An apparatus for the treatment of water includes an elongated housing having a first end and a second end. The first end has a water inlet and the second end has a water outlet. An elongated ultraviolet radiation source with a sleeve is concentrically located within the elongated housing. The elongated ultraviolet radiation source has, at its first end, electrical connections, which extend through the second end of the housing and have a second free end held in a support element. The support element includes a supporting structure containing a ring element and from thereon radially inwardly running arms. The arms are designed in such a way that during assembly the arms are resiliently deformed and wherein, if assembled, the arms are pressed against the sleeve, so that the free end of the ultraviolet radiation source is held by the arms in a resilient manner.

Ultraviolet radiation for the treatment of water utilizes an elongated radiation source in the form of an elongated ultraviolet lamp located within a quartz sleeve. In domestic water treatment units, the lamp and sleeve are typically located within a tube or housing through which the water to be treated is passed.
The sleeve needs to be supported within a closed vessel system to avoid mechanical breakage. Typically, single ended sleeves are supported on the inlet section of these mentioned vessels. In particular (but not only) single lamp reactor systems benefit from any turbulent flow to increase retention time.
It is known the use of diffuser plates to impart turbulence and rotational flow of water within the vessel, to improve the uniformity and predictability of the treatment of the water. Further known are the use of a fin to impart turbulence to water as it flows into the annular chamber of a water treatment unit and water treatment devices having an inlet baffle plate with orifices.
CA 2 875 147 A1 discloses a photoelectric catalytic oxidation system with a container housing a counterelectrode and a photoelectrode arranged around a UV light source, wherein the photoelectrode is irradiated with UV light for photocurrent and/or chlorine generation. A spacer element is disposed between a sleeve tube and a housing. The spacer has two concentric rings connected with radial bridges. The spacer is not designed to resiliently support the free end of the sleeve tube.
US 2012/0051977 A1 discloses a point of use water treatment system, wherein the free end of the UV lamp is support by radial fins which are secured to the sides of cap portion of the housing. The fins connect an inner ring with the cap portion, wherein the connection is stiff in radial direction. The free end of the UV lamp is positioned in the inner ring structure or in a spring connected to the inner ring structure. The UV lamp is not resiliently supported by deformable arms.
U.S. Pat. No. 4,767,932 A, which is considered the closest prior art document, discloses a UV purification system with a resilient spacer arranged between a UV lamp and a quartz sleeve. The resilient spacer is provided to minimize stress of vibration and to resiliently maintain the respective lamp in special relationship within the respective quartz jacket. The resilient spacer comprises a resilient split ring or collar which is adapted to be snap fitted about the lamp. Projecting laterally and circumferentially spaced about the circumference of the collar are a plurality of resilient or spring fingers which are directed outwardly. Since the split ring on the inside of the spacer and is mounted directly to the lamp or to the sleeve tube, this ring covers a relatively large portion of the surface, thereby shadowing the water from part of the UV light.


A rafter square is provided with a triangular base plate, having a flanged base edge portion, a side edge portion, and a hypotenuse edge portion. An extension arm is selectively movable from a retracted position, closely adjacent the hypotenuse edge, to an extended position that is in-line with, but extends beyond a distal end of the side edge. Various locking mechanisms are provided for selectively locking the extension arm in either or both of its retracted or extended positions.

1. Field of the Invention
The present invention relates to rafter squares used to determine and mark the correct base cut and common cut angles for rafters and more particularly to a rafter square having a selectively extendable arm that is used to extend the marking edge of the rafter square to accommodate a user in common instances where the marking edge of the rafter square does not extend from one edge of the rafter to the opposite edge of the rafter.
2. Description of the Prior Art
Framers in the construction arts have used rafter squares for many years for determining and marking the correct base cut and common cut angles for rafters and the like. The common rafter square is provided in the form of a right-triangular plate having a flanged base leg, a side leg and a hypotenuse leg. When used for base cut marks, the rafter square is positioned on a board, with its pivot point positioned closely adjacent one edge of the board. The rafter square is pivoted until the appropriate unit rise mark, within a marking orifice formed within the rafter square, is positioned closely adjacent the edge of the board against which the pivot point is placed. Next, the user typically marks the cut line along the marking edge of the side leg. Oftentimes, however, the distance across the board, along the angle at which the marking edge is placed, is greater than the length of the measurement edge itself. In these instances, the user may simply draw a partial line using the measurement edge, reposition the rafter square, to place the hypotenuse edge adjacent the partial line, and then complete the base cut mark. However, additional steps in the marking process become time consuming and cumbersome over the course of a framer's day. Moreover, repositioning the rafter square in order to make a second attempt at the base cut mark increases the risk that the resulting mark will be inaccurate. Until the present invention, however, the only alternative to this additional step was to guess at the exact position of the remainder of the partially drawn base cut mark by drawing the remainder of the mark freehand.
Accordingly, what is needed is a rafter square that functions similarly to prior art rafter squares until a cut mark is required that is longer than one or more of the edges found on a prior art rafter square, at which time the marking edge should be capable of being selectively extended across the remainder of the board. The design of such an improved rafter square should provide ease of use in extending and retracting the marking edge in order to reduce the overall time spent using the rafter square, relative to the time spent using prior art rafter squares.


Various arrangements for performing intelligent cellular channel management are presented herein. A physical cellular communication channel may be established between a user equipment (UE) and a cellular network for sending a short message service (SMS) message in response to a cellular service request from the UE. One or more characteristics of the UE, the SMS message, or both may be analyzed. A duration of time for which the physical cellular communication channel is kept active may be based on the analyzed one or more characteristics. A channel maintenance instruction may be transmitted to keep the physical cellular communication channel active based on a cellular network messaging controller determining to adjust the duration of time for which the physical cellular communication channel is kept active.

For data to be exchanged between a user equipment (UE) and a cellular network, a communication channel needs to be established between the UE and cellular core network. Establishment of this communication channel involves processing and signaling overhead. Once the channel is established, the channel may be maintained for a period of time based on a timer. If additional data needs to be exchanged between the UE and the cellular network before the timer expires, the channel can be reused. However, if additional data needs to be exchanged between the UE and the cellular network after the timer expires, a new channel may need to be created, which involves the requisite overhead, since the previous channel would have been "torn down," set to idle, or closed on expiration of the timer.


A photoelectric converting layer lamination type solid-state image pick-up device comprises: a semiconductor substrate; at least three layers of photoelectric converting layers each of which is interposed between a common electrode layer and pixel electrode layers, the pixel electrode layers corresponding to pixels respectively, wherein said at least three layers of photoelectric converting layers are laminated through insulating layers, said at least three layers of photoelectric converting layers being above the semiconductor substrate, and wherein each of said at least three layers of photoelectric converting layers is separated into layers corresponding the pixels respectively.

1. Field of the Invention
The present invention relates to a solid-state image pick-up device in which a photoelectric converting layer for generating a signal charge corresponding to a quantity of an incident light is laminated on a semiconductor substrate on which a signal reading circuit is formed, and more particularly to a photoelectric converting layer lamination type solid-state image pick-up device in which S/N of an image signal obtained by a photoelectric converting layer is enhanced.
2. Description of the Related Art
A prototype unit of a photoelectric converting layer lamination type solid-state image pick-up device has been described in JP-A-58-103165, for example. The solid-state image pick-up device has a structure that three photosensitive layers are laminated on a semiconductor substrate and respective electric signals for red (R), green (G) and blue (B) colors detected by each photosensitive layer are read by an MOS circuit formed on a surface of the semiconductor substrate.
The solid-state image pick-up device having such a structure was proposed in the past. Subsequently, a CCD type image sensor and a CMOS type image sensor in which a large number of light receiving portions (photodiodes) are integrated on a surface portion of the semiconductor substrate and color filters for red (R), green (G) and blue (B) colors are laminated on each light receiving portion have progressed remarkably. At present, an image sensor in which several million light receiving portions (pixels) are integrated on a chip is mounted on a digital still camera.
However, the techniques of the CCD type image sensor and the CMOS type image sensor have progressed to an almost limit and a size of an opening of one light receiving portion has been close to a wavelength order of an incident light, that is, approximately 2 μm. For this reason, they have been confronted with a problem in that a manufacturing yield is poor.
Moreover, an upper limit of a quantity of optical charges stored in one light receiving portion which is microfabricated is small, that is, approximately 3000 electrons. Consequently, it has also been difficult to finely represent 256 gradations. For this reason, it has been hard to expect a more excellent image sensor of a CCD type or a CMOS type in respect of picture quality or a sensitivity.
As a solid-state image pick-up device for solving these problems, a solid-state image pick-up device proposed in JP-A-58-103165 has been reconsidered. Consequently, image sensors described in Japanese Patent No. 3405099 and JP-A-2002-83946 have been proposed newly.
The image sensor described in Japanese Patent No. 3405099 has such a structure that hyperfine particles of silicon are dispersed in a medium to form a photoelectric converting layer and three photoelectric converting layers having sizes of the hyperfine particles changed are laminated on a semiconductor substrate, and electric signals corresponding to quantities of received lights for red, green and blue colors are generated from each of the photoelectric converting layers.
Also in the image sensor described in JP-A-2002-83946, three nanosilicon layers having different particle sizes are laminated on a semiconductor substrate and each of electric signals for red, green and blue colors which are detected in the respective nanosilicon layers is read onto a storage diode formed in a surface portion of the semiconductor substrate.
FIG. 5 is a typical sectional view corresponding to two pixels for the related-art photoelectric converting layer lamination type solid-state image pick-up device. In FIG. 5, a high concentration impurity region 2 for storing a red signal, an MOS circuit 3 for reading a read signal, a high concentration impurity region 4 for storing a green signal, an MOS circuit 5 for reading a green signal, a high concentration impurity region 6 for storing a blue signal and an MOS circuit 7 for reading a blue signal are formed on a surface portion of a P well layer 1 provided on an n-type silicon substrate.
Each of the MOS circuits 3, 5 and 7 is constituted by impurity regions for a source and a drain which are formed on the surface of the semiconductor substrate and a gate electrode formed through a gate insulating layer 8. An insulating layer 9 is laminated on the gate insulating layer 8 and the gate electrodes and is flattened and a shielding layer 10 is laminated thereon. In many cases, the shielding layer is formed by a thin metal layer. Therefore, an insulating layer 11 is further formed thereon.
Signal charges stored in the high concentration impurity regions 2, 4 and 6 for storing the color signals are read to an outside by the MOS circuits 3, 5 and 7.
A pixel electrode layer 12 divided for each pixel is formed on the insulating layer 11 shown in FIG. 5. The pixel electrode layer 12 for each pixel is conducted through a columnar electrode 13 to the high concentration impurity region 2 for storing a red signal for each pixel. The columnar electrode 13 is electrically insulated from components other than the pixel electrode layer 12 and the high concentration impurity region 2.
A photoelectric converting layer 14 for detecting a red color is laminated on the pixel electrode layer 12 in a one-sheet structure in common to each pixel, and furthermore, a transparent common electrode layer 15 is formed thereon in a one-sheet structure in common to each pixel.
Similarly, a transparent insulating layer 16 is formed on the common electrode layer 15 and a transparent pixel electrode layer 17 divided for each pixel is formed thereon. Each pixel electrode layer 17 and the high concentration impurity region 4 for storing a green signal for each pixel corresponding thereto are conducted through a columnar electrode 18. The columnar electrode 18 is electrically insulated from components other than the pixel electrode layer 17 and the high concentration impurity region 4. A photoelectric converting layer 19 for detecting a green signal is formed on each pixel electrode layer 17 in a one-sheet structure in the same manner as the photoelectric converting layer 14, and a transparent common electrode layer 20 is formed thereon.
A transparent insulating layer 21 is formed on the common electrode layer 20 and a pixel electrode layer 22 divided for each pixel is formed thereon. The pixel electrode layer 22 is conducted to the high concentration impurity region 6 for storing a blue signal for each pixel corresponding thereto through a columnar electrode 26. The columnar electrode 26 is electrically insulated from components other than the pixel electrode layer 22 and the high concentration impurity region 6. A photoelectric converting layer 23 for detecting a blue signal is laminated on the pixel electrode layer 22 in a one-sheet structure in common to each pixel, a transparent common electrode layer 24 is formed thereon and a transparent protective layer 25 is formed as an uppermost layer.
When a light is incident on the solid-state image pick-up device, optical charges corresponding to the quantities of incident lights having blue, green and red colors are excided in each of the photoelectric converting layers 23, 19 and 14. A voltage is applied between the common electrode layers 24, 20 and 15 and the pixel electrode layers 22, 17 and 12 so that the respective optical charges flow into the high concentration impurity regions 2, 4 and 6 and are read as blue, green and red signals to an outside through the MOS circuits 3, 5 and 7.
In the related-art photoelectric converting layer lamination type solid-state image pick-up device shown in FIG. 5, there is a problem in that a difference in a sensitivity for each color is made and a color balance of a pick-up image is thus lost to cause a deterioration in picture quality if the photoelectric converting efficiencies of the photoelectric converting layers 14, 19 and 23 are not equal to each other. Moreover, there is also a problem in that S/N is reduced because of an insufficient pixel separation of a detection signal through each pixel electrode layer. Furthermore, there is also a problem in that a quantity of a received light in a peripheral part of the solid-state image pick-up device is smaller than that in a central part thereof and shading is thus generated in an incorporation in a digital still camera in some cases.

Photoelectric converting layer lamination type solid-state image pick-up device


A method and a device for the draw expansion of metal tubes of oval cross-section uses expansion elements drawn unidirectionally through metal tubes by means of draw elements. The expansion elements are fastened to the draw elements by suspension devices which have a hammer-like contour. The draw elements are preferably made of a rod-shaped material. An apparatus of the invention is an apparatus for mechanically expanding metallic tubes, in particular tubes in heat exchangers. Each individual tube to be expanded is held in at least one holding device and passed through by a drawing mandrel with an expanding element. To prevent jamming of the expanding element in one of the holding devices, the holding devices are provided with lateral guides which are resiliently compliant outward in the radial direction. When the expanding element passes through the metallic tube, the tube is expanded in the radial direction. The forces occurring thereby in the axial direction are absorbed by the holding device, since the tube is seated on a stop in the holding device.

The invention relates to a method and device for expanding metal tubes, particularly metal tubes of oval cross-section, to fasten the metal tubes to metal ribs.
It is known from EP-B1 188 314 to connect metal tubes of oval or elliptical cross-section and metal ribs to one another by mechanically expanding the metal tubes. Here, expansion elements are pushed through the metal tubes, the expansion operation taking place in two stages.
A similar single-stage expansion method and a device in the form of an expansion mandrel having an expansion head and a thrust rod is disclosed by DE-A-27 05 632.
A disadvantage in the above-mentioned prior art is that the metal tubes are under compressive load during the expansion and can consequently bend out or buckle. Leakages can occur at the tube-plate connection due to this bending or buckling of the tubes. The mandrel rod is likewise under compressive load. Here, too, there is a risk of buckling, the expansion element tilting in the metal tube and the expansion of the tube becoming uneven.
The present invention also relates to an apparatus for mechanically expanding metallic tubes, in particular tubes in heat exchangers, the apparatus including a drawing mandrel with an expanding element and a holding device. It is suitable, for example, for a process for producing heat exchangers, such as that described in the first part of the present invention. For each tube to be expanded, such an apparatus has a drawing mandrel with an expanding element and at least one holding device. The tubes are pre-expanded at their ends and fitted into the holding device. Subsequently, the tube is passed through by the drawing mandrel and the expanding element, the tube being expanded. The pre-expanding is necessary in order that the expanding element can be passed completely through the tube and does not jam in the holding device. The pre-expanding of the tubes is an independent operation and consequently a not inconsiderable cost factor.

Method and device for expanding metal tubes


An optical branch device, comprising: a branch portion having a first branch waveguide extended linearly and continuously from a waveguide in a basis portion, and second and third branch waveguides extended in the directions farther from the first branch waveguide in such a manner that the first branch waveguide is interposed between the second and third branch waveguides; a parallel portion in which the second and third branch waveguides are positioned in parallel to the first branch waveguide; and a divergent portion in which the second and third branch waveguides are extended gradually farther from the first branch waveguide; wherein the interval pitch P (μm), in the transverse direction, between the first, second and third branch waveguides in the parallel portion and the refractive index difference (Δn) between the core and the clad are set in such a manner that C satisfies a relationship of C=0.5±0.2 wherein C is calculated by substituting P and Δn for an equation of C=Δn×P2.

1. Field of the Invention
The present invention relates to an optical branch device for branching signal light in optical communication or the like.
2. Description of the Related Art
In optical communication or like, an optical branch device for branching input signal light into plural components is used as the need arises.
FIG. 23 is a plan view of waveguides of a conventional 4-branched device. In this conventional 4-branched device, a basic waveguide 1 is branched into 4 waveguides 2a, 2b, 3 and 4 at a time. FIG. 24 is a graph showing dimensions of the waveguides when optical outputs of the branched waveguides are simulated about the conventional 4-branched device illustrated in FIG. 23. The transverse axis therein represents the length X in the transverse direction, and the vertical axis represents the length Z in the vertical direction.
FIG. 25 is a graph showing results of the simulation. The transverse axis therein represents the waveguide width of each of the waveguides, and the vertical axis therein represents the output ratio of the inside waveguides 2a and 2b to the outside waveguides 3 and 4 (the ratio of the inside output/the outside output). Δn's each show the refractive index difference between the core of the waveguides and the clad thereof. As shown in FIG. 25, the ratio of the inside output/the outside output varies with a change in the waveguide width. The ratio of the inside output/the outside output varies with a change in the Δn. In optical branch devices, it is desired that optical outputs from their respective branched waveguides are equal to each other and uniform. However, as shown in FIG. 25, in conventional optical branch devices, outputs from their respective branched waveguides are largely varied in accordance with fluctuation in the waveguide width thereof or the refractive index difference (Δn) between their core and their clad. Accordingly, outputs from the respective branched optical waveguides are varied by variation in production conditions. Thus, there is a problem that devices having a uniform quality cannot be produced with a high yield.
As a conventional 4-branched device, known is a 4-branched device wherein one waveguide is first branched into three waveguides and subsequently the central waveguide is further branched into two waveguides (JP-A-8-271744 and so on). In such an optical branch device, it is preferred that one waveguide is firstly branched into three waveguides so as to make the optical intensity of the central waveguide two times larger that of the waveguides on both sides thereof, that is, so as to set the ratio between outputs therefrom to 1/2/1, and subsequently the central waveguide is branched into two waveguides so as to set the ratio between optical intensities therefrom to 1/1, whereby the finally-branched four waveguides emit optical signals at an optical output ratio of 1/1/1/1.
FIG. 26 is a plan view of the initially-branched, 3-branched portion in the 4-branched device. Three branched optical paths 2, 3 and 4 are branched in the form of straight lines from a basic waveguide 1. About this 3-branched waveguide, it is known that when the branch angles θ between the waveguide 2 and the waveguide 3 and between the waveguide 2 and the waveguide 4 are set to 1° or less, the optical intensity ratio of the branched path 3/the branched path 2/the branched path 4 becomes a ratio of 1/2/1 (Correspondence course lecture text "Introductory Lecture, Basis and Actual Application of Optical Waveguide Design", published by Technical Information Institute Co., Ltd., Second Section, pp. 4–5).
Accordingly, in a 3-branched waveguide as illustrated in FIG. 26, the branch angles θ therein are set into 1° or less and then the central branched waveguide is further branched into two, whereby a 4-branched device wherein outputs from the respective branched waveguides are equal to each other can be yielded. FIG. 27 is a plan view of such a 4-branched waveguide device. In the 4-branched waveguide device illustrated in FIG. 27, the branch angles θ are set to 1°, and further the interval between any adjacent two out of the 4 branched paths is set to 250 μm in order to connect the paths to an optical fiber array. Optical fiber arrays are widely used in the field of optical communication, and are devices wherein optical fibers are arranged at a pitch of 250 μm. For this reason, the length of the branched paths becomes 21.5 mm. Thus, a very long 4-branched waveguide device is unfavorably formed. If the length of waveguides becomes long in this manner, a large insertion loss (−10 log (the ratio of the output/the input) (unit: dB)) is unfavorably generated.

Optical branch device and optical coupler module


Semiconductor device chips having a first layer of semiconductor material, a second layer of a semiconductor material and an insulating layer disposed therebetween. The first layer of semiconductor material has doped semiconductor regions disposed therein, and the second layer of semiconductor material has a power device disposed therein. The power device is disposed beneath the doped semiconductor region of the first layer. Trenches may be located within the first layer of semiconductor material to electrically isolate different areas having doped semiconductor regions. The insulating layer is typically formed from an oxide.

1. Field of the Invention
The present invention relates to a process for manufacturing integrated circuits, particularly of intelligent power semiconductor devices.
2. Discussion of the Related Art
In manufacturing integrated circuits, the problem of obtaining chip regions which are electrically insulated from one another exists. For example, in power semiconductor devices provided with on-chip driving circuitry (also called intelligent power semiconductor devices), the power device must be electrically insulated from the driving circuitry.
The most common technique to achieve this electrical insulation is PN junction isolation. However, this technique gives rise to some problems, especially related to the introduction of parasitic components.
Considering for example a Vertical Intelligent Power semiconductor device (VIP), such as an NPN power bipolar transistor constituted by an N++ emitter region diffused into a P-type base region which is in turn diffused into an N-type epitaxial layer representing the collector of the transistor. The driving circuitry is obtained inside a P-type well which is diffused into the N-type epitaxial layer and connected to the lowest voltage among those utilized in the chip to keep the P-type well/N-type epitaxial layer junction reverse biased. Inside the P-type well, vertical NPN transistors and lateral PNP transistors are generally obtained. In this structure, a number of parasitic bipolar transistors are present, both NPN and PNP, having base, emitter and collector represented by the various P-type or N-type regions inside the P-type well, the P-type well itself and the N-type epitaxial layer. Another PNP parasitic transistor has emitter, base and collector respectively represented by the P-type base region of the power transistor, the N-type epitaxial layer and the P-type well. All such parasitic components limit VIP performances.

Dielectrically isolated power semiconductor devices

Consorzio per la Ricerca sulla Microelettronica nel Mezzogiorno


An inductive load drive circuit includes a transistor for pulling-in an excitation current having a predetermined polarity and generated by an inductive load. The transistor is turned-on by a first idling loop when a drive voltage of the inductive load has a negative polarity, and the transistor is turned-on by a second idling loop when the drive voltage has a positive polarity. Though both of the first idling loop and the second idling operate on the basis of the drive voltage, in pulling the excitation current into the circuit, the drive voltage reaches a lower limit of a dynamic range at a time that the first idling loop is suitably operated while the drive voltage reaches an upper limit of the dynamic range at a time that the second idling loop is suitably operated.

1. Field of the Invention
The present invention relates to an inductive load drive circuit. More specifically, the present invention relates to an inductive load drive circuit which is applied to a disc drive for a disc such as CD (Compact Disc), CD-ROM, MD (Mini Disc) and etc., and controls a current flowing an inductive load included in a pickup feeding motor, a spindle motor, a loading motor, a lens actuator and etc.
2. Description of the Prior Art
One example of conventional such a kind of inductive load drive circuit is shown in FIG. 4 and FIG. 5. In a case where the inductive load drive circuit shown in FIG. 4 is provided in the lens actuator of an optical pickup, excitation currents I.sub.A and I.sub.B flowing an inductive load L are switched in response to an input voltage V.sub.i based on a tracking control signal or a focus control signal. That is, the input voltage V.sub.i is amplified by a negative feedback amplifier 1 including an operational amplifier 2, whereby a drive voltage V.sub.O of the inductive load L is obtained. The excitation currents I.sub.A and I.sub.B having phases each delayed 90 degrees from the drive voltage V.sub.O flow through the inductive load L.
An output stage of the operational amplifier 2 is constituted as shown in FIG. 5. The drive voltage V.sub.O is outputted from an output terminal S1 in response to a control voltage V.sub.c applied to a base of a transistor T4. As shown in FIGS. 6A and 6B, the phases of the excitation currents I.sub.A and I.sub.B flowing through the inductive load L are respectively delayed 90 degrees from the drive voltage V.sub.O. In FIG. 6A, a positive excitation current I.sub.A flows into the inductive load L, and a negative excitation current I.sub.B flows from the inductive load L.
Furthermore, a push-pull circuit is constituted by transistors T3 and T1. Accordingly, when the excitation current I.sub.A flows into the inductive load L, the transistor T3 is turned-on and the transistor T1 is turned-off. On the other hand, when the excitation current I.sub.B flows from the inductive load L, the transistor T3 is turned-off and the transistor T1 is turned-on.
When the excitation current I.sub.A flows, a collector voltage of a transistor T4 becomes slightly higher than the drive voltage V.sub.O, whereby the transistor T3 is turned-on. In contrast, when the excitation current I.sub.B flows, the collector voltage of the transistor T4 becomes equal to the drive voltage V.sub.O, whereby the transistor T1 is turned-on by an idling loop composed of a constant-current source C1, diodes D1 and D2, and transistors T5 and T6. That is, the diodes D1 and D2 are inserted between the output terminal S1 and a base of the transistor T5, and forward drop voltages of the diodes D1 and D2 and base-emitter voltages between bases and emitters of the transistors T5 and T6 are equal to each other, respectively. Though the transistors T5 and T6 are not turned-on if the collector voltage of the transistor T4 is larger than the drive voltage V.sub.O, the transistors T5 and T6 are turned-on if the collector voltage of transistor T4 becomes equal to the drive voltage V.sub.O, whereby the transistor T1 becomes a conductive state, and the excitation current I.sub.B flows from the inductive load L.
In such a prior art, since the constant-current source C1 and the diodes D1 and D2 are inserted between a power source V.sub.CC and the output terminal S1, an upper limit of the drive voltage V.sub.O that the idling loop is operated is "V.sub.CC -V.sub.SAT(C1) -2V.sub.F "(V.sub.SAT(C1) : a saturation voltage of the constant-current source C1). On the other hand, when the excitation current I.sub.B flows, the transistor T3 is not turned-on, and thus, an upper limit of a dynamic range of the drive voltage V.sub.O is more than "V.sub.CC ". Accordingly, there is a possibility that the transistor T1 is not suitably controlled, and thus, a negative feedback operation becomes unstable. That is, since the phase of the current flowing through the inductive load L is delayed by 90 degrees from the drive voltage V.sub.O, it is necessary to turn-on the transistor T1 such that the current I.sub.B can flow during a period shown by oblique lines in FIGS. 6A and 6B. Accordingly, if the drive voltage V.sub.O is too large, the transistor T1 is not suitably turned-on, and therefore, the negative feedback operation becomes unstable.


A process for producing an inorganic oxide organosol that has good dispersibility and low viscosity, has excellent transparency, and shows good compatibility with resin solutions, and includes the steps (A) and (B) of: (A) adding silicon alkoxide having two or more alkoxy groups bonded to a silicon atom or having one or more hydroxy groups bonded to a silicon atom and one or more alkoxy groups bonded to a silicon atom to a hydrophilic inorganic oxide sol containing a hydrophilic solvent having a boiling point (1 atm) of 100° C. or less in an amount of 25 to 100% by weight in a dispersion medium to treat surface of the inorganic oxide particles in the sol; and (B) replacing the dispersion medium of the surface treated inorganic oxide sol obtained in step (A) with a non-alcoholic organic solvent in the presence of a primary alcohol having 3 to 12 carbon atoms.

1. Field of the Art
The present invention relates to a process for producing an inorganic oxide organosol comprising inorganic oxide particles, to silicon atoms on the surface of which primary alkoxy groups with 3 to 12 carbon atoms being bonded, being stably dispersed in a organic solvent.
2. Description of the Related Art
There are proposed processes for producing inorganic oxide organosols (inorganic oxide sols dispersed in organic solvents) as follows:                U.S. Pat. No. 2,801,185 discloses a colloidal silica which can be re-dispersed in an organic solvent, has a mean particle diameter of 5 to 150 nm, hydrophobic by alcohol groups or organosilyl groups chemically bonded to the surface of the silica, and has hydroxy groups on the surface of 10 m2 or less per 1 g measured by Methyl Red adsorption method. In the patent, dimethyl dichlorosilane is added to a silica sol containing triethyl phosphate as a dispersion medium, and after the reaction hydrochloric acid, solvent, excess dichlorosilane and the like are distillated off to give a solid that can be dispersed in benzene or chloroform;        JP-A-57-196717 (1982) discloses a silica powder which the surface thereof is esterified and can be dispersed in an organic solvent, and which is obtained by heating a silica sol dispersed in an alcohol with 2 to 18 carbon atoms at a temperature of 170 to 300° C. and then distilling off the alcohol;        JP-A-58-145614 (1983) discloses a silica powder which can be re-dispersed in an organic solvent, and which is obtained by adding a silylating agent to an organosilica sol having a water content of 10% or less, reacting them each other and then distilling off the solvent and in which silyl groups with 1 to 36 carbon atoms are bonded to the surface of colloidal particles in a rate of 1 to 100/10 nm2;        JP-A-3-187913 (1991) discloses a silica powder which the surface thereof is silylated and can be re-dispersed in a solvent, and which is obtained by adding a trimethyl silylating agent to a sol dispersed in methanol obtained by hydrolyzing an alkyl silicate in methanol in an amount of 5 mol % or more of the trimethyl silylating agent based on the silica, reacting them each other, and then distilling off excess trimethyl silylating agent and the solvent for dispersion;        WO 96/34063 discloses a process for producing a sol comprising azeotropically dehydrating water contained in an aqueous inorganic oxide sol by use of an azeotropic solvent with water, and then surface-treating with a silane coupling agent. Further, the publication discloses that the solvent can be replaced with a desired one, if required;        JP-A-11-43319 (1999) discloses a process for producing a silica sol dispersed in a hydrophobic solvent comprising silylating in a mixed solvent of a hydrophilic solvent with a hydrophobic solvent, and then replacing solvent; and        JP-A-2001-213617 (2001) discloses a process for producing a hydrophobic colloidal silica comprising adding a hydrolyzable silicon compound having one or more alkyl groups in the molecule to a colloidal silica containing a hydrophilic organic solvent as a main solvent to obtain a treated colloidal silica, and subjecting the treated colloidal silica to solvent replacement with ultra filtration membrane to produce a hydrophobic colloidal silica containing a hydrophobic organic solvent as a main solvent.
It is known a process for making an inorganic oxide sol organophilic by directly reacting an alcohol with hydroxyl group (OH group) on the surface of inorganic oxide particles. However, the process generally requires a reaction at a high temperature. In order to react an alcohol having a low boiling point, it is required to heat in a pressure vessel such as an autoclave. When an alcohol having a high boiling point is reacted, it can be reacted at atmospheric pressure (1 atm). However, it is difficult to produce a sol stably dispersed in an alcohol having a high boiling point before the surface treatment and to delete unreacted alcohol after the reaction.
In addition, inorganic oxides except silica are generally subject to hydrolysis of alkoxy groups, and therefore it is difficult to maintain long-term stability.
It is also carried out a process for introducing silyl groups and alkoxy groups by reacting trialkoxy silane and the like to the surface of inorganic oxide particles. However, methoxy silane or ethoxy silane that is generally used does not afford organophilic properties or dispersion stability adequately, the alkoxy groups are susceptible to hydrolysis, and sols having a long-term stability are not obtained.
When a silicon alkoxide is reacted with an inorganic oxide in an alcohol having a boiling point of 100° C. or more in conventional processes, it is difficult to delete the alcohol, and therefore a large amount of alcohol tends to remain even after solvent replacement with a hydrophobic solvent, and the alcohol is apt to cause adverse effects in the use scene of the sol. Further, the untreated hydrophilic inorganic colloid is difficult to disperse in an alcohol having a high boiling point.
Although a sol to which trialkyl silyl groups such as trimethyl silyl group are bonded has a high shelf stability, only a few kinds of trialkyl silylation agents can be available, and therefore it is difficult to alter surface treating groups. In addition, reactivity with inorganic oxides other than silica is low, and it is difficult to adapt this process. Further, sols obtained by treating with a trialkyl silyl group have problems that they have poor bonding force or poor reactivity with resin binder.

Process for producing inorganic oxide organosol


A method for generating an output signal having predetermined jitter characteristics is disclosed. A first signal is generated via a first signal generator module. A second signal is generated via a second signal generator module. The first signal is pulse position modulated by the second signal, thereby generating a modulated signal having predetermined jitter characteristics. An output signal having predetermined jitter characteristics is generated based on the modulated signal. Moreover, a signal generator for generating an output signal having predetermined jitter characteristics is disclosed.

With increasing data rates, the demands on communication devices regarding maximum generated jitter and/or jitter tolerance are constantly on the rise.
For some applications, e.g. for jitter tolerance testing of a device under test, a test signal having predefined jitter characteristics is needed. Such test signals are often generated via arbitrary waveform generators (AWGs).
These AWGs usually employ a software-based signal generation, wherein the test signal having the predetermined jitter characteristics is generated based upon one or several parameters that are loaded by the software, and the test signal is then generated based on these parameters.
However, such AWGs are not capable of changing the jitter characteristics of the test signal in real time, as a change of the jitter characteristics implies changing parameters of the AWG, which have to be reloaded by the software first.
Thus, there is a need for a method as well as for a signal generator for generating an output signal having predetermined jitter characteristics that are capable of a faster adaption of the jitter characteristics.

Method for generating an output signal having predetermined jitter characteristics


A small form factor pluggable device (SFP) or other compact transceiver device is provided at a subscriber's site and is configured to perform Layer 3 testing (e.g., ICMP echo request and response operations) for testing connectivity across networks. A universal interface coupling a conventional transceiver to host equipment is also disclosed which has components that can provide additional functionality to the transceiver while maintaining compatibility between the transceiver and the host equipment.

Field of the Invention
The present invention relates to enhanced transceivers (e.g., Small Form-factor Pluggable (SFP) optical transceivers), or enhanced universal interfaces for transceivers, for deployment in a subscriber's network that provide Internet Protocol functionality (e.g., using Layer 3 protocols such as IPv4, IPv6, ICMP, ICMPv6) for network layer (Layer 3) testing and not just physical layer (Layer 1) testing or data link layer (Layer 2) testing. The present invention also relates generally to apparatuses and methods for providing universal interfaces between transceivers (e.g., SFP optical transceivers and other types of optical and electrical transceivers) and network equipment having additional transceiver functionality.

Methods and apparatuses for implementing a layer 3 internet protocol (IP) echo response function on a small form-factor pluggable (SFP) transceiver and providing a universal interface between an SFP transceiver and network equipment


Methods and apparatus for removing substrate contamination are provided herein. In some embodiments, a multi-chamber processing apparatus includes: a processing chamber for processing a substrate; a factory interface (FI) coupled to the processing chamber via a load lock chamber disposed therebetween; and a cleaning chamber coupled to the FI and configured to rinse and to dry the substrate, wherein the cleaning chamber includes a chamber body defining an interior volume and having a first opening at an interface with the FI for transferring the substrate into and out of the interior volume.

In the field of semiconductor device fabrication, substrates may undergo a deposition or etch process to selectively add or remove material from the substrate. The addition or removal of material during the etch process may produce unwanted contamination, or residue, on surfaces of the substrate which can lead to defects in subsequent processing. The inventors have observed that conventional plasma-based cleaning processes were not adequate to remove the unwanted contamination.
Accordingly, the inventors have provided improved methods and apparatus removing contamination from a substrate after processing.

Methods and apparatus for cleaning a substrate after processing


A method for applying a scent to a hunting or other desired location without approaching the area or contaminating it with human scent. The desired scent is placed in a carrying projectile means such as a pellet for a projectile delivery means such as a carbon dioxide operated gun and fired from a distance to the desired location.

The present invention relates generally to the field of hunting aids and specifically to application of animal scent to a hunting area.
It is common for hunters to use deer musk, bear musk, or other scents as an attractant for animals being hunted. The scents attract the animals to an area where a hunter waits. Hunters purchase these scents in bottles, and then apply the scent to a location where they are planning to hunt. The biggest problem with this method of scent application is that a hunter leaves human scent at the same location. Since animals are repelled by human scent, this type of application lessen the effectiveness of the attractant scent.
The attractant scents are very strong, and objectionable to human smell. Currently, the most common method of application for these scents is by physically going to the location to be hunted and applying the scent manually to rocks, trees, or shrubs in the hunting area. Alternatively, the scents may be dispersed from spray bottles. In those methods of scent application, the hunter is subjected to the objectionable smell of the attractant scents, in addition to contaminating the hunting area with human scent.
The present invention overcomes these problems by placing the scent product into a pellet of a size that may be fired from a gun. Guns and pellets appropriate for this use already exist. The guns are carbon dioxide gas operated guns normally used for shooting paint or dye pellets to mark a distant spot or for tactical games, where the paint or dye pellets are used to mark people competing in the game.
This method of delivering the attractant scent to the hunting area eliminates the human scent contamination of the area and also eliminates the objectionable element of the attractant scent smell to humans.


Disclosed herein are zinc fingers comprising CCHC zinc coordinating residues. Also described are zinc finger proteins and fusion proteins comprising these CCHC zinc fingers as well as polynucleotides encoding these proteins. Methods of using these proteins for gene editing and gene regulation are also described.

Sequence-specific binding of proteins to DNA, RNA, protein and other molecules is involved in a number of cellular processes such as, for example, transcription, replication, chromatin structure, recombination, DNA repair, RNA processing and translation. The binding specificity of cellular binding proteins that participate in protein-DNA, protein-RNA and protein-protein interactions contributes to development, differentiation and homeostasis.
Zinc finger proteins (ZFPs) are proteins that can bind to DNA in a sequence-specific manner. Zinc fingers were first identified in the transcription factor TFIIIA from the oocytes of the African clawed toad, Xenopus laevis. A single zinc finger domain of this class of ZFPs is about 30 amino acids in length, and several structural studies have demonstrated that it contains a beta turn (containing two conserved cysteine residues) and an alpha helix (containing two conserved histidine residues), which are held in a particular conformation through coordination of a zinc atom by the two cysteines and the two histidines. This class of ZFPs is also known as C2H2 ZFPs. Additional classes of ZFPs have also been suggested. See, e.g., Jiang et al. (1996) J. Biol. Chem. 271:10723-10730 for a discussion of Cys-Cys-His-Cys (C3H) ZFPs. To date, over 10,000 zinc finger sequences have been identified in several thousand known or putative transcription factors. Zinc finger domains are involved not only in DNA recognition, but also in RNA binding and in protein-protein binding. Current estimates are that this class of molecules will constitute about 2% of all human genes.
Most zinc finger proteins have conserved cysteine and histidine residues that tetrahedrally-coordinate the single zinc atom in each finger domain. In particular, most ZFPs are characterized by finger components of the general sequence: -Cys-(X)2-4-Cys-(X)12-His-(X)3-5-His- (SEQ ID NO: 1), in which X represents any amino acid (the C2H2 ZFPs). The zinc-coordinating sequences of this most widely represented class contain two cysteines and two histidines with particular spacings. The folded structure of each finger contains an antiparallel β-turn, a finger tip region and a short amphipathic α-helix. The metal coordinating ligands bind to the zinc ion and, in the case of zif268-type zinc fingers, the short amphipathic α-helix binds in the major groove of DNA. In addition, the structure of the zinc finger is stabilized by certain conserved hydrophobic amino acid residues (e.g., the residue directly preceding the first conserved Cys and the residue at position +4 of the helical segment of the finger) and by zinc coordination through the conserved cysteine and histidine residues.
Canonical (C2H2) zinc finger proteins having alterations in positions making direct base contacts, 'supporting' or 'buttressing' residues immediately adjacent to the base-contacting positions, and positions capable of contacting the phosphate backbone of the DNA have been described. See, e.g., U.S. Pat. Nos. 6,007,988; 6,013,453; 6,140,081; 6,866,997; 6,746,838; 6,140,081; 6,610,512; 7,101,972; 6,453,242; 6,785,613; 7,013,219; PCT WO 98/53059; Choo et al. (2000) Curr. Opin. Struct. Biol. 10:411-416; Segal et al. (2000) Curr. Opin. Chem. Biol. 4:34-39.
In addition, zinc finger proteins containing zinc fingers with modified zinc coordinating residues have also been described (see, e.g., U.S. Patent Application Nos. 20030108880, 20060246567 and 20060246588; the disclosures of which are incorporated by reference). However, while zinc finger proteins containing these non-canonical zinc fingers retain gene transcription regulatory function, their ability to act as zinc finger nucleases (ZFNs) is in some cases diminished relative to zinc finger proteins consisting exclusively of canonical, C2H2 zinc fingers.
Thus, there remains a need, particularly in the construction of zinc finger nucleases, for additional engineered zinc finger binding proteins containing zinc fingers having optimized non-canonical zinc coordinating regions.

Optimized non-canonical zinc finger proteins


An embodiment subscriber identification module includes a first communication interface, including first pads intended to be coupled to a modulator-demodulator circuit; a second interface, including second pads intended to be coupled to a subscriber identification module card; and a switching circuit, configured to couple the first pads to the second pads or to a communication module integrated to the subscriber identification module. Another embodiment concerns a method of controlling the module.

Many electronic devices, for example, cell phones, each comprising one or a plurality of locations intended to receive a subscriber identification module card, or SIM card, are known. Each SIM card of a device generally enables it to connect to a mobile telephony network and to exchange data with other devices via this network.
Among devices comprising one or a plurality of locations intended to each receive a SIM card, certain devices further comprise an embedded subscriber identity module (eSIM). However, the integration of embedded subscriber identity modules in such devices is generally done to the detriment of the number of locations intended to receive a SIM card. This accordingly adversely affects the flexibility of use of such devices.

Wireless communication device and method


A sling mount or attachment for the rear portion of a firearm is provided. The sling mount includes a cap and a base, removably coupled by screws around a buffer tube of a firearm. The sling mount further includes a connection loop positioned below the opening created by coupling the cap to the base. In some embodiments, the connection loop extends in a vertical plane parallel to the longitudinal axis of the buffer tube, and is centrally located underneath it. A user may attach a sling to the connection loop via a snaphook in order to accomplish a one-point or two-point sling design.

The general use of sling mounts to attach slings to a firearm is fairly well known. Slings provide a way for users to more easily carry and retain a firearm in an active environment. When a user becomes involved in active conflict, particularly in urban conflicts, it is beneficial for the user to incorporate a sling attached to a sling mount in order to provide additional steadiness for accuracy purposes, or to provide an easy way for the user to free his or her hands without having to put the firearm down or otherwise unsecure the firearm. When not involved in active conflict, a sling allows the weapon to be comfortably secured to the user's side, back, or chest. Furthermore, a sling allows a user to quickly access the firearm from the secured position should the need arise.
Slings are most commonly attached to a firearm, such as a rifle or a shotgun, by either single-point, two-point, or three-point designs. The number of points in each design refers to the number of points at which the sling is anchored to the weapon. For example, a single-point sling is generally attached near the rifle's midpoint, and a two-point sling is generally attached once near the front end of the firearm and once near the buttstock of the firearm. A user may prefer one design over the other in order to obtain greater freedom of firearm movement, or to provide greater firearm security.
A sling is attached to a particular point by securing it to an attachment or mount installed at various places on the firearm. The receiver end plate of a rifle or shotgun is a common location for a sling attachment or mount to be located because it resides just behind the pistol grip and thus will not impede a user's ability to quickly fire the firearm. Current designs of clamp on sling mounts with loops for snaphook type attachments that incorporate loops on either the right or left side or both, such as that described in U.S. Pat. No. 8,312,662 to Rogers et al. These loops are bulky and tend to get caught up on gear worn by the user or interfere with manipulation of the charging handle or safety. Although most users will favor either a left or right handed configuration, certain conflict environments, such as aiming around a corner, demand that a user change orientation. This can prove difficult with sling mounts that provide attachment points on the side of the firearm. Therefore, there is a need for a sling mount with a true ambidextrous configuration.
U.S. Pat. No. 8,596,504 to Haley, Sr. et al. discloses an ambidextrous configuration of a sling mount having a horizontal bar to which a connecting ring slides back and forth as the user moves the sling from a left-handed to a right-handed orientation. Haley, Sr. et al. allows for a greater range of motion, but comes with several drawbacks. Since the sling must slide across the horizontal bar, if the sling strap catches on a user's gear or is otherwise inhibited, the orientation may not change or could cause the user to have difficulty operating his or her firearm. It is desirable to minimize the time required and any difficulty encountered when switching orientations because of the nature of using firearms in active conflict environments. Another drawback is that installation of this variety requires disassembly of the firearm. Many law enforcement agencies and the military do not allow disassembly of the existing castlenut or receiver end plate in order to install sling mounts such as those disclosed by Haley, Sr. et al. Lastly, since the connecting ring is not fixed, movement of the sling generates noise, which may be undesirable in a stealth operation.
Another means of providing an ambidextrous configuration is to install a swivel connector piece into the lower portion of a sling mount as shown by U.S. Pat. Nos. 7,562,481 and 7,814,697 to Esch. In these patents, the swivel connector piece includes a ring coupled to the swivel body. As the user moves from one handed orientation to the other, the swivel piece twists to allow the sling to change orientations. However, this configuration has the drawback of causing the sling to frequently become twisted. These designs also require three separate pieces (top clamp member, bottom clamp member, swivel mount), and the addition of more pieces increases the difficulty of installation for the user and increases the maintenance required.
What is desired, therefore, is a sling mount for a firearm that provides a true ambidextrous configuration. What is also desired is a sling mount that may be installed with as few pieces as possible without disassembling the firearm. What is further desired is a sling mount that minimizes excess noise and prevents twisting of the sling.


A stapler has a body including two holes formed on two sidewalls thereof and a first link defined on one sidewall thereof. A magazine is assembly installed in the bottom of the body. A handle assembly includes a handle lever formed on an end thereof and a handle stop defined on another end thereof. A second link and a through hole are between the handle lever and the handle stop. A connector is disposed in the second link and pivotally couples to the two holes, and a first roller is inserted through the through hole and moves rotatably in the first link of the body. A power spring is disposed in the body, and a plunger includes a first hole and a second hole. When the handle lever is pressed downwardly and the handle stop lifts the plunger upwardly, the first roller is driven to move rotatably in the first link of the body to detach the handle stop from the plunger gradually.

1. Field of the Invention
The present invention relates to a stapler.
2. Description of the Related Art
Referring to FIG. 6, a known stapler includes a base portion 91, a magazine 92 installed to the bottom of the base portion 91, and a handle portion 93 pivotally coupling to a pivot point (not numbered) of the base portion 91 and being adjustably movable relative to said pivot point. Moreover, an end of the handle portion 93 connects to and drives a plunger 94, and another end of the handle portion 93 is exposed from the base portion 91. A power spring 95 is disposed in the base portion 91 and couples to the plunger 94 so as to limit the handle portion 93.
While the handle portion 93 is pressed downwardly, the plunger 94 is lifted and drives the power spring 95 upwardly. Because of the reaction of the power spring 95, the lower the handle portion 93 is downwardly pressed, the larger the strength forces of the spring 95 to the handle portion 93. However, when the handle portion 93 is pressed to the lowest position, the position of said pivot point is adjustable relative to the handle portion 93 to force the handle portion 93 to detach from the plunger 94. Next, the staple function is done.
The foregoing shows that when the handle portion 93 is pressed to approach the lowest position, the reaction of the power spring 95 is largest. Hence, it's difficult for a user to move the handle portion 93 relative to said pivot point to detach from the plunger 94. Furthermore, the user has to exert a huge force to operate for stapling so that there will be a loud noise. Also, the known stapler is easy to be broken by forcing excessively.
The present invention is therefore intended to obviate or at least alleviate the problems encountered in the prior art.


Reselection methods for wireless communication devices, for example cellular telephones, that reduce power consumption by receiving periodic paging information (210) concurrently with the performance of periodic signal measurements (230) and reselection processing (250) to increase minimal power consumption mode operation. In some embodiment, the reselection processing (252) is performed on prior signal measurements (230) while obtaining present signal measurement data (240).

Mobile cellular communication devices, including cellular telephones and pagers, must generally monitor and process periodic paging information when connected to the network. Mobile cellular telephones also perform neighbor cell reselection processing based upon neighbor cell signal measurements to identify the most appropriate cell, or base station, with which the cellular telephone should communicate.
Many mobile cellular telephones also operate in a minimum power consumption, sometimes referred to as sleep, mode when idling and not monitoring paging network information or performing neighbor cell signal strength measurements and reselection processing.
GSM cellular telephones generally include the foregoing idle mode functionality. Particularly, in GSM cellular telephones, it is known to receive periodic paging blocks and at the same time, between assigned slots, perform neighbor cell signal strength measurements. Thereafter, GSM cellular telephones perform neighbor cell reselection processing based upon the most recent signal strength measurements. In GSM terminals, the reselection processing does not occur until after completion of the signal strength measurements. During other idle periods, when not receiving paging blocks and performing signal strength measurements and when not performing reselection processing, GSM cellular telephones may enter sleep mode to reduce power consumption.
In many hardware designs "sleep mode" cannot be entered until all hardware functional blocks have completed processing, since all clocks are shut down in sleep mode. Sleep mode may be defined differently in other hardware designs.
WCDMA cellular telephones also generally include the foregoing idle mode functionality. Particularly, WCDMA telephones receive periodic paging indicator channel (PICH) blocks, which are much smaller than paging blocks, and at roughly the same time WCDMA telephones perform intra and inter carrier neighbor cell signal strength measurements. The PICH block in the WCDMA architectures directs the terminal to another paging channel (PCH) block only if the PICH block, and particularly the PICH bit assigned to the particular terminal, is set. Existing WCDMA cellular telephones perform neighbor cell reselection processing based upon the signal strength measurements, and like GSM reselection processing discussed above, WCDMA reselection processing does not occur until after completion of the signal strength measurements. During other idle periods, WCDMA telephones may enter sleep mode to reduce power consumption.
The various aspects, features and advantages of the present invention will become more fully apparent to those having ordinary skill in the art upon careful consideration of the following Detailed Description of the Invention with the accompanying drawings described below.

Reselection optimization in mobile wireless communication devices and methods therefor


A prosthetic implant that contains a stem integrally connected to a neck, a head that sits on top of the neck, and a porous assembly disposed around them stem. The porous assembly contains a first porous tube and a second porous tube, wherein the second porous tube is disposed within the first porous tube, and the stem is disposed within the second porous tube. The porous assembly is a heat absorbent porous assembly which tends to maintain its temperature within a specified range.

An artificial prosthetic device comprised of a stem integrally connected to a neck portion, a head connected to the stem, and two porous tubes disposed about the stem.
Defects of the joints, as a result of hip osteoarthritis, osteoporosis, trauma, occupational overuse, resection of cancerous tissue, and hip joint tumor are among the primary reasons for performing joint replacements. As one example, the hip joint is called a ball-and-socket joint because the spherical head of the thighbone (femur) moves inside the cup-shaped hollow socket (acetabulum) of the pelvis. In a properly functioning hip joint, a series of motions, such as flexion, extension, abduction and adduction, can be carried out to utmost capabilities without stress, strain or pain involved in the motions. After the onset of a hip or hip related diseases and/or fracture, there occurs a wear and tear of the joint and bones and the surrounding ligaments and tendons. This initiates an inflammatory response resulting in pain and swelling of the joint and surrounding tissue, leading to associated diseases and defects. In theses instances, hip replacement surgery is performed to alleviate the symptoms and replace the affected parts.
The use of prosthetic implants is the most successful method used in the cases of limb and joint replacement due to a number of diseases and/or accidents. Implants may be used in hip arthroplasty, total knee replacements, and prosthetic limbs. Hip prosthetics have a success rate of ninety percent for about twenty years, taking into account revision surgery. To duplicate the action of a normal functioning hip joint, a total hip replacement prosthetic implant must have three parts: the stem, which fits into the femur and provides stability; the ball, which replaces the spherical head of the femur and the acetabular cup, which replaces the worn-out hip socket. Each part comes in various sizes in order to accommodate various body sizes and types.
However, even with technological advancements in the design of prosthetic implants, there is still a significant amount of failure, resulting in pain, further damage of region surrounding implant, infection, recurrent arthritic condition and dislocation and the need for revision surgery leading to increase in expenses. U.S. Pat. No. 5,876,446 of Agrawal et al. discloses that xe2x80x9cvirtually all implants currently in use have a tendency to loosen with time, some to the extent of requiring revision.xe2x80x9d According to Agrawal et al., xe2x80x9c. . . the absence of bone in-growth frequently leads to loosening of bone cemented prosthesis.xe2x80x9d
In order to solve this problem, Agrawal et al. provided a metallic press fit prosthetic device comprising at least one porous tissue mating surface on the metallic press fit prosthetic device having interstitial spaces impregnated with a polymer selected from a group consisting of polylactic acid (PLA), polyglutamic acid (PGA), and PLA-PGA copolymers The polymer contains a pharmacologically active substance whose release is controlled over a therapeutically effective period of time. The entire disclosure of U.S. Pat. No. 5,876,446 is hereby incorporated by reference into this specification.
Although the device of Agrawal et al. was an improvement over prior art devices, it still was deficient in certain respects. In the first place, it was not capable of delivering two or more pharmacologically active materials in timed sequence. It also lacked the ability to control the amount of friction produced at the joint and dissipate effectively, the heat produced in other parts of the prosthesis in vivo.
In accordance with this invention, there is provided a prosthetic implant comprised of a stem integrally connected to a neck, a head that sits on top said neck, and porous assembly disposed around the stem. The porous assembly is comprised of a first porous tube and a second porous tube, wherein the second porous tube is disposed within the first porous tube, and wherein the stem is disposed within the second porous tube. The porous assembly is a heat absorbent porous assembly which tends to maintain its temperature within a specified range. The head is comprised of means for releasing a material over a specified period of time.

Apparatus for replacing musculo-skeletal parts


A removable dust gate for an automatic weapon is described. The removable dust gate can include a retractable pivot pin having rod sections with compressible objects therebetween that allow the rod sections to be temporarily pushed together, shortening the length of the retractable pivot pin. When the pivot pin is shortened, it can be placed between two pin ports on the weapon. When released, the pivot pin will engage with the pin ports to secure the dust gate to the weapon in the correct position to engage with the ejection port on the weapon. By shortening the pivot pin, the dust gate can be an easily removed without having to change the design or configuration of current weapons or weapon design.

Assault weapons have been in regular military use since at least the Viet Nam war era. Since their first introduction, military specifications have required that a dust gate be in place over the ejection port on all such weapons. An ejection port is an opening within the upper receiver of an assault weapon that allows spent casings to exit after firing. A dust gate is typically located over the ejection port, when the weapon is not being fired, to help prevent contaminants such as sand, dirt, or other debris from entering the mechanism. While most assault weapons have some type of cover to protect internal components from contaminants, the component most often referred to as a "dust gate" is utilized on the ejection port of automatic rifles.
When used on a weapon, the dust gate is held in place in the ejection port with a detent to protect the ejection port and internal components from contaminates. When the weapon is fired, an internal bolt slides past the ejection port, disengaging the detent, so that a biasing-spring on the dust gate can force the dust gate down and against the lower receiver. Occasionally, the dust gate will jam preventing the internal bolt from completing its action, thus disabling the weapon. Under most environmental conditions, a dust gate provides only minimal protection. Because of the potential for jamming the bolt, civilian, as well as active-duty military personnel, often prefer to remove the dust gate from their weapons. However, due to military requirements, the dust gate must be retained and reusable.
Removal of a dust gate can be a tedious process that requires at least partial disassembly of the weapon. Current designs utilize a pivot pin that slides through sleeves on the dust gate and fit into two pin ports on the side of the weapon. To remove the dust gate, the pivot pin can be slid towards the barrel and out of the pin ports and sleeve. There is typically a barrel nut that secures the barrel in place on the lower receiver. The dimensions of the barrel nut prevent the pivot pin from sliding completely out of the sleeves and/or pin ports. Thus, the barrel nut and barrel must be removed to completely release the dust gate. The dust gate can then be retained for later re-installment by the same method. Alternatively, the pivot pin and dust gate can be bent until the pivot pin can be disengaged from the pin ports. This technique will render the dust gate unusable.
Despite the fact that dust gates have been used on automatic weapons for over 50 years, there has been little or no improvement in the design of dust gates and particularly in the methods for removing or installing them on a weapon. To date, removal of a dust gate necessitates either significant disassembly of the weapon or effectively destruction of the pivot pin that holds the dust gate onto the weapon.

Ejection port dust gate for automatic weapons


A rubber composition containing carbon fibrils in which 0.5 to 60 parts by weight of carbon fibril material comprised primarily of an aggregate of fibrils having an average particle diameter of 0.05 to 50 microns in which fine, filiform carbon fibrils of 3.5 to 75 nm in diameter are intertwined with each other is mixed with 99.5 to 40 parts by weight of synthetic rubber and/or natural rubber and a pneumatic tire in which the surface layer is provided with this rubber composition.

Concerns over the limited oil resources in recent years has let to the imposition of certain fuel cost standards in an effort to bring about improvement in controlling automobile fuel costs. In order to meet the strict standards of the future, it will be necessary to improve existing materials and technology. One method is to reduce the weight of the tire itself, which would be effective in bringing about great improvement in automobile fuel costs.
Lowering the specific gravity of the rubber component that forms the tire can be considered. From this standpoint, it would be desirable to effect a great decrease in the quantity of use of carbon black, which has a high specific gravity. Carbon black has approximately twice the specific gravity as that of rubber. However, when the quantity of carbon is decreased, hardness, tensile strength and modulus during low extension are decreased and wear resistance is insufficient.
Another way of lowering the weight of the tire that has been considered is to decrease the size of the tire. However, when the tire is made smaller, the strength of the tire cannot be maintained. When the quantity of carbon black that is used is increased, hardness is increased. However, increase in strength is not sufficient. When an ever larger amount of carbon black is used, strength is decreased, the processing capacity of the rubber composition becomes poor and heat generated from vulcanized rubber is increased. In addition, there are the problems that the specific gravity of the rubber composition increases and the weight of the tire increases.
Consequently, it is desirous to have a reinforcing material which has a greater reinforcing capacity than conventional carbon black and that has greater hardness and wear resistance when used in small quantities. Most recently, fine, filiform carbon fibrils have been developed and it has been discovered that rubber compositions having hardness and good tensile strength and wear resistance can be obtained by addition of small amounts of reinforcing material. However, problems such as deterioration in the physical properties, and, of tensile strength in particular, of these rubber compositions at high temperatures remain.

Rubber composition containing carbon fibrils and a pneumatic tire


A simple, efficient and inexpensive method of purifying magnesium sulfate from mixtures of epsomite and halite. The method allows for the preparation of substantially pure magnesium sulfate products. The method generally involves heating a mixture of epsomite and halite to form clusters of lower hydrated magnesium sulfate crystals and subsequently applying slight pressure to the clusters so that they collapse to yield fine, less hydrated magnesium sulfate crystals which can then be easily separated from the comparatively coarse halite crystals. The less hydrated magnesium sulfate crystals can be recrystallized to provide highly purified epsomite which can then be dehydrated to provide kieserite or anhydrous magnesium sulfate.

Magnesium sulfate monohydrate (MgSO.sub.4.H.sub.2 O) and the higher hydrates of magnesium sulfate are naturally occurring materials having many uses. For example, they are known as fireproofing materials, as catalyst carriers, for use in warp-sizing and loading cotton goods, weighting silk, dyeing and calico printing, as an ingredient in mineral waters, and are used in ceramics, fertilizers, paper, cosmetic lotions, dietary supplements, laxatives, and as a therapeutic bath salt.
A number of methods are known in the prior art for the production and purification of magnesium sulfate (MgSO.sub.4) and its hydrates. For example, these materials are sometimes produced by reacting sulfuric acid (H.sub.2 SO.sub.4) with either magnesia (MgO) or magnesite (MgCO.sub.3). However, this method is very expensive and the magnesium sulfate produced may still require subsequent purification due to impurities present in the magnesia or magnesite feed stock.
Alternatively, hydrated magnesium sulfate may be produced by dissolving kieserite (magnesium sulfate monohydrate) and then subsequently refrigerating this resulting solution.
Kieserite is mined in large quantities, for example in Germany, and after washing, supplies most of the world's magnesium sulfate market. It contains various impurities, however, including halite (i.e., sodium chloride) and, in addition, it comprises only 89-93% magnesium sulfate monohydrate. Moreover, since the mined kieserite is only partly soluble in ambient water it is not acceptable for use in certain applications, for example, as a therapeutic bath salt or as a laxative.
The refrigeration process described above requires the refrigeration of an unduly large amount of magnesium sulfate-containing solution to obtain a commercially desirable quantity of epsomite and is thus not particularly commercially feasible. For a further discussion of the refrigeration process, see, e.g., Fernandez-Lozano, "Recovery of Epsomite and Sylvite from Seawater Bittern by Crystallization", Fourth Symposium on Salt, Alan H. Coogan, The Northern Ohio Geological Society, Inc., Cleveland, Ohio, Vol. 2, pp. 501-510 (1974).
Epsomite is a heptahydrate of magnesium sulfate having the chemical formula MgSO.sub.4.7H.sub.2 O. It is often found mixed with halite (i.e., NaCl) in nature. Such mixtures are readily isolated from seawater by solar evaporation. In the past, however, these mixtures have not been relied upon as a source of magnesium sulfate or its hydrates since epsomite and halite react upon contact in certain aqueous solutions to form double salts, i.e., a condition wherein two salts crystallize from a melt or from a solution in simple stoichiometric proportions, forming a distinct crystal lattice. The double salts formed in this case are mainly of magnesium and sodium sulfate. An example of such a double salt is astrakanite (MgSO.sub.4.Na.sub.2 SO.sub.4.4H.sub.2 O), which is formed according to the following reaction: EQU 2MgSO.sub.4.7H.sub.2 O+2NaCl.fwdarw.MgSO.sub.4.Na.sub.2 SO.sub.4.4H.sub.2 O+MgCl.sub.2.
The formation of such double salts, when they occur, makes the extraction of magnesium sulfate from the mixture extremely difficult.
Consequently, the separation of epsomite and halite must take place in a medium in which the two substances cannot react, i.e., so as not to form double salts. A simple, cost-effective method has thus long been desired for separating these two materials in a manner to provide substantially pure magnesium sulfate products without the formation of double salts as described above.

Method for recovering magnesium sulfate products from mixtures of epsomite and halite


A computer system is provided having a door which hinges about an axis. The door provides a cover for the computer ports, which also seals the ports from the environment. The door has a plurality of detents which allows the door to adjustably elevate the computer system. Alternatively, the door can be stowed under the computer system, where it does not interfere with other cables or cords proximately located.

The use of lap top computers has increased dramatically as they have become more portable, and simultaneously more powerful. The increased use and transportation of these computers also results in the computers being subjected to harsh environments. Openings or ports on a computer, which are commonly used to connect external devices such as printers or power supplies, provide an opportunity for dirt and debris to enter the computer system as well as causing the system to be exposed to potential port damaging impacts. The dirt interferes with and potentially damages the internal components, and ultimately limits the life of a lap top computer. Thus, it is important to provide a cover for computer ports. Furthermore, as users operate the computer in a wide variety of places, the computer must acclimate to many different surroundings.
Lap top computers typically provide a flat keyboard, which remains flat when the computer is placed on a work surface. Standard desk top keyboards are typically provided at an angle to the desk top surface. Devices for elevating stand alone keyboards are known in the art. One such device is described in U.S. Pat. No. 4,568,056 granted to Lewinski on Feb. 4, 1986, which discloses a tilt mechanism for a stand-alone keyboard. The '056 patent teaches a tilt mechanism which has two springs located within a computer keyboard which has narrow feet for elevating the keyboard. This structure requires a large amount of internal space within the keyboard, and provides two narrow feet located on both edges of the keyboard. The tilt mechanism must be utilized on a surface wide enough to accommodate the distance in between the supporting feet. For instance, the elevational device cannot be utilized if users place the keyboard on their lap, or a surface having a smaller width than the keyboard.
Support devices for lap top computers are known in the art. A detachable support device is described in U.S. Pat. No. 5,337,985 issued on Aug. 16, 1994 to Hale, which teaches a support device for a lap top computer. The '985 patent teaches a support device comprising a set of two panels formed at a right angle. To elevate the lap top computer, the V-shaped devices are affixed to a bottom surface of the computer by a fastener, such as hook-and-loop material, which is applied to both the computer surface and the support devices. The devices are detachable from the lap top computer, and are removed when not in use. The panels are used only to elevate the computer, and not protect the computer ports. The panels are not adjustable; the user has the option of using them at a preselected height, or not using the panels at all.
Accordingly, there is a need for a better way to elevate a lap top computer system without requiring large amounts of internal keyboard space. In addition, there is a need to adequately protect openings and ports from harmful dirt, debris, and impacts.

Lap top computer system with elevating port cover


Dynamic Digital Modulation obtains thermal image data on active semiconductor devices with sufficient sensitivity to be used in situ with packaged devices. These techniques can be applied to dynamic failures, but can also produce quantitative data of actual power dissipation as the device is placed into different operational modes. The thermal image results can be analyzed to assist in thermal management and assessing reliability and failure analysis issues in semiconductor devices.

Thermal imaging is a traditional technique for thermal management, failure analysis and reliability studies of semiconductor devices (see for example, G. C. Albright, J. A. Stump, J. D. McDonald, H. Kaplan, "True" Temperature Measurements on Microscopic Semiconductor Targets", SPIE Conference on Thermosense (SPIE Vol. 3700) 1999). However, limitations occur in thermal sensitivity, especially in the face of complex backgrounds and the need to exercise complex circuit structures in order to stimulate the desired site within a device.
Enhanced signal-acquisition techniques, such as binary sampling or quadrature sampling (e.g., Lock-in Thermography S. Kiefer, et al., "Infrared Microthermography for Integrated Circuit Fault Location; Sensitivity and Limitations", Proceedings of the 28th International Symposium for Testing and Failure Analysis (ISTFA) 2002) that rely on modulating a power supply have extended basic hotspot detection for failure analysis to extremes of sensitivity and show some ability to determine defective depth in simple structures (C. Schmidt, F. Altmann, "Non-Destructive Defect Depth Determination at Fully Packaged and Stacked Die Devices using Lock-in Thermography", 17th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA), 2010).
Binary signal enhancement techniques have been commercially available for many years. Simple binary pulse modulation consists of a single image sample being obtained at each power-on and power-off state, using a synchronously pulse-modulated power supply that is connected to the semiconductor device under test (DUT). This pair of images is digitally subtracted to produce a differenced image in which the common background is removed and only the thermal difference between the on and off power states remains. Averaging multiple pairs of signal samples over tens of minutes allows detection of shorts that are dissipating only a few microwatts.
Recent efforts have focused on quadrature sampling in which two images are taken during the device's power-on state and two during the power-off state. The four images are then combined to produce in-phase and out-of-phase images. An inverse tangent of their ratio produces an additional phase angle image.
These pulse sampling thermography (PST) techniques, described above, have been used for a variety of failure localization applications on static failures. However, there are many dynamic thermal issues in either failure analysis or reliability that require the DUT to be fully on and then placed into a specific state in order for the issue to be become manifest. Desirable thermal measurements are not currently realized.

Dynamic differential thermal measurement systems and methods


A switching machine having a number of trolleys pulled by belts mounted on drive wheels set at the ends of the machine and comprising a mechanism suitable for imposing a counter rotating motion on the trolleys, so as to maintain them in a correct position while passing over the drive wheels.. The mechanism for achieving the counter rotation motion on the trolleys comprises a number of first sprockets, mounted on a support firmly attached to the drive wheels, having a rotation motion proportional to the rotation of the drive wheels and having the same direction, and, for each trolley, a sprocket firmly attached to the frame of the trolley, suitable for meshing with said first sprockets when the trolley reaches the ends of its path.

These trolleys are tied to belts, chains or similar devices pulling them along rails comprising two essentially horizontal superimposed sections, connected by two curved sections on which the trolleys move from the upper to the lower path and vice versa.
A transport plane rigidly fastened to chains would in this process be flipped over, with the consequent dropping off of the transported items.
In order to prevent this, certain devices need to be supplied to constantly maintain the transport planes in an essentially horizontal position, even when they pass the curved sections connecting the upper horizontal plane with the lower plane of the path.
Switching machines of this type are already known, and one of these is for example described in the Italian patent application no. MI93A 0309 by the same applicant. This known switching machine comprises several trolleys, each of which fitted with a rotating mat which constitutes the item's transporting and unloading plane.
The trolleys are hinged to a pair of chains pulled in a rotating motion along a vertical plane by sprockets. At the connecting points between the upper and the lower path, certain devices are supplied which keep the trolleys in a horizontal position while passing from one section of the path to another, thus preventing them from flipping over.
In particular, these devices consist of tongs mounted on discs coaxial with the chains' pulling wheels and moving in a synchronized fashion with the latter, engaging the mentioned trolleys so as to keep them in an essentially horizontal position while passing from an upper to a lower section of the course, and vice versa.

Closed circuit switching machine, on a vertical plane, with devices to maintain the articles' transport planes in an essentially horizontal position


A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing an amount of heat generated during polishing of a substrate to be polished and of effectively cooling a substrate holding part of the substrate holding mechanism, and also capable of effectively preventing a polishing solution and polishing dust from adhering to an outer peripheral portion of the substrate holding part and drying thereon. The substrate holding mechanism has a mounting flange, a support member 6 and a retainer ring. A substrate to be polished is held on a lower side of the support member surrounded by the retainer ring, and the substrate is pressed against a polishing surface of a polishing table. The mounting flange is provided with a flow passage contiguous with at least the retainer ring. A temperature-controlled gas is supplied through the flow passage to cool the mounting flange, the support member and the retainer ring. The retainer ring is provided with a plurality of through-holes communicating with the flow passage to spray the gas flowing through the flow passage onto the polishing surface of the polishing table.

With progress of technology of fabricating high-integration semiconductor devices in recent years, circuit wiring patterns or interconnections have been becoming increasingly small and fine, and spacings between wiring patterns have also been decreasing. As these wiring spacing decreases, a depth of focus becomes shallower in circuit pattern formation by performing photolithography or the like. In a case of photolithography for less than 0.5-μm designs in particular, surfaces of semiconductor wafers on which circuit pattern images are to be formed by a photolithographic apparatus require a higher degree of surface flatness because of a photolithography depth of focus. To realize a required degree of surface flatness, polishing using a polishing apparatus is widely adopted.
A polishing apparatus of this type has a turntable with a polishing cloth bonded to a top thereof to form a polishing surface. The polishing apparatus further has a top ring as a substrate holding mechanism. The turntable and the top ring rotate independently of each other at respective numbers of revolutions. A substrate to be polished that is held by the top ring is pressed against a polishing surface of the turntable while a polishing solution is being supplied onto the polishing surface, thereby polishing a surface of the substrate to a flat and specular surface. After completion of polishing, the substrate is released from the top ring body and transferred to a subsequent process, e.g. a cleaning process.
In the above-described polishing apparatus, a substrate holding part of the top ring, which holds the substrate to be polished, may be deformed by frictional heat generated during polishing of the substrate. Further, a polishing capability may vary owing to a temperature distribution on the polishing surface. Such deformation of the substrate holding part of the top ring and variations of the polishing capability cause a substrate polishing function to be degraded. Further, this type of polishing apparatus polishes the substrate while supplying a polishing solution, e.g. a slurry, onto the polishing surface of the polishing table, as stated above. The polishing solution is likely to adhere to an outer surface of the top ring, particularly an outer peripheral surface thereof, and to dry thereon. If dried solid matter drops onto the polishing surface, an adverse influence is exerted on a polishing process.
To prevent deformation of the substrate holding part of the top ring due to frictional heat generated during polishing of the substrate, JP-A-11-347936 (Japanese Patent Application Unexamined Publication) discloses that a material of good thermal conductivity is attached to a substrate holding part (wafer holder) to make a temperature distribution uniform, and a refrigerant flow passage is provided in the substrate holding part to supply a refrigerant through the refrigerant flow passage to cool the substrate holding part, and further, fins are provided on the substrate holding part to promote heat dissipation. However, the method disclosed in JP-A-11-347936 is still insufficient to effectively cool an outer peripheral portion (particularly a guide ring) of the substrate holding part of the top ring, and hence suffers from a problem in that a polishing solution, e.g. a slurry, may adhere to the outer peripheral portion of the substrate holding part and dry to stick fast thereto, together with polishing dust generated from the substrate by polishing.
With an increase in diameter of semiconductor substrates, an area of contact between a polishing pad on the polishing table and the substrate to be polished has increased. Consequently, a temperature tends to rise during polishing the substrate. Meanwhile, it has become common practice to use substrate polishing apparatus having a complicated mechanism for a purpose of controlling a polishing profile. Many of the polishing apparatus employ a method whereby a component part having a high coefficient of friction is pressed into contact with a polishing pad in the complicated mechanism. This may also cause a rise in temperature during polishing.
The rise in temperature during polishing of the substrate exerts an influence on a surface of the polishing pad and slurry components, and causes degradation of flatness of a polished surface of the substrate obtained with the polishing apparatus and a polishing rate, and also makes it impossible to maintain a desired flatness and polishing rate stably.

Substrate holding mechanism, substrate polishing apparatus and substrate polishing method


A parking assistance device includes a camera configured to capture a rear-view image of a vehicle, a plurality of sensors configured to sense an obstacle located around the vehicle, a controller configured to generate a parking guide line to guide the vehicle into a target parking space and assist a driver of the vehicle to park based on a separation distance between a predicted entrance trajectory corresponding to a steering angle of the vehicle and the parking guide line, and a display configured to match and display the rear-view image of the vehicle with the parking guide line.

In general, there is a process using a sensor, a process using a camera, or a process using a sensor and a camera in a complex manner as a process which notifies a driver of a distance between a vehicle and an object located behind the vehicle upon reverse driving or reverse parking of the vehicle.
The process using the sensor may include, for example, a parking distance warning (PDW) system. A plurality of ultrasonic sensors are loaded into a rear bumper of a vehicle. The process using the sensor calculates a distance between the vehicle and an object located behind the vehicle based on a time taken for ultrasonic waves emitted from the ultrasonic sensors to be bumped against the object to return, start to output an alert sound, when the calculated distance is less than a threshold, and output a higher alert sound or an alert sound of a shorter period as the distance is shorter.
The process using the camera may include, for example, a rear view monitor (RVM). A camera which captures a rear-view image of a vehicle is installed in a trunk lid. The process using the camera displays the image captured by the camera on an audio video navigation (AVN) system, such that a driver may safely park while identifying a situation behind the vehicle.
Such a process using the camera displays a parking guide line together with a rear-view image of the vehicle, when the vehicle operates in a reverse parking mode, thus assisting the driver to park while viewing the parking guide line.
However, because the parking guide line is a guide line in a simple form, which interworks with a steering angle of the vehicle, the driver should back up the vehicle while adjusting a steering wheel of the vehicle such that the parking guide line heads for a target parking space.
As a result, because the driver backs up the vehicle while viewing the guide line in the simple form which decreases sentience, while not receiving a path guiding the vehicle to enter the target parking space, he or she has a difficulty to enter the target parking space.
Details described in the background art are written to increase the understanding of the background of the present disclosure, which may include details other than an existing technology well known to those skilled in the art.