The capacity of a terrestrial wireless communications system that uses a terrestrial frequency band for communications with wireless terminals is expanded by utilizing a satellite frequency band for terrestrially receiving terrestrial communications from the wireless terminals. Since the wireless terminals are configured to transmit communications to a space-based component such as a satellite via a satellite frequency band, these transmissions also may be picked up (received) terrestrially. Thus, terrestrial base stations can be equipped with satellite frequency band receivers that can receive communications from the wireless terminals over a satellite frequency band. By using the satellite frequency band receiver in a terrestrial base station, additional capacity and/or quality of service may be provided for a terrestrial and/or satellite communications system.

Terrestrial wireless communications systems and methods such as terrestrial cellular communications systems and methods are widely used to provide voice and/or data communications to subscribers within a prescribed geographic area. For example, analog terrestrial cellular communications systems and methods, such as those designated AMPS, ETACS, NMT-450 and NMT-900 have been deployed successfully throughout the world. Digital cellular radiotelephone systems and methods, such as those designated IS-1 36 in North America and GSM in Europe also are being widely used. Moreover, Personal Communication Services (PCS) cellular systems and methods, such as those designated IS-95, PCS-1900 and PACS in North America, DCS-1800 and DECT in Europe, and PHS in Japan, also have been deployed for voice and/or high bit-rate data communications.
As is well known to those having skill in the art, terrestrial cellular communications systems and methods may employ a plurality of terrestrial components, also referred to as base stations, which transmit communications to a plurality of wireless terminals over a terrestrial cellular frequency band and receive communications from the wireless terminals over the terrestrial cellular frequency band. The wireless links that are used to transmit communications from the base stations to the wireless terminals are also referred to as forward links, and the wireless links that are used to receive communications from the wireless terminals at the base stations are also referred to as return links.
The following Table illustrates frequency bands that have been designated for terrestrial cellular and satellite cellular use in the United States. These frequency bands are only representative, and other frequency bands may be used within or outside the United States.
TABLEForward LinkReturn LinkTerrestrial Cellular869.01–893.97MHz824.01–848.97MHzTerrestrial Cellular1930–1990MHz1850–1910MHzPCSSatellite Cellular1525–1559MHz1626.5–1660.5MHzL-BandSatellite Cellular2484.39–2499.15MHz1610.73–1625.49MHzBig LEO-BandSatellite Cellular2165–2200MHz1990–2025MHzS-Band
The overall design and operation of terrestrial cellular communications systems and methods are well known to those having skill in the art, and need not be described further herein. Moreover, as used herein, the term "wireless terminal" includes cellular and/or satellite radiotelephones with or without a multi-line display; Personal Communications System (PCS) terminals that may combine a radiotelephone with data processing, facsimile and/or data communications capabilities; Personal Digital Assistants (PDA) that can include a radio frequency transceiver and a pager, Internet/intranet access, Web browser, organizer, calendar and/or a global positioning system (GPS) receiver; and/or conventional laptop and/or palmtop computers or other appliances, which include a radio frequency transceiver.
As the number of users and/or applications in a terrestrial wireless communications system or method continue to increase, it may be desirable to increase the capacity and/or quality of service of the forward and/or return links that are used for communications between the base stations and the wireless terminals. One way to increase this capacity and/or quality of service is to increase the frequency spectrum that is available for use by the terrestrial wireless communications systems and methods. However, as is well known, the radio frequency spectrum generally is tightly controlled by governmental agencies, such as the Federal Communications Commission (FCC) in the United States. The FCC regulates the frequency bands that electronic equipment may use to transmit information, and also regulates the maximum in-band and/or out-of-band power levels that may be radiated by the specific equipment type.

Systems and methods for increasing capacity and/or quality of service of terrestrial cellular and satellite systems using terrestrial reception of satellite band frequencies


The present invention provides a method of forming an alloy interconnect in an integrated circuit having a dielectric layer with an opening formed therein. In an advantageous embodiment, the method comprises the steps of forming a metal alloy within the opening. The metal alloy comprises at least a first and a second metal with the first metal selected from a Group 13 metal and having a melting point substantially lower than a melting point of the second metal and the dielectric. This particular method further comprises the steps of subjecting the first and second metals to a temperature sufficient to melt the first metal and reflow the metal alloy.

Integrated circuits in general, and CMOS devices in particular, have continued to gain wide spread usage as demands for increased functionality and enhanced benefits continue to increase. In order to meet this demand, the integrated circuit industry continues to develop new circuit structures that enhance capabilities and extend the use of existing fabrication processes and equipment.
Key to the fabrication of integrated circuits is the ability to construct highly reliable and low resistance connections between the individual semiconductor device terminals themselves and other needed circuit components including various power supplying and common signal carrying conductor structures (buses). The industry often refers to connections made directly to a semiconductor device terminal as a contact (or windows) and connections made between other conductor structures as vias. The use of both tungsten and aluminum are well established in the art for use in this capacity.
The standard practice in the industry is to use tungsten plugs for contact (or window) and via-fill processes and Al-alloys (Al--Si, Al--Cu, Al--Cu--Si) for interconnect materials. Unfortunately, as contact and via dimensions decrease, their contact resistance to underlying material increases, especially with W-plugs (see Dixit et al., IEDM 1994). Consequently, two all-Al solutions have been advanced in the literature, (instead of w-plug/Al interconnect structure), that allow significant reductions in contact or via resistance over that obtained with W-plugs. The first solution is a force-fill method (Dixit et al., loc cit) and the second solution is a two-step Al reflow process (Zhao et al., IEDM 1996). However, process temperatures of approximately 450.degree. C. are required during the two-step reflow process for the aluminum to flow, form and adhere properly.
Current technology is expanding to the use of new dielectric materials that have a lower dielectric constant, such as polymer-based aerogels. Unfortunately, however, these polymer-based materials are easily damaged by the high processing temperatures (e.g., approximately 450.degree. C.) normally associated with the reflow processing of aluminum. Accordingly, these materials necessitate the use of lower process fabrication temperatures than are normally used with silicon-based dielectrics. Typically, process temperatures must not exceed a maximum of 350.degree. C. to avoid damaging these new dielectric materials. In an effort to lower the deposition temperatures typically associated with aluminum, some investigators have alloyed aluminum with germanium such as those disclosed in K. Kikuta and T. Kikkawa; J. Electrochem. Society; Vol. 143, No. 1, p. 228-232; January 1996. In such processes, the aluminum-germanium alloy is deposited in the contact opening or via. As is well known, pure aluminum melts at approximately 660.degree. C. Alloys of aluminum and germanium however, lower the melting point drastically. Unfortunately, germanium does not wet the dielectric material well and therefore requires a wetting layer of polysilicon to form and flow properly. Another problem with using a germanium-aluminum alloy is that the germanium precipitates epitaxially on silicon during subsequent processing since the crystal structures of the two are very similar. These problems have prevented wide spread commercial application of the aluminum-germanium alloy.
In summary, the use of aluminum to form contact and via interconnect structures has often resulted in unacceptably high contact resistance, alloy processing temperatures that are too high, particularly for polymer-based dielectrics, or other alloy characteristics that prevent successful commercial application.
Accordingly, what is needed in the art is an alloy forming interconnect process that operates successfully at temperatures low enough to prevent damage to desired polymer dielectrics.

Method of fabricating aluminum-indium (or thallium) vias for ULSI metallization and interconnects


An improved hydraulic drive mechanism for a vertical conveyor. The conveyor comprises a pair of upright supports or columns and a carriage to support a load or cargo is guided for vertical movement on the columns. The drive mechanism includes a pair of first hydraulic cylinder units and a pair of second hydraulic cylinder units that preferably have twice the length of the first cylinder units. The first or shorter cylinder units are connected between a movable cross beam and the carriage, while the second cylinder units are connected between the movable beam and the upper end of the frame. At a lower level both the first and second cylinder units are in an extended condition, while at an upper level both cylinder units are retracted.

Vertical conveyors are employed in warehouses, factories and the like to convey material or cargo between different vertical levels. The typical vertical conveyor includes a supporting structure or frame and a carriage, which is adapted to support cargo, is guided for vertical movement on the supporting structure.
In one type of vertical conveyor, the carriage is either straddled between two vertical columns of the frame or is cantilevered outward from the columns and is guided for vertical movement on the columns. The lifting of the carriage is accomplished through the use of two hydraulic cylinder units, each of which is mounted on one of the vertical columns. The piston rod of each cylinder unit is, in turn, connected to a flexible lift means consisting of either wire rope or roller chain, having one end connected to the carriage and the other end dead headed. A vertical conveyor of this type is described in U.S. Pat. No. 5,205,379. As described in the patent, each cylinder unit is affixed to the lower portion of its respective vertical column. The piston rod of each unit carries either a sheave adapted for wire rope or a sprocket adapted for roller chain. As the cylinder rod retracts, it pulls on either the roller chain or wire rope causing the carriage to elevate from the lower to the upper level. In typical designs, the wire rope is trained over four sheaves creating a four-part line so that each inch of piston rod travel produces four inches of carriage travel. In designs using roller chain, the chain is trained over two sprockets creating a two to one ratio of carriage movement to piston rod movement.
Other typical vertical conveyors use a pair of hydraulic cylinder units to elevate the carriage between levels. The cylinders are attached to each other and disposed so that one pistron rod pushes downward and one piston rod pushes upward against the carriage structure. With this design, care must be taken in design of the piston rod as the forces imposed by the weight of the carriage and the weight of the load being elevated impose a buckling force on the piston rods. As the cylinders are tied together, the piston rods are laterally offset from each other which results in a couple which puts considerable stress on the piston seals and packing flanges of the cylinder units. Because of the buckling and lateral forces on the cylinder units, this design is usually limited in capacity and vertical travel.

Hydraulic drive mechanism for a vertical conveyor


A delay apparatus, and a delay locked loop circuit and a semiconductor memory apparatus using the same are provided. A delay locked loop circuit includes a register controlled delay part that delays a plurality of clocks input during an initial operation by delay amounts among initial delay amounts to be varied, which are set according to initial state setting signals, and increases or decreases the set delay amounts according to a phase detecting signal after the initial operation, a phase comparator that compares a phase of any one of the plurality of clocks and a phase of any one of the plurality of clocks delayed by the register controlled delay part and outputs the phase detecting signal, and an initial state setting unit that generates the initial state setting signals.

1. Technical Field
Embodiments of the present invention relate to a semiconductor circuit technology, and more particularly, to a delay apparatus and a delay locked loop circuit and a semiconductor memory apparatus using the same.
2. Related Art
In general, clocks that are used in a semiconductor memory apparatus have been used as references to match the timing of operations, and have been used to achieve high-speed operation without the occurrence of errors. When the clock that is input from the outside of the semiconductor memory apparatus is used inside the semiconductor memory apparatus, a clock skew due to an internal circuit, that is, a time delay, is generated. In order to compensate for the time delay such that an internal clock and an external clock have the same phase, a delay locked loop circuit is generally used.
As shown in FIG. 1, a delay locked loop circuit according to the related art includes a first clock buffer 11, a second clock buffer 12, a clock divider 13, a first delay line 14, a second delay line 15, a third delay line 16, a shift register 17, a first driver 20, a second driver 21, a delay model 22, a phase comparator 19, and a shift controller 18. The first clock buffer 11 receives an inverted external clock/CLK and generates a first internal clock FCLK synchronized with a falling edge of an external clock CLK. The second clock buffer 12 receives the external clock CLK and generates a second internal clock RCLK synchronized with a rising edge of the external clock CLK. The clock divider 13 divides the second internal clock RCLK by 1/N (N is a positive number) and outputs a delay monitoring clock DLY_IN and a reference clock REF_CLK. The first delay line 14 receives and delays the first internal clock FCLK. The second delay line 15 receives and delays the second internal clock RCLK. The third delay line 16 receives and delays the delay monitoring clock DLY_IN. The shift register 17 determines a delay amount by each of the first to third delay lines 14 to 16. The first driver 20 responds to a delay locked signal DLL_LOCK and drives the output IFCLK of the first delay line 14 so as to generate a first delay locked loop clock FCLK_DLL. The second driver 21 responds to the delay locked signal DLL_LOCK and drives the output IRCLK of the second delay line 15 so as to generate a second delay locked loop clock RCLK_DLL. The delay model 22 allows the output FB_DLY of the third delay line 16 to pass through the same delay path as an actual clock path and outputs the output FB_DLY of the third delay line 16 as a feedback clock FB_CLK. The phase comparator 19 compares the phase of the feedback clock FB_CLK with the phase of the reference clock REF_CLK and outputs a phase detecting signal CTRL. The shift controller 18 responds to the phase detecting signal CTRL, and outputs shift control signals SR and SL to control a shift direction of the shift register 17 and the delay locked signal DLL_LOCK indicating that a delay locking operation has been performed.
The delay model 22 includes a dummy clock buffer, a dummy output buffer, a dummy load, and the like, and is also referred to as a replica circuit. The first to third delay lines 14 to 16, the shift register 17, and the shift controller 18 are collectively referred to as a register controlled delay part 10.
The first to third delay lines 14 to 16 have the same structure. Among the first to third delay lines 14 to 16, the third delay line 16 includes a plurality of unit delays (UD) 16-1, and link circuits (not shown) that determine the number of unit delays among the plurality of unit delays 16-1, which an input signal passes through, in accordance with the output of the shift register 17, as shown in FIG. 2.
The operation of the delay locked loop circuit according to the related art that has the above-described structure will now be described.
At the time of an initial operation, that is, at a timing when a reset signal is enabled, the delay monitoring clock DLY_IN passes through only one of the unit delays set in advance to be adjusted for the initial state of the third delay line 16, passes through the delay model 22, and is output as the feedback clock FB_CLK.
The phase comparator 19 compares rising edges of the reference clock REF_CLK and the feedback clock FB_CLK and outputs the phase detecting signal CTRL.
The shift controller 18 outputs the shift control signals SR and SL in response to the phase detecting signal CTRL.
The shift register 17 determines a delay amount by each of the first to third delay lines 14 to 16 in response to the shift control signals SR and SL. If the shift control signal SR is input, the shift register 17 shifts a register value to the right side, and if the shift control signal SL is input, the shift register 17 shifts the register value to the left side. In this way, the shift register 17 adjusts the delay amount.
Then, the shift controller 18 outputs the delay locked signal DLL_LOCK indicating that a delay locking operation has been performed at a timing when the feedback clock FB_CLK and the reference clock REF_CLK have the least amount of jitter.
The first and second drivers 20 and 21 drive the output IFCLK of the first delay line 14 and the output IRCLK of the second delay line 15 in response to the delay locked signal DLL_LOCK, which generates the first delay locked loop clock FCLK_DLL and the second delay locked loop clock RCLK_DLL that are synchronized with the external clock CLK.
The delay operation according to the related art will now be described in detail with reference to FIGS. 3A to 4B.
The first to third delay lines 14 to 16 are constructed such that if the delay locked loop circuit is initialized, an input signal, that is, the delay monitoring clock DLY_IN is output through the last unit delay, which cannot be changed.
As shown in FIG. 3A, it is assumed that the phase of the feedback clock FB_CLK is earlier than the phase of the reference clock REF_CLK by "D". In this case, the feedback clock FB_CLK needs to be delayed by "D" so as to synchronize with the reference clock REF_CLK. Accordingly, a delay amount is increased by increasing the number of unit delays which the feedback clock FB_CLK passes through, starting from the last unit delay of the third delay line 16.
As shown in FIG. 3B, it is assumed that the phase of the feedback clock FB_CLK is slightly later than the phase of the reference clock REF_CLK. As described above, since the third delay line 16 uses only the last unit delay during an initial operation, the delay amount cannot be decreased any more. Accordingly, in order for the feedback clock FB_CLK to synchronize with the reference clock REF_CLK, the feedback clock FB_CLK needs to be delayed for almost a time of period tCK. Since the delay amount by all of the unit delays does not exceed a time of period tCK, the maximum unit delays are used in the case shown in FIG. 3B.
As shown in FIG. 3C, it is assumed that the phase of the reference clock REF_CLK is slightly later than the phase of the feedback clock FB_CLK. At this time, the third delay line 16 uses only the last unit delay, and the minimum unit delay is used in the case shown in FIG. 3C.
Meanwhile, as shown in FIG. 4A, when a change in PVT (Process/Voltage/Temperature) is generated after the delay locking operation is performed, that is, the phase of the feedback clock FB_CLK synchronizes with the phase of the reference clock REF_CLK, the phase of the feedback clock FB_CLK may be slightly later than the phase of the reference clock REF_CLK. The first to third delay lines 14 to 16 and the delay model 22 include inverters or logic gates, each delay value is changed according to the change in PVT, and the delay value is increased when the voltage is decreased.
As shown in FIG. 4A, since the phase of the feedback clock FB_CLK is later than the phase of the reference clock REF_CLK by "D2" after the delay locking operation is performed, the delay amount by the delay lines needs to be decreased, such that the feedback clock FB_CLK synchronizes with the reference clock REF_CLK.
However, if the delay amount "D1" by the unit delay is smaller than the delay amount to be decreased, the feedback clock FB_CLK cannot synchronize with the reference clock REF_CLK, and the constant phase difference "D2−D1" is generated, as shown in FIG. 4B.
As described above, in the delay locked loop circuit according to the related art, the delay amount during the initial operation is locked. If the locked delay amount is smaller than the delay amount to be compensated for, the two clocks cannot be synchronized with each other, and thus the functionality of the delay locked loop is decreased. When the phase difference between the two clocks, which cannot be corrected, departs from an operating range of the semiconductor memory apparatus, a defective operation occurs not only in the delay locked loop circuit but also in the semiconductor memory apparatus using the same.

Delay apparatus, and delay locked loop circuit and semiconductor memory apparatus using the same


Collimators for two-dimensional scans of a radiation sources and methods of scanning are provided. One system includes a scan unit for scanning and collecting ionizing radiation emitted from a radiation emitting object is provided. The scan unit includes an array of at least one pixelated radiation detector having an imaging surface including a two-dimensional (2D) array of pixels. The scan unit also includes a collimator positioned between the radiation detector and the radiation emitting object, with the collimator including a 2D array of columns having openings and septa forming bores, wherein the columns are arranged in groups along rows of the 2D array of columns and the bores within one of the groups have a different aspect ratios than the bores in another one of the groups.

The subject matter disclosed herein relates generally to the detection of ionizing radiation, such as gamma-ray and X-ray radiation, and more particularly to scanning systems and methods of radiation detection, such as for medical diagnosis, using variable collimators, including Single Photon Emission Computed Tomography (SPECT).
Different scanning methods are known for use in detecting ionizing radiation, such as systems that use variable collimators, for example, adaptive collimators for Nuclear Medicine (NM) imaging. Some known methods of three dimensional (3D) image reconstruction use multiple image-acquisitions with different collimations of the imaging-collimator, such as by changing the collimation of the imaging-collimator. These systems use forward looking variable collimators constructed from multiple collimation elements where each collimation element may be varied and may produce multiple corresponding viewing-angles with a primary axis that is normal to imaging planes produced by detectors. These imaging planes are behind the collimators and are arranged to receive the radiation emitted from an imaged object via the collimators. The structures of the collimators and collimation elements are designed to reduce or avoid crosstalk of radiation between the collimation elements, for example, to prevent or reduce the likelihood of gamma rays passing through the gap of one septum into another collimator aperture.
The collimation variation in these systems is produced by changing the collimator height using means that move along a direction that is normal to the imaging plane while there is no relative movement between the collimator and the radiation detectors in a lateral direction, which is parallel to the imaging surface of the radiation detectors. However, in some situations, such a configuration may not be easy to implement and may increase the complexity of the system.
Additionally, the different viewing angles produced by the variable collimation elements are included in each other such that each viewing angle contains all the viewing angles that are smaller than this viewing angle. As a result, acquisition of multiple images using variable collimators of conventional systems creates a significant redundancy of information in which the same information appearing in one image appears in another image as well. In some of the images, the repeated information is the major information and only a small fraction of the information in these images is new information that does not appear in other images.
In order to increase the sensitivity of the imaging system, each of the multiple images acquired in different collimation of the imaging-collimator includes the imaged region. This imaged region is on and in the imaged object and is significantly larger than the size of the desired spatial resolution. The reconstruction of the image within the desired spatial resolution is produced by various image-reconstruction methods which include intensive mathematical calculations based on multiple equations that use image data from the multiple images. For example, in some systems, the number of images acquired for reconstructing a SPECT image times the number of pixels in each image is equal to the number of virtual voxels into which the imaged object is to be divided. Accordingly, the large size of the imaged region in each acquired image and the large number of acquired images that are needed for the 3D image reconstruction does not allow for selecting only images that have no information redundancy.
Thus, the reconstruction of images using some known systems and methods includes repetitive information that is summed with newly acquired information. As a result, reconstructed images may have reduced image quality and may also include reconstruction artifacts.

Collimators for scan of radiation sources and methods of scanning


A method of a rule-based operation can include the steps of dividing a design rule into at least one of three components including an application criteria, a rule condition, and an action. The method can further include the steps of expressing the design rule as a datafile or source code and binding the three components together to form a rule object at runtime.

1. Technical Field
The present invention relates to the field of rule-based operations and, more particularly, to a data-driven design rule check (DRC) method and system.
2. Description of the Related Art
A logic simulator is a software tool which is capable of performing functional and timing simulations for digital electronic designs which are written in a hardware description language (HDL) such as VHSIC Hardware Description Language (VHDL) or Verilog. The VHSIC acronym stands for Very High Speed Integrated Circuits. VHDL and Verilog are HDLs used to design and document electronic systems. Verilog, for example, permits hardware designers to define signals at a very high level of abstraction. The abstracted signal representations can be translated to actual pins on a microchip using any of a variety of commercial electronic design automation (EDA) software tools.
Design Rule Check (DRC) is a crucial step in validating an electronic design before actual hardware implementation. A failed DRC signals a critical error which may lead to silicon failure. The goal of DRC is to identify places in the integrated circuit design where the design rules, such as the spacing between two features or the width of a wire, have been violated. Design rules tend to change frequently and with many different fabrication processes, particularly in the sub-micron domain, there could be many subtly different design rules. Thus, with design density growing and more hardware features being introduced, DRC is also growing in complexity. A typical new design block such as an embedded PowerPC in an field programmable gate array (FPGA)-based System-on-Chip (SOC) or a multi-Gigabit transceiver often requires a large number of complex design rule checks to be done.
In existing design rule checkers, the rules are often coded in software source code (e.g., C/C++) and then compiled into a software library. For example, in order to check whether Pin A of a component B is connected to a Ground signal, the following code fragment would be used:
function check_pinAofB(componentX)                {                    if(typeof(X)==B)            {                            Pin pX =getpinA(X);                if(driven_by_Ground(pX))                                    issueError( );                                                                    }                        }
If a small change has to be made to the design rule above, the entire function (and hence the entire program file) must be recompiled. Such process is time-consuming and risky and hence makes rule modification difficult. Also, if other rules must be added to check the same condition for a different component, a large part of the above function/procedure must be replicated. Such a system is inflexible and hard to maintain.

Method and apparatus for rule-based operations


A below-grade smart irrigation object includes: an input signal portion configured to receive an energizing signal for the below-grade smart irrigation object; an output signal portion configured to indicate the location of the below-grade smart irrigation object in response to receiving the energizing signal; and an irrigation portion configured to effectuate an irrigation operation.

Prior to the turf aeration process, a significant amount of time and energy must be expended in an effort to prepare the grounds for aeration. The reason for such prep work is to ensure that expensive, subterranean irrigation equipment is not damaged as the aeration equipment passes in close proximity to the subterranean irrigation equipment.
Currently, the operator of the aeration equipment must manually raise and lower the aeration equipment to avoid damaging such subterranean irrigation equipment (which is a daunting task when you consider that the average golf course has over 500 buried sprinkler heads). And further complicating the situation is that the location of this subterranean irrigation equipment is not always accurately known, often resulting in damage to the subterranean irrigation equipment.


A photodetector which uses single or multi-layer graphene as the photon detecting layer is disclosed. Multiple embodiments are disclosed with different configurations of electrodes. In addition, a photodetector array comprising multiple photodetecting elements is disclosed for applications such as imaging and monitoring.

Photodetectors are used to detect or sense light or other electromagnetic energy. Currently available photodetectors are generally used in a variety of practical applications such as wired and wireless communications, sensing, monitoring, scientific instrumentations, national security, and so on.
Many optical photodetectors use semiconductor materials as the photodetection material system. Semiconductor materials, however, have a band gap, and therefore only photons having energy greater than the band gap can be detected, potentially leaving photons undetected. In addition, the intrinsic bandwidth of semiconductor based photodetectors is limited by the carrier transit time in the photodetection region. Both of these limitations results in a less than optimal photodetector.

Single and few-layer graphene based photodetecting devices

International Business Machines Corporation


Systems and methods of managing creation and configuration for 5G networks, NFs and NSSIs are provided. An instantiation or configuration request received from a managed entity respectively instantiates or configures the appropriate element. For NF instantiation, when the NF has a virtualized part to be instantiated by a VNF, interaction with an NFV MANO system instantiates the VNF is followed by NF instantiation notification and MOI creation for the NF. For NF configuration, the NF is configured and notification provided thereof. For network instantiation, after reception of a network creation request, interaction with the system to instantiate a NS that realizes the network is followed by determination that a new VNF associated with the NS has been instantiated, creation of a NF (constituting the network) MOI is realized by the new VNF, and NF configuration. For NSSI creation, a NF constituting the NSSI is created and configured.

The use of 3GPP LTE systems (including LTE and LTE-Advanced systems) has increased due to both an increase in the types of devices user equipment (UEs) using network resources as well as the amount of data and bandwidth being used by various applications, such as video streaming, operating on these UEs. With the vast increase in number and diversity of communication devices, the corresponding network environment, including routers, switches, bridges, gateways, firewalls, and load balancers, has become increasingly complicated, especially with the advent of next generation (NG) systems.
To add further complexity to the variety of services provided by the network devices, many physical implementations of the network devices are propriety and may be unable to incorporate new or adjusted physical components to compensate for different network conditions. This has led to the development of Network Function Virtualization (NFV), which may provide a virtualized environment able to provide any network function or service able to be delivered on general purpose computing systems in a data center as software applications called Virtual Network Functions (VNFs). The use of NFV may provide flexibility in configuring network elements, enabling dynamic network optimization and quicker adaptation of new technologies. As 5G systems develop, it is desirable to add a number of functionalities and management services, such as the ability to configure the networks including network slicing and network functions (NFs).

Management services for 5G networks and network functions


Impure steam is partially cooled on a first side of an energy transfer dee, forming a condensate substantially free of CO.sub.2 and other non-condensible gases. The condensate is separated from the impure steam and accumulated in a separator/accumulator. The condensate stream is conveyed through a control valve back to a second side of the energy transfer device for reheating to steam substantially free of CO.sub.2 and other non-condensible gases.

Navy ships, as well as commercial and other ocean going vessels, rely extensively on steam for powering the vessels as well as for operating auxiliary systems such as the galley, scullery, space heating, laundry, hot water and boiler blanketing. The steam for powering the vessel and for boiler blanketing must be substantially free of carbon dioxide (CO.sub.2) to prevent corrosion. However, most of the other on-board systems do not require this high degree of CO.sub.2 free steam.
In order to achieve a steam substantially free of CO.sub.2, the feed water from which the steam is produced undergoes comprehensive and expensive water treatment processing such as demineralization/reverse osmosis in order to remove bicarbonates. With the bicarbonates removed from the feed water, the export steam produced from the feed water will be substantially free of CO.sub.2 and attain, for example, a near neutral pH of 7 and a conductivity of less than 2 .mu.mho/cm as compared to a pH of near 4 and a conductivity near 10 .mu.mho/cm when CO.sub.2 is present.
When at sea, on-board water purification systems remove bicarbonates from the feed water so that all the steam produced is substantially free of CO.sub.2. However, when ships are in port and berthed at piers, shore boilers produce and provide steam for the ships functions as well as for base facility functions. One of the ship requirements is boiler blanketing (i.e. maintaining steam in the boiler) so that a ship, although berthed, may steam into action without requiring lengthy boiler "fire-up". In this way, Navy ships may maintain battle readiness, necessary to avoid, for example, surprise attack. Unfortunately, boiler blanketing requires steam substantially free of CO.sub.2 but most other on-board ship systems as well as base facilities do not. As a result, present practice is to require the shore boilers to produce a steam substantially free of CO.sub.2 for boiler blanketing. Accordingly, 95% of the steam produced is unnecessarily purified and supplied for other ship functions and base facilities which do not require a high degree of CO.sub.2 free steam.
The present invention, provides a method and apparatus for removing CO.sub.2 and other non-condensible gases from steam and produces a gas-free saturated or superheated steam, eliminating gaseous contaminants with minimal energy loss. With the present invention, only the steam for boiler blanketing (and any other system that may require a high degree of CO.sub.2 free steam) undergoes treatment; the remaining steam systems, on-board and on-shore, supplied with impure steam.

The United States of America as represented by The Secretary of the Navy


Disclosed is a method and system to learning mid-level features for text images that leverages character bounding box annotations. According to an exemplary embodiment, the disclosed method and system includes extracting semantic local descriptors by aggregating local statistics of small patches and correlating them with character bounding box annotations.

This disclosure relates to learning word image representations, i.e., given an image of a word, finding a descriptive and robust, fixed-length representation of the word. Machine learning techniques can then be used on top of these representations to produce models useful for word retrieval or recognition tasks. Although the focus of this disclosure is recognizing text in the wild, e.g., street signs, this disclosure and the exemplary embodiments provided herein have broad applications and can be used for the recognition of standard printed text, handwritten text, license plates, etc.
In recent years, a new trend in word image recognition and retrieval has been to describe word images with global representations using standard computer vision features, e.g., HOG (Histogram of Oriented Gradients), or SIFT (Scale-Invariant Feature Transform) features aggregated with bags of words, see G. Csurka, C. R. Dance, L. Fan, J. Willamowski, and C. Bray, "Visual Categorization with Bags of Keypoints", in ECCV Workshop on Statistical Learning in Computer Vision, 2004, or Fisher vector, see F. Perronnin and C. R. Dance, "Fisher Kernels on Visual Vocabularies for Image Categorization", in CVPR, 2007, encodings, and apply different frameworks and machine learning techniques, such as using attributes representations, metric learning, or exemplar SVMs (Support Vector Machines), on top of these global representations to learn models to perform tasks such as recognition, retrieval, or spotting. See F. Perronnin and J. A. Rodriguez-Serrano, "Fisher kernels for handwritten word-spotting", in ICDAR, 2009; M. Rusiñol, D. Aldavert, R. Toledo, and J. Lladós, "Browsing heterogeneous document collections by a segmentation-free word spotting method", in ICDAR, 2011; J. Almazán, A. Gordo, A. Fornés, and E. Valveny, "Efficient exemplar word spotting", in BMVC, 2012; D. Aldavert, M. Rusiñol, R. Toledo and J. Lladós, "Integrating Visual and Textual Cues for Query-by-String Word Spotting", in ICDAR, 2013; J. Almazán, A. Gordo, A. Fornés, and E. Valveny, "Handwritten word spotting with corrected attributes", in ICCV, 2013; J. A. Rodriguez-Serrano and F. Perronnin, "Label embedding for text recognition", in BMVC, 2013; J. Almazán, A. Gordo, A. Fornés, and E. Valveny, "Word spotting and recognition with embedded attributes", Technical report, 2014. This disclosure diverges from traditional approaches that mostly focus on detecting and localizing individual characters in a word image and then using that information to infer the contents of the word, using for example Conditional Random Fields and language priors. See A. Mishra, K. Alahari, and C. V. Jawahar, "Scene text recognition using higher order language priors", in BMVC, 2012; A. Mishra, K. Alahari, and C. V. Jawahar, "Top-down and bottom-up cues for scene text recognition", in CVPR, 2012; A. Bissacco, M. Cummins, Y. Netzer, and H. Neven, "PhotoOCR: Reading Text in Uncontrolled Conditions", in ICCV, 2013; and L. Neumann and J. Matas, "Scene Text Localization and Recognition with Oriented Stroke Detection", in ICCV, 2013.
The global approaches have important advantages such as not requiring words annotated with character bounding boxes for training or not requiring to explicitly localize characters inside the words at testing time, which is slow and error prone. Global approaches can also produce compact signatures which are relatively fast to compute, store and index, or compare, while still obtaining very competitive results in many tasks. The use of off-the-shelves computer vision features and machine learning techniques also makes them very attractive since they are usually very easy to implement. Yet, it may be argued that learning more semantic features that specialize in text instead of directly using generic features such as SIFT or HOG can potentially lead to large improvements.
In an orthogonal direction, it has been noted that methods that detect individual characters can yield very impressive results on recognition tasks when training with huge amounts of words annotated with character bounding boxes. See A. Bissacco, M. Cummins, Y. Netzer, and H. Neven, "PhotoOCR: Reading Text in Uncontrolled Conditions", in ICCV, 2013. However, this suffers from all the aforementioned disadvantages: need to annotate very large amounts of words at the character level, need to localize the characters at test time, and not leading to an amenable final signature that can be used for other tasks such as word retrieval.
This disclosure, and the exemplary embodiments described herein, describes an approach to leverage character bounding box information at training time to construct global image representations learned in a supervised way, as opposed to standard global representations that only involve an unsupervised learning stage. The methods and systems provided involve learning mid-level local features that are correlated with the characters in which they tend to appear. A small external dataset annotated at the character level is used to learn how to transform small groups of locally aggregated low-level features into mid-level semantic features suitable for text analysis. This is achieved by describing blocks of images using two modalities: a semantic modality, based on the character annotations; and a visual modality, based only on the image, and subsequently learning how to project the visual and the annotated modalities into a common subspace. Described also is how to apply this transformation in an efficient manner to new images at testing time.
The disclosed global image representation method and system has the following potential advantages:                Leverages character bounding boxes at training time to provide discriminative information that can significantly improve the final accuracy of the system. Global representations have not leveraged this information in the past.        Prior methods that have leveraged character bounding boxes were focused on recognition and did not produce a global image representation. Consequently, this makes them less useful for other tasks such as text-to-image or image-to-image retrieval. Mid-level features associated with the global image representation provided herein can be aggregated into a compact global representation, for example, but not limited to, as low as 96 dimensions, and directly used for image-to-image, text-to-image, and image-to-text retrieval tasks.        The global representation method and system provided herein can be learnt with very little annotated data. The best performing method known previously on scene-text recognition requires millions of annotated training samples with bounding boxes. See A. Bissacco, M. Cummins, Y. Netzer, and H. Neven, "PhotoOCR: Reading Text in Uncontrolled Conditions", in ICCV, 2013. In comparison, the disclosed approach achieves better results with less than 2,000 samples annotated with bounding boxes.
Many previous works focus on recognition learn character models for isolated characters. See A. Mishra, K. Alahari, and C. V. Jawahar, "Scene text recognition using higher order language priors", in BMVC, 2012; A. Mishra, K. Alahari, and C. V. Jawahar, "Top-down and bottom-up cues for scene text recognition", in CVPR, 2012; A. Bissacco, M. Cummins, Y. Netzer, and H. Neven, "PhotoOCR: Reading Text in Uncontrolled Conditions", in ICCV, 2013; L. Neumann and J. Matas, "Scene Text Localization and Recognition with Oriented Stroke Detection", in ICCV, 2013; and C. Yao, X. Bai, B. Shi, and W. Liu, "Strokelets: A Learned Multi-Scale Representation For Scene-Text Recognition", in CVPR, 2014, as recent examples. However, these methods focus only on recognition and do not produce image signatures. Therefore, these models cannot be easily used for retrieval with image or text queries, which is a requirement for some applications, such as license plate matching.
Other previous work relates to the use of mid-level features, where "blocks" containing some basic semantic information are discovered/learned/defined. See Y.-L. Boureau, F. Bach, Y. LeCun, and J. Ponce, "Learning mid-level features for recognition", in CVPR, 2010; M. Juneja, A. Vedaldi, C. Jawahar, and A. Zisserman, "Blocks that shout: Distinctive parts for scene classification", in CVPR, 2013; and C. Yao, X. Bai, B. Shi, and W. Liu, "Strokelets: A Learned Multi-Scale Representation For Scene-Text Recognition", in CVPR, 2014. The use of mid-level features has been shown to produce large improvements in different tasks. Of those works, the most related to this disclosure is the work of C. Yao, X. Bai, B. Shi, and W. Liu, "Strokelets: A Learned Multi-Scale Representation For Scene-Text Recognition", in CVPR, 2014, which learns Strokelets, a mid-level representation that can be understood as "parts" of characters. These are then used to represent characters in a more semantic way. The main distinctions between this previous use of mid-level features and this disclosure are: i) exploitation of supervised information is used to learn a more semantic representation according to this disclosure, and ii) explicit classification of character blocks is not used, and instead use of a semantic representation is used to construct a high-level word image signature according to this disclosure.
The embedding approaches of J. A. Rodriguez-Serrano and F. Perronnin, "Label embedding for text recognition", in BMVC, 2013 and J. Almazán, A. Gordo, A. Fornés, and E. Valveny, "Handwritten word spotting with corrected attributes", in ICCV, 2013 could also be understood as producing supervised mid-level features, but do not use character bounding box information to do so. To learn the semantic space, supervised dimensionality reduction of local Fisher vectors is performed and the Fisher vectors are then encoded and aggregated into a global Fisher vector. This could be understood as a deep Fisher network for image recognition. See K. Simonyan, A. Vedaldi, and A. Zisserman, "Deep fisher networks for large-scale image classification", in NIPS, 2013. A main difference is that the goal of K. Simonyan, A. Vedaldi, and A. Zisserman, "Deep fisher networks for large-scale image classification", in NIPS, 2013 is to produce an extra layer on the Fisher representation, similar in spirit to deep networks; the supervised dimensionality step is learned using the image labels, the same labels that will be used for the final classification step. According to the disclosed method and system, the goal is to transfer knowledge from information that is only available on an external training dataset, i.e., the character bounding boxes, to produce features that are correlated with characters, and exploit this information from the target datasets.

Supervised mid-level features for word image representation


A gas turbine engine case has a metallic composite boss mounted thereto. The boss may have a main metal injection molded (MIM) part, and a separately formed flange part integrated to the main MIM part and projecting laterally outwardly therefrom. The MIM part and the flange part may be made of different materials. The material of the flange part is selected to provide a suitable mounting interface with the gas turbine engine case.

Gas turbine engine cases are typically provided on the outer side thereof with bosses or similar service or mounting pads. The bosses are generally machined from solid directly on the case or separately produced as single cast parts which are then welded to the case. The machining of bosses on the case is time consuming and thus expensive. The choice of cast materials that can be used for separately fabricated bosses is limited by the need of welding the bosses to the engine case. Also for weld joint architectures, cast materials may not always be ideal from a durability point of view. There is also a need for reducing the overall weight of gas turbine engine casings.


A new and distinct cultivar of Coleus (Coleus scutellarioides) plant named ‘UF19-42-14’, selected for having a combination of desirable traits that make it well-suited for good performance as an annual plant in the summer landscape. ‘UF19-42-14’ has contrasting yellow green leaf color with prominent dark purplish red veins, and excellent overall plant vigor in all trials. ‘UF19-42-14’ maintains its foliage late into the Fall season until frost. It has a very stable leaf color in both sun and shade and was well-branched and vigorous in all locations trialed. Due to its striking color combination and vigorous upright and spreading habit, this plant will likely be grown in landscapes as a specimen annual plant filling a large amount of space with color in a very short period of time.

The invention relates to a new and distinct cultivar of Coleus plant named 'UF19-42-14'. The new cultivar 'UF19-42-14' originated from an open pollination conducted in May-November 2018 in Gainesville, Fla. between the female Coleus plant 'UF18-38-14' (unpatented) and an unknown male Coleus plant. A single seedling was chosen in May 2019 for further asexual propagation in Gainesville, Fla.
The new cultivar 'UF19-42-14' has been reproduced asexually for over 18 months through meristem tip cuttings and has been found to retain its distinctive characteristics through successive asexual propagations. 'UF19-42-14' was first propagated asexually by meristem tip cuttings in May 2019 in Gainesville, Fla., and has remained true-to-type since that time.
Plant Breeder's Rights for the new cultivar 'UF19-42-14' have not been applied for, and 'UF19-42-14' has not been made publicly available more than one year prior to the filing date of this application.
When compared to the female parent 'UF18-38-14', which has leaves that are almost twice as long as they are wide, the new cultivar 'UF19-42-14' has smaller leaves that are almost equally wide as they are long. Leaves on 'UF19-42-14' are bright yellow green with prominent dark purplish red venation patterning throughout the leaf, whereas leaves from the female parent 'UF18-38-14' are solid maroon with a distinct chartreus margin. 'UF19-42-14' has a vigorous upright and spreading habit that is well-branched, whereas 'UF18-38-14' is much less vigorous, and more upright in habit with less lateral branching.
The new cultivar 'UF19-42-14' was selected because it has unique plant form, growing almost twice as wide as it grows tall. It has a striking foliage color and has not been observed to produce flowers in any field or greenhouse. It performs well in sun and shade and has excellent vigor to withstand the harsh selection conditions our plants are subjected to in full sun trials in Gainesville, Fla. 'UF19-42-14' is exceptional because it maintained its foliage color patterning in all trialing conditions tested.


A pneumatic conveyor apparatus for conveying articles, such as empty aluminum cans and plastic bottles, includes first and second air ducts for supplying pneumatic pressure to move the articles along a predetermined path. The first and second air ducts are positionable on respective opposite sides of the path. The first air duct has a first plurality of vents in a laterally facing surface thereof and the second air duct has a second plurality of vents in a laterally facing surface thereof. The first and second plurality of vents cooperate to direct a flow of air on the articles to move the articles along the predetermined path and to exert a lifting force on the articles as the articles are moved downstream. In one embodiment, selected ones of the first and second plurality of vents are inclined at respective predetermined angles of inclination for exerting a lifting force on the articles as the articles are moved along the predetermined path. In another embodiment, selected ones of the air vents are positionable for directing a flow of air on the respective bottom surfaces of the articles to provide the lifting force.

Pneumatic apparatus are often used to transport empty articles, such as empty beverage cans and bottles, along a predetermined conveyor path. The articles are propelled by a pneumatic force directed thereon. For example, in a soft drink packaging operation, the individual beverage containers, be they aluminum cans or plastic bottles, may be transported by a force resulting from air flow on the containers prior to the containers being filled.

Langenbeck Grandchildren's Irrevocable Trust


The invention is a ratcheting open ended wrench comprising a main body having an elongate primary handle portion and an upper stationary jaw element, a secondary handle opposed to the primary handle portion and having a binding surface at the top being pivotally attached to the main body, a tertiary handle pivotally attached to the main body having a gear element cooperating with a geared end of a connecting rod, the opposing end pivotally and slidably fixed to a lower movable jaw assembly, the lower movable jaw assembly being spring biased against the upper stationary jaw and positioned within a main body guide slot so that the secondary handle binding surface contacts the lower jaw assembly and activation of the secondary handle clamps the lower movable jaw assembly relative to the upper stationary jaw. Activation of the tertiary handle counteracts the lower movable jaw spring bias to open the jaws.

Prior art adjustable open ended wrenches typically incorporate a thumb wheel or similar mechanism to adjust the jaw opening size of the wrench so as to snugly grasp a faceted head of a workpiece, such as a fastener. A snug grip is important to maximize the contact surface area between the jaws and the workpiece thereby avoiding damage, principally resulting from slippage and point contact deformation, to the fastener as torque is applied to a workpiece. The typical adjustable open ended wrench maintains a fixed jaw opening size once adjusted to fit the fastener. As the fastener is rotated, the user must reposition the tool so as to restore a convenient position of the tool handle to once again apply torque. The repositioning action requires a user to lift or slide the jaw opening away from the workpiece disengaging the tool from the workpiece, repositioning, and reengaging the tool with the workpiece. The disadvantage of lifting and repositioning of the tool is well recognized and the inconvenience is typically sacrificed in favor of the convenience of the adjustable open ended features for particular applications requiring side access to a fastener or minimizing the need for stowing multiple fixed sized sockets or wrenches. Ratcheting wrenches provide a mechanism to rotate the fastener without removing the wrench from the fastener and typically incorporate a jaw or socket mechanism that surrounds the fastener head requiring approaching the fastener from above. Consequently a user must make an election as to the type of wrench to use in a particular application and must also provide multiple variations of the tools thereby expanding tool kit required so as to be prepared for a wide variety of applications.
Numerous attempts have been pursued to improve the performance of adjustable open ended wrenches principally directed to providing some form of ratcheting wherein the tool need not be disengaged or removed from the workpiece for repositioning the tool handle after each torquing stroke. One such attempt is illustrated by Brown in U.S. Pat. No. 6,889,579 wherein a cam action is taught to position a series of jaw elements movable radially from the workpiece so as to selectably clamp on to a hex fastener for rotation of the workpiece during the torque stroke and released during repositioning; however, the jaw mechanism is not open ended, the jaw size range is limited, and no ratcheting mechanism is provided.
Other prior art attempts incorporate a quasi ratcheting mechanism wherein an element of the tool provides for a small motion of a jaw element either selectably by an operator activated lever mechanism or by an incorporated element in the tool activated by the action of rotating the engaged tool in a particular direction. True ratcheting mechanisms remain fully engaged with a workpiece at all times during torque application and rotational repositioning of the tool handle. Typical quasi ratcheting mechanisms have a disadvantage in that the workpiece can be firmly gripped often resulting in slippage and damage to the fastener.
Janson, in U.S. Pat. No. 5,941,142, teaches a wrench having a quasi ratcheting function wherein the handle is rotated backwards to reset the handle for a torque stroke in 60 degree increments without removing the tool from the workpiece or loosening the fastener. True ratchets can be reset in much smaller increments. Brown wrenches employ the typical method of adjusting the open ended jaw opening size by turning a worm gear that operates on a rack attached to the movable jaws. Quasi ratcheting is typically accomplished by incorporating a movable element within one jaw face allowing the tool to clamp against a workpiece in the torque stroke direction and releasing the workpiece in the reverse free return stroke direction wherein the jaw faces slip to the next facet of the workpiece. The span of movement of the movable element is typically small thus a resizing of the jaw openings requires manual adjustment of the opening to accommodate other workpiece sizes. Alternatively, a movable element is incorporated to provide small movement of one jaw of the tool away from the workpiece thusly effectuating a similar ratcheting action as. These prior art quasi ratcheting mechanisms, despite being an incremental improvement over traditional adjustable wrenches, are slow to adjust as the size range accommodated by the movable portion of the jaw face is typically small there by necessitating adjustment of the worm gear. Also prior art quasi ratcheting mechanisms generally do not clamp firmly onto a workpiece in part because the surface contact area on the workpiece is small due to larger tolerances resulting from the loose fit. A firm grip of the tool onto a workpiece is essential to prevent damage to a workpiece during the torque stroke.
What is needed is a wrench combining the advantageous features of an adjustable open ended wrench facilitating a variety of access approaches to a workpiece and minimizing the number of tools of varying jaw size, while also providing a ratcheting mechanism; and, a simple and rapid jaw opening size change mechanism having a firm clamping action to eliminate clearances and to prevent damage to fasteners thereby improving the utility of the tool and overcoming disadvantages of the prior art.


A portable golf cart weathershield system including a front windshield portion, a rear windshield portion and a golf club compartment cover. The portable golf cart weathershield system is made of a lightweight, flexible, transparent, water repellent material and may be rolled up to a compact size for storage. The golf cart weathershield system is easily attached to and removed from any golf cart having a roof and requires a minimal number of attaching means.

1. Technical Field
The present invention generally relates to a golf cart weathershield. More particularly, the present invention relates to a lightweight, portable, easy to assemble golfer and golf clubs weathershield system for use on standard golf carts used in the golfing industry.
2. Discussion
Due to the increasing popularity of golf as a year-round sport, much has been done to improve equipment which to a significant degree, is designed for use to protect players against inclement weather conditions. In climates where the weather varies greatly among the seasons of the year, golfing can be made difficult by cold, rainy, windy or other inclement weather conditions.
In the past, the only golf cart covers that were available were sold as accessories to specific golf carts because they had to be made to fit a specific cart and required certain attachment means on the cart, such as snaps. This meant that the golfer had to depend on the golf course to provide a golf cart cover for protection from the elements. Due to the cost and storage inconveniences, golf courses that provide such golf cart covers normally only have a limited supply leaving some golfers out in the cold.
Various types of portable golf cart covers are commercially available. Most previous attempts at providing such a climate-controlled environment for golfers have centered on completely enclosing the golf cart, the golf cart being a means for transportation as well as providing shelter. These covers are typically draped over the entire cart in anticipation of poor weather conditions and are constructed from several panels of a water-repellent material such as flexible plastic, canvas or tarpaulin. These covers also include a transparent plastic material, at least in the front panel for purposes of visibility. The panels may be joined to one another by sewing or with heavy duty zippers. Such covers are usually attached to the cart by means of hooks and/or clips. A zippered or snapped slit in one or both sides of the cover allows the golfer access into and out of the cart.
Although most of the above described covers provide adequate protection from the rain, they have numerous drawbacks. For example, access into and out of the golf cart is made much less convenient because of the continuous need to zip/unzip or snap/unsnap the slit opening in the side. In order to access golf clubs or other items placed in the rear of the golf cart, the back cover of the enclosure must be opened or removed to some extent to allow access therein which results in the enclosed area within the golf cart being exposed to the inclement weather, thereby negating the enclosure's protective effect.
The limitations associated with current golf cart covers further include the fact that canvas and tarpaulin are relatively heavy weight, thick materials which inhibit the folding of a cover constructed of this material to a size which is compact and easy to transport and store. Again, because this material is generally heavy weight, panels must be joined by sewing them together or by sewing in heavy duty zippers or snaps, all of which leads to higher manufacturing costs. Additionally, the stitching may eventually weaken and tear, and the zippers often stick, or are prone to breakage if the golfer does not completely open the zipper before entering or exiting the golf cart. As a result of these disadvantages, the current golf cart covers are preferably removed each time the rain or cold weather conditions subside which is time consuming, cumbersome and unpleasant. Moreover, folding the cover up and onto the roof of the golf cart when not in use tends to give an unsightly appearance.
Yet another disadvantage of the current golf cart covers is that the means for attachment of the cover to the cart can be cumbersome. Typically, the covers are secured by attaching hooks or clips, located along the bottom edge of the cover and permanently affixed thereto, to the underside of the cart. When the cover is attached to the underside of the cart, access to the passenger compartment is often awkward and somewhat limited.
The types of devices as described in the current golf cart cover art are adequate in many respects but in other ways exhibit various disadvantages which leads to the result that few, if any, golfing establishments have provided these curtains, covers and rain guards on their golf carts. Obviously, these types of covers are an additional expense which many clubs do not wish to incur and in many instances their existing carts may not be suitable for application. Therefore, when a golfer is playing on a course which does not provide golf carts equipped for inclement weather, that person is subject to being uncomfortable. Additionally, while a golfer's home course may possibly provide such weatherproof carts, it is quite likely that some golfers will travel on vacation or for business reasons and play on many courses that do not have such accommodations. Accordingly, the need exists to provide an improved, cost effective, portable golf cart weathershield system made of a lightweight, yet durable material, being easily mounted on and attached to any golf cart and rollable to a compact size when not in use. The current invention creates a protective environment for golfers within a golf cart and offers major improvements over previous methods such as maintaining the visibility of the golfers while inside the cart, thus preserving the quality of their golfing experience, while greatly improving the convenience of getting into and out of the golf cart as well as of removing clubs from the cart, if they are stored inside. Additionally, the current invention provides a durable yet easily removable means for quickly attaching or removing from the golf cart. Thus, the current weathershield system provides a comfortable climate within the cart during poor weather conditions, allowing golfers to extend their golfing seasons.


A magazine loader for loading cartridges into a magazine is provided. The magazine loader may include a base member configured for positioning on an open end of the magazine, a first cartridge support member extending from the base member, and a second cartridge support member extending from the base member. The first cartridge support member may include a first slot configured for receiving a base end of each of the cartridges. The second cartridge support member may include a second slot configured for receiving a tip end of each of the cartridges. A related system for loading and storing cartridges for a firearm also is provided.

The use of magazines in the shooting arts is well known. For example, magazines often are used in conjunction with, or as an integral part of, a repeating firearm for storing and feeding a number of cartridges to be used by the firearm. The magazine functions by sequentially moving the cartridges stored in the magazine into a position where they may be advanced into the chamber by the action of the firearm. In this manner, the magazine allows a user to quickly and easily advance the cartridges for use by the firearm.
Due to challenges in loading the cartridges directly into the magazine by hand, various types of devices, generally referred to as magazine loaders, have been developed. Certain devices may have a complex, multi-part construction for easily loading the magazine. However, the complexity of such devices may result in a high cost and may be unnecessary in many applications. Certain other devices may have a simple, single-part construction but may be difficult or cumbersome to use. For example, such devices may present challenges in positioning the device on the magazine, advancing the cartridges into the magazine, or verifying that the cartridges have been properly loaded into the magazine.
Accordingly, there remains a need for an improved magazine loader having a simple and inexpensive construction while also addressing one or more of the challenges described above.

Devices, systems, and methods for loading a magazine


One or more embodiments are directed to system in package (SiP) for optical devices, including proximity sensor packaging. One embodiment is directed to an optical package that includes a stacked arrangement with a plurality of optical devices arranged over an image sensor processor die that is coupled to a first substrate. Between the two optical devices and the image sensor processor die there is provided at least a second substrate. In one embodiment, the optical package is a proximity sensor package and the optical devices include a light-emitting diode die and a light-receiving diode die. In one embodiment, the light-emitting diode die is secured to a surface of the second substrate and the light-receiving diode die is secured to a surface of a third substrate. The second and the third substrate may be secured to a surface of the image sensor processor die or to a surface of encapsulation material.

Technical Field
Embodiments of the present disclosure are directed to optical packages comprising optical devices. In particular, one or more embodiments are directed to packages comprising proximity sensors.
Description of the Related Art
Proximity sensors are used to detect the presence of nearby objects and are able to do so without physically touching the object. Proximity sensors may be utilized in various electronic devices, such as cameras, phones, including smartphones, vehicles, machinery, and other devices that may want to detect the presence of nearby objects. After detecting the presence of the nearby object, the electronic device may be configured to perform a function, such as move a mechanical feature to a secure position, couple or uncouple an electrical communication, or any other desired function.
Proximity sensors typically include a light-emitting diode (LED) and a light-receiving diode, such as a photodiode. The LED and photodiode are packaged together in a sensor package. Generally described, the LED emits radiation out a first opening in the sensor package. If an object is close to the sensor package, a suitable amount of the emitted radiation is reflected off of the object and back toward the sensor package. Some of the reflected radiation enters a second opening in the sensor package proximate the photodiode. The photodiode receives the reflected radiation and generates an electrical signal indicative of the received radiation.
The sensor package is typically in electrical communication with an image sensor processor. The image sensor processor is configured to cause the LED to emit the radiation and to receive the electrical signal from the photodiode indicative of the reflected radiation received. Typically, the image sensor processor is enclosed in its own package and both the sensor package and image sensor processor package are coupled to a board, such as a circuit board, and electrically coupled to each other through the board.


An optical path switching method includes converging and irradiating, on a light absorption layer film provided in a thermal lens forming element including at least the film, each of a control light having a wavelength selected from a wavelength band which is absorbed by the film and a signal light having a wavelength selected from a wavelength band which is not absorbed by the film. A thermal lens is reversibly formed according to a distribution of refraction index created by a temperature increase generated in and around an area of the film in which the control light is absorbed according to whether or not the control light is irradiated. The converged signal light is output either in its converged form or after its spread angle is changed. A includes a hole and reflector where the signal light output is either passed through the hole or reflected by reflector.

In order to deal with the exponential increase in network traffic due to the prevalent use of the Internet and intranets in offices and homes, there exists a need for an optical path switching device (optical switch) which does not employ an electric signal, namely, an optical-to-optical direct switch. Known approaches of the device and method for switching optical paths such as optical fibers, optical waveguides, and light propagation paths may include a space division type in which optical paths are switched within an optical waveguide or between optical waveguides, a wavelength division multiplex type in which switching is performed by splitting a multiplexed light having a plurality of wavelengths into respective optical paths according to the wavelengths, a time division multiplex type in which optical paths of a time-division multiplexed light are switched periodically, and a free space type in which light propagation paths in an open space are spatially divided and compounded using mirrors, shutters, or the like. Each of these approaches may be multiplexed, and a combination of these approaches may be used.
A space division type optical switch is still under development, but a number of approaches have been proposed, including a type using a directional coupler, a type in which a copy of the optical signal is produced using an optical divider and a light is switched on and off by a gate element, and a type in which the refraction index of a waveguide is changed at a crossing or a crossing portion of a Y-branch so as to transmit or reflect the light propagated in the waveguide. A Mach-Zehnder interferometer type optical waveguide switch in which the refraction index of the waveguide is changed by a thermooptic effect caused by heating with an electric heater has recently been publicized as being at a state of development close to actual use. However, a switch of this type is disadvantageous not only in its slow response speed of approximately 1 millisecond, but also in that an electric signal must be used to operate the optical switch.
As free space type optical switches, development efforts are being made towards approaches such as a MEMS (micro electro mechanical system), an EARS (exciton absorption reflection switch), a multistage beam shifter type optical switch, a hologram type optical switch, and a liquid crystal switch. These switches have disadvantages in that they include mechanically moving parts and have polarization dependency. It is therefore considered that a free space type optical switch is not yet ready for actual use.
Much research is directed to development of all-optical optical elements and optical control methods which make use of changes in transmittance and refraction index generated by irradiating light on an optical element, to thereby directly use light to modulate light intensity and frequency.
For the purpose of developing a novel information processing technique employing all-optical optical elements and the like, the present inventors have been conducting research on optical control methods using an organic nanoparticle photothermal lens-forming element obtained by dispersing organic dye aggregates in a polymer matrix (disclosed in Takashi HIRAGA, Norio TANAKA, Kikuko HAYAMI, and Tetsuro MORIYA, "Production, Structure Evaluation, and Photophysical Properties of Dye Clusters and Aggregates", Electrotechnical Laboratory Report, published by Electrotechnical Laboratory (Japan), Agency of Industrial Science and Technology, Ministry of International Trade and Industry, Vol. 59, No. 2, pages 29–49 (1994)). At the present, an element which uses a control light (633 nm) to modulate a signal light (780 nm) has been developed. In this element, the control light and the signal light are arranged to be incident coaxially and parfocally. The operation principle is such that absorption of the control light allows temporary formation of a thermal lens which refracts the signal light. This element achieves a high response speed of approximately 20 nanoseconds.
Japanese Patent Laid-Open Publications Nos. Hei 8-286220, Hei 8-320535, Hei 8-320536, Hei 9-329816, Hei 10-90733, Hei 10-90734, and Hei 10-148852 describe an optical control method in which a control light is irradiated on an optical element having an optically responsive composition, so as to reversibly change the transmittance and/or refraction index of a signal light within a wavelength band differing from that of the control light, thereby modulating intensity and/or luminous flux density of the signal light transmitted through the optical element. According to this method, the control light and the signal light are each converged and irradiated on the optical element, while the optical paths of the control light and the signal light are adjusted such that the control light and the signal light overlap in their regions (beam waists) in the vicinity of the respective foci having the highest photon density.
Japanese Patent Laid-Open Publication No. Hei 10-148853 discloses an optical control method in which an optical element having an optically responsive composition is irradiated with a control light and a signal light having different wavelengths. The wavelength of the control light is selected from a wavelength band which is absorbed by the optically responsive composition. The optically responsive composition allows a thermal lens to be reversibly formed according to a distribution of density change caused by a temperature increase generated in and around an area of the optically responsive composition in which the control light is absorbed. The intensity and/or the luminous flux density of the signal light transmitted through the thermal lens can thereby be modulated. Japanese Patent Laid-Open Publication No. Hei 10-148853 further describes that the above-referenced optical element may be a dye/resin film or a dye solution film, and that a response time of the signal light in response to irradiation of the control light at a power of 2 to 25 mW is less than 2 microseconds.
The above-referenced thermal lens effect is explained as follows. At a center portion of light absorption, molecules which absorbed the light convert the light into heat. The heat is transferred toward the surrounding areas, thereby creating a temperature distribution. As a result, the refraction index of the light-transmitting medium changes from the center of light absorption toward the outward areas in a spherical manner, generating a distribution of refraction index which is small in the center of light absorption and increasing toward the outward areas. This produces a light refraction effect which functions as a concave lens. Such a thermal lens effect has already been employed for a considerable time in the field of spectral analysis, and, at the present, an ultra-high sensitivity spectral analysis for detecting light absorption by just one molecule is also possible (as described in Kitao FUJIHARA, Kei-ichiro FUWA, and Takayoshi KOBAYASHI, "Laser-Induced Thermal Lens Effect and Its Application to Colorimetry", Chemistry, published by Kagakudojin, Vol. 36, No. 6, pages 432–438 (1981); and Takehiko KITAMORI and Shiro SAWADA, "Photothermal Conversion Spectral Analysis", Analysis, published by The Japan Society for Analytical Chemistry, March 1994, pages 178–187).
As a method for deflecting an optical path using the thermal lens effect or a change in refraction index created by heat, Japanese Patent Laid-Open Publication No. Sho 60-14221 discloses deflecting light by supplying heat to a medium by a heat-generating resistor to produce a refraction index distribution. However, because this method involves generating heat with a heat-generating resistor and heating the medium via heat conduction, the problem of "heat diffusion" is integral to this method. In other words, heat diffusion hinders creation of a fine pattern of thermal gradient in a large area, making it difficult to obtain a desired refraction index distribution. Further, even when a photolithographic technique used for a semiconductor integrated circuit is employed to process the heat-generating resistor into a fine pattern, the actual results achieved have been limited, inevitably increasing the element size. When the element size is increased, the optical system also becomes larger and more complex. Moreover, because a heat-generating resistor is used to heat the medium via heat conduction, this method is integrally defective in that the response speed is slow and the frequency of change in refraction index cannot be increased.
Japanese Patent Laid-Open Publication No. Hei 11-194373 describes a deflection element comprising at least an optical element composed of an optically responsive composition, and intensity distribution adjusting means for irradiating light on the optical element in a light intensity distribution having a wedge-like shape. A refraction index distribution is created in the optical element using a control light, and the created refraction index distribution is used to deflect a signal light having a wavelength differing from that of the control light. Although this approach is advantageous in that light can be controlled by light, there exists a restriction that the deflection angle must be less than 30 degrees such that the switching direction of an optical path cannot be freely set.

Optical path switching device and method

National Institute of Advanced Industrial Science and Technology

Dainichiseika Color & Chemical Mfg. Co., Ltd.


A first recess for detachably mounting an ionizer therethrough is formed to oppose a dust-collecting air suction side of a precipitator machine body. The ionizer includes an ionizing wire unit having an ionizing wire, and a counterelectrode plate, which can be detachably assembled. A second recess for detachably mounting a dust collector therethrough is formed to oppose a dust-collecting air discharge side of the precipitator body. The dust collector captures and collects dust particles, charged by the ionizer, with a Coulomb force. The ionizer and dust collector are simultaneously electrically connected to the body when they are mounted on the corresponding recesses.

1. Field of the Invention
The present invention relates to an electrostatic precipitator machine for charging dust particles contained in air and capturing and collecting the charged dust particles with a Coulomb force.
2. Description of the Related Art
Electrostatic precipitator machines for capturing small dust particles contained in air to produce clean air have been recently proposed.
For example, Published Unexamined Japanese Patent Application No. 55-22390 discloses an electrostatic precipitator machine as shown in FIGS. 1A and 1B.
A front panel 102 is detachably mounted on a front opening 101 of a body casing 100.
A plurality of air intake ports 103 are formed in the front panel 102 to guide air containing dust particles into the body casing 100 therethrough.
An electrode plate unit 105 in which a plurality of electrode plates 104 are arranged at gaps is mounted on the front panel 102.
A plurality of discharge wires 106 are provided in the body casing 100 to alternate with the electrode plates 104.
When a high voltage is applied between the discharge wires 106 and the electrode plates 104, corona discharge occurs around the discharge wires 106 to generate ions.
The dust particles contained in the air guided through the air intake ports 103 collide with the ions to be charged.
The charged dust particles are attracted and collected by a dielectric filter 107 disposed behind the discharge wires 106 and the electrode plates 104.
The cleaned air passing through the dielectric filter 107 is discharged through an air discharge port 108 formed in the rear end portion of the body casing 100.
FIG. 1A shows a dust collecting state.
Air containing dust particles is guided to pass through the body casing 100 by rotation of a fan 110 mounted on a motor, and the dust particles are collected.
FIG. 1B shows a state in which the electrode plates 104 are cleaned.
Some of the charged dust particles attach to the electrode plates 104. If the electrode plates 104 are left uncleaned for a long period of time, dust is thickly deposited to cause clogging, thus degrading the dust collecting capability of the precipitator machine.
Thus, as shown in FIG. 1B, the front panel 102 on which the electrode plates 104 are mounted is removed from the body casing 100, as shown in FIG. 1B, to clean the electrode plates 104.
The electrostatic precipitator machine of this type, however, is generally installed at a high place of a room.
Although the front panel 102 is made of a synthetic resin material, it is heavy as it has a large area. The electrode plates 104 integral with the front panel 102 are also heavy as they are made of a metal material.
Accordingly, the total weight of the front panel 102 and the electrode plates 104 is very large.
To clean the electrode plates 104, the integral front panel 102 and electrode plates 104 must be removed and put down from the high location to the floor. When cleaning is completed, they must be lifted to the high location and mounted.
These operations require a large force and cumbersome procedures.
Since the dust particles attach to the discharge electrodes 106 as well, the discharge electrodes 106 must be cleaned.
However, since the discharge electrodes 106 are stationarily mounted on the body casing 100, the front panel 102 is removed and put down, and the discharge electrodes 106 are manually cleaned in the body casing 100.
If the body casing 100 is installed at a high place, this operation is dangerous. Even if it is installed at a low place, the operation also is very cumbersome.

Electrostatic precipitator machine for charging dust particles contained in air and capturing dust particles with coulomb force


A retrieval unit retrieves location information. A storage stores location information transmitted from a transmitter. A derivation unit derives a distance of travel based on the location information stored in the storage and the location information newly retrieved by the retrieval unit. A controller causes the transmitter to transmit the location information newly retrieved by the retrieval unit, if the distance of travel exceeds a threshold value.

1. Field of the Invention
The present invention relates to a communication technology and, more particularly, to a terminal device, base station device, communication system, and communication method adapted to transmit location information.
2. Description of the Related Art
The current location of a terminal device of a cell phone system is retrieved so that services adapted to the area including the current location are provided. For example, a terminal device periodically retrieves information indicating the current location of the device using a Global Positioning System (GPS) and transmits the location information to a server device. The server device determines an area in which the terminal device is located based on the received location information. In order to prevent an increase in the traffic for transmission of the location information, the server device transmits area information in advance. If the retrieved location information is included in a range indicated by the area information, the terminal device stops transmitting the location information (see, for example, patent document 1).
[patent document 1] JP2009-89092
Where area information is transmitted to control transmission from a terminal device, the larger the number of areas for which transmission should be controlled, the larger the number of items of area information, i.e., the data size. Also, transmission for a given area should be controlled in some cases but need not be controlled in other cases. Transmission of area information to suit different cases also increases the data size and traffic.

Terminal device, base station device, communication system, and communication method adapted to transmit location information


A lead-on-chip lead frame adapted to mount a chip divided into two independent circuit blocks thereon, the independent circuit blocks having pads arranged laterally and symmetrically with respect to a central portion of the chip, respectively. The lead-on-chip lead frame has a plurality of elongated common leads each adapted to wire-bond pads of each pad pair having the same function respectively arranged on the circuit blocks, each common lead extending laterally from the central portion of the chip in such a manner that it is lead out beyond a desired side edge of the chip. In this lead frame, the number of leads is reduced, thereby minimizing the size of the package.

1. Field of the Invention
The present invention relates to a lead-on-chip lead frame, and more particularly to a lead-on-chip lead frame used for highly integrated semiconductor memory devices in place of a multi-chip package. The present invention also relates to a semiconductor package using such a lead-on-chip lead frame.
2. Description of the Prior Art
Lead-on-chip lead frames have a structure in which leads are arranged on a chip, in order to fabricate highly integrated semiconductor memory devices having a reduced package area while involving a reduced generation of noise at power lines.
A brief description will be made in conjunction with such lead-on-chip lead frames used for highly integrated semiconductor memory devices.
Generally, a lead-on-chip lead frame has leads for power lines such as a ground voltage line and a supply voltage line, leads for control signals such as CASL (Low), CASU (Upper), WE (Write Enable), OE (Output Enable) and RAS signals, leads for input/output signals, and leads for address signals. Each lead has an end extending to a desired position on the central portion of a chip mounted on the frame. That is, the leads are wire-bonded at their ends to pads arranged on the central portion of the chip, respectively. Thus, an electric connection is obtained between the leads and chip. Since the pads are arranged on the central portion of the chip in such a structure, the length of signal transfer lines is minimized. It is also possible to achieve an easy design of signal transfer lines. Accordingly, a stable semiconductor device can be fabricated.
Another lead-on-chip lead frame structure has also been proposed. In this lead-on-chip lead frame structure, each signal transfer lead has an end extending to a desired position on the central portion of a chip mounted on the frame, as in the above-mentioned frame structure. The frame is also provided with power lines, such as a ground voltage lead and a supply voltage lead, extending longitudinally across the central portion of the chip. The power lines are electrically connected to pads on the chip by means of wire bonding.
In such a structure, the transfer of power is carried out by the ground voltage lead or supply voltage lead elongated to the central portion of the chip. Such a power line exhibits low resistance as compared to lines which are arranged as power lines on the chip. Accordingly, an advantage is that the operating speed is improved.
On the other hand, in the case of a highly integrated semiconductor device such as a DRAM of the 1 Giga grade, it may have a size which is too large for the device to be fabricated in a single stepper. In this case, the chip used for such a semiconductor device should be divided into two blocks for DRAM's of the 516 Mega grade. Each circuit block has independent pads for control signal lines, power lines, input/output signals and address signals so that the associated DRAM of, for example, the 512 Mega grade, can operate independently.
FIG. 1 illustrates a lead-on-chip lead frame having a conventional configuration and a chip mounted on the frame. As shown in FIG. 1, the chip, which is denoted by the reference numeral 10, is divided into two independent circuit blocks. The chip has left pads P1 . . . Pn arranged in a single line on the central portion of the left circuit block and right pads P'1 . . . P'n arranged in a single line on the central portion of the right circuit block. The left and right pads are connected to signal lines and power lines, and are independent from each other so as to operate respective DRAM's of, for example, the 512 Mega grade. Left leads L1 . . . Ln and right leads L'1 . . . L'n are also arranged on the chip 10 in such a manner that they have ends respectively disposed adjacent to the left and right pads. The left leads L1 . . . Ln and right leads L'1 . . . L'n extend laterally from the associated pads in such a manner that they protrude from the associated sides of the chip 10, respectively.
On the other hand, FIG. 2 illustrates a lead-on-chip lead frame having another conventional configuration and a chip mounted on the frame. As shown in FIG. 2, the chip, which is denoted by the reference numeral 10, has left pads P1 . . . Pn arranged in a single line on the central portion of the chip 10 and right pads P'1 . . . P'n arranged in a single line on the central portion of the chip 10. Left leads L1 . . . Ln and right leads L'1 . . . L'n are also arranged on the chip 10 in such a manner that they have ends respectively disposed adjacent to the left and right pads. The leads L1 and Ln are connected to each other by a line 20 which is connected to both the leads L1 and Ln while extending along the empty space of the central portion of the chip 10. The leads L'1 and L'n are connected to each other by a line 30 which is connected to both the leads L'1 and L'n while extending along the empty space of the central portion of the chip 10.
FIG. 3 illustrates a semiconductor package which is fabricated by mounting a chip on a lead-on-chip lead frame having the configuration of FIG. 1 or FIG. 2 and performing a wire bonding process and a molding process for the chip-mounted lead frame. As shown in FIG. 3, the semiconductor package has 86 leads which are indexed with their functions or purposes at their ends, respectively. That is, the semiconductor package is provided with leads 1, 18, 69 and 86 for supply voltage VCC, leads 2, 6, 14, 73, 77 and 85 for supply voltage VCCq, leads 19, 42, 45 and 68 for ground voltage VSS, leads 3, 7, 15, 76, 81 and 84 for ground voltage VSSq, leads 23, 24, 25, 26, 61, 62, 64 and 69 for control signals such as CASL, CASU, WE, OE and RAS signals, leads 4, 5, . . . 16 and 17 for input/output signals I/O0 to I/O7, leads 70, 71 . . . 82 and 83 for input/output signals I/O8 to I/O15, and leads 27 . . . 41 and 46 . . . 60 for address signals A0 to A14. Since this configuration has a laterally-symmetrical pad/lead arrangement, it requires a large number of leads.

Lead-on-clip lead frame and semiconductor package using the same

Hyundai Electronics Industries Co., Ltd.