A method for regenerable adsorption includes providing a substrate that defines at least one layer of ultra short channel length mesh capable of conducting an electrical current therethrough, coating at least a portion of the substrate with a desired sorbent for trace contaminant control or CO2 sorption, resistively heating the substrate, and passing a flowstream through the substrate and in contact with the sorbent.

Adsorption methods for removing trace contaminants from a flowstream typically comprise passing the flowstream over or through a sorbent structure. The sorbent structure may be defined by a plurality of pellets or an array of tubes or plates or the like, and such structure typically is positioned within the flowpath of the flowstream to be treated. The sorbent structure may comprise, or be coated with, sorbent particles that adsorb targeted impurities from the flowstream. Although such systems are well known in the art, several problems or shortcomings associated with conventional adsorption methods correspondingly also are well known in the art.
For example, when the sorbent becomes saturated, the sorbent must be regenerated or removed and replaced. Typically, the entire sorbent structure simply is replaced. Preferably, the sorbent structure is regenerable. In some systems, the sorbent structure is removed from the adsorption stream, subjected to a desorption process, and then re-exposed to the adsorption stream. One alternative method is described in U.S. Pat. No. 6,712,878 to Chang, et al., wherein sorbent particles are injected into the flowstream and then the flowstream is passed into contact with the sorbent structures. The saturated sorbent periodically is removed and fresh sorbent again is injected into the flowstream.
Another problem associated with conventional adsorption methods is the efficiency of the adsorption technique employed. Often, the unique characteristics of the targeted impurities and the sorbent itself dictate that the adsorption process operate within a desired temperature range. Several methods are known for raising the temperature of the process including heating the flowstream or the sorbent structure by employing an auxiliary heat source. However, non-uniform heat distribution within a fixed-bed substrate or other sorbent structure negatively impacts the efficiency of the process. In addition, the time it takes for an auxiliary heat source to raise the temperature of the sorbent structure, and thereby raise the temperature of the sorbent and the working fluid, further negatively impacts the efficiency of the process. Moreover, less-complex auxiliary heat sources may not provide the capability to reach and hold a narrow operating temperature range as may be required for the subject adsorption goal. Although more complex auxiliary heating systems may be capable of achieving and holding a narrow operating temperature range in a comparatively short time interval, such devices add considerable weight and cost to the adsorption process.
In addition to conventional applications for adsorption processes, such processes occupy an important niche in spacecraft environmental control and life support systems. Primary applications for adsorption processes exist in the area of cabin air quality control. Since the beginning of crewed space exploration, adsorption processes have been at the forefront for ensuring that cabin air is suitable for the crew to breathe by removing trace chemical contaminants and CO2. The ability to remove trace contaminants (e.g. alcohols, ketones, aromatics, halocarbons, and ammonia) from cabin air is a necessary aspect of spacecraft life support systems such as that employed on the International Space Station ("ISS"). Currently, this trace contaminant control system ("TCCS") requirement is met on the ISS by employing a 50 lb. bed of acid-treated activated carbon, which is not regenerated. Due to its long life (>2 yrs.), the carbon bed is simply replaced periodically. The current CO2 removal system on the ISS employs two pellet bed canisters of 5A molecular sieve that alternate between regeneration and sorption via heating and exposure to space vacuum.
It is anticipated that adsorption processes will continue to remain at the forefront of spacecraft cabin air quality control technologies. As mission durations increase and exploration goals reach beyond Earth orbit, the need for regenerable adsorption processes becomes paramount. Thus, there is a need in the art for an adsorption process that is capable of regenerably removing trace contaminants from a flowstream in an efficient, cost-effective, and robust manner suitable for conventional applications as well as for aerospace applications. There also is a need in the art for an adsorption process that is capable of regenerably removing CO2 from a flowstream in an efficient, cost-effective, and robust manner suitable for conventional applications as well as for aerospace applications.


To provide a temperature detection circuit and a semiconductor device capable of accurately detecting temperatures. A temperature detection circuit 10 includes a group of diodes 11 connected in series, a constant current source I1 connected to the group of diodes 11, a BGR circuit 13, an amplifier 14 for amplifying the BGR voltage, an adder 12 for subtracting a comparison voltage VD generated by the group of diodes 11 from a reference voltage serving as an output of the amplifier 14, a voltage current converter 15 for converting the output voltage of the adder 12 into the current, and a resistor R2 for converting its output current into the voltage. The reference voltage VA2 is a BGR voltage VBGR amplified by the same voltage as the comparison voltage VD at a predetermined temperature T1.

1. Field of the Invention
The present invention relates to a temperature detection circuit, in particular, a temperature detection circuit which outputs a voltage or a current proportional to a chip temperature when a power consumption in a chip such as a power IC is on a high level and the chip temperature is required to be detected, and a semiconductor device mounting this temperature detection circuit.
2. Description of Related Art
In recent years, in general, the integration of LSI has been advanced, and many of circuits are being mounted within one chip. Power consumption is increased in proportion to a scale of the circuit. Alternatively, even when many of circuits are not mounted, a circuit such as a power IC consumes inherently high power. In such a case, the chip temperature rises, and in the worst case, the chip is likely broken down. To avoid this, it is desirable to detect the chip temperature of the semiconductor device and control the system of the semiconductor device, thereby protecting the chip as a result. For example, a temperature sensor is mounted in the semiconductor device. In this case, as the temperature sensor, a circuit (temperature detection circuit) for outputting a voltage or current proportional to the temperature of the semiconductor chip is considered to be mounted.
FIG. 17 shows a graphic chart representing a chip temperature in the axis of abscissas, and an output voltage in the axis of ordinate. The figure shows that the chip temperature and the output voltage are in a directly proportional relationship. As shown in FIG. 17, when the chip temperature is 25° C., the output voltage is 0 V, and when it is 75° C., the output voltage is V1, and when it is 125° C., the output voltage is V2.
Japanese Patent Laid-Open publication No. 11-258065 discloses a temperature detection circuit realizing the characteristics of FIG. 17. FIG. 18 is a circuit diagram showing the temperature detection circuit disclosed in the Publication. As shown in FIG. 18, a temperature detection circuit 210 comprises a band gap reference circuit (hereinafter, referred to as BGR circuit) 213, first and second operational amplifiers A31 and A32, first to fourth resistors R21 to R24, first and second diodes D11 and D12, and a current source Ill.
The operational amplifier A32 is inputted with the output voltage of a BGR circuit 113 in a non-inverting input terminal (forward rotation input terminal), and has a resistor R21 connected between the inverting input terminal and a GND, and further, has a resistor R22 connected between the inverting input terminal and the output terminal.
Further, the first diode D11 has its anode connected to the output terminal of the second operational amplifier A32, and has its cathode connected to the anode of the second diode D12. The current source I11 has one end connected to the cathode of the second diode D12, and has the other end connected with the GND. The operational amplifier A31 has the non-inverting input terminal connected to the cathode of the second diode D12, and has a resistor R23 connected between the inverting input terminal and the GND, and further, has a resistor R24 connected between the inverting input terminal and an output terminal VOUT. The output terminal of this operational amplifier A31 is the final output terminal OUT.
When the temperature detection circuit 210 takes the voltage of the BGR circuit 213 as a VBGR, an output voltage VREF of the operational amplifier A32 can be represented by the following formula (1).
                    [Formula  1]                                                                      V          REF                =                              V            BGR                                          (                          1              +                                                R                  22                                                  R                  21                                                      )                                              (        1        )
Since the output voltage VREF is applied to anode sides of the two diodes D11 and D12 connected in series, and is biased by the current source I11, when the current flowing into the current source I11 is taken as a current I11, the cathode voltage VD12k of the diode D12 can be represented in the following formula (2).
                    [Formula  2]                                                                      V                      D                                                                          12                        K                          =                                            V              BGR                                                  (                              1                +                                                      R                    22                                                        R                    21                                                              )                                -                      2                                                                                kT              q                                    ln                                                                                I                11                                            I                S                                                                        (        2        )            Here is shown a reversed saturation current for the diode, where k: Boltzman's constant, T: the absolute temperature, q: charge of electron, and IS: diode.
Now, it is generally known that the temperature characteristic corresponding to one piece of the diode has a temperature characteristic of an approximately −2 mv/° C. Further, when the BGR circuit 113 is correctly designed, the temperature characteristic, as compared with the temperature characteristic of the diode, can be reduced approximately to the point of ignoring the same. Consequently, to check the temperature characteristic of the formula (2), assuming that the voltage (KT/q)In(I11/IS) of the diode is −2 mv/° C., the formula (2) is differentiated by a temperature T, and the following formula (3) is established.
                    [Formula  3]                                                                                ⅆ                          ⅆ              T                                                      V                          D                                                                                12                            K                                      ≅                              +            4                                                                        mV                                /                                          °C            .                                              (        3        )            As a result of amplifying this voltage VD12K by a closed loop gain decided by the operational amplifier A31, the resistor R23, and the resistor R24, the final output voltage Vout becomes as follows.
                    [Formula  4]                                                                                V                out                            =                                                V                                      D                                                                                12                                        K                                                                                (                                      1                    +                                                                  R                        24                                                                    R                        23                                                                              )                                                                                =                                                (                                      1                    +                                                                  R                        24                                                                    R                        23                                                                              )                                                                  {                                                                                V                        BGR                                                                                (                                                  1                          +                                                                                R                              22                                                                                R                              21                                                                                )                                                              -                                          2                                                                                kT                        q                                                                  ln                                                                                I                          11                                                                          I                          S                                                                                }                                                                                (        4        )
Further, the temperature characteristic of this voltage VD12K has the characteristic shown in the formula (3), and thus, the output voltage Vout becomes as follows.
                    [Formula  5]                                                                                ⅆ                          ⅆ              T                                                      V            out                          ≅                              +            4                                                                                (                          1              +                                                R                  14                                                  R                  13                                                      )                                                                        mV                                /                                          °C            .                                              (        5        )            That is, the temperature detection circuit having a desired positive inclination decided by the resistors R23 and R24 can be realized.
However, a temperature detection circuit 210 disclosed in the publication has a problem that the output voltage is unable to obtain an accuracy of the voltage output in the vicinity of 0 V. This is because, when the current source I11 is configured by the transistor, the input voltage is not allowed to operate as a constant current source in the vicinity of the input voltage 0 V. Further, since the temperature characteristic corresponding to two pieces of the diode is obtained by being amplified by the operational amplifier A31, if the temperature characteristic of the diode has an inherent error component, there arises a problem also that the error component is amplified by an amplification factor decided by the operational amplifier A31 and the resistors R23 and R24.

Temperature detection circuit and semiconductor device


In accordance with embodiments of the present disclosure, a multichip circuit for processing audio signals having dynamic range enhancement information over two or more integrated circuits may include a host integrated circuit and a client integrated circuit. The host integrated circuit may be configured to determine a dynamic range enhancement gain for a digital audio input signal, process the digital audio input signal in accordance with the dynamic range enhancement gain, and transmit audio data based on the processed digital audio input signal. The client integrated circuit may be coupled to the host integrated circuit and may be configured to receive the audio data and wherein the client integrated circuit is provided with the dynamic range enhancement gain and the client integrated circuit is configured to process the audio data with the dynamic range enhancement gain.

Audio processing methods, apparatuses, and implementations for processing digital audio input signals into analog audio output signals can be implemented or provided on a single integrated circuit ("IC") and include a way(s) for enhancing the dynamic range (e.g., a dynamic range enhancement ("DRE") feature/capability) of audio signals processed by the single IC. Such a DRE solution/controller is typically provided and confined within the single audio processing IC.
FIG. 1 shows an example single DRE audio processing IC 100 in accordance with the prior art. Single IC 100 comprises a path that has coupled in series a signal processing block 104, a DRE gain block 105 having a DRE gain 106, a modulator 108, a digital-to-analog converter ("DAC") 110, and a driver 112 having a driver gain 116 as shown in FIG. 1. An audio input signal ("AUDIO IN") 102 is received by single IC 100 and is fed into signal processing block 104. Single IC 100 provides an audio output signal ("AUDIO OUT") 118 as the output. A DRE control block 114 is coupled to the output of signal processing block 104, and the output of DRE control block 114 is fed into the DRE gain block 105. Depending upon the criteria or manner of the DRE control, DRE control block 114 gains up or gains down the DRE gain 106 of DRE gain block 105. The product of the DRE gain 106 and the driver gain 116 may always equal one or another constant value, so the driver gain 116 is correspondingly gained down or gained up based on the respective gain up or gain down of DRE gain 106 (e.g., driver gain 116 is the inverse of DRE gain 106).
FIG. 2 shows an example audio device configuration 200 in accordance with the prior art. Audio device configuration 200 shows a mobile device or computer 202 having an earphone or headphone 201 coupled to it. The single IC 100 is located within mobile device or computer 202. In this example configuration 200, the audio processing that includes the conversion of the digital signals into analog signals and the DRE control of the audio signals are all done within the single IC 100. Thus, the earphone/headphone 201 receives the already processed and DRE controlled analog output signals 203 and 205 from mobile device or computer 202, and the analog output signals 203 and 205 are transmitted to respective earbuds or headphone speakers 204 and 206 as shown in FIG. 2.
FIG. 3 shows another example audio device configuration 300 in accordance with the prior art. Configuration 300 is similar to configuration 200 of FIG. 2, but in configuration 300, the single IC 100 is located in an external box 302 as shown in FIG. 3 instead of within mobile device or computer 202 as shown in FIG. 2. Configuration 300 shows the mobile device or computer 202 coupled to the external box 300. The mobile device or computer 202 provides an analog or digital audio signal 301 to external box 302. External box 302 is coupled to earphone or headphone 201, and external box 302, in turn, provides the analog output signals 203 and 205 to respective earbuds or headphone speakers 204 and 206 as shown in FIG. 3. Similar to configuration 200, since analog output signals 203 and 205 are being provided to the earbuds or headphone speakers 204 and 206 in configuration 300 of FIG. 3, power again is required for enabling such analog signal transmission through earphone or headphone 201. This power is typically provided by the battery or power storage unit of the mobile device or computer 202 or by a battery or power storage unit of the external box 302 if the external box 302 has such a battery or power storage unit. This power consumption of the battery or power storage unit of the mobile device or computer 202 and/or external box 302 is not desired.
Adaptive noise cancellation ("ANC") algorithms are well known in the art and have been implemented for processing audio signals (e.g., AUDIO IN 102) in effectively cancelling or filtering ambient or background noise. In ANC processing, there is a desire to place ANC microphones as close to a user's ear as possible. ANC microphones are typically located in the mobile device or computer 202 of FIGS. 2 and 3 or in the external box 302 of FIG. 3 since they at least require a level of signal processing hardware/circuitry that is typically located in the mobile device, computer, or external box. An ANC microphone would be ideally located in an earbud/headphone speaker 204 or 206. However, locating an ANC microphone in an earbud/headphone speaker 204 or 206 has its challenges. Such challenges include but are not limited to space limitations and/or processing requirements. Thus, digital processing/communications for such ANC microphone signals has advantages and would be desired.
Thus, a number of desired reasons exist for processing audio signals as digital signals instead of analog signals. Some of these desired reasons include but are not limited to providing higher fidelity, lessening susceptibility to noise, interference and coupling effects, lessening degradation of signals along the transmission path, allowing for more sophisticated error correction algorithms, and maybe even lowering power consumption.

Multichip dynamic range enhancement (DRE) audio processing methods and apparatuses


Device for applying at least one active principle, consisting of a material wherein one or several capsules or microcapsules containing the active principle(s) are distributed in a binder having a sponge-like consistency so that the active principle(s) is/are released when pressure is exerted on the material. The device consists of a first part (10) and a second part (12), separated by a tear-off portion (14), the capsule or most of the capsules or microcapsules being located in the first part close to the tear-off portion, the first part being detached from the second part by tearing the tear-off portion so as to obtain, at the breakage interface, a surface for applying the active principle(s) contained in the first part when pressure is exerted thereon.

In the cosmetic and pharmaceutical fields, many liquid products are sold in bottles. As soon as the bottle is opened for first-time use, contact with air inevitably entails oxidation which is detrimental to the product in the bottle. As a result, it is often impossible to go on using the product which has lost a part of its properties relatively quickly.
Other products are sold on some form of substrate, e.g. pads which have been pre-impregnated with toilet water or perfume. Once the packaging is broached, such substrates tend to dry out very quickly as well as providing a propitious medium for bacterial growth. The same disadvantages apply to make-up-removal wipes soaked in cleansing milk.
In consequence, using microcapsules was considered. Microcapsule technology is well known in the biomedical field. Microcapsules are spherical particles consisting of a solid envelope containing a liquid, solid or semi-solid principle.
Each microcapsule has diameter of between 50 μm and 1.5 mm and therefore actually constitutes a reservoir. The first industrial application for microcapsules was in the production of carbonless copy paper since which time this technology has been applied to resolve many problems in pharmacy. In practice, because their external covering inhibits exchange with the outside environment, microcapsules protect medicinal products from diverse chemical and physical phenomena such as humidity, heat and oxidation. Moreover, the rate at which active principles are released from microcapsules can be controlled and their bioavailability can be thus modulated. This can be achieved by varying a large number of different technical parameters, including the nature of the material used to produce the envelope, the relative proportions of the active principles, particle size, and the thickness of the envelope.
The above-mentioned properties have been exploited to produce a substrate acting as a medium for microcapsules, described for example in document FR-A-2.754.450. The material used is a foam such as a polyurethane foam, a polyethylene foam or any other polymer with a sponge-like consistency. The polyurethane foam, for example, is produced in a conventional process by condensation of a mixture of a polyol and isocyanate in the presence of water which leads to the release of carbon dioxide and therefore the formation of multiple cells which give the final polymer a sponge-like structure. The microcapsules are added to the above-mentioned three reagents and everything is thoroughly mixed together. When polymerization is complete, the resultant product is a sponge-like material with microcapsules distributed in the body of the foam which acts as a binder.
One of the characteristics of the material of the invention is that the cells communicate with one another so any products contained in the microcapsules can flow through the material when it is being used. It is important to include enough water in the reaction to induce the formation of open cells (i.e. inter-communicating cells). The ideal is of course to have a material in which 100% of the cells are open, but the above-mentioned applications are possible with a material in which only 60% of the cells are open. In practice, in addition to diffusion via the internal spaces of the cells, the products also diffuse as a result of impregnation of the material and capillary action. Application of a product contained in the microcapsules described in this document is achieved by exerting pressure on the substrate material in such a way as to burst the microcapsules to release the active principle(s) that they contain, so that these principles can reach the surface of the material by diffusion through the open cells.
However, using a substrate material such as is described in document FR-A-2.754.450 is associated with one major drawback. This is that the application surface can become contaminated with unwanted bodies such as dirt, dust or microorganisms, even if the material is sealed in packaging materials up till use. As a result, the active principles can become contaminated when they are released at the surface of the material so that topical application can lead to contamination of the skin and pathological consequences.

Device for applying active principles for pharmaceutical or cosmetic purposes


A display panel includes a gate line, a gate electrode, a planarization layer, a gate insulation layer, an active layer, a data line, a source electrode, a drain electrode, and a pixel electrode. The gate electrode extends from the gate line. The planarization layer covers the gate line and the gate electrode to have an opening exposing a portion of the gate electrode formed therethrough. The gate insulation layer covers a portion of the gate electrode exposed by the opening and the planarization layer. The active layer is formed on the gate insulation layer and corresponds to the gate electrode. The data line is formed. The source electrode extends from the data line to cover a portion of the opening. The drain electrode is spaced apart from the source electrode and covers a portion of the opening. The pixel electrode is connected to the drain electrode.

1. Field
Exemplary embodiments of the present invention relate to a display panel and a method of manufacturing the display panel. More particularly, exemplary embodiments of the present invention relate to a display panel and a method of manufacturing the display panel that prevents a reduction in quality of a display even though a size of the display panel has been increased.
2. Discussion of the Background
Generally, a liquid crystal display ("LCD") controls light transmittance of liquid crystal cells arranged in a matrix pattern in response to video signals, thereby displaying a picture corresponding to the video signals on the liquid crystal display panel.
To accomplish this, the LCD includes an active area having liquid crystal cells arranged in an active matrix and driving circuits for driving the liquid crystal cells in the active area. More specifically, the LCD includes upper and lower plates. A plurality of thin film transistors (TFTs) for switching the liquid crystal cells, driving circuits for driving the thin film transistors, and signal lines connected between the driving circuits and the TFTs may be mounted on the lower substrate. The upper plate may be provided with color filters that are separated for each cell area by black matrix stripes in correspondence with the matrix liquid crystal cells and transparent electrodes coated on the color filters, and spacers provided between the upper and lower plates to maintain a constant cell gap. A liquid crystal is filled in a space defined between the upper and lower plates by the spacers.
Such an LCD is fabricated by separately preparing the upper plate and the lower plate. After the two plates are attached to each other, a liquid crystal is injected between the plates through a liquid crystal injection hole. Thereafter, the LCD is completed by coating the liquid crystal injection hole with a sealant and curing the sealant. The driving circuits require a plurality of driving integrated circuits ("D-IC") connected to a plurality of data lines and gate lines to apply data signals and a scanning signal to the data lines and the gate lines, respectively.
Because the LCD is capable of realizing a large scale and a high resolution, a display speed of the liquid crystal display panel may be reduced because the time required for allowing the D-IC to conduct all the TFTs is increased. For this reason, when a gate voltage level is set to be too high, a voltage drop occurs from a pixel as a result of a feed-through phenomenon, upon turning off the gate voltage, thereby causing distortion in picture quality.

Display panel and method of manufacturing the same


A method and apparatus for a portable renewable energy generator includes; a movable platform adapted for one of towing and transport to a remote area, a redundant renewable energy source generator including a wind energy extraction device configured for transport on the movable platform, and a battery system operably connected to the redundant renewable energy source generator. The battery system is configured to store electrical energy generated by the redundant renewable energy source generator.

This invention relates to a portable renewable energy source generator, and more particularly, relates to a portable renewable energy source generator providing wind and photovoltaic electrical generation.
There is increasing agreement around the world that people would benefit from a change from nuclear fuels, coal, oil and gas as energy sources to clean indefinitely renewable and locally available natural energy sources such as sunshine, wind, and flowing water to generate useful electrical power. The use of each one of sunshine, wind and flowing water as an energy source by itself has its strengths and weaknesses, such as time of day or night, season, weather conditions, location of resources near to points of use, special land and directional and topographic requirements, the amount and cost of required real estate, aesthetic considerations, safety considerations, noise considerations, etc. However, when these natural and manmade sources of energy are used in combination to generate electrical power, they can go a long way in solving another major and heretofore expensive problem, namely that of providing a reasonably steady and continuous source of electricity for storage in batteries and other energy storage devices and/or for use in powering lamps, motors, pumps, and other devices.
The last few years have seen the development of renewable energy (RE) systems, mainly wind-based and/or solar-based systems. These renewable energy systems are intended to help fight against energy pollution and resource depletions.
These renewable energy (RE) systems are highly transient energy sources and exhibit strong variations in their energy outputs. Thus, they require proper means to store the energy produced in period of low demand in order to stabilize the output when the demand is high. At present, the storage of the excess energy relies mostly on batteries (Fisher, Jr., "Apparatus and method for charging an energy storage source", U.S. Pat. No. 6,194,793, Feb. 27, 2001; S. Mituo, S. Tsutomu, O. Hidekiyo, M. Hisafumi, "Power supply apparatus for efficiently utilizing battery and electronic apparatus using the power supply", U.S. Pat. No. 5,610,450, Jun. 29, 1995; T. O. Kent, B. Arthur J., "Method of power management for a hybrid powertrain system", U.S. Pat. No. 5,999,864, Apr. 23, 1997). Batteries typically lose 1–5% of their energy content per month.
Remote and sometimes temporary power requirements typically require the use of a mobile or portable gas or diesel powered generator or a renewable energy system may need to be constructed to provide the required power. Fossil fuels such as coal and oil are not renewable and their use may be increasingly limited by growing environmental concerns. The goal is to minimize dependence on fossil fuels.
Gasoline or diesel powered generators are the most common but require constant refueling (i.e., spill potential) and may require environmental permitting (i.e., air permit or petroleum storage permit). Wind turbines have been used, but only when mounted to fixed foundations. Solar panels have also been used when mounted to fixed foundations, or alone on small mobile units (i.e., roadside emergency units or for use in space).
Accordingly, there is a need for a source of power that can be moved from location to location, is not reliant solely on fossil fuel, does not cause or add to air pollution or noise pollution, and does not require environmental permitting.


A ligature comprises a ligation loop located on the distal side of the ligature, a stopper through which the ligation loop is passed in a united state, a hooked loop located proximally of the stopper, and a restriction member formed so that a plasto-elastic wire forming the ligation loop can penetrate through the restriction member. The ligation loop and hooked loop are formed with plasto-elastic wires made of a synthetic resin. The cylindrical stopper is press-fitted on the part of the ligation loop folded in two, and the hooked loop is formed behind the stopper. The ligation loop is provided with the restriction member formed with a plasto-elastic tubular member with the wire of the ligation loop passed through the restriction member.

1. Field of the Invention
The present invention relates to a medical ligature for ligating the tissue of a lesion inside a human body.
2. Description of the Related Art
In the past, there has been a medical ligature for ligating the tissue of a lesion in a human body trans-endoscopically, that is, by inserting the medical ligature into the human body through a therapeutic instrument insertion channel in an endoscope.
This kind of medical ligature is such that a wire made of a synthetic resin is looped to form a ligation loop on the distal side of the ligature, and the ligation loop is used to ligate the tissue of a lesion and indwelled intact in the human body for several days. As a result, a blood flow through the tissue of the lesion is arrested owing to the ligation. The tissue of the lesion therefore necroses several days later and drops. At this time, the medical ligature also drops and is excreted naturally through the anus.
In the foregoing known medical ligature, the ligation loop is used to ligate the tissue of a lesion, and a stopper is moved toward the distal end of the ligation loop in order to make the ligature loop smaller and thus ligate the tissue of the lesion with the ligation loop. At this time, since no member is provided for restricting the movement of the stopper, the ligation loop can assume any size during ligation and can be made unlimitedly small in terms of the structure. This means that adjusting the strength of ligation depends solely on the extent of an operator's force in practical use, and poses a problem that the efficacy of treatment varies depending on operator's expertise.

Medical ligature enabling reliable ligation irrespective of operator's expertise


Catalysts comprising a compound of vanadium, phosphorus and oxygen which are employed in the oxidation of n-butane to maleic anhydride are protected from contamination caused by side reactions which occur between the catalyst and steel process equipment by covering the process equipment surfaces which contact the catalyst at elevated temperatures with a coating comprising aluminum oxide.

1. Field of the Invention
This invention relates to the use of aluminum oxide (Al.sub.2 O.sub.3) as a coating for reactor internals. Specifically, it has been discovered that the internals of metallic reactors and other metallic chemical process components (i.e., piping, cyclones) which are exposed to catalyst utilized in various chemical processes, react with the catalyst to form compounds which eventually coat the catalyst causing a loss of catalytic activity or otherwise inhibiting catalyst performance. In particular this invention relates to coating with aluminum oxide reactor internals for processes for the oxidation of n-butane to maleic anhydride which utilize a catalyst comprising a compound of vanadium, phosphorus and oxygen.
2. Description of the Prior Art
Reactor vessels and associated hardware and piping used in refinery and chemical processes are typically constructed of carbon or low alloy steel. Where corrosion is a problem, stainless steel or other corrosion resistant materials including aluminum oxide are employed.
A focus of the instant invention are catalytic processes for the oxidation of hydrocarbons which utilize catalysts comprising a compound of vanadium, phosphorus and oxygen and which operate at elevated temperatures. Typically, the reactors for these processes have been fabricated from carbon or low alloy steel. It has been discovered that steel surfaces exposed to such catalyst at elevated temperatures react with the catalyst to produce contaminants which coat the exterior of the catalyst thereby inhibiting catalyst performance. This problem becomes particularly troublesome in fluid bed reactors where catalyst particles are continually circulating as the catalyst particles are suspended in a stream of upward flowing gases, and where contaminants are easily commingled with the catalyst and the circulating catalyst has numerous opportunities to contact metallic surfaces.
The above phenomena and the ill effects caused thereby have been detected in fluid bed processes for the catalytic oxidation of n-butane to maleic anhydride. In this process the catalyst comprising a compound of vanadium, phosphorus and oxygen and operating in carbon or low alloy steel (including stainless steel) reactors eventually acquire iron containing contaminants on the catalyst surface which causes a loss of catalyst activity as well as a loss in catalyst fluidization quality.
An object of this invention is a means to eliminate the production of such contaminants in processes for the catalytic oxidation of n-butane to maleic anhydride thereby maintaining the activity and performance of the catalyst used therein.

Maintaining VPO catalyst performance by aluminizing reactor internals in oxidation of butane to maleic anhydride


A magneto-optic reading apparatus includes a laser light source for generating a linearly polarized light beam and a quarter-wave plate which converts the linearly polarized light beam into a circularly polarized light beam. A beam splitter separates the circularly polarized light beam into a first beam which passes therethrough and a second beam which is reflected. An objective lens converges the first beam so as to scan one of the data tracks of a magneto-optic recording element. The information written along the scanned data track causes the polarization of the first beam to be modulated as the first beam is reflected by the recording element toward the first beam splitter. The first beam splitter further separates the first beam into a third beam which passes therethrough and a fourth beam which is reflected. The quarter-wave plate converts the third beam into a linearly polarized light beam which has a polarization that is substantially transverse to the polarization of the light beam from the laser light source. A polarizing beam splitter prevents the third beam from reaching the laser light source. An optical signal detecting system receives the fourth beam from the first beam splitter and generates a magnetization signal corresponding to the information along the scanned data track.

1. Field of the Invention
The invention relates to the field of magneto-optic recording. More particularly, it relates to improvements in a magneto-optic recording and playback system.
2. Description of the Related Art
A conventional magneto-optic recording and playback system (such as a magneto-optic disk drive system) basically comprises a magneto-optic disk, a magnetic head unit and an optical read/write head unit.
Digital signals can be erased, recorded and read from a magneto-optic disk. The magneto-optic disk can therefore be used as a peripheral memory device of a computer system. The magneto-optic disk is usually made of a magnetic material (such as TbFe).
Referring to FIG. 1, when erasing and/or recording data onto the magneto-optic disk, a predetermined region on the disk is heated to a temperature above the Curie temperature (usually at 200.degree. C.). A sharp change in the magnetic characteristics at the heated region then occurs. The heated region is now in an erasable state. The binary data to be recorded on the disk is received by the magnetic head unit. The magnetic head unit generates a magnetic field which is perpendicular to the heated region. The direction of the magnetic field generated by the magnetic head unit depends upon the logic state of the binary data which is received by the same. The direction of magnetization at the heated region aligns with the direction of the applied magnetic field at this stage. When the temperature at the heated region drops below the Curie temperature, the heated region remains magnetized in the direction of the magnetic field which was applied thereto. This illustrates how information is recorded on a magneto-optic disk.
Referring to FIG. 2, when reading information which is stored in a magneto-optic disk, the optical head unit generates a light beam which scans a data track of the disk. The light beam is reflected by the disk and has an angle of polarization which is altered, depending upon the direction of magnetization at the scanned data track. This change in the polarization is known as the Kerr angle.
If the scanned data track was upwardly magnetized (indicating that a binary "1" signal was recorded thereon), the Kerr angle is equal to +.theta., and if the scanned data track was downwardly magnetized (indicating that a binary "0" signal was recorded thereon), the Kerr angle is equal to -.theta.. The logic state of the recorded information can therefore be determined by simply measuring the Kerr angle or the change in the polarization of the reflected beam.
FIG. 3 is an illustration of a conventional magneto-optic recording and playback system. The conventional magneto-optic recording and playback system employs an optical read/write head unit, the elements of which are enclosed by phantom lines in FIG. 3. The operation of the conventional magneto-optic recording and playback system is described briefly as follows:
When recording or erasing information, a laser diode power supply (PS) (1) is first activated so as to operate a laser diode (2). The light beam generated by the laser diode (2) is characterized by a linear (or vertical) polarization, an appropriate wave length (such as 0.78 .mu.m) and a relatively high beam power. The light beam from the laser diode (2) passes through a collimating lens (3), a first beam splitter (4), a second beam splitter (5) and an objective lens (6) and converges to form a light spot having a diameter of approximately 1 .mu.m. The light spot scans a data track of a disk (8) which is rotated by a motor unit (M) (7). The beam power at the scanned data track is at a minimum of 10 mW, thus heating the same so as to exceed the Curie temperature.
When recording binary data ("0" and "1" logic signals) on the disk (8), a signal generator (FTG) (9) is operated simultaneous with the operation of the optical head unit. The signal generator (9) provides current to a magnetic head unit (10) which is structured as an electromagnet. The magnetic head unit (10) is positioned perpendicular to and near the scanned data track of the disk (8). If a binary "1" (or "0") signal was generated during a definite time (t1), current in the positive (or negative) direction flows through the magnetic head unit (10), thereby allowing the magnetic head unit (10) to apply a vertical magnetic field on the scanned data track (A) of the disk (8). The direction of the vertical magnetic field depends upon the direction of current flow through the magnetic head unit (1). Note that when the scanned data track (A) is heated above the Curie temperature, a sharp change in the magnetic characteristics thereat occurs such that the direction of magnetization thereat can be aligned with the magnetic field which is applied by the magnetic head unit (10).
At a definite time (t) which is later than the definite time (t1), the light spot ceases to scan the data track (A) of the disk (8). The temperature at the portion (A) drops below the Curie temperature, and the portion (A) remains magnetized in the direction of the magnetic field applied thereto. This illustrates how recording of binary signals in a magneto-optic disk is conventionally achieved.
When it is desired to erase information contained in the disk (8), the optical head unit is operated in a manner similar to the above described recording operation. That is, the light spot which is generated by the optical head unit is used to scan the data tracks of the disk (8) which are to be erased so as to raise the temperature thereat past the Curie temperature. The signal generator (9), however, provides a direct current signal to the magnetic head unit (10), thereby erasing the contents of the disk (8).
To read the information recorded on the disk (8), a high frequency modulator (HFM) (Il) is used to modulate the power supply (1). This permits intermittent operation of the laser diode (2). Note that the operating frequency of the laser diode (2) is preferably between 100 MHz to 1 GHz. High frequency modulation is employed so as to prevent the light beam which is reflected by the disk (8) from returning to the laser diode (2) and from mixing with he light beam which is generated by the laser diode (2). The reflected light beam, if received by the laser diode (2), can cause instability in the beam power output and in the wave length of the light beam generated by the laser diode (2), thereby affecting the accuracy of the read operation.
The light beam from the laser diode (2) is linearly (or vertically) polarized and passes through the collimating lens (3). The collimating lens (3) arranges the light beam into parallel light rays which occupy a beam area (Z). The light beam passing through the collimating lens (3) has a light intensity (I0). The light beam from the collimating lens (3) passes through the first beam splitter (4). The light beam at a point (B) after the first beam splitter (4) has a light intensity (I1). The light beam from the first beam splitter (4) passes through the second beam splitter (5). The light beam at a point (C) after the second beam splitter (5) has a light intensity (I2). The light beam from the second beam splitter (5) passes through the objective lens (6) and converges to form a light spot. The light spot has a diameter (a) which is approximately 1 .mu.m. The light beam at the illuminated point (A) of the disk (8) has a light intensity (I3). The beam power at the data track (A) of the disk (8) is given by the formula (I3).times.[(.pi.a.sup.2)/4] and is approximately equal to 1 mW.
The light beam which strikes the surface of the disk (8) is reflected downward. Depending upon the magnetization at the scanned data track (A) of the disk (8), the polarization of the reflected light beam is altered by +.theta. or -.theta.. The angle (.theta.) is usually equal to 0.5.degree.. The reflected light beam has a light intensity (I4) and passes through the objective lens (6). The light intensity of the reflected light beam at a point (C) after the objective lens (6) has a light intensity (I5). The light beam from the objective lens (6) reaches the second beam splitter (5) and is split into a first beam which passes through the second beam splitter (5) and a second beam which is reflected.
The first beam from the second beam splitter (5) reaches the first beam splitter (4) and is split into a third beam which passes through the first beam splitter (4) and a fourth beam which is reflected. The third beam passes through the collimating lens (3) and returns to the laser diode (2).
The fourth beam is received by a servo unit (SV) (12). The servo unit (12) derives focusing and tracking error signals from the fourth beam so as to permit the former to control the focusing and tracking of the objective lens (6).
The second beam from the second beam splitter (5) has a light intensity (I6). Note that the polarization of the light beam which strikes the disk (8) is shifted by an angle (.theta.) from a vertically polarized state when the light beam is reflected by the disk (8). The second beam from the second beam splitter (5) passes through a half-wave plate (13). The light beam at a point (D), which is after the half-wave plate (13), has a light intensity (I7), while the amplitude of the light beam thereat is (A7). The half-wave plate (13) causes a 45.degree. shift in the polarization of the light beam passing therethrough. The vertical component of the light beam passing through the half-wave plate (13) has a light intensity (I7) and an amplitude (A8). The horizontal component of the light beam passing through the half-wave plate (13) has a light intensity (I9) and an amplitude (A9). The light beam from the half-wave plate (13) passes through a polarizing beam splitter (15) and is split into a vertically polarized beam and a horizontally polarized beam. The horizontally polarized beam is received by a first photodetector (16), while the vertically polarized beam is received by a second photodetector (17). The light intensity (I9) of the horizontally polarized beam is converted into a first electrical signal (S1) by the first photodetector (16). The light intensity (I8) of the vertically polarized beam is converted into a second electrical signal (S2) by the second photodetector (17). The first and second electrical signals (S1, S2) are received by a differential amplifier (DFA) (18). The (S1-S2) signal output of the differential amplifier (18) represents the information recorded on the disk (8). The following illustrates the relationship between the (S1-S2) signal output of the differential amplifier (18), the light intensity (I0 ) and the Kerr angle (.theta.):
(1) Since only half of the light beam reaching the first beam splitter (4) can pass therethrough, the light intensity (I1)=0.5 (I0).
(2) Since only half of the light beam reaching the second beam splitter (5) can pass therethrough, the light intensity (I2)=0.5 (I1).
(3) Since all of the light beam reaching the objective lens (6) can pass therethrough, the light intensity (I3)=(I2).
(4) Since all of the light beam reaching the surface of the disk (8) is reflected, the light intensity (I4)=(I3).
(5) Since all of the reflected light beam passes through the objective lens (6), the light intensity (I5)=(I4).
(6) Since only half of the light beam from the objective lens (6) passes through the second beam splitter (5), the light intensity (I6)=0.5 (I5).
(7) Since all of the light beam reaching the half-wave plate (13) can pass therethrough, the light intensity (I7)=(I6).
(8) The amplitude (A8)=(A7).multidot.cos (45.degree.+.theta.), while the light intensity (I8)=(I7).multidot.cos.sup.2 (45.degree.+.theta.).
(9) The amplitude (A9)=(A7) sin (45.degree.+.theta.), while the light intensity (I9)=(I7).multidot.sin.sup.2 (45.degree.+.theta.).
(10) The electrical signal (S1) is proportional to the beam power received by the first photodetector (16). The beam power is equal to the light intensity multiplied by the beam area. The electrical signal (S1) is therefore equal to (I8).multidot.(Z).
(11) The electrical signal (S2) from the second photodetector (17)=(I9).multidot.(Z). ##EQU1##
The (S1-S2) signal output of the differential amplifier (18) is inverted by a succeeding electrical stage so as to obtain a voltage signal (S).apprxeq.1/4(I0).multidot..theta..multidot.(Z).
It has thus been shown that the voltage signal (S) is a function of the Kerr angle (.theta.). The information recorded on the disk (.theta.) can thus be read by the magneto-optic recording and playback system since the Kerr angle (.theta.) or the angle of change in the polarization of the reflected light beam depends upon the direction of the magnetization of the scanned data track of the disk (8), which direction of magnetization in turn depends upon the logic state of the recorded binary signal.
The drawbacks of the above disclosed conventional magneto-optic recording and playback system are as follows:
1. The conventional recording and playback system utilizes a high frequency modulator to minimize the adverse effects of the reflected light beam. However, the high frequency modulator can easily affect the operation of nearby electronic devices. Therefore, electromagnetic shielding should be provided so as to suppress electromagnetic radiation of the high frequency modulator. Incorporation of the electromagnetic shielding increases the size, complexity and cost of the recording and playback system.
2. The signal output of the differential amplifier is relatively weak. Note that the magnitude of the signal output of the differential amplifier is approximately equal to 1/4(I0).multidot..theta..multidot.(Z). The weak signal output of the differential amplifier is due in part to the configuration of the optical head unit and can cause improper operation of the succeeding electrical stages.
There is thus a need for a substantially "noise-free" magneto-optic recording and playback system which is smaller in size and which has a stronger electrical signal output.

Magneto-optic recording and playback system

Industrial Technology Research Institute


An improved singlet delta oxygen generator (SOG) and method of its use are disclosed. The improved SOG is compact and scalable, capable of operating in a zero-gravity or low gravity environment, requires no gaseous diluent or buffer gas, and is capable of operating at pressures as high as one atmosphere. The improved SOG also efficiently utilizes the reactants and produces a O2(1Δ) stream that is largely free of chlorine and water vapor contamination and therefore does not require a BHP regeneration system or a water vapor trap. When used as part of a COIL system, the SOG may be part of a plenum that directly feeds the laser's nozzle. The close proximity of the SOG to the laser cavity allows operation of the SOG at higher pressures without significant depletion of available O2(1Δ) through collisional deactivation.

The invention relates to an improved method and apparatus for generating the singlet delta electronically excited state of diatomic oxygen, O2(a1Δg), in vapor form. The apparatus for generating singlet delta oxygen is referred to as a singlet oxygen generator or SOG. Singlet delta oxygen is most typically used in chemical lasers, or specifically in chemical oxygen-iodine lasers (COIL), although there may be other uses for singlet delta oxygen and particularly for singlet delta oxygen generated according to the method and using the SOG of the invention.
Singlet delta oxygen is generally produced by reacting aqueous basic hydrogen peroxide (BHP) with chlorine. Aqueous BHP is produced by mixing liquid water with an aqueous solution of hydrogen peroxide (H2O2) and an aqueous solution of potassium hydroxide (KOH). Alternatively, sodium hydroxide (NaOH) may be used in place of KOH. In the BHP solution, the H2O2and KOH exist as various ionic molecules. The mixing and reactive process in making BHP is exothermic.
When BHP is mixed with chlorine, the following stoichiometric chemical reaction takes place:H2O2+KOH+Cl2→KCl+HCl+H2O+O2(1Δ)  Reaction Awhere the oxygen is in its lowest energy electronically excited state, O2(a1Δg). For convenience, this is referred to as singlet delta oxygen or as O2(1Δ). Normally, oxygen is in its electronic ground state, O2(X3Σg−), which, hereafter, is written as O2(3Σ) or just O2. In Reaction A, the chlorine vapor diffuses into the aqueous BHP solution, forming potassium chloride (KCl), or sodium chloride (NaCl) if NaOH is used in the reaction, water, and O2(1Δ). The O2(1Δ) can form bubbles and diffuse out of the solution. The presence of singlet delta oxygen from the reaction of BHP and chlorine in Reaction A is evident by a red dimol emission (see "Direct Spectroscopic Evidence for a Deuterium Solvent Effect on the Lifetime of Singlet Delta Oxygen in Water," Kajiwara and Kearns, Journal of the American Chemical Society, vol. 95, No. 18, pp. 5886-5890, September 1973) that is visible by sight. This emission stems from the chemiluminescence of (O2(a1Δ))2.
Singlet delta oxygen has a long radiative lifetime of about 50 minutes, but can collisionally deactivate in much less time, resulting in the production of the ground state and the next higher electronically excited state, O2(1Σ), of diatomic oxygen. An important process is the gas-phase pooling reaction:O2(1Δ)+O2(1Δ)⇄O2(3Σ)+O2(1Σ)  Reaction Bwherein O2(1Σ) is shorthand for O2(b1Σg+) which is a more energetic electronic state than singlet delta oxygen. The O2(1Σ) and O2(3Σ) are contaminants or byproducts in the singlet delta oxygen stream, which reduce the yield of singlet delta oxygen. When O2(1Δ) is the preferred product, as is the case with the chemical laser, then Reaction B is a deactivation process to the extent that the forward rate exceeds the backward rate.
Reaction B is a gas-phase process that can be viewed as producing the O2(1Σ) state. In non-laser applications, this state may be preferred as equal to or superior to the O2(1Δ) state. Hereafter, when discussing the singlet delta state of oxygen, as generated by an SOG according to the preferred embodiment of the present invention, the O2(1Σ) state, produced by Reaction B, is not excluded.
An important deactivation process is the dimol reaction:O2(1Δ)+O2(1Δ)→(O2(a1Δ))2→2O2  Reaction CReactions B and C are the primary deactivation process for removing O2(1Δ) in the gas phase. The gas phase generated by the SOG of this invention consists of O2(1Δ) (which is the preferred species for COIL), O2(3Σ), O2(1Σ), H2O, and possibly a small mole fraction of chlorine vapor. The O2(3Σ), O2(1Σ), H2O and chlorine vapor (if any) are referred to as the gas-phase byproducts. In addition, there may or may not be added diluent, which is not a byproduct. For COIL, a common measure of effectiveness is the yield, which is the mole ratio of O2(1Δ) divided by the total oxygen.
Various types of singlet delta oxygen generators have been developed in the prior art. These generators typically use BHP with chlorine and a diluent gas, such as helium. Optimum singlet delta oxygen production occurs when the H2O2 molar flow rate, relative to the KOH, or NaOH, molar flow rate has a slight excess of RXN that suggested by Reaction A; i.e., H2O2 and KOH have approximately the same molar flow rate. These molar flow rates were used in the feasibility experiment according to the preferred embodiment of the present invention, as described later.
One type of prior art SOG uses a transverse flow uniform droplet method in which BHP droplets, ranging in size from 0.4 mm to 0.5 mm (15.8 mil to 19.7 mil) diameter, fall under the influence of gravity into a sump. Chlorine vapor and a diluent gas flow across the path of the droplets. The flow speed of the chlorine vapor and diluent is limited, otherwise the droplets would be transported downstream with the diluent and the generated oxygen. There is an adverse trade-off in that the maximum vapor speed, which includes the generated singlet delta oxygen, must decrease as the droplet size decreases. Generator pressures of around 92 Torr (0.12 atm), most of which is due to helium diluent, have been reported in this type of SOG. The partial pressure of the generated oxygen reported for this type of SOG is only around 14.3 Torr (0.02 atm).
Another type of prior art SOG is a verticoil oxygen generator. In this device, a number of disks rotate such that the lower portion of the disks is in a BHP sump. The upper portion of the disks is thus wetted with a BHP film. Chlorine vapor and diluent flow past the upper part of the disks to react with the BHP film. Generator pressures of about 40 Torr (0.05 atm), most of which stems from the helium diluent that enters the reactor with the chlorine vapor, have been reported in this type of SOG.
Another type of prior art SOG is a twisted-flow aersol-jet singlet oxygen generator. A partial pressure of about 75 Torr (0.1 atm) of singlet delta oxygen has been reported for this type of generator, but this O2(1Δ) pressure decreases, to around 22.5 Torr (0.03 atm), at a nozzle inlet for a laser. This significantly decreases the laser efficiency.
The foregoing prior art SOGs have, in common, a number of adverse characteristics:                (a) The devices are bulky, and typically require ducting to transport the O2(1Δ) stream to the nozzle that feeds the laser cavity. These devices are not well suited for scaling a laser module to a high-power level.        (b) Primarily, because of Reactions B and C, the singlet delta oxygen partial pressure entering the inlet of the laser's nozzle has not exceeded about 22.5 Torr (0.03 atm) in prior art systems. To increase the plenum pressure of the laser's nozzle, a diluent gas is used, typically helium or nitrogen. The need for supply tanks, plumbing, etc., to accommodate the use of a diluent gas further increases the size and weight of the overall system.        (c) The devices have difficulty keeping water vapor and water droplets from being entrained in the singlet delta oxygen stream. Water vapor is a deactivator that reduces the laser's performance. In many prior art systems, a water vapor trap and liquid separator, located between the SOG and laser nozzle, are needed. These traps, however, reduce the singlet delta oxygen concentration that enters into the laser's nozzle.        (d) Only a small percentage of the reactive chemicals in the BHP solution are utilized as the BHP flows through the oxygen generator. This results in a large and heavy BHP feed system, or a large and heavy system to recondition or regenerate the partly spent BHP.        (e) As described in "Mixed Marks for the ABL," by Canan in Aerospace America, pp. 38-43, August 1999, Earth's gravitational field is required to provide buoyancy for separating the oxygen vapor from the liquid. Prior art SOG devices that rely on gravity for separation of singlet delta oxygen from the reactant flow, or that rely on gravity for reactant flow, such as the BHP droplets which fall by force of gravity in a transverse flow uniform droplet SOG, are not suitable for operation in a space environment.        (f) Prior art systems do not appear to yield a chemical efficiency for the laser above about 30%.
In addition to prior art SOGs, gas sparger devices are relevant to the production of singlet delta oxygen according to the preferred embodiment of the present invention and as discussed more fully below. Gas sparger devices are designed to remove volatile contaminants from a liquid. In a prior art gas sparger, a contaminated liquid is injected, under pressure, onto the inside surface of a porous tube with a circular cross section. Centrifugal force keeps the liquid attached to the inside of the porous walled tube. The liquid follows a helical path as it makes a number of revolutions along the wall. Air, under pressure, is injected from the outside surface of the porous walled tube, through the tube, after which it mixes with the liquid. Most of the volatile contaminants are entrained with the air, which separates from the liquid, due to buoyancy that stems from the centrifugal force. Chemical reactions do not occur in typical gas spargers.

Efficient method and apparatus for generating singlet delta oxygen at an elevated pressure


To provide a drive device rigid enough to endure a stress due to a reaction during driving of an arm unit, and to provide a conveyance device including the same.

In the semi-conductor manufacturing field and the like, there is conveyance devices each including multijoint arms as a conveyance means for conveying a conveyance object such as a wafer or glass substrate under vacuum or in a process gas atmosphere, for example. Extending and retracting or turning the arm, such a conveyance device moves a distal end of the arm to an arbitrary position and conveys the conveyance object. Some arms allow three-dimensional movement by extending and retracting or turning in a horizontal direction with a rotational power in the horizontal direction and moving up and down in a vertical direction. In this case, a drive portion that drives the arm needs a mechanism for generating the rotational power in the horizontal direction and a mechanism for moving up and down in the vertical direction.
For example, Patent Document 1 describes a conveyance device including a casing that houses main parts of a drive portion and a drive-portion support frame housed in the casing. The drive-portion support frame supports a plurality of motors and the like for extending/retracting and turning arms and the like. The drive-portion support frame moves up and down within the casing along linear guide rails provided in the vertical direction via a ball screw mechanism by the motors provided at the bottom portion of the casing. When the drive-portion support frame moves up and down, all the arms move up and down (for example, see paragraph [0016] and FIG. 1 of Patent Document 1).
To the upper portion of the casing, a base plate is connected. The base plate is provided in an opening portion formed in a scaffold (fixing portion) in the vacuum atmosphere. That is, the drive portion is supported by the base plate such that (the drive portion of) the conveyance device is hung from the opening portion formed in the scaffold.

Abstract: A drive device includes a frame and an actuator installed in the frame. The frame is formed by integral molding by casting. The frame includes a connecting portion connectable to a division wall of a conveyance chamber, a bottom plate portion serving as an opposed portion provided to be opposed to the connecting portion, and a plurality of coupling portions that couple the connecting portion and the bottom plate portion to each other. The actuator includes three coaxial shafts (two rotating shafts and single turning shaft), three motors, and a transmission mechanism that transmits a rotational driving force by the three motors to the three shafts. The frame is formed by the integral molding, and hence it is possible to realize a drive device having a high rigidity.


A distributed system and method for associating reputation to device registration is disclosed herein. The systems and methods can include receiving a request for a device interaction from a requesting device. A blockchain registry can then be accessed in response to the request. An approval threshold can be prepared for an approval of the request. Input votes regarding the approval can be received from one or more acting member devices. In response to achieving the approval threshold, the device interaction can be established between the requesting device and one or more connected devices. Then, the device interaction can be recorded in the blockchain registry.

Generally, when a device wants to communicate with a network, the device first registers with the network. Device registration can be performed by accessing a central authority, such as a Dynamic Host Configuration Protocol (DHCP) server. DHCP is a service that dynamically leases Internet Protocol (IP) addresses and related IP information to devices which access the network. When using a DHCP server, the device is generally trusted (i.e., allowed access to the network) by providing a password, through payment, or other methods. DHCP servers generally function as part of a centralized system. However, centralized systems are, as the name suggests, centralized. Thus, the DHCP servers can be subject to attack from malicious sources, outage due to power or device failure, lag due to busy networks, and other difficulties. These difficulties can make the registration system embodied by the DHCP servers unavailable or otherwise faulty.


A method includes removing at least a piece of a deposition chamber liner from a deposition chamber by passing it through a passageway to the deposition chamber through which semiconductor substrates pass into and out of the chamber for deposition processing. A replacement for the removed deposition chamber liner piece is provided into the chamber by passing the replacement through said passageway. A liner apparatus includes a plurality of pieces which when assembled within a selected semiconductor substrate deposition processor chamber are configured to restrict at least a majority portion of all internal wall surfaces which define said semiconductor substrate deposition processor chamber from exposure to deposition material within the chamber. At least some of the pieces are sized for passing completely through a substrate passageway to the chamber through which semiconductor substrates pass into and out of the chamber for deposition processing.

Semiconductor processing in the fabrication of integrated circuitry typically includes the deposition of layers on semiconductor substrates. Exemplary processes include physical vapor deposition (PVD), and chemical vapor deposition (CVD) including atomic layer deposition (ALD). With typical ALD, successive mono-atomic layers are adsorbed to a substrate and/or reacted with the outer layer on the substrate, typically by successive feeding of different precursors to the substrate surface.
Chemical and physical vapor depositions can be conducted within chambers or reactors which retain a single substrate upon a wafer holder or susceptor. The chambers include internal walls which can undesirably have deposition product deposited thereupon in addition to the substrate. This is particularly problematic in ALD and other CVD processes, yet can also occur in PVD chambers. One existing method of protecting or preserving the internal chamber wall is to shield such from the deposition material with one or more removable liners. These liners might be received immediately adjacent or against the internal chamber walls. Alternately, the liners might be displaced therefrom, thereby defining an appreciably reduced volume chamber within which the substrate is received for deposition. One advantage of using liners is that they can be periodically replaced with new or cleaned liners, thereby extending the life of the deposition chambers. Further and regardless, the spent liners can typically be removed and replaced much more quickly than the time it would take to clean the internal chamber walls at a given cleaning interval.
The present method for replacing the liners includes partial disassembly of the deposition chamber. Specifically, the lid is typically removed to provide access to the liners for their quick removal and replacement with fresh liners. The deposition processor is then reassembled for use. The spent liners can thereby be discarded or cleaned for re-use without adding to the downtime for the processor for the same. Such methods do however expose the entire deposition processor apparatus to clean room ambient conditions, thereby increasing downtime, thermal cycling and pressure cycling of the apparatus. It would be desirable to develop methods and structures that can be used to minimize or eliminate such downtime and temperature and pressure cycling.
The invention was motivated in overcoming the above-described drawbacks, although it is in no way so limited. The invention is only limited by the accompanying claims as literally worded without interpretative or other limiting reference to the specification or drawings, and in accordance with the doctrine of equivalents.

Semiconductor substrate deposition processor chamber liner apparatus


A TFT array substrate, an electronic paper display panel and method for manufacturing the same are disclosed. The electronic paper display panel includes: a first transparent substrate, and an array of storage capacitors located on an inner side of the first transparent substrate. Each of the storage capacitors includes a common electrode located on the first transparent substrate, a transparent capacitor medium layer located on the common electrode, and a pixel electrode (44) located on the transparent capacitor medium layer. The display panel also includes an electronic paper film located on the TFT array substrate, a transparent electrode located on the electronic paper film, and a second transparent substrate located on the transparent electrode. A double-sided display may be realized by the electronic paper display panel.

E-paper (electronic paper) is now more and more popular because of its lower energy consumption, paper-like soft display behavior and thus of substituting for paper. Due to its excellent image keeping characteristic, E-paper is especially suitable for static display products for text reading and the like.
A fundamental principle of the E-paper is that charged particles in an electrophoretic fluid may reflect ambient light and then display an image which is received by human eyes. In an image converting phase, positions of the charged particles in the electrophoretic fluid may be controlled by a power-up voltage across the electrophoretic fluid and duration of the power-up voltage. Therefore the strength of the reflected light is controlled to achieve a gray-scale display. In an image keeping phase, the positions of the charged particles in the electrophoretic fluids are kept for the equal potential over both ends of the electrophoretic fluid, thus a static image display with lower energy consumption can be achieved.
When a user is reading, E-paper consumes electrical energy only if the user refreshes a page, otherwise, E-paper can display continuously even if its power is turned off. Therefore, E-paper displays with lower power consumption. Moreover, E-paper has a characteristic of high reflection in which the E-paper displays without backlight and achieves a black-and-white display or a color display by reflection of ambient light. Unlike a currently used transparent display LCD (Liquid Crystal Display), the E-paper, which displays by means of reflection, has good display properties even when used in a very bright environment.
E-paper displays include color displays and black-and-white displays. FIG. 1 is a schematic cross-sectional diagram of an E-paper for black-and-white display in the related art. Referring to FIG. 1, the E-paper for black-and-white display includes a TFT (Thin-Film Transistor) array substrate 10 and a display substrate 20. The TFT array substrate 10 includes a glass substrate 11 and storage capacitors formed on the glass substrate 11, where each of the storage capacitors consists of a common electrode 12, a capacitor medium layer 13 and a pixel electrode 14. Material of the common electrode 12 is an opaque metal and material of the pixel electrode 14 is transparent ITO (Indium Tin Oxides). The display substrate 20 includes an E-paper film 21 and a PET (Polyethylene terephthalate) substrate 23 combined with the E-paper film 21, where the PET substrate 23 is provided thereon with a transparent electrode 22, and PET, namely Polyethylene terephthalate, is a main type of thermoplastic polyester. In the related art, it is common to employ the microcapsule paper film in which there are negatively charged black particles and positive charged white particles. A main principle of the black-and-white display is that: a reference voltage is applied to the transparent electrode 22, corresponding pixel voltages are applied to respective ones of the pixel electrodes 14 via a data line, and the potential differences of pixels, which are the potential differences between the pixel electrodes 14 and the transparent electrode 22, are controlled to implement the control to the moving direction of the negatively charged black particles and the positively charged white particles in the pixel area. Since the white particles reflect light and the black particles absorb light, when the positively charged white particles gather at the side close to the PET substrate 23, white is displayed at the place where the white particles gather; and when the negatively charged black particles gather to the side close to the PET substrate 23, black is displayed at the place where the black particles gather.
To obtain an E-paper for color display, a color filter (CF) plate is added to the E-paper for black-and-white display. Currently, a color E-paper display panel mainly contains three parts: a TFT array substrate, a CF plate and a display substrate consisting of a PET substrate and an E-paper film. FIG. 2 is a schematic cross-sectional diagram of a color E-paper in the related art. A display substrate 20 is located on a TFT array substrate 10 and a CF plate 30 is located on the display substrate 20. The principle of the color E-paper is that: after passing through the CF plate 30, the light reflected by the white particles present a color image.
However, for the color E-paper in the related art, the CF plate 30 is needed for the purpose of color display. The presence of the CF plate leads to an increase in thickness of the E-paper, and only the color display rather than both the color display and the black and white display can be achieved.

TFT array substrate, E-paper display panel and method for manufacturing the same

Shanghai Tianma Micro-Electronics Co., Ltd.


A lobster trap having at least two lobster feeding chambers separated from one another with no direct or indirect access from one lobster feeding chamber to the other(s), each lobster feeding chamber having a lobster trap head to the exterior of the lobster trap and a centrally disposed bait well accessible to each lobster feeding chamber, such lobster trap characterized by the lack of a parlor chamber.

1. Field of the Invention
The device of this invention resides in the field of lobster traps and more particularly relates to a lobster trap configuration having multiple feeding chambers and a central self-closing bait well and method of lobster trapping.
2. History of the Prior Art
Lobster fishing methods and traps have not substantially changed for more than 300 years. Traps used in colonial times were built in the same basic configuration as a modern trap. The only major changes have been in the shape of the trap from half-barrel shaped to rectangular and in the change from the use of wooden lathes to wire mesh construction. Traps suitable for lobstering are particularly designed to catch lobsters, and other types of traps are unsuitable for this purpose.
Lobster fisheries have continually increased catches for decades without a diminution of, or damage to, the breeding stock of the species. The reason behind this fact puzzled scientists until recently. Advances in optics and waterproofing of cameras have led to the scientific study of lobsters in their native habitat. "Lobster cams" can be found on the Internet, recording the actions of lobsters in and around lobster traps twenty-four hours a day. Such devices and studies have led to a better understanding of lobster feeding and activity patterns during both day and night.
Existing lobster traps were built on the assumption that most lobsters would enter the trap at night to feed but would be unable to find the exit. The trap would be hauled at a later date to collect lobsters unable to exit the trap. Modern studies, however, show that 96% of all lobsters which enter a trap do so during the day, where they eat and leave. The lobster caught in the trap is the one unlucky enough to be eating in the trap when the trap is pulled. Studies also show that lobsters will not enter a trap if a larger lobster is present in the feeding chamber, but will actually dig nests or "dugouts" under a trap to wait their turn to feed.
Current lobster traps are equipped with only one feeding chamber and waste one-half to two-thirds of the interior room in the trap utilizing nets designed to make it difficult for lobsters to exit. Unfortunately the lobsters seem to have learned the way out of such traps. Lobsters have no difficulty navigating two-compartment traps. Current traps additionally require the bait to be placed in a bait bag and tied in the sleeper compartment of the trap. If bait is placed loose in the lobster trap, it is easily removed by the lobster. Thus current traps are actually feeding stations for lobsters. Given this easily obtained supply of food, it is little wonder that lobster breeding stocks are continuing to increase.
In the prior art a lobster trap is usually a weighted semicircular or rectangular-shaped wooden or plastic-coated wire mesh box dropped to the ocean floor and tethered to a buoy for location and retrieval. Although the industry uses the term "lobster pot" interchangeably with "lobster trap." for purposes of describing the present invention, the term "lobster trap" or "trap" will be used herein.
Prior art lobster trap configurations 100, as seen in FIG. 1, divide the trap into two types of compartments, the first being an entry where the crustacean enters the trap which is variously called the entry, parlor or kitchen depending on the locale. "Parlor" 102 will be used for purposes of naming this compartment herein. The second type of compartment is the area where the lobster has access to the bait, which area is only accessible from the first compartment. This second compartment is confusingly also called the parlor, sleeper or kitchen depending on the locale in which the trap is being used. For the purposes herein "sleeper" 106 will be used to describe this second compartment which contains the bait bag and which lacks direct access to the ocean.
Traditional prior art lobster traps, as seen in FIG. 1, are usually configured with two entrance funnels referred to as "fishing heads" or "heads" such as head 108, as referred to herein. In a traditional prior art lobster trap these two heads normally allow lobster entry into parlor 102 and are formed by cord netting that tapers inwardly toward the interior of the trap. Heads are generally located on opposite sides of parlor 102. The heads may or may not be equipped with one-way gates.
A semicircular malleable metal wire ring made of steel or aluminum constricts each head's funnel near its interior opening. Many of today's traps are assembled with hog ring clips. These rings can be closed by compression using a specially designed pair of pliers. The use of such rings of various types is standard in the lobster fishing industry for fasteners of the various trap hinges and at other trap locations.
Prior art traps require the use of string mesh bait bags 110 into which the bait must be pre-loaded with great effort and mess. After a trap is hauled, the used bait bag 110 with rotted fish is removed from the trap by lifting lid 104, saved for reuse and a new full bait bag is tied in the trap in the sleeper compartment 106.


Gas meters including a first portion and a second portion are provided. The first portion is separate and distinct from the second portion and a physical barrier is positioned between the first portion and the second portion. The first portion includes at least a motor associated with a shut-off valve for the gas meter and the second portion includes at least an area for a gas stream to flow through. Related gas regulating devices are also provided herein.

Utilities are not generally in the business of disconnecting service. However, sometimes utilities, such as gas companies, dispatch thousands of orders to shut-off service for a variety of reasons, for example, safety, move outs or collections activities. A shut-off valve for residential or commercial gas meters generally involves providing a motor in the gas meter to shut-off the gas meter in these situations. The motor typically has limited energy such that any "spark" created by the motor would not cause the gas in the meter to ignite. However, these limited energy motors also generally have limited torque, which only allows the motor to "shut-off" gas having relatively low pressures. Improved gas "shut-off" systems are desired.

Gas meters having high pressure shut-off valves and related gas flow control systems


A mapping-measurement apparatus includes a light illumination unit, a photodetector for detecting, through an aperture, reflection light or transmission light from a sample, and adjustable scanning mirrors on the illumination and detection sides of the sample, each mirror having two independent rotational axes about which they can be independently rotated by a controller. The aperture restricts light incident on the photodetector from a predetermined portion of the sample surface.

1. Field of the Invention
The present invention relates to mapping-measurement apparatuses, and more particularly, to improvements of the mapping mechanisms thereof.
2. Prior Art
Various microscopes are used to check the molecular structures and so on of organic and other substances attached to a surface of a solid. In infrared microscopes, for example, a specific minute portion of a measurement surface of a sample held on a stage is illuminated with infrared rays, and a transmission, reflection, absorption or other type of spectrum is measured. To measure the specific minute portion of the sample in microscopes such as those described above, an aperture is provided in the optical path to remove light coming from portions other than the specific minute portion. In other words, only a portion for which measurement is to be performed is selected, and a photodetector receives light only from that portion to acquire data (for example, see Japanese Unexamined Utility Model Registration Application Publication No. 1992-110960).
In microscopes such as those described above, it is difficult to measure the entire sample to be measured at once because a high magnification is used. Therefore, mapping measurement is performed to measure the entire sample or a specific area of the sample in a uniform manner (for example, see Japanese Unexamined Patent Registration Application Publication No. 1995-63994).
In the configuration used in the mapping measurement, the sample is generally placed on a stage that can be driven, and the sample itself is moved to measure different portions.
Since very precise control is required for this stage driving, it is impossible to use manual movement in the mapping measurement. Therefore, electronically controlled automatic stages have been used.
However, one drawback of mapping measurement that employs an automatic stage is that the mapping-measurement apparatuses become complicated due to the stage driving section.


An optical cavity resonator device is provided for conducting sensitive murement of optical absorption by matter in any state with diffraction-limited spatial resolution through utilization of total internal reflection within a high-Q (high quality, low loss) optical cavity. Intracavity total reflection generates an evanescent wave that decays exponentially in space at a point external to the cavity, thereby providing a localized region where absorbing materials can be sensitively probed through alteration of the Q-factor of the otherwise isolated cavity. When a laser pulse is injected into the cavity and passes through the evanescent state, an amplitude loss resulting from absorption is incurred that reduces the lifetime of the pulse in the cavity. By monitoring the decay of the injected pulse, the absorption coefficient of manner within the evanescent wave region is accurately obtained from the decay time measurement.

1. Field of the Invention
The present invention relates to matter identifying devices, and more particularly, to those that measure the optical absorption by matter within an evanescent wave field generated by total internal reflection within a low-loss optical cavity.
2. Related Art
Optical absorption spectroscopy is fundamentally important in chemical analysis, providing decisive quantitative and qualitative information. Such diagnostic capabilities find substantial utility in both research and industrial process environments. Therefore, an advancement in sensitivity, accuracy, or adaptability of the technique will have a significant impact.
Absorption is usually determined from measurement of a ratio of optical powers at a certain wavelength. Recently, a new technique, termed cavity ring-down spectroscopy (E. K. Wilson, C&E News, Feb. 19, 1996, p. 34, incorporated herein by reference), has been developed to determine absorption by gases, which utilizes a pulsed light source and an optical cavity. Typically, a light pulse from a laser source is injected into a cavity which is formed by two high-reflectivity mirrors. The lifetime of the pulse in the cavity is highly sensitive to cavity losses, including absorption by gases. Measurement of the pulse decay time or "ring-down" time in the cavity can thereby provide a direct measure of absorption. Cavity ring-down eliminates the adverse effects of light source fluctuation, since the measurement is acquired with a single pulse of light. The feasibility of this technique arises from recent technological advances in optical polishing, which permit the fabrication of extremely low-scatter-loss optics. If ordinary optics such as high-reflectivity mirrors (R.about.99%)are used, the pulse lifetime in the cavity is too short for the cavity ring-down strategy to provide a significant improvement in sensitivity, as compared to conventional absorption methods. However, with the advent of superpolishing, such as that described in N. J. Brown, Ann. Rev. Mater. Sci. 16, p. 371 (1986), incorporated herein by reference, mirrors with 99.99% reflectivity or better can be fabricated to construct low-loss optical cavities, thereby permitting ultra-high sensitivity to be routinely realized. The cavity ring-down technique has thereby become a viable form of optical absorption metrology, with trace analysis capabilities that greatly exceed conventional absorption methods.
A stable optical cavity used to measure the optical absorption of a material, as disclosed in copending application Ser. No. 08/962,170, is shown in FIG. 1. A three element cavity 5 is formed by two high-reflectivity concave mirrors 10, 12 with equal radii of curvature, and a Pellin-Broca prism 14 in a right-angle configuration. A light source 15 for injecting light, described throughout as a laser, is positioned adjacent mirror 10, and a photomultiplier 19 is positioned adjacent mirror 12. The Pellin-Broca prism 14 provides a total internal reflection with very high internal transmission for a light beam 16a that is polarized in the plane formed by the three element cavity 5, since an incident beam 16b and an exiting beam 16c traverse the prism faces at the Brewster's angle N.sub.B. By properly mounting the Pellin-Broca prism 14, the light beam will traverse the Pellin-Broca prism 14 at minimum deviation, which minimizes aberrations and beam translation with rotation about Brewster's angle N.sub.B. Since the total internal reflection occurs at a hypotenuse surface 14a of the Pellin-Broca prism 14, an evanescent wave 18 decays exponentially into the region external to the hypotenuse surface 14a. Absorbing materials (not shown) placed within the decay length of the evanescent wave 18 can thereby be sensitively probed through the change in the decay time of a laser pulse injected into cavity 5. This decay time is detected by photomultiplier 19 which senses a very small portion of the injected light which escapes through mirror or reflector 12. Cavity losses for the configuration shown in FIG. 1 are largely determined by surface roughness induced scattering, although stress-birefringence of the Pellin-Broca prism 14 may induce polarization scrambling.
The optical cavity shown in FIG. 1 includes high-reflectivity concave mirrors 10 and 12 located a distance from the prism 14. The mirrors 10 and 12 must be properly aligned with each other and the prism 14 in order for the cavity to operate properly.

Intra-cavity total reflection for high sensitivity measurement of optical properties

The United States of America, as represented by the Secretary of Commerce