A recording medium having a dummy signal area on at least one side of a recording area is used and information is recorded with a dummy signal added to at least one of the leading and trailing sides in the recorded information signal. The user data area remains unaffected by repeated overwriting so that recorded user data is reproduced correctly. In particular, the wave form distortion caused by fluidization of a recording film remains at the dummy signal area and does not affect the user data area, so that the reproduction of the target information (user data) is assured.

The present invention relates to an information recording medium, an information recording method and an information recording apparatus which are capable of recording such information in real time by means of recording beams, for example, laser beams as digital information including pulse-frequency modulated analog signals of projected images and voice, data in electronic computers, facsimile signals and digital audio signals. More particularly, the present invention relates to a disk shaped recording medium using an erasable, phase-change type optical recording film.
Conventional phase-change type optical disks have a recording film capable of fast erasure by crystallization that is materialized within a time substantially equal to the time required for a recording laser beam to pass on a point on a disk, for example. The conventional method of recording and erasing information to and from such an erasable recording film is to change the power of the laser beam between two levels higher than the reading power levels, these levels are a high power level and an intermediate power level. The advantage of this method is that the so-called overwriting (replacing old information with new without prior erasing) is possible. When such overwriting is repeated a plurality of times, however, the laser beam irradiates the recording film repeatedly in accordance with the recording information signal. This results in a high probability of allowing VFO recording marks to be repeatedly written to the same place in an area close to a preformat section in particular, and therefore variations in film thickness tend to occur locally because of recording film fluidization.
According to Japanese Unexamined Patent Publication No. 150725/1991, a method that avoids the recording film from being repeatedly written at the same place involves shifting the data write start position each time data is written or at appropriate times when old data is overwritten, whereby mark-forming positions are properly distributed. Thus the overwriting cyclability of the optical disk are improved.
Even when information is recorded on the phase-change type optical disk as in the prior art, the fluidization of the overall recording film inevitably occurs as overwriting is repeated a plurality of times because the temperature distribution in the laser beam is asymmetrical. Consequently, a change in the thickness of the recording film is brought about in that the film becomes thick on one side and thin on the other side (the initial or terminal end portion of a recording area taken from the perspective of the direction of recording) or the film becomes thick at the center portion of the recording area and thin at the starting and ending areas, so that the distortion of the reproducing signal waveform also occurs. The latter type of thickness change is more difficult to stop. Therefore, there arises a problem of making the area having the waveform distortion expand as the number of overwriting times increases. In the case of an erasable digital video disk, moreover, mark edge recording may be used with both edges of a recording mark provided with information for the purpose of increasing density. When such a mark edge recording system is employed, deterioration due to fluidization is further evident because a long mark is repeatedly recorded.
An object of the present invention intended to solve the foregoing problems in the prior art is to provide an information recording medium, an information recording method and an information recording apparatus that ensure reproduced signals properly corresponding to recorded information signals.
According to the present invention, a recording medium capable of recording or overwriting information with a laser beam is provided. The recording medium has a preformatted area in which information such as a track address has been formed with pits or with recording marks resulting from a phase change. In addition to the preformatted area, a gap area, a recordable area such as a VFO/SYNC area and a user data area are reserved. Moreover, a dummy area is provided on at least one of the sides before and after the recording area. A part of the VFO area can be used instead of the front dummy area, by making the VFO area long. Further, a buffer area to allow for a margin for the rotational jitter of a motor is located just after the dummy area. In this case, one of the objectives for the provision of the dummy area is to prevent information actually read from the user data area from being damaged even though repeated overwriting causes the fluidization of the recording film. Such damage is prevented because the distortion of a reproduced signal waveform is confined to the VFC/SYNC area and/or the dummy area. Further, the dummy area is preferably set to be longer than the maximum shift width of a position where the writing of a recorded information signal is started. Further, it is preferable to add a pit array (data area postamble) depending in accordance with applicable standards before this dummy area to avoid the mark and the space from being inverted.
According to the invention, recording is made by adding a dummy signal to at least the front or rear side of a target (recorded) signal such as VFO, SYNC and user data. It is preferable to add the dummy signal to the rear side (the trailing side with respect to the direction of recording) when a dummy signal is added to only one side of the target signal. In this case, the dummy signal is chiefly recorded in the dummy area.
Further, according to the invention, the fluidization of the recording film resulting from repeated overwriting can be moderated by setting the average energy of the laser beam during dummy signal recording to be lower than that during the target information signal recording. Consequently, the distortion of the reproduced signal waveform due to the fluidization slightly occurs in the dummy area where the dummy signal is recorded and in part of the buffer area. However, the recording area where the target signal is recorded remains unaffected by the fluidization to ensure that a reproduced signal correctly corresponding to the target signal is obtained. Collectively, the sum of the dummy area and the buffer area can be called a buffer area.
For the recording of the dummy signal, the average energy thereof may be lowered, for example, by adjusting the duty ratio of a single-frequency signal. In a mark edge recording system, the duty ratio of the dummy signal may be set to not greater than 50% because the average duty ratio is about 50%. The duty ratio of at least a part of the dummy signal is preferably in a range of at least 10% to about 40%, and more preferably in a range of at least 20% to about 30%. Moreover, the average energy of the laser beam during the recording of the dummy signal may be decreased stepwise or linearly by adjusting the duty ratio of the dummy signal stepwise or linearly; or otherwise the recording power may be varied. It is more preferred to vary the duty ratio of the dummy signal than to vary the recording power in order to simplify the apparatus. The dummy signal may be added to either the front or rear side of the recording information signal, that is mainly VFO, SYNC, and user data, depending on the recording media characteristics. In the preferred case of adding the dummy signal to only one side, the dummy signal is added to only the rear side of the recorded information signal rather than the front side where the VFO has a function of the dummy signal.
The distortion level of the reproduced signal waveform can also be lowered by shifting the start position of writing the recorded information signal to effect overwriting. In this case, the maximum shift width is preferably set to be shorter than the dummy signal that is added; particularly, it is preferably set to be approximately {fraction (1/20)} to xc2xd of the length of the recorded dummy signal.
Also according to the present invention the recording medium stores thereon information concerning the pattern of the dummy signal that is used, for example the duty cycle of the dummy signal. For example, it is preferred that such information be recorded in the control data area of the recording medium.
Recording films utilizing a phase change such as recording films of a Gexe2x80x94Sbxe2x80x94Te system and a Agxe2x80x94Inxe2x80x94Sbxe2x80x94Te system may be used according to the present invention. The use of a recording film containing a high-melting point material such as Crxe2x80x94Te and Agxe2x80x94Te whose melting point is higher than that of the main component material and a recording medium with an Si/metal double reflective layer is preferred because the recording film thickness is further restrained from varying because of fluidization.
Still further, according to the present invention, information is recorded by an information recording apparatus including: a laser beam source, an optical system, automatic focusing (AF) means, tracking means, reproduced signal detection means, means to read information in a control data area, a recording medium on which information on a pattern of a dummy signal to be added to at least one of the leading or trailing sides of a recorded information signal is recorded beforehand, means for rotating or moving the recording medium, means for condensing laser beams from the laser beam source on the recording medium, signal modulating means for converting a signal to be recorded into a modulation code, means for adding the dummy signal as set forth herein, recording waveform generation means for generating a recording waveform corresponding to the recording code with the dummy signal added, recording start position control means for shifting a recording start position at random (preferably wherein the maximum shift width of the recording start position, for example, expressed in a unit of Bytes is shorter than the length of the dummy signal expressed in a unit of Bytes), laser driving means for driving the laser beam source in accordance with the recording waveform, means for converting the intensity change of the laser beam reflected from the recording medium into an electrical signal, means for amplifying the reproduced electrical signal, binary conversion means for converting the electrical signal into a binary waveform, means for deleting the dummy signal, and means for decoding the binary signal to make the decoded signal an information signal (user data).

Information recording method for recording a recording signal and a dummy signal added to a leading or/and trailing side of the recording signal


The present invention comprises growth hormone releasing peptides/peptidomimetics (GHRP) capable of causing release of growth hormone from the pituitary. Compositions containing the GHRP's of this invention are used to promote growth in mammals either alone or in combination with other growth promoting compounds, especially IGF-1. In a method of this invention GHRP's in combination with IGF-1 are used to treat Type II diabetes. An exemplary compound of this invention is provided below

GH secretion is known to be inhibited by the hypothalamic hormone somatostatin (SS) and stimulated by GH-releasing hormone (GHRH) in all mammalian species studied including humans. In man, GH is released from the anterior pituitary somatotrophs in pulsatile secretory bursts occurring about 4-8 times in each 24 hour period (Devesa, J., et al., Trends Endocrinol Metab. 3:175-183 [1992] and Mason, W. T., et al., Acta Paediatr Suppl 388:84-92 [1993]). This episodic release pattern seems to be optimal for inducing the physiological effects of GH since many target tissues appear to be more sensitive to the frequency than the total amount of GH arriving at the target tissue (Robinson and Clark Growth Hormone: Basic and Clinical Aspects Isaksson, Binder, Hall and Hokfelt eds., Amsterdam, p109-127 [1987]). It is believed the episodic secretion of GH is caused by the rhythmic alternate release of the excitatory 44-amino acid peptide GHRH and the inhibitory tetradecapeptide SS, regulated through the "pituitary-hypothalamus axis" (see FIG. 1). Secreted GH, in turn, both directly and indirectly through IGF-1 appears to maintain this rhythm by stimulating SS and inhibiting GHRH release. Other neurotransmitters also modulate GH release usually by stimulating or inhibiting SS release. Additionally, other factors including exercise, sleep, glucocorticoids, thyroid hormones (e.g. TSH), sex steroids (e.g. testosterone and 17-β estradiol), free fatty acids, amino acids (e.g. arginine and ornithine), and glucose levels further modulate GH release.
In addition to the two primary endogenous regulators of GH release, SS and GHRH, a number of other peptidyl/nonpeptidyl compounds have been shown to stimulate GH release primarily through the pituitary-hypothalamus axis. These include the peptides galanin, pituitary adenylate cyclase-activation peptide (PACAP), delta sleep-inducing peptide (DSIP), and angiotensin II. These peptides, however, generally lack specificity for GH release. A number of structurally diverse nonpeptidyl GH secretagogues (e.g. Talipexole and Clonidine) are reported to stimulate GH release in vitro and in vivo, but these compounds are believed to mediate their effect through cholinergic, adrenergic, dopaminergic or serotonergic pathways and thus also lack GH releasing specificity.
Apart from GHRH, the GH secretagogues having the greatest GH releasing specificity and thus having the greatest therapeutic potential are the growth hormone releasing peptides/peptidomimetics (GHRP's) (Bowers, J. Pediatr. Endocrinol. 6:21-31 [1993]; and Schoen et al., Annual Reports in Medicinal Chemistry, 28:177-186 [1993]). These compounds can activate the pituitary-hypothalamus axis (Dickson et al., Neuroscience 53:303-306 [1993]) and act directly on the pituitary somatotroph (see FIG. 1) by an independent (non-GHRH, non-opiate and non-SS) secretory pathway. Compounds of this class can therefore be characterized by their independent GH releasing pathway. For example, somatotroph cells maximally stimulated with GHRP's can release additional GH when treated with GHRH and vice versa. Similarly the inhibitory effects of specific antagonists to GHRH or GHRP's have no effect on stimulation of GH release by the opposite secretagogue in vitro. These compounds also exhibit dose-dependent desensitization or attenuation of GH release after continuous exposure with the same or different compounds of the GHRP class. Furthermore, structurally related biologically inactive cognate GHRP compounds capable of inhibiting GH release of a particular GHRP have no effect on GHRH agonism. These effects support the independent pathway model and serve as experimental criteria for compounds belonging to the GHRP class. Surprisingly, while the GHRH receptor has been cloned in a number of species including man (Gaylin et al., Mol. Endo. 7:77-84 [1993], the GHRP receptor has remained elusive.
The paradigm compounds of the GHRP class are the synthetic methionine-enkephalin derived GHRP's identified by Bowers et al., Endocrinology 106:663-667 (1980) and Momany et al., Endocrinology 108:31-39 (1981). The most widely studied GHRP is referred to as "GHRP-6" (Momany et al., Endocrinology 114:1531-1536 [1984]; and Bowers et al., Endocrinology 114:1537-1545 [1984]) which has been shown; to be specific for GH release, has no reported long term toxicity, is well tolerated, and can elevate serum GH in a dose-dependent manner in normal humans (Bowers, J. Pediatr. Endocrinol. 6:21-31 [1993]). GHRP-6 is active in a dose-dependent manner when administered either iv, intranasally or orally, though it is poorly absorbed orally (˜0.3%). More potent second generation hepta- and hexapeptides, "GHRP-1" and "GHRP-2" (also known as KP 102), of this class have been described more recently, though these compounds are also expected to be poorly absorbed orally.

Low molecular weight peptidomimetic growth hormone secretagogues


Projectile fuze setback generator power source apparatuses and methods of use and manufacture are disclosed. An explosive projectile contains a fuze with a setback generator and associated fuze electronics. Upon initiation of projectile launch, the setback generator produces a voltage for use by the fuze electronics during flight. The setback generator includes a magnet maintained in place within a surrounding coil by a fastener. When a projectile is fired, rapid acceleration thereof causes the fastener to break and the magnet to be displaced longitudinally within the surrounding coil, which decreases the magnetic field and induces a current in the surrounding coil. The induced current produces a voltage that is stored in a capacitor operably coupled to the setback generators which then is used to power the fuze electronics during flight.

State of the Art: Electronic fuzing systems for controlling projectile warheads are well known in the art. Conventionally, projectile fuzes contain either a setback generator or a reserve battery to provide power to the fuze electronics during flight. Fuze electronics may include controllers, timing circuitry, and various sensors. Additionally, the fuze electronics may include a safing and arming module to ensure that both the arming and detonation of the projectile occur only at a desired moment.
FIG. 1 illustrates a conventional explosive projectile 60 (also referred to as a warhead). As illustrated in FIG. 1, the explosive projectile 60 includes a fuze 62 and an explosive material 64 encased by a body 66. Fuze 62 may comprise, among other parts, a faze electronics module, a power source, and a safing and arming module.
Reserve batteries, which have commonly been used as a power source for fuze electronics, may include a glass ampoule with electrolytes contained therein. Upon projectile launch, ideally the glass ampoule breaks and the electrolytic fluid flows into a cell stack and produces a battery voltage that powers the fuze electronics.
FIG. 2 illustrates a conventional reserve battery assembly 20 that includes a reservoir 22 with a liquid electrolyte 24 contained therein, and a voltage producing cell stack 26. Upon launch of a projectile, inner and outer drive disks 41, 42, respectively, are moved by the acceleration forces (shown by arrow 25), and, in doing so, reservoir 22 is crushed and the electrolyte 24 is forced into cell stack 26 producing a voltage that powers an electronics module of a projectile fuze during flight. Problems associated with reserve batteries include long delay times for fuze power-up and the use of toxic materials and expensive components. Additionally, the force required to break the glass ampoule may be inconsistent, thus resulting in inconsistent unit-to-unit output energy characteristics.
Setback generators, which are also used as power sources for projectile fuzes, generate a pulse of electricity when a projectile is fired and rapidly accelerates down a launch barrel. The pulse of electricity charges a capacitor and the energy stored in the capacitor is then used to power the fuze electronics.
FIG. 3 illustrates a conventional setback generator 10 that comprises a base cup 27, a top cap 18 and an inner frame 21 that contains a woven coil 23. A magnet 12 fits within inner frame 21 and rests against the base cup 27. The magnet 12 is initially held against the base cup 27 by a thin shear disc 14. Upon the firing of a projectile, setback generator 10 is subjected to a rapid acceleration (shown by arrows 29), which causes magnet 12 to shear through shear disc 14 and move to the right (as the drawing is oriented) until it rests against the top cap 18 of the setback generator 10 assembly. This sudden movement of the magnet 12 causes the magnetic field within the setback generator 10 to decrease, which then induces a current within coil 23. Terminal post 16 conducts the induced current away from the setback generator 10 and a corresponding voltage charges a capacitor, which powers an electronics module of the fuze during flight.
Like reserve batteries, conventional setback generators suffer from high unit-to-unit variances during setback as a result of unpredictable shearing properties of any shear disc design. Conventional setback generators using a shear disc design have high ductility and thickness tolerance properties, which may cause the setback generator to experience effects of friction on the periphery of the magnet against the shear disc edges upon shearing. Additionally, setback generators implementing a shear disc design may also experience plastic deformation and stretching of the discs upon setback, rather than a complete shear of the discs. As a result, the shear disc design suffers from high unit-to-unit output variances during projectile setback. Conventional setback generators also suffer from low energy output as well as from slow response times due to inefficient magnetic circuits. Additionally, conventional setback generators have a high unit product cost due to complex component parts, and lack packaging flexibility within the fuze.
There is a need for methods and apparatuses that simplify, improve the performance of, and increase the speed of setback generators, all while reducing the unit product cost of fuze power sources.

Methods and apparatuses for projectile fuze setback generator power source and projectiles including same


A computer bezel includes a front panel, a power button attached to the front panel; an annular member attached to the front panel and set around the power button; and a protective member for covering the power button. The front panel includes a concave portion defining two slots and two through holes therein, the protective member includes two hooks engaging in the slots for slidably attaching the protective member to the front panel. Two posts formed on the protective member. When each post is in alignment with the corresponding through hole, the protective member is depressed to push the power button.

1. Field of the Invention
The present invention relates to computer bezels, and particularly to a computer bezel having a protective member for protecting power button of the computer bezel from undesired pressing.
2. Description of the Related Art
Many electronic products have bezels attached to their front faces. Any typical product among a variety of electronic products has a variety of controlling buttons attached to its bezel. Each button is for switching on the appropriate controlling circuit of the electronic products when the button is pushed. An example of this means is disclosed in U.S. Pat. No. 6,477,447. However the power button of the computer were exposed to the user. It became apparent that the computer did not provide the required protective to prevent the undesired turning on/off the system. If the computer is undesired shut down, computer systems may experience data damage, data loss, file corruption or hardware damage.
Thus, an improved computer bezel which overcomes the above-mentioned problems is desired.


Synchronization of a time base at a local clock to a reference time. Initially, correction data (e.g., synchronization data) may be derived from packet data received over an asynchronous packet-switched network (e.g., the internet). Correction data derived from the packet data may be used to correct at least a portion of the time base (e.g., a frequency component). In turn, once the time base is corrected (e.g., to better than a predetermined quality threshold), the source of synchronization data may change to an alternate (e.g., more accurate source) such as positioning signals from a positioning system. In this regard, the corrected time base may be used to assist in acquiring such positioning signals to allow for higher accuracy correction. Furthermore, use of the positioning system may allow for correction of a phase of the time base (e.g., to align the phase to the positioning system. In turn, an accurate time base may be utilized (e.g., for location determination using the positioning system) and/or other contexts such as a downstream communication operation. For instance, a device employing the synchronization techniques described herein may be an LTE base station used to facilitate downstream communication with another device by use of the synchronized time base.

In-building devices like LTE base stations, positioning system receivers, VoIP phones, or the like, may need to be time synchronized for optimum performance and capacity. As such, variations in the frequency and/or phase in the time base for such devices may lead to performance degradation or malfunctions. Additionally, the positions of such devices may need to be located without the aid of a human to allow for error-free and autonomous location.
Prior approaches to synchronization of the time of a device such as an LTE base station may include use of network synchronization techniques that rely on communication over a network to which the device is connected. For instance, the precision time protocol (PTP or IEEE 1588) includes a packet system, which provides for time and frequency information derived from an Internet connection. However, PTP does not facilitate location determination. Also, this approach is susceptible to error in output time and frequency in instances of complex network topology (e.g., where there are a lot of Internet switches and routers between the time source and the end device).
In other approaches, use of GNSS signals (e.g., GPS or the like) may be utilized to provide synchronization and/or location determination. However, GNSS signals may be highly attenuated and/or prone to error when the receiver is located within a structure or the like. In turn, such GNSS approaches may be impractical when utilized for receivers located in buildings, especially those devices located deep within a structure. Accordingly, the need persists for approaches to provide highly accurate and precise time base synchronization.


An autonomous vehicle including a communication system in communication with a computing system. The computing system runs computer-executable instructions that may examine a profile of a passenger. The computer-executable instructions may include authenticating between the passenger and the autonomous vehicle through the communication system, such that the authenticating results in a successful authentication of a first audible authentication signal and a second audible authentication signal.

An autonomous vehicle is a motorized vehicle that can operate without a human driver. Conventionally, since the autonomous vehicle lacks a driver, physical human-machine interfaces (HMIs) may be provided to assist a passenger in finding the autonomous vehicle, requesting supporting or information during a ride, and disembarking the autonomous vehicle safely. Exemplary HMIs may include a mechanical push-button, a touch-sensitive display, or the like. While such HMIs are well-suited for a large portion of the population, these HMIs may be sub-optimal for those with vision impairments for a variety of reasons. For example, a person with a visual impairment may have difficulty trying to locate the autonomous vehicle and verifying that the particular vehicle is the correct and/or intended vehicle that the person is looking for. As another example, a visually impaired passenger may have difficulty or concerns during the ride as to the route and direction of the vehicle, in which case such HMIs may lack the ability to provide the visually impaired passenger with desired support or information. Furthermore, upon disembarking from the autonomous vehicle may also prove to be difficult. Without the assistance of a driver to guide the passenger safely out of the autonomous vehicle, such HMIs may be sub-optimal for visually impaired passengers.

Pick-up authentication via audible signals


A drain hose fixing assembly of a dishwasher includes a holder body provided at an outer circumference with at least one hook and an interference preventing rib formed on an inner circumference of the holder body to prevent a drain hose from interfering with the hook.

Generally, a dishwasher is an electronic appliance that can remove waste adhered to dishes by spraying high pressure washing water and dry the dishes.
The washing water is reserved in a sump provided on a lower portion of the dishwasher. After the washing process is finished, the washing water is drained through a drain hose connected to the sump. The drain hose is securely connected to the sump not to be separated from the sump while the dishwasher is carried. That is, when the drain hose is disconnected with the sump, the washing water may overflow to the floor.
The drain hose is connected to the sump by a drain hose fixing assembly. A typical drain hose fixing assembly includes a semi-circular body, a flange formed on a front portion of the body and having a size greater than a sectional area of the body, an upper hook formed on an upper portion of the body to prevent the fixing assembly mounted on a base from moving, and a side hook formed on a side portion of the body.
A washing motor and a heater as well as the drain hose fixing assembly are disposed on the base. The drain hose fixing assembly is inserted in the base such that the flange is oriented toward an inner side of the base and the upper hook is oriented forward an outer side of the base.
The drain hose extends into a space defined by the body. Korean Laid-Open Patent No. 10-2004-0023108 discloses such a drain hose fixing assembly, detailed description of which will be omitted herein.
In the prior drain hose fixing assembly, an upper-outer circumference of the drain hose maintains contacting the upper hook. Therefore, in the course of inserting the upper hook into the base, as a result of which the drain hose may be damaged by being depressed by the upper hook. Same results may be incurred in the course of inserting the side hook into the base.
Furthermore, since a diameter of a hole formed on the body is too small to use a variety of drain hoses different in a size and a shape.
In addition, when the side hook is inserted in the base, the side surface of the body must be bent, thereby causing excessive force is consumed for mounting or removing the fixing assembly on or from the base.

Dish washer and drain hose fixing assembly thereof


In some embodiments, an adapter is configured to couple an electrical component to a slot in a host device. The electrical component can have at least three sides. The adapter including: (a) a first housing piece configured to be coupled to two or more sides of the at least three sides of the electrical component when the adapter is coupled to the electrical component; and (b) a second housing piece coupled to the first housing piece and configured to couple to a first side of the at least three sides of the electrical component. When the adapter is coupled to the electrical component, a portion of the second housing piece can be configured to be located inside the slot in the host device along with the electrical component. When the adapter is coupled to the electrical component and the portion of the second housing piece is located inside the slot in the host device, the first housing piece can be located outside of the slot. Other embodiments are disclosed in this application.

The ExpressCard standard provides a method and standard interface for creating a direct connection between an electrical component and a system bus in a computer. The ExpressCard standard provides for electrical components with two widths: 54 millimeter and 34 millimeters. Both the 34 millimeter ExpressCards and 54 millimeter ExpressCards use the same type of connector to couple to the system bus. That is, both the 34 millimeter and 54 millimeter ExpressCards each have 26-pin beam-on-blade connectors. Accordingly, 34 millimeter ExpressCards can be plugged into 54 millimeter ExpressCard slots.
Many computer manufacturers provide only 54 millimeter ExpressCard slots in their computers because users can plug either size of ExpressCard into the 54 millimeter ExpressCard slots. However, when a user places a 34 millimeter ExpressCard inside of a 54 millimeter ExpressCard slot, the 34 millimeter ExpressCard can wobble and can easily become dislodged from the 54 millimeter ExpressCard slot. A gap also exists in the slot because the 34 millimeter ExpressCard is smaller than the slot. Foreign particles or other items can enter the computer case through this gap and potentially damage the ExpressCard or the computer.
Accordingly, a need exists for an adapter for the 34 millimeter ExpressCard that helps secure the 34 millimeter ExpressCard to the 54 millimeter ExpressCard slot and that prevents foreign particles or other items from entering the slot when the 34 millimeter ExpressCard is inside the 54 millimeter ExpressCard slot.
For simplicity and clarity of illustration, the drawing figures illustrate the general manner of construction, and descriptions and details of well-known features and techniques may be omitted to avoid unnecessarily obscuring the invention. Additionally, elements in the drawing figures are not necessarily drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve understanding of embodiments of the present invention. The same reference numerals in different figures denote the same elements.
The terms "first," "second," "third," "fourth," and the like in the description and in the claims, if any, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "include," and "have," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of elements is not necessarily limited to those elements, but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
The terms "left," "right," "front," "back," "top," "bottom," "over," "under," and the like in the description and in the claims, if any, are used for descriptive purposes and not necessarily for describing permanent relative positions. It is to be understood that the terms so used are interchangeable under appropriate circumstances such that the embodiments of the invention described herein are, for example, capable of operation in other orientations than those illustrated or otherwise described herein. The term "on," as used herein, is defined as on, at, or otherwise adjacent to or next to or over.
The terms "couple," "coupled," "couples," "coupling," and the like should be broadly understood and refer to connecting two or more elements or signals, electrically and/or mechanically, either directly or indirectly through intervening circuitry and/or elements. Two or more electrical elements may be electrically coupled, either direct or indirectly, but not be mechanically coupled; two or more mechanical elements may be mechanically coupled, either direct or indirectly, but not be electrically coupled; two or more electrical elements may be mechanically coupled, directly or indirectly, but not be electrically coupled. Coupling (whether only mechanical, only electrical, or both) may be for any length of time, e.g., permanent or semi-permanent or only for an instant.
"Electrical coupling" and the like should be broadly understood and include coupling involving any electrical signal, whether a power signal, a data signal, and/or other types or combinations of electrical signals. "Mechanical coupling" and the like should be broadly understood and include mechanical coupling of all types.
The absence of the word "removably," "removable," and the like near the word "coupled," and the like does not mean that the coupling, etc. in question is or is not removable. For example, the recitation of a first portion being coupled to a second portion does not mean that the first portion cannot be removed (readily or otherwise) from, or that it is permanently connected to, the second portion.

Adapter configured to couple electrical component to slot in host device


Described is a method of manufacturing a self-aligned interlayer contact in a semiconductor device. To carry out the etching process of the conducting material easily and to minimize the space occupied by the contact, the invention uses the following steps: a field oxide layer and a source/drain electrode are formed on a semiconductor substrate; then, a first interlayer insulating layer is formed over the substrate and, over it, a bit line is formed; then, a second interlayer insulating layer and a charge storage electrode contact mask are formed over the entire structure; then, the insulating layer on upper part of the bit line that had been exposed by the charge storage electrode contact mask is completely etched, and, for other parts, an insulating layer having a certain thickness is left on the upper part of the source/drain electrode; then, a charge storage electrode contact is formed on the source electrode and the side wall of the bit line is exposed on the side wall of the charge storage electrode contact; finally, an insulating layer for spacers is formed on the side wall of the bit line to expose the source/drain electrode in order to form a charge storage electrode.

In the manufacture of a semiconductor device, several contacting process are required. For example, in the semiconductor device in which a first conducting line, a first interlayer insulating layer, a second conducting line, a second interlayer insulating layer and a third conducting line are formed sequentially, it is often the case that said third conducting line is connected to the first conducting line after passing through the second conducting line. In this case, in order to insulate the first and third conducting lines from the second conducting line, contact areas for the third conducting line and the first conducting line must maintain a certain distance from the second conducting line. Accordingly, contact masks for the third conducting line and the second conducting line must follow a certain design rule during the manufacturing process. That is, in the design of the third conducting line contact mask that is used to contact the third conducting line to the first conducting line, the contact for the third conducting line must maintain a certain distance from the second conducting line. Therefore, since the registration, critical dimension variation, misalignment tolerance and lens distortion generated during the masking process, as well as the thickness of insulation layer between the third conducting layer contact and the second conducting layer must be considered carefully, the size of the contact increases. Accordingly, the problem of increased space caused by the requirement to maintain a certain distance between the third conducting line contact mask and the second conducting line mask is solved by a self-aligned contact forming method. As a result, the space occupied by the contact is reduced as the distance between the third conducting line contact mask and the second conducting line mask are decreased. However, if the conventional self-aligned contact forming method is used, a vertical topological difference becomes so great that etching away the conducting material for the third conducting line becomes a difficult process. Also, the other conventional method that tries to solve this problem restricts the amount of space to be reduced.
FIG. 1 is a plane view of the semiconductor device during the forming of the self-aligned contact. For the sake of convenience, only a charge storage electrode contact C, bit line B, and source/drain electrode A are illustrated.
FIG. 2A through FIG. 2D are cross sectional views shown along I--I of FIG. 1 that illustrate the manufacturing steps of the semiconductor device using a conventional self-aligned method. As shown in FIG. 2A, a field oxide layer 2 is formed on certain part of the semiconductor substrate 1 and a source/drain electrode 3 on the active area. After that, a first interlayer insulating layer 4, conducting material 5 for bit lines, and a second interlayer insulating layer 6 are formed sequentially.
Next, as shown in FIG. 2B, said second interlayer insulating layer 6, conducting material 5 for bit lines, and the first interlayer insulating layer 4 are etched sequentially using a bit line mask to form a bit line 5'. Then, an insulating layer 7 for side wall spacer is formed on the side wall of said bit line 5' for insulation purpose. Then, a photoresist layer is coated to form a charge storage electrode contact mask 8. FIG. 2B shows that the charge storage electrode contact mask 8 is misaligned as much as the distance created while the masking process. Therefore, said charge storage electrode contact mask 8 does not cover the bit line 5' completely.
As shown in FIG. 2C, the insulating layer 7 for a spacer is etched to a certain thickness using the charge storage electrode contact mask 8 to expose the source/drain electrode 3 so that insulation layers 6 and 7' is left on top and side wall of the bit line 5' for insulation purpose. And then, a conducting material 9 for a charge storage electrode is formed over the entire structure and a charge storage electrode mask 10 is formed. The figure shows a drastic topological difference caused by the above-said first interlayer insulating layer 4, bit line 5', and the second interlayer insulating layer 6. Also, it indicates the part 40 where the most drastic topological difference may take place during etching the conducting material 9 for the charge storage electrode.
FIG. 2D is a cross sectional view illustrating the forming of a charge storage electrode 9' by etching the conducting material for the charging storage electrode using the charge storage electrode mask 10. As shown in the figure, residual 49 of the conducting material is left on the part experiencing a great topological difference caused by said first interlayer insulating layer 4, the bit line 5', and the second interlayer insulating layer 6. The residual 49 may the other conducting lines during the later processes, causing defects in semiconductor device.
As described so far, when the conventional method of forming the self-aligned contact is used, occurrence of a great topological difference becomes a serious problem.
FIG. 3A through FIG. 3C are cross sectional views shown along I--I of FIG. 1 that illustrate the manufacturing steps of the semiconductor device in accordance with another conventional method. This method has decreased the topological difference so that the conducting material for the charge storage electrode can be etched more easily.
Referring to FIG. 3A, a field oxide layer 2 is formed on a certain part of the substrate 1 of the semiconductor device. Then, a first interlayer insulating layer 4 and a bit line 5' are formed after forming a source/drain electrode 3. Next, a second interlayer insulating layer 16 is formed and flattened. Then, a photoresist layer is coated to form a contact mask 8 for the charge storage electrode. FIG. 3A shows that said charge storage electrode contact mask 8 is misaligned and does not cover the bit line 5' completely.
FIG. 3B is a cross sectional view that illustrates the following: the source/drain electrode 3 is exposed by etching the second interlayer insulating layer 16 and the first interlayer insulating layer 4 using said charge storage electrode contact mask 8; then, an insulating layer 17 for spacers is formed on the entire side wall of the bit line 5'.
As shown in the figure, the bit line 5' is misaligned as much as the distance created during the masking process so that some of the upper part and side wall of the bit line 5' is exposed as much as the part not being covered with said charge storage electrode contact mask 8 when the insulating layers 16 and 4 are etched. If the insulating layer 17 for said spacers is thicker than the exposed part of the upper part of said bit line 5', the contact area to be formed on the source/drain electrode 3 is decreased, making the contact with the charge storage electrode difficult. If said insulating layer 17 is less thick than the exposed part, a side wall 50 on the upper part of said insulating layer 17 for spacers will be located on the same vertical plane as the side wall of the exposed bit line 5' will be.
FIG. 3C is a cross sectional view illustrating the forming of the insulating layer spacer 17' on the side wall of said bit line 5' by etching back said insulating layer 17 for spacers. It should be noted that said insulating layer 17 for spacers is less thick than the exposed part of the upper part of said bit line 5', the exposed side wall of said bit line 5' is insulated by the said insulating spacer 17'. However, its top part 50' is not insulated by the insulating spacer 17', causing a short between the charge storage electrode and the bit line in later processes. The prevent this from occurring, the interval between the bit lines of the charge storage electrode contact mask should be reduced to a certain point and no more. If the above described another conventional method is applied, the conducting material for a charge storage electrode can be easily etched due to an improvement in the topological difference. However, it restricts the contact area to be reduced.

Method of manufacturing a self-aligned interlayer contact in a semiconductor device

Hyundai Electronics Industries Co., Ltd.


A manufacturing method for mainly embedding the passive device structure in the printed circuit board is presented. In this structure, both the source electrode and the ground electrode of the passive device belong to the same level, and includes several source branches and several ground branches that are formed vertically on the inside of the dielectric layer of the circuit board which are connected, respectively, to avoid the conducting between the source electrode and the ground electrode during lamination. When it is in the form of the capacitor structure, through the use of the ultra-fine wiring technique, these source branches and ground branches are separated by a small gap between each other. Therefore, the side face area and quantities of the source branches and ground branches are both increased.

1. Field of the Invention
The present invention relates generally to an embedded passive device structure and manufacturing method thereof, and in particular, to an embedded passive device structure of higher electric value (such as, for example, capacitance) and manufacturing method thereof.
2. The Prior Arts
The so-called embedded passives or embedded passive devices, through using the thin core manufacture of the multilayer PCB, the etching or the printing processes are thereby carried out. And then the capacitors or the resistors are manufactured on the thin core directly. When after being laminated to become the multilayer PCB, the discrete passive devices which are welded on top of the board during assembly fabrication are thereby replaced, so as to save on board space for use by the active devices and their corresponding circuits.
The embedded, implanted or the buried technology which is started by the Ohmega-ply Company uses the matte side of the original copper-cladding on the innerlayer surface, and performs processing of the nickel phosphorus alloy layer at the upper thin film layer, which is regarded as the resistive element, and lamination to form the thin core. Then, the photoresist technology is used twice, as well as performing etching three times to form the required film "resistor" on a specific designated position. Because the above resistor is embedded inside the thin core, it is commonly known also as a Buried Resistor (BR).
Thereafter, in 1992, a PCB manufacturer in the U.S.A named Zycon® adds in an extremely thin (2-4 mil) dielectric layer as the thin core at the upper layers inside the multilayer PCB, which is outside of the original Vcc/GND thin core, and uses the vast area of the parallel copper sheet/foil of the thin core for manufacturing an integrated capacitor, with the tradename of Buried Capacitor™ (BC). It has advantages such as interference reduction, offering more charge capacity, and providing steady voltage while operating under fundamental frequencies. Zycon® Company had applied for several patents relating to the BC (namely, the U.S. Pat. Nos. 5,079,069, 5,161,086, and 5,155,655).
Generally, if needed to improve the capacitance of the capacitor in a case of under a stable voltage condition, other than the adoption of a high-k dielectric layer, a larger area of the source electrode, and of the ground electrode are also adopted. In other words, the source electrodes and ground electrodes should be as close to each other as possible. However, if the embedded capacitor structure from the Zycon® Company, were adopted because of the desire to adopt the ultra thin substrate, the manufacturing process is thereby difficult, and the yield is lower at the same time. Inside this capacitor structure, the source electrode, the ground electrode, and the dielectric layer are sequentially stacked. In addition, for achieving higher capacitance, the ground electrode and the source electrode are already very much close to each other. Thereafter, during the lamination process, because of the ease of exerting force upon the upper layers of the source or ground electrodes, it is conceivable to be able to embed some of the source electrodes or the ground electrodes into the dielectric layer, so as to make the source electrode and the ground electrode to form contact with each other, thereby resulting in fabricating the bad products. Although the conventional manufacturing technology was already dramatically improved upon by using the Zycon® method, however, under the general design criteria, the thickness of the dielectric layer at the minimum remains to be at 12 μm. As for adopting the high-k resin, the difficult part lies within the difficulty to control the final thickness during lamination after the printing steps, and to require to be using the copper sheet having low profile to avoid the problem of producing cohesion at the same time, such method is to make the reliability of the circuit board being put to the test.

Manufacturing method of the embedded passive device


A wheeled vehicle includes wheels. A frame supports the wheels. First and second covers cover the wheels or the frame. The first cover includes first, second and third openings. The openings are preferably slots. The respective openings are arranged to form a triangle. The second cover includes first, second and third projections corresponding to the first, second and third openings of the first cover, respectively. The first, second and third projections are inserted into the associated first, second and third openings to couple the second cover with the first cover.

1. Field of the Invention
The present invention relates to a wheeled vehicle with covers, and more particularly to a wheeled vehicle having covers that cover a frame of the vehicle.
2. Description of Related Art
Wheeled vehicles such as, for example, motorcycles, scooters and mopeds typically include a frame that supports wheels, an engine, a seat and other components. Typically, the scooters and mopeds include multiple covers that cover the frame. Some of the covers are directly attached to the frame, while other covers are coupled together and are indirectly attached to the frame through the covers that are directly attached to the frame. For example, Japanese Patent No. 3406159 and Japanese Patent Publications No. 04-331686 and No. 10-67365 disclose coupling strutures of such cover to a frame or to another cover.
In the coupling structure disclosed in Japanese Patent Publication No. 10-67365, a cover is coupled to another cover. The former cover includes engaging pieces, while the latter cover includes slots into which the respective engaging pieces are inserted. Because the engaging pieces are relatively small and fragile, if the former cover receives a force that rotates the engaging pieces about an axis of each engaging piece, the engaging pieces can be easily broken.


A method for using a root rope for planting root material includes disposing onto a bed of soil a root rope. The root rope includes root material, a carrier line onto which the root material is disposed, and wrapping material wrapped around the root material and the carrier line to secure the root material to the carrier line, forming an elongate rope.

The present invention relates generally to a method of planting, and more specifically to a method of planting root material from suckering or runner-producing plants, for example, plants of the genus Rubus.
The disclosed method and apparatus relates generally to the planting of raspberry, blackberry and other species and hybrids in the Rubus genus, as well as asparagus, strawberries, or other suitable plants, and more specifically to methods of planting suckering plants, or plants producing runners, where the plant develops from planting of root material, as opposed to seeds, whole plants, or other planting methods. While the present invention has application to other species and hybrids, particularly in the Rubus genus, but among other suckering plants, as well as those producing runners, because of the broad application of the present application to raspberries in particular, the term "raspberries" will be used in this disclosure with the understanding that the claimed method and apparatus are applicable to those other plants, species and hybrids, notwithstanding the specific reference to raspberries.
Raspberries are a small-fruit crop produced by large and small scale farming operations. Initial investment for raspberry farming is high, primarily a result of the costs associated with land preparation, planting, and installation of trellis and irrigation systems. Raspberry cultivars readily produce new shoots from the roots, in a planting process called "suckering." New plantings are established by taking advantage of the plants' ability to produce these suckers. As the plants go dormant in the fall they are harvested and the harvested roots are used to produce subsequent plantings. Future planting can be established using the roots only or by using a complete plant consisting of the roots, the crown and a portion of a stem. In either style of planting, (root only or root, crown & stem), large amounts of hand labor are expended to sort, clean, package, warehouse and replant the root material. Of these, the planting process consumes the largest amount of labor.
The current state of the art for replanting raspberry roots consists of the following operations: (1) preparing the harvested crop for cold storage; (2) cleaning, sorting and packaging; and (3) prior to planting, preparing the fields to receive the roots. This last step involves multiple operations using specialized ground-working equipment to create a defined bed top with longitudinal grooves in the surface of the bed-top. These grooves are designed to receive the root plantings.
Once the bed has been prepared, the plants are removed from cold storage and transported to the field immediately prior to planting. The roots are unpacked and weighed into totes that are then placed along the bed top at spacings which will yield the desired plant density. Laborers then separate the bunches of roots and lay them by hand into the grooves atop the bed. Finally, specialized ground-working equipment is used to cover the roots with an even layer of soil. It should be mentioned that the previously described process is more art than science. Many variables can affect the quality and success of the finished plantings, such as soil and weather conditions, and the availability of skilled laborers to perform the planting and tractor work. A few acres planted in this fashion create a stressful fast paced operation that must be overseen by a skilled supervisor to insure that the work is done correctly. Large plantings of 100 acres or greater are even more problematic and are labor intensive undertakings. Management, logistical and labor costs are extremely high, cumulatively requiring 100+ man-hours per acre planted.
In another aspect of the invention, the root material is derived from suckering plants, plants producing runners, or a combination of the two.
In another aspect of the invention, the root material is taken from raspberries, strawberries, asparagus, or combinations of these.

Root rope for planting plant root material, and method of use