A superior cement dispersant and a concrete composition containing the cement dispersant, the cement dispersant being a water-soluble amphoteric copolymer which contains an alkylene oxide adduct of a polyamide polyamine having an unsaturated group and at least two types of polyalkylene glycol ester. When the cement dispersant is compounded with a concrete composition, the dispersion performance thereof increases with time, and the concrete viscosity is effectively decreased. The cement dispersant composition contains a water-soluble amphoteric copolymer or the neutralized salt thereof as an essential component, which is obtained by copolymerizing an alkylene oxide adduct of a polyamide polyamine having an unsaturated group, (meta)acrylic acid or an alkali metal, ammonium, or alkanolamine salt thereof, an ester of an alkylene glycol and methacrylic acid, and an ester of an alkylene glycol and acrylic acid. In addition, the concrete composition containing the above cement dispersant is also disclosed.

Heretofore, as cement dispersants, for example, polymelamine sulfonates, lignin sulfonates, copolymers of an olefin and maleic acid, and polycarboxylic acid-base dispersants have been used. However, due to various problems such as poor working efficiency at large building construction sites at which concrete mixer cars are forced to wait for a long period of time, lower profitability of suppliers of ready-mixed concrete since supply areas have to be decreased due to an inferior slump retention property, and in relation thereto, quality degradation which occurs when the time required for transportation of ready-mixed concrete is increased, improvement in slump retention has been always and enthusiastically required. Although polycarboxylic acid-base dispersants have a good slump retention property as compared that of previous generation cement dispersants, in the present circumstances in which the polycarboxylic acid-base dispersants have steadily and progressively spread in the related business fields, a slump retention property which is much superior to that of the current available dispersant has been strongly desired. In order to respond to this requirement, development of controlled-release polymers has been implemented for realizing a polymer which exhibits a slump retention property with time elapsed. Techniques relating to controlled-release cement dispersants have been disclosed. Patent Document 1 discloses palletized dispersants. Patent Documents 2 and 3 disclose a hydrolysable crosslink copolymer which makes use of an alkali condition in a cement dispersant liquid. Patent Document 4 discloses a time-release cement admixture containing poly(succinic imide). However, as for the techniques described above, improvement has been further desired in terms of product performance and effectiveness.
In addition, Patent Documents 5 and 6 disclose a copolymer containing a methacrylic acid ester and an acrylic acid ester. However, according to the documents mentioned above, the controlled-release performance using an alkali condition in a cement dispersant liquid has not been invented.
In addition, Patent Documents 7 and 8 disclose a carboxylic acid-base dispersant for high-strength concrete as a copolymer compound containing a polyamide polyamine or an alkylene oxide adduct thereof.                Patent Document 1: JP-A 54-139929        Patent Document 2: JP-A 03-075252        Patent Document 3: JP-A 06-157100        Patent Document 4: JP-A 08-169741        Patent Document 5: JP-A 9-40446        Patent Document 6: Japanese Patent No. 3029827        Patent Document 7: Japanese Patent No. 3235002        Patent Document 8: Japanese Patent No. 3336456

Cement dispersant and concrete composition containing the dispersant


Engine oil \s and methods for use in soot-producing engines. The engine oil contains a major amount of a base oil and a dispersant reaction product of A) a hydrocarbyl-dicarboxylic acid or anhydride, and B) at least one polyamine, that is post-treated with C) an aromatic carboxylic acid, an aromatic polycarboxylic acid, or an aromatic anhydride, wherein all carboxylic acid or anhydride groups of C) are attached directly to an aromatic ring. A molar ratio of carboxyl groups from components A) and C) to nitrogen atoms from component B) of from 0.9 to 1.3 is used to make the dispersant which also has a molar ratio of component C) to component B) of at least 0.4 and when component B) has an average of 4-6 nitrogen atoms per molecule, a molar ratio of A) to B) is from 1.0 to 1.6.

Engine lubricant compositions may be selected to provide increased engine protection, as well as an increase in fuel economy, and a reduction in emissions. However, in order to achieve benefits of improved fuel economy and reduced emissions, a balance between engine protection and lubricating properties is required. For example, an increase in the amount of friction modifiers may be beneficial for improving fuel economy, but may lead to reduced ability of the lubricant composition to handle water. Likewise, an increase in the amount of anti-wear agent in the lubricant may provide improved engine protection against wear but may be detrimental to catalyst performance for reducing emissions.
One of the reasons that dispersants are added to lubricant compositions is to maintain soot and/or sludge in suspension and thereby prevent these contaminants from settling on and/or adhering to surfaces. As the amount of dispersant(s) in a lubricant composition is increased, typically, the soot and sludge handling properties of the lubricant are improved. In heavy duty diesel engines, the dispersant treat rates required for effective soot and sludge handling may be quite high. High dispersant treat rates, however, may increase corrosion and can be harmful to seals.
Dispersant(s) and/or dispersant treat rates may also influence the frictional properties of an engine oil composition. More specifically, the thin film and/or boundary layer friction properties of an engine oil can be influenced by dispersant(s) and/or dispersant treat rates. As a result, there is a need in the field of engine oils to balance the soot and/or sludge handling properties of dispersants with the thin film and/or boundary layer frictional properties of the engine oils containing the dispersants.
Accordingly, there is a need for a dispersant or a dispersant combination that can provide satisfactory soot and/or sludge handling properties to a lubricant composition at a relatively low dispersant treat rate, as well as provide acceptable or improved thin film and/or boundary layer friction properties to an engine oil composition. Such lubricant compositions should be suitable for meeting or exceeding currently proposed and future lubricant performance standards.

Engine oils for soot handling and friction reduction


A wear leveling method for a non-volatile memory is provided. The non-volatile memory is substantially divided into a plurality of blocks, and these blocks are grouped into at least a data area, a spare area, a substitute area, and a temporary area. The wear leveling method includes selecting blocks from the spare area according to different purposes and executing a wear leveling procedure.

1. Field of the Invention
The present invention generally relates to a wear leveling method, in particular, to a wear leveling method for a non-volatile memory and a controller using the same.
2. Description of Related Art
Along with the widespread of digital cameras, camera phones, and MP3 in recently years, the consumers' demand to storage media has increased drastically too. Flash memory is one of the most adaptable memories for such battery-powered portable products due to its characteristics such as data non-volatility, low power consumption, small volume, and non-mechanical structure. Besides being applied in foregoing portable products, flash memory is also broadly applied to external products such as flash cards and flash drives, and an even larger market is provided since one can have more than one flash card and flash drive. Thereby, flash memory has become one of the most focused electronic products in recent years.
Flash memory can offer such advantages as data rewritability and power-free data storage. However, blocks in a flash memory can be erased only a limited number of times, for example, a block in a flash memory is worn-out after being erased 10,000 times. Data loss may be caused when the storage capacity or performance of a flash memory is obviously deteriorated by its worn-out blocks.
The wear of a block in a flash memory is determined by the number of times this block is programmed or erased. In other words, the wear of a block is relatively low if the block is programmed (or written) only once; contrarily, the wear of a block is relatively higher if the block is programmed and erased repeatedly. For example, when a host keeps writing data into a flash memory by using the same logical block address (LBA), the block having the corresponding physical block address (PBA) in the flash memory is then repeatedly written and erased.
Generally speaking, the existence of worn-out blocks will reduce the performance of a flash memory even if the wear of other blocks are still relatively low. Besides the deterioration in the performance of the worn-out blocks, the performance of the entire flash memory is also reduced when the good blocks cannot provide enough space for storing data. In other words, when the number of worn-out blocks in a flash memory exceeds a threshold value, the flash memory is considered unusable even there are still good blocks. In this case, those good blocks are wasted.
Blocks in a flash memory should be used evenly in order to prolong the life of the flash memory. Blocks in a flash memory are usually grouped into a data area and a spare area. According to a conventional wear leveling method, blocks in the data area and blocks in the spare area are logically exchanged in an appropriate sequence at regular intervals, so that those blocks which are erased fewer times can be exchanged to the spare area to be programmed or written. However, such sequential exchange cannot guarantee that those blocks erased fewer times will be exchanged, and the exchanged blocks will be worn even more quickly if these blocks have been erased many times. As described above, the conventional wear leveling method is not very satisfactory.
Accordingly, a wear leveling method which can effectively prolong the life of a flash memory is to be provided.

Wear leveling method and controller using the same


An apparatus and method that permits the removal of heat from the back side surface of an integrated circuit semiconductor substrate while performing optical based testing through or at the back side surface of the semiconductor substrate.. In one embodiment, the present invention includes a semiconductor device having an infrared transparent heat slug attached to the back side surface of the device. Heat is removed from the semiconductor device through an infrared transparent heat slug that is then thermally cooled by a conventional cooling technique.

Within the integrated circuit industry there is a continuing effort to increase integrated circuit speed as well as device density. As a result of these efforts, there is a trend towards using flip chip technology when packaging complex high speed integrated circuits. Flip chip technology is also known as control collapse chip connection (C4) technology. In C4 technology, the integrated circuit die is flipped upside down. This is opposite to how integrated circuits are packaged today using wire bond technology. By flipping the integrated circuit die upside down, ball bonds may be used to provide direct electrical connections from the bond pads of the die directly to a corresponding set of pads on a package.
In the following discussion reference will be made to a number of drawings. The drawings are provided for descriptive purposes only and are not drawn to scale.
FIG. 1 illustrates an integrated circuit die 102 that is housed in a cavity 105 of a PGA (Pin Grid Array) package 110. The integrated circuit die includes a semiconductor substrate 103 having a top surface 107 and a back side surface 108. The active regions 109 of the integrated circuit are formed from the top surface 107 of the of the semiconductor substrate 103. Wire bonds 104 are used to electrically connect integrated circuit connections in integrated circuit die 102 through internal metal interconnects to the pins 106 of package substrate 110. With the trend towards high speed integrated circuits, the inductance generated in the wire bonds 104 of the typical wire-bonded integrated circuit packaging becomes an increasingly significant problem.
FIG. 2 illustrates a C4 mounted integrated circuit die 202 that is electrically coupled to a PGA (Pin Grid Array) package 210 by ball bonds 204. Die 202 includes a semiconductor substrate 203 that has a top surface 208 and a back side surface 207. The active regions 209 of the integrated circuit are formed from the top surface 208 of the of the semiconductor substrate 203. Because the bond pads of integrated circuit device 202 are located on the top-side surface 208 of the device, the die must be flipped upside down so that it may be attached to package 210. In comparison with the wire bonds 104 of FIG. 1, the ball bonds 204 of integrated circuit device 202 provide more direct electrical connections between the integrated circuit device 202 and the pins 206 of package substrate 210. As a result, the inductance problems associated with typical integrated circuit wire bond packaging technologies are minimized. Unlike wire bond technology, which only allows bonding along the periphery of the integrated circuit die, C4 technology allows connections to be placed anywhere on the integrated circuit die surface. This leads to a much cleaner and more efficient power distribution to the integrated circuit which is another major advantage of C4 technology.
During the silicon debug phase of a new product it is often necessary to probe certain internal portions of the integrated circuit in order to obtain important electrical data from the integrated circuit. Important data include measuring device parameters such as, but are not limited to, voltage levels, timing information, current levels and thermal information. Emissions from the backside of the die may also be measured to determine or locate a variety of defects, such as impact ionization, shorts, hot carrier effects, forward and reverse bias P-N junctions, transistors in saturation and gate oxide breakdown.
Present day debug process for wire bond technology is based on directly probing the metal interconnects on the chip front side with an electron beam (E-beam) or mechanical prober. Typical integrated circuit devices have multiple layers of metal interconnects and it is often difficult to access nodes that are buried deep in the chip. Usually other tools such as plasma etchers and focused ion beam systems must be used to mill away the dielectric and or metal above the node to expose metal nodes for probing. With C4 packaging technology, however, this front side methodology is not feasible since the integrated circuit die is flipped upside down making these internal metal nodes inaccessible.
In order to test and debug C4 mounted integrated circuit devices a number of optical-based testing methods, such as laser probing, have been developed that permit probing of internal portions of an integrated circuit through the back side of the C4 mounted devices. Since the active regions of the integrated circuit are located near the back side surface of the device, it is easier to access these regions through the silicon substrate for the purposes of laser or optical probing and/or for detecting photon emissions emitted from active devices. Since it is often difficult to access the active regions of an integrated circuit from the top surface of a wire-bonded integrated circuit device, it may be desirable to laser probe or detect photon emissions from the back side of a wire-bonded integrated circuit device. As such, the testing of internal nodes may be simplified with the use of an optical-based back side testing methodology. In such an instance, a portion of the package housing the integrated circuit must first be removed to expose the back side surface of the die's semiconductor substrate. Then optical based probing can be performed through the removed portion of the package housing.
During the testing or debugging of an integrated circuit device, it is generally desirable to operate the integrated circuit at its full operating capacity. Since the power density in modern microprocessors is typically very high, it is extremely important to remove heat created by the devices in order for the devices to maintain acceptable operating temperatures. If the temperature of the integrated circuit is not properly controlled, the performance of the circuit may be affected. In some instances, component degradation will occur if the temperature of the integrated circuit is not properly regulated. Thus, any information collected must be obtained with the device operating in its native packaged environment and with its temperature properly regulated. Otherwise, any information obtained may be useless.
FIG. 3A illustrates a prior art approach to dissipating heat from a C4 mounted semiconductor device. Heat is removed from the back side surface 207 of semiconductor device 202 by passing an air flow 240 over a finned heat sink 230 that is thermally coupled to back side surface 207. In some high power applications, heat is dissipated from semiconductor device 202 by attaching a thermally conductive heat slug 232 (e.g., a copper plate) to back side surface 207 and thermally coupling the heat slug to a heat sink. (See FIG. 3B.) In some instances, heat slug 232 is thermally coupled to a metal plate having a large thermal mass and a large heat transfer area. In other instances, heat slug 232 may be thermally coupled to a heat spreading plate by a heat pipe or some other low resistance thermal path.
As depicted in FIG. 4A, the removal of heat from a wire bonded semiconductor device 102 generally involves attaching a finned heat sink 130 to the bottom surface 112 of package 110 and passing an air flow 140 over the heat sink. A heat flow path is established across the back side surface 114 of semiconductor device 102 through package 110 and into heat sink 130. A heat slug (now shown) embedded within package 110 thermally couples die 102 to heat sink 130. Heat is carried away by the air flow 140 passing across finned heat sink 130. In high power applications, a heat slug 130 may be attached to the bottom surface 112 of package 110 and then thermally coupled to a heat spreading plate or other heat sink. (See FIG. 4B.) In the heat removal apparatus of FIGS. 4A and 4B, it is assumed that package 110 is made of a thermally conductive material such as a those typically used in standard ceramic packaging for integrated circuits. Although the prior art heat removal methods described above have proved sufficient in the past, they cannot be used in conjunction with testing methods that require probing through the back side of the semiconductor substrate. In other words, the prior art heat removal methods cannot be used in conjunction with any testing method or process that requires optical access to or through the back side of a semiconductor substrate.
Therefore, what is needed is a method and an apparatus for removing heat from the back side surface of an integrated circuit semiconductor substrate while simultaneously allowing the back side surface of the semiconductor to be probed, or otherwise tested in accordance with an optical-based testing technique.

Method and apparatus for cooling the backside of a semiconductor device using an infrared transparent heat slug


An injection mold and an injection molding apparatus having a movable mold and a fixed mold. Each of the movable/fixed molds has bases, and a runner, a gate and a cavity are formed. The gate is composed of recesses made in mutually opposite end surfaces of sleeve-like heat insulators provided for the bases. Thereby, the gate is heat-insulated, and resin in the gate is prevented from cooling down during a pressure retention step. Thus, the resin keeps fluidity longer.

1. Field of the Invention
The present invention relates to an injection mold and an injection molding apparatus, and more particularly to an injection mold and an injection molding apparatus for molding a small and light optical element, such as a lens.
2. Description of Related Art
In recent years, with improvement of resin materials and injection molding techniques, small and light resin lenses have been developed, and a demand for use of these resin lenses as optical elements in optical pick-up devices and portable telephones has been stronger. In order to produce such resin lenses, molds which permit accurate transfer of fine configurations for diffraction elements and smooth surfaces or the like are required.
Generally, a gate of a mold is narrow, and in a pressure retention process after injection of resin into a cavity, the resin in the gate is solidified relatively early. Therefore, the pressure applied to the resin in the cavity becomes weaker, and a supply of resin to compensate shrinkage of the resin becomes short. Consequently, a molded product has problems that the accuracy of a fine configuration of a surface and the accuracy of a smooth surface are low (low transfer accuracy) and that since a tensile stress is applied to the center part of the product due to shrinkage of the resin, the birefringence of the lens becomes larger.
Japanese Patent Laid-Open Publication No. 2002-187168 discloses a mold for molding an optical element with high surface accuracy and with little residual deformation. This mold has a sliding mechanism to slide the side portions of the mold, except for the sides of the gate, so that a molded product can be released from the mold smoothly. However, this mold does not solve the above-described problems, namely, a degradation in transfer accuracy caused by solidification of resin in the gate and an increase in tensil stress caused by shrinkage of resin in the cavity.

Cold runner injection mold having an insulated gate


Cyclic cedrene acetals of the general formula A are described, in which the wavy lines represent the .alpha.- and .beta.-configurations, and R and R.sub.1 are the radicals below: ##STR1## R=R.sub.1 =H R=H, R.sub.1 =Me/R=Me, R.sub.1 =H. R=H, R.sub.1 =Et/R=Et, R.sub.1 =H PA1 R=H, R.sub.1 =Pr/R=Pr, R.sub.1 =H PA1 R=H, R.sub.1 =Bu/R=Bu, R.sub.1 =H PA1 R=H, R.sub.1 =Iso-Bu/R=Iso-Bu, R.sub.1 =H PA1 R=H, R.sub.1 =Pentyl/R=Pentyl, R.sub.1 =H PA1 R=H, R.sub.1 =Iso-Pentyl/R=Iso-Pentyl, R.sub.1 =H PA1 R=H, R.sub.1 =Hexyl/R=Hexyl, R.sub.1 =H PA1 R=R.sub.1 =Me (.alpha.,.beta.) PA1 R=Me, R.sub.1 =Fl/R=Et, R.sub.1 =Me PA1 R=R.sub.1 =Fl (.alpha.,.beta.) PA1 R=Me, R.sub.1 =Pr/R=Pr, R.sub.1 =Me PA1 R=Pt, R.sub.1 =Pr/R=Pr, R=Et PA1 R=R.sub.1 =Cyclobutyl PA1 R=R.sub.1 =Cyclopentyl PA1 R=R.sub.1 =Cyclohexyl.

Description
The strong odoriferous properties of animal secretions, glands and other organ components have fascinated man for thousands of years. Whilst originally the emanating perfumes were associated with magical powers and were thus used for religious and cultural purposes, there have been a variety of other uses, for example as medicaments, since ancient times. At the start of this century, ambergris, musk and civet appeared as valuable ingredients in perfumery. Thus, the first analytical work to determine the structure of the principal odoriferous substance in ambergris took place in the mid 1920s. The start of the 1930s then saw the first work on preparing it synthetically on an industrial scale. The growing demand for fragrances could no longer be met by products of natural, vegetable and animal origin. It is only possible to meet the growing demand for fragrances having improved properties, such as odor quality, stability in technical applications, skin tolerance, environmental compatibility and also adherence, through chemical synthesis of fragrances.
In order to achieve a steady eco balance, there is a desire for products which are on the one hand made, where possible, from renewable starting materials and, on the other are biodegradable. One such starting material of natural origin which is available in large quantities is cedrene, which is present in various types of cedar wood.
As long as two decades ago, a series of secondary products of -(.alpha.)-cedrene (1) was prepared and fragrance properties described. In his book "Riechstoff und Geruchsinn" Fragrance and Sense of Smell! (Springer-Verlag, Berlin 1990, ISDN 3-540-52560-2, pages 170-172), G. Ohloff reports in summary that a series of commercial fragrances are derived from .alpha.-cedrene (1). In "Perfume and Flavor Chemicals" (No. 593-600, 602), S. Arctander describes several fragrances derived from cedrene.
The derivatives accessible from .alpha.-cedrene (1) by epoxidation, allyloxidation, esterification and etherification are sensorially desirable fragrances of the warm-woody odor type, some having an ambergris-type effect.

Cyclic cedrene acetals, their preparation and their use


The invention includes a coil support assembly having an insulator interfacing a surface of a shield disposed within a processing chamber. The insulator has an extension which extends through the shield. A second insulator is disposed between the shield and a coil and contacts a protrusion extending from the coil. A fastener is disposed through the first insulator and extends through the second insulator and into the protrusion. The fastener is electrically isolated from the shield by the first insulator. The invention includes coil assemblies containing the described coil support configuration. The invention further includes a method of supporting a coil within a processing chamber having a shield disposed therein. Insulators are inserted to extend from an outer side of the shield through a thickness of the shield. A coil is mounted within the chamber by inserting fasteners through each insulator into bosses which-protrude outwardly from the coil body.

Physical vapor deposition (PVD) is commonly utilized for formation of thin films or layers. For instance, PVD is commonly utilized for deposition of thin layers in semiconductor structures, with PVD being particularly useful for deposition of metallic materials. PVD processes are commonly referred to as sputtering processes and can comprise sputtering of desired materials from a target. The sputtered materials are deposited across a substrate to form a desired thin film.
An exemplary PVD operation is described with reference to an apparatus 10 shown in FIG. 1. Apparatus 10 is an example of an ionized metal plasma (IMP) apparatus and comprises a chamber 12 having sidewalls 14. Chamber 12 is typically a high vacuum chamber. A target 16 is provided in an upper region of the chamber and a substrate 18 is provided in a lower region of the chamber. Substrate 18 is retained on a holder 20 which can typically comprise an electrostatic chuck. Target 16 can be retained within the chamber with suitable supporting members (not shown) which can include a power source. A shield 22 can be provided to shield chamber walls from sputtered material. Shield 22 is typically made of a conductive material.
Target 16 can comprise, for example, one or more of aluminum, cadmium, cobalt, copper, gold, indium, molybdenum, nickel, niobium, palladium, platinum, rhenium, ruthenium, silver, tin, tantalum, titanium, tungsten, vanadium, stainless steel and zinc. These target materials can be in elemental, compound or alloy form. The target can be a monolithic target or can be part of a target/backing plate assembly.
Substrate 18 can comprise, for example, a semiconductor wafer such as a single crystal silicon wafer.
During physical vapor deposition, material is sputtered from a surface of target 16 and directed toward substrate 18. The sputtered material is represented by arrows 24. Generally, the sputtered material will leave the target surface in a number of different directions. This can be problematic and it is preferred that the sputtered material be directed relatively orthogonal to an upper surface of the substrate 18. Accordingly, a focusing coil 26 is provided within chamber 12. The focusing coil can improve the orientation of sputtered materials as depicted in FIG. 1 by arrows 24a. As shown, initially sputtered material can be redirected by passing through coil 26 to proceed relatively orthogonal to the upper surface of substrate 18.
Coil 26 is retained within chamber 12 by support members 30. Supports 30 can typically provide attachment of coil 26 to shield 22. Because shield 22 and coil 26 are each conductive, support structure 30 can typically provide electrical insulation between the shield and the coil.
Coil 26 can typically be formed from a conductive material which is generally the same as the target since material can be sputtered from the coil by plasma ions during deposition processing.
Exemplary prior art mounting assemblies and coil mounting configurations are discussed with respect to FIGS. 2 and 3. Referring initially to FIG. 2, coil 26 can be mounted within a processing chamber by providing a support assembly 30 which passes through shield 22. In the prior art coil mounting assembly shown in FIG. 2, coil body 27 has an opening 25 which passes through the thickness of the coil body. A pin 36 can be inserted through the coil body for mounting purposes. A spacer or cup 38 can be mounted externally on coil body 27 and can surround inner pin portion 36. Support assembly 30 can comprise a multi-piece configuration having a first insulative piece 31 that passes partially or completely through shield 22. First insulator 31 can contact cup portion 38. A second insulative piece 32 can be provided externally to shield 22 relative to first insulator portion 31.
When the depicted coil is mounted within a processing chamber, the coil can be spaced from shield 22 by cup portion 38 and first insulator 30 disposed between coil body 27 and an interior or first site 21 of shield 22. Second insulator 32 can typically be disposed entirely on an external side 23 of shield 22 and can interface the shield opposing first insulator 31.
Assembly 30 can further comprise a fastener 34 such as a bolt or screw as shown in FIG. 2. The fastener can extend through insulative support parts 32, 31 and can insert into centrally disposed pin portion 36 for mounting coil 26 within shield 22.
Coil 26 as shown in FIG. 2 is generally provided within the chamber as a kit comprising pins 36, retaining screws 34, cups 38, and insulative pieces 31 and 32 along with various other components (e.g. inner conductor components) which are not shown in FIG. 2. The coils utilized in such kits will comprise annular rings (referred to herein as annular bodies or annular coil bodies) having openings extending therethrough. Coil 26 will wear out with time and replacement kits are provided for replacement of the coil. Such kits will typically comprise a coil together with the numerous separate components for attaching the coil to the shield. The kit is assembled in order to provide the coil within the chamber and assembly typically comprises assembling the various components and inserting fastener 34 which is typically threadably engaged within an interior periphery of pin 36.
The coil structure shown in FIG. 2 is an exemplary pin and cup type prior art coil structure. Other pin and cup type structures and mounting configurations have been developed. For instance, monolithic coil structures have been constructed in which cups and inner conductors and/or the pin portion are one-piece with the coil. An advantage of forming monolithic coils structures is that such can eliminate utilization of pins and thereby eliminate discontinuities along an inner peripheral surface of a coil by eliminating the recessed pinhead otherwise present along the inner periphery of the coil. An advantageous of eliminating discontinuities from the inner periphery of the coil is that such can improve longevity of the coil and performance of the coil.
An exemplary prior art mounting assembly for utilization with a monolithic coil is depicted in FIG. 3. As shown, coil 26 has a protrusion or 'boss' 40 which is integral with coil body 27. Boss structure 40 can be configured to mimic a combination of pin and cup features such as those shown in FIG. 2. The boss configuration 40 shown in FIG. 3 is but an exemplary configuration and alternative boss shapes and structures have been developed. Mounting of a monolithic coil can typically utilize prior art support assemblies having a first insulative component 31 which extends through shield 22 as shown in FIG. 3. Insulator 31 can insulate a fastener 34 thereby electrically isolating the fastener from shield 22. The assembly can further comprise a second insulator disposed externally to shield 22 relative to internally disposed coil 26 and first insulator 31. Mounting of monolithic coil 26 can comprise insertion of fastener 34 through insulator portions 32 and 31 and threadably engaging fastener 34 into a threaded portion of boss 40.
Monolithic coil structures which have been produced have been utilized in modified physical vapor deposition apparatuses. In other words, the monolithic coil assemblies have not corresponded to assemblies which can be substituted for kit constructions utilized in conventional physical vapor deposition apparatuses, but instead have differences which make them suitable for apparatuses other than conventional apparatuses described above. Regardless of whether the coil kits comprise a monolithic coil and assembly as shown in FIG. 3 or the prior art pin and cup coil with the support assembly shown in FIG. 2, such prior art coil kits can be difficult to mount within a processing chamber. Pin and cup coil configurations and corresponding assemblies such as that shown in FIG. 2 can be difficult to mount due to the need to align and correctly assemble multiple pieces during the mounting process. Although the monolithic target shown in FIG. 3 reduces the number of pieces which must be simultaneously aligned during mounting, the limited space within the confines of shield 22 can make positioning and alignment of the coil within the shield extremely difficult. Typical prior art configurations of insulator parts 31 and 32 such as those depicted in FIGS. 2 and 3 can add to the difficulty in coil mounting.
It would be desirable to develop new configurations for coil support assemblies.

Single piece coil support assemblies, coil constructions and methods of assembling coil constructions


The benzene content of light reformate is reduced by selectively alkylating the toluene contained therein with olefins by contacting the light reformate with the olefins in a catalyst bed. The catalyst structure in the catalyst bed acts as both a catalyst for the alkylation reaction and as distillation structure thus immediately separating the reaction product from the reaction zone to prevent reverse reactions and increase the overall reaction rate. The alkylated toluene is then used to transalkylate benzene to reduce the amount of benzene in the gasoline.

The reduction in the lead content of gasolines and the use of lead anti-knock compounds has lead to a search for other ways to improve the octane number of blending components for gasoline. The alternatives to uses of lead anti-knock compounds are chemical processing and the use of other additives. Simultaneously with the reduction in lead has come the requirement that the benzene content of gasoline must be reduced.
One common process long used by the refinery industry to upgrade raw naphtha to high octane gasoline is catalytic reforming. In catalytic reforming the raw naphtha having a boiling range of circa 115.degree.-350.degree. F. is passed over an alumina supported noble metal catalyst at elevated temperatures (circa 920.degree.-950.degree. F.) and moderate pressure (circa 200-550 psig). The catalyst "reforms" the molecular structures of the hydrocarbons contained in the raw naphtha by removing hydrogen and rearranging the structure of the molecules so as to improve the octane number of the naphtha. However, the increase in octane number also reduces the liquid volume of the naphtha as the specific gravity is increased.
Because of the multiplicity of the compounds in the raw naphtha, the actual reactions which occur in catalytic reforming are numerous. However, some of the many resulting products are aryl or aromatic compounds, all of which exhibit high octane numbers. The aryl compounds produced depend upon the starting materials which in a refinery are controlled by the boiling range of the naphtha used and the crude oil source. One of the aryl compounds formed is benzene which as noted above is not desirable. One method suggested for reducing the benzene content of the reformate is to separate the benzene precursor (isohexane) from the feed to the catalytic reformer. See for example U.S. Pat. No. 4,975,179. This expedient, however, reduces the overall octane of the gasoline mixture.
The "reformed" product from a catalytic reforming process is commonly called reformate and is often separated into two fractions by conventional distillations--a light reformate having a boiling range of circa 115.degree.-250.degree. F. and a heavy reformate having a boiling range of circa 250.degree.-350.degree. F. The aryl compounds in each fraction are thus dependent upon their boiling points. The lower boiling or lighter aryl compounds, e.g., benzene, toluene and xylenes, are contained in the light reformate and higher boiling aryl compounds are contained in the heavy reformate.
A method of carrying out catalytic reactions has been developed wherein the components of the reaction system are concurrently separable by distillation using the catalyst structures as the distillation structures. Such systems are described variously in U.S. Pat. Nos. 4,215,011; 4,232,177; 4,242,530; 4,250,052; 4,302,356; and 4,307,254 commonly assigned herewith. Briefly, a structure described there is a cloth belt with a plurality of pockets spaced along the belt containing a particulate catalyst, which is then wound in a helix about a spacing material such as stainless steel knitted mesh. These units are then disposed in a distillation column reactor. In addition, commonly assigned U.S. Pat. No. 4,443,559 discloses a variety of catalyst structures for this use and is incorporated by reference herein.
It has been proposed to alkylate the aromatics, especially benzene, contained in a reformate stream utilizing the concurrent distillation/reaction method. See U.S. Pat. No. 5,082,990. The direct alkylation of benzene with ethylene or propylene has been quite difficult due to fast catalyst deactivation. One reason for the fast deactivation is the requirement for high conversion of benzene. In the concurrent reaction/distillation the depletion of the benzene in the reaction mass increases the concentration of olefin around the catalyst leading to fast catalyst deactivation. In other types of reaction systems the coexistence of toluene and other aromatics leads to the production of a large amount of higher alkylated aromatics, depressing the vapor pressure of the reaction mixture. In addition the high non-aromatic C.sub.6 's in the reformate make the alkylation of benzene more difficult. These hydrocarbons boil in about the same boiling range as benzene and are therefore difficult to separate from benzene without affecting the conversion of benzene.
However, there is almost three times as much toluene as benzene in the reformate and the alkylation of toluene with an olefin is relatively easy.

Process for the production of alkyl benzene


Methods and systems for enhancing a DVD-based game using a remote controller are provided. Example embodiments provide a DVD game remote controller “DGRC,” which provides input to DVD-based games, access to additional game functions and special features such as game hints, enhanced timing and scoring functions, die roll simulation, and support for buzz-in remotes. The buzz-in remotes provide automated support for turns in which multiple participants can respond to challenges. In one embodiment, the DGRC provides a transmitter, an integrated display screen, game-related selection buttons, navigation buttons, a roll button, a timer button, a score button, and a media slot. The DGRC also provides buzz-in remotes and a receiver for receiving signals therefrom.

1. Field of the Invention
The present invention relates to a remote controller for electronic games and, in particular, to a programmable remote controller for DVD-based electronic games and associated methods.
2. Background Information
Games that are played electronically, such as those played on a game console or computer system, are typically made available to potential game players on media targeted to portable game consoles; on media playable by personal computers, such as CDROMs and other portable media; or by downloading game software from a network. To date, personal computer ("PC") based games are typically individual games or games that are connected to other players (such as massive multi-player role based games) via one or more networks. Typically, the standard input devices used to control other aspects of the PC, such as a keyboard and mouse, are used to control the game. External input devices, such as joysticks, are sometimes integrated to enhance the gaming experience.
Multiplayer and portable game consoles, on the other hand, provide self contained environments, sometimes with wired controllers that allow one or more players to control a game displayed on a display screen attached to the console, such as a standard television ("TV"). A media containing the game and designed specifically to operate with the game console logic is loaded into the console, and the wired controller provides player input to control content display on the TV. Handheld game consoles are typically single player games that may display content and feedback on an integrated small LCD display. Examples, such as electronic versions of poker, puzzles, etc. abound. In general, these devices suffer in their ability to provide a rich, visual and auditory experience due to physical limitations of the game consoles.
To date, Digital Video Disc or Digital Versatile Disc ("DVD") technology has been used largely to play movies and to present other types of video content, oftentimes accompanied by audio. DVD technology was developed as an improvement over the sequential technologies previously available with Video Cassette Recorder technology, by providing an ability to access video segments on an "addressable" basis instead of sequentially, from the beginning of the media. However, to provide an optimal environment for the narrow purpose of playing videos such as movies, DVD technology imposes many constraints on the format of DVD media used to store the content and on the processing and storage capacities of DVD players. The only functions that a DVD player is really meant to perform are to play videos (with or without audio), to present menus, which upon selection of an item, enable the video player to navigate to play a different video segment, and to support general playback control such as speed control, skip to next content segment, etc. A DVD medium that stores such content is hereinafter referred to as a "DVD" and the machine or system used to play/present the DVD content referred to as a "player" or a "DVD player." Board games have been developed that integrate the use of a DVD player to incorporate content from a DVD much as a game participant would select a next card from a game-specific set of cards. Examples include games such as Trivial Pursuit® DVD Pop Culture Edition by Hasbro, which adds media questions selectable from a DVD in addition to traditional card selection.


A flashlight includes a main member having top, a bottom, a front and a rear. The main member has a base a head and battery pack, wherein the head is pivoted on the base via a pivot to be flexed to the front. A first light source and a second light source are mounted on the head, wherein the second light source projects light that is substantially to that of the first light source. A hook is provided in a tunnel in the base to be drawn out or pushed into. The first and second light sources and the flexion of the head provide a greater illumination range and a function of adjusting the illuminating direction when it is hung.

1. Field of the Invention
The present invention relates generally to an illuminating device, and more particularly to a flashlight with greater illumination range and capable of changing the illuminating direction when it is hung.
2. Description of the Related Art
A conventional flashlight to illuminate narrow workplace includes a handle, a shell on an end of the handle, a wire with a plug on the other end of the handle and a light bulb in the shell. The shell includes a plate and a metallic net. The shell protects the light bulb and lets the light emitting out via the net. The flashlight usually is provided with a hook on the shell or on the handle, such that workers may hang the flashlight on a wall or other suitable place to work with both hands. As long as the flashlight is hung on a place, the orientation of illumination is fixed. To adjust the orientation of illumination of the flashlight, worker has to hang the wire on another place to lean the flashlight. If there were no suitable place to hang the wire, the flashlight cannot illuminate the desire place. Furthermore, the wire always slips because there is no device on the wire for hanging.


A fitted bed sheet having a storage pocket at each side wall at a location readily accessible to a person while in bed. A closure in the form of a zipper closes the top of the pocket while a lock may secure the zipper in the closed condition. A flap is pivotably connected above the pocket to overlay and conceal the zipper.

This invention relates to bed sheets, and more particularly to bed sheets having at least one storage pocket formed at a side thereof.
Frequently it is desirable to store articles at bedside in a secure location. If, for example, such articles or objects are located on a night stand or the like adjacent to a bed, the object is unnecessarily accessible to uninvited persons such as a child, an intruder or other uninvited persons such as a burglar. For example, with the high crime rate in society, some persons do not feel comfortable going to bed without some protective device such as a can of disabling spray or firearm. Clearly, devices such as these should be maintained in a secure location and not be readily available to the unwelcomed visitor or a child. However, if the device is locked away, it is not readily available when needed. It is thus desirable to provide a storage location for storing such articles, objects or devices for ready accessibility to a person while in bed but which is secure against intruders.


A baseball swing training aid includes a housing and a lid for retaining a batting tee in a first or storage configuration and in a second or use configuration. In the first configuration, the batting tee is stowable on an underside of the lid such that the tee does not interfere with the lid's attachment to the housing. In the second configuration, the batting tee base attaches to a slot formed in the lid to extend the tee upwardly for baseball swing training. Accordingly, the tee is easily changeable between the first and second configurations for fast setup, storage or transportation.

The present invention generally relates to a baseball swing training aid. More particularly, the present invention relates to a baseball swing training aid having a collapsible tee for storage within the lid of the corresponding container.
Baseball tees designed to aid in the training of a batting swing are generally known in art. For example, U.S. Pat. No. 4,176,838 to Griffin discloses a baseball batting tee having a self-righting, semi-spherical weighted bottom portion with an axially upstanding post removably fixed thereto. An inverted conical helical spring attached at the top of the post is configured for reception of a ball thereon. The semi-spherical weighted bottom portion helps maintain the post in a substantially upright position as a batter swings through the ball. The weighted bottom portion helps offset any force against the post in the event that the tee is struck during the course of a swing. But, the tee disclosed in the '838 patent is not collapsible for easy portability or storage.
In another example, U.S. Pat. No. 5,672,124 to Pecoraro discloses an automatic batting tee apparatus having a housing capable of gravity feeding a plurality of balls onto an associated tee. Reloading the top of the tee is accomplished by actuating a lever mechanism that dispenses a ball from the housing and onto the tee. The balls are fed through this housing during operation, but the tee itself is not able to store balls within its housing during transportation.
Moreover, U.S. Pat. No. 6,413,175 to Mooney discloses a batting tee having a ball mount position lower relative to the other batting tee components. The batting tee includes a base, an upright support, and a swing arm wherein the mount for the ball is integral to the end of the swing arm opposite the end mounted to the upright support. The swing arm is pivotally and telescopically movable relative to the upright so that the vertical height of the ball position may be varied. Most notably, this batting tee is bulky and incapable of storing balls.
Lastly, U.S. Pat. No. 6,682,445 to Tanner discloses a durable batting tee having an elongated split washer to provide friction between telescoping parts in the stem without requiring tightening adjustments by a user. While the disclosed batting tee is collapsible, the tee is not capable of storing a number of balls therein for portability.
Accordingly, there is a need for a baseball swing training aid that is collapsible and capable of storing a plurality of balls therein to increase portability. Such a baseball swing training aid should also be compact to ease transportation and storage. There is an additional need for a baseball swing training aid that is easily movable between storage and use configurations and that relies on minimal support for maintaining the tee in an upright configuration. Accordingly, such a baseball swing training aid should include a collapsible tee storable within the container lid to prevent interference with the balls stored within the container during storage. There is a further need for a baseball swing training aid that is economical and easy to manufacturer. The present invention fulfills these needs and provides further related advantages.


A new cultivar of hybrid Echinacea, ‘Irresistible’, characterized by its anemone-type inflorescences with orange colored ray florets and red-orange disk florets, its stems that are strong, upright and purple in color, and its resistance to viral diseases.

The present Invention relates to a new and distinct cultivar of Echinacea purpurea and will be referred to hereafter by its cultivar name, 'Irresistible'. 'Irresistible' represents a new purple coneflower, an herbaceous perennial grown for landscape use.
The new cultivar arose from an ongoing breeding program conducted by the Inventor in a designated field at his nursery in Warmond, The Netherlands. In 2006, the Inventor pollinated the cultivar 'Razmatazz' (U.S. Plant Pat. No. 13,894) with pollen collected from numerous unnamed and unpatented selections of Echinacea purpurea with orange colored ray florets (single) and selections with semi-double inflorescences. The exact male parentage is unknown. 'Irresistible' was selected by the Inventor as a single unique plant amongst the resulting seedlings in June of 2008.
Asexual reproduction of the new cultivar was first accomplished by in vitro propagation in Rijswijk, The Netherlands in 2008 under the direction of the Inventor. The characteristics of this cultivar have been determined to be stable and are reproduced true to type in successive generations.


A pulse width modulation circuit includes a first electric-charge accumulator; a second electric-charge accumulator; a first current generator which generates a first current corresponding to the amplitude of an input AC voltage; a second current generator which generates a second current with a constant value; a first current supply controller which supplies the first current to the first electric-charge accumulator; a second current supply controller which supplies the second current to the first electric-charge accumulator; a third current supply controller which supplies the first current to the second electric-charge accumulator; a fourth current supply controller which supplies the second current to the second electric-charge accumulator; and a current limiter which limits the first current to a third current with a predetermined current value, if the amplitude of the AC voltage in the negative side exceeds a predetermined level.

1. Field of the Invention
The present invention relates to a pulse width modulation circuit which converts, for example, an audio signal into a pulse-width modulated signal having a constant period and having a duty ratio varying with the amplitude of the audio signal and then outputs the pulse-width modulated signal and, also, relates to a switching amplifier (for example, an audio amplifier) using the same.
2. Description of the Related Art
Conventionally, there have been suggested pulse width modulation circuits for converting an AC voltage signal such as an audio signal into a pulse-width modulated signal with a duty ratio varying with the amplitude of the AC voltage signal. For example, in JP-A No. 2007-89122, there is suggested a pulse width modulation circuit which employs a monostable multivibrator. Further, the present applicant has suggested a pulse width modulation circuit of a type employing no monostable multivibrator (refer to, for example, Japanese Patent No. 4,100,455).
FIG. 11 is a circuit diagram illustrating the schematic structure of the pulse width modulation circuit which has been suggested by the present applicant. Further, FIG. 12 and FIG. 13 are timing charts illustrating the voltage waveforms of respective signals in the pulse width modulation circuit illustrated in FIG. 11. Further, FIG. 12 and FIG. 13 mainly illustrate waveforms during operations for charging and discharging a first capacitor C11.
The pulse width modulation circuit 51 illustrated in FIG. 11 includes a reference-clock generation circuit 54, a dead-time generation circuit 55, a trailing-edge detection circuit 56, a charging-current generation circuit 57, a discharging constant-current source 58, a current bypass circuit 59, first to fourth switches SW11 to SW14, a first and second capacitors C11 and C12, a first and second RS flip flop circuits 60 and 61, and a signal output circuit 62 constituted by a NAND circuit.
In the pulse width modulation circuit 51 illustrated in FIG. 11, the charging-current generation circuit 57 generates, from an audio signal es, a current signal Ij (hereinafter, referred to as a "charging current Ij") for charging the first and second capacitors C11 and C12, and the reference-clock generation circuit 54 generates a reference clock MCLK.
The charging current Ij is expressed as Ij=Ic±Δi. The bias voltage at the output terminal of an OP amplifier 63 is determined by −Vcc and resistance devices R11 and R12, and Ic(>0) is determined by this bias voltage, a resistance device R14, a transistor Q11 and a voltage 64. Further, ±Δi is the current resulted from the voltage-to-current conversion performed on the audio signal es (the AC voltage signal).
The dead-time generation circuit 55 generates, on the basis of the reference clock MCLK, a first switching signal φ1 for controlling the operation for charging the first capacitor C11 and a second switching signal φ2 for controlling the operation for charging the second capacitor C12 (see FIGS. 12 (b) and (c)). The first RS flip flop circuit 60 generates a third switching signal φ3 for controlling the operation for discharging the first capacitor C11 (see FIG. 12(f)), and the second RS flip flop circuit 61 generates a fourth switching signal φ4 for controlling the operation for discharging the second capacitor C12.
The first capacitor C11 is charged by being supplied, through the first switch SW11, with the charging current Ij (=Ic±Δi) from the charging-current generation circuit 57 during the time intervals during which the first switching signal φ1 is ON (the time intervals during which it is at a high level). Through this charging, the voltage across the first capacitor C11 is raised from a voltage Va to a voltage Vc corresponding to the amplitude E of the audio signal es (hereinafter, referred to as a "charging end voltage Vc") during each time interval during which the first switching signal φ1 is ON (see FIGS. 12(b) and (e)). Further, FIG. 12(e) illustrates a voltage waveform L1 which has a charging end voltage Vc of Vm and, further, illustrates voltage waveforms L2 and L3 which have a charging end voltage Vc of Vcc.
During each OFF time interval (each low-level time interval) of the first switching signal φ1, if a first set signal set1 (a signal which momentarily descends to a low level) resulted from the detection of the trailing edge of the first switching signal φ1 (the inversion to the low level) by the trailing-edge detection circuit 56 is inputted to the set terminal of the first RS flip flop circuit 60, this causes the third switching signal φ3 outputted from the one of the terminals of the first RS flip flop circuit 60 to be inverted to a high level, which causes the third switch SW13 to supply a constant current Id (hereinafter, referred to as a "discharging current Id") from the constant-current source 58 to the first capacitor C11, thereby starting discharging the first capacitor C11 (see FIG. 12(d), (e) and (f)).
When the voltage across the first capacitor C11 has decreased from the charging end voltage Vc to a predetermined threshold voltage Vth (a threshold voltage for distinguishing between the high level and the low level of the first RS flip flop circuit 60) after the start of the discharging, this voltage is inputted as a first reset signal res1 to the first RS flip flop circuit 60, which inverts the third switching signal φ3 to the low level, thereby causing the third switch SW3 to electrically separate the constant-current source 58. Even when the third switching signal φ3 has been inverted to the low level, there is a short time lag until the OFF operation is actually performed on the third switch SW13, thereby decreasing the voltage across the first capacitor C11 to a voltage Va which is slightly lower than the threshold voltage Vth during this time lag. This voltage Va is maintained until the end of the OFF time interval of the first switching signal φ1 (the discharging time interval) (see FIGS. 12(e) and (f)) and becomes the charging start voltage in the next charging time interval.
Accordingly, the voltage Va becomes the voltage at the start of charging (hereinafter, referred to as "the charging start voltage Va") in each ON time interval (charging time interval) of the first switching signal φ1 and becomes a reference voltage for raising the voltage across the first capacitor C11 to the charging end voltage Vc corresponding to the amplitude E of the audio signal es.
The output rsout1 which is outputted from the other output terminal of the first RS flip flop circuit 60 is inverted to the low level if a first set signal set1 is inputted thereto and, thereafter, is inverted to the high level if a first reset signal res1 is inputted thereto. Namely, during each discharging time interval, the first RS flip flop circuit 60 outputs, from the other output terminal, an output rsout1 constituted by a pulse signal with a pulse width equal to the discharging time interval for the first capacitor C11 (the time interval required for decreasing the voltage thereacross from the charging end voltage Vc to the threshold voltage Vth) (see FIG. 12(g)).
The same charging and discharging control as that for the first capacitor C11 is performed for the second capacitor C12 and, during each discharging time interval, the second RS flip flop circuit 61 outputs, from the other output terminal, an output rsout2 constituted by a pulse signal with a pulse width equal to the discharging time interval for the second capacitor C12 (the time interval required for decreasing the voltage thereacross from the charging end voltage Vc to the threshold voltage Vth).
The operations for charging and discharging the second capacitor C12 are controlled on the basis of the second switching signal φ2 and, accordingly, the charging and discharging time intervals therefor are deviated from the charging and discharging time intervals for the first capacitor C11 by half the period of the reference clock MCLK. Accordingly, the pulse signal of the output rsout1 and the pulse signal of the output rsout2 are alternately generated in each half cycle of the reference clock MCLK.
Further, the signal output circuit 62 outputs a pulse-width modulated signal PWMout generated by synthesizing the output rsout1 and the output rsout2 (see 12(h)).
Further, the solid line L1 illustrated in FIG. 12(e) indicates a waveform during charging and discharging of the first capacitor C11, indicating a waveform in the case where the audio signal es is a non signal (Δi=0). In the case where the audio signal es is a non signal (Δi=0), the first capacitor C11 is charged with a DC bias current Ic, and this DC bias current Ic is set such that the charging end voltage Vc is a voltage Vm intermediate between the power supply voltage Vcc and the threshold voltage Vth of the first RS flip flop circuit 60 (which is nearly equal to (Vcc−Vth)/2, hereinafter, referred to as a "intermediate voltage Vm").
When the amplitude E of the audio signal es is positive (Ij=Ic+Δi), the slope of the charging waveform becomes more abrupt than that of the solid line L1 according to the value of the amplitude E and, if the amplitude E of the audio signal es exceeds a predetermined level (this level is assumed to be "+Es"), as illustrated by a chain line L2 and a two-dot chain line L3, the charging end voltage Vc is continuously clipped to substantially the power supply voltage +Vcc for the first RS first flip circuit 60 (more accurately, the power supply voltage +Vcc plus the forward voltage of the protective diode incorporated in the input terminal of the NAND circuit) and, therefore, is fixed. Accordingly, when the amplitude E of the audio signal es at its positive side is excessively larger, the pulse width of the pulse-width modulated signal PWMout is fixed, regardless of the value of the amplitude E.
On the other hand, when the amplitude E of the audio signal es is negative (Ij=Ic−Δi), the slope of the charging waveform becomes more moderate than that of the solid line L1 according to the value of the amplitude E and, if the amplitude E of the audio signal es exceeds a predetermined level (this level is assumed to be "−Es"), the charging current Ij is clipped to "0" and, therefore, the charging and discharging waveforms are as illustrated in FIG. 13(e).
In this case, the voltages across the first capacitor C11 and the second capacitor C12 are not raised to equal to or higher than the threshold voltage Vth during the respective charging time intervals. This makes it impossible to generate, during the respective discharging time intervals, an output rsout1 and an output rsout2 having pulse signals with pulse widths corresponding to the discharging time intervals. This prevents the pulse-width modulated signal PWMout from being pulse signals, thereby causing the pulse-width modulated signal PWMout to be fixed to a low level as illustrated in FIG. 13(h).
The method for generating a pulse-width modulated signal PWMout with the pulse width modulation circuit 51 illustrated in FIG. 11 is based on that the discharging time intervals for the first and second capacitors C11 and C12 in the respective discharging time intervals are made corresponding to the amplitude E of the audio signal es, and the discharging time intervals are determined by the charging end voltage Vc with respect to the charging start voltage Va across the first and second capacitors C11 and C12. Therefore, it is important that the charging start voltage Va in each charging time interval is stabilized, no matter how the amplitude E of the audio signal es varies, even in cases where the amplitude E is clipped.
However, if the amplitude E of the audio signal es becomes negatively excessive to such an extent that it falls within the range of E<−Es, the charging current Ij is decreased to about 0 and, if this state is continued, as illustrated in FIG. 13(e), the first capacitor C11 and the second capacitor C12 are not charged to such an extent that the voltages across them are raised from the charging start voltage Va to equal to or higher than the threshold voltage Vth during the respective charging time intervals. Accordingly, during the discharging time interval subsequent to each discharging time interval, discharging time is not generated, which causes the level of the pulse-width modulated signal PWMout to be continuously maintained at a low level (see the waveform of FIG. 13(h)).
At the state where the level of the pulse-width modulated signal PWMout is fixed to the low level, the sounds generated by replaying the pulse-width modulated signal PWMout are distorted. The waveform of the pulse-width modulated signal PWMout itself reflects the audio signal es having the amplitude E clipped to −Es. Accordingly, this phenomenon is not a problem specific to the aforementioned method for generating a pulse-width modulated signal PWMout. However, the phenomenon that the voltages across the first and second capacitors C11 and C12 are not raised to equal to or higher than the threshold voltage Vth during the respective charging time intervals degrades the stability of the charging start voltage Va, which is an important problem for the aforementioned method for generating a pulse-width modulated signal PWMout.
More specifically, during a time interval T1 in FIG. 13, at a state where the audio signal es is negatively excessive (a state of es<−Es), if the charging current Ij is substantially 0, the first capacitor C11 is not charged, and the voltage thereacross is maintained at the charging start voltage Va until the end of the charging. Further, at the timing when the first switching signal φ1 descends, a first set signal set1 momentarily turns on the third switching signal φ3, which causes the third switch SW3 to be kept at the ON state during this ON time interval, thereby discharging the electric charge accumulated in the first capacitor C11 and decreasing the voltage across the first capacitor C11 to slightly below the charging start voltage Va.
During the time interval T2 and the time interval T3 subsequent to the time interval T1, no discharging operation and no charging operation are performed substantially, which causes the voltage across the first capacitor C11 to be maintained at a voltage Va′ which is slightly lower than the charging start voltage Va, and this voltage Va′ becomes the charging start voltage in the time interval T4 subsequent to the time interval T3. Further, during the time interval T4, the same operations as those in the time interval T1 are performed again, which causes the voltage across the first capacitor C11 to be decreased to a voltage slightly lower than the voltage Va′. Thereafter, the same phenomenon is repeated, which causes stepwise decreases in the charging start voltage across the first capacitor C11, from the initial charging start voltage Va. The aforementioned phenomenon occurs similarly for the second capacitor C12, and the charging start voltage across the second capacitor C12 is decreased in a stepwise manner from the initial charging start voltage Va.
The charging start voltage Va across the first and second capacitors C11 and C12 is decreased in a stepwise manner during each single cycle of the first switching signal φ1 and the second switching signal φ2. Accordingly, if a state where the amplitude E of the audio signal es is negatively excessive is continued over several cycles to several tens of cycles, this will induce greater amounts of decreases in the voltages across the first and second capacitors C11 and C12 from the charging start voltage Va. Even if the amplitude E of the audio signal es is restored to the normal state (the state of −Es<E<0) from the state where it is negatively excessive (a state of E<−Es), the voltages across the first capacitor C11 and the second capacitor C12 may not be raised to equal to or higher than the threshold voltage Vth from the charging start voltage (<Va) during the charging time intervals, depending on the charging current Ij (=Ic−Δi) at this time.
For example, as illustrated in FIG. 14, when the charging start voltage across the first capacitor C11 has decreased to Va1 (<Va) at the time the amplitude E of the audio signal es is restored to the normal state (the state of −Es<E<0) from a state where it is negatively excessive (E<−Es), if the first capacitor C11 were charged with the charging current Ij from the charging start voltage Va during a charging time interval Ta, the charging end voltage Vc would become higher than the threshold voltage Vth, as illustrated by the waveform of a chain line, but, as illustrated by a solid line, the charging is started from the voltage Va1 and the charging end voltage Vc does not reach the threshold voltage Vth and, in this case, no discharging time t can be provided during the discharging time interval TB, thereby maintaining the pulse-width modulated signal PWMout at the low level.
Further, the charging start voltage Va across the first capacitor C11 is changed from Va1 to Va2 (Va1<Va2<Vth) during the discharging time interval TB and, then, the first capacitor C11 is charged with the charging current Ij from the voltage Va2 during the next charging time interval TC and, even if the charging end voltage Vc exceeds the threshold voltage Vth, the discharging time interval t′ detected during the discharging time interval TD is shorter than the normal discharging time interval t″. Accordingly, the pulse of the pulse-width modulated signal PWMout generated on the basis of this discharging time interval t′ does not correspond to the amplitude E of the audio signal es.
Namely, due to the stepwise decreases of the charging start voltage Va, the responsivity of the pulse-width modulated signal PWMout is delayed by at least the time intervals TA to TD (corresponding to two cycles of the reference clock MCLK), at the time the amplitude E of the audio signal es is restored to the normal state (the state of −Es<E<0) from the state where it is negatively excessive (the state of E<−Es). This induces the inconvenience that the state where the reproduced sounds are distorted is continued over the lag time interval.
The present invention was made in view of the aforementioned circumstances and aims at providing a pulse width modulation circuit capable of, even if an input AC signal becomes negatively excessive, outputting normal pulse-width modulated signals immediately without inducing a time lag, when the input AC signal is restored from the state where it is excessive to a normal state and also at providing a switching amplifier which incorporates the pulse width modulation circuit.

Pulse width modulation circuit and switching amplifier using the same


A thermoconductive curable liquid polymer composition including (A) a curable liquid polymer, (B) a filler made from a thermally-elongatable shape-memory alloy, and (C) a thermoconductive filler other than (B). A semiconductor device having a semiconductor element glued or coated with the thermoconductive curable liquid polymer composition.

Curable liquid compositions that contain thermoconductive fillers find application in the manufacture of electrical and electronic devices as heat-radiating adhesives, potting agents, or protective coatings. In particular, a curable liquid silicone composition comprising a liquid organopolysiloxane with at least two alkenyl groups in one molecule, a liquid organopolysiloxane with at least two silicon-bonded hydrogen atoms in one molecule, a hydrosilylation reaction metal catalyst, and a thermoconductive filler is suitable for forming cured bodies of low internal stress and excellent thermal conductivity. Therefore, this composition finds application in the manufacture of heat-removing adhesives placed between the semiconductor elements and heat-dissipation fins, as well as in the production of protective coating agents, potting agents, and heat-removing adhesives used in electric and electronic parts and devices.
It is not unusual that for further increase in thermal conductivity of the aforementioned thermoconductive liquid composition, it is combined with an additional amount of a thermoconductive filler. However, an increase in the content of a thermoconductive filler increases viscosity of the composition, which impairs conditions for the discharge of the composition from dispensing devices, such as syringes, and does not provide stability of the shape after application.

Thermoconductive curable liquid polymer composition and semiconductor device produced with the use of this composition

Dow Corning Toray Silicone Company, Ltd.


A stabilized aluminum/zirconium/glycine salt comprising a Betaine of Formula I as additive:

A variety of uses of betaines with long chains can be found in the surfactant art. The Betaine of this invention, however, is not a surfactant and has been found to have properties important to the field of antiperspirant salts that contain aluminum and zirconium.
The term "betaine" is used in a variety of ways. In particular, a variety of uses of betaines with long chains can be found in the surfactant art. Such betaines may be represented by the following Formula A where n>0:
The methyl groups can be replaced with other longer chain alkyls and can be straight chain or branched.
The Betaine (defined below) used in this invention is a natural product found in a number of plants in the Chenopodiaceae family, and also in fish and selected legumes. Extracted most often from sugar beets (Beta Vulgaris), it is reported as an extremely versatile molecule with a wide range of applications: food supplement, anti-irritant, skin moisturizer, skin-softening agent, skin-conditioning agent, promoter of wound healing and component in cosmetic compositions for skin aging and stressed skin.
The invention comprises a stabilized antiperspirant salt which is an aluminum/zirconium/glycine salt in combination with Betaine of Formula I:

Betaine in IUPAC nomenclature is 1-carboxy-N,N,N-trimethylmethanaminium hydroxide-inner salt, with alternative names including carboxymethyl-trimethylammonium betaine or (carboxymethyl)trimethylammonium hydroxide-inner salt or glycine betaine or glycoll betaine or glycyl betaine or trimethyl glycine or trimethylglycoll. For convenience here the material of Formula I will be referred to as Betaine.
Betaine appears in numerous patents, with a wide range of applications.
PCT Publication WO 00/67726 describes host-guest processes and formulations for delivering bio-affecting compounds. The invention relates to processes of making a composition having a host compound capable of accepting one or more bio-affecting guest compounds, and topical compositions for cosmetic or pharmaceutical uses formed by the processes. The processes comprise mixing, in any order: (i) a nonionic surfactant; (ii) an amphoteric surfactant; (iii) a solvent for the amphoteric surfactant; (iv) an aromatic compound; (v) an aluminum cation; (vi) a Lewis acid that is not a Bronsted-Lowry acid; and (vii) a Bronsted-Lowry acid.
U.S. Pat. No. 5,877,143 describes a composition containing a lamellar liquid crystalline phase which comprises betaines and amine oxides. This is a pumpable, fluid composition of amine oxide, betaine and/or sultaine is prepared with active concentration of about 36–45% of these materials by the addition of alkaline earth or aluminum salts.
German Patent DE 19725087 is related to cosmetic and dermatologic oil-in-water emulsion formulations for light protection containing hydrophobic inorganic micropigments and hydrophilic surfactants. Formulations containing suspended hydrophobic inorganic pigment microparticles in the oil phase as photoprotectants are stabilized against phase separation, migration of pigment particles into the aqueous phase, and agglomeration of the pigment particles by inclusion of a hydrophilic surfactant such as an alkyl glucoside, acyl lactylate, betaine, or coco amphoacetate, preferably together with a co-emulsifier and a water-sol. or oil-sol. UV-B filtering agent.
PCT Publication WO 97/23594 describes skin cleanser compositions with enhanced antimicrobial activity. The title compounds, useful for cleansing the skin and deposition of an antimicrobial agent onto the skin, comprise 0.1–30% of an amphoteric, zwitterionic, nonionic, anionic and/or cationic emulsifier, 0.00001–5% of an Ag compound deposited on a particulate inert support material as antimicrobial agent, and H2O. Cetyl betaine is used.
Swiss Patent CH 687126 relates to cosmetic compositions containing vegetable extract and trace elements complexes. Described are cosmetic compositions containing vegetable extract and trace elements complexes based on calcium and magnesium. Cocamidopropyl betaine is used.
Japanese Patent JP 52093633 describes chemical polishing solutions for aluminum and its alloys. Myristylbetaine is used.
British Patent GB 2354771 relates to bactericide combinations in detergents. The detergent comprises a bactericide in combination with an anionic, cationic, nonionic or amphoteric surfactant which has a C12–18 alkyl group as the longest chain attached to the hydrophilic moiety.
Japanese Patent JP 2001163752 describes cosmetics containing glossy polymer powders and antiperspirants. This invention relates to long-lasting cosmetic makeup compositions comprising plate-type glossy polymer powders and antiperspirants.
European Patent EP 1005853 describes the use of betaines as antiperspirants. Mono-, di-, and trimethylammonio-substituted carboxylic acids R1R2R3N+(CH2)nC(O)O— (R1—R3═H, Me; n=1–10) are active as antiperspirants and are compatible with the skin and with other conventional constituents of antiperspirant and deodorant compositions.
European Patent EP 1005852 describes the use of functionally substituted betaines as antiperspirants. Mono-, di-, and trimethylammonio-substituted carboxylic acids R1R2R3N+(CH2)nCHX(CH2)mC(O)O— and/or X(CH2)nCH(N+R1R2R3)(CH2)mC(O)O— (R1–R3=H, Me; m, n=1–8) are active as antiperspirants and are compatible with the skin and with other conventional constituents of antiperspirant and deodorant compositions.
Japanese Patent JP 11130652 discloses skin-conditioning and -moisturizing cosmetics containing clay minerals and low-molecular-weight betaines.
German Patent DE 2610225 describes aluminum salts of Betaine chloride being useful as ulcer inhibitors, for treatment of gastritis, to promote wound healing, and as antiperspirants and deodorants.
PCT Publication WO 01/62222 describes cosmetic compositions containing phospholipids and quaternary amines. The invention relates to a cosmetic composition, especially for use on aging and/or stressed skin, the composition comprising, in addition to water, at least one substance that forms lamellar structures with water. The composition further comprises (a) at least one compound that contains a functional group —CH2—N+—(CH3)3; (b) and/or at least one metabolite of the compound;.
PCT Publication WO 01/47479, owned by the same owner as the present case, describes cosmetic moisturizing compositions containing quaternary ammonium compounds. A composition useful for moisturizing skin which comprises (a) a moisturizer such as Me3N+X−1 (X═CH2OH or, CHOHCH2CO2—, or mixtures and when X does not bear a negative charge, the compound is a salt) and a skin compatible carrier.
PCT Publication WO 01/39730 describes a cosmetic composition containing peat and Betaine suitable for cosmetic masks for the face, chin and/or scalp.
PCT Publication WO 97/46246 is related to complex preparations containing Betaine. Preparations, especially for topical use in these preparations, penetrates deep into the tissues where it stimulates cellular and physiological processes.
PCT Publication WO 91/18588 presents a method of reducing the irritating properties of a cosmetic composition by addition of Betaine derivatives.
Japanese Patent JP 03033266 describes modified fabrics for controlling pH change in skin during sweating such as those treated with a mixture including dodecyl betaine (I) 10.
Thus, Betaine is described as an antiperspirant, deodorant, anti-irritant, skin moisturizer, skin-softening agent, skin-conditioning agent, promoter of wound healing, component in cosmetic compositions for skin aging and stressed skin, anti-inflammatory and tissue regenerating agent in topical skin care compositions, pH control agent on fabrics during sweating, component in detergent compositions with bactericide action, component in collagen type I activating complex in skin, surfactant in sunscreen compositions, complexing agent in aluminum liquid crystalline phases, and complexing agent for aluminum in chemical polishing solutions.

Aluminum / zirconium / glycine antiperspirant actives stabilized with Betaine

Abstract: in a sufficient amount to have (a) an overall (Betaine+glycine)/Zr ratio in the range of 0.1–3.0:1, (b) a ratio of Betaine to glycine of at least 0.001:1; and (c) sufficient Betaine so that at least 0.1% of the ratio of Betaine+glycine is contributed by Betaine.


A vector processor includes an instruction fetching unit configured to acquire an instruction, a decoding/issuing unit configured to decode the instruction and issuing the instruction, an operation group configured to include a plurality of operation units and a register configured to store the element data column, wherein the plurality of operation units include a first operation unit processes a first type instruction and a second operation unit processes a second type instruction and the first type instruction; and when a plurality of divided instructions, for which the element data of an instruction to be issued has been divided, are processed by the second operation unit, in a case where the second type instruction is not present, the decoding/issuing unit issues the divided instructions, and in a case where the second type instruction is present, the decoding/issuing unit issues the instruction to be issued without performing division.

A vector processor is used for vector processing in which a constant operation is repeated on a large quantity of element data forming an array. By means of a vector processor, element data of an array can be processed continuously using a single instruction, and high operation throughput can be obtained.
A vector processor has for example load/store and operation pipelines. An operation pipeline performs a single operation instruction fetch and decoding, sequentially and continuously reads out element data from a register (hereafter called a vector register), and executes arithmetic operation or other operation. The operation pipeline stores element data indicating the operation result in a vector register in the order of processing.
In a vector processor, operation instructions are processed for element data with different bit widths (for example, 8 bits, 16 bits, 32 bits, 64 bits, or similar). In general, an operation pipeline has a plurality of operation units each of which perform prescribed bit operations, and performs operation processing for a plurality of arrays in one cycle. Hence when the bit widths of element data differ depending on the operation instruction, the number of arrays of element data processed in one cycle also differ depending on the operation instruction. In a vector processor, the number of arrays of element data for each instruction is set to be the same, and so when the bit widths of element data are different depending on the operation instruction, the number of processing cycles for the operation instruction differs with the operation instruction. For example, under prescribed conditions, a half-word instruction with a bit width of 16 bits requires four cycles, whereas a full-word instruction with a bit width of 32 bits requires eight cycles.
In this way, when processing operation instructions for element data with different bit widths, delays in issuing subsequent operation instructions may occur. For example, subsequent to a preceding full-word instruction (for example, eight cycles), a half-word instruction (for example, four cycles) may be processed. Further, at this time the subsequent half-word instruction is assumed to process element data which is processed in the latter-half four cycles among the element data processed by the preceding full-word instruction.
At this time, in the cycle immediately after the preceding full-word instruction is issued, when the subsequent half-word instruction is issued, in the preceding full-word operation instruction, processing of the element data which is to be processed in the subsequent half-word instruction is not ended. Hence the vector processor waits for the end of processing of the element data, and issues the subsequent half-word instruction. As a result the issuing of the subsequent half-word instruction is delayed, and operation throughput falls.
Hence when a vector processor has a plurality of operation pipelines, a full-word instruction requiring numerous processing cycles is for example divided into two operation instructions, and the divided operation instructions are processed using separate operation pipelines. By this means, processing of element data which is to be processed in a subsequent half-word instruction ends more quickly, and the vector processor can issue the subsequent half-word instruction earlier. As a result, reductions in operation throughput are suppressed.
In a vector processor having a plurality of operation pipelines, when operators with a large circuit scale such as multipliers or operators with low frequency of use are all implemented in operation pipelines, the circuit scale of the processor as a whole becomes large. Hence operators with a large circuit scale and operators with low frequency of use are implemented in only a portion of operation pipelines among the plurality of operation pipelines.
Vector processors are for example described in Japanese Patent Publication No. 2544770 and Japanese Patent Application Publication No. 2009-193378.

Vector processor and vector processor processing method


A serial in random out memory circuit has a number of memory cells integrated with write control circuitry for writing a sequence of data inputs to sequential locations in the memory cells. Read control circuitry is integrated to receive address signals from an external device and provide a random access read output from the memory cells, mapped into an address range of the external device. Compared to circuits using discrete components and conventional RAM chips, the integrated SIRO can enable some of the circuitry or external software to be dispensed with and so reduce costs or increase performance. The memory cells can be arranged in a number of blocks, selectable one at a time for mapping to the external device address range.

1. Field of the Invention
This invention relates to integrated circuit memory devices and to corresponding systems and methods of operating.
2. Discussion of the Related Art
Communication systems that have to process data streams require memories to hold incoming and outgoing data. Due to the irregular flow of data streams, e.g. packets of data arriving at irregular time intervals, this data is held often in temporary storage until the main processor is ready to retrieve it and process it. Known memory types include the following:
FIFO: (First in First out) Allows storing incoming data until needed, or ready to process. Its main drawback is that when the data is needed it still needs to be retrieved and stored in a second memory. Thus more memory is used then actually needed. Add to that the fact that copying data takes time as well
DMA: (Direct Memory Access) here no temporary buffer is used but data is directly written into the processor's main memory. The main drawback is that during this operation the processor is idle. It cannot access its memory. Furthermore the DMA access is 'dangerous', If not closely controlled by software the risk exists that data is overwritten. Software also requires execution which takes time.
Dual Port Ram (DPR): This has no sequential input. This can be solved using additional logic but it requires components. Also the DPR is not fully used. Since both sides are read/write and only one side is used in READ mode and the other in WRITE mode half of its capability is not used. Furthermore there is no mechanism to hold off incoming data when the memory is full, Software will be required to handshake, which will again take execution time.
U.S. Pat. No. 4,827,473 shows a packet switching system having a receive packet storing circuit provided with a receive packet buffer of a first-in random out (FIRO) memory, and a transmit packet storing circuit provided with a transmit packet buffer of the FIRO memory. The FIRO memory has discrete components making up a FIRO controller (FIROC) and a conventional single port RAM. The FIROC has counters for generating write addresses for the RAM, and other RAM control signals, and interfaces to receive random read addresses from other devices, to read out packets stored in the RAM. The address space of the RAM, consists of 256 blocks of 4,096 bytes each. The FIROC is provided with a level 2 interface (L2INF), a microprocessor interface (μPINF), a bus interface (BINF), a data selector (DSEL) for the RAM, and an address selector (ASEL) for the RAM, an arbiter circuit (ARB) for contention among read out or write in signals from the L2INF, μPINF and BINF to the RAM.
There remains a need for improved devices.


The disclosure relates in general to illuminated panels resembling windows, and more particularly, to a system containing a light source, a diffuser and a panel combined in such a fashion as to resemble a window, skylight or curtain wall.

It is frequently desirable to have windows or skylights in rooms, as room occupants may feel more at ease and may have increased productivity resulting therefrom. Known lighting fixtures often do little to create the feeling of natural lighting. Historically, windows have only been possible on walls of rooms at the outside perimeter of a building, and skylights only on ceilings of rooms at the top of a building, as exterior access is typically necessary for the passive window or skylight to admit sunlight. The result is the problem that the benefits of such exterior lighting are available only to certain occupants of the building.
In recent years, the performance of LEDs (Light Emitting Diodes) has improved to the point where their CCT (Coordinated Color Temperature) and CRI (Color Rendition Index) may be selected to closely resemble that of sunlight, both at high noon as well as at other times of the day. It would be desirable to have an LED system that could be used to resemble windows or skylights without requiring the room using such a system to have access to an exterior surface of the building. It would be further desirable if such a system could closely resemble physically a traditional window or skylight. It would also be desirable if such a system could have its CCT and CRI adjustable to resemble other times of the day.

This patent is subject to a terminal disclaimer.


An exoskeleton device is provided for measuring positions of links and angles of joints of an animate body, where the body comprises a plurality of links joined by intervening joints. The device is affixed at a first mobile terminus of said animate body and a second fixed terminus, having device links displaced from animate links, where the device links are connected by device joints and having sensor means for measuring the angle of the device joints. Using the signals from the sensor means, one can determine the position of the terminal device link and based on knowledge of the animate body structure, calculate the animate angle joints.

There has been an increasing interest in the ability to measure position of the fingers and hand in such areas as virtual reality, telerobotics, graphical animation and medical hand function assessment. There have been a number of hand-measurement devices constructed to date for measuring the position of the fingers; however, each such finger-measuring device has a common inadequacy, among various other shortcomings. The primary inadequacy of the devices being that they measure joint angles of the hand and then rely upon a mathematical model of the physical hand and xe2x80x9cforward kinematicxe2x80x9d mathematical calculations to produce an estimate of fingertip positions. Measuring finger joint angles explicitly is satisfactory when the goal of the device is to be used for measuring joint angles. However, in many of the aforementioned fields of study, the desired parameter to be measured is the position of the fingertip. When the position of the fingertip is desired, by measuring the finger joint angles and combining these angles with the mathematical model of the hand, errors in both the joint angle measurements and the model add to produce a cumulative error in fingertip position.
One common source of error is introduced by employing a simplified mathematical model of the hand, where each joint is approximated as a revolute joint with a fixed axis of rotation. More realistically, the instantaneous joint axis of a finger actually varies as a function of the joint angle. Additionally, measuring the joint angles of the finger often requires that a goniometer be affixed to phalanges comprising the links by the joint. Any unmeasured relative motion between these affixation points and the phalanges introduces error in the joint measurement. Hence, the number of such unmeasured affixation points is preferably kept to a minimum.
Devices which illustrate the above deficiencies are exemplified by the gloves described in U.S. Pat. Nos. 4,542,291, 4,937,444, 5,047,952, 5,280,265, 4,986,280, 5,086,785, 4,414,537, 5,184,009, 4,444,205, 5,316,017, 4,715,235.
Methods and devices are provided for accurately determining the positions of animate links and angles of animate joints of an animate kinematic chain of an animate body. The animate body comprises a plurality of animate links interconnected by animate joints to provide the animate kinematic chain. The device comprises a plurality of rigid device links interconnected by fixed-axis revolute device joints to provide a device kinematic chain. Two of the device kinematic chain links are terminal device links, each held in known rigid relationship to an animate link, designated as the terminal animate links, via attachment means. At least one of the device joints is displaced away from the animate links. There are at least three device joints with two sensing device joints on opposing ends of a device link. The sensing device joints provide for measurement of device joint angles. The number of sensing device joints is at least sufficient to determine the relative placement of the two terminal device links. The angle of each of said sensing device joints is measured and transmitted as a signal to a signal processor. The signal processor determines the relative placement of the terminal device links using said signals and using forward kinematic mathematical techniques on the device kinematic chain. Further, employing knowledge of the placement of the terminal device links relative to the terminal animate links, the signal processor can calculate the relative placement of the terminal animate links. By using the relative placement of the terminal animate links, and a kinematic model of the animate body, which includes modeled animate links and animate joints, the positions of such animate links and the angles of such animate joints can be calculated using inverse kinematic mathematical techniques. The subject invention finds particular application with the hand.

Device and method for measuring the position of animate links