A child's seating restraint is removably anchorable to a stationary article of furniture, such as a couch, sofa, or similar furniture typically found in the household. The restraint in turn provides for the removable securing of an infant, toddler, or small child thereto, to prevent the child from falling from furniture inadvertently. The seating restraint includes a belt secured to the back portion thereof. A continuous, unitary seat bottom and seat back portion is formed of a soft, pliable, resilient and washable material such as a closed cell foam plastic. A washable fabric cover may be provided for the seat bottom and/or seat back portion of the device. A crotch strap may be attached to the belt (or beneath the seat bottom), to extend from the back of the belt (or from the seat bottom) to a front loop through which the belt portions are passed. An alternate embodiment includes at least one J-shaped hook extending rearwardly from the seat back portion for anchoring the seat back portion to a piece of furniture. Alternatively, a sheet of material extends from the seat bottom for passing around a furniture cushion to anchor the seating restraint, and therefore a child, to the furniture. The child seating restraint provides a convenient and economical method for a parent or guardian to keep track of a small child which is beginning to develop mobility, while assuring that the child does not endanger him or herself.

Field of the Invention
The present invention relates generally to seat belts, harnesses, and other restraining devices for infants, toddlers, and small children, and more specifically to a restraint which is adapted to be removably secured to an article of furniture such as a couch, chair or upholstered chair or the like. The restraint generally comprises a belt portion including furniture attachment means thereon. The belt may include a seat portion attached thereto, with the seat portion being removably attachable to the couch or chair.
Alternatively, the seat portion may include a securing device for removably securing the seat portion to a back portion of a couch or upholstered chair. In addition, two sets of straps are provided for surrounding a chair and securing the seat portion to the chair.
Additionally, a sheet of fabric is attached to a rear edge of the child seat. This sheet of fabric is laid under a seat cushion upon which the child seat is placed. The weight of the child and the child seat on the cushion anchor the sheet of material, and therefore the child in place.
An infant, toddler, or small child may be secured to the furniture by means of at least one of the restraints, to prevent the child from crawling and falling from the couch or chair.
Description of the Prior Art
Parents of small children, particularly infants who have progressed to crawling and toddlers just starting to walk, are well aware of the difficulty in keeping track of such children as they begin to explore their surroundings. Not only are there many potentially hazardous areas such children may encounter as they wander through the typical home, but the very act of climbing to or from an article of furniture may result in a fall and injury to the child.
Many parents will place a small child on a sofa, chair, or other furniture, and then become distracted by a visitor, phone call, or other task. Meanwhile, the seated child may attempt to climb down from the couch or other furnishing upon which he or she was placed. While the typical seat of such furniture may only be some eighteen inches or so above the floor, this can be a significant height for a toddler or small child, and such a small child is at risk of potential serious injury from such a fall.
Various restraints exist for infants, toddlers, and small children, ranging from infant seats for automobiles and aircraft, to playpens, to safety straps for use with high chairs, to leashes and harnesses to prevent a child from wandering while the parent or guardian is walking with the child. Yet, no suitable restraint has yet been devised to secure a toddler or small child to an existing article of furniture. Accordingly, a need will be seen for a restraint which may be removably secured to upholstered furnishing without damage thereto. The restraint comprises at least a belt which may be removably secured to an article of furniture, and may include a seat bottom and back portion as well, which may be enclosed in a washable cover, if desired. It should be noted that the present restraint is not adapted to absorb large forces, as might be encountered in a vehicle accident, but the attachment means (pins and/or ties) serve well to secure the restraint adequately to upholstered or other furniture in the home. A discussion of the prior art of which the present inventor is aware, and its differences from the present invention, is provided below.
U.S. Pat. No. 1,373,200 issued on Mar. 29, 1921 to Olaf K. Pacht describes a Seat formed of a single sheet of "stiff fibrous material" (p. 1, 1.67) which is adapted to be secured removably to a vehicle seat and to move unitarily with vehicle motion, rather than having a separate seat bottom and seat back, as in a conventional automobile seat. Straps are used to secure the device between the automobile seat bottom and seat back, and a supplemental retaining flap secures the upper edge of the seat back portion to the vehicle seat back. No restraining strap is disclosed for a person seated thereon, as provided by the present seating restraint, and the stiff material used is unlike the resilient foam or other upholstered material used for the seat bottom and back portions of the present seating restraint.
U.S. Pat. No. 2,851,084 issued on Sep. 9, 1958 to Louis Benjetsky describes a Child's Demountable Auto Seat comprising a unitary seat bottom and seat back formed of rigid and inflexible material, unlike the present seat restraint. The Benjetsky seat cannot be folded, as provided by the present seat. Benjetsky provides additional restrain bars and a chest strap, as well as rigid seat back attachment hooks, all of which are beyond the scope of the present invention, which is adapted only to secure a toddler or small child to a stationary seat in a residence or other fixed structure. Benjetsky must provide a seat which is much stronger structurally, in order to withstand acceleration forces which may be encountered in a collision. The present seating restraint is not adapted for use in automobiles.
U.S. Pat. No. 4,235,474 issued on Nov. 25, 1980 to Linda H. Rosenberg describes a Harness For Retaining A Baby In A Chair, comprising a back portion with an upper pocket adapted to fit over the back of a chair. This arrangement precludes use of the harness on a wider chair, couch, sofa, or the like, as provided by the present seating restraint. The relatively narrow strap which passes beneath the baby and between the legs provides little support for the child, and serves merely as a means of connecting a tie to the device. The tie must be secured behind the chair, rather than at the front of the child, as provided by the present invention. Also, Rosenberg fails to provide any means of attaching the lower portion of her harness to the chair, whereas the present seating restraint secures at the lower back portion thereof or at the juncture of the seat bottom and seat back portions, to better centralize the attachment forces.
U.S. Pat. No. 4,759,588 issued on Jul. 26, 1988 to Monte J. Husnik describes a Seat Belt Training Cushion comprising seat bottom and back portions hinged together. The description of a hinge to secure the two portions together implies the use of rigid materials therefor, unlike the flexible, resilient materials of the present seating. Moreover, Husnik requires use of an existing automobile seat belt assembly to secure the child within his device, as the two arms provided by Husnik are not adapted to restrain the child within the seat, but only to camouflage the automobile belts. Husnik must rely upon the existing automotive belts to secure his device, as he does not provide attachment means.
U.S. Pat. No. 4,874,203 issued on Oct. 17, 1989 to Alvera S. Henley describes a Vehicle Passenger Seat For Handicapped Persons, comprising a rigid structure including a tubular frame and/or rigid sheet metal structure, unlike the foldable, resilient material of the present seating restraint. The Henley seat includes a foot rest in all embodiments, as well as arm rests in at least some embodiments. The device requires a separate anchor in the floor of the vehicle, behind the seat, for attachment of the Henley seat in the vehicle. The present seating restraint requires no additional components secured either to the seating or to the adjacent structure, as required by Henley. Again, the present seating restraint is not adapted for use in an automobile, and thus is considerably lighter and more compact than Henley device.
U.S. Pat. No. 5,354,121 issued on Oct. 11, 1994 to Rita J. Allum describes a Support And Restraint Device For Small Child, comprising a pair of foam cushions removably enclosed in adjoining fabric pockets forming separate seat bottom and seat back portions. Two straps are provided to secure the back portion to a chair. A restraining belt and crotch strap are provided to removably secure a small child to the device, but Allum attaches the crotch strap to the upper surface of the seat cushion or lower belt, rather than to the underside for greater comfort, as in the present invention. The Allum device is unsuited for use on wide and/or upholstered furniture, due to the relatively short attachment straps and lack of provision of pins or the like to secure to an upholstered article, as provided by the present seating restraint.
U.S. Pat. No. 5,499,860 issued on Mar. 19, 1996 to Raymond Smith et al. describes a Collapsible Child Seat having a sleeve secured to the seat back portion, which passes over the back of a chair or other seat to support the device. The seat bottom is suspended from the seat back sleeve portion by a belt which passes beneath the seat bottom. The seat bottom is thus formed of a rigid material, in order to provide such suspension above the supporting chair by the belt from the seat back sleeve. The present seating restraint is adapted to be placed directly upon a chair, couch, sofa, or similar upholstered furniture which may provide sufficient length for seating more than one person. The Smith et al device is not adapted for such use, as the size of the seat back sleeve would prove impractical for attachment to such larger articles of furniture.
British Patent Publication No. 815,007 published on Jun. 17, 1959 to Norman Hartell describes Improvements In Or Relating To Seats For Infants, comprising a rigid tubular frame with laterally adjustable attachment hooks thereon. The frame includes a foot rest, unlike the present seating restraint. Such a depending foot rest would preclude the resting of the bottom portion of the frame and its associated seat bottom directly upon the underlying seat or chair surface, as provided by the present seating restraint. The seat back and bottom portions are apparently formed of hard and rigid sheets of material, as they are described as being padded. It would appear that no such padding would be required for resilient materials.
Finally, British Patent Publication No. 1,176,417 published on Jan. 1, 1970 to Wardour Imports Ltd. describes Improvements In And Relating To Infant Chairs, comprising a steel tube frame having hard plastic seat bottom and seat back panels removably clipped thereto. One embodiment includes a pair of upwardly and rearwardly disposed hooks and is adapted to be supported from a chair back or the like, similarly to other devices discussed above. The use of hooks for support of the device would require at least a rigid frame, if not a rigid seating surface, as the device would be suspended above the seating surface of the supporting chair if the supporting chair has a higher back. No other means is provided to secure the device to a supporting chair or other structure.


A lead frame structure includes: at least a die pad for mounting a semiconductor chip thereon; a plurality of suspension members mechanically connected with the die pad; and a plurality of supporting members. Each supporting member has a connection region mechanically connected with each of the plurality of suspension members for mechanically supporting the at least die pad via the plurality of suspension pins. The connection region of the supporting member has a penetrating opening portion which provides a mechanical flexibility to the connection region and which allows the connection region to be deformed toward the suspension member upon application of a tensile stress to the suspension member in a down-set process.

1. Field of the Invention
The present invention relates to a lead frame and a semiconductor device having the same as well as a method of resin-molding the same.
All of patents, patent applications, patent publications, scientific articles and the like, which will hereinafter be cited or identified in the present application, will, hereby, be incorporated by references in their entirety in order to describe more fully the state of the art, to which the present invention pertains.
2. Description of the Related Art
In recent years, the importance of the high density packaging technique for realizing an ultra-high density integration of the semiconductor device has been on the increase. In case that the semiconductor chip has a single transistor such as a power transistor, it is important to mounting a heat radiator onto the semiconductor device, even a possible reduction of the cost of the semiconductor device is strongly required. In order to satisfy both requirements for the heat radiation and the cost reduction, a "down-set" was proposed, wherein each die pad of the lead frame is depressed down or set down, so that the die pad has a lower level than the other part of the lead frame, and the semiconductor chip is thus mounted on this down-set die pad. The semiconductor device mounted on the down-set die pad is then resin-molded, wherein a bottom surface of the down-set die pad is exposed or shown from the bottom of the molding resin, so that the down set-die pad serves as a heat radiator or a heat radiation channel.
The down-set process for the die pad causes a variety of mechanical stress to the die pad, suspension pins and frame portions. In case, this mechanical stress may cause a disconnection of one or more suspension pins and/or any undesirable deformation of the frame portions.
Japanese laid-open patent publication No. 5-315499 discloses a conventional lead frame structure designed for avoiding any undesired deformation due to the down-set process. FIG. 1 is a schematic fragmentary plan view of a conventional lead frame structure designed for avoiding any undesired deformation due to the down-set process disclosed in Japanese laid-open patent publication No. 5-315499. A lead frame 101 has double frames 102 extending in parallel to each other. A plurality of die pad 103 is aligned between the double frames 102 and in a direction parallel to the extension direction of the double frames 102. Each the die pad 103 is mechanically connected through a pair of suspension pins 104 to the frames 102. Namely, the suspension pins 104 are thus positioned inside of the frames 102 and opposite outsides of the die pad 103 so as to provide a mechanical connection between the each die pad 104 and the frames 102. The each die pad 103 is also surrounded by a set of plural leads 105 which provide electrical connections through bonding wires to a semiconductor chip not shown which is mounted on the die pad 103.
The each semiconductor chip is mounted on the each die pad 103, where the die pad 103 is depressed by a die, whereby the level of the die pad 103 becomes lower than the frames 102. This process for level-down of the die pad 103 is so called to as "down-set". This down-set of the die pad 103 causes a certain increase in a distance in three-dimensional space between the die pad 103 and the frames 102. This amount of increase of the distance depends on the amount of the level down.
In accordance with this conventional technique, the suspension pins 104 are modified for responding to variation in the distance between the die pad 103 and the frames 102 upon the down-set process. FIG. 2 is a fragmentary plan view of a pair of the modified suspension pins for providing a mechanical connection with a flexibility in distance between the die pad and the frames included in the lead frame of FIG. 1. Each of the paired suspension pins 104 has a zigzag shaped portion 104a in plan view. This zigzag shaped portion provides a certain mechanical flexibility which allows a limited variation in the distance between the die pad 103 and the frames 102 upon the down-set process. This mechanical flexibility absorbs or relax a certain mechanical stress applied to the suspension pins 104 due to variation in the distance between the die pad 103 and the frames 102 upon the down-set process. This mechanical flexibility also makes it easy to accomplish the down-set process. For those reasons, the zigzag shaped portion may also serve as a mechanical stress absorption portion.
FIG. 3 is a cross sectional elevation view of the down-set die pad connected through the modified suspension pins to the frames in FIG. 1. In the down-set process, the die pad 103 is depressed by the press of the die and becomes level-down by a depth "D" form the frames 102, while having a horizontal distance "T" remain unchanged, wherein the zigzag shaped portions 104a of the suspension pins 104 are elastically deformed to show a stretch or an extension by an increase in the distance between the die pad 103 and the frames 102. After the die is released or removed from the state of pressing the die pad 103, the zigzag shaped portions 104a still remain stretched to provide substantially no mechanical stress to the frames 102. Namely, the zigzag shaped portions 104a make the frames 102 free from any undesired deformation in connection of the down-set process. The zigzag shaped portions 104a also make the suspension pins 104 free from a possible disconnection involved in the down-set process.
Consequently, the zigzag shaped portions 104a provide such both a desired mechanical flexibility and a mechanical stress absorption as to allow the down set process to make the die pad 103 become level-down from the frames 102 by a depth "D", while having the horizontal distance "T" remain unchanged, without causing any undesired deformation of the frames 102 and any disconnection of the suspension pins 104. As shown in FIG. 3, he horizontal distance "T" is defined in a horizontal direction perpendicular to the longitudinal direction, along which the double frames 102 extend.
Japanese laid-open patent publication No. 5-267539 also discloses another conventional lead frame structure designed for avoiding any undesired deformation due to the down-set process. The disclosed technical concept in connection with the counter-measure to the down-set process is substantially equivalent to the above-described conventional technique. A lead frame has a modified support bar which acts as a suspension pin for supporting a stage which acts as a die pad. The modified support bar has a stretchable s stress absorber portion which may exhibit substantially similar function as the above-described zigzag shaped portions, but which are structurally different from them. The stretchable s stress absorber portion comprises an annular portion connected to the support bar and a cross sectional portion.
Returning back to the issue of heat radiation, a heat radiation technique is important for mounting a power transistor such as MOSFET, MESFET or bipolar transistor, particularly for a vertical type MOSFET with a larger current in operation.
In parallel to the above requirement for improvement in the heat radiation structure, a possible shrinking technique of the semiconductor device or a possible increase in the packaging density of the power transistors with the lead frame are also important in view of a possible cost reduction and a possible size-down of an electron device, on which the semiconductor devices are mounted.
The present inventor confirmed the following facts. A highly stretchable material for the suspension pin is effective to avoid a possible disconnection of the suspension pin in the down-set process, but which is insufficient in hardness for the lead frame. Namely, the realization of the practically using lead frame needs sufficient hardness not only to the frames but also the suspension pins. If the suspension pin has an increased hardness, then this may cause another problem with undesirable limitation to the necessary stretchability and may allow a frequency of disconnection of the suspension pins. For those reasons, simple dependence upon selection of any stretchable material for the suspension pins are still engaged with any problems described above.
Further, as shown in FIGS. 2 and 3, the above-described conventional modified suspension pin 104 has the zigzag-shaped stretchable portion 104a which gives rise to a certain increase in the length size of the suspension pin 104. The horizontal size "T" should be sufficiently large with reference to the depth "D". Ensuring the sufficiently large horizontal size "T" of the suspension pin 104 makes it difficult to realize a desired increase in the packaging density.
As shown in FIG. 2, the size of the die pad is defined by subtraction of a double of the horizontal size of the suspension pin 104 from the horizontal distance between the paired frames 102. Increase in the horizontal size "T" of the suspension pin 104, while fixing the horizontal distance between the paired frames 102 would give rise to a certain decrease in the size of the die pad which provides a possible occupied area for the semiconductor device to be mounted on the die pad 103. The decrease in the size of the die pad results in a decrease in the packaging density of the semiconductor device. The decrease in the packaging density make it difficult to realize a desired shrinkage of the semiconductor device. Further the increase in the size of the lead frame makes it difficult to achieve an appreciable cost reduction.
A further important issue for manufacturing the semiconductor device is how to improve the return on investment. It will be preferable as an example for improving the return on investment that the same dies are commonly used for semiconductor packages of different types, for example, down-set free package, down-set packages with various depths in down set. In accordance with the above-described prior art, however, the necessary minimum length of the suspension pin would depend on the down-set, and also the depth of the down-set. For this reason, the prior art does not allow the desired common use of the same dies for a down-set variety of the semiconductor packages the prior art is unsuitable for improving the return on investment.
In the above circumstances, the development of a novel lead frame structure free from the above problems is desirable.

This patent is subject to a terminal disclaimer.

Lead frame and semiconductor device having the same as well as method of resin-molding the same


According to this invention, a fingerprint sensor is mounted for fingerprint collation, and a movable protection unit which coverts the fingerprint sensor is arranged. In fingerprint authentication, the protection unit moves to expose the fingerprint sensor. Along with movement, the apparatus is powered on and activated, and the fingerprint sensor also operates to perform collation processing. The protection unit which covers the fingerprint sensor in normal use is formed by a member capable of handwriting input. This arrangement provides an information terminal apparatus which has a collation function and enables handwriting input.

1. Field of the Invention
The present invention relates to an information terminal apparatus having a collation function using a fingerprint sensor.
2. Description of the Related Art
Information devices (e.g., a computer), communication devices, and the like generally incorporate various security systems for excluding an outsider. For example, collation using an ID (IDentity) number or ID card is done. When the user is authenticated, the apparatus is activated to perform processing work by various application software programs or allow access to a network.
In addition to the ID number, collation operation sometimes utilizes a fingerprint, as disclosed in, e.g., the Jpn. Pat. Appln. KOKAI Publication Nos. 11-185016, 2001-084062. The fingerprint of a user's finger is registered in advance. At the start of operation, the fingerprint of a user is identified, and if the user is a registrant, the subsequent operation is permitted. A general device for detecting a fingerprint is a pressure sensitive or electrostatic fingerprint sensor.
Various security measures have also been examined in portable information terminal apparatuses. Most portable information terminal apparatuses perform software collation processing by causing the user to input an ID number or keyword in activating the apparatus, and determine whether collation is successful.

Information terminal apparatus with collation function


In one embodiment, a method that can be performed on a system, is provided for preferred vender pre-transaction bidding. In one embodiment, the method comprises providing to a user one or more offers for sale of an item or service, the offers matching criteria pre-determined by one of a separate user or entity; receiving a selection of at least one offer from the user; comparing the selected offer to a set of pre-determined preferences of the user and generating and transmitting a request to one or more vendors for a counter-offer based on the set of pre-determined preferences of the user; in response to receiving one or more counter-offers, comparing the one or more counter offers to the criteria pre-determined by the separate user or entity; and providing to the user one or more of the counter-offers matching the criteria pre-determined by the separate user or entity.

Often a buyer of goods and services may be forced to choose a provider based on selection criteria other than his own. For example, an employee on a business trip may be constrained by company policy to travel on an airline other than the airline of his own preference. For example, for certain types of flights, the employee is required to fly by the very lowest cost carrier, although using that particular may be inconvenient or distasteful to the employee.
What is clearly needed is a system and method for eliciting a counter-offer from a vendor preferred by the buyer that meets the criteria for cost, quality, etc., of the goods or services provided by the vendor selected by an external party, or at least approaches such criteria within a reasonable range. For example, if a traveler books a reservation through his company on the company's selected airline, then before the tickets are paid for, said novel system and method could elicit a counter-offer from the traveler's preferred airline that meets or comes within, for example, $25 of the cost of the tickets booked with the company's chosen airline. What is further needed is a system and method for such a counter-offer to be accepted either automatically, according to certain preprogrammed rules, or manually after review by the buyer. Also, in some cases other attributes of the service, such as price, seat location, etc. may drive a change of airline. Furthermore, a third party, or some top down influence is relevant, but not necessary.

Method and system for preferred vendor pre-transaction bidding


An improved method for the efficient incorporation of a metal such as silver in a superconducting material includes blending the metal with a high temperature superconductor or precursor powder and consolidating the same into pellets. The pellets are charged directly into a heating assembly where it is melted and heated sufficiently to a uniform temperature prior to fiberization. Droplets of the melted blend fall through a collar into a nozzle where they are subjected to a high velocity gas to break the melted material into ligaments which solidify into improved flexible fibers having the metal homogeneously dis. This invention was made with Government support under a contract with the Department of Energy (DOE) and Ames Laboratory, Contract No. SC-91-225, our reference No. CRD-1272. The Government has certain rights in this invention.

1. Field of the Invention
The present invention relates in general to the addition of a metal to a superconducting material for homogeneous dispersion of the metal therein, and in particular to a new and improved method for adding silver to a superconducting material to increase the strain tolerance and conductivity thereof in the design and fabrication of magnets and similar products based on the high temperature superconducting material.
2. Description of the Related Art
In the design and fabrication of large scale magnets based on the high temperature superconducting materials, the strain tolerance of the conductor plays an important role. The cuprate superconductors by themselves have a strain tolerance that withstands only about 0.1% to 0.2% strain making fabrication of the magnet exceedingly difficult.
One way to fabricate a highly strain tolerant material is to make a microfilamentary composite based on discontinuous filaments. The filaments are separated from one another by a ductile material so that some plastic flow is possible within the matrix without breaking the superconducting filaments. One possible design is to have filaments of superconducting Bi.sub.2 Sr.sub.2 Ca.sub.1 Cu.sub.2 O.sub.8-.delta. in a silver (Ag) matrix. In the design of such a matrix, it is important that the normal barriers between filaments be thin compared to the supercurrent decay length of Cooper paris in silver or about 20 nanometers (nm), see T. Y. Hsiang and D. K. Finnemore, Phys. Rev. B 22,154 (1980) In addition, the length to diameter ratio of the superconducting filaments should be on the order of 10,000 to 1 so that there is enormous overlap area between filaments. As a consequence, the filament-to-filament current density can be low. With this aspect ratio, the conductor will have an effective resistivity in the range of 10.sup.-14 ohms (.OMEGA.) centimeter (cm) even if the silver barriers are totally normal.
Silver additions to superconducting materials have been demonstrated to have several benefits for improved superconductor performance in addition to promoting strain tolerance in the structure. These benefits appear to be related to the promotion of a controlled crystallographic orientation in the material. This structural improvement can lead to performance enhancements such as high-temperature shift of the zero resistivity temperature (T.sub.C), and an increase in critical current density (J.sub.C), as described in the article by Y. Matsumoto, et al, "Origin of the Silver Doping Effects on Superconducting Oxide Ceramics", Appl. Phys. Lett. 56(16), 1585 (1990).
The general idea of using silver to provide regions of plastic flow and using overlap areas of the superconducting filaments to overcome the weak link problem seems very promising but it has been difficult to fabricate composites having the desired geometry. Various methods have been used to make Bi.sub.2 Sr.sub.2 Ca.sub.1 Cu.sub.2 O.sub.8-.delta. /Ag composites. In possibly the most straight forward and successful approach, Sato, et al, IEEE Trans. Magn. MAG-27, 1231 (1991), has demonstrated that a multifilamentary conductor composed of 123 monolithic ribbons in a composite degrade only about 30% with a bending strain of about 0.7%. For these samples, there is a high degree of texturing and considerable anisotropy in J.sub.C.
Other attempts to form high T.sub.C superconducting wire with a high strain tolerance has used the "powder in a tube" approach. However, these efforts have met with modest success. In this case, silver was dispersed through the matrix by micro-milling powders followed by composite consolidation using various metal working steps. An important requirement for this technique to be successful is that the particle size of the powders be exceedingly fine. This is necessary so that the subsequent sintering process yields an integral superconducting structure.
A reliable means of dispersing silver within the superconducting composite has not been described in literature. Current methods are time-consuming involving several process steps to incorporate the silver within the structure. In addition, obtaining a homogenous distribution of silver has proven difficult.
Thus, there is a need for a processing technique for efficient incorporation of silver in a superconducting material to increase the strain tolerance of the conductor to make it suitable for use in large scale magnets.

Efficient incorporation of silver to improve superconducting fibers


Data-outputting buffer circuit suitable for reducing noise which is generated in an output buffer circuit part when minus electric filed is applied to a data output pad in inputting data is disclosed, including a noise generation restraining part detecting a level of a signal applied to an input/output pad inputting and outputting data for outputting first and second noise generation restraining signals, a pullup transistor having a source connected to the input/output pad and a drain electrode connected to a power voltage terminal, a pulldown transistor serially connected to the pullup transistor with both sources of the pullup and pulldown transistors connected to the input/output pad, first and second driving parts for driving the pullup transistor and the pulldown transistor, and a clamp transistor turned on by the first noise generation restraining signal for restraining increase of substrate bias due to voltage difference between a gate and the source of the pullup transistor.

1. Field of the Invention
The present invention relates to data-outputting buffer circuits and, more particularly, to data-outputting buffer circuits suitable for reducing noise which is generated in an output buffer circuit part when minus electric filed is applied to a data output pad in inputting data.
2. Discussion of the Related Art
Buffer is a temporary memory spot where data are received and transmitted between two apparatuses or two programs having different rates and different units for processing data. It functions as a gate delaying signal transmission in logic circuits temporarily.
In semiconductor memory devices, a data-outputting buffer circuit serves to output data read from a memory cell to an external chip. Applied to semiconductor memory devices with high integration and high speed operations, it accompanies noise in operation of outputting data. One of main reasons for noise is big peak current which is generated when a big-sized transistor placed in output terminal of the data-outputting buffer circuit performs shift operation.
A conventional data-outputting buffer circuit will be discussed with reference to the accompanying drawings.
As shown in FIG. 1, a conventional data-outputting buffer circuit is structured to include a pullup transistor 2 and a pulldown transistor 3 which are serially connected to each other and have both source and drain connected to an input/output pad 1, a clamp transistor 4 having a gate electrode connected to a Vss terminal and a drain electrode connected to the gate electrode of the pullup transistor 2, a first driving part 5 composed of a PMOS M5 and an NMOS M4 serially connected to each other, and connected to the pullup transistor 2 through a noise-reducing resistor R1 for driving the pullup transistor 2, a second driving part 6 connected to the gate electrode of the pulldown transistor 3 through a noise-reducing resistor R2 for driving the pulldown transistor 3, and an input buffer 7 connected to the input/output pad 1 for inputting data.
The drain electrode of the pullup transistor 2 is connected to the Vcc terminal and the source electrode of the clamp transistor 4 is connected to both the input/output pad 1 and the drain electrode of the pulldown transistor 3. The second driving part 6 is composed of an inverter for inverting DOUT signals and then applying them to the pulldown transistor 3.
A data-outputting buffer circuit having the foregoing structure uses the input/output pad 1 for both inputting and outputting data.
When a data of a low level, that is, 0.8 -1V as for a fDRAM, is applied through the input/output pad 1, minus electric field is applied so that a voltage is generated between the gate electrode and source electrode of the pullup transistor (M2) 2. It is because the gate electrode of the pullup transistor 2 has ground potential GND. If the gate and source voltage of the pullup transistor 2 is bigger than V.sub.T, the pullup transistor 2 is turned on. At this time, since big is the difference of the voltages of the source and drain of the pullup transistor 2, there is generated hot carrier in a channel region so that current flows toward substrate potential V.sub.BB of the pullup transistor 2 to heighten the potential of the substrate bias. The clamp transistor 4 serves to prevent the increase of the potential of the substrate bias.
Since the output buffer should keep high impedance while data is being transmitted or received, the gate electrodes of the pullup and pulldown transistors 2 and 3 should keep the ground potential GND. In other words, the DOUT signal keeps a high level.
When the clamp transistor 4, turned on by minus potential applied to the input/output pad 1, discharges charge accumulated in the gate electrode of the pullup transistor 2 toward the input/output pad 1, the charge is again supplied from the source electrode of the first driving part 5 to the gate electrode of the pullup transistor 2, thereby generating noise. To restrain noise, a resistor R1 serves to reduce noise.
Since potential difference between the gate and source of the pullup transistor 2 can be reduced when the level of minus voltage of the input/output pad 1 is declined to the threshold voltage of the clamp transistor 4, temporary turn-on of the pullup transistor 2 can not be prevented.
When the clamp transistor 4, turned on by minus potential applied to the input/output pad 1, discharges charge accumulated in the gate electrode of the pullup transistor 2 toward the input/output pad 1, the charge is again supplied from the source electrode of the NMOS M4 of the first driving part 5 to the gate electrode of the pullup transistor 2 so that the resistor R1 delays the charge accumulating time of the gate electrode of the pullup transistor 2 in outputting data, thereby causing the delay of pull-up operation. Therefore, there can not be effectively refrained noise which is generated by the increase of potential of the substrate bias generated due to a big difference between the drain and source of the pullup transistor 2.


An amplifier GaAs MMIC for microwave band applications includes a ground electrode 8 having a via hole group 12 composed of three via holes 11 filled with plated metals 10a that are formed adjacently. The interaction thereby generates high frequency electromagnetic bonding, which reduces the ground inductance. According to the MMIC, the ground inductance of the via hole may be reduced while decrease of a strength and increase of a size being restrained.

The present invention relates to a semiconductor device, a manufacturing method thereof, and a monolithic microwave integrated circuit, and more specifically to a semiconductor device and a manufacturing method thereof suitable for MMIC (monolithic microwave integrated circuit) and the like for microwave and millimeterwave band applications.
In view of improving gain and stability of MMIC (monolithic microwave integrated circuit), a via hole technology is essential for compound semiconductor MMIC because via holes may decrease ground inductances.
For example, a technology for forming a via hole from the surface of a semiconductor has been disclosed in Japanese Patent Laid-Open Publication No. HEI 7-135210. Detailed description will be given of the case where this prior art technology is applied to a GaAs HBT (hetero-junction bipolar transistor) MMIC for microwave band application shown in FIG. 28 as an example.
FIG. 28 is a plane view showing a structure of the prior art technology applied to an amplifier GaAs HBT-MMIC for microwave band application composed of a semiconductor device.
As shown in FIG. 28, the amplifier GaAs MMIC for microwave band application is composed of a first HBT element 101a, a second HBT element 101b, a third HBT element 101c, an MIM (metal-insulator-metal) capacitor 102, a spiral inductor 103, a resistive element 104, an input pad electrode 105, an output pad electrode 106, pad electrodes for HBT element control 107a and 107b, and a ground electrode 108.
A via hole manufacturing method by the prior art technology is applicable to the ground electrode 108 in the vicinity of the first HBT element 101a.
FIGS. 29 to 32 show conventional process for manufacturing semiconductor devices in sequence as disclosed in the above document.
In this manufacturing process, first as shown in a cross sectional view of FIG. 29, there are formed a ground electrode 108 and an emitter electrode 111, and then a first resist film 112 having an airbridge interconnection pattern is formed. Next, a first feeding layer 113 is formed on the entire surface.
Next as shown in a cross sectional view of FIG. 30, there is formed a second resist film 114 having a via hole pattern. Then as shown in a cross sectional view of FIG. 31, the first feeding layer 113 and a substrate 115 are etched down with the second resist film 114 used as a mask to form a via hole 116.
Next as shown in a cross sectional view of FIG. 32, a second feeding layer 117 is formed, and then electrolytic plating is executed with use of a third resist mask 118 having a specified pattern to integrate an airbridge interconnection 119 and an interconnection inside the via hole 116.
Next as shown in a cross sectional view of FIG. 33, with the substrate 115 being attached to a support substrate (unshown), the back surface of the substrate 115 is etched away till a plated metal inside the via hole 116 is exposed. Further, a backside electrode 120 is formed on the entire surface to complete a compound semiconductor MMIC as shown in FIG. 28.
However, in the prior art technology, only a single via hole 116 is formed in each ground electrode 108 connected by the airbridge interconnection 119. Accordingly, reducing a ground inductance without changing an aperture area of the via hole 116 requires plating of a thicker metal film inside the via hole 116.
However, in the prior art technology, the airbridge interconnection 119 is plated and formed together with the metal film inside the via hole 116, which makes the thickness of a plated metal film forming the airbridge interconnection 119 larger. As a result, the third resist mask 118 is also required to be a thick negative resist.
However, usage of a thick negative resist for the third resist mask 118 causes such problems as deterioration of alignment precision and difficulty in obtaining apertures of fine line patterns.
Therefore, usage of a thick negative resist is not suited for the interconnection patterns that require alignment precision and fine lines like airbridge interconnections. This makes it impossible to increase the thickness of the plated metal inside the via hole 116, which gives the prior art technology a limit of reducing the ground inductance of the via hole.
Here, forming the airbridge interconnection 119 prior to forming the via hole 116 may be considered as a candidate solution.
However, reducing the ground inductance of one via hole 116 requires increase in thickness of a plated metal film, which causes large difference in thickness between a plated metal film forming the airbridge interconnection and a plated metal film in the vicinity of the via hole 116. As a result, unevenness on the front surface of the substrate 115 becomes larger, and therefore in etching the back surface of the substrate 115 while the front surface being attached to the support substrate, external force is concentrated at a part of the semiconductor substrate 115. As a consequence, there are caused problems that semiconductor substrates are broken or inclined, thereby affecting precision of the substrate thickness.
In addition, when an aperture area of the via hole is increased for reducing the ground inductance, an area of an MMIC chip is also increased, which prevents downsizing.

Semiconductor device with via hole group generating high frequency electromagnetic bonding, manufacturing method thereof, and monolithic microwave integrated circuit


A parallel processing shrinking key generator is provided. The parallel processing shrinking key generator includes: a selection linear feedback shift register (LFSR); a source LFSR; a selection logic circuit for selecting one of a source bit of the source LFSR and a predetermined input bit according to a selection bit of the selection LFSR; an index counter for assigning an index where output bits of the selection logic circuit are stored at a next clocking of a clock signal; and an output amount register for shifting an output bit of the selection logic circuit according to the assignment of the index counter.

1. Field of the Invention
The present invention relates to a parallel processing shrinking key generator, and more particularly, to a shrinking key generator for providing a high speed key generation by configuring a parallel processing logic with a 2:1 multiplexer.
2. Description of the Related Art
FIG. 1 is a block diagram illustrating a conventional shrinking key generator.
As show in FIG. 1, the conventional shrinking key generator includes a selection linear feedback shift register (LFSR) 1 for shifting a selection bit according to an inputted clock signal (Clock); a source LFSR 2 for shifting a source bit according to the clock signal (Clock); a sequential processing logic 3 having a multiplexer 31 for sequentially processing the selection bit of the selection LFSR 1 and the source bit of the source LFSR 2, and logic elements 32, 33; and an output amount register 4 for storing output bits of the sequential processing logic 3.
Hereinafter, operations of the conventional shrinking key generator of FIG. 1 will be explained in detail.
The conventional sequential processing logic 3 is easy to be implemented as hardware but a speed of generating key in the conventional sequential processing logic 3 is unusually slow. However, a parallel processing logic according to the present invention may be difficult to be embodied as hardware but quickly generates a key. A parallel processing logic is embodied as hardware by combining logical elements, such as AND gate or OR gate, based on a Boolean Algebraic characteristic of a parallel processing algorithm. That is, a combinational logic is used for embodying the parallel processing logic. In case of a shrinking key generator, a non-boolean algebraic key generation algorithm is used. Since the non-boolean algebraic key generation algorithm does not have the boolean algebraic characteristic, it is impossible to use a parallel processing logic for embodying the shrinking key generator as hardware up to now.
The shrinking key generator has been spotlighted as the most reliable algorithm for encoding/decoding data in a view of a security because there are no specific attacking methods reported or introduced. The shrinking key generator is generally selected when a high-speed key generation is not required. Although the shrinking key generator provides excellent reliability, the shrinking key generator is not selected for a system requiring an Mbps-level data processing speed because of slow speed of key generation. According to development of a wireless data link having wide-bandwidth and a fast Codec processing technology, a high-speed processing technology is also required for encoding and decoding data.
Conventionally, behavioral hardware description language (HDL) codes were not synthesized. According to development of a synthesis tool, many of Behavioral HDL codes, such as a conditional statement and a repetition statement, can be synthesized without problems. However, there are many difficulties still remained to synthesize Behavioral HDL codes, i.e., operation statements related to a pointer index, because of instabilities in an ineffective use of a Cell and a timing simulation. In order to express a selection logic of a shrinking key generator, operations related the pointer index and operations related to a dynamic memory assignment must be expressed as the Behavioral HDL codes by using the synthesis tool. Therefore, it is impossible to express the selection logic of the shrinking key generator having the non-boolean algebraic characteristic as HDL codes and to synthesize the HDL codes by using the synthesis tool.

Shrinking key generator for parallel process

Electronics and Telecommunications Research Institute


A semiconductor device with a structure having superior heat sink characteristics. A first heat sink member is located over a wiring board by using an adhesive material. A semiconductor element is stuck over the first heat sink member by using an adhesive material. The semiconductor element and electrodes located over the wiring board are connected by wires. A second heat sink member which covers the semiconductor element and the wires is joined to the first heat sink member by using a conductive adhesive material. The inside and outside of the second heat sink member are sealed by resin except a flat top thereof. By doing so, the semiconductor device is fabricated. Heat which is generated in the semiconductor element and which is transmitted to the first heat sink member is released from an edge portion of the first heat sink member. In addition, the heat which is generated in the semiconductor element and which is transmitted to the first heat sink member is transmitted to the conductive adhesive material and the second heat sink member and is released from the flat top of the second heat sink member.

(1) Field of the Invention
This invention relates to a semiconductor device and a method for fabricating such a semiconductor device and, more particularly, to a semiconductor device with a heat sink mechanism and a method for fabricating such a semiconductor device.
(2) Description of the Related Art
The semiconductor integrated circuit element which is a kind of semiconductor device includes electronic circuits formed by interconnecting active elements, such as transistors, and passive elements, such as capacitive elements, formed on a semiconductor substrate made of silicon or gallium arsenide.
To stabilize the operation of electronic circuits, a semiconductor integrated circuit element (semiconductor element) is sealed by an insulator, such as resin, or is put into a container hermetically sealed.
With such a semiconductor device, it is necessary to radiate heat which is generated in a semiconductor element at the time of the operation of electronic circuits to the outside.
For example, a heat sink structure shown in FIG. 40 has traditionally been used for radiating heat.
FIG. 40 shows a semiconductor device 400 of what is called a ball grid array (BGA) type.
FIG. 40A shows the top of the semiconductor device 400 and FIG. 40B shows a section along lines X-X of FIG. 40A.
With the semiconductor device 400, a semiconductor element 403 is mounted over a wiring board 401 with an adhesive material 402 therebetween. Electrodes of the semiconductor element 403 are connected to terminals 401a located over the wiring board 401 by bonding wires 404.
In addition, a heat sink member (heat spreader) 406 stuck over the wiring board 401 by an adhesive material 405 is located over the semiconductor element 403 so as to cover the semiconductor element 403.
A sealing resin 407 is located between the heat sink member 406 and the semiconductor element 403 and an outer side of the heat sink member 406 is covered with the sealing resin 407.
On the other hand, a plurality of solder balls are located on or under an other surface of the wiring board 401, that is to say, on or under a surface of the wiring board 401 opposite to the surface over which the semiconductor element 403 is mounted as external connection terminals 408.
With the semiconductor device 400 having the above structure, heat generated in the semiconductor element 403 is transmitted to the heat sink member 406 mainly via the sealing resin 407 which covers the semiconductor element 403, and is released from a top 406a of the heat sink member 406 to the outside.
In addition to the above semiconductor device, a semiconductor device of the BGA type (see Japanese Patent Laid-Open Publication No. 2000-294694) in which a first heat sink member is located on the side of a top of a semiconductor element mounted over a wiring board and in which a second heat sink member which pierces the wiring board is located on the side of the reverse of the semiconductor element or a semiconductor device (see Japanese Patent Laid-Open Publication No. 2005-109526) in which a semiconductor element located between a pair of flat-plate heat sink members with solder or the like therebetween is sealed by resin is proposed as a semiconductor device with a heat sink mechanism.
With the above-mentioned semiconductor device of what is called the BGA type, most of the surface of the wiring board 401 where the semiconductor element 403 is mounted is covered with the sealing resin 407 in order to physically and chemically protect the semiconductor element 403 and the heat sink member 406 which covers the semiconductor element 403.
However, the thermal conductivity of the sealing resin 407 is comparatively low. This contributes to a decrease in the efficiency of heat sink of heat generated in the semiconductor element 403 to the outside via the heat sink member 406.

Semiconductor device and method for fabricating the same


A cable end holding device for holding a cable end of a cable for a crimp process includes a cable holding element for holding the cable end and a vertical position alteration device having two lever elements for altering the vertical position of the cable holding element in a manner decoupled from a movement of a stamp during the crimp process. The lever elements extend mutually parallel along a longitudinal direction of the lever elements and are arranged mutually offset in height and in a width direction perpendicular to the vertical and perpendicular to the longitudinal direction. The lever elements each are rotatably mounted about a first axis of rotation extending along the width direction, the two first axes of rotation extending mutually parallel.

A large number of cable assembly machines or cable end holding devices for holding a cable end of a cable are known. FIG. 10 is a plan view and FIG. 11 is a side view of a known cable assembly machine having a press 5′ or crimp press comprising an anvil 27′ and a stamp 24′ for connecting a contact element 26′ to a cable end or comprising a cable end holding device according to the prior art. The cable assembly machine comprises two additional stations 6′, 6″ at which the cable or the cable end can be further modified.
Cable assembly machines having pivot arms, such as are known for example from EP 2 937 953 B1, comprise a cable end holding device 1′ for holding a cable end of a cable. In this context, the cable end is held by vertically movable gripping heads or holding elements so as to position the cable end in the correct vertical position with respect to the press tool. These gripping heads or holding elements are mounted resiliently and are lowered synchronously with the press by way of a plunger 7′ on the contact press. The cable is supplied by a cable guide 3′. The processing sequence starts with cutting the cable in the blade block 4′.
The cable end, the cable tip, is also stripped over a predetermined length while in the blade block 4′. In this context, stripping blades are closed sufficiently that the insulation is sufficiently cut but the metal conductor of the cable or of the cable end is not damaged. By means of a hoist drive, which acts in the direction of the cable axis, the pivot arm 2′ having the gripper is pulled away from the stripping blade. The occurring forces can sometimes be 400 N, and in the prior art this was absorbed by reinforcements in the gripper receiver or in the holding element, but this leads to a high mass inertia of the pivot arm 2′ or of the cable end holding device.
After the stripping, the cable end is pivoted toward the press 5′. The pivot arm 2′ has a pivot drive for this purpose. Since the cable end or cable tip and the gripper or holding element do not have any drive of their own for the movement in the Z direction (the vertical direction), a clear corridor is created through which the cable end or the cable tip can be turned or pivoted into the operating positions. This movement extends horizontally between the stamp and the protruding parts of the contact on the anvil. Usually, the calibration is performed in such a way that the cable end is closer to the protruding parts of the contact than to the stamp.
A large number of different pressing tools are known, which differ among other things in the height of the anvil. Likewise, the length of the protruding parts of the contacts may differ from product to product. Depending on which pressing tool and which contact are used, in the event of a change of product the height of the processing stations needs to be reset by way of a height adjustment system 8′, so as to ensure the clear corridor. When the product is set up, the plunger 7′ is set in such a way that it contacts the gripper or holding element that holds the cable end as soon as the stamp reaches the desired distance from the cable end. Since this is carried out manually afresh for each product, this setting is a known source of error.
At the start of the pressing process, the cable end or the cable tip is located between the stamp and the protruding parts of the contact. The press 5′ now moves the stamp and the plunger in the negative Z direction (in other words downward in the vertical direction) toward the cable end or the cable tip. The flanks of the stamp enclose the cable end or the cable tip. Once the set distance between the stamp and the cable end is reached, the press 5′ moves the stamp and, via the plunger 7′, the gripper or holding element having the cable end toward the anvil and the contact in the negative Z direction. In its continuing progression, the cable end comes to be positioned in the dip in the contact part, during which the protruding parts of the contact are deformed by the stamp. Since the plunger 7′ can be set only for a relative distance between the stamp and the cable end, the cable is located below the position of the contact when the stamp reaches the end position thereof. The cable is thus overcompressed or bent. In cables, in particular cables of relatively small cross section, this overcompression carries the risk of the cable end being pulled out of the connection. After the pressing is complete, the pressing tool is opened and the cable end is pivoted back. Once the desired length of the cable has been supplied, the blades in the blade block 4′ cut the cable. The rear end of the cable that has been cut to size is likewise processed as described above, a second pivot arm means or cable end holding device and a second press being present on the opposite side of the blade block 4′.
Thus, in each case the anvil has to be adapted to the vertical position at which the cable end or cable tip is located. In addition, in the prior art, the tools in each case have to be set to a height such that a clear corridor occurs at the same height when the gripper or cable holding element turns.

Cable end holding device for holding a cable end of a cable, method for positioning a cable end of a cable, and cable assembly machine for assembling a cable


A device for holding an LCD display includes a substantially U-shaped support adapted to stably rest upon a flat surface, the support having two upright arms; a fastening plate threadedly secured to the LCD display; and a hollow coupling extending rearward of the fastening plate, the coupling comprising two vertically aligned first holes proximate one side, two vertically aligned second holes proximate the other side, a first threaded hole at one side, and a second threaded hole at the other side. The arms are adapted to pass through the first and second holes, a first fastener is adapted to drive through the first threaded hole to secure to one arm, and a second fastener is adapted to drive through the second threaded hole to secure to the other arm.

1. Field of Invention
The invention relates to LCD (liquid crystal display) display holders and more particularly to such an LCD display holder having a sliding coupling with improved characteristics.
2. Description of Related Art
Conventionally, a holder is provided for supporting a computer monitor (e.g., LCD display) on the desk. However, most conventional LCD display holders are not structural strong. Thus, the conventional LCD display holders are subject to damage after a short time of use. Thus, a need for improvement exists.

LCD display holder with sliding coupling


Provided is stretchable electronics. The stretchable electronics includes stretchable substrate, first support patterns disposed on a first surface of the stretchable substrate, and output devices disposed on the first patterns, respectively. The first support patterns are arranged in a first direction and a second direction, which are parallel to an extension direction of the substrate, and each of the output devices generates an output stimulation.

The present disclosure relates to stretchable electronics and a method for fabricating the same.
The tactile sense refers to the various senses felt through human skin. The various types of tactile receptors present under the skin treat various sensations such as a pressure, texture, a temperature, and pain, which are felt on the skin. Electro-skin technologies that make feeling of various senses may be expected to be applicable to various industrial fields such as AR/VR fields that provide various senses in virtual environment similar to real world, bio-diagnosis/treatment requiring human tactile ability, healthcare system such as health and medical care such as surgical soft robot, disaster/structure, defense industry, and the like. Thus, stretchable electronic skin, which is similar to human skin, senses tactile information, and outputs the sensed information to the skin, is needed.
To treat various senses such as a pressure, texture, a temperature, and pain felt on the skin, a tactile sensor technology similar to the human skin sensory receptor and an actuator technology capable of transmitting and outputting various senses to human through the skin have to be fused into stretchable electronic skin.
Also, the human skin has an array of sensory receptors, which senses the physical quantities of various senses, and the electronic skin has also to be mounted in the elastic skin of the electronic circuit to be acquired and treated from the tactile sensors that perform such a function.
Thus, there is a demand for the development of an elastic skin element having a sensor that senses a variety of tactility similarly to the actual skin structure of a person, and an actuator capable of transmitting and outputting the sensed tactility to the human skin.

Stretchable electronics and method for fabricating the same


This circuit permits M-sequence signals to be generated and decoded very fast while using relatively low power, low speed circuitry components.

1. Field of the Invention
This invention is directed to a circuit for generating and decoding sequences of signals, in general, and to the high speed generation and decoding of M-sequence signals, in particular, while using relatively slow circuit components.
2. Prior Art
There are many instances where particular sequences of signals, referred to as M-sequence signals, are required. In typical applications, the M-sequence signals are used in spread spectrum techniques to provide randomization of the data which is to be transmitted. This type of operation reduces the risk of interception and understanding of the transmitted data by unauthorized receivers. Also, the code sequence may be utilized to prevent loss of intelligible information due to jamming. Moreover, an M-sequence circuit guarantees a large number of signal transitions, e.g. binary 1's to binary 0's and vice versa.
These techniques have been used for some time and circuits for generating the sequences, encoding the sequences and/or decoding the sequences are known in the art. However, one of the problems with M-sequence signal generation for spread spectrum communication is that the sequence must be generated at very high signal rates. This tends to be difficult and costly with today's technology. That is, the circuit components which are presently available are relatively slow in operation, even though the circuits can operate in the near megahertz (MHz) range. However, in many instances it is necessary and/or desirable to operate the M-sequence generating circuitry of the type described herein in the gigahertz (GHz) range. Unfortunately, the technology currently available is unable to perform this high speed operation economically.
While it is possible and, perhaps, likely that future technology will become available to operate in this speed range, alternative approaches must be designed at this time to permit the gigahertz range of operation with the megahertz range equipment. The invention described hereinafter accomplishes this operational capability.

High speed M-sequence generator and decoder circuit


The invention provides an aqueous ink containing a self-dispersible pigment having a carboxylic acid group bonded directly or through another atomic group to a particle surface of a pigment and a lactone group bonded to the particle surface of the pigment, wherein, as determined by a selective neutralization method, an introduced amount of the carboxylic acid group is 0.60 mmol/g or more and a ratio of an introduced amount (mmol/g) of the lactone group to the introduced amount (mmol/g) of the carboxylic acid group is 0.20 time or less.

Field of the Invention
The present invention relates to an aqueous ink, an ink cartridge and an ink jet recording method.
Description of the Related Art
An ink jet recording method can conduct recording on various recording media. Various kinds of inks such as, for example, an ink suitable for recording an image having photograph-like quality on glossy paper and an ink suitable for recording a document on plain paper for purpose of recording a better image have been proposed according to its purpose. In recent years, the ink jet recording method has also been utilized for printing a business document including characters and diagrams using a recording medium such as plain paper, and utilization frequency to such use has remarkably increased. In such use, it is required to more improve an optical density of an image recorded and reliability of an ink used.
It is advantageous from the viewpoint of improving the optical density of the image to use a self-dispersible pigment as a coloring material of the ink. When the self-dispersible pigment is used as the coloring material of the ink, it is favorable that the dispersion stability of the pigment in the ink is secured, and moreover the pigment is aggregated immediately after the ink is applied to a recording medium. In addition, after the ink has been applied to the recording medium, the pigment is favorably caused to exist on the surface of the recording medium as much as possible by permeating a liquid component such as water into the recording medium. Therefore, a self-dispersible pigment with an anionic group introduced in plenty into a particle surface of the pigment is favorably used. When such a self-dispersible pigment is used, the pigment can be stably dispersed in the ink by repulsive force between anionic groups. In addition, after the ink has been applied to the recording medium, the dispersed state can be unstabilized by vanishment of the repulsive force between anionic groups which is caused by evaporation of water, thereby immediately aggregate the pigment. From the viewpoint of achieving both good dispersion stability in the ink and improvement of an optical density of an image by acceleration of pigment aggregation in the recording medium, a carboxylic acid group is favorably selected as the anionic group introduced to the particle surface of the pigment.
Various type pigments are known as the self-dispersible pigment to which the carboxylic acid group has been introduced and roughly divided into an oxidation type and a surface modification type according to the production processes thereof. The oxidation type self-dispersible pigment is obtained by subjecting a pigment to an oxidation treatment with ozone gas or hypochlorous acid (see Japanese Patent Application Laid-Open No. 2003-535949). The surface modification type is obtained by chemically treating a pigment with a compound having an anionic group, such as a diazonium salt or a hydrazine compound (see Japanese Patent Application Laid-Open No. H10-510862 and Japanese Patent Application Laid-Open No. 2012-528917). There is further a self-dispersible pigment obtained by bonding a carboxylic acid group to a pigment by an oxidation treatment and then further bonding a functional group having a lactone group at a terminal thereof (see Japanese Patent No. 5085868).
When an image where a region recorded by an ink containing a self-dispersible pigment and a region recorded by another ink adjoin each other is recorded, bleeding is generally eased by the following recording control. That is, after repulsive force between anionic groups of the self-dispersible pigment has vanished, and the self-dispersible pigment has start to aggregate in a recording medium, another ink is applied, thereby preventing the self-dispersible pigment from flowing into the region recorded by another ink. However, when a region where an application amount of an ink is large, such as a multi-order color image, is recorded adjoiningly to the region recorded by the ink containing the self-dispersible pigment, a phenomenon (white blur phenomenon) in which an image looks whitish occurs different from the bleeding. This "white blur phenomenon" is a phenomenon caused by allowing the self-dispersible pigment present in the vicinity of a boundary portion between the above two regions to sink in the interior of the recording medium.
The oxidation type self-dispersible pigment described in Japanese Patent Application Laid-Open No. 2003-535949 is hard to control a chemical species introduced to the particle surface of the pigment. Therefore, a nonionic hydrophilic group such as a lactone group comes to be bonded in plenty to the particle surface of the pigment, not just the carboxylic acid group. When the lactone group is bonded in plenty to the particle surface of the pigment, the aggregation of the pigment becomes gentle due to the hydrophilicity of the lactone group even after the repulsive force between anionic groups has vanished. In addition, the self-dispersible pigment described in Japanese Patent No. 5085868 has not only a lactone group formed on the particle surface of the pigment by the oxidation treatment, but also the functional group having the lactone group at the terminal thereof, so that the aggregation of the pigment becomes gentle.
On the other hand, the surface modification type self-dispersible pigments described in Japanese Patent Application Laid-Open No. H10-510862 and Japanese Patent Application Laid-Open No. 2012-528917 are easy to control a chemical species introduced to the particle surface of the pigment compared with the oxidation type self-dispersible pigment. However, even in the self-dispersible pigments of the above-described types, a certain amount of a lactone group is bonded to the particle surface of the pigment before the treatment irrespective of the production processes of the self-dispersible pigments. Therefore, the aggregation of the pigment becomes gentle in the recording medium due to the action of the lactone group, and so a problem that bleeding or white blur is easy to occur has been caused.

Aqueous ink, ink cartridge and ink jet recording method


A slider that moves a transducer across a surface of a rotating storage disk includes an island that protrudes from a surface of a subambient pressure cavity for supporting the transducer, the island having length and width dimensions that are less than those of the slider. A groove is positioned at the forward end of at least one of the side rails that define the cavity to allow air to flow between the cavity and an area outside of said cavity. The groove serves to maintain the distance between the surface of that rail and the disk surface equal to the distance between the surface of the other rail and the disk surface as the slider moves across the disk. The rail includes a plurality of grooves for equalizing the flying heights of the rails; a first one of the grooves intersects the cavity to allow air to flow between the cavity and an area outside of the slider, while and a second one of the grooves is spaced from the cavity by a portion of the rail.

This invention relates to sliders for recording heads used with storage disks.
In a typical magnetic or optical disk storage system, a read/write head is mounted on the rear end of a slider (i.e., at the rearward edge of the slider). The slider is supported by a positioning arm/suspension assembly and configured so that when the disk is rotated rapidly, the slider flies at a height above the disk. To achieve high storage densities, the slider must be flown close to the disk surface. One technique is to mechanically bias the positioning assembly to force the slider toward the disk. Another proposed approach is to contour the slider bottom so that it generates subambient (or negative) pressure to draw the bottom of the slider down near the disk.
One known approach for contouring the slider bottom is to provide the slider with a pair of side rails that extend along the length of the slider and define a cavity between them which generates the negative pressure. The rails typically extend to the rearward or trailing edge of the slider, and the rearward end of each rail generally supports one read/write head or other transducer.
In flight, sliders are subject to roll, which is the banking of the slider relative to a horizontal axis of the positioning arm. Sliders are also subject to yaw, where the trailing edge of a slider is either closer to (positive yaw) or farther from (negative yaw) the disk center than is the slider leading edge. The yaw angle is measured as the angle between the longitudinal axis of the slider and the tangent to the disk track.

Subambient pressure air bearing slider for disk drive


An object of the present invention is to generate an image which is prevented from being influenced by a movement while suppressing increase in noise components. When a movement is detected during exposure of an image capturing device to light, an image capturing apparatus stops the exposure of the image capturing device and amplifies an image signal obtained with the exposure, thereby compensating exposure shortage. Luminance information is extracted from a captured image, and color information is extracted from a live view image obtained at a timing different from a timing at which the captured image is obtained. By synthesizing the luminance information of the captured image and the color information of the live view image, noise components included in color information are reduced.

1. Field of the Invention
The present invention relates to an image capturing apparatus such as a digital camera, an image processing apparatus, and an image processing method and, more particularly, to an image processing technique of processing an image obtained by photographing when a movement occurs at the time of the photographing.
2. Description of the Background Art
An image capturing apparatus such as a digital camera having a movement correcting mechanism (auto stabilization mechanism) for mechanically correcting a movement (for example, blur) of the image capturing apparatus relative to the subject, which occurs during photographing is known. The movement correction of this kind is realized by detecting a movement amount by using an acceleration sensor or the like and, for example, by displacing an optical system or an image capturing device such as a CCD image sensor to correct a relative displacement between the image capturing apparatus and the subject in accordance with the movement amount.
However, the configuration and control of such a mechanical movement correcting mechanism are complicated. Moreover, since response speed to a movement is limited, when a relative displacement between the image capturing device and the subject due to a movement occurs at a speed higher than the response speed, a situation such that a movement cannot be corrected by the mechanical movement correcting mechanism occurs. Therefore, attempts are being made to correct a movement without providing the mechanical movement correcting mechanism.
As a technique for correcting a movement without providing a movement correcting mechanism, for example, an image capturing apparatus for detecting a movement amount during exposure of an image capturing device, if the movement amount exceeds a predetermined value during the exposure, interrupting the exposure and compensating deterioration in picture quality due to insufficient exposure by increasing the gain of an amplifier provided at the post stage of the image capturing device is known (for example, Japanese Patent Application Laid-Open No. 2001-45361).
In the conventional technique, however, when the exposure amount is insufficient, the gain is increased uniformly for a whole image, so that a noise component is also amplified. It causes a problem such that an image of low picture quality with conspicuous noise is resulted.


Photostable, topically applicable cosmetic/dermatological compositions contain at least one dibenzoylmethane compound UV-A sunscreen and at least one merocyanine sulfone compound.

1. Technical Field of the Invention
The present invention relates to photostabilizing at least one dibenzoylmethane derivative against UV radiation employing at least one merocyanine sulfone derivative.
This invention also relates to novel compositions, in particular cosmetic compositions for topical application.
2. Description of Background and/or Related and/or Prior Art
Light radiation with wavelengths in the range 280 nm to 400 nm is known to brown the human epidermis; more particularly, rays with a wavelength in the range 280 to 320 nm, known as UV-B, are known to cause erythema and cutaneous burns which may be deleterious to the development of a natural tan. For those and for aesthetic reasons, there is a constant demand for means for controlling natural tanning which can thereby control the color of the skin; thus, UV-B radiation must therefore be screened.
It is also known that UV-A rays with wavelengths in the range 320 to 400 nm, which cause the skin to brown, tend to induce an impairment therein, in particular with sensitive skin or skin which is continually exposed to solar radiation. In particular, UV-A radiation causes the skin to lose elasticity and the appearance of wrinkles, resulting in premature aging of the skin. The radiation encourages triggering the erythematous reaction or amplifies that reaction in certain subjects and may even be the cause of phototoxic or photo-allergic reactions. Hence, for aesthetic and cosmetic reasons, such as preserving the natural elasticity of the skin, for example, more and more individuals seek to control the effect of UV-A radiation on their skin. Thus, screening UV-A radiation is also desirable.
With the goal of ensuring protection of the skin and keratinous substrates against UV radiation, sunscreen compositions are generally used which comprise organic screens which are active in the UV-A and active in the UV-B regions. The majority of such screens are liposoluble.
In this respect, a current particularly advantageous family of UV-A screens is constituted by dibenzoylmethane derivatives, in particular 4-tert-butyl-4′-methoxydibenzoyl methane, which have intrinsically good absorbing powers. Such dibenzoylmethane derivatives, which are now well known per se as screens which are active in the UV-A region, have been described in FR-A-2,326,405 and FR-A-2,440,933, as well as in EP-A-0,114,607; 4-tert-butyl-4′-methoxydibenzoyl methane is currently marketed under the trademark "Parsol 1789" by ROCHE VITAMINS.
Unfortunately, it has been discovered that dibenzoylmethane derivatives are relatively sensitive to ultraviolet radiation (in particular UV-A), i.e., more precisely, they have an annoying tendency to degrade at a greater or lesser rate under the action thereof. This substantial lack of photochemical stability of dibenzoylmethane derivatives to the ultraviolet radiation to which they are by their very nature intended to be subjected cannot guarantee constant protection during prolonged exposure to the sun, and repeated applications at regular, close intervals have to be made by the consumer to effectively protect the skin against UV radiation.

Photoprotective cosmetic compositions comprising photostabilized dibenzoylmethane compounds and merocyanine sulfone compounds


The invention comprises a bearing structure for the bodywork of a passenger car wherein front suspension strut mounts are arranged above front longitudinal bearers running down both sides of the vehicle body and are supported by vertical connecting members thereon. A hollow section bearer, acting as a suspension strut bearer, connects the suspension strut mount to a joining element (node) at the middle region of the forward doorpost. According to the invention, the suspension strut bearer is curved such that it will buckle due to a reduction in the radius of curvature in the event of a head-on collision. The buckling action of the suspension strut bearer reduces the force acting on the doorpost, thereby counteracting any possible stressing of the vehicle door. In a further embodiment of the invention, slots and/or notched grooves are provided in the side walls of hollow section bearer to promote the buckling process. In another alternate embodiment, the upper and lower walls of the hollow section bearer are configured as outwardly or inwardly pointed roof structures which act as hinge axes to collapsed the hollow section bearer inward onto itself during the buckling process.

The familiar front-end bearing structure of the bodywork of a passenger car comprises a pair of generally horizontal front longitudinal suspension strut bearers disposed spaced apart along opposite sides of the vehicle body, each of which include a suspension strut mount supported by an upright bearer connecting to a bottom longitudinal bearer.
The conventional self-supporting vehicle bodywork for passenger cars which include the front-end bearing structure of the type described above typically comprise sheet metal parts. For example, the hollow-section bearers are made from at least two deep-drawn metal sheet halves which are welded together. The suspension strut mounts, also made from sheet metal parts, are conventionally embedded in the bell structure of deep-drawn wheel housings. The wheel housings consist of open sheet metal shells which are connected to the underside of the longitudinal bearers. Applied force is guided across the sheet elements as thrust walls. The result is that the suspension strut mount is a heavily loaded and heavily stressed part of the body structure.
Accordingly, for the case of conventional sheet metal structures, the requisite rigidity for the bearing structure in this region, particularly for withstanding major damage in the event of a crash, can only be achieved through costly reinforcement measures. The steel sheets used to construct such self-supporting bodies are shaped in the deep drawing process. While dies used for shaping the sheets are relatively expensive, they do provide a cost-favorable solution for mass production since they permit large production runs. However, in view of the high investment on dies, the aforesaid process is very cost-intensive for smaller production runs.
A more cost-favorable solution for small production runs in particular, is known from European Patent document EP 0 146 716 wherein it is disclosed how to manufacture vehicle bodies for passenger cars having a bearing structure comprising of hollow sections which are joined together by node connector elements. The hollow sections are formed as extruded aluminum sections and the node connector elements are formed as light metal cast pieces. In addition to being a more cost-favorable solution for small production runs, the aluminum bodywork described in EP 0 146 716 is very lightweight and is more resistant to corrosion than a sheet metal bodywork. However, the suspension strut mount for this design and its support on the respective longitudinal bearer are also constructed from sheet metal parts in a manner similar to the conventional structure of the self-supporting sheet metal vehicle body described above. Accordingly, similar costly reinforcement measures must be taken to ensure adequate rigidity of the bearing structure in this case.
Another known vehicle bodywork having a bearing structure formed of extruded light metal hollow-section members which are joined together by light metal cast pieces is disclosed in an article entitled "Aluminum Und Kundstoff IM Verbund-ein Schritt Zur Leichteren Autokarosserie" appearing in Aluminum Journal 64, No. 9 (1988). The suspension strut mount is supported along its bottom surface on the respective longitudinal bearer across an extruded section bearer. Furthermore, a straight extruded section bearer formed as the suspension strut bearer is positioned between the suspension strut mount and the middle of the front door pillar or A-post at a height along the A-post adjacent the upper portion of the apron or fire wall. The connection of the suspension strut mount to the suspension strut bearer on the doorpost provides a stable support for the suspension strut mount. In the event of a forceful collision resulting in major deformation to the front end of the car, the suspension strut mount will be pushed backward in the longitudinal direction of the vehicle. The direct and straight connection of the suspension strut mount from the suspension strut bearer to the middle of the A-post results in a considerable amount of force being exerted on the A-post connection point during a frontal collision. As a result, the A-post will tend to curve or bend backward in the lengthwise direction of the vehicle thereby decreasing the width of the door opening. This presents a danger that the door will be difficult or even impossible to open. To avoid this problem, the suspension strut bearer may be dimensioned such that it is a very weak member in compression. However, this would unfavorably influence the desired rigidity for normal use. Alternatively, the A-post may be dimensioned as a disproportionately strong member such that it resists displacement when a lateral force is exerted thereagainst. However, this solution would unfavorably affect cost and weight.
British Patent document GB 1 201 253 discloses an example of a known bearer structure wherein supporting bearers extend from structural parts of the vehicle front end compartment to a transverse member disposed in front of the passenger compartment. The supporting bearers are constructed as yielding members capable of transmitting a compressive force up to a predetermined limit in the event of a frontal impact such that only slight force is transmitted to the passenger compartment. In a particular embodiment, the supporting bearers include curved regions and selectively positioned beads which promote buckling of the bearers upon frontal loading.
Furthermore, it is known from German Patent document DE 1 801 960 how to apply recesses and beads (grooves) to the side walls of a hollow bearer so that its length is shortened by folding upon axial loading on the hollow bearer.

Bearing structure for the bodywork of a vehicle


A fiber structure made as a single piece by multilayer weaving using a method including weaving warp yarns of at least a first set of layers of warp yarns with weft yarns including at least some that are woven with extra length so as to have warp yarn end portions available that extend beyond the zone of weaving, the warp yarn end portions being returned to be woven with warp yarns by being reinserted in layers of warp yarns, and a hollow, or tubular, portion being formed by looping the first woven set of layers of warp yarns back onto itself and applying traction to the ends of the reinserted weft yarns so that a fiber preform for a part including a hollow portion can be obtained as a single piece.

The invention relates to making a fiber structure by multilayer weaving, and more particularly a fiber structure including at least one hollow portion, in particular a portion that is tubular or substantially tubular.
The field of application is in particular that of making fiber structures for use in providing fiber preforms for composite material parts that are obtained by densifying fiber preforms with a matrix, or parts that are obtained by hot isostatic pressing or by forging and diffusion-welding preforms made of metallic fibers, and particularly, but not exclusively, parts for aviation turbine engines. Examples include:                parts having at least one tubular portion secured to another portion such as a panel or a plate, the tubular portion being for enabling an element to be supported, guided, or hinged beside the panel; and        parts such as hollow support arms or ducts that may optionally be partitioned longitudinally in order to form a plurality of passages.
Proposals have already been made to produce a fiber preform as a single piece from a multilayer woven structure in order to form a composite material part that is of complex shape.
The terms "multilayer weaving" or "three-dimensional weaving" are used herein to mean a weaving process between a plurality of layers of warp yarns and a set of weft yarns, at least some of the weft yarns interlinking warp yarns belonging to different layers of warp yarns. Several multilayer weaves can be used, such as interlock weaves, in which weft yarns in a given weft column move in the same manner in a plane of the weave, or else multi-satin, multi-plain, or multi-twill weaves. Reference may be made to Document WO 2006/136755.
It is known to make a multilayer woven structure that, on being shaped, makes it possible to obtain a preform having a shape that is close to the shape of a composite material part that is to be made. Reference may be made to Documents U.S. Pat. No. 7,241,112 and WO 2010/061139 that relate to making composite material blades for turbine engines.

Multilayer woven fibrous structure including a hollow tubular part, production method thereof and composite part comprising same


Packets (2) of cigarettes are packed in multiples adopting a rigid carton (1) of parallelepiped shape presenting two end faces (11, 12) coinciding with the flanks (13, 14), and four side faces (3, 4, 5, 6) of which two coincide with the bottom (10) and the top (8). One of the side faces (3, 4, 5, 6) constituting the front (7) incorporates a removable portion (15) serving to mask on openable cover (19) that can be rotated about a hinge (20) between a position in which the carton (1) is closed, and an open position exposing the inside of the wrapper, the cover (19) is provided with a pair of guiding and stabilizing members (22) attached permanently to two opposite edges (23), each occupying a plane disposed transversely to the hinge (20), which are interposed and slidable between the flanks (13, 14) and the surfaces of the packets (2) inside, whilst the free edge (21) is strengthened by a reinforcing fold (24) and fashioned with a cutaway portion (25) by means of which the cover (19) can be gripped and pulled open.

It is the conventional practice for packets of cigarettes to be packaged in multiples using rigid wrappers commonly known as cartons, which appear substantially parallelepiped in shape.
One type of carton consists in a wrapper of flat and elongated shape exhibiting four longitudinal faces, including two main faces and two narrower faces, and two transverse end faces.
One of the panels coinciding with one of the two main longitudinal faces functions as a lid, secured by a longitudinal flap sealed along one of the two adjoining narrower longitudinal faces. The lid in this instance cannot be closed stably once the seal is broken, and in effect the general practice is to discard these cartons once opened since they do not protect the packets thereafter during the period of consumption.
Another carton of comparable type consists in a rigid wrapper appearing as a container, of cupped embodiment, with a similarly cupped lid hinged to the container in such a manner that one open end of the selfsame container can be closed. The lid is retained in the closed position by means of a frame projecting from the open end of the container.
These cartons are designed to serve as storage containers until all of the packets they hold have been used up, although the flat diecut blanks from which they are fashioned require a relatively large quantity of wrapping material for their preparation and there is a significant amount of waste wrapping material generated in manufacture. Moreover, a lid hinged to one end of the container affords ease of access only to those packets in the container that are positioned nearer to the open end, whereas the user is unable to see the packets positioned at the bottom of the container.
The object of the present invention is to provide a rigid wrapper that will permit of overcoming the aforementioned drawbacks simply and economically.

Carton of a plurality of packets of cigarettes