A method for bonding leads of a film carrier to electrodes of electronic devices includes a step for positioning the leads and the electrodes with a predetermined clearance aligned to define corresponding pairs of the leads and electrodes, and a step for placing a bonding tool having a conductive bonding material served such that the conductive bonding material is located between the lead and electrode of one of the corresponding pairs. The method further includes a step for pressing the lead of one corresponding pair such that the conductive bonding material is pressed between the lead and the electrode, thereby bonding the lead and electrode. After bonding, the conductive bonding material is pulled to cut and leave the bonded conductive bonding material. Then, while the bonding tool is released from the bonded pair, the conductive bonding material is served to the bonding tool for the next bonding operation.

1. Field of the Invention
The present invention relates to a method for bonding a lead to an electronic device, more particularly, to a method for bonding a terminal lead provided on a film carrier with electrodes of a large scale integrated circuit (LSI) chip for packing in a tape automated bonding (TAB) package.
2. Description of the Prior Art
With recent advances in the high integration methods to mount a plurality of electric/electronic components on a single semiconductor chip such as a LSI and a very large scale integrated circuit (VLSI), the cost reduction of, the high performance of, and downsizing of the electronic devices are achieved. Among such high integration methods, a bump bonding method in which an electrode of a semiconductor chip is bonded with a lead of the film carrier via a bump formed on the electrode is widely used. The film carrier is made of an elastic material such as a polyamide and is provided with a wiring pattern formed thereon. From the wiring pattern, the leads are extended for bonding with the electrodes formed on the surface of semiconductor chip. In this method, the bumps made of conductive materials such as gold and solders should be formed on electrodes before and independently from the bonding operation.
In FIGS. 11A to 11E, the steps for forming the bumps on the semiconductor wafer according to a bump-on-wafer technology, for an example of such bump bonding methods, are shown.
As shown in FIG. 11A, at the first step, a plurality of electrode elements 60 are formed on a surface of a semiconductor wafer 30 by using an electroplating technology. A conductive layer 31, so called "a barrier metal", is vapor deposited on the surface of semiconductor wafer 30 over the electrode elements 60 to cover it entirely. The conductive layer 31 is made of conductive metals such as titanium and palladium.
As shown in FIG. 11B, at the second step, an insulation layer 33 is further formed over the conductive layer 31. The insulation layer 33 is made of a photo sensitive insulation material such as a photo resist.
As shown in FIG. 11C, at the third step, a number of openings 34 are formed in the insulation layer 33 to expose the conductive layer 31 covering the electrode elements 60 by using a photo mask (not shown) having a pattern corresponding to those of the electrode elements 60.
As shown in FIG. 11D, at the fourth step, the semiconductor wafer 30, thus prepared to have openings 34, is immersed in an electrolytic solution and then the conductive layer 31 is connected to an electric source. The conductive layer 31 in the openings 34, exposed to the electrolytic solution, serves as an electrode. Thus, gold included in the electrolytic solution is deposited on the conductive layer 31 in the openings 34. Then, this deposition grows up to form a bump 54 in each opening 34.
As shown in FIG. 11E, at the fifth step, the semiconductor wafer 30 is etched to remove insulation layer 33 and the conductive layer 31 on the portions excluding the bumps 54 from the semiconductor wafer 30. Thus, the bumps 54 are completely formed on each electrode element 60, independent of each other.
In FIGS. 12A to 12C, the steps for bonding bumps 54 of a semiconductor chip 59 with leads 55 of a film carrier 56 are shown.
As shown in FIG. 12A, at the first step, the semiconductor chip 59, cut from the semiconductor wafer 30 with bumps 54, is placed on a heating stage 67. The film carrier 56 is located above the semiconductor chip 59 and is positioned such that leads 55 are located over corresponding bumps 54 (electrode elements 60).
As shown in FIG. 12B, at the second step, the leads 55 are pressed against the bumps 54 by a hot pressure tool 61 so that the leads 55 are bonded to the bumps 54, resulting in an electrical connection between leads 55 and electrode element 60 via bumps 54.
As shown in FIG. 12C, at the third step, the hot pressure tool 60 is removed from the leads 55 bonded to the bumps 54. Thus, a number pair of leads 55 and bumps 54 are bonded at one time in a manner of so called "gang bonding".
In FIGS. 13A and 13B, another method for forming bumps, according to the conventional ball-bonding technology, is shown. First, a golden ball 71 is formed by applying an electric spark to the end of golden wire 70 fed by a capillary tool 72. Second, the thus formed golden ball 71 is pressure bonded to he electrode element 60. Then, the golden wire 70 is cut to leave the golden ball 71 as bump 73 bonded to the electrode element 60, as shown in FIG. 13A. By repeating the above described operations, bumps 60 made by golden ball 73 are formed on every electrode element 73, as shown in FIG. 13B.
In FIGS. 14A and 14B, still another method for forming bumps is shown. In this method, the end portion of a lead 55 is etched to have an end projection 75 formed in a mesa-like shape. This end projection 75 serves as a bump for connection between the lead 55 and the electrode element 60 (not shown) of the semiconductor chip 59 (not shown). However, the end projection 75 made of copper has a hardness greater than the usual bumps made of gold. Therefore, the end projection 75 could damage the oxide layer, under the electrode element 60, of the semiconductor chip 59 when the end projection 75 (leads 55) is pressed against the electrode element 30, resulting in so much degradation and less reliable quality of the semiconductor chip.
With demands for high performance and multi functions of semiconductor chips, the high integration of a plurality of components mounted on a single chip is promoted, causing the semiconductor chip to have multi-leads. Especially such semiconductor chips as micro processors and gate arrays are usually designed according to special specification to satisfy the user's own requirements and are developed in a short lead time. In FIG. 15, a single-point bonding method is shown, which is employed for TAB packaging of such semiconductor chips. In this single bonding method, a bonding tool 61 having a contacting end whose area is almost the same as the electrode is used to press leads 55 of the film carrier 56 against corresponding bumps 54 for the pressure bonding therebetween.
In FIGS. 16A to 16C, the steps for bonding a lead with an electrode of a semiconductor chip, according to the single point bonding method, are shown.
As shown in FIG. 16A, at the first step, the semiconductor chip 59 and film carrier 56 are placed on the heating stage 67 in a manner similar to those described with reference to FIG. 12A.
As shown in FIG. 16B, at the second step, each of the leads 55 is pressed against the bump 54 by a bonding tool 61. At the same time an ultra sonic is applied to the bump 54 so that the bump 54 deforms and bonds with the lead 55, causing the bump to electrically connect with the lead 55. As shown in FIG. 16C, at the third step, the second step is repeated to each corresponding pair of leads 55 and bumps 54 until all pairs are bonded. The single point bonding method can be used regardless of the type of bumps formed on the semiconductor chip. Thus, the single point bonding method can be applied for both technologies of the bump-on-wafer and ball-bonding.
Other than the bonding methods described above, a wire bonding technology is usually used for packaging the semiconductor chip. In the wire bonding technology, however, the electrode element of semiconductor chip and electrode of the package are bonded by a fine metallic wire extending therebetween. The fine metallic wire is made of conductive metals such as gold, aluminum, and copper and has a diameter on the order of several tens of micrometer. Therefore, the process, material, and facilities used by the wire bonding technology are different form those of the above described methods for bonding a semiconductor chip with the film carrier.
However, the bonding technologies described above have the following problems with respect to the TAB packaging of the semiconductor chip. Both in the bump-on-wafer technology and the transferred bump technology (shown in FIGS. 14A and 14B), bumps should be formed on the electrode elements of the semiconductor chip and on leads of the film carrier, respectively, before bonding, further causing the following difficulties.
In the bump-on-wafer technology, the semiconductor chip should be formed with bumps on the electrode elements thereof by vapor depositing and photolithographing methods before the semiconductor chips are cut from the wafer. To achieve this, a photo mask is used for electroplating process of the bump forming. The photo mask has a mask pattern corresponding to the positions of leads and electrode elements. Therefore, it is necessary to prepare photo masks having different mask patterns according to those of semiconductors, resulting in the increase of bump manufacturing cost and the reduction of manufacturability. Thus, it is very difficult to apply TAB packaging to semiconductor chips which with various kind but in a small production lot. Furthermore, since the bump forming process has too much manufacturing steps and complicated manufacturing steps, expensive facilities are required for performing such steps, causing the bump forming cost to be increased. Additionally, the processes of vapor deposition, photolithograph, and etching used for forming bumps causes the semiconductor chip to degrade, resulting in the reduction of yield.
In the transferred bump transfer technology, bumps on the leads are formed by transferring the bumps from the bump forming matrix, requiring the transferring process and facilities. Since the bump forming matrix has bumps formed therein at positions corresponding to the electrodes of the semiconductor chip, it is necessary to prepare the bump forming matrix according to kinds of semiconductor chips, resulting in the increase of bump forming matrix manufacturing cost and the reduction of manufacturability. Thus, it is very difficult to apply TAB packaging to semiconductor chips which with various kind but in a small production lot.
In the ball bump technology, the electrode elements of the semiconductor chip suffer from such stresses as an impact load and two thermal stresses, when the bump is formed thereon and when the lead is bonded with the bump. Such stresses cause the oxide layer under the electrode element to crack, resulting in the reduction of yield.
In case that the end portion of a lead is etched to have an end projection having a mesa-like shape, it is necessary to prepare the special tool and facilities for etching the lead end, resulting in the increase of cost of the film carrier. Additionally, since the lead is made of such a metal approximately three times as hard as gold, the oxide layer under the electrodes are broken and cracked when the end projection is pressed against the electrode for bonding therewith. The lead is plastically deformed and bonded with the electrode. However, the lead is too hard to deform to bond with the electrode with sufficient bonding force, resulting in the reduction of yield.

Method for bonding lead with electrode of electronic device

Matsushita Electric Industrial Co., Ltd.


Antenna structures are provided which facilitate the simultaneous radiation of multiple antenna beams. The structures include photonic manifolds that define equal-length optical paths and other optical paths whose lengths progressively change by a selected length .DELTA.L. The manifolds conduct signal pairs to radiative modules. Each signal pair includes a frequency-swept scanning signal s.sub.s and a reference signal s.sub.r whose frequency is a selected one of the sum and the difference of the frequencies of the scanning signal s.sub.s and a respective operating signal s.sub.o. Subsequently, the scanning signals are mixed with the reference signals and filtered to recover phase-shifted versions of each respective operating signal s.sub.o. The phase-shifted versions are radiated to form multiple radiated beams wherein each beam is scanned by changing the frequency of its respective scanning signal s.sub.s. The frequency of the scanning signals is selected to avoid generation of spurious radiated signals. This selection includes choosing the scanning signals so that each has a different integer number of 2.pi. phase shifts over the path length .DELTA.L. Methods of the invention permit the use of a common mixer and a common filter at each radiative module for processing all signal pairs.

1. Field of the Invention
The present invention relates generally to antennas and more particularly to phased array antennas.
2. Description of the Related Art
The antenna beam of a phased array antenna points in a direction that is normal to its phase front. In one conventional type of antenna, a plurality of phase shifters are incorporated in the array so that the phase front can be steered as desired. In another conventional type of antenna, beam-steering phase shifts are realized by varying the frequency of signals that are transmitted through time delay elements. This latter process scans the antenna beam but typically has the disadvantage that the frequency of the radiated beam is dependant upon the beam's pointing direction.
In contrast, U.S. Pat. No. 3,090,928 (issued May 21, 1963 in the name of William R. Welty) described the use of two time delay elements (e.g., tapped delay lines) to realize beam steering with a constant radiated frequency. In this patent, a reference signal is sent down one delay line and a tuning signal is sent down the other delay line. Corresponding tap points on the delay lines are coupled to mixers and the mixer outputs are coupled through filters to array radiators. The filters are configured to pass a desired mixing product (e.g., a difference signal) and block the reference and tuning signals.
U.S. patent application Ser. No. 08/711,428 (entitled "Simultaneous Multibeam and Frequency Active Photonic Array Radar Apparatus" and filed Sep. 5, 1996) is directed to active array systems that process multiple beams over a wide frequency range. It replaces conventional electronic radio-frequency (RF) delay lines (e.g., those of U.S. Pat. No. 3,090,928) with fiber optic delay lines. The delay lines provide a wide operating frequency range and the ability to process different RF signals through the use of light signals that have different wavelengths. Accordingly, an RF signal that is modulated on one light carrier does not interact with another RF signal that is modulated on a second light carrier. The RF signals may be placed on and taken out of the fiber delay lines using optical filtering (e.g., wavelength division multiplexing) of different light carriers.
A basic transmit manifold is described which has RF oscillators that generate a tuning frequency and a signal frequency. The transmit manifold also includes a solid state light source and electro-optic modulators that are coupled to an input of an optical manifold which is formed by a plurality of optical fibers. The output of this optical manifold is connected through photodiode detectors to array radiators of which each includes a series combination of a mixer, a filter and an RF amplifier.
A transmit implementation is shown that can provide two transmitted beams. With the exception of the optical manifold, this implementation duplicates all of the above-recited structures. In addition, pairs of wavelength division multiplexing (WDM) devices interface the optical manifold to the other structures. Accordingly, an active array system with multiple radiated beams can be realized but only at the expense of multiple duplications of photonic and electronic modules. It is stated that this duplication minimizes unwanted mixing products. However, this duplication also causes significant increases in size, weight and cost of the active array system.

Multibeam phased array antennas and methods


A trochanteric fracture nail system includes: a trochanteric fracture nail and a lag screw system adapted and configured for fixation medially through the trochanteric fracture nail. The trochanteric fracture nail includes: a substantially cylindrical wall defining a longitudinal bore; at least one lateral bore intersecting the longitudinal bore; and a detent on an inner surface of at least one of the at least one lateral bore. The lag screw system includes a lag screw and an interference member. The lag screw includes: an annular body defining a substantially hollow central bore; and a keel located along the annular body. The keel is adapted and configured to substantially lie within an outer profile of the annular body when in a neutral position. The interference member is adapted and configured to displace the keel radially to resist motion of the annular body by engaging with the detent of the trochanteric fracture nail.

Proximal femoral fractures are serious injuries that often require surgery to repair. While the type of surgery depends on the location and severity of the fracture, the alignment of the broken bones, and the age and underlying health conditions of the patient, internal nails and screws are frequently used at the site of the fracture.

Lag screw systems and nail systems and methods incorporating the same


A communications channel that receives a user data sequence including N symbols and that supports host CRC includes a host bus interface (HBI) that generates cyclic redundancy check (CRCU) bits based on the user data sequence. A data dependent scrambler (DDS) receives the user data sequence and the CRCU bits and generates a scrambling seed. The DDS generates a scrambled user data sequence that is based on the user data sequence and the scrambling seed and generates a difference sequence.

Magnetic storage systems such as disk drives include a magnetic medium or platter with a magnetic coating that is divided into data tracks. The data tracks are divided into data sectors that store fixed-sized data blocks. A read/write head typically includes a write circuit and write element such as an inductor that selectively generates positive and negative magnetic fields that are stored by the magnetic medium. The stored positive and negative fields represent binary ones and zeros. The read/write head includes an element such as a magneto-resistive element that senses the stored magnetic field to read data from the magnetic medium. A spindle motor rotates the platter and an actuator arm positions the read/write head relative to the magnetic medium.
Magnetic storage systems typically code the user data sequence or user data using Run Length Limited (RLL) code. RLL coding eliminates sequences in the user data that may cause problems with timing circuits of the magnetic storage system. For example, a RLL code enforces constraints on the number of consecutive ones and/or zeros that are allowed to occur in the data. The efficiency of the RLL code is typically measured in terms of a code rate. For every m-bits or m-bytes of user data, an n-bit or n-byte encoded word is written to the storage media. RLL codes are used to eliminate unwanted bit patterns in the data and typically do not have error correction capability. RLL coding, however, reduces data storage capacity by increasing channel bit density (CBD), which reduces a signal to noise ratio (SNR) and may lead to lower reliability.
Referring now to FIG. 1, a write-path of a data storage system with RLL coding is shown. A host bus interface (HBI) 14 receives user data from a host computer 16. A buffer manager (BM) 18 initially stores the user data in a buffer 20 and then sends the user data from the buffer 20 to a disk formatter (DF) 22 with proper timing. An ECC/CRC encoder 24 appends CRC bits to the user data. The CRC bits are calculated based on the user data.
ECC bits are computed based on the user data and the CRC bits and appended thereto. A scrambler 26 generates a pseudo-random scrambling sequence that is based on a polynomial and seed. The user data and the scrambling sequence are input to an XOR gate 27, which outputs scrambled user data. A RLL encoder 28 is used to constrain the unwanted bit patterns in the scrambled user data sequence.
To increase SNR and data storage capacity, data storage systems were developed without RLL coding using data-dependent scramblers (DDS). Data is processed by the DDS to eliminate unwanted bit patterns. The DDS is disclosed in "Improved Data Coding For Enforcing Constraints On Ones and Zeros In a Communications Channel", U.S. patent application Ser. No. 10/423,552, filed Apr. 25, 2003, which is commonly assigned and is hereby incorporated by reference in its entirety. The scrambled user data from the DDS is forwarded to an ECC/CRC encoder, which generates and appends CRC and ECC bits to the user data.
Because the CRC and ECC bits may also contain unwanted bit patterns, traditional RLL coding may be used to encode the ECC/CRC portion. The data storage system is still referred to as being without RLL coding because the CRC and/or ECC bits are relatively small in number as compared to the number of bits in the user data. In data storage systems without RLL coding, the CRC bits are generated and appended by the ECC/CRC encoder. Because the ECC/CRC encoder is located downstream from other devices, such as the disk formatter (DF), the buffer manager (BM), the buffer, etc., the CRC bits that are generated do not detect errors that are generated in these devices.
Referring now to FIG. 2, a write-path of a data storage system that includes the DDS is shown. The host computer 16 generates user data that is transferred to the host bus interface (HBI) 14. The buffer manager (BM) 18 receives the user data from the HBI 14 and controls the data flow through the write path. The user data is periodically stored in the buffer 20. The BM 18 passes the user data on based on sequence timing of data flow through the write path. The disk formatter (DF) 22 receives the user data from the BM 18 and formats the user data.
A data dependent scrambler (DDS) 40 receives the user data from the DF 22 and scrambles the user data to eliminate the unwanted bit patterns. An ECC/CRC encoder 42 appends CRC bits that are calculated based on the scrambled user data. ECC bits are also computed based on the scrambled user data and the CRC bits and appended to the scrambled user data.
A host CRC feature is sometimes used to maximize the error detection capability of the data storage system without adding more error detecting code, such as another layer of CRC. In traditional host CRC systems, the CRC is generated in the host bus interface (HBI), which initially receives the user data from the host computer. The CRC is generated on the write path using the same polynomial and seed as those used in the ECC/CRC encoder. Therefore, the ECC/CRC encoder can use the same CRC bits to detect ECC miscorrections without losing format efficiency. Additionally, on the read path, while the user data is transferred from the HBI to the host computer, a CRC check detects any errors that occur.
Although the host CRC feature is supported by a traditional data storage system with RLL coding, it is more difficult to implement the host CRC feature in a data storage system having a DDS. This is due to the fact that the user data at the HBI and the data at the ECC/CRC encoder 42 are different. Therefore, the CRC generated at the HBI cannot be used by the ECC/CRC encoder to detect miscorrection even if the same CRC generator polynomials are used.

Methods of supporting host CRC in data storage systems without RLL coding


The present invention relates to an immersion lithographic system for patterning a work piece arranged at an image plane and covered at least partly with a layer sensitive to electromagnetic radiation. Said system comprising a source emitting electromagnetic radiation onto an object plane, a mask, adapted to receive and modulate said electromagnetic radiation at said object plane and to relay said electromagnetic radiation toward said work piece, and an immersion medium contacting at least a portion of a final lens of said lithographic system and a portion of said work piece, wherein an area of said contacting is restricted by capillary forces. The invention further relates to a method for patterning a workpiece.

When making a pattern on a workpiece, which workpiece could be integrated circuits, masks, reticles, flat panel displays, micro mechanical or micro optical devices and packaging devices, e.g. lead frames and MCM's, a pattern may be exposed in a positive photo resist. In case of producing a mask, the resist in the exposed areas is removed by a develop-and-etch process and, unprotected chromium is then dissolved by a chromium etchant. The result, a glass plate with a pattern in opaque chromium, is used as an optical contact or projection mask for production of a device layer pattern in flat panel displays or integrated circuits.
The pattern generator could be any one of the types of commercially available laser pattern generators using acousto-optical modulators, rotating mirrors and electro-optic shutters, or spatial light modulators for producing said pattern. That is, the light may be scanned or imaged onto the workpiece.
Mask making for the 70 nm semiconductor technology node and below is expected to be accomplished by using either electron beam tools or optical mask makers, which employ light with wavelengths shorter than 248 nm. Optical mask making tools typically use excimer lasers as their light source, and are therefore restricted in the wavelengths they can use. Krypton fluoride excimer lasers produce light at 248 nm, and the next shorter wavelength available is 193 nm, produced by argon fluoride lasers. Adapting optical mask makers to use 193 nm is quite difficult for several reasons: (1) the choice of optical materials is restricted, because most optical material absorb 193 nm light. Only fused silica and calcium fluoride are commonly used. Optical coatings also present challenges. (2) 193 nm light is absorbed by oxygen in the air, with the accompanying production of ozone, so an optical path must be sealed and purged of oxygen. This makes the opto-mechanical design more cumbersome, and makes alignment and measurement quite difficult. (3) 193 nm lasers are not as reliable or stable as 248 nm lasers, and their energy output is not as large as 248 nm lasers, so obtaining and controlling the needed exposure energy becomes problematic. (4) 193 nm photons are very energetic, and tend to cause deterioration of materials they strike.
A suitably designed system using immersion optics operating at 248 nm is almost certainly capable of achieving lithographic specifications suitable for said 70 nm semiconductor technology node, and for the reasons stated above, this may present an easier technological challenge than development of a tool employing shorter wavelengths.

Method and device for immersion lithography


Disclosed is a coherent cache system that operates in conjunction with non-homogeneous processing units. A set of processing units of a first configuration has conventional cache and directly accesses common or shared system physical and virtual address memory through the use of a conventional MMU (Memory Management Unit). Additional processors of a different configuration and/or other devices that need to access system memory are configured to store accessed data in compatible caches. Each of the caches is compatible with a given protocol coherent memory management bus interspersed between the caches and the system memory.

One method of extending or adding to the processing capability of a processing unit is to offload some of the work or functions to one or more coprocessors. Typically one processor is a main or control plane processor which is used to coordinate the work of the remaining data plane processors. Each of these processors will typically have their own cache memory. Data plane processors will also typically have their own Local Memory. As is known, caches are essentially temporary storage memory directly or closely linked to a processor. The amount of time required to retrieve information from a cache is significantly less than the time required to retrieve information from hard disk or even from RAM (Random Access Memory. For this reason, a given processor, in a multiprocessor system, typically, when needing information not in its associated cache, will perform a request for the information from memory. Other processors in the multiprocessor system will first perform a lookup or "snoop" request to ascertain if the information being requested is contained in the cache associated with that "another processor." If so, the information may be directly retrieved from the other cache and each cache in the system is advised if state changes are required in the cache for that memory location, as set forth infra. Thus caches, even of other processors, are used to reduce latency or the time that it takes to retrieve information, especially where that information is likely to be used multiple times by a given processor.
To prevent destruction of data being used or accessed simultaneously by different processors and to further assure that data accessed is the most recently correct value, coherent memory systems have been developed and used to communicate the status of data to all processors using data contained in a given virtual or physical memory location. One example of a coherent memory management system uses a protocol referred to in the industry as a MESI protocol. Each read or write request involves all other caches in the system. After each read or write request relative a given memory location, each cache in the system maintains a record of the cache state with respect to that memory location of Invalid, Shared, Exclusive or Modified in accordance with the MESI protocol. More information on such coherency protocols may be obtained from many sources such as the Internet and so forth. An extended MESI protocol outlined in this invention is set forth in a U.S. Pat. No. 6,334,172 issued Dec. 25, 2001 and assigned to IBM. Known prior coherent memory systems were, however, limited to processors executing the same instruction set, having the same cache hierarchy, and each accessing or addressing memory in the same manner.
A prior art multiprocessing system having heterogeneous processors is shown in an application Ser. No. 09/736,585 filed Dec. 14, 2000, entitled Symmetric Multi-Processing System and assigned to the same assignee as the present invention. This system is also shown in Publication 2002/0078308 published Jun. 20, 2002. In this system, the main processing units (PUs) can access memory at either a physical or a virtual memory location using Load and Store instructions. However, the auxiliary (APU) or synergistic (SPU) processor units access memory using a DMA (Direct Memory Access) unit and have a different cache hierarchy than the PUs. Elsewhere, in IBM prior art, memory management schemes have been described for the DMA units to access memory using a physical and/or a virtual address. In addition, the SPUs have a Local Storage which may be addressed as part of system memory. In other words, the PUs and the APUs were heterogeneous or non-homogeneous.
It may be pointed out that in such heterogeneous processor systems, the APUs are typically specialized processors for doing specific jobs more efficiently, and with less hardware than is used in conjunction with the central or control processors.
Typically, homogeneous multiprocessor systems provide instructions for performing atomic updates of a memory location. Atomic updates are useful in cooperative programming environments to perform operations such as "compare and swap," "test and set," "fetch and no-op," and "fetch and store". These instructions typically rely on a coherent access of a system memory location. A means for a DMA unit to issue atomic update of memory has been described in IBM prior art. When combined with the present invention, the SPU can perform the above operations in a compatible manner as the control processor(s) and thus participate in a cooperative programming environment with the control processor.
Further in the IBM prior art, methods are described for allowing a DMA operation to be cached and also for data to be predictably pre-fetched. As is known, caches and pre-fetching data typically are provided in a multiprocessor system to improve the performance of a cooperative programming environment. However, to take advantage of these methods in a shared memory system with the control processor, the cached and pre-fetched data must be coherent with the other system caches.
While the characteristics of a prior art non-homogeneous processor can be implemented without a coherent memory structure, the performance and difficulty in programming in such an environment suffers greatly. It would thus be highly desirable to have a system whereby each processor, regardless of processor configuration, can time efficiently and in a coherent manner communicate with other caches used by other processors in the system to minimize time required to retrieve valid and up-to-date information utilized by more than one processor of a multiprocessor system.

Method and apparatus for coherent memory structure of heterogeneous processor systems

International Business Machines Corporation


A backlight module (20) includes a light guide plate (22), a light source (21), and a reflection plate (23). The light guide plate includes a light incidence surface (221) for receiving light, a light emitting surface (223) for emitting light, and a bottom surface (222). The light source is disposed adjacent the light incidence surface. The reflection plate disposed under the bottom surface includes a base (232), and a reflection layer (233) formed on the base. The reflection layer defines a number of diffraction grating units (231) at an outer surface thereof. Grating constants of the diffraction grating units progressively decrease with increasing distance away from the light incidence surface. This enables the light emitting surface to output highly uniform light. Further, if the process of fabrication of the diffraction grating units fails, only the reflection plate need be discarded. Thus the backlight module has a low mass manufacturing cost.

1. Field of the Invention
The present invention relates to backlight modules for liquid crystal displays, and particularly to a backlight module utilizing a reflection plate for controlling light emission.
2. Description of Prior Art
A typical liquid crystal display requires a backlight module in order to be able to provide uniform illumination. The performance of the backlight module greatly depends on a light guide plate employed therein. Means for enhancing the uniformity of light that is output from a light guide plate can be classified into two categories. The first category uses geometrical optics means, such as prisms or micro projections. The second category uses wave optics means, such as diffraction gratings. Light guide plates with multifarious configurations of micro projections and prisms have been developed, and some of these light guide plates can generate quite uniform light beams. However, the uniformity provided by projections is relatively low compared with light guide plates having gratings. This is because the gratings of the latter kind of light guide plate can be precisely configured to correspond to the wavelength band of visible light beams, thereby accurately controlling the uniformity of transmission of the light beams. Nevertheless, there are two main problems associated with gratings. Firstly, a grating is liable to become worn over time. Secondly, a grating generates spectral phenomena.
Referring to FIG. 4, U.S. Pat. No. 5,703,667 issued on Dec. 30, 1997 discloses a backlight module. The backlight module 1 comprises a light guide plate 2 having a light incidence surface 2c, a bottom surface 2b and a light emitting surface 2a. The backlight module 1 further comprises a fluorescent tube 4 disposed adjacent the light incidence surface 2c, a reflection plate 5 disposed under the bottom surface 2b, and a diffusing plate 6 and a prism plate 7 disposed on the light emitting surface 2a in that order from bottom to top.
A plurality of reflective diffraction grating units 3 is provided on the bottom surface 2b. Each diffraction grating unit 3 comprises a grating part parallel with the fluorescent tube 4, and a non-grating part. Because all the grating parts of the diffraction grating units 3 are arranged in a same direction parallel to each other, the diffraction grating units 3 provide strong diffraction of light beams received from the fluorescent tube 4.
The ratio of a grating part width to a non-grating part width in the diffraction grating units 3 becomes progressively larger with increasing distance away from the light incidence surface 2c. Therefore, light beams that are available in large quantities at locations nearer to the light incidence surface 2c undergo weaker diffraction, and light beams that are available only in small quantities at locations more remote from the light incidence surface 2c undergo stronger diffraction. As a result, the light emitting surface 2a provides uniform outgoing light beams.
For precision, the diffraction grating units 3 can be fabricated at the bottom surface 2b of the light guide plate 2 by way of injection molding, laser beam etching, electron beam etching, or another kind of precision process used in the semiconductor field. However, if the process of fabrication of the diffraction grating units 3 fails, the whole light guide plate 2 must be discarded. Further, the cost of the light guide plate 2 is high compared to the cost of other parts of the backlight module 1. Defective light guide plates 2 can significantly increase the cost of mass manufacturing backlight modules 1.
It is desired to provide a backlight module which overcomes the above-described problem.


A combination pressure measurement/charging system may include a conduit coupled to a refrigerant can. The conduit may be coupled to a low-pressure side of a refrigerant system. The system may include a valve to control a flow of fluid through the conduit. Thus, a flow of fluid between the refrigerant can and the low-pressure side of the refrigerant system may be controlled using the valve. A first pressure gauge may be in fluid communication with the conduit. The first pressure gauge may be coupled to the low-pressure side of the refrigerant system. The first pressure gauge may be used to operate the valve to control fluid flow through the conduit. A second pressure gauge may be coupled to a high-pressure side of the refrigerant system. The second pressure gauge may be isolated from fluids that flow through the conduit.

1. Field of the Invention
The present invention generally relates to refrigerant charging apparatus. Certain embodiments relate to refrigerant charging and pressure testing assemblies useable to charge a refrigerant system (e.g., a motor vehicle refrigerant system).
2. Description of Related Art
One common technique for assessing the refrigerant charge of a refrigerant system (e.g., an automotive vehicle air conditioning system) is to check the pressure within the refrigerant system by coupling an end of a pressure gauge hose assembly to a service fitting portion of the refrigerant system (e.g., a low-pressure side fitting of the refrigerant system). The pressure gauge may be read, and the pressure gauge hose assembly may be removed from the refrigerant system. If the pressure gauge reading indicates that the refrigerant charge is below a desired level, a charging hose assembly may then be coupled to the refrigerant system, and refrigerant may be added to the refrigerant system through the charging hose assembly.
A first end of a charging hose assembly typically includes a coupling, which may be releasably coupled to the service fitting. A second end of the charging hose assembly typically includes a shutoff valve that may be secured to an outlet of a pressurized refrigerant container (e.g., a refrigerant can). During use, the charging hose assembly is coupled to the service fitting of the refrigerant system and the valve is opened to allow refrigerant to flow into the refrigerant system from the pressurized refrigerant container. After allowing some refrigerant to flow into the refrigerant system, the charging hose assembly may be removed from the service fitting. The pressure gauge hose assembly is again coupled to the service fitting to assess a refrigerant charge of the refrigerant system. After the refrigerant charge is assessed, the pressure gauge hose assembly may be removed from the refrigerant system.
If the refrigerant charge is below a desired level, the charging hose assembly may be reattached to the service fitting and more refrigerant may be added to the refrigerant system. The refrigerant charge may then be reassessed with the pressure gauge hose assembly. These steps may be repeated, using the separate hose assemblies, until the measured pressure within the refrigerant system indicates that the refrigerant system is adequately charged with refrigerant.
U.S. Pat. No. 6,609,385 to Ferris et al. and U.S. Patent Application Publication No. 20040079092 to Ferris et al., each of which is incorporated by reference as if fully set forth herein, disclose a refrigerant charging/pressure testing hose assembly that is useable to both check the pressure in a refrigerant system and, if necessary, add refrigerant to the refrigerant system. The assembly includes a refrigerant hose with a quick disconnect coupler at one end that is connectable to a service fitting of a refrigerant system, a piercing-type shutoff valve at the other end that is connectable to a refrigerant container, a pressure gauge coupled into an intermediate portion of the hose, and a check valve in the hose between the shutoff valve and the pressure gauge.
Some manifold assemblies may also be used to pressure test and/or charge a refrigerant system. For example, QUEST™ brand part# 413 (available from EF Products, Inc., Dallas, Tex.) is an R-134a Manifold Gauge for use by professional service personnel. Part# 413 includes two pressure gauges. One pressure gauge may be coupled to the low-pressure side of a refrigerant system using a hose. The other pressure gauge may be coupled to the high-pressure side of the refrigerant system using a hose. Both of the gauges are coupled to handle-operated valves that open and close flow to the pressure gauges from the hoses. In the manifold, both pressure gauges and both hoses (i.e., the low-pressure side of the refrigerant system and the high-pressure side of the refrigerant system) are in fluid communication with a third hose that may be coupled to a refrigerant container (either a 30 lb. cylinder of refrigerant or, with an adapter, a refrigerant can). Thus, the refrigerant system may be charged through the low-pressure side or the high-pressure side of the refrigerant system. Charging of a refrigerant system through the high-pressure side of the refrigerant system may be dangerous and should only be performed by professional service personnel.

Pressure testing and refrigerant recharging conduit assembly for automobiles


A multi-filter apparatus for processing ova and parasites from human and animal specimens. The filtration apparatus includes a specimen receptacle, a filter holder section and a collection receptacle. The filter holder section contains two filters, a coarse filter and a fine filter. The method for using the apparatus includes mixing a specimen with a preservation solution to form a mixture, transferring the solution to the specimen receptacle and then fractionating the mixture. After fractionation, the specimen receptacle, filter holder section and supernatant are conveniently discarded. The resulting concentrated parasite sample may be analyzed using conventional analytic techniques. The invention further includes a kit including a filtration apparatus and a preservation fluid dispenser.

A. Field of the Invention
This invention relates to an apparatus, a kit and method for processing ova and parasites from human and animal specimens. More specifically, this invention relates to a multi-filter apparatus, kit, and method for separating and concentrating ova and parasite from human and animal specimens.
B. Description of Related Art
The prompt diagnosis and treatment of parasitic infections in humans and animals requires simple, fast and accurate diagnostic techniques. Parasitic infections can be diagnosed based on the presence of ova and parasites in human or animal specimens. For example, parasitic infections in the human intestine can be diagnosed by the presence of ova and parasites in a patient's fecal material. Diagnoses based on the presence of ova and parasites are faster because these parasitic forms are more likely to be present in such specimens. The ability to detect ova and parasites is increased when the ova and parasites are separated from residual host material. The separated ova and parasites can then be qualitatively and quantitatively analyzed to determine the nature and extent of the infection.
There is a need for a separation apparatus which quantitatively and non-selectively separates ova and parasites from human or animal specimens while minimizing the amount of residual contaminating material. Such residual material can interfere with subsequent identification and analysis of the collected parasite sample. There is also a need for a separation apparatus which does not require the use of toxic separation chemicals. Prior separation devices typically use toxic chemicals such as ethyl acetate and ether. Finally, prior separation devices typically offer a compromise between efficiency and cost. The present invention overcomes the deficiencies of prior devices by providing a highly efficient, yet inexpensive, multi-filter separation apparatus which minimizes the use of toxic separation chemicals.
One of the traditional methods for collecting ova and parasites is the floatation method. In this method, a specimen, such as fecal material, is dispersed in a flotation solution. The ova and parasites are then collected by adjusting the specific gravity of the solution so that ova and parasites float to the surface, where they are collected on a microscope slide.
A U.S. Patent to R. J. Greenwald (U.S. Pat. No. 4,293,405) describes an apparatus for collecting ova using the floatation method. This patent is incorporated by reference herein in its entirety. In the Greenwald apparatus, a fecal specimen, suspended in a buoyant solution, is placed in a lower tray, and then a single filter is placed over the specimen. Because the filter pore size is greater than 500 micrometers, the filter allows the ova to pass upwards through the filter and collect on the surface of the solution.
A U.S. Patent to T. Addis (U.S. Pat. No. 3,905,895) discloses a similar apparatus and method for separating ova from fecal material. This patent is incorporated by reference herein in its entirety. The Addis apparatus includes a hollow receptacle and a pair of interconnected filtering surfaces. Fecal samples are placed within the receptacle, a flotation solution is added, and the ova are allowed to pass through the filters to the surface of the solution, where they are collected.
A disadvantage of both the Greenwald and Addis devices is that the ova are concentrated at the liquid meniscus, and not in a tight pellet. The large pore size of the filters in the Greenwald and Addis devices also allows contaminating matter to collect at the liquid surface with the ova. This residual material interferes with analysis of the parasite samples.
Another method for separating ova and parasites from fecal material is filtration prior to a gravimetric centrifugation separation. In this method, the sample is first filtered through a filter to remove large contaminants. Then, diethyl ether is added to "defat" the specimen solution. After separation by centrifugation, 4 layers were formed: an ether layer, a debris layer, a formalin layer and a pellet containing ova and parasites. After decanting the first three layers, the pellet was analyzed for the presence of ova and parasites. A later improvement in this method substituted ethyl acetate for diethyl ether to reduce the risk of fire or explosion.
A U.S. Patent to W. S. Zierdt (U.S. Pat. No. 4,081,356) discloses an apparatus and method for collecting ova and parasites using the traditional formalin ether method. This patent is incorporated by reference herein in its entirety. The Zierdt apparatus includes a single filter juxtaposed between emulsification and separation chambers. Emulsified fecal samples are transferred from the emulsification chamber to the separation chamber by vertical agitation. After transfer of the sample to the emulsification chamber, the ova and parasites are subsequently concentrated using the formalin-ether method.
A disadvantage of the Zierdt apparatus is that the pore size of the single filter must be sufficiently large to allow transfer of the parasite sample through the filter using vertical agitation. Typically, only large residual material is trapped by the filter. Vertical agitation can also generate fine sediment which contaminates the parasite sample. The Zierdt apparatus is also designed for use of hazardous chemicals such as diethyl ether, which create a fire and explosion hazard.
A U.S. Patent to M.-G. Chang (U.S. Pat. No. 5,066,463) discloses a multi-purpose fecal examination apparatus for performing occult blood tests as well as inspecting fecal samples for parasites. This patent is incorporated by reference in its entirety. Fecal samples are inserted into a hollow tube within the apparatus. Filter paper impregnated with test reagent may be placed in contact with the sample within two windows in the apparatus. After testing is complete, the fecal samples are drained through a single filter into a collection device such as a test tube. Because the examination apparatus lacks a self-contained collection tube, the use of this apparatus increases the likelihood that fecal samples will be lost or will contaminate the user. Because the filtration apparatus includes only a single filter, and is designed to collect the sample by draining the sample through a filter, the apparatus requires a large pore size and allows residual material to collect with the parasite sample.
Perry et al. reviewed the effectiveness of five different filtration devices, including the Zierdt apparatus described above (Perry, J. L., Matthews, J. S., and Miller, G. R. "Parasite Detection Efficiencies for Five Stool Concentration Systems." Journal of Clinical Microbiology, vol. 28, no.2 (June 1990), pp. 1094-1097). This article is incorporated by reference in its entirety. These filtration devices were used for the removal of large debris before a traditional centrifugation concentration procedure, such as the formalin-ether or formalin-ethyl-acetate methods. The devices have large filter pore sizes ranging from 600 to 2,000 micrometers. While all tested devices detected all six test organisms, the efficiencies of detection were generally low.
Other methods of analyzing specimens for the presence of parasites utilize non-filtration techniques. For example, U.S. Patents to H. Adlercreutz et al. (U.S. Pat. No. 4,427,769) and M. A. Grow and V. D. Shah (U.S. Pat. No. 5,094,956) disclose methods for testing fecal samples for hemoglobin by immunoassay testing. These patents are incorporated by reference herein in their entirety. Such tests are not designed to facilitate visual detection or identification of ova and parasites from fecal samples.
The present invention overcomes the deficiencies of prior devices by providing a multi-filter apparatus for quantitatively separating ova and parasites from human and animal specimens and for concentrating the parasite samples. The multi-filter apparatus eliminates the need for separate filtration and separation steps by performing both steps at the same time. An additional advantage is that the use of toxic chemicals such as diethyl ether and ethyl acetate is eliminated. The multi-filter apparatus may be used a part of a specimen-processing kit.
The present invention also includes a method for processing human and animal specimens by mixing the specimen in a preservation solution, transferring the specimen-containing solution to a specimen receptacle and then fractionating the mixture in the multi-filter apparatus. During fractionation, the ova and parasites are concentrated in a collection receptacle. The concentrated ova and parasites are then conveniently separated from the supernatant and are ready for subsequent analysis.

Filtration apparatus, kit and method for processing parasite samples


Provided are fine coated copper particles, which are fine with a narrow particle size distribution and superior storability, and which can be sintered at low temperatures. Specifically provided is a method for producing fine coated copper particles which is characterized by including: a step of mixing a copper-containing compound and a reducing compound to form a composite compound that is capable of thermal decomposition to generate copper in an alkylamine; and a step of heating the composite compound in the alkylamine to produce fine copper particles coated with the alkylamine.

1. Field of the Invention
The present invention relates to fine coated copper particles of a nanometer size that have superior dispersibility in a solvent and demonstrate favorable electrical conductivity as a result of low-temperature sintering on a flexible printed board and the like, a method for producing the same, and a sintered copper adherend using the same.
2. Description of Related Art
In the background of recent remarkable progress of electronic devices, there exist advances of semiconductor devices and other electronic components, and the considerable developments of printed wiring substrates on which these electronic components are mounted. For many of these electronic devices there is a need for compact size, reduced thickness, and lightweight, and furthermore, improved productivity. Therefore, printed wiring substrates have also been required to have various contrivances and improvements to deal with this need. In particular, to achieve these requirements, there is a demand for higher speed and higher density to mount the material of electrically conductive wiring for the electronic components.
Amidst such circumstances, nanosized fine metal particles are currently expected to serve as one of such materials, and studies for this are now being conducted (for example, see Kawazome, M. et al., Pulverization, No. 50, 27-31 (2006/2007)).
As the fine metal particles to be used as such a wiring material, ones mainly formed of copper are preferable from the point of low electromigration. For this reason, means for providing nanosized fine copper particles have so far been studied. For example, in Japanese Unexamined Patent Publication No. 2010-24526, it is described that, as a method for producing fine copper particles, a fine copper powder is produced by reducing a precursor of fine copper particles by a treatment with a hydrazine derivative in water. However, forming a copper coating by sintering the thus produced fine copper powder at low temperatures has yet to be achieved. In addition, Japanese Unexamined Patent Publication No. 2007-321215 discloses a technique, as a method for producing fine copper particles, in which metal nanoparticles are produced by reducing an organic acid salt of a metal by treating a solution containing the metal salt and an amine with a reducing agent. It is described that the fine copper particles produced by this method attained electrical conductivity by sintering at about 300° C.
In the methods for producing fine copper particles according to the methods described in Japanese Unexamined Patent Publication No. 2010-24526 and Japanese Unexamined Patent Publication No. 2007-321215, metal copper is generated by previously preparing a copper-containing compound in a liquid, and charging a reducing agent thereto from the outside to cause the reduction reaction. Thus, it is inevitable for the speed of the progression of the reduction reaction to be limited by the supply of the reducing agent and such substances. For this reason, in a case of an actual production of fine copper particles, it is difficult to cause a reaction to generate uniform fine copper particles, due to uneven concentrations of the raw material substances in the reaction container, and the like. Thus, in particular, it becomes very difficult to uniformly produce a large amount of fine copper particles in the industrial production process, which is a problem.
On the other hand, Japanese Unexamined Patent Publication No. 2008-214695 discloses a technique for producing fine silver particles protected by protective films of oleylamine by: mixing silver oxalate with an excessive amount of oleylamine to allow them to react so as to form a complex compound; and thereafter heating the complex compound to decompose oxalate ions included in the complex compound so as to generate atomic silver. It is described that the method is able to provide fine silver particles which are ultra-fine with a narrow particle size distribution and superior storage stability.
According to this method, silver oxalate is thermally decomposed in oleylamine to generate atomic silver, and the aggregation thereof enables the production of fine silver particles. In this production method, silver atoms are generated by the decomposition of a single type of molecule, because of which, atomic silver can be generated evenly in the reaction system without a limitation on the speed of the reaction due to the supply of substances. Moreover, it is possible, by controlling the aggregation of atomic silver with the action of oleylamine, to produce fine silver particles with clean surfaces which are ultra-fine with a narrow particle size distribution and superior storage stability. As a result, the use of the fine silver particles produced by this method makes it possible to provide an ink for wiring formation with which wiring can be formed by sintering on the surface of a resin.
Regarding copper-containing compounds, if it is possible to generate atomic copper by self decomposition in a predetermined alkylamine, as described in Japanese Unexamined Patent Publication No. 2008-214695, it is also expected to produce fine copper particles coated with an alkylamine similarly to the fine silver particles.
However, generally speaking, a copper-containing compound has a large free energy change in its formation. Thus, mere heating is not always enough to generate atomic copper by self decomposition of the compound. Also, if a mixture containing the compound and an alkylamine is strongly heated; the alkylamine may be vaporized or degraded before the generation of atomic copper, another chemical reaction differing from the copper reduction reaction may occur between the compound and the alkylamine, or other such problems may occur. Thus, it is difficult to produce superior fine copper particles. For this reason, what is applicable to the method described in Japanese Unexamined Patent Publication No. 2008-214695 has been limited to compounds which are mainly composed of silver.

Fine coated copper particles and method for producing same


A multiplexing device is described. In one embodiment, the multiplexing device includes: a hardwired multiplexer including a plurality of input terminals; a plurality of select terminals; and at least one output terminal, where the plurality of input terminals are coupled to a plurality of block input lines or a plurality of functional element input terminals. In one embodiment, the plurality of input terminals are hardwired to the plurality of block input lines or the plurality of functional element input terminals. In one embodiment, the plurality of select terminals are coupled to a second plurality of functional element input terminals or a plurality of functional element output terminals. In one embodiment, the plurality of block input lines include a plurality of logic array block (LAB) lines, the plurality of functional element input terminals include a plurality of logic element (LE) input terminals, and the plurality of functional element output terminals include LE output terminals. In another embodiment the multiplexing device includes: a hardwired multiplexer including a plurality of data signal input terminals; and a first plurality of LEs including a first plurality of LE output terminals, where the plurality of data signal input terminals are coupled to the first plurality of LE output terminals.

1. Field of the Invention
This invention relates to programmable logic devices (PLDs), and more particularly to a method of implementing multiplexers through the addition of dedicated hardware in a PLD.
2. Description of the Related Art
A PLD is a digital, user-configurable integrated circuit used to implement a custom logic function. For the purposes of this description, the term PLD encompasses any digital logic circuit configured by the end-user, and includes a programmable logic array ("PLA"), a field programmable gate array ("FPGA"), and an erasable and complex PLD. The basic building block of a PLD is a logic element ("LE"). An LE is capable of performing logic functions on a number of input variables. Conventional PLDs combine together multiple LEs through an array of programmable interconnects to facilitate implementation of both simple and complex logic functions.
PLDs are frequently used for a variety of applications which require a large number of multiplexers. The multiplexers are typically implemented within PLDs as "soft" muxes. However, "soft" muxes can consume a large number of LEs within the PLD. For example, two four-input look-up tables (LUTs) are required to implement a simple 4:1 "soft" mux. Two of the inputs to the first LUT are used as multiplexer selection control signals. The third and fourth inputs of the first LUT are used as the first and second multiplexer input signals. The output of the first LUT is connected to an input of the second LUT. One multiplexer selection control signal from the first LUT is connected to an input of the second LUT and the third and fourth inputs of the second LUT are used as the third and fourth multiplexer input signals. Larger multiplexers, such as a 16:1 "soft" mux, require ten four-input LUTs comprising roughly twenty thousand transistors.
Another disadvantage of "soft" muxes within PLDs is that they can be relatively slow. For example, the first and second multiplexer input signals in the 4:1 "soft" mux described above must pass through two levels of logic before a multiplexer output signal is generated. Larger "soft" muxes used to perform wide fan-in multiplexing require some multiplexer input signals to pass through numerous logic levels before generating an output, thus slowing down the speed, efficiency, and economy with which PLDs can perform multiplexing operations. Although synthesis tools can be utilized to rearrange signal paths within a particular LUT, synthesis tools are not sophisticated enough to understand the structure of the overall circuit which is necessary for determining critical paths or rearranging signal paths between different LUTs.
The present invention addresses the above mentioned disadvantages.

Multiplexing device including a hardwired multiplexer in a programmable logic device


The present disclosure relates to a pliable carbonaceous pocket composite structure including various particles encapsulated within pliable carbonaceous pockets formed by carbonaceous sheets, a method for preparing the pliable carbonaceous pocket composite structure which enables ultrafast mass production of the pliable carbonaceous pocket composite structure, an electrode including the pliable carbonaceous pocket composite structure, and an energy storage device including the electrode.

As demand for energy storage devices with higher energy densities is exploding over time, enormous attention has been toward lithium ion batteries (LIB). However, ever-evolving variety systems require higher levels of energy storage, and the improvement of the anode materials of LIBs is especially required to satisfy this demand.
In spite of the numerous studies to improve anode materials, the performance of LIB used in real life is still stagnant. By these problems, the lithium metal batteries are emerging, which ultimately reduces the specific gravity of the anode material by replacing graphite currently used as an anode material of a LIB. Although this methodology shows a possibility to achieve a very high energy density, the safety problem has not been solved.
By these reasons, it is essential that the new approach for developing an anode having a high specific capacity bridge the gap between conventional and Li-metal batteries. Moreover, the whole process for preparing the anode materials have to not only be scalable and precisely controllable for further process to commercialization, but also be capable of paring with representative cathode materials for practical full-cell devices. More importantly, the newly suggested methodology for designing materials should be able to apply directly to the current industrial structure, and capable of being realized in near future.
Extensive growth of the demand to increase the energy density of lithium ion batteries (LIBs) for advanced portable electronic devices and electric vehicles (EVs) have aroused the enormous interests in the new anode materials. Various transition series of metal oxide or IV series species with high theoretical capacities over 1000 mAh/g have been expected to play a key role in realizing the next generation LIBs with high energy densities, increasing the specific gravimetric capacities on the anode sides. Despite of this attractive feature, the severe capacity fading by their huge volume expansion introducing the unstable solid-electrolyte interphase (SEI) layer formation in a repeated cycling operation hinders their practical applications. Moreover, relatively low electrical properties in high performances electrodes such as conductivity and Li ion diffusivity can be also the obstacle limiting the role as an anode in a full-cell configuration. Various approaches to address the issues in these anode materials have been developed, such as the diminishing the size of active materials, formation of buffer layers on active materials by removing the surface inactive shell, and composition with carbon materials. However, these suggestions are still suffering from the increasing the irreversible reaction for SEI formation, lack of cost-efficiency in scalable process, and low-contents of active materials in a total electrode.
Of the possible candidate for anode materials, silicon (Si), which has a high theoretical capacity over 3,500 mAh/g, has been considered as the most promising candidate for replacing the graphite (372 mAh/g). Almost 10 times higher specific capacity of Si anodes than that of graphite can be leading a reduced weight of anode side, extracting the maximized energy densities from the full-cell configuration of LIBs. Unfortunately, the issues raised from the volume change during the operation are the most magnified in the Si-based materials. To use Si as an anode, an advanced nanomaterial design for Si-carbon composites has been suggested to prevent a volume expansion and control SEI formation for high Coulombic efficiency (CE), such as Si nanotubes, Si-carbon core shell, and graphene encapsulated Si clusters. However, these Si composites still suffer from insufficient active materials contents in composites, limiting the specific capacity for high energy densities in full-cells and consuming the Li ions during a first cycle by less 85% of initial CE (ICE). Moreover, the synthesis procedures for fabricating the structures precisely, such as the HF etching process, gas-phase synthesis with high-temperature, and hard-template operation, are quite far from the practical application because of various aspects of inefficiency in cost, safety, and scalability.

Pliable carbonaceous pocket composite structure, method for preparing the same, electrode, including the same, and energy storage device including the electrode

KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY


In the normal selfrefresh mode, the timer output selection circuit selects the timer output of a longer cycle from the timer outputs generated by the internal timer circuit, and the selected timer output supplied as an operation activation signal for the selfrefresh operation. Using this long timer output, the selfrefresh operation of DRAM cells in the memory device is performed with a low operating current which allows the memory device to be backed up by a battery. When the selfrefresh mode is set before the store operation, the timer output of a short cycle is selected from the timer outputs generated by the internal timer circuit, and the short timer output is supplied as an operation activation signal for the selfrefresh operation. Using this short timer output, the selfrefresh operation of the volatile memory means is performed. Therefore, a drop in the potential of the volatile memory portions caused by a leakage current can be quickly compensated, thus ensuring that data can be correctly stored in the volatile memory means. In the selfrecall operation mode, the timer output of an medium cycle is selected from the timer outputs generated by the internal timer circuit, and the medium timer output is supplied as an operation activation signal for the selfcall operation. Since the selfrecall operation is performed using the medium timer output, the selfrecall operation is performed at a faster speed than the normal selfrefresh operation.

1. Field of the Invention
The present invention relates to a semiconductor memory device, and more particularly to a non-volatile semiconductor memory device having memory cells each comprising volatile memory means (such as a DRAM cell) and nonvolatile memory means (such as an EEPROM cell).
2. Description of the Prior Art
A nonvolatile semiconductor memory comprises memory cells each arranged in a matrix form. Each of the memory cells has a combination of a DRAM cell MC.sub.3 and an EEPROM cell MC.sub.4 as shown in FIG. 7 (for example, Y. Terada et al, IEEE JOURNAL OF SOLID-STATE CIRCUITS, Vol. 23, No. 1, Feb., 1988). Hereinafter, such a nonvolatile semiconductor memory device is referred to as "an NVDRAM". In FIG. 7, C.sub.2 is a DRAM capacitor, B is a bit line, CG is a control gate line, and W.sub.1 and W.sub.2 are first and second word lines, respectively. In the NVDRAM of FIG. 7, data is transferred between the DRAM cell MC.sub.3 and C.sub.2 and a external device through the bit line B. The EEPROM cell MC.sub.4 is activated only when data in the DRAM cell MC.sub.3 and C.sub.2 is transferred to the EEPROM cell MC.sub.4 ("store operation") or when data stored in the EEPROM cell MC.sub.4 is transferred to the DRAM cell MC.sub.3 and C.sub.2 ("recall operation"). Once the data of the DRAM cell MC.sub.3 and C.sub.2 is stored in the EEPROM cell MC.sub.4, the EEPROM cell MC.sub.4 retains the data stored therein, even when the power supply to the NVDRAM is turned off. This enables the data retained in the EEPROM cell MC.sub.4 to be recalled to the DRAM cell MC.sub.3 and C.sub.2 when the power is turned on again.
In the NVDRAM, the selfrefresh and selfrecall operations must be performed at a predetermined time interval, respectively. The timings of the selfrefresh and selfrecall operations are controlled by the output of an internal timer circuit, in the same manner as the selfrefresh operation in a pseudo SRAM. In order to reduce the current level for the selfrefresh operation, such an internal timer circuit is generally designed so that the output has a predetermined constant long cycle, thereby enabling the battery backup.
FIG. 6 illustrates an internal timer circuit used in a conventional NVDRAM. The internal timer circuit of FIG. 6 comprises an oscillator 61, and a plurality of 1/2 frequency dividers 62.sub.l -62.sub.n which are connected in series. The output of the oscillator 61 (frequency: f.sub.s) is coupled to the input of the first 1/2 frequency divider 62.sub.l. The last 1/2 frequency divider 62.sub.n outputs a signal of a long cycle (frequency: f.sub.s /2.sup.n). which is in turn supplied as an operation activation signal for the selfrefresh and selfrecall operations.
However, in a prior art NVDRAM, when the selfrefresh operation is performed before the store operation using the long-cycle timer output, a current leaks from the DRAM cell MC.sub.3 and C.sub.2 to cause a drop in the potential of the DRAM cell MC.sub.3. This often results in that data cannot be correctly stored into the EEPROM cell MC.sub.4. Furthermore, the use of the long-cycle timer output in the selfrecall operation required a prolonged period of time for performing the selfrecall operation.


A method includes storing a first data to a first portion of a storage location of a storage component of a processing device in association with a first store operation and obtaining a second data from the storage location, the second data being stored at the storage location prior to the first data. The method further includes determining whether the storage location has a bit error at second portion of the storage location different from the first portion based on the second data obtained from the storage location. The method additionally includes storing a third data to a second portion of the storage location in response to determining the storage location has a bit error at the second portion, wherein the third data is to correct the bit error.

Data stored at a storage component often is susceptible to corruption due to a variety of factors, including static discharge, parasitic capacitance, structural imperfections, and the like. Accordingly, in using a storage component, many conventional processing devices utilize error detection/correction techniques whereby error correcting code (ECC) data is generated for a corresponding storage location (e.g., a cache line) and stored with the corresponding storage location at the storage component. Accordingly, the storage location can be periodically accessed and the integrity of the data stored in the storage location can be verified based on the corresponding ECC data.
The storage of data to a storage location of a storage device during a store operation typically entails the generation of a new ECC value for the storage location. In many instances, data being stored to the storage location may overwrite only a portion of the storage location. However, in the event that an error exists in the remaining portion of the storage location that is not overwritten during a store operation, the new ECC value is calculated using the invalid data and the old ECC value of the storage location is overwritten with the new ECC value, thereby making it impossible to detect the bit error during subsequent accesses to the storage location because the new ECC value was calculated using the erroneous data and thus incorrectly validates the erroneous data. Without the proper precautions, subsequent use of the erroneous data from the storage location can cause errors in calculations or other operations dependent on the data.
To prevent the use of erroneous data, in certain conventional devices the store pipeline is stalled for each store operation until the data previously stored at the corresponding storage location can be verified as valid, or corrected if identified as invalid, before the next store operation can proceed. As a result, the performance of store operations, and thus the performance of the processing device, is negatively impacted. Further, other consumers of the data being stored, such as other processing devices, may be delayed while waiting for the verification of the old data to complete before the new data is available for access. Accordingly, an improved technique for processing store operations for a processing device would be advantageous.
The use of the same reference symbols in different drawings indicates similar or identical items.

Parallel instruction processing and operand integrity verification


The present invention relates to a friction clutch having a pair of clutch members opposite to each other in a radial direction with a plurality of rollers held between them, an angle of a turning axis of each roller relative to the rotation axis of a clutch member is made more than 10xc2x0 and less than 20xc2x0, and in the meantime, the angle of the turning axis of each roller relative to the plane including the rotation axis of the clutch member is made more than 25xc2x0 and less than 90xc2x0, so that a stable frictional force may be generated at all times. In this case, when a load in an axial direction is added to the clutch member, each roller generates sliding friction while turning, and therefore, a wear is extremely smaller than that of a structure of bringing the respective fellow clutch plates into surface contact with each other like a multiple disk clutch.

1. Field of the Invention
The present invention relates to a friction clutch used for power transfer of various machines and an automatic transmission of an automobile using the friction clutch and a non-stage transmission of an automobile and a power distribution device of an automobile and a power transmission device of a motorcycle.
2. Description of the Prior Art
Previously, as a clutch used for various power transfer mechanisms, a so-called multiple disk clutch has been well known, in which a lot of clutch plates rotating integrally with a member on the input side and a lot of clutch plates rotating integrally with a member on the output side are alternately arranged, and the respective clutch plates are pressed onto each other, so that the torque on the input side may be transferred to the output side by frictional force of each clutch plate.
This multiple disk clutch is widely used for an automatic transmission of an automobile, a non-stage transmission of an automobile, a power distribution device of an automobile, and a power transmission device of a motorcycle or the like, since the respective fellow clutch plates can be connected while being properly slid.
For example, in a general automatic transmission of an automobile, the rotational ratio of the output shaft to the input shaft is changed step by step by changing the combination of a lot of gears making up the power transmission passage, and therefore, by using a plurality of multiple disk clutches as a mechanism for arbitrarily regulating the rotation of a specific gear at the time of changing speed, the shock of speed changing is relieved by utilizing sliding when connecting each multiple disk clutch.
Furthermore, a non-stage transmission which is put in practice in part of automobiles is configured so that the speed may be continuously changed by using a pair of variable diameter pulleys and a V-belt. In this case, by using a multiple disk clutch as a starting clutch, an effective creeping (state where a little power is transmitted to the drive wheel side without pressing down the accelerator) is generated at the starting time by utilizing sliding of the multiple disk clutch.
Furthermore, as a power distribution device of an automobile, a device is well known, in which normally, the power of an engine is transmitted to a drive shaft on the front wheel side or the rear wheel side to perform two-wheel drive, and according to the running state or the like, the drive force is transmitted to both drive shafts on the front wheel side and the rear wheel side, respectively to perform four-wheel drive. In this case, when performing four-wheel drive, each of the drive shafts on the front wheel side and the rear wheel side is connected by a multiple disk clutch, and by utilizing sliding of the multiple disk clutch, the torque distribution to the front wheel side or the rear wheel side is controlled.
Furthermore, in a power transmission device of a motorcycle, the weight of the vehicle body is light relative to the maximum power of the engine, and therefore, by using a so-called wet multiple disk clutch, a sudden transmission of the power when starting is prevented by sliding of the respective fellow clutch plates.
However, in the above described multiple disk clutch, there are many cases where each clutch plate is used while being slid, and therefore, in the sliding state, the oil film between the respective clutch plates is cut off so that the clutch plate may easily wear away, which is disadvantageous in durability. Therefore, in an automatic transmission using gears, the sliding state of the clutch plate is reduced in the connection of the clutch at the time of changing speed, but since the torque is transmitted suddenly according to the decrease of the state of sliding, there has been such a problem that the shock of speed changing cannot be sufficiently relieved. Furthermore, in a non-stage transmission using a multiple disk clutch for starting, in order to decrease the wear of the clutch plate, the thrust force of the fellow clutch plates when a creeping occurs is reduced, and therefore, when compared with an automatic transmission using a torque converter, at present, it is a limit to generate a creeping force of approximately half degree thereof, which has been practically disadvantageous. Furthermore, in a power distribution device of an automobile, it is also necessary to continuously slide the clutch plate when controlling the torque distribution, and therefore, there has been a problem of easily generating the wear of a clutch plate. Furthermore, in a power transmission device of a motorcycle, since the clutch operation is artificially performed, the life of a clutch plate is shortened in the situation of frequently performing half-clutch, and there has been a problem of increasing the frequency of replacement and repair.
The present invention is achieved due to the above described problems, and it is an object of the present invention to provide a friction clutch capable of decreasing the wear in the sliding state and an automatic transmission of an automobile using the friction clutch and a non-stage transmission of an automobile and a power distribution device of an automobile and a power transmission device of a motorcycle.
In order to attain the above described object, a friction clutch of the present invention comprises: a pair of clutch members which are coaxially and relatively rotatably arranged with the peripheral surfaces opposite to each other in the radial direction and in which the respective opposite surfaces are formed to be inclined from one end side toward the other end side in the axial direction; a lot of rollers which are arranged between the opposite surfaces of the respective clutch members; a holder which rotatably holds each roller mutually at intervals in the circumferential direction of each clutch member; and thrust means which can thrust in the axial direction at least one of the respective clutch members in the direction in which the opposite surfaces of the respective clutch members approach each other, wherein the turning axis of each roller is inclined to have a specific angle relative to the rotation axis of the clutch member and in the meantime, the inclination angle thereof is made more than 10xc2x0 and less than 20xc2x0, and the turning axis of each roller is each inclined in the same direction to have a specific angle relative to the plane including the rotation axis of the clutch member and in the meantime, the inclination angle thereof is made more than 25xc2x0 and less than 90xc2x0.
According to this configuration, when a load in the axial direction is applied to each clutch member by the thrust means and each clutch member is relatively rotated while being brought into contact with each roller, each roller which tends to turn in the direction inclined relative to the rotary track of the clutch member turns along the rotary track of the clutch member while being restricted by the holder, and therefore, a frictional force by the sliding and turning of each roller is generated between each roller and each clutch member. At that moment, in one rotational direction of the clutch member, each roller tends to turn in one axial direction of the clutch member, and in the other rotational direction of the clutch member, each roller tends to turn in the other axial direction of the clutch member, and therefore, different frictional forces are generated depending on the rotational direction of the clutch member, respectively. In this case, by making the inclination angle of the turning axis of each roller relative to the rotation axis of the clutch member more than 10xc2x0 and less than 20xc2x0 and the inclination angle of the turning axis of each roller relative to the plane including the rotation axis of the clutch member more than 25xc2x0 and less than 90xc2x0, an effective and stable frictional force is generated at all times. As a result of this, the wear can be made extremely smaller than that of the structure in which the respective fellow clutch plates are brought into surface contact with each other like a multiple disk clutch, and the durability can be remarkably improved. Furthermore, since different frictional forces can be generated depending on the rotational directions of the clutch member, respectively, it is very advantageous in a case where such an operation is the object.
Furthermore, in order to attain the above described object, the friction clutch of the present invention comprises: a pair of clutch members which are coaxially and relatively rotatably arranged with the peripheral surfaces opposite to each other in the radial direction and in which the respective opposite surfaces are formed to be inclined from one end side toward the other end side in the axial direction; a lot of rollers which are arranged between the opposite surfaces of the respective clutch members; a holder which rotatably holds each roller mutually at intervals in the circumferential direction of each clutch member; and thrust means which can thrust in the axial direction at least one of the respective clutch members in the direction in which the opposite surfaces of the respective clutch members approach each other, wherein the turning axis of each roller is inclined to have a specific angle relative to the rotation axis of the clutch member and in the meantime, the inclination angle thereof is made more than 3xc2x0 and less than 8xc2x0, and the turning axes of the respective rollers are inclined in the opposite directions to: have a specific angle relative to the plane including the rotation axis. of the clutch member, a specific number of pieces by a specific number of pieces and in the meantime, the inclination angle thereof is made more than 25xc2x0 and less than 90xc2x0.
According to this configuration, when a load in the axial direction is applied to each clutch member by the thrust means and each clutch member is relatively rotated while being brought into contact with each roller, each roller which tends to turn in the direction inclined relative to the rotary track of the clutch member turns along the rotary track of the clutch member while being restricted by the holder, and therefore, a frictional force by the sliding and turning of each roller is generated between each roller and each clutch member. At that moment, when the clutch member is rotated in an arbitrary direction, part of rollers inclined mutually in the same direction tend to turn in one axial direction of the clutch member, and the rollers inclined in the other direction tend to turn in the other axial direction of the clutch member, and therefore, by the number of pieces of rollers inclined mutually in the opposite directions, it is possible to arbitrarily set the magnitude of the frictional force in each rotational direction of the clutch member. In this case, by making the inclination angle of the turning axis of each roller relative to the rotation axis of the clutch member more than 3xc2x0 and less than 8xc2x0 and the inclination angle of the turning axis of each roller relative to the plane including the rotation axis of the clutch member more than 25xc2x0 and less than 90xc2x0, an effective and stable frictional force is generated at all times. Consequently, similarly to the above description, the improvement of durability can be considerably attained, and in the meantime, it is possible to arbitrarily set the magnitude of the frictional force in each rotational direction of the clutch member, and therefore, it can be applied in a wide range according to the use.
Furthermore, in the above described friction clutch, the rollers inclined mutually in the opposite directions relative to the plane including the rotation axis of the above described clutch member are alternately arranged in the circumferential direction of the clutch member, by the same numbers, and consequently, an equal frictional force is generated regardless of the rotational direction of the clutch member. Accordingly, it is very advantageous in the case where such an operation is the object.
Furthermore, in the above described friction clutch, the above described respective clutch members are provided in the axial direction, in a plurality of pieces, and consequently, it is possible to arbitrarily set the magnitude of the frictional force according to the number of the respective clutch members. Accordingly, a frictional force complying with the object can be obtained.
Furthermore, in the above described friction clutch, the contact surface to the roller in the above described respective clutch members is each formed to be convex to the outer peripheral surface of the roller in the cross section including the turning axis of the roller, and consequently, it is possible to reduce the contact pressure on both end sides in the axial direction of each roller. Accordingly, the wear one-sided in the axial direction does not occur in each roller, and the durability of each roller can be improved.
Furthermore, in the above described friction clutch, the outer peripheral surface of the roller brought into contact with the above described respective clutch members is each formed to be convex to the contact surface of each clutch member in the cross section including the turning axis of the roller, and consequently, similarly to the above description, it is possible to decrease the contact pressure on both end sides in the axial direction of each roller, and the wear one-sided in the axial direction does not occur in each roller, and the durability of each roller can be improved.
Furthermore, in order to attain the above described object, the present invention is an automatic transmission of an automobile, comprising: an input shaft and an output shaft which are arranged mutually coaxially; a torque converter which transmits the power between the input shaft side and the engine side; at least one central gear which is arranged coaxially with; the input shaft and the output shaft; at least one pair of planetary,gears which are rotatably held by a holder rotatable around the input shaft and the output shaft and which are engaged with the central gear; at least one internal gear which is engaged with the planetary gear; a plurality of clutches which can regulate the relative rotation between specific members among an engine side member of the torque converter, the above described input shaft side member of the torque converter, the central gear, the holder of the planetary gear, the internal gear, and the transmission main body; and control means which each controls the connection and cut-off of each clutch according to the change of speed respectively, wherein a plurality of above described friction clutches are provided as the above described respective clutches, and each clutch member of each friction clutch is individually provided between specific members among the engine side member of the above described torque converter, the above described input shaft side member of the torque converter, the central gear, the holder of the planetary gear, the internal gear, and the transmission main body, and the thrust means of each friction clutch is controlled respectively by the above described control means. Consequently, when the above described clutch is connected while changing speed, each roller turns while sliding, so that a frictional force may be generated. As a result of this, the wear of each clutch can be extremely reduced, and it is possible to connect the clutch after continuing the sliding state of each clutch for a long time when changing speed. Accordingly, the shock in changing speed can be largely reduced.
Furthermore, in order to attain the above described object, the present invention is a non-stage transmission of an automobile, comprising: a first variable diameter pulley which rotates integrally with the input shaft; a second variable diameter pulley which rotates integrally with the output shaft; a belt which is wound up on each pulley; a starting clutch which is arranged between the output shaft and the drive wheel side; and control means which controls the connection and cut-off of the clutch, wherein the above described friction clutch is provided as the above described clutch, and one clutch member of the friction clutch is provided on the engine side and in the meantime, the other clutch member of the friction clutch is provided on the input shaft side, and. the thrust means of the friction clutch is controlled by the above described control means. Consequently, when the above described clutch is connected while transmitting the power of the output shaft to the drive wheel side, each roller turns while sliding, so that a frictional force may be generated. As a result of this, the wear of the clutch can be extremely reduced, and the sliding friction of the clutch can be increased when a creeping occurs. Accordingly, it is possible to obtain a practically sufficient creeping force.
Furthermore, the present invention is a power distribution device of an automobile, comprising: a clutch arranged between a drive shaft on the front wheel side and a drive shaft on the rear wheel side of an automobile; and control means for controlling the connection and cut-off of the clutch, so that the power of the engine to be transmitted to a drive shaft on the front wheel side or on the rear wheel side may be transmitted to both drive shafts on the front wheel side and on the rear wheel side by the connection of the above described clutch, wherein the above described friction clutch is provided as the above described clutch, and one clutch member of the friction clutch is provided to one of the drive shafts on the front wheel side and on the rear wheel side and in the meantime, the other clutch member of the friction clutch is provided to the other of the drive shafts on the front wheel side and on the rear wheel side, and the thrust means of the friction clutch is controlled by the above described control means. Consequently, when the above described clutch is connected while transmitting the power to both drive shafts on the front wheel side and on the rear wheel side, each roller turns while sliding, so that a frictional force may be generated. As a result of this, when distributing the power to the drive wheel on the front wheel side or on the rear wheel side, even in the case of arbitrarily controlling the torque distribution ratio by using the sliding of the clutch, the wear of the clutch can be extremely reduced. Accordingly, the improvement of durability can be attained.
Furthermore, the present invention is a power transmission device of a motorcycle having a clutch for intermittently transmitting the power of the engine to the drive wheel side by the operation of a clutch lever, wherein the above described friction clutch is provided as the above described clutch, and one clutch member of the friction clutch is provided on the engine side and in the meantime, the other clutch member of the friction clutch is provided on the drive wheel side, and the thrust means of the friction clutch is controlled by the above described clutch lever. Consequently, when the above described clutch is connected while transmitting the power of the engine to the drive wheel side, each roller turns while sliding, so that a frictional force may be generated. As a result of this, even in the case of often using the half-clutch when starting or changing speed, the wear of the clutch can be extremely reduced, and the improvement of durability can be attained. In this case, by making the setting so that the rotational direction of a larger frictional force may be on the acceleration side, the frictional force in deceleration can be reduced, and therefore, the excessive engine brake of, for example, a 4-cycle engine can be relieved, which is practically extremely effective.

Friction clutch and automatic transmission of automobile using the same and non-stage transmission of automobile and power distribution device of automobile and power transmission device of motorcycle