Method and apparatus for sucker rod pumping in a wellbore using, in lieu of a stuffing box, first and second seal members connected by a length of compressible hose, the first seal member adapted to seal with the wellhead in a liquid and vapor tight manner and the second seal member adapted to seal with the sucker rod string in a liquid and vapor tight manner.

When a well such as an oil and gas well produces a liquid product such as crude oil which is desirably recovered at the earth's surface but the well does not have sufficient natural pressure in the reservoir to force the liquid product to the earth's surface, artificial pumping, sometimes referred to as artificial lifting, is employed. Artificial pumping forces the desired liquid product through the wellbore to the earth's surface for recovery and other utilization as desired.
One of the more common forms of artificial pumping used, particularly in the oil patch, is sucker rod pumping wherein a sucker rod string is employed in the wellbore and carries at the bottom end thereof a positive displacement pump. By reciprocating the sucker rod string and pump up and down inside the well tubing, work is transferred to the downhole positive displacement pump with the result that liquid product in the well tubing is forced upwardly through the tubing to the earth's surface.
The sucker rod string is reciprocated through the use of a pumping unit located at the earth's surface. This requires the sucker rod string to be reciprocated continuously through an opening in the wellhead that caps the well at the earth's surface. The area of concern to which this invention is directed is the area where the sucker rod string enters the wellhead. A seal is universally employed in this area to prevent well fluids, both liquid and gaseous, from escaping from around the sucker rod string out of the wellhead and into the earth's atmosphere.
The type of sucker rod seal most used by the prior art employs packing elements that are mechanically forced against a highly smooth sucker rod section called a polish rod. The packing elements press against the polish rod to achieve good sealing around the polish rod and to prevent, to the maximum extent possible, leakage from the interior of the wellhead around the polish rod and then to the exterior of the wellhead. Because the polish rod moves repeatedly up and down through these packing elements over a long period of time, the elements are subject to mechanical wear so that the stuffing box requires continual monitoring to adjust or replace worn packing elements to insure leakage prevention.
This type of stuffing box and its packing elements rely on the presence of some liquid lubricant between the polish rod and the packing elements which can sometimes escape outside the wellhead. Further, this equipment is not designed to form a reliable gas-tight seal around the polish rod so that the escape of volatile organic compounds from inside the wellhead and around the polish rod is also possible. As requirements tighten on the tolerable amount of liquid and gas allowed to escape around the polish rod, operator monitoring of each stuffing box necessarily increases, sometimes even to daily checks, to insure compliance with the volatile organic compound emission limits.


A system and method are provided for arranging and mounting a plurality of connectors on a substrate in a rectangular or square configuration. The system involves the provision of a rectangular mounting frame having four elongated sides joined at four corners, with engagement means at each corner on one face of the frame. Four elongated connectors are assembled to the one face of the frame respectively along the four elongated sides thereof. The four connectors have complementary engagement means at opposite ends thereof for interengagement with the engagement means at the four corners of the frame to hold the connectors on the frame. A flat surface at the center of the frame may be used to apply suction to manipulate the frame to position the connectors on the substrate. A plurality of terminals are mounted on each connector for electrical connection to appropriate conductors on the substrate, whereafter the mounting frame can be disengaged and removed from the connectors.

There are applications wherein it is desirable to fixedly mount and terminate a plurality of electrical terminals to a substrate, such as a printed circuit board, in a rectangular or square configuration, with the terminals in a straight line on each side of the square shape. Heretofore, one system for mounting the terminals has involved the use of a square board fixed to the substrate, with the terminals being disposed along the four edges of the board and soldered to appropriate circuit traces on the substrate. Problems are encountered with such systems when one side of the square board is bent. The terminals along the bent side of the board will undergo undesirable stresses, deteriorating or damaging the solder connections between the terminals and the flat substrate. Often, the opposite side of the square board also becomes bent, resulting in additional deterioration or damage to the terminal connections. As a result, the entire board, all of the terminals and, sometimes, the substrate must be discarded, lowering the yield of final products.
Another system has involved the use of four linear terminal supports forming the square configuration, with the electrical terminals disposed along a substantial length of each terminal support. The ends of the linear terminal supports have projections for interengaging the supports in a square configuration. The terminals then are soldered to the underlying substrate. Such a system can be seen in Japanese Patent 2750998. This system also has problems in that the interengaging projections at the corners of the linear supports occupy a substantial space or "real estate" on the substrate, resulting in lowering the density with which various electrical components can be mounted on the substrate.
The present invention is directed to solving these problems by providing a system which is free of any distortion in the linear terminal arrangement and which can effectively increase the parts-mounting density on a given substrate.


Power tool includes a movable blade and a detection system for detecting contact between the blade and an object. Detection system includes an excitation plate capacitively coupling the drive signal to the movable blade. A circuit generates an in phase component signal and a quadrature component signal from a blade current signal indicative of the instantaneous current drawn by the movable blade and calculates an energy of the blade current signal considering the in-phase and the quadrature components. The circuit compares the energy of the blade current signal to an adaptive trigger threshold to detect contact between the blade and the object based on whether the energy of the blade current signal is greater than the adaptive trigger threshold.

Detection or sensing systems have been developed for use with various kinds of manufacturing equipment and power tools. Such detection systems are operable to trigger some type of condition mitigation mechanism by detecting or sensing the proximity of the operator to some part of the equipment or contact with some part of the equipment by the operator. For example, it is known to use a capacitive contact sensing system in a table saw to detect contact between the operator and the blade. Such systems, however, have difficulty distinguishing certain materials, which may cause false activations of the condition mitigation mechanism. Accordingly, improved and more robust capacitive contact sensing systems are needed.


A package for a die includes a porous wick layer disposed between the die and a substrate. A sealed chamber between the die and substrate includes a phase-change fluid to transfer heat from a substrate side of the die to a heat spreader. Interconnects coupling bonding pads of the die to the substrate may pass through the chamber and through vias in the wick layer. In embodiments, the wick layer may have a coefficient of thermal expansion (CTE) matching a CTE of the die of the heat spreader. Heat generated by the die may evaporate the fluid in a die region and the evaporated fluid may condense in a heat spreader region. The wick layer returns the condensed fluid from the heat spreader region to the die region to complete the cycle. The fluid may be non-corrosive with respect to the interconnects and may be an electrical insulator. In embodiments, the wick layer in the heat spreader region may be disposed on the heat spreader in a pattern to efficiently draw the condensed fluid to the die region. In other embodiments, the wick layer may comprise materials of different pore size and porosity to efficiently draw the condensed fluid to the die region.

As semiconductor devices, such as processors and processing elements, operate at continually higher data rates and higher frequencies, greater current is consumed and more heat is produced. Due to size and location restrictions, as well as thermal limitations, conventional heat transfer mechanisms for packaged devices (i.e., dies) have a limited heat transfer capability restricting the operation of such devices to lower power levels, lower data rates and/or lower operating frequencies. As the performance of dies increases, materials with lower dielectric constants may be integrated into the die surface. These lower dielectric materials tend to be either more brittle or less stiff than those used previously, and may break more easily or deform by large amounts as a result of thermal expansion mismatches between the various materials in the package.
One problem with conventional packages is the heat dissipation path itself. Some conventional packaging techniques dissipate heat generated within a die using an integrated heat spreader which may be thermally bonded to the side of the die opposite the substrate. In many cases, however, most of the heat generated within the die is generated on the substrate side of the die, rather than the heat spreader side of the die. This increased heat dissipation path reduces the heat dissipation ability of the package. It may also increase the operating temperature of the die, and may restrict the operation of the die to lower power levels, lower data rates and/or lower operating frequencies.
Another problem with conventional organic-based packages is the thermal expansion mismatch between the die and the substrate. This is especially a problem for die coated with lower dielectric constant materials. Conventional packaging techniques have used a ceramic, rather than organic, substrate to reduce the thermal expansion mismatch. More recently, interconnects have been introduced between the substrate and die that reduce the thermal stresses on the die and the dielectric layer. These interconnects are sometimes referred to as "compliant" interconnects because they may comply with their surroundings. Although these interconnects may reduce the thermal stresses on the die, they have poor heat dissipation abilities making it difficult to remove heat from the substrate side of the die where most heat may be generated.
Thus, there are general needs for improved packages and methods for dissipating heat within a package. There is also a need for a package and method that helps reduce the temperature of a die. There is also a need for a package and method that removes heat from the substrate side of a die. There is also a need for a package and method that helps reduce stress on a die caused by thermal mismatches. There is also a need for a package and method that increases the reliability of a die. There is also a need for a package and method that allows a die to operate at higher data rates. There is also a need for a package and method suitable for die incorporating lower dielectric constant materials.

Package with integrated wick layer and method for heat removal


A gate drive circuit, comprising: a plurality of shift register units each having a signal output end, wherein the signal output end of one of the plurality of shift register units except the last one is connected to the signal input end of the next one; L arithmetic units each having a plurality of input ends, wherein L is an integer equal to or larger than 2, and one of the plurality of input ends of each of the L arithmetic units is connected to the signal output end of a respective shift register unit; and a clock generation unit having a plurality of clock output ends for outputting different clock signals, wherein at least one of the plurality of clock output ends is connected to at least one of the other input ends of a respective arithmetic unit except the one input end connected to the signal output end of the shift register unit, so that the L arithmetic units output L different drive signals.

1. Field of the Invention
The present invention relates to a technical field of a display, more particularly, relates to a gate drive circuit, an array substrate and a display apparatus.
2. Description of the Related Art
FIG. 1 shows an illustrative view of a conventional gate drive circuit. In prior arts, a display apparatus generally comprises the conventional gate drive circuit of FIG. 1.
As shown in FIG. 1, the gate drive circuit comprises a plurality of shift register units and a plurality of output buffer units. The plurality of shift register units are connected in series. Each of the shift register units may output a gate pulse signal to a respective output buffer unit, so that the output buffer unit outputs a gate drive signal. The signal output from one of the plurality of shift register units also functions as a start signal of a next shift register unit.
Referring to FIG. 1, one of the shift register units shifts a start signal STV_N and outputs a shifted signal STV_N+1. The shifted signal STV_N+1 is input into the output buffer unit, and the output buffer unit outputs a gate drive signal Gate_N+1. In addition, the shifted signal STV_N+1 also is input into the next shift register unit as the start signal of the next shift register unit. The next shift register unit shifts the shifted signal STV_N+1 and outputs a next shifted signal STV_N+2. The next shifted signal STV_N+2 is input into a next output buffer unit, and the next output buffer unit outputs a gate drive signal Gate_N+2.
So far, in order to increase a display region of a small display apparatus and improve a display effect of a large display apparatus, it is necessary to reduce a width of an edge frame extending from an edge of the display region to the outer edge of the display apparatus so as to obtain a narrow edge frame. However, in the gate drive circuit shown in FIG. 1, if it needs to output N gate drive signals, then N shift register units must be connected in series, causing a wiring area of the gate drive circuit very large, and increasing the width of the edge frame. As a result, it is difficult to obtain a display apparatus with a narrow edge frame.

Gate drive circuit, array substrate and display apparatus

Chengdu BOE Optoelectronics Technology Co., Ltd.


The invention relates to a process for remediation of a fluid contaminated with alkylene oxide, involving contacting the contaminated fluid with an aqueous absorbent to yield a fat absorbent having absorbed fluid, conferring intimate contact of fat absorbent and alkylene oxide and conversion of alkylene oxide; and, an apparatus for remediation of the fluid which has a converter having inlet means connected to the outlet of a fluid absorber for contacting fluid and aqueous absorbent, a holding unit having a volume V for the fat absorbent, and outlet means connected to the inlet of a fluid desorber.

Ethylene oxide is a substantial item of chemical commerce having utility both as a sterilization agent and as a fumigant, but primarily as a starting material in the manufacture of a diverse array of products such as anti-freeze, cosmetics, lubricants, plastics and surfactants. The major process for manufacture of ethylene oxide is by the silver-catalyzed oxidation of ethylene. Typically, the stream exiting the reactor comprises small quantities of ethylene oxide (for example 0.5 to 5 mol %) together with large amounts of residual gases including unconverted ethylene and oxygen as well as appreciable quantities of carbon dioxide, low molecular weight hydrocarbons and inert gases such as nitrogen. Customarily, the ethylene oxide product is recovered from the residual gases by absorption in water followed by processing of the ethylene oxide-fat absorbent in a variety of ways including fractionation, scrubbing, stripping and the like.
An ethylene oxide plant may also be the site of production of monoethylene glycol derived by hydration of the product ethylene oxide. In such a plant, the product ethylene oxide, having been isolated by water absorption, is then typically hydrated in a separate reactor.
Variations of this process have been proposed in the past. GB-A-498,119 for example is an early proposal where the hydration may be performed thermally or, preferably, using an acidic catalyst which is added to the water absorbent. The glycol forms on heating the absorbent solution after the ethylene oxide is absorbed and the resulting solution is recycled as liquid absorbent until the glycol content is relatively high and is recovered.
EP-A2-776890 proposes another variant where ethylene oxide absorbed in a solution containing ethylene carbonate and ethylene glycol is reacted with carbon dioxide to the carbonate form and hydrolyzed with a separate catalyst. The Example shows that treatment of an ethylene oxidation product stream, containing 3 mol % ethylene oxide, left 100 ppm in the residual gases, following the particular absorption step and conditions used.
DE-A1-19843721 uses ethylene oxide wash water as absorbent prior to the hydration step. The Example shows absorption in wash-water of ethylene oxide from a gas mixture containing 2.7 mol % ethylene oxide, leaving 10 ppm ethylene oxide to be lost in the residual gases.
The residual gases that remain after recovery of the bulk ethylene oxide product are recycled to the ethylene oxidation reactor. Customarily, a small bleed stream is withdrawn from the recycled gases to prevent build-up of impurities such as argon, ethane or nitrogen in the recycle gas loop. A side stream, being part or all of the recycle gas, is usually scrubbed with an aqueous carbon dioxide (CO2) absorbent for removal of excess CO2 which is subsequently stripped from the absorbent and typically is vented, or if desired, recovered for use or sale as a by-product.
A problem arises, particularly in manufacturing plants of large capacity, in that, during scrubbing of the recycle gas side stream, small amounts of hydrocarbon are dissolved and/or entrained in the CO2 absorbent and ultimately vented with the carbon dioxide.
U.S. Pat. No. 3,867,113 discloses a process improvement which is now conventional in EO processes, whereby the CO2-fat absorbent obtained by contacting a sidestream from the recycle stream with a CO2 absorbent is flashed to form a hydrocarbon-containing vapor stream and a hydrocarbon-lean fat absorbent, and the fat absorbent is stripped to produce a CO2 stream substantially free of hydrocarbon which is suitable for venting, or use.
Nevertheless, in conventional EO plants, despite flashing the fat absorbate, a small amount of residual EO remains in the vent gas from the CO2 stripper. In order to keep vented EO as small as possible for environmental reasons, the vent gas can therefore, conventionally, be subject to incineration. Such incineration can, for example, occur within a catalytic incinerator whereby one or more catalyst beds are heated to high temperatures (in ranges from approximately 300° C. to 800° C.) and various heat exchange mechanisms are incorporated to minimize energy loss and improve efficiency. This, therefore, presents a convenient solution which is effective in operation and, as an "end-of-pipe" process, requires minimal alteration to the existing process line up.
Being operated at high temperatures and requiring the need for catalyst will, however, inevitably mean periods of time in which the incinerator cannot function due to the need for maintenance, repair, replacement of catalyst, etc. Where environmental contamination is measured on an average basis, say as EO vented per week, such incinerator-downtimes are negligible, but increasingly, environmental concerns require constant monitoring of EO venting with hourly measurement of contamination, and this means that the conventional incinerator system may not comply with environmental regulations all of the time.
There is therefore a need to provide for an effective reduction of EO in CO2 vent gas from an EO plant, with or without the use of additional incineration, in which reduction is constantly maintained.
The concentration of EO in vent gas is moreover dependent on a number of factors, including the percent of recycle stream which is treated as a sidestream, and the operating conditions of the CO2 absorber and EO absorber. A further need is, therefore, to provide a system for independent control of EO in CO2 vent gas from an EO plant, whereby the level of carbon dioxide to be vented can be varied without compromising the reduction in EO emission.


A method for decoding a residual block, includes: obtaining residual data from encoded data; identifying one or more conditions for enabling an inverse quantization and an inverse transform; skipping both of the inverse quantization and the inverse transform for the obtained residual data to thereby reconstruct a residual block directly from the obtained residual data, when the one or more identified conditions indicate skipping of both the inverse quantization and the inverse transform; inversely quantizing the obtained residual data and skipping the inverse transform for the inversely quantized residual data to thereby reconstruct a residual block using the inverse-quantized residual data, when the one or more identified conditions indicate skipping of the inverse transform; and inversely quantizing the obtained residual data and inversely transforming the inversely quantized residual data to thereby reconstruct a residual block using the inverse transformed residual data.

The statements in this section merely provide background information related to the present disclosure and do not constitute prior art.
As fast as the multimedia-related technology advances at unprecedented pace, demands for high quality of multimedia data such as audio, images, and videos are increasing. As a part of the development, international standards have been established on high efficiency video compressions to satisfy the needs for transmission, storage, and retrieval of such multimedia data within limited network resources. Especially for an international standard on video compressions, ISO/IEC JTC1/SC29 MPEG group and ITU-T VCEG group have created H.264/AVC MPEG-4 Part. 10 standard, which attempts to achieve a high compression efficiency by using various prediction encoding methods such as variable block size motion estimation and compensation, intra prediction encoding, etc.
Through the motion estimation, motion vectors are generated and used to compensate the motions, and the known method of encoding/decoding the motion vectors in the video encoding/decoding space is to perform a prediction encoding with respect to a motion vector of a block estimated by using motion vectors of spatially adjacent blocks as predicted values. That is, the inventor(s) has noted that because the motion vector of the current block has high correlations with motion vectors of the adjacent blocks, these motion vectors are used in calculating the predicted values which are generated as predicted motion vectors (PMV), and then an encoding is performed not on the true value of the motion vector of the current block but just on its differential values from PMVs in an effort to reduce the bit rate required to encode the motion vectors and improve the encoding efficiency.
Therefore, the inventor(s) has noted that according to the typical motion vector encoding methods, the efficiency of compression is increased as the predicted motion vectors get closer to a motion vector of the current block. However, the inventor(s) has experienced that to have the closest predicted motion vectors relative to the motion vector of the current block, it is necessary to additionally encode information on what values to use as the predicted motion vectors which adds to the bit rate and deteriorates in the compression efficiency.

This patent is subject to a terminal disclaimer.

Method and an apparatus for decoding a video


An inspection and/or processing apparatus for sheets such as banknotes includes a stacker wheel arrangement in which, rather than continuously rotating the stacker wheel and decelerating or accelerating the wheel to adjust the wheel speed in order to cause the grooves to align with the entrance chute at the same time that sheets arrive at the wheel, the stacker wheel is rotated only between sheet arrivals, and only for the purpose of indexing the stacker wheel to a new position at which a sheet can enter the stacker wheel without jamming. Indexing of the stacker wheel follows a predetermined profile, and the stacker wheel is held stationary at each predetermined aligned position until a respective individual sheet has entered the stacker wheel.

1. Field of the Invention
This invention generally relates to apparatus for inspecting or processing sheet materials such as bank notes, and in particular to the stacking or accumulation unit of a sheet material inspecting or processing apparatus. The stacking or accumulation unit includes at least one impeller or stacker wheel to which sheets are selectively fed following inspection or processing, a stepper motor for rotating the stacker wheel in order to accept the sheets and deposit them in a stack, and a stepper motor control circuit for synchronizing movement of the wheel with movement of the sheets by start-stop or intermittent operation of the stepper wheel. Movement of the stacker wheel is timed by the controller so that movement of the wheel occurs solely during the intervals between sheet arrivals, the wheel remaining stationary as individual sheets enter grooves in the wheel so as to prevent collisions between the arriving sheets and edges of the accumulation grooves in the wheel.
The invention also relates to a method of accumulating or stacking sheets following inspection or processing and selective diversion to a stacking or accumulation unit of the type which utilizes an impeller or stacker wheel to collect the sheets and deposit them in a stack. The method involves controlling the stacker wheel so that it moves only during the intervals between arrival of the sheets, and is stationary and perfectly positioned upon arrival of each sheet in order to prevent collisions between the arriving sheets and edges of the accumulation grooves in the wheel.
2. Description of Related Art
In general, the use of stacker wheels, also known as star wheels or accumulation impellers, for the purpose of accumulating and stacking sheet materials such as bank notes following inspection or processing, is well-known. As shown in FIGS. 1-3, the conventional stacker wheel 1 includes a plurality of spiral blades 4 which define accumulation grooves 5. As the wheel is rotated so that the grooves 5 successively are presented to a sheet arrival chute 6, the sheets are selectively diverted into the chute by a pivotal gate 7 based on the results of sheet inspection (for example, based on a determination of banknote denomination). The grooves absorb the forward momentum of the sheets so that they can be stacked without causing damage to the sheets. Following insertion of the sheets into grooves 5, the wheel is operated in a purge mode which deposits the sheets in an accumulation tray or bin 8.
Because of the high speed at which bank notes are processed, damage which can lead to misfeeding or jamming may occur if a sheet collides with one of the spiral blades 4 before properly entering the corresponding groove, as illustrated in FIG. 2. The possibility of collision results from even slight differences in arrival times of the sheets at the entrance to the accumulation device.
To reduce the possibility of collision, it has been proposed to increase the entrance angle so as to decrease the likelihood that a sheet will encounter the trailing side of a blade before entering the groove, but the reduction in collisions that can be achieved is limited. A more effective, but also more difficult solution to the problem of reducing collisions and jamming has been to synchronize rotation of the wheel with detected sheet arrivals by varying the rotation speed of the wheel, and in particular by accelerating or decelerating the wheel to adjust for deviations in arrival times of the sheets at the entrance to the accumulation device.
In order to synchronize rotation of the stacker wheel with arrival of sheets, the conventional apparatus includes, as shown in FIG. 3, at least one optical sensor 9 positioned upstream of the stacker wheel or accumulation unit and arranged to indicate the arrival of the sheet in the entrance chute 6. The optical sensor or sensors have outputs connected to a microcontroller 10. Microcontroller 10 supplies timing signals to a motor controller 11 to enable the motor controller to determine the arrival time of a sheet for the purpose of adjusting the speed that the stacker wheel is rotated by stepper motor 12, so that a sheet will begin entering one of the grooves 5 of the stacker wheel at the exact moment that the groove is aligned with the incoming sheet. In addition, microcontroller 10 synchronizes operation of the gate 7 and/or gate controller 7xe2x80x2 so that notes are properly diverted into the accumulation device or sent downstream to another accumulation device or for further processing.
In the conventional method of controlling the apparatus of FIG. 3, as illustrated in FIG. 4, the motor controller 11, upon being informed by microcontroller 10 of an incoming sheet (step 1), calculates an arrival time for the sheet at the entrance to the groove based on the output of optical sensor 9 (step 2). Based on the detected position or phase of the stepper motor 12, the stepper motor controller 11 then calculates the deceleration or acceleration necessary to cause the groove to be in the proper position at the time of arrival of the sheet (step 3). The process is repeated for the next sheet.
In this method, all speed calculations and adjustments must be carried out between the time of arrival of a sheet at the optical sensor 9 and the time of arrival of the sheet at the stacker wheel 1. In the case of a U.S. or Canadian banknote inspection apparatus, in which individual sheets in the form of banknotes are fed at a rate of 10 sheets per second, the available time between arrival of the leading edge of one of the notes at the optical sensor and entry of the note into the stackerwheel is approximately 13.5 ms, while an additional 22 to 24 ms are required for the trailing edge of the note to enter the groove. Not only does this necessitate rapid processing capabilities, but the high torques required to accelerate or decelerate the motor in the limited time between completion of the speed calculation and arrival of the banknote places great physical demands on the conventional stepper motor used to rotate the stacker wheel.
An example of a prior continuous stacker wheel motor control arrangement which addresses the problem of high torques is disclosed in U.S. Pat. No. 5,641,156. In the system of this patent, in order to reduce the amount of acceleration or deceleration necessary to achieve precise phasing of the stacker wheel and the arriving notes, the stepper motor only accelerates or decelerates the stacker wheel if the pitch, i.e., spacing between notes is outside a predetermined range, and only accelerates or decelerates the note by an amount sufficient to bring the stacker wheel within a predetermined insertion range. In addition, an auxiliary drive is used to accelerate or decelerate the notes themselves in order to further reduce the amount by which the rotation speed of the stacker wheel needs to be varied.
Even with the modifications described in U.S. Pat. No. 5,641,156, however, sophisticated processing capabilities and a relatively high capacity motor are required in order to effect the continuous control necessary to ensure proper phasing, limiting the speed at which notes can be processed, and increasing the cost, weight, and power consumption of the device.
It is accordingly a first objective of the invention to provide a high speed sheet material processing and/or inspection apparatus of the type including a stacker wheel made up of a plurality of spiral blades defining grooves for collecting the sheets following inspection and/or processing, which minimizes the possiblity of jamming due to improperly timed arrival of the sheets.
It is a second objective of the invention to provide a high speed sheet material processing and/or inspection apparatus of the type including a stacker wheel made up of a plurality of spiral blades defining grooves for collecting the sheets following inspection and/or processing, in which successive grooves are perfectly positioned to accept respective successively arriving sheets without the need for continuous control and/or adjustment of the speed of the stacker wheel speed to compensate for variations in arrival times of the sheets.
It is a third objective of the invention to provide a high speed sheet material processing and/or inspection apparatus of the type including a stacker wheel made up of a plurality of spiral blades defining grooves for collecting the sheets following inspection and/or processing, in which successive grooves are perfectly positioned to accept respective successively arriving sheets, and yet which does not require any real-time calculations of sheet arrival time or continuous adjustment of stacker wheel position.
It is a fourth objective of the invention to provide a high speed sheet material processing and/or inspection apparatus of the type including a stacker wheel made up of a plurality of spiral blades defining grooves for collecting the sheets following inspection and/or processing, in which successive grooves are perfectly positioned to accept respective successively arriving sheets, and yet which utilizes a stepper motor arranged to follow a predetermined indexing profile that minimizes required torques in order to reduce required motor capacity while protecting the wheel and sheets captured by the wheel from stresses resulting from sudden repeated acceleration and deceleration.
It is a fifth objective of the invention to provide a high speed sheet material processing and/or inspection apparatus of the type including a stacker wheel made up of a plurality of spiral blades defining grooves for collecting the sheets following inspection and/or processing, which minimizes power consumption of the accumulation device.
It is a sixth objective of the invention to provide a method of controlling a stacker wheel in a high speed sheet inspection and/or processing apparatus, the stacker wheel including a plurality of blades defining spiral grooves, so that sheets arrive at the entrances to the grooves without colliding with edges of the grooves, and yet which does not require real time calculation of arrival times or continuous adjustment of stacker wheel speed to account for variations in arrival times of the sheets at the wheel.
These objectives are accomplished, in accordance with the principles of a preferred embodiment of the invention, by providing a stacker wheel arrangement in which, rather than continuously rotating the stacker wheel and decelerating or accelerating the wheel to adjust the wheel speed in order to cause the grooves to align with the entrance chute at the same time that sheets arrive at the wheel, the stacker wheel is indexed between aligned positions following a predetermined profile and held stationary at the aligned position until the sheet has arrived.
By moving or indexing the stacker wheel between predetermined stationary positions, the invention eliminates the need for real-time calculations of sheet arrival times since the indexing sequence need only be completed at some arbitrary time before the next sheet arrives, and not exactly upon arrival of the sheet at the wheel as in the continuous rotation apparatus and method. Thus, so long as the indexing time is less than the minimum time interval between sheet arrivals, the indexing sequence may be started at any time following insertion of the arrival of a sheet in a groove, and thus may be triggered by any signal associated with sheet arrival, including: (i) signals from an optical sensor situated upstream of the stacker wheel or at the entrance to the accumulation device, (ii) synchronization signals provided by or to a main accumulation unit controller for the purpose of operating the gate, or (iii) the occurrence of any other event associated with sheet arrival. For example, since the time of arrival of a sheet in a groove following detection of the trailing edge of the sheet at the optical sensor positioned before the entrance chute of the conventional stacker arrangement can be predetermined, the indexing procedure can be started a predetermined period after the trailing edge signal from the optical sensor, or the trailing edge of a xe2x80x9csynchxe2x80x9d signal based thereon.
While the manner in which the stacker wheel is indexed may be varied without departing from the scope of the invention, according to an especially preferred embodiment of the invention, the apparatus of the invention includes a PIC microcontroller arranged to generate an acceleration and deceleration profile which advances the stacker wheel a predetermined amount, such as 30 degrees, following entry of a sheet into the stacker wheel. A convenient starting point for the indexing procedure is the falling edge of a synchronization pulse generated by a main controller and sent to the PIC microcontroller, as well as to the gate controller, to indicate that a sheet is arriving and that the sheet is to be diverted to the stacker wheel. The leading edge of the synchronization pulse can occur at any time following the previous pulse, but the trailing edge of the synchronization pulse must occur before the trailing edge of the sheet enters the stacker wheel in order to leave enough time to start of a new synchronization pulse before arrival of another bank note.
By way of example, in the case of U.S. or Canadian banknotes fed at ten notes per second, rotation of the stacker wheel may be set to occur 9.5 ms after detection by the optical sensor of the trailing edge of the bank note, i.e., approximately 4 ms before the trailing edge of the banknote enters the stacker wheel, and thus the indexing process can safely be started by waiting 4 ms following an initial synchronization pulse.
In addition to using the trailing edge of the synchronization pulse to initiate an index cycle, the control apparatus and method of the preferred embodiment of the invention employs the synchronization pulse to determine when to begin a purge cycle, in which accumulated sheets or notes are removed from the stacker wheel. In particular, if there is no synchronization pulse for a predetermined extended period of time, such as 100 ms, a purge cycle of six consecutive indexes is initiated. If a synchronization pulse arrives during the purge cycle, then there must be enough time for the stacker wheel to move to an aligned position and complete at least the current purge index if not the entire purge cycle. Since an index cycle is approximately 30 seconds, so long as the leading edge of the synchronization pulse arrives at least about 35 ms before arrival at the stacker wheel of the banknote or other sheet, there will be sufficient time to complete the purge index.
According to yet another feature of the preferred embodiment of the invention, the stepper motor acceleration and deceleration profile output by the PIC microcontroller to the stepper motor controller may be designed to further minimize forces resulting from sudden acceleration and deceleration of the stacker wheel, by ensuring that the wheel is ramped up to full speed as gradually as possible, and then only gradually decelerated. Further shock protection may be provided by connecting the shaft of the stacker wheel to the motor via a helical spring or other damping device.

Stacker wheel control apparatus and method utilizing start-stop synchronization


A negative electrode for a lithium secondary battery that includes, as a negative active material, a lithium titanate (Li4Ti5O12) compound containing 0.004 parts by weight or less of phosphorous (P) and 0.007 parts by weight or less of potassium (K) based on 100 parts by weight of lithium titanate, a binder, and a conductive agent, and a lithium secondary battery including the negative electrode.

1. Field
One or more embodiments relate to a lithium titanate, a negative electrode for a lithium secondary battery that includes the lithium titanate, and a lithium secondary battery including the negative electrode.
2. Description of the Related Technology
Lithium titanate (Li4Ti5O12) is useful as an electrode material in a lithium secondary battery.
Usually, lithium titanate is prepared by dry-heat treating a mixture including titanium dioxide and a lithium compound, or by using other dry or wet powder synthesis methods that are known to one of ordinary skill in the art.
Conventionally, lithium titanate is obtained from titanium dioxide as a starting material. In preparing an electrode material having excellent characteristics, titanium dioxide, as a starting material of lithium titanate, plays an important role. Among a lithium precursor and a titanium precursor, which are necessary starting materials of lithium titanate, an amount of the titanium precursor needed in consideration of a composition ratio with respect to the lithium precursor is relatively high and thus, the kind and amount of elements contained in the titanium precursor affects battery performance more than those in the lithium precursor. Also, in consideration of a percentage of the titanium precursor in the total raw material costs, it is important to select an appropriate titanium precursor. When high-purity titanium dioxide is used as a precursor of lithium titanate, many problems including high manufacturing costs may occur.
Lithium titanate undergoes a small volumetric change during charging and discharging and thus has excellent rapid charge and discharge characteristics, and when used in a lithium battery, the lithium battery has high-performance characteristics. Accordingly, it is expected that lithium titanate is very useful as an electrode material of a high-output battery used in an application, such as a hybrid electric vehicle, that requires rapid charging and discharging.
An important characteristic of a high-capacity middle and large-sized battery is rate capacity. However, lithium titanate has lower charge and discharge capacity than a conventional graphite-based negative active material. Thus, there is a need to embody a capacity near a theoretical value and improve capacity retention characteristics by control of impurities in the active material.

Lithium titanate, negative electrode including the lithium titanate, and secondary lithium battery containing the electrode


A microelectronic assembly, including a microelectronic element such as a semiconductor chip and a dielectric material covering the chip and forming a body having a bottom surface. The assembly includes conductive units having portions exposed at the bottom surface, posts extending upwardly from said exposed portions and top flanges spaced above the bottom surface.

Resistors are presently fabricated using a number of different methods, depending on the requirements of the circuit in which resistors are to be used. Resistor types such as thin film resistors, thick film resistors, wound wire resistors, molded axial leaded resistors, surface mount resistors and others are known in the art.
Thin film resistors are fabricated by first depositing a resistive material, then a conductor material, onto a substrate. A wide variety of substrate materials can be used, but these materials generally contain an oxygen compound to permit adhesion of the resistive film. Materials used for thin film resistors generally must also be capable of providing adhesion to a substrate. The resistor film forms as single points on the substrate in the vicinity of substrate faults or other irregularities that might have an excess of broken oxygen bonds. The points expand into islands that form continuous films.
This differs from typical thick film resistor fabrication for which the conductor is deposited first onto a substrate, followed by the resistive material. In general, thick film resistors are formed by adding metal oxide particles to glass particles and firing the mixture at a certain temperature and for a predetermined time period sufficient to melt the glass and sinter the oxide particles together. The resulting structure consists of a series of three-dimensional chains of metal oxide particles embedded in a glass matrix. The higher the metal oxide-to-glass ratio, the lower the resistivity.
The drawback of traditional thick and thin film resistor manufacturing is that both processes tend to have many process steps. Another drawback to these methods of manufacture is that they are generally not capable of providing resistor networks having multiple different or common values in a single device. Further, current methods of manufacturing resistors generally result in the leads being located at the periphery of the resistor device. Peripherally located leads often suffer from the problem that these leads can be easily bent, requiring, in certain circumstances, that the resistor be glued in place. The proposed methods are more versatile than existing methods in that a wide range of resistor devices can be built using a single sacrificial layer, and that the resistor devices can be designed without peripherally located leads.

Methods for manufacturing resistors using a sacrificial layer


Responsive to a processor of a first intercom unit establishing a wireless data channel with one or more second intercom units of a plurality of intercom units in a wireless network, and responsive to an encoder of the first intercom unit repeatedly encoding, during a repeated time interval, data to be transmitted to the one or more second intercom units over the wireless data channel while pausing the wireless data channel such that the first intercom unit does not transmit the encoded data during the repeated time interval, the processor may receive an indication to un-pause the wireless data channel. A network controller of the first intercom unit may wirelessly transmit the data last encoded by the encoder during the repeated time interval to the one or more second intercom units.

Intercom systems have been employed to help facilitate communication throughout premises such as a home or office. Using an intercom, one can talk or listen among multiple locations. Current intercom systems can be divided into two categories—wireless and wired. Each possesses serious disadvantages.
Wireless intercom systems rely on simple wireless broadcast technology to broadcast a signal from one handset to all other handsets. Some models permit a user to select which channel to broadcast on, but an associated receiver needs to be set to the same channel in order to receive the broadcasted message. These simple wireless devices suffer from poor quality (due to radio wave interference from other devices and weak signals) and have no privacy or security; anyone can listen in on transmissions by monitoring the channel.
Wired intercom systems are hard-wired together, either via telephone lines or Ethernet cables. These systems are mounted in place in the wall, and communicate with each other through their wired analog or digital connections. These systems provide greater reliability and privacy than wireless intercoms because of their wired connection, but quality is often poor because of interference from power lines. In addition, many wired intercom systems employ a "master/slave" model in which communication is permitted between master and slave devices but two slave devices cannot communicate with each other. Finally, these systems are costly due to the requirement to wire them together.


A lens supporting mechanism for a lens shutter camera includes a front lens group, a lens supporting barrel, a movable barrel, a rear lens group, and a shutter mounting barrel which includes a shutter with an AE function. The front lens group is fixed to the lens supporting barrel. Both the lens supporting barrel and the shutter mounting barrel are fixed to the movable barrel. The rear lens group is attached to either the movable barrel or the shutter mounting barrel such that the rear lens group is movable along the optical axis relative to the moveable barrel. During operation of the zoom lens, the movable barrel advances and retreats along the optical axis.

1. Field of the Invention
The present invention relates to a lens supporting mechanism for a camera. In particular, the present invention relates to the mechanism to fix a lens supporting barrel supporting a lens group to a movable barrel that is driven in a direction of an optical axis.
2. Background and Material Information
A lens shutter camera may be provided with a shutter unit that is arranged between or behind lens groups of a photographing lens. Since the lens group comprises a plurality of lenses, generally they are installed in a lens supporting barrel. In the case where at least one of the lens groups are driven along an optical axis together with the shutter unit, i.e., the photographing lens is a zoom lens or the photographing lens can be switched between a retracted position and a photographing position, the lens group and the shutter unit are arranged on a movable barrel.
In the conventional lens shutter camera, the lens supporting barrel for a front movable lens group is fixed to the shutter unit at the rear side of the lens supporting barrel, and the shutter unit is fixed to the movable barrel at the rear side thereof. Alternatively, the lens supporting barrel is fixed to the movable barrel at the front side thereof and the shutter unit is fixed to the movable barrel at the front side thereof.
According to the conventional structures, an accurate alignment of the lens supporting barrel with the movable barrel is difficult because of a cantilever support for the lens supporting barrel. That is, when the lens supporting barrel is fixed to the shutter unit, the lens supporting barrel is only supported at the rear side. On the other hand, when the lens supporting barrel is fixed to the movable barrel at the front side, the lens supporting barrel is only supported at the front side. In either case, the positional relationships may be changed.
Furthermore, when a camera is provided with a zoom lens having front and rear lens groups, it is necessary to make optical axes of the lens groups coaxial. However, the front lens group and the rear lens group, which are driven along an optical axis respectively during zooming operation, are guided by the different guide mechanisms in a conventional camera, and it is difficult to keep the coaxial condition during zooming operation.

Zoom lens barrel with shutter mounting unit


A voice coil actuator utilizes an eddy current magnet configured for positioning proximal to the outer perimeter side face of one or more recording disk, and which cooperates with the conductive side face to generate an eddy current force to rotate a latch lever to an unlatched position. Embodiments may include an end cam on a base on which the latch lever is rotatably disposed, and the latch lever includes a cam follower capable of rotatably engaging with the end cam, whereby the magnetic attraction between the eddy current magnet and the voice coil actuator yoke generates a latch bias force which causes the end cam and cam follower to engage or mesh in order to hold the latch lever in a latched position.

A hard-disk drive (HDD) is a non-volatile storage device that is housed in a protective enclosure and stores digitally encoded data on one or more circular disk having magnetic surfaces. When an HDD is in operation, each magnetic-recording disk is rapidly rotated by a spindle system. Data is read from and written to a magnetic-recording disk using a read/write head that is positioned over a specific location of a disk by an actuator. A read/write head uses a magnetic field to read data from and write data to the surface of a magnetic-recording disk. A write head makes use of the electricity flowing through a coil, which produces a magnetic field. Electrical pulses are sent to the write head, with different patterns of positive and negative currents. The current in the coil of the head induces a magnetic field across the gap between the head and the magnetic disk, which in turn magnetizes a small area on the recording medium.
Many HDDs are configured to include a ramp (also referred to as a load/unload ramp). Ramp load/unload technology involves a mechanism that moves the head stack assembly (HSA), including the sliders, away from and off the disks and safely positions them onto a cam-like structure. The cam typically includes a shallow ramp on the side closest to the disk. During a power-on sequence, for example, the read/write heads are loaded by moving the sliders off the ramp and over the disk surfaces when the disks reach the appropriate rotational speed. Thus, the terminology used is that the sliders or HSA are "loaded" to or over the disk (i.e., off the ramp) into an operational position, and "unloaded" from the disk (i.e., "parked" onto the ramp) such as in an idle position.
Furthermore, many HDDs are configured with a latch mechanism to secure the HSA, or at least the suspension/slider portion of the HSA, on the ramp (or perhaps on a landing zone of the disk for HDD's absent a ramp) when not operating. Thus, the head slider is prevented from dislodging from the ramp and moving over the disk when the actuator rotates due to external vibration or shock events. In light of the customer demand and industry move toward thinner and thinner HDD's, internal space constraints present challenges for sub-system design and development.
Any approaches described in this section are approaches that could be pursued, but not necessarily approaches that have been previously conceived or pursued. Therefore, unless otherwise indicated, it should not be assumed that any of the approaches described in this section qualify as prior art merely by virtue of their inclusion in this section.

Hard disk drive voice coil actuator latch


A combustor comprises an annular combustor chamber formed between the inner and outer liners, the annular combustor chamber having a central axis. Fuel nozzles are in fluid communication with the annular combustor chamber to inject fuel in the annular combustor chamber. The fuel nozzles are oriented to inject fuel in a fuel flow direction having an axial component relative to the central axis of the annular combustor chamber. Nozzle air inlets are in fluid communication with the annular combustor chamber to inject nozzle air generally radially in the annular combustor chamber. A plurality of dilution air holes are defined through the inner and outer liner downstream of the nozzle air inlets, the dilution holes configured for high pressure air to be injected from an exterior of the liners through the dilution air holes generally radially into the combustor chamber, a central axis of the dilution air holes having a tangential component relative to the central axis of the annular combustor chamber.

In combustors of gas turbine engines, an efficient use of primary zone volume in annular combustor is desired. An important component in improving the mixing within the primary zone of the combustor is creating high swirl, while minimizing the amount of components. Furthermore, typical combustion systems deploy a relatively low number of discrete fuel nozzles which individually mix air and fuel as the fuel/air mixture is introduced into the combustion zone. Improvement is desirable.


A substrate 1 for growing an electro-optical single crystal thin film in which two or more layers of buffer layers 3, 4, and 5 for buffering lattice mismatch between Si and BTO are formed on an Si (001) substrate 2 is provided as a substrate for growing an electro-optical single crystal thin film which can obtain an electro-optical single crystal thin film of BTO single crystal thin film 6 etc. with a large size and a very high quality.

1. Field of the Invention
The present invention relates to a substrate used for epitaxially growing an electro-optical single crystal thin film made of BaTiO3 (BTO: barium titanate), PbTiO3, BiKTiO3 etc., used for an optical switch, an optical modulator, etc., and a method of manufacturing the same.
2. Description of the Related Art
A BTO single crystal is a transparent crystal made of Ba (barium), Ti (titanium), and O (oxygen), and is known as a material that provides a very large secondary electro-optical effect (Kerr effect) which determines an efficiency of an optical device.
As for the above-mentioned BTO single crystal, it is known that a BTO single crystal thin film is formed on an Si (001) (silicon, (001) face) substrate via an MgO (magnesium oxide) single crystal layer as a buffer layer for buffering lattice mismatch between Si and BTO (see J. Mater. Res., Vol.12, No.4, pp 1152-1159, April 1997).
However, in the above-mentioned BTO single crystal, the lattice mismatch between Si and BTO is not fully relieved, so that BTO is polycrystallized, making it difficult to manufacture the optical device.

Substrate for growing electro-optical single crystal thin film and method of manufacturing the same


To provide a non-aqueous electrolyte secondary battery adapted to prevent an internal short circuit between an positive electrode and a negative electrode caused by the penetration of electrically conductive micro particles through a separator, which occurs when winding up electrodes, and manufacturing methods of an electrode used therein, whereby the non-aqueous electrolyte secondary battery having a coiled electrode assembly is formed through the multilayer winding of an positive electrode 90 having a metallic collector 76 coated with an positive electrode mixture 78 composed of an positive electrode active material that occludes and liberates lithium ions, a negative electrode 86 having a metallic collector 82 coated with a negative electrode mixture 84, composed of a negative electrode active material that occludes and liberates lithium ions, and a separator 72 interposed between the positive electrode and the negative electrode, wherein the positive electrode 90 has an insulating layer 100 formed by means of the dried coating method, the heat seal tape method, or the hot melt coating method on a portion of the metallic collector 76 which is uncoated with the positive electrode mixture 78 and opposed to the negative electrode 86 coated with the negative electrode mixture 84, through the separator 72.

Because of their continued rise in growth and development, the specification requirements for batteries used in portable electronic devices has increasingly become more rigid. In particular, batteries having a smaller and thinner size, a high capacity and an excellent cycle characteristic, and a stable performance are in demand. In the field of secondary batteries, the lithium non-aqueous electrolyte secondary battery has spawned a lot of interest because it has a higher energy density than other types of batteries, such that its market share in the secondary battery market continues to grow.
The lithium non-aqueous electrolyte secondary battery comprises a negative electrode, which is a strip of negative electrode collector (current collector), such as copper foil, with both surfaces thereof coated with a negative electrode active material mixture; an positive electrode, which is a strip of positive electrode collector, such as aluminum foil, with both surfaces coated with an positive electrode active material mixture; and a separator, such as micro-porous polypropylene film or the like, interposed between the electrodes. The negative electrode and positive electrode are coiled, each insulated from the other by the separator to form a cylinder or an elliptical cylinder, and if the coiled electrode assembly is for a square-shaped battery, it is pressed flat. The negative electrode and positive electrode are then connected at a predetermined part of the electrode, to a negative electrode or positive electrode terminal lead, respectively, and finally, the assembly is housed in a container of a predetermined shape.
In the manufacture of the coiled electrode assembly, the negative electrode and positive electrode are provided by slitting a negative electrode sheet and an positive electrode sheet, respectively, and thereafter coil around a mandrill. However, the cutting of the negative electrode and positive electrode sheets causes burrs to form at the cut ends thereof, that is, the cut ends of the negative electrode collector and the positive electrode collector made of metal, such that when the coiled electrode assembly is pressed flat, the burrs penetrate the separator to electrically couple the negative electrode and positive electrode, producing a short circuit. This short circuit generates an abnormal amount of heat during use of the battery, lowering the capacity thereof, thereby shortening its service life.
Hence, Japanese laid-open Patent Application No.10-241737, paragraphs 18 to 27, paragraphs 40 to 50, FIG. 1, FIG. 5, and FIG. 7, thereof (Related Art Document 1), and Japanese laid-open Patent Application No.2002-42881, right column of page 3 through left column of page 4, and FIG. 8, thereof (Related Art Document 2), for example, disclose non-aqueous electrolyte secondary batteries that determine the position of the negative electrode when the coiled electrode assembly is formed by multilayer-winding of the positive electrode and the negative electrode with a separator interposed there between, and a predetermined insulating tape, whose thickness is greater than the length of burrs on the positive electrode and/or negative electrode that may cause a short circuit with the electrodes when the coiled electrode assembly is formed, and is attached to at least one surface of the negative electrode whose position has been determined, where a short circuit with the positive electrode may occur, wherein the negative electrode is opposed at least to the positive electrode terminal lead. The non-aqueous electrolyte secondary battery electrode and the manufacturing method thereof disclosed in Related Art Document 1 are explained hereinafter with reference to FIG. 8.
FIG. 8 shows the construction of a coiled electrode assembly of the non-aqueous electrolyte secondary battery disclosed in Related Art Document 1. A mandrill 70 holds the folded ends of two separators 72 and 74, which are strips of insulating sheet. An positive electrode collector 76 has an positive electrode active material mixture layer 78 formed on both surfaces of the middle part thereof, and is exposed on both surfaces near the end CT, to which the positive electrode active material mixture layer is not applied. An positive electrode terminal lead 80 is coupled to the exposed part of the positive electrode collector 76. A negative electrode collector 82 has a negative electrode active material mixture layer 84 formed on both surfaces of the middle part thereof, and is exposed on both surfaces near the end CT, to which the negative electrode active material mixture is not applied.
The positive electrode collector 76 is coiled between the mandrill 70 and the separator 72, and the negative electrode collector 82 is coiled while interposed between the two separators 72 and 74. The positive electrode terminal lead 80 is coupled to the surface, facing the mandrill 70 of the positive electrode collector 76 that is opposed to the end CT of the negative electrode collector 82 through the separator 72. That is, part of the positive electrode collector 76 (to which the positive electrode terminal lead 80 is coupled), is opposed to the end CT of the negative electrode collector 82 through the separator 72.
In the above-mentioned construction, any of the following measures may be adopted to prevent a short circuit from occurring between the positive electrode collector 76 and the negative electrode collector 82:
(1) To cover with an insulating material 88, a part of the surface of the positive electrode collector 76 (to which the positive electrode terminal lead 80 is coupled), which is opposed to the end CT of the negative electrode collector 86 through the separator 72.
(2) To cover with an insulating material 92, either surface facing the positive electrode collector 90 or the negative electrode collector 86 of the separator 72 that exists between a part of the positive electrode collector 76, to which the positive electrode terminal lead 80 is connected, and a part of the negative electrode collector 86 which opposes the above-mentioned part of the positive electrode collector 76 and is near the end CT.
(3) To cover with an insulating material 94, a part of the surface of the negative electrode collector 86 that is near the end CT and is opposed to a part of positive electrode collector 76 where the positive electrode terminal lead 80 is coupled, through the separator 72.
In this case, it is sufficient to provide one of the above-mentioned measures. That is, covering the positive electrode collector 76 with insulating material 88 prevents the burrs on the positive electrode terminal lead 80 from damaging the separator 72, while covering the negative electrode collector 82 with insulating material 94 also prevents the burrs on the positive electrode terminal lead 80 from causing a short circuit even if the burrs penetrate the separator 72. Further, covering either surface of the separator 72 with insulating material 92 also produces the same effects as above-mentioned. The application of insulating material 88, 92, or 94 either by means of a resin coating or an insulating adhesive tape will produce the above-described effects. The use of an adhesive insulating tape however is preferred.

Non-aqueous electrolyte secondary battery and manufacturing methods of an electrode used therein


The present invention discloses a method for manufacturing a fringe field switching mode liquid crystal display device. Here, a counter electrode, gate bus line and common electrode line are formed by one photolithography process including: a first process for coating a resist film on the MoW film; a second process for forming a resist pattern consisting of first and second patterns respectively covering gate bus line and common electrode line formation regions and maintaining a coating thickness, and a third pattern covering a counter electrode formation region and partially maintaining the coating thickness, by exposing/developing the resist film; a third process for forming the gate bus line and the common electrode line by dry-etching the MoW film using the resist pattern as an etch barrier, the first and second patterns being partially removed, the third pattern being completely removed, the MoW film on the counter electrode formation region being partially removed; a fourth process for forming the counter electrode by wet-etching the ITO film using the remained resist pattern and MoW film as an etch barrier; and a fifth process for removing the remained resist pattern and MoW film.

1. Field of the Invention
The present invention relates to a method for manufacturing a liquid crystal display device, and in particular to a method for manufacturing a fringe field switching mode liquid crystal display device which can reduce a manufacturing time and cost.
2. Description of the Background Art
An in-plane switching (IPS) mode liquid crystal display device has been suggested to improve a narrow field angle of a TN mode liquid crystal display device. As publicly known, in the IPS mode liquid crystal display device, a counter electrode and a pixel electrode for driving a liquid crystal are aligned in parallel on an identical substrate. The field angle is improved according to a major axis of liquid crystal molecules, regardless of a direction in which a user watches a screen. The IPS mode liquid crystal display device has a wider field angle than the TN mode liquid crystal display device. However, the counter electrode and the pixel electrode consist of an opaque metal, and thus its aperture ratio and transmittance are poor.
Accordingly, in order to improve the aperture ratio and transmittance of the IPS mode liquid crystal display device, there has been taught a fringe field switching mode liquid crystal display device(hereinafter, referred to as xe2x80x98FFS mode LCDxe2x80x99) wherein the liquid crystal molecules are driven by a fringe field.
In the FFS mode LCD, the counter electrode and the pixel electrode consist of a transparent material such as an indium tin oxide (ITO), and an interval between the counter electrode and the pixel electrode is smaller than an interval between upper and lower substrates. In addition, the counter electrode and the pixel electrode have a sufficient width so that the liquid crystal molecules on the electrodes can be all driven. Since the electrodes consist of the transparent material, the FFS mode LCD obtains a more improved aperture ratio than the IPS mode LCD. Moreover, the light permeability occurs in the electrodes, and thus the FFS mode LCD obtains a more improved transmittance than the IPS mode LCD.
FIG. 1 is a cross-sectional diagram illustrating the lower substrate in the conventional FFS mode LCD. A method manufacturing the FFS mode LCD will now be described with reference to FIG. 1.
An ITO film is deposited on a glass substrate 1. The ITO film is patterned according to a first photolithography process, thereby forming a counter electrode 2 in a plate shape. An MoW film is deposited on the counter electrode 2 and the glass substrate 1 and then the MoW film is patterned according to a second photolithography process, thereby forming a gate bus line 3 and a common electrode line 4.
A gate insulating film 5 is formed over the resultant structure. An undoped amorphous silicon film and a doped amorphous silicon film are sequentially deposited on the gate insulating film 5 and then the doped amorphous silicon film and the undoped amorphous silicon film are patterned according to a third lithography process, thereby forming an ohmic contact layer 7 and a channel layer 6. A metal film for source/drain is deposited over the resultant structure. The metal film is patterned according to a fourth lithography process, thereby forming a data bus line(not shown) including source and drain electrodes 8a, 8b. As a result, a thin film transistor (TFT) is formed.
A passivation film 9 is deposited over the resultant structure. Thereafter, the passivation film 9 is etched according to a fifth photolithography process so that the source electrode 8a can be partially exposed. An ITO film is deposited on the passivation film 9 and then patterned according to a sixth photolithography process, thereby forming a comb-shaped pixel electrode 10 having a few branches and contacting with the source electrodes 8a of the TFT.
However, the conventional method for manufacturing the FFS mode LCD has a disadvantage in that six photolithography processes are performed to form the lower substrate, which results in an increased manufacturing time and cost.
In more detail, the photolithography process includes a process for forming a resist pattern such as resist coating, exposure and development processes, an etching process using the resist pattern, and a process for removing the resist pattern. Therefore, even one photolithography process takes a long time. Accordingly, the conventional method for manufacturing the FFS mode LCD by performing the six photolithography processes is not advantageous in productivity. In addition, the etching process requires a mask for exposure that is very expensive. Thus, the six photolithography processes require six masks for exposure. As a result, the conventional method for manufacturing the FFS mode LCD is not advantageous in cost, either.
Therefore, an object of the present invention is to provide a method for manufacturing a fringe field switching mode liquid crystal display device which can reduce a manufacturing time and cost.
In order to achieve the above-described object of the present invention, a method for manufacturing a fringe field switching mode liquid crystal display device includes the steps of: forming a counter electrode, a gate bus line and a common electrode line at the same time, by sequentially depositing an indium tin oxide film and an MoW film on a glass substrate, and patterning the MoW film and the ITO film according to a first photolithography process; depositing a gate insulating film over the resultant structure; forming a stacked channel layer and ohmic contact layer on a predetermined portion of the gate insulating film, by using a second photolithography process; forming a data bus line including source/drain electrodes on the ohmic contact layer and the gate insulting film, by using a third photolithography process; forming a passivation film to expose the source electrode over the resultant structure, by using a fourth photolithography process; and forming a pixel electrode of a comb shape in contact with the source electrode on the passivation film, by using a fifth photolithography process, wherein the first photolithography process comprises: a first process for coating a resist film on the MoW film; a second process for forming a resist pattern consisting of first and second patterns respectively covering gate bus line and common electrode line formation regions and maintaining a coating thickness, and a third pattern covering a counter electrode formation region and partially maintaining the coating thickness, by exposing and developing the resist film; a third process for forming the gate bus line and the common electrode line by dry-etching the MoW film using the resist pattern as an etch barrier, the first and second patterns being partially removed, the third pattern being completely removed, the MoW film on the counter electrode formation region being partially removed; a fourth process for forming the counter electrode by wet-etching the ITO film using the remained resist pattern and MoW film as an etch barrier; and a fifth process for removing the remained resist pattern and MoW film.

Method for manufacturing fringe field switching mode liquid crystal display device


A method of manufacturing a build-up printed circuit board, in which the circuit of a build-up printed circuit board including a core layer and an outer layer is realized by forming the metal seed layer of the core layer using a dry process, consisting of ion beam surface treatment and vacuum deposition, instead of a conventional wet process, including a wet surface roughening process and electroless plating. When the wet process is replaced with the dry process in the method of the invention, the circuit layer can be formed in an environmentally friendly manner, and as well, all circuit layers of the substrate including the core layer and the outer layer can be manufactured through a semi-additive process. Further, the peel strength between the resin substrate and the metal layer can be increased, thus realizing a highly reliable fine circuit.

1. Field of the Invention
The present invention relates, in general, to a method of manufacturing a build-up printed circuit board (build-up PCB), and more particularly, to a method of manufacturing a build-up PCB, in which the core circuit layer of a build-up PCB is formed through a dry metal seed layer forming process including ion beam surface treatment and vacuum deposition, thereby realizing a highly reliable fine circuit in an environmentally friendly manner.
2. Description of the Related Art
Presently, build-up PCBs have been manufactured using a subtractive process, a modified semi-additive process (MSAP), and a semi-additive process (SAP).
In particular, a subtractive process is applied to HDI (high density interconnection) products, and a subtractive process and MSAP are applied to UT-CSP (ultra thin-chip scale package) and BGA (ball grid array) products. Further, in the case of FCBGA (flip chip BGA), a core layer and a build-up outer layer including 2F2B/3F3B are formed using a subtractive process and SAP, respectively, and furthermore, a seed layer is formed through electroless plating, thereby realizing a fine circuit.
In this regard, according to a first conventional technique, FIGS. 1A and 1B are flowcharts respectively illustrating the processes of forming the core layer and the outer layer of a build-up PCB.
With reference to FIG. 1A and FIGS. 2A to 2G, the method of forming the core layer of the build-up PCB using a subtractive process according to the first conventional technique is described below.
First, a resin substrate 11 having metal layers 12 laminated on both surfaces thereof is subjected to typical etching and drilling to thus form a through hole 13 (FIGS. 2A and 2B). Subsequently, the surface of the substrate having the through hole 13 is subjected to desmearing and then electroless plating to thus form an electroless metal layer 14 (FIG. 2C). Through electroplating, a metal panel plating layer 15 is formed (FIG. 2D). The through hole 13 is filled with a conductive paste 16 (FIG. 2E), after which a dry film 17 is applied on a predetermined region corresponding to a circuit pattern, including the through hole 13 (FIG. 2F). The unnecessary portions of the metal layers are removed through typical exposure/development and etching, and then the dry film 17 is removed, thus completing the procedure for forming the core circuit layer (FIG. 2G). Before the following outer layer forming process is performed, the substrate is subjected to typical surface treatment, such as CZ treatment, as known in the art, and then an insulating layer is laminated thereon (not shown).
In addition, with reference to FIG. 1B and FIGS. 3A to 3F, the process of forming the outer layer of the build-up PCB using MSAP according to the first conventional technique is described below. For convenience, the description of the build-up process on the core layer is omitted, and only the outer layer forming process is described.
First, a resin substrate 21 having metal layers 22 laminated on both surfaces thereof is half-etched and then subjected to typical etching and drilling to thus form a blind via hole 23 (FIGS. 3A and 3B). Thereafter, the surface of the substrate having the blind via hole 23 is subjected to desmearing and then electroless plating to thus form an electroless metal layer 24 (FIG. 3C). Thereafter, a dry film 26 is applied on a predetermined region, other than the region corresponding to a circuit pattern, including the via hole 23 (FIG. 3D). Using the dry film as a resist, a metal pattern plating layer 27 is formed through electroplating (FIG. 3E). Thereafter, the dry film 26 is removed, and the unnecessary portions of the metal layers are removed through flash etching, thus completing the patterning process (FIG. 3F).
According to a second conventional technique, the processes of forming the core layer and the outer layer of a build-up PCB are illustrated in flowcharts of FIGS. 4A and 4B, respectively.
With reference to FIG. 4A and FIGS. 5A to 5G, the process of forming the core layer of the build-up PCB using a subtractive process according to the second conventional technique is described below.
First, a resin substrate 31 including metal layers 32 having a thickness of about 12 μm laminated on both surfaces thereof is subjected to typical etching and drilling, thus forming a through hole 13 having a diameter of about 350 μm (FIGS. 5A and 5B). Subsequently, the surface of the substrate having the through hole 33 is subjected to desmearing and then electroless plating, thus forming an electroless metal layer 34 about 1˜3 μm thick (FIG. 5C). Through electroplating, a metal panel plating layer 35 about 18 μm thick is formed (FIG. 5D). The through hole 33 having the electrolytic metal layer 35 is filled with a conductive paste 36 (FIG. 5E), after which a dry film 37 is applied on a predetermined region corresponding to a circuit pattern, including the through hole 33 (FIG. 5F). The unnecessary portions of the metal layers are removed via typical exposure/development and etching, and then the dry film 37 is removed, thereby completing the procedure for forming the core circuit layer (FIG. 5G). Before the following outer layer forming process progresses, the substrate is subjected to typical surface treatment, such as CZ treatment, as known in the art, and then an insulating layer is laminated thereon (not shown).
In addition, with reference to FIG. 4B and FIGS. 6A to 6F, the process of forming the outer layer of the build-up PCB using SAP according to the second conventional technique is described below. For convenience, the description of the build-up process on the core layer is omitted, and only the outer layer forming process is described.
First, a resin substrate 41 having metal layers 42 laminated on both surfaces thereof, for example, an ABF (Ajinomoto Build-up Film) about 35 μm thick, is subjected to typical etching and drilling to form a blind via hole 43 having a diameter of about 75 μm (FIGS. 6A and 6B). Then, the surface of the substrate having the blind via hole 43 is subjected to desmearing and then electroless plating, therefore forming an electroless metal layer 44 about 1±0.3 μm thick (FIG. 6C). Then, a dry film 45 is applied on a predetermined region, other than the region corresponding to a circuit pattern including the blind via hole 43 (FIG. 6D). Using the dry film as a resist, a metal pattern plating layer 46 is formed through electroplating (FIG. 6E). Then, the dry film 45 is removed, and the unnecessary portions of the metal layers are removed through flash etching, thus completing the patterning process (FIG. 6F).
As such, examples of the material for resin substrate depending on the type of product include epoxy resins, such as FR-4, BT (Bismaleimide Triazine), ABF, etc.
For instance, in the case of BGA and UT-CSP produced through a subtractive process and MSAP, which comprises a BT insulating material, the surface profile of the material is at least 1 μm, and in the subtractive process, a fine circuit having a pitch not larger than 80 μm (line/space=40/40 μm) is difficult to realize. In the MSAP, since the thickness of the metal layer varies due to half-etching, a fine circuit having a pitch on the order of about 50 μm (line/space=25/25 μm) may be obtained.
In the group of FCBGA products, the core layer is typically formed using an FR-4 resin substrate through a subtractive process to thus realize a circuit having a pitch of about 100 μm (line/space=50/50 μm), and the build-up outer layer is prepared using an ABF resin substrate through SAP to attain a fine circuit having a pitch of about 36 μm (line/space=18/18 μm). As such, however, the fine circuit of the core layer is difficult to realize, attributable to the surface roughness of the resin substrate material and the limitation of the subtractive process itself.
Further, in the group of FCBGA products, in which a multilayered substrate is manufactured using an ABF insulating material through SAP, as illustrated in FIG. 7, a subtractive process is applied to a core layer (which is composed of 1st˜2nd layers 52a, 52b), and SAP is applied to an outer layer (which is composed of 3rd˜6th layers 55a, 55b, 57a, 57b). In particular, in order to form the circuit, the outer layer forming process, comprising electroless plating for forming a seed layer about 1˜3 μm thick, plating, stripping, and flash etching, is repeated two times. Thereby, via holes 53 and circuit patterns 52a, 52b, 55a, 55b, 57a, 57b are formed in resin substrates 51, 54a, 54b, 56a, 56b. Subsequently, an solder resist 58a, 58b is applied and a solder resist open part 59a, 59b is formed. Thereby, a FCBGA having a total of six layers is completed.
However, the use of expensive ABF material results in increased process cost and thus a high product price. In the case in which the SAP is applied, the surface profile of the ABF material is at least 1 μm, leading to a large surface roughness and a pitch of 36 μm (line/space=18/18 μm). Further, there are limitations in realizing a fine circuit through wet surface treatment and electroless chemical plating.
With the demand for light, slim, short and small PCBs, many manufacturers have attempted to develop insulating material for realizing a fine circuit and exhibiting high functionality in order to increase signal transfer rates on circuits. According to the above development trend, the number of signals that are input and output is increased, and thus highly reliable fine circuit is required. However, conventional SAP suffers because a metal seed layer is formed through a wet process including wet surface treatment and electroless plating, undesirably increasing the surface roughness, thus making it impossible to realize a fine circuit. As well, a large amount of waste is generated, causing environmental problems.

Method of manufacturing build-up printed circuit board


The invention disclose: Chinese spelling scheme, Chinese alphabetic writing and Phonetic Symbols scheme. The Chinese spelling scheme which is used English letters to mark the tones, it is reduced to 5 sound symbols of the monosyllabic words from 6 spelling letters of other schemes at most. Between the syllables is clearly demarcated. It can be used as marks in sound and tone for Chinese characters, and also can form an alphabetic writing independently which follows the law of international languages. It's highly integrated with word, sound, and code which can be displayed each other and converted each other. It can be translated directly with the Chinese-language sentence and foreign languages. The Phonetic Symbols do not go beyond the range of 26 letters and symbols of common used English keyboard, which can not only be used to mark in English and other languages, but also can be used as a phonetic symbol written language independently.

1. Field of the Invention
This scheme relates to a kind of Gugq's Chinese Spelling scheme, Gugq's Chinese Alphabetic Writing scheme an Gugq's Phonetic Symbols scheme. Gugq's Chinese Spelling and Gugq's Phonetic Symbols do not go beyond the range of 26 letters and symbols in the commonly used general English keyboard. Gugq's Chinese Spelling can be used not only in the marking of sound and tone of the Chinese characters, but also can form an alphabetic writing independently. It matches international languages, and makes word, sound and code highly integrated. The Chinese characters and Gugq's Chinese Spelling words can be displayed and converted into each other. Gugq's Phonetic Symbols not only can be used to mark English, and other languages, but also can form the phonetic symbol writing independently.
2. Description of the Prior Art
The Chinese character (Chinese square picture character) is one of the oldest characters in the world. At present, according to relevant statistics, the population of using the Chinese character accounts for more than 36% of the total population in the world. In Chinese characters, there are about 1,550 Chinese character components (shape and sound components), which are made from five kinds of basic strokes. Then more than 100,000 Chinese characters are made up from these basic character components. The amount of Chinese characters have accumulated up to 150,000 from ancient times to the present (The Chinese-language Variant Form of Chinese Character Dictionary collected 106,152 characters).
The GB Code 18030-2000 which is used in Chinese Mainland has 27,533 characters, the Big5+ Code used in Taiwan has collected 51,585 characters. In addition, on the basis of Big5, "The Hong Kong Augmented Character Collection" used in Hong Kong has added 4,702 Chinese characters including dialects of Guangzhou, which is used together with Big5. Chinese characters and English letters are the most basic units of the spoken and written languages. Vocabularies and sentences which transmit different kinds of information are formed from the units. We can say they are the carrier of information. In order to make the quantitative analysis for every Chinese character or English letter of carried messages, modern informatics weigh up the average amount of information with entropy. Entropy shows the uncertainty of a symbol appearing. The unit used is a Bit. Some linguists get a conclusion through calculating, which says the entropy of an English letter is 4.03 Bits (in alphabetic writing a letter is usually within 4.35 Bits), while the entropy of a Chinese character is 9.65 Bits. This indicates that a Chinese character needs more space for storage and more time for transmission. An alphabetic writing which has much less symbols, words with letter combinations spells one-dimensionally in a linear permutation from left to right. But the Chinese character has too many symbols, combinations of strokes and components which make up a two-dimensional surface type "square". There is much higher degree of difficulty than alphabetic writing in teaching, using, machine translation etc.
Every character of the Chinese character is a picture. Mostly, between the pictures there are no rules to follow. The shortcoming of the Chinese character can be rated "three in quantities and five in difficulties": Large quantity of characters, strokes, pronunciations, therefore it is difficult to recognize, read, write, remember and use. The Chinese character can not be input through the commonly used English keyboard directly. That's why there are about 6,000 kinds of Chinese character inputting methods. In China, Taiwan and Hong Kong, every organization has to hire a professional "typist" to input Chinese characters into a computer. Most of the none-spoken Chinese people studying the Chinese character have little success even though they try for many years. People describing something very difficult, would say "As difficult as learning Chinese".
According to a relevant study about the simplified Chinese character used in Chinese Mainland, to compare learning the Chinese character with only learning alphabetic writing, one should spend four more years in one's life to learn the Chinese character. Meanwhile, one must often "keep reciting to remember from time to time" in order to maintain the degree of familiarity in reading and writing Chinese characters. In fact, this way of "forced to remember" has run through each user's life. Some relevant results of study indicate that the reading amount of children under the age of 8 in English speaking and writing nations is equivalent to 6 times that of the children of the same age in China.
According to the recent statistics that the Chinese Ministry of Education announced in China, the adult illiteracy rate of Chinese Mainland account for 8.72% of the adult population. The illiterate number is up to 85 millions, and the whole country has the trend of increasing about 500,000 illiterates every year. That means in China there is one of every 10 illiterate of the world. There is one illiterate of 15 Chinese—the direct reason is because of the complicatedness of the Chinese character. The national power of many countries is weaker than that of China, but because of using alphabetic writing, the illiteracy rate is much lower than China.
The international community has to pay a price for the Chinese character too. If disregarded symbols and private codes, among Unicode, the system of spelling, syllable, and pronunciation of the world only 8,192 points need to be distributed, but in the only one language which is not writing with letters—the Chinese character, 45,056 points need to be distributed. Some language philologists say: "the Chinese character is the last living fossil in the human characters' history"; "Entering the era of information, the using of the Chinese character has already become the irrational, inefficient primitive mode".
The scheme of the Chinese Phonetic transcription (Hanyu Pinyin) which is used now in Chinese mainland was made out in 1958, it was developed on the basis of various kinds of phonetic notation rules of the past. In order to solve the problem of too complicated Chinese characters, from 1950s the Chinese government had been organizing a lot of reform experts to launch the design of "alphabetic writing of Chinese". Decades passed, huge manpower and money were spent on it. The Committee for Reforming the Chinese Written Language had altogether received 655 kinds of schemes for the Chinese Phonetic transcription which were referred by the people from all walks of life. And more than 4,000 letters from the domestic and international masses. But the committee failed to obtain a satisfactory result, then declared to give up finally. So the subject of Chinese alphabetic writing is the very difficult problem that the numerous Chinese characters experts failed to solve.
Both of "The scheme of Hanyu Pinyin (which is used in Chinese mainland)" and "The scheme of Tongyong Pinyin (which is used in Taiwan)", have the similarity up to more than 85%. The commonly used computer keyboard is designed by English letters, because of the tone marks:  , ´, {hacek over ( )}, {grave over ( )}, in "Hanyu Pinyin" and "Tongyong Pinyin", and the simple vowel ü in "Hanyu Pinyin", there is no way for directly inputting. The letters or the letter combinations (such as: q, x, zh, ch, sh, ao, ou, ong, etc.), do not correspond to the spelling rules of the International Phonetic Symbols, and there are too many differences from the pronunciations of English spelling. At present, the scheme of "Hanyu Pinyin" has left only one function which is to mark the tones for the Chinese character. In fact, both of "Hanyu Pinyin" and "Tongyong Pinyin" are just semi-Romanized schemes, they can't be integrated with the international spoken and written languages due to various reasons.
In Chinese alphabetic writing, the spelling of the quoted non-Chinese words and phrases should return to the form of original Latin alphabet, and the pronunciations should be marked with phonetic symbols if necessary. At present, English and the world's other main languages have commonly used phonetic notation systems such as: IPA, KK, Webster, Oxford etc. The existing Chinese phonetic notation systems have a lot of letters and symbols which cannot be directly input in the commonly used English keyboard, and bring inconvenience to users in the whole world.
Therefore no matter in China, or in the international community, a standard Chinese alphabetic writing and a special kind of phonetic symbols are needed urgently to match the standard English keyboard for directly inputting, and to accord with the current international language spelling. Furthermore, because the pronunciations and spellings of English or other languages do not always correspond, one way is needed to turn an international popular language into an international phonetic symbol writing at the same time.
In most of syllables of Chinese characters, one syllable corresponds to a lot of monosyllabic characters. In fact, each square character is a monosyllable. Right now, there are 415 syllabic forms (the 4 tone marks neglected) for spelling the square characters. If spelling with the 415 syllables, there are lots of corresponding characters at the same shape spelling (repeated codes). In commonly used contemporary Chinese, the vocabularies are nearly 50,000. If spelling these 50,000 words with 415 syllabic forms, the same shape spelling words are nearly 15,000, the proportion is 30%; If spelling in the form of 1,350 syllables (with tone marks), the same shape spelling words are still nearly 4000, the proportion is 8%. As we know, even spelling with tone marks, the proportion of the same shape words is still very high; Because of the wording uniqueness in a much higher degree, the Indo-European family languages have only about 3% in proportion of the same shape words.
Some Chinese alphabetic writing schemes once used with "a different way of spelling" to split up the words and form a pattern of each word for the same sound with the same tone words, namely many kinds of spelling ways were used for the same syllable (for instance: cao, the different spellings were "cau, caw, tsao, tsau, tsow, tzao, tzau, tzaw, ccao, ccau, ccaw", etc.). If using dozens of different spelling forms to split up and form an unique pattern for each word for every Chinese syllable and using the same way for several tens of thousands of words and phrases of the Chinese language, learners need to spend a lot of time to get forced to remember the very large amount of the designated words, it is very hard for them to bear the burden in memory. Therefore the Chinese alphabetic writing should use a scientific method to split up and form an unique pattern for each word effectively without using "different letters combination spelling" to discriminate the monosyllable and multiple syllabic words with the same sound and the same tone (homonym). The Chinese alphabetic writing must be very easy and accurate in two-way machine translation with a popular language such as English in the world.