The invention is a laminator and a method of lamination of a plastic card (14). A laminator (10, 100) in accordance with the invention includes an infeed (12) which supplies plastic cards which are to be laminated with a plastic laminating material on a first side (18) of each card; a laminating station (20) having a heated roller (22, 114) and a card support (24, 112), opposed to the heated roller, which supports a second side of each card and is separated from the heated roller to define a card opening (28, 116) through which each plastic card passes when being laminated; a laminate source (32) which feeds plastic laminating material into the card opening between the heated roller and the first side of each plastic card with heat from the heated roller heating the plastic laminating material and each plastic card in the card opening to fuse the plastic laminating material to the first surface of each plastic card; and a card bowing the station (40), which bows each card sufficiently in a portion thereof to cause each card when cooled to be substantially flat.

1. Field of the Invention
The present invention relates to laminators and methods of lamination for fusing a plastic laminate to a surface of a card to protect the surface against wear so as to protect sensitive indicia thereon such as pictures.
2. Description of the Prior Art
The Assignee of the present invention and other companies sell credit card embossing and printing (personalization) systems which are designed to perform a series of processes which transform a blank card, such as a credit card blank, into a processed card. The processes performed by credit card embossing and printing systems are not limited to embossing credit cards and use a number of processing stations all of which are not required to be activated when flat non-embossed cards are being processed.
Processing of plastic cards performed by the largest credit card embossing systems, is at very high speeds which can result in a throughput of fully processed cards at a rate up to 1500 cards per hour. U.S. Pat. No. 5,837,991, which is assigned to the Assignee of the present invention, is exemplary of the foregoing type of credit card system which patent is incorporated herein by reference in its entirety.
It is also well known that printing and photographs on a plastic card surface may be protected by the heat fusing of a clear plastic laminate to the card surface on which the printing and photographs are placed.
Data Card Corporation has sold a Model 9000 embossing system which included a laminator which laminated the top surface of flat non-embossed cards with a clear plastic laminate by heat fusing. The clear plastic laminate protected a photographic image of the authorized user of the card. The Data Card system, as a consequence of the laminating operation, introduced heat stress into the plastic card to which the plastic laminate is fused. If the resultant heat stress in the laminated plastic card was not removed, the laminated card was not substantially flat after cooling.
The Data Card Corporation Model 9000, when operating to laminate cards, transports the cards along a horizontal transport path with the individual cards having their width aligned with the transport path. The longitudinal dimension of the cards during processing at the card processing stations is vertically oriented.
The Data Card Model 9000 system laminator included a bowing device which, after lamination, applied a vertical compressive force to both vertically oriented longitudinal ends of the laminated card which retained heat from the lamination. The middle portion of the laminated card was free to bow with the bowing being caused by reducing the longitudinal dimension of the card by the force applied to the ends. The compressive force countered the effect of the heat induced stress by reversing the effect of the bow along the longitudinal dimension introduced by the heat of the lamination operation.
The Assignee of the present invention manufactures a color printer used in its HORIZON embossing system which is described, with the exception of the color printer, in the above-referenced patent. The color printer includes an infeed, a color printing station and an outfeed. The infeed has a pair of driven rollers and a pair of opposed idler rollers between which cards pass during the infeed of cards, such as processed credit cards, to the color printing station. The activation of the infeed rollers causes the card to be moved along a transport path underneath the printhead which, under control of a system controller, applies a color image to at least a portion of the processed card which typically is the side of the card on which the embossing may appear. A second pair of driven rollers is on an outfeed side of the printing station. A corresponding pair of offset idler rollers defines a gap between which the processed credit card bearing the color image passes. The outfeed conveys the printed card to another card processing station when the color printer is part of a HORIZON embossing system or a card collection station. The drive of the first and second pairs of rollers is synchronized such that at least one driven roller is always contacting the card as the card is moved through the color printer to produce uniform movement underneath the printhead.
The present invention is a laminator and a method of laminating flat plastic cards with a clear plastic laminating material in order to protect a photographic image or sensitive printing on a side of the plastic card. As used herein, plastic laminating material is any plastic material, regardless of thickness, which is heat fused to a plastic card which may be carried by a web or be transferred by a thermal transfer method from a continuous web to provide full edge to edge coverage of the card surface. A laminator as used herein applies the plastic laminating material to a plastic card. The plastic card may be, without limitation, a flat (non-embossed) PVC (or other plastic) card and the plastic laminate may be dimensioned to cover substantially all of or only a portion of a surface of the plastic card bearing a printed or a photographic image to be protected. The plastic cards which may be laminated with the invention commercially take many forms including, but not limited to, a non-embossed credit or debit card, a laser engraved credit or debit card, an identification card, and an access card. The clear plastic laminating material may provide a useful life to the printing or photographic image of up to five years.
The invention utilizes a laminating station having a heated roller which applies heat to a first side of a plastic laminating material (which may be, without limitation, a clear polyester overlay with a thickness of, for example, of 0.0002 inches or a clear polyester laminate between 0.0005 and 0.001 inches in thickness) which causes a second side of the plastic laminating material to be heat fused to a first side of the card and a card bowing station located at an outfeed of the laminating station which removes residual heat stress in the card to which the clear plastic laminating material has been fused by applying a bow transversely across a portion (which may be the middle) of the second side of the card relative to a direction of movement of the card through the laminator. The ends of the heated laminated card are fixed while the middle portion is bowed which results in the applied bow deflecting the card in a direction which is opposite to the direction of a heat set bow which would result after cooling of the laminated card if the card bowing station was not utilized. The bow (degree of deflection of the bow from the horizontal, as well as the timing thereof, or the length of the time the bow is applied) applied at the card bowing station is chosen to be sufficient to cause the card when cooled to be substantially flat and is dependent upon the physical properties of the plastics used in the card and the clear plastic laminating material and the physical dimensions of the card and a clear plastic laminate if used as the laminating material. Movement of each card through the laminator is synchronized by a system controller which may be part of the system controller of a card embossing system that produces a high throughput of processed cards without activation of the embossing station. Furthermore, as a result of the card bowing station being located on the outfeed side of the laminating station, the laminated plastic card is sufficiently heated to apply the bow to the card while the molecular structure of the plastic is relatively soft as a consequence of the retained heat. The application of the bowing force, if the laminated card was not in an elevated temperature, would require additional force and deflection which is not required with the present invention in view of the proximity of the card bowing station to the laminating station which results in the card having been heated at the time that bowing at the card bowing station occurs.
In a preferred embodiment of the present invention, the card transport system of the present invention may be that utilized in the Assignee""s color printing assembly used in the Assignee""s HORIZON embosser which is used therein without the embossing station being activated. Currently, it is not possible to commercially laminate an embossed surface of a credit card because the embossed characters cause the heat fused clear plastic laminating material to crack over the useful life of the credit card thus increasing the cost of credit card issuance. In one embodiment of the invention, the card printing assembly of the Assignee is modified to remove the card printing head and in place thereof, to incorporate the laminating station which lowers the cost of the laminator as a result of the card transport system being common to the Assignee""s color printer assembly and to the laminator of the present invention.
A laminator in accordance with the invention includes an infeed which supplies plastic cards which are to be laminated with a plastic laminating material on a first side of each card; a laminating station having a heated roller and a card support, opposed to the heated roller, which supports a second side of each plastic card and is separated from the heated roller to define a card opening through which each plastic card passes when being laminated; a plastic laminating material source which feeds plastic laminating material into the card opening between the heated roller and the first side of each plastic card with heat from the heated roller heating the plastic laminating material and each plastic card in the card opening to fuse the plastic laminating material to the first surface of each plastic card to produce laminated plastic cards; and a card bowing station, located at an outfeed of the laminating station, including a resilient member which moves from a withdrawn position into transverse contact with a portion of the second side of each plastic card relative to a direction of movement of each plastic card through the laminator, while each laminated plastic card retains heat from being laminated, to bow each plastic card sufficiently in the middle portion to cause each laminated plastic card when cooled to be substantially flat. A web may provide the plastic laminating material which is heat fused onto the first side of each card; a source reel may be used on which the web is wound; and a take up reel may be used on which the web is wound after the plastic laminating material is fused to the first side of the plastic cards. At least three driven rollers may be used which contact one side of each card wherein at least one driven roller is located along a card transport path at the infeed and a pair of driven rollers are disposed along the card transport with a-first driven roller of the pair of driven rollers being located between the heated roller and the resilient member and the second driven roller of the pair of driven rollers being located at the outfeed of the card bowing station. The at least three rollers may be driven by a transmission driven by one motor. At least three idler rollers may be used which contact each card on another side of each card and are individually opposed to the individual driven rollers of the at least three driven rollers, with each card passing between the driven and opposed roller when driven by each driven roller contacting the one side of each card and the opposed idler roller contacting the another side. The laminator may include a controller and first, second and third motors; and wherein the first motor drives the at least three driven rollers, the second motor drives the resilient member, and the third motor moves the heated roller into contact with the laminating material and the controller controls activation of the motors. The first motor may be activated under control of the controller to drive each card along the card transport path to drive each card past the heated roller and into a stopped position where each card is contacted by the pair of driven rollers and after each card is in the stopped position, the second motor may be activated under control of the controller to move the part including the resilient member to bow the portion thereof. The laminator may be part of a credit card processing and printing (personalization) system. The resilient member may reciprocate and the transverse contact may be with a middle portion of the second side. The laminating material may be a series of plastic laminates which are spaced apart on a carrying web with the laminates being transferred from the web to the first side of the plastic cards by the heat from the heated roller or the laminating material may be a continuous coating on one side of a carrying web with the laminating material being transferred from the web to the first side of the cards by the heat from the heated roller.
A method of laminating a card with a laminator having an infeed which supplies cards which are to be laminated with a plastic laminating material on a first side of each card, a laminating station having a heated roller and a card support, opposed to the heated roller, which supports a second side of each card and is separated from the heated roller to define a card opening through which each card passes when being laminated, a laminating material source which feeds laminating material into the card opening between the heated roller and the first side of each card, and a card bowing station, located at an outfeed of the laminating station, including a resilient member which moves from a withdrawn position into transverse contact with a portion of the second side of each card relative to a direction of movement of the plastic card through the laminator in accordance with the invention includes feeding a plastic card from the infeed to the laminating station; supplying a plastic laminating material to the laminating station from the laminating material source and heating a first side of the plastic laminating material with the heated roller which fuses a plastic laminating material to the plastic card to produce a laminated card; feeding the laminated card to the bowing station while the laminated card retains heat from the lamination thereof; and moving the resilient member to transversely contact a portion of the second side to bow the card sufficiently in the portion to cause the laminated card to be substantially flat. The plastic laminating material may be conveyed to the laminating station by a web which carries the plastic laminating material and the heated roller contacts the web which heats the plastic laminating material to fuse the plastic laminating material to the first side of the plastic card. At least three driven rollers may be disposed along a transport path of the card through the laminator with each driven roller contacting one side of the plastic card with at least one of the driven rollers being located at the infeed and a first roller of the pair of rollers being located between the heated roller and the resilient member and a second driven roller of the pair of driven rollers being located on an outfeed of the card bowing station and at least three opposed idler rollers may be disposed along the transport path with the plastic card passing between the driven and opposed roller when driven by each driven roller contacting the one side of the card and the opposed idler roller contacting another side of the plastic card; and wherein the second pair of driven rollers may be stopped to cause the plastic card to be held between the second pair of driven rollers and the opposed idler rollers to fix longitudinal ends of the plastic card while the resilient member bows the portion of the plastic card. The laminator may include a controller and first, second and third motors are provided; and wherein the first motor drives the at least three driven rollers, the second motor drives the resilient member, and the third motor moves the heated roller into contact with the laminating material and the controller controls activation of the motors. The first motor may be activated under control of the controller to drive each plastic card along the card transport path to drive each plastic card past the heated roller and into a stopped position where each plastic card may be contacted by the pair of driven rollers and after each plastic card is in the stopped position, the second motor may be activated under control of the controller to move the resilient member to bow the portion. The card which is laminated may be an one of a credit card, a laser engraved card, a debit card, an identification card or an access card. The part may be a reciprocating part and the transverse contact may be with a middle portion of the second side. The laminating material may be a series of plastic laminates which are spaced apart on a carrying web with the laminates being transferred from the web to the first side of the plastic cards by the heat from the heated roller or the laminating material may be a continuous coating on one side of a carrying web with the laminating material being transferred from the web to the first side of the cards by the heat from the heated roller.

Card laminator and method of card lamination


A system and method for providing a self-diagnostic process for determining a print shaft contamination condition such as debris build up on the guide shaft in a shuttle head printer is described. The process can be carried out at several points in time including automatically when the printer is powered-up, at a periodic schedule, and/or at the initiation of a user. The process includes a measurement of the print head speed over a travel distance along the guide shaft. If the speed is lower than a predetermined threshold value, the user is notified that a print shaft contamination condition exists.

The present invention relates generally to a printers and, more particularly, to shuttle head printers.
In shuttle head printers, such as dot-matrix printers, inkjet printers and bubble-jet printers, the print head assembly travels across a print media such as a sheet of paper or a mail piece, marking the media such as by rendering ink on the media one band at a time. The printer advances the print media under the print head assembly after printing a band in preparation for the next band. The print head assembly then traverses back across the print media, rendering the next band. The back and forth movement interspersed with media motion continues until the printing on the media is completed. One of the factors determining the overall throughput of the printer is the speed at which the print head assembly is able to traverse the print media. A typical inkjet shuttle head printer includes a print head assembly that consists of plastic print head holder, which secures one or more print cartridges. Two metal bearings are molded into the holder for guiding the print head assembly along a polished steel guide shaft. A ribbon cable assembly is connected to the print head assembly using a set of contact points for providing electrical connections with the print cartridges.
As the printer is used over a period of time, debris such as dust resulting from the media handling and printing accumulates on the guide shaft. The dust is also mixed with the lubricants leached from the bearings. When the guide shaft becomes dirty, it slows down the print head speed and significantly reduces the overall throughput of the printer. When that happens, the guide shaft must be cleaned. Some printers include a shuttle motor test feature, but do not test for a print shaft contamination condition. Certain printers rely on technicians to perform maintenance after a failure caused by print shaft contamination. Yet other printing systems reduce throughput due to the contamination condition without any warning or feedback to the operator.
Accordingly, there is a need for a printing system that is capable of testing for a print shaft contamination condition and for providing a warning to a printer operator.


A new cultivar of hybrid Heuchera named ‘Silver Heart’, characterized by its uniquely colored foliage with leaves that are reddish brown with a silver overlay, its floriferous flowering habit, its purple-red flowering stems with numerous dark pink flowers, and its compact plant habit.

The present invention relates to a new and distinct cultivar of Heuchera of hybrid origin, botanically known as a Heuchera and is hereinafter referred to by its cultivar name 'Silver Heart'.
The new cultivar arose from an ongoing breeding program by the Inventor in Hantay, France. The Inventor sowed seeds that were pooled from crosses made between proprietary plants in his breeding program in 2009. The Inventor selected 'Silver Heart' in 2011 as a single unique plant amongst the 500 seedlings that were evaluated from the above crosses. The exact parentage is unknown.
Asexual propagation of the new cultivar was first accomplished by the Inventor by leaf bud cuttings under the direction of the Inventor in June of 2013 in Paraiso, Cartago, Costa Rica. Asexual propagation of the new cultivar by leaf bud cuttings has shown that the unique features are stable and reproduced true to type in successive generations.


A circuit arrangement for operating a discharge lamp. Input terminals are coupled to the poles of a supply voltage source which delivers a low frequency supply voltage. A rectifier is coupled to the input terminals for rectifying the low frequency supply voltage. A branch interconnects output terminals of the rectifier and includes a series arrangement of a first diode, a second diode, and a third diode. The first and second diodes are shunted by a first capacitor. The second and third diodes are shunted by a second capacitor. A resistor passes current during lamp operation with which the first and second capacitors are charged. Lamp current is generated based on the voltages across the first and second capacitors. The resistor is placed in a branch which passes a low frequency alternating current during lamp operation and which connects an input terminal to an input of the rectifier. The circuit arrangement has a high power factor. Radio frequency interference generated in producing the lamp current is effectively suppressed.

The invention relates to a circuit arrangement for operating a discharge lamp, provided with
input terminals for coupling to the poles of a supply voltage source which delivers a low-frequency supply voltage, PA1 rectifying means provided with inputs coupled to the input terminals for rectifying the low-frequency supply voltage, and provided with output terminals, PA1 a branch D which interconnects the output terminals and which comprises a series arrangement of first unidirectional means D1, second unidirectional means D2, and third unidirectional means D3, the first and the second unidirectional means being shunted by first capacitive means C1, and the second and the third unidirectional means being shunted by second capacitive means C2, PA1 an ohmic resistor R which passes a current during lamp operation with which the first and the second capacitive means are charged, PA1 means M for generating a lamp current from the voltages present across the first and the second capacitive means.
Such a circuit arrangement is known from U.S. Pat. No. 5,387,847. The branch D and the first and the second capacitive means form an alternative to the use of a single buffer capacitance between the output terminals. Since the first and the second capacitive means are charged in series and discharged in parallel, the circuit arrangement has a higher power factor than if it contained a single buffer capacitance between the output terminals. The power factor of the circuit arrangement is further improved by the presence of the ohmic resistor R which limits the amplitude of the current with which the first and the second capacitive means are charged. A power factor higher than 0.95 can be obtained through a suitable choice of the components of the circuit arrangement. The circuit arrangement can be used in a wide range thanks to this high power factor value. For example, if the discharge lamp is a low-pressure mercury discharge lamp, the lamp current is often a high-frequency alternating current, and the means M often comprise one or several switching elements which are rendered conducting and non-conducting which high frequency during lamp operation. A certain amount of radio frequency interference (RFI) is generated thereby, flowing also into the supply mains while the rectifying means are in the conducting state. The first and the second capacitive means act as a filter via the second unidirectional means D2 whereby the amount of RFI is reduced. In the known circuit arrangement, however, the ohmic resistor R is placed in the branch D between the first and the third unidirectional means. The ohmic resistor does limit the amplitude of the current with which the first and the second capacitive means are charged in this position, but the filtering action of these capacitive means is at the same time strongly suppressed, so that the use of the known circuit arrangement generates a comparatively large amount of RFI in the supply mains.

Circuit arrangement for operating a discharge lamp


A shutter base plate is made of synthetic resin and is configured with one overhang section on the blade-chamber-side surface at one end of an arcuate slot and the other overhang section on the blade-chamber-outside surface. A shock absorbing member made from elastic material is configured with concave portions on the blade-chamber-side surface and three concave portions on the blade-chamber-outside surface. The shock absorbing member is mounted to the shutter base plate in such a way that these concave portions come in contact with the overhang sections, and as is well known, when an exposure operation is completed, the driving pin of a driving member abuts on the shock absorbing member.

1. Field of the Invention
This invention relates to a focal plane shutter for cameras, provided with one or two shutter blades.
2. Description of Related Art
In focal plane shutters for cameras, two types are known: those in which two blade chambers are provided between three plate members, called a shutter base plate, an intermediate plate, and an auxiliary base plate so that two shutter blades, called a first blade and a second blade are separately placed in the two blade chambers, and those in which a single shutter blades is placed in a blade chamber provided between the shutter base plate and the auxiliary base plate. The former focal plane shutters are adopted in digital cameras as well as in silver-halide film cameras, while the latter focal plane shutters are adopted only in digital cameras.
In either case of the focal plane shutters, the structure of the shutter blade is nearly the same and the shutter is constructed with a plurality of arms, one end of each of which is rotatably mounted to the shutter base plate, and at least one blade pivotally supported by the plurality of arms through a connection shank. A driving member is rotatably mounted to the blade-chamber-outside surface of the shutter base plate, and its driving pin is extended from an arcuate slot configured in the shutter base plate into the blade chamber and is connected to one of the arms. Thus, the shutter blade is constructed so that an opening and closing operation is performed by the reciprocating rotation of the driving member.
The driving member is rotated at a high speed in an exposure operation, and hence when the operation is completed, the driving pin is made to abut on a shock absorbing member made from elastic material and attached to one end of the slot and is braked by temporarily compressing the shock absorbing member so that the bound of the driving pin is favorably suppressed and the driving pin is stopped. The shape of such a shock absorbing member and a structure for attaching the member to one end of the slot are set forth in Japanese Patent Kokai No. 2001-133839.
As mentioned above, the shock absorbing member on which the driving pin of the driving member abuts when the exposure operation is completed, as disclosed in Kokai No. 2001-133839, is generally made from elastic material, such as butyl rubber, so as to have a planar shape like the letter "C", and is configured with two arcuate overhang sections of nearly the same shape (flange portions in Kokai No. 2001-133839) at both end of the shutter base plate along its plate thickness on the periphery. The shock absorbing member is compressed and deformed in its entirety and is admitted to the slot. The shock absorbing member is restored to its original shape at one end of the slot in a longitudinal direction, and is mounted in a state where the edge of the slot of the shutter base plate is held between the two overhang sections. Hence, in a state where the shock absorbing member is mounted, the two overhang sections protrude from both surfaces of the shutter base plate.
However, the protrusions of the overhang sections of the shock absorbing member from the surfaces of the shutter base plate cause the possibility that other constituent members mounted to the shutter base plate interfere in the operation. This brings about considerable design constraints. For example, when the overhang sections of the shock absorbing member protrude from the shutter base plate into the blade chamber, the shutter must be designed so that the constituent members of the shutter blade are prevented from colliding with the overhang sections during the operation. In particular, a big problem is that the head of the connection shank used to pivotally support the blade with respect to the arms collides with the overhang sections. Thus, in order to avoid this problem, it is conceivable that the thickness of the shutter base plate is reduced for a portion corresponding to the mounting part of the shock absorbing member (a part held between the two overhang sections) so that the overhang sections of the shock absorbing member do not protrude from the surfaces of the shutter base plate in a mounted state of the shock absorbing member.
However, even in the mounting structure mentioned above, the problem is not completely solved. That is, as is well known, the shutter blade vibrates in a direction perpendicular to a working plane (along the optical axis) during the operation. Thus, in this mounting structure, the head of the connection shank is brought into sliding contact with the shock absorbing member by the vibration of the shutter blade during the operation, and thereby the shock absorbing member is also compressed in the direction of the thickness of the shutter base plate. When such sliding contact is repeated for a long term, the overhang sections of the shock absorbing member cease to be restored to the original shape, partly due to the fact that the overhang sections are thin parts. Consequently, the top of a sliding contact part (an arcuate peripheral edge) is raised to project into the blade chamber, and the operation of the shutter blade is made unstable. Since the head of the connection shank is not to abut on the shock absorbing member as in the driving pin but to come into sliding contact therewith, there are problems that the shock absorbing member is subjected to wear, and a shock absorbing function and strength for mounting are degraded.


A bling nozzle/carrier interface design for a steam turbine is provided wherein there is limited contact between the carrier (casing, shell) to allow for ease of assembly. There is also limited contact in strategic locations to both reduce the roll, or downstream deflection, of the inner portion and to improve disassembly due to limited contact in areas where corrosion can occur.

Steam turbine designs consist of static nozzle segments that direct the steam flow into rotating buckets that are connected to a rotor. In steam turbines, the nozzle construction is typically called a diaphragm stage. Typical diaphragm stages are constructed using one of two methods. The first method is a "band/ring" method that uses an assembly comprised of a plurality of airfoils contained in inner and outer bands and then that banded airfoil assembly is welded into inner (web) and outer rings. The second method involves welding airfoils directly to inner and outer rings using a fillet weld at the interface. The second method is typically used for larger airfoils, where access for creating the weld is possible.
However, there are drawbacks to using these methods. One drawback is the inherent weld distortion of both the flow path and the steam path sidewalls. In this regard, current methods of steam turbine nozzle construction consist of high heat input welds using significant amounts of metal filler or deep electron beam welds. This material and heat input causes the flow path to distort and the airfoils often need to be adjusted after welding and stress relief. The result of the distortion is turbine efficiency losses in the steam turbine flow path.
Other methods using single nozzle construction into rings still have welds and mechanical interfaces that are difficult to model and analyze. They also are not as robust to stress level due to the weld interface and interfaces between the nozzles. Another method is to put "hooks" on the nozzle and slide each nozzle into a circumferential groove in the carrier. This method is also difficult and time consuming to analyze using finite element methods for stresses. Additionally, the frequency analysis is not as robust due to in determinant and changing boundary conditions between the nozzles and the carrier.
Thus, in general, current methods of constructing nozzle diaphragms are costly and time consuming in both engineering and manufacturing and all of the current methods consist of some type of weld or mechanical interface between nozzle and rings.
"Bling" design nozzles are currently used very little in steam turbine design. A bling is basically an entire nozzle flow path that is machined out of two half rings with no welding or assembly features. The bling has many valuable design qualities. First, blings have much lower stress levels because there are no weld joints or mechanical discontinuities in the load path. Second, the airfoil tolerances can be greatly improved over welded techniques. Third, they are easier to design and have more determinant frequency characteristics. In this regard, the 3D modeling and finite element analysis of the stress and frequencies is simpler, quicker and more robust due to the simplicity of the design.
An issue with current bling constructions is the interface between the carrier and the bling. In most diaphragm designs there are "crush pins" or small spacers to keep a tight tolerance between the diaphragm and the casing in the axial direction. The spacers act to keep the diaphragm loaded in the aft direction against the steam face. This helps assembly and also aids in the removal of the diaphragm after years of operation. In this regard, after years of operation, corrosion occurs on the surfaces and if the diaphragm to casing interface is tight on both axial faces, then it would be very difficult to get the diaphragm out as it would tend to lock into place due to the corrosion. Blings also "roll" or deflect downstream more than the slid in nozzle design. Many diaphragms use only the crush pins on the lower half (usually 3) and the upper half has a larger gap to the front face. This at times allows the diaphragm upper half to unseat off the back face and allow debris to get behind the face and cause a leakage path.

Bling nozzle/carrier interface design for a steam turbine


A dispensing apparatus for applying a thin stream of flux to a surface of a printed circuit board. The dispensing head travels at a high rate of speed relative to the board during the dispensing of flux to apply thin layers of flux thereto. Preferably, the dispensing head moves transversely to the work path of a conveyor that transports the board through a flux station, at a rate of approximately 20 to 90 inches per second. Tips that dispense the flux are angularly disposed relative to the board and, if desired, make multiple passes over the surface to coat selected regions twice. Either the board is incrementally advanced through the flux station or the dispensing head is incrementally advanced relative to the board so that flux is applied when the board is stationary.

This invention pertains to a method and apparatus for dispensing fluid materials, and more particularly to a method and apparatus for dispensing flux on a surface such as a printed circuit board. The invention is particularly applicable to dispensing a low solids flux and will be described with particular reference thereto. However, it will be appreciated that the invention has broader applications and may be advantageously employed with other types of fluxes.
In fabricating a printed circuit board (PCB), which defines a substrate surface for a printed circuit assembly, three general types of boards are frequently encountered. The first is known as a surface mount board in which only surface mount components are used. A method of securing these components to the board is known as reflow soldering where solder paste is placed on the board, and then the surface mount components located as desired. The solder paste is cured as the board is heated to reflow the solder and complete the electrical connection. Thereafter, the board is cleaned, and if a double-sided surface mount assembly is required, the same process is applied to the opposite side of the board.
The second type of board uses through hole components. As the name implies, these electrical components have leads that extend through holes or openings in the board. The leads are soldered to complete the electrical connection.
In a mixed technology board, a combination of surface mount components and through hole components are used. The surface mount components are assembled and soldered as described above. After the surface mount components are secured to the first side of the board, the through hole components are then located on the board with the component leads extending through openings in the board for a subsequent soldering process. If a double-sided assembly is envisioned, the board is inverted and the surface mount components are applied to the second surface.
In either situation, a soldering operation is required on one surface, typically the bottom surface, of the board. One common soldering process is known as wave soldering in which molten solder is pumped into a wave form and a conveyor assembly transports the board thereover. A surface of the board contacts the peak of the wave and the solder wets the protruding component leads. The solder is drawn up into the through holes to effectively and securely establish an electrical connection. The soldered board, including surface mount components previously adhesively secured to the board, requires subsequent cleaning.
The entire soldering process is actually comprised of three separate and essential steps which are normally performed within a single machine. These steps include (i) flux application, (ii) preheating the board, and (iii) soldering. Soldering flux is generally defined as "a chemically and physically active formula which promotes wetting of a metal surface by molten solder, by removing the oxide or other surface films from the base metals and the solder. The flux also protects the surfaces from reoxidation during soldering and alters the surface tension of the molten solder and the base metal." (Institute for Interconnecting and Packaging Electronic Circuits (IPC), ANSI/IPC/SF-818, "General Requirements for Electronic Soldering Fluxes" 1988 3.1.18) As described in depth in CLEANING PRINTED WIRING ASSEMBLIES IN TODAY'S ENVIRONMENT, edited by Les Hymes, and published by Van Nostrand Reinhold, a printed circuit board must be cleaned with flux to effectively prepare the board for soldering and properly wet the components.
Four general types of fluxes are in common commercial use. Of these, rosin based fluxes are the most widely used, even though they normally require a subsequent cleaning operation to remove rosin flux residue on the board. The residue can adversely impact subsequent testing of the printed circuit board.
Another major category of fluxes includes water soluble fluxes which, as the name suggests, are designed to be cleaned in an aqueous solution. For a variety of reasons, though, this technology is not yet readily accepted.
Likewise, a third category is synthetic activated fluxes, which are decreasing in demand for a number of reasons. For example, the residues must be removed with chlorofluorocarbon (CFC) based cleaners which raises environmental concerns.
A fourth type of flux receiving greater attention in light of the environmental concerns are termed low solids fluxes. Low solids fluxes contain small amounts of solids, e.g., five weight percent or less. Use of low solids fluxes are intended to limit the amount of residue remaining on the board after soldering is completed so that subsequent cleaning operations can be eliminated.
As alluded to above, commercial cleaning operations typically employ CFC's. Studies presently indicate that use of CFC's destroy, or adversely contribute to the destruction of, earth's stratospheric ozone. Thus, elimination of subsequent cleaning operations for printed circuit boards will, in turn, address environmental concerns of ozone depletion associated with post soldering cleaning processes.
Generally speaking, fluxes commonly incorporate a solvent, vehicle, activator, surfactant and antioxidant. The solvent is the liquid carrier for the flux ingredient. An isopropanol or similar type of alcohol is often used as the solvent. The vehicle component of the flux serves as a high temperature solvent during the subsequent soldering operation. The activator, on the other hand, removes contaminants such as oxides to present a wettable surface for the soldering operation. The surfactant encourages solder wetting while the antioxidant limits reoxidation of the component leads.
Known structures and methods for applying flux to a printed circuit board are described in U.S. Pat. No. 4,821,948. These conventional techniques include liquid wave, foaming, brushing, or spraying, all of which are deemed to be deficient in one manner or another in achieving the overall goals of uniformity and effectiveness of flux application.
Focusing more particularly on low solids fluxes, three methods are commonly used. The flux can be applied as a wave in a manner analogous to the wave soldering technique. An open bath of flux is pumped into a wave form and the board surface passed into the wave crest. In addition to problems associated with flux being inadvertently placed on the top of the board, the uniformity of application and ability to precisely control the amount of flux application can be problematic.
Moreover, since the bath of flux is exposed to atmosphere, the specific gravity of the flux is subject to change. With low solids fluxes, conventional techniques of controlling specific gravity with automatic density controllers is ineffective since the low amount of solids in the composition is sensitive to slight changes of solvent.
A foam fluxer may alternately be used. This flux application technique also has an open bath of flux through which air bubbles are passed to form a foam layer. The board is passed through the foam layer to apply the flux to the desired surface. Since this method also requires an open reservoir, control of the specific gravity of the flux is a concern. The bubbling and splattering associated with the foam fluxing technique lacks the desired uniformity and precision of application, along with the potential for flux to be deposited on the upper surface of the board.
The third commonly used technique of applying low solids flux to a board is spraying. The '948 patent describes one type of high velocity spray in which the flux is ultrasonically atomized. More particularly, the flux is dispersed into tiny droplets and directed into the path of a substantially laminar air flow to allegedly provide uniform flux application. An enclosing structure collects and exhausts the vapors that result from this flux application. Other sprays in which the flux is atomized, or a rotating drum spray in which the flux is atomized by an air knife from the surface of a rotating mesh drum, are known in the art.
As the spray nozzle and board move relative to one another according to the various spray techniques, the lack of uniformity of flux application is apparent. A phenomenon known as shadowing results from this relative motion and can be briefly described as areas adjacent a protruding component that fail to receive any flux, or an insufficient amount of flux, because of the relative motion. This is oftentimes categorized as a lack of uniform application, but is itself, a more particular specie of problem associated with the spray application.
Prior spraying techniques do not lend themselves to promotion of "wicking", which results from capillary action due to surface tension. Fluid material naturally tends to adopt the configuration having the lowest surface tension, and it is observed that prior techniques do not take advantage of cohesive and adhesive forces that result in flux material being attracted to desired soldering locations.
The subject invention is deemed to provide a new apparatus and method that overcomes all of the above referred to problems and others and provides for an even, uniform, and precisely controlled application of flux to a surface.


A sensing margin expanding scheme for a memory and a method therefor is disclosed. A first terminal of a first capacitor is coupled to a bit line. A first terminal of a second capacitor is coupled to a reference voltage. In a first phase, the controller controls a first common switch and a second common switch to store the voltage difference between the bit line and the reference voltage to the first capacitor and the second capacitor. In a second phase, controlling the first common switch and the second common switch to open the first terminal of the first capacitor and the second terminal of the second capacitor and open the second terminal of the first capacitor and the first terminal of the second capacitor, and then coupling the second terminal of the first capacitor and the second terminal of the second capacitor to a common voltage.

1. Field of the Invention
The instant disclosure relates to a memory; in particular, to a sensing margin expanding scheme for a memory.
2. Description of Related Art
In these years, the requirement of low power, high speed and high density memory increases, due to the industry growth of mobile device, medical electrical equipment, portable storage . . . etc. Sensing margin time of the memory is the key factor which may limit the access time of the memory.
FIG. 1 shows a diagram of a sensing margin for a conventional memory. A reference voltage VREF is provided for comparing with the bit line (BL) voltage of each cell of the memory. When the bit line capacitance (CBL) is coupled to a sensing amplifier the voltage of the bit line capacitance would drop from a standard VDD as the discharge-time passes. For example, the reference voltage VREF would be defined as larger than the bit line voltage as the discharge-time passes when the bit line store '1', and the bit line voltage would be lower than the reference voltage VREF as the discharge-time passes when the bit line store '0'. A sensing margin time of the bit line voltage is needed for obtaining a distinguishable voltage difference (compared with the offset of the sense amplifier) inputted to the sense amplifier. With low supply voltage, a sense amplifier needs more read margin against PVT variation. Conventional read scheme suffers from slow margin developing and thus has longer access time.

Sensing marging expanding scheme for memory


A method of forming low dielectric insulation between pairs of conductive lines separated by insulating material of a level of interconnection for integrated circuits by selectively removing portions of the insulating material to create spaces for containing a gas with a dielectric constant of slightly above 1. Preferably, the insulating material is a conformal source of silicon oxide, such as tetraethylorthosilicate. The resultant method forms an insulation separating the conductive lines whose composite dielectric constant with the gas in the spaces between the insulating material is not greater than about 3 over a predetermined distance. An integrated circuit having a plurality of semiconductor devices being interconnected by conductive lines separated by insulating material and spaces containing a gas, composite dielectric constant of which is not greater than about 3 over a predetermined distance.

In very large scale integrated (VLSI) circuit devices, several wiring layers are required to connect together the active and/or passive elements in a VLSI semiconductor chip. The interconnection structure consists of thin conductive lines separated by insulation in one layer or level and connected through vias or studs from contacts of the elements of the semiconductor chip or to a similar layer in another level of interconnections. This interconnection structure is similar to a transmission line in that there is a propagation delay of the signals being transmitted in these wiring layers. The delay is referred to as RC delay because it is a result of the resistance (R) of the material of the wire and the capacitance (C) between adjacent wires. With the trend of higher and higher levels of integration in semiconductor devices to ultra large scale integrated (ULSI) circuits, the space or gap between the wires or conductive lines to be filled with insulation is becoming extremely narrow between some of the conductive lines, such as those that are about 0.5 microns and smaller. Such a narrow space or gap between conductive lines increases the capacitance and places greater demands on the insulating properties of the insulation between such conductive lines. Capacitance (C) is the product of dielectric constant (DC) of the insulating material times the area (A) of the opposing faces of the conductive line divided by the distance (D) between the conductive lines. With a decrease in distance (D), the capacitance (C) increases. Since signal delay of signal transmitted on the conductive line is controlled by the RC constant, an increase in capacitance (C) degrades the performance of the integrated circuit.
At the present state of the art, the insulating material used to fill these gaps is a silicon containing compound, such as silicon dioxide, which has a dielectric constant (DC) of between 3.5 and 4.0. A vacuum has a perfect dielectric constant (DC) and is the basis for the measurement of the dielectric constant of other materials. For example, air and other insulating gases have a dielectric constant (DC) of slightly greater than 1, but less than 1.1. Air has a dielectric constant of 1.00059 and oxygen (O.sub.2) has a dielectric constant of 1.000523. The use of insulating material with dielectric constants (DC) lower than 3.5 in the narrow gap will lower the capacitance (C) and offset the increase caused by the smaller distance (D) between adjacent conductive lines. Attempts have been made to use organic insulating materials, such as polyimides which have a DC of between 3.2-3.4, but these materials are hydroscopic and any absorbed moisture can potentially cause corrosion of metal lines. Other possible insulating materials are boron nitride (BN.sub.x) and fluorinated silicon oxide (SiO.sub.x F.sub.y), but they also have dielectric constants above 3 and by themselves cannot achieve a lower dielectric constant.
In addition to the demands placed on the insulating property of the insulation between the conductive lines, these narrow gaps of about 0.5 microns and smaller make it much more difficult to deposit the insulating material into the gaps so that the gaps may not be completely and properly filled. In addition, when the height of the conductive line is increased, this increased height makes it still more difficult to fill, especially when the aspect ratio is 2 to 1 or greater with a gap distance of 0.5 microns or smaller. Aspect ratio is the height (h) of the conductive line divided by the distance (d) or gap between the conductive lines. It is pointed out in U.S. Pat. No. 5,124,014 to Pang-Dow Foo et al. that when the gap or distance (d) is less than the (h) of the conductive line, it is difficult to fill uniformly. U.S. Pat. No. 5,275,977 to Otsubo et al. confirms this problem and the inventors of both patents set the same objective for their processes; namely, the formation of the insulating film free of voids.
The disclosure in the Foo et al. patent describe a method for forming void free insulating layers between the conductive lines and it suggests that, from a detrimental standpoint, voids will form under certain conditions. However, this patent fails to recognize the advantage of voids surrounded by the insulating material in narrow gaps between conductive lines.
However, Ser. No. 08/478,315, filed Jun. 7, 1995, Ser. No. 08/481,906 filed Jun. 7, 1995 and Ser. No. 08/481,030 filed Jun. 7, 1995 and assigned to the same assignee do recognize the advantage of large voids surrounded by insulating material and describe and claim processes for creating a continuous void between at least narrow conductive lines.

Interlevel dielectric with multiple air gaps between conductive lines of an integrated circuit


The present invention relates to novel mammalian DNA-R proteins and genes that encode such proteins. The invention is directed toward the isolation and characterization of mammalian DNA-R proteins. The invention specifically provides isolated complementary DNA copies of mRNA corresponding to rat and human homologues of a mammalian DNA-R gene. Also provided are recombinant expression constructs capable of expressing the mammalian DNA-R genes of the invention in cultures of transformed prokaryotic and eukaryotic cells, as well as such cultures of transformed cells that synthesize the mammalian catecholamine receptor proteins encoded therein. The invention also provides methods for screening compounds in vitro that are capable of binding to the mammalian DNA-R proteins of the invention, and further characterizing the binding properties of such compounds in comparison with known DNA-R agonists and antagonists. Improved methods of pharmacological screening are provided thereby.

1. Field of the Invention
This invention relates to cell membrane-associated DNA binding proteins (termed DNA-R herein) from mammalian species and the genes corresponding to such receptors. Specifically, the invention relates to the isolation, cloning and sequencing of complementary DNA (cDNA) copies of messenger RNA (mRNA) encoding a novel mammalian DNA-R gene. The invention also relates to the construction of recombinant expression constructs comprising cDNA of this novel DNA-R gene, said recombinant expression constructs being capable of expressing DNA-R protein in cultures of transformed prokaryotic and eukaryotic cells. Production of the receptor protein in such cultures is also provided, as well as the production of fragments thereof having biological activity. The invention relates to the use of such cultures of such transformed cells to produce homogeneous compositions of the novel DNA-R protein. The invention also provides cultures of such cells producing this DNA-R protein for the characterization of novel and useful drugs. Antibodies against and epitopes of this novel DNA-R protein are also provided by the invention.
2. Background of the Invention
Extracellular DNA is a potent biological signal, being capable of initiating a wide range of immune responses in vivo and in vitro; including cytokine production, influx of neutrophils, IgM secretion, B-cell proliferation and enhanced natural killer activity. These properties of extracellular DNA enable naked DNA to be used as vaccines, in some instances. In addition, extracellular DNA has been used to introduce new genetic information into cells, both in vivo and in vitro.
One important aspect of extracellular DNA transfer into mammalian cells is gene therapy. Gene transfer therapy offers the potential for treatment of a variety of diseases. The ability to provide safe, efficient, and selective in vivo gene delivery will be a critical component of future protocols. Gene transfer by injection of either plasmid DNA or DNA/liposome complexes has been demonstrated to be safe and permits expression of gene products. The uptake of DNA/liposome complexes does not depend upon specific cell-surface receptors while the mechanism mediating uptake of plasmid DNA by cells remains unknown.
In order to realize the full potential of this technology, safe delivery and efficient transgene expression of DNA in selected tissues and cells must be achieved. One approach to target DNA to tissue is the use of a receptor-mediated mechanism for the binding and internalization of DNA. Viral (retrovirus, adenovirus, adeno-associated virus) delivery of DNA to cells is via a receptor-mediated mechanism, however this technique has limited in vivo clinical application. Viral vectors have been most frequently used for ex vivo gene therapy, but the technical problems associated with transplanting transduced cells remain a serious obstacle. In addition, viral vectors have the potential to lead to virus infection or to induce an immune response against antigenic viral coat proteins.
Non-viral methods of gene delivery include liposomes, the so-called "gene gun", and direct injection. Gene transfer with liposomes has been shown to result in uptake and expression of DNA. Although DNA/liposomes are effectively taken up and the cDNA on the plasmid expressed, the process is believed to be nonspecific with limited possibility of targeting selected tissue. An alternative is to administer plasmid DNA directly, without a delivery system. Cells lines in tissue culture have demonstrated in vitro uptake of plasmid DNA and the expression of the transgene on the plasmid. It has also been shown that DNA, injected directly in vivo, has been taken up and the encoded genes have been expressed. While this approach has been shown to be a safe and free from problems associated with DNA delivery by viruses, the therapeutic potential of this technology is often limited by poor transgene expression from plasmid DNA in many tissues. In addition, the mechanism by which plasmid DNA is bound and internalized into cells is not well established. Knowledge of the mechanism of plasmid DNA binding to the cell surface, and how DNA is internalized and expressed, will be critical to enhancing transgene methods that also have the potential to target selected tissues.
Antisense oligonucleotides (ODN) are another form of extracellular DNA of great importance. ODN are considered potential therapeutic agents against various pathogens and oncogenes due to their ability to specifically inhibit gene expression. When injected into tissues, ODN are internalized by cells and bind to complementary region of mRNA to inhibit translation of proteins in a highly specific manner. Different antisense ODN to HIV RNA have been shown to inhibit the infectivity of the virus in cultured human leukemia cells. Although human clinical trials using ODN to treat AIDS and other diseases are ongoing, the lack of a precise understanding of where and how gene expression is effected hinders the optimization of this technique.
Extracellular DNA is also associated with human diseases, such as cystic fibrosis. Cystic fibrosis (CF) is the most common lethal genetic disease in North America. It affects one in 2500 live births and affected individuals have a median life expectancy of 28 years (Davis et al., 1996, Amer. J. Respir. Crit Care Med. 157: 1234–1239). There is a growing body of evidence showing that inflammation, particularly the injurious products of neutrophils, may be responsible for lung damage (Doring, 1997, Ped. Pulmonol. Supp. 16: 271–272); it is now recognized that most of the morbidity and over 90% of the mortality results from chronic progressive inflammation of the lungs. Corticosteroids have abroad anti-inflammatory effect, particularly on neutrophils. A multicenter trial showed beneficial effects of oral corticosteroids on lung function. However, adverse effects such as growth retardation, glucose abnormalities and cataracts prelude this treatment as a long-term option (Eigen et al., 1995, J. Ped. 126: 515–523). The nonsteroidal anti-inflammatory drug, ibuprofen, has also been studied (Konstan et al., 1995, N. Engl. J. Med. 332: 848–854). The drug is beneficial, but continued monitoring is needed to determine the safety of long-term, high dose therapy. Other therapies that treat the injurious products of neutrophils, for example, antiproteases and antioxidants, are currently under investigation (Konstan, 1998, Clin. Chest Med. 19: 505–513).
The vicious airway fluid characteristic of CF can obstruct airflow and provides a viable growth medium for pathogenic bacteria, and cell lysis of these bacteria can produce extracellular DNA that causes inflammation. Recombinant human Dnase (rhDNase) has been clinical use since 1994 (Kontsan, 1998, ibid.). The rhDNase, administered by inhalation, has been used to cleave the extracelular airway DNA and reduce the viscosity of the airway fluid. Treatment with rhDNase produces a small improvement in lung function (Cramer & Bosso, 1996, Ann. Pharmacol. 30: 656–661). However, when treatment is stopped, patients can deteriorate to a point below their previous baseline (Bush, 1998, Ped. Pulmonol. 25: 79–82). In addition, a recent report showed that despite improvements in lung function, there were no changes in airway inflammation (Henry et al., 1998, Ped. Pulmonol. 26: 97–100). Although the DNA is broken down by the Dnase, it is not entirely degraded, and hydrolized fragments are still potentially immunostimulatory and can contribute to inflammation. Thus rhDNase may be masking the process of on-going lung destruction.
There are also a variety of conventional treatments for CF including physiotherapy, nutritional support and drugs (Bilton & Mahadeva, 1997, J. Royal Soc. Med. 90: Suppl. 31,2–5). Because the events that trigger and sustain inflammation in patients with CF are not clearly understood, a variety of approaches have been developed to treat different components of the disease. Antibiotics, anti-inflammatories, and therapies to reduce the viscosity of the airway fluid are all approaches that are being used and investigated. Aggressive antibiotic therapy has helped the acute control of infection, but rarely if ever are the bacteria in the airways of patients with CF completely eradicated. These pathogenic bacteria chronically stimulate and exacerbate inflammation. Although some of the currently-available treatments can help to alleviate symptoms and slow the progression of disease, none of the current treatments can prevent ultimate respiratory failure.
One important clinical observation is that greatly increased amounts of extracellular DNA, of host and bacterial origin, are present in the airway of patients with cystic fibrosis. Recent investigation has demonstrated that extracellular DNA, purified from sputum of patients with CF, will directly induce inflammation in the mouse lung (Schwartz et al., 1997, J. Clin. Invest. 100: 68–73). The DNA purified from the sputum of patients with cystic fibrosis has been shown to be composed primarily of host-derived DNA and only a small fraction appears to be bacterial DNA (Schwartz et al., 1997, ibid.). One possible explanation is that extracellular DNA binds to immune lung cells in the lungs and induces the secretion of pro-inflammatory cytokines and neutrophic migration to the lung, leading to severe airway inflammation. Extracellular DNA binding to immune cells in the lung, such as alveolar macrophages are stimulated to produce pro-inflammatory cytokines that recruit and activate neutrophils leading to inflammation. When these neutrophils undergo apoptosis and release their DNA the cycle is repeated and inflammation is maintained or increased. Thus, methods and reagents that block DNA binding to cytokine producing cells may therefore provide better treatment of CF patients than are currently available.
Although there have been several reports in the art that DNA could bind to cell surfaces (Bennett, 1993, Antisense Res. Develop. 3: 235–241; Bennett et al., 1986, J. Rheumatol. 13: 679–685; Gabor & Bennett, 1984, Biochem Biophys. Res. Commun. 122:1034–1039; Hefeneider et al., 1990, J. Invest. Dermatol. 94: 79S–84S; Bennett et al., 1987, J. Exp. Med. 166: 850–863; Bennett et al., 1991, Clin. Exp. Immunol. 86:374–379; Bennett et al., 1992, Clin. Exp. Immunol 90: 428–433; Bennett et al., 1985, J. Clin. Invest. 76: 2182–2190; Hefeneider et al., 1992, Lupus 1: 167–173; Hefeneider et al., 1992, Clin. Immunol. Immunopath. 63: 245–251; Reid & Chalson, 1979, Intl. Rev. Cytol. 60: 27–52; Lerner et al., 1971, Proc. Natl. Acad. Sci. USA 68: 1212–1216; Pancer et al., 1981, J. Immunol. 127: 98–104; Meinke & Goldstein, 1974, J. Molec. Biol. 86: 757–773; Sudar et al., 1986, Cell. Molec. Biol. 32: 87–91; Gasparro et al., 1990, Photochem & Photobiol. 52: 315–321; Emlen et al., 1988, Amer. J. Pathol. 133: 54–60), the art lacks an understanding of how cells mediate extracellular DNA binding. Thus, an understanding of the mechanisms by which eukaryotic cells, particularly mammalian cells, take up extracellular DNA would be important in improving a variety of biological processes.


A semiconductor package includes a first interposer, a second interposer, a first die, a second die and at least one bridge structure. The first interposer and the second interposer are embedded by a first dielectric encapsulation. The first die is disposed over and electrically connected to the first interposer. The second die is disposed over and electrically connected to the second interposer. The at least one bridge structure is disposed between the first die and the second die.

In recent years, the semiconductor industry has experienced rapid growth due to continuous improvement in integration density of various electronic devices, e.g., transistors, diodes, resistors, capacitors, etc. For the most part, this improvement in integration density has come from successive reductions in minimum feature size, which allows more devices to be integrated into a given area.
These smaller electronic devices also require smaller packages that occupy less area than previous packages. One of the promising semiconductor packages is a "chip on wafer on substrate (CoWoS)" structure for advanced products targeting cloud computing, data center, and super computer applications. Although the existing semiconductor packages have been generally adequate for their intended purposes, they have not been entirely satisfactory in all respects.

Semiconductor packages and methods of forming the same

Taiwan Semiconductor Manufacturing Company, Ltd.


A mobile radio communication apparatus includes a first housing including an input part, a second housing including a speaker and a display, a hinge part that connects the second housing to the first housing so that the second housing can be folded over the first housing, an opening mechanism that automatically opens the second housing from a folded state to a first angle between 160° and 170° relative to the first housing in a non-stop motion, a damper mechanism that brakes opening of the second housing by the one touch opening mechanism, and a free stop mechanism that maintains the second housing relative to the first housing at a second angle.

The present invention relates generally to a foldable portable phone (which includes a personal digital cellular ("PDC") and a personal handy phone system ("PHS")), and another mobile communication terminal, which are generically referred to as "mobile radio communication apparatus" in the instant application, and more particularly to an internal structure of its hinge part.
Recent widespread mobile radio communication apparatuses, such as PDCs, have roused various demands including operational comfortableness and safety, apparatus's versatility and smaller housing, etc. in addition to mere communications.
In general, there are two types of portable phones, i.e., foldable portable phones and non-foldable, rod-shaped portable phones. The foldable portable phones typically include a movable part that contains a liquid crystal display ("LCD") screen, a fixed part that contains a ten-key, and a hinge part that connects them foldably. Some foldable portable phones include a free stop function, a one touch opening function, and a safety-improving oil damper (see, for example, Japanese Patent Applications, Publications Nos. 2002-344597, 2001-165144, 2001-177266, and 10-65778). For the apparatus's versatility, there have been proposed the camera function and Internet access function that allows a user to access the Internet to download Web information and motion-picture information.
The free stop function is one that maintains an arbitrary angle between the movable part and the fixed part. The one touch opening function is one that automatically opens the movable part when a push button on the fixed part is pressed. The oil damper is such a damper as stores oil in a hinge part's case, and uses oil's viscosity to absorb vibrations when the movable part opens.
However, these conventional portable phones do not sufficiently satisfy the operational comfort and safety to both call and non-call functions.
For example, in the call operation, the best angle for calling (referred to as the "best call angle" hereinafter) is ergonomically between the movable part and the fixed part is between about 160° and about 170°. When the angle between the movable part and the fixed part is smaller than the best call angle, the user should manually increase the angle to the best call angle.
In this respect, Japanese Patent Application, Publication No. 2001-165144 describes, at its paragraph no. [0034], a call at an opening angle state of about 145° using the one touch opening function. However, indeed a user must manually open the angle to the best call angle and two opening actions lowers the operability and require a long time to prepare for a call. Japanese Patent Application, Publication No. 2001-177266 similarly uses the one touch opening mechanism to open the housing up to 20° and then requires a manual opening up to 165°, lowering the operability, as described at its paragraph nos. [0014] and [0015].
On the other hand, Japanese Patent Applications, Publication Nos. 2002-344597 and 10-65778 disclose a one touch opening function that opens the housing up to the best call angle in a non-stop motion. However, when the opening angle in a non-stop motion is set to the best call angle as in these references, the reaction or kick in the opening is so large that it causes a safety problem, for instance, the housing undesirably jumping off from the user's palm. In addition, Japanese Patent Application, Publication No. 10-65778 particularly attaches the push button for the one touch opening mechanism to the movable part as in its FIG. 11, and allows the fixed part to open by its own weight. Since the user usually enters a telephone number while holding the fixed part during the transmission, a switch of the hand from holding the movable part to holding the fixed part after opening deteriorates the operability.
Thus, the one touch opening mechanism having excellent operational comfort and safety has not yet been proposed.
In addition, due to the recent demands for multiple functions, such as a camera function and an Internet function, a user needs to view motion and still pictures while placing the cellular phone on the desk or another location at a desired opening angle, and to take a picture while maintaining the predetermined opening angle or at a desired camera angle. Therefore, the free stop mechanism is needed for the versatility.
As discussed, in order to meet the recent demands for improved multifunction cellular phones, it is necessary to provide a cellular phone that has a one touch opening function that opens the housing to the best call angle at the calling time and a free stop function for a non-call function. In addition, it is necessary to maintain the small size of the cellular phone with these functions. For example, it is an undesirable arrangement of an engagement/disengagement mechanism coupled with a push button of the one touch opening mechanism, as in Japanese Patent Application, Publication No. 2001-165144, when the engagement/disengagement mechanism is separately provided from a forcing mechanism that opens the movable part from the fixed part and is located at a different position from that of the forcing mechanism, because this arrangement undesirably enlarges the size of the housing.


A punching and perforating cylinder and a die and anvil cylinder are part of a computer paper processing system producing the line holes and the cross perforation in a continuous paper web. The PUNCH/PERF cylinder is mounted on an upper shaft, while the DIE/ANVIL cylinder is mounted on a lower shaft. The upper and lower shafts are rotatably engaged by a set of gears. At both ends of the PUNCH/PERF cylinder, holes are located to accept the PUNCHES. At both ends of the DIE/ANVIL cylinder, holes are located to accept the DIES. While the two cylinders are rolling together, the punches engage with the dies and form the punched line holes in the continuous paper web. The PUNCH/PERF cylinder has longitudinally formed slots, providing the space for the cross perforating blades and for the cross perforating blade clamping bars. The DIE/ANVIL cylinder has longitudinally formed slots, providing the space for the hardened anvil bars. While the two cylinders are rolling, the cross perforating blades are engaged with the anvil bars and form the cross perforation in the continuous paper web. At both ends of the cross perforating blade locking bars, holes are located to accept the punches, providing the punch hole locations in the cylinder, circumferentially. At both ends of the anvil bars, holes are located to accept the dies, providing the die hole locations in the cylinder, circumferentially. The combined punching and perforating cylinder set enables it to complete both the punching and perforating operations in a continuous paper web by only one set of rotating cylinders.

1) Field of Invention
The present invention relates generally to punching and perforating units.
With the increasing use of folded paper for web printing, computer, word processing and other high speed printing applications, a need has arisen for punching and perforating units for punching and perforating a continuous web of paper, which are simple to manufacture, economical, easy to set-up, operate, and efficient. Further, the ability of changing and setting-up the paper processing system for different format sizes, without the need of highly skilled technicians, is obtainable.
2) Description of the Prior Art
In the past, the computer paper processing was accomplished by three operations. Specifically:
First, at the punching station the line holes were punched at both edges of the continuous paper web.
Second, at the cross perforating station, the cross perforation was created across the paper web.
Third, between the punching and perforating stations a length compensator was used, in order to bring the cross perforation line in register and between the punched line holes.
In addition, for bridging the drive between the punching and the perforating stations, either an idler gear, or some means of drive was needed.
In the past, the computer paper processing systems needed separate setting-up for each stations independently. Specifically:
At the punching station, two sets of punch and die rings were utilized for punching the line holes at both edges of the continuous paper web simultaneously. The distance between the (upper) punch rings, and the distance between the (lower) die rings were set individually for the edge-to-edge distance, while an alignment had to be observed between the punch and die rings. As for the next setting, the punches had to be brought in line with the dies exactly for proper punch-die engagement. This was accomplished by the SLIP gears, which are rotatably adjustable. Finally, an ANTI-BACKLASH type gear adjusted the relative rotational clearance between the punching ring shaft gear teeth and the die ring shaft gear teeth, for proper operation.
At the perforating station, the cross perforating blades were installed into the slots of the perforating cylinder. For the next setting, an ANTI-BACKLASH type gear was used, for eliminating the gear teeth clearance between the perforating cylinder gear and the anvil cylinder gear, for proper operation. Both the perforating cylinder and the anvil cylinder were full cylinders. The anvil cylinder was hardened all around. Both cylinders embodied the elements of the shaft, gear, bearings, retainer, shield and all related components.
The compensator was utilized as part of the set-up to bring the cross perforation line in register with the punched line holes. This was done while the equipment was running slowly, and the results of the correction were observed by the naked eye. Thus, the magnitude of the accuracy depended on the skill of the technician.

Punching and perforating unit with combined punching and perforating cylinders


A method and apparatus for a timer service for program components. An embodiment of a method includes receiving a request for a timer for a program component. The method further includes establishing the timer for the program component, where the program component timer is implemented as a shared session. A timeout is received for the generated program component timer, and the timeout is resolved for the program component.

In computer operations, programming may commonly use program components. Components may include, but are not limited, to JavaBeans for Java operations. Java operations may include operations under the J2EE (Java 2 Platform, Enterprise Edition) environment. Java beans include enterprise JavaBeans (EJBs), where Enterprise JavaBean technology is the server-side component architecture established for the J2EE platform. The operation of enterprise JavaBeans are defined by the Enterprise JavaBeans Specification, Version 2.1, Final Release Nov. 12, 2003 (Release: Nov. 24, 2003), the Enterprise JavaBeans Specification, Version 3.0 Proposed Final Draft, Dec. 19, 2005 (Release: Dec. 21, 2005), and subsequent standards (referred to herein jointly as the "EJB specification").
In utilizing program components, it may be useful to implement timers such that the operation of a component may be subject to a timeout after a certain time period. The timers may be implemented in, for example, a timer service. In one example, a timer service may be provided to register an EJB for a timer callback, which may, for example, occur at a specified time, after a specified elapsed time, or at specified time intervals. The implementation of timers may include an implementation by an EJB container as provided in the EJB specification.
However, conventional timer implementations for components, including EJB timer systems, have certain drawbacks in operation. Certain implementations may be inefficient and overly complex. For example, a timer for a component may be generated as another program component, with the timer service normally persisting timers in a database. In such system, the program code or module that is responsible for a timeout notification is generally decoupled from the program code or module that is responsible for the timer persistence. Further, in certain processes the persistence of timers is used to provide fault tolerant operation because the process does not include a failover facility.

Timer service computer program components


A reaction material for a chemical heat pump includes type III anhydrous gypsum, a magnesium compound, and CaxMg1-xSO4. The reaction material for the chemical heat pump structurally changes between a compound including type III anhydrous gypsum, the magnesium compound, and CaxMg1-xSO4, and a compound including hemihydrate gypsum, a hydrate of the magnesium compound, and a hydrate of CaxMg1-xSO4 when subjected to heat storage process and heat release process. x is 0<x<1.

1. Technical Field
Exemplary embodiments of the present disclosure generally relates to a reaction material and a chemical heat pump.
2. Related Art
In recent years, from the standpoint of energy conservation, heat recovery systems such as chemical heat pumps that effectively employ heat sources such as excessive exhaust heat are attracting attention.
Chemical heat pumps are systems that conduct supplying of heat and storage of heat employing exothermic and endothermic phenomenon accompanying reversible chemical reaction (hydration reaction and dehydration reaction) occurring between a reaction medium and a storage material (hereinafter referred to as reaction material). Typically, chemical heat pumps include a reactor including a heat exchanger having a reaction material reacting in a reversible manner with the reaction medium, an evaporator for evaporating a liquid reaction medium, a condenser for condensing a gaseous reaction medium, and an opening and closing mechanism that connects the reactor, evaporator, and condenser.
Specific materials as the reaction material for the chemical heat pump have been reviewed such as materials employing calcium oxide (CaO), materials employing magnesium oxide (MgO), and materials employing calcium sulfate (CaSO4). Recently, among chemical heat pumps, a chemical heat pump employing calcium oxide or magnesium oxide as the reaction material is attracting attention. For example, see JP-2010-185035-A and JP-H9-026225-A. However, in a heat pump of either JP-2010-185035-A or JP-H9-026225-A, there is a problem of decline in reaction rate of the reaction material by repeating heat storage and heat release processes.
On the other hand, when calcium sulfate is employed as the reaction material, type III anhydrous gypsum (referred to as type III calcium sulfate) is employed from the standpoint of heat storage-release properties. In heat release process, reaction heat generated by reaction of type III calcium sulfate and the reaction medium is extracted. In heat storage process, an external heat such as excessive exhaust heat is added to calcium sulfate hemihydrate (calcined gypsum) and the reaction medium is desorbed.
However, a decline of reaction rate of the reaction material is also a problem when calcium sulfate is employed as the reaction material. The decline in reaction rate when calcium sulfate is employed as the reaction material is mainly due to phase change of crystal structure of calcium sulfate. More specifically, crystal structure of type III calcium sulfate changes to a more stable crystal structure of type II anhydrous gypsum (referred to as type II calcium sulfate) by repeating heat storage and heat release processes. Thus, there is a problem of decrease in heat storage amount and heat release amount.

Reaction material and chemical heat pump


An image forming apparatus heats and fixes a toner image on a recording material, discharges and cools the recording material, and prevents the heated and fixed toner image on the recording material from being melted. The apparatus also has a conveying portion that is prevented from being cooled, so that unevenness of cooling of the toner image is prevented, and the image forming apparatus does not cause any contact mark of the conveying portion.

1. Field of the Invention
The present invention relates to an image forming apparatus for forming a toner image on a recording material.
2. Description of the Related Art
A recording material discharged immediately after a toner image formed on the recording material has been heated and fixed is at a high temperature. In normal circumstances, immediately after the heating and fixing process, the recording material is discharged to a discharge tray by, e.g., a discharge roller. Accordingly, high-temperature recording materials are stacked on the discharge tray, and the toner image that has been heated and fixed onto the recording material may be melted again by the high-temperature recording materials that have been discharged, and the toner image may stick to the back surface of the recording material.
In order to solve such a problem, external air that has been drawn by, e.g., a fan, is blown onto the recording materials discharged onto the discharge tray to cool the recording materials, so that the toner image that has been heated and fixed on the recording material is prevented from being melting again.
For example, Japanese Patent Laid-Open No. 2005-77565 indicates that a cooling fan cools a portion around a discharge roller provided downstream of a fixing device, and in accordance with whether a discharge device is attached or not, the flow of air from the cooling fan is changed.
When a high-temperature recording material is stacked on a discharge tray, a toner image heated and fixed on the recording material is melted again by high-temperature, previously-discharged recording materials. Accordingly, the toner image attaches to the back surface of the recording material. In order to prevent this, the recording material is cooled by blowing external air, which is retrieved by, e.g., a fan, onto the recording material discharged onto the discharge tray, and the toner image heated and fixed on the recording material is prevented from being melted again.
However, when the recording material is cooled, the discharge roller and the like are also cooled, and therefore, unevenness of cooling occurs in the toner image because of the difference in the temperature between the recording material discharged immediately after the heating and fixing process and the discharge roller and the discharge driven roller, and failure may occur in the image, e.g., the occurrence of contact marks of the discharge roller and the discharge driven roller.
The present invention solves the above problem, and it is desirable to cool the recording material on which the toner image has been heated and fixed and which has been discharged, and the toner image, which has been heated and fixed on the recording material, is prevented from being melted again. Further, the present invention provides an image forming apparatus that prevents the conveying portion from being cooled, thus preventing unevenness of cooling of the toner image, and preventing the making of any contact mark of the conveying portion.

Image forming apparatus including an air-blowing portion configured to blow air guided to a recording material


A photovoltaic (PV) power system having distributed square wave current DC to AC inverters integral with strings of PV cells in a PV array. The PV array is arranged into four quadrants and phase-shifted and summed AC voltages from each quadrant are further summed in a 12-phase to 3-phase transformer to produce a sinusoidal 3-phase AC voltage with a total harmonic distortion of less than 5 percent.

This invention relates to a photovoltaic (PV) power system and in particular to an improved method and apparatus for converting DC power to AC power for introduction to a utility grid.
The prior art teaches subjecting a photovoltaic array to solar radiation for generating electrical power for a variety of purposes. In U.S. Pat. No. 5,293,447, issued Mar. 8, 1994, to Fanney et al., there is shown a photovoltaic Solar Water Heating System where solar energy is collected and centrally combined where it is converted to electrical energy for heating a water tank.
The prior art also teaches generating electrical power for a utility grid. Photovoltaic arrays produce a DC voltage which is collected and centrally combined and then converted to an AC voltage by a complex power inverter for use on the utility grid. Existing PV power systems differ mainly in the style of PV module mounting. There are passive PV arrays and tracking PV arrays. The tracking arrays have had varying degrees of reliability problems associated with the tracking mechanisms. The problems with passive arrays have been primarily related to the DC connections of the panels.
In U.S. Pat. No. 4,591,965, issued May 27, 1986, to Dickenson, there is shown an inverter for converting direct current (DC) produced by several photovoltaic solar arrays to a polyphase alternating current (AC). Direct current generated by the PV arrays is applied to switching poles which connect the applied direct current to three lines V.sub.A, V.sub.B, and V.sub.C. No two of the arrays supply current to the same AC line and the current generated by each of the arrays is applied to some one of the AC lines as a result of an inverter switching action.
In U.S. Pat. No. 4,922,124 issued May 1, 1990 to Nagataka Seki et al., power converter device comprising a plurality of self-commutated voltage type inverters is disclosed wherein each input of the inverters is connected to a common DC circuit and the outputs of each inverter are connected to designated windings of transformers which have AC windings arranged in a zigzag connection; serially connected AC windings of the transformers are connected to a utility power system via AC switches. Seki et al. teach effective means of preventing DC overvoltage and preventing excess transient voltage when the transformer units are connected to utility power systems by synchronous making. However, the power converter device of Seki et al. is complex requiring control of DC sources which requires resistors for discharging capacitors, and to absorb regenerative energy resulting in reduced efficiency. Seki also requires a DC overvoltage suppression device on AC switch for controlled connection of AC windings, deliberate sequencing of the multiple self-commutated voltage type converters, an auxiliary charging circuit and a particular start-up sequence.
FIG. 1 shows a system block diagram of a photovoltaic power station as known in the prior art. A PV array 12 receives solar radiation from the sun 11 and converts the solar energy into electrical energy in the form of direct current. The DC is collected by DC switch gear 14 and fed to a DC-AC inverter 16 which converts the DC to three-phase AC. The AC is coupled to AC switch gear 18 for control of low voltages and then the AC is fed to a transformer 20 which generates a high voltage three-phase AC. AC switch gear 22 is coupled to the three-phase outputs of the transformer 20 and such three-phase outputs are fed via the switch gear 22 to high voltage transmission lines 24. A key requirement for connection of a PV power station to the utility grid is that the current waveform of the power being delivered have no more than a total harmonic distortion (THD) of 5% with no individual harmonic having a magnitude of greater than 3% with respect to the fundamental current.
In the PV power station as shown in FIG. 1, the single DC to AC inverter 16 represents a single point failure and needs to switch at high frequency, and use pulse width modulation to meet the total harmonic distortion requirements. The DC power for the array 12 is connected via a significant amount of wiring contained generally in underground trunks and then the DC wiring is all combined in DC switch gear 14. A DC voltage has problems associated with plating action experienced when an electrolyte is subjected to a steady DC potential, creating a plating current in the electrolyte. The resulting plating action causes an ever reinforced plated path to ground caused by the material removed from the conductor (wire or connector) by this action. Eventually a ground fault results in the system, and there is additional concern for potential open circuit failure of the wiring or connector as a result of loss of material due to the plating action. An electrolyte is naturally formed with moisture from condensation including rain and materials found in dirt and dust. Rainwater will often be an electrolyte when mixed with air pollutants causing, for example, an electrolyte such as acid rain. In addition, there are many other problems with the present technology as illustrated in FIG. 1 ranging from the DC to AC inverters being complex and very expensive to EMI/RFI issues exacerbated by high frequency switching circuits.
Because PV energy is low density for utility scale power, a power station may cover several acres. Hence, the wire for collection of the power from the PV array is extensive and represents a significant opportunity for the problems described above for DC wiring to occur. All these problems identified with the prior art PV power station are overcome by the present invention.
Further, in the prior art high frequency switching inverters need filters to take care of EMI/RFI and waveform purity. These filters create uncertainties in installations with a utility grid due to Kilo Volt Amp Reactive (KVAR) generation that needs to be provided by the utility; also there are unpredictable interactions with the system that is being connected to, with respect to resonances being formed between the system reactance and the filters. The present invention overcomes the problems and disadvantages of the prior art described hereinbefore.

Power conditioning system for a four quadrant photovoltaic array with an inverter for each array quadrant


A method is disclosed, operating a mobile station in a wireless network system comprising a plurality of base stations allocated in N channels. A Data packet is transmitted at a time interval p to a first base station of the wireless network system to which the mobile station is currently connected. Each of a plurality of partial scan sections is performed at the interval of every M data packets to monitor messages from the base stations of the N channels.

The invention relates to wireless local area networks (WLAN), and more particularly to a background scan mechanism for a mobile station in a WLAN.
This section is intended to introduce the reader to various aspects of the art, which may be related to various aspects of the invention, which are described and/or claimed below. This discussion is believed to be helpful in providing the reader with background information to facilitate a better understanding of the various aspects of the invention. Accordingly, it should be understood that these statements are to be read in this light, and not as admissions of related art.
According to a conventional handover mechanism, a handover operation is initiated by a mobile station (MS), such as a mobile phone, rather than an access point (AP). The mobile station performs a background scan to gather information to determine a time and target for the handover operation.
Conventionally, background scans and other applications may interfere with each other. For example, according to a real-time transport protocol (RTP), a RTP packet can carry any data with real-time characteristics, such as interactive audio and video. Referring to FIG. 1A, a RTP packet 10 is sent at intervals of T. For example, for VoIP (Voice over IP) data, T may be 20 ms (G.711 and G.729) or 30 (G. 723.1); for IPTV data, T may be at least 20 ms (AMR and AWB). For example, in a wireless network system comprising 14 WLAN channels, it takes 14 S to complete a round of background scan, wherein S is the time required for scanning one channel. Generally, S ranges between 7 ms and 11 ms. Accordingly, it takes 154 ms (11*14) to complete a round of background scan. In this case, if the priority is given to RTP packets 10, operations of background scan 13 may be interrupted by delivery of a RTP packet 10, as shown in FIG. 1B. On the other hand, if the priority is given to the background scan 13, delivery of the RTP packet 10 may be blocked by the background scan 13, as shown in FIG. 1C.
Therefore, a background scan mechanism is required to perform the background scan without interfering with other delivery operations.

This patent is subject to a terminal disclaimer.

Method for background scan in a mobile wireless system