In an arrangement for the ejection of individual droplets in an ink printer head, the drive elements fashioned as conductor loops are formed by U-shaped middle parts in the region of the ink channel the conductor loops lie in the field of a magnet system; a respective discharge opening is allocated to each conductor loop; the conductor loops are respectively formed by webs or legs of conductive material whose low ends are secured at one side of the ink chamber at the wall bounding the ink chamber.

1. Field of the Invention
The invention relates to an arrangement for the ejection of individual droplets from discharge openings of an ink printer head having conductor loop drive elements and a magnet system.
2. Description of the Prior Art
An arrangement has been proposed for ink printer devices wherein ink is ejected in the form of individual droplets wherein the drive elements are secured at both sides of an ink channel in the form of conductor loops and their movable middle parts angled arrow-like proceed in the ink channel (U.S. Pat. No. 4,544,933). A magnet system extending over the entire length of the ink channel generates a magnetic field in the region of the drive elements. A force acting on the middle part is generated by a change of the current flux in a drive element, for example by switching the current on, this force moving the middle part in the direction toward a discharge opening allocated to this middle part and leading to the ejection of an individual droplet.
A write head can be constructed with such an arrangement wherein the advantages of an operationally reliable functioning can be combined with a low-outlay manufacture. It turns out, however, that the demands recently made of dot-matrix printers cannot be fulfilled to the desired degree with this arrangement. Thus, the high resolution required for a good print quality is limited, since the division of the drive elements and, thus, the division of the discharge openings is limited by the arrangement of the drive elements. An overlap of the printing points on the recording medium can only be achieved by enlarging the diameter of the discharge openings. The drive elements fastened at both sides of the ink channel not only limit the possibility of arranging the discharge openings in multiple rows but, rather, the frequently desired legibility of the characters immediately after a printing operation is also limited.

Arrangement for the ejection of individual droplets from discharge openings of an ink printer head


A sealing arrangement of a piezoactuator (12) for a fuel injection valve of an internal combustion engine, has connecting pins (14) projecting out of the piezoactuator (12) and a head arrangement (16, 18) placed on to the piezoactuator (12), which is provided with openings (20) for the penetration of the connecting pins (14), wherein a liquid-tight sealing element (30) abuts against the outer surfaces of the connecting pins (14) on one side and also against the head arrangement (16, 18) on the other. In order to ensure a reliable seal with this arrangement, in particular also over extended periods of time, the sealing element (30) abuts against the outer surfaces of the connecting pins (14) located inside the openings (20), and sealing element sections (32) located inside the openings (20) are radially compressed in the openings.

Such an arrangement is for example known from DE 10 2004 042 353 A1. In the known sealing arrangement a seal is realized by means of an elastomer sealing disk, from which dome-shaped sealing element sections extending out from the plane of the disk abut to form a seal against the outer surfaces of connecting pin sections which project from the openings of the top plate placed on the piezoactuator. Preferably the contact force for providing the sealing effect here is supplied by an elastic pretensioning of the material of the elastomer sealing disk.
A disadvantage of the known sealing arrangement is that the contact force and thereby the sealing effect is limited by the material properties of the sealing element. In addition there is the danger of this contact force diminishing over time because of a relaxation of the material. Finally a disadvantage which might arise under some circumstances is that the sealing arrangement demands space on the side of the top plate arrangement opposite the piezoactuator.

Sealing arrangement of a piezoactuator for a fuel injection valve of an internal combustion engine


A push-up pin used for separating a semiconductor element attached by adhesive to an adhesive sheet of a semiconductor element pushing-up device in a die bonding apparatus from the adhesive sheet by pushing up the semiconductor element from the rear surface side of the adhesive sheet includes a tip end portion having a shape for applying pushing-up pressure with the thicknesses of the adhesive sheet and the adhesive kept constant when the pushing-up pressure for pushing up the semiconductor element from the rear surface side of the adhesive sheet is applied, and a base portion for supporting the tip end portion.

1. Field of the Invention
This invention relates to a push-up pin of a semiconductor element pushing-up device in a die bonding apparatus, a semiconductor element pushing-up device in a die bonding apparatus, and a method for separating a semiconductor element in a semiconductor element pushing-up device of a die bonding apparatus.
2. Description of the Related Art
The process for bonding a semiconductor element obtained by subjecting a semiconductor substrate to the dicing process on a lead frame in the method of manufacturing a semiconductor device is called a die bonding process.
The conventional die bonding apparatus is shown in FIG. 1.
The die bonding apparatus is mainly constructed by a portion for taking up one semiconductor element, a portion for moving the taken-up semiconductor element onto a lead frame, and a portion for carrying the lead frame.
The portion for taking up the semiconductor element includes a wafer ring 2 for fixing a semiconductor substrate 1 obtained after semiconductor elements are subjected to the dicing process with the semiconductor substrate attached to the adhesive sheet, an XY table 3 for carrying the wafer ring 2, a camera 4 set above the XY table 3, and a semiconductor element pushing-up device 30 disposed below the XY table and used for pushing up the semiconductor element from the rear surface side of the adhesive sheet by use of a pin or pins so as to separate the semiconductor element from the adhesive sheet.
The portion for moving the semiconductor element onto the lead frame includes an element suction head 10 for taking up the semiconductor element separated from the adhesive sheet and moving the semiconductor element to a position correcting stage 11, and the position correcting stage 11 for correcting the position of the semiconductor element, and a bonding head portion 8 for holding the semiconductor element by use of a collet and carrying the semiconductor element from the position correcting stage 11 onto the lead frame.
The portion for carrying the lead frame includes a lead frame supplying portion 5 for supplying a lead frame, a lead frame carrying portion 6, a paste supplying portion 7 for supplying adhesive onto the lead frame, and a lead frame receiving portion 9.
The portion for taking up the semiconductor element is explained in more detail with reference to FIGS. 2A, 2B, and 3A to 3D.
FIG. 2A is an enlarged top plan view showing the semiconductor substrate 1 on the semiconductor element pushing-up device 30, and FIG. 2B shows a cross section taken along the line IIBxe2x80x94IIB of FIG. 2A and the construction of peripheral devices of the semiconductor element pushing-up device 30.
FIGS. 3A to 3D are cross sectional views for illustrating the operation of the semiconductor element pushing-up device 30.
The semiconductor element pushing-up device 30 includes a backup holder 15, push-up pins 17, pin holder 19, pin holder driving device 31, control device 32, and vacuum device 20.
The backup holder 15 is a vacuum chamber having through holes 18 formed in the upper surface thereof and vacuum suction force is applied to an adhesive sheet 14 on the upper surface of the backup holder 15 by use of the vacuum device 20 connected to the vacuum chamber so as to fixedly hold the adhesive sheet 14 on the upper surface thereof.
Semiconductor elements 13 are attached to the adhesive sheet 14.
The pin holder 19 capable of receiving a plurality of push-up pins 17 is inserted into the vacuum chamber of the backup holder 15 and the pin holder 19 is driven in the vertical direction by the driving device 31 shown in FIG. 2B.
The control device 32 controls the operation of the driving device 31 to drive the pin holder 19 in the vertical direction. shown in FIGS. 3A to 3D, if the pin holder 19 is moved upwardly in the state shown in FIG. 3A, the push-up pins 17 pass through the through holes 18 formed in the upper surface of the backup holder 15 to push up the semiconductor element 13 on the adhesive sheet 14 (FIG. 3B).
Since the adhesive sheet 14 is fixedly held on the backup holder 15 by vacuum suction force, the semiconductor element 13 is separated from the adhesive sheet 14 and taken up by suction of the element suction head 10 (FIG. 3C).
After this, the pin holder 19 is moved downwardly and the vacuum suction is released.
Then, a new semiconductor element 13 is placed on the backup holder 15 with the adhesive sheet 14 disposed therebetween in such a position that it can be taken up by suction of the semiconductor element suction head 10 (FIG. 3D).
Generally, the bonding force between the semiconductor element 13 and the adhesive sheet 14 depends on the property of the adhesive of the adhesive sheet 14 and the area of the semiconductor element 13. However, in the above-described conventional element pushing-up device 30, the conditions of the shape of the tip end portion of the push-up pin 17, the traveling distance in the vertical direction, the moving speed, and the vacuum suction pressure are kept constant irrespective of the above factors.
Recently, the adhesive strength between the semiconductor element 13 and the adhesive sheet 14 increases with an increase in the area of the semiconductor element 13 and it becomes difficult to separate the semiconductor element 13 from the adhesive sheet 14 under the constant condition as in the conventional case.
Therefore, in order to separate the semiconductor element 13 from the adhesive sheet 14, it is necessary for the push-up pins 17 to push up the semiconductor element 13 with extremely large force. In this case, there occurs a problem that the adhesive strength between the adhesive and the rear surface of the semiconductor element 13 becomes larger than the adhesive strength between the adhesive and the adhesive sheet 14 by application of the above force, and adhesive is left behind on the rear surface of the semiconductor element 13 which is separated from the adhesive sheet 14 or the adhesive sheet 14 is broken and left behind on the rear surface of the semiconductor element 13.
The above phenomenon is explained more in detail below.
FIG. 4 is a side view showing the push-up pin 17 of the conventional element pushing-up device 30. The push-up pin 17 has a cylindrical portion 17a to be engaged into the pin holder 19, a conical coupling portion 17b, and a tip end portion 17c having a curved surface with the radius R of curvature.
The angle xcex8 of circumference of a sector formed by a curved surface portion of the tip end portion 17c on a cross section taken along a line passing the central axes of the above portions is less than 180xc2x0.
FIG. 5 is an enlarged view showing a state in which the push-up pin 17 pushes up the semiconductor element 13. The push-up pin 17 pushes up the semiconductor element 13 while expanding the adhesive sheet 14 and adhesive 23.
In FIG. 5, since the adhesive sheet 14 and adhesive 23 are disposed between the tip end portion 17c of the push-up pin 17 and the rear surface of the semiconductor element 13 in an A zone, the adhesive sheet 14 and adhesive 23 are difficult to expand. On the other hand, since the adhesive sheet 14 and adhesive 23 are not set in contact with the rear surface of the semiconductor element 13 in a B zone, they can easily expand in the B zone than in the A zone.
Thus, the adhesive sheet 14 and adhesive 23 cannot expand equally in the A zone and in the B zone.
As a result, as shown in FIG. 5, the adhesive sheet 14 and adhesive 23 become extremely thin particularly on the boundary line S between the tip portion 17c and the conical coupling portion 17b. Therefore, the coupling strength between the adhesive 23 on the tip end portion 17c and the adhesive 23 on the conical coupling portion 17b or the coupling strength between the adhesive 23 and the adhesive sheet 14 is lowered on the boundary line S and the adhesive strength is lowered.
As a result, the adhesive 23 in the A zone is cut apart from the adhesive in the B zone on the boundary line S and attached to the rear surface of the semiconductor element 13 or the adhesive sheet 14 is broken and attached to the rear surface of the semiconductor element 13 via the adhesive 23.
If the semiconductor element having the adhesive or adhesive sheet 14 thus left behind on the rear surface thereof is received into a plastic package, a crack may be caused in the package by the thermal stress when it is mounted on a circuit board, thus making the device defective.
Particularly, in a package with a structure in which the rear surface of the semiconductor element is directly covered with sealing plastic as in the LOC (Lead On Chip) structure which is frequently used recently, cracks may easily occur.
Further, there occurs a problem that since the load applied to the push-up pin 17 is increased, the push-up pin 17 will break through the adhesive sheet 14. if the push-up pin 17 breaks through the adhesive sheet 14, the tip end portion of the push-up pin 17 is brought into direct contact with the rear surface of the semiconductor element 13, but since large force is applied to the tip end portion of the push-up pin 17 as described before, damage such as crack, scratch or mark of the push-up pin 17 is formed on the rear surface of the semiconductor element 13.
If the semiconductor element 13 having the damage formed on the rear surface thereof is set into a plastic package, a crack may be caused in the semiconductor element 13 by the thermal stress when it is mounted on a circuit board, thus making the device defective.
Semiconductor elements 13 having the damage formed on the rear surface thereof and semiconductor elements 13 having no damage were set into respective plastic packages, then subjected to the soldering process by infrared heating and mounted on circuit boards, and the defective rates thereof were compared. The result of comparison was that no defective device was contained in 139 semiconductor elements having no damage on the rear surface thereof but ten devices were found defective in 550 semiconductor elements having the damage formed on the rear surface thereof.
Thus, the probability that the semiconductor elements having the damage formed on the rear surface thereof become defective is high.
Further, in the conventional element pushing-up device 30, the process is continuously effected even after the adhesive sheet 14 is broken. At this time, as indicated by broken lines in FIG. 2A, the backup holder 15 applies vacuum suction force to the adhesive sheet 14 in a wide range covering not only the semiconductor element 13 to be subjected to the pushing-up process but also an area in which the semiconductor element 13 was already separated and taken up in the preceding pushing-up process.
Therefore, if the adhesive sheet 14 is broken in the preceding pushing-up process, vacuum suction force is also applied to the broken portion and the pressure will leak-via the broken portion of the adhesive sheet 14 and cannot be sufficiently lowered so that the adhesive sheet 14 cannot be fixedly held. As a result, the semiconductor element 13 cannot be separated from the adhesive sheet.
Further, if the push-up pin 17 breaks through the adhesive sheet 14, the tip end portion of the push-up pin 17 is brought into direct contact with the rear surface of the semiconductor element 13 with large force, and in this case, the tip end portion of the push-up pin 17 may be damaged. At this time, the conventional element pushing-up device 30 continues the operation, the adhesive sheet is successively broken and the rear surface of another semiconductor element 13 is damaged by the damaged tip end portion of the push-up pin 17.
In the conventional element pushing-up device 30, since breakage of the adhesive sheet 14 cannot be detected until the die bonding process for a preset number (or one lot) of semiconductor elements is completed, a large number of defective devices will be produced when the breakage of the adhesive sheet is detected.
Thus, in the conventional element pushing-up device, the conditions of the shape of the tip end portion of the push-up pin 17, the traveling distance in the vertical direction, the moving speed, and the vacuum suction pressure are kept constant irrespective of the property of the adhesive of the adhesive sheet 14 and the area of the semiconductor element 13 and the operating state of the push-up pin 17 is not controlled according to different conditions.
An object of this invention is to provide a push-up pin used for separating a semiconductor element from an adhesive sheet in a die bonding apparatus which can prevent semiconductor devices from being made defective by preventing adhesive from being left behind on the rear surface of the semiconductor element and preventing the adhesive sheet from being broken when the semiconductor element is separated from the adhesive sheet by use of the push-up pin.
Another object of this invention is to provide a semiconductor element pushing-up device having an improved push-up pin or pins in a die bonding apparatus.
Another object of this invention is to provide a method for separating a semiconductor element by using an improved push-up pin of pins in a semiconductor element pushing-up device of a die bonding apparatus.
In order to attain the above objects, a push-up pin used for separating a semiconductor element attached by adhesive to an adhesive sheet of a semiconductor element pushing-up device in a die bonding apparatus of this invention from the adhesive sheet by pushing up the semiconductor element from the rear surface side of the adhesive sheet, comprises a tip end portion having a shape for applying pushing-up pressure with the thicknesses of the adhesive sheet and the adhesive kept constant when the pushing-up pressure for pushing up the semiconductor element from the rear surface side of the adhesive sheet is applied; and a base portion for supporting the tip end portion.
A semiconductor element pushing-up device in a die bonding apparatus of this invention comprises at least one push-up pin which includes a tip end portion having a shape for applying pushing-up pressure with the thicknesses of an adhesive sheet and adhesive kept constant when the pushing-up pressure for separating a semiconductor element which is attached to the adhesive sheet via the adhesive from the adhesive sheet by pushing up the semiconductor element from the rear surface side of the adhesive sheet is applied, and a base portion for supporting the tip end portion; a pin holder for supporting the push-up pin to be movable in a vertical direction; a backup holder for receiving the push-up.pin and the pin holder and used as a vacuum chamber having at least one through hole formed in the upper surface thereof for passage of the push-up pin; a vacuum device for drawing the adhesive sheet to which the semiconductor element is attached via the adhesive onto the upper surface of the backup holder to provide vacuum in the backup holder; and a drive control device for driving the pin holder in a vertical direction.
Further, a semiconductor element pushing-up device in a die bonding apparatus of this invention comprises at least one push-up pin which includes a tip end portion having a shape for applying pushing-up pressure with the thicknesses of an adhesive sheet and adhesive kept constant when the pushing-up pressure for separating a semiconductor element which is attached to the adhesive sheet via the adhesive from the adhesive sheet by pushing up the semiconductor element from the rear surface side of the adhesive sheet is applied, and a base portion for supporting the tip end portion; a pin holder for supporting the push-up pin to be movable in a vertical direction; a backup holder for receiving the push-up pin and the pin holder and used as a vacuum chamber having at least one through hole formed in the upper surface thereof for passage of the push-up pin; a vacuum device for drawing the adhesive sheet to which the semiconductor element is attached via the adhesive onto the upper surface of the backup holder to provide vacuum in the backup holder; drive control means for driving the pin holder in a vertical direction; means connected to the vacuum device, for measuring the vacuum suction pressure; and control means for controlling the operation of the push-up pin based on the result of measurement of the pressure measuring means.
Further, a semiconductor element pushing-up device in a die bonding apparatus of this invention comprises at least one push-up pin which includes a tip end portion having a shape for applying pushing-up pressure with the thicknesses of an adhesive sheet and adhesive kept constant when the pushing-up pressure for separating a semiconductor element which is attached to the adhesive sheet via the adhesive from the adhesive sheet by pushing up the semiconductor element from the rear surface side of the adhesive sheet is applied, and a base portion for supporting the tip end portion; a pin holder for supporting the push-up pin to be movable in a vertical direction; a backup holder for receiving the push-up pin and the pin holder and used as a vacuum chamber having at least one through hole formed in the upper surface thereof for passage of the push-up pin; a vacuum device for drawing the adhesive sheet to which the semiconductor element is attached via the adhesive onto the upper surface of the backup holder to provide vacuum in the backup holder; means connected to the pin holder, for measuring a load applied to the push-up pin; and control means for controlling the operating condition of the push-up pin based on the result of measurement of the load measuring means.
Further, a semiconductor element pushing-up device in a die bonding apparatus of this invention comprises at least one-push-up pin which includes a tip end portion having a shape for applying pushing-up pressure with the thicknesses of an adhesive sheet and adhesive kept constant when the pushing-up pressure for separating a semiconductor element which is attached to the adhesive sheet via the adhesive from the adhesive sheet by pushing up the semiconductor element from the rear surface side of the adhesive sheet is applied and the semiconductor element is taken up by suction of a semiconductor element suction head, and a base portion for supporting the tip end portion; a pin holder for supporting the push-up pin to be movable in a vertical direction; a backup holder for receiving the push-up pin and the pin holder and used as a vacuum chamber having at least one through hole formed in the upper surface thereof for passage of the push-up pin; a vacuum device for drawing the adhesive sheet to which the semiconductor element is attached via the adhesive onto the tipper surface of the backup holder to provide vacuum in the backup holder; means for applying a voltage between the element suction head and the push-up pin; means for measuring a current flowing between the element suction head and the push-up pin; and control means for controlling the operating condition of the push-up pin based on the result of measurement of the current measuring means.
Further, a method for separating a semiconductor element in a semiconductor element pushing-up device in a die bonding apparatus of this invention comprises the steps of fixedly holding an adhesive sheet to which the semiconductor element is attached by adhesive by vacuum suction in a vacuum condition; measuring vacuum suction pressure when the semiconductor element is pushed up from the rear surface side of the adhesive sheet by use of at least one push-up pin with the thicknesses of the adhesive sheet and the adhesive kept constant; and controlling the operating condition of the push-up pin based on the result of measurement.
Further, a method for separating a semiconductor element in a semiconductor element pushing-up device in a die bonding apparatus of this invention comprises the steps of fixedly holding an adhesive sheet to which the semiconductor element is attached by adhesive by vacuum suction in a vacuum condition; measuring a load applied to at least one push-up pin when the semiconductor element is pushed up from the rear surface side of the adhesive sheet by use of the push-up pin with the thicknesses of the adhesive sheet and the adhesive kept constant; and controlling the operating condition of the push-up pin based on the result of measurement of the load.
Further, a method for separating a semiconductor element in a semiconductor element pushing-up device in a die bonding apparatus of this invention comprises the steps of fixedly holding an adhesive sheet to which the semiconductor element is attached by adhesive by vacuum suction in a vacuum condition; applying a voltage between the element suction head and the push-up pin and measuring a current flowing between the element suction head and the push-up pin when the semiconductor element attached to the adhesive sheet by adhesive is pushed up from the rear surface side of the adhesive sheet by use of the push-up pin with the thicknesses of the adhesive sheet and the-adhesive kept constant, separated from the adhesive sheet and then taken up by suction of the semiconductor element suction head; and controlling the operating condition of the push-up pin based on the result of measurement of the current.
With the above construction, according to the push-up pin of this invention, since the adhesive will not be left behind on the rear surface of the semiconductor element and breakage of the adhesive sheet can be prevented when the semiconductor element attached to the adhesive sheet is separated, occurrence of defective semiconductor elements can be prevented.
Further, with the semiconductor element pushing-up device in the die bonding apparatus of this invention, the rear surface of the semiconductor element can be prevented from being damaged when the semiconductor element is separated from the adhesive sheet by use of the push-up pin, and if the push-up pin breaks through the adhesive sheet, the breakage of the adhesive sheet is detected to prevent defective semiconductor elements from being further produced.
Further, with the method for separating the semiconductor element in the semiconductor element pushing-up device in the die bonding apparatus of this invention, the rear surface of the semiconductor element can be prevented from being damaged when the semiconductor element is separated from the adhesive sheet by use of the push-up pin, and if the push-up pin breaks through the adhesive sheet, the breakage of the adhesive sheet is detected to prevent defective semiconductor elements from being further produced.
Additional objects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out in the appended claims.

Method for separating a semiconductor element in a semiconductor element pushing-up device


The present invention provides a photovoltaic module comprising a photovoltaics and a signal generation means for generating a signal by application of a voltage, wherein the photovoltaics and the signal generating means are connected in parallel and the voltage is a voltage output by the photovoltaics which is connected in parallel with at least the signal generating means, thereby enabling detection of a failed photovoltaic module, regardless of the structure of a photovoltaic module array or the failure mode of the photovoltaic module.

1. Field of the Invention
The present invention relates to a photovoltaic module, a photovoltaic module array, a photovoltaic system (photovoltaic power generation apparatus), and a method of detecting failure of a photovoltaic module.
2. Related Background Art
With the recent spreading use of photovoltaic modules, there is a rapidly growing demand for photovoltaic modules suitable for use in medium-scale electric power systems installed outdoors, particularly in the personal houses. Generally, in the case of using the photovoltaic module for electric power generation, a plurality of the photovoltaic modules are connected in series (hereinafter, referred to as "string") for generating a voltage not smaller than a certain value, and a plurality of the strings are connected in parallel to form a photovoltaic module array.
FIG. 29 is a circuit diagram showing the constitution of a conventional photovoltaic module. In FIG. 29, there are shown a photovoltaic module 1, a photovoltaics 1a, and a bypass diode 1b connected parallel to the photovoltaics 1a. When a shadow is partly formed on the photovoltaic module 1 thereby increasing the electrical resistance of the photovoltaics 1a and causing the application of the voltage generated in other modules within the string as an inverse bias to the module 1 (hereinafter, referred to as "partial shadow"), the bypass diode 1b prevents the application of an inverse bias to the photovoltaics 1a in the photovoltaic module 1 thereby preventing the damage of the photovoltaic cell. Also, when a photovoltaic module which was part of the photovoltaic module array exhibited abnormal output, it was usually necessary, for detecting the position of the failure, to check whether the electrical output is normal in each string, then to interrupt the operation of the photovoltaics-photovoltaic system and to measure the electrical output of each photovoltaic module constituting the string by utilizing the output terminals of each photovoltaic module.
However, since the output terminals are usually provided on the back surface (a surface opposite to a light incident surface) of the photovoltaic module, it was very difficult to locate a failure position by using the output terminals after the installation of the photovoltaic module. On the other hand, if terminals for inspection are provided in each of the modules in such a way that they are exposed to the exterior, they may cause leakage of electricity or danger of electrical shock, thereby causing reliability problems. For these reasons, terminals for inspection were not provided. Consequently, for locating the failed photovoltaic module in a photovoltaic module array, the current flowed in the wiring of the photovoltaic module array is typically measured utilizing a clamping ampere meter.
It is preferable in practical use to have a photovoltaic module provided with current detecting not exposed to exterior in order to locate a failed position. An example of such a photovoltaic module includes the photovoltaic module shown in FIGS. 30A and 30B, as disclosed in the Japanese Patent Application Laid-Open No. 6-125105 and the photovoltaic module shown in FIG. 31, as disclosed in the Japanese Patent Application Laid-Open No. 9-148613. In FIGS. 30A and 30B, reference characters 1c and 1d indicate magnetic field generating means, and in FIG. 31, reference character 1e indicates light emitting means. In the photovoltaic module shown in FIG. 30A, a current flows in a bypass diode 1b to generate a magnetic field by the magnetic field generating means 1c. The photovoltaic module shown in FIG. 30B is so constructed that by the electromotive force generated by the photovoltaics 1a, an operation current flows into the magnetic field generating means 1d to generate a magnetic field. The photovoltaic module shown in FIG. 31 is so constructed that a current flows into the bypass diode 1b to turn on the light emitting means 1e. The current detecting means shown in FIG. 30B utilizes an operation current c1 generated during the operation of the photovoltaics 1a, while the current detecting means shown in FIGS. 30A and 31 utilize a current c2 flowing into the bypass diode 1b when the voltage of photovoltaics 1a is lowered.
However, the conventional method of detecting failure of a photovoltaic module array has the following problems. First, when the photovoltaics fails, a current flowing into the bypass diode is generated only when the failure of the photovoltaics is an open circuit failure; this method cannot be applied to short circuit failure. Second, the failure may not be detected in some cases, depending on the configuration of the photovoltaic module array. This problem becomes more conspicuous when the photovoltaic module array is equipped with a blocking diode for blocking a reverse current.
An open circuit failure means a failure such as an open circuit of the photovoltaic cell itself constituting the photovoltaics, or, in the case of plural photovoltaic cells constituting the photovoltaics, a failure such as breaking of a wiring connecting such photovoltaic cells.
Also, a short circuit failure means a failure such as a short circuit of the photovoltaic cell itself constituting the photovoltaics (including partial short circuit of the photovoltaic cell itself, the same is applied hereinafter), or, in the case of plural photovoltaic cells constituting the photovoltaics, a failure such as the short circuit of the wiring connecting such photovoltaic cells.
Both the open circuit failure and the short circuit failure are modes of failure, and these failure states (modes) are referred to as the open circuit failure mode and the short circuit failure mode, respectively.
The above two problems will be further explained with reference to FIGS. 32A to 34B. FIGS. 32A and 32B show the cases of a short circuit failure of the photovoltaics 1a in the photovoltaic module. In such a situation, regardless of the failure state, a current 2 flows into the failure signal generating means D1 for detecting the failure by the "absence" of the operation current of the photovoltaics 1a. On the other hand, even in the case of a failure state, the current 2 does not flow into the failure signal generating means D2 for detecting the failure by the "presence" of the current flowing into the bypass diode 1b. Distinguishing the failure state from the normal state is not possible in either case, and the failed photovoltaic module in the string cannot be detected. FIGS. 33A and 33B show examples of the photovoltaic module array constituted by connecting plural strings in parallel. FIG. 33A shows the state in the normal operation, while FIG. 33B shows the state in the failure state. Reference character 3 indicates a photovoltaic module array, and 3c indicates blocking diodes for preventing loss resulting from the reverse current generated in the case of generating a voltage difference. In such a configuration, when a photovoltaic module 1A constituting a part of a string 3a fails and reaches an open state, the operation current 2 does not flow through the string 3a at all, as shown in FIG. 33B, if the sum of open circuit voltages Voc2+Voc3 generated in other photovoltaic modules 1B and 1C is lower than the sum of operation voltages V4+V5+V6 of the string 3b. In other words, there is obtained a state that a current does not flow into all the bypass diodes and the photovoltaics constituting the string 3a. Consequently, it is not possible to detect the failed photovoltaic module in the string 3a.
FIGS. 34A and 34B are circuit diagrams showing an example of the photovoltaic module array formed by connecting in series a plurality of parallel members 3e of the photovoltaics. FIG. 34A shows the state in the normal operation, while FIG. 34B is an equivalent circuit diagram showing a failure state. In FIG. 34A, I1+I2 indicates the operation current 2 in a normal operation. Even when a photovoltaic module 1D is damaged to generate an open circuit failure as shown in FIG. 34B, if the load current I1′+12′ is not larger than the operation current of the non-failed photovoltaic module 1E, reverse bias is not applied to the failed photovoltaic module 1D at all, so that no current flows into the bypass diode in such module. Consequently, the failure cannot be detected by the type means of detecting the failure by the current flowing into the bypass diode.
It is possible to locate a failure point by detecting the operation current of the photovoltaics by employing the constitution as shown in FIG. 30B. However, since the signal generating means Id such as the magnetic generating means is connected in series to the photovoltaics, the almost amount of the operation current of the photovoltaics flowed into the signal generating means almost the all amount of the operation current of the signal generating means was not small, and this loss becomes a large value which is not negligible, particularly in a large-area photovoltaic module of a large current.

Photovoltaic module, photovoltaic module array, photovoltaic system, and method of detecting failure of photovoltaic module


A personal sound amplifier device in the form of a hearing aid worn by a user not only amplifies sounds but also communicates wirelessly with an external electronic device, such as a cellular telephone. The personal sound amplifier device includes a first microphone, an amplification circuit electrically connected to the first microphone, and a speaker electrically connected to the amplification circuit for amplifying ambient sound detected by the first microphone. A second microphone is situated away from the first microphone. A radio frequency (RF) transmitter and receiver circuit is electrically connected to the second microphone and to the speaker. An antenna is connected to the RF transmitter and receiver circuit. The user's voice is detected by the second microphone and transmitted by the RF transmitter and receiver circuit, through the antenna, to an external electronic device. Signals from the external electronic device are received by the antenna and processed by the RF transmitter and receiver circuit, and are emitted as sound through the speaker for the user to hear.

1. Field of the Invention
The present invention relates to personal sound amplification devices for use by hearing impaired persons, and more particularly relates to personal sound amplification devices having Bluetooth™ functionality.
2. Description of the Prior Art
Conventional personal sound amplifiers ("PSAs"), including hearing aids, do not have integrated Bluetooth™ radios. The integration of Bluetooth™ radios into PSAs has been problematic due to battery power consumption, output sound interference, and the space required to incorporate a Bluetooth™ circuit within a hearing aid housing also having the PSA circuit. To utilize Bluetooth™ technology, conventional PSA designs resort to utilizing a pendant unit worn by the user as a frequency convertor between the PSA device and Bluetooth™ quipped electronic devices, such as smart phones, the Apple iPad™/iPhone™ devices, and Blackberry™ devices. The pendant unit converts the 2.4 GHz Bluetooth™ frequency into lower frequencies to avoid interference with the integrated circuitry within the PSA (hearing aid), and consumes less battery power. This pendant unit provides the additional internal space needed for housing a relatively large battery to power the frequency convertor circuitry, and a relatively large antenna. However, to utilize the Bluetooth™ capabilities, consumers must inconveniently wear the pendant unit along with the PSA. Conventional pendant units have significantly limited transmission ranges and signal loss problems. Accordingly, the user must wear this separate pendant unit having a larger battery and a larger antenna.


A data storage system includes a memory circuit and a control circuit. The control circuit is operable to receive data bits provided for storage in memory cells of the memory circuit. The control circuit is operable to compare each of the data bits provided for storage in a corresponding one of the memory cells having a stuck-at fault value to the stuck-at fault value. The control circuit is operable to generate encoded data bits by inverting each of the data bits having a different value than the stuck-at fault value of the corresponding one of the memory cells and by maintaining a digital value of each of the data bits having the stuck-at fault value of the corresponding one of the memory cells. The control circuit is operable to prevent any of the data bits from being stored in the memory cells determined to have unstable values. The control circuit is operable to generate redundant bits that indicate at least one operation to perform on the encoded data bits to regenerate the data bits.

Many data communication systems use error correction encoders and decoders to detect and correct errors in data. Storage systems are frequently modeled as a communication system with a delay, where data is transmitted during a write operation and data is received at a read operation. In a storage system, random errors can be corrected up to a rate of about 1×10−4 with an acceptable overhead. To protect against an error rate of about 1×10−4, an error correction encoder may generate encoded bits having about 10% more bits than its input bits.
Phase change memory (PCM) is a class of non-volatile semiconductor memory. PCM devices have many advantages over traditional non-volatile flash memory. However, PCM devices may generate a large number of errors that are induced by writing cycle degradation. For example, a PCM device may generate errors at a rate of 1×10−2 or greater if cycled to millions or tens of millions of cycles.
At the limits of endurance, the error rate in non-volatile memory devices is dominated by writing cycle degradation, not by random errors. Errors that are dominated by degradation include stuck-at faults and unstable bits. Each of these two types of errors have different statistics than the random errors that are commonly assumed in data communication systems and corresponding error correcting approaches.

This patent is subject to a terminal disclaimer.

Techniques for storing data in stuck and unstable memory cells


A cakeboard useful for direct transfer of a cake from the oven, for finishing and serving, without the need for a cooling rack. The cakeboard can have a first layer of corrugated cardboard and a second layer of PET. The first layer can have its top liner perforated with microperforations to permit venting of heat and moisture, thus allowing cakes to be turned from the oven directly onto the cakeboard to cool before finishing and serving, thereby removing the need for turning cakes onto separate cooling racks before transferring them to the cakeboard, thereby reducing handling. The microperforations can be added after the layers are affixed to each other such that the microperforations pierce the top second layer and the top liner of the first layer. The first and second layers can be comprised of other materials; and, other layers may be present.

Boards for holding finished cakes are known. A problem with these boards has been that they have not been capable of accepting a cake fresh from the oven. In other words, it is common in the art to bake a cake, place it on a cooling rack, and then transfer the cooled cake to a cakeboard for finishing. (Finishing a cake can entail adding layers and/or icing.)
Thus, it is another problem in the art that placing a cake onto a cooling rack after baking, instead of directly onto a cakeboard, means an additional handling step in the preparation of a cake. This additional handling step means a loss of efficiency in cake preparation.
Further, this additional handling step provides yet a further problem in the art; namely, potential for damage to the cake prior to finishing it, and consequential losses therefrom. For instance, if a cake is broken while being transferred from the cooling rack to the cakeboard, the baker may have to scrap the cake and bake it again, meaning a loss of time and materials and therefore a loss of revenue.
It would therefore be desirable to provide a cakeboard which can directly accept a cake--fresh from the oven--to address any or all of the problems in the art.
In addition, a cakeboard which can directly accept a cake--fresh from the oven--provides additional advantages over that which has come before. For instance, instead of having to purchase cooling racks and cakeboards, the baker need only purchase the inventive cakeboard, providing an economic advantage; namely, that only one board--used by both the baker and the ultimate consumer--need be purchased by the baker for holding the cake after it is baked. Further, since only one board need be used, the present invention can provide ecological advantages, e.g., reduced waste, since only one board, rather than a board and a cooling rack, need be used.
Reference is made to U.S. Pat. Nos. 4,867,303, 4,776,459 and 4,389,315 and to the following listed documents, incorporated herein by reference, which either individually, or in any combination, fail to teach or suggest the present invention:
U.S. PAT. NO. INVENTOR 491,977 Bingham 1,301,197 Tully 1,781,302 Roberts 2,297,914 Pino 2,407,118 Waters 3,054,703 Brasure 3,127,828 Fine 3,347,181 Pizzo 3,406,052 Peters 3,411,433 Christopher 4,262,050 Jenkins 4,391,833 Self et al. 4,418,119 Morrow et al. 4,441,626 Hall 4,452,356 Dahl 4,950,524 Hacker 5,482,724 Morici et al. 5,565,228 Gics 5,609,293 Wu et al. 5,613,427 Wiley 5,698,295 Benner et al.
For instance, U.S. Pat. No. 4,452,356 to Dahl illustrates, in FIG. 1, a cakeboard or base 10 having a corrugated cardboard layer coated on its upper surface with plastic material 10a. In contrast to the present invention, no perforations are present and the cakeboard is not specifically used to dissipate or transmit heat.
U.S. Pat. Nos. 4,441,626 to Hall, 5,482,724 to Morici et al. and 5,565,228 to Gics relate to corrugated paperboard inserts or trays for use in pizza boxes. In the Morici et al. patent, FIGS. 1-3 show a generally flat pizza tray made of corrugated paperboard and including on its upper surface a parchment-like coating. Note that the paperboard is also provided with a plurality of linear, elongated slots therethrough to facilitate the capture of moisture and juices exuded by the pizza. However, in contrast to the present invention, there does not appear to be any teaching or suggestion of the perforations in the present invention or their particular use.
U.S. Pat. No. 3,054,703 to Brasure is directed to a laminated structure and process for making, in which a cardboard base (see column 1, line 43) is adhesively bonded to a PET web. The laminate is useful as a protective covering for thermal insulation. U.S. Pat. No. 4,418,119 to Morrow et al. provides an ovenable bakery food board comprising a paperboard base coated with polyvinyl alcohol and a silicone. U.S. Pat. Nos. 3,406,052 to Peters, 4,262,050 to Jenkins, 5,609,293 to Wu et al. and 5,698,295 to Benner et al. relate to corrugated boards including at least a protective polymer film or layer on at least one of its faces. The patent to Peters, in particular, provides a method of making the corrugated board/plastic laminate by extruding the plastic layer onto the corrugated board. However, in contrast to the present invention, these patents do not appear to teach or suggest the perforations in the present invention or their particular use.
U.S. Pat. No. 491,977 to Bingham is directed to a cooling board having perforations which is specifically used for cooling baker products (e.g., bread) after baking. However, there does not appear to be any teaching or suggestion of the board being a corrugated board with a grease and/or moisture and/or heat resistant layer, e.g., a foil or PET layer.
U.S. Pat. Nos. 2,407,118 to Waters, 3,411,433 to Christopher and 5,613,427 to Wiley relate to baking pans or liners per se of multilayer construction. The Waters patents provides, in one embodiment, a baking pan make of cardboard laminated with metal foil. Christopher's patent provides a baking container having three laminated layers, namely a top perforated foil layer, a bottom layer of imperforate foil, and a center layer of mesh material designed to entrap air and to absorb grease and moisture flowing during baking through the perforations of the first layer. Wiley's patent (see FIGS. 11 and 12) provides a pan liner in which a thermoplastic layer (having perforations thereon) is bonded to a cellulosic fiber layer (also having perforations therethrough). However, in contrast to the present invention, there does not appear to be any teaching or suggestion in these patents of a corrugated board with a grease and/or moisture and/or heat resistant layer, e.g., a foil or PET layer and perforations as in the present invention.
U.S. Pat. No. 1,301,197 to Tully is directed to a culinary utensil provided with a corrugated base and a perforated, substantially planar member overlying the base. There does not appear to be any teaching or suggestion in this patent of a corrugated board with a grease and/or moisture and/or heat resistant layer, e.g., a foil or PET layer and perforations as in the present invention.
U.S. Pat. Nos. 1,781,302 to Roberts and 2,297,914 to Pino provide pie or baking pans per se incorporated with ventilating apertures. However, in contrast to the present invention, there does not appear to be any teaching or suggestion in these patents of a corrugated board with a grease and/or moisture and/or heat resistant layer, e.g., a foil or PET layer and perforations as in the present invention.
And, as to U.S. Pat. Nos. 4,867,303, 4,776,459 and 4,389,315. The lattermost patent appears directed to a filter device, whereas the first two patents are related to each other and pertain to a bakery foods package which can include a base from corrugated board provided with an upper foil layer. However, there does not appear to be any teaching or suggestion of the perforations as in the present invention.
Accordingly, not only would it be desirable to provide a cakeboard which can directly accept a cake--fresh from the oven--to address any or all of the problems in the art, as in the present invention, it is believed that heretofore the art has not provided, taught or suggested a cakeboard or methods for making or using a cakeboard, as in the present invention.

Cakeboard and methods of manufacturing and use


An acquisition unit acquires list data concerning contents and records the acquired list data in a recording medium. A list display unit arranges a plurality of content images adjacent to each other and places them on a screen. As a receiving unit acquires an instruction to select one of the content images in a content list, the list display causes a display of the content list including a selected content image, in a first area of the screen and, at the same time, causes a display of detailed information associated with the selected content image, in a second area of the screen.

1. Field of the Invention
The present invention relates to an electronic device, and more particularly, to an electronic device having a display processing function.
2. Description of the Related Art
Electronic devices, such as mobile game devices and personal digital assistants (PDAs), have been in wide-spread use. And recent years have seen an emergence of multifunctional electronic devices, such as smartphones that combine functions of a mobile phone, PDA, and the like into one. These electronic devices, carrying large-capacity memories and high-speed processors, allow the users' accesses to a great variety of applications by downloading game software, movie, and other contents.
Electronic devices having a touch panel provide an excellent user interface that permits intuitive responses or operations by a user. Such user interfaces now in practical use include one that allows the selection of an icon with a finger tapping on a displayed content image (icon) or one that effects a scrolling of a displayed image with a finger tracing along the panel surface.


A method comprising determining that an interactable object is within a field of view of a head mounted display while the head mounted display is operating in a first power mode, and transitioning the head mounted display from operation in the first power mode to operation in a second power mode based, at least in part, on the determination that the interactable object is within the field of view, such that the head mounted display consumes more power during operation in the second power mode than during operation in the first power mode is disclosed.

In modern times, electronic apparatus are often powered by a power source, such as electrical batteries, electrical cells, and/or the like that have a limited power storage capacity. Such electronic devices may operate for extended periods without having their power sources recharged. As such, it may be desirable to configure an apparatus such that the apparatus utilizes the power source in a manner that conserves the limited power of the power source.

Transition of a head mounted display from operation in a first power mode to operation in a second power mode


A central processing unit for control of an aircraft system provided on board an aircraft, a control network for control of the aircraft system, an aircraft comprising such a control network, a corresponding method for control of the aircraft system and a computer program for carrying out the method. The central processing unit is connectable to at least two remote data concentrators over a network connection for control of a system component of an aircraft system. The central processing unit is configured to select one of the at least two remote data concentrators for control of the system component and to instruct the selected remote data concentrator to control the system component.

The present invention relates to a central processing unit for control of an aircraft system provided on board an aircraft, a control network for control of the aircraft system, an aircraft comprising such a control network, a corresponding method for control of the aircraft system and a computer program for carrying out the method.
Automation and control of aircraft systems, like aircraft ventilation systems, aircraft cooling systems or any other aircraft system that is suitable to be controlled via central processing units, control networks and common remote data concentrators, are generally performed by use of software (S/W) programmable controllers. In case of aircraft ventilation systems, today's solutions for automation and control are based on dedicated centrally located controllers, which are specifically developed for the system to be controlled. In other words, such centrally located controllers are specifically developed for controlling only a specific type of components, e.g., a specific type of sensors and/or actuators. That is, in case of aircraft ventilation systems, such centrally located controllers are specifically developed for controlling only ventilation system components of the installed aircraft ventilation system rather than system components of other aircraft systems.
In other words, these controllers fulfill all individual requirements for automation and control of the specific ventilation system installed on the aircraft and its electric and electronic components and are only foreseen and suitable to be used within one dedicated aircraft program. This is also true for controllers of many other aircraft systems, so that a lot of different system specific and individually developed controllers are typically used on one aircraft type. Hence, airlines typically need to keep a big number of different controllers that are used on a specific aircraft in their spare parts stores.
Due to existing safety and reliability requirements, automation and control of aircraft systems like aircraft ventilation systems needs to be set up redundantly so that many different important and safety-critical functions can always be guaranteed in case of one failed controller entity. For this reason, controllers used for controlling aircraft systems, for instance, aircraft ventilation system controllers for control of aircraft ventilation systems, are presently developed as dual-lane controllers. Dual-lane controllers host two independent and redundant controller lanes, e.g., a dual-lane controller typically has two independent processors and memories for performing independent control operations. The two independent control lanes can communicate with each other. That is, for example, the processor of the first control lane can not only read out instructions, commands and data stored in a specific area of the first control lane's memory, but also of the memory in the second control lane and vice versa. Such dual-lane controllers are typically connected to central process computers by Controller Area Network (CAN) busses.
Each dual-lane controller is typically not only connected to central process computers but also to multiple system components which are to be controlled. Electrical connections between the dual-lane controllers and the system components (e.g., electric system components) must often bridge long distances within the aircraft fuselage depending on the components' specific locations. The decision which of the lanes of the dual-lane controllers is used for the control of the system components to which the dual-lane controller is connected is generally performed by the dual-lane controller itself, e.g., the two lanes of the dual-lane controllers typically communicate with each other to decide which lane should be responsible for control the system component(s) at a certain point of time.
Recently, generic, single-lane and S/W configurable data concentrators, so called Common Remote Data Concentrators (CRDCs), have been developed. These generic, single-lane data concentrators can be connected via an Avionics Full DupleX (AFDX™) switched Ethernet network connection or other network connections to a common avionics data communication network for communication with further computers and data concentrators. The CRDCs can not only be used for monitoring and controlling specific aircraft system components, e.g., ventilation system components, but can adaptively be configured for monitoring and controlling system components of other aircraft systems.
In WO 2012/038265 A1 a remote data concentrator (RDC) for an avionics network has been proposed. The RDC comprises an input/output interface (I/O) for connection to one or more input/output devices, and a network interface for connection to a remote processor. The RDC is operable to provide communication between the input/output device(s) and the remote processor, and the RDC comprises a set of instructions for autonomously driving an output device connected to the I/O.

Control of aircraft systems with at least two remote data concentrators for control of an aircraft system component


In an on-line method of analyzing financial accounting data, uploaded financial accounting data is received at a server (2) from a client computer (3). The data is analyzed at the server (2) to identify anomalies in the data. A display is provided at the client computer (3) representing the anomalies that have been identified. Further, in a method of pre-processing financial accounting data prior to analyzis of the data, the financial accounting data is abstracted to correspond to a pre-stored accounting ontology. Further, in a method of analyzing financial accounting data, the method checks the data for violation of a particular state to identify inconsistent combinations of values in the data.

In today's increasingly litigious business environment, the necessity for more stringent financial and accounting data analysis and control is ever growing. At present, this is partially addressed by the role of auditors through their examination of the financial statements and underlying records to determine if the statements represent a true and fair view of the company's activities and are free from material misstatement
Auditors currently apply the technique of sampling in their approach and performance of an audit on the understanding that coverage of 100% of the transactions is costly, time-consuming and infeasible. Instead, if errors are found during the testing phase, these are extrapolated across the entire population to gain understanding as to the extent to which the error potentially affects the data.
The nature and extent of an audit is decided once a thorough "audit risk" assessment has been carried out. "Audit risk" is the risk that the auditor may provide an inappropriate opinion on the financial statements. In general terms, this consists of three components:audit risk=inherent risk×control risk×detection risk
Ideally, all transactions and other data in an accounting system would be assessed as part of an audit procedure in order to reduce the detection risk. Ideally, a comprehensive summary of errors or anomalies would be provided to enable the control risk to be reduced. With present sampling methods, which are essentially manual, this is not feasible.

Methods and apparatus for analysing and/or pre-processing financial accounting data


An automatic fish feeder has a separable container having a plurality of compartments which can be mounted on a rotatable shaft extending from an angled surface of a housing. The container has a lid with an opening through which food is dispensed. The container mounts on the rotatable shaft while the lid is fixed in position by one or more clips. Thus the container is rotatable beneath the lid to dispense food through the opening. The shaft is connected to a drive device, motor and power supply. By the proper choice of container and motor drive speed 7, 10 or 14 day automatic feeding can be reliably attained.

It is important when maintaining an aquarium that food be provided on a regular and consistent basis to assure the health and vitality of fish in the aquarium. Failure to feed fish on a regular basis can not only result in starvation but increases stress which can result in the onset of disease. Consequently, when vacations or other activities prevent regular feeding, methods and apparatus must be utilized to provide food in the feeders' absence.
One method for providing food to fish in an aquarium during extended absence is a solid type food which is placed within the tank and dissolves in a slow release fashion to release food on a regular basis. However, the type and quantity of food and the degree to which the food is released may vary depending upon tank chemistry and it is also limited in the quality of food which is released.
One apparatus for feeding fish, known as a "Fishmate", is a horizontally mounted device which requires a hole cut in the top of a tank cover, positioning of the device such that an aperture in the device is aligned with the hole. The device has a wheel made up of a pair of concentric rings with vertical walls between them which sits on a flat surface. The wheel works somewhat like a paddle wheel for pushing food over the hole which then falls into the tank. The wheel has inwardly engaging tabs which periodically engage a drive device, such that the wheel moves in periodic amounts which correspond to the width of the opening. To use the device requires setting pins in appropriate slots in the drive, setting the drive device timer, and placing food in the segmented portions of the wheel. However, since the wheel has no bottom surface, it is possible that the food could become moist and stick to the device surface and thus either slide beneath the rotating wheel or cause the wheel to jam. Consequently, the search continues for apparatus for automatic fish feeding.


A thermal processing device for dry photographic paper using a minimum amt of electrical energy. A cylindrical drum is provided with heating elements on the inside surface and current is applied through a slip ring assembly. A non-metallic belt, substantially equal in width to the length of the cylindrical drum, is supported by rollers so that a portion of the belt engages the cylindrical drum. Rotation of the cylindrical drum causes rotation of the belt and a sheet of paper fed into the device is sandwiched between the belt and drum and is heated thereby to develop the dry photographic paper.

The present invention relates to a thermal processor for photographic paper and more particularly to an improved heating apparatus for processing dry photographic paper.
Various imaging materials are known which utilize heat development following an imagewise exposure, e.g., by electrical charge, light or other forms of electromagnetic radiation; and many different devices have been utilized for thermally processing such materials. Common requirements for such devices are a well and uniform application of heat, a rapid and efficient heat transfer to minimize energy usage and a reliable feed means which obviates material jams and conserves the power required for material transport.
Various approaches have been utilized, e.g., hot air heating, infrared heating, microwave heating, etc.; however, a simple and common approach has been conductive heating by moving sheet or web to be developed in intimate contact with a heated member. One common configuration for implementing the last mentioned approach utilizes a rotating heated drum, on which the sheet or web is moved from an entrance zone to an exit zone around the drum periphery. To maintain the sheet in intimate contact with the drum during rotation along the development path, a stationary support, e.g., a belt, or blanket, or shoe, has been located around the drum periphery, usually spring-biased into contact with the rotating drum. These processors often rely on the friction force between the drum and copy material, which is higher than the friction force between the copy material and stationary support, to effect transport of the copy material through the processing zone. Another, somewhat similar, kind of apparatus utilizes a stationary heated member, (e.g., drum or platen) over which a continuous belt is moved to transport the copy material and hold it in close contact with the heated member. In this latter configuration the frictional force between the moving belt and copy material is greater than between the stationary heated member and sheet.

The United States of America as represented by the Secretary of the Navy


A gallium nitride crystal having a hexagonal crystal structure includes a first region located on an inner side of a cross section intersecting c-axis of the hexagonal crystal structure, and a second region surrounding at least a part of the outer periphery of the first region in the cross section. An emission spectrum of each of the first region and the second region with electron beam or ultraviolet light excitation has a first peak including a band edge emission of gallium nitride and a second peak located in a longer wavelength area than the first peak. A peak intensity of the first peak is smaller than a peak intensity of the second peak in the first region, and a peak intensity of the first peak is greater than a peak intensity of the second peak in the second region.

1. Field of the Invention
The present invention relates to a gallium nitride crystal, a group 13 nitride crystal, a group 13 nitride crystal substrate, and a manufacturing method.
2. Description of the Related Art
Semiconductor materials based on gallium nitride (GaN) are used for blue color LED (light-emitting diode) or white color LED, and a semiconductor device such as semiconductor laser (also called "LD: Laser Diode"). The white color LED is used for illumination purpose or back lighting of cell phones, LC (Liquid Crystal) display or the like. The blue color LED is used for traffic lights or other illumination purpose and so on. On the other hand, blue-violet semiconductor laser is used as light sources of Blu-ray discs. Presently, most of semiconductor devices based on GaN used as light sources of UV or violet-blue-green color are produced by using MO-CVD (Metalorganic Chemical Vapor Deposition) method or MBE (Molecular Beam Epitaxy) method to grow crystal on sapphire or SiC substrate.
There are problems in a case that sapphire or SiC is used as substrate. Crystal defects increases because of the significant difference of thermal expansion coefficient or lattice constant between the substrate and the group 13 nitride. Such a defect affects device properties. For example, it becomes harder to elongate the lifetime of emitting device. And, the operating power may increase. In order to address these problems, it is the most preferable way to use a gallium nitride substrate which is made of the same material as crystal to be grown on the substrate.
Presently, free-standing GaN substrates are manufactured in such a manner that a thick gallium nitride crystal is grown on a hetero-substrate such as sapphire substrate or GaAs substrate by HVPE (Hydride Vapor Phase Epitaxy) with employing ELO (Epitaxial Lateral Overgrowth) which is a method to reduce the dislocation density, and then the thick film of gallium nitride is separated from the hetero-substrate. The gallium nitride substrate manufactured as such has a dislocation density reduced to the order of 106 cm−2, and allows a size up to 2 inches in practical use mainly for laser device purpose. Recently, there is a further need for much larger diameter of substrate up to 4 inches or 6 inches for electronic devices, or cost saving of white color LEDs.
Warpage or cracks which may be induced by the difference of the thermal expansion coefficient or the lattice constant between the hetero-substrate and the gallium nitride hinders to enlarge the diameter of substrate. The aforementioned dislocation density still remains. There is also a problem of high manufacturing cost in processes of separating one thick film of gallium nitride from one hetero-substrate, and polishing it to form the gallium nitride substrate.
On the other hand, as one of liquid phase methods to realize the gallium nitride substrate, many efforts have been made for developing a flux method in which the gallium nitride crystal is formed by dissolving the nitrogen from a gaseous phase into a molten mixture of group 13 metal and alkali metal.
In the flux method, a molten mixture containing the alkali metal such as sodium (Na) and potassium (K) and the group 13 metal such as gallium (Ga) is heated to about 600 to 900 degrees Celsius under an atmosphere where the nitrogen pressure is 10 MPa or less. Thus, the nitrogen is dissolved from the gaseous phase and reacts with the group 13 metal in the molten mixture to form the group 13 nitride crystal. The flux method allows a crystal growth with a lower temperature and lower pressure in comparison with other liquid phase methods. The crystal formed by the flux method has a low dislocation density advantageously lower than 106 cm−2.
There is a report that gallium nitride crystal is formed under conditions that sodium azide (NaN3) and metal Ga which are used as source materials are put and sealed in a reactor vessel made of stainless material (as for sizes inside of the vessel, inner diameter is 7.5 mm, length is 100 mm) under a nitrogen atmosphere, and the reactor vessel is retained at 600 to 800 degrees Celsius for 24 to 100 hours (Chemistry of Materials Vol. 9 (1997) 413-416).
Japanese Patent Application Laid-open No. 2008-94704 discloses a method of manufacturing a column-like crystal of gallium nitride by using a needle-like crystal of aluminum nitride (AlN) as seed crystal in order to provide a large crystal of gallium nitride. Japanese Patent Application Laid-open No. 2006-045047 discloses a method of manufacturing a needle-like crystal of aluminum nitride which becomes a seed crystal. Japanese Patent Application Laid-open No. 2009-126771 discloses a seed crystal of which a yellow emission effect is observed, and a gallium nitride crystal which is formed on the seed crystal and has a crystal layer of which a yellow emission effect is not observed.
In a case that gallium nitride crystal is grown from aluminum nitride as seed crystal, however, the difference of lattice constant between aluminum nitride and gallium nitride may cause dislocations due to the lattice mismatch. Since thermal expansion coefficient is also different between aluminum nitride and gallium nitride, thermal stress may cause new dislocations or even cracks, in the course of cooling from a crystal growth temperature to a room temperature.
Therefore, it is preferable to use gallium nitride crystal as seed crystal which has the same lattice constant or the same thermal expansion coefficient with the target crystal, in order to grow a high quality gallium nitride crystal with low dislocation density. However, it is difficult to grow a needle-like crystal of gallium nitride by the method disclosed in Japanese Patent Application Laid-open No. 2006-045047.

Gallium nitride crystal, group 13 nitride crystal, group 13 nitride crystal substrate, and manufacturing method


The invention concerns a capacitor whereof one first electrode consists of a highly doped active region (D) of a semiconductor component (T) formed on one side of a surface of a semiconductor body, and whereof the second electrode consists of a conductive region (BR) coated with insulation (IL) formed beneath said active region and embedded in the semiconductor body.

1. Field of the Invention
The present invention generally relates to the forming of capacitors in integrated circuits, and in particular the forming of capacitors associated with sram cells.
2. Discussion of the Related Art
FIG. 1 shows an SRAM cell circuit with six transistors. The cell includes a memory point formed of two inverters I1 and I2 connected head-to-tail and having their two inputs, respectively BLTI, BLFI, connected to bit lines BLT, BLF by N-channel MOS transistors (NMOS) T1, T2. The gates of transistors T1 and T2 are connected to a word line WL. Inverter I1 comprises a PMOS transistor TP1 and an NMOS transistor TN1. The gates of transistors TP1 and TN1 are connected to terminal BLTI of the inverter. The drains of transistors TP1 and TN1 are connected and form the output terminal of the inverter. The sources of transistors TP1 and TN1 are respectively connected to a supply voltage VDD and a ground GND. Inverter I2 has the same structure and includes a PMOS transistor TP2 and an NMOS transistor TN2.
FIG. 2 shows a simplified top view of an embodiment in CMOS technology of the SRAM cell of FIG. 1. For simplicity, the P- and N-channel transistors are shown with the same gate widths. N-channel transistors T1, T2, TN1, and TN2 are formed in a P-type substrate (SUB) and P-channel transistors TP1 and TP2 are formed in an N-type well (NWELL). The drain regions of transistors TN1, T1, and TN2, T2 are confounded. The transistor gates, formed of polysilicon, are shown in hatchings. The gates of transistors TP1, TN1, respectively TP2, TN2, are interconnected. The drains of transistors TP1 and TN1 are connected to the gates of transistors TP2, TN2 by a conductive line formed in an upper metal layer (METAL1) via vias or contacts (the locations of which are shown with crosses). The drains of transistors TP2 and TN2 are connected to the gate of transistors TP1, TN1 by a conductive line formed in the same metal layer (METAL1). Vias form the contact between the source regions of transistors T1, T2, TN1, TN2, TP1, TP2 and metal lines, not shown, respectively connected to lines BLT, BLF and to voltages GND, GND, VDD, and VDD. The N-type well is grounded and the substrate is at a predetermined voltage. For clarity, the STI transistor insulation trenches have not been shown. The STI trenches are preferably the inverse of the active areas (drains or sources).
Inverters I1 and I2 form a bistable structure or memory point that can take two states. When transistors T1 and T2 are on, an appropriate control of bit lines BLT, BLF enables modifying the state of the memory point and thereby programming a piece of information. When transistors T1 and T2 are off, the memory cell keeps the information in the form of a charge on the gate capacitors of the transistors of one or the other of the inverters.
If an ionizing radiation hits cell 2, this creates parasitic electric charges that may change the stored state. Because recent SRAM cells are formed with MOS transistors having smaller and smaller dimensions, the gate capacitance of the transistors forming the inverters is smaller and smaller and the memory point is more and more sensitive to ionizing radiations, all the more as supply voltage VDD of the inverters is smaller and smaller.
To increase the resistance against ionizing radiations of an SRAM cell of small surface area formed with small-size transistors, it has been provided to couple the gates of the memory point transistors with additional capacitors. The problem of forming such capacitors without increasing the SRAM cell surface area then has to be overcome.


Methods, apparatuses, and systems for comparing threshold voltages of a plurality of flash memory cells to a plurality of reference voltages. A number of flash memory cells having threshold voltages that fall within each bin of a plurality of bins is determined. The plurality of bins each represent a plurality of threshold voltage ranges. A threshold voltage distribution of the plurality of flash memory cells is calculated based at least in part on the number of flash memory cells that fall into each of the bins.

Flash memory employs floating gate transistors in a plurality of memory cells. One or more charge levels may be programmed onto the floating gates of the floating gate transistors in order to store data. The threshold voltage level of a floating gate transistor depends on the level of charge programmed therein. Thus, the data stored within flash memory is read by comparing the threshold voltages of the floating gate transistors to one or more reference voltages. This mechanism is used in both single-bit and in multi-bit flash memories.
A floating-gate transistor is capable of storing a voltage on its "floating gate" for a period, typically many years. The threshold voltage of the floating-gate transistor will change depending on a value currently stored on the floating gate. In a single-bit flash cell, for example, the threshold voltage of the cell will be one of two voltages depending on the level of charge stored in the floating gate transistor. Thus, in some implementations of flash memory, the stored value is read by comparing the threshold voltage to a reference voltage. If the threshold voltage is less than the reference voltage, then the output is considered to be a first binary number (such as a 1). If the threshold voltage is greater than the reference voltage, the output is considered to be a second binary value (such as a 0). In a sense, a floating gate transistor has multiple threshold voltages, each exhibited only when a certain voltage is stored on the floating gate.
The levels of these multiple threshold voltages of a floating gate transistor will change over time due to physical changes after repeated erase and program cycles, or for other reasons. A group of flash memory cells will therefore exhibit a change in their overall threshold voltages distribution over time. And if the threshold voltages change as a memory device ages, then it can be useful to adjust the reference voltages used to read the memory cells as the device gets older. This can, for example, result in lower error rates. If the reference voltages are not varied, the device may exhibit higher error rates as it ages.
The description in this section is related art, and does not necessarily include information disclosed under 37 C.F.R. 1.97 and 37 C.F.R. 1.98. Unless specifically denoted as prior art, it is not admitted that any of the described related art is prior art.

Determining threshold voltage distribution in flash memory


This invention relates to a machine-tool incorporating a mobile standard and a horizontal broach, wherein the mobile standard is disposed between a fixed lower base and a fixed upper base connected together by a rigid static support located behind the mobile standard, and is guided at each of its ends by parallel guiding means provided on said bases. The mobile standard is, moreover, driven at each of its ends by synchronized drive means.

All heretofore known machine-tools for milling, boring, and drilling that incorporate a mobile standard and a horizontal broach, present a mobile standard resting on a sole plate which slides on a fixed base, itself connected to a solid concrete mass. The broach is mobile vertically along the standard and may move horizontally along a perpendicular to the plane of displacement of the standard. These machines enable workpieces of very large dimensions, which remain fixed during the work, to be machined.
Such machines present two major drawbacks connected with their design. In the first place, they present a rigidity which varies with the vertical position of the broach, which means that they do not make it possible to carry out, under good conditions, either machining of blanks or finishing work when the broach is in a high position, due to the vibrations resulting from the lack of rigidity in the case of blanks and due to the deformations which are amplified as soon as the ratio of the height of the broach to the width of the slide rails increases in the case of finishing work. Secondly, the dimensioning of the standard necessary for obtaining a minimum rigidity results in the mobile assembly becoming very heavy, which means that these machines are relatively slow in their displacements and in their accelerations.
It is an object of the present invention to overcome these drawbacks and to propose a machine-tool incorporating a mobile standard and a horizontal broach, which allows perfect machinings both of blanks and for finishing, and which is rapid and precise.

Horizontal broach with a mobile standard


An image processing system includes an access point, an image processing apparatus, and a communication system. In the image processing apparatus, an apparatus side access point information holding section holds access point information of an access point acquired from the access point. In the communication terminal, a terminal side access point information holding section holds access point information of an access point acquired from the access point. A search section searches for the image processing apparatus having the same access point information as the access point information based on the access point information held in the terminal side access point information holding section. The instruction section transmits a processing instruction to the image processing apparatus detected by the search section.

The present disclosure relates to an image processing system, an image processing method, and an image processing apparatus.
Recently, image processing apparatuses such as a printer, a copier, and a multifunction peripheral have become a necessity in offices, and the like. Such image processing apparatuses are configured to print image data input from an information processing terminal such as a personal computer through a network such as a local area network (LAN) on paper, or transmit acquired image data to the information processing terminal, in addition to carrying out the acquisition and printing of the image data by a direct operation of a user. Further, a plurality of image processing apparatuses may be often installed on such a network and a user may select a desired image processing apparatus to carry out the printing of the image data, and the like.
When the plurality of image processing apparatuses are present on the network, a user who is unable to figure out a name of the image processing apparatus on the network and an installation position of the real image processing apparatus may not transmit the image data or receive the image data from the image processing apparatus, for example, even when the image processing apparatus is present in front of the user's eyes. Further, when the image processing apparatus is approximately selected, printed matter may be output to an unexpected place, such that the printed matter may not be withdrawn. Further, recently, wireless networks such as a wireless LAN have been proliferated. In such a wireless network, the installation position of the image processing apparatus and the information processing terminal may be easily changed. Therefore, it is more difficult to recognize the installation position of the image processing apparatus from the name of the image processing apparatus which is displayed on the information processing terminal.
For this reason, under the condition that the plurality of image processing apparatuses are installed on the network, various technologies enabling a user to easily output the printed matter from the image processing apparatus in the vicinity of the user using the wireless network and the like have been proposed.
For example, a technique of allowing the image processing apparatus carrying out the output of the image data and the acquisition of the image data and a computer wanting to print the image data and receive the image data to detect an intensity of a zone signal transmitted from each of the plurality of wireless base stations to recognize a control zone (a corresponding zone) of a wireless base station to which the image processing apparatus and the computer belong and a control zone (a neighboring zone) of a neighboring wireless base station has been proposed. In this configuration, the corresponding zone and the neighboring zone recognized by the computer and the image processing apparatus are registered in a server as zone data. For example, when the computer carries out the printing, the computer acquires the zone data from the server and selects the image processing apparatus belonging to the same zone as the zone of the computer based on the corresponding zone data to select the image processing apparatus which is present in the vicinity of the computer.
Further, a technique of including a positioning server calculating a position of the mobile station as a position of the computer based on received results of a radio wave for position detection which is transmitted from a mobile station moving along with the computer or one of the plurality of base stations fixedly installed in known positions and received by another one thereof has been proposed. In this configuration, the position information of the plurality of printers is stored in the positioning server as a database and a distance between the position of the computer and the printer is calculated. Further, the printer having the shortest calculated distance carries out the printing.

Image processing system, image processing method, and image processing apparatus