A dual-band bandpass filter with stepped-impedance resonators uses only one circuit to generate dual-band effect. It adopts the principle of stepped-impedance resonator, which contains a connecting section and two coupling sections. The impedance and electrical length of the connecting section and coupling sections conforms to a selected condition to generate two passbands at desired frequencies. A multi-layer broadside-coupled parallel lines structure may be applied to increase coupling-amount between the parallel lines so that the dual-band bandpass filters have broader bandwidth and less loss.

Wireless communication has had a tremendous growth in recent years. Developments of wireless transceivers have been gradually directed to multiple bandwidths to provide more flexibility. By means of this technology, users can access different services through one multi-mode, multi-band terminal. In the previous technology, GSM and WCDMA communication systems achieve the dual-band operation by switching two separated transceivers. Such architecture requires two transceivers operating in different frequency. Hence, it requires higher cost, greater circuit area, and more power consumption. To overcome these drawbacks, a so-called concurrent dual-band architecture has been introduced. In this architecture, one transceiver can simultaneously operate in two passbands, where the key building blocks, such as low noise amplifier and bandpass filter, have two concurrent passbands and adequate the stop-band suppression. The concurrent dual-band low noise amplifier has been designed to achieve the required effect, but the dual-band bandpass filter is still not yet reported H. Miyake, S. Kitazawa, T. Ishizaki, T. Yamada, and Y. Nagatomi, "A miniaturized monolithic dual band filter using ceramic lamination technique for dual mode portable telephones," 1997 IEEE MTT-S Int. Microwave Symp. Dig., vol. 2, pp. 789–792, June 1997, a dual-band bandpass filter was fabricated in low temperature co-fired ceramic processes. However, its structure actually included two separated filters. The filter layout at the upper four layers was designed for the pass-band of 900 MHz and layout at the lower four layers was for the pass-band of 1800 MHz. Although these two circuits were fabricated at the same low temperature co-fired ceramic chip, they had individual output and input ports, hence required additional input and output combination circuits to transmit the signal through a single pair of input and output ports. In practice, it still does not effectively reduce the circuit area and cost.

Dual-band bandpass filter with stepped-impedance resonators


A fletching jig can include constrictor ring that, when rotated, urges a plurality of arms supporting respective vanes toward an arrow supported in the jig to fletch the arrow. The arms can extend away from a base, which can support the arrow along a central axis. The actuator ring can be disposed around the arms. The actuator ring can include a ramp that can engage multiple guide blocks adjacent the actuator ring, each guide block configured to push a respective arm toward the arrow as the ring rotates. A related method of use is provided.

The present invention relates to archery products, and more particularly to a fletching jig used to fletch archery arrows or bolts.
Arrow fletchings or vanes, referred to interchangeably herein as vanes, stabilize an arrow in flight by providing drag at the tail end of the arrow. The fabrication and repair of archery arrows or bolts, referred to interchangeably herein as arrows, requires attachment of vanes to the shaft of the arrow. Typically, two, three or four vanes are adhered to the shaft with an adhesive at even angular displacements around the circumference of the shaft. The vanes can be disposed parallel to the axis of the shaft, or can helically spiral around part of the shaft. Skill and patience are required to prepare the shaft and to apply the proper amount of adhesive to achieve a durable bond between the vane and the arrow. The vanes also must be held in place for a period of several minutes to several hours as the adhesive cures, so that the vanes do not move before the adhesive has cured, which would cause imperfect placement and/or alignment of the vanes along the arrow, which in turn can be detrimental to the stabilization and flight of the arrow.
During the course of shooting the arrows, whether in a tournament or during practice for competition or hunting, it is not uncommon to damage vanes, especially when shooting at a single spot on a target. When the vanes are damaged, an archer will typically repair them to ensure that the associated arrow files true again. This means that an active archer may find themselves repairing vanes with high frequency, which can be tedious and time consuming.
For the purpose of adhering vanes to arrows, for example, to install anew or repair vanes, there is a variety of fletching jigs that hold vanes against the shaft of the arrow in a predetermined orientation. Most fletching jigs, however, are either specifically set for particular numbers of vanes, particular types of vane positioning and/or shaft diameters, or the adjustments required are unwieldy and time-consuming when servicing or building a variety of arrows having different vane patterns or shaft diameters.
Accordingly, there remains room for improvement in the field of fletching jigs that can easily or automatically adapt to various vane patterns and arrow shaft diameters.


When an incremental amount of a steering angle exceeds a reference incremental amount, an ECU 60 executes vehicle attitude control of reducing an output torque of an engine, and, in a given operating range, drives a spark plug 16 in a manner allowing an air-fuel mixture to be self-ignited at a given timing, thereby executing SPCCI combustion. When there is a request for an additional deceleration from the vehicle attitude control (#12: YES), and the SPCCI combustion is performed (#13: YES), the ECU 60 executes fuel amount reduction control of reducing the amount of fuel to be supplied into a cylinder 2 (#14), so as to attain torque reduction for the vehicle attitude control. On the other hand, when the SPCCI combustion is not performed (#13: NO), the ECU 60 executes ignition retardation control of retarding an ignition timing of the spark plug 16 (#15).

There has been known premixed charge compression ignition combustion (or homogenous charge compression ignition combustion) in which a mixture of air and gasoline fuel is sufficiently compressed in a cylinder so as to be combusted by self-ignition. Further, there has been proposed partially premixed charge compression ignition combustion (hereinafter referred to as "spark controlled compression ignition (SPCCI) combustion" which is a combination of spark ignition (SI) combustion and compression ignition (CI) combustion, instead of combusting the entirety of an air-fuel mixture by self-ignition (see, for example, the following Patent Document 1). In the SPCCI combustion, a part of an air-fuel mixture is forcibly combusted by flame propagation triggered by spark ignition (SI combustion), and then the remaining unburned air-fuel mixture is combusted by self-ignition (CI combustion).
Meanwhile, there has also be known driving support control of comprehensively controlling accelerations (G) in a forward-rearward (longitudinal) direction and a width (lateral) direction of a vehicle by changing an output torque of an engine according to a steering angle (this control will hereinafter be referred to as "vehicle attitude control"). In the vehicle attitude control, immediately after a driver starts to turn a steering wheel, the output torque of the engine is reduced to be less than a required torque, to generate a deceleration G in the vehicle, thereby causing a load shift toward front road wheels. This results in increases in tire gripping force and cornering force of the front road wheels. In the vehicle attitude control, the engine output torque is reduced by means of, e.g., retardation of an ignition timing at which an air-fuel mixture is ignited by a spark plug (ignition retardation).


Immunoassays for the detection of everolimus are provided. Compounds for producing antibodies for everolimus, as well as antibodies produced therefrom, are also provided.

The everolimus [40-O-(2-hydroxyethyl)-rapamycin] is a novel macrolide immunosuppressant. Everolimus (also known as SDZ-RAD, RAD, Certican®) was developed by Novartis (Nashan B. The role of Certican in the many pathways of chronic rejection. Transplantation Proceedings, 2001, 33: 3215–3230, herein incorporated by reference) in an effort to improve upon rapamycin (Sirolimus), a proliferation signal inhibitor that blocks growth factor-driven transduction signals in the cellular responses to alloantigen (Cottens S, et al. O-Alkylated rapamycin derivatives and their use, particularly as immunosupressants. WO-009409010 28 Apr. 1994, herein incorporated by reference). Everolimus has greater stability and enhanced solubility in organic solvents, as well as more favorable pharmokinetics with fewer side effects than rapamycin (Sirolimus). Everolimus has been used in conjunction with microemulsion cyclosporin (Neoral®, Novartis) to increase the efficacy of the immunosuppressive regime (Kovarik J M, et al. Exposure-response relationship for Certican in de novo kidney transplantation: define a therapeutic range. Transplantation 2002; 73(6): 920–925, herein incorporated by reference).
The complexity of the clinical state, individual differences in sensitivity to immunosuppressive and nephrotoxic effects, has been rather challenging for physicians to balance between therapeutic efficacy and the occurrence of side effects (Wallemacq, Pierre E. Therapeutic monitoring of immunosuppressant drugs. Where are we? Clinical Chemistry and Laboratory Medicine (2004), 42 (11), 1204–1211, herein incorporated by Chemistry and Laboratory Medicine (2004), 42 (11), 1204–1211, herein incorporated by reference). Therapeutic drug monitoring (TDM), defined as the measurement and interpretation of concentration of these drugs in biological fluids, with as a final objective the prediction of organ responses, became an integral part of transplant protocols.
Therapeutic concentration of everolimus was reported (Kovarik et al.) as 3–15 ng/ml, which was consistent with efficacy while minimizing adverse effects in kidney transplantation. Recent data also showed that therapeutic drug monitoring (TDM) of everolimus would benefit heart transplant patients (Starling, Randall C.; et al. Therapeutic drug monitoring for everolimus in heart transplant recipients based on exposure-effect modeling. American Journal of Transplantation (2004), 4(12), 2126–2131, herein incorporated by reference). Everolimus trough levels were stable in the first year post-transplant and averaged 5.2±3.8 and 9.4±6.3 ng/mL in patients treated with 1.5 and 3 mg/day, respectively.
The TDM of everolimus was reported (McMahon L M, et al. High-throughput analysis of Certican (RAD001) and cyclosporin A (CsA) in whole blood by liquid chromatography/mass spectrometry using a semi-automated 96-well solid-phase extraction system. Rapid Comm. Mass Spectrometry 2000; 14: 1965–1971; Brignol N, et al. High-throughput semi-automated 96-well liquid/liquid extraction and liquid chromatography/mass spectrometric analysis of Certican (RAD001) and cyclosporin A (CsA) in whole blood. Rapid Communications in Mass Spectrometry 2002; 15: 1–10; Streit F. et al. Rapid liquid chromatography-tandem mass spectrometry routine method for simultaneous determination of sirolimus, Certican, tacrolimus, and cyclosporin A in whole blood. Clinical Chemistry. 2002; 48(6): 955–958, each of which herein incorporated by reference). However, methods that use HPLC, LC/MS can be impractical for commercial use due to, for example, long sample preparation time, long assay time, high cost, and labor-intensive procedures. For routine TDM of everolimus, the availability of simple automated tests and high throughput clinical analyzers is desirable.


The present invention relates to a new improved, simplified process for the preparation of halo-4-phenoxyquinolines, whereby thionyl chloride is used as the chlorinating agent to prepare the corresponding chloroquinoline intermediate prior to the final coupling reaction, and a single, inert high boiling polyether solvent is used throughout the entire reaction procedure.

U.S. Pat. No. 5,145,843 describes halo-4-phenoxyquinoline compounds as having excellent plant fungicide activity, such as those of formula (1), ##STR1## wherein
R.sup.1 and R.sup.3 are independently halo and R.sup.2 and R.sup.4 are H; or R.sup.3 is halo, R.sup.1 is halo or H, and R.sup.2 and R.sup.4 are H; or R.sup.4 is halo and R.sup.1 to R.sup.3 are H;
A is a phenyl group of formula (2) ##STR2## wherein R.sup.9 to R.sup.13 are independently H, CN, NO.sub.2, OH, halo, (C.sub.1 -C.sub.4)alkyl, (C.sub.2 -C.sub.4)alkanoyl, halo(C.sub.1 -C.sub.7)alkyl, hydroxy(C.sub.1 -C.sub.7)alkyl, (C.sub.1 -C.sub.7)alkoxy, halo(C.sub.1 -C.sub.7)alkoxy, (C.sub.1 -C.sub.7)alkylthio, halo(C.sub.1 -C.sub.7)alkylthio, phenyl, substituted phenyl, phenoxy, substituted phenoxy, phenylthio, substituted phenylthio, phenyl(C.sub.1 -C.sub.4)alkyl, substituted phenyl(C.sub.1 -C.sub.4)alkyl, benzoyl, SiR.sup.20 R.sup.21 R.sup.22, or OSiR.sup.20 R.sup.21 R.sup.22 where R.sup.20, R.sup.21, and R.sup.22 are H, a (C.sub.1 -C.sub.6)alkyl group, phenyl, or substituted phenyl, provided that at least one of R.sup.20, R.sup.21, and R.sup.22 is other than H, or R.sup.11 and R.sup.12 or R.sup.12 and R.sup.13 combine to form a carbocyclic ring, and provided that unless all of R.sup.9 to R.sup.13 are H or F, then at least two of R.sup.9 to R.sup.13 are H.
Wherein the foregoing definitions, the term substituted phenyl refers to phenyl substituted with up to three groups selected from halo, (C.sub.1 -C.sub.10)alkyl, halo(C.sub.1 -C.sub.7)alkyl, hydroxy(C.sub.1 -C.sub.7)alkyl, (C.sub.1 -C.sub.7)alkoxy, halo(C.sub.1 -C.sub.7)alkoxy, phenoxy, phenyl, NO.sub.2, OH, CN, (C.sub.1 -C.sub.4)alkanoyloxy, or benzyloxy.
The term alkyl refers to linear, branched, or cyclic alkyl.
The term halo refers to fluoro, chloro, bromo, or iodo.
The term substituted phenoxy refers to a phenoxy group substituted with up to three groups selected from halo, (C.sub.1 -C.sub.10)alkyl, halo(C.sub.1 -C.sub.7)alkyl, hydroxy-(C.sub.1 -C.sub.7)alkyl, (C.sub.1 -C.sub.7)alkoxy, halo(C.sub.1 -C.sub.7)alkoxy, phenoxy, phenyl, NO.sub.2, OH, CN, (C.sub.1 -C.sub.4)alkanoyloxy, or benzyloxy.
The term substituted phenylthio refers to a phenylthio group substituted with up to three groups selected from halo, (C.sub.1 -C.sub.10)alkyl, halo(C.sub.1 -C.sub.7)alkyl, hydroxy(C.sub.1 -C.sub.7)alkyl, (C.sub.1 -C.sub.7)alkoxy, halo(C.sub.1 -C.sub.7)alkoxy, phenoxy, phenyl, NO.sub.2, OH, CN, (C.sub.1 -C.sub.4)alkanoyloxy, or benzyloxy.
As described in U.S. Pat. No.5,145,843 the compounds of formula (1) may be made by condensing a compound of formula (3) ##STR3## wherein R.sup.1 to R.sup.4 are as previously defined, with a compound of the formula (4) EQU HO--A (4)
wherein A is as previously defined. This reaction can be carried out neat, at a temperature in the range of 80-150.degree. C., or preferably 130-140.degree. C.
Many of the quinoline starting materials may be prepared as described in U.S. Pat. No. 5,145,843, and shown in the following reaction scheme below: ##STR4##
In cases where mixtures of isomeric products are obtained, the mixture of substituted 4-quinolines is chlorinated under standard conditions utilizing phosphorous oxychloride, and the isomeric 4-chloroquinolines are separated by liquid chromatography.
U.S. Pat. No. 5,245,036 describes an improvement over this process whereby the coupling step is carried out in the presence of a 4-dialkylaminopyridine catalyst.
Other known methods which may be used for preparing other types of quinoline materials are described as follows:
4-Hydroxyquinolines may be prepared via the Gould-Jacobs reaction of substituted anilines with ethoxymethylene diethylmalonate. J.A.C.S. 61, 2890 (1939). This procedure is also described in detail in Organic Syntheses, vol. 3 (1955), cited above in U.S. Pat. No. 5,145,843, for the preparation of 4,7-dichloroquinoline, which is a useful intermediate for the antimalarial drug chloroquin. Another general procedure is described in Tetrahedron, vol. 41, pp. 3033-3036 (1985).
Kokai Pat. No. Hei 1(1989)-246263 describes a method for producing 5,7-dichloro-4-(2-fluorophenoxy)-quinoline whereby a mixture of 3,5-dichloroaniline and Meldrum's acid is heated to give 4-oxo-5,7-dichloro-1,4-dihydroquinoline, which is reacted with phosphorus oxychloride to give 4,5,7-trichloroquinoline, which is then reacted with 2-fluorophenol to give the final compound.
Kokai Pat. No. Hei 5(1993)-1555856 describes an acrylic acid based route to produce an addition product with 3,5-dichloroaniline, which is then cyclized and oxidized to the corresponding quinoline compound.
Tetrahedron Letters, vol. 35, no. 32 (1994) describes a decarboxylation process to convert camptothecin, a compound which exhibits antineoplastic activity, to mappicine ketone, whose analogs are of interest in medicinal and pharmacological research. The conversion takes place upon extended reflux in DMF. Changing the solvent to triglyme at 200.degree. C. gave a shorter reaction time. However, it is reported this reaction is limited to analogs with an intact a-hydroxylactone structure.

Process for the preparation of halo-4-phenoxyquinolines


A locking mechanism including a non-threaded, self-adjusting locking device for locking a rod in place within a screw and rod assembly. A non-threaded, self-adjusting locking device for locking a rod in place within a screw and rod assembly. A spring for locking a rod in a screw and rod fixation assembly. A assembly including an implant body including a rod seat for seating a rod therein, a biasing device seat for seating a biasing device therein, and a biasing device seated in the biasing device seat for biasing a rod against a rod seat. A method of biasing a rod against a rod seat in a screw and rod fixation assembly.

1. Field of the Invention
The present invention relates to a locking mechanism. More specifically, the present invention relates to a locking mechanism for use in a screw and rod fixation assembly.
2. Description of Related Art
Stabilization of the spine for various conditions, including degenerative disc disease, scoliosis, spondylolithises, and spinal stenosis often requires attaching implants to the spine and then securing the implants to spinal rods. Such spinal fixation devices can immobilize the vertebrae and can alter the alignment of the spine over a large number of vertebrae by means of connecting at least one elongate rod to the sequence of selected vertebrae. Such rods can span a large number of vertebrae, such as three or four. However, the spine anatomy rarely allows for three or more implants to be directly in line. In order to allow for this irregularity, the rod must be contoured to the coronal plane. With anatomical curvature in the saggital plane found in the lumbar spine, the rod has to be contoured in both planes, requiring considerable effort and surgical time.
For example, the U.S. Pat. Nos. 5,554,157, 5,549,608, and 5,586,984, all to Errico et al., disclose polyaxial locking screws and coupling element devices for use with rod fixation apparatus. The '157 patent discloses a coupling element including an interior axial passage having an interior surface which is inwardly curvate at the lower portion thereof such that it comprises a socket for polyaxially retaining a spherical head of a screw. The coupling element further includes a pair of vertically oriented opposing channels extending down from the top of the coupling element which define therebetween a rod receiving seat. The channel further provides the walls of the upper portion to a pair of upwardly extending members, each including an exterior threading disposed on the upper most portion thereof for receiving a locking nut. During the implantation of the assembly, the locking nut seats against the top of the rod which in turn seats on top of the screw head. The nut causes the rod to be locked between the nut and screw and the screw to be locked in the socket.
The '608 patent discloses a modification wherein a locking ring is disposed about the exterior of the lower portion of the coupling element and provides an inward force on an outwardly tapered portion upon downward translation thereof, causing the interior chamber to crush lock a screw head therein to eliminate the polyaxial nature of the screw element coupling.
The '984 patent discloses a polyaxial orthopedic device including a coupling element having a tapered lower portion including a slotted interior chamber in which a curvate head of a screw is initially polyaxially disposed. The coupling element includes a recess for receiving a rod of the implant apparatus. A locking ring is disposed about the lower portion of the coupling element and provides an inward force on the outwardly tapered portion upon downward translation thereof. The vertical slots are caused to close and crush, thereby locking the screw head within the inter chamber thereof.
With regard to a posterial spinal fixation system, the size of the implant is an important issue. Bulky components can cause soft tissue irritation, as well as comprise the facet joints at the end of a fusion. Minimizing the size of the implants used is critical in spinal surgery with regard to the issue of bulky components. Soft tissue irritation resulting from extensions of implants is a common occurrence. Many times it is caused by the implant being too high relative to its environment. For example, implants can be too high to sufficiently be covered with muscle tissue. Hence, a reduction in the overall height of an implant is a critical advantage for the patient.
Most spine implants utilize a rod connection mechanism that requires a nut, connector, or other component to secure the implant to the rod, such as in those prior art patents discussed above. This connection means has at least some portion that sits above the rod to which the implants are connected. This increases the overall height of the implant assembly in the body.
Several attempts have been made in the prior art to address this concern of the overall height of the implant assembly. Modulok™ (manufactured by Zimmer and Wright Medical, Arlington, Tenn.), Versalok™ (manufactured by Wright Medical, Arlington, Tenn.), and Paragon™ (manufactured by DANEK, Memphis, Tenn.) are all products in the marketplace utilizing a taper connection mechanism to minimize the amount of material situated above the rod in the spinal assembly. However, these types of designs have various inherent difficulties. The Modulok™ system requires a tapered sleeve to be snapped in place over the rod prior to locking the rod to the implant. The Paragon™ system requires use of two tapered sleeves. The Versalok™ system, specifically designed for lower back fixation, requires that the rod be snapped into a channel and an outer sleeve be brought up to compress the rod interface.
All of the above-mentioned systems have drawbacks, including the bulky instrumentation needed to engage the tapers which somehow must be brought into the surgical environment, thereby causing various difficulties in surgical use. For example, a surgeon usually determines the contour of a rod by contouring the rod and placing it into the saddle or seat of the implants. Then the surgeon examines the contour, removes the rod, and re-contours the rod as required.
Others have approached the solution to this problem with various poly-axial screw designs. For example, in U.S. Pat. No. 5,466,237 to Byrd et al., a bone screw is described that includes a spherical projection on the top of the bone screw. An externally threaded receiver member supports the bone screw and a spinal rod on top of the spherical projection. An outer nut is tightened onto the receiver member to press the spinal rod against the spherical projection to accommodate various angular orientations of the bone screw relative to the rod. While this particular approach utilizes a minimum of components, the security of the fixation of the bone screw to the rod is lacking. In other words, the engagement or fixation between the small spherical projection on the bone screw and the spinal rod is readily disrupted when the instrumentation is subjected to the high loads of the spine, particularly in the lumbar region.
In another approach disclosed in U.S. Pat. No. 4,946,458 to Harms et al., a spherical headed bone screw is supported within separate halves of a receiver member. The bottoms of the halves are held together by a retaining ring. The top of the receiver halves are compressed about the bone screw by nuts threaded onto a threaded spinal rod. In another approach taken by Harms et al., in U.S. Pat. No. 5,207,678, a receiver member is flexibly connected about a partially spherical head of a bone screw. Conical nuts on opposite sides of the receiver member are threaded onto a threaded rod passing through the receiver. As the conical nuts are threaded toward each other, the receiver member flexibly compresses around the head of the bone screw to clamp the bone screw in its variable angular position. One detriment of the systems in the two Harms et al. patents is that the spinal rod must be threaded in order to accept the compression nuts. It is known that threading rods can tend to weaken the rods in the face of severe spinal loads. Moreover, the design of the bone screws in the '458 and '678 patents require a multiplicity of parts and are fairly complicated to achieve complete fixation of the bone screw.
A further approach illustrated in U.S. Pat. No. 5,797,911 to Sherman et al. is to provide a U-shaped holder through the top of which a bone fastener topped with a crown member is loaded. The holder accommodates a rod in a channel above the crown member and a compression member above the rod. The compression member presses on the rod and crown member to lock the fastener against the holder in any of a number of angles in three dimensions with respect to the rod. This approach is somewhat bulky in order to accommodate the other structural components.
Yet a further approach is disclosed in U.S. Pat. No. 5,733,285 to Errico et al., in which a holder is provided with a tapered and colletted portion at the bottom into which a bone fastener head is inserted. A sleeve is provided that slides down around the colletted portion to crush lock the colletted portion around the head of the bone fastener. This apparatus is believed to be relatively bulky and difficult to manipulate given the external sliding locking mechanism. It is further dependent on the fit of the external sleeve and the relative strength of the collet and its bending and crushing portions for secure locking of the bone fastener head.
Another important aspect for improving a polyaxial screw is having a screw head securing means that provides a strong lock while minimizing size. All known polyaxial screws in prior art require substantial size due to the locking mechanism.
For example, U.S. Pat. No. 6,280,442, to Barker et al. discloses a complex locking means having a screw head with complex head geometry, a crown member, and an outer rigid body. Locking occurs by compressing the crown member against the complex head, which compresses the head against the rigid seat. This crushes the machined ridges on the head and secures the screw.
Another example, and one common in many polyaxial screw patents, is the use of some sort of collet that has a spherical seat with a flexible portion that is designed to deflect around the screw. By compressing the flexible portion against a rigid outer wall, the collet is compressed against the head to cause locking. Such configurations are disclosed in U.S. Pat. No. 6,053,917 to Sherman et al., U.S. Pat. No. 6,010,503, to Richelsoph, and U.S. Pat. No. 5,964,760, to Richelsoph. Tartar in U.S. Pat. No. 5,910,142 discloses a spherical collet that is compressed between the screw head and the rod. U.S. Pat. No. 5,891,145 discloses a very complex double wedge locking means. The more complex the locking means the larger the components need to be and the more expensive to manufacture.
In addition, the majority of the locking mechanisms use a set screw, nut, or other threaded locking means. Threaded devices tend to be subject to cross-threading. Therefore, considerable effort must be placed into instrument design and surgeon technique to prevent this from happening. In addition, proper locking can only achieved by exerting a controlled locking force, such as a torque wrench, or a set screw designed to fracture the head portion at the proper load. Furthermore, the exertion of torque on the set screw exerts a force on the implant and bone. This detrimental load on the spine must be countered by another instrument referred to as a counter-torque instrument. This makes the surgical procedure more difficult, as room must he provided for the counter-torque instrument.
There have been other solutions. U.S. Pat. No. 5,683,392, to Richelsoph et al., discloses a non-threaded locking means whereby an outside collar is drawn upwards over an inner collet to lock the screw and rod simultaneously. This mechanism requires considerable force to engage the collar and is bulky due to the wall thickness needed in the collar to maintain compressive strength. U.S. Pat. Nos. 6,010,503 and 6,355,040, to Richelsoph show a collet that is inserted within the body portion of at implant, such that the walls of the collet deflect and bend to engage the rod and lock the assembly. While this creates a low profile, the mechanism is complex and requires significant energy to lock the system together.
The energy required to lock the system further complicates the instrumentation. Instruments become larger and more complex whenever this is an increase in required locking force. This is partly due to the energy loss in locking due to elastic and plastic deformation of the implant and elastic energy losses due to flexing of the instruments.
It would therefore be useful to develop a locking means that locks securely without exerting any torsional load on the spine, requires no torque wrench or breaking set screws, self adjusts to exert proper locking force, is uneffected by in vivo conditions (for example, blood and debris in threads), eliminates threads and the risk of cross-threading, as an efficient use of energy to allow maximum use of the locking energy without frictional or mechanical losses, can stay within known acceptable tolerances for locked components, and is small, compact, and simple.


Disclosed is a mask comprising a first area including a first surrounding area in which a halftone phase shift film or a stacked film of a halftone phase shift film and an opaque film is provided on a transparent substrate, and a first opening area surrounded by the first surrounding area, and a second area including a second surrounding area in which a halftone phase shift film is provided on the transparent substrate and a second opening area surrounded by the second surrounding area, wherein a transparent film is provided in at least a part of the second opening area, the transparent film being configured to give a predetermined phase difference to exposure light passing through that part of the second opening area in which the transparent film is provided relative to exposure light passing through the second surrounding area.

1. Field of the Invention
The present invention relates to a mask, a manufacturing method for a mask, and a manufacturing method for a semiconductor device.
2. Description of the Related Art
The inventors have already proposed a focus monitor mask used to measure the magnitude of defocus in an exposure apparatus including the sign of the defocus (refer to Jpn. Pat. Appln. Nos. 11-274701 and 11-375472, which correspond to U.S. Pat. No. 6,440,616). FIG. 20 illustrates an example of this focus monitor mask. This figure schematically shows a planar configuration of a mask pattern formed area.
The mask pattern formed area includes a reference mark area 10 and a phase shift mark area 20. The reference mark area 10 has a surrounding portion (surrounding area) 11 including an opaque portion or a halftone portion and five opening portions (opening areas) 12 surrounded by the surrounding portion 11. The phase shift mark area 20 has a surrounding portion 21 including a halftone portion and five opening portions 22 surrounded by the surrounding portion 21. The opening portions 12 and 22 are used as focus monitor marks and have the same diamond-like (rhomboid-like) planar shape. A phase difference between the opening portions 22 and the surrounding portion 21 is set to be 90°. Accordingly, there is a phase difference of 90° between exposure light passing through the opening portions 22 and exposure light passing through the surrounding portion 21.
The use of a mask configured as described above enables focus monitoring. This focus monitoring utilizes misalignment that may occur between the best focus point for the pattern (reference mark) of the opening portions 12 and the best focus point for the pattern (phase shift mark) of the opening portions 22. A monotonous decrease or increase relative to defocus is observed in a size difference between a long side of the reference mark and a long side of the phase shift mark which difference may occur after exposure or development. Thus, by determining the relationship between defocus and this size difference in the form of a calibration curve and subsequently measuring a size difference on a wafer after exposure and development, the magnitude of defocus can be monitored including its direction.
FIG. 22 shows the relationship (calibration curve) between a size difference (L–L′) and defocus where L denotes the size of a long side of a reference mark on a wafer and L′ denotes the size of a long side of a phase shift mark on the wafer. A line a indicates the size L of the reference mark. A line b indicates the size L′ of the phase shift mark. A line c indicates the size difference (L–L′). The size difference c increases monotonously relative to defocus. Accordingly, this calibration curve can be used to determine the magnitude of defocus including its sign. In this connection, varying the magnitude of exposure by ±10% does not substantially change the calibration curve. Therefore, even with a slight variation in the magnitude of exposure, the defocus can be accurately detected.
Now, description will be given of a manufacturing method for a conventional mask having a pattern such as the one shown in FIG. 20. FIGS. 21A to 21H schematically show cross sections taken along line A–A′ in FIG. 20.
First, as shown in FIG. 21A, a quartz substrate is provided as a transparent substrate 101. An MoSiOx film is formed on the transparent substrate 101 as a halftone phase shift film 102. Subsequently, a Cr film is formed on the halftone phase shift film 102 as an opaque film 103. Furthermore, a chemically amplified positive type resist 104 is applied to the opaque film 103. The halftone phase shift film 102 sets a phase difference of 180° between exposure light passing through the halftone phase shift film 102 and exposure light passing through the opening portion 12.
Then, as shown in FIG. 21B, focus monitor marks are written in the resist film 104 in a reference mark area and a phase shift mark area. At this time, device pattern is also written in a device pattern forming area (not shown). Subsequently, the substrate is baked and then development is carried out to form a resist pattern 104.
Then, as shown in FIG. 21C, the opaque film 103 and the halftone phase shift film 102 are sequentially etched using the resist pattern 104 as a mask. This etching forms a focus monitor mark pattern corresponding to the planar shape of the opening portions 12 and 22 as well as a device pattern (not shown). Subsequently, the resist film 104 is removed and the substrate is cleaned.
Then, as shown in FIG. 21D, an i-ray photo resist 151 is applied. Subsequently, to mask the area except for the opening portions of the phase shift mark, a writing operation is performed using a laser writing apparatus. Furthermore, a developer is used to carry out development to obtain a resist pattern 151.
Then, as shown in FIG. 21E, the transparent substrate 101 is etched using the resist pattern 151 and the opaque film 103 as a mask. This allows the transparent substrate 101 to be etched only in the opening portions of the phase shift mark to form holes 152.
Then, as shown in FIG. 21F, the resist 151 is removed and the substrate is cleaned.
Then, as shown in FIG. 21G, an i-ray photo resist 153 is applied. Subsequently, to mask the opening portions in the reference mark area 10, Cr opaque frame portions, and other Cr pattern portions, the laser writing apparatus is used to write in the resist film 153. Furthermore, a developer is used to carry out development to obtain a resist pattern 153.
Then, as shown in FIG. 21H, the resist pattern 153 is used as a mask to wet-etch the opaque film 103. Subsequently, the resist film 153 is removed and the substrate is cleaned.
A mask configured as shown in FIGS. 20 and 21H is obtained as described above. Since the transparent substrate 101 is etched to form the holes 152, it is possible to give a phase difference of −90° to exposure light passing through the opening portions in the phase shift mark area 20 relative to exposure light passing through the opening portions in the reference mark area 10.
However, with the above conventional manufacturing method, extra lithography and etching steps such as those shown in FIGS. 21D to 21F are required to form the holes 152 used to create a phase difference of 90°. This sharply increases the time required for a manufacturing process, thus affecting manufacturing costs and TAT.
Thus, the conventional focus monitor mask requires extra lithography steps to obtain a phase difference of 90°. This increases the time required for the manufacturing process, thus increasing manufacturing costs.

Mask, manufacturing method for mask, and manufacturing method for semiconductor device


A self-opening and self-closing device enabling entry into a controlled access area includes a gate with two laterally retractable panels that may be opened by inserting a ticket or access card into a control mechanism. Each of the panels is controlled by a respective motor operated by the control mechanism. Each panel is secured to at least two runner members that are each operated by a roller secured to a link arm. The link arms are rotationally interconnected and rotated by the respective motor. Simultaneous rotation of the arms in opposite directions moves the two panels together (or apart) and thus closes (or opens) the entry device by moving each panel into a position in which it is locked by the respective arm in the horizontal position.

A common way for controlling users entries into a public transport network such as metropolitan or regional rail system consists in installing entry devices whose opening is activated by the user through the insertion of a ticket or access card into a control mechanism.
Currently, there are two types of entry devices. The first type is a three-arm turnstile whose rotation by 120.degree., which allows only one person to get through, is activated by the insertion of a ticket into the control mechanism. The major drawback of such a device is that users who want to commit fraud can easily step it over.
To overcome this drawback, a second type of entry device has been installed for controlling users, either as a stand-alone device, or along with the three-arm turnstile. This is a quite high one-panel or two-panel gate, whose automatic opening activated by the insertion of the ticket into the control mechanism is controlled by an electric or pneumatic system. Such devices present a number of drawbacks. First, existing control systems require quite a long time to run their cycle and activate the opening (approximately 0.5 to 0.7 sec.), and thus require that the ticket control mechanism be located at a distance from the automatic door, what reduces the users flow. Once activated, the opening is abrupt. As a result, the system is noisy and subjected, mainly at the end of the opening cycle, to vibrations that reduce its reliability. Moreover, a high power is required, what makes the system expensive. At last, since the user always faces a closed door before its opening, such devices may cause a very unpleasant feeling of confinement to the user.
The system disclosed by the patent U.S. Pat. No. 1,643,454 relates to a garage door activated by a motor driven crank. A roller interdependent with the crank runs into a slide interdependent with the door, thus transforming the crank rotation motion into the door translation. This way, half a turn of the crank enables to switch from the open position to the closed and locked position since the crank is stopped in a position slightly below a horizontal level. This system, that can be profitably used for automatic gate opening and closing, has however the drawback that driving and locking the door by only one crank requires a heavy door and/or rail guiding on the floor or a long recess housing since the opening or closing effort during acceleration and deceleration phases, and especially the effort for forcing the entry not lined up with the rod, applies on the guiding device a high torque that may cause the failure of the mechanism. Moreover, such a system does not provide for automatic and fast opening of the gate in case of an accidental power cut.

Self-opening entry device for a controlled access area


A method, device and computer product suitable for performing an analysis on a Grid Computer Network (GCN) is disclosed. The method comprises the steps of representing selected ones of a plurality of components and a relationship among the components in the GCN, providing a mapping between a plurality of events and a plurality of observable events occurring among the components, wherein the mapping is represented as a value associating each event with each observable event, and determining at least one likely causing event based on at least one of the plurality of observable events by determining a measure between each of a plurality of values associated with the plurality of observable events and the plurality of causing events. The step of representing the GCN, comprises the steps of creating at least one non-specific representation of the selected components, wherein the non-specific representations are selected from the group consisting of ComputeElement, GridService and GridServiceInstance, and creating at least one non-specification representation of relations along which the events propagate amongst the selected components, wherein the representations of relations are selected from the group consisting of ComposedOf, Part of, HostedBy, and HostsServices. Also disclosed is an apparatus comprising a processor and a computer program product providing computer instruction to a computing system for executing the method steps described herein.

Grid computing is an emerging computing model that provides the ability to perform higher throughput computing by taking advantage of many networked computers to model a virtual computer architecture that is able to distribute process execution across a parallel infrastructure. Grids use the resources of many separate computers connected by a network, e.g., the Internet) to solve large-scale computation problems. Grids provide the ability to perform computations on large data sets, by breaking the data sets down into many smaller operations, or provide the ability to perform many more computations at once than would be possible on a signal computer, by modeling a parallel division of labor between processes. In a conventional environment, resource allocation in a grid computer network is done in accordance with one or more Service Level Agreements (SLAs).
A Grid computing environment is created to address large scale resource needs. The use of recourses, e.g., CPU cycles, disk storage, software programs, peripherals, etc., is usually characterized by the resources' availability outside the context of the local administrative domain. This external provisioning approach entails creating a new administrative domain referred to as a Virtual organization with a distinct and separate set of administrative policies.
One characteristic that currently distinguishes grid computing networks from distributed computing is the abstraction of a distributed resource into a grid resource. One result of abstraction is that it allows resource substitution to be more easily accomplished. Some of the overhead associated with this flexibility is reflected in the temporal latency associated with the access of a grid resource.
As grid computing networks increase in the number of elements utilized and the allocation of element resources, there is a need in the industry for providing a method of modeling Grid computing for determining performance and allocating resources and further for analyzing the network to determine root-cause failures and impacts of such failures.

Method and apparatus for analyzing and problem reporting in grid computing networks


The disclosed embodiments include ball valves having integrated seats. The integrated seats are included in a ball body assembly of a valve body. The ball body assembly may rotate with respect to the valve body to open or close the valve. The integrated seats may contact walls of a bore to sealingly close the valve.

This section is intended to introduce the reader to various aspects of art that may be related to various aspects of the present invention, which are described and/or claimed below. This discussion is believed to be helpful in providing the reader with background information to facilitate a better understanding of the various aspects of the present invention. Accordingly, it should be understood that these statements are to be read in this light, and not as admissions of prior art.
Ball valves are capable of controlling a flow through a conduit by using a sphere with a port or hole typically centered in the sphere. The valve is opened by rotating the sphere so as to position the port or hole in line with both ends of the valve. A flow may thus move from a first end of the valve, traverse the port or hole, and continue through the second end of the valve. Likewise, the valve is closed by rotating the sphere so as to position the port or hole perpendicular to the ends of the valve. Unfortunately, the sphere may deform over time under loading conditions, resulting in leakage or improper seals.


A plurality of antennas receives radio wave transmitted from a vehicle which comes in a toll collection area. Each antenna has at least three antenna elements, and the antennas are disposed in the horizontal direction and vertical direction. The signal analyzer analyzes the ID signal included in the received radio wave to identify the vehicle. The direction detector measures the direction of arrival (DOA) of radio wave received by two antennas selected by the antenna selector by way of two-dimensional interferometry principle in terms of the directional angle and depression angle. The location detector calculates the location of the vehicle in the horizontal direction and the height in the vertical direction of the vehicle as a location information based on the DOA of the radio wave measured by the direction detector. The vehicle tracking unit generates the locus data of the vehicle based on the location information calculated by the location detector and the information for identifying the vehicle analyzed by the signal analyzer. On the other hand, the video camera takes a picture of the vehicle which comes in the toll collection area to obtain the picture data. The data correlation unit judges whether the vehicle is a violator vehicle by correlating the picture data and locus data. The controller registers the locus data and picture data of the vehicle if the vehicle is a violator vehicle. On the other hand, the controller collects a prescribed toll from the vehicle if the vehicle is not a violator vehicle.

1. Field of the Invention
This invention relates to a vehicle identification system, and particularly relates to a vehicle identification system applicable to the electric toll collection (ETC) systems provided with a means for measuring the location of a vehicle by measuring direction of arrival (DOA) of radio wave transmitted from the vehicle.
2. Description of the Related Art
A conventional vehicle identification system to be applied to ETC systems for using on toll roads is disclosed in U.S. Pat. No. 5,440,109. In this conventional vehicle identification system, an infrared beacon (IRB) which is a component of an infrared communication system (IRK), an infrared video camera (IRV) which is a component of an infrared location measurement system, a traffic radar system (RD), and a usual video camera (NV) which is a component of a vehicle identification-recording system (FIR) are installed on a toll booth side. These systems are connected to a controller for performing a total data processing and correlative processing.
By way of the data fusion of three types of information obtained from these systems, namely radar information, IR location information, and video information, the identification of a vehicle under the communication for toll collection is performed.
However, in this conventional vehicle identification system, it is required to install an infrared communication system, and it results in high cost. The communication by way of infrared ray is not appropriate to a foggy environment, and therefore if this conventional vehicle identification system is used in a foggy place, it is apt to cause the erroneous detection of a vehicle and communication trouble between a toll booth and vehicles.

Vehicle identification system for electric toll collection system


A method and apparatus for managing data structures associated with large files are provided. With the apparatus and method, region control blocks for a data file are allocated on demand from an array of control blocks and are organized into a tree data structure. The tree data structure includes a base region control block and zero or more extended region control blocks. The base region control block includes a pointer to a root of the tree data structure and information about the data file. The extended region control blocks have pointers to the base region control block, to a successor region control block, and pointers to zero to four child region control blocks. Using this tree data structure, the operating system may perform various operations on the region control blocks with improved performance.

1. Technical Field
The present invention is directed to a method and apparatus for managing a set of data structures associated with a large file. More specifically, the present invention is directed to a method and apparatus for maintaining and using a tree structure to represent the relationship of region control blocks of a data file.
2. Description of Related Art
In the AIX operating system, it is useful to divide files into regions of 256 megabytes. Each region is assigned a unique identifier that is used by the virtual memory manager to find the memory associated with each region. The unique identifier can be mathematically converted to an address of a region control block, which is used to maintain information about the region, such as how many pages of the region are currently in memory, and the like.
In AIX version 5.2, files as large as 16 terabytes are supported. A 16-terabyte file contains 65,536 256-megabyte regions. The AIX operating system is designed to support 4 petabyte files (252 bytes), and a file this large contains 16,777,216 regions.
In the AIX operating system, a file that is currently in use by an application is uniquely identified by the identifier assigned to the file's first 256-megabyte region. This region is called the "primary region" or "base region." If the file is larger than 256 megabytes, additional region control blocks are allocated, each with its own unique identifier. These regions are called "extended regions." The regions are numbered consecutively with region 0 being the base region while region 1 is the extended region associated with the second 256-megabyte region of the file (the unique identifier associated with a region is independent of the region number).
Files can be created without writing to every region of the file. In addition, an application can read a portion of a file without reading the entire file. In both cases, the operating system allocates new region control blocks dynamically.
Typically, the control blocks for a file are part of a linked list in which each control block for a region has a pointer to the control block for another region. Thus, operations performed on the regions of the files require traversing the linked list until the desired region control block is encountered and then performing the operation. Since large file in AIX may have 16,777,216 regions, the linked list becomes large and the computing time required to traverse such a linked list becomes prohibitive.
Thus, it would be beneficial to have a method and apparatus for managing a set of data structures associated with a large file that arranges the control blocks in a tree, so that a desired region control block can be found much more quickly, thereby reducing the amount of computing time necessary to identify the control blocks for regions of interest.

Method and apparatus for managing a set of data structures associated with a large file

International Business Machines Corporation


An electronic device, such as a print device, generates barcodes that contain encoded data corresponding to a functional destination and a variety of electronic device operational parameters. When a user selects a functional category, the electronic device determines the category's destination and relevant parameters, and generates the barcode with destination data and the parameters. A user may then use a barcode scanner to scan the barcode and automatically transmit the parameters to the destination.

This document relates generally to systems and methods for performing document services using Mobile Communication Devices ("MCDs"), and more particularly, to systems and methods configured for providing non-connected product data exchange using barcode symbology and/or mobile technology.
In many service provider applications, electronic devices are placed in customer facilities. Such electronic devices include, but is not limited to, document handling devices, machinery, vehicles, heating/cooling units, water supply/quality meters, energy meters, and vending machines. The electronic devices are typically configured to collect information that is useful for billing purposes, supply ordering purposes, service ordering and diagnostic purposes. For example, a customer enters into a contract with a document service provider for document services (e.g., copying). In order to provide the document services, a multi-functional device is placed in a facility of the customer. The customer is charged by the document service provider based on the total number of copies made by the multi-functional device. As such, the multi-functional device tracks the number of copies made thereby. In order for the document service provider to prepare a bill, it needs to obtain the "page-related" information from the multi-functional device. This information may be identified by the type of operation performed against each page such as copy, print, fax or scan operations.
The "page-related" information can be obtained in many ways. If the multi-functional device is connected to a service provider system via the Internet, then the "page-related" information is communicated automatively from the multi-functional device to the document service provider over a communications link. However, if the multi-functional device is a non-connected machine (i.e., the multi-functional device is not connected to a service provider system via a network), then the "page-related" information is obtained by the document service provider via a manual process. The manual process typically involves: presenting the "page-related" information to a person via a display screen of the multi-functional device; manually writing the displayed information on a sheet of paper; and sending the written information to the document service provider via a fax, email or online form. The manual process is a relatively costly, inaccurate and error prone solution for obtaining data from a non-connected machine.

Not-connected product data exchange via symbology


There is provided a plasma display device that has a first, a second, and a third electrodes, phosphors emitting a light depending on discharges generated by applying voltages of the first to third electrodes, and a drive circuit for applying a pulse to the third electrode in every time discharge light emission is generated by applying an alternating pulse between the first and second electrodes, and the time at which the pulse of the third electrode reaches 50% of its amplitude in the trailing edge takes place before the time of the first peak of the light emission waveform.

1. Field of the Invention
The present invention relates to a plasma display device and a method for driving the same.
2. Description of the Related Art
A plasma display is a large-sized flat type display and begins to prevail as a home-use wall hanging type TV. Further distribution of the plasma display demands improved luminous efficiency and low power consumption.
In the patent document 1 (Japanese Patent Application Laid-open No. 2000-251746), which has disclosed a plasma display panel having auxiliary electrodes. In the patent document 2 (Japanese Patent No. 3573005), which has disclosed a method for driving a plasma display panel having the first, the second and the third electrodes.

Plasma display device and method for driving the same


Disclosed is a pattern forming method, comprising the steps of providing a resist film, applying a light exposure to the resist film, with a film directly above the resist film and another film directly below the resist film being made insulative, applying a charged beam exposure to the resist film, with the film directly above the resist film and the other film directly below the resist film being made conductive, and developing the resist film to form a resist pattern.

The present invention relates to a pattern forming method which permits forming a semiconductor integrated circuit pattern including fine patterns with a high superposing accuracy and with a high through-put.
The photolithography technology used in the manufacture of a semiconductor device facilitates the manufacturing process and lowers the manufacturing cost and, thus, has been widely employed in the manufacture of electronic devices. As a result of technical innovation which continues to be made nowadays, miniaturization of a device has now been achieved to provide a device sized at 0.25 .mu.m or less by the use of a light source of a short wavelength (KrF excimer laser light source). Also, vigorous researches are being made on the use of ArF excimer laser light source having a wavelength shorter than that of the KrF excimer laser light, or on the development of a Revenson type phase shifting mask in an attempt to achieve further miniaturization of the device. These new techniques are expected to provide a mass production lithography tool corresponding to the 0.15 .mu.m rule.
However, various problems must be solved for developing these new techniques, and a long time is required for the development. It is worried about that the speed of development may fail to follow the speed in the miniaturization of the device.
On the other hand, a charged beam lithography, which is considered to be a first candidate of the post-photolithography, has already proved that it is possible to form a pattern sized at 0.01 .mu.m by using a finely drawn beam. This technology is satisfactory in terms of miniaturization of the device, but leaves room for further improvement in terms of the through-put when used as a tool for mass production of the device. To be more specific, fine patterns are depicted one by one in the charged beam lithography, leading to requirement of a long treating time.
A pattern forming method utilizing a charged beam which exhibits a resolution higher than that achieved by light and achieving a through-put substantially equal to that of a light stepper and a lithography system achieving the particular pattern forming method are being developed in recent years. The particular pattern forming method is expected to provide a mass production system adapted for use after the era of the photolithography. In the particular pattern forming method and the lithography system, it is necessary to form a conductive upper film right above a resist film or to form a conductive underlying film right below the resist film in order to prevent the charge accumulation in the step of exposure to the charged beam.
However, if the conductive film is formed right above or below the resist film, it has been clarified that the profile of the resist pattern formed by the light exposure is deteriorated, and that the process allowance is lowered. Particularly, these problems are rendered prominent where a fine pattern smaller than the wavelength of the light used for the light exposure is to be formed.
Also, in this technique, it is necessary to align the pattern of exposure to light with the pattern of exposure to the charged beam. In this case, each of these patterns is aligned with the same mark. In other words, it is unavoidable to employ an indirect alignment. The necessity of employing an indirect alignment in place of a direct alignment is a serious defect because the required accuracy of alignment is made severer to severer in accordance with miniaturization of the pattern size.
The present inventors previously proposed a pattern forming method in which a charged beam is aligned with a latent image formed in advance within a resist film by exposure to light. In this method, a conductive layer is formed above or below a resist film in order to prevent a charge up in the step of exposure to a charged beam, with the result that it is difficult to clearly sense the latent image formed within the resist film. It follows that the S/N ratio of the position information is deteriorated, making it difficult to achieve the required alignment accurately. In other words, it was impossible to align the light exposure pattern within the resist layer with the charged beam pattern while preventing the charge-up problem from taking place in the step of exposure to a charged beam.

Pattern forming method utilizing first insulative and then conductive overlayer and underlayer


A battery monitor which monitors the operating parameters of a battery to provide an indication of, for example, the absolute state of charge, the relative state of charge, and the capacity of the battery under battery discharge, rest, and recharge conditions. The battery monitor includes a current sensor for sensing battery current, a voltage sensor for sensing battery voltage, and a temperature sensor for sensing battery temperature. A processor approximates to a high level of accuracy the battery parameters utilizing an iterative process based upon predetermined relationships, employing empirically determined constants and parameters determined in the immediately proceeding iteration stored in memory. Output signals indicative of the determined parameters are provided and may be utilized for many different battery applications.

The present invention is generally directed to a battery monitor and method for monitoring the operating parameters of a battery such as a lead-acid battery. The present invention is more particularly directed to a battery monitor and method for monitoring the operating parameters of a battery and providing output signals indicative of the operating parameters such as the capacity of the battery, the relative state of charge of the battery, or the absolute state of charge of the battery independent of whether the battery is in discharge, recharge, or at rest. The battery monitor, at spaced apart time intervals, estimates the operating parameters to a high degree of accuracy based upon predetermined relationships of measured battery current, measured battery voltage, measured battery temperature, empirically determined constants, and previously determined operating parameters or measured values.
Lead-acid storage batteries have become highly refined since these devices were first utilized commercially about 125 years ago. Since its introduction, the lead-acid storage battery has distinguished itself as a highly efficient and reliable electrochemical energy source. In addition to being a highly efficient energy source, lead-acid storage batteries are also relatively insensitive to debilitating temperature effects over a broad temperature range of, for example, -40.degree. to about 160.degree. F. As a result, lead-acid storage batteries lend themselves to a broad range of utilities which continues to increase.
Transportation is one example of a commercial use for lead-acid storage batteries. Such batteries have been used for small or personal vehicle movement for quite some time. For example, such batteries have been used effectively for golf carts, wheelchairs, trolling motors or similarly small-scaled transportation devices. There has also been great interest recently in the adaptability of such storage batteries for providing power to larger vehicles such as, the so-called "electric car." Such vehicles rely heavily upon the regenerative ability of lead-acid storage batteries to provide adequate power for transportation over reasonable distances, as for example, 50 miles, without the need for recharging. For such applications, it is of obvious importance to the user that a destination be reached prior to the need to recharge or replace the batteries. Currently, because of the rarity of electric vehicles for general transportation, facilities do not exist as a general matter for recharging such batteries and hence, travel must be carefully scheduled and monitored. In turn, there is a compelling need for monitoring the state of charge of the battery or batteries to provide an accompanying fuel gauge like indication of the amount of energy remaining in the battery or batteries for continued travel.
There have been a number of proposals, in the prior art, for providing such monitoring of batteries, such as a lead-acid storage battery. For example, one arrangement examines the condition of a storage battery used as a starting, lighting and ignition battery for an internal combustion engine. This arrangement measures battery voltage under opened circuit conditions and while the battery is subjected to a predetermined AC load and a predetermined DC load. The temperature of the battery is also monitored. A microprocessor utilizes the opened circuit potential, the measured potential under both DC and AC loading, and the temperature to ascertain the characteristics of the battery. For example, internal resistance is determined and, should it be found to be excessive, the battery is deemed defective. Open circuit voltage, internal resistance and temperature provide inputs for calculating the estimated power at a fully charged state. The apparatus then discharges the battery through a reference load for about 15 seconds at constant load and measures a 15 second battery voltage. This voltage is then compared to a similar voltage of a battery at about 75% state of charge under the same conditions. If the voltage measured is higher than value maintained in a computer, the battery condition is deemed good. As a result, performance benchmarks are ascertained with a view toward determining battery capability.
Another arrangement concerns an apparatus for determining the general state of charge of a battery. This approach, however, requires the battery to be taken off-line from its circuit and connected to a calibrated resistor to determine state of charge. The process requires the battery to be subjected to two loads, one corresponding to a minimum current consumption level or load and the other a maximum consumption level or load. The process includes monitoring the load condition between the minimum and maximum load possibilities, periodically connecting the battery to a reference load when the minimum load is applied to the battery sampling the voltage across the reference load and comparing the sample voltage to an array of predetermined levels, each corresponding to a different state of charge. The comparison thereby yields an indication of the present condition of the battery.
A further arrangement determines state of charge of a battery based upon the integration of current. During the first portion of the discharge, the state of charge is evaluated by integrating the current after compensating for the rate of discharge. Later in the discharge, the state of charge of the battery is determined from the lowest subpack voltage corrected for polarization. Battery polarization is used to calculate a corrected battery voltage which is used to terminate discharge at an appropriate time.
A more improved battery monitor is shown and described in U.S. Patent No. 4,876,513 which is assigned to the Assignee of the present invention. This monitor is a dynamic state of charge indicator for a storage battery characterized by a discharge curve relating available energy of the battery to a contemporaneous voltage over a range of voltage boundaries having predetermined end points corresponding to fully charged and effectively discharged for one charge cycle. The indicator includes a microprocessor which stores predetermined relationships between the contemporaneous voltage and the state of charge of the battery. A voltage sensor and a current sensor are connected to monitor battery voltage and current flow and to provide corresponding voltage and current signals to the microprocessor. The microprocessor periodically computes the internal resistance of the battery, the average voltage and current for a predetermined discharge time period and a corrected voltage as a total of internal resistance voltage loss and average voltage with the state of charge being determined as a function of corrected battery voltage.
While the last mentioned battery monitor provided a distinct advancement in the art, there still remains a need in the art for a more effective battery monitor. For example, there is a need in the art for a battery monitor which is capable of providing indications of battery state of charge whether the battery is in discharge, recharge, or at rest. The aforementioned battery monitor disclosed in U.S. Pat. No. 4,876,513, because it relies upon a measurement of internal battery resistance, requires that the battery be in discharge. As a result, the state of charge of the battery can only be determined when the battery is in discharge. Also, because the internal resistance measurement requires a fluctuating current, such measurements are subject to inaccuracies.

Battery monitor and method for providing operating parameters


An interposer including a fence that receives and aligns a semiconductor device, such as a flip-chip type semiconductor device, with an interposer substrate. The fence may include edges that are configured to progressively align a semiconductor device with the interposer substrate. The fence may also include one or more laterally recessed regions to facilitate rough alignment of a semiconductor device with the interposer substrate. Methods for fabricating the fence include the use of stereolithographic and molding processes. When stereolithography is used to fabricate the fence, a machine vision system that includes at least one camera operably associated with a computer may be used to control a stereolithography apparatus and facilitates recognition of the position and orientation of interposer substrates on and around which material is to be applied in one or more layers to form the fence. As a result, the interposer substrates need not be precisely mechanically aligned.

1. Field of the Invention
The present invention relates generally to an interposer configured to receive a semiconductor device for testing. More specifically, the invention pertains to such a test interposer having an alignment fence for receiving and aligning semiconductor devices, such as flip-chip type semiconductor dice, ball grid array (BGA) packages, and chip scale packages (CSPs), with test sockets of the interposer. The present invention also relates to methods for fabricating such a test interposer.
2. Background of Related Art
The semiconductor industry produces extremely large numbers of miniature electrical devices, or "chips" or dice, which are referred to as semiconductor devices. Semiconductor devices are installed in essentially every electronic device. Such devices are typically fabricated in large numbers on a wafer of semiconductive material (e.g., silicon, gallium arsenide, or indium phosphide). The individual chips or dice are then singulated from the wafer.
Tests are typically performed at several stages of manufacture for the purposes of evaluating the electrical characteristics of various circuits of the semiconductor devices and for detecting electrical, structural, and other types of faults in the semiconductor devices. These tests are sometimes performed on representative semiconductor devices and sometimes on each semiconductor device of a certain type, depending on the criticality of use, manufacturing costs, and expectation of flaws.
Conventionally, the semiconductor industry favored a "final" electrical testing of semiconductor devices, which was effected before semiconductor devices were packaged with electrical leads extending therefrom and encapsulated in a protective material. However, it is now recognized that conventional packaging processes may cause significant numbers of semiconductor devices to fail. For example, as a semiconductor device is being encapsulated, the protective material may cause particulate die coat penetration, "bond wire sweep," which may break electrical connections made by the bond wires or cause electrical shorts between adjacent bond wires, and other problems. Accordingly, it is desirable to test semiconductor devices after they have been packaged.
Some state of the art semiconductor devices lack conventional packages (e.g., leads and encapsulants) or are minimally packaged. Flip-chip type semiconductor devices may be left unpackaged and connected directly to a higher level substrate by way of conductive structures, such as solder balls, disposed between the bond pads of the flip-chip and corresponding contact pads of the higher level substrate.
Ball grid array packages, a type of flip-chip semiconductor device, may include a semiconductor die disposed on and electrically connected to an interposer. The interposer has contact pads on the opposite side thereof that are arranged in a pattern complementary to that of contact pads on a higher level substrate to which the ball grid array package is to be connected. The interposer may also include electrical traces that lead to contact pads arranged in a different pattern than the bond pads of the semiconductor die and, therefore, reroute the bond pads of the semiconductor die.
Another type of state of the art package is the so-called "chip scale package," wherein the dimensions of the total package are only slightly larger than the dimensions of the semiconductor die thereof. A chip scale package typically includes a flip-chip type semiconductor die with one or more thin layers of protective material (e.g., plastic encapsulant) on the active surface thereof. Conductive structures (e.g., solder bumps) protrude from bond pads of the flip-chip type semiconductor die and extend above the layer of protective material. Chip scale packages may also have one or more thin layers of protective material on the edges or backsides of the semiconductor dice thereof. Ball grid array packages may be formed as chip scale packages.
When these types of semiconductor devices are tested, the solder bumps or other conductive structures protruding therefrom may not properly align with the corresponding test sockets of a test substrate so as to establish adequate electrical contacts between the tested semiconductor device and the test substrate. Moreover, if misalignment occurs, the conductive structures may be damaged.
In order to reduce potential damage to conductive structures, such as solder bumps, during the testing of flip-chip type semiconductor devices, interposers have been used between a test substrate and a semiconductor device to be tested. These interposers may comprise micromachined silicon or ceramic structures that include metal-lined recesses for receiving conductive structures of a semiconductor device to be tested, metal-filled vias extending from the bottom of each recess to the opposite, bottom side of the interposer, and conductive structures, such as solder bumps, communicating with the metal-filled vias and protruding from the bottom side of the interposer. The recesses of the interposer are configured to receive the conductive structures of a semiconductor device to be tested without stressing or damaging the conductive structures. The metal lining of and metal-filled via communicating with each recess facilitates electrical communication between a conductive structure disposed in each recess and the corresponding, underlying conductive structure protruding from the bottom of the interposer. The conductive structures of the interposer are precisely aligned with test pads or sockets of a test substrate so as to establish an electrical connection between a semiconductor device assembled with the interposer and the test substrate. The test pads or sockets of the test substrate communicate with known semiconductor device test equipment.
Nonetheless, the conductive structures protruding from a semiconductor device to be tested may be damaged when assembled with such an interposer. Moreover, since the recesses of such interposers are configured to receive the conductive structures of a semiconductor device without stressing, deforming, or otherwise damaging the conductive structures, the interposer may fail to make adequate electrical connections between some of the conductive structures and their corresponding test pads or sockets of the test substrate. Moreover, test interposers typically lack any alignment component other than the recesses thereof.
Accordingly, it appears that the art is lacking a structure for aligning the conductive structures of a semiconductor device with corresponding test pads or sockets of a test substrate without stressing or damaging the conductive structures while facilitating adequate electrical connections between the conductive structures and the test pads or sockets.
In the past decade, a manufacturing technique termed "stereolithography," also known as "layered manufacturing," has evolved to a degree where it is employed in many industries.
Essentially, stereolithography as conventionally practiced involves the use of a computer to generate a three-dimensional (3-D) mathematical simulation or model of an object to be fabricated, such generation usually effected with 3-D computer-aided design (CAD) software. The model or simulation is mathematically separated or "sliced" into a large number of relatively thin, parallel, usually vertically superimposed layers, each layer having defined boundaries and other features associated with the model (and thus the actual object to be fabricated) at the level of that layer within the exterior boundaries of the object. A complete assembly or stack of all of the layers defines the entire object, and surface resolution of the object is, in part, dependent upon the thickness of the layers.
The mathematical simulation or model is then employed to generate an actual object by building the object, layer by superimposed layer. A wide variety of approaches to stereolithography by different companies has resulted in techniques for fabrication of objects from both metallic and nonmetallic materials. Regardless of the material employed to fabricate an object, stereolithographic techniques usually involve disposition of a layer of unconsolidated or unfixed material corresponding to each layer within the object boundaries, followed by selective consolidation or fixation of the material to at least a semisolid state in those areas of a given layer corresponding to portions of the object, the at least partially consolidated or fixed material also at that time being substantially concurrently bonded to a lower layer. The unconsolidated material employed to build an object may be supplied in particulate or liquid form, and the material itself may be consolidated or fixed or a separate binder material may be employed to bond material particles to one another and to those of a previously formed layer. In some instances, thin sheets of material may be superimposed to build an object, each sheet being fixed to a next lower sheet and unwanted portions of each sheet removed, a stack of such sheets defining the completed object. When particulate materials are employed, resolution of object surfaces is highly dependent upon particle size, whereas when a liquid is employed, surface resolution is highly dependent upon the minimum surface area of the liquid which may be fixed and the minimum thickness of a layer which may be generated. Of course, in either case, resolution and accuracy of object reproduction from the CAD file is also dependent upon the ability of the apparatus used to fix the material to precisely track the mathematical instructions indicating solid areas and boundaries for each layer of material. Toward that end, and depending upon the layer being fixed, various fixation approaches have been employed, including particle bombardment (electron beams), disposing a binder or other fixative (such as by ink-jet printing techniques), or irradiation using heat or specific wavelength ranges.
An early application of stereolithography was to enable rapid fabrication of molds and prototypes of objects from CAD files. Thus, either male or female forms on which mold material might be disposed might be rapidly generated. Prototypes of objects might be built to verify the accuracy of the CAD file defining the object and to detect any design deficiencies and possible fabrication problems before a design was committed to large-scale production.
In more recent years, stereolithography has been employed to develop and refine object designs in relatively inexpensive materials, and has also been used to fabricate small quantities of objects where the cost of conventional fabrication techniques is prohibitive for same, such as in the case of plastic objects conventionally formed by injection molding. It is also known to employ stereolithography in the custom fabrication of products generally built in small quantities or where a product design is rendered only once. Finally, it has been appreciated in some industries that stereolithography provides a capability to fabricate products, such as those including closed interior chambers or convoluted passageways, which may not be fabricated satisfactorily using conventional manufacturing techniques. It has also been recognized in some industries that a stereolithographic object or component may be formed or built around another, pre-existing object or component to create a larger product.
However, to the inventors' knowledge, stereolithography has yet to be applied to mass production of articles in volumes of thousands or millions, or employed to produce, augment or enhance products including other pre-existing components in large quantities, where minute component sizes are involved, and where extremely high resolution and a high degree of reproducibility of results are required. Furthermore, conventional stereolithography apparatus and methods fail to address the difficulties of precisely locating and orienting a number of pre-existing components for stereolithographic application of material thereto without the use of mechanical alignment techniques or to otherwise assure precise, repeatable placement of components. In particular, stereolithography has not been employed to fabricate interposers for aligning and connecting a semiconductor device to a test substrate.

This patent is subject to a terminal disclaimer.


A semi-oval shaped metallic carrier having an excellent thermal stress resistance and thermal fatigue resistance and used for an automobile exhaust gas-purifying catalyst, in which the carrier is composed of a metallic honeycomb body constituted by superimposing flat metal foils and corrugated metal foils one on the other and winding them together, and a metallic jacket enclosing the lateral face of the honeycomb body, the transverse section of the metallic carrier constituting the parallel portions and semi-circular arc portions and the honeycomb body is joined to the jacket mainly at the semi-circular arc portions or at the parallel portions of the honeycomb body.

1. Title of the Invention
The present invention relates to semi-oval-shaped (i.e., a shape having parallel portions and semi-circular arc portions at each end thereof) metallic carrier having an excellent thermal stress resistance and thermal fatigue resistance and used for supporting an automobile exhaust gas-purifying catalyst.
The most common type of carrier for supporting an automobile exhaust gas-purifying catalyst is formed as a honeycomb body consisting of superimposed flat metal foils (hereinafter referred to as "flat foils") and corrugated metal foils (hereinafter referred to as "corrugated foils") made of a heat resistant stainless steel, and wound together. The cross section of the carrier is usually circular, but there is a great demand for a semi-oval-shaped metallic carrier, because such a carrier is often mounted while surrounding a part of an engine.
Such metallic carriers must be able to withstand a thermal stress and thermal fatigue caused by a heat cycle dependent on heating and cooling treatments and a temperature distribution difference in a honeycomb body. When such a metallic carrier is subjected to the heat cycle, there occurs a large temperature difference between the jacket enclosing the honeycomb body and the outermost corrugated foil of the honeycomb body, and accordingly, a large thermal stress is developed on the outermost corrugated foil. Therefore, a means for suppressing this thermal stress becomes necessary, to enable the honeycomb body to be fixed to the jacket.
As described in, for example, Japanese Unexamined Utility Model Publication Nos. 61-162329 and 62-160728, a method is known of fixing a honeycomb body by folding down a jacket at the end face of the honeycomb body. In this method, the jacket and the honeycomb body are not joined together between the end faces, and thus no thermal stress is caused by a binding of the jacket.
Nevertheless, since the jacket is fixed to the honeycomb body at the end face thereof the honeycomb body is often ruptured due to the vibration of the engine or a thermal expansion elongation difference between the honeycomb body and the jacket, and if a thermal stress is repeatedly imposed on the carrier, a gap is gradually produced between the jacket and the honeycomb body, and the carrier becomes loose at that joint. Once the carrier becomes loose at that joint, the rupture of the honeycomb body becomes more and more severe, and the gap between the jacket and the honeycomb body becomes larger. As a result, the honeycomb body is vibrated and banged against the jacket, and the shock of such impacts causes the supporting slurry to fall from the catalyst, to thereby lower the purification capability of the catalyst.
Further, as disclosed in Japanese Unexamined Patent Publications Nos. 63-36842 and 62-273052, a method is known of fixing a honeycomb body by passing a pin through the honeycomb body or by fixing a plate therein. In this method, however, since the pin or plate is placed in the honeycomb body, these objects are deformed when exposed to very high temperatures, and thus lose their ability to fix the honeycomb body, and as a result, the honeycomb body is separated from the jacket, to thereby worsen the condition of the engine.
Furthermore, as disclosed in Japanese Unexamined Utility Model Publication No. 63-22319, a method is also known of fixing a honeycomb body by protuberances provided on the inner surface of a jacket. In this method, however, when a heat cycle is repeated, the honeycomb body crumbles at the protruding portions, whereby gaps are formed between each of the protuberances and the honeycomb body, and thus the fitting of the honeycomb body becomes loose.
As described above, none of the mechanically fixing methods can avoid an unstable fitting, and thus the efficiency of the metallic carrier is low.
The gist of the device described in Japanese Unexamined Utility Model Publication No. 62-194436 is a suppression of the binding between a honeycomb body and a jacket at an axial-directional open end, by joining them at a cross-sectional part of the honeycomb body, and in the examples of this publication, the jacket is joined to the honeycomb body by brazing. Although this method is useful for the suppression of stress developed in the axial direction, it is of no use for a suppression of stress developed in the radial direction, in cross section. In particular, when a radius in the direction of a major axis is long, as in a semi-oval-shaped carrier, the suppression of stress in the radial direction becomes important. In a method such as disclosed in Japanese Unexamined Utility Model Publication No. 62-194436, the thermal stress applied to a honeycomb body cannot be sufficiently suppressed, and a large thermal stress is imposed at the outermost corrugated foil of the honeycomb body, at which the honeycomb body is joined to a jacket, and thus the outermost corrugated foil is broken and becomes separated from the jacket.
U.S. Pat. No. 4,795,615 discloses a technique for joining a honeycomb body and a jacket, the object of this technique being to avoid an elongation in an axial direction of the honeycomb body from the jacket. Also, in this technique the locations of the junctions between the foils of the honeycomb body and between the honeycomb and the jacket are not duplicated in the axial directions.
Nevertheless, in a semi-oval-shaped carrier, a difference of the length of the major axis and the minor axis becomes large, and a deformation of the honeycomb body during a heat cycle is different at the major axis and at the minor axis, and thus a large thermal stress is imposed at the junction between the jacket and the honeycomb body, whereby the outermost corrugated foil thereof is broken and becomes separated from the jacket. This problem is not solved by a location of one junction between the jacket and the honeycomb body.
As described above, in the conventional techniques for fixing a jacket and honeycomb body to each other, the defects mentioned above cannot be overcome, and thus the true efficiency of a metallic carrier cannot be exhibited.

Semi-oval shaped carrier having excellent thermal stress resistance and thermal fatigue resistance for automobile exhaust gas-purifying catalyst


A chemiluminescent illuminated device employing a light-filtering injection molded polygonal shaped container that is scalloped to form an augmented illumination surface. The shaped housing includes a round shaped or form following chemical holding section. The lighting effects generated by the chemiluminescent chemical is enhanced by the polygonal shape and the inherent optical properties.

Chemiluminescent devices are non-incandescent products which produce light from a chemical mixture. The basic chemiluminescent process produces light when two chemical solutions are combined. The solutions are kept physically separated prior to activation. Physical separation typically consists of a sealed frangible glass vial containing a first solution that is placed within a second solution, both of which are housed in a sealed flexible vessel. When the vessel is flexed, the glass vial is ruptured thereby releasing the vial solution wherein the admixed chemical creates a reaction that produces light.
The chemical solutions are generally referred to as the "oxalate" component and the "activator" component. A typical oxalate component consists of Dibutyl Phthalate, CPPO and CBPEA.
A typical activator solution contains Dimethyl Phthalate, T-butyl alcohol, 90% aq. Hydrogen Peroxide, Sodium Salicylate. The components may be separated by a vial, pellet, separating wall, and so forth. Despite the type of separation, the object of these devices is to produce usable light. For this reason, the outer vessel is made of a light-filtering plastic material which permits the light produced by the reaction to pass through the vessel walls.
Numerous patents exist that disclose improvements in the oxalate and activators, such patents extending or enhancing the illumination properties of chemiluminescent lighting devices. The unique lighting effects generated from chemiluminescent lighting devices are enhanced by the inherent optical properties of the containing vessel. The color, clarity and degree of effervescence, if any, serve to add to dissipation of light throughout the vessel wall. Some dyes or coloring agents can be used not only as color filters but as fluorescers. A fluorescent dye functions by converting light of one wavelength to another wavelength. For example, blue light from a chemiluminescent device might be converted to red light by employing an appropriate fluorescer. This red light could be produced even if there was little or no red light emitted by the chemiluminescent device. Most of these improvements strive for producing a brighter illumination of the device. If the vessel is actually made larger, the amount of chemical needed is increased thereby making the device uneconomical. The corners, as disclosed, act as light concentrators to give an enhanced lighting effect but is commercially unviable. Conventional chemical lighting devices are manufactured with polyethylene or polypropylene plastics. Other types of plastics such as vinyl's, acrylics, or such are not compatible with the solvents typically utilized by chemical lighting devices.
U.S. Pat. No. 5,043,851 shaped housing having distinct corners that concentrate light. The light concentration creates a fiber optic display-like effect which enhances the visibility of radiated light by concentrating the chemiluminescent light at each corner. The physical act of forming the polyethylene or polypropylene plastic containers described by U.S. Pat. No. 5,043,851 via extrusion or injection molding creates stress lines at the corners needed for the fiber optic effect. Additionally, the chemical light reaction forms, as a by-product, carbon dioxide gas. A normal chemical light device develops an internal pressure of as much as 50 psig internal pressure within 30 minutes of initiation of the chemical light reaction. Consumers will use chemical lighting devices under all weather conditions. Polyolefins that remain flexible at low temperatures (35 F) start to soften and loose physical properties at higher temperatures (140 F). It is very common for a consumer to store a chemical light device in the trunk of their automobile for possible roadside emergencies. A dark vehicle in bright sunlight can have a temperature within the trunk of over 160 F. A consumer activating a chemical light device manufactured per U.S. Pat. No. 5,043,851 and subjected to high temperatures would experience product failure, the stress lines resulting in the splitting and leaking of the container.
What is lacking in the art is a chemiluminescent device that enhances the illumination properties of chemiluminescent devices while reducing the weight, cost and rigidity of the device by altering the shape of the vessels.

Polygonal chemiluminescent lighting device