A wiring substrate includes a first metal plate and a second electrode. The first metal plate includes a first electrode, a wiring, and a mount portion for an electronic component. The mount portion includes an upper surface of the wiring. The second electrode is joined to an upper surface of the first electrode. The first electrode is solid. The second electrode is solid.

Japanese Laid-Open Patent Publication No. 2012-191204 discloses a wiring substrate that incorporates an electronic component such as a semiconductor chip or a chip capacitor. The wiring substrate includes an interlayer insulation layer having an opening, and the electronic component is formed in the opening. Such a wiring substrate may be manufactured, for example, as follows.
First, a support substrate is prepared, and a wiring layer is formed on the support substrate. Then, a desired number of build-up wiring layers and interlayer insulation layers are stacked. Laser cutting is performed to form an opening in given ones of the interlayer insulation layers. After the electronic component is placed in the opening, an insulation layer fills the opening and entirely covers the electronic component. Then, a wiring layer is formed on the insulation layer and is electrically connected to the electronic component. Finally, the support substrate is removed.

Wiring structure having stacked first and second electrodes


A device and method for pass-phrase modeling for speaker verification and a speaker verification system are provided. The device comprises a front end which receives enrollment speech from a target speaker, and a template generation unit which generates a pass-phrase template with a general speaker model based on the enrollment speech. With the device, method and system of the present disclosure, by taking the rich variations contained in a general speaker model into account, the robust pass-phrase modeling is ensured even the enrollment data is insufficient, even just one pass-phrase is available from a target speaker.

Speaker recognition technology is useful in Human-Machine Interaction. Many applications and products could be enabled or augmented with speaker recognition technology, such as (1) on-site access control to some facilities (home appliances, car, PC terminals etc., or (2) remote secured access to database, website, even bank transaction through the lines of telephone, mobile or computer.
An enrollment or registration process for a target speaker is necessary before utilizing speaker recognition technology in a real system. In the speaker enrollment process, a sample speech from a target speaker is collected and used to generate the statistic template of a specific speaker. The quality of generated statistic template has big influence on the performance of the speaker recognition system.
FIG. 1 shows a diagram of a conventional device for pass-phrase modeling for speaker verification system. When a user wants to register his or her pass-phrase during the enrollment process, the utterances of the pass-phrase from the target user is requested by a front end 101 of the speaker verification system. Since the user's utterances are not always exactly the same each time, 3-5 repetitions of the pass-phrase are necessary in order to get a robust statistic template model in a modeling unit 103. The created template model is stored into a database 105 for the later verification. Two main disadvantages of the conventional method are: (1) if less enrollment data available or big intra-speaker variations existing, the effect of enrollment is not assured; and (2) user experience is not so good if more repetitions are needed since the users prefer a simple enrollment procedure.

Device and method for pass-phrase modeling for speaker verification, and verification system

PANASONIC INTELLECTUAL PROPERTY CORPORATION OF AMERICA


Backlit display systems, such as those employed with LED backlit displays, including those configured for autostereoscopic operation, may employ synchronization between the backlight and the presentation of sequential left and right eye images at a frame rate exceeding approximately 100 Hz. To successfully directionally illuminate isolated frames, the disclosed principles provide for segmenting the directional illumination and introducing a phase shifted, synchronized, pulsed drive scheme for the illumination segments. Accordingly, the principles disclosed herein are directed to segmented directional illumination systems and related techniques for segmented directional backlight illumination.

Spatially multiplexed autostereoscopic displays typically align a parallax component such as a lenticular screen or parallax barrier with an array of images arranged as at least first and second sets of pixels on a spatial light modulator, for example an LCD. The parallax component directs light from each of the sets of pixels into different respective directions to provide first and second viewing windows in front of the display. An observer with an eye placed in the first viewing window can see a first image with light from the first set of pixels; and with an eye placed in the second viewing window can see a second image, with light from the second set of pixels.
Such displays have reduced spatial resolution compared to the native resolution of the spatial light modulator and further, the structure of the viewing windows is determined by the pixel aperture shape and parallax component imaging function. Gaps between the pixels, for example for electrodes, typically produce non-uniform viewing windows. Undesirably such displays exhibit image flicker as an observer moves laterally with respect to the display and so limit the viewing freedom of the display. Such flicker can be reduced by defocusing the optical elements; however such defocusing results in increased levels of image cross talk and increases visual strain for an observer. Such flicker can be reduced by adjusting the shape of the pixel aperture, however such changes can reduce display brightness and can comprise addressing electronics in the spatial light modulator.
Generally, current display technologies may include functionality to deploy, view and/or display three dimensional (3D) content. Recently, the increased demand for such functionality has driven the need for enhanced performance of display technology. Display technology may employ the use of plasma and liquid crystal displays (LCDs) for 2D and 3D content. However, LCD displays struggle to meet various update requirements due to the modest response times and continuous scrolling and line-by-line updating provided in scrolling stereoscopic displays.

Segmented directional backlight and related methods of backlight illumination


An apparatus for and method of performing automatic test pattern generation for a digital circuit specified registers when the process of automatic test pattern generation for one or more faults is aborted which allow detection of circuit faults by scanning the specified registers. The scan request count of the specified registers is updated, and registers having a scan request count greater than the scan request count limit are recognized as critical registers. Automatic test pattern generation is performed while regarding the critical registers as scan registers.

1. Field of the Invention
This invention relates to a method of performing automatic test pattern generation for digital circuits, and design for testability, and also apparatuses for the method and design.
2. Description of the Prior Art
Automatic test pattern generation for sequential circuits involves a difficult problem, and even if an automatic test pattern generation program is used, it is generally difficult to obtain test patterns for all faults within a practical CPU time period. Furthermore, there ere also some faults which cause the automatic test pattern generation to abort. In order to solve these problems, scan path technique is widely used which makes it possible to write and read states externally by switching registers to a shift register configuration in the test mode. By making all of the registers scan registers, the test of a sequential circuit can be performed in three phases of: scan-in of the register state; partial testing of the combinational circuit; and scan-out of the register state, thereby allowing automatic test pattern generation problems to be handled as those of the combinational circuit. This enables automatic test pattern generation to be greatly simplified.
However, the structure for making all of the registers scan registers greatly increases the hardware overhead. Therefore, partial scan structure is used wherein only some of the registers have scan structure. In the partial scan, there is a high degree of freedom in selecting which registers are to be scan structure, and there have been proposed several methods of selecting registers which should be changed to scan registers.
Techniques of partial scan design are taught in "A Complete Solution to the Partial Scan Problem" (Int. Test Conf., pp. 44-51, 1987) and the references cited therein.
When considered from the standpoint of scan register selection, the prior art techniques can be generally classified into two categories shown in FIGS. 9A and 9B. In the method shown in FIG. 9A, the causes for low fault coverage are investigated after performing automatic test pattern generation, and then questioned registers are changed to scan registers. In the method shown in FIG. 9B, before performing automatic test pattern generation, registers which will likely present problems in test pattern generation are estimated based on the circuit topology, and then these registers are changed to scan registers.
The former method requires great amounts of the CPU time and memory capacity. The later method does not guarantee that registers which present problems in test pattern generation will actually be scanned, so that it is difficult to obtain high fault coverage with small area overhead.

Method and apparatus for performing automatic test pattern generation

Matsushita Electric Industrial Co., Ltd.


Described is a technology by which a real-time data relocating mechanism is provided for multiprocessing environments, including supporting lock-free programs that run in parallel. The relocating mechanism moves an object by using a status field related to the data field, possibly in an interim (wide) object space, which is then copied to a to-space object. The status information for each data field of the original object contains information indicating where a current version of the data for each field is present, that is, in the original, wide or to-space object. In one example, a handshake mechanism of a garbage collector establishes preparation and copy phases between the mechanism and other threads that determine where memory accesses occur. Also described is support for program thread compare-and-swap (CAS) operations and/or multi-word atomic operations.

Garbage collection refers to a type of automatic memory management found in many modern programming languages, including C#, Java, ML and Lisp. If the garbage collection does not include copying of program objects from one location in memory to another location in memory, long-running programs are likely to suffer from a phenomenon known as "memory fragmentation." Memory fragmentation leads to unnecessarily large memory requirements by programs, whereby programs may run slower or may eventually fail due to running out of available memory. Copying garbage collection counteracts memory fragmentation by copying program objects for the purposes of packing them closer together in memory. As a result, long-running programs such as operating systems, operating system components, and server applications may be saved from running out of available memory.
A large number of garbage collection techniques are in existence. One family of garbage collection techniques generally operates concurrently with the execution of the program whose memory is being reclaimed, and is referred to as concurrent garbage collection. However, existing garbage collectors for multiprocessor environments suffer from at least one of several problems.
One problem is that some garbage collectors employ what is known as a stop-the-world phase, which has a number of drawbacks. More particularly, in the stop-the-world phase, program execution is stopped for the purposes of doing part or all the work of garbage collection. Among other aspects, stopping program execution prevents the programs from modifying memory, which may include the memory allocated to the objects being processed for garbage collection. The duration that program execution is stopped is known as "pause time." Pause times degrade the user experience of a program, e.g., a pause time of a tenth of a second could cause the loss of two-to-three frames of video replay and a very noticeable pause in an audio signal.
To obtain short pause times, incremental or concurrent collectors have been developed. However, previous collectors suffer from one of the following drawbacks. Either they employ a stop-the-world phase, which hinder high-responsiveness; or they do not relocate objects, which leads to fragmentation in the long run; or they restrict support to a uniprocessor; or they do not support atomic operations, required to synchronize lock-free (non-blocking) algorithms, or they impose unsustainable overheads on memory usage and/or efficiency, or they impose unrealistic constraints on the behavior of user programs (e.g., violate the language semantics), or they impose unsustainable overheads on memory usage, or they rely on the processor having instructions not found in many commonly used machine architectures (e.g., not supported by the Intel x86 or x64 architectures).
In sum, stop-the-world garbage collectors are not acceptable for many applications. At the same time, known real-time highly-responsive collectors restrict real-time guarantees to uni-processor environments only, rely on special hardware, or suffer from one of the drawbacks mentioned above.


A wide bandwidth, low noise, fine frequency step phase locked loop frequency synthesizer (10) and processing method. The synthesizer (10) includes a first divider (16) for dividing a first signal provided by a reference frequency source (12). A first phase locked loop (20) is provided for receiving a divided first signal from the first divider (16) and providing an intermediate frequency signal in response thereto. The first phase locked loop (20) includes a first phase detector (22) for comparing the phase of the first signal to the phase of a first feedback signal and providing a first phase difference signal in response thereto. The first phase locked loop (20) includes a first voltage controlled oscillator (30) for providing the intermediate signal in response to the first phase difference signal. The first phase locked loop (20) includes a first mixer (32) for mixing the intermediate signal with a second signal at a second frequency F2 and providing the first feedback signal in response thereto. A second divider (38) is included in the first phase locked loop (20) for dividing the first feedback signal prior to its application to the first phase detector (22). A third divider (39) is provided for shifting the frequency of the intermediate frequency signal, and a second phase locked loop (40) is coupled to the third divider for processing the frequency shifted intermediate frequency signal and providing an output frequency signal from the synthesizer. The second phase locked loop (40) includes a second phase detector (42) for comparing the phase of the shifted intermediate signal to the phase of a second feedback signal and providing a second phase difference signal in response thereto. A second voltage controlled oscillator (50) is included for providing the output frequency signal from the synthesizer (10).

The present invention relates generally to frequency synthesizers and synthesizing methods, and more particularly, to a wide bandwidth, low noise, fine frequency step phase locked loop frequency synthesizer and synthesizing method that provides for a large number of frequency steps.
Frequency synthesizers are used to generate reference frequencies for radar systems, communication systems, test instruments and numerous other devices. In many of these applications, there is a need for low phase noise and frequency agility. In general, frequency synthesizers include a signal source, a frequency multiplier or divider and a phase locked loop. The signal source (typically a crystal oscillator) provides a signal at a reference frequency. The frequency multiplier or divider uses this signal to synthesize a signal at a frequency of interest. The phase locked loop synchronizes the signal at the frequency of interest with an input signal.
Noise around a signal may be represented as fluctuations of either the amplitude or phase of the carrier. This noise is commonly referred to as phase noise, since fluctuations in phase are typically the dominant source of noise close to the carrier. Phase noise causes lower receiver sensitivity in multi-signal environments, clutter noise in Doppler radar systems, and phase errors in digital communication systems. Phase noise imposes fundamental limitations wherever a weak signal is processed in the presence of a strong interfering signals. In receivers, phase noise sidebands of the receiver local oscillator are transferred to the IF product of the strong interfering signal and cover up the weak wanted signals. In a Doppler radar system, the strong interfering signal is produced by reflections from large stationary objects. Phase noise side bands of this unwanted return signal are decorrelated by delay and potentially cover the weak Doppler signal in the form of clutter noise. Phase noise is also a limiting factor in digital data transmission systems. Phase noise adds to overall system noise increasing the bit error rate and may cause a cycle slip in carrier or data clock recovery.
Conventional phase locked loop frequency synthesizers exhibit better frequency agility using higher reference frequencies. This is due to the fact that phase locked loops generally require several cycles to acquire (lock) onto a signal. At higher frequencies, more cycles are available in a shorter period of time.
In conventional systems, the phase locked synthesized frequency provided by a frequency synthesizer either has many fine steps with high phase noise or has low phase noise with very limited tuning step size. More specifically, the patents listed below disclose conventional synthesizers that cannot provide both low phase noise and synthesized frequencies having many fine steps at the same time. None of these conventional systems provides both low phase noise and synthesized frequencies having many fine steps at the same time.
The prior art patents referred to above are identified as follows: U.S. Pat. No. 4,940,950 entitled "Frequency Synthesis Method and Apparatus Using Approximation to Provide Closely Spaced Discrete Frequencies Over a Wide Range with Rapid Acquisition," issued to Helfrick, U.S. Pat. No. 4,965,533 entitled "Direct Digital Synthesizer Driven Phase Lock Loop Frequency Synthesizer," issued to Gilmore, U.S. Pat. No. 4,912,433 entitled "VCO Controlled by Separate Phase Locked Loop," issued to Motegi et al., U.S. Pat. No. 4,234,929 entitled "Control Device for a Phase Lock Loop Vernier Frequency Synthesizer," issued to Riley, Jr., U.S. Pat. No. 4,388,597 entitled "Frequency Synthesizer Having Plural Phase Locked Loops," issued to Bickley et al., and U.S. Pat. No. 4,912,432 entitled "Plural Feedback Loop Digital Frequency Synthesizer," issued to Galani et al. Of these references, the Bickley et al. and Galani et al. patents disclose plural phase locked loop synthesizers, and are considered pertinent to the present invention.
The Bickley et al. patent employs three phase locked loops to achieve synthesis. The synthesizer includes a first phase locked loop comprising a mixer and a phase detector. A second phase locked loop having a programmable divider supplies a reference frequency in predetermined steps to the mixer, while a third phase locked loop provides a reference frequency in predetermined steps to the phase detector, which steps are different from the steps provided by the second phase locked loop. Also, in a preferred embodiment, a fourth phase locked loop provides a reference signal to a mixer in the third phase locked loop to reduce the operating frequency therein and the output of the fourth phase locked loop is mixed with an output from the first phase locked loop to extend the range of the synthesizer.
The Galani et al. patent discloses an indirect digital frequency synthesizer adapted to produce a signal having a selected one of a plurality of relatively closely spaced frequencies and having a relatively fast frequency switching time. Multiple feedback loops are fed by reference frequency signals whose frequency is greater than the desired frequency separation provided by the synthesizer. The bandwidth of each of the feedback loops is less than the frequency of the reference fed to each loop, and achievement of frequency separation less than the frequency of either of the reference frequencies enables each of the feedback loops to have increased bandwidth and therefore reduced frequency switching times and increased noise suppression.
In order to advance the state of the art as evidenced in the above-cited patents, U.S. Pat. No. 5,150,078 entitled "Low Noise, Fine Frequency Step Synthesizer" issued to Steven S. Yang, et al. and assigned to the assignee of the present invention, discloses a frequency synthesizer that achieves low phase noise and provides for synthesized frequencies having many fine steps, and provides a low phase noise frequency synthesizer with fine frequency step tuning. This synthesizer provides for half-integer digital frequency dividing, VCO frequency offsetting, and local oscillator harmonic mixing using two phase locked loop circuits. The first loop generates the required frequency steps, while in the second loop the signal is divided by a fixed number to reduce both the frequency step size and to reduce the phase noise. The second loop output is divided by two, and then mixed with the third harmonic of the reference frequency to generate an offset frequency that is locked to the low phase noise frequency of the first loop. The present invention is an improvement to this synthesizer that provides for wide-band frequency operation.
In view of the above, there is a need in the art for a frequency synthesizer and synthesizing method that exhibits good frequency agility and low phase noise, and provides many channels, thus permitting wide band operation.

Wide band, low noise, fine step tuning, phase locked loop frequency synthesizer


A card intermediate, as for identification, which includes a business from having one or more selectively-pattern-treated laminae diecut into it and adhesively secured to a film.

Garrison, U.S. Pat. Nos. 5,466,013 and 5,589,025, describes card intermediates which include a business form having one or more cards diecut into it and backed by a complex laminate of multi-ply film. Removability of the card is accomplished by splitting an adhesive interface in the backing by employing a rupturable adhesive. Some of the splittable adhesive randomly stays with the form and some of it goes with the card. It is not universally acceptable to have the adhesive split randomly and transfer either way for aesthetic purposes where the adhesive residue mars the graphics on the card.
Fischer, U.S. Pat. No. 5,736,212, describes card intermediates which include a business form having one or more cards diecut into it and backed by a complex laminate of multi-ply film and/or paper. Removability of the card is accomplished by employing a "peel-glue" adhesive that exhibits a removable adhesive property at the interface of the removable piece and a permanent adhesive property that adheres the adhesive solely to the form when the piece is removed. All of the adhesive stays with the base layer that remains attached to the form after the diecut piece is removed. This invention is not universally accepted because while not very sticky, the adhesive still retains slight tack in the commercial product sold. When a form is stored tight in a file with other materials, especially smooth papers and films that are pressed in intimate contact with the peel adhesive, clinging between the forms can occur. Deadening the adhesive further could result in possible pre-release of the card as the integrated card is made in the form or the finished form is handled (folded, inserted into a mailer, etc.) in normal handling. Since all of the adhesive stays in the form after removal of the card, signature compatibility on the back of the form is not universally acceptable.
Casagrande, U.S. Pat. No. 5,782,497, describes card intermediates which include a business form having one or more cards diecut into it and backed by a complex laminate of multi-ply film and/or paper. Removability of the card is accomplished by transferring the adhesive interface to the backing by employing a deadening coated film (release) layer on top of a permanent adhesive. All of the permanent adhesive with the release layer adhered to it and transferred over it as a deadening layer staying with the form when removed. It is not universally acceptable to have the release layer stay with the form if the card is to be written on (signature compatible). The commercial product sold under this patent uses dry adhesive edges (no adhesive) to act as lift tabs at the card edge. They are used to begin to lift the release layer (that has tight adhesion to hold the card in the form) off of the card. This is done to facilitate transfer of the adhesive and release layer to the form without tearing the paper remaining in the form because there is not an easy release area at some point at the card edge.
Casagrande, U.S. Published Patent Application No. 20010015554 A1 Aug. 23, 2001, describes card intermediates which include a business form having one or more cards diecut into it and backed by a laminate of multi-ply film. Removability of the card is accomplished by transferring the adhesive interface with coated film release layer covering the permanent adhesive as a deadening agent to the back of the card. All of the permanent adhesive and the release layer stays with the card and cures to a solid film after drying that produces a signature compatible card that can be written on.
Schwarzbauer, U.S. Published Patent Application No. 20020000718 A1 Jan. 3, 2002, describes card intermediates which include a business form with a multi-layered laminate patch secured to the base paper layer having one or more cards diecut into it. The laminate has a primary film layer having top and bottom surfaces and a periphery, which is preferably chemically and mechanically bonded directly to a layer of breakaway coating. The bond between the breakaway coating and primary film layer is designed to release and allow the layers to separate. The advantage of the invention is the breakaway layer composition which is applied as a liquid and cures to a solid and is applied in varied patterns or thicknesses or may be chemically varied in patterns using different compounds in areas across the card when coated in order to allow variation in peel strengths in different areas of the primary film layer. One embodiment incorporates an area with an increased peel strength or tighter release in the center of the laminated card with an area of weaker peel strength at the outside edge of the patch positioned such that the die cut for the card will extend ¼″ beyond the center zone of the patch with the tight release. This positions the edge of the card in the area of the card with the easy release. Another embodiment teaches a pattern in either the adhesive coating or breakaway layer while another teaches the use of tighter areas on the edges just outside the perimeter of the diecut card with easy release in the card area. The invention works in concept but in production the process is difficult to control in terms of different degrees of peel strength across a film being pattern coated by using different thicknesses of coating as coating rolls wear and coating weight changes due to foam or temperature changes during a coating run. In addition, without controlling dyne level, changes in the natural dyne level of the incoming primary web which can vary in excess of 4 dynes produce inconsistent results. Following the teaching of using different compounds which must be applied in a registered pattern complicates the manufacturing process of the laminate. In addition, using multiple coating stations further complicates the process and increases the cost which is not desirable. Not only is the process of manufacturing the laminate complicated, secondary slitting of smaller rolls out of a master must be done in register to the pattern which is difficult and time consuming. Lastly, the end user producing the form must die cut in register to the coated pattern of different coat weights, patterned adhesive or breakaway coating or areas of different coated chemistry. A more universally manufacturable and useable product where a user could cut anywhere in the patch to begin removal of the card is preferred.
Fischer, U.S. Pat. No. 6,328,340 describes a "peeling adhesive" as also detailed in the U.S. Pat. No. 5,736,212 with an adhesive layer or layers that transfer to the back of the card instead of staying in the form. The novelty of the technology of U.S. Pat. No. 6,328,340 is that the peel glue layer can receive indicia which corrects for the short-coming of U.S. Pat. No. 5,736,212 technology not being signature compatible without the use of a separate pre-coating of a film layer as in Casagrande 20010015554. Fischer provides detail on the "peel glue" or "peeling adhesive" that has the dual function of adhesive and signature compatibility layer. The peeling adhesive system achieves the differential adhesive effects by pre-treatment using plasma, corona or flame treatment on the film layer where the bond is permanent (can not be peeled) and no treatment on the film for the other layer where the bond is not permanent (peelable). The peeling adhesive can have the same issues of tack as discussed above. Test cards made from substrate and peel adhesive obtained commercially that were placed in a wallet with other cards as will be done in practice showed that the peel glue will stick to another card. While it can be re-peeled and removed, this is not universally acceptable.
Hoffman, U.S. Pat. No. 4,879,430, and its divisional, U.S. Pat. No. 5,130,804 (both having in the meantime expired), disclose and claim a method of making plastic web materials which are selectively treated in a patterned manner with corona discharge for forming into containers. The variable corona pattern described in the Hoffman Patents was intended to create areas of weak sealability or bond of thermally sealable adhesive layers in the areas of treatment.
The present state of the art shows that easy lift cards can be integrally formed by diecutting multilayer laminates if one is willing to use extra steps and materials and that a single layer will suffice if one is willing to turn the business form over and punch the card out without leaving a layer in the form. One could use cards with a peel glue where a slight tack can remain on the form or the back of the card. Furthermore, an alternative approach is available if adhesives of two different strengths are used, or by patterning the adhesive, or by using a deadener, or even by using a patterned adhesive release deadener with a permanent adhesive, or cured breakaway coatings using different application patterns, different compounds in multiple applications or different thicknesses or areas of no breakaway or adhesive to achieve different peel strength characteristics.
The use of patterned adhesives, patterned release layers, multiple adhesives, selectively cured adhesives, release coatings, peel adhesives cured breakaway coatings using different application patterns, different compounds in multiple applications or different thicknesses or areas of no breakaway or adhesive to achieve different peel strength characteristics or combinations of the forgoing to create different levels of release. Sufficient adhesion on corona treated or non corona treated film layers has been necessary in the prior art to create removable but firmly adherent integrated cards to ensure that the card can be easily lifted at an edge to begin to disengage the card from the form, while other areas of the card patch integrated with the form have a tighter releasable bond than the lift area to maintain adhesion of the card to the form. This is necessary after die cutting so the card does not prematurely remove from the form due to the significant stiffness difference between the laminated card area in contrast to stiffness of the remaining base layer as the form is processed, folded, inserted and handled through automatic mail processing equipment. If the adhesion of the card at the interface with the layer remaining in the form is too loose, the card can prematurely remove in processing before reaching the end user. If the adhesion of the card is too tight, lifting and edge and removabilty is difficult which can result in damage to the card or form during attempted removal of the card.
This invention provides for an improved process for making an integrated card by simplifying the process by using areas of variable surface treatment alternating from higher treatment level (dyne level) in judiciously selected patterns on the same layer of film (not different layers as in Fischer). Variable treatment is defined as the application of different energy levels to the surface of a polymer substrate in a variety of patterns. The invention provides for easy separation of adhesive bonding layers (Fischer) or adhesive and deadening release agent (Casagrande) in any area of the card without the use of special "peel adhesives", patterned adhesives, cured breakaway coatings using different application patterns, different compounds in multiple applications, different thicknesses, areas of no breakaway or adhesive to achieve different peel strength characteristics, patterned release deadening layers, splittable adhesives or combinations while producing an easily separable but firmly adherent card. The variable degree of separation strength in lesser- or non-treated areas allows for easy "pop" or separation of the layers in that area while securely bonding in higher treatment areas for controlled separation force. The terms "pop" and "separation force" strength mean respectively; the ability of a laminate to lift an edge to disengage from or "pop" free of another layer; the "separation" force or strength required to remove the card once it has been disengaged.
It has now been found that making a business form having an integral and removable portion is unexpectedly improved if at least one of the films used as laminae with the form is patterned in a judicious way during treatment to produce alternating areas of easy and tight separation strength of adhesives or release/deadening layers to allow for ease of removability with firm controlled separation.
It has also been found that the process for making the forms with removable cards is simplified, and an improved card is obtained, if a patterned "treated area" is caused to develop on the substrate in at least the shape of the card. A universal treatment pattern is defined for purposes of this invention as a pattern that will allow for easy separation of a perimeter die cut card at any area in an integrated laminate form while providing sufficient adhesion to prevent pre-separation of the die cut card during normal handling and processing, regardless of whether or not patterned or full coverage adhesives, release coatings, deadening agents, cured breakaway coatings, different application patterns, different compounds in multiple applications or different thicknesses or areas of no breakaway or adhesive are used to achieve different peel strength characteristics. Release or deadening layers in this art are also known as breakaway or fugitive layers that release or breakaway from one layer and transfer to a second layer to facilitate separation of the layers as defined in Casagrande. These layers do not "peel" in the classic sense of the art as an adhesive system does, rather they "breakaway" and become fugitive once the area of tightest bond has separated and removal force is applied.
Accordingly, a principal object of the present invention is to provide for the use of intermediates to make cards for use without the problems discussed above.
These and other objects of the invention will become apparent from the present specification.

This patent is subject to a terminal disclaimer.


[Problem] Provision of a heat-sealable multilayer polypropylene-based resin film having heat seal strength sufficient for packaging a heavy article and tight-sealing property, and a packaging material using the film.

Conventionally, in general, a coextruded polypropylene-based resin laminate film wherein a polyolefin-based resin having a low melting point is laminated on a polypropylene-based resin, and a polypropylene-based resin laminate film, wherein an unoriented polyethylene-based resin film or polypropylene-based resin film and an oriented polypropylene-based resin film are laminated, have been frequently used as heat-sealable films used for packaging. However, a coextruded polypropylene-based resin laminate film wherein a polyolefin-based resin having a low melting point is laminated on a polypropylene-based resin has a certain level of seal strength but does not have a seal strength enabling packaging of a heavy article such as a water product and the like. A polypropylene-based resin laminate film, wherein an unoriented polyethylene-based resin film or polypropylene-based resin film and an oriented polypropylene-based resin film are laminated, has sufficient seal strength but requires a laminating step using an organic solvent and the like, and therefore, is unpreferable in view of the economical aspect and an influence on the global environment.
In addition, as a method for improving the seal strength of the coextruded polypropylene-based resin laminate film, an embodiment using a polypropylene-based resin as a substrate layer and a linear low density polyethylene-based resin as a heat-sealable layer has been reported (e.g., see patent reference 1). However, since a heterologous material is laminated, it has a weak interlayer strength, and a sufficient heat seal strength desired by the present invention cannot be obtained.    patent reference 1: JP-A-9-207294
Moreover, forming an adhesion layer between a polypropylene-based resin layer and a linear low-density polyethylene-based resin layer has been reported (e.g., see patent reference 2). However, since a polyethylene-based resin is laminated, the film loses elasticity, which causes difficulty in the handling during bag making processing and after filling the contents.    patent reference 2: JP-A-10-76618
In addition, it has been reported that sufficient seal strength can be obtained by defining the MFR (melt flow rate) of the resins to be used for the respective layers (e.g., see patent reference 3). However, this alone is not sufficient to ensure satisfactory tight-sealing property of the sealed part during automatic packaging, and this method is unsuitable for use requiring tight-sealing property of the sealed part.    patent reference 3: JP-A-2003-225979

Heat-sealable multilayer polypropylene resin film and packaging material

Abstract: [Solving means] A heat-sealable multilayer polypropylene-based resin film comprising a crystalline polypropylene-based resin and a propylene-α-olefin copolymer, which is an oriented polypropylene-based resin film made of a laminate of 3 or more layers of a substrate layer having a melting point of 155° C. or less, an intermediate layer and a thermal adhesion layer having a melting point of 150° C. or less, wherein the intermediate layer has a xylene-soluble content of 2.5% or less, the substrate layer has a melting point higher than that of the intermediate layer, and the intermediate layer has a thickness of 4 μm or above.


Some features pertain to an integrated device that includes a first package, a set of interconnects, and a second package. The first package includes a first substrate comprising a first surface and a second surface. The first package includes a redistribution portion comprising a redistribution layer. The first package includes a first die coupled to the first surface of the first substrate. The set of interconnects is coupled to the redistribution portion of the first package. The second package is coupled to the first package through the set of interconnects. The second package includes a second substrate comprising a first surface and a second surface; and a second die coupled to the first surface of the second substrate, where the second die is electrically coupled to the first die through the second substrate of the second package, the set of interconnects, and the redistribution portion of the first package.

FIG. 1 illustrates a conventional package on package (PoP) integrated device. As shown in FIG. 1, the integrated device 100 includes a first package 102 and a second package 104. The first package 102 includes a first substrate 106, a first die (e.g., chip) 108, a first set of solder balls 116, and a first set of interconnects 118. The first substrate 106 may include traces and/or vias (both of which are not shown). The second package 104 includes a second substrate 105, a second die 107, a third die 109, a second set of solder balls 115, a first set of wire bonding 117, and a second set of wire bonding 119. The second substrate 105 may include traces and/or vias (both of which are not shown). The second package 104 is positioned above the first package 102.
The first die 108 is coupled to a first surface (e.g., top surface) of the first substrate 106 through the first set of interconnects 118. The first set of solder balls 116 is coupled to a second surface (e.g., bottom surface) of the first substrate 106. The first substrate 106 includes a set of traces and/or vias that may electrically connect to the first die 108 and/or the first set of solder balls 116.
The second die 107 and the third die 109 are coupled to a first surface (e.g., top surface) of the second substrate 105. The second die 107 is electrically coupled to the traces and/or vias of the second substrate 105 through the first set of wire bonding 117. The third die 109 is electrically coupled to the traces and/or vias of the second substrate 105 through the second set of wire bonding 119. The second set of solder balls 115 is coupled to a second surface (e.g., bottom surface) of the second substrate 105.
One major drawback of the package on package (PoP) configuration shown in FIG. 1 is that it creates an integrated device with a form factor that may be too large for the needs of mobile computing devices. That is, the PoP configuration shown in FIG. 1 may be too thick and/or have a surface area that is too large to meet the needs and/or requirements of mobile computing devices.
Therefore, there is a need for an integrated device that includes an improved PoP configuration. Ideally, such an integrated device will have a better form factor (e.g., smaller, thinner) that meets the needs and/or requirements of mobile computing devices. Moreover, such an improved PoP configuration would provide better integrated device performance (e.g., better signal, better channel, better electrical speed performance).

Package on package (PoP) integrated device comprising a redistribution layer


An amplitude adjustment device such as an amplitude compression device and amplitude expansion device is basically configured by a PWM modulator, a demodulator and an amplitude detector. Herein, the PWM modulator effects pulse-width modulation on an input signal to produce a pulse-width modulated signal, which is demodulated by the demodulator to produce an output signal. In addition, the amplitude detector detects an amplitude of a demodulated signal or an amplitude of the input signal to produce a control signal. A modulation factor of the pulse-width modulation is adjusted based on the control signal. In the case of the amplitude compression device, an input/output gain is changed inversely proportional to the amplitude of the input signal or amplitude of the output signal. Thus, it is possible to compress a dynamic range with respect to input/output characteristics. A full-wave rectifier, applicable to the amplitude adjustment device, is mainly configured by an inversion amplifier, an amplifier and an output section. Herein, the inversion amplifier amplifies an input signal with a gain of “−1”, while the amplifier amplifies it with a gain of “1”. Outputs of the amplifiers differ from each other in phases by 180°. The output section produces a full-wave rectified signal based on the outputs of the amplifiers. Incidentally, all of the amplifiers and output section are configured using field-effect transistors without using diodes being externally connected. Hence, it is possible to manufacture the full-wave rectifier in a form of an IC in accordance with the MOS process with ease.

1. Field of the Invention
This invention relates to amplitude adjustment devices such as amplitude compression devices and amplitude expansion devices, which are made with the MOS (i.e., Metal-Oxide Semiconductor) technology. In addition, this invention also relates to full-wave rectifiers, applicable to the amplitude adjustment devices, which are made with the MOS technology. Specifically, the devices are used for amplitude adjustment and rectification of audio inputs of digital audio systems.
This application is based on Patent Application No. Hei 10-180864 and Patent Application No. Hei 10-180865 both filed in Japan, the contents of which are incorporated herein by reference.
2. Description of the Related Art
Conventionally, amplitude compression/expansion devices are used for compressing and expanding signals of audio playback systems or audio reproduction systems. In the case of the automobiles, for example, drivers normally hear the noise due to the running of the automobiles when listening to the music which is played back with audio devices. So, if the drivers play back the music having a broad dynamic range such as the classic music, the drivers are hard to listen to piano sounds which are performed in pianissimo, for example. To improve such hardness in listening to the music in the automobiles, amplitude compression devices called "compressors" are used for the audio devices so that musical tone signals having small amplitudes are reproduced with a relatively large gain while musical tone signals having large amplitudes are reproduced with a relatively small gain.
There are provided three examples as the aforementioned amplitude compression devices, as follows:
FIG. 11 shows a circuit configuration for a first example of the amplitude compression device, which uses a voltage control amplifier. Herein, the voltage control amplifier 100 contains a multiplier, which is configured using bipolar transistors. The voltage control amplifier 100 adjusts an amplitude of an input signal Vin based on a control signal Cs. Thus, the voltage control amplifier 100 produces an output signal Vout in response to the input signal Vin. An amplitude detection circuit 110 is configured by a full-wave rectifier and a low-pass filter. The amplitude detection circuit 110 produces the control signal Cs in response to an amplitude of the output signal Vout. Normally, the bipolar transistors have base-emitter voltage characteristics, which show logarithmic characteristics. Using such characteristics, the voltage control amplifier 100 adjusts the amplitude of the input signal Vin.
FIG. 12 shows a circuit configuration for a second example of the amplitude compression device, which uses a gain switching amplifier. Herein, the gain switching amplifier 200 has a capability of switching over gains thereof based on control data Dc. In addition, an amplitude detection circuit 210 detects an amplitude of an output signal Vout. So, the amplitude detection circuit 210 produces the control data Dc in response to the detected amplitude. Incidentally, the gain switching amplifier 200 has a number of steps in changing the gains, which are called "gain steps". Herein, the number of gain steps corresponds to a number of bits of the control data Dc.
FIG. 13 shows a circuit configuration for a third example of the amplitude compression device, which uses a digital signal processor (i.e., DSP). Herein, an input signal Vin is supplied to a DSP 310 via an analog-to-digital converter (or A/D converter). The DSP 310 detects an amplitude of the input signal Vin. Then, the DSP 310 performs non-linear amplification based on the detected amplitude, thus producing output data thereof. A digital-to-analog converter 320 (or D/A converter) converts the output data of the DSP 310 to an analog signal, which is output as an output signal Vout.
The aforementioned examples of the amplitude compression devices suffer from problems, as follows:
The first example of the amplitude compression device shown in FIG. 11 is designed such that the voltage control amplifier 100 is configured using the bipolar transistors, wherein amplitude compression is performed using the logarithmic characteristics of the bipolar transistors. So, it is impossible to manufacture the amplitude compression device in a form of an IC in accordance with the MOS process (or MOS technology). For this reason, the first example of the amplitude compression device suffers from a problem in which it has a limited range of application.
In the second example of the amplitude compression device, the gain switching amplifier 200 cannot change the gains thereof in a continuous manner. Therefore, the output signal should be made discontinuous in response to gain switching timings. Thus, the second example suffers from a problem in which it cannot produce the output signal which is "smooth".
The third example of the amplitude compression device uses the DSP 310, which requires conversion from analog signals to digital signals and conversion from digital signals to analog signals. For this reason, the third example suffers from a problem in which it has a complicated circuit configuration.
By the way, full-wave rectifiers are known as devices that perform full-wave rectification on signal voltages to detect amplitude values of signals. FIG. 14 shows an example of a circuit configuration for the full-wave rectifier. The full-wave rectifier of FIG. 14 is mainly configured by a half-wave rectifier and an addition circuit of an inversion type. Herein, the half-wave rectifier is configured by resistors 110, 120, diodes D1, D2 and an operational amplifier OP1, while the addition circuit is configured by resistors 130, 140, 150 and an operational amplifier OP2. All of the resistors 110 to 140 have same resistance "R", while the resistor 150 has resistance of "R/2".
The half-wave rectifier is configured such that the diodes D1, D2 cancel voltage drops Vf in forward directions. Therefore, a half-wave rectified signal V′ increases in a positive direction from a ground level. For example, if an input signal Vin shown in FIG. 15A is applied to the half-wave rectifier, its half-wave rectified signal V′ is shown in FIG. 15B.
In the addition circuit of the inversion type which is configured by the resistors 130 to 150 having the aforementioned resistances respectively, it is possible to perform addition on the input signal Vin with a gain "−1", while it is possible to perform addition on the half-wave rectified signal V′ with a gain "−2". Therefore, an output signal Vout of the addition circuit is shown in FIG. 15C.
As described above, the full-wave rectifier is configured using two diodes and two operational amplifiers (OP1, OP2), wherein the half-wave rectified signal V′ is produced and is mixed with the input signal Vin so that the output signal Vout is created.
The aforementioned full-wave rectifier can be applied to an audio signal processing circuit in order to detect amplitudes of reproduced audio signals, wherein processing is performed in response to the amplitudes of the reproduced audio signals. Engineers wish to manufacture such audio signal processing circuit in a form of a LSI circuit in accordance with the CMOS process (where "CMOS" is an abbreviation for "Complementary Metal-Oxide Semiconductor"). However, it is impossible to form the diodes by the CMOS process. So, there is a disadvantage in that the diodes should be provided as external components which are attached to the LSI circuit.

Device for amplitude adjustment and rectification made with MOS technology


A milking plant for cows is provided with a milking machine comprising teat cups, which are connected separately to the teats of an animal. The milk obtained from each udder quarter is conveyed through a separate line to a milk measuring device. The milk measuring device includes four milk meters, one for each teat cup, having separate discharge lines coupled to common discharge lines which connect with a circulation line or loop that includes a bulk milk cooling tank, a two-speed or variable speed pump, and a plurality of heat exchangers for precooling the milk received from the common discharge lines before it is received in the bulk milk cooling tank and to recirculate and cool the milk received in the bulk milk cooling tank. After the milk has been discharged from the bulk milk cooling tank and the system is to be disinfected, washed and rinsed, the heat exchangers being used in a heat pump arrangement, can heat the fluid therein as selected and desired for sanitizing the system.

The present invention relates to a milking plant for milking cows, which plant comprises teat cups that are connectable to the respective teats of a cow's udder, the milk obtained from each udder quarter capable of being conveyed with the aid of the said teat cups, through a separate line to a milk measuring device for measurement and evaluation wherefrom, if from an unhealthy quarter it is separated, otherwise it is caused to flow through a common milk discharge line into a milk circulation loop, including a bulk milk tank, wherein the milk is cooled and continuously circulated to maintain it in wholesome condition for delivery to a dairy.
In prior art milking plants of the above-defined type, the teat cups are combined in one single milking claw, while the buffer space in the milking claw, to which space the teat cups are connected directly, comprises four separate chambers. Via four separate milk hoses the milking claw is connected to a milk meter, from which the milk can be separated or be supplied to a milk cooling tank. The object of the four-quarter milking claw is to provide better means to maintain the udder in a healthy condition; the milk originating from an inflamed quarter has a higher conductivity than that from a healthy one, which can be measured for each quarter, whereafter it can be determined whether or not the milk must be separated.
Such milking apparatus is less suitable when a common claw is used for all four teat cups from the cow's udder, and therefore it is preferable that the teat cups be interconnected to the milking system in general individually and independently of each other to the teats of the udder.
Moreover, having prevented unwholesome milk from being mixed with that from healthy quarters, it is important that the milk be maintained in its healthy state by being held continuously at the proper cool temperature (about 3.degree. C. or 38.degree. F.) and sufficiently circulated while periodically receiving warm milk from several milkings so that the milk's wholesomeness is maintained until its delivery to a dairy wherein it is further processed and placed in containers for retail sales.


An electronic expansion valve is provided, a stop component thereof includes a spindle which is fixed with respect to the valve seat, a spring guide rail sleeved on the spindle, and a sliding ring configured to cooperate with the spring guide rail; one end of the sliding ring extends to form a stop rod, and a top of the magnet is provided with a stop hole, the stop rod passes through the stop hole, and when the sliding ring is at an upper limit position and a lower limit position, the stop rod remains in the stop hole. The structural design of the electronic expansion valve may reduce a number of components, simplify the assembly process of a stop rod, and improve the operational reliability of the stop rod, and reduce a radial dimension of a magnet, thereby saving the material cost and realizing the minimization of the product.

In the field of refrigerating and heating technology, an electronic expansion valve is a component used to control a flow rate of refrigerant in a refrigerating and heating device, and the working process of the electronic expansion valve is generally illustrated as follows. With a coil device being energized or de-energized, a vale needle regulates an opening of a valve port, thereby regulating the flow rate of the refrigerant.
In the conventional technology, an electronic expansion valve is disclosed in a Chinese Patent Application Publication No. "CN102454819A". Reference is made to FIG. 1, which is a schematic view showing the structure of an electronic expansion valve in the conventional technology.
As shown in FIG. 1, the electronic expansion valve includes a valve seat 1′ and a housing 2′, and the housing 2′ is fixedly supported on the valve seat 1′, therefore, the relative position between the housing 2′ and the valve seat 1′ is fixed. A rotatable magnet 3′ is provided inside the housing 2′, the magnet 3′ is fixedly connected to a screw rod 4′, and the screw rod 4′ cooperates with a nut 5′ by screw threads. The nut 5′ has a lower end fixed to the valve seat 1′, therefore, the relative position between the nut 5′ and the valve seat 1′ is fixed. The electronic expansion valve further includes a stop component, the stop component includes a spindle 6′1 which is fixed with respect to the valve seat 1′, a spring guide rail 6′2 sleeved on the spindle 6′1, and a sliding ring 6′3 configured to cooperate with the spring guide rail 6′2. In such structure, an upper portion of the nut 5′ forms the spindle 6′1, and the spring guide rail 6′2 is sleeved on an outer wall of the upper portion of the nut 5′.
As show in FIG. 1, in the above structure, a top portion of the magnet 3′ is provided with a connecting seat 3′1, the connecting seat 3′1 is connected to a stop rod 6′4 extending downwards, and the stop rod 6′4 cooperates with an extending portion 6′3a of the sliding ring 6′3. As the magnet 3′ rotates, the stop rod 6′4 cooperates with the extending portion 6′3a to drive the sliding ring 6′3 to rotate along the spring guide rail 6′2, and the scope of rotation of the sliding ring 6′3 is limited between an upper limit position and a lower limit position of the spring guide rail 6′2, thereby limiting a number of turns of rotation of the magnet 3′.
However, the electronic expansion valve of the above structure has the following defects:
Firstly, the stop rod 6′4 is connected to an inner wall of the connecting seat 3′1, and is assembled inside the magnet 3′, thus the assembly process is difficult, and the assembly cost is high. Furthermore, the reliability of connection of the stop rod 6′4 is low, and after working for a period of time, the stop rod 6′4 is apt to fall out.
Secondly, the extending portion 6′3a of the sliding ring 6′3 is required to extend in a radial direction by an enough length so as to cooperate with the stop rod 6′4, and meanwhile, it is further required to avoid an interference between the extending portion 6′3a and the inner wall of the magnet 3′, thus the magnet 3′ is required to have a large radial dimension, which not only increases the material cost, but also is adverse to the minimization of the product.


A semiconductor package includes a substrate; a first semiconductor chip arranged on the substrate; a second semiconductor chip arranged on the first semiconductor chip; a lead attached to the second semiconductor chip on a side of the second semiconductor chip opposite a side of the second semiconductor chip facing the first semiconductor chip; and a molding member covering an upper surface of the substrate and side surfaces of the lead and sealing the first semiconductor chip and the second semiconductor chip.

Embodiments relate to a semiconductor package, a package-on-package (PoP) device including the same, and a mobile device including the same, and more particularly, to a semiconductor package having a structure that prevents deformation of a semiconductor chip, a package-on-package device including the semiconductor package, and a mobile device including the same.
Recently, as demand for miniaturized mobile devices has increased, small, thin, and light semiconductor devices have been developed. Accordingly, a semiconductor package including a plurality of semiconductor chips has been developed. For example, the semiconductor package may have a chip-on-chip (CoC) structure in which two or more semiconductor chips are stacked or a package-on-package (PoP) structure in which two or more semiconductor packages are stacked. In this case, an entire thickness of the semiconductor package may increase, however, when thicknesses of the mounted semiconductor chips are decreased in order to address this problem, the semiconductor chips may be deformed. Thus, deterioration of an electrical connection in the semiconductor package may occur.

Semiconductor package with a lead, package-on-package device including the same, and mobile device including the same


A rechargeable battery, and a module thereof, including a case accommodating an electrode assembly therein; a cap plate covering an opening of the case and having terminal holes; and electrode terminals installed in the terminal holes and electrically connected to the electrode assembly, the electrode terminals being protruded from lateral surfaces of the case adjacent the opening.

1. Field
Aspects of embodiments of the present invention relate to a rechargeable battery and a module thereof.
2. Description of the Related Art
Unlike a primary battery that is not rechargeable, a rechargeable battery can be recharged and discharged. A small-capacity rechargeable battery is typically used for small portable electronic devices, such as mobile phones, notebook computers, camcorders, and the like, while a large-capacity rechargeable battery may be used as a motor-driving power source, such as for a hybrid vehicle, an electric vehicle, or the like.
For example, a rechargeable battery includes an electrode assembly formed by having a positive electrode and a negative electrode arranged on both surfaces of a separator, a case accommodating the electrode assembly therein, a cap plate hermetically sealing an opening of the case, and electrode terminals penetrating the cap plate and electrically connected to the electrode assembly.
The electrode terminals are installed in a vertical direction on a plane of the cap plate through the cap plate, i.e. in an upward direction in a cell. Namely, the electrode terminals are maintained in a state in which the electrode terminals are protruded upward from the cap plate. Thus, much space is required for the vertically upward direction of the cell, and the number of connection members connecting electrode terminals may be increased in forming a module.
The above information disclosed in this Background section is only for enhancement of understanding of the background of the described technology and therefore it may contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art.


Embodiments include method, systems and computer program products for performing summarization of a recording based on biometric and business process data. Aspects include receiving a recording of a customer service representative performing a task, receiving a biometric data from a sensor configured to monitor the customer service representative during the performance of the task and obtaining a business process data relating to one or more of the task and the customer service representative. Aspects also include identifying one or more portions of interest from the recording based on one or more of the biometric data and the business process data and compiling the one or more portions of interest into a summarization of the task.

The present disclosure relates to summarization or a recording and more specifically, to methods, systems and computer program products for performing summarization of a recording based on biometric and business process data for quality control monitoring.
Consumers routinely rely on customer service representatives to perform contracted tasks, such as repairing a car, performing surgery, or the like in an expected manner. However, mistakes do happen and often a consumer or employer is left wondering how to prove that a contracted service was performed improperly. Today a consumer's course of action may be to hire an additional expert service provider for a second opinion regarding how the service was provided. In some cases, an employer may use video to record the working environment of employees and it may instigate a review of the video upon discovery of a problem. If a problem is discovered, the employer may take actions to prevent a reoccurrence with future consumer.
Video summarization is one way to facilitate sharing video data, specifically the relevant information from that video, with other parties. Video summarization techniques collect a subset of frames, for example based on saliency of each frame, to provide a story using fewer frames of the video. Some currently available video summarization techniques use a standard sampling rate to select a subset of frames for collection. For example, the a single frame out of a fixed number of frames, i.e., 1/10, 1/20, may be selected and the ratio of the number of selected frames to fixed frames can be determined based on the application.

Summarization of a recording for quality control

INTERNATIONAL BUSINESS MACHINES CORPORATION


A system for sensing and measuring the relative motion of an object, comprising a transceiver device configured to transmit a signal toward an object, a plurality of detectors offset in phase to receive the transmitted signal and a reflected signal, and a processor configured with logic to measure a phase shift resulting from the relative motion of the object between the transmitted signal and the reflected signal at the plurality of detectors, wherein the processor is further configured with the logic to relate the phase shift to the relative motion of the object.

The present invention generally relates to sensing systems and, more particularly, to non-contact sensing systems.
Sensing systems are employed for a wide variety of purposes and in diverse fields. There are sensing systems for detecting motion, surface irregularities, environmental conditions, and for physiological conditions, to name a few. Applications can be used in such industries as medical, process, aeronautical, and others. Such diversity in purpose and industry results in a multitude of considerations for the designer or user of the sensing system. These considerations include cost, precision, measurement range, durability, maintenance requirements, and even the physical characteristics of the sensed object, among others.
Non-contact, or non-invasive, sensing systems are sensing systems that, unlike direct contact sensing systems, do not require the sensing portion (e.g. sensor) to physically contact (directly or through an intermediary) the sensed, or targeted object. Non-contact sensing systems offer many advantages over traditional direct contact sensing systems, such as the ability to provide information regarding an object and/or condition of interest without expensive and invasive sensor mounting assemblies. Non-contact systems, unlike contact systems, also have the advantage of not changing the system they are measuring. Radar systems are an example of one non-invasive sensing system. Radar systems use reflected radio waves, typically on the order of 0.9-100 giga hertz (GHz) to determine the presence, location, and speed of sensed objects. Some radar systems operate by transmitting either a constant continuous wave (CW) signal or a pulsed signal. Most of these CW radar systems operate under the principle of the Doppler effect, which is the change in received signal frequency with respect to transmitted signal frequency, due to motion. CW radar systems using the Doppler effect provide a mechanism of detecting a moving target by transmitting microwaves at a targeted object and detecting the change in frequency of microwave signals reflected from the target. Continuous wave radar techniques are non-contact, relatively inexpensive, and provide a sensing mechanism that is relatively unaffected by dust, debris, rain, and many other obscurants when the proper transmit frequencies are used. Conventional radar sensing systems provide limited information on the speed, location, and direction of movement of targets being sensed, but are unable to provide high resolution information of xe2x80x9csensed objectsxe2x80x9d on the subwavelength scale. Thus, there exists a need for a radar sensing system that improves the information received about the sensed target.
Thus, a heretofore unaddressed need exists in the industry to address the aforementioned deficiencies and inadequacies.
The present invention provides, among other things, a sensing system. The sensing system can generally be described as including, among other things, a transceiver device configured to transmit a signal toward an object, a plurality of detectors offset in phase to receive the transmitted signal and a reflected signal, and a processor configured with logic to measure a phase shift resulting from the relative motion of the object between the transmitted signal and the reflected signal at the plurality of detectors, wherein the processor is further configured with the logic to relate the phase shift to the relative motion of the object.
The present invention can also be viewed as, among other things, a sensing method. The method can generally be viewed as including the following steps: measuring a phase shift resulting from the relative motion of an object between a transmitted signal and a reflected signal at a plurality of detectors; and relating the phase shift to the relative motion of the object.
Other systems, methods, features, and advantages of the present invention will be or become apparent to one with skill in the art upon examination of the following drawings and detailed description. It is intended that all such additional systems, methods, features, and advantages be included within this description, be within the scope of the present invention, and be protected by the accompanying claims.


According to the invention, blocks (10) are formed of rigid colored material shaped as mosaic components of the road sign; the sign is then composed by arranging the blocks (10) as a mosaic, and incorporatedly inserting the blocks (10) into the upper layer (40) of the wearing course, in such a manner that the upper surface of the mosaic road sign is substantially coplanar with the road surface.

1. Technical Field
The present invention relates to a method for manufacturing road signs, in roads in which the wearing course comprises an upper layer of asphalt or similar material. The present invention is also directed to the structural nature of the road signs.
2. Disclosure of the Invention
The method of the invention comprises: forming blocks of rigid colored material shaped as mosaic components of the road sign; arranging the blocks as a mosaic; and inserting the blocks into the upper layer of the wearing course in such a manner that the upper surface of the mosaic road sign is substantially coplanar with the road surface.
The component blocks can be formed of material relatively resistant to the wear which occurs on the road surface by normal vehicle and people passage. In addition these blocks can be of many millimeters thickness and can be colored throughout.
Consequently by virtue of the invention, a road sign incorporated into the wearing course is formed, which can have a very long life under normal use of the road.
Moreover, the road sign formed can have a relatively high vivacity and brightness, and in any event greater than those of the usual road signs formed by being painted on the road surface.

Impianti 2000 S.N.C. di Valcavi Anna E.C.


A test instrument, including an embedded VNA circuit, for testing a DUT. The test instrument includes a first receiver for receiving an incident RF signal through a first coupling device; a second receiver for receiving a reflected RF signal through a second coupling device; a test port for connecting to an interconnect, which is connectable to a calibration device in a calibrating stage, during which the interconnect is characterized, and to the DUT in a testing stage, during which at least one parameter of the DUT is tested; an RF source for generating the incident RF signal during the calibrating stage; and a processing unit programmed to determine S-parameters of the interconnect based on the incident RF signal and the reflected RF signal, the S-parameters compensating for error introduced by the interconnect when testing the at least one parameter of the DUT in the testing stage.

A vector network analyzer (VNA) is a type of radio frequency (RF) test equipment used to characterize network devices, for example, in terms of scattering parameters (S parameters), for purposes of design, testing and/or calibration. The network devices characterized by a VNA may include a device under test (DUT), as well as an interconnect between the DUT and the VNA used to test the DUT. The interconnect may be implemented as a cable, a probe, a fixture, a filter, or other electrical component capable of passing a signal between the DUT and the VNA. A cable, or other connectorized component, has connectors on both ends for connecting to the DUT and to the VNA. A probe has a connector on one end and a probe tip(s) on the other end. The connector may be connected to the VNA and the probe tip(s) may be used to temporarily contact a circuit in the DUT, although the opposite arrangement may be used. A fixture has a connector one end and an interface on the other end, where the interface may be non-standard and thus difficult to calibrate. A fixture is similar to a probe but the connection point is not moved around a circuit. A VNA is able to provide both amplitude and phase measurements of the network devices.
A VNA may be used in combination with other RF test instruments, such as signal sources (signal generators), spectrum analyzers and oscilloscopes. For example, when a DUT is measured using another RF test instrument, measurement errors are introduced due to the interconnect and equipment drift, for example. A simple VNA may be combined with the RF test instrument in order to provide error correction and advanced measurement capabilities. The VNA measurements may be used, for example, to equalize interconnects, correct source flatness, measure mismatch, measure gain, align phase between sources, and correct external test system preamplifiers.
For example, when an RF test instrument is connected to a DUT through a cable (or other interconnect), the errors introduced by the cable need to be eliminated. Conventionally, this may be accomplished by disconnecting the cable from the RF test instrument and connecting it to a VNA, performing measurements on the cable using the VNA to determine the errors, disconnecting the cable from the VNA and reconnecting to the RF test instrument, and manually loading the errors determined by the VNA into the RF test instrument so that subsequent measurements performed on the DUT by the RF test instrument can be corrected. Thus, for accurate measurements, the VNA is used to remove the effects of the cable, e.g., by measuring the cable and then de-embedding the relevant cable measurements from the measured data obtained by the RF test instrument. This procedure is time consuming and inefficient, particularly for unsophisticated users.


A system for illuminated tap handles includes at least one tap handle, at least one charging unit, at least one control device (remote control), and a plurality of web enabled computing devices. The at least one tap handle provides illumination through a transparent handle casing, where the illumination is provided by a LED light strip. The LED light strip can be controlled and operated by the plurality of web enabled computing devices and a remote control device. The at least one charging unit provides a wireless internet network for the plurality of web enabled computing devices, and sends out text messages to the plurality of web enabled computing device through the wireless network and a personal-area network.

Beer tap handles have been used by a wide variety of people for centuries to dispense beer. The beer handles have evolved into many different shapes and forms throughout the years. Different types of beer tap handles often display different designs and decals for promotional purposes. Currently, there are no beer tap handles that utilize a remote operation for illuminative purpose.
It is therefore an object of the present invention to introduce a plurality of illuminated tap handle that comprises at least one charging unit, and a remote control device, where users have complete control over the desired lighting effects of the plurality of illuminated tap handles. It is further objective of the present invention to provide a wireless internet network and text messaging technology so that the customers of an establishment can join in to the wireless internet network to use the internet, and the owners are able to promote their business through the text messaging and communication technology. Animation technology, such as scrolling messages on the face of the tap handle, can also be added to the present invention to promote the establishment.


A shed-forming device in a weaving loom which includes spaced partitions to which are mounted retention hooks controlled by electro-magnets. The electro-magnets are encased in a substantially air-tight manner between adjacent partitions. In the preferred embodiment, oppositely oriented flanges extend from the borders of each partition so as to be engagable with the flanges of adjacent partitions when the partitions are mounted in assembled relationship to thereby form substantially air-tight enclosures.

1. Field of the Invention
The present invention relates to devices for forming the shed of a weaving loom including a plurality of assemblies intended to form the shed of the weaving loom.
2. History of the Related Art
U.S. Pat. No. 4,739,806 to Palau et al. discloses a device of the type in question of which the assemblies each include two hooks joined by a funicular element, an electro-magnet and retaining hooks located between two separating partitions joined to each other with a view to producing an independent assembly or module.
It will be readily understood that the pole pieces of the electro-magnets placed between two separating partitions are not isolated from the ambient atmosphere. The ambient atmosphere in a weaving workshop includes fatty dust in suspension is created by waste or flock coming from the weaving yarns and by fine particles of oil and grease in suspension in the air. Such fatty dust tends to be deposited on the pole piece of the electro-magnets which may cause defective operation of the retaining hooks, leading to defects in weaving.
It is an object of the improvements forming the subject matter of the present invention to overcome this drawback and to place each electro-magnet in a substantially air-tight casing.

Enclosures for electromagnets of shed-forming assemblies


A system including an implantable medical device (IMD) configured to be programmed with magnetic resonance imaging (MRI) settings for use during an MRI scan, a server configured to receive MRI settings associated with the IMD, and configured to store the MRI settings associated with the IMD, and a portable retrieval programmer. The portable retrieval programmer includes a housing configured for portability by a user, a first communication module in the housing configured to communicate with the server to retrieve the MRI settings associated with the IMD, and a device communication module connectible to and disconnectible from the housing and configured to communicate with the IMD to retrieve the identity data and program the IMD with the MRI settings.

Many different types of medical devices are implanted within patients to provide medical therapy. One type of an implanted medical device is a cardiac rhythm management device, such as a pacemaker or implantable defibrillator. Cardiac rhythm management (CRM) devices are used to provide medical therapy to patients who have a disorder related to cardiac rhythm, such as bradycardia or tachycardia.
Magnetic resonance imaging (MRI) is a method of visualizing body tissues of a patient, primarily to identify pathological conditions or to visualize physiological structure for purposes of medical diagnosis and therapy. MRI relies on subjecting the body tissue of interest to a very strong uniform magnetic field, up to about 30,000 gauss, as well as a moderate strength but variable magnetic field of around 200 gauss. In the presence of these uniform and gradient magnetic fields, a radio frequency (RF) pulse is transmitted from a coil to the body tissue. Hydrogen atoms within the body tissue have a magnetic moment and tend to line up with the direction of the applied magnetic fields. Some of these hydrogen atoms will align facing one direction and others will align facing an opposite direction, such that most of the hydrogen atoms facing in alternating directions will tend to cancel each other out. However, a small percentage (but a significant absolute number) of hydrogen atoms will be unbalanced, or not cancelled out. The applied RF pulse tends to cause the unbalanced hydrogen protons to spin, or resonate, in a particular direction and at a particular frequency. When this RF pulse is turned off, the spinning hydrogen protons revert to their earlier, aligned position, and release their excess energy. The RF coil of the MRI machine is capable of detecting this emitted energy and transmitting a corresponding signal to a processor that transforms the signal to an image of the body tissue. Because different tissues have different characteristic responses to the application of the RF pulse in the presence of the magnetic fields, these differences can be utilized to prepare an image showing areas of contrasting tissue types.
MRI techniques have proven to be very effective at diagnosing certain medical conditions and allowing for patients to receive timely, appropriate medical therapy. However, in many cases patients having an implanted medical device are contraindicated for MRI and MRI may be inappropriate for those patients.
During imaging, the electromagnetic radiation produced by the MRI system may interfere with the operation of an IMD. In the case of cardiac devices, the presence of strong magnetic fields and RF energy during an MRI scan may prevent the charging of a high voltage capacitor within the cardiac device, which can affect the ability of the cardiac device to deliver electrical shocks to the patient when an event such as a tachyarrhythmia occurs. The RF energy and/or time varying gradient fields may prevent the sensing and detection of tachyarrhythmias by cardiac devices. The MRI system may also affect other types of implantable medical devices (IMDs).
Some embodiments of IMDs provide for a method of operating an IMD in the presence of an MRI environment using particular MRI settings for the IMD. Examples of patents and patent publications that describe such methods and options for MRI settings for an IMD include U.S. Published Patent Application No. 2010-0087892A1, Stubbs et al.; U.S. Published Patent Application No. 2010-0106215A1, Stubbs et al.; U.S. Published Patent Application No. 2010-0211123A1, Stubbs et al.; U.S. Published Patent Application No. 2008-0221638A1, Wedan et al.; U.S. Pat. No. 7,853,318, Wedan and U.S. Pat. No. 7,873,412, Wedan; which are each incorporated by referenced herein in its entirety.

Remote programming of MRI settings of an implantable medical device


A lighting device (1) is disclosed, comprising a carrier substrate (4) and a heat-transferring element (5). The carrier substrate (4) includes at least a first region (6) and a second region (8). The first region (6) comprises a light-emitting module (7). The second region (8) comprises a communication module (9), which is configured for wireless communication. The heat-transferring element (5) connected with the carrier substrate (4). The carrier substrate (4) partly overlies the heat-transferring element (5) such that at least a part or portion of the first region (6) of the carrier substrate (4) overlies the heat-transferring element (5) and at least a part or portion of the second region (8) of the carrier substrate (4) does not overlie the heat-transferring element (5).

Lamps or lighting modules with controllable light sources such as light-emitting diodes (LEDs) may be communicatively connected with a control unit or controller, e.g., in wireless fashion using radio frequency (RF) communication techniques or means. Such lamps or lighting modules will in the following be referred to as 'connected lamps', or 'connected LED lamps' in case of including one or more LEDs. As used herein, the term "LED lamp" encompasses LED modules or the like. While reference in the following may be made to connected LED lamp, it is to be understood that the description applies also to types of connected lamps other than connected LED lamps, similarly or in the same manner. RF communication techniques or means may for example employ or comprise one or more RF antennas. The operation of the light sources of the lamp may be controlled for example by means of the control unit or controller transmitting control signaling to the lamp. This may be particularly desirable for lamps capable of emitting light of different colors, such as, for example, multicolor filament lamps, in order to facilitate or allow for adjusting the color of the light emitted by the lamp. In alternative or in addition, dimming of the light source(s) of the lamp, or activation/deactivation of the light source(s) of the lamp, may be controlled (e.g., based on output from a sensor that may be included in the lamp) by means of the control unit or controller transmitting control signaling to the lamp.
In connected LED lamps, the light generating functionality (e.g., 'L2') and the communication functionality (e.g., an RF board) are provided in separate components. This is in part due to size constraints, but also because of the conflicting requirements of a wireless communication element (e.g., an antenna) and a light generating element (e.g., a LED board). For a good antenna performance, the antenna should be arranged distinct from and at a distance from metal parts of the connected LED lamp. However, for best thermal management performance (e.g., cooling) in connected LED lamp with a relatively high power, light-emitting elements such as LEDs should be placed on a metal core printed circuit board (MCPCB).
US 2015/103515 discloses a lighting assembly, comprising a circuit board coupled to a power storage unit, the circuit board comprising a processor and communication module; a lighting module electrically connected to the circuit board, the lighting module comprising: a substrate; and a set of light emitting elements mounted to a first broad face of the substrate.


Systems and methods for controlling application of horizontal resistive force to a user walking on a treadmill to provide substantially constant force even if the user changes his or her relative position on the treadmill. The systems and methods can improve the user experience when force is applied while also improving user safety. The system has a cable, a motor, and a system controller. The cable can be coupled to a harness to apply a horizontal resistive force to a treadmill user, and the motor can be coupled to the cable and configured to apply a motor force to the cable. The cable can have an adjustable operative length. The system controller can have a processor communicatively coupled to the motor and configured to adjust the force applied by the motor in response to changes in cable length and a measurement of the actual force applied by the cable.

When individuals walk or run at an average velocity, their instantaneous velocity varies considerably depending upon where the user is within his or her gait cycle. There is a need for improved systems and methods for adjusting and controlling application of a horizontal resistive force applied to individuals (e.g., treadmill users) who are walking or running at an average velocity.

Force profile control for the application of horizontal resistive force


A system and method for stimulating a formation surrounding a well and vibrating a device for supporting a gravel pack in the well, according to which a build up of scale on the device is sensed and a corresponding signal is output. A driver is provided for driving a transducer coupled to the device for vibrating the device and removing scale from the device.

This invention relates to a vibrating device for use in sand control and formation stimulation in an oil and gas recovery operation.
Many oil and gas downhole recovery operations, especially high-rate, high-permeability completions, produce reservoir fluids that contain fines, or formation sand. Therefore, support and screening devices, such as screens, slotted liners, and the like, have been utilized to support gravel packs, or the like, in the well to stabilize the formation while permitting the recovered fluids to pass from the formation into the wellbore while preventing passage of fines or formation sand with the recovered fluids.
These support devices are often placed in a pressure-drop zone that subjects the devices to contamination from scaling (salt crystal growth) and other materials that are precipitated during production of the reservoir fluids (hereinafter collectively referred to as "scale"). Thus, the scale must be removed from the devices either mechanically, which adds to the labor and cost of the project, or chemically, which may harm the metal parts of the devices. Also, during the recovery operation from the wellbore, a "skin" develops around the wall of the wellbore that impedes the flow of fluid from the formation thus requiring techniques to remove the skin.
Therefore, what is needed is a device of the above type that simultaneously performs the above screening as well as the scale and skin removal functions, yet eliminates the above problems.

System and method for scale removal in oil and gas recovery operations


Prepolymers comprising at least one block of Formula II and terminated with a polymerizable ethylenically unsaturated radical are useful in hydrogel materials are disclosed:

1. Technical Field
The present invention generally relates to polysiloxane prepolymers and their use as biomedical devices such as ophthalmic lenses.
2. Description of Related Art
In the field of biomedical devices such as contact lenses, various physical and chemical properties such as, for example, oxygen permeability, wettability, material strength and stability are but a few of the factors that must be carefully balanced in order to provide a useable contact lens. For example, since the cornea receives its oxygen supply exclusively from contact with the atmosphere, good oxygen permeability is a critical characteristic for any contact lens material. Wettability also is important in that, if the lens is not sufficiently wettable, it does not remain lubricated and therefore cannot be worn comfortably in the eye. Accordingly, the optimum contact lens would have at least both excellent oxygen permeability and excellent tear fluid wettability.
Hydrogels represent a desirable class of materials for many biomedical applications, including contact lenses and intraocular lenses. Hydrogels are hydrated, cross-linked polymeric systems that contain water in an equilibrium state. Silicone hydrogels are a known class of hydrogels and are characterized by the inclusion of a silicone-containing material. Typically, a silicone-containing monomer is copolymerized by free radical polymerization with a hydrophilic monomer, with either the silicone-containing monomer or the hydrophilic monomer functioning as a crosslinking agent (a crosslinker being defined as a monomer having multiple polymerizable functionalities) or a separate crosslinker may be employed. An advantage of silicone hydrogels over non-silicone hydrogels is that the silicone hydrogels typically have higher oxygen permeability due to the inclusion of the silicone-containing monomer. Because such hydrogels are based on monomers polymerizable by free radical, these materials are thermosetting polymers.
U.S. Pat. No. 5,034,461 discloses neutral polyurethane-containing prepolymers. These prepolymers may be copolymerized with a hydrophilic comonomer to form a silicone hydrogel copolymer that is useful as a contact lens material and other biomedical device applications. The prepolymers exemplified in U.S. Pat. No. 5,034,461 do not include any major hydrophilic portion, and therefore, these prepolymers are copolymerized with a hydrophilic monomer to form a hydrogel copolymer.
It would be desirable to provide improved biomedical devices formed from silicone-containing material that exhibit suitable physical and chemical properties, e.g., oxygen permeability and wettability, for prolonged contact with the body while also being biocompatible.

Abstract: wherein n, R, R1, R2 and X+ are as defined herein.