A thermosetting composition comprising: (A) a (meth)acrylate compound having a viscosity at 25° C. of 1 to 300 mPa·s with which a substituted or unsubstituted aliphatic hydrocarbon group including 6 or more carbon atoms is ester-bonded; (B) spherical silica; and (C) a white pigment, and having a shear viscosity at 25° C. and 10 s−1 of 1 Pa·s or more and 500 Pa·s or less and a shear velocity at 25° C. and 100 s−1 of 0.3 Pa·s or more and 100 Pa·s or less.

A light-emitting device utilizing a light-emitting semiconductor such as light-emitting diode (LED) that has been widespread in recent years is normally produced by a method in which a light-emitting semiconductor (LED) is fixed on a lead frame of a molded product obtained by integrally molding a synthetic resin as a reflector in the shape of a concave on a lead frame, followed by sealing with a sealant such as an epoxy resin or a silicone resin.
As the material for a reflector, Patent Document 1 discloses a composition that provides a cured product excellent in heat resistance and weatherability, as well as in adhesiveness with peripheral components, which is obtained by mixing a thermoset resin such as an acrylate resin with a white pigment such as titanium oxide.
When titanium oxide as a representative white pigment is used, the viscosity of a thermosetting composition tends to increase, and the fluidity of the thermoset resin liquid is deteriorated. If the fluidity of the liquid is poor, when a resin molded product is formed in a lead frame, bending or un-filling of a reflector, formation of voids or burrs in a lead frame molded body occur, and hence mass producibility of a light-emitting device becomes insufficient. Further, it is required that only a slight effect be exerted on continuous moldability if a thermosetting composition is stored at normal temperature.

Thermosetting composition, and method for manufacturing thermoset resin


A disposable body wrap is configured to be worn by a person in the manner of a diaper while the person is undergoing rectal examination. The wrap comprises a sheet having front and back area portions interconnected to a crotch area portion. Each of the front and back area portions has a waistband, and structure is provided for releasably securing these waistband portions together around the waist of the person wearing the wrap. A small access opening in the crotch area portion of the sheet is positioned and dimensioned to permit instrumentation to pass therethrough for rectal examination. A flap on the outside of the sheet covers the small access opening in the crotch area portion, and this flap also has a small access opening therein positioned and dimensioned to permit instrumentation to pass therethrough for examination purposes. The wrap reduces professional risk involved in performing the examination.

The present invention relates to a disposable body wrap for use by a person undergoing rectal examination which permits instrumentation to pass therethrough while protecting the person conducting the diagnostic procedure from possible contamination.
Colonoscopy, sigmoidoscopy, and barium enema are procedures which all have in common the introduction of a tube into the rectum and the insertion of a fluid medium (air or liquid) into the bowel. These procedures are done for either diagnostic or therapeutic reasons. Since there is an instrument in the anal canal and a fluid medium is introduced, there is developed a back pressure which often causes fluid (from both exogenous and endogenous sources) contamination of the local region and the professional performing the procedures. There are numerous diseases which can be transmitted via this type of contamination with feces and body fluids emanating from the colon. No effective barriers have been developed to date.

Body wrap for use in diagnostic procedure


A copper particulate dispersion containing copper particulates coated with water-soluble polymers and hydroxycarboxylic acid; hydroxycarboxylic acid; and polyhydric alcohol and/or a polar solvent. The copper particulate dispersion is produced by adding hydroxycarboxylic acid such as malic acid, citric acid, and the like or a solution thereof into a dispersion containing a polar solvent and copper particulates coated with water-soluble polymers, and stirring the obtained dispersion so that part of water-soluble polymers are substituted by hydroxycarboxylic acid; discharging released water-soluble polymers from the dispersion by ultrafiltration; and subsequently adding hydroxycarboxylic acid, polyhydric alcohol and/or a polar solvent, into the dispersion.

Metal particulates have been conventionally utilized as circuit formation materials such as electronic material-oriented electroconductive pastes, for providing: a printed wiring; an internal wiring of semiconductor; a connection between a printed circuit board and an electronic component; and the like. Particularly, unlike typical particles larger than submicrons, metal particulates having diameters of 100 nm or less can be lowered in sintering temperature, thereby bringing about an idea to utilize metal particulates as low-temperature sintering pastes and the like.
Attention has been particularly and recently directed to techniques such that investigations and developments thereof have been progressed, the techniques each configured to draw a fine circuit pattern in paste or ink containing therein metal particulates by screen printing or by using an inkjet printer, for example, followed by low-temperature sintering to form circuits. Although developments adopting silver particulates have preceded the other developments in the present state, silver has an essential defect of migration upon usage thereof as a circuit formation material, thereby bringing about a demand for development of a copper particulate dispersion for a paste, ink, and the like.
Here, unlike other noble metals, copper has a nature susceptible to oxidation, so that conduction of technical development of a copper particulate dispersion requires consideration of oxidation resistance of copper particulate not only in a synthesis stage of particulates but also in a situation where the dispersion is prepared and used as an ink.
As such, there has been disclosed an electroconductive ink in Patent Document 1 based on a combination of metal colloidal particles and various additives, for example. Although such an electroconductive ink is allowed to utilize a mixed colloid containing, as a main component, silver therein which requires no consideration of oxidation resistance, the electroconductive ink is not allowed to utilize a mixed colloid containing, as a main component, copper which requires oxidation resistance, thereby still stopping short of solving the problem of oxidation resistance suffered by a copper particulate dispersion, in the present state.
Further, in case of drawing a circuit pattern by an inkjet printer, metal particulates contained in an ink are required to keep long-term dispersibility in the ink. As such, for metal particulates to be used in inks for inkjet printers, it has been typically conducted to coat metal particulates with a polymer dispersant, to guarantee long-term dispersion stability.
In general, as a method for producing fine particles which is suitable for mass-production, there is a method to synthesize fine particles using chemical reaction in a liquid phase. The method to synthesize fine particles is no exception for producing metal particulates as well. For example, a method for reducing metallic compounds in a solution by reducing agent such as hydrazine is well known.
Further, there is well known a polyol method (see Patent Document 2, for example), as a method for synthesizing metal particulates in a concentrated system having a higher productivity. The polyol method is configured to heat and reduce an oxide or complexes of copper within polyol, in a manner that the polyol plays three roles of a solvent, a reducing agent, and a protective agent, thereby enabling obtainment of metal particulates in submicron or micron orders even in the concentrated system.
To obtain metal particulates having diameters of 100 nm or less by means of such liquid phase based reduction, it is effective to coat surfaces of the particulates with water-soluble polymers such as polyvinyl pyrrolidone, polyvinyl alcohol, or gelatin so as to restrict growth of the particulates, and to avoid agglomeration of the particulates. To this end, many methods have been proposed, in such a manner to conduct addition of water-soluble polymers upon reductive reaction or after obtainment of particulates to thereby cause the polymers to be adsorbed onto the particulates (see Patent Document 3 and Patent Document 4, for example).
In turn, the present inventors have proposed methods each configured to obtain copper particulates by heating and reducing an oxide, hydroxide, or complexes of copper in a solution made of ethylene glycol, diethylene glycol, or triethylene glycol, in a manner to add noble metal ions for production of nuclei and to add water-soluble polymers as a dispersant such as polyvinyl pyrrolidone, polyethyleneimine, or the like, thereby obtaining copper particulates having diameters of 100 nm or less excellent in dispersibility (see Patent Document 5, Patent Document 6, and Patent Document 7, for example).
The metal particulate dispersions obtained according to the methods each contain metal particulates which have diameters of 100 nm or less coated with water-soluble polymers and which are stably dispersed in the dispersion, thereby also exhibiting an excellent oxidation resistance. As such, technical developments are being conducted to utilize the metal particulate dispersion in a state of ink or paste, in a manner to draw a fine circuit pattern by an inkjet printer or by means of screen printing and to heat and sinter the circuit pattern at 150 to 400° C. by utilizing a low-temperature sintering ability specific to metal particulates having diameters of 100 nm or less, thereby forming a circuit.
However, insofar as based on the dispersion containing therein metal particulates coated with water-soluble polymers, it has been difficult to achieve simultaneous establishment of a film-forming ability of the dispersion and an electroconductive property of a sintered film. Namely, since the coated macromolecule layer for keeping dispersibility rather acts as a factor to obstruct sintering, it has been impossible to achieve a sintered film having a sufficient electroconductivity insofar as based on a thickness of typically formed polymer coating layer. When sintering temperatures are raised to solve this problem, there are caused rapid thermal decomposition and evaporation of the polymer coating layer together with a considerable shrinkage thereof, thereby failing to form a continuous circuit.
In turn, excessively decreased thicknesses of polymer coating layers fail to keep dispersibility of metal particulates in a dispersion, and deteriorate oxidation resistance of metal particulates. As such, it becomes important to control an atmosphere upon sintering, particularly in case of copper particulates apt to be oxidized in the atmospheric air, such that introducing hydrogen or sintering in a vacuum atmosphere enables formation of an electroconductive film capable of withstanding practical use (see Patent Document 8, for example).
However, sintering in a hydrogen atmosphere or vacuum atmosphere leads to a complicated configuration of apparatus, a higher cost, and a problem of safety.
Under such circumstances, it is desired to provide a copper particulate dispersion for circuit formation, which adopts copper particulates excellent in migration resistance, which possesses an excellent dispersibility and oxidation resistance of copper particulates, which possesses an excellent film-forming ability such that sintering can be conducted under a simple condition of weakly oxidative atmosphere or the like, and which is also capable of achieving a satisfactory electroconductive property of a sintered film.    Patent Document 1: JP-A-2004-143325    Patent Document 2: JP-A-59-173206    Patent Document 3: JP-A-2004-232012    Patent Document 4: JP-A-2004-256857    Patent Document 5: JP-A-2005-097677    Patent Document 6: JP-A-2005-307335    Patent Document 7: JP-A-2005-330552    Patent Document 8: JP-A-2000-123634

Copper particulate dispersions and method for producing the same


In a throttle control system in which a controller monitors accelerator position and controls throttle valve position accordingly rather directly coupling the accelerator to the throttle valve, a sensor monitors vehicle driving conditions related to desired engine output response and the controller adjusts the relationship between throttle valve position and accelerator position in accordance with the detected vehicle driving conditions. Factors indicative of driving conditions monitored by the sensor may include wheel slippage and selection of reverse transmission gear, in which case the controller will reduce the stroke of the throttle valve when either excessive wheel slippage or reverse gear is detected. Each monitored factor may be associated with a distinct characteristic curve relating throttle valve position to accelerator position with the appropriate characteristics being selected by the controller in accordance with the detected vehicle driving conditions.

The present invention relates generally to a throttle control system, in which a throttle valve is adapted to be angularly actuated electrically rather than being mechanically connected to an accelerator pedal. 0 More particularly, the invention relates to a throttle control system which controls throttle valve angular position as a specific function of the degree of depression of an accelerator pedal and possibly of other vehicle operating conditions.
Such throttle valve position control systems have been disclosed in European Patent First Publications Nos. 01 14 401, 01 21 937, 01 21 938, and 01 21 939. In these prior proposals or developments, the throttle valve angular position is generally controlled by an electromagnetic actuator associated with the throttle valve. A throttle control signal is produced depending upon the degree of depression of an accelerator pedal as indicated by a signal generated at the accelerator pedal.
A similar throttle control system has also been disclosed in the Japanese Patent First Publication (Tokkai) Showa No. 56-107925, published on Aug. 27, 1981. This document discloses an electronic fuel injection control system for a spark ignition internal combustion engine, which includes a throttle valve servo mechanism operative to control a throttle valve angular position depending upon the degree of depression of an accelerator pedal.
The aforementioned control systems are capable of controlling the throttle valve to a desired angular position corresponding to the depression rate of the accelerator pedals. Therefore, those systems may successful in controlling air induction at a rate corresponding to the accelerator depression degree. Theoretically, control of the throttle valve angular position implies direct control of engine output to obtain desired engine performance. However, in practice, due to production errors among individual engines and the wide range of possible environmental conditions, engine output does not necessarily correspond to the demand on the engine throughout the range of throttle valve angular positions.
There have been proposals for controlling engines or power trains including the engine and a power transmission to obtain output torque precisely corresponding to the output demand. SAE Technical Paper 830423, by the Society of Automotive Engineering, discloses a power train control system controlling the engine in a discrete manner by controlling the power transmission. In controlling the engine, the engine controller detects data from various points in the engine and adjusts fuel supply, ignition timing, EGR flow rate and intake air flow rate to optimal values derived from computations on the detected data. In controlling the transmission, a transmission controller detects engine load and vehicle speed, and derives the gear ratio to be established by the transmission and performs lock-up control on the basis of the results of computations on the detected data.
As will be appreciated, final goal for this type of throttle control system is to obtain good response characteristics to changes in accelerator pedal position. When the throttle valve angular position is controlled simply in accordance with the depression or other operation magnitude of the accelerator pedal, the engine output or vehicle driving force may not always match that required at the accelerator position. This could be due to wheel slippage under a relatively low friction road conditions and/or transmission gear position and so forth. For instance, when the vehicle is running on a road with a relatively low coefficient of friction, a smaller driving torque would be preferable to prevent the vehicular wheels from slipping. On the other hand, when the transmission is in reverse gear position, for example, slower response characteristics would be preferable to ensure steady and moderate increases in engine output. Driving in reverse would be greatly facilitated by ensuring that there will be no abrupt increases in engine output.

Throttle control system for internal combustion engine with vehicle driving condition-dependent throttle angle correction coefficient variable


A method for convening an input data character stream into an encoded data stream in a dictionary-based data compression system, which includes determining possible parsing options of the input data character stream; defining a directed labelled graph having vertices and edges, the graph being related to the possible parsing options; finding the elements of an optimal parsing by determining the shortest path between two given vertices of the graph, the finding of the elements of the optimal parsing including eliminating from the graph edges and vertices which cannot form a part of the shortest path; and encoding the elements of the optimal parsing.

The present invention relates to data compression methods which are used to improve the way information is stored on a digital computer, or transmitted over communication channels.
The primary benefit of using a data compression system is to reduce storage space, which may lead to significant savings. For instance, compressing all the files on the hard disk of a PC may delay the need to purchase a new, larger, hard disk. Similarly, a large data base and the auxiliary files needed to turn it into a full text information retrieval system, may fit onto a single CD-Rom only after suitable compression has been applied.
In addition to reducing required storage space, data compression methods can also lead to savings in processing time. Although the use of compression implies a certain overhead for decompressing the data when the data is accessed, the rate determining steps, or bottlenecks, of most systems are still the relatively slow I/O operations. In many cases, the overhead incurred in the decompression process is largely compensated by the savings in the number of read operations from external storage devices.
The present invention involves lossless compression which are fully reversible methods, allowing the reconstruction of the original data without the loss of a single bit. Not all compression methods are lossless. For example, most image compression techniques are lossy, involving the discarding of a significant portion of the data and thereby yielding generally much higher compression ratios than are possible with lossless techniques.
Many compression methods have been proposed. One well known method was offered by Huffman, (see Huffman D. A., A Method for the Construction of Minimum Redundancy Codes, Proceedings of the I.R.E., Vol. 40 (1952), pp 1098-1110). The Huffman method is statistical and is based on the idea that frequently occurring characters are encoded by shorter codewords than rare characters. Huffman's algorithm discloses how to assign, under certain constraints, such codewords in an optimal way once the character distribution is given or has been determined.
Widely used are the various dictionary-based compression systems. These use a list, called a "dictionary", of variable length strings, such as frequent words or word fragments. Compression is achieved by replacing in the text to be processed the occurrences of strings which can be found in the dictionary by a pointer, which is shorter than the string, to the corresponding entry in the dictionary.
Many modern data compression techniques are based on the pioneering works of A. Lempel and J. Ziv. often referred to as LZ methods. Two such methods are disclosed in Ziv J., Lempel A., A Universal Algorithm for Sequential Data Compression, IEEE Trans. on Inf. Th. IT-23 (1977) 337-343 (hereinafter "LZ77"), and Ziv J., Lempel A., Compression of Individual Sequences via Variable Rate Coding, IEEE Trans. on Inf. Th. IT-24 (1978) 530-536 (hereinafter "LZ78"). The innovation of LZ77 and LZ78, which are both dictionary-based, is that they build the dictionary adaptively while scanning the text, by using fragments of the text itself.
In the LZ77 method the dictionary is, in fact, the previously scanned text, rather than a separately stored dictionary, thereby obviating the need to store an explicit dictionary for this case. A pointer is used which is of the form (d,l), where d is the offset (i.e., the number of characters from the current location to the previous occurrence of the substring starting at the current location), and l is the length of the matching substring.
LZ78 forms the basis of the LZW method described in Welch T. A., High Speed Data Compression and Decompression Apparatus and Method, U.S. Pat. No. 4,558,302, Dec. 10, 1985. In the LZW method each of the strings in the dictionary is obtained from one of the earlier elements by appending a new character to its right, such that the extended string matches the string currently processed.
A common difficulty of the various dictionary-based methods involves the efficient location of previous occurrences of substrings in the text. The method of backwardly scanning the entire text for each character to be processed is normally unacceptably slow.
Many schemes for more efficiently locating substrings have been suggested. These include the use of binary trees, as in Bell T. C., Better OPM/L Text Compression, IEEE Trans on Communications, COM-34 (December 1986) 1176-1182; the use of hashing, as in Brent R. P., A Linear Algorithm for Data Compression, The Australian Computer Journal 19 (1987) 64-68, and Gibson & Graybill, Apparatus and Method for Very High Data Rate-Compression Incorporating Lossless Data Compression and Expansion Utilizing a Hashing Technique, U.S. Pat. No. No. 5,049,881, Sep. 17, 1991; and the use of Patricia trees, as in Fiala & Greene, Textual Substitution Data Compression with Finite Length Search Windows, U.S. Pat. No. No. 4,906,991, Mar. 6, 1990.
The question of how to parse the original text into a sequence of substrings is a problem which is common to all dictionary-based compression methods. Generally, the parsing is done by a "greedy" method, i.e., a method which, at each stage, seeks the longest matching element from the dictionary. While greedy methods have the advantage of speed, they do not always yield optimal parsing.
Because the elements of the dictionary are often overlapping (which is particularly true of LZ77 variants where the text, which also serves as the dictionary, consists of numerous overlapping fragments), a different way of parsing may, under some circumstances yield better compression. For example, assume that the dictionary, D, consists of the strings {abc, ab, cdef, de, f} and that the text, T, is `abcdef`; assume further that the elements of D are encoded by some fixed-length code, which means that, log.sub.2 (.vertline.D.vertline.) bits are needed to refer to any of the elements of D, where .vertline.D.vertline. denotes the number of elements in D. Then, parsing T using a greedy method, which tries always to match the longest available string, yields abc-de-f, which requires three codewords, whereas a better partition would have been ab-cdef, which requires only two codewords.
There is thus a widely recognized need for, and it would be highly advantageous to have, a dictionary-based data compression technique capable of optimally parsing a text in a manner which is not prohibitively slow.

Efficient optimal data recopression method and apparatus

Mitan Software International (1989) Ltd.


A system to enable detection of the process corner of each of the P and N devices of an SRAM array (of bitcells) and of peripheral devices. This permits more focused (optimized and compensated) design of non-SRAM peripheral circuits and of read and write assist circuits for better handling of process distribution impact on circuits improving functionality and yield.

Most existing process sensors are targeted towards the chip standard core devices and are ill suited for static random access memory (SRAM) device process corner sensing, because SRAM bitcells do not use standard core devices. Furthermore, the few process sensors designed for sensing SRAMs require "hacking" of the SRAM array and are targeted towards the overall corner of the SRAM and incapable of detecting device skew.

SRAM and periphery specialized device sensors


A new and improved apparatus for spraying water in a child's wading pool to simulate a typhoon comprising a water spraying assembly which has a first tube in a circular configuration forming a first ring of an enlarged diameter. A plurality of inwardly directed spray heads on the first ring and first fluidic coupling components are secured to the first ring. A second tube in a circular configuration forms a second ring of a reduced diameter with radially extending tubes terminating in a central sprinkler head coupled with respect thereto. Second fluidics components are secured to the second ring and a generally vertically oriented tube for coupling the fluidic components of the first ring and the second ring.

1. Field of the Invention
The present invention relates to apparatus for spraying water in a child's wading pool to simulate a typhoon and more particularly pertains to simulating a typhoon or other extreme condition of weather through the use of water sprays in a child's wading pool.
2. Description of the Prior Art
The use of shower heads and other water spraying devices is known in the prior art. More specifically, shower heads and other water spraying devices heretofore devised and utilized for the purpose of spraying water for one purpose or another are known to consist basically of familiar, expected, and obvious structural configurations, notwithstanding the myriad of designs encompassed by the crowded prior art which has been developed for the fulfillment of countless objectives and requirements.
By way of example, U.S. Pat. No. 3,539 to Larsen discloses an outdoor gym set with plural water spray heads.
U.S. Pat. No. 3,831,852 to Stillman, Jr., discloses a fountain spray system for swimming pools.
U.S. Pat. No. 3,877,644 to Cockman discloses a sprinkler head and game apparatus.
U.S. Pat. No. 4,235,378 to Melin et al discloses a water play toy.
U.S. Pat. No. 4,416,420 to Thompson discloses a portable fountain for pools or spas.
Lastly, U.S. Pat. No. 4,550,876 to Kulesza et al discloses a sprinkler toy.
In this respect, the apparatus for spraying water in a child's wading pool to simulate a typhoon according to the present invention substantially departs from the conventional concepts and designs of the prior art, and in doing so provides an apparatus primarily developed for the purpose of simulating a typhoon or other extreme condition of weather through the use of water sprays in a child's wading pool.
Therefore, it can be appreciated that there exists a continuing need for new and improved apparatus for spraying water in a child's wading pool to simulate a typhoon which can be used for simulating a typhoon or other extreme condition of weather through the use of water sprays in a child's wading pool. In this regard, the present invention substantially fulfills this need.

Apparatus for spraying water in a child's wading pool to simulate a typhoon


A shoe with skate wheels which can be alternatively used as a walking shoe or a skating shoe. The shoe is constructed so that the skate wheels are quickly, easily, and securely locked into either a retracted walking position or an extended roller skating position.

Prior sports devices suitable for walking or roller skating have been provided as shown in U.S. Pat. No. 3,983,643 wherein skating means are extendably and retractably contained within a cavity extending transversely over the entire sole of a shoe, and a longitudinal section connecting the cross-sections. In U.S. Pat. No. 3,979,842 wherein skating means are retractable into a cavity formed by a lower portion of an exerciser secured to the removable sole of a shoe, and within a housing formed as a bottom portion of the sole as shown in U.S. Pat. No. 4,333,249, or a shoe provided with conical disks affixed to a plate secured to the sole as shown in U.S. Pat. No. 4,928,982.


The present invention provides a laser annealing method for irradiating laser light L to an amorphous silicon thin film deposited on a substrate to obtain polysilicon, the method including: multiply irradiating the laser light L while changing an irradiation area of the laser light L on the amorphous silicon thin film to achieve such a grain size distribution that a crystal grain size of the polysilicon decreases from a central portion to a side edge portion at least along a center line C of the irradiation area of the laser light L. The above laser annealing method can reduce a leak current through a simple process.

1. Field of the Invention
The present invention relates to a laser annealing method for an amorphous silicon thin film, and more particularly, relates to a laser annealing method, a laser annealing apparatus, and a manufacturing process for a thin film transistor, which can reduce a leak current in the thin film transistor.
2. Description of Related Art
In general, thin film transistors (hereinafter referred to as "TFTs") have a structure in which a gate electrode, a source electrode, a drain electrode, and a semiconductor layer are laminated. In such a structure, a TFT having a polysilicon thin film as the semiconductor layer excels in electron mobility and finds its application in low power displays. It is conventionally known that in a manufacturing process for a TFT substrate, amorphous silicon deposited into a film on the TFT substrate is crystallized into a polysilicon (polycrystalline silicon) film by laser annealing, for example, see, Japanese Patent Application Laid-open Publication No. 2007-335780.

Laser annealing method, laser annealing apparatus, and manufacturing process for thin film transistor


A system for testing and measuring hole elongation or deformation in a test article. The system includes a frame, a bearing member, and a referencing arm. The frame has a receiving area adapted to receive a portion of a test article. The bearing member is positionable into a hole of the test article. The referencing arm is movably connected to the frame and is adapted to signal the location of a portion of the test article relative to the bearing member. A distance measuring device is wholely supported on the frame and arm to allow the test article to be tested to catastrophic failure without risk of damaging the measuring device.

b 1. Field of the Invention
The present invention relates to testing and measuring systems for article deformation and failure and, more particularly, to a system for testing and measuring elongation of a hole in a test article.
2. Prior Art
There exists in the prior art a deformation testing and measuring system known as an extensometer. The extensometer is generally adapted to put a test article under a tensile load to test and measure elongation or longitudinal deformation of the test article. The current use of an extensometer in bearing tests makes it very difficult to obtain consistent hole elongation measurements during the bearing test. The extensometer includes in its measurement elongation of the test article, sometimes a test coupon, and the test fixture between the extensometer attachment points. Extensometer slippage is also a problem during tests leading to erroneous measurements. The extensometer is always removed prior to catastrophic failure to preclude damage to the extensometer.
It is an objective of the present invention to provide a new and improved testing and measuring system.


A method and corresponding device for the alignment of a first substrate comprising at least two first alignment marks with a second substrate comprising at least two second alignment marks. By means of a first assignment, the first alignment marks are assigned to at least two first characteristic alignment features of the first substrate in an X-direction and in a Y-direction. By means of a second assignment, the second alignment marks are assigned to at least two second characteristic alignment features of the second substrate in an X-direction and in a Y-direction, and by means of an alignment, the first and second alignment marks are aligned in relation to one another in an X- and Y-direction by means of the first and second characteristic alignment features.

There are a number of methods for aligning and bonding two, in particular structured, substrates with one another. In the majority of all the methods, the aligner and the bonder are separate modules/chambers. The aligner orientates two substrates with one another with the aid of alignment marks. Fixing, in particular by clamping, takes place after the alignment. For this purpose, the two substrates are fixed against one another and against a sample holder. The fixing of the substrates to one another without the use of a sample holder is also conceivable. Such fixing without a sample holder is disclosed in publication WO2014154272A1, in which it is shown how a direct fixing of two substrates can take place by means of magnetic bodies.
The substrates fixed to one another then pass by means of a transport system into a bonding system, in which bonding of the two substrates takes place.
A fusion bonder represents a special case of such a bonding system. A fusion bonder is understood to mean a device which produces the bonding of two substrates by an, in particular, concentric contacting with the aid of a pin. As a result of the extremely clean surfaces of the substrates, self-fixing occurs due to the adhesive forces between the substrate surfaces. The adhesive forces are primarily van-der-Waals forces. A bond thus produced is referred to as a prebond, since it does not yet have the full strength that is theoretically to be obtained, which is produced in a further process step by a heat treatment and the accompanying generation of covalent bonds.
There are essentially two major problems with carrying out a fusion bond.
The first problem relates to obtaining alignment accuracy over long distances. Modern aligners are already capable of achieving alignment accuracies of less than 200 nm. This means that two substrates with corresponding alignment marks can be aligned and fixed in relation to one another with greater precision than 100-200 nm. However, this alignment accuracy has to be maintained over times as long as possible and/or over distances as long as possible. Furthermore, the fixing of the two substrates to one another must take place so securely that the achieved alignment accuracy is not lost by a displacement of the substrates in relation to one another, in particular during a handling process, for example by a robot.
The second problem is that the throughput with the alignment and therefore with the production of a bond is usually low with the previously known methods.
In very many cases, a complex and therefore costly aligner is used, which is able to implement different alignment methods, in particular face-to-face, back-to-face or back-to-back alignments.
Thermocompression bonders are a type of bonder preferably used according to the invention. High pressures and high temperatures can be produced with the aid of a thermocompression bonder. It is used preferably for metal diffusion bonding and/or for eutectic bonding. Since the metal surfaces should preferably be completely free from oxides, it is of fundamental importance that the atmosphere in such bonder chambers can be adjusted and monitored in a targeted manner. The present invention not only comprises a simple method of increasing the bonding throughput, but also describes in an advantageous way an embodiment and a method with which a controlled atmosphere can be generated and continuously maintained in a bonding chamber. Such atmospheres are particularly advantageous for the production of pure metal-metal bonds.
It is the problem of the invention to provide a method and a system, with the aid of which an improved and in particular quicker alignment of two substrates in relation to one another can be carried out.
This problem is solved with the features of the independent claim(s). Advantageous developments of the invention are indicated in the sub-claims. All combinations of at least two of the features stated in the description, the claims and/or the figures also fall within the scope of the invention. In the case of the stated value ranges, values lying within the stated limits should also be deemed to be disclosed as limiting values and can be claimed in any combination.
The idea underlying the invention is to provide a method for the alignment of a first substrate comprising at least two first alignment marks with a second substrate comprising at least two second alignment marks, wherein                by means of a first assignment, the first alignment marks are assigned to at least two first characteristic alignment features of the first substrate in an X-direction and in a Y-direction,        by means of a second assignment, the second alignment marks are assigned to at least two second characteristic alignment features of the second substrate in an X-direction and in a Y-direction and        by means an alignment, the first and second alignment marks are aligned in relation to one another in an X- and Y-direction by means of the first and second characteristic alignment features.
According to the device, the invention can be implemented in particular by the following features:                a first assignment module for the assignment of the first assignment marks to at least two first characteristic assignment features of the first substrate in an X-direction and in a Y-direction,        a second assignment module for the assignment of the second assignment marks to at least two second characteristic assignment features of the second substrate in an X-direction and in a Y-direction and        an alignment module, constituted in particular as a bonding module, for the alignment of the first and second alignment marks in relation to one another in the X- and Y-direction by means of the first and second characteristic alignment features.
An essential feature of the invention in particular is that the first and second alignment marks of the substrates are measured/detected in respect of characteristic substrate features, in particular a flat side and/or a notch, before said substrates are transferred into the bonding system or a bonding module, in particular a fusion bonder, still more preferably a thermocompression bonder. A measurement/detection in respect of other characteristic substrate features that can be identified and detected by optics would also be conceivable. This measurement/detection is carried out with the best possible precision. The measurement is in particular more accurate than 100 μm, preferably more accurate than 10 μm, still more preferably more accurate than 1 μm, most preferably more accurate than 100 nm, most preferably of all more accurate than 50 nm. It is also conceivable for an indication to be given concerning the accuracy of the rotation of the substrates (angular position in rotation) in relation to one another. The substrates are orientated in particular more accurate than 1°, more preferably more accurate than 0.1°, still more preferably more accurate than 0.01°, most preferably more accurate than 0.001°, most preferably of all more accurate than 0.0001° in respect of their rotational orientation in relation to one another.
On the basis of the measurement/detection, an exact positional chart of the alignment marks in relation to the characteristic substrate features is prepared (assignment). As a result of this preliminary measurement, only one alignment in respect of the characteristic substrate features needs to be carried out in the bonding station, and in particular not in respect of the first and/or second alignment marks. This is particularly advantageous when the alignment marks are located on the substrate surfaces to be bonded together and would thus have to be aligned by a very precise, but laborious alignment procedure. Aligners, which carry out such a face-to-face alignment, are disclosed for example in publications PCT/EP2013/075831, WO2014202106A1 or U.S. Pat. No. 6,214,692B1. Apart from the mentioned publications, there are also other aligners which perform a face-to-face alignment by the insertion of optics between the substrates. According to the invention, therefore, the introduction of an optical measuring device between the substrates or a relative displacement of the two substrates in relation to one another for the measurement can be dispensed with.
In particular, the idea underlying the invention is also to perform an assignment of the alignment marks, in particular spaced apart from the lateral boundary, to characteristic substrate features, in particular disposed at the lateral boundary, in an X-Y plane corresponding in particular to the respective substrate surface, in particular before the transfer into the bonding chamber. The assignment takes place in particular by defining a corresponding factor in a defined vector space, preferably at least related to the X-Y plane.
The invention thus relates in particular to a device and a method for increasing the throughput of a bonding system. The bonding system preferably comprises at least one bonding chamber and at least two assignment modules, which are constituted in particular as locks and in which a measurement of the first and second substrates takes place in each case. A transfer means, preferably a robot, conveys the first and second substrates in each case from the locks into the bonding chamber of a bonding system or of a bonding module. The orientation of the two substrates takes place in the bonding chamber on the basis of the characteristic features and/or the contacting of the two substrates. As a further particularly preferred feature according to the invention, the possibility is disclosed whereby the robot, which performs the transport of the substrates out of the assignment modules into the bonding chamber, already deposits the substrates in the bonding chamber in such a way that a further alignment in the bonding chamber is not necessary. The depositing thus implies alignment in this embodiment. The two substrates are then bonded together in the bonding system after being deposited. The bonding system/bonding module is in particular a fusion bonder, even more preferably a thermocompression bonder.
In other words, the present invention is based in particular on assigning respectively corresponding first and second characteristic substrate features corresponding to alignment marks by measurement/detection prior to a transfer of the first and second substrates. The assignment especially takes place in each case in an X-Y plane defined by an X-direction and a Y-direction and parallel to the first and second substrate surfaces.
A major advantage of the inventive embodiment according to one or more of the above-described features is primarily the fact that a relatively accurate measurement of the first and second alignment marks can take place in a location outside the bonding module, in particular in a lock. As a result of the measurement of the substrate surfaces and the accurate charting of the alignment marks in relation to the characteristic substrate features, the time during which the lock is evacuated can in particular be utilised. In particular, the problem of the alignment of two contact surfaces of the substrates, in particular spaced apart from the lateral boundary, or alignment marks lying on the substrate surfaces in relation to one another is thus solved in that the alignment takes place with the aid of the characteristic substrate features. The latter, especially in the contacted state of the substrates, are still accessible from the exterior at the contact surfaces, so that an alignment can take place up to the contacting, preferably continuously. As a result of this measure, it is possible to dispense with face-to-face alignment strategies or a displacement of the substrates parallel to the substrate surfaces beyond the alignment.
The alignment marks are spaced apart from the characteristic substrate features, wherein the characteristic substrate features are preferably disposed at the lateral boundary or at an outer contour of the substrates defined by the X-Y plane and the alignment marks are spaced apart from the lateral boundary.
According to an embodiment of the invention, provision is made such that, after the first and second assignment and before the alignment, a transfer of the substrates takes place into a bonding module or into a bonding chamber, in which in particular the alignment is carried out, preferably under a gas pressure less than 1 bar, more preferably less than 10−3 mbar, still more preferably less than 10−5 mbar, most preferably less than 10−8 mbar.
An essential aspect according to the invention is according to one embodiment in that the bonding chamber preferably remains continuously evacuated and is not opened to the atmosphere during the operation of the system, while the assignments take place in additional modules. If, after an evacuation, the bonding chamber is flooded with an, in particular non-oxidising, gas or gas mixture, this gas atmosphere is preferably retained.
In a development of the invention, provision is made such that the first assignment takes place in a first assignment module, constituted in particular as a lock, and the second assignment takes place, in particular in parallel with the first assignment, in a second assignment module, constituted in particular as a lock. The assignment is thus not only speeded up, but it is also conceivable for the alignments to be able to take place at the outer sides and/or on existing or subsequently produced contours of the substrates. A rotation of the substrates before the contacting of the substrates for bonding can thus be dispensed with.
Before the alignment, in particular in the first and/or second assignment module, preferably during the assignment, the gas pressure is advantageously reduced, preferably to a gas pressure of less than 1 bar, more preferably less than 10−3 mbar, still more preferably less than 10−5 mbar, most preferably less than 10−8 mbar. It is thus possible—especially when the assignment modules are constituted as locks—for the bonding in the bonding chamber to be speeded up, since the latter no longer needs to be evacuated or no longer evacuated for so long. The evacuation of an assignment module lasts in particular for less than 5 minutes, preferably less than 4 minutes, still more preferably less than 3 minutes, most preferably less than 2 minutes, most preferably of all less than 1 minute. The more rapidly the evacuation takes place, the greater the throughput.
In a further embodiment according to the invention, the measurement of the substrates according to the invention can also take place in an assignment module, which is constituted separate from the bonding chamber. The substrates are then transported over a longer distance into a bonding chamber. In particular, the substrates can be further processed by other process steps between the measurement according to the invention and the actual bonding process in the bonding chamber. The measurement of the substrates in the assignment modules is therefore itself a step according to the invention.
In a further embodiment according to the invention, the measurements can also take place in the assignment modules when the assignment modules are open to the surrounding atmosphere. The assignment modules can thus also be used exclusively for the measurement of the characteristic substrate features, without having to utilise the effect of the measurement during an evacuation. As a further aspect according to the invention, therefore, the assignment module alone is disclosed for the measurement of the characteristic substrate features, independently of an evacuation and/or a connection to a bonder.
Modules
Inasmuch as modules such as in particular assignment modules, alignment modules or measurement modules are described, the latter are constituted in particular as spatially separate chambers, which can preferably be connected to one another via locks. Thus, the chambers are constituted capable of being evacuated, in particular in each case to a gas pressure less than 1 bar, preferably less than 10−3 mbar, still more preferably less than 10−5 mbar, most preferably less than 10−8 mbar. The gas pressures in the chambers are preferably each adjustable separately from and independently of one another. Modules also serve for the preliminary treatment and/or post-treatment of the substrates or the bonded substrate stack. Thus, it is conceivable for the substrates to be inspected, measured, flipped, cleaned, etched and/or coated before they are introduced into the assignment modules according to the invention.
Control System
The control of the device and the described method features preferably takes place by means an, in particular central, control system. The latter is preferably software-controlled or comprises firm- and/or hard- and/or software, which in particular comprises memories for storing data/information in respect of the device and the alignment/assignment.
The Substrates
The substrates can have the any shape, preferably at least a predominantly round and/or flat shape. The substrates are in particular preferably standardised semiconductor substrates, in particular wafers. The substrates are described in particular by their diameter in the circular section. For wafers, use is preferably made of diameters standard in the industry, i.e. 1 inch, 2 inches, 3 inches, 4 inches, 5 inches, 6 inches, 8 inches, 12 inches and 18 inches. However, the embodiment according to the invention can in principle handle any substrate, irrespective of its diameter.
The following two types of wafer are preferably used:
The first type of wafer exhibits a marked divergence from the otherwise circular shape of the wafer, said marked divergence being produced by a straight peripheral section/substrate edge section (flat). The characteristic substrate feature is at least one of the two points of intersection of a straight line running in particular as a secant of the straight peripheral section/substrate edge section. The second type of wafer is circular, apart from a notch. The notch preferably serves for the alignment and/or rough adjustment, i.e. as a characteristic substrate feature.
Characteristic Substrate Features
According to the invention, a characteristic substrate feature is understood to mean, in particular, a point/position unequivocally assignable to the substrate, in particular to a geometrical position at the substrate outer contour. The characteristic substrate feature, in particular its position in the X-direction, Y-direction and preferably also in the Z-direction, is preferably optically detectable. On account of the size of the characteristic substrate feature, the position can be detected with an accuracy of less than 100 μm, preferably less than 10 μm, still more preferably less than 1 μm, most preferably less than 100 nm, most preferably of all less than 10 nm.
The characteristic substrate feature can in particular be a point of intersection of the straight peripheral section with the circular circumferential section of the substrate. Further characteristic features can be the notch or distinctive, micron-sized or nanometer-sized contours along the edge of the substrate. In particular, characteristic features are different for each individual substrate. According to the invention, the following in particular come into consideration as characteristic features:                alignment marks on the outer side of the substrates and/or        circular substrate edge section and/or        straight substrate edge section and/or        notch-shaped substrate edge section and/or        points of intersection of the aforementioned features and/or        points of intersection of tangents of the aforementioned features.
The characteristic substrate features are in particular unequivocally identifiable/assignable, stable and/or retrievable. The characteristic substrate features have an unequivocal point of reference, which can be retrieved preferably by measuring devices, particularly microscopes.
The characteristic substrate features are disposed in particular at the edge on the outer contour of the substrates or at least in a region close to the edge, i.e. the periphery, so that the measuring devices can detect them during the approach and up to the contacting of the substrates in the bonding system. Furthermore, characteristic substrate features lying farther outwards permit increased alignment accuracy.
By means of the characteristic substrate features, an unequivocal fixed point in relation to the alignment marks present on the substrate surface, in particular on the inner side of the substrates, can preferably be defined, in particular calculated. The surfaces that are later bonded (contact surfaces) are inside or the inner side. The surfaces lying opposite the inner sides are outside or the outer side.
The characteristic substrate features can be located on the same substrate surface as the alignment marks or (preferably) on the substrate surface lying opposite the alignment marks or (still more preferably) at the side edge. If the characteristic substrate features are to be located on the same substrate surface as the alignment marks and if the alignment marks are to be located on the inner side, therefore on the surfaces that are bonded according to the invention, the characteristic features are preferably disposed, as far as possible, at the periphery of the substrates, in order that optical devices can detect them in the bonding chamber, preferably during the entire approach procedure.
The characteristic substrate features are preferably parts of the substrate and have not been introduced into the substrate as such before the process according to the invention. It would however also be conceivable to produce characteristic substrate features, in particular by producing patterns on the outer surface of the substrates, on the substrate outer contour or on the side edge, in particular by means of a laser, an etching process or a lithographic production process. The alignment thus becomes independent of alignment marks that are specified in particular by third parties. It is also conceivable to produce very fine etching pits at the outer periphery of the substrate.
The System
In a first embodiment according to the invention, the system comprises a bonding chamber and at least one assignment module, in particular a lock, preferably two locks, in particular connected in parallel and/or disposed beside one another. In special embodiments, more than two locks can be present in order to increase the throughput further. The number of locks is in particular greater than 2, preferably greater than 3, still more preferably greater than 5. A system with precisely two locks (preferred embodiment) will be described below by way of example.
The locks comprise first lock gates, which separate the locks from the surroundings, and second lock gates, which separate the locks from the bonding chamber. The lock gates can be controlled in particular manually, semi-automatically or fully automatically. The first and second lock gates can in particular be controlled independently of one another.
The bonding chamber and/or the assignment module/assignment modules can be evacuated individually. The bonding chamber and/or the assignment modules can be evacuated in particular to a pressure of less than 1 bar, preferably less than 10−3 mbar, more preferably less than 10−5 mbar, most preferably less than 10 mbar. It is also conceivable to apply an excess pressure, in particular by pumping in and/or admitting an inert gas. The bonding chamber and/or the assignment modules can then be flooded, preferably flushed, with gases or gas mixtures with a pressure greater than 1 bar, preferably greater than 2 bar, still more preferably greater than 3 bar. An, in particular exclusive, use of the bonding chamber and/or the assignment modules at ambient pressure of 1 bar is also conceivable.
The bonding chamber is flushed, especially when use is made of a thermocompression bonder, with inert gases or gases which prevent, at least delay or preferably even reverse renewed oxide formation. The use of any gas mixtures is also conceivable. The following gases or gas mixtures comprising the stated gases are preferably used:                argon and/or        helium and/or        hydrogen and/or        carbon dioxide and/or        forming gas and/or        formic acid and/or        SF6.
Each of the assignment modules comprises in particular at least one, preferably two, still more preferably three, most preferably more than three measuring devices, with the aid of which alignment marks and/or characteristic substrate features can be measured. The measuring devices are preferably optical measuring devices, still more preferably microscopes.
In a special embodiment according to the invention, it concerns measuring devices for the edge measurement. Such a device for the edge measurement is mentioned for example in publication WO2013185803A1. The measuring devices are capable of producing an edge profile, in particular one around the entire periphery (related to the lateral boundary of the substrate). This edge profile has in particular a resolution at least in the micron range, preferably at least in the nanometer range. The edge of each substrate is unique, in particular on account of a preferred processing of the substrate and/or the production of the substrate from an ingot. As a result of this uniqueness, an in particular circular profile of the substrate edge around the entire periphery is obtained. This profile could also be defined by the fact that the diameter of the substrate differs as a function of an angle of rotation.
The resolution of the measuring devices is in particular greater than 1 mm, preferably greater than 100 μm, still more preferably greater than 1 μm, most preferably greater than 100 nm, most preferably of all greater than 10 nm.
A magnification of the measuring devices, in particular of the microscopes, is in particular better than the factor 1, preferably better than the factor 10, still more preferably better than the factor 1000, most preferably better than the factor 105, most preferably of all better than the factor 107.
The measuring devices are adjustable, in particular in translation and/or rotation, so that they can be freely displaced and/or rotated inside the assignment modules. An adaptation of the measuring devices to the size of the substrates and/or the pre-positioning in relation to the alignment marks and/or characteristic substrate features is thus possible.
In particular, such a pre-positioning of the measuring devices is carried out only once in the case of one type of substrate and/or an identical process, so that the parts of the substrate to be measured after the loading of the substrate into the lock are already disposed in the field-of-view (FOV). In addition, the alignment marks and/or characteristic substrate features to be measured are brought into t depth range (depth-of-focus, DOF), in order to obtain a sharp image with the greatest possible resolution.
The transport of the substrates out of the assignment modules into the bonding chamber and back is preferably carried out by means of a robot. The robot can be located either in a lock or in the bonding chamber. It is also conceivable for an interposed robot module to be located between the lock and the bonding chamber. If a plurality of locks are present, it is conceivable to position a robot in each lock. The positioning of the robot, however, is particularly preferably in the bonding chamber, so that access to each individual lock by a single robot can take place. The robot is preferably also able to reach ends of the assignment modules lying opposite the bonding chamber, so that the substrates can preferably be loaded not only from the assignment modules into the bonding chamber, but also from a given wafer box, in particular a FOUP, located upstream of the assignment modules, into the assignment modules.
In particular embodiments, however, the robot loads the substrates only from the locks into the bonding chamber, whilst the loading of the locks takes place from the exterior, in particular by means of a further, in particular external, robot.
A robot is understood to mean any kind of machine that is able to take up the substrates, transport them over a certain distance and set them down again.
Located in the bonding chamber is a bonding device, in particular a fusion bonder, more preferably a thermocompression bonder. The bonding device comprises a lower first sample holder and an upper second sample holder. The bonding chamber also comprises a plurality of measuring devices, in particular microscopes. The measuring devices of the bonding chamber are installed in particular on the periphery or the peripheral regions (lateral boundary) of the loaded substrates, so that a measurement of the characteristic substrate features can take place. By restricting the measurement to the characteristic substrate features, the measurement of the alignment marks in the bonding device can be dispensed with. A number of advantages result from this:                a) The measurement can also take place during the approach of the substrates and up to making contact,        b) The bonding device can be designed smaller, so that less volume has to be subjected to an atmosphere defined for the bonding or a defined gas pressure,        c) The bonding is accelerated.
As a result of the inventive measurement of the alignment marks in relation to the characteristic substrate features taking place in the assignment module(s), an approach (Z-direction) and bonding of the substrates with simultaneous measurement and in-situ monitoring is enabled on the basis of the characteristic substrate features, wherein the alignment marks are aligned (indirectly measured). The position of the alignment marks in the X-Y plane is thus calculated on the basis of the X-Y positions of the characteristic substrate features.
The Process
All the substrates can undergo a preliminary treatment before being loaded into the locks. The preliminary treatments can in particular be                cleaning processes, in particular the removal of oxides, and/or        amorphisation of the surface and/or        etching processes and/or        lithographic processes, in particular                    photolithographic processes            imprint lithographic processes.
Oxide removal and/or amorphisation preferably takes place by means of a unit such as is mentioned in publication PCT/EP2014/063303.
In a first step according to the invention, loading of a first lock (more generally: assignment module) takes place. The second lock gate, which connects the lock to the bonding chamber, is next closed. The first lock gate, which connects the surroundings to the lock, is then opened. Loading of the first lock with a first substrate then follows. After the loading of a first substrate into the first lock, the first lock gate is closed again.
After the closing of an evacuation process begins. The evacuation is thus limited in particular to the relatively small lock designed as compact as possible. According to the invention and therefore preferably, a measurement of the substrate surface of the loaded substrate is carried out during the evacuation.
A plurality of measuring devices measure the X-positions and Y-positions of first and second (and if need be further) alignment marks on the substrate surface as well as at least one, preferably at least two, most preferably at least three characteristic substrate features. The measuring devices are calibrated with one another in such a way that they can ascertain the exact position and/or the orientation of the alignment marks in relation to the characteristic substrate features. The positions and, as the case may be, the orientations of the alignment marks in relation to the characteristic substrate features are thus determined unequivocally (assignment).
These data/this information are/is stored in respect of the given substrate using firm- and/or hard- and/or software.
According to the invention, the measurement should not take longer than the evacuation of the lock, so that the process can be carried out in the optimum manner with regard to the throughput. In particular, no additional process time is required for the measurement.
During the first process step according to the invention, a further, in particular second substrate can be loaded, in particular simultaneously, into a further, in particular second lock (more generally: assignment module), and thus be processed in the same way as in the first lock.
Inasmuch as a single robot is used for the transport of the substrates, the transport of the substrates cannot take place simultaneously. According to the invention, it is preferable that at all times only one robot has access to the bonding system, in particular to the sample holders for receiving the substrates. A process-related delay thus arises between the first and the second substrate. The loading of a substrate, the evacuation of a lock, and the unloading of the substrate into the bonding chamber will not therefore proceed in a wholly synchronous manner, but preferably predominantly so. The unloading of the second substrate can thus be referred to as a third process step.
In a second process step according to the invention, the second lock gate of the first lock is opened to the bonding chamber. At this time, the bonding chamber has in particular the pressure of less than 1 bar, preferably less than 10−3 mbar, still more preferably less than 10−5 mbar, most preferably less than 10−8 mbar. After a single evacuation, the bonding chamber is preferably no longer flooded during a large number of bonding processes. This is only necessary again in the case of an interruption in the bonding, in particular for maintenance and/or repair work.
A robot takes up the already measured and assigned first substrate out of the first lock and positions it on one of the two sample holders in the bonding chamber of the bonding system. The robot preferably performs a pre-positioning (pre-alignment). Once the substrate has been removed from the lock, the second lock gate can be closed again and locked and the first lock gate can be opened in order to load a new substrate into the first lock. A new process can thus already start when the old one has still not been completed.
In a third process step according to the invention, the second substrate is loaded into a second lock. The second lock can be designed identical to the first lock. In particular, it is conceivable that the second measuring devices have a second measuring direction opposite to a first measuring direction of the measuring devices of the first lock. In relation to the first substrate, the opposite side, preferably the underside, of the second substrate can thus be measured. The robot then finds the second substrate already in the correct orientation for the bonding with the first substrate. A substrate can in particular be rotated in a so-called flip module before it is loaded into the lock. This is a module which is able to rotate a substrate, in particular large substrates, through 180°. The rotation takes place about an axis which lies inside the plane of the substrate. An additional rotation about an axis lying normal to the substrate surface is also conceivable so as to perform a pre-alignment process. This pre-alignment process takes place either in the flip module or is carried out in a separate pre-aligner. The use of a robot which can rotate a fixed substrate through 180° is however also conceivable. The loading, measurement and unloading of the second substrate takes place simultaneously or with a time lag in respect of the second process step.
According to the invention, it is conceivable that further substrates in further locks are fed to the bonding chamber, either to bond more than two substrates or to prepare further substrates for the next bonding process and thus to increase the throughput.
In a fourth process step according to the invention, a measurement of the characteristic substrate features of the substrates by the measuring devices takes place in the bonding chamber. An essential advantage according to the invention, especially with regard to aligners such as mentioned in publications PCT/EP2013/075831, WO201402106A1 or U.S. Pat. No. 6,214,692B1, is that the alignment of the substrates now takes place exclusively on the basis of the characteristic substrate features and extremely short travel paths are required for this. However, the alignment marks of the substrates are brought indirectly into congruence by the alignment process, since the relationship between the alignment marks and the characteristic substrate features is known as a result of the inventive measurement in the assignment modules, in particular locks. The two substrates to be bonded are preferably already pre-positioned by the robot, in order that the characteristic substrate features can more easily be detected by the measuring devices for the precise alignment of the substrates. With its technically specified precision, the robot endeavours to achieve an approach of the characteristic substrate features of the substrates towards one another that is as good as possible. Data from the measurement of the substrates in the lock can also be used for this purpose.
The fine adjustment (precise alignment) of the characteristic substrate features in relation to one another then takes place by means of the sample holders, which can be moved, in particular displaced and rotated, in the X-direction and Y-direction. The position and/or the orientation of the characteristic substrate features are continuously measured during the displacement of the substrates in relation to one another and relayed to firm- and/or hard- and/or software, which calculates the new position of the sample holders and therefore of the substrates from the transmitted data.
An aspect according to the invention lies in particular in the fact that the (in particular all the) characteristic substrate features are located at the periphery, in particular at the outer edge (lateral boundary edge or outer contour in the X-Y plane) of the substrates, still more preferably on their outer surfaces, and are therefore easily accessible. Whilst it is true that, according to the invention, the characteristic substrate features in particular are detected, referenceable alignment marks are aligned in relation to one another by the assignment that has taken place in the assignment modules.
The assignment and calculation of the positioning can take place in particular by vector calculation in a central control system.
Inasmuch as process features are disclosed, the latter are also deemed to be disclosed according to the device and vice versa.
Further advantages, features and details of the invention will emerge from the following description of preferred examples of embodiment and with the aid of the drawings.
In the figures, identical or identically acting parts are marked with uniform reference numbers, wherein the size ratios serve the purpose of illustration and are not therefore true to scale.

Method for aligning substrates before bonding


An assembly for movably supporting a wheel on a frame of a house trailer has a torsion bar extending horizontally perpendicular to the normal horizontal transport direction of the trailer, with the inner bar end being anchored to the trailer frame and the outer bar end being limitedly elastically pivotal about the bar axis relative to the inner bar end. An arm extends generally perpendicular to the bar axis and generally in the transport direction, and has an inner arm end fixed to the outer bar end and an outer arm end. This arm is formed of a piece of flexible steel plate lying in a vertical plane parallel to the normal transport direction so as to be substantially inflexible angularly of the bar axis between the arm ends and relatively flexible parallel to the bar axis between the arm ends. A substantially rigid and inflexible wheel-support strut has an outer strut end connected to the outer arm end and an inner strut end mounted by means of a bearing on the frame for pivoting of the strut about a strut axis skew to the bar axis and passing through the inner strut end. The outer strut and outer arm ends carry a wheel that is rotatable about a wheel axis substantially parallel to the bar axis. As the strut pivots about the strut axis the bar will twist about the bar axis and the arm will deform parallel to the bar and wheel axes between the outer strut and bar ends.

The wheels of a house trailer rotate about wheel axes perpendicular to the normal direction of travel of the trailer. These wheels are normally mounted on struts themselves pivotal about axes that are skew, that is neither intersecting nor parallel, with reference to the wheel axes. Typically each strut pivot axis is inclined inwardly upwardly and outwardly backwardly relative to the motor vehicle and its normal horizontal forward direction of travel. Such pivoting about these skew axes gives excellent road-handling capabilities, providing the right camber and caster for best roadability, with best transmission force from the center of the load to the wheels.
German Utility Model No. 7 319 964 discloses such a system with a so-called elastomeric spring axle. This is formed of a prismatic-section support tube fixed in the frame of the vehicle and provided internally with a torsion bar coupled with a wheel-support arm. The torsion bar engages the support tube by means of elastomeric webs. In order to obtain the desired pivoting about a skew axis the support tube is bent and in each bent part has a respective torsion bar and is elastomerically supported.
Such an arrangement is relatively complex and expensive to make. It is relatively difficult to service in the event that any of its parts fail. Finally the elastomeric mounting is extremely disadvantageous in that in extremely cold climates the spring characteristics for the bodies responsible for the cushion mounting change. In fact the elastic limit of such bodies decreases greatly with decreasing temperature, so that when used under very cold conditions failure is a common problem.


A carousel for processing containers includes a base structure that can rotate about the rotation axis of the carousel and supports a plurality of supporting elements. A detection device is provided having at least one sensor that can move about the rotation axis of the carousel. The carousel further includes a plurality of kinematic connection elements arranged between the base structure and the sensor or sensors, which are adapted to couple integrally in rotation the sensor or sensors and the base structure during the movement of the sensor or sensors. The kinematic connection elements are associated with motor elements adapted to return on command the sensor or sensors from a final angular position to the initial angular position by way of an angular movement of the sensor or sensors in the opposite direction with respect to the rotation of the base structure.

Carousels for processing containers are known and are widely used which comprise a plurality of pans for supporting respective containers to be processed, which are positioned at the peripheral region of the carousel and to which the containers are supplied.
The carousel can be associated with various different types of stations for processing the containers in order to carry out, for example, the filling of the containers, the stoppering or the labeling.
In some applications it is necessary to detect the orientation of the container arranged on the pan in order to be able to carry out the operations required at a preset angular portion of the container.
In the majority of cases, the carousels are provided with devices for the detection of the orientation of the containers which comprise, for each pan, a respective sensor designed to detect, during the rotation of the container on the respective pan, a distinctive indicator constituted for example by a ridge, a notch, a so-called "spot", etc.
Once the sensor has detected the distinctive indicator, a data processing device connected therewith acquires the signal and associates it with the angular position of the pan at that moment.
Typically each sensor is connected to the carousel by way of a supporting bracket so as to follow the respective container during the rotation of the carousel.
Such solution, although widely used, suffers a number of drawbacks, which in particular are determined by the need to use an extremely high number of sensors and supporting brackets.
This results in the need, in the event of a change of format, to carry out an extremely high number of adjustments on the sensors.
Furthermore, the sensors must often be mobile with respect to the container in order to not impede the processing operations (such as for example the labeling).
Likewise, solutions are known in which the carousel is associated with one or more sensors which are designed to follow, for a certain angular portion, a respective container in order to detect its orientation in order to then bring it into the initial position so as to be able to detect the orientation of a further container arranged upstream in the direction of advancement of the carousel.
A solution of this type is described and illustrated in French patent application no. 2012430 in the name of Firma Otto Sick Metallwarenfabrik.
In such solution the carousel supports rotatably, about its own main rotation axis, a bracket for supporting a sensor, which extends externally to the carousel.
Along the peripheral region of the carousel are advancement elements designed to entrain the bracket in rotation from an initial position for a preset angular portion that is adapted to allow the detection of the orientation of the container.
At the end of the angular portion, the bracket "disengages" from the advancement element and, thanks to the action of a return spring and a stroke limit, it is brought back to the initial position at which it "engages" another advancement element.
Such solution, while conceptually valid, suffers considerable drawbacks in technical and implementation terms.
In fact, as the rotation speed increases, it is extremely problematic to ensure the precision and reliability of the step of engaging the bracket with the advancement elements.
Furthermore, repositioning the bracket by way of the return spring and the mechanical holdback is also problematic from the point of view of precision.
EP 0635452 discloses a carousel provided with an apparatus for the application of sealing capsules on wine bottles, such carousel being provided with optical readers for detecting the orientation of the capsules.
In this case the optical readers are entrained, thanks to the action of a motor with a shaft arranged coaxially to the axis of the carousel, in an alternating back-and-forth motion along a preset angular portion so that, in the outward portion, the angular speed of the optical readers corresponds to that of the container to be monitored.
Lastly, a solution has recently been proposed, disclosed in WO2012/090093, relating to a detection device for containers in motion on a carousel conveyor, which comprises a supporting structure and at least one detection sensor which is connected to the supporting structure and can move with respect thereto.
Such detection device further comprises means of synchronization of the sensor with respect to the container, in order to move it so that the sensor follows the container along at least a part of the advancement path from an initial angular position to a final angular position.
Specifically, the synchronization means comprise a guide, fixed to the supporting structure, and a movable structure mounted slideably on the guide and comprising a closed annular transmission element on which at least one sensor is connected.
In particular, the sensor is fixed to the movable structure in order to move at least from the initial position to the final position.
Such solution suffers the drawback of needing specific means for synchronizing the movement of the sensors with that of the container during the movement of the supporting bracket along the advancement path from the initial angular position to the final angular position.


The invention relates to an apparatus for sterilizing liquids by means of ultraviolet rays, using as the radiation source a low pressure, high current, mercury vapor lamp (UV lamp) which is provided with an appendix-shaped piece of tube (appendix) located on the discharge tube. In order to be able to regulate the temperature of the appendix in a defined manner even while the lamp is in operation and in order to achieve longer life of the UV lamp, an airstream circulating through the apparatus is used to cool the UV lamp. This airstream follows a path such that the air warmed on the discharge tube travels past the electrode bulbs of the UV lamp to the outer wall of the pipeline, through which pipeline the liquid to be sterilized flows. The air which has cooled on the outer wall of the pipeline is then returned to the UV lamp and must be at a temperature which is lower than the operating temperature of the appendix, so that the temperature of the latter can be regulated in a defined manner by means of a heater.

1. Field of the Invention
The invention relates to an apparatus for sterilizing liquids by means of ultraviolet rays, wherein the radiation source used is a low pressure, high current, mercury vapour lamp (UV lamp) which is provided with an appendix-shaped piece of tube (appendix) located on the discharge tube.
2. Description of the Prior Art
Apparatus for sterilizing liquids, which utilize ultraviolet radiation sources, are disclosed, for example, in German Offenlengungsschrift No. 2,630,496 and U.S. Pat. No. 3,637,342. In cases where the discharge tube of the UV lamp possessed an appendix for creating the mercury vapour pressure, the space in which the UV lamp was fixed was, in the previously used apparatus, divided essentially into three thermally mutually separate chambers, namely a bottom chamber, in which was located the "appendix" of the UV lamp, a middle chamber, in which was located the discharge space of the lamp, and a round chamber in which the liquid to be sterilized flowed, and an upper part which accommodated the electrode bulbs and which was cooled by cooling fins. The three-chamber division appeared necessary so that on the one hand the operating temperature of the discharge zone (as a rule .gtoreq.300.degree. C.) did not excessively heat the appendix which, being the coldest point (as a rule .ltoreq.65.degree. C.) of the system, is responsible for the mercury vapour pressure and hence also for the radiation intensity, while on the other hand the upper space was also not excessively heated by the discharge zone, since this space, which is accessible from the exterior, was, for safety reasons, not allowed to become excessively hot.
In order that the UV lamp should be able to "strike" at all, the entire appendix section had to be preheated by means of a resistance heater before striking the lamp. On switching on the anode current, this heating was again switched off. In operation, the temperature of the appendix was determined by the heat fed back from the discharge zone, and by the temperature of the surrounding air. This in turn varied with the water temperature. The temperature of the appendix therefore had to be corrected, depending on the time of year, by using suitable spacers by means of which the appendix was lowered to a greater or lesser degree into the bottom chamber.
The previous apparatus suffered from the disadvantage that on heating the appendix in order to strike the lamp, the middle part, and hence the discharge zone, remained cold. Hence, the mercury was able to recondense there, which made it more difficult for the lamp to strike. On the other hand, the high temperature of the discharge zone in the middle chamber during operation was extremely detrimental to the life of the UV lamp.


Magnetic confinement of electrons in a plasma reactor is effected using electro-magnetic coils and other magnets which generate respective magnetic fields which are mutually opposed and substantially orthogonal on their common axis to the major plane of a wafer being processed, instead of being aligned and parallel to the major plane as in prior magnetically enhanced plasma reactors. The respective magnetic fields combine to yield a net magnetic field which is nearly parallel to the wafer away from the magnetic axis so that electrons are confined in the usual manner. In addition, a magnetic mirror provides confinement near the magnetic axis. The E.times.B cross product defines a circumferential drift velocity urging electrons about a closed path about the magnetic axis. The magnetic and cross-product forces on plasma electrons have a rotational symmetry which enhances reaction uniformity across the wafer; this contrasts with the prior art in which lateral drift velocity disturbs plasma symmetry and thus reaction uniformity. Furthermore, the disclosed field geometry permits stronger electron confinement which enhances plasma reaction rates.

The present invention relates to semiconductor processing and, more particularly, to a system and method which provide for efficient plasma production in a region directly above a semiconductor wafer. A major objective of the present invention is to provide for confinement of energetic electrons near the wafer with increased symmetry to enhance plasma and reactive natural species production and, thereby, enhance uniformity and rate of etching and deposition across a wafer.
Much of recent technological progress is identified with increasingly miniature integrated circuits which have been providing greater functional density at lower costs. Semiconductor processing technology has provided for increased functionality, in part, by permitting smaller features to be patterned onto a semiconductor wafer, and has provided for lower costs, in part, by developing equipment which can handle larger wafers, thereby increasing the number of circuits that can be made together. The 1980s have witnessed a rapid progression from 3-inch wafers with 3-micron features to 8-inch wafers with half micron features, and from 16-kilobit memories to one- and four-megabit memories, with 16- and 64-megabit memories in development.
Semiconductor processing typically involves a series of photolithographic procedures in which: 1) a layer of material is deposited or grown on a wafer, 2) a layer of photoresist is deposited over the material; 3) the photoresist is exposed to radiation according to a predetermined pattern defined by a mask or stepper program; 4) developer is used to remove resist, with either the exposed or unexposed resist being left in place; 5) the wafer is etched so that exposed material is removed, while material beneath the resist is retained; and 6) the remaining resist is removed to expose the patterned layer of material.
The trends of smaller features and larger wafers combine to make deposition and etch uniformity both more important and more difficult to achieve. Attainment of small features requires that photolithographic procedures be applied to very thin layers. This means that depositions and etches must be precisely controlled. Some approaches which were effective with larger feature sizes are becoming less applicable for submicron feature sizes. For example, wet chemical etches tend to be isotropic so that they etch laterally into material which is supposed to be protected by photoresist, requiring feature tolerances to be imposed. Furthermore, the surface tension associated with wet chemical etches impairs their conformance to small openings needed to define small features at the wafer surfaces exposed below the photoresist.
Plasma-based reactions have become increasingly important, providing for precisely controlled thin-film depositions and etches. A plasma is a mixture of positive and negative ions and electrons which is typically characterized by a visible glow. A plasma can be formed by capacitively coupling electric energy at radio frequencies, via a metal cathode, into electrons which can then impact gas molecules, creating more ions and free electrons. The positive ions are pushed outward by mutual repulsion toward surfaces including the cathode used in generating the electric field. Thus, a wafer supported over the cathode will be bombarded by positive ions which can form a deposited layer or cause a material to be etched, depending on the composition of the plasma.
Since the cathode has a large negative potential in a thin sheath region above and adjacent to the wafer surface, ions are accelerated so that they impact the wafer with large velocity components perpendicular to the plane of the wafer. These ions then bombard areas of material exposed due to the absence of photoresist and provide a high reaction rate on horizontal wafer surfaces with minimal effect on vertical sidewall features. Thus, plasma reactions are particularly well suited for precise pattern definition of small features.
Electrons have a charge equal in magnitude to that of the positive ions while being thousands of times lighter. Without some form of confinement, the more energetic electrons would diffuse away from the wafer, depleting the plasma of electrons capable of sustaining it and, thus, rendering it less dense immediately above the wafer. This diminished density results in a slower etch or deposition. The effect of electron depletion is apparent in the sheath over the wafer surface from which electrons are repelled. This sheath lacks the glow of the nearby plasma and is commonly referred to as a "dark space".
Energetic electrons can be confined to the plasma using a magnetic field which is parallel to the wafer surface. Electrons can be considered as being pulled into orbit about magnetic field lines so as to prevent their escape in a direction perpendicular to the magnetic field. A magnetic field along a wafer surface can be established using a pair of electro-magnets disposed on opposite sides of the wafer and arranged coaxially and parallel to each other so that their mutual axis extends parallel to the wafer surface. The magnetic fields generated by the coils are aligned so that they add to produce a field which is generally parallel to the wafer surface and uniform along the mutual axis.
The magnetic field B confines energetic electrons by forcing them into helical orbits about magnetic field lines. An electron in orbit about a magnet field parallel to and above a wafer progresses along a spiral from West to up to East to down. An electric field accelerates electrons in a direction opposed to the electric field, so that the downward electric field above a wafer in a conventional reactor system accelerates electrons in an upward direction.
An electron at the Western extreme of its orbit is traveling upward so that its speed is increased by the electric field. While at the top extreme of its orbit, the electron has acquired its maximum speed and is traveling in an Eastward direction. While at the Eastern extreme of its orbit, an electron undergoes a decrease in speed since its motion is aligned with the electric field. Minimum speed is reached at the bottom extreme of the orbit when the electron is traveling Westward. Thus, an orbiting electron travels fast Eastwardly and slow Westwardly.
The net effect is an Eastward E.times.B drift of the electron. Cumulatively, the energetic electrons, and thus the plasma they sustain, are subject to this Eastwind drift. This drift results in a plasma which is shifted Eastward relative to the wafer rather than being centered over it. This shift is a potential source of non-uniform depositions and etches.
There are various ways of dealing with this plasma shift. Electrons can be allowed to drift around an electrode to form a closed loop which goes under the wafer and then returns to the plasma region over the wafer. This requires a reaction vessel design in which the electric and magnetic fields all around the wafer support permit the required closed loop motion.
A time-averaged cylindrical symmetry can be achieved by rotating the wafer within the fields. However, rotating the wafer induces undesirable mechanical motion in the plasma, which can increase contamination. This mechanical motion can be avoided by rotating the magnetic field rather than the wafer, which can be done using two pairs of coils and phasing the currents though the coils so that the vector sum of the magnetic fields rotates in the plane parallel to the wafer surface. While excellent results have been achieved in such a system, the costs involved with the additional coils and current modulations make it less desirable. In addition, optimal uniformity on the largest wafers is more difficult to attain with coils of finite size in this configuration.
What is needed is a system and method for confining electrons to the desired region which avoids the problems associated with plasma shift. Preferably, plasma shift should be avoided even on an instantaneous basis so that time-averaging need not be relied on.

Magnetically enhanced plasma reactor system for semiconductor processing


A heat dissipator for an electric motor includes an impeller having an internal heat transfer mechanism. The heat transfer mechanism provides efficient heat transfer from the motor armature to the surrounding environment without forcing cooling fluids into the motor and without transferring heat through the motor housing. The motor can therefore be encased in sealed, light-weight plastic motor housing having relatively poor heat transfer characteristics without danger of overheating. The impeller is preferably designed to displace fluids without turbulence, thereby reducing noise and increasing efficiency. To this end, the impeller employs annular disks stacked on a shaft which may be rotatably mounted in a specially shaped housing and which preferably is formed from an extension of the motor drive shaft. The disks and a complementary surface cooperate so as to use a combination of surface friction, centrifugal forces, and a venturi effect to propel fluids without turbulence. This type of impeller is also preferred because it is sufficiently compact to be attachable to a conventional motor without prohibitively increasing the size of the overall system.

1. Field of the Invention
The invention relates to electric motors and, more particularly, relates to electric motors having internal heat transfer mechanisms.
2. Discussion of the Related Art
Electric motors are well known for providing a central rotating shaft which can supply a rotational force to a system. Such motors generate substantial heat which must be dissipated to prevent the motors from overheating.
Two heat dissipation techniques are commonly employed, each of which exhibits several drawbacks and disadvantages. The first technique utilizes an internal fan to draw cooling air through the motor armature. This technique, while providing adequate cooling, suffers the disadvantage of drawing dust and other particulates into the motor which may harm the motor. The second technique employs an external fan to draw cooling air past the exterior of a sealed motor housing, thus providing indirect cooling. This technique is relatively inefficient because the point of heat transfer is remote from the point at which heat is generated. To compensate for this inefficiency, relatively large fans must be employed along with metal housings promoting heat transfer, thus increasing the weight and complexity of the motor.
Moreover, both of these methods suffer the disadvantage of requiring blades which are inherently noisy and inefficient. Fan blades operate by colliding with the fluid being displaced and by pushing the fluid to displace it. This type of operation creates turbulence within the fan or blower which not only creates unpleasant noise, but which also impedes the movement of the fluid through the device and reduces the overall efficiency of the device.

Electric motor having internal heat dissipator