A system and method provides active propulsion of endoscopes along body lumens. The propulsion system can be attached to a commercially available endoscope, or be provide affixed together, and moves the endoscope in a lumen by pulling it forward. A rotatable toroidal wall, e.g. annular invaginated balloon, provides the propulsion. A drive assembly rotates the toroid while maintaining the toroid's position along the endoscope. The toroid is radially extended or inflated within the lumen to engage its outer surface to the lumen. The toroidal rotation tracks the lumen wall for propulsion. Stops maintain the rotating toroid's position on the endoscope. A helical screw within the toroid engages patterned protrusions around the toroid; screw rotation advances the protrusions to rotate the toroid wall. A fitted belt coupled to a groove in the toroid provides alternative actuation. Colonoscopy is substantially improved, reducing anesthesia and other requirements and costs, and improving safety.

1. Field of the Invention
This present invention provides a system and method adapted to assist movement of devices through body spaces, and in particular body lumens. More specifically, it provides a system and method adapted to assist endoscope movement along body spaces such as lumens. Still more specifically, it provides a system and method adapted to assist movement of devices, and in particular endoscopes, through the colon and lower gastrointestinal tract.
2. Description of Related Art
Each year 60,000 Americans die from colon cancer, making colon cancer the second leading cause of cancer death in the United States. Early detection of the disease greatly improves survival. Furthermore, removal of pre-cancerous polyps can be achieved endoscopically which prevents colon cancer altogether. Unfortunately early colon cancer and polyps are asymptotic. For this reason screening tests are needed to detect and prevent colon cancer. Currently available screening tests include fecal occult blood test, flexible sigmoidoscopy and colonoscopy. In part because of the limitations of these tests only about 10% of the United States population is currently screened for this common preventable cause of death.
Fecal occult blood testing detects blood in the stool that can not be seen on visual inspection of the stool. Unfortunately only about 30% of colon cancers can be detected by fecal occult blood testing, making this test too insensitive for effective screening.
Flexible sigmoidoscopy is a type of endoscopy that uses a semi-rigid tube with fiberoptic lenses to directly visualize the colon. The end of this semi-rigid tube has a flexible steering section to direct the instrument's tip. In an ideal patient this test can visualize up to 60 centimeters of the distal colon (or approximately one-third of the entire colon). The limited extent of the flexible sigmoidoscopy exam misses approximately 50% of colon cancers. Although flexible sigmoidoscopy is insensitive it is relatively inexpensive and can be performed as a screening test in a physician's office. Unfortunately flexible sigmoidoscopy is too uncomfortable for many patients to tolerate. Flexible sigmoidoscopy is painful because the scope is advanced in the colon by pushing the semi-rigid tube against the colon wall. As the tube is pushed against the colon wall, the colon is stretched. Stretching of the colon causes intense visceral pain. In addition to pain stretching the colon too far can result in colon perforation, a potentially life threatening complication of flexible sigmoidoscopy.
Colonoscopy like flexible sigmoidoscopy is a type of endoscopy that utilizes a semi-rigid tube with either fiberoptic lenses or a video camera to directly visualize the colon. Currently available colonoscopes offer an excellent view of the colon. In a fashion similar to flexible sigmoidoscopy the semi-rigid tube has a flexible steering section at the distal end of the instrument. Unlike the flexible sigmoidoscope, the colonoscope is long enough to visualize the entire colon. For this reason colonoscopy is ideal for colon cancer screening. If a pre-cancerous colon polyp is detected at the time of colonoscopy it can be removed through the scope's "working channel" using various endosurgical instruments (such as biopsy forceps and polypectomy snares). In a fashion similar to flexible sigmoidoscopy, pushing the semi-rigid tube against the colon wall advances the colonoscope. Unfortunately colonoscopy is far too uncomfortable to be performed without high level intravenous sedation or general anesthesia. The pain experienced during colonoscopy is related to stretching of the colon wall as the colonoscope is advanced. Colon perforation can occur as a result of pushing the semi-rigid tube too forcefully against the colon wall as the colonoscope is advanced. The high level of sedation needed for colonoscopy requires a highly monitored environment such as an operating room. With the added operating room charges colonoscopy becomes quite costly. If colonoscopy were less expensive it would be more widely accepted as a colon cancer-screening test.
The purpose of the current invention is to develop a safe and effective low cost method for colon cancer screening. To achieve this end the inventors have developed an endoscopic propulsion unit that can attach to currently available colonoscopes. The endoscopic propulsion unit will advance a colonoscope in the colon lumen without stretching the colon wall; greatly reducing procedure-related pain. In addition, safety of colonoscopy will be improved by eliminating the risk of colon perforation. The endoscopic propulsion unit advances a colonoscope by pulling the distal end of the instrument. The invention that follows will allow relatively painless colonoscopy that can be performed safely in a physician's office. By removing the need for high level sedation, colonoscopy could be moved to a lower cost center such as a physician's office. This could result in a 66% savings in the total colonoscopy cost. It is hoped that this comfortable, effective, affordable and safe method for colon cancer screening will be widely used to reduce colon cancer mortality.
Various robotic endoscopy devices and methods have been previously disclosed. Several such disclosures involve robotic endoscopes that are generally complex devices with multiple interacting segments. These previously disclosed robotic endoscopes generally involve a kinematically redundant robot, which generally has about seven or more internal degrees of freedom. These robotic endoscopes are also designed to function autonomously as a robot. An examining physician has no direct control of the robotic endoscope. Furthermore the examining physician cannot directly assist in the movement of the scope in an organ lumen. The lack of direct physician control will markedly increase the risks of robotic endoscopy.
The previously disclosed robotic endoscopes also depend on a complicated interaction of a plurality of segments. At least one previously disclosure involves a robotic endoscope that relies on a complex array of pressure sensors, gripping devices and expansion modules under the control of at least one computer. Even the slightest malfunction of the complex control mechanism could cause devastating complications for a patient.
More specifically, the prior robotic endoscope uses a proximal and a distal toroidal balloon in conjunction with an extensor module. The proximal toroidal balloon expands to statically grip the organ wall and thereby fix this segment of the robotic endoscope to the organ wall. After the proximal balloon has expanded, the extensor module expands thus lengthening the robotic endoscope. The robotic depends primarily on the extensor module for movement. After the extensor module has lengthened the robotic endoscope, the distal toroidal balloon expands to fix this segment of the robotic endoscope to the organ lumen wall. After distal toroidal balloon inflation, the proximal toroidal balloon deflates and the extensor module contracts. This arrangement is said to produce an inch-worm-like movement in an organ lumen.
The toroidal balloon described in at least two such prior disclosures operates by means of static friction. This static friction is fundamental to the operation of the robotic endoscope. This static friction is between the balloon and organ wall. The only dynamic feature of the toroidal balloon's operation is expansion and contraction. Extension and contraction of the extensor module causes movement of the robotic endoscope in an organ lumen. As such, the extensor module is the main dynamic component of the robotic endoscope.
The toroidal balloon(s) described in at least these two prior disclosures involves a relatively small surface area. Thus high inflation pressures may be required to grip and fix the toroidal balloon to the organ wall. A high inflation pressure used to fix the toroidal balloon to an organ wall may distend the organ wall. This degree of organ wall distention may produce intense visceral pain. Therefore, robotic endoscopy according to these prior devices and methods may often require high level sedation or general anesthesia to permit a comfortable examination. In this regard, robotic endoscopy according to these prior disclosures offers no additional benefits to currently available endoscopic procedures.
Furthermore, the extensor module of these prior robotic endoscope disclosures is constantly changing the axial length of the robotic endoscope. As the robotic endoscope is constantly changing length, currently available endosurgical devices such as biopsy forceps or polypectomy snares may be very difficult if not prevented from conjunctive use.
The mechanical complexity of this prior approach and the need for computer control systems generally relate to relatively high production cost for the robotic endoscope. And, as in many fields, high production cost could substantially limit the availability of robotic endoscopy for widespread clinical use, such as in colorectal cancer screening. Moreover, sufficiently high production cost may also prohibit disposal of the robotic endoscope after each use. As disposal would not be generally practical according to these prior approaches, sterilization of the robotic endoscope becomes a likely necessity. Furthermore, sterilizing such a complex device with multiple mechanical and electronic components would be still a further challenge of substantial difficulty. The difficulty in sterilizing these robotic endoscopes may result in elevated potential for infectious disease transmission.
Other medical devices have also been previously disclosed that operate, at least in part, in much the same fashion as the robotic endoscopes just described. At least one additional medical device has been disclosed that uses an expandable front and rear cuff section with an expandable center section to produce movement, sharing certain similarities, including various of the incumbent shortcomings and concerns, with the robotic endoscope noted above. Another lumen-traversing device has also been disclosed that also shares certain similar limitations as the robotic endoscopes noted.
The disclosures of the following issued U.S. Patents are herein incorporated in their entirety by reference thereto: U.S. Pat. No. 4,117,847 to Clayton; U.S. Pat. No. 4,207,872 to Meiri et al.; U.S. Pat. No. 4,321,915 to Leighton et al.; U.S. Pat. No. 4,368,739 to Nelson, Jr.; U.S. Pat. No. 4,561,427 to Takada; U.S. Pat. No. 4,615,331 to Kramann; U.S. Pat. No. 4,676,228 to Krasner et al.; U.S. Pat. No. 4,776,845 to Davis; U.S. Pat. No. 5,236,423 to Mix et al.; U.S. Pat. No. 5,259,364 to Bob et al.; U.S. Pat. No. 5,331,975 to Bonutti; U.S. Pat. No. 5,337,732 to Grundfest et al.; U.S. Pat. No. 5,398,670 to Ortiz et al.; U.S. Pat. No. 5,562,601 to Takada; U.S. Pat. No. 5,586,968 to Grundl et al.; U.S. Pat. No. 5,662,587 to Grundfest et al.; U.S. Pat. No. 6,071,234 to Takada; U.S. Pat. No. 6,086,603 to Termin et al.; and U.S. Pat. No. 6,224,544 to Takada.
The following U.S. Patent Application Publications are also herein incorporated in their entirety by reference thereto: US 2002/0143237 to Oneda et al.; US 2003/0225433 to Nakao; US 2004/0106976 to Bailey et al.; and US 2004/0138689 to Bonutti.
There is still a need for improved endoscope delivery, in particular relation to colonoscopy.
There is in particular still a need for improved system and method that actively propels endoscopes within tortuous body lumens, and in particular the colon and lower GI tract, with improved control and substantially reduced wall trauma and pain.
There is also still a need for an improved system and method that modifies commercially available endoscopes for active propulsion along body lumens.


Transparent conductors and methods for fabricating transparent conductors are provided. In one exemplary embodiment, a method for fabricating a transparent conductor comprises forming a dispersion comprising a plurality of conductive components and a solvent, applying the dispersion to a substrate in an environment having a predetermined atmospheric humidity that is based on a selected surface resistivity of the transparent conductor, and causing the solvent to at least partially evaporate such that the plurality of conductive components remains overlying the substrate.

Over the past few years, there has been an explosive growth of interest in research and industrial applications for transparent conductors. A transparent conductor typically includes a transparent substrate upon which is disposed a coating or film that is transparent yet electrically conductive. This unique class of conductors is used, or is considered being used, in a variety of applications, such as solar cells, antistatic films, gas sensors, organic light-emitting diodes, liquid crystal and high-definition displays, and electrochromic and smart windows, as well as architectural coatings.
Conventional methods for fabricating transparent conductive coatings on transparent substrates include dry and wet processes. In dry processes, plasma vapor deposition (PVD) (including sputtering, ion plating and vacuum deposition) or chemical vapor deposition (CVD) is used to form a conductive transparent film of a metal oxide, such as indium-tin mixed oxide (ITO), antimony-tin mixed oxide (ATO), fluorine-doped tin oxide (FTO), and aluminum-doped zinc oxide (Al—ZO). The films produced using dry processes have both good transparency and good conductivity. However, these films, particularly ITO, are expensive and require complicated apparatuses that result in poor productivity. Other problems with dry processes include difficult application results when trying to apply these materials to continuous and/or large substrates. In conventional wet processes, conductive coatings are formed using the above-identified electrically conductive powders mixed with liquid additives. In all of these conventional methods using metal oxides and mixed oxides, the materials suffer from supply restriction, lack of spectral uniformity, poor adhesion to substrates, and brittleness.
Alternatives to metal oxides for transparent conductors include conductive components such as, for example, silver nanowires and carbon nanotubes. Transparent conductors formed of such conductive components demonstrate transparency and conductivity equal to, if not superior to, those formed of metal oxides. In addition, these transparent conductors exhibit mechanical durability that metal-oxide transparent conductors do not. Accordingly, these transparent conductors can be used in a variety of applications, including flexible display applications. However, the transparency and conductivity of transparent conductors fabricated using conductive components depends on the process by which the conductors are made.
Accordingly, it is desirable to provide methods for fabricating transparent conductors with enhanced transparency and conductivity. In addition, it also is desirable to provide such transparent conductors that do not require expensive or complicated systems. Furthermore, other desirable features and characteristics of the present invention will become apparent from the subsequent detailed description of the invention and the appended claims, taken in conjunction with the accompanying drawings and this background of the invention.


A semiconductor device comprises a plurality of semiconductor chips (20, 30) having electrodes (22, 32) and aligned in the horizontal direction; a substrate (10) on which is formed an interconnect pattern (12) having bonding portions (14) connected to the electrodes (22, 32) of the semiconductor chips (20, 30) and lands (16) connected to the bonding portions (14), and external electrodes (40) provided on the lands (16) and connected to the electrodes (22, 32) through an interconnect pattern (12).

The present invention relates to a semiconductor device and method of manufacturing the same, to a circuit board and to an electronic instrument.
In recent years, with the increasing compactness of electronic instruments, the development of multichip modules incorporating a plurality of semiconductor chips at high density is proceeding. With a multichip module, since an existing plurality of semiconductor chips can be used, the cost can be reduced compared with the design of a new integrated circuit.
However, conventional multichip modules have used wire bonding to connect interconnect pattern of a substrate to the electrodes of the semiconductor chip. As a result, the interconnect pattern requires bonding pads for the wires, and therefore the area of the substrate is increased, preventing the required compactness of the package from being fully achieved.
The present invention solves this problems, and has as its object the provision of a compact semiconductor device incorporating a plurality of semiconductor chips at high density and a method of manufacturing the same, of a circuit board and of an electronic instrument.
(1) A semiconductor device of the present invention comprises:
a plurality of semiconductor chips having electrodes, and aligned in a horizontal direction for face-down bonding;
a substrate on which an interconnect pattern is formed, the interconnect pattern having bonding portions to which the electrodes of the semiconductor chip are connected, and lands to which the bonding portions are electrically connected; and
external electrodes provided on the lands.
According to this aspect of the present invention, a plurality of semiconductor chips is aligned in a horizontal direction and mounted on a substrate. Each semiconductor chip is subjected to face-down bonding. Since the bonding is carried out within the region where the semiconductor chip is mounted, the area of the substrate can be kept to the minimum required. As a result, the semiconductor device can be made more compact.
(2) In the semiconductor device:
the external electrodes may be disposed within mounting regions of the semiconductor chips.
By means of this, external electrodes can be provided corresponding to the electrodes of the semiconductor chip, within the region where each semiconductor chip is mounted.
(3) In the semiconductor device:
the external electrodes may be disposed outside regions where the semiconductor chips are mounted.
By means of this, the external electrodes can be aligned on the periphery of the substrate.
(4) In the semiconductor device:
the substrate may be a flexible substrate and is formed to be larger than the regions where the semiconductor chips are mounted, and a flat support member may be provided on a periphery of the substrate.
By means of this, even if a flexible substrate is used, the uniform height (coplanarity) of the external electrodes can be assured by means of the flat support member.
(5) In the semiconductor device:
the external electrodes may be disposed within a region where any one of the semiconductor chips is mounted.
By means of this, all of the external electrodes can be provided within the region where any one of the semiconductor chips is mounted, and no external electrodes can be provided within the region where any other semiconductor chip is mounted.
(6) In the semiconductor device:
the substrate may be a flexible substrate and part of the substrate is bent; and
a surface of the one semiconductor chip, which is disposed at a region where the external electrodes are provided, opposite to a surface on which the electrodes are formed may be adhered to a surface of at least one remaining semiconductor chip opposite to a surface on which the electrodes are formed.
Since on the semiconductor chip another semiconductor chip is adhered, the size of the semiconductor device in the horizontal direction can be reduced.
(7) In the semiconductor device:
the substrate may have at least one hole formed along a region to be bent.
By forming the hole in the substrate, the resilience of the substrate can be reduced, and the bent state can be more easily maintained.
(8) In the semiconductor device:
the hole may be a slot extending along a bending line;
the interconnect pattern may be formed to pass over the hole; and
an edge of the slot extending along the bending line may form a part of an outer edge.
Since a part of the outer edge of the semiconductor device is formed by an edge of the slot, the edge of the semiconductor device can be positioned accurately.
(9) In the semiconductor device:
a plurality of the holes may be formed;
the interconnect pattern may be formed to pass over the plurality of holes; and
the plurality of holes may be slots extending along a bending line, and are aligned.
By means of this, the substrate may be made easier to bend. (10) In the semiconductor device:
the substrate may have a slit formed along a region to be bent; and
the substrate may be divided by the slit, and a gap may be opened up between opposing divided edges.
When the divided substrate is considered as a whole, it can be bent more easily.
(11) In the semiconductor device:
a joining member may be provided spanning the slit.
By means of this, the bent portion of the substrate can be supported by the joining member.
(12) In the semiconductor device:
a flexible resin may be provided on the interconnect pattern in the hole; and
the resin may be bent together with the substrate.
By means of this, the bent portion of the substrate can be supported by the resin.
(13) In the semiconductor device:
the semiconductor chips may be adhered by an electrically conductive adhesive or a thermally conductive adhesive.
When an electrically conductive adhesive is used, the electrical potential of the adhering surfaces of the semiconductor chips can be made the same. When a thermally conductive adhesive is used, cooling can be achieved by passing heat from the semiconductor chip which emits more heat to the semiconductor chip which emits less heat.
(14) In the semiconductor device:
a surface area of one of the semiconductor chips may be larger than a surface area of a remaining semiconductor chip; and
the external electrodes may be formed only in a region where the semiconductor chip having a larger surface area is provided.
By means of this, the largest possible region for providing the external electrodes can be assured, without going outside the surface area of the semiconductor chip.
(15) In the semiconductor device:
the electrodes of the semiconductor chips may be connected to the bonding portions by an anisotropically conductive material including conductive particles dispersed in an adhesive.
Since the bonding portions and electrodes are electrically connected by the anisotropically conductive material, a semiconductor device can be manufactured by a method of outstanding reliability and productivity.
(16) A method of manufacturing a semiconductor device of the present invention comprises:
a step of providing a substrate on which an interconnect pattern is formed, the interconnect pattern having a plurality of bonding portions and a plurality of lands electrically connected to the bonding portions, and providing a plurality of semiconductor chips having electrodes;
a step of providing anisotropically conductive materials including conductive particles dispersed in an adhesive at least on the bonding portions;
a step of positioning the electrodes over the bonding portions on the anisotropically conductive materials, and mounting the semiconductor chips over the substrate;
a step of applying pressure to at least one of the semiconductor chips and the substrate so that the bonding portions and the electrodes are electrically connected by the conductive particles; and
a step of forming external electrodes on the lands.
According to this aspect of the present invention, a plurality of semiconductor chips is mounted on the substrate, and the electrodes of the semiconductor chips and bonding portions are subjected to face-down bonding. Therefore, since the bonding is carried out within the region where the semiconductor chip is mounted, the area of the substrate can be kept to the minimum required. As a result, the semiconductor device can be made more compact.
Since the bonding portions and electrodes are electrically connected by the anisotropically conductive material, a semiconductor device can be manufactured by a method of outstanding reliability and productivity.
(17) In this method,
the substrate may be a flexible substrate and formed to be larger than the regions where the semiconductor chips are mounted; and
a flat support member may be provided on a periphery of the substrate.
By means of this, even if a flexible substrate is used, the uniform height (coplanarity) of the external electrodes can be assured. In the case where all of the external electrodes are provided outside the region where all of the semiconductor chips are mounted, the external electrodes can be provided on the region to which the flat support member is attached.
(18) The method may further comprise a step of bending a part of the substrate, after the step of mounting the semiconductor chips on the substrate, so that a surface of one of the semiconductor chips opposite to a surface where the electrodes are provided is adhered to a surface of another of the semiconductor chips opposite to a surface on which the electrodes are formed.
Since on the semiconductor chip another semiconductor chip is adhered, the size of the semiconductor device in the horizontal direction can be reduced.
(19) In this method,
the substrate may have at least one hole formed along a region to be bent.
In this way, by forming a hole in the substrate, the resilience of the substrate can be reduced, and the substrate can be made easier to bend.
(20) The circuit board of the present invention has the above described semiconductor device mounted.
(21) The electronic instrument of the present invention has the above described circuit board.

Semiconductor device and method manufacturing the same, circuit board, and electronic instrument


The present invention provides a portable device that can be used anywhere and that enables a golfer to improve putting performance, for training or entertainment purposes. The device has an electronic analyzing system comprising, in one embodiment of the invention, only three passive infrared sensors to accurately detect all the crucial movements of a putter head (or any other golf club) (e.g., squareness at impact, speed, distance) throughout the crucial portion of a swing at the virtual point of impact (or actual point of impact if a golf ball is used). The device further uses these sensors to capture information in tandem with preset and/or selectable features and options (e.g., stimp, slope, statistics, games) to supply a holistic approach to putting practice. The device may also be equipped with an accelerometer/inclinometer to instantly inform the user of the slope and drop of the ground on which the device is placed.

Throughout the age of golf, putting training has stayed in a primitive stage while tireless efforts have been made in developing tools and devices to improve all other aspects of the game. Many golfing simulators and training/practice systems enable golfers to practice drives and chip shots, but none of these address the specific and unique aspects of the real needs that golfers have to improve their putting abilities in a very reliable, simple and portable design.


In one embodiment a method of structuring a municipal bond issued by a credit issuer to a credit holder, comprising requiring the credit issuer to pay to the credit holder a fixed payment component; and requiring the credit issuer to pay to the credit holder a variable payment component that varies based on changes in a value of an ownership value characteristic which is associated with the municipal bond and wherein the ownership characteristic is selected from the group including: a) a general interest rate level; b) an exemption from a state tax; c) an exemption from a federal tax; d) a marginal state tax rate; e) a marginal federal tax rate; f) a credit rating of the credit issuer; g) a credit variation associated with a credit enhancer; h) a credit variation associated with a liquidity provider; and i) a supply/demand level for municipal bonds.

Municipal and non-municipal credits (such as loans, bonds, securities, or other obligations) traditionally include a number of ownership value characteristics. Further, each of these ownership value characteristics has associated therewith a potential risk and a potential benefit (hereinafter collectively referred to as "loss/gain potential").
With regard to traditional fixed rate bonds (e.g. traditional municipal fixed rate bonds), the bondholder typically assumes all of the loss/gain potential of each ownership value characteristic associated with the bond (that is, the bondholder traditionally assumes all of the risks and benefits of bond ownership). In issuing such fixed rate debt, an issuer typically pays its fixed rate bondholders a higher interest rate (versus non-fixed rate debt) to accept all of the risks and benefits of ownership of the debt. In essence, the issuer purchases insurance against these risks from its fixed rate bondholders. The compensation to the fixed rate bondholders includes both a higher fixed rate as well as the rights to the potential benefits associated with ownership of the debt.
On the other hand, with regard to traditional variable rate demand bonds ("VRDBs"), the issuer typically retains all of the loss/gain potential of each ownership value characteristic associated with the bond (that is, the issuer retains all of the risks and benefits of bond ownership). The interest rate on such traditional VRDBs is periodically reset to maintain the value of the bonds equal to par, thereby causing the issuer to benefit from favorable market conditions and to bear the cost of unfavorable market conditions.
In any case, as seen in Table 1, a number of representative characteristics that generally affect the value of ownership of municipal debt (and the associated risks and benefits of ownership) include:
TABLE 1Representative Characteristics That Affect The Value ofOwnership of Municipal BondsCharacteristicRiskBenefitGeneral level of interestIncreasing ratesDecreasing ratesratesExemption from state taxDecrease in marginalTax increasetax rate or repeal ofexemptionCredit of issuerImprovement in creditCredit deteriorationCredit of credit enhancerImprovement in creditCredit deteriorationCredit liquidity providerImprovement in creditCredit deteriorationSupply and demand forIncrease in supply orDecrease in supplymunicipal bondsdecrease in demandor increase indemand
By issuing traditional fixed rate debt, an issuer may essentially fully hedge each of the above characteristics (i.e., the issuer fixes both the cost and the benefit derived from the bond issuance). In contrast, by issuing traditional variable rate demand debt, an issuer may essentially retains all of the loss/gain potential of each ownership value characteristic associated with the bond.

Method of structuring a credit entailing a fixed payment component and a variable payment component


Methods and apparatus to model on/off states of media presentation devices based on return path data are disclosed. An apparatus includes a distribution generator to: generate a first cumulative probability distribution indicative of actual durations of panel tuning segments; and generate a second cumulative probability distribution indicative of modeled durations of modeled tuning segments, the modeled tuning segments corresponding to modified lengths of the panel tuning segments. The apparatus also includes an RPD tuning information analyzer to analyze RPD tuning information reported from an RPD device. The apparatus further includes a set-on time calculator to estimate a set-on time for a media set associated with the RPD device, the set-on time indicative of a period of time when the media set is powered on, the set-on time estimated based on the RPD tuning information and the first and second cumulative probability distributions.

Many people access media through set top boxes (STBs) or other media presentation devices provided by media content providers (e.g., cable media providers, satellite media providers, etc.). Some STBs are equipped to report tuning information indicative of the media accessed by the STBs back to the content providers. Tuning information reported back to content providers via STBs or other similar devices is sometimes referred to as return path data (RPD). RPD tuning information may be used by audience measurement entities to track or monitor people's exposure to media.
The figures are not to scale. Wherever possible, the same reference numbers will be used throughout the drawing(s) and accompanying written description to refer to the same or like parts.


An amplifier with two parallel coupled amplifier units with inverse characteristics and in particular to the parallel coupling of a sourcing limited amplifier unit and a sinking limited amplifier unit.

Capacitive microphones (both electrets and MEMS types) require built-in buffer amplifiers in order to drive an external load. Traditionally source followers are used for this purpose. The advantages of the source follower are its simplicity, high input impedance, low output impedance, low noise, and the possibility to run on a low supply voltage with low current consumption.
Nonetheless the small signal output impedance, the current drive capability of the source follower is asymmetrical, meaning it can sink a large current from the output, but it can only source a predetermined current to the output, which value is set by the bias current. If the output of a source follower is loaded capacitively, the asymmetry of the source follower will cause non-linearity, which will express itself e.g. by demodulation of ultrasound. This effect will either impose a limit to the capacitive load, and thus limit the possibility of low-pass filtering of the microphone output, or requires a higher bias current setting.

Amplifier comprising two parallel coupled amplifier units


Formation of an interlayer is realized for a light-emitting device, the interlayer having properties of anticorrosion and adhesion to a silicone layer, thus preventing incidence of cracking during a baking process. The light-emitting device includes a light-emitting element covered with the silicone layer, and the interlayer is provided between the light-emitting element and the silicone layer. The interlayer is formed of a mixture of a tri-functional polysiloxane and a tetra-functional polysiloxane.

In recent years, a technique for achieving a white light-emitting device has been widely used, in which a fluorescent material like YAG (yttrium aluminum garnet) phosphor is placed in the vicinity of a blue LED (Light-Emitting Diode) chip based on gallium nitride (GaN). In such a white light-emitting device, white light is created as a color mixed of the blue light emitted by the blue LED chip with the yellow light emitted in secondary emission by the phosphor, which has received the blue light. In addition, another type of technique for generating white light as a mixed color is also employed in which the blue light emitted by the blue LED chip is mixed with the red light and the green light that are emitted as secondary emission by phosphors of the respective colors, in receipt of the blue light.
Such a white light-emitting device has various applications. For example, there is a demand that the device be used as replacements for fluorescent lights and incandescent lamps. Such application is now further extending to lighting devices like headlights for automobiles, which require very high brightness.

Light-emitting device having an interlayer of a polysiloxane mixture


A removable LED track light device has a plurality of LED light-units that fit within track means. At least one LED element(s) fits within the LED light-unit's geometric construction such that electrodes of the LED light unit are connected via conductive mean, resilient conductive means, contact means, to bus means that supply electric signal from an AC or DC power source, with circuit means, switch means, sensor means, timer means, and/or control means being included to provide desired light functions for illumination. The LED-units have a geometric construction and space to allow element(s) to be fixed in position or incorporated with reflector means. The LED light-units may also be incorporated bracket means to arrange the LED element assembly away from the LED light-unit base. Hanging means or another electric device also can be added onto the LED light-unit or LED light device to provide even more practical extra functions.

This application has subject matter in common with U.S. patent application Ser. Nos. 12/073,889 ("LED track light device"); 12/073,095 ("LED light with changeable position with Preferable power source"); 12/007,076 ("LED light with changeable geometric system"); 12/003,691 ("LED light with changeable geometric dimension features"); 12/003,809 ("LED light with changeable features"); 11/806,711 ("Multiple LED light with adjustable angle features"); 11/527,631 ("LED Night light with interchangeable display unit"); 11/498,881 ("Poly Night light"); 11/255,981 ("Multiple light source Night Light"); 11/094,215 ("LED Night light with Liquid optics medium"); 11/092,741 ("Night light with fiber optics); 10/883,747 ("Fiber Optic light kits for footwear"); 11/498,874 ("Area Illumination for LED night light") 11/527,628 ("Time Piece with LED night light"); 11/527,628 ("Multiple Function Night light with Air Freshener"); 11/806,284 ("LED Night light with more than one optics mediums"); 11/806,285 ("LED Night Light with multiple function"); and 11/806,711 ("Multiple LEDs Light with adjustable angle function").
The current invention is related to a removable LED light device made up of a plurality of LED-Units situated within a track means such that the LED-Units can change position along the track means when people move the said LED-units.
The current invention has a simpler construction than the lighting devices disclosed in copending application Ser. Nos. 12/007,076, 12/003,809, 11/806,711, 11/806,285, 11/806,284, 11/527,628, 11/527,629, 11/498,874, 11/527,631, 11/498,881, 11/255,981, 11/184,771, 11/152,063, 11/094,215, 11/092,742, and 11/092,741, listed above.
The current invention also is related to a removable LED light device having track means with bus-means to electric signals from a power source and change the power source electric signals using circuit means to trigger the LED-unit's LED or LEDs for desired light performance. Each said LED-unit has a desired LED or LEDs that fit into the LED-unit along with conductive means, resilient conductive means, and contact-means to obtain moveable LED-units that can freely move within the track means and are always connected with the bus-means to deliver the electric signals to the LED or LEDs.
The current track light device has the following 10 features that are also included in the light device of co-pending application Ser. No. 12/073,889 10 features, as well as 14 additional features listed below.
The original 10 features are:    1. The light device includes easy-to-replace LED-units.    2. A user can add or reduce the LED-units at any time.    3. A user can easily replace batteries when using a DC power source.    4. A user can easily plug the electric plug into a wall outlet adaptor when using an AC power source.    5. The track means has space to arrange the DC or AC power source and related parts neatly in a compartment.    6. The LED-units may optionally incorporate rotating means to enable the light beams to be adjusted over an angle of 360 degrees (as also disclosed in co-pending application Ser. No. 11/806,711 and other related copending applications listed above)    7. The LED-units may optionally incorporate hanging means to add more practicality and value to the current invention, the hanging means optionally also having an adjustable angle for different installations.    8. The circuit means may incorporate an Integrated Circuit to provide desired light functions currently available on the market or to incorporate sensor means, motion sensor means, photo sensor means, and/or mechanical or electric switch means to make the LED light device more practical and improve the life of the consumer.    9. The material of the track means material may be selected from a bendable, cuttable material so as to allow a consumer to be make the track means shorter to fit into a limited space.    10. All LED-units may be arranged in-parallel to facilitate adding or reducing the desired number of LED-units because the LED's element power consumption is very low and there is therefore no need, unlike the case of a halogen bulb, for each unit to carry its own circuit and transformer, which is way too risky since the unit may fall off and kill people from a high location—the LED track light can use a bus means with an LED trigger current which is a safe and low current and voltage so that there will be no harm to people.
The current invention additionally adds the following features:    11. The bus-means can be designed to provide a super compact track means and incorporate a super small or miniature LED light unit to allow people to apply the current invention to a tiny space or area.    12. The light device can have an outer groove to add a joint-piece having a geometric shape that enables a plurality of the LED track light devices to be put together to form a unit having a desired length, shape, and size to fit into a certain space, and the joint-piece can connect the plurality of LED track light devices into linear, curved, vertical, L-turn, Y-turn, or any other desired geometric configuration.    13. The LED light unit can have different designs for contact-means with desired mechanical construction to allow people to easily add or remove the said LED light units from the ends or from any position of the track means.    14. The each LED light unit can have different constructions to install a desired number of the LED elements, contact means and related parts to enable the said LED light unit(s) to be easily removed from and added into the track means.    15. The track light device may have a plurality of switch or sensor means to allow people to turn on a desired number of the LED light units—for example, the whole system can have one central switch and sensor means to turn on and off the system under pre-determined conditions or each LED light unit or group of LED light unit(s) can individually have additional switch or sensor means that can turn on and off the light unit or group of the LED light unit(s) according to a user's desire.    16. The LED light unit(s) can fit within the track light device from ends or anywhere along the track means.    17. The LED light unit(s) can have a base that fits within the track means and has a desired geometric design in which the LED element(s) and related parts and accessories arranged into a matrix, line, or any other arrangement and number of LED elements located in three dimensions on top of the said LED light unit's base.    18. The bus-means and track means can be any geometric shape as long as the distance to fit the said LED light unit(s) is the same.    19. The LED elements may be installed on a desired surface incorporated with a bar, tube, flexible tube, or bendable tube to allow the LED elements' light beam to be seen in desired areas.    20. The LED elements, LED light unit, bus means, track means, and/or light device can be any size to fit into different locations and spaces such as in a kitchen, bed room, laundry room, toilet, garage, patio, garden, living room, bus, car, airplane, boat, airport, hospital, restaurant. The size can be enlarged to any size, and can also be reduced to a desired miniature size for small area illumination.    21. The power source, batteries, AC adaptor, AC plug and related accessories can be designed to fit into a desired compartment which may be anywhere in the said track light device or LED light device as required, for example at two ends or in the back of the track light device or removable LED light device.    22. The bus means can be arranged anywhere on the track light or removable LED light device.    23. The said LED track light or removable LED light device can be designed as a picture frame light to offer a light and hanging device for all restaurants to use.    24. The LED track light or removable LED light device may be arranged to form a super strong hanging device that can support a desired weight with differing hook lengths and hook location.
All the 10 features originally described in co-pending applications and the 14 features described herein can make a big improvement in a consumer's life and become a universal LED light device for people to use in their house, kitchen, under cabinet, bath room, garage, wash room, closet, stair, front door, garden, swimming pool, spa, patio, public area, stair, bus, van, car, boat, or airplane, or any place that needs a good light fixture with super low power consumption, or green energy-saving light fixtures.
The current track light device has the following preferred construction.
At least one of LED-units is a arranged within a track means with position, location changeable features.
The LED-units have a geometric design, shape, and construction to fit within the track means and allow light to be emitted in a desired direction for area illumination.
At least one LED element fits within the LED-unit and the element's electric terminals connect with conductive means, resilient conductive means, contact-means, and bus means to deliver electric signals from a preferred power source and circuit means to the poles.
The afore-said construction further may include the following improvements:
At least one pair of bus-means are arranged within the track means to deliver electric signals from a power source and circuit means to the element's poles for illumination exhibiting a predetermined function, duration, brightness, colors, and/or performance.
The track means has a geometric shape, design, and dimensions to provide space to arrange the power source, circuit means, bus means, and related parts to supply the electric signal from an alternating current (AC) or direct current (DC) source.
The track light device can be installed on a main object's surface by conventionally available attachment means.
The LED-units may include optional rotating means to adjust each light beam to emit in a desired direction for area illumination.
The LED-units or track light device may be incorporated with hanging means to add other functions.
The current invention may further have wider application to encompass different light means including an incandescent bulb, fluorescent lamp, halogen bulb, electro-luminescent elements, cold cathode tube, and any other conventional light means available from the marketplace which has the same function or equivalent functions as the LEDs or LED-units to offer illumination to all people, with geometric shape, size, and dimension changeable features the orientation, position, etc. of each said light means to be changed.


An apparatus, system, and method are disclosed for preserving cluster level serialization during file server serialization reinitialization. The apparatus includes a permission request module, a cluster negotiation module, and a completion notification module. The permission request module communicates a permission request to a remote file server in anticipation of a reinitialization of a local file server. The cluster negotiation module implements a reinitialization protocol on the remote file server during the reinitialization of the local file server. The completion notification module notifies the remote file server when the reinitialization of the local file server is complete. The apparatus, system, and method beneficially facilitate continued serialization negotiation among the remote file servers during the reinitialization of the serialization data on the local file server and, thereby, preserve the integrity of shared data resources.

1. Field of the Invention
This invention relates to file servers and more particularly relates to preserving cluster level serialization while reinitializing serialization data in a file server in response to a serialization failure.
2. Description of the Related Art
Serialization of a plurality of data access requests can be extremely complicated for data storage devices that are shared among multiple-processor file system servers. Serialization of the data access requests involves defining which applications are connected to which storage devices, or portions thereof, and what kind of access is provided for each application. For example, some applications are given exclusive access rights for certain write operations, while others may not receive exclusive access. Also, some applications may receive shared access rights for certain read operations on the shared data storage devices. By defining which applications are allowed which type of access at which times, the file system servers are able to prevent many data operation errors that would otherwise occur.
However, serialization techniques are not perfect and a serialization implementation may fail. A serialization failure may occur when read or write access to a requested data file or directory is not made available to a requesting application. For example, a serialization failure may occur when two applications are requesting data access rights to data that is exclusively assigned to the other application.
FIG. 1a shows one example of an application environment 10 in which a serialization conflict might occur. In particular, the illustrated application environment 10 includes a first application 12 and a second application 14. The first application 12 has exclusive rights (as shown by the solid arrow 16) to a first data file 18. Likewise, the second application 14 has exclusive rights (as shown by the solid arrow 20) to a second data file 22.
FIG. 1a also shows the first application 12 requesting access rights (as shown by the dashed arrow 24) to the second data file 22. Likewise the second application 14 may request access rights (as shown by the dashed arrow 26) to the first data file 22. In this case, a serialization "deadlock" failure occurs when neither the first application 12 nor the second application 14 can progress until the requested access rights are granted, but the requested access rights cannot be granted because the requested data files 18, 22 are already in use by the non-requesting applications 12, 14. When this type of serialization failure occurs, the file system server (not shown) may become nonresponsive and thereby unavailable because the applications 12, 14 continue to hold onto their existing access rights while requesting the additional access rights.
Although an internal serialization failure, by itself, does not compromise either the integrity of the data stored in the data files 18, 22 or the run-time states of the in-flight applications 12, 14, such a serialization failure can have drastic effects on the file system server. For instance, a serious serialization failure may occur where the file system is central to an operating system, such as when the ability to load programs from a file system is necessary for basic operating system functions. Furthermore, serialization failures can result in operating system outages, which can cause the failure of all in-flight application processing, including processing that is not directly related to the corresponding file system. Additionally, serialization failures may lead to excessive costs due to file system server downtime that impacts business-critical applications.
With regard to file system serialization failures, the conventional focus is on correcting the underlying causes of all serialization problems. However, this solution is practically infeasible given the complexity of contemporary multitasking, multiprocessing, and clustering environments in which the number of possible serialization problems and causes is overwhelming.
Because conventional serialization management schemes typically solve serialization failures by restarting the file server, conventional techniques also fail to address how to maintain cluster level serialization data during the reinitialization of the file server. Rather, conventional serialization management schemes allow open file connections and other resource connections to fail while the file server is down. Furthermore, conventional serialization management schemes fail to recognize and preserve continuing data access rights of the file server that is being reinitialized.
From the foregoing discussion, it should be apparent that a need exists for an apparatus, system, and method for preserving cluster level serialization data during file server serialization reinitialization in a manner to overcome the disadvantages of conventional technology. Beneficially, such an apparatus, system, and method would preserve data access rights of the reinitialized file server while the file system serialization information is reinitialized. Additionally, such an apparatus, system, and method would be advantageous over conventional systems and methods providing automated reinitialization negotiation among the file servers within a cluster without risking the integrity of shared data resources within the cluster.

Apparatus, system, and method for preserving cluster level serialization during file server serialization reinitialization

International Business Machines Corporation


An overhead LED light fixture including a base member with a vertical sleeve secured to the top of the base member for alignment with a pass-through opening. The fixture has a driver-tray assembly with a bottom member engageable with the base member at the pass-through opening, a vertical driver-support structure extending upwardly therefrom, at least one driver secured to the support structure, and the driver-tray assembly is slideably received within the vertical sleeve. When used as a canopy light, the driver-tray assembly is removable from below the canopy to facilitate servicing, upgrading or replacing of components.

In describing the overhead light fixture of this invention and its advantages, particular reference will be made to what is referred to as canopy light fixtures; however, the inventive apparatus and method are more generally applicable to overhead lighting fixtures and in some cases to light fixtures in other mounting locations, orientations and positions.
Canopy-mounted light fixtures ("fixtures") are often used to provide lighting in areas such as service stations, drive-through facilities such as banks, and other outdoor lighting environments which are generally lighted from above, often high overhead. A great variety of canopy-mounted light fixtures have been developed. Some examples of such prior art fixtures are those disclosed in the following United States patents: U.S. Pat. No. 7,572,038 (Kinnune, et al.), U.S. Pat. No. 6,561,670 (Jongewaard, et al.), U.S. Pat. No. 6,116,749 (Quiogue, et al.), U.S. Pat. No. 5,997,158 (Fischer, et al.), U.S. Pat. No. 5,927,843 (Haugaard, et al.) and U.S. Pat. No. 5,662,407 (Fischer, et al.).
Some of the canopy-mounted light fixtures of the prior art, when in their use positions, are above, rather than below the generally horizontal planar structure which forms the sealing of the canopy. Such planar structure will be referred to herein as the "canopy sheet." Such member is most typically sheet metal, but may be of other materials. Above-sheet positioning of light fixtures is often deemed preferential from a design point of view. In other words, what appears overhead may be simply a rectangular or circular light emission area, rather than a bulky light fixture structure.
Such canopy-mounted light fixtures of the prior art often have certain shortcomings and disadvantages related to servicing. When such light fixtures are positioned primarily above the canopy sheet, servicing may be particularly difficult and time-consuming. This invention addresses such shortcomings and disadvantages.
It would be desirable and economically advantageous to be able to easily service and replace functioning elements of the overhead light fixture, such as replacing or servicing LED drivers, while retaining the fixture in place above the canopy sheet. Some efforts have been directed toward this goal, but there remains a need for a low-cost and very easily serviceable overhead light fixture of this type, including overhead LED light fixtures.

Overhead light fixture and related method


A respirator with an eye space (16), through which the air to be inhaled flows, and with an indicator located on a support for indicating the efficiency of the protective device on the respiration connection, which is to retain the pollutant from the environment. The pollutant indication takes place both in the case of leakages at the sealing zones of the mask or the respiration gas-carrying lines (compressed air respirator) and in the case of insufficient filter effect. To achieve this, the support (10) is arranged on an inner half mask (3) of the respirator, and an access surface, which is exposed to the pollutant and contains the indicator (18, 118), is in flow contact with the air being inhaled, which flows through the passage openings (12, 112) between the eye space (16) of the full mask (1) and the inner half mask space (4).

The above mentioned type of respirators are used for supplying respiration gas for persons who have to work or stay in an atmosphere that is hazardous for breathing. The air to be inhaled is purified or freed from the pollutant via a filter, or respiration gas is supplied into the respirator from a bottle-type reservoir via a flexible tube. In the case of respirators with a filter, indicators are arranged on or in the filter, and they either indicate the depletion of the filter material or the breakthrough of pollutants, so that the user of the mask will be warned or is able to replace the filter in time. Even though monitoring of filter devices is eliminated in compressed-air respirators, it is just as important to monitor the full facepiece mask for sealed fitting on the face part of the mask user in order to recognize whether leaks, which make it possible for pollutant-loaded ambient air to enter the air to be inhaled, occur at the sealing edge. In this sense, the term "respiration connection" can be considered to denote both the filter connection and the tube connection for a compressed air-operated respirator or for the full facepiece mask itself.
In a prior-art full facepiece mask according to DE-PS 962,313, a colorimetric indicator is provided in the interior space of the mask, and it indicates the passage of harmful components from the environment into the interior space of the mask by a detection reagent arranged on a support changing its color in the presence of the pollutant being monitored. However, this prior-art mask has the disadvantage that it is dependent on the site of application of the indicator, insofar as passage due to leakage or depletion of the filter is indicated, depending on whether the air to be inhaled also flows past the indicator. The respiration air is routed, especially in respirators with inner half mask, such that passage openings with corresponding check valves, through which the air to be inhaled flows, are provided between the outer space of the mask and the inner space of the mask. In an air stream thus directed, the prior-art indicator is usually located in the flow shadow, and it permits only inaccurate indication of pollutant passing through at best.

Respirator with inner half mask and pollutant indicator


A method of refining a petroleum product to remove aromatics and to separate paraffinic oils and waxes is provided. The method involves the utilization of phase equilibria wherein crystallized or solidified waxes, normally present in the petroleum product, are used to remove oils from a liquid solvent phase containing dissolved aromatics present in the unrefined petroleum product. The wax containing the oils is separated from the aromatic-containing solvent and is further processed to separate the waxes and oils. For petroleum products containing little, if any, wax, additional wax may be added and recycled back for further use in removing oils from the petroleum product. The method has particular application in preparing lubricating oils having a high viscosity index, where the presence of aromatics and wax can be detrimental.

This invention relates to a method of refining petroleum products, and in particular, to a method of refining petroleum products by the use of solvent extraction.
Solvent extraction used in petroleum refining is typically used in refining or upgrading various petroleum distillates and deasphalted oil. The presence of aromatic fractions is often undesirable, because such compounds often tend to oxidate or thermally degrade. With respect to diesel and other fuels, government regulations may limit the presence of aromatics. Aromatics also have poor viscometric properties, which is particularly important with respect to the production of lubricating or lube oils. For lube oils, the property of the lube oils that are most often used to indicate lube quality with regard to aromatics is the viscosity index (VI). Oils with high VI (95 or greater) are generally considered acceptable. Oils with a VI below 95 are usually considered inferior. Extracting the aromatics from these oils increases the VI of the oil. As presented herein, viscosity indices are determined pursuant to ASTM D2270.
Typical solvent extraction processes used in the refining of petroleum products and distillates utilize highly polar solvents. These solvents may include such things as phenol, furfural and NMP (N-methyl-pyrolidone), with NMP being the most recently developed solvent system presently in use for removing aromatic compounds. These solvents are highly selective for aromatics and various polar-compounds, but are less selective for saturated hydrocarbons, such as paraffins and cycloparaffins. The aromatic products removed during extraction can be used in fuels production or in specialized applications requiring high aromaticity.
The prior art solvent extraction techniques are usually carried out in a continuous flow process in which the solvent and petroleum product feed stream are maintained in the liquid phase and in countercurrent contact. The solvent is typically recovered, with the aromatics being removed, and the solvent is recycled back into the solvent feed stream. The solvent extraction is usually carried out at elevated temperatures that are well above ambient. Typically, these temperatures are from about 100xc2x0 F. to 250xc2x0 F. The elevated temperatures facilitate the flow of the petroleum products, which may contain wax, as well as increase the solubility of the aromatics in the solvent. At these elevated temperatures, however, saturates (i.e. paraffins and cycloparaffins), which may be either oils and/or waxes, may also be extracted by the solvent, resulting in lower yields of these products.
Crude petroleum and partially refined petroleum commonly contain waxes (usually paraffin waxes). These waxes crystallize or solidify at cooler temperatures. This is particularly notable with higher molecular weight n-paraffins, certain branched or iso-paraffins, and cycloparaffins. When petroleum is being refined for use as a lubricating oil, the presence of these materials, which crystallize within the range of temperatures for which the lubricating oils are used, is very deleterious. Thus, these materials are commonly removed in the refining process, which is oftentimes referred to as xe2x80x9cdewaxing.xe2x80x9d Therefore, after extraction, dewaxing of the petroleum products is usually carried out to improve the oil""s low temperature properties.
While conventional solvent refining or extraction techniques may be adequate for many applications, improvements are needed. In particular, extraction techniques that require less energy and processing equipment, and that result in higher purity and greater yields is highly desirous.
A method of refining a petroleum product is carried out by providing an unrefined petroleum product containing a first petroleum fraction and a second fraction to be separated, and wherein the first petroleum fraction has a melt point temperature. The unrefined petroleum product contains an amount of extractant, with the extractant having a freezing point temperature that is greater than the melt point of the first petroleum fraction.
The unrefined petroleum product is at a temperature at or above its pour point temperature so that the extractant is substantially liquefied. The first petroleum fraction is substantially dissolved within the liquefied extractant. A solvent is admixed with the unrefined petroleum product, with the second fraction being soluble within the solvent so that the second fraction is dissolved therein, and wherein the extractant is substantially insoluble within the solvent.
The mixture of unrefined petroleum product and solvent is brought to a temperature at or below the freezing point temperature of the extractant so that the extractant containing the dissolved first petroleum fraction is crystallized, while the solvent containing the dissolved second fraction remains in a liquid phase.
The crystallized extractant containing the dissolved first petroleum fraction is then separated from the liquid phase.
In another embodiment, a petroleum product is refined by providing an unrefined petroleum product containing a first petroleum fraction and a second fraction to be separated. The first petroleum fraction has a melt point temperature, and wherein the unrefined petroleum product contains an amount of extractant with a freezing point temperature that is greater than the melt point of the first petroleum fraction.
The unrefined petroleum product is at a temperature at or above its pour point temperature so that the extractant is substantially liquefied, with the first petroleum fraction being substantially dissolved within the liquefied extractant. A first solvent in which the second fraction is soluble is admixed with the unrefined petroleum product so that the second fraction is dissolved within the first solvent, with the extractant being substantially insoluble within the first solvent.
The mixture of unrefined petroleum product and first solvent is brought to a temperature at or below the freezing point temperature of the extractant so that the extractant containing the dissolved first petroleum fraction is crystallized, and the first solvent containing the dissolved second fraction is in a liquid phase. The crystallized extractant containing the dissolved first petroleum fraction is then separated from the liquid phase.
After this separation, a second solvent is admixed with the crystallized extractant and first petroleum fraction, with the first petroleum fraction being soluble within the second solvent. The first petroleum fraction is then separated from the crystallized extractant, and wherein the first petroleum fraction may be further separated from the second solvent.
In still another embodiment of the invention, a method of preparing lubricating oil from a petroleum product is provided. This is accomplished by providing a petroleum product containing a lubricating oil fraction and a second fraction to be separated from the lubricating oil. The lubricating oil fraction has a melt point temperature, and the petroleum product contains an amount of extractant, with the extractant having a freezing point temperature that is greater than the melt point of the lubricating oil fraction.
The petroleum product is at a temperature at or above its pour point temperature so that the extractant is substantially liquefied, with the lubricating oil fraction being substantially dissolved within the liquefied extractant. A first solvent in which the second fraction is soluble is then admixed with the petroleum product so that the second fraction is dissolved within the first solvent, with the extractant being substantially insoluble within the first solvent. The mixture of petroleum product and first solvent is brought to a temperature at or below the freezing point temperature of the extractant so that the extractant containing the dissolved lubricating oil fraction is crystallized and the first solvent containing the dissolved second fraction is in a liquid phase. The crystallized extractant containing the dissolved lubricating oil fraction is then separated from the liquid phase.
A second solvent is then admixed with the crystallized extractant and lubricating oil fraction, with the lubricating oil fraction being soluble within the second solvent so that the lubricating oil fraction is dissolved within the second solvent. The lubricating oil fraction and second solvent is then separated from the crystallized extractant. The lubricating oil fraction is then separated from the second solvent to provide a lubricating oil.

Solvent extraction refining of petroleum products


Circuit data on a semiconductor integrated circuit, design constraints as to design of the semiconductor integrated circuit, air gap information on air gap creation in the circuit data, and an air gap volume constraint specifying an allowable range for an air gap volume value are received. The sum total of the values of the volumes of air gaps created in the circuit data according to the air gap information is calculated. Upon detection that the calculated sum total of the air gap volume values falls outside the allowable range specified by the air gap volume constraint, the circuit data is optimized so that the design constraints are satisfied and the sum total of the air gap volume values falls within the allowable range.

The present invention relates to techniques for semiconductor integrated circuit design process, and more particularly relates to design of a semiconductor integrated circuit having air gaps formed therein, support of the design of the semiconductor integrated circuit, and calculation of wiring parasitic capacitance in the design process of the semiconductor integrated circuit.
As miniaturization of semiconductor fabrication processes has been advanced, the spacing between signal wires in a semiconductor integrated circuit has been narrowed to increase the resulting wiring parasitic capacitance between the signal wires. As a result, the adverse effects of wiring delay and cross talk noise, which cause the design period to be extended and the performance to be degraded, can no longer be ignored.
In order to reduce the wiring parasitic capacitance between signal wires, there has been an air gap producing technique, in which air gaps are formed between the signal wires. In the "air gap" structure, air gaps are formed in an insulating film between wires. This structure allows the insulating film to have a lower dielectric constant than conventional ones, thereby enabling the wiring parasitic capacitance between the signal wires to be reduced.
Such air gap producing methods were disclosed in Japanese Examined Patent Application Publication No. 7-114236 (Patent Document 1) and in Japanese Laid-Open Publication No. 7-326670 (Patent Document 2). In the methods disclosed in these patent documents, a CVD process or a sputtering process are used to form air gaps in part of an insulating film between wires in a semiconductor integrated circuit. The part where the air gaps are formed and the volume of the air gaps are limited by the space between the wires. Specifically, if the space between wires is large, no air gaps can be formed therebetween. Also, Japanese Patent No. 348122 (Patent Document 3) proposed a technique for creating air gaps by controlling the spacing between wires.
To reduce the wiring parasitic capacitance between wires in a semiconductor integrated circuit, it is desired that many air gaps be created. However, if too many air gaps are present in a semiconductor integrated circuit, resistance to thermal and mechanical stresses may decrease, and if the locations and volumes of created air gaps are uneven in the chip, irregularities may occur in the chip.
In designing a miniaturized large-scale semiconductor integrated circuit, the designing must be performed in such a manner that various kinds of constraints not only as to air gaps but also as to delay, area, fabrication rules, etc. are satisfied. These constraints must be taken into account throughout the entire design process of the semiconductor integrated circuit. The constraints on air gaps thus also have to be considered throughout the entire design process of the semiconductor integrated circuit.
Nevertheless, the disclosed methods only show how to create air gaps in the fabrication process of a semiconductor integrated circuit, and no designing methods have been disclosed in which air gap formation is taken into account in the design process (such as a logic synthesis process and a layout process) of a semiconductor integrated circuit.

Method for designing semiconductor integrated circuits having air gaps.


Processing schemes and arrangements for the amine treatment of high olefin content (e.g., ethylene-rich) carbon dioxide-containing streams such as for the effective separation and removal of carbon dioxide therefrom are provided. Corresponding or associated processing schemes and arrangements for the catalytic cracking of a heavy hydrocarbon feedstock and obtaining light olefins substantially free of carbon dioxide via absorption-based product recovery are also provided.

This invention relates generally to hydrocarbon processing and, more particularly, to the processing of hydrocarbon-containing materials having a high light olefin content, such as produced or formed in or by the cracking of a heavy hydrocarbon feedstock.
Light olefins serve as feed materials for the production of numerous chemicals. Light olefins have traditionally been produced through the processes of steam or catalytic cracking of hydrocarbons such as derived from petroleum sources. Fluidized catalytic cracking (FCC) of heavy hydrocarbon streams is commonly carried out by contacting a starting material whether it be vacuum gas oil, reduced crude, or another source of relatively high boiling hydrocarbons with a catalyst such as composed of finely divided or particulate solid material. The catalyst is transported in a fluid-like manner by transmitting a gas or vapor through the catalyst at sufficient velocity to produce a desired regime of fluid transport. Contact of the oil with the fluidized material catalyzes the cracking reaction.
The cracking reaction typically deposits coke on the catalyst. Catalyst exiting the reaction zone is commonly referred to as being "spent", i.e., partially deactivated by the deposition of coke upon the catalyst. Coke is comprised of hydrogen and carbon and can include, in trace quantities, other materials such as sulfur and metals such that may enter the process with the starting material. The presence of coke interferes with the catalytic activity of the spent catalyst. It is believed that the coke blocks acid sites on the catalyst surface where the cracking reactions take place. Spent catalyst is traditionally transferred to a stripper that removes adsorbed hydrocarbons and gases from catalyst and then to a regenerator for the purpose of removing the coke by oxidation with an oxygen-containing gas. An inventory of catalyst having a reduced coke content, relative to the spent catalyst in the stripper, hereinafter referred to as regenerated catalyst, is collected for return to the reaction zone. Oxidizing the coke from the catalyst surface releases a large amount of heat, a portion of which escapes the regenerator with gaseous products of coke oxidation generally referred to as flue gas. The balance of the heat leaves the regenerator with the regenerated catalyst. The fluidized catalyst is continuously circulated between the reaction zone and the regeneration zone. The fluidized catalyst, as well as providing a catalytic function, serves as a vehicle for the transfer of heat from zone to zone. FCC processing is more fully described in U.S. Pat. No. 5,360,533 to Tagamolila et al., U.S. Pat. No. 5,584,985 to Lomas, U.S. Pat. No. 5,858,206 to Castillo and U.S. Pat. No. 6,843,906 B1 to Eng, the contents of each of these patents are hereby incorporated herein by reference. Specific details of the various contact zones, regeneration zones, and stripping zones along with arrangements for conveying the catalyst between the various zones are well known to those skilled in the art.
The FCC reactor serves to crack gas oil or heavier feeds into a broad range of products. Cracked vapors from an FCC unit enter a separation zone, typically in the form of a main column, that provides a gas stream, a gasoline cut, light cycle oil (LCO) and clarified oil (CO) which includes heavy cycle oil (HCO) components. The gas stream may include dry gas, i.e., hydrogen and C1 and C2 hydrocarbons, and liquefied petroleum gas ("LPG"), i.e., C3 and C4 hydrocarbons, also sometimes commonly referred to as wet gas.
As a result or through such hydrocarbon cracking processing, byproduct species such as CO2, H2S and other sulfur compounds may form or otherwise be present in the FCC effluent in undesirably high relative amounts. In the past, amine units have been used to separate species such as CO2 from hydrocarbon stream materials. In typical amine systems, an amine solvent such as methyl diethanol amine [MDEA] is used to absorb or otherwise separate CO2 from hydrocarbon stream materials. A stripper is typically subsequently used to strip the absorbed CO2 from the amine solvent, permitting the reuse of the stripped amine solvent.
In view of an increasing need and demand for light olefins such as ethylene and propylene for various petrochemical uses such as for the production of polyethylene, polypropylene and the like as well as the desire to produce relatively less of heavier olefins such as butylenes and pentenes which are generally less desirable as gasoline blending components due to environmental considerations, it may be desired to practice the cracking reaction processing of heavy hydrocarbon feedstock to increase the relative amount of light olefins in the resulting product slate.
Research efforts have led to the development of an FCC process that produces or results in greater relative yields of light olefins, i.e., ethylene and propylene. Such processing is more fully described in U.S. Pat. No. 6,538,169 B1 to Pittman et al., the contents of which are hereby fully incorporated herein by reference. As disclosed therein, a hydrocarbon feed stream can desirably be contacted with a blended catalyst comprising regenerated catalyst and coked catalyst. The catalyst has a composition including a first component and a second component. The second component comprises a zeolite with no greater than medium pore size wherein the zeolite comprises at least 1 wt. % of the catalyst composition. The contacting occurs in a riser to crack hydrocarbons in the feed stream and obtain a cracked stream containing hydrocarbon products including light olefins and coked catalyst. The cracked stream is passed out of an end of the riser such that the hydrocarbon feed stream is in contact with the blended catalyst in the riser for less than or equal to 2 seconds on average.
As with conventional FCC processing, byproduct species such as CO2, H2S and other sulfur compounds may form or otherwise be present in the resulting effluent in undesirably high relative amounts. However, whereas conventional FCC processing effluent streams typically have little if any olefin content, the such modified hydrocarbon processing desirably produces or results in an effluent stream having a significantly large olefin content. With standard amine system treatment of such large olefin content effluent streams, some of the olefin material is typically co-absorbed with the CO2 in or by the amine solvent. Such co-absorption of olefin material undesirably reduces the amounts of light olefins available for recovery from such processing.
Moreover, in conventional amine treatment processing, the amine solvent containing the absorbed CO2 is typically subjected to further processing such as through a stripper wherein the absorbed CO2 can desirably be separated from the amine solvent and the amine solvent can be recycled and reused for amine treatment of a selected carbon dioxide-containing stream. Unfortunately, during such subsequent stripper processing of the amine solvent, the presence of such olefin materials can lead to polymerization. Such polymerization can lead to degradation of the amine solvent and require expensive off-site reclamation processing.
Thus, there is a need and a demand for processing and arrangements for increased effectiveness for the separation and removal of carbon dioxide from high olefin content process streams.
More particularly, there is a need and a demand for improved amine treatment processing arrangements and processing schemes of such high olefin content process streams such as for the effective separation and removal of carbon dioxide therefrom while desirably permitting increased or improved olefin recovery.

This patent is subject to a terminal disclaimer.

Amine treatment in light olefin processing


A vehicle braking force control device for executing a follow-up (or servo) control of braking force for individual wheels is improved for canceling the difference of braking force between left and right wheels especially during transient condition of braking force variation due to the difference of input-output response characteristics in braking force generating apparatuses and components associated therewith in a braking system. In the inventive control device, a relation between actual values of braking force on left and right wheels, such as the difference between braking force or pressure values on the left and right wheels, is fed back to these braking force generating apparatuses through the modification of target barking force or pressure values. The modification amounts of the target values may be determined so as to keep appropriate braking force distribution among front and rear wheels.

1. Field of the Invention
The present invention relates to a device for controlling brakes of a vehicle such as an automobile, and more specifically, to such a device that executes follow-up (or servo) control of braking force or braking pressure for individual wheels of a vehicle.
2. Description of Prior Art
Electronic controlled braking (ECB) systems are being commonly employed in modern vehicles such as automobile, establishing braking force balance or distribution for providing an appropriate driving condition. In these ECB systems, braking force on individual wheels are servo-controlled. Namely, an electronic controller first determines target values of braking force or braking pressure (in a hydraulic system) for individual wheels, taking into account actual running conditions in the vehicle such as wheel speeds, the vehicle's behavior, as well as a braking action of the driver. Then, under the control of the controller, braking force generating apparatuses for the wheels are operated to generate braking force or pressures so as to follow up the respective target values. In order to bring actual braking force or pressure values for individual wheels in conformity with the corresponding target values, the actual values are fed back to the inputs of the respective braking force generating apparatuses so as to modify the inputs for canceling any deviation of the actual value from the corresponding target value, as well known in the art (feedback control). Examples of devices of ECB type are seen in Japanese Laid-Open Patent Publications (JP) Nos. 2000-247219 and 2002-187537. Such a system is often referred to as brake by wire (BBW) control system because a demand for controlling braking force is transmitted through electrical harness from an input device responding to braking action by a driver, e.g. a brake pedal, to braking force generating apparatuses for the respective wheels.
In practical ECB systems, braking force generating apparatuses and/or components in a hydraulic circuit of a braking system associated therewith, such as flow metering valves, have differences in input and output response characteristics within tolerances, hindering the accurate controlling of braking force on the individual wheels and/or braking force distribution. As mentioned above, a deviation of an actual braking force or pressure value for each wheel from the corresponding target value, if any, can be cancelled through the feedback control of braking force individually executed for each wheel. This feedback process, however, is not instantaneous. Until the actual value reaches to the target value, i.e. under transient condition, the rates of variation of the actual values can differ from one another among the wheels, dependent upon the response characteristics of the components in the braking system, resulting in undesirable difference of braking force or unwanted braking force distribution. In other words, in the controlling of braking force on individual wheels for an appropriate driving condition, the feedback strategy so far can not eliminate the effects of the tolerances under transient condition.
Accordingly, a braking force control device for a vehicle may be improved more appropriately for providing an appropriate driving condition, especially under transient condition (during the variation of braking force) in conjunction with the input-out response characteristics of braking force-generating apparatuses for wheels and/or components in a hydraulic braking circuit associated therewith.

Vehicle braking force control device with feedback communication between wheels


A computer implemented apparatus and method for transferring information from one set or sets of memory locations to another set or sets of memory locations. The present invention has particular advantageous use within a computer system specially implemented for pattern recognition applications, such as handwriting or voice recognition. The present invention includes a system with an automatic sequencer able to sequentially generate sequential source and destination addresses and able to generate appropriate data requests to internal and external memory controllers. The present invention memory to memory transfer unit allows memory transfer operations to occur in parallel with the operation of arithmetic pipelines that process pattern recognition procedures. Therefore, using the present invention, no additional processing time is consumed by a memory transfer. Double buffering is utilized to transfer information and process information in the same time frame.

1. Field of the Invention
The present invention relates to the field of memory transfers of information. Specifically the present invention relates to the field of memory to memory transfers of information within a computer system that may be specially adapted for pattern recognition applications.
2. Prior Art
The ability to store and accurately recognize patterns is a particularly good application for general computer systems. Computer systems offer the unique ability to process at high speeds specialized procedures and information formats that are developed for the field of pattern recognition. Using pattern recognition technology, a computer system can be advantageously utilized to respond to variable patterns of information (such as handwritten characters and voice) rather than rigid input devices, such as a keyboard input device. Using such technology, a computer system can be utilized to recognize visible patterns, such as pictures and video frame, or audible patterns, such as voice and other sounds, or movement patterns such as handwriting. Computer systems that process the vast amount of information required to perform pattern recognition applications must provide adequate mechanisms for rapid and efficient movement of information between memory devices. It would be advantageous, then, to provide a computer system with an efficient mechanism for transferring information quickly and without consuming valuable computation time which can be useful in conjunction with a pattern recognition system. The present invention offers such capability.
Typically, a library of reference or prototype patterns may be stored within the memory storage devices of a general purpose computer system implemented by software for pattern recognition. Each library pattern is further composed of many individual points or states that, in total, comprise the pattern representation; this format of points or states also constitutes an input unknown pattern or patterns. These known library reference patterns are then individually compared against the input patterns. The general purpose computer systems of the prior art are programmed to individually compare, point by point, or state by state, the individual components of a particular reference pattern to the individual components of the input unknown pattern. This continues for each reference pattern in the library of patterns involving a large amount of repetitive processing tasks and predictable movement of different information from memory store to memory store. For each pattern a match path is developed that indicates the level of identity between the unknown and the reference patterns. Reference patterns with good match paths are then selected by the computer system as candidates for a resultant match. The computer system then analyzes each of the reported candidates to determine which is best matched the unknown input pattern. It would be advantageous to provide an efficient system to rapidly transfer prototype information from a base or reference library into a working memory area for direct comparisons without consuming valuable processing time from execution units that perform the unknown pattern to reference pattern comparisons. The present invention offers such advantageous capability.
Heretofore, data cache systems have been employed for more efficient data access to and from predetermined destination and source addresses. Although cache memory transfer systems may operate advantageously in some applications, they are not necessarily effective in the realm of pattern recognition applications particularly in the area of information transfer of reference patterns and results between alternate memory stores. This is the case because data cache systems take advantage of the fact that often the same information is accessed sequentially and this often reused information may be stored in a special memory ("cache") for quick access over and over again. In other words, a cache based system exploits data "locality" where data is used and stored in a special location to be used over again. However, in the area of pattern recognition, the unknown information pattern is rarely duplicative of a prior unknown pattern. And if possibly duplicative, the occurrence is very rare and would never justify the complexity of a data cache. Furthermore, each of the reference libraries, by definition, are different and therefore a cache would not contribute greatly to the processing efficiency of transferring such reference patterns. There would be no reason to include duplicate reference patterns within the same library. Each of the library reference patterns are unique and thus add more intelligence to any pattern recognition system that utilizes the library. Further, since the input comparison information is not similar from pattern to pattern, the results of these comparisons are not duplicative either. These results must be transferred from the recognition engine to some alternative or temporary storage area. Therefore, since the information transfers involved within pattern recognition systems are not duplicative, and the same data is not constantly reused, a data cache system does not offer advantageous capabilities within this environment.
It would be advantageous to provide a memory transfer capability that would provide rapid and efficient transfer of information that may not be related sequentially or duplicative in any way, while not consuming valuable processing time. The present invention offers such capability. It would further be advantageous to offer such a system within a pattern recognition system. The present invention offers such functionality.
Accordingly, it is an object of the present invention to provide a memory transfer system for transferring information from one set or sets of memory locations to another set or sets of memory locations in an efficient and rapid method. It is further an object of the present invention to provide such a memory transfer operation within a general purpose computer system that is specially optimized for pattern recognition applications. It is further an object of the present invention to provide a memory to memory transfer system that can efficiently transfer pattern information that may not be related sequentially or duplicative in any way (i.e., pattern information that does not have the property of data locality). It is further an object of the present invention to provide such a memory transfer system that does not consume valuable computer processing time that is being used in a pattern recognition procedure for comparing a set of values representative of an unknown pattern to sets of values representative of reference patterns. It is an object of the present invention to provide a memory to memory transfer system that integrates to a pen based computer system to provide a more efficient system for handwriting recognition. It is an object of the present invention to provide a memory to memory transfer system that integrates to a general purpose computer system to provide a more efficient system for voice recognition. It is further an object of the present invention to provide a memory to memory transfer capability that may be substantially programmer controlled rather than hardware controlled (such as a cache unit).

Memory transfer apparatus and method useful within a pattern recognition system


A method for manufacturing a semiconductor device comprises forming a laser marking, forming a trench pattern, forming a metal interconnection layer, removing a predetermined portion of the metal interconnection layer, and planarizing the metal interconnection layer. The laser marking is formed in a first region of a wafer, and the first region has a first width from an edge of the wafer. The trench pattern is formed above the wafer except for above the first region. The metal interconnection layer is formed above the wafer where the laser marking and the trench pattern are formed. The predetermined portion of the metal interconnection layer is removed, and the predetermined portion has a second width from the edge of the wafer equal to or greater than the first width. And the metal interconnection layer above the wafer where the trench pattern is formed is planarized to a predetermined thickness.

Generally, a laser marking is formed in the wafer so as to identify wafer.
Referring to FIG. 1, a laser marking 20 is formed at an edge portion of a wafer 10. As a semiconductor device is highly integrated, the number of metal layers also increases. Thus, the depth D of the laser marking 20 increases so as to identify each metal layer even when all processes of forming the metal layers are carried out. When a laser is used to form the laser marking 20, a protrusion 22 is formed as a by-product of forming the laser marking 20 and the height H of the protrusion 22 also increases.
Referring to FIG. 2, after forming the laser marking 20 on the wafer 10, a plurality of trench patterns 40 are formed over an entire area of the wafer 10 except an area ranging from an edge of the wafer 10 to a first distance D1 by using a wafer edge exclusion (WEE) of a trench photo etch process (PEP) of a Damascene process.
Next, a copper film is formed on an entire surface of the wafer 10 to fill the laser marking 20 and each trench region 40.
Then, the copper film 30 disposed from the edge of the wafer 10 to a second distance D2 is removed using an edge bead removal (EBR) process.
An object of the EBR process is to remove a predetermined edge portion of the wafer 10 using chemicals, because several contamination problems are caused by the formation of the copper film 30 at the edge portion of the wafer 10.
However, as illustrated in FIG. 3A, a defect is caused by the protrusion 22 as a by-product of forming the laser marking 20. The defect results from a Cu belt formed by an interval between a trench WEE and EBR in a dual Damascene process. If the trench WEE is smaller than the EBR, an unfilled trench pattern collapses during the planarization process and the collapsed unfilled trench pattern serves as a particle source. Therefore, to prevent this phenomenon, the trench WEE is set to be greater than EBR.
Accordingly, if the Cu belt exists in a region encountering the laser marking 20, a step between the protrusion 22 and the trench pattern 40 increases. Thus, there occurs a problem that the Cu film 30 is peeled off in a planarization process.

Method for manufacturing semiconductor device