A method for reducing contaminants in a semiconductor device is provided. The method includes cleaning the semiconductor substrate. The cleaning includes rotating the semiconductor substrate and dispersing an aerosol at a predetermined temperature to a surface of the semiconductor substrate or a layer formed on the substrate to be cleaned. The aerosol includes a chemical having a predetermined pressure and a gas having a predetermined flow rate.

Processing wafers to manufacture semiconductor devices includes several steps such as etching and cleaning processes to form features of the semiconductor device on the wafers. The etching processes involve removal of material either directly from the wafers or from layers formed on the wafers. The etching processes leave behind residual material which is removed during the cleaning processes. However, as the geometry of semiconductor devices continues to decrease, trace amounts of contaminants, such as polymer residues remaining behind in high aspect ratio trenches and vias are becoming more and more difficult to remove.
Conventional cleaning methods use wet spray and dispense methods in which the semiconductor substrate is rotated at a relatively high spin speed (e.g., 300-1000 rpm) and high spray force (e.g., pressures up to 30 psi) is used to produce strong shear stress and turbulent flow for cleaning the sidewalls and bottoms of high aspect ratio trenches and vias. These cleaning methods, however come not without their shortcomings. Feature patterns with small pitch (e.g., less than 40 nm) can be easily collapsed by the strong shear force and the high wafer rotation. Further, the efficiency of removing residue at the bottoms and/or on the sidewall of high aspect ratio trenches and vias is very low. Furthermore, these traditional cleaning methods can be expensive in that they use high chemical consumption (e.g., about 0.5-4 L/min.).
Accordingly, a need exists for an improved cleaning method for cleaning small pitch features that do not have the shortcomings of traditional cleaning methods.

Wet cleaning method for cleaning small pitch features

Taiwan Semiconductor Manufacturing Company, Ltd.


A CD-ROM 201 for recording multi-media information of at least one page stream. Contents of each page stream are successively recorded in the storage areas in the CD-ROM 201. The following three items are shown by the page stream: a partial image list having at least one pair of partial image data which describes partial images of one screen image and display state information including X-Y coordinates, X-Y enlargement rates and a rotational angle showing the display state; control information which describes command to be executed corresponding to an input signal; time line information which describes parameters concerning time sequence processing to be executed corresponding to the control information. The display data creation unit 213 synthesizes partial images shown by the partial image list and creates display data from the partial image data and display state information in the page stream read from the CD-ROM 201, and writes the display data in the display data storage unit 209.

(1) Field of the Invention
The present invention relates to a multi-media information record device and a multi-media information playback device: the multi-media information record device records multi-media information like dynamic/still picture, graphics, sound and the like in a storage device and a recording medium provided to a data server; the multi-media information playback device plays back the multi-media information inputted via a recording medium and a transmission line.
(2) Description of the Related Art
Recently, TV game sets, electronic publications, quality karaoke sets and video on demand devices are used as read-only multi-media information playback devices. These multimedia information playback devices play back multi-media information recorded in a optical disc (CD-ROM) and a digital video disc (DVD), and also multi-media information transmitted from a data server via a network and the like.
The following explanation is about "Denshi Kamishibai-Electronic Picture-Card Show" disclosed in Japanese Laid-open Patent Application No. 5-28648, which is an example of the conventional multi-media information playback device mentioned above. FIG. 1 is an example of a data configuration of multi-media information of a conventional multi-media information playback device, by which images and sound are synchronously played back.
Data and information shown in a data area section and control information section of FIG. 1 are recorded in the recording medium like a digital disc. Control information shown in the control information section is recorded in each block composed of predetermined amount of data shown in the data area section, in which sound data and still picture data mingle. In the data area section of FIG. 1, An (n is a natural number) represents sound data: VnB and VnC represents still pictures A and B, respectively; CLUT (color look up table) represents CLUT data; NOPn represents data to which no operation is applied. In the control information section, (1) represents a data write command; (2) represents a CLUT data command; (3) represents a data display command; (4) represents an audio data command; (5) represents a command of no operation. In the screen image section, A and B represent still pictures A and B, respectively. Both of them are displayed on the screen.
Each command in the control information section is executed in order from the left side to the right side. First, audio data A1, which is digitalized sound information, is transferred to audio data memory by the control information (4), and outputted as an analog audio signal via an audio D/A (digital/analog) converter. Video data V1B is written in a predetermined position of video memory of V42B from V1B, after the write area of a still picture is designated by the control information (1). The CLUT data updates the screen image by the control information (2). Based on a CLUT memory, contents of the video memory are converted to an analog video signal by the video D/A converter, so that the contents are displayed on the screen. While the screen image and an audio signal A44 in FIG. 1 are synchronized, a still picture A can be switched to a still picture B. Although the succeeding still pictures C, D, E . . . are not shown in FIG. 1, the same processing is carried out to play back display screens and sound synchronously.
The next explanation is about a general playback processing of a multi-media information playback device. Multi-media information playback device places a line end signal and a page end signal, which are already inserted in the digitalized image signals, at the end of a scanning line (normally more than 500) and a page (contents of a screen at every 1/30 second) in the display device like Cathode Ray Tube and Liquid Crystal Display, respectively, and displays the scanning lines on the proper pages, so that image signals recorded in the recording medium like a CD-ROM and a DVD are displayed at predetermined positions on the screen of the display device. Multi-media information playback device quadruples a size of an image to be displayed on the screen by using two pixels vertically and horizontally, which forms the smallest square of four pixels, for each pixel in the display device, or by interpolation. This device also reduces an image to a quarter size, by skipping a pixel vertically and horizontally.
Also the multi-media information playback device rotates an image to be displayed on the screen by converting coordinates of each pixel using trigonometric function. As pixels are more dense in the recording medium than in the display device, predetermined adjustment is applied to the recording medium so that a proper image is displayed based on the pixel density of the display device, in time of normal display. So practically, there's no problem when an image which is stored in the CD-ROM as a small still picture is enlarged as much as possible on the screen of the display unit.
Generally, the multi-media information playback device is equipped with necessary programs to play back the multi-media information stored in the recording medium. Sometimes, a different program is already written in the multi-media information so that commands which are added to the multi-media information or which are changed are executed according to the program. In this case, signs which are similar to "[", and "]" are given to the different program which is described by the multi-media information, so that the multimedia information playback device recognizes the program to be executed.
Moreover, the multi-media information playback device displays a still picture, which does not change at all during the display time, in the display device by repeating the steps of reading and displaying the display data stored in a VRAM (video RAM) every 1/30 second or so. On the other hand, dynamic pictures are displayed by repeating the steps of updating the display data stored in the VRAM, reading and displaying the updated display data every 1/30 second or so. Therefore, one storage unit of page data which shows each screen image of the display device is about 1/30 second for dynamic pictures.
Sound which is played back synchronously with the dynamic pictures can be delimited by 1/30 second or so and stored with each page data which consists the dynamic picture. Therefore, the multi-media information playback device is equipped with a storage unit which stores sound data of at least 1/30 second so that the sound is successively played back along with the dynamic pictures.
As for DVD, details can be found in the next reference; "Movies can be stored in a hard disc; photo-electric magnetic and phase change", featured in Jul. 18, 1994 issue of "Nikkei Electronics No. 613", pages 76-81.
However, in the conventional art mentioned above, data about movies, sound, and their controlling, are stored fixedly. Specifically, in the case of image data, data for the whole screen image including the background is stored as one still picture data. Therefore, when part of the screen image is changed by, e.g., moving a part of the still picture to a different position on the screen, enlarging or reducing a part of the still picture, more still picture data coping with the change has to be stored in the CD-ROM or the DVD. So the maximum number of the still pictures which can be displayed is limited by the storage capacity of the CD-ROM and the DVD. Moreover, each time the still picture data is displayed, they have to be read from the CD-ROM and the DVD, so the number of still pictures which can be displayed per unit time is limited by the data transfer rate between the CD-ROM or the DVD and a memory.
When the audio data, the still picture data, the dynamic picture data and the control information are stored in different storage areas, the multi-media information playback device has to access different storage areas of the CD-ROM or the DVD in order to read the control information and each data used for it every time it executes the control information. This results in bad read efficiency. Also, load of the multi-media information playback device for controlling the internal memory is large since data are separately read into the memory provided to the multi-media information playback device from the different storage areas of the CD-ROM and the DVD.

Multi-media information record device, and a multi-media information playback device

Matsushita Electric Industrial Co., Ltd.


The invention relates to a drinking straw comprising:                a thermoplastic wall having an elongate container portion;        liquid permeable closures closing off the container portion;        at least one effervescent tablet disposed within the container portion such that a clearance is left between the inner side of the wall and the at least one tablet;        a hygroscopic filler disposed at both sides of the at least one tablet within the container portion.

Drinking straws are known for flavouring or changing the flavour of a liquid passing through the drinking straw. Such drinking straws can impart different flavours (e.g. cocoa, fruit, etc.) to a liquid for example milk.
There are solutions in which the flavouring agent is applied on a portion of the drinking straw and dissolves when this portion is immersed in the liquid. U.S. Pat. No. 3,615,595 describes such flavouring drinking straw. In another embodiment according to U.S. Pat. No. 3,615,595 the flavouring agent is applied on the inner wall of the drinking straw. A disadvantage of this solution is that dissolution of the flavouring agent thereby the flavouring effect is unsatisfactory.
U.S. Pat. No. 5,094,861 discloses an improved embodiment of the flavoured drinking straw of U.S. Pat. No. 3,615,595. Here, carriers of flavouring agent are inserted in the drinking straw. Embodying of this drinking straw is complicated, placing the flavouring agent in the straw requires an elaborate method while the flavouring effect is still unsatisfactory.
The solution proposed in U.S. Pat. No. 6,109,538 differs from the earlier known solutions in that a large sized flavouring object is disposed in the lumen of the drinking straw.
A common disadvantage of the aforementioned embodiments is that proportionally to the dissolution of the flavouring agent placed in the interior of the drinking straw the flavouring effect also decreases and the force required to sip the drinking straw varies significantly especially in the latter solution.
Patent application WO 9851259 is directed to an oral active agent delivery device comprising improved flow controllers.
Here, a hollow tubular member containing the active agent formulation and having a fluid passing controller is placed at one end into a fluid and at a second end into a patient's mouth. The active agent is delivered when the patient sips on the end of the tube. This improved solution prevents leakage of the active agent formulation. This document teaches a number of complicated filtering elements that can be inserted in the drinking straw. On the one hand dosing of the active agent according to this solution is complicated on the other hand it is expensive and flavouring of the active agent may be realized at most by flavouring the fluid in which the device is placed.
Effervescent tablets are also generally used in the food and medical industry. Effervescent tablets are tablets that are designed to break down rapidly when they are placed into water or another liquid, releasing carbon dioxide in the process. The rapid breakdown causes the tablet to dissolve into a frothy or fizzy solution, which property is particularly appealing to younger consumers. Such tablets are also extensively used for the administration of minerals (e.g. calcium, magnesium), vitamins and various drugs (medication).
Effervescent tablets are made by compressing the component ingredients into a dense mass, which is packaged in an airtight container or other airtight packaging since otherwise the tablet would react with humidity (water vapor) contained in the air.
The aim of the present invention is to provide a drinking straw which contains one or more effervescent tablets in order to produce a fizzy drink when a neutral liquid, such as water, is drawn through the straw. The inventors have realized that simply disposing effervescent tablets in any of the prior art filled drinking straws does not solve this problem as the effervescent tablet is not stable once the packaging of the straw is opened, however, consumers often wish to consume a beverage over a longer period of time, or use the same straw more than once. Furthermore, if the effervescent tablet sinks to the bottom of the straw immersed in the liquid then it will dissolve too fast. However, if the tablet floats in the liquid, it will rise to the top of the straw and cause inconvenient foaming in the vicinity of the user's mouth.

This patent is subject to a terminal disclaimer.


A turbine engine nozzle assembly has an upstream flap and a downstream flap pivotally coupled thereto for relative rotation about a hinge axis. An actuator linkage is coupled to the downstream flap along a forward portion thereof for actuating the upstream flaps and downstream flaps between a number of throat area conditions while permitting mode changes.

(1) Field of the Invention
The invention relates to turbine engines. More particularly, the invention relates to variable throat turbine engine exhaust nozzles.
(2) Description of the Related Art
There is well developed field in turbine engine exhaust nozzles. A number of nozzle configurations involve pairs of relatively hinged flaps: a convergent flap upstream; and a divergent flap downstream. Axisymmetric nozzles may feature a circular array of such flap pairs. Exemplary nozzles are shown in U.S. Pat. Nos. 3,730,436, 5,797,544, and 6,398,129.


One aspect of the disclosure describes a controller for a heating, ventilation, and air conditioning (HVAC) unit. In one embodiment, the HVAC controller includes an interface and a processor. In this embodiment, the interface is configured to receive a delay originating signal. In one embodiment, the processor is configured to: (1) automatically generate an offset delay value for the HVAC unit upon receipt of the delay originating signal; (2) apply the offset delay value based on an offset enabled configurable parameter; and (3) delay starting identified components of the HVAC unit based on the offset delay value.

HVAC systems can be used to regulate the environment within an enclosed space. Typically, an air blower is used to pull air from the enclosed space into the HVAC system through ducts and push the air back into the enclosed space through additional ducts after conditioning the air (e.g., heating, cooling or dehumidifying the air). Various types of HVAC systems, such as roof top units, may be used to provide conditioned air for enclosed spaces.
When two or more rooftop units (RTU), each comprising elements for heating, cooling, blower (HCB), and control, come into a condition requiring one or more HCB elements to come on from an off state, it is desired that the operation of these elements does not create an unusually high power requirement. An unwanted "power spike" may occur due to blower motors, compressors, and/or heating elements starting at the same time after a power cycle. Additionally, the power spike may occur in response to a building going into an occupied state which can cause a cooling or heating demand for multiple units. To prevent power spikes, some HVAC units may be manually programmed with a default start-up value. However, this is can be time consuming and require coordination with other HVAC units at a particular location.

Staggered start-up HVAC system, a method for starting an HVAC unit and an HVAC controller configured for the same


A device for the post-treatment of the exhaust gas of an internal combustion engine comprises a conduit defining a passage for the flow of the exhaust gas and, from upstream to downstream of the conduit, an injector arranged to inject a reducing agent into the flow passage, and a purifying member. The injector is heated to heat the reducing agent prior to injection. The device further comprises a heating element arranged between the injector and the purifying member.

An exhaust gas post-treatment device is typically arranged in an exhaust line of an internal combustion engine. The function of the device is to reduce nitrogen oxide (NOx). To do this, such a device mixes a reducing agent, typically ammonia or an aqueous urea solution (AUS 32, DEF) with the exhaust gases, and treats the mixture using a purification member such as a catalyst or a selective catalytic reduction (SCR) substrate.
It is known to use a purification member to reduce the nitrogen oxide present in exhaust gasses.
For the purification member to be able to carry out a chemical reaction to reduce the nitrogen oxide, it must be supplied with exhaust gas mixed with a reducing agent.
To do this, a reducing agent injector is used, which is capable of injecting the reducing agent into a pipe where the exhaust gas flows. A mixer that homogenizes the exhaust gas with the reducing agent is also used. This is done upstream of the catalyst.
In order for the purification member to effectively reduce the nitrogen oxide with a good conversion efficiency, it must be at a high temperature, called the operating temperature, of at least 220° C.
In a steady state, this operating temperature of the purification member is maintained by the heat supplied by the hot exhaust gases from the engine and by the heat produced by the chemical reduction reaction.
In certain transitional phases of operation, during start-up, for example, the purification member is considered cold, i.e. at a temperature lower than that required to establish the chemical reduction reaction of the nitrogen oxide. Therefore, it is known to use a heating element capable of heating the exhaust gases and the purification member. Such a heating element is active during this transitional phase towards the steady state, so that this transitional phase is as short as possible and the purification member quickly reaches its operating temperature.
Improvements making it possible to further reduce the duration of the transitional phase of heating and reaching the active temperature of the purification member are still being sought.


A compressor including a hollow housing having a suction chamber, a discharge chamber, and a crank chamber formed therein. A first fluid flow path provided within the compressor facilitates a flow of the working fluid from the crank chamber to the suction chamber. A second fluid flow path provided within the compressor facilitates a flow of a mixture of the working fluid and a lubricating fluid from the crank chamber to the suction chamber, wherein the second fluid flow path is selectively opened and closed by an annular sleeve.

Presently known compressors used in refrigeration and air conditioning systems such as variable displacement swash plate compressors, for example, typically include a lubricating mist suspended in a gaseous refrigerant medium. Such compressors also include a first path that provides refrigerant communication between a crank chamber and a discharge chamber, and a second path that provides refrigerant communication between the crank chamber and a suction chamber. During operation of the compressor, the oil mist lubricates moving parts of the compressor. However, oil that remains suspended in the refrigerant as it travels throughout the refrigeration and air conditioning system can minimize a performance and an efficiency the refrigeration and air conditioning system.
To combat these problems, an oil separator is added to the refrigeration and air conditioning system. One type of oil separator is typically positioned in the refrigeration and air conditioning system between the compressor and a condenser. The oil separator functions to separate the suspended oil from the gaseous refrigerant, so that the oil is maintained in the compressor and introduced into the suction chamber. This type of oil separator requires added package space in the discharge chamber or a separate external component attached to the compressor.
A second type of oil separator utilizes the crank chamber to store the oil, so that the oil is maintained in the compressor and not introduced into the suction chamber. However, the addition of this type of oil management system in the refrigeration and air conditioning system does not address other operating conditions of the compressor which may lead to performance and durability issues such as liquid-fill start-up, high-temperature operation, or inadequate piston lubrication at high speeds caused by oil logging in the crank chamber of the compressor, for example.
It would be desirable to produce a variable displacement compressor wherein a performance, an efficiency, and a durability of the compressor are maximized, and a cost of manufacture, a weight, a package size, and an assembly time thereof are minimized.

Halla Visteon Climate Control Corporation


A pre-preg product, such as a tape or sheet suitable for forming a composite having reinforcement fibers and a liquid crystal thermoset (LCT) precursor is provided. Further aspects of the invention are directed to a method for preparation of the pre-preg product and to composite products based on the pre-preg product.

Reinforced composite products are typically based on reinforcement fibers (e.g. carbon fibers) and a matrix material (e.g. epoxy resin, thermoplastics) used to bind the fibers. To facilitate the production of composite products, pre-impregnated products (also referred to as pre-preg products) are used as intermediate goods. The pre-preg products comprise the fibers and a partially cured matrix material. As such the pre-preg product is typically shapeable (optionally after heating and applying pressure) to follow the contours of the mold or mandrel that is used to make the composite product. The composite materials are typically formed by a manual or automated lay-up process—laying out of the pre-preg product in a mold—and subsequent heating possibly under pressure, vacuum or reduced pressure or both such that the matrix material wets-out the fabric and further cures. Use of the pre-preg product thus greatly facilitates the production of composite materials.
However, known pre-preg based composite products also face drawbacks. The bonding of the reinforcement fibers and the matrix material at their interface is rather weak. Efforts to strengthen this bonding include adding "sizing" to the outer surfaces of the reinforcement fibers to promote adhesion including the formation of chemical bonds (covalent, ionic, hydrogen and the like) between the fibers and the surrounding matrix material. However, despite these efforts, the performance of the composite products is still limited. For example, by exposing the composite products to a range of temperatures, on subsequent fracturing the product one typically observes "fiber pull-out" that is characteristic of a weak bond between the fiber and the matrix.
The phenomenon of a weakened interfacial bonding of the known composite materials may be caused by a mismatch in the respective coefficients of thermal expansion (CTE) of the fibers and the surrounding matrix material. In case the CTE of, for instance, the matrix material is sufficiently higher than that of the fibers this results in an interfacial stress. Thus on cooling and heating the composites products, very high mechanical stresses may result from the CTE mismatch weakening the adhesion between the reinforcement and the matrix.
It is desirable to have pre-preg products and resulting composite products that suffer less of the above-mentioned drawbacks and have improved mechanical properties with respect to the composite products of known pre-preg products.

Pre-preg and composite products comprising fibers and a liquid crystal thermoset precursor


Under the present invention, a semiconductor chip is electrically connected to a substrate (e.g., organic, ceramic, etc.) by an interposer structure. The interposer structure comprises an elastomeric, compliant material that includes metallurgic through connections having a predetermined shape. In a typical embodiment, the metallurgical through connections electrically connect an under bump metallization of the semiconductor chip to a top surface metallization of the substrate. By utilizing the interposer structure in accordance with the present invention, the problems associated with previous semiconductor module designs are alleviated.

1. Field of the Invention
The present invention generally relates to a semiconductor module and method for forming the same. Specifically, the present invention provides a semiconductor module having an interposer structure with metallurgical through connections for electrically connecting a semiconductor chip to a substrate.
2. Related Art
In the production of semiconductor modules, a semiconductor chip is often connected to a carrier such as a substrate. Typically, the connection is made using controlled collapse chip connection (C4) technology whereby solder bumps are used to join the two components together. Unfortunately, several problems emerge with the existing technology. First, the semiconductor chip usually has a different coefficient of thermal expansion (CTE) than the substrate. Given the close physical proximity of the semiconductor chip to the substrate, the solder bumps often deteriorate as the module heats up and cools off. This is especially the case with larger die sizes.
In addition, ceramic substrates (if used) are generally non-planar, which can become a gating factor as the substrate X-Y dimensions increase. With shrinking pitch, there is a need to shrink C4 bump dimensions to avoid nearest neighbor shorting. However, a small C4 bump height results in a larger percentage of variation across the grid of bumps. Further, when the interconnections at the chip to substrate level migrate to a lead-free system, there will be no solder temperature hierarchy between first and second level interconnections, thus, creating an increased strain on the C4 structure due to higher temperatures of subsequent assembly operations. Still yet, current methods of depositing and joining C4 interconnections are expensive and involve the use of specific under bump metallization (UBM), which might have to be customized. Also, the UBM may need additional layers such as diffusion barriers and chip encapsulants so that it may endure a melting or partially melting C4 structure that reacts with the UBM during subsequent assembly operations.
In view of the foregoing, there exists a need for an improved semiconductor module and method for forming the same. Specifically, a need exists for a semiconductor chip to be electrically connected to a substrate or the like so that the above concerns are alleviated.

Semiconductor module with improved interposer structure and method for forming the same

International Business Machines Corporation


This system of detecting endemic or epidemic diseases includes an analysis center connected by a computer network to a number of health booths in which health data can be measured and stored with the conditions under which the measurements are taken. The analysis center generates an alert automatically if an endemic or epidemic disease is detected.

The field of the invention is that of detecting endemic or epidemic diseases.
The term epidemic refers to the rapid onset of a pathology in a given place during a given time period, not necessarily with any notion of contagion.
An endemic disease, characterized by its habitual presence in a geographical area, can develop into an epidemic if environmental conditions allow.
At present, in an epidemic, doctors send the relevant health authorities information on the increase in the number of cases in an area during a given period.
Doctors are sometimes designated to track a particular pathology. This applies in particular in France for detecting influenza.
Consequently, detection of the epidemic by the health authorities requires collecting numerous case studies and long delays, to the extent that, when an alert is finally issued, the disease has broken out and many people have already become infected.
It is therefore not possible at present to intervene in a preventative manner as soon as an epidemic is suspected.

System and a method for detecting an endemic or an epidemic disease


A turbine blade includes an airfoil having pressure and suction sidewalls spaced apart between opposite leading and trailing edges and interconnected by a plurality of partitions to define first and second independent cooling circuits therein. The cooling circuits have corresponding inlets in a dovetail of the blade and extend through a platform of the blade and through the airfoil to its tip. A common discharge chamber is disposed below the airfoil tip and includes a plurality of outlet holes for discharging cooling air from the circuits.

The present invention relates generally to gas turbine engines, and, more specifically, to turbine blade cooling.
In a gas turbine engine, air is pressurized in a compressor and mixed with fuel in a combustor for generating hot combustion gases. Energy is extracted from the combustion gases in several rows or stages of turbine blades which power the compressor, and power a fan in a turbofan aircraft engine application, or power an external drive shaft in marine and industrial applications.
The high pressure turbine (HPT) includes one or more stages which first receive the hot gases from the combustor, and are typically internally cooling by channeling therethrough a portion of pressurized air bled from the compressor. Each turbine blade includes an airfoil extending radially outwardly from an integral platform and supporting dovetail. The airfoil is hollow and includes various cooling circuits therein having inlets at the base of the dovetail for receiving the bleed or cooling air.
Turbine blade cooling is crowded with various configurations of the cooling circuits therein tailored for accommodating the varying heat loads from the combustion gases over the opposite pressure and suction sides of the airfoil and between the axially opposite leading and trailing edges and the radially opposite inner root and outer tip. Each airfoil typically includes rows of film cooling holes through the sidewalls thereof which discharge the spent cooling air in corresponding thermally insulating films over the external surface of the airfoil.
The internal cooling circuits include radial channels or legs axially separated from each other by corresponding partitions or bridges which extend radially along the span of the airfoil. Dedicated cooling legs may be used directly behind the leading edge and directly in front of the trailing edge for specialized cooling thereof. The midchord region of the airfoil may also include dedicated cooling channels typically in the form of serpentine circuits having multiple radial legs which alternate the radial flow of the cooling air between the root and tip of the airfoil.
One or more serpentine cooling circuits may be used in each airfoil either combined with or independent from the cooling legs along the leading and trailing edges. The cooling circuits may also include various forms of short ribs or turbulators along the inner surface of the pressure and suction sidewalls for tripping the cooling air to increase the heat transfer thereof.
Turbine blades found in gas turbine engines are subject to the local environment in which the engine is operated. And, minimum weight of the engine is typically a paramount design objective, particularly for aircraft engines, which limits the size and complexity of the engine and associated equipment when integrated into the aircraft.
For example, operating a gas turbine engine in a dusty environment will carry dust particles through the compressor, which dust particles are also entrained in the cooling air used for the turbine blades. The cooling circuits of the turbine blades are relatively small, with small features therein, including the various rows of film cooling holes. A typical film cooling hole is about 10–15 mils in diameter and is susceptible to dust accumulation during operation.
Accordingly, it is common practice to include relatively large dust holes in the airfoil tip to permit entrained dust particles to readily exit the airfoil and minimize dust accumulation therein or in the smaller film cooling holes. A typical dust hole is about 25 to 60 mils in diameter which is several times the diameter of the small film cooling holes.
Furthermore, the tip region of the typical turbine blade also requires dedicated cooling to ensure its durability and long useful life. The typical airfoil tip is a thin flat plate which closes the radially outer end of the airfoil, and typically includes short extensions of the pressure and suction sidewalls in the form of squealer or tip ribs. The squealer ribs define an outwardly open tip cavity in which the dust holes are located for discharging the cooling air and any dust from the airfoil. The tip also typically includes several smaller cooling holes for cooling the tip itself and the adjacent squealer ribs.
Since the dust holes are typically much larger than the film cooling holes and the tip cooling holes, they themselves have little cooling efficacy and correspondingly increase the flowrate of the cooling air which must be channeled through each airfoil. Any such excess air channeled through the airfoil correspondingly decreases the overall efficiency of the gas turbine engine since the bleed air is not used in the combustion process.
Compounding this problem of the large dust holes is the typical need for multiple large dust holes in an individual turbine blade for multiple independent cooling circuits used therein. Since the pressure distribution of the combustion gases varies over the external surface of the airfoil between the leading and trailing edges and along the pressure and suction sides of the airfoil, independent cooling circuits are typically provided inside each airfoil and fed with a common pressure bleed air.
As the cooling air is channeled through the independent circuits in the airfoil it experiences pressure losses or drops between the inlet of each cooling circuit and the various outlets thereof, such as the film cooling holes along the airfoil sidewalls, trailing edge holes along the thin trailing edge, and the tip cooling holes in the airfoil tip. Each circuit and its various outlet holes are specifically designed for maintaining a suitable backflow margin at each of the outlet holes to prevent ingestion of the hot combustion gases into the airfoil during operation. Backflow margin is a primary design objective in configuring the various cooling circuits inside each turbine blade.
Accordingly, it is desired to provide an improved turbine blade for minimizing air discharge through the dust holes.


A method for generating dynamic images applied to a computer device includes obtaining a depth image of a static image. A preset region of the depth image is converted into a histogram and an average depth value D is calculated therefrom. A first depth value d1 and a second depth value d2 are determined from the histogram according to the average depth value D. M numbers of third depth values d3 are calculated according to the first depth value d1 and the second depth value d2. Once M number of blurred images are generated according to each M number of third depth values d3, the M number of blurred images are played back according to a magnitude of the third depth value d3 corresponding to each of the M number of blurred images.

This section is intended to provide a context for embodiments of the invention set forth in the claims. The description herein is not admitted to be prior art as it is included in this section.
There are currently many ways to obtain depth images. For example, a depth-sensing camera may be used for photographing depth images. In another example, the depth image can be obtained by establishing a spatial model, executing edge detection, calculating vanishing points, or the like on a static image. However, there are few solutions that utilize depth images to obtain a dynamic image.

Computer device and method for generating dynamic images


In a process for producing mono-cycloalkyl-substituted aromatic compound, benzene and cyclic monoolefin are contacted with a catalyst under alkylation conditions to produce an effluent containing mono-cycloalkyl-substituted aromatic compound. The catalyst comprises a molecular sieve.

Phenol is an important product in the chemical industry and is useful in, for example, the production of phenolic resins, bisphenol A, ε-caprolactam, adipic acid, and plasticizers.
Currently, the most common route for the production of phenol is the Hock process. This is a three-step process in which the first step involves alkylation of benzene with propylene to produce cumene, followed by oxidation of the cumene to the corresponding hydroperoxide and then cleavage of the hydroperoxide to produce equimolar amounts of phenol and acetone. However, the world demand for phenol is growing more rapidly than that for acetone.
Thus, a process that uses higher alkenes instead of propylene as feed and coproduces higher ketones, such as cyclohexanone, rather than acetone may be an attractive alternative route to the production of phenols. For example, there is a growing market for cyclohexanone, which is used as an industrial solvent, as an activator in oxidation reactions and in the production of adipic acid, cyclohexanone resins, cyclohexanone oxime, caprolactam and nylon 6.
It is known from U.S. Pat. No. 5,053,571 that cyclohexylbenzene can be produced by contacting benzene with hydrogen in the presence of a catalyst comprising ruthenium and nickel supported on zeolite beta and that the resultant cyclohexylbenzene can be processed in two steps to cyclohexanone and phenol. The alkylation reaction is carried out at a liquid hourly space velocity (LHSV) ranging from 1 to 100, a reaction pressure ranging from 100 to 1000 kPa, a hydrogen feed rate ranging from 0.2 to 6 mole per mole of feedstock per hour, and a reaction temperature ranging from 100 to 300° C.
In addition, U.S. Pat. No. 5,146,024 discloses that benzene can be reacted with hydrogen in the presence of carbon monoxide and a palladium-containing zeolite X or Y to produce cyclohexylbenzene, which can then be converted in high yield to phenol and cyclohexanone by autooxidation with subsequent acid treatment. The alkylation reaction is carried out at a liquid hourly space velocity (LHSV) of the benzene feed of about 1 to about 100 hr−1, a total reaction pressure of about 345 to about 10,350 kPa, a molar ratio of H2 to benzene of about 0.1:1 to about 10:1, a molar ratio of carbon monoxide to H2 of about 0.01:1 to about 0.3:1, and a temperature of about 100 to about 250° C.
Further, U.S. Pat. No. 6,037,513 discloses that cyclohexylbenzene can be produced by contacting benzene with hydrogen in the presence of a bifunctional catalyst comprising a molecular sieve of the MCM-22 family and at least one hydrogenation metal selected from palladium, ruthenium, nickel, cobalt and mixtures thereof. The catalyst may also contain a binder and/or matrix and in the Examples the catalyst is produced by impregnating an extrudate of the MCM-22 family molecular sieve and an alumina binder with an aqueous solution of a salt of the hydrogenation metal using incipient wetness impregnation. The '513 patent also discloses that the resultant cyclohexylbenzene can be oxidized to the corresponding hydroperoxide and the peroxide decomposed to the desired phenol and cyclohexanone.
According to the present invention, it has now been found that the benzene may be alkylated with a cyclic monoolefin using an alkylation catalyst comprising a molecular sieve to produce a mono-cycloalkyl-substituted aromatic compound.

Process for producing a monocycloalkyl-substituted aromatic compound


A multilayer composite contains a gel coat layer, a laminate layer, and a barrier layer disposed between the gel coat and the laminate layer. The laminate contains from 40–80% by weight paste and from 20–60% by weight reinforcing fibers. The barrier coat also comprises a cured polyester resin, and contains reinforcing fibers shorter than those in the laminate layer. The barrier layer has sufficient flexibility to avoid cracking during demolding and handling. Preferably, the barrier layer exhibits an elongation at break of more than 1%, and more preferably about 2% or more. The resin of the barrier layer can contain up to about 25% by weight of the resin of an isophthalic acid based polyester resin. The composites can be made using an open tool molding process.

Light-weight composites are commonly used in manufacturing cars with lighter weight and improved fuel economy. The composites typically contain a structural layer made of a fiber reinforced cured polyester resin. The structural layer may be produced by compression molding. Protective coatings may be added after demolding to give the composites a finish and surface appearance appropriate for the end use. The composites are currently produced using expensive steel tools and technologically advanced compression molding machines.
Alternative methods of producing light weight composites can be utilized. Open tool molding is an example of such a method. To obtain a reasonable surface appearance, the process requires the use of a gel coat followed by a supporting composite laminate. In the process, a mold surface is first cleaned, a mold release coating is optionally applied, and a layer of a gel coat is applied and partially cured. A laminate is then applied to the gel coat layer, and the laminate and gel coat are cured to form a unitary part having a surface defined by the cured gel coat. Molded parts can be produced by this method to have a finish bearing any desired color originally carried by the gel coat.
In some applications, in order to obtain a smooth surface finish on the gel coat and reduce the extent of fiber read through, a barrier coat may be applied between the gel coat and the laminate. It would be desirable to produce low density, flexible barrier coats for such an application.


An armor system is provided for installation in a vehicle having a body structure. The armor system includes frame members joined to form a framework having openings. The framework is joined to the inside of the body structure of the vehicle. Brackets are joined to the frame members. A number of armor plates are provided, which are configured to cover the openings of the framework. Each plate is joined to at least one of the brackets, so that gaps between the armor plates are overlapped by the frame members.

1. Field of the Invention
The present invention relates to a vehicle armor system having a armored panels connected to a frame that is separate from the vehicle body structure.
2. Related Art
Conventional techniques for armoring street vehicles involve removal of the interior fittings, measuring the interior dimensions, fabricating a set of armor plates, and individually attaching the armor plates to the inside of the vehicle body structure. Armoring may be installed in various vehicle types, such as, for example, automobiles, vans, pickup trucks, and sport-utility vehicles (SUVs), and military vehicles, e.g., Jeeps, Humvees, etc. A fitting and installation for a typical vehicle may take 12 –14 weeks. Generally speaking, the armor must be assembled in the vehicle, rather than being preassembled, which increases the time the vehicle must be kept in the installation facility.
Conventional techniques are based on a weldment methodology or mechanical attachment, i.e., they rely on welding or attaching armor plates to an existing body structure of a vehicle, rather then providing an armor system having its own independent frame structure. However, the welding of armor plates directly to a vehicle body structure does not provide structural integrity independent of the vehicle structure, and therefore does not provide additional protection to vehicle occupants in the event of a collision or rollover. Nor does this approach facilitate preassembly of armor components outside of the vehicle.
Moreover, these conventional techniques do not include structural components designed to allow for movement of the armor plates, to absorb the kinetic energy of a ballistic impact or blast force. Rather, as discussed above, the armor plates are directly attached to the vehicle body structure, e.g., by welding or fasteners. Such static configurations increase the probability of failure of the armor components, such as ballistic penetration of the armor plate or detachment of the armor plate or fasteners from the vehicle body structure.
Conventional welding techniques include gas metal arc welding (GMAW), which is frequently referred to as "MIG" welding. MIG welding is a commonly used high deposition rate welding process in which wire is continuously fed from a spool. In gas tungsten arc welding (GTAW), which is frequently referred to as "TIG" welding, an arc is formed between a non-consumable tungsten electrode and the metal being welded. Gas is fed through the welding torch to shield the electrode and molten weld pool. In flux cored arc welding (FCAW), as in MIG welding, wire is continuously fed from a spool. Self-shielding flux cored arc welding wires or gas shielded welding wires may be used.
Another conventional welding technique is shielded metal arc welding (SMAW), which is frequently referred to as "stick" or covered electrode welding. In stick welding, the flux covering the electrode melts during welding and forms gas and slag to shield the arc and molten weld pool. The slag is chipped off the weld bead after welding. Resistance spot welding (RSW), resistance seam welding (RSEW), and projection welding (PW) are commonly used resistance welding processes. Resistance welding uses the application of electric current and mechanical pressure to create a weld between two pieces of metal. In these techniques, weld electrodes conduct the electric current to the two pieces of metal as they are forged together. Brazing is a joining processes where parts are joined without melting the base metals, using filler metals melt above 840° F.
Armor plates may be fabricated from heat-treated, dual-hard steel, which has different hardness properties from one side to the other. The "hard" side of the dual-hard steel must be installed to face outward from the vehicle, i.e., must be the impact side of the plate. However, welding must be done on the "soft" side of the dual-hard steel, to avoid weld failure. Consequently, fasteners often must be used to attach the dual-hard steel plates to the vehicle body structure in conventional armoring techniques. Such fasteners may become secondary projectiles during a ballistic or blast event.


This invention relates to novel 8-aza-bicyclop[3.2.1]octane derivatives useful as monoamine neurotransmitter re-up-take inhibitors. In other aspects the invention relates to the use of these compounds in a method for therapy and to pharmaceutical compositions comprising the compounds of the invention.

WO 97/30997 (NeuroSearch A/S) describes tropane derivatives active as neurotransmitter re-uptake inhibitors.
However, there is a continued strong need to find compounds with an optimised biochemical profile as regards the activity on reuptake of the monoamine neurotransmitters serotonin, dopamine and noradrenaline, such as the ratio of the serotonin reuptake versus the noradrenaline and dopamine activity.

8-aza-bicyclo (3.2.1) octane derivatives and their use as monoamine neurotransmitter re-uptake inhibitors


A vacuum sealer includes a base member formed with a hollow platform having a first sealing ring secured on the platform and a support. A drawing hole is defined in the top of the platform within the first sealing ring. A heating plate is laterally secured on a front edge of the platform. A pumping device is mounted on the support for drawing out the air in a plastic bag that is purposed to be sealed. A transparent presser has a rear side pivotally mounted on the platform and selectively pressed on the top of the platform. A second sealing ring is secured on a bottom of the presser and fully airtightly abuts the first sealing ring when the presser is pressed on the platform.

1. Field of the Invention
The present invention relates to a sealer, and more particularly to a vacuum sealer used for a plastic bag.
2. Description of Related Art
A conventional vacuum sealer usually uses a flexible tube inserted into the plastic bag to draw out air from the plastic bag before sealing. However, the flexible tube is inconveniently operated and the conventional vacuum sealer has two steps for sealing the plastic bag. One is the drawing process and the other is the hot-melt sealing process. As a result, an improved conventional vacuum sealer is marketed to solve the above problem. The improved conventional vacuum sealer has two hoods pivotally mounted to each other to clamp the plastic bag for drawing out the air in the plastic bag and sealing the plastic bag by hot-melt. However, the operator can not see the situation of the plastic bag after being clamped by the two hoods and confirm the drawing step is truly operated. As a result, the operator needs to check the sealed plastic bag to ensure well sealing the plastic such that the work effect is reduced.
The present invention has arisen to mitigate and/or obviate the disadvantages of the conventional vacuum sealers.


A process in the fabrication of wiring patterns on ceramic or polymeric substrates precisely controls the cross-sectional dimensions of the metallization that constitute the wiring patterns. A single etch process defines thin film conductors on a substrate without loss to the conductor cross-section and provides enhanced thin film design flexibility. The zero undercut etch process uses photoresists defining the metal patterns to completely protect the metal patterns during the subetch.

1. Field of the Invention
The present invention generally relates to manufacturing processes for the production of thin film printed circuits as used for the interconnection of semiconductor devices, integrated circuits (ICs) and the like and, more particularly, to a zero undercut etch process that eliminates restrictions on the thickness and width of a photo developed image that can be etch defined.
2. Description of the Prior Art
Multilayer ceramic (MLC) is one technology that is widely used for fabricating dielectric substrate carriers for integrated circuits, semiconductor devices and other electronic components. As the packaging of electronic circuits and components has become increasingly dense, the wiring patterns have become finer and finer. However, a problem in the control of cross-sectional dimensions of the metallization has been encountered with the manufacture of ever finer wiring patterns. Specifically, conventional processes of forming the wiring patterns results in an undercut of the metallization, resulting in a significant decrease in the desired cross-sectional dimensions. One approach to a solution to this problem has been to form the wiring patterns "oversized" to compensate for the undercut. This has not been satisfactory as only an approximate dimension can be assured in the resulting wiring pattern.

International Business Machines Corporation


An apparatus for forming an image using an electrophoretic particle suspension containing media including: a transitioner for sufficiently lowering a viscosity of the suspension to facilitate mobility of at least some of the electrophoretic particles; and, imaging electrodes for selectively providing an imaging electric field associated with the image to be formed and positioned with respect to the transitioner such that the imaging electric field impinges upon the lowered viscosity suspension; wherein, the imaging electric field is sufficient to cause select ones of the electrophoretic particles in the lowered viscosity suspension to migrate depending upon the image to be formed. The media includes a plurality of substrates defining an interior hollow including an electrophoretic particle containing, phase-transitional suspension suitable for enabling migration of the electrophoretic particles responsively to an applied electric field in a first state and substantially impeding migration of the particles in a second state.

Information reproduction has matured from manual reproduction using handwriting and hand written drawings to printed documents. For example, printing presses and then printing devices such as dot matrix, laser and inkjet technology printers have matured significantly. Nonetheless, each of these technologies typically uses media, that once imaged, or is used to display information, it is not suitable for re-use.
It is believed to be desirable to provide a portable media, which may be used to display information and then re-used, as well as an apparatus for imaging such media.

Method, apparatus and media for displaying information


In accordance with the foregoing objects and advantages, the present invention provides a fabrication device that may be used during the grinding operation of the fabrication process. The fabrication device comprises a socket plate that includes a plurality of cavities formed therein that correspond in position and number to the solder (or other conductive material) bumps formed on the front surface of a product wafer.

1. Field of Invention
The present invention relates generally to semiconductor wafers, and more particularly to the devices and methods for fabricating wafers having solder bumps formed on one surface thereof.
2. Background
The desire for smaller, thinner, lighter electronic components has driven the semiconductor packaging industry to develop tools and processes for wafer backside thinning by grinding and polishing before the wafers are diced into chips. As packaging assemblers develop more sophisticated multi-chip packages containing multiple die which are often stacked in a 3D assembly, the need for thinner die becomes more acute.
Wirebond stacked die packages may contain die thinned to less than 200 um, with even more aggressive thinning anticipated in the future. Because the surface of a wafer being processed for wire bonded interconnects is planar, the mechanical process of backside grinding and surface finishing is capable of removing greater than 90% of the original wafer thickness without breakage or lattice damage. These techniques have enabled the manufacture of extremely thin stacked wirebond package assemblies for advanced electronics.
With increasing semiconductor complexity comes the desire for greater signal bandwidth, which requires that the semiconductor chips have higher interconnect density from the die to the module substrate, or in the case of stacked assemblies, from die to die. Higher performance interconnects are achieved by switching from wirebond to solder bump connections. However, since the solder bumping process must be done with unthinned wafers, the 30-100 um solder bump feature creates significant challenges to obtain wafer backside thinning comparable to what is achieved today for wirebond wafers.
Thinning of wafers with solder bumps is done today by using a compliant tape on the wafer front side to conform around, cushion, and protect the solder bumps during the grinding process. This is reasonably effective for final wafer thicknesses greater than 300 um. For thinner dimensions, a tape with higher compliancy allows for replication of the underlying bump features especially in dissimilar pattern density regions of the bumps. Conversely, a tape with lower compliancy may also reflect pattern density differences as well as posing difficulty in removal. These issues have prevented the packaging industry from embracing thin single and multi-chip stacked die packaging for solder bumped wafers.
3. Objects and Advantages
It is therefore a principal object and advantage of the present invention to provide a fabrication device and method for permitting the effective thinning of bumped wafers through a grinding operation.
It is another object and advantage of the present invention to provide a fabrication device that permits backside grinding of bumped wafers to thinner dimensions than is presently feasible.
It is a further object and advantage of the present invention to provide a fabrication device that is easily adapted to existing fabrication processes.
Other objects and advantages of the present invention will in part be obvious, and in part appear hereinafter.

System and device for thinning wafers that have contact bumps


A method for fabricating a semiconductor device includes forming a gate dielectric layer over a substrate; forming a metal containing layer, containing an effective work function adjust species, over the gate dielectric layer; forming an anti-reaction layer over the metal containing layer; increasing an amount of the effective work function adjust species contained in the metal containing layer; and forming, on the substrate, a gate stack by etching the anti-reaction layer, the metal containing layer, and the gate dielectric layer.

1. Field
Exemplary embodiments of the present invention relate to a semiconductor device, and more particularly, to a semiconductor device with dual work function gate stacks and a method for fabricating the same.
2. Description of the Related Art
When a transistor is scaled down to improve performance, gate leakage increases while the thickness of a gate dielectric layer is reduced. In order to solve such a problem, the gate dielectric layer has been replaced with a high-k material having a larger dielectric constant than that of SiO2. The high-k material may include metal oxide containing hafnium, zirconium or the like. As the high-k material is adopted, a new problem, that is, a Fermi level pinning effect has occurred. The Fermi level pinning effect is caused by the contact between the high-k material and a polysilicon gate electrode. The Fermi level pinning is a basic characteristic at the boundary between the polysilicon gate electrode and the metal oxide, and increases the threshold voltage of a transistor.
In the transistor, the gate electrode requires a threshold voltage (Vth) for conducting a channel. According to processes of a CMOS device, both of an N-channel transistor and a P-channel transistor may be fabricated. The threshold voltage is influenced by an effective work function. In general, a gate stack includes a gate dielectric layer and a gate electrode, and the gate dielectric layer and the gate electrode determine an effective work function of the gate stack. Furthermore, a gate process may have an effect on the effective work function of the gate stack. The effective work function is distinguished from a work function. The effective work function of the gate stack is a parameter which may be adjusted by the material of the gate dielectric layer, the material of the gate electrode, and the gate stack formation process. On the other hand, the work function of the gate electrode is a specific property of a material. In general, the work function of a specific material (that is, metal layer) corresponds to the value of energy required for discharging electrons within the material into vacuum from atoms of the material, when the electrons are positioned at the Fermi level at the initial stage. The work function has a unit of eV. In general, a gate electrode of an N-channel transistor has an N-type work function lower than a midgap work function, and a gate electrode of a P-channel transistor has a P-type work function higher than the midgap work function.
Recently, in order to solve the Fermi level pinning issue, a gate stack including a high-k material and a metal gate electrode has been adopted. However, during a process for fabricating a CMOS device, it is difficult to form a metal gate electrode having an N-type work function or a P-type work function which requires a threshold voltage suitable for each transistor. Furthermore, although the metal gate electrode having a work function suitable for each transistor is formed, the effective work function of the gate stack may be varied due to various factors caused by the material of the gate dielectric layer contacted with the metal gate electrode and the gate stack formation process (for example, etch process and high-temperature thermal process). Furthermore, the CMOS device may be fabricated by using dual work function metal gate electrodes. In this case, one of the dual work function metal gate electrodes needs to be selectively removed. Accordingly, substantial complexity increases, and the fabrication cost increases.

Semiconductor device with dual work function gate stacks and method for fabricating the same


A display securely decrypts an encrypted image signal. Pixels are disposed between the display substrate and cover in a display area, and provide light to a user in response to a drive signal. Control chiplets disposed between the display substrate and cover in the display area are each connected to one or more of the plurality of pixels. Each receives a respective control signal and produce respective drive signal(s) for the connected pixel(s). A decryption chiplet is disposed between the display substrate and cover. It includes means for receiving the encrypted image signal and a decryptor for decrypting the encrypted image signal to produce a respective control signal for each of the control chiplets.

Content to be shown on a display is often provided in encrypted form to reduce the risk of piracy (unauthorized duplication). For example, the High-bandwidth Digital Content Protection System (HDCP) is a commonly-used standard for encrypting video data by exclusive-ORing (XORing) the data with a pseudo-random bit stream (PRBS)—see Digital Content Protection, LLC, High-bandwidth digital content protection system, Revision 1.4, Jul. 8, 2009. Although HDCP protects data in transit between devices (e.g., between a DVD player and a TV using HDMI, the High-Definition Multimedia Interface), at some point within a display the data must be decrypted and fed to the pixels. Attackers (e.g., pirates) who can gain access to the data after the point of decryption can make a full pirate copy. Moreover, the master key for HDCP has recently been publically disclosed, so HDCP-encrypted content can now be freely decrypted by an attacker—see Mills, Elinor, "Intel: Leaked HDCP copy protection code is legit." Sep. 16, 2010.
Flat-panel displays are commonly employed to display content transported in encrypted form. Liquid-crystal displays (LCD), plasma displays (PDP) and electroluminescent (EL) displays are examples of flat-panel displays. EL displays can be made from various emitter technologies, including coatable-inorganic light-emitting diode, quantum-dot, and organic light-emitting diode (OLED). EL emitters use current passing through thin films of EL material to produce light. EL displays employ both active-matrix and passive-matrix control schemes and can employ a plurality of pixels. Each pixel can include an EL emitter; drive transistors for driving current through the EL emitter are also provided on the display. The pixels are typically arranged in two-dimensional arrays with a row and a column address for each pixel, and having a data value associated with the pixel. Pixels can be of different colors, such as red, green, blue and white.
Initially, display systems used separate decryption ICs located off the display substrate. However, the outputs of the decryption ICs on such systems can readily be probed to pirate the content.
FIG. 9 shows a more recent method of protection against piracy employed in a conventional EL display. Display substrate 400 supports EL emitter 50 under cover 408. Cover 408 can be glass, metal foil or other materials known in the art. Seal 409 is used to prevent moisture from entering sealed area 16, the space between the substrate and the cover, as EL emitter 50 is damaged by moisture. Seal 409 can include an adhesive and desiccant as known in the art. Sealed area 16 includes display area 15, in which all of the EL emitters 50 are located. EL emitter 50 receives current through metal layer 403 from driver IC 420 via solder ball 421, or a wire bond (not shown) in pad-up configurations as known in the art. Driver IC 420 can be a chip-on-glass (CoG), flip-chip or BGA (Ball Grid Array) package, or a CSP (chip-scale package). Driver IC 420 is outside of the display area 15, and outside of sealed area 16. Glob-top 422, which can be an epoxy or other molding compound, covers driver IC 420 to make it difficult to remove driver IC 420 from display substrate 400. Driver IC 420 receives encrypted data and provides decrypted data to EL emitter 50. Glob-top 422 can be extended over metal layer 403 up to seal 409 to provide additional security. U.S. Patent Application Publication No. 2006/0158737 by Hu et al., paragraph 44, is an example of a related scheme. U.S. Pat. No. 6,442,448 by Finley et al., cols. 18-19, has further discussion of using epoxy to protect security-sensitive components. U.S. Patent Application Publication No. 2005/0201726 by Malcolm et al., paragraphs 54 and 81, also describes alternative ways of protecting transmissions of data inside a device.
However, glob-top is frequently used in the electronics industry for non-security applications, e.g., environmental resistance, and so rework tools have been developed which are capable of removing epoxy with minimal damage to the device(s) in question (here, display substrate 400 and driver IC 420). For example, section 5.4.3 of An Engineer's Handbook of Encapsulation and Underfill Technology by Martin Bartholomew (Electrochemical Publications Ltd 1999, ISBN 090115038X), entitled "Methods for encapsulant removal (decapsulation)," describes such methods. Automated Production Equipment of Key Largo, Fla., USA sells rework equipment that can be used to remove and replace glob-topped, conformally-coated, or underfilled BGA parts; see the 2009 article "Reworking Plastic Parts" from APE. Wayne Chen, in "FCOB reliability evaluation simulating multiple rework/reflow processes" (IEEE Transactions on Components, Packaging, and Manufacturing Technology, Part C, vol. 19, no. 4, pp. 270-276, October 1996), pg. 272, left column, describes epoxy encapsulant used as an underfill between a flip-chip IC and the PCB on which it is mounted, then simulates rework of that underfill to determine the reliability effects due to rework. For a conventional display as shown in FIG. 9, after glob-top 421 is reworked or removed, metal layer 403 can be probed to pirate the decrypted data.
Furthermore, display signals are generally high-frequency. An RGB 1920×1080p60 display has a 373 MHz pixel rate (1920 columns×1080 rows×3 (RGB)×60 Hz=373 MHz). The pixel signals therefore produce large amounts of high-frequency noise. This noise can be inductively probed through glob-top, permitting piracy without any need to destroy or rework the display.
Additionally, some image data is transported compressed instead of, or in addition to, encrypted. Existing systems for image decompression are also vulnerable to attack.
There is a need, therefore, for a more secure approach for decrypting or decompressing image data.

Display with secure decryption of image signals


A wireless navigation system with automatic guidance to the final destination/routes capable of operating in Internet-dead zones includes a system of servers containing data of final destinations/routes, Google and/or Apple Maps API, a voice synthesizer server, a GPS/AGPS system of satellites, servers and processing stations, a set of sensors, a microprocessor, a standard mobile operating system, a supra operating system controlling the above systems and a display and sound system for displaying the final output of the system.

Current wireless systems of navigation such as the turn-by-turn navigation systems offered by dedicated GPS navigation devices including Garmin car navigators, and TomTom car navigators, and GPS capable mobile phones such as Nokia smartphones, Windows phones, Android smart phones, Apple iPhones, used with software/applications such as Google/Apple maps, provide directions for final destinations selected by users. These systems keep users up-to-date about the best (in terms of time, speed or absence of roadblocks) route to a destination and are often updated according to changing factors such as traffic and road conditions.

Wireless navigation apparatus, method, and system


A balance shaft for rotating machinery such as a vehicle engine which minimizes the mass or weight of the balance shaft by optimizing the material usage in accordance with the standards and parameters established for the balance shaft. For rotating couple-type shafts, the two balance weights each have surfaces substantially forming hyperbolic curves. In addition, the connector portion between the balance weights has a cross-section with recessed sides in order to reduce the mass or weight of the balance shaft. For single unbalance-type shafts, the connector portion also has a cross-section with recessed sides.

Balance shafts are commonly used to reduce or cancel shaking forces and/or vibrations which result from residual imbalances inherent in the design architecture of machinery with rotating parts or mechanisms, such as motors. These balance shafts are sometimes called "counterbalance" shafts.
Balance shafts are particularly valuable when operator or passenger comfort and freedom from noise and vibration-related fatigue or distraction are desired, as in the case of motor vehicles such as automobiles, motorcycles, and the like. It is also advantageous to minimize vibration from the standpoint of equipment reliability. Where vibrations are reduced, the size, mass and/or complexity of the mounting structures can often also be reliably reduced, thus potentially reducing cost.
With multicylinder motor vehicle engines, the inline four-cylinder engines and 90-degree V-6 engines are favored in automotive use today due to their space efficiency and cost. Both of these engine architectures benefit from balance shafts, although for different reasons and vibratory characteristics, and thus require distinctly different balance shaft arrangements.
Balance shafts for inline four-cylinder engines typically are paired to rotate in opposite directions at twice the engine speed. The two balance shafts cancel each other's lateral shaking forces while opposing the vertical secondary shaking forces that are typical with this type of engine. Each shaft produces a single unbalance force, which taken together with its mating shaft's unbalance force, produces a resultant vertical shaking force located centrally among the bank of cylinders. These "single unbalance" type shafts are shown, for example, in U.S. Pat. No. 4,819,505.
Other engines, such as 90-degree V-6 engines (i.e., six-cylinder engine with two sets of three cylinders spaced 90-degrees apart), produce resultant imbalance forces in the form of a crankshaft-speed rotating couple. These engines benefit from a single balance shaft with two balance "weights", or masses, on opposite sides of its axis of rotation, but spaced apart axially so as to have a dynamic imbalance providing a rotating couple. The couple produced by the balance shaft is designed to oppose or cancel that of the engine when the shaft is rotated at crankshaft speed and in the opposite direction to the crankshaft. The axial location of this "rotating couple"-type shaft relative to the engine is not critical since the output of the balance shaft is a pure couple or torque on the crankcase.
Balance shafts of both types frequently incorporate an elongated support member, or shaft, which provides a structural connection between the balance weights, in the case of the rotating couple-type shaft, or between the centrally located balance weight(s) and a driving member, in the case of the single unbalance-type shaft. The elongated support member is subjected to both torsion and bending forces, and thus must be substantial enough to fulfill structural requirements. Since the mass of the elongated support member is largely "dead weight" and has little, if any, contribution to unbalance, its mass can be reduced in applications where overall mass is a factor in product cost and/or operating efficiency. These elongated support members or shafts typically have a circular cross-section. This circular section represents a structurally inefficient distribution of material that causes the components and their support structures to be more massive and often more costly than necessary.
The room or space for placement of balance shafts in the engine is typically small or limited. Balance shafts usually are constrained to operate within specified radii, whether to clear mating parts or to enable installation. Thus, efficient material usage typically motivates a balance weight cross-sectional shape that is, except for elongated support member intersection areas, "circular segment" in shape, i.e. the area between a radius and a chord. The radius of such a shape represents the clearance boundary beyond which the balance shaft cannot extend without risk of unwanted contact. The chord represents a locus of constant contribution to unbalance within the section, placing elements of mass equidistant from the axis of rotation, with regard to the ability of the mass element to generate centrifugal force in a particular direction, i.e., when viewed from a direction normal to the desired direction of unbalance force.
Typically, the "circular segment" shape of the balance weights are constant along their lengths. This enables easy calculation of their unbalance value from a design standpoint. However, this shape also results in inefficient distribution of material in the case of a rotating couple-type shaft, thus causing components and their support structures to be more massive and thus also often more costly than necessary.


A display panel drive device is provided with: a parallel-to-serial converter for conducting parallel-to-serial conversion on an input signal and outputting a serial signal; a transmission section for converting the serial signal output from the parallel-to-serial converter to a signal complying with a differential serial transmission system and transferring a signal via a transmission line; a reception section for receiving the signal transferred via the transmission line; a serial-to-parallel converter for conducting serial-to-parallel conversion on the signal received by the reception section and outputting a parallel signal; and a drive pulse output section for generating a drive pulse to drive a display panel based on the parallel signal output by the serial-to-parallel converter.

1. Field of the Invention
The present invention relates to a display panel drive device for driving a display panel of a matrix form, such as a plasma display panel.
2. Description of the Related Art
A display panel drive device for transmitting image data represented as digital data in a display device on a line is described in Japanese Patent Application Laid-Open Publication No. Hei-11-95713. In that device, a system (differential serial transmission system) for transmitting the digital signal using the LVDS (Low Voltage Differential Signaling) is used. The transmission system using the LVDS is a system is a system of driving two signal lines symmetrically with opposite phases and transmitting a difference between signals on the two signal lines. Therefore, the transmission system using the LVDS has a feature that foreign noises cancel each other and hardly affect the signal.
In the device described in Japanese Patent Application Laid-Open Publication No. Hei-11-95713, however, only image data and control signals, such as synchronization signals, are transferred by using the LVDS system, whereas a clock signal used on the reception side is transferred via a different transmission line. When such a configuration is adopted, however, there is a fear that skew (timing deviation) between the image data and the clock signal received on the reception side. For example, it is conceivable to provide a delay circuit in a path of a clock signal to adjust timing in order to eliminate the skew. In this case, however, the adjustment work of timing becomes troublesome.
The device described in Japanese Patent Application Laid-Open Publication No. Hei-11-95713 is a display panel drive device for driving a liquid crystal display. For example, as for a configuration suitable for transmitting a signal group comprising address data and driving pulse generation control data required to drive a display panel such as a plasma display panel by using a differential serial transmission system, any proposal has not been made heretofore. In general, when a skew (timing deviation) between the address data and the drive pulse generation control data occurs, it becomes a cause of false operation. Therefore, it is necessary to exclude such a skew. It is conceivable to provide a delay circuit in a path of a clock signal to adjust timing in order to eliminate the skew. In this case, however, the adjustment work of timing becomes troublesome.
In addition, when the number of transmitted signals increases or the number of transfer destination printed circuit boards becomes plural as the definition of display panels becomes high, then a plurality of sets of LVDS transmitter/receiver become necessary. In such a case, signals received by receivers are transferred via mutually different paths. As a result, a skew (timing deviation) occurs. Therefore, there is a fear that input timing of the drive pulse generation control data to drivers located after the receivers might deviate and a false operation might occur.
When reading image data or the like from a memory and transmitting it by using such a conventional technique, the clock used to read out the image data from the memory and the clock used in the transmission system using LVDS have the same frequency or frequencies mutually related with an integer ratio. In some cases, therefore, both the clock used in operation of reading out image data from the memory and the clock used in transmission using LVDS or used in operation conducted in a transmission destination circuit cannot be set respectively equal to an optimum clock frequency.

Display panel drive device, display control device, drive device, data transfer system, data transmission device, and data reception device


An electrical box assembly includes an electrical box having a removable partition plate that can be positioned between the ends of the electrical box or at the end of the electrical box when two or more of the electrical boxes are ganged together. The electrical box can include a mounting bracket having a body portion attached to a wall of the box for supporting the box during use. A support member is coupled to the mounting bracket and is extendable to a length to contact the opposing wall. The mounting and the support member are independently adjustable with respect to the box.

Electrical boxes are required in many situations for supporting electrical wiring devices such as receptacles, switches and connectors. Many electrical boxes have removable end walls so that two or more electrical boxes can be ganged together.
Electrical boxes having supports for electrical boxes are often used for mounting the electrical box to a support such as a wall stud. Various support devices are also used that extend from the electrical box to contact an opposing wall to support one side of the electrical box.
One example of an electrical box is disclosed in U.S. Pat. No. 2,092,367 to Breitenstein. The outlet box has a movable partition plate having notches that fit in the bottom wall of the electrical box. The top end has tabs that fit within holes formed in a cover plate. An elongated tongue extends from the top end to project into the opening in the cover plate.
U.S. Pat. No. 6,872,884 to Roesch et al. discloses a gangable electrical unit. The unit is constructed for positioning an electrical component beside an electrical outlet box. The unit includes a bracket with a wall structure and an adhering element for mounting on a wall of the electrical outlet box.
U.S. Pat. No. 6,894,222 to Lalancette et al. discloses an outlet box having an outwardly extending flange for mounting the electrical box and a plurality of knock-outs in the side walls. Outwardly extending flanges project from opposite side walls. Fastening members integrally formed with the flanges mount the box to a structural member.
U.S. Pat. No. 7,119,277 to Shotey et al. discloses an electrical device cover having a plurality of knock-outs in the adapter plate where the knock-outs include concentric rings. The knock-outs can be selectively removed to form an opening with different sizes.
U.S. Pat. No. 7,186,915 to Hull et al. discloses an electrical box molded as a one-piece unit of plastic material having three connectors extending outwardly from each side wall for receiving different sizes of electrical non-metallic tubing. The internal corners of the box are occupied by bosses that extend the full height of the corners and have holes therein for receiving a fastener. Attachment ears extend outwardly from the box. An adapter is attached to a front surface of the box with attachment ears aligned with the box ears.
U.S. Pat. No. 7,575,122 to Hull et al. discloses an outlet box having a knock-out in a side wall of a plastic electrical box. The knock-out has a slot for receiving a screw driver to apply a knock-out force. The knock-outs include a plurality of eccentric circles formed in the side wall.
U.S. Pat. No. 7,628,286 to Lalancette discloses an electrical box having a box locator adjustably positioned on one of the side walls to adjust the location of the front face of the box with respect to the stud to which the box is mounted. An opposite side wall includes a support bracket that is adjustably attached to the electrical box for supporting the electrical box with respect to a back wall.
U.S. Patent Publication No. 2010/0288554 to Jafari discloses an adjustable support bracket for an electrical box. The bracket includes two or three components incorporating a ratchet or locking mechanism to provide incremental adjustment of the support. The extendable arms include a spring loaded tab to engage a notch in the opposing extendable arm.
While the prior electrical boxes have generally been suitable for their intended use, there is a continuing need in the industry for improved electrical boxes.


An optical switching device including an optical switching engine may be packaged by omitting an optical bench and disposing optical elements directly on a base of a housing of the optical switching device. The optical switching engine may be disposed on a ceramic portion of the base, and thermally matched to the ceramic base. The base may be reinforced by the housing walls and optional internal rigidity ribs. The optical elements may be thermally matched to the base, and the lid may be strain relieved by thinning lid edges. The housing may be mounted to an external chassis using soft grummets.

Optical devices typically include optical elements held in a pre-determined spatial relationship by mechanical supports and holders. A mechanical package or housing may be provided to protect sensitive optical elements of an optical device from dust, shock, vibration, and other unwanted influences of the outside environment. To prevent external mechanical stresses from shifting optical components out of alignment, a dedicated rigid plate, termed "optical bench", may be suspended inside the housing, and the optical elements may be mounted directly to the optical bench. When the optical bench is rigid enough, the mechanical stresses may be decoupled from the optical elements supported by the optical bench, reducing chances of an optical misalignment.
Telecommunications equipment is frequently held in racks, or crates, having an array of parallel vertical slots for receiving individual telecommunication modules. The slots usually have a fixed width. Accordingly, optical modules used in telecommunication equipment need to be narrower than a multiple of the slot width, and preferably narrower than a single slot width, to fit into their dedicated slots in the racks or crates. The requirement of maximal allowed width, or height if placed horizontally, may provide a restriction of the maximal height of optical devices used in the telecommunication modules. A mere increase of the optical device height by one millimeter may render the optical device unusable, or it may require a stepwise increase of the telecommunication module width by an entire slot width. Many similar modules may be required for a multi-channel optical telecommunications system, further multiplying the required slot space. For this reason, it may be highly desirable to reduce height of individual optical modules.
In view of the foregoing, it may be understood that there may be significant problems and shortcomings associated with current solutions for mounting optical components of optical devices into housings.


In the tape printing apparatus 1, in the state that the back cover 11 is not attached to the apparatus body 2, the coil spring member 22 urges the stopper member 15 so as to rotate and the cutter lever 5 becomes inoperable based on that the engagement portion 15A of the stopper member 15 is engaged with the difference portion 19 of the cutter lever 5, and in the state that the back cover 11 is attached to the apparatus body 2, the stopper member 5 is rotated against the urging force of the coil spring member 22 based on that the engagement lib 14 of the back cover 11 is engaged with the engagement portion 15B of the stopper member 15 and the cutter lever 5 becomes operable based on that the engagement portion 15A of the stopper member 15 is released from the difference portion 19 of the cutter lever 5.

Conventionally, there is provided various tape printing apparatuses in each of which a scissors-like cutter is operated by manually operating a cutter lever and a tape on which characters are printed by a printing head is cut.
For example, in Japanese Publication No. Hei 10-100494, it is disclosed a tape printing apparatus in which a platen holder retaining a platen roller is rotatably supported at one side of the tape printing apparatus and a cutter lever is rotatably supported at a position adjacent to the platen holder. In the tape printing apparatus, when printing is conducted, the platen holder is rotated toward a thermal head and characters are printed on the tape while the platen roller is contacted with the thermal head through the tape derived from a tape cassette.
In the above tape printing apparatus, when the tape on which characters are printed according to the above is cut, the cutter lever is rotated toward a holder member having a cutter blade and the holder member is pressed by a press member, thereby the tape is cut by the cutter blade. And when printing is not conducted, the platen holder is rotated toward a direction according to which the platen holder is separated from the thermal head, thereby a stopper portion of the platen holder is contacted with an end portion of the cutter lever. Thus, the cutter lever is made inoperable.
Further, as disclosed in Japanese Publication No. 2005-88239, it is proposed a tape forming apparatus which has the same construction as the above mentioned tape printing apparatus. In this tape forming apparatus, the cutter lever is rotatably arranged at one side of the main body and the platen holder rotatably supporting the platen is rotatably arranged at the other side of the main body.
In the tape printing apparatus disclosed in Japanese Publication No. Hei 10-100494, when printing is not conducted on the tape, the stopper portion of the platen holder is contacted with the end portion of the cutter lever, thereby the cutter lever is locked in the inoperable state. However, the platen holder and the cutter lever is arranged at the same side in the tape printing apparatus. In this case, one side of the tape printing apparatus is inevitably and largely protruded outward, therefore a balance of both sided in the tape printing apparatus is broken. In a case that one side of the tape printing apparatus is protruded, it become difficult for a user to grasp and support the tape printing apparatus by one of hands even if such tape printing apparatus is handy type one.
On the other hand, in a case of the tape forming apparatus disclosed in Japanese Publication No. 2005-88239, the cutter lever is rotatably arranged at one side of the main body and the platen holder rotatably supporting the platen is rotatably arranged at the other side of the main body. Thereby, there is no problem that one side of the tape printing apparatus is protruded and the tape printing apparatus can be constructed so as to have a balanced shape at both sides thereof.
However, as in the tape forming apparatus, in a case that the cutter lever and the platen holder are separately arranged at the both sides of the tape forming apparatus, it is very difficult to arrange a lock mechanism to make the cutter lever inoperable in the non-printing state between the cutter lever and the platen holder. Based on this situation, it is not provided in the tape forming apparatus disclosed in Japanese Publication No. 2005-88239 the lock mechanism to make the cutter lever inoperable.
In order to dissolve the above problem, the present invention has been done and has an object to provide a tape printing apparatus in which a cutter lever does not operable when the cover member is removed from the tape printing apparatus body and becomes operable when the cover member is attached to the tape printing apparatus body, thereby the cutter lever can be changed between an inoperable state and an operable state by a simple construction even if the cutter lever and the platen holder are separately arranged at the both sides of the tape printing apparatus.


A method of making modular multi-function active optical cables (AOC) that enables multiple functions with minimal non-recurring engineering is described herein. In a non-limiting embodiment, one or more modular boards may be assembled into an assembly at a first end and a second end of the modular multi-function active optical cable, where each modular board may include at least a first connector. An electrical connector may be connected to the assembly using an interface to connect the electrical connector to the first connector associated with each module board. A hybrid cable assembly then may be connected between the assembly at the first end and the second, where the hybrid cable assembly includes one or more optical fibers and one or more electrical conductors.

This invention relates to the design and/or manufacturing of active optical cables, particularly for aerospace, military, and/or industrial applications in harsh environments.
Most interconnects in harsh environments, particularly for aerospace, military, and/or industrial applications, may be implemented using electrical cables. Using electrical cables has significant advantages, including: the ability to use ruggedized, blind-mateable electrical connectors such as the MIL-DTL-38999, flexibility in integrating different types of data, the ability to distribute electrical power, and/or the ability to operate in harsh environments including those with extended temperature ranges and/or high levels of contamination. However, the use of electrical cables for these interconnects also has disadvantages, including: susceptibility to electromagnetic interference, large cable size and/or weight, and/or limited ability to upgrade to higher bandwidths and/or longer transmission distances.
In principle, optical data transmission may address these disadvantages, but existing optical interconnect solutions have fallen drastically short of providing a viable solution to interconnects in these applications and/or environments.
Existing optical solutions only enable the transmission of a single type (namely, electrical format) of data and may not include the ability to distribute electrical power and/or perform significant health monitoring functions. Such solutions may be also standardized to a specific electrical connector and/or pin-out. The standardization may be done to create standard products with sufficient manufacturing volume to make them profitable.
Much of the interconnect market in these applications includes a wide variety of customized cabling including different connectors, pin-outs, power distribution requirements, and/or types of electrical data. In addition, the electrical data often consists of multiple channels of different types of data, usually requiring media conversion before the electrical data may be used for optical data transmission. Another challenge may be the small volumes typically associated with these applications. Overall the potential market for optical solutions in aerospace, military, and/or industrial applications may be substantial, but the potential market may be comprised of a very large number of customized cables, each with only a small volume.
Although optical interconnects may be incorporated in limited situations in applications such as aerospace, military, and/or industrial markets, these applications tend to be for high-bandwidth interconnects where only a single standardized type of data may be present. While a much larger section of the interconnect market in these applications may greatly benefit from some of the inherent advantages of optical interconnects, they require solutions that may be drastically different from existing products in both form and/or function. The lack of a modular design and/or manufacturing method that scales to small volumes limits the ability to provide the required optical interconnect solution for many of these applications.

Method for manufacturing modular multi-function active optical cables