spatial displacement of a laser beam along a path proceeding substantially parallel to a surface, facing away from the first cavity, of the substrate or of the cap.

In PCT Published Patent Application No. WO 2015/120939 A1, if a specific internal pressure in a cavity of a micromechanical component is desired, or if a gas mixture having a specific chemical composition is to be enclosed in the cavity, the internal pressure or the chemical composition is then often established upon capping of the micromechanical component or in the context of the bonding operation between a substrate wafer and a cap wafer. Upon capping, for example, a cap is connected to a substrate with the result that the cap and the substrate together enclose the cavity. The specific internal pressure and/or specific chemical composition in the cavity can thus be established by establishing the atmosphere or pressure, and/or the chemical composition, of the gas mixture present in the environment upon capping.
With the method known from PCT Published Patent Application No. WO 2015/120939 A1, an internal pressure in a cavity of a micromechanical component can be established in targeted fashion. It is possible with this method, in particular, to manufacture a micromechanical component having a first cavity, such that in the first cavity a first pressure and a first chemical composition, which differ at the time of capping from a second pressure and a second chemical composition, can be established in the first cavity.
In the method according to PCT Published Patent Application No. WO 2015/120939 A1 for targeted establishment of an internal pressure in a cavity of a micromechanical component, a narrow access channel to the cavity is generated respectively in the cap or in the cap wafer, or in the substrate or substrate wafer. The cavity is then flooded with the desired gas and the desired internal pressure via the access channel. Lastly, the region around the access channel is locally heated with the aid of a laser, and the substrate material locally liquefies and hermetically seals the access channel upon solidification.

Laser beam deflection for targeted energy deposition


A suction braking apparatus for the braking and overlapping of sheets coming from a duplex crosscutter is provided which has a single suction chamber and can be quickly changed over to accommodate sheets of a different width. The suction chamber is provided with two groups of suction holes arranged in a row in the direction of travel of the sheets and has cover plates perforated in register therewith and each has a perforated control belt. Each group of suction holes has associated therewith a cover slide which is movable at a right angle to the direction of sheet travel with the two cover slides reciprocally covering a group of suction holes, starting from one of the two side edges and up to a junction extending in the direction of sheet travel.

The invention relates to a suction braking apparatus for the braking and overlapping of sheets to be stacked, particularly sheets of paper, which comprises a suction chamber provided with suction holes, a cover plate perforated in register therewith, and at least one perforated control belt movable between cover plate and suction chamber at right angles to the direction of travel of the sheets. A suction braking apparatus of this type has become part of the prior art through German Pat. No. 1,917,616 and German patent of addition No. 2,000,078.


A method of manufacture of an integrated circuit packaging system includes: forming a first level contact on a first external connection level; forming a second level contact on a second external connection level next to the first external connection level; attaching a device adjacent the first level contact and the second level contact; attaching a first level device connector to the first level contact and the device; attaching a second level device connector to the second level contact and the device; and forming an encapsulant over the first level contact, the second level contact, the first level device connector, and the second level device connector.

Integrated circuit devices have pervaded virtually all aspects of modern life. From cell phones to equipment for manufacturing airplanes, integrated circuit devices improve processes and machines that are often take for granted.
The demands for electronic devices with integrated circuits increasingly require more functions with faster response in reduced dimensions and at lower prices. These high performance devices often demand all of lighter, faster, smaller, multi-functional, highly reliable, and lower cost.
In efforts to meet such requirements, improvements have been attempted in many aspects of electronic product development such as producing smaller and less expensive semiconductor chips. Unfortunately, this development is still not enough to satisfy the demands. Every aspect including packaging can contribute.
A commonly used integrated circuit or semiconductor device methodology for packaging uses a substrate for the semiconductor chips. The substrate or "board" provides a connection pattern of input and output elements such as contacts, leads, or other electrodes connecting the integrated circuit.
Numerous technologies have been developed to meet these requirements. Some research and development focused on new package technologies while others focused on improving existing and mature package technologies. Research and development in package technologies may include a seemingly endless number of different approaches.
One proven way to reduce cost is to use package technologies with existing manufacturing methods and equipments. Paradoxically, the reuse of existing manufacturing processes does not typically result in the reduction of package size. Existing packaging technologies struggle to cost effectively meet demands of today's integrated circuit packages.
Of course, the requirement of additional material including the substrate undesirably increases the thickness and cost of fabricating the package. Moreover, the use of an additional substrate material may undesirably increase the manufacturing cycle time, which can also increase cost.
Despite the advantages of recent developments in semiconductor fabrication and packaging techniques, there is a continuing need for improving electronic device size, performance, reliability, and manufacturing.
Thus, a need still remains for an integrated circuit packaging system with improved manufacturing processes and materials. In view of the ever-increasing commercial competitive pressures, along with growing consumer expectations and the diminishing opportunities for meaningful product differentiation in the marketplace, it is critical that answers be found for these problems. Additionally, the need to reduce costs, improve efficiencies and performance, and meet competitive pressures, adds an even greater urgency to the critical necessity for finding answers to these problems.
Solutions to these problems have been long sought but prior developments have not taught or suggested any solutions and, thus, solutions to these problems have long eluded those skilled in the art.

Integrated circuit packaging system with multi level contact and method of manufacture thereof