A collapsible bracing structure for bracing a load against shifting a surface bearing the load, including a pair of upright side frames extending longitudinally of the load-bearing surface and a plurality of elongated cross-braces each having opposite ends and extending laterally to the side frames to retain the side frames in an upright position. Manually operable, rotatable latches are provided for releasably attaching the opposite ends of each of the elongated braces to each of the side frames to define a rigid block having a bottom surface engaging the surface bearing the load and at least one upright load-engaging face.

1. Technical Field
The present invention is directed toward a structure and method for unitizing and bracing loads and, more particularly, toward a collapsible structure and method for unitizing and bracing loads in moving vehicles, such as truck trailers.
2. Background Art
The desirability for unitizing loads during transport is well-known. Glass items, including liquid containers, are particularly susceptible to breaking as a result of being bumped during transport. Further, shifting of massive payloads results in dangerous dynamic instabilities in the motion of a truck trailer. By unitizing loads, the shifting of the loads can be minimized during transport, and therefore damage to parts of the load resulting from bumping, as well as precarious vehicle dynamics, can be reduced.
In addition to payload damage and safety concerns, compliance with truck trailer weight distribution regulations necessitates the use of load-positioning structure. Truck trailers are typically limited, by law, to carry a payload of no greater than 48,000 lbs. This load must be distributed so that neither trailer axle is loaded in excess of 24,000 lbs. In order to maintain the weight distribution of a trailer load during transport, it is important to have the capability of unitizing and fixedly positioning the load.
One method which has been used is to place straps around the load, as shown in U.S. Pat. No. 1,920,917 to Scales. However, the structure disclosed in this patent for unitizing such loads is not readily adaptable to loads of different heights. The straps of such structure bear against the edges of the loads and thereby damage the loads.
Structure to prevent the shifting of a load in a moving vehicle is shown in U.S. Pat. Nos. 4,193,736 to Thomaswick.
Thomaswick discloses a pair of spaced deck runners, with a stanchion and lash bar attached to the runners adjustable along the length thereof. Loads are unitized and confined between the stanchion and lash bar. The Thomaswick structure is complicated and, to be effective, must have runners extending over the entire length of the load-supporting surface to which it is attached. Such a structure takes up valuable space in vehicles and, because of the weight, reduces payload.
Further, the stanchion in Thomaswick takes up a substantial amount of space lengthwise of the runners. In certain situations, it is impossible to incorporate the Thomaswick structure into a vehicle. For example, if the load extends to within approximately two feet of the rear wall of the carrying vehicle, bracing of the load against rearward shifting may be required. The Thomaswick structure would not fit in the allowed space. Further, by reason of the complicated nature of the Thomaswick structure, its manufacture is relatively involved and costly.
Still other structures have been used, such as airbags, to fill the empty spaces in a transport vehicle. However, these structures can be dangerous as they are placed in relatively high pressures and can sometimes force the transport vehicle doors open, striking nearby individuals. Still further, the airbags are expensive and difficult to use.
The present invention is directed toward overcoming one or more of the problems as set forth above.

Collapsible structure for unitizing and bracing a load in a trailer


Roller board assemblies and methods of manufacture and use. A roller board assembly may include a roller board having a first roller board insert which is removably coupled to a housing and a second roller board insert which is also removably coupled to a housing. The removability of the first and second roller board inserts may allow for variation in the desired roller board insert configuration such as shape and size of grooves in the roller board, thus allowing for variation in the shape and size of the item to be rolled. A first coupler may couple the first roller board to the housing through a hole in the housing. A handle on the housing may allow a user to grip the housing and apply the motion required to roll an item.

1. Technical Field
Aspects of this document relate generally to instruments used for the formation of comestibles into desired shapes. More specific implementations involve instruments used to form relatively plastic comestibles, such as dough, batter, mix, paste, and so forth, into desired shapes.
2. Background Art
Various instruments exist to form comestibles into desired shapes. Some of these require manual assistance and some are largely automated. Examples of such instruments include those adapted to transport and shape foods such as spoons and ladles and those adapted to produce a shape out of a particular food, such as a cookie cutter. Many are configured to form the food into a desired shape before the food is cooked or otherwise finished in its preparation.


An apparatus for testing semiconductor devices allows various testing processes, including a burn-in process, to be performed at the same testing stage. Test trays which contain the semiconductor devices are used throughout an in-line system so that an entire back-end process can be performed without loading/unloading the semiconductor devices between the various tests. The in-line system includes multiple test and burn-in apparatuses as well as a single sorting unit which performs a composite sorting operation after all the testing processes. A method for testing semiconductor devices in the in-line system includes testing the semiconductor devices in the test trays using the test and burn-in apparatus, transferring the test trays to a different testing apparatus for a second testing, and finally sorting the semiconductor devices after all testing processes have been performed based on a final sorting map created by combining test tray maps generated during each of the tests.

This application is related to Korean patent application No. 97-12256 filed on Apr. 2, 1997 entitled xe2x80x9cMethod for Generating Lot in Semiconductor Test Process Systemxe2x80x9d which is herein incorporated by reference for all purposes.
1. Field of the Invention
The present invention relates generally to an apparatus and method for testing semiconductor devices. More particularly, the present invention relates to a test and burn-in apparatus for semiconductor chip package devices, an in-line system which includes the test and burn-in apparatus, and a test method which employs the in-line system.
2. Description of the Related Art
A manufacturing process for producing semiconductor devices generally includes three sub-processes: a wafer fabrication process; a package assembly process; and a back-end process. The wafer fabrication process encompasses the procedures for creating a large number of circuits on a thin disc, or wafer, of semiconductor material such as silicon. The package assembly process is the process by which an individual chip, having been separated from the wafer, is assembled into a package for establishing interconnections with a suitable operating environment. The back-end process includes several test steps where the packaged devices are tested to determine the parameters of the devices and whether the devices appropriately perform their intended function. The back-end process also includes sort steps in which the tested devices are sorted according to their individual parameters.
FIG. 1 is a flow chart illustrating a conventional back-end process 80 for manufacturing semiconductor devices 89. As shown in FIG. 1, the conventional back-end process 80 includes four test steps 81, 82, 83 and 84, three associated sort steps 91, 92 and 93, a marking step 85, a visual inspection step 86, a packing step 87, and a stocking step 88. The four test steps are performed in sequence and include a DC test 81, a burn-in step 82, a room/cold test 83, and a hot sort test 84.
The assembled semiconductor devices 89 are provided to the back-end process 80 in package form. Specifically, the assembled semiconductor devices 89 are loaded in a device tray and then provided to the DC test 81. The DC test 81 is performed to detect electrical failures which can occur during the package assembly process. After performance of the DC test 81, the first sort step 91 is engaged during which good devices in the device tray are transferred to a burn-in board, while failed devices are scrapped. The burn-in board, once supplied with the good devices, is transferred to the burn-in step 82.
The burn-in step 82 is an unusual test in which the semiconductor devices are subjected to extreme conditions (such as high temperature) in order to pre-screen out early device failures that might take place during actual usage. Following the burn-in step 82, the burn-in board is returned to the first sort step 91. The devices in the burn-in board are then sorted depending on the results of the burn-in step 82. The passing devices are again loaded in the device tray and transferred to the next test step. Although, for clarity, the first sort step 91 appears as single block in FIG. 1, several processes are actually carried out during this step. Specifically, these processes include: moving the semiconductor devices from the device tray to the burn-in board and from the burn-in board back to the device tray; scrapping the failed devices after the DC test 81; and sorting the devices after the burn-in step 82. In most cases, both the first sort step 91 and the DC test 81 are carried out at the same stage of the manufacturing process.
Following the burn-in step 82, the room/cold test 83 is performed. The room/cold test 83 begins after the good devices stored in the device tray are transferred to a room/cold tester. The room/cold tester includes a handler which shifts the devices from the device tray to a test tray. The room/cold test 83 is carried out at either about 25xc2x0 C. (room temperature) or below 0xc2x0 C. (freezing), so that DC failures or function failures can be checked. As the room/cold test 83 operation is completed, the devices in the test tray are again sorted, this time based on the room/cold test results. The good devices are shifted to the device tray which will carry the devices to the next test step while the failed devices are scrapped. The second sort step 92 is carried out by the handler of the room/cold tester. As described above, the test tray of the room/cold tester is used to carry the devices to and from the contact parts of the tester, while the device tray carries the devices between two testers.
The good devices in the device tray, having been room/cold tested, are then transferred to the hot sort test 84, which is performed under high temperature conditions, i.e., approaching about 83xc2x0 C. The hot sort test 84, as is widely known in the art, verifies the electrical or functional characteristics of the devices and determines their operational speed. Similar to the room/cold test 83, the hot sort test 84 includes the additional steps of removing the devices from the device tray and placing them in the test tray, and then removing them from the test tray and placing them on the device tray. Moving the devices from tray to tray is carried out by a handler (that is, by handling equipment) of the tester. The third sort step 93 is associated with the hot sort test 84 and is performed together with the shifting of the devices by the handler after completion of the hot sort test 84.
When new semiconductor material arrives to be tested in the back-end process, it is handled by lot ID number. A human operator typically needs to input the lot ID number into the system in order to generate a test result and to measure the output obtained from a given input. Between the loading and unloading of the semiconductor devices, there are several general steps which take place inside the handler regardless of the test function being performed. These general steps require time to perform. Specifically, test tray index time, soaking hot or cold temperature processing time and sorting time must all be included in the overall device loading/unloading time during transfer between trays. The time requirements are even worse when rework is required following the main process. The total processing time includes a lot of preparation time during handler processing, even before actually testing the devices and combining the output. Additionally, a human operator has to count the total output and record the test results on every lot traveller card.
Unfortunately, as indicated above, conventional testers require additional equipment for transporting between test steps and transferring between trays (handling) both the devices to be tested and those which have already been tested. Furthermore, shifting the devices between trays during every test step adds time and complexity but does not add any value in the performance of the tests. In other words, the complicated processes engaged in by the handler have no positive affects on the performance of the tests. In fact, the conventional handling requirements add cost and complexity to the semiconductor device manufacturing process without any corresponding benefits. Specifically, the prior art handlers increase significantly the space and time requirements for moving the devices through the back-end process, as well as the costs associated due to increased equipment requirements. Also, semiconductor devices being manipulated by the handler are faced with the possibility of considerable damage during movement between trays.
Another significant problem in the prior art is that the current burn-in testers require a long test time. The excessive test time is further compounded by the amount of time it takes to transfer the devices between the burn-in board and the device tray, the time it takes to load and unload the burn-in board, and the time it takes to raise or drop the test temperature and/or to check the burn-in process or signals. In addition, the burn-in board and its test sockets are high-priced expendables. Accordingly, all of the above-discussed testing stepsxe2x80x94which are required for every semiconductor devicexe2x80x94impose a heavy cost burden on the end-consumer.
Finally, typical burn-in testers perform at a slow test rate and a low test accuracy. The reason why the test rate of typical burn-in testers is slow is that test signals are applied in parallel to the devices in every row or every column through circuit patterns on the burn-in board. This testing technique makes it difficult to apply test signals to the specific device to be tested.
Furthermore, typical burn-in testers have a long serial scanning time when compared with normal testers. For example, JEC Co.""s burn-in tester model no. MBT P1700S has a test rate of 4 MHz maximum and a transition time of approximately 50 ns, which represents a long cycle time. This tester is therefore capable of performing a few of the desired tests, such as a gross function test or a long cycle test, in addition to the burn-in step 82. It is unable, however, to perform either the room/cold test 83 or the hot sort test 84, both of which require shorter cycle testing times.
Another major problem in the prior art involves the prior art retest procedures. The prior art retest is a serial-type retest which means it is performed on the same machine as the initial test for each of the different test steps. Using this type of retest adds to the time requirements and complexity of the back-end process.
As a consequence of all of these drawbacks, it is considerably difficult to systemize the back-end process of the in-line system. Use of the prior art processes and equipment results in dropped productivity and lost cost-efficiency. Accordingly, improvements in the back-end process are extremely desirable in light of the industry desire for higher device throughput and lower manufacturing costs. In addition, it would be particularly desirable to eliminate the need for three separate sort steps, in order to further increase throughput and lower costs.
It is therefore an object of the present invention to provide an improved testing apparatus for semiconductor devices, which allows various tests of a back-end process, including a burn-in process, to be performed at the same platform.
It is another object of the present invention to provide a back-end process which uses an in-line system throughout the entire process and which employs more space-efficient equipment.
It is still another object of the present invention to provide an improved testing method which includes a burn-in process having a reduced number of steps, requires less time to perform, and uses equipment occupying less space.
It is yet another object of the present invention to provide a testing system which eliminates the unnecessary movement of semiconductor devices between trays by employing test trays which are directly transferable between test steps.
It is still another object of the present invention to provide a single composite sort step which eliminates the need for multiple sort steps between each of the various tests and burn in processes.
It is yet another aspect of the present invention to provide a parallel-type retest, rather than a serial-type retest, which is independent of the testing machine and which uses previous test results and data automation to efficiently retest the devices.
These and other objects of the present invention are attained by using a test and burn-in apparatus for semiconductor devices. In particular, the test and burn-in apparatus in accordance with the present invention includes a rail for transferring multiple test trays, each of which contains multiple semiconductor devices to be tested. The apparatus also includes a loader for loading the test trays onto the rail and a unloader for unloading the test trays from the rail. Furthermore, the apparatus comprises a chamber, which the rail traverses. The test trays are provided in the chamber along the rail, so that the semiconductor devices contained in the test trays may be subjected to a test and/or burn-in process within the chamber. A plurality of test heads are formed in the chamber so that each test head can be electrically connected to a respective one of the test trays to perform the test and/or burn-in process for the semiconductor devices.
The apparatus may further include a main frame which includes a control unit which is electrically connected to the test heads. The main frame may further include a coolant refrigerator unit for cooling down the test heads. The number of test heads included is preferably either four or eight, with each test head capable of performing the test and/or burn-in process for sixty-four semiconductor devices in a single test tray. Preferably, the devices to be tested are semiconductor chip packages with gull-wing leads, or chip scaled packages.
According to an alternate aspect of the present invention, an in-line system is provided for manufacturing semiconductor devices. The in-line system includes a plurality of test and burn-in apparatuses, a transferring member, and a sorting unit. Each test and burn-in apparatus performs a different test and/or burn-in process from the other and includes a rail for transferring multiple test trays between processes. Each test tray holds a plurality of semiconductor devices. Each test and burn-in apparatus further includes a loader for loading the test trays onto the rail and a unloader for removing the test trays from the rail. Additionally, the rail traverses through a chamber in which the test or burn-in process takes place. Accordingly, the test trays travel in the chamber along the rail, and the plurality of semiconductor devices contained in the test trays are then subjected to the test or burn-in process.
A plurality of test heads are formed in the chamber where the test and/or burn-in process for the semiconductor devices is performed. Each of the test heads corresponds to a respective one of the test trays in the chamber, and each test head is electrically connected to its corresponding test tray. The transferring member receives the test trays from the unloader of one test and burn-in apparatus and supplies them to the loader of another test and burn-in apparatus. Accordingly, the test and burn-in apparatuses are linked in an in-line system by the transferring member. The semiconductor devices which pass all of the tests and burn-in processes of the in-line system are transferred to device trays from the test trays by a sorting unit.
Each test and burn-in apparatus in the in-line system further includes a main frame which includes a control unit electrically connected to the test heads. The control units and the sorting unit can be electrically connected to each other. The main frames can further include a coolant refrigerator unit for cooling down the test heads. The in-line system preferably includes four or eight test heads in each test and burn-in apparatus, with each head being capable of performing the test and/or burn-in process for sixty-four semiconductor devices in one test tray. The semiconductor devices are preferably semiconductor chip packages with gull-wing leads.
In particular, the in-line system according to this invention preferably includes a first test and burn-in apparatus for performing a DC test and a burn-in process, a second test and burn-in apparatus for performing a room/cold test, and a third test and burn-in apparatus for performing a hot sort test. Moreover, a sorting unit is preferably provided which can perform two operations: first, moving the devices which have already been tested from a test tray to a device tray; and second, providing new devices, which have not yet been tested, from a new device tray to the test tray.
According to still another aspect of the present invention, a method is provided for testing semiconductor devices. This method includes providing a test tray containing multiple semiconductor devices to a first test and burn-in apparatus. Next, a first testing process is performed on the semiconductor devices contained in the test tray in the first test and burn-in apparatus. The test tray is then transferred from the first test and burn-in apparatus to a second test and burn-in apparatus. A second testing process is then performed on the semiconductor devices contained in the test tray in the second test and burn-in apparatus. The test tray is next transferred from the second test and burn-in apparatus to a third test and burn-in apparatus. Subsequently, a third testing process is performed on the semiconductor devices contained in the test tray in the third test and burn-in apparatus. The test tray is then transferred from the third test and burn-in apparatus to a sorting unit where the semiconductor devices in the test tray are sorted based on the results of the three tests and delivered to a device tray during a sorting process.
The test and burn-in apparatuses and the in-line system described previously are preferably employed in carrying out this method, with each apparatus performing one of the three testing steps. Each of the transferring steps may be conducted by a transferring member which receives the test tray from the unloader of one apparatus and supplies it to the loader of the next apparatus, such that all of the apparatuses are linked together via the in-line system""s transferring device.
In the previously described method, each test and burn-in apparatus can further include a main frame which includes a control unit electrically connected to test heads within the apparatus. Furthermore, the control units may be electrically connected to each other and to a sorting unit where the sorting process for sorting the semiconductor devices in the test tray is conducted. In particular, semiconductor device selection during the sorting process is preferably based on test tray maps which have been recorded as a result of the three testing steps and transmitted to the sorting step via the control units.
In addition, the method can further include loading new semiconductor devices contained in a new device tray into the test tray from which the tested semiconductor devices have just been sorted, and providing that test tray containing the new devices to be tested to the first test and burn-in apparatus for testing. Also, the first, second and third testing processes may include a burn-in process, a room/cold test and a hot sort test, in various orders. The third testing process is preferably the hot sort test, however.

Test and burn-in apparatus, in-line system using the test and burn-in apparatus, and test method using the in-line system


A method of magnetotelluric exploration is disclosed which features multiple measurements of the earth's electric field at a plurality of locations and one or more magnetic field measurements being made simultaneously. A specific form of cable for connecting measurement apparatus with recording apparatus is also disclosed.

This invention relates to magnetotelluric geophysical exploration and more particularly to recording magnetotelluric signals along lines of exploration on the surface of the earth.
It has long been known that telluric currents circulate beneath the surface of the earth. The prior art suggests that the measurement of these naturally occuring currents will indicate the resistivity of the earth and hence the geophysical characteristics of the subsurface. These telluric currents are subject to variations caused by external influences, such as sunspot activity. Because these variations are unpredictable, measurement of telluric currents was little used as a geophysical exploration tool until Louis Cagniard devised a mathematical technique capable of accounting for these variations. His work is represented, for example, in U.S. Pat. No. 2,677,801 wherein the proposes measuring not only the telluric currents, but also the magnetic field at a measurement station on the earth's surface. Cagniard teaches that a specific relationship exists between the measured orthogonal components of the earth's magnetic field and the measured orthogonal components of the earth's electric (or "telluric") field, and that spatial variations therein may be used to derive specific information regarding the subterranean structure of the earth. As certain structures are known to be indicative of the presence of minerals, these magnetotelluric measurements are a useful prospecting tool.
The Cagniard method of magnetotelluric exploration usually involves the generation of signals representing the magnetic field and the electric field in two orthogonal directions, usually denoted by H.sub.x, H.sub.y, E.sub.x and E.sub.y respectively. In this type of exploration it is desirable to record the electric field and the magnetic field at spaced locations along a line of exploration; the data thus generated can be combined with data obtained along parallel lines to yield a three-dimensional picture of the subterranean structure. A similar technique is used in seismic exploration; compare U.S. Pat. No. 3,105,568 to Jolly, which is an example of a seismic exploration technique, commonly referred to as "roll along", which obtains multiple coverage of common depth points in seismic exploration.

Multiple site magnetotelluric measurements


A water-saving sheet and a water-saving device having the same is provided. The water-saving sheet includes a sheet body including a central assembling base and a plurality of through holes arranged around the central assembling base. A circumference of the sheet body has an engaging flange structure for being positionably engaged with an inner wall of a tube. An elastic ring is annularly arranged on the central assembling base. The elastic ring and the central assembling base form at least one first passage therebetween, the elastic ring and each said through hole form a second passage therebetween. The water-saving device includes one said water-saving sheet and a barrel member. An inner wall of the barrel member has a shoulder portion engageable with the engaging flange structure to restrict the sheet body from moving toward and out from the inlet end.

Field of the Invention
Description of the Prior Art
A common water-saving sheet can lessen a water flow through decreasing a total cross-sectional area of a tube so as to save water.
However, when a hydraulic pressure is small, the conventional water-saving sheet still blocks the water flow and cannot adjust the water flow according to the hydraulic pressure. In addition, the water-saving sheet is fixed in the tube through abutting against the tube radially, and the water-saving sheet falls off easily.
US patent publication 2011/0247702 disclosed a water-saving sheet having a sealing ring covering the sheet. The sealing ring is made of resilient material to make the sheet abut the inner wall of the tube firmly. However, the elasticity is limited because it's completely provided by the resilience of the material.
U.S. Pat. No. 4,000,857 disclosed another water-saving sheet. The sheet is clamped by two tube units screwed with each other, so the sheet is firmly positioned. However, the sheet can not be used in a single tube structure.
The present invention has arisen to mitigate and/or obviate the afore-described disadvantages.

Water-saving sheet and water-saving device having the same


A cable-membrane tensegrity structure which is asymmetric, and construction method and design method thereof are provided. The cable-membrane tensegrity structure comprises a central opening and is formed by a ring cable (4) and three layers of radial cables comprising a suspension cable (1), a ridge cable (2) and a valley cable (3), wherein the suspension cable (1) is located above the ridge cable (2), the ridge cable (2) is located above the valley cable (3), wherein one end of each of the suspension cable (1), the ridge cable (2) and the valley cable (3) is connected to the ring cable (4), and the other end of each of the suspension cable (1), the ridge cable (2) and the valley cable (3) is connected to a peripheral supporting structure (7), wherein a coating membrane (5) is tensioned between the ridge cable (2) and the valley cable (3) that are adjacent to each other and function as a skeleton to tension the coating membrane (5). The method of constructing the cable-membrane tensegrity structure comprises steps of: lifting step by step the suspension cable (1), the ridge cable (2) and the valley cable (3) to positions adjacent to respective cable anchor nodes by a traction device, based on a shape of formed cable-membrane tensegrity structure; and tensioning and anchoring synchronously the suspension cable (1), the ridge cable (2) and the valley cable (3) in place by a tensioning device, so as to achieve a final shape of the cable-membrane tensegrity structure. A multi-stage design method, based on the bearing whole-process, of a cable-membrane tensegrity structure of an opening type is also provided.

Field of the Invention
The present invention relates to the technical field of long span structure, particularly, relates to a long span cable-membrane structure, more particularly, relates to a cable-membrane tensegrity structure which is asymmetric and is of an opening type, a method of constructing the same, and a method of designing the same.
Description of the Related Art
Cable-membrane structure, as a novel tension structure, is developed from the late twentieth century. The cable-membrane structure has unique characteristics of structure system, and can make full use of the tensile characteristics of the cable material and the membrane material, increasing the utilization efficiency of materials. The history of the cable-membrane structure may be traced back to ancient tent. However, the ancient tent, as a temporary construction, was not paid much attention to by people before the 80's of last century. After a novel membrane material was developed in the 80's of last century, and the membrane structure is widely applied. According to the construction formation, the membrane structure can be classified as: inflatable membrane structure; cable truss membrane structure; cable dome structure and tension cable-membrane structure.
The tension cable-membrane structure is a structure system depended on tension of membrane and composed of tension cable and the membrane. The tension cable-membrane structure is mainly composed of the tension cable and the membrane material covering on the tension cable. The tension cable can be divided into a valley cable, a ridge cable and a side cable which is at the edge of the membrane. In this kind of structure, the membrane unit is fully tensioned, and can withstand a certain load. This kind structure of membrane unit can serve as a horizontal connection of the structure, has a good bearing capacity, and has a good absorbing effect on the earthquake and the wind load in the horizontal direction.
According to the stress characteristics, the tension cable-membrane structure can be classified as:
(1) A general tension cable-membrane structure, the membrane of which is the main stress part. In this structure, the membrane has certain rigidity by applying a pre-stress to the membrane. Due to limit strength of the membrane itself, a great pre-stress cannot be exerted on the membrane. Thereby, this kind of structure is generally used in small span structure.
(2) A composite tension cable-membrane structure, the cable of which bears the main stress of the structure, and the membrane of which is mainly subjected to local load. Because of the existence of the cable net, this kind of structure has rigidity larger than that of the general tension cable-membrane structure, and it can be used in a large span structure. In addition, in this kind of structure, the pre-stress must be proportionally applied on the cable and the membrane.
The existing cable-membrane tensegrity structure of an opening type is mainly used for the stadium building and mainly comprises two types of (1) The radial cables comprise a lower layer and an upper layer at the outer ring cable and intersect to form one layer at the inner ring cable. The plane is circular or substantially elliptical and has a relatively regular overall configuration. The inner ring cables are in the same plane. (2) The two layers of radial cables intersect to form a circle in the periphery and are divided into two layers at the inner ring cable. The two layers of radial cables are connected by using support bars. As for the above cable-membrane tensegrity structure of an opening type, because of structural constraints, they mostly have a symmetrical shape, and it is difficult to realize an asymmetric shape of the building effect.
Since the tension cable-membrane structure has a beautiful appearance, a lithe and light body, a high material utilization rate, the tension cable-membrane structure is especially suitable for stadium, exhibition venue, airport and other large span structure's roof. With the development of computer technology, the tension cable-membrane structure is developed widely in practical engineering, the cable net in the tension cable-membrane structure functions as the main stress part, and the tension cable-membrane structure is formed by tensioning the membrane as a secondary stress part. Because of the existence of the cable net, this kind of structure has rigidity larger than that of the general cable-membrane structure, and it can be used in the large span structure. In addition, in this kind of structure, the pre-stress must be proportionally applied on the cable and the membrane. The cable-membrane structure of large span is very complex in construction. Thereby, a reasonable construction scheme can not only make the structure formation to meet the design requirements, and can reduce the difficulty of construction process. Different tension construction methods may exert different influences on the stress state of the structure after forming, therefore, the reasonable tension construction scheme relates to the limit stress and the safety performance of the structure.
In the pre-stress cable-membrane tensegrity structure of an opening type, the steel cable is the main force bearing part, and it has a suitable stress characteristics and a high structure efficiency, and can reflect the modern advanced materials, structural system of contemporary architecture design and construction technical level. A whole tension main structure of an opening type consists of two portions (see FIG. 1 and FIG. 4): a continuous tension cable net the dimensional cable-membrane tensegrity structure comprising a central opening and being formed by a suspension cable 1, a ridge cable 2, a valley cable 3 and a ring cable 4; and a surrounding supporting structure 7. Cable membrane secondary structure comprises a membrane side cable 12 and a membrane tensioned on the ridge cable and the valley cable. Pre-stress is applied to the cable net of an opening type so as to convert it from the mechanism to the structure that can withstand the use load. Thereby, the tension cable net is the main stress part of the pre-stress cable-membrane tensegrity structure of an opening type, and it implements the "advanced structural mechanics theory of continuous tension ocean". This structure system belongs to a nonlinear flexible structure with main characteristics of "small strain-large vertical deformation".
The pre-stress cable-membrane tensegrity structure of an opening type is very novel, and is restricted by design theory and design means. So far, the design of the pre-stress tensegrity structure is limited to only the elastic stage design, mainly including the member elastic bearing capacity design and the system elastic vertical deformation capacity design. The above design method cannot reflect the whole-process of structural mechanics characteristics from loading to failure, cannot fully reveal security control elements in various stress stages of the structure, and cannot fully meet the pre-stress tensegrity structure safety design requirements. The above design method has been far behind compared with the "elastic-nonlinear" two-stage design method adopted in the conventional construction engineering. Moreover, this kind of structure system belongs to a flexible cable net structure with the main characteristics of the nonlinear large vertical deformation, and the structure response under load is completely different from the mainly rigid structure in conventional construction engineering. Thereby, the current elastic design method cannot reflect the nonlinear large vertical deformation characteristics of pre-stress tensegrity structure of an opening type, cannot achieve the safety control on the bearing capacity and the vertical deformation capacity of the flexible structure, and cannot satisfy the characteristics requirements of the flexible structure system having the characteristics of nonlinear large vertical deformation. Based on the above reasons, the current design method cannot fully meet the safety, the economy and the rationality requirements of pre-stress tensegrity structure of an opening type.

Asymmetric cable-membrane tensegrity structure of opening type, method of constructing the same and method of designing the same

CHINA AVIATION PLANNING & CONSTRUCTION DEVELOPMENT


Semi-submersibles are subjected to loading from waves, causing racking, longitudinal shear and parallelogramming, or differential movement of the pontoons. The cyclic wave loading makes the various connections, where stress concentrations occur, susceptible to fatigue damage throughout the hull structure. This is most evident at the connections between the braces and the main hull structure. A revised brace to main hull connection with reduced bending stiffness is employed to reduce the moment being transferred from the brace to the hull, thereby reducing the bending stress and susceptibility to fatigue damage. This improved connection employs an internal member to transfer the loads between the brace and hull structure mainly as tension and compression. As a consequence of the improved fatigue performance, the structural weight of the connection can be greatly reduced, thus increasing the capacity with which the semi-submersible hull can operate.

This invention relates to mobile offshore units. Mobile offshore units are used in the offshore industry mainly for drilling and production operations, but also for general construction operations, crew accommodation, wind-turbine installation, etc. Semi-submersibles are a type of floating mobile offshore unit designed to provide a stable platform to support the necessary offshore operations in water depths where an on-bottom structure is not feasible.
The invention provides permanent means of structural connection, between the multiple hulls or multiple legs of the semi-submersible.
Semi-submersibles typically consist of a deck or deck box supported by a plurality of columns connected by large longitudinal pontoons and a series of transverse braces, at least two per vessel, typically one at the forward column and one at the aft column [see U.S. Pat. No. 4,436,050]. The braces extend from column to column, column to pontoon, or pontoon to pontoon, depending upon the design, but essentially, the braces connect parts of the main hull.
During operation, a semi-submersible is ballasted to a depth at which its longitudinal hulls are submerged, its columns penetrate the surface of the water and its braces are typically submerged. The hull can be partially de-ballasted to float at a reduced draft, to provide a greater clearance between the hull deck box and the surface waves.
In transit mode, a semi-submersible is completely de-ballasted resulting in it floating at its minimal draft. In this condition, it floats purely on the pontoons, with the columns completely above the water surface. The braces are typically above the water surface in this condition.
Weight in a semi-submersible is a critical design parameter. With Variable Deck Load around 15 percent of operating displacement, any lightship weight reduction has a multiplicative advantage to carrying capacity.
Throughout its life, a semi-submersible is subjected to global wave loadings which are resisted by the brace working in concert with the deck or deck box. Due to the wave loads on the semi-submersible, significant loading of the braces can occur, particularly at their connections.
The brace loading can be separated into two components; 1) an axial load due to squeeze/pry loads, where the hulls are forced together or pulled apart, by wave action, and 2) bending due to direct action of the waves perpendicular to the axis of the brace and due to the racking and parallelogram deflection, resulting in longitudinal and vertical displacement of the brace ends, relative to each other.
Considering that the wave loading is cyclical, the fatigue life considerations typically drive the design details, and scantlings of the brace members and their connections.
From this description, it can be appreciated that the braces of a semi-submersible are typically very robust and able to withstand compression, tension and bending loads, with due consideration made to assure adequate fatigue life. The brace is a beam column, with fatigue loading.
In the past, the approach has been to size the braces for the squeeze and pry forces, considering the minimum slenderness ratio required of the brace to withstand damaged condition loads and reinforce, or increase the cross-section at the end connection [see U.S. Pat. No. 4,771,720] of the brace ends to withstand the bending induced by the global parallelogram and racking deflections of the hull. Naturally, to achieve the required slenderness ratio, the braces are designed with a significant cross-section resulting in essentially a fixed ended brace. In a fixed ended traditional brace design, the bending stress is typically of the same magnitude as the axial stress, requiring heavy reinforcement to withstand the unintended parasitic bending stress.
Typically, from the brace at vessel centerline to their end connections at the hull, port and starboard, the brace walls are progressively increased in thickness to handle the hull deflection induced bending and its resulting cyclic fatigue stresses. Naturally, as the brace ends are reinforced, they are stiffened, and tend to attract more bending load, caused by the hull deflection. With greater load comes incremental stress, requiring increased reinforcement and weight.
Reinforcing the brace to hull connection increases the rotational stiffness of the connection, attracting more load, making reinforcement an ineffective way to address the connection fatigue issues. The reinforcement added to the brace is of little value to the vessel, other than to assure the survivability of the brace itself. The brace is intended to resist the axial squeeze/pry loads caused by hydrodynamic wave loading. The bending of the brace is the result of hull deflections over which the brace has no control. In other words, that bending is due to the hull parallelogram and racking deflections which are controlled by the stiffness of the hull box structure, which has orders of magnitude greater torsional stiffness than the braces, and therefore not greatly influenced by the stiffness of the braces. Increasing the stiffness of the braces to bending, only adds weight, without significantly reducing the magnitude of the hull deflection.
Besides having to keep the final stresses low to achieve adequate fatigue life, which finally requires very thick and heavy sections, the complex geometry at the intersection of the braces with the hull may require measures such as weld toe grinding and weld profiling [see CN 203,612,180] or making the entire hull to brace connection as a cast piece. As a result, the brace to hull connection can be very costly to construct, requiring lots of planning, inspection and lead-time.
Another brace solution has been to utilize more than 2 braces, per hull, typically two at the forward column and two at the aft column [see U.S. Pat. No. 6,378,450 B1]. As the squeeze and pry loads are shared, this arrangement has the advantage that the braces can be made smaller in cross-section and thereby less stiff. As a result, these braces attract less bending, given the same magnitude of hull deflections. However, this design suffers the same cost and weight deficiencies of the 2 brace design when the one brace damaged condition is considered.
It has been attempted to eliminate the braces entirely and rely on the columns and deck box connection to withstand the squeeze and pry forces [see U.S. Pat. No. 6,009,820]. This arrangement converts squeeze and pry forces between the pontoons from axial loads on the braces to loads which create bending moments at the column to deck box connection and increase the bending due to racking at the column to deck box connection. In practice, this arrangement resulted in deck box plate cracking, at the column to deck box connection, and braces were retrofitted to take the squeeze and pry loads directly, thereby reducing the deck box deflections to acceptable limits.
Other designs have added a truss-work of braces to prevent hull relative deflection and brace end relative displacement, but this results in a still heavier structural design.

Bending stiffness reducer for brace to hull connection


A computer-implemented system and method for using certain simulated sensors constructed with an accurate localization sensor and a mobile phone to replace/enhance many existing real-life sensors. By using “simulated sensor” to convert localization sensor measurement to real signal outputs that are similar to real distance-sensor outputs, real direction sensor outputs, or real line following sensor outputs, one or more embodiments of the invention may be used to upgrade traditional robots by plugging these simulated outputs to robots' corresponding sensor inputs without the need to rewire or add customized hardware.

Technical Field
The disclosed embodiments relate in general to the field of robotics and, more specifically, to systems and methods for using an external sensor, such as an accurate location sensor, and a mobile device to simulate real sensors for a robot.
Description of the Related Art
Adding new fancy functions such security fencing or dynamic navigation map to a released robot in a traditional way is not an easy task. Normally, robot owners need to ship robots back to manufactures for installing new sensors, adding new hardware and software interfaces for defining a map or security fencing and reprogramming the core control units with new algorithms for new hardware and the corresponding new functions. The above-described required steps make the overall robot upgrade process very expensive and time-consuming.
On the other hand, robots may need many different sensors to help their navigation. It may need line detection sensors to tell if the robot is on the left or right of a line so that the robot can follow a predefined line. It may need a distance sensor to tell the robot how close it is to existing obstacles for collision avoidance. It may also need direction sensors to tell the robot how to turn its direction accurately for some tasks such shooting a photo or a video.
Therefore, there is a need for new systems and methods that would provide new sensing functionality to existing robots in an inexpensive, simple and effective manner.

Systems and methods for using an external sensor and a mobile device to simulate real sensors for a robot


A non-volatile semiconductor memory device capable of selectively storing one of at least three different data comprises a memory array including a plurality of memory cells, each having a control gate, a floating gate, a drain, and a source, a circuit for producing a stepped voltage whose level is varied stepwise to a number of different levels corresponding to a number of data to be stored, a circuit for producing a pulse voltage having a predetermined voltage level and a predetermined pulse width, and a circuit for selecting one of the plurality of memory cells, wherein during storing of the at least three different data the stepped voltage and the pulse voltage are applied to the control gate and the drain of the selected memory cell, respectively, while a timing of application of the pulse voltage to the drain is controlled relative to a timing of application of the stepped voltage to the control gate, depending on which of the at least three different data is to be stored into the selected memory cell.

1. Field of the Invention
The present invention relates to a nonvolatile semiconductor memory device capable of electrically writing information therein, and a method of using the same, namely a method of writing data into this memory device, or reading data from the memory device. More specifically, the present invention concerns a non-volatile semiconductor memory device capable of selectively writing any one of more than two values into each memory cell, and also a method of writing, or reading data into, or from this memory device.
2. Description of the Related Art
As one sort of non-volatile semiconductor memory devices, there is an EPROM (Erasable and Programmable Read-Only Memory). In this EPROM, data stored therein is erasable by irradiating ultraviolet ray to the EPROM, and also new data is electrically writable therein.
Each of memory Cells of this EPROM employs a MOS transistor including a drain region and a source region, which are fabricated on one surface of a substrate and are mutually separated from each other, and a channel region formed therebetween. The MOS transistor further includes a tunnel insulating film, a floating gate electrode, an interlayer insulating film, and a control electrode, which are successively formed on this channel region.
To write data into such a memory cell, electron charges are injected via the tunnel insulating film into the floating gate, thereby causing the memory cell to assume a first state indicating, for instance, data "1" where a threshold voltage of the memory cell is set to a high value, and conversely, data "0" is represented by a second state of the memory cell where the threshold voltage of the memory cell is set to a low value by removing the electron charges from the floating gate. This stored data is read out by sensing whether the memory cell is set into the first state, or the second state, by applying a voltage lower than the above-explained higher threshold voltage value and higher than the lower threshold voltage value to the control gate electrode.
The above-described conventional EPROM can store only data having two different values, since the respective memory cells are selectively set to one of the first and second state, resulting in a small memory capacity. To allow for a recent trend of increasing data amounts, it is desired to develop such an EPROM having a large memory capacity with a small number of memory cells.
To this end, the inventors have proposed a method of selectively writing 4-value data into each of the memory cells of EPROM in "The Proposal of Multi-bit type Flash Memory", at the 53rd Autumn Meeting, 1992, The Japan Society of Applied Physics, 17a-ZS-9. However, this proposal merely described the very basic idea. Thus, there are many difficulties to practically realize this type of flash memory.

Non-volatile semiconductor memory cell capable of storing more than two different data and method of using the same


A shaft enlargement arrangement for a boring system is provided, the shaft enlargement arrangement comprising a hollow column proximate a lower end of the boring system; a first cutter head that is rotatably fitted to the hollow column, with first drive means being provided to rotate the first cutter head relative to the hollow column so as to bore downwardly a hole having a diameter corresponding substantially to the diameter of the first cutter head; and a boring head arrangement fitted to an operatively lower end of the column, the boring head arrangement terminating in a second cutter head to bore a leading hole as the boring system proceeds to bore downwardly. In an embodiment, the first cutter head comprises a support body carrying a winged arrangement, the support body being rotatably fitted to the column, the winged arrangement comprising a plurality of wings extending from the support body, each wing being fitted with, or comprising, a plurality of first cutter elements.

Conventional raise boring begins with the drilling of a pilot hole vertically down, typically using a directional drilling system. It is drilled using a drilling unit at the surface from which a hollow drill string, comprising a plurality of drill pipes fitted together, extends downwardly. A roller bit to drill the pilot hole is fitted to the lowermost drill pipe of the drill string, with the pipes having a standard thread for high-torque applications. After the pilot hole has broken through to a lower level, the roller bit is removed and replaced with a reamer head comprising a plurality of cutters. The reamer head is rotated and pulled back towards the surface-mounted drilling unit so as to cut a larger hole, or raise, through the ground and rock. The cuttings fall by gravity into a chamber at the bottom of the hole, typically in an uncontrolled manner, where they are removed using a loader.
Blind hole boring, on the other hand, comprises drilling an oversized pilot hole. The oversized pilot hole can be drilled either in a single step, or, more typically, by first drilling an initial 400 mm pilot hole, for example, which is then subsequently enlarged to define a 3 m oversized pilot hole. This process is reasonably well known in the art. A cutting head is then installed above the drilled oversized pilot hole, so that drilling can occur downwardly. The cuttings are then flushed out of the oversized pilot hole. This particular technique is not used that often, as the risk of blocking the pilot hole and creating mud rushes at the bottom of the hole is relatively high.
No known boring system is capable of boring relatively larger holes (preferably having a diameter of between 8 and 15 metres, but possibly even larger), with the cuttings being removable from above the boring system without having to flush out the cuttings, using, for example, reverse circulation.
There are a number of related prior art documents, including published PCT patent application no. WO9320325 which discloses a down reaming apparatus having an upper stabilizer which supports the down reaming apparatus in a bored hole, and a lower stabilizer that provides additional support for the down reaming apparatus.
U.S. Pat. No. 3,965,995 discloses a machine for boring a large diameter blind hole, the machine including a cutterwheel mounted at the lower end of the machine for rotation about a horizontal tubular support. A gripper assembly, positioned above the cutterwheel, secures the machine against the tunnel wall. U.S. Pat. No. 4,646,853 discloses a substantially similar machine.
The prior art documents listed and described above are just a selection of known documents that disclose, to varying degrees, the broad concept of down reaming. However, they all tend to suffer from the following disadvantages:                1. None of them disclose easily implementable arrangements for removing the reamed cuttings from above the reaming apparatus i.e. so that the cuttings exit out of the top of the bored hole.        2. None of them disclose a gripping arrangement that would enable the relatively larger holes (with diameters of between 8 and 15 metres) to be safely, efficiently and economically drilled.        3. None of them disclose a scalable apparatus, to enable a single reaming or boring apparatus to be modified to bore shafts of varying diameters.        4. None of them disclose the ability to bore through hard rock, which presents particular difficulties. At the moment, hard rock boring involves using a blast and advance sequence, which the present invention specifically aims to avoid.
It is an aim of the present invention to provide a boring system or rig to address the above shortcomings prevalent in existing boring arrangements. In an embodiment, the aim is to provide a blind shaft boring system that can achieve very accurate directional drilling and avoid having to drill an initial pilot hole, as is conventionally done.

Shaft enlargement arrangement for a boring system


The invention is directed to a thermoplastic film package having one or more pouches for holding articles such as thermoplastic film bags, and a method of producing and filling such a package. The package is made from a thermoplastic film bag folded along horizontal and vertical fold lines such that a pouch having an open end is defined by the walls of the bag. It is non-permanently and non-destructively secured by adhesive tape or a selectively applied adhesive in the folded position such that the pouch can be used for storing articles. The entire thermoplastic film bag enclosure is accessible upon release of the non-destructive adhesive or tape and unfolding of the bag along the horizontal and vertical fold lines.

1. Field of the Invention
The present invention relates to thermoplastic film bags, and more particularly, thermoplastic film bags that are foldable and non-permanently and non-destructively held in a folded position. It further relates to a method of packaging articles in such a manner that waste is virtually eliminated.
2. Brief Description of the Prior Art
Bags that are foldable to vary their size are known in the art. Such bags have been used to hold fruit and personal articles. One such bag is disclosed in U.S. Pat. No. 3,425,470 to Wuest. The Wuest device is a combination hand bag and basket made of a material capable of folding. The body of the hand bag can be collapsed or expanded to form a hand bag of varying sizes, or be collapsed or expanded to provide a receptacle in basket form in varying sizes. The basket in each instance includes a handle and flap.
A combined fruit picking sack and measure is disclosed in U.S. Pat. No. 790,194 to Douglass et al., which relates to an improvement in receptacles for gathering or picking fruit or the like. The apparatus includes a bag having a plurality of hooks, and a stiffening member extending transversely across the lower end of the bag.
A folding bag is disclosed in U.S. Pat. No. 932,721 to Rueter which includes a bag which may be used as an ordinary lady's handbag and may be extended so as to form a shopping bag. The folding bag consists of an ordinary bag frame, having a sack-like receptacle, made of leather or of any other suitable fabric, and a size adapted to receive a large quantity of articles to be carried along.
Thermoplastic film bags are commonly used as trash bags or food bags and are stored ready for use in, for example, a cardboard container. The container is discarded when the last thermoplastic film bag is used. Thus, the container contributes as a source of waste.
It is an object of the present invention to provide a thermoplastic film package that substantially reduces waste product.
It is another object of the present invention to provide a thermoplastic film package that is formed from a single thermoplastic film bag.
It is a still further object of the present invention to provide a thermoplastic film package having at least one pouch for holding at least one thermoplastic film bag.
Yet another object of the present invention is to provide a thermoplastic film package that is non-permanently and non-destructively held together such that the thermoplastic film package is not damaged when unfolded.
A still further object of the present invention is to provide a thermoplastic film package that is usable as a thermoplastic film bag.

Reusable trash bag or food bag container and method of making it


A substrate for a solid state lighting module has a plurality of serrated finger sections extending from an interconnecting base. The substrate may be formed from a single rectangular sheet by cutting away material between adjacent finger sections of a symmetrical second substrate to form the finger sections of the substrate. Parallel linear rows of solid state light sources may be disposed along the length of each finger section. For example, the solid state light sources may be disposed proximate to points of sawteeth at the edges of the finger sections.

Solid state lighting is being developed as a more energy-efficient and durable alternative to conventional lighting technologies such as incandescent and fluorescent. A solid state lighting device may include solid state light sources such as LEDs (light emitting diodes) that are mounted on a substrate such as a PCB (printed circuit board). The physical shape of the substrate used in solid state lighting devices is often designed such that the solid state lighting device can be used in place of a conventional lighting device. For example, some solid state lighting substrates have a so-called "bar" shape with a plurality of solid state lighting components arranged linearly thereon, resulting in a solid state lighting device that can be mounted in a tube and used to replace a single fluorescent tube light. Some other solid state lighting substrates have a planar quadrilateral shape such as a rectangle or a square, and occupy a large area.

Shaped substrate with arrangement of solid state light sources


Growth of mammary adenocarcinoma in a mammal can be inhibited by orally administering a therapeutically effective dosage of pyruvate in the form of sodium pyruvate, calcium pyruvate or organic esters of pyruvate or precursors of pyruvate.

Field of the Invention
This invention relates to a method for treating a mammal with pyruvic acid and its salts and esters to inhibit the growth of malignancy, the spread of malignancy and to retard DNA breaks.
Pyruvate has been described for use in retarding fatty deposits in livers (U.S. Pat. No. 4,158,057); for retarding diabetes (U.S. Pat. No. 4,874,790); for retarding weight gain (U.S. Pat. Nos. 4,812,479, 4,548,937, 4,351,835); to increase body protein concentration in a mammal (U.S. Pat. No. 4,415,576); for treating cardiac patients to increase the cardiac output without accompanying increase in cardiac oxygen demand (Ser. No. 802,062, filed Nov. 27, 1991); for extending athletic endurance (U.S. Pat. No. 4,315,835); and for retarding cholesterol increase (U.S. Pat. No. 5,134,162).
Malignancies are usually carcinoma, associated with glands, lungs, etc. or sarcoma, associated with muscle, bone. Malignancies are a major medical problem in mammals, and particularly involving humans. The adenocarcinoma is a form of malignancy (carcinoma) which is known to function predictably in rats and similarly in rats and in humans. In malignancies the DNA strands become damaged and break.

Inhibiting growth of mammary adenocarcinoma


A pneumatic tire having a designated orientation for mounting to a vehicle includes a tread, sidewalls, beads including bead cores, respectively, and a carcass including a carcass ply. Each bead includes a rubber apex, an outer bead and an inner bead, the rubber apex includes an outer apex portion and an inner apex portion, the outer apex portion includes a first outer apex portion positioned inward from the carcass ply in the axial direction and a second outer apex portion positioned outward from the carcass ply in the axial direction, the inner apex portion includes a first inner apex portion positioned inward from the carcass ply in the axial direction and a second inner apex portion positioned outward from the carcass ply in the axial direction, and the second outer apex portion has height which is greater than height of the second inner apex portion in the radial direction.

Field of the Invention
The present invention relates to a pneumatic tire having satisfactory durability and steering stability.
Description of Background Art
A pneumatic tire may be provided with a carcass and a rubber apex where the carcass is composed of a carcass ply extending from the tread to a bead core on both sides of the bead, and the rubber apex extends radially about the tire in the bead along the carcass ply (see, for example, Japanese Unexamined Patent Application Publication No. 2012-236499). The entire contents of this publication are incorporated herein by reference.


Provided are a system for search and a method for operating thereof. The system for search includes: a preliminary data analysis part which extracts a variety of attributes through analysis of images being input, analyzes a trend about a category as information requested by a client with the image analysis result, and stores the trend analysis result as metadata; an index part which stores the image analysis result, and structuralizes, organizes and stores the stored metadata in order to easily search the metadata; and a search part which extracts trend information matching a category input by a client, from the index part and provides the trend information in a predetermined format.

1. Field
One or more exemplary embodiments of the present disclosure relate to a system for search and a method for operating thereof, and more particularly, to a system for search which identifies contents formed in data, analyzing a trend, and providing the trend to a client, and a method for operating thereof.
2. Description of the Related Art
General search systems provide specialized searches to return a search result to a client. For example, when a client searches for classification information related to people and/or vehicles in image data, general search systems form category information by using an image analysis algorithm capable of generating the classification information, and the client retrieves information from a specified category. That is, related art search systems use processes for analyzing a client's requirements and finding items. The formation of such a search system is disclosed in Korean Patent Laid-Open Publication No. 2007-0007031 and Japanese Patent Laid-Open Publication No. 1995-325832.

System for search and method for operating thereof


In an encoding and decoding method of color signal components of picture signals having a plurality of resolutions, an encoding system and a decoding system can be obtained color pictures with higher definition, so that color difference signals in a format of the macroblock of 4:4:4 are encoded by a circuit 102. These color difference signals with the highest definition are down-sampled by a down sampling circuit 103 and then encoded by a circuit 101. These color difference signals with intermediate definition are further down-sampled by a down sampling circuit 104 to produce the color difference signals with the lowest definition. These color difference signals in a format of the macroblock of 4:2:0 are supplied to and encoded by a circuit 100. Data output from the circuits 100, 101, and 102 are composed by a combining circuit 105 and transmitted.

FIELD OF THE INVENTION
The present invention relates to methods and systems for encoding and decoding picture signals and related picture signal recording media, and more particularly, relates to such methods and systems suitable for use in compressing high definition television signals (HDTV signals) and recording the compressed HDTV signals in a recording medium, such as an optical disc, magneto-optical disc or a magnetic tape, reproducing the recorded compressed HDTV signals, expanding the reproduced compressed HDTV signals to restore the normal range, and displaying the restored HDTV signals.
FIG. 1 shows a conventional picture signal encoder and a conventional picture signal decoder by way of example. The picture signal encoder includes a preprocessing circuit 1 which separates a luminance signal (Y signal) and a color difference signal (C signal) of an input video signal VD1, such as an HDTV signal. An analog-to-digital (A/D) converter 2 converts the luminance data into a corresponding digital luminance signal and stores the digital luminance signal temporarily in a frame memory 4. An A/D converter 3 converts the color difference data into a corresponding digital color difference signal and stores the digital color difference data temporarily in a frame memory 5. A format conversion circuit 6 converts the digital luminance data and the digital color difference data in frame format stored in the frame memories 4 and 5 into corresponding luminance data and color difference data in a block format, and provides the luminance data and the color difference data in block format to an encoder 7. The encoder 7 encodes the input data and supplies a bit stream representing the coded input signals to a recording medium 8, such as an optical disc, a magneto-optical disc, or a magnetic tape for recording.
A decoder 9 decodes the data reproduced from the recording medium 8 in a bit stream. A format conversion circuit 10 converts the decoded data in block format provided by the decoder 9 into corresponding decoded data in frame format. Luminance data and color difference data provided by the format conversion circuit 10 are stored respectively in frame memories 11 and 12. The luminance data and the color difference data read from the frame memories 11 and 12 are converted into an analog luminance signal and an analog color difference signal, respectively, by digital-to-analog (D/A) converters 13 and 14. A post processing circuit 15 combines the analog luminance signal and the analog color difference signal to provide an output video signal VD2 to an external circuit, not shown for purposes of simplicity and clarity.
As shown in FIG. 2, picture data representing a picture of one frame is depicted therein consisting of V lines each of H dots per inch which is sliced into N slices, i.e., a slice 1 to a slice N, each of, for example, sixteen lines, and each slice includes M macroblocks. Each macroblock comprises data blocks Y[1] to Y[4] including the luminance data of a group of 8.times.8 pixels, and data blocks Cb[5] and Cr[6] including color difference data corresponding to all the pixel data (16.times.6 pixels) of the data blocks Y[1] to Y[4].
Thus, each macroblock includes the luminance data Y[1] to Y[4] of the 16.times.16 pixel area arranged along the horizontal and vertical scanning directions as an unit for the luminance signal. The two color difference signals are time-base multiplexed after data compression and the color difference data for the 16.times.16 pixel area is allocated to the blocks Cb[5] and Cr[6] each having 8.times.8 pixels to process one unit. The picture data represented by the macroblocks are arranged successively in the slice, and the picture data represented by the blocks (8.times.8 pixels) are arranged successively in a raster scanning sequence in the macroblock (16.times.16 pixels).
The luminance data Y[1] to Y[4] and the color difference data Cb[5] and Cr[6] are transmitted in that order. The numerals in the reference characters denoting the data indicate the data's turn for transmission.
The encoder 7 compresses the received picture data and supplies the compressed picture data to the recording medium 8. The decoder 9 expands the compressed data received thereby and provides the expanded picture data to the format conversion circuit 10. The quantity of the data to be recorded in the recording medium 8 can be reduced by compression based on the line correlation and/or inter-frame correlation properties of picture signals. The line correlation property enables compression of the picture signal by, for example, discrete cosine transform (DCT).
Inter-frame correlation enables further compression of the picture signal. For example, suppose that frame pictures PC1, PC2, and PC3 are produced respectively at times t.sub.1, t.sub.2, and t.sub.3 as shown in FIG. 3. The differences between picture signals respectively representing the frame pictures PC1 and PC2 are calculated to produce a frame picture PC12, and the differences between the frame pictures PC2 and PC3 are calculated to produce a frame picture PC23. Since the differences between successive frame pictures, in general, are not very large, a signal representing such differences is small. The difference signal is coded to further reduce the quantity of data.
As shown in FIGS. 4A and 4B, a group of pictures including picture signals representing frames F1 to F17 is processed as an unit wherein each frame is encoded either as an "I picture", a "P picture" or a "B picture", as explained below. More specifically, the picture signal representing the head frame F1 is coded as an I picture, the picture signal representing the second frame F2 is coded as a B picture and the picture signal representing the third frame F3 is coded as a P picture. The picture signals representing the fourth frame F4 to the seventeenth frame F17 are coded alternately as B pictures and P pictures.
The picture signal representing the I picture is obtained by coding the picture signal representing the corresponding frame (intra-frame encoding). Basically, the picture signal representing the P picture is encoded selectively by choosing one of two modes; either of which is selected to encode each macroblock depending on which mode provides greatest efficiency. The two modes available for encoding the macroblocks of each P picture include (1) intra-frame encoding and (2) an inter-frame encoding technique in which the differences between the picture signal representing the corresponding frame and the picture signal representing the preceding I picture or P picture are encoded as shown in FIG. 4A. The picture signal representing the B picture is obtained by selectively encoding each macroblock using the most efficient one of (1) intra-frame encoding, (2) inter-frame encoding and (3) a bidirectional encoding technique in which the differences between the picture signal representing the corresponding frame and the mean of the picture signals representing the preceding and succeeding frames are encoded as indicated in FIG. 4B.
FIG. 5 is a diagrammatic view to assist in explaining the principles of a method for coding a moving picture. As shown in FIG. 5, the first frame F1 is processed as an I picture to provide data F1X on a transmission line (intra-frame coding). The second frame F2 is processed as a B picture coded to provide transmission data F2X.
As indicated above, the macroblocks of the second frame F2 as a B picture can be processed in any of a plurality of processing modes. In the first (intra-frame) processing mode, the data representing the frame F2 is coded to provide the transmission data F2X (SP1), which is the same as the processing mode for processing the I picture. In a second (inter-frame) processing mode, the differences (SP2) between the frame F2 and the succeeding frame F3 are calculated and coded for transmission in a backward predictive coding mode. In a third (also inter-frame) processing mode, the difference (SP3) between the frame F2 and the preceding frame F1 are coded for transmission in a forward predictive coding mode. In a fourth (bidirectional-predictive) processing mode, the differences (SP4) between the frame F2 and the-mean of the preceding frame F1 and the succeeding frame F3 are calculated and coded to transmit transmission data F2X. That one of the these processing modes providing the least amount of data is employed for each macroblock.
For each macroblock, a motion vector x1 representing the motion of the picture of the objective frame (F1) for the calculation of the difference data (a motion vector between the frames F1 and F2) (forward prediction) or a motion vector x2 (a motion vector between the frames F3 and F2 for backward prediction) or the motion vectors x1 and x2 are transmitted (bilateral prediction).
Difference data (SP3) representing the differences between the frame F3 of the P picture and the preceding frame F1 as a predicted picture, and a motion vector x3 are calculated, and the difference data and the motion vector x3 are transmitted as transmission data F3X (forward predictive coding mode) or the picture data (SP1) of the frame F3 is transmitted as the transmission data F3X (inter-frame coding mode). Either the forward predictive coding mode or the inter-frame coding mode that will more effective on reducing the amount of data is employed.
On the other hand, in the ISO-IEC/JTC1/SC29/WG11, an encoding method and a decoding method related COMPATIBILITY AND SCALABILITY is now examined. Scalability is achieved by spatial reduction in the peland emporal domain. Compatibility is a specific implementation of the spatial scalability. These are described in detail, on pages 125 to 137 of "Document, AVC-400 (Test Model 3)", which is issued on November 1992, by the ISO-IEC/JTC1/SC29/WG11.
However, the COMPATIBILITY AND SCALABILITY related an encoding method and a decoding method of color difference signals has not been examined in the concrete.

Encoding method and decoding method of color signal component of picture signal having plurality resolutions


A well apparatus adapted to be disposed in a wellbore includes a perforating apparatus and a packer adapted to set and isolate an annulus above the packer from a rathole annulus below the packer, the perforating apparatus including a new and novel rathole differential pressure balanced firing system where the firing system includes a ball release sleeve holding a firing piston, means for initially opening a top end and a bottom end of the ball release sleeve to the rathole annulus below the packer; and a plurality of sequentially operable hydraulic systems, the top end of the ball release sleeve being initially open to the rathole annulus below the packer but being subsequently closed to the rathole annulus below the packer and then reopened to the annulus above the packer when the packer is set. When the top end of the ball release sleeve is opened relative to the annulus above the packer and the significant pressure is applied to the annulus above the packer, the ball release sleeve releases the firing piston; as a result, since the firing piston is released, the firing piston drops and impacts a primer, the impact of the firing piston on the primer detonating the perforating apparatus.

The subject matter of the present invention relates to a firing system adapted for use in a perforating apparatus, and more particularly, to a differential pressure firing system disposed in a perforating apparatus adapted for use in a wellbore, the firing system maintaining the pressure above and below a firing apparatus pressure balanced at a rathole (hydrostatic) pressure and, by means of a plurality of sequentially operable hydraulic systems, maintaining the balanced rathole pressure across the firing apparatus until a packer is set and a pressure above the packer is increased to a level which exceeds the rathole hydrostatic pressure.
The concept of using differential pressure to fire a perforating apparatus is not new. For example, U.S. Pat. Nos. 4,817,718 and 4,880,056 to Nelson et al and U.S. Pat. No. 4,606,409 to Peterson et al disclose differential pressure fired perforating systems. In general, existing differential pressure fired perforating systems use the difference between annulus pressure above the packer and tubing pressure to power either a mechanical system or a hydraulic system, that is, an operating piston above the packer is always applying the annulus pressure above the packer to a side of a firing piston or a mechanical actuator; however, any movement of the firing piston or actuator is prevented by a tubing pressure being applied directly to the other side of the firing piston or mechanical actuator. However, in these existing systems, safety requires that the above the packer annulus pressure be maintained equal to the tubing pressure until such time that detonation of the perforating system is required. Only then can the annulus pressure above the packer be increased to a level greater than the tubing pressure below the packer.
One existing system is disclosed in U.S. Pat. Nos. 4,817,718 and 4,880,056 to Nelson et al. In order to maintain a margin of safety when using the existing system disclosed in the Nelson et al patents, a reference pressure chamber, located within the confines of the tool, is physically disposed below the firing piston and is filled with fluid at hydrostatic pressure; the annulus pressure above the packer is increased to a first pressure level; this closes off the reference pressure chamber and traps the fluid therein at the hydrostatic pressure thereby maintaining the pressure below the firing piston at the hydrostatic pressure; the annulus pressure above the packer is increased further to a second pressure level; this increases a pressure above the firing piston to a level above the hydrostatic pressure in the reference pressure chamber thereby creating a differential pressure and driving the firing piston onto a primer which detonates the perforating apparatus. However, since the reference pressure chamber is located within the confines of the tool, the firing piston is not open, at both ends, to an annulus area below the packer (also termed the "rathole annulus") prior to application of the differential pressure across the firing piston. Therefore, premature detonation of the Nelson system could occur because the Nelson firing piston is not truely pressure balanced prior to detonation. Since the firing piston is not open at both ends to the rathole annulus, the Nelson et al differential pressure firing system is classified as a "closed" system.
Still another existing system is disclosed in U.S. Pat. No. 4,606,409 to Peterson et al. At least for a short period of time, the system disclosed in Peterson et al may be considered an "open" system; that is, for a short period of time, the top and bottom ends of the firing piston are exposed to fluid pressure which exists within the rathole annulus. A check valve admits pressurized fluid into a pressure chamber disposed near the top part of the firing piston but immediately closes when the pressure chamber is full thereby trapping the fluid therein at hydrostatic pressure. However, when the check valve closes, since the top part of the firing piston is closed relative to the rathole annulus, the system is no longer considered to be an "open" system; rather, it is a "closed" system, one which may be subject to premature detonation due to unwanted pressure differences which exist between the top and bottom ends of the firing piston. Therefore, in order to maintain a margin of safety when using the system disclosed in Peterson, a locking sleeve piston prevents any premature movements of the firing piston toward a primer charge. Peterson's firing piston is actuated by bleeding off the pressure in the tubing string below the packer when the check valve is closed thereby reducing the pressure below the firing piston relative to the pressure existing within the pressure chamber.
However, none of the aforementioned existing systems are, at all times, open to the rathole annulus immediately prior to creating the differential pressure and actuating the firing piston; therefore, none of the existing systems may be truely classified as an "open" system. However, in-any event, none of the, existing systems maintain the firing piston or mechanical actuator pressure balanced at the rathole hydrostatic pressure by "opening" both ends of the firing piston or actuator to the rathole annulus below the packer and keeping both ends of the firing piston open to the rathole annulus until the packer is set and the pressure in the annulus above the set packer is increased to a point which exceeds the rathole hydrostatic pressure. In addition, the system disclosed in the Nelson et al patents requires that the distance between the packer and the firing head be limited in order to maintain the required differential pressure across the firing head which is necessary to detonate the firing head.

Wellbore apparatus including a rathole pressure balanced-differential pressure firing system