The present invention refers to a new process meant for chrome and/or vegetable leather tanning. The process proposed by the invention comprises the steps of bating or purging, conditioning, and chrome and/or vegetable tannage. The conditioning step uses hydroxy-butaldehyde which reacts by blocking the amines of the collagen and releasing carboyxls. This reaction reduces the isoelectric point to 4.0-4.5, making the hide receptive or susceptible to effective chrome tannage by linking the carboxyls, or to tannin, by linking through hydrogen bridges. Hydroxy-butaldehyde is used in the conditioning step in a proportion of 2.5-3.0% as compared to the weight of the delimed hide, in a concentration of 40.+-.2%, with a pH of 4.2-4.4, and with the reaction time being from 3 to 4 hours.

The conventional process for leather tanning comprise the following operations: bating, pickling, pre-tanning and tanning.
The bating (purging or cleaning) of leather hides consists of deliming (removal of lime) and then bating the hides with enzymes. The second step is the pickling operation, where the bated hide is treated with sulfuric acid and sodium chloride in order to avoid, eliminate or reduce hide deterioration. Afterwards, the pre-tanning step is executed with chrome (chromic acid) or glutaraldehyde; this is the process that gives the hide its pretanning characteristics, allowing some operations, such as splitting, and afterwards, shawing the leather. This phase results in less steps with the use of a smaller quantity of chemicals. Finally the tanning of the hide is performed with chrome (chromic acid) and/or tannins, in accordance with the specifications to be reached.


A signal generating circuit includes a relaxation oscillator operating to alternately generate a first ramp signal that is periodic at a frequency of the relaxation oscillator and a second ramp signal that is periodic at the frequency of the relaxation oscillator and is out of phase with respect to the first ramp signal The first ramp signal is compared to a first reference voltage and the state of a first flip-flop is changed if the first ramp signal exceeds the first reference voltage. The second ramp signal is compared to the first reference voltage and the state of a second flip-flop is changed if the second ramp signal exceeds the first reference voltage. The first flip-flop is reset in response to a first level of the first ramp signal and the second flip-flop is reset in response to a second level of the second ramp signal. A logical ORing function is performed on an output of the first flip-flop and an output of the second flip-flop to produce an output signal having a frequency that is a multiple of the relaxation oscillator frequency.

The present invention relates generally to improved circuits and methods for generating clock signals by multiplying a fundamental clock frequency, and more particularly to substantially increasing the accuracy of the multiplied clock frequency above the accuracy achievable in the prior art.
"Prior Art" FIG. 1 shows a clock generation circuit 1 which includes a typical relaxation oscillator 2 that is believed to be representative of the closest prior art. Relatively "tight" frequency specifications are required for some integrated circuits including internal clock generators based on internal relaxation oscillators. For example, relatively tight frequency specifications are required for internal clock signals in integrated circuits which are designed to communicate over an RS232 interface. In the manufacture of such an integrated circuit, it may be desirable to perform a laser trimming operation on certain resistors in the integrated circuit at room temperature to produce a desired relaxation oscillator frequency. However, after the laser trimming operation the relaxation oscillator frequency nevertheless may vary significantly over a specified temperature range (e.g., minus 50 degrees Centigrade to plus 125 degrees Centigrade). There may be a need to ensure that the laser trimming operation at room temperature results in the relaxation oscillator frequency being within the specified range over the entire allowable temperature range. This has been difficult to achieve for internal clock generation circuits based on prior art relaxation oscillator circuits.
Referring to FIG. 1, clock generator circuit 1 includes a relaxation oscillator 2 including a current source 11 which supplies a current I1 to the sources of P-channel transistors M1 and M2, the gates of which are controlled by a logic circuit 10. The drain of transistor M1 is connected by conductor 3 to capacitor C1, switch S2, and a comparator 13. The drain of transistor M2 is connected to capacitor C2, switch S1, and comparator 12. Comparators 12 and 13 receive a reference voltage Vref that is produced by a current source Iref flowing through a resistor having a resistance R1.
The outputs of comparators 12 and 13 are connected to inputs of an OR gate 14, the output of which clocks a flip-flop 15. The output 16 of flip-flop 15 is connected to the inputs of a inverter 18 and a non-inverting buffer 20 and to an input of logic circuit 10. Logic circuit 10 produces clock signals φ1, φ2, φ1, and φ2 in response to the signal produced by flip-flop 15, where φ2 can be equal to φ1 and φ1 can be equal to φ2.
If transistor M1 is on, transistor M2 is off, switch S1 is closed, and switch S2 is open, causing the current I1 to flow through transistor M1 and gradually charge up capacitor C1, producing the ramp section "A1" of V3 as shown during which the clock signal CLK in the timing diagram of FIG. 2 is at the level P1. When V3 exceeds reference voltage Vref, the output 36 of comparator 12 switches from a "0" level to a "1" level after a propagation delay Tprop, causing a "1" level to be produced at the output of OR gate 14. This causes flip-flop 15 to change state, causing buffer 20 to produce the low level N1 of clock signal CLK in FIG. 2 and causing logic circuit 10 to switch φ1 to a high level and to switch φ2 to a low level
That turns transistor M1 off, turns transistor M2 on, closes switch S2, and opens switch S1. The closing of switch S2 discharges capacitor C1, producing transition B1 of voltage signal V3. The current I1 flows through transistor M2 and gradually charges up capacitor C2, producing the ramp section "A2" of signal V4. The operation continues similarly to that described above, and when V4 exceeds reference voltage Vref, the output 37 of comparator 13 switches from a "0" level to a "1" level, and a "1" level then produced at the output of OR gate 14 causes flip-flop 15 to change state, reversing the levels of φ1 and φ2. This discharges capacitor C2 to ground, causing transition "B2" of voltage signal V4 and also causing the transition of clock signal CLK to the level P2. As the foregoing operation is repeated, the level of CLK changes and the levels of φ1 and φ2 change each time the ramp portions of V3 and V4 exceed Vref.
The period of oscillation TOSC of relaxation oscillator 2 is given by the expressionTOSC=(2*C*Vref)/I1+Tprop.   Eq. (1)
The value of Tprop has a great influence on the ability of relaxation oscillator 2 to operate at very high clock frequencies (e.g., several hundred megahertz) over a typical expected temperature range (e.g., −50 degrees Centigrade to +125 degrees Centigrade) because Tprop can vary significantly over that range.
For clock signal periods requiring an accuracy of less than, for example 2%, over a predetermined typical temperature range and power supply range, the variance of the propagation delay Tprop can limit the maximum clock frequency obtainable. For example, a deviation of 1 nanosecond in Tprop can produce a corresponding 1% deviation in a 10 MHz nominal frequency of relaxation oscillator 2 and hence in the frequency of CLK. However, since the propagation delay Tprop is not totally dependent on the frequency of relaxation oscillator 2, if in this example relaxation oscillator 2 oscillates at a frequency higher than 10 MHz, any deviation of the propagation delay Tprop over the expected temperature range results in a correspondingly greater percentage deviation than 1% in the corresponding period of relaxation oscillator 2.
Thus, there is an unmet need for a clock generator circuit based on a relaxation oscillator that provides increased accuracy of the generated clock signal.
There also is an unmet need for a circuit and technique for multiplying the frequency of a signal produced by a relaxation oscillator without having to increase the current supplied by a current source in the relaxation oscillator or varying the value of capacitors such as capacitors C1 and C2 in FIG. 1.
There also is an unmet need for a circuit and technique for multiplying the frequency of a signal based on a clock signal derived from a relaxation oscillator without having to increase the frequency of the relaxation oscillator.
There also is an unmet need for an analog technique and circuit for multiplying an output signal produced by a relaxation oscillator to obtain a signal having a frequency which is a multiple of the frequency of the output signal produced by the relaxation oscillator without reducing overall circuit performance of the relaxation oscillator and the analog multiplying circuit over an expected temperature range.
There also is an unmet need for an analog technique and circuit for multiplying an output signal produced by a relaxation oscillator to obtain a signal having a frequency which is a multiple of the frequency of the output signal produced by the relaxation oscillator without unacceptably limiting the maximum achievable frequency of the multiplied output signal.
There also is an unmet need for an analog technique for obtaining signals within certain phase specifications or time delay specifications of a fundamental relaxation oscillator output.

Analog circuit and method for multiplying clock frequency


An error detecting/correcting circuit 9 in a digital broadcast receiving device calculates a error rate from the error amount for the amount of input information. A controlling part 15 converts the error rate into the C/N ratio as a receiving signal quality and indicates it on a screen of a TV receiver 5 or other indicator 18. In this method, after digitally demodulating the received digital broadcasting signal, the error rate is obtained by an error detecting part 9 and the error rate is converted into the receiving signal quality for indication. Therefore, compared with the reception performance indication based on the input level such as the AGC voltage, the method is high both in precision and in stability. The receiving signal quality can be detected only while receiving a digital broadcasting signal, so with reference to the converted receiving signal quality in antenna bearing adjustment, a digital broadcasting signal can be surely received without confusing it with an analog broadcasting signal.

1. Field of the Invention
The present invention relates to an improvement of a digital broadcast receiving device which is used for a digital broadcasting system in which on the transmission side a broadcasting station broadcasts both video and audio signals or either one after coding or digitizing them, and which on the reception side digitally demodulates a digital broadcasting signal, corrects errors and converts the resulting signal into an analog signal for reproduction.
2. Description of the Related Art
Generally, satellite broadcasting, it is necessary to use an antenna with sharp directivity and to adjust its bearing precisely to the direction of a broadcasting satellite.
In an analog conventional satellite broadcast receiving device, the antenna bearing is adjusted so that the maximum antenna input field strength is obtained while observing the pointer of a level meter indicating a signal strength.
Generally, the above-mentioned antenna input field strength is obtained from the AGC voltage of an AGC circuit in the input stage of the receiver by conversion.
However, this method in which the input field strength only is converted from the AGC voltage and indicated on the meter has the following two disadvantages. (1) Sufficient precision and stability cannot be obtained. (2) The high input field strength does not necessarily mean good signal quality. Therefore when image quality deteriorates, namely when reproduced video and audio quality is lowered due to the deterioration of C/N (Carrier to Noise) ratio, it is impossible to know that such image quality deterioration is caused by the lowered C/N ratio of a transmission system or by a receiver.
As described above, in the reception of the satellite broadcasting signal, high input field strength does not mean an adequate receiving signal quality. The C/N ratio of the received signal is an important factor. Therefore, in some cases, an improvement is made so as to indicate not only the input field strength but also the C/N ratio to show the receiving signal quality.
For this purpose, in an analog satellite broadcast receiving device, a triangular noise proper to frequency modulation (FM) system is measured to obtain the C/N ratio of the received signal.
It is expected that broadcasting digitization will bring about higher video quality, higher audio quality, multiple broadcasting channels and multiple broadcasting programs and at the same time multimedia service and interactive service.
In a digital satellite broadcast receiving device, a modulation system different from analog system such as QPSK modulation is employed. Therefore, the C/N ratio cannot be measured and indicated by the same procedure as that of the analog system.
In Japan, the analog and digital broadcasting satellites exist in mixed form in almost the same direction. Therefore, it is impossible to determine which broadcasting system is now being received, analog system or digital system by measuring and indicating only the input field strength in the antenna bearing adjustment.

Digital broadcast receiving device capable of indicating a receiving signal strength or quality


A color cathode ray tube has excellent focusing characteristics over the whole screen thereof, as well as a total length which is short, thus providing a compact monitoring device. The Cathode ray tube has an electron gun in which the ratio between the diagonal size De of a phosphor screen and the distance Lg from the center of the phosphor screen to an end portion of a focusing electrode which forms a main lens portion of the electron gun and faces an anode electrode in an opposed manner is set to De/Lg greater than 1.5. The focusing electrode and the anode electrode have single opening portions whose opening size in the horizontal direction is not less than 68% of the outer diameter of a neck portion and end surfaces of the opening portions face each other in an opposed manner in the tube axis direction along which the electron beams pass.

The present invention relates to a color cathode ray tube, and more particularly to a color cathode ray tube having a wide deflection angle and which is equipped with an in-line type electron gun having excellent focusing characteristics.
The color cathode ray tube used as a monitor of a television receiver and an information terminal accommodates an electron gun which emits a plurality of electron beams in one end of a vacuum envelope and has a phosphor screen (image screen) on which phosphor films of a plurality of colors are coated on an inner surface of the other end of the vacuum envelope. The color cathode ray tube is also provided with a deflection yoke on an outer portion of the vacuum envelope, which the deflection yoke performs a two-dimensional scanning of electron beams from the electron gun on the phosphor screen so as to display a given image.
Further, in many color cathode ray tubes, a shadow mask which constitutes a color selection electrode is installed close to the phosphor screen and a plurality of electron beams emitted from the electron gun are made to pass through the color selection electrode and impinge on the respective phosphor films so as to form color images.
To improve the color image formed on the phosphor screen over the whole screen area, a color cathode ray tube equipped with an electron gun as part of a system which applies high voltages other than an anode voltage to a plurality of electrodes which focus the electron beams and form a multi-stage focusing lens is known.
As such an electron gun, a so-called in-line type electron gun which emits three electron beams in parallel on a plane is most common.
FIG. 8A and FIG. 8B are schematic cross-sectional views illustrating the schematic structure of the conventional in-line type electron gun, wherein FIG. 8A is a horizontal cross-sectional view as seen from a direction perpendicular to the in-line direction and FIG. 8B is a vertical cross-sectional view as seen from the in-line direction.
This electron gun includes an electron beam generating portion which is comprised of three cathodes 1 arranged in the in-line direction, a first electrode (control electrode) 2 and a second electrode (accelerating electrode) 3 and a pre-focusing lens portion which is comprised of the first electrode 2, the second electrode 3 and a third electrode 4. Further, in the direction toward the phosphor screen from the third electrode 4, a fourth electrode 5 and a fifth electrode 6 which is divided into a first fifth electrode 61 and a second fifth electrode 62 are arranged in sequence, and the fourth electrode 5 is electrically connected with the second electrode 3 so as to have the same potential and is sandwiched between the third electrode 4 and the fifth electrode 6 to which a high voltage is applied, thus forming a first-stage focusing lens (UPF: Uni-Potential Focusing).
Further, the electron gun includes the fifth electrode 6 and a sixth electrode 7 to which the anode voltage Eb which is the optimal voltage is applied, and a second-stage focusing lens (BPF: Bi-Potential Focusing) is constituted by the fifth electrode 6 and the sixth electrode 7. That is, a main lens which is formed by combining a UPF lens and a BPF lens is called a U-B lens and is popularly used in a multistage focusing type electron gun.
Numeral 8 indicates a shield cup contiguously connected to the sixth electrode 7. Further, the fifth electrode 6 is divided into two electrodes and is comprised of the first fifth electrode 61 which is electrically connected to the third electrode 4 and the second fifth electrode 62 which faces the sixth electrode 7 so as to form the second-stage focusing lens.
Further, vertical correction plates 6V and horizontal correction plates 6H are respectively mounted on the first fifth electrode 61 and the second fifth electrode 62. That is, on the second fifth electrode 62 side of the first fifth electrode 61, there are mounted the vertical correction plates 6V which are arranged such that they sandwich three electron beams individually from the horizontal direction, while on the first fifth electrode 61 side of the second fifth electrode 62, there are mounted horizontal correction plates 6H which are arranged such that they sandwich three electron beams from the vertical direction. An electrostatic quadrupole lens is constituted by these vertical correction plates 6V and the horizontal correction plates 6H.
In the in-line type electron gun having the above-mentioned constitution, a constant focusing voltage Vfs is applied to the first fifth electrode 61, and Vfd+dVf, which is obtained by superposing a dynamic voltage dVf which is increased corresponding to a deflection amount of electron beams to an optimal focusing voltage Vfd at the center of the screen, is applied to the second fifth electrode 62.
This kind of electron gun is disclosed in Japanese Laid-open Publication 189842/1990.
In this electron gun, the electrostatic quadrupole lens constituted by the vertical correction plates 6V and the horizontal correction plates 6H are installed, Vfs is applied to the vertical correction plates 6V, Vfd+dVf is applied to the horizontal correction plates 6H, and Vfs less than Vfd+dVf is established; and, hence, the quadrupole lens acts as a focusing lens for the horizontal direction of the electron beams an acts as a divergent lens for the vertical direction.
Due to such actions, the deflection aberration which becomes a cause of a lateral defocusing phenomenon or a horizontal crush of the beam spot generated around the periphery of the screen is corrected. Further, when the electron beams are focused at the center of the screen, a curvature-of-field (curvature-of-field aberration, curvature-of-field defocusing) which causes excessive focusing is generated.
With respect to this phenomenon, since the focusing voltage of the second fifth electrode 62 which faces the sixth electrode (anode) 7 becomes high due to the relationship of Vfs less than Vfd+dVf, the focusing action of the above-mentioned second-stage focusing lens is weakened so that the curvature-of-field can be simultaneously corrected and excellent focusing characteristics can be obtained over the whole screen.
Here, corresponding to the widening of the deflection angle of the electron beams, the above-mentioned deflection aberration and the curvature-of-field are also increased so that in the color cathode ray tubes which have been popularly used as display monitors for personal computers or electronic computer terminals, the deflection angle of the electron beams has been set to approximately 90xc2x0.
In converting this deflection angle of 90xc2x0 into the shape of the color cathode ray tube, by designating the diagonal size of an effective screen as De and the distance from the center of the phosphor screen to the end portion of the focusing electrode which forms the main lens of the electronic gun and faces the anode electrode as Lg, the ratio De/Lg becomes De/Lg ≅1.4.
To consider the mounting of such a color cathode ray tube in a display monitor device, it is preferable that the total length of the color cathode ray tube is short. In case the deflection angle is widened to 100xc2x0, for example, to make the color cathode ray tube short, with the same diagonal size of effective screen De of the color cathode ray tube having a deflection angle of 90xc2x0, the distance Lg from the center of the phosphor screen to the opposing end portion of the focusing electrode, which forms the main lens of the electron gun and faces the anode electrode in an opposed manner, can be shortened approximately inversely proportional to the tangent angle (expressed as tan (Amax/2) in case the maximum deflection angle is Amax).
Further, in case this deflection angle is increased, it becomes necessary to increase the above-mentioned dynamic voltage dVf. However, in view of the limitation imposed on the actual designing of a dynamic focusing circuit at the monitor side, a sufficient dynamic voltage cannot be applied, thus giving rise to the deterioration of the focusing at the periphery of the screen.
Further, the increase of the dynamic voltage dVf makes the drive source per se expensive so that it is an important task to suppress the dynamic voltage dVf to a low level.
According to the present invention, it has been found when the relationship of Vfs greater than Vfd+dVf is set at the screen center and the astigmatism is set to be relatively large at the screen center, although the dynamic voltage dVf becomes small, the diameter of the beam spot on the screen is enlarged so that the focusing characteristics are deteriorated.
It is an object of the present invention to provide a color cathode ray tube having a total length which is short, thus providing a monitoring device which is compact and simultaneously exhibiting excellent focusing characteristics over the entire screen.
To achieve the above object, contrary to the above-mentioned electron gun used in the conventional color cathode ray tube where the relationship of Vfs less than Vfd+dVf is set at the periphery of the screen, the present invention is characterized by applying the dynamic voltage in such a manner that the relationship of Vfs greater than Vfd+dVf is set at the screen center.
The typical constitutions of the present invention are as follows.
(1) The color cathode ray tube has the relationship that the ratio between the diagonal size De of the phosphor screen (effective screen) on which at least the phosphors of three colors are coated and the distance Lg from the center of the phosphor screen to the end portion of the focusing electrode which faces the anode electrode in an opposed manner and forms the main lens portion of the electron gun is set to De/Lg greater than 1.5, and the focusing electrode and the anode electrode are constituted such that they have single opening portions whose opening size in the horizontal direction is not less than 68% of the outer diameter of a neck portion, and end surfaces of the opening portions face each other in an opposed manner in the tube axis direction along which the electron beams pass.
(2) The focusing electrode adjacent to the anode electrode which forms the main lens of the electron gun in (1) and to which the anode potential is applied is divided in the tube axis direction; in addition to a constant focusing voltage, a dynamic voltage which is changed corresponding to the deflection amount of the electron beam is superposed to one electrode of the divided focusing electrodes adjacent to the anode electrode, an electrostatic quadrupole lens which changes in the intensity thereof in response to application of the dynamic voltage is provided to at least one portion; and, further, a curvature-of-field correction lens which weakens its focusing action in the horizontal direction as well as in the vertical direction against three electron beams corresponding to an increase of the dynamic voltage is provided at the anode electrode side in the tube axis direction of the electrostatic quadrupole lens.
(3) The electrostatic quadrupole lens and the curvature-of-field correction lens are provided in the electron gun of (1), and further, an electron beam generating portion which generates three electron beams arranged in the horizontal direction is comprised of a cathode, a first electrode and a second electrode which are arranged in the anode electrode direction, and a third electrode and a fourth electrode which are arranged adjacent to the second electrode, and the third electrode is divided into two elements, thus forming another electrostatic quadrupole lens.
(4) The voltage which corrects the astigmatism generated from the potential difference between the just focusing voltages in the horizontal, direction and the vertical direction of the main lens on the electron beam spot at the center of the screen formed of the phosphor screen in (1), (2) or (3) is set to 1.4xe2x88x922.2 kV, the dynamic voltage at the corners of the screen is set to not more than 600 V, and the diameter of the electron beam spot at the center of the screen is set to not more than 0.6 mm.
(5) The outer diameter of the neck portion which accommodates the electron gun of (1), (2), (3) or (4) and constitutes the vacuum envelope is set to substantially 29 mm, while the opening portions of the focusing electrode and the anode electrode which face each other in an opposed manner are formed into a single laterally elongated shape, wherein the opening size in the horizontal direction is set to not less than 20 mm and the opening size in the vertical direction is set to not less than 9.5 mm.
In the electron gun of the conventional color cathode ray tube, the astigmatism of the main lens is set to approximately hull and the electron beams are focused on the phosphor screen without receiving the action of the electrostatic quadrupole lens at the center of the screen while the action of the electrostatic quadrupole lens is maximized at the periphery of the screen and hence, the defocusing of the beam spot generated by the deflection aberration is corrected. To the contrary, in the electron-gun used for the color cathode ray tube of the present invention, a given astigmatism is provided to the main lens and the action of the electrostatic quadrupole lens at the center of the screen is maximized so that the astigmatism of the main lens is corrected and the beam spot is made to approach a perfect circle.
Since the action of the electrostatic quadrupole lens decreases at the periphery of the screen, the defocusing of the beam spot is corrected in such a manner that the deflection aberration offsets the astigmatism of the main lens. Further, in the present invention, besides the electrostatic quadrupole lens, for correcting the curvature-of-field independently, another correction lens is provided for focusing the electron beams vertically and horizontally at the time of applying the dynamic voltage and for weakening the focusing action corresponding to the increase of the deflection amount of the electron beams and, hence, the dynamic voltage can be reduced more than in the conventional electron gun.
Further, by establishing the relationship that the ratio between the effective screen diagonal size De and the distance Lg from the center of the phosphor screen to the end portion of the focusing electrode which faces the anode electrode in an opposed manner and forms the main lens portion of the electron gun is set to De/Lg greater than 1.5 and by making the structures of respective opposing portions of the focusing electrode and the anode electrode have a large opening size with the opening size in the horizontal direction being not less than 20 mm and the opening size in the vertical direction being not less than 9.5 mm, the focusing voltage is reduced by the main beam having the large opening size, while by providing the correction lens for correcting the curvature-of-field, the diameter of the beam spot can be made small and the effect that the dynamic voltage drive is further reduced can be obtained.
FIG. 9A and FIG. 9B show waveforms of the dynamic voltages applied to the electron gun, wherein FIG. 9A is the waveform of the dynamic voltage applied to the electron gun of the conventional color cathode ray tube and FIG. 9B is the waveform of the dynamic voltage applied to the electron gun of the color cathode ray tube of the present invention. In the drawing, 1H indicates one horizontal period and 1V indicates one vertical period.
FIG. 10A and FIG. 10B are explanatory views of an optical model of the electron gun, wherein FIG. 10A indicates the optical model of the electron gun of the conventional color cathode ray tube and FIG. 10B indicates the optical model of the electron gun of the color cathode ray tube of the present invention.
In the conventional electron gun, the dynamic voltage is applied to the focusing electrode which constitutes the main lens ML (convex lens in the horizontal direction as well as in the vertical direction in FIG. 10A) so as to weaken the intensity of the main lens at the time of deflecting the electron beams toward the periphery of the screen (in FIG. 10A, this phenomenon is expressed by a lens having a thickness smaller in the horizontal direction as well as in the vertical direction than the main lens ML in case of the screen center) thus correcting the curvature-of-field aberration, and simultaneously, the electrostatic quadrupole lens QL (concave lens in the vertical direction and convex lens in the horizontal direction in FIG. 10A) corrects the astigmatism.
In general, although the intensity of the electrostatic quadrupole lens can be relatively easily adjusted, since the intensity of the main lens is set to a proper intensity so as to focus the electron beam to the phosphor screen, a sufficient adjustment of the intensity of the main lens is difficult.
Accordingly, although the correction sensitivity of the astigmatism can be enhanced by increasing the intensity of the electrostatic quadrupole lens, with respect to the curvature-of-field (curvature-of-field aberration), it is difficult to enhance the correction sensitivity of the astigmatism-more than the correction sensitivity determined by the intensity of the main lens.
It is necessary to take a balance between the correction sensitivity of the astigmatism and the correction sensitivity of the curvature-of-field aberration, and, hence, it is impossible to enhance only the correction sensitivity of the astigmatism. Accordingly, in the conventional electron gun, there is almost no space for reducing the dynamic voltage by enhancing the sensitivity.
On the other hand, the present invention is characterized by providing a curvature-of-field aberration correction lens FL (FIG. 10B shows only a convex lens in the horizontal direction in case of the screen center) independently from the main lens ML, besides the electrostatic quadrupole lens QL for correcting the astigmatism.
The curvature-of-field aberration correction lens FL is a non-axisymmetric lens formed by facing longitudinally elongated openings (vertically elongated openings) in an opposed manner, that is, a slit lens (not shown in the drawing) and the focusing force is intensified more in the horizontal direction than in the vertical direction.
At the corners of the screen, as can be also understood from the waveform of the dynamic voltage in FIG. 9B, the potential difference at the electrostatic quadrupole lens portion and the slit lens portion is small, and, hence, the intensity of the lens is weak. At the center of the screen, the lens intensity of both of the electrostatic quadrupole lens and the curvature-of-field aberration correction lens (=slit lens) is maximized, and, hence, the astigmatism of the main lens is corrected. At the corners of the screen, the intensity of the electrostatic quadrupole lens, the intensity of the curvature-of-field aberration correction lens and the intensity of the main lens are respectively minimized.
Accordingly, the focusing action against the electron beams at the corner of the screen is minimized, and, hence, the curvature-of-field aberration can be corrected. Although the effect that the curvature-of -field aberration is corrected by the dynamic voltage applied to the main lens electrode is the same as the effect of the above-mentioned conventional electron gun, the correction effect is increased by an amount of the correction effect obtained at the slit lens, and, hence, the curvature-of-field aberration can be corrected with the low dynamic voltage.
In the main lens of the electron gun used f or the color cathode ray tube of the present invention, the opposing portions of the electrodes which face each other in an opposed manner have a large opening size, wherein the opening size in the horizontal direction is set to not less than 20 mm and the opening size in the vertical direction is set to not less than 9.5 mm so that the focusing voltage Vf of the electron beam can be reduced, and, accordingly, the dynamic voltage superposed on the focusing voltage can be reduced. As well known, a main lens having a large opening reduces the spherical aberration, and, hence, the diameter of the electron beam spot can be minimized.
The present invention is not limited to the above-mentioned constitutions and embodiments described hereinafter and various modifications are possible without departing from the technical concept of the present invention.

Color cathode ray tube with wide deflection angle


A method and apparatus are provided for detecting a receiver over a PCI-Express bus. A receiver is detected on a PCI-Express link by adjusting a common mode voltage using a current injected into one or more transmitter output nodes and detecting whether a receiver is present based on a voltage change rate. The current can be injected, for example, by a charge pump. In various embodiments, the charge pump can be integrated with a CML transmit buffer or an H-bridge type of transmit buffer. The amplitude control circuit can compare the adjusted common mode voltage to one or more predefined voltages and maintain the adjusted common mode voltage between two predefined voltages. The amplitude control circuit provides a signal to the charge pump to control the current injected into the transmitter output nodes. The amplitude control circuit also provides a signal to an exemplary timer that measures the voltage change rate.

The Peripheral Component Interconnect (PCI) specification (downloadable from www.pci-sig com) defines how one or more peripheral devices can communicate with a computing device over a serial input/output bus link. The serial link can be within a single computing device or can link one or more computing devices and peripheral devices. The original PCI specification defines a 32-bit PCI bus that operates at 33 MHz with a peak throughput of 132 Megabytes/second. Until recently, the performance of the original PCI specification was adequate for most applications. As the processing rates of commercially available processors have increased, the processing capacity of the processors to process data eventually exceeded the capacity of the PCI bus to deliver data. Thus, recent piocessors can process data faster than the PCI bus can deliver the data to processor.
An updated version of the PCI specification, referred to as PCI Express, proposes to improve the computer performance by increasing the flow of data between a processor and various peripheral devices, such as network cards, printers and storage disks. Rather than transmitting data on a parallel bus, which limits the maximum transmitting speed, PCI-Express uses high speed serial lanes at 2.5 Gbit/second or higher to transmit the data. When multiple lanes are used, e.g., 32 lanes, the maximum speed can be up to 80 Gbit/second.
In addition, PCI-Express includes a number of new features that are said to improve reliability, timing and scalability of the bus. For example, the PCI-Express standard requires that transmitters support a "receiver detect" function that allows a transmitter to determine whether there is a receiver present at the far end of a communication link. A need therefore exists for a receiver detection circuit that may be employed by a transmitter that communicates over a PCI-Express bus.

Method and apparatus for receiver detection on a PCI-Express bus


An input circuit writes an expected value to one end of an evaluation wiring. A latch circuit latches a logic level of the other end of the evaluation wiring. A first switch circuit connects an output of the input circuit to the input of the latch circuit. A second switch circuit connects the output of the input circuit to the one end of the evaluation wiring. A third switch circuit connects the other end of the evaluation wiring to the input of the latch circuit. By turning on, off, and off the first to third switch circuits, respectively, the output of the input circuit is directly connected to only the input of the latch circuit. In this state, the input circuit writes an expected value, and a logic level is read from the latch circuit. Accordingly, failure of the evaluation wiring can be easily discriminated from other failure.

1. Field of the Invention
The present invention relates to a semiconductor integrated circuit having a wiring evaluation circuit for evaluating wiring formed on a chip when a semiconductor fabrication process or the like is developed, and to an evaluation method of the wiring in the semiconductor integrated circuit.
2. Description of the Related Art
When a new semiconductor fabrication process is developed, an evaluation chip is generally used to evaluate the shape of wiring fabricated by this process, the characteristics of elements, and so on. On the evaluation chip, a wiring evaluation circuit, an element evaluation circuit, and so on are formed. In the wiring evaluation circuit, a plurality of kinds of evaluation wirings with different wiring widths and wiring intervals are formed. Then, failure (break, short, and so on) occurring in each of the evaluation wirings is evaluated, thereby determining optimum fabrication process conditions and process margins. In other words, a semiconductor fabrication process is developed.
For example, Japanese Unexamined Patent Application Publication No. Hei 9-306965 proposes a wiring evaluation circuit having a write circuit formed on an input side of an evaluation wiring and a read circuit formed on an output side of the evaluation wiring via a latch circuit. In this wiring evaluation circuit, the write circuit gives a predetermined logic level (expected value) to the evaluation wiring, the read circuit reads a logic level held by the latch circuit, and a read value is compared with the expected value, thereby detecting failure of each evaluation wiring.

Semiconductor integrated circuit and evaluation method of wiring in the same


An item identification device antenna which provides better field coverage for reading item identification tags. The item identification device antenna includes a first portion coupled to a tag reader for reading a tag on an item, wherein the first portion is for radiating an electromagnetic field at a predetermined frequency, and a second portion in the electromagnetic field for resonating at the predetermined frequency to radiate another electromagnetic field for reading the tag. The tags may include radio frequency identification (RFID) tags.

Radio frequency identification (RFID) tags are known for there usefulness in identifying items. RFID tag readers may be used in various venues, such as point-of-sale checkout, where RFID tag readers read RFID tags on merchandise items.
RFID readers may have limited output power (250 mW). Mounting limitations may result in a conventional RFID antenna covering only a limited volume, squandering what limited power is available. The RFID reader may not be able to read an RFID tag anywhere it may be located within a desired reading area.
It would be desirable to provide an antenna for an item identification device, such as an RFID reader, which expands reading volume.


A therapeutic wrap adapted to use with a vaporizing ointment for relieving the discomfort of colds and sore throats. The invention includes a therapeutic kit having a vaporizing ointment and a wrap. The wrap is composed of an elongated piece of fabric, preferably flannel. The fabric has a throat end and a chest end. The throat end has a width approximately corresponding to the length of a human neck. The chest end has a width greater than the width of the throat end. At least two mating portions of hook and loop fastener are attached to opposite surfaces of the fabric. The hook and loop fastener secures the wrap around the neck so that the chest end drapes over the chest. The wrap helps to keep the patient's neck and chest warm and protected from drafts so that the vaporizing ointment can have its maximum effect. The wrap also protects the patient's clothing. The wrap is comfortable, looks neat, and holds securely, so that the patient's mobility is enhanced. The invention includes a method of treating colds and sore throats by applying the vaporizing ointment to the neck and chest, covering the neck and chest with a wrap, and securing the wrap with hook and loop fastener.

1. Field of the Invention
The present invention relates generally to therapeutic wraps, and specifically to a therapeutic wrap adapted to use with a vaporizing ointment for treating colds and sore throats. The invention also includes a therapeutic kit and a method of treating colds and sore throats.
2. Description of the Related Art
Ailments of the upper respiratory tract, such as the common cold, frequently involve sore throats. Various types of vaporizing ointments are widely used in relieving the discomfort accompanying colds and sore throats. An example is Vicks VapoRub. Vaporizing ointments are generally applied to the throat and chest of the patient. These ointments typically include ingredients which open the pores and make the throat and chest feel warm. The warmth helps the patient to feel more comfortable.
Vaporizing ointments also include various vaporizing ingredients. The vaporizing ingredients may have a decongestant effect so that the patient feels he is breathing easier. The vaporizing ingredients may also include perfumes of various sorts, which help to distract and relax the patient. Typical ingredients of a vaporizing ointment include menthol, camphor, eucalyptus oil, and spirits of turpentine.
The instructions for using a vaporizing ointment typically state that the ointment should be rubbed on throat and chest as desired. The instructions suggest that the ointment may then be covered with a dry, warm cloth. Covering the ointment also prevents the ointment from staining the patient's clothing.
While any available cloth may be used for covering in this way, such as a towel, diaper, or scarf, such improvised wraps have a number of disadvantages. Improvised wraps tend to be bulky and unattractive. They fit poorly under a patient's normal clothing. These problems generally limit the use of vaporizing ointments to the home or similarly private situations where loose-fitting clothing is appropriate.
Since improvised wraps are not designed to wrap around the neck, they may not wrap closely, creating gaps and drafts. The cold air reaching the open pores of the patient's skin is unpleasant and tends to counteract the beneficial feeling of warmth from the ointment. Since improvised wraps are not secured around the neck, they may even fall off, particularly if the patient moves around. This tends to limit the patient's mobility. If the vaporizing ointment has been applied to both the throat and the chest, it can be difficult to arrange an improvised wrap so that both the throat and chest are securely covered. Some of the beneficial feeling of warmth is lost. The ointment may also stain the patient's clothing where the ointment has not been fully covered.
U.S. Pat. No. Des. 342,790 shows a therapeutic neck wrap having fasteners for fastening around the neck. U.S. Pat. No. 4,805,619 discloses a therapeutic scarf for applying ice to the neck and chest during hot weather and vigorous activity. U.S. Pat. No. 5,005,374 discloses a thermal wrap for containing hot or cold pack inserts. U.S. Pat. No. 5,088,549 discloses a neckband which is tied around the neck for heating or cooling the user. U.S. Pat. No. 5,507,793 discloses a neck wrap for cooling or heating the neck which drapes down the chest and is secured with hook and loop fastener.
None of the above inventions and patents, taken either singularly or in combination, is seen to describe the instant invention as claimed. Thus a therapeutic wrap for colds and sore throats solving the aforementioned problems is desired.


A cutting machining tool, especially of a boring bar type, has a holding device (10), one end of which is provided with a fixing shaft while its other end is provided with a seat (12) for a removable cutting member (16). The cutting member encompasses a support part (18) which engages at least partly into the seat (12) in the fixed state and a machining part (20). The support part (18) can be fixed in a clamping manner in the seat (12) by a fastening part (22). The seat (12) is provided with a rest area (28). The cutting member can be securely fixed in the seat across a larger fixing range by a support part due to the fact that the seat (12) includes a delivery area (30) in addition to the rest area (28). The two areas (28, 30) are movable towards or away from each other so as to fasten or remove the cutting member (16) by the fastening part (22). Secure fixing and support is achieved by three planar areas that are located on the outer circumference of the support part.

DE 41 02 529 A1 discloses a tool holder for rotating cutting tools, especially ones having a rod extending in the direction of the axis of rotation and introducible into a tool seat of a chuck, and having a cutting element mounted eccentrically on one end of the rod. The tool seat is eccentricity adjustable relative to the axis of rotation being mounted for adjustment of the operating radius of the cutting tool. For this purpose, there is mounted in an external bushing of the tool holder a circular opening eccentric from the axis of this bushing. In this opening, an interior bushing has an adjustable-rotation seat eccentric relative to the central axis of the opening for the cutting tool. The extent of the eccentricity between the seat for the cutting tool and the central axis of the opening in the exterior bushing in which the interior bushing is seated is more or less as great as the extent of the eccentricity between the central axis of the opening referred to and the exterior bushing. With the tool holder as disclosed, it is possible only to exchange a cutting element mounted on a rod for it by the holder in the form of a chuck, while the cutting element itself is mounted conventionally, eccentrically, on the free frontal surface of the rod which may be introduced into the chuck. Because of the large number of components, this tool holder as disclosed is complex in structure and accordingly expensive. Consequently, high-precision machining with that holder also is not possible.
Another tool is disclosed by DE 100 52 016 A1. The tool disclosed is used in particular for rotary milling and has as holder a shaft defining the axis of rotation. This holder may be coupled to a rotary drive, and has on its free end a headpiece to which a cutting element may be detachably connected in a mounting configuration in which the cutting edge of the cutting element is positioned at a radial distance from the axis of rotation corresponding to a desired cutting circle diameter. A supporting component on the headpiece performing the function of half-element of the cutting element is mounted so as to be rotatable around an adjustment axis which extends in parallel with the axis of rotation of the shaft and is offset eccentrically from this axis. It is possible to mount the cutting edge of the cutting element as a machining component offset a certain radial distance from the axis of adjustment. In addition, in the case of the solution disclosed, a stop mechanism is present by which the cutting element component may be locked with the headpiece in selected rotary positions which correspond to the diameter of the cutting circle diameter desired of the cutting edge of the cutting element.
In the case of the tool disclosed, the seat has convergent support surfaces of a support area which may be brought into contact with correspondingly convergent contact surfaces of the supporting component. A clamp connection is used to fasten the supporting component in the seat of the holder, there being provided as fastening component a hexagon socket screw which extends through the exterior circumferential wall of the seat in the holder. The machining component presses against the support surfaces of the support area of the seat. Although this configuration permits very good adjustment of the cutting component in the holder, it is desirable as a prerequisite for high-precision machining with the cutting element that the fastening be even further improved in order that high-precision machining may be achieved.
FR-A-1497 546 discloses a generic tool for machining by cutting having a holder with a fastening shank on one of its ends and on the other end a seat for a replaceable cutting element with a supporting component which is engaged at least partly in the seat when in the fastened state, and having a machining component. It is possible to fasten the supporting component in the seat by clamping by a fastening component. In the case of the disclosed solution, the shaft of the supporting component is cylindrical in configuration and may be fastened in a cylindrical seat by a fastening component which is integrated with the remainder of the seat by a slot guide and which may be tightened by a screw connection in the direction of the supporting component for the purpose of fastening the latter. As a result, there necessarily is a slight displacement of the axes of rotation of holder and supporting component which cannot be effectively offset in that there are inside the cylindrical seat three webs projecting into the seat space, the purpose of which is to permit center adjustment. High-precision machining with the tool is not possible. Comparable considerations also apply to the generic tool disclosed in GB 598 240 A.
U.S. Pat. No. 1,765,362 discloses clamping of the respective tools by a clamping or fastening sleeve in the case of a holder for drilling tools. The cylindrical seat has a plurality of slots in the direction of the fastening shank in diametrically opposite directions relative to the longitudinal axis. Thus, the tools may be clamped by screwing the fastening sleeve onto an external threading of the slotted fastening area of the drill on its shaft-like supporting component. The slotted guide necessitates fastening of the slotted fastening area of the cylindrical drill shaft by four elastic tongue areas in adjustment of the fastening sleeve. This in turn results in overevaluation of the fastening state for the supporting component and accordingly in displacement of the corresponding positions of the longitudinal axes of holder and drilling tools, something which in its turn results in machining inaccuracies.

Hartmetall-Werkzeug Fabrik Paul Horn GmbH.


A container for dispensing solid crystal deodorant including an elongated outer tubular member having both of its ends open and an elongated slot longitudinally disposed on its inside surface. An elongated inner tubular member, with at least one open end, is rotably held within the outer tubular member. The inner tubular member has helical grooves. Positioned inside the inner tubular member is a holder suitable for holding a solid crystal deodorant product to extend out from the container. The holder has tabs inserted through the helical grooves and into the elongated slot. The holder also has a plurality of projections extending from its periphery which contact an indentation on the external surface of the crystal deodorant to hold the solid crystal deodorant onto the holder. When the user rotates the inner tubular member relative to the outer tubular member, the Labs are forced to move longitudinally in the helical groove and the slot as the inner tubular member rotates, moving the holder and the deodorant longitudinally relative to the inner and outer tubular members, and thus into or out of the container.

The present invention is related to a tube container for dispensing solid products, particularly solid rocklike crystal deodorant.
Crystal rock deodorant is gaining increasing consumer acceptance because of its long life and image as a healthy alternative to conventional antiperspirant. Crystal rock deodorant is made from natural mineral salts and does not contain any moisture. Thus, the user must wet the deodorant with water before it is used, usually by either holding it under a running tap or immersing it in a sink filled with water. Once the deodorant is wet, the user can rub the top of the crystal over the area of the body to which the deodorant is to be applied.
After use, the crystal must be allowed to dry. If water is left on the crystal it will deteriorate by becoming soft. If this happens, the crystal may be unusable in the intended manner.
Push-up dispensers for crystal deodorant may require the user to push down on the top of the crystal deodorant in order to retract the deodorant back into the container. This is disadvantageous because the deodorant is typically wet after it is used, and the user may get the deodorant on his hands when pushing down on the top of the deodorant or must use the lid of the container to push down the deodorant.
Furthermore, if rock crystal deodorant is held in place on a movable platform by a frictional projection inserted into the rock crystal deodorant, a central hole must be formed in the rock crystal during the manufacturing process. If this method of holding the rock crystal deodorant onto a platform is used, the deodorant can be somewhat unstable when it is extended from the tube and a sideways force is applied. Restricting the amount by which the deodorant can be extended from the tube, and thus allowing the inner circumference of the tube to stabilize the product, has the disadvantage of causing a portion of the product to be wasted, as that portion of the product must remain below the top of the container and therefore cannot be used. A longer projection, which might provide more stability, also reduces the useful life of the product, since once the projection extends from the top of the deodorant, the user is prevented from using the product as it is intended. Additional projections into the base of the deodorant crystal require a more complicated manufacturing process as more holes in the deodorant must be provided.


In a particle measurement device 1 for a powder or granular material processing apparatus, powder or granular material is introduced into a drawing tube 3, which is formed to be projected from the inside of the granulating vessel 2, by injecting high pressure gas from the inside of the granulating vessel 2, so as to capture it with adhesive film 6. The captured powder or granular material is photographed, and, based on the obtained image information, information on the powder or granular material within the granulating vessel 2 is obtained. An air inlet 4, which is communicated with the drawing tube 3, is provided in the drawing tube 3 in the neighborhood of its end portion 3b on the side of the outside of the granulating vessel 2. Through this air inlet 4, gas having higher pressure than the inside of the granulating vessel 2 is introduced into the drawing tube 3. By this, in the particle measurement device for the powder or granular processing apparatus, effects of remaining powder or granular material and flow out of the powder or granular material are removed, and grain size etc. are measured with high reliability.

There are various processings of powder or granular material, including granulating, drying, coating, and the like. Among them, as the granulating method of powder or granular material, can be listed the fluidized bed granulating method, agitation granulating method, centrifugal tumbling granulating method, and combinations thereof or combined-type granulating methods, and they are widely employed in various fields such as pharmaceutical preparations and food.
At first, among these granulating methods, the fluidized bed granulating method comprises sprinkling liquid material on powder or granular material, which has been in a fluidized state by dispersion and mixing within a processing vessel, increasing the grain sizes gradually. As a fluidized bed granulating apparatus for such processing, may be mentioned Flow Coater (trade name) by Freund Industrial Co., Ltd. which fundamentally comprises a processing vessel for containing and processing material to be processed, a fluidizing air supply device for supplying fluidizing air so as to fluidize the material, and a spray nozzle for spraying liquid on the material. By the fluidizing air, the material to be processed comes to be fluidized, and on this fluidized material, the liquid is sprayed by the spray nozzle, to carry out the granulation.
Next, the agitation granulating method comprises dispersing and mixing solid/liquid to produce particles, by agitation with an agitating blade (agitator). As an agitation granulating apparatus for such processing, be mentioned a high speed mixer FS-G model (trade name) of Fukae Kogyo Ltd., which is called, in another name, as a high speed mixing machine. As disclosed in Japanese Patent Publication No. 6-22667, Japanese Patent Publication No. 6-24619, Japanese Un-examined Patent Laid-Open No. 5-236, and Japanese Patent Publication No. 2-32932, this agitating granulating apparatus fundamentally comprises an agitating blade rotatably provided within a processing vessel, with a bottom portion of the processing vessel serving as a fixed wall. In addition to this construction, a disintegrating blade (chopper) may be provided if necessary, as shown in Japanese Un-examined Patent Laid-Open No. 5-115766, so that disintegration granulation may be performed by the chopper, in addition to tumbling granulation by the agitator. Further, if a drying process is needed, a vacuum drying system may be provided, or otherwise, a heater may be provided on the outer periphery of the processing vessel in a jacketing manner. Then, by suitably controlling rotational speed of the agitator and the chopper, quantity of the liquid, quantity of charging, granulation time, temperature, and the like, mixing granulation of the powder or granular material is carried out.
On the other hand, the centrifugal tumbling method comprises tumbling mixing of powder material on a rotating disk, while spraying liquid on the material to make powder particles adhere to and agglomerate with one another. As a centrifugal tumbling granulating apparatus for such processing, be mentioned CF Granulator (trade name) made by Freund Industrial Co., Ltd., an automatic coating apparatus described in Japanese Patent Publication No. 54-992, and a granulating apparatus of Japanese Un-examined Patent Laid-Open No. 6-262054 (corresponding to U.S. Pat. No. 5,507, 871), and each of these apparatus fundamentally comprises a rotating disk, which rotates generally horizontally, provided at a bottom portion of a processing vessel. If necessary, slit air is supplied into the inside of the processing vessel through a ring-shaped gap formed between circumference of the rotating disk and a inside wall portion of the processing vessel, while dispersing powder and spraying liquid on the material to be processed within the processing vessel, so as to perform granulation of the powder or granular material.
Further, there has been used the combined-type granulating method which combines the above-described techniques. For example, there has been appeared an apparatus, such as Spir-A-Flow (trade name) made by Freund Industrial Co., Ltd., which fundamentally performs the fluidized bed granulation, and suitably combines it with the agitation granulation and the centrifugal tumbling granulation, using combination of a rotor disk and an agitator.
In such process of granulating powder or granular material, from the viewpoint of the object of producing particles and from the viewpoint of process validation for a product, measurement and control of particle diameter are so important as to be incomparable with the other factors. By this reason, various granulating apparatuses use a moisture meter, a pressure gauge, an electric power meter, and the like as sensors for process validation. Using these sensors, an end of granulation, granulating conditions, and the like are controlled. Here, "process validation" is defined as "a documented program giving a high-level assurance that a certain process constantly produces products compliant with preset standard and quality characteristics", and is important from the viewpoint of GMP (Good Manufacturing Practice).
However, measurement using these sensors gives only indirect "estimation" of particle diameters, and has disadvantage that error becomes large. Further, according to a granulation method, the above-described sensors may not be used. For example, in non-water type granulation using ethanol, the moisture meter can not be used. Further, each granulating method has following specific difficulty.
First, in the fluidized bed granulating method, process control generally uses an infrared absorption moisture meter such as Moiswatch (trade name) made by Okawaraseisakusho. Such a moisture meter, however, has disadvantages in that data is blurred in high moisture content area, and that variation of moisture content is smaller in comparison with variation of particle diameter. Further, in the case of granulation with constant moisture content, the end point of granulation can not be decided by such a moisture meter.
Next, in the case of the agitation granulating method, although there exist examples of validation using a pressure gauge or a resistance meter or based on power consumption, granulation is generally controlled by charge amount of raw material, added amount of binder, rotation speed of the agitating blade, and agitating time. For example, in the case of the control by power consumption, power consumption rapidly increases at the start of the granulation, repeats fluctuations as the granulation proceeds, decreases gradually as resistance to agitation decreases, and becomes steady state as the regulation of particles proceeds, and, following these stages, the end point of the granulation is decided. However, synthetic process or storage conditions of the raw material etc. may affect them so that the raw material etc. are varied in their hygroscopic property (wettability), fluidity, and powder property (characteristics of bulk) such as agglomeration or adhesion property etc. Accordingly, for validation, it is desirable to control by feedback. Further, as in the case of the control by power consumption, when granulation is made to proceed until change of load on a granulating apparatus becomes obvious, detection by a sensor is easy, but granulation tends to proceed excessively. In particular, in the case of granulation for tabletting, the excessive granulation makes the particles too hard, or produces too small amount of fine powder.
Further, in the centrifugal tumbling granulating method, an operator decides the end point of the granulation by directly feeling water content in the powder material with his hand, or by observing sampled products with a magnifying lens, for example. Judgment, however, by the operator's feeling or eye observation can not be said as objective judgment at all, and validation is impossible. On the other hand, although introduction of a moisture meter or a lever resistance type pressure gauge has been studied, a satisfactory result has not been obtained since, for example, measurement error becomes large due to adherence of the powder material to an employed sensor such as a moisture meter. In particular, in the case of an electrode-type moisture meter, powder adheres to surface of an electrode of the moisture meter, and the measurement becomes impossible in short time. In addition, a moisture meter or the like has been used mainly for maintaining of an equilibrium state of granulation process, and can not be used for deciding an end point of granulation.
Thus, there are various disadvantages for control of granulation process in respective granulating methods. In particular, the fluidized bed granulating method has a disadvantage in that variation in grain size and particle shape (referred to as "grain size etc." in abbreviation) of products is large, and various grain size control methods have been tried for this granulating method.
In that case, to make the grain size etc. of powder or granular material uniform, it is necessary to monitor the grain size etc. always in real time for change of processing conditions at any time, and to suitably decide an end point of processing for obtaining products with desired properties. For that purpose, as described above, such techniques as time management by timer control, observation by a skilled worker, control by water content value, and the like have been employed. However, the timer control or the observation by a skilled worker has a problem in accuracy. Namely, the timer control can not cope with change in bulk characteristics, and variation in product grain size can not be avoided. Further, accuracy is lacked in workings depending on skilled worker's experience or perception such as judgment of the processing state by observing the inside of a processing apparatus through its inspection hole. Further, it is difficult to give exact judgment by the control based on water content value, since change of water content does not quickly respond to rapid advance of granulation in the stage approaching the end point of the granulation. Accordingly, in many conventional cases, end of granulation is decided by judgment of grain size etc. by eye observation or measurement of granulated objects sampled in the course of the granulation process. For example, the end point is predicted by sieving the sampled products with 16 mesh sieve for 10 seconds, and by calculating based on the ratio of the particles remaining on the sieve.
Such a method, however, can not obtain data in real time, is inferior in accuracy and rapidity, and, thus, is unfavorable from the viewpoint of validity. Accordingly, to grasp, in real time, grain size etc. simply and accurately, such grain size measurement devices have been proposed as described in Japanese Un-examined Patent Laid-Open No. 4-265142, Japanese Un-examined Patent No. 7-794, Japanese Un-examined Patent Laid-Open No. 7-120374, and Japanese Un-examined Patent Laid-Open No. 8-131810.
Here, in the grain size measurement device of 4-265142, a processing vessel (granulating vessel) is provided with a drawing tube for powder or granular material, and high pressure gas is blown from the inside of the processing vessel to introduce the powder or granular material within the processing vessel into the drawing tube. Thus-introduced powder or granular material is captured by adhesive film provided in an inner part of the drawing tube, and an image of the captured powder or granular material is picked up to measure its grain size etc. After the measurement of the grain size, the inside of the drawing tube for powder or granular material is cleaned by negative pressure in the processing vessel. On the other hand, in the device of 7-794, a camera device and a high speed stroboscopic device are provided being directed toward the inside of the processing vessel, and, using these devices, a static image is obtained to measure grain size etc.
Further, as for the camera devices for granulation, coating, or the like in 7-120374 and 8-131810, camera system devices and lighting system devices are arranged within the processing vessel, and powder or granular material is made to be in a separated state by air and, then, is photographed. In that case, in the camera device of 7-120374, front end portions of the camera system and the lighting system are provided adjacently within the processing vessel, and air is supplied in the direction of photographing and in the direction at right angles with the former to put the powder or granular material in the separated state. On the other hand, in 8-131810, lighting and air injection are given obliquely in front of a lens tube containing the camera system, thus putting the powder or granular material in dispersed condition to take a picture.
Although these devices, in particular the grain size measurement device of 4-265142, are superior ones which can measure grain size etc. in real time simply and accurately, when the inside of the processing vessel is not at negative pressure, sometimes a great amount of powder or granular material adheres to the adhesive film so that it becomes impossible to measure. Further, the powder or granular material introduced in the last time remains within the drawing tube, and adheres to the adhesive film together with the powder or granular material introduced in the next time so that accurate sample can not be obtained.
Further, at the time of measurement, the adhesive film for capturing the powder or granular material is tightly fixed to the drawing tube. For next measurement, however, it should be once separated from the drawing tube and wound, so that unused portion of the film is moved to the suitable position. Thus, at the time of the movement of the film, there exist gaps between the adhesive film and the drawing tube for powder or granular material, and the powder or granular material flows out through these gaps, contaminating adjacent portions of the device and an unused portion of the adhesive film. In that case, the flowed-out powder or granular material is scattered onto the image pick-up means for obtaining sampling images, having an adverse effect on subsequent pick-ups and measurements, or making measurement itself impossible, and settlement of these problems has been desired.
On the other hand, the devices of 7-120374 and 8-131810 photograph particles by dispersing them with purging air. Thus, in an apparatus where particles are floated such as the fluidized bed apparatus, it is possible to disperse the particle, and the device of 7-120374 or 8-131810 can be used without problem for photographing particles. However, in the agitation granulating apparatus and the centrifugal tumbling granulating apparatus, a great amount of particles are in a concentrated state, and it is difficult to disperse the particles to identify an individual, and the device of 7-120374 or 8-131810 can not be applied to such a kind of granulating apparatus.
An object of the present invention is to provide a particle measurement device which can perform real-time and highly-reliable measurement of grain size etc. in various granulating apparatuses.
The above-described and other objects and new features of the present invention will be obvious from the following description and the attached drawings.

Particle measuring device for granule processing apparatus and particle measuring method


An optical fiber includes a core (1a) having an oblong rectangular or square cross section and made of quartz, and a cladding (2) surrounding the core (1a), having a circular outer cross-sectional shape, and made of resin.

Laser guides have been widely used, as optical fiber components for transmitting laser beams with high energy density, for machining equipment, etc.
Incidentally, laser machining for a surface ablation process for semiconductor, etc., using a laser beam emitted through a laser guide requires that the intensities of a laser beam at the spot irradiated with the laser beam be uniform.
A conventional optical fiber including, e.g., a core having a circular cross section, and a cladding surrounding the core is configured such that the distribution of the intensities of a laser beam at the spot irradiated with the laser beam corresponds to a Gaussian distribution. Therefore, in order to obtain uniform intensities of the laser beam at such an irradiated spot, mode scrambling is required. Here, mode scrambling denotes a process for inducing the interchange of optical power between modes in an optical waveguide, e.g., by winding an optical fiber while bending the optical fiber within the range of allowable bend radii of the fiber. However, since this mode scrambling requires the winding of an optical fiber, the optical fiber may be broken, and the size of a mode scrambling device (mode scrambler) may increase. In addition, sufficiently uniform light intensities cannot be obtained by merely winding an optical fiber having a length of hundreds of meters. This decreases processing efficiency.
PATENT DOCUMENT 1 describes an optical waveguide fiber including a core material functioning to allow light to propagate and having a rectangular cross section.
PATENT DOCUMENT 1: Japanese Examined Patent Publication No. H03-49591

Optical fiber and method for fabricating the same


A system and method for altering bone growth on and within an orthopedic implant that includes an implant body; a plurality of electrodes, wherein each electrode is at least partially embedded in the implant body, and comprises: a set of primary electrodes comprising at least one electrode, wherein a non-embedded segment of each primary electrode is proximal to a bone growth region, a set of secondary electrodes comprising at least one electrode, wherein a non-embedded segment of each secondary electrode is distal to the bone growth region, and wherein the plurality of electrodes are configured to function in a stimulation operating mode, such that a subset of primary electrodes function as cathodes and a subset of secondary electrodes function as anodes; a control system comprising a processor, and circuitry that connects to the plurality of electrodes; and a power system.

Spinal fusion is one of the most commonly performed surgical procedures within the US and in Europe. The goal of spinal fusion surgery is to introduce bone growth between two or more vertebrae, fusing them into a single, continuous unit. Spinal fusion surgery is performed in the lumbar, cervical and thoracic regions, and fusions within each region are associated with a different set of complications. Even so, most complications following spinal fusion can be generalized into two broad categories: non-fusions, where the vertebrae are not fused into a singular unit due to insufficient bone formation within the fusion space; heterotopic ossification, where bone growth damages or impinges on tissue causing harm or discomfort to the patient. Examples of heterotopic ossification includes: Anterior osteophyte formation causing mass effect on the esophagus leading difficulty of swallowing (cervical fusions); ossification of the posterior longitudinal ligament; and formation of posterior osteophyte and/or other excessive posterior bone growth pressuring the spinal cord and/or spinal nerves.
Many contemporary spinal fusion hardware and biologics include designs to address the problems associated with non-unions, with little regard to heterotopic ossification. For example, commonly used biologics, particularly recombinant human bone morphogenetic protein (rhBMP-2), have been used to reduce non-fusion rates by increasing bone formation in the fusion space and the volume surrounding it. While clinically proven to decrease non-unions, numerous studies have shown that the biologic causes a host of side effects including but not limited to cancer, tissue swelling, growth of benign tissue, teratogenicity, pathological heterotopic ossification, nerve injury and spinal cord injury. While not all side effects caused by rhBMP-2 are related to heterotopic ossification, many are. As such, the biologic represents an illustrating example of how, nonspecific, unguided osteoinduction can be harmful to a patient and the delicate balance between increasing fusion rates and avoiding heterotopic ossification.
A second method utilized in reducing non-union rates is electrical stimulation. When mechanical stress is exerted on bone, an electric field is created. In the body, this electrical field constitutes a signal causing a physiological response resulting in osteoinduction or osteolysis. Consequently, it is possible to cause osteoinduction or osteolysis by introducing an electrical field in the volume within and surrounding a segment of bone. In volumes where the current density is above a certain threshold, osteoinduction is achieved if the polarity of the field in the region is electronegative while bone in regions where the field is electropositive undergoes osteolysis.
With the advent of electrically stimulated bone growth, there is an increasing need to fine tune the methods of bone growth such that osteoinduction and osteolysis occur more precisely in the appropriate region. This invention proves such a new and useful system and method.

System and method to alter bone growth in a targeted spatial region for the use with implants


There is disclosed a method of fabricating a thin-film transistor having excellent characteristics. Nickel element is held in contact with selected regions of an amorphous silicon film. Then, thermal processing is performed to crystallize the amorphous film. Subsequently, thermal processing is carried out in an oxidizing ambient containing a halogen element to form a thermal oxide film. At this time, the crystallinity is improved. Also, gettering of the nickel element proceeds. This crystalline silicon film consists of crystals grown radially from a number of points. Consequently, the thin-film transistor having excellent characteristics can be obtained.

1. Field of the Invention
The present invention relates to a thin-film semiconductor having crystallinity and also to a method of fabricating such a thin-film semiconductor. Furthermore, the invention relates to a semiconductor device utilizing such a thin-film semiconductor. In addition, the invention relates to a method of fabricating this semiconductor device.
2. Description of the Related Art
Techniques for forming a crystalline silicon film on a glass substrate or quartz substrate and fabricating thin-film transistors (TFTs) from this silicon film are known.
These TFTs are known as high-temperature polysilicon TFTs or low-temperature polysilicon TFTs.
High-temperature polysilicon TFT fabrication is a technique utilizing a heat treatment conducted at relatively high-temperatures such as 800° C., 900° C., and more, in fabricating crystalline silicon films. It can be said that this technique has derived from IC fabrication processes making use of single-crystal silicon wafers.
Of course, quartz substrates withstanding the above-described heating temperatures are used as substrates on which high-temperature polysilicon TFTs are formed.
On the other hand, low-temperature polysilicon TFTs are fabricated on cheaper glass substrates which are, of course, inferior in heat resistance to quartz substrates.
When a crystalline silicon film forming low-temperature polysilicon TFTs is fabricated, a heat treatment at a temperature lower than 600° C. is used so that the glass substrate can stand up to it, or laser annealing technique which hardly thermally damages the glass substrate is exploited.
High-temperature polysilicon TFT fabrication technology is characterized in that it can integrate TFTs having uniform characteristics on a substrate at a high density.
On the other hand, low-temperature polysilicon TFTs can make use of glass substrates which are cheap and can easily provide large areas.
It is to be noted that with the current technology, high-temperature polysilicon TFTs do not differ greatly from low-temperature polysilicon TFTs in characteristics. The slight differences between them are that high-temperature polysilicon TFTs are superior in production yield and uniformity of characteristics across the substrate while low-temperature polysilicon TFTs are superior in productivity and production cost.
With respect to the characteristics, both kinds of TFTs show mobilities of approximately 50 to 100 cm2/V s and S values of about 200 to 400 mV/dec (VD=1 V).
These characteristics mean that these TFTs can operate at speeds about two orders of magnitude higher than those of TFTs using amorphous silicon. However, the characteristics of the high-temperature polysilicon TFTs are much inferior to those of MOS transistors using single-crystal silicon wafers. Generally, the S values of MOS transistors employing single-crystal silicon wafers are on the order of 60 to 70 mV/dec. Furthermore, their operating frequencies are 1-2 orders of magnitude higher than those of high- and low-temperature polysilicon TFTs.
At present, TFTs are used to integrate the active matrix circuit of an active matrix liquid crystal display and its peripheral driver circuit on the same substrate. That is, the active matrix circuit and peripheral driver circuit are fabricated from TFTs on the same substrate.
In this configuration, the source driver circuit of the peripheral driver circuit is required to operate considerably above 10 MHz. Today, however, with respect to a circuit composed of high- and low-temperature polysilicon TFTs, a margin of only several megahertz is given to the operating speed.
Accordingly, it is customary to multiplex the operation, so that a matrix-driven liquid crystal display is fabricated. However, this method has the disadvantage that stripes appear on the viewing screen due to subtle deviations of timing of multiplexing.
A conceivable forthcoming technique is to integrate oscillator circuits, D/A converters, A/D converters, and digital circuits for performing various kinds of image processing on the same substrate, in addition to the peripheral driver circuit including a shift register circuit and a buffer circuit.
However, it is necessary that the aforementioned oscillator circuits, D/A converters, A/D converters, and digital circuits for performing various kinds of image processing operate at higher frequencies than the peripheral driver circuit.
Therefore, it is substantially impossible to fabricate these circuits from the high- and low-temperature polysilicon TFTs obtained by the current techniques.
It is to be noted that an integrated circuit which consists of MOS transistors using a single-crystal silicon wafer and can be operated above 100 MHz has been put into practical use.

Semiconductor active region of TFTs having radial crystal grains through the whole area of the region

Semiconductor Energy Laboratory Co., Ltd.


A low overhead, efficient, and simple protection check circuit is inserted into a data path between a master requester and a target resource such as a memory or input/output device. The master requester initiates a memory request, a pio access request, or a dma transaction directed to the target resource. For example, the master requester may be a processor accessing a memory, a processor performing programmed I/O (pio). Alternatively, the master requester may be a DMA device performing direct memory access of a memory. The protection check circuit is configured at initialization time by an operating system or a privileged software process, then passively monitors all transactions on the data paths, disallowing accesses that fail the protection check operation.

1. Field of the Invention
The present invention relates generally to a system and method for controlling access to system resources in hardware, most particularly in a system including a processor, memory, and devices, but including neither a processor memory management unit (PMMU) nor an input/output memory management unit (IOMMU).
2. Description of the Related Art
Generally user process.sub.-- level protection in CPU-based hardware systems such as computer systems and embedded controller systems is supplied by a system memory management unit (MMU). The MMU in a conventional system performs several functions including address translation from virtual to physical addresses, and remapping and realigning of noncontiguous physical address segments into contiguous virtual addresses. The MMU of a conventional system also controls access to system hardware resources using protection checks built into MMU logic. This access control prevents one user-level process from writing into physical memory pages assigned to another process, reading from the physical memory pages or executing from the physical memory pages. The access control functionality of the MMU of a conventional system also supplies address mapping to input/output devices under control of an operating system such that a user process with no mapping to the input/output device does not even detect that the input/output device is present in the system.
Unfortunately memory address protection is compromised in systems that do not include memory management unit hardware and in systems that do include a memory management unit but employ an operating system that does not exploit the protection capabilities of the MMU. User-level resource protection is difficult to achieve in a system that does not include or fails to exploit MMU hardware. In some real-time embedded systems, the memory management unit (MMU) may not be used due to the overhead of managing virtual memory. In a system that does not exploit the MMU, either an entire application executes in a single kernel context or multiple user-level contexts trap into a single kernel context for device access.
A system that runs the Java.TM. Virtual Machine (JVM) is an example of a system that does not use an MMU but operates in an environment that generally demands resource protection. The Java.TM. Virtual Machine (JVM) is available from Sun Microsystems, Inc. and supports a multi-threaded environment for the Java.TM. programming language (also available from Sun Microsystems, Inc). Java, SpecJava, Sun, Sun Microsystems and the Sun Logo are trademarks or registered trademarks of Sun Microsystems, Inc. in the United States and other countries. All SPARC trademarks are used under license and are trademarks of SPARC International, Inc. in the United States and other countries. Products bearing SPARC trademarks are based upon an architecture developed by Sun Microsystems, Inc.
The JVM allows multiple tasks to execute within a common address space in a well-defined and secure environment. Resource protection is highly advantageous in the JVM environment since, although JVM supports multi-tasking, many applications run multiple instances of the JVM with each instance generally using resources independently of the other instances but concurrently with the execution of the other instances.
The JVM may be used with an operating system or without an operating system. For example, in a workstation or computer environment running the Unix operating system that supports multiple user processes, many instances of JVM execute concurrently with the Unix operating system supplying access control to resources. However in other systems, such as embedded controllers or systems executing on a processor with no memory management unit (MMU), access control to input/output devices is not ensured even when the underlying operating system supplies independent sections of memory address space for execution of each process. In such systems, access control is typically achieved only indirectly by an application. Direct user-level access control of system devices is not available in hardware.
Resource protection is difficult or impossible to achieve efficiently in a conventional JVM system with no MMU support since such protection is only implemented using software-based techniques executing inside the operating system that hosts the JVM. Such software-based protection entails a heavy overhead burden. One example of a technique for indirectly controlling access is the issuance of a system call by a process that directs a kernel to access the input/output device on behalf of the operating system.
What is needed is a system and technique for controlling process level access to devices such as memory and input/output (I/O) devices from user space in the absence of a memory management unit (MMU) and when the MMU access control functionality is not exploited.

Method and apparatus for implementing hardware protection domains in a system with no memory management unit (MMU)


An apparatus for use in controlling a simulated target position in a millimeter wave, hardware-in-the-loop system includes a pair of horns and a conditioning circuit. The conditioning circuit is capable of generating a pair of output millimeter wave signals, each to be broadcast from a respective one of the horns, the output millimeter wave signals being out of phase by a predetermined amount, and capable of attenuating at least one of the output millimeter wave signals to control the position of the simulated target in a first and a second region. A method for use in controlling a simulated target position in a millimeter wave, hardware-in-the-loop system includes generating a pair of output millimeter wave signals that are out of phase by a predetermined amount; attenuating at least one of the output millimeter wave signals to control the position of the simulated target in a first and a second region; and broadcasting the millimeter wave signals. The method and apparatus can be extended to four horns arranged in a quad configuration to control position in two dimensions and can be extended to a test array comprising a plurality of horn pairs and horn quads.

1. Field of the Invention
The present invention pertains to hardware-in-the-loop testing of millimeter wave tracking and guidance systems and, more particular, to a technique for controlling the position of a simulated target for such testing.
2. Description of the Related Art
A need of great importance in military and some civilian remote sensing operations is the ability to quickly detect and identify objects, frequently referred to as "targets," in a "field of regard." A common problem in military operations, for example, is to detect and identify targets, such as tanks, vehicles, guns, and similar items, which have been camouflaged or which are operating at night or in foggy weather. It is important in many instances to be able to distinguish reliably between enemy and friendly forces. As the pace of battlefield operations increases, so does the need for quick and accurate identification of potential targets as friend or foe and as a target or not.
Remote sensing techniques for identifying targets have existed for many years. For instance, in World War II, the British developed and utilized radio detection and ranging ("RADAR") systems for identifying the incoming planes of the German Luftwaffe. RADAR uses radio waves to locate objects at great distances even in bad weather or in total darkness. Sound navigation and ranging ("SONAR") has found similar utility and application in environments where signals propagate through water, as opposed to the atmosphere. While RADAR and SONAR have proven quite effective in many areas, they are inherently limited by a number of factors. For instance, RADAR is limited because of its use of radio frequency signals and the size of the resultant antennas used to transmit and receive such signals. Sonar suffers similar types of limitations. Thus, alternative technologies have been developed and deployed.
Some of these alternative technologies are optical in nature. One such alternative technology is laser detection and ranging ("LADAR"). Similar to RADAR systems, which transmit and receive radio waves to and reflected from objects, LADAR systems transmit laser beams and receive reflections from targets. Because of the short wavelengths associated with laser beam transmissions, LADAR data exhibits much greater resolution than RADAR data. Typically, a LADAR system creates a three-dimensional ("3-D") image in which each datum, or "pixel", comprises an (x,y) coordinate and associated range for the point of reflection. However, some optical systems operate two-dimensionally. Optical systems can be used for automatic target recognition, targeting, direction finding, and other, similar tasks.
Such tracking and guidance systems are typically expensive to design and build, even in prototype. Furthermore, they are usually designed to operate over relatively long distances and frequently at high speeds. New designs are therefore tested by simulation. Hardware-in-the-loop ("HWIL") simulations for RF missile seeker guidance verification requires simulated target angle motion in synchronization with the missile motion simulator in order to evaluate intercept performance. Target angle motion control has classically been achieved with either mechanical x-y positioners or exotic electronic implementations to achieve the desired results. Mechanical positioners are costly and have limited coverage and acceleration, high losses, poor phase stability, and low reliability. Classical exotic electronic techniques use amplitude and phase control at lower frequencies with up-conversion to millimeter wave ("MMW") for each element. This is expensive and requires extensive calibration.
More particularly, missile tracking and guidance systems are typically tested during development in an anechoic chamber. The guidance system prototype is placed at one end of the anechoic chamber. The wall of the chamber at the opposite end is honeycombed with antennas, sometimes referred to as "horns." The antennas are controlled in groups of three referred to as "triads," to radiate energy in a pattern that will simulate the presence of a target. More particularly, each horn of the triad radiates a signal, and the three signals interfere with each other at a desired point. The desired point is in the two-dimensional, triangular space defined by the triad. To simulate movement of the target within the triad, the radiated energy can be controlled to "move" the simulated target within the triad. Movement can be simulated outside of a given triad, but within the honeycomb pattern as a whole, by forming new triads and controlling their radiated energy similarly. Because the simulated target's position is defined within the triad whose signal's generate it, the target cannot be simulated at a position outside the physical dimensions of the honeycomb of antennas.
The present invention is directed to resolving, or at least reducing, one or all of the problems mentioned above.

Electronic target position control at millimeter wave for hardware-in-the-loop applications