Methods, systems, and media for managing functional verification of a parameterizable design are disclosed. Embodiments include a system having a testbench configuration module adapted to configure a testbench, the testbench having testbench signals and one or more instantiated components having a plurality of ports of a generic design, where the testbench signals are wired to the plurality of ports. The testbench may also have one or more instantiated special components based on chip-specific versions of the design where the special components are wired to the same ports as the generic design. The system may also include a functional verification manager that, through a component module, observes values in the testbench and automatically configure a verification environment based on the observed values, including automatic insertion of checkers at different levels of hierarchy. The testbench may be a VHDL or Verilog testbench in some embodiments.

When designing increasingly complex processors or IC chips such as Application-Specific ICs (ASICs) and system-on-chips (SoC's), functional verification has proven to be a major bottleneck in achieving time-to-market goals. Many companies now realize that functional verification of complex chips has become an inefficient, unwieldy, and incomplete process. Design teams report that functional verification of medium- to large-complexity processors, ASICs or SOC's may consume over 70% of the project's manpower, schedule and budget. In spite of the time and resources consumed by functional verification, it is still often incomplete, allowing design bugs to go undetected. Improved functional verification can cut costs, improve design quality and accelerate time-to-market, as well as allowing companies to sharply increase the productivity of precious verification personnel.
The design process for a chip starts with the creation of a functional specification for the design. Once the functional specification has been completed, the verification team typically creates a test plan that specifies the design features and functions to be tested at both the block and system levels. The verification team then creates tests to verify design functionality until all test plan requirements have been met. The verification process involves developing and simulating tests that are used to determine whether design components (e.g., processor units, I/O units, resources, functions, etc.) behave according to their functional specification in a process known as functional simulation. Functional verification is often an iterative process where the entire system (or at least all its major features) is tested or functionally simulated on a continuous basis for the duration of the design process. Functional verification is typically completed before fabrication, as finding and fixing errors, or bugs, after fabrication proves to be time-consuming and expensive. Functional coverage is the study and analysis of the quality and completeness of functional verification. It includes statistical, stochastic and heuristic analysis of functional verification progress and completeness.
Formal methods can be applied to the design for verification of design features, as well as identifying design connectivity and signal propagation characteristics. In most such cases, a set of formal rules or design behavior specifications are defined and applied against a compiled model of the design to identify any deviation from the formal specification (rules). Some tools can generate a set of checkers and monitors from the formal rules which can then be used along with the simulation-based verification.
Software tools have been developed to help designers and testers with the functional verification process. A design under test (DUT) may be described using a hardware description language (HDL) such as VHSIC (Very High Speed Integrated Circuits) HDL (VHDL) or Verilog. Automation tools such as Verisity Design, Inc.'s (Verisity's) Specman testbench automation software provide an environment for generation of functional tests, data and temporal checking, functional coverage analysis, and HDL simulation control.
Some design components require sophisticated modeling in order to properly simulate their performance (and thus to complete functional verification). Functional verification of a high-speed, self-aligning, elastic I/O design, for example, poses problems with existing verification environments. An I/O design, for example, may ultimately be used in a number of different chips, each chip requiring a different size, shape, speed, and FIFO (First In, First Out) size due to its intended function and use. Each of these variations needs to be functionally simulated and verified. Functionally verifying these different variations results in a large number of different configurations needing to be stored and managed, wasting resources in storage and personnel time. These variations also necessitate reconfiguring the verification environment repeatedly to account for different I/O designs, releases, versions, and the like, again utilizing valuable resources. There is, therefore, a need for an improved mechanism for managing functional verification of parameterizable components such as I/O bus designs.

Methods, systems and media for managing functional verification of a parameterizable design

International Business Machines Corporation


An electrically conductive composite article is provided having a polytetrafluoroethylene fibril matrix and a predetermined volume. The electrically conductive composite article comprises electrically conductive particles, and electrically nonconductive, energy expanded hollow polymeric particles. The volume percent of the electrically conductive particles is at least 20 volume percent. The electrically conductive composite article is continuously electrically conductive throughout its entire structure. Accordingly, electric current freely flows through the composite article due to the low resistivity of the article. The electrically conductive composite article may additionally include an elastomer material disposed within the article in a discontinuous fashion.

Electromagnetic interference (EMI) has been defined as undesired conducted or radiated electrical disturbances from an electrical or electronic apparatus, including transients, which can interfere with the operation of other electrical or electronic apparatus. Such disturbances can occur anywhere in the electromagnetic spectrum. Radio frequency interference (RFI) is often used interchangeably with electromagnetic interference, although it is more properly restricted to the radio frequency portion of the electromagnetic spectrum, usually defined as between 10 kilohertz (kHz) and 100 gigahertz (GHz).
A shield is defined as a metallic or otherwise electrically conductive configuration inserted between a source of EMI/RFI and a desired area of protection. Such a shield may be provided to prevent electromagnetic energy from radiating from a source. Additionally, such a shield may prevent external electromagnetic energy from entering the shielded system. As a practical matter, such shields normally take the form of an electrically conductive housing which is electrically grounded. The energy of the EMI/RFI is thereby dissipated harmlessly to ground.
Necessarily, most housings for electrical equipment are provided with access panels, hatches, doors and/or removable covers. Gaps which form between the panels, hatches, doors and/or removable covers provide an undesired opportunity for electromagnetic energy to leak into the shielded system. The gaps also interfere with electrical current running along the surfaces of a housing. For example, if a gap is encountered, the impedance of the gap is such that electromagnetic energy may radiate from an opposed side of the gap, much like a slot antenna.
Various configurations of gaskets have been developed over the years to close the gaps of such shields and to effect the least possible disturbance of the ground conduction currents. Each seeks to establish as continuous an electrically conductive path as possible across the gap(s). However, there are inevitable compromises between: the ability of the gasket to smoothly and thoroughly engage and conform to the surface of the housing adjacent the gaps; the conductive capacity of the gasket; the ease of mounting the gasket; and the cost of manufacturing and installing the gasket.
Presently, many electronic devices, such as but not limited to pocket pagers, cellular phones, laptop computers and wireless local area networks (LANs) are constructed using metallized plastic injection molded housings which are not manufactured to exact tolerances. Therefore, gaps form about the seams of an individual housing. Typically, in such devices mating housing members incorporate a snap-together method of closure, or in other instances, a limited number of light gauge screws are utilized to provide housing closure. Accordingly, most electronic devices having metallized plastic injected molded housings do not require substantial closure force to assemble a respective housing. Any shielded gasket which is incorporated into such electronic devices must be deformable under a low compression force.
Conventionally, conductive particle filled silicone elastomers have been utilized as conductive gaskets to reduce EMI and RFI. However, such materials tend to be relatively hard (e.g. Shore A hardness of about 60 or greater). Because of their hardness, conductive particle filled silicone elastomers are not well suited for use as a gasket in a device having a housing which is assembled with a substantially low closure force. Additionally, conductive particle filled silicone elastomers are difficult to manipulate when die cut into a thin gasket.
Other EMI/RFI shielding gaskets have been proposed which incorporate a conductive fabric or mesh which surrounds a soft, conformable foam material. Examples of such gaskets are disclosed in U.S. Pat. Nos. 5,028,739; 5,115,104; 4,857,668; 5,045,635; 5,105,056; 5,202,536; and 5,294,270. Although the gaskets disclosed in the foregoing U.S. patents may be deformable under a low compression force, these gaskets do not have continuous conductivity throughout the material. Therefore, these gasket materials cannot be die cut into arbitrary shapes to function as an EMI/RFI gasket.
Seemingly, what the prior art lacks is an improved electrically conductive material which is deformable under a low compressive load, and which is conformable and continuously conductive throughout the structure of the material such that the material is operable, in one application, to provide EMI shielding, in a frequency range from about 10 MHz to about 20 GHz, when used as a gasket between conductive seams.

Electrically conductive polytetrafluoroethylene article


A composition for enhancing cellular energy that includes creatine, L-arginine-α-ketoglutarate, D-ribose, L-carnitine, L-citrulline, and pyruvate. The composition is administering to a subject to enhance cellular energy, to increase relative intensity of physical activity performed by the subject, to increase endurance of the subject during the physical activity and to increase the muscle mass of the subject.

1. Field of the Invention
The present invention generally relates to a composition for enhancing cellular energy. More particularly, the invention relates to a composition for enhancing cellular energy that can be administered to a subject in order to enhance performance and endurance during physical activity.
2. Description of Related Art
Nutritional supplementation plays an ever increasing role in the advancement of exercise, health and fitness. Performance elite, fitness minded and/or well-oriented individuals seeking healthier lifestyles use nutritional supplements as safe and legal avenues to boost their performance and endurance while performing physical activities. Properly formulated compositions not only may enhance physical performance but also maximize efficiency of physical effort in order to achieve users' health goals such as decreased body fat or weight, increased strength and muscle size, improved body appearance, increased speed and/or generally improved health. However, compositions that are not properly formulated and lack the proper amounts of ingredients, or include improper ingredients, are at best ineffective in assisting users in achieving their goals. At worst, nutritional supplements that lack the correct formulation of ingredients can lead to serious side effects.
One target for producing nutritional supplements that enhance physical performance and endurance has been the cellular energy production mechanisms of the body, particularly those located in muscle cells. The energy production sequences involve an intricate pathway of priming the mechanisms prior to physical activity, providing energy and nutrients during physical activity; and re-energizing, recovering, repairing, and developing the energy producing mechanisms of the body once the physical activity is complete. A number of compositions in the prior art have been proposed to enhance particular aspects of the cellular energy pathway, however there are no compositions that seek to enhance and supplement the cellular energy pathway from beginning to end. In particular there are no compositions that contain the proper amount of the nutrients and energy precursors needed to prepare the body for physical activity; that provide energy and nutrients to the body during physical activity; and that provide the body the materials needed to re-energize, rebuild and improve after the physical activity is complete.
Accordingly, there is a need for a composition that supports metabolic processes; enhances physical performance and endurance; helps maintain and restore energy supplies during and after physical activity; supplies essential components for muscle gain during and after physical activity; and helps manage oxidative stress. Furthermore, there is a need that the composition is easily administered and the components of the composition are in a form that quickly becomes bioavailable to the user. There is also a need for a composition that enhances physical performance and lacks any adverse side effects.

Composition for enhancing cellular energy


A footwear cleaning apparatus has a housing formed of a single hollow molded plastic body. A rotary brush is rotatably supported on laterally opposed walls of the housing so as to partially protrude upwardly through an opening in the top side of the housing. A motor mounted alongside the housing drives rotation of the rotary brush by directly coupled bevelled gears on the motor output and rotary brush respectively. A lower portion of the housing defines a refuse receptacle which spans the full length and width of the housing and is suitable for containing liquid and other debris removed from footwear engaged with the rotary brush. A rear discharge spout mounted in a rear perimeter wall of the housing permits the contents of the refuse receptacle to be discharged therethrough.

In the sport of curling, it is well known that the ice sheets forming the playing surface must be kept clear of debris to prevent undesirable diversion of curling rocks away from their intended target. To prevent tracking of debris from non-playing areas of a curling club onto the ice sheets, effort is generally made to minimize tracking of debris from entering the curling club entirely using carpets and mats and like at doorways as much as possible. The use of carpets and mats have limited effectiveness however in climates where a large amount of snow, as well as salt and sand commonly spread of icy roadways and walkways, can be tracked into the curling club by patrons.
Various prior attempts have been made to manufacture a shoe cleaner which is more effective at collecting debris from shoes in various environments as disclosed in the following United States patents: U.S. Pat. No. 3,226,750 by Leonard; U.S. Pat. No. 5,418,996 by Chen; U.S. Pat. No. 1,223,195 by Molinaro; U.S. Pat. No. 3,060,475 by Dufault; U.S. Pat. No. 2,718,020 by Homme; and U.S. Pat. No. 762,782 by Waters. The known prior art examples typically have refuse receiving areas which are either i) incapable of containing liquids, ii) poorly located below rotary brushes for collecting liquids therefrom, or iii) have insufficient capacity for any substantial collection of liquids therein, as is typically required when snow forms a large portion of the debris to be collected.
Another example of a shoe cleaning apparatus has been previously manufactured and distributed by Thomson Rink Equipment Ltd. under the trademark name Boot Master in which a rotary brush is supported above a large refuse receptacle suitable for containing a large volume of liquid. The refuse receptacle is separate from a housing supported thereabove which houses the rotary brush and drive motor. Emptying the refuse receptacle thus requires separation of the housing from the refuse receptacle which can be cumbersome. Furthermore, the housing and refuse receptacle are formed of sheet metal which can quickly oxidise when exposed to liquid and salt of the type used commonly on roadways and walkways in colder climates.

Cleaning apparatus for an article of footwear


Method and apparatus for cooling molded plastic pieces preferably includes a take out structure/step configured to hold the plurality of plastic parts oriented such that closed ends thereof are disposed toward an inside of the take out structure and open ends thereof are disposed toward an outside of the take out structure. A movement structure/step is configured to cause relative movement between the take out structure and at least one of a first cooling station and a second cooling station. The first cooling station includes a first cooling structure/step configured to provide a cooling fluid to an inside of the plurality of plastic parts through the open ends thereof. The second cooling station includes a second cooling structure/step configured to provide a cooling fluid to an inside of the plurality of plastic parts through the open ends thereof.

1. Field of the Invention
The present invention relates to method and apparatus for cooling molded plastic pieces after the molding is finished. In particular, the present invention relates to method and apparatus for post mold cooling of plastic pieces wherein at least two cooling stations are provided to cool the interior of the plastic pieces. The present invention also relates to method and apparatus wherein pressurized sealing of each plastic piece is carried out at a cooling station such that the pressure seal does not contact the plastic piece. The present invention also relates to method and apparatus wherein plastic piece cavity tubes are provided with vents to prevent deformation of negative draft plastic pieces. Preferably, the plastic pieces comprise plastic preforms.
2. Related Art
A variety of post mold cooling methods are currently employed on injection molding machines (e.g., an Index machine platform) in various sequences to optimize the cooling of freshly molded plastic parts. Some parts (for example plastic preforms) are typically injection-molded using PET resin, and can have wall thicknesses varying from about 2.00 mm to greater than 4.00 mm, and consequently require extended cooling periods to solidify into defect-free parts. Heavy walled parts (such as these made from a material that has a high resistance to thermal heat transfer, like plastic resin) can exhibit a "reheating" phenomena that can produce defective parts after they have been ejected from the mold.
In the case of PET performs some of these manufacturing defects are:                Crystallinity: The resin recrystallizes due to the elevated temperature of the core resin not cooling quickly enough. The white appearance of the crystals impairs the clarity of the final product.        Surface blemishes: The ejected performs, initially having solidified surfaces are reheated by the core material which causes the surface to soften and be easily marred. Sometimes this surface reheating can be severe enough to cause touching parts to weld together.        Geometric inaccuracies: Handling partly-cooled performs or attempting to further cool them in devices that do not maintain their geometric shape while their surfaces are reheated can cause the preform's round diameter to become oval shaped or the smooth surface to become wrinkled or non-linear.
The above-noted problems could be alleviated somewhat by extending the cooling time of the injection molded performs. However, this will cause the injection molding cycle to be lengthy, typically 25 seconds or longer, wherein the majority of this time was used solely for cooling purposes. In an effort to improve the production efficiency of this process, several techniques are employed to perform a "post mold cooling" function, wherein partially-cooled performs are ejected from the injection mold after an initially cooled surface skin has formed to allow the part to be ejected without deformation. The partially-cooled performs are then handed off to a downstream device that continues to hold the perform while removing the remaining heat so that the preform can subsequently be handled without damage. Typically, the preform surface temperature needs to be lowered to about 72° C. to ensure safe handling.
The early ejection of partially-cooled performs released the injection molding equipment earlier in the molding cycle, thereby significantly improving the production efficiency of the equipment. Injection molding cycle times typically were halved from 25 seconds to about 12 seconds or less in some instances depending on the perform design being molded.
Some examples of post mold cooling technology are shown in U.S. Pat. Nos. 4,729,732; Re. 33,237; 5,447,426; and 6,171,541, the contents of each being incorporated herein by reference.
Another approach to extending the cooling time for performs is to utilize a turret molding machine in which more than one set of injection molding cores are employed. An example is the Index machine, shown in U.S. Pat. Nos. 5,728,409; 5,830,404; 5,750,162; and 5,817,345 (the contents of each being incorporated herein by reference), which teach using a turret block having four faces and four core sets that are sequentially mated with one cavity set to hold the injection mold performs. Preforms molded on this kind of equipment can be produced in molding cycle times of typically 10-13 seconds.
A disadvantage of the above-described approach is the cost of the additional core side tooling that is required. In order to reduce this cost, Index machines with fewer core side tooling sets were employed. However, to maintain the cycle times, additional post mold cooling devices are needed to complete the perform cooling. Examples of Index machines with post mold cooling devices are shown in U.S. Pat. Nos. 6,059,557; 6,123,538; 6,143,225; and 6,113,834, the contents of each being incorporated herein by reference.
One technique for improving the rate of heat transfer from a cooling perform is to pressurize its interior volume while cooling it in a cavity. This method helps keep the preform's exterior surface in contact with the cooling cavity surface, and counters the shrinkage of the perform which tends to separate the two surfaces. This allows good heat transfer to be maintained. Examples of pressurized perform cooling are shown in U.S. Pat. Nos. 4,950,152; and 5,679,306, and in EP 0 900 135, the contents of each being incorporated herein by reference.
Therefore, there is a need for post-mold cooling method and apparatus, which provides rapid, efficient cooling while further reducing the molding cycle time to further decrease the cost of producing molded plastic pieces.

Method for post mold cooling of plastic pieces


A process for increasing the crystallization rate and crystallization temperature of thermoplastic polyesters by incorporating into the polyesters quaternary ammonium salts in amounts effective to increase the crystallization temperatures of the polyesters at least 15.degree. C., which quaternary ammonium salts are substantially free of metal salts of organic acid functional groups. Molding compositions of thermoplastic polyesters and quaternary ammonium salts present in amounts effective to increase the crystallization temperatures of the polyesters at least 15.degree. C.

The present invention relates to a process for increasing the rate and temperature of crystallization of molding compositions of thermoplastic polyesters such as polyethylene terephthalate (PET) and to molding compositions of thermoplastic polyesters having increased crystallization rates and temperatures. In particular, the present invention relates to molding compositions of thermoplastic polyesters to which a quaternary ammonium salt has been added as a nucleating agent, which nucleating agent increases the crystallization rate and temperature of the polyester.
PET is widely used in the manufacture of molded plastics, films and fibers, because of its excellent physical properties However, the mold processing of PET is inefficient because it has a slow rate of crystallization, requiring high mold processing temperatures and long mold cycling times
The crystallization rate and temperature of PET can be increased by the addition of a nucleating agent to a molding composition. Candidate nucleating agents should promote rapid crystallization under conditions of rapid cooling from the melt. The nucleating agent should be highly effective at low concentration in promoting crystallization, and readily dispersible so that rapid and uniform crystallization of the polymer from the melt is possible If the crystallization of PET is slow and if the crystallization process during injection molding is substantially incomplete, then the dimensional stability of the molded parts will be poor. Also, because of the slow crystallization rate of PET, the injection moldability of PET is very poor.
Commonly used nucleating agents are the alkali or alkaline earth metal salts of organic acids For example, U.S. Pat. No. 3,352,904 to Deyrup discloses the use as PET nucleating agents of sodium or potassium salts of carboxylic acids or the salts of organic polymers containing pendant carboxyl groups, including carboxylic acid groups. The use of ionizable metal salts of aromatic rings substituted with acid groups selected from carboxylic acid, sulphinic acid, phosphonic acid, phosphinic acid and phenol groups are disclosed in U.S. Pat. Nos. 4,322,335 and 4,368,288 to Nield, U.S. Pat. No. 4,305,864 to Griffin, U.S. Pat. No. 4,390,493 to Yasui, U.S. Pat. No. 4,393,178 to Legras, EP 21,648 to Biebuyck and EP 351,732 to Karasawa.
U.S. Pat. No. 3,575,931 to Sherman discloses the use of metal salts of carboxylic acids as PET nucleating agents. U.S. Pat. No. 4,401,792 to Axelrod discloses the use of alkali metal salts of polyethylene ionomers and benzoic acid as PET nucleating agents. U.S. Pat. No. 4,425,470 to Garcia discloses the use of alkali metal salts of ethylene terephthalate oligomers as nucleating agents for PET. U.S. Pat. No. 4,551,507 to Haylock discloses the use of alkali or alkaline earth metal carboxylate salts of tertiary or quaternary amines as PET nucleating agents.
U.S. Pat. No. 4,390,493 cited above notes that these nucleating agents are salts of either weak or strong acids. The salts of strong acids cannot be dispersed uniformly in PET, although their crystallization acceleration effect is great. This causes nonuniform crystallization, which, as discussed above, reduces the impact resistance and other properties of articles molded from the PET. While salts of weak acids disperse more uniformly through the PET, their crystallization acceleration effect is poor, requiring large quantities of these nucleating agents to be added to the polymer, which also hinders the uniform dispersion of these nucleating agents and consequently the uniformity of the crystallization of the polymer.
A PET nucleating agent that was not a metal salt of an organic acid would be highly desirable, so that the nucleating agent would be capable of being more uniformly dispersed in the PET.

Thermoplastic polyester molding compositions containing quaternary ammonium compounds


A metering device for metering energy delivered to customers over electrical wires from a power distribution cabinet. The metering device has a plurality of current transformers, each capable of receiving one of the electrical wires and connections for the line voltages which drive the wires. The current transformers are arranged for physical correspondence to the power outputs of the power distribution cabinet. Circuitry connected to the current transformers and line voltage connections meter the energy over the electrical wires.

This invention relates to electrical power wires and, more particularly to, devices for metering electric power wires.
It should be noted in passing that in the metering of power and energy, the two terms are often used interchangeably. In strict terms, this is erroneous. The familiar "power" meter on a customer's premises actually measures the amount of energy consumed over a period of time. A customer is changed by the energy consumed. Power is the rate at which energy is being delivered to, and consumed by, the customer.
Current metering technology is bulky and the required wiring of the current transformers, which monitor the current carried by the wires to the customers, is confusing. A particular problem is the identification of all the load-carrying wires with the current transformer signal leads. Up to now, an electrician must identify the individual leads among a thicket of similar looking wires. This makes installation of power metering a complex and error-prone process. Such problems discourage the retrofitting of metering to sites where metering to individual consumers is not done but highly desirable. For example, many apartment buildings have only a single metering device for the entire building, though individual billing is highly desirable due to issues of environmental responsibility, legislative constraints and pressure to lower costs. However, the electrical wiring of such buildings is not conducive to retrofitting metering. Extensive rewiring is required with conventional metering, which makes the task in a finished building nearly impossible or extremely difficult.
To avoid or ameliorate the problems of conventional metering, the present invention provides for an electrical metering device at the power distribution cabinet. Power distribution cabinets are located near the end of electricity distribution networks to supply customers, such as homes and businesses, with electricity. Electrical wires from the power distribution cabinets provide the link from the electricity distribution networks to the customer's premises. The present invention allows for the monitoring the amount of energy supplied to each customer by an economical arrangement which is simple to install, easy to calibrate and is accurate. Rearrangements to supply power to customers are easily accommodated.
The present invention provides for such an improvement.

Electrical power metering device and method of operation thereof


An electronic apparatus is removed from a power supply apparatus and that can be certified by detecting a secondary-side transformer coil by a no-load detecting unit. The no-load detecting unit is configured to turn off an output switch unit and a power factor correction and pulse width modulation controller. An intermittent driving unit is configured to drive a start unit once a pre-determined time. The start unit is configured to drive the power factor correction and pulse width modulation controller. A load detecting unit is configured to detect that the electronic apparatus is connected to the power supply apparatus. The load detecting unit is configured to drive the intermittent driving unit. The intermittent driving unit is configured to drive the start unit. The start unit is configured to drive the power factor correction and pulse width modulation controller.

1. Field of the Invention
The present invention relates to a power supply apparatus, and especially relates to a power supply apparatus with low standby power consumption.
2. Description of the Related Art
An alternating current power is transferred into a direct current power by a power supply apparatus. An electronic apparatus is driven by the direct current power.
The power supply apparatus is configured to enter a standby mode if the electronic apparatus is not in use or the electronic apparatus is removed from the power supply apparatus. The efficiency of the power supply apparatus is better if the standby power consumption of the power supply apparatus is lower.
However, the disadvantage of the related art power supply apparatus is that the standby power consumption of the related art power supply apparatus is not low enough. The related art power supply apparatus still wastes too much energy in the standby mode. Therefore, it is very important to invent a power supply apparatus with low standby power consumption.

Power supply apparatus with low standby power consumption


A portable hand-held device (20) has a camera (102) for use by a professional truck driver while on the road to allow pictures taken to be transmitted via a transceiver of the device through a cellular telephone network to an Internet site that is linked with the telephone network and that can be securely accessed via the Internet from a personal computer at the driver's home. Pictures from home can be uploaded to the site and when one is, an alert is issued to the driver. The device also includes a GPS (132) for enabling the site to display travel of the driver on a map.

The United States trucking industry is facing a shortage of long-haul drivers and is seeking to hire large numbers of new, and often younger, truck drivers in the foreseeable future.
A long-haul trucker must spend extended periods of time away from family members, and that fact is a significant impediment to bringing younger drivers into the trucking industry and retaining them.
While wireless media such as a cellular telephone can provide a means of communication while a driver is on the road, such media may not be convenient to use in certain situations due to various distractions such as noise and may not fully satisfy a trucker's need to connect with a home that may be far away. Other wireless media can be complicated to use and even prohibitively expensive for many truckers.

Device and system for enabling families to share in long haul truckers' travels

International Truck Intellectual Property Company, LLC


Improved column sample-and-hold (CSH) circuitry particularly useful in a CMOS imager is disclosed. In the improved circuitry layout, the overall column height of the CSH circuitry is reduced by providing a plurality of pairs of sampling and reference capacitors in a vertical stack over the columns that the capacitors service. The number of pairs provided in the vertical stack is subject to optimization, and for a given set of design constraints, a certain form factors can prove to be optimal. No modification needs to be made to the pixel array (such as pixel pitch), and the sensing circuitry otherwise requires no electrical or process modifications as the values for the capacitances as well as other design constraint are preserved. However, the vertical stacking of the plurality of pairs of capacitors reduces the overall column height (CH), which conserves layout space on the CMOS imager integrated circuit.

Complementary Metal-Oxide-Semiconductor (CMOS) imagers are gaining popularity in the market place. As one skilled in the art understands, CMOS imagers are used to sense light and to provide an electronic representation of the sensed imaged. Accordingly, such devices are useable in digital cameras, to cite just one example.
FIG. 1 shows an example of the basic architecture of a CMOS imager 10 integrated circuit. As can be seen, the CMOS imager 10 includes an array 12 of photosensitive pixels 8 arranged in rows and columns. Read out of a given pixel 8 requires the activation of a given row and column, which is the function of the row decoder circuitry 14 and the column decoder circuitry 16, which in turn are responsive to a row address and column address input into the imager 10. The accessed pixel 8 routes a photo-induced charge from the pixel 8 to its associated column, which meets with column sample-and-hold (CSH) circuitry 18. In FIG. 1, the CSH circuitry 18 is shown at the bottom edge of the pixel array 12 (a bottom-only architecture), although it may also appear at the top and bottom of the array 12 as will be discussed further below. Briefly, the CSH circuit 18 samples the accessed pixel's charge via a sampling capacitor and a reference capacitor (more on this below) to produce signals "sig" and "rst," which are input to an amplifier 20. The amplifier 20 in turn produces analog signals indicative of the sensed charge, and provides them to an analog-to-digital Converter (ADC) circuit 22 to provide a digital representation of the intensity of the light impingent on the pixel 8 being read.
FIG. 2 shows further details of the pixel array 12 and of the sensing circuitry, and in particular the CSH circuitry 18. As can be seen, each pixel 8 comprises a photodiode 11, which induces a charge which scales in magnitude with the intensity of the light impingent upon the photodiode. This induced charge drives a transfer gate 13 to route some amount of the power supply voltage Vcc onto a given column 15, assuming that the access transistor 17 for the row of the pixel 8 in question has been activated by the row decoders 14. Although not shown, one skilled in the art will realize that each pixel 8 may comprise a reset transistor as well.
The pixel induced charge is thus routed from the column 15 to the CSH circuitry 18, where it is coupled to two capacitors, called the sampling capacitor, Cs 32, and the reference capacitor, Cr 33. As each column has its own dedicated sampling and reference capacitors 32 and 33, they are denoted in conjunction with the column they support: i.e., the capacitors for column 0 are denoted as C0s and C0r. While the actual mechanics for using the sensing and reference capacitors 32 and 33 to sense the induced charge on the pixels 8 are well known and not directly important to embodiments of the invention, it is only briefly explained here. Essentially, a sample signal ("samp_sig") is sent from the imager 10's control unit (not shown) to close one of transistors 19 move the charge from the column 15 onto the sampling capacitor 32 Cxs. Later in the sensing cycle, the other of the transistors 19 is opened to move charge from the column 15 to the reference capacitor 33 Cxr, which occurs in conjunction with resetting of the pixel. This provides a reference level of charge which is essentially used to normalize the signal charge. The sampled charge on Cxs and the reference charge Cxr are then passed by transistors 21 under control of a column decoder 16 at an appropriate time onto signal lines "sig" and "rst," which are in turn passed to the amplifier 20 to perform the normalization, and ultimately to the ADC 22 where the magnitude of normalized sensed change is digitized.
Further details concerning the design and operation of CMOS imagers can be found at http://www.olympusmicro.com/primer/digitalimaging/cmosimagesensors.html, a copy of which is submitted in an Information Disclosure Statement filed with this application, and which is hereby incorporated by reference in its entirety.
FIG. 3 shows a typical layout of the sampling and reference capacitors 32 and 33 in conjunction with the pixel array 12. In the embodiment shown, the capacitors 32 and 33 are positioned on both the top and bottom of the array 12 (a top-bottom architecture). So arranged, the top sets of capacitors 32t and 33t service the even-numbered columns, while the bottom sets of capacitors 32b and 33b service the odd-numbered columns. The columns 15 are not shown for ease of illustration.
The sensing and reference capacitors 32 and 33 in this embodiment are formed from two different layers of polycrystalline silicon ("poly 2" over "poly 1"), with the poly 1 plate formed with a slightly larger area to allow contact to be easily made from overlying metal layers (e.g., the columns 15; not shown) to the bottom capacitor plate. (Note that this sizing difference between the poly 1 and poly 2 plates of the capacitors 32 and 33 is in reality quite small, and that the difference is greatly exaggerated in the Figures). As one skilled in the art of semiconductor processing will understand, a dielectric layer (such as a silicon oxide or silicon nitride) intervenes between the two capacitor plates.
Although the layout of FIG. 3 is not drawn to scale, one of skill in the art will appreciate that the CSH circuitry 18 takes up significant layout space on the imager integrated circuit. This is primarily due to the size of the sampling and reference capacitors 32 and 33. For proper sensing, it is simply the case that the capacitance of these capacitors needs to be quite large (perhaps 1.2 pF a piece). As a result, these capacitors 32 and 33 are made large in area to maximize their capacitance. Thus, even when the sampling and reference capacitors 32 and 33 are split between the top and bottom of the array 12 as shown in FIG. 3, the result is that the CSH circuitry 18 is quite long, what is referred to herein as the "column height" (CH) of the CSH circuitry 18. As can be seen in FIG. 3, this column height CH is dominated by the height h of each of the sampling and reference capacitors 32 and 33. Moreover, further adding to the column height are smaller spaces of dimension d, what is referred to herein as the intercapacitor spacing. These spaces d perform the function of isolating the capacitors 32 and 33, and is usually set as a design constraint. Additionally, the intercapacitor spacing d can also provide the location of other circuitry used within the CSH circuitry 18, such as the selection and column decode transistors 19 and 21 (FIG. 2).
In any event, the column height of the CSH circuitry 18 in CMOS imagers is a significant issue, and reduction of the height is greatly desired. Without schemes to reduce this height, further miniaturization of these devices (which ultimately increases their profitability) will become increasing difficult.

Reduction in size of column sample and hold circuitry in a CMOS imager


A PCIe switch implements a logical device for use by connected host systems. The logical device is created by logical device enabling software running on a host management system. The logical device is able to consolidate one or more physical devices or may be entirely software-based. Commands from the connected host are processed in the command and response queues in the host and are also reflected in shadow queues stored in the management system. A DMA engine associated with the connected host is set up to automatically trigger on queues in the connected (local) host. Commands are sent to the physical devices to complete the work and a completion signal is sent to the management software and a response to the work is sent directly to the connected host, which is not aware that the logical device is non-existent and is implemented by software in the management system.

1. Field of the Invention
The present invention relates generally to switches and electronic communication. More specifically, the present invention relates to enabling a synthetic or logical device in an intelligent PCIe switch in order to consolidate functionality of multiple devices.
2. Description of the Related Art
Computer architectures have advanced greatly over the years. Lately it is becoming more and more commonplace for chip designers to include external data interfaces, such as Universal Serial Bus (USB) interface controllers into their motherboards. These interfaces are known as host controllers. The processor is typically then connected to the other components of the computer system via an input/output (I/O) interconnect system.
There are many different computer I/O interconnect standards available. One of the most popular over the years has been the peripheral component interconnect (PCI) standard. PCI allows the bus to act like a bridge, which isolates a local processor bus from the peripherals, allowing a Central Processing Unit (CPU) of the computer to connect to a host of IO devices through this interconnect.
Recently, a successor to PCI has been popularized, termed PCI Express (or, simply, PCIe). PCIe provides higher performance, increased flexibility and scalability for next-generation systems, while maintaining software compatibility with existing PCI applications. Compared to legacy PCI, the PCI Express protocol is considerably more complex, with three layers—the transaction, data link and physical layers.
In a PCI Express system, a root complex device connects the processor and memory subsystem to the PCI Express switch fabric comprised of one or more switch devices (embodiments are also possible without switches, however). In PCI Express, a point-to-point architecture is used. Similar to a host bridge in a PCI system, the root complex generates transaction requests on behalf of the processor, which is interconnected through a local I/O interconnect. Root complex functionality may be implemented as a discrete device, or may be integrated with the processor. A root complex may contain more than one PCI Express port and multiple switch devices can be connected to ports on the root complex or cascaded.
As an example, FIG. 1 is a block diagram depicting a normal shared IO architecture having a standard PCIe switch 102 controlled by management host 104 running switch management software. Switch 102 services one or more hosts, shown as connected host 106 and connected host 108 (also referred to as "local hosts"), for example servers, PCs, and other computing devices. Also connected to switch are one or more devices 110-116 that typically provide some type of function or service for the connected hosts. Within switch 102 are virtual devices 118-124. Virtual devices 118 and 120 are connected to connected host 106 and virtual devices 122 and 124 are connected to connected host 108. Some of these virtual devices have data paths to physical devices 110-114. The functionality and roles of virtual devices 118-124 are described in co-pending application U.S. patent application Ser. No. 12/979,904, entitled "MULTI-ROOT SHARING OF SINGLE-ROOT INPUT/OUTPUT VIRTUALIZATION," where a solution was described that used resource redirection methods when multiple hosts are connected using the non-transparent ports of a PCIe switch that supports shared I/O mechanisms.
It would be desirable to further enhance the functionality of the PCIe switch through use of DMA engines, address mapping and memory space redirection to consolidate functionality of physical devices connected to the switch. In addition, it would be desirable to enable synthetic NVMe end points for connected hosts for a set of SSD drives (or other storage device) with or without additional features such as RAID or to share a set of SSD/storage drives with several connected hosts. Finally, it would be beneficial to users of the switch if it enabled sharing scarce or expensive resources among multiple connected hosts by way of software and hardware assists even if the resources do not allow sharing natively.

PCI express switch with logical device capability

Avago Technologies General IP (Singapore) Pte. Ltd.


A five-piece wide-angle lens module includes a first lens, a second lens, a third lens, a stop, a fourth lens and a fifth lens, which are sequentially arranged from an object side to an image side. The first lens has a negative refractive power, a convex surface on the object side, and a concave surface on the image side. The second lens has a negative refractive power and two concave surfaces on both sides. The third lens has a positive refractive power. The fourth lens has a positive refractive power and two convex surfaces on both sides. The fifth lens has a negative refractive power. Thereby, the five-piece wide-angle lens module can provide good image quality even in the environment with severe temperature changes.

1. Field of the Invention
The present invention relates generally to an optical system, and more particularly to a five-piece wide-angle lens module.
2. Description of the Related Art
When a driver backs a car, he or she usually relies on the rear-view mirror and the side-view mirrors to see the road behind the car. However, the driver is still unable to see somewhere behind the car, which is called the "blind zone". Therefore, rear-view video cameras are installed on vehicles to assist the driver to have better rear visibility and wider field of view.
In some areas having obvious season changes, the temperature can go down to −20° C. or lower in winter and up to 60° C. or higher in summer. Therefore, the rear-view video cameras must have excellent and consistent imaging quality in high/low temperature environment, otherwise the rear-view video cameras can be unsatisfying.


Systems, methods and computer software are disclosed for fronthaul. In one embodiment a method is disclosed, comprising: providing a virtual Radio Access Network (vRAN) having a centralized unit (CU) and a distributed unit (DU); and

Virtual Radio Access Network (vRAN) is a potential new architecture for cellular networks. In some embodiments of this architecture, a split is defined between a distributed unit (DU) and a centralized unit (CU) with a main goal to break the strong coupling of software and hardware design per standard. Moreover, 5G adaptation depends on the flexibility required for software modifications combined with even stronger requirement to keep/lower DU hardware installation/upgrade cost. In other words, the Virtual-RAN architecture can be defined such that DU hardware upgrades will be limited to not required during the evolution of 5G while digital baseband (BB) design, including Modem part, will be easily changeable by software upgrade. Such flexibility is achievable since the DU should run on a computationally strong centralized platform.

Abstract: interconnecting the CU and DU over an Input/Output (I/O) bus using Peripheral Component Interconnect-Express (PCIe); wherein the CU and the DU include a PCI to optical converter and an optical to PCI converter.


Apparatuses, methods, and media for page coloring with color inheritance for memory pages are disclosed. Some embodiments may include an interface to access a memory and a paging unit including translation logic, inheritance logic, and comparison logic. The translation logic translates a first address to a second address based on an entry in a data structure, wherein the first address is provided by an instruction stored in a first page in the memory and the entry includes a base address of a second page in the memory including the second address and a color of the second page. The inheritance logic may determine an effective current page color of the first page based on a color of the first page. The comparison logic may compare the effective current page color of the first page to the color of the second page. Other embodiments are disclosed and claimed.

Memory based attacks are a significant threat to the security of information processing systems. Some such attacks involve storing malicious code, such as a virus or a worm, in the memory of a computer system, then exploiting bugs and/or buffer overflows while running legitimate programs to transfer control to the malicious code. Modern viruses and worms are thus able to breach the user/kernel boundary, causing widespread damage to the IT industry and other users of information processing systems. Security of information processing systems remains a complicated and important problem as intruders continue to develop new techniques to attack systems to cause damage, misappropriate information, or perform other unauthorized tasks.
One approach to preventing this type of attack is to include an "execute disable" bit in a page table entry that may be used to designate pages where data is stored as non-executable, so that malicious code could not be stored as data and subsequently executed within the same physical, linear or logical memory space. However, memory based attack techniques are becoming increasingly sophisticated, and additional approaches to preventing such attacks may be desired. This includes protections from buffer overflows that execute existing code or corrupt memory, malicious kernel or application components, rootkits, spyware, and computer viruses. It also includes protections from buggy code such as runaway pointers that corrupt data in other programs or subprograms within a linear address space.

Page coloring with color inheritance for memory pages


Embodiments of the disclosure provide an integrated circuit (IC) structure. The IC structure may include a first metal layer on a substrate, and a second metal layer on the substrate that is horizontally separated from the first metal layer. A dielectric material may include a first portion on the first metal layer, and having a first upper surface, a second portion on the second metal layer, and having a second upper surface, and a third portion on the substrate between the first metal layer and the second metal layer. The third portion of the dielectric material includes a third upper surface above the first upper surface of the first portion and the second upper surface of the second portion of the dielectric material.

In the microelectronics industry as well as in other industries involving construction of microscopic structures, there is a continued desire to reduce the size of structural features and microelectronic devices and/or to provide a greater amount of circuitry for a given chip size. Miniaturization in general allows for increased performance (more processing per clock cycle and less heat generated) at lower power levels and lower cost. Present technology is at nanometer level scaling of certain micro-devices such as inductors, transistors, resistors, and capacitors. Circuit chips with hundreds of millions of such devices are common.
Circuit fabricators are currently seeking to reduce the two-dimensional area occupied by device components, e.g., to reduce two dimensional area and power consumption while maintaining compliance with performance metrics. The fabrication of inductors in microcircuitry is especially challenging because an inductor's surface area will control its inductance during operation. In the case of magnetic elements such as wire coil inductors, such concerns may be especially important because alignment between the inductor and overlying materials, e.g., a corresponding magnetic core, will affect parameters such as magnetic field strength, inductance, etc. The processes implemented to form inductors, as well as other devices such as resistors and capacitors, may also affect the characteristics of other devices. Modifying a device structure to control electrical parameters such as inductance may affect other constraints, e.g., the planarity or thickness of overlying materials.

Integrated circuit structure with dielectric material to cover horizontally separated metal layers, and related method

GlobalFoundries Dresden Module One Limited Liability Company & Co. KG


An interturbine duct for channelling combustion gases between two axial turbine stages. The interturbine duct is made of sheet material to provide a relatively lightweight construction.

The interturbine duct (ITD), sometimes referred to as the interstage duct, channels hot combustion gases from an axial high pressure turbine (HPT) stage to an axial low pressure turbine (LPT) stage. In multi-spool turbofan engines, the ITD is an annular duct of significant length which is typically cast integrally as a part of the LPT vane set, and thus forms in essence an extension of the LPT vane, as shown in U.S. Pat. No. 5,485,717. As gas turbine engine size decreases, the casting size becomes an increasing proportion of the engine weight, since castings cannot scale down linearly as castings can only be made reliably down to a certain minimum thickness. U.S. Pat. No. 5,016,436 discloses a double-skinned sheet metal ITD arrangement, in which cooling air is circulated between the skins to cool the hot inner skin. The double skin also provides stiffening against the dynamic forces which the ITD encounters in normal use. Such a configuration is complex and bulky, however, not to mention expensive to manufacture.
Accordingly, there is a need to provide a new lightweight ITD construction.


A non-invasive sensor suitable for measuring the depth of fat in animal tissue is described, the sensor generating and transmitting focussed discrete narrow band microwave signals into the tissue, receiving reflected microwave signals from the tissue and providing magnitude and phase information of the reflected microwave signals for a processor to compute a value of the fat depth within the tissue.

The meat industry is becoming increasingly automated with the goal of becoming more efficient. Automated accurate measurement of the properties of animal tissue is therefore important to ensure efficient operation.
In particular, the accurate measurement of the composition and structure of meat carcasses, including fat depth, bone location and muscle thickness, is typically required. The measurement process is preferably non-contact to allow easier and faster measurement and assist in avoiding problems with contamination and cleaning.
Electromagnetic sensors, in particular microwave sensors have been used to detect the properties of animal tissue. Typical problems associated with the use of microwave energy include the need to focus the energy into a relatively small area or voxel, accounting for the different permittivity between different tissue samples, inaccuracies due to surface variation and the requirement for a robust sensor.
Known methods for focussing electromagnetic radiation into a voxel include the use of lenses, reflectors and synthetic aperture methods. These focus the radiation onto a specific area of the tissue and a measurement is taken of the reflected or scattered radiation. Different materials within the tissue are then detected by the energy of the reflected waves.
Traditionally, wide band signals have been used for the detection of the properties of tissue in order to obtain a required resolution. These may then be analysed using Fourier Transform and spectral estimation techniques. A disadvantage of using wide band signals is the generation of numerous spurious reflections and the requirement to use more complex and costly equipment capable of generating a wide range of frequencies. Also, the swept frequency range can not be reduced without sacrificing resolution in the detected signals. Furthermore, the generation and detection of a wide band signal requires relatively expensive equipment in comparison to narrow band systems. Problems are also encountered when attempting to measure the thickness of fat tissue as it is necessary to resolve the position of the small reflection that arises from the air-fat interface from the much larger and swamping reflection from the fat-meat interface.
The widely used Fast Fourier Transform Technique, when used over a limited bandwidth gives rise to significant errors for relatively minor errors in phase if unknown incidental scatterers are unaccounted for. Therefore, the position and response of these incidental scatterers must be determined for accurate measurement. This is acceptable only if long multiple path scatter is ignored. Spectral estimation techniques are a known method of accounting for the incidental scatterers. However, the computational burden of spectral estimation techniques is relatively expensive, requiring relatively high performance processors and therefore is not well suited to a harsh environment, due to lack of robustness.


A pressure modulator includes an electromagnetic coil wire wound about a hollow axle for developing a magnetic field when electrical current is applied to the wire, the hollow of the axle having an entrance port for receiving a fluid and a discharge port for discharging the fluid. The modulator serves to control the pressure of fluid flowing through a conduit under pressure and further includes a bleed-off tap connecting the conduit to the entrance port. A diaphragm plate is disposed above the coil of wire and axle and adjacent to the discharge port of the hollow to modulate the rate of fluid flow from the discharge port. The diaphragm plate includes a central void, a central section of magnetically attractable material disposed in the void above the coil of wire for attraction toward the coil when electrical current is applied to the coil to thereby limit the amount of fluid which is allowed to escape from the discharge port. The diaphragm plate also includes a pair of legs which extend from the periphery of the plate to the central section to hold the central section in place, and a biasing element disposed between the legs for selectively moving the central section toward or away from the coil of wire to provide a beginning position for the central section from which the central section will be attracted towards the coil.

This invention relates to a fluid pressure modulator for use, for example, in a current to pressure transducer system.
Current to pressure transducer systems have been used for some time to control output fluid pressure in a fluid carrying line. This control is effected by controlling bleed-off of the fluid in some type of pressure modulating device. The pressure modulating device, which is controlled by an electrical input signal, is connected to the fluid-carrying line to increase the bleed-off if less output pressure is desired and to decrease the bleed-off if a greater output pressure is desired. A pressure sensor senses the fluid output pressure and supplies an electrical signal representing that pressure to a comparator. The electrical input signal, whose value is to determine the output fluid pressure, is also supplied to the comparator and compared to the signal representing the sensed output pressure. If there is a difference between the two compared signals, the comparator supplies an electrical adjustment signal to the pressure modulator to either increase or decrease the bleed-off so that as to bring the output fluid pressure closer to the desired output pressure as represented by the value of the electrical input signal. In this manner, the fluid output pressure can be controlled and varied by varying the value of the electrical input signal. The above current to pressure transducer system is fairly conventional and systems similar to this, or at least component parts useable in such systems, are disclosed in U.S. Pat. Nos. 4,534,376, 4,481,967, 4,492,246, 4,325,399, 4,653,523, and 4,636,830.
Although there exist a variety of systems for controlling the output fluid pressure in a fluid carrying line by controlling bleed-off of the fluid, such systems oftentimes lack accuracy and precision, are sensitive to vibration, are sensitive to the mounting of the pressure modulating device, either do not allow for calibration or calibration is complicated, and generally are complicated in design and operation.


A tightening tool for tightening a fastener is disclosed which comprises a motor and a main shaft that engages with the fastener. A clutch is disposed between the motor and the main shaft so that the clutch rotates the main shaft by transmitting torque from the motor to the main shaft when a load acting on the main shaft is less than a predetermined value. The clutch shuts off torque transmission from the motor to the main shaft when the load acting on the main shaft reaches or exceeds the predetermined value. When in use, the current flowing to the motor and rotation angle of the main shaft of the motor are detected. The detected current and rotation angle are used to determine whether the tightening torque of the fastener is normal.

Japanese Patent Application Publication No. 11-179673 discloses a tightening tool for shutting off torque transmission to a fastener when the tightening torque of the fastener reaches a predetermined value. In this tightening tool, the rotary torque of a motor is transmitted to a main shaft via a clutch, and the fastener is tightened by rotating the main shaft. The clutch used in this type of tightening tool comprises a pair of mutually opposed clutch members and biasing means (e.g., a spring) for pressing one of the clutch members toward the other, for example. When the tightening torque of the fastener (i.e. the load acting on the main shaft) is lower than the predetermined value, the clutch members are maintained in an engaged state such that the torque of the motor is transmitted to the main shaft. On the other hand, when the tightening torque of the fastener reaches or exceeds the predetermined value, the state of engagement between the clutch members is released, and torque transmission from the motor to the main shaft is shut off.

Tightening tool and tightening tool management system


The synchronous logic device with reduced pin count scan chain includes: more than two flip/flops coupled to form a shift register for receiving a scan data input signal; a combinational logic circuit for receiving device inputs, generating flip/flop inputs for the more than two flip/flops, and generating an output signal; a first multiplexer for providing a clock signal to the more than two flip/flops during a test mode; a second multiplexer for selecting between a test mode output from the shift register and the output signal from the combinational logic circuit, and for providing a scan data output signal; and wherein the scan data input signal and the scan data output signal share an input/output pin.

Logic designs frequently use scan chains to enhance testability and test coverage. Typical scan chain implementations utilize four signals (Scan Data In, Scan Data Out, Scan Clock, and Scan Enable) connected to four pins. However, some small pin count packages do not have enough available pins even with a special test mode configuration.
Shown in FIG. 1 is a prior art general synchronous logic design implementation without the addition of a scan chain to facilitate testing. Pins A1, A2, and A3 are inputs, and pin A4 is an output. Pin SysClk provides the clock signal to node CLK of the flip/flops. Three flip/flops DTC0, DTC1, and DTC2 receive a common clock signal. They each receive one of the data input signals D1, D2, and D3 from the Combinational Logic circuit 20. The flip/flops DTC0, DTC1, and DTC2 have output signals Q1, Q2, and Q3 which are inputs to the Combinational Logic circuit 20. The Combinational Logic circuit 20 represents the combinational logic that generates the flip/flop inputs D1-D3 from the input signals A1-A3 and the flip/flop outputs Q1-Q3. The Combinational Logic circuit 20 also generates the output at pin A4 from input signals A1-A3 and the flip/flop outputs Q1-Q3. The number of input pins, the number of output pins, and the number of flip/flops can be significantly larger, but the circuit of FIG. 1 is sufficient to describe the operation of the device.
Shown in FIG. 2 is a prior art synchronous logic design implementation that includes a scan chain to facilitate testing by making the internal circuit nodes (the inputs and outputs of the combinational logic circuit) more controllable and more observable. This circuit is very similar to the circuit of FIG. 1 in that the Combinational Logic circuit 20 is the same and the circuit has the same number of flip/flops SDC0, SDC1, and SDC2. The flip/flops have been changed to scannable flip/flips which have an input selection multiplexer controlled by input node S to select between the normal mode input D (D1, D2, and D3) when the signal at node S is logic 0, and the scan mode input node SD when the signal at node S is logic 1. The signal at node S is determined by combining signal TestMode and signal ScanEnable at AND gate AND10. Multiplexer MUX10 is added to the circuit to select one of the input pins A3 (ScanClock) for the clock CLK to the flip/flops during the test mode of operation if the clock is not already from an external pin. Multiplexer MUX12 is added to select between the Q output Q3 of the last flip/flop SDC2 in the scan chain and the normal mode output Y4 (from the Combinational Logic 20 which could be the direct output of a flip/flop). And gate AND10 is added to ensure that the S inputs to the flip/flops are all set to logic 0 when the device is not in test mode of operation. This technique is called a scan chain because the flip/flops in the design are connected in a long chain to form a shift register in which data is input on a pin to the input of the first flip/flop. The output of the first flip/flop is connected to the input of the second flip/flop and so on until the output of the last flip/flop is connected to an output pin. This path allows the external testing circuitry to load the flip/flops in the design with any desired pattern by shifting in a set of data through the shift register. When the signal TestMode is logic 0, the logic performs it normal logic function. When the signal TestMode is logic 1, the logic circuit is configured for scan chain testing. During test mode, when the signal ScanEnable is set to logic 1 (node A1 in this example) the internal flip/flops are configured as a shift register with the input to the shift register from node A2 (ScanDataIn) and the output on node A4 (ScanDataOut). Pin A3 provides the clock (ScanClock) for the shift register. A complete set of data is shifted into the shift register (3 bits in this case). After this data is shifted in, the signal ScanEnable is set to logic 0 so that on the next active edge of signal ScanClock, the flip/flops latch data from the D inputs which come from the combinational logic circuit 20. Since the inputs to the combinational logic circuit 20 are able to be controlled by the data shifted into the flip/flops when signal ScanEnable=1, the inputs to the combinational logic circuit 20 are highly controllable. With signal ScanEnable=0, the flip/flops latch the output of the combinational logic circuit 20. By activating signal ScanClock only once while signal ScanEnable=0, the flip/flops will latch data from controlled inputs to the combinational logic circuit 20. By making signal ScanEnable=1, the data in the flip/flops can be shifted out on pin A4 (which can be simultaneous to shifting in the next set of input data). Monitoring the output data of the scan chain allows the data latched by the scan chain when signal ScanEnable=0 to be checked and this makes the design highly observable. This basic scan chain operation requires a minimum of 4 pins once the logic is enabled in test mode for signals ScanEnable, ScanDataIn, ScanDataOut, and ScanClock.

Reduced pin count scan chain implementation


Disclosed is a spindle for use with compressed core wound paper products such as toilet tissue and paper towels. One end of the spindle is generally circular and adapted to fit onto a conventional dispenser. The second end of the spindle also adapted to fit onto a conventional dispenser and is wedge-shaped for inserting into the core of a compressed core wound paper product and has an edge which is generally orthogonal the longitudinal axis of the spindle. The second end of the spindle may comprise another edge, which is not encountered until the spindle is partially inserted into the compressed core wound paper product. The second edge allows for expansion of the compressed core wound paper product to a generally circular cross section.

Core wound paper products are in constant use in daily life. Particularly, toilet tissue and paper towels are a staple in home and industry. Such products comprise a roll of the toilet tissue or a roll of paper towels wound in a spiral around a hollow center core. The hollow center core has a volume which is not used until a spindle is inserted into the product for dispensing by the consumer.
To reduce the cost associated with this unused volume, the cores of core wound paper products have been compressed for several years. Such compression reduces, or eliminates, the volume of the core prior to use and thereby decreases the overall volume of the entire core wound paper product. Reducing the volume of the entire core wound paper product favorably affects the price and cost of transportation, storage and shelving for such products.
For example, as early as 1889, U.S. Pat. No. 401,233 issued Apr. 9, 1889 to Wheeler disclosed a flattened roll of toilet paper having an interior reinforcement. The interior reinforcement had incisions to facilitate the insertion of a suspensory device from which the toilet paper was dispensed.
Later, U.S. Pat. No. 1,005,787 issued Oct. 10, 1911 to Sibley disclosed a corrugated core for packages of wound fabric. The package is compressed into a flattened state to occupy less space during transportation and stocking.
Similarly, U.S. Pat. No. 1,316,041 issued Sep. 16, 1919 to Johnson disclosed a flattened roll of toilet tissue having a core of material made with overlapping ends. The Johnson roll was bent from the flattened state into a kidney shape for application onto a dispensing fixture when it was desired to utilize the toilet tissue wound thereon.
When the compressed core wound paper product is ready to be used by the consumer, it must be rerounded to a generally cylindrical shape having a generally circular cross section. Rerounding is often effected as disclosed in U.S. Pat. No. 4,909,388 issued Mar. 20, 1990 to Watanabe. Watanabe discloses applying lateral compressive forces to the sides of the compressed core wound paper product so that rerounding occurs due to crepes and embosses on the paper product itself.
However, with the advent of the volume savings and the cost savings associated with compressing core wound paper products, inconveniences emerged for the end user. Depending upon the materials used for construction of the core, the substrate of the paper product wound thereon, the tension with which the paper product is wound, the compressibility of the paper product, the amount of compression or flattening applied, and other parameters, it may not be convenient to even begin the rerounding process.
Particularly, when it is desired to restore the round shape of the paper product and eliminate the flattened shape used for transportation, storage and shelving, the consumer may be confronted with difficulties. For example, often the core does not return to a circular cross section, but instead remains in an obround cross-section.
The type of compression or flattening applied to the core wound paper product varies from product to product. For example, commonly assigned U.S. Pat. No. 4,886,167 issued Jun. 11, 1991 to Dearwester discloses unilaterally compressed core wound paper product. U.S. Pat. No. 4,762,061 issued Aug. 9, 1988 to Watanabe et al. discloses multi-stroke bilaterally compressed paper product. The differences between unilateral and multi-stroke bilateral compression will affect the behavior of the core wound paper product upon rerounding.
Also, the amount of compression or flattening applied to the core wound paper product varies widely between different products. For example, U.K. Patent Application 709,363 published May 19, 1954 in the name of Samson teaches diametrically flattening the cores and core wound paper product. The aforementioned U.S. Pat. No. 4,909,388 issued to Watanabe teaches flattening the core wound paper product to one half of its original volume or less and maintaining a particular flattened cross section. Commonly assigned U.S. Pat. No. 5,027,582 issued Jul. 2, 1991 to Dearwester teaches applying unilateral compressive loading sufficient only to reduce the volume of and flatten the cores without substantially flattening the paper product wound thereon. Conversely, the aforementioned U.S. Pat. No. 1,005,787 issued Oct. 10, 1911 to Sibley discloses a somewhat elastic corrugated core which has an opening after compression is applied.
Clearly the substrate of the paper product, the type (unilateral or bilateral) and amount (whether compressed to a degree or flattened) of compressive loading will also affect the behavior of the core wound paper product upon rerounding. The consumer, who is unlikely to be aware of the substrate of the paper product or the amount and type of compressive loading used in manufacturing, will not know how to accommodate all of these factors when attempting to reround the package.
However, the consumer is presented with still other difficulties and inconveniences when attempting to reround the package. For example, when lateral compressive forces are applied to the product as disclosed in the aforementioned U.S. Pat. No. 4,909,388 issued to Watanabe, the consumer expects the opposed sides of the flattened or compressed core to expand outwardly and away from each other. Ideally, each half of the core is then oriented concave inwards toward the center of the core and towards the other half.
However, both halves of the core may buckle in the same direction, forming a somewhat crescent shaped cross section. This phenomenon may be referred to as core inversion and occurs when both sides of the core buckle so that the two halves of the core are concave in the same direction.
When core inversion occurs upon rerounding, it is very difficult for the consumer to insert a spindle through the opening in the center of the core. The opening is too small to freely admit the spindle and the opposed halves of the core do not readily expand outwardly to be concave in mutually opposite directions.
However, assuming core inversion does not occur and the package properly rerounds to a generally circular cross section, the consumer still has the step of inserting the spindle through the core of the core wound paper product. Various types of spindles, and dispensers are known in the art.
For example, U.S. Pat. No. 1,819,895 issued Aug. 18, 1931 to Hunt discloses a paper dispenser having a locking tongue with a hook-shaped member. Flattened toilet tissue having a slot is slid onto the dispenser so that the shank of the tongue bears against and engages the toilet tissue.
This teaching suffers from the drawback that the toilet paper does not rotate on the locking tongue and the locking tongue must be permanently mounted to a fixture which is generally not compatible with those commonly found in the homes of today's consumer. Furthermore, toilet tissue and paper towels sold today are not provided with slots and adapting slots to such core wound paper product would require an extra step in the manufacturing process, thereby increasing the cost to the consumer and offsetting any savings recognized through compressing the core wound paper product.
U.S. Pat. No. 4,765,475 issued Aug. 23, 1988 to Kaysserian discloses a container for storing and dispensing a plurality of rolls of stacked toilet tissue. The toilet tissue is inserted through a generally oval-shaped opening and onto a central support rod having a mushroom-shaped free end. This arrangement allows for providing a plurality of rolls of core wound paper product at the same time, while preventing their removal through the oval-shaped opening. However, this arrangement is not compatible with the single dispensing configuration found in most homes and most frequently used in industry. Nor does the oval-shaped opening through which the plurality of core wound paper products is inserted solve the aforementioned problems, difficulties, and inconveniences associated with the step of rerounding.
Other attempts to improve spindles used in dispensing core wound paper products have focused on the ends of the spindles. For example, U.S. Pat. No. 3,029,035 issued Apr. 10, 1962 to Layton discloses a roll supporting construction having an end with a circular recess and a circular bearing disposed therein and which conforms to the shape of the recess. U.S. Pat. No. 3,438,589 issued Apr. 15, 1969 to Jespersen discloses a dispenser which has circular shaped ends smaller in diameter than the central section of the core. The ends are recessed and press fitted into the central section of the core so that when the core wound paper product is exhausted, the core automatically falls from the dispenser.
U.S. Pat. No. 314,301 issued Feb. 5, 1991 to Cook discloses a toilet tissue roll dispenser having a notch and holes at one end. It is not clear what function, if any, is provided by the notch.
None of the aforementioned spindles or dispensers for core wound paper products eliminate the need for separate steps in rerounding the compressed core wound paper products and inserting a spindle therethrough. One inconvenience to the consumer could be eliminated if these two steps were combined.
From this review of the prior art, it is apparent there exists a need for a device to assist in rerounding a large variety of compressed core wound paper products without presenting undue difficulty or inconvenience to the consumer.
Accordingly, it is an object of this invention to overcome the problems in the prior art associated with rerounding various types of compressed core wound paper products. It is also an object of this invention to present a spindle which not only assists in rerounding the compressed core wound paper product, but which can also be used by the consumer without requiring substantial additional steps than would occur if the consumer were to use a core wound paper product which was not compressed or flattened. Finally, it is an object of this invention to provide a spindle which can be used not only with compressed core wound paper products, but with conventional dispensers as well.

Spindle for use with compressed core wound paper products


Methods are described for extending the service life of implantable sensors having a silver-containing anodic reference electrode maintained at a high impedance, at least one noble metal cathodic working electrode, and at least one noble metal anodic counter electrode maintained at a low impedance, particularly sensors for the in vivo detection of oxygen and/or glucose in bodily fluids. The methods described involve increasing the input impedance of the reference electrode up to a maximum for implanted circuitry and shielding said electrode, and/or alternating the operating roles of the reference and working electrodes, switching the working electrodes with counter electrodes in the circuit, reversing the polarities of the reference and working electrodes, and sequentially activating each electrode in a plurality of working and/or reference electrodes in the circuit. All of the circuitry means needed to control the steps described can be implanted with the sensor so that the steps can be performed while the sensor is in use in a patient.

1. Field of the Invention
The invention herein relates to implantable sensors for measuring bodily fluids. More particularly it relates to methods of extending the service life of such sensors.
2. Description of the Prior Art
The electrochemical oxygen sensor has been a powerful tool for revealing the role of oxygen in biological systems. Application of this sensor has been the main experimental methodology in many thousands of studies over more than 40 years. Virtually all, however, have been studies in which the sensor is used for a period of only a few days at most before recalibration is necessary. More recently there has been developed a stable oxygen sensor that is suitable for continuous application in long-term monitoring situations without the need of frequent recalibration. Such a sensor makes possible certain important oxygen monitoring applications that were not previously feasible.
This type of sensor, and its application as a component of an enzyme electrode-based system for continuously monitoring glucose, have been described in several prior patents: U.S. Pat. Nos. 4,650,547; 4,671,288; 4,703,756 and 4,781,798 the disclosures of which are incorporated herein by this reference. The system requires two oxygen sensors, one coupled to immobilized enzymes to detect oxygen modulated by the enzyme reaction, and the other to monitor the background oxygen concentration.
When a noble metal electrode (usually platinum or gold, which are slower to corrode than other metals) is immersed in an electrically conductive medium and held at a potential sufficiently cathodic with respect to an appropriate reference electrode, oxygen molecules in contact with the surface are reduced and an oxygen diffusion gradient is established, resulting in an electrical current. This phenomenon was observed and reported in the 19th century. Under controlled conditions, the reduction current may be related to oxygen concentration in the medium. This principle forms the basis of the amperometric (current-measuring) electrochemical oxygen sensor. It is recognized that the application of this principle will be influenced by factors such as: impurities in the media; pH and reaction intermediates; initial protonation of adsorbed oxygen; oxygen dissolved interstitially in the metallic electrode; the nature of the background electrolyte; and the degree of electrode surface oxide coverage.
The reaction pathways are complex. They include the kinetics of oxygen adsorption on and into the electrode and the formation of multiple metal-oxygen complexes involving short-lived intermediates. A detailed consideration of these pathways is not required here, but simplified models of the electrode reactions that are believed to explain many aspects are helpful in understanding the invention. These models are based on the observation that hydrogen peroxide is detected as an intermediate in the oxygen reduction process. One widely accepted mechanism in acidic media is the following two-step process: EQU O.sub.2 +2H.sup.+ +2e.sup.- .fwdarw.H.sub.2 O.sub.2 (1.1) EQU H.sub.2 O.sub.2 +2H.sup.+ +2e.sup.- .fwdarw.2H.sub.2 O (1.2)
In alkaline media, a similar process has been proposed: EQU O.sub.2 +H.sub.2 O+2e.sup.- .fwdarw.HO.sub.2.sup.- +OH.sup.-(2.1) EQU HO.sub.2.sup.- +H.sub.2 O+2e.sup.- .fwdarw.3OH.sup.- (2.2)
HO.sub.2.sup.- is the ionized form of H.sub.2 O.sub.2 that is present in alkaline media. These two sets of equations indicate that oxygen reduction can proceed by either a 2 or 4 electron process on platinum in aqueous solutions. These models have proven useful in analyses of functional electrodes.
When the electrode is polarized within a certain cathodic range, the rate of electrochemical reaction is sufficiently rapid that the process becomes mass transfer limited. This results in a current "plateau," in which there is relatively little variation in current with applied potential. The electrode can be most easily operated as a sensor in this potential range.
Certain three-electrode sensors of this type, especially those described in the aforesaid U.S. patents, have been shown to have long-term stability under well-defined in vitro and in vivo conditions. It has been found, however, that after a period of operation, such sensors tend to fail in one or the other of two characteristic modes. In most cases, the current rose abruptly and returned to the original value several times over the period of a few hours before finally remaining at a high, off-scale value. In other sensors, the current suddenly began to drift downward and fell over a period of several weeks.
It would be of significant value to have a method for preventing or deferring such failures, since such would be expected to substantially increase the operating service life of the sensors. It is therefore an object of this invention to provide such a method.

Method for increasing the service life of an implantable sensor

The Regents of the University of California


A method is provided that includes providing a mold on a temporary substrate, e.g., a sapphire substrate. Next, a material such as PZT paste is deposited into the mold. Then, the mold is removed to obtain elements formed by the mold. The formed elements will then be sintered. After sintering, electrode deposition is optionally performed. The sintered elements are then bonded to a final target substrate and released from the temporary substrate through laser liftoff. Further, electrodes may also be optionally deposited at this point.

The present exemplary embodiments relate to a method for forming ceramic (e.g., piezoelectric such as lead zirconate titanate (PZT)) thick film element arrays with fine feature size, high-precision definition, and/or high aspect ratios. It finds particular application in conjunction with high frequency and/or ultrasonic implementations, and will be described with particular reference thereto. However, it is to be appreciated that the present exemplary embodiment is also amenable to other like applications.
Ceramic thick films, especially piezoelectric thick film (thickness between 10 to 100 μm) element arrays with fine feature size, high-precision definition, and/or high aspect ratios have many applications in, for example, micro electromechanical systems (MEMS) devices, nondestructive testing and medical imaging. For example, as shown in FIG. 1, a one-dimensional (1-D) piezoelectric element array 10 for medical ultrasound imaging may comprise a plurality of high-aspect elements 12. To operate the piezoelectric element array 10 at the desired resonant frequency, i.e., that of the longitudinal mode, to obtain maximum acoustic power output, the thickness t of the piezoelectric elements should be approximately λPZT/2, where λPZT is the acoustic wavelength in PZT ceramics. As the sound velocity of PZT ceramics is about 4000 M/s and a typical frequency used in the present technology is 40 MHz, the thickness of the PZT elements should be approximately 50 μm. On the other hand, in order to reduce the side lobe of the waveform, the center-to-center distance d of the PZT elements should be about half of the acoustic wavelength in human organs, which is close to that of water. This results in the lateral dimension b of the PZT elements being approximately λwater/3. Considering λPZT≈(4/1.5)λwater, the height-to-width aspect ratio of the PZT elements should be at least (4/1.5)/2/(1/3)=4. Thus, for the 50 μm-thick PZT films, the lateral dimension b should be about 12.5 μm, and the spacing between the elements should be about 6.25 μm.
At present, there is a need for cost effective methods to directly form piezoelectric elements with a thickness between 10 to 100 μm, such as 50 μm. Moreover, there is a need for effective methods for forming arrays of elements with a high aspect ratio, as described above, in such a thickness range. Attempts to satisfy these needs are outlined below.
A method has been proposed for producing high aspect ratio PZT thick film elements by combining a sol-gel technique with SU-8 molding. N. Futai, K. Matsumoto, I. Shimoyama, "Fabrication of High-Aspect-Ratio PZT Thick Film Structure Using Sol-Gel Technique and SU-8 Photoresist," Technical Digest of MEMS 2002 IEEE International Conference, pp. 168-171 (2002). However, there is quite a large portion of organics in the sol-gel derived PZT elements, which needs to be burned out during sintering or annealing. This leads to the difficulty of densifying high-aspect-ratio sol-gel PZT films made by using a SU-8 mold, and thus affects the quality of the films. Second, due to the limited doping effect in the sol-gel films, the properties of the sol-gel derived PZT films cannot be easily tailored. That is, it is very difficult to make sol-gel PZT films to be intentionally soft or hard. Third, the sol-gel derived PZT films need to be annealed at 600° C. or higher, so the choice of the substrates is limited.
Others have proposed making 1-3 PZT/epoxy composites using soft molds and slip casting. S. Gebhardt et al., "Fine Scale Piezoelectric 1-3 Composites by Soft Mold Process: Preparation and Modeling," Ferroelectrics, v. 241, pp. 67-73 (2000). However, it is difficult to use these methods for elements having a very fine feature size, such as less than 10 μm in the lateral dimension or in spacing.
In U.S. Pat. No. 7,089,635 B2, bearing application Ser. No. 10/376,544, and Publication No. 2004/0164650 A1, filed on Feb. 25, 2003, entitled "Methods to Make Piezoelectric Ceramic Thick Film Array and Single Element and Devices," and naming Baomin Xu et al as inventors, a technique combining screen printing and laser liftoff has been proposed to make high quality piezoelectric ceramic element arrays on almost any kind of substrate. This method can provide high quality PZT elements because the PZT elements are sintered on a sapphire substrate and, thus, there is no limitation on sintering conditions. Also, for the final target substrate, this is a low-temperature and clean process because the PZT elements are transferred to the final target substrate after sintering. The cost of this method is also much lower than sol-gel processing because it uses conventional bulk raw materials and the sapphire substrate can be re-used.
In U.S. Pat. No. 7,070,668 B1, bearing application Ser. No. 11/017,325, filed Dec. 20, 2004 now U.S. Pat. No. 7,070,669, entitled "A Method for Forming Ceramic Thick Film Element Arrays," and naming Baomin Xu and Stephen David White, an alternative transfer technique has been proposed. That is, the printing substrate is advantageously provided with a release layer, and making it possible to release the printed and soft-baked ceramic elements from the printing substrate and transfer them to the sintering substrate. After sintering, the ceramic elements are transferred to the final target substrate.
However, there are several qualities of some screen printing methods that do not render them particularly advantageous when applied to high aspect ratio and/or very fine feature size implementations. First, it is difficult to make high thickness-to-width aspect ratio elements. Second, the smallest feature size and spacing for screen printing is about 50 μm, but many MEMS devices may require piezoelectric elements with dimensions smaller than 50 μm. Third, the edge of screen printed elements is not very sharp and there is typically a transition area along the edge.

Method for forming ceramic thick film element arrays with fine feature size, high-precision definition, and/or high aspect ratios


Various examples of the present invention relate to an electronic device and a method for displaying applications used in the electronic device. The electronic device includes a wireless communication unit; a touch screen; a processor coupled to the wireless communication unit and the touch screen; and a memory coupled to the processor, wherein the memory, when executed, stores instructions to cause the processor to control to: display, on the touch screen, an execution screen of a first application being executed among a plurality of applications having a stack order, display, on the touch screen, an execution screen of a second application among the plurality of applications according to the stack order, instead of the execution screen of the first application, in response to a first swipe gesture input from a first position of the touch screen while the execution screen of the first application is displayed, display, on the touch screen, an execution screen of a third application among the plurality of applications according to the stack order, instead of the execution screen of the first application, in response to a second swipe gesture input from a second position of the touch screen while the execution screen of the first application is displayed, and change the stack order of the first application, the second application, and the third application, based on a user input for interacting with one of the first application, the second application, and the third application. Other various examples are possible other than the examples disclosed in the present invention.

With the development of electronic device technology, various kinds of applications executable in a portable electronic device mounted with a touch screen have been presented.
Applications installed in a portable electronic device may be selectively executed in accordance with user tastes.
Recently, multi-tasking for simultaneously executing a plurality of applications in a portable electronic device becomes possible.
After performing the multi-tasking, switching of the applications may be performed between foreground and background.
The foreground may be an environment in which applications having high priority are executed, and the background may be an environment in which applications having low priority are not executed.

This patent is subject to a terminal disclaimer.

Electronic device and method for displaying application used therein