The intraosseous implant intended to be fitted in a bone is provided on the surface with a specific roughness, the implant surface having depressions (1) with a depth (c) of about 20 xcexcm to about 60 xcexcm. At the bottom of the depressions (1) there are base faces (2), and between the depressions (1) there are plateau faces (3). Base faces (2) and plateau faces (3) have a horizontal extent (a, b) of about 10 xcexcm to about 20 xcexcm. These depressions (1) are ideally as smooth as possible, i.e. they have no surface roughness below the cellular dimension. Obliquely ascending side faces (4) extend from the base faces (2) to the plateau faces (3), and the angle of inclination (xcex1) between the horizontal and the side faces (4) is about 30xc2x0 maximum. Below the upper neck portion, the implant has a self-tapping thread, and the neck portion of the implant is provided with a porcelain-like coating. The surface energy and surface tension of the implant are kept as low as possible. Materials which can preferably be used for the implants are titanium, titanium-based alloys or porcelain-like substances. The surface structure results in an implant which, while providing sound immediate postoperative primary stability, is also distinguished by an accelerated and increased load-bearing capacity on account of more intensive osseointegration.

The invention relates to an implant to be surgically fitted in bone, preferably human bone, and covers for example the areas of osteosynthesis, prosthetics (in surgery of the hands, feet, hips and limbs), and maxillofacial and dental implantology. The invention in particular concerns the design of the implant and of its surface for the purpose of achieving immediate primary stability and rapid osseointegration.
There are two requirements regarding the stability of an implant:
a) an as far as possible immediate postoperative load-bearing capacity, i.e. immediate primary stability, which is based solely on mechanical principles; and
b) as rapid as possible secondary stability by means of osseointegration, which follows biological principles.
Apart from the quality of implantation and the local conditions in the area surrounding the implantation site, it has been recognized that a critical factor regarding the primary stability of the implant is its design, and that an outer screw thread delivers the best results for immediate stability. By contrast, osseointegration is crucially dependent on the choice of material (titanium and titanium-based alloys and porcelain-like substances are being increasingly used in this connection) and on the surface characteristics of the implant.
In GB-A-2,045,083, a surface roughness of the order of 0.01 xcexcm to 0.3 xcexcm is recommended. EP-B-0,388,576 proposes an ideal implant surface with a macro-roughness of more than 10 xcexcm, preferably more than 20 xcexcm, on which a micro-roughness of the order of 2 xcexcm and finer is superimposed. Treating the implant surface with an abrasive is proposed in order to generate the macro-roughness, and etching in acid is proposed in order to generate the micro-roughness. WO-A-97/28760 discloses, for osteosynthesis screws, a roughness value Rt of ca. xe2x89xa710 xcexcm (maximum peak-to-valley height). According to Schroeder, A.; Sutter, F.; Buser, D.; Krekeler, G. (Orale Implantologie [Oral implantology], Georg Thieme Verlag, Stuttgart, 2nd edition, 1994, pages 48 et seq.), a plasma coating with a layer thickness of ca. 20-40 xcexcm and a peak-to-valley height of ca. 15 xcexcm is applied to the implant surface in order to increase the surface and promote osseointegration. In general, specialists in this field are of the firm opinion that macro and micro roughnesses, particularly in combination, promote the anchoring of intraosseous implants in the bone.
U.S. Pat. No. 4,865,603 discloses prosthetic implants which have a surface with a structure. The structure comprises first and second depressions, the dimensions of the second depressions being in the range of 25% to 75% of the dimensions of the first depressions. The dimensions of the first depressions, in particular the width, are in the range of between 200 xcexcm and 1000 xcexcm, preferably between 300 xcexcm and 700 xcexcm, and consequently the dimensions of the second depressions lie in the range of 50 xcexcm to 750 xcexcm, preferably in the range of 75 xcexcm to 525 xcexcm. The depth of the first depressions and also of the second depressions lies in principle in the range of the dimension, in particular the width, of the respective depressions. The second depressions can be groove-shaped or diamond-shaped in configuration.
Although previous measures have brought some progress in terms of primary and secondary anchoring of intraosseous implants in bone implant sites, further improvements are nevertheless desired in order to increase the rate of success of the implants, shorten overall surgical procedure and thus impose less strain on the patient and ensure that the patient can return more quickly to a by and large normal lifestyle.
In view of the aims set out above, it is an object of the invention to create, for intraosseous implants, a surface structure which gives a high degree of primary stability immediately following surgery and which promotes rapid and as intensive as possible biological osseointegration of the fitted implant.
The main features of the invention can be summarized as follows:
The intraosseous implant intended to be fitted in a bone is provided with a specific roughness on the surface, said implant surface having a multiplicity of depressions with a vertically measured depth of 20 xcexcm to 60 xcexcm, between which there are plateau faces. At the bottom of the depressions there are base faces, and side faces extend from the base faces to the plateau faces. The base faces and the plateau faces have a horizontal extent of in each case 10 xcexcm to 20 xcexcm. The depressions and the plateau faces are smooth, i.e. they have no surface roughness which although below the cellular dimension of osteogenetic cells is nevertheless in the same order of magnitude.
The side faces of the depressions preferably form an angle of inclination relative to the horizontal of about 30xc2x0 maximum. The implant preferably has an upper neck portion, and below this upper neck portion, a self-tapping thread. The neck portion of the implant can be provided with a porcelain-like coating. The surface energy, or xe2x80x9czeta potentialxe2x80x9d, and the surface tension of the implant are kept preferably as low as possible. Materials used for the implants are preferably titanium, titanium-based alloys or porcelain-like substances. The depressions are preferably designed as systematically trapezoid grooves extending parallel to one another, said grooves being generated mechanically.
By virtue of the invention, an implant is now available which, while providing sound immediate postoperative primary stability, is distinguished, on account of improved osseointegration in terms of the biological union of the bone and the implant surface, by an accelerated and increased load-bearing capacity in terms of secondary anchoring.
The intraosseous implant intended to be fitted in a bone is provided with a specific roughness on the surface, where said implant surface:
a) has a multiplicity of depressions with a vertically measured depth of about 20 xcexcm to about 60 xcexcm;
b) at the bottom of the depressions there are base faces, and between the depressions there are plateau faces, said base faces and plateau faces having a horizontal extent of about 10 xcexcm to about 20 xcexcm;
c) side faces extend from the plateau faces to the base faces; and
d) the depressions and the plateau faces are ideally as smooth as possible, that is to say they have no surface roughness below the cellular dimension.
The side faces of the depressions form an angle of inclination relative to the horizontal of about 30xc2x0 maximum. Below the upper neck portion, the implant has a self-tapping thread, and the neck portion of the implant is provided with a porcelain-like coating. The surface energy, or xe2x80x9czeta potentialxe2x80x9d, and the surface tension of the implant are kept as low as possible. Materials used for the implants are preferably titanium, titanium-based alloys or porcelain-like substances. The depressions are preferably designed as systematically trapezoid grooves extending parallel to one another, said grooves being generated mechanically.
By virtue of the invention, an implant is now available which, while providing sound immediate postoperative primary stability, is distinguished, on account of improved osseointegration in terms of the biological union of the bone and the implant surface, by an accelerated and increased load-bearing capacity in terms of secondary anchoring.

Surface structure for intraosseous implant


A guidewire for use in ear, nose and throat procedures may include an elongate core wire having a proximal region and a distal region. The distal region of the core wire may include a flattened portion adapted to provide preferential flexure along at least one axis of the wire. The distal region of the core wire may include a tip portion distal of the flattened portion, where at least one cross-sectional dimension of the tip portion is greater than at least one cross-sectional dimension of the flattened portion. The guidewire may include an outer coil disposed around at least a portion of the elongate core wire. The guidewire may also include an atraumatic tip coupled to the core wire or the outer coil.

Embodiments of the present invention relate generally to medical devices and methods and more particularly to minimally invasive devices, systems and methods for treating sinusitis and other ear, nose & throat disorders.
The human head includes a number of hollow cavities called paranasal sinuses, which connect to the nasal cavity via small openings called "ostia" (singular "ostium"). Generally, the human head includes eight paranasal sinuses (two sets of four on each side), called the frontal, ethmoid, sphenoid and maxillary sinuses. The frontal sinuses are located in the forehead, the maxillary sinuses are in the cheeks, the ethmoids are under the eyes, and the sphenoid sinuses are farther back in the head, near the pituitary gland. Paranasal sinuses are lined with mucous-producing epithelial tissue and have cilia to sweep mucous out of the sinuses and through the ostia into the nasal cavity.
Sinusitis is defined as an inflammation of the paranasal sinus lining commonly caused by bacterial, viral and/or microbial infections, as well as structural issues such as block age of the sinus ostia. Symptoms include nasal congestion, facial discomfort, nasal discharge, headache, and fatigue. Sinusitis is considered acute when symptoms last 4 weeks or less. The disease is considered chronic when it lasts 3 months or longer. Sinusitis affects 37 million people each year, making it one of the most common health problems in the U.S. It is more prevalent than arthritis and hypertension and has a greater impact on quality of life than diabetes or congestive heart failure. Sinusitis is also responsible for $8 billion in direct healthcare expenditures and a significant loss of workplace productivity.
The initial therapy typically attempted when treating chronic sinusitis is drug therapy involving anti-inflammatory agents to reduce the inflammation and antibiotics to treat the infection. A large number of patients, however, do not respond to drug therapy and seek a surgical option. The most common surgical procedure currently performed for chronic sinusitis treatment is Functional Endoscopic Sinus Surgery (FESS).
In FESS, an endoscope is inserted into the nose and, under visualization through the endoscope, the surgeon removes diseased or hypertrophic bone and soft tissue in the nasal cavity and enlarges the ostia of the effected sinuses to restore normal drainage of the sinuses. Instruments used in FESS procedures are generally rigid surgical shavers, drills and burrs, and not only are the ostia enlarged during FESS procedures, but also anatomical structures are often removed just to gain access to the ostia with the rigid surgical tools. This removal of structures increases the post-surgical pain and bleeding after FESS. FESS procedures are typically performed with the patient under general anesthesia and involve days or even weeks of recovery, with painful and uncomfortable post-surgical packing of the nasal cavity, bleeding and scarring requiring follow-up debridement procedures.
Due to the invasiveness of FESS procedures, many otolaryngologists consider FESS an option only for patients who suffer from severe sinus disease (e.g., those showing significant abnormalities under CT scan), and many patients who would benefit from a surgical solution to their chronic sinusitis nevertheless avoid surgery. Thus, patients with less severe disease may not be considered candidates for FESS and may be left with no option but drug therapy.
An alternative to FESS employs dilating balloons and related devices for less invasive sinus intervention. Examples of dilating balloons and related devices and their methods of use can be found, for example, in U.S. patent application Ser. No. 10/829,917, entitled "Devices, Systems and Methods for Treatment of Nasal and Sinus Disorders of the Ears, Nose and/or Throat" and filed on Apr. 21, 2004; Ser. No. 10/944,270, entitled "Apparatus and Methods for Dilating and Modifying Ostia for Paranasal Sinuses and Other Intranasal or Paranasal Structures" and filed on Sep. 17, 2004; Ser. No. 11/037,548, entitled "Systems and Methods for Treating Disorders of the Ear, Nose and Throat" and filed on Jan. 18, 2005; and Ser. No. 11/150,847, entitled "Devices, Systems and Methods Usable for Treating Sinusitis" and filed: Jun. 10, 2005, which are incorporated by reference in their entirety. Less invasive procedures of the type described in the above applications may sometimes be referred to as "Balloon Sinuplasty™" or more generally "Sinuplasty."
In addition to Balloon Sinuplasty™ devices, systems and methods, the assignee of the present invention has invented other devices, systems and methods for minimally invasive sinus procedures. For example, an irrigation catheter for use in the paranasal sinuses is described in U.S. patent application Ser. No. 12/011,100, entitled "Methods, Devices and Systems for Treatment and/or Diagnosis of Disorders of the Ear, Nose and Throat," and filed on Jan. 23, 2008, the full disclosure of which is hereby incorporated by reference. Another example is a lighted guidewire device for use in a Balloon Sinuplasty™ procedure, such as the embodiments described in U.S. patent application Ser. No. 11/522,497, entitled "Methods and Devices for Facilitating Visualization in a Surgical Environment," and filed Sep. 15, 2006, the full disclosure of which is hereby incorporated by reference.
In some Balloon Sinuplasty™ procedures, as well as in other procedures invented by the assignee of the present invention, such as paranasal sinus irrigation using an irrigation catheter device as described in the above-referenced patent application, a guidewire may be used for advancement and positioning of one or more devices in or through a paranasal sinus ostium and sometimes into a paranasal sinus itself. For example, in some procedures a guidewire may be advanced through an angled guide catheter, through a paranasal sinus ostium, and into a paranasal sinus. A balloon catheter may then be advanced over the guidewire to position a balloon of the catheter in the paranasal sinus ostium, and the balloon may then be inflated to expand the ostium. In some cases, the balloon catheter and guidewire may then be removed from the paranasal sinus by pulling them back through the angled guide catheter. Optionally, the same guide catheter, guidewire and balloon catheter may be used to access and expand multiple paranasal sinus ostia in one patient.
Although the assignee of the present invention has previously developed guidewires for use in such procedures, improvements are continually being sought. For example, when a distal end of a guidewire is passed into a sinus, it is often advantageous to continue to pass an additional length of guidewire into the sinus, thus causing it to curl and turn up on itself and thus facilitating confirmation of the location of the guidewire distal end in the sinus, using fluoroscopy. The distal end of the guidewire is also passed in and out of an angled guide catheter at least once and often more than once. These two parts of the procedure may often cause the guidewire to kink or bend, and this kinking or bending may make it very difficult or impossible to access subsequent paranasal sinuses in the same patient with the same guidewire. Ideally, the guidewire distal portion should be flexible enough to pass through tortuous anatomy without damaging the anatomy while also resistant to kinking and bending. The ideal guidewire should also be pushable, to allow it to be advanced through a guide catheter. Such a guidewire should also be sufficiently strong to support a balloon catheter, irrigation catheter or other device that is passed over it.
The challenges faced by a guidewire for paranasal sinus procedures are also much more daunting than those faced by a guidewire used in cardiology vascular applications. For example, the anatomy in the nasal cavity and paranasal sinuses is composed of bone covered in soft tissue, formed into many folds, twists and turns, so the sinus guidewire faces both hard tissue that it must navigate and soft tissue that it ideally will leave relatively undamaged. The circumference and shape of the paranasal sinus cavities vary significantly from patient to patient and within a patient. The circumference of a sinus cavity may vary from about 0.5 cm to about 10 cm within a patient. Based on the size of the sinus cavity, the amount of guidewire that is positioned in the sinus also can vary significantly. The amount of guidewire that is positioned in the sinus can also vary based on physician preference as well as support needed during passage of devices. The guidewire must also pass in and out of an angled guide catheter that is usually at least partially rigid while still retaining approximately it overall shape. Further, the guidewire must provide support for the balloon catheter, irrigation catheter or other device being advanced over it.
Thus, there is a need for devices and methods for easily navigating the complex anatomy of the nasal cavities and paranasal sinuses and for treating disorders of the paranasal sinuses with minimal complications due to individual variations in anatomy and causing minimal trauma to or disruption of anatomical structures that are not pathogenic. Specifically, there is a need for a guidewire that balances flexibility and ease of use with the resilience and rigidity to provide support for a balloon catheter, irrigation catheter and/or other device(s).

Corewire design and construction for medical devices


A color space converter converts data points from one color space to another color space using a lookup table. Color space converters may be used in any device that involves image processing, such as displays and printers. An interface receives an input value in a first color space. A controller access a lookup table stored in memory to determine an upper bound and a lower bound of a subset of the color space. An output value is interpolated between the upper bound and the lower bound using interpolation values. The interpolation values of the last subset in any dimension of the color space are modified by a scale factor to approximate ideal values.

The background description provided herein is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventor, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.
The science of quantifying the human perception of color, or "colorimetry," defines colors as vectors in a color space or color model. The conversion of vectors from one color space to another color space using a mapping function is commonly used in image processing for printing or displaying images. For example, when an image input device, such as a scanner, a digital camera, or a computer, uses a different color space than that of an image output device, such as a printer or a display, color space conversion is typically performed to maintain the color integrity of an image.
Color space conversion is generally a challenging process because the mapping function from one color space to another color space is rarely linear. That is, the conversion algorithm necessary for one area in the color space is not effective in a second area in the color space. Rather than mathematically performing the color space conversion, a look up table may be used to perform cost effective color space conversion.
A typical example of a color space includes three color components, with each color component represented by eight bits, or 24 bits total for all of the color components of any given color in the color space. Using this example, there are (28)3 possible colors, requiring a lookup table large enough to store 224 values for both the input and output color spaces.

This patent is subject to a terminal disclaimer.


An organic electroluminescent display device of the present invention includes: a substrate; an anode (first electrode); an organic layer including a light-emitting layer; a cathode (second electrode); a reflective layer and a semi-transmissive reflective layer provided to interpose an organic layer; and a plurality of sub-pixels of different colors in which light emitted from the organic layer is repeatedly reflected between the reflective layer and the semi-transmissive reflective layer such that light of a specific wavelength is enhanced and emitted. The substrate is bent or curved, and an optical path length between the reflective layer and the cathode (semi-transmissive reflective layer) in a sub-pixel of a predetermined color of a flat region (first region) is different from an optical path length between the reflective layer and the cathode (semi-transmissive reflective layer) in a sub-pixel of a same color as the predetermined color of a bent region (second region).

In an organic electroluminescent display device, a structure in which light emitted from a light-emitting layer is multiply-reflected between a pair of reflective layers to resonate, a so-called microcavity structure, has been proposed to improve color purity and efficiency in extracting light. If light resonates between the pair of reflective layers, there are effects that an emission spectrum becomes steep and light intensity of a peak wavelength is increased. For example, in Patent Document 1 below, an organic light-emitting display device which includes a bottom electrode, a top electrode, and a dielectric alternate laminated film, and has the microcavity structure configured of the dielectric alternate laminated film and the bottom electrode is disclosed. "Electroluminescent" is hereinafter abbreviated as "EL."

Organic electroluminescent display device having bent type or curved surface type display


A compact survival firearm is a rifle having an upper receiver body, a lower receiver body removably connectable to the upper receiver body and defining a transverse bore adapted to closely receive a takedown pin, a fastener connected to the upper receiver body and having a protruding portion protruding therefrom, the lower receiver body defining a space sized to closely receive the fastener, the protruding portion of the fastener having an end portion of a first width, and an intermediate portion of a second width less than the first width, and the space at least partially intersecting the transverse bore such that the intermediate portion of the fastener is clear of the bore to permit the presence of the takedown pin, and the end portion of the fastener prevents separation of the upper receiver from the lower receiver when a takedown pin is present in the bore.

Compact firearms are desirable for outdoor activities, particularly those occurring in remote areas, including backpacking, boating, camping, backcountry flying, mountain biking, and hunting. A compact rifle is particularly attractive relative to a pistol because of the rifle's increased accuracy and range.
Since the compact firearm is often carried on the body, low weight is also desirable in addition to the ability to fit in a small space. Aluminum and plastic are attractive materials because of their light weight and low cost. However, a firearm made out of aluminum or plastic has the risk of apertures stretching over time from discharge impulses and denting caused by wear. In the case of an aluminum or plastic rifle, the mating engagement between the upper receiver and the lower receiver can become loose over time or as a result of subsequent firearm manufacturing activities after the receivers are initially made. Any looseness can lead to worsening accuracy over time and a perception of the firearm having poor quality on the part of the user.
Therefore, a need exists for a new and improved compact survival firearm that can be easily adjusted to compensate for loosening of the mating engagement between the upper receiver and the lower receiver. In this regard, the various embodiments of the present invention substantially fulfill at least some of these needs. In this respect, the compact survival firearm according to the present invention substantially departs from the conventional concepts and designs of the prior art, and in doing so provides an apparatus primarily developed for the purpose of enabling easy adjustment to compensate for loosening of the mating engagement between the upper receiver and the lower receiver.


A method, apparatus, and computer implemented instructions for generating antialiased lines for display in a data processing system. Graphics data is received for display, wherein the graphics data includes primitives defining lines. A gamma correction is applied to the graphics data on a per primitive basis to form antialiased lines. The antialiased lines are displayed.

1. Technical Field
The present invention relates generally to an improved data processing system and in particular to a method and apparatus for processing data. Still more particularly, the present invention provides a method and apparatus for processing graphics data.
2. Description of Related Art
Data processing systems, such as personal computers and work stations, are commonly utilized to run computer-aided design (CAD) applications, computer-aided manufacturing (CAM) applications, and computer-aided software engineering (CASE) tools. Engineers, scientists, technicians, and others employ these applications daily. These applications involve complex calculations, such as finite element analysis, to model stress in structures. Often, modeling of these complex structures requires computer generated surfaces and lines that describe the features of physical models. Other applications include chemical or molecular modeling applications. CAD/CAM/CASE applications are normally graphics intensive in terms of the information relayed to the user. Data processing system users may employ other graphics intensive applications, such as desktop publishing applications. Generally, users of these applications require and demand that the data processing systems be able to provide extremely fast graphics information.
The processing of a graphics data stream to provide a graphical display on a video display terminal requires an extremely fast graphics system to provide a display with a rapid response. In these types of graphics systems, primitives are received for processing and display. A primitive is a graphics element that is used as a building block for creating images, such as, for example, a point, a line, a polygon, or text. A primitive is defined by a group of one or more vertices. A vertex defines a point, an end point of an line, or a corner of a polygon where two lines intersect. Data also is associated with a vertex in which the data includes information, such as positional coordinates, colors, normals, and texture coordinates. Commands are sent to the graphics system to define how the primitives and other data should be processed for display.
When lines are displayed on a display screen, a "stair stepping" or "jagged" appearance may be seen depending on the resolution of the display. This visual artifact is a manifestation of a sampling error called aliasing. Graphics adapters typically support a gamma adjustment on a screen or window basis that lightens or darkens the contents of the entire screen or window. Antialiasing techniques are implemented for smoothing or correcting this artifact. These techniques typically specify gradations in intensity of neighboring pixels near the edges of primitives, rather than setting pixels to maximum or zero intensity. These techniques essentially blur the lines by strategically adding pixels with a lower color intensity along the mathematical center of the line. As a result, lines normally one pixel in width are rendered as two or more pixel width lines. These techniques tend to dampen or dilute the intended color intensity for the lines.
Therefore, it would be advantageous to have an improved method and apparatus for correcting artifacts or aliasing in text, points, lines, or triangles.

Method and apparatus for generating gammacorrected antialiased lines

International Business Machines Corporation


A battery-cooling system includes a battery array and a plurality of heat pipes that each include a low-profile extrusion having a plurality of hollow tubes formed therein. A heat transfer fluid is disposed in the plurality of hollow tubes. Each heat pipe includes an evaporator portion and a condenser portion. The evaporator portion is disposed between successive batteries within the battery array and the condenser portion is disposed outside of the battery array and exposed to a heat sink.

Field of the Invention
The present application relates generally to battery cooling systems and more particularly, but not by way of limitation, to battery cooling systems incorporating heat pipes constructed with low-profile extrusions adapted for select heat exchange and designed for use with a battery array.
History of the Related Art
Dependence on non-renewable carbon-based energy sources, such as, for example, oil, gas, coal, and the like has led to intense focus on development of alternative energy sources. Moreover, detrimental environmental effects believed to be associated with carbon-based fuels have contributed to an urgency with which alternative energy sources are developed.
Chief among alternative energy initiatives is development of alternatively-fueled vehicles. In the United States alone, each passenger vehicle is estimated to release in excess of approximately 11,000 pounds of carbon dioxide along with smaller amounts of various other pollutants. Pollution worsens air quality and, in many cases, leads to respiratory problems. In addition, carbon-based pollutants are commonly believed to be a contributing factor in climate change and global warming.
The last decade has seen progress in development of alternatively-fueled vehicles. Vehicles fueled by, for example, natural gas, present cleaner and cheaper alternatives to traditional gasoline-powered vehicles. In addition, hybrid vehicles, combining a small gasoline-powered engine with a battery backup, have been developed. While these developments certainly amount to improvements in existing technology, the long-term goal of automotive research and development is development of an economical electric-powered vehicle.
Development of electric-powered vehicles present unique challenges to auto manufacturers. For example, electric-powered vehicles typically require a potential difference of approximately 36 to approximately 48 Volts. Most commercially-available electric-powered vehicles generate the required voltage with a large battery array. Such an array can include, for example, between six and nine 12-Volt batteries. The requirement of a large battery array presents a number of design challenges. First, a battery array generates considerable heat that must be dissipated to a heat sink. Second, a battery array must be efficiently sized to fit within space-confined areas of a passenger vehicle. Consequently, any cooling system for the battery array must also be economically sized.


A cybersecurity system for managing cyber behavior associated with cyber actors such that the cyber behavior can be computed and predicted and cyber interactions between the cyber actors can be created. The system includes a cyber behavioral space management module configured to receive input data, and data from the interaction engine and the analytic workflow engine, and to generate a plurality of cyber behavioral spaces based on the received data. The system includes an interaction engine configured to process cyber actor data to facilitate interactions with the cyber behavioral space, a cyber scene, a cyber map, and another cyber actor. The system includes an analytic workflow engine configured to analyze the cyber behavioral spaces and update cyber data based on the analyzed data and the interaction engine data. The system includes a visualization engine configured to compute visualizations and transmit the visualizations for display.

Traditionally, network defenders review only fragments of information to help understand what is actually happening on their network. It can be extremely difficult and manpower intensive to simulate the entire network in order to look at potential courses of action, defensive maneuvers, and force on force scenarios. Current cybersecurity exercises allow defenders to play against each other, but the exercises do not cover all of the possible scenarios that could occur on the network. Each day, the number and complexity of new threats grow, and it becomes harder and harder for network defenders to keep up with current cyber operational systems.
Generally, companies and organizations work cybersecurity related issues independently. When they do share information, it is usually through industry or government policies and frameworks for facilitating the sharing of cybersecurity related data. The traditional practices for sharing information are not sufficient to handle the volume or the speed of the attacks. It does not allow companies to fully leverage the manpower available to actively defend within a network, nor among networks fighting to defend a sector, multiple sectors, or a nation.

Simulation and virtual reality based cyber behavioral systems


The present disclosure relates to power semiconductor modules. The teachings thereof may be embodied in modules with a power semiconductor component and methods, as well as a circuit arrangement. For example, a method may include: developing a thermal model of the power semiconductor module at a reference time point; establishing a reference temperature based on the thermal model; measuring a temperature-sensitive electrical parameter of the power semiconductor module during operation of the power semiconductor module; determining a current temperature from the measured temperature-sensitive electrical parameter of the power semiconductor module; calculating a temperature difference between the current temperature and the reference temperature; and determining a deterioration of the power semiconductor module based on the calculated temperature difference.

Power semiconductor modules may comprise a power inverter or a converter and generally at least one power semiconductor chip or a power semiconductor component. The latter may control and switch high electrical currents and voltages. Such a power semiconductor component may include a power metal-oxide field effect transistor (power MOSFET), a power diode, or a bipolar transistor with an insulated gate electrode (insulated-gate bipolar transistor, abbreviated to IGBT). To form the power semiconductor module, the power semiconductor components are usually soldered onto a substrate and connected to each other electrically by bond connections.
Power semiconductor modules can be characterized by an expected lifetime. The lifetime corresponds to the time until the power semiconductor module fails or becomes functionally non-viable. During operation of the power semiconductor module a remaining lifetime of the power semiconductor module can change through a deterioration of the power semiconductor module, for example. In particular, the remaining lifetime of the power semiconductor module reduces if the power module deteriorates.
The deterioration of the power semiconductor module may be accelerated during any operation in which the power semiconductor modules is subjected to thermal and mechanical stresses. These stresses can lead to a so-called thermomechanical fatigue of the power semiconductor module, which may result in the failure or a functional non-viability of the power semiconductor module (e.g., the end of the lifetime). Thermal stresses may include temperature change stresses from the electrical operation of the power semiconductor module as a result of different coefficients of thermal expansion of the materials in the power semiconductor module. Such examples may include fatigue at the electrical connection points, for example of bond connections and solder connections of the chip solder and of the system solder. The fatigue at the connection points may cause the bond connections or the solder connections to work loose, which leads to an increased temperature of the semiconductor chip. Thus the thermomechanical fatigue of the power semiconductor module causes the deterioration of the power semiconductor module to accelerate, which can lead to a reduced remaining lifetime and to a premature failure of the power semiconductor module.
To guarantee safe operation of the power semiconductor module, some systems use a prediction of the lifetime of the power semiconductor module. In the prior art, lifetime calculations may be based on lifetime curves and predetermined load profiles, and carried out with computer support. For this purpose, for example a temperature of the power semiconductor modules is monitored. In some systems, thermistors are soldered to the substrate along with the power semiconductor components. The spatial separation of the thermistors from the power semiconductor components inhibits the detectiong of exact transient temperatures of the chips, and reduces the accuracy of the lifetime calculations.
In some systems, equivalent thermal networks are created for the power semiconductor modules, on the basis of which conclusions can be drawn indirectly about the temperature of power semiconductor components. The electrical losses of the IGBTs and of the diodes can be calculated from current and voltage measurements or using the knowledge of the operating point of the power semiconductor module. Thus, although the temperatures of the power semiconductor components during operation can be calculated, no account is generally taken in the equivalent thermal networks of any deterioration of the power semiconductor components.
The teachings of the present disclosure may provide a solution through which a deterioration of power semiconductor modules can be determined more reliably and through this solution a remaining lifetime of the power semiconductor modules can be predicted more accurately. For example, some embodiments may include a method for characterizing a power semiconductor module comprising: determining a thermal model (4) of a power semiconductor module (1) at a reference time point; establishing a reference temperature (Tj,zth) on the basis of the thermal model (4) of the power semiconductor module (1); measuring at least one temperature-sensitive electrical parameter (TSEP) of the power semiconductor module (1) at at least one later point in time compared to the reference time point, during operation of the power semiconductor module (1); establishing a current temperature (Tj,tsep) of the power semiconductor module (1) from the at least one measured temperature-sensitive electrical parameter (TSEP) of the power semiconductor module (1); establishing a temperature difference (ΔT) between the current temperature (Tj,tsep) and the reference temperature (Tj,zth); and determining a deterioration of the power semiconductor module (1) on the basis of the temperature difference (ΔT) established.
In some embodiments, for creation of the thermal model (4), a thermal impedance of the power semiconductor module (1) describing a thermal path of the power semiconductor module (1) is determined.
In some embodiments, for creation of the thermal model (4), a power dissipation (P) of the power semiconductor module (1) is determined.
In some embodiments, for creation of the thermal model (4), a temperature (Tc) of a cooling element (3) of the power semiconductor module (1) is acquired during operation of the power semiconductor module (1).
In some embodiments, a power semiconductor module (1) is characterized, which has a IGBT as the at least one power semiconductor component (2).
In some embodiments, an electrical threshold voltage and/or a Miller plateau and/or a turn-on delay time and/or a turn-off delay time and/or a maximum speed of current increase (dI/dt|max) and/or a recovered charge and/or a tail current and/or a voltage peak UEE′max) during a turn-on process and/or a turn-on duration and/or a turn-off duration is measured as the at least one temperature-sensitive electrical parameter (TSEP).
In some embodiments, a characteristic curve (6) is determined, on the basis of which each value of the at least one temperature-sensitive electrical parameter (TSEP) is assigned a temperature value, wherein one of the temperature values is determined as a function of the measured temperature-sensitive electrical parameter (TSEP) as the current temperature (Tj,tsep).
In some embodiments, for determining the characteristic curve (6), the temperature values are predetermined for the power semiconductor module (1), the power semiconductor module (1) is set to the respective temperature value and the respective value of the at least one temperature-sensitive electrical parameter (TSEP) is measured at the predetermined temperature value.
In some embodiments, a heating device is provided for setting the temperature values, by means of which a temperature of the power semiconductor module (1) is increased step-by-step to the respective predetermined temperature values.
In some embodiments, the measurement of the at least one temperature-sensitive electrical parameter (TSEP) for creating the characteristic curve (6) is carried out at the respective predetermined temperature value by means of a double-pulse measurement circuit (10).
As another example, some embodiments may include a device for characterizing a power semiconductor module (1) during operation of the power semiconductor module (1). The device may include a measuring device for measuring at least one temperature-sensitive electrical parameter (TSEP) of the power semiconductor module (1) and a calculation device for establishing a current temperature (Tj,tsep) from the at least one temperature-sensitive electrical parameter (TSEP) and for calculating a temperature difference (ΔT) between a predetermined reference temperature (Tj,zth) and the current temperature (Tj,tsep).
As another example, some embodiments, may include a circuit arrangement, which has a power semiconductor module (1) with at least one power semiconductor component (2) and a device as described above.
In some embodiments, the power semiconductor module (1) comprises an inverter and at least one cooling element (3), wherein the inverter has at least one IGBT as the at least one power semiconductor component (2).
In some embodiments, the circuit arrangement has a control device (7), which is designed to regulate a power of the power semiconductor module (2) as a function of the temperature difference (ΔT) established.

Method for determining a deterioration of power semiconductor modules as well as a device and circuit arrangement


A method and apparatus for thermal storage having a movable manifold which discharges thermal transfer fluid to trickle through a particulate solid thermal storage medium to be collected for distribution or recirculation in a manner such as to establish a vertical thermocline within said thermal storage medium, said thermocline being movable horizontally with said manifold.

1. Field of the Invention
This invention relates to thermal storage methods and apparatus, and is particularly directed to thermal storage methods and apparatus whereby a movable manifold discharges a thermal transfer fluid, such as silicone oil, to trickle through a particulate solid thermal storage medium, such as a quantity of rocks, and to be collected thereafter for distribution or for recirculation in a manner such as to establish a vertical thermocline within said thermal storage medium, said thermocline being movable horizontally with said manifold.
2 Description of the Prior Art
In the current search for alternative sources of energy, considerable attention has been devoted to solar energy. Various techniques have been proposed for converting solar energy into thermal energy. Unfortunately, the prior art has taught no satisfactory method for storing thermal energy.
U.S. Pat. No. 3,369,541, issued Feb. 20, 1968 to Harry E. Thomason, discloses a prior art thermal storage system. However, in this system the liquid does not travel through the solid medium and does not provide a definitive thermocline.
U.S. Pat. No. 4,010,731, issued Mar. 8, 1977 to Henry Harrison, teaches a thermal storage system in which heat rises to the top of the solid medium only by convection. Moreover, a large quantity of thermal transfer fluid is required for Harrison's system, since he requires that the fluid completely fill all spaces between the solid medium.
U.S. Pat. No. 4,037,583, issued July 26, 1977 to Paul Bakun, teaches a thermal storage system employing separate manifolds for charging and extracting fluid. This requires that heat travel sideways through the bed by natural conduction and convection. This system also requires a large quantity of thermal transfer liquid and it appears unlikely that this system would provide a thermocline.
U.S. Pat. No. 4,059,226, issued Nov. 22, 1977 to David L. Atkinson, teaches a thermal storage system that uses only air and rocks. No liquids are used. This system must be completely charged with heat before any heat can be withdrawn. The Atkinson system would appear to be expensive, since it requires a plurality of tanks together with the piping and valves necessary to guide the heat transfer fluid to the appropriate tank.


The present relates to a method, an electronic device and computer readable memory for incorporating a transition effect upon playing subsequent digital media elements. The method, device and computer readable memory concurrently manage a current and next media elements, and render the current and next media elements. The method, electronic device and computer readable memory further apply the transition effect to the current and next media elements; and play the current and next media elements with the applied transition effect.

The industry of video playback applications is widespread, with both personal and industrial applications. To play video content on electronic equipment such as a computer, a tablet, an intelligent phone and other electronic devices, a corresponding media player must be installed. Various video formats require different media players, oftentimes reducing the compatibility between media players.
Multiple video media element may further be played subsequently. In such instances, a transition effect between the video media element is usually introduced to render the viewing experience more pleasant and eliminate any abrupt passage between video media element. Currently, software provides pre-production transition effect between video media element. Video media editors such as Final Cut Pro® and Windows Movie Maker® allow users to select and introduce a transition effect between two images or video media element. The resulting video media element is a newly encoded video media element including the two video media element and the selected transition effect in a pre-encoded combined video media element.
Computing the pre-encoded combined video media element with current methodologies and software available today on the market require important processing capability, making its application to real-time solutions unsuitable. There is therefore a need for a media player and a method for adding transition effect between two subsequent video media element, suitable for real time applications such as for example digital signage.

Media element transition electronic device, method and application


An image forming apparatus wherein a plurality of toner images having different colors from each other are successively formed on an image carrier, and the plurality of toner images formed on the image carrier are transferred to a transfer member carried on a transfer member carrier in such a condition that the plural toner images are successively overlapped with each other to thereby form an image, characterized in that the image forming apparatus comprises a pawl-shaped stripping member for stripping the transfer member from the transfer member carrier while being made in contact with a surface of the transfer member carrier at a predetermined timing; a volume electric resistance value of at least a portion of the pawl-shaped stripping member, which is made in contact with the transfer member, is selected to be greater than, or equal to 10 .OMEGA..cm, and smaller than, or equal to 10.sup.7 .OMEGA..cm; otherwise a surface electric resistance value thereof is selected to be greater than, or equal to 10 .OMEGA./cm, or smaller than, or equal to 10.sup.7 .OMEGA./cm.

The present invention relates to an image forming apparatus such as an electrophotographic copying machine and a printer, in which a plurality of toner images having different colors are successively formed on a photosensitive drum, and a plurality of toner images formed on the photosensitive drum are transferred to a transfer member carried on a transfer drum under such a condition that these plural toner images are successively overlapped with each other, to thereby form an image. More specifically, the present invention relates to a technique for stripping (exfoliating) the transfer member carried on the transfer drum.
Conventionally, as an image forming apparatus using this sort of transfer drum, there is an image forming apparatus in which a plurality of toner images having different colors such as cyan, magenta, yellow, and black are successively formed on a photosensitive drum, and then the plural toner images formed on this photosensitive drum are transferred to a transfer member such as a transfer paper carried on a transfer drum under such a condition that these toner images are successively overlapped. Then, in this image forming apparatus, after a predetermined member of toner images attracted on the transfer drum have been transferred onto the transfer member in the multiple mode, this transfer member is stripped (exfoliated) from the surface of the transfer drum, and then the toner image is fixed on the transfer member by way of a fixing device. At this time, in order to firmly strip the transfer member from the surface of the transfer drum, such a stripping (exfoliating) apparatus as a stripping finger whose tip portion is made sharp is used in this image forming apparatus.
For instance, as shown in FIGS. 19 to 21, as this stripping apparatus, the stripping finger 100 made of the plate-shaped metal member whose width is made narrow is made in contact with the transfer film 101 for forming the surface of the transfer drum at a predetermined timing, and the tip portion of the stripping finger 100 is made sharp. After the transfer member 102 is stripped from the transfer film 101 by way of the sharp tip portion of the stripping finger 100, the transfer member 102 is lift up by the upper surface of the stripping finger 100, so that the transfer member 102 is stripped from the surface of the transfer drum (disclosed in Japanese Laid-open Patent Application No. Hei. 1-254,986). Also, in the above-described stripping apparatus, to assist the stripping effects of the stripping finger 100, a plurality of stripping guide members 103 are arranged at both sides of the stripping finger 100, which may float the transfer member 102 stripped from the surface of the transfer drum by this stripping finger 100. Then, these plural strip guide members 103 are fixed to the supporting member 104 in an integral form of the stripping finger 100. This supporting member 104 is pivoted at a predetermined timing, so that the tip portion of the stripping finger 100 is made in contact with the surface of the transfer film 101.
However, in the case of the above-described conventional image forming apparatus, since a plurality of strip guide members 103 are pivoted in conjunction with the stripping finger 100, the strip guide members 103 would approach to the transfer drum up to the unwanted distance when the stripping finger 100 picks up the transfer member 102. Therefore, when the stripping fingers 100 pick up the transfer member 102, the positions of the strip guide members 103,103, - - - , are defined to the positions for avoiding interference with the transfer drum. In other words, if the strip guide member 103 is set to the position for avoiding interference with the transfer drum when the stripping fingers 100 pick up the transfer member, the strip guide member 103 is returned to the original position after the stripping fingers 100. When the transfer member 102 is picked up by the strip guide member 103, the tip portion of the strip guide member 103 has passed the upper side of the transfer member 102, and thus this transfer member 103 is not picked up. Therefore, there is a problem that a jam happens to occur.

Image forming apparatus having a device for stripping a transfer member carried on a transfer drum


A semiconductor device has a semiconductor substrate, a first interconnect made of a copper-containing metal which is formed over the semiconductor substrate, a conductive first plug formed over the first interconnect and connected to the first interconnect, a Cu silicide layer over the first interconnect in an area other than the area where the first plug is formed, a Cu silicide layer over the first plug, and a first porous MSQ film formed over an area from the side surface of the first interconnect to the side surface of the first plug and covering the side surface of the first interconnect, the upper portion of the first interconnect and the side surface of the first plug.

1. Technical Field
This invention relates to a semiconductor device having a multilayer interconnect structure and a manufacturing process therefor.
2. Related Art
FIG. 21 is a cross-sectional view illustrating the configuration of a conventional semiconductor device. The semiconductor device 200 shown in FIG. 21 will be manufactured in accordance with the following procedure.
First, on a silicon substrate (not shown) are formed an SiO2 film 201 and a SiC barrier dielectric film 203. On the barrier dielectric film 203 is then deposited a porous SiOC film as a first Low-k (low dielectric constant) film 205 to a thickness of about 70 to 200 nm. On the first Low-k film 205 is deposited a hard mask SiO2 film (not shown) to a thickness of about 50 to 150 nm. Then, the hard mask SiO2 film and the porous SiOC film as the first Low-k film 205 are etched with a fluorocarbon based gas and ashed by a photolithography process, to form an interconnect trench. After forming a barrier metal film 211 and a copper interconnect 213 in the interconnect trench, an SiC film is formed as a barrier dielectric film 207. Then, on the film is further formed a porous SiOC film as a second Low-k film 209, which is processed as described above, to form a via hole 215. Thus, there is provided the semiconductor device 200 shown in FIG. 21. Subsequently, a metal film is buried in the via hole 215 to form a via plug (not shown). The process is repeated to form a multilayer interconnect.
However, in the manufacturing process, as a dielectric constant of the insulating interlayer is decreased, film damage due to processing becomes more significant. Specifically, the process of etching and ashing with a fluorocarbon gas leads to formation of a damaged layer 217 in the exposed area in the first Low-k film 205 and the second Low-k film 209. In the area of the damaged layer 217, Si—CH3 bonds in the Low-k film are broken, leading to increase in a dielectric constant of the Low-k film. Furthermore, since a barrier dielectric film 203 with a relatively higher specific dielectric constant exists on the copper interconnect 213, it is difficult to reduce an effective dielectric constant.
In addition, peeling may occur in a stacked portion where on a layer in which the copper interconnect 213 is to be formed, that is, an interconnect layer, a layer with via plug and a smaller metal area than the interconnect layer is formed. Specifically, adhesiveness is poor between the porous SiOC film as the second Low-k film 209 and the SiC film as the barrier dielectric film 207. Therefore, during a T/C (thermal cycle) test after forming a multilayer interconnect and assembling, the films may be peeled due to a difference in a thermal expansion coefficient between the films, leading to a peeled interface 219.
Thus, there has been proposed application of metal cap technique on an interconnect instead of a barrier dielectric film.
FIG. 22 is a cross-sectional view illustrating the configuration of such a semiconductor device. The semiconductor device 210 shown in FIG. 22 does not have a barrier dielectric film 207 in contrast to the semiconductor device 200 shown in FIG. 21, and thus requires an etching stopper during forming a via hole. Therefore, the semiconductor device 210 has a cap metal film 221 over the copper interconnect 213. Over the cap metal film 221 is formed a Cu plug consisting of a barrier metal film 225 and a Cu film 227, on which is formed a cap metal film 229.
The semiconductor device 210 shown in FIG. 22 will be manufactured in accordance with the following process. On an SiO2 film (not shown) is formed an SiC barrier dielectric film 203, on which is then formed a porous SiOC film as a Low-k film. Then, an SiO2 film is formed on the porous SiOC film, to obtain a first stacked film 233. Subsequently, the first stacked film 233 is processed by using photolithography technique, to form an interconnect trench. Then, there are sequentially formed a barrier metal film 211, a Cu seed (not shown) and a Cu plating film to be a copper interconnect 213, and then an interconnect is formed in the trench by CMP. Next, a CoWP layer as a cap metal film 221 is formed on the interconnect by selective growth.
Then, as described above, on the cap metal film 221 is formed a second stacked film 235, in which is then formed a via hole. After forming a plug consisting of a barrier metal film 225 and a Cu film 227 in the via hole, a CoWP layer as a cap metal film 229 is formed on the plug by selective growth.
Japanese patent application NO. 2003-152077 has disclosed that in a multilayer interconnect structure formed by a dual damascene process, a tungsten film is formed as a cap metal film and the tungsten film on the bottom of a contact hole is removed.

Semiconductor device and manufacturing process therefor


In a method for automatically controlling a call-waiting-interruption restriction for a communication system, a subscriber is supplied with a call-waiting service permitting an interruption processing when an interruption call occurs. The subscriber is also supplied with a call-waiting-interruption restriction service for restricting the interruption processing even when the interruption call occurs. The interruption processing to the second subscriber is automatically restricted, when a first subscriber supplied with the call-waiting-interruption restriction service is in communication with a second subscriber supplied with the call-waiting service.

1. Field of the Invention
The present invention generally relates to a call-waiting service, and more particularly, to a method for automatically controlling a call-waiting-interruption restriction and a switching system, which can automatically restrict a call-waiting-interruption for a one-side subscriber, when the other-side subscriber communicating with the one-side subscriber is supplied with a call-waiting-interruption restriction service.
2. Description of the Prior Art
A call-waiting service in speech signal communication is widely used by conventional subscribers. And further, data communication such as telematique services including a facsimile is also used by the conventional subscribers, so that the same subscriber is often supplied with both services of the speech signal communication and the data communication.
In this case, it is desired that the call-waiting service be supplied for the speech signal communication, whereas for the data communication, that a call-waiting-interruption by the call-waiting service be restricted to prevent communication data from being destroyed due to a beep sound for the call-waiting interruption being multiplied with the communication data. This way makes it possible to effectively utilize both the call-waiting and data communication services.
To restrict the interruption by the call-waiting service, a call-waiting-interruption restriction service (cancel-call-waiting service) is already in use. For the subscriber supplied with the cancel-call-waiting service, the call-waiting interruption coming from a third subscriber can be restricted during the communication. Therefore, this service can prevent the communication data from being destroyed due to the beep sound for the interruption.
Recently, a duplex ringing (DR) service is also being used. In the DR service, a subscriber connected to one subscriber line is supplied with a plurality of telephone numbers (two presently) with different kinds of calling-bell sounds. For example, a first telephone number is used for the speech signal communication, and a second telephone number is used for the facsimile.
Especially, when the DR service is supplied to the subscriber with the call-waiting service and the call-waiting-interruption restriction service, it is desired that the first telephone number be used for the speech signal communication and have the call-waiting service, and that the second telephone number be used for the facsimile and have the call-waiting-interruption restriction service. Information of the call-waiting service for the first telephone number, and information of the call-waiting-interruption restriction service for the second telephone number are stored in subscriber data associated with each telephone number.
In this case, when the interruption from the third subscriber to a first subscriber occurs, the call-waiting service is performed by referring to the subscriber data of the first subscriber. Therefore, even if the communication which has been started by terminating to the second telephone number is kept with the call-waiting-interruption restriction service, the interruption from the third subscriber may be accepted when the third subscriber has called to the first telephone number, which is supplied with the call-waiting service.
Therefore, when the communication is started by terminating to the second telephone number for the data communication, the call-waiting service is required to be restricted to prevent the communication data from being destroyed due to the beep sound for the interruption. To meet the requirement, when a call for the data communication terminates to the second telephone number, the call-waiting-interruption restriction service is performed by referring to the subscriber data for the second telephone number, and a restriction bit is set in a call-control memory to restrict an interruption call terminating to the first telephone number.
When the call for the data communication terminates to the first telephone number, the restriction bit is not set in the call-control memory, so that the call-waiting service may be performed by referring to the subscriber data of the first telephone number when the interruption call terminates to the first telephone number.
As described above, in the DR service, one subscriber can be simultaneously supplied with both the call-waiting service and the call-waiting-interruption restriction service.
However, in such a conventional call-waiting-interruption restriction service, the interruption call is only restricted for the subscriber supplied with this service. Therefore, even if this service is supplied to the first subscriber, the interruption call to a second subscriber as the opposite subscriber is not restricted when the second subscriber is supplied with the call-waiting service. Therefore, there is a problem that the communication data is destroyed due to the beep sound for the interruption call when the call-waiting-interruption is performed during the data communication such as telematique services.
On the other hand, another method to implement the data communication without the interruption is presented by an article shown in a Japanese Laid-Open Patent Application No. 3-157043. In this method, a device for discriminating the speech signal and the telematique signal is installed in a time-division switching system. And when the interruption call terminates to the subscriber supplied with the call-waiting service, that device monitors the signal within a communication line and discriminates whether the signal is the speech signal or the telematique signal. When the signal is discriminated to be the telematique signal, the call-waiting service is restricted.
However, if the opposite subscriber for the communication is supplied with the call-waiting service, the interruption call to the opposite subscriber cannot be restricted. The problem previously mentioned still remains. In addition, there is another problem that many devices for discriminating are required.

Method for automatically controlling a call-waiting-interruption restriction and switching system


A construction support having an outer tube extending in a longitudinal direction, and an inner tube arranged therein, extending in the longitudinal direction, adjustable in relation to the outer tube in the longitudinal direction and having an outer thread. The outer tube is an uneven rolled tube and provided with at least one guide groove during roll-production. The guide groove extends in the longitudinal direction and is open in the radially inward direction. The inner tube is a round tube and has at least one guide element protruding radially outwards that engages in the radially inwardly open guide groove such that the inner tube is interlockingly anti-rotationally arranged in the circumferential direction in the outer tube. An adjustment nut is arranged in a longitudinal end region of the outer tube in a captive manner such that it is rotatable in the circumferential direction.

Field of the Invention
The present invention relates to a construction support having an axial longitudinal direction, a circumferential direction concentric thereto and a radial direction comprising an outer tube extending in the longitudinal direction and an inner tube having an outer thread arranged therein extending in the longitudinal direction and adjustable in the longitudinal direction relative the outer tube.
Description of the Background Art
Construction supports are known in the conventional art. For example, DE 10 2012 211 384 has a length adjustable support that has a supporting section, which has a hollow cross-section in a portion of length that contains an end of the supporting section and an externally threaded section in its two end areas, to which the hollow end belongs. WO 2007/039422 has a support device having a first vertical support element and a wall disposed around a longitudinal axis, which defines an axial cavity, inside which a second vertical support element can be inserted.
The conventional construction supports, however, are not sturdy, easy to operate or economical to produce.


A system for performing a hand-off between two IP core networks in the wireless domain includes a source mobility control function (MCF) within a source IP core network that is coupled to a source access network providing service to a mobile unit. The source MCF is coupled to a source bearer path gateway (BPGW) within the source IP core network. The source BPGW communicates bearer traffic associated with the mobile unit between the source access network and a public switched telephone network (PSTN) gateway within the source IP core network. The PSTN gateway communicates the bearer traffic between the source BPGW and a PSTN coupled to the source IP core network. The source MCF is functionally separate from a call agent (CA) within the source IP core network. The CA is also coupled to the source BPGW. The CA sets up a first segment of a bearer path for the bearer traffic between the source BPGW and the PSTN gateway, and the source MCF sets up a second segment of the bearer path for the bearer traffic between the source access network and the source BPGW. A hand-off occurs between the source IP core network and the target IP core network in the wireless domain when the source MCF takes down the second segment and sets up third and fourth segments of the bearer path for the bearer traffic in response to the mobile unit entering a service area of a target access network coupled to a target IP core network. The third segment is between the source BPGW and a target BPGW within the target IP core network that communicates the bearer traffic between the target access network and the source BPGW, and the fourth bearer segment is between the target access network and the target BPGW.

In a typical mobile communications system, mobile units are supported by radio networks coupled to different mobile switching centers (MSCs) providing an interface between the radio networks and the public switched telephone network (PSTN). In traditional circuit-switched environments, an MSC controls both the signaling and bearer paths for a call. When a mobile unit participating in a communications session roams from the service area of one radio network to the service area of another radio network, the communications session may be handed-off between the MSCs coupled to the radio networks. When a hand-off occurs between two MSCs, the source MSC establishes a circuit-switched connection to the next switch in the network providing service to the mobile unit. The source MSC has to maintain the original circuit-switched connection, providing an anchor for the bearer path and the second circuit-switched connection. Additional connections may need to be added if the mobile unit roams into other network service areas, and these connections may need to be linked to the original connection.
IP networks have begun to replace MSCs. Accordingly, systems and methods are needed for handing-off mobile communications sessions between IP networks coupling radio networks to the PSTN

System and method for performing hand-offs between internet protocol (IP) core networks in the wireless domain


A rack designed for attachment to the inside wall of a kitchen sink. A rod is connected to two suction cups within a width that will accommodate either a double or single kitchen sink. It provides a resting place for a dishcloth to dry while being virtually out of sight.

Field of Invention
This invention relates to a rack in the kitchen sink specifically for hanging a dishcloth in such a way that it is hidden from direct view.
2. Description of Prior Art
A patent search resulted in discovering no prior art.
The only available rack attached to suction cups would not be at all suitable for use in the kitchen sink for several reasons:
1. It is not designed for various sink widths and is too wide (30.48 cm) to work in most double-tub sinks.
2. The rack would extend too far into the sink and would conflict with normal sink use.
3. The white suction cups and the semi-square (in cross-section) rod and its configuration make it clumsy in appearance and unattractive for kitchen use.
4. According to its packaging, it is designed for use as a towel rack.
The problem of an unsightly dishcloth draped over the kitchen sink in full view is solved by a rack on the inside wall of the sink.

Rack for hanging a dishcloth on the inside wall of a kitchen sink


With omission of a duplication process of compressed data, a cache access frequency is reduced to improve throughput. A storage system includes first and second control units and a storage drive. Upon receiving a data write command, the first control unit stores data to be subjected to the write command in a first cache area of the first control unit, and stores the data in a second cache area of the second control unit to perform duplication, and upon completion of the duplication, the first control unit transmits a response indicating an end of write, performs a predetermined process on the data to be subjected to the write command, stores the data in a buffer area, reads the data stored in the buffer area, and transmits the read data to the storage drive.

The present invention relates to a storage system.
In general, a storage system includes one or more storage devices. Each of one or more storage devices generally includes, for example, an HDD (hard disk drive) or an SSD (solid state drive) as the storage device. The storage system is accessed from one or more host devices (for example, host computers) through a network such as a SAN (storage area network) or LAN (local area network). In general, the storage device improves reliability with the use of a high reliability method complying with a RAID (redundant array of independent (or inexpensive) disks) technique.
U. S. Patent Application Publication No. 2009/0144496 discloses an information system capable of compressing data while maintaining a data writing speed from a host computer. According to U. S. Patent Application Publication No. 2009/0144496, the storage device provides a first volume that accepts data write from a host computer and a second volume that compresses and manages data on the first volume. Upon completion of the data write to the first volume from the host computer, the storage device returns a response assuming that a write process to the host computer is completed. Thereafter, the storage device compresses the data asynchronously with the data write from the host computer and stores the compressed data in the second volume.
A publication "Jun Kato, Hiroki Otsuji, Kosuke Suzuki, Mitsuru Sato, Eiji Yoshida: "High-speed writing in in-memory deduplication", Research report computer system symposium, Nov. 28, 2016, pp. 51-59" discloses a method for achieving both of a response and a throughput by switching a processing opportunity according to an operation rate of a storage device, in a deduplication process for combining duplicate data written from a host computer into one piece.
For example, the "High-speed writing in in-memory deduplication" discloses that "This paper proposes a hybrid method in which characteristics related to an IOPS and a latency depend on different methods, and those methods are selectively used, to thereby realize a low latency of a duty-back method and a high IOPS of a dedup-through method." In addition, the "High-speed writing in in-memory deduplication" discloses that "This paper proposes a hybrid method in which two methods of a conventional dedup-through method for performing deduplication synchronously and a dedup-back method for performing deduplication asynchronously are compared with each other, a high IOPS performance and a high latency by overhead of a synchronous deduplication process in the dedup-through method, and a low latency and a reduction in IOPS caused by an increase in a tail latency in the dedup-back method are clarified, to thereby aim at performing both of the high IOPS and the low latency by combination of those two methods."
In other words, according to the "High-speed writing in in-memory deduplication", when the operation rate of the storage device is low, a response time is shortened by performing the deduplication process after the data write from the host computer is completed, and when the operation rate is high, the deduplication process is performed simultaneously with the data write.

Storage system and control method thereof


An interpolating bandpass filter for packet-data receiver synchronization comprises a single delay line that delays the passband-sampled data from the analog-to-digital converter, and a convolving structure that uses the delay line to implement a L-times oversampling bandpass filter. A separate accumulator accumulates a fractional phase difference that represents the frequency offset between the remote transmitter""s frequency and the receiver""s sampling frequency. The integer portion of the accumulator is used to determine the number of samples to delay the input of the filter, while the fractional portion is used to choose two coefficient sets closest to the desired delay and to interpolate between these two filter sets.

1. Field of the Invention
The present invention relates generally to demodulation of communication signals and more particularly to an interpolating bandpass filter for packet-data receiver synchronization.
2. Description of the Background Art
In network communications a carrier signal, a signal that oscillates at a fixed frequency, is used to establish the base frequency at which data signals are transmitted. These data signals modulate the carrier frequency prior to transmission.
Normally, it is desirable to demodulate data signals from their carrier communication signal using a digital method. It is further desirable to sample the communication signal at a rate greater than two times the maximum frequency of the modulated signal. This process is known as passband sampling.
Typically, demodulating a sampled data stream requires a xe2x80x9cmatched filterxe2x80x9d for optimum performance. This xe2x80x9cmatched filterxe2x80x9d is usually implemented as a bandpass filter with the signal being sampled in the passband. A bandpass filter is an electronic device that prohibits all but the specific range of frequency of the desired modulation to pass through, thus rejecting interference and noise that may be present in the sampled data stream. Often, this xe2x80x9cmatched filterxe2x80x9d is implemented as a finite-impulse response (FIR) digital filter.
It is common for a demodulator to require a sample rate to be interpolated to a different rate for later application to an equalizer structure. This sample rate change is necessary when the original sampling rate is not the same frequency as the sampled rate in the receiver structure. Typically, the receiver structure requires synchronization with the far-end transmitter. This synchronization is usually accomplished with a phase-locked loop on the clock to the analog-to-digital converter or some interpolating FIR structure on the received sample stream. Conventionally, the xe2x80x9cmatched filterxe2x80x9d and the interpolation functions are performed by separate and distinct elements in a receiver. Some transmission standards, particularly those that involve more than two transceiver units, mandate that data are transmitted in packets. An example of such a transmission standard is described in the Home Phoneline Network Alliance (referred to herein as xe2x80x9cHomePNAxe2x80x9d or xe2x80x9cHPNAxe2x80x9d) 2.0 standard. The HPNA standard requires a receiver to synchronize its local clock to that of the remote transmitter clock for the duration of the transmitted packet. Details regarding the HPNA 2.0 standard are disclosed in xe2x80x9cInterface Specification for HomePNA 2.02.7 10M8 Technologyxe2x80x9d by Home Phoneline Networking Alliance, herein incorporated by reference.
In general, the present invention provides an interpolating bandpass filter capable of synchronizing packet data received by the receiver device. The system of the invention includes a single multi-tapped delay line that delays the passband-sampled data from the analog-to-digital converter. A convolving structure in conjunction with the multi-tapped delay line implements a finite impulse response (FIR) filter, which has multiple coefficient sets. The coefficient sets are selected to implement an L-times oversampling bandpass filter.
A separate-accumulator accumulates a fractional phase difference that represents the frequency offset between the remote transmitter""s frequency and the receiver""s sampling frequency. The integer portion of the phase difference is used to determine the number of samples to delay the input of the FIR filter, while the fractional portion is used to choose two filter sets closest to the desired delay and to interpolate between these two filter sets.
In the preferred embodiment, a coefficient generator stores 32 coefficients divided into even and odd coefficients. The fractional portion of the phase difference is split into two components. One component determines a subset of coefficients from the even coefficients and a subset of coefficients from the odd coefficients, and the other component is used to interpolate between these two subsets to provide coefficients that are convolved with input samples.
Other advantages, features, and embodiments of the present invention will be apparent from the drawings and detailed description as set forth below.

Interpolating bandpass filter for packet-data receiver synchronization


The present invention relates to temperature compensation of HID lamps in automobiles. The invention concerns the manner in which the temperature of the HID lamp is accounted for in order to drive the lamp is at appropriate power from hot to cold conditions. In the present invention, the voltage across a capacitor in the temperature compensation circuit is sensed and used as a command signal to anticipate lamp temperature, and accordingly the reference power to the HID lamp is modulated depending on the temperature of the lamp. In the present invention, the lamp is driven with a higher power setting when the lamp is cold and with lower power setting when hot. This adaptive generation of reference power setting depending on the temperature of the lamp is implemented using the voltage across a capacitor in the temperature compensation circuit.

1. Field of the Invention
2. Description of the Related Art
High intensity discharge (HID) lamps show superior performance over conventional halogen lamps, such as energy saving, long life, high luminous efficacy, and good color rendering. So, HID lamps will be the preferred lighting source in the near future. Unlike incandescent lamp, HID lamps do not contain filament and hence have longer life. On the other hand, the characteristics of an HID lamp are complex compared to that of a halogen lamp.
FIG. 1 shows the block diagram of conventional microprocessor-based HID ballast. The HID ballast circuit consists of DC/DC converter 101, voltage doubler 102, DC/AC inverter 103, the high voltage igniter 104, and controller 105 including microprocessor. The DC-DC converter 101, as the battery source in automotive systems use mostly 12 V, the DC/DC converter 101 should boost the battery voltage from 9-16V up to 300 V (dc-link voltage). For the voltage doubler 102, in order to step up the dc link voltage of 300V to about 600V required for the spark gap in the igniter assembly, the dc-dc converter 101 along with a voltage doubler 102 boost the dc-link voltage to 600V. For example, as taught in Lee and Cho ("Design and analysis of automotive high intensity discharge lamp ballast using micro-controller unit" (IEEE transactions on Power Electronics)), the voltage doubler 102 is formed by the additional winding on the secondary of a DC-DC converter transformer 101.
Regarding the use of the voltage doubler 102, as the breakdown voltage of the spark-gap used in the igniter assembly is about 600 V, the dc link voltage has to be of the same value. In order to reduce the dc link voltage, the circuit in Lee and Cho, uses a transformer with two secondaries with equal number of turns. The general schematic of the arrangement is shown in FIG. 3. The voltages across the two secondary windings are summed and applied to the spark gap. As a result the dc link voltage is reduced to 300 V. The limitation of this design is that two secondary windings are required resulting in larger size for the transformer.
The present invention is related to further reducing dc link voltage to 200 V from 300 V as in FIG. 1 and to eliminate the additional winding on the dc-dc converter transformer.
FIG. 2 shows an igniter assembly of the conventional HID ballast. The igniter is a high voltage transformer which converts the low voltage from the dc converter into a high-voltage pulse of 10-22 kV magnitude for initiating an arc across the lamp electrodes. The voltage from the voltage doubler is applied to the primary windings of the igniter through a capacitor and a spark gap arrangement. The spark gap conducts when the voltage across the capacitor is equal to the breakdown voltage (about 600 V) of the spark gap. The capacitor discharges its energy through the spark-gap into the primary when the spark gap conducts to create a pulse in the primary winding. This discharge pulse in the primary is amplified by the secondary winding and applied across the lamp.
The inverter of the conventional ballast is used to provide an alternating square pulses to the lamp upon ignition. The inverter has no active role in the control of power to the lamp.
The most important and complex part of the conventional ballast is the controller which controls and dictates the mode of operation depending on the stages from the start-up to steady state. The operating mode of the controller changes from constant current mode at start-up to constant power mode after the lamp voltage begins to increase. In order to satisfy the standards, the lamp is driven at twice the rated power at start-up but with the maximum load current limited to around 2.5 A.
Unlike HID lamps for other applications, the HID lamps for automobiles must develop over 70% of the light output within 2 seconds of being turned on under cold and warm start conditions. The controller of an electronic ballast ensures that the lamp receives appropriate power under all conditions. The parameter that affects the characteristics of HID lamps is the lamp temperature which influences the power required by the lamp for successful operation. As the power demanded by the lamp at different stages of operation is dependent on the lamp temperature it is vital to use the lamp temperature as one of the feedback signals to calculate the reference power signal with which to drive the lamp.
In Fiorello's "Powering a 35 W DC metal halide high intensity discharge (HID) lamp using the UCC3305 HID lamp controller" (Unitrade Corporation), a method is proposed to monitor the temperature of the lamp in which a capacitor is charged by a variable current source and the voltage of the capacitor is measured to reflect the temperature of the lamp. The lamp temperature is estimated based on the voltage of this capacitor. The current source charges the capacitor at different rates till the lamp achieves a steady state and the voltage of this capacitor is clamped at a certain value to indicate the steady state operation of the lamp. The design of the current source is complex and expensive besides it requires careful tuning of the magnitude to control the rate of charging of the capacitor.

HID ballast with integrated voltage multiplier and lamp temperature compensation


In one embodiment, a data plane component of the network visibility system can receive a data packet tapped from a source network. The data plane component can further match the data packet with an entry in a rule table, where the entry includes one or more match parameters, and in response to the matching can tag the data packet with a zone identifier defined in the entry. The data plane component can then forward the tagged data packet to an analytic server for analysis.

Unless expressly indicated herein, the material presented in this section is not prior art to the claims of the present application and is not admitted to be prior art by inclusion in this section.
General Packet Radio Service (GPRS) is a standard for wireless data communications that allows 3G and 4G/LTE mobile networks to transmit Internet Protocol (IP) packets to external networks such as the Internet. FIG. 1 is a simplified diagram of an exemplary 3G network 100 that makes use of GPRS. As shown, 3G network 100 includes a mobile station (MS) 102 (e.g., a cellular phone, tablet, etc.) that is wirelessly connected to a base station subsystem (BSS) 104. BSS 104 is, in turn, connected to a serving GPRS support node (SGSN) 106, which communicates with a gateway GPRS support node (GGSN) 108 via a GPRS core network 110. Although only one of each of these entities is depicted in FIG. 1, it should be appreciated that any number of these entities may be supported. For example, multiple MSs 102 may connect to each BSS 104, and multiple BSSs 104 may connect to each SGSN 106. Further, multiple SGGNs 106 may interface with multiple GGSNs 108 via GPRS core network 110.
When a user wishes to access Internet 114 via MS 102, MS 102 sends a request message (known as an "Activate PDP Context" request) to SGSN 106 via BSS 104. In response to this request, SGSN 106 activates a session on behalf of the user and exchanges GPRS Tunneling Protocol (GTP) control packets (referred to as "GTP-C" packets) with GGSN 108 in order to signal session activation (as well as set/adjust certain session parameters, such as quality-of-service, etc.). The activated user session is associated with a tunnel between SGSN 106 and GGSN 108 that is identified by a unique tunnel endpoint identifier (TEID). In a scenario where MS 102 has roamed to BSS 104 from a different BSS served by a different SGSN, SGSN 106 may exchange GTP-C packets with GGSN 108 in order to update an existing session for the user (instead of activating a new session).
Once the user session has been activated/updated, MS 102 transmits user data packets (e.g., IPv4, IPv6, or Point-to-Point Protocol (PPP) packets) destined for an external host/network to BSS 104. The user data packets are encapsulated into GTP user, or "GTP-U," packets and sent to SGSN 106. SGSN 106 then tunnels, via the tunnel associated with the user session, the GTP-U packets to GGSN 108. Upon receiving the GTP-U packets, GGSN 108 strips the GTP header from the packets and routes them to Internet 114, thereby enabling the packets to be delivered to their intended destinations.
The architecture of a 4G/LTE network that makes uses of GPRS is similar in certain respects to 3G network 100 of FIG. 1. However, in a 4G/LTE network, BSS 104 is replaced by an eNode-B, SGSN 106 is replaced by a mobility management entity (MME) and a Serving Gateway (SGW), and GGSN 108 is replaced by a packet data network gateway (PGW).
For various reasons, an operator of a mobile network such as network 100 of FIG. 1 may be interested in analyzing traffic flows within the network. For instance, the operator may want to collect and analyze flow information for network management or business intelligence/reporting. Alternatively or in addition, the operator may want to monitor traffic flows in order to, e.g., detect and thwart malicious network attacks.
To facilitate these and other types of analyses, the operator can implement a network telemetry, or "visibility," system, such as system 200 shown in FIG. 2 according to an embodiment. At a high level, network visibility system 200 can intercept traffic flowing through one or more connected networks (in this example, GTP traffic between SGSN-GGSN pairs in a 3G network 206 and/or GTP traffic between eNodeB/MME-SGW pairs in a 4G/LTE network 208) and can intelligently distribute the intercepted traffic among a number of analytic servers 210(1)-(M). Analytic servers 210(1)-(M), which may be operated by the same operator/service provider as networks 206 and 208, can then analyze the received traffic for various purposes, such as network management, reporting, security, etc.
In the example of FIG. 2, network visibility system 200 comprises two components: a GTP Visibility Router (GVR) 202 and a GTP Correlation Cluster (GCC) 204. GVR 202 can be considered the data plane component of network visibility system 200 and is generally responsible for receiving and forwarding intercepted traffic (e.g., GTP traffic tapped from 3G network 206 and/or 4G/LTE network 208) to analytic servers 210(1)-(M).
GCC 204 can be considered the control plane of network visibility system 200 and is generally responsible for determining forwarding rules on behalf of GVR 202. Once these forwarding rules have been determined, GCC 204 can program the rules into GVR 202's forwarding tables (e.g., content-addressable memories, or CAMs) so that GVR 202 can forward network traffic to analytic servers 210(1)-(M) according to customer (e.g., network operator) requirements. As one example, GCC 204 can identify and correlate GTP-U packets that belong to the same user session but include different source (e.g., SGSN) IP addresses. Such a situation may occur if, e.g., a mobile user starts a phone call in one wireless access area serviced by one SGSN and then roams, during the same phone call, to a different wireless access area serviced by a different SGSN. GCC 204 can then create and program "dynamic" forwarding rules in GVR 202 that ensure these packets (which correspond to the same user session) are all forwarded to the same analytic server for consolidated analysis.
Additional details regarding an exemplary implementation of network visibility system 200, as well as the GTP correlation processing attributed to GCC 204, can be found in commonly-owned U.S. patent application Ser. No. 14/603,304, entitled "SESSION-BASED PACKET ROUTING FOR FACILITATING ANALYTICS," the entire contents of which are incorporated herein by reference for all purposes.
In certain embodiments, as part of the traffic analysis performed by analytic servers 210(1)-(M), servers 210(1)-(M) may be interested in categorizing the data packets they receive from GVR 202 according to various criteria. For instance, analytic servers 210(1)-(M) may want to categorize the data packets based on the physical network path, or "circuit," they originated from in 3G network 206 or 4G/LTE network 208. Analytic servers 210(1)-(M) can then use this information to facilitate their analyses. By way of example, assume that an analytic server 210 sees that data packets in a certain flow are being dropped or delayed. In this case, if the data packets are categorized according to their point of origin in source network 306 or 208, the analytic server can determine that there is a problem with the physical network path/circuit from which the affected data packets originated. The network provider can thereafter take appropriate steps for addressing the problem with that particular circuit.
One issue with performing this packet categorization on analytic servers 210(1)-(M) is that the analytic servers may not have sufficient compute resources to perform the categorization in an efficient manner. This may be particularly true if a high volume of traffic is sent from GVR 202 to servers 210(1)-(M) on a continuous basis. Another issue with performing this packet categorization on analytic servers 210(1)-(M) is that the analytic servers may not have access to all of the information needed to successfully carry out the categorization task. For instance, in the example above where analytic servers 210(1)-(M) are interested in categorizing data packets according to the network circuit their originated from in source networks 206/208, servers 210(1)-(M) may not be able to ascertain the source circuit for each data packet without knowing which ingress port of GVR 202 received the packet. This ingress port information would only be known to the components of network visibility system 200 (i.e., GVR 202 and GCC 204).

Techniques for user-defined tagging of traffic in a network visibility system