A method, apparatus and program product are provided to optimize film cooling performance for turbomachinery components. A design space is defined by selecting process variables and limits. A random initial population of a plurality of designs is provided using Latin hypersquare sampling, varying the process variables across the design space. Each design of the plurality of designs is evaluated. A fitness function value is determined based on a performance of each of the evaluated designs of the plurality of designs. A half of the plurality of designs having higher fitness function values is selected. Designs of the selected half of the plurality of designs are randomly paired to generate two new designs from each random pair of designs forming a plurality of new designs.

1. Field of the Invention
The present invention generally relates to gas turbine engines and, more particularly, optimization of film cooling configurations therefor.
2. Description of the Related Art
Gas turbines, also called combustion turbines, are a type of internal combustion engine. They have an upstream rotating compressor coupled to a downstream turbine, and a combustion chamber in-between. Energy is added to a gas stream in the combustor, where fuel is mixed with air and ignited. In the high pressure environment of the combustor, combustion of the fuel increases the temperature. The products of the combustion are forced into the turbine section. There, the high velocity and volume of the gas flow is directed through a nozzle over the turbine's blades, spinning the turbine which powers the compressor and, for some turbines, drives their mechanical output. The energy given up to the turbine comes from the reduction in the temperature and pressure of the exhaust gas. Energy can be extracted in the form of shaft power, compressed air or thrust or any combination of these and used to power aircraft, trains, ships, generators, or even tanks.
Contemporary and next generation gas turbine engines generally demand that high pressure turbine ("HPT") inlet temperatures be ever-increasing to allow for higher thrust-to-weight ratio and thermodynamic efficiency. This requires that durability measures for turbine components continue to meet the challenge and keep pace with the trend of increasing hot gas temperatures in the engine. For decades, this has been done with high-temperance materials, thermal barrier coatings, and cooler air flow that is routed from the upstream compressor through the inside passages of the component. The last of these durability measures, internal convective cooling, becomes film cooling when the coolant is leaked through small holes in an airfoil wall and out onto an external surface. Film cooling has afforded the greatest leaps in gas turbine engine performance and durability, allowing engines to operate at temperatures beyond the material limits of their components. Active external cooling is required to achieve adequate part life for these configurations. Thus, cooling may be applied to high temperature components at a penalty to the efficiency of the engine.
The purpose of film cooling in any turbomachinery is to protect the material surface of components at the location of cooling injection as well as downstream. Film cooling works by using a fraction of the ambient flow going into the engine from a bypass fan near the compressor and routing it internally through the inside of the HPT components, allowing it to escape through small cooling holes in the surface where it interacts with the mainstream hot engine flow. As the main flow mixes with the cooler injected flow, a film is created over the material surface. The introduction of a secondary fluid into the boundary layer at a temperature lower than the mainstream results in a reduction of the material surface temperature in the region downstream of the injection. In the right pressure gradients, the additional cooling mass flow also provides a thicker boundary layer and greater insulation from potentially-damaging hot flow. Generally, a two-dimensional array of discrete cooling holes on the component surface allows for a coalescence of film cooling coverage over the component. While slots have shown to have the greatest cooling effectiveness downstream from the injection location, rows of discrete cooling holes provide the necessary structural integrity for the increased thermal stress environment of a HPT in addition to the beneficial additive nature of cooling effectiveness due to repeating rows, relative to single or sparsely-spaced holes.
Continual advances in computing power have afforded greater capabilities in computational fluid dynamic (CFD) simulations for a turbomachinery designer. But even with these advances reliable simulation tools, physical models, and all-encompassing turbomachine design methods that consider individual 3-D geometries, pertinent flow conditions, and whole film cooling arrays in the process are not fully developed or available. Currently, design practices related to film cooling configurations involve a high amount of empiricism and may be missing important physical behaviors that have direct impacts on durability, especially for the hottest part that sees the harshest environment, the HPT. Industry proprietary methods tend to use non-dimensional dated film correlations that assume analytical cooling performance at one span (usually mid span) will be the same at all spans. The 3-D nature of HPT component surfaces and local effects of the film cooling array are not factored into durability designs for individual parts. This prohibits accurate knowledge of thermally-driven stresses for a specific part given its unique geometry. Unfortunately, due to the intense compute power required, CFD codes are typically not used in the process of film cooling design. While industry has taken advantage of contemporary computing power to design for optimal aerodynamic shapes and structural design, the same cannot be said for film cooling design. Accordingly, there is a need in the art for a design methodology including 3-D CFD simulations for improving film cooling of turbomachinery components.

Method of optimizing film cooling performance for turbo-machinery components

The United States of America As represented by the Secretary of the Air Force


In one embodiment, a file transfer apparatus includes a storing device, a determination unit, and a notification unit. The storing unit stores transfer information between the file transfer apparatus and a second file transfer apparatus. The determination unit determines an insufficient state when the latest value of a numerical value which varies depending on a use situation of the region meets a predetermined condition. The notification unit notifies, as a response to the determination of the insufficient state by the determination unit, the gist thereof to a user.

A file transfer apparatus, which allows an information terminal such as a personal computer or a multi functional peripheral (MFP) to transfer a file by the use of a communication network such as a next generation network (NGN), is known as a network adapter, or simply, adapter.
The adapter is equipped with a storage medium, and stores a file becoming a transfer target in the storage medium. Since a storage capacity of the storage medium is limited, space in the storage medium may run out during writing of the file, which halts the writing of the file. Moreover, in this case, after securing an free region of the storage medium, the acquisition of the file resumes from the beginning.
Under such circumstances, when a capacity of the free region is low, it has been desired that a user is made aware of the situation.

File transfer apparatus and control method thereof


Disclosed is a channel power adjustment method and system based on positional information of plural self-organizing subnets in a restricted area. The method includes a first setting step of setting, based on the positional information of the plural self-organizing subnets, a positional priority for each of the plural self-organizing subnets; and a first adjustment step of adjusting, at least partially based on the positional priorities of the plural self-organizing subnets, a power of a first device in a first self-organizing subnet working in a first channel, satisfying a predetermined rule to a first power of the first channel.

1. Field of the Invention
The present invention relates to the field of communications, and particularly relates to a method and system for adjusting channel power on the basis of the positional information of at least one area restricted self-organizing subnet (or subnetwork).
2. Description of the Related Art
In a case where dense wireless channels are utilized, in the environment of Wi-Fi 802.11b/g or Wi-Fi Direct of 2.4 GHz Wireless Technology, in general, well-used channels, whose frequency bands do not overlap, are the first channel (2412 MHz), the sixth channel (2437 MHz), and the eleventh channel (2462 MHz). However, in 5 GHz Wireless Technology being developed, there are four available channels in a range of 5.725-5.825 GHz. With the increase of the number of self-organizing subnets sharing a same channel, co-channel interference generated on the basis of these self-organizing subnets increases at the same time. As a result, when it is necessary to transmit important data in a self-organizing subnet, the quality of communications of this self-organizing subnet may not be guaranteed.
In U.S. Patent Application Publication No. 2007/0133483 A1, a method of controlling transmission power on a node over a wireless ad-hoc network, which includes a plurality of sender, intermediate, and receiver nodes, is disclosed. Initially, levels of the transmission power of the node are configured. The node then exchanges information with its neighboring nodes by sending out a global signal. After exchanging the information, the node identifies a node coverage for the level of the transmission power. The node then determines an effective transmission power (ETP). Finally, the EPT is used to form a virtual cluster. However, in this method, the positional information of the node and its neighboring nodes is not utilized, and only the power adjustment of a single node is carried out.
In U.S. Patent Application Publication No. 2006/0217062 A1, a wireless channel resource adjustment method is disclosed. A terminal node receives a transmission request together with a related quality-of-service (QoS) requirement sent from another node, and then it decides a transmission power on the basis of the information carried by the transmission request and the related QoS requirement. However, in this method, the positional information and priorities of the terminal node and the other node are not utilized, and only the transmission power of a single terminal device (i.e., the terminal node) is decided on the basis of the transmission request and related QoS requirement sent from the other node.
In International Publication No. WO 02/03567 A2, a power control technique in wireless network for reducing mobile nodes' power consumption and achieving a lower signal-to-interference ratio is disclosed. The proposed power control scheme for distributed networks discloses a method for adapting and storing the power level for transmission between nodes. For each node that communicates with other nodes in the network, the power level is calculated and stored in the nodes' memories (power caches). Each node continuously builds up its power cache. The calculation of the required transmission power level is done either at the receiving node or at the transmitting node. The resulting calculated power level is stored at the transmitting node for reference and for use in future transmissions. However, in this technique, the positional information and priority of each node are not utilized, and only the transmission power having a certain level of QoS, of a single node is determined on the basis of the relationship between the premeasured transmission power and QoS.
Therefore, it is necessary to provide a technique by which it is possible not only to adjust the channel power of each self-organizing subnet but also to guarantee good communications quality.

Channel power adjustment based on positional information of area restricted self-organizing subnets


With a microwave FET, the internalized Schottky junction capacitance or pn junction capacitance is small and these junctions are weak against static electricity. However, with a microwave device, a protecting diode could not be connected since the increase of parasitic capacitance resulting from this method causes degradation of the high frequency characteristics. Therefore, to eliminate this problem, a semiconductor device is provided, wherein two paths, extending from a gate electrode pad to a gate electrode on an operating region, are arranged, with one path running near a source electrode pad, the other path running near a drain electrode pad, and at the respective parts where a path becomes close to a pad, the abovementioned protecting elements are connected between the gate electrode and source electrode and between the gate electrode and drain electrode to improve the electrostatic breakdown voltage of the FET from approximately 100V to 700V.

1. Field of the Invention
This invention relates to a semiconductor device and particularly relates to a semiconductor device which having an improved electrostatic breakdown voltage.
2. Description of the Related Art
FIG. 23 is a circuit diagram of a compound semiconductor switching circuit device. The source electrodes (or drain electrodes) of first and second FET's, FET1 and FET2, are connected to a common input terminal IN, the gate electrodes of FET1 and FET2 are respectively connected to first and second control terminals Ctl-1 and Ctl-2 via resistors R1 and R2, and the drain electrodes (or source electrodes) of FET1 and FET2 are connected respectively to first and second output terminals OUT1 and OUT2. The control signals applied to first and second control terminals Ctl-1 and Ctl-2 are complementary signals and the FET to which the H level signal is applied turns ON and transmit the input signal applied to common input terminal IN to one of the output terminals. Resistors R1 and R2 have the resistance of 10 KΩ respectively and are provided for preventing high-frequency signals from leaking via the gate electrodes to the DC potential of control terminals Ctl-1 and Ctl-2 which are AC grounded.
FIG. 24 shows an example of a compound semiconductor chip having this compound semiconductor switching circuit integrated.
FET1 and FET2, which perform switching, are disposed at central parts of a GaAs substrate and the resistors R1 and R2 are connected to the respective the gate electrodes of the FET's. Also, pads, respectively corresponding to the common input terminal IN, the output terminals OUT1 and OUT2, and the control terminals Ctl-1 and Ctl-2, are disposed at peripheral parts of the substrate. A gate metal layer (Ti/Pt/Au) 20, which is formed at the same time as the forming of the gate electrodes of the respective FET's, includes a second-layer wiring, indicated by dotted lines, and a pad metal layer (Ti/Pt/Au) 30, which connects the respective elements and form the pads, includes a third-layer wiring, indicated by solid lines. An ohmic metal layer (AuGe/Ni/Au), which is in ohmic contact with the first-layer substrate, forms the source electrodes and drain electrodes of the respective FET's and forms electrodes at the ends of the respective resistors, and this layer is not illustrated in FIG. 11 as it overlaps with the pad metal layer FET1, shown in FIG. 24, are formed on an operating region 12, which is surrounded by alternate long and short dash lines. The three-teeth-comb-shaped third-layer pad metal layer 30 parts, which extend from the lower side, form a source electrode 13 (or drain electrode) connected to the output terminal OUT1, and below this is disposed a source electrode 14 (or drain electrode) formed by the first-layer ohmic metal layer. Also, the three-teeth-comb-shaped third-layer pad metal layer 30 parts, which extend from the upper side, form a drain electrode 15 (or source electrode) connected to the common input terminal IN, and below this is disposed a drain electrode 14 (or source electrode), formed by the first-layer ohmic metal layer. These electrodes are disposed in the form of engaged comb teeth and in between these, a gate electrode 17, formed from second-layer the gate metal layer 20, is disposed on the operating region 12 in the form of five comb teeth. The drain electrode 15 (or source electrode) that has the central comb tooth extending from the upper side is used in common by FET1 and FET2 to contribute to size reduction. Here, the gate width, which is the total gate width of the comb-shaped gate electrode 17 of each FET, is 600 μm.
FIG. 25 shows the results of measuring the electrostatic breakdown voltage of the switching circuit device shown in FIG. 24. Here, the electrostatic breakdown voltage is measured under the following conditions. That is, after applying a test voltage to the terminals of a test capacitor of 220 pF and thereby charging electricity in the test capacitor, the wiring for voltage application is cut off. Thereafter, the charged electricity in the test capacitor is discharged between the terminals of a tested element (FET) without resistance element or inductance element inserted. Thereafter it is determined whether the FET has broken down. If the FET does not break down, the test is repeatedly carried out with the application voltage being increased by 10V at a time, and the first application voltage at which the FET breaks down is measured as the electrostatic breakdown voltage.
As shown in FIG. 25, since there has been no attempt in the art to improve the electrostatic breakdown voltage, the electrostatic breakdown voltage is poor and only 140V between the common input terminal IN and the control terminal Ctl-1 and between the common input terminal IN and the control terminal Ctl-2.
Also, there is a variation of the electrostatic breakdown voltage depending on the terminals which the electrostatic breakdown voltage is measured between. Though the specific mechanism that determines this electrostatic breakdown voltage is unclear, with a switching circuit device, the minimum electrostatic breakdown voltage between two terminals is generally of the level of 100V or less as mentioned above, and the finest care is required for handling. That is, the minimum electrostatic breakdown voltage among the terminals of a device determines the electrostatic breakdown voltage of the device as a whole, and thus improvement of the minimum electrostatic breakdown voltage among these terminals is required.
Besides, unlike other devices for audio, video, and power supply applications, microwave communication devices are low in the internal Schottky junction or pn junction capacitance, and these junctions are weak against static electricity.
Generally in order to protect a device against static electricity, an electrostatic breakdown protecting diode may be connected in parallel between the terminals of a pn junction or Schottky junction, which is damaged readily by electrostatic discharge. However, this approach could not be applied to a microwave device since increased parasitic capacitance due to connection of a protecting diode causes degradation of the high-frequency characteristics.


The invention provides an improved method of producing a natural, acellular matrix scaffold for subsequent use in tissue-engineered replacement of tissues such as the bladder. Decellularization is carried out on an expanded or distended bladder and the product retains the strength and compliance of natural material. The invention also provides use of the matrix scaffolds as wound healing material and to investigate tissue structure and function in vitro.

At present, natural biomaterials are predominantly used in reconstructive surgery, mainly in the fields of gastroenterology, urology and wound-healing, but with increasing applications in cardiovascular and cosmetic surgery. One such biomaterial, porcine small intestinal submucosa (SIS), has been used in gastroenterology, urology and wound-healing applications as it is easily incorporated into host tissue and remodeled. However, recent work to investigate the adherence and viability of human cells seeded onto SIS demonstrated that commercially-available SIS specimens contained porcine nuclear residues and was cytotoxic in vitro. In addition, clinical use of SIS has resulted in localised inflammation, suggesting the material can cause an immunological response in vivo. An alternative natural biomaterial is decellularised porcine dermis (Permacol™) which has a wide range of uses in medical and cosmetic procedures and has been implanted in over 8500 patients in over 70 different surgical procedures since being licensed for use in humans in 1998. However, Permacol™ a disadvantage associated with this material is that not only is it only partially resorbable but when it is used in an animal model of bladder augmentation it has been shown to cause micro-calcification and irregular detrusor regeneration. Furthermore, Permacol™ is unable to support in vitro recellularisation thus preventing its use as a biomaterial that could be seeded with cells and functionalised prior to implantation. An improved natural biomaterial that is immunologically inert and able to support recellularisation would offer an immediate advantage in the art.
It is estimated that over 400 million people worldwide suffer from some form of bladder dysfunction. A variety of diverse congenital and acquired conditions result in bladder dysfunction, for example cancer, congenital abnormalities, nerve damage or trauma. Currently, the major surgical solution is surgical reconstruction. It is known in the prior art to repair or augment or replace the bladder during these procedures with vascularised segments of the patient's own tissue derived from their stomach or more commonly their intestine. However, this latter procedure ('enterocystoplasty') is associated with significant clinical complications that arise due to the exposure of the epithelial lining of the intestine to urine. It has been found that the use of intestine results in significant complications, such as infection and development of bladder stones, as the intestine is lined by an absorptive and mucus-secreting epithelium that is incompatible with long-term exposure to urine. Consequently, a number of alternative approaches have been proposed to find a practical and functional substitute for native bladder tissue. One of the alternative solutions is 'composite enterocystoplasty', where the de-epithelialized intestine wall is lined with bladder epithelial cells that have been propagated in vitro, to augmenting the urinary system with natural or synthetic biomaterials that may incorporate in vitro-propagated cells. However even this modified form of enterocystoplasty has been associated with adverse side effects. The lack of an entirely satisfactory clinical procedure has led researchers to investigate alternative strategies.
Attempts have been made to develop suitable biomaterials for urological tissue engineering using both synthetic materials, for example polyglycolic acid and poly L-lactic acid, and naturally derived materials including SIS, Permacol™ and porcine bladder matrix. However none of these materials have been found to be totally successful vis a vis immunogenicity and rejection and recellularisation.
Tissue matrices prior to implantation undergo a process of decellularisation in order to reduce their immunogenicity once implanted. This process involves removing the donor cells, whilst ideally retaining the biomechanical structure and function of the matrix. As regards the bladder, it is especially desirable to maintain the normal mechanical properties and its elasticity.
A problem associated with the use of a bladder matrix is that bladder tissue is relatively thick (1-5 mm when not distended). This in turn means that it is difficult to decellularise bladder tissue to provide an immunologically inert scaffold matrix using routine methods known in the art. Attempts to decellularise dissected segments of full thickness porcine bladder have resulted in incomplete decellularisation. Histological analysis of these samples indicated that cells had not been removed from the muscular bladder wall. In its retrieved form, the porcine bladder was too thick to allow efficient penetration of the solutions used throughout the decellularisation process. In order to overcome this problem segments of bladder tissue of reduced thickness could be used to enable successful decellularisation.
An improved method of decellularisation that could be used to decellularise whole bladders or other membranous sacs of full thickness, whilst retaining the biomechanical properties of the tissue, would offer immediate advantage in the field of particularly but not exclusively, urological tissue engineering.

Decellularisation of tissue matrices for bladder implantation


Disclosed herein is a device that includes: a semiconductor substrate; plurality of first through-substrate vias each penetrating through the semiconductor substrate, a plurality of second through-substrate vias each penetrating through the semiconductor substrate, an insulating film formed over the semiconductor substrate, the insulating film including a first opening and a plurality of second openings, the first opening being located over the first through-substrate vias, and each of the second openings being located over a corresponding one of the second through-substrate vias.

1. Field of the Invention
The present invention relates to a semiconductor device, and particularly to a semiconductor device equipped with a penetrating electrode which is so provided as to pass through a semiconductor chip.
2. Description of Related Art
Storage capacity required for semiconductor memory devices such as DRAM (Dynamic Random Access Memory) has been growing year by year. To satisfy the requirement, in recent years, a memory device called multi-chip package has been proposed. In the multi-chip package, a plurality of memory chips are stacked. However, in the case of the multi-chip package, wires that connect each memory chip and a package substrate are necessary. Therefore, it is difficult to stack many memory chips.
On the other hand, in recent years, a semiconductor device of a type in which a plurality of memory chips with penetrating electrodes are stacked has been proposed. In the semiconductor device of the type, among penetrating electrodes provided on each memory chip, the penetrating electrodes that are provided on the same plane position when seen from a stacking direction are electrically short-circuited. Therefore, even if the number of chips stacked increases, the number of electrodes connected to the package substrate does not increase. Thus, it is possible to stack a larger number of memory chips.
When the semiconductor chips with penetrating electrodes are stacked, bump electrodes provided on upper and lower chips need to be in accurate contact with each other. Therefore, the chips are stacked as positioning is performed by referencing alignment marks provided on the upper and lower chips. There is disclosed in Japanese Patent Application Laid-Open No. 2005-217071 is a semiconductor device that uses penetrating electrodes as alignment marks.
However, the alignment marks disclosed in Japanese Patent Application Laid-Open No. 2005-217071 have a different planar shape from original penetrating electrodes that are used for transmitting and receiving of signals, power supply, or the like, such as a cross shape or L-shape. A process of forming the penetrating electrodes is controlled in such a way as to most accurately form original penetrating electrodes. Accordingly, if making of alignment marks of a different shape from the original penetrating electrodes is performed in the same process as that of the original penetrating electrodes as disclosed in Japanese Patent Application Laid-Open No. 2005-217071, the alignment marks might not be accurately formed.
If the accuracy of the alignment marks is low, there are great difficulties in stacking the chips. The alignment marks are recognized by a recognition camera provided on a flip chip bonder. However, the devices that are now available in the market require a dimensional accuracy of 1 μm or less for alignment marks to enable the recognition camera to accurately recognize the positions. On the other hand, the film thickness of photoresist used for formation of penetrating electrodes needs to be about 20 μm. As a result, an edge of the photoresist becomes tapered. If different planar shapes of the penetrating electrodes, such as a cross shape or L-shape, are used, distortion of the shape or the like is likely to occur, making it difficult to realize a dimensional accuracy of 1 μm or less.

Semiconductor device having penetrating electrodes each penetrating through semiconductor chip


A switching power converter for converting an AC power into a DC power. The converter includes a transformer, a charge storage unit, a synchronization signal generator, and a switch element. The transformer includes a primary side coil and a secondary side coil, and the primary side coil generates an induced voltage at the secondary side coil according to AC power. The charge storage unit charges according to the induced voltage and outputs a DC power. The synchronization signal generator generates a synchronization signal according to the induced voltage. The synchronization signal is the first value when the induced voltage is positive and is the second value when the induced voltage is negative. The switch element, serially connected to the secondary side coil and controlled by the synchronization signal, is turned on when the synchronization signal is the first value and is turned off when otherwise.

1. Field of the Invention
The invention relates in general to a switching power converter, and more particularly to an efficiency-enhancing switching power converter.
2. Description of the Related Art
Switching power converter, which is for rectifying an AC power and then outputting a DC power, is widely applied in electronic devices. FIG. 1 is a circuit diagram of conventional switching power converter 100. Switching power converter 100 includes a transformer, resistors R1, R2, R3, R4, R5, R7, R8 and R14, diodes D2, D3 and D14, capacitors C1, C3 and C22, an inductor L5, and a transistor M1. The transformer includes a primary side coil L1 and a secondary side coil L3. The switching power converter 100 rectifies a power Vb+ according to control signal Vin and outputs a DC power Vo. The diode D14 is electrically connected to the secondary side coil L3 for rectifying.
Considering worldwide energy specification and consumers' demands, energy saving and power efficiency enhancing have become urgent goals for the manufacturers of electronic devices to achieve. Besides, if power consumption can be reduced, temperature of electronic device will be reduced as well.
However, when the diode D14 is used to rectify, the efficiency of the switching power converter 100 cannot be good. Given that the output voltage Vo is 3.3V and that the diode D14 is a Schotty diode, the forward voltage of the diode D14 is 0.7V, and the efficiency of switching power converter 100 is 3.3/(3.3+0.7)=82.5%. Given that the output voltage Vo is 12V and that the diode D14 is an ultra-fast diode, the forward voltage of the diode D14 is 0.95V, and the efficiency of the switching power converter 100 is 12/(12+0.95)=92%.


A belt driven infusion pump for emptying the contents of a syringe is disclosed. The pump includes a syringe pusher including an antisiphon catch and a pressure detector which is used for detecting occlusions or the end of infusion. A syringe clamp for locking a syringe in place is also provided. The syringe clamp is spring loaded and lockable. A syringe position detector is provided to ensure the proper placement of the syringe prior to and during pumping. A control knob is provided on the face of the pump for controlling both the locking of the syringe barrel clamp and the coupling of the drive belt with a d.c. motor. The pump includes a housing having an elongated slot through which the syringe pusher is connected to the drive belt. A sealing band is connected to the syringe pusher and is moveable with the syringe pusher for sealing the slot against moisture or other contaminants. A pole clamp assembly is incorporated within the pump housing and includes a clamping arm for securing the pole between the clamping arm and the housing. The clamping arm is movable to a storage position where it is substantially flush with the outer surface of the pump housing.

This invention relates to infusion pumps for dispensing fluid from syringes. More specifically the invention relates to the securing of a syringe for use in an infusion pump so that its contents may be infused into a patient.
Infusion pumps are frequently employed in the medical field for administering fluids such as medications. A typical infusion pump comprises a housing, a drive mechanism for pushing the plunger of a syringe and a means for securing the syringe to the housing.
In the prior art, the means for holding the syringe in place for pumping was typically a spring loaded clamp or a screw-type clamp. If a spring was used, the force exerted by the spring had to be chosen so that the spring would hold the syringe firmly in place. However, if a very stiff spring was used, it was difficult to open the clamp and place or remove the syringe. A screw type clamp, while securing the syringe effectively, was cumbersome to open and close.
It is an object of the present invention to provide a syringe pump having clamp for holding a syringe in an infusion pump very securely, while allowing the easy placement and removal of the syringe.

Syringe pump with biased lockable syringe clamp


A coextruded laminate may be formed by coextruding a linear alternating polymer of carbon monoxide and at least one ethylenically unsaturated hydrocarbon (a polyketone polymer) with an other thermoplastic polymer, without the use of an adhesive or tie layer, wherein the other thermoplastic polymer is polyvinylidene fluoride, nylon-6,6, or phenoxy resin.

Coextrusion of multiple layers of different polymers through a common die is used to produce a variety of polymer products, such as sheet, film, coatings, profiles, pipe, tubing, and foam-core products. Food and beverage packaging is a common application of such coextruded products. Sheet or film, for example, are often shaped after coextrusion into various packaging items by methods such as thermoforming, solid-phase pressure forming, or stamping. Preparation of tubing and hoses for use in automobiles and industrial equipment is another application. Individual polymers exhibit a wide variety of properties, such as permeability to oxygen, water vapor, and other gases and liquids, and chemical resistance to acids, bases, hydrocarbons, oils, alcohols, and other materials. Coextrusion of multiple polymer layers can be used to prepare a product with optimum properties for a particular application.
No comprehensive theory exists for predicting inter-layer adhesion in coextrusion of different polymers. Most knowledge comes from trial-and-error testing of the polymers. Even materials which form compatible blends do not necessarily exhibit good adhesion when coextruded. For example, a polyketone polymer and an ethylene vinyl alcohol copolymer will form a compatible blend, but will not adhere when coextruded. Adhesive polymers are commonly used as "tie layers" to bond incompatible polymers that do not normally adhere to each other. Ethylene-vinyl acetate, ethylene-acrylic acid, and ethylene-methyl acrylate copolymers are commonly used as tie layers.
Coextrusion of polymers without the use of tie layers allows the use of simpler equipment, and production of a lower cost product. It is an object of this invention to provide a coextruded product of two or more dissimilar polymer layers, produced without the use of any tie layers.
In an analogous processing technique, injection molding may be used to form composite parts by injecting two or more polymers into the same mold to make a composite part. The specialized techniques used to produce such composite parts include coinjection, dual shot, multi-shot, and shuttle molding. As an alternative, a pre-molded article may be inserted into a larger mold cavity, and a second polymer injected into the larger mold, coating part or all of the surface of the premolded article. This technique is known as insert molding. In the fabrication of such composite parts, it is essential to have strong adhesion between the different polymer surfaces to maintain the integrity of the product molded article. It is another object of this invention to provide a composite part, prepared through injection molding of two or more dissimilar polymers and without the use of any adhesive or tie layer between the dissimilar polymers.
In particular, it is an object of this invention to provide a coextruded product or composite part of a polyketone polymer and an other thermoplastic polymer, produced without the use of any adhesive or tie layer. Surprisingly, after extensive trial-and-error testing, only a few other thermoplastic polymers have been found that meet this objective.

Coextruded laminates containing polyketone polymers


A radiator mounting system for a skid steer vehicle includes an air box with a front wall having an opening sized to receive engine fan blades, an oil cooler disposed in the air box, a radiator; and a radiator frame supporting the radiator that is hingeably coupled to the air box. The radiator has plastic tanks and an aluminum core and the frame extends around the periphery of the radiator.

Skid steer vehicles such as skid steer loaders are a mainstay of construction work. In their most common configuration, they have two drive wheels on each side of a chassis that are driven in rotation by one or more hydraulic motors coupled to the wheels on one side and another one or more hydraulic motors coupled to the wheels on the other side.
The wheels on one side of the vehicle can be driven independently of the wheels on the other side of the vehicle This permits the wheels on opposing sides of the vehicle to be rotated at different speeds and in opposite directions. By rotating in opposite directions, the skid steer can rotate in place about a vertical axis that extends through the vehicle itself.
The vehicles have an overall size of about 10 by 12 feet, which, when combined with their ability to rotate in place, gives them considerable mobility at a worksite. It is this mobility that makes them a favorite.
Skid steer vehicles commonly have at least one loader (or lift) arm that is pivotally coupled to the chassis of the vehicle to raise and lower at the operator's command. This arm typically has a bucket, blade or other implement attached to the end of the arm that is lifted and lowered thereby. Most commonly, a bucket is attached, and the skid steer vehicle is used to carry supplies or particulate matter such as gravel, sand, or dirt around the worksite.
As a counterbalance to the loads provided at the front of the vehicle, skid steer vehicles typically have an engine that is located behind the operator. The radiator is also commonly disposed behind the operator, usually at the center rear of the vehicle behind the engine.
Cooling air for the engine is typically drawn into the rear engine compartment through an aperture protected by a grille or grating. This air aperture is most commonly disposed at the very rear of the vehicle. In the skid steer vehicle illustrated herein, for example, the air aperture is a rectangular opening that is located in a rear engine access door.
Skid steer vehicles are operated in dusty and dirty environments. The vehicles are typically used at construction sites for both roads and buildings. These environments are unpaved, and a significant amount of dirt gets stirred up by the passage of vehicles such as skid steers. Further, the method of steering—by skidding—breaks up compacted soil and turns it into loose particles easily lifted by wind and rotating wheels.
These environments cause significant dirt to accumulate around the radiator and other coolers. In skid steers this is a particular problem. They are close to the ground, they steer by skidding, and their cooling air intakes are located at the rear of the vehicle precisely where the wheels and the air disturbed during their passage throws us dirt and dust.
This accumulated dirt reduces the efficiency of the radiator and other coolers. Once sucked into the cooling air aperture, the dust coats the cooling fins of the engine cooling water radiator, oil coolers and other heat exchangers. Common skid steer vehicles have at least two heat exchangers that are cooled by this dirty air: an engine water cooler (or "radiator") and a hydraulic fluid cooler. As the air passes first through one, and then through the other, dirt, dust and other contaminants carried by the air begin to coat the cooling fins of each of the heat exchangers and plug the air flow passages between adjacent cooling fins. This coating blocks the transfer of heat from the cooling fins of the heat exchangers to the air and must be removed to restore the full operational capacity of the heat exchangers.
To restore efficiency it is necessary to clean the radiator and coolers out regularly. Cleaning the cooling fins requires a strong blast of air and/or water directed through the core of the heart exchangers. This blast of fluid must be of sufficient force to dislodge the dust dirt and other contaminants (small bits of paper, leaves, sticks twigs, etc.) that have lodged between or coat the cooling fins.
It is difficult to access the skid steer radiator and coolers and clean them. A single heat exchanger can be cleaned by directing a blast of air or water through both sides of the heat exchanger core. As long as the operator has access to both sides (both faces) of the heat exchanger it can be cleaned well.
When two heat exchangers are stacked and fastened one in front of the other, however, like two stacked slices of bread, the operator cannot reach both surfaces of the heat exchanger, only one surface (the outer surface) of each. A blast of fluid through two stacked heat exchangers is not satisfactory since the first heat exchanger core slows down, redirects and scatters the blast as it passes through, leaving little force to dislodge dirt, dust and contaminants from the second heat exchanger core.
The radiator and coolers cannot readily be separated to permit better cleaning. In the typical arrangement, the radiator and cooler are fixed to one another with metal straps and are together bolted to a fan shroud. The fan shroud is typically a large funnel-like structure, molded from a fiber reinforced plastic and fixed between the spinning engine fan that draws air through the heat exchangers and the heat exchangers themselves. Even small deflections or misalignments of such a fan shroud can cause it to be chewed up by the spinning fan blades, damaging both the fan and the shroud itself. Further, any disconnection or movement of the heat exchangers and the fan shroud with respect to each other run the risk of producing air leaks. Whenever air is permitted to leak out of or into the cooling air flow path without passing through the heat exchangers and the fan, the cooling air flow is reduced and the efficiency of the heat exchangers drops accordingly. For these reasons, the heat exchangers and the fan shroud are most commonly bolted firmly together and are fixed in place, with no easy provision for moving either heat exchanger.
What is needed, therefore, is an improved skid steer vehicle having a cooling system that is configured to provide better cleaning access. What is also needed is a system that provides access to the space between two stacked radiators. What is also needed is a system for providing access that is easily and quickly operated, without requiring considerably time for disassembly and reassembly. What is also needed is an improved system for sealing the heat exchangers in the radiator one to the other to reduce or eliminate air leaks. It is an object of this invention to provide these advantages. While not every claimed aspect of the invention provides all these advantages, each of these advantages is provided by at least one claimed aspect.


The present invention concerns a plasma processing apparatus for processing a processing object by applying two types of high-frequency power with different frequencies to generate plasma. A first high-frequency line is provided with a first filter circuit for attenuating a high-frequency current from a second high-frequency power supply. A second high-frequency line is provided with a second filter circuit for attenuating a high-frequency current from a first high-frequency power supply. The first filter circuit is provided with a variable capacitor for changing a circuit constant. For changing the circuit constant, the variable capacitor is varied so that a resonance point becomes greater than an optimum resonance point most attenuating a high frequency in the second high-frequency power supply. Doing so decreases a sputter rate of the generated plasma affected on a wall surface of the processing chamber.

This application is based upon and claims the benefit of priority from the prior Japanese Patent Application No. 2000-219783, filed Jul. 19, 2000, the entire contents of which are incorporated herein by reference.
1. Field of the Invention
The present invention relates to a plasma processing apparatus capable of suppressing a damage due to sputtering to a wall surface of a processing chamber during plasma occurrence.
2. Description of the Related Art
Conventionally, there are two types of plasma processing apparatuses. One type generates plasma by applying high-frequency power with a single type of frequency. The other type generates plasma by applying high-frequency power with two types of frequency. Especially, the latter type of plasma processing apparatus is configured to generate high-density plasma using high-frequency power with a high frequency, and generate a bias potential using high-frequency power with a low frequency. In recent years, there is often used a plasma processing apparatus which alternates the two types of frequencies according to necessity.
As shown in FIG. 10, this plasma processing apparatus comprises upper and lower electrodes 2a and 2b, and first and second high-frequency power supplies 3a and 3b. The upper and lower electrodes 2a and 2b are arranged parallel facing each other in a processing chamber 1. The first and second high-frequency power supplies 3a and 3b supply these upper and lower electrodes 2a and 2b with first and second high-frequency powers having different frequencies.
A matching circuit 5a is provided in the middle of a first power supply line 4a connecting the first high-frequency power 3a and the upper electrode 2a. A matching circuit 5b is provided on a second power supply line 4b connecting the second high-frequency power 3b and the lower electrode 2b.
Further, the first power supply line 4a connects with a first filter circuit 6a as a return circuit. This filter circuit 6a has a fixed circuit constant and attenuates a second high-frequency component. The second power supply line 4b connects with a second filter circuit 6b as a return circuit. This filter circuit 6b has a fixed circuit constant and attenuates a first high-frequency component. In the first and second filter circuits 6a and 6b, each circuit constant is set to a value resonating with a high frequency to be filtered.
When plasma processing is applied to a processing object such as a semiconductor wafer, the processing object is mounted on the lower electrode 2b, for example. The first and second high-frequency power supplies 3a and 3b supply corresponding high-frequency powers to the upper and lower electrodes 2a and 2b, respectively, to generate plasma P therebetween. Further, a bias voltage is applied to the lower electrode 2b to perform specified plasma processing for the semiconductor wafer on the lower electrode 2b.
The plasma processing apparatus attenuates high-frequency power with a different frequency on the first and second power supply lines 4a and 4b. The first and second high-frequency power supplies 3a and 3b supply respective high-frequency powers to the upper and lower electrodes 2a and 2b under an optimum condition.
In this technology, however, a potential difference occurs between the plasma potential and the wall surface of the processing chamber 1. Sputtering due to an ion component in the plasma erodes the wall surface. Simultaneously applying two types of high-frequency power decreases an effective ground area for one electrode compared to the case where a single frequency is applied. A sputter rate increases for the decreased ground area, causing more damages of the wall surface. This has been a cause of the shortening of the processing chamber life (usable period).
The problem of shortening the processing chamber life becomes more serious when the processing object such as a semiconductor wafer has an increased area, throughput is increased, or the high-frequency power is increased to further increase the sputter rate, and the like.
Conventionally, countermeasures have been taken to suppress damages to the wall surface. For example, the processing chamber is enlarged to increase the ground area and decrease the sputter rate. Alternatively, a resin coating is applied to the wall surface to prevent wear to the wall surface. In any case, substantial countermeasures is unavailable, causing a problem of increasing costs for additional processing.
It is an object of the present invention to provide a plasma processing apparatus capable of decreasing a sputter rate damaging a processing chamber wall surface during plasma generation and extending the usable life of the processing chamber.
In order to achieve the above-mentioned objects, a plasma processing apparatus according to the present invention for applying a specified plasma processing to a processing object comprises first and second electrodes arranged in parallel in a processing chamber so that they face to each other; a first high-frequency power supply for applying a first high-frequency power to the first and second electrodes via a first power supply line; a second high-frequency power supply for applying a second high-frequency power to the second electrode via a second power supply line; a first filter circuit for attenuating the second high-frequency power flowing through the first power supply line; and a second filter circuit for attenuating the first high-frequency power flowing through the second power supply line, wherein the first filter circuit includes a variable capacitor for varying a circuit constant in order to increase a resonance point from an optimum resonance point most attenuating the second high-frequency power and for decreasing a sputter rate for a wall surface of the processing chamber during plasma occurrence.
Additional objects and advantages of the invention will be set forth in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. The objects and advantages of the invention may be realized and obtained by means of the instrumentalities and combinations particularly pointed out hereinafter.


A method performed by a slave network edge node (e.g., a Broadband Network Gateway BNG2) for enhancing a Long Term Evolution (LTE) backup channel in the event of a failure of a master network edge node (e.g., BNG1) in a wireline network. When BNG2 detects the failure of BNG1, BNG2 sends a failure update message to a Packet Data Network Gateway (PDN GW) of an LTE network. The PDN GW provides a backup channel for the CPE to reach the wide area network over a mobile tunnel. Before the failure the mobile tunnel has an end point at BNG1, and the failure update message notifies the PDN GW that the end point of the mobile tunnel has changed from BNG1 to BNG2. After BNG2 receives a failure acknowledgement message from the PDN GW, BNG2 routes the traffic from the PDN GW over the mobile tunnel to the wide area network.

Home networks are utilized to connect devices in the home to one another and to the Internet. These home networks are connected to residential Internet service providers via a device known as a Residential Gateway (RGW). This device provides physical and protocol connectivity between the home network and the access network (i.e., the core network of the Internet service provider including the Internet service provider's access control devices such as a Broadband Remote Access Server (BRAS) router or Broadband Network Gateway (BNG)). In this specification, BRAS and BNG are used interchangeably.
An RGW can provide bridging or routing support for a home network. It typically also provides additional services such as firewall protection and network address translation. The RGW can connect with the devices in a home using both wired and wireless protocols and connections. The RGW can provide a set of Ethernet connections as well as a wireless local area network using IEEE 802.11(a/b/g/n). The RGW can also be a point of service delivery for services such as Voice Over Internet Protocol (VOIP) or de-multiplexing for services like shared television delivery.
An Internet service provider's access control device such as a BNG is also called a network edge device. The BNG is a critical network element for providing Internet services for home networks. The failure of the BNG will make devices in the home networks unreachable by the Internet service provider.

Enhancing a mobile backup channel to address a node failure in a wireline network


A turbine rotor consisting of a wheel made of a TiAl alloy of good heat resistance and a rotor shaft made of a steel with good bonding strength is disclosed. As the shaft material a structural steel or a martensitic heat resistant steel is used. A TiAl turbine wheel made by precision casting is butted to the shaft with insertion of a brazing filler in the butted interfaces and stress of 0.01 kgf/mm.sup.2 or higher but lower than yield stress of the shaft is applied on the butted interfaces under heating by high frequency induction heating in atmosphere of an inert gas or a reducing gas to a temperature higher than the liquidus temperature of the brazing metal but not exceeding 100.degree. C. above the liquidus temperature. Turbine rotors with good accordance of the axes of the wheel and the shaft will be obtained by fitting a projection (or recess) and a recess (or projection) formed at the base of the wheel and the end of the shaft concentrically to the outer shape thereof, and by brazing the ring-shaped area outside the fitted parts.

1. Field in the Industry
The present invention concerns a TiAl turbine rotor used as a part of turbochargers for internal combustion engines, and a method of manufacturing the same.
2. State of the Art
To date, turbine rotors for turbochargers of internal combustion engines have been manufactured by bonding a shaft made of a structural steel to a turbine wheel made by precision casting of, for example, Ni-based super alloy Inconel 713.degree. C. having good high temperature strength by friction bonding or electron beam bonding.
For the purpose of improving heat resistance of the turbochargers and to enhance responsibility of engines by lowering inertia caused by lowered weight of the turbine wheels, ceramics turbine rotors made of silicon nitride have been practiced.
The ceramics turbine rotors have drawbacks such as,
1) that the wheels must be thicker than those of conventional metal products due to lower rigidity of the material; and PA1 2) that balance of thermal expansion between the wheel and the casing is difficult to achieve due to lower thermal expansion of ceramics.
As a new material to replace ceramics, TiAl alloys drew attention because of their such low specific gravity as 3.8, which is of the same level as those of ceramics, a high specific strength (strength by density) at high temperature, which is equal to or higher than that of Inconel 713.degree. C., and a thermal expansion coefficient near those of metals. Thus, it was proposed to use the TiAl alloys as the material for turbine wheels (for example, Japanese Patent Disclosure No. 61-229901). The TiAl alloys practically used are those containing TiAl intermetallic compound as the main component, and the alloy compositions vary in a certain range. In the following description, however, the alloys are collectively referred to as "TiAl".
The TiAl turbine wheels are made by precision casting or isothermal forging and then, bonded to shafts made of a structural steel to form the turbine rotors. For the way of friction bonding, which has been practiced for bonding wheels of conventional Ni-based superalloy and shafts of a structural steel, cannot be applied to bonding TiAl wheels. This is because, if friction bonding is employed, transformation of the structural steel at the time of cooling from austenite to martensite causes volume expansion of the steel, which results in residual stress, and even though the TiAl have much higher rigidity which ceramics lack, ductility at room temperature is so low as about 1%, and thus, cracking of the TiAl wheels may occur. Further, reaction of Ti in TiAl and C in the structural steel occurs to form titanium carbide at the bonding interface, and therefore, strength at the interface decreases.
As the solutions of these problems, there has been proposed to practice vacuum brazing or friction bonding using an intermediate parts of austenitic material which does not suffer from martensitic transformation (for example, Japanese Patent Disclosure No. 02-133183).
The former solution, vacuum brazing mentioned above, must be carried out in high vacuum, which necessitates longer operation period inclusive of vacuum evacuation, and the costs will be higher. The latter solution, use of intermediate parts, requires two stages of bonding, for example, the first bonding between the intermediate part and the shaft and the second bonding between the intermediate part and the turbine wheel. Thus, the costs for manufacturing are also high. Further, control of the intermediate thickness after bonding is difficult.
The shaft part of the turbine rotor made by bonding is subjected to, for the purpose of refining, hardening and tempering, and then, the surface of the shaft around the bonded part to be supported by bearings is subjected to, for the purpose of improving wear resistance, hardening by high HF-heating or by laser heating. In case of vacuum brazing, if the austenitizing temperature is above the melting point of the brazing metal, then the brazing metal melts again at heating for hardening. This will result in oxidation of the brazing metal and decrease of strength at the bonded part. In some cases the product rotors may be even destroyed during handling.
Under the above circumstances, TiAl turbine rotors have not been practically manufactured. Main bar to practical manufacturing is high cost of production. The inventors tried brazing under high frequency induction heating (hereinafter abbreviated as "HF-heating"). The trial succeeded and it was ascertained that TiAl turbine wheels and steel shafts can be bonded with high bonding strength and that TiAl turbine rotors can be manufactured with reduced costs.
In practice of the above technology it was experienced that, if the interfaces to be bonded by brazing are plane, placing the axis of the TiAl wheel and the axis of the shaft in accordance is difficult, and that eccentric bonding often occurred. Also, due to higher thermal conductivity of TiAl, conduction of heat from the TiAl wheel, which is exposed to a high temperature during use, to the shaft is so high that the shaft goes to a high temperature and as the result, seizure of bearings may occur.

TiAl turbine rotor and method of manufacturing


A continuous bubble removal method includes: preparing a main container, a basic pressurization container that connects to the main container and holds a basic operating liquid, and a basic movable portion that is displaceably attached to the basic pressurization container; flowing target liquid through the main container, the liquid including a bubble; and iteratively decreasing and increasing a volume of the bubble by iteratively pressurizing and depressurizing the target liquid from a region via the basic operating liquid by displacing, in a reciprocating manner, the basic movable portion, the region being surrounded by a basic connecting portion of the basic pressurization container that is closer to the main container than the basic supporting portion, wherein an opening area of the basic supporting portion is larger than an opening area of the basic connecting portion.

The removal of bubbles in a highly viscous fluid is not easy due to the viscosity, and various bubble removal methods have been proposed. For example, with the bubble removal technology described in PTL 1, liquid flows into a container through an inlet, and as the volume of the container changes, pressurization and depressurization in the container are iteratively performed. Consequently, the volume of bubbles in the liquid iteratively decreases and increases, and as a result, shearing occurs in the liquid around the bubbles. This shearing causes the viscosity of the liquid around the bubbles to decrease, such that the rate at which the bubbles rise due to buoyancy increases. The bubbles that have risen are guided to a bubble outlet of the container, and the liquid from which the bubbles have been removed flows out of the container through a liquid outlet. In this way, bubbles are continuously removed from the liquid.
Also, with the bubble removal technology described in PTL 2, pressurization and depressurization in a container are performed from a plurality of locations in the container. As a result, the rate at which bubbles rise naturally increases compared to the technology described in PTL 1, thus improving the removal efficiency of bubbles.

Continuous bubble removal method and continuous bubble removal apparatus


It is possible to manage information on a city area in a centralized manner and reduce a processing load. A management system includes: information acquisition means that is provided in infrastructure of a predetermined city area and acquire information on the city area; service providing means sending instructions to respective mobile bodies for providing a plurality of different conveyance services, each of the mobile bodies including a sensor configured to detect the information on the city area and moving in the city area based on the information detected by the sensor, thereby providing each of the conveyance services; and instruction means for sending an instruction to the service providing means based on the information on the city area acquired by the information acquisition means.

The present disclosure relates to a management system that manages a mobile body and a management method.
A management system including a server that acquires information on a city area via respective clients, analyzes the acquired information, and transmits information determined based on the result of the analysis to the clients has been known (see, for example, Japanese Patent No. 6567483).


A finished-image generating unit generates a finished image showing a result of a process performed on a target image according to various function setting items. A finished-image display unit, when the target image extends to a plurality of pages, forms the finished image in a stack, and displays the stacked finished image on a display unit with a page structure image that shows an overall page structure of the stacked finished image. A page moving unit, when one of the pages constituting the page structure image is specified via an operating unit, executes a page moving from a page currently displayed on the display unit to the specified page.

1. Field of the Invention
The present invention relates to an image processing apparatus and a computer product.
2. Description of the Related Art
In using an image processing apparatus, such as a copier, fax machine, printer, and a multi function product (MFP) having combined functions of copying, faxing, printing, a user has to selects a function to execute from functions the image processing apparatus offers, and to make setting for desired functional contents. For example, the user needs to make setting on the condition of a document, such as the type and the density of the document, on various image processes, such as zoom, single-side/double-side printing, and margin size adjustment, and on postprocessing, such as sorting, stapling, and punching.
A conventional image processing apparatus provides enormous numbers of setting items and a plurality of setting contents for each item to allow a user to execute a variety of setting. The user, who wants to obtain a desired result, selects a type of setting out of those enormous setting items and contents.
The user, however, has no way to know what kind of a process result to receive according to setting contents in using the conventional image processing apparatus. For example, the user has to wait for actual print-out from the image processing apparatus to know a print result for the user. The obtained print result often ends up in a kind of finished product that the user does not expect to get.
To solve the above problem, some apparatuses and systems have been proposed, which include a preview display apparatus (see, for example, Japanese Patent Application Laid-Open No. 2003-5471) that displays a preview image showing the state of a printed result, an image processing apparatus (see, for example, Japanese Patent Application Laid-Open No. 2002-103726) that displays a preview image showing image data printed on a paper corresponding to selected paper image data when the paper image data to express a paper style of a different paper quality is selected, and an image forming system (see, for example, Japanese Patent Application Laid-Open No. 1999-234503) that displays a preview image of data made by synthesizing a plurality of edited and processed image data.
These conventional techniques offer a function of only displaying a preview of a single image, or an image synthesized from a plurality of images, that shows the result of image processes executed according to setting contents.
A user checks such preview images to make setting again for correction, which allows the user to perform setting operation while checking an image for a finished condition before proceeding to a print-out process, and finally obtain desired image output.
Those conventional techniques, however, have such a disadvantage in usability that a paging operation is required to turn pages one by one to find the overall structure of an image consisting of a plurality of pages or to find a specific image to check when the image consists of a number of pages of images, because each of the above conventional techniques features only the function of displaying a preview of a single image or an image synthesized from a plurality of images that shows the result of image processes executed according to setting contents.
In actual work of finding an object page in an image file consisting of a plurality of pages displayed on a display unit, a user often desires to find such a specific page that bears the turn of chapters or diagrams. A conventional method, however, forces the user to turn pages one by one to find the specific page. This costs the user a lot of trouble and time when the object page is separated far from a page to start turning, thus poses a problem that check work is cumbersome and inefficient.

Image forming apparatus including a finished image display unit


A low-voltage latch adapted for differential mode with a supply voltage of 2.5V and a voltage swing of 200 mV to 3000 mV is described. Two inverters, are used, each having a non-inverting and an inverting input terminal and a non-inverted and an inverted output terminal. The non-inverted output terminals are connected to the input of an OR structure, and the inverted output terminals are connected to the input of another OR structure. The input terminals of one inverter form the input terminals of the latch. The input terminals of the other inverter are connected to the output terminals of the OR structures and form the output of the latch. The supply voltages of the inverters are varied, so that at any given time, only one inverter has an appropriate supply voltage. This inverter then controls the output of the latch. In this way, a latch function is achieved.

Latches are used in electric circuits to hold information temporarily. For example, in a computer system, incoming information may pass through a latch where it is held for a certain time so that it can be read.
The development of sub-micron CMOS technologies results in new standards for voltage supplies. Currently, CMOS circuits use voltage supplies as low as 3.3V, and in the future, voltage supplies as low as 2.5V will probably be used. A traditional ECL gate typically uses voltages of approximately 4.5V-5V. Therefore, there is a need for circuits that can operate at lower voltages. Also the technical development increases the need for faster circuits than those available today.
Latches can be designed to work either in a differential mode or in a single-ended mode.
In single-ended mode, the voltage at one of the inputs is held constant while the other one varies between two modes, one of which is higher, the other lower than the constant voltage at the first input. One drawback with the single-ended mode is that it requires at least twice the voltage swing of the differential mode. Typically the voltage swing in single-ended mode is 600 mV-800 mV.
In differential mode the voltage at both input terminals are varied, and a voltage swing of 200 mV-300 mV is required. This configuration is faster and also less sensitive to noise than the single-ended mode.
In logical circuits, several levels of transistors may be used, so that the output of one transistor controls a transistor at the next level. In ECL logic 3-4 levels of transistors are typically used. By reducing the number of levels, the required supply voltage is reduced. With a supply voltage of 2.5V, only one level of transistors can be used, together with one resistor and one current source.
In Razavi et al. "Design Techniques for Low-Voltage High-Speed Digital Bipolar Circuits", IEEE Journal of Solid-State Circuits, Vol. 29, No. 3, March 1994, a number of low-voltage circuits based on the ECL circuits are disclosed, among them a D-latch. This latch operates in a single ended mode and requires a supply voltage of 2.5V and a voltage swing of approximately 600 mV-800 mV.


A method and apparatus for imaging a scene. The method and apparatus are capable of resolving 3D spatial structure within the scene. The apparatus includes a light source, a timing system and a detector system. The light source emits pulses of light toward the object or target scene being imaged. In one embodiment, the light source is a laser. In another embodiment, the detector system includes an optical system and a monolithic array of light detectors operating in non-linear Geiger-mode. The optical system collects a portion of the light scattered off of objects in the target scene and directs the collected light toward the array of light detectors. In another embodiment, the detector system includes an optical system and a single light detector operating in non-linear Geiger-mode. In this embodiment, the optical system scans the target scene, collects a portion of the light scattered off of objects in the target scene and directs the collected light toward the light detector.

Most remote imaging techniques can be broadly divided into two categories: passive and active. As used herein, "imaging" is defined as creating a representation of a scene. Passive imaging techniques detect light emitted or reflected by objects. Passive imaging techniques can be used to recognize objects if the reflective or emissive signature of the objects can be distinguished from sensor noise and background light. As used herein, an object's "signature" is defined as the appearance of the object. A camera is an example of a device which uses a passive imaging technique.
Active imaging techniques direct light onto a target scene and detect light reflected back from objects in the target scene. As used herein, "target scene" is defined as the region in space to be imaged. Similar to passive imaging techniques, active imaging techniques can be used to recognize objects within the target scene if the reflective or emissive signature of the objects can be distinguished from sensor noise and background light. The problem of recognizing an object using remote imaging techniques is complicated because the signature of an object varies with surface, lighting, environmental conditions, viewing angle and percent exposure.
Laser radar, also referred to as Light Detection and Ranging (LIDAR) or Laser Detection and Ranging (LADAR), is an active imaging technique which utilizes a laser in a radar system configuration to remotely image a target scene. Laser radar systems utilize principles of optics and microwave radar. Conventional laser radar systems are able to measure the shape, position, and velocity of objects in a target scene. Other known laser radar systems include coaxial passive thermal sensing receivers which measure the temperature of objects in the target scene.
Conventional laser radar systems can be broadly divided into two categories: scanning and scannerless. Typical scanning laser radar systems include a laser, scanning optics, a timing system, a detector system and a processor. The detector system includes a light detector. To image a target scene, a typical scanning laser radar system first transmits a short pulse of light toward a point in the scene. In one known system, the pulse of light has a duration of approximately one nanosecond. Next, the detector system detects light reflected back from the point in the scene and the timing system determines the round-trip travel time of the pulse of light. As used herein, the "roundtrip travel time" of a pulse of light is defined as the amount of time between the time that the laser transmits the pulse of light and the time that the detector system detects the reflected light. Next, the processor records the direction of the output of the laser and the round-trip travel time of the pulse of light. The scanning optics then position the output of the laser toward a new point in the target scene and the laser radar system transmits a second pulse. This process is repeated for each point in the target scene. Finally, the processor generates an image of the scene in response to the recorded directions of the output of the laser and the corresponding round-trip travel times of each of the transmitted pulses of light.
Typical scannerless laser radar systems include a laser, a timing system, a stationary detector system and a processor. The detector system includes an array of light detectors. To image a target scene, a typical scannerless laser radar system directs the output of the laser toward the target scene and the laser transmits a pulse of light toward the target scene which illuminates the entire scene. Next, the detector system detects light reflected back from the scene. The timing system then determines a roundtrip travel time of the pulse of light for each of the light detectors in the array that detects reflected light. Next, the processor records the positions of the light detectors in the array that detected the reflected light and the corresponding round-trip travel times of the pulse of light for each light detector. Finally, the processor determines an image of the target scene in response to the recorded positions of the light detectors and corresponding round-trip travel times of the transmitted pulse of light.
In general, known laser radar systems are subject to one of the following shortcomings: being heavy and large in size; having cryogenic cooling requirements; having high false alarm rates; having poor ranging precision; and not being capable of single photon detection. Known scannerless laser radar systems have the additional shortcoming of crosstalk between the light detectors in the array of light detectors.
What is desired then is a light-weight direct detection laser radar system which can measure and image the three-dimensional spatial structure of objects located in a target scene with extreme sensitivity. The present invention permits such functionality.

Method and apparatus for imaging a scene using a light detector operating in non-linear geiger-mode


A video signal processing apparatus includes a characteristic detection circuit for detecting luminance distribution corresponding to one frame of a video signal, a contrast compensation circuit for compensating contrast of the video signal, an edge compensation circuit for compensating an edge portion of the video signal, and a control circuit for determining a luminance range to be controlled on the basis of the luminance distribution detected by the characteristic detection circuit, and controlling the contrast compensation circuit and edge compensation circuit to conduct predetermined compensation on the video signal belonging to the luminance range. The control circuit controls the contrast compensation circuit to increase contrast for the video signal in the luminance range as compared with the video signal in other regions, and controls the edge compensation circuit to make an edge compensation quantity for the video signal in the luminance range smaller as compared with other regions.

This invention relates to a video signal processing apparatus that conducts signal processing such as contrast adjustment and edge compensation on a video signal, a TV receiver using such a video signal processing apparatus, and a video signal processing method.
As a conventional technique concerning the contrast compensation function in TV receivers, a technique of detecting a maximum level and a minimum level of a video luminance signal and an average luminance level and controlling the contrast compensation on the basis of these levels is known as described in, for example, Japanese Patent No. 3,215,400. As a conventional technique concerning the sharpness adjustment function, i.e., the edge compensation function, a technique of conducting edge compensation (emphasis) by extracting high frequency components in a video signal and adding the extracted high frequency components to the original image is known as described in, for example, JP-A-5-56308.
In the conventional technique described in Japanese Patent No. 3,215,400, a characteristic of an image is detected, and the signal gain is controlled so as to improve the contrast according to the dynamic range of a display apparatus. When the signal gain is increased, however, then the image amplitude becomes large and in addition noise components contained in the image are also amplified. On the other hand, the edge compensation in the edge compensation circuit is conducted by extracting the high frequency components in the horizontal and vertical direction from the video signal and amplifying the extracted high frequency components as described above. Since the noise components contained in the image also distribute in relative high frequency bands, not only the image edges but also the noise components are also amplified (emphasized) in some cases.
In other words, when the edge compensation is further conducted in a state in which compensation for increasing the contrast is being conducted, the noise components are amplified doubly. In an apparatus having these two compensation functions, therefore, the noise components becomes larger in a state in which the compensation for increasing the contrast is being conducted, and there is a possibility that the image becomes difficult to see in some images because of the influence of the noise. Heretofore, the problem of the noise emphasis in the case where the contrast compensation (especially the compensation for increasing the contrast) and the edge compensation are conducted simultaneously has not been considered.

Video signal processing apparatus, for controlling contrast compensation and edge compensation in relation to each other in depedence on luminance of an image, and television receiver including the same


A vascular access needle assembly is provided. The needle assembly includes a housing interconnected with a needle. The housing and the needle have slots along their lengths which are aligned to form a slot extending along the entire needle assembly. A sheath interconnected with the needle extends partially about the needle and includes a slot. The vascular access needle, with the needle point exposed and needle slot closed, can be inserted into the blood vessel of a subject and a guide wire can be inserted into the blood vessel through the needle assembly. The sheath is then moved to cover the needle point and to expose the needle slot so that the guide wire can be lifted through the needle, sheath and housing slots and the vascular access needle assembly removed, leaving the guide wire in the subject. The device can also be used as a wire introducer for catheters. The vascular needle assembly can also be used as a biopsy needle for obtaining biopsy tissue wherein the edges of one or both of the needle slot and sheath slot are sharpened for cutting tissue.

1. Field of the Invention
The present invention relates to a medical device for inserting medical instruments into a subject. In particular, the invention provides a vascular access needle assembly to facilitate insertion of a guide wire into a subject.
2. Background of the Invention
Medical instruments used for diagnostic or therapeutic purposes such as micropuncture, catheterization, and arteriography are often introduced into subjects through vascular vessels using various types of needle assemblies. One problem associated with the use of such needles is inadvertent needle sticks.
The insertion of catheters and other instruments into blood vessels typically involves inserting and removing guide wires. For example, micropuncture involves inserting and removing guide wires of increasing diameter in order to successfully insert diagnostic or therapeutic instruments which may have a greater diameter than the initial insertion point into the blood vessel. One procedure involves making an incision in the skin over the target blood vessel. A thin walled needle is then inserted into the blood vessel. A fine guide wire is then inserted through the needle and the needle is removed by sliding it over the end of the guide wire. A dilator having inner and outer components is then placed over the guide wire, and is advanced over the guide wire and into the blood vessel. The inner component of the dilator and the guide wire are removed while the sheath (the outer component of the dilator) remains in the blood vessel. A guide wire of a larger diameter may then be inserted into the blood vessel. In addition to consuming valuable time, the disadvantage of this procedure is that in order to insert a device of greater diameter than the needle, more than one guide wire must be inserted and removed from the blood vessel, increasing the chances of damaging the vessel wall.
Other access and/or tissue collection procedures also have potential problems associated with the use of complicated devices and limitations much like those of vascular access needles.
Thus, what is needed, but has not yet been provided, is a vascular access needle which allows the insertion of instruments of varying or increasing diameter into a blood vessel without requiring the insertion of multiple guide wires, and which protects against inadvertent needle sticks. What is also needed is an access device which allows for quick and easy insertion of instruments. What is also needed is a device that allows for tissue to be quickly and easily obtained for biopsies.

University of Medicine & Dentistry of New Jersey


There is set forth herein a method for providing a nanoparticle array. A nanoparticle network can be provided by nanoparticles combined with surfactant micelle chains. The nanoparticle network can be provided by distributing metal nanoparticles in a surfactant solution and agitating the surfactant solution comprising the nanoparticles to form a gel comprising the nanoparticle network which can be characterized by a distributed array of nanoparticles combined with surfactant micelle chains within a fluid. The gel can comprise a fluid in a continuous phase and the nanoparticles in a discontinuous phase. Apparatus having arrays of nanoparticles are also set forth herein.

Various approaches for providing light absorbing materials have been proposed. A popular approach is the incorporation of a light trapping layer that consists of noble metal NPs onto the PV device. Nanostructured plasmonic interfaces for this purpose have been fabricated by using lithography, vapor deposition, de-wetting of thin metal films by ns and fs pulsed lasers, and wet chemistry using self-assembled monolayers. Economical scale-up and adaption of such processes to fabricate interfaces with multiple species/shapes/sizes in a controllable and repeatable fashion are not straightforward.

Nanoparticle array comprising distributed nanoparticles


Methods and apparatus for automatically detecting when a memory system has significantly degraded are disclosed. According to one aspect of the present invention, a method for determining a status associated with a memory system which includes a plurality of sectors includes updating a counter, comparing the counter to a threshold value, and generating an appropriate indication when comparing the counter to the threshold value yields a first result. The counter is updated each time a sector is reassigned, and indicates a number of sectors remaining in the memory system. The threshold value indicates a number of sectors which are yet to be reassigned in order for the memory system to be considered as useable, or reliable. The indication is generated when comparing the counter to the threshold value yields a first result to indicate that the memory system is substantially near a failure condition.

1. Field of Invention
The present invention relates generally to mass digital data storage systems. More particularly, the present invention relates to systems and methods for automatically determining when a digital data storage system is nearing a fault condition or an end of life.
2. Description of the Related Art
The use of non-volatile memory systems such as flash memory storage systems is increasing due to the compact physical size of such memory systems, and the ability for non-volatile memory to be repetitively reprogrammed. The compact physical size of flash memory storage systems facilitates the use of such storage systems in devices which are becoming increasingly prevalent. Devices which use flash memory storage systems include, but are not limited to, digital cameras, digital camcorders, digital music players, handheld personal computers, and global positioning devices. The ability to repetitively reprogram non-volatile memory included in flash memory storage systems enables flash memory storage systems to be used and reused.
As the life of a flash memory storage system is limited, i.e., a flash memory storage system will typically wear out after some amount of use, a flash memory storage system generally must eventually be replaced. A flash memory system that has significantly degraded may fail to retain data reliably, e.g., in sectors or blocks that are worn. A decision as to when it may be appropriate to replace a flash memory storage system may be made when a user notices that the performance of the flash memory storage system is deteriorating, e.g., when a write process is slower than expected. That is, a user may decide to replace a flash memory system based upon his belief that the flash memory system may be nearing the end of its useful life, or may be nearing a fault condition. More typically, however, a user may not realize that it may be necessary to replace a flash memory storage system until the flash memory storage system fails in some way. For example, a user may not realize that a flash memory storage system has substantially reached the end of its useful life or is nearing a fault condition until an attempt to either write data to or retrieve data from the flash memory system fails. A failed attempt to either write data or retrieve data may prove, in some cases, to be relatively catastrophic.
A memory system such as hard disk drive systems may include the capability to generate warnings when a fault condition is near. To monitor the life of hard disk drive systems, some hard disk drive manufacturers provide a feature set that is consistent with a Self-Monitoring, Analysis and Reporting Technology (SMART) feature set. A SMART feature set essentially monitors the internal operations of a hard disk drive and provides warnings pertaining to problems, e.g., an end of life condition, as will be appreciated by those skilled in the art. Diagnostics associated with a SMART feature set are typically run off-line, i.e., when the hard disk drive is not currently processing active commands or servicing user requests.
While the off-line failure prediction process associated with a SMART feature set is generally effective in determining when a hard disk drive may be nearing the end of its useful life or approaching a fault condition, an off-line failure prediction process associated with a SMART feature set often may not initiated, or when initiated, may often not be completed. In other words, an off-line failure prediction process may not be implemented and completed often enough to enable a warning to be generated when the hard disk drive is either near the end of its useful life or near a fault condition. As the implementation of an off-line failure prediction process occurs substantially only when the hard disk drive is not processing active commands or servicing user requests, when a hard disk drive continually has commands to process and requests to service, it may not be possible for an off-line failure prediction process to be initiated. In addition, when an off-line failure prediction process is initiated, the process may not be completed if the computer system which includes the hard disk drive attempts to use the hard disk drive.
The ability to provide an indication of when a hard disk drive or a flash memory system is nearing the end of its useful life or nearing a fault condition would enable a user to act to ensure that his or her data may be retained reliably within the hard disk drive of the flash memory system. While some hard disk drives include the capability to warn a user of when the hard disk drive might be about to fail, even such hard disk drives may not always successfully execute operations to determine when the hard disk drive is about to fail since such operations generally occur off-line and, hence, may fail to occur on occasion, or may be interrupted once they are initiated, as discussed above.
Therefore, what is needed is a method and an apparatus for dynamically determining when a memory device may be either near the end of its useful life or near a fault condition. Specifically, what is desired is a method and an apparatus which enables dynamic predicts to be made as to when a flash memory system may be about to fail or may be about to meet a fault condition.

Method and apparatus for dynamic degradation detection


A buffer brush for stenciling with which the user's hand will not get tired even if it taps the handle for a long time to stencil ink, and the close contact of the ink absorbing part and the stencil will be good. The buffer brush comprises an ink absorbing part (2) on a handle (1) which is made of buffer material.

Conventionally, stenciling is done as follows: Stencils with letters, figures, or designs cut out are fixed onto a sheet of paper. Watercolors (water-soluble paint), or ink from a stamp pad is transferred to a stencil brush, then the artist colors by slightly tapping the stencil brush on the top of the stencil. Then, afterward, the stencil is removed and the letters, figures, or designs are copied.
Stencil brushes used for conventional stencils can have, as illustrated in FIG. 4, a brush (13) of animal hair, etc., attached to the tip of a wooden or bamboo handle (11), or as illustrated in FIG. 5, an ink absorbing part (12) of polyurethane sponge, etc., attached to the tip of a handle (11a) of wood, bamboo, or hard plastic. The artist holds the handle with his or her fingers in the same manner as a pencil, and colors with ink by slightly tapping the brush on top of the stencil.
However, such conventional stencil brushes have the following problem: Because the handle is made of hard material such as wood, bamboo, or hard plastic, when the user taps the handle to dispense the ink, the impact of the tapping force returns to the fingers through the handle, because the force is not absorbed by the hard handle, stencil, or paper. Thus, the user receives an impact on the fingers all the time, and the fingers get tired if tapping is continued for a long time period.
Also, because the impact of the force, which taps the stencil brush, returns through the handle (11), the handle bounces, and disrupts the close contact between the brush (13) or ink absorbing part (12), the stencil and the paper. Thus, the quantity of ink released from the brush by one time of tapping is small, resulting in the need for more tapping on the stencil brush. The fingers therefore receive impact more frequently, and the hand gets tired.
The present invention improves such a problem of the prior art. The purpose is to offer a buffer brush for stenciling as follows: By providing buffer characteristics by using buffer material for the handle of a stencil brush, the impact of the force of tapping the stencil brush is absorbed by the buffer material of the handle. Thus, the hand will not be tired even if the user taps for a long time period. Also, there will be close contact between the ink absorbing part, the stencil and the paper.