An electric wave receiving apparatus obtains the received data in a partial period, and judges the timing of the received data in which partial data has been received by comparing the received data with the partial data. Thereby, the electric wave receiving apparatus performs correction of the second data of timing data.

1. Field of the Invention
The present invention relates to an electric wave receiving apparatus that receives an electric wave modulated by a time code and an electric wave clock that performs the time correct of an internal clock on the basis of a received time code.
2. Related Art
There has been an electric wave clock for receiving a time code to automatically correct the internal clock of the electric wave clock before. The time code is transmitted as a standard electric wave by performing the amplitude modulation (AM) of a carrier wave of 40 kHz or 60 kHz. As shown in FIG. 6, in the time code, a frame of data is composed of 60 data pulses arranged in each second which data pulses are classified into three kinds that are identified by their pulse widths. Then, for example, the time code in Japan is configured so as to express a "minute" by the partial data from 1 second to 8 seconds, an "hour" by the partial data from 12 seconds to 18 seconds, a "total days" by the partial data from 22 seconds to 33 seconds, and a "year" by the partial data from 41 seconds to 48 seconds.
Conventional electric wave clocks have generally received the time code during the whole period of one frame or a plurality of frames of the time code to perform time setting and time corrections (see, for example, US 2007/0177690 A1).
The reception processing of the standard electric wave consumes comparatively large electric power. In particular, in a wrist watch driven by a small-sized battery, the electric power consumption is the level of consumption that cannot be treated lightly. Consequently, there is the problem of shortening a total time during which electric power is consumed by the electric wave receiving processing at the time of receiving the time code to perform a time correction.
Moreover, the standard electric wave sometimes cannot be received as a neat signal owing to attenuation in an office building, the mixture of external noises, and the like. Consequently, there is also the problem of judging the time code accurately to enable a correct time correction even under such a bad electric wave condition.

Electric wave receiving apparatus and electric wave clock


Provided is a method of manufacturing a wire grid polarizer in which a stable color coordinate can be implemented. According to the present invention, in a process where a second grid pattern of metal pattern is formed over a first grid pattern made of resin material, metal layer is deposited in a concave portion formed between adjacent first grid patterns to form void portion and a width and a height of the second grid pattern are adjusted depending on adjustment of a width of the voids, and thereby improving a process efficiency.

1. Field of the Invention
The present invention relates to a method for manufacturing a wire grid polarizer, capable of implementing a stable color coordinate.
2. Description of the Related Art
In general, a polarizer or polarizing device refers to as an optical device for drawing linearly polarized light having a specific vibration direction among non-polarized lights such as natural light. In addition, a wire grid polarizer is a kind of optical devices for producing polarized light using a conductive wire grid.
Generally, in a case where a cycle of metal line placement is shorter than a half-wavelength of an incident electromagnetic wave, a polarized component (s wave) parallel to the metal line is reflected and a polarized component (p wave) vertical to the metal line is transmitted. Here, a planar polarizer having an excellent polarization efficiency, a high transmission rate and a wide view angle cab be manufactured using the phenomenon as described above, which refers to as a wire grid polarizer.
FIG. 1 is a view illustrating a configuration and function of a prior wire grid polarizer wherein metal grids 2 having a predetermined thickness h are placed on a substrate 1 in a predetermined cycle A and the cycle of fine metal grid of a wire grid polarizer may be less than a half of a visible light wavelength. In case where the cycle of a metal line in the wire grid polarizer is much smaller than a wavelength of incident light, when non-polarized light is incident, a component having a vector orthogonal to a conductive wire grid, i.e., p polarized light is transmitted, and a component having a vector parallel to the wire grid, i.e., s polarized light is reflected.
In the prior wire grid polarizer as configured in an above manner, as an incident angle of light is enlarged by a fine metal grid formed directly over a substrate, a transmission rate depending on a wavelength of the incident light is varied, and thereby limiting to implementing colors depending on a view angle. Further, in a case where light is incident from one surface of the substrate 1 opposite to the other surface on which a metal grid is formed, the light is reflected from and absorbed into the one surface of the substrate, and thereby decreasing a light transmission rate.

Method for manufacturing a wire grid polarizer


A vehicle sunroof device has a contact portion between a panel bracket and a guide bracket, an insertion portion, a first member, and a second member. The contact portion contacts a first bracket, which is one of the panel bracket and the guide bracket. The insertion portion protrudes at the contact portion and is inserted into an attachment hole formed in a second bracket, which is the other of the panel bracket and the guide bracket. The first member has a retainer portion that permits a set range of motion of the second bracket. The second member is fastened to the first member. The first and second members permit relative motion of the first and second brackets in the non-fastened state, and restrict relative motion of the first and second brackets in the fastened state.

As a conventional sunroof device, a sunroof device described in Patent Document 1, for example, is known. As shown in FIG. 17, the vehicle sunroof device includes a first bracket 83 and a second bracket 85. The first bracket 83 is fixed to a movable panel 82 for selectively opening and closing an opening 81, which is formed in a roof portion 80 of a vehicle. The second bracket 85 is movably supported by a guide rail 84, which is arranged below the movable panel 82 and extends in the vehicle front-rear direction. The first bracket 83 and the second bracket 85 are opposed to each other in the vehicle lateral direction. The vehicle sunroof device also includes a screw member 86 and a nut member 87. The screw member 86 extends in the vehicle lateral direction and is inserted through the first bracket 83. The nut member 87 is engaged with the screw member 86 at a position between the first bracket 83 and the second bracket 85 in the vehicle lateral direction.
The nut member 87 is fixed to the first bracket 83 by clamping the first bracket 83 between a base portion 87a and a head portion 86a of the screw member 86, which is opposed to the first bracket 83, in the vehicle lateral direction as the screw member 86 is rotated. The nut member 87, which is fixed to the first bracket 83, is pressed against and held in contact with a top surface of the second bracket 85 with respect to a rotational direction of the screw member 86 at an engagement portion 87b, which extends from the base portion 87a in the vehicle lateral direction. This restricts pivot of the nut member 87 relative to the second bracket 85.
Also, the nut member 87, which is fixed to the first bracket 83, allows movement of the second bracket 85 relative to the first bracket 83 in the vehicle lateral direction at a position between a retainer portion 87c, which is arranged at the distal end of the nut member 87, and the base portion 87a. Accordingly, even when the position of the second bracket 85 relative to the first bracket 83 changes in the vehicle lateral direction, the nut member 87 absorbs such position change and supports the second bracket 85.
In this case, the position of the second bracket 85 relative to the first bracket 83 is adjustable in the vehicle lateral direction. This ensures reliable connection between the first bracket 83 and the second bracket 85 without increasing the dimension of the guide rail 84 in the vehicle lateral direction, for example.


An improved apparatus, and related method of operation, is described for rapidly drying large monoliths of glass, ceramic and/or composite material, under subcritical conditions, while minimizing the risk of cracking the monolith during the drying process. The apparatus incorporates a pressure chamber for carrying the monolith to be dried, with no significant limitation on the size of the monolith relative to the size of the chamber. The monolith is initially immersed in a suitable drying solvent, and the temperature of the pressure chamber is raised to a predetermined value below the solvent's critical temperature, which raises the pressure to a predetermined value, likewise below the solvent's critical pressure. At a selected time during the drying process the pressure chamber is connected to a diffusion chamber, to draw away and condense solvent vapor. This drawing away of solvent vapor continues until the monolith is dry, at which time the pressure chamber is purged with an inert gas and then depressurized in a controlled manner. The apparatus thereby is configured to dry the monolith at an even lower subcritical pressure than previous apparatus of this kind, leading to increased safety and reduced operating expenses.

This invention relates generally to sol-gel processes for producing dry gel bodies and, more particularly, to drying processes and apparatus for rapidly drying wet porous monolithic bodies at elevated, subcritical temperatures and pressures.
Sol-gel processes are gaining increased popularity in the creation of large, high-purity monoliths of glass and ceramic materials. In such processes, a desired solution, i.e., a sol, including glass- or ceramic-forming compounds, solvents, and catalysts, is poured into a mold and allowed to react. Following hydrolysis and condensation reactions, the sol forms a porous matrix of solids, i.e., a gel. With additional time, the gel shrinks in size and expels fluids from its pores. The wet gel is then dried in a controlled environment, to remove fluid from its pores, and it is then consolidated into a dense monolith.
Advantages of the sol-gel process include chemical purity and homogeneity, flexibility in the selection of compositions, processing at relatively low temperatures, and producing monolithic articles close to their final desired shapes, thereby minimizing finishing costs. Despite these advantages, the sol-gel process has generally been difficult to use in producing monoliths that are large and free of cracks. These cracks arise during the drying step of the process, and they are believed to result from stresses due to capillary forces in the gel pores. Efforts to eliminate the cracking problem present in sol-gel monoliths have been diverse. However, the problem of cracking has not previously been eliminated without adversely affecting one or more of the advantages, as listed above, or without incurring undue expense.
Sol-gel derived bodies have previously been dried using any of several distinctly different approaches. In one approach, the wet gel is heated above the critical temperature of the solvent being used as the drying medium, in an autoclave or drying chamber that permits the pressure to exceed the solvent's critical pressure. Above the critical temperature and pressure, there is no vapor/liquid interface in the pores, so no capillary force exists. Therefore, the shrinkage of the wet gel is negligible during drying. The solvent is removed from the pores while the critical temperature and pressure are exceeded, until the gel is completely dried. Although this "supercritical" drying technique is generally effective, providing an autoclave operable at the required temperatures and pressures (greater than 243.degree. C. and 928 psia in the case of ethyl alcohol) can be prohibitively expensive for large scale manufacturing. Operating at such high temperatures and pressures also can be dangerous.
Inorganic solvents, such as liquid carbon dioxide (CO.sub.2), also have been used as the drying solvent in an attempt to at least avoid the need to operate at excessively high temperatures. CO.sub.2 's critical temperature is 31.degree. C., and its critical pressure is 1070 psia. CO.sub.2 also is advantageously used because it is not explosive. However, the compression equipment necessary for liquefying gaseous CO.sub.2, and the cryogenic equipment necessary for maintaining CO.sub.2 in its liquid state, are very expensive. Consequently, CO.sub.2 is not believed to provide a commercially attractive alternative.
In an alternative approach, the wet gels are dried at ambient pressure (14.7 psia), and at temperatures close to or slightly higher than the boiling point of the solvent used as the drying medium. An example of this approach is provided in U.S. Pat. No. 5,243,769, to Wang et al. This approach, however, causes excessive shrinkage of the wet gel during drying, resulting in very small pore size dry gels.
In another approach, the gel is heated to such temperatures in a chamber having several pin holes through which the evaporating liquid escapes. Because the chamber is ventilated to the ambient environment, the pressure cannot increase above ambient pressure. Although this approach is generally effective, it can be very slow, at times requiring as much as a month or more to complete the drying process. The drying rate can be increased by increasing the area of the pin holes, but this can lead to cracking. Moreover, this drying process also results in considerable shrinkage of the wet gel.
In variations of this ambient pressure drying technique, colloidal silica particles have been added to the sol to increase the average pore size and to increase the strength of the solid matrix. Although this technique is generally effective, the presence of colloidal silica particles sacrifices the gel's otherwise inherent homogeneity, and thus restricts the range of compositions that can be utilized. In addition, devitrification spots can be created if mixing of the colloidal silica particles is imperfect.
Alternatively, drying control additives, such as dimethyl formamide, can be added to the sol, to enlarge the pores and to control the drying rate. These additives are then removed during the drying step. Although this alternative technique is generally effective in eliminating cracking, the resulting monoliths can sometimes have a large number of bubbles.
Another approach for eliminating cracking of the glass or ceramic gel during the drying step has been to hydrothermally age the gel while it is still wet. This increases the average pore size in the gel, and correspondingly decreases the capillary stresses encountered during drying. Although this technique is generally effective, the aging step increases the time and the equipment costs for drying gels.
Yet another approach for eliminating cracking of the gel during the final drying step is to dry the gel at an elevated temperature and pressure below the solvent's critical temperature and pressure. This subcritical drying process is carried out in a specially configured, sealed pressure chamber. The chamber is controllably heated, to evaporate the solvent and thereby cause the pressure within the chamber to rise until it eventually stabilizes at a substantially constant value. The value of this final pressure is determined according to the total amount of solvent, including both free solvent and solvent in the pores of the wet gel, present in the chamber before the chamber is sealed and heated. The chamber is sized so that it can accommodate all of this solvent in its gaseous form without reaching the solvent's critical pressure. This drying process is described in greater detail in U.S. Pat. No. 5,473,826, to Kirkbir et al. Although this subcritical drying process is effective in reliably and inexpensively drying wet gel monoliths, the limitation on the total amount of initial liquid solvent relative to the size of the drying chamber is considered to unduly limit the sizes of the gels that can be dried.
It should, therefore, be appreciated that there is a need for an improved drying process and apparatus such that the drying process can be carried out below the critical temperature and pressure of the drying solvent and that yields crack-free, porous glass and ceramic monolithic bodies with negligible shrinkage of the gel in even larger sizes than was previously attainable. The present invention fulfills these needs.

Method and apparatus for drying wet porous bodies under subcritical temperatures and pressures


One embodiment disclosed relates to a method for accurate electron beam metrology. A substrate with a target feature is loaded into a scanning electron microscope. An electron beam is scanned over the target feature, and scattered electrons are detected therefrom. A characteristic of the target feature is measured by finding optimal values for parameters of a mathematical model which accounts for substrate charging effects. Principal component analysis may be used to advantageously result in reduced requirements for processing time and/or computational speed.

1. Field of the Invention
The present invention relates to electron beam (e-beam) apparatus and metrology.
2. Description of the Background Art
As technology progresses in the semiconductor industry, the features of integrated circuit devices are being reduced to smaller and smaller sizes. Such reduction in feature size enables a greater density of devices to be manufactured on a semiconductor. However, increasingly smaller feature sizes require increasingly higher resolutions and accuracy in measurement, inspection, and review equipment.
One category of such equipment is based on scanning electron microscope (SEM) technology. In an SEM, a beam of electrons (an electron beam or e-beam) is scanned over a specimen, and the resulting electrons that are returned from the specimen surface are used to create an image of the specimen surface. In order to handle increasingly smaller feature sizes, it is desirable to increase the effective accuracy of SEM-based equipment used for feature measurement, substrate inspection, or defect review.

Method and apparatus for accurate e-beam metrology


A semiconductor circuit includes an internal circuit of plural transistors formed in a well of semiconductor substrate and, for each transistor, a threshold level indicator voltage generating circuit which detects a threshold level of the respective one of the plurality of transistors, a control signal generating circuit which generates a control signal in accordance with the threshold level detected by the threshold level indicator voltage generating circuit and a switching circuit responsive to a received control signal for switching to a designated one of plural power supplies of respective, different voltages for connection to the well. The switching circuit is controlled in accordance with the detected threshold level, so that the well is connected to an appropriate power supply. Any variation in the threshold level thereby is corrected since the well potential is controlled to a proper level so that a desired threshold level is obtained, for each of the plural transistors.

1. Field of the Invention
The present invention relates to a semiconductor integrated circuit having MOS transistor circuits.
2. Description of the Prior Art
Conventionally MOS transistor circuits driven by a power supply voltage of 3.0-5.0 V and having a threshold voltage of about 0.7 V have been normally used in a semiconductor circuit. Recently, however, requirements for high-speed performance and low power consumption have made it necessary to modify the conventional power supply voltage and threshold voltage. For example, it is essential that a semiconductor integrated circuit, for use in a portable appliance having its power supplied by a dry cell, be capable of operating with a low power consumption. The most effective approach to satisfy this need is to lower the power supply voltage. It is to be noted, however, that a transistor circuit operated with a lower power supply voltage and having its threshold voltage unchanged exhibits a slower performance. Hence, it is necessary to lower the threshold voltage when the power supply voltage is lowered.
It is known that the threshold voltage of a transistor is removed from a target level due to a variation in the fabrication process. For example, assuming that the target threshold voltage is 0.7 V, the threshold voltage of transistors in an actually produced circuit may vary between 0.6-0.8 V. Assuming that the target threshold voltage is lowered to 0.1 V in correspondence with a lowered power supply voltage, the threshold voltage of transistors in a circuit produced in the same process may vary between 0.0-0.2 V.
When the threshold voltage of a transistor is 0.0 V, a relatively large leakage current occurs so that the power consumption of the whole circuit becomes large. When the threshold voltage of a transistor is 0.2 V, a relatively small current flows when the transistor conducts, resulting in a slow operation speed of the circuit. While a variance of 0.1 V may not present a serious problem when the target threshold voltage is 0.7 V, the same degree of variance presents a serious problem when the target threshold voltage is 0.1 V.
One approach to correct a variation in the threshold voltage is to detect a well potential of a circuit and control a charge pump circuit connected to the well (for example, see "Tackling the parasite effect and maintaining the high performance trend", Nikkei Microdevices, July 1995).
It is also to be noted that, even when the threshold voltage is set to the target level, there is a need to reduce a leakage current only when the circuit is not in operation (that is, in a stand-by mode) for advanced lower-power consumption operation. One approach to reduce a leakage current when the circuit is in a stand-by mode is to switch between two types of external power supplies connected to the well potential of the circuit (for example, see "Tackling the parasite effect and maintaining the high performance trend", Nikkei Microdevices, July 1995).
While the above-described two approaches are effective to correct a variation in the threshold voltage and to reduce a leakage current, respectively, these two approaches can not be implemented at the same time because they are designed to control the well potential of a transistor using different approaches.
Conceivably, the leakage current can be reduced in a stand-by mode by providing transistors having different threshold voltages in the same circuit and disconnecting the transistors having a lower threshold voltage from a power supply using the transistors having a higher threshold voltage. However, when this approach is combined with the aforementioned circuit for correcting a variation in the threshold voltage, the circuit scale (i.e., size) becomes large and an additional step must be introduced in the fabrication process.

Semiconductor integrated circuit having controllable threshold level


A method of evaluating laser trimming of a semiconductor device having a thin film resistor is disclosed. The method includes the steps of providing the thin film resistor and laser trimming the thin film resistor by creating a first trim cut. The first trim cut bisects the thin film resistor such that the thin film resistor is divided into a first portion and a second portion. Also, the method involves measuring the insulation resistance of the thin film resistor. In addition, the method involves evaluating the trim cut based on the measured insulation resistance.

Laser trimming is used for trimming a thin film resistor (see U.S. Pat. No. 5,081,439 and Japanese Patent No. 2,618,139 for example). Specifically, as shown in FIGS. 10A and 10B, a thin film resistor 102 is formed on a top surface of a silicon substrate 100 of an IC chip. An insulation film 101 is interposed between the thin film resistor 102 and the silicon substrate 100. Also, electrodes 103, 104 are disposed at opposite ends of the thin film resistor 102. Trimming is performed by irradiating the thin film resistor 102 with a laser beam to form a trim cut 105. In the embodiment shown, for instance, an L-shaped trim cut 105 is formed.
It is known that the quality of trim cuts created during laser trimming can vary. For instance, the cutting quality of a linearly polarized laser beam may be adequate in one linear direction, but uncut strips may remain when trimming in another linear direction. Also, trimming at an inadequate laser intensity (i.e., a shortage of the laser beam energy) can cause defects to be created in the resistor. Defects can also be created due to improper focusing of the laser beam and/or due to a relatively small trimming window (i.e., a relatively small width of trimming energy over which a favorable cut can be achieved).
The resistor can be visually examined to detect defects; however, a visual examination may not reveal certain defects. In addition, the resistor can be electrically evaluated for detecting defects. However, an electrical evaluation may not reveal certain defects, especially if the trim cut is relatively long. This is because the electrical characteristics of the resistor are more likely to fall within acceptable ranges as the length of the trim cut increases.
More specifically, as shown in FIG. 11A, a thin film resistor 102 has been trimmed using a linearly polarized laser beam. The trim cut 105 includes a first trim cut 105a, which extends in the Y-direction, and a second trim cut 105b, which extends in the X-direction. As shown, the cutting ability of the linearly polarized laser beam is reduced when trimming in the X-direction as compared to trimming in the Y-direction. In other words, uncut parts remain in the second trim cut 105b, and the uncut parts could be detected with a visual examination. However, uncut parts in the first trim cut 105a, if any, are not obviously present, and such defects would be difficult to detect with a visual examination.
FIG. 11B also shows an example of trimming using a linearly polarized laser beam, in which the trim cut 105 is formed in the Y-direction only. In this case, uncut parts, if any, are not obviously present in the trim cut 105 because it extends in the Y-direction only. Thus, defects in the trim cut 105 of FIG. 11B would be difficult to detect with a visual examination.
FIG. 11C shows an example of trim cuts 105a, 105b disposed in an L-shape and formed using a circularly polarized laser beam. As shown, uncut parts, if any, are not obviously present in the trim cuts 105a, 105b because the circularly polarized laser beam was used. As such, any defects in the trim cuts 105a, 105b would be difficult to detect with a visual examination.

Manufacturing method for semiconductor device having a thin film resistor


A creping adhesive is described which provides the ability to readily control glass transition temperature (Tg) and adhesion and which can be easily removed from dryer surfaces. The creping adhesive contains a crosslinkable polymer and preferably an ionic crosslinking agent such as metal cations having a valence of three or more.

In the manufacture of tissue and towel products, a common step is the creping of the product. This creping is done to provide desired aesthetic and performance properties to the product. Many of the aesthetic properties of tissue and towel products rely more upon the perceptions of the consumer than on properties that can be measured quantitatively. Such things as softness, and perceived bulk are not easily quantified, but have significant impacts on consumer acceptance. Since many of the properties of tissue and towel products are controlled or are at least influenced by the creping process, it is of interest to develop methods for controlling the creping process. Although the creping process is not well understood, it is known that changes in the process can result in significant changes in the product properties. A need exists to provide a method for influencing the creping process by allowing the control of the adhesion of the tissue or towel substrate to the surface from which it is creped, most usually large cylindrical dryers known in the industry as Yankee dryers.
Obtaining and maintaining adhesion of tissue and towel products to Yankee dryers is an important factor in determining crepe quality. Inadequate adhesion results in poor or non-existing creping, whereas excessive adhesion may result in poor sheet quality and operational difficulties. Traditionally, creping adhesives alone or in combination with release agents have been applied either to the sheet or to the surface of the dryer in order to provide the appropriate adhesion to produce the desired crepe.
Various types of creping adhesives have been used to adhere fibrous webs to dryer surfaces such as Yankee dryers. Prior art creping adhesives rely upon combinations of self-crosslinkable soft polymers having a T.sub.g of less than 10.degree. C. with a non-film forming hard polymer emulsion having a T.sub.g greater than 50.degree. C. (U.S. Pat. No. 4,886,579) or thermoset resins (U.S. Pat. Nos. 4,528,316 and 4,501,640). The ability to control the mechanical properties of the polymers, as well as the adhesion and release of the fibrous web from the Yankee dryer, is limited when using these types of creping adhesives.


A method and system decrease the amount of undesired laser radiation reaching a workpiece from a laser having a laser cavity and a Q-switch. The laser operates at any given time in one of at least two modes. In a first mode the laser emits pulses at a PRF (pulse repetition frequency) for selectively irradiating targets on or within a workpiece, and the pulses propagate along a propagation path to the workpiece. In a second mode less or no laser radiation desirably reaches the workpiece. The method is operable during the second mode. The method opens the Q switch more than the Q switch is open in the first mode, thereby limiting the amount of energy that builds up in the laser cavity and decreasing the peak energy of the laser radiation emitted in the second mode.

During their fabrication process, ICs (integrated circuits) often incur defects due to minor imperfections in the process or in the semiconductor material. For that reason, ICs are usually designed to contain redundant circuit elements, such as spare rows and columns of memory cells in semiconductor memory devices, e.g., a DRAM (dynamic random access memory), an SRAM (static random access memory), or an embedded memory. Such devices are also designed to include particular laser-severable links between electrical contacts of the redundant circuit elements. Such links can be removed, for example, to disconnect a defective memory cell and to substitute a replacement redundant cell. Similar techniques are also used to sever links in order to program or configure logic products, such as gate arrays or ASICs (application-specific integrated circuits). After an IC has been fabricated, its circuit elements are tested for defects, and the locations of defects may be recorded in a data file or defect map. Combined with positional information regarding the layout of the IC and the location of its circuit elements, a laser-based link processing system can be employed to remove selected links so as to make the IC useful.
A typical link processing system adjusts the position of the laser beam spot on a semiconductor wafer by moving the wafer in an XY plane underneath a stationary optics table, which supports a laser and other optical hardware. The wafer is moved underneath in the XY plane by placing it on a chuck that is carried by a motion stage. A typical wafer contains a number of dies, each containing an IC. Circuit elements within an IC that are typically arranged in a regular geometric arrangement, as are the links between those elements. The links usually lie in regular rows in groups which are termed "link banks," having an approximately uniform center-to-center pitch spacing. To remove selected links in a link bank, a beam spot (i.e., the position at which the laser beam's propagation path axis intersects the wafer workpiece) continuously advances along the link bank at an approximately uniform speed while the laser emits pulses to selectively remove links. The laser is triggered to emit a pulse and thereby to sever a link at a selected target position when the laser beam spot is on the target position. As a result, some of the links are not irradiated and left as unprocessed links, while others are irradiated to become severed. The process of progressing down a row of links and severing selected links with a laser pulse is termed a "link run."
The laser in a typical link processing system is a Q-switched cavity laser that generates pulses at a pulse repetition frequency ("PRF"). When the Q switch is closed, energy builds up in the laser cavity. When the Q switch is opened, the built-up energy is released as a laser beam pulse. The process of opening and closing the laser's Q switch occurs repeatedly at a rate equal to the PRF.
Problems can arise if the Q switch is closed for an undesirably long period of time resulting in an undesirably large amount of energy accumulated in the laser cavity. The accumulated energy will eventually be released when the Q switch is opened. The resultant laser pulse can have greater energy than is desired to accomplish certain tasks and may damage the workpiece, components of the optics path, or the laser itself. Furthermore, leaving the Q switch closed for a period of time longer than occurs during nominal PRF operations may perturb the thermal equilibrium of the laser cavity or any wavelength-altering optic elements along the laser beam's propagation path. This may undesirably alter the laser pulse properties.

Method and system for preventing excessive energy build-up in a laser cavity


Replication-competent adenoviral vectors comprising an EBV-specific transcriptional regulatory element (TRE) operably linked to a gene required for adenovirus replication are provided. By providing for transcriptional initiating regulation dependent upon transcription factors that are only active in specific, limited cell types, virus replication can be restricted to particular target cells. The modified adenovirus may be used as a vehicle for introducing new genetic capability, particularly associated with cytotoxicity for treating neoplasia.

The Epstein-Barr virus (EBV) has been implicated in a number of human tumors, and is of interest in the development of anti-tumor therapies. EBV associated diseases often arise from a failure of the host immune response to control the proliferation of latently infected cells. During the persistent stage of EBV infection, the virus primarily infects long-lived memory B cells in the periphery. Latent EBV infection of B cells is associated with rapid tumor development in immunocompromised individuals, such as bone marrow transplant recipients and persons with AIDS.
Burkitt's lymphoma (BL) has likewise been linked to immunosuppression in AIDS, and to malarial infection in the case of endemic BL. All cases of Burkitt's lymphoma are also marked by the presence of specific chromosomal translocations, which result in the activation of the c-myc proto-oncogene. The majority of these involve a reciprocal translocation between chromosome 8 at or near the site of the c-myc locus, and the immunoglobulin heavy chain locus on chromosome 14. Other EBV associated tumors include Hodgkin's disease, certain unusual types of T cell lymphoma, and nasopharyngeal carcinoma.
EBV is a gamma herpesvirus of the Lymphocryptovirus (LCV) genus. The EBV genome is composed of linear double-stranded DNA, approximately 172 kilobase pairs (kb) in length. EBV has a series of 0.5 kb terminal direct repeats and internal repeat sequences that divide the genome into short and long, largely unique sequence domains. EBV was the first herpesvirus to have its genome completely cloned and sequenced. There are two major types of EBV isolate, called types 1 and 2, which appear to be identical over the bulk of the EBV genome but show allelic polymorphism in a subset of latent genes, including EBNA-LP.
EBV infects the majority of the World's adult population and following primary infection the individual remains a lifelong carrier of the virus. In underdeveloped countries, primary infection with EBV usually occurs during the first few years of life and is often asymptomatic. However, in developed populations, primary infection is more frequently delayed until adolescence or adulthood, in many cases producing the characteristic clinical features of infectious mononucleosis. EBV is orally transmitted, and infectious virus can be detected in oropharyngeal secretions from infectious mononucleosis patients, from immunosuppressed patients and at lower levels from healthy EBV seropositive individuals. Early in the course of primary infection, EBV infects B-lymphocytes. EBV does not usually replicate in B-lymphocytes but instead establishes a latent infection, which is characterized by the limited expression of a subset of virus genes.
Several viruses have recently come forth as both vehicles for gene therapy and as candidate anticancer agents. Among them adenovirus, a mildly pathogenic human virus that propagates prolifically in epithelial cells, the origin of many human cancers. Adenovirus has emerged as a virus that can be engineered with oncotropic properties. See, for example, U.S. Pat. Nos. 5,846,945; 5,801,029; 5,747,469; PCTUS1999/08592 (WO 99/59604;) or PCT/US1998/03514 (WO 98/35554;); PCT/US1997/22036 (WO 98/29555;). Replication competent adenovirus vectors have been designed to selectively replicate in tumor cells. Improving the delivery of these adenoviruses, both to local-regional and disseminated disease, as well as improving the virus to promote intratumoral spread are of particular interest.
Several experimental cancer therapies utilize various aspects of adenovirus or adenovirus vectors. See, for example, U.S. Pat. Nos. 5,846,945; 5,801,029; PCT/US99/08592; U.S. Pat. No. 5,747,469; PCT/US98/03514; and PCT/US97/22036.
Although replication competent adenoviruses are able to achieve selective targeting and amplification for the treatment of some types of cancer, there remains a need for improvement in both the adenovirus vectors themselves and methods for their use with respect to particular types of cancers. Preliminary results suggest that effective treatment strategies may require development of specific adenovirus vectors and/or methods particular to the type of cancer under treatment.
There is, therefore, substantial interest in development of viral vectors that enable the targeting of EBV-positive cells in vivo. The uniform presence of the EBV genome in certain tumors, versus its presence in only a very small number of normal B cells, suggests that novel therapies which include specific targeting and cytolysis of EBV-positive cells may be effective for treating such tumors.
Publications
Feng et al. (2002) J. Virol. 76:10951-10959 discuss the use of adenovirus vectors expressing EBV immediate early proteins to treat EBV-positive tumors. Abdulkarim and Bourhis (2001) Lancet Oncol. 2:622-630 suggest that the use of antisense oligodeoxynucleotides against Epstein-Barr virus and human papillomavirus oncoproteins to effect downregulation of the oncoproteins can influence tumor cell growth and restore sensitivity to cytotoxic agents. Another approach uses antiviral drugs such as acyclic nucleoside phosphonates, in combination with chemotherapy.
Grinstein et al. (2002) Cancer Res 62(17):4876-8 suggest the presence of EBV in a variety of carcinomas, including those of the breast, lung, colon, and prostate. A review of EBV in human disease may be found in Murray and Young (2002) Frontiers in Bioscience 7:519-540.

Cell-specific adenovirus vector comprising EBV-specific promoter


A method of securing an animal to a fixed object with a securing device via a lead line is disclosed, wherein the securing device includes a frame and a retaining member coupled to the frame and is mounted to the object. The method includes inserting a segment of the lead line through the frame, extending the segment of the lead line around the retaining member, and pulling the lead line to bring the lead line into contact with the retaining member to thereby frictionally interlace the lead line with the frame and the retaining member such that a panicked animal can pull a length of lead line through the securing device.

Users of saddle and pack animals, such as horses, donkeys, llamas, camels, etc., sometimes must leave an animal unattended outside of an enclosed environment. To prevent the animal from wandering away, the user may sometimes tie or otherwise secure the animal to a fixed object with a lead line or rope.
In places where saddle or pack animals are frequently left unattended, various devices to which the animals may be tied are sometimes provided. One common example of such a device is a hitching post. A hitching post typically includes a horizontal bar to which the animals may be tied, and one or more vertical supports that support the horizontal bar off of the ground. Another common device to which an animal may be tied is a tie ring. A tie ring includes a ring to which a lead line may be tied, and some mechanism (for example, an eyebolt) for securing the ring to a post or other fixed object.
While known securing devices are simple to use and construct, they also have various drawbacks. For example, if an animal tied to a hitching post or tie ring pulls on the lead line excessively, the knot securing the horse to the tie ring may pull tight, making it difficult to untie the animal. Also, it may be difficult for beginning riders to learn how to tie the animal to these devices.
Furthermore, securing an animal to a fixed object with a knot may present various dangers. For example, if an animal is frightened or startled, the animal may pull back against the knot. If the knot used to tie the animal does not have any give, the animal may feel trapped. This may cause the animal to panic and pull harder against the knot. If the animal continues to panic, it may injure itself, and also may present a danger to anybody that attempts to untie it. This may be an especially dangerous situation if the animal is tied into a transport trailer, due to the confined nature of such trailers.
The use of an ordinary tie ring aboard a transport trailer may also present a serious danger when an animal falls down inside of the trailer. If the knot used to tie the animal into the trailer has no give, the animal's head may be twisted into an unnatural position by the tension of the lead rope when the animal falls. This may cause serious injury to the animal, and may also prevent the animal from getting its head and/or body into a position from which it can right itself. Furthermore, this may cause the animal to panic, and thus to present a danger to itself and anyone who enters the trailer to try to help the animal.
Various solutions to these problems have been proposed. For example, one solution involves tying the animal to an elastic device, for example an automobile inner tube, that is fixed to an object such as a wall, a tree, etc. If a panicked animal pulls against the inner tube, the inner tube may stretch, which may prevent the animal from injuring itself. However, because the elastic member exerts a continuous force against the animal when the animal pulls against it, the animal may have the feeling that it is trapped, and may become panicked. Also, the continuous pull may cause the animal to tend to fight against the elastic member. This may tend to reinforce any pull back problems the animal may have.
Another known solution involves the use of a quick-release device that releases when an animal pulls against the device with enough force. While quick-release devices allow a panicked animal to free itself, the sudden nature of the release may cause the lead line to snap back toward the animal with enough force to injure the animal. Furthermore, the animal may fall down due to the sudden release of the lead line. Finally, the release of the lead line may leave the animal completely unsecured to any fixed object, and thus free to wander off.

This patent is subject to a terminal disclaimer.

Method for securing an animal to an object


A method for defect inspection of a transparent substrate comprises (a) providing an optical system for performing a diffraction process of object wave passing through a transparent substrate, (b) interfering and wavefront recording for the diffracted object wave and a reference wave to reconstruct the defect complex images (including amplitude and phase) of the transparent substrate, (c) characteristics analyzing, features classifying and sieving for the defect complex images of the transparent substrate, and (d) creating defect complex images database based-on the defect complex images for comparison and detection of the defect complex images of the transparent substrate.

Glass substrate is one of the most popular and widely components applied for all kinds of optoelectronic products, such as photoelectric display, intelligent mobile phone panel, micro lens and so on. There are a lot of requirements and applications of glass substrate in the field of optoelectronic industry. Especially, in manufacturing and assembling of photovoltaic products including photoelectric display (for example: liquid crystal display, plasma display panel, organic light emitting diode), digital camera, intelligent mobile phone panel, the glass substrate plays a very significant and key role. In addition, in bonding with silicon chip, microelectromechanical systems (MEMS), Bio-medical, micro mirror, micro glass-block, polarized beam splitter, and dichroic filter, all kinds of glass substrates are also used.
Furthermore, in the high-tech industries, such as the semiconductor manufacturing process, precision machinery and display devices, all of them are tendency to miniaturization, precision, and nanometer level. Therefore, in the development of measurement equipment, manufacturing technology, and integrated technology in the field of precision machinery, the defect detection technology of glass substrate is very important.
Please refer to China patent application No. CNI01241086, it discloses "a detecting apparatus based-on detecting bubble, impurity of glass substrate"; the other, China patent application No. CNI01750422, it discloses "an on-line automatic detection device of defects on glass"; and, China No. CNI02305798, it discloses "detection and classification method of defects on glass based-on machine vision". However, in the disclosure of the above-mentioned patent applications, method of detection and classification of defects on glass only performs edge detection for the image to obtain edge information of the defects. Such methods are not suitable for detection of micro bubble defects on glass, and the micro bubble detection system or device is still needed to be further improved for facilitating detection of the defects.
In addition, please refer to the R.O.C. Patent No. I512284 entitled "defect detection system for bubble on glass", which utilizes a diffused light irradiating to a piece of glass substrate to be detected, to obtain an illumination image of glass substrate, and utilizes binarization threshold for searching a bubble image in the region of interest, to achieve the purpose of improving test accuracy. However, this method utilizes extraction of intensity image information, combining with image processing and retrieval comparison of database, to determine the location of defects and type of glass substrate.
In practice, the most transparent glass substrate is still utilizing manual or semi mechanical operation mode to obtain reflection or penetrating pattern of glass substrate to identify the possible defects. Some methods are utilizing machine vision to use camera for shooting reflection or penetration pattern of the glass substrate, and further performing some defect image algorithms to complete the detection. However, through the machine vision camera, only the intensity image can be obtained, and the complex images information of the glass substrate can't be obtained completely. Furthermore, it is easy to lose focus or without focusing because the camera can't effectively focus on transparent substrate. Therefore, it is often necessary to carry out a complicated and time-consuming algorithm for multiple pre-signal processing and classification to proceed the following detection task. Thus, the existing machine vision can't provide quickly and effectively detect the transparent substrate and improve yield of detection due to the above complicated operations.
Defects detection items of micro optics include: surface defect detection, surface roughness, surface profile, film thickness and roughness, curvature radius, wavefront measurement, aberration analysis, refractive index distribution etc. At present, there are some defects detection technologies, such as metallographic microscope, confocal microscope, atomic force microscope and white light interferometer. According to the different defect types of detection techniques, the detection apparatus and structure need to be developed to meet the speed of the production line. However, in the wide-field optical imaging system of traditional defect detection, some problems exist, such as: poor image pixel resolution of sensor, that require the use of mechanical scanning and image stitching and other related technologies, to complete wide field reconstructed image with high resolution of a large area. This leads to time-consuming of defect detection process, so that only some samples can be extracted to shorten the detection time. In addition, the defect detection technology of traditional industrial products can't be applied to penetrating detection of transparent glass substrate. Therefore, how to effectively implement the detection of transparent substrate to improve resolution and field of view, and shorten the detecting time and improve the detection area, has become an important issue in the industry and field of detection. Therefore, how to improve the field of view and high resolution imaging mechanism to shorten the detection time and increase the number of detection has become an important issue in the current defect detection.
In view of a rapid evolution in nano and micron technology, the production of many industries has trend of miniaturization manufacture and applications. The integrated circuit and semiconductor components, and micro optic elements are essential components of the technology products. In recent years, the demand and use of smart phones and display panel products are the most significant influenced by the rapid spread of social media and Internet information. Therefore, in the face of rapid production demand, how to effectively improve the yield of process and product has become an important indicator of business operation cost.
The defects of the transparent substrate may lead to serious yield decline of the whole product process and assembly, and greatly increase the cost of production and waste of resources. Therefore, it is very important for defect detection of the transparent substrate in the manufacturing and assembling processes of the photoelectric products.
However, at present, there is no effective and reliable transparent substrate defect detection technology and method available for industrial applications. It is necessary to develop a novel optical detection technology to solve the above problems.

Method for defect inspection of transparent substrate by integrating interference and wavefront recording to reconstruct defect complex images information


A modular, top-loading, food transport cabinet and serving platform apparatus is disclosed in various embodiments. The food transport cabinet and serving platform is advantageous because it is alternatively configurable in both a transport condition (e.g., for transporting or delivering prepared food while maintaining a desired (hot or cold) temperature of the food) and a serving condition (e.g., presenting the prepared food for serving while maintaining a desired (hot or cold) temperature of the food). The apparatus can be configured to accommodate various food presentation and serving requirements and arrangements, including heating (e.g., chafing or direct heat) and chilling (e.g., ice) without having to remove the food items to be presented and served from the food transport cabinet to a special serving platform.

This section provides background information related to the present disclosure which is not necessarily prior art.
Insulated food carriers (also referred to as transport cabinets) are used by caterers, for example, to transport or deliver food to a venue while keeping the food hot or cold. Exemplary known top-loading transport cabinets 1, 2 are shown in FIGS. 1A and 1B. Typical top-loading food serving pan transport cabinets generally accommodate multiple food serving pans (e.g., steam-table pans or gastronorm pans), stacked on top of each other. The entire serving pan (e.g., including its rim) fits inside the carrier. At the venue, the caterer then typically sets up separate chafing equipment for presenting and serving the food. The serving pans and food have to be transferred to the chafing equipment, requiring time and labor.

Modular multi-function thermally-insulated top-loading food transport cabinet and serving platform


A cutting rack is presented which includes a base, a plurality of tines extending upwardly from the base for securing meat or other victuals thereto, and at least one suction cup or other member pivotally attached at one end of the base for holding the base to a supporting surface, thereby permitting the user to grasp the opposite end and pivot the base to obtain the most advantageous cutting position. The suction cup is preferably located within a relieved area at one end of the base which permits the underside of the base to lie flush with the supporting surface. Two suction cups may be located at opposite ends of the base, thereby permitting the base to be fixed in position when both are secured to the supporting surface, or only one may be placed in suction to allow pivoting of the base. A plurality of tines of different heights are press-fitted into the base to permit removal for cleaning and for holding odd-shaped meat items such as hams.

1. Field of the Invention
This invention concerns a cutting rack for holding meats or other victuals to be sliced which includes a base which may be pivoted to present the most advantageous cutting position. More particularly, it includes a cutting rack including suction cups or the like which may be attached to a supporting surface without penetrating the latter.
2. Description of the Prior Art
Cutting racks of the type discussed herein are designed to be placed on a countertop, table or other supporting surface and to enable the user to more securely hold a victual such as meat, produce, etc. thereon during slicing. At the same time, it is desirable for the user to keep his or her hands clear of the food to prevent injury when a knife slips.
To accomplish these ends, cutting racks have been devised with upwardly extending tines which penetrate the victual and thus secure it to the base. Typically, the tines are embedded in a wooden base which supports the victual and allows cutting without damage to the supporting surface or knife. A plurality of feet typically hold the cutting board at a desired elevation above the supporting surface.
Prior art cutting racks are shown generally by U.S. Pat. Nos. 943,767; 1,471,122; 2,031,307; 2,888,054; 2,942,639; 4,989,846; Des. 233,203 and Des. 314,892. While these racks are generally useful, certain advances would make these racks easier to use and store, while remaining of a simplified construction for use. Accordingly, there has developed a need for a cutting rack which is simple to construct and facilitates easy cutting by the user while remaining secure on a countertop or other supporting surface.


A two-sided, multi-sport scoring banner 30 consisting of a plurality of flexible scoring elements 44A, 44B, 44C, 44D sandwiched between a front face 32 and a back face 34. A set of scoring symbols 44A, 44B, 44C, 44D selectively positioned and uniformly spaced upon the scoring element to allow the score of a competitive event to be displayed through a plurality of windows 48, 50, 52, 54 formed into the front and back faces of the scoring banner. A plurality of utility storage pockets 90, a plurality of equipment storage loops 110 and a plurality of hooks 120 attached to the scoring banner to facilitate the organization of a variety of sport equipment items. A team insignia 74, a home and visitor title 76, 78 and a plurality of advertisement signs 130 printed on or attached to the scoring banner's two faces. In one embodiment a plurality of linear pockets 60, 62, 64, 66 are included within the scoring banner to facilitate the use and storage of a plurality of ground stakes or rods 58. The scoring banner, in all of its embodiments, having the means to be attached to a variety of structures, display a team's insignia, easily maintain the score of the sporting event as well as be rolled up and secured into a compact cylindrical configuration for storage and transport.

1. Field of Invention
This invention relates to scoring devices that are portable, self contained and capable of being used in a wide variety of sporting events and venues.
2. Background of the Invention
Team banners are a popular choice for youth and adult sporting teams providing a means to display their team insignia in any sporting venue. Banners are easily attached and displayed on a variety of surfaces while capable of being rolled up and easily stored in an equipment bag or car trunk.
In addition, every sports team relies on the ability to keep an up to date score. The ability to display this score is a critical part of the enjoyment of every participant involved in the sporting event, including players, coaches, parents and spectators. In many sporting events, particularly youth sporting events, scoreboard displays are not available for common viewing. The need for distant viewing displays requires large rigid structures requiring a high degree of complexity in assembly, storage, maintenance and transportability. These large, permanent and expensive scoreboards are often not a practical solution for many youth sport organizations. Therefore scores are often maintained with pencil and paper which can only be viewed by the individual scorekeeper. A participant is forced to keep his or her own score, either by using memory, using their own pencil and paper or most cases repeatedly asking the scorekeeper what the current score is. Therefore inventors have created several approaches to solving this problem by designing small portable scoring devices. They have, however, failed in developing a scoring device that meets the lightweight, flexible, compactable and storable benefits of a banner.
U.S. Pat. No. 4,045,788 to Castelli (1977) discloses an all purpose one-sided portable electronic scoreboard with a self contained carrying case of rigid material, however this scoreboard requires the use of an external power source forcing the playing field to provide a 120 V AC supply or a portable gasoline generator. The rigid self-contained carrying case limits the scoreboard's compact portability. U.S. Pat. No. 4,280,291 to Maynes (1981) discloses a two-sided portable scoreboard with a pair of overlapping disks sandwiched between a front and rear plate, however the rigidity of the disclosed front and back plates and disks prevents flexibility and compact portability. Maynes also requires a complex array of display attachments required for use in different venues, further restricting its compact portability. U.S. Pat. No. 5,615,636 to Gustafson (1997) discloses a portable scoreboard with an inverted-U-shaped mounting frame, incorporating a plurality of cards having indicia and arranged in at least three stacks with the cards having a front face and a back face. This scoreboard requires over eighty components in its basic design, a large U-shaped rigid frame plus a complexity of display attachments for alternative venues thus preventing flexible compact portability.
U.S. Pat. No. 6,041,934 to Alexson (2000) discloses a portable scoring apparatus comprising of a carrying case formed of two half sections joined together by a flexible connecting section however the scoring apparatus does not provide the benefits of a banner display of a team insignia in a size that could be easily viewable while remaining compact and portable. U.S. Pat. No. 4,831,956 to Thater (1989) discloses a one sided tennis scoring apparatus constructed of a durable fabric and designed so as to be foldable about itself into a small portable configuration however the apparatus is specifically designed and limited for use in the sport of tennis and therefore fails to support a variety of sports and venues.
In addition, inventors have also created several approaches to solving the problem of organizing sports equipment, specifically in baseball and softball dugouts. U.S. Pat. No. 5,337,907 to McKenzie and Ingle (1994) discloses a predetermined location holder for beverage containers and related articles, U.S. Pat. No. 6,053,340 to Cameron (2000) discloses a back supported sports equipment rack, and U.S. Pat. No. 6,029,830 to Manookian (2000) discloses a length adjusting sports equipment hanging belt, all of which are specific in claims and fail to incorporate a scoring capability in their disclosures.
In conclusion, insofar as I am aware, no scoreboard or scoring apparatus formerly developed provides a team banner which also serves as a two-sided, self contained scoring device capable of supporting a large variety of sporting events and venues. In addition, insofar as I am aware, no scoreboard or scoring apparatus developed provides a multi-sport scoring device capable of also organizing sports equipment.


Methods and devices for moving a media sheet along a media path from an input area to a toner transfer area. One method comprises initially determining that the media sheet is to be moved from the input area. After making the determination, the media path is detected to ensure it is capable of moving the media sheet. If the media path is available, the media sheet is picked and moved along the path. If the media path is not available, the media sheet remains in the input area until the path is available. When required to wait for the path, an amount of delay is determined. Once the path is available, the delayed media sheet is picked from the input area and then accelerated to compensate for the delay.

Media sheets for use in an image forming device are initially stored in an input area. The input area is sized to hold a predetermined number of media sheets. A pick mechanism is positioned adjacent to the input area to pick individual media sheets from the stack and deliver them into a media path. The pick mechanism should accurately deliver the media sheet to the media path in a timely manner.
The media sheet moves along the media path and receives a toner image at a transfer area. In one type of device, the toner image is applied directly to the media sheet. In another type of device, the toner image is initially placed on an intermediate member, and then transferred from the intermediate member to the media sheet.
Movement of the media sheet along the media path is important for good print quality. If the media sheet is delayed while being picked from the input area, the toner image may not be centered on the media sheet. Likewise, the toner image may not be centered if the media sheet is picked early from the input area. In either event, a non-centered toner image results in a print defect that may not be acceptable to the user.
The speed of the media sheet may be corrected as the media sheet moves along the media path. A lagging media sheet may be sped up, and a leading media sheet may be slowed down. However, changing the media sheet speed affects the inter-page gap. This may lead to a lower number of media sheets that can be formed within a given amount of time. A quality image forming device should deliver a high device output with minimal to no print defects.

Method and device for correcting pick timing in an image forming device


A method for maintaining the ability of a parent server process to communicate with one or more client processes is disclosed. In the method, a first child server process is configured to monitor for failure of the parent server process and to respond to failure of the parent server process by:    i) continuing any communication with the client processes that would have been performed by the parent server process had it not failed; and    ii) initiating a second child server process which is configured to monitor for failure of the first child server process and to respond to such a failure in the same manner as the first child server process responds to failure of the parent server process.

1. Field of the Invention
This invention relates to improvements in server processes, and specifically to a method for maintaining the ability of a parent server process to communicate with one or more client processes.
2. Description of the Related Art
The reliability of a server process in a client server computer system is critical. The server must ensure that each client request is serviced reliably with very little and preferably no loss of data. Server processes are usually monitored by a separate monitor process. Such monitor processes can detect when the associated server process has failed, for example by crashing. In response to this, the monitor will initiate a replacement server process to resume the functions previously performed by the failed server process.
This approach has the inherent disadvantage that each client has to detect the failure of the server process through its network connection and reconnect to the replacement server process.


To provide a banknote handling apparatus (1) capable of reducing a waiting time of a customer, as compared with a case in which a general banknote replenishing operation is performed when a banknote to be dispensed falls short in a dispensing process. The banknote handling apparatus (1) includes a memory unit (32) configured to record the stored-number of banknotes stored in the banknote handling apparatus (1) by denomination. Upon receipt of a command for dispensing a banknote(s) of one or more denominations, the number of dispensing being designated by denomination, the control unit (30) is configured to compare the designated-number with the stored-number recorded in the memory unit (32) corresponding to the denomination designated in the dispensing command, and to control the reception unit (11) and the transport unit (10) such that, if the stored-number is smaller than the designated-number, a banknote is fed out from the reception unit (11) and is recognized by the recognition unit (13), and that a banknote of a designated denomination is transported to the dispensing unit (12), in order that the number of banknotes of the designated denomination that have been transported to the dispensing unit matches the designated-number.

Various kinds of banknote handling apparatuses configured to handle a banknote have been conventionally known. Among such banknote handling apparatuses, there is known a banknote handling apparatus which includes: a reception unit configured to receive a banknote and to feed out the banknote, one by one; a transport unit configured to transport the banknote fed out from the reception unit in an inside of a housing; and a recognition unit disposed on the transport unit, the recognition unit being configured to recognize at least a denomination of the banknote transported by the transport unit. In addition, there is known a conventional banknote handling apparatus which includes: a storing and feeding unit connected to the transport unit, the storing and feeding unit configured to store a banknote which has been transported from the transport unit, and configured to feed out the stored banknote one by one; and a dispensing unit connected to the transport unit, the dispensing unit being configured to stack a banknote which have been transported from the transport unit, and to enable an operator (e.g., clerk) to take out the banknote.
Further, Patent Document 1 discloses a banknote handling apparatus which replenishes a deficit in general banknotes of a predetermined denomination, which are stored inside, with a new banknote of the predetermined denomination, and dispenses the general banknote(s) of the predetermined denomination and the new banknote(s) of the predetermined denomination, while a sum of the number of the general banknote(s) of the predetermined denomination and the number of the new banknote(s) of the predetermined denomination is designated.
Furthermore, Patent Document 2 discloses a substitute denomination dispensing method in which, while banknotes to be dispensed are being fed out, when a banknote to be dispensed falls short, substitute banknotes of a different denomination are dispensed.    Patent Document 1: JP2000-251123A    Patent Document 2: JP2003-346222A


A method and device for recognizing a waveform of an analog signal into a binary digital signal is developed. The method includes a) inputting the analog signal, b) determining voltage values of every peak and every valley of the analog signal respectively, c) determining a plurality of threshold voltages for the analog signal such that each the threshold voltage corresponds to mutually adjacent peak and valley and two adjacent respective the threshold voltages have a corresponding common one of the respective peak and the respective valley, and d) comparing each point of the waveform of the analog signal with the corresponding threshold voltage respectively for obtaining the digital signal. A real time device with a simple circuit is also available.

Optically sensing devices such as charge coupled device (CCD) are widely used in image readers. Referring to FIG. 1, an inputted image signal 11 is broadened by the optical sensing device 12, which will trouble the recognition of the waveform when converting the inputted analog data into a binary digital signal.
There are two conventional methods for converting an analog signal from an image reader to a binary digital signal. The first method is to take a second differentiation of the waveform of the analog signal to obtain the edge of the waveform. Because a differentiation to a waveform is analogic to a high-pass filter to an analog signal, which will be coupled with a lot of disturbance signals, and thus decrease the accuracy in reading image data.
Another method is to take a voltage value, normally a mean value of the maximum and the minimum voltage of the analog signal, as a threshold voltage. The point having a higher voltage value than the threshold voltage is considered to have a high level voltage in the binary digital signal, while the lower voltage value point is considered as a low level voltage. This method is invalid in a high resolution requiring job, thus an optical character recognition (OCR) process will fail without a high image quality.

Method and device for recognizing a waveform of an analog signal


A semiconductor device and a fabrication method of the semiconductor device, the semiconductor device including: a gate electrode, a source electrode, and a drain electrode which are placed on a first surface of a substrate, and have a plurality of fingers; a gate terminal electrode, a source terminal electrode, and the drain terminal electrode which governed and formed a plurality of fingers for every the gate electrode, the source electrode, and the drain electrode; an active area placed on an underneath part of the gate electrode, the source electrode, and the drain electrode, on the substrate between the gate electrode and source electrode, and on the substrate between the gate electrode and the drain electrode; a sealing layer which is placed on the active area, the gate electrode, the source electrode, and the drain electrode through a cavity part, and performs a hermetic seal of the active area, the gate electrode, the source electrode, and the drain electrode. Accordingly, the semiconductor element itself can have air-tightness, it is not necessary to cover the gate electrode surface with a damp-proof protective film, gate capacitance of the semiconductor element is reduced, and high frequency characteristics and gain of the semiconductor element improve.

1. Field of the Invention
The present invention relates to a semiconductor device and a fabrication method of the semiconductor device. In particular, the present invention is relates to a semiconductor device used for millimeter wave power amplifiers, such as GaN based FETs (field effect transistors) and GaAsFETs, and having air-tightness, and a fabrication method of the semiconductor device.
2. Description of the Related Art
A semiconductor device used with a high frequency band, for example, a microwave power amplifying device, is composed of circuit elements such as: active elements, such as a field effect transistor; passive elements, such as a resistor and a capacitor; and micro strip-lines for transmitting high frequency signals.
The above circuit elements are formed, for example, on a semi-insulating substrate. An electrode for grounding is formed in a backside of the semi-insulating substrate. And, when grounding the circuit element provided on the semi-insulating substrate, the electrode for grounding formed on the backside of the semi-insulating substrate is electrically connected with the circuit element through a VIA hole (via hole) which passes through the semi-insulating substrate, for example (for example, refer to Patent Document 1 and Patent Documents 2).
On the other hand, as a method of packaging holding air-tightness applicable in contrast with such the semiconductor device, "MICROSTRUCTURE, SEALING METHOD OF THE MICROSTRUCTURE, MICRO ELECTRIC MACHINE ELEMENT AND FABRICATION METHOD OF THE MICRO ELECTRIC MACHINE ELEMENT, AND ELECTRONIC APPARATUS" are disclosed (for example, refer to Patent Document 3). In the Patent Document 3, the aim is to providing a microstructure and a micro electric machine element which enabled to form an airtight structure easily by using a semiconductor process. An enclosure wall is formed on a substrate so that a body of the micro electric machine element may be surrounded, a top film is bonded to the upper surface of the enclosure wall, and the body of the micro electric machine element is sealed.
Moreover, as a method of packaging holding air-tightness, in an example of a thin film piezoelectric resonator, a filter, and a thin film piezoelectric resonator, "THIN FILM PIEZOELECTRIC RESONATOR, FILTER, AND FABRICATION METHOD OF THE THIN FILM PIEZOELECTRIC RESONATOR" is disclosed (for example, refer to Patent Document 4). In the Patent Document 4, the aim is to providing a thin film piezoelectric resonator which includes a sealing structure which can prevent a collapse of a cavity and can adjust resonance frequency with high precision. The thin film piezoelectric resonator includes: a substrate having a cavity on the surface; a lower electrode extended on the cavity from on a substrate; a piezoelectric film provided on the lower electrode; an upper part electrode which opposes with the lower electrode and is placed on the piezoelectric film, and also is extended on the substrate from on the piezoelectric film; and a sealing member which includes a resonance part inside specified in a region in which the lower electrode and the upper part electrode oppose, is provided on the substrate so that an opening which extends from the cavity may be located outside, and closes the resonance part.
FIG. 1 shows a configuration diagram of an overall schematic plane pattern of a semiconductor device according to a conventional example.
As shown in FIG. 1, the overall schematic plane pattern configuration of the semiconductor device according to the conventional example includes: a substrate 10; a gate electrode 24, a source electrode 26, and a drain electrode 22 which are placed on a first surface of the substrate 10 and have a plurality of fingers, respectively; gate terminal electrodes G1, G2, . . . , G4, source terminal electrodes S1, S2, . . . , S5 and drain terminal electrode D which are placed on the first surface of the substrate 10, governed and formed a plurality of fingers, respectively, every the gate electrode 24, the source electrode 26, and the drain electrode 22.
In a configuration example of FIG. 1, as for the size of each part, for example, cell width W1 is about 120 micrometers, W2 is about 80 micrometers, cell length W3 is about 100 micrometers, W4 is about 120 micrometers, and gate width is about 2.4 mm (=100 micrometer×6×4 cells) as a whole.
In the example of FIG. 1, in the source terminal electrodes S1, S2, . . . , S5, VIA holes are formed from a back side of the substrate 10, and a ground conductor is formed on the backside of the substrate 10. And, when grounding the circuit element, the circuit element provided on the substrate 10 and the ground conductor formed on the backside of the substrate 10 are electrically connected through the VIA holes SC1, SC2, . . . , SC5 which pass through the substrate 10.
In addition, the gate terminal electrodes G1, G2, . . . , G4 are connected to a surrounding semiconductor chip by a bonding wire etc., and the drain terminal electrode D is also connected to a surrounding semiconductor chip by a bonding wire etc.
FIG. 2A shows a package configuration of the semiconductor device according to the conventional example and is a schematic plane pattern configuration diagram, FIG. 2B shows a schematic section structure chart taken in the line I-I of FIG. 2A, and FIG. 2C shows a schematic section structure chart taken in the line II-II of FIG. 2A, respectively.
As shown, for example in FIG. 2, the package configuration of the semiconductor device according to the conventional example includes: a substrate; a field effect transistor 18 placed on the substrate; input/output matching circuits 17 placed at input/output sections of the field effect transistor 18, respectively; input/output strip-lines 15 connected to the input/output matching circuits 17, respectively; an enclosure wall 12 which includes the field effect transistor 18, the input/output matching circuits 17, and a part of the input/output strip-lines 15; and an upper surface package sealed part 16 placed on the enclosure wall 12 through an adhesive part 14.
In the semiconductor device according to the conventional example, the semiconductor element itself did not have air-tightness but the package which mounts a semiconductor element had air-tightness. Moreover, a high damp-proof dielectric film was deposited on the gate electrode of the semiconductor element.    Patent document 1:    Japanese Patent Application Laying-Open Publication No. H02-288409    Patent document 2:    Japanese Patent Application Laying-Open Publication No. 2001-28425    Patent document 3:    Japanese Patent Application Laying-Open Publication No. 2006-43847    Patent document 4:    Japanese Patent Application Laying-Open Publication No. 2007-36829
The airtight package applied to the semiconductor device of the conventional example is high-cost.
Moreover, the airtight package applied to the conventional semiconductor device had to bond a terminal with the enclosure wall in order to also give air-tightness to a terminal area, therefore had great influence on the high frequency characteristics of the terminal.
On the other hand, although there is also a method of applying resin on the gate electrode in order to give air-tightness to the semiconductor device itself, this method has a problem of increasing gate capacitance and reducing gain of the semiconductor device.

Semiconductor device having hermitically sealed active area and electrodes


A reception result of an analog signal transmitted from a local switch to a subscriber line, or a voltage difference corresponding to a line current is analyzed, and a transmission characteristic in the subscriber line is evaluated based on an analyzing result. The transmission characteristic is sent to a network by use of a function of an analog transmitting unit. Noises having power of a predetermined threshold value or more are detected from a data signal input to a digital transmitting unit, and a periodicity of the noises is examined, whereby influences of the cyclic noises are evaluated, and an examination result is sent to the network by use of the function of the analog transmitting unit. As a result, provided is an xDSL modem capable of automatically collecting various characteristics of the subscriber line connected thereto prior to a start of a provision of a broadband communication service.

1. Field of the Invention
The present invention relates to an x digital subscriber line (hereinafter referred to as an xDSL) modem which comprises a line characteristic estimating function for estimating characteristics of a telephone line connected thereto, when broadband communication services using an xDSL technology are provided.
The xDSL technology is capable of transmitting data of several mega bits per one second at a high speed by use of a metal wire such as an existing telephone wire, and hence the xDSL technology has lately attracted a considerable attention as a communication system in stead of an analog modem. The xDSL technology includes HDSL (high bit rate DSL) technology, SDSL (single line DSL) technology, RADSL (rate adaptive DSL) technology, VSDL (very high bit rate DSL) technology, and ADSL (asymmetric DSL) technology; and among these technologies, the ADSL technology is particularly attractive because its asymmetric transmission capacity is suitable for an Internet access and standardization of technical specifications is advanced. Popularization of a broadband communication service using the ADSL modem has been expected.
2. Description of the Related Art
FIG. 10 shows a constitution example of a communication system which provides broadband communication services by use of an ADSL technology.
Referring to FIG. 10, an ADSL modem 411 and a telephone set 412 installed in a subscriber's home are connected to a subscriber line through a splitter 413, respectively. The subscriber line is connected to a splitter 401 installed in a central office, and signals that have arrived at the central office through the subscriber line are divided by the splitter 401 into a signal of a frequency band used in a plain old telephone system (POTS) and a signal of a frequency band used in the xDSL technology. Analog signals for POTS are delivered to a local switch 402.
Furthermore, in the central office shown in FIG. 10, an ADSL modem 403 is installed by a provider providing broadband communication services by the ADSL (hereinafter simply referred to as broadband communication services). The ADSL modem 403 faces the ADSL modem on the subscriber side. The modulated-analog signal of the frequency band separated by the above-described splitter 401 is converted to a digital data signal by the ADSL modem 403, and thereafter is delivered to a router 404 (or an ATM switching system). Then, the digital signal data is delivered from the router 404 to a server of the provider through a predetermined data channel. Moreover, the digital data signal sent to a user from the server of the provider is delivered to the ADSL modem 403 from the router 404 through a reversed path in the data channel, and is converted to a modulated-analog signal by the ADSL modem 403. The modulated-analog signal is then sent out to the subscriber line through the splitter 401.
In the conventional broadband communication service, when a contract is made between a subscriber of a telephone system provided by NTT (Nippon Telegraph and Telephone company) and a provider providing a broadband communication service, a request for a construction is first issued to NTT from the provider. Subsequently, a work in which a connection of a subscriber line of a customer with the local switch 402 provided in the plain old telephone system (POTS) is changed to that with the ADSL modem 403 is performed in a central office by NTT. Thereafter, the provider sets up an ADSL modem exclusively used for the broadband communication services provided by the provider in a subscriber's home, and then performs a connection check of the ADSL modem.
As a result of this connection check, when it is proved that a good service quality is acquired in the subscriber line connected to the subscriber's home, the subscriber can accept the provision of the broadband communication service by use of the ADSL modem.
On the contrary, when it is proved that a predetermined service quality cannot be acquired in the subscriber line connected to the subscriber's home, on the subscriber line a worker sent from the provider performs an operation for measuring characteristics of the subscriber line in order to investigate causes leading to deterioration of the service quality.
Generally, as the principal cause which deteriorates the service quality in the ADSL modem, assigned are transmission loss in proportion to a line length of the subscriber line between the subscriber's home and the central office, and cyclic noises accompanied by provision of time compression multiplexing-ISDN services in Japan. Accordingly, by measuring the transmission loss and the existence of the cyclic noises on the subscriber line and an intensity of the cyclic noises, it is possible to assign the cause of the deterioration of the service quality. Depending on the assigned cause and a degree thereof, it can be decided whether or not the provision of the broadband communication services is possible, and a necessary countermeasure can be decided if the provision of the broadband communication services is possible.
When, based on the measurement results of the above-described line characteristics, it is decided that the provision of the broadband communication services is possible, a necessary countermeasure is taken, which is performed, for example, in such a manner that the provider makes a request to NTT for changing a connection of the subscriber line connected to the subscriber's home. After the service quality required for the services is secured, the provision of the broadband communication services is begun.
Contrary to this, the service quality cannot sometimes be expected to be improved even by changing the connection of the subscriber line. For example, in the case where the subscriber line to which the service is to be provided and a subscriber line which is producing a crosstalk causing the frequency noises are located very closely to each other, particularly the case where these subscriber lines constitute the same quad comes under the above-described situation.
In such a case, the provider consults with the customer, and decides whether to provide services with limited transmission capacity or to abandon the provision of the broadband communication service itself.
As a technology for achieving coexistence of ADSL and ISDN, for example, there have been one used by applying Annex. C to G. lite and G. dmt that are international standard specs by ITU-T. Concerning G. lite and G. dmt, Annex. C respectively prescribes a spec that adjusts a transmission rate by ADSL so as to synchronize with clocks of ISDN having 400 Hz. In Annex. C, two kinds of modes are prescribed. One is a DBM mode that makes the transmission rate low during the period when a near-end crosstalk power is large; and the other is a FBM mode that performs a transmission by using only the period when the near-end crosstalk power is small. In any case, since the transmission capacity during the period when the near-end crosstalk power is large is drastically restricted, a decrease in the transmission capacity as a whole is inevitable. However, interference by ISDN can be suppressed to the minimum.
As described above, in the conventional procedures in which the broadband communication service is set up, it is unclear whether or not the service quality in the subscriber line of the customer satisfies the required conditions for providing the broadband communication services, until the ADSL modem is installed in the customer's home and the connection check of the ADSL modem is performed. Moreover, even if the causes deteriorating the service quality are assigned by performing the work for measuring the line characteristics for the subscriber line, it is not always possible to remove the causes. Specifically, there is a possibility that the provider does not come to provide the service in spite of costs and man-hours spent until then.
Recently, a case is observed, in which the provider send the ADSL modem to the customer, and entrusts the work for setting up the ADSL modem and the work of the connection test for the ADSL modem, thus attempting to decrease man-hours concerning the set-up work. However, also in this case, when the predetermined level of service quality cannot be acquired by the subscriber line of the customer, as a matter of course, the provider must send the worker to allow the worker to measure the line characteristics. Accordingly, the provider pays considerable costs and performs the considerable number of the working steps.
As described above, in the conventional broadband communication services, since no countermeasure to previously obtain various characteristics of the subscriber line used for services to be contracted, a risk that the provider must bear for setting up the broadband communication service is very serious compared to an income earned by a service contract. This has been a large hindrance from the viewpoint of propagation of the broadband communication service using the xDSL technology.


A method is provided for distributing a recall notification to an automobile equipped with an in-vehicle communications system. The method comprises the steps of providing a telematics service center with identification information corresponding to the automobile, matching the identification information with the corresponding in-vehicle communications system, and wirelessly transmitting the recall notification to the in-vehicle communications system. A system for distributing a recall notification to a vehicle, and a vehicle equipped with an in-vehicle communications system are also provided to carry out the method.

The automobile industry is constantly developing systems and methods for encouraging and assisting automobile owners towards maintaining the automobile in good repair. For instance, some automobiles are equipped with warning lights or messages to remind the automobile owner of preventive maintenance schedules. Moreover, all automobiles are initially provided with gauges or warning devices that concern the state of at least the most essential engine components, fluids, and electrical sources to name a few.
In addition to providing technology encouraging wear-related repair and maintenance, automobile manufacturers will notify automobile owners of recall information. For instance, if post manufacturing tests or reports reveal common safety-related defects in a particular automobile model, the manufacturer will typically notify the owner of such defects and will provide information on where and how to replace the defective equipment. Manufacturers typically send such notifications to the last known owner using a mail carrier such as the U.S. Postal Service. However, since automobiles are frequently sold or otherwise exchanged after their initial sale, safety recall notifications are frequently sent to prior owners. Also, if an owner moves or travels for long periods of time, safety recall notifications may be received by the owner after the subject automobile equipment has already failed even if the notifications were mailed well in advance of the equipment failure. Furthermore, even if the owner receives the safety recall notification in advance of equipment failure, some owners disregard the notification or procrastinate taking the automobile in for repair before the subject equipment fails, often causing associated equipment failures that are even more costly to repair.
Accordingly, it is desirable to provide systems and associated methods for ensuring efficient safety recall notification delivery and responses. In addition, it is desirable to providing reliable methods for delivering such notifications. It is further desirable to provide technology that can prevent automobile equipment from failure during the time between safety recall notification and subsequent repair. Furthermore, other desirable features and characteristics of the present invention will become apparent from the subsequent detailed description and the appended claims, taken in conjunction with the accompanying drawings and the foregoing technical field and background.

Automobile recall notification system and method for using the same