A selective etching method for a stacked organic film which is capable of effectively removing an organic anti-reflection layer without a loss of a photoresist film before etching a base layer such as a wafer, etc., by using an organic anti-reflection layer. The method includes the steps of forming a first organic film on a base layer, forming a second organic film on the first organic film, patterning the second organic film, and exposing a predetermined portion of the first organic film, hardening the first organic film and the patterned second organic film, and etching the exposed first organic film and exposing the base layer.

1. Field of the Invention
The present invention relates to a selective etching method for a stacked organic film, and in particular to an improved selective etching method for a stacked organic film which is capable of effectively removing an organic anti-reflection layer without a loss of a photoresist film before etching a base layer such as a wafer, etc., by using an organic anti-reflection layer.
2. Description of the Conventional Art
Recently, during the etching process for fabricating a semiconductor device, an anti-reflection bottom organic layer is increasingly used in order to increase the depth of an optical focus (DOF) and resolution at the time of using an i-Line/DUV (Deep UV) photoresist (PR) film.
The composition of a commercially-used organic anti-reflection layer is different based on the fabrication company and the kind of a photoresist (PR) film, but includes aromatic agents of which carbon is a major element. The etching characteristic of a bottom organic anti-reflection layer is very similar to the etching characteristic of the photoresist film. In particular, an isotropic etching profile may be formed under an oxygen (O.sub.2) plasma at room temperature due to a chemical etching characteristic of a photoresist film and bottom organic layer, which characteristic is directed to forming a main product of CO.sub.2 without using gas, for thus causing a large critical dimension (CD) bias. Therefore, in the conventional art, N.sub.2, Ar, SO.sub.2, etc. or CF.sub.4, CHF.sub.3, C.sub.2 F.sub.6, etc. which are compound gases including fluorine are added, and then the organic anti-reflection layer is etched. A polymer such as CN.sub.X, CS.sub.X, CF.sub.X, CHF.sub.X, etc is formed at a sidewall of the organic anti-reflection layer which remains after the etching process, and the anisotropic etching profile of the organic anti-reflection layer is maintained, and the residual organic anti-reflection layer and a critical dimension (CD) bias of the photoresist layer are minimized.
FIGS. 1A through 1C illustrate a conventional selective etching method of a stacked organic film.
As shown in FIG. 1A, a first organic film 13 such as an organic anti-reflection layer is coated on the upper surface of a base layer 11 which becomes an etching object layer, and a second organic film 15 such as a photoresist film patterned for etching the base layer 11 is formed on the upper surface of the first organic film 13. The thusly patterned second organic film 15 is used as a mask at the time of etching the base layer 11. As shown in FIG. 1B, a passivation gas such as CF.sub.4, CHF.sub.3, N.sub.2, etc. is added into an O.sub.2 plasma before the base layer 11 is etched. However, at this time, the second organic film 15 is etched and eroded together with the first organic film 13, and the second organic film 15 is changed to a triangle-shaped second organic film 15a. A sidewall passivation film 17 is formed on sidewalls of the first organic film 13a formed below the second organic film 15a by CF.sub.4, CHF.sub.3, N.sub.2, etc. Thereafter, as shown in FIG. 1C, the base layer 11 is etched by using the second organic film 15a as a mask, and then the first organic film 13a including the second organic film 15a and the sidewall passivation film 17 are removed, for thereby finishing the etching process. The anisotropic etching profile of the first organic film is maintained by the sidewall passivation film 17, and the critical dimension biases of the first organic film 13a and the second organic film 15a are minimized. However, since the etching speed ratio between the second organic film 15 and the first organic film 13 is similar, the second organic film 15 is eroded together with the first organic film 13 at the time of etching the first organic film 13, so that the etching is first performed at a corner portion of the same, for thus forming a much deformed profile of the second organic film 15a. Therefore, when etching the base layer 11 by using the deformed second organic film 15a as a mask, as shown in FIG. 1C, a narrowed upper portion, widened lower portion and sloped pattern of the base layer 11a is formed.
The problems of the conventional selective etching method for a stacked organic film will now be explained.
First, when etching the first organic film such as an organic anti-reflection layer, an ion sputtering effect is increased due to heavy gases having a large molecular structure such as SO.sub.2, CHF.sub.3, C.sub.2 F.sub.6, etc., whereby the second organic film such as the photoresist film is severely eroded. Therefore, when etching the base layer (the etching object layer) by using the thusly deformed second organic film as a mask, it is impossible to maintain a desired profile of the base layer.
Second, since the etching speed ratio between the second organic film and the first organic film is similar, the loss of the second organic film is much increased at the time of etching the first organic film. Therefore, when etching the base layer, since the second organic film does not play the role of a mask, the base layer may be attacked.
Third, since an organic polymer (sidewall passivation film) such as CF.sub.X, CHF.sub.X, etc. is formed on the base layer, the sidewall passivation film acts as a barrier at the time of etching the base layer.

Selective etching method for stacked organic film


The need for an all-purpose hard surface cleaning composition which provides improved removal of greasy soap scum and water-marks, especially on inclined surfaces, is met by formulating an alkaline composition with an alkyl pyrrolidone, and a co-surfactant selected from the group consisting of: an amine oxide surfactant; a betaine surfactant; and mixtures thereof.

Hard surface cleaning compositions are used for cleaning and treating hard surfaces. Preferably, the hard surface cleaning composition is formulated to be an "all purpose" hard surface cleaning composition. That is, the hard surface cleaning composition is formulated to be suitable for cleaning as many different kinds of surfaces as possible.
Visible limescale deposits result in an unaesthetic aspect of the surfaces. The limescale formation and deposition phenomenon is even more acute in places where water is particularly hard. Furthermore, limescale deposits are prone to combination with other types of soils, such as soap scum or grease, and can lead to the formation of limescale-soil mixture deposits, typically referred to as greasy soap scum. In addition, the removal of limescale deposits and limescale-containing soils is herein in general referred to as "limescale removal" or "removing limescale". Another challenging stain to remove is water-marks. Such water-marks are typically formed from the precipitation of insoluble calcium salts, as hard water dries on surfaces. In addition, hard surface cleaning compositions are typically diluted in water before use in treating surfaces. When hard water is used, this can also lead to calcium deposits being left on the treated surface, leading to such unsightly water-marks. Typically, such water-marks are removed using an acid cleaner. However, such acid cleaners are typically harsh on surfaces, and also less effective than alkali cleaners for overall cleaning, especially grease removal, and may not remove all of the water-mark.
Furthermore, removing greasy soap scum and water-marks from inclined surfaces is particularly challenging since the liquid cleaning composition tends to run down the surface before it has had time to fully act on the surface.
As such, a need remains for an all-purpose hard surface cleaning composition which provides improved removal of greasy soap scum and water-marks, especially on inclined surfaces.
EP 058083881 A relates to aqueous hard surface cleaners which comprise (a) an effective amount of a solvent selected from C1-6 alkanol, C3-24 alkylene glycol ether and mixtures (B) an effective amount of a surfactant selected from amphoteric, nonionic and anionic surfactants and mixtures of said surfactants, (c) an effective amount of a buffer system which comprises a nitrogen buffer selected from the group consisting of carbamates of ammonium or of alkaline earths, derivatives of guanidine, alkoxyalkylamines and alkyleneamines; and (d) the remainder consisting substantially of water. WO2004/074417 relates to aqueous acidic antimicrobial compositions comprising acid, an amine oxide surfactant, and an N-alkylpyrrolidone derivative. DE102013218225 relates to laundry detergent comprising an alkyl pyrrolidone. U.S. Pat. No. 8,598,104 relates to a detergent composition comprising a hydrophobic polymer, a sulphonated polyacrylate, a pyrrolidone derivative and an anionic surfactant, in particular, for dishwashing applications. U.S. Pat. No. 6,337,311 relates to an acid or neutral all-purpose liquid cleaning composition containing a nonionic surfactant, a liquid crystal suppression additive, which can be N-alkyl pyrrolidone, and water. U.S. Pat. No. 6,140,288 relates to all-purpose liquid cleaning compositions containing a nonionic surfactant, a liquid crystal suppression additive, which can be N-alkyl pyrrolidone, and water. U.S. Pat. No. 6,399,563 relates to an all-purpose liquid cleaning composition containing a nonionic surfactant, a liquid crystal suppression additive, which can be N-alkyl pyrrolidone, and water. U.S. Pat. No. 7,314,852 relates to a glass cleaning composition which contains an ethylene glycol ether, an N-alkyl pyrrolidone, an amphoteric surfactant and/or alkyl polyglycoside surfactant, and water. WO1995/021238 relates to acid-containing microemulsion compositions or all-purpose hard surface cleaning compositions which comprise N-alkyl-2-pyrrolidone. WO1998/055569 relates to an aqueous, hard surface cleaner comprising: an effective amount of a least one organic solvent with a vapor pressure of at least 0.001 mm Hg at 25° C., and mixtures of such solvents; an effective amount of either at least one anionic surfactant, or a mixture of anionic and nonionic surfactants; an effective amount of a buffering system which comprises a nitrogenous buffer which will result in a pH of greater than 6.5; and the remainder as substantially all water. U.S. Pat. No. 8,114,223 B relates to a cleaning agent for hard surfaces, which is made of a combination of at least one alkyl pyrrolidone, at least one glycol ether, and at least one anionic surfactant.
WO 97/05222 A1 relates to a cleaning solution for degreasing metal articles which contain water soluble, N-alkyl substituted amides in which the alkyl substituent has from 6 to 22 carbon atoms and at least one of: amine oxide surfactants, non-ionic water soluble surfactants with molecules containing a polyoxyalkylene block, and alkali stable anionic, or both anionic and amphoteric, surfactants. WO 94/22996 A1 relates to multi-surface cleaning compositions which comprise: an amine oxide surfactant and/or quaternary amine salt; a very slightly water-soluble polar organic compound; and preferably an effective amount of a water soluble organic compound, to provide streak-free treatment of hard surfaces. EP 0 647706 A2 relates to an aqueous, hard surface cleaner for improved residue removal and substantially reduced filming/streaking, the cleaner comprising: an effective amount of a solvent selected from C1-6 alkanol, C3-24 alkylene glycol ether, and mixtures thereof; an effective amount of at least one nonionic surfactant; an effective amount of a buffering system which comprises a nitrogenous buffer selected from the group consisting of: ammonium or alkaline earth carbamates, guanidine derivatives, alkoxylalkylamines and alkyleneamines; and the remainder as substantially all water.

Alkaline hard surface cleaners comprising alkylpyrrolidones


A trenched gate MOSFET (metal oxide semiconductor field effect transistor) structure is fabricated via a novel process which includes the step of using a common mask serving the dual role as a mask for the body layer formation and as a mask for trench etching. The common mask defines an patterned oxide layer which includes a plurality of openings at a predetermined distance away from the scribe line of the MOSFET structure. During fabrication, material of the body layer is implanted through the openings of the patterned oxide layer. Thereafter, the implanted material is side-diffused and merged together under a drive-in cycle as one continuous body layer. Using the same patterned oxide layer as a shield, trenches are anisotropically etched in the substrate. The MOSFET structure as formed requires no separate mask for delineating the active body region away from the scribe line, resulting reduction of fabrication steps. The consequential benefits are lower manufacturing costs and higher production yields.

1. Field of the Invention
The present invention relates generally to microelectronic circuits, and more particularly, to trenched gate MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) having laterally merged body layers formed by a process with reduced masking sequences.
2. Description of the Related Art
Power semiconductor devices have long been used as replacement for mechanical relays in various applications. Development in semiconductor technology enables these power devices to operate with high reliability and performance. However, modern day instruments are now built at a miniaturized scale with lower power consumption. These instruments, such as fast switching power supplies, high-frequency ballasts, robotics controls and various portable machines, all require power devices to operate under certain stringent requirements. Accordingly, special criteria have to be met in the design and manufacturing of these devices. One area that shows prominence is the fabrication of power metal oxide semiconductor field effect transistors (MOSFETs) using trenched gates.
In a trenched gate MOSFET array, intersecting trenches which define a plurality of cells are formed on a silicon substrate. The trenches are filled with conductive material separated from the silicon substrate with a thin layer of insulating material. There are also other diffusion layers, such as the body and source layers, of different impurity types and concentration deposited in the semiconductor substrate. As arranged, the conductive and insulating materials in the trenches constitute the gate and gate oxide layer, respectively, of the MOSFET. In addition, the perimeter and the depth of the cell correspond to the respective channel width and depth of each MOSFET cell.
Power MOSFETs with trenched gates provide many advantages. To begin with, the channels of the MOSFETs are arranged in a vertical manner, instead of horizontally as in most planar configurations. The consequential benefit is that a higher degree of integration on a semiconductor substrate can be realized. More importantly, since the channel direction is vertical, the lateral current paths are basically eliminated. As a result, the overall channel resistance is reduced. Reduction in channel resistance substantially curtails ohmic loss during the power-on state of the MOSFET, which in turn provides lower power consumption and further alleviates heat dissipation.
Heretofore, fabricating a trenched gate MOSFET has involved a substantial number of fabrication steps in the manufacturing process. To highlight the number of masks and the associated steps involved, FIGS. 1A-1R schematically illustrate the conventional process required to fabricate a trenched MOSFET.
The fabrication process starts with providing a n-type base silicon wafer 4 as shown in FIG. 1A. An epitaxial layer 6 with a predetermined resistivity is then grown atop the base wafer 4 as shown in FIG. 1B. A field oxide layer 8 is thereafter deposited on the top of the epitaxial layer 6. The resultant structure 2 up to this step is shown in FIG. 1C.
A first mask M1, called the active mask, which defines the active area 10 and the termination area 12 is disposed atop the filled oxide layer 8 as shown in FIG. 1D. The active mask M1 is a photoresist layer capable of being patterned by the conventional photolithographic process. After proper patterning, using the patterned first mask M1 as a shield, either the method of dry etch or wet etch is employed to define the field oxide layer 8 as shown in FIG. 1E. The field oxide layer 8 defines an active body layer 14 (formed by the next step) which has to be at a distance d away from the scribe line 36 of the structure 2. The scribe line 36 is a physical cut line separating the semiconductor dies in a finished wafer. The reason of this critical requirement will be explained later in this specification.
The method of ion implantation is then employed to form the active body layer 14 and the termination body layer 16. After a proper drive-in process, the active body layer 14 and the terminal body layer 16 are diffused sufficiently deep into the epitaxial layer 6. The resultant structure up to this step is shown in FIG. 1E.
Another layer of oxide 18 is then deposited on the top of the structure 2 as shown in FIG. 1F. A second mask M2, called the trench mask, is then spun on the top of the oxide layer 18. The second mask M2 is also made of photoresist material. After proper patterning and etching, the resultant structure 2 up to this step is shown in FIG. 1G. Using the trench mask M2 as a shielding mask, the oxide layer 18 is then etched to define a pattern with trench openings 20 in the oxide layer 18 as shown in FIG. 1H. The trench mask M2 is then removed. Using the patterned oxide 18 as a masking layer and via the method of either dry or wet etch, the structure 2 is then anisotropically etched to form trenches 22 in the epitaxial layer 6 as shown in FIG. 1I.
What follows is the formation of a gate oxide layer. First, the oxide layer 18 is removed. The trenches 22 are then lined with gate oxide 24 and are thereafter filled with polycrystaline silicon 26 as shown in FIG. 1J. The process of planazation is then employed to flatten the polycrystalline silicon 26 as shown in FIG. 1K. The polycrystalline silicon 26 is thereafter doped with phosphorous oxychloride (POCl.sub.3) to assume a n-type conductivity. The resultant structure 2 up to this step is shown in FIG. 1K.
The next step is the formation of a source layer in the structure 2. First, the polycrystalline silicon 26 is further etched. A third photoresist mask M3, called the source blocking mask, is then laid on the top of the structure 2. After proper patterning, the resultant structure 2 up to this step is as shown in FIG. 1L. Arsenic (As) is then implanted through the M3 mask into the body layer. After a drive-in process, the source layer 28 is formed in the body layer 14 as shown in FIG. 1M. Thereafter, the third mask M3 is removed and a passivation oxide layer 30 is formed on the top of the structure 2 as shown in FIG. 1M.
A fourth photoresist mask M4, called the contact mask, is then laid atop the passivation oxide layer 30. After proper patterning, the resultant structure up to this step is shown in FIG. 1N. The process of contact etch is then performed. After the removal of the contact mask M4, the resultant structure 2 is covered with a patterned passivation oxide layer 30 as shown in FIG. 10.
P-type material, such as boron, is then implanted and diffused into the structure 2 through the patterned passivation oxide layer 30, resulting in contact diffusion layers 29 formed in the structure 2 as also shown in FIG. 10.
The step of metallization follows. A metal layer 32 is deposited atop the structure 2 by the sputtering process as shown in FIG. 1P. A fifth photoresist mask M5, called the metal mask, is then deposited and patterned on the top of the metal layer 32 as shown in FIG. 1Q. The metal layer 32 is then etched through the fifth mask M5. Furthermore, a drain metal layer 34 is deposited on the bottom side of the wafer 4. The resultant structure 2 up to this step is as shown in FIG. 1R.
Not shown in FIG. 1A-1R is the deposition of another masking step via a 6th mask M6, called the bonding pad mask, for the purpose of exposing selected areas of the metal layer 32 to the bonding wires, after a protective insulating layer is deposited atop the structure 2.
In the process of fabricating a trenched MOSFET device as depicted above, there are at least 6 photoresist masks, namely, M1-M6 involved. As with other thin-film microelectronic processes, it is always highly desirable to reduce the number of masks with the associated masking and patterning steps. The advantage of reducing the number of masks in the fabrication process is twofold. First, laying a mask on a semiconductor structure in the manufacturing process is relatively expensive, not merely in the cost of the mask itself but the various patterning and etching steps associated with the mask involved. Secondly, the more the number of masking and etching steps involved, the higher the chance of contamination of the structure and consequently the lower production yield of the final products. Accordingly, the costs saved by reducing a mask is beyond the prorated basis accorded by the reduced mask.
In the production of a trenched MOSFET device, there has been a long-felt need in the industry to curtail the number of masks and the associated fabrication steps involved, without sacrificing any device performance.

Method of forming a semiconductor structure having laterally merged body layer


The present invention relates to a Δ5 desaturase, which has the ability to convert dihomo-γ-linolenic acid (DGLA; 20:3 ω-6) to arachidonic acid (ARA; 20:4 ω-6) and/or eicosatetraenoic acid (ETA; 20:4 ω-3) to eicosapentaenoic acid (EPA; 20:5 ω-3). Isolated nucleic acid fragments and recombinant constructs comprising such fragments encoding Δ5 desaturase along with a method of making long chain polyunsaturated fatty acids (PUFAs) using this Δ5 desaturase in oleaginous yeast are disclosed.

The importance of PUFAs is undisputed. For example, certain PUFAs are important biological components of healthy cells and are recognized as: "essential" fatty acids that cannot be synthesized de novo in mammals and instead must be obtained either in the diet or derived by further desaturation and elongation of linoleic acid (LA; 18:2 ω-6) or α-linolenic acid (ALA; 18:3 ω-3); constituents of plasma membranes of cells, where they may be found in such forms as phospholipids or triacylglycerols; necessary for proper development (particularly in the developing infant brain) and for tissue formation and repair; and, precursors to several biologically active eicosanoids of importance in mammals (e.g., prostacyclins, eicosanoids, leukotrienes, prostaglandins). Additionally, a high intake of long-chain ω-3 PUFAs produces cardiovascular protective effects (Dyerberg, J. et al., Amer. J. Clin. Nutr., 28:958-966 (1975); Dyerberg, J. et al., Lancet, 2(8081):117-119 (Jul. 15, 1978); Shimokawa, H., World Rev. Nutr. Diet, 88:100-108 (2001); von Schacky, C. and Dyerberg, J., World Rev. Nutr. Diet, 88:90-99 (2001)). And, numerous other studies document wide-ranging health benefits conferred by administration of ω-3 and/or ω-6 PUFAs against a variety of symptoms and diseases (e.g., asthma, psoriasis, eczema, diabetes, cancer).
A variety of different hosts including plants, algae, fungi and yeast are being investigated as means for commercial PUFA production. Genetic engineering has demonstrated that the natural abilities of some hosts (even those natively limited to LA and ALA fatty acid production) can be substantially altered to result in high-level production of various long-chain ω-3/ω-6 PUFAs. Whether this is the result of natural abilities or recombinant technology, production of arachidonic acid (ARA; 20:4 ω-6), eicosapentaenoic acid (EPA; 20:5 ω-3) and docosahexaenoic acid (DHA; 22:6 ω-3) may all require expression of a Δ5 desaturase.
Most Δ5 desaturase enzymes identified so far have the primary ability to convert dihomo-γ-linolenic acid (DGLA; 20:3 ω-6) to ARA, with secondary activity in converting eicosatetraenoic acid (ETA; 20:4 ω-3) to EPA (where DHA is subsequently synthesized from EPA following reaction with an additional C20/22 elongase and a Δ4 desaturase). The Δ5 desaturase has a role in both the Δ6 desaturase/Δ6 elongase pathway (which is predominantly found in algae, mosses, fungi, nematodes and humans and which is characterized by the production of γ-linoleic acid (GLA; 18:3 ω-6) and/or stearidonic acid (STA; 18:4 ω-3)) and the Δ9 elongase/Δ8 desaturase pathway (which operates in some organisms, such as euglenoid species and which is characterized by the production of eicosadienoic acid (EDA; 20:2 ω-6) and/or eicosatrienoic acid (ETrA; 20:3 ω-3)) (FIG. 1).
Based on the role Δ5 desaturase enzymes play in the synthesis of e.g., ARA, EPA and DHA, there has been considerable effort to identify and characterize these enzymes from various sources. As such, numerous Δ5 desaturases have been disclosed in both the open literature (e.g., GenBank Accession No. AF199596, No. AF226273, No. AF320509, No. AB072976, No. AF489588, No. AJ510244, No. AF419297, No. AF07879, No. AF067654 and No. AB022097) and the patent literature (e.g., U.S. Pat. Nos. 5,972,664 and 6,075,183; see also commonly owned, co-pending Provisional Applications No. 60/801,119 (filed May 17, 2006) disclosing amino acid and nucleic acid sequences for a Δ5 desaturase enzyme from Peridium sp. CCMP626; and No. 60/915,733 (filed May 3, 2007) disclosing amino acid and nucleic acid sequences for a □5 desaturase enzyme from Euglena anabaena.
Applicants have identified and isolated new genes encoding □5 desaturases that are be suitable for heterologous expression in a variety of host organisms for use in the production of ω-3/ω-6 fatty acids. Specifically new genes encoding Δ5 desaturase from Euglena gracilis have been discovered.

Δ  5 desaturase and its use in making polyunsaturated fatty acids


A directional coupler having a first structure with distributed lines having a first conductive line intended to convey a main signal between two end terminals and having a second conductive line, coupled to the first one, intended to convey a secondary signal proportional to the main signal; and a second structure with local elements including, between a first terminal of the coupler intended to extract the secondary signal and a first end of the second line, two attenuators in series between which is interposed a low-pass filter and, between a second terminal of the coupler and the second end of the second line, at least one attenuator.

1. Field of the Invention
The present invention generally relates to the field of couplers which are intended to extract data proportional to a signal carried by a transmission line.
The present invention more specifically relates to couplers formed by means of conductive lines coupled to each other with no contact. Such couplers are called couplers with distributed lines as opposed to couplers with local elements, formed from capacitive and inductive elements.
The present invention more specifically applies to the field of radio-frequency couplers, for example, for radio-communication applications of mobile telephony type.
2. Discussion of the Related Art
FIG. 1 shows a conventional example of a coupler 10 with distributed lines. A main line 11 connects an input access IN to an output access DIR. Line 11 forms the primary of the coupler and is intended to convey the useful signal. A secondary line 12 is arranged parallel to line 11 to ensure a contactless coupling therewith to sample part of the power present on line 11. The two ends of line 12 define accesses, respectively CPLD intended to interpret the result of the coupling and ISO, generally isolated, that is, in the air. The coupler is typically formed by metal tracks deposited on an insulating substrate.
A distributed coupler is generally characterized by the following parameters:
the transmission losses between terminals IN and DIR;
the coupling, which corresponds to the transmission losses between terminals IN and CPLD;
the isolation of the coupling which corresponds to the transmission loss between terminals DIR and ISO; and
the directionality, which represents the difference in decibels between the signals present on terminals ISO and CPLD.
The first three above parameters are generally measured while the two terminals not taken into account are loaded with standardized impedances (generally 50 ohms).
The lengths given to the main and secondary lines are calculated according to the central frequency of the passband for which the coupler is intended and to the desired coupling. Typically, these lines have lengths corresponding to one quarter of the wavelength of this central frequency. The longer the lines, the greater the insertion losses.
FIG. 2 very schematically shows, in the form of blocks, a radiofrequency transmission chain of the type to which the present invention applies as an example. A transmit amplifier 1 (PA) receives a radiofrequency signal RF to be transmitted by an antenna 2. To control the transmit power to a value, set by a reference REF, a coupler 10 with distributed lines between the output of amplifier 1 and antenna 2 is used. Accesses IN and DIR of main transmission line 11 are respectively connected to the output of amplifier 1 and to the input of antenna 2. Terminal CPLD of the coupled line is connected to the input of a detector 2 (DET) having its output compared (comparator 4) with reference signal REF to adjust the transmit power (the gain) of amplifier 1.
In a so-called directional coupler, a signal entering through terminal DIR is trapped by terminal ISO to avoid that this signal reaches the application, for example, amplifier 1 (FIG. 2). In this case, terminal ISO is generally loaded with a grounded 50-ohm impedance. "Higher directionality" is used to designate a greater attenuation in dB between accesses ISO and CPLD.
In other cases, an external isolator is provided between coupler 10 and antenna 2 to prevent a return of the signal to amplifier 1. The coupler then needs not be directional and terminal ISO is generally left in the air.
The present invention more specifically relates to directional couplers.
A disadvantage of couplers of the type illustrated in FIG. 1 is that the coupling is very sensitive to the frequency of the transmitted signal.
This disadvantage is particularly disturbing in radiocommunication applications more specifically aimed at by the present invention. Indeed, too high a variation of the coupling within the same operating frequency band (for example, GSM or DCS) adversely affects the optimization of the transmission chain operation. Further, the coupling may vary significantly from one frequency band to another.
A directional coupler is described, for example, in patent application No. US-A 2004/0113716 of the applicant. This coupler has interdigited transmission lines, and is also known as a Lange coupler. As compared with couplers with non-interdigited lines, a Lange structure enables improving the coupling between lines.
"Improvement in the coupling" is used to mean an increase in the attenuation in dB of the signal on terminal CPLD with respect to the desired signal to draw as little as possible from this signal.
"Improvement in the directionality" is used to mean an increase in the attenuation in dB of the signal on terminal ISO with respect to terminal CPLD.
Traditionally, to improve the directionality, capacitive elements are provided either between terminals of the coupler, or between some of these terminals and the ground.
A disadvantage is that, in frequency bands aimed at by the present invention, the values of the capacitive elements are so low that they become close to the values of the stray capacitances of the structure, which makes the coupler difficult to form.


A contact for a wire-to-wire electrical connector includes a first contact portion defining a first wire receiving opening to receive a first wire and a second wire receiving opening to receive a second wire. The contact further includes a splice contact portion abutting the first contact portion and defining a third wire receiving opening to receive a third wire. The first contact portion also includes a first plurality of contact tines to electrically connect the first wire and the second wire and the splice contact portion includes a second plurality of contact tines to electrically connect the third wire to the first wire and the second wire.

The following description is provided to assist the understanding of the reader. None of the information provided or references cited are admitted to be prior art.
Various types of connectors are used for forming electrical connections between a wire and any manner of electronic or electrical component. These connectors are typically available as sockets, plugs, and shrouded headers in a vast range of sizes, pitches, and plating options. Traditionally, for two wires to be connected together, a user must strip the first and second wires, twist the two ends together, and then secure them to one other. This process can be tedious, inefficient, and undesirable. Furthermore, a wire-to-wire connection that may fall apart or short out unexpectedly could be hazardous or even deadly. Thus, a quick, efficient, and reliable means of connecting and disconnecting wires is needed.

Wire-to-wire connector with splice contact portion


A suspension apparatus for suspending a truck-type circuit breaker or the like when the circuit breaker is put on or taken off a truck of a switchboard frame comprises a suspension adapter to be engaged with a first hollow provided on a side face of the circuit breaker and a stopper provided on the suspension adapter to be engaged with a second hollow provided on a top face of the circuit breaker.

1. Field of the Invention
The present invention relates to a suspension apparatus to be used for suspending a truck-type circuit breaker or the like when the circuit breaker is put on or taken off of the truck of a switchboard frame.
2. Description of the Prior Art
A conventional suspension apparatus, which is to be used for suspending a truck-type circuit breaker or the like, is described referring to FIGS. 6 and 7. FIG. 6 is a perspective view for showing the truck-type circuit breaker or the like which is suspended by a conventional suspension apparatus. FIG. 7 is a partial sectional side view showing the constitution of a hook part taken along line VII--VII in FIG. 6.
As is obvious from the figures, a pair of hollows 2 are provided on both side faces of a truck-type circuit breaker 1. As shown in FIG. 7, each hollow 2 is overhanged toward the bottom of the circuit breaker. A pair of suspension adapters 3, which have a substantially J-shaped section, are respectively engaged with the hollows 2 from below. Each suspension adapter 3 has a hole 4, so that a rope or wire 5 is tied to the adapter 3 through the hole 4.
For suspending the circuit breaker 1 by the conventional suspension apparatus, once the circuit breaker 1 is put on a truck of a switchboard frame or a floor, the rope or wire 5 is loosened, and thereby, the suspension adapters 3 are disengaged from the hollows 2 of the circuit breaker 1. Therefore, disengaged suspension adapters 3 have to be re-engaged with the hollows 2 for re-suspending the circuit breaker 1.


An computer assembly having an integral video display and processor subsystem in a single enclosure is described. The assembly contains an electrically conductive safety wall inside the enclosure which separates the interior of the enclosure into a high-voltage region where the video display components are mounted, and a low-voltage region where the processor subsystem is mounted. The enclosure has a removable rear cover which allows access to the processor subsystem for upgrading memory. An electrically conductive liner is attached to the rear cover for EMI shielding of the low-voltage region.

In the mechanical design of computer systems, it has been the practice to partition the system into at least two separate components, namely a video display monitor and a system box, connected by a cable. The monitor is commonly an assembly having a cathode-ray tube (CRT) or other video display, a power supply, high-voltage electronics to drive the display, and a small amount of relatively low-voltage electronics. The CRT and the high-voltage electronics are commonly referred to collectively as the video display components; they work together to display image data which is received by the low-voltage electronics from the system box via the cable.
The system box in a computer system might contain, for example, a microprocessor, memory, a disk drive, a power supply, and other circuitry. The collection of these components in the system box is commonly referred to as the processor subsystem. The processor subsystem runs software programs, accesses files stored on the disk drive, and responds to user input from a keyboard or mouse attached to the system box. The processor subsystem in the system box communicates with the monitor over a cable in order to display the results of its operations.
In the past, partitioning the system in two boxes as described above was advantageous for several reasons. The video display components in the monitor operate at dangerously high voltages, while the processor subsystem operates at lower voltages which are relatively safe. Since the processor subsystem is often customer-accessible for memory or disk upgrades, it should therefore be isolated from the high-voltage video display components for reasons of customer safety. Also, the electromagnetic interference (EMI) generated by the video display components could interfere with the operation of the processor subsystem, or vice-versa, so it has been beneficial to house them in separate EMI-shielded enclosures.
While the two-box approach to computer system design thus has technical advantages, it nevertheless imposes costs as well. There is the obvious cost of two enclosures, as well as two power supplies, power switches and power cords. There are also cables and connectors on each box merely to enable them to communicate with each other. All of these components add to the cost of the computer system. Additionally, the computer system must be packaged into two shipping containers, and thus is more expensive to ship.
The costs associated with a two-box system partition can be particularly burdensome in a small computer system which is meant to be sold in a price-sensitive market. Therefore it is desirable to reduce or eliminate excess costs while retaining the beneficial EMI and safety features of a two-box system.


An inkjet fixer composition and a printing method and system used with the composition are disclosed herein. The composition includes: a) from 1 to 8 weight percent cationic polymer; and b) from 0 to 2 weight percent of at least one surfactant selected from the group consisting of nonionic surfactant, cationic surfactant and combinations thereof; and c) an aqueous liquid vehicle. Upon overprinting the fixer composition with an ink-jet ink on a substrate, the fixer composition vehicle and the ink-jet ink vehicle form a vehicle mixture on the substrate after which the vehicle mixture penetrates into the substrate, and an ink image is formed on the substrate.

In some reactive ink systems, fixers have been employed for the purpose of crashing colorants in ink. In inkjet printing, for example, fixer fluids are used to make reactive ink systems, whereby the fixer, upon contact with ink, causes the pigments and dyes in the ink formulation to precipitate out. The precipitated colorants deposit on the surface of the media, which results in the enhancement of image quality attributes, for example, optical density and chroma. Durability attributes like water-fastness and highlighter smear also benefit from such reactive ink chemistry. As a rule, both fixer and ink are formulated such that they reasonably well wet the media to which they are applied and quickly penetrate the media to avoid drytime related issues. This approach often results in non-uniform area fill, because the media itself is often inherently non-uniform. In areas where fiber density is low, fixer penetrates the media more quickly relative to denser areas. Consequently, ink colorants are precipitated out by the fixer at various depths from the media surface. These variations in depth are perceived as mottle (non-uniform area fill).

Slow-penetrating inkjet fixer composition and methods and systems for making and using same

Hewlett-Packard Development Company, L.P.


A display panel and a display device are provided in the present disclosure. The display panel includes a substrate and an array layer on the substrate, where the array layer includes a plurality of control units, one control unit includes a plurality of thin-film transistors, and the plurality of thin-film transistors in a same control unit is sequentially arranged along a ring-shaped path. The display panel further includes a plurality of light-emitting units on a side of the array layer away from the substrate. The plurality of light-emitting units and the plurality of control units are in a one-to-one correspondence. A light-emitting unit includes a plurality of light-emitting devices each having a first electrode. A plurality of first electrodes in a same light-emitting unit is sequentially arranged along an arrangement direction of the plurality of thin-film transistors in a control unit corresponding to the same light-emitting unit.

Flat display devices have become the mainstream display devices because of their advantages of high image quality, low power consumption, thin body, and wide-range applications, thereby being widely used in various consumer electronics, such as mobile phones, TVs, personal digital assistants, digital cameras, notebook computers, desktop computers, and the like.
The micro light-emitting diode (micro-LED) display is a display which uses arrays with high-density micro-sized LEDs, which are integrated on a substrate, as individual pixels to display pictures. Similar to the large-sized outdoor LED display, each pixel can be addressed and driven separately for illumination. The pixel distance may be reduced from millimeter level to micrometer level, such that the micro-LED may be regarded as a reduced version of the outdoor LED display. The micro-LED display and the organic light-emitting diode (OLED) display both belong to the self-luminous display. However, compared with the OLED display, the micro-LED display has the advantages of enhanced material stability, longer lifespan, no image burn-in and the like, which has been considered to be the major competitor of the OLED display.

Shanghai Tianma Micro-Electronics Co., Ltd.


An energy generation system and method are presented for use in operating a heat engine. The energy generation method comprises: reducing a CO2 gas into CO and O2 gases; reacting said CO and O2 gases, thus combusting the CO gas, and yielding a substantially pure CO2 outlet gas; and supplying said CO2 outlet gas to the heat engine as a working gas in its heat-to-work generation process.

One of the challenging problems facing the power generation industry is the capture of greenhouse gases produced during the combustion of fuels. More specifically, the main challenge is the capture of Carbon Dioxide (CO2), since this molecular structure is the major greenhouse gas emitted during combustion.
Several technologies exist for the capture of CO2. They are generally divided into the following groups: post combustion capture, oxy-fuel combustion, and pre-combustion capture.

Energy generation system and method thereof


A pigment composition of improved dispersibility in thermoplastic resins and concentrates of the pigment composition in thermoplastic resin are provided. The pigment composition is comprised of an inorganic pigment such as titanium dioxide having an organophosphate ester treating agent deposited thereon.

1. Field of the Invention
The present invention relates to compositions of matter characterized by their improved dispersibility in thermoplastic resins. More particularly, the present invention relates to chemically treated inorganic pigments suitable for use in thermoplastic resins. Most particularly, the present invention relates to titanium dioxide pigments treated with an organophosphate ester treating agent.
2. Description of the Prior Art
The use of inorganic pigments such as, for example, pigmentary titanium dioxide, as UV light stabilizers, colorants, opacifiers and the like in various thermoplastic resins is known. It also is known, however, that due to the hydrophilic nature of such inorganic pigments and to the hydrophobic nature of the thermoplastic resins, the compatibility and thus the dispersibility of such pigments in such resins, particularly at high pigment loadings, leaves much to be desired.
It further is known that the compatibility and thus the dispersibility of inorganic pigments in thermoplastic resins can be significantly improved through chemical surface treatment of the pigments. For example, in U.S. Pat. No. 4,209,430 it is disclosed to treat inorganic pigments such as titanium dioxide pigment with phosphorylated polyenes, i.e., aliphatic polyunsaturated compounds of at least ten carbon atoms to which a phosphoryl group has been added to the olefinic unsaturation thereof. The pigments thus treated are described as not only possessing improved pigment properties but also improved uniformity of dispersion and a reduced tendency to yellow in those thermoplastic polyolefins to which the treated pigments may be added.
Further examples of methods or treatments for reducing the tendency of inorganic pigments, and particularly titanium dioxide, to yellow in various polymeric compositions are those disclosed in U.S. Pat. Nos. 4,357,170 and 4,377,417. According to these patents, the application to pigmentary titanium dioxide of an additive system comprised of either the combination of an organophosphate/alkanolamine addition product and a polyol or the organophosphate/alkanolamine addition product alone results in a reduction of the tendency of titanium dioxide pigment to yellow in polymeric compositions. The organophosphate materials utilized to produce the addition product include those organophosphate materials disclosed in U.S. Patent No. 3,380,927. These materials comprise orthophosphate or polyphosphate coesters of, conjointly, an aliphatic alcohol containing 6 to 16 carbon atoms and a nonionic adduct of ethylene oxide and a reactive hydrogen containing organic compound. The organic compounds employed to form the adduct include alkylated phenols, aliphatic alcohols containing 6 to 25 carbon atoms, aliphatic monocarboxylic acids and the like. Neither U.S. Pat. No. 4,357,170 nor U.S. Pat. No. 4,377,417 mentions any benefit to be afforded by such treatment relevant to the dispersibility of the thus treated pigment when employed in a polymeric composition.
A still further example of the treatment of inorganic fillers or pigments with organophosphate esters is found in U.S. Pat. No. 4,183,843. This patent teaches the surface treatment of inorganic fillers or pigments, including titanium dioxide, with polar phosphate ester surfactants containing both acid and polar ether groups. The thus treated fillers or pigments, when combined with a sprayable, curable polyester resin results in filler or pigment/polyester dispersions of reduced viscosities. Although the exact nature or structure of the treating materials is not definitively identified, materials such as Triton QS-44, a product of Rohm and Haas, listed as an exemplary coating material is known to comprise the composition, octylphenoxyethoxyethylphosphate.
None of the foregoing patents suggest either the treated inorganic pigments or the polymeric concentrates produced therefrom which are the subject of this application.

Pigments for improved dispersibility in thermoplastic resins


A resistive strain gauge pressure sensor including upper and lower housings coacting to define a pressure chamber within the housing. A board member assembly is clamped between the housings and defines a diaphragm portion which extends across the pressure chamber to divide the pressure chamber into upper and lower chamber portions. The board member assembly includes a relatively thin plate member, including a diaphragm portion, and a relatively thick support member bonded to the upper face of the thin plate member and including an annular portion positioned in surrounding relation to the diaphragm portion. The circuitry of the sensor is screen printed onto the lower face of the plate member and includes the various resistor elements of the strain gauge assembly, the various elements of the conditioning circuit receiving the output of the strain gauge assembly, and the various further leads required to connect the circuitry elements to the terminals of the sensor. The sensor terminals are provided by a plurality of connector pins extending downwardly through the plate member for connection at their respective lower ends to the circuitry provided on the lower face of the plate member.

This invention relates to pressure transducers and more particularly to resistive strain gauge pressure sensors.
It is often necessary to determine the pressure of gases and liquids for purposes of measurement or control and many transducers and sensors have been proposed to facilitate the determination of the pressure of gases and liquids. One general type of transducer or sensor for such applications is a resistive strain gauge sensor in which the pressure is sensed and measured based on dimensional changes in the strain gauges which generate proportional changes in the resistance of the gauges.
Whereas many types of resistive strain gauge pressure sensors have been designed and made commercially available, and whereas the various resistive strain gauge sensors have proven to be generally satisfactory, these gauges tend to be rather expensive both in terms of labor and material. Specifically, the design of prior art resistive strain gauge sensors have been relatively expensive either by virtue of the expense of the materials required to form the sensor or by virtue of the complicated processes required to manufacture the sensor.

Board construction for resistive strain gauge pressure sensors


Multilayered moldings, which comprise a laminate structure of (A) a layer of a polyphenylene sulfide resin (hereinafter referred to as PPS resin) composition and (B) a layer of a thermoplastic resin except PPS resins and which are characterized in that the PPS resin composition constituting the layer (A) comprises (A1) 100 parts by weight of a PPS resin, (A2) from 1 to 80 parts by weight of a thermoplastic resin having at least one functional group selected from epoxy groups, acid anhydride groups, carboxyl group and its salts, and carboxylate groups, and (A3) from 5 to 80 parts by weight of a thermoplastic resin that is similar in kind to the thermoplastic resin constituting the layer (B), have good hot water resistance, antifreeze resistance, chemical resistance, heat resistance, abrasion resistance, gas permeation resistance and interlayer adhesion.

The present invention relates to multilayered moldings with good hot water resistance, antifreeze resistance, chemical resistance, heat resistance, abrasion resistance, gas permeation resistance and interlayer adhesion.
Polyphenylene sulfide resins (hereinafter referred to as PPS resins) have good heat resistance, hot water resistance, chemical resistance and flame resistance, while having good electric characteristics, and there is increasing a great demand for the applications of those PPS resins to electric and electronic parts and also to car parts. Recently, Japanese Patent Publication No. 6-98673 has disclosed hollow molding materials comprising PPS resins, referring to the characteristics of the resins.
However, PPS resins require high molding temperatures while solidifying rapidly. Therefore, where those resins are molded, for example, through blow molding or extrusion to give moldings with good outward appearance, the temperature of the molds to be used must be high. For these reasons, the PPS resins are not favorable in view of their moldability and economic aspects.
On the other hand, regarding hollow moldings of thermoplastic resins, such as ducts and fuel lines in car engine rooms, various techniques of producing them have been popularized through blow molding and extrusion of polyamide resins and saturated polyester resins.
However, since single-layered hollow moldings of those conventional thermoplastic resins such as polyamide resins and saturated polyester resins have poor heat resistance, chemical resistance, gas permeation resistance and abrasion resistance, their applications are limited. Therefore, products with much more improved heat resistance, chemical resistance, gas permeation resistance and abrasion resistance are required.
Given this situation, it may be considered to laminate a thermoplastic resin except PPS resins and a PPS resin to obtain laminate moldings having both the characteristics of the former thermoplastic resin characterized by its good mechanical properties, moldability and availability, and the characteristics of the latter PPS resin characterized by its good heat resistance, hot water resistance and chemical resistance. However, even if a PPS resin and a thermoplastic resin except PPS resins are directly laminated together, interlayer peeling is inevitable in the resulting laminates because of the absence of interlayer adhesiveness between the two different resins, and therefore the intended moldings could not be obtained.
On the other hand, a method of interposing an adhesive layer between a PPS resin and a thermoplastic resin except PPS resins to give laminates of the two resins has been proposed. For example, Japanese Patent Application Laid-Open No. 5-193060 discloses a laminate structure comprising a PPS resin layer and a polyolefin resin layer as laminated via an adhesive therebetween.
However, where multilayered structures are produced through co-extrusion according to the method of interposing such an adhesive layer between two different resin layers, an increased number of extruders are needed, resulting in that the working equipment is complicated and requires time-consuming operations. Therefore, the method is problematic in that it is uneconomical and disadvantageous in practical use.
One object of the present invention is to provide multilayered moldings with well-balanced and good heat resistance, hot water resistance, chemical resistance to, for example, zinc chloride, calcium chloride and amines, gas permeation resistance, abrasion resistance, moldability and interlayer adhesion.
Another object of the invention is to provide PPS resin compositions with good surface smoothness and moldability, which can be formed into multilayered moldings with such good characteristics.
The invention is summarized as follows:
A multilayered molding comprising a laminate structure of (A) a layer of a polyphenylene sulfide resin (hereinafter referred to as PPS resin) composition and (B) a layer of a thermoplastic resin except PPS resins, in which the PPS resin composition constituting the layer (A) comprises (A1) 100 parts by weight of a PPS resin, (A2) from 1 to 80 parts by weight of a thermoplastic resin having at least one functional group selected from epoxy groups, acid anhydride groups, carboxyl group and its salts, and carboxylate groups, and (A3) from 5 to 80 parts by weight of a thermoplastic resin which is similar in kind to the thermoplastic resin constituting the layer (B).
The constituent components and the structure of the multilayered, tubular, thermoplastic resin moldings of the invention are described in detail hereinunder.
The PPS resin (A1) for use in the invention is a polymer comprising a repeating unit of the following structural formula in an amount of preferably 70 mol % or more, more preferably 90 mol % or more.
PPS resins usable in the invention include relatively low molecular weight polymers to be produced, for example, by the method described in Japanese Patent Publication No. 45-3368, and substantially linear, relatively high molecular weight polymers to be produced, for example, by the method described in Japanese Patent Publication No. 52-12240; and the former polymers as produced by the method described in Japanese Patent Publication No. 45-3368 could be heated in an oxygen atmosphere or could be heated in the presence of a crosslinking agent such as peroxides to thereby make them have an increased molecular weight, prior to being used in the invention.
PPS resins obtained by any methods can be used in the invention, but preferred are substantially linear, relatively high molecular weight polymers.
PPS resins for use in the invention could be so modified as to comprise any of repeating units of the following structural formulae in an amount of less than 30 mol % of the total repeating units.
Desirably, the PPS resin (A1) to be used in the invention is one as prepared through ordinary polymerization such as that mentioned above followed by deionization to be effected by washing the polymers with an aqueous acid solution or an organic solvent.
The washing of PPS resins with an aqueous acid solution may be effected, for example, as follows:
Acids to be used for the washing are not specifically defined, provided that they do not decompose PPS resins. For example, employable is any of acetic acid, hydrochloric acid, sulfuric acid, phosphoric acid, silicic acid, carbonic acid and propionic acid. Of those, preferred are acetic acid and hydrochloric acid. However, nitric acid and others that decompose and deteriorate PPS resins are unfavorable.
To wash PPS resins with such an aqueous acid solution, for example, the resins are dipped in the solution optionally with stirring or heating them. In one example using acetic acid, a powdery PPS resin is dipped in an aqueous acetic acid solution having a pH of 4, and stirred therein for 30 minutes under heat at 80 to 90xc2x0 C. to obtain sufficient results. It is desirable that the acid-treated PPS resins are additionally washed several times with cold or warm water to thereby physically remove the remaining acid or salt.
Water to be used for the additional washing is preferably distilled or deionized water, as not interfering with the favorable chemical modifications in the acid-treated PPS resins.
PPS resins for use in the invention may be washed with hot water, for example, in the manner mentioned below.
Hot water to be used for the washing is preferably at 100xc2x0 C. or higher, more preferably at 120xc2x0 C. or higher, even more preferably at 150xc2x0 C. or higher, especially preferably at 170xc2x0 C. or higher.
It is desirable that the hot water to be used for the treatment is distilled or deionized water, as producing favorable chemical modifications in the treated PPS resins. For the hot water treatment, in general, a predetermined amount of the PPS resin to be treated is put into water in a pressure container and heated therein with stirring. Regarding the ratio of the PPS resin to water, it is desirable that the amount of water is larger than that of the PPS resin. In general, the bath ratio is so determined that the amount of the PPS resin to be treated in one liter of water is not larger than 200 g.
Desirably, the hot water treatment is effected in an inert atmosphere in order to prevent the decomposition of the terminal groups of the PPS resin being treated. After the hot water treatment, it is desirable that the PPS resin is washed several times with warm water to thereby physically remove the remaining components.
PPS resins for use in the invention may be washed with an organic solvent in the manner mentioned below.
The organic solvent to be used for the washing is not specifically defined, provided that it does not decompose PPS resins. For example, employable is any of nitrogen-containing polar solvents such as N-methylpyrrolidone, dimethylformamide, dimethylacetamide, 1,3-dimethylimidazolidinone, hexamethylphosphoramide and piperazinones; sulfoxide-type and sulfone-type solvents such as dimethylsulfoxide, dimethylsulfone and sulfolane; ketone-type solvents such as acetone, methyl ethyl ketone, diethyl ketone and acetophenone; ether-type solvents such as dimethyl ether, dipropyl ether, dioxane and tetrahydrofuran; halogen-containing solvents such as chloroform, methylene chloride, trichloroethylene, dichloroethylene, perchloroethylene, monochloroethane, dichloroethane, tetrachloroethane, perchloroethane and chlorobenzene; alcoholic and phenolic solvents such as methanol, ethanol, propanol, butanol, pentanol, ethylene glycol, propylene glycol, phenol, cresol, polyethylene glycol and polypropylene glycol; and aromatic hydrocarbon solvents such as benzene, toluene and xylene. Of those organic solvents, especially preferred are N-methylpyrrolidone, acetone, dimethylformamide and chloroform. The organic solvents can be used in a single or mixed solvent system.
To wash PPS resins with such an organic solvent, for example, the resins are dipped in the organic solvent optionally with stirring or heating them. The washing temperature for the treatment is not specifically defined and may be from room temperature to 300xc2x0 C. or so. The higher the washing temperature is, the higher is the washing efficiency to be attained. In general, however, the washing temperature may be from room temperature to 150xc2x0 C. or so to produce good results. If desired, PPS resins may be washed with an organic solvent in a pressure container under pressure and at a temperature not lower than the boiling point of the solvent used. Anyhow, the washing time for the treatment is not specifically defined. For example, depending on the washing condition employed, the washing may be effected generally for 5 minutes or longer in a batchwise washing system to obtain good results. If desired, the washing may be effected in a continuous washing system.
It is sufficient to only wash the PPS resins as obtained through polymerization, with such an organic solvent, but in order to further augment the effect of the invention, it is desirable that the washing of those PPS resins is followed by additional washing thereof with cold or warm water. For example, where the PPS resins are washed with a high-boiling-point, water-soluble organic solvent such as N-methylpyrrolidone, it is preferable that they are additionally washed with cold or warm water to thereby remove the remaining organic solvent. The cold or warm water to be used for the additional washing is desirably distilled or deionized water.
The melt viscosity of the PPS resin (A1) for use in the invention is not specifically defined, provided that the resin itself is kneadable with the other components to be mixed therewith, the thermoplastic resin (A2) having at least one functional group selected from epoxy groups, acid anhydride groups, carboxyl group and its salts, and carboxylate groups, and the thermoplastic resin (A3) which is similar in kind to the thermoplastic resin constituting the layer (B) of which the thermoplastic resin is not a PPS resin, and also with an optional component (A4) of an elastomer having none of epoxy groups, acid anhydride groups, carboxyl group and its salts, and carboxylate groups. In general, the melt viscosity of the PPS resin (A1) may be from 100 to 10,000 poises at 320xc2x0 C. and at a shear rate of 10 sec xe2x88x921.
The thermoplastic resin (A2) for use in the invention, which has at least one functional group selected from epoxy groups, acid anhydride groups, carboxyl group and its salts, and carboxylate groups, includes, for example, olefinic copolymers and fluorine-containing copolymers having any of those functional groups.
As examples of the epoxy-containing olefinic copolymers, mentioned are olefinic copolymers having any of glycidyl residues of, for example, glycidyl esters, glycidyl ethers and glycidylamines in their side chains; and those as prepared by epoxidative oxidation of the double bond(s) of double bond-containing olefinic copolymers. Of those epoxy-containing olefinic copolymers, preferably used in the invention are copolymers comprising xcex1-olefins and glycidyl esters of xcex1,xcex2-unsaturated acids. The xcex1-olefins include, for example, ethylene, propylene and butene-1. The glycidyl esters of xcex1,xcex2-unsaturated acids may be represented by the following general formula, which include, for example, glycidyl acrylate, glycidyl methacrylate and glycidyl ethacrylate. Preferred is glycidyl methacrylate.
wherein R represents a hydrogen atom, or an alkyl group having from 1 to 6 carbon atoms.
The epoxy-containing compound (A2) of that type may be any of random, block and graft copolymers of xcex1-olefins and glycidyl esters of xcex1xcex2-unsaturated acids such as those mentioned above.
The epoxy content of those copolymers is preferably from 1 to 50% by weight, more preferably from 3 to 40% by weight. If it is smaller than 1% by weight, the intended results could not be obtained. However, if it is larger than 50% by weight, the copolymers will be unfavorably gelled, while melt-mixed with PPS resins, thereby having some negative influences on the extrusion stability, the moldability and the mechanical strength of the resulting PPS resin compositions. The epoxy-containing olefinic copolymer for use in the invention may be optionally copolymerized with any other olefinic comonomers, such as methyl acrylate, ethyl acrylate, acrylonitrile, styrene, vinyl acetate and vinyl ether, within a range not interfering with the effect of the invention.
The thermoplastic resins of the component (A2), which have any of carboxyl group and its salts, carboxylate groups and acid anhydride groups, are preferably olefinic copolymers, including, for example, those as prepared by copolymerizing polyolefinic resins of, for example, polyethylenes, polypropylenes, polystyrenes, ethylene-propylene copolymers, ethylene-butene copolymers, polybutene, ethylene-propylene-diene copolymers, styrene-butadiene copolymers, styrene-butadiene-styrene (SBS) block copolymers, styrene-isoprene-styrene (SIS) copolymers, polybutadienes, butadiene-acrylonitrile copolymers, polyisoprenes, butene-isoprene copolymers and styrene-ethylene-butylene-styrene (SEBS) block copolymers, with comonomers of, for example, maleic anhydride, succinic anhydride, fumaric anhydride, acrylic acid, methacrylic acid, ethylene-(meth)acrylic acid copolymers, and their salts such as Na, Zn, K, Ca and Mg salts, and methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl, acrylate, propyl methacrylate, butyl acrylate and butyl methacrylate. The copolymerization mode for those olefinic copolymers is not specifically defined, and the copolymers may be any of random copolymers, graft copolymers and block copolymers. Two or more of those thermoplastic resins (A2) having at least one functional group selected from epoxy groups, acid anhydride groups, carboxyl group and its salts, and carboxylate groups may be used in combination.
The amount of the thermoplastic resin component (A2) to be in the PPS resin composition of the invention shall be from 1 to 80 parts by weight, preferably from 3 to 50 parts by weight, relative to 100 parts by weight of the PPS resin component (A1) to be therein. If it is smaller than 1 part by weight, the melt viscosity of the PPS composition is too low and the moldability thereof is poor. If, however, it is larger than 80 parts by weight, the resin (A2) will be unfavorably gelled, when melt-mixed with the PPS resin (A1), thereby having some negative influences on the extrusion stability, the moldability, the mechanical strength and the heat resistance of the resin composition.
The thermoplastic resin (A3) to be in the PPS resin composition of the invention is similar in kind to the thermoplastic resin to be used for laminating it along with the PPS resin composition, and includes for example, polyamides, polyesters, polyolefins, polyacetals, ABS and polyphenylene ethers. Of those, preferred are polyamides and polyesters.
As examples of the polyamides, mentioned are polycaproamide (nylon 6), polyhexamethylene adipamide (nylon 66), polytetramethylene adipamide (nylon 46), polyhexamethylene sebacamide (nylon 610), polyhexamethylene dodecamide (nylon 612), polydodecanamide (nylon 12), polyundecanamide (nylon 11), polyhexamethylene terephthalamide (nylon 6T), polyxylylene adipamide (nylon XD6), and their mixtures and copolymers.
Of those, preferred are nylon 6, nylon 66, nylon 11, nylon 12 and their copolymers in view of their heat resistance, moldability and economic aspects.
The degree of polymerization of those polyamide resins is not specifically defined, and may be from 1.5 to 7.0, preferably from 2.0 to 6.5, in terms of the relative viscosity thereof as measured in a 1% solution of concentrated sulfuric acid at 25xc2x0 C., or may be from 1.0 to 7.0, preferably from 1.5 to 5.0, in terms of the relative viscosity thereof as measured in metacresol (having a polymer concentration of 0.5% by weight) at 25xc2x0 C.
The saturated polyester resins for use in the invention are not also specifically defined, but are preferably aromatic polyesters to be produced from dicarboxylic acids, of which at least 60 mol % is terephthalic acid, and aliphatic diols. The dicarboxylic acids except terephthalic acid include, for example, aliphatic dicarboxylic acids having from 2 to 20 carbon atoms, such as azelaic acid, sebacic acid, adipic acid and dodecane-dicarboxylic acid; aromatic dicarboxylic acids such as isophthalic acid and naphthalene-dicarboxylic acid; and alicyclic dicarboxylic acids such as cyclohexane-dicarboxylic acid. These may be used either singly or as combined. The aliphatic diols include, for example, ethylene glycol, propylene glycol, 1,4-butane-diol, trimethylene glycol, and hexamethylene glycol.
Preferred examples of the saturated polyesters are polyethylene terephthalate, polypropylene terephthalate, polybutylene terephthalate, polyhexamethylene terephthalate, and polycyclohexylene-dimethylene terephthalate. Of those, especially preferred are polybutylene terephthalate, and copolyesters comprising a dicarboxylic acid component that is comprised of terephthalic acid in an amount of 60 mol % or more, preferably 70 mol % or more, and dodecane-dicarboxylic acid and/or isophthalic acid, and a diol component of 1,4-butane-diol, as they have good mechanical strength.
The degree of polymerization of those polybutylene terephthalate (hereinafter referred to as PBT resin) and copolyesters is not specifically defined, but is preferably from 0.5 to 2.5, more preferably from 0.8 to 2.0, in terms of the relative viscosity thereof as measured in a 0.5% orthochlorophenol solution at 25xc2x0 C. The degree of polymerization of polyethylene terephthalate for use in the invention is not also specifically defined, but is preferably from 0.54 to 1.5, more preferably from 0.6 to 1.2, in terms of its limiting viscosity as measured in a 0.5% orthochlorophenol solution at 25xc2x0 C.
The amount of the thermoplastic resin (A3) except PPS resins, which is in the PPS resin composition of the invention, may be from 5 to 80 parts by weight, preferably from 15 to 60 parts by weight, relative to 100 parts by weight of the PPS resin (A1) to be in the composition. If it is smaller than 5 parts by weight, the interlayer adhesion of the multilayered moldings to be obtained herein is poor. However, if it is larger than 80 parts by weight, the PPS resin composition could not have good heat resistance and chemical resistance that is intrinsic to PPS resins.
As comprising the PPS resin (A1), the thermoplastic resin (A2) having at least one functional group selected from epoxy groups, acid anhydride groups, carboxyl group and its salts, and carboxylate groups, and the thermoplastic resin (A3) except PPS resins, the PPS resin composition of the invention produces good adhesion to the other layer (B) of a thermoplastic resin except PPS resins. If the PPS resin composition lacks any of those components (A2) and (A3), the multilayered moldings comprising the composition could not have good interlayer adhesion in practical use.
In the PPS resin composition of the invention, the elastomer (A4) having no epoxy groups, acid anhydride groups, carboxyl group and its salts, and carboxylate groups is not an indispensable component, but may be optionally present in an amount not larger than 70 parts by weight relative to 100 parts by weight of the PPS resin (A1) therein. In general, the elastomer (A4) may be added to the composition in an amount of from 10 to 60 parts by weight to improve the moldability of the composition. The moldings of the composition comprising the elastomer (A4) may have better outward appearance.
As the elastomer (A4), usable is any of polyolefinic elastomers, dienic elastomers, silicone rubbers, fluorine rubbers, polyurethane-type thermoplastic elastomers, polyester-type thermoplastic elastomers, and polyamide-type thermoplastic elastomers.
As examples of those elastomers, mentioned are polyolefinic elastomers such as ethylene-propylene copolymers, ethylene-butene copolymers, polybutenes, ethylene-propylene-diene copolymers, and ethylene-vinyl acetate copolymers; dienic elastomers such as styrene-butadiene copolymers, polybutadienes, butadiene-acrylonitrile copolymers, polyisoprenes, and butene-isoprene copolymers, and their hydrogenated derivatives; and acrylic elastomers such as ethylene-methyl acrylate copolymers, ethylene-ethyl acrylate copolymers, ethylene-isopropyl acrylate copolymers, ethylene-methyl methacrylate copolymers, and ethylene-ethyl methacrylate copolymers.
Of those, especially preferred are ethylene-propylene copolymers, ethylene-butene copolymers, and ethylene-propylene-diene copolymers. Those elastomers for the component (A4) may be used either singly or as combined.
It has been found that, where a layer of a PPS composition layer (A)1 comprising from 45 to 100 parts by weight of a PPS resin and from 0 to 55 parts by weight of a thermoplastic resin having at least one functional group selected from the group consisting of (A2)(1) epoxy groups, (A2)2 acid anhydride groups, (A2)3, carboxyl groups and salts, and (A2)4 carboxylate groups is further laminated to be adjacent to the PPS composition layer (A) in the multilayered moldings of the invention, the heat resistance, the chemical resistance and the gas permeation resistance of the moldings are further improved.
Another aspect of the invention is to provide a PPS composition which comprises a PPS resin, a thermoplastic resin except PPS resins, and a functional group-containing compound, and which gives the moldings good surface smoothness.
The PPS composition is characterized in that, when it is put into a melt indexer (315.5xc2x0 C., residence time of 5 minutes, load of 5 kg, orifice diameter of 0.0825 inches, orifice length of 0.315 inches) to obtain a gut, and when the gut is projected through a projector, the number of projections having a height of not less than 25 xcexcm as seen in the surface of the gut is not more than 1 (one) per cm of the gut.
We prepared a simple mixture of a PPS resin and a polyamide resin, and a functional group-containing compound, through simple melt-kneading using a single-screw extruder (screw:distributive mixing). After having observed the melt indexer gut of the composition, we found many projections formed on it. Using a transmission electron microscope, we further observed the projections, and found that, in those projections, the thermoplastic resin other than PPS and the functional group-containing compound were gelled through abnormal reaction therebetween and the resulting gel worsened the surface smoothness of the gut.
The resin composition of the invention may be prepared in any ordinary manner with no specific limitation, provided that it gives moldings with good surface smoothness. In one typical example for the preparation, a mixture of the constituent components is fed into any known melt mixer, such as a single-screw or double-screw extruder, a Bambury mixer, a kneader or a mixing roll, and kneaded therein at a temperature falling between 280 and 340xc2x0 C.
In order to effectively prevent any abnormal reaction between those constituent components and to further improve the surface smoothness of the moldings, for example, the PPS resin (A1) is first melt-kneaded with all or a part of the epoxy-containing compound (A2), and thereafter the resulting melt mixture is further melt-mixed with a thermoplastic resin (A3) which is not a PPS resin, and the remaining part of the functional group-containing compound (A2); or the PPS resin (A1) is melt-kneaded with a part of the functional group-containing compound (A2) to give a first composition, while, on the other hand, the thermoplastic resin (A3) which does not contain PPS resins is melt-mixed with the remaining part of the functional group-containing compound (A2) to give a second composition and thereafter those first and second compositions are melt-kneaded. These methods are extremely effective for the intended purpose.
Another method is also effective for that purpose, in which the PPS resin (A1) is first melt-kneaded with all or some of the functional group-containing compound (A2) and some of the functional group-free elastomer (A4), and the resulting composition is thereafter melt-kneaded with the thermoplastic resin (A3) which contains no PPS resins, or with the resin (A3) and the remaining part of (A2) and (A4).
In such multi-stage kneading, the order of addition of the PPS resin (A1), the functional group-containing compound (A2) and the thermoplastic resin (A3) containing no PPS resin to the mixing device is not specifically limited. In one example of the multi-stage kneading system, the components to be melt-kneaded in the first stage may be fed into the mixing device through the main hopper while the others to be melt-kneaded in the second stage may be fed into the hopper through side feeders. Where a small amount of additives are desired to be incorporated into the composition, they may be added to the pellets of the melt composition that has been prepared by any of the methods mentioned above, and the resulting pellets may be molded into moldings.
In the multilayered moldings of the invention, the layer (B) of a thermoplastic resin except which is not a PPS resin may optionally contain a filler (D), which, however, is not indispensable. The filler (D), if added, shall be not larger than 100 parts by weight relative to 100 parts by weight of the thermoplastic resin, excepting the PPS resins, of the layer (B). In general, the amount of the filler (D) may be from 10 to 90 parts by weight. When containing the filler (D), the strength, the stiffness, the heat resistance and the dimensional stability of the moldings are further improved.
The filler may be any of fibrous fillers, for example, glass fibers, alumina fibers, silicon carbide fibers, ceramic fibers, asbestos fibers, gypsum fibers, metallic fibers and carbon fibers; and non-fibrous fillers, for example, silicates such as wollastonite, zeolite, sericite, kaolin, mica, clay, pyrophyllite, bentonite, asbestos, talc and alumina silicate, metallic compounds such as alumina, silicon oxide, magnesium oxide, zirconium oxide and titanium oxide, carbonates such as calcium carbonate, magnesium carbonate and dolomite, sulfates such as calcium sulfate and barium sulfate, and also glass beads, boron nitride, silicon carbide and silica. These fillers may be hollow ones. Two or more these fillers may be used in combination. If desired, these fillers may be pre-treated with a silane-type or titanium-type coupling agent prior to their use.
The resin composition for the layer (A) that comprises a PPS resin (A1), an epoxy-containing compound (A2), a thermoplastic resin (A3) other than PPS resins, and a functional group-free elastomer (A4), and also the thermoplastic resin, except PPS resins, for the layer (B) to be laminated with the layer (A) may contain, if desired, any ordinary additives such as nucleating agents, mold release agents, antioxidants, heat stabilizers, lubricants, ultraviolet protectors, colorants and flame retardants, and even a small amount of any other polymers, within a range not interfering with the effect of the invention.
The method which comprises adding the fibrous and/or non-fibrous filler (D) to the thermoplastic resin other than PPS resins, for the layer (B) is not specifically defined. For example, the filler is previously mixed with the resin in a suitable mixer, and then fed into an extruder in which the mixture is melt-kneaded and pelletized, and thereafter the resulting pellets are directly fed into a molding machine; or alternatively, the filler is dry-blended with the resin in a mixer and thereafter the resulting dry blend is directly fed into a molding machine. However, those methods are not limitative.
To produce the multilayered moldings of the invention, any ordinary co-extrusion methods are employable. For example, where two-layered tubular moldings are produced, the PPS resin composition for the layer (A) and the thermoplastic resin other than PPS resins, for the layer (B) are separately fed into two and different extruders, the separate extrusion melts from those two extruders are introduced into one die under pressure, while producing two different tubular melt flows, those melt flows are combined in the die in such a manner that the melt flow of the PPS resin composition forms an inner layer while that of the thermoplastic resin other than PPS resins forms an outer layer, and the thus-combined melt flows are co-extruded out of the die to produce a two-layered tubular molding. For this, any known tube-forming methods and blow molding methods is employable. Where three-layered tubular moldings are produced, three extruders are used to form three layers in the same manner as above (in this case, all the three constituent layers may be different from one another); or two extruders maybe used to form three layers also in the same manner as above (in this case, two of the three constituent layers are the same). Where a larger number of plural extruders are used, four or more multi-layered tubular moldings can be obtained.
The methods mentioned hereinabove are only some examples concretely illustrating the invention, by which, therefore, the invention should not be limited.
The layer constitution comprising the layer (A) of a PPS resin composition and the layer (B) of a thermoplastic resin other than PPS resins in the multilayered moldings of the invention may be freely determined, depending on the requirements for the use of the moldings. For example, for two-layered moldings, one of those resins may be either an inner or outer layer. For three-layered moldings, the interlayer may be made of one of those resins. Depending on the number of laminations, two or more, or even four or more multilayered moldings are obtained herein.
In order to attain firm adhesion between the layer of the PPS resin composition and the layer of the thermoplastic resin other than PPS resins, it is desirable that the molding temperatures for those resins are planned to be as near as possible. If the melting temperature of the PPS resin composition is much lower than that of the thermoplastic resin other than PPS resins and if those resins are co-extruded, the surface of the PPS resin composition will solidify too rapidly resulting in that the interlayer adhesion between the two layers of those resins is lowered. Preferably, the molding temperature for the PPS resin composition falls between 290 and 330xc2x0 C., while that for the thermoplastic resin other than PPS resins is higher than its melting point by 10 to 80xc2x0 C.; but more preferably, the molding temperature for the PPS resin composition falls between 290 and 310xc2x0 C., while that for the thermoplastic resin except PPS resins is to be higher than its melting point by 20 to 60xc2x0 C.
The multilayered moldings of the invention have good hot water resistance, antifreeze resistance, chemical resistance, heat resistance, moldability and interlayer adhesion. These can be produced, for example, in the form of bottles, tanks and ducts through blow molding, and in the form of sheets, tubes, pipes and films through extrusion molding. The multilayered moldings of those forms are favorably used, for example, as water pipes, fuel tubes and fuel fillers in car parts, and even in electric and electronic parts. In addition, the multilayered moldings of the invention are further applicable to the field of chemicals.

Laminate containing a layer composed of polyphenylene sulfide blended with other polymers


A hair processing apparatus has facing members for nipping hair. The facing members have uneven surface portions on their contact surfaces which are engaged with each other. The uneven surface portions have a plurality of grooves along their length directions. The hair is placed along the grooves between the facing members, and pressed by making the facing members closer. Simultaneously, the facing members are kept at a high temperature to heat the hair. A method for hair processing uses the apparatus.

This invention relates to hair processing methods and apparatus to apply or transform permanent waves or related styles of hair, and more particularly to a method and apparatus which are based on the fact that essential characteristics of hair are changed by applying a predetermined pressure or certain pressure and heat to the hair, and which enables permanent wave shrunken or curled hair to be transformed into straight hair, to hair straightened by chemical process into waved hair, or make fine split hair back to the original state, and also enables to maintain processed states of straight, waved or treated hair for a long time.
Human hair, like skin and nails, consists of fibrous proteins known as keratins. Keratins are made up of coiled polypeptide chains combined to form supercoils of several polypeptides linked by disulfide bonds between adjacent amino acids. Aggregates of these supercoils form microfibrils, which are embedded in a protein matrix.
When analyzed on a individual structual basis, each hair is composed of a medullar (core) as its center, cortices which surround the medullar (the cortices are formed of longitudinally arranged spindle or cigar like shaped outer layer cells filled with keratin fibers), matrices which connects the cortex (outer layer) to each other (the matrices called padding material, have higher water absorption and moisture retention properties), and cuticles (outer layer of the hair) which surround the hair.
Therefore, to keep hair healthy for a long time, it is recommended to ingest adequate protein levels to provide enough to the body for forming keratin.
However, since hair is exposed to open air and sun light, and receives substances floating in the air, ingesting adequate protein as explained before does not suffice for ideal health of the hair. It is further recommended to make efforts to carry out hair health care by diligent shampoo and treatment of the hair.
For the purposes of this application, the term "permanent wave", which is a term of art, is defined as "Artificial waves in the hair produced by applying chemicals to it while wet, winding it on curlers, and drying it with heat." (The American Heritage Dictionary, Fourth College Edition, Houghton Mifflin Company, Boston--1991, at page 924). The noun form of this term may alternatively be utilized, and it is abbreviated herein as "perm". The term applies both to chemical treatments to impart and remove "waves" from the hair.
In a conventional processing of straight perm or wave perm, hair is washed and kept clean, and, a softening process (a first liquid process) is performed by applying or coating softening material such as a cold liquid onto the whole hair. Then, the whole hair is divided into some bundles, and, for each bundle, a heating process, combing process, deposition of creamy material, or rolling by a rod is performed (for wave perm). Next, a hardening process (a second liquid process) is performed by applying or coating hardening material such as a cold liquid. After a certain time period, if necessary, rods are removed, and the hair is processed with hot water rinse to finalize straight perm, wave perm or hair treatment.
The conventional straight perm, wave perm and hair treatment processes are performed by so called chemical steps only. That is, the stiffness of hair is changed by infiltrating the cold liquids (the first and second liquids) into matrices and cuticles portions of hair, and, during that process, the heating, combing, depositing or rolling process is performed for straight, wave perm or hair treatment. For that reason, the retention time of straight, wave perm and hair treatment is short.
According to conventional belief hair processing is time limited, and shape retention gradually degrades over time. Time for infiltrating cold liquids is limited in the above mentioned process (long time process involves significant damage to hair health condition), and it is impossible to infiltrate cold liquids into matrices and cuticles adequately. Further, frequent shampoo washes out the cold liquids and the hair tends to return to the original state. Thus the shape retention effect of straight or wave perm or hair treatment is gradually lost.
In order to improve the shape retention effect of the cold liquids, pH of the cold liquids (the first and second liquid) is, for example, adapted for each person according to her or his hair characteristics. However, adequate shape retention effects still have not been achieved according to known practice.
As a prior art means for heating hair, a heating iron having contact faces, which are formed in a shape such as a wave, was developed. In process of wave perm or the like with that iron, a bundle of hair is supported with one hand and the iron is held with the other hand. The bundle of hair is nipped between a pair of facing surface of the iron and the bundle of hair obtains the shape of the facing surface of the iron. The process is primarily based on the heating iron, and the object of the pressure applied to the hair while the hair nipped with the iron is to hold the hair. Therefore that process is completely different from hair processing of wave perm or the like, which will be clearly disclosed below. In other words, applications of pressure, based upon the structural characteristics of hair, have generally not be utilized in conventional hair processing techniques for to apply or transform permanent waves or related styles of hair.