A line light irradiation device includes a plurality of light source units on which a plurality of light source mounting substrates are juxtaposed on a base in a row, and the plurality of light source units are juxtaposed in a row. The plurality of light source mounting substrates are positioned and fixed to the base at predetermined intervals. Thus, if a light source in a certain light source unit becomes defective, this light source unit can be removed so as to exchange only the light source mounting substrate on which the defective light source is mounted. Therefore, the normal light sources can be left as they are as much as possible, and waste of the light sources can be reduced. Further, the light source mounting substrates are positioned and fixed at predetermined intervals, and thus dimensional errors do not accumulate in the light source mounting substrates at the juxtaposition ends.

Patent Literature 1 discloses one known example of such a line light irradiation device. This line light irradiation device includes a casing having a left-right pair of side panels and a bottom panel with an opening formed at the top panel side, and a light-emitting unit that is positioned on the bottom panel and has a plurality of LEDs (light sources) mounted in a row along the lengthwise direction on a long substrate.
In the light-emitting unit, the plurality of LEDs are mechanically mounted substantially linearly in one row so that their optical axes are aligned in a fixed direction on the surface of a strip-shaped printed circuit board. The LEDs are so-called power LEDs that can continuously pass a current of 200 mA or more, and are surface mounting-type LEDs in which LED elements are arranged in the center of a rectangular panel-shaped package. The LEDs are disposed, for example, such that the LED elements are aligned at fixed intervals in a single, substantially linear row.
Since a light source such as an LED light source has a useful life, the light source must be periodically exchanged, or exchanged every time a set number of usage hours have elapsed. Therefore, in the above-mentioned line light irradiation device, since each LED light source is fixed to a substrate within the device, when exchanging the LED light sources, the device had to be taken apart to remove the substrate and exchange each LED light source one-by-one or exchange the entire substrate.
However, there have been problems in that this kind of exchange operation required considerable time and labor and the operation efficiency was poor, and the manufacturing line had to be stopped for a long time when exchanging the LED light sources during manufacturing, which led to decreased productivity.
Patent Literature 2 discloses one known example of a line light irradiation device that solves the above-described problems.
This line light irradiation device includes a light source unit obtained by bonding a light source mounting substrate on which a plurality of light sources are mounted in a line shape and a heat radiation member that radiates heat from the light source mounting substrate, a main body housing on which a plurality of the light source units are aligned and mounted, and a drive control part that outputs a drive signal to the light source mounting substrate of each light source unit.
According to this kind of line light irradiation device, when a light source needs to be exchanged due to reaching the end of its life or the like, the light source units can be removed from the main body housing and each light source unit can be exchanged individually. Thus, the maintenance is easy and the operability is improved.


A novel alfalfa variety designated 53V52 and seed, plants and plant parts thereof. Methods for producing an alfalfa plant that comprise crossing alfalfa variety 53V52 with another alfalfa plant. Methods for producing an alfalfa plant containing in its genetic material one or more traits introgressed into 53V52 through backcross conversion and/or transformation, and to the alfalfa seed, plant and plant part produced thereby. Hybrid alfalfa seed, plant or plant part produced by crossing alfalfa variety 53V52 or a trait conversion of 53V52 with another alfalfa line. Alfalfa lines derived from alfalfa variety 53V52, methods for producing other inbred alfalfa lines derived from alfalfa variety 53V52 and the alfalfa lines and their parts derived by the use of those methods.

Alfalfa (Medicago sativa L., also known as lucerne) is one of the world's most valuable forage legumes. It is grown for hay, pasture and silage, and is valued highly as a livestock feed. Alfalfa is highly effective in nitrogen fixation, and is frequently planted in crop rotation to replenish nutrients depleted from the soil by other crops such as corn.
Alfalfa originated in the Near East, in the area extending from Turkey to Iran and north into the Caucasus. From the great diversity of forms within the genus Medicago, two species, M. sativa and M. falcata, have become important forage plants. These species are mainly tetraploid, with 32 chromosomes, although diploid forms are known.
Alfalfa is a herbaceous perennial legume characterized by a deep tap root showing varying degrees of branching. Erect or semi-erect stems, bearing an abundance of leaves, grow to a height of 2-3 feet. The number of stems arising from a single woody crown may vary from just a few to 50 or more. New stems develop when older ones mature or have been cut or grazed. Flowers are borne on axillary racemes which vary greatly in size and number of flowers. Flower color is predominantly purple, or bluish-purple, but other colors occur. The fruit is a legume, or pod, usually spirally coiled in M. sativa. Seeds are small, with about 220,000/lb., and the color varies from yellow to brown. Alfalfa is widely adapted to temperature and soil conditions, except for humid tropical conditions. Reproduction in alfalfa is mainly by cross-fertilization, but substantial self-pollination may also occur. Cross-pollination is effected largely by bees.
The commercial production of seeds for growing alfalfa plants normally involves four stages, the production of breeder, foundation, certified and registered seeds. Breeder seed is the initial increase of seed of the strain which is developed by the breeder and from which foundation seed is derived. Foundation seed is the second generation of seed increase and from which certified seed is derived. Certified seeds are used in commercial crop production and are produced from foundation or certified seed. Foundation seed normally is distributed by growers or seedsmen as planting stock for the production of certified seed.


In thin film transistors (TFTs) having an active layer of crystalline silicon adapted for mass production, a catalytic element is introduced into doped regions of an amorphous silicon film by ion implantation or other means. This film is crystallized at a temperature below the strain point of the glass substrate. Further, a gate insulating film and a gate electrode are formed. Impurities are introduced by a self-aligning process. Then, the laminate is annealed below the strain point of the substrate to activate the dopant impurities. On the other hand, Neckel or other element is also used as a catalytic element for promoting crystallization of an amorphous silicon film. First, this catalytic element is applied in contact with the surface of the amorphous silicon film. The film is heated at 450 to 650° C. to create crystal nuclei. The film is further heated at a higher temperature to grow the crystal grains. In this way, a crystalline silicon film having improved crystallinity is formed.

1. Field of the Invention
The present invention relates to a method for forming a semiconductor device using a crystalline semiconductor in a semiconductor device forming method. Further, the present invention relates to a method for forming thin film transistors (TFTs). TFTs according to the invention can be formed either on an insulating substrate as made of glass or on a semiconductor substrate as made of a single crystal of silicon. More particularly, the invention relates to TFTs formed, utilizing both a crystallization process using thermal and/or optical annealing and an activation process.
2. Description of Related Art
In recent years, an insulated gate semiconductor device comprising a thin film active layer (also called an active region) formed on an insulating substrate has been studied. Especially, researches on insulated gate thin film transistors (TFTs) have been earnestly conducted. These TFTs are formed on a transparent insulating substrate and used to control pixels of a display device such as a liquid crystal display having a matrix structure. Also, the TFTs are used in the driver circuit of the display device. Depending on the material and the state of the crystal of the used semiconductor, they are classified as amorphous silicon TFTs or crystalline silicon TFTs.
Generally, an amorphous semiconductors have small field mobilities and so they cannot be used in TFTs which are required to operate at high speeds. Since the field mobility of P-type amorphous silicon is quite small, it is impossible to form P-channel TFTs (PMOS TFTs). Therefore, a complementary MOS circuit (CMOS) which would be formed by combining an N-channel TFT (NMOS TFT) with such a P-channel TFT cannot be obtained.
On the other hand, crystalline semiconductors have higher field mobilities than those of amorphous semiconductors and thus can operate at higher speeds. With crystalline silicon, PMOS TFTs can be formed as well as NMOS TFTs and so CMOS circuits can be built. For example, in a known active matrix liquid crystal display, not only the active matrix portions but also the peripheral circuit such as drivers are composed of CMOS crystalline TFTs. This structure is known as a monolithic structure. For this reason, TFTs using crystalline silicon have been earnestly studied and developed recently.
One method of obtaining crystalline silicon is irradiation of an amorphous silicon with laser light or other equivalent intense light so as to crystallize the silicon. However, there is no prospect of mass production because of instability of the laser output and instability caused by the fact that the process is quite short.
The method which is currently considered to be capable of being put into practical use is to crystallize amorphous silicon by heat. In this method, crystalline silicon can be obtained with small variations among batches. However, this method is not free from problems.
Usually, in order to obtain crystalline silicon, it is necessary that annealing is carried out at about 600° C. for a long time or that annealing is carried out at a high temperature exceeding 1000° C. Where the latter method is adopted, the usable substrate material is limited to quartz, thus increasing the cost of the substrate greatly. Where the former method is adopted, the material of the substrate can be selected from various substances but shrinkage of the substrate caused during thermal annealing presents problems. In particular, a decrease in the forming yield due to misalignment of masks has been pointed out. Accordingly, there is a demand for a process at lower temperatures. Specifically, there is a demand for a process which is carried out below the strain points of (preferably at temperatures lower than the strain points of glasses by more than 50° C.) various non-alkali glasses used as materials of substrates. The present invention is intended to solve these difficulties. It is an object of the invention to provide a method of mass-producing TFTs without incurring the foregoing problems.
TFTs are formed using a thin film semiconductor formed on a substrate. These TFTs are used in various ICs. Especially, TFTs of this kind have concerned as switching devices located at pixels in an active matrix liquid crystal display and as driver devices formed in peripheral circuit portions.
It is easy to use an amorphous silicon film as thin film transistors used in TFTs. However, this method has the problem that the electrical characteristics are low. In order to improve the characteristics of TFTs, a crystalline thin film silicon may be used. Crystalline silicon films are variously known as polycrystalline silicon, polysilicon, and silicon crystallite. To obtain such a crystalline silicon film, an amorphous silicon film is first formed. Then, the film is crystallized by heating.
However, crystalline silicon thin films obtained by the conventional heating process have relatively small particle diameters, and these particles are not uniform in size. In consequence, their characteristics are not uniform. Furthermore, their mobilities which represents the performance of completed devices are much inferior to the mobilities of single crystal silicon. Therefore, there is a demand for a crystalline silicon thin film having improved characteristics.
Our research has revealed that crystallization can be performed at 450 to 650° C., e.g., about 550° C., in a short time on the order of 4 hours by depositing a trace amount of elements such as nickel, palladium, and lead on the surface of an amorphous silicon film and then heating the laminate. Also, the obtained crystal grains can be controlled by the temperature and time of the crystallization. This means that an active layer necessary for devices can be formed.
In order to introduce a trace amount of element as described above, or a catalytic element for promoting crystallization, plasma processing, evaporation, or ion implantation is employed. The plasma processing uses a parallel plate type or positive column type CVD apparatus. Electrodes containing a catalytic element are used. A plasma is generated in an ambient of nitrogen, hydrogen, or the like. In this way, the catalytic element is added to the amorphous silicon film.
However, if the above described element exists in abundance in a semiconductor, then the reliability and the electrical stability of an device using this semiconductor is deteriorated. This produces undesirable results.
In particular, an element for promoting crystallization such as nickel (referred to herein as a catalytic element) is necessary to crystallize amorphous silicon but it is desired that the amount of catalytic elements in the crystallized silicon should be reduced to a minimum. To fit this requirement, a catalytic element which tends to be inactive within crystalline silicon is selected. At the same time, the amount of a catalytic element necessary for crystallization is minimized. For this purpose, it is necessary to precisely control the amount of the introduced catalytic element.
Using nickel as a catalytic element, an amorphous silicon film is formed, nickel is introduced by plasma processing and a crystalline silicon film is formed by heating. The crystallization process is carefully examined and discovered the following items:    (1) Where nickel was introduced into the amorphous silicon film by plasma processing, nickel atoms are penetrated considerably deep into the amorphous silicon film before the heating processing.    (2) At first, nuclei of crystals are produced at the surface through which nickel atoms are introduced.    (3) Where a nickel film is formed on the amorphous silicon film by evaporation, crystallization occurs in the same way as in the case in which plasma processing is carried out.
From the above items, it is concluded that all the nickel atoms introduced by plasma processing does not function effectively. That is, if a large amount of nickel is introduced, some nickel atoms may not function sufficiently. Therefore, it is considered that the points or surfaces at which nickel atoms are in contact with silicon atoms function during low temperature crystallization. it is concluded that nickel atoms are required to be dispersed most finely, i.e., almost on an atomic scale. In other words, the requirement is that a minimum concentration of nickel is dispersed on an atomic scale near the surface of an amorphous silicon film within a concentration range which permits low temperature crystallization.
Evaporation can be used as a method of introducing an infinitesimal amount of nickel only into a surface region of an amorphous silicon film, i.e., introducing an infinitesimal amount of a catalytic element for promoting crystallization of an amorphous silicon film only into a surface region of the amorphous silicon film. However, it is not easy to control the evaporation process, and it is difficult to strictly control the amount of the introduced catalytic element.
It is necessary that the amount of the introduced catalytic element is reduced to a minimum. In this case, satisfactory crystallinity cannot be obtained.

Semiconductor Energy Laboratory Co., Ltd.


A ball grid array (BGA) connection system includes an integrated circuit (IC) package that includes a plurality of conductive balls forming a ball grid array (BGA) arranged in a matrix pattern. A printed circuit board (PCB) includes a plurality of ball sockets arranged in a corresponding matrix pattern. Each ball socket includes a base having one side that engages the PCB and an opposing side configured for seating a conductive ball of the BGA. A plurality of prongs are secured to and extend from the base and configured to receive and hold a conductive ball into contact with the base.

A ball grid array (BGA) is related to a pin grid array (PGA), in which an integrated circuit (IC) package includes face covered or partly covered with pins in a PGA or balls in a BGA, usually in a grid or matrix pattern. The pins and balls conduct electrical signals from the IC positioned in the IC package to a printed circuit board (PCB) e.g., a printed wiring board, on which the package is placed. In a BGA, the balls are conductive balls, typically formed from solder and positioned at the bottom of the IC package. Usually the PCB carries copper pads in a matrix pattern that matches the matrix pattern formed by the conductive balls. In some manufacturing techniques, the assembly is heated in a reflow oven or infrared heater, causing the conductive balls to stick to the PCB. Usually, the composition of the solder alloy and soldering temperature are chosen such that the solder does not completely melt, but stays semi-liquid, allowing each conductive ball to stay separate from its neighbors.
A BGA IC package usually has a lower thermal resistance between the IC package the PCB such that any heat generated by the IC flows more easily to the PCB, preventing the IC chip from overheating. Also, because the conductive balls of a BGA are shorter than pins of a PGA as an electrical conductor, the balls have lower inductance than the pins and prevent unwanted distortion of signals in high-speed electronic circuits. One disadvantage of a BGA, however, is that the conductive balls often cannot flex in the manner of pins in a PGA. Any bending and thermal expansion within the PCB is transmitted directly to the BGA IC package, causing solder joints to fracture under high thermal or mechanical stresses. In some designs, this is overcome by matching the coefficient of thermal expansion (CTE) between the PCB and IC package, but even then, it is difficult to inspect for soldering failure once the IC package is secured to a PCB.
As a result, a BGA package has limited inspectability, reworkability and testability and has reliability issues and design limitations when the CTE mismatch between the IC package and the PCB is large. There are a number of proposals with different BGA products, but these products increase the package footprint, height, weight and assembly steps more than desired.

Ball grid array (BGA) connection system and related method and ball socket


Information matching output attributes and/or content attributes is contained in a single data content for distribution and is divided by tags for separation during processing. The expression format is prescribed by style sheets, so that the receiving system side selectively stores style sheets matching the content attributes of the distribution content or matching the output attributes of the output apparatus.

1. Technical Field
The present invention relates to digital data distribution, such as a digital satellite broadcast or other multimedia content communication, and in particular to distributing digital data comprised of computer language commands defining data attributes. The computer language commands are represented, for example, in the form of data that is divided by tags that define the data attribute, known as a "markup language".
Further, the present invention relates to the distributing of data content in a language that uses arbitrarily definable tags, such as XML (eXtensible Markup Language), within the data broadcast and to the receiving and displaying of the content. In particular, the invention relates to the distributing and selecting of style sheets for prescribing the expression format of XML instances or XSL (eXtensible Style sheet Language) documents.
2. Background Art
In the field of broadcasting, the use of digital data is rapidly growing. Digital signals are superior to analog signals because of their stability and the higher compressibility of the data. Further, digital signals, whether sent over a cable, a ground wave or a satellite wave, provide more channels than analog signals for certain bands. In addition, though various information, such as documents, voice data and picture data are separated in a conventional transmission, the digitized broadcast data enables transmission of these monomedia data types indiscriminately.
For example, using a digital broadcast, improved service is provided to users (i.e., viewers) by sending EPG (Electric Program Guide) and other system information as part of the data broadcast content together with the image and voice information. The EPG may include the capability of video recording, in addition to providing a broadcast schedule, a name of broadcast programs and other information.
Data delivered in a digital format has a high compatibility with general-purpose computer systems and with other non-television information equipment. For example, a general-purpose computer system may be equipped with a tuner card for satellite broadcasts to parse the EPG data received in the computer, process the same for display, and display program tables and other menu screens in a window. Using such a menu screen, it is possible to switch programs and reserve video recordings by moving a mouse controlled cursor or using a touch panel. Moreover, it is possible to store the received data broadcast content on a hard disc, that is integrated with the computer, to be reproduced or reused.
Moreover, using a digital broadcast, it is possible to enhance the interaction of broadcast programs by taking advantage of the band used and by transmitting data other than the image and voice broadcast programs. For example, in a broadcast program in which true-false quizzes are given, the transmission of answers as well as image and voice data enables the satellite TV broadcast receivers (i.e., viewers) to use answer menu buttons on the computer display and to check the answers by means of the mouse cursor or the touch panel.
When the interaction is further enhanced, home TV receivers may play an active role as an information controller to handle more than image content. For example, a TV receiver may serve as an Internet terminal or as an electronic commerce terminal.
In Japan, the ARIB (Association of Radio Industries and Businesses) is playing a central role in promoting standardization of the digital satellite data broadcast. Using the digital satellite broadcast, digital transfer data supplementary to the broadcast program is distributed, in addition to the image and voice data constituting the main body of the broadcast program (AV data). More specifically, data is transmitted as broadcast waves in the form of a transport stream obtained by multiplexing the AV data compressed by a specified compression method, such as the MPEG (Motion Picture Experts Group) 2 format, with digital transfer data.
An example of broadcast program information transmitted as data broadcast content is the aforementioned EPG (Electric Program Guide). Information inherent to the main body of the broadcast program may be included, such as the title and date of the broadcast program as well as the program casting. The types of and the construction of the data contained in the broadcast program information are systematized to some extent in accordance with the service content provided by the main body of the program. For example, information related to recipes and food materials may be delivered with a cooking program, the number of votes cast may be obtained and renewed constantly and then delivered in a real-time report of election returns, and the individual batting and pitching records of various players and the team rankings may be delivered with a professional baseball game broadcast.
Broadcast program information is typically displayed using part of the same display screen of the receiving system that displays the main body of the broadcast program. The receiving system typically includes a receiver for receiving, tuning and decoding the broadcast wave, such as a set top box (STB) and a television (TV) set for displaying/outputting the broadcast. The receiving system is typically installed in the home of a viewer.
The construction of content distributed as digital broadcast data, hereinafter referred to as "data broadcast content", is explained by referring to FIG. 1.
As shown in FIG. 1, the data broadcast content consists of a large variety of monomedia data including text data, still pictures, animation images, voice data, etc., as well as a display and output control program that prescribes the state of broadcast program information by handling integrally each of the monomedia data or multimedia data, generally referred to as a multimedia coding application. It is possible to integrate information corresponding to the monomedia information to the display output control program.
As part of the standardization of the digital satellite data broadcast undertaken by the aforementioned ARIB, a first attempt at a format for describing the multimedia coding applications of data broadcast content used MHEG (Multimedia and Hypermedia Expert Group). MHEG is a descriptive language that defines data attributes and displays multimedia content on TVs and which is designed to allow viewers to obtain their desired information from Video On Demand (VOD) or digital TV broadcast. MHEG-5 is already used in the Japanese CS (Communication Satellite) digital broadcast known as SKY Perfect TV.
MHEG, however, uses a fixed coding space and lacks extensibility. In other words, a unilaterally fixed coding space must be used to describe a change of a single function. For example, an API (Application Programming Interface) requires a considerable amount of correction work. In addition, MHEG is generally not well known, and thus data content written in MHEG is not circulated in a sufficient quantity. In this sense, MHEG has a relatively low applicability for general-purpose computers.
As a result, the ARIB is examining standardization based on XML (eXtensible Markup Language) in place of MHEG. More specifically, work is progressing in dividing content into "basic XML", also referred to as BML ("Broadcast Markup Language"), and "advanced XML", an extended version of the basic XML.
XML allows for the optional definition of tags and has no restrictions on the way attributes are described. XML therefore allows a high degree of freedom and its high applicability in general-purpose computers and the Internet provides advantages over MHEG. Furthermore, XML is now being developed as a descriptive language for the next generation of the Internet.
When XML is used as the standard language of data broadcast content, it is possible to exchange data for digital broadcast among a variety of information equipment, such as computers, TVs, telephones, etc. In addition, as XML can be used to freely define tag attributes, it is more suitable for data processing than HTML (Hyper Text Markup Language). Consequently, its use is rapidly expanding in various fields including electronic commerce.
Document files written in XML format are called "XML instances." The writing of attribute information (or tag grammar) is governed by a standard known as DTD (Document Type Definition). For example, a DTD may be established for every industry or for every service provided by each industry.
XML instances themselves do not always contain the style information on the form expressed, such as the form of the output to displays or the form of the output to printers, etc. In this case, the expression of the XML instances is described by a "style sheet" or a document file different from DTD.
The style sheet for XML instances can be written by using particular languages, such as in the form of XSL (eXtensible Style sheet Language), CSS (Cascade Style Sheet), XSLT (XSL Transformation) or a standard derived from the abovementioned. Alternatively, a script may be inserted into a style sheet. A script is a method of executing software described in a text form in the same manner as ordinary source programs. A script is used to automate a series of processes resulting from the combination of operating procedures that users can control, such as specific keys or buttons, in an application or in an OS (Operating System).
Even when XML instances are the same, depending on the description in the style sheet concerned, the same XML instance may be expressed on the display screen in a completely different form by varying the font style, size or color. In other words, a style sheet has the function of providing added information to the original XML instance. It can be assumed that the importance of style sheets will grow in the future as more attractive style sheets are designed by specialized designers.
Style sheets can be transmitted in a file separate from that storing the XML instance. For example, XML instances may be distributed by data broadcast, whereas the style sheets may be distributed using other forms of distribution, for example, using portable recording media such as a CD (Compact Disc), an MO (Magneto-Optical) disc, a DVD (Digital Versatile Disc) or by file transfers through the Internet.
Meanwhile, the choice of display apparatus that can output the data broadcast content are becoming more diverse. For example, in addition to the conventional NTSC (National Television System Committee) color television systems, HDTV (High Definition Television) systems with many scanning lines for large screens, PDA (Personal Digital Assistant) devices with a monochrome liquid crystal display of a small screen size, and relatively high definition computer screens such as SVGA (Super Video Graphic Array) or XGA (eXtended Graphic Array) are under development.
Thus, though the data content may be the same, when the display capacity of the output device is different, the optimum form of the display is different. For example, a display format that is optimum for a high resolution, high definition HDTV is not necessarily appropriate for a low resolution, small screen PDA. As mentioned earlier, the format used for expressing content is defined by style sheets. Therefore, the style sheet that is appropriate for such content is determined by the display and output capacity and expression capacity of the display apparatus to which the data content is outputted.
Also, even when the resolution and other hardware capacity for the display apparatus are identical, the optimum format of display may differ depending on the manufacturer and the type of apparatus used.
In addition, depending on the attribute of data broadcast content, for example, depending on the data shown by the tags <POSITION>, <COLOR>, <SIZE>, etc., the optimum choice of style sheet may differ.
Further, the optimum style sheets or the style sheets most preferred by the receiving user are not always distributed together with the data broadcast content.

Data distribution method and apparatus, and data reception method and apparatus


An integrated optical I/O and semiconductor chip with a direct liquid jet impingement cooling assembly are disclosed. Contrary to other solutions for packaging an optical I/O with a semiconductor die, this assembly makes use of a metal clad fiber, e.g. copper, which will actually enhance cooling performance rather than create a design restriction that has the potential to limit cooling capability.

1. Technical Field of the Invention
This invention pertains to cooling semiconductor chips. In particular, this invention utilizes heretofore unused thermal channels, thereby providing enhanced heat dissipation for electronic products.
2. Description of the Prior Art
Many advanced microprocessor designs are reaching the limits of thermal dissipation which can be accommodated by air cooling alone. Examples include multi-core processors, multi-chip modules, as well as high performance microprocessors used for home entertainment. Efforts to control thermal dissipation through redesign of the chips have met with some success, but the use of air cooling places fundamental limitations on the thermal management of these systems. In addition, many of these chips require very high I/O count and high interconnect density, which has begun to push the limits of conventional electrical interconnnects. In order to address both of these concerns, we propose a version of direct liquid jet cooling for these applications which incorporates metal clad optical fibers to enhance cooling performance. Metal clad fibers have been recommended in the technical literature for highly corrosive environments and for increased mechanical protection of the glass fiber but have never been designed into a microprocessor package to provide cooling enhancing properties.

Coupling metal clad fiber optics for enhanced heat dissipation

International Business Machines Corporation


Golf clubs, and a matched set of golf clubs, with each golf club having a hollow shaft with a head end and grip end. A resilient grip is fitted about the grip end of each shaft, and the grip has a butt end and a forward end and a midpoint therebetween. A clubhead is secured to the head end of each shaft. A frictionally-dissipative, vibration-damping counterweight (dash pot) is positioned within each hollow shaft (except for that of the 1-wood or driver) at the grip end thereof. The counterweight is at least substantially entirely contained between the midpoint and the butt end of the grip. The various counterweights are sized to position the center of gravity of each individual club a selected distance from the head end of the hollow shaft of the individual club, such that the selected distance does not decrease for successively shorter clubs in the matched set.

Contemporary designers of golf clubs typically intentionally remove weight from the grips and shafts of clubs. In fact, one golf club manufacturer (Goldwin Golf) currently advertises that it has eliminated 40 grams (about 1.6 ounces) of "dead" weight from the grip end of one of its drivers. This design approach is consistent with the beliefs of many that any additional weight in a club can only retard a club's swing speed at impact, and that any weight not in the clubhead thereby necessarily reduces the maximum amount of momentum that the club can transfer to the ball. Because it is based on the idealization of the swinging of a golf club as a simple pendulum, however, this approach overlooks significant subtleties of the physical dynamics of an efficient golf swing.
Recently, T. P. Jorgensen in The Physics of Golf, (AIP Press, 1994) has modeled the downswing as the motion of a double pendulum driven by a lateral shift of the leading shoulder and a constant torque applied at the leading shoulder (the higher of the double pendulum's two pivot points). He has labeled his model as a "Standard Model" of the downswing. Further consideration of this model and of its implications for the optimal weighting of golf clubs is discussed in the section herein entitled "Operation."
For more than 50 years, makers of golf clubs have referred to clubs with a higher percentage of their overall weight concentrated in their heads as having greater so-called "swingweight". Strictly speaking, swingweight is a measure of a club's moment of weight about an arbitrary axis, with the axis being located either 14 inches (Lorhythmic Scale, Prorhythmic Scale, et al) or 12 inches (Official Scale) from the butt end of the shaft. On the Lorythmic Scale, one unit of swingweight, which is smaller than any difference that a golfer can feel between two clubs, is roughly equivalent to about 0.065 ounces in the head of a wood or about 0.07 ounces in the head of an iron. Historically, the Official Scale is a revision of the Lorhythmic Scale, which appears to have been chosen, in part, to facilitate the design of a relatively compact device for measuring a moment of weight of golf clubs.
Neither of these scales accurately measures a club's moment of weight about the club's wrist cock axis, which is the axis about which the club actually rotates relative to the leading arm during a swing. In practice, when a golfer grips a club with both hands, the wrist cock axis is located in the vicinity of a righty's left thumb or a lefty's right thumb. Either way, when a golfer grips a club at its full length, we conventionally assume that the wrist cock axis is located about 5 inches from the butt end of the shaft.
In spite of swingweights not being measured relative to the wrist cock axis, however, golf club makers continue to use swingweight as a basis for matching sets of clubs. These matched sets normally progress in even increments of length and weight from longer clubs with lighter heads to shorter clubs with heavier heads. Consequently, a constant swingweight can be maintained by choosing an appropriate common increment in clubhead weight to offset the combined effects of shafts with incrementally decreasing lengths and weights and grips with constant weight.
The traditional method of matching by swingweight also produces sets of clubs for which each club's center of gravity gets closer to the head end of its shaft for successively shorter and heavier clubs. This fact is especially relevant because other inventors previously have patented a variety of non-traditional methods of matching sets of clubs by altering the weights of one or more of the clubs' components. To this inventor's knowledge, however, none of these methods produce sets of clubs for which the centers of gravity do not get closer to the head ends of the shafts for at least some of the clubs in a matched set as the clubs get successively shorter and heavier.
For example, U.S. Pat. No. 4,887,815 to Hughes et al. describes that various weights may be removed from conventional clubheads when counterweights of constant weight are added to produce a set of clubs with significantly reduced but roughly constant swingweights. U.S. Pat. No. 5,152,527 to Mather et al. describes that various weights may be removed from the clubheads, and counterweights of decreasing weight are added to shafts of decreasing length. In U.S. Pat. No. 5,228,688 to Davis it is discussed that conventional lengths and faces of clubs are varied, and counterweights of decreasing weight are added to clubs of decreasing length. In U.S. Pat. No. 4,461,479 to Mitchell, the counterweights for woods are substantial, with those for the 3, 4, and 5-wood in an example exceeding those for any of the irons. The counterweights for successive irons in this same example also progress by too small a common increment (0.10 ounce=2.853 grams) to prevent the centers of gravity of successively shorter clubs from moving progressively closer to the head ends of their shafts.
Considering, next, devices for damping unwanted vibrations of the shafts of golf clubs, we observe that one major shaft manufacturer (True-Temper) recently has introduced shafts with energy-absorbing inserts or liners called SENSICORE.TM., and a major club manufacturer (Karsten Manufacturing or "Ping") has introduced another vibration-dampening mid-shaft insert known as CUSHIN.RTM.. Both of these vibration-damping mechanisms are relatively light in weight and are positioned in the shafts of clubs below the grips.
In U.S. Pat. No. 5,362,046 to Sims it is disclosed that a vibration-damping device is inserted in the butt end of the shafts of clubs. This device, an embodiment of which currently is being marketed as SIMS SHOCK RELIEF.TM., necessarily incorporates a member that is relatively free to move within the shaft. As disclosed, this device is composed entirely of an elastomer, and the ratio of its head width to its stem length is in the range of 5:1 to 1:1. Thus, it is light in weight, and, except for its vibration damping, has little effect on a club's dynamic response.
The known prior art makes no attempt to design or to use counterweights simultaneously as frictionally dissipative, vibration-damping devices (dash pots) in any of the counterweight devices and systems cited above. Indeed, special care has been taken in all of the patents to affix the counterweights immovably to the interior of shafts. In U.S. Pat. No. 4,461,479 to Mitchell, for example, counterweights are encased tightly in flexible sleeves that, in turn, are bound tightly within clubs' hollow shafts in an effort to insulate the counterweights from mechanical stresses, such as vibrations of the shafts.
Accordingly, a need yet remains for golf clubs and for complete sets of golf clubs with improved overall playability and instructional utility, and which damp or lessen vibration and shock in the user's hands. The present invention is directed principally to the provision of such clubs and sets of clubs.

Golf clubs, and matched sets thereof, with frictionally-dissipative, vibration-damping counterweights


An upper electrode is formed on one surface of a semiconductor multilayer structure including a light emitting layer. An interface electrode is formed at a region of another surface of the semiconductor multilayer structure except a region right under the upper electrode. A center of the interface electrode coincides with a center of the upper electrode. At least a part of the interface electrode has a similar shape to a shape of an outer periphery of the upper electrode. A current blocking layer is formed at another region of another surface of the semiconductor multilayer structure except the region where the interface electrode is formed. A reflecting layer for reflecting a part of the light emitted from the light emitting layer is electrically connected to the interface electrode. A conductive supporting substrate is electrically connected to the semiconductor multilayer structure.

1. Field of the Invention
The present invention relates to a light emitting device, in more particular, to a light emitting device, in which a photoelectric conversion efficiency is improved by improving a light extract efficiency.
2. Related Art
As one of conventional light emitting diodes, for instance, there is an LED in which a light emitting part of an active layer is not located right under an electrode provided at a light extracting side.
This type of LED comprises a GaAs substrate, a semiconductor multilayer structure formed on one surface of the GaAs substrate, the semiconductor multilayer structure comprising an n-type cladding layer, a p-type cladding layer, and an active layer provided between the n-type cladding layer and the p-type cladding layer, a circular upper electrode having a predetermined outer diameter that is formed on one surface of the semiconductor multilayer structure, and a lower electrode formed on another surface of the GaAs substrate, in which a concentric ring-shaped current injection region having an inner diameter and an outer diameter that are greater than an outer diameter of the upper electrode is formed at an interface between the GaAs substrate and the semiconductor multilayer structure, and a current confining layer is formed inside and outside of the current injection region. For example, Japanese Patent Publication No. 6-82862 (JP-B-6-82862) discloses this type of LED.
In this type of LED, the current injected from the upper electrode is flown through the concentric ring-shaped current injection region to the lower electrode, without passing through a part of the active layer located right under the upper electrode by means of the current confining layer. As a result, a light emission at the part of the active layer located right under the upper electrode is suppressed, and a main light emission is generated at another part of the active layer, through which the upper electrode is connected to the concentric ring-shaped current injection region, thereby improving the light extract efficiency.
Further, as another one of the conventional light emitting diodes, for instance, there is an LED, in which a light emitting part of an active layer is not located right under an electrode provided at a light extracting side, in order to relax a local current convergence to the active layer, as well as to control a light absorption in a semiconductor substrate. In this type of LED, a current confining layer is formed in a region right under an upper electrode at an interface between the semiconductor substrate and a semiconductor multilayer structure, a plurality of interface electrodes are arranged outside of the current confining layer in a matrix shape, the interface electrodes are isolated from each other by the current confining layer, and a reflecting layer is formed between the interface electrodes and current confining layer and the semiconductor substrate. For example, U.S. Pat. No. 6,784,462 discloses this type of LED.
In this type of LED, the current injected from the upper electrode is flown into the lower electrode via a plurality of the electrodes disposed in the matrix shape, so that it is possible to relax the local current convergence to the active layer and to reflect the light emitted from the active layer to the semiconductor substrate side at the reflecting layer toward the upper electrode side. According to this structure, it is possible to suppress the absorption of the light emitted from the active layer by the semiconductor substrate.
However, in the LED disclosed by JP-B-6-82862, since a part of the light emitted from the active layer is absorbed by the upper electrode and the GaAs substrate, there is a limit for the improvement in the light extract efficiency. In addition, in the LED disclosed by U.S. Pat. No. 6,784,462, since there is a difference in distances from the upper electrode to the respective interface electrodes in addition to the absorption of the light by the upper electrode as described above, a difference is caused in electric resistance of a plurality of current paths between the upper electrode and the respective interface electrodes through the active layer. Therefore, a difference is caused in the current flowing through the active layer, so that a difference is caused in heat generation (elevation of a temperature), luminance, and the like. As a result, there is a disadvantage in that the driving voltage and the lifetime of the LED vary among the respective devices.


By selectively performing a pre-amorphization implantation process in logic areas and memory areas, the negative effect of the interaction between stressed overlayers and dislocation defects may be avoided or at least significantly reduced in the memory areas, thereby increasing production yield and stability of the memory areas.

1. Field of the Invention
Generally, the present invention relates to the formation of integrated circuits, and, more particularly, to the formation of field effect transistors in complex circuits including a complex logic circuitry and a memory area, such as a cache memory of a CPU.
2. Description of the Related Art
The fabrication of integrated circuits requires the formation of a large number of circuit elements on a given chip area according to a specified circuit layout. Generally, a plurality of process technologies are currently practiced, wherein, for complex circuitry, such as microprocessors, storage chips and the like, CMOS technology is currently the most promising approach, due to the superior characteristics in view of operating speed and/or power consumption. During the fabrication of complex integrated circuits using CMOS technology, millions of complementary transistors, i.e., N-channel transistors and P-channel transistors, are formed on a substrate including a crystalline semiconductor layer. A MOS transistor, irrespective of whether an N-channel transistor or a P-channel transistor is considered, comprises so-called PN junctions that are formed by an interface of highly doped drain and source regions with an inversely or weakly doped channel region disposed between the drain region and the source region.
The conductivity of the channel region, i.e., the drive current capability of the conductive channel, is controlled by a gate electrode formed above the channel region and separated therefrom by a thin insulating layer. The conductivity of the channel region, upon formation of a conductive channel due to the application of an appropriate control voltage to the gate electrode, depends on the dopant concentration, the mobility of the majority charge carriers, and, for a given extension of the channel region in the transistor width direction, on the distance between the source and drain regions, which is also referred to as channel length. Hence, in combination with the capability of rapidly creating a conductive channel below the insulating layer upon application of the control voltage to the gate electrode, the conductivity of the channel region substantially determines the performance of the MOS transistors. Thus, the reduction of the channel length, and associated therewith the reduction of the channel resistivity, renders the channel length a dominant design criterion for accomplishing an increase in the operating speed of the integrated circuits.
The shrinkage of the transistor dimensions also raises a plurality of issues associated therewith that have to be addressed so as to not unduly offset the advantages obtained by steadily decreasing the channel length of MOS transistors. One major problem in this respect is the reduction of so-called short channel effects, which occur upon reducing the channel length. Generally, with a reduced channel length, the controllability of the channel becomes increasingly difficult and requires specific design measures, such as reduction of the thickness of the gate insulation layer, increased doping concentrations in the channel regions and the like. These countermeasures may reduce the charge carrier mobility in the channel region. Accordingly, to further increase transistor performance, it has been proposed to increase the charge carrier mobility in the channel region for a given channel length.
In principle, at least two mechanisms may be used, in combination or separately, to increase the mobility of the charge carriers in the channel region. First, the dopant concentration within the channel region may be reduced, thereby reducing scattering events for the charge carriers and thus increasing the conductivity. However, reducing the dopant concentration in the channel region significantly affects the threshold voltage of the transistor device and may affect the channel controllability as previously explained, thereby making a reduction of the dopant concentration a less attractive approach unless other mechanisms are developed to adjust a desired threshold voltage. Second, the lattice structure in the channel region may be modified, for instance by creating tensile or compressive strain therein, which results in a modified mobility for electrons and holes, respectively. For example, creating tensile strain in the channel region may increase the mobility of electrons, which, in turn, may directly translate into a corresponding increase in the conductivity for N-type transistors. On the other hand, compressive strain in the channel region may increase the mobility of holes, thereby providing the potential for enhancing the performance of P-type transistors.
Therefore, a technique is frequently used that enables the creation of desired stress conditions within the channel region of different transistor elements by individually modifying the stress characteristics of a contact etch stop layer that is formed after completion of the basic transistor structure in order to form contact openings to the gate and drain and source terminals in an interlayer dielectric material. The effective control of mechanical stress in the channel region, i.e., effective stress engineering, may be accomplished by individually adjusting the internal stress in the contact etch stop layer in order to position a contact etch contact layer having an internal compressive stress above a P-channel transistor while positioning a contact etch stop layer having an internal tensile strain above an N-channel transistor, thereby creating compressive and tensile strain, respectively in the respective channel regions.
Moreover, other enhanced junction engineering techniques may be used in advanced SOI transistors for enhancing the performance thereof by creating more abrupt junctions for reducing the junction capacitance, which may translate into increased switching speed. To this end, a so-called pre-amorphization step may be performed prior to the drain/source implantation in order to more precisely define the dopant concentration. The substantially amorphous silicon in the drain and source regions requires, however, a re-crystallization anneal, which results in dislocation defects in the body region of the SOI transistor and in the drain and source regions. In SOI architectures, the further reduced junction capacitance in combination with the per se unwanted dislocation defects may result in a significant performance gain, since the increased junction leakage caused by the dislocation defects may reduce floating body effects while the reduced junction capacitance contributes to increased switching speed. Thus, this enhanced junction engineering may be combined with the stress layer approach in an attempt to further increase device performance. Although this technique is highly efficient in individually enhancing the performance of individual transistors, an increased failure probability and/or production yield may be observed in complex circuits comprising logic circuits and high density memory areas, such as static RAM (random access memory) cells, thereby rendering the above technique less desirable for the formation of highly advanced integrated circuits.
The present invention is directed to various methods and systems that may solve, or at least reduce, some or all of the aforementioned problems.

Semiconductor device having stressed etch stop layers of different intrinsic stress in combination with PN junctions of different design in different device regions


An apparatus for grating or shredding cheese or like foodstuff, or for storing it in a ready-to-grate or -shred condition. A container is provided within which cheese, or like foodstuff, is mounted or stored on a spring-loaded plate, being captured at the container open end with a grating cap having raised blades on its internal surface in contact with the cheese or like foodstuff, which grate or shred the foodstuff when the grating cap is rotated versus the container, and having holes and perforations through its thickness from which the grated foodstuff exits. The cross section of the container cavity is non-circular and is defined by a multiplicity of contiguous container internal sidewalls, at least one of which is planar. The cross sections of the mounting plate and cheese, or like foodstuff, conform to the container cavity cross section, immobilizing the cheese, or like foodstuff, rotationally with respect to the container. The cheese, or like foodstuff, is grated or shredded when the grating cap is rotated relative to the container with sufficient force so as to overcome the foodstuff's shearing resistance. A sealing cap is provided optionally to seal-in the freshness of the cheese, or like foodstuff, when stored in the apparatus of the present invention.

Pre-grated or pre-shredded cheese is used as an essential ingredient in food preparation or added to cooked food as a complement to enhance taste. Cheese may be typically procured from the supermarket in block or grated form. The grated form of cheese, while convenient to use, contains chemicals and cellulose additives for increased shelf life and prevention of caking. Cheese shelf life and freshness diminish over time from exposure to ambient air and moisture. It is desirable to freshly grate cheese from a cheese block, which, because of its much smaller exposed surface area per unit volume of cheese compared to grated or shredded cheese in particulate form, retains its freshness for a much longer time.
Previous designs of cheese grating or shredding units for wide usage suffer from various limitations. They are typically expensive to make, require cheese in custom forms not readily available, hold small quantities of cheese, are inconvenient to use, and lack provisions for storing bulk cheese with extended shelf life for marketing of cheese packaged integrally with the grating or shredding units.
As examples, certain previous designs of grating or shredding units require the cheese to possess certain physical features, such as being split into two half-cylinders, as in U.S. Pat. No. 3,642,045, dated Feb. 15, 1972 issued to J. Buvelot, or having a hollow core at its center, as in U.S. Pat. No. 5,071,663, dated Dec. 10, 1991 issued to E. Dugan. These units generally require the block cheese to be of cylindrical geometry, which is modified to suit the grater being used. These designs are largely incompatible with the large amount of block cheese marketed by leading cheese manufacturers in the shape of rectangular parallelepipeds.
Some of the designs also require physical penetration of the cheese blocks by mechanical structures that restrain the cheese as it is grated. The force required to overcome the resistance of the cheese to being grated, when placed in contact with the grating screen and moved with respect to it, is overcome by applied forces that cause the cheese and the grating screen to move with respect to each other. These forces are typically applied manually, as in the above patents, or may be applied using an electric motor as in U.S. Pat. No. 5,364,037, dated November 15 issued to G. Bigelow. The cheese penetrating structures help transmit the externally applied forces to the cheese. These structures, however, cause wastage, since the cheese trapped in between the penetrating structures is not available to the grating screen. There is also a safety issue. The user may apply excessive force in grating the last remaining morsel of cheese and cause chipping of the penetrating elements leading to contamination of the food.
Further, as in the Buvelot patent, several of the previous cheese, or like foodstuff, grater designs require that when the cheese is grated, pressure be applied manually against the cheese to keep it in contact with the grating screen as the operator turns it relative to the cheese, causing the latter to grate. The manually applied pressure is inconvenient, variable, and non-uniform across the cheese block. This causes uneven grating and production of non-uniformly sized grated cheese particles, diminishing the aesthetics and causing variability in the flavoring of the food when cheese grating is performed directly over a food dish. Where a spring has been added to achieve application of uniform pressure on the cheese block, as in the Dugan patent, cheese rotation versus a grating screen has been achieved with an external handle mechanism increasing the complexity and cost of the unit.

Apparatus for grating cheese and the like


A support system for a flexible closure such as a shower curtain comprising a rod with a channel running lengthwise and a plurality of carrier assemblies freely movable within the channel. The carrier assemblies each further comprise a roller assembly and a button assembly, the roller assembly having two wheels joined together by an axle and rolling on rails formed in the rod's channel, and the button assembly having a button and a stop joined by an axle. The roller assembly and button assembly each fit into a different hole in the carrier assembly, the holes both having a large portion and an adjacent smaller portion connected by a tapered passage that forms a keylock to allow the assemblies to be securely seated in the smaller portions.

1. Field of the Invention:
The present invention relates to carriers for supporting flexible closures such as shower curtains and draperies from rods.
2. Discussion of Background:
A flexible closure such as a shower curtain or draperies typically is supported from an overhead horizontal support bar or tube attached to the walls by suspension hooks or rings that loosely encircle the bar passing through holes in the upper margin of the curtain. With use, there is a tendency for the shower curtain to separate from suspension hooks. Furthermore, periodically the shower curtain needs to be cleaned, so the hooks or rings must be disconnected from the curtain before laundering.
There are numerous systems for supporting flexible closures. See for example, U.S. Pat. No. 4,217,676 issued to Terrones, U.S. Pat. No. 3,861,001 issued to Pape, U.S. Pat. No. 3,175,243 issued to Weber, and U.S. Pat. No. 1,227,020 issued to Thompson. More recently, I disclose a flexible closure carrier in U.S. Pat. No. 4,729,148 issued in March 1988.
The characteristics of a good flexible closure support system are that it be easily manufactured, easily assembled, easily installed, and certain in its hold on the supported closure. Additionally, the support system should allow the easy removal of the flexible closure for cleaning and should also have a decorative appearance.
A flexible closure support system having many of these characteristics is described by this applicant in my copending application for patent, Ser. No. 588,365, filed Sep. 26, 1990, now U.S. Pat. No. 5,189,758. The system disclosed therein comprises a rod with a channel running lengthwise therein and a carrier assembly that includes a button assembly to which the curtain is fastened. The carrier has a hook on each end, one for receiving and locking a roller assembly, that fits into the channel of the rod, and one for receiving and locking the button assembly. However, this support system can still result in the curtain being pulled loose if the curtain is pulled hard enough. Finally, although a shower curtain is not designed or intended to be a safety device for someone who is slipping or falling in a shower stall, people will instinctively reach out and grab for whatever is within reach. It is therefore better for a shower curtain to be more securely fastened than less.


The objective of this invention is to provide an oily external composition for skin having an excellent rough skin recovering/preventing effect, and wherein powder is well dispersed in oil. An oily external composition for skin of this invention is characterized in that comprising a complex powder (the surface of lipophilic base powder is covered with zinc oxide) and an oil component, wherein said complex powder is dispersed in said oil component, and wherein zeta-potential of said lipophilic base powder is negative value at pH on skin. It is preferable that zeta-potential of said lipophilic base powder is −10 mV or less at pH on skin. It is preferable that said lipophilic base powder is swelled in the condition of dispersing in oil. Above-mentioned external composition can be used as a rough skin recovering composition and a sensitive skin caring composition.

1. Field of the Invention
The present invention relates to an oily external composition for skin, and in particular, the oily external composition for skin containing zinc oxide complex powder.
2. Prior Art
Conventionally, for protecting skin from ultraviolet rays, some powders such as zinc oxide and titanium dioxide are added in oily external composition for skin. It is difficult to disperse these inorganic powders in oil base, because the surface of said powders generally has hydrophilic property. Concerning emulsion cosmetics (a surfactant is added to oil phase containing powder, and water phase is added to therein and emulsified), sometimes aggregation occurs due to interaction among powder, surfactant and water. As a result, the composition lacks its stability and the functions of powder itself are not shown fully.
For the purpose of improving dispersibility of powder, many kinds of cosmetic compositions are developed; such as cosmetics comprising lipophilic powder whose surface is hydrophobicized [for example complex powder that zinc oxide is covered with magnesium aluminate metasilicate (Japanese Patent Publication Hei 1-308819), cosmetics comprising complex powder that zinc oxide is covered with fluorine modified silicone (Japanese Patent Publication Hei 7-277914)] and cosmetics that powder is disperses in oil dispersion medium with particular dispersant (Japanese Patent Publication Hei 9-208438).
In the above cosmetics, although dispersibility of powder in oil is improved to some extent, it is not enough. And it is difficult to exhibit function that zinc oxide itself originally owns, because its surface is covered fully.

This patent is subject to a terminal disclaimer.


A display lifting device which is mounted within a ceiling plenum and is arranged for concealing a support framework, lifting arm and display within the ceiling area. A support arm for the display is pivotally mounted within the framework and is biased in the downward position and supported by a cable mounted on a cable drum drivingly connected to a reversible motor. The support arm comprises at least two telescoping sections with the cable connected to the end of the inner lower most section so that as the cable is extended the arm pivots downward with the telescoping sections extending through gravity to their fullest extent. In this way, the display can extend a considerable distance from the ceiling for viewing by the audience while in the retracted position a very small opening and space within the plenum is required for concealment. Mechanical stops and limit switches are provided at both extremes of the movement of the display and support arm to restrict the angular movement of the arm. A cover matching the opening in the ceiling is attached to the support arm and is pivoted from the ceiling to close the ceiling opening when the arm is raised into the upper concealed position. Actuation of the display lifting device can be made with a wired control panel or a remote control device.

This invention is directed to a concealed ceiling mount for a large screen display. It is more specifically directed to a pivotal mount for storing within a ceiling a large screen display which can be pivotally and telescopically extended to an exposed position for use.
In the design and construction of auditoriums or theaters, it is very desirable to conceal the components of the audio/visual equipment that is to be used in those locations. One of the ways of doing this is to position the equipment in the ceiling or sidewalls with a panel covering the equipment to prevent it from being seen. Upon use, the panel is then either removed or moved aside so that the equipment can perform its function.
In other situations, the equipment has been concealed within the ceiling and provides the capability of lowering the equipment from the ceiling to a use position, whereby a video projector or film projector can be used to show videos or motion pictures on an auxiliary screen positioned at the front portion of the auditorium or theater. Some of these systems include a cable lift or a telescoping column that allows the equipment to be lowered from the concealed position within the ceiling structure.
In recent years, video screens and computer monitors have been redesigned in a relatively flat configuration with large size dimensions. Some of these screens utilize fibre optics to provide the displayed picture, while others use projection of a video image through mirrors and lenses to provide a large scale image. In recent years plasma screen technology has been developed which can provide a flat screen televison display of large proportions. These screens can be as big as 3xe2x80x2xc3x976xe2x80x2 or larger, depending upon the application that is intended. It has been found highly desirable to conceal this screen out of sight when it is not being used. At the time that it is needed, it can be exposed or moved into position for use.
The present inventor is a pioneer in the effort to solve these problems by concealing the display unit in a ceiling or wall when it is not being used. As part of that effort, the inventor has devised lift structures, which can be attached in the ceiling area and which can allow a video or movie projector to be remotely raised or lowered from the ceiling surface by a cable lift. In addition, the projector can be lowered to a position which is easily accessible from the floor of the area for maintenance or replacement purposes.
One of the major problems with concealing a mechanism of this type in a ceiling area is the fact that there is usually a very small dimensional clearance available in the plenum area between the ceiling of the auditorium, theater or presentation room and the above floor or roof structure. In many cases, this clearance is no more than 15xe2x80x3-18xe2x80x3 and, in many cases, this limited clearance prevents any type of lifting mechanism from being mounted or concealed within the ceiling area. The present patent application is directed to a new invention to eliminate the problems which have been encountered in the past with this type of mechanism and to provide a unique high strength, lifting mechanism which is compatible with a flat screen type of display panel.
This statement is provided in order to comply with the inventor""s acknowledged duty to inform the Patent and Trademark Office of any pertinent information of which he is aware that would be of any value or have importance in the Examination of this application. The following patents are known to the applicant and may have some applicability to the present invention and the examination of this application.
The Huffman patents (U.S. Pat. Nos. 5,261,645 and 5,366,203) disclose a remote control, ceiling mounted lifting device which is provided for concealing, supporting and allowing convenient access to audio/visual equipment, such as video/data projectors. The lifting device has an outer mounting framework. A support carriage is arranged within the framework and is suspended by cables and its lateral movement is restricted by a scissor-like stabilizer mechanism. The cables are mounted on a motor driven drum assembly which is laterally positioned within the support framework. An emergency lever brake assembly is provided in conjunction with the cable drum to prevent the carriage from dropping out of control in an emergency situation.
The present invention provides a lifting mechanism for supporting and moving relatively large flat panel displays. It is primarily intended for concealment of the display within the ceiling area when not in use. Since there is a relatively low structural clearance in the plenum area above the ceiling surface found in most auditoriums, theaters or presentation rooms, the present mechanism has an extremely flat profile which allows it to be installed within the ceiling structure for the purpose of this concealment.
The lifting mechanism, according to the present invention, uses a number of new and novel elements to provide a lifting device having long extensions for relatively large flat objects. Although the object in the present invention is intended to be a type of display such as, a flat screen T.V. or monitor, it can also cover a number of other objects, such as a projection screen for movies or for a video/data projector. In some cases, the video projector utilizing the concealed flat screen can also be supported in the ceiling structure or in a side wall.
The present invention incorporates a relatively compact flat framework mounted within the ceiling cavity with a pivotally extended support arm having a flat screen T.V. mounted at the end of the arm. In the raised or upper position the screen and arm is positioned within the ceiling cavity. A ceiling cap or cover which matches the required ceiling opening is mounted on the underside of the arm and can be aligned to be flush with the existing ceiling surface when the lift is in the raised position. To lower the arm and the attached screen to the lower view position, a wired control switch or a suitable type of remote control device using infrared or UHF can be utilized. Upon command, the arm is pivoted downward to a substantially perpendicular viewing position. As part of the present invention the actual angular position of the screen can be adjusted minutely to position the screen in the correct and proper angular position for viewing by the audience. Thus, the arm can move either less or greater than the 90xc2x0 vertical position to obtain the desired angular position.
The support arm is pivotally mounted on a shallow, rigid framework which is adequately positioned and mounted within the ceiling cavity or plenum. The pivotal support arm is biased by a suitable device, such as a helical spring attached to the supporting shaft or one or more coiled springs attached to an extension of the arm which can be leveraged beyond the pivot mounting of the arm. This force biases the arm and display in the downward direction and position. A cable wound on a laterally positioned cable drum assembly mounted within the framework has its free end threaded over a pulley and down through the support arm. The end of the cable is secured to the end of the arm. A reversible drive motor properly geared or drivingly connected to the cable drum assembly is provided for extending or retracting the cable as required.
A suitable safety lock can be provided in conjunction with the drum or cable to arrest the rapid downward movement of the cable and arm in an emergency situation. The cable lock can be a lever type lock mounted in conjunction with the cable drum. The lock can be controlled by an over-speed governor attached to the drum to sense the rotational velocity of the drum. At an exceedingly high rate of rotational speed the drum lock can be activated to arrest and stop the rotation of the drum and, thus, the cable and arm. By the same token, a cable brake, such as an automatic clamp can be positioned adjacent to or surrounding the cable so that the cable itself can be clamped and stopped if its velocity exceeds a predetermined rate. It is to be understood that any type of suitable brake which will arrest the downward movement of the arm in an emergency situation can be used.
It is intended that stops will be placed in proper position to restrict the overall movement of the support arm in the up or down position. The up position stop limits the movement of the arm in the retracted ceiling concealed position. The stop for the lowered position restricts the pivotal movement of the arm past a limited arc beyond vertical to control the overall movement of the support arm.
In order to make the lift device as compact as possible, the support arm is arranged in a telescoping configuration wherein the arm is made up of two or more telescoping sections or channels which have an essentially hollow rectangular cross-section. The lower or inner sections of the arm can slidably fit within the dimensions of the upper or base section of the arm. Although the sections of the arm can be mechanically biased into the extended position, it has been found that gravity is suitable for this purpose, with the end of the support cable secured within the inner portion of the end section. Thus, the arm can be lowered by releasing and extending the cable which is guided across a pulley mounted on the side of the arm and down into the interior of the end section. In this way, the lower end section is held in the contracted position within the upper section until the support arm is fully extended with further extension of the cable allowing the end section or sections to lower into a downward extended position with the screen or display object. In the reverse, the cable, upon retracting, first raises the lower or end section of the arm and the attached display into a contracted position within the upper section and then further pivots the arm upward into the concealed raised position within the ceiling. In this way, a relatively long yet compact, heavy duty lifting device is provided for storing and concealing the entire lifting mechanism and display within the ceiling cavity. A ceiling cover can be pivotally mounted from the ceiling and arranged to move with the downward movement of the pivoting support arm or it can be mounted directly on the arm, whereby the entire cover moves with the arm. The attachment for supporting the cover is arranged to move with the arm extension. As can be seen in the present invention, the length of the support arm and the positioning of the screen can be greatly extended to compensate for the height of the ceiling in the auditorium, theater or presentation room and the positioning of the audience within the room.
One of the objects of the present invention is to provide a heavy duty lifting device that can extend a flat screen television or monitor, or the like, from a concealed position within the ceiling of a structure to a lower viewable position which is properly positioned and aligned with respect to the audience.
It is a further object of this invention to provide a lifting device for a flat screen T.V. wherein the position of the screen can be angularly adjusted.
It is a still further object of the present invention to provide a display lift whereby the display can be extended to a position close to the level of the audience and then retracted to a compact configuration before being concealed within the structure.
Other objects and features of this invention will be seen and explained through the following drawings and descriptions.


Reduced mounting inductance and/or an increased self-resonant frequency range of operation for capacitor circuits of a circuit board is described. The circuit board has a mounting pad for coupling a capacitor to at least three vias arranged in a pattern and coupled to the mounting pad at least three discrete locations to reduce mounting pad inductance. Alternatively or additionally, top and bottom mounted capacitors to the circuit board have a physically and electrically common through via to provide a self-resonant frequency range of operation.

Programmable logic devices ("PLDs") are a well-known type of integrated circuit that can be programmed to perform specified logic functions. One type of PLD, the field programmable gate array ("FPGA"), typically includes an array of programmable tiles. These programmable tiles can include, for example, input/output blocks ("IOBs"), configurable logic blocks ("CLBs"), dedicated random access memory blocks ("BRAMs"), multipliers, digital signal processing blocks ("DSPs"), processors, clock managers, delay lock loops ("DLLs"), and so forth. Notably, as used herein, "include" and "including" mean including without limitation.
One such FPGA is the Xilinx Virtex® FPGA available from Xilinx, Inc., 2100 Logic Drive, San Jose, Calif. 95124. Another type of PLD is the Complex Programmable Logic Device ("CPLD"). A CPLD includes two or more "function blocks" connected together and to input/output ("I/O") resources by an interconnect switch matrix. Each function block of the CPLD includes a two-level AND/OR structure similar to those used in Programmable Logic Arrays ("PLAs") and Programmable Array Logic ("PAL") devices. Other PLDs are programmed by applying a processing layer, such as a metal layer, that programmably interconnects the various elements on the device. These PLDs are known as mask programmable devices. PLDs can also be implemented in other ways, for example, using fuse or antifuse technology. The terms "PLD" and "programmable logic device" include but are not limited to these exemplary devices, as well as encompassing devices that are only partially programmable.
For purposes of clarity, FPGAs are described below though other types of PLDs may be used. FPGAs may include one or more embedded microprocessors. For example, a microprocessor may be located in an area reserved for it, generally referred to as a "processor block."
Heretofore, decoupling capacitors for high-frequency applications were coupled to a circuit board using single vias for each terminal. Furthermore, such decoupling capacitors, though in some instances have been mounted on both top and bottom sides of a circuit board such as a printed circuit board ("PCB"), were heretofore not physically and electrically coupled to one another by a common via. However, mounting inductance associated with coupling, for example, a two terminal discrete capacitor to a PCB may be a significant limitation on performance or may involve using more costly capacitors to obtain a target performance, or a combination thereof.
Accordingly, it would be desirable and useful to reduce mounting inductance associated with decoupling capacitors. Furthermore, it would be additionally desirable and useful to enhance self-resonance associated with such decoupling capacitors.

Reduced mounting inductance and increased self-resonant frequency range


An FET outputs a signal including a component of angular frequency ωo of input signal and harmonic components, a first two-terminal reactance circuit interconnects an output terminal and a ground terminal of the FET, a fundamental matching circuit is connected to an output terminal end of the FET, a second two-terminal reactance circuit is connected between an input terminal of the matching circuit and the output terminal, the FET has a parallel circuit of an output resistor and an output capacitor, the first two-terminal reactance circuit is open for a dc, shorted for angular frequencies 2ωo, 4ωo, . . . , 2nωo, and parallel resonant with the output capacitor for angular frequencies 3ωo, 5ωo, . . . , (2n+1)ωo, and the second two-terminal reactance circuit is shorted for a dc, and open for angular frequencies 3ωo, 5ωo, . . . , (2n+1)ωo.

1. Field of the Invention
The present invention relates to a class-F amplifier, and particularly, to a class-F amplifier of a high-frequency semiconductor device of class-F operation allowing the impedance, as it is seen from an amplifying element with a load inclusive, to be matched for a fundamental wave, shorted for even harmonics, and open for odd harmonics.
2. Description of the Related Art
Recent years have observed high-frequency operable transistors in practical use, such as HEMT (High Electron Mobility Transistor), HBT (Hetero-junction Bipolar Transistor), etc. Those devices implement operation frequencies within a band of 50 to 60 GHz.
Some of them make positive use of harmonics to allow for an enhanced gain, where desirable for enhanced power efficiency is controlled power consumption by harmonics.
For such a purpose so-called class-F amplifiers are used. For class-F amplifiers, the principle is to have a combination of instantaneous voltage waveform and instantaneous current waveform kept anytime from overlapping each other.
It therefore is necessary for a transistor to have an impedance seen from an output terminal thereof with the load side inclusive to be shorted for even harmonics, and open for odd harmonics. The transistor is thereby allowed for the current through the output terminal to have frequency components consisting simply of a fundamental and even harmonics, and for the voltage thereacross to have frequency components consisting simply of odd harmonics, with a nullified power loss due to harmonics. If the phase of a current in the fundamental is quite opposite to the voltage, dc power may be converted into microwave power with a 100% efficiency.
There has been disclosed in patent document 1 below, as well as patent document 2 below, a class-F amplifier in which the impedance seen from an amplifying element with a load inclusive is not simply matched for a fundamental wave, but also shorted for even harmonics and rendered open for odd harmonics, for the high frequency power amplifier to be enhanced in efficiency.
However, assuming the amplifying element to be an FET (Field Effect Transistor) of an internally matched FET model that has a dc bias Vdd supplied to the drain from an RF output terminal of an enclosure, for example, if it has built in a harmonic processor composed of a distributed constant circuit, as disclosed in patent document 1, then the distributed constant circuit might have an increased area, with a resultant increase in area of the enclosure.
On the other hand, as disclosed in patent document 2, one may employ a downsized harmonic processor composed of a lumped constant circuit to be open for a dc, and set in such a system that has a direct dc bias supplied to the drain of an FET via a choke coil separated from the harmonic processor, and is inapplicable to a high power internally matched FET having a dc bias supplied from an RF output terminal.
Both cases have an impedance seen from the drain of an FET, with a load inclusive, set open for odd harmonics, and would work for a class-F operation at frequencies where the output capacity of FET is negligible, but would not at high frequencies where the output capacity of FET is unnegligible.
Patent document 1:                Japanese Patent Application Laying-Open Publication No. 2001-111362
Patent document 2:                Japanese Patent Application Laying-Open Publication No. 2005-117200


An apparatus incorporating small-feature size and large-feature-size components. The apparatus comprise a strap including a substrate with an integrated circuit contained therein. The integrated circuit coupling to a first conductor disposed on the substrate. The first conductor is made of a thermosetting or a thermoplastic material including conductive fillers. A large-scale component having a second conductor is electrically coupled to the first conductor to electrically couple the large-scale component to the integrated circuit. The large-scale component includes a second substrate.

1. Field of the Invention
The field of the invention generally relates to apparatuses having both large-feature-size components and small-feature-size components, and methods of making such apparatuses. The invention more particularly relates to combination of VLSI integrated circuits and macro-scale components to form a single device.
2. Description of the Related Art
VLSI provides many effective methods for creation of microscopic-scale and smaller components. Such miniaturization provides many advantages in terms of speed of operation, size of footprint, amount of necessary resources, and speed of manufacture for electronic devices.
Unfortunately, some components of electronic devices are not well-suited to formation through well-known VLSI processes. These components often are necessarily very large (macroscopic-scale) relative to devices or components of devices formed through VLSI. One such component is an antenna, which may need to have a characteristic length to allow for adequate transmission on a preferred frequency, and for which the characteristic length in question may be appropriately measured in centimeters or meters, for example. Formation of a conductor for use as an antenna using VLSI tends to waste time and material resources, as a 30 cm conductor (for example) can easily be formed through less expensive processes.
Thus, the problem then becomes a matter of combining a large-scale component such as an antenna with a small-scale component such as an integrated circuit. For a conventional radio, this may involve use of packaging for the integrated circuit, conductors on a printed circuit board, a connector attached to the printed circuit board, and an antenna attached to the connector. This approach is simple enough for a device having rigid packaging and flexible size constraints. However, other applications may have more demanding requirements for size and materials cost.
In particular, it may be useful to have a small radio-transmitter with flexible materials allowing for bending and other abusive actions without degradation in functionality. Similarly, such a small radio-transmitter may need to be producible rapidly in quantities of millions or billions, thus requiring ease of assembly and relatively inexpensive materials on a per-unit basis. Using a printed-circuit board approach for such a radio-transmitter will likely not succeed. Moreover, avoiding such time (and/or space) consuming processing operations as thermal cure may be advantageous.
It is possible to separately produce elements, such as integrated circuits and then place them where desired on a different and perhaps larger substrate. Prior techniques can be generally divided into two types: deterministic methods or random methods. Deterministic methods, such as pick and place, use a human or robot arm to pick each element and place it into its corresponding location in a different substrate. Pick and place methods place devices generally one at a time, and are generally not applicable to very small or numerous elements such as those needed for large arrays, such as an active matrix liquid crystal display. Random placement techniques are more effective and result in high yields if the elements to be placed have the right shape. U.S. Pat. Nos. 5,545,291 and 5,904,545 describe methods that use random placement. In this method, microstructures are assembled onto a different substrate through fluid transport. This is sometimes referred to as fluidic self assembly (FSA). Using this technique, various integrated circuits, each containing a functional component, may be fabricated on one substrate and then separated from that substrate and assembled onto a separate substrate through the fluidic self assembly process. The process involves combining the integrated circuits with a fluid, and dispensing the fluid and integrated circuits over the surface of a receiving substrate that has receptor regions or openings. The integrated circuits flow in the fluid over the surface and randomly align into receptor regions, thereby becoming embedded in the substrate.
Once the integrated circuits have been deposited into the receptor regions, the remainder of the device can be assembled. Typically, this involves coating the substrate with a planarization layer to provide electrical insulation and physical retention for the integrated circuits. The planarization layer creates a level surface on top of the substrate by filling in the portions of the receptor regions that are not filled by integrated circuits. After the planarization layer has been deposited, other elements, including pixel electrodes and traces for example, may be installed.
Using FSA, the functional components of the device can be manufactured and tested separately from the rest of the device.

Apparatus incorporating small-feature-size and large-feature-size components and method for making same


An arrangement for bleeding or flushing a hydraulic system includes a portable pump and a hydraulic fluid packet. The hydraulic fluid packet comprises a flexible receptacle which contains a body of hydraulic fluid. A spout is located at one end of the receptacle and an opening is provided at the opposite end of the receptacle. The spout can be connected to the pump and the opening allows the receptacle to be suspended with the spout facing down. As hydraulic fluid is withdrawn from the receptacle, the receptacle collapses around the remaining hydraulic fluid to inhibit the formation of air pockets in the receptacle.

1. Field of the Invention
The invention relates to the removal of contaminants from a hydraulic system.
2. Description of the Prior Art
The braking system of a motor vehicle is generally bled by opening the bleed valve for each brake individually and pumping the brakes. This procedure not only requires two people but is also very time-consuming.
These drawbacks are overcome by U.S. Pat. No. 4,038,823 in which a reciprocating pump is used to pump brake fluid into the servo cylinders of the braking system. Bleeding of a brake is complete when clear brake fluid enters the reservoir of the master cylinder. In order for the person bleeding the brakes to ascertain that clear brake fluid is entering the reservoir, a long feed line must be provided from the pump to the brake being bled. This is cumbersome.
U.S. Pat. No. 4,741,417 employs a motor-driven rotary pump for bleeding a braking system. The pump inlet is immersed in the reservoir of the master cylinder while the pump outlet is connected to a manifold. Flexible hoses lead from the manifold to the bleed valves of the respective servo cylinders. In operation, brake fluid is pumped from the reservoir to the servo cylinders via the manifold and the flexible hoses. The brake fluid returns to the reservoir through the brake lines of the braking system. This arrangement is complicated and, in addition, requires considerable time to set up.
U.S. Pat. No. 4,785,629 eliminates these problems by injecting brake fluid into the servo cylinders via a syringe. However, the syringe is associated with its own difficulties. To begin with, two hands are required to operate the syringe. Furthermore, the syringe cannot be very large since otherwise the force necessary to operate the syringe becomes excessive. Due to the limited size of the syringe, the syringe must be refilled frequently thereby increasing the time to bleed the braking system. In addition, the refilling operation requires disconnection of the syringe from the brake system and the attendant risk of introducing air upon reconnection. Moreover, following the injection of brake fluid with the syringe, the master cylinder must be observed to insure that all air bubbles are dissipated. Finally, as a practical matter people tend to impart too much force to the syringe at the beginning of each bleeding operation and cause rapid flow and upward splashing and/or spilling of fluid from the master cylinder.
Prior application Ser. No. 08/441,187 discloses a portable pump or fluid conveying device which is simpler and quicker than the syringe. Although the pump works well, it was found that certain improvements would be beneficial. For instance, the prior application fails to teach a convenient manner of priming the pump. Moreover, while the prior application discloses pressure bleeding, there are situations where vacuum bleeding, either alone or in combination with pressure bleeding, yields best results. Accordingly, it would be of advantage if the pump could be easily switched back-and-forth. Furthermore, although the prior application shows the pump connected to the servo cylinder of a brake system, pressure bleeding through a master cylinder reservoir is recommended under certain circumstances. However, since different reservoirs have openings of different size, it is not possible to employ the pump for a variety of reservoirs.
Prior application Ser. No. 08/738,776 teaches a kit which permits convenient priming of the pump, simple switching of the pump between pressure bleeding and vacuum bleeding, and easy adaptation of the pump to openings of various sizes. While the kit is satisfactory, a problem exists with the kit as well as with other arrangements for bleeding or flushing hydraulic systems. This is the lack of any provision for protecting hydraulic fluid from air when hydraulic fluid is delivered to a hydraulic system. Thus, hydraulic fluid tends to deteriorate when it comes into contact with air.

Hydraulic fluid packet and kit containing the same