A method for utilizing computer memory devices when they have compressed data is disclosed. Specifically, the techniques focus on the field of operating devices so as to access randomly specified portions of such compressed data. It has particular applicability in computer tape drives such as are used in computer peripheral memory backup devices. These improved methods act to efficiently ascertain the location of the desired data with a minimum amount of effort. One embodiment of the present invention comprises the use of records which represent a number of files or an amount of data stored. Each record is independently compressed to allow independent access and uncompression. The records may include labels for identification purposes. Each label is typically an uncompressed value or series of values stored at the front of each record. Additionally, offsets are specified in labels to indicate the distance from the beginning of the first record to any item of data. The essence of the present invention is to simply calculate an estimated location utilizing an initial compression rate estimate, that is a percentage or ratio that represents the relationship between the average cumulative file size in compressed form of the same data in uncompressed form. Testing this estimate and subsequently refining it serves to efficiently search and retrieve the desired data.

Generally, the invention relates to the field of techniques for utilizing computer memory devices when they have compressed data. Specifically, the techniques focus on the field of operating devices so as to access randomly specified portions of such compressed data. It has particular applicability in computer tape drives such as are used in computer peripheral memory backup devices.
Since the advent of programmable data processing systems, or computers, the need to store information has grown dramatically. This information storage is frequently accomplished through devices which interconnect with the computer and act relatively independent of it in response to signals received from the main data processing functions of the computer. These devices, known as peripheral devices, act to receive data from the main computer memory and then to store such data on a separate media associated with the peripheral device.
One of the aspects of typical memory devices in computer systems is their volatility--they can unintentionally lose their contents occasionally. To overcome this undesirable aspect, backup devices have evolved. Such devices serve the simple function of separately storing large amounts of data on relatively non-volatile media. In the field of these specialized devices the use of magnetic tape media has greatly eclipsed all other types of storage media. This use is so broad that magnetic tape cartridges which are specifically designed to be used with computer backup devices have been developed. Such cartridges specifically meet the needs of computer users in a standardized and optimum fashion.
In essence, computer backup devices serve as a separate memory system on which data or information can be stored. As with any type of memory device, there are limitations on the amount of data which the media can hold. While removable media such as magnetic tape cartridges have been developed to allow the users to have virtually unlimited memory capacity, within each cartridge limits still exist. Accordingly, the technique of compressing the data has been developed. Through this technique data can be stored in a form which takes less memory space than as originally stored. In advanced backup devices, the step of compressing the data is usually accomplished automatically by the backup device itself without additional actions by the user.
A variety of techniques for compressing data exist. These algorithms each act uniquely to compress data or files from one size to a smaller size for storage purposes. The data or file in compressed form--that of reduced size--is then stored on the memory media. Because of the way these algorithms work, the reduction in size that any particular amount of data receives varies not only by the type of algorithm used, but also the contents of the data. For this reason, the reduction in size is not predictable.
As with any memory device associated with a computer, accessing such memory is an important element. To accomplish this on any type of memory device, the location of the desired data must first be determined. While this is a straight-forward operation when data is stored in uncompressed form, when compression is included it is more difficult for the simple reason that the amount of compression varies. For the present invention, access to the data also requires the additional step of uncompressing the data or file. Accordingly, the desire to locate and access the data in the shortest amount of time possible has long been a goal of those skilled in the art.
The present invention focuses upon the techniques used to locate and access data stored in compressed form on any type of media. While it is especially appropriate for serially-disposed media such as computer tape memory media, it has applicability to other media as well. Even though the concept of storing compressed data has been well known and even though those in the field of computer backup memory devices have long had to deal with the difficulty of locating data in compressed form, the desire for an efficient access technique has remained unsatisfied until the present invention. This was perhaps due to the fact that the standards which had developed among those involved acted to teach away from the direction of the present invention. As an example, the quarter-inch-cartridge (QIC) recording format standards promoted by the industry teach the use of tables for data location, then a separately generated compression map is utilized to locate the data in traditional manners.
Prior to the present invention those skilled in the art either serially uncompressed data until the appropriate aspect was located, or they relied upon a table look-up technique. In the table look-up technique, an additional step of creating a listing of file size after compression is accomplished. While such a technique does improve the ease with which the location of desired data can be ascertained, several drawbacks exist. First, the creation of the additional table information takes time, adding to the apparent memory access time. Second, additional memory space is required to store the information. Also, update or modification of the table has been difficult to accomplish efficiently.
Other inventions have addressed similar problems, however, they have not been readily adaptable to the problem addressed by the present invention. Rather, they have been directed to techniques to locate items in a listing which is itself compressed. As an example, U.S. Pat. No. 3,651,483 discloses techniques which allow searching a compressed index, not compressed data. Similarly, U.S. Pat. No. 3,643,226 dealt with the same problem in a fashion which is not adaptable to the problems addressed by the present invention.

Method for locating compressed data in a computed memory back up device including steps of refining estimater location

400;425
FSS 200 MS File;900 MS File
FSS 51 MS
FSS 56 MS


A collection system for collecting coolant and chips from a series of machine tools for cleaning the coolant in a filter system and recirculating the coolant back to the machine tools. The system includes a series of end-to-end connected shallow depth troughs disposed on the floor below the machine tools, defining a downward sloping gravity flow path. Flow nozzles are used to maintain sufficient flow velocity to move the collected debris and liquid to the end of the trough. Collector-deflector plates prevent oversplashing and misting out of the troughs. A flow nozzle control variably sets the diversion of clean coolant to the flow nozzles in accordance with the sensed velocity of the coolant in the trough.

This invention concerns collection systems for receiving machine tool coolant collected to be filtered and recirculated to the tools. In production, machine tools are typically arranged in transfer lines. Coolant is directed at the cutting tools during machining to cool and lubricate the tools and flush chips and abrading grit away from the part. The coolant is allowed to drain into a floor trench, passing beneath the series of machine tools along with the chips and other solid debris from the machining operation. The liquid in the trench flows along an incline to carry the debris to a settling tank and filter systems, flow nozzles spaced along the trench aiding the flow of debris and insuring there is sufficient volume of liquid to move debris along the trench. The coolant is filtered and recirculated to the machine tools, while the chips are collected for disposal.
The velocity trenches have conventionally been installed below floor level to provide sufficient volume capacity for the accumulated coolant collected progressively from all of the machine tools arranged over and along the velocity trench. The below grade trenches also minimize the spillage of coolant on the floor around the machine tools.
This type of system increases the overall cost of a particular machine tool installation, but also renders it difficult to reconfigure. Also, it would sometimes be desirable to move the installation to another location in the plant or to another site completely. The existence of below grade trenching would make this costly or entirely unfeasible.
Overhead coolant collection piping systems have been devised to overcome this disadvantage, but these systems require large capacity piping and vacuum or pumping circulation systems, which are more complex than the gravity flow trench systems.
Another difficulty involves the flow nozzles which direct jets of clean coolant to the coolant flowing in the trench to insure that chips are carried along with the flow. Where there is an adequate volume of coolant draining from the machine tools, an excess volume of clean coolant is diverted to the flow nozzles than is necessary to keep the debris from accumulating in the trench.
Excessive velocity of the coolant also contributes to "misting" in which atomized liquid drifts out of the trenches and condenses on adjacent surfaces.
It is an object of the present invention to provide a machine tool coolant collection system which does not require below grade trenching and minimizes spillage of the coolant onto the adjacent floor surfaces, as well as misting.
It is another object of the present invention to provide such a collection system which uses flow nozzles supplied with an efficiently controlled diversion of clean coolant to the flow nozzles.

Collection system for machine tool coolant


A connecting assembly of modular box, comprising a top cover, a sleeve, a mandrel, and a jacket, the sleeve is configured to trap outside the mandrel; the sleeve is provided with at least one snap-fit portion, the jacket is provided with at least one snap-engagement portion, the at least one snap-engagement portion is connected with the at least one snap-fit portion, so that the jacket is fixed in a circumferential direction of the sleeve; the top cover is connected to an upper end of the mandrel to press firmly the sleeve and the jacket, so that the axial positions of the sleeve and the jacket are fixed.

There are various ways to connect a combined box currently. One is to use a metal pillar with its four sides having connection chucking slots or holes through which boxboards are fixed on the pillar, the disadvantages of this connection are as follows: (a) a particular connector needs to be fixed on a boxboard, or faces of the boxboard are machined as having a shape adapted to a chucking slot on the pillar, so it is cumbersome in mounting and labour-intensive; (b) the combination style of the box is unitary due to the limitation of the structure of the connecting pillar; (c) the fixation of the box to the ground is troublesome; (d) four sides of the connecting pillar have chucking slots, affecting the appearance.
Another is to use an extrusion having a docking, rectangular, or three-way configuration as a connector, a mandrel is provided in a centre hole of the connector, by which the plates between the different layers are overlapped with each other to form a higher box. Compared to the previous solution, this connection is adjustable in height, mounting is relatively easy, but its drawbacks are: (a) combination style is unitary due to the limitation by the structure of the connecting pillar; (b) the fixation of the box to the ground is troublesome.
More and more requirements are made on the combination style of the box in the actual use, but the existing combined box and connector only provide a 1+1 connection or some fixed-angle connections, which limits the diversity and flexibility of the box style.

Modular combined box and connecting assembly thereof


Hypotensive mammals are treated to lower mean blood pressure by administering synergistic amounts of a calcium blocking agent together with a calcium supplement.

Calcium channel blockers were identified as a method for the control of hypertension, as reported by Fleckenstein et al., Z. Kreislaufforsch, 56, 716 (1967), and are routinely used in the control of hypertension. Three calcium channel blockers are currently of clinical significance in the United States, verapamil, nifedipine and diltiazem. All three achieve their anti-hypertensive effect by inhibiting the entry of calcium ions into vascular smooth muscle. The ultimate effect is vasodilation.
Hypertensive hormones, such as the renin-angiotensin system (RAS), the vitamin D system, and the parathyroid hypertensive factor (PHF), are all causative factors in stimulating the increase of calcium ions in vascular smooth muscle. PHF is disclosed and described in patent application Ser. No. 07/327,450.
It has been found that calcium supplements, in dietary form, may inhibit the RAS, PHF and vitamin D systems, Park et al., Am. J. Physiol., 235, F22 (1978); Park et al., Am. J. Physiol.,240, F70 (1981); Hotchen et al., Am. J. Cardiol., 62, 41G (1988); Bukoski et al., B.B.R.C., 147, 1330 (1987); Inoue et al., B.B.R.C., 152, 1388 (1988); Baran et al., J. Clin. Invest., 77, 1622 (1986); Lewanczuk et al., Am. J. Hypertens., 3:349 (1990)! and are, therefore, beneficial in decreasing calcium uptake in vascular smooth muscle. An untoward effect of calcium supplementation is that the increased bio-availability of calcium partially negates the inhibitory effect on the endocrine system. Calcium channel blockers, by limiting the uptake of calcium in vascular smooth muscle, are beneficial, but have been found to stimulate some endocrine systems, such as the RAS system. (Kotchen et al., Am. J. Cardiol., 62 41G (1988); Matsumara et al., J. Pharmacol. Exp. Ther., 241, 1000 (1978); Resnick et al., Fed. Proc., 45, 2739 (1986)). Utilization of calcium channel blockers may be limited by excessive vasodilation, negative inotropy, excessive depression of the sinus nodal rate, atrial-ventricular nodal conduction disturbances and interference with non-vascular smooth muscle contraction. A combination therapy which minimizes the amount of calcium channel blocker required to achieve the desired anti-hypertensive effect is desirable.
In addition to identification of essential hypertension, the existence of PHF is applicable to the study and treatment of other diseases which may or may not necessarily include hypertension as a primary symptom. These diseases include non-insulin-dependent diabetes mellitus (NIDDM) and cancer. In NIDDM, increased intracellular free calcium has been observed. The increase can be attributed to PHF. PHF has been detected in the plasma of "ob/ob" mice which are obese, hypertensive and have non-insulin-dependent diabetes. PHF is also found in humans with essential hypertension, e.g., hypertension of the low-renin and salt-sensitive type, and in a higher percentage of humans with NIDDM than those without NIDDM see Ho et al., Journal of Cardiovasc. Pharmacol., 23 (Supp. 2): S31-S34 (1994)!.
Some forms of cancer are characterized by an increase in intracellular free calcium see: Okazaki et al., Canc. Res., 46 (12 Pt 1), 6059-6063 (1986); Lipton and Morris, Canc. Chemother. Pharmacol., 18(1), 17-20 (1986); Chien and Warren, Canc. Res., 46(11), 5706-5714; Shirakawa et al., Canc. Res., 46(2), 658-661 (1986); and Meyer, J. Hypertens., 5 (suppl. 4), S3-S4 (1987)!. As PHF is of parathyroid origin, PHF may be implicated in those forms of cancer characterized by an increase in intracellular calcium concentration.

Method of treatment for disease associated with excessive PHF using combination therapy involving exogenous calcium and calcium channel blockers


A system and method for extending the use of the cross-memory descriptor in a server partition environment such that it may be used to describe another partition's memory, e.g., a client partition's memory (referred to hereafter as a “remote” memory), are provided. With the system and method, when an operating system in a logically partitioned computing system is initialized, operating system kernel services are invoked that examine a device tree of the computing system and generate an extended cross-memory descriptor that describes the local memory of another logical partition, which is a remote memory to the present logical partition. When an access to a remote memory is required to perform an operation, the operating system of the server partition uses the stored extended cross-memory descriptor to perform the remote memory access.

1. Technical Field
The present invention is generally directed to an improved data processing system. More specifically, the present invention is directed to a system and method for extending the cross-memory descriptor so that it may be used to describe memory from another partition in a logically partitioned computing environment.
2. Description of Related Art
The Advanced Interactive Executive (AIX) operating system supports logical partitioning (LPAR) in International Business Machine (IBM) Corporation's pSeries machines. LPARs allow the running of multiple system images on a single processor complex. Each such image has a full complement of CPUs (dedicated or shared), central storage, expanded storage and channels. With LPAR, there is a clear isolation of resources between partitions such that one partition may not make the system environment of any other partition unstable. In IBM Corporation's machines, the facility that enables this clear separation of resources for partitions is the hypervisor.
Since each partition has its own isolated set of resources, each partition has its own "local" memory that is hidden from surrounding partitions. Until the creation of virtual input/output (VIO) there was no legitimate reason for one partition to access another partition's memory directly.
With VIO a concept of point-to-point Direct Memory Access (DMA) operations and memory copy operations between partitions was introduced. DMA operations permit transfers of data from one memory to another memory directly without using the central processing unit (CPU) to perform the data transfers. DMA operations permit faster data transfers than if the CPU had to be used to transfer the data. Memory copy operations permit portions of memory to be directly copied from one memory to another.
Thus, VIO allows sharing of physical resources, e.g., an I/O adapter, etc., between partitions. Since a resource can belong to only one partition (called a "server" partition), the other partitions have to go through the server partition in order to use the resource (the other partitions are referred to as "client" partitions).
In the case of the shared resource being an I/O adapter, in order to use a server partition's I/O adapter, the server partition needs to setup a DMA operation from the I/O adapter to the client's memory. However, in order to setup the DMA operation, the server partition needs to know information about the structure of the client partition's memory. Moreover, the server partition needs to be able to pass the information about the client partition's memory structure down its own I/O stack, i.e. the prescribed hierarchy of software layers through which a data must be processed in order to perform an I/O operation (e.g., Logical Volume Manager (LVM), head driver, adapter drivers, bus drivers, kernel, and so on), in a useable format. Thus, it would be beneficial to have a system and method for describing a client partition's memory in a server partition's environment in such a manner that the description may be easily passed down the server partition's I/O stack.

System and method for extending the cross-memory descriptor to describe another partition's memory

International Business Machines Corporation


A method and apparatus for controlling the temperature, maintaining the vacuum integrity and facilitating maintenance of a lid assembly (2) in a wafer processing apparatus. The apparatus comprises a gas distribution plate (42) defining one or more gas distribution holes (50) formed therethrough for passage of process gas(es), and a base plate (10) thermally coupled to the gas distribution plate. The base plate (10) has a gas inlet in communication with the gas distribution holes, a fluid inlet (98) for receiving a coolant fluid and a fluid outlet (102) for discharging the coolant fluid. A fluid passage (94) is formed through portions of the base plate in communication with the fluid inlet and outlet to allow a coolant fluid to flow therethrough and to transfer heat from the gas injection and distribution plates. The base plate is an integral, single piece that minimizes the use of gas seals in the lid assembly and facilitates disassembly and assembly of the lid assembly for cleaning and other maintenance.

The present invention relates to the fabrication of integrated circuits. More particularly, the invention provides a method and apparatus for controlling the temperature, maintaining the vacuum integrity and facilitating maintenance of a lid assembly for a semiconductor processing chamber.
High density integrated circuits, commonly termed VLSI devices, are typically formed on semiconductor wafers by subjecting the wafers to a number of deposition, masking, doping and etching processes. The wafers are placed on the upper surface of a pedestal or susceptor within a processing chamber, and process gas(es), such as tungsten hexafluoride and silane, are delivered into the chamber onto the wafer to perform the various deposition and etching steps. Typically, the process gases are directed through a manifold and mixed in a water-cooled gas mixing chamber within the manifold head. This cooling is often desired because the process gases may react to form a solid precipitate that deposits onto the walls of the manifold head at temperatures greater than a threshold temperature. After mixing in the cooled manifold head, the gaseous mixture is delivered through a lid assembly that includes one or more gas distribution plates for delivering a uniform distribution of the gaseous mixture into the deposition chamber onto the wafer.
During processing, the gas distribution plates of the lid assembly (i.e., the gas distribution plate or showerhead and the gas dispersion plate or blocker plate) receive heat from the gases flowing therethrough and from the heated wafer in the processing chamber. If these plates reach a threshold temperature, the process gases passing through the gas distribution system may react to form large particulates which clog the gas distribution holes of the plates. In addition, a layer of deposition may form on the inner surface of the plates to later flake off in large particulates that rain down on the wafer to create an uneven deposition layer, thereby contaminating the wafer.
The gas distribution plates of the lid assembly are typically mechanically coupled to a gas injection cover plate and a mounting plate, which are attached to a base plate for mounting to the processing chamber. The interfaces between these components are usually sealed with gas seals (e.g., O-rings) so as to maintain a vacuum-tight seal throughout the lid assembly. During installation of the lid assembly, however, it is often difficult to precisely align the gas seals within the corresponding grooves of the plates. In addition, the gas seal surfaces and grooves can be damaged from handling during this installation. A gas seal that has not been precisely installed or one that has been damaged during installation may contain a leak. This leak allows gas to pass through the lid assembly during processing, thereby disrupting the desired pressure within the processing chamber. Disruption of this desired pressure, which is typically on the order of 1-2 milliTorr, will adversely affect the deposition uniformity on the semiconductor wafer. Therefore, the gas seals must be repaired or reinstalled, or the entire lid assembly must be replaced when the vacuum integrity of its components has been compromised. Frequent reinstallation, repair or replacement of the lid assembly increases the manufacturing cost of the wafers and the downtime of the processing apparatus, which decreases the throughput of the process and further increases the manufacturing cost of the wafers.
Periodic cleaning and maintenance of the exposed surfaces of the processing chamber also increases the downtime of the processing apparatus. For example, the surfaces of the lid assembly that are exposed to process gases are typically cleaned periodically to remove deposition reactant from these exposed surfaces. To accomplish this, the lid assembly usually must be completely taken apart to separate the gas distribution plates from each other and to thereby access the exposed surfaces of these plates. Disassembling the lid assembly for cleaning takes a relatively long time. Moreover, reassembling the lid assembly after cleaning requires the gas seals and the gas distribution plates to be realigned, which can be a difficult, time-consuming process.
What is needed in the semiconductor manufacturing industry, therefore, is an improved lid assembly for a wafer processing apparatus. It would be desirable to maintain the temperature of the various components of the improved lid assembly below a threshold value to thereby avoid reaction and subsequent deposition of the processing gases on these components. In addition, the components of the lid assembly should be designed to minimize leakage of fluids therebetween to maintain a sufficient gas seal over the processing chamber. Furthermore, it would be desirable if the lid assembly were designed to facilitate cleaning of the surfaces that are exposed to process gases during processing.

Lid assembly for semiconductor processing chamber


A modular gun case (10) comprises an elongated bottom section (12) having a rim (28), an elongated lid section (16) having lid upper and lower brims (92, 94), and a top section (14) having a top section peripheral edge (70). The lid section matably engages and closes the bottom section. The top section can matably and removably engage either the lid or bottom sections. In one embodiment, the lid section is pivotally mounted to the bottom section. The sections at the respective rim, lid upper and lower brims, and top section peripheral edge utilize a combination of protrusions (104) and shoulders (102) to matingly engage one another. To secure the top section, lock recesses (72) are provided having juxtaposed lock brackets (74) capable of receiving a lock (76). Gas purge valves (51) are provided in the bottom and top sections. Straps (38) releasably retain the sections together. Wheels (42) rotatably mounted to the bottom section assist an individual in porting the modular gun case from one location to another. A plurality of locking bar latches (106) having locking bars (110) extending therethrough are mounted to the bottom, lid and top sections to releasably mount and lock the lid section to the bottom section and releasably mount and lock the top section to either the lid or bottom sections. The lid section has slotted inserts (98) mounted thereto to receive and transport objects.

I. Field of the Invention
The present invention relates generally to the field of carrying cases for storage, protection and transportation of sporting equipment. More particularly, the present invention relates to a modular gun case acceptable by the air carrier industry for transporting firearms, bows, arrows, golf clubs, and the like, on commercial airlines.
II. Description of the Related Art
Typically, hard-shell firearm carrying cases have two metal or plastic shells attached on one side by one or more mechanical hinges for folding the firearm carrying case into an open or a closed position. Releasably attached on the opposite side of the firearm carrying case are one or more mechanical latches for securing the firearm carrying case in the closed position. A locking rod system can be utilized with the latches to further secure the two shells together. Each shell contains a foam bedding which interlocks with each other upon closing the firearm carrying case. One or two handles are attached to the latching side to facilitate carrying the firearm carrying case. However, such a firearm carrying case is not capable of matingly engaging another storage section to act as a functional closure or lid. Nor does such a firearm carrying case have a removable lid which is capable of receiving items for additional storage. Examples of such firearm carrying cases are market by Cabela as "`Bullet Proof` Aluminum Cases" and by Doskocil as "Gun Guard" cases.
U.S. Pat. No. 5,551,562 issued to Beretta describes a carrier-suitcase for sports guns, their spare parts and equipment for the user. This device has a body with front and rear sides. The body is provided with wheels allowing the body to be moved on wheels as a carrier and is provided with a grip element allowing the body to be carried as a suitcase. The interior of the body has a plurality of spaces or compartments. The spaces are accessible in part on the front side and in part on the rear side. At least some of the spaces which are accessible on the front side are closed by a shutter or sliding gate. Spaces which are accessible on the rear side are closed by a door, which is hinge-mounted onto the body.


A system and method for hosting and managing a live game are disclosed which includes a live gaming table for live players and a live dealer. In an embodiment an application configures a player's mobile device to receive an invitation from a casino to play the table game based upon the player being, based upon location aware technology, being in or near the casino. Accepting the invention permits the player to reserve a position at the gaming table and displays a machine readable code at the player's mobile device. The player positions at the gaming table include video display and player input devices (VDPIDs) and a code reader to read the displayed code and access the player's electronic account. Using the VDPID the player may convert between electronic funds and physical gaming chips, participate in video bonus event play and back-bet on other players.

Gaming venues such as casinos have long known to provide live table games such as Blackjack, Pai Gow, Baccarat, Craps, Poker and other games. A common aspect of these games is a live dealer(s) and live players occupying positions about a physical gaming table. The gaming table in most cases includes a surface bearing a layout printed with information such as designating player positions, betting areas to control and identify the propositions wagered on by the players and the placement of game pieces such as playing cards. To play the game players must find an open position at the table from which to participate.
In many modern casino venues with live table and electronic machine gaming, players may enroll in a player loyalty club. The club is administered through a communication network including one or more servers hosting player data. Upon enrollment, these clubs provide a loyalty (or player's) card for the player to identify himself/herself to the system. Enrollment may include a player establishing an electronic account to be a repository for electronic funds. In some cases the account is funded by the player presenting value such as cash, chips, electronic transfer of funds from a financial institution or credit card company or some other form of value. To wager on live table games players must present casino-compatible, physical gaming chips or cash, which are converted by the dealer into physical gaming chips.
In relation to these table games, it has been known to provide a primary game bonus feature where the bonus is based upon the play/outcome of the base game. For example, Snow, U.S. Pat. No. 6,808,173 discloses a Blackjack base game with a primary bonus game side bet proposition which can be fulfilled based upon the player's cards and the dealer's face up card. Snow, U.S. Pat. No. 6,789,801 discloses a Baccarat base game with a primary game side wager for a bonus based upon the numerical difference between the winning and losing Banker or Player hands. Snow et al U.S. Pat. No. 9,126,102 teaches a four-card Poker game with a bonus wager. Suttle et al U.S. Pat. No. 4,836,553 describes a table game having a primary bonus game with a progressive bonus feature and requiring a side wager.
In the past, for many table games, the application of progressive jackpots was a challenge since there was no mechanism to receive progressive side wagers for allocation to the jackpot and to memorialize participation on the progressive proposition. In Jones et al U.S. Pat. No. 5,794,964, an early attempt at a solution discloses a table game providing a progressive jackpot for a table game, which includes a token acceptor associated with each player position. Insertion of a physical token indicated the player's participation and provided a processor with information to increment a progressive prize. The table game of Caribbean Stud™ is a commercial offering including this feature. Kelly et al U.S. Pat. No. 9,142,084, issued Sep. 22, 2015 and titled "WAGER RECOGNITION SYSTEM," the disclosure of which is incorporated by reference, discloses an optical bet detection unit for a gaming table which can be used to detect a progressive participation wager.
Halter et al US 2016/0217657 filed Mar. 24, 2016 and titled SYSTEMS AND METHODS OF LINKING GAMING STATIONS," the disclosure of which is incorporated by reference, teaches a system for linking progressive prizes between gaming tables offering different games and providing a spinning wheel feature when a qualifying base game triggering event has occurred.
It has also been known to provide promotions toward the play of table games. These promotions are in the form of a printed voucher or coupon which may, for example, double a table game wager, e.g. if the player wagers $5 the voucher may act to double the wager to $10. The use of paper vouchers restricts the nature and utility of such instruments.
Some drawbacks to table gaming has been the nature and type of bonusing which can be provided to attract players, the inability of a player to access electronic funds for conversion into physical gaming chips and the inability of a player to remotely accept a table game promotion and reserve a seat at the corresponding gaming table to redeem the promotion. A further drawback is that players could not wager upon another player that other player will, for example, hit the jackpot.

This patent is subject to a terminal disclaimer.

System and method for hosting and managing a live game


An apparatus and method for protecting wellheads of a fixed-leg drilling and production platform which provide an alternative from the shutting in of producing wells as currently required. The apparatus provides a structural barrier for the production process systems of the platform, shielding such systems from heavy objects which may be dropped in the course of rig mobilization and skidding procedures. A method of installing an embodiment of the apparatus allows the barrier to be installed without shutting in the production wells.

The present invention generally relates to fixed leg platforms used in relatively shallow water for producing mineral resources, specifically oil and gas. The present invention more specifically relates to various embodiments of an apparatus and a method of installing an apparatus which protects wellheads from being struck from objects or equipment which may fall and impact the wellhead and production processing equipment.
Offshore hydrocarbon production in federal waters is regulated by the Minerals Management Service (the "MMS"). The MMS currently requires that wells be shut-in during various operations, including operations to install a drilling or work-over rig on the platform. Specifically, the applicable regulations require that all producing wells in the affected wallaby be shut in below the surface and at the wellhead when a drilling rig is moved between wells on the platform. The regulation also requires that wells be shut-in during rigging up and rigging down activities which occur within 500 feet of the affected platform or when a drilling unit is moved between wells on a platform or when a mobile offshore drilling unit moves within 500 feet of a platform.
This regulation recognizes that many heavy components are lifted over the wallaby and over the wellheads and production piping therein during the mobilization and moving of a drilling rig, presenting the risk that a heavy component may be dropped onto the production piping of a wellhead resulting in damage to the facilities and the possible release of hydrocarbons. The regulation further provides that once enough of the drilling rig, such as the superstructure, is over the well of interest, the wells may be returned to production. However, for a variety of reasons, the moving of a drilling rig may be delayed, resulting in a prolonged period that one or more producing wells are shut-in. For example, in rough seas the work boat transporting rig components may be delayed while waiting for smoother seas to deliver the components to the platform.
Shutting in producing wells is problematic for at least two reasons. First, production is lost or delayed when wells are shut-in. Bringing the wells back online can be time-consuming and may require substantial supervision to safely return the wells to production. Second, some wells are damaged from being shut-in, and do not always return to their previous flow rates after the wells are returned to production. For example, fine particles may be repositioned within the reservoir rock as a result of ebbing and surging flow associated with stopping and resuming of the production in a well. Loss of production is not only detrimental to the owner of the wells, but it also adversely impacts the royalties received by the federal government.
The MMS regulations grant the MMS District Supervisor some discretion in the shutting in of producing wells. The regulations provide that the MMS District Supervisor may approve departures from the shut-in requirement by making application to the District Supervisor. Among other information, the District Supervisor may consider platform structural data and point load calculations showing that the production process systems can withstand the impact of a dropped object. The District Supervisor may also consider a lift sequence plan which describes the order of the lifts, and the lift positioning on the platform deck relative to the wallaby areas and production processing equipment.

Apparatus for protecting wellheads and method of installing the same


The present invention controls a room temperature by controlling an environmental control unit. A total span about a setpoint temperature is adjusted in accordance with a previous total span and a multiplicative factor. The multiplicative factor is periodically updated from a desired cycle time and a previous cycle time. The room temperature may also be controlled by adjusting a duty cycle for controlling an environmental control unit. The duty cycle is adjusted based on an error associated with a previous control cycle and an attenuation factor. A new control cycle may be started by cutting the previous control cycle or a current control cycle may be extended if a predetermined condition is detected. The control mode is selected based on environmental characteristics and room characteristics. The control mode may include a span control mode and a duty cycle control mode that is selected from the cycle rate.

With the increased price of fuel and electricity, efficient temperature control of buildings is increasingly important. Room temperature control typically utilizes a "temperature span" method, in which a temperature range is specified between a setpoint temperature plus a fixed span temperature and the setpoint temperature minus the fixed span temperature. When heating a room, a heating unit turns off when the room temperature is higher than the setpoint temperature plus span temperature and turns on when room temperature is lower than the setpoint temperature minus span temperature. Similarly, when cooling the room, a cooling unit turns off when the room temperature is lower than the setpoint temperature minus span temperature and turns on when the room temperature is higher than the setpoint temperature plus span temperature. This approach is not very flexible and typically does not adapt to the characteristics of the room or changing environmental factors, thus lowering the efficiency of the cooling or heating unit. This approach is limited by the inherent span temperature resolution, which is dependent on hardware of an electronic digital thermostat, e.g., an analog to digital (A/D) converter, causing an error in the room temperature. Moreover, with thermal time delays of the controlled room and of the thermostat housing, the temperature span setting in the electronic digital thermostat is usually not achievable. Consequently, prior art temperature control often results in a large swing in the room temperature which is not comfortable to the user and may also lead to lower efficiency.
Consequently, there is a need to control a temperature of a room that is sufficiently accurate and that provides improved energy efficiency.

Apparatus for temperature control using a cycle rate control algorithm


A method and a first network node (800) serving a first cell (800A) in a wireless network, for enabling reduction of interference in a second cell (800B) caused by transmission of reference signals in the first cell (800A). The first network node (800) transmits (8:1) scheduling blocks with said reference signals, using a time offset relative transmission of scheduling blocks in the second cell. A timing advance value is determined (8:3) for a wireless device (802) and the wireless device (802) instructed (8:4) to apply said timing advance value for uplink transmissions. The timing advance value was determined such that uplink symbols transmitted from the wireless device (802) are aligned with uplink symbols received at a second network node (804) of the second cell (804A).

In a wireless network comprising a plurality of network nodes, it is desirable to utilize available radio resources as efficiently as possible so as to achieve high capacity and adequate performance in communication with wireless devices. The term "wireless network" is used in this description to denote any network comprising network nodes such as base stations, access points, eNodeBs or the like which are capable of radio communication with wireless devices, e.g. by transmitting scheduling blocks carrying reference signals and typically also various data and control information.
The nodes in the network that performs such radio communication with wireless devices are also generally denoted "network nodes" herein. Further, the term "wireless device" denotes any communication equipment that is capable of radio communication with network nodes in a wireless network. Some non-limiting examples of wireless devices that may be involved in the procedures described herein include mobile phones, smartphones, tablets, laptop computers and Machine-to-Machine, M2M, devices. Throughout this description, the term "User Equipment", UE, may be used instead of wireless device.
In order to support coherent downlink reception as well as to evaluate whether a connection to a network node is suitable for communication, and if so to configure various parameters for the communication, the wireless devices are requested to perform measurements on predefined reference signals which are regularly transmitted from the network node. In a wireless network operating according to Long Term Evolution, LTE, signals are transmitted by the network nodes using Orthogonal Frequency-Division Multiplexing, OFDM, which is a method of encoding digital data on multiple carrier frequencies. In this description the reference signals will be referred to as "Cell-specific Reference Signals", CRSs, which term is commonly used in LTE.
In downlink transmission according to LTE, the smallest schedulable resource is commonly referred to as a "scheduling block" which is illustrated in FIG. 1A. For consistency the term scheduling block will be used throughout this description, regardless of whether it carries any data or not. However, any of the terms "resource block" and "resource grid" could also be used herein as a synonym for scheduling block. Another term that is commonly used in this context is Physical Resource Block, PRB. A scheduling block may carry various reference signals as well as data and control signaling, see below. The scheduling block described herein may thus carry one or more of data, control signaling, reference signals, synchronization signals, etc., and the description is not limited in this respect.
A downlink transmission may comprise multiple scheduling blocks which can be "stacked" the frequency domain to fill the available system bandwidth or any part thereof. A scheduling block 100 may typically extend over 180 kHz during 1 millisecond, ms. This resource 100 is further divided into 12 subcarriers in the frequency domain. In the time domain this resource is divided into 14 OFDM symbols as shown in FIG. 1 when a normal cyclic prefix is used, or 12 OFDM symbols when an extended cyclic prefix is used. The cyclic prefix is used in OFDM to maintain orthogonality between subcarriers when the signal is distorted by multipath propagation. The scheduling block 100 in FIG. 1 is shown as a "resource grid" divided into 12 elements in the frequency domain representing the subcarriers and 14 elements in the time domain representing the OFDM symbols.
The smallest resource in LTE is comprised of one Resource Element, RE, 100A which corresponds to one subcarrier 100B during one OFDM symbol 100C. The scheduling block 100 is thus comprised of 12×14 REs. The first 1 to 3 OFDM symbols in this example compose the control region where mainly the Physical Downlink Control Channel, PDCCH, is multiplexed. The rest of the OFDM symbols in the scheduling block 100 compose the data region, where mainly the Physical Downlink Shared Channel, PDSCH, is multiplexed.
Some resource elements in the time/frequency grid are used for transmitting CRSs which are indicated in FIG. 1A as striped resource elements, while the resource elements used for data and control are non-striped. A predetermined sequence of CRSs is transmitted in predefined RE positions known to the wireless devices. The CRSs can be used by wireless devices for synchronization, downlink channel estimation, determination of a Channel Quality Indicator, CQI, a Rank Indicator, RI and a Precoding Matrix Indicator, PMI, as well as for mobility measurements such as the Reference Signal Received Power, RSRP, etc.
Since CRSs are used also for cell measurements by wireless devices in idle mode which are more or less unknown to the network, the CRSs need to be transmitted even if there are no wireless devices attached to the cell. Note that this description has been simplified to involve only one antenna. If more antenna ports are used (e.g. 2 or 4), the resource grid of one antenna will contain unused REs in positions that are used for a CRS on the other antenna.
However, when a scheduling block is transmitted in two cells at the same time using the same CRS positions, the CRSs in the two cells will coincide and may therefore also interfere with each other, which is illustrated in FIG. 1B. In this figure, CRSs are transmitted in the predefined REs by a network node 102 of a first cell 102A and also by a network node 104 of a second cell 104A. When wireless devices 106 present in the first cell 102A try to measure the CRSs from the network node 102, they will also receive interfering CRSs from the network node 104. Similarly when wireless devices 108 present in the second cell 104A try to measure the CRSs from the network node 104, they will also receive interfering CRSs from the network node 102. The interfering CRSs are indicated by dashed arrows.
As a result, the CRS measurements in either cell will be too "pessimistic" due to the interference of CRSs from the other cell, and if the CRS measurements are used for channel estimation or the like, the channel may be under-estimated since the above harmful interference from CRSs, which interference made the CRS measurements pessimistic, will not occur when data is transmitted in other REs. The capacity of the network may therefore not be fully utilized due to such pessimistic and misleading CRS measurements. This under-estimation of the channel can be avoided by not transmitting the CRSs in the same REs in the two cells, but then the CRSs in one cell may instead interfere with data transmissions in the other cell.

Method and network node for enabling reduced interference in a wireless network


Some embodiments include apparatuses having a first node to receive a supply voltage, a second node, a switching circuit to couple the first node to the second node and to decouple the first node from the second node, circuit blocks coupled to the second node and the switching circuit, and drivers coupled to the second node. Each of the circuit blocks includes a capacitor having a plate coupled to the second node. Each of the drivers is associated with a conductive line. The conductive line is associated with memory cells.

Many electronic systems, such as computers and mobile devices, include a memory device to store information. The memory device usually has numerous memory cells. The memory device performs a write operation to store information in the memory cells and a read operation to retrieve information from the memory cells. A conventional memory device often has circuitry to provide a specific voltage to some parts of the device at a certain time during a read or write operation to ensure proper device operation. As described in more detail below, such circuitry in some conventional memory devices have limitations that may be inapplicable for some device configurations.

Register files including distributed capacitor circuit blocks


A handheld medical instrument for rotating a tool including a support structure having a portion that may be gripped by a user, and an electric motor having an output rotatable at a first speed. A tool rotating shaft extends from the support structure and is adapted to be coupled to a tool to rotate the tool at a second speed. A variable speed transmission is operatively coupled between the output of the electric motor and the tool rotating shaft to transfer rotation therebetween and is selectively adjustable between at least two different ratios of the first speed relative to the second speed.

Electrically operated, handheld devices are commonly used today in various medical and dental procedures. These devices may be used, for example, to rotate burrs, drills, and dental files for cutting away or shaping different types of tissue. Typically, these devices include an electronic controller, a variable speed handheld motor, and a gear head. The controller is electrically connected to the motor and can vary the power to the motor thus varying the motor output speed. The gear head includes an output which is connected to the desired tool for rotating the tool at a predetermined speed. Gear heads are generally available in many different input/output speed ratios and a selected gear head is typically connected to the motor both to provide a mechanical connection to the desired tool and to step-up or step-down the rotational speed of the tool relative to the speed of the motor.
A significant problem with existing handheld instruments of this type is that the motors are usually limited to a small range of output speeds. A typical output speed of handheld instruments is approximately 1,000 rpm to 20,000 rpm. Tool rotation requirements, however, can often vary between 250 rpm and 200,000 rpm depending on the medical or dental procedure. For example, root canal files need to be rotated at relatively slow speeds of between about 250 rpm and about 500 rpm. Dental drills may be rotated in a range of about 2,000 rpm to about 4,000 rpm. Diamond burrs, for example, used for cleaning, shaping or polishing work in the dental field ideally rotate at relatively high speeds. These speeds may reach 150,000 rpm to 200,000 rpm or above. To achieve a wide range of different speeds, given the relatively limited speed range of a motor, different gear heads are purchased by end users to step-up (i.e., multiply) or step-down (i.e., reduce) the final output speed of the instrument or tool according to the needs of the user. This typically requires the purchase of a number of different, and expensive, gear heads. In addition, the output speed displayed on the motor controller typically relates only to the motor output and thus the actual final tool speed must be separately calculated by the user depending upon the specific gear ratio of the chosen gear head. These calculations can be error-prone.
In view of these and other problems in the art, it would be desirable to provide a medical and/or dental instrument for rotating a tool that can reduce or eliminate the need for several different gear heads to perform a number of different medical or dental procedures.

Rotatable medical and/or dental instrument having a variable speed transmission


Described herein is a metal construction component, such as a metal framing component, which includes a metal stud, having a length, a width, and a height. The metal stud may comprise a first end, a second end opposite the first end, a first side, a second side, a third side, a first edge, and a second edge. The metal stud may also comprise an indicia comprising a plurality of indicium evenly spaced according to a measurement convention along a theoretical measurement line. The theoretical measurement line may be substantially parallel to at least one of the first edge and the second edge.

Metal construction components, which includes metal studs, are usually provided in standard lengths, e.g. 12 foot, 10 foot, 9 foot or 8 foot. Some metal construction components are cut to length at the job site.
The traditional method of cutting metal construction components, such as metal studs and other metal construction components involves using a tape measure across the length of a metal construction component, marking it, then field cutting.
Not only is this method unwieldly and time consuming it can be highly inaccurate. The longer the metal construction component, the more inaccurate the measurement becomes when the tape measure is not kept exactly aligned with the edge of the metal construction component or the mark is just a little off.
Excessive variation leads to scrapping the cut metal construction component and re-cutting new pieces resulting in higher material costs, more time, and more field labor.
There exists therefore the need to have a more accurate method of measuring and cutting a metal construction component. The problems associated with using a tape measure and marking tools as noted in US200810975. As described, laying out various structures for the building industry require a tradesperson to use various tools such as a construction square, tape measure, and marking tools, to locate the desired member locations. Marking these locations is time consuming and may, depending on the size of the project, require more than one person to complete the task. The use of mechanical devices needed for the measuring and marking of a member location often lead to errors requiring rework or nonstandard installation of the members.
While US20080201975 recognizes the problems inherent with using a tape measure and marking, US2008021975 addresses these problems during the layout of the studs relative to each other. US2008021975 does not address the problem as it occurs in the cutting of the studs or metal construction component in the field.
U.S. Pat. No. 5,924,213 to Lee claims a sheet construction material being rectangular in shape comprising: a grid line of line indicia positioned on said sheet construction material, said line indicia spaced ¼-inch apart and extending from one side to the opposite side of said sheet construction material, thereby forming ¼-inch squares on said sheet construction material; a pair of numerical indicia positioned along each side of the said sheet construction material and along each line indicia that corresponds to a stud line, each of the said pair of numerical indicia comprising a consecutive ascending set of numerical indicia and a consecutive descending set of numerical indicia, said ascending and descending number indicia being in 1-inch increments.
U.S. Pat. No. 5,924,213 to Lee again teaches nothing about a technique or method which eliminates the use of a tape measure and marking when cutting a metal frame component or a metal stud.

Metal framing construction components having measurement indicia


The method for fabrication of a non-symmetrical IGFET of the present invention includes providing a semiconductor substrate having an insulating film and a gate material. A first portion of the gate material overlying a first region of the semiconductor substrate is removed forming a first sidewall of a gate electrode A dopant is implanted into the first region after forming the first sidewall. After the first region is implanted, a second portion of the gate material overlying a second region of the semiconductor substrate is then removed forming a second sidewall of the gate electrode. A dopant is implanted into the second region after forming the second sidewall. Spacers are formed adjacent to each of the sidewalls of the gate electrode. Then, a dopant is then implanted into portions of the first and second regions of the semiconductor substrate outside the gate electrode and the spacers. In one embodiment of the invention, the first region is a heavily doped source region and the second region is a lightly doped drain region. In another embodiment of the present invention the first region is a lightly doped drain region and the second region is a heavily doped source region. In both embodiments, a part of the lightly doped drain region is retained beneath a spacer.

1. Field of the Invention
The present invention relates to integrated circuits, and more particularly to lightly doped drain insulated-gate field-effect transistors.
2. Description of Related Art
An insulated-gate field-effect transistor (IGFET), such as a metal-oxide semiconductor field-effect transistor (MOSFET), uses a gate electrode to control an underlying surface channel joining a source and a drain. The channel, drain and source are located in a semiconductor substrate, with the substrate being doped oppositely to the drain and source. The gate electrode is separated from the semiconductor substrate by a thin insulating layer such as a gate oxide. The operation of the IGFET involves application of an input voltage to the gate electrode, which sets up a transverse electric field in the channel in order to modulate the longitudinal conductance of the channel.
In typical IGFET processing, the source and drain are formed by introducing dopants of a second conductivity type (P or N) into the semiconductor substrate of a first conductivity type (N or P) using a patterned gate as a mask. This self-aligning procedure tends to improve packing density and reduce parasitic overlap capacitances between the gate electrode and the source/drain regions. Heavily doped polysilicon (also called polycrystalline silicon, poly-Si or poly) thin films are used as the gate electrode. Since polysilicon has the same high melting point as a silicon substrate, it can be deposited prior to source and drain formation. The polysilicon is anisotropically etched through openings in a photoresist mask to provide a gate electrode which provides a mask during formation of the source and drain by ion implantation. Photolithography is frequently used to create patterns in the photoresist mask that define the gate electrode.
Photolithographic systems often use a radiation source and a lens in conjunction with a mask or reticle to selectively irradiate the photoresist. The radiation source projects radiation through the mask or reticle to the lens, and the lens focuses an image of the mask or reticle onto a wafer. A mask transfers a pattern onto the entire wafer (or another mask) in a single exposure step, whereas a reticle transfers a pattern onto only a portion of the wafer. The three major methods of optically transferring a pattern on a mask or reticle to a photoresist coated wafer include contact printing, proximity printing and projection printing. In general, the term "resolution" describes the ability of an optical system to distinguish closely spaced objects. The minimum resolution of a photolithographic system is the dimension of minimum linewidth or space that the machine can adequately print or resolve. While optical photolithography continues to be the dominant technology because it is well established and is capable of implementing sub-micron resolution of at least 0.35 microns using current equipment, there are incentives for trying to push the current optical photolithography technology into significantly better patterning capabilities for more precise fabrication.
In recent years, with larger and larger scale semiconductor integrated circuit devices (IC's), IGFETs used as circuit elements have become scaled down. This, however, has not been simply accompanied by appropriate supply voltage scaling because interfaces between IC circuit devices must be standardized. As IGFET dimensions are reduced and the supply voltage remains constant (e.g., 3V), the electric field in the gate insulator tends to increase. If the electric field becomes strong enough, it can give rise to so-called hot-carrier effects. For instance, hot electrons can overcome the potential energy barrier between the silicon substrate and the gate insulator thereby causing hot carriers to become injected into the gate insulator. Trapped charge in the gate insulator accumulates over time and can lead to a permanent change in the threshold voltage of the device and premature dielectric breakdown.
A number of techniques have been utilized to reduce hot carrier effects. The voltages applied to the device can be decreased or appropriate drain engineering design techniques, which result in special drain structures that reduce hot electron effects, can be implemented. One such technique is a lightly doped drain (LDD). LDDs absorb some of the potential into the drain and thus reduce the maximum electric field. The drain is typically formed by two ion implants. One of these is self-aligned to the gate electrode, and the other is self-aligned to the gate electrode on which sidewall spacers have been formed. The spacers are typically oxides. The purpose of the lighter first dose is to form a lightly doped region of the drain (or LDD) at the sidewall near the channel, which can reduce the maximum electric field. The second heavier dose forms a low resistivity region of the drain, which is subsequently merged with the lightly doped region. Thereafter, electrical contacts are formed on the heavily doped region. Since the heavily doped region is farther away from the channel than a conventional drain structure, the depth of the heavily doped region can be made somewhat greater without adversely affecting the device characteristics. The lightly doped region is not necessary for the source (unless bi-directional current is used), however LDD structures are typically formed for both the drain and source to avoid the need for an additional masking step.
Disadvantages of LDDs are their increased fabrication complexity compared to conventional drain structures, and parasitic resistance. LDDs exhibit relatively high parasitic resistance due to their light doping levels. During operation, the LDD parasitic resistance can decrease drain current, which in turn may reduce the speed of the IGFET. The saturation drain current is affected little by the parasitic resistance of the drain region and greatly by the effective gate voltage drop due to the parasitic resistance of the source region. Reduction of the drain current can, therefore, be decreased by implementation of an non-symmetrical LDD-IGFET with a lightly doped region only at the drain. However, a non-symmetrical LDD-IGFET can further increase fabrication complexity.
One method for non-symmetrical LDD-MOSFET fabrication is U.S. Pat. No. 5,424,229 entitled "Method For Manufacturing MOSFET Having An LDD Structure" (Oyamatsu) which includes masking the substrate before the gate electrode is formed and leaving a window open in the mask. The lightly doped drain region is then implanted at an angle into the substrate through the window opening. The mask is removed and the gate electrode is formed in the window opening and over a portion of the lightly doped drain region. The heavily doped regions are then formed aligned with the sidewalls of the gate electrode. However, implanting doped regions at an angle into the substrate increases fabrication complexity.
Another method is U.S. Pat. No. 5,286,664 entitled "Method For Fabricating The LDD-MOSFET" (Horiuchi) wherein the gate electrode is formed and then one half of the gate electrode (on the source side) is masked with a photoresist mask. The lightly doped drain region is implanted. Then a single spacer is formed on the drain side using a liquid phase deposition (LPD) method for depositing silicon dioxide. The mask is then removed and the heavily doped regions are implanted. The LPD method however is not precise and can make controlling the thickness or size of the spacer difficult.
Accordingly, there is a need for a non-symmetrical LDD-IGFET which decreases the parasitic resistance, therefore increasing drain current, yet which can be simply and precisely fabricated.

Method for fabrication of a non-symmetrical transistor with sequentially formed gate electrode sidewalls


A laminated glass and an interlayer film for laminated glasses are provided, which have the high performance for mitigating the impact given externally and, particularly in the case of using it as glass for vehicles, and which have the high performance for mitigating the impact when a person's head comes into collision with the glass due to the occurrence of a personal accident. Also provided is a laminated glass, wherein at least an interlayer film for laminated glasses and a glass sheet are laminated and unified, Head Injury Criteria (HIC) values, measured according to regulations of European Enhanced Vehicle-safety Committee; EEVC/WG 17, being 1,000 or lower.

In recent years, there have been studied and developed systems for evaluating automobile's performance to protect pedestrians when the vehicle comes into collision with a pedestrian in advanced countries. Head portion is largest in number among body parts on which pedestrians are vitally injured in collision with an automobile. Therefore, also on a method of a head impact test for evaluating the protections of head from impact, international standards (ISO/SC 10/WG 2) and EU standards (EEVC/WG 10, ECE-Regulation No. 43 Annex 3) are defined.
For example, European Enhanced Vehicle-safety Committee; EEVC/WG 17 has proposed a test for the protections of head as a part of a test for the protections of pedestrian and has proposed a condition that a Head Injury Criteria (HIC) value, which is determined by a method according to this test for the protections of head, does not exceed 1,000 as a performance standard on automobile's safety. Further, an HIC value of 1,000 is a threshold of being seriously injured, and it is said that when the HIC value is higher than 1,000, a probability of survival of a normal human being becomes lower.
Front noses of recent automobiles have tendencies to be shortened and in the recent accidents, a location of vehicles with which the head of an adult pedestrian comes into collision is often a windshield other than a hood.
But, since the test for the protections of head of EEVC/WG 17 limits the scope of test to on the hood of the passenger cars by its definition, in the ongoing International Harmonized Research Activities (IHRA), it is considered to include the windshield in the scope of the test for the protections of adult head.
Currently, as the glass for vehicles such as automobiles, aircrafts, buildings and the like, laminated glasses are widely employed because less fragments of broken glass shatter even though the laminated glass is impacted externally and broken and therefore the laminated glass is safe. As such a laminated glass, there is given a laminated glass obtained by interposing an interlayer film for laminated glasses, which comprises polyvinyl acetal resin such as polyvinyl butyral resin plasticized with a plasticizer, between at least a pair of glass sheets and unifying them and the like.
However, many of conventional laminated glasses have the HIC value of higher than 1,000. Especially in windshields of automobiles, the HIC value is particularly high in the vicinity of a periphery of the windshield secured to the window's frame and some laminated glasses have an HIC value of higher than 2,000. Such the vicinity of the periphery of the windshield is a location with which the head of an adult pedestrian comes into collision at a high probability in the occurrence of an accident, and a laminated glass having a lower HIC value has been required in order to avoid damages to head in the collision of pedestrian with vehicles.

Laminated glass and interlayer film for laminated glasses


An exposure device, where circulating systems and for controlling a temperature varied by the driving of a linear motor are connected to a reticle stage and wafer stage, a controller sets the temperature of refrigerant circulating through the circulating system by driving heater, circulating system is connected to a projection optical system and a controller sets the temperature of refrigerant circulating through a circulating system by driving heater by a feedforward control to control the temperature of the refrigerant circulating through the circulating system.

1. Field of the Invention
The present invention relates to an exposure device and exposure method which transfer a pattern formed on a mask or reticle onto a substrate such as a wafer, and also to a device manufacturing method for manufacturing semiconductor devices, liquid crystal display devices, image pickup devices, thin-film magnetic heads, and other devices using the exposure device and exposure method.
2. Description of Related Art
In a photolithographic step, which is one of the steps for manufacturing semiconductor devices, liquid crystal display devices, image pickup devices, thin-film magnetic heads, and other devices, an exposure device is used that transfers a pattern that is formed on a mask or reticle (hereinafter, when referring to these generically, they will be referred to as masks) onto a wafer or glass or the like (hereinafter, when referring to these generically, they will be referred to as substrates) on which a photosensitive agent such as photoresist has been coated.
In recent years, step-and-repeat types of exposure device, for example, reduction projection types exposure device (what are known as steppers) or step-and-scan types exposure device are widely used. These step-and-repeat types exposure device are apparatuses that hold a substrate on a stage that is able to move freely two-dimensionally, and by moving the substrate in steps using this stage, repeatedly perform an operation in which a pattern image on a article is sequentially exposed onto each shot area on a substrate such as a wafer. The aforementioned step-and-scan types exposure device are apparatuses that, when transferring a pattern on a reticle onto a predetermined shot area on a wafer, sequentially transfer the pattern formed on the reticle onto the shot area while moving the reticle and wafer in synchronization.
In recent years, among the aforementioned devices, there have been considerable advances, in particular, in the further integration of semiconductor devices and, for example, process rules have become extremely minute at approximately 0.13 μm. As a result, exposure devices have achieved an improvement in resolution, and an improvement in the positioning accuracy of the pattern image on the reticle that is projected via a projection optical system relative onto the shot area of the wafer. Specifically, in order to improve the resolution, for example, a wavelength reduction in the wavelength of the exposure light and a high numerical aperture (NA) in the projection optical system have been achieved, while in order to improve positioning accuracy, for example, precise and rigorous control of the baseline amount is conducted.
The baseline amount is the distance between a reference point (for example, the center of the projection) of the pattern image on the reticle that is projected onto the wafer and a reference point (for example, the center of the measured field of vision) of an off-axis type of alignment sensor. In order to measure alignment marks that are formed on a wafer, a variety of alignment sensors are provided in an exposure device, and one of these is an off-axis type of alignment sensor that is placed in the vicinity of a side portion of a projection optical system. If this type of alignment sensor is used, a position that is obtained by correcting the result of a measurement by the alignment sensor using the baseline amount becomes the position where each shot area is located during an exposure. Accordingly, by accurately controlling the baseline amount, it is possible to achieve an improvement in the accuracy with which the projected pattern is superimposed on the shot area.
In the manufacture of devices in recent years, because there has been a demand for an improvement in productivity, there is a need to improve throughput, namely, to improve the number of wafers that are processed in a unit time. In order to improve throughput, in a step-and-repeat type exposure device, by raising the rate of acceleration of the wafer stage, a reduction in the time required for acceleration and deceleration is achieved. In a step-and-scan type exposure device, in addition to improving the acceleration and deceleration of the wafer stage and the reticle stage, by improving the scanning speed of the wafer stage and reticle stage during exposure, a reduction in the time required for exposure is achieved.
However, in order to improve throughput, if the rate of acceleration of the wafer stage or reticle stage is improved and acceleration and deceleration is frequently repeated, the quality of heat generated by the motor that drives the wafer stage or by the motor that drives the reticle stage is increased. Because these motors are provided inside the exposure device, each time an exposure operation is repeated there is a large variation in the temperature inside the exposure device. In a step-and-scan type exposure device, in particular, because both the wafer stage and the reticle stage are driven by motors during an exposure (i.e., during the transfer of a pattern), the rate of temperature change is considerable. A change in temperature is generated inside the exposure device not only by the motors provided in the wafer stage and reticle stage, but also when drive systems (for example, the lens drive system of the projection optical system and the reticle blind drive system) inside the exposure device are driven.
If the temperature inside the exposure device changes, a change (for example, a change in the best focus position and a change in aberration) is generated in the optical characteristics of the projection optical system. As a result, deterioration in the resolution and the like occurs and problems arise when a detailed pattern is being transferred. Moreover, because thermal expansion and thermal deformation are generated in the alignment sensors and the stages by changes in temperature inside the exposure device, there is a concern that a variation in the baseline amount (i.e., baseline drift) will occur during exposure. Because of this, the problem arises that a deterioration in accuracy occurs when the projected pattern and the shot area are overlayed. In addition, the temperature of the atmosphere surrounding the stages is raised by the heat generated by the stages, and the problem arises that the stage positioning accuracy is worsened by the effects such as fluctuations in the optical path of the interferometer that measures the positions of the stages.
Accordingly, in order to prevent reductions in the resolution, reductions in the accuracy of the overlay, and reductions in the stage positioning accuracy, it is necessary to maintain a constant temperature inside the exposure device. Because of this, conventional exposure devices are provided with a temperature sensor that detects the temperature inside the exposure device and with a temperature control device, and, based on detection results from the temperature sensor, the temperature control device conducts feedback control so as to maintain a constant temperature inside the exposure device. Either air-cooled or liquid-cooled temperature control devices may be used as this temperature control device, however, commonly, exposure devices are provided with liquid-cooled types of temperature control device as these have an excellent cooling performance.
However, using as an example an exposure device that is provided with, for example, a liquid-cooled type of temperature control device, the diameter of pipes that are used to conduct temperature-controlled coolant in the vicinity of a heat generating source such as a motor is restricted by the size of the exposure device and by space limitations inside the exposure device. Moreover, because it is clearly not possible to use any optional component as a pipe, the pressure inside the pipes is restricted and the flow rate is also limited. Furthermore, in order to perform temperature control, it is desirable that the temperature control apparatus be located extremely close to the heat generating source, however, it is not always possible to employ this type of structure due to the structure limitations of the apparatus. Accordingly, due to the restrictions of this type of apparatus structure, there is an increase in time wastage due to control.
In order for exposure devices of recent years to provide the expected performance, for example, the temperature of the wafer stage and reticle stage must be controlled within a range of approximately 1/10° C., and the temperature of the projection optical stem must be controlled within a range of approximately 1/100° C. However, if the aforementioned time wastage is considerable, then in a conventional temperature control device that only uses feedback control, it is difficult to conduct this type of high precision temperature control. Moreover, in recent years, wafer stages and reticle stages have had to increase in size to keep pace with the increase in size of wafer diameters, so that the heat capacity thereof has increased as has the thermal time constant. Furthermore, because the ability to drive the reticle stage and wafer stage at high speed is more and more in demand in order to improve throughput, the quantity of heat generated by the motors that drive the reticle stage and wafer stage is also increasing, and highly accurate temperature control in the above described temperature range has become more difficult.
It is an aim of the present invention to provide an exposure device and exposure method as well as a device manufacturing method that uses this exposure device and exposure method that result in it being possible to improve device manufacturing efficiency by maintaining the performance of an exposure device consistently at the expected performance, by performing temperature control inside the exposure device with a high degree of accuracy even if time wastage due to control does occur.

Exposure device, exposure method and device manufacturing method


The invention provides a light-emitting diode device and a method for fabricating the same. The light-emitting diode device includes a metal substrate. A light-emitting diode structure is bonded on the metal substrate. The light-emitting diode structure includes a first type semiconductor substrate and a second type semiconductor layer. The first type semiconductor layer has a first surface and a second surface opposite to the first surface. The second type semiconductor layer is in contact with the metal substrate. A light-emitting layer is disposed between the first type semiconductor substrate and the second type semiconductor layer. A portion of the second surface and a sidewall adjacent to the second surface are uneven roughened surfaces.

1. Field of the Invention
The present invention relates to a light-emitting diode (LED) device and a method for fabricating the same, and in particular it relates to a vertical LED device and a method for fabricating the same.
2. Description of the Related Art
Light-emitting diodes (LEDs) have two configurations. The LED that has electrodes arranged on the same side of an LED chip is called a horizontal LED. The LED that has electrodes arranged on the opposite sides of an LED chip is called a vertical LED. A current path flowing in and out of a semiconductor light-emitting layer of the horizontal LED needs to be turned in a direction horizontal to the LED chip. A current path can flow in and out of a semiconductor light-emitting layer of the vertical LED without turning in different directions.
The horizontal LED has disadvantages of hot spots and non-uniform current density due to the turned current path, so that the area of the horizontal LED is hard to be increased. In comparison, the vertical LED does not have over-heat portions (hot spots) or dark portions due to the uniform current density. Therefore, the area of the vertical LED could be increased. The LED chip of the LED device usually grows on a substrate wafer by an epitaxial growth method. In fabrication processes for LED devices, however, the substrate wafer needs to be cut to fabricate the individual LED chips for epitaxial layers to grow on. The loss due to the substrate wafer sawing process is high when the LED chips have a small area, and this leads to the total light-emitting area of the substrate wafer to be reduced. Also, a portion of the light-emitting layer of the horizontal LED is used for an electrode formed thereon. Therefore, the fabrication cost per light-emitting area of the vertical LED is lower than that of the horizontal LED. The vertical LEDs are usually designed as high-illumination LEDs. Additionally, the vertical LEDs have a current flow from top to bottom, which is different from a current flow in the horizontal LED. The spreading area of the current flowing in the vertical LEDs is larger and more uniform that the horizontal LED. Further, a sapphire carrier lift-off process, is required to be adopted in the conventional fabrication processes of the LED device. The sapphire carrier removal process is too complex to control the fabrication cost and yield.
Thus, a novel LED device and a method for fabricating the same are desired.

Light-emitting diode device and method for fabricating the same


The invention is directed to a piston pump for a steam iron, including a pump housing (10) provided in a housing bore (12) for receiving an axially movable piston (14), said piston (14) combining with the housing bore (13) to form a pressure generating chamber (13) connected with at least two outlets (16, 18) for at least two liquid consuming devices and with an inlet (20), said piston (14) further including a distributor bore (28) in which a distributor element (26) is rotatably mounted which includes at least one conduit (30, 32) with an inlet port (34, 36), through which conduit, in dependence upon the rotary position of the distributor element (26), one of the liquid consuming devices is supplied with pumped liquid through a connecting conduit (44) communicating with the pressure generating chamber (13). To provide a piston pump sealing tightly and being producible to more lenient manufacturing tolerances, it is proposed providing the distributor element (26) with a separate conduit (30, 32) having each an inlet port (34, 36) for each liquid consuming device, and providing a seal (40) which seals the inlet ports (34, 36) relative to each other and is adapted to be acted upon by a compressive force to effect a seal.

This invention relates to a steam iron with a pump mechanism according to the prior-art portion of patent claim 1.
From U.S. Pat. No. 3,691,660 a piston pump for a steam iron is known which feeds pumped water either to a water spray or to an extra burst of steam. The two liquid consuming devices involving the water spray and the extra burst of steam are selected in dependence upon the rotary position of a common actuator, with the same actuator being depressed to direct the liquid pumped into a pressure-generating chamber by means of an axially movable piston to one of the liquid consuming devices. For opening one of the outlets provided on the pump housing in dependence upon the rotary position of the actuator while the other outlet is maintained closed, a distributor element is inserted in a cavity of the pump housing. The distributor element is connected with the actuator in a manner preventing relative rotation and has a central bore and a radial bore extending to one side, so that the pumped liquid is directed through the central bore and the radial bore to one of the outlets. Considering that the outlets are arranged opposite each other at the same level on the pump housing, this piston pump requires plenty of mounting space in the steam iron. Further, the complex structure of this piston pump makes it relatively elaborate to manufacture, requiring relatively high manufacturing accuracy particularly in the area of the outlets between the circumferential surface of the distributor element and the opposite inner surface in order to provide an easily rotating distributor element on the one hand and a tight seal for the outlet to be closed on the other hand.
A piston pump similar to this one in respect of its basic structure is known from European patent application 497 470. In this application, two outlets equally arranged opposite each other at the same level on the pump housing are supplied with pumped liquid through a distributor element arranged both rotatably and axially displaceably in the interior of an axial housing bore. The circumferential surface of the distributor element is configured such that only one outlet at a time is opened, depending on the distributor element's rotary position. In this event, the end of the distributor element forms at the same time the piston, so that the pressure-generating chamber is formed by the cavity defined between a ball valve at the inlet of the housing bore, the piston upper surface, and a ball valve at the outlet. The dual function of the distributor element which includes the added piston function has, however, the disadvantage that a seal relative to the distributor element and the outlet to be closed demands a major manufacturing effort, because the seal is required to be effective during both rotation and longitudinal displacement of the distributor element.
From EP 0 694 646 A1 a steam iron is known which incorporates a common pump mechanism for two liquid consuming devices. An axially movable piston has a central bore communicating with one of the two liquid consuming devices in dependence upon which of the two push-buttons is pressed. By pressing one of the push-buttons, the piston is displaced on the one hand, while on the other hand a seal is urged into sealed engagement with a supply conduit leading to the non-selected liquid consuming device. As a result of the eccentric arrangement of the two push-buttons, the housing wall guiding the piston axially is subjected to one-sided wear. Moreover, this system is susceptible to incorrect operation because the two push-buttons are arranged closely side-by-side.
A steam iron with a pump mechanism of the type initially referred to is known, for example, from applicant's PV 1210 series of steam irons. FIG. 5 illustrates a longitudinal section through a piston of such a pump mechanism. This piston is axially movably mounted in a housing bore of a pump housing, not shown, for compressing a pressure-generating chamber. The piston has an axial distributor bore in which a distributor element is inserted. The distributor element has its upper end area connected with an activating element, so that an operator, in using the same activating element, displaces the piston axially by a pressing motion and the distributing element by a rotating motion.
The distributor element includes further a central conduit opening into a connecting conduit at the frontal bearing surface of the distributor bore. The connecting conduit of the piston communicates with the pressure generating chamber through a ball valve. The central conduit of the distributor element has its upper end connected with an outlet for the water spray through a radial bore, in addition to having its mid-region connected with an outlet for the extra shot of steam through another radial bore. The two radial bores of the distributor element are disposed in a 180.degree. offset relation to each other.
The distributor element of the known piston pump includes two seals arranged above and beneath the upper radial bore on the circumference of the distributor element. The distributor element is surrounded by a non-rotatably mounted sleeve having an opening each in the area of the two outlets. The sleeve and the distributor element are made of stainless steel, with the inside diameter of the sleeve and the outside diameter of the distributor element being relatively coordinated and manufactured to close tolerances in order to obtain a tight seal between the two outlets while at the same time ensuring ease of rotation of the distributor element. Accordingly, the manufacture of the known piston pump has the undesired effect of necessitating a relatively high production effort.
It is therefore an object of the present invention to provide a piston pump of the type initially referred to which involves less manufacturing effort and has in particular tightly sealed fluid paths without the need to specify close manufacturing tolerances for this purpose.


A method of preventing diffusion penetration of the dopant used to dope polysilicon gate material in a MOSFET is disclosed. Atomic nitrogen is introduced into the substrate prior to gate oxide growth. The nitrogen later diffuses upward into the gate oxide and blocks subsequent ion implanted gate dopants from penetrating to the substrate. Low dosages of atomic nitrogen implantation, while not significantly affecting gate oxide growth rate, produce significant improvements in the damage immunity of thin gate oxides.

This invention relates to methods of semiconductor fabrication and devices formed thereby.
2. Description of Related Art
As integrated circuit technology advances, the gate widths of MOSFETS become increasingly smaller. In addition, the thicknesses of the gate dielectrics, typically, gate oxides, become thinner and thinner. Very thin gate oxides are necessary for small CMOS transistors.
Often, ion implantation with boron BF.sub.2 is used to dope the polysilicon gates of surface channel PMOSFETS. However, as gate oxides become increasingly thinner, boron penetration through the gate oxide by diffusion in subsequent thermal cycles becomes a problem. Typically, the boron penetrates the gate oxide, doping the channel and adversely affecting the device threshold voltage, short channel effects, and circuit performance.
A variety of process steps have been tried to reduce boron penetration through the gate oxide. Some of these approaches have utilized nitrogen in an effort to reduce boron penetration through the gate oxide.
For example, after blanket layers of gate oxide and polysilicon have been deposited (but before the gate has been defined) nitrogen has been implanted into the polysilicon layer. It is hoped the nitrogen blocks the subsequently implanted boron. This approach is detailed in: T. Kuroi et al. 1994 Symp. on VLSI Tech., p. 107.
Another approach involves growing the gate oxide in an ambient of N.sub.2 O. This approach is detailed in Lo et al., IEEE Electron Device Letters, Volume 13, p. 111, February 1992.
A third approach involves growing a conventional gate oxide by conventional processes and then annealing the gate oxide in a nitrogen ambient. This approach is detailed in: K. Kirsch et al., IEEE IEDM, p. 325, 1994.
Nevertheless, those concerned with the development of integrated circuits processes still continually search for improved methods of reducing boron penetration.
As device dimensions scale down rapidly with the advance of VLSI technologies, the electric field in the thin gate oxides continues to increase. Part of the consequence of such increased electric field is the increased trap generation at the oxide interface or within the thin oxides. The trap generation and the capture of channel electrons by the traps in turn leads to increased low frequency (l/f) noise and transconductance (g.sub.m) degradation. For ultra-thin oxides of less than 50 .ANG., the tunneling current also becomes significant and gives rise to accelerated degradation of the device characteristics.


A liquid spray arrangement for a window has a spray nozzle which includes an inflow chamber, an interaction chamber, and an oscillator in the interaction chamber. The oscillator divides the interaction chamber into two spray channels and is caused to oscillate by the flow of a cleaning liquid, as a result of which a spray jet is sprayed onto the window alternately at two different angles. This makes it possible to increase the proportion of cleaning liquid which contributes to the cleaning of the window, and thus to reduce the volume of cleaning liquid in the storage container.

This invention relates to liquid-spraying arrangements for spraying a cleaning liquid on windows, such as motor vehicle windows, in which a spray has a liquid inflow chamber, through which cleaning liquid is received, and an interaction chamber having at least one outlet opening, through which the cleaning liquid flows out.
A liquid spraying arrangement of this type is disclosed in U.S. Pat. No. 3,973,558 which also describes an associated method for applying liquid to a window in a fan-like manner.
The disadvantage of such arrangements, however, is that very narrow channels have to be provided in order to make the water jet oscillate back and forth. Because of the desired fluid mechanics, it is not possible, with the desired volume flow, to increase the size of the channels since, otherwise, the water jet will not be made to oscillate as desired.
The disadvantage of having narrow channels is that in winter, at low temperatures, the cleaning liquid freezes very easily in the channels. If the cleaning liquid freezes in the channels, then the lack of liquid flow into the channels means that the oscillating movement of the water jet is no longer produced.
In addition, in order to prevent freezing, a nozzle of this type must be heated. Furthermore, with such narrow channels the oscillating water jet cannot be deflected in a different direction since, this would cause the desired flow effect to be lost.
A further disadvantage is that the emerging water jet is distributed over the window in a fan-like manner, i.e. the liquid is applied to a poorly defined region of the window and thus the majority of the cleaning liquid is not used for specific cleaning of the window.
U.S. Pat. No. 4,732,325 discloses a spray arrangement having a nozzle body which is mounted so that it can be tilted, the nozzle body being driven by a turbine which is caused to rotate by the water jet.
In this arrangement, the nozzle body is made to tilt by a comparatively complex and expensive mechanism. Moreover, in this case also the water jet can only be distributed in a fan-like manner.
It is not possible with this arrangement for the cleaning liquid to be sprayed alternately through two water jets which are spaced apart at an angle.