An apparatus may include an antenna and a transceiver coupled to the antenna, the transceiver including a receiver operative to receive a radio-frequency (RF) signal and a transmitter operative to transmit a RF signal. The apparatus may also include an RF echo cancellation module coupled to the receiver and the transmitter, the RF echo cancellation module operative to generate an analog echo cancellation signal for the received RF signal based on a delayed version of the transmit RF signal. Other embodiments are disclosed and claimed.

Modern wireless communications systems typically employ separate time and/or frequency resources for downlinks (DL) and uplinks (UL). For example, in frequency division modulation (FDM), downlinks employ radio-frequency (RF) carriers over frequency range(s) that are different from the frequency ranges of RF carriers used for the uplinks. In time division multiplexing, such as time division duplexing (TDD), the DL and UL employ different time resources, such that uplink communications take place at different time slots or frames than downlink communications. Because of the practice of employing TDD or FDM in wireless communications, the full time/frequency capacity for conduction of wireless communications has not yet been exploited.
In order to exploit the ability to conduct simultaneous transmission (Tx) and reception (Rx) (STR) over the same frequency and time range, it may be desirable to improve present day apparatus and procedures for conducting duplex communications. For example, when Tx and Rx signals use the same RF carrier and time slot, a high power Tx signal typically leaks to the receive chain through a duplexer as an echo. The term "echo" is used to refer to an undesired feed-through of a transmitted data signal into a receiver.
In many circumstances, this high power echo may create a severe interference to what may be a very weak signal, such as a signal received from a cell edge of a radio access network. Due to impedance mismatching at an antenna and cable, echoes can appear at the receive chain. In addition, a transmitted signal can be reflected in the air and may return to a system as multiple echoes that can interfere with the weak desired receive signal. As an example, a Tx signal may be transmitted at 46 dBm. A typical duplexer may exhibit 20˜40 dB leakage. Accordingly, even assuming 40 dB leakage at the duplexer, a 6 dBm echo can result to contaminate the desired (weak) receive signal. Without cancelling such STR interference caused by echoes, the intended received signal may not be decoded because the signal strength of the echo swamps the intended received signal.
It is with respect to these and other considerations that the present improvements have been needed.

Techniques to simultaneously transmit and receive over the same radiofrequency carrier


A family of crystalline aluminosilicate zeolites designated UZM-8HS and derived from UZM-8 have been synthesized. The aluminum content of the UZM-8HS is lower than that of the starting UZM-8 thus changing its ion exchange capacity and acidity. These UZM-8HS are represented by the empirical formula:M1an+Al(1−x)ExSiy′Oz″and are prepared by treatments such as acid extraction and AFS treatments.

Zeolites are crystalline aluminosilicate compositions which are microporous and which are formed from corner sharing AlO2 and SiO2 tetrahedra. Numerous zeolites, both naturally occurring and synthetically prepared are used in various industrial processes. Zeolites are characterized by having pore openings of uniform dimensions, having a significant ion exchange capacity, and being capable of reversibly desorbing an adsorbed phase which is dispersed throughout the internal voids of the crystal without significantly displacing any atoms which make up the permanent zeolite crystal structure.
The number of synthetic zeolites is well over a hundred as evidenced by the Atlas of Zeolite Framework Types published by the Structure Commission of the International Zeolite Association (IZA). As is well known, zeolites are distinguished from each other on the basis of their composition, crystal structure, catalytic and adsorption properties. One method commonly used in the art to distinguish zeolites is x-ray diffraction.
In U.S. Pat. No. 6,756,030 B1, a new family of materials designated UZM-8 is disclosed. The UZM-8 materials are zeolitic aluminosilicates ranging in Si/Al ratio from 6.5 to 35. They are prepared from reaction mixtures employing organoammonium structure directing agents with preferred examples being diethyldimethylammonium (DEDMA), ethyltrimethylammonium (ETMA), and hexamethonium (HM) cations and optionally alkali or alkaline earth metals and/or other organoammonium cations. The UZM-8 materials have a unique x-ray diffraction pattern and a composition on an as synthesized and anhydrous basis expressed by an empirical formula of:Mmn+Rrp+Al1−xExSiyOz where M is at least one exchangeable cation selected from the group consisting of alkali and alkaline earth metals, "m" is the mole ratio of M to (Al+E) and varies from 0 to about 2.0, R is at least one organoammonium cation selected from the group consisting of quaternary ammonium cations, diquaternary ammonium, protonated amines, protonated diamines, protonated alkanolamines and quaternized alkanolammonium, "r" is the mole ratio of R to (Al+E) and has a value of about 0.05 to about 5.0, "n" is the weighted average valence of M and has a value of about 1 to about 2, "p" is the weighted average valence of R and has a value of about 1 to about 2, E is an element selected from the group consisting of gallium, iron, boron, chromium, indium and mixtures thereof, "x" is the mole fraction of E and has a value from 0 to about 1.0, "y" is the mole ratio of Si to (Al +E) and varies from about 6.5 to about 35 and "z" is the mole ratio of O to (Al+E) and has a value determined by the equation:z=(m•n+r•p+3+4•y)/2.
Applicants have now modified these UZM-8 materials in order to change some of their properties. By using one or more techniques selected from acid extraction, calcination, steaming and ammonium hexafluorosilicate treatment, applicants have been able to control the aluminum content of the UZM-8 zeolites to nearly all silica while maintaining their structure and porosity. Dealumination strategies are known in the art and are given by Breck (see D. W. Breck, Zeolite Molecular Sieves, Wiley and Sons, New York, (1974), p. 441) and Skeels and Breck (see U.S. Pat. No. 4,610,856). The result is a modified UZM-8 (UZM-8HS) material containing less aluminum than the starting UZM-8 composition. Control of the Al content in the zeolite allows one to tune the properties associated with the Al, such as ion-exchange capacity and acidity thereby providing improved catalysts and/or adsorbents. This new family of materials is designated UZM-8HS.


In one aspect, a programming method is provided for a non-volatile semiconductor memory device which includes a plurality of electrically programmable and erasable memory cells, and transmission transistors for providing predetermined voltages to the memory cells. The method includes a primary programming process which includes providing a first program voltage to a selected memory cell to program the selected memory cell, a verify read process which includes reading the selected memory cell to verify a programmed status of the selected memory cell resulting from the primary programming process, and a secondary programming process which includes providing a second program voltage to the selected memory cell so as to reprogram the selected memory cell after the verify read process. During the verify read process, the transmission transistors are continuously gated by a boosted voltage generated during the primary programming process. The boosted voltage has a voltage level which is sufficient to provide the first and second program voltages to the memory cell.

1. Field of the Invention
The present invention is generally related to non-volatile semiconductor memory devices and to methods of programming non-volatile semiconductor memory device.
A claim of priority is made to Korean Patent Application No. 10-2005-54753, filed Jun. 24, 2005, the subject matter of which is incorporated by reference in its entirety.
2. Description of the Related Art
Generally, in a non-volatile semiconductor memory device (e.g., a NAND flash memory device), data is programmed by altering the threshold voltage of a selected memory cell by applying so-called "pass" and "program" voltages to word lines connected to gates of non-volatile memory cells.
FIG. 1 is a diagram showing a conventional non-volatile semiconductor memory device, and FIG. 2 is a voltage-timing diagram showing a sequence of program loops LOOP <0-2> executed by the device of FIG. 1. Each of the of the program loops LOOP <0-2> includes a programming operation T01, T11 and T21, and verify read operation T02, T12 and T22.
As shown in FIG. 1, the conventional non-volatile semiconductor memory device includes a non-volatile memory cell array 10, row decoder 20, a pre-decoder 30, a high voltage generation unit 50, and a page buffer 60.
The non-volatile memory cell array 10 includes a memory cell string connected between a bit line BL and a common source line CSL. More specifically, the memory cell string includes a select transistor ST, a plurality of non-volatile memory cells MC<1-32>, and a ground transistor GT, all connected in series between the bit line BL and the common source line CSL.
The row decoder 20 includes a boosting circuit 21 and a plurality of transmission transistors TT. One of the transmission transistors TT is connected between a global string select line GSSL and a string select line SSL, and another of the transmission transistors TT is connected between a global ground select line GGSL and a string ground select line SGSL. The remaining transmission transistors TT are respectively connected between global word lines <1-32> and word lines SWL <1-32>. The boosting circuit 21 provides the block gating signal BKWL of FIG. 2 to the gates of the transmission transistors TT in accordance with pass and program voltages VPASS and VPGM, a block address BKADD and a boosting control signal CON11.
The high voltage generation unit 50 generates the pass voltage VPASS and the program voltage VPGM. In addition, although not shown in FIG. 1, the high voltage generation unit 50 generates a read voltage (VREAD, FIG. 2) which is used by the during reading of the non-volatile memory device.
The pre-decoder 30 provides voltages to select one of the global word lines GWL<1:32>, and to activate a global string select line GSSL, and a global ground select line GGSL. As shown in FIG. 2, a selected word line SWL (SELECTED) corresponding to a selected global word line GWL is applied with a program voltage VPGM <1> in response to the block selection signal BKWL, and the non-volatile memory cell connected to the selected word line SWL (SELECTED) is programmed accordingly. The remaining word lines SWL (NON-SELECTED) are applied with the pass voltage VPASS in response to the block selection signal BKWL.
The page buffer 60 senses the voltage of the bit line BL and outputs the voltage to an element external to the memory device, and/or provides the bit line BL with operational voltages received from an external source.
In the conventional non-volatile semiconductor memory device, the voltage level of the block gating signal BKWL is adjusted in accordance with a boosting method. As shown in FIG. 2, throughout a programming process the voltage level of the block gating signal BKWL during a programming operation is greater than the voltage level of the block gating signal BKWL during a preceding programming operation (except for the first programming operation, which has no preceding programming operation). Therefore, the conventional non-volatile semiconductor memory device suffers a drawback in that the voltage level of the block gating signal BKWL is unstable and difficult to control.
Further, in the conventional non-volatile semiconductor memory device, at the starting point of each programming operation 61, 71, and 81, and each verify read operation 62, 72, and 82, the block gating signal BKWL is discharged to a ground voltage VSS. Therefore, the conventional non-volatile semiconductor memory device suffers another drawback in that unnecessary current is consumed and/or a data programming time is increased.

Non-volatile semiconductor memory and programming method


A system and method for distributing a plurality of electronic articles is provided. Articles are received from a plurality of users and stored retrievably in memory. A request is received for the purchase of an article from one of a plurality of users. An electronic funding account associated with the one of a plurality of users is debited, and the article is transmitted to the one of the plurality of users.

The Internet comprises a vast number of computers and computer networks that are interconnected through communication links. The interconnected computers exchange information using various services, such as electronic mail, Gopher, and the World Wide Web ("WWW"). The WWW service allows a server computer system (i.e., a Web server or Web site) to send graphical Web pages of information to a remote client computer system. The remote client computer system can then display the Web pages on a display screen such as a cathode ray tube ("CRT") or the like. Each resource (e.g., computer or Web page) of the WWW is uniquely identifiable by a Uniform Resource Locator ("URL"). To view a specific Web page, a client computer system specifies the URL for that Web page in a request (e.g., a HyperText Transfer Protocol ("HTTP") request). The request is forwarded to the Web server that supports that Web page. When that Web server receives the request, it sends that Web page to the client computer system. When the client computer system receives that Web page, it typically displays the Web page using a browser. A browser is a special-purpose application program that effects the requesting of Web pages and the displaying of Web pages on a display screen.
Currently, Web pages are typically defined using HyperText Markup Language ("HTML"). HIML provides a standard set of tags that define how a Web page is to be displayed. When a user indicates to the browser to display a Web page, the browser sends a request to the server computer system to transfer to the client computer system an HTML document that defines the Web page. When the requested HTML document is received by the client computer system, the browser displays the Web page as defined by the HTML document. The HTML document contains various tags that control the displaying of text, graphics, controls, and other features. The HTML document may contain URLs of other Web pages available on that server computer system or other server computer systems.
An important feature of the WWW is the ability to connect one Web page to many other Web pages using "hypertext" links. A link typically appears unobtrusively as an underlined portion of text in a Web page; when the user of this page moves a pointer over the underlined text and clicks, the link—which is otherwise invisible to the user—is executed and the linked Web page is retrieved. It is also not necessary for the retrieved Web page to be located on the same server as the original Web page.
One of the benefits of the WWW is the accessibility of information. Thus, the WWW has become increasingly used to share electronic information between users of the Internet. Similarly, the widespread accessibility and ease of use of the WWW have enabled it to contribute significantly to the growth of electronic commerce.
Web sites offering electronic information to WWW users generally fall into two types, the first of which is a "one-to-many" information distribution system. Electronic information—for example, news articles, short stories, poems, recipes, sports news, computer files, product recommendations, and instructions—are provided on a Web site for distribution to multiple users. Such electronic information may generally be referred to as "articles". In such "one-to-many" systems, the content of the articles is generated by a single entity, e.g. a newspaper, and available to multiple users. For example, the Web site NYTIMES.COM utilizes a "one-to-many" electronic information distribution system. However, "one-to-many" systems typically do not provide for users of the Web site to communicate with other users of the Web site.
By way of example of a "one-to-many" information distribution system, U.S. Pat. No. 6,078,916 to Culliss on Jun. 20, 2000 discloses a method of organizing information in which the search activity of a user is monitored and such search activity is used to organize articles in a subsequent search.
A second type of Web sites offering electronic information is a "many-to-many" information distribution system. In this type of system, articles are not created by a single entity but rather are created by multiple users and subsequently made available to multiple other users of the Web site. Thus, the "many-to-many" Web site operates as a central point of information sharing between the multiple users of the Web site. For example, the Web site BLOGGER.COM utilizes a "many-to-many" electronic information distribution system. However, "many-to-many" systems typically do not provide incentive, financial or otherwise, for information-providing users to provide information to the Web site; such systems rely on the voluntary provision of information from users. Also, "many-to-many" systems typically do not provide a mechanism by which information-seeking users may gauge the value of the information provided by other users.
Exemplary of a "many-to-many" information distribution system is U.S. Patent Application Publication No. 2003/0028469 A1 of Bergman et al. on Feb. 6, 2003, which discloses techniques for enabling an electronic information marketplace between buyers and sellers exchanging information goods.
The present invention is provided to solve these and other problems.

System and method for distributing electronic information


A single-phase induction motor includes a main winding, an auxiliary winding, a run capacitor, and a subsidiary start device. The auxiliary winding is configured such that the number of turns of the auxiliary winding, through which a current flows, varies according to the operating mode of the motor. When the motor starts, the number of turns of the auxiliary winding, through which a current flows, is reduced, thereby increasing the start efficiency of the motor. When the motor runs in normal mode, the number of turns of the auxiliary winding, through which a current flows, is increased, thereby increasing the operational efficiency of the motor.

1. Field of the Invention
The present invention relates to a single-phase induction motor, and more particularly to a single-phase induction motor, which changes the number of turns of an auxiliary winding, through which a current flows, according to the operating mode of the motor, thereby increasing both the start torque performance when the motor starts and the efficiency of the motor when the motor runs in normal mode.
2. Description of the Related Art
A single-phase induction motor is a device that produces an alternating current on a winding installed on a stator, and produces an alternating magnetic field according to the current variation, thereby applying a torque to the rotor and thus obtaining a rotating force.
However, in the case where the motor receives single-phase AC power from a driving power source, the motor simply produces an alternating magnetic field in the axis direction of the winding, and thus it is not able to produce a rotating force. A start device is installed in the motor to start the motor. Typically, a capacitor-based start device is used as the start device.
FIG. 1 is a circuit diagram of a conventional single-phase induction motor. As shown in FIG. 1, the conventional single-phase induction motor is driven by a power source E, and includes a main winding M, an auxiliary winding S, a run capacitor Cr connected in series with the auxiliary winding S, and a subsidiary start device connected in parallel with the run capacitor Cr. The subsidiary start device is generally composed of a Positive Thermal coefficient element (hereinafter referred to as a "PTC") 50. The PTC 50 is an element whose resistance varies according to temperature. The PTC 50 has a high resistance at high temperatures and has a low resistance at low temperatures.
The single-phase induction motor further includes a rotor 20, which is shown as a circle between the windings M and S in FIG. 2. A start capacitor (not shown) may be connected in series with the subsidiary start device.
The single-phase induction motor configured as described above operates in the following manner.
As the power source E supplies power to the motor, a current Im flows to the main winding M, so that the main winding M produces a main alternating magnetic field. Also, a current Is, whose phase is shifted by the run capacitor Cr, flows to the auxiliary winding S, so that the auxiliary winding S produces an auxiliary alternating magnetic field whose phase is different from the main alternating magnetic field produced by the main winding M. As the auxiliary winding S produces the auxiliary magnetic field with a different phase from the main magnetic field, a rotating magnetic field is produced, so that torque is applied to the rotor 20, thereby rotating the rotor 20.
In addition, since the PTC 50, which is used as a subsidiary start device, has a relatively low resistance when the motor starts, most of the current Is passing through the auxiliary winding S flows through the PTC 50 when the motor starts, thereby increasing the start efficiency of the motor.
On the other hand, when the motor runs in normal mode after a predetermined time from the start of the motor, the PTC 50 has a very high resistance, thereby opening a connection line, through which the PTC 50 is connected to the circuit, and thus preventing current from flowing to the PTC 50.
Accordingly, most of the current Is passing through the auxiliary winding Is flows through the run capacitor Cr, so that the rotor 20 rotates at synchronous speed due to the interaction between the rotor 20 and the magnetic fields produced by the main winding M, the auxiliary winding S and the run capacitor Cr.
FIG. 2 is a circuit diagram illustrating the connection state of wires of an auxiliary winding of a conventional single-phase induction motor. The conventional single-phase induction motor includes a stator 30 having a number of slots 1 to 14 and 1′ to 14′. A coil is wound on the stator 30 through the slots 1 to 14 and 1′ to 14′ to form a main winding and an auxiliary winding. The auxiliary winding includes two coils connected in parallel. The first coil (n3 to n7) of the auxiliary winding is formed by winding turns n3 to n7 on the stator 20 through slots 12, 3, 11, 4, . . . in the named order. The second coil (n3′ to n7′) is formed by winding turns n3′ to n7′ on the stator 20 through slots 12′, 3′, 11′, 4′ . . . in the named order. The two coils of the auxiliary winding are connected in parallel by connecting both ends of the first coil (n3 to n7) of the auxiliary winding respectively with both ends of the second coil (n3′ to n7′) thereof.
The run capacitor Cr is connected between the power source E and one-side ends of the two parallel coils of the auxiliary winding. The PTC 50 is connected in parallel with the run capacitor Cr. As a rotating magnetic field is produced by a current flowing through the coils, a rotating force is applied to the rotor 20, thereby rotating the rotor 20. In order to transfer the rotating force to the outside of the motor, a shaft 40 is placed in the rotor 20 at the center thereof so that it is oriented in the direction parallel to the axis of the rotor 20.
Both the operational and start efficiencies of the conventional single-phase induction motor have a significant influence on the performance of the motor. However, the operational and start efficiencies depend on the number of turns of the auxiliary winding. Specifically, if the number of turns of the auxiliary winding is large, the operational efficiency of the motor is increased but the start efficiency thereof is reduced. On the contrary, if the number of turns of the auxiliary winding is small, the start efficiency of the motor is increased but the operational efficiency thereof is reduced.
The conventional single-phase induction motor cannot achieve satisfactory start and operational efficiencies at the same time since the number of turns of the auxiliary winding is constant from when the motor starts running to when the motor stops running.


In an implantable heart-monitoring device and system, and a heart-monitoring method, a control circuit is connected to one or more sensors, a first of which is positionable in the coronary sinus region of a heart and senses at least one blood constituent, and at least one other of the sensors supplying a signal to the control circuit indicative of the activity of the heart. In response to signals from the first sensor and with information about the activity of the heart from the other sensor, the control circuit determines a first value of the blood constituent during a first portion of a heart cycle, and determines a second value of the blood constituent during a second portion of the heart cycle.

1. Field of the Invention
The present invention relates to an implantable heart monitoring device of the type having a control circuit connected to one or more sensors suited to be positioned in or at the heart of a living being, at least a first of the sensors being positionable in the coronary sinus region of the heart and arranged to sense at least one constituent of blood, and wherein the control circuit receives signals from the first sensor, which are related to the blood constituent, and wherein the control circuit senses the activity of the heart, via signals from one or more of the sensors, such that events signifying a heart cycle are detectable by the control circuit. The invention also relates to a heart monitoring system including such a heart monitoring device and a method for monitoring a heart.
2. Description of the Prior Art
Many different devices for monitoring the performance of a heart are known. Often these devices are also able to deliver stimulation pulses to the heart. The devices are often able to sense the electrical activity in the heart. It is also known to sense other physiological parameters, such as pressure, oxygen level, pH, nitric oxide, carbon dioxide, etc.
U.S. Pat. No. 5,213,098 discloses a cardiac stimulator with an oxygen saturation sensor positioned in the coronary sinus of the heart. The device is also able to sense the blood pressure and the electrical activity of the heart. The stimulator may be used to control the atrial stimulation in order to improve the filling of the ventricles.
U.S. Pat. No. 5,199,428 discloses a device for detecting myocardial ischemia. A pH sensor or an oxygen saturation sensor may be positioned in the coronary sinus. The device can be used to stimulate for example the left and/or right carotid sinus nerves in order to decrease cardiac workload.
U.S. Pat. No. 6,236,873 discloses an electrochemical sensor for measuring the oxygen content in blood.
U.S. Pat. No. 4,202,339 describes a sensor for measuring the oxygen saturation level in blood.
U.S. Pat. No. 4,453,537 discloses a device for sensing, inter alia, the carbon dioxide content in the blood.
U.S. Pat. No. 5,582,170 discloses a fiber optic sensor for sensing the nitric oxide content in blood.
U.S. Pat. No. 5,720,768 discloses different possible electrode positions in order to stimulate or sense the different chambers of the heart.
U.S. Pat. No. 6,070,100 discloses that electrodes may be positioned in both the left and the right atrium as well as in or at the left and the right ventricles. The document describes the possibility of sensing the impedance between different electrodes. The sensed impedance values may be used to improve the cardiac output.
U.S. Pat. No. 5,156,147 discloses a pacemaker which has a hemodynamic sensor which is arranged to provide a signal representing the pumping performance of the heart. The hemodynamic sensor may be a piezoelectric pressure sensor.

Heart monitoring device, system and method


A neural network structure, namely a warped external recurrent neural network, is disclosed for reconstructing images with synthesized effects. The effects can include motion blur, depth of field reconstruction (e.g., simulating lens effects), and/or anti-aliasing (e.g., removing artifacts caused by sampling frequency). The warped external recurrent neural network is not recurrent at each layer inside the neural network. Instead, the external state output by the final layer of the neural network is warped and provided as a portion of the input to the neural network for the next image in a sequence of images. In contrast, in a conventional recurrent neural network, hidden state generated at each layer is provided as a feedback input to the generating layer. The neural network can be implemented, at least in part, on a processor. In an embodiment, the neural network is implemented on at least one parallel processing unit.

Computer-generated images can be rendered by a variety of algorithms. Many of these algorithms are designed to create photo-realistic images using a variety of complicated techniques. Examples of algorithms used to create photo-realistic images include ray-tracing algorithms and rasterization algorithms with advanced lighting shaders. Various applications may require these algorithms to produce video streams that include photo-realistic images in real-time. The timing requirements can introduce significant limitations on the quality of images that can be produced at, e.g., 30 frames per second.
One technique to get around these limitations is to render the images using an algorithm that meets the timing constraints and then reconstruct a better quality image during a post-processing operation. This technique can separate the creation of visual effects such as lens flare, bokeh due to depth of field associated with a lens, motion blur, and the like from the rendering algorithm that translates a three-dimensional model or geometry into a two-dimensional image. However, these techniques are relatively new and the results are mixed. There is room to improve the post-processing techniques using new algorithms to model these visual effects. Thus, there is a need for addressing these issues and/or other issues associated with the prior art.

Motion blur and depth of field reconstruction through temporally stable neural networks


A device for implantation in a host having a material at an interface between the host and the device, said material having a conformation which results in growth of vascular structures by the host close to the interface.

The present invention relates to material implanted in a host. More particularly, the present invention relates to material that promotes the formation of vascular structures at the interface between at least a portion of the implanted material and the host.
For a variety of applications, ranging from research to therapeutic, it may be desirable to implant an article or device within soft tissue. Such implants can include indwelling catheters, indwelling sensors, and devices for holding tissue that are implanted in vivo.
If the implanted device is utilized to hold tissue, in a variety of such applications it is necessary to isolate the implanted tissue from the immune response of the host (immunoisolation). For example, this is critical when the implanted tissues are xenografts, i.e., graft cells from donors of another species, or allografts, i.e., cells from the same species but having a different genetic make-up. A failure to properly isolate such tissue will result in an invasion from host cells or host immunogenic factors rejecting the implant cells. In certain other applications, such as autografts, i.e., cells previously isolated from the tissue of the patient to be implanted, it is necessary to isolate the implanted tissues from the host, not because the cells would be rejected, but because the cells may contain retroviral vectors which otherwise might present a risk to the patient. Accordingly, it may be necessary for such cells to be enclosed within a structure that prevents the passage of cells therethrough.
In certain other implant applications it may be desirable to provide a zone or structure that is selectively impermeable for molecular diffusion as in certain forms of cellular implants that could be rejected by humoral factors, or non-permeable for non-transport functions, such as providing a surface for transcutaneous catheters.
When biomaterials are implanted, the host inflammatory cells (macrophages, giant calls, and fibroblasts) produce an inflammatory response called a foreign body response. This response invariably results in a zone of nonvascular tissue that surrounds the implanted material. The foreign body response is the body's attempt to remove or isolate the foreign entity (Anderson, J. M., "Inflammatory Response to Impants", Trans. Am. Soc. Artif. Interm. Ograns, Vol. XXXIV:101-107 (1988)).
During the foreign body response macrophages from the host attempt to ingest the foreign body. In some cases, the macrophages coalesce to form multinuecleated giant cells. The implant may lead to the formation of fibroblast layers of increased thickness and density as the host attempts to isolate the foreign body. This creates a fibrous capsule of cells and collagen.
Referring to FIG. 1, a micrograph (1(a)) and a drawing (1(b)) are provided to illustrate a classical tissue response to an implanted foreign body. FIG. 1 represents a typical histological section taken through a tissue block removed after approximately three weeks from a dorsal subcutaneous implant in a Sprague-Dawley rat. As illustrated, the implant 10 is surrounded by a foreign body capsule 12 that forms adjacent to the implant. The foreign body capsule 12 typically consists of three-layers.
As illustrated, the first layer 13 of the foreign body capsule 12 includes macrophages 14 and foreign body giant cells 16 at an interface 18 between the implant 10 and the tissue. This first layer 13, consisting of the macrophages 14, is generally approximately 5 to about 15 microns thick.
The next, or second layer 15, of the foreign body capsule 12 includes fibroblasts 20. The fibroblasts 20 are oriented parallel to the surface of the implant 10 and embedded in a collagenous matrix including collagen fibers that are also oriented parallel with the surface of the implant. The second layer 15 consisting of the fibroblasts 20 and collagen fibers is generally approximately 30 to about 200 microns thick. The first and second layers 13 and 15 of the foreign body capsule 12 are usually completely avascular throughout.
At the outlying areas of the foreign body capsule 12, a few vascular structures 24 begin to appear in the outer regions of the fibroblast second zone 15. At a third layer 17, lying approximately 30 to about 200 microns away from the surface of the implant 10 is loose connective tissue that is highly vascular. This layer 17 is amorphous and widely varies in thickness depending on the tissue location and time after the implant.
As illustrated in FIG. 1, the classical foreign body response results in the implant 10 being surrounded by a foreign body capsule 12 that does not include vascular structures near the surface of the implant.
Although the foreign body capsule generated from the foreign body response is desirable, or at least not detrimental, for certain types of implants, such as, for example, silicon breast implants and collagen implants, the foreign body capsule prevents certain applications and treatments utilizing such implants. For example, indwelling sensors for applications such as glucose analysis in diabetics, become occluded after only a few days due to the foreign body capsule. Indeed, the foreign body capsule becomes so thick that it inhibits the diffusion of glucose to the membrane surface preventing the sensor from functioning.
Likewise, when pancreatic islets are implanted within a semipermeable membrane for treatment of diabetes, they usually die within a few days or weeks. The loss of function of the pancreatic islets is attributed to the poor diffusion of nutrients to the islets due to the thickness of the foreign body capsule. Likewise, other tissues that are implanted within the host do not remain viable due to the foreign body capsule that effectively prevents the transport of nutrients from the capillaries to cells enclosed within the implanted membrane.
Scharp, in a comprehensive review of the literature about immunoisolation ("Isolation and Transplantation of Islet Tissue" (1984) World J. Surgery 8:143-151) cited 18 papers on islet immunoisolation. In every case, the islets failed to function for more than a few weeks, or in 4 studies, several months. In every case but one, the failure was attributed to fibroblastic overgrowth of the membrane and chamber. The authors state that, "If . . . a [membrane] can be constructed to resist host fibrotic response, then the extravascular diffusion chamber approach may be useful clinically." They further state that the "primary disadvantages [of diffusion chambers] relate to the host fibroblastic response to the device." This belief is echoed in U.S. Pat. No. 4,298,002 which states, "the device . . . remains effective for limited periods of time because the body encapsulates the device with fibrous material blocking the passage of insulin, nutrients, and/or waste products."
More recent papers continue to state that device failure is caused by the foreign body capsule diminution of diffusion. For example, Christenson, Abeischer, McMillan, and Galletti, in "Tissue Reaction to Intraperitoneal Polymer Implants: Species difference and effects of corticoid and doxorubicin" ((1989) J. of Biomed. Mat. Res. 23:705-718) stated, "reduction of the tissue reaction around an implant is important in improving the long-term viability of the encapsulated endocrine tissue and is imperative for any clinical application of this technique for implanting endocrine tissue."
Poor viability of tissues has prompted the design of modalities for periodic replacement of implanted islets through percutaneous catheters (e.g. U.S. Pat. No. 4,378,016) to solve the shortcoming of previous designs, i.e., the deterioration of implanted tissues because of overgrowth by a fibrous capsule.
Additionally, indwelling catheters that have a variety of applications, typically have a high drop-out rate because the site of the catheter entry becomes infected. It is generally believed that this infection is caused by poor adhesion of the tissues to the catheter surface and poor vascularization of the region around the catheter because of the thick foreign body capsule that forms. Implants have been proposed having surfaces designed to increase the adhesion or anchorage of the implant in the host tissue (e.g. European Patent Application No. 0359575 of Von Recum and Campbell). This patent application describes materials with surface topography designed to provide "improved soft tissue implant having a surface texture that optimizes anchorage of the implant to the tissue without causing inflammatory tissue at the implantation site."
In attempting to provide needed nutrients to cells and tissues located within implanted devices and/or allowing agents generated by the tissues to enter the host, an almost contradictory concern must be dealt with. For devices that include xenografts or allografts, these tissues must be isolated from the immune system of the host. Therefore, although it may be desirable to somehow connect the vascular system of the host to these tissues to provide nutrients and allow a transfer of biological agents to the host, a contrary concern is to prevent an immune response from the host to the tissues. Likewise, with respect to sensors and catheters, although it may be desirable to create vascularization with respect to these devices, vascularization into an interior of such devices will prevent the devices from functioning satisfactorily.


A process for the preparation of a 1,5-dideoxyazafuranose or 1,6-dideoxy-azapyranose is disclosed. In such a process, an azido-substituted .alpha.-ketose phosphate having a five- or a six-carbon chain is hydrogenated in the presence of a palladium catalyst. The carbon atom bearing the azido substituent and the carbon atom of the keto group of the .alpha.-ketose phosphate starting material are separated by two or three carbon atoms.

Carbohydrates are a large class of natural substances that structurally are polyhydroxycarbonyl compounds and their derivatives. Carbohydrates generally correspond to the formula (C).sub.n (H.sub.2 O).sub.n, where n is an integer usually greater than 3.
Monosaccharides are simple carbohydrates that cannot be further hydrolyzed into simpler types of carbohydrate. A monosaccharide having a six-membered ring is referred to as a pyranose, whereas a five-membered ring monosaccharide is referred to as furanose. A pyranose or furanose lacking one or more hydroxyl groups normally present in a carbohydrate is referred to as a deoxy-pyranose or deoxy-furanose, with the carbon chain position at which the hydroxy is absent being indicated.
Azasugars are a class of saccharides in which the ring oxygen is replaced by an imino group (--NH--). A six-membered ring azasugar can be referred to as an azapyranose or a polyhydroxylated piperidine compound. A five-membered ring azasugar can be referred to as an azafuranose or a polyhydroxylated pyrrolidine. An azasugar can also be named as an aza derivative of an otherwise systematically or trivially named pyranose or furanose monosaccharide.
One group of azasugars described herein are derived from piperidines (azapyranoses), can be hyrdroxylated at the 3-, 4- and 5-positions, have hydrogen at the 6-position and can have a methyl group or hydrogen at the 2-position, the 1-position being the nitrogen atom, in piperidine nomenclature. Dideoxyazapyranoses are the polyhydroxylated piperidines as discussed above, that have either a methyl group or hydrogen at the 5-position, hydrogen at the 1-position and can have hydroxyl groups elsewhere on the ring, as above, in pyranose nomenclature. Pyranose nomenclature and numbering will usually be used herein for six-membered ring compounds, unless otherwise specified.
Another group of azasugars described herein are derived from pyrrolidines (azafuranoses). These compounds can be hydroxylated at the 3 and 4 positions, have a hydroxymethyl group at the 5-position, and a methyl or hydroxymethyl at the 2-position, the 1-position being the nitrogen atom, in pyrrolidine nomenclature. A 2-hydroxymethyl group in pyrrolidine nomenclature corresponds to a 1-hydroxymethyl or 4-hydroxyl group in furanose nomenclature. Dideoxyazafuranoses are the polyhydroxypyrrolidines discussed above that have a methyl or hydroxymethyl at the 4-position, hydrogen or hydroxymethyl at the 1-position, and can have hydroxyl groups at the other positions, using furanose numbering. Pyrrolidine nomenclature and numbering will usually be used herein for these azasugars, unless otherwise specified.
Azasugars and their derivatives have been identified as potent glycosidase inhibitors [Paulsen et al., Adv. Carbohydr. Chem. 1968, 21, 115; Fellows, Chem. Br. 1987, 22, 842; Truscheit et al., Angew. Chem. Int. Ed. Engl. 1981, 22, 744; Inouye et al., Tetrahedron 1968, 24, 2125; Muller, in Biotechnology, Rehm, H.-J. et al., eds., VCH Verlagsgesellschaft Weinheim 1985, Vol. 4, Chapter 18]. As such, azasugars can be useful for treating metabolic disorders such as diabetes [Liu, J. Org. Chem. 1987, 52, 4717; Bayer et al., Ger. Offen. DE 3620645; Anzeveno et al., J. Org. Chem. 1989, 111, 2539; Yoshikuni et al., J. Pharmacobio-Dyn 1988, 111, 356] or as antiviral agents [Karpas et al., Proc. Natl. Acad. Sci. 1988, 85, 9229; Walker et al., Proc Natl. Acad. Sci. 1987, 84, 8120; Winkler et al., J. Med. Chem. 1989, 32, 2084], as antimicrobial [Evans et al. J. Phytochemistry 1985, 24, 1953] and as anticancer agents [Humphries, M. J., et al. Cancer Res. 1986, 46, 5215].
Despite their clear usefulness, there is still a need for an effective synthesis of novel azasugars and their derivatives [Fleet, Chem. Br. 1989, 25, 287 and references cited therein; Bernotas et al., Tetrahedron Lett. 1985, 26, 1123; Setoi et al. Chem. Pharm. Bull, 1986, 34, 2642; Legler et al., Carbohydr. Res. 1984, 128, 61; Kinast et al., Angew. Chem. Int. Ed. Enal. 1981, 20, 805; Hanesian, Chem. Ind. 1966, 2126; Schmidt et al., Justus Liebigs Ann. Chem. 1989, 5, 423; Pederson et al., Tetrahedron Lett. 1988, 29, 4645; Ziegler et al., Angew. Chem. Int. Ed. Engl. 1988, 29, 716; Buchanan et al., J. Chem. Soc. Perkin Trans, 1990, 699; Fleet et al., J. Chem. Soc. Perkin Trans. 1989, 665; Dondoni et al., J. Chem. Soc. Chem. Commun. 1990, 854; Fleet et al., Chem. Lett. 1986, 1051; Chen et al., Tetrahedron Lett. 1990, 31, 2229; Ciufolini et al., J. Am. Chem. Soc. 1989, 111, 3473] .
Naturally occurring azasugars include 1-deoxynojirimycin (1,5-dideoxy-1,5-imino-D-glucitol), 1-deoxymannojirimycin (1,5-dideoxy-1,5-imino-D-mannitol), and castanospermine (1,6,7,8-tetrahydroxyoctahydroindolizine). 1-Deoxynojirimycin was isolated from plants of the genus Morus [Yagi et al., Nippon Nogei Kagaku Kaishi 1976, 50, 5751; Vasella et al., Helv. Chim. Acta, 1982, 65, 1134] and from strains of Bacillus [Daigo et al., Chem. Pharm. Bull. 1986, 34, 2243]. 1-Deoxymannojirimycin was isolated from the legume Lonchocarpus [Fellows et al., J. C. S. Chem. Comm. 1979, 977]. Castanospermine is a plant alkaloid isolated from seeds of an Australian chestnut tree, Castanospermum australe [Saul et al. Arch. Biochem. Biophys. 1983, 221, 593]. Isolation of azasugars from nature is often expensive and time consuming. Therefore, several methods have been developed for the synthesis of these important compounds.
Both synthetic and semi-synthetic routes have been used in these syntheses [Inouye et al., Tetrahedron 1968, 24, 2125; Paulsen et al., Chem. Ber, 1967, 100, 802; Saeki et al., Chem. Pharm. Bull. 1968, 16, 2477; Paulsen et al., Adv. Carbohydr. Chem. 1968, 23, 115; Kinast et al., Angew. Chem. Int. Ed. Engl. 1981, 20, 805; Bernotas et al., Tetrahedron Lett. 1984, 25, 165; Bernotas, Tetrahedron Lett, 1985, 26, 1123; Setoi et al., Chem. Pharm. Bull. 1986, 34, 2642; Iida, J. Org. Chem. 1987, 52, 3337). Natural sugars have been used as starting materials, but multiple protection and deprotection steps are required. For example, glucose was used in the synthesis of 1-deoxynojirimycin and 1-deoxymannojirimycin [Fleet, Chem. Br. 1989, 25, 287 and references cited therein; Bernotas et al., Tetrahedron Lett, 1985, 26, 1123; Chen et al., Tetrahedron Lett, 1990, 31, 2229).
An enzymatic synthesis based on fructose-1,6-diphosphate (FDP) aldolase (EC 184.108.40.206) has been recently developed and has proven to be a powerful approach for the synthesis of some azasugars [Pederson et al., Tetrahedron Lett. 1988, 29, 4645; von der Osten et al., J. Am. Chem. Soc. 1989, 111, 3924; Pederson et al., Heterocycles 1989, 28, 477; Ziegler et al., Angew, Chem. Int. Ed. Engl. 1988, 29, 716; Straub et al., J. Org. Chem. 1990, 55, 3926]. This enzymatic method involves the use of FDP aldolase from either rabbit muscle or Escherichia coli to catalyze the aldol condensation of dihydroxyacetone phosphate (DHAP; a donor substrate) with any of a number of possible omega-azidoaldehydes as a second, acceptor substrate [Durrwachter et al., J. Am. Chem. Soc. 1986, 108, 7812; Durrwachter et al. J. Org. Chem. 1988, 53, 4175; Pederson et al., Tetrahedron Lett. 1988, 29, 4645; Bednarski et al. Tetrahedron Lett, 1986, 27, 5807]. The omega-azidoketose phosphate produced is dephosphorylated and then reductively cyclized to form a deoxynojirimycin compound.
For instance, if DHAP is reacted with (RS)-3-azido-2-hydroxypropanal in the presence of FDP aldolase, the 2-epimers, 1-deoxynojirimycin and 1-deoxymannojirimycin, are produced upon catalytic reductive amination of the dephosphorylated enzyme reaction products [Pederson, R. L., et al. Tetrahedron Lett. 1988, 29; 4645].
After synthesis, 1-deoxynojirimycin can then be easily converted into castanospermine [Hamana et al., J. Org. Chem. 1987, 52, 5494]. The latter compound has been shown to inhibit the processing of the AIDS virus gp160 envelope protein precursor, and to modify the envelope glycoprotein, thus affecting the ability of the virus to enter cells [Walker et al., Proc. Natl. Acad. Sci. 1987, 84, 8120].
The synthesis of hydroxylated piperidines and pyrrolidines from dicarbonyl sugars via a one-step double reductive amination reaction has recently been reported. Reitz, et al., Tetrahedron Lett, 31 (47):6777-6750 (1990). According to such a synthetic scheme, 2,5-anhydro-imino-D-glucitol and 1-deoxynojirimycin were prepared by reacting 5-keto-D-fructose and 5-keto-D-glucose, respectively, with benzhydrylamine (NaCNBH.sub.3, MEOH).
Each of the above azapyranoses and azafuranoses thus far prepared has had two hydrogens at the 1-position of the azapyranose (or azafuranose) ring and a hydroxyl group at the 6- or 5-position (omega-position) carbon atom of the pyranose or furanose chain; i.e., the last carbon in the chain or the omega-position. Further, naturally occurring pyranose and furanose sugars found in man and other mammals contain a 6- or 5-position hydroxyl group, respectively.
On the other hand, many pyranose sugars in many microbes such as bacteria, insects and plants are free of a 6- or omega-position hydroxyl group. Such 6-or omega-dehydroxy (-deoxy) sugars are rare, if present at all, in man and other mammals.
It would therefore be beneficial if a 6- or omega-deoxy azapyranose could be prepared that bears a structural similarity to the omega-deoxy-pyranoses that are present in microbes. The disclosure that follows describes the synthesis and activity of several omega-deoxy-azapyranose compounds as well as the synthesis of omega-deoxy azafuranose.

Process for forming omega-deuxy-azasugars


A viewing system and method for producing at least one image for being perceived as three-dimensional, including at least one of: a provision for compensating the center-of-interest of the at least one image in such a manner as to reduce convergence-accommodation conflict; a provision for configuring the viewing system such that crosstalk produced by a stereo display is perceived as foreground and background blur instead of ghosting; and a provision for viewing the at least one image via automicrostereopsis.

Generally, a need has been recognized for what may be termed "kinder gentler stereo".
In this context, "stereo" refers to a system for putting information on a two-dimensional, essentially flat screen surface (such as front and back projection "movie" screens, CRTs, LCDs, etc.) in a way that causes the observer to see an image in depth corresponding to the depth in the original scene. The scene could be a real scene captured by an appropriate camera system, a virtual scene generated by a computer, or a hybrid of these.
The term "kinder gentler" is provided as a contrast to what has been experienced with known conventional devices. Particularly, conventional stereo displays often involve various types of physical and mental discomfort, to varying degrees. One commonly encountered example of such discomfort is "virtual reality sickness". Technical inconveniences have also been noted among known devices, such as specialized types of eyewear that must be worn and "viewing zones" that are often perceived to be bothersome.
At a basic level of the musculature of the human visual system, there is a well-known conflict, known as convergence-accommodation (sometimes termed "vergence-accommodation", among other things) that makes it difficult to achieve the desired consistency among stimuli (or cues). That is, because the information is presented on a 2D "flat" screen surface, the eyes focus (i.e., accommodate) on that surface. However, the directions-of-gaze of the eyes have been found to converge not on the screen but onto a center-of-interest which generally exists someplace in front of or behind the screen at a distance corresponding to the virtual location of the point or region at the momentary center-of-interest.
The conflict between what the convergence muscles and the focusing muscles are each communicating to the brain about the scene's depth is thus a major disturbing conflict. A need has thus been recognized to overcome this and other conflicts of less severe nature.


The present invention relates to a trimming apparatus operable in an auto mode or a manual mode. The trimming apparatus include a cutter frame, a transmission belt, a motor, a clamping element, a switch and a mode-switching unit. By adjusting the mode-switching unit to control clamping element to clamp or release the transmission belt, the trimming apparatus 100 is operated in either the auto mode or the manual mode.

With increasing industrial development, electronic office technologies have experienced great growth and are now rapidly gaining in popularity. In other words, a diversity of office machines such as personal computers, printers, copy machines or multifunction peripherals are utilized to achieve various purposes. As a consequence, the working efficiency is enhanced. Recently, automatic shredders, electronic punches, automatic trimmers are prevailing.
Take a conventional automatic trimming apparatus for example. After ten or more documents are placed on the platform of the automatic trimming apparatus and the plug is connected to the utility power, the automatic trimming apparatus can be powered on to uniformly trim the documents. In some situations where only one or two documents are intended to trim, the conventional manual trimming apparatus is more convenient than the automatic trimming apparatus. Since the conventional automatic trimming apparatus can only be operated in the auto mode rather than the manual mode, the conventional automatic trimming apparatus is not user-friendly.
Therefore, there is a need of providing a trimming apparatus operable in an auto mode or a manual mode, in which the operating mode is selected according to the user's requirement.

Trimming apparatus operable in auto mode or manual mode


A method for searching a printing frequency to display a 3D picture includes breaking an image into strips and using NumLen lenses to form a NumLen-1 image cycle. After the NumLen-1 image cycle is formed, a quantity of images of the image cycle is defined to be dpi/lpi, where dpi is dot per inch of a printer and Ipi is lens per inch of a lenticular lens. Therefore, a quantity of the image per inch is arrived.

1. Field of the Invention
The present invention relates to a printing frequency searching method, and more particularly to a method for fast search printing frequency to present a 3D image.
2. Description of Related Art
In order to have a three dimensional image, the images received by the left eye and the right eye of an observer are different. With this kind of fine difference in the images, the observer superposes the two different images to form a three dimensional image. A lenticular lens is a lens array that uses this principle to turn a two dimensional image into a three dimensional image. At least two images are chiastically placed under the lenticular lens and the positions of the two images correspond to the lens per inch of the lenticular lens. The two images project through the lenticular lens to the left eye of the observer to present a first picture and to the right eye of the observer to present a second picture, as shown in FIG. 1. Therefore, the observer is able to see a three dimensional image through the lenticular lens by the fine difference between the two pictures.
U.S. Pat. No. 6,329,987; U.S. Pat. No. 6,026,215; U.S. Pat. No. 6,091,479; U.S. Pat. No. 6,405,464; U.S. Pat. No. 5,973,700 and U.S. Pat. No. 5,715,383 are patents using the lenticular lens in different fields to develop specific technologies. In U.S. Pat. No. 6,329,987, it utilizes a specific technology to search for a printing frequency. However, numerous drawbacks and disadvantages are encountered in the practical operation. The image frequency (VPI; view per inch) of the patent starts from 300, which leads to a consequence that the quantity required to search for the printing frequency is enormous. Therefore, the operator is unable to have the printing frequency within a short period of time. Furthermore, the only criterion in the patent is that the image frequency will be smaller than the frequency of the lenticular lens, which leads to a consequence that the operator is not able to search for the appropriate printing frequency systematically.
To overcome the shortcomings, the present invention tends to provide an improved method to search printing frequency to present a three dimensional image to mitigate and obviate the aforementioned problems.

Method to fast search printing frequency to present a 3D image


A liquid waste disposal and canister flushing system includes a cabinet with a sink for receiving the canister and a subsink for receiving a lower portion thereof. The subsink is connected to a drain line. A plunger subassembly includes a stopper which functions as a drain valve for the canister. An injection jet is connected to water and cleaning solution sources and discharges diluted cleaning solution into the canister for flushing same. The injection jet engages the plunger subassembly for ejecting the stopper from a canister drain opening. A control system includes a programmable microprocessor which can be programmed to provide drain and flush cycles of predetermined duration. A method of liquid waste disposal and canister flushing utilizes the microprocessor for delaying the flush cycle until completion of the drain cycle. The control system can provide drain and flush cycles of predetermined durations, can monitor water pressure, flow rate and temperature, cleaning solution flow rate and other system parameters.

I. Field of the Invention
The present invention relates generally to liquid waste disposal and canister flushing, and in particular to the disposal of liquid medical waste from containers which are flushed in preparation for reuse.
II. Description of the Related Art
Various forms of liquid waste are commonly encountered in a variety of different situations. For example, liquid medical wastes are commonly produced in surgery and other medical procedures. Such wastes can include blood and other body fluids of patients, and major surgery can produce a number of containers of such waste from a single patient. Liquid medical waste generates significant disposal problems due to its possible contamination with various infectious diseases, including AIDS, hepatitis, MRSA and tuberculosis. In an effort to combat the risks associated with handling such liquid medical wastes and to protect medical personnel from the spread of infectious diseases, disposal procedures have become increasingly complicated and expensive.
One type of disposal procedure for liquid medical wastes involves emptying the waste canisters from surgery into specially designed plumbing fixtures. However, this procedure can involve risks associated with splash back and aerosolization whereby medical personnel can be exposed to the waste and bacteria present therein.
Another type of procedure involves the centralized collection of the waste with specially designed equipment having a liquid waste reservoir that must periodically be dumped. Such equipment is generally relatively expensive and can add significantly to the cost of equipping a hospital operating room or other treatment facility.
Yet another method of disposing of liquid medical waste involves mixing it with a solidifying agent in the container. The medical waste in the container then disposed of pursuant to regulations governing the disposal of bio-hazardous waste. The disadvantages with this disposal method include the cost of the canister, which becomes a single-use item, and the extra charges for disposing of bio-hazardous waste, which is sometimes referred to as "red bag" waste.
Liquid medical waste disposal procedures can come under rules and regulations imposed by various governmental and regulatory agencies, including the Occupational Safety and Health Administration (OSHA), the Food and Drug Administration (FDA), and the Center for Disease Control (CDC).
Heretofore there has not been available a liquid medical waste disposal system and method with the advantages and features of the present invention.

Liquid waste disposal and canister flushing system and method


An apparatus for application of material to the external diameters of cylindrical items of manufacture. The apparatus includes a frame, a transport system having work stations supporting the items, an application system, and a curing system for curing the material applied to the cylindrical items. The application system includes first and second horizontally, axially spaced application rolls engagable with the items external diameter, and an adjustable reservoir system for supplying a desired thickness of material to be applied to the external diameter of the item.

Devices for applying liquid materials to cylindrical items of manufacture are well known in the manufacturing industry. The external diameters of cylindrical items are, for example, coated with paint or other material in the packaging industry, and with adhesive material in the automotive parts industry. One common method of applying adhesive material to parts manufactured for the automotive industry is spray coating.
One disadvantage of the spray coating process in connection with the application of adhesive is that it is quite inefficient. It is estimated that only 15%-20% of sprayed coating material adheres to the part surface being coated. Thus, as much as 80%-85% of the often expensive coating material being sprayed may be "lost".
An additional disadvantage, is that the adhesives typically used for automotive parts in spray processes are often volatile organic based materials. The atomization of such materials may result in vapors which should not be released directly into the environment. Thus, the "lost" material must be reclaimed. Reclamation of such material typically involves the use of a water retrieval system. Treatment of the waste water resulting from the operation of retrieval systems is also expensive.
U.S. Pat. No. 4,296,708, for example, provides an apparatus for roll coating the external diameters of cylindrical parts with adhesive material using fiber felt rolls. Such devices require the cylindrical part to be moved between drive and idler rolls and are not capable of applying in a precise and repeatable manner specific coating thicknesses.

Apparatus for application of a material to an external surface of items of manufacture


Provided is a multi-piece integrated heat spreader/stiffener assembly which is bonded to the substrate and die in a semiconductor package following electrical bonding of the die to the substrate, a packaging method using the integrated heat spreader/stiffener, and a semiconductor package incorporating the integrated heat spreader/stiffener. In a preferred embodiment, the integrated heat spreader/stiffener assembly has two pieces, both composed of a high modulus, high thermal conductivity material shaped to attach to each other and a die on the surface of a packaging substrate. A first piece of this assembly is bonded to the substrate surface adjacent to an electrically connected die and to the top surface of the die prior to the dispensation and curing of underfill material which provides the mechanical connection between the die and the substrate. With the first piece of the assembly in place, access may still be had to at least one edge of the die to dispense and cure the underfill epoxy. Once the underfill material is cured by heating, the second piece of the assembly is placed and bonded on the substrate either abutting or overlapping with the first piece. A ball grid array (BGA) process may then be used to apply solder balls to the underside of the substrate for subsequent bonding of the package to a circuit board for use.

This invention relates generally to semiconductor chip device assembly, and in particular to flip chip device assembly. More specifically, the invention relates to a multi-piece integrated heat spreader/stiffener assembly and method of its assembly in a semiconductor package which reduces stress and warpage of a semiconductor die during attachment of the die to a substrate.
In semiconductor device assembly, a semiconductor chip (also referred to as an integrated circuit (IC) chip or "die") may be bonded directly to a packaging substrate, without the need for a separate leadframe or for separate I/O connectors (e.g. wire or tape). Such chips are formed with ball-shaped beads or bumps of solder affixed to their I/O bonding pads. During packaging, the chip is "flipped" onto its active circuit surface so that the solder balls form electrical connections directly between the chip and conductive traces on a packaging substrate. Semiconductor chips of this type are commonly called "flip chips".
FIGS. 1A-F illustrate stages in a conventional method for packaging a semiconductor flip chip, in which a semiconductor die and a packaging substrate are electrically connected and mechanically bonded. FIG. 1A shows a cross-sectional, side view of an unbonded flip chip with the chip 100 having an active circuit surface 102 on which are arranged solder balls 104. The solder may be composed of a low melting point eutectic material or a high lead material, for example. It should be noted that this figure and the figures that follow are intended to be representative and, for example, do not show the solder balls 104 in proportion to the semiconductor die 100. In current designs, the die may have dimensions on the order of 0.5.times.0.5 inch (1 inch=2.54 cm) whereas the unbonded solder balls may have a diameter on the order of 4 to 5 mils (1 mil=10.sup.-3 inch=0.0254 mm).
Prior to bonding the die 100 to a substrate, solder flux is applied to either the active surface 102 of the die 100 or the packaging substrate surface. The flux serves primarily to aid the flow of the solder, such that the solder balls 104 make good contact with traces on the packaging substrate. It may be applied in any of a variety of methods, including brushing or spraying, or dipping the die 100 into a thin film, thereby coating the solder balls 104 with flux. The flux generally has an acidic component, which removes oxide barriers from the solder surfaces, and an adhesive quality, which helps to prevent the die from moving on the packaging substrate surface during the assembly process.
As shown in FIG. 1B, after the flux is applied, the die 100 is aligned with and placed onto a placement site on the packaging substrate 106 such that the die's solder balls 104 are aligned with electrical traces (not shown) on the substrate 106. The substrate is typically composed of a laminate or organic material, such as fiber glass, PTFE (such as Teflon.TM., available form Gore, Eau Claire, Wis.) BT resin, epoxy laminates or ceramic-plastic composites. Heat (to a temperature of about 220.degree. C, for example) is applied to one or more of the die 100 and the packaging substrate 106, causing the solder balls 104 to reflow and form electrical connections between the die 100 and the packaging substrate 106. Then, the remaining flux residue is substantially removed in a cleaning step, for instance by washing with an appropriate solvent.
At this point, the mechanical bonding procedure can begin. An underfill material, typically a thermo-set epoxy 108, such as is available from Hysol Corporation of Industry, California (product numbers 4511 and 4527), Ablestik Laboratories of Rancho Domingo, Calif. and Johnson Matthey Electronics of San Diego, Calif., is dispensed into the remaining space (or "gap") 107 between the die 100 and the substrate 106. In a typical procedure, a bead of thermo-set epoxy, is applied along one edge of the die where it is drawn under the die by capillary action until it completely fills the gap between the die and the packaging substrate. Slight heating of the packaging substrate after dispensing of the underfill epoxy assists the flow. In some cases, the underfill epoxy flow is further assisted by vacuum, or, alternatively, by injection of the epoxy into the gap.
After the epoxy 108 has bled through the gap 107, a separate bead of epoxy (not shown) may also be dispensed and bonded around the perimeter of the die 100. Thereafter, the epoxy (both the underfill and perimeter bonding epoxy, if any) are cured by heating the substrate and die to an appropriate curing temperature, for example, about 130 to 165.degree. C. In this manner the process produces a mechanically, as well as electrically, bonded semiconductor chip assembly, with the underfill material 108 allowing a redistribution of the stress at the connection between the die 100 and the substrate 106 from the solder 104 joints only to the entire sub-die area. FIG. 1C shows the semiconductor die 100 interconnected to the packaging substrate 106 electrically by solder 104 joints and mechanically by a cured layer of epoxy 108.
Semiconductor packages are typically subject to temperature cycling during normal operation. In order to improve the thermal performance and reliability of the packages, a stiffener 110 may be placed around the die 100 on the substrate 106 where it is bonded with a heat curable adhesive (not shown), as shown in FIG. 1D. The stiffener 110 is typically a flat piece of high modulus (about 9.times.10.sup.6 to 30.times.10.sup.6 psi) metal about 10 to 40 mils thick, having substantially the same dimensions as the package substrate 106 with a window 111 in its center to clear the die 100. Typically, the stiffener 110 is composed of nickel-plated copper which has a coefficient of thermal expansion similar to that of typical substrate 106 materials. The stiffener 110 may be bonded to the substrate 106 prior to the placement, bonding and underfilling/curing steps previously described, or it may be bonded after the placement and bonding of the die 100, but prior to the underfilling/curing step. The stiffener is typically bonded and cured in a separate step following curing of the underfill material 108. The adhesive may also be cured concurrently with the curing of the underfill material in a single heating step.
The purpose of the stiffener 110 is to constrain the substrate 106 in order to prevent its warpage or other movement relative to the die 100 which may be caused by thermal cycling during operation of an electronic device in which the package is installed. Such movement may result from the different coefficients of thermal expansion (CTE) of the die 100 and substrate 106 materials, and may produce stress in the die or the package as a whole which can result in electrical and mechanical failures.
Next, as shown in FIG. 1E, a heat spreader 112, typically composed of a high thermal conductivity (about 2 to 4 W/cm.multidot.K) material, and having substantially the same dimensions as the package substrate 106, is attached over the stiffener 110 and the die 100 and bonded to each by a thermally conductive adhesive (not shown) which is also then heat cured. A conventional heat spreader is also typically a flat piece of nickel-plated copper about 20 to 40 mils thick. A conventional heat spreader 112 may not be applied until the underfill material 108 has been dispensed and cured because the heat spreader 112 prevents access to the die 100. Therefore, the heat spreader 112 is applied in a separate step following attachment of the die 100 and stiffener 110.
The purpose of the heat spreader is to disperse the heat generated during thermal cycling in order to reduce stress in the package due to different CTEs of the various elements of the package, including the die 100, substrate 106 and underfill 108. Since it covers and is attached to the die 100, the heat spreader 112 also plays a role is constraining the die 100 in place on the substrate 106, but only once the heat spreader 112 is attached in position following dispensation and curing of the underfill material 108.
In a final step of a conventional packaging process, shown in FIG. 1F, solder balls 114 are bonded to the underside 115 of the substrate 106. These solder balls 114 may be used to bond the chip package to a circuit board, such as a mother board, for use in an electronic application.
A problem with such flip chip package constructions is that during the heating and cooling involved in curing of the underfill material 108, the different CTEs of the substrate 106 and die 100 materials may stress these materials by causing them to warp or otherwise move relative to each other. In addition, the epoxy underfill 108 typically shrinks during the curing process, applying additional stress on the bonded die 100 and substrate 106 which may cause one or both to warp. As discussed above with reference to operational thermal cycling, such stress in the semiconductor package which may ultimately result in its electronic and/or mechanical failure, including cracking of the die 100.
Accordingly, what is needed are methods and apparatuses for improving the reliability of flip-chip packages by providing die constraint during the underfill curing process.

Integrated heat spreader/stiffener assembly and method of assembly for semiconductor package


The invention relates to a capacitive micromechanical acceleration sensor comprising a first sensor, a second sensor, and a third sensor. The first sensor comprises a rotor electrode and stator electrode. The sensor comprises a first beam that is connected to a rotor electrode support structure and that is connected to the rotor electrode. The sensor comprises a second beam that is connected to the rotor electrode support structure and that is connected to the rotor electrode. The second sensor is situated in a first space circumscribed by the first beam, the first sensor, and the rotor electrode support structure. The third sensor is situated in a second space circumscribed by the second beam, the first sensor, and the rotor electrode support structure.

Field
The present invention relates to capacitive MEMS, micro-electro-mechanical systems acceleration sensors.
Description of the Related Art
Publication U.S. Pat. No. 7,430,909 presents a tri-axis acceleration sensor. In an embodiment of this tri-axis acceleration sensor there is provided a micro-electromechanical (MEMS) acceleration sensor, including a substrate, a first sensor and a second sensor. The first sensor is configured to measure acceleration along a first axis parallel to a plane of the substrate. The second sensor is configured to measure acceleration along an axis perpendicular to the plane of the substrate. The second sensor comprises a first beam, a second beam and a single support structure. The single support structure supports the first and second beams relative to the substrate, wherein the first and second beams circumscribe the first sensor.

Capacitive micromechanical acceleration sensor