Apparatus for blanking and collating a plurality of individual pyrolyzable sheets having electrical circuit patterns formed thereon from an integral pyrolyzable sheet having the electrical circuit patterns for the individual sheets printed thereon, where the individual pyrolyzable sheets comprise layers of a hybrid module. The apparatus includes a die having substantially identically sized openings for supporting the integral printed pyrolyzable sheet, a punch assembly engageable with the die for blanking the integral printed pyrolyzable sheet into a plurality of substantially identically sized sheets having electrical circuit patterns formed thereon, and a collation structure located beneath the means for receiving the blanked sheets from the die and for stacking the blanked sheets.

The subject invention is generally directed to the manufacture of unitized multilayer circuit structures, and is directed more particularly to a blanking and collating structure which blanks a plurality of substrate layers from a substrate tape and stacks the separated layers in preparation for lamination and firing.
Hybrid multilayer circuit structures, also known as hybrid microcircuits, implement the interconnection and packaging of discrete circuit devices, and generally include a unitized multilayer circuit structure formed from a plurality of integrally fused insulating layers (e.g., ceramic layers) having conductor traces disposed therebetween. The discrete circuit devices (e.g., integrated circuits) are commonly mounted on the top insulating layer so as not to be covered by another insulating layer or on an insulating layer having die cutouts formed thereon to provide cavities for the discrete devices. Passive components such as capacitors and resistors can be formed on the same layer that supports the discrete devices, for example, by thick film processes, or they can be formed between the insulating layers, for example, also by thick film processes. Electrical interconnection of the conductors and components on the different layers is achieved with vias or holes appropriately located and formed in the insulating layers and filled with conductive material, whereby the conductive material in contact with predetermined conductive traces between the layers that extend over or under the vias.
Unitized multilayer circuit structures are commonly made pursuant to co-fired technology wherein a unitized multilayer circuit module is made from layers of pyrolyzable dielectric tape (comprising for example a ceramic material) known in the art as "green tape". Generally, each of the green tape layers of a particular module is punched and screen printed to include a predetermined pattern of conductive vias, interconnecting conductive traces, and electrical components such as resistors and capacitors, or portions of capacitors. The individual screen printed green tape layers for a module are then stacked in the required order, and laminated together using a chosen temperature and pressure. The laminated structure is then fired at an elevated temperature. Such co-fired technology has been implemented with low temperature co-fired ceramic (LTCC) as well as with high temperature co-fired ceramic (HTCC).
Examples of low temperature co-fired processing can be found in "Development of a Low Temperature Co-fired Multilayer Ceramic Technology," by William A. Vitriol et al., 1983 ISHM Proceedings, pages 593-598; "Processing and Reliability of Resistors Incorporated Within Low Temperature Co-fired Ceramic Structures," by Ramona G. Pond et al., 1986 ISHM Proceedings, pages 461-472; and "Low Temperature Co-Fireable Ceramics with Co-Fired Resistors," by H. T. Sawhill et al., 1986 ISHM Proceedings, pages 268-271.
In both low temperature and high temperature co-fired technologies, the individual green tape layers for a hybrid module are blanked (i.e., cut) from a larger sheet or strip of unfired green tape, and then collated in the appropriate sequence. Known techniques for blanking and collating have included the use of hand pick and place equipment and robotic equipment. Such equipment is slow and costly, and moreover can process only one hybrid module at a time.

HTCC/LTCC substrate blanker/multi-layer collation die


A process is disclosed for the preparation of (.+-.)-6-cyano-3,4-dihydro-2,2-dimethyl-trans-4-(2-oxo-1-pyrrol idino)-2H-1-benzopyran-3-ol of the Formula (VI) ##STR1## from 4-cyanophenol of the Formula (I) ##STR2## which comprises reacting 4-cyanophenol of the Formula (I) with isoprene, followed with bromination and dehydrobromination steps with formation of intermediates to react with 2-pyrrolidone resulting in obtaining the compound of the Formula (VI).

Kromakalim is an anti-hypertensive composition of novel acting mechanism. It belongs to the peripheral group of anti-hypertensive agents, it acts by opening the potassium channels in the smooth muscle cells and it thereby prevents the accumulation of electric potential through the membranes. Accordingly it belongs to the potassium channel activators [Drugs of the Future II, 175 (1986), 12, 284 (1987), 13, 269 (1988), 14, 276 (1989)].
Several independent methods are known for the preparation of Kromakalim and analogues thereof: J. M. Evans et al.: J. Med. Chem. 26, 1582 (1983), J. M. Evans et al.: J. Med. Chem. 27, 1127 (1984), V. A. Ashwood et al.:J. Med. Chem. 29, 2194 (1986), EPO 0 009 912, EPO 0 046 652, EPO 0 076 075, EPO 0 093 535, EPO 0 120 426, EPO 0 120 427, EPO 0 120 428, EPO 0 126 311, EPO 0 126 350, EPO 0 126 367, EPO 0 138 134, EPO 0 173 848, EPO 0 271 271, EPO 0 274 821, EPO 0 277 611, EPO 0 286 975, PCT WO 85 00602, PCT WO 85 01290, PCT WO 88 00822.
According to EPO 0 076 075 describing the possibilities for preparing Kromakalim 4-cyano-phenol of the formula (I) ##STR4## is reacted with 3-chloro-3-methyl-butyne resulting in propargyl-ether of the formula (IX) ##STR5## which is then subjected to ring closure to produce 6-cyano-2,2-dimethyl-2H-1-benzopyran of the formula (III) ##STR6## The compound of the formula (III) is then converted through 6-cyano-trans-3-bromo-3,4-dihydro-2,2-dimethyl-2H-1-benzopyran-4-ol to 6-cyano-3,4-dihydro-3,4-epoxy-2,2-dimethyl-2H-1-benzopyran of the formula (V). ##STR7## From the compound of the formula (V) the end-product of the formula (VI) can be obtained by three independent routes.
1. The compound of the Formula (V) is reacted with ammonia to produce 6-cyano-3,4-dihydro-2,2-dimethyl-trans-4-amino-2H-1-benzopyran-3-ol of the formula (VII) ##STR8## which is then reacted with 4-chloro-butyric acid chloride to produce a compound of the formula (VIII) ##STR9## and this is then subjected to ring closure in a sodium-hydride-tetrahydrofuran system.
2. The compound of the formula (V) is reacted with 4-amino-butyric acid in a sodium-hydrogen-carbonate-ethanol system, and the ring closure results in the end-product of the formula (VI).
3. The compound of the formula (V) is reacted with 2-pyrrolidone in the presence of sodium hydride and dimethylsulfoxide and the end-product of the formula (VI) is obtained.
When reproducing the working examples of EPO 0 076 075 we observed the following circumstances:
4-cyano-phenol reacts with 3-chloro-3-methyl-butyne in the presence of sodium hydroxide-benzyl-trimethyl-ammonium-hydroxide-water and dichloro-butane at room temperature within 5-6 days, according to the patent specification propargyl-ether of the formula (IX) can be obtained with a yield of 69%. The reaction was repeated several times but only a 46-50% yield could be achieved. The reaction was carried out in acetone, dimethyl-sulfoxide, N,N-dimethyl-formamide solvent in the presence of potassium-carbonate and potassium-iodide at 50.degree.-150.degree. C., and after 30-40 hours reaction only 40-55% yield could be achieved. The further problem is that only 3-hydroxy-3-methyl-butyne is commercially available and according to our experiences 3-chloro-3-methyl-butyne can be prepared from this compound with a yield of only 55-60% by a difficult reaction. 3-chloro-3-methyl-butyne is a compound of poor stability; it decomposes upon standing and at the same time it polymerizes during the alkylation reaction or it decomposes at higher temperature. It can be said that the reaction of 4-cyano-phenol of the formula (I) and 3-chloro-3-methyl-butyne results in propargyl-ether of the formula (IX) with a yield of only 45-55%, and this is then subjected to ring-closure in ortho-dichloro-benzene to 6-cyano-2,2-dimethyl-2H-1-benzopyran of the formula (III) with a yield of 80% according to EPO 0 076 075. According to our own experimental experience the reaction can be carried out with a yield of at most 70% and the purification of the product of the formula (III) is a complicated procedure and can be performed by vacuum distillation or column chromatography. By this reaction the chromene derivatives of the formula (III) can be obtained with a yield of 35% related to 4-cyano-phenol of the formula (I) and with a yield of 23% related to 3-chloro-3-methyl-butyne.
3-bromo-4-hydroxy-derivatives of the formula (IV) ##STR10## could be prepared from the chromene of the formula (III) in a system of dimethyl-sulfoxide and water with a yield of 90% according to EPO 0 076 075. Similarly, epoxide of the formula (V) could be obtained by a yield of 90% by reacting 3-bromo-4-hydroxy-derivative of the formula (IV) with sodium-hydroxide in the presence of a solvent mixture of dioxane and water that is the conversion of (III).fwdarw.(IV).fwdarw.(V) could be reproduced. PA1 The preparation of the end-product of the formula (VI) was carried out by a way which seemed to be the most simple method, that is epoxide of the formula (V) was reacted with 3-pyrrolidone in the presence of sodium-hydride and dimethyl-sulfoxide. As to our surprise a rather complex reaction mixture was obtained and by thin layer chromatography 6-8 components could be detected the amount of which was commeasurable. The reaction was repeated several times, and the end-product of the formula (VI) could be prepared with a yield of 20-25% only by the complicated column chromatography as opposed to the yield of 60% in the disclosure. PA1 4-cyano-phenol of the formula (I) reacts unambiguously with isoprene with an almost quantitative yield, PA1 isoprene is an inexpensive, easily available industrial intermediate product, PA1 chromene of the formula (III) can be obtained with unambiguous reactions with a good yield, and thereby purified by crystallization (as opposed to the vacuum distillation disclosed in EPO 0 076 075), PA1 epoxide of the formula (V) can be obtained according to our invention in high purity in a crystalline form, PA1 end-product of the formula (VI) can be obtained under mild reaction conditions (there is no need to use the expensive sodium-hydride and dimethyl-sulfoxide which is dangerous for the environment and which can only be handled with difficulty, PA1 the purification of the product and the working up of the reaction mixture is simple, PA1 the solvents used can be recovered by distillation and can be recycled, PA1 the reaction can be easily handled and their size can be increased, PA1 industrial production does not need special equipment and the reactions can be carried out in conventional industrial equipment.
According to the procedure disclosed in the EPO 0 076 075 the end-product of the formula (VI) could be prepared only by a yield of 22-26% related to 4-cyano-phenol of the formula (I) and the procedure when reproduced by our own experiments could be carried out with a yield of only 6-8%.
Accordingly, the procedures disclosed in EPO 0 076 075 are not suitable for the industrial preparation of Kromakalim of the formula (VI).

Process for the preparation of anti-hypertensive benzopyran


An oxide etching process, particular useful for selectively etching oxide over a feature having a non-oxide composition, such as silicon nitride and especially when that feature has a corner that is prone to faceting during the oxide etch. The invention uses one of three unsaturated 3- and 4-carbon fluorocarbons, specifically hexafluorobutadiene (C.sub.4 F.sub.6), pentafluoropropylene (C.sub.3 HF.sub.5), and trifluoropropyne (C.sub.3 HF.sub.3), all of which have boiling points below 10.degree. C. and are commercially available. The unsaturated hydrofluorocarbon together with argon is excited into a high-density plasma in a reactor which inductively couples plasma source power into the chamber and RF biases the pedestal electrode supporting the wafer. Preferably, a two-step etch is used process is used in which the above etching gas is used in the main step to provide a good vertical profile and a more strongly polymerizing fluorocarbon such as difluoromethane (CH.sub.2 F.sub.2) is added in the over etch to protect the nitride corner.

In the fabrication of silicon integrated circuits, the continuing increase in the number of devices on a chip and the accompanying decrease in the minimum feature sizes have placed increasingly difficult demands upon many of the many fabrication steps used in their fabrication including depositing layers of different materials onto sometimes difficult topologies and etching further features within those layers.
Oxide etching has presented some of the most difficult challenges. Oxide is a somewhat generic term used for silica, particularly silicon dioxide (SiO.sub.2) although slightly non-stoichiometric compositions SiO.sub.x are also included, as is well known. The term oxide also covers closely related materials, such as oxide glasses including borophosphosilicate glass (BPSG). Some forms of silicon oxynitride are considered to more closely resemble a nitride than an oxide. Small fractions of dopants such as fluorine or carbon may be added to the silica to reduce its dielectric constant. Oxide materials are principally used for electrically insulating layers, often between different levels of the integrated circuit. Because of the limits set by dielectric breakdown, the thickness of the oxide layers cannot be reduced to much below 0.5 to 1 .mu.m. However, the minimum feature sizes of contact and via holes penetrating the oxide layer are being pushed to well below 0.5 .mu.m. The result is that the holes etched in the oxide must be highly anisotropic and must have high aspect ratios, defined as the depth to the minimum width of a hole. A further problem arises from the fact that the underlying silicon may be formed with active doped regions of thicknesses substantially less than the depth of the etched hole (the oxide thickness). Due to manufacturing variables, it has become impossible to precisely time a non-selective oxide etch to completely etch through the silicon oxide without a substantial probability of also etching through the underlying active silicon region.
The anisotropy can be achieved in dry plasma etching in which an etching gas, usually a fluorocarbon, is electrically excited into a plasma. The plasma conditions may be adjusted to produce highly anisotropic etching in many materials. However, the anisotropy should not be achieved by operating the plasma reactor in a pure sputtering mode in which the plasma ejects particles toward the wafer with sufficiently high energy that they sputter the oxide. Sputtering is generally non-selective, and high-energy sputtering also seriously degrades semiconducting silicon exposed at the bottom of the etched contact hole.
In view of these and other problems, selective etching processes have been developed which depend more upon chemical effects. These processes are often described as reactive ion etching (RIE). A sufficiently high degree of selectivity allows new structures to be fabricated without the need for precise lithography for each level.
An example of such an advanced structure is a self-aligned contact (SAC), illustrated in the cross-sectional view of FIG. 1. A SAC structure for two transistors is formed on a silicon substrate 2. A polysilicon gate layer 4, a tungsten silicide barrier and glue layer 6, and a silicon nitride cap layer 8 are deposited and photolithographically formed into two closely spaced gate structures 10 having a gap 12 therebetween. Chemical vapor deposition is then used to deposit onto the wafer a substantially conformal layer 14 of silicon nitride (Si.sub.3 N.sub.4), which coats the top and sides of the gate structures 10 as well as the bottom 15 of the gap 12. In practice, the nitride deviates from the indicated stoichiometry and may have a composition of SiN.sub.x, where x is between 1 and 1.5. The nitride acts as an electrical insulator. Dopant ions are ion implanted using the gate structures 10 as a mask to form a self-aligned p-type or n-type well 16, which acts as a common source for the two transistors having respective gates 10. The drain structures of the transistors are not illustrated.
An oxide field layer 18 is deposited over this previously defined structure, and a photoresist layer 20 is deposited over the oxide layer 18 and photographically defined into a mask so that a subsequent oxide etching step etches a contact hole 22 through the oxide layer 18 and stops on the portion 24 of the nitride layer 14 underlying the hole 22. It is called a contact hole because the metal subsequently deposited into the contact hole 22 contacts silicon rather than a metal layer. A post-etch sputter removes the nitride portion 24 at the bottom 15 of the gap 12. The silicon nitride acts as an electrical insulator for the metal, usually aluminum, thereafter filled into the contact hole 22.
Because the nitride acts as an insulator, the SAC structure and process offer the advantage that the contact hole 22 may be wider than the width of the gap 12 between the gate structures 10. Additionally, the photolithographic registry of the contact hole 22 with the gate structures 10 need not be precise. However, to achieve these beneficial effects, the SAC oxide etch must be highly selective to nitride. That is, the process must produce an oxide etch rate that is much greater than the nitride etch rate. Numerical values of selectivity are calculated as the ratio of the oxide to nitride etch rates. Selectivity is especially critical at the corners 26 of the nitride layer 14 above and next to the gap 12 since the corners 26 are the portion of the nitride exposed the longest to the oxide etch. Furthermore, they have a geometry favorable to fast etching that tends to create facets at the corners 26.
Furthermore, increased selectivity is being required with the increased usage of chemical mechanical polishing (CMP) for planarization of an oxide layer over a curly wafer. The planarization produces a flat oxide surface over a wavy underlayer substrate, thereby producing an oxide layer of significantly varying thickness. As a result, the time of the oxide etch must be set significantly higher, say by 100%, than the etch of the design thickness to assure penetration of the oxide. This is called over etch, which also accounts for other process variations. However, for the regions with a thinner oxide, the nitride is exposed that much longer to the etching environment.
Ultimately, the required degree of selectivity is reflected in the probability of an electrical short between the gate structures 10 and the metal filled into the contact hole 22. The etch must also be selective to photoresist, for example at facets 28 that develop at the mask corners, but the requirement of photoresist selectivity is not so stringent since the photoresist layer 20 may be made much thicker than the nitride layer 14.
In the future, the most demanding etching steps are projected to be performed with high-density plasma (HDP) etch reactors. Such HDP etch reactors achieve a high-density plasma having a minimum average ion density of 10.sup.11 cm.sup.-3 across the plasma exclusive of the plasma sheath. Although several techniques are available for achieving a high-density plasma such as electron cyclotron resonance and remote plasma sources, the commercially most important technique involves inductively coupling RF energy into the source region. The inductive coil may be cylindrically wrapped around the sides of chamber or be a flat coil above the top of the chamber or represent some intermediate geometry.
An example of an inductively coupled plasma etch reactor is the IPS etch reactor, which is also available from Applied Materials and which by Collins et al. describe in U.S. patent application, Ser. No. 08/733,544, filed Oct. 21, 1996 and in European Patent Publication EP-840,365-A2. As shown in FIG. 2, a wafer 30 to be processed is supported on a cathode pedestal 32 supplied with RF power from a first RF power supply 34. A silicon ring 36 surrounds the pedestal 32 and is controllably heated by an array of heater lamps 38. A grounded silicon wall 40 surrounds the plasma processing area. A silicon roof 42 overlies the plasma processing area, and lamps 44 and water cooling channels 46 control its temperature. The temperature-controlled silicon ring 36 and silicon roof 42 may be used to scavenge fluorine from the fluorocarbon plasma. For some applications, fluorine scavenging can be accomplished by a solid carbon body, such as amorphous or graphitic carbon, or by other non-oxide silicon-based or carbon-based materials, such as silicon carbide.
Processing gas is supplied from one or more bottom gas feeds 48 through a bank of mass flow controllers 50 under the control of a system controller 52, in which is stored the process recipe in magnetic or semiconductor memory. Gas is supplied from respective gas sources 54, 56, 58. The conventional oxide etch recipe uses a combination of a fluorocarbon or hydrofluorocarbon and argon. Octafluorocyclobutane (C.sub.4 F.sub.8) and trifluoromethane (CHF.sub.3) are popular fluorocarbons, but other fluorocarbons, hydrofluorocarbons, and combinations thereof are used.
An unillustrated vacuum pumping system connected to a pumping channel 60 around the lower portion of the chamber maintains the chamber at a preselected pressure.
In the used configuration, the silicon roof 42 is grounded, but its semiconductor resistivity and thickness are chosen to pass generally axial RF magnetic fields produced by an inner inductive coil stack 62 and an outer inductive coil stack 64 powered by respective RF power supplies 66, 68.
Optical emission spectroscopy (OES) is a conventional monitoring process used for end-point detection in plasma etching. An optical fiber 70 is placed in a hole 72 penetrating the chamber wall 40 to laterally view the plasma area 74 above the wafer 30. An optical detector system 76 is connected to the other end of the fiber 70 and includes one or more optical filters and processing circuitry that are tuned to the plasma emission spectrum associated with the aluminum or copper species in the plasma. Either the raw detected signals or a trigger signal is electronically supplied to the controller 52, which can use the signals to determine that one step of the etch process has been completed as either a new signal appears or an old one decreases. With this determination, the controller 52 can adjust the process recipe or end the etching step.
The IPS chamber can be operated to produce a high-density or a low-density plasma. The temperature of the silicon surfaces and of the wafer can be controlled. The bias power applied to the cathode 42 can be adjusted independently of the source power applied to the coils 62, 64.
It has become recognized, particularly in the use of HDP etch reactors, that selectivity in an oxide etch can be achieved by a fluorocarbon etching gas forming a polymer layer upon the non-oxide portions, thereby protecting them from etching, while the oxide portions remain exposed to the etching environment. It is believed that the temperature controlled silicon ring 36 and roof 42 in the reactor of FIG. 2 control the fluorine content of the polymer, and hence its effectiveness against etching by the fluorocarbon plasma, when the polymer overlies a non-oxide. However, this mechanism seems to be responsible for at least two problems if high selectivity is being sought. If excessive amounts of polymer are deposited on the oxide or nitride surfaces in the contact hole being etched, the hole can close up and the etching is stopped prior to complete etching of the hole. This deleterious condition is referred to as etch stop.
Further, the chemistry may be such that the polymer formation depends critically upon the processing conditions. It may be possible to achieve high selectivity with one set of processing conditions, but very small variations in those parameters may be enough to substantially reduce the selectivity on one hand or to produce etch stop on the other. Such variations can occur in at least two ways. The conditions at the middle of the wafer may vary from those at the center. Furthermore, the conditions may change over time on the order of minutes as the chamber warms up or on the order of days as the equipment ages or as chamber parts are replaced. It is felt that hardware can be controlled to no better than .+-.5 or 6%, and a safety margin or 3 to 6 is desired. Mass flow controllers 46 are difficult to control to less than .+-.1 sccm (standard cubic centimeter per minute) of gas flow so gas flows of any constituent gas of only a few sccm are prone to large percentage variations.
These factors indicate that a commercially viable etch process must have a wide process window. That is, moderate variations in such parameters as gas composition and chamber pressure should produce only minimal changes in the resultant etching.
Several oxide etch processes have been proposed which rely upon higher-order hydrogen-free fluorocarbons and hydrofluorocarbons, both generically referred to as fluorocarbons. Examples of higher-order fluorocarbons are fluoroethane, fluoropropane, and even fluorobutane, both in its linear and cyclic forms. In U.S. Pat. No. 5,423,945, Marks et al. disclose an oxide etch selective to nitride using C.sub.2 F.sub.6 in an HDP etch reactor having a thermally controlled silicon surface. Later process work with the IPS chamber of FIG. 2 has emphasized C.sub.4 F.sub.8 as the principal etchant species. Wang et al. have disclosed the use of fluoropropanes and fluoropropylenes, e.g., C.sub.3 F.sub.6 and C.sub.3 H.sub.2 F.sub.6, in U.S. patent applications, Ser. Nos. 08/964,504 and 09/049,862, filed Nov. 5, 1997 and Mar. 27, 1998 respectively. The two examples of fluorocarbons have F/C ratios of 2, as does C.sub.4 F.sub.8, and some researchers, including Yanagida in U.S. Pat. No. 5,338,399, believe this value produces the best passivating polymer. We have observed, however, that the etching profile cannot be controlled with C.sub.3 H.sub.2 F.sub.6.
If possible, it is desirable to use the already widely available fluoromethanes, which include carbon tetrafluoride (CF.sub.4), trifluoromethane (CHF.sub.3), difluoromethane (CH.sub.2 F.sub.2), and monofluoromethane (CH.sub.3 F). Hung et al. in U.S. patent application, Ser. No. 08/956,641, filed Oct. 23, 1997, suggest the use of CHF.sub.3 and CH.sub.2 F.sub.2. We have observed that this last combination is insufficiently selective, indicating poor polymer formation.
Although octafluorocyclobutane (C.sub.4 F.sub.8) remains the most popular oxide etching gas, we observe that it suffers from too narrow a process window. Furthermore, although C.sub.4 F.sub.8 is known to provide selectivity at the bottom of the etching hole, it provides little sidewall passivation, which is required for the desired vertical profiles. Also, C.sub.4 F.sub.8 has a boiling point of +1.degree. C., which is considered somewhat high, especially in view of a trend to operate with very cold cathodes. Often carbon monoxide (CO) is added to C.sub.4 F.sub.8 to increase the sidewall passivation as well as increase general nitride selectivity. However, CO is not only toxic, it also forms carbonyls with nickel and iron in gas cylinders and supply lines. The carbonyls are believed to contaminate wafers. For these reasons, the use of CO is not preferred.
The two approaches using alternatively the fluoromethanes and hexafluoropropane (C.sub.3 H.sub.2 F.sub.6) both provide wider process windows with satisfactory etching characteristics, but we still believe that the process windows are too narrow and the etching characteristics can be further improved.
Hexafluoropropylene (C.sub.3 F.sub.6) has also been investigated by Wang et al. in the previously cited patents. It has the F/C ratio desired by Yanagida. However, the results show insufficient selectivity.
A theoretically promising etching gas is tetrafluoroethylene (C.sub.2 F.sub.4). However, it is considered dangerously explosive.
There are further considerations in selecting fluorocarbons for oxide etching. If a higher-order fluorocarbon is selected, a presently available commercial supply is greatly desired, even if a semiconductor grade needs to be developed. Furthermore, many of the higher-order fluorocarbons are liquids at near to room temperature. It is still possible to use liquid precursors by the use of bubblers to atomize the liquid in a carrier gas. However, bubblers present another expense, they need frequent maintenance, and the effective flow rate of the liquid precursor is difficult to tightly control. Gaseous precursors are much more preferred.
For these reasons, other fluorocarbon etching gases are desired.

Oxide etch process using hexafluorobutadiene and related unsaturated hydrofluorocarbons


Optical quality of float glass is improved by attenuating longitudinally prior to attenuating laterally; and by providing extended residence time prior to attenuating.

This invention relates to a method for manufacturing flat glass wherein the glass is formed into a flat sheet while supported on a surface of a pool of molten metal, commonly referred to as the float process. More particularly, this invention relates to a process for attenuating the glass while supported on the molten metal to a thickness below the equilibrium thickness of the glass in such a manner so as to minimize distortion in the product glass.
In a float forming process, molten glass is delivered into a pool of molten metal and thereafter formed into a continuous ribbon or sheet of glass as disclosed, for example, in U.S. Pat. No. 710,357 of Heal; U.S. Pat. No. 789,911 of Hitchcock; U.S. Pat. Nos. 3,083,551 and 3,220,816 of Pilkington; and U.S. Pat. No. 3,843,346 of Edge et al. Under the competing forces of gravity and surface tension, the molten glass on the molten metal spreads outwardly to an equilibrium thickness of about 0.27 inches. In order to produce glass of thicknesses less than the equilibrium thickness, the prior art has resorted to various arrangements for stretching the glass while still in a viscous state on the spool of molten metal. The simplest stretching technique is that shown in U.S. Pat. No. 3,215,516 of Pilkington wherein stretching is done in the longitudinal direction (the direction of glass travel) only, wherein the stretching force is provided by the tractive means withdrawing the glass from the float chamber. In such an arrangement, the ribbon loses width as it becomes thinner. A common refinement of this arrangement is to employ lateral stretching means in order to reduce the loss of ribbon width as it is being stretched longitudinally. Typical of this latter approach is the process shown in U.S. Pat. No. 3,695,859 to Dickinson et al. Another approach is to maintain the ribbon of glass at essentially constant width by applying lateral tractive forces to edge portions of the ribbon as the ribbon is being attenuated in the longitudinal direction as exemplified in U.S. Pat. No. 3,843,346 of Edge et al.
Process perturbations originating with the attenuating process affect the topography of the glass ribbon in ways that degrade the optical quality of the product glass. The topography of float glass is characterized by two types of elongated features, thickness variations and corrugations, which extend generally parallel to the direction of glass travel, i.e., the longitudinal direction. These deviations from perfect flatness are, in effect, cylindrical lenses which distort light reflected from and/or transmitted through the product glass sheet. Analysis of the distortion patterns using optical scanners in a direction transverse to the direction that the glass traveled in the forming process reveals that the distortion patterns can be considered as consisting of randomly superimposed sinusoidal waves whose wavelengths vary over a wide range. It has also been found that the dominant component of the instrumentally measured signal corresponding to transmitted light occurs at rather well defined wavelengths that may range from about 1.2 to 1.4 inches (3.0 to 3.6 centimeters) for a "constant width" float forming process as in the Edge et al. patent cited above, to about 0.25 to 1.0 inches (0.6 to 2.5 centimeters) in the free-fall type of float forming as in the Pilkington patents cited above. Furthermore, these dominant wavelengths have been found to lie within a range to which the human eye is particularly sensitive for most applications.
Surface distortion in float glass is believed to arise from several categories of perturbations. First, inhomogeneities in the glass composition ("ream") not only cause nonuniformity of the refractive index of the glass but also can contribute to surface distortion. Second, thermal nonuniformity either in the molten glass entering the float forming chamber or within the chamber itself can contribute to surface distortion. Third, variations in the flow of molten glass from the melter to the forming chamber, either volume flow rate fluctuations or inequalities in the thickness of entering molten glass across the width of the ribbon of glass. Fourth, mechanical perturbations from contact of various members of the forming apparatus with the deformable glass ribbon. These include, for example, the stretching machines and side barriers as well as fluctuations in the speed with which the dimensionally stable ribbon is withdrawn from the forming chamber. These perturbations in the glass/tin system generate thickness variations or corrugations in the glass through a variety of mechanisms such as differential stretching, viscous folding, wrinkling, embossing, and membrane stress. While minimizing the causes of these perturbations is desirable, such an approach is limited because the perturbations cannot be completely eliminated, particularly in the case where less than equilibrium thickness glass is being produced. Therefore, this invention relates to diminishing the effects on distortion of these perturbations rather than eliminating the perturbations themselves.
As a newly formed ribbon of glass still in a softened condition progresses along the molten tin bath its topography is continually changing as perturbations introduce new defects into the ribbon and previously introduced defects are changed in shape. A defect may decrease in amplitude by means of viscous decay, or the wavelength of a distortion pattern may be altered by extensive or compressive stresses. It would be desirable if these distortion decaying mechanisms could be coordinated with the attenuating process so as to minimize the amount of distortion imparted to the glass when attenuated to below equilibrium thicknesses.
Some attempts have been made in the prior art to correlate the manner of attenuation to minimizing surface defects such as in U.S. Pat. Nos. 3,440,030 (Thompson et al.); 3,533,772 (Itakura et al.); and 3,520,672 (Greenler et al.), but it is now believed that none of these approaches fully meets the problem.

Method of attenuating glass in a float process


A divertor for removal of unwanted materials from the interior of a magnetic plasma confinement device includes the division of the wall of the device into segments insulated from each other in order to apply an electric field having a component perpendicular to the confining magnetic field. The resulting crossed-field drift causes electrically charged particles to be removed from the outer part of the confinement chamber to a pumping chamber. This method moves the particles quickly past the saddle point in the poloidal magnetic field where they would otherwise tend to stall, and provides external control over the rate of removal by controlling the magnitude of the electric field.

This invention relates to plasma devices. In particular, this invention is a divertor for removal of unwanted charged particles from a plasma.
A noticeable feature of most models both built and proposed for plasma systems is some form of divertor. This is an apparatus that operates to remove unwanted particles from the plasma while interfering as little as possible with the maintenance of the plasma. The unwanted particles may be impurities that are sputtered from the walls of the plasma device or they may be escaping hot particles which would bombard the wall in the case of a plasma device that is intended to be some form of a reactor. In either case, the unwanted particles tend to cool the plasma by their presence and it is desirable to remove them from the plasma to maintain the plasma in a desired state. This is a particular problem in the Tokamak which is a plasma device in which the plasma is confined in a toroidal region by a combination of magnetic fields that are toroidal and poloidal. The term "poloidal" refers to magnetic fields in the plasma region that are in a plane containing the axis of the toroid. These fields contribute to the stability of the plasma. It is well known that a plasma in a purely toroidal field configuration is not stable. The addition of a carefully calculated poloidal field provides the stability that is a principal feature of the Tokamak. This is accomplished by creating a pattern of magnetic flux lines in the center of the plasma region that adds to the magnetic flux that is applied to confine the plasma in the toroid and also to the magnetic flux generated by the plasma itself to create an average minimum of magnetic field within the plasma or to create shear in the field. Such an average minimum serves as a collection region both for particles of the plasma and for unwanted charged particles, the impurities described above.
Early attempts at removing unwanted particles from plasmas were characterized by divertors such as those used on the Stellarator, an early twisted toroidal plasma device. Divertors on the Stellarator applied a small opposing magnetic flux near the outside of the twisted toroid to bend some of the outer toroidal flux lines in a loop. That loop was passed through an enclosure that included a collecting surface. Charged particles that were free to travel along the outer flux lines were trapped on the collecting surface and thereby removed from the plasma. However, the divertor in the Stellarator distorted the confining magnetic fields. An ideal divertor would not perturb or destroy the symmetry of the confining magnetic fields of the plasma device and would promote the quick removal of particles from the plasma edge.
It is an object of the present invention to provide a divertor for a plasma confinement system such as a Tokamak.
It is a further object of the present invention to provide quick and controllable passage of particles out through the diverter region.
It is a further object of the present invention to extract impurities from the plasma in a plasma confinement system such as a Tokamak by the use of crossed fields.
It is a further object of the present invention to extract impurities from a plasma without perturbing confining magnetic fields.
Other objects will become apparent in the course of a detailed description of the invention.

Crossed-field divertor for a plasma device

The United States of America as represented by the United States Department of Energy


Provided in the present disclosure are an information transmitting device, an information receiving device, an information transmitting method, and an information receiving method. The information transmitting device comprises: a selection unit, which selects multiple pieces of target recipient information and a target transmission mode for a to-be-transmitted short message on the basis of a selection command received; a first determination unit, which determines whether or not the target transmission mode for the to-be-transmitted short message is a disappear-after-reading transmission mode; a second determination unit, which determines respectively, when the target transmission mode is the disappear-after-reading transmission mode, whether or not disappear-after-reading is currently supported by an information receiving device; and, a processing unit, which transmits the to-be-transmitted short message in the disappear-after-reading transmission mode when the determination is yes and transmits the to-be-transmitted short message in a direct transmission mode when the determination is no.

With the wide use of smart phones, people's requirements on the security of and privacy of mobile phones are higher and higher. The privacy of short messages as an important communication mode is being paid close attention to by more and more users.
For example, based on a disappear-after-reading transmission mode for the normal short messages, a disappear-after-reading short message can be directly deleted after the short message is received and the dialog box is closed. Although the privacy of the short messages may be increased, it could be transmitted in only one transmission mode to all the recipients when bulk messaging. For example, if a short message is transmitted in the disappear-after-reading mode when bulk messaging, it is transmitted in the disappear-after-reading mode even if disappear-after-reading is not supported by a few recipients among the multiple recipients. Then, the recipients not supporting disappear-after-reading will not receive the short message and the short message sent by the terminal is lost.

Information transmitting device and method and information receiving device and method

Yulong Computer Telecommunication Scientific (Shenzhen) Co., Ltd.


An illuminating caster includes an at least translucent tire, a rim for supporting the wheel, a hub including slits defined therein, spokes extending to the rim from the hub, illuminating elements located in the vicinity of the tire and a generator. The generator includes a ring disposed in the hub, rods each extending to a related one of the illuminating elements from the ring through a related one of the slits, a circuit board disposed in the ring and connected to the illuminating elements, an annular shell disposed in the ring, a coil disposed in the annular shell and connected to the circuit board, a permanent magnet disposed in but separated from the coil and a lining provided between the permanent magnet and an axle.

1. Field of the Invention
The present invention relates to an illuminating caster for a buggy, a walker, a toy, a sports gear, a wheeled chair or a trolley and, more particularly, to a reliable illuminating caster.
2. Related Prior Art
A buggy, a walker, a toy, a sports gear, a wheeled chair or a trolley needs casters. Conventional casters are plain.
Some roller skaters are equipped with illuminating casters for decorative and signaling purposes. An illuminating caster includes illuminating elements and a small generator for energizing the illuminating elements. The small generator includes a coil, a permanent magnet and a circuit board. When the illuminating caster is rotated, there is relative rotation between the coil and the permanent magnet. Thus, electricity is generated to energize the illuminating elements.
The illuminating casters cold easily fail to illuminate after some time of use. The failure could be attributed to slacking of the elements relative to one another or breaking of some of the elements. The slacking or breaking could be attributed to vibration during the use of the roller skaters.
The present invention is therefore intended to obviate or at least alleviate the problems encountered in prior art.


A cup-shaped flexible externally toothed gear of a wave gear device comprises a cylindrical body part, and an external-teeth area thereof includes a pushed portion pushed radially outward by a wave generator and a groove formed in a position adjacent to the pushed portion toward a diaphragm. The reaction force of the wave generator can be reduced because the groove is formed to partially reduce thickness in a portion that does not affect the root strength of the external teeth. The increase in root stress can be suppressed when the roots of the external teeth are thickened, and root strength can be effectively increased. The load torque of the wave gear device can thereby be increased.

In a wave gear device, an external-teeth area in a cup-shaped or silk-hat-shaped flexible externally toothed gear is flexed into a non-circular shape, e.g., an elliptical shape by a wave generator, whereby the external teeth of the flexible externally toothed gear are partially meshed with the internal teeth of an annular rigid internally toothed gear. When the wave generator is rotated by a motor, the meshing positions of the two gears move circumferentially, and relative rotation occurs between the two gears, the rotation corresponding to the difference in the number of teeth between the two gears. When the wave gear device is used as a reducer, commonly, the rigid internally toothed gear is fixed in place so as to not rotate, high-speed rotation inputted from the motor to the wave generator is greatly reduced, and the reduced rotation is outputted from the flexible externally toothed gear.
Patent Document 1 proposes a wave gear device comprising a cup-shaped flexible externally toothed gear. In the wave gear device disclosed in this document, the face width of the external teeth of the cup-shaped and silk-hat-shaped flexible externally toothed gear is reduced for the purpose of suppressing poor meshing of the flexible externally toothed gear with the rigid internally toothed gear, whereby a proper state of meshing can be maintained between the flexible externally toothed gear and the rigid internally toothed gear. To enable the external-teeth area to flex easily, a thin portion is formed in the portion of the flexible externally toothed gear that is adjacent to the external-teeth area in the cylindrical cup part, enabling the entire external-teeth area to flex appropriately and thereby improving the state of meshing between the two gears.

Wave gear device and flexible externally toothed gear


An apparatus for curving a needle is provided which comprises at least two generally cylindrical members rotatably connected to a frame. At least one anvil shaft is positioned substantially between the cylindrical members and is rotatably connected to the frame. A needle is positionable between the anvil shaft and the cylindrical members such that the needle is curvable about the anvil shaft. A driving assembly rotates the cylindrical members and the anvil shaft such that the needle is curved about the anvil shaft and expelled from the apparatus.

1. Field of the Invention
The present invention relates to needle curving devices and, more particularly, to surgical needle curving devices for curving one or more needles simultaneously.
2. Description of the Related Art
Surgical needle manufacture is an extremely precise and time consuming process, particularly where individual needles are formed one at a time. Conventional surgical needle manufacturing typically begins with the step of cutting round wire stock to a predetermined length. One end of the stock is then tapered to provide a cutting edge while the opposite end may be manipulated or processed to attain a flattened or other predetermined shape. Later, typically after almost all of the processing is completed, the stock is cut to its final length and then prepared for suture attachment. The needle may then be subjected to further processing, i.e., further refinement such as grinding, polishing and/or hardening.
Curved needles have advantages over other needle configurations in many surgical procedures for a variety of reasons including, uniformity of entry depth for multiple sutures, and proper "bite" of tissue surrounding the incision or wound. When providing curved needles for surgical procedures it is desirable for the needles to have a specified curvature, i.e., a predetermined radius of curvature. The predetermined radius of curvature for the needle may vary with specific applications.
Configuration of a needle includes curving or forming the needle into predetermined shapes and may be accomplished by using conventional curving methods. Such conventional curving methods may include bending a needle around an anvil structure having a desired curving surface to curve a needle to a predetermined radius of curvature.
Where a curved needle is to have a bore for receiving a suture, it is desirable for the curving procedure to precede boring the needle so that the hole is not deformed by the curving procedure.
To attain the desired needle configuration, the anvil structure provides a shaping surface for deforming the needle. Typically, a needle is positioned for curving by manually placing the needle for engagement with an anvil structure. The needle may be held by hand or placed in a holding device which is manipulated manually.
It is further known that because needles are made of steel or similar springy materials, the anvil or mandrel used should have a smaller radius than the radius desired in the final needle to allow for some springback after the bending operation. A disclosure of such features may be found in, for example, U.S. Pat. No. 4,534,771 to McGregor et al.
One disadvantage to conventional needle curving is that only one needle can be curved around an anvil structure at a time. Moreover, the needle is positioned for engagement about an anvil surface using manual means. Further, during the needle curving process the needle may be damaged.
It would therefore be desirable to provide a needle curving device that is capable of simultaneously curving a multiplicity of needles. It would further be desirable to provide a needle curving device to cooperate with a needle holding structure for positioning one or a multiplicity of needles for curving. It would further be desirable for a needle curving device to substantially avert damaging needles. It would also be desirable for a needle curving device to entertain substantially continuous needle curving. It would further be desirable to provide a needle curving device to curve a multiplicity of needles in predetermined configurations.


A decoupled gas turbine engine includes a high spool assembly and a low spool assembly each having a rotational axis that are spaced from one-another. The engine further includes a combustor that may have a centerline spaced from the rotational axes of each spool assembly. Turning ducts of the engine are configured to re-direct airflow from one spool assembly to the next and/or between one spool assembly and the combustor.

The present disclosure relates to a gas turbine engines, and more particularly to a decoupled gas turbine engine.
Known gas turbine engines for both land based (e.g. industrial gas turbines) and aircraft applications (e.g. planes and vertical lift applications such as helicopters) typically include at least two concentrically located spools, having a common engine axis. The spools generally interconnect a compressor and a turbine section interposed by a concentrically located combustor. In a turbofan application, the engine may further include a fan that drives air along a bypass flowpath while the compressor section drives air along a core flowpath for compression and communication into the combustor then expansion through the turbine section. In a two spool application, the engine generally includes a low spool and a high spool mounted for rotation about the engine axis via several bearing structures and relative to a static engine case. The low spool generally includes an inner shaft that interconnects the fan, a low pressure compressor ("LPC") of the compressor section and a low pressure turbine ("LPT") of the turbine section. The inner shaft may typically be configured to drive the fan.
The high spool includes an outer shaft that interconnects a high pressure compressor ("HPC") of the compressor section and a high pressure turbine ("HPT") of the turbine section. The combustor is arranged between the HPC and the HPT. The concentric inner and outer shafts both rotate about the engine axis. Core airflow is compressed by the LPC then the HPC, mixed with the fuel and burned in the combustor, then expanded over the HPT and the LPT. The LPT and HPT rotationally drive the respective low spool and high spool in response to the expansion.
Unfortunately, the concentric nature of such engines makes it difficult to obtain high operating pressure ratios while maintaining/achieving small engine core size. Further, packaging space for the engine may be limited, and achieving optimal dimensional tolerances with known manufacturing techniques may be difficult to obtain especially for smaller engines.


Provided is a breeding container which is adapted to be lethal to container breeding mosquitoes which contains:. a walled structure defining an internal volume, the walled structure being constructed and arranged to contain an aqueous liquid within at least a portion of the internal volume; PA1 at least one opening in the walled structure disposed so as to allow mosquitoes to enter the walled structure; PA1 mosquito egg laying structure in the internal volume constructed and arranged such that female mosquitoes contact a surface of the mosquito egg laying structure; and PA1 an insecticide that is lethal to mosquitoes present in an amount sufficient to kill the female mosquitoes in contact with the surface. Also provided is a lethal mosquito breeding container kit and a method for controlling the population of container breeding mosquitoes.

With approximately 20 million dengue cases a year and 100 countries affected, the World Health Organization considers dengue the most important mosquito-borne viral disease. A vaccine is not currently available and mosquito control is a critical element of dengue disease prevention. There are reports that conventional ground and aerial application of insecticides are not providing adequate control of the mosquitoes that transmit dengue. Dengue is primarily transmitted by the Aedes species of mosquito. The Aedes mosquito is a container breeder and, therefore, the female Aedes mosquito will only lay eggs in a container holding water.
Chemical mosquito control has relied on area treatment of the mosquitoes' habitat. For example, large outdoor areas or the space within a home are treated with an insecticidal fog or spray in an attempt to deposit a lethal dose of insecticide on individual mosquitoes. The water used as mosquito breeding habitats has also been treated with insecticide which is designed to kill the developing larva. Adult resting places have been treated with an insecticide deposit designed to kill adult mosquitoes as they stand on the resting places.
The oviposition trap (hereinafter "ovitrap") has been used as a surveillance tool for Aedes mosquitoes. The ovitrap consists of a pint sized water container, filled with water to within 1 inch of the top, with a wooden or velour paper paddle projecting above the water surface. Aedes females are attracted to the ovitrap and deposit eggs on the paddle. The number of eggs deposited provides an indication of the Aedes mosquito population.
A variation of the ovitrap in described in U.S. Pat. No. 5,123,201. This patent describes a sensor-triggered suction trap for collecting live gravid mosquitoes. When a mosquito interrupts an infrared beam a fan is activated which blows the mosquito into a container for collection. Such a device is complicated and expensive. Furthermore, this device does not kill mosquitoes or mosquito larvae.
Chan, K. L., et. al., "An autocidal ovitrap for the control and possible eradication of Aedes aegypti", Southeast Asian Journal of Tropical Medicine and Public Health, 8(1), pages 56-62 (1977), discloses a modified ovitrap in which any eggs that hatched would be unable to emerge as adults because of a mechanical barrier. By slowly trapping and killing progeny of Aedes aegypti there was a gradual reduction of the population.
U.S. Pat. No. 4,328,636 describes a foraminous barrier which prevents hatched mosquitoes from escaping a body of water. Such a trap, which allows adult females to escape, does not directly interrupt the dengue transmission cycle since adult females can leave the trap after depositing their eggs and take another blood meal, possibly transmitting dengue.
Ikeshoji, T., et. al., "Surfactants for a mosquito ovitrap", Jap. J. Sanit. Zool., 28(4), pages 451-452 (1977), relates to the use of surfactants to drown adult mosquitoes as they attempted to lay eggs. This method is a research tool and not a control method.
Obaldia, G. Davila de, et. al., "Aedes aegyti resting preference on untreated and deltamethrin-treated crepe paper and plastic foam surfaces", J. Am. Mosq. Control Assoc. 12(3), pages 467-68 (1996), investigated the use of resting boxes having insecticide impregnated surfaces. Shortcomings of such a control method are that there are many resting stations to compete with and females would be able to lay eggs prior to entering the resting box, ensuring a next generation.
There is a need for an environmentally sound, simple, cost-effective apparatus and method for controlling populations of the Aedes species of mosquito, primarily Aedes aegypti and Aedes albopictus.

The United States of America as represented by the Secretary of the Army


A tool (30) is disclosed for inserting insulated conductors (32) into insulation displacement contacts (34) and crimping the strain relief tabs (76) onto the insulated conductor in two stages to minimize distortion of the housing (36) containing the contacts. The tool includes an inserter (48) having a first crimping blade (70) that operates in a first crimping station (86) and a second crimping blade (88) that operates in a second crimping station (102). The inserter (48) includes an insertion blade (66) that fully inserts the insulated conductor (32) in the IDC contact (34) in the first crimping station (86) while the first crimping blade 70 rolls over and partially crimps the tabs (76) that project from the contact (34) onto the insulated conductor (32). Concurrently, the second crimping blade 88 engages the tabs (76) in the second crimping station 102 and completes the crimp to form the strain relief.

Connectors having insulation displacement contacts (IDC) are widely used in the telephone and computer industries as well as in other industries. Such an IDC connector, for example, is disclosed in U.S. Pat. No. 3,820,055 which issued Jun. 25, 1972 to Hufnagle. In line with the miniaturization trend in the manufacture of electronic and electrical components, these IDC connectors are beginning to be made quite small with closely space contacts. The insulated housings of these connectors have relatively thin wall sections that are delicate and easily deformed or damaged. When terminating insulated conductors to these connectors, tabs on each of the contacts must be crimped onto the insulation of its respective conductor to form a strain relief. This crimping process tends to bulge the crimped area outwardly against the wall sections of the housing that separate the contacts. A wall section can be deformed or bent over into the area of an adjacent contact that has not yet received a conductor so that, when termination of a conductor is attempted the insertion tooling may engage this deformed wall section and damage the connector. This is illustrated in FIGS. 1 and 2 where there is shown a connector 10 having a series of insulation displacement contacts 12 positioned in a tool 14. The tool includes an inserter 16 that both inserts the conductor into the contact 12 and rolls over and crimps a pair of tabs 18 that project upwardly from each contact, to form a strain relief in the usual manner. Each contact 12 is separated by a relatively thin insulating wall 20 that is part of the connector housing. During the insertion operation the crimped area of the contact 12 tends to bulge out in the horizontal direction, as shown at 22 in FIG. 1. While the end wall 24 is relatively thick and rigid, the opposite wall 20 in the first contact cavity is relatively thin and deflects toward the right a small amount under the pressure of the crimped first contact. In the case of a relatively shallow crimping depth this deflection of the wall 20 is only slight in the first couple of contacts, however, when the third contact is crimped, as shown in FIG. 1, the effect of cumulative side pressure caused by the bulging of the first several contacts causes a significant deflection of the wall 26 into the fourth contact cavity. When the connector 10 is indexed to the fourth cavity, the inserter may engage the edge of the wall 26, as shown in FIG. 2, resulting in damage to the connector 10 or the tool 14. In the case where the crimping depth is relatively greater, the wall 26 can be significantly deflected after only the first contact is fully crimped so that the wall intrudes well into the cavity of the second contact. In this case, when the connector 10 is indexed to the second cavity, the inserter may engage the wall 26.
What is needed is an apparatus for terminating such IDC connectors while assuring that the inserter does not damage the walls of the connector housing.


An electrostatic color printer or copier having a single toner applicator with a system for continuous toner purification. The single applicator is used for each color sequentially and as toning of one color is completed a volume of spent or contaminated toner fluid is left behind in the applicator. This volume is removed with clean wash fluid and sent to a wash fluid tank. Dirty wash fluid is continuously purified either before or after return to a wash fluid supply tank. In the latter case, the wash fluid supply becomes contaminated but is purified as wash fluid is withdrawn or while still in the tank. Continuous purification of dirty wash fluid allows a small volume purifier to be used without need for spent toner disposal.

Disposal of spent toners has long been a major problem for users of electrostatic printers and plotters. Today, ever increasing environmental awareness together with proliferating governmental regulations relating to chemical disposal are beginning to threaten use of liquid toners altogether. Despite the fact that the materials used for modern liquid toners are relatively harmless, the costs associated with proper disposal and documentation are threatening to render the technology non-competitive in the marketplace.
A method already exists, in principle, for eliminating the need for liquid toner disposal. This is described in U.S. Pat. Nos. 4,799,452; 4,895,103 and 4,923,581, all to G. F. Day. In this method the toner itself is eliminated except for a transitory existence just at the moment of toning. Concentrated "ink" of each color is stored in a small tank and injected into and mixed with a continuous stream of clear carrier fluid. The resulting toner stream is passed through the toner applicator and then immediately decomposed back into concentrate and clear fluid. This is done electrophoretically with a "separator", described in the patents. To stop the toning process the injection of the selected concentrate is simply terminated.
It would seem that this recycling concept might provide a liquid toning technology free of disposal problems since a large volume of contaminated or spent toner would never exist. However, the basic cause of disposal is not eliminated. Eventually the contents of the concentrate tanks would have to be discarded due to contamination. This is because the contaminants are re-mixed with the carrier fluid along with the colored toner particles and never removed from the system. The quantity of liquid to be thrown away would, to be sure, be smaller, but some fluid disposal problems would still remain. Also, the recycling architecture is relatively complex. It requires precise metering and mixing of two fluid streams and, worse, high speed separation of the toner into its components as it flows out of its applicator. With the high flows which are characteristic of full-width toner applicators, the separation apparatus must be quite large and, therefore, costly.
In order to electrophoretically separate a toner stream into its components the fluid is passed between two closely spaced, parallel electrodes while a high voltage is imposed across the gap. All of the fluid must be exposed to the full electric field and this means the flow must normally be confined to the gap region with some kind of fluid seals along the lateral edges of the separation zone. One of the electrodes must also be moving so that the accumulating sludge can be scraped off and sent to the appropriate concentrate tank. The seals which confine the fluid flow within the gap present numerous technical difficulties. They must support the high voltage and this high voltage appears across the exposed surface of the seal which joins the two electrodes. Surface electrical breakdown keeps the applied voltage lower than would otherwise be desired and this, in turn, causes the separator to be yet larger in order to assure total separation of the solids from the clear fluid. Also, four such large separators are normally required for a four color system.
An object of the invention was to devise a more effective method of providing disposal-free liquid toner than prior art recycling methods.

Continuous purification of liquid toners


A method for improving situational awareness for teleoperation of a remote vehicle by creating a 3D map display of an area around the remote vehicle comprises: receiving an original image from a stereo vision camera and utilizing the original image to perform visual odometry to determine the x, y, z, roll, pitch, and yaw for the original image; applying a fill-in algorithm to the original image to fill in an estimated depth for areas of the original image for which no depth data is available, which creates an enhanced depth image; combining the enhanced depth image with the x, y, z, roll, pitch, and yaw for the original image to create the 3D map display of the area around the remote vehicle; and displaying the 3D map display on an operator control unit used to control the remote vehicle.

Currently, Explosive Ordnance Disposal (EOD) and similar remote vehicle applications involve time-consuming and complex maneuvers that require the operator to expend significant cognitive attention in commanding and controlling the remote vehicle. In addition to controlling the remote vehicle, the operator has to consider the surroundings of the remote vehicle down range. This attention overload can leave the operator dangerously unaware of events in his own immediate environment.
Further, the operator is required to control every motion of the remote vehicle using limited sensory information and situational awareness, primarily provided by one or more video streams from independent monocular cameras. This required level of detailed control, coupled with a lack of situational awareness, can result in increased mission execution time. Increased mission execution time can cause increased time on target in areas of elevated risk to the operator and any supporting personnel.

Situational awareness for teleoperation of a remote vehicle


When a base station that does not support downlink beamforming is serving a UE and a guaranteed-bit-rate (GBR) bearer is established for the UE, the base station will detect the establishment of the GBR bearer for the UE and will responsively trigger handover of the UE to another base station selected based on the other base station supporting downlink beamforming. With this process, handing the UE over to a base station that supports downlink beamforming may thereby help to ensure successful transmission to the UE at the GBR associated with the bearer.

A cellular wireless network typically includes a number of base stations that provide wireless coverage areas, such as cells and cell sectors, in which user equipment devices (UEs) such as cell phones, tablet computers, tracking devices, embedded wireless modules, and other wirelessly equipped communication devices (whether or not technically operated by a human user), can operate. In turn, each base station could be coupled with network infrastructure, including one or more gateways and switches, that provides connectivity with one or more transport networks, such as the public switched telephone network (PSTN) and/or a packet-switched network such as the Internet for instance. With this arrangement, a UE within coverage of the network could engage in air interface communication with a base station and could thereby communicate via the base station with various remote network entities or with other served UEs.
When a cellular wireless network serves UEs, the network could allocate various resources to facilitate communication to and from the UEs. In an example arrangement, for instance, the network could establish "bearers," which could define physical or logical communication channels for carrying UE communication, such as virtual tunnels extending between the UEs a transport network gateway. Each such bearer could include a radio-bearer component that extends between a UE and a serving base station and an access-bearer component that extends between the serving base station and the transport network gateway. Further, each such bearer could have an associated service level defined by various service-level attributes, to support a particular quality of service or type of service. In practice, the network could allocate a number of such bearers for a UE, to support various different types of communication services.
By way of example, when the UE first enters into coverage of a base station, the UE could engage in a registration or "attachment" process that causes the network to establish for the UE certain default bearers for particular types of service, in accordance with the UE's service profile. For instance, if the UE's service profile indicates that the UE supports general packet-data communication (such as web browsing, file transfer, and the like), the network may establish for the UE a default bearer for carrying such communications with a best-effort service level. Further, if the UE's service profile indicates that the UE supports voice over Internet Protocol (VoIP) communications or other such real-time packet-based communication service, the network may establish for the UE a default bearer with a medium service level to support Session Initiation Protocol (SIP) signaling or the like to facilitate setup of such communications.
In turn, as a UE is being served by a base station, if the UE is going to engage in another type of communication service, the network may establish for the UE still other bearers, possibly with other service levels. For instance, if the UE supports VoIP service and seeks to engage in a VoIP call, or a VoIP call server seeks to connect a call to the UE, the network may establish for the UE a bearer with a high service level to carry the VoIP bearer traffic (e.g., packets representing voice), and the UE may then engage in the VoIP call via that bearer. Further, if the UE supports online gaming service and seeks to engage in gaming communication, the network may establish for the UE a bearer with a relatively high service level for that gaming communication, and the UE may then engage in the gaming via that bearer.
Each bearer that the network allocates to a UE could have an associated quality of service class indicator (QCI) that indicates service-level attributes of the bearer, such as whether the bearer is a "guaranteed bit rate" (GBR) bearer (having a guaranteed minimum bit rate suitable for an associated application) and if so what the GBR of the bearer is, as well as other attributes such as maximum bit rate (MBR), priority level, packet-delay budget, and packet error loss rate, for instance.
In a representative implementation, for instance, QCIs could range from 1 to 9, with QCIs 1-4 designating GBR bearers and QCIs 5-9 designating non-GBR bearers (i.e., bearers that do not have a guaranteed minimum bit rate). More specifically, in this implementation, a QCI 1 bearer is a GBR bearer for carrying conversational voice (e.g., VoIP) traffic, a QCI 3 bearer is a GBR bearer for carrying real-time gaming traffic, a QCI 5 bearer is a non-GBR bearer for carrying SIP signaling or the like, and a QCI 8 or QCI 9 bearer is a non-GBR bearer for carrying general packet-data communication.
When a base station serves a UE, the base station could maintain a context record for the UE, identifying each bearer established for the UE, and specifying the QCI level and/or other attributes of the bearer, for reference by the base station to help ensure appropriate service for the UE. To the extent the base station coordinates air interface communication with the UE on a particular bearer, the base station could work to do so in accordance with the QCI level of the bearer. For instance, when the base station coordinates transmission to the UE on a GBR bearer, the base station could work to ensure that sufficient air interface resources are allocated for that communication, to support communication at the GBR of the bearer.

Handover to help meet bit-rate guarantee upon establishment of guaranteed-bit-rate bearer


A direct mount rotary handle operating mechanism for operating a circuit breaker having electrical contacts. The handle mechanism includes a driver coupled to the circuit breaker and a handle having a socket for receiving the driver. The socket is configured to allow the handle to rotate relative to the driver. The handle further includes a movable locking pin. A lock latch is associated with the driver, wherein the lock latch includes a flange portion. When the electrical contacts of the circuit breaker are welded closed and a torque is applied to the handle, the handle rotates to a position in which the pin is blocked from being inserted into the locking hole by the flange portion thereby preventing the handle from being locked in an OFF position when the contacts are welded together.

Circuit breakers, both single and multi-phase circuit breakers, typically include a lever or other device for manually operating the circuit breaker. Frequently, it is desirable that the lever be operated through the use of a mechanical interface, such as a direct mount rotary handle operating mechanism having a handle that may be manually operated, wherein the handle mechanism is of the type that is directly mounted to the circuit breaker.
In operation, the handle mechanism moves the circuit breaker lever to its various operative positions. This includes an "ON" position, an "OFF" position and a "RESET" position. In some instances, it is necessary to lock the handle mechanism in the OFF position so as to safeguard personnel working on associated equipment. However, when the electrical contacts of the circuit breaker have become welded closed, usually as a result of a short circuit condition, locking the handle mechanism in an OFF position would create a dangerous and inappropriate condition since a user would believe that the circuit breaker is in the OFF (electrical contacts open) condition, when in fact the electrical contacts are welded closed.
Conventional handle mechanisms include a locking portion that will not enable locking of the handle when the contacts are welded together. This is commonly referred to as "Suitable for Isolation" or "Positive OFF". In addition, the handle will return to indicate the ON position when the handle is released. These are safety features that indicate to the user that the contacts are welded and that substantially reduce the likelihood that others working on the equipment would mistakenly believe that the contacts are open.
However, conventional handle mechanisms rely on the proper positioning of the handle as a way of ensuring that it will not lock during Positive OFF. The disadvantage of such mechanisms is, that with wear, the position of the handle mechanism approaches the locked position. Further, such mechanisms rely on the force limits set by standard specifications, such as those set by the International Electrotechnical Commission (IEC), in order to ensure the handle cannot be locked.
Thus there is a need for a direct mount rotary handle operating mechanism for a circuit breaker that will prevent the handle from being locked in an OFF position when the electrical contacts of the circuit breaker are in fact closed, such as in a welded closed condition.

This patent is subject to a terminal disclaimer.

Direct mount rotary handle operating mechanism which is suitable for isolation


A lamellar end grinding tool is described, which has a support plate provided with a central mandrel for placing on a driving machine, as well as a grinding wheel detachably fixed thereto. The grinding wheel comprises a carrier, preferably made from a fabric, which has on one side radially oriented grinding flaps overlapping in fan-like manner and fixed by adhesion and is provided on the other side with one surface of a burr surface fastening. The counterpart of the surface fastening is located on the support plate.

The invention relates to a lamellar end grinding tool with a support plate, which is provided with a fixing means for mounting on a driving machine, as well as with a grinding wheel, which has a circular disklike carrier detachably fixable to the support plate and radially oriented, fan-like overlapping grinding flaps fixed thereto.
Such a tool is known from U.S. Pat. No. 3,616,581. The support plate has a raised ring provided with a rubber covering. The carrier is provided with radial slots, in which is inserted in each case one grinding flap in such a way that one edge projects on the back surface remote from the grinding side. The carrier is screwed by a central screw onto the support plate and the projecting edges are fixed between the carrier and the ring area for anchoring the grinding flap. Fitting with the grinding flap takes place in situ, in that the carrier is unscrewed, the grinding flaps inserted and subsequently the carrier is again screwed onto the support plate. Therefore the changeover times are relatively long and require considerable care.
In addition, lamellar end grinding wheels are known, which have a plastic plate provided with radial slots and also one equipped with a mandrel and in which the grinding flaps are bonded into the radial slots. If the abrasive becomes worn, the plastic plates form waste which it is difficult to dispose of. Finally, lamellar end grinding wheels with a plate made from reusable aluminium are known, in which the grinding disks are anchored by mechanical jamming in radial slots or are fixed by adhesive to a closed plate surface.


The field of colonic diagnostic and surgical procedures is hampered by the lack of optimal means available to cleanse the colon. A compromise between convenient, distasteful, solid or low volume, hyperosmotic solutions which cause considerable fluid and electrolyte imbalances in patients and large volume, difficult to consume, iso-osmotic solutions has had to be made heretofore. This invention describes a low volume, hyper-osmotic solution consisting of sulfate salts with and with out polyethylene glycol. Unlike prior art, this composition is useful for the cleansing of the bowel and, in lower volumes, as a laxative, without producing clinically significant changes in bodily function.

1. Field of the Invention
I have found a new improved concentrated colonic purgative formulation made by combining inorganic salts and polyethylene glycol (PEG) in a small volume of water. This formulation is effective to produce colonic purging to prepare the colon for surgical or diagnostic procedures and surprisingly does not cause clinically significant changes in electrolyte balance.
2. Background Information
In sigmoidoscopy, colonoscopy, radiographic examination, preparation for patients undergoing bowel surgery, and other medical or diagnostic procedures on the colon, it is important that the colon be thoroughly purged and cleaned. In particular, it is essential that as much fecal matter as possible be removed from the colon to permit adequate visualization of the intestinal mucosa. This is important prior to, for example, diagnositc procedures such as flexible sigmoidoscopy or colonoscopy, diagnostic examinations widely performed to screen patients for diseases of the colon. In addition, it is important that the intestines be cleansed thoroughly in order to obtain satisfactory radiographs of the colon. The same condition also applies when the colon is preoperatively prepared for surgery, where removal of fecal waste materials is critically important for patient safety.
Large volume orally administered compositions have been developed for use as gastrointestinal washes for diagnostic purposes or for use as cathartic laxatives. Such orally administered preparations are usually formulated as dilute or isotonic solutions of electrolytes such as sodium sulfate, sodium bicarbonate, sodium chloride and potassium chloride. These orally administered compositions are useful in the rapid cleansing of the colon for diagnostic purposes. These formulations may include other agents such as polyethylene glycol. These formulations have generally been administered in a quantity of about four liters as isotonic solutions. One example composition is GoLYTELY® formulated according to the following: polyethylene glycol 59 g, sodium sulfate 5.68 g, sodium bicarbonate 1.69 g, sodium chloride 1.46 g, potassium chloride 0.745 g and water to make up one liter (Davis et al. Gastroenterology 1980;78:991-995).
Commercially available products embodying these formulations sometimes utilize polyethylene glycol, a non-absorbable osmotic agent, with an isotonic mixture of electrolytes for replenishment, so that patients do not become dehydrated or experience clinically significant electrolyte shifts. Because the solutions are isotonic, patients are required to ingest a significant amount of volume of these solutions, up to one eight ounce glass every ten minutes for a total of one gallon of fluid, to achieve effective purging
Sodium sulfate and phosphate salts have been used as laxatives when diluted in a small volume (˜300 mL) concentrated solution and taken in tablespoon sized (15 ml) daily doses. An example of this use is Glauber's Salt's (containing sodium sulfate). However, because of their small volumes, when used in this fashion they do not sufficiently clean the colon for diagnostic or surgical procedures. Also these small volume preparations do not contain polyethylene glycol. Sodium sulfate combined with polyethylene glycol and various other salts, administered in large volumes (1 gallon) over a short period of time is an effective gastrointestinal lavage, which cleanses the colon prior to colonoscopy or surgical procedures as described above.
The large volume required for effective use of this type of formulation for lavage is frequently associated with distention, nausea, vomiting and significant patient discomfort. Thus, while these formulations are generally effective, they are not well tolerated.
Another drawback of these prior art preparations is their unpleasant, bitter, saline taste. This can promote nausea and vomiting in sensitive patients—thereby preventing ingestion. It is difficult to overcome this unpleasant taste, even the most common natural sweeteners such as glucose, fructose, saccharose, and sorbitol could change the osmolarity of these orally administered solutions resulting in potentially dangerous electrolyte imbalances.
In an attempt to avoid the problems associated with the high volume types of preparations, other investigators have utilized ingestible preparations which consist of aqueous solutions of concentrated phosphate salts. The aqueous phosphate salt concentrate produces a tremendous osmotic effect on the intra-luminal contents of the bowel and therefore, evacuation of the bowel occurs with a large influx of water and electrolytes into the colon from the body. These phosphate salt preparations have been developed for the purpose of decreasing the volume required in colonic purgations. One such preparation basically is comprised of 480 grams per liter monobasic sodium phosphate and 180 grams per liter dibasic sodium phosphate in stabilized buffered aqueous solution and is sold under the brand name Fleets Phospho-Soda.™. Patients are typically required to take two (2) three ounce doses of this preparation, separated by a three to 12 hour interval for a total of six ounces (180 ml), which is a significant reduction compared to the large 1 gallon volumes required by the high volume preparations. Additionally, non-aqueous tablet or capsule formulations of sodium phosphates and sulfates have been used (U.S. Pat. Nos. 5,997,906, 6,162,464, and 5,616,346).
These small volume sulfate/phosphate solutions and non-aqueous formulations have been shown to cause massive electrolyte and fluid shifts that are clinically significant to the patient (US Food and Drug Administration, Center for Drug Evaluation and Research, Sep. 17, 2001; 2002 Physician's Desk Reference, prescribing information for Fleet's Phospho Soda and InKine Pharmaceutical's Visicol®). The terms "clinically significant" as used herein are meant to convey alterations in blood chemistry that are outside the normal upper or lower limits of their normal range or other untoward effects. These solutions are hyperosmotic; that is the electrolyte concentration of the solution is much higher than the electrolyte concentration in the human body. Available products, as Fleet's Phospho-Soda, and the solid dosage form such as Visicol tablets (sodium phosphate salts) are examples of small volume electrolyte preparations. All of these products have been seen to cause clinically significant electrolyte disturbances and fluid shifts, and disturbances in cardiac and renal function when administered to patients (US Food and Drug Administration, Center for Drug Evaluation and Research, Sep. 17, 2001).
To overcome the risks and electrolyte disturbances that occur with the small volume laxative preparations, large volume "lavage" solutions were developed to be isotonic. Preparing a patient for a surgical or diagnostic procedure on the colon with such an isotonic lavage would result in only minimal fluid and electrolyte shifts in the patient. GoLytely®, NuLytely®, and CoLyte® are examples of such large volume ravages. Because these lavages are isotonic, the patient experiences minimal, non-clinically significant fluid and electrolyte shifts, if any, upon their administration.
From the foregoing, it can be seen that the two approaches to colonic lavage have significant drawbacks that have not been resolved by prior attempts. The isotonic solutions, while not causing clinically significant fluid or electrolyte shifts, are, of necessity, of large volume, and difficult for patient ingestion. The hypertonic solutions or concentrated non-aqueous formulations are sometimes inadequate to prepare the colon and more importantly, can cause clinically significant electrolyte and fluid shifts, which have been known to cause deaths. Thus, it is desirable to have a small volume orally administered colonic purgative formulation which may be easily and conveniently administered and which avoids the clinically significant problems and objectionable tastes of known formulations. It can also be seen that it is desirable to have such a purgative formulation which may be administered without the large volumes necessary in conventional formulations and which avoids other potentially irritant chemicals or chemicals which could effect osmolality. In the nearly 20 years since the advent of large volume colonic lavage solutions, there has not been success in discovering an effective small volume gastrointestinal cleansing preparation that minimized fluid or electrolyte shifts. Concentrating the large volume lavages into smaller volumes does not achieve the same effectiveness, and is not as safe. This is because the components are not soluble in the small volumes necessary and because the concentrations are such that dangerous electrolyte shifts could occur. One purpose of the present research was to develop a safe, effective, and well tolerated small volume solution made up of a high concentration of poorly absorbable salts that induce a colon cleansing catharsis after oral ingestion without clinically significant alternation of sodium, chloride, bicarbonate, potassium, calcium, and phosphate level and balance or other untoward effects on the recipient.


Supercorroding magnesium alloys that operate like galvanic cells and react apidly and predictably with seawater to produce heat and hydrogen gas. The alloys are formed by a mechanical process that bonds magnesium and noble metal powder particles together in a strong electrical and mechanical bond. The alloy powders can be compacted and sintered to form barstock, etc., suitable for making self-destructing corroding links.

This invention generally relates to alloys which operate as short-circuited galvanic cells to corrode rapidly in electrolyre such as seawater. Such an alloy is suitable as a heat source; as a gas generator; or as a corroding release link.
Sources of heat and hydrogen gas of various types are well known in the art, especially by virtue of earlier already issued United States Patents commonly assigned herewith such as: U.S. Pat. No. 3,884,216 issued May 20, 1975 for ELECTROCHEMICAL ENERGY SOURCE FOR DIVER SUIT HEATING; U.S. Pat. No. 3,942,511 issued Mar. 9, 1976 for SANDWICHED STRUCTURE FOR PRODUCTION OF HEAT AND HYDROGEN GAS; U.S. Pat. No. 3,993,577 issued Nov. 23, 1976 for METHOD FOR PRODUCTION OF HEAT AND HYDROGEN GAS; and, U.S. Pat. No. 4,017,414 issued Apr. 12, 1977 for POWERED METAL SOURCE FOR PRODUCTION OF HEAT AND HYDROGEN GAS.
At least two methods have been employed in the past to achieve high corrosion rates. One is to construct a short-circuited battery-like cell of noble and active metal plates separated by an electrode gap such as disclosed in aforementioned U.S. Pat. No. 3,884,216. Another method is to form a powder by mechanically joining the discrete particles of noble and active powders such as disclosed in aforementioned U.S. Pat. Nos. 3,942,511, 3,993,577 and 4,017,414 where each powder particle is a small galvanic cell.
The battery-like cell has two principal disadvantages: the power output is dependent upon the electrode gap (internal cell resistance) and the resistance in the electrical short circuits (external load) limits the reaction rate. In order to maximize power output, the electrode gap must approach zero. Yet, to sustain the reaction, reaction products must be flushed away from the reacting surfaces. This requires a small initial gap between the plates. The gap creates high internal cell resistance which reduces the power obtainable from the cell. A further decline in power occurs because of the gap increase as the active plate is consumed.
The resistance in the electrical short circuit between the noble and active materials can limit power output. To maximize output, the external short circuit resistance must be minimized. In the battery like configuration the resistance is kept low by providing several relatively short-length paths between the plates. Low resistance spacers are used to maintain the electrode gap. Thus, the electrical resistance is minimized within the configuration and material limits.
In the powdered form where each grain of powder is a small galvanic cell similar to the larger battery-like cell, noble metal particles are mechanically joined to the surface of an active metal particle, as disclosed in aforementioned U.S. Pat. No. 4,017,414. The combination retains the property and identity of each constituent. But each cell will react with itself, so no electrode gap is necessary or exists. The short circuit path length is minimized because the particles are in direct contact. However, the short circuit resistance is not minimized. Electrical resistance between individual particles is a function both of physical proximity and of the oxides that exist on the bond surface between the metal particles (this is also true for the battery-like configuration). Because high resistance surface oxides are present, excellent mechanical contact may not assure intimate electrical contact. Due to the random method of joining the particles and low energy level of the balls used in the milling process in the aforesaid patent, some metal particles may not be paired into micro-cells but may remain free and will not react at all. Also, in this prior art powder form, the internal cell resistance may be minimized but the external or load resistance may be high. Due to the high oxide level on the bond surface, compacting and sintering the powders fabricated by using the prior art teachings will not result in barstock, etc., which has any significant mechanical strength.
A strong mechanical and electrical bond is necessary to provide a rapidly corroding galvanic cell alloy.

Supercorroding galvanic cell alloys for generation of heat and gas

The United States of America as represented by the Secretary of the Navy


A tracking system includes a tether, a buoyant transmitter assembly coupled to a first portion of the tether, an attachment component coupled to a second portion of the tether. The attachment component is configured to couple the tracking system to an object, and the tether enables the buoyant transmitter assembly to float above the object while the object and the tracking system are submerged in a fluid.

This section is intended to introduce the reader to various aspects of art that may be related to various aspects of the present invention, which are described and/or claimed below. This discussion is believed to be helpful in providing the reader with background information to facilitate a better understanding of the various aspects of the present invention. Accordingly, it should be understood that these statements are to be read in this light, and not as admissions of prior art.
Oil and gas wells are often used to access resources below the surface of the earth. For instance, oil, natural gas, and water are often extracted via a well. Offshore platforms may be used to support equipment for extracting the resources from wells located at the ocean floor. Offshore cranes or other floating transport vessels may be used to transport the equipment from land to the offshore platform. The equipment may be dropped during transport, during installation at the offshore platform or well, and/or may separate from the offshore platform during drilling operations, for example. Accordingly, it may be advantageous to provide a reliable tracking system to facilitate locating dropped objects, such as drilling equipment, at the ocean floor.


A network overlay system can include a data transport module having a network interface and a translation module configured to generate offload processing addresses for the network packet data; a system bus; at least one host processor connected to the system bus; and at least one offload processor module coupled to the system bus and configured to receive network packet data associated. Offload processor modules include processing circuits associated with at least one of the offload processing addresses that are configured to encapsulate the network packet data for transport on a logical network or decapsulate the network packet data received from the logical network. The offload processing circuits encapsulate or decapsulate network packet data independent of any host processor.

Modern computing systems can support a variety of intercommunication protocols. In certain instances, computers can connect with each other using one network protocol, while appearing to outside users to use another network protocol. Commonly termed an "overlay" network, such computer networks are effectively built on the top of another computer network, with nodes in the overlay network being connected by virtual or logical links to the underlying network. For example, some types of distributed cloud systems, peer-to-peer networks and client-server applications can be considered to be overlay networks that run on top of conventional Internet TCP/IP protocols. Overlay networks are of particular use when a virtual local network must be provided using multiple intermediate physical networks that separate the multiple computing nodes. The overlay network may be built by encapsulating communications and embedding virtual network address information for a virtual network in a larger physical network address space used for a networking protocol of the one or more intermediate physical networks.
Overlay networks are particularly useful for environments where different physical network servers, processors, and storage units are used, and network addresses to such devices may commonly change. An outside user would ordinarily prefer to communicate with a particular computing device using a constant address or link, even when the actual device might have a frequently changing address. However, overlay networks do require additional computational processing power to run, so efficient network translation mechanisms are necessary, particularly when large numbers of network transactions occur.

Network overlay systems and methods using offload processors