A centrifugal discharger, particularly for cigarette manufacturing and/or packing machines, for disposing of waste fibrous and/or sheet material inside a fluidtight bin; wherein a centrifugal separator presents a cylindrical lateral wall, the bottom portion of which is fitted in fluidtight manner inside the bin, and communicates with a chamber in the bin via a tangent discharge conduit and a number of through holes for mutually compensating the pressure in the centrifugal separator and the bin.

The present invention relates to a centrifugal discharger for waste materials having a low weight/area ratio.
In particular, the present invention relates to a centrifugal discharger for feeding waste material, especially fibrous or sheet material, into a fluidtight bin enabling pollutionfree disposal.
The centrifugal discharger according to the present invention is particularly suitable for machines manufacturing and/or packing products containing fibrous material, such as cigarettes, to which the following description refers purely by way of example.
Certain stations on cigarette manufacturing machines, and particularly filter assembly and packing machines, produce waste fibrous and/or sheet material that cannot be fed back into the process. A filter assembly machine, for example, employs bands for connecting the cigarettes to the filters, some of which, if already gummed, must be disposed of in the event of the machine breaking down.
Any unrecoverable waste is usually fed into a hopper having an output conduit from which the waste material is normally withdrawn by suction and fed into a fluidtight bin. For this purpose, provision is made, between the output conduit and the suction source, for a centrifugal separator having a normal conical portion at the bottom terminating in a discharge conduit communicating with the bin, for separating the waste material from the intake air and so feeding it into the bin.
Using a normal centrifugal separator, however, the above solution has proved unsatisfactory, due to the low weight/area ratio of the waste involved and the overpressure produced inside the bin, which result in large part of the waste spinning continually inside the separator and never reaching the bin.

Centrifugal discharger for waste materials having a low weight/area ratio


A brushless motor according to the present invention is provided with: a tubular stator case; a stator core; and a rotor. The stator core includes a tubular yoke portion and a plurality of split cores. A plurality of dovetail grooves are formed in an inner peripheral surface of the yoke portion; each split core has a coil bobbin which has a mounting hole so as to penetrate in a radial direction, and a split teeth which is mounted into the mounting hole of the coil bobbin. The coil bobbin has a winding portion, and flange portions, and a clearance portion into which a winding starting end of the coil is strayed from the winding portion is formed on the inside of the one of the flange portions by reducing the thickness of the flange portion such that.

1. Field of the Invention
The present invention relates to an inner rotor type brushless motor which has, for example, a rotor and a stator.
2. Description of Related Art
Generally, an inner rotor type brushless motor has a stator core fitted into and fixed to a stator case and a rotor rotatably provided with respect to the stator core, and includes permanent magnets at an outer peripheral portion thereof. This stator core includes a plurality of teeth which project radially inward. A coil is wound around these teeth. As electric current flows into the coil, an attractive or repulsive force is generated between the rotor and the stator to rotate the rotor.
Among this kind of stator, there is one which includes a plurality of teeth fixed at the internal diameter side of a cylindrical yoke portion, and a coil bobbin coupling body in which a plurality of coil bobbins around which a coil is wound are coupled together, and in which this coil bobbin coupling body is mounted on the teeth (for example, refer to Japanese Patent No. 3190511). Further, there is one in which a dovetail groove is formed at an inner peripheral surface of a yoke portion formed in a tubular shape, and a split tooth including a projection fitted into the dovetail groove is mounted on a coil bobbin around which a coil is wound to form a split core, and is then fitted into the dovetail groove (for example, refer to Japanese Unexamined Patent Application, First Publication No. 2006-296033).
Winding starting end and winding finishing end of the coil wound around the coil bobbin are drawn out to the terminals, and are electrically connected with lead wires drawn in from the outside via the terminals.
FIG. 10 shows a conventional split core.
As shown in this drawing, a split core 118 includes a coil bobbin 160 around which a coil 107 is wound, and a split tooth 161 which is mounted on the coil bobbin 160. The coil bobbin 160 is provided with terminals 180a and 180b which electrically connect the coil 107 wound around the coil bobbin 160 to lead wires drawn from around the outside. Further, the split tooth 161 is a member which is T-shaped in plan view, and one end thereof is formed with a projection 167 which can fit into the aforementioned dovetail groove.
Meanwhile, in the above-mentioned brushless motor, when the coil 107 is wound around the coil bobbin 160, the coil 107 connected to a terminal 180a and the coil 107 wound around the coil bobbin 160 are different from each other in directivity at the winding starting end (at the terminal 180a in FIG. 10) of the coil bobbin 160. Therefore, overlapping coils 107 interfere with each other, and winding of the coil 107 becomes difficult. This causes disordered winding of the coil 107. Thereby, the coil 107 should be mounted (refer to K′ in FIG. 10) while avoiding the winding starting end of the coil 107. As a result, there is a problem in that the occupancy of the coil 107 in the coil bobbin 160 may fall, and the magnetic flux generated from the coil 107 may become small.
As described above, during mounting, a winding starting end of the coil 107 should be avoided. In this respect, there is a problem in that the assembling workability of the stator core is poor.
Therefore, the present invention has been made in view of the above-described situations, and the object of the present invention is to provide a brushless motor capable of cheaply preventing disordered winding of a coil to improve the occupancy of the coil, and easily performing the assembling operation of a stator core.


A portable terminal device includes: a memory to store power data; and a processor to execute a process, the process including: receiving an instruction to execute sensing; specifying one or more sensors for executing the sensing or one or more drivers controlling the sensors so that devices including the specified sensor and driver are specified; calculating a power consumed for the sensing by the specified devices based on the power data; and selecting a combination of the driver and the sensor, having a minimum power consumed for the sensing by the specified devices.

An application program using various sensors is installed in a portable terminal device represented by a smart phone. As the portable terminal device is multi-functionalized, a plurality of sensors of the same type may be equipped in the portable terminal device.
Related techniques are disclosed in, for example, International Publication Pamphlet No. WO 2010/107107 and Japanese Laid-Open Patent Publication No. 2003-157155.

Portable terminal device that selects lowest amount of power consumed by a sensor and sensor's driver


The switchable lightning-arrester system has a safety-switchable connector (10), which, for differing power-line features, can include optionally a counter-lever safety connector (14), a slide safety connector (40), a hinged safety connector (56) and a pivot safety connector (67) intermediate a power line (11) and a lightning arrester (1) for on-spot disconnection to protect workers from self-destructing arresters when changing lightning arresters or working on damaged lines without costly, time-consuming and power-disruptive shutdown of power lines. This is highly important because the lightning arresters are changed and repair work is done on damaged lines as quickly after self-destruction from lightning surges as possible requiring the change and repair. The safety-switchable connectors are made to be operable and changeable from a safe distance remotely, which is preferably from a ground position near a light pole, a transformer or other line support (9). Many line-worker lives have been injured or lost in the past without this safety-switchable connector.

This invention relates to switchable contact of lightning arresters to power lines on power poles and on or near transformers.
Currently, the most commonly used lightning arresters on power poles and on or near transformers are not designed to continue to operate repeatedly after nearly all lightning strikes, but to be sacrificial with designedly predetermined self-destruction from lightning electrical surges in excess of design amounts which are most typically 10 KV.
After sacrificial self-destruction, the lightning arresters must be replaced promptly at high risk by line workers. The high risk results from not shutting down power lines to a self-destructed lightning arrester while line workers electrically connect a replacement lightning arrester to a power line in order to avoid interruption of electrical service to residential and commercial power users and in order to save high power-plant costs. For initial installation of lightning arresters, power to power lines and transformers can be delayed until the lightning arresters are installed. Shutdown of a power line is expensive and time consuming for single and separate replacement of lightning arresters because (a) high power-plant-employee costs in addition to power-line workers are required and (b) shutdown for a single power line or transformer often requires shutdown of branched power lines to a plurality of users. Accordingly, power-line workers are often under employment pressure to avoid injury-preventive shutdowns for replacing single lightning arresters. Generally, the replacement can be accomplished safely, but serious injury and death of line workers result frequently from unexpected electrical surges and from accidental occurrences during replacement and electrical-line contact of the lightning arresters without safety shutdowns.
There is no known switchable lightning-arrester system for allowing replacement of lightning arresters with safe electrical connection to a power line without interrupting electrical service and without expensive power-plant shutdown of power in a manner taught by this invention.
Examples of most-closely related known but different devices are described in the following patent documents:
U.S. Pat. No.InventorIssue Date2,296,991FoxSep. 29, 19423,614,700Beard, et al.Oct. 19, 19713,497,148MacDonaldAug. 07, 19904,688,013NishikawaAug. 18, 19874,546,341McNaghten, et al.Oct. 08, 19854,795,996Brown, et al.Jan. 03, 19894,814,550NewbergMar. 21, 19894,450,425ManningMay 22, 1984


Autonomous personal service robot to monitor its owner for symptoms of distress and provide assistance. The system may include sensors to detect situations before they affect people such as smoke, heat, temperature and carbon monoxide sensors. The system can provide security for the home. The PRA may comprise features such as a medicine dispenser and blood pressure cuff. Features such as broadband internet, MP3 player, reading lights and eye glass tracker provide butler type capabilities that enable the system to appeal to markets beyond the elderly and infirmed. The system may also include an X10 transmitter/receiver to automatically control various household lights and appliances. Equipping the system with a robot arm enables the robot to fetch items, turn on and off wall switches and open the refrigerator.

1. Field of the Invention
Embodiments of the invention described herein pertain to the field of robots. More particularly, but not by way of limitation, one or more embodiments of the invention enable an autonomous personal service robot to monitor and attend to people such as the elderly or disabled and report their status and the status of their living environments.
2. Description of the Related Art
Virtually everyone wants to enjoy the highest possible quality of life. Increasing household conveniences is one method to improve home life for many people. For others, such as the elderly, simply being able to live independently in their own homes is their desire.
Refrigerators, washing machines, dish washers and micro-wave ovens represent a small fraction of the convenience appliances in many homes. Yet, there remain many tasks to automate such as: fetching the newspaper; getting a drink from the refrigerator; or locating the missing telephone receiver or television remote control. While these and many other similar tasks seem mundane, none-the-less, many people would enjoy a personal attendant or butler that provides these services.
Most people want to be able to choose where and how they live. However, as people age, they often lose this choice and are forced to live in assisted care or nursing homes. The ability to live independently in comfortable surroundings is important both because it improves the mental wellbeing of the individual and because of the high cost of care. This prized independence is often only grudging relinquished as health concerns, diminished capacity and the fear being unable to respond to crisis forces individuals to accept increasingly higher levels of living assistance. As well as financial strain, reduced confidence and unhappiness often accompanies this decreased independence.
Many people who can handle the day-to-day activities of living alone are forced into assisted living or nursing homes because they cannot handle emergencies. The person can cook, clean, etc. but might not be able to get up if they fall in the middle of a room. Other people need to be monitored for different medical conditions. These people are robbed of their independence because of what might happen. This problem is exacerbated by today's demographics where the aging live far from relatives, including their children, so daily monitoring is either expensive or not available.
Emergency stations and "Medical Alarms" integrated into necklaces connected to monitoring service providers exist, but are not overwhelmingly received. Two problems are that the products can be invasive, and that they are only useful in some conditions. A push button alarm does not work if their owner loses consciousness, and a motion sensor might give false readings if the owner is napping.
Currently, nurses and other caregivers monitor some elderly in their homes. The cost of nursing care is high, and rising, while the supply will soon experience a shortage. Automating tasks such as medicine dispensing and compliance monitoring, dementia testing, and monitoring for falls and other emergency conditions decrease the tasks for which caregivers are required, but such solutions do not currently exist.
For at least the limitations described above there is a need for system that provides the functions of an autonomous personal robot that enables the disabled or elderly to remain independent as long as possible while providing automated twenty-four hour support that will improve the quality of life while significantly decreasing costs.


An endoscope including a lens barrel in which a partial region including at least a distal end is inserted inside a body cavity of a person under measurement, an imaging module is provided in the distal end of the lens barrel, and the imaging module having at least one pair of image sensors arranged in parallel at a mutually prescribed distance are described. The imaging module may be switched between a storage state in which the imaging module is stored within the lens barrel in a manner that an extension direction of imaging surfaces of the image sensors becomes a direction along a first direction, and a photographing state in which the imaging module is projected outside of the lens barrel in a manner that the extension direction of the imaging surfaces of the image sensors becomes a direction along a second direction.

The present disclosure relates to an endoscope and an endoscope apparatus.
Observing (photographing) an affected part or performing various treatments for an affected part by using an endoscope has become widespread, from the viewpoint of minimally invasive medical treatment which reduces the physical burden on a patient (a person under measurement) as much as possible. In order to implement such minimally invasive medical treatment, a thickness (diameter) of a lens barrel of the endoscope inserted within the body cavity of a person under measurement is generally sought after which is equal to or less than approximately several mm.
On the other hand, three-dimensional endoscopes (3D endoscopes) which can display photographed positions as three-dimensional images (3D images) have become widespread in recent years. In 3D endoscopes, 3D images are generated based on pixel signals (image signals) acquired by each of a pair of image sensors included in the distal end of the lens barrel of the endoscope. Since various treatments can be performed by using a 3D endoscope while referring to 3D images close to what is actually seen by the human eyes, it becomes possible for a medical practitioner (a user) to operate the endoscope more intuitively.
Here, in a 3D endoscope, in order to secure a sufficient photographing range for treating an affected part, it is preferable that a prescribed distance is secured as an interval between the pair of image sensors. However, when the pair of image sensors is arranged while securing this prescribed distance in the distal end of the lens barrel of the endoscope, there is the possibility that the diameter of this lens barrel part will increase. Accordingly, technology has been developed in which the image sensors are stored within the lens barrel, while moving up to an affected part, inside the body cavity of the person under measurement, and photography is performed by allowing the image sensors to be projected from within the lens barrel at the time when the affected part is reached.
For example, JP S63-294508A discloses a stereoscopic endoscope apparatus which has a pair of imaging sections projecting in a radial direction of a lens barrel from mutually different positions of the outer surface of the lens barrel. Further, JP H4-500768A discloses an endoscope which has a pair of imaging sections included at mutually different positions on the outer wall of a lens barrel, which project in a radial direction of the lens barrel by eccentrically rotating with respect to the center of the end surface at the distal end of the lens barrel, around a rotation axis parallel to an extension direction of the lens barrel.

Endoscope apparatus with rotatable imaging module


Heat dissipation in vertically arrayed host device configurations can be improved through inclusion of heat sinks having split-stream fin architectures. The split-stream fin architecture includes two or more sets of angled fins separated by a central conduit, which allows for more efficient inflow and/or expulsion of convection cooling air over the heat sink. The split-stream fin arrangement may include inwardly angled fins in order to draw convection cooling air inwards from horizontal inlets, in which case warm exhaust is expelled through the central conduit. Conversely, the split-stream fin arrangement may include outwardly angled fins, which draw convection cooling air from the central conduit, and expel warm air through horizontal exhausts. The split-stream fin arrangements function well when host devices are configured horizontally, which allows for more flexible host device configurations.

Modern wireless networks use active antenna systems (AASs) to achieve increased performance on the wireless link. Active antennas are presently used in macro base stations (BSs), and it is foreseeable that active antennas will be deployed as small cell wireless transceivers in the near future. Accordingly, there is potentially significant market demand for compact, modular AAS designs that are cost effective, durable, and capable of being reliably installed and serviced in remote field locations. One challenge in designing compact and durable AASs is that active antennas typically generate significantly more heat than passive antennas due to, inter alia, their inclusion of active antenna components, e.g., power amplifiers, receivers, digital signal processing components, etc. As a result of this increased heat dissipation, active antennas may typically require some means for thermal dissipation, such as a heat sink, heat exchanger or an active cooling system such as fans.

Apparatus and method for an active antenna heat sink


A consumer care composition or a food composition comprising a mesoporous microparticulate material wherein at least some of the pores of the material are loaded with at least one ingredient and the loaded mesoporous microparticulate material is encapsulated by a capping layer is described.

In the consumer care and food industries, various methods are used to stabilise various ingredients and to control the timing and release of said ingredients. Such methods enable the protection of food components to ensure against nutritional loss and to mask or preserve flavours and aromas. Suitable methods of protection also increase the stability of vitamin or mineral supplements which are normally sensitive to light, UV radiation, metals, humidity, temperature and oxygen. Similar issues affect a range of consumer care products such as hair care compositions, oral hygiene compositions, skin care products and cosmetics.
There is a continued need for alternative methods and/or products for protecting, controlling the release of, and/or masking the taste of ingredients in the consumer care and food industries. In particular, there are challenges in storing products in liquid environments.

Composition containing loaded and capped porous silica particles


A method of investigating a reservoir region in a subsurface formation by a time-lapse seismic survey. The subsurface formation comprises a further formation region adjacent to the reservoir region. Data are obtained from a time-lapse seismic survey and includes seismic data of the subsurface formation at a first point in time and a later point in time. The seismic data is processed to obtain a seismic representation of change in a predetermined seismic parameter in the further formation region, whereby the seismic parameter is dependent on stress. The seismic representation of change in the seismic parameter in the further formation region is interpreted for an indication of changes of stress distribution in the further formation region, and a property of the reservoir region is derived using the indication of change of stress distribution in the further formation region.

Time-lapse seismic surveying is increasingly used for studying of earth formations. It is applied for monitoring of hydrocarbon bearing underground reservoirs, in particular to follow the effects resulting from producing reservoir fluids (e.g. oil, gas, water) through a well to surface.
In time-lapse seismic surveying, seismic data are acquired at least two points in time. Time is therefore an additional parameter with regard to conventional seismic surveying. This allows studying the changes in seismic properties of the subsurface as a function of time due to, for example, spatial and temporal variation in fluid saturation, pressure and temperature. Time-lapse seismic surveying is also referred to as 4-dimensional (or 4D) seismics, wherein time between acquisitions represents a fourth data dimension. Like in conventional seismic surveying, the three other dimensions relate to the spatial characteristics of the earth formation, two being horizontal length dimensions, and the third relating to depth in the earth formation, which can be represented by a length coordinate, or by a time coordinate such as the two-way travel time of a seismic wave from surface to a certain depth and back.
The acquisition and initial processing of the seismic data can be done by standard seismic techniques. The time span between the first and the second point in time at which seismic data are acquired can be several years. One normally tries to acquire the first and second seismic data sets in a similar way, so that they are best comparable. If that is not fully possible, differences in acquisition can be accounted for during processing.
Seismic surveying techniques investigate the earth formation by generating seismic waves in the earth formation, and measuring the time the waves need to travel between one or more seismic sources and one or more seismic receivers. The travel time of a seismic wave is dependent on the length of the path traversed, and the velocity of the wave along the path.
A general difficulty in seismic surveying of oil or gas fields is that the reservoir region normally lies several hundreds of meters up to several thousands of meters below the earth's surface, but the thickness of the reservoir region or layer is comparatively small, i.e. typically only several meters or tens of meters. Resolution of processed seismic data in the reservoir region is therefore an issue. Resolution requirements are even higher when small differences in time-lapse seismic surveys are to be detected and interpreted.
The paper "4D constrained depth conversion for reservoir compaction estimation: Application to Ekofisk Field" by J. Guilbot and B. Smith, The Leading Edge, March 2002, p. 302-308, discloses a method for interpreting a time-lapse seismic survey of a subsea earth formation, in order to determine reservoir compaction as a result of production and water flooding. Seismic data were acquired at a first and a second point in time, separated by about 10 years. The seismic data were interpreted at the hand of a model of the earth formation, which consisted of, consecutively from bottom to top, a lower reservoir layer, an upper reservoir layer, an overburden layer and a seawater layer. The model included the depth of the boundaries between adjacent layers and the seismic velocity in each of the layers. It was found that in order to interpret the compaction of the reservoir correctly, it is required to take into account the changes in the seismic velocity in the various earth layers between the first and second points in time.
Among the interesting questions to be answered in a time-lapse seismic survey of a producing reservoir is about inhomogeneous depletion of the reservoir during production, caused e.g. by the presence of a discontinuity or fault that seals a certain part of the reservoir from those parts which are in direct fluid communication with the production well. Whereas the resolution of the processed seismic data is often just sufficient to obtain a more or less clear indication of the presence of a discontinuity or fault, differences observed in the reservoir region in a time-lapse seismic survey (e.g. amplitude or interval velocity changes) are generally so small that it proves to be very difficult to draw reliable conclusions about the sealing nature of the fault.
There is a need for a method of interpreting time-lapse seismic data, which allows one to obtain more detailed information about certain parameters and conditions of the reservoir region, and it is an object of the present invention to provide such a method.

Time-lapse seismic survey of a reservoir region


An interconnection array subunit and method for forming the interconnection array subunit are provided, the interconnection array subunit including a first pair of line conductors in first and second regions, the first pair of line conductors including a first true line conductor and a first associated complementary line conductor connected and vertically twisted in a vertical twisting region between the first and second regions. The interconnection array subunit also includes a second pair of line conductors adjacent to the first pair of line conductors in the first and second regions, the second pair of line conductors including a second true line conductor and a second associated complementary line conductor. The interconnection array subunit also includes a first interconnection layer disposed in the vertical twisting region, the first interconnection layer connecting the second associated complementary line conductor in the first region to the second associated complementary line conductor in the second region. The interconnection array subunit also includes a second interconnection layer disposed in the vertical twisting region, the second interconnection layer connecting the second true line conductor in the first region to the second true line conductor in the second region. The first true line conductor is disposed below the first associated complementary line conductor in the first region and above the first associated complementary line conductor in the second region. The second true line conductor is disposed below the second associated complementary line conductor in the first and second regions.

Semiconductor integrated circuits (ICs) typically are formed by metal-oxide semiconductor (MOS) or bipolar transistors that are integrated at a planar major surface of a silicon chip. Electrical interconnections between various transistors, and between certain transistors and input/output pads, have taken the form of electrically connecting lines that comprise a layer of metallization running along an essentially planar surface. In some ICs, two or more "levels" of interconnections may be required. The planar surfaces of the interconnections are oriented mutually parallel to, and are insulated from, both each other and the top planar surface of the chip by suitable insulating layers. Connections to the transistors at lower levels than the metallization layers are provided through openings called contacts, and connections between different interconnection layers are provided through insulation openings called vias.
In memory ICs, such as random access memories (RAMs), the data in the memory array are accessed by an external data path by means of a number of electrically conducting lines. The electrically conducting lines in the array are conventionally arranged in the form of an array of parallel metallization strips. For example, a dynamic RAM (DRAM) contains an array of hundreds of parallel bit lines, or digit lines. A DRAM also contains an array of parallel word lines. The word lines, typically lie at a different planar level than the bit lines. The array of bit lines and the array of word lines lie perpendicular to each other, forming a grid. Memory cells in the DRAM lie at an intersection of a bit line and a word line.
The bit lines, or digit lines, in a DRAM can give rise to electrical cross-coupling or "cross-talk." For example, access to any given bit line or digit line may spuriously influence memory cells connected to adjacent bit lines or digit lines. The term "pattern sensitivity" is applied to this undesirable phenomenon. The problems of cross-talk and pattern sensitivity can arise in other interconnection arrays, such as address busses and data busses where similarly paired, parallelly disposed line conductors are employed. In these environments, cross-talk and pattern sensitivity can result in undesirable errors.
Memory ICs such as DRAMs typically have a memory array of millions of memory cells that store electrical charges indicative of binary data. For instance, the presence of an electrical charge in the memory cell usually equates to a binary "1" value, and the absence of an electrical charge usually equates to a binary "0" value. The memory cells are accessed via address signals on row and column lines. Once accessed, data is written to, or read from, the addressed memory cell via bit lines, or digit lines.
One common design found in many memory circuit topologies or configurations or layouts is the "folded bit line" or "folded digit line" structure or architecture, also known as the 8F2 architecture. In a folded bit line construction, the bit lines are arranged in pairs with each pair being assigned to complementary binary signals. For example, one bit line (the "true" line) in the pair is dedicated to a binary signal DATA while the other bit line (the "associated complementary" line) in the pair is dedicated to handle the associated complementary binary signal DATA*. (The asterisk notation "*" is used throughout to indicate the binary complement.)
The memory cells are connected to one of the bit lines in the folded pair. During read it and write operations, the bit lines are driven to opposing voltage levels depending on the data content being written to or read from the memory cell. For purposes of explanation, the following example describes a read operation of a memory cell holding a charge indicative of a binary "1" value. The voltage potential of both bit lines in the pair are first preferably equalized to a middle voltage level such as 1.2V for a memory circuit with a supply voltage level of 2.5V. Then, the addressed memory cell is accessed and the charge held therein begins to flow to one of the bit lines in the bit line pair, causing the voltage of that bit line to be raised slightly above the voltage of the other bit line of the pair. A sense amplifier, or similar circuit, senses the voltage differential on the bit line pair and further increases this differential by increasing the voltage on the first bit line to 2.5V and decreasing the voltage on the second bit line to 0V. The folded bit lines thereby output the data in a complementary form, which is transmitted to the output pads.
One version of a folded bit line architecture or structure is the twisted bit line structure. FIG. 1 illustrates a conventional twisted bit line structure having bit line pairs D0/D0* through D3/D3*. Twisting occurs at twist junctions 120 across the array of bit lines when the true line in a bit line pair (D0 for example) exchanges positions with the associated complementary line (D0*) in the pair. Memory cells are coupled to the bit line pairs throughout the array. Representative memory cells 122a through 122n and 124a through 124n are shown coupled to bit line pair D0/D0*. The twisted bit line structure evolved as a technique to reduce bit line interference noise or cross-talk or pattern sensitivity during chip operation. Such noise becomes more problematic as memory density increases. The twisted bit line structure is therefore used in larger, higher density, memories such as a 64 Mb DRAM.
Conventional twisted bit line architectures have a number of disadvantages as compared to open bit line architectures. One disadvantage is the relatively large amount of chip "real estate" that is typically used by the twist junctions 120. Yet another disadvantage is that the use of the conventional twisted folded bit line architecture may result in an inefficient use of the cell matrix space. The conventional twisted bit line architecture does not use space efficiently because it provides a lower packing density of memory cells than the open bit line architecture, and because it cannot utilize a cross-point layout cell structure. Some of these disadvantages could be overcome if a cross-point layout were combined with a folded bit line architecture. This combination would offer both high packing density and good noise immunity. Implementing this combination would require that the bit lines be vertically twisted, not just horizontally twisted as shown in FIG. 1.
One attempt in the prior art to provide a DRAM architecture that utilizes the advantages ie of both a cross-point layout cell architecture and a folded bit line architecture is described in U.S. Pat. No. 5,107,459 to Chu et al. Chu utilizes a three-dimensional approach by stacking the two lines in a bit line pair (the true bit line and the complementary bit line) vertically one above the other in two layers of metallization. The two layers are twisted by means of a third layer.
A scheme similar to the scheme described by Chu is shown conceptually and schematically in FIG. 2. In the scheme in FIG. 2, bit line pairs (D1, D1*) and (D2, D2*) form a sub-array 200. Bit line pair (D1, D1*) consists of bit lines D1L and D1L* to the left of the twisting region 210, and bit lines D1R and D1R* to the right of the twisting region 210. Similarly, bit line pair (D2, D2*) consists of bit-lines D2L and D2L* to the left of the twisting region 210, and bit lines D2R and D2R* to the right of the twisting region 210. The thick-strips in FIG. 2 represent a first layer of metallization, and the thin solid lines represent a second layer of metallization arranged above, and insulated from, the first layer of metallization. The alternating dashed-dotted lines in FIG. 2 represent a third interconnection layer, a polysilicon layer, arranged below and insulated from the first layer of metallization. The twisting region 210 is situated between two dummy word lines 220 formed in the polysilicon layer. The two dummy word lines 220 are situated adjacent to real word lines (not shown).
In the scheme shown in FIG. 2, the two bit lines (the true bit line and the complementary bit line) in a bit line pair, which are stacked vertically one above the other, exchange vertical positions as they cross the twisting region 210. In other words, the bit lines are vertically twisted within the twisting region 210. For example, the portion of the true bit line D2 on the left of the twisting region 210 (D2L) is formed in the first (lower) layer of metallization, while the portion of D2 on the right of the twisting region 210 (D2R) is formed in the second (upper) layer of metallization. Likewise, the portion of the complementary bit line D2* on the left of the twisting region 210 (D2L*) is formed in the second (upper) layer of metallization, while the portion of D2* on the right of the twisting region 210 (D2R*) is formed in the first (lower) layer of metallization. Thus D2 and D2* exchange vertical positions as they cross the twisting region 210. As shown in FIG. 2, the vertical twisting of bit line pair (D2, D2*) is effected within the twisting region 210 by having the bit line D2L veer to its left (upwards in FIG. 2), and connecting D2L to D2R through a via 230. The vertical twisting of bit line pair (D2, D2*) is further effected within the twisting region 210 by having the bit line D2R* veer to its left (downwards in FIG. 2), and connecting D2R* to the bit line D2L* through a via 240.
Vertical twisting of the other bit line pair (D1, D1*) in sub-array 200 is accomplished in a different manner. The portion of the true bit line D1 on the left of the twisting region 210 (D1L) is formed in the first (lower) layer of metallization, while the portion of D1 on the right of the twisting region 210 (D1R) is formed in the second (upper) layer of metallization. Likewise, the portion of the complementary bit line D1* on the left of the twisting region 210 (D1L*) is formed in the second (upper) layer of metallization, while the portion of D1* on the right of the twisting region 210 (D1R*) is formed in the first (lower) layer of metallization. As shown in FIG. 2, the vertical twisting of bit line pair (D1, D1*) is effected within the twisting region 210 by having the bit line D1L connect to a polysilicon layer interconnection 250 through a contact hole 255. The polysilicon layer interconnection 250 extends across the twisting region 210, passes underneath bit lines D2L and D2R*, and connects to an interlayer interconnection 260 through a contact hole 265. The interlayer interconnection 260, which is formed in the first metallization layer, connects in turn to the bit line D1R through a via 270. The vertical twisting of bit line pair (D1, D1*) is further effected within the twisting region 210 by having the bit line D1R* connect to a polysilicon layer interconnection 275 through a contact hole 280. The polysilicon layer interconnection 275 extends across the twisting region 210, passes underneath the bit lines D2R* and D2L, and connects to an interlayer interconnection 285 through a contact hole 290. The interlayer interconnection 285, which is formed in the first metallization layer, connects in turn to the bit line D1L* through a via 295.
The vertical twisting scheme represented in FIG. 2 has a number of shortcomings. One shortcoming is that the bit line pairs within each sub-array exchange horizontal positions as they cross the twisting region 210. In other words, the bit lines are twisted horizontally as well as vertically. For example, bit line pairs (D1, D1*) and (D2, D2*) in FIG. 2 exchange horizontal positions (upper and lower positions in the figure) within sub-array 200 as they cross the twisting region 210. This exchange of horizontal positions tends to complicate the layout of the memory array. Another shortcoming of the scheme in FIG. 2 is that the scheme requires the use of two sets of polysilicon layer interconnections to effect the vertical twisting of the odd-numbered bit line pairs, (D2j+1, D2j+1*) (with j=0, 1, 2, 3) in each sub-array. For example, in FIG. 2 two polysilicon layer interconnections (250 and 275) are used to effect the vertical twisting of the odd-numbered bit line pair (D1, D1*) in sub-array 200. A third shortcoming of the vertical twisting scheme in FIG. 2 is that the scheme requires three layers to achieve the twist. This added complexity takes up more space (being both wide and long due to additional metal pads) and does not allow three twists. Further, the vertical twisting scheme of FIG. 2 requires the deposition of additional layers beyond the layers deposited in the standard DRAM fabrication process. A final shortcoming of the scheme in FIG. 2 is that the scheme does not allow vertical twisting of only one of the bit line pairs of each sub-array. A twisting scheme without this shortcoming would provide more design flexibility. For example, the ability to effect vertical twisting of only one of the bit line pairs would allow the twisting of each of the bit line pairs in a sub-array 200 to occur at different locations, as shown in FIG. 1 (where bit line pair (D0, D0*) is twisted at a different location 120 than bit line pair (D1, D1*)). Staggering the locations at which adjacent bit line pairs are twisted provides superior noise reduction.
The present invention is directed to overcoming, or at least reducing the effects of, one or more of the perceived shortcomings of prior art twisting schemes. Furthermore, the present invention advantageously occupies less chip "real estate" than the vertical twisting scheme represented in FIG. 2.

Vertical twist scheme for high-density DRAMs


After completely etching through a material stack comprising an oxide hard mask layer and an underlying interlevel dielectric (ILD) layer formed on a substrate to provide at least one opening, top corners of the at least one opening are rounded by performing a plasma etch employing a combination of an etching gas and a deposition gas comprising a hydrofluorocarbon compound. The hydrofluorocarbon compound forms a hydrofluorocarbon polymer layer on sidewalls of the at least one opening and helps to preserve the profile of the at least one opening.

The present application relates to the formation of back-end-of-line (BEOL) interconnect structures in integrated circuits and, more particularly to a method that provides enhanced protection to patterned features during a top oxide rounding process in the formation of the interconnect structures.
Back-end-of-line (BEOL) interconnect structures are used to electrically connect the device structures fabricated on the substrate during front-end-of-line (FEOL) processing. BEOL interconnect structures are routinely fabricated by damascene processes, such as a dual damascene process in which vias and trenches formed in a dielectric layer are filled with a conductive material using a single blanket deposition followed by planarization.
Trenches formed in the dielectric layer using conventional etching/hard mask removal processes typically have sharp, squared-off top corners which cause the formation of defects, such as voids, within the trenches when filling the trenches with the conductive material. One method to mitigate this filling problem is to round the top corners of the trenches using a fluorocarbon-based plasma etch to allow a more uniform deposition of the conductive material. However, top corner rounding (TCR) with conventional fluorocarbon-based plasma etch chemistries normally results in undesirable effects, such as increased via critical dimension (CD) and trench over-etching, making it difficult to maintain trench and via profiles. As such, a method that allows a better preservation of patterned feature profile during a TCR process is needed.

Method for top oxide rounding with protection of patterned features

INTERNATIONAL BUSINESS MACHINES CORPORATION


A silver halide color reversal photosensitive material comprising a blue-sensitive emulsion layer unit containing a yellow color-forming coupler, a green-sensitive emulsion layer unit containing a magenta color-forming coupler and a red-sensitive emulsion layer unit containing a cyan color-forming coupler, on a transparent support, wherein the material includes at least one interimage effect-donating layer substantially forms no image; the wavelength, λrmax, at which the maximum sensitivity of the spectral sensitivity distribution of the red-sensitive layer unit is given, satisfies the relation: 620 nm≦λrmax≦680 nm; and the sensitivities of the red-sensitive layer unit satisfy the following relationships: Sr(610) is ⅕ of Sr(λrmax) or more; Sr(680) is 1/10 of Sr(λrmax) or more; and/or Sr(690) is 1/50 of Sr(λrmax) or more wherein Sr(610), Sr(680) and Sr(690) are the sensitivities of the red-sensitive unit at 610 nm, 680 nm and 690 nm, respectively, and Sr(λrmax) is the maximum sensitivity at λrmax.

1. Field of the Invention
The invention relates to a silver halide color reversal photosensitive material, particularly to a color reversal photosensitive material improved in color reproduction. More specifically, the invention relates to a color reversal photosensitive material suitable for landscape photography such as a sunset because of its high color saturation, and exhibits reduced fog in the case of photography under a fluorescent light.
2. Description of the Related Arts
Silver halide color reversal photosensitive materials are often used by professional photographers for originals of printing because they can directly appreciate the films after development. That is, it also plays a role of color sample for printing. Accordingly, the requirements for color reproduction are very severe. However, it is difficult to say that conventional commercial products have sufficiently answered the requirements.
One example is fog due to a fluorescent lamp. Conventional silver halide color reversal photosensitive materials have a weakness in that it gets wholly fogged on the cyan side in photography under a fluorescent lamp. The reason is that the red-sensitive layer has spectral sensitivity of longer waves and does not have sensitivity for bright lines of a fluorescent lamp. However, attempts only to prepare a red-sensitive layer with the spectral sensitivity of a shorter wave to counter the weakness results in problems of color reproduction such as decrease of color saturation or slippage of hue. Further, it is not preferable because characteristic that color reproduction of evening glow and the like becomes more reddish than actual color, which is consciously used by nature photographers as one of representations although a shortcoming from the view point of faithful color reproduction, is lost. Various attempts have always been carried out to improve color reproduction of color reversal photosensitive material.
In the case of color negative film, correction of auxiliary absorption of coloring material is generally carried out by masking using so-called colored coupler in order to obtain color reproduction with a higher color saturation and more faithfulness. In the case of color reversal photosensitive material, the correction of auxiliary absorption of coloring material by masking using the colored coupler is impossible. Therefore, an attempt to improve color reproduction by utilizing mainly an interimage effect has been carried out along with improvement in spectral sensitivity and spectral absorption property of coloring material.
For example, one of the conventional techniques includes a method for improving faithfulness in hue by using an interimage effect-donating layer containing an emulsion of silver iodide by high content (refer to pages 2 and 3 of Jpn. Pat. Appln. KOKAI Publication No. (hereinafter referred to as JP-A-) 2002-351029.


According to a medical traction device containing a polymer molded article having biocompatibility as a weight for traction of a living tissue to be resected under observation with an endoscope, and a medical traction equipment containing the medical traction device and a grasping member connected to each other, such a medical traction device or traction equipment is provided that in ESD in a digestive tract, a dissected living tissue is efficiently removed from the operative field also in a direction that is different from the moving direction of the endoscope, thereby maintaining the field of view, and the procedures are thus performed safely and rapidly.

A tumor, such as a polyp and an early cancer, formed in a mucosa of a digestive tract, such as a stomach and a large intestine, can be now resected by an endoscopic surgery using endoscopic mucosal resection (EMR) and ESD without abdominal section. In particular, a flat tumor and a large tumor having a size of several centimeter are difficult to process by EMR, and can now be efficiently resected by employing ESD. Ordinary ESD is performed in the following procedures.
(1) The circumference of the lesion is marked.
(2) A local injection drug, such as physiological saline or a hyaluronic acid aqueous solution, is injected the submucosal layer for prominence.
(3) The circumference of the lesion is cut with a knife.
(4) The submucosal layer is dissected.
(5) The tumor is recovered.
In the procedure (4), however, the mucosa to be resected may cover the field of view, and the dissected mucosa may be readhered, in some cases, which may cause prolongation of the procedure time. Furthermore, the field of view may not be sufficiently maintained, which concerns about bleeding due to damage of a blood vessel and perforation of a muscular wall.
For solving the problems, various mucosal resection and dissection assisting tools for removing the resected mucosa from the processed area, such as medical grasping equipments and medical traction equipments, have been proposed (see Patent Documents 1 to 5).
However, the traction with a magnetic anchor involves such problems that a large-size equipment is required for traction, movement of the magnetic anchor inside the digestive tract may damage the mucosa (Patent Document 1).
In the method, in which a clip is attached to the other mucosal portion than a lesion, to which a clip and a spring traction device attached to the mucosa of the lesion are connected, thereby resecting the submucosal layer of the mucosa of the lesion, it is necessary to attach the clip to the normal mucosa portion, which damages the unlesioned portion. Furthermore, the lesion and the mucosa on the opposite side are attracted to each other, which concerns about narrowing the operative field (see Patent Documents 2 to 4).
In the case where a mucosal resection and dissection assisting tool that is introduced beside the endoscope, it is necessary to introduce plural tubes into the narrow digestive tract, which may concern about an operational error of the endoscope. Furthermore, there is a concern that the assisting tool may be erroneously moved during operation of the endoscope, which may bring about troubles in the traction operation. Moreover, the assisting tool can be moved only in the same direction as the endoscope, which restrict the direction of opening the mucosa, and it cannot be moved during the endoscopic operation in a direction that is different from the moving axis of the endoscope (see Patent Document 5).

Polymer molded body for pulling biological tissue, medical pulling member using same, and medical pulling tool


A thick film circuit board that can be produced at a low cost, a method of producing the same, and an integrated circuit device. A first thick film circuit board has conducting layers of a copper-containing conductor fired at not higher than 750° C., and includes conducting portions formed by using a silver-containing conductor. A second thick film circuit board has conductors that are formed in the through holes so as to close the openings of at least the one side thereof. The thick film circuit board is produced at a low cost and suppresses a drop in electric conductivity when it is in use.

1. Field of the Invention
The present invention relates to a thick film circuit board and to a method of producing the same. More specifically, the invention relates to a thick film circuit board that can be produced at a low cost, to a method of producing the same and to an integrated circuit device using the thick film circuit board.
2. Description of the Related Art
In the thick film circuit board in a hybrid integrated circuit device, conducting layers of an electric circuit are formed on both surfaces of an insulating base member in order to decrease the size. The conducting layers formed on both surfaces of the base member are made of a conductor formed depending upon a predetermined circuit pattern. The conducting layers formed on both surfaces of the base member are electrically connected together through conducting portions that maintain electric conduction in through holes formed penetrating through the base member.
The conducting layers and the conducting portions are made of a silver-containing conductor or a copper-containing conductor. The conductors are formed by firing an alloy material on the surfaces of the base member (see Japanese Unexamined Patent Publications (Kokai) Nos. 11-177016 and 2000-312062).
The silver-containing conductor easily develops electro-migration and has a problem concerning the reliability. Therefore, a silver-containing conductor to which palladium is added has been devised accompanied, however, by a problem of low electric conduction.
Further, since copper by itself tends to be easily oxidized, the atmosphere must be controlled when the copper-containing conductor is to be fired, thus driving up the cost. The atmosphere must be controlled even when a resistor is to be fired in the circuit pattern. Therefore, a limitation is imposed on the material for forming the resistor, also driving up the cost. As the copper-containing conductors, there have been known high-temperature fired copper that is fired at 800 to 900° C. and low-temperature fired copper that is fired at 600 to 700° C.

Thick film circuit board, method of producing the same and integrated circuit device


For the coagulation of tissue by plasma, instruments are known that comprise a tubular probe body through which inert gas is conducted and an ignition electrode within the lumen in the region of an outlet of the probe body. A current conductor is provided to supply a coagulation current to the ignition electrode. The ignition electrode is fixed to the probe body substantially in the middle, by means of fixing devices. The present invention provides an instrument for plasma coagulation wherein a fixing device for the ignition electrode comprises a piece of sheet metal, a wafer or similar flat body, which is fixed by its longitudinal edges to the tube wall so that it extends substantially diametrically across the lumen, and to which the ignition electrode is attached.

The invention relates to an instrument for plasma coagulation.
Such an instrument is known for example from the document EP-1293170, and in the following is explained with reference to FIG. 3.
In FIG. 3 a probe for coagulation of tissue by means of plasma, specifically by means of argon (APC), is shown as a longitudinal section through the end section of the probe, which during an operation projects out of the opening of the working channel of an endoscope. Argon gas flows through the lumen 11 of a probe body 10 and emerges from an outlet 12 of the probe body 10.
Within the lumen 11 of the probe body 10 is an ignition electrode 20 that comprises, at its end opposite to a tip 21, a helical section 6 coiled in such a way that the outer circumference of the helix 6 is apposed firmly to a tube wall 13 of the probe body 10, or is fixedly attached thereto. The end of the helical section 6 opposite to the ignition electrode 20 is connected by way of a crimp tubule 7 to a current conductor 25 for supplying a coagulation current. The ignition electrode 20 is situated in the interior of a tubule 14 that is made of ceramic and likewise is firmly pressed into the tube wall 13. The arrangement here is such that the ignition electrode 20 with its tip 21 is set back by a prespecified amount from the outlet 12 of the tube body 10, or of the tubule 14 situated therein. Furthermore, the ignition electrode 20 occupies a precisely coaxial position within the tubule 14, so that symmetrical relationships are produced when the argon that flows past the ignition electrode 20 and its tip 21 and then emerges through the outlet 12 is ionized by the coagulation current and thus, in the known manner, produces a plasma that coagulates the tissue to be treated.
The known arrangement raises many problems, with regard in particular to manufacture but also to the operation of the instrument, in particular long-term operation.
First, it is difficult to provide the ignition electrode 20 with a helical section 6 having sufficiently precise construction that when it is pressed into the probe body 10, the ignition electrode 20 and in particular the tip 21 are positioned exactly in the middle, i.e. are coaxial with the tubule 14. Another problem arises in that the distance separating the tip 21 from the outlet 12 of the tubule 14 depends on the depth to which the helix 6 has been pressed in. Even placing the helix 6 in direct contact with the back end of the tubule 14 cannot alleviate this problem, because pressing too firmly would cause a change in position and/or angle of the ignition electrode 20.
The connection between the current conductor 25 and the electrode 20 by way of the crimp tubule 7 requires much effort to produce, in which respect it should always be kept in mind that the lumen 11 has a very small diameter, in the case of probes a diameter in the lower mm range or even below that.
Another problem with the known instrument resides in the fact that in particular the helical section 6 and its transition to the straight ignition electrode 20 cause, firstly, a constriction of the space through which the inert gas flows, and furthermore in the transition region between the helical section 6 and the interior of the tubule an asymmetry is present, which results in nonuniform gas-flow relationships within the tubule 14. All these asymmetries and constrictions interfere with the plasma generation and in particular result in poor reproducibility of instruments manufactured in series, with regard to their ignition behavior.
In a thermal respect, as well, the known state of the art raises problems. That is, the plasma causes heating and even burning away of the ignition electrode 20, so that the burning behavior, and in particular the ignition behavior of the instrument, changes while it is in use, which in turn makes it necessary to readjust the coagulation current (and/or the amplitude of the applied HF voltage).


A pressure sensor apparatus and a method of forming the same. A substrate (e.g., PCB) can be provided that includes a top side and a bottom side. A pressure transducer can be directly bonded to the top side of the substrate, wherein the substrate comprises substrate walls forming a plated through-hole that allows for the passage of a sensed media to contact a back side of the pressure transducer. Thereafter, a metal carrier with an integral port is bonded to the bottom side of the substrate, thereby forming a chip-on-board pressure sensor in which the need for a plating or coating to allow adhesion between the pressure transducer and the metal carrier is eliminated. The pressure transducer may comprise, for example, silicon or silicon bonded to glass. The metal carrier can be provided with a feature that mates with a valve such as a Schrader valve.

Many processes and devices have been used in the field of pressure sensing. Pressure sensors are generally used and deployed wherever a need for monitoring and responding to pressure changes is necessary. Pressure sensors are commonly used in a variety of automotive, aerospace, commercial, industrial, and consumer applications.
The operational environments in which pressure sensors are required to operate in these applications with high accuracy and repeatability can be very demanding. For example, extreme thermal conditions including thermal shocks in ranges from 160 C to −55 C, exposure to harsh and/or conductive media, withstand high overpressure (proof pressure) cycling without change in calibration and survive high peak (burst) pressures to protect system from potentially catastrophic leaks.
In the case of a pressure sensor that relies upon the use of a pressure transducer (or sense element) including piezoresistive silicon on an etched silicon diaphragm, a most cost effective solution for operating in such environments is to use so called "back-side" sensing. With this arrangement the only parts of sensor which are exposed to the media are the electrically isolated cavity side of the pressure transducer, the adhesive used to bond the transducer die to a substrate and finally the substrate itself.
FIGS. 1-4 illustrate example prior art pressure sensor apparatus configurations. FIG. 1 illustrates a cross sectional view of a prior art direct chip-on-board mounted pressure sensor apparatus 100. The configuration illustrated in FIG. 1 generally includes a pressure transducer/die 102 that is attached to a printed circuit board (PCB) substrate 106 with the assistance of a die-attach adhesive 104. A plurality of bond wires 110 are also depicted in the configuration illustrated in FIG. 1. The bottom portion of the pressure sensor apparatus 100 includes a housing 108. A top cover 105 or protective portion is also included. The configuration depicted in FIG. 1 is generally presented for background and edification purposes only and is not considered a limiting feature of the disclosed embodiments.
FIG. 2 illustrates a side sectional view of another prior art sensor apparatus 200. FIG. 3 illustrates a portion of a prior art sensor system 400 in which the sensor apparatus 200 can be implemented, while FIG. 4 illustrates a larger view of the system 400 together with the prior art pressure sensor apparatus 200. FIGS. 2-4 are illustrated as a contrast to the improved sensor apparatus 500, which is described in greater detail herein. Note that in FIGS. 2-4, identical or similar parts or elements are generally indicated by identical reference numerals. The prior art sensor apparatus generally includes a PCB (Printed Circuit Board) 201 in association with one or more bond wires 204, 255, and 257. An electronic component 212 can communicate with the PCB 201 via bond wires 255 and 257. Similarly, an electronic component 243 can communicate with the PCB 201 via the bond wire 204.
An adhesive or glue 209 is generally utilized to maintain a contact clip 202 with respect to the PCB 201. A glue 208 can also be utilized to maintain the component 243 to the carrier 204. Additionally, a cover or housing 203 surrounds the components 243 and 212. An adhesive may be utilized to maintain the component 212 to the PCB 201. The pressure sensor apparatus 200 includes the carrier 204 in which a port 251 is disposed and configured within the carrier 204. As shown in FIG. 3, the carrier 204 can be configured from a rigid material 207, which is preferably a metal such as aluminum in order to ensure that the carrier 204 is rigid. A section 402 as depicted in FIG. 4 generally constitutes a fitting while the area 404 can include threads. Areas 207 and 402 together can constitutes a valve such as a Schrader valve. The port 251 depicted in the prior art configuration of FIG. 204 extends toward and into an area 261 of the carrier 204. The area 261 thus extends through the cross section of PCB 201, offering a limited area for component attachment.
One of the problems with the prior art configurations illustrated in FIGS. 1-4 is that such designs need to operate reliably under the conditions described earlier and with the use of attach materials which have high strength and chemical resistance. The rigid mounting of a stress sensitive die (e.g., pressure transducer), for example, onto a PCB where there is a large mismatch in thermal expansion coefficient between the die and the PCB can introduce high levels of package stress, which can result in output errors, non-repeatability and potentially, mechanical damage.
Pressure sensor designs are known, which include the use of a Si piezoresistive die mounted to a metal carrier via an adhesive or epoxy. Such metal carriers not only serve as a substrate or pedestal, but when assembled in the final product design also serve to mate, for example, with a Schrader valve in an automotive HVAC system. These metal carriers are typically made of aluminum, which is known to possess a high affinity for oxygen and quickly forms oxides when exposed to the open environment and adversely affects adhesion. Other times, a plating or coating must be implemented to allow adhesion between the silicon pressure die and the metal carrier. Common platings in the field use chromium and this material is being eliminated from use in a number of countries, including those in Europe. Removing this material from the plating does not allow for a strong bond between the sense die and the carrier. Therefore, in order to overcome this problem, it is believed that a solution lies in the implementation of an improved pressure sensor method and system, which is disclosed in greater detail herein.


The invention provides DNA sequences encoding insecticidal secreted proteins from bacteria and transgenic plants having insecticidal activity against coleopteran insect pests. Methods of protecting plants from damage by insects by transforming the plants with chimeric genes comprising DNA sequences encoding the insecticidal secreted proteins are also provided.

1. Field of the Invention
The present invention relates to new insecticidal secreted proteins ("ISPs") isolated from a bacterial strain, preferably a Brevibacillus species strain, most preferably a Brevibacillus laterosporus species strain which are insecticidal when ingested in combination with an ISP-complimentary protein such as another ISP protein of this invention, and to DNA sequences encoding such proteins. These proteins are useful to prevent or minimize insect damage, particularly of corn rootworms, to plants in a field.
The present invention also relates to plants, particularly corn plants, which are rendered insecticidal, preferably to coleopteran insects, particularly to Diabrotica spp., Leptinotarsa spp. and Anthonomus species insects, by the expression of the ISP proteins of this invention in cells of said plants.
The present invention also relates to a method for controlling damage by Diabrotica spp., Leptinotarsa spp. or Anthonomus species insects, preferably Diabrotica spp. insect pests, particularly corn rootworms, by having the ISP proteins of the invention, particularly the proteins with the amino acid sequence of any one of SEQ ID No. 2, 4, 8 or 10, or insecticidally-effective fragments thereof, ingested by said insects.
2. Description of the Prior Art
Some of the most destructive pests are found among the Diabroticine beetles. In North America, the three important species of corn rootworms, Diabrotica virgifera (the Western corn rootworm), Diabrotica barberi (the Northern corn rootworm) and Diabrotica undecimpunctata howardi (the Southern corn rootworm) are considered to be the most expensive insect pests to control (Metcalf, 1986, Foreword in "Methods for the Study of Pest Diabrotica", pp. vii–xv, eds. Krysan, J. L. and Miller, T. A., Springer-Verlag, New York). Diabrotica virgifera and Diabrotica barberi are considered the most serious insect pests of corn in the major corn-producing states of the United States and Canada (Levine and Oloumi-Sadeghi, 1991, Annu. Rev. Entomol. 36, 229–55). The larvae feed on the roots and thus cause direct damage to corn growth and corn yields. Costs for soil insecticides to control larval damage to the root systems of corn and aerial sprays to reduce beetle damage to corn silks, when combined with crop losses, can approach one billion dollars annually (Metcalf, 1986, supra). Recently, in some US states it was discovered that the crop rotation program of planting soybeans after corn lost its effect as corn rootworms have adapted to this situation.
Bacterial strains and/or genes with toxicity to corn rootworm have been described in U.S. Pat. Nos. 6,023,013; 6,015,553; 6,001,637; 5,906,818; and 5,645,831. Also, PCT publications WO 00/09697, WO 99/57282, WO 98/18932, WO 97/40162, and WO 00/26378 relate to toxins and genes obtainable from Bacillus or other bacterial spp., some of which are described to have toxicity to corn rootworm. WO 98/44137, WO 94/21795 and WO 96/10083 relate to pesticidal Bacillus strains, characterized by pesticidal proteins and auxiliary proteins produced during vegetative growth, some of which are described to have toxicity to corn rootworm. U.S. Pat. No. 5,055,293 describes a method to control corn rootworms by inoculating soil with parasporal-inclusion forming species of Bacillus laterosporus. Orlova et al. (1998, Applied Environmental Microbiol. 64, 2723) showed insecticidal activity to mosquitoes associated with protein crystals in crystal-forming strains of Bacillus laterosporus.

Transgenic plants expressing insecticidal proteins and methods of producing the same


The present invention relates to a display, in particular Head-Up-Display of a vehicle, comprising an image forming unit for generating an image, an illumination means for illuminating the image forming unit and a deflecting unit for providing a user with a virtual image of the image generated by the image forming unit, wherein the image forming unit comprises a reflective LCoS—(Liquid Crystal on Silicon) display and the deflecting unit comprises a partially transmissive combiner.

The present invention relates to a display, in particular Head-Up-Display of a vehicle, comprising an image forming unit for generating an image, an illumination means for illuminating the image forming unit and a deflecting unit for providing a user with a virtual image of the image generated by the image forming unit.
Suchlike Head-Up-Displays are commonly known from the prior art. They have been used in airplane cockpits and motor vehicles for several years in order to provide the pilot or the driver with information like e.g. operational data of the airplane or the vehicle in a comfortable manner. For this purpose, Head-Up-Displays with monochrome visual imaging are used mostly. Meanwhile, the pilot or the driver has to be provided with a continually increasing amount of information, so that a most clear and detailed visualization of the information is required. This can advantageously be achieved by a multi-colored visualization of the information. In this way, a warning message can be highlighted compared to less important information, for instance.
Commonly used multi-colored Head-Up-Displays usually work with LCD (Liquid Crystal Display)-displays, which are backlighted by an intensive light source, e.g. a LED (Light Emitting Diode). Disadvantageously, the brightness and the contrast of suchlike Head-Up Displays are comparatively low due to a comparatively low transmission of the LCD-display. Consequently, the visualization of the information is not favorable for the drivers or the pilots. Furthermore, the low transmission cannot be compensated simply by increasing the light intensity of the light source, because the intensive light source generates a lot of heat, so that a comparatively complex and expensive cooling mechanism for cooling down the display would be needed in this case.

Display, in particular head-up-display of a vehicle


A tool head having a first slide fitted with a tool holder as well as a second slide for eliminating the unbalance effect created by the off-centering of the first slide. An actuating device that can be actuated longitudinally that is able to control the radial displacement of the two slides. Each of these slides is provided with a pressing device for pressing the slide against an oblique support surface of the actuating device. The force exerted by each of the pressing devices is determined, so as to be greater than the centrifugal force exerted on each slide and in a direction opposed to that of the centrifugal force. This force is determined so that the resultant force of all forces exerted on each slide is constant.

The content of Application No. 99810884.9, filed Sep. 30, 1999, in Europe, is hereby incorporated by reference.
The present invention concerns a tool head that can be mounted on a machine tool headstock and fitted with a radially movable tool holder slide. Such a tool head allows the machining of cylindrical portions that are external or internal, coaxial, of different diameters, as well as of circular or truncated plane faces, with a single machining tool.
Different tool heads able to perform a machining of this type are known from the prior art.
The company Komet in Besigheim, Germany, supplies a tool head of this type comprising a first slide that can be moved perpendicularly to the axis of rotation of the tool head and that carries the machining tool, as well as a second slide to compensate unbalance and that can also be moved perpendicularly to the axis of rotation of the tool head. The mass of the second slide is equivalent to the sum of the masses of the first slide and of the tool it carries. Both slides are driven in opposite directions by a tension rod fitted with a double rack acting simultaneously on the two slides. This device has at least to major disadvantages, namely that the force necessary to act on the tension rod depends essentially on the centrifugal force exerted on the two slides, i.e. on the head""s speed of rotation as well as on the radial position of the two slides. Consequently, use of such a tool head is limited at low machining speeds. The other inconvenience is caused by the play of the rack on the slides toothing, thus limiting the machining accuracy.
Other tool heads propose to have the machining tool swivel on an eccentric circle. Such a method means that the working angle of the tool on the work piece varies during machining, which is detrimental for the state of the worked piece""s surface.
U.S. Pat. No. 4,508,475 of Peuterbaugh describes a tool head with two slides, the pressing means on the slides being constituted by springs. This document does not specify anywhere a relation between the pressing forces exerted by the springs and those exerted by the centrifugal force.
The hydraulic pressing means described in patent U.S. Pat. No. 5,307,714 of Muendlein et al. acts on the longitudinal actuator rod for moving the slides and not directly on the slides themselves. There is thus no compensation of the centrifugal force on the slides as sought.
A first object of the invention is therefore to propose a tool head able to perform a machining as proposed without the aforementioned inconveniences of known tool heads.
Another object of the invention is to propose a tool head that can perform a machining as proposed and whose force driving the means for radially displacing the tool is independent from the speed of rotation of the head as well as from the radial displacement of the tool.
Another object of the invention is to propose a tool head that can perform a machining as proposed and whose driving means for radially displacing the tool are free from play.
Another object of the invention is to propose a tool head that can perform a machining as proposed and that is of simple construction, reliable and requiring minimal maintenance.
According to the invention, these objects are achieved by a tool head as described in claim 1, variants or alternative embodiments being described in the dependent claims.
An embodiment of the invention is described hereafter, this description making reference to the attached drawings containing the figures and in which:


A centrifugal blower apparatus includes a scroll-shaped housing with first and second air inlets which open to a blower chamber that is in fluid communication with an air outlet. The blower includes a motor to drive impellers, wherein the motor is secured to a frame coupled within the housing in a manner to substantially enhance aerodynamic performance of the blower.

Demands for electronic equipment to increasingly provide higher-performance operation in smaller packages are ever present. Typically, such electronic equipment requires compact and highly efficient cooling systems to provide cooling air to power supplies, microprocessors, and related electronics that reside in the equipment. A typical cooling system involves moving air across one or more operating electronic components, such as printed circuit boards. The flow path layout, type of air moving device, and how well it is integrated into the system are each key elements in achieving desired cooling performance in a small package size.
Air movers of various types are available to select from when designing an electronics package cooling system. Such air mover types include axial fans and centrifugal blowers, each exhibiting advantages and disadvantages. Conventional systems, however, often employ fans and blowers that are not well matched to the system pressures, or do not move air efficiently within the space constraints, and therefore result in unacceptable noise and relatively large power consumption.
A particularly useful type of air mover is a double inlet centrifugal blower. Such blowers may be particularly well suited for restrictive flow systems that require a high volume of cooling air. Conventional implementations of centrifugal blowers typically employ a motor that is affixed in one of two inlets, or inside the hub of the blower wheel with strut connections at one or both of the inlets. Neither conventional design is optimal, because the motor occupies valuable aerodynamic space, reducing the overall cooling efficiency of the blower, and creating unwanted noise. The hub motor approach may require a hollow shaft and resultant manufacturing complexities associated with routing stator wires through a mounting shaft. A marketplace example of a conventional arrangement in which the motor is mounted in one of the two air inlets of the centrifugal blower is available from Fasco as model number B45267. An example of a double inlet centrifugal blower with a hub motor with a strut assembly for securing the motor inside of the hub is described in U.S. Pat. No. 2,776,088 to Wentling.
An alternate approach employs a mid-plane blower motor of the type described in U.S. Pat. No. 3,231,176 to Bowen. While the arrangement described in the Bowen '176 patent reduces the obstruction to the impeller, such design nevertheless employs struts for rotor support in the housing inlets. Such struts, as recognized above, inhibit aerodynamic efficiency.
The present invention provides a double inlet centrifugal blower employing a motor which minimizes aerodynamic interference and simplifies construction. In doing so, such a blower enhances operating efficiency to potentially reduce power consumption and noise output.

This patent is subject to a terminal disclaimer.

Double inlet centrifugal blower with a solid center plate


A gas-liquid contacting tray equipped with downcomers having sidewalls with liquid outlet openings, which openings are provided with a liquid guiding device such as a lip or a spout. In one embodiment the contacting tray constitutes an upper tray having downcomer(s) which are arranged in parallel, and symmetrically, with downcomers on a lower tray.

Such a tray is normally horizontally mounted in a vertical column, and the terms upward, downward, top, and bottom are used in the specification and in the claims with reference to this normal tray arrangement. The vertical column can for example be a column for counter-currently contacting gas and liquid, such as a fractionation column, wherein a plurality of similar trays are vertically stacked.
Each of such trays normally comprises a bubble area, which is an area on the tray plate that is provided with tray openings, e.g. perforations or special valves, through which gas can upwardly pass during normal operation. In this way gas is allowed to bubble through the liquid present on the tray during normal operation, thereby achieving intimate gas-liquid contact. Liquid is normally received on the tray from the liquid outlet of the downcomer of an upper tray. The tray is arranged such that liquid flows a certain distance over the tray during which time gas can bubble through, before the liquid is removed from the tray and guided to a lower tray via a downcomer.
The liquid outlets of the downcomers can in particular be arranged above the level of liquid on the liquid receiving tray. Such downcomers are commonly referred to as truncated downcomers.
U.S. Pat. No. 4,550,000 discloses a known tray which comprises a number of parallel rectangular sloped downcomers. A rectangular downcomer has a substantially rectangularly shaped inlet opening. A rectangular sloped downcomer is a downcomer of which the longer sidewalls are inclined towards each other in downward direction. The lower end of the known downcomers is formed by a bottom plate wherein the liquid outlet openings are arranged, so that interference of liquid streams from adjacent downcomers is prevented.
It was observed that a problem occurs when such downcomers are operated at high liquid loads. The liquid leaving through the liquid outlets falls with such a velocity on to the next lower tray, that the liquid may pass directly through any perforations directly below the downcomer. This is a problem since normally the liquid that is received on a certain tray must travel some distance to the next downcomer inlet opening so as to have sufficient residence time for gas-liquid contact on that tray. Also if trays with floating valves are used, the momentum of the liquid received on the lower tray may push the valves directly below the downcomers downwards, thereby closing the tray openings on the next lower tray, so that gas cannot bubble through the liquid receiving area. This problem is not encountered when no perforations or valves are arranged in a liquid receiving area underneath the downcomers of the upper tray. However this is undesirable since the unperforated liquid receiving area is arranged at the cost of bubble area, whereas it is normally desired to maximise the bubble area for optimum fractionation efficiency.
U.S. Pat. No. 4,550,000 discloses a solution to this problem by arranging a perforated structure made of expanded metal on the lower tray, underneath the liquid discharge openings of the upper downcomer. The perforated structure serves to break up and at least partly deflect the liquid stream. However, such perforated structures are not normally applied in practice because of their complexity and manufacturing cost.
Clearly the problem described hereinbefore increases with increasing velocity of the liquid impacting on the tray below. Particularly high liquid velocities are observed with trays comprising highly sloped rectangular downcomers as described in International patent application publication No. WO 01/60485.
U.S. Pat. No. 5,407,605 discloses a gas-liquid contacting tray comprising a perforated tray deck and a plurality of rectangular downcomers, each having a pair of planar sidewalls that are inclined towards each other so that the downcomers have triangular cross-section. The bottom part of the downcomers is sealed and the inclined walls are provided with liquid outlet openings in the form of perforations. In this way a horizontal velocity component away from the downcomer is imparted to the liquid exiting the liquid outlet openings. The known tray is useful for spreading the liquid over any packing which may be located below the tray. Also, when no packing is arranged so that the liquid is directly received by a lower tray, the horizontal velocity component helps directing the liquid onto the decking area of the tray below.
However, it was found that it is difficult to control or optimize the distribution of liquid from the downcomer outlet openings onto the tray below, in order to make optimum use of the bubble area. Under given process conditions in the column the flow path of liquid exiting from the known downcomer is mainly determined by the angle of the sidewall with the vertical.
UK patent application publication No. GB 2 002 650 discloses a vertical column comprising two trays that are vertically stacked in the column. On each tray a plurality of rectangular downcomers is arranged that extend parallel to each other over the width of the tray, in between perforated bubble area. The floor members of the downcomers are provided with openings through which the liquid exits vertically downwardly. In order to prevent weeping of liquid from the upper downcomers through the lower fluid contact area, transversely beneath the downcomer openings a lip means is arranged, that gives a horizontal velocity component to the liquid exiting the downcomer perpendicular to the length direction of the downcomer. In one embodiment of the known trays the downcomers on both trays extend parallel to each other, and the downcomers of the lower tray are transversely so much displaced, that the liquid from the upper tray is not discharged directly into the downcomer of the underlying tray. In another embodiment the downcomers on both trays extend in mutually perpendicular directions, and the liquid exiting from the upper downcomer flows parallel between the downcomer inlet openings on the lower tray.
It is desired to provide a gas-liquid contacting tray with a downcomer, which allows controlled or optimized distribution of the liquid from the downcomer over the tray below, in particular such that the use of bubble area on the tray below and the overall tray efficiency can be maximised.


A circuit for controlling the energizing of heating elements (13), including transistors (12) for controlling the energizing of the respective heating elements, energizing start time counter circuits (22) for determining a delay time until the energizing of the respective transistors (12) is started, and energizing time counter circuits (23) for determining energizing time. Data are written to the respective counter circuits from the outside via a group of multi-bit, multi-stage latch circuits and a counter clock signal (8). The energizing start time counter circuits (22) are collectively and simultaneously caused to perform a count (subtraction) operation. Then, the energizing time counter circuit (23) is made to start a count operation at a point in time when each of the energizing start time counter circuits (22) holds a value of 0, and the transistors (12) start to energize each heating element (13). According to this arrangement, dots are formed at equal horizontal intervals, irrespective of the dot size.

The present invention relates to control of a thermal head of a thermal printer, and more particularly, to a circuit for controlling the area modulation of a transfer pixel unit.
FIG. 9 illustrates a conventional circuit for controlling the energizing of heating elements. In FIG. 9, numeral 101 denotes heating elements, 108 transistors for driving the respective heating elements, 107 AND gates, 106 latches, 104 a shift register, 109 an energizing time signal line, and 102 a printing data line through which one-bit printing data is input on a time series basis, the printing data being transferred to the shift register 104 in synchronization with a clock signal from a transfer clock line 103. After all the printing data for turning on or off the heating elements 101 have been transferred, a latch signal from a latch signal line 105 causes the printing data stored in the shift register 104 to be collectively stored in the respective latches 106. Before being converted into a signal for driving the transistor 108, the output of the latch 106 is input to one terminal of AND gate 107, while a signal from the energizing time signal line 109 is input to the other terminal of AND gate 107. The heating element 101 is energized via the transistor 108 by making the printing data "1" (HIGH), while the heating element is energized only for the period of time defined by the energizing time signal after the printing data is completely stored in the latch 106. With this arrangement, the energizing time can be varied by supplying to each heating element the number of pulses corresponding to image density, where 256 dots in terms of a binary data image is equivalent to one line. For example, the energizing time can be varied with respect to a maximum dot of one pixel in a multi-value data image when tone is emphasized, by individually controlling the heating-element energizing time as in the case of a multi-value data image, or when energizing time control at a level of 256 is exercised on the individual heating element.
As described above, the energizing of one heating unit is determined by the time required for data to be transferred to the register in view of the prior art circuit configuration. If it is attempted to control the energizing time to increase the image density, the printing speed per line tends to decrease. In other words, simultaneous control of printing speed and energizing time has heretofore been incompatible. In order to solve this problem, there has been proposed a method of controlling the energizing time by transferring energizing time data to a multi-bit shift register and inputting the data to a counter with a latch function to allow individual control of the energizing times of the heating elements. Although simultaneous control of printing speed and energizing time has been made compatible in the method described above, the center of a dot shifts in proportion to its diameter (.DELTA.L), as shown in the transfer pixel configuration of FIG. 10. The disadvantage in this case is that the dot corresponding to the pixel tends to be inclined, although at a small angle.

Circuit for controlling energizing of heating elements


The present invention relates to a heat treatment apparatus and a heat treatment method that control temperature distribution during cooling. There is provided a cooling step in which a heated treatment object is cooled using a cooling liquid in mist form, and heat treatment is performed by alternatingly repeating a first step (K1) in which the treatment object is cooled at a first mist density, and a second step (K2) in which the treatment object is cooled at a second mist density that is less dense than the first mist density.

Conventionally, an oil quenching type of cooling apparatus or a gas quenching type of cooling apparatus is used in cases in which high-speed cooling is required in a heat processing apparatus that performs processing such as quenching in which a treatment object in the form of a metal material is heated and then cooled. These oil quenching cooling apparatuses have superior cooling efficiency, however, they have the problem that they are substantially unable to perform precise cooling control and it is easy for an article being heat-treated to become deformed. In contrast, in gas quenching cooling apparatuses, although cooling control is easily achieved by controlling the gas flow rate so that these apparatuses less likely deform the article being heat-treated, they have the problem that they have inferior cooling efficiency.
Consequently, a technology is disclosed in Patent document 1 in which liquid nozzles and gas nozzles are disposed around an article being heat-treated, and cooling liquid is supplied as a spray from the liquid nozzles (what is known as mist cooling), while cooling gas is supplied from the gas nozzles. As a result, an improvement is achieved in both cooling controllability and cooling efficiency.

Heat treatment apparatus and heat treatment method


Contamination at the exciter of a parabolic antenna can lead to impaired signal quality, or even system downtime. A parabolic antenna is described which in addition to a parabolic reflector and an exciter has a rinsing device, which is configured so as to rinse and clean the exciter with rinsing agent or protect it from contaminants. Herein, the rinsing agent is injected, dropped, or else blown from a rinsing outlet in an outlet member at the parabolic reflector onto the exciter. Mounting the rinsing outlet directly to the parabolic reflector allows for the exciter to be cleaned from the parabolic reflector.

Known level measuring instruments have a parabolic antenna, which emits or receives radar or microwaves for determining the filling level of a medium in a filling material container. In this case, the parabolic antenna of such a level measuring instrument is arranged e.g. inside a container.
The quality of the measuring signals received at level measuring with a level radar having a parabolic antenna largely depends on the quality of the transmitting-receiving unit. In particular, contamination of the antenna feed or the exciter, which may be caused e.g. by filling material dust or liquid, may significantly deteriorate the quality of measuring results. In the extreme case, serious contamination of the exciter (which by the way may also be used as a radiation receiver) may even lead to no signals being transmitted at all.

Parabolic antenna with rinsing connection


It is intended to correct print pitches P at which a pattern A is printed on a plastic film 1 repeatedly. A first optical sensor detects positions at which the pattern A is printed on the plastic film 1 repeatedly, to measure the print pitches P individually. A first stretching device 4 stretches the plastic film 1 after measuring the print pitch P to correct the print pitches P individually. A second optical sensor detects the positions after correcting the print pitch P to measure a sum of print pitches P(1)+P(2)+ - - - +P(N) of a number of patterns A. A second stretching device 10 stretches the plastic film 1 after measuring the sum of print pitches to correct the sum of print pitches.

For example, in a machine for successively making plastic bags each of which includes a pattern printed thereon, a plastic film is fed longitudinally thereof. The plastic film includes the pattern printed thereon repeatedly, with a print pitch being predetermined. The plastic film is fed intermittently for a length corresponding to the print pitch and stopped temporarily whenever being fed intermittently. In general, plastic films are superposed with each other. The plastic films are then heat sealed with each other by a heat seal device and cross cut by a cross cutter whenever being fed intermittently and when being stopped temporarily, to successively make plastic bags.
In this case, conformity in pattern is required between the plastic films. On the other hand, minute errors must exist in the print pitches of plastic film to be accumulated, resulting in a discrepancy in pattern between the plastic films. In order to overcome this problem, there has been proposed an apparatus for correcting the print pitches, as disclosed in Japanese Patent No. 4,121,722.
In the apparatus of the patent, a plurality of optical sensors are disposed at a path along which the plastic films are fed, to detect and compare positions at which the patterns are printed on the plastic films repeatedly. In addition, the apparatus is arranged to heat a specific film partially to stretch it by tension at a position predetermined upstream of the optical sensors when the specific film goes ahead of other films. The apparatus can therefore correct the print pitches, conformity in pattern being obtained between the plastic films.
However, the apparatus can merely correct the print pitches of the plastic films relatively to each other. The apparatus cannot correct the print pitches individually to keep them at a fixed value. In addition, when stretching the plastic film, the print pitch is fluctuated by the stretching amount. The plastic films are then heat sealed with each other and cross cut by the heat seal device and the cross cutter at a position predetermined with respect to the pattern. The plastic bag must therefore have a size changed by the print pitch fluctuated. The apparatus cannot keep the size constant. Furthermore, the heat seal device and the cross cutter have to be moved by a drive means for adjustment of position when operating the machine so that the plastic films should be heat sealed and cross cut at the position predetermined with respect to the pattern, resulting in technical problems.
It has also been proposed in the patent to keep an average of print pitches constant by correcting the print pitches. However, the apparatus cannot correct the print pitches individually all the same. It can merely keep the average of print pitches.
By the way, the apparatus is arranged to heat the plastic film partially to stretch it by tension, as described previously. However, the plastic film is not always suitable for heating. There has therefore been proposed a device for stretching a plastic film in a different way, as disclosed in Japanese Patent Publication No. 4,461,201. The device can stretch a plastic film by using rollers without heating the plastic film partially.
It is therefore an object of the invention to provide an apparatus for correcting print pitches at which a pattern is printed on a plastic film repeatedly, which can correct the print pitches individually.

Print pitch correcting apparatus for plastic film