The present invention relates to a hydrophobic additive for use with fabric, fiber, and film. One aspect of the present invention comprises a master batch composition for use in preparing a non-woven fabric in order to increase the hydrophobicity of the non-woven fabric. In one embodiment, the master batch composition includes a polymer and a lipid ester. The lipid ester comprises from 10 wt. % to 40 wt. % of the master batch. The fabric, when including the master batch composition, has a contact angle ranging from 100° to 125° when measured according to test method ASTM D2578.

1. Field of the Invention
The present invention relates to a hydrophobic additive for use with fabric, fiber, and film.
2. Background Art
Non-woven fabrics are used in many circumstances to provide a barrier to fluids, including contaminated bodily fluids. Contaminated bodily fluids are low surface tension fluids. Typically, non-woven fabrics require a coating or film in order to achieve effective fluid repellency of low surface tension fluids to be considered adequate barrier materials. The non-woven fabric may be manufactured by methods known in the art. Articles incorporating the non-woven fabric may also be manufactured by conventional manufacturing methods. At present, fluorinated and silicone-based components are included in the coatings and films applied to non-woven products to achieve effective fluid repellency of the low surface tension fluids.
But, some people suffer skin irritation during prolonged exposure to fluorinated coatings adjacent to their skin. Application of silicone components to non-woven fabrics in a manufacturing process is extremely difficult and labor-intensive.
What is needed is a composition for fabrics, fibers, and films that repels low surface tension fluids, but which does not cause skin irritation during long exposure and which is relatively easy and inexpensive to manufacture.

Hydrophobic additive for use with fabric, fiber, and film


An integrated-distributed-inductive-capacitive network (100) having a high dielectric electronically-tunable semiconductor integrated capacitor. The network (100) also includes a conductive layer (126) formed on the high dielectric semiconductor integrated capacitor, to provide the distributed resistance of the network (100). External contact to the network (100) is provided via a plurality of contact terminals (122A and 122B) which are coupled to the conductive layer (126).

High-quality capacitors are an integral part of many electrical circuits. Capacitors are available in a variety of values with different characteristics. Variable capacitors having a wide dynamic range are available only in bulk sizes rendering them useless for miniature electronic applications. Semiconductor variable capacitors, referred to as varactors, are available, however with very narrow dynamic range. Tunable electronic circuits such as filters and oscillators are presently tuned using fixed components for coarse tune and tunable capacitors or inductors for fine tune.
Electronic devices, and in particular communication devices, utilize a variety of circuits such as filters and oscillators that must be tuned for proper operation. These circuits use a combination of fixed and tunable components to achieve their objectives. Fixed components are used along with tunable components to provide the tunable circuit with sufficient dynamic range. The need for fixed value components has resulted in the inability to design and manufacture a common circuit to operate over a desired range. Communication devices operating in a particular band must be proliferated to accommodate different segments of that band due to the unavailability of alternative components. Each board is equipped with a different fixed value component along with a variable characteristic component to achieve the desired performance specifications.
Another area of deficiency in electronic devices is the area of distributed inductive-capacitive networks. These networks are particularly beneficial in communication devices. Present distributed networks are also used in proliferation. That is, several circuits are designed and fabricated which perform the same function at different segments of their performance spectrum. The impact of proliferation is obvious on product cost, inventory, handling, troubleshooting, and quality. Some techniques have been employed to avoid proliferation with some degree of success. One such technique employs components printed on a substrate and subsequently trimmed to desired spec via a well defined laser beam. This procedure only available to high frequency applications is limited in range and can only reduce the number of boards performing similar functions and not totally eliminating the need for such proliferation. A need is therefore clear for a tunable network having a wide dynamic range with reactive characteristics.

Integrated distributed inductive-capacitive network


A substrate treatment method is provided, which includes: a liquid film forming step of forming a liquid film of a treatment liquid on a front surface of a substrate; a hydrophobization liquid supplying step of supplying a hydrophobization liquid to a center portion of the front surface of the substrate for hydrophobizing the front surface of the substrate, while rotating the substrate; an inactivation suppressing step of suppressing inactivation of the supplied hydrophobization liquid on a peripheral edge portion of the front surface of the substrate simultaneously with the hydrophobization liquid supplying step; and a drying step of drying the substrate to which the hydrophobization liquid has been supplied.

1. Field of the Invention
The present invention relates to a substrate treatment method and a substrate treatment apparatus for treating a substrate. Examples of the substrate to be treated include semiconductor wafers, substrates for liquid crystal display devices, substrates for plasma display devices, substrates for FED (Field Emission Display) devices, substrates for optical disks, substrates for magnetic disks, substrates for magneto-optical disks, substrates for photo masks, ceramic substrates and substrates for solar cells.
2. Description of Related Art
In production processes for semiconductor devices, liquid crystal display devices and the like, a substrate treatment apparatus of a single substrate treatment type adapted to treat a single substrate at a time is often used for treating a front surface of a substrate with a treatment liquid. The substrate treatment apparatus of the single substrate treatment type includes a spin chuck which horizontally holds and rotates the substrate, and a nozzle which spouts the treatment liquid toward a center portion of the front surface of the substrate rotated by the spin chuck (see US2010/101497A1 and US2010/075504A1).
More specifically, a chemical liquid is supplied to the substrate, whereby the front surface of the substrate is treated with the chemical liquid. Then, chemical liquid adhering to the substrate is rinsed away from the substrate by supplying deionized water to the substrate. After the chemical liquid is rinsed away, IPA (isopropyl alcohol) having a lower boiling point than water is supplied to the front surface of the substrate, whereby deionized water adhering to the substrate is replaced with IPA. Thereafter, the substrate is rotated at a high speed, whereby IPA adhering to the substrate is removed from the substrate to dry the substrate.
In this method, however, a pattern formed on the front surface of the substrate is liable to collapse during the drying of the substrate. A conventionally known method for preventing the collapse of the pattern is to hydrophobize the front surface of the substrate prior to the drying of the substrate. In US2010/075504A1, for example, a silane coupling agent solution (liquid silane coupling agent, hereinafter referred to as "silylation agent") is supplied to the substrate to form a hydrophobic protection film on the front surface of the substrate, thereby hydrophobizing the front surface of the substrate.

Substrate treatment method and substrate treatment apparatus


A method of authenticating the identity of an item bearing or associated with a printed security marker, the method comprising:    a. printing the security marker with a pattern that encodes at least one of a unique product identifier, a batch identifier, and positional information about a portion of the marker;    b. scanning and storing an image of the security marker as printed, said image being taken at sufficiently high resolution to capture artifacts of the printing process;and authentication steps comprising:    c. imaging a portion of the marker at sufficiently high resolution to capture the artifacts, and    d. querying a data store by providing the image of the portion of the marker or a compressed or parameterized version of the image and data derived from the pattern.

It is known that many products are subjected to counterfeiting. It is estimated that as of 2006 counterfeit products may represent 7% or so of the articles for sale in certain industries, such as pharmaceutical, fashion and the computer industry. Attempts to overcome counterfeiting include holographic labels but these themselves may be faked and are expensive to produce.

Method of and system for authenticating an item

Hewlett-Packard Development Company, L. P.


An offset printing apparatus having a coated imaging drum for use with phase-change inks, wherein the imaging drum including a metal substrate, a conformable intermediate layer, and outer coating having an alkyd thermoset, and a heating member associated with the offset printing apparatus.

The present invention relates generally to an imaging apparatus and layers for components thereof, and for use in offset printing or ink jet printing apparatuses. The layers herein are useful for many purposes including layers for transfer components, including transfix or transfuse components, imaging components, and like components. More specifically, the present invention relates to layers comprising a thermoset material. The layers of the present invention may be useful in components used in combination with ink or dye materials. In embodiments, the layers can be used in combination with phase change inks such as solid inks.
Ink jet printing systems using intermediate transfer, transfix or transfuse members are well known, such as that described in U.S. Pat. No. 4,538,156. Generally, the printing or imaging member is employed in combination with a printhead. A final receiving surface or print medium is brought into contact with the imaging surface after the image has been placed thereon by the nozzles of the printhead. The image is then transferred and fixed to a final receiving surface.
More specifically, the phase-change ink imaging process begins by first applying a thin liquid, such as, for example, silicone oil, to an imaging member surface. The solid or hot melt ink is placed into a heated reservoir where it is maintained in a liquid state. This highly engineered ink is formulated to meet a number of constraints, including low viscosity at jetting temperatures, specific visco-elastic properties at component-to-media transfer temperatures, and high durability at room temperatures. Once within the printhead, the liquid ink flows through manifolds to be ejected from microscopic orifices through use of proprietary piezoelectric transducer (PZT) printhead technology. The duration and amplitude of the electrical pulse applied to the PZT is very accurately controlled so that a repeatable and precise pressure pulse can be applied to the ink, resulting in the proper volume, velocity and trajectory of the droplet. Several rows of jets, for example four rows, can be used, each one with a different color. The individual droplets of ink are jetted onto the liquid layer on the imaging member. The imaging member and liquid layer are held at a specified temperature such that the ink hardens to a ductile visco-elastic state.
After depositing the image, a print medium is heated by feeding it through a preheater and into a nip formed between the imaging member and a pressure member, either or both of which can also be heated. A high durometer synthetic pressure member is placed against the imaging member in order to develop a high-pressure nip. As the imaging member rotates, the heated print medium is pulled through the nip and is pressed against the deposited ink image with the help of a pressure member, thereby transferring the ink to the print medium. The pressure member compresses the print medium and ink together, spreads the ink droplets, and fuses the ink droplets to the print medium. Heat from the preheated print medium heats the ink in the nip, making the ink sufficiently soft and tacky to adhere to the print medium. When the print medium leaves the nip, stripper fingers or other like members, peel it from the printer member and direct it into a media exit path.
To optimize image resolution, the transferred ink drops should spread out to cover a predetermined area, but not so much that image resolution is compromised or lost. The ink drops should not melt during the transfer process. To optimize printed image durability, the ink drops should be pressed into the paper with sufficient pressure to prevent their inadvertent removal by abrasion. Finally, image transfer conditions should be such that nearly all the ink drops are transferred from the imaging member to the print medium. Therefore, it is desirable that the imaging member has the ability to transfer the image to the media sufficiently.
The imaging member is multi-functional. First, the ink jet printhead prints images on the imaging member, and thus, it is an imaging member. Second, after the images are printed on the imaging member, they can then transfixed or transfused to a final print medium. Therefore, the imaging member provides a transfix or transfuse function, in addition to an imaging function.
In order to ensure proper transfer and fusing of the ink off the imaging member to the print medium, certain nip temperature, pressure and compliance are required. Unlike laser printer imaging technology in which solid fills are produced by sheets of toner, the solid ink is placed on the imaging member one pixel at a time and the individual pixels must be spread out during the transfix process to achieve a uniform solid fill. Also, the secondary color pixels on the imaging member are physically taller than the primary color pixels because the secondary pixels are produced from two primary pixels. Therefore, compliance in the nip is required to conform around the secondary pixels and to allow the primary pixel neighbors to touch the media with enough pressure to spread and transfer. The correct amount of temperature, pressure and compliance is required to produce acceptable image quality.
Currently, the imaging member useful for solid inks or phase change inks comprises anodized aluminum. This member operates at about 57° C. to about 64° C. and can be used with a heater that preheats the print media prior to entering the nip. Otherwise, the imaging member may include a heater associated therewith. The heater may be associated anywhere on the offset printing apparatus. The current aluminum-imaging member has several drawbacks. A high nip load of up to about 770 pounds is needed for transfix or transfuse operations. Further, because of the high nip load, bulky mechanisms and supporting structures are needed, resulting in increased printer weight and cost. One example is that a fairly complex two-layer pressure roller is needed. In addition, the first copy out time is unacceptable because of the bulky weight. Moreover, low cohesive failure temperature is another drawback to use of an anodized aluminum drum.
Several coatings for the imaging member have been suggested. Examples are listed below.
U.S. Pat. No. 5,092,235 discloses a pressure fixing apparatus for ink jet inks having 1) outer shell of rigid, non-compliant material such as steel, or polymer such as acetal homopolymer or Nylon 6/6 and 2) an underlayer of elastomer material having a hardness of about 30 to 60, or about 50 to 60.
U.S. Pat. No. 5,195,430 discloses a pressure fixing apparatus for ink jet inks having 1) outer shell of rigid, non-compliant material such as steel, or polymer such as acetal homopolymer or Nylon 6/6 and 2) an underlayer of elastomer material having a hardness of about 30 to 60, or about 50 to 60, which can be polyurethane (VIBRATHANE, or REN:C:O-thane).
U.S. Pat. No. 5,389,958 discloses an intermediate transfer member/image receiving member having a surface of metal (aluminum, nickel, iron phosphate), elastomers (fluoroelastomers, perfluoroelastomers, silicone rubber, polybutadiene), plastics (polyphenylene sulfide), thermoplastics (polyethylene, polyamide (nylon), FEP), thermosets (metals, ceramics), and a pressure roller with elastomer surface.
U.S. Pat. No. 5,455,604 discloses a fixing mechanism and pressure wheels, wherein the pressure wheels can be comprised of a steel or plastic material such as DELRIN. Image-receiving drum 40 can be a rigid material such as aluminum or stainless steel with a thin shell mounted to the shaft, or plastic.
U.S. Pat. No. 5,502,476 teaches a pressure roller having a metallic core with elastomer coating such as silicones, urethanes, nitrites, or EPDM, and an intermediate transfer member surface of liquid, which can be water, fluorinated oils, glycol, surfactants, mineral oil, silicone oil, functional oils such as mercapto silicone oils or fluorinated silicone oils or the like, or combinations thereof.
U.S. Pat. No. 5,614,933 discloses an intermediate transfer member/image receiving member having a surface of metal (aluminum, nickel, iron phosphate), elastomers (fluoroelastomers, perfluoroelastomers, silicone rubber, polybutadiene), plastics (polyphenylene sulfide), thermoplastics (polyethylene, polyamide (nylon), FEP), thermosets (metals, ceramics), or polyphenylene sulfide loaded with PTFE, and a pressure roller with elastomer surface.
U.S. Pat. No. 5,790,160 discloses an intermediate transfer member/image receiving member having a surface of metal (aluminum, nickel, iron phosphate), elastomers (fluoroelastomers, perfluoroelastomers, silicone rubber, polybutadiene), plastics (polyphenylene sulfide), thermoplastics (polyethylene, polyamide (nylon), FEP), thermosets (metals, ceramics), or polyphenylene sulfide loaded with PTFE, and a pressure roller with elastomer surface.
U.S. Pat. No. 5,805,191 an intermediate transfer member/image receiving member having a surface of metal (aluminum, nickel, iron phosphate), elastomers (fluoroelastomers, perfluoroelastomers, silicone rubber, polybutadiene), plastics (polyphenylene sulfide), thermoplastics (polyethylene, polyamide (nylon), FEP), thermosets (metals, ceramics), or polyphenylene sulfide loaded with PTFE, and an outer liquid layer of liquid, which can be water, fluorinated oils, glycol, surfactants, mineral oil, silicone oil, functional oils such as mercapto silicone oils or fluorinated silicone oils or the like, or combinations thereof.
U.S. Pat. No. 5,808,645 discloses a transfer roller having a metallic core with elastomer covering of silicone, urethanes, nitriles, and EPDM.
U.S. Pat. No. 6,196,675 B1 discloses separate image transfer and fusing stations, wherein the fuser roller coatings can be silicones, urethanes, nitrites and EPDM.
U.S. Pat. No. 5,777,650 discloses a pressure roller having an elastomer sleeve, and an outer coating that can be metals, (aluminum, nickel, iron phosphate), elastomers (fluoroelastomers, perfluoroelastomers, silicone rubber, polybutadiene), plastics (polyphenylene sulfide with PTFE filler), thermoplastics (polyethylene, polyamide (nylon), FEP), thermosets (acetals, ceramics). Preferred is anodized aluminum.
In addition, many different types of outer coatings for transfer members, fuser members, and intermediate transfer members have been used in the electrostatographic arts using powder toner, but not with liquid inks or phase change inks. Several examples are listed herein.
U.S. Pat. No. 5,361,126 discloses an imaging apparatus including a transfer member including a heater and pressure-applying roller, wherein the transfer member includes a fabric substrate and an impurity-absorbent material as a top layer. The impurity-absorbing material can include a rubber elastomer material.
U.S. Pat. No. 5,337,129 discloses an intermediate transfer component comprising a substrate and a ceramer or grafted ceramer coating comprised of integral, interpenetrating networks of haloelastomer, silicon oxide, and optionally polyorganosiloxane.
U.S. Pat. No. 5,340,679 discloses an intermediate transfer component comprised of a substrate and thereover a coating comprised of a volume grafted elastomer, which is a substantially uniform integral interpenetrating network of a hybrid composition of a fluoroelastomer and a polyorganosiloxane.
U.S. Pat. No. 5,480,938 describes a low surface energy material comprising a volume grafted elastomer which is a substantially uniform integral interpenetrating network of a hybrid composition of a fluoroelastomer and a polyorganosiloxane, the volume graft having been formed by dehydrofluorination of fluoroelastomer by a nucleophilic dehydrofluorinating agent, followed by a hydrosilation reaction, addition of a hydrogen functionally terminated polyorganosiloxane and a hydrosilation reaction catalyst
U.S. Pat. No. 5,366,772 describes a fuser member comprising a supporting substrate, and a outer layer comprised of an integral interpenetrating hybrid polymeric network comprised of a haloelastomer, a coupling agent, a functional polyorganosiloxane and a crosslinking agent.
U.S. Pat. No. 5,456,987 discloses an intermediate transfer component comprising a substrate and a titamer or grafted titamer coating comprised of integral, interpenetrating networks of haloelastomer, titanium dioxide, and optionally polyorganosiloxane.
U.S. Pat. No. 5,848,327 discloses an electrode member positioned near the donor member used in hybrid scavengeless development, wherein the electrode members have a composite haloelastomer coating.
U.S. Pat. No. 5,576,818 discloses an intermediate toner transfer component including: (a) an electrically conductive substrate; (b) a conformable and electrically resistive layer comprised of a first polymeric material; and (c) a toner release layer comprised of a second polymeric material selected from the group consisting of a fluorosilicone and a substantially uniform integral interpenetrating network of a hybrid composition of a fluoroelastomer and a polyorganosiloxane, wherein the resistive layer is disposed between the substrate and the release layer.
U.S. Pat. No. 6,035,780 discloses a process for forming a layer on a component of an electrostatographic apparatus, including mixing a first fluoroelastomer and a polymeric siloxane containing free radical reactive functional groups, and forming a second mixture of the resulting product with a mixture of a second fluoroelastomer and a second polysiloxane compound.
U.S. Pat. No. 5,537,194 discloses an intermediate toner transfer member comprising: (a) a substrate; and (b) an outer layer comprised of a haloelastomer having pendant hydrocarbon chains covalently bonded to the backbone of the haloelastomer.
U.S. Pat. No. 5,753,307 discloses fluoroelastomer surfaces and a method for providing a fluoroelastomer surface on a supporting substrate which includes dissolving a fluoroelastomer; adding a dehydrofluorinating agent; adding an amino silane to form a resulting homogeneous fluoroelastomer solution; and subsequently providing at least one layer of the homogeneous fluoroelastomer solution to the supporting substrate.
U.S. Pat. No. 5,840,796 describes polymer nanocomposites including a mica-type layered silicate and a fluoroelastomer, wherein the nanocomposite has a structure selected from the group consisting of an exfoliated structure and an intercalated structure.
U.S. Pat. No. 5,846,643 describes a fuser member for use in an electrostatographic printing machine, wherein the fuser member has at least one layer of an elastomer composition comprising a silicone elastomer and a mica-type layered silicate, the silicone elastomer and mica-type layered silicate form a delaminated nanocomposite with silicone elastomer inserted among the delaminated layers of the mica-type layered silicate.
It is desired to provide a multi-functional imaging member for use with phase change ink printing machines, which has the ability to receive an image, and either transfer or transfer and fuse the image to a print medium. It is desired that the imaging member when having heat associated therewith, be thermally stable for conduction for fusing or fixing. It is further desired that the imaging member have a relatively low nip load, in order to decrease the weight and cost of the printing machine, and in order to provide an acceptable first copy out time.

Phase change ink imaging component with thermoset layer


A laser energy delivery tip element for applying laser energy received through an optical fiber has a foraminous element disposed to receive laser light energy emitted from the optical fiber to be heated thereby. The heated portion of the foraminous element is disposed to be contacted to a tissue so as to heat and vaporize a portion of the tissue to form an incision. Suction is applied to the laser energy tip element to immediately draw away from the incision site any gaseous and/or vaporized substances generated during its use to apply heat, the sucked-away substances passing through openings in the foraminous element and around and outside the optical fiber, to thereby facilitate viewing of the incision-making activity. In another aspect of the invention, a separately controlled electrical voltage is applied through the foraminous element to generate a relatively high current over a small area of the patient's incised tissue to, for example, cauterize a cut blood vessel, the current passing through a relatively large surface area of the patient to an electrically conducting support element. A surgeon utilizing such a laser energy tip element with separate control over a cauterizing current can thus employ a single hand-held surgical tool to cut through tissues, cauterize any cut blood vessels, and simultaneously remove any gaseous and/or vaporized substances generated by either the laser-cutting or electro-cautery actions.

Many laser surgical systems are known in which a hand-held surgical device is applied by a surgeon to deliver laser energy to tissues at such a rate that the affected tissues disintegrate into gaseous and/or vaporized substances. Such a delivery of laser energy, for example to effect localized incisions, generally requires a relatively small tip element shaped and oriented to enable the surgeon to see clearly where the laser energy is being delivered. It is inevitable in surgery that blood vessels are occasionally incised, whether the surgeon is applying a scalpel or a laser surgical tool. To prevent undesirable bleeding from the cut blood vessel, the surgeon or an assistant typically cauterizes the incised blood vessel as quickly as possible. Such cauterization may require separate tools, but certain versatile laser energy delivering tip elements are also known which enable a user to selectively apply the same tool to effect either incisions or cauterization of incised vessels
Regardless of how good the local ventilation is in an operating room, a surgeon performing precise incision/cauterization with a laser surgical tool must contend with the presence of unpleasant odors, smoke and the gaseous and/or vaporized byproducts of the heated tissues every time he or she applies laser energy. Surgeons and their operating room assistants would experience less stress and be able to function more efficiently if the gaseous and/or vaporized substances produced during surgery and cauterization were immediately removed from the site where they are produced.
A need, therefore, clearly exists for an improved laser energy delivery tip element which enables a user to remove gaseous and/or vaporized substances immediately upon their production during surgery and cauterization.
Furthermore, even though versatile laser energy delivery tip elements are known which are useful for both incision making and for cauterization, to simplify the surgeon's task in operating the hand-held laser surgical tool, it is also highly desirable to provide the surgeon with a separately operated cauterization system in which controlled amounts of heat can be selectively delivered by the incision-making tip element itself without the need for separate tools or additional hand-operated actuation elements.
The present invention, as described more fully hereinbelow and as illustrated in its essentials in the accompanying drawing figures, is intended to meet both of these needs, i.e., to immediately remove gaseous and/or vaporized substances from the surgical site and, with the same tip element, to enable the surgeon to selectively deliver controlled amounts of energy to effect cauterization by a foot-actuated control.

Laser energy delivery tip element with throughflow of vaporized materials


Facial recognition-based authentication comprises obtaining a first image of a target object, updating projection information associated with a display by a display device, obtaining a second image of the target object, the second image being an image of the target object after the projection information is updated, obtaining an image difference data based at least in part on the first image and the second image, and determining whether the target object is a virtual object based at least in part on the image difference data.

Biometrics is a way of authenticating personal identities by combining computers, optical, acoustical, and biological sensors, the principles of biostatistics, and other high-tech methods and using the inherent physiological characteristics (e.g., fingerprints, voice prints, faces, irises, etc.) of the human body as well as behavioral characteristics (e.g., handwriting, voice, gait, etc.) to identify individuals. Facial recognition technology has the advantages over other biometrics of being accurate, non-invasive, and in real time. Therefore, it is widely applied in various sectors of society, such as video monitoring, facial recognition-based attendance checking, and identity authentication systems.
In the field of identity authentication, particularly in the field of facial recognition-based identity authentication, the related art generally authenticates identities according to the following two techniques:
In the first technique, a facial image recognition-based identity authentication system carries out recognition and authentication by using a camera to capture facial images of users. In the facial recognition process, the system extracts characteristic information about the facial images. However, a photograph of a person and the facial images acquired by a video camera have almost the same characteristics. Thus, it is possible to simulate the effects of an actual person and cheat the authentication system by subjecting the photograph of a face to rotation, flipping, bending, and other such operations in front of the image-capturing device. Therefore, a facial image recognition-based identity authentication system is vulnerable to attacks by photographs of legitimate users and three-dimensional models of legitimate users.
In the second technique, in a facial image recognition-based identity authentication system, a human face within an image frame undergoes facial recognition, characteristic point extraction, facial characteristic point comparison, action recognition, etc. A living, real person is assessed primarily using the forms of facial expressive activity. The user is prompted to perform one or more actions (such as nodding or shaking the head, eye-blinking, or opening the mouth), and the system receives the corresponding actions performed by the user. The person's actions are computed and analyzed using the consecutive images that were taken. Specifically, real-time images are shot of a user with a video camera in order to acquire facial images. Representative characteristic points are extracted from the facial images, and these points include, but are not limited to, the nose, the eyebrows, the mouth, and other such characteristics. Methods such as rule-based methods or machine learning are then applied to the consecutive changes in the characteristic points of the consecutive, multi-frame images so as to assess whether there is a certain action (including, but not limited to: nodding or shaking the head, eye-blinking, or opening the mouth). Thereupon, the system assesses the correctness of the user's action and thus determines whether the real-time images correspond to a real person. Such a facial image recognition-based identity authentication system is subject to the following three forms of attack:
1. Video playback attack: actions are simulated by using video images of appropriate actions recorded in advance, and in this way the facial live recognition system is attacked.
2. Consecutive picture attack: actions are simulated by playing consecutive image slides, and in this way the facial live recognition system is attacked.
3. Facial action software simulation attack: a video playback attack and facial action software simulation attack acquire photographs of a legitimate user. The images of head-nodding, shaking, eye-blinking, and other such actions are synthesized through software simulation, and in this way the facial live recognition system is attacked.
An effective solution is needed to address the problem because existing live recognition-based authentication systems are still vulnerable to video or image attacks in which illegitimate users make use of the simulated actions of legitimate users described above.


An improved 2-bit boundary scan test circuit capable of applying boundary scan test vectors to the input of the core logic of a circuit, using a multiplexer for selectively coupling the output of a boundary scan register to the input of a boundary scan register or to the input of the core logic, and a selection circuit for controlling the multiplexer to enable the coupling when test vectors are required to be applied to the core.

As integrated circuits become more complex, it becomes increasingly necessary to implement thorough testing for verifying functionality and conformance to specifications. At the same time the shrinking size of integrated circuits as well as the accelerating speed requirements of devices have propelled the development of smaller and faster testing methods. Various standards bodies have also been involved in developing test standards in an effort towards promoting standardization of test methods. To this end a "boundary-scan" testing specification was proposed and developed by the Joint Test Action Group (JTAG) which was later standardized as the IEEE standards 1149.1 specification. This boundary-scan test architecture offers the capability to test components efficiently whether embedded in assembled printed circuit board assemblies or in the form of integrated circuit devices.
The Boundary Scan Test architecture is capable of testing pin connections without using physical test probes. It is also capable of capturing functional data while a device is in normal operation. The boundary scan process can force signals onto pins, or capture data from pin or core logic signals. Captured test data is serially shifted into special boundary scan cells from where it can be serially shifted out and compared to expected results externally.
Boundary scan register cells are placed such that the state of each digital system pin can be controlled or observed using the boundary scan register. These cells may also allow the state of the system logic inputs and outputs to be controlled and observed respectively.
While the implementation of conventional IEEE 1149.1 compliant interfaces within components, such as integrated circuit chips, facilitates higher quality, low cost testing without the need for disclosure of the internal circuitry of the components under test, these benefits come at the expense of performance due to the signal path delay associated with boundary scan cells. Because of the performance penalty associated with conventional IEEE 1149.1-compliant boundary scan cells manufacturers have resisted compliance with the IEEE 1149.1 standard.
U.S. Pat. No. 6,266,793, proposes a method for boundary scanning with increased testability by adding one extra signal to the standard methods, so that input buffers and output buffers are also testable in a two bit bi-directional boundary scan cell. However this method can not be implemented with the standard "INTEST" instruction defined by IEEE standard 1149.1.


‘Orange Storm’ is a new quince plant particularly distinguished by a medium-sized, upright, multi-stemmed, fruitless shrub, large, double-flowers with orange petals, and thornless stems, is disclosed.

The present invention comprises a new and distinct cultivar of flowering quince, botanically known as Chaenomeles speciosa, and hereinafter referred to by the cultivar name 'Orange Storm'. This new flowering quince was developed through a breeding program at North Carolina State University, Mills River, N.C. 'Orange Storm' is an F1 hybrid between the female parent, Chaenomeles speciosa 'Spitfire' (unpatented) and the male parent, Chaenomeles speciosa 'Dragons Blood' (unpatented). The first asexual propagation of 'Orange Storm' was carried out in June 2003 by rooting stem cuttings at the North Carolina State University, Mountain Horticultural Crops Research Station, Mills River, N.C. and has been asexually reproduced repeatedly by vegetative cuttings in North Carolina over a five year period.
'Orange Storm' roots readily from softwood cuttings treated with a basal dip of 5,000 ppm indole butyric acid (potassium salt) in water. 'Orange Storm' has been found to retain its distinctive characteristics through successive asexual propagations.
Plant Breeder's Rights for this cultivar have not been applied for. 'Orange Storm' has not been made publicly available more than one year prior to the filing date of this application.

Flowering quince plant named ‘Orange Storm’


Methods for dicing a wafer is presented. The method includes providing a wafer having first and second major surfaces. The wafer is prepared with a plurality of dies on main device regions and are spaced apart from each other by dicing channels on the first major surface of the wafer. A film is provided over first or second major surface of the wafer. The film covers at least areas corresponding to the main device regions. The method also includes using the film as an etch mask and plasma etching the wafer through exposed semiconductor material of the wafer to form gaps to separate the plurality of dies on the wafer into a plurality of individual dies.

Singulation process, also known as dicing, is generally performed to separate a plurality of chips formed on a wafer. Various singulation techniques may be used to separate the plurality of chips formed on the wafer into individual chips for packaging. One of the common techniques used is mechanical sawing. In a mechanical sawing process, a diamond saw rotating at high speed cuts the wafer along saw streets or dicing channels to separate the chips from each other. However, crack or chipping tends to occur in each chip due to mechanical stress caused by the blade. Furthermore, it is very time consuming when mechanical sawing process is used to separate the chips from the entire wafer.
In an effort to mitigate the problems above, a plasma etch process has been proposed to be used in singulating or dicing a wafer. However, we have observed that conventional plasma etch process may not effectively separate the dies from the wafer and the singulated dies may also suffer contamination caused by the plasma etch process. Conventional plasma etch process may also result in rough or uneven lateral surfaces or sidewalls of the singulated die.
In view of the foregoing, there is a desire to provide reliable, simplified, efficient and cost effective methods for singulating semiconductor chips or dies from a wafer.

Methods for singulating semiconductor wafer


An isolation assembly for use with a vehicle. The isolation assembly includes a collar having a continuous wall. A carriage is disposed within a cavity of the wall and is displaceable relative to the collar. A fastener supports the carriage relative to a frame portion of the vehicle. An insulator is disposed between the carriage and the wall of the collar for coupling the carriage to the collar and for isolating the carriage and the fastener from the collar. The insulator has a first portion and a plurality of second portions. The first portion encapsulates one of the second end surface and the peripheral surface of the carriage. The second portions are movable relative to the first portion about a living hinge to encapsulate the other of the peripheral surface and second end surface of the carriage such that the carriage is adequately isolated from the collar.

1. Field of the Invention
The subject invention relates to a isolation assembly and bushings for a vehicle having an insulator for isolating vibrational movement between a frame portion and a vehicle body, and controlling the total movement at the same time.
2. Description of Related Art
Isolation assemblies for vehicles are well known in the art. Typically, the isolation assemblies include a collar mounted to a frame portion and an insulator for isolating movements of the frame portion from a vehicle body. The insulators are typically formed of an elastomeric material such as rubber or micro-cellular polyurethane (MPU). Many of the insulators are designed to isolate vibrational movement in only one direction, such as vertical movement or lateral movement. The prior art therefore uses multiple insulators in conjunction with each other to isolate multiple movements. It would be desirable to simplify the insulators and form the insulators of a single unitary component that could isolate multiple movements. Further, it would be desirable to form such a unitary insulator of a MPU material. As is known in the art, forming three-dimensional components made of MPU material has been found to be a difficult and expensive task.

Isolation assembly for a vehicle suspension component


The present invention is a seaming iron holder as used in the carpet installation industry. The invention totes the seaming iron and can be used during the seaming process. The holder is preferably made of a material which is flexible enough to lay flat, defining a surface above which the seaming is place intermittently during seaming, while also allowing said surface to be wrapped up around the seaming iron. Said surface then joining together at predetermined edges and defining a holder to tote said seaming iron from job to job.

1. Field of the Invention
The present invention relates to a holding device to be used in the field of carpet installation. More specifically, said holding device to be used to hold a seaming iron for; transporting to job; holding iron while not in use; holding iron while hot and in usage; and, holding iron after usage while cooling down.
2. Description of the Prior Art
The use of bags to hold tools has been known for many years. Such bags have been used to transport, organize, protect, and otherwise tote tools to and from specific jobs or work areas. To date no bags have been invented which are effective in transporting a seaming iron as used in the carpeting industry. The seaming iron presents specific difficulties in transporting, which other tools do not present. These specific problems include, the size of the seaming iron, the material that the seaming iron comes in contact with, and the extreme temperature that the seaming iron operates at.
In the past, tool bags or holders, were primarily concerned with fitting the tool in a convenient carrying compartment. However, such bags lacked in the ability to efficiently and conveniently carry a seaming iron as used in the carpeting industry.
A seaming iron is bulky and has a permanently attached power cord that allows it to be heated. The seaming iron's size and attached power cord do not allow convenient storage in a conventional tool box or tool bag. Therefore, it is necessary to design a tool bag specifically planned to accommodate a seaming iron.
Moreover, the seaming iron, as used in the carpeting industry, comes into continual contact with adhesive. The adhesive remains on the seaming iron, which causes problems when placing the seaming iron in a bag or holder with other tools. Therefore, it is also advantageous to have a bag or holder that holds only the seaming iron. This eliminates prior tool bags or holders as a good source for holding seaming irons because they are designed to hold multiple tools. None of the prior art in the tool bag or holder fields addresses a bag or holder specifically designed to hold only a seaming iron.
In addition, the contact with an adhesive makes the seaming iron difficult to temporarily store while carpet seaming is taking place. In other words, when a carpet installation technician is making a seam he may have to place the seaming iron down from time to time in order to perform other tasks associated with the installation of the carpet. If a bag or holder was designed so that the seaming iron could conveniently be placed in or on the bag temporarily while in use the bag would be very advantageous. However, no such bag or holder presently exist. Therefore, carpet installation technicians currently place the seaming iron on cardboard temporarily while in use.
Past bags or holders have been constructed of materials that are not sufficient in carrying a tool within extremely hot surface. Many times the seaming iron is still very hot when it is time to leave a job site or carpet seaming has been completed. Therefore, the prior materials, such as plastic and metal would either melt or the tool box would become extremely hot if the seaming iron came in direct contact with the tool box wall. Therefore, none of the prior tool bags or tool holders are adequate for carrying a seaming iron.
There are no patents addressing a device for holding a carpet installation seaming iron. In related areas there are various bags and tool holders, however these patents do not and cannot resolve some of the problems addressed by the present invention. Even thought, the present invention addresses some of the same difficulties experienced in the art as does the prior patents, it does so in a new an inventive way. Moreover, the present invention embodies advantages never found or contemplated by the prior art which are described in greater detail below.


Provided is an erbium-doped fiber amplifier reducing transient phenomena of a signal-to-noise ratio and a bit error rate in a dynamic wavelength division multiplexing system and an amplifying method using the erbium-doped fiber amplifier. The erbium-doped fiber amplifier includes: a polarization scrambler modulating a polarization state of an input signal to remove a polarization of the input signal; an amplifier amplifying the input signal from which the polarization has been removed; a detector reading powers of input and output signals of the amplifier; and an automatic gain controller controlling currents of the pump LDs according to the powers of the input and output signals read by the detector 1630 to maintain the gain even if the power of input signal changes.

1. Field of the Invention
The present invention relates to an erbium-doped fiber amplifier (EDFA) for reducing transient phenomena of an optical signal-to-nose ratio (SNR) and a bit error rate (BER) in a dynamic wavelength division multiplexing (WDM) system and an amplifying method thereof.
2. Description of the Related Art
WDM systems have been evolved into intelligent dynamic WDM systems attributed to efficiency, flexibility, and reliability. In a case where obstacles are put in the way of arbitrary paths of dynamic WDM systems into which optical add drop multiplexer (OADM) and optical cross connect (OXC) are integrated, paths of channels are changed to re-allocate channels or to insert new channels. Thus, the number of input channels and a total input power of an EDFA vary depending on states of nodes and paths.
A sudden variation of the number of input channels affects a gain of the EDFA and thus affects powers, OSNRs, and BERs of remaining channels. As a result, the performance of the EDFA may be deteriorated. To solve this problem, there is suggested a technique for adjusting the currents of pump LDs depending on the input power of an EDFA to keep up a gain. However, the technique cannot entirely remove transient phenomena of the OSNR and the BER.

Erbium doped fiber amplifier for reducing transient phenomena of OSNR and BER in dynamic WDM system and amplifying method thereof

Electronics and Telecommunications Research Institute


The invention relates to a roller tappet (1) for a piston pump, in particular for a high-pressure fuel pump, for supporting a pump piston (2) which can move in a reciprocating motion on a cam (3) or eccentric of a drive shaft (4), comprising a tappet body (5) with an end-side recess (6) and two radial bores (7) which lie diametrically opposite one another at the recess (6) and receive a pin (8), on which a roller (10) is rotatably mounted directly or indirectly via a bearing bush (9), wherein at least one radially or obliquely running feed bore (12) is configured in the tappet body (5) in order to supply a lubricating medium to a radial bearing gap (11) which is configured between the roller (10) and the pin (8) or between the roller (10) and the bearing bush (9), which feed bore (12) opens into the recess (6) in the region of an axial bearing gap (13) between the roller (10) and the tappet body (5). According to the invention, the feed bore (12) is connected to an arcuately running lubricating duct (14) which is configured in a surface (15) of the tappet body (5), which surface (15) delimits the axial bearing gap (13). Furthermore, the invention relates to a piston pump comprising a roller tappet (1) of said type.

The invention relates to a roller tappet for a piston pump, in particular a high-pressure fuel pump. The roller tappet serves for supporting a pump piston of the piston pump on a cam or eccentric of a drive shaft. The invention further relates to a piston pump, in particular a high-pressure fuel pump for supplying an internal combustion engine with fuel, having such a roller tappet.
A roller tappet of the aforementioned type can be found, for example, in German laid-open specification DE 10 2012 223 413 A1. The known roller tappet has a tappet part which can be supported on a drive device via a roller which is rotatably mounted in the tappet part. In order to minimize the wear in the bearing region and in this way to increase the service life of the pump, there is proposed an improved lubrication of the bearing region via at least one through-passage, which is provided in the tappet part, and a groove. The through-passage connects an inner region of the tappet part, in which the bearing of the roller is arranged, to the outer shell of the tappet part. The through-passage is arranged in such a way that it opens into the groove. Here, the groove is provided in a circumferential region of the tappet part in the inner shell thereof, said circumferential region adjoining an end side of the roller that points in the direction of its axis of rotation, and extends in the direction of the longitudinal axis of the roller tappet. Accordingly, the lubricant which passes into the inner region of the tappet part via the through-passage is primarily fed to an axial bearing gap between the roller and the inner shell of the tappet part.
Taking the above-cited prior art as the starting point, the object on which the present invention is based is to further improve the lubrication of a rotatably mounted roller of a roller tappet for a piston pump, in particular for a high-pressure fuel pump. In particular, lubrication is intended to be ensured under lateral run-on conditions, that is to say in the case of a force component which acts on the roller and which presses the roller axially against the tappet body. This is regularly the case when there is slanting of the cam with respect to the roller tappet, the slanting being attributable to manufacturing and/or assembly tolerances.

Roller tappet for a piston pump, piston pump


An enhanced game of hide and seek where the game participant searches for a hidden object having a transmitter device inside or attached to the object. The game participant utilizes a seeker unit that determines the distance between the object and the participant before and after the participant moves. The seeker unit uses that information to determine whether the participant is moving closer to or further away from the object and then communicates useful information to the game participant to assist the participant in finding the object. The participant interacts with the seeker unit to use and develop his or her logical reasoning skills in searching for the hidden object. The object can be a doll, stuffed animal, toy or any variety of other objects suitable for hiding and fun for finding.

A. Field of the Invention
The field of the present invention relates generally to children""s toys and games. More particularly the present invention relates to those games that are enhanced versions of the game of hide and seek. Even more particularly, the present invention relates to such games that utilize an object, such as a doll, stuffed animal, toy or other such object, that is hidden and which communicates its relative position to the person seeking the toy or object.
B. Background
The game of hide and seek has likely been around for a very long time. In fact, most people have played the game of hide and seek, either when they were a child or as an adult in conjunction with children. The standard game of hide and seek requires two or more participants with one participant being the seeker and the other participant(s) hiding so the seeker cannot easily find them. Typically, the seeker will hide his or her eyes to give the other participants a chance to hide. Once the allotted time has gone by for the others to hide, the seeker will begin seeking out the other participants. When the seeker is able to find and touch another participant, that participant becomes the next seeker and the game is repeated. There are numerous variations of the standard game where rules are made to increase or decrease the difficultly of play. One such variation on the standard hide and seek game is where one person (often a parent or older sibling) hides an object, such as a doll, stuffed animal or toy, so that another person (i.e., a child) can try to find the object. Typically, the person who hid the object will watch the person seeking the object and give clues as to the location of the hidden object, usually in reference relative to the seeker""s position and often in the vague form of whether the seeker is cold, warm or hot. Based on the clues, the seeking participant uses his or her logic skills to determine the object""s location.
One limitation of the standard game of hide and seek is that the game requires at least two persons (whether both are children or one is a parent or other adult) to participate, one as the seeker and one who hides. If only two participants are playing the standard hide and seek game, the one hiding is unable to give any clues as to his or her position without the sound of the clues, as opposed to the words themselves, giving away the hider""s location. In fact, with only two people playing hide and seek, the modified game (i.e., where an object is hidden and clues are given) is usually the game of choice for younger children due to their inability to find a well-hidden hider. Naturally, without a second person to do the hiding or seeking, either the standard or modified game of hide and seek cannot be played. With young children at home, often it is the parent who plays as the other participant. Even well meaning parents, however, are generally limited on the amount of time and patience they have available for playing such a game. Usually, the parent will tire of the game before the child does.
For traditional hide and seek games, the number of players to make the game fun generally depends on the size of area where the game is played and the number of places to hide. If the area is small with not too many places to hide, the game is generally more fun with fewer players. Otherwise, the game is not very much fun because it is too easy to find the hidden participants. In contrast, if the playing area is large with many places to hide, the game is generally much more fun with more participants. This is particularly true for a game being played in a large area with only a young seeker and a single hidden child, which would be too difficult to be fun.
A number of modern variations of the game of hide and seek have been developed and/or patented to incorporate modern electronic technology into devices to be used to play the game. One such game is xe2x80x9cHide ""n Sneakxe2x80x9d that utilizes a seeker unit and one or more xe2x80x9chiderxe2x80x9d units that are worn by the person seeking and the person hiding, respectively. When the seeker comes within a preset distance of the hider, the seeker unit picks up a signal transmitted by the hider unit to let the seeker know he or she is close to a person hiding. As the seeker gets closer to the hidden person, the seeker unit uses a variety of lights and/or sounds to indicate the relative closeness to the person hiding. As such, the game basically replaces visual seeking with sonar-type seeking. Another game is called xe2x80x9cHide ""n Squeakxe2x80x9d by Milton Bradley. In this game, an object such as a kitten or puppy with a transmitter inside is hidden. The object transmits a xe2x80x9ccutexe2x80x9d sound every few seconds for the child to follow. Skill level is adjusted by setting how often the object transmits the sound. Other than listening for the sound of the object, there is no other interaction between the seeker and the object. Another available game utilizes the Freddie Fish(copyright) character in a toy format, treasures for hiding and a tracking device. The character toy emits different phrases to guide the seekers to the hidden treasures. Other than listening to the phrases emitted by the toy, no other interaction takes place between the child and the toy. One common aspect of the above-mentioned games is that none of them provide much of an opportunity for the seeker to use and develop his or her logic skills. The interaction between the seeker and the hidden objects is generally very minimal and the seeker merely has to follow the sound of the devices to determine where they are located.
U.S. Pat. No. 4,961,575 to Perry discloses a hide and seek game that utilizes a radio receiver for the seeker and radio transmitters for those who are hiding. Each transmitter emits a radio signal that is picked-up by the receiver, which measures the field strength of the cumulative signal field generated by the transmitters. The receivers and transmitters can be configured in the form of a wrist watch sized device to be worn on the players"" person. The transmitters also include a feature to allow them to be temporarily turned off. This game, like the traditional game of hide and seek, requires two or more participants. In addition, the game devices appear to be less suitable for very young children due to the need to understand the effect of multiple radio signals. A similar type of game is disclosed in U.S. Pat. No. 5,942,969 to Wicks. This patent describes a treasure hunt type of game that utilizes pagers and a wireless paging system. The participants decipher clues to determine which location they need to go to next. Once there, they signal the base pager station that they are there and then they receive the next clue. This game requires interaction with a wireless paging system and is not configured for young children.
While the foregoing describes certain hide and seek and related games that are available or have been previously patented, none of the games provide a hide and seek game that can be played by a single participant (once the object is hidden) and which interacts with the participant. The ability to provide a participant, particularly young children, with a hide and seek game that both entertains and helps develop the participant""s thinking abilities would be beneficial to most parents. As is well known, a child playing by his or herself or even with other children often becomes bored and wants a parent to interact in a game with the child or children. The level of interaction desired by the child or children often is not possible due to work or other activities engaged in by the parent. Although the parent wants to keep the child or children busy, he or she desires to have something that interacts with the child and makes the child use and further develop thinking skills. What is needed, therefore, is a hide and seek game and interactive apparatus for use with the game that can be played by one or more young children and which provides a level of interaction with the child or children that encourages the child to utilize his or her deductive reasoning skills.
The enhance hide and seek game and method of playing the game of the present invention provides the benefits and solves the problems identified above. That is to say, the present invention discloses a new and useful hide and seek game and method that can be played by one or more participants, such as young children, and which interacts with the participants playing the game to challenge them to utilize their deductive reasoning skills to find a hidden object. The present invention is easy to play and is suitable for use with a variety of commonly available objects as,the object to be hidden and utilizes commonly available technology. The preferred embodiment of the present invention is set forth in the discussion below. However, it should be understood that the principles set forth below with regard to the present invention are equally adaptable to other configurations.
In its preferred configuration, the enhanced hide and seek game of the present invention utilizes an object to be hidden and a seeker unit to be worn or held by the participant seeking the hidden object. The object to be hidden has a transmitter unit either built into the object, attached to the object or otherwise associated with the object. In the preferred embodiment of playing the game the transmitter unit associated with the object is activated and the object is hidden so the game participant will have to find it. The seeker unit is activated and communicates an initialization message (such as laughing, steps running away or the like) to the game participant. The microprocessor in the seeker unit then determines a first distance between the participant and the object based on the first position of the participant. After the participant moves, he or she can initiate a position request by speaking into the seeker unit or pushing a button, flipping a switch or otherwise activating a device on the seeker unit to cause it to determine a second distance, based on the participant""s second position, between the seeker unit and the transmitter unit. The microprocessor in the seeker unit compares the second distance to the first distance to determine a relative change in distance and whether the second distance is greater or less than the first distance. Based on that determination, the seeker unit communicates a game message to the game participant regarding the change in distance (i.e., whether he or she is getting closer or further away from the object). The participant then moves again and repeats the procedure for the next position he or she desires to check until the object is found. When the participant gets very close to the object, the seeker unit can communicate an end message (such as xe2x80x9cyou""ve found mexe2x80x9d or the like) to indicate that the participant has found the object.
In the preferred embodiment of the game of the present invention, the game comprises an object capable of being hidden, a transmitter unit associated with the object and a seeker unit associated with the game participant. The transmitter unit is configured to transmit a signal generally outward from the object such that it can be received by the receiver in the seeker unit. The seeker unit has a microprocessor suitable for determining a relative first distance between the seeker unit (the participant) and the object based on the signal strength of the signal from the transmitter. The microprocessor in the seeker unit also determines the relative second distance between the seeker unit and the object and the relative change in distance between the first distance and the second distance to determine if the participant is generally moving closer to the object or further away from it. The seeker unit also has a speaker for transmitting one or more messages to the game participant, such as an initialization message at the beginning of the game, various game messages during the game to encourage or help the participant find the object and an end message at the end of the game for when the participant finds or is very near the object. In the preferred embodiment, the seeker unit has a voice activated sensor to initiate the distance determination and/or messages. Alternatively, a push button, switch or similar device can be used to activate this procedure.
Accordingly, the primary objective of the present invention is to provide a hide and seek game and apparatus for use therewith having the features generally described above and more specifically described below in the detailed description of the preferred embodiments. It is also an important objective of the present invention to provide a hide and seek game and apparatus that utilizes a doll, toy or other object that can be hidden and then communicates with the seeking child. Yet another important object of the present invention is to provide a method of playing a hide and seek game that can be easily played by one or more participants as the seeker or seekers and which includes an object that interacts with the seeker or seekers to challenge them to find the hidden object. Another object of the present invention is to provide an enhanced hide and seek game and apparatuses that can determine the seeker""s relative position to a hidden object and provide clues as to the location of the object. The above and other objectives of the present invention will be explained in greater detail by reference to the attached figures and the description of the preferred embodiment which follows.

Enhanced hide and seek game and method of playing game


A multi-chip semiconductor package with a heat dissipating structure is proposed, in which a chip receiving cavity and an opening respectively formed in the heat dissipating structure and a chip carrier, are used to accommodate semiconductor chips therein with the chips being in direct contact with the heat dissipating structure, allowing heat generated by the chips to be rapidly dissipated through the heat dissipating structure. With the provision of through holes for interconnecting the chip receiving cavity and opening, gold wires pass the through holes and electrically connect the chips to the chip carrier. Such a structure with chips embedded in the chip receiving cavity and opening makes internal elements to be more compactly arranged in the semiconductor package, which is preferable in response to profile miniaturization of electronic product development.

The present invention relates to semiconductor packages, and more particularly, to a multi-chip semiconductor package with a heat dissipating structure having a chip receiving cavity, so as to improve overall heat dissipating efficiency and miniaturize the profile of the semiconductor package.
With the continuing development of the packaging technology, semiconductor devices become available with various forms of packages. In particular, BGA (ball grid array) semiconductor packages having high density of input/output (I/O) connections and the self-alignment function become a main stream of products suitably to be used in electronic devices due to preferable characteristics of high memory capacity, high processing speed and low profile in appearance.
In order to achieve high functionality and performances of electronic products, besides the foregoing preferably characteristics of the BGA semiconductor packages for use in the electronic products, it is greatly critical to increase the layout density of semiconductor devices on a main board or to enhance the circuit integration of semiconductor chips encapsulated in the semiconductor devices. However, since the increased layout of the semiconductor devices leads to enlargement in usage area of the main board, it is not favorable in response to a low profile trend of electronic product development. As for the integration enhancement of the semiconductor chips, it may be restricted in extent by the current technology, and also undesirably causes increase in packaging costs. Therefore, an effective solution is to mount two or more chips in a single packaging device with multiply provision of integrated circuit density, memory capacity and processing speed.
A conventional stacked-chip or multi-chip-module (MCM) semiconductor package is made by firstly mounting multiple chips on a chip carrier and subsequently performing an encapsulating process. FIGS. 1A and 1B illustrate cross-sectional views of the stacked-chip semiconductor package and the multi-chip-module semiconductor package, respectively. As shown in the drawings, the semiconductor package 1 includes a chip carrier 10 such as a substrate or a tape, for mounting a plurality of semiconductor chips 11 with different dimensions thereon; a plurality of conductive elements 12 such as gold wires or solder bumps for electrically connecting the chips 11 to the chip carrier 10; and an encapsulant 13 for encapsulating the chips 11. The stacked-chip or MCM semiconductor package 1 is therefore characterized in electrically bonding the chips 11 of different dimensions onto the chip carrier 10 in a stack or flip-chip manner to be subsequently encapsulated by the encapsulant 13. However, such a multi-chip semiconductor package 1 is dimensionally higher than normal, and occupies more area as mounted on an external printed circuit board; this is not ideal for the low profile development of electronic products.
In addition, a semiconductor package having multiple chips is also provided with high density of electronic elements and electronic circuits, and thus a large amount of heat would be generated in operation of the multi-chip semiconductor package. In this case, if the heat cannot be dissipated effectively and rapidly, it would seriously damage the functionality and lifetime of the chips. Therefore, a BGA package provided with a heat spreader is accordingly developed. U.S. Pat. No. 5,397,921 entitled xe2x80x9cTAB GRID ARRAYxe2x80x9d discloses a cavity down BGA semiconductor package for improving heat dissipating efficiency and electrical functions thereof Referring to FIG. 2, such a semiconductor package 1xe2x80x2 includes a substrate 10xe2x80x2 formed at a central position with an opening 102 dimensionally larger than a semiconductor chip; a heat spreader 14 mounted on the substrate 10xe2x80x2, and formed with a downwardly-opened chip receiving cavity 142 corresponding in position to the opening 102 of the substrate 10xe2x80x2; a semiconductor chip 11xe2x80x2 accommodated in the chip receiving cavity 142; a plurality of conductive elements 12xe2x80x2 for electrically connecting the chip 11xe2x80x2 to the substrate 10xe2x80x2; a plurality of solder balls 15; and an encapsulant 13xe2x80x2 for encapsulating the chip 11xe2x80x2. This semiconductor package 1xe2x80x2 is different from a normal BGA package by disposing the chip 11xe2x80x2 with its circuit surface (not shown) facing downwardly in the chip receiving cavity 142, and electrically connecting the circuit surface of the chip 11xe2x80x2 directly to the substrate 10xe2x80x2. This significantly shortens the electrical transmitting distance from the chip 11xe2x80x2 to the outermost solder balls 15, and thereby reduces the interference of electric inductance. The semiconductor package 1xe2x80x2 is further advantageous of having good heat dissipating efficiency with the provision of the heat spreader 14 for rapidly dissipating heat produced by the chip 11xe2x80x2 and efficiently cooling down the chip 11xe2x80x2.
However, the foregoing cavity down BGA package structure can only be incorporated with one semiconductor chip, which is not suitably applicable for a multi-chip semiconductor package. Therefore, it is tremendously desired to find out a solution for the heat dissipation problem of the multi-chip semiconductor package that is highly integrated with electronic circuits and electronic elements.
A primary objective of the present invention is to provide a multi-chip semiconductor package, in which a heat dissipating structure is formed with a chip receiving cavity for receiving at least one semiconductor chip therein so as to enhance heat dissipation efficiency.
Another objective of the invention is to provide a multi-chip semiconductor package for reducing overall dimensions of the fabricated packaging product.
A further objective of the invention is to provide a multi-chip semiconductor package, which can be made by current fabricating equipment without using the costly flip-chip technology.
In accordance with the foregoing and other objectives, the present invention proposes a multi-chip semiconductor package, comprising: a chip carrier having at least one opening for receiving a semiconductor chip therein; a heat dissipating structure formed with a chip receiving cavity corresponding in position above the opening of the chip carrier, and a plurality of through holes for interconnecting the chip receiving cavity and the opening of the chip carrier and for allowing gold wires and an encapsulating resin to pass through the through holes; a first and a second semiconductor chips attached to surfaces of the heat dissipating structure, and received in the chip receiving cavity and the opening of the chip carrier respectively; a plurality of gold wires for electrically connecting the chips to the chip carrier; and an encapsulant for encapsulating the chips and the gold wires.
Since the chips are respectively in direct contact with the heat dissipating structure, heat generated by the chips can be rapidly dissipated via the heat dissipating structure with the provision of the shortest heat transmitting pathway; this therefore significantly improves heat dissipating efficiency of the semiconductor package. Besides, compared to a conventional stacked-chip semiconductor structure, this invention with the chips being accommodated in the chip receiving cavity and the opening of the chip carrier, allows internal elements to be more compactly arranged in the semiconductor package, thereby making the packaging space optimally utilized. This is beneficially applicable to a multi-chip structure in favor of high memory capacity without undesirably increasing package dimensions, and is therefore preferable for low profile development of electronic products.

Multi-chip semiconductor package with heat dissipating structure

Siliconware Precision Industries Co., Ltd.


The present invention relates to an X-Y direction input device which shifts a cursor on a screen in any direction, and particularly to an X-Y direction input device capable of not only decreasing its thickness to realize a compact size but increasing its resolution or realizing superior operability. An X-Y direction input device comprises a casing for forming an outer body and an operating body accommodated in the casing to be mutually shiftable so that a cursor displayed on a display apparatus can be shifted in any direction in response to a shifting motion of this operating body. This input device comprises a base plate on which an X-direction pattern and a Y-direction pattern are respectively provided, a first holder which is provided to be shiftable in a Y-direction, a second holder which is provided to be shiftable in an X-direction, a plurality of cover plates covering an opening formed on the casing and provided to be shiftable independently with each other. And the operating body includes an engaging portion engaging with the first and second holders and a projection exposing through an opening formed on the casing. Furthermore, the first holder is guided at its both end portions and its intermediate portion in the Y-direction and the second holder is guided at its both end portions and its intermediate portion in the X-direction, thereby smoothing the movement of the operating body.

The present invention relates to an X-Y direction input device which shifts a cursor on a screen in any direction.
There has been known a so-called "mouse" as an X-Y direction input device which shifts a cursor displayed on a screen of a display apparatus in any direction. This "mouse" includes a ball as a operating body and a casing which accommodates this ball. When an operator shifts this casing on a base, signals of an X-direction and a Y-direction are produced by a pair of rotary encoders in accordance with a rotational movement of the ball. This X-Y direction input device causes the cursor to shift on the screen in any direction based on the signals.
Recently, there is a trend toward thinner personal computer such as a lap-top type computer. In order to respond to this trend, there is a corresponding need of making an X-Y direction input device as thin as possible. However, in the above described conventional X-Y direction input devices, there was a problem such that an overall shape of the casing becomes significantly large because of rotary type electric parts such as a ball, a rotary encoder, and a rotary volume, resulting in that the conventional X-Y direction input devices do not fit the lap-top type personal computer.


Apparatus, system, and method for delivering data to multiple memory clients are described. In one embodiment, a graphics processing apparatus includes an output pipeline including a set of memory clients. The graphics processing apparatus also includes a memory controller connected to the output pipeline. The memory controller is configured to retrieve data requested by respective ones of the set of memory clients from a memory. The graphics processing apparatus further includes a buffering module connected between the memory controller and the output pipeline. The buffering module includes a unitary buffer and a buffer controller connected to the unitary buffer. The buffer controller is configured to coordinate storage of the data in the unitary buffer, and the buffer controller is configured to coordinate delivery of the data from the unitary buffer to respective ones of the set of memory clients.

In current graphics systems, the number and processing speed of memory clients have increased enough to make memory access latency a barrier to achieving high performance. FIG. 1 illustrates a Graphics Processing Unit ("GPU") 100 of the prior art. The GPU 100 includes a graphics pipeline 102, which includes a set of memory clients 104, 106, 108, and 110. The graphics pipeline 102 is connected to a memory controller 112, which serves as an interface between the set of memory clients 104, 106, 108, and 110 and a memory (not illustrated). When a particular memory client makes a request for data, the memory controller 112 retrieves the data from the memory for that memory client. When multiple memory clients make requests for data substantially simultaneously, the memory controller 112 can determine which of the multiple memory clients is allowed access to the memory at a particular time. Typically, at least one of the set of memory clients 104, 106, 108, and 110 corresponds to an isochronous memory client, which is one that expects data to be delivered in a periodic manner or in accordance with a baseline rate. As can be appreciated, untimely delivery of data to such an isochronous memory client can lead to a stall and degradation of a visual output.
As illustrated in FIG. 1, the GPU 100 also includes an array of dedicated buffers 114, 116, 118, and 120, which are connected between the memory controller 112 and the graphics pipeline 102. The array of dedicated buffers 114, 116, 118, and 120 are configured to store data retrieved by the memory controller 112 and to deliver the data to the set of memory clients 104, 106, 108, and 110. The array of dedicated buffers 114, 116, 118, and 120 can serve to reduce memory access latency by storing an advance supply of data to be processed by the set of memory clients 104, 106, 108, and 110. Each dedicated buffer has a fixed buffering space that is dedicated to store data for a particular memory client. Thus, for example, the dedicated buffer 114 is dedicated to store data for the memory client 104, while the dedicated buffer 116 is dedicated to store data for the memory client 106. As illustrated in FIG. 1, the GPU 100 also includes an array of dedicated Read/Write controllers ("R/W controllers") 122, 124, 126, and 128, which are connected to respective ones of the array of dedicated buffers 114, 116, 118, and 120.
A significant drawback of the buffering implementation illustrated in FIG. 1 is that use of the array of dedicated buffers 114, 116, 118, and 120 and the array of dedicated R/W controllers 122, 124, 126, and 128 can lead to inefficiencies when a subset of the memory clients 104, 106, 108, and 110 is inactive or do not require all of its dedicated buffering space. For example, whenever a particular memory client is inactive or is operating with reduced memory access requirements, its dedicated buffering space is unused or underused. Such unused or underused buffering space translates into wasted buffering space that otherwise could have been assigned to another memory client that is active or is operating with enhanced memory access requirements. Also, such unused or underused buffering space translates into inefficient use of valuable die area on a chip.
It is against this background that a need arose to develop the apparatus, system, and method described herein.

Apparatus, system, and method for delivering data to multiple memory clients via a unitary buffer


A device (100) and method (200) for bonding a ribbon wire (104) to a workpiece (106) comprising feeding the ribbon wire through a passageway (116) of an ultrasonic bond capillary (102) and clamping the ribbon wire against an engagement surface (120) of the bond capillary via a clamping jaw (118) operably coupled to the bond capillary. The ribbon wire (104) is bonded to the workpiece (106) along a bonding surface (112) of the bond capillary (102) and penetrated, at least partially, between the bonding surface and the engagement surface (120) of the bond capillary by a cutting tool (124). The cutting tool (124) may comprise an elongate member (126) positioned between the bonding surface (112) and engagement surface (120), and may have a cutting blade (128) positioned at a distal end (130) thereof. The cutting tool (124) may further comprise a ring cutter (132), wherein the ribbon wire passes through a ring (134) having a cutting surface (138) defined about an inner diameter thereof.

In the semiconductor industry, wire bonding is commonly performed to electrically interconnect an integrated circuit (IC), such as a semiconductor die or chip, to various structures, such as a metal leadframe. Wedge bonding, for example, is a conventional method used to bond thin wires, such as thin aluminum or gold wire, between a bonding point on the semiconductor die to another point, such as a lead finger of the leadframe. Conventionally, in order to initiate a bond, the wire is pressed against the IC and/or leadframe with a tip of a bonding tool. The bonding tool is ultrasonically vibrated for a period of tens of milliseconds, wherein a plane of motion of the tip of the bonding tool is generally parallel to the surface of the semiconductor chip to which the bond is to be formed. The combination of a static load of the bonding tool normal to the chip's surface against the wire and chip coupled with the vibration at the tip of the tool causes the wire to plastically deform, thus simultaneously joining the bond wire with atoms of the material composing the chip's or leadframe's surface, and accordingly, providing a cold weld between the wire and the chip or leadframe.
One problem associated with wire bonding is the handling of the wire throughout the bonding process, and the breaking or severing of the wire after the bond has been made. To perform these functions, most conventional fine wire wedge bonding tools break the wire by clamping and/or pulling the wire away from the bonded substrate. Typically, with small diameter wires (circular cross-section wires having diameters of less than 0.025 inches), such a pulling action is sufficient, and does not cause significant damage to the substrate. However, with the ever-increasing demands for speed and performance of ICs, ribbon wires have been introduced, wherein a cross-sectional area of the ribbon wires is significantly greater than previously-used round cross-section wires, thus providing greater electrical current-carrying capabilities for the wire. Accordingly, when the conventional bonding tools are used with the thicker ribbon wires, the pulling force required to break the ribbon wire tends to deleteriously deform the chip and/or leadframe. As a consequence, various configurations for bonding tools have been formulated, such as one wherein a blade is pressed against the chip and/or leadframe in order to deform or cut the ribbon wire prior to pulling the bonding tool away from the substrate.
FIGS. 1A–1C illustrate one such conventional bonding device 10 during various operations, wherein a ribbon wire 15 is bonded to a substrate 20, such as a leadframe finger or semiconductor chip by an ultrasonic bonding tool 25. As illustrated in FIG. 1A, the bonding tool 25 is pressed against the ribbon wire 15, thus compressing the ribbon wire between the bonding tool and the substrate 20. At this point, the bonding tool 25 ultrasonically vibrates, thus cold-welding the ribbon wire 15 to the substrate 20. FIG. 1B illustrates a cutter 30 that is pressed against the ribbon wire 15, wherein the cutter significantly thins or cuts through the ribbon wire by the force F exerted by the cutter. FIG. 1C illustrates the bonding tool 25 being pulled away from the substrate 20, wherein a clamp 35 further pulls the ribbon wire 15 from the substrate, thus fully severing the ribbon wire generally at a tip 40 of the cutter 30.
One problem with the conventional bonding of ribbon wires, however, is that the force F of the cutter 30 against the ribbon wire 15 illustrated in FIG. 1B typically translates into a force on the substrate 20, wherein the substrate is potentially permanently deforming and/or damaged by the cutting operation. For example, as in the case of the ribbon wire 15 being bonded to a thin leadframe finger, the force F significantly deforms the leadframe finger (as illustrated by arrow 45), wherein the deformation remains after the cutter is pulled away from the substrate 20. Furthermore, if the ribbon wire 15 is not completely severed, the pulling force may further bend the leadframe finger in a direction opposite of the arrow 45 when the clamp 35 pulls the ribbon wire away. Alternatively, as in the case of the ribbon wire 15 being bonded to a chip, the cutting force F can deleteriously impact the chip, such as potentially damaging metallization layers or other layers of the IC.
Therefore, a need currently exists for a reliable process and apparatus for bonding ribbon wires to substrates, wherein damage to the substrate is substantially minimized.

Bond capillary design for ribbon wire bonding


A backlight system (100) in accordance with the present invention includes a plurality of light sources (110) for emitting light beams and a light guide plate (120) for receiving the light beams emitted by the light sources. The light guide plate includes a light input surface (121) and a light output surface (122) joining the light input surface. The light input surface has a plurality of protrusions (124) thereon. The light beams are refracted and diffused by the protrusions, and are then transmitted through the light guide plate to be emitted with a high degree of uniformity through the light output surface.

1. Field of the Invention
The present invention relates to a backlight device and particularly to an edge light type backlight device for use in a liquid crystal display (LCD) or the like.
2. The Related Arts
An LCD device comprises, for example, a liquid crystal display panel and a backlight system mounted under the liquid crystal display panel for supplying light beams thereto. The backlight system mainly comprises a light source and a light guide plate, wherein the light guide plate is made of a transparent acrylic plastic plate and is used for guiding the light beams emitted by the light source to uniformly illuminate the liquid crystal display panel.
The light source emits light beams into the light guide plate, wherein the light beams are totally internally reflected. In order to diffuse the light beams and emit them uniformly from a top surface of the light guide plate, protrusions or recesses are located on a bottom surface of the light guide plate, or a plurality of light diffusion dot-patterns are formed on the bottom surface of the light guide plate.
Referring to FIG. 7 and FIG. 8, a conventional backlight system 9 comprises a plurality of light sources 40, which can be light emitting diodes, miniature bulbs, or other point sources, a cage 30 having a reflective coating thereon, a light guide plate 10, and a translucent sheet 20. The cage 30 has a plurality of locating grooves 31 therein. The light guide plate 10 comprises a light input surface 11 and a light output surface 12.
In assembly, the light sources 40 are arranged in the locating grooves 31 of the cage 30, and the light guide plate 10 is accommodated in the cage 30. The light input surface 11 of the light guide plate 10 is close to the light sources 40. The translucent sheet 20 is placed upon the light guide plate 10.
In operation, light beams emitted by the light sources 40 pass through the light input surface 11 and enter into the light guide plate 10, and then are transmitted out from the light output surface 12 of the light guide plate 10. After that, the light beams pass through the translucent sheet 20 to illuminate an LCD panel.
However, the light sources 40 have a certain emitting angle. For example, light emitting diodes used as the light sources 40 emit light beams with an emitting angle in a range of 30° to 130°. Referring to FIG. 8, because the light beams are refracted at the light input surface 11 when they pass there through, the emitting angle of the light beams is decreased. The largest emitting angle is about 119.653°. Therefore, the light guide plate 10 yields a plurality of dark areas 13, from which fewer light beams are emitted. Thus, the uniformity of emission from the light guide plate 10 is impaired.
It is desirable to provide an improved backlight system for use in a liquid crystal display, which overcomes the above problems.

Backlight system and liquid crystal display using the same


A thin film transistor structure including a substrate, a gate, an oxide semiconductor layer, a gate insulation layer, a source, a drain, a silicon-containing light absorption layer and an insulation layer is provided. The gate insulation layer is disposed between the oxide semiconductor layer and the gate. The oxide semiconductor layer and the gate are stacked in a thickness direction. The source and the drain contact the oxide semiconductor layer. A portion of the oxide semiconductor layer without contacting the source and the drain defines a channel region located between the source and the drain. The oxide semiconductor layer is located between the substrate and the silicon-containing light absorption layer. The silicon-containing light absorption layer has a band gap smaller than 2.5 eV. The insulation layer is disposed between the oxide semiconductor layer and the silicon-containing light absorption layer, and in contact with the silicon-containing light absorption layer.

1. Field of the Invention
The present invention relates to a thin film transistor structure, and more particularly, to a thin film transistor structure having an oxide semiconductor layer.
2. Description of Related Art
Regarding a known thin film transistor array substrate, an amorphous silicon (a-Si) thin film transistor or a low temperature poly-crystalline silicon (LTPS) thin film transistor is commonly used as a switch for controlling the electronic signals. Recently, it is found that an oxide semiconductor thin film transistor has higher carrier mobility than the a-Si thin film transistor. Additionally, the oxide semiconductor thin film transistor has better threshold voltage (Vth) uniformity than the LTPS thin film transistor.
Regarding the known oxide semiconductor thin film transistor, the Vth of the oxide semiconductor channel layer would be shifted owing to a light irradiation so that the electric property and the reliability of the oxide semiconductor thin film transistor are affected. Therefore, how to improve the characteristic of the oxide semiconductor thin film transistor has become an important issue.

Thin film transistor having silicon-containing light absorption layer