A bare chip is mounted on a land of a substrate, and electrodes on an upper surface of the bare chip are connected with pads by means of wires. The pads are formed in lines so as to face the land, and electrodes for the soldering of electrodes of rectangular electronic parts are formed in the empty spaces between the vertical and horizontal lines of pads. After soldering the rectangular electronic parts, the bare chip is mounted and then sealed with resin. The rectangular electronic parts soldered between the lines of pads are entirely or partly sealed with the resin as well as the bare chip. The rectangular electronic parts are mounted in the spaces between the lines of pads, and therefore the bare chip and the rectangular electronic parts can be mounted at a higher density so that the substrate can be made smaller and more compact.

1. Field of the Invention
This invention relates to a method of manufacturing a circuit module in which a bare chip or chips of IC, memory and the like and solder-connected electronic parts are mounted on a single electronic circuit board (hereinafter referred to as a substrate).
2. Description of the Prior Art
Recently, there have been increasing demands for ever smaller electronic equipments. Circuit modules which are to be built in electronic equipment are becoming smaller. Most ICs and memories are mounted on the circuit module in the form of a flat package called QFP or SOP. The flat package is formed by mounting a bare chip or chips on a lead frame, electrically connecting the lead frame with the bare chip and then molding the same with resin. However, from the viewpoint of aiming at smaller size of the circuit module, it is necessary to mount the bare chip directly on the substrate. Conventional examples of this kind of technology are disclosed in Japanese Patent Unexamined Publication No. 2-260592 and Japanese Utility Model Unexamined Publication No. 3-92046. FIG. 12 is a plan view of a conventional substrate, and FIG. 13 is a fragmentary enlarged sectional view showing a state in which cream solder is being applied onto the same substrate. FIGS. 12 and 13 simply illustrate the content of the above publications. In FIG. 12, reference numeral 1 denotes a substrate, and a large number of pads 3 are formed around a land 2 in the center of substrate 1. The pads 3 are formed in lines of four pads 3 so as to face to four sides of the land 2. A bare chip 4 is mounted on the land 2. Electrodes 5 on an upper surface of the bare chip 4 are connected with the pads 3 by means of wires 6. The bare chip 4 and the wires 6 are sealed with resin 7.
A large number of rectangular electronic parts 8 are mounted by the side of the bare chip 4. The rectangular electronic part 8 means that in which electrodes are formed on opposite sides of a box-shaped main body, examples of which are resistance chip, chip capacitor and so on. Electrodes 9 of each of the rectangular electronic parts 8 are fixed onto electrodes 10 of the substrate 1 with solder 11.
FIG. 13 shows a state in which, after mounting the bare chip 4 due to sealing with the resin 7, cream solder 11 is being applied onto the electrodes 10 by means of screen printing for the purpose of the soldering of the rectangular electronic parts 8. Reference numeral 12 denotes a screen mask in which pattern holes 13 are formed in the positions corresponding to the electrodes 10 of the printed substrate 1. The screen mask 12 is formed with a projecting portion 12a for avoiding the resin 7. As shown in the drawing, by sliding a squeegee 15 over the screen mask 12 put on top of the substrate 1, the cream solder 11 is applied onto the electrodes 10. In the succeeding step, reflowing is performed to cause the cream solder 11 to melt and solidify to form the solder 11 shown in FIG. 12.
However, in the conventional method described above, after the mounting of the bare chip 4, the cream solder 11 was applied by screen printing and then the rectangular electronic parts 8 were mounted, and therefore there was a problem that the rectangular electronic parts 8 had to be mounted in positions distant from the resin 7. Particularly as shown in FIG. 13, the screen mask 12 should be formed with the projecting portion 12a having a gently-inclined tapered surface a so as to allow the squeegee 15 to slide smoothly. For this reason, printing of the cream solder 11 was unstable in the vicinity of the tapered surface a, and therefore the pattern holes 13 were formed in the area at a horizontal distance L from the tapered surface a (or the area outside of the broken line in FIG. 12). In order to assure the distance L, the mounting positions of the rectangular electronic parts 8 had to be kept away from the bare chip 4 to a great extent, giving rise to a problem that the mounting of the bare chip could not contribute to smaller size of the circuit module so much.

Matsushita Electric Industrial Co., Ltd.


The present invention discloses methods and systems for selecting at least one SIM card for data communication at a wireless communication device which is capable of housing a plurality of SIM cards. When a switching condition is satisfied, the wireless communication device selects a second SIM card group, and disconnects one or more connections established using any non-second group SIM card. Non-second group SIM cards are SIM cards that are not in the second SIM card group. A selected SIM card from the second SIM card group is then used for data communications. The steps are repeated until (i) the switching condition is no longer satisfied, (ii) no more SIM cards selected from the second SIM card group can be used for data communications or (iii) no more connection is made using non-second group SIM cards.

A wireless communication device, such as a router or gateway may be used in various deployments according to preferences of a user or administrator. Therefore, at different times, network environment may be different. When network environment changes, there may be disruptions in Internet connectivity. Prior art fails to disclose methods for seamlessly changing connections according to changes in network environment. Therefore, solution is required for ensuring that the wireless communication device is connected to the Internet without disruptions. Furthermore, for example, when there is a change in geographical location, a user or administrator has to manually configure the wireless communication device to use a SIM card that belongs to that particular geographical location. When there are many devices and SIM cards, it is a hassle to configure each device manually. A solution is required for automatically selecting SIM cards according to geographical location.

Methods and systems for selecting SIM card


The present invention provides a methanation catalyst prepared by depositing Pt and Ru on a metal oxide carrier by incipient wetness impregnation or precipitation deposition, drying and calcining the deposited carrier to obtain a Pt—Ru/metal oxide catalyst. This catalyst can selectively catalyze methanation of CO, wherein hydrogen and CO in a hydrogen-rich reformate or synthesis gas are reacted to form methane and water, thereby the CO concentration in the hydrogen-rich reformate is reduced.

A polymer electrolyte fuel cell (PEFC) is highly possible to be applied as a stationary domestic power generation system or in an electric car, and a PEFC system requiring a fuel consisting of a hydrogen-rich gas (concentration of H2>35%) with a CO concentration lower than 20 ppm. A hydrogen-rich reformate gas formed from a reforming reaction of hydrocarbon contains about 4˜15% of CO, which needs to undergo a water-gas shift (WGS) reaction to reduce the CO content to less than 1% of, followed by a preferential oxidation reaction or a methanation reaction and a preferential oxidation reaction in serial in order to reduce the CO concentration to be less than 100 ppm, or even less than 20 ppm. By selecting a suitable catalyst and controlling the reaction at a suitable temperature, the CO contained in a hydrogen-rich reformate gas can be converted to methane through the methanation reaction, and thus reduce the CO concentration therein. One advantage of the methanation reaction is the reactor design is simpler than that for use in the PrOX reaction. However, one defect of the methanation reaction is removing one mole of CO requiring depleting three moles of hydrogen. Thus, methanation mainly is applied on a reformate gas with a low CO concentration or for miniaturization of a fuel reformer. At present, methanation has been used in the design of reformers by the Osaka Gas Company and the Mercedes-Benz Automobile Company.
However, other than catalyzing a CO methanation reaction, a methanation catalyst will also catalyze a CO2 methanation reaction. In order to taking into account of both CO removal and hydrogen loss, a good methanation catalyst should have good catalytic activity and reaction selectivity to the CO methanation reaction.CO+3H2→CH4+H2OCO2+4H2→CH4+2H2O (side reaction)
An active metal used in the methanation reaction catalyst for the conventional petrochemical industry mostly is nickel. A nickel-catalyzed methanation reaction has a slightly higher reaction temperature of about 400° C. When the reactant composition contains CO2, a nickel catalyst at 400° C. is liable to catalyze a CO2 methanation reaction, which will consume a larger amount of hydrogen and can not be used in serial to an existing WGS reaction. Other than a nickel catalyst, ruthenium is most commonly used as an active metal in a methanation catalyst.
U.S. Pat. No. 3,787,468 discloses a mixed Ru—WOX and Pt—Ru—WOX catalyst, which are applicable on methanation of CO and CO2, wherein Ru—WOX has a better methanation activity, and Pt—Ru—WOX has a lower activity. Said catalysts contain Ru as a main ingredient, Pt in an amount of 0-50% of the amount of Ru, and WOX in an amount of 5-20% of Ru. That is said catalysts contain a high content of precious metal, which leads to a high production cost.
U.S. Pat. No. 3,615,164 discloses a Ru or Rh catalyst suitable for selective methanation of CO, wherein said Ru or Rh is supported on a metal oxide carrier.
In comparison with a nickel catalyst, a ruthenium catalyst has a lower reaction temperature in catalyzing a methanation reaction. However, the reaction temperature thereof is deeply influenced by a space velocity. Even though a ruthenium catalyst has the advantages of a high activity in catalyzing a CO methanation reaction and a low reaction temperature (U.S. Pat. No. 3,615,164; U.S. Pat. No. 3,787,468), ruthenium is liable to form a Ru(CO)x complex with CO, whereas the Ru(CO)x complex will sublimate in the methanation reaction, causing deterioration of the catalyst activity, thereby affecting the lifespan of the catalyst.

Process for the selective methanation of carbonmonoxide (CO) contained in a hydrogen-rich reformate gas

Industrial Technology Research Institute


A method and apparatus provide a receiver with an architecture to regulate a bit error rate of the receiver using an offset based on detecting false transitions in received data. In an embodiment, such false transitions in data may be determined in a bang-bang detector.

In communication systems, an incoming signal may be distorted with noise. In an optical system, for example, the distortion from noise may be due to inherent nonlinear properties of an optical fiber. The noise may cause data errors since a "1" may be taken to be a "0" and vice versa. Enhanced techniques to compensate for such noise may provide improved operational performance.

Dynamic offset compensation based on false transitions


A pressure measurement device includes a housing having an inlet, a transducer coupled to the inlet to generate an electrical signal representative of pressure at the inlet, and a data communication device coupled to the transducer to transmit a wireless signal corresponding to the electrical signal.

Pressure gauges are widely utilized in a myriad of different environments for commercial and industrial applications. Typically, pressure gauges measure pressure and provide an indication of the value. Pressure values are usually displayed in analog form (e.g., by a pointer) or in digital form (e.g., by an LED readout). Gauges displaying values in analog form often include a mechanical pressure transducer, such as a Bourdon tube, that displaces a predictable amount in response to the pressure to which the transducer is exposed. The displacement is translated via a movement to a rotatable pointer that moves opposite a dial of calibrated pressure values. Gauges displaying values in digital form often use an electronic pressure transducer, such as a piezosensor, that generates an electrical signal in response to the pressure to which the transducer is exposed. The electrical signal is then converted to a symbol that is presented on a display.

Wireless transmitting pressure measurement device


A method, system, and computer program product, include tracking eye-reaction of a user each of a plurality of advertisements of an advertisement group on a web page displayed on a display device, calculating an interest of the user for each advertisement of the advertisement group over time based on the tracked eye-reaction, and to assign each advertisement a user engagement value based on the interest, conducting an auction to determine winning advertisements based on advertiser parameters received from a database and the user engagement value of each of the plurality of advertisements, determining at least one time at which to cause the conducting to conduct the auction, and dynamically repopulating the advertisement group with the winning advertisements.

The present invention relates generally to a system for updating and/or distributing advertisement, and more particularly, but not by way of limitation, to a system and method for dynamic updating of advertisement based on a user's evolution of interest, and for dynamic advertisement auctioning for remarketing based upon a user's eye-reaction to prior advertisement within a same content.
It is common to have content with empty slots for advertisements in a web page before the content, in the content, or after the content. The empty slots are populated with a static generation of an advertisement (i.e., a "one-time" population) such that the advertisement does not change after the web page has been loaded. The empty slots are conventionally auctioned away to commercial companies for their ads or advertising agencies for their client's ads.
Conventionally, auctioning for advertisements on a web page is a "one-time", static process. Hence, advertisements once rendered on a page do not get updated with the evolution of interests and/or cognition of a reader.
That is, the conventional techniques have a technical problem in that the conventional techniques do not consider in-session behavior-monitoring of a given user utilizing, for example, eye movement behavior with respect to advertisements shown at an earlier part of given content, and dynamic repetition of auctioning for the same slots previously generated as the user interest evolves over time during reading a web page.

This patent is subject to a terminal disclaimer.

INTERNATIONAL BUSINESS MACHINES CORPORATION


A system of antennas for conserving space and concealing the separate identity of the individual antennas. The antennas may be a radio antenna and a telecommunications antenna. The antennas may have a common base to eliminate separate wires and holes in the vehicle on which they are mounted. The antennas may be housed within the same casing to protect them from the elements and from other harm.

As communication technology advances, more methods of communication become available to consumers. Miniaturization of electronic components for communication methods have made it theoretically possible to have portable cellular telephones. Accompanying this miniaturization has been a reduction in the cost of the systems using these components. This cost reduction has brought the theory to reality, enabling a large number of consumers to afford cutting-edge telecommunication technology, for example, cellular telephones.
Miniaturization and cost reduction have opened up the possibilities for affordable mobile communications. It is now quite common for consumers to have cellular telephones in their vehicles. New mobile communication proposals yet to become readily available to the public include global positioning, obstacle detection systems and collision avoidance systems. Still others have yet to be imagined by even the most inventive minds. Inherent in all of the current, proposed, and yet to be imagined amenities is the need for mobile communication systems to transmit and/or receive information from remote locations to the consumer's vehicles without hard-wire connections. In other words, these systems do or will require antennas on the consumers' vehicles.
The availability of these technological advantages comes, however, with some drawbacks. For example, the antennas for these systems must compete for space on the vehicle. Often, antennas must be separated from obstacles to avoid disruption of their antenna patterns. On motor vehicles, therefore, telecommunication antennas must compete with the other antennas on the vehicle. Currently, cellular phone antennas and radio (i.e., AM/FM) antennas are separated spatially on the vehicle's surface. This spatial separation mandates separate electrical wiring to transmit and receive information via the antennas. Wiring to separate locations requires additional labor and increases the cost of the multiple locations versus a consolidated unit. Moreover, the distinct antenna locations require multiple mountings on the vehicle's surface. This also increases the cost of the system over a consolidated unit and requires multiple holes to be put in the vehicle's surface. One could reduce the need for a cellular phone antenna on the vehicle's surface by using a handheld unit with its own antenna. This arrangement, however, has its own deficiencies. First, according to the TIA/ELA Interim Standard IS-88 (Telecommunications Industry Association 1993), handheld units are limited to transmitting 0.6 watts while a cellular phone mounted on the vehicle's surface, remote from the operator is allowed to transmit three (3) watts (although higher powers may be possible depending on the type of telecommunication antenna used). The added power output of a surface-mounted antenna increases the range and, generally, the communication clarity available. Second, the operator may not have the option of using anything other than a surface-mounted antenna for future telecommunication purposes or systems.
Furthermore, vehicle owners often do not want passersby to know that the vehicle contains a cellular phone, or other variety of telecommunication equipment. Passersby can readily identify cars containing cellular phones due to the distinctive cellular antenna. As not every vehicle has a cellular phone, and usually those that do have other expensive items therein, vehicles with cellular phones may be the target of thieves seeking the phones themselves, or other items likely to be found in vehicles containing cellular phones. This may also apply to other forms of telecommunication and their respective antennas.
Owners therefore would often like to conceal the fact that a vehicle contains a cellular phone or other form of telecommunication.
Thus, the need currently exists for a consolidated antenna system to: reduce the cost of multiple antennas on a vehicle; allow increased transmit power from a cellular telephone antenna or other form of telecommunication antenna; conceal the fact that a vehicle has a telecommunication device therein; and/or reduce the number of holes needed in the vehicle's exterior. The present invention satisfies these needs with a consolidated antenna system that reduces system cost, wiring, and mounting holes while maintaining the advantages of remote surface-mounted telecommunication antennas.


A contactless fingerprint acquisition and processing method, includes detecting and acquiring an object image, converting the object image into a fingerprint image and at least one of identifying and verifying the fingerprint image.

This application relates to fingerprint collection sensors, specifically a non-contact mechanism that works at varying distances away from the finger.
Implementation of biometric data such as fingerprints is becoming increasingly popular. However, conventional implementations of acquiring fingerprint data require either contact or close proximity of the finger near the sensor. In addition, conventional methods do not provide identification and verification of individual fingerprints.

Contactless fingerprint acquisition and processing


A high frequency power amplifier includes an amplification element amplifying a high frequency signal; a duplexer to which an output signal of the amplification element is inputted, the duplexer allowing a signal of a certain frequency band to pass and attenuating signals of other frequency bands; a matching circuit connected between the amplification element and the duplexer; an external terminal connected to the matching circuit; and a passive element connected between the external terminal and a grounding point. The amplification element, the matching circuit, and the duplexer are integrally mounted on a single substrate. The passive element is located outside the substrate.

1. Field of the Invention
The present invention relates to a high frequency power amplifier used for CDMA (Code Division Multiple Access) or LTE (Long Term Evolution) cellular phones, portable terminals or the like, and in particular to a high frequency power amplifier which can realize desired performance at low cost for specified maximum output power conditions of a plurality of specifications.
2. Background Art
High frequency power amplifiers used for CDMA or LTE cellular phones, portable terminals or the like are required to realize a desired ACLR (Adjacent Channel Leakage Ratio) during specified maximum output power with low current consumption. A matching circuit in the high frequency power amplifier needs to be adjusted to achieve such desired high frequency performance (e.g., see Japanese Patent Laid-Open No. 11-127040).


A compliant electrical interconnect having a first component and a second component interlockingly engaged with the first component. Each component has two cantilever arms lockingly engaged and continuously biased against each other. Contact springs are captivated by the cantilever arms providing a contact force for the first and second components.

Conventional spring-loaded contact probes generally include a moveable plunger, a barrel having an open end for containing an enlarged diameter section or bearing of the plunger, and a spring for biasing the travel of the plunger in the barrel. The plunger bearing slideably engages the inner surface of the barrel. The enlarged bearing section is retained in the barrel by a crimp near the barrel's open end.
The plunger is commonly biased outwardly a selected distance by the spring and may be biased or depressed inwardly into the barrel, a selected distance, under force directed against the spring. Axial and side biasing of the plunger against the barrel prevents false opens or intermittent points of no contact between the plunger and the barrel. The plunger generally is solid and includes a head, or tip, for contacting electrical devices under test. The barrel may also include a tip opposite the barrel's open end.
The barrel, plunger and tip form an electrical interconnect between the electrical device under test and test equipment and, as such, are manufactured from an electrically conductive material. Typically, the probes are fitted in cavities formed through the thickness of a test plate or socket. Generally, a contact side of the electrical device to be tested, such as an integrated circuit, is brought in to pressure contact with the tips of the plungers protruding through one side of the test plate or test socket for maintaining spring pressure against the electrical device. A contact plate connected to the test equipment is brought to contact with the tips of the plungers protruding through the other side of the test plate or test socket. The test equipment transmits test signals to the contact plate from where they are transmitted through the test probe interconnects to the device being tested. After the electrical device has been tested, the pressure exerted by the spring probes is released and the device is removed from contact with the tip of each probe. In conventional systems, the pressure is released by moving the electrical device and probes away from one another, thereby allowing the plungers to be displaced outwardly away from the barrel under the force of the spring, until the enlarged diameter bearing the plunger engages the crimp of the barrel.
The process of making a conventional spring probe involves separately producing the compression spring, the barrel and the plunger. The compression spring is wound and heat treated to produce a spring of a precise size and of a controlled spring force. The plunger is typically turned on a lathe and heat treated. The barrels are also sometimes heat treated. The barrels can be formed in a lathe or by a deep draw process. All components may be subjected to a plating process to enhance conductivity. The spring probe components are assembled either manually or by an automated process. The assembly process for these probes is a multiple step process. Considering that probes are produced by the thousands, a reduction in the equipment and the steps required to produce the probes will result in substantial savings.
An important aspect of testing integrated circuit boards is that they are tested under high frequencies. As such, impedance matching is required between the test equipment and integrated circuit so as to avoid attenuation of the high frequency signals. Due to the numerous probes that are used in relatively small area in the socket, the spacing between probes is minimal making impedance matching infeasible. In such situations, in order to avoid attenuation of the high frequency signals, the length of the electrical interconnects formed by the probes must be kept to a minimum. With current probes, when the interconnect length is minimized, so is the spring length and thus spring volume.
A spring's operating life, as well as the force applied by a spring are proportional to the spring volume. Consequently, the spring volume requirements for a given spring operating life and required spring force are in contrast with the short spring length requirements for avoiding the attenuation of the high frequency signals. Since the diameter of the spring is limited by the diameter of the barrel which is limited by the diameter of the cavities in the test sockets, the only way to increase the spring volume for increasing the spring operating life, as well as the spring force, is to increase the overall barrel length. Doing so, however, results in a probe having an electrical interconnect of increased length resulting in the undesirable attenuation of the high frequency signals.
An alternative type of conventional probe consists of two contact tips separated by a spring. Each contact tip is attached to a spring end. This type of probe relies on the walls of the test plate or socket cavity into which it is inserted for lateral support. The electrical path provided by this type of probe spirals down the spring wire between the two contact tips. Consequently, this probe has a relatively long electrical interconnect length which may result in attenuation of the high frequency signals when testing integrated circuits.
Thus, it is desirable to reduce the electrical interconnect length of a probe without reducing the spring volume. In addition, it is desirable to increase the spring volume without decreasing the spring compliance or increasing the electrical interconnect length. Moreover, a probe is desirable that can be easily manufactured and assembled.

Electrical contact probe with compliant internal interconnect


Rifamycin derivatives having the following structure of general formula I (both hydroquinone and corresponding quinone (C1-C4) forms):

This application claims priority to U.S. Provisional Patent Application Ser. No. 60/590,190, entitled "4H-4-Oxoquinolizine Derivatives Having Improved Target Selectivity," filed on Jul. 22, 2004, the entire content of which is hereby incorporated by reference.
This invention relates to compounds of rifamycin origin having antimicrobial activities, their compositions, methods of preparation, and methods for treatment or prevention of infectious disease. More particularly, the rifamycin derivatives of the current invention comprise a rifamycin moiety covalently linked to a linker at the C-3 carbon of the rifamycin moiety and the linker is, in turn, covalently linked to a 4H-4-oxoquinolizine moiety. The invention pertains to the preferred chirality of the linker at its pro-chiral carbon center, which contributes to the antibacterial activities of the compounds. This invention also encompasses chemical processes that address the chirality of the linker and the synthesis of the compounds. The rifamycin derivatives of the present invention are active against drug-resistant microorganisms with reduced frequency of developing mutational resistance.
Rifamycins are natural products with potent antimicrobial activity. Examples of the naturally-occurring rifamycins are rifamycin B, rifamycin O, rifamycin R, rifamycin U, rifamycin S, rifamycin SV and rifamycin Y (Brufani, M., Cerrini, S., Fedeli, W., Vaciago, A. J. Mol. Biol. 1974, 87, 409-435). The therapeutic applications of the naturally-occurring rifamycins are limited due to their poor pharmacokinetics and oral bioavailability, weak activity against Gram-negative pathogens and low distribution into the infected tissues. Chemical modifications result in many semi-synthetic rifamycin derivatives with improved spectrum and pharmacological profiles. Among the semi-synthetic compounds, rifampin, rifabutin and rifapetine have been developed into therapeutic agents and are currently used for the treatment of tuberculosis and other microbial infections (Farr, B. M. Rifamycins, in Principles and Practice of Infectious Diseases; Mandell, G. L., Bennett, J. E., Dolin, R., Eds.; Churchhill Livingstone: Philadelphia; p348-361).
One major liability associated with the current rifamycin class of antimicrobial agents, such as rifampin, however, is their rapid development of microbial resistance. Mutations in their antibacterial target RNA polymerase are mainly responsible for the high frequency of microbial resistance to rifamycins. Thus, there is a need to have new compounds addressing the rifamycin liability. The compounds of the present invention are chemically designed to address drug resistance to both the rifamycin and quinolone class of antibiotics by chemically linking rifamycin and quinolone antibacterial pharmacophores together through a stable bivalent linker. The novel inventive rifamycin compounds exert their antimicrobial activity through multiple antibacterial mechanisms targeting bacterial RNA polymerase, DNA gyrase and DNA topoisomerase IV, and, therefore, they exhibit reduced frequency of resistance, and slow or eliminate development of drug resistance.
Reference is made to PCT application WO 03/045319 A2 that discloses rifamycin derivatives formed by linking rifamycin and a therapeutic drug and the use of them as vehicles for delivering the therapeutic drug.
However, this reference does not describe any drug that is introduced to the C-3 position of a rifamycin molecule. The reference also fails to demonstrate by example that a quinolone antibiotic or its pharmacophore structure is linked to any position of rifamycin molecule.

(R/S) rifamycin derivatives, their preparations and pharmaceutical compositions

Abstract: or its salts, hydrates or prodrugs thereof; wherein a preferred R1 comprises hydrogen or acetyl and a prefered R2 comprises hydrogen, methyl or other lower alkyls; wherein asterik (*) denotes the carbon bearing the chiral center, wherein absolute configuration is assigned as R or S. Methods of preparation of the aforementioned rifamycin derivatives are also described. The compounds exhibit antimicrobial activities, including activities against drug-resistant microorganisms.


A fuel cell arrangement which comprises a fuel cell having a first inlet for a fuel and a second inlet for an oxidizing agent, and comprises a vortex tube having an inlet, a first outlet for heated gas and a second outlet for cooled gas. Here, the first outlet of the vortex tube is fluidically connected to the first inlet or the second inlet of the fuel cell. A fuel cell system may have such a fuel cell arrangement, and a vehicle may have such a fuel cell arrangement or fuel cell system.

For the operation of a fuel cell, it is normally the case that fuel and/or an oxidizing agent are/is held in tanks and under elevated pressure. For the operation of the fuel cell, the fuel and/or the oxidizing agent are/is reduced to a pressure suitable for the fuel cell and are/is supplied to the fuel cell. Since fuel and oxidizing agent must always be present to a sufficient extent for the chemical reaction in the fuel cell, the fuel cell is supplied with more fuel and oxidizing agent than is necessary for the chemical reaction, so that, in a respective recirculation circuit, the fuel and the oxidizing agent are conducted back to the fuel cell.

Fuel cell arrangement having a vortex tube, fuel cell system and vehicle having a fuel cell arrangement


The invention relates to a method for forming a silicate coating on particles and to the particles thus obtained, characterized in that a solution containing silicate is added to a dispersion of uncoated particles having a diameter of less than 50 μm and acoustic excitation occurs.

The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
A wide variety of coated particles are known. They are needed if a particle having particular properties, such as a given luminescence, absorption, color etc., lacks other properties, which are also needed, however. Thus, biological markers can be provided by particles which are particularly readily detected due to their luminescence and easily undergo binding with specific substances, such as enzymes or the like, due to the properties of their shell material. The shells are often organic, which limits applicability.
Also, in particular applications, only a few properties of particles are desired while other properties are disturbing. Thus, there are a wide variety of transparent IR absorbers which at the same time have a good electric conductivity ("transparent conductive oxides", TCO). Often, this conductivity is even retained when particles are incorporated in a matrix, such as a paint, which is the case even if the percolation limit is not reached. This is often undesirable, such as with glazing, because the two-dimensional application on glazing results in conductive surfaces, which adversely affects mobile phones, for example, in a building or house. In such cases, the TCOs or other substances are used as aggregates.
Aggregates, such as additives, fillers, pigments and the like, are required in a wide variety of applications. They confer particular properties, such as a particular desired optical behavior, to a matrix in which they are incorporated or to a larger body to which they adhere chemically or physically. It is important that while the aggregates must provide the desired properties, they must not have negative effects, such as with respect to the stability or biocompatibility or the biological safety and/or safety under food laws.
This is problematic especially when the aggregates cannot be incorporated firmly and at least essentially inaccessible in a matrix, and the material with which the aggregate is to be used additionally is exposed to changing and/or chemically aggressive environments. They may be exemplified by aggregates for fibrous materials, such as cotton. There are aggregates which must remain adhered to the cotton fibers even though the material is exposed to, for example, the acidic environment of transpiration and the like. The same applies to aggregates for, for example, paper fibers, cellulose and the like; there may be mentioned, for example, titanium oxide aggregates as whitening agents. Also problematic are aggregates, such as for printing and other inks, mainly if the printed matter frequently comes into contact with skin, because incorporation in printing inks is not particularly stable as a rule.
An aggregate with a high attractiveness because of its optical properties is indium tin oxide with an Sn content of 7±0.5 mole percent designated for printing in offset and ink-jet printing processes. In order to render this material more attractive beyond its optical properties, it is required to prepare it in a biocompatible form. Here, "biocompatible" does not necessarily mean "safe in terms of food technology", but nevertheless in a form which renders the contact with such materials harmless in accordance with the definition below.
Problems in terms of production technology occur, in particular, when the biocompatibility of pigments to be printed is to be improved, or if pigments having an improved biocompatibility are to be prepared for use in printing without significantly influencing desired pigment properties, such as the particle size. Often, different production processes are required from pigment to pigment in order to obtain desired optical properties and printing properties with sufficient biocompatibility.
Relevant pigments include, for example, indium tin oxide with a tin content of 7±0.5 mole percent and a particle size of smaller than 10 μm. Efficient processes for producing such pigments in a biocompatible form are desirable.
There are a number of property rights which already deal with aggregates. There may be mentioned, for example, EP 0 492 223 A2 which relates to silanized pigments and their use for inhibiting the yellowing of pigmented plastic materials in which the increasing of the stability of pigment surfaces towards the action of air, oxygen, heat and light is addressed, and the chemisorption of silane compounds to pigments is mentioned, wherein the pigment coating is to be effected, in particular, without adding solvents or adding other substances, such as coupling agents or carrier liquids, in an intensive mixer. Further, there may be mentioned DE 198 17 286, which relates to a multilayered pearlescent pigment on the basis of an opaque substrate, wherein this application discusses, inter alia, the pigmenting of papers for bonds and securities and of packagings, as well as the laser marking of polymeric materials and papers; as metal oxides, there are mentioned TiO2, ZrO2, Fe2O3, Fe3O4, Cr2O3, ZnO, (SnSb)O2, Al2O3, mixtures thereof, SiO2.
In this specification, it is proposed to coat mica pigments having a particle size of from about 10 μm in such a way that they exhibit a particularly pronounced color flop, which means that the interference colors of the mica are to depend to a very high extent on the viewing angle. The use thereof in car paints is exemplified.
Further, there may be mentioned EP 0 608 388 B1, which discloses a plate-like pigment having a high luster and high opacity or high transparency, which is prepared in a particular way and provided with a matrix to achieve a luster. Surface-modified pigments in the form of titanium dioxide pigments and a layer of borates of alkaline earth metals and double borates of alkali and/or alkaline earth metals are disclosed in EP 0 641 842 B1. DE 697 23 347 relates to spherical SiO2 particles having a size of from 5 to 500 nm and coated at individual points with metal oxide particles having a size of less than 60 nm.
In addition, DE 100 22 037 A1 relates to IR-absorbing compositions containing transparent thermoplastic polymers and surface-modified oxide particles having a particle size of less than 200 nm and organic near-infrared absorbers, as well as their preparation, use and products prepared therefrom.
EP 0 245 984 A1 describes the coating of TiO2 particles with silicate. The addition of the silicate solution during the coating takes place at a pH value substantially above the isoelectric point of titanium oxide, without any input of additional energy. The pH value varies highly during the coating process. An uncontrollably rapid growth of the coating during the coating process and the coating of particle agglomerates cannot be prevented with this process, which is why the pigment formed must be comminuted again in a further step.
U.S. Pat. No. 6,440,322 B1 describes the coating of iron oxide particles with silicate. In this described process too, the pH value is not kept constant during the coating and lies far above pH 8 during the coating and is adjusted with hydrochloric acid to a pH of 8 after the reaction. No additional energy is input in this coating process either.
EP 1 477 465 A1 describes the coating of glass substrates with a coating material comprising particles of indium tin oxide and particles of silica. In the preparation of the coating material, the indium tin oxide particles are added without previous dissolution or dispersion to a mixture containing water glass and silica particles.
JP 2003-246965 describes the modification of particles of indium tin oxide with tetraethoxysilanes.
DE 697 08 085 T2 describes the coating of oxide particles with silicon dioxide, in which no additional energy input takes place and the coating occurs in a highly alkaline medium at a pH within a range of from 8 to 10. In this coating process, an additional electrolyte is further needed obligatorily. Since the coating takes place in a highly alkaline medium, an uncontrolled growth of the coating occurs. Therefore, the coated particles must be atomized after drying (cf. p. 8, 3rd paragraph).

Silicate coating and method of coating by acoustic excitation


The present invention provides a composition for developing a photoresist containing a carboxyl group (—COOH) and a method of developing a photoresist using the composition. The composition includes: a first solution including a salt containing a monovalent cationic component; and a second solution including a salt containing a bivalent cationic component. The composition for photoresist development is advantageous in that the developing depth of a photoresist can be controlled, and the developed surface of a photoresist is flat, thereby enabling the photoresist to be developed to realize precise three-dimensional packaging.

1. Technical Field
The present invention relates to a composition for photoresist development and a method of developing a photoresist using the same.
2. Description of the Related Art
When a semiconductor or the like is mounted on a printed circuit board, a process of developing a photoresist layer is followed. Such a developing process means a process of removing a photoresist layer. The photoresist layer serves as an insulation layer or protective layer of a printed circuit board. A solder resist is included in a photoresist. Such a photoresist developing process is known as a solder resist opening process. Such a solder resist opening process is necessarily required in order to secure a passage for electrical connection between a chip mounted on a printed circuit board and a wiring layer formed on the printed circuit board.
As a conventional photoresist opening method, buffing, plasma etching, chemical etching or the like is known. Buffing or plasma etching is a method of forming a photoresist layer having a thickness equal to or less than the height of a copper pattern by curing a photoresist and then physically or chemicophysically treating the cured photoresist. Chemical etching is a method of forming a photoresist layer having a thickness equal to or less than the height of a copper pattern by treating the unexposed area (uncured area) of a photoresist with a chemical. The chemical used in a conventional developing method is an aqueous alkali solution. Meanwhile, most conventional developing solutions are prepared using a salt containing a monovalent cation. Particularly, as disclosed in the following Patent document 1, an aqueous solution containing 1 wt % of sodium carbonate (Na2CO3) is used as a developing solution.
Meanwhile, recently, three-dimensional packaging technologies have attracted considerable attention in relation to the provision of various circuit patterns and mounting conditions. In order to use such three-dimensional technologies, a photoresist must be provided with predetermined bumps, and, in order to secure such bumps, precisely-controllable developing technologies are required during a photoresist developing process. For this purpose, conventionally, a partial curing process has been used. However, this partial curing process is problematic in that it is difficult to secure precise bumps and control the developing depth of a photoresist because of the characteristics of developing chemicals used in this process.
As a conventional technology for controlling the developing depth of a photoresist, a method of diluting a developing chemical with water, a method of controlling developing time, or the like, has been used. Here, the developing chemical is an aqueous solution containing a salt having a monovalent cation. The development principle of a conventional developing solution including an aqueous solution containing a salt having a monovalent cation is realized by a process in which sodium (Na) included in the developing solution reacts with a carboxyl group (—COOH) included in a photoresist to obtain —COONa, thus saponifying the photoresist to melt the photoresist. However, due to the characteristics of —COONa, which is hydrophilic, —COONa is rapidly detached from the photoresist by water (H2O) existing therearound, and thus it becomes difficult to control the developing speed of a photoresist. Meanwhile, even when the developing depth of a photoresist is controlled to some degree by diluting a convention developing solution, there remains a problem in that the developed surface of a photoresist is very irregular, and thus a spatial environment for precise three-dimensional packaging cannot be provided.
Patent document 1: Japanese Unexamined Patent Application Publication No. 2011-192692

Composition for photoresist development and method of developing photoresist using the same


The present disclosure provides a fine-grained link adaptation mechanism that allows for link adaptation at a resource block granularity. To this end, the fine-grained link adaptation mechanism can determine the effective signal-to-interference-plus-noise ratio for individual user equipment in a particular cell at the resource block granularity. This way, the transmitter can use the effective signal-to-interference-plus-noise ratio to adapt the modulation and coding scheme at the resource block granularity. The fine-grained link adaptation mechanism can be introduced to a long term evolution (LTE) network without substantial redesign of the LTE network.

Wireless networks are telecommunication networks that use radio waves to carry information from one node in the network to one or more receiving nodes in the network. Cellular telephony is characterized by the use of radio cells that provide radio coverage for a geographic area, with multiple cells arranged to provide contiguous radio coverage over a larger area. Wired communication can also be used in portions of a wireless network, such as between cells or access points. Wireless communication technologies are used in connection with many user equipment, including, for example, satellite communications systems, portable digital assistants (PDAs), laptop computers, and mobile devices (e.g., cellular telephones). Such devices can connect to a network (e.g., the Internet) as long as the user is within range of such a wireless communication technology. Such devices can use connections to the wireless networks to download video data.

Link adaptation based on neighboring cell transmission information


An information communication system for use in a robot communicates a full-color light flux between a transmitting device and a receiving device separated from each other. The transmitting device receives a sensor signal to generate an optical information signal including a color signal based on a sensor identifying information and a brightness signal based on an output level of the sensor signal, and irradiates a light flux (an optical signal) enabling a user to recognize it through the optical information signal from a color LED. The receiving device is arranged away from the transmitting device, in which an analysis unit generates an identifying signal and an output level of a sensor on the basis of color information and brightness information extracted from an image processor from image data including the optical information signal imaged by an imaging unit.

1. Field of the Invention
The present invention relates an information communication system for use in a robot converting an information signal into an optical signal to enable communication between constituent parts of the robot.
2. Description of the Related Art
Conventionally, in manufacturing industries on down, manufacturing assembly and checking automated by industrial robots have progressed. In recent years, even in a business field dependent on human actions and human services up to this day, robotization which is conducted by an assistance robot, performing nursing help and assistance for human work and having different uses in comparison to the industrial robot, has been expected to be put into practice.
It is required for such a robot to mount a variety of sensors and acquire information relating to operations to control it for performing accurate operations. For example, for a robot operating in a house, office or public institute, namely, for a "robot coexistent with human being", it becomes important not only to perform a mere mechanical operation but also to allow a user (side receiving service or operator) to intuitively recognize an operation condition of the robot visually and audibly. For instance, in work by which the user transfers articles to the robot, after transferring the articles manually to the gripping part of the robot, the user has to quickly recognize whether or not the robot surely grasps the articles when the user takes off the articles.
To transfer the articles from the gripping part of the robot, the robot needs a plurality of sensors, in response to each operation, for instance, sensors to operate the gripping part depending on the firmness and shape so as not to break the articles in gripping them. The sensors monitor the start and end of the operation, and a presentation mechanism is also required to notify the monitored condition to the user.
A large number of signal lines are provided to transmit sensor signals output form the sensors to a control unit and an interface, respectively. For example, if the gripping part is disposed at a tip of an arm having a joint, the signal lines are wired in order to be laid along with the inside and outside of the arm.
The case of the laying of the large number of signal lines makes the arm thick and requires that the arm becomes so strong to bear the increase in weight due to the signal lines. If it is structured that the arm has a joint to be bent or expanded, an arm operation, breaking prevention and the like have been taking into account, drawing the wiring of the signal lines becomes hard and its structure becomes complicated.
To solve such a problem, JP-A 2005-94744 (KOKAI) presents a control system planning to save lines by reducing the number of the signal lines connecting the main control device of the robot and each set of equipment.
This JP-A 2005-94744 (KOKAI) discloses a technique dividing a frequency band of a signal propagated on a single signal line into a plurality and assigns frequency bands different from one another to a plurality of sets of equipment to be connected to the signal lines. According to the technique, signals different in frequency band having been input to each set of the equipment, respectively, the control system can independently control each set of the equipment. To conduct such independent control, the robot needs many sensors to dispose at each constituent part. The robot has to draw the wiring connecting the sensors to the control unit (sensor signal processor).
In the aforementioned technique, dividing the frequency band of the signal on the single signal line into the plurality results in reducing the number of the signal lines; however, not a few number of the signal lines remain yet. Therefore, providing the sensors at the constituent parts disposed at the tip of the arm with a multiple-joint poses a problem on the technique in drawing the wiring in the same manner as the case before. Accordingly, the larger the number of the joints becomes, the heavier a load is put on the wiring for each drive, and the problem on disconnections or the like has to be taken into account. If the constituent parts having different functions for the arm are structured to be displaceable by detaching, connectors and the like should be disposed halfway the signal lines, and the problem on the attenuation of the sensor signals are produced.
Further, communications among the constituent parts with radio equipment not requiring signal lines mounted are possible approach. However, in the case of intending to make a large number of radio communications within a limited region, there is the possibility that accurate communications are not made because of crosstalk, interference or overlapping of high-frequencies depending on a circumstance and a situation in the use places, and the desired number of robots cannot be operated simultaneously sometimes. If the robots are those for the nursing help, moving places including medical institutes such as hospitals, in the case in which the robots become generation sources of electromagnetic waves, the control system has to make the robots not affect on medical equipment.

Information communication system for use in robot


A drain inlet is disclosed for draining of liquid from an area in which it has collected. The inlet includes a body having a chamber therein for receiving the liquid from the area and an opening at the bottom of the body for draining the liquid from the chamber. The body is formed by a plurality of side walls each of which has a lateral cross section which is greater than the next adjacent lower side wall which permits a substantial reduction in the height of the body. The bottom of the side walls is connected to the top of the next lower side wall by a laterally extending wall which has a plurality of elongated slotted openings so that the fluid to be drained flows upwardly through these openings, into the chamber and out of the chamber through the opening at the bottom of the body to drain the area. The total cross sectional area of the openings in the walls through which the liquid flows is at least as great and preferably substantially greater than the cross sectional area through the opening at the bottom of the body which results in a substantial reduction in clogging of the openings by debris which may be present in the liquid being drained.

The present invention is directed to a drain inlet for draining a fluid from an area.
It is frequently desirable to drain fluids, such as standing water from areas in which it accumulates for example during wet weather in the spring or during periods of flood. For example, it is desirable to drain the water from low spots or terraces in agricultural fields to improve the crops and/or the soil when drained.
In the past, such drainage has been accomplished by way of drain tile which is buried beneath the surface of the soil and upstanding inlets which are spaced periodically along the length of the tile and which open above the soil surface and into the area where the water has accumulated to drain the area through the buried drain tile. In such systems some form of grate or screen is usually positioned at the opening to the upstanding drain tile inlet in order to prevent debris which may be in the water from flowing through the inlet and into the drain tile where it can rapidly clog the drain tile and prevent further drainage.
Various screen or grate devices have been employed in the past for this purpose. However, even if not plugged by debris, such prior screening devices generally reduce the flow volume of the water being drained at any given time from the potential flow volume which could be drained without the screen or grate.
In order to overcome this reduction in volume problem, in one prior drain inlet a cylindrical generally constant diameter upstanding pipe is positioned on the drain tile inlet. Such pipe has holes of approximately three quarters to one inch in diameter in bands around the pipe, and also may have a wire cage on the top to let water into the pipe where it can be transported to the buried drain tile. In order to provide a sufficient number of drain holes in the pipe to produce a total cross sectional area of drain holes which is at least as large as the cross sectional area of the pipe and drain tile inlet to maximize the flow volume through the pipe, the cylindrical pipe must extend four to five feet above the soil level. And, because each of the holes is relatively small and because the holes extend radially through the wall of the pipe, the flow rate through each of the holes is relatively high. This results in debris in the water which is to be drained to be drawn to and cover the holes due to the suction produced by the high flow rate through the holes. Moreover, the efficiency of such relatively tall pipe drain inlets is further diminished as the water level drops in the area being drained, because the water level will drop below the drain holes in the upper part of the pipe and, therefore, those holes will no longer function to provide drainage. Another disadvantage of these relatively tall prior pipe drain inlets is that they must be avoided during seeding and harvesting and it is generally necessary to seed and harvest around them because seeders and harvester combines cannot be elevated to a sufficient height during seeding and harvest to be able to pass over the relatively tall drain pipes.
The drain inlet of the present invention overcomes these several disadvantages of the last mentioned prior cylindrical upstanding drain pipe inlets. In the present invention water to be drained from an area flows upwardly into the drain inlet of the present invention through a plurality of elongated slots in laterally extending walls which separate adjacent side walls of the body of the drain inlet. The total cross sectional area of the slots is at least as great and preferably greatly exceeds the cross sectional area of the discharge from the drain inlet of the invention. This insures that the water flow volume into the drain inlet of the present invention is at least as great as the flow volume which can be discharged from the drain inlet even if some of the openings might become non-functional for one reason or another. Also because of the large cross sectional area of the slots, the flow rate though the slots is substantially reduced, thereby minimizing the collection of debris at the slots and the clogging of the slots by such debris. Thus, less time and hassle is involved in wading out into ponds to clean debris out of the openings than was needed with the relatively small holes of the prior drain inlets which was a nuisance and unpleasant task often done under very cold and wet conditions. Moreover, faster drainage of the standing water may be accomplished which is better for the crops and the soil. Also, because of the ability of the present invention to substantially maximize the flow volume through the drain inlet, it is no longer necessary as in the prior art that the drain inlet body stand as tall as it must to insure adequate flow volume. Therefore, the height of the drain inlet may be substantially shortened to a height which may be easily avoided by, for example combines during harvest most of which have heads which can be elevated three or more feet above the level of the ground. Still another advantage of the positioning of the openings in the drain inlet of the present invention in laterally extending walls is that the flow of the liquid from the pond into the drain inlet is upward, and any debris that may be trapped on the downwardly facing openings tends to fall away by gravity both during the draining procedure and after the pond has been drained. Thus, the openings of the drain inlet of the present invention are relatively self cleaning. Still another advantage of the present invention is that the amount of residue or debris that enters the buried drain tile is substantially reduced. This reduces the amount of BOD and nitrates in the water and the possibility of potential clogging and need to clean out or replace the buried drain tile.
In one principal aspect of the present invention, a drain inlet for draining a fluid from an area comprises a body having a chamber therein for receiving the fluid from the area and an opening adjacent the bottom of the body for draining the fluid from the chamber. At least two side walls form the body and are spaced from each other in the direction of the height of the body, the side wall closest to the opening adjacent the bottom of the body being smaller in lateral cross section than the lateral cross section of the next adjacent side wall which is farther from the opening. A wall extends laterally between the two side walls, and an opening is positioned in the laterally extending wall, whereby the fluid flows upwardly through the opening in the laterally extending wall and into the chamber, and out of the chamber through the opening adjacent the bottom of the body to drain the area of the fluid.
In another principal aspect of the present invention, a plurality of the openings are located in the laterally extending wall.
In still another principal aspect of the present invention, the total cross sectional area of the openings in the laterally extending wall is at least as great as the cross sectional area of the opening adjacent the bottom of the body.
In still another principal aspect of the present invention, the opening in the laterally extending wall is an elongate slot.
In still another principal aspect of the present invention, an upstanding member is positioned around the opening in the laterally extending wall.
In still another principal aspect of the present invention, the upstanding member is a flange.
In still another principal aspect of the present invention, a cover is positioned adjacent the uppermost of the side walls.
In still another principal aspect of the present invention, ribs are on the cover.
In still another principal aspect of the present invention, the cover is generally imperforate.
In still another principal aspect of the present invention, the cover has openings through which the fluid also flows into the chamber.
In still another principal aspect of the present invention, the drain inlet includes a high visibility component.
In still another principal aspect of the present invention, ribs are positioned on the side walls.
In still another principal aspect of the present invention, the laterally extending wall extends between the top of the side wall adjacent the opening adjacent the bottom of the body and the bottom of the next adjacent side wall which is farther from the opening.
In still another principal aspect of the present invention, the drain inlet comprises a plurality of the laterally extending walls and side walls, whereby the body increases in cross section from the bottom to the top thereof, each laterally extending wall extends laterally between the top of one side wall and the bottom of the next upwardly adjacent side wall. A plurality of openings are located in each laterally extending wall, the openings are elongated slots and, the total cross sectional area of the slots is at least as great as the cross sectional area of the opening adjacent the bottom of the body. A cover is located adjacent the uppermost of the side walls.
These and other objects, features and advantages of the present invention will be more clearly understood through a consideration of the following detailed description.


There is provided a large capacity memory such as a DRAM and an SDRAM n which bonding pads PS and PD are not located at the center, but are displaced from the center between memory array regions UL and UR, disposed on the upper side of a four-bank structure of banks 0 through 3, and memory array regions DL and DR, disposed on the lower side thereof. Secondly, the disposition of the bonding pads PS and PD is staggered on the right and left such that the right half bonding pads PD are shifted up relative to the left half bonding pads by about 30 μm. Only a sense amplifier, a column decoder and a main amplifier, which need to be near to the memory array regions DL and DR, are disposed between the bonding pads PS and PD, and the lower memory array regions DL and DR, and further indirect peripheral circuits are disposed on the upper side of the bonding pads PS and PD.

The present invention relates to a technology for laying out semiconductor devices and more specifically to a technology effectively applicable to the disposition of pads for efficiently laying out a large capacity memory, such as a DRAM and a synchronous DRAM (SDRAM).
The technological problem in DRAMs and SDRAMs which the inventor has examined is that the number of bits tends to be multiplied from ×4 to ×16 and ×32 and the number of pads tends to be also increased. For instance, while the number of input/output pins in a 64 M-bit DRAM (×4, ×8 and ×16 have been realized by a bonding option) is 54 in the package, the DRAM requires about 70 pads as internal pads, including normal signal pads, such as address, clock and data signal pads, power source pads, experimental pads and bonding option pads (for switching ×4 through ×16 and for switching the number of banks). It also requires predetermined pad dimensions and spaces therebetween, and it has become difficult to array the pads in a row for the LOC method gradually in the shrink generation. Even if they can be arrayed in a row, it has become difficult to assure large channel and power source bus regions between them in their gap.
A step-down system or a voltage regulator is often adopted in recent high-integrated memories, so that a variety of power source lines are required within a chip.
They include VDD, VSS, VDDQ and VSSQ lines as the external power source lines, and VPERI (for a peripheral circuit), VDL (for a memory array), VPP (for a boost word driver) and VBB (for biasing an array substrate) lines as the internal power source lines. Still more, the power source lines may be divided into those for the memory arrays (VDDA, VSSA), those for the general peripheral circuits (VDD, VSS) and those for the input circuits (VDDI, VSSI) as measures to counter noises. Thus, it has become difficult to dispose the pads adequately due to the increase in the number of the pads owing to the multiplication of bits and the variety of power source lines which have come to be required due to the high integration in memories, such as the DRAM and SDRAM.
It is noted that an example of the technology related to large capacity memories, such as the DRAM and SDRAM, is described in "Advanced Electronics 1-9, Super LSI Memory" published by Baifukan Co., Ltd. on Nov. 5, 1994.
Japanese Patent Laid-open No. 116865/1991 has disclosed a semiconductor memory device in which direct peripheral circuits are disposed in a region between two memory cell arrays along the respective memory cell arrays, in-direct peripheral circuits are disposed in a region between the direct peripheral circuits along one direct peripheral circuit, external terminals are disposed in the region between the direct peripheral circuits along the other direct peripheral circuit and a substrate voltage generating circuit is disposed in a region between the indirect peripheral circuit and the external terminal.
U.S. Pat. No. 5,579,256 (corresponding to Japanese Patent Laid-Open No. 134568/1998) has disclosed a semiconductor device in which bonding pads, a voltage converter, a substrate voltage generating circuit and others are disposed at the center part of the chip.
U.S. Pat. No. 5,473,198 (corresponding to Japanese Patent Laid-open No. 350052/1994) has disclosed a semiconductor device in which axially symmetrical data input/output pads are disposed in two rows in parallel at the center part of the semiconductor chip.
U.S. Pat. No. 5,640,362 (corresponding to Japanese Patent Laid-open No. 128973/1997) has disclosed a synchronous semiconductor memory device having a plurality of data input/output pad groups 20 positioned at the right and left sides based on the center of a semiconductor chip 100, disposed in a row horizontally between upper and lower memory bank arrays 0 through 7 and having the same number with the memory array banks 0 through 7 to input/output information to/from the memory array banks 0 through 7.
U.S. Pat. No. 5,619,472 (corresponding to Japanese Patent Laid-Open No. 139287/1996) has disclosed a center pad disposed type semiconductor memory device in which an IO pad array, i.e., a first pad array, is disposed between a core block 1 and a core block 2 and an address pad array, i.e., a second pad array, is disposed between a core block 3 and a core block 4.
U.S. Pat. No. 5,627,792 (corresponding to Japanese Patent Laid-Open No. 125143/1996) has disclosed a semiconductor memory device in which respective pins (power source pins, ground pins, data input/output pins, control system signal pins, address system signal pins) of a lead frame are connected to bonding pad groups disposed along a center line in the center part of a semiconductor substrate by bonding wires 55.


A method and apparatus for directing an aim light through a window of an image reader. The window has a cylindrically curved section. The aim light impinges on a portion of the cylindrically curved section of the window prior to partially passing through the window. A first amount of the aim light is passed through the window, and a second amount of the aim light is reflected into the cavity resulting in reflected aim light. The reflected aim light is directed away from the imaging assembly such that no or substantially no reflected aim light impinges on the imager of the imaging assembly.

Presentation imaging barcode readers typically have a window to protect the internal opto-mechanics, an imager, an illumination source, and an aiming light which visually indicates the imaging axis of the imager. Typically, the aiming light is concentric or near concentric with the central axis of the field-of-view of the imager though the usable range of the imager, so as to have minimal parallax between the aim light and the central axis. However, the window can internally reflect some of the aiming light back to the imager, thereby impairing the function of the imager when capturing and reading an image of the intended target. This is often referred to as "stray light". In particular, the stray light appears on the captured image as a light artifact 14 separate from the image of the aim light 12 on the target 10, as shown in FIG. 1. This light artifact can appear bright enough that the barcode reader algorithm reads the light artifact as the aim light on the target, in which case the barcode may not read the correct or intended target. This problem is particularly acute with barcode pick lists. Additionally, in barcode readers utilizing off-axis illumination, illumination sources are separated from the imaging axis in location and angle. This off-axis illumination benefits the decode of specularly reflective barcodes but creates specific mechanical constraints on the window shape and size.
Accordingly, there is a need for an improved technique for minimizing these light artifacts due to stray light artifacts caused by the window of a barcode reader.
Skilled artisans will appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help to improve understanding of embodiments of the present invention.
The apparatus and method components have been represented where appropriate by conventional symbols in the drawings, showing only those specific details that are pertinent to understanding the embodiments of the present invention so as not to obscure the disclosure with details that will be readily apparent to those of ordinary skill in the art having the benefit of the description herein.

Apparatus and method for reducing the effect of aim light aberrations in a barcode reader


To place a muffler in a front area to make it suitable for an off-road motorcycle, A down frame extending downward obliquely from a head pipe ahead of an engine and a lower frame connected with its lower end, extending backward under the engine, are provided. A muffler is located in the vicinity of the joint between the down frame and the lower frame where its rear surface is curved forward in a convex pattern along the down frame and the lower frame. An exhaust pipe extending from a cylinder head is almost S-shaped as seen sideways and its forward curved portion and lower backward curved portion are vertically arranged with its lower end connected with a lower portion of the muffler.

A motorcycle exhaust structure is known, wherein a main frame extending downward obliquely and backward from a head pipe supporting a front wheel is provided. A V-type engine is held under the main frame. An exhaust pipe extending from a cylinder of the engine is connected to a muffler divided into two portions before and after an oil pan under a crankcase. The rear muffler portion is larger than the front muffler portion (see JP-A No. 2004-26007).


A method of forming an anti-tamper mesh on an electronic device. The method includes forming at least one terminal on the electronic device and forming a conductive mesh on at least one surface of the electronic device, wherein the conductive mesh is in electrical contact with the terminal, and wherein the terminal facilitates electrical conduction between the conductive mesh and an electrical detection circuit.

Anti-tamper ("AT") protection is employed so that it is very difficult to reverse engineer or alter the function of electronic hardware (e.g., computer processors, integrated circuits, multi-chip modules, etc). For some commercial applications, designers often spend vast sums of money to develop a "next generation" circuit. These companies often wish to deter, or at least hamper a competitor's reverse engineering efforts. The motivation in this case is to protect valuable intellectual property. Military and Government users also have a strong interest in AT protection. When new military hardware is fielded, often the consequences of capture are not fully understood by the designer of the hardware. Similarly, the combat loss of any one of a thousand pieces of sensitive, high-tech military hardware could do irreparable damage to national security.
Most AT is categorized as either passive or active. In each case, the intent is to delay, prevent or stop tampering and potential reverse engineering of an electronic circuit. Passive AT is currently the most widespread method of deterring an opponent from reverse engineering or spoofing an electronic circuit. Current passive AT arrangements include encapsulation or various types of conformal coatings such as epoxies. Methods to defeat common encapsulants are well documented.
AT standards have been defined according to the Federal Information Protection Standard (FIPS) 140-2. The standard describes the requirements for four levels of protection. For the standards for multi-chip, embedded modules, Level 1 calls for standard passivation techniques (i.e., a sealing coat applied over the chip circuitry to protect it against environmental or other physical damage). The standard describes that Level 2 can be achieved using anti-tamper coatings or passive AT. Level 3 may use passive AT if tampering will likely destroy the module. Level 4 requires the use of active AT technologies.
Layered anti-tamper arrangements are also employed in which alternating layers of passive AT with active AT yields a synergy in probing difficulty. With active AT methods, a protected circuit will take some action when unauthorized activities are detected. Any number of events can trigger a programmed circuit response. Examples of active triggering arrangements include: voltage, photon detection, acceleration, strain, thermal, chemical attack, and proximity or tamper-respondent enclosures. A tamper-respondent package can theoretically detect probing by proximity detection or by an external activity mutilating an active circuit, exterior to what is being protected. The response of an active AT circuit upon triggering is also widely variable. For example, zeroization may be employed in which critical memory cells or an entire die can be erased. Similarly, a response can trigger overwriting of some or all of a memory die. Another detection response is to physically obliterate a critical circuit element or elements.

Methods for forming an anti-tamper pattern


A high frequency SAW device and the substrate thereof are disclosed. The disclosed high frequency SAW device does not need to use the conventional and expensive sapphire substrate as its substrate. Besides, the disclosed substrate for a high-frequency SAW device can replace the conventional sapphire substrate in the use of the substrate for a high frequency SAW device. The disclosed high frequency SAW device comprises: a substrate; a first buffering layer forming on the surface of the substrate; a second buffering layer forming on the surface of the first buffering layer; a piezoelectric layer forming on the surface of the second buffering layer; an input transformation unit; and an output transformation unit, wherein the input transformation unit and the output transformation unit are formed in pairs on the surface of or beneath the piezoelectric layer.

1. Field of the Invention
The present invention relates to a high frequency surface acoustic wave device and the substrate thereof and, more particularly, to a high frequency surface acoustic wave device, which does not require the conventional and expensive sapphire substrate as its substrate.
2. Description of Related Art
Please refer to FIG. 1A and FIG. 1B, wherein FIG. 1A is a perspective view of the conventional high frequency surface acoustic wave device and FIG. 1B is a cross-section view taken along the A-A′ plane of FIG. 1A. As shown in FIG. 1A and FIG. 1B, the conventional high frequency surface acoustic wave device 1 comprises: a substrate 11; a piezoelectric layer 12 forming on the surface of the substrate 11; an input transformation unit 13; and an output transformation unit 14. The input transformation unit 13 and the output transformation unit 14 are formed in pairs on the surface of the piezoelectric layer 12. The input transformation unit 13 and the output transformation unit 14 are both interdigital electrodes, and thus an interdigital transducer is formed. Besides, in the conventional high frequency surface acoustic wave device 1, substrate 11 of the high frequency surface acoustic wave device 1 is a sapphire substrate. The piezoelectric layer 12 is a ZnO, AlN, LiNbO3 or LiTaO3 film, having the thickness preferably between 0.1 μm and 10 μm. Moreover, the input transformation unit 13 and the output transformation unit 14, which are formed in pairs on the surface of the piezoelectric layer 12, are made of aluminum, with their line width being between 0.1 μm and 5 μm.
However, since other opto-electronic applications, such as a light emitting diode, also require the sapphire substrate as the substrate thereof, the price of the sapphire substrate increases a lot, and the supply of the sapphire substrate to the market is not stable, either. As a result, by using the sapphire substrate as its substrate, the manufacturing cost of the conventional high frequency surface acoustic wave device cannot be lowered, and the manufacturing process may also be forced to halt, due to the sapphire substrate often becoming out of stock.
Therefore, a high frequency surface acoustic wave device that can remove the requirement of the expensive sapphire substrate as its substrate is required, for lowering the manufacturing cost of a high frequency surface acoustic wave device.

High frequency surface acoustic wave device and the substrate thereof


According to the invention, the loose coal is displaced from the peaks to the valleys of the waves on the narrow, long coal cake and is beaten down on the coal cake. The inventive device comprises at least one scraper (12) and at least one vertically movable impact plate (13) that are disposed one behind another and are fitted with a connection (7) to a holder. Furthermore, means are provided for generating a relative movement between the scraper (12) and the impact plate (13) and between the scraper (12) and a stamping form. The scraper (12) and the impact plate (13) are interconnected by means of a device frame (14) so as to form a structural unit (6) that is connected to the holder. Preferably, the structural unit (6) can be moved along the stamping form and is equipped with a drive unit. For this purpose, the holder encompasses a guide that extends along the stamping form as well as a carriage or a car which can be slid or moved on said guide and to which the unit (6) is connected with the aid of a boom.

The invention relates to a method for removing loose coal on wavy surfaces of long, narrow coal cakes that have been compacted by stamping and are used for coking by scraping off the loose coal.
In addition, the invention relates to a device for accomplishing the method.
To compact coal with a high content of volatile constituents, granular coal is filled into molds and compacted there by means of stamping. Stampers are used which have to be disposed spaced apart due to structural constraints and accordingly are not able to work the entire cross-section of the coal cake. Consequently, at the end the surface is not uniformly compacted; wavy regions are formed with loose lying coal on peaks and tamped coal in valleys.
Since the loose coal is swirled around the coke oven by the gas flows during the coking process, causing heavy contamination there, it has to be removed from the coal cake beforehand.
In the case of the aforementioned method known through usage, when the coal cake is displaced into the coke oven, the loose coal is pushed off the coal cake out to the sides by means of a plow-like scraper, which is intended to set up a defined spacing between coal cake and oven ceiling, and falls into chutes installed next to the coal cake. A conveyor transports said coal away to be re-processed. The rest of the loose coal remains on the surface of the coal cake.

Method and device for removing loose material on wavy surfaces of stamped coal used for coking


A new and distinct cultivar of Anemone plant named ‘IFANFA’, characterized by its upright and uniform plant habit; moderately vigorous to vigorous growth habit; early and freely flowering habit; long flowering period; large single flowers that are reddish purple in color; and good garden performance.

The present invention relates to a new and distinct cultivar of Anemone, botanically known as Anemone hupehensis and hereinafter referred to by the name 'IFANFA'.
The new Anemone plant is a product of a planned breeding program conducted by the Inventor in Heerhugowaard, The Netherlands. The objective of the breeding program is to create new vigorous and fast-growing Anemone plants with numerous attractive flowers.
The new Anemone plant originated from a cross-pollination made by the Inventor in July, 2017 in a controlled greenhouse environment in Heerhugowaard, The Netherlands of a proprietary selection of Anemone hupehensis identified as code number 148-14-k020-11, not patented, as the female, or seed, parent with a proprietary selection of Anemone hupehensis identified as code number 148-12-k002-01, not patented, as the male, or pollen, parent. The new Anemone plant was discovered and selected by the Inventor as a single flowering plant within the progeny of the stated cross-pollination in a controlled greenhouse environment in Heerhugowaard, The Netherlands in August, 2018.
Asexual reproduction of the new Anemone by in vitro meristem culture in a controlled environment in Heerhugowaard, The Netherlands since August, 2018 has shown that the unique features of this new Anemone plant are stable and reproduced true to type in successive generations.


There is disclosed an oral composition including an organosilicon-type quaternary ammonium salt immobilized on a water-insoluble solid carrier. In particularly, an oral composition in an aqueous system according to the present invention includes an organosilicon-type quaternary ammonium salt immobilized on a water-insoluble solid carrier in combination with at least one surfactant selected from the group consisting of polyoxyethylene-polyoxypropylene block copolymers and alkylolamides as a stabilizing agent; at least one thickening agent selected from the group consisting of nonionic thickening agents and cationic thickening agents; and optionally at least one alcohol selected from the group consisting of ethanol, propanol and isopropanol as a dispersing agent.

It is well known that organosilicon-type quaternary ammonium salts immobilized on water-insoluble solid carriers (hereinafter referred to as organosilicon-type immobilized bactericides) have antibacterial activity. The bactericides of this type have been used as antibacterial agents for fiber treatment, as water treatment agents or as antibacterial agents to be incorporated into plastics (see, e.g., JP-A 177284/1987, JP-A 196810/1991 and JP-B 019860/1977). The application of organosilicon-type immobilized bactericides has not yet, however, been proposed in the field of oral hygiene.
In the field of oral hygiene, it is well known that conventional water-soluble quaternary ammonium compounds such as cetylpyridinium chloride or benzethonium chloride can be stably blended into dentifrice (see, e.g., JP-A 85310/1986 and U.S. Pat. No. 5,035,880). There is, however, no disclosure of water-insoluble immobilized bactericides in any literature of this field.
In general, organosilicon-type immobilized bactericides have a cationic character to react with any anionic ingredient, such as a foaming agent or a thickening agent, which is usually used in conventional oral compositions, thereby causing a significant decrease in their antibacterial activity. Further, organosilicon-type immobilized bactericides in particulate form have a tendency to aggregate in an aqueous system, so that these particles can hardly be dispersed, thereby making it difficult to attain uniform blending of these bactericides into an aqueous oral composition. Therefore, when an organosilicon-type immobilized bactericide is used in an aqueous system, it is necessary to devise some means for stabilization of this bactericide.


One embodiment sets forth a method for assigning priorities to kernels launched by a software application and executed within a stream of work on a parallel processing subsystem that supports dynamic parallelism. First, the software application assigns a maximum nesting depth for dynamic parallelism. The software application then assigns a stream priority to a stream. These assignments cause a driver to map the stream priority to a device priority and, subsequently, associate the device priority with the stream. As part of the mapping, the driver ensures that each device priority is at least the maximum nesting depth higher than the device priorities associated with any lower priority streams. Subsequently, the driver launches any kernel included in the stream with the device priority associated with the stream. Advantageously, by strategically assigning the maximum nesting depth and prioritizing streams, an application developer may increase the overall processing efficiency of the software application.

Field of the Invention
Embodiments of the present invention generally relate to general purpose computing and, more specifically, to techniques for sharing priorities between streams of work and dynamic parallelism.
Description of the Related Art
A typical parallel processing subsystem, that may include one or more graphics processing units (GPUs), is capable of very high performance using a relatively large number of small, parallel execution threads on dedicated programmable hardware processing units. The specialized design of such parallel processing subsystems usually allows these subsystems to efficiently perform certain tasks, such as rendering 3-D scenes or computing the product of two matrices, using a high volume of concurrent computational and memory operations.
To fully realize the processing capabilities of advanced parallel processing subsystems, subsystem functionality may be exposed to application developers through one or more application programming interfaces (APIs) of calls and libraries. Among other things, doing so enables application developers to tailor a software application executing on a central processing unit (CPU) to optimize the way parallel processing subsystems function. In one approach to developing a software application, the software application developer may divide work included in the software application into streams of work components (e.g., computational and memory operations). Each stream may be executed concurrently on the parallel processing subsystem. More specifically, work components included in different streams may run concurrently and may be interleaved. In contrast, within each stream, a sequence of work components executes in issue-order on the parallel processing subsystem.
The parallel processing subsystem may schedule the execution of the work components using a variety of techniques depending on the functionality included in the parallel processing subsystem. Two features that may be included in advanced parallel processing systems are support for prioritizing work components and preemption of currently executing computation work components. For example, a parallel processing subsystem that supports prioritization may be configured to schedule work components in priority-order. And a preemption-capable parallel processing subsystem may be configured to preempt a lower-priority computational work component executing on a parallel processing subsystem resource in favor of a higher-priority computational work component.
Typically, a parallel processing subsystem that includes prioritization functionality supports a limited set of priorities—referred to herein as a "set of valid device priorities." In one approach to exposing prioritization capabilities, an API included in a software stack enables the software application to assign a desired stream priority to a stream. An API driver (also included in the software stack) then maps the desired stream priority to a device priority included in the set of valid device priorities. Further, the API driver may store the device priority in a memory resource associated with the stream. Subsequently, if the software application requests the launch of a work component within the stream, then the API driver may request that the parallel processing subsystem launch the work component with the device priority associated with the stream.
Advanced parallel processing subsystems may also support dynamic parallelism. Dynamic parallelism allows a "parent" work component executing on the parallel processing subsystem to launch a "child" work component on the parallel processing subsystem. The parallel processing subsystem may also enable to "parent" work component to optionally synchronize on the completion of the "child" work component. Further, the parallel processing subsystem may enable the "parent" work component to consume the output produced from the "child" work component. In some implementations, the parallel processing subsystem performs the launching, synchronization, and consumption of the results of a "child" work component without involving the CPU.
Some parallel processing subsystems support multiple levels of nested "child" launches, where each subordinate launch executes at a new level. In other words, the "parent" work component executing at a first level may launch a first "child" work component. The first "child" work component executing at a second level may then launch a second "child" work component. The second "child" work component executing at a third level may then launch a third "child" work component, and so on. Because of resource limitations, such as the memory required by the parallel processing system to support each new level, the parallel processing subsystem will typically define a max nesting depth (N). Notably, the max nesting depth N is the maximum number of work components in the chain (and, therefore the maximum number of levels). For example, if a "parent" work component launches a first "child" work component and then the "first" child work component launches a "second" work component, then the nesting depth would be three (N=3). Any launch of a work component which would result in a "child" kernel executing at a deeper level than the maximum nesting depth will fail.
Dynamic parallelism usually requires that a "parent" work component is able to synchronize on any "child" work components that the "parent" work component launches. However, if executing the "parent" work component were to completely occupy the parallel processing subsystem resources, then the "child" work component would be unable to execute. Consequently, the "parent" work component would be unable to synchronize on the "child" work component. To avoid synchronization problems, the parallel processing subsystem is typically configured to ensure that the "child" work component receives enough resources to fully execute. In particular, the parallel processing subsystem is typically configured to give preference to the "child" work component whenever there is a resource contention between the "child" work component and the "parent" work component.
To ensure preferential treatment for the "child" work component, the parallel processing subsystem typically uses on or more of the valid device priorities mentioned above. More specifically, the parallel processing subsystem assigns a "child" work component a device priority that is one higher than the "parent" work component. Because each "child" work component may also launch nested "child" work components, to support a max nesting depth of N, the parallel processing subsystem requires (N−1) valid device priorities for child work components.
In one approach to accommodating dynamic parallelism in conjunction with prioritizing streams, the API driver reserves (N−1) valid device priorities to support a fixed maximum nesting depth of N. Further, the API driver is configured to disregard the device priority associated with a stream when launching a "parent" work component within the stream. In particular, upon receiving a request to launch a "parent" work component, the API driver launches the "parent" work component at the lowest valid device priority.
One drawback to this approach to prioritizing work is that by reserving (N−1) valid device priorities, the number of valid device priorities available for prioritizing streams is reduced by (N−1). And reducing the number of device priorities available for prioritizing streams may reduce the ability of application developers to optimize the performance of software applications. For example, to tune a software algorithm that performs video decoding and encoding using a pipelined workflow with M stages, an application developer could strategically allocate the work components for each stage into M prioritized streams. More specifically, to reduce the likelihood that a particular frame is starved for resources by subsequent frames, the second stage could be prioritized higher than the first stage, the third stage could be prioritized higher than the second stage, and so on. If a parallel processing subsystem were to support less than M device priorities for prioritizing streams, then the parallel processing subsystem would be unable to fully support the stream prioritization requests included in the software application. Consequently, the overall latency of each frame could be increased and, therefore, could be more likely to cause jitter in frame rates than in a parallel processing subsystem that supported M device priorities for streams.
Another drawback to the above approach to prioritizing work is that indiscriminately launching all "parent" work components at the default device priority could adversely affect latency-sensitive work components included in a high priority stream. For instance, suppose that a stream "StreamA" associated with a high device priority were to include a work component "ChildlessA" and a work component "ParentA." Further, suppose that the work component "ParentA" were configured to launch a "child" work component "ChildA." Finally, suppose that the work component "ChildlessA" were not configured to launch any "child" work components. The API driver would launch the work component "ChildlessA" at the high device priority associated with the stream and the work component "ParentA" at the lowest device priority. Subsequently, the parallel processing subsystem would launch the "ChildA" work component at a device priority reserved for "child" priorities (i.e., one higher than the lowest device priority). Consequently, if "ParentA" were a highly latency-sensitive work component, then executing "ParentA" at the lowest device priority could increase latency and reduce the execution speed of the software application.
As the foregoing illustrates, what is needed in the art is a more effective way to prioritize work submitted to parallel processing subsystems that support dynamic parallelism.

Techniques for sharing priorities between streams of work and dynamic parallelism