A substrate and a target are disposed within a vacuum chamber, and an oxygen partial pressure within the vacuum chamber is set to 1xc3x9710xe2x88x925 or less. Under this condition, a spinel ferrite thin film selected from the group consisting of compounds represented by the formula AE1+tFe2xe2x88x922tTMtO4, where AE represents an alkaline earth metal or an alkali metal, TM represents a transition metal and t falls within a range of between 0.2 and 0.6, and compounds represented by the formula Zn1xe2x88x92xCoxFe2O4, where x falls within a range of between 0.2 and 0.7, is deposited on the substrate by laser beam deposition. The particular method makes it possible to provide a spinel ferrite thin film realizing a spin glass state under temperatures around or higher than room temperature and capable of controlling the spin state by light.

This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2000-035119, filed Feb. 14, 2000, the entire contents of which are incorporated herein by reference.
The present invention relates to a spinel ferrite thin film exhibiting a high-temperature spin glass state and capable of spin control by light and a method of manufacturing the same.
A magneto-optical recording medium (MO) is known to the art as one of the magnetic recording media that have put to a practical use at present. In the conventional magneto-optical recording medium, a structural change is brought about within a recording medium by using a laser as a heat source so as to carry out recording. However, since a structural change is brought about by heat in the conventional medium, shortening in recording speed is limited. Since improvements in recording speed and in processing speed are required with recent increase in data, it is required to develop a magneto-optical recording medium in which data can be recorded directly with light, not with heat.
In a spin glass material, it is expected that magnetic properties, specifically its spin, can be controlled by light irradiation. Therefore, the spin glass material is a prominent candidate for a new magneto-optical recording medium. However, many spin glass materials exhibit the spin glass state only under very low temperatures such as 50 K or lower. This is because spin exchange interaction that determines a temperature at which the spin glass state is exhibited is low. Therefore, elevation of temperature at which the glass phenomenon is exhibited is a serious problem to be solved for putting the spin glass material to a practical use.
As examples of the material that exhibits the spin glass state at a high temperature such as room temperature, bulk Zn0.5Co0.5Fe2O4 (spin freezing temperature Tf=320 K) and an amorphous film of CoFe2O4 (Tf=284 K) have been reported to date. However, in order to use a spin glass material as a memory material, it is required to increase the width of selection of materials that achieve a spin glass state at temperatures around room temperature. In addition, concerning the above two materials, no report has yet been made relating to control of the spin state by light.
An object of the present invention is to provide a spinel ferrite thin film capable of exhibiting a spin glass state under temperatures around or higher than room temperature and capable of controlling the spin state by light, and a method of manufacturing the same.
According to a first aspect of the present invention, there is provided a spinel ferrite thin film selected from the group consisting of compounds represented by the formula:
AE1+tFe2xe2x88x922tTMtO4
where AE represents an alkaline earth metal or an alkali metal, TM represents a transition metal, and t falls within a range of between 0.2 and 0.6, i.e., 0.2xe2x89xa6txe2x89xa60.6, and
compounds represented by the formula:
Zn1xe2x88x92xCoxFe2O4
where x falls within a range of between 0.2 and 0.7, i.e., 0.2xe2x89xa6xxe2x89xa60.7.
In the spinel ferrite thin film of the present invention, the alkaline earth metal or the alkali metal is selected from the group consisting of magnesium and lithium, and the transition metal is selected from the group consisting of cobalt, titanium, zinc, vanadium, manganese, chromium and nickel.
According to a second aspect of the present invention, there is provided a method of manufacturing a spinel ferrite thin film, comprising steps of:
disposing a substrate and a target within a vacuum chamber, followed by setting an oxygen partial pressure within the vacuum chamber to 1xc3x9710xe2x88x925 Torr or less; and
depositing by a laser beam deposition a spinel ferrite thin film selected from the group consisting of compounds represented by the formula:
AE1+tFe2xe2x88x922tTMtO4
where AE represents an alkaline earth metal or an alkali metal, TM represents a transition metal, and t falls within a range of between 0.2 and 0.6, i.e., 0.2xe2x89xa6txe2x89xa60.6, and
compounds represented by the formula:
Zn1xe2x88x92xCoxFe2O4
xe2x80x83where x falls within a range of between 0.2 and 0.7, i.e., 0.2xe2x89xa6xxe2x89xa60.7.
In the method of the present invention, it is desirable for the substrate to be selected from the group consisting of a sapphire single crystal and a strontium titanate single crystal.
According to a third aspect of the present invention, there is provided a method of controlling magnetization of a spinel ferrite thin film by light, comprising steps of:
applying at least 30% of a magnetic field relative to coercive force Hc to the spinel ferrite thin film; and
irradiating the spinel ferrite thin film with light, while applying the magnetic field to the thin film, so as to increase the magnetization of the thin film.
Additional objects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out hereinafter.

Spinel ferrite thin film and method of manufacturing the same


A connection between a fluid line and a connecting element, in which at one end the line has an insertion part, and the connecting element is provided with an bore for accommodating the insertion part of the line, in which the line is provided with a locking shoulder, and in which the connecting element is designed to accommodate a locking element, which locking element when fitted covers the locking shoulder of the line, so that the insertion part of the line is locked in the bore of the connecting element, in which the bore, viewed in the insertion direction of the insertion part has a first part with a first diameter and connecting thereto a second part with a second diameter which is smaller than the first diameter. At the bore of the connecting element an receiving element for the locking element is fitted immovably, which receiving element has a through axial bore connecting to the bore, in such a way that the insertion part of the line projects through the axial bore of the receiving element and projects into the bore of the connecting element. The receiving element is provided with an outward projecting annular flange which fits into the first part of the bore. The annular flange of the receiving element is fixed in the first part of the bore by deformation of the connecting element.

U.S. Pat. No. 3,538,940 discloses a connection between a distibutor block and several fluid lines. The distributor block is provided with an bore for receiving an insertion fitting fitted to the end of a fluid line. In the case of this known connection the fluid line fitting is locked by means of a U-shaped metal clip which is slided into a slot formed in the distributor block and running parallel to the insertion side of the bore.
The disadvantage of this known connection is that making the slot in the distributor block requires a special milling operation which is complicated, in particular if the connecting member has a cylindrical shape.


A cuvette for arrangement in an optical measuring device includes a receiving chamber for a measuring medium having an inlet. The receiving chamber is delimited at least in some regions by two opposing plane-parallel side surfaces. Two opposing metallic electrodes are arranged in the receiving chamber on the opposing side surfaces.

Optical measuring methods have become established in process analysis measuring technology. In this case, the measuring medium can be mixed with one or more reagents, possibly heated and then poured into a glass cuvette.
There the substance to be analyzed reacts with the reagent, resulting in a color change, depending on its concentration. This color change is detected by means of an optical measuring method. However, an addition is not absolutely necessary with other optical measuring methods.
Cuvettes, including glass cuvettes, are often used in the prescribed field of application.
For further analysis parameters of the medium such as temperature, conductivity or pH, dedicated measuring points and fittings are provided for the necessary sensors in the tubing or piping of the analysis device.
Separate external sensors may also be used for process reliability in filling and emptying the cuvettes.
In order to avoid contamination within the cuvettes, normal analysis devices have cleaning cycles or a replacement of the cuvette is considered. The cuvette can be cleaned with clean water, and the zero values then determined can be offset against the actual measured values in order to compensate for contamination.

Cuvette, preferably flow-through cuvette for an optical measuring device, and method for its operation


A chemical mechanical polishing apparatus is described, which includes a platen, a polishing pad that is attached to the platen, and a means for adjusting the temperature of the polishing pad.

The present invention relates to chemical mechanical polishing apparatus, which may be used to make semiconductor devices.
To make a semiconductor device, several layers of different types of material are deposited on a substrate, e.g., a silicon wafer. After they are deposited, those layers are processed to create devices and interconnects that form the desired integrated circuits. Many of those layers must be planarized to ensure that subsequently deposited layers will be applied to a substantially flat surface. A widely adopted planarizing technique is chemical mechanical polishing (xe2x80x9cCMPxe2x80x9d).
FIG. 1a illustrates a cross-section of a structure that may be formed when making a semiconductor device. That structure includes conductive layer 100 upon which is formed dielectric layer 101. Barrier layer 102 lines a via that has been etched into dielectric layer 101, and copper layer 103 is formed on barrier layer 102. A CMP step is applied to that structure to remove copper layer 103, and the underlying barrier layer, from the surface of dielectric layer 101xe2x80x94generating the structure shown in FIG. 1b.
Current methods for controlling the CMP process rely on modifying slurry composition and polishing pad properties. Changes to the slurry composition and/or the polishing pad may not, however, enable the polish rate, or the selectivity of that rate across different layers, to be optimized. Taking the example illustrated in FIGS. 1a and 1b, to produce the structure shown in FIG. 1b requires polishing through copper layer 103, then through barrier layer 102. Because copper is a relatively soft metal, it will polish at a relatively high rate, when compared to the rate at which barrier layer 102 (typically made from a relatively hard material like tantalum or tantalum nitride) is polished. When continuing to polish the structure after breaking through copper layer 103 to barrier layer 102, differences in selectivity of the polishing process to those two layers can cause significant dishing of wide features.
Such differences in selectivity may be a significant concern, when making damascene based structures. To make such structures, low selectivity between the primary metal (e.g., copper) and the underlying barrier layer (e.g., tantalum or tantalum nitride) is required; whereas, high selectivity must be maintained between those materials and the underlying dielectric layer to stop the CMP process on that layer. Optimally, the relative selectivity of the polishing process to the primary metal and the barrier layer is about 1:1; whereas, the relative selectivity to those materials, when compared to the dielectric layer, is about 100:1, or greater. Maintaining such a high degree of selectivity between the primary metal/barrier layer and the dielectric layer may be difficult, when such a layer is formed from polymer based, carbon based or porous low k dielectrics, as such materials are not as strong as silicon dioxide.
Accordingly, there is a need for an improved CMP apparatus that enables better control of the polishing rate and the selectivity of the polish rate across different layers. There is a need for such an apparatus that enables higher throughput for the CMP process. The present invention provides such an apparatus.

Apparatus for enhanced rate chemical mechanical polishing with adjustable selectivity


Controlling rate of resource consumptions improves manageability of resources in relation to the entities consuming the resource. A consumer's resource consumption behavior can be controlled with a mechanism that throttles its resource requests to conform to a threshold rate, such as a resource consumption rate. A set of one or more computations tracks a consumption measurement variable over a given time interval, such as number of resource requests for a given resource within the last 5 seconds. When a resource request is received, the set of computations determine whether servicing the resource request would exceed the threshold rate. If the threshold rate would be exceeded, then the computations sleep until servicing the resource request would not exceed the threshold rate.

1. Field of the Invention
The present invention relates to the field of computers. More specifically, the present invention relates to resource management.
2. Description of the Related Art
Traditionally, resource management is handled by operating system environments. Resource management includes management of CPU time, heap memory, and network bandwidth. Since resource management is typically handled by operating system environments, application and generation of resource management policies are limited by operating system environment constraints and complicated by native/proprietary code or shell scripts necessary to interact with the operating system.
Meeting performance requirements and satisfying various tasks, such as load balancing or preventing denial of service attacks, are difficult if not impossible within the limitations of operating system controlled resource management. Safe languages, such as the Java® language, provide a vehicle for meeting performance requirements and satisfying various tasks that are difficult or impossible within the traditional operating system environment limitations.
A safe language (e.g., Java®, Tcl, TeleScript, etc.) allows untrusted program components to be incorporated in a framework where untrusted program components interact safely and efficiently with other program components. A safe language prohibits a program component from circumventing programming abstractions and access restrictions (e.g., illegal type casts, function calls with arguments of inappropriate type or causing stack overflow). An example design aspect for a safe language is removal of pointers. Many access protection problems stem from a program's ability to forge pointers. A program can use pointers and pointer arithmetic to violate access restrictions by accessing objects as something they are not (e.g., a byte array or an object with the same data layout as the actual object but without its access-restrictions). A safe language can provide separate name-spaces to prevent confusion of variables and functions between programs, and ways to insure provision of a service. Generally, safe languages use one or more of three approaches to ensure that a programs' access privileges are constrained: restrict or disallow access to the underlying system; analyze a program to ensure that it conforms to certain stipulated restrictions; or use a computational model that makes certain actions impossible to implement.
Safe languages are increasingly being used as the primary vehicle for organizing computing resources into applications, network services, etc. As part of this evolutionary trend, safe languages are being used to implement complete computing platforms, assuming responsibilities that have historically belonged to the underlying operating system environment.
However, the conventional use of safe languages to implement complete computing platforms falls short to the extent that safe languages do not provide some of the features of operating system environments. This shortfall and the lack of a standard, programmatic way to manage resources outside of the operating system environment has forced developers to take cognizance of the underlying operating system environment, thus leading to a number of awkward, ad-hoc techniques, limiting the expressiveness of safe languages.

Regulation of resource requests to control rate of resource consumption


In the formation of a stacked IC device formed by stacking IC chips by a plurality of levels, the number of selecting bonding wires connected to select an IC chip on a certain level is reduced. The selecting device of the IC chip on each of the levels is connected to the selecting device on a neighboring level in the form of a chain to form a shift register so that only when a trigger signal is applied to the selecting device, the selecting device sequentially transmits a signal held in itself to the selecting device on the neighboring level.

The present invention relates to a stacked IC package formed by stacking IC chips (boards) by a plurality of levels and, more specifically, to a device having functions such as the function of selecting an IC chip on a certain level in order to enable input/output to/from the IC chip on the level in the stacked IC package.
In the formation of an FPGA (field-programmable gate array), a memory and a stacked IC package, if only two or three types of ICs are necessary, their cost performance will be improved. However, if a stacked IC package is to be formed by stacking IC chips of the same type, the I/O pads of all the IC chips need to be perpendicularly connected to one another, with the result that a bus contention problem may occur. In addition, it has conventionally been necessary to connect selecting bonding wires to all the IC chips in order to enable selection of an IC chip on a certain level in the stacked IC package.
The invention has been made in order to solve the problems of the related art, and an object of the invention is to provide a device capable of reducing the number of types of necessary IC chips in the formation of a stacked IC package.
Another object of the invention is to provide a device capable of reducing the number of selecting bonding wires to be connected to the IC chips of a stacked IC package in order to enable selection of an IC chip on a certain level in the stacked IC package. In association with this object, a further object of the invention is to provide a stacked IC package having the function of counting the number of IC chips included in a stacked IC package.

Stacked IC device having functions for selecting and counting IC chips


Described are compositions comprising a desired material, e.g., a soluble fiber, entrapped within a protein matrix, and methods of preparation and use thereof. In a preferred embodiment, the subject invention provides a method for entrapping a soluble fiber compound within a protein matrix, wherein the method comprises the following steps: (a) a soluble fiber compound is first mixed with undenatured protein to create a uniform dispersion, wherein the dispersion thus created comprises protein at a concentration of at least about 25% and soluble fiber at a concentration of less than about 75%; (b) the dispersion created in step (a) is then mixed with water and subjected to elevated pressures, wherein the pressures reduce the water content of the composition to less than about 50%, thereby forcing the protein and the soluble fiber compound into close molecular proximity; and (c) the dispersion is then subjected to heat of at least about 300.degree. F., thereby entrapping the soluble fiber compound within the protein matrix, and wherein the heating process reduces the water content of the composition to less than about 5%.

1. Field of the Invention
This invention relates to methods for preparing a protein-enriched soluble fiber composition and the use of this material in making a dietary supplement.
2. Related Art
The soluble fiber useful according to the subject invention is well known to those skilled in this art. Specifically exemplified herein is the use of pectin and guar gum compositions as the soluble fiber source. Pectins are a group of high-molecular-weight heterogenous polysaccharides which serve as fundamental structural components of plant cell walls in fruits and vegetables, particularly limes, lemons, grapefruit, and oranges. Pectin is composed of D-anhydrogalacturonic acid units linked through .alpha.(1.fwdarw.4)-glycosidic bonds forming a polygalacturonic acid with some of the carboxyl groups esterified with methanol. Since pectin and guar gum are not susceptible to hydrolysis by the alimentary tract enzymes of humans, it is classified as a water-soluble fiber dietary supplement.
Soluble fiber products are often manufactured by aqueous extraction of appropriate edible plant material such as those enumerated above. Several specific examples are discussed below.
Guar gum. Guar gum is derived from the seed of the guar plant. The plant has been grown in India and Pakistan for centuries. The guar plant is a pod-bearing legume. The seeds of the plant are composed of the hull, germ, and endosperm. Guar gum is produced by milling the endosperm after removal of the hull and germ.
Guar gum, which has a molecular weight of about 220,000-300,000, is a galactomannan with linear chains of D-galactomannopyranosyl units with side branching units of D-galactopyranose attached by (1.fwdarw.6) linkages.
Guar gum is nonionic and is compatible with salts over a wide range of electrolyte concentration. The hydration and water-binding properties of guar gum are responsible for its use in food stabilization systems. Ice cream stabilizers, particularly high-temperature, short-time processes, use guar gum, at a concentration of 0.3%. These same properties render it useful in the stabilization of ice pops and sherbets. Guar is allowed at levels up to 3.0% in cold-pack cheese foods. In soft cheeses, guar increases the yield of curd solids and gives curds a better texture. It is useful in cake and donut mixes at levels under 1%. In pie fillings, guar thickens and prevents shrinking and cracking of the filling. Used in icings to absorb free water, guar gum is mixed at a level of 1 part gum to 250 parts sugar and 30 parts water.
Guar gum has also been used as a thickener in salad dressings and pickle and relish sauces at 0.2-0.8%. Gum guar alone or in combination with agar at levels of 0.5% is useful in processing canned meat products. It prevents fat migration during storage and stops syneresis and water accumulation and reduces the tendency for voids to be present in the can.
Locust bean gum. The locust bean, or carob, is an ancient leguminous plant. It is indigenous to the Mediterranean and Near East. Arabs used the carob seed as a unit of weight. The seed, called karat, became a standard (carats) against which gold and precious gems were weighed. The carob pod or fruit has been widely used as a foodstuff. It is very sweet, and its flavor is further enhanced by roasting. The carob fruit is dark brown, 4-10 inches long, and pod-like. The pod contains the seed which is the source of locust bean gum. The seed is composed of the outer husk, a central germ, and the endosperm. The semitransparent layer of endosperm yields the desired gum. In commerce the seed is dehusked, split, and the germ removed. The separated endosperm is finely milled. The gum is an off-white powder.
Locust bean gum, which has a molecular weight of 310,000, is essentially a straight D-mannose polymer with branching on every fourth or fifth mannose group on C-6 by single D-galactose units. The structure is similar to that of gum guar.
Locust bean gum is widely used today in many industries. It is an excellent ice cream stabilizer. Carob bean gum acts as a binder and stabilizer in processed meats, salami, bologna, and pork sausages. In soft cheese manufacture, about 0.5% locust bean gum speeds up coagulation, increases the yield of curd solids by about 10%, and makes the curd easier to separate and remove. Locust bean gum is sometimes used to thicken soups at levels of 0.2-0.5%. Locust bean gum is used as a thickener in pie fillings. The gum yields a clear, fruit-like filling when used at a level of 1-2% of the weight of the fruit juice and water. In bakery products the use of high quality locust bean gum produces more uniform doughs. Locust bean gum is utilized as a stabilizer and binder in many prepared foods such as soup bases, sauces, frozen batter, and vegetable and fish dishes. IT has been used to stabilized whipped cream, mayonnaise, and tomato ketchup, as well as salad dressings.
Gum arabic. Gum arabic is the dried, gummy exudate obtained from Acacia senegal and various other Acacia species. The exudation of gum arabic is a pathological condition attributed to unhealthy trees, as the gum is produced from breaks or wounds in the bark of the tree. Arabic was known over 4,000 years ago and is the most common and universally used of all of the natural gums.
Gum arabic is official in the U.S. Pharmacopeia (U.S. Pharmacopeial Convention, 1975) as well as the Food Chemicals Codex (Natl. Acad. Sci.-Natl. Res. Council, 1972). It is on the GRAS (generally recognized as safe) list under the Federal Food, Drug, and Cosmetic Act.
Gum arabic is a neutral or slightly acidic salt of a complex polysaccharide containing calcium, magnesium, and potassium ions. The main molecular structure is a chain of .beta.-galactopyranose units with some substitution at the C-6 position with various side chains.
Gum arabic is the most widely used of all the plant hydrocolloids. It is compatible with other gums, proteins, carbohydrates, and starches. It is commonly employed at a level of 2 lb/gallon of emulsion. It also serves to stabilize foams in the manufacture of soft drinks and beer. About 3 lb is enough to stabilize 50 barrels of beer. Gum arabic is also used in dairy products such as ices, sherbets, and ice creams. Here it functions to retard both ice crystal formation and growth.
Gum arabic is widely used in the candy industry. The gum is used to emulsify fats and retard sugar crystallization. It is used as a glaze in candy products and as a component of chewing gum, cough drops, and candy lozenges. Lozenges are also prepared from gum arabic by mixing finely ground or powdered sugar with a thick mucilage of gum arabic. Dietetic or sugarless hard candy drops and jujubes can be prepared from combinations of gum arabic, sorbitol, and mannitol. Arabic at a level of 1-3% will give a hard candy, 5-35% a medium center, and a soft drop can be obtained utilizing approximately 70% gum. The greater the percentage of arabic, the softer and more chewable the candy. An excellent glaze for marzipan and buns, gum arabic also acts as a protective coating in panned confectionery goods, and may be used in coating nuts. Gum arabic also improves the baking properties of rye and wheat flour at levels as little as 0.015%. The gum extends the shelf-life of bread by rendering it softer. It truly has universal applications.
Pectin. Food-grade pectin consists of partially methylated polygalacturonic acid units and is normally classified according to its degree of esterification or methoxyl content.
In high ester or high methoxyl (HM) pectin, a relatively high portion of the carboxyl groups occur as methyl ester and the remaining carboxylic acid groups are in the form of the free acid or as its ammonium, potassium, calcium, or sodium salt. Pectin in which less than 50% of the available carboxyl acid groups occur as the methyl ester is normally referred to as low methoxyl (LM) pectin. In general, LM pectin is obtained from HM pectin by a treatment such as mild acid or alkaline conditions. Amidated pectin is obtained from HM pectin when ammonia is used in the alkaline deesterification process. In this type of pectin, some of the remaining carboxylic acid groups have been transformed into the acid amide. Commercial soluble fibers are normally blended with sugars for standardization purposes, and some types may contain suitable food-grade buffer salts required for pH control and desirable setting characteristics.
Since it is a constituent of all plants, soluble fiber has long been part of the human diet. Pectin has been evaluated and cleared toxicologically by the Joint FAO/WHO Expert Committee on Food Additives. National and international food regulations recognize that pectin is a valuable food gelling agent and harmless food additive. Pectin is included in the list of permitted additives in standardized foods when a technological need can be proven.
Soluble fiber has been shown to be an effective hypocholesterolemic agent with minimal side effects (Reiser 1987! Food Technol. 31-91). It has also been found that grapefruit pectin inhibits hypercholesterolemia and atherosclerosis in miniature swine (Baekey et al. 1988! Clin. Cardiology 11:595-600). Furthermore, grapefruit pectin has proved to lower plasma cholesterol in human volunteers who were hypercholesterolemic, and to improve the ratio of low density lipoprotein cholesterol (LDLC) to high density lipoprotein cholesterol (HDLC) (Cerda 1988! Clin. Cardiology 11:589-594).
U.S. Pat. No. 4,497,838 describes the preparation of various orange products from orange peels. The preparation involves extraction of orange peels with a non-aqueous water-miscible solvent. The solvent-extracted peel is dried to produce a product high in cellulose and pectin.
Simple methods which allow the manufacture of soluble fiber food compositions are needed to provide the general public with dietary forms of soluble fiber. The present invention provides a preparation method which achieves this goal.

Preparation and use of a protein-enriched soluble fiber composition


Methods and a voltage regulator are provided for distributing power sourcing in a hybrid power plant system. The voltage regulator is configured to monitor an output power of a generator and control an excitation signal provided to the generator based at least in part on the generator output power.

The embodiments described herein relate generally to hybrid power plant systems, and more particularly, to methods and systems of distributing active power sourcing in hybrid power plant systems.
In certain hybrid power plant systems, a synchronous generator shares production of power demanded by a load with other sources of power to drive an engine. The other sources of power are often of a direct current (DC) nature, for example, a battery bank coupled in parallel with the generator. The hybrid power plant systems are generally those that have variable power demand are designed such that no single power source is capable of providing all the required power during periods of high power demand.
In such hybrid systems, the generator includes a voltage regulator for output voltage by the generator. A typical voltage regulator has a function that lets a user define a desired generator output voltage. The voltage regulator measures the generator's output voltage and attempts to keep it at that user-defined voltage by increasing or decreasing excitation current to the generator. Typical voltage regulators tend to have problems in sharing the load demand with the battery bank. Because the battery bank is not an ideal and constant DC power source, it outputs a voltage which is dependent on charging and/or discharging conditions at a particular instant in time. If the voltage of the battery bank is lower than the rectified generator output voltage, the battery bank suppresses the generator output voltage. Conversely, if the voltage of the battery bank is higher than the rectified generator output voltage, the battery bank unloads the generator, causing the generator output voltage to increase. Because of the influence of the battery voltage on the generator output voltage, the voltage regulator continuously reacts to changes in battery voltage, which may cause unstable voltages regulation and/or other conditions that may trip faults, which may cause nuisance behavior and/or damage or destroy system components. Such poor load sharing is due to the voltage regulator's response to battery loading characteristics. Known methods of load sharing do not alter the voltage regulator's control strategy during periods of battery draw.
For example, in a hybrid vehicle with an engine-generator set and a battery bank, during normal operation, the generator alone provides sufficient power for the electric motors to enable the vehicle to move. But, if the vehicle is driven up a steep hill, or if the load is increased, the generator may need assistance from the battery bank for short durations. The voltage regulator on the vehicle must recognize a heavy load condition and control the generator output to achieve load sharing with the batteries. Voltage regulators that are not designed for load sharing with DC sources provide poor load sharing during engagement of battery power draw because they are constantly reacting to influences of instantaneous changes in battery terminal voltage. Voltage regulators that do not implement a strategy for battery load sharing exhibit unsteady voltage regulation, causing periods of engine overloading. This may cause the engine speed to drop during the overload event, further causing a voltage dip to ripple through the electrical drive system. Voltage dips may cause nuisance power trips of downstream connected power converters and may cause the vehicle to lose power.

Methods and voltage regulator for power distribution in a hybrid system


Oxide-coated Fe powder for producing various electromagnetic circuit components requiring high resistivity is provided. The oxide-coated Fe powder is a Mg-containing oxide film-coated iron powder coated with an Mg—Fe—O ternary-based deposition film at least containing (Mg, Fe)O. The (Mg,Fe)O is a crystalline MgO-dissolving wustite. The Mg—Fe—O ternary-based oxide deposition film has a sulfur-enriched layer containing a higher concentration of sulfur than that of central portion of the iron powder, fine crystalline texture having a grain size of 200 nm or less, and the outermost surface is substantially composed of MgO. A composite soft magnetic material using the Mg-containing oxide film-coated iron powder is also provided.

Since low core loss is generally required for soft magnetic materials used in various electromagnetic circuit components, it is generally known that hysteresis loss is reduced by reducing coercive force, and eddy current loss is reduced by increasing electric resistance. Moreover, because of recent requirements for down-sizing and high response of electromagnetic circuits, relatively high magnetic flux density is considered to be important.
A Mg-containing oxide film-coated iron powder formed by coating Mg-containing ferrite films having insulating property on the surfaces of the iron powder particles is known as an example of the above-described soft magnetic material having high resistivity (see Patent Reference 1).
A Mg-containing-chemical-conversion-film-coated powder formed by coating the Mg-containing-chemical-conversion-films on the surfaces of iron silicide powder particles is known as another example (see Patent Reference 2).
In addition, an iron-based Fe—Si-based soft magnetic powder containing 0.1 to 10 weight % of Si, and the balance consisting of Fe and unavoidable impurities is known as another example. Soft magnetic powder formed by coating materials of high resistance on the surfaces of the iron-based Fe—Si-based soft magnetic powder particles is also known. A manufacturing method of a composite soft magnetic material is known, where the soft magnetic material powder provided with the surface coating of high-resistance material is press-molded, and the obtained compact is heat-treated, thereby forming a composite soft magnetic material having high resistivity and a texture in which materials of high resistance exist in interstices of soft magnetic particles (see Patent Reference 3).
In another known method, a Mg-containing iron oxide film-coated iron powder coated with a Mg-containing ferrite film by a chemical process is mixed with glass powder having a low melting point to form a mixed powder, the mixed powder is press-molded and heat-treated, and a compact powder magnetic material is manufactured (see Patent References 4 or 5).
Patent Reference 1: Japanese Unexamined Patent Application, First Publication No. H11-1702.
Patent Reference 2: Japanese Unexamined Patent Application, First Publication No. 2003-142310.
Patent Reference 3: Japanese Unexamined Patent Application, First Publication No. H5-258934.
Patent Reference 4: Japanese Unexamined Patent Application, First Publication No. 2004-253787.
Patent Reference 5: Japanese Unexamined Patent Application, First Publication No. 2004-297036.
However, in the conventional Mg-containing oxide film-coated iron powder coated with the Mg-containing ferrite film, the Mg-containing ferrite film is coated on the surface of the iron powder through a chemical process. Therefore, in the composite soft magnetic material obtained by performing high-temperature heat treatment for reducing strain of a press-molded compact, the ferrite film is destabilized and changed, and its insulation property is deteriorated. In addition, bonding of the Mg-containing ferrite film to the surface of the iron powder is not sufficient, and a composite soft magnetic material having sufficient strength cannot be manufactured by press molding and subsequently baking the Mg-containing iron oxide film-coated iron powder. In composite soft magnetic materials manufactured by press molding and baking the Mg-containing oxide film-coated iron powder coated with the conventional Mg-containing ferrite film or by press molding and heat treating the mixed powder obtained by mixing the glass powder having a low melting point with the Mg-containing iron oxide film-coated iron powder coated with the Mg-containing ferrite film, the Mg-containing ferrite film cannot exert a sufficient insulation effect because of delamination during the press molding or the like, and therefore sufficient high temperature resistivity cannot be obtained.
In addition, in the chemical-conversion-film-coated iron silicide powder coated with the conventional Mg-containing chemical conversion film, since the Mg-containing chemical conversion film is coated by a chemical process, bonding strength of the oxide film to the iron silicide powder particle is weak and the oxide film itself has weak strength. Therefore, in the complex soft magnetic material manufactured by press molding and baking the conventional chemical conversion film-coated iron silicide powder, the chemical conversion film cannot exert a sufficient insulation effect because of delamination or tearing of the film during the press molding or the like, and therefore sufficient high temperature resistivity cannot be obtained. In addition, the chemical conversion film formed by coating the above-described Mg-containing chemical conversion film by a chemical process is sometimes degraded during the high temperature baking treatment for removal of strain, thereby reducing the resistance, and therefore, a complex soft magnetic material having sufficient high temperature resistivity cannot be obtained.
An Mg-containing ferrite oxide film may be considered as an example of high resistance material formed on the particle surface of the above-described iron-based Fe—Si-based soft magnetic powder. However, even when an iron-based Fe—Si-based soft magnetic powder coated with the Mg-containing ferrite oxide film is press-molded into a compact, and strain-relief heat treatment at a high temperature is performed on the compact, sufficient high-temperature resistivity cannot be obtained. Because the Mg-containing ferrite is generally unstable in relation to heat, its insulation property is easily reduced by the change of ferrite structure caused by heating. As a result, insulation property of the obtained composite soft magnetic material is reduced.
In addition, in the iron-based Fe—Si-based soft magnetic powder coated with the conventional Mg-containing ferrite oxide film, the Mg-containing ferrite oxide film is coated on the surface of powder particle through a chemical process. Therefore, bonding of the Mg-containing ferrite oxide film to the surface of iron-based Fe—Si-based soft magnetic powder particle is not sufficient. Therefore, in the composite soft magnetic material manufactured by press molding and heat-treating the iron-based soft magnetic powder coated with the conventional Mg-containing ferrite oxide film, delamination or breakdown of the Mg-containing ferrite oxide film or the like occur during press molding, and sufficient insulation effect cannot be exerted. Therefore, sufficient high resistivity could not be obtained.

Iron powder coated with Mg-containing oxide film


The present invention comprises novel “one-step” methods for the production of gold sol and gold sol conjugates. The methods disclosed herein produce gold sol and colloidal gold conjugates with product with yields on the order of about 20 ODs. Since current methods in the art yield conjugates at concentrations on the order of about 2 ODs, the present invention represents an approximately 10-fold increase in production over conventional methods. The novel method provided herein also does not result in the production of undesired aggregate by-products that, in conventional methods, must be removed via centrifugation, filtration or other means. The new method is therefore less labor intensive and requires less time to complete than standard methods in the art for synthesizing pure colloidal gold conjugates.

Colloidal gold solutions (gold sols) are useful in immunochemistry, bioresearch, and medical diagnosis and in the physical and chemical sciences. A gold sol is a suspension of gold particles measuring about 5 to 150 nm in either a flake or particle shape. The shape and size of the particle is important in permitting the particle to remain in suspension. In other words, the particles need a high surface-to-volume ratio. This geometry allows the particle to be subject to the forces of Brownian movement rather than the force of gravity thereby allowing it to remain in suspension.
Gold sols are used in research and medicine as, primarily, a labeling agent. Gold sol can be bound to proteinaceous molecules and other compounds facilitating their use as a labeling agent. Because of the electron dense nature of the gold particles, gold sol-conjugated labels are reagents of choice in electron microscopy, light microscopy, flow cytometry, blotting, hybridization assays and rapid diagnostic tests.
Current manufacturing methods for gold sol and gold sol-based conjugates are time consuming and labor intensive and/or have poor quality and quantity yields. The methods are dependent on precise chemical and physical parameters and often require "clean-up" steps involving ultracentrifugation, filtering or other mechanical means to remove gold sol aggregates (e.g., see, U.S. Pat. No. 6,833,275 B1 to Nichtl, which is herein incorporated by reference; Geoghegan, W. D. and G. A. Ackerman, J. Histochem. Cytochem. 25, 1187-1200, 1977). It is believed that aggregation occurs because current manufacturing procedures result in supersaturation of the gold particles in the solution. Because of the supersaturation, the gold sol particles form "nuclei." These nuclei facilitate aggregation in a process called nucleation. Controlling aggregation via optimized prior art manufacturing conditions is theoretically possible but in practice is hard to achieve (Chauduri, B. and S. Raychauduri, Manufacturing High-Quality Gold Sol, IVD Technology, March 2001). If not removed, the aggregates can cause the clumping of proteins (or other substances chosen to be gold sol-labeled) upon conjugation. These clumps then interfere with the protocol for which the gold sol conjugates are used.
Current manufacturing protocols also achieve relatively low yields. A concentration yielding an OD 530 nm reading of about 2 units is typical (see, e.g., U.S. Pat. No. 4,313,734 to Leuvering, which is herein incorporated by reference). Because of the labor intensity of the current manufacturing processes as well as the poor yields that are obtained, gold sol production is costly.
Additionally, gold sol conjugation is also not without problems. For example, conjugation of gold sol to thiol-containing molecules such as proteins often require the "coating" of the gold sol with n-alkanethiol and n-alkanethiol derivatives prior to conjugation (e.g., see, U.S. Pat. No. 5,294,369 to Shigekawa, which is herein incorporated by reference). These additional steps add even greater time and cost to an already expensive and labor-intensive undertaking.
What is needed are methods for the more efficient and economical production of gold sol and gold-sol thiol conjugates.


An apparatus and method for removing air or other gases from a free-ink ink-jet pen is provided in a manner that does not waste ink or require disposal of purged ink. A gas separation and purge mechanism is incorporated into a pen body construct having an ink containment chamber such that gases will rise toward the mechanism. A vacuum is cyclically applied to the gas separation and purge mechanism to remove the gas and to allow the ink containment chamber to refill from a remote reservoir as needed.

The art of ink-jet technology is relatively well developed. Commnercial products such as computer printers, graphics plotters, and facsimile machines employ ink-jet technology for producing hard copy. The basics of this technology are disclosed, for example, in various articles in the Hewlett-Packard Journal, Vol. 36, No. 5 (May 1985), Vol 39, No. 4 (August 1988), Vol 39, No. 5 (October 1988), Vol. 43, No. 4 (August 1992), Vol. 43, No. 6 (December 1992) and Vol. 45, No. 1 (February 1994) editions, incorporated herein by reference. Ink-jet devices are also described by W. J. Lloyd and H. T. Taub in Output Hardcopy [sic] Devices, chapter 13 (Ed. R. C. Durbeck and S. Sherr, Academic Press, San Diego, 1988).
Generally, in the thermal ink-jet field, an ink-jet pen is provided with a printhead, having an orifice plate in combination with heating elements. Thermal excitation of ink is used to eject droplets through miniature nozzles and orifices, onto a print medium, forming alphanumeric characters or images using dot matrix manipulation. Other types of ink droplet generators, such as the use of piezoelectric transducers, are also known in the art.
The pen may also serve as a reservoir for storing ink and providing appropriate amounts of ink to the printhead during a printing cycle. Ink can be stored in a contained medium, such as a permeable foam material, in a disposable pen (see e.g., U.S. Pat. No. 4,771,295 (Baker et al.), assigned to the common assignee of the present invention and incorporated herein by reference). Or, the pen can be a free-ink type, where the ink is supplied to a printhead mechanism from an on-board reservoir or, if refillable, from a remote ink supply to a relatively permanent printhead mechanism (see e.g., U.S. Pat. No. 4,929,963 (Balazai), assigned to the common assignee of the present invention, incorporated herein by reference).
While such pens provide a reliable and efficient means of "jetting" droplets of ink from the nozzle plate onto the print medium, the printheads generally require a mechanism to prevent the free flow of ink through the orifices when the printhead is not activated. Without this control, ink may leak, or "drool", onto the printing surface or into the hard copy transport and printer mechanism. Such leaking ink may also build up and cake on the printhead itself, impairing proper operation. Complex pen service stations are often provided where pens can be wiped or activated to "spit" away excess ink.
To alleviate this problem, many ink-jet printers supply ink from the reservoir to the printhead at a slight under pressure, also referred to in the art as "back-pressure" or "negative pressure" operation, such as at about minus three (-3) inches Water Column (WC) lower than the ambient atmospheric pressure at the printhead. To be effective, this pen back-pressure must be maintained consistently and predictably within a desired operating range. That is, the pen back-pressure must be large enough to prevent the unwanted free flow of ink through the orifices, yet at the same time, small enough so that the printhead, when activated, can overcome the back-pressure and eject ink droplets in a consistent and predictable manner. This back-pressure will be affected by changes in either or both the ambient atmospheric pressure or the internal pressure. Likewise, temperature variations may cause the ink and air within the ink-jet pen to contract or expand, also affecting the back-pressure. Therefore, these factors must be accounted for and a mechanism should be incorporated into an ink-jet pen to maintain the back-pressure within the predetermined desirable operating range.
In a foam reservoir pen, the capillary action of the foam will generally be sufficient to create the desired back-pressure. In a free-ink reservoir type ink-jet pen, a variable volume, local reservoir is often employed. For example, the reservoir may be of a biased, flexible material which can expand or contract as shown in U.S. Pat. No. 4,500,895 assigned to the assignee of the present invention and incorporated herein by reference. Or, an on-board ink containment chamber may be provided which includes a pressure regulator device as shown in U.S. Pat. No. 4,509,602, assigned to the common assignee of the present invention and incorporated herein by reference. U.S. Pat. No. 4,677,447, assigned to the common assignee of the present invention and incorporated herein by reference, describes the use of a check valve in a printing device with an on-board ink reservoir that maintains a constant pressure difference between the ink reservoir and the ink-jet printhead. U.S. Pat. No. 5,650,811 (Seccombe et al.), assigned to the common assignee of the present invention and incorporated herein by reference, describes a pressure regulator located on-board an ink-jet pen using an off-board ink reservoir.
As the volume of ink within the reservoir varies due to depletion, thermal or ambient pressure variations, and the like, the volume of the local ink containment chamber also varies. The back-pressure range can be affected by the introduction of gases into the free-ink reservoir. For example, air can be sucked up through the orifice plate or out-gassed from the ink composition. As a biasing regulator mechanism is specifically designed to maintain the back-pressure in the printhead mechanism local ink containment chamber within a predetermined range, such unpredictable and thus unaccounted for gases may adversely affect operation. Therefore, these gases must be removed from a free-ink reservoir if the printhead and regulator mechanism does not have enough compliance to prevent the expanding gases from forcing ink out of the orifices during temperature and altitude excursions.
Thus, there is a need for an gas purge and separator mechanism for free-ink ink-jet pen devices.

Method for separating and purging gases from a free-ink ink-jet pen


The present invention discloses a tactile feedback device for giving realistic touch sensation to the user by stimulating the skin of the user. The tactile feedback device of the present invention comprises a housing having one end positioned near the skin of the user in use, an actuator, touch pins and an elastic means. The actuator is mounted inside the housing to convert electromagnetic energy into kinetic energy. The touch pins are mounted inside the housing so as to pop in and out, and the front end thereof is popped out of one end of the housing to contact the skin, and is connected with the actuator so as to be operated by kinetic energy of the actuator. The elastic plates of the elastic means are mounted between one end of the housing and the actuator, and have the touch pins fixedly passing through so as to be interlocked with the touch pins, and when the touch pins pop in and out, they are elastically deformed to have elastic energy. According to the present invention, the touch pins stimulate the skin of the user by dint of an interlocking structure of the actuator that converts electromagnetic energy into kinetic energy and the elastic means, so it is possible to implement realistic touch sensation.

1. Field of the Invention
The present invention relates to a tactile feedback device, more specifically to a tactile feedback device for giving realistic feeling sensation to the user by stimulating the skin of the user.
2. Description of the Related Art
A haptic device has utilized in various fields such as virtual reality, simulation, wearable computers, robotics and medical use, and it is also called haptic interface. The haptic device is classified into a force feedback device for transmitting physical force to the muscles and joints and a tactile feedback device for transmitting skin stimulation such as texture, temperature, pressure, vibration and pain through mechanoreceptors that are in contact with the skin. The tactile feedback device is also called tactile display. It is important for the tactile feedback device to be provided with tactile technology for embodying realistic force such as the texture of actual body to the user by skin stimulation. In tactile technology, it is known that it is advantageous for idealistic cognition of touch sensation to array the interval between skin stimulating points at 1.3 mm or less.
As an example of tactile feedback device, a multi-layer touch display device is disclosed in U.S. Patent Laid-Open No. 2006/0012576A1. The multi-layer touch display device of this patent document comprises a touch plate, a plurality of tactile sensation modification components having magnetic force, and a plurality of coils. The tactile sensation modification components are mounted so as to operate on the touch plate. The tactile sensation modification components are vibrated according to the direction of the electric current applied to the coils, and the hand and/or finger of the user is stimulated by the vibration of the touch plate. Accordingly, the user can feel the touch sensation of the body displayed on screen.
However in the tactile feedback device of the aforementioned patent document, since the blade of the tactile sensation modification components is manufactured into a large area due to its mechanical structure, the intervals of the points stimulating the skin are far apart, so the problem is that it is insufficient for implementing the tactile sensation. Also, it has a disadvantage that there are many constraints to implementable displacement and force because the coil of the electromagnetic device is of a flat plate type as well as the blade of the tactile sensation modification components is supported on the touch plate by arms.

Korea Advanced Institute of Science and Technology


A method and apparatus for applying mortar to the underside of a building block to be laid so that the mortar to be applied is automatically conveyed upwardly from a mortar supply container into a mortaring region where it is applied to the underside of the building block. The mortar can be sprayed onto the building block or applied thereto by a rotating coating roller, thereby automating the application of mortar and also reducing the consumption thereof.

The invention concerns a method of applying mortar to the underside of a building block to be laid, and an apparatus for carrying out that method.
The term building block is used broadly to denote blocks, bricks and the like of varying sizes and configurations, which are to be laid in various structures for building purposes.
In laying brickwork it is still the usual practice for the mortar, in particular for the bed joints, to be applied by hand to the top side of the brickwork which has already been erected, and then for the next layer of building blocks or bricks to be put on to the mortar bed prepared in that way. That is also the case when for example so-called flat blocks produced from porous concrete are laid by means of thin-bed mortar, which is frequently also referred to as the `bonding agent`.
The procedure involving applying and distributing the mortar or thin-bed mortar, which hitherto usually precedes laying the next layer of building blocks, requires a high degree of experience and skill in order to overcome a whole series of difficulties.
Thus for example a relatively accurately controlled amount of mortar has to be put on to the top side of the brickwork and distributed with a very high degree of uniformity over a portion whose length greatly depends on the conditions prevailing at that time. If for example mortar with a relatively low water content is distributed over an excessively long length of brickwork which at that time is exposed to strong sunlight, then during the period of time, that is required for the subsequent operation of laying the next layer of building blocks, the -mortar in the portion in which the last blocks are to be laid may already have dried to such an extent that there is no longer any guarantee of producing a proper bonding effect and the old material has to be scraped out and replaced by fresh mortar. A corresponding consideration also applies when using mortar at temperatures of below 0.degree. C., at which an excessively long period of time between the step of applying the mortar and laying a building block thereon can result in the mortar freezing.
The layer of mortar which is applied first is also urged apart in the horizontal direction by virtue of the weight of the building block laid thereon and the pressing force which is to be exerted in order to make the bed joint of uniform thickness. If an excessive amount of mortar was applied, the result is that the mortar material comes out of the bed joints and runs down on the brickwork surfaces, and that makes it necessary to carry out a subsequent cleaning operation. If too little mortar was applied, there is no guarantee of a proper bonding action.
If the building blocks to be laid do not have a closed top side or if their abutting surfaces have irregular gaps or engagement recesses which are intended to permit the building block to be gripped by means of gripping cradles, a relatively large amount of material drops into those vertical gaps when mortar is applied manually so that the consumption of mortar is unnecessarily high unless the procedure is conducted with a high degree of care. The latter however involves an increased amount of time, even for a skilled bricklayer.
In order to obviate those difficulties, in particular in regard to the consumption of mortar, a method of applying mortar to building blocks has therefore already been proposed (German laid-open application (DE-OS) No 42 26 795) in which the building block is fitted on its surface which in the brickwork forms the underside, on to a so-called metering grid and jointly with same pressed against the surface of the supply of mortar which is made ready in a tank or vat. In that case, mortar material passes through the open meshes of the metering grid and remains adhering to the underside of the building block. The metering grid is intended to ensure in that case that the layer of mortar adhering to the building block is of approximately uniform thickness which, when the building block is put on to the brickwork which has already been erected, is rendered further uniform by virtue of the fact that the mortar material is distributed into the surface regions of the underside of the building block, which were initially not covered with mortar because of the shielding effect of the bars of the metering grid.
As with that known method the amount of mortar adhering to the underside of the building block is very heavily dependent both on the surface nature of the building block and also on the consistency of the mortar, and as those parameters can vary greatly from one case to another, the thickness of the layer of mortar which is actually achieved is still substantially dependent on the skill of the operator using the known apparatus, and in particular the force with which the operator presses the metering grid with building block disposed thereon, against the surface of the supply of mortar. That pressing force cannot be adapted to a given situation by a one-off adjustment, but has to be kept within relatively narrow limits afresh in each individual pressing operation. The step of individually putting the building blocks on to the metering grid and the operation of pressing that unit against the surface of the supply of mortar, under a defined force, is also a procedure which consumes a relatively large amount of time.

Method and appratus for applying mortar to the underside of a building block


Thermally conductive particles (14) for use in a polymeric resin are provided. The particles (10) are aluminum nitride coated with copper (12). The thermally conductive particles (14) are incorporated into a polymer (38) in order to provide, for example, a thermally conductive adhesive (36). The thermally conductive adhesive is used to bond an electronic component (32) to a circuit carrying substrate (34) in order to dissipate heat from the electronic component.

Semiconductor device or chip bonding involves attaching the chip to a substrate with a layer of adhesive. The substrates may be as diverse as ceramic chip carders, organic printed wiring boards, copper heat sinks or Kovar lead frames. Typically, the adhesive does not serve an electrical function, or is at most a grounding contact. The functionality of the adhesive is therefore primarily defined by thermal and mechanical rather than electrical requirements. In order to provide for a highly reliable attachment of the semiconductor device to the substrate, the adhesive must be an excellent thermal conductor and also must approximate the thermal expansion coefficient of the chip. The thermal expansion mismatch between the chip and the substrate is absorbed primarily by the adhesive, making it susceptible to fatigue fracture or disbonding, sometimes transmitting stresses to the die. It would be highly desirable to formulate a die attach adhesive that has excellent thermal conductivity and a low thermal expansion coefficient.
In order to improve thermal conductivity and reduce the expansion coefficient, particulate fillers are added to the adhesives. Greater increases may be obtained by the incorporation of metallic fibers or other materials with improved thermal conductivity. Increasing the volume loading of fillers also results in a proportional increase in the thermal conductivity. If metallic powders or fibers are undesirable from an electrical standpoint, it has been shown that significant increases in thermal conductivity may be obtained using non-conductive materials such as silicon carbide or beryllium oxide. Because of their cost and toxicity considerations, these materials are seldom used. Inert silica materials are commonly used in electronic packaging adhesives. For other applications, you find calcium carbonates, calcium silicates, talcs, micas and even clay incorporated into the resin. Silica or silver particles are currently the primary fillers used in die attach adhesives. Although it provides excellent thermal conductivity, silver does not achieve the desired low thermal expansion coefficient. Silica, on the other hand, is used in adhesives in order to create a low thermal expansion coefficient material, but does not achieve the thermal conductivity that may be obtained through the use of silver.
As a result, a need exists for a lower cost filler material that can be used to formulate adhesives with improved thermal conductivity and lower thermal expansion coefficients.

Thermally conducting adhesive containing aluminum nitride


A thermistor is disposed confronting a surface of a heat roller on a downstream side in a rotational direction of a heat roller from a contact position between the heat roller and a pressure roller. Side guide members are provided on both sides of the thermistor and spaced away from the thermistor in the axial direction of the heat roller, and a regulating guide member is disposed connecting the side guide members on the downstream side in the rotational direction of the heat roller. In addition, a separation plate for separating a sheet of paper is provided at a predetermined space from the surface of the heat roller between the contact position and the thermistor in the rotational direction.

1. Field of the Invention
The present invention relates to a fixing device and an image forming device provided with the fixing device.
2. Description of Related Art
An image forming device such as a laser printer is usually provided with a fixing device that has a heat roller and a pressure roller, and a toner image that has been transferred onto paper is thermally fixed as the paper passes between the heat roller and. the pressure roller.
To prevent the paper from rolling around the heat roller in such a fixing device, it is known to provide a plurality of separation claws at positions along the axial direction of the heat roller. The plurality of separation claws are disposed on the side that is further downstream in the rotational direction of the heat roller from the contact portion between the heat roller and the pressure roller, so that the paper is separated from the heat roller by the separation claws after the fixing.
As disclosed in Japanese patent-application publication (kokai) No. HEI-2-208679, it is also known to provide a separation guide having a very small space from a rotational body for fixing (that is, a heat roller) within an image area and to bring the separation guide into contact with the rotational body outside the maximum image area so that the paper is separated from the rotational body by the separation guide.
In such a fixing device, a halogen heater is provided within the heat roller and a thermistor is provided in the neighborhood of the surface of the heat roller. The fixing temperature of the heat roller is set by controlling the halogen heater based on the temperature detected by the thermistor.
The thermistor is provided further downstream in the rotational direction of the heat roller and does not normally come into contact with the paper. However, if the paper is not peeled off or separated from the heat roller by the separation claws, it is possible that the paper will be conveyed onward until the paper comes into contact with the thermistor and the thermistor could be deformed thereby.
For that reason, Japanese patent-application publication (kokai) No. 2000-98775 proposes to provide deformation prevention members in the heat roller at portions corresponding to the thermistor on the upstream and downstream sides in the rotational direction, to prevent deformation of the thermistor by guiding the paper that has not been separated from the heat roller along the heat roller by the deformation prevention member.


A method for providing uniformity in plasma-assisted material processes. A shielding plate is implemented within a plasma chamber above a substrate. The dimensions, geometry, and location of the shielding plate are optimized to generate a desired ion flux in a plasma-assisted material process conducted in a plasma chamber.

Capacitively coupled plasma (CCP) reactors and high density plasma (HDP) reactors, such as inductively coupled plasma (ICP) reactors and electron cyclotron resonant (ECR) plasma reactors, have been widely applied in the semiconductor industry for plasma assisted material process, such as plasma enhanced chemical vapor deposition (PECVD) and plasma etch. A conventional plasma reactor, such as CCP, usually consists of two parallel plate electrodes in a chamber. The reactive nature of the discharged gas in the chamber is sustained due to the radio frequency (RF) voltage on the two electrodes. The typical pressure in the chamber ranges from 10−3–10 Torr. High voltage on the electrodes causes ion bombardment on the surface of a substrate.
HDP reactors, such as those of the ICP type, consist of two set RF coils located outside the plasma chamber. RF power is provided to the chamber by an inductive magnetic field. It is not necessary to have an electrode in the HDP reactor. In general, by applying RF bias voltage to the substrate one can independently control the ion bombardment energy in HDP.
Plasma-assisted material processes are generally carried out in a plasma chamber or reactor. To control the reaction rate across a reticle or wafer, the state of the art approach provides for the end user to adjust operational parameters. For example, the radio frequency (RF) power of the coil or neutral gas pressure may be adjusted. Additionally, the mass flow rate may be adjusted.
However, modification of the above parameters still yields a disproportionate etching or deposition rate on the surface of the substrate, i.e. sometimes significantly higher rates at the center of the substrate than at the edges. Thus, such modifications can yield, at best, only about a 2–3% uniformity across the substrate. Although this represents an improvement over processes performed without such modifications, this level of uniformity still does not meet the specifications for certain applications, such as for etching a quartz/chromium reticle.
With state of the art systems, the end user cannot do anything more to improve uniformity without sacrificing other qualities such as etch selectivity. The end user cannot make structural modifications to the reactor hardware itself, such as, adjustment of coil configuration, chamber size, and pedestal position. Such modifications could produce the desired improvements, but modifications to reactor hardware can only be made by the vendor. Thus, if heightened uniformity is to be achieved by the end-user, it should make use of conventional etching equipment.
There is thus a need for a means of attaining better plasma-enhanced material process uniformity using conventional equipment.

Methods for providing uniformity in plasma-assisted material processes


Some embodiments of the invention provide a method for defining code-based policies. The method generates a policy-builder first view of a policy for display in a graphical user interface (GUI) by processing a syntax tree that is generated from a code second view of the policy. The method receives, through the policy-builder first view, a modification to a portion of the policy. To reflect the modification, the method updates a portion of the syntax tree that corresponds to the portion of the policy that is affected by the modification. Based on the updating of the syntax tree, the method updates the code second view by modifying a portion of the code second view that corresponds to the updated portion of the syntax tree.

Most applications today use access control rules to allow different users with different privileges, different access to the applications and their resources. Typically, evaluating these rules and policies can be time consuming and inefficient. This issue is especially acute for polices that require aggregation operations on large data sets. Additionally, certain declarative languages used to define these rules and policies do not provide users with a way to perform large aggregations of data, and also may not support mutation. Accordingly, certain functions and operations like "group by" cannot currently be performed.


Disclosed herein is a speed controller of a type wherein a check valve flexed depending on the flow direction of a pressurized fluid can be seated on a seat portion of a main body thereof and separated therefrom. The main body has first and second connecting portions capable of communicating with a pressurized-fluid flow channel defined in a pressurized fluid device. A needle valve mechanism is provided in continuation with a passage defined in the main body. When the pressurized fluid is introduced from the first connecting portion, the check valve is tightly fitted on a seat portion formed in the main body so as to close the passage and the second connecting portion. On the other hand, when the pressurized fluid is introduced from the second connecting portion, the check valve is separated from the seat portion so as to close the first and second connecting portions and discharge the pressurized fluid introduced from the second connecting portion into the needle valve mechanism via the passage. Therefore, water vapor can be prevented from adhering to the pressurized-fluid flow channel for allowing an electromagnetic valve to communicate with a cylinder. The response time of the cylinder can be shortened as a whole and the degree of freedom of arrangement of devices can be improved.

1. Field of the Invention
The present invention relates to a speed controller, and more specifically to a speed controller of a type wherein a check valve displaced according to the flow direction of a pressurized fluid is disposed so as to be seated on a seat portion of a main body thereof and separated from the seat portion.
2. Description of the Related Art
Heretofore, there have widely been used pneumatic devices to drive and control objects using a pressurized fluid such as pressurized air. One of the pneumatic devices, e.g., a cylinder is normally provided with a plurality of ports to introduce the pressurized air therein and discharge it therefrom. In general, the pressurized air is introduced into these ports by a speed controller. A piston provided inside the cylinder is reciprocated at a given speed by the introduced pressurized air. In this case, a method of increasing effective cross sections of respective parts, which are exposed to the pressurized air, of a line, an electromagnetic valve and the speed controller coupled to the cylinder to thereby reduce the resistance to the pressurized air and smoothly circulating the pressurized air is effective in reciprocating the piston at a high speed, i.e., reducing the response time of the cylinder and improving the efficiency of work.
However, when the effective cross sections of the electromagnetic valve, etc. are increased, the dimensions of the respective devices increase correspondingly and the positions at which they are disposed are restricted. In particular, such devices are normally disposed adjacent to one another in order to effectively use narrow spaces. Therefore, they may preferably be formed as small as possible. When the pressurized air flows out from the electromagnetic valve, water or moisture included in the air is cooled by adiabatic expansion so as to change into water vapor, which in turn adheres to the inside of a tube or line. When the cylinder is actuated in the next step, the water vapor is brought into the cylinder by the pressurized air, so that the water or moisture gradually remains in the cylinder.


A printer cleaning device cleans an image receiving surface with a surface preparation material, includes a roller having a perforated cylindrical wall surrounded by a foam material. The cylindrical wall has an interior volume for holding a fluid pumped into the interior volume by a pump. The pressurized fluid flows through the cylindrical wall into the foam material as the roller is moved into engagement with the image receiving surface. The roller is rotated in a direction opposition to a direction of movement of the image receiving surface to help the foam material to scrub the image receiving surface and apply the fluid to the surface. As the roller is moved away from the surface, the foam material expands to facilitate absorption of fluid and remove material from the image receiving surface. The foam material in one embodiment is hydrophobic.

Some inkjet printing systems or printers that treat the image receiving surface with surface preparation materials include a cleaning device to remove certain materials from an image surface without removing all of the surface preparation material for the next printing cycle. Surface preparation material is any substance applied to the image receiving surface to enable an ink image to be formed on the surface and to facilitate the transfer of the ink image from the surface to media. Examples of a surface preparation material or a blanket coating include, but are not limited to, a skin coating, a fluid coating, a combination thereof, or the like. In some previously known systems, a blade cleaner is used to remove materials from the image surface. The materials removed from an image surface to replenish the ability of the image surface to form quality images include ink, surface preparation substances, media debris, and the like. Blade cleaners are effective because they can provide higher pressures on the imaging surface, but these pressures can result in a shorter life of the image forming surface and the blade cleaner. Additionally, blade cleaners need a higher blade load required to clean the image surface. The blade cleaners also have a poor reliability because they have a single cleaning edge that slides across a high friction elastomer blanket surface.
In some previously known system, a web cleaner is used to remove materials from the image surface. However, web cleaners have a high consumable cost of web materials and cost of disposal of the webs. While the fiber edges on the web can provide a better redundant cleaning with respect to the blade, the thinness of the web provides little volume for storing the detached ink as it is transported out of the cleaning nip. As such, a web cleaner must be translated through the nip at a rate to transport cleaned ink out of the nip faster than the rate at which the ink enters the nip. Additionally, the web cleaners also have a limited cleaning capacity. The limited ink capacity of webs makes them impractical in high ink density situations.
To address the issues related to blade and web cleaners, some previously known aqueous ink printing systems have used a foam roller that rotates against the movement of the image receiving surface to scruff and carry material away from the surface. In aqueous ink printing systems, the image receiving surface that is cleaned by the foam roller is a blanket of material wrapped around an endless support surface, such as a rotating drum or belt. To enhance the surface properties of the blanket so ink adheres to it during image formation and then releases the ink image during transfer to media, the blanket is treated with a surface preparation material that forms a skin on the blanket surface. This surface preparation material is applied to the surface of the blanket after the ink image has been transferred to media and the blanket surface has been cleaned of the skin and residual ink from the previous imaging cycle. Ideally, the pressure of the foam roller should split and remove the ink layer while only hydrating the skin layer so it can be replenished. If the pressure applied to the blanket by the foam roller is too high, however, the thin skin layer under the ink layer also splits. This splitting of the skin layer enables some of the loosened ink to contact the blanket surface, which has an affinity for the ink. Consequently, the ink adheres to the blanket surface and is harder to remove than ink on the skin preparation material. Thus, the cleaning of the blanket is adversely impacted and image quality can be affected in subsequent imaging cycles.
In certain previously known aqueous ink printing systems, the ink is dried to a semi-wet consistency to enable the transfer of the ink image onto media before the imaging surface is cleaned by the cleaning device. In most cases, the semi-wet ink is easier to clean since the density of the ink is small. However in certain cases, the ink is over-dried. Over-dried ink can occur regularly in machine operation due to machine faults. For example, faults such as media handling faults, control faults and other situations can result in the machine shutting down during the printing operation. The processing of these faults can leave the ink image under the dryers longer than desired. The extra drying can make the dried ink harder to clean. Over drying can also reduce efficiency of the ink image transfer to the media causing a larger amount of the harder-to-clean ink to be introduced to the cleaning device in the printer system. To compensate for the occurrence of these situations, a blade cleaner may be employed since the blade cleaner can apply the higher pressures required to remove dried ink with the attendant risks noted previously.
FIG. 4 is a graph illustrating the effect that drying the aqueous ink on the image forming surface to various degrees has on the cleaning performance. Particularly, the effect of drying the ink on a blanket surface was tested on the load of a blade cleaner. Line 404 in FIG. 4 represents an over-dried ink, line 408 represents a semi-wet ink, line 412 represents undried ink, and line 416 represents water. The vertical axis of the graph in FIG. 4 represents the blade load in g/cm and the horizontal axis of the graph represents the blade working angle in degrees. In previously known aqueous ink printing systems, machine operators resort to isopropyl alcohol soaked rags to remove the over dried ink rather than using water alone. However, as seen in the graph in FIG. 4, the effort required to remove ink rises significantly when over dried ink 404 is cleaned from a blanket by hand. As such, improvements in inkjet printers that enable cleaning of the imaging surface are desirable.

System and method for cleaning an image receiving surface in an inkjet printer


This disclosure is directed towards detecting artifacts in an ECG signal. An ECG system may include multiple sensors which can sense an ECG signal when attached to a patient. Bipolar leads connect the sensors, and provide the ECG signal from the sensors to a computing device. The computing device receives respective signals from the bipolar leads, where the respective signals are indicative of the ECG signal. The computing device identifies, based on the respective signals, a potential artifact corresponding to a subset of the plurality of bipolar leads. The computing device determines that each lead of the subset of the plurality of bipolar leads is connected to a common sensor. The computing device may use signals originating from a remainder of the bipolar leads (e.g., the bipolar leads that are not connected to the sensor(s) where the artifact is detected) to detect a condition of the patient.

ECG systems typically record electrical activity of the heart using sensors, such as electrode sensors, placed in a configuration across a patient's body. Electrode sensors of ECG systems may be connected by bipolar leads, which transfer the electrical signals sensed by the electrode sensors to a device which may aggregate the electrical signals into a single ECG signal and output ECG signal on a display device. For ECG systems where a patient may be in motion (e.g., intentionally or unintentionally), an ECG signal may contain information indicative of cardiac electrical activity, as well as other non-heart related "artifacts." Such artifacts may result from a variety of internal and external causes including, for example, the electrical activity of muscle tissue, electrical interference from external sources, poor electrode sensor contact, etc. Differentiating between cardiac electrical activity of the heart and artifacts detected by the ECG system may, at times, present challenges.
The various example embodiments of the present disclosure are directed toward overcoming one or more of the deficiencies associated with known ECG systems.


A two-wire transmitter includes a pressure sensor comprising first and second sensing means each having an impedance value which varies with pressure being measured and with a predetermined environmental condition, such as line pressure or temperature. A fixed impedance has an impedance value which is substantially unchanged by variations in the predetermined environmental condition. A switch alternately connects the fixed impedance into operative relation with the first and second sensing means to derive first and second signals which are each functions of pressure being measured and the predetermined environmental condition. A correction circuit processes the first and second signals, such as by a polynomial series or with a lookup table, to derive a corrected pressure signal. In one form, the sensor senses differential pressure and the predetermined environmental condition is line pressure or temperature, and the first and second signals are functions of both differential pressure and either line pressure or temperature, so the correction circuit derives an indication of differential pressure corrected for variations in either line pressure or temperature. In another form, the sensor measures line pressure and is sensitive to temperature changes, in which case the first and second signals are functions of line pressure and temperature and the correction circuit derives a line pressure signal corrected for variations in temperature.

The present invention involves measuring pressure, and particularly, to transmission of signals representative of two variables through a single analog-to-digital converter with minimum loss of information and minimum aliasing errors. More particularly, the present invention relates to correcting the output signal of a measurement circuit for errors in a differential pressure signal due to changes in line pressure or temperature on a differential pressure sensor, and to correcting the output signal for errors in a line or static pressure signal due to changes in temperature.
Capacitive differential pressure sensors often include a sensor housing having an inner chamber divided into two cavities by a deflectable diaphragm. A first pressure is provided to the first cavity, while a second pressure is provided to the second cavity. Difference between the first and second pressures causes the diaphragm to deflect, the amount of deflection being based on the amount of the difference in pressure.
The diaphragm typically includes a conductive portion separated from, and aligned with, conductive portions on the inner walls of the cavities to form first and second variable capacitors within the first and second cavities, respectively. As the diaphragm deflects due to differential pressure, the capacitive values of the two variable capacitors change. The pressure sensor is connected to a measurement circuit to provide an output signal representative of the capacitive values of the variable capacitors. The output signal provides a measurement of the differential pressure.
However, problems can arise due to non-linearities in the capacitive pressure sensor. For example, stray capacitances in the system can cause non-linearities which must be compensated.
Also, errors can result due to changes in line pressure. Line pressure, also commonly referred to as static pressure, can be defined in several ways. To illustrate the different definitions of line pressure, assume the first and second pressures provided to the first and second cavities of the capacitive pressure sensor have values of 2990 psi (P.sub.L) and 3000 psi (P.sub.H) creating a differential pressure of 10 psi (3000 psi-2990 psi). By one definition, line pressure is defined as the average of P.sub.H and P.sub.L, or 2995 psi in the example. Other definitions define line pressure as simply P.sub.H or P.sub.L, alone. Regardless of which definition is used for line pressure, errors in the output signal of the pressure sensor can result based on variations in line pressure.
The effects of variations in line pressure on a capacitive differential pressure sensor may be illustrated with the following examples. Where P.sub.H =3000 psi and P.sub.L =2990 psi, the differential pressure is 10 psi and the line pressure is 2995 psi (using the average of P.sub.H and P.sub.L as the measurement for line pressure). However, where P.sub.H =10 psi and P.sub.L =0 psi, the differential pressure is still 10 psi but the line pressure is 5 psi. Due to certain stresses placed on the housing of the pressure sensor, the output signal of a typical differential pressure sensor may vary 1% per 1000 psi variation in line pressure. Thus, with the examples given above, the output signal from the differential pressure may vary significantly with changes in line pressure. It is desirable to measure differential pressure and provide an output signal which is unaffected by variations in line pressure.
The Frick U.S. Pat. No. 4,370,890, issued on Feb. 1, 1983 and assigned to the same assignee as the present invention, discloses a mechanical configuration for a capacitive differential pressure sensor which attempts to compensate for unwanted mechanical stresses on the capacitive pressure sensor housing due to variations in line pressure. The Frick configuration reduces variations in the output signal of the differential pressure sensor due to variations in line pressure. However, there is a continuing need for correction techniques which correct for variations in the output signal due to variations in line pressure and which can be adjusted by electrical rather than mechanical means.
The Frick U.S. pending application Ser. No. 7-667,320, filed Mar. 8, 1991 and assigned to the same assignee as the present invention, describes the use of fixed compensation capacitors arranged with the variable capacitors of the differential sensor so that the currents through compensation capacitors subtract from the currents through variable capacitors. The capacitance values of the compensation capacitors are chosen to compensate the output of the circuit for zero and span errors caused by variations in line pressure. The use of fixed compensation capacitors is limited to an expected operating range for the sensor and may not be adequate for all conditions. Hence, there remains a need for improved correction techniques.
Another type of pressure sensor is a piezoresistive bridge sensor typically employing a bridge network of four piezoresistive elements formed on a single silicon wafer. The piezoresistive elements are arranged such that pressure applied to a diaphragm in the wafer unbalances the resistive values of the bridge. The two pressures P.sub.1 and P.sub.2 affect opposite sides of the diaphragm to apply differential pressure to the piezoresistive elements. Changes in differential pressure alters the impedance of two diametrically opposed piezoresistive elements of the bridge in one manner and alters the impedance of the other two diametrically opposed piezoresistive elements in an opposite manner (such as altering the impedances of piezoresistive elements R.sub.5 and R.sub.6 in FIG. 4 positively and altering the impedances of piezoresistive elements R.sub.7 and R.sub.e negatively). The resulting output signal from the bridge is representative of differential pressure.
In the case of a piezoresistive bridge for measuring line pressure (gauge or absolute pressure), changes in pressure applied to the wafer will typically alter the impedances of two opposite piezoresistive elements positively, and will alter the impedances of the other two opposite piezoresistive elements negatively. The amount of change of impedance of each piezoresistive element is representative of line pressure.
It will be appreciated by those skilled in the art that the piezoresistive bridges may be half-bridges employing only two piezoresistive elements. The piezoresistive elements of the differential pressure bridge would be responsive to differential pressure to change the impedance of one piezoresistive element positively and to change the impedance of the other piezoresistive element negatively. The piezoresistive elements of the line pressure bridge would be responsive to line pressure to change the impedance of one piezoresistive element positively and to change the impedance of the other piezoresistive element negatively. Most present piezoresistive bridges employ four piezoresistive elements for economic reasons.
Differential pressure sensing piezoresistive bridges are responsive in to changes differential pressure as well as line pressure and temperature. Line pressure sensing piezoresistive bridges are responsive to changes in line pressure and temperature. This is the result of undesirable mechanical stresses imposed on the piezoresistive elements on the wafer due to variations in line pressure and temperature and the result of undesirable changes in resistivity of the piezoresistive elements due to variations in temperature. These stresses and changes in resistivity adversely affect output signals from the bridge. Consequently, it has been common to provide a separate temperature sensor with a line pressure bridge, and a separate line pressure bridge and a temperature sensor with a differential pressure bridge. In the case of a differential pressure bridge, the output of the bridge was processed with the outputs of the temperature sensor and line pressure bridge to calculate a corrected differential pressure. In the case of a line pressure bridge, the output of the bridge was processed with the output of the temperature sensor to calculate a corrected line pressure. Each sensor required its own dedicated analog-to-digital converter, so correction of a line pressure bridge required two converters and correction of a differential pressure bridge required three converters, each converter providing sensor input to a processor. To eliminate the requirement for two or three converters, multiplexing techniques were sometimes used to alternately connect the separate sensor outputs to a single converter, but multiplexing has the disadvantage that alternate connection of the several sensor information signals to the converter results in the loss of information due to aliasing errors.

Correction of a pressure indication in a pressure transducer due to variations of an environmental condition


An embodiment of a vise may include a clamping structure having a first clamping jaw, a second clamping jaw positioned relative to the first clamping jaw, and a quick adjust jaw guide to maintain the first clamping jaw relative to the second clamping jaw. The quick adjust jaw guide may include a driving element to apply a force to move the first clamping jaw relative to the second clamping jaw, wherein the driving element comprises a release structure to release the applied force to facilitate rapid adjustment of the first clamping jaw relative to the second clamping jaw.

Vises are useful tools for holding various work pieces while performing work operations on the work piece. A vise typically includes a first jaw and a second jaw that are configured to operate relative to each other. In particular, a force is typically applied between the first jaw and the second jaw, causing the jaws to supply a compression force to the work piece, thereby holding the work piece in place. Vises are useful for welding, sanding, drilling, sawing, and various other work functions.
It may be useful to mount a vise to a workbench. Mounting the vise prevents movement of the vise and the work piece, and the workbench provides a suitable surface at a suitable height for performing the various work functions. Typically, a vise is simply bolted to the work bench, and therefore, is not adjustable. Rather, the vise sits in a static position, relative to the work bench. This may not be suitable for certain work functions that require manipulation of the orientation of the work piece.


A gate on array (GOA) circuit and a display panel are provided. The GOA circuit includes a plurality of GOA units connected in series. A pull-up module includes a first switch, a second switch, a third switch and a fourth switch. When a nth stage signal STn corresponds to a high voltage level, the third switch is turned on and residual charges of the first switch, the second switch and the third switch are released through an output end of the fourth switch to prevent the residual charges from influencing performances of the first switch, the second switch, the third switch and the fourth switch.

A conventional GOA circuit comprises multiple modules. The pull-up control module is used to output a stable pull-up control signal to ensure the stability of the entire GOA circuit. However, the conventional pull-up control module has a problem. That is, the residual charges of switches cannot be released and thus may affect the threshold voltage of the switches such that the performances of the switches and the stability of the GOA circuit may be affected.
Therefore, the GOA circuit and the conventional display panel have the above issue due to the pull-up control module. And this issue needs to be solved.

Shenzhen China Star Optoelectronics Semiconductor Display Technology Co., Ltd.