A method of manufacturing a thin film semiconductor device which includes a thin film transistor having a first semiconductor layer, a gate insulating layer, and a gate electrode which are laminated in this order on a substrate, and a capacitive element having a lower electrode that conductively connects a second semiconductor layer coplanar with the first semiconductor layer, a dielectric layer coplanar with the gate insulating layer, and an upper electrode coplanar with the gate electrode which are laminated in this order on the substrate is provided. The method includes, after simultaneously forming the gate insulating layer and the dielectric layer, and before forming the gate electrode and the upper electrode, introducing dopants into the second semiconductor layer from a first opening of a mask formed on a surface of the substrate to form the lower electrode, and etching a surface of the dielectric layer from the first opening of the mask.

The present invention relates to a thin film semiconductor device having thin film transistors (hereinafter, referred to as TFT) and capacitive elements provided on the same substrate, to a method of manufacturing thereof, to an electro-optical device using the thin film semiconductor device as a substrate for the electro-optical device, and to an electronic apparatus having the electro-optical device. More specifically, the present invention relates to a technology of manufacturing a capacitive element having a high capacitance.
In the case of manufacturing a thin film transistor device having TFTs and capacitive elements provided on the same substrate, when a semiconductor layer coplanar with the TFT semiconductor layer is made be conducted to form an electrode, an insulating layer coplanar with a gate insulating layer is used to form a dielectric layer, and a conductive layer coplanar with a gate electrode is used to form an upper electrode, the TFT and the capacitive elements can be provided through the reduced number of processes. This arrangement has been widely used in a device substrate of a liquid crystal device (electro-optical device) that uses TFT as a nonlinear device for switching devices, and various thin film semiconductor devices.
However, for the capacitive element, when the dielectric layer becomes thinner, a larger electrostatic capacitance can be obtained, whereas for the TFT, when the gate insulating layer becomes thinner, the electric strength is reduced. Thus, an arrangement in which the insulating layer formed at the same time with the dielectric layer is thinned to form the dielectric layer, for the capacitive element, is disclosed (for example, refer to Japanese Unexamined Patent Application Publication No. 6-130413)
However, when the thickness of a dielectric layer of the capacitive element and the thickness of the gate insulating layer of the TFT are different from each other, a mask should be added in order to make the dielectric layer of the capacitive element be thinner by etching. For this reason, it is necessary to add each of a mask formation process and a mask removal process. Therefore, there is a problem in that productivity is lowered.

Method of manufacturing thin film semiconductor device, thin film semiconductor device, electro-optical device, and electronic apparatus


A shredder for shredding a by-product, such as sprue, runner and the like generated when molding a thermoplastic synthetic resin product, into recyclable shredded pieces, is structured such that front and rear oscillating side walls are openable, right and left stationary side walls are connected by two support shafts and one connection member, and two support shafts serve as pivot axes of the oscillating side walls and connection members connecting the right and left stationary side walls.

In conventional, the following structure is known as this kind of shredder.
There has been known a shredder comprising:
a lower casing which has an outlet in a lower portion and is formed in a rectangular plan shape;
an upper casing which is provided on the lower casing so as to be freely opened and closed by vertically oscillating movement, and is formed in a rectangular plan shape;
a rotary shaft which is rotatably provided between right and left side walls of the lower casing in the state of the axis thereof being in a lateral direction, and has a rotary blade;
a stationary blade which is provided in an inner side of a front wall of the upper casing and shreds a subject to be treated in cooperation with the rotary blade; and
a scraper which is provided in an inner side of a rear wall of the upper casing,
wherein the rotary blade is positioned between the stationary blade and the scraper (refer to Japanese Unexamined Utility Model Publication No. 6-16016).
The conventional shredder has the following defects.
Since the upper casing is freely opened and closed by oscillating movement with respect to the lower casing, however, the lower casing and the upper casing are formed in the rectangular frame shape in the plan view, there has been a defect that it is hard to perform a maintenance and a cleaning.


A filter for passing tobacco smoke or other gaseous material comprising two layers of material having a plurality of circuitous or serpentine passageways forming pathways through which tobacco smoke travels a distance greater than the length of the filter itself. The filter is constructed by coating the layers with an adhesive except in the areas forming the passageways so that when the two layers are fastened together, there are unobstructed paths through the layers of material. The combined layers are rolled into a cylindrical construct. In an alternative embodiment, one or more cavities are formed along the passageways.

Smoking tobacco is more pleasant when the tobacco smoke is filtered and cooled. Filters are usually constructed from fibrous products to restrict the size of particles that pass from the tobacco to the smoker.
The invention increases the distance the tobacco smoke travels from the tobacco to the smoker. It can also be constructed of a material that cools the smoke and condenses the moisture therein before it reaches the smoker. The filters can be easily manufactured and the materials used can be recycled instead of being discarded as is the case with present filter materials.
According to the invention, a first layer of material is coated with an adhesive except in a plurality of areas forming passageways having several circuitous or serpentine paths, each having a length greater than the width of the layer material from one edge to the opposite edge, i.e., having a length greater than that of the filter itself.
A second layer of material is arranged similarly to the first layer and is affixed thereto with its described passageways being a mirror image of the passageways of the first layer so as to align to form a plurality of continuous circuitous passages through which the tobacco smoke travels from one end of the material to the other. The affixed layers are rolled into a cylindrical shape to form a smoking filter.


A differential thermal analysis sensor consisting of two low-impedance differential thermopiles. Each thermopile consists of a series of thermocouples joined in series, with the measuring junctions of the thermocouples arranged around a uniform temperature measuring region, and the thermoelectric reference junctions of the thermocouples arranged around a uniform temperature thermoelectric reference region. The differential thermal analysis sensor can be used for single-sample heat flux differential thermal analysis measurements, dual-sample heat flux differential thermal analysis measurements, or power compensation differential thermal analysis measurements.

1. Field of the Invention
This invention relates to sensors used in differential thermal analyzers such as differential scanning calorimeters.
2. Background of the Invention
Differential thermal analyzers measure the difference in temperature between a sample material and a reference material, as the sample and reference materials are subjected to dynamic controlled changes of temperature. Measurement of the dynamic temperature difference as a function of temperature provides qualitative information concerning physical transformations which occur in the sample material. Differential scanning calorimeters are differential thermal analyzers which provide quantitative information about physical transformations occurring in the sample by measuring the flow of heat to or from the sample.
Differential scanning calorimeters fall into two broad classes of instruments: heat flux instruments and power-compensated instruments. Heat flux differential scanning calorimeters measure the dynamic temperature difference between a sample material and a reference material. Because the dynamic temperature difference is proportional to the heat flow to (or from) the sample, the heat flow to (or from) the sample is obtained from the dynamic temperature difference. Power compensated differential scanning calorimeters control the flow of heat to the sample material and reference material separately. The flow of heat is controlled so as to maintain the temperature of the sample material at the temperature of the reference material during physical transformations in the sample material. The heat flow to (or from) the sample material is calculated from the difference between power supplied to the sample material and the power supplied to the reference material.
Heat flux calorimeters comprise means for supporting the sample and reference materials, a temperature sensor to determine the temperature of the sample material, a differential temperature sensor to measure the difference between the temperature of the sample material and the temperature of the reference material, and a controlled-temperature enclosure. U.S. Pat. No. 4,095,453 to Woo describes a typical means for supporting a sample or reference material in a differential scanning calorimeter. The most typical type of support means is a circular disk but this is by no means the only configuration used. For example, some high sensitivity differential scanning calorimeters have receptacles mounted on short columns attached to the disk to hold the sample pans. The columns increase the heat flow resistances between the disk and the sample pans, thereby increasing the temperature difference between sample and reference and hence the sensitivity of the differential scanning calorimeter. However, this decreases the resolution in proportion to the increase in sensitivity. The enclosure may be supplied with a cooling device to more accurately control its temperature or for below-room temperature measurements.
Most instruments use thermoelectric effect differential temperature sensors, i.e., thermocouples, wherein a difference in the measurement temperature and a reference temperature generates an electromotive force proportional to the temperature difference between the measuring and thermoelectric reference temperatures.
There are two types of commonly-used differential temperature sensors based upon the thermoelectric effect. The differential thermocouple uses a single differential temperature-sensing element. The differential thermopile uses multiple, in-series differential thermocouples. U.S. Pat. No. 3,554,002 to J.C. Harden et al. describes a differential thermal analysis cell using a differential thermocouple. U.S. Pat. No. 5,033,866 to Kehl et al. describes a thermal analysis sensor using a differential thermopile.
The resolution and calorimetric sensitivity of an instrument are two of the important performance criteria for differential scanning calorimeters. These criteria serve to define the applications for which the instrument is best suited. Resolution is the instrument's ability to separate thermal events which occur at temperatures which are close to each other. It is determined by the dynamic thermal response of the instrument. Calorimetric sensitivity is the measure of the signal generated by an instrument in response to a thermal event having a certain heat flow. Dynamic thermal behavior is characteristic of the geometry of a particular instrument, and of the materials used in its construction.
The sensitivity of heat flux instruments is dependent upon the output of the differential temperature sensor, which is in turn dependent upon, in part, the temperature difference developed between the sample material and the reference material. This temperature difference is also dependent upon the instrument geometry and construction materials. However, there is an inverse relationship between instrument designs that improve resolution and instrument designs that improve sensitivity. For an instrument using a given type and configuration of differential temperature sensor, increasing sensitivity results in decreased resolution while increased resolution results in decreased sensitivity.
Thermopile instruments are capable of greater sensitivity, because the output signal of the sensor is increased in proportion to the number of thermocouples in the thermopile. However, geometric considerations eventually limit the performance of the instrument, because the number of differential thermocouples which fit into an instrument of a given size is limited.
Another very important measure of performance of differential scanning calorimeters is their signal-to-noise ratio. This ratio is a measure of the smallest heat flow detectable by the instrument. Noise in differential thermal analyzers is predominantly electromagnetic and amplifier noise. Sensors with low electrical impedance pick up less noise than sensors with high electrical impedance. Differential thermopile sensors have inherently high electrical impedance. Thermopile sensors are therefore highly susceptible to electromagnetic noise and thus have a decreased signal-to-noise ratio.
The heat flow is measured as a function of the sample temperature. The preferred method for measuring the temperature of the sample is to directly measure the sample temperature using a sample temperature sensor. An alternate but less desirable approach is to use the temperature of the enclosure as a measure of the sample temperature. U.S. Pat. No. 4,095,453 discloses an instrument that directly measures sample temperature. U.S. Pat. No. 5,033,866 discloses an instrument wherein the sample temperature is inferred from the enclosure temperature.
U.S. Pat. No. 4,350,446 describes a heat flux differential scanning calorimeter which can measure multiple samples simultaneously. Although this instrument improves productivity, in practice its calorimetric accuracy and precision is not equal to that of single-sample instruments. The user of such instruments must choose between accuracy and precision, and productivity, or must use separate single-sample and multiple sample instruments.
U.S. Pat. No. 3,263,484 describes power compensation differential scanning calorimetry. Power compensation calorimeters measure the difference in power supplied to the sample material and the reference material, and determine the heat flow from this measurement. Heat flux instruments calculate the heat flow from a differential temperature measurement. However, power compensation instruments are more complex than heat flux instruments.
Moreover, current power compensation instruments do not directly measure sample temperature.
Furthermore, there are no current instruments that can be used either as power compensation instruments or as heat flux instruments. A user who wants to practice both techniques would have to purchase instruments of each type.
In traditional differential scanning calorimetry, the sample material and the reference material are simultaneously subjected to the regulated temperature environment. However, this is not essential to the operation of the calorimeter. Differential scanning calorimetry may be performed sequentially, by subjecting the sample material and the reference material to consecutive measurements, storing the results, and subsequently calculating the heat flow to (and from) the sample. U.S. Pat. No. 4,848,921 describes this technique in power compensation calorimeters. In principle, heat flux calorimeters could also measure the heat flow to (and from) the sample material and the reference material sequentially.
Differential thermocouples and thermopiles, in addition to being used to measure temperature difference, may transfer energy between the measuring and reference points by employing the Peltier effect. The Peltier effect describes the behavior of a thermocouple circuit when direct electric current is applied to it. When an electric current is applied to the differential thermocouple, one of the two thermocouple junctions is heated and the other is cooled. This difference in temperature corresponds to a flow of heat from the colder to the hotter junction. Thus the Peltier effect refers to the use of a thermocouple as a heat pump. The magnitude of the Peltier effect is strongly dependent on the electrical impedance of the thermocouple: for a given type of thermocouple, thermocouples with low electrical impedance have greater heat pumping capacity than those with higher impedance. The current supplied to the differential thermocouple or thermopile is a measure of the heat pumped by the Peltier effect, as described in U.S. Pat. No. 4,451,690.

Thermopile differential thermal analysis sensor


An aspect provides a method, including: setting a battery pack, in an information handling device having two or more battery packs, as a priority battery pack; discharging the priority battery pack and maintaining one or more other battery packs in an idle state; ascertaining if the priority battery pack satisfies one or more conditions; and in response to the priority battery pack satisfying the one or more conditions, setting one of the one or more other battery packs to be the priority battery pack and maintaining the remaining battery packs in an idle state; wherein the priority battery pack is prioritized in terms of charging. Other aspects are described and claimed.

Information handling devices ("devices"), for example laptop computers, tablet computing devices, smart phones, e-readers, mp3 players and the like, use rechargeable battery packs to supply power. For example, devices commonly include a rechargeable battery pack that is charged by a commercial power source (wall outlet) and powers the device when disconnected therefrom.
Increased operational battery life (i.e., useful operating time between charges) and increased overall battery life (i.e., time the battery remains useful and rechargeable) are desirable. Many advances have been made in this area. One approach is to provide additional battery packs such that a device may use one or a plurality of available battery packs (e.g., one battery pack used first, followed by a second battery pack). This permits devices to increase the operational battery life (i.e., extend time between charging) and provides other advantages.


A surgical retractor assembly is provided comprising a frame having first and second portions, a first hook member supported on the frame, a second hook member supported on the frame and movable with respect to the frame, and a frame support supporting the frame. The frame support is adapted to retain the first portion of the frame in a selected raised position with respect to the second portion of the frame. The frame support preferably comprises two elongated shafts having locking mechanisms for locking the frame in the selected raised position.

1. Technical Field
The disclosure relates to a surgical apparatus and method and more particularly to a minimally invasive surgical apparatus and method for retracting tissue.
2. Background of the Related Art
The diagnosis and treatment of coronary disease and related conditions typically require access to the heart, blood vessels, and associated tissue. Such procedures include cardiopulmonary bypass, valve repair and replacement, and treatment of aneurysms. Until recently, access to the patient's thoracic cavity was achieved by a large longitudinal incision in the chest. This procedure, referred to as a median sternotomy, required a saw or other cutting instrument to cut the sternum and allow two opposing halves of the rib cage to be spread apart U.S. Patent No. to Bugge discloses a retractor which is designed to grip opposite sternum halves and spread the thoracic cavity apart. The large opening which is created by this technique enables the surgeon to directly visualize the surgical site and perform procedures on the affected organs. However, such procedures that involve large incisions and substantial displacement of the rib cage are often traumatic to the patient with significant attendant risks. The recovery period may be extended and is often painful. Furthermore, patients for whom coronary surgery is indicated may need to forego such surgery due to the risks involved with gaining access to the heart.
To avoid the risks and pitfalls of median sternotomies, a minimally invasive "window" approach to vascular or cardiac surgery has recently been developed. One example of the window approach is disclosed in European patent application 97106912.5, filed on Apr. 25, 1997. The 97106912.5 application shows an oval shaped retractor having several retractor blades mounted thereon to spread the ribs and allow access to the heart for performing procedures such as coronary bypass.
In certain instances, additional access to other vessels and improved visibility is desirable. One way to achieve this would be to not only spread the retractor blades apart to spread the ribs laterally, but to also spread the ribs and surrounding upwardly away from the body, e.g. to lift the tissue. This would enable additional procedures to be performed through a window approach, such as an "IMA (internal mammary artery) takedown" where the artery is dissected for subsequent attachment to the heart or other vessel to complete the bypass.


An improved and new method for forming dual damascene CMP of copper lines and interconnects(studs) using a dual CMP barrier layer. The two layer polishing barrier produces planar copper structures and solves dishing problems caused when the soft exhibits to a high polishing rate relative to the surround material. The polishing barrier layers consist of bottom layer of TiN with a layer of Ta or TaN on top of TiN layer. The top layer has a low polishing and the bottom layer has high polishing similar to the polishing of copper. Dishing of the copper lines and interconnects is avoided by the method. The result is better uniformity across the substrate and better electrical performance due to the increased copper line cross-sectional.

(1) Field of the Invention
This inventions relates to a method of fabrication used in the semiconductor integrated circuit devices, and more specifically to the formation of planarized structures of conducting copper lines and interconnects using the CMP (Chemical Mechanical Polish) dual damascene technique with a unique double CMP barrier layer.
(2) Description of Related Art
In the fabrication of semiconductor integrated circuits CMP (Chemical Mechanical Polish) is used to remove conducting metal in a dual damascene process. Conducting metal is inlaid into trench and via structures of insulating material. The trenches and vias are usually filled with copper and the insulating material is typically insulating oxide defined by photo lithography.
The CMP process polishes back the excess copper and any surrounding material at the same time. Key to the process is the polishing rate of copper and the surrounding material. The softer copper metal typically polishes back at a faster rate than the surrounding material causing dishing in the copper structures. This lack of planarity caused by different CMP polishing rates among different materials presents a challenge to the Semiconductor Industry. Ideally, the CMP polishing rate of copper and that of the surrounding material should be, such that copper is polished without any dishing, while also removing the barrier layers, and stopping on insulating layer without removing the insulating layer.
U.S. Pat. No. 5,736,192 entitled "Embedded Electroconductive Layer and Method for Formation Thereof" granted Apr. 7, 1998 to Shigeru Okamoto describes a method of forming a copper interconnect using a TiN layer to aid in the CVD deposition of copper. A diffusion barrier layer for copper is listed as a TaN or WN layer. The embedded copper is patterned by a damascene CMP process.
U.S. Pat. No. 5,731,245 entitled "High Aspect Ratio Low Resistivity Lines/Vias with Tungsten-Germanium Alloy Hard Cap" granted Mar. 24, 1998 to Rajiv Vassant Joshl, et al, shows a CMP process for a copper layer using a hard CMP stopping layer. The invent teaches that copper or Al-Cu layer, in a trench or via fill process, is capped by a refractory metal. A layer of W-Ge is deposited over the refractory material layer and metallization. The hard, wear-resistant W-Ge layer acts as a polishing stop, in alumina slurry or ferric nitrate CMP.
U.S. Pat. No. 5,676,587 entitled "Selective Polish Process For Titanium, Titanium Nitride, Tantalum and Tantalum Nitride" granted Oct. 14, 1997 to William Francis Landers, et al, describes CMP method whereby W or Cu is removed by a two-step CMP process from an oxide layer. The damascene method uses an underlying Ti/TiN or Ta/TaN via liner layer, which protects the underlying oxide layer. This underlying layer is selectively removed in step two, of the two-step CMP process, by utilizing a neutral pH silica based slurry.
U.S Pat. No. 5,739,579 entitled "Method for Forming Interconnections for Semiconductor Fabrication and Semi-Conductor Device Having Such Interconnections" granted Apr. 14, 1998 to Chien Chiang and David B. Fraser describes multilayer interconnects (plugs) and conducting lines formed by CMP. Copper metal is surrounded by diffusion barrier layer of titanium nitride and silicon oxynitride. Silicon nitride is used as a key etch stop on top oxide for CMP process.
U.S. Pat. No. 5,705,430 granted Jan. 6, 1998 to Steven Avanzino, et al, teaches a method of improving a dual CMP damacene process by forming the conductive lines and conductive vias with two etch steps of an insulating layer that produces sharply defined edges of the via openings.
U.S. Pat. No. 5,677,244 to Venkatraman describes a dual damascene structure that utilizes a copper diffusion barrier layer and seed layer combined. CVD copper is used for the conducting lines and vias and removed by CMP. Barrier layer material lists Ti, TiN, Cu and Al.
U.S. Pat. No. 5,723,387 to Chen describes a method and apparatus for forming Cu interconnect metallurgy on semiconductor substrates. A self contained unit for forming Cu metallurgy interconnection structures is described, which reduces the number of times wafers are transferred between wet process stations.

Method for forming copper damascene structures by using a dual CMP barrier layer

Chartered Semiconductor Manufacturing Ltd.


A cat relief chamber includes a front, a back, a floor, a first side, a second side, and a roof. The front has a doorway formed therein to allow for a cat to enter and exit the chamber. The chamber is adapted to be sold as a substantially flat preform and then expanded by a consumer to a formed state. The floor of the preform is assembled such that the floor forms as the consumer expands the preform to form the chamber. The doorway is formed from a door panel in the front of the chamber. The door panel is pushed in along perforations. The door extends upwardly from the bottom of the chamber, and when pushed in, becomes a part of the floor of the chamber. The chamber can be formed easily and quickly by the consumer and without the use of glue.

This invention relates to cat relief chambers which house kitty litter boxes, and, in particular, to a paperboard cat relief chamber.
Cat owners typically have kitty litter boxes in which their cats relieve themselves. The odors and unsightliness of kitty litter boxes is well known and many products have been introduced in an attempt to control the odor of kitty litter boxes. Many of these products are deodorizing agents for the kitty litter or reformulated kitty litter. However, various forms of cat relief chambers have also been introduced to control not only the odor, but also the unsightliness of kitty litter boxes. Cat relief chambers generally include a structure which houses a kitty litter box and which the cat enters to relieve itself. The cat relief structures serve to hide the kitty litter box and to retain whatever kitty litter may be kicked around by the cat. It will also maintain some of the odors of the kitty litter box. Many of the currently available cat relief chambers are expensive and/or are made from materials which are not easily recyclable. Therefore, the cat owners are reluctant to dispose of the cat relief chambers. Thus, the cat relief chambers must be cleaned periodically. Further, the cat relief chambers which are made from recyclable materials, such as paperboard, are difficult to assemble.


A foundation system 50 for supporting a support beam 80 of a manufactured home and for preventing longitudinal movement of the beam; beam 80 having a longitudinal axis defining the longitudinal direction. Ground support pan 52 including blades 57 for insertion in the ground for preventing horizontal movement and a bracket 61 pivotably connecting lower ends 73 of a pair of rigid arms 70 substantially to the longitudinal middle 59 of pan 53 such that arms 70 form a V. Each upper end 76 of arms 70 is pivotably attached to a clamp 10 clamped to beam 80 such that the clamp 10 cannot move along beam 80.

Manufactured homes, mobile homes or trailer coaches include long longitudinal support beams underneath. Typically, when the home or coach is installed, a plurality of vertical piers or jacks are placed under the beams to support them. Most piers or jacks require placement on a rigid ground pad so as to not sink into the ground from the loading. Conventional piers do not provide resistance to longitudinal forces or lateral forces that may be exerted on the coach such as by strong winds or earthquakes. Thus, additional stabilizing and anchoring systems have to be used.
It is desirable to have an improved foundation system that both supports the beam and provides longitudinal stability.
Since many foundation systems are required for a single manufactured home and since these systems have to be installed in the field and in a confined space under a manufactured home, it is desirable that they be simple and fast to install, preferably by a single person, not require complex tools and not require any alterations to the present beams, such as drilling, that could decrease the strength of the beams.

Foundation system for beam of manufactured home


In a fluidized bed process having a bed of fluidized particulate material which is susceptible to having at least some of the particulate material being entrained in the gases exiting the bed, the entrainment is reduced by introducing the particulate material into the process, in the substantial absence of a gas which transports the particulate material, at one or more points which are below the surface of the bed of fluidized particulate material.

This invention relates to an improved fluidized bed process.
Fluidized bed processes are used commercially for the chlorination of titanium containing materials, ore roasting or refining, combustion of solid carbonaceous material such as coal, etc.
In such processes, particulate material, air, oxygen or other oxidizing agents are fed into a reaction chamber, and suitable temperature and pressure are maintained. The flow rates are adjusted so that the particulate material becomes fluidized, i.e., it is maintained in a state of suspension and has the appearance of boiling.
A good example of a commercial fluidized bed process is that for chlorinating titanium containing material. In such process, particulate coke, particulate titanium containing material, chlorine and optionally oxygen or air are fed into a reaction chamber, and a suitable reaction temperature, pressure and flow rates are maintained to sustain the fluidized bed. Gaseous titanium tetrachloride and other metal chlorides are exhausted from the reactor chamber. The gaseous titanium tetrachloride so produced can then be separated from the other metal chlorides and used to produce titanium dioxide pigment or titanium metal.
A problem, however, which has not been satisfactorily solved in the foregoing fluidized bed processes is that particulate material of fine size tends to becomes entrained in the hot gases exiting the process. As a consequence, such fine particulates have a short residence time in the reaction zone of the process, and often exit the reactor in an unreacted state. While the fine particulates can be recycled to the process, they still tend to exit before reacting and therefore generally must be removed from the process. The unreacted fines therefore are a disposal problem and a waste of the fuel, metallic, or other values in the materials being processed.
The fine particulate material typically is present due to the attrition and degradation of particulate materials of larger particle size which are fed to the fluidized bed process. However, it would be desirable to be able to feed fine particulate material to the process because it often is abundant and less expensive than materials having larger particle size. For example, there exists abundant quantities of relatively inexpensive titanium containing ore which currently cannot be economically processed because it exists in the form of sands having small particle size.
The following references are disclosed as being of interest to the subject matter of this invention:
U.S. Pat. No. 2,701,179 discloses a commercial fluidized bed process for chlorinating titanium containing material wherein the particulates are fed pneumatically with chlorine into the bottom of the fluidized bed reactor.
An article entitled, "Fluidized Bed Chlorination of Rutile", by J. Glasser and W. L. Robinson, appeared in the Sep. 9, 1962 publication of the Society of Mining Engineers of AIME. It describes a commercial fluidized bed process for chlorinating titanium containing ore wherein course particulate ore of a size greater than about 70 microns is fed to the top of a fluidized bed reactor.
U.S. Department of Energy Contract Report Fe-21063-8-1985, by W. C. Yang, and entitled, "A Study of Fine Particle Residence Time in a Jetting Fluidized Bed", discloses laboratory scale fluidized bed experiments including injecting fine particulate acrylic material into and above the fluidized bed. The experiments appear to conclude that (a) coaxial pneumatic injection below the bed is less desirable than radial pneumatic injection above or below the bed, and (b) radial pneumatic injection above and below the bed produced similar results.
An article entitled, "Fluid Bed Behavior in Zinc Roasters", by N. J. Themelis and G. M. Freeman appeared in the August 1984 issue of the Journal of Metals. It discloses the commercial fluidized bed roasting of zinc ores wherein the ore is fed to the reactor above the fluidized bed.
The U.S. Bureau of Mines report No. 8165 was authored by H. M. Harris, A. M. Henderson and T. T. Campbell. It is entitled, "Fluidized Coke Bed Chlorination of Ilmenites" and discloses pneumatic feed, below the fluidized bed, of titanium containing ores and coke. A laboratory scale reaction is used.


The invention provides a diffraction grating lens suitable for use as an objective lens for an optical disk recording/reproducing apparatus. This lens includes a light transmissive substrate of which a refractive index is larger than 1, having one plane and the other plane, and a diffraction grating pattern having a lens effect and constituted by a plurality of diffraction gratings formed on one plane of the light transmissive substrate. The diffraction grating pattern is for focusing an incident light beam flux at a focal point provided on a side of the other plane of the light transmissive substrate and is formed so that a numerical aperture, calculated with the focal point as a peak point, becomes larger than 1.

The present invention relates to a diffraction grating lens for focusing a laser beam or the like to a minimum spot, and relates more particularly to a diffraction grating lens suitable for an objective lens of an optical disk recording/reproducing apparatus and an optical recording/reproducing apparatus using the diffraction grating lens.
Recently, a high-density information recording has been required for a video disk, a read-only optical disk such as a CD, and a recordable and reproducible optical disk of additional recording type or of rewritable type. For this purpose, it has become necessary to provide a light source and an optical system which can be applied for an optical disk recording/reproducing apparatus and which can focus a laser beam for recording and reproducing to a minimum spot.
In general, a diffraction limit spot diameter s of a light focused by a lens having a numerical aperture NA for a light source having a wavelength .lambda. is given by the following expression. EQU s=c.multidot..lambda./NA (1)
In this case, c takes a value of 0.67 when a diameter is selected to take the intensity of 1/e.sup.2, for example, in the Gaussian distribution. Since the numerical aperture of the lens in general is not larger than 1 even as a maximum, s can not be made smaller than c.lambda. as is clear from the above expression.
An effective method of obtaining a minimum spot is to shorten the wavelength .lambda. of the light source. However, when a compact semiconductor laser is used as a light source, there is a limit to the shortening of the wavelength. Further, when the wavelength becomes shorter than the ultraviolet zone, the conventional optical systems can not be used from the limit of the transparent zone of lens materials.
As a method for exceeding the limit shown by the above-described expression (1), a solid immersion lens (SIL) has been proposed (such as, for example, by B. D. Terris et al,: Appl. Phys. Lett., 65 (1994) p. 388). This SIL is designed to focus an incident light beam in this lens.
When an incident light beam is focused in the SIL, the focusing spot diameter can be made smaller than that obtained when incident light beam is focused in the air. This is because when an incident light beam is focused in a medium of which refractive index n is larger than 1, the numerical aperture NA can be made larger than 1.
In an optical system using an SIL, a part of the light beam emitted from this SIL becomes what is called an evanescent light-wave. The evanescent light-wave is a light-wave which exists as a localized wave without propagational property. Since this evanescent light-wave is attenuated rapidly, an object such as an optical disk must be kept in the vicinity of the light emitting plane of the SIL in order to utilize the minimum spot obtained by the SIL.
However, an apparatus of this type has the following problems. First, since the SIL has a large curvature, a lens of non-aberration is necessary, of which preparation is extremely difficult. Second, since the lens becomes necessarily thick, it is difficult to make this lens compact or match position with other parts.
As a lens which utilizes the evanescent beam, there is one as disclosed in the Japanese Patent Application KOKAI Publication No. 7-93797.
According to the technique disclosed in this publication, a grating lens is used as a mean for forming a focusing spot. This grating lens utilizes a diffraction grating group formed in an equivalent distance concentric shape of the distance shorter than that of a light wavelength and generates an evanescent light-wave near the center of this diffraction grating group.
When this grating lens is used as an objective lens of an optical disk recording and reproducing apparatus, a plane on which the diffraction grating group is formed is faced with the surface of an optical disk in a state of being almost in contact with the surface of this optical disk. In other words, unlike the SIL, this grating lens does not generate an evanescent light beam by focusing an incident light beam in the lens but generates an evanescent light beam within the diffraction grating.
However, according to the above-described grating lens, since it should be used by keeping the surface on which the diffraction grating is formed to be almost in contact with the optical disk, there arises a problem in the protection of the diffraction grating pattern. Moreover, since the evanescent light-waves are generated by the whole of the diffraction grating according to this grating lens, there is a possibility that these light-waves reduce the SIN ratio. Further, there is another problem that the optical spot diameter does not necessarily become the so-called minimum spot diameter.

Diffraction grating lens and optical disk recording/reproducing apparatus using the same


A system for handling tubulars on a rig may include a top handling device configured for arrangement on the rig and for handling a top portion of a tubular to and from a setback area. The system may also include a lower handling device configured for arrangement on the rig and for handling a bottom portion of the tubular between well center and a release position. The system may also include a bottom handling device configured for arrangement on the rig and for handling the bottom portion of the tubular between the release position and the setback area.

The background description provided herein is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.
Drilling of wells involves tripping of the drill string, during which drill pipes are lowered into (tripping in) or pulled out of (tripping out) a well. Drillers or well operators may perform tripping to change all or a portion of the bottom hole assembly, such as to change a drill bit. When tripping in, stands or lengths of drill pipe may be supplied from a storage position in a setback area of the drill rig and connected end-to-end to lengthen the drill string as the it is fed into the well. When tripping out, stands or lengths of drill pipe may be disconnected from the drill string and may be positioned in the setback area as the drill string is pulled out of the well.
Tripping has conventionally been performed with human operators. In particular, while an elevator or top drive may be used to carry the load of a stand of drill pipe during trip in and trip out operations, human operators may typically maneuver the drill pipe stands around the drill floor, such as between the well center and the setback area. For example, a first human operator may be positioned on the drill floor, at or near the well, to maneuver a lower end of drill pipe stands as they are tripped into or out of the well, while a second human operator may be positioned on or above the racking board to maneuver an upper end of drill pipe stands as the stands are moved between the well and the setback area. Operators often use ropes and/or other tools to maneuver the drill pipe stands on or above the drill floor. Such work is labor-intensive and can be dangerous. Moreover, tripping in and tripping out operations may be limited by the speed at which the human operators can maneuver the stands between well center and the setback area.
Still further, a drill string may be made up of a drill head arranged at the deepest tip of the string. A substantially heavy pipe, referred to as drill collar, may be arranged behind the drill head to create a weight on the deepest portions of the drill string. More conventional drill pipe may be arranged behind the drill collar and extending upward to the drill floor. When tripping in and/or out of a well, the handling of the drill collar can be much more labor intensive and potentially dangerous due to the very heavy nature of this portion of the drill string.


In a general aspect, various fields of a PHY frame are used for motion detection. In some aspects, a first training field and a second, different training field are identified in a PHY frame of each wireless signal transmitted between wireless communication devices in a wireless communication network. A first time-domain channel estimate and a second time-domain channel estimate are generated for each wireless signal. The first time-domain channel estimate is based on a first frequency-domain signal included in the first training field, while the second time-domain channel estimate is based on a second frequency-domain signal included in the second training field. A determination is made whether motion has occurred in a space during the time period based on the first time-domain channel estimates, and a location of the motion within the space is determined based on the second time-domain channel estimates.

The following description relates to using multiple-input/multiple-output (MIMO) training fields for motion detection.
Motion detection systems have been used to detect movement, for example, of objects in a room or an outdoor area. In some example motion detection systems, infrared or optical sensors are used to detect movement of objects in the sensor's field of view. Motion detection systems have been used in security systems, automated control systems and other types of systems.

Using MIMO training fields for motion detection


Three methods for converting sketch shapes into semantic elements by way of a semantic editor are disclosed. First, a method for conversion of a sketch shape that is part of a nested shape combination, which includes a sketch shape either hosting or nested within a semantic element. Second, a method for conversion of sketch shapes to semantic elements by storing sketch shape names and sketch shape descriptions in correlation with specific semantic elements and properties. The stored correlation is referenced for subsequent sketch shapes names or descriptions that are the same or a subset of the stored sketch shape name or description. Third, a method of conversion of one or more sketch shapes into a semantic template containing a plurality of semantic elements. Each of the one or more sketch shapes is mapped to a specific semantic element within the semantic template.

Creating a model or diagram is often the first step when designing a process or deploying a system. A model can be defined as a complete specification of a problem or solution domain from a particular perspective. Ultimately, a model is a logical concept that can be expressed physically as a drawing, for example on a whiteboard or in a modeling tool. Exemplary models include business analysis models, class diagram models, use-case models, design models, deployment models, data models, etc. A model can either be constructed in a formal manner, i.e., with semantic details included, or in an informal manner, i.e., without semantic details. More specifically, as "semantic" pertains to the different meanings of words or symbols, "semantic details" added to a model identify or define concepts in a model. Typically, an initial model or diagram is constructed in an informal manner without tying specific definitions to the model (referred to herein as a "semantic-less model"). This allows the creator to get an idea down on paper while not having to worry about the specific details of his design. A semantic-less model is composed of notational elements. A notational element is an informal element that is used to visually depict a component of a semantic-less model but adds no semantic details. For example, a notational element might be a rectangle drawn as a component of a model. The rectangle might represent that a function or process should take place here, but may not specifically define what the function or process is or how it operates. Several graphical editors, such as Microsoft Visio and PowerPoint, allow users to create models and diagrams without being required to allocate semantic meaning (e.g., defining the process represented by the box in the above example) to each notational element (referred to herein as a "semantic-less editor"). However, without semantics, the model created (or the logical concept defined by the model) can't be validated or used to automatically generate other content. A model with all the logical components clearly defined may be referred to as a "formal" or "semantic" model.
If a user desires to make a formal model or diagram, a graphical semantic editor, such as IBM Rational Rose and PowerDesigner, is used. A model created by a graphical semantic editor is composed of semantic elements. Semantic elements provide the semantic details previously discussed and may be classes, activities, relationships, specific machines, or any descriptive information, and may be depicted as graphically illustrated components of the model. For example, in a system deployment model describing a website, the components would include hardware components such as a web server and an application server, and software components such as a web application and a database. Each of these components are semantic elements of the deployment diagram and may be displayed as an image recognized by the graphical semantic editor as a known component. Taking the example from above where an informal notational element was a rectangle depicting some function or process that should be included; the corresponding semantic element might be a rectangle with a name of a specific and recognizable function. Alternatively, the corresponding semantic element could be any image recognized by the semantic editor as representative of the specific function.
The relationship between various semantic elements, referred to herein as a "semantic relationship", can also be visually depicted. For example, if the web server hosts the web application, the two corresponding semantic elements would have a semantic relationship which may be depicted by the semantic element representing the web application being shown contained within the semantic element representing the web server. A semantic element may, in some embodiments, have a number of semantic properties providing further details. For example, for the semantic element representing a web server, the amount of memory and the speed of the server processor are possible semantic properties of the web server semantic element that can be included in the semantic model by a user if a higher degree of specificity is desired.
Creating semantic models can be more difficult than creating semantic-less models because they force the user to be continually aware of the details of their model. Often, semantic editors force users to pick the exact semantic element and its relationship to another semantic element before it can be added to the model. With regard to the example above, when building a semantic model, the user would need to not only identify the hardware and software components as specific semantic elements (e.g., the web server and the web application), but in addition, the user would need to identify a specific semantic relationship (e.g., the server hosting the application) before the semantic model would be complete.
For most graphical semantic editors, Unified Modeling Language (UML) has become a standard visual modeling language for software specification and design. UML is used to specify, visualize, modify, construct and document the artifacts of an object-oriented software intensive system under development. In other words, for most semantic editors, semantic elements and their corresponding relationships and properties are presented in terms of UML. This can present problems for users wishing to convert a semantic-less model into a semantic model.
A graphical semantic editor may support conversion between semantic and semantic-less models. These hybrid editors typically provide the user with a tool palette of a set number of notational elements or shapes that can be added to a visual depiction of an informal or semantic-less model. In this manner, a user is not forced to sketch each component of a semantic-less model manually. These notational elements or shapes provided by hybrid editors are referred to herein as "sketch shapes". After the informal model is composed, the user is then given the option of converting the entire semantic-less model to a semantic model or converting each individual semantic-less component into a semantic element by filling in the semantic details required to create each semantic element and/or semantic relationship. The sketch shapes can also be given sketch shape names and sketch shape descriptions at the user's discretion, which serve as informal details for each sketch shape. A sketch shape name can be used to identify a specific matching semantic element. A sketch shape name can also be used to identify a category of sketch shapes which correlate to a specific semantic element or category of semantic elements. Additionally, a sketch shape description can be used to identify a category of descriptions which correlate to one or more semantic properties. Once the semantic model is created, the semantic editor stores the semantic-less model and may even create a link to the semantic-less model within the semantic model. Therefore, the user can go back and forth between the semantic-less model and the semantic model at any time.

International Business Machines Corporation


A connector having a connector body with opposing end contacts. The connector also includes tabs coupled to the connector body and positioned between the opposing end contacts. Provided between the tabs and the opposing end contacts are circular stabilizers. When no force is applied to the opposing end contacts, the tabs and the circular stabilizers hold the connector in a cylindrical holder. When a compressive force is applied on each opposing end contact, the circular stabilizers pivot about an axis while maintaining the position of the connector in the holder. Further, as the opposing end contacts are compressed, they move across the connector surface of the component making contact with the connector. The movement of the opposing end contacts "wipes" across the surface and, thus, forms a good electrical connection between the connector and the surface.

The current trend in connector design, for those connectors utilized in the computer field, is to provide both high density and reliable connections between various circuit devices which form important parts of the computer. It is essential that such connectors be highly reliable because potential computer failure may occur if misconnections of these devices occur. Further, to assure effective repair, upgrade, or replacement of various components of a computer system (i.e. connectors, cards, boards, chips, modules, etc.), it is also highly desirable that such connections be separable and reconnectable in the field within the final product, as well as tolerant of dust and fibrous debris. Such capability is also desirable during the manufacturing process for the products.
In order to ensure a good connection, a connector should provide spring tension to maintain the connection and a "wiping action." The wiping action forms a good connection by removing debris from between the connector and the component.
One prior technique for providing connections is described in U.S. Pat. No. 5,248,262 issued to Busacco et al. Busacco et al. discloses an electrical connector for interconnecting a pair of circuit members (e.g., a circuit board and a module) which, in one embodiment, includes a housing, at least one flexible circuit within the housing, and a spring attached to the flexible circuit at two spaced locations for exerting force against the flexible circuit to cause the circuit to engage respective conductive pads on the circuit members when the circuit members are moved toward each other (e.g., compressed). The shape of the spring conforms substantially to the portion of the flexible circuit between the locations of the attachment. In another embodiment, a connector for interconnecting such circuit members includes a housing located between the circuit members and an elongated, compressible contact member in the housing with conductive end portions for engaging the circuit members. The contact member occupies a first, pre-stressed position before engagement and moves to a second, compressed position during engagement. The conductive end portions of the flexible circuit in the first embodiment and the contact member in the second embodiment preferably comprise a plurality of dendrites for providing enhanced connections.
Frequently, there are requests to change the pitch of the contact or to depopulate the center portion for chip down applications. Further, it is often necessary to provide for custom designs and easy prototyping systems. The system described in the Busacco et al. reference requires costly changes to plastic molds and flexible tooling to implement changes for custom designs and to provide for prototyping.
Therefore, it is desirable to provide a high-density electrical connector providing effective, reliable connections in which the connections are repeatable. It is also desirable to provide a connector that permits custom designs, easy prototyping, and less expensive tooling.
It is an object of the invention, therefore, to provide an electrical connector capable of providing high-density interconnections that are highly reliable and which can be readily separated and repeated if desired. It is another object of the invention to provide connectors which allow for custom designs, easy prototyping, and less expensive tooling.

International Business Machines Corporation


A combustible carbonaceous composition and method of making a charcoal briquette wherein a finely divided carbonaceous material is combined with an activated carbon and/or an activated graphite (which may be formed in-situ during pyrolysis of the composition by reacting a humic-containing ore with a low VOC-containing carbon and/or graphite). The combustible carbonaceous composition is present in the briquette composition in an amount of about 65% to about 99.9% by weight; a binder is included in the composition in an amount of about 1% to about 15% by weight when forming a charcoal briquette or an igniter log; and the activated carbon and/or activated graphite is present in an amount of about 0.1% to about 20% by weight. The activated carbon and/or activated graphite absorbs most of the VOCs entitled from the combustible carbonaceous material, thereby preventing the VOCs from escaping to the atmosphere.

Charcoal briquettes are commonly used in the United States as a source of heat and flavor for outdoor cooking on a barbecue grill or hibachi. The charcoal briquettes are formed from a combination of a combustible carbonaceous material such as charcoal, peat, coal, or other combustible, hydrocarbon-containing carbon source together with a binder, such as corn starch, a non-toxic polymeric material or the like, and compressed under high pressure into briquettes for use as a barbecue fuel. After the composition is formed into briquettes, the briquettes are dried to remove essentially all of the moisture so that the briquettes are capable of ignition. Exemplary of various charcoal briquette compositions and methods of manufacturing charcoal briquettes include the following U.S. Pat. Nos. Dell 5,221,290; Spencer 1,590,706; Wagel 1,618,029; Jaffe 3,089,760; McGoff 3,304,161; Ross 3,709,700; Robertson 3,485,600; Mennen 3,385,681; Onozawa 3,689,234; Swinehart, et al. 2,822,251; Hughes, et al. 4,167,398; and Crace 4,787,914, hereby incorporated by reference.
Surprisingly, it has been found that by including (a) activated carbon and/or activated graphite as a charcoal briquette composition additive, and/or by including (b) non-activated or incompletely activated carbon and/or graphite and a humic acid-containing ore or a humic acid salt-containing ore, oxidation of the carbon and/or graphite source occurs in-situ during the pyrolysis, or heating to a temperature of at least about 450.degree. F., of the charcoal briquette composition to reduce VOCs escaping from the pyrolyzing composition to the atmosphere. The activated carbon and/or activated graphite, initially added in activated form to the combustible carbonaceous composition or added to the composition in the form of reactants capable of activating carbon and/or graphite in-situ, sorbs unexpectedly high amounts of volatile organic compounds (VOCs) that are volatilized from the combustible carbonaceous material--thereby eliminating or reducing the need for VOC-elimination treatment of the gases formed during heating of the carbonaceous material. Such VOC reduction resulting from activated carbon and/or activated graphite formed in-situ is quite unexpected so long as the carbon and/or graphite added to the combustible carbonaceous material for activation in-situ has a low total organic volatiles content (low VOC), at 1800.degree. F. and 1 atmosphere (750 mm Hg) pressure, hereby defined as less than about 10 mg/g, preferably less than about 1 mg/g, more preferably less than about 0.5 mg/g, and most preferably less than about 0.3 mg/g volatiles, at 1800.degree. F. and 1 atmosphere (760 mm Hg) pressure.

Combustible carbonaceous compositions and methods


A gas generator comprising a pressure vessel containing a gas under a first predetermined pressure. An initiator housing closes one end of the pressure vessel and has an opening at the inner end thereof that is closed by an initiator rupture disk constructed to rupture at a second predetermined pressure in the initiator housing greater than the first predetermined pressure. A micro-gas generator or initiator is disposed within the initiator housing. A manifold closes the other end of the pressure vessel and has an opening at the inner end thereof closed by a manifold rupture disk constructed to rupture at a third predetermined pressure greater than the first predetermined pressure. Upon the firing of the micro-gas generator or initiator, the gas pressure in the initiator housing increases to or exceeds the second predetermined pressure to rupture the initiator rupture disk and create a pressure wave that travels through the pressure vessel to create a localized pressure at the manifold rupture disk that equals or exceeds the third predetermined pressure to rupture the manifold rupture disk and allow flow of cool pressurized gas through the manifold before the gas in the pressure vessel is significantly heated and pressurized by the gas flow from the initiator housing.

1. Field of the Invention
The present invention relates to a gas generator which may be used to inflate an automotive airbag or other safety restraint, and for providing gas under pressure to a device to be pressurized in other applications. More particularly, the present invention relates to such a gas generator that creates a pressure wave.
2. Description of the Related Art
U.S. Pat. No. 6,273,462 discloses an airbag inflator having a container for defining a chamber containing gas under pressure. The container includes a rupturable container wall or rupture disk which is rupturable to provide a gas exit through which gas flows outwardly from the chamber. The inflator includes means for producing a shock wave in the gas under pressure which ruptures the rupturable wall or disk. The shock wave producing means is spaced apart from the rupturable wall or disk and preferably is an igniter or detonator which is exposed to the chamber. The igniter creates a shock wave impulse that causes the rupturable wall or disk to rupture prior to the pressure in the container reaching the predetermined level at which the wall or disk is designed to rupture.
As specifically stated in the specification of U.S. Pat. No. 6,273,462, the rupturable disk was designed to rupture when the pressure in the inflator reached a predetermined level of 5,000 psi. The container was pressurized to an initial level of 1,054 psi, as can be seen at time 0 on the graph in FIG. 4. The activation of the igniter produced a shock wave in the gas in the container and increased the pressure in the container. The pressure in the container reached a maximum second level of 2,983.1 psi at 1 ms. The rupturable disk ruptured when the pressure in the container reached the second level which was much less than the predetermined level of 5,000 psi.
The inflator disclosed in U.S. Pat. No. 6,273,462 is subject to one or more of the following disadvantages:                1. The low fill pressure of the container does not optimize moles of gas relative to package size;        2. The rupturable wall or disk must be weakened to enable it to rupture at a pressure less than that at which it is designed to rupture; and        3. The igniter or detonator is exposed to the gas under pressure in the container and thus does not generate a high pressure wave for rapidly rupturing the rupturable disk at its design pressure before the gas in the container is heated to raise its average surrounding pressure to the design pressure of the rupturable wall or disk.


A function execution method, a function execution apparatus, a computer program and a recorded medium to execute a program of stacking, in a stack area of a memory, a function record area according to a format of an invoked function which is invoked by an invoking function including a process to invoke another function, invoking the invoked function, executing the invoked function and then discarding the stacked function record area, wherein a predetermined alternative function which substitutes the invoking function is executed when it is judged, from analysis of the invoking function by byte-code such as a JVM, that the invoking function is a trail-recursive invoking function, so that the alternative function as an invoking function invokes the invoked function utilizing the function record area utilized for executing the invoking function and the invoked function which has been invoked is executed.

Function execution methods that execute programs containing multiple functions composed of multiple instructions written in language such as Java are utilized recently in many applications and such language such as Java is generally executed in an area of a memory of a JVM after being compiled into byte-code of the JVM.
FIG. 1 is a conceptual diagram showing function record areas in which functions necessary to execute a program are recorded.
A program is executed generally as nested invocation of functions (methods). That is, as shown in FIGS. 1(a), (b) and (c), regarding functions necessary to execute a program, an invoked function to be executed is invoked by an invoking function in execution, a new function record area according to a format of the invoked function is stacked and secured on a function record area (frame) of the invoking function in execution that are secured in a stack area of a memory, the invoked function which has been invoked is executed utilizing the secured function record area and the stacked function record area which has become unnecessary is discarded after completion of execution of the invoked function.
The function record area stacked on the top, in which the function in execution is recorded, is called a top-frame. In FIG. 1(a) wherein a function F is in execution, the function record area of the function F is the top-frame.
When the function F as an invoking function invokes a function G which is an invoked function, a function record area to execute the function G is stacked in the stack area to be the top-frame as shown in FIG. 1(b). After completion of execution of the function G, execution results of the function G are transferred to the function F and the corresponding function record area is discarded, so that the state becomes as in FIG. 1(a) that is the state before invocation.
It should be noted in FIG. 1(b) that, when the function G as an invoking function further invokes another function H which is an invoked function, a function record area to execute the function H is stacked in the stack area to be the top-frame as shown in FIG. 1(c). After completion of execution of the function H, execution results of the function H are transferred to the function G and the corresponding function record area is discarded, so that the state becomes as in FIG. 1(b) that is the state before invocation.
Here, when the execution results of the function H as an invoked function invoked by the function G which is an invoking function are transferred to the function F as execution results of the function G, the invocation of the function H is called tail-recursive invocation. In tail-recursive invocation, the function record areas of the functions H and G are discarded one after another, after completion of execution of the function H.
However, to stack many function record areas in the stack area may cause the stack area to overflow and a problem may arise in some cases in execution of a program.
Moreover, a problem of decrease in total execution speed may arise because of the processing load required for stacking and discarding function record areas.
The present invention has been made in consideration of these situations, and it is a main object thereof to provide a function execution method which can reduce the possibility of occurrence of a problem in execution of a program due to function record areas overflowing a stack area and reduce the processing load required for stacking and discarding areas to improve total execution speed by not stacking a new function record area but utilizing a function record area, in which an invoking function is recorded, as a function record area, in which an invoked function is recorded, when it is judged that invocation by an invoking function is tail-recursive invocation; a function execution apparatus to which the method is applied; a computer program for realizing the apparatus; and a recorded medium in which the computer program is recorded.
Another object of the present invention is to provide a function execution method, and the like, that does not require any special attention in making source-codes using language such as Java and that does not require additional special instructions for compilers which convert source-codes to a function of execution format such as byte-code, wherein in execution of an invoking function of execution format such as byte-code of a JVM, the invoking function to be executed is substituted by an alternative function prepared beforehand and the alternative function which has substituted is executed, so as to realize the above-mentioned process of re-utilizing the function record area.
Further object of the present invention is to provide a function execution method, and the like, that can decrease total processing load and make the function record area appropriate by utilizing the secured function record area as it is when the invoking function is the same as the invoked function, and changing the secured function record area according to a format of the invoked function when the invoking function is different from the invoked function.

Function execution method, function execution apparatus, computer program and recorded medium

Kansai Technology Licensing Organization Co., Ltd


The invention relates to a lid (8) of a container, especially a beverage can, comprising a substantially flat lid surface (9) and a preferably folded edge area, with at least one re-closeable pouring opening (10) being provided on the lid surface (9), and a substantially integral closure means (1) provided on the bottom side of the lid surface (9), which closure means is associated with the pouring opening (10) and is attached entirely to the bottom side of the lid surface (9) in a twist-proof manner, and an actuating means (6) which is in connection with the closure means (1), penetrates the lid surface (9) and is arranged accessibly from the outside on the upper side of the lid surface (9), with the closure means (1) being movable from a closed position to an open position through actuation of the actuating means (6), and with the actuating means (6) comprising a support element (12, 12′, 14, 15) which cooperates with the lid surface (9) when the closure means (1) is in the open position, with the closure means (1) being movable to the open position from the closed position substantially perpendicularly to the lid surface (9) and the actuating means (6) covering the pouring opening (10) in the closed position.

1. Field of the Invention
The invention relates to a lid of a container, especially a beverage can, comprising a substantially flat lid surface and a preferably folded edge area, with at least one re-closeable pouring opening being provided on the lid surface, a substantially integral closure means associated with the pouring opening being provided in its entirety on the bottom side of the lid surface in a torsion-proof manner, and an actuating means which penetrates the lid surface being arranged on the upper side of the lid surface accessible from the outside, with the closure means being movable from a closed position to an open position through actuation of the actuating means, and with the actuating means comprising a support element which cooperates with the lid surface when the closure means is in the open position.
2. The Prior Art
Numerous beverage cans have become known which have a re-closable pouring opening. DE 196 13 246 A1 for example discloses a closure means with substantially the same diameter which is applied to the already existing lid, which closure means closes a pouring opening disposed in the lid by twisting. Similar apparatuses where some of these closure means cover the lid only partly have been described in DE 196 13 256 B4, DE 197 06 112 C2, EP 1 247 752 B1 or U.S. Pat. No. 6,626,314 B1. The disadvantageous aspect in these closure means is their mostly complex arrangement which additionally requires constructional changes to the lid region of the can.
A further group of closure means for beverage cans consists of a pull tab which is fastened by means of a rivet connection to the can lid, with the handle part of the pull tab being arranged simultaneously as the closure means for the pouring opening, which after the opening of the pouring opening seals the pouring opening again by twisting and/or folding down the pull tab. Such elements are shown, among other things, in DE 197 46 539 A1, DE 203 19 105 U1, EP 1 190 952 A2, EP 1 097 086 B1 and EP 0 433 502 A1. These beverage cans all have a closure means which is applied from the outside to the pouring opening and partly protrudes beyond the lid edge, so that the same can be removed inadvertently and the content of the can is exposed to the ambient environment.
GB 2 331 284 A finally describes a closure system, consisting of a pull tab for exposing a pouring opening and a closure means which is arranged on the bottom side of the lid of the can in the interior of the can, with a spring element pressing the closure means against the pouring opening. In order to enable the emptying of the can, parts of the closure means must be displaced against the pull tab. This closure means comes with the disadvantage that it is highly complex and requires a change to the conventional lid of the can. A slightly simpler arranged closure device which also consists of several parts is disclosed in U.S. Pat. No. 3,889,842, which also requires a complex changed lid. Similar re-useable closure means are described in U.S. Pat. No. 4,746,032 A and U.S. Pat. No. 4,345,695 A.
It is therefore the object of the invention to eliminate the disadvantages of the state of the art as described above and to provide a lid for a can which has a secure closure system for resealing the can which can preferably be mounted in a simple and cost-effective way in conventional lids.


A container for a potty seat includes a first end, a second end, a sidewall, and an internal flap. The first end includes an opening. The second end is opposite the first end and the opening. The sidewall extends between the first end and the second end, and defines an interior cavity between the first end, the second end, and the sidewall. The internal flap is disposed within the interior cavity and includes a first end coupled to and extending away from the second end of the container such that the internal flap is coupled to a portion of the potty seat. The configuration of the container allows the potty seat to be conveniently carried and operated with minimal contact with the potty seat as well as the portion of the multifunctional container touching the surface of a toilet seat, thereby decreasing the risk of contact with bacteria or contaminants.

Transitioning a child from diapers to underwear is often a challenging process. A particular challenge involves teaching the child how to properly use a conventional toilet. Many children are fearful of sitting on a toilet because the hole in the toilet seat is substantially larger than the child's buttocks. Thus, children are fearful of falling into the toilet. To mitigate this fear, potty seats were invented.
A conventional, portable potty seat (henceforth referred to as a "potty seat") is designed to sit on top of the toilet seat. The outer circumference of the potty seat is of sufficient size to rest on the toilet seat while the inner circumference is small enough to support a young child's buttocks thereby eliminating the risk of a child falling into the toilet.
Potty seats work well when they are being used at home where the toilet seat and surrounding areas of the toilet are generally clean. However, using a potty seat in public restrooms where the toilet is often unsanitary is problematic for several reasons. First, one is confronted with cleaning at least the upper surface of the public toilet seat to avoid placing the potty seat on top of an unclean surface. This scenario is particularly alarming considering that although the potty seat provides a sanitary surface upon which the child rests; the child's legs and hands are still exposed to the unsanitary surroundings of the toilet. Secondly, once the potty seat has been used on an unsanitary public toilet, one has to then transport the soiled potty seat. Typically, the soiled potty seat is transported in a diaper bag or other containers of sufficient size to hold the potty seat.
Several solutions exist to combat these problems. For example, some public restrooms offer paper covers for the toilet seat. These paper toilet seat covers are usually half folded and made to fit directly on top of the toilet seat. The covers are dispensed from a container typically positioned adjacent to the toilet. Whereas paper covers are convenient and can be readily disposed of in the toilet, these covers fit awkwardly beneath a potty seat. Furthermore, the paper covers do not eliminate the child's exposure to other unsanitary, uncovered surface areas of the toilet.
Other solutions focus on the transport of potty seats. The prior art in this area shows various potty seat designs which allow the potty seat to fold for ease of storage and transport. Some of the designs include a container into which the folded potty seat is placed. These designs address aspects of the aforementioned problem by providing containers that isolate the soiled or contaminated potty seat after use. However, these designs fall short of mitigating the child's exposure to unsanitary conditions around the potty seat.
Accordingly, there still remains a need for a potty seat container that: (1) attaches to the potty seat; (2) shields the child from unsanitary surfaces of the toilet when the potty seat is in use; and, (3) enables the sanitary transport of the potty seat.

Apparatus, system and method for transporting a potty seat


A data slice circuit and the method thereof The data slice circuit comprises a digitizer, a finite state machine, and a digitizer parameter adjustment element. The digitizer receives an analog signal and converts to a digital signal. The finite state machine generates a state signal in response to the digital signal. The digitizer parameter adjustment element generates a parameter adjustment signal in response to the state signal from the finite state machine. The digital signal of the digitizer is adjusted in accordance with the parameter adjustment signal.

1. Field of Invention
The present invention relates to a digitization apparatus and a digitization method for the transfer of data, more particularly, to a digitization apparatus and a digitization method, which has more flexibility, higher accuracy and faster speed to digitize data received from mass storage devices.
2. Description of Related Art
Optical mass storage devices such as compact disk read only memory (CD-ROM) devices are used for the storage and distribution of programs and data structures. Recently, as the technology being developed the mass storage device such as a CD-ROM device has been improved and more and more powerful functions are introduced thereon.
FIG. 1 shows a conventional architecture of a CD-ROM device. A spindle motor 8 drives a disk 1 rotation and an optical pickup element 2 reads the data from the disk 1 and transmits the data to an amplifier 3. The amplifier 3 amplifies the received data and outputs a RF signal to a digitization apparatus (slicer) 4. The digitization apparatus 4 converts the RF signal into the binary EFM (Eight to Fourteen Modulation) signal, which is then sent to a phase locked loop (PLL) circuit 5 and a data processing circuit 6.
The PLL circuit 5 generates a clock signal PLCK according to the EFM signal and outputs the clock signal PLCK to the digitization apparatus 4 and the data processing circuit 6. The date processing circuit 6 generates a system reference clock signal XCK, which is sent to the motor control circuit 7. The date processing circuit 6 also generates output signal according to the EFM signal and the clock signal PLCK. The motor control circuit 7 is used to control the motor 8 rotating at a desired speed with respect to the system reference clock signal XCK. A system controller 9 is used to output a motor speed control signal HS to the data processing circuit 6 and the motor controller 7 to adjust the data processing speed and the rotating speed of disk 1.
Conventionally, to reduce the bias current or voltage of digital data while transmitting, methods to decrease the sum of coded digital data to almost zero are introduced. In a conventional design method, the digitization apparatus is used to digitalize the transmitted data, which is coded by the method of decreasing the sum of coded digital data to almost zero.
FIG. 2 shows a conventional digitization apparatus, which is introduced in U.S. Pat. No. 6,157,603. The digitization apparatus 20 includes a comparator 21, an up/down counter 22, a multiplexer 23, two frequency dividers 24 and 25, and a digital/analog converter 26. The comparator 21 compares the RF signal supplied from the amplifier 3 shown in FIG. 1, with a reference voltage Vref generated by the digital/analog converter 26, and generates the EFM signal. An operating clock signal CK is provided by either the frequency divider 24 or the frequency divider 25 through selection of the multiplexer 23. The multiplexer 23 is controlled by a LOCK signal. The frequency divider 24 receives the clock signal PLCK generated by the phase locked loop (PLL) circuit, while the frequency divider 25 receives the clock signal XCK generated by an oscillator, for example, a voltage controlled oscillator or crystal oscillator.
Based on the operating clock signal CK from the multiplexer 23, the up/down counter 22 serves as a differential data calculator which integrates a differential value between the periods of EFM signal xe2x80x9c0xe2x80x9d and xe2x80x9c1xe2x80x9d supplied from the comparator 11, and outputs a differential data. The digital/analog converter 26 converts the differential data from the up/down counter 22 into the reference voltage Vref, and supplies to the ads to comparator 21.
The RF signal and the reference voltage Verf are sent to the non-inverted and inverted inputs of the comparator 21, respectively. The comparator 21 compares the RF signal with the reference voltage Vref, and converts the RF signal into the EFM signal. The EFM signal of the comparator 21 is sent to the up/down control input of the up/down counter 22. Because the up/down counter 22 is clocked by the operating clock signal CK, and counts down when the EFM signal is xe2x80x9c0xe2x80x9d and counts up when the EFM signal is xe2x80x9c1xe2x80x9d, the integration of the difference between the 1 and 0 of the EFM signal is generated by the up/down counter 22. The D/A converter 26 receives the integration of the difference and converts the integration into the analog voltage Vref. Thus, the comparator 21 can slice the RF signal based on the analog voltage Vref to generate the EFM signal, which has almost equal binary code periods.
As shown in FIG. 2, the operating clock signal CK is generated by the frequency divider 24, which divides the clock signal PLCK, or by the frequency divider 25, which divides the clock signal XCK. If the up/down counter 22 uses the operating clock signal CK as the input clock to count the EFM signal, the accuracy of the slice circuit will be greatly reduced, due to that the operating clock signal CK is divided. However, if the up/down counter 22 uses the clock signal PLCK or XCK as the input clock to count the EFM signal, the operational speed will be limited by the counting speed of the up/down counter 22.
To solve the above problems, the objective of the invention is to provide a digitization apparatus and method to digitalize signal with more flexibility, better accuracy and higher-speed.
To attain the objective previously mentioned, this invention digitization apparatus includes a digitizer, a finite state machine, and a digitizer parameter adjustment element. The digitizer receives an analog signal and converts it into a parallel digital signal. The finite state machine generates a state signal in response to the parallel digital signal. The digitizer parameter adjustment element generates a adjusting signal according to the state signal generated from the finite state machine. The digital signal of the digitizer varies in accordance with the adjusting signal.
In the digitization apparatus above-mentioned, the digitizer further includes a comparator and a serial-to-parallel converter. The comparator compares the analog signal and the adjusting signal and generates a serial sequence of logic signals. The serial-to-parallel converter converts the serial sequence of logic signals into the parallel digital signal.
In the digitization apparatus above-mentioned, the finite state machine further receives a gain control signal. The state signal of the state machine is determined by the parallel digital signal and the gain control signal.

Digitization apparatus and method using a finite state machine in feedback loop


A chip size package semiconductor device can have reliable solder mounting and improved mounting reliability. A semiconductor device of one embodiment can include a semiconductor chip (1) mounted to a bottom portion (11) of a metal base (10A). A metal base (10A) can have side portions (12) with connection electrodes (15A) having a surface level higher than that of electrodes (7 and 8) on a surface of the semiconductor chip (1) by a difference (d). The connection electrode (15A) can be formed on a projecting piece (16) that is bent outward away from remaining portions of the side portion (12). The semiconductor device can be mounted face down without abutting the semiconductor chip (1) against a mounting substrate, thereby preventing mechanical damage to a semiconductor chip (1). At the same time, a solder layer can be formed in the gap between electrodes (7 and 8) and the mounting substrate, thereby raising the reliability of the soldering connection.

There continues to be a demand for a higher degree of integration for electronic devices that mount semiconductor devices. To meet such goals, there has been a corresponding demand for the reduction in the size of individual semiconductor device packages. One type of semiconductor device package that has been proposed is the "chip size package (CSP)".
FIG. 12 shows a semiconductor device disclosed in U.S. Patent Application Publication 2001/00048116 A1. In this device, a metal plate is provided that is slightly larger than a semiconductor chip 101. The metal plate is processed to have a dish-like shape (e.g., a recessed portion) and the semiconductor chip 101 is mounted in a concave portion 111 of the metal plate (hereinafter referred to as metal base 110).
A semiconductor chip 101 in this example is a metal-oxide-semiconductor (MOS) transistor chip. A drain electrode (not shown) is formed on the rear surface of the semiconductor chip 101 and is fixed directly to the bottom surface of the concave portion 111. The space surrounding the semiconductor chip 101 in the concave portion 111 is filled with a resin 113 for sealing. A gate electrode 107 and a source electrode 108 are formed on the surface of the semiconductor chip 101 to be coplanar with the surface of the metal base 110. Regions within a peripheral portion 112 on the surface of the metal base 110 serve as drain connection electrodes 115.
The semiconductor device is mounted face down onto a mounting substrate (not shown in the drawing) so that drain connection electrodes 115 in peripheral portions 112 of metal base 110 are connected to drain connection electrode pad portion provided on the mounting substrate. At the same time, the gate electrode 107 and source electrode 108 are connected to a gate electrode pad portion and source electrode pad portion (also not shown in the drawing).
The above publication also proposes, as shown in FIG. 13(a), a structure in which a concave portion 121 is formed leaving portions 122 on both sides of a metal base 120. The surfaces of both side portions 122 are used as drain electrodes 125. In addition, as shown in FIG. 13(b), the publication shows a structure in which, instead of both side portions, one side portion 132 of a metal base 130 is left to form a concave portion 131. Grooves 133, as deep as the entire thickness of the metal base 130, are formed in several locations along the length of the one side portion 132. The surfaces of the regions separated by grooves 133 are used as drain electrodes 135.
A technique similar to the one shown in FIG. 13(a) is disclosed in Japanese publication 08-78657 A (the illustration of which is not included herein). In this technique, a concave portion is formed leaving both side portions. A semiconductor chip is mounted in the concave portion. The device is mounted face down, with the surfaces of both side portions being coplanar with electrodes on the surface of the semiconductor chip.
U.S. Pat. No. 6,133,634 discloses a semiconductor device that is almost identical to the semiconductor device shown in FIG. 14. In this semiconductor device, a metal base 140 receives press work, or the like, to form a concave portion 141 and leaving a peripheral portion 142. A semiconductor chip 101 is fixed in the concave portion 141. The surface of the peripheral portion 142 of the metal base 140 is substantially coplanar with electrodes 102 that are formed on the semiconductor chip 101. Solder balls 103 are formed on the surface of the peripheral portion 142 and on the electrodes 102 on the surface of the semiconductor chip 101. This device is mounted face down.
In the above conventional devices, the metal base is slightly larger in surface area than the semiconductor chip, and the total thickness is the sum of the thickness of the semiconductor device and the thickness of the metal base (at the bottom of a concave portion). Furthermore, there is no need to bond a metal wire, or the like, to the semiconductor device, and resin is not necessary for sealing the package. This makes it possible to reduce the size and thickness of a semiconductor device chip holding package. Further, such a relatively simple structure can be easy to manufacture. Another advantage can be heat dissipation. When such structures are mounted, the metal base can function as a heat sink, thereby dissipating heat.
However, inspections by the inventors of the present invention are believed to show latent problems inherent in the above structures. In a device in which a concave portion is formed that leaves a peripheral portion of a metal base, such as that of FIGS. 12 and 14, such a concave portion is obtained through press work or etching of the metal base. Finishing a device with such a relatively complicated process can make it difficult to form a desired shape with a high degree of precision. Thus, such metal base forming techniques present an obstacle to cost reduction. The semiconductor devices shown in FIG. 13(a) and 13(b) are superior in this regard (i.e., size and/or cost reduction), because both side portions (or one side portion) can be formed by bending or cutting. Thus, achieving higher processing precision can be relatively easy. Additionally, such approaches can have improved heat dissipation capabilities and improved mechanical strength, despite being smaller and/or thinner.
However, in a semiconductor device like that of FIG. 13(a), a drain connection electrode 125 has a larger area than the gate electrode 107 and source electrode 108, because the side portions 122 of metal base 120 have flat surfaces and the entirety of the flat surfaces are used to form the drain connection electrode 125. This means that when the device is mounted face down, the heat capacity of the drain connection electrode 125 is larger than that of the gate electrode 107 and source electrode 108. Therefore, it can be necessary to supply a larger amount of solder to drain connection electrodes 125 than the solder amount for gate electrode 107 and source electrode 108 when mounting the device to a mounting substrate with solder. As a result, the solder density on the mounting substrate can be uneven. Further, heat capacitance of the solder is irregular.
Accordingly, higher temperatures at the drain electrodes 125 can be necessary during a solder reflow step, and such a higher temperature can bring thermal damage to a part of the semiconductor device. In particular, damage may occur at a portion where the semiconductor chip is connected to the metal base. Further, such higher temperatures can reduce the reliability of a connection to gate electrode 107 and source electrode 108 when the solder amount is low. This can ultimately lower the reliability of the mounting.
Another drawback to an approach like that of FIG. 13(a) can be the substantially coplanar arrangement of the drain connection electrodes 125 with the surfaces of the gate electrode 107 and the source electrode 108. When the semiconductor device is mounted face down onto the mounting substrate, the gate electrode 107 and source electrode 108 can collide against the surface of the mounting substrate, and cause mechanical damage to such electrodes and/or to other parts of the semiconductor chip 101.
It is noted that the semiconductor devices like those shown in FIGS. 12 and 14 can be subject to the same above drawbacks, as the drain connection electrodes for such structures like that of FIGS. 13(a).
Similarly, the semiconductor device shown in FIG. 13(b) includes a drain connection electrode 135 having a larger area than a gate electrode or source electrode. The device thus suffers from similar problems, including varying solder amounts, arising from variances in heat capacity, accompanying thermal damage, and lowered reliability in a solder connection.
If drain connection electrodes 135 are reduced in area, heat capacity of the individual drain connection electrodes during a mounting process can be reduced, and can address the above drawbacks. However, drain connection electrodes 135 are in regions separated by grooves 133 as deep as the entire metal base 130. Thus, in order to separate drain connection electrodes 135, each of the drain connection electrodes 135 would be cantilevered with respect to the metal base 130. This can lower the mechanical strength of the drain connection electrodes 135 and weakens the metal base supporting strength when the device is mounted on the mounting substrate. Thus, such a modification can present another factor to lower the mounting reliability.
Still further, like the device of FIG. 13(a), in the device of FIG. 13(b) drain connection electrodes 135 can have a surface essentially level with that of the gate electrode 107 and source electrode 108. Thus, an approach like that of FIG. 13(b) can also suffer from mechanical damage when mounting takes place.
In light of the above, it would be desirable to arrive at a semiconductor device having an improved mounting reliability with respect to conventional approaches. In particular, it would be desirable to arrive at such a result by improving soldering upon mounting such a device.

Semiconductor device including a semiconductor chip mounted on a metal base


A transgenic plant engineered to have increased desiccation tolerance, increased drought tolerance or increased water use efficiency, the plant transformed with an artificial DNA construct comprising a transcribable nucleic acid molecule encoding a polypeptide requiring both ABA and ABI3 to influence desiccation tolerance. Also provided are DNA constructs and methods of producing a transgenic plant engineered to have increased desiccation tolerance, increased drought tolerance or increased water use efficiency.

To survive on land, the earliest land plants had to develop mechanisms to tolerate desiccation. Modern seed plants possess an array of morphological features to retain water (such as conductive tissues, waxy layers on leaves, and openings in leaves that can be control to prevent water loss) and have retained desiccation tolerance in only a few specialized structures (e.g., seeds). Present-day bryophytes (mosses), in contrast, lack water transport and retention tissues, presumably like early land plants. As a result, their normal state is at equilibrium with the surrounding air, creating a water-deficit condition that most seed plants could not tolerate.
The plant specific transcription factor ABSCISIC ACID INSENSITIVE3 (ABI3) functions in ABA signaling during seed maturation and germination. It has been reported that ABI3 is evolutionarily conserved in the non-seed plant Physcomitrella patens. Furthermore, both ABA and ABI3 are required for P. patens vegetative tissue to survive desiccation.

Plants having increased desiccation tolerance, increased drought tolerance or increased water use efficiency