A liquid crystal display apparatus which prevents illumination of light by non-uniform brightness from a fluorescent lamp employed for the backlight illumination which is caused by mercury enclosed in the fluorescent tube being deposited on the inner surface of the tube of the fluorescent lamp. The liquid crystal display apparatus comprises a liquid crystal display panel, a backlight apparatus including a fluorescent lamp disposed on the rear face side of the liquid crystal display panel for directing illuminating backlight upon the liquid crystal display panel, and a reflecting plate disposed remote from the liquid crystal display panel with respect to the fluorescent lamp. The reflecting plate has a plurality of ventilating holes formed at portions of a recessed portion thereof opposing to an outer periphery of the fluorescent lamp.

1. Field of the Invention
This invention relates to a display apparatus having a liquid crystal display panel, and more particularly to a liquid crystal display apparatus wherein a backlight apparatus in the form of a fluorescent lamp is disposed on the back face side of a liquid crystal panel so that the liquid crystal panel is illuminated by the backlight apparatus.
2. Description of the Prior Art
A display apparatus which makes use of a liquid crystal display panel is advantageous in that a television receiver can be constructed with a reduced thickness comparing with another television receiver which makes use of a CRT (cathode ray tube). Due to the advantage, television receivers making use of a liquid crystal display panel have been put into practical use. When a television receiver of the type including a liquid crystal display panel is constructed as a television receiver of the reflecting type, there is a drawback that it is so low in brightness that an image thereon cannot be observed clearly. Therefore, a display apparatus has been proposed wherein a backlight apparatus in the form of a fluorescent lamp is disposed on the rear face side of a liquid crystal panel and backlight from the backlight apparatus is distributed uniformly by a diffusing plate so that it may illuminate the liquid crystal display panel uniformly.
A display apparatus of the type wherein a fluorescent lamp is employed as a backlight apparatus, however, has a drawback that, as time passes, drops of mercury are deposited on the inner surface of the tube thereof and make the brightness thereof non-uniform. In particular, there is a drawback that mercury enclosed in the fluorescent lamp is condensed and deposited and locally stricks to the inner surface of the tube of the fluorescent lamp and decreases the brightness at the portions of the tube at which the mercury sticks. While the brightness of the tube is made more uniform to some degree by the diffusing plate, if the amount of mercury sticking to the tube increases, then the illumination upon the liquid crystal display panel becomes non-uniform.

Backlight apparatus having ventilating holes for liquid crystal display


A gas turbine moving blade steam cooling system in which leakage of steam for cooling a moving blade is prevented and thermal stress at a blade root end portion is mitigated. Each end portion of a blade root portion (3) of the moving blade (1) is projected so as to form a projection portions (4a, 4b). A steam passage 5 is provided between the projection portions (4a, 4b) and a steam supply port 5a and a steam recovery port (5b) are provided downwardly with the respect to the steam passage 5. The steam supply port (5a) connects to a steam supply passage (20) and the steam recovery port (5b) connects to a steam recovery passage (21). Steam is supplied from the steam supply port (5a) into a blade interior and is recovered through the steam recovery port (5b). Side surface seal plates (6, 7 and 8) are provided for preventing steam leakage. The steam cools the moving blade (1) and can be recovered without leakage and stress concentration due to heat at the projection portions (4a, 4b) of the blade root end portion.

1. Field of the Invention
The present invention relates to a gas turbine moving blade steam cooling system, and more specifically to a structure thereof which is able to prevent strength reduction of blade root portion and also to prevent steam leakage.
2. Description of the Related Art
FIG. 8 is a cross sectional view of a prior art gas turbine interior and shows flows of cooling air in a moving blade portion. In FIG. 8, numeral 50 designates a stationary blade, numeral 51 designates an outer shroud and numeral 52 designates an inner shroud. Numeral 60 designates a moving blade, which is fixed to a blade root portion 62 of a turbine disc 61 and rotates between stationary blades 50.
In the prior art gas turbine so constructed by the stationary blade 50 and the moving blade 60, the moving blade 60 is cooled by air which is a part of rotor cooling air. That is, there is bored a radial hole 65 in the blade root portion 62 and the rotor cooling air 100 is introduced into each disc cavity 64 to be further introduced into a lower portion of a platform 63 via the radial hole 65 and then is supplied into the moving blade 60.
FIG. 9 is a cross sectional view of a moving blade portion and a stationary blade portion of the gas turbine shown in FIG. 8. In FIG. 9, numeral 50 designates a stationary blade, which has an outer shroud 51 and an inner shroud 52 as well as an air pipe 53 extending in a blade height direction and passing through the blade interior. Seal air 110 is fed through the air pipe from the outer shroud 51 side into a cavity 54 so that pressure in the cavity 54 is made higher than that in a combustion gas passage and the seal air 110 further flows through a hole 57 and is partially discharged from a passage 56 so that a high temperature gas is prevented from coming therein. Numeral 55 designates a labyrinth seal, which is also for sealing the high temperature gas.
As for the cooling air for the moving blade 60, the mentioned rotor cooling air 100 is introduced into the disc cavity 64 to be further introduced into a shank portion 66 of a lower portion of the platform 63 via a radial hole 65 which passes through the interior of a rotor disc blade root portion 62 and then is supplied into a cooling air passage in the moving blade 60. Further, in place of using a portion of the rotor cooling air, it takes place also that air from a compressor is cooled by a cooler and is introduced into a disc cavity 64.
As mentioned above, the conventional process of cooling the gas turbine blades is air cooling and, especially for the moving blades, a portion of the rotor cooling air is introduced so as to be used for cooling thereof. In recent years, a steam cooling method is being developed in order to effect steam cooling of the rotor system, and it is imperative to employ such a structure that steam leakage is prevented sufficiently and the blade root portion, in which steam passages are provided, may adequately withstand thermal stress.
Further, in the case of air cooling, there occurs a lot of air leakage when the cooling air enters the moving blade from the disc which results in a loss of cooling air, while, in the case of steam cooling of the moving blade, there is no such loss of cooling air but if the steam escapes, a large amount of steam on the boiler side is lost which affects the performance greatly.
Also, in the moving blade of the air cooling method, there occurs stress concentration at a through hole portion of the radial hole between the blade root portion and a blade base portion so as to be affected by thermal stress. Hence, in order to employ steam cooling, it is necessary to consider a structure which avoids the stress concentration.

Gas turbine moving blade steam cooling system


Disclosed is an abnormality determination device capable of checking for abnormal particulate matter detection by a particulate matter detection sensor. The particulate matter detection sensor 10 includes a sensor element section 12, which comes into contact with particulate matter in exhaust gas in an exhaust pipe 6 of an internal combustion engine 2, and changes its output in accordance with the amount of particulate matter attached to the sensor element section 12. A heater for the particulate matter detection sensor 10 is capable of heating the sensor element section 12 to a particulate matter elimination temperature (T3) at which the particulate matter attached to the sensor element section 12 is eliminated from the sensor element section 12. An ECU 50 determines, in accordance with output changes (S1 to S4) occurring in the particulate matter detection sensor 10 during heater control, whether or not the particulate matter detection sensor 10 is abnormal.

For use in an exhaust emission control system having a DPF (Diesel Particulate Filter) and a PM sensor for detecting the amount of particulate matter (hereinafter may be referred to as the PM) in exhaust gas, a fault determination device for determining whether the PM sensor is faulty is conventionally known as disclosed, for instance, in JP-A-2010-275977. More specifically, a conventional technology applied to this fault determination device is used in a configuration in which the PM sensor is installed downstream of the DPF in an exhaust pipe, and determines, in accordance with a change in a PM sensor output prevailing after regeneration of the DPF, whether the PM sensor is faulty.
When the PM collection performance of the DPF is normal, the DPF can collect the PM in the exhaust gas. In other words, an extremely small amount of PM flows downstream of the DPF as far as the DPF's PM collection performance is normal. Even if an attempt is made to check whether the PM sensor generates a normal output in accordance with the arrival of the PM at the PM sensor, it is virtually difficult to perform such a check when an extremely small amount of PM flows downstream of the DPF.
As such being the case, the above conventional technology notes the fact that the PM collection performance is temporarily degraded during a certain period after the regeneration of the DPF, and determines whether the PM sensor is faulty by checking an output of the PM sensor during the period during which the PM collection performance is degraded. In other words, as a certain limit is imposed on the amount of PM collected by the DPF, it is necessary to recover the DPF's PM collection performance by regenerating the DPF as needed. According to the JP-A-2010-275977, the DPF's PM collection performance is temporarily degraded immediately after the above-mentioned DPF regeneration process is performed. While the PM collection performance is degraded, the amount of PM flowing downstream of the DPF is larger than while normal PM collection performance is exhibited. Whether or not the PM sensor is faulty can be determined by checking an output of the PM sensor during the period during which the PM collection performance is degraded.

Device for detecting particulate matter in exhaust gas


The present invention involves a preparation adapted for prophylaxis and treatment of oral lesions. The preparation is suitable for use as an oral lavage, and comprises water, hydrogen peroxide in a premixed aqueous form in the preparation mixture, with between about 0.1% and about 0.4% sodium bicarbonate. To produce such a preparation adapted for the prophylaxis and treatment of oral lesions most preferably involves dissolving hydrogen peroxide and sodium bicarbonate in an aqueous solution to produce a premixed preparation having between about 0.1% and about 0.8% hydrogen peroxide and between about 0.1% and about 0.4% sodium bicarbonate. In more preferable embodiments of the present invention, the oral lavage (formulation) includes hydrogen peroxide at a concentration of about 0.4% and sodium bicarbonate at a concentration of about 0.2%. Additionally, a method for prophylaxis and treatment of oral lesions incident the use of chemotherapeutic agents is included in the present invention. This method involves the step of initially providing a premixed preparation comprising water, between about 0.1% and about 0.8% hydrogen peroxide and between about 0.1% and about 0.4% sodium bicarbonate. Oral rinsing with said preparation, particularly multiple daily oral rinsing, is shown to enhance healing of oral lesions and impedes or prevents the development of oral lesions.

The present invention relates to a composition and method of prophylaxis and treatment for oral mucosal lesions. Oral lesions of various forms may develop in many circumstances and conditions. These forms of oral lesions include, for example, ulcerations, infections, stomatitis and vesiculo-bullous lesions. Among the most acute of these oral lesions are those typically occurring as an incident to cancer chemotherapy. These chemotherapy-related lesions may be so painful and severe as to force cessation of the chemotherapy, as well as eating and drinking, which may interfere with medical treatment. The lack of a consistent, effective and convenient method of prophylaxis and treatment for such oral lesions has too long been a therapeutic handicap.
Certain antineoplastic drugs have well documented direct and indirect stomatotoxicity. The direct toxicity is characterized by the interruption of the migrating, maturing squamous cells from the basal cell layer to the oral mucosal surface. As this normal progression is attenuated and desquamation of surface cells continues, it may be clinically manifested as oral mucosal ulcerations. Acute and severe pain may be associated with this ulcerative process at its developmental peak. Patients have discontinued their chemotherapy due to this complication. Such cessation means that the full chemotherapy protocol cannot be delivered and thus, the patient may not be provided the best therapeutic effect. Control or cure of the cancer may be lost. The patient and family are then placed in an emotional struggle between gaining relief from the oral pain and simultaneously realizing that in doing so the cancer may continue to progress.
The indirect stomatotoxic effects are related to alteration of the hematologic status through myelosupression and the patient's subsequent decreased ability to resist infections and hemorrhage. Oral infections increase the overall morbidity of cancer chemotherapy. If these infections are not discovered early and treated aggressively, they may be lethal following their systemic dissemination. Oral hemorrhaging may occur spontaneously and be profuse. Such incidents are terribly distressful to the patient, family and the professional care team. Fatal exsanguination has been reported.
Currently, antineoplastic drug therapy is being used with 40% of cancer patients either as a single treatment modality or as part of multi-modal therapy (chemotherapy, surgery, radiation). Some cancers respond well to single agent chemotherapy and others are treated with several agents in combination. New combinations and single agents are used in investigational clinical trials. The oral toxicity must be identified for all of these new agents and new combinations. Data show that nearly 50% of all individuals receiving chemotherapy will develop oral complication, most notably oral lesionary distinct in anatomical distribution and physical characteristics form other oral maladies resultant of fungal agents, bacteria and nutritional deficiencies. These complication include stomatitis, infection and hemorrhage Of this 50% incidence rate, 33% will develop one complication, 10% two complications and 3-4% will develop all three.
There is a plethora of scientific reports describing the multiple and varied oral complications as sequelae to cancer chemotherapy. Great detail has been used to describe these clinical entities. To a lesser degree, the scientific literature offers explanations for the pathogenesis of these oral lesions. Treatment protocols for these sequelae are more sparse and varied. Their development seems to be more empiric than scientific. An extensive literature search and a preliminary survey of some of the major cancer treatment centers in North America indicate that no treatment is presently available to prevent or significantly attenuate these oral complications. Clearly, there is a need for a proven, safe, comfortable and effective method and material to address this widespread and difficult problem.

Prevention and treatment of oral lesions


A return fuel cooling system for LPI vehicle having an engine and a bombe connected to each other through a fuel supply line and a fuel return line in the LPI vehicle using LPG fuel to cool high-temperature LPG fuel returning from the engine to the bombe, may include a heat exchanger mounted on the fuel return line, a bypass line connecting upstream and downstream of the fuel return line, wherein the heat exchanger may be interposed between the upstream and the downstream of the fuel return line to make the LPG fuel returning to the bombe bypass the heat exchanger and supply the LPG fuel to the bombe, and a valve included at a portion in which the fuel return line and the bypass line is connected, and selectively opening or closing the fuel return line connected with the heat exchanger according to a temperature of the bombe.

1. Field of the Invention
The present invention relates to a return fuel cooling system for an LPI vehicle and a control method thereof, and more particularly, to a return fuel cooling system for an LPI vehicle for preventing pressure of a bombe from increasing by efficiently cooling LPG fuel returning from an engine and controlling flow of the returning LPG fuel according to an operation state of an air conditioning unit, and a control method thereof.
2. Description of Related Art
In general, a liquefied petroleum injection (LPI) engine means an engine driven by a mono-fuel method in which a fuel pump is installed inside a bombe, LPG fuel is liquefied at a high pressure (5 to 15 bar) by the fuel pump, and liquefied fuel is sprayed for each cylinder by using an injector, contrary to a mechanical LPG fuel method dependent on pressure of a bombe.
Since the LPI engine sprays liquefied fuel, a vaporizer and a mixer which are constituent components of a mixer type of LPG engine are not necessary, and includes a high pressure injector, a fuel pump installed in the bombe, a fuel supply line, an LPI dedicated electronic control unit (ECU), a regulator unit for adjusting fuel pressure, and the like.
The electronic control unit of the LPI engine receives input signals of various sensors to determine a state of the engine, and controls the fuel pump, the injector, and an ignition coil in order to achieve an optimum air-fuel ratio and improve engine performance.
Further, the electronic control unit of the LPI engine controls the fuel pump according to the amount of fuel demanded by the engine to supply liquefied fuel to the engine, and the LPI injector sequentially sprays the fuel for each cylinder to implement an optimum air-fuel ratio.
However, in a vehicle to which the LPI system in the related art is applied, high-temperature return fuel returns to the bombe from the engine, a phenomenon in which internal pressure of the bombe increases according to an increase in a temperature of the LPG fuel. Especially, when the internal pressure of the bombe is higher than charging pressure of a charging station, there is a problem in that the LPG fuel is not charged in the bombe.
Accordingly, it is necessary to install a separate fuel cooling apparatus in order to lower a temperature of the fuel returning from the engine, so that manufacturing and installation costs increase and there is a limit in securing an installation space inside a narrow engine room.
The information disclosed in this Background of the Invention section is only for enhancement of understanding of the general background of the invention and should not be taken as an acknowledgement or any form of suggestion that this information forms the prior art already known to a person skilled in the art.

Return fuel cooling system for LPI vehicle and control method thereof


A semiconductor system including a semiconductor circuit configured to compare a first error detection code generated by performing an operation on read data to a second error detection code and determine a data transmission error, and a controller configured to provide the second error detection code, generated by performing an operation on expect data based on the read data, to the semiconductor circuit.

1. Technical Field
Various embodiments relate to a semiconductor circuit, and more particularly, to a semiconductor system.
2. Related Art
Due to various causes including noise introduced into a transmission line, an error may occur in data transmitted between a first device (for example, a semiconductor circuit) and a second device (for example, a controller to control the semiconductor circuit or a tester for testing the semiconductor circuit).
Thus, there is a demand for a method for checking and detecting whether or not the data was or is being normally transmitted between the two devices.

Semiconductor system with error detection


A method for manufacturing a reinforced cementitious columnar structure comprising: (a) providing a mold having a cavity which corresponds to a shape and size of the columnar structure; (b) filling the cavity with dry coarse particulates to form a formed dry body comprising 50-90 volume percent coarse particulates having a particle size between about 1 and 60 mm so as to form a core volume; (c) introducing a slurry of cementitious material containing an amount of fine material which has been determined beforehand, the fine material having a particle size smaller than the size of interstitial voids of the coarse particulates into the core volume, the fine material and the cementitious material filling the core volume and the cementitious material infiltirating and encapsulating the coarse particulates, and the fine material remaining within the core volume; (d) curing the slurry of cementitious material to form the reinforced cementitious columnar structure; and (e) separating the mold from the reinforced cementitious columnar structure.

A number of processes for producing a lining on the inner walls of a metallurgical vessel are known. Thus, for example, there is known, according to French Patent 2,393,637, a process in which an aqueous and pasty mixture capable of setting, containing inorganic particles, optionally fibers, and an organic and/or inorganic binder, is applied by molding, tamping or projecting with the trowel or pneumatic or other projecting to the inside of a metallurgical vessel such as a casting tundish. The mixture of particles sinters in contact with the liquid metal, and this ensures the cohesion of the lining.
According to French Patents 2,585,273, 2,613,256 and 2,619,323 there is also known a process according to which at least two layers of different compositions are applied to the inside of the metallurgical vessel, each being applied by projecting an aqueous and pasty mixture capable of setting of the above-mentioned type.
These processes, which otherwise give the users complete satisfaction, nevertheless present a disadvantage: at least all the wetting water employed for forming the aqueous mixture(s) must be removed by drying, and this involves an immobilization time and an expenditure of energy, neither of which can be ignored.
There is also known a process according to which a template is placed inside a metallurgical vessel, a material consisting of refractory particles and of a heat-curable binder is projected pneumatically between the template and the inner walls of the vessel, and heating is then applied while the template is left in place to cause the binder to set, and the template is finally removed. The cast material contains an inorganic compound containing water of crystallization.
It is also known that refractory bodies can be made by casting of refractory concretes either by vibration casting of a wet concrete or by vibration-free casting the concrete having a self-flowing consistency. In both approaches, all concrete materials need to be homogeneously mixed and wetted.
Mixing of concrete in a homogeneous way which has very fine and coarse particles is difficult to achieve and needs high energy mixing equipment. In case of vibration casting, the used molds have to be strong enough to withstand vibration. When casting more complicated linings, i.e., steel ladles, the casting has to be done in separate steps. The bottom of the ladle can be cast; and before the mold for the wall can be introduced, the castable has to reach sufficient mechanical strength.
Producing castables of highly porous materials by conventional vibration of vibration-free casting requires large quantities of mixing water (in excess of 15%) due to the fact that the mixing water fills up the open pores of the material. A high mixing water content in the castable means very long dry-out times and poor mechanical strength.
In order to increase thermal shock resistance, fibrous materials have been used in vibration and self-flowing materials. The use of fibrous materials increases the need for high levels of mixing water and makes casting more difficult. Very coarse materials which are beneficial for slag resistance due to their high density can only be used to a certain extent, because casting of concretes with a very high content of coarse materials is very difficult.
The aim of the present invention is to overcome the disadvantages of the known processes and to propose a process which is simple, rapid and economical to employ and which is particularly well suited to the production of a lining of a metallurgical or glass vessel.
These and other objects and advantages of the present invention will be more fully understood and appreciated with reference to the following description.


A joint-use bracket (JUB) for installing multiple communication lines in a joint-use section on a utility pole is disclosed. The JUB includes a curved plate having a generally rectangular shape elongated in a longitudinal direction and curved along a lateral direction. The curved plate is formed to have one or more attachment holes, one or more slots, and multiple threaded receiving holes. The JUB also has multiple hooks formed contiguous to the front surface of the curved plate, each hook having a threaded through hole, wherein multiple bolts are associated with the multiple hooks, respectively. Each hook is configured to hold a wire or a cable through a D-shaped opening that is formed by the hook and the bolt when the bolt is screwed in through the threaded through hole to have the end portion engaged with the threaded receiving hole.

A utility pole is used to support power lines, electrical cables, fiber optic cables and related equipment. A standard utility pole in the United States is about 40 ft (12 m) long and is buried about 6 ft (2 m) in the ground, and can be made of wood, metal, concrete, or composites such as fiberglass. The power lines, including wires for power distribution and associated equipment, are typically mounted at the top portion of the pole, where the wires are mounted typically on a horizontal crossarm attached to the pole, and several pieces of power-distribution equipment, e.g., fuse cutouts, a lightning arrestor, a distribution transformer, etc., are mounted near the wires. Below the top portion of the pole designated for power lines, a vertical space along the pole is designated for supporting communication lines, examples of which include copper or fiber optic cables for telecommunication lines, coaxial cables for cable televisions, coaxial or fiber optic cables linking computer networks, etc. Utility poles may also carry other equipment such as streetlights, trolley wires, cellular network antennas, etc. In general, providers of electricity, television, telephone, streetlight, traffic signal and other services share poles, either in joint ownership or by renting space to each other, commonly referred to as "joint use."
A wide variety of pole attachment hardware are provided to secure the cables, wires, and individual pieces of associated equipment to the poles. Examples of these attachment devices include braces, bands, straps, guards, brackets, clamps, hooks, bolts, screws, anchors, etc. Design and implementation of these attachment devices must conform to strict standards and regulations, as compiled, for example, in Telcordia GR-3174, Generic Requirements for Hardware Attachments for Utility Poles, to facilitate reliable physical support, proper directional guiding to accommodate lateral stresses, safe grounding and isolation for electrical parts, and other mechanical and electrical provisions.
To mount an attachment device onto a pole, the pole itself must be configured to receive the attachment device in a secured fashion. For example, holes may be drilled in wood poles to fit the exact hardware needs and requirements. Fasteners such as bolts and screws can be easily applied to wood structures to fasten hardware pieces to wood poles. On the other hand, drilling holes in concrete poles is not feasible. In this case, bands or straps may be used to fasten hardware pieces onto concrete poles on site. Although it is possible to drill holes in steel poles or weld metal objects to steel poles, these processes are not recommended due to potential operational and practical hazards as well as economical disadvantages. Strapping or banding may be a feasible alternative to reliably fasten hardware pieces onto steel poles. Fiber-reinforced composite (FRC) poles can be pre-drilled, or holes can be drilled on-site. However, a certain type of fasteners such as lag bolts, teeth, nails, staples, and the like are unacceptable for FRC poles.
As explained above, mounting pole attachment hardware on already-built poles on-site requires careful considerations with respect to safety, feasibility, labor and cost, depending on the type of equipment to install as well as the type and location of the pole to be used for accommodating the equipment. It should be noted also that adding too many holes and objects to a pole will ultimately lead to structural weakness, a "mess" generated by tangled wires and loose pieces, and other functional and visual degradation. In some areas, the communication companies are making holes in existing poles and installing their communication lines haphazardly, occasionally too close to the power lines, creating a hazard for the power utility. With the advancement of communication technologies, it is expected that more and more providers of the Internet, telephone, and cable TV services will come into play and scramble for the limited space available on utility poles to install their own wires and equipment. In view of the above problems associated with the crowded utility poles with too many wires and equipment pieces, this document describes a new type of pole attachment hardware to reliably install multiple communication lines in an orderly fashion, which will help eliminate the troublesome interference between individual lines and mitigate structural damages to the utility poles.

Joint-use bracket for installing communication lines on utility pole


Large gas pockets in a crude oil transfer pipeline are detected and separated. As a large gas pocket forms, the liquid level drops (and the hydraulic head declines) in the export riser portion of the transfer pipeline, increasing the pressure required to transfer the fluid. Detection of the lower level and separation decreases the pressure required. Smaller gas pockets, which can be swept down the export riser portion, are not separated. The detecting and separating functions can be combined in a float-type gas vent valve, or separate gas detectors and gas vent valves can be used. The separated gas can be recombined with the crude oil, or used at an import platform, or separately transported to an on-shore facility. If the separated gas requires pressurization, a compressor-expander may be used to compress gas for flow in one direction and recover power from the expanding gas during flow in the other direction.

Offshore oil wells are typically drilled from offshore platforms anchored to the sea floor. Many wells produce oil or oil/water mixtures from an underground formation or reservoir without the need for pumping. Although the produced crude oil may be transferred from the offshore platform to tankers, a transfer pipeline is more commonly provided for moving the liquids to other platforms or shore facilities, e.g., for upgrading or refining. The export pipeline may directly transfer the oil to the shore facilities, or the produced oil may be transferred first to another platform, called an import platform, and then to the shore facilities from the import platform.
The transport pipeline normally comprises an export riser portion (e.g., extending from the outlet of the process equipment down towards the sea floor) and a transfer portion. The transfer portion typically extends along the sea floor from the lower end of the export riser to facilities on-shore or to an oil-importing platform. If the transport pipeline communicates to an importing platform, the pipeline also comprises an import riser extending from the transfer portion end up to the collection apparatus on the import platform.
Because the produced crude oil is frequently viscous and transfer distances may be long, transfer friction losses in the transfer pipeline (and associated backpressure) can be quite high. This increase in backpressure can inhibit the production performance of the well or require large and costly-to-operate transfer pumps. In addition, variable crude oil composition, temperature, and flowrates can also result in crude oil transfers over a wide range of supply, pipeline and outlet conditions, e.g. pressure and flowrate.

Gas eliminator for offshore oil transfer pipelines


A rib of an airplane wing is prevented from deforming due to a machining load when machining a rivet hole in parts where the rib and a skin are joined. With regard to a rib that provides a connection between first and second spars of the airplane wing, the rib is formed with mounting flanges secured to a skin via a rivet, a stringer through hole for a stringer to be positioned through, and first and second cutouts facing parts where the first and second spars and the skin are connected. Since reinforcing beads are formed along the mounting flanges and reinforcing flanges are formed so as to extend in the span direction from the edges of the stringer through hole and the first and second cutouts and be connected integrally to the mounting flanges, the stiffness of the rib toward a load in the vertical direction when drilling a rivet hole can be enhanced.

1. Field of the Invention
The present invention relates to an airplane wing structure having first and second spars extending in the span direction; a plurality of stringers disposed between the first and second spars and extending in the span direction; a rib extending in the chord direction and providing a connection between the first and second spars; and a skin covering the first and second spars, the stringer, and an upper face and a lower face of the rib.
2. Description of the Related Art
An airplane wing structure is disclosed in Japanese Patent Application Laid-open No. 2002-302097 or Published Japanese Translation (PCT) No. 2000-506816.
In general, a rib for defining the airfoil of an airplane wing is formed by press forming a thin plate material in order to lighten the weight. In addition, a stringer through hole is formed in an upper edge and a lower edge of the rib with a stringer fixed to an inner face of a skin of the wing and positioned through the stringer through hole via a gap. The wing is formed as a box structure that is resistant to bending or twisting by joining a spar, the stringer, the rib, and the skin, but when lift or drag acts on the wing, there is a possibility that the rib, which is formed from a thin plate material, will buckle due to the shear load. In the arrangements disclosed in Japanese Patent Application Laid-open No. 2002-302097 and Published Japanese Translation (PCT) No. 2000-506816, when press forming the rib, a bead extending in the vertical direction (wing thickness direction) is formed integrally with the rib, thereby enhancing the buckling strength of the rib toward a shear load.


A base for liquid crystal display, including a support board, a pivot device and a base seat. The bottom end of the support board is bent in accordance with the angle of the display. The upper end of the pivot device is connected with the lower end of the support board, while the lower end of the pivot device is connected with a rotary disc, whereby the pivot device can be inclined up and down and rotated left and right. The base seat is connected with the bottom end of the support board. The base seat is formed with receptacles for receiving accessories tidily. The display is connected on the support board, whereby by means of the cooperation of the support board, pivot device and the base seat, the display can be freely adjusted by any angle.

The present invention relates to a base for liquid crystal display, in which the base seat is formed with receptacles for tidily receiving accessories such as a transformer, a rectifier, etc.
A conventional base for liquid crystal display is merely used to support the display. In order to stably support the display, such base has a considerably large area and occupies much room. In cooperation with the display, many accessories such as a transformer, a rectifier, etc are used and placed randomly beside the display. This often affects the operation of the display.

Base for liquid crystal display having receptacle for accessories


In a liquid crystal display device the reflection of light from a transmissive region is reduced, the contrast of images is enhanced and a display of inverted images is suppressed. The liquid crystal display device includes a first background film made of silicon nitride and a second background film made of silicon oxide over a glass substrate, and thin film transistors and light transmissive pixel portions are formed over the second background film. Each thin film transistor is constituted of a polysilicon film, a gate electrode, a drain electrode and a source electrode, while a gate insulation film, an interlayer insulation film and an organic film are formed over the pixel portion. Further, in the liquid crystal display device external light is reflected, wherein by forming the first background film thicker than the second background film, the inversion of images of a transmissive type liquid crystal panel can be suppressed.

The present invention relates to a liquid crystal display device, and, more particularly, to a liquid crystal display device in which the contrast of an image is enhanced by preventing the reflection of external light.
A liquid crystal display device is used in a television receiver set, a personal computer, and as the display device for a portable terminal or the like. Since the liquid crystal display device is light in weight and exhibits a small power consumption, the liquid crystal display device is commonly used as a display device in a small electronic terminal, such as a mobile telephone or the like.
Further, since such a portable terminal is used outside of houses or buildings, a partial-transmissive-type liquid crystal display device is used. The partial-transmissive-type liquid crystal display device displays images by making use of external light when the outside environment is bright and displays images by making use of light from a backlight when the outside environment is dark (see Japanese Unexamined Patent Publication 350158/2001, for example). Further, even with respect to a liquid crystal display device which employs a full-transmissive-type panel, there is a liquid crystal display device which can produce a transmissive display which mainly uses light from a backlight and a reflective display which reflects light incident from an image observing side on a reflector of the backlight (see Japanese Unexamined Patent Publication 98960/2002 (paragraphs 0034 to 0043, FIG. 2 and FIG. 3) and Japanese Unexamined Patent Publication 98963/2002 (paragraphs 0001 to 0007, 0016 to 0017, FIG. 1, FIG. 3, FIG. 5, for example). Further, in many liquid crystal display devices, thin film transistors are used as switching elements.
Recently, to cope with the demand for a liquid crystal display device having a higher definition, the number of pixels of the liquid crystal display device has been increased. As a result of the increase in the number of pixels, thin film transistors which exhibit a high operational speed are required. In a liquid crystal display device having high definition polysilicon (polycrystalline silicon) is used in place of amorphous silicon as a semiconductor layer of the thin film transistor. With the use of polysilicon as the material of the semiconductor layer, the operational speed of the thin film transistor is increased, whereby images of high definition can be displayed.
Further, there is a known technique in which an upper-side background layer and a lower-side background layer are stacked on a glass substrate, laser beams are radiated to semiconductor thin films formed on the upper-side background layer, and the semiconductor thin films are crystallized (see Japanese Unexamined Patent Publication 132306/1994 (paragraphs 0002 to 0007, FIG. 1 to FIG. 4).
Usually, the thin film transistors are formed on the glass substrate and so-called alkali-free glass is used as a material of the glass substrate. This glass substrate includes impurities and the impurities intrude into the polysilicon film, so that the transistor characteristics of the thin film transistor formed on the substrate are degraded.
To suppress the intrusion of the impurities into the polysilicon film from the glass substrate, a background film made of silicon nitride, silicon oxide or the like is interposed between the glass substrate and the polysilicon film. The background film is formed over the whole surface of a panel and light-transmissive pixel electrodes are formed over the background film in addition to the thin film transistors. However, when the background film and the pixel electrodes are stacked, this gives rise to reflection of external light attributed to the difference in the refractive indices of the respective films.
In the conventional liquid crystal display device using the backlight, a background film is formed also in the light transmissive region. Accordingly, there has been a drawback in that, when the external light is reflected in the region where the light transmissive pixel electrodes are formed, the contrast of the images is lowered.
Further, in the partial-transmissive-type liquid crystal display device, the light reflective region and the light transmissive region are both formed in one pixel. Accordingly, when the image is displayed by making use of light from the backlight, the transmitting light is blocked by the reflective region, and, hence, the luminance of the screen is low. By adopting the full-transmissive panel structure having no reflective electrode in the pixel electrode and by reflecting the external light by use of the backlight, the luminance when the backlight is used can be enhanced. However, since such a display device is constituted by stacking the background film, the electrodes, the interlayer insulation films and the like, interface reflections attributed to the difference in refractive index occur on the interfaces of the respective films. Accordingly, with respect to the full-transmissive-type liquid crystal display device which reflects the external light by use of the backlight, there has been a drawback in that, when the images are displayed by the reflected light, an inverted image whose tint is inverted is displayed.


A micro-explosive material is provided. The micro-explosive material can include a carbon nanotube and a solid oxidizer attached to the carbon nanotube. The carbon nanotube with the solid oxidizer attached thereto is operable to burn per an exothermic chemical reaction between the carbon nanotube and the solid oxidizer such that a controlled burn and/or an explosive burn is provided. The micro-explosive material can be used as a heat generator, a gas generator, a micro-thruster, a primer for use with a larger explosive material, and the like.

Explosive materials and their use to destroy, move, and/or manipulate components, devices, etc. are known. Such explosive materials typically undergo an exothermic chemical reaction that produces heat and/or a large volume of gas. In addition, the chemical reaction occurs at a rapid rate such that a shockwave propagates from the chemical reaction.
The use of explosive materials is critical in a variety of areas such as military operations, espionage operations, counter-espionage operations, movement of desired devices, and the like. In addition, the ability to precisely control quantity of explosive and the amount of energy released can provide for more accurate, reliable, and controllable effects. Therefore, a micro-explosive device and/or material would be desirable.

The United States of America as represented by the Secretary of the Army


An exhaust gas purifying apparatus for a hybrid car, which is of the heater catalyst type and which is provided with an electric motor 1 for driving the hybrid car, a battery 2 for supplying electric power to the electric motor 1, a power generator 3 for charging the battery 2, an internal-combustion engine 4 for driving the power generator 3, and a controller 5 for controlling the operation of the internal-combustion engine 4. The internal-combustion engine 4 is equipped with a catalyst 9 installed in an exhaust pipe 8 for purifying exhaust gas, and a heater 9 for heating the catalyst 9 under the control of the controller 5 to enhance its catalytic action. The controller 5 actuates the internal-combustion engine 4 after the catalyst 9 is heated by the heater 9.

The present invention relates to an exhaust gas purifying apparatus and method for a hybrid car, which are suited for an electric vehicle or the like equipped with an electric motor for driving the vehicle and an internal-combustion engine for generating electric power.
In recent years, the emission regulation on internal-combustion engines is becoming stringent primarily because of the environmental problems, and many new technologies are being researched and developed to comply with the regulation. One of such efforts is represented by the "electric vehicle."
The electric vehicle is driven by an electric motor, and the electric motor basically receives electric power from a battery. The battery, however, has a limited capacity, making it difficult to achieve a long-distance drive. For this reason, the "hybrid car," which is equipped with a power generator for charging the battery and an internal-combustion engine for driving the power generator in addition to the above-mentioned electric motor and battery, is currently regarded as a typical form of the electric vehicle.
However, the hybrid car is, after all, provided with an internal-combustion engine; therefore, how to achieve the exhaust gas purification of the internal-combustion engine is extremely important to fulfill the original object of the electric vehicle to provide a pollution-free automobile. Accordingly, the internal-combustion engine mounted on the hybrid car is adapted for steady driving at, for example, a constant rotational speed, as a rule, to thereby minimize the generation of harmful substances such as CO and NOx by avoiding unsteady driving. Also, an exhaust pipe is provided with a catalyst for purifying exhaust gas as in a general internal-combustion engine, or stoichiometric feedback by an O.sub.2 sensor, lean feedback by an air-fuel ratio sensor, or the like is conducted to purify exhaust gas.
Meanwhile, as a device for powerfully controlling the exhaust gas of an internal-combustion engine, there has been proposed the "heater catalyst," the catalytic action thereof has been dramatically improved by heating the catalyst provided in an exhaust pipe by a heater to activate it.
Nevertheless, although various corrective measures have been taken for purifying the exhaust gas of the conventional hybrid cars as described above, there is still a problem that these measures alone cannot fully reduce the generation of harmful substances in exhaust gas to a level which is required of the electric vehicle.
Meanwhile, the heater catalyst, which is commonly recommended for the conventional internal-combustion engines, cannot provide powerful catalytic action until the catalyst is fully heated and activated; therefore, emission of harmful substances during that period is more or less unavoidable. Thus, to obtain powerful catalytic action from the start of an engine, the catalyst must be preheated before the engine is started so that the activation of the catalyst will have been finished when the engine is started. This is an extremely complicated operation for a driver, adversely affecting the practicality.

Exhaust gas purifying apparatus and method for a hybrid car

Mitsubishi Jidosha Kogyo Kabushiki Kaisha


Successful laser treatment of hemangiomas requires selective photocoagulation of subsurface targeted blood vessels without thermal damage to the overlying epidermis. An apparatus for in vivo exposure of laser radiation from a continuous Nd:YAG laser at 1064 nm delivers repetitive cryogen spurts, each having a duration of the order of milliseconds during continuous laser irradiation. Control of the cryogen spray cooling is achieved through monitoring of the radiometric surface temperature of the tissue site and either controlling the repetition rate of the cryogen spurts according to temperature or according to a threshold temperature of the irradiated surface and/or repetition rate of the cryogen spurts according to power density and the duration of continuous irradiation.

1. Field of the Invention
The invention relates to an apparatus and methodology for thermally mediated therapeutic procedures, and in particular for selective coagulation of specific components in selected regions in a biological matrix, when using focused ultrasound or electromagnetic radiation, such as a laser or microwave radiation, to induce thermal injury to the tissue.
2. Description of the Prior Art
Various thermally mediated therapeutic procedures using microwave, infrared or visible light energy have been used to induce coagulation necrosis of certain tissue components while protecting superficial tissues from thermal injury. For example, successful laser treatment of dermatoses, such as port wine stain lesions, hemangiomas, and telangiectasias, is based on photocoagulation of blood vessels without inducing thermal injury to the overlaying epidermis and papillary dermis, which could result in skin-surface texture changing or scaring.
Cryogen spray cooling is a potentially effective method for protecting superficial tissues from thermal injury. By the application of a short duration spurt of cryogen in the order of milliseconds, rapid and selective cooling of tissues is possible. Superficial tissues are cooled while the temperature of deeper tissues remain unchanged. Evaporation of the cryogen on the surface provides a mechanism for rapid removal of heat from the tissue. For example, when tetrafluoroethane, having a boiling point of -26.degree. C., is used as a cryogen, surface temperature drops of the order of 30-40.degree. C. have been obtained within 5-100 milliseconds. Experimental results indicate that spray cooling the tissue, e.g. skin, with tetrafluoroethane just prior to laser irradiation can selectively cool the superficial layer, e.g. epidermis, and yet permit photocoagulation of deeper dilated structures, e.g. port wine stain blood vessels. Successful blanching of port wine stain lesions without either epidermal thermal injury or skin-surface textural changes have been reported when the skin is precooled with tetrafluoroethane immediately prior to flashlamp-pumped pulsed dye laser irradiation with a relatively high-light dosage of about 10 J/cm.sup.2.
Surface cooling with ice or water has also been used as a method to prevent laser-induced thermal injury to the epidermis. Although this method has been shown effective in cooling skin, exposure time are too long (seconds) to reduce the temperature of the underlying targeted blood vessels. Consequently, incident laser energy is utilized ineffectively by first rewarming the blood vessels to their higher initial temperature before sufficient heat is generated to induce photocoagulation.
Some investigators have studied the effectiveness of delivering a short cryogen spurt, on the order of milliseconds, to selectively cool the epidermis without reducing temperature of the underlying targeted blood vessels. When used in conjunction with flashlamp pumped pulsed dye laser irradiation for treatment of vascular lesions, use of cryogen spray cooling has been demonstrated to prevent skin textural changes that result from thermally induced epidermal injury, while allowing blanching of port wine stains. In the absence of cryogen spray cooling, epidermal necrosis and subsequent skin pigmentation changes have been observed when treatments are administered with equivalent laser irradiation parameters.
The foregoing treatments have all been used for superficial dermal mediation, typically relating to hair removal, wrinkle treatment, and port wine stain removal. Laser Treatment without cooling has been practiced for tattoo removal. Hemangiomas are vascular tumors, characterized by rapid endothelial cell proliferation, which may infiltrate the entire dermis and extend several millimeters in depth. The depth and size of hemangiomas are far deeper than chromophores targeted for hair removal, wrinkle treatment, and port wine stain. Although laser irradiation has been used to induce photothermal destruction of hemangiomas, thermal damage to the epidermis and papillary dermis remain a serious concern. Therefore, what is needed is an apparatus and methodology whereby deep photocoagulation without thermal damage to the overlying epidermis can be successfully practiced.

Method and apparatus for causing rapid and deep spatially selective coagulation during thermally mediated therapeutic procedures

The Regents of the University of California


This invention relates to a method of fabrication for metal wiring used in semiconductor integrated circuit devices, and more specifically, to a copper plating method, whereby the wafer edge alignment marks for subsequent processing steps are protected from being covered by copper deposition by two methods: the first method being that of forming alignment mark shields at the wafer""s edge, thus preventing both barrier and copper seed layers from being deposited in those regions; the second method being that of forming small pad-like extrusions at the contact ring of the copper plating fixture, thus preventing copper plating at the contact points. In the first method, an alignment mark shield Is utilized to cover the alignment mark areas, near the edge of the wafer, with a mechanical shield. This shield protects the alignment mark regions from film deposition during the sputter deposition steps of barrier and copper seed layers. The alignment marks are left without a copper seed layer, hence preventing copper deposition in these regions during copper electroplating. In the second method, the alignment mark areas, near the edge of the wafer, are protected from copper electroplating deposition by use of small pad-like extrusions positioned at copper plating contact ring. The pad-like extrusion is part of the contact ring and prevents copper buildup and deposition on the alignment mark.

(1) Field of the Invention
This invention relates to a method of fabrication for metal wiring used in semiconductor integrated circuit devices, and more specifically, to a copper plating method, whereby the wafer edge alignment marks for subsequent processing steps are protected from being covered by copper deposition by two methods: the first method being that of forming alignment mark shields at the wafer""s edge, thus preventing both barrier and copper seed layers from being deposited in those regions; the second method being that of forming small pad-like extrusions at the contact ring of the copper plating fixture, thus preventing copper plating at the contact points.
(2) Description of Related Art
In this section a description of related Prior Art background patents follows.
U.S. Pat. No. 5,933,758 entitled xe2x80x9cMethod For Preventing Electroplating Of Copper On An Exposed Surface At The Edge Exclusion Of A Semiconductor Waferxe2x80x9d granted Aug. 3, 1999 to Jain describes a process for not plating Cu on the outside edge of a wafer. A layer is in situ covered with a copper seed layer. The layer is not formed in an edge exclusion region, thereby exposing a portion of the layer. This portion will natively oxidize in a room ambient to form a copper electroplating prevention barrier, whereby copper will not electroplate in the region.
U.S. Pat. No. 6,049,137 entitled xe2x80x9cReadable Alignment Mark Structure Formed Using Enhanced Chemical Mechanical Polishingxe2x80x9d granted Apr. 11, 2000 to Jang et al. describes a chemical mechanical polish (CMP) process for an alignment mark area. A structure of a readable alignment mark and method of manufacturing the readable alignment mark in an alignment mark area on a semiconductor substrate is disclosed. Alignment mark trenches are formed in the substrate. An insulating layer is formed over the alignment mark area. The insulating layer is chemical mechanical polished (CMP), thereby removing a first thickness of the insulating layer from the alignment mark area, leaving a residual insulating layer in the alignment mark trenches. Etches are used to remove the residual insulating layer, a silicon nitride layer, and a pad oxide layer in the alignment mark area, thereby exposing the alignment marks and making the alignment marks readable.
U.S. Pat. No. 4,632,724 entitled xe2x80x9cVisibility Enhancement Of First Order Alignment Marksxe2x80x9d granted Dec. 30, 1986 to Chesebro et al. teaches an alignment mark process that forms a xe2x80x9cblock maskxe2x80x9d over the alignment mark areas. After a given mark is formed, it is tested for visual contrast. If the contrast is insufficient to provide adequate alignment, a block mask is formed on a xe2x80x9ccritical maskxe2x80x9d. The block mask exposes all of the alignment target areas and protects the product regions of the wafer, and the xe2x80x9ccritical maskxe2x80x9d only exposes the mark to be enhanced. The mark is then etched for a time period which is a function of the measured visual contrast, to enhance the alignment marks.
U.S. Pat. No. 6,057,206 entitled xe2x80x9cMark Protection Scheme With No Maskingxe2x80x9d granted May 2, 2000 to Nguyen et al. teaches an alignment mark protection scheme that forms an alignment mark protection layer over the alignment mark. The method also includes forming a negative photoresist layer over the alignment mark protection layer and removing a portion of the negative photoresist layer, which does not overlie the alignment mark. Preferably, the removal of a portion of the negative photoresist includes selectively exposing a peripheral portion using an xe2x80x9cedge-bead removal toolxe2x80x9d. Therefore, the scheme allows for the formation of an alignment mark protection structure without an extra masking step.
U.S. Pat. No. 5,897,371 entitled xe2x80x9cAlignment Process Compatible With Chemical Mechanical Polishingxe2x80x9d granted Apr. 27, 1999 to Yeh et al. describes an alignment mark process with chemical mechanical polish (CMP), that deposits metal over the alignment marks. The invention discloses a process that maintains a second (or xe2x80x9creplicaxe2x80x9d) set of alignment marks during existing processing steps used in manufacturing a semiconductor device or integrated circuit, including chemical mechanical polish (CMP) and other planarization methods. The method describes a new alignment mark that may be xe2x80x9cprintedxe2x80x9d in a metal layer on the wafer. The new alignment mark is generally not subjected to planarization or to an xe2x80x9copen framexe2x80x9d process.
U.S. Pat. No. 5,899,738 entitled xe2x80x9cMethod For Making Metal Plugs In Stacked Vias For Multilevel Interconnections and Contact Openings While Retaining The Alignment Marks Without Requiring Extra Masking Stepsxe2x80x9d granted May 4, 1999 to Wu et al. teaches an alignment mark process that removes metal from over alignment marks. The method discloses the formation of stacked metal plugs in via holes and contacts, while retaining alignment marks without using additional masking steps. The method involves the deposition of a barrier layer and a tungsten layer, which fill the via boles or contact openings in an insulating layer. The tungsten is then etched back, without over-etching, to the surface of the barrier layer to form tungsten plugs that are coplanar with the surface of the insulating layer. Concurrently, the tungsten is removed from the recessed alignment marks, which allows for the replication of the alignment marks in the next level of metal, thereby eliminating additional masking steps.
This invention relates to a method of fabrication for metal wiring used in semiconductor integrated circuit devices, and more specifically, to a copper plating method, whereby the wafer edge alignment marks for subsequent processing steps are protected from being covered by copper deposition by two methods: the first method being that of forming alignment mark shields at the wafer""s edge, thus preventing both barrier and copper seed layers from being deposited in those regions; the second method being that of forming small pad-like extrusions at the contact ring of the copper plating fixture, thus preventing copper plating at the contact points. In the first method, an alignment mark shield is utilized to cover the alignment mark areas, near the edge of the wafer, with a mechanical shield. This shield protects the alignment mark regions from film deposition during the sputter deposition steps of barrier and copper seed layers. The alignment marks are left without a copper seed layer, hence preventing copper deposition in these regions during copper electroplating. In the second method, the alignment mark areas, near the edge of the wafer, are protected from copper electroplating deposition by use of small pad-like extrusions positioned at copper plating contact ring. The pad-like extrusion is part of the contact ring and prevents copper buildup and deposition on the alignment mark.
In the first method, that is the use of an alignment mark shield, the key elements follow. As a background, one of the problems the present invention addresses is the problem of a recessed profile at the alignment mark area before copper damascene processing which leads to a copper and barrier layer remaining after the chemical mechanical polishing (CMP) of copper. In addition, during the electrochemical plating of copper higher currents occur at the cathode contact at the wafer""s edge, which leads to a steep convex copper profile at the wafer""s edge and residual copper remains after the chemical mechanical polishing (CMP) of copper. However, by using an alignment mark shield at copper seed and barrier sputter deposition steps, the electrochemical plating of copper (ECP-Cu) will not occur on the underlying dielectric layer. Hence a clean and transparent area at alignment mark can be achieved at post chemical mechanical polishing (CMP) of copper.
In the second method, the alignment mark areas, near the edge of the wafer, are protected from copper electroplating deposition by use of small pad-like extrusions positioned at copper plating contact ring. The key elements follow. The pad-like extrusion is part of the contact ring and prevents copper buildup and deposition on the alignment mark. As a background, similar to the first method, one of the problems the present invention addresses is that during the process of electrochemical plating of copper, higher currents occur at the cathode contact at the wafer""s edge, which lead to a steep convex copper profile at the wafer""s edge and residual copper remains after the chemical mechanical polishing (CMP) of copper, covering the alignment marks at the wafer""s edge. However, following the following process sequence protects the alignment marks: a) damascene trench formation, b) copper barrier and seed layer deposition, c) electrochemical plating of copper (ECP-Cu) utilizing a small pad extrusion at the contact ring to avoid Cu plating on alignment marks, d) chemical mechanical polishing (CMP) of excess copper forming copper interconnects and contact vias.
This invention has been summarized above and described with reference to the preferred embodiments. Some processing details have been omitted and are understood by those skilled in the art. More details of this invention are stated in the xe2x80x9cDESCRIPTION OF THE PREFERRED EMBODIMENTSxe2x80x9d section.

Methods for edge alignment mark protection during damascene electrochemical plating of copper

Taiwan Semiconductor Manufacturing Company


An electronic circuit apparatus for a compressor includes a board and a case. One corner of the board is fixed to case such that the board cannot move in the thickness direction and is movable in the flattening direction. According to this structure, even when an electronic part generates heat or outside air temperature of the case varies, the expansion or contraction of the board in the flattening direction is not affected by the expansion or contraction of the case in the flattening direction. Therefore, it is possible to prevent the deformation of the board and stress from being repeatedly applied to a soldering portion of the electronic part. As a result, it is possible to ensure the reliability of soldering strength for a long time.

In an electronic circuit apparatus for a compressor according to the related art, a circuit board having electronic parts soldered thereto is housed in a case, and four corners of the board are fixed to the case by fasteners, such as screws.
Hereinafter, a fixing method according to the related art will be described with reference to the accompanying drawings.
FIG. 4 is an exploded perspective view illustrating an electronic circuit apparatus according to the related art. In FIG. 4, case 10 is formed of synthetic resin, such as nylon or ABS resin, by injection molding, and opening 12 having a size that is slightly larger than that of board 20 is formed in case 10 such that board 20 can be housed in case 10.
A metal pattern (not shown) is formed on or in board 20, and electronic parts (not shown) are soldered to the metal pattern, so that board 20 has an electrical function. In addition, board 20 is provided with connectors 22 for electrically connecting the electronic parts (not shown) to the metal pattern. A portion of case 10 corresponding to connectors 22 is opened, thereby forming cord lead portion 15.
Holes are formed at four corners 25 of board 20 such that board 20 can be fixed to case 10 by board fixing screws 30. Holes are formed at four corners 17 of opening 12 of case 10 such that four corners 45 of lid 40 can be fixed to case 10 by lid fixing screws 50.
The operation of the electronic circuit apparatus for a compressor having the above-mentioned structure will be described below.
In an assembly process of the electronic circuit apparatus for a compressor, first, board 20 is inserted through opening 12 of case 10 such that connectors 22 can be electrically connected to an external apparatus through cord lead portion 15. Then, four corners 25 of board 20 are fixed to case 10 in the thickness direction of board 20 by board fixing screws 30. Finally, four corners 45 of lid 40 are fixed to opening 12 of case 10 by lid fixing screws 50, and board 20 is covered with case 10 and lid 40, thereby completing the assembly process.
This structure is disclosed in Japanese Patent Unexamined Publication No. 11-317570.
However, in the above-mentioned structure, when the electronic circuit apparatus for a compressor is turned on, stress is repeatedly applied to a soldering portion of the electronic part due to the difference between linear expansion coefficients of board 20 and case 10 that is caused by heat generated from the electronic part mounted on board 20 or a variation in the outside air temperature of case 10.
For example, it is assumed that the electronic circuit apparatus for a compressor is used in a temperature range of −50° C. to +90° C. in consideration of the use of the apparatus in the arctic area, the arrangement of the apparatus around the compressor, and heat generated from electronic parts. Therefore, when soldering strength deteriorates due to the stress applied to the soldering portion of the electronic part, soldering cracks may occur in the soldering portion of the electronic part, which results in a defective circuit.

Electronic circuit apparatus for compressor


An apparatus and method for selecting products to inspect for defects performs in-situ monitoring of a processing tool during a manufacturing processing step. The data from the in-situ monitoring for a test run of products is correlated by a neural network with data collected during inspection of the test products for defects. During a production run of products, the in-situ monitor data is provided to the neural network which, based on the input data and the correlation, predicts the values of the data that would be collected upon inspection of the products. Specific products from the production run are selected for inspection based upon the predicted values.

1. Technological Field of the Invention
The present invention relates to the field of manufacturing products, such as semiconductor chips, and more particularly, to a method and apparatus for selecting which products to inspect for defects during the manufacturing process.
2. Description of the Related Art
The manufacture of most products, such as wafers containing semiconductor devices, requires a number of discrete processing steps to create the product. For the example of wafers, a number of discrete steps are needed to produce a packaged semiconductor circuit device from raw semiconductor material. The starting substrate is usually a slice of single crystal silicon referred to as a wafer. Circuits of a particular type are fabricated together in batches of wafers called "lots" or "runs". The fabrication process creates regular arrays of a circuit on the wafers of a lot. During processing, the individual wafers in a lot may go through individual processing steps one at a time or as a batch. At the completion of wafer processing, the wafers are tested to determine circuit functionality. Later the wafers are sliced, the functioning products are packaged, and further testing occurs prior to use by the customer.
Data gathered during the course of wafer processing is used to diagnose yield problems and forms the basis of yield improvement efforts. For example, during semiconductor processing, particle contamination in the processing tool will normally have a deleterious affect on product yield. In order to collect data on particle contamination, a sensor may be used that senses the level of particle contamination in the processing tool chamber, in the outflow gas, or other area.
In known arrangements, this in-situ sensor for measuring a parameter or operating condition, such as particle contamination, is controlled independently of the processing tool. This sensor also has its own separate database for storing the sensor data that is collected during the manufacturing processing step performed by the processing tool.
Although in-situ particle monitors provide a 100% monitoring of particle deposition at the wafer level, they do not always accurately predict the level of contamination that is actually contained on the wafers. This is because different process recipes will have different counts of particles in the outflow of gas, without necessarily being too high for that particular process. Also, the particle count in certain regions of the processing tool may not accurately reflect the level of contamination on wafers currently being processed in the processing tool.
In order to obtain accurate information regarding the contamination of a wafer, the surface of an actual wafer is scanned (a "surface scan") using an inspection machine, such as the Inspex wafer scanning machine manufactured by Inspex of Boston. These wafers are normally selected at random, scanned for defects, and then the problem in the processing tool, if any, will then be addressed. This random selection of wafers to be inspected generates a number of problems. For example, wafers must be removed during the manufacturing process, which presents the possibility of adding more defects to the wafers. Also, this conventional method adds a step to the manufacturing process, increasing the cost, delaying the process, and adding more particles to the wafer.
Hence, although wafer scans are very reliable, to the extent that they may be used to shut down a processing line, the costs associated with the random selection and inspection of wafers effectively prohibits 100% sampling of the manufactured wafers.

Method and apparatus for inspecting manufactured products for defects in response to in-situ monitoring


The present invention relates to an electric range comprising a body (100) for defining an exterior, an upper plate (400) on a top of the body (100), a working coil (210) provided in the body (100) for generating an electromagnetic force, an upper insulating sheet (240) provided to cover an upper surface of the working coil (210), a temperature sensor (250) secured to the electric part of the upper insulating sheet (240) for sensing a temperature of the upper plate (400) in a close contact with a downside of the upper plate (400), and an elastic part elastically formed in the upper insulating sheet (240) for making the temperature sensor (250) in a close contact with the upper plate (400).

Generally, electric rangers are cooking devices which cook by using an electric heater or a heating element as a heating source.
FIG. 1 and FIG. 2 illustrate a structure of a conventional electric range. Referring to them, the structure of the conventional electric range will be described.
In FIG. 1, the conventional electric range comprises a body 10 for forming an exterior, one or more heater assemblies 20 for generating a heating source, a power supply part (not shown) for supplying power to each heater assembly 20, a control assembly 30 for controlling an entire operation of the electric range, and an upper plate 40 defining a top of the electric range for having a food container thereon.
The heater assembly 20 mounted in the body 10 is of an induction heating structure in which a food container itself generates heat once applying an electromagnetic force to the container in an induction heating way.
The heater assembly 20 comprises a working coil 21, a circuit board 22, a heater base 23, and an insulating sheet 24.
The working coil 21 is employed for transmitting the electromagnetic force to the food container, and the circuit board 22 is for controlling an induction current supplied to the working coil 21.
The heater base 23 is provided between the working coil 21 and the circuit board 22 for forming a body of the heater assembly 20.
Between the heater base 23 and the working coil 21 is provided a magnet 21a for preventing a magnetic field (not shown) formed by the working coil 21 in a downside of the working coil 21.
Furthermore, the insulating sheet 24 of asbestos material is provided to cover a top of the working coil 21.
The insulating sheet 24 is employed for preventing the heat radiated from the upper plate 40 from being transmitted to the working coil 21.
Still further, a temperature sensor 25 is mounted on the insulating sheet 24 for sensing a cooking temperature heated by the working coil 21.
A wire 25a passes through a downside of the insulating sheet 24 to be drawn outside for applying power to the temperature sensor 25.
Thus, after driving the electric range, power is applied to the working coil 21 of the heater assembly 20. Hence, the induction current is generated, after that the food container is heated and cooking is performed.
However, as described hereinabove, the heater assembly 20 of the conventional electric rage has the following problems.
First, since it is mounted on the top of the insulating sheet 24 without any additional supporting structure or securing structure, the temperature sensor 25 of the heater assembly 20 may be going out of its position in a process of placing the upper plate 40.
Second, preferably the temperature sensor 25 may be in a close contact with a downside of the upper plate 40 for a high sensing efficiency. Commonly, considering that the insulating sheet 24 is made of asbestos material with good thermo stability, the temperature sensor 25 may be embedded in the insulating sheet 24. Therefore, it may cause a problem that the close contact between the temperature sensor 25 and the upper plate 40 may not be made smoothly, thereby deteriorating a reliability of the sensed temperature.
Third, since it, as described above, is made of the asbestos material, the insulating sheet 24 may cause problems of a high production cost as well as of the bad influence on the workers health.
Accordingly, the above problems necessitate a replacement of the asbestos.


Device for detecting polarization mode dispersion of an optical data signal, which has at least one EXOR gate together with an averaging device for measuring at least one value of the autocorrelation function of a baseband signal distorted by polarization mode dispersion.

Long optical waveguide transmission links are used in optical transmission technology. Production dictates that the optical waveguides are not completely isotropic, but rather weakly birefringent. The long transmission link results in frequency-dependent polarization transformation, called polarization mode dispersion or polarization dispersion, abbreviated to PMD. Through the change in the polarization of the optical signal as a function of the optical frequency and, associated therewith, different frequency-dependent delays, this PMD leads to the widening of transmitted pulses. As such, at the receiving end, the identifiability of the pulses is reduced and, as a result, the transmitted data rate is limited. The term "principal states of polarization", referred to as PSP below, designates those two states of polarization which are orthogonal to one another and to a first approximation do not change when the optical frequency changes. In polarization-maintaining optical waveguides, the principal states of polarization coincide with the principal axes; in other words, are horizontal and vertical. In general, however, the principal states of polarization are arbitrary orthogonal pairs of elliptic states of polarization. The principal states of polarization have different group delays, whose difference is referred to as "differential group delay", DGD below. If an optical signal is transmitted with one principal state of polarization, then, to a first-order approximation, no pulse widening takes place. If it is transmitted with a polarization which, in the case of splitting according to the two principal states of polarization, corresponds to power components that are identical there, maximum pulse widening occurs because two pulses of identical strength, with delay differences equal to DGD, are superposed. If the principal states of polarization change as a function of the optical frequency, then it is the case, however, that, when a principal state of polarization which corresponds to a specific frequency is used on the input side, the output state of polarization will nevertheless change as a function of the frequency, but actually only in a higher order than the first order. This is referred to as higher-order PMD. Higher-order PMD generally occurs, although first-order PMD is predominant due to its effects and, therefore, must be compensated preferentially. This is aggravated by the fact that the transmission response of the link, and hence the PMD too, changes as a result of temperature change or mechanical stress. Therefore, use is made of adaptive PMD compensators which are inserted in the transmission path. To drive these compensators, PMD distortions must be detected in the optical receiver. The compensator can then be set optimally using a gradient algorithm, for example.
In Electronic Letters, Feb. 17, 1994, Volume 30, no. 4, pages 348 to 349, use is made of a bandpass filter for filtering a data signal whose PMD is to be detected. A power detector at the filter output supplies a signal which is higher, the smaller the PMD distortions are. In Electron. Lett. 34(1998) 23, pages 2258 to 2259, use is made of a combination of a number of bandpass filters with downstream power detectors, in which case, instead of individual signals, it is also possible to use a linear combination of the signals. By using bandpass filters having different center frequencies, it becomes possible, at the same time, to detect even relatively large PMD distortions which exceed, e.g., a bit duration of the signal. However, bandpass filters are poorly suited to monolithic integration; for example, in Si or SiGe. Moreover, unavoidable group delay distortions in the bandpass filters have the result that optimal PMD detection and hence equalization is not possible.
In Proceedings OEC 94, 14e-12, pages 258 to 259, Makuhari Trade Fair, Japan 1994, a different method is used, in which the power of the differential signal between decision-circuit output and decision-circuit input is evaluated. Incorrect decisions may occur, however, particularly in the event of severe PMD distortions in which the DGD exceeds the bit duration, so that the signal obtained in such cases is an unsuitable criterion for the presence of PMD distortions.
An object of the present invention, therefore, is to specify a reliable detector even for relatively large values of the differential group delay which can be integrated in a simple manner and, unlike bandpass filters, is not subject to intrinsic distortions through group delay distortions.


Embodiments of the present invention relate to an apparatus. The apparatus includes a supplementary decoder and a memory. The supplementary decoder is configured to decode supplementary data. The supplementary data is associated at least one of audio data and video data. The memory is coupled to a supplemental video decoder. The memory is configured to record the start position of the decoded supplementary data. In embodiments, the apparatus includes a user input. The user input is configured to cause the apparatus to replay at least one of audio data and video data with the supplementary data starting from the start position of the decoded supplementary data stored in the memory.

1. Field of the Invention
The present invention generally relates to playback devices.
2. Background of the Related Art
Radio and televisions are examples of devices which output audio and/or video signals. These audio and/or video signals may be in the form of radio programs, television programs, or movies. It is often desirable for a listener or a viewer to record a radio or television program. This desire is based on the ability to replay or playback the radio or television program later.
Some listeners or viewers of radio and television programs may not have a complete understanding of their radio or television program due to a language barrier. This language barrier may be that the radio or television program is in a language different from the listener or viewer's native language. Accordingly, there has been a long felt need for a listener or a viewer to enhance their understanding of a radio or television program which is in a different language than their native language.

Method for reproducing sub-picture data in optical disc device, and method for displaying multi-text in optical disc device


A three-dimensional object detection device is provided with an image capturing device, a three-dimensional object detection unit, a rainfall state detection unit, a three-dimensional object assessment unit and a controller. The image capturing device captures an area rearward of a vehicle. The three-dimensional object detection unit detects a three-dimensional object rearward of the vehicle and calculating a traveling speed of the three-dimensional object, based on images obtained by the image capturing device. The rainfall state detection unit detects a state of rainfall including cases of rainfall or formation of a water film on a road surface due to rainfall. The three-dimensional object assessment unit accesses the three-dimensional object to be another vehicle when the traveling speed of the detected three-dimensional object lies within a preset setting range. The controller changes the traveling speed setting range to be narrower when the rainfall state detection unit has detected a rainfall state.

1. Field of the Invention
The present invention relates to a three-dimensional object detection device and a three-dimensional object detection method.
2. Background Information
From the standpoint of using a single camera to monitor vehicle environs and detect raindrops, vehicle monitoring devices are known which monitor the environs of a vehicle based on images captured by a camera provided with a lens capable of image capture with a first focal distance for short distances to capture raindrops adhering to the vehicle and of image capture with a second focal distance for long distances to capture the vehicle surroundings (Japanese Laid-Open Patent Application No. 2005-225250).

Three-dimensional object detection device, three-dimensional object detection method


The cable insulation stripping machine is adapted for mounting to a machine with a motor having a reversible rotating chuck and is operable to remove the outer insulating jacket from a multi-conductor cable. The cable insulation stripping machine has a stripping spindle rotated by the chuck. At one end of the stripping spindle is a stripping and take up spool. The spool contains a self-adjusting slot, which grips a flap cut into the outer jacket at the end of a multi-conductor cable. As the spindle is rotated, the pinching action of the spool slot removes the insulation from the cable and the stripped insulation winds onto the body of the spool. A pair of cable guides is provided, the first guide for support incoming cable on and feeding the cable to the stripping and take up spool, the second guide for receiving the stripped conductors as they exit the machine.

1. Field of the Invention
The present invention relates to an apparatus for removing the insulating jacket from cable, and more particularly to a cable insulation stripping machine for stripping the outer insulation from multi-conductor cables.
2. Description of the Related Art
A very common activity for technicians installing electrical equipment is stripping the insulating jacket from cables and wires. Electrical cables are made up of one or more conductors contained in an insulating jacket. The jacket is typically made of an elastomeric material, such as neoprene rubber, silicon rubber, or a polymeric material such as Polyvinylidene Fluoride (PVDF). Electricians strip the insulation from cables in order to expose the conductors. It is necessary to gain access to the conductors in order to connect cables carrying electrical power, control, and other signals to electrical equipment.
Removing the outer insulation from large multi-conductor cables is a particularly onerous task. Multi-conductor cables consist of two or more insulated conductors contained in an outer insulating jacket. Multi-conductor cable may also contain filler, which is material added to occupy the interstitial spaces between the conductors to give the multi-conductor cable a round shape. A typical manual process for removing the outer jacket involves making one or more longitudinal cuts into the outer jacket using a sharp knife and then pulling the jacket away from the cable until the desired length of the internal conductors is exposed. An electrician performing this operation must be careful when making these cuts on a multi-conductor cable not to cut through the insulation on the inner conductors, because doing so would compromise the insulation on these conductors producing possible short circuits during use. For large size electrical conductors, pulling the outer jacket away from the conductors in the jacket may be physically demanding because of the difficulty in flexing the thick outer jacket material and because the jacket adheres to the filler material inside the cable. Removing the cut insulation may be made easier by making multiple cuts into the insulation, allowing the jacket insulation to be removed in narrow strips. However making the additional cuts requires additional time and labor by the electrician, and increases the likelihood of cutting into the insulation of the inner conductors, or of cutting the conductors themselves.
When completing a large installation, the need to strip insulation from both ends of large numbers of cable requires substantial time and labor and adds significantly to both the expense and the completion time for a construction project. In addition, removing the heavy insulation is physically taxing and may result in repetitive motion injuries as well as injuries of other types to the hands and wrists of the electrical installers.
Mechanical or electrically operated machines to strip the outer jacket from multi-conductor cables can speed up the stripping task and make the task less physically demanding. Typically, devices for stripping cable utilize blades to cut through the insulation along the length of the cable and may also include a mechanism for separating the cut insulation from the cable. Because different sizes and types of multi-conductor cable have different diameters, different thickness of insulation, and different arrangements of the internal conductors, these devices may need to make adjustments to the positions of the cutting blades and to other parts of the devices to properly strip the outer insulating jacket from the cable without also cutting through the insulation of the internal conductors or through the conductors. Making these adjustments may increase the time spent stripping the cable or may alternatively result in technicians attempting to strip the jacket from a multi-conductor cable using an inappropriate blade adjustment or setting. An inappropriate setting may require repeating the stripping operation, may damage the cable so that the cable must be discarded, or may even result in installing the cable with damage to the inner conductor insulation, leading to electrical short circuits and the risk of fire, shock, equipment downtime, and damage to equipment.
German Patent No. 3,412,044, published Oct. 3, 1985, describes a device for removing insulation from cables for recycling. The cable stripper described in this publication converts the conductor and insulation of the cable to granular form for recycling, rather than removing the outer cable jacket to leave the internal conductors intact.
Thus, a cable insulation stripping machine solving the aforementioned problems is desired.


Use of an inhibitor of the renin-angiotensin system or a pharmaceutically acceptable derivative thereof, optionally together with another antihypertensive, a cholesterol lowering agent, a diuretic or aspirin, in the manufacture of a medicament for the prevention of cardiovascular events; a method of preventing cardiovascular events comprising administering to a patient in need of such prevention an effective amount of an inhibitor of the renin angiotensin system or a pharmaceutically acceptable derivative thereof, optionally together with another antihypertensive, a cholesterol lowering agent, a diuretic or aspirin; and a combination product containing an an inhibitor of the renin-angiotensin system or a pharmaceutically acceptable derivative thereof and a cholesterol lowering agent.

The renin-angiotensin system (RAS) can be interfered with by inhibition of the enzymes synthesizing angiotensins or by blocking the corresponding receptors at the effector sites. There are many marketed or investigation-stage agents which inhibit RAS activity, and many fall into two broad classes: the inhibitors of angiotensin-converting enzyme (ACE), whose approved names generally end in "-pril" or in the case of active metabolites "-prilat", and antagonists at angiotensin receptors (more specifically, currently, the AT1 receptor) (Angiotensin II Antagonists), whose approved names generally end in "-sartan". Also potentially of increasing importance may be a class of drugs known as neutral endopeptidase (NEP) inhibitors which will also have an ACE-inhibitory effect or the potential to reduce RAS activity and are therefore also known as NEP/ACE-inhibitors.
ACE inhibitors are well known in the art for their activity in inhibiting angiotensin converting enzyme, thereby blocking conversion of the decapeptide angiotensin I to angiotensin II. The principal pharmacological and clinical effects of ACE inhibitors arise from suppression of synthesis of angiotensin II. Angiotensin II is a potent pressor substance and, therefore, blood pressure lowering can result from inhibition of its biosynthesis, especially in animals and humans whose hypertension is angiotensin II related. ACE inhibitors are effective antihypertensive agents in a variety of animal models and are clinically useful for the treatment of hypertension in humans.
ACE inhibitors are also employed for the treatment of heart conditions such as hypertension and heart failure. It is known that at least some ACE inhibitors can improve (i.e., decrease) morbidity and mortality in patient populations with heart conditions, ie. patients with low ejection fraction (EF) or heart failure (HF), but their role in a broader population of high risk patients without ventricular dysfunction or HF is unknown.

This patent is subject to a terminal disclaimer.

Use of inhibitors of the renin-angiotensin system in the prevention of cardiovascular events


A switching-mode power supply capable of causing conduction through a synchronous rectifier switch exactly when required. Included is a transformer having a primary winding connected to a pair of DC input terminals via an active switch, and a secondary winding connected to a pair of DC output terminals via a synchronous rectifier and a smoothing capacitor. The synchronous rectifier is a parallel connection of a synchronous rectifier switch and a diode. In order to cause conduction through the synchronous rectifier switch while the diode is conducting, there is provided a synchronous rectifier control circuit comprising two current sources, a conduction period determination circuit, and a synchronous rectifier switch control pulse forming circuit.

This invention relates to an electronic power supply unit known as the switching-mode power supply, and more specifically, to such a power supply of the kind having a synchronous rectifier circuit.
A typical conventional switching-mode power supply with a flyback DC-to-DC converter includes a transformer having a primary winding coupled to the pair of DC input terminals via an active switch, and a secondary winding coupled to the pair of DC output terminals via a rectifying diode and smoothing capacitor. The DC input voltage is rapidly turned on and off as the active switch is driven by pulses that have been width-modulated by a feedback circuit monitoring the DC output voltage. Energy is stored on the transformer during the conducting periods of the active switch and released during its nonconducting periods. The smoothing capacitor is charged as the rectifying diode conducts during the nonconducting periods of the active switch.
A voltage drop of approximately 0.8 volt has been known to occur across the rectifying diode of the above switching-mode power supply. Japanese Unexamined Patent Publication No. 9-163736 teaches how to reduce this voltage drop, and consequent power loss, across the rectifying diode. Connected in parallel with the rectifying diode according to this prior art is a synchronous rectifier switch which is turned on during the conducting periods of the rectifying diode. The synchronous rectifier switch, particularly when in the form of a bipolar or field-effect transistor, introduces a voltage drop of as low as 0.2 volt or so, realizing an appreciable diminution of an overall voltage drop on the output side of the transformer.
This prior art technique has proved to possess its own shortcomings, however. One of them is the difficulty of turning on the synchronous rectifier switch in exact synchronism with the conducting periods of the rectifying diode, these conducting periods being subject to change with the input voltage and with the loading.
Another weakness manifested itself in the event of an abrupt drop in the output voltage of the switching-mode power supply in response to a change in loading. Thereupon the standard feedback circuit of the closed-loop switching regulator responded by correspondingly extending the conducting periods of the active switch. The possible result was the undesired overlapping of the conducting periods of the active switch and those of the synchronous rectifier switch. Such overlapping, if it occurred at all, might lead to noise production and, worse yet, to the destruction of the associated circuit parts.
The yet-unremedied drawbacks of the synchronous rectification technology discussed above are not peculiar to the flyback DC-to-DC converter. The same technology has been applied, at the risk of like contingencies, to other varieties of switching-mode power supplies such as a forward DC-to-DC converter and a chopper converter.

Switching-mode power supply having a synchronous rectifier