The present invention relates to a thermosetting low dielectric resin composition, a laminate for use in printed wiring, a laminate for a circuit, and the like. The present invention""s thermosetting low dielectric resin composition contains a specific siloxane denatured polyimide, a compound having two or more allyl or methylallyl groups, and a compound having two or more maleimide groups. This resin composition adheres extremely well to metals with a low dielectric constant and low dielectric dissipation factor, and demonstrates very little scattering of the resin during operational processes like punching or cutting. By using laminates or laminates for circuits that employ this resin composition, electrical signals can be propagated more quickly, enabling signals to be processed at faster speeds. In addition, the present invention can be applied to the formation of miniaturized circuit wiring, and is suitably employed in electronic devices employed in the high frequency region, and, in particular, in electronic devices that must be made smaller and lighter in weight.

The present invention relates to a thermosetting low dielectric resin composition that adheres extremely well to metals with a low dielectric constant and low dielectric dissipation factor, and for which there is very little scattering of the resin during punching, cutting or other such operational processes. The present invention further relates to a laminate used in printed wiring, a laminate for a circuit, and the like.
This application is based on patent applications filed in Japan (Japanese Patent Application Nos. Hei 11-26710 and Hei 11-26711), the contents of which are incorporated herein by reference.
Signal speeds and operating frequencies for electronic systems have increased rapidly in recent years. As a result, printed wiring used in electronic systems employed in the high frequency regions have required prepregs and laminates that have excellent thermal resistance and superior adherence properties with a low dielectric constant and low dielectric dissipation factor. In particular, the propagation speed of the electric signal can be increased by employing a laminate consisting of a low dielectric material in the printed wiring. As a result, it has become possible to process signals at a faster speed.
Fluororesins and polyphenylene ether resins that have a small dielectric constant have been proposed as materials for this type of laminate.
However, the reliability of these types of resins is problematic as they have poor workability and adherence properties.
Epoxy denatured polyphenylene ether and polyphenylene ether denatured epoxy have been proposed with the goal of improving workability and adherence properties. However, due to their high dielectric constant, satisfactory properties have not been obtained from epoxy resins.
In addition, thermosetting resin compositions are known (see Japanese Patent Application, First Publication No. (A) Sho 57-185350) that are formed in a pre-reaction by compounding polyphenylene ether resin, multifunctional cyanate ester resin, and another resin, and then adding a radical polymerization initiator. Even in this case, however, the reduction in the dielectric constant is not sufficient.
Furthermore, while a thermosetting polybutadiene resin having as its main component 1,2-polybutadiene has a low dielectric constant, its adherence and thermal resistance properties are not sufficient.
As an example of a low dielectric resin, a composition is known (Japanese Patent Application, First Publication No. (A) Sho 61-83224) in which 5xcx9c20 parts by weight of 1,2-polybutadiene resin, 5xcx9c10 parts by weight of a bridging monomer, and a radical bridging agent are compounded to 100 parts by weight of a polyphenylene ether resin. However, when employing 1,2-polybutadiene resin having a molecular weight of several thousand, a stickiness remains once the solvent has been removed from the composition. The prepreg obtained by coating and impregnating the composition into fiberglass cannot maintain a tack-free state as a result, making practical application problematic. Moreover, while a method is available that employs high molecular weight 1,2-polybutadiene in order to eliminate the stickiness, solubility in the solvent is reduced. As a result, the solution becomes highly viscous and has poor flow characteristics, so that this too is problematic with respect to practical application.
A low dielectric laminate and copper-clad laminate have been proposed (see Japanese Patent Application (B2) No. 2578097) in which a thermosetting resin is impregnated in a cloth consisting of fluorocarbon fibers. In order to increase the adherence between the fluorocarbon fibers and the thermosetting resin, however, it is necessary to treat the surface of the fluorocarbon fibers. Moreover, fluorocarbon fibers are expensive, so that the final laminate and copper-clad laminate become extremely costly, making this approach impractical.
Multi-layer printed circuit boards that also have electric circuits on their inner layers are used in electronic devices and other equipment. These multi-layer printed circuit boards are obtained by placing an electrically insulating prepreg between an inner layer circuit board, on which circuitry has been formed in advance, and a copper foil, which is employed for the outer layer circuit. Thermocompression molding is then carried out to fabricate a copper-clad laminate that has circuits on its inner layers. Finally, specific circuits are formed to the outer layer of this copper-clad laminate to complete the multi-layer printed circuit board.
A prepreg consisting of epoxy resin and thin glass cloth having a thickness of 30xcx9c100 xcexcm has been conventionally employed for the prepreg used here.
However, in the case of this type of prepreg, the cloth weave is readily embossed, while the concavities and convexities of the inner layer circuit board cannot be easily absorbed within the prepreg. As a result, these irregularities readily appear on the surface of the outer layer, impairing the smoothness of the surface and hindering formation of micro wiring.
Accordingly, methods are available in which a resin film that does not contain glass cloth is used as a prepreg in place of the glass cloth epoxy resin prepreg, or in which copper foil attached to a resin base, which already contains a laminated resin base layer that adheres to one side of the copper foil that is used for the outer layer circuit, is employed for both the prepreg and the outer layer circuit.
However, in these types of substitute prepregs, various problems occur when conveying, cutting or laminating the resin film or copper foil attached to a resin base. Namely, resin cracking and deletion may occur; the insulating layer that is between layers may become extremely thin at areas where inner layer circuitry is present during thermocompression molding in the case where employing the prepreg as an insulating material for connecting between the layers in a multi-layer board; the insulation resistance between layers may fall; and shorts may occur. In order to avoid these problems, a resin capable of forming a film is employed for the resin used in this resin film and in the copper foil attached to a resin base.
Various resins with this type of film forming capability have been proposed, including thermoplastic polyimide adhesive film (U.S. Pat. No. 4,543,295), high molecular weight epoxy resin (Japanese Patent Application, First Publication (A) No. Hei 4-120135), acrylonitrile butadiene copolymer/phenol resin (Japanese Patent Application, First Publication (A) No. Hei 4-29393), phenol resin/butyral resin (Japanese Patent Application, First Publication (A) No. Hei 4-36366), and acrylonitrile butadiene copolymer/epoxy resin (Japanese Patent Application, First Publication (A) No. Hei 4-41581), among others.
However, these film-forming resins have poor dielectric constants and cannot process signals at faster speeds.
Furthermore, the low dielectric resin disclosed in the aforementioned Japanese Patent Application, First Publication (A) No. Sho 61-83224 is not reliable with respect to thermal resistance, workability, and adherence, and, moreover, has poor film forming capability. Accordingly, practical application of this resin has not been satisfactory.
The present invention was conceived to resolve the above-described problems, and has as its objective the provision of a thermosetting low dielectric resin composition for use in printed wiring that adheres extremely well to metals with a low dielectric constant and low dielectric dissipation factor, and for which there is very little scattering of the resin during operational processes. The present invention further relates to a prepreg, laminate, and a laminate for a circuit, that forms a resin film or metal foil attached to a resin base, that employs the aforementioned thermosetting low dielectric resin composition.
The present invention""s thermosetting low dielectric resin composition is characterized in the inclusion of a component (a), which is a siloxane denatured polyimide in which the structural unit expressed by the following formula (2a), the structural unit expressed by the following formula (2b), and the structural unit expressed by the following formula (2c) are arrayed; a component (b), which is a compound expressed by the following formula (b-1) or (b-2); and a component (c), which is a compound having two or more maleimide groups.
(Where Z indicates a direct coupling, or a xe2x80x94Oxe2x80x94, xe2x80x94SO2xe2x80x94, xe2x80x94COxe2x80x94, xe2x80x94C(CH3)2xe2x80x94, xe2x80x94C(CF3)2xe2x80x94, or xe2x80x94COOCH2CH2OCOxe2x80x94 bond; Ar1 indicates a bivalent group having an aromatic ring; Ar2 indicates a bivalent organic group having one or two hydroxyl groups or carboxyl groups; R indicates a 1xcx9c10 C alkylene or indicates xe2x80x94CH2OC6H4xe2x80x94 of which methylene group is bonded to Si; and n is an integer between 1xcx9c20.)
(Where R in the above formulas (b-1) and (b-2) indicates a hydrogen atom or a methyl group.).
The present invention""s prepreg is characterized in including the above-described thermosetting low dielectric resin composition and a fiber material.
The present invention""s laminate is characterized in that the multiple layers of the prepreg are laminated.
The present invention""s laminate for a circuit is characterized in including a resin base layer consisting of a thermosetting low dielectric resin composition and a peelable film or metal layer.
The present invention""s thermosetting low dielectric resin composition is superior with respect to its low dielectric constant, thermal resistance, and workability, and is capable of forming a film. Accordingly, the prepreg, laminate, and laminate for a circuit employing this resin composition demonstrate sufficient peel strength at room temperature, and are particularly suitably employed as the laminate material for printed circuit boards.
The present invention will now be explained in detail.
The present invention""s thermosetting low dielectric resin composition is formed of a siloxane denatured polyimide as component (a), a compound having two or more allyl or methylallyl groups as component (b), and a compound having two or more maleimide groups as component (c).
The structural units expressed by formulas (2a), (2b) and (2c) below are arrayed in the siloxane denatured polyimide employed in the present invention.
Here, Z indicates a direct coupling, or a xe2x80x94Oxe2x80x94, xe2x80x94SO2xe2x80x94, xe2x80x94COxe2x80x94, xe2x80x94C(CH3)2xe2x80x94, xe2x80x94C(CF3)2xe2x80x94, or xe2x80x94COOCH2CH2OCOxe2x80x94bond. Ar1 indicates a bivalent group having an aromatic ring. Ar2 indicates a bivalent organic group having one or two hydroxyl groups or carboxyl groups. R indicates a 1xcx9c10 C alkylene or indicates xe2x80x94CH2OC6H4xe2x80x94 of which methylene group is bonded to Si. n is an integer between 1xcx9c20.
The array of these various structural units may be regular or irregular.
Groups selected from the chemical group indicated by the following chemical formula are preferable for the Ar1 bivalent group having an aromatic ring. R1, R2, R3 and R4 may be the same or different, and may indicate hydrogen atom, or a 1xcx9c4 C alkyl or alkoxy group. However, all of the groups may not simultaneously be hydrogen atoms.
Specific examples may be cited as follows:
4,4xe2x80x2-diamino-3,3xe2x80x2, 5,5xe2x80x2-tetramethyldiphenylmethane, 4,4xe2x80x2-diamino-3,3xe2x80x2, 5,5xe2x80x2-tetraethyldiphenylmethane, 4,4xe2x80x2-diamino-3,3xe2x80x2, 5,5xe2x80x2-tetrapropyldiphenylmethane, 4,4xe2x80x2-diamino-3,3xe2x80x2,5,5xe2x80x2-tetraisopropyldiphenylmethane, 4,4xe2x80x2-diamino-3,3xe2x80x2,5,5xe2x80x2-tetrabutyldiphenylmethane, 4,4xe2x80x2-diamino-3,3xe2x80x2-diethyl-5,5xe2x80x2-dimethyldiphenylmethane, 4,4xe2x80x2-diamino-3,3xe2x80x2-dimethyldiphenylmethane, 4,4xe2x80x2-diamino-3,3xe2x80x2-diethyldiphenylmethane, 4,4xe2x80x2-diamino-3,3xe2x80x2,5,5xe2x80x2-tetramethoxydiphenylmethane, 4,4xe2x80x2-diamino-3,3xe2x80x2,5,5xe2x80x2-tetraethoxydiphenylmethane, 4,4xe2x80x2-diamino-3,3xe2x80x25,5xe2x80x2-tetrapropoxydiphenylmethane, 4,4xe2x80x2-diamino-3,3xe2x80x2, 5,5xe2x80x2-tetrabutoxydiphenylmethane, 4,4xe2x80x2-diamino-3,3xe2x80x2-dimethoxydiphenylmethane,
1,3-bis(3-aminophenoxy)benzene, 1,3-bis(4-aminophenoxy)benzene, 1,4-bis(3-aminophenoxy)benzene, 1,4-bis(4-aminophenoxy)benzene,
9,9-bis(3-aminophenyl)fluorene, 9,9-bis(4-aminophenyl)fluorene,
1,3-bis[1-(3-aminophenyl)-1-methylethyl]benzene, 1,3-bis[1-(4-aminophenyl)-1-methylethyl]benzene, 1,4-bis[1-(3-aminophenyl)-1-methylethyl]benzene, 1,4-bis[1-(4-aminophenyl)-1-methylethyl]benzene,
3,3xe2x80x2-bis(3-aminophenoxy)biphenyl, 3,3xe2x80x2-bis(4-aminophenoxy)biphenyl, 3,4xe2x80x2-bis(3-aminophenoxy)biphenyl, 3,4xe2x80x2-bis(4-aminophenoxy)biphenyl, 4,4xe2x80x2-bis(3-aminophenoxy)biphenyl, 4,4xe2x80x2-bis(4-aminophenoxy)biphenyl,
3,3xe2x80x2-bis(3-aminophenoxy)diphenylether, 3,3xe2x80x2-bis(4-aminophenoxy)diphenylether, 3,4xe2x80x2-bis(3-aminophenoxy)diphenylether, 3,4xe2x80x2-bis(4-aminophenoxy)diphenylether, 4,4xe2x80x2-bis(3-aminophenoxy)diphenylether, 4,4xe2x80x2-bis(4-aminophenoxy)diphenylether,
bis[4-(3-aminophenoxy)phenyl]sulfone, bis[4-(4-aminophenoxy)phenyl]sulfone,
2,2-bis[3-(3-aminophenoxy)phenyl]propane, 2,2-bis[3-(4-aminophenoxy)phenyl]propane, 2,2-bis[4-(3-aminophenoxy)phenyl]propane, 2,2-bis[4-(4-aminophenoxy)phenyl]propane, 2,2-bis[3-(3-aminophenoxy)phenyl]hexafluoropropane, 2,2-bis[3-(4-aminophenoxy)phenyl]hexafluoropropane, 2,2-bis-[4-(3-aminophenoxy)phenyl]hexafluoropropane, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, and the like.
A siloxane denatured polyimide in which the structural unit expressed by the following formula (3a), the structural unit expressed by the following formula (3b), and the structural unit expressed by the following formula (3c) are arrayed is even more preferably employed as the siloxane denatured polyimide of this component (a).
Arm in the above formula is a tetravalent aromatic group and indicates either a 3,3xe2x80x2, 4,4xe2x80x2-diphenylsulfone structure, 3,3xe2x80x2, 4,4xe2x80x2-biphenyl structure, or 2,3xe2x80x2,3,4xe2x80x2-biphenyl structure. Ar1 and Ar2 are identical to the Ar1 and Ar2 in formulas (2b) and (2c). Namely, Ar1 indicates a bivalent group having an aromatic ring and Ar2 indicates a bivalent organic group having one or two hydroxyl groups or carboxyl groups. R indicates a 1xcx9c10 C alkylene or indicates xe2x80x94CH2OC6H4xe2x80x94 of which methylene group is coupled to Si. n is an integer from 1xcx9c20.
The ratio between the structural unit expressed by formula (2a) and the total of the structure units expressed by formulas (2b) and (2c) is preferably in a molar ratio range of 5xcx9c60:95xcx9c40, and more preferably of 15xcx9c60:85xcx9c40, and even more preferably of 20xcx9c50:80xcx9c50. If the proportion of the structural unit expressed by formula (2a) is less than 5 molar %, the solubility of the solvent and the effect of reducing the dielectric constant are insufficient. On the other hand, if the proportion of the structural unit expressed by formula (2a) is greater than 60 molar %, then adherence is reduced.
The proportion of the structural unit expressed by formula (2b) and the structural unit expressed by formula (2c) is preferably in a molar ratio range of 1xcx9c99:99xcx9c1, and even more preferably of 5xcx9c95:95xcx9c5.
For the siloxane denatured polyimide of component (a), a weight average molecular weight of 5,000xcx9c500,000, a glass transition temperature (Tg) of 150xc2x0 C. or less, and a dielectric constant of 3.0 or less are preferred; a weight average molecular weight in the range of 5,000xcx9c300,000, a glass transition temperature of 140xc2x0 C. or less, and a dielectric constant of 3.0 or less are more preferred; and a weight average molecular weight in the range of 10,000xcx9c300,000, a glass transition temperature of 130xc2x0 C. or less, and a dielectric constant of 3.0 or less are still more preferable. When the weight average molecular weight of the siloxane denatured polyimide is less than 5,000, heat stability deteriorates and thermal resistance falls. On the other hand, when the weight average molecular weight is greater than 500,000, the melt viscosity increases, causing workability and adherence to become poor when employing as a resin composition. When the glass transition temperature exceeds 150xc2x0 C., the melting temperature increases. As a result, the working temperature increases and the adherence becomes poor. When the dielectric constant exceeds 3.0, it is difficult to reduce the dielectric constant of the resin composition, making application to miniaturizing the inner circuits more difficult.
The siloxane denatured polyimide employed in the present invention can be obtained using a regular method for producing polyimide. Namely, the present invention""s siloxane denatured polyimide can be produced from tetracarboxylic acid dianhydride and diamine or diisocyanate applied for each repeating structural unit.
Specifically, the present invention""s siloxane denatured polyimide can be produced by reacting a diamine compound having an aromatic diamine for Ar1 and a hydroxyl or carboxyl group for Ar2, and a siloxane compound expressed by the following chemical formula (5), with a tetracarboxylic dianhydride which is pyromellitic dianhydride, 3,3xe2x80x2,4,4xe2x80x2-diphenylsulfone tetracarboxylic dianhydride, 3,3xe2x80x2,4,4xe2x80x2-benzophenone tetracarboxylic dianhydride, 3,3xe2x80x2,4,4xe2x80x2-biphenyl tetracarboxylic dianhydride, 2,3xe2x80x2,3,4xe2x80x2-biphenyl tetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl)ether dianhydride, 4,4xe2x80x2-bis(3,4-dicarboxyphenoxy)diphenylsulfone dianhydride, ethylene glycol bis trimellitatic dianhydride, or 2,2-bis[4-(3,4-dicarboxyphenoxy)phenyl]propane dianhydride, or more preferably, is 3,3xe2x80x24,4xe2x80x2-diphenylsulfone tetracarboxylic dianhydride, 3,3xe2x80x2,4,4xe2x80x2-biphenyl tetracarboxylic dianhydride, or 2,3xe2x80x2, 3,4xe2x80x2-biphenyl tetracarboxylic dianhydride.
Here, R is a 1xcx9c12 C alkylene, and Q is a functional group such as an amino group or isocyanate group.
In the case where the functional group Q is an amino group in the siloxane compound expressed by formula (5) which is employed as a starting material to produce the polyimide, examples of diamines include bis(3-aminopropyl)tetramethyldisiloxane, bis(10-aminodecamethylene)tetramethyldisiloxane, dimethylsiloxane tetramer or octamer at an aminopropyl terminal, bis(3-aminophenoxymethyl)tetramethyldisiloxane and the like. These may also be used in combination.
In the case where the functional group Q is an isocyanate group in the compound expressed by formula (5), examples of isocyanates may be cited by substituting the term xe2x80x9cisocyanatexe2x80x9d for the term xe2x80x9caminoxe2x80x9d in the preceding list of diamines.
In the case where the functional group Q is an isocyanate group in the compound expressed by the preceding formula (5), diisocyanates may be readily produced by reacting the diamines cited above with carbonyl chloride according to the usual method.
Examples of diamine compounds having a hydroxyl group or carboxyl group include 2,5-dihydroxy-p-phenylenediamine, 3,3xe2x80x2-dihydroxy-4,4xe2x80x2-diaminodiphenyl ether, 4,3xe2x80x2-dihydroxy-3,4xe2x80x2-diaminodiphenyl ether, 3,3xe2x80x2-dihydroxy-4,4xe2x80x2-diaminobenzophenone, 3,3xe2x80x2-dihydroxy-4,4xe2x80x2-diaminodiphenyl methane, 3,3xe2x80x2-dihydroxy-4,4xe2x80x2-diaminodiphenyl sulfone, 4,4xe2x80x2-dihydroxy-3,3xe2x80x2-diaminodiphenyl sulfone, 2,2xe2x80x2-bis[3-hydroxy-4-(4-aminophenoxy)phenyl]propane, bis[3-hydroxy-4-(4-aminophenoxy)phenyl]methane, 3,3xe2x80x2-dicarboxy-4,4xe2x80x2-diaminodiphenyl ether, 4,3xe2x80x2-dicarboxy-3,4xe2x80x2-diaminodiphenyl ether, 3,3xe2x80x2-dicarboxy-4,4xe2x80x2-diaminobenzophenone, 3,3xe2x80x2-dicarboxy-4,4xe2x80x2-diaminodiphenylmethane, 3,3xe2x80x2-dicarboxy-4,4xe2x80x2-diaminodiphenylsulfone, 4,4xe2x80x2-dicarboxy-3,3xe2x80x2-diaminodiphenylsulfone, 3,3xe2x80x2-dicarboxybenzidine, 2,2xe2x80x2-bis[3-carboxy-4-(4-aminophenoxy)phenyl]propane, bis[3-carboxy-4-(4-aminophenoxy)phenyl]methane, and the like.
Examples of desirable structures for the Ar2 group include phenylene, diphenyl ether, benzophenone, diphenyl methane, diphenyl sulfone, bisphenoxyphenyl propane, bisphenoxyphenyl methane, benzidine, diphenylhexafluoropropane, diphenylbenzene, bisphenoxybenzene, diphenylsulfide, bisphenoxybiphenyl, and 1xcx9c12C alkylene structures.
These diamine compounds may be used in combinations of two or more.
An example of the production of the siloxane denatured polyimide employed in the present invention now follows.
When employing tetracarboxylic dianhydride and diamine as the starting materials, there is a method in which the tetracarboxylic dianhydride and the diamine are placed in an organic solvent and heated to 100xc2x0 C. or more, and preferably 180xc2x0 C. or more, in the presence of a catalyst (20 parts by weight or less of the reactant) such as tributylamine, triethylamine, or triphenyl phosphite as needed, to directly obtain the polyimide; a method in which tetracarboxylic dianhydride and diamine are reacted in an organic solvent at 100xc2x0 C. or less to obtain the polyamide precursor, polyamido acid, then a dehydrating catalyst (in a molar quantity that is 1xcx9c5 fold that of the tetracarboxylic dianhydride) such as p-toluenesulfonic acid is added as needed, and the polyimide is obtained by carrying out an imidizating reaction by heating; and a method in which this polyamido acid is subjected to chemical cyclization at a relatively low temperature (room temperaturexcx9c100xc2x0 C.) following the addition of a dehydrating and cyclizating agent, such as carbodiimide compounds like dicylcohexylcarbodiimide, and acid anhydrides like acetic anhydride, propionic anhydride, or benzoic anhydride, and, as necessary, a cyclizating catalyst such as pyridine, isoquinoline, imidazole, or triethylamine (dehydrating and cyclizating catalysts and cyclizating catalysts are used in a molar amount that is 2xcx9c10 fold that of the tetracarboxylic dianhydride).
Examples of the organic solvent employed in the preceding reaction include such aprotic polar solvents as N-methyl-2-pyrrolidone, N,N-dimethylacetoamide, N,N-dimethylformamide, dimethyl sulfoxide, sulfolane, hexamethylphosphoric triamide, 1,3-dimethyl-2-imidazolidone, and the like, and phenol solvents such as phenol, cresol, xylenol, p-chlorophenol, and the like. It is also acceptable to mix into the aforementioned solvent as necessary such compounds as benzene, toluene, xylene, methylethylketone, acetone, tetrahydrofuran, dioxane, monoglyme, diglyme, methylcellosolve, cellosolve acetate, methanol, ethanol, isopropanol, methylene chloride, chloroform, trichloroethylene, nitrobenzene and the like.
In the case where tetracarboxylic dianhydride and diisocyanate are used as the starting materials, it is possible to apply the method described above for directly obtaining the polyimide. The reaction temperature in this case is room temperature or higher, and specifically is 60xc2x0 C. or higher. By carrying out the reaction between tetracarboxylic dianhydride and the diamine or diisocyanate in equal molar quantities, it is possible to obtain a polyimide with a high degree of polymerization. However, it is also possible to produce the polyimide by using any one of the preceding in an excess amount but within the limits of 10 molar % or less as necessary.
By including this specific siloxane denatured polyimide in the present invention, the flexibility of the molded article comprised of this resin composition is improved, scattering of the resin during such operations as punching or cutting is extremely reduced, and the handling and yield when making a printed circuit board are improved. In addition, because the polyimide is denatured in siloxane, solubility in the solvent is improved. Further, low dielectric properties result, such that a dielectric constant of 3.0 or less is readily possible.
From the perspective of the cured resin composition""s thermal resistance and dielectric constant properties, compounds expressed by the following formulas (b-1) and (b-2) are particularly desirable for employment as the compound having two or more allyl or methylallyl groups. These compounds are typically commercially available and can be easily obtained.
(Where R is a hydrogen atom or a methyl group.) It is particularly desirable that R in formula (b-1) represent a methyl group.
Any compound may be employed for the compound having two or more maleimide groups. From the perspective of electrical reliability, solvent solubility and the like, however, the compounds expressed by the following formulas (c-1) through (c-5) are particularly desirable. These compounds are typically commercially available and can be readily acquired. They can also be synthesized by a known conventional method.
(Where p in formula (c-4) indicates an integer from 1xcx9c8.)
The compounding ratio of the preceding components (a)xcx9c(c) in the present invention""s thermosetting low dielectric resin composition is such that the total of components (b) and (c) is in the range of 10xcx9c900 parts by weight with respect to 100 parts by weight of component (a). However, a range of 50xcx9c900 parts by weight is preferred, while a range of 100xcx9c900 parts by weight is even more preferred. When the total of components (b) and (c) is less than 10 parts by weight, the cured resin composition experiences a marked reduction in thermal resistance, and in its glass transition temperature (Tg) and Young""s modulus in particular. As a result, the resin composition cannot be employed for the intended applications. On the other hand, when the total of components (b) and (c) exceeds 900 parts by weight, the resin composition becomes brittle and leads to scattering when the resin has been semi-cured.
With regard to the compounding ratio of component (b) and component (c), it is desirable that the methylallyl groups in component (b) be in the range of 0.1xcx9c2.0 molar weight equivalents with respect to 1 molar weight equivalent of the maleimide groups in component (c), with a range of 0.3xcx9c1.8 molar weight equivalents being preferred, and a range of 0.5xcx9c1.5 molar weight equivalents being even more preferred. When the weight equivalent of the allyl group or methylallyl group becomes less than 0.1 molar weight equivalents, the resin composition has poor electrical reliability following curing. On the other hand, when the weight equivalent of the allyl group or methylallyl group exceeds 2.0 molar weight equivalents, gelling occurs during mixing, so that an adhesive agent cannot be formulated.
The mixing of component (a), component (b) and component (c) may be performed in a solvent that will dissolve these components. Examples of such a solvent include N-methyl-2-pyrrolidone, N,N-dimethyl acetoamide, N,N-dimethyl formamide, dimethyl sulfoxide, sulfolane, hexamethylphosphoric triamide, 1,3-dimethyl-2-imidazolidone, hexane, benzene, toluene, xylene, methylethylketone, acetone, diethylether, tetrahydrofuran, dioxane, 1,2-dimethoxymethane, diethyleneglycol dimethylether, methyl cellosolve, cellosolve acetate, methanol, ethanol, propanol, isopropanol, methyl acetate, ethyl acetate, acetonitrile, methylene chloride, chloroform, carbon tetrachloride, chlorobenzene, dichlorobenzene, dichloroethane, trichloroethane, and the like. The type and quantity of the solvent may be suitably selected from among these so that each component dissolves.
As needed, reaction accelerators for promoting the reaction during drying or heat curing may be added to the thermosetting low dielectric resin composition, examples including diazabicyclo-octane; such organic peroxides as methylethylketone peroxide, cyclohexane peroxide, 3,3,5-trimethylcyclohexanone peroxide, methylcyclohexanone peroxide, methyl acetoacetate peroxide, acetylacetone peroxide, 1,1-bis(t-butyl peroxy)-3,3,5 trimethylhexane, 1,1-bis(t-butyl peroxy)-cyclohexane, 2,2-bis(t-butyl peroxy)octane, n-butyl-4,4-bis(t-butyl peroxy)valerate, 2,2-bis(t-butyl peroxy)butane, t-butyl hydroperoxide, cumene hydroperoxide, diisopropylbenzene hydroperoxide, p-menthane hydroperoxide, 2,5-dimethylhexane-2,5-dihydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide, di-t-butylperoxide, t-butylcumyl peroxide, dicumyl peroxide, xcex1,xcex1xe2x80x2-bis(t-butylperoxy-m-isopropyl)benzene, 2,5-dimethyl-2,5-di(t-butylperoxy)hexane, 2,5-dimethyl-2,5-di(t-butylperoxy)hexyne, acetyl peroxide, isobutyl peroxide, octanoyl peroxide, decanoyl peroxide, benzoyl peroxide, lauroyl peroxide, 3,5,5-trimethylhexanoyl peroxide, succinic acid peroxide, 2,4-dichlorobenzoyl peroxide, m-toluoyl peroxide, di-isopropyl peroxydicarbonate, di-2-ethylhexylperoxydicarbonate, di-n-propylperoxydicarbonate, bis-(4-t-butylcyclohexyl)peroxydicarbonate, di-myristylperoxydicarbonate, di-2-ethoxyethyl peroxydicarbonate, di-methoxyisopropylperoxydicarbonate, di(3-methyl-3-methoxybutyl)peroxydicarbonate, di-allylperoxydicarbonate, t-butylperoxyacetate, t-butylperoxyisobutyrate, t-butylperoxypivalate, t-butylperoxyneodecanate, cumyl peroxyneodecanate, t-butylperoxy-2-ethylhexanate, t-butylperoxy-3,5,5-trimethylhexanate, t-butylperoxylaurate, t-butylperoxybenzoate, di-t-butylperoxyisophthalate, 2,5-dimethyl-2,5-di(benzoyl peroxy)hexane, t-butylperoxymaleic acid, t-butylperoxyisopropyl carbonate, cumyl peroxyoctate, t-hexylperoxyneodecanate, t-hexylperoxypivalate, t-butylperoxyneohexanate, acetyl cyclohexylsulfonyl peroxide, and t-butylperoxyallylcarbonate; imidazoles such as 1,2-dimethylimidazole, 1-methyl-2-ethylimidazole, 2-methylimidazole, 2-ethyl-4-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-phenylimidazole,. 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 1-benzyl-2-phenylimidazole trimellitate, 1-benzyl-2-ethylimidazole, 1-benzyl-2-ethyl-5-methylimidazole, 2-ethylimidazole, 2-isopropylimidazole, 2-phenyl-4-benzylimidazole, 1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-isopropylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-methylimidazolium trimellitate, 1-cyanoethyl-2-phenylimidazolium trimellitate, 2,4-diamino-6-[2xe2x80x2-methylimidazolyl-(1xe2x80x2)]-ethyl-s-triazine, 2,4-diamino-6-[2xe2x80x2-ethyl-4-methylimidazolyl-(1xe2x80x2)]-ethyl-s-triazine, 2,4-diamino-6-[2xe2x80x2-undecylimidazolyl-(1xe2x80x2)]-ethyl-s-triazine, 2-methylimidazolium isocyanurate adduct, 2-phenylimidazolium isocyanurate adduct, 2,4-diamino-6-[2xe2x80x2-methylimidazoyl-(1xe2x80x2)]-ethyl-s-triazine-isocyanurate adduct, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-benzyl-5-hydroxymethylimidazole, 4,4xe2x80x2-methylene-bis-(2-ethyl-5-methylimidazole), 1-aminoethyl-2-methylimidazole, 1-cyanoethyl-2-phenyl-4,5-di(cyanoethyoxymethyl)imidazole, 1-dodecyl-2-methyl-3-benzylimidazolium chloride, 2-methylimidazole benzotriazole adduct, 1-aminoethyl-2-ethylimidazole, 1-(cyanoethylaminoethyl)-2-methylimidazole, N,Nxe2x80x2-[2-methyimidazolyl-(1)-ethyl]-adipoyldiamide, N,Nxe2x80x2-bis-(2-methylimidazoyl-1-ethyl)urea, N-(2-methyimidazoyl-1-ethyl)urea, N,Nxe2x80x2-[2-methylimidazoyl-(1)-ethyl]dodecane dioyl diamide, N,Nxe2x80x2-[2-methylimidazoyl-(1)-ethyl]eicosane dioyl diamide, 1-benzyl-2-phenylimidazole hydrochloride; and triphenylphosphine.
It is also acceptable to add a silane coupling agent to the thermosetting low dielectric resin composition.
Furthermore, it is preferable to include filler having a particle diameter of 1 xcexcm or less in the thermosetting low dielectric resin composition for the purpose of stabilizing the flow properties of the composition. The amount of filler included is in the range of 5xcx9c70 wt %, preferably 10xcx9c60 wt %, and even more preferably 20xcx9c50 wt %, as a solid component. When the amount of filler included is less than 5 wt %, the effect of stabilizing the flow properties is reduced, while when the amount of filler included exceeds 70 wt %, the adhesive strength of the laminate falls and the dielectric constant increases. Examples of suitable fillers include silica, quartz powder, alumina, calcium carbonate, magnesium oxide, diamond powder, mica, fluororesin, zircon powder and the like.
The present invention""s prepreg includes the above-described resin composition and a fiber material. This prepreg can be fabricated by forming a varnish by dissolving the present invention""s thermosetting low dielectric resin composition in the aforementioned organic solvent, coating this varnish onto the fiber material to impregnate it, and then drying. It is preferable that the amount of resin composition following drying is such that it fills the spaces in the fiber material. In addition, the resin composition can also be semi-cured to form a film, and then pressed together with the fiber material in a thermal press to form the prepreg.
A thermal resistant fiber is preferably employed as the fiber material, with specific examples including carbon fiber, glass fiber, aramid fiber, aromatic polyester fiber, boron fiber, silica fiber, tetrafluorocarbon fiber, and the like. These fibers may be used alone or in combinations of two or more, with aramid fiber, aromatic polyester fiber and tetrafluorocarbon fiber being particularly desirable. The fibers may be long or short, and may be used in the form of a woven or unwoven cloth.
The thickness of this type of woven or unwoven cloth is preferably 0.05xcx9c1 mm, more preferably 0.1xcx9c0.5 mm, and even more preferably 0.1xcx9c0.2 mm. If the woven or unwoven cloth is too thin, then the cloth is not sufficiently strong, while if the woven or unwoven cloth is too thick, it becomes difficult to coat and impregnate the cloth with the resin composition varnish.
The present invention""s laminate can be obtained by laminating two or more of these prepregs.
The surface of the prepreg or laminate may be made smooth by using a thermal laminator or calender.
A metal-clad laminate can be fabricated by forming a metal layer consisting of metallic foil or the like to one or both surfaces of the laminate. A metal foil having a thickness of 5 xcexcmxcx9c200 xcexcm and consisting of copper, cupronickel, silver, iron, 42 alloy, stainless steel, or the like, is suitable as the metal layer used.
In order to fabricate a metal-clad laminate in which metal foil is laminated in a unitary manner to one or both surfaces of a laminate in which a fiber material is filled with the aforementioned thermosetting low dielectric resin composition in the semi-cured form, a press machine, vacuum press, thermal laminator or the like may be employed to laminate the metal foil to one or both sides of the laminate filled with the semi-cured resin composition.
In order to fabricate a metal-clad laminate in which metal foil is laminated in a unitary manner to one or both surfaces of a laminate in which a fiber material is filled with the aforementioned thermosetting low dielectric resin composition in the cured form, metal foil and a laminate, in which the fiber material is filled with semi-cured thermosetting low dielectric resin composition, can be thermally pressed to form a laminated unitary structure.
Note that a peelable protective film may be provided to the surface of these laminates, suitable examples of this protective film including polypropylene film, fluororesin film, polyethylene film, polyethylene terephthalate film, and paper, as well as materials which have been made peelable through the addition of a silicon resin or the like.
It is preferred that these peelable films have a 90xc2x0 peel strength that is in the range of 0.01xcx9c10.0 g/cm. When the peel strength is less than 0.01 g/cm, then-the peelable film readily peels off the laminate and either side of the metal-clad laminate during conveyance. When the peel strength is greater than 10.0 g/cm, then it is not possible to cleanly remove the peelable film from the laminate and either side of the metal-clad laminate, so that operability is impaired.
The dielectric constant of the resin composition following curing of the thus-obtained low dielectric thermosetting resin composition, laminate, etc. is preferably 3.2 or less, and even more preferably 3.0 or less. If the dielectric constant is 3.2 or less, then the resin composition can be suitably applied to miniaturization of the inner circuit.
The metal layer of the above-described metal-clad laminate may be subjected to the usual treatments, such as etching, to produce various types of specific print circuit boards.
The present invention""s laminate for a circuit requires a resin base layer consisting of the above-described thermosetting low dielectric resin composition.
A resin film or metal foil attached to a resin base, which are one arrangement for the present invention""s laminate for a circuit, have a resin base layer and a peelable film or metal layer.
In a resin film having a resin base layer and a peelable film, the peelable film, which functions as a temporary supporting member, protects the resin base layer during distribution and the like, and is removed at the time of use. Suitable examples of this peelable film include polypropylene film, fluororesin film, polyethylene film, polyethylene terephthalate film, and paper, as well as materials which have been made peelable through the addition of a silicon resin or the like. The thickness of the peelable film is preferably 1xcx9c200 xcexcm, and more preferably, 10xcx9c100 xcexcm. It is desirable that these peelable films have a 90xc2x0 peel strength that is in the range of 0.01xcx9c7.0 g/cm. A peel strength of less than 0.01 g/cm is problematic as the peelable film readily peels off during conveyance. On the other hand, when the peel strength is greater than 7.0 g/cm, then it is not possible to cleanly remove the peelable film from the resin base layer, so that operability is impaired.
The resin film may have other layers in addition to the resin base layer and the peelable film. In this case, the other layer may be interposed between the resin base layer and the peelable film. A layer consisting of an adhesive agent of a different composition is suitable as an example of this type of other layer. However, it is desirable to directly for the peelable film onto the resin base layer, so that the resin base layer and the peelable film are next to one another, as a circuit laminate having a lower dielectric constant results.
The metal layer in the metal foil which is attached to a resin base that has a resin base layer and a metal layer has a thickness in the range of 5xcx9c300 xcexcm, preferably 200 xcexcm or less, and more preferably 100 xcexcm or less. It is especially desirable to employ a foil such as copper, cupronickel, silver, iron, 42 alloy, or stainless steel that has a thickness of 36 xcexcm or less. If this metal layer is too thick, it becomes difficult to form miniature circuit lines. Accordingly, a thickness of 300 xcexcm or less is desirable.
Note that in the case of a metal foil attached to a resin base, in which a resin base layer is formed by coating the above-described thermosetting low dielectric resin composition to one or both surfaces of a metal layer, it is acceptable to provide a peelable protective film on top of the resin base layer. The same material as employed for the peelable film described above may be used for this protective film.
For the resin film and the metal foil attached to a resin base, the aforementioned thermosetting low dielectric resin composition may be coated to one side of the peelable film or to one or both sides of the metal layer, and then dried. In this case, the coating thickness is preferably in the range of 5xcx9c100 xcexcm, and more preferably 10xcx9c70 xcexcm. When the coating thickness is less than 5 xcexcm, the insulation along the Z axis of the circuit (i.e., between circuits) is not sufficient, while when the thickness exceeds 100 xcexcm, it is not possible to miniaturize the inner circuits.
The resin base layer in these laminates for a circuit has a cured dielectric constant that is preferably 3.2 or less, and more preferably 3.0 or less. By providing a dielectric constant that is 3.2 or less, it is possible to adequately apply the laminate to the miniaturization of the inner circuits.
The peelable film is removed, and this resin film is interposed between the metal foil employed for the outer layer circuit, and the inner layer circuit board to which a circuit has already been formed. This arrangement is then subjected to thermocompression molding to fabricate a multi-layer metal-clad laminate with inner layer circuitry. A multi-layer print circuit board can be formed by performing a step, such as etching, to the outer layer to form a specific conventionally known circuit. The metal foil attached to a resin base can be employed to form a multi-layer print circuit board by adhering it to an inner layer circuit board on which a circuit is formed, and then carrying out a step in the same manner as above to the metal layer to form a specific circuit.
In these multi-layer print circuit boards, embossing of the cloth weave does not occur and the irregularities in the inner layer circuit board are absorbed. Irregularities do not appear in the outer layer surface, and there is a high degree of surface smoothness. As a result, these multi-layer print circuit boards can be applied to forming miniaturized circuitry.
Moreover, because the resin base layer can form a film, cracking and deletion of the resin during steps such as conveying, cutting or laminating are reduced, while such problems are avoided as thinning of the intralayer insulating layer in areas where the inner layer circuit is present during thermocompression molding when the resin base is employed as an insulating material for connecting the layers in a multi-layer board. Moreover, shorts and a reduction in the insulating resistance between layers can be avoided. This design offers excellent thermal resistance, superior adherence to metals with a low dielectric constant and low dielectric dissipation factor, and very little scattering of the resin during processing operations. Further, a thinner circuit board can be achieved and a faster propagation speed for the electric signal is obtained, so that it becomes possible to process the signal more quickly.

Thermoplastic resin composition having low permittivity, prepreg, laminated plate and laminated material for circuit using the same


To provide a position detection apparatus with an expanded range of good linearity in a magnetic sensor's output characteristic with respect to position of a movable body as well as to provide a vehicle mirror angle detection apparatus using the position detection apparatus. Two permanent magnets 42 and 44 and one Hall-effect sensor 46 are used. The permanent magnets 42 and 44 are arranged with their relative position fixed. The Hall-effect sensor 46 is placed laterally to the arrangement of the two permanent magnets 42 and 44. The permanent magnets 42 and 44 and Hall-effect sensor 46 move relative to each other in a direction parallel to the arranging direction of the permanent magnets 42 and 44. Those surfaces 42a and 44a of the permanent magnets 42 and 44 which face the Hall-effect sensor 46 constitute magnetic pole faces of opposite polarity and the magnetic pole faces 42a and 44a are placed with an inward tilt. A magnetic sensing direction F of the Hall-effect sensor 46 is set orthogonally to the arranging direction of the permanent magnets 42 and 44.

1. Field of the Invention
The present invention relates to an apparatus which detects position of a movable body using a magnetic sensor. The apparatus expands a range in which good linearity is obtained. Also, the present invention relates to a vehicle mirror angle detection apparatus using the position detection apparatus.
2. Description of the Related Art
A vehicle mirror angle detection apparatus is incorporated in a so-called remote-control door mirror which allow up-and-down and left-to-right tilt angles of its mirror surface to be adjusted using a motor. The apparatus detects absolute angular position and angular displacement of the mirror surface in up-and-down and left-to-right directions with respect to a predetermined reference angular position. The mirror angle detection apparatus detects a mirror angle adjusted, for example, by the driver and stores it in memory. Subsequently, after the mirror angle is changed, the apparatus is used to automatically return the mirror to its original angular position by reading a setting value out of the memory at the touch of a button. The vehicle mirror angle detection apparatus is also used to detect displacement of a mirror angle in a so-called reverse-shift-activated mirror angle control which allows a driver to visually check areas around rear wheels during backing-up (e.g., when backing into a parking space) by turning a mirror surface of a vehicle outer mirror downward by a predetermined amount simultaneously as gear-shifting means of a vehicle is set to a reverse position and restores the mirror face to the original mirror angular position by turning the mirror surface upward by a predetermined amount simultaneously as the gear-shifting means is subsequently switched to another operating position from the reverse position.
Vehicle mirror angle detection apparatus which use a magnetic sensor such as a Hall-effect sensor have been proposed previously. For example, Patent Document 1 discloses a structure shown in FIG. 2. In FIG. 2, a mirror body 10 consists of a mirror plate 14 fitted in the front face of a mirror holder 12. A pivot 16 protrudes from the rear center of the mirror body 10. A mirror drive unit 17 (mirror angle adjustment actuator unit) is housed and stationarily placed in a front opening of a mirror housing 15 behind the mirror body 10. A universal joint 19 is formed in the front center of the mirror drive unit 17 and the pivot 16 of the mirror body 10 is pivotally coupled to the universal joint 19. The mirror body 10 tilts (swings) around the pivot 16 to adjust the mirror angle.
On the rear face of the mirror body 10, a universal joint 18 is installed away from the pivot 16. A spherical part 20c at an upper end of a screw rod 20 of the mirror drive unit 17 is pivotally coupled with the universal joint 18. The screw rod 20 penetrates a center hole 22a of a gear plate 22. A lower end of the screw rod 20 is slidably led into a guide groove 24 along its axis. The screw rod 20 is restrained from rotating around its axis. With its axial movement restrained, the gear plate 22 is rotatably driven around its axis by a mirror angle adjustment motor (not shown). A spring 22b is installed in the center hole 22a of the gear plate 22. The spring 22b is engaged with a thread groove 20a in the outer surface of the screw rod 20. With this configuration, when the gear plate 22 is rotatably driven by a mirror angle adjustment motor, the mesh between the thread groove 20a and spring 22b causes the screw rod 20 to move linearly in the axial direction with its rotation around its axis restrained. The linear movement of the screw rod 20 causes the mirror body 10 to tilt around the pivot 16, thereby adjusting the mirror angle.
A rod-shaped permanent magnet 26 is embedded in lower part of the screw rod 20 along the central axis of the screw rod 20. The magnetization direction of the permanent magnet 26 corresponds to the axial direction (longitudinal direction). One end in the axial direction constitutes the North (or South) magnetic pole and the other end constitutes the South (or North) magnetic pole. A Hall-effect sensor 28 serving as a magnetic sensor is stationarily placed on the mirror drive unit 17, facing a lower outer surface of the screw rod 20. The axial movement of the screw rod 20 causes changes in that component of a magnetic flux linking the Hall-effect sensor 28 which is oriented in a magnetic sensing direction of the Hall-effect sensor 28, thereby causing the Hall-effect sensor 28 to output a Hall voltage corresponding to axial position of the screw rod 20, i.e., the mirror angle (where the magnetic sensing direction is a direction in which a given element responds to magnetism—i.e., the direction orthogonal to supplied bias current in the case of a Hall-effect sensor and direction orthogonal to the axis of the permanent magnet 26 in the arrangement in FIG. 2). Thus, the mirror angle is detected from the Hall voltage.
Also, Patent Document 2 discloses a configuration of a vehicle mirror angle detection apparatus which uses two permanent magnets 32 and 34 and one Hall-effect sensor 36 as shown in FIG. 3. The permanent magnets 32 and 34 are arranged away from each other and coupled with each other by a coupler 38. The permanent magnets 32 and 34 move linearly in a direction (direction indicated by arrow A) parallel to an arranging direction of the permanent magnets 32 and 34 as the mirror angle is adjusted. Pole faces of the permanent magnets 32 and 34 consist of end faces 32a and 34a fastened by the coupler 38 and end faces (free ends) 32b and 34b on the opposite side. Magnetization directions of the permanent magnets 32 and 34 are opposite to each other. The Hall-effect sensor 36 is located across a gap y of a predetermined length from the end faces 32b and 34b of the permanent magnets 32 and 34. As the mirror angle is adjusted, movement of the permanent magnets 32 and 34 in the direction of arrow A causes changes in that component of a magnetic flux linking the Hall-effect sensor 36 which is oriented in a magnetic sensing direction (direction indicated by arrow B) of the Hall-effect sensor 36, thereby causing the Hall-effect sensor 36 to output a Hall voltage corresponding to the mirror angle. Thus, the mirror angle is detected from the Hall voltage.
[Patent Document 1] Japanese Utility Model Laid-Open No. 64-28343 (FIG. 1)
[Patent Document 2] U.S. Pat. No. 6,382,806 (FIG. 3D)
The mirror angle detection apparatus described in Patent Document 1 provides good linearity in characteristics of the Hall voltage of the Hall-effect sensor 28 with respect to the position of the permanent magnet 26 only in a narrow range. Similarly, the mirror angle detection apparatus described in Patent Document 2 also provides good linearity in characteristics of the Hall voltage of the Hall-effect sensor 36 with respect to the positions of the permanent magnets 32 and 34 only in a narrow range.
Thus, the mirror angle detection apparatus described in Patent Documents 1 and 2 provide good linearity in characteristics of magnetic sensor output (Hall voltage) with respect to the position of the permanent magnet(s) (i.e., mirror angular position) only in a narrow range, leaving no choice but to use the range in which poor linearity is obtained. This causes errors, for example, in detection of displacement in the mirror angle during reverse-shift-activated operation. Specifically, if ΔM denotes a target angular displacement by which the mirror surface is turned downward (e.g., ΔM=6°) and ΔV denotes the amount of change in the Hall voltage per one-degree mirror angular displacement, the reverse-shift-activated operation involves turning the mirror surface downward by the target angular displacement ΔM by turning the mirror surface downward to an angular position where the Hall voltage changes by a set value of ΔM×ΔV from the value of the Hall voltage before the start of the reverse-shift-activated operation. FIG. 4 shows relationship between the mirror angle and Hall voltage at this time. Heavy line C indicates a case where the change characteristic of the Hall voltage with respect to the mirror angular position is an ideal straight line. In the case of the ideal straight line, if the Hall voltage at a mirror angular position M1 before the start of the reverse-shift-activated operation is V1, when gear-shifting means of the vehicle is set to a reverse position and the mirror surface is turned downward until the Hall voltage reaches V2 (V2=V1−ΔM×ΔV) by changing (decreasing)ΔM×ΔV, the mirror surface turns exactly by the target angular displacement ΔM and stops at a mirror angular position M2. This allows the driver to back up the vehicle by visually checking areas around rear wheels properly.
On the other hand, light line D indicates a narrow range of good linearity in the change characteristic of the Hall voltage with respect to the mirror angular position (i.e., poor linearity in the characteristic as a whole). In this case, if the Hall voltage at a mirror angular position M1′ before the start of the reverse-shift-activated operation is V1, when the gear-shifting means of the vehicle is set to a reverse position and the mirror surface is turned downward until the Hall voltage reaches V2 (V2=V1−ΔM×ΔV) by changing (decreasing) a set value of ΔM×ΔV, the mirror surface turns by an angular displacement ΔM′ (e.g., ΔM′=8° if ΔM=6°) larger than the target angular displacement ΔM and stops at a mirror angular position M2′. Thus, the mirror turns excessively, making it difficult for the driver to visually check areas around rear wheels and thereby obstructing the driver in backing up the vehicle.

Position detection apparatus and vehicle mirror angle detection apparatus


A transaction and proximity cards having an improved construction and systems for utilizing such cards. The card system includes a card having only one top ply and only one bottom ply and a layer of high elongation adhesive between each of the only one top ply and the only one bottom ply. In one card embodiment, the card further includes at least one inlay between the only one top ply and the only one bottom ply and a layer of high elongation adhesive between each of the only one top ply and the only one bottom ply and the at least one inlay. In addition, the card system includes card dispensers adapted to dispense the cards.

(1) Field
The present inventions relate generally to transaction cards and, more particularly, to transaction and proximity cards having an improved construction and systems for utilizing such cards.
(2) Related Art
Transaction cards have been currently adapted for a wide variety of uses, most commonly as a method of payment in commercial transactions. For example, a user may purchase a fare for transportation at a kiosk.
The growing popularity of near field communication (NFC) technologies such as radio-frequency identification (RFID) tags has resulted in its implementation in proximity cards as well. The kiosk may dispense a NFC-containing card with the number of uses stored within. The user may quickly pay for the transportation by simply scanning the card upon entering the vehicle. Ideally, these cards should be cheaply produced, such that when the card expires it may simply be disposed of.
Proximity cards incorporating NFC technologies have been limited in design due to structural constraints. The proximity cards must be built with sufficient durability such that the RFID tags contained within do not become destroyed and nonfunctional with nominal wear and tear. These cards have been required to be of higher thickness due to the multiple layers needed to accommodate its use as a NFC device.
Thus, there remains a need for new and improved transaction and proximity cards and systems which includes a card having only one top ply and only one bottom ply and a layer of high elongation adhesive between each of the only one top ply and the only one bottom ply which reduces the cost to produce the cards while, at the same time, provides a level of appearance, strength and durability comparable or greater than conventional multilayer stacked cards.


A method of calibrating an ultrasound bone analysis apparatus having a pair of transducer assemblies. Each transducer assembly has a transducer and a coupling pad, and is movable relative to the other so that a face of each pad can be moved to a position in which they mutually contact and to a position where the faces contact body parts. The method according to the present application includes transmitting an ultrasound signal from one transducer and receiving a signal corresponding to the transmitted ultrasound signal through the other transducer when the transducer assemblies are in the first position and the second position. A time for the ultrasound signal to pass through the body part is determined, and a width of the body part based on positions of the transducers is determined. Then, using the time and width values a speed of sound of the ultrasound signal passing through the body part with squish compensation is calculated.

The invention relates to x-ray systems and methods and more particularly to x-ray based bone densitometry systems and methods and techniques useful at least in such systems and methods.
X-rays or gamma-rays can be used to measure the density and distribution of bone in the human body in order to help health professionals assess and evaluate projected bone mineral density, which in turn can be used to monitor age-related bone loss that can be associated with diseases such as osteoporosis. Additionally or alternatively, similar procedures can be used to measure non-bone related body content such as body fat and muscle. In bone densitometry, a patient typically is placed on a table such that the patient's spine extends along the length of the table, along a direction that can be called the Y-axis in Cartesian coordinates. For a supine patient, the left and right sides are in a direction typically called the X-axis. A source at one side of the patient transmits radiation through the patient to a radiation detector at the other side. The source and the detector typically are mechanically linked by a structure such as a C-arm to ensure their alignment along a source-detector axis which is transverse (typically perpendicular) to the Y-axis. Both x-ray tubes and isotopes have been used as a source of the radiation. In each case, the radiation from the source is collimated to a specific beam shape prior to reaching the patient to thereby restrict the field of x-ray or gamma radiation to the predetermined region of the patient opposite which are located the detectors. In the case of using x-rays, various beam shapes have been used in practice including fan beam, pencil beam and cone or pyramid beam shapes. When a fan beam is used, typically the beam conforms to a beam plane which is transverse (e.g., normal) to the Y-axis. Stated differently, the beam is wide in the plane and thin along the Y-axis. The shape of the beam and the shape of the detector system correspond. The detector in a fan beam system typically is an elongated array of detector elements arranged along a line or an arc. By means of mechanically moving the C-arm and/or moving the table, a region of interest in a patient on the table can be scanned with the radiation. Typical regions of analysis in bone densitometry include the spine, hip, forearm, and wrist, scanned individually. They can be covered individually within a reasonable time by a fan beam that has a relatively narrow angle in a single pass or, alternatively, by a pencil beam scanning a raster pattern. Another analysis region is termed "oblique hip" in which the hip is viewed at an angle relative to the horizontal and vertical directions. Another analysis region is referred to as "whole body" in which the entire patient body is scanned and analyzed for bone density and possibly also for "body composition" or the percentages of fat and muscle in the body.
X-ray bone densitometry systems have been made by the owner of this application under the tradenames QDR-2000+, QDR-2000, QDR-1500, QDR-1000plus, and QDR-1000. The following commonly owned U.S. patents pertain to such systems and are hereby incorporated by reference herein: U.S. Pat. Nos. 4,811,373, 4,947,414, 4,953,189, 5,040,199, 5,044,002; 5,054,048, 5,067,144, 5,070,519, 5,132,995 and 5,148,455; and 4,986,273 and 5,165,410 (each assigned on its face to Medical & Scientific Enterprises, Inc. but now commonly owned). Other bone densitometry systems are believed to have been made by the Lunar Corporation of Madison, Wis. (see, e.g., the system which is believed to be offered under the tradename Expert and U.S. Pat. Nos. 5,228,068, 5,287,546 and 5,305,368, none of which is admitted to be prior art against this invention). It is believed that other manufacturers also have offered bone densitometry products.
The inventions disclosed in this application are directed toward bone densitometry features which are believed to overcome various shortcomings of such prior art systems. In a particular exemplary and non-limiting embodiment, the inventions are included in an x-ray bone densitometry system comprising a patient table having a length extending along a Y-axis and a width extending along an X-axis, a C-arm supporting an x-ray source at one side and an x-ray detector at an opposite side of said table, the source and detector being aligned along a source-detector axis which is transverse to the Y-axis. When selectively energized, the source emits a fan beam of x-rays which conforms to a beam plane which is transverse to the Y-axis and contains the source-detector axis. At least one of said C-arm and table is selectively movable relative to the other along the X-axis, along the Y-axis, and along a Z-axis which is transverse to both the X-axis and the Y-axis, to selectively scan selected regions of a patient on the table with said fan beam of x-rays. In addition, the C-arm is selectively rotatable around a rotational axis extending along the Y-axis to selectively change the angle of the fan beam with respect to a patient on the table. A beam modulator is mounted between the x-ray source and the table for rotation about a beam modulator axis which is transverse to the source-detector axis. The beam modulator is selectively rotatable about the beam modulator axis to cause the fan beam of x-rays to pass through a succession of beam modulating materials before reaching a patient on the table. These beam modulating materials having respective different effects on the x-rays impinging thereon, to modulate the beam for desired patient procedures and to serve other purposes such as to provide reference and calibration information. An attenuator selector also is mounted between the x-ray source and the table and has a plurality of attenuating materials selectively movable to cause the fan beam to pass therethrough. Each of these attenuating materials attenuates the fan beam passing therethrough in a selected manner different from that of other attenuating materials to cause a desired change in beam parameters such as intensity, uniformity and energy spectrum. A variable aperture collimator also is mounted between the x-ray source and the table to define the cross-section of the fan beam. The collimator can define the shape and size of the fan beam by passing x-rays through a selected one of several different slits in an x-ray opaque plate or, alternatively, can use a pair of plates selectively movable along the Y-axis to define one of the cross-sectional dimensions of the fan beam and a pair of plates movable along a direction transverse to both the Y-axis and the source-detector axis to define another cross-sectional dimension of the fan beam. A number of detector elements can be used to form said detector and tp provide respective detector outputs related to the x-rays received at respective angular positions within the fan beam. A detector response flattener can be used which is responsive to the detector outputs to process the outputs to account for at least one of: (i) non-uniformities in the fan beam; and (ii) non-uniformities in the response of detector elements. A dark current system can be used for interleaving the detector outputs with dark current responses of the detector elements on a substantially continuous basis, so as to use a dark current corrector which is responsive to the detector outputs and the dark current responses to account for dark current characteristics of the detector elements. An optical crosshairs device can be mounted on the C-arm to project a visible crosshairs co-axial with the source-detector axis and having a plane along the Y-axis and a plane normal to the Y-axis. The scan motion controller can move at least one of the C-arm and the table relative to the other to scan at least a first region and then a second region of a patient on the table with the fan beam along the Y-axis, wherein the first region and said second region are next to each other along the X-axis, each region has an edge overlapping an adjacent edge of the other region, and the distance along the Z-axis from an origin of the fan beam in the source to the table remains the same for the scan of each of the first and second regions. The system can use a merger responsive to outputs of the detector for scans of the first and second regions to merge detector outputs for positions of the fan beam which are spatially adjacent along the X-axis but are obtained at different times, into resulting merged detector outputs corresponding to detector outputs obtainable from a single fan beam having substantially twice the width of the fan beam emitted from the source. A source controller selectively pulses the source to emit therefrom single energy and dual energy x-rays in time-interleaved manner, and a processor is responsive to detector outputs for these single and dual energy x-rays to derive from them diagnostic information based solely on single energy x-rays as well as diagnostic information based on dual energy x-rays. A display coupled with the processor displays concurrently both the diagnostic information based on single energy x-rays and the diagnostic information based on dual energy x-rays. The scan motion controller moves at least one of the C-arm and the table relative to the other to carry out first a posterior/anterior or an anterior/posterior scan and then a lateral scan of a patient on the table without moving the patient between the two views. The scan motion controller rotates the C-arm around its rotation axis between carrying out the two scans, and selects the position of the source relative to the table for the lateral scan based on information respecting the patient's spine obtained in the course of the anterior/posterior or posterior/anterior scan. The scan motion controller stores scan sequences each corresponding to scanning a selected region of interest, or a selected set of regions of interest, in a patient on the table. An interface responsive to operator input selects a stored scan sequence, and the scan motion controller in response carries out the operator-selected scan sequence. A patient positioner is removably supported on the table and has: (i) a base for supporting the head and upper shoulders of a patient who is supine on the table; and (ii) a pair of wings spaced from each other along the X-axis and extending up from the base for supporting the patient's arms when the patient's hands are under the patient's head and the elbows are to the left and right of, and elevated from, the patient's torso. The patient positioner is shaped and dimensioned to maintain the patient's arms and hands away from the patient's chest and to straighten the patient's spine. A forearm positioner also can be removably supported on the table at a selected distance along the X-axis from an edge of the table. The forearm positioner comprises a base with an opening therein corresponding to a position for a patient's wrist when the patient's forearm extends along the Y-axis and is held against the table, and further comprises a fence against which the patient's forearm can be pressed to limit movement of the patient's forearm along the X-axis in a direction away from said edge of the table. The scan motion controller maintains the C-arm and the table at a selected relative position along the Y-axis while causing other relative motion between the C-arm and the table to obtain dual energy detector outputs for different relative positions between the C-arm and table while a patient is on the table. The system for such scanning can process the dual energy detector outputs to substantially cancel out soft tissue information while retaining bone information in the detector outputs, and can cofrm a computerized tomography image reconstructing bone structure but not soft tissue structure for which detector outputs have been obtained.


A liquid container having a threaded neck tapering into a non-slip palm rest opposite the finger grooves for easy handling. Both sides continue outward and down to the base which allows the container to stand freely. Within the container a partition means represented by an interior wall or a cavity starts at the base in the corner under the finger grooves and slants in an upward direction towards the neck creating two separate chambers. The top of the interior wall or cavity has a slight curve and an opening that allows the two chambers to communicate fluid there between.

1. Field of the Invention
This invention relates generally to manually operated pump type dispenser containers, and more particularly, to an improved container with two separate chambers adapted for dispensing atomized fluid in a variety of positions, including an inverted position.
2. Description of the Background Art
Pump type fluid dispensers generally include a suction tube which extends into a container configured to hold the fluid to be pumped. The containers take on different shapes for comfort and style, such as those which use handgrips and non-slip surfaces, but all of the containers merely hold a fluid to be dispensed. The problem with such conventional containers is that the fluid level eventually reaches a point at which the suction tube begins to draw air, particularly when the container is tilted from a vertical position into a horizontal plane or when the container is inverted. When this happens the fluid will spew and sputter from the pump nozzle, rather than spray as it was intended. The spewing of fluid usually ends up dripping from the nozzle, possibly damaging clothing, furniture, rugs, and the like, depending upon the type of fluid being dispensed. Moreover, when the container is inverted, the suction tube sticks straight out of the fluid making it impossible to use.
Therefore, a need exists for a container which can be tilted or inverted, while still maintaining the ability to dispense a fluid. The present invention fulfills that need.


To measure the dimensions of a tubular vessel, it is planned to plot a set of wall lines on the surface of the vessels. Then, the lengths of these wall lines are measured between a starting section and an arrival section. The plotting of the wall lines starts from a central line of the vessel divided into segments. For each central line segment, a wall line segment is defined on the wall by intersection of a plane containing this central line segment and intersecting this wall. Other wall line segments are distributed all around and all along the wall. Then, the lengths are measured.

1. Field of the Invention
The field of the present invention relates to medical diagnostic techniques generally, and more particularly to a method for measuring the dimensions of a vessel. The term "vessel" refers to the vessels and ducts of the human body, namely the blood vessel and the ducts such as the urethra that convey other liquids. An aim of the invention is to provide greater knowledge of the size and geometry of these vessels and ducts in order to facilitate subsequent therapeutic action. One of the most immediate applications of the invention is in the insertion of stents. Naturally, other uses of the dimension-measuring method of the invention can be envisaged.
2. Description of the Prior Art
A stent is a small metal spring that is slid into a natural human cavity in order to keep it open. It is used essentially in arteries in angioplasty. A stent can also be used in the urethra, the bile ducts etc. Angioplasty is a procedure used to dilate a narrowed artery by means of a balloon that is inflated in this artery, thus crushing an atheromatous plaque that has caused a stenosis. The main drawback of this technique is the high rate of restenosis, i.e. the repetition of the narrowing process which occurs in almost half of the cases. This restenosis may be premature (the elastic return of the artery after the balloon has been deflated) or delayed by proliferation of cells in the wall (the endothelium) of the artery.
To be put in place, the stent is positioned on a folded angioplasty balloon. The unit is conveyed into the vessel until the place of intervention. When the balloon is inflated in the artery, the spring expands and prevents the elastic return of the stenosis. The balloon is then withdrawn and the stent remains in place. It may be positioned by direct stenting or after dilation by a first balloon. The positioning of the stent is done under radioscopy and does not appreciably lengthen the angioplasty procedure.
Since the stent is foreign to the human body, it is a natural point of focus for the formation of a clot. A clot-prevention treatment therefore remains indispensable for at least several weeks, until the metal is naturally coated with the cells of the internal walls of the artery, in a process of endothelialization. This treatment is based on aspirin in small doses, historically associated with ticlopidine. At present, the preferred association consists of aspirin and clopidogrel, two platelet antiaggregants. The stent very appreciably diminishes the frequency of restenosis after angioplasty. It is very commonly used during angioplasty. There is no allergy. Although made of metal, it does not hamper an IRM operation.
A stent is characterized by its diameter (once unfolded) and its length. The problems posed by stents are essentially related to the need to know their exact dimensions, especially when the part of the duct in which they have to be implanted is curved. In practice, since the vessel has a tube-like structure, it is necessary to know the longest dimension of the stent and its shortest dimension so as to foresee its average curvature and hence its implantation.
The measurement of the vessels in the body by 3D imaging is now a well-established medical procedure. This procedure is leading to a simplification of surgical operations and radiology operations. There are numerous medical image-processing techniques to help in this task. The applications most commonly used serve to determine the size and geometry of a prosthetic device. In particular, they serve to measure the lengths, diameters and volumes to prepare a positioning of the stent in a vessel, such as the coronary artery, the carotid, the iliac artery, etc. that has undergone stenosis.
The technique currently used for sizing stents is to determine the central line in the vessels, and measure the length of this central line. Such an approach naturally implies that the vessel to be measured is straight, or at least that it will become straight, after the prosthesis has been put in place. However, such an assumption is not valid for certain vessels. For, it is increasingly common to place stents in a portion of the thoracic artery that may have a curvature of more than 90 degrees. When deployed, the shape of the stent adapts to the shape of the aorta in being curved. In this case however, in order to choose the appropriate stent, it is very important to know its exact dimensions.
To resolve this problem, the invention has come up with the idea of computing a set of lengths on the image of the vessel to be fitted out, preferably a minimum length and a maximum length, so as to have knowledge of all the constraints that the stent will have to support. The invention shall be described in the context of the thoracic artery but it can also be applied to any other curved tubular structure.
According to the invention, on the tubular image of the vessel, the method starts by the plotting of lines applied to the tubular surface. Thus, a certain number of lines are plotted, evenly separated from one another as much as possible, that never intersect one another and support minimum torsion.
In practice, after having obtained a 3D digital acquisition of the image of the vessel, a central line of this vessel is sought. With the knowledge of this central line, two processing operations are performed. Firstly, a segmentation of the digital image is performed starting from this central line to find the position of the walls of the tubular vessel. Secondly, this central line is subdivided into a set of segments whose number will be all the greater as the dimensions of the vessel have to be approached with greater precision. In practice, it can be noted that, over a real length of 3 cm for a vessel, about 30 segments can be envisaged but the number of these segments may be greater or smaller.
Wall line portions corresponding to these segments are plotted on the walls of the vessel. The wall line portions are joined to one another and form total wall lines whose length is definitively measured. This mode of action gives knowledge of the maximum length, the minimum length, the mean length and many other items of information on the length of the vessel and therefore on the length of the stent to be positioned in the vessel. The choice of this stent may be more appropriate.

Method for measuring the dimensions of a vessel


A conversion frame mounts to pre-existing bolt holes in a conventional USPS tilt-tray carriage with bolts that extend into the holes which previously supported vertical axis rollers for the mechanical drive tilt-tray carriage. The conversion frame has a forward foot and a rear foot, both of which connect to a ferromagnetic driving plate. The feet elevate a connection platform above the driving plate, and provide clearance for the rotation of four positioning rollers which extend sidewardly from the platform on protruding ears. The conversion kit allows the rapid change-over of a conventional mechanical drive tilt-tray sorter system to a LIM drive system with maximum re-use of parts.

Tilt tray sorters are employed where it is necessary to sort a stream of incoming parcels to a number of different destinations. Individual tilt tray carriages are linked together into a looped train which is supported on a closed loop track. Discharge stations are located adjacent inclined chutes around the track. Each discharge station corresponds to a particular destination or sorting category of the conveyed parcel. Each carriage receives a parcel at a load station. As parcels are loaded on a particular carriage, a digital controller is supplied with data to indicate the destination chute at which the parcels are to be unloaded. As the train advances around the track, air operated tippers engage the tiltable tray of a carriage when it reaches its programmed destination. The tilted tray discharges the carriage contents onto the inclined chute and then returns to an upright position. The discharged parcels may then proceed to additional processing steps, while the empty carriage returns to the load station to receive a new parcel.
The earliest tilt tray sorters used mechanical chain drives. Such drives offered the benefits of secure physical connection between the drive and the carriage, and represent a very old and well-understood technology. Mechanical chain drive type tilt tray sorters have been used at a number of locations for decades. For example, the United States Postal Service (USPS) has over 20 bulk mail centers, each with a number of tilt tray sorter installations.
Advancements in conveyor technology have made the LIM drive particularly suited for use in tilt tray sorters. In a linear induction motor drive, the train of carriages is still supported on a looped track, but the carriages do not make physical contact with the drive. Instead, the drive motors are fixed, and act on ferromagnetic carrier plates connected to each carriage. The drive motors are positioned at intervals around the track and accelerate the carriages as they pass over. The LIM drives offers the advantages of reduced noise levels, increased reliability as failure of any individual LIM drive motor will not cause the train to halt, and improved system life. A LIM drive motor is extremely reliable, as it contains no moving parts. Although new tilt tray sorter installations can be designed as LIM drive systems, there remain the many current mechanical drive technology installations which represent a significant investment not only in tracks and supports, but in tilt tray carriages. The USPS alone, for example, has tens of thousands of tilt tray carriages, representing an investment of many millions of dollars.
What is needed is a mechanism which permits the rapid and cost-effective conversion of mechanical drive tilt tray sorters to LIM drive sorters.


Some embodiments include a method, comprising: attaching a carrier substrate to a side of at least one semiconductor substrate, the at least one semiconductor substrate including photodetectors on the side; thinning the at least one semiconductor substrate while the at least one semiconductor substrate is attached to the carrier substrate; attaching an optical substrate to the at least one semiconductor substrate while the at least one semiconductor substrate is attached to the carrier substrate; and removing the carrier substrate from the at least one semiconductor substrate.

This disclosure relates to detector architectures using photodetector arrays on thinned substrates.
Back side illuminated photodetector arrays use thinned substrates. The thinned substrate reduces an effect of the substrate on illumination that passes through the substrate to the photodetectors. The thinned substrates may be on the order of 10 μm. As a result, the thinned substrate is fragile and may break during later processing.

Detector architecture using photodetector arrays on thinned substrates


A contact lens transfer device for transferring a contact lens from a storage container to a contact lens applicator has a body and a contact lens holder movably mounted on the body. The contact lens holder defines a contact lens support surface, a fluid-flow aperture extending through the contact lens support surface, and a chamber coupled in fluid communication with the fluid-flow aperture. A contact lens is removably receivable on the lens support surface, and the fluid-flow aperture is coupled in fluid communication with an interface between the contact lens and lens support surface for introducing fluid from the chamber, through the fluid-flow aperture and into the interface to release the lens from the lens support surface.

Many patients who require optical correction for visual acuity wear eye-glasses because they either cannot, or do not desire to apply contact lenses to their eyes. Among those who are able to apply contact lenses to their eyes without assistance, it is believed that approximately 25% of these patients have terminated use of contact lenses because of complications arising from a lack of aseptic conditions and/or because of frustrations or difficulties arising from the need to clean and store the contact lenses, and transport with themselves the necessary containers and cleaning solutions to maintain the contact lenses. For example, the containers for holding contact lenses need to be carefully cleaned and are difficult, and in many cases, impossible to adequately clean. In addition, these persons typically require a mirror to apply the contact lenses, and because they have difficulty viewing themselves within the mirror without eyeglasses, they have further difficulty applying the contact lenses to their eyes without assistance.
Many ocular complications relating to contact lenses are due to infections and/or toxic reactions arising from incomplete rinsing of the contact lenses with cleaning solutions or otherwise inadequate cleaning or not maintaining the sterile conditions of the lenses prior to application to the eyes. A certain number of such complications are due to the preservatives contained within the cleaning solutions. For example, it has been widely demonstrated that certain preservatives are aggressive, irritating and/or damaging to the superficial layers of the cornea of the eye.
There are numerous events that must be carried out to properly apply contact lenses to a person's eyes, including: forcing the upper and lower eyelids in a wide-open position so that the contact lens (typically about 14.5 mm in outer diameter) can fit through the opening between the eyelids; adequately cleaning the finger(s) used to handle and apply the contact lens; making sure the contact lens is properly oriented with the correct side (or concave side) facing the eye; making sure the contact lens is in a state of equilibrium on the finger at the time of application; and applying the contact lens onto the cornea of the eye without irritating the cornea or otherwise causing the eye to blink during application. The sensitivity of the cornea is among the highest of the human tissues, and therefore if the eyelids are not maintained in the proper position during application of the contact lens, the maneuver fails.
In view of the above, several attempts have been made to aid a person when applying a contact lens. For example, U.S. Pat. No. 2,919,696 to Rinaldy shows an instrument for applying a contact lens. The instrument has a cup member 11 with a rim 13. A bracket 14 supports a lens supporting element 20 which is slidably mounted within the cup member 11. In use, the lens supporting element 20 is retracted and retains the lens by surface tension. The rim 13 is manually deformed and placed against the eyelids so that upon relaxing the rim 13, the eyelids are retained open. Subsequently, the lens supporting element 20 is depressed to place the contact lens on the eye and the instrument is removed.
U.S. Pat. No. 3,910,618 to Massenz provides a contact lens applicator having a cup 11 connected to an irrigation bottle 23 by a tube 14. The tube 14 slides within the cup 11 and communicates fluid into the cup 11 from the irrigation bottle 23. The end of the tube within the cup 11 has a lens seat 19 for receiving a contact lens. The distal end of the cup 11 is a rim 12. Both the rim 12 and the cup are made of rubber. In operation, the rim 12 is squeezed to bring the outer edges together. The rim 12 is applied to the eyelid. Upon relief of the compression, the cup 11, being resilient, resumes shape keeping the eye widely exposed. Then, the tube 14 is moved toward the eye to place a contact lens thereon and the irrigation bottle 23 provides fluid as desired.
U.S. Pat. No. 4,113,297 to Quinn illustrates a device for inserting and removing a contact lens 32. A stand 11 supports the device upright on a flat surface. A storage chamber 15 is in fluid communication with a float chamber 14. An applicator eyepiece 16 mounts on top of the float chamber 14 and defines an aperture. A rod member 20 extends through the aperture and receives a contact lens on its top. The height of the rod member 20 is determined by the fluid level within the float chamber 14. Actuation of a flexible portion of the storage chamber 15 varies the fluid level within the float chamber 14 and, thus, the height of the rod member 20. To apply a contact lens, the fingers of one hand are used to hold the eye open over the eyepiece 16. The free hand actuates the storage chamber 15 to raise the rod member 20 to place the contact lens on the eye.
U.S. Pat. No. 5,069,494 to Reinson et al. shows a contact lens applicator 25 which also stores a plurality of contact lens. The container portion 10 includes multiple portions 10 which are identical and interlocking. Each portion 10 contains a single contact lens disposed in a liquid. The lens is supported on a deformable projection made of five legs 20. The portions 10 have a cover surface 16 and sidewalls with inner threads 13 and outer threads 14. The inner threads 13 and outer threads 14 of adjacent portions 10 threadably engage such that the adjacent portion 10 defines the cover for the next adjacent portion 10. A base 12 upon which the contact lens rests completes the portions 10.
One of the drawbacks associated with such prior art devices and methods is contamination of the contact lens by, for example, a user's fingers. Another drawback associated with such prior art devices and methods is the significant level of skill and/or dexterity that may be required to properly manipulate the lens.
Accordingly, it is an object of the present invention to overcome one or more of the above-described drawbacks and/or disadvantages of such prior art devices and methods.

Contact lens transfer device and associated method


The inventive polymeric membrane has the feature that porous agglomerates of at least one powder of hydrophobic thermoplastic material, formed by influence of heat, are fixed onto at least one side of a carrier material or of a mixture of carrier materials by a mechanical anchoring in the carrier material and/or by an adhering onto the carrier material.. Also a method of producing of this polymeric membrane and its use are described.

1. Field of the Invention
The present invention relates to a polymeric membrane, a method of producing this polymeric membrane and its use as well.
2. Description of the Prior Art
In the prior art there exist two groups of polymeric membranes which can be applied as subroof membranes, also called underlay membrane or "pliable sarking and underlays" or "underslating".
The representatives of the first group are predominantly based on a basis of polyvinylchloride containing a plasticizing agent and display generally a thickness between 0.5 and 1.0 mm. They have the advantage of being able to be welded by means of hot air or heating wedge apparatuses.
However, they have among others the drawback that their permeability regarding water vapor is generally considerably lower than 40 g/m.sup.2 day (23.degree. C., 90% relative humidity). Therefore, high demands must be posed regarding the quality of workmanship when laying the membrane. Similarly, the application at roof constructions with a high inherent humidity is generally problematic.
The representatives of the second group contain no uniform material basis. Their main feature is that due to very fine pores with partly clearly above 100 g/m.sup.2 d (23.degree. C., 90% relative humidity) they display extremely high permeabilities regarding water vapor. The products of this group are generally thinner than 0.5 mm. The drawback of these polymeric membranes is that partly due to the low thickness of the material, partly due to the used duroplastic raw materials, they can not be welded together at conditions present at a building site.
Therefore, subroofs having no seams cannot be produced, with the consequence that these subroofs can fulfill the function of an emergency covering only un-completely.
Connections of such subroof membranes to polymeric waterproofing and roofing membranes on flat roofs at the transition from sloping roofs to flat roofs are intrinsic regarding the execution.

Polymeric membrane comprising porous agglomerates of hydrophobic thermoplastic material


Methods for scalable video coding are described. Such methods can be used to deliver video contents in Low Dynamic Range (LDR) and/or one color format and then converting the video contents to High Dynamic Range (HDR) and/or a different color format, respectively, while pre-processing video content.

Scalable video coding (SVC) is an extension of H.264/AVC, which was developed by the Joint Video Team (JVT). Enhanced content applications such as High Dynamic Range (HDR), Wide Color Gamut (WCG), spatial scalability, and 3-D have become widely popular. Along with popularity, systems and methods for delivering such content to current generation consumer set-top box decoders have become increasingly important. However, there are drawbacks in delivering such content in enhanced format. For instance, higher amounts of bandwidth may be involved in delivery of the content in enhanced format. Additionally, content providers may have to upgrade or replace their infrastructure in order to receive and/or deliver the content in enhanced format.

Pre-processing for bitdepth and color format scalable video coding

Dolby Laboratories Licensing Corporation


A method for reducing the length of the forebody strakes along a fighter airplane involves modifying the outer contours of intermediate frame members. The original skin panels are removed. A strake contour portion on each intermediate frame member is then cut away. A replacement outer support will be secured to each intermediate frame member to fill the gap left by the cutting away of the strake contour portion. The replacement outer edge support is secured by fasteners and new skin panels then secured in place.

1. Field of the invention
This invention relates in general to modifications of an airplane fuselage, and in particular to a method for shortening the forward portion of strakes on the forebody of an aircraft.
2. Description of the Prior Art
At times, it is desirable to modify the aerodynamic features of existing aircraft. For example, tests have determined that aerodynamic performance of an F-16 fighter aircraft may be improved by modifying the fuselage. This modification involves shortening the length of the strakes on both sides of the fuselage. The strakes are thin, narrow aerodynamic shapes that extend forward from the wings on each side of the forebody.
In the portion where the strakes would be removed, a number of intermediate frame members locate between two bulkheads. The frame members comprise curved beams in symmetrical pairs, each beam having inner and outer flanges separated by a web. The outer edge contour of each frame member is formed to provide support for the existing strake. The existing F-16 aircraft has aluminum skin panels that secure over the frame members and are contoured to provide the surface of the strake.
U.S. Pat. No. 4,869,443, Sep. 26, 1989, Andrew M. Skow, describes a method of modifying the F-16 fuselage to shorten the lengths of the strakes. The method of the patent teaches to extensively disassemble the existing structure around the crew station and install new parts, including new frame members. The method requires removing all of the intermediate frame members between the two bulkheads, intercostals, and other related attachments of crew station equipment and system supports. New frame members without the strake contour on the outer edges are then installed.
The complete removal of the intermediate frame members between the crew station forward and rearward bulkheads is particularly disruptive. The intermediate frame members provide support for numerous crew station equipment and system supports. Supports for throttle quadrant and cable mounts, electrical wiring harnesses, hydraulic and pneumatic tubing, environmental control systems routing, and flight control consoles are some of the attachments made to these intermediate frame members. The systems hardware must be detached prior to removing the intermediate frame members. Additional crew station equipment and systems, also unrelated to the original purpose of the retrofit, must be removed to provide adequate access to associated frame joints and system supports. During reconstruction, complex tooling is required to locate new frame members to re-establish aircraft contours within tolerances. Supplemental tooling is required to relocate system supports and equipment that was removed earlier. Further, many of these attachments must be electrically grounded for safety purposes, requiring extra testing equipment and skilled technicians to accomplish the task.


An ice skateboard comprising a skateboard having a top surface, a bottom surface, side edges, and a front and back section, said ice skateboard having an ice blade assembly attached to the bottom surface, said ice blade assembly comprising a mounting plate having at least one integral ice blade that extends outwardly at substantially right angles from said mounting plate.

Skateboards with ice blades are well known. On such skateboards, the ice blades typically are either directly attached to the board of the skateboard or mounted on the truck axles of the truck assembly of the skateboard in replacement of the roller wheels.
An example of an ice skateboard is found in U.S. Pat. No. 4,896,893. Other ice skateboards are described in U.S. Pat. No. 6,311,990, U.S. Pat. No. 4,114,913 and U.S. Pat. No. 4,194,753.
For such ice skateboards, the rigidity of the connection of the ice blades to the skate board depends on the used of one or more brackets that separate attach the ice blades to the skate board. This may result in a high stress being applied to the mountings when unequal pressures are applied to an outer ice blade. These high stresses are all focused on the individual mounting brackets of a particular blade.
Accordingly, there is a need for an improved blade runner assembly for an ice skateboard that is made of an integral. unitary mounting bracket and ice blades that may be fastened as a single unit to a skateboard to form a highly durable and reliable ice skateboard.