An improved induction tool for evaluating formation resistivity. The tool provides electromagnetic transmitters and sensors suitable for transmitting and receiving magnetic fields in radial directions that are orthogonal to the tool's longitudinal axis with minimal susceptibility to errors associated with parasitic eddy currents induced in the metal components surrounding the transmitter and receiver coils. A magnetic lens is provided to select sensitivity to a desired reservoir formation property.

1. Field of the Invention
The present invention relates to the field of induction resistivity in frequency or time domain measurements for evaluation of potential hydrocarbon bearing formations and assisting drilling and well placement decisions with geo-steering and geological information above, below and ahead of the bit using downhole induction instruments having reinforced metal mandrel (monitoring while drilling-MWD) or significant amounts of electrically conductive parts in or around the sensor section. The present invention provides for compensation of eddy currents induced in the tool body, which create additive error signals that interfere with resistivity measurements for automatically estimating dip angle through joint interpretation of multi-array induction and electromagnetic measurements (including high frequency "dielectric" or wave propagation ones), multi-component induction measurements for geosteering and open hole applications involving anisotropic formations.
2. Summary of the Related Art
Electromagnetic induction resistivity well logging instruments are well known in the art. These induction resistivity well logging instruments are used to determine the electrical conductivity, or its converse, resistivity, of earth formations penetrated by a borehole. Formation conductivity has been determined based on results of measuring the magnetic field due to eddy currents that the instrument induces in the formation adjoining the borehole. The electrical conductivity is used for, among other reasons, inferring the fluid content of the earth formations. Typically, lower conductivity (higher resistivity) is associated with hydrocarbon-bearing earth formations. The physical principles of electromagnetic induction well logging are well described, for example, in, J. H. Moran and K. S. Kunz, Basic Theory of Induction Logging and Application to Study of Two-Coil Sondes, Geophysics, vol. 27, No. 6, part 1, pp. 829-858, Society of Exploration Geophysicists, December 1962. Many improvements and modifications to electromagnetic induction resistivity instruments described in the Moran and Kunz reference, supra, have been devised, some of which are described, for example, in U.S. Pat. No. 4,837,517 issued to Barber, in U.S. Pat. No. 5,157,605 issued to Chandler et a. and in U.S. Pat. No. 5,600,246 issued to Fanini et al.
The conventional geophysical induction resistivity well logging tool is a probe suitable for lowering into the borehole and it comprises a sensor section and other, primarily electrical, equipment for acquiring the data to determine the physical parameters that characterize the formation. The sensor section, or mandrel, comprises induction transmitters and receivers positioned along the instrument axis and arranged in the order according to particular instrument specifications. The electrical equipment generates an electrical voltage to be further applied to a transmitter induction coil, conditions the signals coming from receiver induction coils, processes the acquired information. The acquired data then has been stored or by means of telemetry sent to the earth's surface through a wire line cable used to lower the tool into the borehole.
In general, when using a conventional induction logging tool with transmitters and receivers (induction coils) having their magnetic moments oriented only along the borehole axis, the hydrocarbon-bearing zones are difficult to detect when they occur in multi-layered or laminated reservoirs. These reservoirs usually consist of thin alternating layers of shale and sand and, oftentimes, the layers are so thin that due to the insufficient resolution of the conventional logging tool they cannot be detected individually. In this case the average conductivity of the formation is evaluated.
Thus, in a vertical borehole, a conventional induction logging tool with transmitters and receivers (induction coils) oriented only along the borehole axis responds to the average conductivity that combines the conductivity of both sand and shale. These average readings are usually dominated by the relatively higher conductivity of the shale layers. To address this problem, loggers have turned to using transverse induction logging tools where transmitters and receivers (induction coils) have their magnetic moments oriented transversely with respect to the tool longitudinal axis. The instrument for transverse induction well logging was described in U.S. Pat. No. 5,781,436 issued to Forgang et al.
In the transverse induction logging tools the response of transversal coil arrays or inclined coil arrays with a transverse component is also determined by an average conductivity, however, the relatively lower conductivity of hydrocarbon-bearing sand layers dominates in this estimation. In general, the volume of shale/sand in the formation can be determined from gamma-ray or nuclear well logging measurements. Then a combination of the conventional induction logging tool with the transversal induction logging tool can be used for determining the conductivity of individual shale and sand layers.
One of the main difficulties in interpreting the data acquired by a transversal induction logging tool is associated with its response vulnerability to borehole conditions. Among these conditions there are a presence of a conductive well fluid as well as well bore fluid invasion effects. A known method for reducing these unwanted impacts on a transversal induction logging tool response was disclosed in L. A. Tabarovsky and M. I. Epov, Geometric and Frequency Focusing in Exploration of Anisotropy Seams, Nauka, USSR Academy of Science, Siberian Division, Novosibirsk, pp. 67-129 (1972) and L. A. Tabarovsky and M. I. Epov, Radial Characteristics Of Induction Focusing Probes With Transverse Detectors In An Anisotropic Medium, Soviet Geology And Geophysics, 20 (1979), pp. 81-90.
The known method has been used a transversal induction logging tool comprising induction transmitters and receiver (induction coils). By irradiating a magnetic field the induction transmitter induces currents in the formation adjoining the borehole; in turn, the receivers measure a responding magnetic field due to these currents. To enable a wide range of vertical resolution and effective suppression of the unwanted borehole effects, measurements of magnetic from the formation can be obtained at different distances between the transmitter and receiver. However, even with these modifications, the data logs obtained with a conventional transversal induction logging instruments can be inconsistent, difficult to interpret, and the problems have been exacerbated while logging through a sequence of layers.
In the induction logging instruments the acquired data quality depends primarily both on parameters of the environment the tool operates in and on its intrinsic instrument its electromagnetic response characteristics. Thus, in an ideal case, the logging tool measures signals induced only by eddy currents excited in the formation by the primary magnetic field of the induction transmitter. Variations in the magnitude and phase of the eddy currents occurring in response to variations in the formation conductivity are reflected as respective variations in the output voltage of induction receivers. In conventional induction instruments these receiver voltages (or currents floating in the receiver coils) are signal conditioned and then processed using analog or digital phase sensitive detectors, primarily—algorithmically. The processing allows for determining both receiver voltage or current amplitude and phase with respect to the induction transmitter current or its magnetic field waveforms.
As in an open hole induction logging, the induction instruments currently deployed in monitoring while drilling (MWD) operations typically utilize solenoid-type transmitter and receiver induction coils coaxial with the tool mandrel. These instruments produce a "classical" set of induction measurements in the propagation mode, measuring attenuation and phase shift in the transmitted magnetic field due to the influence of the adjacent formation. Known induction tools utilize two coaxial receiver coils positioned in the center of the mandrel and two sets of balanced transmitter coils on both sides of the receiver coils. This balanced coil configuration, when operating at two frequencies of 400 kHz and 2 MHz, enables the typical known induction instrument to quantitatively evaluate eight directional horizontal formation resistivities for a plurality of investigation depths.
As a general rule for induction tool design, a high degree of magnetic coupling between the tool transmitter and the formation and the tool receiver and the formation is desirable. This high magnetic coupling between the tool transmitter/receiver and the formation facilitates increased instrument efficiency and increased overall signal to noise ratio and increases desirable sensitivity to formation parameters. However, the presence of conductive bodies typically found in the mandrel of known induction instruments becomes problematic, resulting in appearance of an additional and unavoidable magnetic coupling between these bodies and different sources of electromagnetic radiation\reception. Primarily, parasitic magnetic coupling between the transmitter, receiver and formation from one side and the conductive metal parts of the downhole tool from another side creates problems associated with parasitic eddy currents induced on the tool body surface and internal tool surfaces.
The parasitic eddy currents flowing on the surface of the downhole tool produce undesirable magnetic fields that interact with resistivity measurements as additive error components. These induced magnetic fields reduce the overall transmitter moment, couple directly into the receiver coil(s) and create undesirable offsets in measurement signals. Moreover, eddy currents on the tool body are temperature and frequency dependent that makes their adverse effects difficult, if not impossible to account and compensate for by known methods. Thus, there is a need for a method and apparatus that reduces and compensates for the adverse effects of eddy currents. Any remaining effect of the eddy currents can be calibrated out in an air calibration of a tool.
The relative formation dip angle is vital for proper and accurate interpretation of data acquired by the new multi-component array induction instrument. This newly developed induction instrument comprises three mutually orthogonal transmitter-receiver arrays. These configurations allow for determining both horizontal and vertical resistivities of an anisotropic formation in vertical, deviated, and horizontal boreholes. A description of the tool can be found in WO 98/00733, Electrical logging of a laminated formation, by Beard et al (1998). The transmitters induce currents in all three spatial directions and the receivers measure the corresponding magnetic fields (Hxx, Hyy, and Hzz). In this nomenclature of the field responses, the first index indicates the direction of the transmitter, the second index denotes the receiver direction. As an example, Hzz is the magnetic field induced by a z-direction transmitter coil and measured by a z-directed receiver where the z-direction has been conventionally parallel to the borehole axis. In addition, the instrument measures all cross-components of the magnetic fields, i.e., Hxy, Hxz, Hyx, Hyz, Hzx, and Hzy. In general inductive measurements can also be made in any non-orthogonal directions, for example, 20 and 40 degrees off or an orthogonal direction.
The signals acquired by the main receiver coils (Hxx, Hyy, and Hzz) are used to determine both the horizontal and vertical resistivity of the formation. This is done by inverse processing techniques of the data. These inverse processing techniques automatically adjust formation parameters in order to optimize in a cost-function for example a least-square sense measuring the data mismatch of the synthetic tool responses with measured data. Required inputs in this process are accurate information of the relative formation dip and relative formation azimuth. This information can be derived using in addition to the main signals (Hxx, Hyy, and Hzz) from the cross-components.
Conventional induction tools comprising only coaxial transmitter-receiver coil configurations do not have azimuthal sensitivity. Therefore, in a horizontal wellbore, the data does not contain information about directionality of the formation. It is not possible to distinguish whether a layer is above or below the borehole from these data alone. There is a need to be able to determine directionality of the formation. This knowledge can be obtained using a subset or all of the cross-components of the new multi-component induction tool that allows for determination of directionality of the formation.

This patent is subject to a terminal disclaimer.

Method and apparatus for mulit-component induction instrument measuring system for geosteering and formation resistivity data interpretation in horizontal, vertical and deviated wells


In the present disclosure, silver ions, copper ions, quaternary ammonium compounds and cationic drugs such as sulphanilamide, chlorhexidine acetate, etc., used as antibacterial agents are incorporated into fibers, filaments and films through nanoclays. The nanoclays serve as a carrier for the antimicrobial agents and are incorporated into the fiber-forming polymer. In one embodiment, the biocidal metals and organic compounds are incorporated into the clay structure via an ion exchange reaction. Nylon nanocomposite filaments and films based on copper and quaternary ammonium ion modified clays provide 100% antibacterial activity against Gram positive Staphylococcus aureus and Gram negative Escherichia coli bacteria at an optimum clay loading of 0.75% (by weight), and the activity is retained up to 50 washes. The resulting filaments show enhanced mechanical properties such as tensile strength and modulus, and find application in areas of medical textiles like sutures, wound dressings and health & hygiene textiles. In addition, they can be integrated into protective clothing, body garments, sportswear and upholstery.

Textiles provide an excellent medium for the growth of microorganisms when the basic requirements such as nutrients, moisture, oxygen, and appropriate temperature are present. The large surface area of textiles also assists in the growth of microorganisms on the fabric. The major problems associated with microorganism growth in textiles are related to hygiene and fabric deterioration. With existing technologies, antimicrobial compounds such as silver, copper, quaternary ammonium compounds are generally applied on the fibers either through coating or are added during melt mixing prior to spinning. The major drawbacks of these fibers are that the antimicrobial compounds release very fast. The amount of antimicrobial agent released during laundering is also high, which affects the durability of the finished fabric. Metals such as silver are generally applied on the fibers in the form of a very thin coating deposited through a sputtering technique, an example of which is the commercial antimicrobial nylon fibre "X-STATIC®". This thin film coating is prone to crack during processing and use due to the mismatch in extensibility between the fibre and the coating. Apart from this, the strength of the fibre/fabric is also often reduced after the application of a durable antimicrobial coating or finishing.
Thus, there remains a need for a highly durable anti-microbial textile material having enhanced retention of antimicrobial properties upon repeated use and washings without affecting the textile properties such as handle and feel. The controlled release of active agent over a period of time is also a desirable property for certain applications.
The modification of nanoclays with organic compounds and their application as nano-filler finds use in the preparation of hybrid polymer nanocomposite materials due to improved mechanical, thermal, electrical, barrier and optical properties. See Alexandre, M., Dubois, P., Materials Science and Engineering. 28, 2000, pp. 1-63. Organic modified clay is generally prepared through ion exchange of the metal cations in the clay with organophilic cations such as quaternary ammonium salts. It has been reported recently that organoclay containing cationic surfactant or quaternary ammonium salt and long hydrophobic chain show excellent antimicrobial properties. See Nigmatullin, R., Gao, F., Konovalova, V., Journal of Material Science. 43, 2008, 5728. The use of clays such as Montmorillonite, Laopnite, Mingguang Polygorskite, AND Na-clinoptilolite as a support medium or carrier for antimicrobial agents as well as antimicrobial drug has also been reported recently due to their potential use in water treatment, food packaging, and drug delivery material. See Zhou, Y., Xia, M., Ye, Y., Applied Clay Science, 27 (2004) 215; Hu, C-H., Xia, M-S. Applied Clay Science. 31 (2006)180; Magana, S. M., Quintana, P., Aguilar, D. H., Toledo, J. A., Angeles-Chavez, C., Cortes, M. A., Leon, L., Freile-Pelegrm, Y., Lopez, T., Torres Sanchez e, R. M., Journal of Molecular Catalysis A: Chemical. 281 (2008)192; Malachová, K., Praus, P., Pavlí{hacek over (c)}ková, Z., Turicová, M., Applied Clay Science. 43 (2009) 364; Aihara, N., Torigoe, K., Esumi, K., Langmuir. 14 (1998) 4945; Zhao, D., Zhou, J., Liu, N., Applied Clay Science 33 (2006) 161; and Top, A., Úlkú, S. Applied Clay Science, 27 (2004).
The antimicrobial agents such as silver, copper, quaternary ammonium compounds, cationic drugs and like have been intercalated and absorbed on clay surfaces through an ion exchange mechanism. These incorporated antimicrobial/active ions/drugs subsequently release from the clay surface in a controlled manner and show excellent antimicrobial activity against pathogenic bacteria.
Montmorillonite (MMT) is classified as 2:1 phyllosilicate clay. It has a unit crystal lattice formed by one alumina octahedral sheet sandwiched between two silica tetrahedral sheets and the interlayer between units contain positive cations such as Na+, K+, Ca++ etc. and water molecules. Due to this crystalline arrangement, montmorillonite is able to expand and contract the interlayer while maintaining two dimensional crystallographic integrity and is characterized by octahedral and/or tetrahedral substitution and high ion exchange capacities (70-120 mequiv/100 g). Magana et al., have studied the antimicrobial activity of the montmorillonite clay modified with silver and found that the antimicrobial activity or silver loading on the clay is dependent on the cation exchange capacity of the clay and the availability of ionic silver to be in contact with the bacteria. The cation exchange capacity of the clay can be modified via thermal, mechanical or chemical treatments. See Top et al. Hu and Xia have studied three different kinds of montmorillonite such as calcium montmorillonite, sodium montmorillonite and acid activated montmorillonite and their ion exchange with Cu++. See Hu et al. The Cu++ modified clays shows very good antimicrobial activity. Menga et al., have studied chlorhexidine acetate (CA)/montmorillonite intercalation composites and its antimicrobial potential with pathogenic bacteria, Staphylococcus aureus and Pseudomonas aeruginosa. See Menga, Na., Zhoua, N-L., Zhang, S-Q., Shena, J. International Journal of Pharmaceutics, 382 (2009).
The application of quaternary ammonium ion based antimicrobial clay into a polymer matrix in the form of films has been explored recently. The introduction of commercially available organo-clays such as Closite 30B and Closite 10A into Nylon 6, Chitosan and PLA matrix significantly suppresses biofilm formation on film surfaces exposed to the bacterial suspension. See Nigmatullin et al.; Wang, X., Du, Y., Yang, J., Wang, X., Shi, X., Hu, Y., Polymer, 47 (2006) 6738; and Rhim, J. W., Hong, S. I., Ha, C. S., LWT Food Science and Technology, 42 (2009) 612. However, there is no literature available on the application of antimicrobial clay based on metal ions in polymer nanocomposite and more specifically for making antimicrobial fibers.

Antimicrobial nanocomposite compositions, fibers and films


A striker assembly includes a striker having a main body, a head, and teeth formed in the main body. A “U”-shaped channel is formed in a top wall of the head to accommodate a movable first elongate metal bar and in a bottom wall of the head to accommodate a stationary second elongate metal bar. An undercut is formed in open communication with the channel that accommodates the second elongate metal bar. A plurality of longitudinally spaced apart circular discs is positioned in a plane perpendicular to a longitudinal axis. Each disc has slots formed in it to accommodate opposite ends of the first and second elongate metal bars. The slot that accommodates the first elongate metal bar enables it to be displaced circumferentially and radially so that a striker can be replaced and it is moved back into its operative position after the striker has been replaced.

1. Field of the Invention
This invention relates generally to devices that remove dirt, debris, contaminates, and the like from animal carcasses. More particularly, it relates to a striker assembly that includes a plurality of strikers mounted in radial relation to a rotatable frame so that rotation of the frame causes the strikers to repeatedly strike the hide of a carcass passing through a processing facility.
2. Description of the Prior Art
Small rotating fingers known as picking fingers are used in the poultry industry to remove feathers from chickens and the like in processing facilities. The machines that include such picking fingers are known as automatic defeathering machines. Larger rotating fingers known as whips are used in the pork industry for hair removal.
Conventional picking fingers or whips are attached to rotating drums or frames and extend radially therefrom relative to an axis of rotation thereof so that a carcass is repeatedly struck by the picking fingers or whips as the carcass is carried on a conveyor through a processing station.
Picking fingers have a head that is forced through an opening formed in a metal bar to seat in a recess under a head or a rim. When the picking fingers become worn and require replacement, they must be cut from the head using a knife or shears.
When whips are worn and in need of replacement, an elongate attachment rod that passes through a bore formed in the head of the whip must be removed from its engagement with the striker assembly.
There is a need for a striker assembly that facilitates replacement of worn out strikers.
More specifically, there is a need for a striker assembly that does not require cutting of the strikers with a knife or other cutting instrument when worn strikers are replaced. There is also a need for a striker assembly that does not require removal of elongate attachment rods when a striker requires replacement.
However, in view of the art considered as a whole at the time the present invention was made, it was not obvious to those of ordinary skill in this art how the identified needs could be met.


The present disclosure provides a display panel, a method for driving the display panel and a display device. The display panel includes a display region and a non-display region. The non-display region includes a first bonding region, and further includes first connection lines connected to a plurality of gate lines respectively and second connection lines connected to a plurality of data lines respectively. The display panel further includes at least one chip on film, the chip on film includes a second bonding region, a first region, and a second region between the second bonding region and the first region. A scanning driving integrated circuitry connected to the second bonding region via first wirings and a data driving integrated circuitry connected to the second bonding region via second wirings are bonded in the first region. The first wirings and the second wirings are arranged at different layers in the second region.

Along with the continuous advancement of science and technology, people's pursuit of well appearance has become increasingly intense, and a narrow-bezel or even bezel-free display device has attracted more and more attention.
In the related art, a driving integrated circuitry of the display device is intensively arranged on a side of a display region, so as to provide a narrow bezel on the other three sides of the display region. However, a width of a bezel on the side where the driving integrated circuitry is located increases, so it is impossible to provide the narrow-bezel display device as a whole or the bezel-free display device.

Display panel including chip on film, method for driving the same and display device

FUZHOU BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.


An assembly which a concave member and a first substrate having a transverse opening which is superimposed over the concave member to form an internal chamber. A second substrate having a transverse opening is also superimposed over said first substrate, and an electrical connector means is mounted on the second substrate. A flex circuit is interposed in spaced generally parallel relation between the first substrate and the concave member. An extension of the flex circuit extends through the transverse openings of the first and second substrate to engage the electrical connector means.

1. Field of the Invention
The present invention relates to flex circuit assemblies and more particularly to assemblies in which flex circuits are used to carry signals into and out of gas-tight chambers.
2. Brief Description of Earlier Developments
Direct access storage devices (DASD), or disk drives, store information on concentric tracks of a rotatable magnetic disk. In such devices flex circuits may extend out of gas tight chambers. Further efficiencies in integrating flex circuit and gas tight chambers are needed.
The present invention is an assembly in which a concave member and a first substrate having a transverse opening is superimposed over the concave member to form an internal chamber. A second substrate having a transverse opening is also superimposed over said first substrate, and an electrical connector means is mounted on the second substrate. A flex circuit is interposed in spaced relation between the first substrate and the concave member. An extension of the flex circuit projects through the transverse openings of the first and second substrate to engage the electrical connector means.

Assembly including a flex circuit and a gas tight chamber


A liquid suction pump comprising: a drive pipe to receive a liquid drive flow for the pump; a liquid conduit with first and second liquid delivery arms to provide pumped liquid, and a connecting valve arrangement between the arms. First and second pump inlets to the arms have respective first and second one-way inlet valves. The valve arrangement has a valve inlet coupled to the drive pipe and valve outlets coupled to the arms to alternately close off a liquid connection between the valve inlet and respective arms. A compliant element is coupled to the drive pipe. The drive flow oscillates in pressure/flow rate due to alternate switching of the valves. A compliance of the compliant element is such that a geometry of the suction pump in combination with the compliance defines a resonant condition, and the oscillation is at a resonant frequency of the pump.

Suction rams may be divided into two broad categories, single acting and double acting, as follows:
Single Acting: Those having a single drive pipe and delivery pipe, an impulse valve between the drive pipe and delivery pipe, a single intake non-return valve situated immediately downstream of the impulse valve. Most examples incorporate an accumulator connected to the bottom of the drive pipe to store the kinetic energy in the drive pipe and to limit damage to the apparatus due to the production of un-exploited discharge shock waves.
Examples are described in U.S. Pat. No. 799,428, DE804288, and U.S. Pat. No. 4,948,341. They tend to stall readily in the closed position, requiring the drive pressure to be relieved before a renewed attempt can be made at starting. AU708806 addresses this difficulty, but in all single-acting hydraulic suction ram pumps comprising an accumulator, the minimum pressure in the accumulator occurs at a time when the impulse valve is already open, and thus cannot be exploited as a means of re-opening.
Double Acting: Those having a single drive pipe but two delivery pipes, each connected to an intake non-return valve, wherein the impulse valve is a diverter valve such that when in operation, either of the two delivery pipes is closed at any one time but not the other.
Examples are described in FR435032, U.S. Pat. Nos. 3,123,009, 4,121,895. A more recent example is described in WO2010/130002, but this pump is difficult to set up and relatively inefficient.
More generally, existing double-acting suction rams have the disadvantage of a trade-off between the ability of the valve to switch from one delivery pipe to the other, and the flow-friction loss around the impulse/diverter valve. Either the switching occurs at low flow rates but the flow is relatively choked or the switching only occurs at high flow rates.
The inventors have conducted practical and theoretical investigations of the underlying fluid dynamics and have identified surprising and substantial improvements which may be made.


An example method comprising detecting that an unidentified client device joins a network, retrieving information related to a device property of the unidentified client device from network traffic to and/or from the unidentified client device, sending a query based on the information to a fingerprinting server, and receiving the device property of the unidentified client device in response to the query.

In some networks it may be desirable to enforce network access policies for each device based on information about the devices. Device fingerprinting is a technique that aids in providing more information about devices connected to a network, such as for example the operating system in the device, the device type and the device manufacturer.
Information about devices can be used to apply policies to the devices. For example, devices such as cameras may in some networks be permitted to access specific servers to upload live camera feeds, and be denied other access. Devices such as temperature sensors with weak or no security protocols may for example be grouped within a guest virtual LAN (VLAN) with limited access to the network, other networks or resources on the network.

Hewlett Packard Enterprise Development LP


There is provided a multilayer ceramic electronic component, including a ceramic body including dielectric layers; a plurality of internal electrodes stacked within the ceramic body, and external electrodes formed on external surfaces of the ceramic body and electrically connected to the internal electrodes, wherein the external electrodes include a metal layer and a conductive resin layer formed on the metal layer, the conducive resin layer containing a copper powder and an epoxy resin, the copper powder including a first copper powder having a content of 10 wt % or more and a particle diameter of 2 μm or greater and a second copper powder having a content of 5 wt % or more and a particle diameter of 0.7 μm or smaller, the first copper powder being a mixture of spherical powder particles and flake type powder particles.

1. Field of the Invention
The present invention relates to a conductive paste for an external electrode and a multilayer ceramic electronic component including the same, capable of improving equivalent series resistance (ESR) characteristics in the multilayer ceramic electronic component.
2. Description of the Related Art
In accordance with the recent trend for the miniaturization of electronic products, multilayer ceramic electronic components have also been required to have smaller sizes and larger capacitances.
For this reason, attempts at thinning and increasing dielectric layers and internal electrodes stacked on one another have been performed using various methods. Recently, multilayer ceramic electronic components having dielectric layers having a reduced thickness and an increased number of laminations have been manufactured.
Along with this, as an external electrode is also required to be thinner, plating liquid may penetrate into a chip through the thinned external electrode, and thus there are technical difficulties in the miniaturization of electronic products.
Particularly, when the external electrode has an irregular shape, the possibility that the plating liquid may penetrate through a thin portion of the external electrode, resulting in a failure to secure reliability.
In addition, in terms of securing reliability, cracks and the like may occur due to external impacts. The occurrence of cracks may also result from the fact that the external electrode may not sufficiently absorb stress, or stress may occur by a plating layer.
In order to solve the defects, a resin composition containing a conductive material is coated between a metal layer of the external electrode and a plating layer, so that external impacts may be absorbed and reliability may be improved.
However, in the case of coating the resin composition, an increase in equivalent series resistance (ESR) may be caused as compared with the case of a general copper (Cu) sintered external electrode.
Therefore, research into multilayer ceramic electronic components having excellent equivalent series resistance (ESR) as well as high degrees of reliability implemented therein is still required.

Multilayer ceramic electronic component having external electrodes which include a metal layer and conductive resin layer


An embodiment provides systems and techniques for determining a process model. During operation, the system may receive a first optical model which models a first optical system of a photolithography process. Next, the system may use the first optical model to determine a second optical model that models a second latent image that is formed by the first optical system at a second distance. The system may also use the first optical model to determine a third optical model that models a third latent image that is formed by the first optical system at a third distance. Next, the system may receive process data which is obtained by subjecting a test layout to the photolithography process. The system may then determine a process model using the first optical model, the second optical model, the third optical model, the test layout, and the process data.

1. Field of the Invention
The present invention relates to integrated circuit design and fabrication. More specifically, the present invention relates to a method and an apparatus to determine a photolithography process model that models the impact of CAR/PEB (Chemically Amplified Resist Post Exposure Bake) on the resist profile.
2. Related Art
Rapid advances in computing technology have made it possible to perform trillions of computational operations each second on data sets that are sometimes as large as trillions of bytes. These advances can be attributed to the dramatic improvements in semiconductor manufacturing technologies which have made it possible to integrate tens of millions of devices onto a single chip.
As semiconductor design enters the deep submicron era, process model accuracy is becoming increasingly important. Inaccuracies in the process model negatively affect the efficacy of downstream applications. For example, inaccuracies in the photolithography process model can reduce the efficacy of optical proximity correction (OPC). Hence, it is desirable to improve process model accuracy.

Method and apparatus for determining a process model that models the impact of CAR/PEB on the resist profile


Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpiece process fluid to a semiconductor processor are provided. One aspect of the invention provides a semiconductor processor system including a process chamber adapted to process at least one semiconductor workpiece using a process fluid; a connection coupled with the process chamber and configured to receive the process fluid; a sensor coupled with the connection and configured to output a signal indicative of the process fluid; and a control system coupled with the sensor and configured to control at least one operation of the semiconductor processor system responsive to the signal.

Numerous semiconductor processing tools are typically utilized during the fabrication of semiconductor devices. One such common semiconductor processor is a chemical-mechanical polishing (CMP) processor. A chemical-mechanical polishing processor is typically used to polish or planarize the front face or device side of a semiconductor wafer. Numerous polishing steps utilizing the chemical-mechanical polishing system can be implemented during the fabrication or processing of a single wafer.
In an exemplary chemical-mechanical polishing apparatus, a semiconductor wafer is rotated against a rotating polishing pad while an abrasive and chemically reactive solution, also referred to as a slurry, is supplied to the rotating pad. Further details of chemical-mechanical polishing are described in U.S. Pat. No. 5,755,614, incorporated herein by reference.
A number of polishing parameters affect the processing of a semiconductor wafer. Exemplary polishing parameters of a semiconductor wafer include downward pressure upon a semiconductor wafer, rotational speed of a carrier, speed of a polishing pad, flow rate of slurry, and pH of the slurry.
Slurries used for chemical-mechanical polishing may be divided into three categories including silicon polish slurries, oxide polish slurries and metals polish slurries. A silicon polish slurry is designed to polish and planarize bare silicon wafers. The silicon polish slurry can include a proportion of particles in a slurry typically with a range from 1–15 percent by weight.
An oxide polish slurry may be utilized for polishing and planarization of a dielectric layer formed upon a semiconductor wafer. Oxide polish slurries typically have a proportion of particles in the slurry within a range of 1–15 percent by weight. Conductive layers upon a semiconductor wafer may be polished and planarized using chemical-mechanical polishing and a metals polish slurry. A proportion of particles in a metals polish slurry may be within a range of 1–5 percent by weight.
It has been observed that slurries can undergo chemical changes during polishing processes. Such changes can include composition and pH, for example. Furthermore, polishing can produce stray particles from the semiconductor wafer, pad material or elsewhere. Polishing may be adversely affected once these by-products reach a sufficient concentration. Thereafter, the slurry is typically removed from the chemical-mechanical polishing processing tool.
It is important to know the status of a slurry being utilized to process semiconductor wafers inasmuch as the performance of a semiconductor processor is greatly impacted by the slurry. Such information can indicate proper times for flushing or draining the currently used slurry.

Semiconductor workpiece processing methods


Electroluminescent devices have, as the active layer, a polymer comprising a poly(3-substituted thiophene), the 3-substituent of which is an alkyl, cycloalkyl, alkoxy, cycloalkoxy, alkoxyalkyl, fluorocarbon, siloxyl or heteroorganic group, the poly(3-substituted thiophene) having a head-to-tail ratio of at least about 80 percent. Such devices give better electroluminescent performance than similar devices using a poly(3-substituted thiophene) having a lower head-to-tail ratio.

This invention relates to electroluminescent devices containing polymers, and to processes for the use of these devices.
In recent years, a great deal of research has been conducted into electroluminescent materials, that is to say materials which emit electromagnetic radiation (typically visible light) when an electric current flows through the material. Electroluminescent materials are potentially useful for the construction of image display devices, which could be very thin and lightweight, and could thus advantageously replace cathode ray tubes, gas plasma displays, liquid crystal displays and other types of image display devices.
Several different types of electroluminescent materials are known; see, generally as to development of such materials, International Patent Application No. PCT/GB90/00584 (Publication No. WO 90/13148). The first type to be developed was inorganic semiconductor materials such as gallium phosphide and zinc sulfide. However, such inorganic electroluminescent materials are not readily usable in large image display devices, and many of them suffer from practical drawbacks, including poor reliability. Accordingly, much recent research has concentrated on organic electroluminescent materials.
Many organic compounds, especially polycyclic arenes such as anthracene, perylene, pyrene and coronene, are electroluminescent. However, electroluminescent devices using these monomeric organic compounds suffer from poor reliability, and these organic compounds present difficulties in preparing the thin layers of the materials needed for use in practical electroluminescent image display devices, and the electrodes needed for electrical contact with such layers. Techniques such as sublimation of the organic material produce layers which are soft, prone to recrystallization and unable to support high temperature deposition of electrode layers, while techniques such as Langmuir-Blodgett film deposition produce films of poor quality, dilution of the active material and high cost of fabrication. Prior art electroluminescent devices formed from these materials, such as that described in U.S. Pat. No. 3,621,321, typically suffer from high power consumption and low light output.
Attempts have also been made to use solid solutions of non-polymeric organic electroluminescent materials in non-electroluminescent polymers as the active layer in electroluminescent devices; see, for example, U.S. Pat. No. 4,356,429. However, use of such solid solutions carries a substantial risk of phase separation by crystallization of the electroluminescent material out of the polymer, especially in environments where the electroluminescent device may be subjected to large changes in temperature. In addition, often it is difficult to find a non-electroluminescent polymer which can both conduct electricity and dissolve a large proportion of the active electroluminescent material to form the necessary solid solution. Finally, the use of a solid solution necessarily involves substantial dilution of the active electroluminescent material and thus lowers the maximum light flux from a given area of the electroluminescent device.
Accordingly, research has been carried out on electroluminescent polymers having an electroluminescent group incorporated into the polymer itself. These polymers do not suffer from the phase separation, solubility and stability problems encountered with the aforementioned solid solutions. Among the polymers which have been tested for use in electroluminescent devices are poly(3-substituted thiophenes); see, for example:
Braun et al., Electroluminescence and electrical transport in poly(3-octylthiophene) diodes, J. Appl. Phys. 72(2), 564 (1992);
Ohmori et al., Visible-Light Electroluminescent Diodes Utilizing Poly(3-alkylthiophene), Jap. J. Appl. Phys. 30(11B), 1938 (1991) (hereinafter "Ohmori I"); and
Ohmori et al., Effects of alkyl chain length and carrier confinement layer on characteristics of poly(3-alkylthiophene) electroluminescent diodes, Solid State Commun. 80(8), 605 (1991) (hereinafter "Ohmori II").
However, the electroluminescent performance of the poly(3-alkylthiophenes) described in the above papers is inferior to certain other electroluminescent polymers known in the art.
It has now been found that the electroluminescent performance of poly(3-alkylthiophenes) is greatly affected by the head-to-tail ratio of the polymer, and that improved electroluminescent performance can be achieved using a poly(3-alkylthiophene) having a head-to-tail ratio of at least about 80 percent.

Electroluminescent devices and processes using polythiophenes


A method of transforming a carnation (Dianthus L.) plant genome with a DNA molecule. The method comprises (a) preparing stem explants from carnation cuttings; (b) wounding the explants by microprojectile bombardment; (c) cocultivating the wounded explants with Agrobacterium comprising the DNA molecule under defined conditions of exposure to dark followed by light; (d) excising shoots from the cultivated wounded explants and removing the leaves from the shoots; and (e) culturing the leaves to obtain transgenic shoots transformed with the DNA molecule. Also disclosed are a rolC-transgenic carnation with improved agronomic traits and enhancement of flower fragrance by antisense suppression of the flavonoid gene fht.

The following references may contribute to the understanding of the invention, and are referred to by number in the specification:    1. Zuker A, Tzfira T, Vainstein A: Genetic engineering for cut-flower improvement. Biotech Adv 16: 33–79 (1998)    2. van Altvorst A C, Rikesen T, Koehorst H, Dons J J M: Transgenic carnations obtained by Agrobacterium tumefaciens-mediated of leaf explants. Transgenic Res 4:105–113 (1995)    3. Zuker A, Chang P-F L, Ahroni A, Cheah K, Woodson W R, Bressan R A, Watad A A, Hasegawa P M, Vainstein A: Transformation of carnation by microprojectile bombardment. Sci Hort 64: 177–185 (1995)    4. Firoozabady E, Moy Y, Tucker W, Robinson K, Gutterson N: Efficient transformation and regeneration of carnation cultivars using Agrobacterium. Molecular Breeding 1: 283–293 (1995)    5. Lu C Y, Nugent G, Wardley-Richardson T, Chandler S F, Young R, Dalling M J: Agrobacterium-mediated transformation of carnation (Dianthus caryophyllus L.). Bio/Tech 9: 864–868 (1991)    6. Zuker, A., et al: Application of an integrative system based on microprojectile bombardment and Agrobacterium tumefaciens to generate transgenic carnation plants with novel characteristics. IX International Congress on Plant Tissue and Cell Culture, Jerusalem, Israel (1998)    7. Fladung, M., K. Grossmann, and M. R. Ahuja. 1997. Alterations in hormonal and developmental characteristics in transgenic Populus conditioned by the rolC gene from Agrobacterium rhizogenes. J. Plant Physiol. 150:420–427    8. Scorza, R., T. W. Zimmerman, J. M. Cordts, K. J. Footen, and M. Ravelonandro. 1994. Horticultural characteristics of transgenic tobacco expressing rolC gene from Agrobacterium rhizogenes. J. Amer. Soc. Hort. Sci. 119:1091–1098    9. Nilsson, O. and O. Olsson. 1997. Getting to the root: the role of the Agrobacterium rhizogenes rol genes in the formation of hairy roots. Physiol. Plant. 100:463–473    10. Souq, F., P. Coutos-Thevenot, H. Yean, G. Delbard, Y Maziere, J. P. Barbe, and M. Boulay. 1986. Genetic transformation of roses, 2 examples: one on morphogenesis, the other on anthocyanin biosynthetic pathway. In: Morisot A, Ricci P (eds) Second International Symposium on Roses. Acta Hort. 424:381–388    11. Pelletier, M. K. & Shirley, B. W. Analysis of flavanone 3-hydroxylase in arabidopsis seedlings. Plant Physiol. 111, 339–345 (1996)    12. Ahroni A: Developing efficient regeneration and transformation methods for carnation and gypsophila. M. Sc. thesis (The Hebrew University of Jerusalem, Israel) (1996)    13. Tzfira, T., C. S. Jensen, W. Wang, A. Zuker, B. Vinocur, A. Altman, and A. Vainstein. 1997. Transgenic Populus tremula: a step-by-step protocol for its Agrobacterium-mediated transformation. Plant Mol. Biol. Rep. 15:219–235
The carnation (Dianthus L.), one of the world's major cut-flower crops, is the commercial leader in terms of number of stems sold worldwide. Different carnation types have been developed as a result of crossing and they can be divided into two main groups, standard (midi and mignon carnation) and spray (micro and diantini carnation); a minor group is formed by the pot carnations.
Market demand for flowers with improved traits—such as new colors, new shapes, better fragrance and longer vase life, drives breeders to create new and more attractive varieties every year. However, carnation is a vegetatively propagated crop and is very detrimentally affected by inbreeding. Hence, controlled breeding is rather complicated and limited due to the fact that selection of a desired trait in the siblings is performed on the genetic background of their two parents, and due to the very high genetic variability among offspring. Furthermore, crosses within and between related species is limited by a rather small available gene pool for new traits.
Biotechnological techniques such as genetic engineering could be a useful alternative/addition to currently used classical breeding methods for the production of novel plant varieties (1).
One of the prerequisites to generating transgenic plants is the availability of a regeneration system. For carnation, numerous procedures leading to efficient adventitious regeneration from a number of explants, including stem segments, leaves and petals, have been published (1). However, success in harnessing these regeneration systems to efficiently generate transgenes has been rather limited. The Agrobacterium-mediated transformation procedure described by van Altvorst et al. (2) and the microprojectile bombardment-mediated procedure (3) were both of relatively low efficiency.
A more recent, alternative transformation procedure was developed by DNAP Inc. (4). Although a high number of transgenes could be generated from the three varieties used, the procedure was extremely time-consuming and cumbersome because it relied on vitrified leaves as the primary explants and these can take 4 to 6 months of tissue culture to generate. The only efficient procedure reported to date, also used to generate transgenes with improved vase life, was developed by another biotech company, Calgene Pacific Ltd. (5). However extensive efforts by numerous groups to generate carnation transgenes with this experimental protocol have been unsuccessful. A preliminary report of an integrative system based on microprojectile bombardment and Agrobacterium-mediated transformation under a light regime and a two-step selection cycle has recently appeared (6).
New traits in cut flowers include not only yield improvement and resistance to insects or disease; they also consist of new colors and novel plant morphology. In fact, the latter are of great importance for the cut-flower market, where plant architecture and flower color are the main features determining consumer interest. Nevertheless, agronomic traits, such as performance, remain highly important for breeders and growers as extensively growing and better performing plants can lower the time and cost required for growth and breeding.
Among the different genes affecting plant morphology, e.g. homeotic, Agrobacterium, phytochrome and gibberellin genes, the Agrobacterium rhizogenes rol genes have been the most widely and successfully employed (7,8). Although its precise mode of action is still unknown (9), rolC has attracted the most attention through its expression in transgenic plant—either under its own promoter or under the control of a cauliflower mosaic virus (CaMV) 35S promoter, leading to a series of morphological alterations. These include reduced apical dominance, altered leaf morphology, reduced seed production, reduced internode length, male sterility, small flowers and early flowering, bushy and compact phenotype, and even stem fasciation.
Nevertheless, studies on the rolC gene and its effects on plant development have been performed mostly in model herbaceous plants, e.g. tobacco, potato, and tomato, or forest trees. rolC studies in cut flowers are rather limited—the only report being on a woody ornamental, rose, in the proceedings of a symposium (10). These transgenic rose plants (Rosa hybrida cv. Madame G. Delbard), expressing the rolC gene under its native promoter, exhibited an array of phenotypic alterations, most of which were highly disadvantageous horticulturally. They included a dramatically reduced root system, wrinkled leaves, high sensitivity to diseases and dying out of shoots.
With respect to color, anthocyanins, carotenoids and betalain are the main flower pigments, of which the most studied are the anthocyanins. The great interest in the latter, which derive from the general phenylpropanoid pathway, results from their wide distribution in many plants and microorganisms and their role in color determination. Furthermore, detailed biochemical and genetic analyses of anthocyanin production/accumulation has brought about the development of two main strategies for altering flower color: introducing a foreign gene(s) to allow new branching in the anthocyanin-biosynthesis pathway, and up/down-regulation of this pathway's native genes' expression.
Several genes from the anthocyanin biosynthetic pathway have been used to manipulate flower color in numerous plants. Chalcone synthase (chs), chalcone flavanone isomerase (chi) and flavanone 3-hydroxylase (fht) are the first three genes encoding the early, non-branched segment of the flavonoid biosynthetic pathway (FIG. 17). Although FHT is a key enzyme in this pathway (11) and its suppression, as opposed to that of CHS, should not block the production of the essential phytoalexins, isoflavonoids, it has never been harnessed for the genetic manipulation of flower color.
With respect to flower fragrance, mainly dominated by terpenoids, fatty acid derivatives and benzenoid compounds (phenylpropanoid derivatives), much less is known. To date, only a few genes involved in fragrance production have been characterized.

Transgenic plants and method for transforming carnations

Yissum Research Development Company of the Hebrew University


A gateway device is connected between a switched-circuit communication network and at least two VoIP network domains, each domain having a packet-based signaling controller. The gateway device transfers to each of the signaling controllers a registration request message so that the gateway device is simultaneously registered in the at least two VoIP network domains as a VoIP end point.

In present-day communication systems communication links, in particular real-time connections, e.g., for voice, video or multimedia communication, are increasingly also routed via packet-oriented networks such as Local Area Networks (LANs) or Wide Area Networks (WANs). For example, Internet telephony, frequently also referred to as Voice over Internet Protocol (VoIP) telephony, is based on this technology.
These types of packet-oriented communication networks are frequently linked via gateway equipment to conventional switched-circuit communication networks, such as public or private Integrated Services Digital Network (ISDN) networks in order to implement connections across networks. Such a gateway facility between a packet-oriented and a switched-circuit communication network enables communication links to be routed from the switched-circuit into the packet-oriented communication network and vice versa. In this case the gateway facility performs the required signaling and protocol conversions between the signaling that are used in the packet-oriented and in the switched-circuit communication network.
Currently packet-oriented communication networks for setting up real time communication links are frequently based on ITU-T Recommendation H.323 or on the IETF Standard SIP (Session Initiation Protocol). This type of communication system is frequently also referred to as a VoIP system. The expression VoIP in this document is taken to refer to not only Internet protocol-based speech transmission but also to Internet protocol-based transmission of different media types such as video, fax, data and/or multimedia.
In a VoIP system the terminals and gateway facility belonging to the system register with a central signaling controller of the VoIP system in order to make themselves known in this way to the VoIP system. In VoIP systems in accordance with the H.323 Recommendation a signaling controller of this type is known as a gatekeeper. As well as the registration of terminals and gateway devices, another of the gatekeeper's functions is to resolve called destination addresses into Internet protocol-based transport addresses.
A VoIP system which is administered by one or more logically linked gatekeepers is frequently also referred to as a VoIP domain.
In accordance with the H.323 Recommendation a gateway device is handled by a gateway like a VoIP end point and, like other VoIP end points is assigned to precisely one gatekeeper by registration. On registration the gateway device stores its transport address with the gatekeeper assigned to it so that the gatekeeper can if necessary forward connection signaling to the gateway device.
Because of the assignment of a gateway device to precisely one gatekeeper a number of gateway devices are needed to link a number of VoIP domains to a switched-circuit communication network. However as a rule this requires a significant investment in hardware.

Communication between switched-circuit communication network and VoIP network domains


A method for facilitating a transaction may include generating, via a token server computer, a token for use by a first entity computer, wherein the token is generated in response to a request received from the first entity computer. The method may also include transmitting, via the token server computer, the token to the first entity computer, wherein the first entity computer transmits the token to a second entity computer. The method may also include receiving, at the token server computer and from the first entity computer, data indicative of the second entity computer successfully receiving the token. The data may include a hashed value derived from at least the token, data indicative of an identity of the second entity computer, and writing, by the token server computer, the data indicative of the second entity computer successfully receiving the token to a registry.

Tokenization has become a popular method for increasing the security of transactions. The use of tokenization provides many advantages when conducting these types of transactions, such as improving efficiency and security. For example, a token may be generated to represent a primary account number (PAN) or other type of sensitive data (such as a ticket to an event). Often times, tokens are passed from one entity to another. For example, a token may be passed by one merchant to another merchant in certain integrated systems. However, in modern-day complex ecosystems, it becomes increasingly complex to track the passing of tokens through several entities. It may be important to track the chain of custody of a token to ensure that the token has not been tampered with.
A conventional token transaction system can be illustrated with reference to FIG. 1. In the conventional token transaction system, a token requestor 110 is in communication with a token server computer 120. The token requestor may be an entity computer or device that requests a token from the token server computer 120. The token server computer 120 is responsible for generation and registration of a token. For example, the token requestor 110 requests a token from the token server computer 120 and upon verification, the token server computer 120 generates, registers, and returns the token to the token requestor 110. The token requestor 110 then initiates a payment transaction either directly with (or through a merchant) the payment processor network 130 by sending an authorization request message including the token to the payment processor network 130. The payment processor network 130 then forwards the authorization request message to the issuer 140 for authorization.
While the conventional token transaction system is useful, improvements can be made. For example, often times the token requstor 110 may forward a token received from the token server computer 120 to second entity (not shown), and in turn the second entity may forward the token to a third entity, etc. In such scenarios, it is difficult for the token server computer 120 to track the various handoffs of the token from one entity to another, and maintain a level of a confidence in the integrity and validity of the generated token.
Embodiments of the invention address these and other problems.

Method of distributing tokens and managing token relationships


A cable card having increased cable connector density is provided. The cable card has a non-planar surface and, therefore, more surface area than a planar cable card having the same outside dimensions. The increased surface area of the non-planar surface permits more connectors of a given size to be located on the cable card.

The present invention is generally related to the field of equipment connection. More particularly, the present invention is related to increasing connector density in equipment.
In the highly competitive area of electronic equipment, there is ever present pressure to provide more equipment in a smaller space. The problem is compounded by the high cost of electronic equipment and the associated reluctance on the part of the equipment owner to frequently replace this expensive equipment. When equipment changes are unavoidable, the cost of such changes can be greatly reduced if the cables and connectors used with the existing equipment can be reused. However, the physical size of connectors is often a limiting factor in condensing more equipment into a limited space.
FIGS. 1 and 2 are a front view and a top view, respectively, of an example of equipment in the related art. The example shown in FIGS. 1 and 2 is a piece of computer network equipment having a frame 105 connected to a backpanel 110. Network cards 130 are removably attached to the backpanel 110 and cables 140 are removably attached to backpanel 110 by connectors 120. Cables 140 lead to various other pieces of equipment on the network.
In accordance with the present invention, the above problems are solved by increasing the density of cable connectors attachable to a piece of equipment of a given size. Increasing the number of cable connectors attachable to a piece of equipment of a given size, while maintaining the size of the connectors, increases the capacity of the equipment without increasing the space required by the equipment or requiring expensive and time consuming recabling.
In accordance with the present invention, cable connector density is increased by providing a non-planar cable card to which the cable connectors are attached. A non-planar cable card having, for example, a zig-zag profile provides more surface area than a planar cable card having the same length and width. The increased surface area of the non-planar cable card provides more area for the placement of cable connectors. Therefore, for a given cable connector size, a non-planar cable card can accommodate more connectors than a planar cable card having the same length and width.
The invention permits a new cable card to be fabricated to fit existing equipment and provide an increased number of cable connectors of the same size as the existing equipment. As a result, the connectors on the existing cables need not be changed, avoiding expensive cable modifications and testing.

Method and apparatus to increase cable connector density in equipment


A probe includes a substrate and a tetragonal structure disposed on the substrate that has four end points. Three of the end points are disposed adjacent to the substrate. A fourth of the end points extends outwardly and substantially normal to the substrate. In a method of making a probe tip, a plurality of tetrapods are grown and at least one of the tetrapods is placed on a substrate at a selected location. The tetrapod is affixed to the substrate at the selected location.

1. Field of the Invention
The present invention relates to probe tips and, more specifically, probe tips used in atomic force microscopy and the like.
2. Description of the Prior Art
Atomic Force Microscopes (AFM) are used to measure surface characteristics of materials at the nano scale. AFM's are useful in measuring thin and thick film coatings, ceramics, composites, glasses, synthetic and biological membranes, metals, polymers, and semiconductors, among other things. By using an AFM one can not only image the surface with near atomic resolution but can also measure the forces of the surface of a sample at the nano-Newton scale.
An AFM typically includes a probe with a probe tip extending therefrom. One type of probe is a cantilever; another is a force sensing integrated readout and active tip (FIRAT) probe. A cantilever includes a beam with a probe tip at a distal end. The beam may be angularly deflected to move the probe tip toward the object being measured. When the probe tip begins to interact with the object, the deflection of the beam can be measured by sensing light from a laser reflected off of the beam. A FIRAT probe includes a membrane that is supported by a frame. A FIRAT probe tip is typically affixed to the center of the membrane. The membrane may be displaced vertically by one of several methods. In one such method, the membrane has a first conductive surface that is spaced apart from a second conductive surface. When a similar charge is applied to both the first conductive surface and the second conductive surface, the two surfaces repel each other, thereby forcing the membrane (and the probe tip) away from the second conductive surface. The vertical displacement of the probe tip is controlled in this way. The vertical displacement of the membrane is detected by reflecting light from a laser off of the membrane and passing the reflected light through a diffraction grating and then measuring the intensity of one or more modes of the diffracted light using a photodetector.
Probe tips should be hard relative to the object being measured and should have a high aspect ratio. (Aspect ratio is the ratio of the longest dimension of a probe tip to its widest dimension. Thus, something with a high aspect ration is long and thin.) Also, once mounted, a probe tip should be substantially normal to the probe surface.
With current AFM probe designs, forming and mounting the probe tip is a relatively costly process. Typical methods of making probe tips including cleaving hard crystals to form sharp shards and then gluing the shards to a probe surface. Such methods are complicated and time consuming. Also, getting the probe tip to be normal to the probe surface can be difficult.
Therefore, there is a need for method of making a self-aligned probe tip that is always substantially normal to the probe surface.
There is also a need for a method of making probe tips that have a high aspect ratio.
There is also a need for a method of making probe tips economically.


The device is designed for nebulizing liquids and for transporting the formed aerosols. It includes components to form a fountain of liquid that is being nebulized, a container holder (4), a container (2) with contact medium (3), an additional container (5) with liquid being nebulized (6), a nebulization chamber (7), a system for transporting the aerosol to the user, an outlet duct (11), and a mechanism for regulation of rate of delivery of aerosol. The nebulization chamber (7) is designed as a double-element structure, composed of an intake tube (8) and an expansion chamber (9). In the bottom of the expansion chamber (9) outlets (10) have been made for the drainage of the non-nebulized liquid back to the section of the container remote from the base of the fountain. This reduces the negative action of the non-nebulized liquid on the effectiveness of nebulization. The expansion chamber (9) which is incorporated into the nebulization chamber (7) ensures a significant reduction in coagulation of the aerosol particles, thus increasing the efficiency of the nebulizer and particle uniformity. The latter effect is likewise heightened by this specifically designed outlet duct (10) which accomplishes a process of gravitational filtration. As a consequence of the movement of the stream in the narrow intake tube (8) there is formation of a differential pressure, enabling transport of the aerosol from the nebulization chamber to the user. The above principles are proposed for application to multi-use and single-used devices.

Ultrasonic nebulizers are widely used for the inhalation of medications, nebulization of liquid fuel, moisturisation of air and for other uses.
A typical device for the nebulization and transport of aerosol which is used in ultrasonic nebulizers is described on p.298 of "Utrasound" (in Russian) in the series "Small Encyclopedia", published by "Soviet Encyclopedia" Publishing House, Moscow 1979.
The disadvantage of this device is the return of a large proportion of non-nebulized liquid reflected from the fountain shield back to the liquid being nebulized in the area of the active part of the fountain (i.e. the base), where the intensity of the ultrasound is maximized. This results in both a higher load on the ultrasonic transducer as well as increased waviness of the liquid being nebulized, thus defocusing transmitted energy. Both of these factors reduce effectiveness and stability of nebulization.
It is known that drops of liquid (and particles of aerosol) returning to the container have a higher temperature than the liquid that is being nebulized because of the work necessary for their creation through which they have absorbed added energy. Where these drops return to the liquid being nebulized, the temperature of the liquid changes according to random law. This further destabilises the acoustic characteristics of the medium, intensifying defocusing and lowering efficiency and stability of nebulization.
The other disadvantage of this device is the need of a separate fan for transporting the aerosol to the user.
Some of the disadvantages in the above-mentioned device are avoided in U.S. Pat. No. 4,410,139 issued Oct. 18, 1984. As shown in this patent to reduce the influence which the returning non-nebulized liquid has on effectiveness and stability of the nebulization, the ultrasonic transducer is placed at an angle different from ninety degrees to the axis of the nebulization chamber. On the bottom of the container of this device a slotted partition which surrounds the fountain is set up. It is positioned so that the major portion of the non-nebulized liquid falls outside the perimeter of the partition.
This device has some disadvantages, which reduce its efficiency and complicate its construction. The main disadvantages are:
1. The necessity to put an ultrasonic transducer at an angle to the surface of the liquid being nebulized, which leads to the significant complications in the construction of its mounting in the container holding the liquid being nebulized and therefore increases the dimensions of the said container.. PA0 2. Asymmetry of the nebulization process caused by the axis of the fountain being positioned at an angle to the axis of the container, thus leading to: PA0 3. Additional losses caused by dissipation on the partition of the energy of the ultrasonic wave which passes through the liquid being nebulized. PA0 4. A need for a fan to effect aerosol transport.
a) Increase in waviness of the liquid which then increases defocusing of transmitted energy.
b) Reduction of nebulization efficiency at low levels of liquid, caused by the liquid's surface being non-perpendicular to the direction of propagation of the ultrasonic wave front.
In summary, even though the outlined device allows certain improvement in the efficiency of nebulization, its disadvantages mentioned above restrict substantially its effectiveness.
The object of this invention is the creation of an improved device for nebulization of liquid and transport of aerosol assuring higher efficiency and stability as well as greater uniformity of the aerosol particles and delivery of the aerosol to the user without the need of an added fan; this is to be provided by means of diverting the major portion of the recycled non-nebulized liquid to the area of the container remote from the base of the fountain and the establishment (for transport of the aerosol) of a differential air pressure by reducing the cross-section of a part of the channel along which the stream of the fountain moves (Bernoulli's Law).
This object is achieved by means of designing the nebulization chamber in two parts: the expansion chamber including a bottom in which one incorporates outlet(s), as well as an intake tube inserted in the bottom of the expansion chamber and located above the base of the fountain stream of liquid being nebulized; the system of transport of the aerosol to the user is accomplished in the form of the above mentioned intake tube, and inlet(s) located on any section of the nebulizer with/without a supplementary tube(s) connected to the inlet(s) and passing through any section of the nebulizer in order for the outside air to enter by means of free (unforced) flow into the intake tube from the side of the container holding the liquid being nebulized.

Sheiman Ultrasonic Research Foundation Party, Ltd.


The present invention is directed to an apparatus and method for reliability testing of an integrated circuit. The present invention provides a test structure and method for testing gate and node dielectrics of an integrated circuit wherein a self-heating gate structure is integrated with the product structure itself. Selected conductive lines within the product structure are used as heater elements to provide temperature stressing of the integrated circuit. The localized self-heating gate structure is an integral part of the product chip. Thus, etch and deposition characteristics of the test structure are kept identical to the etch and deposition characteristics of the product itself. As low-voltage technologies make it harder to obtain significant acceleration due to voltage stressing, temperature stressing may be used instead to increase acceleration.

In the reliability engineering of integrated circuits, it is necessary to predict product lifetimes and calculate defect densities. To accomplish this in a short time, it is necessary to subject product samples to environmental conditions that accelerate the failure modes that cause wearout. Typical methods for creating these stress conditions include the use of temperature and voltage such that the stress temperature used for testing exceeds the operating temperature when the circuit is in actual use, and such that the stress voltage used for testing exceeds the operating voltage when the circuit is in actual use.
Voltage acceleration has been used as the primary factor for gate and node dielectric stressing throughout CMOS history. An example of voltage stressing of a memory array is described below with reference to FIGS. 1 through 6.
FIG. 1 illustrates a typical memory array 8 with intersecting word lines 10 and bit lines 12. Referring now to FIG. 2, a three-dimensional plan view of the typical memory array 8 of FIG. 1, in this case a DRAM, is illustrated. Typical DRAMs are known in the art, thus only briefly discussed herein. The DRAM 8 includes intersecting word lines 10 and bit lines 12. Each bit line 12 is connected to a diffusion 14 by way of a via, or contact 16. This connection is shown in greater detail in the enlarged portion of memory array 8, shown in FIG. 3. For simplicity, dielectric material 15 has been omitted except as shown in the enlarged portion of FIG. 3. The DRAM 8 shown uses trench capacitors 18 as the storage elements. However, stack capacitors are also widely used.
Voltage stressing for integrated circuits is known in the art. FIG. 4 depicts a known testing method where all the word lines 10 and bit lines 12 of a test structure are connected together to allow for voltage stressing of all of the gate or node dielectric structures of memory array 8 at the same time. (It is assumed that the substrate is grounded). The portion of the gate dielectric stressed during reliability testing is shown by the dashed line 17 in the enlarged portion of FIG. 3. The node dielectric, i.e., the dielectric (not shown) separating node 18 from the surrounding silicon, is also stressed.
During a voltage stressing of a gate dielectric or of a node 18, a desired word line 10 is activated (i.e. a voltage potential is applied to the word line 10) for turning on an associated field effect transistor (FET) 31 (shown in FIG. 5). As shown in FIG. 5, the associated bit line 20 is thus connected, through connection 30, with a corresponding storage node 18. As discussed below, the voltage potential applied to the bit line is at most twice the use voltage, Vuse. Voltage stressing in this manner stresses both the gate dielectric 17 and the node dielectric (not shown) associated with node 18, or, if no bias is applied to bit line 20, just gate dielectric 17 is stressed. The gate dielectric 17 is also shown (by a dashed line) in FIG. 6, which depicts a side view of FET 31. Of course, either nFETs or pFETs can be used as the array transfer devices.
As operating voltages decrease and the gate dielectrics and junctions get thinner, however, significant voltage acceleration has become more difficult to achieve. One frequently used voltage acceleration model expresses the voltage acceleration by the formula Vacc=e.sup..beta.(Vstress-Vuse). In this formula, .beta. is constant. The acceleration thus is dependent on the voltage difference. However, the junctions/circuits typically can only tolerate a stress voltage, Vstress, of at most twice the use voltage, Vuse. For a 5 volt technology the stress-to-use difference is 10 volts minus 5 volts, resulting in 5 volts, but for a 2.5 volt technology the stress-to-use difference is only 5 volts minus 2.5 volts, resulting in 2.5 volts. Since this difference (Vstress-Vuse)is then raised to a power, the maximum resultant voltage acceleration is significantly reduced. As integrated circuit dimensions continue to decrease, and become ever smaller, this decreasing voltage trend will continue. A use voltage of 1.8 V is already on the horizon. Hence this limitation on voltage acceleration is a very significant new constraint.
During the stressing of gate or node dielectrics, the temperatures normally are limited to 200.degree. C. Wafer probing at higher wafer temperatures typically results in the probes moving slightly and causing damage to the chip. Module stressing can utilize somewhat higher temperatures, but also is limited because of the melting point of the normal chip mount metallurgies. Although special actions can be taken for short term wafer stressing up to 300.degree. C., and special actions can permit module stressing up to at least 300.degree. C., these activities require more expensive equipment and additional experimental time and precautions.
The normal use temperature of a chip is often at least 100.degree. C. If that chip is stressed at 200.degree. C., little temperature acceleration can be achieved. The typical model used for temperature stressing is an Arhennius model of the form Tacc=e.sup..DELTA.Hik.DELTA.T where .DELTA.T=(Tuse-Tstress) Kelvin, k is Boltzman's constant and .DELTA.H is a constant.
If stressing could be done at higher temperatures, the acceleration would be larger, depending on the value of .DELTA.H which typically is between 0.3 and 0.7. This could provide the necessary acceleration to establish the gate and node dielectric reliability for the next several generations.
Given the above-described constraints on voltage differentials and temperature differentials, the problem is how to simply achieve a reasonable acceleration when doing reliability stressing of thin gate and node dielectrics for low voltage technologies.

Structure and method for reliability stressing of dielectrics

International Business Machines Corporation


A power system having an extended life and a system and method for extending the life of a battery powered device. In one embodiment, the method comprises providing a plurality of power sources and an alternate energy source. The method also comprises measuring the voltage of the power sources and the alternate energy source. The method further comprises selecting a power source to provide voltage to the device, wherein the selected power source provides voltage to the device. In addition, the method comprises optionally charging any power source that is providing voltage to the device. Moreover, the method is repeated after a variable delay. Further embodiments include switching to providing the voltage to the device from a power source while charging another power source.

1. Field of the Invention
This invention relates to the field of power systems and more specifically to the field of extending the life of battery powered systems.
2. Background of the Invention
There has been an increasing need to extend the uptime for battery powered devices while also extending the life of the devices. Traditional battery powered devices are only operable for a finite time as traditional batteries have a limited useful life. In addition, the devices are typically inoperable or unusable when their batteries are being charged. When the batteries are sufficiently charged, the device again becomes available. Besides the device downtime involved, further drawbacks include battery memory and reduction in battery life.
For instance, in the field of sensor networks, access to a power grid is typically unavailable. Therefore, the devices are typically independent. A typical drawback is trading off device/network lifetime versus the ability for the devices to transfer data between nodes. Traditional charging schemes either allow the device to run and communicate or allow the device to charge the battery.
Battery powered devices recharged by alternate energy sources have been developed to extend battery life. However, such alternate energy sources typically do not provide enough energy to support full device operation while storing energy for later use. Additional drawbacks include the effects of battery memory because of prematurely discharging the battery before it finishes charging.
Because battery life and uptime can be quality measures of battery powered devices, there is a need for maximizing the lifetime and uptime of an individual independently powered device. Additional needs include increasing the lifetime and uptime of individual powered devices that consume large amounts of power. Further needs include operating an independently powered device while at the same time charging its batteries. In addition, needs include maximizing use of alternate energy sources.


A method of making a lightweight, microwave electronic structure includes the steps of forming a rigid, glass structure having a desired density by a sol-gel process and thereafter uniformly coating the formed glass structure with an adherent and uniform conductor. The sol-gel process may be carried out by polymerizing a mixture comprising silicon alkoxide, water and an alcohol. The coating process may be carried out by coating the glass structure with a solution comprising an organic compound of a metal dissolved in an organic solvent and thereafter volatizing the organic solvent.

1. Field of the Invention
The invention relates generally to lightweight microwave structures and, more particularly, to lightweight microwave structures having excellent thermomechanical stability, and a method of making the same.
2. Brief Description of the Related Art
Due to a desire to minimize payload weight, and thereby reduce costs, it is preferable to use lightweight components whenever possible in the construction of high-power communications satellites. Furthermore, due to the extreme operating conditions (e.g., wide temperature fluctuations) of satellites and the components thereof, it is desirable to make and use components capable of enduring these operating conditions without detrimentally affecting their performance capabilities.
For example, one component used in communications satellites is a microwave resonator, which is a tuned, electromagnetic circuit that transmits energy at or near a resonant frequency. It can be used as a filter to remove electromagnetic signals of unwanted frequencies from input signals and to output signals having a preselected bandwidth centered about one or more resonant frequencies. Typical shapes used for such resonators include cylinders, rectangular bodies, and spheres. Side walls of a cavity defined by the resonator act as a boundary that confines the electromagnetic wave to the enclosed cavity. The frequency of the resonator is a function of the cavity dimensions. Accordingly, a change in temperature can cause the effective dimensions of the cavity to change by expansion or contraction of the resonator material which, in turn, causes the resonant frequency to change.
Microwave electronic components, such as microwave resonators, used in high-power communications satellites have been composed primarily of either conductive metal-plated aluminum or a conductive metal-plated iron-nickel Invar.TM. alloy (hereafter "Invar.TM."). Incorporation of conductive metal-plated aluminum or Invar.TM. into microwave electronic components, such as microwave resonators, has proven particularly troublesome because of their poor thermomechanical stability and/or their high weight.
Microwave electronic components, such as microwave resonators, are often made of aluminum due to its low specific gravity of about 2.7. However, aluminum exhibits poor thermal expansion resistance (i.e., a high coefficient of thermal expansion of about 20 ppm/.degree.C.). Thus, microwave electronic components made of aluminum exhibit poor thermomechanical stability and frequently must be tuned to maintain their resonant frequencies. A temperature compensation membrane, such as the one disclosed in U.S. Pat. No. 4,677,403, may be used to minimize the amount of tuning required to maintain the resonant frequency of an aluminum-based microwave electronic structure in spite of temperature-induced dimensional changes in the aluminum. The use of these membranes, however, results in decreased production efficiency and an increase in manufacturing costs. Furthermore, the added hardware required to tune the microwave electronic structure adds to the weight of the high-power communications satellite.
Invar.TM., an alternative to aluminum, exhibits a higher resistance to thermal expansion (i.e., a low coefficient of thermal expansion of about 1 ppm/.degree.C.). However, Invar.TM. is more dense (having a specific gravity of about 8.0) than aluminum, and therefore is undesirable for use in lightweight satellites.
It would be desirable to provide a lightweight microwave electronic structure, and a method for making the same, wherein the structure, and the material comprising the structure, exhibit thermomechanical stability, chemical durability, mechanical integrity, thermal shock resistance, and tailorable dielectric behavior suitable for use in lightweight spacecraft.

Method of making lightweight, low thermal expansion microwave structures


A temporarily fixing device includes a frame-shaped structure member having a hole in its central part and a stepped portion around the hole; a board mounted on the stepped portion of the frame-shaped structure member; a simultaneously-pressing member into which a base pressing the board to the stepped portion and a pressing portion pressing at least one or more circuit components onto the board are unitized in its connection part; a shaft provided on the frame-shaped structure member so as to rotatably and vertically movably support the base of the simultaneously-pressing member; and a pressure member normally pressing the simultaneously-pressing member to the surface of the frame-shaped structure member.

Conventionally, when a plurality of circuit components such as connectors and switches are secured to a printed board by soldering, the lead terminals of the circuit components are passed through the holes of the printed board to be soldered. Since in soldering the lead terminals thereof the terminals may be dislodged or floated from the holes, the lead terminals are bent to be temporarily fixed to the printed board, followed by the process that the lead terminals are soldered to the board. However, this procedure requires a bending process for bending the lead terminals. For this reason, there is a disclosure for a technology for eliminating the necessity of the above-described bending process by pressing circuit components from above to a board, in order to eliminate the need of the process of bending the lead terminals thereof (for example, see Patent Document 1).
Patent Document 1: JP-A-2005-072441
However, although the arrangement as disclosed in Patent Document 1 does not have the necessity of bending the lead terminals of circuit components, the arrangement individually requires temporary fixing of a board to a frame-shaped structure member and temporary fixing of the circuit components to the board. Therefore, there is a problem that the temporarily fixing process is complicated to thus effect a high production cost.
The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a temporarily fixing device capable of simultaneously temporarily fixing a board to the mounting location of a frame-shaped structure member and at least one or more circuit components of which the lead terminals are inserted in the holes of the board to the board, and thereby, can prevent the accidental dislodgements or lifts of the board and the circuit components in soldering at the same time.


Embodiments of the invention provide systems and methods for facilitating collaboration in a contact center by providing a roster of recommended subject matter experts on a topic related to an ongoing customer contact session. For example, embodiments can use a modification of the skills matching algorithm of the CRM system used to initially select an agent to also evaluate the needs of the service incident, and match those needs with people who would be able to contribute to a conversation and help the agent. The system can then recommend these possible contributors in a ranked order based on how well each collaborator's skills match the requirements of the incident. When the agent requires assistance and creates a conversation, the system can recommend to the agent a list of users that can help, based on the strength of the match to the skill that would equate to the incident.

Embodiments of the present invention relate generally to methods and systems for facilitating collaboration in a contact center and more particularly to providing a roster of recommended subject matter experts on a topic related to an ongoing customer contact session.
Customer Relationship Management (CRM) systems or other contact center systems provide support for customers of a product or service by allowing those users to make requests for service that can include a question posed by the user related to the product or service. Generally speaking, these systems receive requests for service, e.g., in the form of a phone call, web page form, instant message, email, etc., and route the requests to a human agent for addressing the request and providing an answer to the question. In ideal cases, the agent is selected based on the topic of the question or request and a predefined profile of that agent that includes indications of the agent's skills and/or expertise. Once the agent has been selected the customer is placed in contact with the agent and an interactive session can be conducted between the agent and customer using any of the available channels, e.g., voice call, chat, web page form, instant message, email, etc.
Some CRM systems also provide a means for an agent to collaborate with others, i.e., other agents or other subject matter experts, while handling the customer contact. In some cases, the system can provide a workspace or a team workspace that provides a way for users to share and collaborate on data for specific purposes. Some examples of such workspaces are forums, white boards in the Internet domain and workspaces in several enterprise applications. In other cases, collaboration between an agent and another agent or other subject matter expert can take the form of a chat, email exchange, or instant messaging. However, all of the above methods require the agent to decide who they should ask for assistance, based on the agent's knowledge of other people's skills and attributes, or based on pre-defined groups. In other words, agents are only as good as the rolodex of people they know or must "get lucky" by reaching out to a large list of people. Hence, there is a need for improved methods and systems for facilitating collaboration in a contact center.

Recommended roster based on customer relationship management data


An adjustable aligning reel for aligning a misaligned tooth into a predetermined position in an arch of teeth. The adjustable aligning reel comprises an adjustable tensioner which is capable of being mounted on an archwire in operative relationship with the misaligned tooth . The adjustable tensioner comprises a drive shaft having a filament attached thereto. An end of the filament is secured to a bracket which is mounted on the misaligned tooth and the drive shaft is rotated such that a predetermined tension is applied to the tooth. This tension causes the misaligned tooth to be moved towards the predetermined position. The drive shaft comprises a slip gear for preventing the tension applied to the filament from exceeding a preselected tension limit. The adjustable tensioner also includes a ratchet and pawl mechanism for preventing the drive shaft from rotating in a manner that causes the filament to unwind. A keyhole is provided at one end of the drive shaft to facilitate using a tool to rotate the drive shaft and tighten the filament.

1. Field of the Invention
This invention relates to a device for orthodontic tooth alignment, and more particularly, it relates to an adjustable aligning reel for aligning a tooth into a predetermined position in an arch of teeth.
2. Description of Related Art
In the field of orthodontics, it is often desirable or necessary to move a tooth, such as an impacted canine tooth, into an arch of teeth in a patient's mouth. In the past, a force was applied to the misaligned tooth by a rubber elastic or a wire having one end affixed to the tooth and another end coupled to an arch wire which was typically mounted around the arch of teeth. The movement of the tooth was accomplished in large part by rapid movement of the tooth which occurred immediately following visits with an orthodontist who would, for example, tighten the wire. During most of the time between visits with an orthodontist the patient's misaligned tooth was not being moved towards the arch of teeth. Another problem with the methods used in the prior art is that the patient had to visit the orthodontist regularly so that the orthodontist could either replace the rubber elastic or adjust the tension of the wire.

Adjustable aligning reel and methods for aligning a tooth