A method for forming a via through a dielectric layer within a microelectronics fabrication. There is first provided a substrate employed within a microelectronics fabrication. There is then formed upon the substrate a patterned first dielectric layer which defines a via accessing a contact region formed within the substrate. The patterned first dielectric layer is formed of a first dielectric material which is not susceptible to etching with an oxygen containing plasma. There is then formed upon the patterned first dielectric layer a blanket second dielectric layer which completely covers the patterned first dielectric layer and fills the via. The blanket second dielectric layer is formed of a second dielectric material which is susceptible to etching within the oxygen containing plasma. There is then formed upon the blanket second dielectric layer a blanket hard mask layer which is formed from a hard mask material which is not susceptible to etching within the oxygen containing plasma. There is then formed upon the blanket hard mask layer a patterned photoresist layer which leaves exposed a portion of the blanket hard mask layer greater that an areal dimension of the via and at least partially overlapping the areal dimension of the via. There is then etched while employing a first plasma etch method the blanket hard mask layer to form a patterned hard mask layer defining a first trench formed through the patterned hard mask layer while employing the patterned photoresist layer as a first etch mask layer. The first plasma etch method employs a first etchant gas composition appropriate to the hard mask material from which is formed the blanket hard mask layer. Finally, there is then etched while employing a second plasma etch method the blanket second dielectric layer to form a patterned second dielectric layer having an aperture formed therethrough. The aperture comprises: (1) a second trench corresponding with the first trench; and (2) at least a portion of the first via. The second plasma etch method employs the oxygen containing plasma.

1. Field of the Invention
The present invention relates generally to methods for forming patterned conductor layers separated by patterned dielectric layers within microelectronics fabrications. More particularly, the present invention relates to dual damascene methods for forming patterned conductor layers separated by patterned dielectric layers within microelectronics fabrications.
2. Description of the Related Art
Microelectronics fabrications are formed from microelectronics substrates over which are formed patterned microelectronics conductor layers which are separated by microelectronics dielectric layers.
As microelectronics integration levels have increased and microelectronics device and patterned conductor layer dimensions have decreased, it has become increasingly common within the art of microelectronics fabrication to employ, interposed between the patterns of narrow linewidth dimension and/or narrow pitch dimension patterned microelectronics, conductor layers within microelectronics fabrications microelectronics dielectric layers formed of low dielectric constant dielectric materials. Such patterned microelectronics conductor layers often access within the microelectronics fabrications within which they are formed patterned conductor contact stud layers or patterned conductor interconnection stud layers. For the purposes of the present disclosure, low dielectric constant dielectric materials are intended as dielectric materials having a dielectric constant of less than about 3.0. For comparison purposes, dielectric layers formed employing conventional silicon oxide dielectric materials, silicon nitride dielectric materials or silicon oxynitride dielectric materials typically have dielectric constants in the range of from about 4.0 to about 7.0.
Microelectronics dielectric layers formed of low dielectric constant dielectric materials are desirable interposed between the patterns of narrow linewidth dimension and/or narrow pitch dimension patterned microelectronics conductor layers within microelectronics fabrications since such dielectric layers formed from such low dielectric constant dielectric materials provide dielectric layers which assist in providing microelectronics fabrications exhibiting enhanced microelectronics fabrication speed, attenuated patterned microelectronics conductor layer parasitic capacitance, and attenuated patterned microelectronics conductor layer cross-talk.
Low dielectric constant dielectric materials which may be employed for forming low dielectric constant microelectronics dielectric layers within microelectronics fabrications are typically materials with hydrogen and/or carbon content, such as but not limited to organic polymer spin-on-polymer dielectric materials (such as but not limited to polyimide organic polymer spin-on-polymer dielectric materials, poly-arylene-ether organic polymer spin-on-polymer dielectric materials, and fluorinated poly-arylene-ether organic polymer spin-on-polymer dielectric materials), amorphous carbon dielectric materials (such as but not limited to amorphous carbon and fluorinated amorphous carbon), and silsesqiuoxane spin-on-glass (SOG) dielectric materials (such as but not limited to hydrogen silsesquioxane spin-on-glass (SOG) dielectric materials, carbon bonded hydrocarbon silsesquioxane spin-on-glass (SOG) dielectric materials, and carbon bonded fluorocarbon silsesquioxane spin-on-glass (SOG) dielectric materials).
While organic polymer spin-on-polymer dielectric materials, amorphous carbon dielectric materials, and silsesquioxane spin-on-glass (SOG) dielectric materials are thus desirable within the art of microelectronics fabrication for forming patterned low dielectric constant microelectronics dielectric layers interposed between the patterns of patterned conductor layers which access patterned conductor stud layers within microelectronics fabrications, such microelectronics fabrication structures are often not formed entirely without problems. In particular, such microelectronics fabrication structures are typically formed employing an etch stop layer formed interposed between: (1) a patterned first dielectric layer through which is formed a patterned conductor stud layer; and (2) a patterned low dielectric constant dielectric layer which is formed adjoining the patterned conductor layer which contacts the patterned conductor stud layer. The etch stop layer typically assures optimal definition of the patterned conductor layer within respect to the patterned conductor stud layer. Unfortunately, the presence of such etch stop layers often provides additional microelectronics fabrication complexity within microelectronics fabrications within which are formed patterned conductor layers which contact patterned conductor stud layers.
It is thus towards the goal of forming microelectronics fabrication structures comprising patterned low dielectric constant dielectric layers separating patterned conductor layers which in turn contact patterned conductor stud layers, with attenuated microelectronics fabrication complexity, that the present invention is directed.
Various methods have been disclosed in the art of microelectronics fabrication for forming patterned microelectronics layers within microelectronics fabrications.
For example, Korczynski, in "Low-k dielectric integration cost modelling," Solid State Technology, Oct. 1997, pp. 123-28, discloses in general various methods and materials for forming patterned low dielectric constant dielectric layers interposed between the patterns of patterned conductor layers which in turn contact patterned conductor stud layers within microelectronics fabrications. Disclosed are standard patterned conductor layer formation and dielectric layer isolation methods and dual damascene patterned conductor layer formation and dielectric layer isolation methods.
In addition, Krishnan et al., in U.S. Pat. No. 5,380,546, discloses a maskiess method for forming a barrier layer surrounded metal feature within a planar insulator layer within a microelectronics fabrication. The barrier layer surrounded metal feature so formed is formed employing a planarizing method rather than a masking method.
Further, Ireland, in U.S. Pat. No. 5,466,639, discloses a dual damascene method for forming a patterned conductor layer contiguous with a patterned conductor stud layer within a semiconductor integrated circuit microelectronics fabrication. The dual damascene method employs a patterned mask layer formed interposed between a lower dielectric layer through which is formed the patterned conductor stud layer and an upper dielectric layer through which is formed the patterned conductor layer contiguous with the patterned conductor stud layer, where the upper dielectric layer and the lower dielectric layer are patterned employing a single reactive ion etch method.
Yet further, Havemann, in U.S. Pat. No. 5,565,384, discloses a method for forming within an integrated circuit microelectronics fabrication a self-aligned via through an inorganic dielectric layer to access a patterned conductor layer formed below the inorganic dielectric layer, where the patterned conductor layer has interposed at least partially between its patterns an organic containing dielectric layer. The patterned conductor layer and the organic dielectric layer are completely covered by the inorganic dielectric layer. The method employs an anisotropic etchant which is selective to the inorganic dielectric layer with respect to the organic dielectric layer, such that the organic dielectric layer serves as an etch stop layer when etching the self-aligned via through the inorganic dielectric layer, thus avoiding overetching of the organic dielectric layer.
Still yet further, Huang et al., in U.S. Pat. No. 5,635,423 also discloses a dual damascene method for forming a patterned conductor layer contiguous with a patterned conductor stud layer within a semiconductor integrated circuit microelectronics fabrication. The dual damascene method employs a blanket mask layer formed interposed between a lower dielectric layer through which is formed the patterned conductor stud layer and an upper dielectric layer through which is formed the patterned conductor layer contiguous with the patterned conductor stud layer, where the upper dielectric layer and the lower dielectric layer are sequentially patterned employing separate reactive ion etch (RIE) methods.
Finally, Avanzino et al., in U.S. Pat. No. 5,686,354, discloses yet another dual damascene method for forming a patterned conductor layer contiguous with a patterned conductor stud layer within a microelectronics fabrication. The dual damascene method employs a single dielectric layer sequentially: (1) partially patterned employing a first etch method to form a trench within the single dielectric layer; and (2) subsequently completely patterned employing a second etch method and hard mask layer exposing a portion of a floor within the trench, to define with sharp sidewall edges the patterned conductor stud layer through the single dielectric layer.
Desirable in the art of microelectronics fabrication are methods through which there may be formed within microelectronics fabrications low dielectric constant dielectric layers interposed between the patterns of patterned conductor layers which in turn contact patterned conductor stud layers, with attenuated process complexity.
It is towards the foregoing object that the present invention is both generally and more specifically directed.

Dual damascene patterned conductor layer formation method without etch stop layer

Taiwan Semiconductor Manufacturing Company, Ltd.


Light flux controlling member 140 includes first light flux controlling member 141 and second light flux controlling member 142. First light flux controlling member 141 includes incidence surface 143 on which a part of light emitted from light-emitting element 130 is incident, total reflection surface 144 that reflects a part of light incident on incidence surface 143 toward second light flux controlling member 142, and emission surface 145 that emits a part of light incident on incidence surface 143 and light reflected by total reflection surface 144. Second light flux controlling member 142 includes reflection surface 149 that reflects a part of light emitted from first light flux controlling member 141. Reflection surface 149 is a rotational symmetric surface with the optical axis LA of light-emitting element 130 as a rotation axis.

Recently, from the viewpoint of energy saving or environmental conservation, illuminating apparatuses (such as LED lamps) using a light-emitting diode (hereinafter, also referred to as "LED") as a light source have been used instead of incandescent lamps. However, a conventional illuminating apparatus using an LED as a light source can emit light only in the forward direction, but cannot emit light in all directions like an incandescent lamp. Accordingly, the conventional illuminating apparatus cannot extensively illuminate a room using reflected light from a ceiling or walls like an incandescent lamp.
In order to make light distribution characteristics of such a conventional illuminating apparatus using an LED as a light source close to the light distribution characteristics of an incandescent lamp, it has been proposed that the distribution of light emitted from the LED be controlled by the use of a light flux controlling member (for example, see PTL 1). FIG. 1 is a schematic diagram illustrating the configuration of an illuminating apparatus described in PTL 1. As shown in FIG. 1, illuminating apparatus 10 includes plural LEDs 12 arranged on a substrate and cylindrical case 14 formed of a light-transmitting material and disposed around LEDs 12. The top surface of case 14 is formed in an inverted truncated cone shape. Aluminum plate 16 reflecting light is attached to the oblique surface of the truncated cone, which serves as a reflection surface. On the other hand, the horizontal plane of the truncated cone serves as transmission window 18 transmitting light. As indicated by arrows in FIG. 1, a part of light emitted from LEDs 12 passes through transmission window 18 and serves as emitted light in the forward direction (upward direction). A part of light emitted from LEDs 12 is reflected by aluminum plate 16 and serves as emitted light in the lateral direction (horizontal direction) and in the backward direction (downward direction).
In this way, by controlling the traveling direction of light emitted from the LEDs using a light flux controlling member, it is possible to obtain emitted light in the lateral direction and in the backward direction as well as in the forward direction. Therefore, by using the light flux controlling member (reflection surface) described in PTL 1, it is possible to make the light distribution characteristics of the illuminating apparatus (LED lamp) close to the light distribution characteristics of an incandescent lamp to a certain extent.

Light flux controlling member and illuminating device


A scalpel having a blade with a fitting molded about or assembled to its proximal end with the fitting having a proximally facing opening sized to receive an end of a distal portion of a detachable handle. The handle includes a proximal portion designed to be gripped by the surgeon and a distal portion including a male coupling half designed to be received within the proximal opening of the fitting, which proximal opening is configured as a female coupling half. The proximal and distal portions of the handle are angled with respect to one another defining an angle from about 0xc2x0-10xc2x0. The male coupling half may be inserted within the female coupling half in either one of two diametrically opposed orientations. Thus, due to the angulation between the proximal portion of the handle and the distal portion of the handle, the proximal portion of the handle is either angled downwardly or upwardly with respect to the axis of the blade itself. The handle may be attached to the blade in either one of these two positions depending upon the particular surgical step that is being carried out by the surgeon. The blade itself is provided with a double grind which enhances the sharpness and longetivity of the blade. In the preferred embodiment, the blade includes a primary grind defining an angle of 6xc2x0-10xc2x0 per side and a secondary and final grind of 14xc2x0-18xc2x0 per side. The blade itself is made of a thickness of from 0.020-0.029 inches, and, if desired, the cutting surface of the scalpel blade may be coated with a very thin layer of zirconium nitride or other coating material as disclosed.

The present invention relates to a scalpel with a double grind blade edge and detachable handle. During performance of surgery, the surgeon typically employs a scalpel to cut tissue. In this environment, the scalpel blade becomes dull within one to two minutes as evidenced by the tearing of tissues with the scalpel blade in jagged, uneven cuts. Eventually, after a total of three to five minutes, the blade will no longer cut tissues and must be replaced.
During a typical total hip or total knee surgery case, the surgeon can use as many as ten to fifteen blades. Having to change the scalpel blade that many times during the course of a single surgery eliminates any notion of continuity and greatly increases surgery time while also increasing the risk that the surgeon or nurse technician will be cut while changing the blade, thereby being exposed to communicable diseases such as AIDS and the various types of hepatitis.
Applicant has found that the necessity to change blades as often as ten to fifteen times per surgery can increase the length of time of the surgery by as much as 15% or more. A typical operating room costs about $1,200.00 per hour to staff and operate. If it were possible to save time during the performance of surgery by devising a scalpel blade that would not have to be changed as often as is currently done, great savings of time and money would result.
Applicant has found that angulation of the blade is helpful when doing certain surgical tasks. For example, it is easier to cut the skin with the blade tilted upward and for certain precise dissection, it is easier when the blade is tilted downward.
Additionally, when human tissue is torn rather than cut, ugly, painful scars result. A blade that would stay sharp for 10-20 minutes would definitely alleviate scarring and subsequent pain to the patient.
Additionally, typical scalpel blades as currently used are extremely thin, typically having a thickness of 0.015 to 0.018 inches with a large oval fixation hole in the tang of the blade. As a result, it is quite common for the scalpel blade tip to break off in the depths of the wound at the surgical site. When this occurs, it is often difficult to find and retrieve the blade tip. When a surgery is completed without retrieval of the blade tip, a malpractice law suit will often result because the unretrieved blade is easily visible in an X-ray image. Thus, also, a need has developed for a scalpel blade that has reduced brittleness and is less likely to break off in use.
It is with these needs in mind that the present invention was developed.
The present invention relates to a scalpel with double grind blade edge and detachable handle. The present invention includes the following interrelated objects, aspects and features:
(1) In a first embodiment, the present invention contemplates a scalpel having a blade with a fitting molded about the proximal end thereof. The fitting has a proximally facing opening that is sized and configured to receive an end of a distal portion of a detachable handle.
(2) In the first and second embodiments, the handle includes a proximal portion that is designed to be gripped by the surgeon and a distal portion that comprises a male coupling half designed to be received within the proximal opening of the fitting, which proximal opening comprises a female coupling half.
(3) In the first and second embodiments, the proximal and distal portions of the handle are preferably angled with respect to one another with the proximal portion of the handle being angled from about 0xc2x0-10xc2x0 with respect to the axis of the distal portion of the handle. Additionally, the proximal portion of the handle is tapered from a thinner portion adjacent a distal end thereof to a thicker portion adjacent a proximal end thereof. The taper in the distal to proximal direction may be in the range of approximately 1xc2x0-2xc2x0. The male coupling half at the distal portion of the handle may be inserted within the female coupling half at the proximal end of the blade fitting in either one of two diametrically opposed orientations. Thus, due to the angulation between the proximal portion of the handle and the distal portion of the handle, the proximal portion of the handle is either angled downwardly or upwardly with respect to the axis of the blade itself. Thus, the handle may be attached to the blade in either one of these two positions depending upon the particular surgical step that is being carried out by the surgeon.
(4) In the first and second embodiments, the blade itself is provided with a double grind which enhances the sharpness and longetivity of the blade. In the preferred embodiment, the blade includes a primary grind defining an angle of 6xc2x0-10xc2x0 per side and a secondary and final grind of 14xc2x0-18xc2x0 per side. Thus, as should be understood, the absolute edge of the blade is defined by two angled surfaces defining the final grind of the blade which creates an angle from the edge of the blade backward of 28xc2x0-36xc2x0.
(5) In a further aspect, in the embodiments of the present invention, the blade itself is made of a thickness of from 0.020-0.029 inches as compared to commonly used scalpel blades which, as explained above, have a thickness of about 0.015-0.018 inches. Additionally, if desired, the cutting surface of the scalpel blade may be coated with a very thin layer of, for example, zirconium nitride by any suitable process such as, for example, vapor deposition. This coating increases the longetivity of the sharpness of the scalpel blade by up to ten times. Other alternative coatings and methods of coating are disclosed herein.
(6) In the second embodiment, instead of molding the fitting about the blade, the fitting is mechanically connected to the blade and may be removed therefrom for sterilization. In the second embodiment, a spring clip is interposed between the proximal end of the blade and the fitting and the blade may be attached to the fitting via the spring clip in either one of two opposed orientations.
(7) Applicant has found that applying a thin coating of body compatible intermetallic nitrides, oxides or carbides to the blade""s surface markedly adds to the sharpness and longevity of the blade. Examples of such metal elements are: Titanium, Zirconium, Niobium, Hafnium and Tantalum. Additionally, adding the coatings of body compatible intermetallic phosphides to the blade surface creates a lubricious condition allowing the blade to cut more smoothly through tissues. Examples of such metal elements are: phosphides of Titanium, Zirconium, Niobium, Hafnium, Tantalum and Magnesium (Mg).
Accordingly, it is a first object of the present invention to provide a scalpel with double grind blade edge and detachable handle.
It is a further object of the present invention to provide such a device wherein a handle is receivable in a proximal fitting attached to the scalpel blade in either one of two opposed orientations.
It is a still further object of the present invention to provide such a scalpel with a blade edge defined by a double grind to enhance longetivity of sharpness.
It is a yet further object of the present invention to provide such a scalpel blade of a thickness in the range of 0.020-0.029 inches to enhance strength and significantly reduce the incidence of blade breakage.
It is a still further object of the present invention to provide such a scalpel with a proximal fitting molded about the proximal end of the blade, in one embodiment thereof.
It is a still further object of the present invention to provide such a scalpel with a proximal fitting mechanically connectable to the proximal end of the blade, in a second embodiment thereof.
These and other objects, aspects and features of the present invention will be better understood from the following detailed description of the preferred embodiment when read in conjunction with the appended drawing figures.

Scalpel with a double grind blade edge and detachable handle


This process comprises using unconventional processing of hydrocarbons, e.g. natural gas, for recovering C2+ and NGL hydrocarbons that meet pipeline specifications, without the core high capital cost requirement of a demethanizer column, which is central to and required by almost 100% of the world's current NGL recovery technologies. It can operate in Ethane Extraction or Ethane Rejection modes. The process uses only heat exchangers, compression and simple separation vessels to achieve specification ready NGL. The process utilizes cooling the natural gas, expansion cooling, separating the gas and liquid streams, recycling the cooled streams to exchange heat and recycling selective composition bearing streams to achieve selective extraction of hydrocarbons, in this instance being NGLs. The compactness and utility of this process makes it feasible in offshore applications as well as to implementation to retrofit/revamp or unload existing NGL facilities. Many disparate processes and derivatives are anticipated for its use.

The present invention is in the technical field of recovery of less volatile than methane or C1 component recoveries from gas/fluid mixtures in Oil/Gas or Petrochemical operations.
More particularly, in addition the present invention is in the technical field of and applicable to various oil/gas production arenas.
Prior art utilizes complex equipment arrangements and operations for condensate recoveries and generally do not utilize our methods for enhancing upstream operations.

Process for separating and recovering NGLs from hydrocarbon streams


A scheme to identify the uplink border between two neighboring cells (10, 20) in an LTE-based heterogeneous network, especially one Macro cell (10) and another Small Cell (20). A trigger event is configured for a connected mode UE (1) such that the UE is triggered to send the measurement report about the neighboring cell (20) when the condition “neighbor is offset better than Pcell on UL” is fulfilled. Such a measurement report can be used by the current serving eNB (11) to decide whether one or more neighboring cells (20) should be activated or handed-over to, and/or whether certain information should be sent to one or more neighboring eNBs (21) so that they can start monitoring the uplink connection quality of the UE. In particular it is possible to offload at least part of the UE's uplink traffic from the serving cell (10) to a neighbor cell (20).

Cellular wireless networks are widely known in which base stations (BSs) communicate with terminals (also called user equipments (UEs), or subscriber or mobile stations) within range of the BSs.
The geographical areas covered by base stations are generally referred to as cells, and typically many BSs are provided in appropriate locations so as to form a network or system covering a wide geographical area more or less seamlessly with adjacent and/or overlapping cells. (In this specification, the terms "system" and "network" are used synonymously except where the context requires otherwise). In each cell, the available bandwidth is divided into individual resource allocations for the user equipments which it serves. The terminals are generally mobile and therefore may move among the cells, prompting a need for handovers between the base stations of adjacent and/or overlapping cells.
Handover in wireless systems is conventionally based on downlink (DL) signal quality: when the DL signal quality as measured by the mobile terminal using reference signals transmitted by the base stations drops below a certain threshold, the terminal is handed over to one of the suitable neighbours. Normally, such a handover is effective both for the downlink and the uplink.
One type of cellular wireless communication network is based upon the set of standards referred to as Long-Term Evolution (LTE). In LTE, the measurement most commonly used for handover is the Reference Signal Received Quality (RSRQ), which is an indicator of the wanted signal quality which takes into account the interference levels, or the Reference Signal Received Power (RSRP). The terminal (referred to as a UE in LTE) then uses channel reciprocity to estimate the required power settings for the uplink (UL), by knowing the transmission power of the DL reference signals (which is broadcast by the base station, referred to in LTE as the eNB) and their received power (which the UE measures).
As the UE moves out of the coverage area of its current serving cell, after the RSRQ or RSRP with respect to a neighbour cell exceeds, by a sufficient margin called the "offset", the RSRQ/RSRP with respect to the serving cell, the terminal transmits this information to the base station of the serving cell, and in one form of handover the serving base station or a higher-level node determines that a handover is required to another "destination" base station. However, various forms of handover are possible in wireless communication networks; for example, the handover decision may be taken by the "destination" base station or even at the terminal.
As an embodiment of the present invention will be described later with respect to LTE, it may be worth briefly outlining some relevant aspects of LTE network topology.
The network topology in LTE is illustrated in FIG. 1. As can be seen, each UE 1 connects over a wireless link via a Uu interface to an enhanced node-B or eNB 11. It should be noted that various types of eNB are possible having differing transmit powers and therefore providing coverage areas (cells) of differing sizes. Multiple eNBs deployed in a given geographical area constitute a wireless network called the E-UTRAN (and henceforth generally referred to simply as "the network").
Each eNB 11 in turn is connected by a (usually) wired link using an interface called S1 to higher-level or "core network" entities 101, including a Serving Gateway (S-GW), and a Mobility Management Entity (MME) for managing the system and sending control signalling to other nodes, particularly eNBs, in the network. In addition (not shown), a Packet Data Network (PDN) Gateway (P-GW) is present, separately or combined with the S-GW, to exchange data packets with any packet data network including the Internet. Thus, communication is possible between the LTE network and other networks, including other cellular wireless communication networks. It should be noted that in the same geographical area, distinct E-UTRANs (or radio access networks—RANs) may exist using the same, or different, radio access technology (RAT). These networks may be under control of the same operator, or may be coordinated in another way. Thus, inter-RAN and inter-RAT handovers are also possible.
Radio resource management (RRM) is an important aspect in wireless communication networks in order to ensure the efficient use of the available radio resources and to provide mechanisms that enable network to meet radio resource related requirements. In particular, RRM in E-UTRAN provides means to manage (e.g. assign, re-assign and release) radio resources taking into account single and multi-cell aspects. Measurements play a critical role in RRM, especially for mobility and scheduling. Generally network control and configure UEs' measurement and measurement reporting functions. In LTE, the two basic UE measurement quantities are the above mentioned Reference symbol received power (RSRP) and the Reference symbol received quality (RSRQ).
Measurements to be performed by a UE for intra/inter-frequency mobility can be controlled by E-UTRAN, using broadcast or dedicated control. In idle mode, the cell reselection algorithms are controlled by setting of parameters (thresholds and hysteresis values) that define the best cell and/or determine when the UE should select a new cell. Also, E-UTRAN broadcasts parameters that configure the UE measurement and reporting procedures. In connected mode, the mobility of radio connections has to be supported. Handover decisions may be based on UE and eNB measurements. In addition, handover decisions may take other inputs, such as neighbour cell load, traffic distribution, transport and hardware resources and operator defined policies into account.
The following 3GPP standards documents contain useful background and are hereby incorporated by reference:
TS36.300 Evolved Universal Terrestrial Radio Access (E-UTRA) and Evolved Universal Terrestrial Radio Access Network (E-UTRAN); Overall description; Stage 2;
TS36.331 Evolved Universal Terrestrial Radio Access (E-UTRA); Radio Resource Control (RRC); Protocol specification;
TS36.413 Evolved Universal Terrestrial Radio Access Network (E-UTRAN); S1 Application Protocol (S1AP); and
TS 36.423 Evolved Universal Terrestrial Radio Access Network (E-UTRAN); X2 Application Protocol (X2AP).
FIG. 1 shows what is sometimes called a "homogeneous network"; that is, a network of base stations in a planned layout and which have similar transmit power levels, antenna patterns, receiver noise floors and similar backhaul connectivity to the core network. Current wireless cellular networks are typically deployed as homogeneous networks using a macro-centric planned process. The locations of the base stations are carefully decided by network planning, and the base station settings are properly configured to maximise the coverage and control the interference between base stations. However, it is widely assumed that future cellular wireless networks will adopt the structure of the so-called "heterogeneous network", composed of two or more different kinds of cell.
FIG. 2 depicts a simple heterogeneous network. The large ellipse 10 represents the coverage area or footprint of a Macro cell provided by a base station (Macro BS) 11. The smaller ellipses 20, 22 and 24 represent Micro cells within the coverage area of Macro cell 10, each having a respective base station (Micro BS), one such base station being shown at 21. Here, the Macro cell is a cell providing basic "underlay" coverage in the network of a certain area, and the Micro cells are overlaid over the Macro cell using separate frequency spectrums for capacity boosting purposes particularly within so-called "hot spot zones". A UE 1 is able to communicate both with Macro BS 11 and Micro BS 21 as indicated by the arrows in the Figure. Thus, for example, the same UE may use both the Macro cell as its "primary" cell (Pcell) and a Micro cell as a "secondary" cell. When a UE starts to use a given cell for its communication, that cell is said to be "activated" for that UE, whether or not the cell is already in use by any other UEs.
The Radio Access Technology (RAT) adopted by the base stations could be any kind, for example, 3G or 4G. Here we assume that a 4G RAT such as 3GPP Long-Term Evolution (LTE) is adopted by each of the cells in the network and use this as an example to illustrate the proposed method. Although only two types of cell, Macro or Micro, are shown in FIG. 2, various levels of cell are under consideration for 4G including so-called Femto and Pico cells. Femto and Pico cells can be overlaid on either Macro or Micro cells as explained below. Also, in LTE each Macro eNB generally is sectorized into N (N>=1) partitions, each of which or any subset of which may constitute a cell. A typical example is for the base station to have three sectors, each of which is configured as a cell with frequency reuse factor being 1. Therefore, references to "cell" therefore include "sector" unless where the context demands otherwise.
A more complex heterogeneous network may consist of Femto, Pico, Micro and Macro base stations. Of these, the operator will have control over Pico, Micro and Macro Base stations. Femto base stations are expected to be installed by users, with backhaul provided by broadband Internet, and consequently activation/deactivation thereof is not under control of the network operator. FIG. 3 shows the operator-controlled cells in part of such a heterogeneous network.
The three biggest cells 10, 12 and 14 represent the Macro cells in the network, while the medium sized cells are Micro cells and the smallest cells are Pico cells. Within each Macro cell, Micro cells exemplified by 26 and 28 provide a first level of additional capacity. It should be noted that Micro cell 28 is at least partly within the coverage area of two Macro cells, 10 and 12. Within the Micro cells, in turn, there are Pico cells illustrated by the small circles and exemplified by 30 and 32. Pico cell 30 is an example of a Pico cell which is within the coverage area of a Micro cell 26, as well as within the coverage area of Macro cell 10. Pico cell 32 is an example of a Pico cell which is within the coverage area of a Macro cell only.
The network is designed such that the Macro cells provide blanket coverage while the smaller Micro and Pico cells are providing additional capacity.
Thus, in addition to the Macro cell to Micro cell relationship shown in FIG. 2, where the Micro cells provide additional capacity to the basic coverage provided by the Macro cells, it is possible to define a Pico cell to Micro cell relationship, where the Pico cells provide additional capacity to that of the Micro cells which are already serving as capacity boosters, as well as a Pico cell to Macro cell relationship, where the Pico cells provide additional capacity to the basic coverage provided by the Macro cells. The above mentioned Femto cells may provide a further layer of coverage. For present purposes, all of the Micro, Pico and/or Femto cells as may be present in a heterogeneous network can be regarded as "Small Cells".
The principal scenario of interest in this invention is an LTE heterogeneous network (HetNet) where UEs operate within the coverage of at least two cells: a Macro Cell and a Small Cell (low power node, e.g. a Pico Cell, a relay or a Femto cell). The Small Cell eNodeB (SCeNB) and the Macro Cell eNodeB (MeNB) are able to exchange information over the X2 interface or S1 interface, through which several procedures/functions can be executed/coordinated between the MeNB(s) and SCeNBs. For example, UEs can be handed over between the neighbouring MeNB(s) and SCeNB(s); or inter-site/eNB carrier aggregation or co-operative multipoint transmission (COMP) can be operated among the neighbouring MeNB(s) and SCeNB(s); or dual connectivity of the UEs can be maintained where UEs have multiple connections with the MeNB(s) and SCeNBs.

Cell handover and activation in heterogeneous networks


The present invention relates to nucleic acid molecules and in particular to vectors, comprising at least one gene of interest, at least one scaffold/matrix attached region (S/MAR), at least one origin of replication, and at least one replication initiation factor, cells comprising these, processes for their propagation, and their use, in particular for the high level expression of proteins which can be used as medicaments.

1. Field of the Invention
The present invention relates to compositions and methods for high level expression of polypeptides. The invention provides nucleic acid molecules, expression systems, host cells, methods and kits that are useful for the production of polypeptides and/or untranslated RNA molecules. Due to the improved expression levels of polypeptides or untranslated RNA molecules the invention is particularly useful for the rapid production of large quantities of recombinant proteins such as monoclonal antibodies which can be used as drugs.
2. Related Art
Process development for biopharmaceuticals, and hereby in particular the expression of polypetides used in these biopharmaceuticals, is governed by the economy of the manufacturing process. The classical approach for the production of recombinant polypetides is the use of stable expression systems. These systems are based on chromosomal integration of an expression plasmid into the genome of the host cell. The sites of gene integration, however, are random, and the number and ratio of genes integrating at any particular site are unpredictable. As a result, it is normally necessary to screen many clonal cell populations to obtain a cell line in which the desired genes are expressed at an appropriate level. This procedure of transfection, selection and analysis of numerous clonally derived cell lines expressing the multiple genes is costly and time-consuming.
An alternative to stable expression systems for gene expression are transient expression systems. The expression of the latter systems is based on non-integrated plasmids, and hence the expression is typically rapidly lost as the cell undergoes division. Thus, transient expression systems typically do not lead to sufficient expression over time implying that repeated processes would be necessary which might be not desirable.
Another way of performing expression is by transfection of an episomal vector which replicates extra-chromosomally in a host cell such as in a mammalian host cell. Episomal replicating vectors provide certain advantages over classical expression systems since they do not integrate into the host genome, but replicate episomally in a host cell. Most of the described episomally replicating vectors are based on viral components from viruses like Papovaviridae (e.g. SV40, BPV) or Herpesviridae (e.g. EBV). Episomal replicating vectors derived from these viruses generally contain a replication origin and at least one viral trans-acting factor, e.g., an initiator protein. Examples of such initiator proteins are large T-antigen for SV40, E1/E2 for BPV, and EBNA-1 for EBV. The process of episomal replication typically involves both host cell replication machinery and virus trans-acting factors.
To increase expression, retrovirus vectors stably integrated in transduced resting cells have been described using a chromosomal scaffold/matrix attached regions (S/MAR) element derived from human INF-beta gene (U.S. Pat. No. 6,194,212 B1). It has further been shown for stably integrated retrovirus vectors that human INF-beta SAR inhibits de novo methylation, alleviates methylation-mediated transcriptional repression and allows for higher level gene expression (Dang et al., (2000) J Virol 74, 2671-2678). Episomal vectors having a S/MAR element were described for delivery in gene therapy. However, to avoid any type of cell transformation induced by viral trans-acting factors, the viral trans-acting factor was replaced by S/MAR (U.S. Pat. No. 6,410,314 B1; Piechaczek et al., NAR, 1999, Vol 27, No. 2; Bode et al., 2001 Gene Ther Mol Biol, Vol. 6, 33-46).
However, the enhancing effect of S/MAR on promoter functions and gene expression has been reported to be restricted to the integrated state of transfected templates. Thus, in transient expression systems for the expression of proteins, and therefore in expression systems based on plasmids which are not integrated in the genome of the host cell, the effect of S/MAR on the expression levels of proteins has been reported to have an antagonizing effect (Klehr et al., (1991) Biochemistry, 30(5):1264-70; Poljak et al., (1994) Nucleic Acid Res., 22(21):4386-94; Wu et al., (2001) Sheng, 33(1):59-64).
A need remains in the art for compositions and methods other than stable expression systems that allow rapid production of large quantities of polypeptides and untranslated RNA molecules, and in particular for compositions and methods that allow increased expression levels of a desired protein compared to compositions and methods known in the art.


A method and apparatus for coupling data between discrete processor-based emulation chips is described. The apparatus is a processor-based hardware emulation integrated circuits (chips) element comprising a plurality of discrete hardware emulation chips, each emulation chip coupled to another emulation chip by a crossbar for coupling data between the plurality of chips. The method comprises providing data to a crossbar from a first discrete emulation chip, selecting the data from the crossbar using a discrete second emulation chip, and storing the data in a data array in the second discrete emulation chip.

1. Field of the Invention
Embodiments of the present invention generally relate to processor-based emulation integrated circuits, and more particularly, to a method and apparatus for coupling data between processor-based emulation integrated circuits.
2. Description of the Related Art
Hardware emulators are programmable devices used in the verification of hardware designs. A common method of hardware design verification uses processor-based hardware emulators to emulate the design. These processor-based emulators sequentially evaluate combinatorial logic levels, starting at the inputs and proceeding to the outputs. Each pass through the entire set of logic levels is known as a cycle; the evaluation of each individual logic level is known as an emulation step.
An exemplary hardware emulator is described in commonly assigned U.S. Pat. No. 6,618,698 titled "Clustered Processors In An Emulation Engine", which is hereby incorporated by reference in its entirety. Hardware emulators allow engineers and hardware designers to test and verify the operation of an integrated circuit, an entire board of integrated circuits, or an entire system without having to first physically fabricate the hardware.
A hardware emulator generally comprises a computer workstation for providing emulation support facilities, i.e., emulation software, a compiler, and a graphical user interface to allow a person to program the emulator, and an emulation engine for performing the emulation. The emulation engine is comprised of at least one emulation board, and each emulation board contains individual emulation circuits. Each individual emulation circuit contains multiple emulation processors, and each emulation processor is capable of mimicking a logic gate. Thus, the hierarchy of the emulation engine is an emulation board, multiple emulation integrated circuits, and multiple processors that are part of each emulation integrated circuit.
Processors within an emulation integrated circuit (also referred to herein as emulation chips) are connected to each other via a shared memory known as a data array. These interconnected processors are sometimes referred to as a cluster of processors. Each processor within the cluster can access the output of any other processor, and can also access any output that is available in the data array.
Emulation chips, typically integrated circuits, on an emulation board are capable of communicating with each other via signal wires between each chip. Emulation chips can only communicate with other emulation chips, and can only receive data currently transmitted from another emulation chip, i.e., the emulation chip receiving the data does not have full access to all of the data within the emulation chip transmitting the data. Thus, communication between emulation chips is not as efficient as communication between processors within an emulation chip because extra emulation steps, i.e., requesting data from another chip, the other chip fetching the requested data, transmitting the requested data to the chip that requested the data, and finally processing the requested data, are required
Emulation boards are only capable of communicating with another emulation board via a cable connector. Communication between emulation boards is less efficient than communication between emulation chips. The cable connector typically connects two emulation chips, one emulation chip on each emulation board that is joined by the cable connector. Sharing data between emulation boards requires routing the data to be shared from an emulation chip to the emulation chip connected to the cable connector. The cable connector then provides the data to the emulation chip on the other board that is also connected to the cable connector. The emulation chip on the other board can then share the data with the other emulation chips on that emulation board. The process of sharing data between emulation boards requires coordination between both emulation boards, and also between emulation chips. The entire process of sharing data between emulation boards generally requires more emulation steps than is required to share data between emulation chips and hence is less efficient than communication between emulation chips.
The computation efficiency of the emulation engine may be increased by increasing the number of processors within an emulation chips. As the number of processors within the emulation chip increases, the size and the cost of the emulation chip increases. Larger emulation chips that contain more processors are more expensive to manufacture than smaller emulation chips because they are produced at a lower yield. Very often, the resulting increase in performance that accompanies a larger emulation chip, i.e., an emulation chip containing more processors, is cost-prohibitive.
Thus, there is a need in the art for an emulation chip that contains an increased number of processors that is not cost-prohibitive.

Method and apparatus for coupling data between discrete processor based emulation integrated chips


An electric motor speed controller for use in a bicycle includes a motor to provide a propulsion force to move the bicycle. The actual motor speed and a target motor speed are compared, and if the actual motor speed is lower, more current is supplied to the motor, and if the actual motor speed is higher, less current is supplied to the motor.

The present invention relates to an electric motor speed controller for vehicles, and more particularly, to an electric bicycle.
Currently, makers of electric vehicles are commonly using programmable microcontroller solution for controlling the vehicle speed One of these solutions is found in U.S. Pat. No. 6,727,668 B1, the block diagram of which is shown in FIG. 1.
The controlling algorithm is pre-programmed in programmable microcontroller 144, where one of the external inputs is the user's throttle command. Multiphase motor 110 is formed by a rotor 120 and stator 130. DC source 140 drives different phases of the motor via switch sets 142, which are controlled by the controller 144 via gate drivers 146. Current conditions of different phases are feedback to controller 144 by current sensor 148, while position and speed information is feedback via position sensor 146 and speed approximator 150 respectively. According to these feedback signals, controller 144 adjusts switch sets 142 to achieve the reference, the user input.
However, due to the use of programmable microcontrollers, this solution is costly. The present invention overcomes this drawback by using simple logic gates and counters to implement the motor speed controller. It can be integrated easily into silicon and hence provide a lower cost system solution where no programmable microcontroller is required.

Electric motor speed controller for vehicle

Matsushita Electric Industrial Co., Ltd.


A lubrication system for a vehicle (100) is provided with a blade element (1) movable between a first position (2) and a second position (3); the lubrication system comprises a pump (4) connected to a reservoir of lubricant and an actuation element or striker (6) acting on the pump (4), the actuation element (6) being activated in response to the blade element (1) when displaced between the first (2) and the second (3) position.

The present disclosure relates generally to industrial machines, such as tipped articulated trucks, which may be designed to carry heavy loads in a carriage located at the rear of the vehicle. These articulated trucks may be operated substantially in road construction, mining fields, or in any other environment where it is necessary to move material from one location to another. Performance increases may be achieved when a moving element, for instance an ejector blade, is used in the unloading process to better control removal of the material from the carriage.
These machines have to be extremely reliable in operation, since a disorder would hinder the workflow significantly. When these machines are operated in locations where a service for the vehicle is either not present or remotely located, it can take a significant amount of time before they can be repaired or replaced.
However, these industrial machines may be subject to extensive wear and tear, due to the large loads they may carry and move in the carriage and to the unfavorable environment conditions, since construction or building sites are dirty environments where dust and dirt can quickly intrude in all connected moving parts, such as sliders, joints and hinges. Impurities intruded in a hinge, roller or piston can significantly interrupt the operation of the machine because of the increased friction between the elements. To remove the impurities the parts may need to be disassembled, which makes the machine inoperative for a certain time, a fact that can have significant impact, for example, on a road construction project.
Therefore, many parts may need to be greased regularly to ensure proper operation of the machine and avoid that certain moving elements become stuck or subjected to excessive friction. Conventional greasing systems, comprising a pump and a network of fixed lines distributing the lubricant to fixed lubrication points and usually operated electrically by the machine operator, are well known in the state of the art. Such known greasing systems supply lubricants to stationary points on the vehicle, such as the hinges connecting the ejection carriage to the chassis of an industrial machine. When an articulated truck with a movable blade element is involved, the moving parts of the blade element must typically be lubricated very frequently, for the blade element to operate properly. The lubrication process is carried out by the operator of the machine, who manually provides the lubricants to the moving parts. To do so, the operator must stop the machine, climb on the chassis to reach the blade element and its respective lubrication points and then apply the lubricant. Such activity interrupts the workflow significantly.
An alternative known way of providing a lubricant to the moving parts of a movable blade element consists in using an electrically operated pump applying lubricant to the lubrication points via a network of hoses, the electric pump being fixed at a fixed point of the machine and the lubrication lines lying between fixed and mobile parts of the vehicle.
It is an aim of the current disclosure to overcome or alleviate some or all of the problems associated with the prior art.

Lubrication system and method for vehicles provided with blade element


A method of preparing biocompatible and stable gold nanoparticles comprises preparing at least one flavonoid-rich plant extract, and mixing at least one of the plant extracts with an aqueous solution of at least one gold salt. The flavonoid-rich plant extract is an extract of Hubertia ambavilla or Hypericum lanceolatum. The gold nanoparticles may be used for medical and/or cosmetic purposes.

Nanoparticles are being increasingly used in medicine and cosmetics. They may or may not be metallic in nature and their size does not exceed a few hundreds of nanometers. The nature of the nanoparticles provides the latter specific properties.
Gold nanoparticles are highly interesting in nanomedicine. These offer the advantage of having a unique surface plasmon resonance, which makes them particularly interesting in medicine (diagnosis, therapy and research, etc.). Furthermore, they do not oxidize and are inert and biocompatible. Gold nanoparticles can also be coupled with biological molecules such as antibodies, peptides or others, or even inorganic molecules.
Conventionally, metallic nanoparticles were synthesized by chemical processes, the reagents or reaction products of which could be toxic. The reducing agent generally used was citrate (Turkevich, 1951). These processes required washings of the nanoparticles in order to attempt to eliminate toxic agents. These nanoparticles, owing to their method of synthesis, could cause stability, reactivity and biocompatibility problems or even render them unfit for conjugation with biomolecules, with the synthesis reagents resulting in inactivation of the biomolecule.
It has been necessary to develop new methods of synthesis that are more environment-friendly and improve the biocompatibility, stability and reactivity of the gold nanoparticles.
Environment-friendly methods are thus known from the state of the art that use plant extracts to reduce the gold salts.
Patent application WO 2005/095031 describes a method for synthesizing mono- and bimetallic nanoparticles of different shapes and sizes via reaction of metallic salts with reducing extracts of different plant parts at a temperature between 15° C. and 100° C. The plants in this patent application are, for example, varieties of cinnamon, lemon, jasmine, chamomile and rose, etc.
U.S. Pat. No. 8,333,994 describes biocompatible gold nanoparticles stabilized with polyphenol-rich or flavonoid-rich plant extracts or phytochemical reactive compounds. The method is environment-friendly. In this patent, an aqueous solution containing gold salts is mixed with polyphenol-rich or flavonoid-rich plant extracts. The solution of gold salts is mixed, for example, with black tea, turmeric or cinnamon.
Methods requiring chemical products have the disadvantage of not being environment-friendly and the gold nanoparticles obtained may pose problems of stability, reactivity, toxicity or biocompatibility, particularly during their subsequent injections into the body owing to dissociation of the (toxic) molecules stabilizing them in solution. These molecules may subsequently be responsible for the side effects observed.
The methods of the state of the art using plant extracts mainly lead to generation of spherical gold particles that are unstable in aqueous solution. It is known that the shape of the nanoparticles directly affects the ability of the nanoparticles to reach the microenvironment of the tumors and, therefore, efficacy of the treatment (Stylianopoulos et al.). The size and shape of the nanoparticles are influenced by the antioxidant composition of the plant extracts. Three factors determine the size and shape of the nanoparticles: the reducing power of the polyphenols, their concentration in the extract and the nature or concentration of the stabilizing agents (Elia et al., 2014). Very often, ecological extraction methods lead to an accumulation of polyphenolic agents of different types (phenolic acids, catechin, epicatechin, anthocyanin flavonoids, tannins, etc.), which do not allow long-term stabilization of the nanoparticles in solution (Krishnaswamy et al., 2014).
In order to increase the efficacy of these nanoparticles, both from the point of view of their ability to reach the target cells and of improving their efficacy, it is essential to find environment-friendly methods that make it possible to obtain monodispersed, stable gold nanoparticles more efficient in generating hyperthermia, which are biocompatible and of a shape that is controlled and uniform.

Gold nanoparticles and ecological method of production


A universal air bubble detector allows for use with a variety of sizes and types of tubing. The detector maintains proper alignment of a sensor emitter and receiver with different sizes of tubing. The detector may be mounted on existing equipment or may be used to monitor a tubing at any position along the tubing, and may operate in a stand alone mode or in combination with existing equipment.

1. Field of the Invention
The present invention relates to air bubble detectors. More specifically, the present invention relates to a universal air bubble detector which is usable with a variety of different tubing sizes and usable in a variety of different applications.
2. State of the Art
Air bubble detectors are used in many situations where it is desirable to detect the presence of an air bubble, particularly in a tube carrying a liquid. In many applications, such as the medical and health care industries, tubing is used to deliver various fluids to a person, and it is often important to detect air bubbles before they are accidentally delivered to the patient. In industry, they can be used to ensure that liquids do not have excessive amounts of air to ensure proper volume flows or reactions.
Some equipment, such as peristaltic pumps, is now available with air bubble detectors. These detectors, however, monitor air bubbles at the pump and can not check for air bubbles downstream from the pump, as may be introduced through fittings, connectors, or other equipment. It is often desirable to monitor for air bubbles downstream from the equipment and as close to the patient as possible to monitor for the introduction of air from all possible sources. There is thus a need for an air bubble detector which is capable of monitoring for air bubbles very near the point of injection of the solution into the patient, such as by attaching it to a delivery tubing near the patient, or at any desired location.
Additionally, many devices are not yet available with air bubble detectors. It is often prohibitively expensive to replace equipment, or to redesign equipment to include an air bubble detector. Thus, the cost of replacing equipment or designing and manufacturing an air bubble detector may prevent the use of the same in situations where it is otherwise desirable to have the detector. There is, therefore, a need for an air bubble detector which may be attached to or used in combination with existing devices without requiring replacement or extensive modification of the device.
There are also many situations where a small number of air bubble detectors are desired, whether for a device which is produced in a limited quantity or for a project or procedure which is infrequently performed, etc. In such a situation, current air bubble detector technologies impede the use of an air bubble detector, as the detectors are typically custom manufactured for a particular application. It is appreciated that it is typically too expensive to design, create molds and tooling, and manufacture an air bubble detector where only limited quantity is desired. There is thus a need for an air bubble detector which may be used in a variety of situations, accommodating a variety of different sizes of tubing, etc.
Many available air bubble detectors function by passing a signal through the tubing and fluid and receiving the signal. The received signal is evaluated to determine if an air bubble is present. These detectors are designed to function with a particular type and size of tubing so as to achieve good signal transmission and reception. It is appreciated that if a tubing of a different diameter or type is used, the signal pathway is often interrupted, or the signal does not pass properly through the tube. Thus, a universal air bubble detector should ensure proper signal transmission and reception (signal coupling) with a variety of tubing diameters and types. Poor signal coupling typically results in errors and unreliable operation of the device.
There is thus a need for a universal air bubble detector which may be used in many different situations by allowing for mounting in a variety of locations such as at a piece of equipment or very near to a patient. Such a universal air bubble detector should accommodate a variety of different tubing diameters while maintaining good signal transmission through the tubing. Such an air bubble detector should have stand alone control circuitry and alarms or be able to connect to and communicate with associated equipment such as a delivery pump, or both.


A multichannel weak magnetic field measuring system for neuromagnetic diagnosis is provided having a plurality of dc-SQUID magnetometers. Bias current setting circuits are provided for detecting an even harmonic component of the output across the terminals of the corresponding SQUID and automatically adjusting a DC bias current to the SQUID. Accordingly, the level of the component becomes a predetermined value. Circuitry is also included for equalizing the magnetic flux detection sensitivities of these dc-SQUID magnetometers. Abnormal operation detecting circuits are also provided for producing abnormal operation detected outputs when the level of the corresponding even harmonic component is smaller than a certain threshold value.

This invention relates to a weak magnetic field measuring system having dc-biased SQUIDs (Superconducting Quantum Interference Devices), and particularly to a system for biomagnetic diagnosis.
The SQUID (Superconducting Quantum Interference Device) is a high-sensitivity magnetometer making use of the superconducting Josephson effect. Particularly, the dc-SQUID is widely used because of its low noise. Its structure and operation are disclosed in, for example, Journal of Low Temperature Physics, Vol. 25, Nos. 1/2, pp 99, 1976.
On the other hand, a system has been published for simultaneously measuring a magnetic field at a plurality of measurement points by providing many SQUID magnetometers, as in, for example, "31-Channel DC SQUID Gradiometer Array for Biomagnetic Diagnosis" (Abstracts of 1989 International Superconductivity Electronics Conference SS-1 (1989)).
In addition, a method for signal source estimation by use of measured data from multi-channel magnetic field measuring system is presented in "Measurement of Somatosensory Evoked Magnetic Fields Induced by Electrical Stimulation", the Journal Magnetics Society of Japan, Vol. 13, No. 3, 1989, pp 508 .about.512. According to this paper, the positions, strengths and directions of the current dipoles assumed within the head are determined to provide the minimum sum of square differences between the theoretical magnetic field distribution established on the surface of the head by the current dipoles and the experimental magnetic field distribution.

Weak magnetic field measuring system using dc-SQUID magnetometer with bias current adjustment and/or detecting function of abnormal operation

Director-General of the Agency of Industrial Science and Technology


A process for inducing pre-tilt in alignment of a liquid crystal medium comprising exposing at least one optical alignment layer, comprising anisotropically absorbing molecules and hydrophobic moieties, to polarized light; the polarized light having a wavelength within the absorption band of said anisotropically absorbing molecules; wherein the exposed anisotropically absorbing molecules induce alignment of the liquid crystal medium at an angle + and -.theta. with respect to the direction of the polarization of the incident light beam and along the surface of the optical alignment layer, and induce a pre-tilt at an angle .PHI. with respect to the surface of the optical alignment layer and applying a liquid crystal medium to said optical alignment layer, is described. The invention also is directed to liquid crystal display elements made by the process of the invention and to novel polyimide compositions that are useful as optical alignment layers in the invention.

The present invention relates to processes for inducing pre-tilt in alignment of a liquid crystal medium, compositions useful in these processes, and liquid crystal display elements.
Liquid crystal compounds are used in human and machine readable displays, finding applications in instrument controls, such as those in motor vehicles, avionics, medical devices, process control devices and watches. Display devices are primarily comprised of liquid crystal cells having a glass or other substrate coated with a transparent conductive material in front and behind a liquid crystal medium. Light transmission through these devices is controled through orientation of the liquid crystal compounds or dyes dissolved therein. In this way, a voltage or, in some instances, a magnetic field may be applied to the cell so that the liquid crystals are oriented in a fashion such that all, some or none of the light is passed through. In addition, depending on the device geometry, polarizers may be used in conjunction with the liquid crystal medium to control light transmission.
Aligned liquid crystal cells in commerical use are typically oriented in directions suitable for controlling light transmission. That is, the molecules in the liquid crystal compostion are aligned so as to assume a homogeneous or homeotropic alignment. Without external stimuli the display will either appear opaque or transparent. By applying an electric field the molecules are rotated along a fixed axis so as to alter the transmission properties in a desired fashion.
Current liquid crystal display elements include a product that utilizes a twisted nematic mode, i.e. having a structure wherein the aligning direction of nematic liquid crystal molecules is twisted by 90.degree. between a pair of upper and lower electrode substrates, a product utilizing a supertwisted nematic mode, utilizing a birefringent effect, i.e. having a structure wherein the aligning direction of nematic liquid crystal molecules is twisted by 180.degree. to 300.degree., and a product utilizing a ferroelectric liquid crystal substance or an antiferroelectric liquid crystal substance. Common to each of these products is a liquid crystal layer disposed between a pair of substrates coated with a polymeric alignment layer. The polymeric alignment layer controls the direction of alignment of the liquid crystal medium in the absence of an electric field. Usually the direction of alignment of the liquid crystal medium is established in a mechanical buffing process wherein the polymer layer is buffed with a cloth or other fiberous material. The liquid crystal medium contacting the buffed surface typically aligns parallel to the mechanical buffing direction. Alternatively, an alignment layer comprising anisotropically absorbing molecules can be exposed to polarized light to align a liquid crystal medium as disclosed in U.S. Pat. Nos. 5,032,009 and 4,974,941, both entitled "Process of Aligning and Realigning Liquid Crystal Media," which are hereby incorporated by reference.
The process for aligning liquid crystal media with polarized light is a noncontact method of alignment which can reduce dust and static charge buildup on alignment layers. Other advantages of the optical alignment process include high resolution control of alignment direction and high quality of alignment.
Requirements of optical alignment layers for liquid crystal displays include low energy threshold for alignment, transparency to visible light (no color), good dielectric properties and voltage holding ratios, long-term thermal and optical stability and in many applications a controlled uniform pre-tilt angle. Most liquid crystal devices, including displays, have a finite pre-tilt angle, controlled, for instance, by the mechanical buffing of selected polymeric alignment layers. The liquid crystal molecules in contact with such a layer aligns parallel to the buffing direction, but is not exactly parallel to the substrate. The liquid crystal molecules are slightly tilted from the substrate, for instance by about 2-15 degrees. For optimum performance in most display applications a finite and uniform pre-tilt angle of the liquid crystal is desirable.
The process for aligning liquid crystal media with polarized light has many attractive features. However, up to now, controlling the pre-tilt angle of liquid crystals in contact with optical alignment layers, while maintaining the uniformity of alignment, has been lacking. Furthermore to meet the above stated requirements of transparency the use of anisotropically absorbing molecules that absorb in the visible region are generally not acceptable.

Process and materials for inducing pre-tilt in liquid crystals and liquid crystal displays


Pressure sensitive adhesive compositions containing 92 to 99.9 parts of a block copolymer adhesive composition and 0.1 to less than 8 parts of an acrylic adhesive composition are described. Tapes including such adhesives, and methods of making such tapes are also described.

Adhesives and tapes are commonly used to bond two substrates together to form a bonded composite. While a vast array of adhesives and tapes are available, advances in substrates and end use requirements continues to drive a need for new adhesive formulations and tape constructions. In addition to performance properties, environmental regulations and processing costs also influence product formulation requirements. For example, in some applications it may be desirable to use a hot melt adhesive rather than a solvent-based adhesive.
While some efforts are directed at the identification and development of new materials for use in adhesive formulations, much progress can still be made by identifying, selecting, and combining the proper proportions of existing raw materials to arrive at useful adhesives and tapes.

Blends of block copolymer and acrylic adhesives


A magnetoresistive device comprises: a first shield layer and a second shield layer disposed with a space from each other in the direction of thickness; an MR element disposed between the first and second shield layers; and a layered structure disposed between the first and second shield layers on both sides of the MR element. The layered structure includes an insulating layer and bias field applying layers. The second shield layer has a surface facing toward the first shield layer. This surface includes a first portion touching the top surface of the MR element and second portions located on both sides of the MR element, the sides being opposed to each other in the direction of track width. A difference in level is created between the first and second portions such that the second portions are closer to the first shield layer than the first portion.

1. Field of the Invention
The present invention relates to a magnetoresistive device and a method of manufacturing the same and to a thin-film magnetic head, a head gimbal assembly, a head arm assembly and a magnetic disk drive each of which incorporates the magnetoresistive device.
2. Description of the Related Art
Performance improvements in thin-film magnetic heads have been sought as areal recording density of magnetic disk drives has increased. A widely used type of thin-film magnetic head is a composite thin-film magnetic head that has a structure in which a write (recording) head having an induction-type electromagnetic transducer for writing and a read (reproducing) head having a magnetoresistive (MR) element for reading are stacked on a substrate.
MR elements include: anisotropic magnetoresistive (AMR) elements utilizing an anisotropic magnetoresistive effect; giant magnetoresistive (GMR) elements utilizing a giant magnetoresistive effect; and tunnel magnetoresistive (TMR) elements utilizing a tunnel magnetoresistive effect.
It is required that the characteristics of a read head include high sensitivity and high output capability. GMR heads incorporating spin-valve GMR elements have been mass-produced as read heads that satisfy such requirements. Recently, developments in read heads using TMR elements have been sought to conform to further improvements in areal recording density.
Conventional GMR heads have a structure in which a current used for detecting magnetic signals (that is hereinafter called a sense current) is fed in the direction parallel to a plane of each layer making up the GMR element. Such a structure is called a current-in-plane (CIP) structure. In the GMR head having the CIP structure, the GMR element is insulated from each of top and bottom shield layers by an insulating film. As a result, there arises a problem that, if the space between the top and bottom shield layers (that is hereinafter called a shield gap length) is reduced to enhance the linear recording density of the GMR head having the CIP structure, the above-mentioned insulating film is made thin and it is therefore difficult to maintain the insulation between the GMR element and each of the shield layers.
To solve such a problem, there have been proposed GMR heads having a structure in which a sense current is fed in the direction perpendicular to a plane of each layer making up the GMR element. Such a structure is called a current-perpendicular-to-plane (CPP) structure. It is not necessary to insulate the GMR element from each of the shield layers for the GMR head having the CPP structure. Therefore, the GMR head having the CPP structure is free from the above-mentioned problem. In addition, the GMR head having the CPP structure has an advantage that, when the track width is reduced, it is capable of producing a greater output than the output of the GMR head having the CIP structure. A TMR head incorporating a TMR element has the CPP structure, too.
In the heads having the CPP structure, a pair of electrode layers for feeding a sense current to the MR element are disposed with a space between the electrode layers in the direction of thickness. The MR element is disposed between the pair of electrode layers. The electrode layers may function as shield layers, too. In this case, the space between the electrode layers is the shield gap length. Typically, bias field applying layers for applying a bias magnetic field to the MR element are disposed on both sides of the MR element, the sides being opposed to each other in the direction of track width. The bias magnetic field directs the direction of magnetization in a layer of the MR element to a specific direction when no signal magnetic field is applied to the MR element, wherein the direction of magnetization in the layer changes in response to a signal magnetic field.
There are some prior-art methods of manufacturing the heads having the CPP structure as will now be described.
A first method is the one disclosed as lift-off in the Published Unexamined Japanese Patent Application 2003-203313 and the Published Unexamined Japanese Patent Application 2003-132509. In this method, an MR film to be an MR element is first formed on a lower electrode layer. Next, a mask is formed on the MR film, and the MR film is selectively etched through the use of the mask to form the MR element. Next, while the mask is left unremoved, an insulating layer is formed to cover the MR element, the mask and the lower electrode layer. The mask is then removed. The top surface of the MR element is thereby exposed. Next, an upper electrode layer is formed on the MR element and the insulating layer.
A second method is the one disclosed as a contact hole method in the Published Unexamined Japanese Patent Application 2003-203313 and the Published Unexamined Japanese Patent Application 2003-132509. This method will now be described with reference to FIG. 27. In the method, an MR film is first formed on a lower electrode layer 101. Next, a mask is formed on the MR film, and the MR film is selectively etched through the use of the mask to form an MR element 102. Next, the mask is removed, and then an insulating layer 103 is formed on the MR element 102 and the lower electrode layer 101. Next, a portion of the insulating layer 103 located on the MR element 102 is selectively etched to form a contact hole 103a. The top surface of the MR element 102 is thereby exposed. Next, an upper electrode layer 104 is formed on the MR element 102 and the insulating layer 103.
A third method is disclosed in the Published Unexamined Japanese Patent Application 2003-203313. This method will now be described with reference to FIG. 28. In the method, an MR film is first formed on the lower electrode layer 101. Next, a mask is formed on the MR film, and the MR film is selectively etched through the use of the mask to form the MR element 102. Next, the mask is removed, and then an insulating layer 105 is formed on the MR element 102 and the lower electrode layer 101. Next, ion beam etching or chemical mechanical polishing (hereinafter referred to as CMP) is performed to remove a portion of the insulating layer 105 located higher than the level of the top surface of the MR element 102 indicated by an alternate long and two short dashes line with numeral 106 in FIG. 28. The top surface of the MR element 102 is thereby exposed and the top surfaces of the MR element 102 and the insulating layer 105 are thereby flattened. Next, an upper electrode layer is formed on the MR element 102 and the insulating layer 105.
A fourth method is disclosed in the Published Unexamined Japanese Patent Application 2003-132509. In this method, an MR film is first formed on a lower electrode layer. Next, a mask is formed on the MR film, and the MR film is selectively etched through the use of the mask to form the MR element. Next, while the mask is left unremoved, an insulating layer is formed to cover the MR element, the mask and the lower electrode layer. Next, the insulating layer is polished until the mask is exposed or immediately before the mask is exposed. If the mask is made of an insulating material, the mask is then removed. If the mask is made of a conductive material, the mask may be removed or left unremoved to be used as a protection layer. Next, an upper electrode layer is formed on the insulating layer and the MR element or the mask.
A fifth method is disclosed in the Published Unexamined Japanese Patent Application 2002-123916. This method will now be described with reference to FIG. 29. In the method, first, an MR film and a conductive protection film are formed one by one on the lower electrode layer 101. Next, a mask is formed on the protection film, and the protection film and the MR film are selectively etched through the use of the mask to form the MR element 102. A protection layer 107 made up of the protection film patterned is disposed on the MR element 102. Next, the mask is removed, and then an insulating layer 108 is formed to cover the MR element 102, the protection layer 107 and the lower electrode layer 101. Next, the insulating layer 108 is polished by CMP until the protection layer 107 is exposed. Next, the upper electrode layer 104 is formed on the protection layer 107 and the insulating layer 108.
Each of the above-described first to fifth methods has problems described below. In the first method, as described in the Published Unexamined Japanese Patent Application 2003-203313 and the Published Unexamined Japanese Patent Application 2003-132509, on the top surface of the MR element, burrs made of unwanted accumulations are formed around the region in which the mask was located and/or the insulating layer overlaps the top surface of the MR element. In either of these cases, it is difficult to form the upper electrode layer having a desired shape with precision.
In the second method, as shown in FIG. 27, a portion of the insulating layer 103 around the contact hole 103a protrudes upward above the top surface of the MR element 102. In this case, too, it is difficult to form the upper electrode layer 104 having a desired shape with precision.
The third method has a problem that it is difficult to precisely remove only the portion of the insulating layer 105 located higher than the level of the top surface of the MR element 102. If the insulating layer 105 remains on the top surface of the MR element 102, it is impossible to electrically connect the MR element 102 to the upper electrode layer 104. On the other hand, if a portion of the MR element 102 is cut away, the property of the MR element 102 is changed.
In the fourth method, when the mask on the MR element is removed, a portion of the insulating layer around the MR element protrudes upward above the top surface of the MR element. In this case, it is difficult to form the upper electrode layer having a desired shape with precision. The fourth method has another problem that, if the mask on the MR element is left unremoved, it is difficult to keep the thickness of the remaining mask unchanged, and it is therefore difficult to keep the shield gap length unchanged.
The fifth method has a problem that it is difficult to maintain the thickness of the protection layer 107 remaining after the insulating layer 108 is polished, and it is therefore difficult to keep the shield gap length unchanged.
In any of the second to fifth methods, the insulating layer is disposed around the MR element, and the top surface of the insulating layer and the top surface of the MR element or the protection layer are located at nearly the same level. As a result, in any of the second to fifth methods, the thick insulating layer is once formed on the MR element or the protection layer, too, in the course of manufacturing process of the head, and the insulating layer is removed by etching or CMP. This causes the above-described problems.

Magnetoresistive device and method of manufacturing same, thin-film magnetic head, head gimbal assembly, head arm assembly and magnetic disk drive


A long-range wireless phasing voltmeter having a high impedance AC voltmeter in series between two high impedance probes. Shielding surrounds and electrically isolates the voltmeter and probes that communicate wirelessly via a pair of frequency translators, thus eliminating the cable customarily used to connect the probes and enabling measurements of the voltages, voltage differences, phases and phase difference between two conductor that may be miles apart. The signal transmitted from the first probe to the second may be analog or digital and is automatically compensated to correct the synchronization of the transmitted signal for the delay required to send it via the two translators.

The present invention relates to voltmeters generally and to voltmeters for use in electrical power transmission line servicing and maintenance in particular.
Electricity transmitted through power lines destined for commercial, industrial and residential use can involve hundreds of thousands of volts and high currents. Inevitably, there is an element of danger in measuring the voltage on a transmission line because of the need to make contact with the line. Indeed, even the proximity to a high voltage line may be sufficient to cause a spark to jump through the air to the nearest object. Nonetheless, in installing, servicing and repairing power lines, there are various occasions when contact is made, such as when the voltage carried by a line must be measured.
Presently, high voltage phasing voltmeters use two test probes, which are each high voltage resistors housed in an insulated holder. The probes are electrically connected in series with a meter using a cable to connect them. The holders will have metal hooks or other fittings on their ends to facilitate a quick, good electrical contact with transmission lines. Often the meter is mounted to one of the two test probes and oriented so that the electric utility worker can read the voltage displayed on the meter. "Hot sticks" may be used to hold and elevate the entire assembly up to a transmission line. The meter may be designed to measure either voltage or current, but its display indicates voltage.
In addition to concerns for safety, there are a number of factors that introduce inaccuracies in these types of measurements. One of these factors is the existence of capacitive currents. However, the inaccuracies in phasing voltmeters attributable to capacitive currents are eliminated by the design disclosed and described in a commonly owned U.S. Pat. No. 6,459,252 issued Oct. 1, 2002, which is incorporated herein by reference.
Other factors that affect accuracy with phasing voltmeters have also been solved. On occasion, more than a few feet may separate power transmission lines. While the alternating current phasing voltmeter disclosed in the related U.S. Pat. No. 6,459,252, practically eliminates capacitive currents regardless of the length of the cable required to make measurements of power lines that are separated, it does not effectively address the problem of the physical problems in dealing with a long cable or the problem of having a cable that is not long enough. Commonly owned U.S. Pat. No. 6,617,840 issued Sep. 9, 2003 and U.S. Pat. No. 6,734,658, issued May 11, 2004, however, solve this problem to some extent by eliminating the cable altogether in favor of an alternating current phasing voltmeter in a master and slave probe combination that communicate voltage information wirelessly. The patent specification of U.S. Pat. No. 6,734,658 is also incorporated herein by reference. This phasing voltmeter also helps to overcome the natural reluctance of workers to apply test probes to power lines carrying very high voltages and it incorporates the accuracy improvements of U.S. Pat. No. 6,459,252.
However, there remains a need for a phasing voltmeter that is accurate, easy to read, and can be easily used when the transmission lines are separated by more than a few hundred feet, perhaps even separated by a distance on the order of a few miles.

Long range alternating current phasing voltmeter


An information display system has an information display unit which displays information in a large screen display device in a predetermined standard language; a user information input unit which inputs user information including information of a language desired by a user; and a language switch display unit which, when the user desired language input by the user information input unit is different from the standard language, switches the standard language of the screen display device to and displays the desired language of the user. The information display unit displays guide information, which comprises a public area common to all users and a plurality of individual areas dependent on respective users, in the standard language. When the input user desired language is different from the standard language, the language switch display unit displays the public area by time division or space division by the standard language and the user desired language and switches the individual area from the standard language to and displays in the user desired language.

Conventionally, a standalone-type public display device which displays departure information by using a large display has been set in a departure terminal of an airport. If it is an airport of, for example, an English-speaking area, such a public display device is displayed in English as a display language. In order to support users of a plurality of different linguistic areas, some devices prepare buttons for a plurality of languages so that display is switched to the display of the language corresponding to the pressed button. In display control of contents such as movies corresponding to a plurality of languages, there are: a mechanism which carries out display in the language corresponding to a user according to setting by the user or the information embedded in a device, a device in which a plurality of language-corresponding buttons are provided and display is carried out in a language when the language is selected, and a device which displays embedded captions of a plurality of languages by time division.    Patent Document 1: Japanese Patent Application Laid-Open (kokai) No. H11-327725    Patent Document 2: International Publication No. WO-00-048082    Patent Document 3: Japanese Patent Application Laid-Open (kokai) No. 2003-345325    Patent Document 4: Japanese Patent Application Laid-Open (kokai) No. 2004-180097
However, in such conventional information display systems corresponding to a plurality of languages, when a particular user is using it, the display is in a particular language desired by the user, and the display cannot be understood if a user of a different language is watching it. Particularly, in the case of a public display device of, for example, an airport terminal, a plurality of users of different linguistic areas watch departure information, and there is a problem that, when the display is in the language of particular users, the information cannot be read at all if there is another user of a different linguistic area who is watching the display. In expectation of people of a plurality of linguistic areas who use the public display, displaying captions of a plurality of languages by time division is conceivable. However, there are problems that, when there are many languages to be supported, it takes time until the display appears in the language of the user, which is desired to be watched by the user; and, when the number of displayed languages is increased, the displayed time at a time has to be shortened. Furthermore, also in the case in which a language is selected by a button and also in the case in which captions are displayed by time division, there are a problem that the number of supported languages is practically limited and a problem that there is a lack of convenience as a public display device of, for example, an airport terminal where users of many linguistic areas come and go.

Multi-lingual information display system comprising public area and individual areas


A free coaster bicycle wheel driving apparatus is provided with a clutch that employs radially acting, rather than axially acting components. An annular drive sleeve projecting inwardly from a drive sprocket is disposed within multiple transmission power transmission sleeves, which are disposed within a cylindrical wheel hub shell. The drive sleeve defines multiple cam lobes and the power transmission sleeves define multiple cam lobes and multiple pockets. When the drive sleeve cam lobes are disposed in the power transmission sleeve pockets, the driving apparatus is disengaged and allowed to free coast. Upon forward rotation of the driving apparatus, the drive sleeve cam lobes rotate toward and engage the power transmission sleeve cam lobes, thereby forcing the power transmission sleeve radially outward towards the wheel hub shell, thereby allowing the sprocket to engage the wheel hub.

In a conventional bicycle drive system a rider powers the bicycle by applying force through the rider's feet to the bicycle pedals which are mounted on a crank arm to a large sprocket which drives a chain loop in rotation in a forward direction. The chain is engaged with a smaller sprocket that is coupled to the hub of the rear bicycle wheel.
There is a recognized desire among many riders of trick bicycles to have a rear wheel which is capable of being entirely disengaged from the drive train. With a conventional free wheel ratchet mechanism the rider is forced to backpedal constantly to allow the rear bicycle wheel to rotate in reverse. Since the rider's weight is predominantly carried by the pedals, this constant backpedaling can upset the rider's balance. It also makes some tricks much harder to perform than would otherwise be the case.
There are conventional systems that allow a rider to disengage the drive sprocket from the hub. Such systems operate by means of a clutch hub which only engages the drive when the rider pedals in a forward direction. The hub begins disengagement from the drive sprocket when the forward force applied to the bicycle pedals ceases. Deliberate backpedaling by the rider at this point will cause the clutch to become fully disengaged. Once fully disengaged the hub is free to rotate in either direction without any effect on the positions of the bicycle pedals.
Existing bicycle clutch designs of this type typically employ a jamming cone which is moved axially to jam in a conical seat. However, the axial movement required is typically created using a drive thread. Drive threads are difficult to manufacture and are also expensive. Furthermore, the axial movement of the clutch parts creates large axial loads which are undesirable. Furthermore, the action is also generally poor.
Another problem with conventional clutches of this type is that the hub runs on a bearing fitted to the outside of the driver. Such a construction results in large bearing sizes and an undesirable "nested" bearing arrangement. Other types of bearing arrangements are impractical due to the large amount of space required by the mechanism.
While some bicycle clutches have been devised that utilize a radial movement of rollers, the intricacies of the design and the restricted space have resulted in very high contact stresses. These excessive stresses lead to premature failure and poor reliability and function. Furthermore, clutches of this type are quite expensive to produce.

This patent is subject to a terminal disclaimer.