An electrochemical cell for etching a metal workpiece such as an aluminum foil, a method for etching the foil using the electrochemical cell, and foil thus produced is provided. The cell includes an etch tank having an etch electrolyte disposed therein and containing at least a first and a second compartment each containing (i)an etch electrolyte, (ii) a cathode plate, and (iii) an ion exchange membrane separator portion having an ion exchange polymeric material effective to substantially retard or prevent reduction of the oxidizing agent or agents present in the etch electrolyte, the first and second compartments being arranged in the etch tank with the ion exchange membrane separator portions in facing relationship one to the other; and a metal workpiece such as an aluminum foil anode present in the etch tank and disposed between each said first and second compartments.

Electrolytic capacitors typically comprise a metal oxide dielectric layer which is electrochemically formed on the surface of a metal anode. Such capacitors may be, for example, as disclosed in U.S. Pat. Nos. 4,609,971 and 5,143,591, both commonly assigned herewith. In such capacitors, for example, a conductive electrolyte is disposed in intimate contact with the outer surface of the dielectric. The metal anode forms one electrode of the capacitor while the conductive electrolyte forms the second electrode. The use of such metal anodes commonly involves anodization. Anodization is a well known electrochemical reaction wherein a film is grown on the anode in an electrochemical cell according to the basic equations EQU M+nH.sub.2 O.fwdarw.MO.sub.n +2nH.sup.+ +2ne (at the anode) EQU 2ne2nH.sub.2 O.fwdarw.nH.sub.2 +2nOH.sup.- (at the cathode)
An oxide is formed on the metal anode surface and hydrogen is evolved at the cathode. Anodization usually is undertaken in an aqueous electrolyte. At the anode, the reaction with the larger electronegative potential will occur. Oxide films can be prepared by methods well known in the art wherein a constant current is passed through the cell, the film thickness is proportional to the time for which the current is passed, and the voltage developed across the oxide film is a measure of the film thickness; or film may be formed under constant voltage conditions, all as is well known in the art.
Various processes are used to etch aluminum foil to make it suitable for use as and to enhance its properties when it is used as the anode in such electrolytic cells as described above. For example, it is customary to etch the foil surfaces to form microscopic holes and thereby increase the effective surface area (which foil surfaces may be masked to etch only selected areas as desired), and then to subject the foil to anodic oxidation to increase the electrostatic capacity of an electrolytic capacitor using such a foil. However, in the conventional etching techniques, dissolution of the aluminum foil surface either tends to proceed preferentially over the growth of the etching holes or etching proceeds slowly and inefficiently because of the ineffectiveness of the etch electrolyte and/or the rapid depletion of one or more essential components of the etch electrolyte.

Method of producing aluminum foil for electrolytic capacitors and product thereof

Philips Electronics North America Corporation


Disclosed herein is a system for purifying contaminated soil, which restores soil contaminated by a variety of pollutants to the condition before the contamination, and which itself provides the driving source required for the purification. The system includes: a dryer which dries contaminated soil, separates waste gas generated during the drying from the contaminated soil, and discharges the waste gas; a pyrolysis apparatus which indirectly heats the dried contaminated soil in a hermetic condition to divide the contaminated soil into purified soil and pyrolysis gas, and separately discharges the purified soil and the pyrolysis gas; a transfer fan for forcibly transferring the discharged pyrolysis gas; a burner for oxidizing the waste gas discharged from the dryer and the pyrolysis gas forcibly transferred by the transfer fan, to heat the pyrolysis apparatus; and a cooling facility for directly spraying cooling water on the discharged purified soil to cool the purified soil.

1. Field of the Invention
The present invention relates generally to a system for purifying contaminated soil, and, more particularly, to a system for purifying soil contaminated soil, which is designed to restore soil contaminated by a variety of oils, heavy metals, organic wastes, etc., to the condition before the contamination, and which itself provides a driving source required for the purification.
2. Description of the Related Art
With the development of sciences and technology, human civilization has correspondingly developed, and thus the human cultural environment has been highly improved. However, such development entails the generation of a variety of contamination and waste, and the contamination and waste destroy the natural environment, thus deteriorating the ecosystem.
Accordingly, in order to improve the ecosystem, human beings have researched a method of reducing the amount of contamination and waste, as well as realizing a method of efficiently treating the contamination and the waste.
The contamination and the waste, when illegally dumped on the ground or buried in the ground, cause contamination of the ground. Of course, soil has a natural self-purifying function. However, the natural purification of soil requires an excessively long purification period, and the soil loses its natural self-purifying capability in the case where it is severely contaminated, and thus it is not sufficiently capable of handling today's soil contamination.
In the past, a process of artificially purifying contaminated soil using a thermal desorption system was used.
The term "thermal desorption system" used herein refers to an apparatus for separating and eliminating contaminants contained in a contaminated medium, i.e., soil, through a thermal desorption reaction. More specifically, the thermal desorption system applies direct heat at a high temperature to the contaminated soil to burn the contaminated materials in the soil.
However, since the conventional thermal desorption system directly heats contaminated soil in the air to separate and oxidize contaminated materials contained in the soil, there is a problem in that moisture in the soil and water vapor in the air hinder the combustion of the contaminated materials, thus causing incomplete combustion of the contaminated materials contained in the soil. Furthermore, since incomplete combustion produces a large quantity of exhaust gas containing various contaminated materials, and the exhaust gas contains environmental pollutants, which play a role in atmospheric pollution, there is a severe problem in that the atmospheric pollution becomes worse despite the use of the thermal desorption system in the purification of contaminated soil.


A method for specifying a set of instructions selectable for generation by an instruction generator is disclosed. A class name representative of a class of instructions is identified and concatenated with a unique identifier label, thereby defining a unique singleton meta-mnemonic representative of a set of instructions. The class of instructions and the set of instructions are subsets of the instruction set of the processor. The resulting singleton meta-mnemonic specifies the set of instructions available for selection and generation by the instruction generator.

The present disclosure relates generally to a method and apparatus for specifying a set of instructions for selection by an instruction generator, and particularly to a method and apparatus for dynamically and conditionally specifying a set of instructions that are available for selection by an instruction stream testcase generator when choosing the next instruction to generate.
Testing of a superscalar microprocessor architecture requires the generation of a large number of instruction sequences to assure that the microprocessor behaves properly under a wide variety of circumstances. Verification techniques generally require automated testing systems that can turn out high volume testcases in an effort to sufficiently cover the realm of possible behaviors of the integrated circuit being tested. Testcases may be generated by a testcase generator in accordance with parameters specified in a file that are provided by a software design specialist or engineer, otherwise the generator generates random testcases.
Generation of instruction sequences can be pseudo-randomly selected or guided based on templates in input files that are specified by the engineer that detail the instructions to generate. Each instruction selection within a template can be an explicit instruction mnemonic, such as,                n1: LR, where the instruction LR is explicitly defined;        a control statement that guides the selection of a given list of instruction mnemonics and/or macros, such as,        Oneof(AR;AEBR;), where the control statement "Oneof" selects one explicit mnemonic from a list, such as a list of two as shown; or        a group identifier/macro that gets replaced with a control statement and/or list of mnemonics, such as,        AnyHalfOp( ) is defined as One of(LH;STH;)        Sequence(1.5 AnyHalfOp( )), where the control statement Sequence selects a random range of 1 to 5 instances of the macro.
Control statements and macros are used to generalize the template so that various instruction combinations can be tested with only one template. Macros may be declared external to the template and imported into more than one template.
New instructions that are added to the architecture of a processor require testing, which typically involves updating macros or instruction templates previously defined, thereby enabling them to be included in the new instruction set. New macros also need to be manually created to handle new groupings of instructions, whether based on architecture attributes or user selected groupings, which typically involves listing each instruction that is a part of the newly created grouping. Occasionally, instructions need to be avoided in the testcase generation, whether due to a segmented design or an instruction that is not yet fully implemented. Additionally, each explicit mnemonic reference, control statement, or macro that uses the new instruction typically needs to be temporarily updated to remove the new instruction and then updated again when the instruction is available for testing.
Macros with large lists of instructions are storage and computationally intensive as they are expanded to create structures for each control statement and each mnemonic listed. Typically these macros are reused multiple times in an instruction stream template. When selecting instructions based on a specific state of the machine, a macro needs to be created for each instruction in this grouping and must be utilized with the corresponding initialization file to insure the existence of the specific state.
Instruction sequence generators typically have attributes associated with each instruction in the architecture. Operand characteristics can also be specified for each operand of the instruction. These are usually kept with the instruction in some table format, such as:                OP(2A) MNEM(ADR) FMT(RR) CLASS(HFP, CC_Set) . . .        OP(50) MNEM(ST) FMT(RX) CLASS(General, Store) . . .        OP(E378) MNEM(LHY) FMT(RXY) CLASS(zArch, General, Fetch, LongDisp) . . .        OP(B31A) MNEM(ADBR) FMT(RRE) CLASS(BFP, CC_Set).
The architecture table is parsed and kept as an internal table to the generator. Use of the table facilitates testcase generation by having these instruction attributes and instruction operand characteristics readily available in a table lookup. Some of these instruction features include classifications of the instruction, that is, which class the instruction belongs to. The class identifier is a generic description for the type of instruction (such as Binary floating point), or what architecture facility it is a part of (such as Long Displacement Facility), or what format the instruction is (such RR, RRF, for example), or which architecture the instruction is valid in (such as zArch). Other instruction attributes and instruction operand attributes can be contained in the architecture table and can include instruction action (such as CC_Setter), or operand type (such as Fetch or Store).
Mnemonic specification for template guided instruction stream generation typically includes the use of explicit assembler mnemonics, control statements with a list of mnemonics, and group identifiers/macro expansion of mnemonics. Control statements guide the generation and selection of a given list of mnemonics. These control statements typically include the following types:    Sequence(n..m <substream>), which psuedo-randomly selects a number (i), such that (n<=i<=m) and creates (i) instances of <substream>;    Oneof(<substreamlist>), which psuedo-randomly selects and creates one element of the <substreamlist>;    Anyorder(<substreamlist>), which psuedo-randomly creates any permutation of the order of the items in <substreamlist>;    where,    <substream> represents either an explicit mnemonic, macro, or control statement, and    <substreamlist> represents a list of one or more <substream> elements.
As noted above, superscalar processors utilize large instruction sets that need to be tested by the production and execution of a large number of instruction sequences. To accomplish this, instruction stream testcase generators need to turn out high volume testcases in order to sufficiently cover the realm of possible behaviors of the integrated circuit being tested. Accordingly, it would be advantageous to have a testcase generator that could effectively and efficiently generate the necessary instruction stream testcases.

Method and system for specifying sets of instructions for selection by an instruction generator

International Business Machines Corporation


Pavement aging can be reduced by applying to an asphalt-containing pavement a topcoat layer or a surface treatment containing asphalt binder with sterols.

Asphalt pavement is a composite material that is a mixture of mineral aggregate and a liquefied asphalt (bitumen) binder, which hardens to form a robust surface. The bitumen is generally liquefied through heating. Asphalt pavements can also be produced using bitumen that has been blended with solvents (known as cutbacks) or bitumen that has been dispersed in water (known as asphalt emulsions). Asphalt pavements can include reclaimed or recycled materials containing reclaimed asphalt pavements (RAP), reclaimed asphalt shingles (RAS), ground tire rubber, and other post-consumer waste materials. Asphalt pavement deteriorates over time from oxidation of asphalt binder, heavy loads, moisture damage and varying climatic conditions resulting in fatigue cracking which then further accelerates the deterioration of the overall pavement.
Methods for restoring or repairing deteriorated asphalt pavement include removing and replacing the existing pavement with either newly prepared or recycled pavement. The lifetime of existing pavement may also be extended by applying certain surface treatments.


An array of sensor pixels is formed on a substrate, and a signal processing unit is connected to the array of sensor pixels. The signal processing unit includes multiple spectral channels that are defined by a respective transmission curve of each optical filter of at least one associated sensor pixel. Each of the sensor pixels includes a stack of a respective photodetector and a respective optical filter. Each spectral channel receives an output signal from one or more sensor pixels including an optical filter having the same transmission curve. At least one spectral channel has a greater number of sensor pixels than another spectral channel among the multiple spectral channels. The different number of pixels for the spectral channels can be employed to compensate for variations of sensor efficiency as a function of wavelength. Adjustment to sensor gain can be minimized through use of different number of pixels for different spectral channels.

A spectrometer, or a spectrum sensor, is an instrument configured to analyze the spectral distribution of impinging light. The spectrometer differs from imagers or cameras in that the spectrometer does not generate a spatial map of incoming light or a two-dimensional image at one or more (typically three) wavelength bands, but generates a spectral image of the entire impinging light without regard to spatial distribution of the intensity of light. The spectral image includes a set of intensity measurements for each wavelength range, which is herein referred to as a spectral channel or a "spectral channel." Typically, a spectral image covers the entire visible spectrum, which is the wavelength range from 400 nm to 800 nm. Some spectrometers can cover a subset of the infrared wavelength range, which includes the wavelength range from 800 nm to 1 mm. Some spectrometers can also cover a subset of the ultraviolet wavelength range, which includes wavelength range from 10 nm to 400 nm. Typically, more than 10 spectral channels, such as 100 or more spectral channels, are employed in a spectrometer.
An "on-chip spectrometer," an "on-chip spectrum sensor," a "spectrometer-on-chip," or a "spectrum sensor on chip" refers to a spectrometer employing a single chip on which semiconductor devices for measuring the intensity of light at a respective spectral channel are mounted in parallel. The on-chip spectrometers differ from conventional spectrometers most prominently by the size. Typically, an on-chip spectrometer has a dimension less than 10 cm×10 cm×10 cm, such as less than 7 cm×5 cm×5 cm, and may weigh less than 200 g. This is a tremendous improvement in portability compared to conventional spectrometers, which typically have a dimension greater than 70 cm×50 cm×50 cm, and weigh at least 30 kg. The portability of the on-chip spectrometer is achieved by employing solid-state devices for each component of the spectrometer. Thus, a dispersive prism and a collimator in a conventional spectrometer is replaced by an array of band pass filters that allow passage of light only within the respective wavelength range, and an array of solid state detectors underlying the array of band pass filters. An example of such an on-chip spectrometer is described in U.S. Pat. No. 8,284,401 B2 to Choi et al. and U.S. Pat. No. 8,542,359 B2 to Choi et al, which are assigned to NanoLambda, Inc. as of 2017.
Optical spectroscopy allows complete characterization of the spectral distribution of light emanating from an object or an ambient. The information contained in the spectral distribution of light can be captured by a spectrometer, and can be used to detect and quantify the characteristics or concentration of a physical, chemical, or biological object. Spectroscopy is a non-destructive measurement. For example, optical diagnostics using spectroscopy allows acquisition of chemical and/or biological information without taking a physical specimen.
A performance metric for spectrometers is accurate characterization of intensity distribution of impinging light across the multiple spectral channels. In order to provide accurate measurement of intensity for the impinging light, the spectral channels of the spectrometer need to provide the same sensitivity across the entire measurement wavelength range of the spectrometer. In other words, the spectrometer needs to generate the same measured spectral intensity for the same number of photons irrespective of the energy of the photons. This is a very challenging task because sold state photodetectors display a non-uniform detection efficiency curve across the visible spectrum. This challenge becomes even more significant for on-chip spectrometers, which cannot alter the scan speed across the wavelength range in order to compensate for the non-uniform detection efficiency as a function of wavelength. In addition, the spectral responses of different filters for on-chip spectrometers are also non-uniform which multiply the non-uniformity of spectral response. In order to provide a high performance on-chip spectrometer, therefore, a method of compensating for the non-uniform detection efficiency of semiconductor detectors is desired.

On-chip spectrometer employing pixel-count-modulated spectral channels and method of manufacturing the same


An operation circuit is set to a conductive state in a case where a three-phase alternating-current power supply switching circuit receives an R phase and an N phase. An internal switch is set to a non-conductive state in a case where the state of the operation circuit is the conductive state. One contactor electrically connects an input terminal to output terminals in a case where the state of the operation circuit is the conductive state. Another contactor electrically disconnects input terminals from the output terminals in a case where the state of the internal switch is the non-conductive state.

1. Field of the Invention
The present invention relates to a three-phase alternating-current power supply switching circuit compatible with a plurality of kinds of three-phase alternating-current power supplies.
2. Description of the Background Art
A three-phase alternating-current power supply is used for various technologies. Japanese Patent No. 3900444 discloses a technology as an example in which the three-phase alternating-current power supply is used (hereinafter referred to as a related technology A). Three power conversion parts are used in the related technology A. Moreover, the related technology A controls switching such that the three-phase alternating-current power supply is connected to each power conversion part in a star connection upon a high input voltage and in a delta connection upon a low input voltage. This ensures that each element of a downstream circuit is resistant to a wide range of the input voltages.
Furthermore, a thyristor is used as a switching means that controls switching in the related technology A. The related technology A switches a state of the switching means on the basis of a phase-to-phase voltage (200 V or 400 V) of the three-phase alternating-current power supply.
The three-phase alternating-current power supply includes a plurality of kinds of systems, such as a three-phase three-wire system and a three-phase four-wire system. Thus, a three-phase alternating-current power supply switching circuit compatible with the plurality of kinds of three-phase alternating-current power supplies is required.
In the related technology A, the switching means is used to be compatible with the plurality of kinds of three-phase alternating-current power supplies. However, the thyristor is used as the switching means in the related technology A. Consequently, the related technology A requires a drive circuit for switching the thyristor, a timing control circuit, and a circuit for determining whether or not to control the switching. Therefore, the related technology A has the complex configuration compatible with the plurality of kinds of three-phase alternating-current power supplies.

Three-phase alternating-current power supply switching circuit


Multifrequency focusing is applied to measurements made with a multicomponent resistivity logging tool in an earth formation having resisitivity anisotropy. From knowledge of relative dip and azimuth of the borehole relative to the formation, two modes can be separated, one of which is dependent substantially on the horizontal resistivity. Alternatively, mode separation and angle determination can be made simultaneously.

1. Field of the Invention
The invention is related generally to the field of interpretation of measurements made by well logging instruments for the purpose of determining the properties of earth formations. More specifically, the invention is related to a method for determination of anisotropic formation resistivity in a deviated wellbore using multifrequency, multicomponent resistivity data.
2. Description of the Related Art
Electromagnetic induction and wave propagation logging tools are commonly used for determination of electrical properties of formations surrounding a borehole. These logging tools give measurements of apparent resistivity (or conductivity) of the formation that, when properly interpreted, are diagnostic of the petrophysical properties of the formation and the fluids therein.
The physical principles of electromagnetic induction resistivity well logging are described, for example, in, H. G. Doll, Introduction to Induction Logging and Application to Logging of Wells Drilled with Oil Based Mud, Journal of Petroleum Technology, vol. 1, p. 148, Society of Petroleum Engineers, Richardson Tex. (1949). Many improvements and modifications to electromagnetic induction resistivity instruments have been devised since publication of the Doll reference, supra. Examples of such modifications and improvements can be found, for example, in U.S. Pat. No. 4,837,517; U.S. Pat. No. 5,157,605 issued to Chandler et al, and U.S. Pat. No. 5,452,761 issued to Beard et al.
A limitation to the electromagnetic induction resistivity well logging instruments known in the art is that they typically include transmitter coils and receiver coils wound so that the magnetic moments of these coils are substantially parallel only to the axis of the instrument. Eddy currents are induced in the earth formations from the magnetic field generated by the transmitter coil, and in the induction instruments known in the art these eddy currents tend to flow in ground loops which are substantially perpendicular to the axis of the instrument. Voltages are then induced in the receiver coils related to the magnitude of the eddy currents. Certain earth formations, however, consist of thin layers of electrically conductive materials interleaved with thin layers of substantially non-conductive material. The response of the typical electromagnetic induction resistivity well logging instrument will be largely dependent on the conductivity of the conductive layers when the layers are substantially parallel to the flow path of the eddy currents. The substantially non-conductive layers will contribute only a small amount to the overall response of the instrument and therefore their presence will typically be masked by the presence of the conductive layers. The non-conductive layers, however, are the ones that are typically hydrocarbon bearing and are of the most interest to the instrument user.
The effect of formation anisotropy on resistivity logging measurements has long been recognized. Kunz and Moran studied the anisotropic effect on the response of a conventional logging device in a borehole perpendicular to the bedding plane of a thick anisotropic bed. Moran and Gianzero extended this work to accommodate an arbitrary orientation of the borehole to the bedding planes.
Rosthal (U.S. Pat. No. 5,329,448) discloses a method for determining the horizontal and vertical conductivities from a propagation or induction well logging device. The method assumes the angle between the borehole axis and the normal to the bedding plane, is known. Conductivity estimates are obtained by two methods. The first method measures the attenuation of the amplitude of the received signal between two receivers and derives a first estimate of conductivity from this attenuation. The second method measures the phase difference between the received signals at two receivers and derives a second estimate of conductivity from this phase shift. Two estimates are used to give the starting estimate of a conductivity model and based on this model, an attenuation and a phase shift for the two receivers are calculated. An iterative scheme is then used to update the initial conductivity model until a good match is obtained between the model output and the actual measured attenuation and phase shift.
Hagiwara (U.S. Pat. No. 5,656,930) shows that the log response of an induction-type logging tool can be described by an equation of the formV∝i/L3(−2eikL(1−ikL)+ikL(eikβ−eikL))  (1)whereβ2=cos2 θ+λ2 sin2 θ  (2)andk2=ω2μ(εh+iσh/ω)  (3)where L is the spacing between the transmitter and receiver, k is the wave number of the electromagnetic wave, μ is the magnetic permeability of the medium, θ is the deviation of the borehole angle from the normal to the formation, λ is the anisotropy factor for the formation, ω is the angular frequency of the electromagnetic wave, σh is the horizontal conductivity of the medium and εh is the horizontal dielectric constant of the medium.
Eq. (1) is actually a pair of equations—one corresponding to the real part and one corresponding to the imaginary part of the measured signal—and has two unknowns. By making two measurements of the measured signal, the parameters k and β can be determined. The two needed measurements can be obtained from (1) R and X signals from induction logs, (2) phase and attenuation measurements from induction tools, (3) phase or attenuation measurements from induction tools with two different spacings, or (4) resistivity measurements at two different frequencies. In the low frequency limit, ε can be neglected in Eq. (3) and from known values of ω and μ, the conductivity ω can be determined from k, assuming a value of μ equal to the permittivity of free space.
Wu (U.S. Pat. No. 6,092,024) recognized that the solution to Eqs. (1)-(3) may be non-unique and showed how this ambiguity in the solution may be resolved using a plurality of measurements obtained from multiple spacings and/or multiple frequencies. The methods of Rosthal, of Hagiwara, and of Wu can only be used in deviated boreholes where the borehole axis makes a nonzero angle to the normal to the bedding plane.
One solution to the limitation of the induction instruments known in the art is to include a transverse transmitter coil and a transverse receiver coil on the induction instrument, whereby the magnetic moments of these transverse coils is substantially perpendicular to the axis of the instrument. Such a solution is suggested in Tabarovsky and Epov, ("Geometric and Frequency Focusing in Exploration of Anisotropic Seams", Nauka, USSR Academy of Science, Siberian Division, Novosibirsk, pp. 67-129 (1972).) using various arrangements of transverse transmitter coils and transverse receiver coils as well as simulations of the responses of these transverse coil systems. Tabarovsky and Epov also describe a method of substantially reducing the effect on the voltage induced in transverse receiver coils which would be caused by eddy currents flowing in the wellbore and invaded zone. The wellbore signal reduction method described by Tabarovsky and Epov can be described as "frequency focusing", whereby induction voltage measurements are made at more than one frequency, and the signals induced in the transverse receiver coils are combined in a manner so that the effects of eddy currents flowing within certain geometries, such as the wellbore and invasion zone, can be substantially eliminated from the final result. Tabarovsky and Epov, however, do not suggest any configuration of signal processing circuitry which could perform the frequency focusing method suggested in their paper.
Strack et al. (U.S. Pat. No. 6,147,496) describe a multicomponent logging tool comprising a pair of 3-component transmitters and a pair of 3-component receivers. Using measurements made at two different frequencies, a combined signal is generated having a reduced dependency on the electrical conductivity in the wellbore region. U.S. Pat. No. 5,781,436 to Forgang et al, the contents of which are fully incorporated herein by reference, discloses a suitable hardware configuration for multifrequency, multicomponent induction logging.
U.S. Pat. No. 5,999,883 issued to Gupta et al, (the "Gupta patent"), the contents of which are fully incorporated here by reference, discloses a method for determination of an initial estimate of the horizontal and vertical conductivity of anisotropic earth formations. Electromagnetic induction signals induced by induction transmitters oriented along three mutually orthogonal axes are measured at a single frequency. One of the mutually orthogonal axes is substantially parallel to a logging instrument axis. The electromagnetic induction signals are measured using first receivers each having a magnetic moment parallel to one of the orthogonal axes and using second receivers each having a magnetic moment perpendicular to a one of the orthogonal axes which is also perpendicular to the instrument axis. A relative angle of rotation of the perpendicular one of the orthogonal axes is calculated from the receiver signals measured perpendicular to the instrument axis. An intermediate measurement tensor is calculated by rotating magnitudes of the receiver signals through a negative of the angle of rotation. A relative angle of inclination of one of the orthogonal axes that is parallel to the axis of the instrument is calculated, from the rotated magnitudes, with respect to a direction of the vertical conductivity. The rotated magnitudes are rotated through a negative of the angle of inclination. Horizontal conductivity is calculated from the magnitudes of the receiver signals after the second step of rotation. An anisotropy parameter is calculated from the receiver signal magnitudes after the second step of rotation. Vertical conductivity is calculated from the horizontal conductivity and the anisotropy parameter. One drawback in the teachings of Gupta et al is the step of determination of the relative angle of inclination of the required measurements of three components of data with substantially identical transmitter-receiver spacings. Because of limitations on the physical size of the tools, this condition is difficult to obtain; consequently the estimates of resistivities are susceptible to error. In addition, due to the highly nonlinear character of the response of multicomponent tools, such inversion methods are time consuming at a single frequency and even more so at multiple frequencies.
U.S. Pat. No. 6,574,562 to Tabarovsky et al. teaches a computationally fast method of determination of horizontal and vertical conductivities of subsurface formations using a combination of data acquired with a transverse induction logging tool such as the 3DEXSM tool of Baker Hughes Incorporated and data acquired with a conventional high definition induction logging tool (HDIL). The data are acquired in a vertical borehole. The HDIL data are used to determine horizontal resistivities that are used in an isotropic model to obtain expected values of the transverse components of the 3DEXSM. Differences between the model output and the acquired 3DEXSM data are indicative of anisotropy, and this difference is used to derive an anisotropy factor. The method described therein has difficulties in deviated boreholes as the HDIL measurements used to derive the isotropic model are responsive to both horizontal and vertical resistivity. The procedure disclosed in Tabarovsky '562 is iterative.
U.S. Pat. No. 6,636,045, to Tabarovsky et al., discusses a method of logging subsurface formations using data acquired with a transverse induction logging tool, the formation having a horizontal conductivity and a vertical conductivity, by obtaining a plurality of frequencies measurements indicative of vertical and horizontal conductivities in a tool referenced coordinate system. The data are transformed to a subsurface formation coordinate system. Multifrequency focusing is applied to the measurements at a plurality of frequencies. Horizontal formation conductivities are determined from a subset of the focused conductivity measurements. Vertical formation conductivities are determined from the focused conductivity measurements associated with the subsurface formation and the horizontal conductivities. The method of Tabarovsky '045 required an estimate of the inclination angle and iteratively determines an estimate of the conductivities.
There is a need for a fast and robust method of determination of anisotropic resistivity without the need of an accurate estimate of angles and a fast procedure for determining the resistivity values. Such a method should preferably be able to use multifrequency measurements. The present invention satisfies this need.

Determination of formation anistrophy, dip and azimuth


In accordance with one embodiment, a navigation system includes a display device configured to detect user gestures, a data storage device including program instructions stored therein, a map stored within the data storage device, and a controller operatively coupled to the data storage device and the display device and configured to execute the program instructions to receive first user gesture data associated with a first portion of a first user gesture from the display device, generate a first predicted user gesture data based upon the stored map and the first user gesture data, and control the display device to render the first predicted user gesture data as the user is continuing the first user gesture.

For a navigation system, such as an in-car system, speech provides a natural modality of interaction. Speech, however, is constrained by the limitation of the language. For example, if a user wants to find restaurants or other points of interest (POIs) in a specific geographical area or a specific segment of a street, it is difficult for the user to describe the specific geographical area with language.
The limitations of speech have been addressed in some systems which incorporate a touch screen. In some of these systems, a user can "draw" a circle around a specific geographic location on the map using "gestures". The drawing is made in a layer located above the depicted map. The system then applies the drawn geometric shape to the underlying map to specifically identify the geographic area of interest. Some of these systems can identify user gestures in the form of shapes, lines, and points. Thus, a user can use a circle-shaped gesture to identify a particular geographic region, or a line-shaped gesture to identify a street. In some known systems, once a specific geographic area is identified using gestures, various information about particular POIs within the specific geographic area may be extracted and communicated to the user.
While beneficial in many respects, known systems have various limitations. By way of example, while some systems include a form of error correction wherein a geographic shape is identified from one or more gestures which form an imperfect geometric shape, a user must still substantially complete the shape and then wait to see if the system correctly identifies the shape. The need to substantially complete drawing of the shape and then waiting to see if the system has correctly identified the shape results in undesired complication and delay. Such complications and delay can be distracting, particularly in situations where a driver of a vehicle is attempting to form the shape.
What is needed is a navigation system which intuitively identifies a geographic shape using partial gestures. A navigation system which predicts geographic areas based on user gesture data and conforms the predicted gesture data to a user-intended geographical feature of the map would be beneficial.

System and method for autocompletion and alignment of user gestures


A method for TCR-independent T cell activation which comprises the co-ligation of CD28 and CD81.

T cells constitute about 60% of circulating blood leukocytes and play a central role in adaptive immunity. T cells recognise protein antigens complexed with MHC molecules through their T cell receptor-CD3 ("TCR/CD3") complex. Naïve T cells need additional signals provided by professional antigen presenting cells (APCs), for example, CD28-CD80/86 interactions. It is well established that the triggering of the TCR is a central event in T cell activation and that ligation of additional co-stimulatory molecules is necessary for full stimulation of T cells.
Recently, TCR-independent methods of T cell activation have been disclosed. For example, the TCR-independent CD28 signal leads the selective transcription of survival (Bcl-xL) and inflammatory (IL-8 and B cell activation factor), but not proliferative (IL-2) genes, in a NFκB-dependent manner [1]. Further, ref. 2 teaches that, in the absence of TCR ligation, CD28 stimulation induced Th2 differentiation of memory, but not of naïve CD4(+) T cells.
It is an object of the invention to provide further and improved methods for TCR-independent T cell activation.


A machining, recording, and reproducing apparatus using a scanning probe microscope comprising: a probe equipped with a probe tip at its front end, a vibration application portion consisting of a piezoelectric vibrating body and an AC voltage-generating portion, a vibration-detecting portion consisting of a quartz oscillator and a current/voltage amplifier circuit, a coarse displacement device for bringing the probe close to a surface of a sample, a sample-to-probe distance control device consisting of a Z fine displacement element and a Z servo circuit, a two-dimensional scanning device consisting of an XY fine displacement element and an XY scanning circuit, and a data-processing device for converting a measurement signal into a three-dimensional image. The probe is held to the quartz oscillator by spring pressure of a resilient body.

The present invention relates to apparatus for machining, recording, and reproducing, using a scanning probe microscope that utilizes a quartz oscillator to control the position of a probe.
Known methods for position control in a scanning probe microscope include a method consisting of detecting a tunneling current, a method consisting of detecting evanescent light, and a method consisting of detecting an atomic force. One form of scanning probe microscope making use of a tunneling current for the control of a probe is a scanning tunneling microscope (STM). One form of scanning probe microscope in which evanescent light is employed for the control of a probe is a photon STM. However, limitations are imposed on samples capable of being measured. Therefore, principal applications lie in an atomic force microscope (AFM) where an atomic force is used to control the position of a probe and in a near-field scanning optical microscope (NSOM). One method of detecting an atomic force consists of detecting displacements of a probe by means of laser light. Another method makes use of variations in the current generated by a quartz oscillator.
A scanning probe microscope in which laser light is used to detect displacements of a probe is disclosed, for example, in Patent Unexamined Publication No. 50750/1994, entitled, "Scanning Microscope Including Force-Detecting Means", by Robert Erik Betzig. An example of a scanning probe microscope in which a quartz oscillator is used to detect displacements of a probe is disclosed in App. Phys. Lett. 66(14), 1995, pp. 1842-1844, by Kaled Karai et al. These instruments are outlined below.
FIG. 2 is a schematic view of the prior art "scanning probe microscope using laser light". The tip of an optical fiber 310 is machined into a tapering form 70. A sample stage 20 is placed on an XYZ stage 50. A sample 30 is set on the sample stage. The optical fiber probe 70 is vibrated parallel to the sample surface, using a fine displacement element 40. A horizontal force from the sample surface, or a shear force, acts on the tip of the probe. Thus, the state of the vibration of the probe varies. To measure the state of vibration of the probe 70, laser light (not shown) used for position control is directed at the tip, and the shadow of the probe 70 is detected by a lens 90 and a photodetector 30. The distance between the sample surface and the tip of the probe is controlled, using the fine displacement element 40, so that the shear force is kept constant, i.e., the rate at which the amplitude or phase varies is kept constant. The shear force drops rapidly with the distance from the sample. Utilizing this, the distance between the sample surface and the tip of the probe is kept constant on the order of nanometers. The sample surface is raster-scanned, using the XYZ fine displacement element 40. In this way, the topography of the sample surface can be measured on the order of nanometers. Under this condition, an electric field, magnetic field, electric current, light, heat, pressure, or the like is applied to the sample surface. Thus, the sample surface can be machined or processed. In addition, information can be recorded by forming a distribution of machining on the sample surface, using a sample-moving means. In addition, the information can be reproduced by successively measuring the information machined into the surface by the use of the sample-moving means.
FIG. 3 is a schematic view of main portions of the prior art "scanning probe microscope using a quartz oscillator". Indicated by 400 is an optical fiber probe, and indicated by 410 is a quartz oscillator. The optical fiber probe is bonded to the quartz oscillator with adhesive. The quartz oscillator is made to resonate, using a piezoelectric device (not shown) for vibrations. Vibration of the quartz oscillator vibrates the optical fiber probe. As the tip of the probe approaches the sample, a horizontal force from the sample surface, or a shear force, acts on the tip of the probe. Thus, the state of the vibration of the probe varies. The state of vibration of the quartz oscillator is measured by measuring electric charge generated by a piezoelectric effect of quartz. The distance between the sample surface and the tip of the probe is controlled, using a piezoelectric scanner (not shown) so that the shear force is kept constant, i.e., the rate at which the amplitude or phase varies is kept constant. The shear force drops rapidly with the distance from the sample. Utilizing this, the distance between the sample surface and the tip of the probe is kept constant on the order of nanometers. The sample surface is raster-scanned, using an XYZ fine displacement element (not shown). In this manner, the topography of the sample surface can be measured on the order of nanometers. Under this condition, an electric field, magnetic field, electric current, light, heat, pressure, or the like is applied to the sample surface. Thus, the sample surface can be machined or processed. In addition, information can be recorded by forming a distribution of machining on the sample surface, using a sample-moving means. In addition, the information can be reproduced by successively measuring the information machined into the surface by the use of the sample-moving means.
The prior art scanning probe microscope described above has the following disadvantages. In the scanning probe microscope using laser light, it is directed at the sample surface near the tip of the optical probe, and an image (shadow) of the tip of the probe is detected from the reflected light to detect the shear force. Therefore, the amount of reflected light is readily affected by the topography of the sample surface and by the reflectivity. Hence, it is difficult to measure the amplitude of vibration, and it is difficult to precisely measure the surface topography. Furthermore, it is not easy to align the laser light and so the data reproducibility has posed problems. Consequently, the machining accuracy and recording accuracy have problems. It has been difficult to reproduce the information.
In the scanning probe microscope using a quartz oscillator, the portion where the quartz oscillator and the optical fiber are adhesively bonded together tends to be a microscopic region (e.g., a square region about 100 .mu.m square). It is difficult to perform the bonding operation. Furthermore, the characteristics of the quartz oscillator device are easily affected by the amount of adhesive, the hardness, the location at which they are bonded, and other factors. Thus, it is difficult to obtain an oscillator sensor with high reproducibility. For these reasons, it has been difficult to use the instrument in industrial applications. Where the probe is replaced, the quartz oscillator must also be replaced. This gives rise to an increase in the cost. In addition, reproducible surface topography measurement has been impossible to perform. Consequently, the machining accuracy and recording accuracy have problems. It has been difficult to reproduce the information.

Apparatus for machining, recording, and reproducing, using scanning probe microscope


For manufacturing a packaged semiconductor device, a lead frame with an electrically insulating strip member and a semiconductor chip is placed in a molding unit having upper and lower dies. The upper and lower dies have recessed areas for determining a size of a cavity of the molding unit different from each other, the size of the cavity being measured in a direction perpendicular to a clamping motion direction of the dies. The lead frame is positioned so that a surface of each lead with the insulating strip member applied thereto is contacted with one of the upper and lower dies having a larger recessed area and a molding line of the molding unit intersects the insulating strip member. The molding unit is closed to clamp the lead frame to depress and thrust into spaces between adjacent leads that part of the strip member which is outside the molding line and to form the cavity of the molding unit. By injecting a molding material into the cavity, a molding package is provided encapsulating the semiconductor chip and a portion of each lead. The packaged semiconductor device has a flanged side surface with an insulating strip provided between a step of the flanged side surface and intermediate portions of the leads which are between first portions of the leads encapsulated in the molding package and second portions of the leads protruding from the flanged side surface.

The present invention relates to a packaged semiconductor device and techniques for manufacturing same and in particular to techniques useful when applied to an LSI package having numerous pins or a small pin arrangement pitch such as a QFP (Quad Flat Package).
Dam bars are disposed in a lead frame used for fabricating an LSI package. A dam bar is a member disposed in an intermediate portion of each lead of the lead frame so as to couple leads adjacent to each other and has a function to prevent molten resin injected into a molding unit from flowing out to the exterior of the molding unit through spaces between different leads, when a semiconductor chip mounted on the lead frame is molded with resin. It has further a function to act as a supporting member for preventing deformation of the leads. The dam bars are cut away by means of a cutting tool such as a press, etc., after the semiconductor chip has been molded with resin.
However, recently, for lead frames used for fabricating LSI packages involving numerous pins, since an increase in the number of pins or leads and a decrease in the pin arrangement pitch are advanced rapidly, it becomes more and more difficult to cut the dam bars by means of a press.
Therefore, in lieu of a lead frame in which dam bars and leads are formed in one body from a metal plate, so-called tape dam techniques have been proposed (JP-A-58-28841, published on Feb. 19, 1983) in which a thin insulating tape is applied to a lead frame having no dam bars, and the tape is pressed between different leads in a resin molding operation to use the pressed parts of the insulating tape as dam bars. According to these tape dam techniques, since the tape is made of an insulating material, dam cut after the resin molding is unnecessary and thus it is possible to increase the number of pins or leads and to decrease the pin arrangement pitch.
Techniques similar to the tape dam techniques are disclosed also in U.S. Ser. No. 08/161,374 filed on Dec. 2, 1993 and U.S. Pat. No. 5,106,784 issued on Apr. 21, 1992.

Packaged semiconductor device having a flange at its side surface and its manufacturing method


A method and apparatus for controlling zebra mussels in the inlet cell of a utility power plant by isolating a batch of water in the cell from the water supply of a lake or river and the equipment plant by shutting an inlet gate and shutting outlet valves from said cell. The batch of isolated water is thereafter heated to a lethal temperature which is maintained for a sufficient period of time to ensure 100 percent mortality to the zebra mussels within the cell. The water may be maintained in a static condition and heated by a heat exchanger disposed within the cell. Alternatively the water may be fed to a heat exchanger, heated outside the cell, and returned to the cell. The water is heated to a range of approximately 95.degree. F. to 100.degree. F. and held at the heated temperature within the cell for approximately 30 minutes.

This invention relates to a method for controlling the entry of zebra mussels into the inlet water to electrical generating plants, water plants and other plants drawing water from rivers, lakes and streams contaminated with zebra mussels, and more particularly to a method of killing the zebra mussels by heating the inlet water prior to entry into the plants.
Dreissena Polymorpha, commonly known as zebra mussels, were unknown in the waters of the United States and Canada prior to 1988. They are indigenous to Europe and it is theorized that these prolific breeders entered the waters of Lake St. Clair when a foreign ship emptied its ballast water. Since then zebra mussels have found their way into the Great Lakes, namely Lake Erie and Lake Ontario and have already been reported in the Ohio and Tennessee river systems. A single female zebra mussel may lay some ten thousand to two million eggs per year which have a four to eight year life cycle comprising four stages: the fertilized egg stage lasting some two to three days, the veliger or larvae stage lasting some two to three weeks, the settling stage and the adult stage which begins at about twelve months. In the veliger stage the zebra mussels are a free swimming planktonic larval which may disperse for miles. It is in this stage that they are small enough to enter through the screens of a power plant such as an electrical utility generating plant and municipal and industrial water plants drawing their water supply from the contaminated rivers and lakes. In the settling stage they are visible to the eye and possess visceral threads, known as byssus, which cling to or attach to almost any solid stationary surface in areas having low velocity currents, e.g., less than approximately seven feet per second. In this stage they attempt to attach or connect onto such surfaces and if a clear surface is not available, they will climb on top of others that are so attached. In this manner they colonize on the condensers and other equipment in such plants and may form into mats or clumps up to five inches thick. The zebra mussels have few natural predators and can stay out of water for substantial periods of time, up to 14 days, merely needing moist or humid areas in which to exist.
The primary use of water in power plants and the like is to cool and condense the steam that passes through the electrical generating turbines. If the steam is not properly condensed, the plant must be shut down. The condensers are large shell and tube heat exchangers which have the cooling water inside the tubes and the steam/condensate on the shell side. Power plants using fresh water taken from the rivers and lakes have been the first to encounter the costs associated with removal of zebra mussels from intakes, piping, pumps, filters and heat exchangers since the zebra mussel clumps that form can choke down areas of the tubes, piping and filters and block the water flow. When this occurs in condenser tubes, for example, the back pressure on the turbines are increased and the overload can trip the turbines. The problem has been so severe that the Electrical Power Research Institute has formed an internal zebra mussel task force and a utility advisory group to help members cope with the zebra mussel problem and to ensure reliability of the utility plants. Extensive research and development is being conducted regarding the zebra mussel problem in an effort to provide solutions which are cost effective and environmentally acceptable.
Attempts to control the zebra mussel problem to date include: chemical treatment, primarily by injection of chlorine and bromine into the water to discourage veliger settlement within the plant; mechanical cleaning, by water blasting and scraping of the walls in the intake structures and large piping and vacuuming out the removed zebra mussels; coating the pipes with a silicone or other anti-fouling coating; use of biological molluscicide, acoustic energy and other methods including thermal methods of either recirculating the warm water from the condenser and raising its temperature which, when raised to between 95.degree. and 100.degree. F. and held for about 30 minutes, kills the zebra mussels on the screens, grates and tunnels within the plant, or by limited application of electrical resistance heating or steam heating in the piping sections. All of these known methods are either of limited value or costly, or both. For example, mechanical cleaning which provides short term control requires some four or five days for a work crew to perform and can only be done when the facility has been shut down for normal maintenance. The thermal method continually raises the water temperature and, due to environmental regulations, the hot water cannot be released back into the lakes or rivers since there is a maximum temperature at which the water may have on reentry into the lake and river system to prevent damage to existing marine life. Additionally, there are limitations on chemicals and other pollutants that may be exhausted into the rivers and lakes. Thus, the present methods of controlling the zebra mussel problem in electrical utilities are of limited value and research continues to find better methods.

Method for controlling zebra mussels in power and water plants


A normal resolution component included in a readout signal of a super resolution optical disc is canceled to improve quality of the readout signal. The normal resolution component is separated from the readout signal of the super resolution optical disc by using a normal resolution selection filter such as a low pass filter, a mark length determination circuit, and then the normal resolution component is subtracted from an original readout signal while gain and a phase are appropriately controlled. Thereby, an influence of crosstalk due to the normal resolution component is reduced.

1. Field of the Invention
The present invention relates to an optical disc device which forms a recording mark having a different physical characteristic from that of the other portion, on a recording medium to read information from the optical disc on which information is recorded.
2. Description of the Related Art
Optical disc media include various media, such as a CD-R/RW, a DVD-RAM, a DVD±R/RW, a Blu-ray Disc (hereinafter referred to as a BD), and a HD DVD. Such optical disc media including one with two data layers have been widely used. What is termed as a DVD super multi-drive, which is provided for writing/reading on/from a CD-R/RW, a DVD-RAM and a DVD±R/RW, has widely available as the corresponding optical disc device. A high-performance drive, which is provided for a BD and a HD DVD, is considered to be widely available in the future.
Super resolution techniques and SIL (Solid Immersion Lens) for next-generation large-capacity optical discs are proposed, and one of the super resolution techniques is described in Japanese Patent Application Laid-open No. 2006-107588. Specifically, a phase-change recording film, which changes its optical characteristics when it melts, is buried in pits to conduct super resolution reading. In addition, recording marks are spatially separated from each other to reduce thermal interference between the recording marks and fluctuation of a super resolution region. The aforementioned configuration makes it possible to improve linear density and track density at the same time. As a result, storage capacity of the optical disc can be largely increased. Furthermore, light transmittance of the region between data pits is increased to allow an increase in an average light transmittance of a data surface. Thus, efficiency in light utilization is high, and this is advantageous for a multi-layering process. This type is hereinafter called as a three-dimensional pit selection type. As means for burying the recording film in the pits, it is possible to use a phase-change etching method (a method using a difference in etching speed between liquid crystal and amorphous) as described in Japanese Patent Application Laid-open No. 2005-100526, and a physical polishing method such as CMP (Chemical Mechanical Polishing).
When a super resolution optical disc is read, a super resolution signal is obtained from a mark smaller than optical resolution. Meanwhile, in a case where there is a mark larger than the optical resolution, a similar signal to that in a case of the normal optical disc is obtained. This signal is hereinafter called as a normal resolution signal. Thus, a readout signal of the super resolution optical disc results in such a nonlinear signal to which a super resolution signal and a normal resolution signal are added. Accordingly, instead of a general readout signal processing method, a nonlinear processing method needs to be carried out to obtain a good-bit error rate.
Japanese Patent No. 3781911 describes a nonlinear signal processing method in which a coefficient of equalization is changed according to a level of a readout signal. Furthermore, Japanese Patent Application Laid-open No. 2005-332453 describes a signal processing method in which crosstalk from adjacent tracks is suppressed using readout signals from three beam spots.

Optical disc device with normal resolution signal selection filter


The disclosure provides a phantom and method for quality assurance of a hadron therapy apparatus used in the intensity modulated particle therapy mode. The phantom comprises a frame structure comprising a base plate, one or more energy wedges, an energy wedge first face inclined with respect to said base plate and an energy wedge second face perpendicular to said base plate, said one or more energy wedges being mounted on said base plate, a 2D detector; said one or more wedges, and 2D detector being in known fixed positions in relation to said frame structure. Said phantom comprises in addition a Spread-Out Bragg Peak wedge, said SOBP wedge having an SOBP wedge first face inclined with respect to said base plate, and a SOBP wedge second face, perpendicular to said base plate, said SOBP wedge being made of a material having a relative density higher than 1.3 preferably 1.5, more preferably 1.7, the distance between the SOBP wedge first face and SOBP second face varying between the penetration depth of a beam having an energy between the high and low limit energy of the beam of said hadron therapy apparatus. The disclosure also provides a method for determining the compliance of the planned SOBP with the actual SOBP.

Hadron therapy comprises the treatment of a tumour by irradiation with an energetic hadron beam. Preferred hadrons are typically protons and carbon ions. In current proton beam facilities, the Pencil Beam Scanning technique (PBS) involves the irradiation of separate spots in a target, each spot having a predefined position and depth, with a pre-defined dose being prescribed for each spot. In each treatment room of the facility, various characteristics of the delivered beam are subjected to a daily verification routine. These characteristics may comprise:                beam range: the position (depth) of the Bragg peak at a given beam energy in a given target, usually a water phantom or multi-layer ionization chamber;        spot position, spot size and spot symmetry, measured by a suitable 2D-detector, for example an array of ionization chambers or a scintillator screen equipped with a CCD camera;        the deposited dose, measured by an absolute ionization chamber, for checking the output factor of the irradiation installation;        the position of the proton beam with respect to the X-ray imaging system;        when a Spread-out Bragg peak (SOBP) is used, the compliance of the planned SOBP to the actual SOBP.Each of these characteristics are commonly measured at a number of distinct beam energy levels, by a separate measurement device. A complete verification may involve many manual operations, including entrance in the treatment room for adapting a phantom or a measuring device. Therefore, the time needed to complete a verification routine is in the order of 30 to 60 minutes. Such long verification times are reducing the efficiency of the treatment facility in terms of the number of treatments that may be performed per day. Typical times spent on quality assurance (QA) in a proton beam facility are as follows: daily QA: 30 minutes, i.e 16 days per year in total; monthly QA: 3 hours per month, i.e. 4.5 days per year in total; yearly QA 16 hours, i.e. 2 days per year. It is therefore important to reduce the time needed for performing daily QA.
A Phantom and Method for Quality Assurance of a Particle Therapy Apparatus is known from PCT Pat. publication No. WO 2016/170115. This phantom may comprise a frame structure; one or more wedges, a first and second block of material each having a first block face and a second block face parallel thereto, an absolute dosimeter arranged at said first block face, a plurality of beads of high density material located in said blocks and a 2D detector. The components may be arranged in a known fixed position in relation to the frame structure. A central bead is maintained in a central known fixed position in relation to the frame structure. The components may be arranged in the frame structure so that a beam will traverse the phantom, through the central bead, without traversing any material besides said central bead. The product "Sphinx PT" provided by IBA Dosimetry is built according to this document. The wedges of this phantom are made of a water-equivalent materiel, i.e. RW3, having a relative density of 1,045. This phantom is preferably used with a 2D detector having a scintillator screen and a CCD camera.

Phantom and method for the quality assurance of a hadron therapy apparatus


An analog-to-digital converter operates according to the multiple ramp procedure with continuous integration of the input signal in a charge storage or charge summation circuit, whereby downward integration is performed at periodically recurrent time intervals with the aid of a comparator circuit at the output of the charge storage or charge summation circuit, a logic circuit, a clock oscillator, a switching circuit, a first reference signal and a second reference signal. Hereby the duration of the switched-on state of one of the reference signals is a measure for the input signal. The transfer function of the quantization noise H.sub.q (z) with an n-th order (n=1,2,3, . . . ) high pass filter characteristic can be derived from a transfer function H(z) describing the specified configuration.

Analog-to-digital converters of this kind are known for example through the patents DE 28 20 601, and corresponding U.S. Pat. No. 4,361,831, DE 39 21 976 and corresponding U.S. Pat. No. 5,066,955. Due to their continuous integration of the input signal in time, i.e. integration without any need to switch the input signal, these procedures are especially suitable for highly accurate and stable analog-to-digital conversion. Furthermore, a class of one bit analog-to-digital converters is known, the so-called delta sigma converters, which aroused interest specially for digital voice signal processing in conjunction with frequency-dependent shaping of the quantization noise followed by digital filtering. The disadvantages of the latter procedure are the poor long-term and short-term stability and temperature drift caused mainly by the frequent switching, and the relatively large background noise level.
Both groups have in common the possibility of distributing the quantization noise power over a large frequency range by oversampling the input signal with a sampling frequency greater than the Nyquist frequency resp. Nyquist rate (cf. Ref. 8, p.209). This gives the opportunity of removing a large fraction of this noise power subsequently by digital low pass filtering (Ref. 5, Ref. 2 and Ref. 7).

Multiple ramp procedure with higher order noise shaping


Prevention of reduction in the production yield due to the increase in the area of a semiconductor chip permits a sophisticated-performance single-chip semiconductor device to be fabricated. This also permits a many-kind small-amount production of semiconductor devices to be implemented. After plural semiconductor chips 2 and 3 are fabricated separately, only defect-free chips of them are selected. The selected defect-free chips are connected in contact between their side walls of their densest faces of atoms of their substrates so that the surfaces 4a and 4b where elements are to be formed are located in the same plane. Thus, even when the chip area is increased, reduction of the production yield can be prevented, thereby permitting a large-area sophisticated-performance single chip semiconductor device to be fabricated. If many kinds of semiconductor chips are prepared and connected in their combination in a variety of forms, it is possible to realize a many-kind small-amount production of semiconductor devices.

1. Field of the Invention
The present invention relates to a semiconductor device which is optimal to provide a large wafer area and a large number of functions formed on the wafer or less number of parts to be fabricated, and a method for fabricating it. The semiconductor device according to the present invention is suitable to realize a large capacity and high performance.
2. Description of the Related Art
Heretofore, a semiconductor device has been required to have plural functions such as functions of arithmetic, storage and input/output on its monolithic chip. But an increase in the chip area leads to a considerable reduction in the fabrication yield so that such requirement has been dealt with by curtailing each function and reducing the area occupied by each function.
Thus, the semiconductor device has been constructed with each function made lower than the case where a single chip has a single function. Its one example is HD401220 eight-bit single chip microcomputer described in HITACHI MICROCOMPUTER GENERAL USER'S GUIDE February 1991 page 121.
This microcomputer chip has many functions including a 2048-byte ROM, 32-byte EEPROM, timer, D/A converter and I/O port. The performance of each function is inferior to that in the system including HD64180 eight-bit microcomputer and 4MDRAM named HM514102. The technology of combining plural chips to form a single semiconductor device is disclosed in JP-A-2-184063.
The former technology, in which each function is made lower than in the case of the single-chip single-function, is not suitable to the case where upgraded functions are required.
The latter technology, in which the gaps necessarily generated between chips are filled with resin, cannot be applicable to a high temperature process. The reason why the gaps are generated is that the chips etched by isotropic etching or insufficient anisotropic etching are combined.
Conventional defect relief technology for LSI with the scale of a semiconductor substrate is disclosed in e.g. (1) "NIKKEI MICRODEVICE" April 1986, pages 45-46 issued Apr. 1, 1986 by Nikkei McGraw-Hill Inc., and (2) JP-A-62-147746.
The reference (1) makes an explanation of the defect relief technology for the integrated circuit with the scale of a substrate. Its summary is as follows. First, poor device areas of device areas on the substrate are removed, and at the removed areas planar square holes each penetrating from the principal surface of the substrate to the back surface thereof are formed. Secondly, the substrate, under the state where the principal surface is directed downward, is placed on a prescribed pedestal. Subsequently, defect-free semiconductor elements chips, under the state where their principal surface is directed downward, are inserted or mounted in the holes. The size of the defect-free element chips inserted in the holes is e.g. 4.98 mm square or so. Thereafter, the gaps between the defect-free element chips and the substrate are filled with resin such as epoxy resin. Finally, the substrate is turned over and wirings are made between the pads of the defect-free element chips and those for the defect-free areas on the substrate, thus completing the integrated circuit.
The reference (2) also describes a defect relief technique for integrated circuits. Like the reference (1), in this technique also, defective element areas on a substrate are removed and defect-free element chips are inserted in the removed areas; thereafter wirings are made between the element chips to complete an integrated circuit.
In recent years, the semiconductor devices have been advanced to provide large capacity and upgraded function, and also the element chips included in the device have been advanced to provide upgraded function and large size. But if the element chips are made large-sized, the number of element areas which can be formed on the substrate will be reduced. In addition, if the element chips are made large-sized and also highly integrated, the defect production rate will be increased owing to alien substances. As a result, the number of defect-free element chips which can be acquired from a single substrate will be greatly decreased.
Thus, it is expected that realizing the large capacity and upgraded function of the semiconductor device makes it very difficult to assure the element production yield profitable in cost. The method which may reduce the number of defect-free element chips which can be acquired from a single semiconductor substrate to one or less cannot be used for the production of the semiconductor device. From such a standpoint, as a future trend of the semiconductor devices, an important problem to be solved is to provide a method of fabricating a semiconductor device with high production yield or realizing defect relief with high reliability.
Further, in recent years, development and fabrication of custom products for semiconductor devices have been advanced. The custom products are fabricated in accordance with the specification requested by a user by the number required by him. Thus, the number of the kinds of products is increased whereas the number of products for each kind is not increased. As a result, reduction in the production cost for the products due to mass-production cannot be expected. The cost of the products will greatly depend on the element production yield. In order to assure the element yield profitable in cost, the defect relief technique with high reliability is required as in the above case.
In the conventional techniques disclosed in the above references (1) and (2), defective element chips cannot be easily removed and defect-free element chips cannot be precisely positioned when they are to be mounted on a substrate so that the wiring method of connecting the elements with the substrate is problematic. The conventional techniques, as they are, cannot be adopted as relief technique for elements.

Semiconductor device having plural chips with the sides of the chips in face-to-face contact with each other in the same crystal plane


An LCD adapter mounting for a computer cover includes a cover base and an adapter mounted in the base. An LCD panel is mounted in the adapter. The adapter is mounted in the cover base in a first orientation when the LCD panel is of a first size. The adapter is mounted in the cover base in a second orientation, inverted from the first orientation, when the LCD panel is of a second size. A bezel is mounted on the cover base for securing the adapter and LCD panel therebetween.

The disclosures herein relate generally to portable computer systems and more particularly to an adapter for mounting an LCD panel in a laptop computer.
Portable laptop or notebook computers include a base and a cover which is pivotally connected to the base at a hinged connection. When the cover is raised, a liquid crystal display (LCD) panel mounted therein is exposed. The LCD panels are costly components available from several manufacturing sources and are available in various sizes. In addition, the spacing and orientation of the mounting points for one manufacturer may vary from the spacing and orientation of the mounting points for another manufacturer. As a result, several different cover configurations are required for mounting the various size LCD panels and their multiple mounting points.
LCD panels are mounted between a cover base and a bezel. Various size LCD panels have different "active" areas, i.e. the area of the panel that becomes illuminated and is visible. As a result, the bezel used must cover the peripheral edges of the LCD panel in a manner which exposes only the active area for a particular panel. Because of the variation in panel sizes and active areas, it is difficult to provide a one size fits all bezel for all panels. Moreover, it is also difficult to provide apparatus and methods for securely mounting LCD panels in a cover base by accommodating the various sizes of panels and the various mounting point locations. As a result, costly additional parts are required to accommodate each different panel size and each different mounting point configuration to adapt the LCD panel to the cover and bezel with which a particular panel is being used.
Therefore, what is needed is an apparatus and a method for mounting various size LCD panels having varying mounting point locations by using a single cover base configuration and a single bezel configuration.

Adapter for various LCD sizes in a computer


Equine matting for a horse stall made of a composite textile of nonwoven fabric sewn to a plastic grid.

The present invention generally relates to horse matting.
Analysis has shown that horse matting used in stalls should preferably possess a variety of characteristics, including that it: be dry (i.e., hydrophobic, such that liquid/urine passes through) and non-odor retentive (stall floors that retain odors can deteriorate the respiratory system of the horse); provide traction and be non-slippery to encourage the horse to lie down, while allowing the horse to regain his footing without injury; be easy on the legs and have some "give" to decrease tendon and foot strain; be durable with a long life, and stay level and resist damage from horse pawing; have low maintenance such that it is easy to clean and maintain; be affordable; and be lightweight.
Two major categories of stable flooring materials depend on whether the material is porous or impervious to liquid. Porous floors may be made of sand and/or gravel to absorb liquid into the ground below the stable. However, porous materials such as soil or clay are less capable of bearing weight, and can work their way into adjacent areas through hoof action, creating holes and high spots. Impervious floors may be sloped toward a drain so that urine and water can run out of the stall. Stall design can increase cost, of course, and already-designed stalls with impervious floors must use an absorbent floor mat or deal with the negative consequences. Even porous floors must be maintained, as sand and/or gravel will flow away over time and will need to be added. Different floor types have advantages and disadvantages, of course. For example, while concrete floors can provide drainage, they are tough on a horse's legs. Similarly, wood floors are easier on a horse's leg, but not as durable, and also flammable.
A 1,000-pound horse may produce about 31 pounds of feces and 2/4 gallons of urine daily, so a non-absorbent floor mat, without a draining floor, can quickly become problematic. Conversely, flooring materials that allow urine to be absorbed and travel down through the flooring material layers can retain odors.
Several available products provide alternatives to the historical rubber stall mat. None has been successfully in the retail marketplace. Rubber stall mats have historically been the market leader. In the retail marketplace, the most common horse matting options are 4-foot by 6-foot, and 3-foot by 5-foot (¾-inch thick) standard rubber mats, as well as a ¼-inch thick rubber mat in varying lengths that is rolled and displayed in a plastic bag. This second option is more of a portable option useful in a horse trailer or aisleway rather than in a stall, and it does not offer shock absorption as with the standard rubber mat.
Disadvantages of rubber mats include cost, weight and lack of absorbency. For example, the standard 4-foot by 6-foot, ¾-inch thick rubber mat weighs over 100 pounds, and is not absorbent, requiring wood shavings or other absorbent material (dirt, clay, etc.) to be added over the top of the mat, adding to its maintenance.
"Grid" horse mats are known in which a plastic grid is provided over a porous foundation such as gravel, and the plastic grid is covered with a lumber grid. Grid mats have advantages, including relatively low maintenance, using less bedding than concrete, remaining level, and being relatively durable and easy on the legs, but grid mats are relatively expensive, and their longevity is expected to be less than rubber or plastic.
A stall mat that uses a geotextile fabric is also known. See: https://www.stallsavers.com/index.php/about-stall-savers/videos/18-articles/36-use-of-geotextiles-in-livestock-areas. However, this product has no structural backing, and testing on this product showed that it did not allow liquid to pass through the matting into the soil below, instead trapping urine in the mat (requiring the mat to be hung to allow the urine to run out).
Accordingly, it would be advantageous to provide a horse mat with the above-referenced preferred characteristics.


A video test system is provided with a circular buffer to capture a video input sequence in response to a trigger, and a test generator output to generate a video test sequence based upon the captured video test sequence. The system may be implemented using a single instrument, or a combination of instruments, such as video waveform monitors and video signal generators. A method is also provided for generating video test sequences based upon captured video sequences.

The present invention relates to systems and instruments for monitoring and analyzing video sources.
Video test instruments and systems are able to monitor and analyze video sources in an ever increasing variety of both analog and digital formats. Examples of analog formats include NTSC, PAL, and SECAM. Digital formats include both standard definition (SD) and high definition formats (HD). Examples of digital formats include CCIR601, and various MPEG formats, including H.264. Digital video may be transmitted for example using a serial digital interface (SDI).
In addition to monitoring video sources and analyzing them to provide a variety of measurements, some video test instruments and systems provide the ability to capture portions of a video source signal based upon a trigger. The trigger may be based upon an external event such as a user's input, or a signal from a separate test instrument. Alternatively, some systems provide for triggering based upon internally generated triggers. These internally generated triggers can be based upon a video source meeting certain desirable, or generally undesirable, characteristics, or other information included with the video source signal. For example, a trigger may be produced based upon a cyclical redundancy check (CRC) error, a gamut error, or ancillary data identification (ANC DID).
In some implementations, the raw video data is written into a circular buffer as it is received. In response to a trigger, the video data in the circular buffer is held to effectively capture the signal. The captured video data could consist of parts of a frame, a frame, a sequence of consecutive frames, a sequence of non-consecutive frames, or a combination thereof. The captured raw data is then available for additional analysis within the video test equipment. The captured raw data is not provided in a format that is readily used by other systems or applications.
Video test systems often use a video test generator to provide test patterns, including standard test patterns such as color bars. These test patterns are defined by a code format that can be used to generate a video frame for use in testing. The number and variety of test patterns from a video test generator may be numerous and yet still be limited to specific patterns based upon the nature of the test being conducted. These test patterns have not enabled problematic video sequences to be reproduced to allow for further testing of a video environment, such as a video production system.

Systems and methods for generating video test sequences based upon captured video data


The present disclosure provides a connector assembly. The connector assembly includes a wire-end connector. The wire-end connector includes a wafer, a shield plate and a twin-ax cable. The wafer includes a frame and a terminal group. The terminal group is supported by the frame. The terminal group includes a signal terminal pair and a ground plate. The ground plate includes a ground terminal on both sides of the signal terminal pair. The shield plate is electrically connected to the ground plate. The shield plate includes an opening that penetrates the shield plate. The twin-ax cable includes a pair of conductors and a ground portion. The pair of conductors extend into the opening of the shield plate and are electrically connected to the signal terminal pair. The ground portion electrically connects at least one of the shield plate and the ground plate.

Chinese patent application issuance publication No. CN207868438 U discloses a technical means that uses a plurality of shield covers to improve the electrical performance of a system. In the present disclosure, the shield cover may include a retention tab which engages with a retention aperture of a ground terminal plate and the shield cover can thus be mounted in place with a friction/interference fit. Or, alternatively, the shield cover may be connected by a solder or fusion welding operation or by using a conductive adhesive. Furthermore, the shield cover is placed over a signal terminal pair which includes a first signal terminal and a second signal terminal, so that the shield cover is connected to the ground terminal plate. However, the shield cover may only improve crosstalk between adjacent signal terminal pairs but not suppress crosstalk between twin-ax cables.
The above description of the "background" merely provides a background, and it is not admitted that the above description of "background" discloses the subject matter of the present disclosure, and the above description of "background" does not constitute the background of the present disclosure, any above description of the "background" should not be considered as any part of the present disclosure.

This patent is subject to a terminal disclaimer.


Polyimide compositions containing graphite and wollastonite exhibit an unusual combination of low wear and friction and low coefficient of thermal expansion.

Polyimides, such as those described in Edwards, U.S. Pat. No. 3,179,614, can be used in a wide variety of commercial applications. The outstanding performance characteristics of these polymers under stress and at high temperatures have made them useful in the form of bushings, seals, electrical insulators, compressor vanes and impellers, pistons and piston rings, gears, thread guides, cams, brake linings, and clutch faces.
It is often desirable to incorporate various additives in such polyimide compositions before fabrication into their final form. Accordingly, graphite has been incorporated to improve the wear characteristics in bearing applications. Diamonds have been incorporated for abrasive applications. Fluoropolymers have been incorporated in the past for lubricity in forming and extrusion of shapes.
Despite the variety of polyimides and additives that have previously been available, a continuing need for polyimide compositions, particularly when processed into the shape of bushings and bearings, is a reduction in the thermal expansion of such materials. In bushings and bearings, close clearances to adjacent metal surfaces are needed, in combination with excellent wear characteristics. In the past, while additives could be incorporated for the reduction of wear, it has previous not been possible to prepare a polyimide composition having both low wear and friction performance and a low coefficient of thermal expansion.

Low thermal expansion polyimide compositions


An implant (100) includes a protrusion (110) with an open or rounded loop (112) (or open head) connected to a collapsible anchor. The protrusion may include a straight length of wire (114) or a helical length wire, with one or more wire loops (112) at the end of the length forming the loop. Upon deployment within the gastrointestinal tract, the protrusion expands from a collapsed state, alongside the anchor, to a relaxed state, in which the protrusion extends outward from the anchor. As the protrusion expands to its relaxed state, it pushes the loop into the wall of the duodenum, causing the loop to penetrate the duodenal wall. A pocket of scar tissue forms about the head and possibly through an opening in the head, securing the anchor within the duodenum. The implant may also include a thin-walled sleeve that is coupled to the anchor and extended from the anchor into the intestine.

Obesity is associated with a wide variety of health problems, including Type 2 diabetes, hypertension, coronary artery disease, hypercholesteremia, sleep apnea, and pulmonary hypertension. It also exerts an enormous strain on the body that affects the organs, the nervous system, and the circulatory systems. Obesity rates have been rising for years in the United States, causing corresponding increases in healthcare expenditures.
Curing obesity has so far vexed the best efforts of medical science. Dieting is not an adequate long-term solution for most obese people, especially those with a body-mass index of over 30. Stomach stapling, or gastroplasty, reduces the size of the stomach, leading to reduced appetite and weight loss, but eventually the stomach stretches and the patient's appetite returns to pre-surgery levels. Roux-en-Y gastric bypass reduces the size of the stomach and the length of the intestine, and leads to both weight loss and alleviation of the Type 2 diabetes common to obese patients. Although gastric bypass appears to provide a more permanent solution than gastroplasty, complication rates associated with gastric bypass are between 2% and 6%, with mortality rates of about 0.5-1.5%.
Endoscopically delivered gastrointestinal implants, such as those described in commonly assigned U.S. Pat. Nos. 7,025,791 and 7,608,114 to Levine et al., incorporated herein by reference in their entireties, provide the benefits of gastric bypass without the hazards of surgery. For example, an implant may include a thin-walled, floppy sleeve that is secured in the stomach or intestine with a collapsible anchor. The sleeve extends into the intestine and channels partially digested food, or chyme, from the stomach through the intestine in a manner that may cause weight loss and improve diabetes symptoms. The sleeve and anchor can be removed endoscopically when treatment is over or if the patient desires.


A droplet-jetting device, which is usable for an ink-jet recording apparatus, comprises a pressure chamber disposed between a cavity plate and a pressure-generating section of a piezoelectric actuator. The pressure-generating section and the cavity plate are connected by a connecting section. When a voltage is applied to the piezoelectric actuator, the pressure-generating section is elongated to depress the bottom of the pressure chamber downwardly so that the volume of the pressure chamber is increased. The droplet-jetting device is realized, in which the area of arrangement of the pressure-generating section is decreased to suppress the electrostatic capacity and the pull-eject can be performed by applying the voltage only when the device is driven.

1. Field of the Invention
The present invention relates to a droplet-jetting device such as an ink-jet head of an ink-jet printer.
2. Description of the Related Art
An apparatus has been hitherto suggested, in which a piezoelectric droplet-jetting device is utilized for a print head. This device is constructed such that the volume of a liquid chamber is changed by the dimensional displacement of a piezoelectric actuator, and thus the liquid (ink) contained in the liquid chamber is jetted from a nozzle during the decrease of the volume, while the ink is introduced into the liquid chamber during the increase of the volume. A large number of the droplet-jetting devices as described above are arranged closely to one another, and the ink is jetted from the droplet-jetting device disposed at a predetermined position. Accordingly, a desired letter or an image is formed.
For example, FIG. 28 shows an ink-jet print head which utilizes the conventional piezoelectric droplet-jetting device. FIG. 28 shows a magnified sectional view illustrating the conventional piezoelectric ink-jet head. The piezoelectric ink-jet head comprises nozzles 215 which are open to the outside, pressure chambers 216 which supply the ink to the nozzles 215, a common ink chamber 212a which distributes the ink from an unillustrated ink supply source to the plurality of pressure chambers 216 via ink supply holes 218, 216b and throttle sections 216d, and a piezoelectric actuator 220 provided with pressure-generating sections 228 which apply the pressure to jet the ink to the pressure chambers 216.
The pressure-generating section 228 is a portion of the piezoelectric actuator 220 at which a piezoelectric sheet 222 of the piezoelectric actuator 220 is interposed between a driving electrode 224 and a common electrode 225. The pressure-generating section 228 is subjected to the polarization treatment in a direction directed from the driving electrode 224 to the common electrode 225. When an electric field, which matches the direction in which the polarization treatment is applied, is applied between the driving electrode 224 and the common electrode 225, the pressure-generating section 228 causes the elongation displacement in the thickness direction of the piezoelectric actuator 220. As a result of the displacement, the volume of the pressure chamber 216 is decreased, and the ink contained in the pressure chamber 216 is extruded. Accordingly, ink droplets are jetted from the nozzle 215 which is communicated with the pressure chamber 216.
In order to jet the ink droplets having necessary jetting velocities and volumes more efficiently, i.e., at a lower voltage, the pressure-generating section 228 has been arranged in a region approximately ranging over the entire pressure chamber 216.
However, the conventional piezoelectric ink-jet print head as described above has involved the following problems, because the pressure-generating section has been arranged in the region approximately ranging over the entire pressure chamber. That is, the electrostatic capacity, which is proportional to the area of the pressure-generating section, is increased. The energy efficiency is unsatisfactory. The power source system, which is used to drive the ink-jet print head, suffers from the increase in cost.
The piezoelectric ink-jet print head as described above is suitable for the so-called "push-eject" in which the ink droplets are jetted by decreasing the volume of the pressure chamber when the driving voltage is applied. However, when such a method is used, a problem arises such that the supply of the ink is not performed in time, and it is impossible to increase the driving frequency so much. Further, when such a method is used, a problem arises such that the volume of the ink droplet cannot be increased so much as well.
Therefore, it is intended to perform the so-called "pull-eject" as a method for increasing the driving frequency and increasing the volume of the droplet, in which the volume of the pressure chamber is firstly increased, and then the volume of the pressure chamber is restored to the original volume at the timing at which the pressure in the pressure chamber is changed from the negative to the positive. In this case, it is necessary to use such a method that the volume of the pressure chamber is always decreased by always applying a voltage, and the voltage application is shut off only when the printing operation is performed. Therefore, the energy efficiency has been extremely unsatisfactory.
In such a method, it is also conceived that a reverse electric field is applied in order to increase the volume of the ink chamber. However, if such a procedure is adopted, only a low electric field, which causes no polarization reversal, can be applied. It is impossible to jet any sufficient amount of ink droplets.

Droplet-jetting device with pressure chamber expandable by elongation of pressure-generating section