An image within a search area of an image of interest is rotated from 0 to 345° in increments of 15°. An evaluation value of facial likeliness of an image after rotation thereof by each angular increment is calculated. A correction angle is calculated based upon a rotation angle (rotational manipulated variable θ) that affords the maximum evaluation value calculated. The image of interest is displayed upon being rotated based upon the correction angle calculated. Thus, the image of interest is displayed in an orientation suitable for appreciation.

1. Field of the Invention
This invention relates to an image display control apparatus and method and to a program for controlling the image display control apparatus.
2. Description of the Related Art
When the image of a subject is sensed using a digital still camera or the like, generally the camera is held so as to be suitable for a landscape-type display. However, a camera is not always held so as to be suitable for a landscape display and there are instances where a camera is held so as to be suitable for a portrait-type display. In a case where the image is displayed, however, generally the set-up is such that the image is displayed in the landscape-type format. In order to display in portrait format an image that has been captured in the portrait format, therefore, it is necessary to designate the image and rotate it in such a manner that it will be displayed in the landscape format.
In art disclosed heretofore (Japanese Patent Application Laid-Open No. 8-138024), the above-mentioned facts are taken into consideration and in a case where the subject is a person, the orientation of an image is discriminated based upon the positional relationship of the constituent parts of the body of the person.
However, with regard to an image that does not contain the constituent part of a body other than a face, as in the case of portrait photography, there are instances where image orientation cannot be determined.

Image display control apparatus and method, and program for controlling image display control apparatus


A device and method to accurately detect list-based attacks without reducing the convenience for authorized users. An acquirer acquires information on accounts used for log-in trials to a plurality of websites. An analyzer calculates the degree of use of each account used in common for log-in trials to different websites in a predetermined period of time out of the accounts acquired by the acquirer and determine the log-in trials using the account to be attacks when the degree of use exceeds a predetermined threshold. A detector detects, as an attack, a log-in trial to the website using the same account as the account used for the log-in trials determined to be attacks by the analyzer.

Account authentication using account names and passwords are widely performed for services on the Internet. In other words, services are provided to users authenticated using account names and passwords registered in advance.
Many of the users each register and use the same account name and password for a plurality of services. With the circumstances described above, what is called list-based attacks have recently occurred frequently. The list-based attacks mean that an attacker who has unauthorizedly obtained a list of registered account names and passwords repeats log-in trials using the list to unauthorizedly log in to various other sites.
Conventionally known are methods for detecting such list-based attacks as attacks when the number of authentication failures in a certain period of time exceeds a fixed value (refer to Non Patent Literature 1). Also widely known are methods for detecting attacks by making a comparison with the characteristics of terminals that have succeeded in log-in before (refer to Non Patent Literature 2).

Detection device, detection method, detection system, and detection program

NIPPON TELEGRAPH AND TELEPHONE CORPORATION


A method for interconnecting P-NAP customers with P-NAP providers and symmetrically routing packets between a P-NAP customer and a destination within a P-NAP provider's backbone across the P-NAP and that provider's backbone or symmetrically routing packets between a P-NAP customer and a destination not currently within a P-NAP provider's backbone across the P-NAP and a pre-defined P-NAP provider's backbone known as the default backbone. The method comprises creating a list of all P-NAP provider AS numbers and a list of all AS numbers which peer at public NAPs but which are not associated with P-NAP providers. For each P-NAP provider, take the union of all provider AS numbers and AS numbers associated with public NAPs and subtracting out AS numbers associated with the current provider. Deny that resulting list of AS numbers on routes as they are received from the current provider to approximate the routes which are deemed to be destined within the current provider's network by tagging these routes with the primary local preference value. For all routes which were denied, attach the secondary local preference value. Set P-NAP provider local preferences causing the P-NAP provider to select direct routing from the P-NAP provider to the P-NAP. Make changes to AS path lengths of routes advertised by the P-NAP to each P-NAP provider to cause providers not directly connected to the P-NAP to use the same preselected P-NAP provider as the P-NAP uses to send to the providers.

Within the Internet today, packets of data are routed between sources and destinations over a plurality of large, nationwide networks whose operating entities are typically referred to as National Internet Service Providers or NSPs. An NSP is an Internet Service Provider (ISP) which has a nationwide network of DS3 capacity of 44.736 Megabits per second (Mbps) or higher, and is present at a minimum of five public NAPs. NAP stands for Network Access Point. There are at least 15-20 such nationwide networks in the United States (U.S.) at the present time, many of which are owned and operated by large telephone companies. Some representative NSPs are MCI, Sprint, WorldCom/UUNet, ANS, AGIS, Netcom and PSI.
In the pre-commercial days of the Internet, there was one NSP, the US National Science Foundation (NSF), which ran a nationwide network infrastructure known as the NSFNet. If two end-users wanted to communicate with one another, they had to connect either directly or indirectly (via a smaller regional ISP) to the NSFNet. Over time, a small number of commercial entities evolved to create their own nationwide network infrastructures which provided the same services as the NSFNet, but for the commercial sector. When the NSF decided to decommission the NSFNet and thereby commercialize the entire Internet, it was anticipated that there would evolve an even larger number of commercial nationwide network infrastructures which would become the Internet connectivity points, either directly or indirectly (via a smaller regional ISP), for all end-users. Two end-users connected via the same national infrastructure would communicate with one another over that infrastructure, but a method was needed to allow for the exchange of traffic between the various national infrastructures so end-users on different infrastructures could communicate with one another. This problem was solved by the creation of several Network Access Points or NAPs.
A public NAP is a public infrastructure operated by private entities (NAP operators) which creates a neutral meeting place for the exchange of TCP/IP packet traffic between any two entities connected to the NAP, provided the entities have an agreement in place to exchange traffic (known as a peering agreement). Today, there are five major NAPs located in the U.S. Two are located in the San Francisco Bay area, one in Washington, D.C., one in New York, and one in Chicago. The NAP operator is paid a fee by any entity connecting to the NAP, and the peering agreements between entities outline the strategy for cost-recovery of their traffic exchange (if any).
Although the NAP architecture seemed sound when it was first developed, time has shown that it has failed to scale with the growth of the Internet. There are a number of reasons for this. First, because the Internet routing protocol used among entities at a NAP (Border Gateway Protocol version 4, or BGP4) does not have hooks to allow for automated, even traffic distribution across NAPs, most of the world's exchanged traffic occurs at a small number of the total number of NAPs because the NAPs which are used must be manually configured by each provider. The result of this is that those NAPs which are taking most of the traffic are overloaded and packets going through them are being dropped. It should be noted that the Transmission Control Protocol/Internet Protocol (TCP/IP) can gracefully recover from a dropped packet because of its Acknowledgement scheme, but this greatly increases the time it takes for information to be exchanged between two end-users, thus causing performance problems for the users. Second, the lack of quick technical advances in Local Area Network/Metropolitan Area Network (LAN/MAN) technologies have made the NAP scaling problems worse. Asynchronous Transfer Mode (ATM) and its promise of high bandwidth is unsuitable for TCP/IP traffic. FDDI (Fiber Distributed Data Interface, operating at 100 Mbps) the only current, stable LAN technology today, is not enough bandwidth to handle traffic levels in the current model. Finally, because the NAP infrastructures are managed by the NAP operators and connections into the NAPs are managed by the connecting entities themselves, there is a continual discontinuity between the available bandwidth within the NAP infrastructure and the amount of bandwidth the entities put into the NAP, thus causing more packet loss.
Thus, there exists a need for a way to bypass the NAPs whenever possible by creating a new interconnection model managing the routing of TCP/IP traffic between the NSPs and users.

Private network access point router for interconnecting among internet route providers


Regimens useful in reducing the frequency of apheresis in a human patient having familial hypercholesterolemia are described. The method involves administering to the human subject via a peripheral vein by infusion of a suspension of replication deficient recombinant adeno-associated virus (rAAV).

Familial hypercholesterolemia (FH) is a life threatening disorder caused by mutations in genes that affect LDL receptor (LDLR) function (Goldstein et al. Familial hypercholesterolemia, in The Metabolic and Molecular Bases of Inherited Disease, C. R. Scriver, et al., Editors. 2001, McGraw-Hill Information Services Company: New York. p. 2863-2913 (2001)). It is estimated that >90% of patients with molecularly confirmed FH carry mutations in the gene encoding for the LDLR (LDLR, MIM 606945). The remainder of the patients carry mutations on three additional genes: APOB (MIM 107730) encoding apolipoprotein (apo) B, PCSK9 (MIM 607786) encoding proprotein convertase subtilisin/kexin type 9 (PCSK9), and LDLRAP1 (MIM 695747) encoding LDLR adapter protein 1. The latter is the only gene mutation that is associated with a recessive trait. Homozygosis is usually conferred by the presence of mutations in the 2 alleles of the same gene; however cases have been reported of patients with double heterozygosis (two heterozygous mutations, one each in two different genes). Based on prevalence rates of between 1 in 500 and 1 in 200 for heterozygous FH (Nordestgaard et al. Eur Heart J, 2013. 34(45): p. 3478-90a (2013), Sjouke et al. Eur Heart J, (2014)), it is estimated that between 7,000 and 43,000 people worldwide have homozygous FH (HoFH).
Characterization of mutant LDLR alleles has revealed a variety of mutations including deletions, insertions, missense mutations, and nonsense mutations (Goldstein et al. 2001). More than 1700 LDLR mutations have been reported. This genotypic heterogeneity leads to variable consequences in the biochemical function of the receptor which are classified in four general groups. Class 1 mutations are associated with no detectable protein and are often caused by gene deletions. Class 2 mutations lead to abnormalities in intracellular processing of the protein. Class 3 mutations specifically affect binding the ligand LDL, and Class 4 mutations encode receptor proteins that do not cluster in coated pits. Based on residual LDLR activity assessed using patients cultured fibroblasts, mutations are also classified as receptor negative (<2% residual activity of the LDLR) or receptor-defective (2-25% residual activity). Patients that are receptor-defective have, on average, lower LDL-C levels and a less malignant cardiovascular course.
As a consequence of impaired LDL receptor function, untreated total plasma cholesterol levels in patients with HoFH are typically greater than 500 mg/dl, resulting in premature and aggressive atherosclerosis often leading to cardiovascular disease (CVD) before age 20 and death before age 30 (Cuchel et al. Eur Heart J, 2014. 35(32): p. 2146-2157 (2014), Goldstein et al. 2001). Early initiation of aggressive treatment for these patients is therefore essential (Kolansky et al. 2008). The available options are limited. Statins are considered the first line for pharmacological treatment. Even at maximal doses, only a 10-25% reduction in LDL-C plasma levels is observed in most patients (Marais et al. Atherosclerosis, 2008. 197(1): p. 400-6 (2008); Raal et al. Atherosclerosis, 2000. 150(2): p. 421-8 (2000)). The addition of the cholesterol absorption inhibitor, ezetimibe, to statin therapy may result in a further 10-20% reduction in LDL-C levels (Gagne et al. Circulation, 2002. 105 (21): p. 2469-2475 (2002)). Use of other cholesterol lowering medications, including bile acid sequestrants, niacin, fibrates, and probucol have been used successfully in the pre-statin era and can be considered to achieve further LDL-C reduction in HoFH; however, their use is limited by tolerability and drug availability. This approach has been shown to reduce CVD and all-cause mortality (Raal et al. Circulation, 2011. 124(20): p. 2202-7). Despite the implementation of an aggressive multi-drug therapy approach, the LDL-C levels of HoFH patients remain elevated and their mean life expectancy remains approximately 32 years (Raal et al. 2011). Several non-pharmacological options have also been tested over the years. Surgical interventions, such as portacaval shunting (Bilheimer Arteriosclerosis, 1989. 9(1 Suppl): p. 1158-1163 (1989); Forman et al. Atherosclerosis, 1982. 41(2-3): p. 349-361 (1982)) and ileal bypass (Deckelbaum et al. N. Engl. J. Med. 1977; 296:465-470 1977. 296(9): p. 465-470 (1977)), have resulted only in partial and transient LDL-C lowering and are now considered nonviable approaches. Orthotopic liver transplantation has been demonstrated to substantially reduce LDL-C levels in HoFH patients (Ibrahim et al. J Cardiovasc Transl Res, 2012. 5(3): p. 351-8 (2012); Kucukkartallar et al. 2 Pediatr Transplant, 2011. 15(3): p. 281-4 (2011)), but disadvantages and risks limit the use of this approach, including the high risk of post-transplantation surgical complications and mortality, the scarcity of donors, and the need for life-long treatment with immunosuppressive therapy (Malatack Pediatr Transplant, 2011. 15(2): p. 123-5 (2011); Starzl et al. Lancet, 1984. 1(8391): p. 1382-1383 (1984)). The current standard of care in HoFH includes lipoprotein apheresis, a physical method of purging the plasma of LDL-C which can transiently reduce LDL-C by more than 50% (Thompson Atherosclerosis, 2003. 167(1): p. 1-13 (2003); Vella et al. Mayo Clin Proc, 2001. 76(10): p. 1039-46 (2001)). Rapid re-accumulation of LDL-C in plasma after treatment sessions (Eder and Rader Today's Therapeutic Trends, 1996. 14: p. 165-179 (1996)) necessitates weekly or biweekly apheresis. Although this procedure may delay the onset of atherosclerosis (Thompson et al. Lancet, 1995. 345: p. 811-816; Vella et al. Mayo Clin Proc, 2001. 76(10): p. 1039-46 (2001)), it is laborious, expensive, and not readily available. Furthermore, although it is a procedure that is generally well tolerated, the fact that it requires frequent repetition and intravenous access can be challenging for many HoFH patients.
Recently three new drugs have been approved by the FDA as add-on therapy specifically for HoFH. Two of them, lomitapide and mipomersen, inhibit the assembly and secretion of apoB-containing lipoproteins, although they do so via different molecular mechanisms (Cuchel et al. N Engl J Med, 2007. 356(2): p. 148-156 (2007); Raal et al. Lancet, 2010. 375 (9719): p. 998-1006 (2010)). This approach results in a significant reduction of LDL-C that reaches an average of ˜50% with lomitapide (Cuchel et al. 2013) and ˜25% with mipomersen (Rall et al. 2010). However their use is associated with an array of adverse events that may affect tolerance and long term adherence and that include liver fat accumulation, the long term consequences of which have not yet been fully clarified.
The third is part of a novel class of lipid-lowering drugs, monoclonal antibodies against proprotein convertase subtilisin/kexin 9 (PCSK9) that have been shown to be effective in lowering LDL-C levels with an apparently favorable safety profile in patients with heterozygous FH (Raal et al. Circulation, 2012. 126(20): p. 2408-17 (2012), Raal et al. The Lancet, 2015. 385(9965): p. 341-350 (2015); Stein et al. Circulation, 2013. 128(19): p. 2113-20 (2012)). Treatment of HoFH with the PCSK9 inhibitor evolocumab 420 mg every 4 weeks for 12 weeks has been shown to provide about a 30% reduction in LDL-C as compared with placebo (Raal et al. 2015). Efficacy of PCSK9 inhibitors is, however, dependent on the residual LDLR activity, with no effect in patients with no residual LDLR activity (Raal et al. 2015, Stein et al. Circulation, 2013. 128(19): p. 2113-20 (2013)). Although the addition of PCSK9 inhibitors may become standard of care for FH and may provide an additional further reduction to lower hypercholesterolemia in a sub-set of HoFH patients, they will not dramatically impact the clinical management of this condition.
Therefore, there remains an unmet medical need for new medical therapies for HoFH.

This patent is subject to a terminal disclaimer.

Gene therapy for treating familial hypercholesterolemia

The Trustees of the University of Pennsylvania


The present disclosure is directed to a regulator, a pharmaceutical composition encompassing the regulator and the application thereof. The regulator modulates the expression integrins and/or EMP2, and is employed for treating integrins-associated and/or EMP2-associated diseases.

Integrins are receptors that can mediate the attachment between a cell and the tissues surrounding thereof, wherein the tissues can be, for example, other cells or the extracellular matrix (ECM). Integrins are also involved in cell signaling and the regulation of cell cycle, shape, and motility. It is now known that activation of integrins allows for bidirectional (outside-in and inside-out) transmission of mechanical and biochemical signals across the plasma membrane, leading to a cooperative regulation of cell functions, including adhesion, migration, growth, and differentiation. Thus, integrins transduce information from the ECM to the cell as well as reveal the status of the cell to the outside so that the cell can make rapid and flexible responses to changes in the environment.
Integrins are transmembrane proteins and have various types, and a cell may have more than one type of integrins on its cell membrane. Specifically, the integrins located on the cell membrane are in the heterodimer form and have an α and a β submits which are bound by non-covalent bond. For example, αVβ3 integrins are formed by an αV and a β3 integrin submits.
Integrins on the cell membrane may interact with the epidermal growth factor receptor (EGFR) and therefore influence the growth of cancer cell and cause the resistance to chemotherapy for cancer. Regarding usage of integrins for the research and clinical treatment of cancer, antibody against integrins is applied and antagonize the receptor of integrins so as to inhibit growths of cells, e.g. vascular endothelial cell, in which integrins are highly expressed or cancer cells. On the other hand, expression of integrins family may need to be raised for the repair and/or regeneration of central nervous system. Recently, integrins are taken as the target for the research and clinical treatment of some diseases such as cancer, multiple sclerosis, Crohn's disease, psoriasis, rheumatoid arthritis, acute coronary syndromes, etc.
In 2008, the market of treatment for the above-mentioned diseases was estimated as more than one billion US dollars. Now the products, being available on the market, for the treatment of those diseases include ReoPro (Abciximab) and Tysabri (Natalizumab). ReoPro is a humanized monoclonal antibody that blocks the function of β3 integrin and is applied to clinical treatment of percutaneous transluminal coronary angioplasty (PTCA) for unstable angina. Tysabri, a monoclonal antibody, blocks the function of α4 integrin and is used for the monotherapy of relapsing-remitting multiple sclerosis. However, the inhibitor against single integrin molecule, such as α4 or β3, does not provide good treatment effects. Moreover, those antibody drugs are expansive, probably induce allergy caused by heterologous protein and may have lost efficacy due to host's immunoreaction.
Furthermore, epithelial membrane protein-2 (EMP2) is a hydrophobic membrane protein and the study and clinical application therefor are limited in the diseases relating to the pathway regulated by female hormones such as endometrial cancer. However, the relations between EMP2 and other proteins or diseases are not clearly demonstrated.
Employing experiments and researches full-heartily and persistently, the applicant finally conceived regulator, pharmaceutical composition encompassing the regulator and application thereof.

Regulator, pharmaceutical composition encompassing the regulator and application thereof


A method, program product and system for automated control of pricing of a product or service. The method includes determining an initial price of the product, monitoring actual sales of the product at retail outlets, and adjusting the initial price during a selling season of the product based on the actual sales of the product. The method can further include accepting input from a historical price database, and determining the initial price using historical prices of the product or a similar product. The method can further include repeatedly adjusting a price of the product during a selling season based on the actual sales of the product. The method can further include applying a markdown to the price of the product and using a markdown profile to determine the markdown. The method can further include performing slow seller analysis to determine the markdown. The determination that a product is a slow seller can be made by applying a predetermined rule set to the product.

A. Field of the Invention
The present invention is directed to the field of marketing of products and services and specifically to the automated control of the pricing of products and services.
B. Background
Effective pricing of products that are made available for sale is often a complicated task. In order to maximize profits, not only must revenue be optimized, but also the costs of inventory must be taken into account. One strategy used is to periodically reduce the price of the products or services, effecting a markdown, in order to encourage sales of the products or services. The amount of the markdown is often set by a sales agent who has had experience in the market for the products or services and can, using his or her experience and intuition determine the timing and amount of markdowns.
In particular, the sale of seasonal products poses a high financial risk for merchants. This risk is even more acute in the retail business. Each seasonal article can be assigned a specific sales period. When high-fashion and fashion articles are involved, the merchant wants to have as little remaining stock as possible at the end of the sales period, as it will be difficult to sell this merchandise even with markdowns. In this case, larger remaining stocks translate to higher losses. In addition to fashion articles, such as pink raincoats, this also applies to other products, such as computer hardware.
For less "fashionable" products, the risk is lower because merchants can store any remaining stock and then try to sell it at the normal price again in the same season of the next year. Because storing inventories is expensive, however, merchants will generally prefer to sell their merchandise by the end of the regular sales period.
Merchants use markdowns to ensure that the merchandise is sold out as completely as possible by the end of a season. Markdowns are price reductions or buyer's incentives aimed at promoting the sale of certain articles. Of course, markdowns reduce the gross margin, which means the revenue merchants earn for selling the merchandise is less than originally planned. Merchants usually plan a certain budget for markdowns that must not be exceeded. Accordingly, markdowns are applied restrictively in retail, which once again increases the risk of remaining stocks at the end of the season.
As discussed above, effective pricing of products is a complicated task which is often performed manually. For example, price adjustments in planning decisions may be used using manual selection systems. Further, a sales promotion may also be implemented in a manual or automated process. A promotion refers to a special event, retail sale, or other activity designed to reduce inventory. For example, spring sales events, two-for-one promotions, end-of-the-season sales, clearance sales, etc. are examples of retail promotions which are utilized to reduce inventory. Sales promotions are different than a markdown controlling process which is not necessarily tied to an event or special circumstance.
Heretofore, a system for providing automated control of pricing of products and services has not been available. Specifically, in existing systems, one or more aspects of the pricing of products and services over the course of a season must be addressed manually. This is often tedious and time consuming and can lead to less than optimal pricing. There is a need for a single system that automatically controls the pricing of good and services that takes into account actual sales information, expected sales, historical sales data and other factors in order to automatically set and adjust pricing to achieve sales goals more effectively.

Method and system for automated control of pricing


An attraction loading system is provided that includes a turntable configured to rotate about a vertical axis. A ride vehicle is configured to travel along a loading path disposed about a perimeter of the turntable. A first track switch of the system is disposed along the loading path to direct the ride vehicle to a main portion of the loading path from an attraction path, or to direct the ride vehicle to the main portion of the loading path from a secondary portion of the loading path. A second track switch of the system is disposed along the loading path to direct the ride vehicle from the main portion of the loading path to the attraction path, or to direct the ride vehicle from the main portion of the loading path to the secondary portion of the loading path.

The present disclosure relates generally to the field of amusement parks. More particularly, embodiments of the present disclosure relate to systems and methods for implementing flexible passenger loading and unloading time in an attraction of an amusement park.
Recently, there has been a growing interest in increasing an efficiency of loading passengers into ride vehicles of attractions of amusement parks. For example, some attractions may include loading systems that have ride vehicles continuously moving along a loading zone as passengers unload from a ride vehicle and/or as new passengers load into the ride vehicle. However, some passengers may take a long time to leave the ride vehicle and/or may take a long time to board the ride vehicle. That is, a loading passenger may not be fully boarded and secured within the ride vehicle before the ride vehicle reaches an end of the loading zone. In such instances, movement of all of the ride vehicles through the attraction and/or the loading zone may be affected to give the loading passenger extra time to board the ride vehicle. For example, in one scenario, each ride vehicle may come to a complete stop in order to allow the loading passenger extra time in the loading zone to board the ride vehicle. Slowing or stopping of the ride vehicles' movement through the attraction may be detrimental to a throughput of the attraction, which can lead to increased waiting times and decreased revenue for the amusement park.


In response to a jumping operation in which a word appearing in an explanatory description read from a Chinese-Japanese dictionary is specified as a jump word, language information on the jump word is read, and the jump word is converted to the corresponding all-purpose character codes by using an all-purpose character code/Chinese-Japanese dictionary local character code conversion table for the language information on the jump word. Further, the all-purpose character codes of the jump word are converted to the corresponding existing local character codes by using an all-purpose character code/existing local character code conversion table for the language information. Jump-enabled destination dictionaries are then extracted based on the language information, a headword matching the jump word is retrieved in a jump destination dictionary selected from the extracted jump-enabled destination dictionaries, and the corresponding explanatory description is then displayed.

1. Field of the Invention
The present invention relates to information display control apparatus for retrieving information corresponding to a specified headword and recording media having stored a program for retrieving the information.
2. Description of the Related Art
In the past, information display control apparatus called electronic dictionaries are known that include dictionary data on subdictionaries such as a Japanese language dictionary, an English-Japanese dictionary, a Japanese-English dictionary, an English dictionary, and an encyclopedia. By using a jumping function provided in such electronic dictionary and by specifying, for example, as a retrieval word a character string composing a part of an explanatory description appearing in the Japanese language dictionary, an explanatory description of a headline appearing in that Japanese language dictionary or other dictionaries such as the Japanese-English dictionary and the encyclopedia can be displayed.
The jumping function provided in the electronic dictionary refers to one that when an explanatory description for a headword in the dictionary is displayed, specifies and retrieves as a retrieval word a character string composing a part of the explanatory description in the dictionary.
Another known jumping function is to set a desired one of the subdictionaries provided in the electronic dictionary as a jump destination when a jump is made from a different subdictionary now in use to the desired subdictionary.
In this jumping, when a character string of a part of an explanatory description appearing in the subdictionary as the jump source displayed on the display screen is selected, an explanatory description for the selected character string is retrieved, using the character codes that describe the selected character string as those of a headword, from the electronic dictionary data of the jump destination specified for the character codes of the headword, and then displayed.
Thus, when the character codes of the electronic dictionary data of the jump source are different in type from those of the jump destination, appropriate retrieval cannot be expected.

Information display control apparatus and recording medium having recorded information display control program


A method of producing a system architecture comprises identifying a set of undesirable events and ascribing to each of the undesirable events an indicator of their severity, associating the undesirable events with one or more actuators of the system architecture, developing a functional specification of an initial architecture proposed for implementation of the system architecture, refining fault tolerance requirements associated with the severity of each of the undesirable events and issuing refined fault tolerance requirements, producing replicates in the functional specification together with attached indicators of freeness of the replicates from other of the replicates, the indicators reflecting the refined fault tolerance requirements, defining a hardware structure for the system architecture, mapping the functional specification onto the hardware structure, and verifying automatically that the indicators of freeness are preserved during the mapping. The method can be stored on a computer readable storage medium or implemented by a design tool.

Many fault tolerant systems, up to now, have been built upon so called fault-tolerant frameworks on which general properties are proved and then installed. Such frameworks may be the basis for nuclear plants, trains or airplane control.
Such frameworks are not scalable or flexible and are very expensive because they rely on a high level of hardware redundancy and have hardware prerequisites, for instance a dedicated bus driver or other components, (in particular verified micro-controllers with preexisting pieces of software). They are not adapted for large series production where cost optimization is a major issue.
Attempts are being made to realize virtual prototyping, one example of which [SCHEID02] is embodied in the approach referred to as "Systems Engineering for Time Triggered Architectures" (SETTA). This can be found via the URL: "http://www.setta.org", one of whose publications is by Ch. Scheidler et al: "Systems Engineering for Time triggered Architectures, Deliverable D7.3, Final Document, version 1.0", XP-002264808, 18 Apr. 2002.
The time-triggered protocol (TTP) framework [Kop96] is a good example of a safety framework built for embedded electronics applications. It answers to a certain extent the flexibility and scalability mentioned above, but only at the level of communication between nodes.
In all the examples above there is a common point,: in that a general safety critical framework is set and the design of an application must be made within the framework and under the specific rules of the framework. The safety proofs are achieved for the whole framework and not for a particular instance of the framework. For instance, in the TTP framework, at least four nodes are required for "normal"1 behavior of the system, and mapping four instances of a process on the different TTP nodes will guarantee that the results of these processes will be available in time and correct for the consumers of these processes. The idea is that a general proof exists for the physical architecture and that this proof specializes for the many instances of safety dataflow and functions embedded in the system.
To give another idea, there is a citation in [Rush95] describing a project in which a safety critical framework, SIFT, has been designed:
"In the SIFT project, several independent computing channels, each having their own processors operate in approximate synchrony; single source data such as sensors are distributed to each channel in a manner that is resistant to Byzantine (i.e. asynchronous) faults, so that a good channel gets exactly the same input data; all channels run the same application tasks on the same data at approximately the same time and the results are submitted to exact-match majority voting before being sent to the actuators".
This is a good illustration of a safety critical framework. Note however that, in the paragraph below in that publication, the application is not even mentioned. It seems that the framework could be used for a nuclear plant, a space shuttle, or even a coffee machine. So even if the SIFT framework has been built to support a flight control system, the designers wished to design a framework with "good" safety properties on which they could design their safety critical application following fixed replication, communication and voting rules.
In the document "Extending IEC-61508 Reliability Evaluation techniques to Include Common Circuit Designs Used in Industrial Safety Systems", W. M. Goble et al., the analysis methods described in the IEC-61508 and ANSI/ISA84.01 standards are discussed. The actual effect of particular failures are considered with respect to their effect on the circuit functionality from a safety perspective and indicators of that severity are ascribed. Once assigned, the severity indicators are fixed.
It can therefore be seen that there is a continuing need for improved methods for designing and verifying a safety critical system, which method allows the optimization of a hardware architecture in that system.

Method for design and verification of safety critical systems


A liquid silicone rubber composition for a lubricant seal having after it is cured high resistance to lubricant, with high stability displayed even in lubricant that has been subjected to thermal and oxidative degradation, and having its rubber elasticity well maintained. The liquid silicone rubber composition for a lubricant seal comprises the following ingredients: (A) an organopolysiloxane containing 2 or more silicon-atom-bonded alkenyl groups in each molecule; (B) an inorganic filler; (C) an oxide or hydroxide of an alkaline-earth metal with an atomic weight of 40 or greater; (D) an organohydrogensiloxane containing 3 or more silicon-atom-bonded hydrogen atoms in each molecule; and (E) a platinum-type catalyst.

This invention pertains to a liquid silicone rubber composition for a lubricant seal. More specifically, this invention pertains to a liquid silicone rubber composition for a lubricant seal, characterized by the fact that it has high stability against lubricant that has been subjected to thermal and oxidative degradation.
Silicone rubber has high heat resistance, high cold resistance, and low compression set. Consequently, it is widely used to form seals for use in automobiles, ships, and industrial machines. For the various types of seals, including rocker cover seals, oil pan seals, oil filter seals, shaft seals, and other seals in direct contact with lubricant, the resistance to lubricant that has been degraded by heat and oxidation should be high. That is, these seals are required to display high stability to the acid components generated by the degradation of the lubricant, to residues of various additives, and to oxygen dissolved in the lubricant. Conventional silicone rubber does not have as good of stability in such an environment as is sometime desired.
In consideration of this problem, various methods have been used in efforts to increase the oil resistance of the silicone rubber composition by adding various types of basic substances into it. For example, Japanese Kokai Patent Application No. Sho 571982!-76055 discloses a method in which magnesium oxide powder is added into a silicone rubber composition that is cured by a condensation reaction so as to obtain a silicone rubber composition which can be cured at room temperature and which has a high oil resistance. Also, Japanese Kokai Patent Application No. Hei 31991!-149260 discloses a method in which magnesium oxide powder is added into a silicone rubber composition that is cured in the presence of a platinum catalyst so as to obtain a silicone rubber composition with a high oil resistance.
However, for the silicone rubber prepared using the first-mentioned method, a long curing time is needed at room temperature to obtain the silicone rubber. The workability is thus poor, and the obtained silicone rubber has low mechanical strength.
For the latter method, when a large amount of magnesium oxide powder is added, a highly basic substance, the platinum catalyst may be poisoned. In addition, in the presence of the organohydrogenpolysiloxane, the composition may begin to cure during storage. Even when the material is stored as a 2-part liquid system, it is still impossible to guarantee a high storage stability and a long pot life, and it is impossible to increase the amount of the magnesium oxide powder added. Consequently, high oil resistance cannot be realized and therefore the durability of the cured silicone elastomer is poor when used under the severe conditions of thermally and oxidatively degraded lubricants.
The purpose of this invention is to provide a type of liquid silicone rubber composition for a lubricant seal characterized by having good storage stability and long pot life before curing, and after it is cured having good stability and ability to maintain good rubber elasticity even in the presence of lubricant that has been subjected to thermal and oxidative degradation.

Liquid silicone rubber composition for lubricant seal


A print head manufacturing method in which satisfactory precision can be obtained by simple processes are provided. Projecting objects having a predetermined shape are formed on a substrate, and a setting resin is applied on the substrate and is set. Then, the projecting objects are removed so that ink cells and nozzles are formed. The thickness of the setting resin is determined such that tip portions of the projecting objects project above the setting resin and ink cells can be formed.

1. Field of the Invention
The present invention relates to printers, print heads, and print head manufacturing methods. The present invention can be applied to a printer in which ink contained in ink cells is heated by heating elements so that ink drops are ejected from the ink cells.
2. Description of the Related Art
In ink jet printers, images, characters, etc., are printed by ejecting ink drops from small nozzles which then adhere to a print medium. In such ink jet printers, ink drops are ejected from small nozzles by heating ink with heating elements or by driving piezoelectric elements.
With respect to ink jet printers in which the ink drops are ejected by heating ink, a method of forming ink cells and nozzles on a substrate has been suggested in Japanese Unexamined Patent Application Publication No. 9-76516. According to this method, projecting objects having a predetermined shape are formed on the substrate at positions above heaters. Then, a setting resin is applied on the substrate and is set, and then the projecting objects are removed so that hollow parts are formed.
More specifically, in this method, heaters are first formed on a semiconductor substrate using semiconductor manufacturing techniques. Then, the projecting objects having the predetermined shape are formed above the heaters using photolithography techniques. The shape of the projecting objects is determined by the required shape of the hollow parts including the ink cells and the nozzles. Then, a setting resin such as epoxy resin, etc., is applied on the semiconductor substrate and is set. Then, the setting resin is partly removed so as to reveal the tip portions of the projecting objects, and then the projecting object are removed by dissolving them. Thus, hollow parts surrounded by the setting resin are formed, and ink passages, ink cells, and nozzles are formed on the semiconductor substrate. According to this method, the ink cells, etc., can be formed by simple processes.
However, in this method, there is a problem in that the nozzles cannot be formed with satisfactory precision.
In this method, the setting resin must be partly removed so as to reveal the tip portions of the projecting objects. However, in an etching process, which is a process for removing the setting resin, it takes approximately an hour to etch 10 μm. Accordingly, there is a problem in that a relatively long processing time is required. In addition, there is another problem in that side walls of ink outlets at the tips of the nozzles easily break, so that the ink drops may be ejected in different directions. In contrast, in barrel finishing, the setting resin can be partly removed and the tip portions of the projecting objects can be revealed in a relatively short time. However, in this case, since a large amount of side etching occurs, there is a problem in that the precision of the ink outlets at the tips of the nozzles is degraded.


A remote operation system comprises an image forming apparatus and a remote operation apparatus. The image forming apparatus has an operation input part including a touch panel and a hardware key and a transmission part for transmitting synthesizable area information indicating a synthesizable area in a candidate screen (first screen) of the remote operation screen to the remote operation apparatus. The first screen is a screen including a touch panel area and a hardware key area, and the synthesizable area is defined in the synthesizable area information as an area not including a hardware key image. The remote operation apparatus generates a second screen by synthesizing an additional image to be added to the first screen into the synthesizable area of the first screen on the basis of the synthesizable area information and displays the second screen on the display part as the remote operation screen.

Field of the Invention
The present invention relates to a remote operation system and a technique relevant to the same.
Description of the Background Art
In the field of a remote operation system, there is a technique in which a remote operation screen is displayed on a display part of a remote operation apparatus for the purpose of a remote operation (remote control) of an apparatus (operation object apparatus) to be operated. Japanese Patent Application Laid Open Gazette No. 2008-071313 (Patent Document 1), for example, discloses a technique in which a remote operation screen including a display screen image simulating a display screen on a display of a remote operation object apparatus and a hardware key image simulating the appearance of a hardware key group of the remote operation object apparatus is displayed on a screen display part of a remote operation apparatus.
By using the technique of Patent Document 1, a remote operation of an image forming apparatus (remote operation object apparatus) can be performed while a remote operation screen including a touch panel image representing a touch panel of the image forming apparatus and a hardware key image representing a hardware key of the image forming apparatus is displayed on a display part of a remote operation apparatus.
In some cases, during the remote operation of the image forming apparatus by using the above-described remote operation screen, one or more operations other than the remote operation have to be performed while the remote operation of the image forming apparatus is performed. Specifically, there is a case where a web browsing operation is performed while the remote operation of the image forming apparatus is performed, or the like. In such a case, a web browsing screen image used for web browsing is displayed as an additional image in a partial area of the remote operation screen.
When such an additional image is synthesized into a given area of the remote operation screen and the screen is displayed, however, (though depending on the area into which the additional image is synthesized), there is a possibility that the hardware key image in the remote operation screen may be hidden behind the additional image and this makes it hard to perform the remote operation of the hardware key of the image forming apparatus.

Remote operation system, image forming apparatus, remote operation apparatus, and recording medium

KONICA MINOLTA BUSINESS TECHNOLOGIES, INC.


A system that incorporates teachings of the subject disclosure may include, for example, a processor which when executing computer instructions performs the operations including receiving network operator-approved credentials associated with a first communications device. Pre-assigned network resources are accessible by the first communications device by way of the network operator-approved credentials. The processor also performs operations including replicating the network operator-approved credentials, and receiving a request from a second communications device for access to the pre-assigned network resources of the first communications device. A copy of the replicated network operator-approved credentials is forwarded to enable the second mobile device to access the pre-assigned network resources. Other embodiments are disclosed.

Presently, access to privately managed mobile communications networks, such as cellular radio networks, requires that users subscribe to a service plan with a carrier network provider. Service plans can include access to services, such as, voice, text messaging, and data. Pricing of such service plans typically set limits on delivery volumes per service during a given billing period. For example, a plan subscriber might be allotted a budget of voice minutes, text messages, and/or megabytes of data per month. A subscriber's usage of the various subscribed services would generally be tracked by the carrier network provider for billing purposes.
Access to such privately managed mobile communications networks includes certain precautions such that services are restricted to authorized subscribers. For example, a subscriber registers a mobile communications device, such as a mobile phone, with the service provider. Through various protocols and as a result of the registration and/or personalization process, the service provider is able to provide access to the subscribed services automatically, without a subscriber having to manually register or login. Registration can include identification of a Subscriber Identification Module (SIM) associated with a particular mobile communications device.
A SIM can include a unique and reliable means of identification, such as an Integrated Circuit Card Identifier (ICCID). The ICCID is stored on the SIM and can also be engraved on the SIM module. The ICCID is defined by the ITU-T recommendation E.118 as a "primary account number." SIMs are also identified on a carrier network by a unique International Mobile Subscriber Identity (IMSI). The IMSI identifies a mobile country code, a mobile network code, and a Mobile Subscriber Identification Number (MSIN). Such information can be used to coordinate network access and billing, such that subscribers of one network can obtain services through a separately managed mobile communication network. The SIM can also include an authentication key (Ki), assigned by a mobile operator during a registration and/or personalization process. The authentication key can also be stored by the carrier network and used to automatically authorize access to a subscriber associated with the authentication key.
Some service plans accommodate other features, such as registration of more than one device for a subscriber, e.g., a mobile phone and a tablet computer, or sharing of network resources among multiple subscribers, e.g., family members, under the service plan.

Sharing of network resources within a managed network


Systems and methods for providing mobile device security are disclosed. In some implementations, a request for access to a security mechanism is received at a user terminal. A short-range radio connection of the user terminal at a time of receiving the request for access is identified responsive to the request. A memory of the user terminal is accessed to determine whether the identified short-range radio connection corresponds to a user-identified secure radio connection. Upon determining that the radio connection corresponds to the user-identified secure radio connection, the user is granted access to the security mechanism without soliciting the user of the user terminal for a predetermined security input. Upon determining that the radio connection does not correspond to the user-identified secure radio connection, the user is solicited for the predetermined security input.

Some computing devices (e.g., mobile phone(s), tablet computer(s), laptop computer(s), etc.) include security mechanisms(s). A security mechanism, which may include, for example, a secure interface, may be a "home screen" on the computing device that provides access to data or applications on the device. The applications may, for example, include a telephone application, an email application, and a short messaging service application, which may be presented on the screen of the computing device via one or more computer icons after authenticated access to the security mechanism. The security mechanism may also include an interface for accessing a secure application executing on the device. The secure application may, for example, include an online banking application.
Security mechanisms are typically accessed by providing login credentials (e.g., a username and/or a password) to the computing device. Entering a password may be inconvenient under some circumstances, for example, when the user is driving a car. As the foregoing illustrates, a new approach for accessing a security mechanism on a computing device may be desirable.
In addition, security clearance procedures at security checkpoints, for example, at airports and at high-rise office buildings, may be cumbersome and time consuming for travelers or visitors to the high-rise office buildings who are low-risk. A traveler or visitor may be low-risk based on information known about the travelers or visitors (e.g., a visitor who is an employee working at the office building may be a low-risk visitor). As the foregoing illustrates, a new, less cumbersome approach for clearing a security checkpoint may be desirable.


A semiconductor chip of the present invention has a wiring substrate and a chip part. The wiring substrate has an insulating resin layer having a first major surface and a second major surface, and a first wiring layer disposed on the insulating resin layer on the second major surface side. The chip part has a projection electrode on the bottom surface. The insulating resin layer holds the chip part such that the bottom and side surfaces of the chip part are in contact with the insulating resin layer, and the top surface of the chip part is exposed on the insulating layer on the first major surface side. The projection electrode of the chip part is connected with the first wiring layer.

Conventionally, in the connection structure of a semiconductor chip and a wiring substrate by the flip chip method, the reliability of the connection portion becomes one of the important problems.
As means for increasing the reliability, usually sealing resin is injected between the semiconductor chip and the wiring substrate to alleviate stress on the connection portion. The underfill method was used, as the resin injection method, in most cases, in which the semiconductor chip is mounted on the wiring substrate by the flip chip method and then liquid resin is poured and hardened (for example, Japanese Patent Laid-Open No. 2000-156386: first conventional example).
Explanations are given of the flip chip mounting method in which underfill resin is later injected according to the first conventional example, with reference to FIGS. 1A to 1C. As shown in FIG. 1A, a wiring substrate includes wiring pattern 2 formed on insulating layer 12 and solder resist 3 to cover wiring pattern 2. Generally, insulating layer 12 and wiring pattern 2 are multi-layered.
In the step of mounting the semiconductor chip, as shown in FIG. 1B, bump 5 is formed on a pad (electrode) arranged on the circuit surface of semiconductor chip 4, and the exposure portion of wiring pattern 2 on the wiring substrate and bump 5 for semiconductor chip 4 are aligned and are joined.
In the subsequent step shown in FIG. 1C, the liquid resin is injected into a space between semiconductor chip 4 and the wiring substrate and is hardened to form underfill 17 that seals semiconductor chip 4, and then a semiconductor package of the flip chip mounted structure is completed.
However, in the first conventional example in which the underfill resin is injected later, as the connection means, various techniques, such as metal diffusion junction, metal fusion junction, junction by metal content resin paste, are used. In any technique, heat is applied to the semiconductor chip and the wiring substrate during mounting. Therefore, in particular, in cases where an organic substrate is used as the wiring substrate, stress is caused by the difference between thermal expansion coefficients of the semiconductor chip and the wiring substrate and the stress is concentrated on the connection portion when the temperature lowers after the semiconductor chip has been mounted. Therefore, there are problems in that the connection portion is apt to be broken and improvement of reliability is difficult.
As another manufacturing method, a technique is proposed, in which resin is previously applied on a wiring substrate, and, during mounting of a semiconductor chip, the resin between the semiconductor chip and the wiring substrate is hardened simultaneously with the junction while bumps formed on the semiconductor chip are maintained in contact with pads formed on the wiring substrate by the application of pressure to the chip (for example, Japanese Patent Laid-Open No. 4-82241: second conventional example).
The manufacturing method in the technique according to the second conventional example is explained with reference to FIGS. 2A and 2B. First, as shown in FIG. 2A, liquid resin 17a is supplied to a position on which the semiconductor chip is mounted on the wiring substrate. Generally, an air-type dispensing device is used to supply the resin.
Then, semiconductor chip 4 on which bumps 5 are formed is adsorbed and held by chip mounting tool 18 that has adsorption hole 19, and semiconductor chip 4 is aligned with wiring on the wiring substrate. Successively, as shown in FIG. 2B, chip mounting tool 18 is moved down to make bumps 5 come into contact with wiring pattern 2 while semiconductor chip 4 is adsorbed and held. While this state is maintained, heat and pressure are applied to semiconductor chip 4 to connect the bumps and the wiring and to harden the resin between the semiconductor chip and the wiring substrate, thereby forming underfill 17. In the second conventional example, although expansion of the substrate by heat during mounting has not changed, stress, which is generated due to contraction of the substrate when it returns to room temperature, is dispersed over underfill 17. Therefore, it is possible to prevent to poor connection caused by the difference between thermal expansion coefficients of the semiconductor chip and the wiring substrate, that is, the problem in the above-described technique where the resin is injected and hardened after mounting. Further, this example is provided with the feature in which low-temperature connection is available only by contact of bumps 5 and the wiring on the wiring substrate. However, in recent years, demand for use in portable terminal devices has become severe, and it has become essential to manufacture discrete semiconductor chips that have thin profiles. A significant problem emerges in which resin climbs the chip mounting tool of the semiconductor chip mounting device while the chip is being mounted in the case of thin chips, and resin adheres to the tool.
As recent electronic devices become more sophisticated in performance and functionality, demand for higher frequencies and higher densities is steadily increasing. Particularly, in electronic device where analog circuits that generate enormous noises are incorporated, e.g., a mobile phone and a wireless LAN, and in motherboards for personal computers with higher clock speeds, noises that are transmitted to wires in the wiring substrate may cause malfunction depending on the levels of the noise. Therefore, how the noise is reduced or blocked is an important problem.
In order to reduce the effects caused by noise, a technique is used, in which power source and ground patterns are arranged in the wiring layer of a core layer and filled-in patterns that connect with the ground are arranged as much as possible in an outmost wiring layer. The example for mounting a semiconductor chip according to this conventional technique will be explained, with reference to FIGS. 3A and 3B. FIG. 3A is a plan view of the uppermost wiring layer, and FIG. 3B is a cross-sectional view of the area around the mounting portion of semiconductor chips. Bumps for semiconductor chip 4 are connected to pads 20 formed on the uppermost wiring layer and are connected with via hole lands 21 through wiring pattern 2. Also, in the uppermost wiring layer, ground patterns 2a for reducing the above-mentioned effects caused by the noise are formed in filled-in patterns. In the internal layer of the wiring substrate, writing patterns 2 that transmit signals from semiconductor chip 4 connected to pads 20 are formed, and are connected to terminals of other electronic parts through these wiring patterns in the wiring substrate. In this example, writing patterns 2 that are connected to the other electronic parts pass through the lower layer of ground pattern 2a arranged in the uppermost layer, thereby reducing the above-mentioned effects caused by the noise.
Interlayer connection for the wiring patterns in the wiring substrate having a plurality of wiring layers is performed through via hole 22. Each wiring pattern passes through the internal wiring layer by via hole 22 and is drawn to the surface layer through via hole 22 once again to be connected with the corresponding terminal of the other parts.
Also, FIGS. 4A and 4B show an example in which semiconductor chips are laminated and BGA (ball grid array) is manufactured according to the conventional mounting method. FIG. 4A is a plan view of the wiring layer of an uppermost layer, and FIG. 4B is a cross-sectional view of a conventional BGA. Similarly, to the example shown in FIGS. 3A and 3B, bumps for semiconductor chip 4 are drawn out to via hole land 21 through pad 20 and through wiring patterns 2 formed in the uppermost wiring layer, and fall to the lower wiring layer. Pads 23 for wire bonding are formed on the peripheral portion of insulating layer 12 of the uppermost layer. On semiconductor chip 4, another semiconductor chip 16 is mounted in a face-up state. Electrodes (not shown) of another semiconductor chip 16 and pads 23 are connected with bonding wires 24.
In the manufacturing method according to the first conventional example shown in FIGS. 1A to 1C, in particular, when organic materials are used as insulating layers for the wiring substrate, the thermal expansion coefficient of the semiconductor chip is approximately 2 to 3 ppm/° C. while that of the organic wiring substrate is approximately 10 to 50 ppm/° C., and a large difference exists. After the application of heat during mounting, the wiring substrate contacts more than five times that of the chip, and thus much stress concentration is produced in the junction portion. This stress concentration causes problems of various junction breakages, i.e., breakage between bumps formed on electrodes on the chip and electrodes, breakage of electrodes, connection interface breakage between bumps and pads on the wiring substrate, and the stress concentration also caused a problem in which reliability is lowered. Further, since these failures are caused by the difference between the thermal expansion coefficients, the rate of failure occurrence tends to increase in large chips; in particular, it is very difficult to apply this example to a large chip having a peripheral structure in which bumps are arranged only in the periphery of the chip.
Next, the problems in the manufacturing method according to the second conventional example shown in FIGS. 2A and 2B will be explained. In this method, expansion of the substrate by heat during mounting has not changes. However, during mounting the semiconductor chip, stress caused by contraction of the substrate when it returns to room temperature is spread by the resin because the resin is hardened while the chip is being held by the chip mounting tool. Therefore, the connection failure caused by the difference between the thermal explosion coefficients of the semiconductor chip and the wiring substrate, i.e., the problem in the above-mentioned method in which the resin is injected after mounting, can be prevented. However, in recent years, demand for semiconductor devices having thin profiles for use in portable terminal devices has become severe, and it has become essential to manufacture discrete semiconductor chips that have thin profiles. As chips are thinner, the problem becomes obvious, that resin climbs the chip mounting tool of the semiconductor chip mounting device during mounting and adheres to the tool. This causes a problem that, while the resin previously applied on the substrate is pushed out during the steps of applying pressure and heat to the semiconductor chip and leaks out to the periphery of the chip, the resin climbs from the side surfaces of the chip and is in contact with the heated tool of the mounting device that adsorbs the chip and applies pressure to the chip, so that the resin becomes hardened, and then mounting after the next time becomes impossible.
The reason why this problem occurs is explained with reference to FIG. 5, which is a schematic view of a state in that a thin chip is adsorbed by the chip mounting tool. Chip mounting tool 18 is designed to be sufficiently smaller than semiconductor chip 4 taking into consideration cases where the resin climbs the top surface of semiconductor chip 4 by variations in the amount of discharge. However, in cases in which the thickness of semiconductor chip 4 is sufficiently thin, as shown in FIG. 18, and the chip mounting tool is smaller than the formation portion of bumps 5, there occurs a problem that the chip is broken when pressure is applied to semiconductor chip 4 by chip mounting tool 18. Therefore, for thin chips, chip mounting tool 18 must be made large so as to cover at least bumps 5, and the possibility is significantly increased, that resin that climbs up the top surface of the chip adheres to the chip mounting tool and becomes hardened.
Further, because the chip is thin, it is easy for the resin to climb, and therefore variations in the amount of resin that is discharged must be reduced to a fixed limit. It is generally known that when the thickness of the chip is 15 mm or less, controlling the amount of resin is difficult, in case of liquid resin, and reducing variations in the amount of resin that is discharged becomes difficult.
In terms of preventing the resin from adhering to the chip mounting tool and of controlling the proper amount of resin, film-shaped resin is proposed, and various resin materials, such as thermosetting, thermoplastic, and thermosetting and thermoplastic mixture resin materials, are being studied. However, film-shaped resin materials used for underfill are burdened with many problems peculiar to film shapes, for example, adhesive suitability when film-shaped resin adheres to the wiring substrate, the generation of bubbles, and connection reliability after hardening. These film-shaped resins have problems in that not only are they still under development, but material costs are also very expensive. Further other problems that occur when film-shaped resin materials are used is that conventional resin dispensing devices cannot be used and that capital investment must be made for new film adhering device, and this means there is the difficulty in reducing the manufacturing costs.
Next, structural problems are explained about electronic devices manufactured according to the conventional mounting method. In the conventional chip mounted structure in which parts for substrate surface layer wires are mounted, as shown in FIGS. 3A, 3B, 4A and 4B, many signal lines must fall in the wiring layer of the internal layer, and surface layer wires and internal layer wires are connected through via holes for interlayer connection. Therefore, though a general semiconductor chip with several hundreds of pins is mounted, an enormous number of via holes is required. Particularly, as the conventional example shown in FIGS. 3A and 3B, when the ground patterns are formed in the uppermost layer of the substrate in order to address higher frequencies, this becomes more significant, and almost all of the signal lines must fall in the internal layer.
Here, a via hole land diameter in the order of 200 μm is required in the leading-edge. As the number of via holes is increased, the area occupied by the via holes is increased. Therefore, it is very difficult to route wires because the wiring area is limited and alternative wiring is needed, the number of wiring layers must be increased in some cases, and the wiring length is further increased. Accordingly, to be able to use higher frequencies, it is necessary to minimize the number of via holes.
Further, since the increase in the number of via holes causes an increase in the rate of occupation in the via hole arrangement area and the wiring area in the uppermost layer, this causes many constraints on mounting intervals between parts and has harmful effects on the higher-density mounting of parts. For example, in BGA shown in FIGS. 4A and 4B, since bonding pads are arranged away from semiconductor chip 16, the bonding wires become longer and packaging in a chip size becomes difficult.
Also, concerning costs, via holes are formed one by one in the insulating layer by laser or the like in many cases, because the number of processes is increased in proportion to the increase in the number of via holes, as a matter of course, and therefore production costs for substrates increase. The increase in the number of layers significantly causes an increase in costs.
On the other hand, in terms of reliability, via holes are portions that are apt to be broken in the substrate. In terms of quality such as production variability, it is more preferable to have a smaller number of via holes. An increase in via holes becomes weakens to reliability.

Electronic device having a wiring substrate


An inexpensive positive electrode active material for lithium batteries which comprises lithium manganate having a hexagonal layered structure with space group of R3m and exhibits continuous discharge voltage characteristics between 4.5 V and 2 V for metallic lithium.

1. Field of the Invention
The present invention relates to a positive electrode active material for a lithium battery, a method for producing the same, and a battery containing the same in the positive electrode thereof.
2. Description of the Related Art
With the recent development of portable electronic equipment, batteries of higher performance have been demanded. Lithium ion batteries using a carbon material in the negative electrode and lithium cobaltate (LiCoO.sub.2), which is a composite oxide having a layer structure, in the positive electrode have been put to practical in a nonaqueous battery having a high working voltage and a high energy density. Lithium nickelate (Li-containing nickel oxide; LiNiO.sub.2) is also a compound having the same layered crystal structure as the lithium cobaltate in which lithium ions are intercalated between layers of NiO.sub.6 octahedral sharing edges.
Lithium nickelate is generally prepared by mixing a nickel source selected from Ni(NO.sub.3).sub.2, Ni(OH).sub.2, NiCO.sub.3, NiO, NiOOH, etc. and a lithium source selected from LiOH, LiNO.sub.3, Li.sub.2 CO.sub.3, Li.sub.2 O.sub.2, etc., and subjecting the mixture to a heat treatment at about 600 to 900.degree. C. in an oxygen stream.
Since cobalt or nickel used in these active materials is expensive for scarcity, less expensive active materials for a positive electrode has been sought. For example, Li-containing manganese composite oxide (LiMn.sub.2 O.sub.4) having a spinel structure has been proposed, but its theoretical capacity of 148 mAh/g is low, and the reduction in capacity increases with charge and discharge cycles.
LiMnO.sub.2 has been proposed as a promising active material for batteries with higher performance. Among various phases exhibited by LiMnO.sub.2, two phases, whose crystal structure have been well characterized, are a high temperature orthorhombic phase (Pmnm) and a low temperature tetragonal phase (I4.sub.1 /amd). Both structures involve cubic close packing but they differ in the arrangement of the ordering of the lithium and manganese cations. The tetragonal form Li.sub.2 Mn.sub.2 O.sub.4 is prepared by electrochemically or chemically intercalating lithium into the spinel LiMn.sub.2 O.sub.4 [Mat. Res. Bull, 18(1983)461 & 18(1983)1375; J. Electrochem. Soc. 138(1991)2864 & 139(1992)937]. The orthorhombic phase has been prepared mainly by the solid state reaction at high temperature using different precursors [J. Phys. Chem. Solid. 3(1957)20 & 318; J. Phys. Radium 20(1959)155; J. Anorg. Allg. Chem. 417(1975)1; Mater. Res. Bull. 28(1993)1249]. However, orthorhombic LiMnO.sub.2 was reported to be prepared at low temperature using the solid state reaction by heating a mixture of .gamma.-MnOOH and LiOH at 300 to 450.degree. C. [Chem. Express, 7(1992)193]. An other process for preparing the orthorhombic LiMnO.sub.2 at a temperature less than 100.degree. C. by ion exchange was reported. [J. Electrochem. Soc. 140(1993)3396; Unexamined Japanese Patent Publication (kokai) No. 6-349494] In this case, the exchange was carried out by refluxing .gamma.-MnOOH under boiling condition in LiOH solution. So far, LiMnO.sub.2 isostractural with layered LiNiO.sub.2 or LiCoO.sub.2 has not yet been synthesized.
Referring to LiMnO.sub.2 having a layer structure, J. Solid State Chem., 104(1993)464 and U.S. Pat. No. 5,153,081 report that LiMnO.sub.2 having a monoclinic layer structure can be obtained by acid leading of Li.sub.2 O out of Li.sub.2 MnO.sub.3. In the first step, Li.sub.2 MnO.sub.3 was prepared by reacting electrolytic manganese dioxide (EMD) with a stoichiometric quantity of Li.sub.2 O.sub.3. The obtained material was then delithiated using H.sub.2 SO.sub.4 at room temperature for 64 hours.
The thus obtained substance exhibits a discharge voltage of 3 V vs. Li/Li.sup.+. Although the reaction product exhibits a new X-ray diffraction peak at 2.theta.=19.5.degree., most of the other peaks correspond to the starting material which is Li.sub.2 MnO.sub.3 (U.S. Pat. No. 5,153,081). Ignoring the fact that most of the peaks are assigned to the starting Li.sub.2 MnO.sub.3, the inventors of U.S. Pat. No. 5,153,081 identify the product to be a substance having a layer structure based on the peak at 2.theta.=19.5.degree., but the identification seems to be decisively unreasonable. In this case, the product should rather be regarded as a lithium manganese oxide having a spinel structure as a basic skeleton, such as Li.sub.2 Mn.sub.4 O.sub.9 or Li.sub.4 Mn.sub.5 O.sub.12.
Further, J. Solid State Chem., 104(1993)464 reports a substance having a layer structure whose X-ray diffraction pattern is different from those of LiNiO.sub.2 or LiCoO.sub.2. While not entering into details about structural refinement of the substance, the report based their layered structure on the assumption that removal of Li.sub.2 O from Li.sub.2 MnO.sub.3 causes a shearing of the closed-packed oxygen planes to yield an oxygen array in the obtained material comprised of alternate layers of trigonal prisms where lithium is located and sheets of edge-shared octahedra where manganese is located. In this case, the manganese ions remain in alternate layers and do not migrate to the lithium layers during the leaching process, and the lithium layer is arranged in a zig-zag fashion with lithium ions in a trigonal prismatic coordination.
Unexamined Japanese Patent Publication (kokai) No. 7-223819 reports that LiMnO.sub.2 having a layer structure with a lattice constant of a=3.321 .ANG. and c=4.730 .ANG. is obtained by electrolysis method. This material is not isostructural with LiNiO.sub.2. Thus, no LiMnO.sub.2 having a layer structure similar to that of LiNiO.sub.2 or LiCoO.sub.2, has been synthesized yet.
As stated above, although 4.0 V type LiMn.sub.2 O.sub.4 having a spinel structure has been proposed as an inexpensive Li-containing manganese composite oxide, the theoretical capacity is inferior to oxide compounds having a hexagonal layer structure, such as LiNiO.sub.2 (theoretical capacity: 275 mAh/g) and LiCoO.sub.2 (theoretical capacity: 274 mAh/g). In addition, the charge and discharge cycle characteristics are better in layered oxide materials. Therefore, development of an inexpensive active material having a layer structure similar to that of LiNiO.sub.2 or LiCoO.sub.2 and establishment of synthesis therefore have been keenly demanded, but a useful method of synthesis has not yet been established.

Positive electrode active material for lithium battery, method for producing the same, and lithium battery containing the same


A child seat includes a seat body having a seat portion, a backrest, and left and right side guards, an airbag provided adjacent to the seat body for receiving the child upon inflation thereof, and an inflating device communicating with the airbag for inflating the airbag. When the inflating device is actuated, the airbag is inflated to receive the child for protection.

The present invention relates to a child seat used in an automobile and the like. In particular, the present invention relates to a child seat with an airbag to be inflated for receiving a head portion of a child.
A common child seat installed in an automobile has a seat body for accommodating a child and a seatbelt for supporting the child. A child seat may be provided with an impact shield disposed in front of an abdomen of a child (Japanese Patent Publication (Kokai) No. 61-235251). The seat body includes a seat portion for placing a buttock of the child, a backrest for placing a back of the child, and left and right side guards located on left and right sides of the child.
Japanese Patent Publication (Kokai) No. 2001-341611 has disclosed a child seat in which two arms extend upwardly from left and right sides of a seat body towards a front of the child seat and an airbag module is disposed between ends of the arms. The airbag module includes a cylindrical diffuser housing with a build-in inflator (gas generator) and an airbag disposed around a circumference of the diffuser housing. A collision sensor is provided on the seat body. When the collision sensor sends a signal upon a collision, the inflator is activated to generate gas. The gas inflates the airbag widely in front of the child sitting in the child seat.
Japanese Patent Publication (Kokai) No. 10-157553 has disclosed a child seat in which when a high-load is applied due to an automobile collision, an airbag is inflated along outer surfaces of left and the right side guards (side support portions) for protecting a child.
Japanese Utility Model Publication (Kokai) No. 64-37743 has disclosed a child seat in which a concave headrest is disposed around a head portion of a child from a backside to left and the right sides.
In the airbag module disclosed in Japanese Patent Publication (Kokai) No. 2001-341611, the inflator has a heavy weight, thereby increasing a weight of the child seat. Moreover, it is necessary to provide an activation mechanism for the inflator, thereby increasing a cost of the child seat.
In the child seat disclosed in Japanese Patent Publication (Kokai) No. 10-157553, the airbag is inflated along the entire outer surfaces of the side guards. Accordingly, it is necessary to provide a large-capacity inflator. In a case that the airbag is inflated when a person sits closely next to the child seat, the airbag may be inflated between the person and the child seat, thereby applying an unexpected external force to the person.
In the child seat disclosed in Japanese Utility Model Publication No. 64-37743, the headrest is situated around the head portion of the child at all the time, thereby causing discomfort to the child.
In view of the problems described above, an object of the present invention is to provide a child seat with a simple and lightweight structure for sufficiently protecting a child.
Further objects and advantages of the invention will be apparent from the following description of the invention.


A coiled camera includes a coiling layer, a circuit device layer, active microelectronic circuitry fabricated on the circuit device layer, a semiconductor imaging device electronically coupled to the active microelectronic circuitry and a lens coupled to the semiconductor imaging device.

The information age has significantly increased the need for miniature electronic devices. Tremendous demand exists for portable electronic devices, such as digital cameras, digital camcorders, laptops and other similar products. Devices that are small and fully functional with processing, power, information gathering and storing capabilities built in are desirable.
Using current semiconductor process technology, an incredible amount of functionality can be integrated onto a single, large silicon die. This single die can now contain an entire system on a chip, such as an entire computer or, a cell phone. However, one of constraints affecting further miniaturization is the thickness of the silicon substitute that the integrated circuit is manufactured on.
Applications for miniature devices are countless including commercial applications, such as cameras, communication devices, computers, etc.


A mobile terminal includes a display device that displays pages, and a control unit that acts as an input receiver that receives a writing made on the page, displayed on the display device, an application executor that executes an application program, a recording requester that requests a data management system to record playback data including the written data received by the input receiver and a task executed by the browser application program acquired by the browser expander, with a time stamp added to the written data and the executed task, and a playback processor that plays back the written data and the executed task included in the playback data acquired from the data management system, in synchronization according to the time stamp. The playback processor plays back the task executed by the browser application program, through the browser expander.

The present disclosure relates to a mobile terminal configured to play back data written on a page, and an information processing system.
Recently, digitization of school classes is in progress. For example, a technique has been proposed that includes recording the voice of a teacher, or a picture of a content displayed by the teacher on a monitor of the classroom, as recorded information, and generating and recording synchronicity information of the content and the recorded information, at the timing that the page number of the content changes. With such a technique, the content and the recorded information can be played back in synchronization at the timing that the page number of the content changes, through a network.

Information processing system provided with mobile terminal that can play back data written on page


Embodiments of a multicarrier transmitter and method of generating an RF signal for transmission are generally described herein. Other embodiments may be described and claimed. In some embodiments, a multicarrier transmitter generates RF signals for transmission using non-linear switching power amplifiers to amplify outphased switching waveforms allowing the multicarrier transmitter to operate more efficiently than some conventional multicarrier transmitters.

Multicarrier waveforms, such as orthogonal frequency division multiplexed (OFDM) waveforms, have amplitude and phase information modulated thereon. These waveforms are conventionally amplified for transmission using linear or near-linear power amplifiers to reduce distortion of this information. The inherently low efficiency of these linear and near-linear power amplifiers results in increased power consumption and/or increased heat generation. Furthermore, the significant peak-to-average power ratios (i.e., 10-15 dB) of some multicarrier waveforms may further reduce the average efficiency of linear or near-linear power amplifiers. Increased power consumption and increased heat generation are undesirable characteristics, particularly for portable, mobile and handheld wireless devices that rely on batteries. Non-linear power amplifiers are generally more efficient than linear and near-linear power amplifiers, however direct amplification of a multicarrier waveform by non-linear power amplifiers may distort the amplitude and phase information, making non-linear power amplifiers unsuitable for use in conventional OFDM transmitters.
Many conventional transmitters use analog circuitry, which is more sensitive to process, voltage and temperature (PVT) variations than digital circuitry. Analog circuitry also utilizes large inductors that may occupy a larger die area and are less compatible with some semiconductor processes, such as complementary metal-oxide semiconductor (CMOS) processes, than digital circuitry. Analog circuitry may also require greater voltages than digital circuitry making it less compatible with low-voltage semiconductor processes.
Thus, there are general needs for multicarrier transmitters that are more efficient, consume less power, and/or are less sensitive to PVT variations. There are also general needs for multicarrier transmitters that are compatible with low-voltage semiconductor processes.

Digital transmitter and methods of generating radio-frequency signals using time-domain outphasing


A turbocharger includes: a rotating shaft which extends along an axis; a turbine wheel which is provided on one end side of the rotating shaft; a compressor wheel which is provided on the other end side of the rotating shaft; a rolling bearing which includes an inner race fixed to an outer circumferential surface of the rotating shaft, an outer race surrounding the inner race from an outside in a radial direction, and rolling bodies arranged between the inner race and the outer race and rotatably supports the rotating shaft around the axis; a housing which covers the rolling bearing from an outer circumferential side with a gap between the housing and an outer circumferential surface of the rolling bearing; and a plurality of lubricating oil supply lines through which lubricating oil is supplied to different locations in the housing at different state quantities.

Some turbochargers have a constitution in which a rotating shaft is supported by a rolling bearing. Such turbochargers each include a housing which includes a tubular accommodation part for accommodating a rolling bearing. A rolling bearing is supported by a housing by fitting an outer race of the rolling bearing into an accommodation part of the housing. A rotating shaft of a turbocharger is fitted into a rotatable inner race. Thus, a rotating shaft can rotate relative to a housing.
In such turbochargers, in order to minimize friction resistance in the rolling bearing, lubricating oil is supplied to a rolling bearing. If an amount of lubricating oil to be supplied is too small, a temperature of a rolling bearing increases when a turbocharger is in operation. However, if the amount of lubricating oil to be supplied is too much, an agitation loss of lubricating oil in a rolling bearing increases.
Patent Document 1 describes a constitution in which oil supply holes for supplying lubricating oil are provided in a rolling bearing of a turbocharger. The device of Patent Document 1 includes distribution flanges by which lubricating oil is distributed into a rolling bearing side and a turbine wheel side. With such a constitution, lubricating oil is prevented from being excessively supplied to a rolling bearing and stirring resistance of lubricating oil in a rolling bearing is minimized.

MITSUBISHI HEAVY INDUSTRIES ENGINE & TURBOCHARGER, LTD.


Assigning security levels to a shared component is presented. A workflow manager receives a workflow request that corresponds to a plurality of workflow steps. For each workflow step, the workflow manager determines whether the workflow step uses a shared component or an unshared component for execution. If the workflow step uses a shared component, the workflow manager invokes the step, and stores the step and its corresponding security level in a security tracking table. When the workflow manager encounters a shared component, the workflow manager uses the security tracking table entries in order to determine a security level to assign the shared component. The workflow manager assigns the determined security level to the shared component, and invokes the shared component to execute the corresponding process step.

1. Technical Field
The present invention relates in general to a system and method for assigning security levels to a shared component. More particularly, the present invention relates to a system and method for using completed workflow step security levels in order to determine a shared component's security level.
2. Description of the Related Art
Large computer systems typically support multiple applications. These applications invoke "workflows" whereby a workflow is a series of process steps. For example, a computer system may support an employee directory application, and one of the application's workflows is to retrieve contact information from an employee database. Each process step uses a "component" during its execution. Using the example described above, the employee directory application may use a "database access" component during its contact information retrieval workflow.
A challenge found is when more than one application accesses a particular component. Expanding on the example described above, another one of the computer system's applications may be an employee data update application, whereby the application accesses the same employee database as the employee directory application in order to update contact information. In this example, both the employee directory application and the employee data update application share the "database access" component. The challenge found when applications share components is assigning a security level to the component. In the example described above, retrieving contact information is at a lower security level than updating contact information. However, existing art assigns the same security level to both process steps when the shared component is used, regardless of which application is invoking the shared component.
What is needed, therefore, is a system and method to allow shared components to operate at different security levels based upon a corresponding process step.

International Business Machines Corporation