A data processing system includes a readout unit, a device ID storage unit, a storage medium writing unit, a determination unit, and a processing unit. The readout unit reads out data that have been stored on a storage medium, where the storage medium is removably mounted in an external storage unit. The device ID storage unit stores a device ID that is peculiar to a device. The storage medium writing unit writes the device ID that has been stored in the device ID storage unit to the storage medium. The determination unit makes a determination as to whether the device ID that has been written to the storage medium and the device ID that has been stored in the device ID storage unit are in agreement. The processing unit carries out either first processing or second processing depending on a determination made by the determination unit.

1. Field of the Invention
Embodiments of the present invention relate to a data processing system and method and, in particular embodiments, to a data processing system and method with which it is possible to prevent programs or data from being used illegally.
2. Related Art
In the past, the storage media on which programs and data have been stored were mounted in a data processing system, the programs and data were read out, stored on a hard disk and the like, and utilized. Those programs and data were ones that added capabilities to the data processing system or improved the capabilities of the data processing system.
However, there have been problems in that the storage media on which the programs and data have been stored could be obtained by borrowing the media from another person and the like and illegally copying the programs and data to the hard disk of the data processing system and utilizing them. In other words, there are copyrights for programs and data, and only those who have legally obtained the programs and data by purchasing them and the like may legally use them. Borrowing the programs and data from other people and copying them is unlawful, but, in actuality, they are used illegally.
Therefore, in an attempt to prevent illegal use, restrictions with respect to use have been added, but the restrictions have caused the programs and data to become substandard with regard to convenience of use.

Data processing system and method with copy protection


A projectile propelling system includes a gun barrel filled with a gaseous propulsive mixture, a projectile having a front cone wall and a rear cone wall, and a driver for initially propelling the projectile in the gun barrel to an initial velocity above the detonation velocity of the gaseous propulsive mixture to produce a shock wave at the front cone wall followed by a detonation wave resulting from the reflection of the shock wave inside the barrel, which detonation wave is applied to the rear cone wall to increase the velocity of the projectile. The front cone wall and rear cone wall of the projectile are such as to create a "mach stem" in the form of a disc normal to the longitudinal axis of the projectile, of sufficiently high pressure and temperature to ensure ignition of the gaseous propulsive mixture.

The present invention relates to a projectile propelling system and particularly to the RAM accelerator type of projectile propelling system.
The RAM accelerator is a recent type of projectile propelling system for accelerating heavy projectiles to hyper velocities in the range of 10 Km/s. It is based on a continuous combustion or detonation of a gaseous propulsive mixture in a gun. The gun barrel is prefilled with the mixture, and the projectile is propelled into the gun barrel and the gaseous propulsive mixture after the projectile has been accelerated by a conventional launcher, such as a light gas gun or a powder gun. The projectile is shaped in a special manner so that the flow around it creates the necessary conditions for the mixture to be detonated. The thrust is produced by the action of the high pressure of the expanding combustion or detonation products on the rear part of the projectile.
More particularly, in the RAM accelerator propelling system the driver propels the projectile in the gun barrel to an initial velocity above the detonation velocity of the gaseous propulsion mixture within the gun barrel to produce a shock wave at a front cone wall of the projectile, followed by a detonation wave applied to the rear cone wall of the projectile. The detonation wave results from the reflection of the shock wave at the barrel wall and, when applied to the rear cone wall, increases the velocity of the projectile.
This type of projectile propelling system is described in the literature, for example in Hertzberg, A, Bruckner, A. P. and Bogdanoff, D. W.: "The RAM Accelerator: A New Chemical Method of Achieving Ultrahigh Velocities", Proceedings of the 37th Meeting of the Aeroballistic Range Association, Quebec, September 1986. In the analysis given by the authors, the acceleration process comprises three main stages: (1) a preliminary acceleration stage by a conventional gun (0-0.7 Km/s); (2) an intermediate acceleration stage via a subsonic combustion process (0.7-2 Km/s); and (3) a final acceleration stage, involving detonation of the propulsive mixture.
The position of the reflected detonation wave is of critical importance to the efficiency of the RAM accelerator type projectile propelling system. Thus, if the detonation wave impinges the projectile forwardly of the rear cone wall, the high pressure of the detonation products will contribute to a drag force and will thus reduce the net thrust. On the other hand, if the detonation wave impinges the projectile too much rearwardly of the rear cone wall, then only a fraction of the rear cone area will be exposed to the high pressure gases, thereby reducing the thrust produced by the detonation wave. A difficulty in the RAM accelerator propelling system is the problem of effecting ignition of the mixture at the reflection point of the nose shock wave to obtain thrust, because this occurs only in a narrow range of projectile velocities in the conventional RAM accelerator system.


An apparatus and method for use in performing ablation or coagulation of organs and other tissue includes a metallized fabric electrode array which is substantially absorbent and/or permeable to moisture and gases such as steam and conformable to the body cavity. Following placement of the ablation device into contact with the tissue to be ablated, an RF generator is used to deliver RF energy to the conductive regions and to thereby induce current flow from the electrodes to tissue to be ablated. As the current heats the tissue, moisture (such as steam or liquid) leaves the tissue causing the tissue to dehydrate. Suction may be applied to facilitate moisture removal. The moisture permeability and/or absorbency of the electrode carrying member allows the moisture to leave the ablation site so as to prevent the moisture from providing a path of conductivity for the current.

Ablation of the interior lining of a body organ is a procedure which involves heating the organ lining to temperatures which destroy the cells of the lining or coagulate tissue proteins for hemostasis. Such a procedure may be performed as a treatment to one of many conditions, such as chronic bleeding of the endometrial layer of the uterus or abnormalities of the mucosal layer of the gallbladder. Existing methods for effecting ablation include circulation of heated fluid inside the organ (either directly or inside a balloon), laser treatment of the organ lining, and resistive heating using application of RF energy to the tissue to be ablated.
U.S. Pat. No. 5,084,044 describes an apparatus for endometrial ablation in which a bladder is inserted into the uterus. Heated fluid is then circulated through the balloon to expand the balloon into contact with the endometrium and to ablate the endometrium thermally. U.S. Pat. No. 5,443,470 describes an apparatus for endometrial ablation in which an expandable bladder is provided with electrodes on its outer surface. After the apparatus is positioned inside the uterus, a non-conductive gas or liquid is used to fill the balloon, causing the balloon to push the electrodes into contact with the endometrial surface. RF energy is supplied to the electrodes to ablate the endometrial tissue using resistive heating.
These ablation devices are satisfactory for carrying out ablation procedures. However, because no data or feedback is available to guide the physician as to how deep the tissue ablation has progressed, controlling the ablation depth and ablation profile with such devices can only be done by assumption.
For example, the heated fluid method is a very passive and ineffective heating process which relies on the heat conductivity of the tissue. This process does not account for variations in factors such as the amount of contact between the balloon and the underlying tissue, or cooling effects such as those of blood circulating through the organ. RF ablation techniques can achieve more effective ablation since it relies on active heating of the tissue using RF energy, but presently the depth of ablation using RF techniques can only be estimated by the physician since no feedback can be provided as to actual ablation depth.
Both the heated fluid techniques and the latest RF techniques must be performed using great care to prevent over ablation. Monitoring of tissue surface temperature is normally carried out during these ablation procedures to ensure the temperature does not exceed 100° C. If the temperature exceeds 100° C., the fluid within the tissue begins to boil and to thereby produce steam. Because ablation is carried out within a closed cavity within the body, the steam cannot escape and may instead force itself deeply into the tissue, or it may pass into areas adjacent to the area intended to be ablated, causing embolism or unintended burning.
Moreover, in prior art RF devices the water drawn from the tissue creates a path of conductivity through which current traveling through the electrodes will flow. This can prevent the current from traveling into the tissue to be ablated. Moreover, the presence of this current path around the electrodes causes current to be continuously drawn from the electrodes. The current heats the liquid drawn from the tissue and thus turns the ablation process into a passive heating method in which the heated liquid around the electrodes causes thermal ablation to continue well beyond the desired ablation depths.
Another problem with prior art ablation devices is that it is difficult for a physician to find out when ablation has been carried out to a desired depth within the tissue. Thus, it is often the case that too much or too little tissue may be ablated during an ablation procedure.
It is therefore desirable to provide an ablation device which eliminates the above-described problem of steam and liquid buildup at the ablation site. It is further desirable to provide an ablation method and device which allows the depth of ablation to be controlled and which automatically discontinues ablation once the desired ablation depth has been reached.

Moisture transport system for contact electrocoagulation


The present application discloses methods for the production of organic compounds comprising a linear series of five fused carbon rings. Such compounds are useful in the production of electronic components, devices and materials. For example the methods disclosed permit the production of 2,9- and 2,10-disubstituted pentacene compounds that present particularly advantageous properties for the manufacture of semiconductor materials, and may be used in devices such as for example thin film transistors and solar cells. Also disclosed are compounds that are excellent candidates for use in the manufacture of semiconductor materials, and other components of electronic systems, by virtue of their solubility, crystal packing geometries, and electronic properties.

Semiconductors are materials that have electronic properties between electrical insulators and electrical conductors. The efficiency of a semiconducting material is determined by how easily the electrons and electron 'holes' can move through the material—i.e. the electron and hole mobilities (μe or μh). Highly conjugated organic compounds have overlapping atomic orbitals that form valence and conducting bands similar to metals. Organic semiconductors do not have the same electron or hole mobilities as single-crystalline silicon, but they are advantageous during fabrication as solution processing techniques such as lithography can be used.
Silicon and gallium arsenide semiconductors, silicon dioxide insulators, and metals such as aluminum and copper have dominated the semiconductor industry for many years. More recently, however, organic thin-film transistors (OTFTs) have presented an alternative to the traditional thin-film transistors based on inorganic materials. For example, research efforts have focused on linear acenes (including tetracene and pentacene), thiophene oligomers (including α-sexithiophene), regioregular polythiophenes, copper phthalocyanines and naphthalenebisimides as candidates for organic semiconductors (Katz H. E. et al. Acc Chem Res (2001), 34, 359). Of these, pentacene exhibits the best electron and hole mobilities. Charge-carrier mobility values of 1.5 cm2V−1s−1, on/off current ratios greater than 108, and sub-threshold voltages of less than 1.6 V have been reported for pentacene-based transistors. Therefore, the charge-carrier mobility values for pentacenes are comparable or even superior to those of amorphous silicon-based devices.
A rapid two-step synthesis for pentacene was reported in 1972, as shown in Scheme 1, and pentacene was found to be both light and air sensitive (Goodings E. P. et al. J Chem Soc, Perkin I (1972), 1310). However, more problematic is the virtual insolubility of pentacene in common organic solvents, thereby preventing solution-based processing (Mayer zu Heingdorf F.-J. et al. Nature (2001) 412, 517). As a result, pentacene must generally be deposited from the vapor phase by vacuum sublimation in order to achieve maximum performance. The vacuum sublimation method, however, requires expensive equipment and lengthy pump-down cycles.
Scheme 1: Synthesis of Pentacene
Another disadvantage of pentacene relates to its polymorphic nature, which can have a detrimental influence upon the performance and reproducibility of pentacene-based devices. The alignment or structural order of the pentacene molecules differs for each polymorph or crystallographic phase, and this structural order determines the electronic properties of the device. The crystallographic phase adopted by pentacene depends on the method and conditions under which the crystals are formed. For example, when pentacene is vapor-deposited onto a substrate, a thin film phase is formed. This thin film phase is more effective at transporting charge than pentacene's bulk or single crystal phase, but it is meta-stable. For example, the thin film form of pentacene can be converted to the bulk phase by exposure to solvents such as isopropanol, acetone or ethanol.
More recently, substituted pentacene compounds have been developed that are more soluble in organic solvents, exhibit regular crystal packing, and are better suited for organic processing. For example, corresponding international patent publications WO03/028125, and WO03/027050, both published Apr. 3, 2003 and which are incorporated herein by reference, disclose substituted pentacene compounds and methods for their preparation. The substitutions include electron-donating groups and halogen atoms. Such petancene compounds are, at least in preferred embodiments, suited for use in organic semiconductor materials. Particularly useful semiconductor compounds include 2,9- and 2,10-disubstituted pentacenes, which are predicted to exhibit excellent solubility, solid-state packing and Σ-orbital overlap (Anthony, J. E. et al. J Am Chem Soc (2001), 123, 9482; Anthony J. E. et al. Org Lett (2002) 4, 15).
To date, the production of 2,9- and 2,10-disubstituted pentacenes has been difficult to achieve. International patent publication WO03/027050 discloses a method for preparing pentacene derivatives comprising the step of cyclizing at least one substituted bis(benzyl)phthalic acid to form the corresponding substituted pentacenedione by using an acid composition comprising trifluoromethanesulphonic acid, wherein the bis(benzyl)phthalic acid is selected from:
each R representing an electron-donating group, a halogen atom, or a hydrogen atom. In preferred embodiments, the method is suitable for generating a 2,9- or 2,10-disubstituted pentacene 5,7 or 5,12-dione, which can undergo reduction and dehydration to generate the corresponding disubstituted pentacene.
There remains a continuing need to develop novel pathways for the production of compounds comprising a linear series of five fused carbon rings, such as for example 2,9- and 2,10-disubstituted pentacene compounds, and corresponding pentacene derivatives. Moreover, there remains a need to develop methods that are better suited for large-scale production of a broad range of pentacene derivatives, and other compounds comprising a linear series of five fused carbon rings, within minimal cost. New pathways are desired to present opportunities to develop new classes of pentacene derivatives, for example with alternative substitutions either on the A and E rings, or the other rings of the five fused carbon ring core structure.

Compounds comprising a linear series of five fused carbon rings, and preparation thereof


A semiconductor integrated circuit includes a semiconductor chip body, a plurality of input/output cells arranged on a surface of the semiconductor chip body at parts including a peripheral part and a central part the semiconductor chip body, and at least an internal logic circuit provided on the semiconductor chip body. Each of the input/output cells include a pad and a holding circuit coupled to the pad for holding incoming data. A plurality of holding circuits are coupled in series in a test mode to form a scan path circuit. The input/output cell which has the pad for receiving an external test signal in a test mode is arranged at the peripheral part of the semiconductor chip body, and the test data held in the holding circuit of the input/output cell which is arranged at a part other than the peripheral part of the semiconductor chip body is transferred to the internal logic circuit in the test mode.

The present invention generally relates to semiconductor integrated circuits, and more particularly to a semiconductor integrated circuit having a scan path circuit which uses a scan-in/out system.
Semiconductor technology has developed considerably over the recent years, and the integration density of semiconductor integrated circuits such as large scale integrated circuits (LSIs) and very large scale integrated circuits (VLSIs) has improved. Due to the increase in the integration density of the semiconductor integrated circuits, the number of terminals for data input/output has increased, and the number of input/output cells for data input/output has also increased. For this reason, it is impossible to secure the required number of input/output cells by the method of arranging the input/output cells only in a peripheral part of a chip of the semiconductor integrated circuit, and the input/output cells are now being arranged on the entire surface of the chip of the semiconductor integrated circuit. However, when the input/output cells are arranged on the entire surface of the chip, it is difficult to carry out a test which uses a prober.
On the other hand, as the integration density of the semiconductor integrated circuit increases, it becomes more and more difficult to make a diagnosis regarding whether or not the semiconductor integrated circuit operates as originally designed. As a result, there is a problem in that the cost involved in testing the semiconductor integrated circuit increases. Accordingly, there are demands to realize a semiconductor integrated circuit which can facilitate the test and reduce the cost involved in testing the semiconductor integrated circuit.
In the LSI production process, it is necessary to confirm the performance of the LSI. The test which is carried out to confirm the performance of the LSI can generally be divided into a test which is carried out at the development stage and a test which is carried out at the mass production stage. As the circuit test which is carried out at the mass production stage, there is a wafer probing test which is carried out at the end stage of the wafer process in order to reduce the defective chip mixture rate to the assembling process.
According to the wafer probing test, tip ends of needles 14 of the prober (not shown) make contact with corresponding pads 15 of input/output cells 11 which are arranged on an LSI chip 10 as shown in FIG. 1, and the electrical characteristics of the LSI chip 10 are checked by use of a signal generator, a waveform analyzer and the like which are coupled to the prober. As a result, it is possible to check not only the operation of the LSI chip 10 but also the transmission delay time, the rise time, the fall time and the like of signals. The LSI chip 10 which is found to be defective as a result of this wafer probing test is automatically marked as a defective chip and is excluded from the subsequent assembling process. Hence, the chips which are found to be defective after the assembling process are only those which are generated in the assembling process, and it is possible to considerably improve the production yield and production cost of the LSI.
Conventionally, the integration density of the LSI chip 10 is not extremely high and the number of input/output cells 11 is not extremely large. For this reason, the input/output cells 11 are provided at the outer peripheral end region of the LSI chip 10, that is, at the peripheral part of the LSI chip 10. Accordingly, it was sufficient to arrange the prober needles 14 which are required for the wafer probing test only at the peripheral part of the LSI chip 10.
But recently, due to the improved integration density of LSIs, it has become necessary to arrange the input/output cells for data input/output also at the inner part of the LSI chip. In order to carry out the wafer probing test similarly to the conventional case described above, it is necessary to arrange the prober needles 14 which are required for the wafer probing test so as to make contact with the pads 15 of all of the input/output cells 11 within an LSI chip 10A, as shown in FIG. 2. However, it is difficult to make a prober which has the prober needles 14 arranged to make contact with the pads 15 of all of the input/output cells 11 shown in FIG. 2, and even if were possible to make such a prober, there are problems in that the prober would become expensive and the contact accuracy of the prober needles 14 would become poor. In addition, the testing equipment must be provided with a large number of terminals for supplying the signals to all of the input/output cells 11, and there is a problem in that the cost of the testing equipment itself becomes high.
Accordingly, it is a general object of the present invention to provide a novel and useful semiconductor integrated circuit in which the problems described above are eliminated.
Another and more specific object of the present invention is to provide a semiconductor integrated circuit comprising a semiconductor chip body, a plurality of input/output cells arranged on a surface of the semiconductor chip body at parts including a peripheral part and a central part of the semiconductor chip body, and at least an internal logic circuit provided on the semiconductor chip body, where each of the input/output cells include a pad and holding means coupled to the pad for holding incoming data, a plurality of the holding means are coupled in series in a test mode to form a scan path circuit, the input/output cell which has the pad for receiving an external test signal in a test mode is arranged at the peripheral part of the semiconductor chip body, and the test data held in the holding means of the input/output cell which is arranged at a part other than the peripheral part of the semiconductor chip body is transferred to the internal logic circuit in the test mode. According to the semiconductor integrated circuit of the present invention, it is possible to use a prober and a testing equipment which are similar to those conventionally used. Therefore, the prober needles can accurately contact the required pads and the testing can be carried out with ease using inexpensive prober and testing equipment which have simple constructions.
Still another object of the present invention is to provide the semiconductor integrated circuit of the type described above wherein predetermined ones of the input/output cells having the pads for receiving an external signal and outputting a signal outside the semiconductor integrated circuit are arranged in the peripheral part of the semiconductor chip body, and the holding means which are coupled to form the scan path circuit include a first shift register for shifting the test data which is received from the input/output cell having the pad for receiving the external test signal in the test mode. According to the semiconductor integrated circuit of the present invention, it is possible to test the semiconductor integrated circuit by simply contacting the prober needles to those pads which are arranged in the peripheral part of the semiconductor integrated circuit.
A further object of the present invention is to provide the semiconductor integrated circuit of the type described first, wherein predetermined ones of the input/output cells having the pads for receiving an external signal and outputting a signal outside the semiconductor integrated circuit are arranged in the peripheral part of the semiconductor chip body, first input/output cells are arranged in the peripheral part of the semiconductor chip body, second input/output cells are arranged in the central part of the semiconductor chip body, each first input/output cell is used for a data transfer between the semiconductor integrated circuit and another semiconductor integrated circuit which is independent from the semiconductor chip body, and each second input/output cell is primarily used for a data transfer within the semiconductor integrated circuit. According to the semiconductor integrated circuit of the present invention, it is possible to minimize the deterioration of the integration density of the internal logic circuit due to the provision of the input/output cells and effectively utilize the surface of the semiconductor chip body.
Another object of the present invention is to provide the semiconductor integrated circuit of the type described first, wherein the semiconductor chip body includes a substrate, and the semiconductor integrated circuit further comprises a pair of lower conductor layers formed on the substrate and coupled to mutually different logic circuits within the semiconductor integrated circuit, and an upper conductor layer which is formed on the pair of lower conductor layers to short-circuit the pair of lower conductor layers, where the upper conductor layer forms the pad of the input/output cell. According to the semiconductor integrated circuit of the present invention, no boundary scan chain is established if a conduction failure, a short-circuit and the like occurs within the pad or in a vicinity of the pad. Hence, it is unnecessary to contact the prober needles to all of the pads in order to test the conduction test and the like within the pad or in the region in the vicinity of the pad. As a result, as long as the bonding is possible, there is no other limits to reducing the intervals of the pads, and the pads can be arranged using an arbitrary layout which efficiently utilizes the surface of the semiconductor chip body. Therefore, the integration density of the semiconductor integrated circuit can be improved.
Still another object of the present invention is to provide a semiconductor integrated circuit comprising a semiconductor chip body, a plurality of input/output cells arranged on a surface of the semiconductor chip body, and at least an internal logic circuit provided on the semiconductor chip body, where the input/output cells include first input/output cells which are arranged in a peripheral part of the semiconductor chip body and second input/output cells which are arranged in a central part of the semiconductor chip body, each first input/output cell is used for a data transfer between the semiconductor integrated circuit and another semiconductor integrated circuit which is independent from the semiconductor chip body, and each second input/output cell is primarily used for a data transfer within the semiconductor integrated circuit. According to the semiconductor integrated circuit of the present invention, it is possible to minimize the deterioration of the integration density of the internal logic circuit due to the provision of the input/output cells and effectively utilize the surface of the semiconductor chip body.
Other objects and further features of the present invention will be apparent from the following detailed description when read in conjunction with the accompanying drawings.


A distance indicating mechanism can be used in combination with a bow sight to quickly determine distances to targets from an elevated position. The distance indicating mechanism has a generally circular, fluid-filled tubular device with one or more adjustable indicators located thereon. The indicators are positionable to correspond with the fluid level in the tubular device to indicate the orientation of the mechanism when aiming at a known distance. Each indicator generally corresponds to a sight pin of a bow site that indicates a corresponding linear distance for which an arrow will be at a desired vertical position when shot by a bow operator.

In the sport of archery or bow hunting, as with other forms of hunting or shooting, accuracy is imperative, since the bow operator will often only have one shot at his target. A well known accessory to a hunting bow is a bow sight, which is a device that is mounted on the bow to help the shooter aim an arrow and improve shot accuracy.
Bow sights can vary in design and complexity. A bow sight common in the prior art utilizes a series of pins that are positioned in a track such that when an operator's line of sight is aligned with the respective pin and the arrow is shot from the bow, the arrow will be at a desired height at a predetermined linear distance. The pins are typically set to establish known intervals of linear distances from the shooter. For example, a bow sight having three pins may have them set to correspond to distances of 15, 20, and 25 yards. As the operator's line of sight moves from one pin to another, the orientation of the bow is rotated with respect to the operator, thereby changing the trajectory of the arrow. By increasing the trajectory, the arrow will fly farther before falling to the desired height. The pins are set by the operator to provide a visual indicator as to when the bow is in the proper orientation such that the arrow will be at the proper height a known distance from the bow.
Bow sights provide a sufficient aid to a hunter when the hunter is to shoot a known distance. However, when the bow hunter is at an elevated position, such as in a tree stand where he can watch a larger area of land for potential targets, the distance to a target that can move often cannot be easily determined quickly and to the level of accuracy necessary to know what distance the arrow should be aimed. In order to determine the exact distance to a target from an elevated position, unless the target moves past a landmark at a known distance, bow hunters are forced to use a distance finder each time. The hunter must then raise the bow and align his line of sight with a pin having a known linear distance equal to or similar to the estimated distance to the target. This process is cumbersome to the hunter, requires extra time which instead could be spent focusing on and preparing to shoot the target, and requires extra movement, which can frequently spook the animal, resulting in the animal escaping before the hunter can take a shot.


A specific region of a polylactic acid sheet is heated by a microwave. To allow the polylactic acid sheet to exhibit piezoelectricity in the thickness direction of the polylactic acid sheet, a high voltage is applied to the heated polylactic acid sheet in the thickness direction of the polylactic acid sheet, and thereby the screw axes of at least a part of the polylactic acid molecules are relatively aligned with the thickness direction. Then the polylactic acid sheet is rapidly cooled, and thereby the polylactic acid molecules are immobilized. The same step is executed for other regions of the polylactic acid sheet, and thereby piezoelectricity is imparted to a wide area of the polylactic acid sheet in the thickness direction. The resultant piezoelectric sheet is capable of exhibiting a high piezoelectricity in the thickness direction.

Polylactic acid (PLA) has such a molecular structure as shown in FIG. 14. PLA is dehydrated condensation polymer obtained through ring-opening polymerization of lactide, which is a cyclic dimer of lactic acid. Since lactic acid contains asymmetric carbon, it has chirality. Therefore, L-form and D-form are present in PLA, whose polymers are referred to as poly L-lactic acid (PLLA) and poly D-lactic acid (PDLA), respectively. Main chain of PLLA has left-handed helix structure, and main chain of PDLA has right-handed helix structure. Polylactic acid derived from lactic acid synthesized by microorganism is mostly in L-form and, currently mass-produced and used PLA is PLLA.
As described, for example, in Patent Literature 1 and Non-Patent Literature 1, a stretched PLA film exhibits piezoelectricity. According to Non-Patent Literature 1, point group of PLLA crystal is D2, and has such component as shown in FIG. 15(a) as piezoelectric tensor.
PLLA is helical polymer having dipoles of large value in the helix axis direction (C-axis direction). Crystal structure of PLLA is packed with dipoles in the C-axis direction facing opposite directions alternately. Therefore, macroscopically, dipoles in the C-axis direction are cancelled with each other to be zero. Therefore, assuming that a PLLA sheet is stretched in "3" axis direction as shown in FIG. 15(b), the piezoelectric tensor of the stretched, uniaxially-oriented PLLA sheet comes to have such component as shown in FIG. 15(c) as a result.
As described, for example, in Patent Literatures 1 and 2, piezoelectric phenomenon of conventional piezoelectric PLLA mainly comes from d14 shown in FIG. 15(c), of which value is about 10 to 20 pC/N. The piezoelectric constant of PLLA is distinctively high among polymers.
On the other hand, PZT as a representative example of ceramic piezoelectric body commercially available at present has as high a value as d33=300 to 700 pC/N, and it is applied to various actuators, piezoelectric buzzers and piezoelectric speakers. PZT, however, is lead-containing material and, from the viewpoint of environmental protection, lead-free piezoelectric material has been desired in the market. Further, among inorganic piezoelectric materials, ceramics are dominant, of which manufacturing cost is high and which inevitably involves disposal by landfill. From the foregoing, polymer piezoelectric material that can be manufactured at a low cost and is easily disposable has been desired. No material having piezoelectric constant comparable to PZT has said to be found.
PVDF (polyvinylidenefluoride) and PLLA are considered promising as polymers having very high piezoelectric constants. Particularly, as can be seen from FIG. 14, PLLA contains only C, O and H as constituent elements and, therefore, it will not emit any harmful substance when incinerated. Further, PLLA is biodegradable plastic that can be fully decomposed to water and CO2 through two steps of decomposition process of hydrolysis and microbial degradation. At present, raw material is corn starch, and petroleum oil is not at all used as the raw material. Except for CO2 derived from energy used in the manufacturing process, PLLA itself does not increase CO2 in the air after decomposition, since original material of PLLA is CO2 in the air. This is the reason why PLLA is considered carbon-neutral, and it attracts attention as environmentally friendly material.
It is noted, however, that piezoelectric constant of PLLA is, for d14, at most 20 pC/N, which is very low as compared with the piezoelectric constant of PZT. In order to use PLLA as a replacement of PZT, it is necessary to apply very high voltage at the time of operation. Therefore, conventionally, replacement to PLLA has been very difficult.
PTL 1: Japanese Patent Laying-Open No. 5-152638
PTL 2: Japanese Patent Laying-Open No. 2005-213376
NPL 1: Yoshiro TAJITSU, "Poly Nyusan Maku no Hikari/Denki Kinou (Optical/Electric Functions of Polylactic Film)", Mirai Zairyo, July 2003, Vol. 3, No. 7, pp. 16-25.

Piezoelectric sheet, method for manufacturing piezoelectric sheet, and manufacturing apparatus


An apparatus for the development of upper body parts and muscles is disclosed. The apparatus includes a base on which is mounted a seat supported above the base and a forearm pad disposed forward of the seat and supported above the base. A pivoted lever is pivoted at a first end to a seat support, a second end of the lever extends past the forearm pad a distance and includes a weight supporting pin which extends vertically upward. A lifting device is selectively and pivotally attached to the pivoted lever forward of the forearm rest. A plurality of weights are selectively attached to the weight support pin to vary the amount of force required to use the lifting device and raise the weights. A variety of attachments are selectively affixed to the lifting device to exercise various body parts and muscles.

A search of issued U.S. patents in the field of muscular exercising devices and apparatus reveals U.S. patents related generally to the field of the present invention but which do not anticipate nor disclose the device of the present invention. The discovered U.S. patents relating to the present invention are discussed herein below.
U.S. Pat. No. 3,573,865 to Annas et al. entitled "Weight Shifting Mechanism for Exercising" discloses an exercise device wherein the user pushes against an arcuately movable pedal which is connected through a mechanism to pivot a weighted beam about a fixed fulcrum. A seat is provided against which the user of the device rests while employing the device. This device employs cables and pulleys in its operation.
U.S. Pat. No. 3,858,873 to Jones entitled "Weight Lifting Exercising Devices" discloses an apparatus for development of body parts. The apparatus includes a frame on which is mounted a force applying member against which the user exerts a force for developing body parts and muscles. The device employs a seat for supporting the user, and a system of cables and pulleys is employed to exert force against the force applying member. The force exerted is continuously varied over the full range of rotation of the force applying member.
U.S. Pat. No. 3,285,070 to McDonough entitled "Muscular Evaluation and Exercising Apparatus" discloses an exercise apparatus employing a hinged weighted arm affixed to one end of a table or support. Resistance against motion is provided by a clutch which is adjustable to vary the amount of resistance imposed.
None of the above listed U.S. patents disclose nor anticipate an exercise device comprising a base with a seat supported above the base, a forearm pad disposed forward of the seat and supported above the base, a pivoted lever pivoted at a first end to a seat support and including a second end extending past the forearm pad a distance, a weight supporting pin extending vertically upward from the lever second end, an attachment post pivotally attached to the pivoted lever forward of the forearm rest, a lifting means selectively attached to the lifting post, and a plurality of weights selectively attached to the weight support pin to vary the amount of force required to raise the lifting means.
U.S. Pat. No. 4,266,766 to Calderone entitled "Exercise Device" discloses an apparatus for the development of upper body parts and muscles. The apparatus includes a base on which is mounted a seat supported above the base and a forearm pad disposed forward of the seat and supported above the base. A pivoted lever is pivoted at a first end to a seat support, a second end of the lever extends past the forearm pad a distance and includes a weight supporting pin which extends vertically upward. A lifting device is selectively and pivotally attached to the pivoted lever forward of the forearm rest. A plurality of weights are selectively attached to the weight support pin to vary the amount of force required to use the lifting device and raise the weights. A variety of attachments are selectively affixed to the lifting device to exercise various body parts and muscles.
U.S. Pat. No. 4,923,195 to Calderone entitled "Exercise Device" discloses an apparatus for the development of upper body parts and muscles. The apparatus includes a base on which is mounted a seat supported above the base with an adjustable forearm pad which is adjustably disposed forward of the seat and supported above the base by an adjustable forearm pad support. A pivoted lever is pivoted at a first end adjacent the seat, a second end of the lever extends past the forearm pad a distance and includes a weight supporting pin which extends vertically upward. A lifting device is selectively and pivotally attached to the pivoted lever, including mechanisms for adjusting the height and the forward or rearward position of the lifting device along the pivoted lever. A plurality of weights are selectively attached to the weight support pin to vary the amount of force required to use the lifting device and raise the weights. A variety of attachments are selectively affixed to the pivoted lever to exercise various body parts and muscles.
U.S. Pat. No. 5,358,462 to Calderone entitled "Exercise Apparatus" discloses an arrangement wherein two attachments are provided for an exercise apparatus of the type having a lever arm with an end pivotally connected to a base and a free end adapted to receive weights. A tower attachment provides a flexible tensile member connected at an end of the lever arm, with intermediate portions borne across elevated pulleys, and connectable at another end to various handles, by which a user can perform various pull-down and rowing exercises. A shoulder bar attachment has an elongated body connected at one end to the lever arm and having another end which accommodates the user's head and shoulders and which is provided with handles, allowing a user to perform various press and leg raise exercises.
U.S. Design Pat. No. D347,041 to Calderone entitled "Handle Assembly for a Physical Exerciser" describes an ornamental design for a handle assembly for a physical exerciser, such as the physical exercise apparatus described in U.S. Pat. No. 5,358,462.
U.S. Pat. Nos. 4,266,766, 4,923,195, 5,358,462 and D347,041 described herein are commonly owned, with the present application, by Michael P. Calderone. The specifications, drawings, abstracts and claims of U.S. Pat. Nos. 4,266,766, 4,923,195, 5,358,462 and D347,041 are incorporated herein by reference to include their respective teachings.
The aforesaid apparatus are typically intended for and can be advantageously applied in traditional home and commercial gym settings wherein the intended user is in average or superior physical condition. They can be, however, of limited value in situations wherein the user is infirm, suffers from severe or chronic injuries, physical limitations, or is undertaking a medically supervised course of physical therapy. It therefore has long been desired to provide exercise devices suitable for developing or restoring targeted body parts and muscles as part of a medical or physical therapy regimen.


A dosage device for extruding a bicomponent or a monocomponent sealant, particularly for an automatic machine for sealing a perimetric edge of an insulating glazing unit constituted by at least two glass sheets and by at least one spacer frame, having a finite width, is arranged proximate to the perimeter at a finite distance from the margin of the glass sheets, includes a first dosage assembly and a separate second dosage assembly for the dosage and feeding of the sealant, which can be activated alternately, in a first feeding step and in a third feeding step, so that one of them provides flow continuity to an extrusion nozzle while the other one is in the reloading step. The first and second dosage assemblies are activatable, in a second swapping step that is intermediate with respect to the first and third feeding steps, simultaneously and jointly, one of them having a flow-rate ramp that passes from the steady-state value to zero and the other one complementarily having a flow-rate ramp that passes from zero to the steady-state value.

Currently it is known to deposit the rigid spacer frame (3) or the flexible spacer profile (5) pre-spread with sealant (6) and/or adhesive (6′) on a glass sheet (2) so that the assembly is then mated with a second glass sheet (2′) and sealed over the entire external peripheral region so as to constitute the so-called insulating glazing unit (1).
The operation can further be multiple so as to obtain the insulating glazing unit 1 constituted by three glass sheets (2, 2′, 2″) and two frames (3, 3′) or spacer profiles (5, 5′), as well as "n" glass sheets (2, 2′, 2″, 2′″, 2M, 2′m, 2″m) and "n−1" frames (3, 3′, 3″) or spacer profiles (5, 5′, 5″).
And it is when the cavity delimited by the glass sheets and by the spacer frame has considerable dimensions, in combination with a considerable extension of the external peripheral region, but not only for these situations, that the invention according to the present application is of essential importance.
Taking for granted that the subsequent use of the insulating glazing unit (1), i.e., in the door or window, is known, in detail the insulating glazing unit (1) is constituted by the composition of two or more glass sheets (2, 2′, 2″, 2′″, 2M, 2′m, 2″m), which are separated by one or more spacer frames (3, 3′, 3″), generally made of inorganic material, such as for example aluminum or stainless steel or mixed inorganic/organic material, the second one being generally for example made of polyvinyl chloride (PVC), generally hollow and microperforated on the face that is directed inward, the spacer frames (3, 3′, 3″) containing hygroscopic material (4) in their hollow part and being provided with a butyl sealant (6) (constituting the so-called first seal) on the lateral faces and the chamber (or chambers), delimited by the glass sheets (2, 2′, 2″, 2′″, 2M, 2′m, 2″m) and by the spacer frame or frames (3, 3′, 3″), being able to contain for example air or gas (8) or gas mixtures (8) which provide the insulating glazing unit (1) with particular properties, for example thermal insulation and/or soundproofing properties.
The use has also recently become widespread of a spacer profile (5) having an essentially rectangular cross-section, which optionally contains two receptacles on its two sides intended for the butyl sealant (6), made of synthetic organic material, such as for example silicone and EPDM rubbers (from the English Ethylene-Propylene Diene Monomer), which is expanded, containing hygroscopic material (4) and is provided in its sides or part thereof with an adhesive (6′) which is useful for mechanical bonding with the glass sheets.
Joining between the glass sheets (2, 2′, 2″, 2′″, 2M, 2′m, 2″m) and the spacer frame or frames (3, 3′, 3″) or (5, 5′, 5″) is obtained by means of two sealing levels; the first one (also known in the jargon as primary) (6) having the function of providing a hermetic seal and the initial bonding between said components and affecting the lateral surfaces of the frame and the portions of the adjacent glass sheets, already mentioned earlier (butyl sealant, thermoplastic); the second one (also known in the jargon as secondary) (7), typically constituted by an elastomeric bicomponent sealant, such as polysulfide (PS) or polyurethane (PU) or silicone (SI), processed at room temperature, but also constituted by monocomponent sealant of the type processed at room temperature or of the hot processed type, having the function of providing final cohesion among the components and mechanical strength of the joint between them and affecting the compartment constituted by the outer surface of the spacer frame (3, 5) and by the internal faces of the glass sheets up to the edge thereof (see FIG. 1A to FIG. 1F).
In the case of a spacer profile (5) made of expanded synthetic material, the first sealing level is replaced (in this case losing the hermetic sealing function) or can be integrated (in this case preserving the hermetic sealing function) by an adhesive (6′), for example an acrylic adhesive, which is already spread on the lateral faces of said spacer profile and is covered by a removable protective film (see FIG. 1D, in which said film has already been removed).
The glass sheets (2, 2′, 2″, 2′″, 2M, 2′m, 2″m) used in the composition of the insulating glazing unit (1) can have different shapes as a function of the use thereof; for example, the outer glass sheet (outer being understood with respect to the building) can be normal or reflective or selective (in order to limit the thermal input during summer months) or laminated/armored (for intrusion prevention/vandalism prevention/bulletproof functions) or laminated/tempered (for safety functions) or combined (for example reflective and laminated, in order to obtain a combination of properties), the inner glass sheet (inner being understood with respect to the building) can be normal or low-emissive (in order to limit heat loss during the winter months) or laminated/tempered (for security functions) or combined (for example low-emissive and laminated in order to obtain a combination of properties).
The simple summary given already makes it clear that a manufacturing line for obtaining the insulating glazing unit product (1) requires many processes in a cascade arrangement and in particular comprises the process of second sealing to which the present application relates.
The processes for the production of the insulating glazing unit (1), each requiring a corresponding and particular machine to be arranged in series with respect to the other complementary ones, are, by way of non-limiting example and at the same time not all necessary, the following:
EDGING on the peripheral face of the glass sheet in order to remove any coatings in order to allow and maintain over time the bonding of the primary sealant (6) and the secondary sealant (7);
BEVELING of the sharp edges of the glass sheet, both to eliminate the marginal defects introduced with the cutting operation, which potentially could trigger cracks, and to reduce the risks of injury in subsequent handling of the glass sheets (2, 2′, 2″, 2′″, 2M, 2′m, 2″m) and of the finished insulating glazing unit (1);
WASHING of the individual glass sheets, with alternation between the inner glass sheet, any intermediate glass sheets, and the outer glass sheet (the orientation being the one defined earlier);
APPLICATION OF THE SPACER PROFILE: the spacer profile (3, 3′, 3″) manufactured previously, filled with hygroscopic material (4) and covered on its lateral faces with a thermoplastic (butyl) sealant (6), having functions of providing a seal against the entry of humidity and the leakage of the gas (8), in machines which are external with respect to the line for the production of the insulating glazing unit (1), is applied to one of the glass sheets that constitute the insulating glazing unit (1) in an adapted station of the line for producing the insulating glazing unit (1); as an alternative, a continuous strip of spacer profile (5, 5′, 5″) is unwound from a spool and is applied to one of the glass sheets until it also forms a closed frame, which is manufactured directly in adhesion against one of the glass sheets after removal of the protective film, on the same line for the production of the insulating glazing unit (1);
COUPLING AND PRESSING of the assembly constituted by the glass sheets and the frame or frames (i);
FILLING WITH GAS of the chamber or chambers thus obtained, for example performed in the same machine that performs the functions of the preceding paragraph, or in a subsequent machine, as shown in the figures, which show the complete configuration of the line for producing the insulating glazing unit (1);
SECOND SEALING of the assembly of the components: glass sheets (2, 2′, 2″, 2′″, 2M, 2′m, 2″m), spacer frame (3, 3′, 3″, 5, 5′, 5″), at the perimeter.
The invention that is the subject matter of the present application relates in particular to the manner of feeding the sealant (which is bicomponent but also optionally monocomponent) to the extrusion head and nozzle, a manner, that is adapted to provide high flow-rates of the sealant and to eliminate any discontinuity, so as to obtain a high productivity of the line for producing the insulating glazing unit (1) and a high functional and aesthetic quality of the filling of the perimetric joint.
The processes listed above can be performed by the respective machine automatically or semiautomatically or, for some operations, with a manual method.
Machines and methods are known for performing the second sealing in order to provide many inventions, which relate to the solutions for the dosage and feeding of the secondary sealant (7) to the head and therefore to the extrusion nozzle, which we define as of the first type or with flow discontinuity, since the dosage devices of the bicomponent products or the dosage device of the monocomponent product, once the contained product has been depleted, must be reloaded, and this occurs by actuating reloading and discharge valves, entailing that during the reloading step the flow toward the extrusion nozzle is interrupted; in this case, the sealing product is distributed proximate to the rigid spacer profile (3, 3′, 3″) or to the flexible spacer profile (5, 5′, 5″) in order to join it mechanically to the glass sheets (2, 2′, 2″, 2′″, 2M, 2′m, 2″m) and until alignment occurs with the edges of the glass sheets or with the edge of the smallest glass sheet (2′m, 2″m) (in the case of insulating glazing units with offset glass sheets (2M, 2′m, 2″m), as shown in FIGS. 1C, 1E, 1F) and constitute a sealing barrier against humidity, which must not enter the insulating glazing unit (1), and the filler gas (8), which must not escape toward the outside of the insulating glazing unit 1.
These inventions of the first type, being widespread and therefore common and known since 1980, are neither listed nor commented.
In particular, if the cavity delimited by the glass sheets and by the spacer frame has considerable dimensions (product, understood as multiplication, of the width of the spacer frame by the depth at which it is placed with respect to the edges of the glass sheets, a product which defines an area) and if the extensions of the outer peripheral region are also extended (constituting a length), so that the need for a high and uninterrupted flow-rate (determined by the product, understood as multiplication, of said area by the relative speed between the extrusion nozzle and the peripheral region of the insulating glazing panel) of sealing product must be solved with innovative solutions, the following prior art documents have been made evident and we define them as of the second type or with flow continuity (since flow toward the extrusion nozzle is not interrupted):
U.S. Pat. No. 9,079,335 B2 with German priority DE 10 2009 024 939 dated 9 Jun. 2009 and international equivalent WO 2010/142428 (A1)—proprietor Bystronic Lenhardt GmbH.
U.S. Pat. No. 8,480,940 B2 with German priority DE 10 2007 051 610.1 dated 24 Oct. 2007 and international equivalent WO 2009/053090 A2—proprietor Bystronic Lenhardt GmbH.
The difference between inventions of the first type and inventions of the second type is the flow-rate of the sealing fluid, which is modest and discontinuous in the first case and important and continuous in the second case and is such as to require an additional inventive step with respect to the background art of the first type.
This inventive step can be found in the invention according to the present application, not only with respect to inventions of the first type but also and in particular with respect to the two titles listed above of the second type (which use pumps that entail the problems that will be described), which are commented hereinafter.
U.S. Pat. No. 9,079,335 B2 highlights the need to extrude more viscous sealants, such as silicone, and with high flow-rates, as required in insulating glazing panels that have considerable distances between the glass sheets, as well as the need to follow the productivity increase of modern insulating glazing unit production lines (column 4 lines 21-26, which state verbatim: "According to the invention, however, it is possible to process the silicone with flow capacities, which are as large as required for insulating glass panes comprising a large distance between the glass panels, so as to be able to fully utilize the short clock cycle of modern insulating glass production lines").
This is achieved by using gear pumps (15, 16, the reference numerals are the ones of the patent), the first one controlling the flow of the base material, the second one controlling the flow of the catalyst material, instead of the usual piston pumps, and by resorting to a dynamic mixer instead of the usual static mixer.
This solves the following problem of the background art of the first type (verbatim quote from column 1, lines 43-45): "the sealing process of the insulating glass pane must be interrupted to refill the main component and the additional component into the respective piston-cylinder unit. During this time, a sealing of insulating glass panes is not possible.".
U.S. Pat. No. 8,480,940 B2, in addition to referencing the same background art and the same problem, recycles the characteristic according to the preceding invention, since (column 3 lines 47-53) it states again (verbatim): "With a sealing device according to the invention, it is possible to process the silicone with throughputs, which are as large as necessary for insulated glass panes comprising a large distance between the glass plates, so as to be able to fully utilize the short clock times of modern insulated glass production lines.".
This background art of the second type has the following drawbacks:
U.S. Pat. No. 9,079,335 B2 resorts to dosage gear pumps, both for the base product, with the pump 15, and for the catalyst product, with the pump 16 (the reference numerals are the ones of the patent), and this allows continuity and control of flow-rates, the gear pumps being fed respectively by double-acting piston transfer pumps 6, 6′ which are not dosage pumps but are solely pumps for drawing and transferring from the storage drums 3, 4, together with dosage precision, which typically is in the 10:1 volumetric proportion (which is why the gear pumps and the transfer pumps are shown with different dimensions in the figures).
And this solves, in principle, the described problems of the background art of the first type of interruption of the sealing during the step for reloading the dosage devices and of flow-rate limiting. However, gear pumps, when used to pump products which are viscous and unfortunately non-Newtonian and sometimes corrosive, such as sealants used in the production of insulating glazing units and when intended for high flow-rates, must be manufactured with very particular refinements which often do not provide a solution regarding the choice of materials and of machining tolerances, and this makes them very expensive. Further, due to abrasion and corrosion, they have a rather short life and a progressive decay of precision during operation, since bypass paths form between the chamber located downstream of the gears and the chamber located upstream as the plays increase and as channels form.
U.S. Pat. No. 8,480,940 B2 resorts to double-syringe dosage pumps 15, 16, 15′, 16′ of FIG. 1 or to double-acting piston dosage pumps 28, 28′ of FIG. 2 (the reference numerals are the ones of the patent), which in turn are fed respectively by double-acting piston pumps 11, 11′, which are not dosage pumps but solely for drawing and transferring from the storage drums, and this in principle solves the described problems of the background art of the first type of interruption of sealing during the reloading step of the dosage device and of flow-rate limiting.
However, these dosage pump solutions, by resorting to stroke limit exchange valves 13, 14, 13′, 14′ (the reference numerals are the ones of the patent), have the great problem of sudden transient conditions during the opening and closing of said exchange valves, and this causes pressure peaks, imbalances in the base product/catalyst product dosage ratio, discontinuities in the aesthetics and geometry of the seal of the joint.
Uses of a single system for dosage and pumping of a sealant, or uses of two distinct systems which coexist but are each intended to use a distinct sealant and only for the need to operate alternately in the same sealing machine with more than one type of sealant (typically PS and SI or PS and PU) ale also known.
The aim of the present invention is therefore to eliminate the drawbacks of the background art, by providing a device that allows continuity of the sealing process.

Dosage device for extruding a bicomponent or monocomponent sealant


The present disclosure describes reducing flooding of link state information of a link state protocol in a network with multiple routers. A filtering strategy is pre-configured on a router interface for filtering link state information generated by a first router. The filtering strategy is to enable link state database (LSDB) isolation between a second router associated with the router interface and the first router. Link state information generated by the first router is received or sent according to the pre-configured filtering strategy via the router interface.

Link state routing protocols are used for communication in packet-switched networks. Routers exchange link state information with each other using a flooding process, where each router creates link state information and floods it to their neighbours. The link state information is used to maintain a link state database (LSDB) that reflects the topology of the autonomous system.

Reducing flooding of link state information

HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP


A carbon nanotube dispersion includes a carbon nanotube compound represented by structural formula A and a dispersion medium in which the carbon nanotube is dispersed or dissolved,

1. Technical Field
The present invention relates to a carbon nanotube dispersion suitable for the formation of a carbon nanotube film, a production method of a carbon nanotube structure from the carbon nanotube dispersion and a carbon nanotube structure obtained by the production method.
2. Related Art
In recent years, transparent electrodes and transparent TFT's have been under active development aiming at the application to flat panel display. As one of materials favorable for these products, carbon nanotubes have attracted attention. In order to apply the carbon nanotubes to transparent electrodes and transparent TFT's, the carbon nanotubes are required to form a thin film uniformly on a certain substrate.

Carbon nanotube dispersion, production method of carbon nanotube structure and carbon nanotube structure

Abstract: wherein a moiety represented by double lines represents a carbon nanotube R1 represents a hydrogen atom, a substituted or unsubstituted alkyl group having one or two carbon atoms, a substituted or unsubstituted aryl group or a substituted or unsubstituted carbodiimide group, R2 represents a substituted or unsubstituted alkyl group having from 1 to 4 carbon atoms, and m and n each independently represents an integer of 1 or more.


In the case of a fitting system for a vehicle seat (1), in particular for a motor vehicle seat, having at least one fitting (15, 35, 45) and a structural part (11) on which the fitting (15) is to be fixed, the fitting parts are substantially disk-shaped, can be rotated relative to each other, are axially held together by a clutch ring (19) arranged along the periphery, and the clutch ring (19) is designed in a manner such that it is integrated in the structural part (11).

The present invention relates to a fitting system for a vehicle seat, in particular for a motor vehicle seat, having at least one fitting and a structural part on which the fitting is to be fixed, with the fitting parts of the fitting being substantially disk-shaped, rotatable relative to each other, and axially held together by a clutch ring arranged along the fitting's periphery.
DE 101 05 282 A1 and corresponding U.S. Pat. No. 6,799,806 disclose a fitting system of the type described immediately above, in which a fitting part is pressed into the clutch ring which at the same time clutches the other fitting part and therefore ensures that they are held together axially and radially. DE 101 05 282 A1 and corresponding U.S. Pat. No. 6,799,806 further indicate that the fitting prepared in this manner is then laser-welded to the structural part.


A power supply device and system for providing power to a portable electronic device. A detachable device includes a rechargeable DC power source, a DC-to-AC inverter, and a primary transformer winding around a first core element. The portable electronic device includes multiple secondary transformer windings around a second core element. The detachable device cooperates with the portable electronic device so as to form a complete power supply circuit for providing AC and/or DC operating voltages to the portable electronic device.

In the rapidly-developing field of wireless communication devices, and in portable electronic devices in general, power supply systems which provide a safe, reliable, long-lasting source of power without compromising the portability of the device are highly desirable. The power supply requirements of many electronic devices are evolving as new generations of integrated circuits are developed which operate at decreasing voltage levels. These decreasing voltage requirements allow battery assemblies for portable electronic devices to be made smaller and lighter. However, the reduction in operating voltages for some chips results in different operating voltage levels for different portions of the electronic device. Further contributing to this problem of multiple supply voltage levels is the fact that analog circuits perform better at voltage levels which are higher than the voltage levels required by many digital integrated circuits. Finally, some circuit components, such as RF power amplifiers and displays, require negative supply voltages. Generating all of the necessary supply voltages for a particular electronic device can consume a significant amount of surface area on a printed circuit board, and is typically inefficient.
An additional problem results from the evolving power supply requirements of mobile telephones and other portable electronic devices, in that devices which require relatively high supply voltage levels experience a relatively insignificant power loss across the contacts which connect the power supply to the device. However, as the voltage supply requirements decrease, the current across the power supply contacts increases, and the voltage drop and power loss across the power supply contacts becomes significant.
Known power supply systems for portable electronic devices use conventional power supply contacts to supply power from a battery assembly to the device. In some cases, multiple power supply contacts are used to decrease the total resistance at the contacts. Different voltage levels can be derived using linear regulators and boost or buck voltage converters. However, known power supply systems do not adequately address the problem of power loss across the power supply contacts. Further, known power supply systems do not adequately address the problems of inefficient use of PC board area, which occurs as a result of multiple linear voltage regulators or boost/buck voltage converters.
One example of a known power supply system is disclosed in U.S. Pat. No. 5,327,065 to Bruni et al. (Bruni). Bruni discloses a hand-held inductive charger having concentric windings for transferring power across a dielectric medium using magnetic induction. More particularly, the charger includes a primary coil and is connected to an electrical power source via a cable. The charger is designed to be inserted into a receptacle housing having a secondary coil coupled to an automobile battery. When the charger is inserted into the receptacle housing, the primary and secondary coils form a transformer which transfers power from the electrical power source to the automobile battery to charge the battery. Since the Bruni device relates to the charging of electric automobile batteries, it is not designed for portability. Further, the Bruni device is designed to transfer approximately 6000 watts, and therefore is not applicable to typical portable electronic devices. Further, Bruni does not adequately address the problem of power loss occurring at the power supply contacts due to the relatively low voltages required by the powered device, and does not address the problem of providing multiple supply voltages.
Another example of a known power supply system is disclosed in U.S. Pat. Nos. 5,157,319 and 5,341,083 to Klontz et al. (Klontz). Klontz discloses a contactless battery charging system for recharging an electric automobile battery. In the Klontz system, a primary converter converts power from a power source into high frequency power, and a secondary converter in the automobile is coupled to the battery. When the primary and secondary converters are coupled together by a contactless coupling to form a transformer, power is transferred from the power source to the battery for charging. As described above with respect to Bruni, Klontz does not address the problem of providing multiple supply voltages to a portable electronic device, or the problem of power consumption across the power supply contacts in a relatively low-voltage portable electronic device.
U.S. Pat. No. 5,264,776 to Hulsey (Hulsey) discloses an inductive coupling charge port for charging an electric vehicle. The Hulsey system includes a hand-held primary coil assembly connected to a power source, and a secondary coil assembly disposed in a cavity in the vehicle. The secondary coil assembly is connected to the vehicle battery, and includes a first portion of a transformer core. A hinged access door provides access to the cavity, and has a second portion of the transformer core attached by a compressible material to the inner surface of the hinged access door. When the primary coil assembly is inserted into the cavity and the hinged access door is closed, a complete transformer core is formed, and power is transferred from the power source to the battery. As with the Bruni and Klontz systems, the Hulsey system is not directed to providing multiple voltages to a portable electronic device.
Therefore, it would be desirable for a power supply system for a portable electronic device to provide a reliable, safe, relatively long-life power supply to the portable electronic device, including multiple supply voltages, in an efficient manner so as to enhance the portability of the electronic device.

Power transfer and voltage level conversion for a battery-powered electronic device


A load including a plasma discharge in a plasma processing chamber is matched to a variable frequency source so the power reflected from the load is substantially minimized. The source voltage or a variable reactance of a matching network between the source and load is controlled so the load has a preset power level, as detected by the difference between the source output power and the power reflected from the load.

Vacuum plasma processing chambers are employed for processing workpieces, typically glass, semiconductor or metal substrates, so the workpiece is etched and/or has materials deposited thereon. Significant amounts of power must be supplied to the vacuum plasma processing chamber to excite ions in a gas in the chamber to a plasma and to maintain the plasma in a discharge state.
The impedance of a load of the vacuum plasma processing chamber, including the plasma discharge and an excitation circuit component for it, usually a coil or one or more electrodes, frequently varies, non-linearly and unpredictably. For example, the quality factor (Q) of an excitation coil prior to ignition of the plasma is typically quite high, about 1,000. After ignition, the Q of the coil and its plasma load drops to about 10-20 when the coil is not close to being resonated. As resonance is approached, the Q of the coil and plasma drops to a lower value because the resistive impedance seen looking into a matching network driving the coil and plasma becomes a larger percentage of the total impedance seen looking into the matching network. The reactive impedance seen looking into the matching network also decreases as resonance is approached and reached due to properties of the plasma. The resistive impedance results, to a large extent, from the charged carriers in the plasma. Hence, matching to a plasma presents particular problems due to these variations in the resistive (real) and reactive (imaginary) impedance components of the load seen looking into the matching network driving the excitation circuit element and plasma of a vacuum plasma processing chamber. These variations often include fairly high frequency components, for example, in the audio frequency range.
Usually the plasma of a vacuum plasma processing chamber has been excited to a single r.f. frequency, such as 13.56 mHz, by a relatively high power r.f. source connected to the load via a variable impedance matching network. Two or more variable impedances of the matching network have usually been provided, one primarily controlling the load reactive component and the other primarily controlling the load real, i.e., resistive, component, as seen by the source.
The variable impedance elements of the matching network must be relatively robust because relatively large r.f. currents and voltages are applied to them. Hence, the variable reactances of the matching network are usually controlled by servo controllers including motors having relatively slow response times, incapable of following many changes in the reactive impedance of the load including the discharge. The prior art controller time constants are typically in the 0.1 to 1 second range, to prevent the matching network variable reactances from adjusting properly to load transients or perturbations which occur at audio frequencies on faster time scales than 0.1 to 1 second. This problem is particularly acute because of the frequent need to repeatedly vary both reactances of the matching network.
It is, accordingly, an object of the present invention to provide a new and improved apparatus for and method of controlling power supplied to a plasma discharge of a vacuum plasma processing chamber.
Another object of the invention is to provide a new and improved method of and apparatus for substantially eliminating reactive components seen by a source exciting a plasma discharge of a vacuum plasma processing chamber.
A further object of the invention is to provide a new and improved method of and apparatus for varying a parameter of an excitation circuit for a vacuum plasma processing chamber in such a manner that reactive impedances seen by a source exciting a plasma discharge of the chamber are substantially eliminated, even when changes in the reactive impedance occur at audio frequencies.
An additional object of the invention is to provide a new and improved all-electronic, low power method of and apparatus for controlling the reactive impedance seen by a source exciting a plasma discharge of a vacuum plasma processing chamber.
Yet another object of the invention is to provide a new and improved method of and apparatus for controlling the amount of power exciting a plasma discharge of a vacuum plasma processing chamber while substantially eliminating reactive impedance effects seen by a source exciting the plasma discharge.
Still a further object of the invention is to provide a new and improved method of and apparatus for controlling the amount of power exciting a plasma discharge of vacuum plasma processing chamber so a desired power level is applied to the load even though power from the load is reflected back to an excitation power supply.

Method of and apparatus for electronically controlling r.f. energy supplied to a vacuum plasma processor and memory for same


An acrylic rubber composition comprising 100 parts by weight of acrylic rubber containing cross-linkable groups and 2 to 40 parts by weight of tri(2-ethylhexyl) phosphate has quite an unexpected effect on prevention of fixation of its vulcanized rubber moldings to metallic materials or resin moldings when brought into direct contact with the latter due to the presence of tri(2-ethylhexyl) phosphate in the acrylic rubber containing cross-linkable groups.

1) Field of the Invention
The present invention relates to an acrylic rubber composition, and more particularly to an acrylic rubber composition having a property to prevent fixation to a metal, etc.
2) Description of the Prior Art
Acrylic rubber is used as molding materials for sealing rubber such as packings, O-ring, etc. and has such a tendency that the rubber is fixed to materials in direct contact with the rubber, for example, metals such as cast iron, aluminum, stainless steel, soft steel, etc., or resins such as polyamide resin, phenol resin, etc., thereby lowering the sealing effect. Such a tendency is often observed particularly in case of acrylic rubber having cross-linkable groups such as reactive halogen, epoxy group, etc. in the acrylic rubber molecules.
The term "fixation or fixing" used herein designates a state of sealing rubber, which cannot be peeled off from a material, especially cast iron or mild steel, in contact with the sealing rubber by strong adhesion due to reaction therebetween, when the sealing rubber and the material in contact therewith are compressed by about 10 to about 40% and left standing in air or working oil at a predetermined temperature for a predetermined time.
Various methods have been so far proposed, as given below, to solve the problem of fixation, but have not been found successful:
(1) A method of adding a relatively large amount of a plasticizer, etc. to the rubber, thereby bleeding the plasticizer, etc. from the rubber to prevent any direct contact with a mating material. The method is economically best, but the physical properties of the rubber are largely lowered by the bleeding. PA1 (2) A method of depositing a solid lubricant onto the rubber. The method suffers from easy release of a solid lubricant such as graphite, molybdenum disulfide, etc. from the rubber, resulting in unstable properties and contamination of working oil with the released solid lubricant to form foreign matters. PA1 (3) A method of coating a sealing material with a composition of a rubber-based binder and a solid lubricant as main ingredients, dispersed in a solvent. The method usually suffers from a poor adhesion to the sealing material and has no satisfactory effect on the prevention of fixation. PA1 (C.sub.1) vinyl monomer having an epoxy group, PA1 (C.sub.2) vinyl monomer having a carboxyl group, PA1 (C.sub.3) vinyl monomer having a reactive halogen, PA1 (C.sub.4) vinyl monomer having a hydroxyl group, PA1 (C.sub.5) vinyl monomer having an amide group, and PA1 (C.sub.6) dienic monomer. PA1 (C.sub.1) For the vinyl monomer having an epoxy group including, for example, allylglycidyl ether, glycidyl acrylate, glycidyl methacrylate, etc., such cross-linking agents as polyamines, for example, diethylenetriamine, metaphenylenediamine, etc.; polycarboxylic acids, for example, adipic acid, etc.; acid anhydrides, for example, pyromellitic anhydride, maleic anhydride, etc.; and polyamides; sulfonamides, etc. can be used. PA1 (C.sub.2) For the vinyl monomer having a carboxyl group including, for example, acrylic acid, methacrylic acid, itaconic acid etc., such cross-linking agents as polyepoxides, for example, ethyleneglycol diglycidyl ether 1,6-hexanediol diglycidyl ether, etc.; and polyols, for example, 1,4-butanediol, 1,1,1-trimethylolpropane, etc. can be used. Cross-linking can be carried out only by heating without using these cross-linking agents. PA1 (C.sub.3) For the vinyl monomer having a reactive halogen including, for example, 2-chloroethylvinyl ether, etc., such cross-linking agents as polyamines, for example, diethylenetriamine, triethylene-tetramine, etc.; and polycarbamates, for example, hexamethylenediamine carbamate, etc. can be used. PA1 (C.sub.4) For the vinyl monomer having a hydroxyl group including, for example, hydroxyalkyl methacrylate, hydroxyalkoxy acrylate, N-methylolacrylic acid amide, etc., such cross-linking agents as polyisocyanates, for example, hexamethylene diisocyanate, tolylene diisocyanate, etc.; polycarboxylic acids, for example, adipic acid, etc.; and alkoxymethylmelamines, for example, methoxymethylmelamine, etc. can be used. PA1 (C.sub.5) For the vinyl monomer having an amido group including, for example, acryl amide, methacryl amide, etc. such cross-linking agents as aminoformaldehyde, etc. can be used. Cross-linking can be carried out only by heating. PA1 (C.sub.6) For the dienic monomers including, for example, divinyl benzene, isoprene, pentadiene, vinylcyclohexene, chloroprene, butadiene, methylbutadiene, cyclopentadiene, methylpentadiene, ethyleneglycol diacrylate, propyleneglycol diacrylate, ethyleneglycol dimethacrylate, propyleneglycol dimethacrylate, etc., such cross-linking agents as sulfur; organic peroxides, for example, benzoyl peroxide, dicumyl peroxide, etc.; azo compounds, for example, azobisisobutyronitrile, etc.; divinyl benzene; triallyl cyanurate, triallyl isocyanurate, etc. can be used. Cross-linking can be carried out only by heating without using these cross-linking agents.


A snowmobile design, including a modular front suspension system and a stabilizer assembly, a lightweight frame structure and a drive train that reduces the center of gravity of the snowmobile. The modular front suspension system for a snowmobile that is substantially self-contained and self-supporting. The present modular front suspension system is assembled around a primary support structure, such as an extrusion or other structural member. The primary support structure can be easily attached to, or detached from, the snowmobile frame. The modularity of the present suspension system decreases assembly costs. A stabilizer assembly extends through the center opening and is mechanically coupled to the ski spindle housings.

This invention is directed to various innovations in snowmobile design, including a modular front suspension system and a stabilizer assembly, a lightweight frame structure and a drive train that reduces the center of gravity of the snowmobile.
Snow mobile design has incrementally moved towards more powerful motors, with a resulting increase in the weight of the machines due to the larger motor and corresponding support structure. Frequently, increased weight results in a higher center of gravity of the snowmobile. Increased weight and increased center of gravity can have a detrimental affect on the ride quality and handling characteristics of the snowmobile.
Handling, cornering and ride quality are largely dependent upon the front suspension system of the snowmobile. It is common practice to suspend the skis of a snowmobile independently by means of respective strut type suspensions. It is desirable to provide some form of stabilizer or sway bar arrangement interconnecting the front skis to reduce the amount of leaning that occurs during cornering of the snowmobile. Due to the rough and sometimes uncertain terrain over which snowmobiles are ridden, it is desirable that the stabilizer arrangement be positioned so that it will be protected if unexpected objects are encountered, such as disclosed in U.S. Pat. No. 4.690,234 (Takada).
U.S. Pat. No. 4.489,954 discloses an anti-roll mechanism that includes a torsion bar supported by the body that is connected to the skis for torsion loading upon independent movement of the skis relative to the body. The connection between each of the skis and the torsion bar is such that the torsion bar is loaded by the pivotal movement of the skis about their steering axes for providing a self-centering force on the skis.
U.S. Pat. No. 4,671,521 (Talbot, et al) discloses a snowmobile ski suspension including upper and lower transverse suspension arms vertically spaced and each having an outboard end articulated to a ski spindle and an inboard end articulated to a fixed mounting on the frame of the snowmobile. The upper and lower transverse suspension arms define a parallelogram linkage for guiding the spindle to move Generally vertically with respect to the snowmobile.
U.S. Pat. No. 5,029,664 (Zuwalski) discloses a suspension system with a geometry that includes upper and lower suspension linkages of predetermined lengths in cooperation with a spindle of a predetermined length for eliminating lateral movement of the skis during suspension travel. The respective linkages and spindles are interconnected by ball joints at predetermined locations in such a manner that during deflection of the suspension system, a ski attached to the lower end of the spindle moves substantially in a line parallel to a vertical plane which contains the longitudinal axis of the snowmobile.
What is needed is a snowmobile design that provides a high power-to-weigh ratio while maintaining optimum handling characteristics and ride quality.
The present invention is directed to various innovations in snowmobile design. In one embodiment, the snowmobile includes a modular front suspension system and a stabilizer assembly. In another embodiment, the frame structure includes a lightweight frame structure. In yet another embodiment. the snowmobile includes a drive train that reduces the center of gravity. Finally, all of these features are combined on a single snowmobile.
The present invention is directed to a modular front suspension system for a snowmobile that is substantially self-contained and self-supporting. The present modular front suspension system is assembled around a primary support structure, such as an extrusion or other structural member. The primary support structure can be easily attached to, or detached from, the snowmobile frame. The modularity of the present suspension system decreases assembly costs.
The front suspension system of a snowmobile is typically assembled directly to the frame of the snowmobile. The present modular front suspension system can be assembled independently of the snowmobile and conveniently transported or stored for later use. The self-contained, self-supporting nature of the present suspension system allows for lower cost assembly, machine handling and automated testing.
Repairs on conventional snowmobile suspension systems are often accomplished by replacing individual components. End-users, however, typically lack the proper equipment to determine whether the front suspension system is operating properly. The present front suspension system can be easily removed by the user and returned to the manufacturer for factory repair. A temporary or permanent replacement suspension systems can also be sent to the customer for easy installation.
Additionally, a standardized primary support structure can be utilized so that a variety of suspension systems with different features can be easily substituted on the snowmobile by the manufacture. the dealer or the end-user. Since the front suspension system is less expensive than the entire snowmobile. the manufacturer/dealer can offer a variety of options with lower inventory costs. The end-user may also purchase multiple front suspension systems for a single snowmobile. For example, the end-user may have one front suspension system for racing and another for touring.
In one embodiment, the modular front suspension system includes a primary support structure having first and second ends. a center opening and at least one mounting surface attachable to the chassis. A pair of upper control arms are pivotally connected to the first and second ends of the primary support structure at upper control arm axes, respectively. A pair of lower control arms are pivotally connected to the first and second ends of the primary support structure at lower control arm axes, respectively. A pair of ski spindle housings are pivotally connected to distal ends of the upper and lower control arms. respectively. The ski spindle housings are connectable to the steerable skis. A stabilizer assembly is mechanically coupled to the ski spindle housings. In one embodiment. the stabilizer assembly extends through the center opening and is mechanically coupled to the ski spindle housings.
In another embodiment, the modular front suspension system includes a primary support structure having first and second ends, a center opening and at least one mounting surface attachable to the chassis. A pair of upper control arms are pivotally connected to the first and second ends of the primary support structure at upper control arm axes, respectively. A pair of lower control arms are pivotally connected to the first and second ends of the primary support structure at lower control arm axes, respectively. A pair of ski spindle housings are pivotally connected to distal ends of the upper and lower control arms. respectively. The ski spindle housings are connectable to the steerable skis. A pair of shock mounts are pivotally attached to one of the upper control arm or primary support structure, respectively. A pair of shock absorber are attached to the shock mounts and the spindle housings, respectively.
The present invention is also directed to a stabilizer assembly for use in a front suspension system on a snowmobile. The present stabilizer assembly may be used with or without the present modular front suspension system.
To provide flat cornering on smooth terrain, the front suspension system initially provides stiff resistance to ski displacement. In the event that rough terrain is encountered, subsequent ski displacement is preferably less stiff. That is. the force per unit displacement decreases with greater displacement. For example, the front suspension system provides stiff resistance to ski displacement during high-speed turns. If bumps are encountered during the turn, the front stabilizer system provides less resistance to ski displacement as compared to its initial movement. In one embodiment, the force per unit displacement curve is a step function, with greater force per unit displacement required during initial displacement and less additional force per unit displacement for subsequent displacement.
In one embodiment, the present stabilizer system includes first and second stabilizer brackets attached to the control arms, respectively. A rocker arm having first and second ends is pivotally mounted to the snowmobile. A first stabilizer member assembly is pivotally connected to the first stabilizer bracket and the first end of the rocker arm. A second stabilizer member assembly is pivotally connected to the second stabilizer bracket and the second end of the rocker arm. The stabilizer system transfers load from one side of the snowmobile to another. That is, spring force from one side of the snowmobile is transferred to the side experiencing lie greatest ski displacement. In one embodiment, the actual spring rate on the stabilizer member assemblies can be different from ski to ski.
In one embodiment, the stabilizer member assembly includes an extendable rod assembly having a maximum extension and a spring cap fixed thereto. A sleeve is slidably engaged with the extendable rod assembly adjacent to the first stabilizer bracket. A spring is arranged around the extendable rod assembly and interposed between the spring cap and the sleeve. In one embodiment, an adjustment mechanism is provided for sliding the sleeve along the extendable rod assembly to apply a bias of the spring. The extendable rod assembly is typically a telescoping structure. The stabilizer member assemblies are typically in a fully extended or topped-out configuration in a level or horizontal resting state.
The stabilizer member assemblies can be configured to provide a preload in the horizontal resting state such that initial upward displacement of one of the skis is resisted by a first force, and subsequent upward displacement of that ski is resisted by the addition of a second force proportionally less than the first force. In another embodiment, the first stabilizer member assembly is a double-acting spring assembly and the second stabilizer members assembly comprises a rigid shaft.
The present modular front suspension system and the present stabilizer assembly have application in other vehicles, such as automobiles, trucks and all-terrain vehicles.
The present invention is also directed to a chassis for a snowmobile having an endless belt drive system. The chassis includes a plurality of front structural members defining a motor compartment. Front suspension system mounting locations are positioned on distal ends of two or more of the front structural members. A pair of independent, rear structural members are rigidly connected to the front structural members and extend rearwardly from the motor compartment on opposite sides of an endless belt channel. A protective shell extends between the pair of rear structural members and over the endless belt channel. In one embodiment, the protective shell comprises a lightweight, resin based material that transfers substantially no loads between the pair of rear structural members. The. snowmobile chassis further includes a rear suspension system extending between the pair of rear structural members. The rear suspension system transfers substantially all loads between the pair of rear structural members.
In one embodiment, the snowmobile chassis includes a motor located in the motor compartment. The motor has at least one carburetor positioned on a first side of the motor adjacent to the front suspension system mounting locations and an exhaust port positioned on a second side of the motor.
The present invention is also directed to a snowmobile chassis having a motor compartment and an endless belt channel. A motor is located in the motor compartment. The motor has at least one carburetor positioned on a first side of the motor adjacent to a front suspension system and an exhaust port positioned on a second side of the motor. The motor has a drive clutch. A driven pulley is located on a gearbox that is located adjacent to the endless belt channel.
An endless belt drive shaft is located in the endless belt channel and mechanically coupled directly to the gearbox. A drive belt mechanically couples the drive clutch to the driven pulley. A torque arm connects the driven pulley to the snowmobile chassis.

Abstract: The chassis for a snowmobile includes a plurality of front structural members defining a motor compartment. A pair of independent, rear structural members are rigidly connected to the front structural members and extend rearwardly from the motor compartment on opposite sides of an endless belt channel. A protective shell extends between the pair of rear structural members and over the endless belt channel. The protective shell comprises a light-weight, resin based material that transfers substantially no loads between the pair of rear structural members. The snowmobile chassis further includes a rear suspension system extending between the pair of rear structural members. The rear suspension system transfers substantially all loads between the pair of rear structural members.


A method for fabricating a integrated circuit with improved performance is disclosed. The method comprises providing a substrate; forming a hard mask layer over the substrate; forming protected portions and unprotected portions of the hard mask layer; performing a first etching process, a second etching process, and a third etching process on the unprotected portions of the hard mask layer, wherein the first etching process partially removes the unprotected portions of the hard mask layer, the second etching process treats the unprotected portions of the hard mask layer, and the third etching process removes the remaining unprotected portions of the hard mask layer; and performing a fourth etching process to remove the protected portions of the hard mask layer.

The semiconductor integrated circuit (IC) industry has experienced rapid growth. In the course of IC evolution, functional density (i.e., the number of interconnected devices per chip area) has generally increased while geometry size (i.e., the smallest component (or line) that can be created using a fabrication process) has decreased. This scaling down process generally provides benefits by increasing production efficiency and lowering associated costs. Such scaling-down has also lead to high-k dielectric layers and conductive (e.g., metal) layers being adopted to form gate stacks in various IC devices, such as metal-oxide-semiconductor field-effect-transistors (MOSFETs). The conductive layers are often tuned to have a proper work function to achieve a designed threshold voltage for n-type and p-type devices. Currently, the conductive layers are patterned using an etching process, for example, a dry etching process or a wet etching process. However, it has been observed that a dry etching process results in damage to the high-k dielectric and conductive layers, and sometimes, leaves photoresist residue; and a wet etching process often results in lateral etching, degrading patterning profiles.
Accordingly, what is needed is a method for making an IC device that addresses the above stated issues.

High selectivity etching process for metal gate N/P patterning

Taiwan Semiconductor Manufacturing Company, Ltd.