A composite free layer having a FL1/insertion/FL2 configuration is disclosed for achieving high dR/R, low RA, and low λ in TMR or GMR sensors. Ferromagnetic FL1 and FL2 layers have (+) λ and (−) λ values, respectively. FL1 may be CoFe, CoFeB, or alloys thereof with Ni, Ta, Mn, Ti, W, Zr, Hf, Tb, or Nb. FL2 may be CoFe, NiFe, or alloys thereof with Ni, Ta, Mn, Ti, W, Zr, Hf, Tb, Nb, or B. The thin insertion layer includes at least one magnetic element such as Co, Fe, and Ni, and at least one non-magnetic element selected from Ta, Ti, W, Zr, Hf, Nb, Mo, V, Cr, or B. In a TMR stack with a MgO tunnel barrier, dR/R>60%, λ˜1×10−6, and RA=1.2 ohm-um2 when FL1 is CoFe/CoFeB/CoFe, FL2 is CoFe/NiFe/CoFe, and the insertion layer is CoTa or CoFeBTa.

A TMR sensor otherwise known as a magnetic tunneling junction (MTJ) is a key component in magnetic devices such as Magnetic Random Access Memory (MRAM) and a magnetic recording head. A TMR sensor typically has a stack of layers with a configuration in which two ferromagnetic layers are separated by a thin non-magnetic insulator layer. The sensor stack in a so-called bottom spin valve configuration is generally comprised of a seed (buffer) layer, anti-ferromagnetic (AFM) layer, pinned layer, tunnel barrier layer, free layer, and capping layer that are sequentially formed on a substrate. The free layer serves as a sensing layer that responds to external fields (media field) while the pinned layer is relatively fixed and functions as a reference layer. The electrical resistance through the tunnel barrier layer (insulator layer) varies with the relative orientation of the free layer moment compared with the reference layer moment and thereby converts magnetic signals into electrical signals. In a magnetic read head, the TMR sensor is formed between a bottom shield and a top shield. When a sense current is passed from the top shield to the bottom shield (or top conductor to bottom conductor in a MRAM device) in a direction perpendicular to the planes of the TMR layers (CPP designation), a lower resistance is detected when the magnetization directions of the free and reference layers are in a parallel state ("1" memory state) and a higher resistance is noted when they are in an anti-parallel state or "0" memory state. Alternatively, a TMR sensor may be configured as a current in plane (CIP) structure which indicates the direction of the sense current.
A giant magnetoresistive (GMR) head is another type of memory device. In this design, the insulator layer between the pinned layer and free layer in the TMR stack is replaced by a non-magnetic conductive layer such as copper.
In the TMR stack, the pinned layer may have a synthetic anti-ferromagnetic (SyAF) configuration in which an outer pinned layer is magnetically coupled through a coupling layer to an inner pinned layer that contacts the tunnel barrier. The outer pinned layer has a magnetic moment that is fixed in a certain direction by exchange coupling with the adjacent AFM layer which is magnetized in the same direction. The tunnel barrier layer is so thin that a current through it can be established by quantum mechanical tunneling of conduction electrons.
A TMR sensor is currently the most promising candidate for replacing a GMR sensor in upcoming generations of magnetic recording heads. An advanced TMR sensor may have a cross-sectional area of about 0.1 microns×0.1 microns at the air bearing surface (ABS) plane of the read head. The advantage of a TMR sensor is that a substantially higher MR ratio can be realized than for a GMR sensor. In addition to a high MR ratio, a high performance TMR sensor requires a low areal resistance RA (area×resistance) value, a free layer with low magnetostriction (λ) and low coercivity (Hc), a strong pinned layer, and low interlayer coupling (Hin) through the barrier layer. The MR ratio (also referred to as TMR ratio) is dR/R where R is the minimum resistance of the TMR sensor and dR is the change in resistance observed by changing the magnetic state of the free layer. A higher dR/R improves the readout speed. For high recording density or high frequency applications, RA must be reduced to about 1 to 3 ohm-um2.
A MgO based MTJ is a very promising candidate for high frequency recording applications because its tunneling magnetoresistive (TMR) ratio is significantly higher than for AlOx or TiOx based MTJs as demonstrated by S. Yuasa et al. in "Giant room-temperature magnetoresistance in single crystal Fe/MgO/Fe magnetic tunnel junctions", Nature Materials, 3, 868-871 (2004), and in "Giant tunneling magnetoresistance up to 410% at room temperature in fully epitaxial Co/MgO/Co magnetic tunnel junctions with bcc Co(001) electrodes", Appl. Phys. Lett., 89, 042505 (2006), and by S. Parkin et al. in "Giant tunneling magnetoresistance at room temperature with MgO (100) tunnel barriers", Nature Materials, 3, 862-867 (2004).
CoFeB has been used in the free layer for MgO based MTJs to achieve high MR ratio and a soft magnetic layer. D. Djayaprawira et al. showed that MTJs with a CoFeB/MgO(001)/CoFeB structure made by conventional sputtering can also have a very high MR ratio of 230% with advantages of better flexibility and uniformity in "230% room temperature magnetoresistance in CoFeB/MgO/CoFeB magnetic tunnel junctions", Physics Letters 86, 092502 (2005).
For a low RA application, the MR ratio of CoFeB/Mg/MgO/CoFeB MTJs can reach 138% at RA=2.4 ohm/μm2 according to K. Tsunekawa et al. in "Giant tunneling magnetoresistance effect in low resistance CoFeB/MgO(001)/CoFeB magnetic tunnel junctions for read head applications", Applied Physics Letters 87, 072503 (2005). In this case, a DC-sputtered Mg layer was inserted between the CoFeB pinned layer and an RF-sputtered MgO layer, an idea initially proposed by T. Linn et al. in U.S. Pat. No. 6,841,395 to prevent oxidation of the bottom electrode (CoFe) in a CoFe/MgO (reactive sputtering)/NiFe structure. Also, a Ta getter pre-sputtering prior to RF sputtering a MgO layer can achieve 55% TMR with 0.4 ohm/μm2 as reported by Y. Nagamine et al. in "Ultralow resistance-area product of 0.4 ohm/μm2 and high magnetoresistance above 50% in CoFeB/MgO/CoFeB magnetic junctions", Appl. Phys. Lett., 89, 162507 (2006).
In order to achieve a smaller Hc but still maintain a high TMR ratio, the industry tends to use CoFeB as the free layer in a TMR sensor. Unfortunately, the magnetostriction (λ) of a CoFeB free layer is considerably greater than the maximum acceptable value of about 5×10−6 for high density memory applications. A free layer made of a CoFe/NiFe composite has been employed instead of CoFeB because of its low λ and soft magnetic properties. However, when using a CoFe/NiFe free layer, the TMR ratio will degrade. Another approach is a composite free layer containing CoFeB with a positive λ and a NiFe layer with a negative λ to result in a low λ and magnetic softness for the free layer. However, a CoFeB/NiFe type free layer structure is not usable because direct contact of CoFeB with NiFe will cause a drastic drop in the MR (TMR) ratio. Thus, an improved free layer in a TMR sensor is needed that provides low magnetostriction in combination with a high TMR ratio, low RA value, and low coercivity.
U.S. Pat. No. 7,333,306 and U.S. Patent Application 2007/0047159 show a tri-layered free layer represented by CoFe/CoFeB/NiFe to achieve low coercivity and low magnetostriction for either GMR-CPP or TMR sensors.
In U.S. Patent Application No. 2007/0139827, a free layer is described that includes a sense enhancing layer (Ta) sandwiched between a first ferromagnetic layer and a second ferromagnetic layer. The first ferromagnetic layer has a positive magnetostriction and is made of CoFeB or CoFe based alloys while the second ferromagnetic layer has a negative magnetostriction and is comprised of CoFe, Ni, or NiFe based alloys.
U.S. Patent Application No. 2007/0188942 discloses a free layer comprised three layers that include a lower NiFe or CoFe layer on the tunnel barrier layer, a Ta, Ru, Cu, or W spacer, and a CoFeB, CoFe, or NiFe upper layer.
In U.S. Patent Application 2007/0242396, a free layer is disclosed that comprises FeCo, a Heusler alloy, and NiFe.
U.S. Patent Application No. 2008/0061388 discloses a free layer with a CoFeB/Ru/CoFeTaB configuration.
U.S. Pat. No. 6,982,932 and U.S. Patent Application 2008/0152834 describe free layers that are laminations of NiFe, CoFe, and CoFeB.

TMR device with novel free layer structure


A method for recommending a candidate path includes, in response to receiving a query from a user, looking up a plurality of paths that conform to the query; with respect to a current path among the plurality of paths, obtaining behavior data of the user and behavior data of at least one other user associated with the current path; determining a recommendation indicator associated with the current path, based on the behavior data of the user and the behavior data of the at least one other user; and recommending the candidate path to the user based on at least a recommendation indicator associated with at least one of the plurality of paths.

Various embodiments of the present invention relate to path recommendation, and more specifically, to a method and apparatus for recommending a candidate path based on user behavior data.
With the development of computer technology and positioning technology, various path navigation devices have been developed so far. For example, a user (a vehicle driver) can query a navigation path from a given starting point to a certain destination by an onboard device or a portable navigation device. Using existing navigation devices, a plurality of candidate navigation paths will be returned.
Generally the navigation device may rank a plurality of navigation paths based on standards like distance, time and so on. However, due to differences in respect of users' driving habits and skills, navigation paths recommended to a user by the navigation device is not necessarily suitable for the user's own characteristics and thus might cause inconvenience to the user. For example, suppose the user is a novice driver and has quite limited driving experience, if a highway is recommended as a preferred path by the navigation device to the user, then the user perhaps does not want to choose the highway but prefers an ordinary road where the speed is rather low. At this point, it becomes a current research focus regarding how to recommend, based on a user's own characteristics, a candidate path that better conforms to these characteristics.

This patent is subject to a terminal disclaimer.

INTERNATIONAL BUSINESS MACHINES CORPORATION


The present invention discloses a filter for removing noise, which includes: a lower magnetic body; primary and secondary patterns spirally provided on the lower magnetic body in parallel to each other; an insulating layer for covering the primary and secondary patterns; and an upper magnetic body provided on the insulating layer, wherein the primary and secondary patterns are formed to have a ratio of vertical thickness (T) to horizontal width (W) of 0.27≦T/W≦2.4. According to the present invention, it is possible to improve performance and capacity by implementing high common-mode impedance in the same frequency and reduce manufacturing costs by simplifying structures and processes.

1. Field of the Invention
The present invention relates to a filter for removing noise, and more particularly, to a filter for removing noise that can improve performance and capacity by implementing high common-mode impedance in the same frequency and improving insertion loss and reduce manufacturing costs and improve productivity by simplifying structures and processes.
2. Description of the Related Art
Electronic products, such as digital TVs, smart phones, and notebook computers, have functions for data communication in radio-frequency bands. Such IT electronic products are expected to be more widely used since they have multifunctional and complex features by connecting not only one device but also USBs and other communication ports.
Here, for higher-speed data communication, data are communicated through more internal signal lines by moving from MHz frequency bands to GHz radio-frequency bands.
When more data are communicated between a main device and a peripheral device over a GHz radio-frequency band, it is difficult to provide smooth data processing due to signal delay and other noises.
In order to solve the above problem, an EMI prevention part is provided around the connection between an IT device and a peripheral device. However, conventional EMI prevention parts are used only in limited regions such as specific portions and large-area substrates since they are coil-type and stack-type and have large chip part sizes and poor electrical characteristics. Therefore, there is a need for EMI prevention parts that are suitable for slim, miniaturized, complex, and multifunctional features of electronic products.
A common-mode filter of EMI prevention coil parts, that is, filters for removing noise in accordance with the prior art is described below in detail with reference to FIGS. 1 to 3.
As shown in FIG. 1, a conventional common-mode filter includes a first magnetic substrate 1, an insulating layer 2 provided on the first magnetic substrate 1 and including a first coil pattern 2a and a second coil pattern 2b which are vertically symmetrical to each other, and a second magnetic substrate 3 provided on the insulating layer 2.
Here, the insulating layer 2 including the first coil pattern 2a and the second coil pattern 2b is formed on the first magnetic substrate 1 through a thin-film process. An example of the thin-film process is disclosed in Japanese Patent Application Laid-open No. 8-203737.
And, the second magnetic substrate 3 is bonded to the insulating layer 2 by an adhesive layer 4.
Further, an external electrode 5 is provided to surround both ends of a laminate including the first magnetic substrate 1, the insulating layer 2, and the second magnetic substrate 3, and the external electrode 5 is electrically connected to the first coil pattern 2a and the second coil pattern 2b through the drawn lead wire (not shown).
In the conventional common-mode filter configured as above, the first coil pattern 2a and the second coil pattern 2b are configured to vertically face each other to remove common-mode noise and smoothly pass a differential-mode signal.
More specifically, as shown in FIG. 2, the common-mode noise can't pass through the filter since magnetic fluxes generated by the current flow of the first coil pattern 2a and the second coil pattern 2b reinforce each other to have high impedance, and the differential-mode signal can smoothly pass through the filter since the magnetic fluxes offset each other.
However, in the conventional common-mode filter, as the frequency increases, the differential-mode impedance also increases, thus causing insertion loss.
That is, as the magnetic fluxes flowing between the first coil pattern 2a and the second coil pattern 2b reinforce each other and the frequency increases, the differential-mode impedance also increases, thus increasing the insertion loss.
Especially, the larger the interval between the first coil pattern 2a and the second coil pattern 2b, the higher the differential-mode impedance and the insertion loss. Accordingly, characteristics of the common-mode filter are further deteriorated.
Further, in the conventional common-mode filter, the second magnetic substrate 3 is bonded to the insulating layer 2 by the adhesive layer 4, a magnetic flux flow is further disrupted by non-magnetic characteristics of the adhesive layer 4, thus causing rapid deterioration of characteristics.
In order to overcome the above problem, although it is possible to increase the length of the first coil pattern 2a and the second coil pattern 2b, in such a case, there are disadvantages such as an increase in manufacturing costs of the filter for removing noise and an increase in size of the filter for removing noise.


The present invention is a ski helmet that combines a visor and face shield. Adapted to the ski helmet is a suitably thick strip of resilient foam material positioned across the exterior front-facing surface of the helmet protecting the forehead area of the person wearing the helmet. The face shield can be rotated to various positions which will change the contact area of the face shield and foam strip and thus the amount of air flow between the face shield and user's face. When the face shield is in maximum contact with the foam strip, air flow is minimized.

This invention generally relates to helmets and more specifically to a helmet worn by snow boarders or skiers. Skiers have used helmets for protection against head injuries. Skiers have also used goggles or face shields for protection of the eyes and face not only in the event of a fall, but also against wind velocity when skiing at high speed.
A problem in using this sort of protective wear is that the interior surface of a face shield or goggles tend to fog as a result of the humidity and temperature difference between a person's face during a physical activity and outdoor winter conditions. Also, due to the close proximity of the worn goggles to the face, aerodynamic conditions are less than optimal which substantially reduces visibility in blizzard conditions.
One prior art example of a helmet with defogging capability is U.S. Pat. No. 4,612,675 issued to Broersma. This helmet was designed for motorcyclists and bicyclists and creates a frontward facing air inlet means by partially raising the faceshield which permits airflow circulation to different portions of the interior of the helmet. The Broersma reference is designed with a lower front wall structure to protect the chin and jaw area; essentially protecting the entire head from the neck up.


A method of manufacturing a semiconductor device having buried gates may include forming a stacked structure of sequentially stacked first mask patterns and second mask patterns with equal widths to expose active regions and isolation regions of a semiconductor substrate. After forming reduced first mask patterns by decreasing the width only of the first mask patterns, trenches may be formed in the active regions and the isolation regions by etching the exposed portions of the semiconductor substrate using the second mask patterns as an etch mask. Then, gate insulating films may be formed on inner walls of the trenches in the active regions, and a conductive material may be buried into the trenches in the active regions and the isolation regions to form gates.

1. Field
Example embodiments relate to a method of manufacturing a semiconductor device, for example, to a method of manufacturing a semiconductor device having a buried gate.
2. Description of the Related Art
Memory cells may be reduced or minimized as the integration density of semiconductor devices increases. Accordingly, continuing efforts are being made to obtain a desired or predetermined cell capacitance in a reduced or minimized memory cell and improve cell transistor characteristics. As such, reduced or minimized memory cells may further require smaller cell transistors. In response to such reduction or minimization, various methods of controlling an impurity density in a diffusion layer of cell transistors have been suggested to embody cell transistors that do no have any problems in terms of cell transistor characteristics. However, as a channel length of cell transistors is decreased, various thermal treatments performed when manufacturing semiconductor devices make the control of the depth of a diffusion layer of a transistor more difficult, so that an effective channel length as well as a threshold voltage decrease and may result in short channel effects and thereby, cause problems in operating the cell transistor.
As a method of solving the above-mentioned problems, a buried-gate type transistor has been suggested, in which a trench is formed in a surface of a substrate, and a gate of the buried-gate type transistor is formed within the trench. In the buried-gate type transistor, the gate is formed within the trench to lengthen a distance between a source and a drain. Therefore, an effective channel length may be increased, and thus, short channel effects may be decreased.
Conventionally, in order to fabricate the buried-gate type transistor, an isolation region that defines an active region may be formed in a semiconductor substrate. Then, trenches may be formed in the active region and the isolation region of the semiconductor substrate to form gate electrodes in the trenches. However, as the width of the gate electrode is decreased to embody a higher integrated memory cell, the width of the trench to be formed in the semiconductor device decreases. If a trench with a narrow width as above is formed, an internal width of the trench formed in the isolation region may be slightly greater than an internal width of the trench formed in the active region even when trenches of the same dimension are each formed in the active region and the isolation region as will be described in more detail. Hence, before burying a gate material into the trench, a natural oxide film within the trench may be removed using a conventional etchant. In this case, the materials each constituting the active regions and the isolation regions have different etch rates with respect to the etchant used for removing the natural oxide film. Conventionally, the isolation region that is composed of an oxide film may be slightly consumed by the conventional etchant that removes the natural oxide film. As the result, the internal width of the trench formed in the isolation region is greater than that of the trench formed in the active region. For example, when a polysilicon mask is used as an etch mask for forming the trench, a sidewall of the polysilicon mask may be oxidized as much as a desired or predetermined thickness when forming a gate oxide film within the trench. Therefore, an entrance width of the trench may be less than the internal width of the trench in the isolation region, so that voids may be formed within the trench in the isolation region when performing deposition for burying the gate material within the trench.
If the gate oxide film is grown along the surfaces of the voids once the voids are formed within the trench as above, the gate material buried within the trench may not be recessed as desired because the oxide films formed on the surfaces of the voids may act as an etch mask when etching-back the gate material buried within the trench for forming the buried gate.
In order to overcome the above-described problems, cleaning may be performed after etching-back the gate material buried within the trench. However, if a cleansing solution permeates into the voids, a problem of isotropic etching may occur to adversely increase a removal quantity of the gate material buried within the trench to be more than an intended quantity. In order to form a buried gate having more uniform electrical characteristics for each cell, it may be important to identically control the recess quantity of the gate material buried into the trench. Excessive recess of the gate material within the trench may result in a line break and an increased resistance of the gate. Also, a recess that is less than a desired quantity may cause a short circuit between a buried gate and a direct contact (DC) adjacent to the buried gate. Therefore, the above-mentioned factors may negatively affect the reliability of an obtained transistor.

Method of manufacturing semiconductor device having buried gate


A method for detecting the presence of a transmission signal in a wireless spectrum channel. The frequency of a signal is converted from a first frequency to a second frequency. The signal with the second frequency is filtered to remove signals that are not within the band of the second frequency. An averaged periodogram of the signal is calculated. A value of the averaged periodogram is compared to a threshold. The presence of the transmission signal is detected, if the value of the averaged periodogram exceeds the threshold.

Wireless communication networks are widely deployed to provide various types of services such as voice, packet data, broadcast, and so on. For example, these wireless networks include Code Division Multiple Access 2000 (CDMA2000) networks, Global System for Mobile Communications (GSM) networks, Wideband Code Division Multiple Access (W-CDMA) networks and Worldwide Interoperability for Microwave Access (WiMAX) networks.
Each wireless network utilizes a particular air interface to support over-the-air communication and typically further implements a particular mobile networking protocol that supports roaming and advanced services. For example, a W-CDMA network utilizes a code division multiple access (CDMA) air interface and GSM EDGE Radio Access Network (GERAN) networking protocol.
The telecommunication standards cited above are examples of some of the various communications systems that may be implemented to transmit voice and/or data. Within these systems, multiple channels may be available to be utilized by multiple types of transmissions. Devices within these systems may scan a frequency spectrum of these channels with the goal of identifying unused spectrum, however, certain types of transmissions using a frequency spectrum may not be detected. As such, benefits may be realized by improved systems and methods for detecting the presence of a transmission signal in a wireless channel.

Systems and methods for detecting the presence of a transmission signal in a wireless channel


A comminuting rotor is driven by a rotary current electric motor via a non-positive traction drive, wherein said rotary current electric motor is energized by a controlled frequency converter for operating the comminuting rotor at a predetermined rotational speed during the normal operating phase. A degree of slip of the traction drive is determined and monitored and the rotary current electric motor is controlled for being powered off if a first slip threshold value is exceeded. If a predetermined second threshold of the traction drive slip is exceeded, which is below said first slip threshold, for continuing the operation of the comminuting device, the frequency converter is controlled in a slip operating phase for a closed or open loop control of the traction drive slip to a predetermined third slip threshold value and for reducing the torque output from the rotary current electric motor.

The invention relates to a method for operating a comminuting device, in which method a comminuting rotor is driven by a driving unit at least comprising a rotary current electric motor, via a non-positive traction drive, in particular a belt drive, wherein said rotary current electric motor is energized by a controlled frequency converter, for operating the comminuting rotor at a predetermined rotational speed during the normal operating phase, and wherein a degree of slip of the traction drive is determined and monitored and the rotary current electric motor is controlled for being powered off if a first slip threshold value is exceeded. The invention also relates to a comminuting device for carrying out such a method.
Such comminuting devices or such a method for operating the same are well known in this field and can be used for a variety of materials to be comminuted, such as wood, domestic waste, industrial waste, production remainders etc. To provide the comminution forces that are required, the output power of the electric motor of such a comminuting device may be several 10 KW up to several thousand kW. Here the material to be comminuted is frequently fed to the comminuting rotor while tools mounted to the comminuting rotor act upon the material to be comminuted. Depending on the construction type, the comminuting rotor rotates at a speed of several revolutions up to several hundred revolutions per minute. Considering that with many kinds of materials to be comminuted the comminution process is not performed in a smooth manner, but may be shock-loaded, the requirements are high concerning the stability of the device and particularly the mounting of the rotating parts.
The use of a non-positive traction drive often turns out to be an advantageous alternative to the gear drive mechanism which, too is frequently used and in which an electric motor is connected to the comminuting rotor via a gear mechanism. Depending on the specific application, mechanical gear mechanisms may produce strong running noises or may lead to a harsh, impact-loaded operation of the comminuting device, accompanied by all relevant drawbacks such as noise, vibrancy, and high loads of individual machine elements. Particularly in the case of jamming caused by the occurrence of uncomminutable extraneous materials, the gear mechanism may be severely damaged and shafts may even break. The use of a non-positive traction drive, particularly a belt drive, disposed between the rotary current motor and the comminution rotor turned out to be advantageous, above all with such comminution process. Such a traction drive is relatively resistant to impact loads and has a damping effect on the entire electro-mechanical drive system. If used in such comminuting devices, said belt drive which otherwise has a number of drawbacks such as its design size and wear characteristics, has the advantage that it slips when extraneous material occurs among the material to be comminuted and thus prevents damage to the drive system. For example, if it is detected in such comminuting devices that slip occurs which exceeds a predetermined slip threshold value, the electric motor may be controlled for being powered off.
A comminuting device of this type as well as a method for operating the same are disclosed for example in the German Offenlegungsschrift DE 10 2008 061 734 A1.
Conventional belt drives for comminuting devices are however subject to considerable wear, which results in comparatively short maintenance intervals that must be observed. Further, the operation of such comminuting devices can be complicated because depending on the material to be comminuted it may require frequent stoppage or reversing of the rotor if comminuting material has accumulated. The interruption of the comminuting process can often not be prevented, even if the feeding rate of the material to be comminuted is reduced. It is therefore an object of the present invention to improve a conventional method for operating comminuting devices of this kind or such a comminuting device in such a manner that the above-described problems are removed at least partially.

Comminuting device including a rotary current asynchronous motor and a non-positive traction drive and method for its operation


A method for obtaining information about a subsurface formation from acoustic signals that contain information about the subsurface formation, comprises a) transmitting an optical signal into a fiber optic cable (14) that includes a sensing apparatus (20) comprising a plurality of substantially parallel fiber lengths (24), b) collecting from the sensing apparatus a plurality of received optical signals, each received signal comprising a portion of the transmitted signal that has been reflected from a different segment of a cable length, wherein the different segments are each in different cable lengths and correspond to a single selected location along the sensing cable, and c) processing the collected signals so as to obtain information about an acoustic signal received at the different segments. The cable may be ribbon cable and the lateral distance between the different segments may be less than 10 meters.

Various attempts have been made to provide sensing capabilities in the context of petroleum exploration, production, and monitoring, with varying degrees of success.
Recently, these attempts have included the use of fiber optic cables to detect acoustic energy. Because the cables typically comprise optically conducting fiber containing a plurality of backscattering inhomogeneities along the length of the fiber, such systems allow the distributed measurement of axial strain along an optical fiber by measuring backscattered light from a laser pulse input into the fiber. Because they allow distributed sensing, such systems may be referred to as "distributed acoustic sensing" or "DAS" systems.
DAS systems operate using principles similar to Optical Time-Domain Reflectometry (OTDR). In OTDR, a fiber-optic cable is probed with a laser pulse from an interrogation unit. Defects in the glass backscatter the pulse (Rayleigh scattering) as it propagates along the fiber and the backscattered photons are received in a photodetector. The data is used to map the reflectivity of the fiber along its length. In DAS, external acoustic disturbances modulate the backscattered light from certain sections of the fiber. By recording these traces at high data rates (−5 kHz), DAS transforms the fiber into a large number of distributed microphones or sensors.
One use of DAS systems is in seismic applications, in which seismic sources at known locations transmit acoustic signals into the formation, and/or passive seismic sources emit acoustic energy. The signals are received at seismic sensors after passing through and/or reflecting through the formation. The received signals can be processed to give information about the formation through which they passed. This technology can be used to record a variety of seismic information.
While there exists a variety of commercially available DAS systems that have varying sensitivity, dynamic range, spatial resolution, linearity, etc., these systems tend to have an undesirably low ratio of signal to noise. This is due in part to the nature of back-scattering measurements, which rely on the presence of reflectors along the length of the fiber to provide the distributed sensing.
In addition, it has been discovered that distributed acoustic systems, particularly those that rely on Rayleigh backscattering are subject to significant noise and that the noise is random or statistical in nature. In instances where a high degree of precision is required, such as when a distributed acoustic system is used to monitor seismic signals, the signal to noise ratio is so small as to significantly reduce the value of the sensing system.
One way to increase the signal to noise ratio is to fire multiple light pulses at different frequencies and wavelengths into the fiber. This technique is disadvantageous, however, because it requires more complex data processing and optical components than a single-pulse system.
Thus, it is desirable to improve the signal to noise ratio of a DAS system while maintaining the relatively low cost and simplicity of DAS hardware.

Signal stacking in fiber optic distributed acoustic sensing


A polymer siding panel for mounting on a wall surface that in one embodiment includes at least two horizontal adjacent sections and a plurality of decorative elements integrally formed with the said panel and disposed in at least one row. The panel may also include an upwardly facing channel formed on a rear side of the siding panel opposite the front face; and at least two splicing members. The splicing members may be transparent or translucent and manufactured from a polymer that is the same or different than the polymer of the siding panel, and one of the splicing members may be welded to and joining the sections to one another. The other splicing member can be welded to one of the sections at a side edge opposite the side edge adjoining the other section. The other splicing member may extend beyond the respective side edge.

The present invention relates to decorative exterior wall coverings, and in particular, to bonded injection molded siding panels having attachment elements to facilitate easier installation and functional elements to improve the aesthetics and performance of the panels.
Many types of exterior wall panels are currently known and used in the construction and improvement of residential, commercial, and industrial and other buildings. Typically, such panels are formed from a lightweight composite plastic material and are manufactured using conventional extrusion molding, injection molding, impression molding, vacuum molding or thermal molding processes. Such panels may be formed in various shapes, such as individual elongated sections similar to standard aluminum siding or single panels incorporating one or more rows of individual decorative elements. Individual panels are often connected to other previously installed, identical panels through a vertical attachment and a horizontal attachment by which portions of the panel to be installed overlap portions of previously installed panels.
Some prior known panel designs employ vertical side and horizontal bottom connections that must be viewed and fitted simultaneously by the installer during installation. The problem with these designs is that the installation of such panels is difficult because the installer can only do one connection at a time. Often the installer would attempt to circumvent this problem by first connecting only the vertical side of the horizontal bottom, only to discover that the remaining connection either cannot be attached, or will cause the initial connection to slip out of place.
In addition, many prior known panel designs have both side and bottom connections that require precise fit. Installation of these panels with such precise connections is difficult for several reasons. For example, often an entire row of connection must be attached along the vertical side or horizontal bottom of a panel, necessitating frequent checking and adjusting as the panel is maneuvered into its installed position. Also, this problem is exacerbated by the need for such panels to overlap in order to conceal their attachment points because connections are hidden from the installer as they are attached during installation. The installer is often forced to either position his head in an awkward viewing position near the wall surface when fitting the panel into position.
Further, prior panels have employed fastener attachments located on the rear of the panels that have no relations to reference elements on the front side of the panel. For example, one prior design comprises a series of tabs at intervals on the rear side of the panels that do not correspond to arrangements of any elements or reference points on the front side. This problem hampers installation because as described above, these elements are hidden from the installer during installation and the installer cannot, by simply looking at the front of the panel, identify the locations of the attachment elements on the rear side of the panel.
Prior known panel designs have also employed connections that lock firmly into place upon attachment. The problem with such a connection is that it may be so rigid that it cannot accommodate the inevitable movement associated with thermal expansion or contraction or the settling of the underlying wall surface after the panels are installed. This may cause buckling of the paneling or tearing of the attachments.
Also, many prior panel designs have been difficult to cut, trim, or otherwise adjust to fit into tight areas along the wall surface, such as within the gable of the roofline or the area surrounding windows or other surface irregularities. Some existing panels may only be cut in certain structurally designated locations without comprising their overall structural integrity. Other panels are made of materials that are difficult to cut occasionally requiring certain types of saws and saw blades.
In addition, many installers prefer panels that are well over the 8-foot length such as is common with aluminum siding or extruded vinyl siding. However, the extrusion process is not capable of providing a decorative appearance on the face of a siding panel that has the detail that can be obtained by using a process such as the injection molding process. For example, the extrusion process is not suitable for forming a panel having simulated cedar shake elements. The best process for forming elements of this type is the injection molding process; however, due to the cost of providing dies and extrusion machines of sufficient size, it is not common to use the injection molding process to produce panels that are 8 feet or longer. The vacuum thermal process has also been used to provide a simulated shake element on polymer panels in longer lengths; however, the aesthetic appearance and detail of panels formed with this process is considerably lacking compared to panels formed by the injection molding process.
It is therefore an object of the present invention to provide a wall panel that is easy to install. It is a further object that the invention that the panel have sound connections, but will readily allow for expansion and contraction of panels without comprising the integrity of the connections or adversely affecting the panels. It is also an object of the invention that the panels may be readily installed by a single installer. Another object of the invention is to provide a siding panel that may be formed by the injection molding process to obtain the superior aesthetics of simulated building elements such as cedar shake and that can be produced in lengths of 8 feet or longer.
One method of joining panels of a shorter lengths to form panels of a longer length by using a splicing member is disclosed in U.S. Pat. Nos. 6,050,041 and 6,393,792 B1, both to Mowery et al, and both of which are incorporated in their entirety herein by reference. Mowery, et al, discloses a splicing member having a formed flange that is received in a protruding flange of the panel. The splicing member may be attached to the panels using a fastener such as a rivet or screw, by use of an adhesive, or by welding the splicing member to the panels. It would be desirable, however, to provide a simple splicing member that can be used to join two sections of panel members together and that does not require locking flanges.
As such, an additional object of the invention is to provide a panel that has two or more sections joined together using a splicing member that does not require a flange or other interlocking configuration that fits into the flange portion of the panels therein.
A further object of the invention is to provide a method for cutting panels that are fused together to minimize waste. These and other objects of the invention have been accomplished by the decorative wall panels as set forth and described below.


A method and apparatus to compute a fastest route is described. The method uses the speed of a plurality of informer vehicles as data collection agents to summarize traffic conditions. A central processing point collects the data. Navigation systems in receiving vehicles use the summarized traffic conditions data to generate faster routes from a current location to a destination.

Modern navigational systems have become a popular option in new automobiles. In such systems, a driver or a passenger inputs a desired destination. A sensor, such as a global positioning system (GPS) sensor, then determines the location of the automobile. A navigation system processor uses the driver input and the sensor output to compute a route from the location to the destination. The route is typically the most direct route available using freeways.
A storage device, such as a compact disk, a DVD, a hard drive, a non-volatile semiconductor memory or other equivalent storage mechanism typically provides a map of many available routes to the navigation system. The storage mechanism may be updated every few months, or every few years to account for new roads being built, road closures and other changes due to construction. However no mechanism is provided to easily determine short term changes that occur in days, hours or even minutes. Such changes that may include accidents, traffic jams or roadwork can easily make a particular route more or less desirable.
Thus an improved navigation system that takes into account real time data is needed.


An imaging lens is constituted by six lenses, including: a first lens having a positive refractive power and a convex surface toward the object side; a second lens having a negative refractive power and a convex surface toward the object side; a third lens having a positive refractive power; a fourth lens having a positive refractive power; a fifth lens having a positive refractive power and a convex surface toward the object side; and a sixth lens having a negative refractive power, provided in this order from the object side. The imaging lens satisfies a predetermined conditional formula.

Technical Field
The present invention is related to a fixed focus imaging lens for forming optical images of subjects onto an imaging element such as a CCD (Charge Coupled Device) and a CMOS (Complementary Metal Oxide Semiconductor). The present invention is also related to an imaging apparatus provided with the imaging lens that performs photography such as a digital still camera, a cellular telephone with a built in camera, a PDA (Personal Digital Assistant), a smart phone, a tablet type terminal, and a portable gaming device.
Background Art
Accompanying the recent spread of personal computers in households, digital still cameras capable of inputting image data such as photographed scenes and portraits into personal computers are rapidly becoming available. In addition, many cellular telephones, smart phones, and tablet type terminals are being equipped with camera modules for inputting images. Imaging elements such as CCD's and CMOS's are employed in these devices having photography functions. Recently, miniaturization of these imaging elements is advancing, and there is demand for miniaturization of the entirety of the photography devices as well as imaging lenses to be mounted thereon. At the same time, the number of pixels in imaging elements is increasing, and there is demand for high resolution and high performance of imaging lenses. Performance corresponding to 5 megapixels or greater, and more preferably 8 megapixels or greater, is desired.
In response to such demands, imaging lenses having a five lens configuration, which is a comparatively large number of lenses, and imaging lenses having a six lens configuration, which has a greater number of lenses in order to improve performance further, have been proposed. For example, International Patent Publication No. WO2014/006822, U.S. Patent Application Publication No. 20120188654, U.S. Patent Application Publication No. 20120262806, Taiwanese Patent Publication No. 201331663, and Korean Patent Publication No. 10-2011-0024872 propose imaging lenses having six lens configurations.

Imaging lens and imaging apparatus equipped with the imaging lens


A thermal management system (101), comprising (a) a synthetic jet actuator (103), and (b) a processor (107) in communication with the synthetic jet actuator, the processor being adapted to receive programming instructions, and being further adapted to modify the operation of the synthetic jet actuator in response to the programming instructions.

As the size of semiconductor devices has continued to shrink and circuit densities have increased accordingly, the thermal management of these devices has become more challenging. This problem is expected to worsen in the foreseeable future.
In the past, the thermal management of semiconductor devices and the equipment that incorporates them was often addressed through the use of forced convective air cooling, either alone or in conjunction with various heat sink devices, and was accomplished through the use of fans. However, fan-based cooling systems were found to be undesirable due to the electromagnetic interference and acoustical footprint attendant to their use. Moreover, the use of fans requires relatively large moving parts, and correspondingly high power inputs, in order to achieve the desired level of heat transfer.
More recently, thermal management systems have been developed which utilize synthetic jet ejectors. These systems are more energy efficient than comparable fan-based systems, and also offer reduced levels of noise and electromagnetic interference. Systems of this type are described in greater detail in U.S. Pat. No. 6,588,497 (Glezer et al.).
While thermal management systems which utilize synthetic jet ejectors have a number of advantages over other types of thermal management systems, further improvements in these systems are required to more fully leverage the synthetic jet ejector technology. Some of these improvements are realized in the devices, methodologies and systems disclosed herein.

Electronics package for synthetic jet ejectors


Novel compounds, their salts and compositions related thereto having activity against mammalian factor Xa are disclosed. The novel compounds include peptide aldehyde analogues having substantial potency and specificity as inhibitors of mammalian factor Xa are further disclosed. The compounds are thought useful as inhibitors of factor xa in vitro or as a therapeutic agent for the prevention and treatment of conditions characterized by abnormal thrombosis in mammals. Intermediates useful for the preparation of the novel compounds are also disclosed.

Normal hemostasis is the result of a complex balance between the processes of clot formation (blood coagulation) and clot dissolution (fibrinolysis). The complex interactions between blood cells, specific plasma proteins and the vascular surface maintain the fluidity of blood unless injury and blood loss occur. Many significant disease states are related to abnormal hemostasis. Abnormal thrombus formation occurring in the coronary arterial vasculature due to the rupture of an established atherosclerotic plague is the major cause of acute myocardial infarction and unstable angina. Treatment of occlusive coronary thrombus by either thrombolytic therapy or percutaneous transluminal angioplasty is often accompanied by an acute thrombotic reclosure of the affected vessel which requires immediate resolution. A high percentage of patients undergoing major surgery in the lower extremities or the abdominal area suffer from thrombus formation in the venous vasculature which can result in reduced blood flow to the affected extremity and a predisposition to pulmonary embolism. Disseminated intravascular coagulopathy commonly occurs during septic shock, certain viral infections and cancer and is characterized by the rapid consumption of coagulation factors and systemic coagulation which results in the formation of life-threatening thrombi occurring throughout the vasculature leading to wide-spread organ failure.
Blood coagulation is the culmination of a series of amplified reactions in which several specific zymogens of serine proteases in plasma are activated by limited proteolysis. This results in the formation of an insoluble fibrin matrix which is required for the stabilization of the primary hemostatic plug. The interaction and propagation of the activation reactions occurs through the extrinsic and intrinsic pathways of coagulation as reviewed by Mackie, I. J. and Bull, H. A., "Normal Hemostasis and its Regulation" Blood Reviews, 3: 237-250 (1989). Both pathways are highly inter-dependent and converge in the formation of the serine protease factor xa from its zymogen, factor X. Factor Xa catalyzes the penultimate step in the blood coagulation cascade which is the formation of the serine protease thrombin. Thrombin goes on to cleave soluble fibrinogen in the plasma to form insoluble fibrin.
The biochemical and physiological characterization of factor X has been reviewed by Steinberg, M. and Nemerson, Y., "Activation of Factor X", Hemostasis and Thrombosis, First Edit., pp 91-111 (Colman, R. et. al. eds. 1982) and Mann, K. G. et. al., "Surface-Dependent Reactions of the Vitamin K-Dependent Enzyme Complexes", Blood, 76: 1-16 (1990). Human factor X circulates in plasma at a concentration of 170 nM. The enzyme is a two-chain glycoprotein containing 442 amino acid residues having an overall molecular size (Mr) of 59,000 as determined by sedimentation equilibrium centrifugation and approximately 67,000 by sodium dodecyl sulfate electrophoresis. DiScipio et. al., "A comparison of human prothrombin, Factor IX (Christmas Factor), Factor X (Stuart Factor) and Protein S", Biochemistry, 16: 698-706 (1977) and Leyfus et. al., "Characterization of a cDNA coding for human Factor X", Proc. Natl. Acad. Sci. USA, 82: 3699 (1984). Human factor X contains a light-chain subunit containing 139 amino acid residues (Mr=16,200) and a heavy chain subunit containing 303 amino acid residues (Mr=42,000) linked together by a single disulfide bond. The light chain of human factor X contains 11 glutamic acid residues which have been post-translationally modified to .gamma.-carboxy-glutamic acid and one asparagine acid moiety modified to .beta.-hydroxy aspartic acid. The heavy chain of factor X contains all of the glycosylated residues (15% overall) as well as the catalytic domain of the molecule.
Proteolytic activation of zymogen factor X to its catalytically active form, factor Xa, can occur by either the intrinsic or extrinsic coagulation pathways. The intrinsic pathway is referred to as intrinsic because everything needed for clotting is in the blood. Saito, H., "Normal Hemostatic Mechanisms", Disorders of Hemostasis, pp. 27-29, Grune & Stratton, Inc. (O. D. Ratnoff, M.D. and C. D. Forbes, M.D. edit. 1984). This pathway is comprised of the zymogen serine proteases, factors IX and XI, and the non-enzymatic co-factor, factor VIII. The initiation of the intrinsic pathway results in the activation of factor XI to XIa. Factor XIa catalyzes the activation of factor IX to factor IXa which in combination with the activated form of factor VIII on an appropriate phospholipid surface, results in the formation of the tenase complex. This complex also catalyzes the formation of the serine protease, factor Xa, from its zymogen, factor X, which subsequently results in clot formation.
The extrinsic pathway is referred to as extrinsic because the tissue factor which binds to and begins activation of factor VII comes from outside the blood. Saito, Id, The major components of this pathway are the zymogen serine protease, factor VII, and the membrane bound protein, tissue factor. The latter serves as the requisite non-enzymatic co-factor for this enzyme. The initiation of this pathway is thought to be an autocatalytic event resulting from the activation of zymogen factor VII by trace levels of activated factor VII (factor VIIa), both of which are bound to newly exposed tissue factor on membrane surfaces at sites of vascular damage. The factor VIIa/tissue factor complex directly catalyzes the formation of the serine protease, factor Xa, from its zymogen, factor X. Exposure of blood to injured tissue initiates blood clotting by the extrinsic pathway.
Proteolytic activation of zymogen factor X to its catalytically active form, factor Xa, results in the liberation of a 52 amino acid activation peptide from the amino-terminus of the heavy chain subunit. The intrinsic activation reaction is catalyzed by factor Ixa in a macromolecular complex with the non-enzymatic co-factor, factor VIII. Factor Xa formation via the extrinsic pathway is catalyzed by the catalytic complex of factor VIIa and tissue factor. Both of these reactions must occur on an appropriate phospholipid surface in the presence of calcium ions. The active product formed following either intrinsic or extrinsic activation of factor X is .alpha.-factor Xa. A second proteolytic cleavage which is thought to be autocatalytic, results in the formation of .beta.-factor Xa following the release of a 14 amino acid peptide from the carboxy-terminus of the heavy chain. Both forms of the activated molecule have the same catalytic activity as measured by their ability to promote coagulation in plasma or hydrolyze a peptidyl chromogenic substrate.
The formation of thrombin is catalyzed by factor Xa following the assembly of the catalytic prothrombinase complex as reviewed by Mann, K. G. et. al., "Surface-Dependent Reactions of the Vitamin K-Dependent Enzyme Complexes", Blood, 76: 1-16 (1990). This complex is composed of factor xa, the non-enzymatic co-factor Va and the substrate prothrombin all assembled on an appropriate phospholipid surface. The requirement of a macromolecular complex for efficient catalysis results in the protection of factor Xa from natural anticoagulant mechanisms such as heparin-antithrombin III mediated inhibition. Teite, J. M. and Rosenberg, R. D., "Protection of Factor Xa from neutralization by the heparin-antithrombin complex", J. Clin. Invest., 71: 1383-1391(1983). In addition sequestration of factor Xa in the prothrombinase complex also renders it resistant to inhibition by exogenous heparin therapy which also requires antithrombin III to elicit its anticoagulant effect.
Several examples of naturally occurring polypeptide inhibitors of factor Xa have been reported to have excellent specificity and potency. U.S. Pat. No. 4,588,587 to Gasic describes the anticoagulant activity of Haementeria offcinalis leech saliva. A principal component of the leech saliva, Antistasin was said to inhibit factor xa. See, Tuszynski, G. P. et. al., "Isolation and characterization of antistasin, an inhibitor of metastasis and coagulation", J. Biol. Chem., 262: 9718-9723 (1987); Nutt, E. et. al.,"The amino acid sequence of antistasin, a potent inhibitor of Factor xa reveals a repeated internal structure", J. Biol. Chem., 63: 10162-10167 (1988); Dunwiddie, C. et. al., "Antistasin, a leech-derived inhibitor of factor Xa, kinetic analysis of enzyme inhibition and identification of the reactive site", J. Biol. Chem., 264:16694-16699 (1989); and Han, J. H. et. al., "Cloning and expression of cDNA encoding antistasin, a leech-derived protein having anti-coagulant and anti-metastatic properties", Gene, 75: 47-57 (1989).
A polypeptide reported to be a selective and potent inhibitor of factor Xa was originally isolated from whole body extracts of the soft tick Ornithidoros moubata. See Waxman, L. et. al., "Tick anticoagulant peptide (TAP) is a novel inhibitor of blood coagulation factor Xa", Science, 248: 593-596(1990); Neeper M. P. et al.,"Characterization of recombinant tick anticoagulant peptide, a highly selective inhibitor of blood coagulation, factor Xa", J. Biol. Chem., 265: 17746-17752 (1990); and Jordan, S. P. et. al., "Tick anticoagulant peptide: kinetic analysis of the recombinant inhibitor with blood coagulation factor Xa", Biochemistry, 29: 11095-11100 (1990); and Vlasuk et al., U.S. Pat. No. 5,239,058 (Aug. 24, 1993).
Plasma has been reported to contain a common inhibitor of both factor Xa and factor VIIa-tissue factor complex called lipoprotein-associated coagulation inhibitor (LACI). LACI is reported to consist of 276 amino acids and has been reported to inhibit the proteolytic activity of factor Xa directly, and in a factor Xa-dependent manner, factor VIIa-tissue factor complex. Girard, T. J. et al., Nature, 338: 518-520 (1989).
Other polypeptide inhibitors of factor Xa have also been reported. See, e.g., Jacobs, J. W. et. al., "Isolation and characterization of a coagulation factor Xa inhibitor from Black fly salivary glands", Thromb. Haemostas., 64: 235-238 (1990); Condra, C. et. al., "Isolation and structural characterization of a potent inhibitor of coagulation factor Xa from the leech Haementeria ghilianii", Thromb. Haemost., 61: 437-441 (1989); Brankamp, R. G. et. al., "Ghilantens: anticoagulants, antimetastatic proteins from the South American leech Haementeria ghilianii", J. Lab. Clin. Med., 115: 89-97 (1990); Blankenship, D. T. et. al., "Amino acid sequence of ghilanten: anti-coagulant-antimetastatic principle of the South American leech, Haementeria ghilianii"", Biochem. Biophys. Res. Commun., 166: 1384-1389 (1990); and Rigbi, M. et. al.,"Bovine factor Xa inhibiting factor and pharmaceutical compositions containing the same", European Patent Application, publication no. 352,903 (1990).
In addition to the above polypeptide inhibitors of factor Xa, small molecule inhibitors of this enzyme have been reported. See, Kam, et. al., "Mechanism based isocoumarin inhibitors for trypsin and blood coagulation serine proteases: new anticoagulants", Biochemistry, 27: 2547-2557 (1988); Tidwell, R. R. et. al., "Strategies for anticoagulation with synthetic protease inhibitors. Xa inhibitors versus thrombin inhibitors", Thromb. Res., 19: 339-349 (1980); Hitomi, Y. et. al., "Inhibitory effect of a new synthetic protease inhibitor (FUT-175) on the coagulation system", Haemostasis, 15: 164-168 (1985); Turner, A. D. et. al., "p-Amidino esters as irreversible inhibitors of factors IXa and Xa and thrombin", Biochemistry, 25: 4929-4935 (1986); and Sturzebecher, J. et. al., "Synthetic inhibitors of bovine factor Xa and thrombin. Comparison of their anticoagulant efficiency", Thromb. Res., 54: 245-252 (1989).
Unlike the reported polypeptide inhibitors of factor xa, the known small molecule inhibitors have been reported to be relatively non-selective with respect to the inhibition of other serine proteases. For example, 6-amidino-2-naphthyl-p-guanidinobenzoate dimethanesulfonate (FUT-175) inhibits human factor Xa and human thrombin similarly, yielding inhibitor constants of 4.1 .mu.M and 1.3 .mu.M, respectively. Hitomi et al., supra, at p. 166. p-Amidinophenyl .alpha.-methylcinnamate irreversibly inactivates human factor xa, human factor XIa and human thrombin similarly yielding second-order rate constants of inactivation of 9.9.times.10.sup.4, 16.times.10.sup.4, and 16.times.10.sup.4 M.sup.-1 min.sup.-1, respectively. Turner et al., supra, at p. 4932.


An electronic device includes a chassis, a motherboard, an airflow duct, and an expansion card. The chassis includes a bottom wall, a rear wall, and a sidewall. A motherboard is disposed on the bottom wall, and a riser card perpendicularly connected to the motherboard. An expansion card is parallel to the motherboard and inserted in the riser card. The expansion card has a first end and a second end. The first end is secured to the rear wall of the chassis. An airflow duct is located on the bottom wall of the chassis. The airflow duct includes a mounting wall parallel to the chassis rear wall. The first end of the expansion card is secured to the rear wall, and the second end of the expansion card is mounted to the mounting wall of the airflow duct.

1. Technical Field
The present disclosure relates to electronic devices, particularly, to an electronic device with an expansion card and holder.
2. Description of Related Art
For enhancing the capabilities of a computer system, they usually include expansion cards, such as sound cards, video cards, graphics cards etc. Conventionally, an expansion card is coupled to a riser card, and one end of the expansion card is secured to a rear wall of the computer system enclosure. However, some expansion cards have longer sizes. If the long expansion cards are secured to the computer enclosure in the conventional manner, it can be unstable. Therefore what is needed is an expansion card holder that will secure the longer expansion cards.

Electronic device with expansion card and holder

Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.


Device to detect leaks and fatigue in membranes wherein the membrane consists of at least two membrane layers, and wherein at least one of the membrane layers includes a conductor on its inner surface that causes an alteration to a measured value in case of an alteration to either the membrane or the conductor.

Membranes enjoy widespread use. One frequent application is in machines having a hydraulic or pneumatic drive. In such machines, movement of the membrane transports a fluid. Membrane or diaphragm pumps are also widely used in the pharmaceutical, biological, and foodstuff industries. In such applications, a high degree of purity of the transported fluid is important. Another application field is the chemical industry, in which it is of primary importance that the transported fluid not leak out, since it may be poisonous, toxic, or flammable. In such applications, it is desirable, and sometimes necessary, that the membrane be constantly checked for integrity. Several mechanisms are known which perform this function.
The published German Patent Application No. DE OS 37 29 726 describes a membrane-machine unit that having at least two membranes which form a gap between them that is connected to a fluid leak sensor. If one or the other membrane is ruptured, the fluid enters the gap between the membranes, and the sensor reports the leak. Such a device is relatively inefficient in design, and problems may only be detected after a relatively large amount of fluid has leaked. Also, the effect may only be measurable after the closely-positioned membranes are forced apart by the leaking fluid.
Only then can the fluid reach the sensor. Additionally, the fluid must also reach the sensor""s location.
The published European Patent No. EP 0 486 618 describes another arrangement for detecting a membrane fault wherein two membranes are mounted with a sensor between them to detect the presence of fluid between the membranes. Here also, the detection occurs only after a large quantity of fluid has entered the space between the two membranes. Additionally, the design of the membranes with the accompanying detector is very inefficient.
The European Patent No. EP 0 715 690 presents yet another method of detecting a damaged membrane. This patent provides a pump membrane that contains a layer of sealed, porous polytetrafluorethylene (PTFE) in which an electrically-conducting fiber made of expanded porous PTFE is embedded. The ends of the fiber are connected to an electrical measuring device. By measuring changes in conductivity of the fiber, fatigue or cracks in the membrane may be detected. This design has the disadvantage that it is very expensive to produce, and is therefore associated with high cost.
The principal object of the present invention is to provide a device to detect leaks or fatigue in membranes that is simple in design and may be produced at low cost.
This object, as well as other objects which will become apparent from the discussion that follows, are achieved, in accordance with the present invention, by constructing the membrane of two membrane layers to form a double membrane, and providing at least one of the membrane layers with at least one conductor that results in a change in measured value in response to any change in either the membrane or the conductor.
With such a membrane construction, optical devices used to detect fluid accumulations are no longer required, and it is also no longer necessary to embed an electrical conductor directly into a membrane layer. Along with an advantageous simplicity of manufacture, there is also the advantage that damage to the membrane, as well as the magnitude of the damage, may be detected quickly.
A very simple option exists of emplacing electrically-conducting metal conductors or elastomer loops. Loops may, for example, be arranged radially in the membrane. Other configurations are certainly possible.
Based on another implementation of the invention, an optical fiber consisting of a glass or plastic fiber might be added to a membrane layer. Such an optical conductor could be in the form of a closed spiral circuit or open conductor spiral with reflecting end.
The conductor might also consist of a channel mounted on a membrane layer that contains a fluid. The channel would be arranged concentrically around the membrane layer center.
In a particularly space-saving and easy-to-produce monitoring device according to the invention, the conductor comprises a conductive xe2x80x9cfleecexe2x80x9d material (a fabric of non-woven material) or piece of elastomer. Thus, the entire surface of the pertinent membrane layer may be coated so that a very precise location of a fault could be determined. The fleece piece might be produced from a fleece containing carbon fiber. This would allow various configurations to be pressed out. Formation of the piece of fleece or elastomer as a fabric made of metallic or carbon fibers is a further possibility.
Another very useful implementation of the invention might include an elastomeric element containing metal or carbon particles that are imprinted onto the membrane layers using a silkscreen method. This would produce a particularly flat membrane.
Another advantageous implementation might be achieved by using an elastomer conductor formed from an electrically-conducting foil vulcanized onto the membrane layer.
This new membrane monitoring device would in principle be formed of two membrane layers, where at least one would contain a conductor on its inner surface that detects damage to the membrane and passes a signal to a measurement or signaling device attached to it. This results in a layered construction of the membrane consisting of membrane layer, conductor layer, and membrane layer in its simplest form. The membrane layers could be produced from materials suitable to the membrane application. One very useful implementation form, particularly when the membrane is used for foodstuffs or chemical products, would be achieved if the membrane layer in contact with the fluid being transported were made of PTFE (polytetrafluorethylene) and the exterior membrane layer were made of an elastomer. The PTFE membrane layer would be particularly resistant to aggressive chemical substances, while the elastomer membrane layer would be very flexible. If a leak occurred in the PTFE membrane layer, it would be detected via the monitoring conductor mounted on the inner side of that membrane layer and reported. The elastomer membrane layer would itself remain intact, fulfilling the function of a second barrier. The most advantageous form of the membrane would be achieved if the membrane were to consist of a double membrane made using a PTFE (or similar material) membrane layer and an elastomer membrane layer, wherein each membrane layer be coated on its inner surface with a layer of electrically-conducting material, and wherein the layers be separated from each other by an electrically-insulating porous fleece layer. Production of such a membrane is relatively simple, and the entire surface of the membrane would be coated so that even the most minor damage could be detected.
Mounting of the conductors onto each membrane layer could be achieved using various methods. Advantageous options include thermal adhesive, vulcanization, or similar methods.
For a full understanding of the present invention, reference should now be made to the following detailed description of the preferred embodiments of the invention as illustrated in the accompanying drawings.

Device for detecting membrane leaks in a diaphragm pump


For transporting data packets of a data stream between a packet-oriented network (LAN) and a channel-oriented data stream processing module (VMOD), a data stream controller (ST) is provided which, via a data channel allocation module (VMUX), accesses an interface module (PS) for exchanging the data packets with the network (LAN) and/or accesses the data stream processing module (VMOD). The data stream controller (ST) transmits a data channel allocation information item (DKl1, DKl2) to the interface module (PS) and/or to the data stream processing module (VMOD). Using a data channel allocation information item (DKl1, DKl2) in each case transmitted, the data packets are transmitted directly between the interface module (PS) and the data stream processing module (VMOD), bypassing the data channel allocation module (VMUX).

The invention relates to a method and a system for transporting data packets of a data stream between a packet-oriented data network and at least one channel-oriented data stream processing module. In particular, one aspect of the invention relates to data transport in the context of a so-called stream architecture.
Data streams and, in particular, communication data streams, such as e.g. voice, video and/or multimedia data streams, are increasingly transmitted in the form of discrete data packets via packet-oriented networks, such as e.g. local area networks (LAN) or wide area networks (WAN). To receive and process further data streams transmitted via a packet-oriented network, its data packets must be extracted from the network and supplied to appropriate data processing modules, such as e.g. software applications or digital signal processors. The further processing can relate to e.g. decoding, decompression, outputting or conversion to a circuit-oriented transmission protocol. Such data stream processing modules are in most cases of multichannel design.
To transmit data packets of a data stream between a packet-oriented network and a channel-oriented data stream processing module, the so-called stream architecture known from the environment of the Unix operating system is found to be particularly advantageous. The stream architecture is of modular composition of predetermined layers of standard software components. As a consequence, the stream architecture is highly portable and allows for simple integration of additional services. To transmit data packets between a packet-oriented network and a channel-oriented data stream processing module, according to the stream architecture, an interface module for exchanging the data packets with the network, an interface driver, a so-called voice multiplexer for data channel allocation, a so-called voice module for preprocessing the useful voice data and a driver for a voice-processing signal processor or a voice-processing application must be provided. The modules are in each case coupled via input and output queues in the order specified. Data are transported via the modules in the order specified. The data transport is controlled by a data stream controller (call processing) which accesses the other modules via the voice multiplexer.
However, the type of data transport specified requires relatively high processor power, particularly with a high number of data channels. In addition, the data packets are delayed in a not insignificant manner.

Method and system for transporting data packets of a data stream


Disclosed is a seismic damper for ground equipment such as high voltage breakers and disconnect switches. The disclosed seismic damper is reactive to low frequency seismic disturbances and provides damping in response to both upward and downward vertical forces. The seismic damper is adapted to be connected to such equipment without modifying the equipment. When the seismic dampers are connected to the equipment, the equipment's natural frequency in response to seismic disturbances is reduced. This reduction results from the particular use of a stacked ring compression spring and the particular configuration and assembly of the components of the seismic damper.

Large equipment such as high voltage circuit breakers or other switching devices, cannot respond adequately when exposed to a seismic disturbance with a frequency at or above the equipment's natural frequency. As a result of the seismic disturbance, resonant energy builds within the equipment. If the resonant energy becomes too large, deformities can result in the structural materials of the equipment. Ultimately, if a large number of structural deformities occur, the equipment may suffer catastrophic failure.
It is known to utilize spring deflection to absorb the energy of suddenly applied loads and store the energy for subsequent release. The amount of energy stored in a spring is a function of the spring's stiffness K or the spring constant and the distance x the spring is compressed. Some devices attempt to accommodate seismic deflections by either storing the kinetic energy of the seismic force and subsequently releasing the energy back to the earth, or by transferring the energy to the attached equipment, often at a lower frequency than the original seismic force. However, these devices when connected to the equipment have been ineffective in protecting the equipment from sudden seismic events, in part, because such devices do not effectively reduce the equipment's natural frequency.
Often, the spring constants are so large (i.e. the springs are so stiff), that the springs do not reduce the equipment's natural frequency when connected to the equipment in response to low frequency events like earthquakes. Rather, the seismic forces are transferred through the unreactive spring-loaded devices to the equipment. Ultimately, if the forces exerted through the spring are of a large enough magnitude and high enough frequency, the electrical equipment can fail. Therefore, the equipment's natural frequency should be lower with the damping devices than without the damping devices to prevent such failure.
FIG. 1 illustrates a typical arrangement of seismic devices. As shown, damping devices 60, 60' are commonly mounted on each of the support studs 40, 40' of the equipment which is shown generally at 14. A horizontal component 46h of the seismic force 46 that is exerted at the base of the equipment causes a downward vertical force 48 to be exerted on one support stud 40 of the equipment 14. A reactive upward force 50 is exerted on the opposite support stud 40' of the equipment 14. As one support stud 40 of the equipment 14 is forced down, and the opposite support stud 40' of the equipment 14 is forced up, the center of mass 44 of the equipment undergoes a horizontal seismic force 52. In those arrangements when the spring-loaded support device provides little or no damping, the equipment rebounds between the damping devices, imparting a "rocking" motion on the equipment 14. Each cycle of the "rocking," causes horizontal seismic forces 52 to be exerted on the equipment 14. The longer the "rocking" and related horizontal seismic forces 52 are exerted, the more resonant energy builds in the equipment.
By providing a damping capability in a seismic support device, the magnitude of horizontal seismic forces and their duration can be reduced. Several spring loaded seismic devices provide damping in a single direction, but none provide damping in response to both upward and downward forces. For example, some devices provide damping in response to a downward force but not in response to an upward force. Others provide damping only in response to upward forces and not downward forces. Using FIG. 1 as an example, if the pictured seismic devices 60, 60' both provided damping in response to downward forces, only one of the two seismic devices (i.e., the one receiving the downward force, 60) at any one time would provide damping as the equipment 14 rocked from side to side. Similarly, if both devices provide damping only in response to upward force, only one device (i.e., the seismic device receiving the upward force, 60') would actively damp at a given time as the equipment "rocks" from side to side. While such seismic support device may provide some damping in a single direction, such devices do not sufficiently reduce the magnitude and duration of the horizontal seismic forces that are exerted on the equipment. Thus the natural frequency of the equipment in response to a seismic disturbance is not reduced through the use of such devices.
Attempts have been made using single-action dampers to provide double acting damping. Often this has been accomplished through the coupling of two or more single acting dampers. Such arrangements have proven cumbersome because equipment are typically designed to be mounted to a single device. Generally there is no simple method of coupling more than one damper to the equipment at a time. Therefore, these arrangements have proven cumbersome and difficult to implement.
Other prior art seismic devices rely on hydraulic shock absorbers. Unlike the spring loaded devices, the hydraulic devices have been effective at damping the forces that are transferred to an attached equipment. However, these devices sometimes leak hydraulic fluid and have proven by field experience to be maintenance intensive.
Therefore, there is a need to provide an improved seismic damper that is capable of supporting large, heavy equipment, that reduces the natural frequency of equipment in response to seismic events through double acting damping, and can be easily installed without modification to the equipment.

Seismic damper for high voltage breakers and disconnect switches


A method for compensating for perceived blur due to motion between a current frame and a previous frame of a digital video sequence comprises estimating a motion vector between the frames for each of a plurality of pixel blocks in the current and previous frames. A cluster motion vector is then estimated for each of a plurality of clusters of the motion vectors based on one of vectors in each cluster and motion vectors in proximate clusters. The cluster motion vector of its corresponding cluster is allocated to each pixel in the current frame. An initial guess frame is generated based on the current frame and pixels in the guess frame are blurred as a function of their respective allocated cluster motion vectors. Each blurred pixel is compared with a respective pixel in the current frame to generate an error pixel for each respective pixel. Each error pixel is blurred and weighted and then each error pixel and its respective pixel is combined in the initial guess frame thereby to update the guess frame and compensate for blur. A system and computer program for perceived blur compensation is also provided.

It is well known that moving objects in digital video displayed on a hold-type display device such as a liquid crystal display (LCD) can appear blurry to an observer. The perceived blur is known to be caused in part by the relatively slow LC response of the liquid crystal cells. When compared with an impulse-type device such as a cathode ray tube (CRT) device, for example, an LCD device has a much slower brightness transition response time. The perceived blur is also caused in part by prolonged light emission inherent in the sample-and-hold driving technique commonly employed by LCD devices, which results in formation of after-images on the human retina. These after-images produce a blurred visual perception as the video sequence is being observed.
It has been proposed to compensate for the relatively slow response time of an LCD device by modifying the LCD device such that it adjusts the driving voltage applied to each device pixel by an amount proportional to a gray level transition. This is commonly known as the "overdrive" technique, and is described by H. Okurama, M. Akiyama, K. Takotoh, and Y. Uematsu in the publication entitled "A New Low Image-Lag Drive Method For Large-Size LCTVs," (SID '02 Digest, pp. 1284-1287, 2002).
It has also been proposed to compensate for the prolonged light emission inherent in the sample-and-hold driving technique by modifying the LCD device using black frame insertion, as described by T. Kurita in the publication entitled "Consideration on Perceived MTF of Hold Type Display For Moving Images," (IDW '98 Digest, pp. 823-826, 1998). U.S. Patent Application Publication No. 2003/0122772 to Park et al. also relates to black frame insertion and discloses a method for operating an LCD device by adjusting signals to the LCD device in order to control the ratio of real data to inserted black data. The ratio is controlled in accordance with the speed of the motion in the video stream. In particular, an increased ratio of black data to video data is said to prevent the appearance of motion blur.
Another technique used to compensate for prolonged light emission involves backlight blinking, as described by T. Furuhashi, K. Kawabe, J. Hirikata, Y Tanaka and T. Sato in the publication entitled "High Quality TFT-LCD System For Moving Picture" (SID '02 Digest, pp. 1284-1287, 2002).
In order to avoid modifying the hold-type display itself, it is known to apply video pre-processing to frames of the digital video sequence prior to display on the hold-type device in order to compensate for motion blur. For example, as described by K. Sekiya and H. Nakamura, in the publication entitled "Eye-Trace Integration Effect on the Perception of Moving Pictures and a New Possibility For Reducing Blur" (SID '02 Digest, pp. 930-933, 2002) the low-pass filtering effect of LCDs on a step function is analyzed and used to introduce waveform modulation in order to reduce motion blur in rectangular waveforms.
Another video pre-processing technique for motion blur compensation is detailed by M. Klompenhouwer and L. J. Velthoven, in the publication entitled "Motion Blur Reduction for Liquid Crystal Displays: Motion Compensated Inverse Filtering" (Visual Communications and Image Processing, pp. 690-698, 2004). According to this technique, blur is reduced by processing each pixel with a one-dimensional high-pass filter oriented in the local direction of motion. As with other known inverse filtering methods, however, noise can be problematic.
U.S. Patent Application Publication No. 2003/0006991 to De Haan et al. discloses a method for suppressing motion blur due to motion integration along a trajectory that employs inverse integration filtering of the video signal. High spatial frequency properties of the video signal are determined such that filtering in flat regions of the image can be avoided. The method is purported to reduce the noise modulation that is typical of other inverse filtering methods.
Other pre-processing techniques have also been considered. For example, U.S. Patent Application Publication No. 2002/0154088 to Nishimura discloses a method for displaying an image on an LCD display which, based on a determined motion vector, switches between an image signal making up the input image and a blanking signal. The method is purported to reduce the flickering, trailing and image-retention phenomenon caused by prior attempts to compensate for the physical characteristics of an LCD display compared to a CRT device. The method factors the speed of image motion to alter the rate at which the non-image signal is displayed. In particular, when motion of an image is fast, the rate at which the non-image signal is displayed during one frame is increased and control is exerted such that the level of the non-image signal comes nearer to the level of white color rather than the level of black color. The converse is true when the motion of an image is slow. As such, display luminance and contrast is generally increased.
It is an object to provide a novel method and system for estimating motion and compensating for perceived motion blur in digital video.

Method and system for estimating motion and compensating for perceived motion blur in digital video


A motor-vehicle door-latch system has a key cylinder pivotal about an axis from a center starting position into a pair of opposite end positions flanking the center position, a key insertable into the cylinder only in the starting position thereof, a latch operable by the cylinder on displacement of same into one of the end positions, and an arcuate magnet pivotal about the axis, polarized generally parallel to the axis, and coupled to the cylinder for joint angular movement therewith. A pair of hall-effect sensors are juxtaposed with the magnet and positioned such that in the central position the magnet is closely juxtaposed with both sensors, in the one end position the magnet is closely juxtaposed with one of the sensors and is spaced from the other of the sensors, and in the other end position the magnet is closely juxtaposed with the other sensor and is spaced from the one sensor. A lock system connected to the sensors has an antitheft mode initiated by the sensors on displacement of the cylinder into the other of the end positions.

As described in European patent 0,447,818 of K. Claar et al (claiming priority of German 4,008,834 of 20 Mar. 1990) it is known to provide an electrical switch that is directly actuated by the key cylinder of a motor-vehicle latch. The key can only be inserted into and withdrawn from the cylinder in a center starting position. Pivoting the key in one direction locks or unlocks the door and, in a central lock system, operates all the other door latches also. Pivoting the key in the opposite direction from the starting position enables the antitheft mode that not only locks all the latches, but also disables any other elements, for instance inside door buttons, that could be used to open a door.
In this Claar patent the switch is a simple mechanical one, having a center position corresponding to the starting position for the cylinder and two oppositely offset end positions. It has been suggested in German utility model 9,415,257 to replace the mechanical switch with a semiconductor hall-effect system to eliminate the need for physical contact between the various parts and thereby increase the service life of the device. Such a system, however, is fairly complex and is also susceptible to manipulation by a would-be thief equipped with a powerful permanent magnet. Such a magnet is simply positioned on the door adjacent the hall-effect arrangement to actuate its sensors and thereby operate the latch.

Key-position sensor for motor-vehicle latch


An electronic equipment cabinet is provided, which includes an enclosure defining an interior space. A support is disposed with the interior space and is configured to receive electronic equipment. The bottom portion defines a base plenum configured for at least one heat exchanger, which is in fluid communication with a low temperature fluid supply and a high temperature fluid return. A closed loop gas flow distribution pathway includes a first plenum communicating with the base plenum and configured to direct a low temperature gas to the support, and a second plenum configured to receive a high temperature gas flow from the support and direct the high temperature gas flow to the base plenum. A temperature sensor is disposed with the enclosure to sense the temperature of the high temperature gas flow within the enclosure.

1. Field of the Invention
This invention relates generally to cabinet systems for housing and maintaining electronic equipment. More specifically, the present disclosure is directed to a cabinet system having a closed loop, fluid cooled design that employs a heat exchanger for regulating temperature and cooling heat generating electronic components.
2. Background of the Art
Cabinets for storing of electronic equipment are well known. These cabinets can be designed to enclose and store electronic equipment on racks in a vertical arrangement. The electronic equipment may include computers, data servers, storage systems, communication systems, audio/video components and other similar equipment.
These cabinets may also be configured to store blade servers, which are single circuit boards populated with components, such as, processors, memory and network connections. The cabinet can include enclosures or slots for receiving the blades.
It is desirable for the efficient operation of the electronic equipment, such as blade servers, to maintain an acceptable working temperature within the cabinet and avoid overheating of the electronic equipment. However, the electronic equipment stored in the cabinet typically generate heat during operation, and for example, the chassis of a blade server can create substantial amounts of heat thereby greatly increasing the heat load in the cabinet. This heat load causes an increase in the internal temperature of the cabinet. This temperature eventually exceeds the acceptable working temperature for the electronic equipment, resulting in overheating. Overheating of the electronic equipment can lead to equipment error, failure, shutdown, damage, shortened life and low reliability.
Various prior attempts have been made to overcome the drawbacks associated with the excessive heat loads and/or accumulation of heat generated during operation of electronic equipment stored in a cabinet. One attempt places several such cabinets in a room, which is air conditioned or supplied with ducted cool air. This attempt, however, suffers from several disadvantages such as the requirements of cooling the entire room and its contents, the adverse effect of one cabinet temperature relative to another, and the inability to upgrade electronic equipment because the cooling capacity has reached its maximum.
Other attempts include cabinet designs having multiple front and rear access openings, which may include fan units. These designs disadvantageously have difficulty maintaining uniform temperature within the cabinet due to greater amounts of heat being found at the top of the cabinet resulting in temperature gradients from the top to the bottom of the cabinet. In these cases, the equipment located near the top is more prone to failure from overheating.
Still other attempts include ducted cool air assemblies. However, these designs do not account for temperature gradients or provide reliable temperature regulation. In some cases, these designs are configured for an initial equipment load and programmed to operate at full capacity, regardless of the heating load. Thus, these cooling designs are in effect static and unable to accommodate load changes. In the event of equipment failure or discontinuity, many industries cannot afford down time to accommodate changes. Further, these designs can disadvantageously waste power and cooling capacity.
Therefore, it would be desirable to overcome the disadvantages and drawbacks of the prior art with a cabinet for housing and maintaining electronic equipment, which includes a system having a closed loop, fluid cooled design that employs a heat exchanger for regulating temperature and cooling heat generating electronic components, as well as related methods of use. It would be desirable if the cabinet employs a redundant cooling design having a plurality of heat exchangers. It is most desirable that the cabinet includes a plurality of variable speed fans to maintain cooling capacity. It is contemplated that the cabinet of the present disclosure is easily and efficiently manufactured and assembled.

Fluid cooled cabinet for electronic equipment


Four generally quadrant-like indentations are formed at the corners of a substrate. A conductive member is applied to the inner surfaces of the indentations to form input and output terminals, namely a power voltage terminal, a voltage control terminal, a modulation terminal, and an output terminal. By placing these terminals at the corners of the substrate, sufficient distances are provided between the input terminals and the output terminals so as to prevent interference between these terminals.

1. Field of the Invention
The present invention relates to a voltage-controlled oscillator constituting a local oscillator used in a mobile communication unit, such as a portable telephone. The present invention also relates to a method for making such a voltage-controlled oscillator.
2. Description of the Related Art
The configuration of a conventional voltage-controlled oscillator will be described below by referring to FIG. 5.
In FIG. 5, there is shown a substrate 21 for a voltage-controlled oscillator. A plurality of ceramic sheets are laminated to form the substrate 21. On one main surface 21a of the substrate 21, circuit devices such as a varicap diode Vd serving as a variable-capacitance device, a capacitor C1, and a transistor Tr are provided. At side faces 21c and 21d of the substrate 21, generally semicircular indentations 24a, 24b, 24c, and 24d, and generally elongated-circular indentations 25a and 25b having a larger opening than the indentations 24a to 24d are formed. At side faces 21e and 21f, generally elongated-circular indentations 25c and 25d are formed in the same way as for the indentations 25a and 25b. A conductive member is applied to the inner surfaces of these indentations to form input terminals, a power voltage terminal Vb, a voltage control terminal Vc, a modulation terminal M1, an output terminal P1, and ground terminals Ga, Gb, Gc, and Gd. The circuit devices, the input terminals, the output terminal, and the ground terminals are connected to each other through wiring sections (not shown) formed on one main surface 21a of and inside the substrate 21. A control voltage applied to the voltage control terminal Vc, which is an input terminal, is changed to alter the capacitance of the varicap diode Vd, thereby changing the oscillating frequency. A control voltage applied to the modulation terminal M1, which is also an input terminal, is changed to start and stop oscillation.
A manufacturing method for the conventional voltage-controlled oscillator will be described next.
A motherboard 31 shown in FIG. 6 is prepared first. More specifically, in constructing the motherboard, a conductive member is printed on or applied to a plurality of ceramic sheets (not shown). Then, circuit devices and wiring sections are provided. These sheets are then laminated to form the motherboard 31. The motherboard 31 is cut along boundaries 33a and 33b to produce a number of the individual substrates 21 shown in FIG. 5.
More specifically, in the motherboard 31, through holes 34 having generally elongated-circular openings are provided on the boundaries 33a, and through holes 35 having generally circular openings and through holes 34 are provided on the boundaries 33b. A conductive member (not shown) is applied to the inner surfaces of the through holes 34 and 35. The motherboard 31 is cut along the boundaries 33a and 33b to produce a plurality of the substrates 21. In this case, the through holes 34 and 35 are divided and the conductive member applied to the inner surfaces of the through holes 34 and 35 are exposed to form the input terminals Vb, Vc, and M1, the output terminal P1, and the ground terminals Ga to Gd of the substrate 21. Each substrate 21 obtained in this way is put in a metal case (not shown) for shielding to form a voltage-controlled oscillator.
In the conventional voltage-controlled oscillator, however, since each terminal is provided on a side face of the substrate 21, the distance between the output terminal P1 and the power voltage terminal Vb and the voltage control terminal Vc becomes short. Therefore, radiation may occur between these terminals due to high-frequency interference, and, as a result, phase-noise (C/N) characteristics may deteriorate.
In the conventional manufacturing method for a voltage-controlled oscillator, since the through holes 35 formed on the motherboard 31 are shared by two divisions (substrates 21) specified by the boundaries 33b, which are used as input and output terminals, it is necessary to form a relatively large number of the holes in the entire motherboard 31. In addition, since the diameter of the holes is small, making the holes is complicated, which makes cost reduction difficult.

Voltage-controlled oscillator with input and output on opposite corners of substrate