A device to control valves of an internal combustion engine, especially the gas supply valve of a gas engine, which can be operated by a piston of a working cylinder, which can be pressurized with a pressure medium against the return force of a spring. A control device, preferably designed as a control slide valve, which has a movable control apparatus by way of which a work space of the working cylinder can be pressurized with the pressure medium in order to open the valve and relieved in order to close the valve, is arranged before the piston on the pressurization side. The movable control apparatus can itself be controlled by an associated pilot control device. It is possible to control the opening timepoint and closing timepoint of the control valve independently of one another and independently of the inlet valve, because the control apparatus of the control device without a return spring can be brought into the position that pressurizes the steam space with pressure medium and, independently thereof, into the relief position by the pilot control device.

1. Field of the Invention
The invention relates to a device for controlling at least one valve of an internal combustion engine, especially the gas supply value of a gasoline engine, which can be operated by a piston of a working cylinder that can be pressurized by a pressure medium, preferably against the return force of a spring, before which, on the pressurization side, a control device is arranged, preferably in the form of a control slide valve. The control device has a movable control apparatus, which can be used to pressurize a steam space of the working cylinder with the pressure medium for the purpose of opening the valve and to relieve the pressurized space for the purpose of closing the valve. The control apparatus itself can be controlled by means of an associated pilot control device.
2. Description of the Prior Art
German reference DE 43 03 299 A1 discloses a control system of this type for the gas supply valve of a gasoline engine. In the disclosed system, a control device in the form of a control slide valve can be deflected against the return force of a spring, which is arranged above the control slide valve in a cylinder that accommodates the control slide valve, as the result of pressurization, which is initiated by a pilot control device, of a surface of the control slide valve in the axial direction of the control slide valve. In this way, a high-pressure hydraulic line is connected to a working space of a working cylinder, so that the piston arranged in this working space and connected to the gas valve is subjected to high pressure and deflected against the force of a return spring. In the pilot control device, the hydraulic pressure is connected to a pressure line that leads to a surface of the control slide valve. This connection occurs as the result of the deflection of a piston, which has a control recess and is controlled by a camshaft and operates the control shaft that controls the inlet valve of the gas engine. The stroke of the piston can be set by turning a lever that is located on a working cylinder of the piston connected to the gas supply valve. The duration of opening can be set by turning a lever that is arranged on the pilot control device and connected to a pilot-control-device piston, which pressurizes a surface of the control slide valve via a control recess. In this arrangement, the opening timepoint and the closing timepoint of the controlled gas valve cannot be adjusted independently of each other or independently of the control exercised on the inlet valve of the internal combustion engine.
German reference DE 31 35 650 C2 discloses an arrangement that permits adjustment of the opening duration of an inlet valve for an internal combustion engine. The arrangement has a cam seated on a shaft, which deflects a piston. The piston is connected to a second piston, which in turn is connected to the inlet valve, via a hydraulic column enclosed in the normal state.
In order to close the inlet valve while the first piston is still deflected by the cam and thus to adjust the opening duration of the inlet valve, the hydraulic fluid between the two pistons can be released. When this happens, the lower piston, which is connected to the inlet valve, is returned by a return spring, so that the inlet valve closes.
To allow the hydraulic fluid to emerge from the space between the two pistons, there is a valve actuator that in the normal state blocks a recycling line for the hydraulic fluid. The extension of the valve actuator is clamped between a piezoelectric column and an anvil and is held in this position by means of a pressure spring. In order to shorten the opening duration of the inlet valve by releasing the recycling line, the extension of the valve actuator can be released by the application of a voltage signal to the piezoelectric column, so that the valve actuator is moved against the force of the return spring by means of the pressure available in the deflected state of the pistons and the recycling line is released, so that hydraulic oil can flow out between the two pistons, so that the second piston, moving relative to the first piston, can move back, due to the return force of a spring arranged within it, and close the inlet valve.
When the first piston returns to the non-deflected state, the pressure drops between the two cylinders, so that the valve actuator, due to the return force of its return spring, returns to the normal position that closes the recycling line for the hydraulic fluid, where, by interrupting the voltage applied at the piezoelectric column, it can then be clamped between the column and the anvil. Via a back-pressure valve, the space between the two pistons can be refilled with hydraulic fluid from a supply area for hydraulic medium.
This arrangement permits only the opening duration of the inlet valve of an internal combustion engine to be controlled.
U.S. Pat. No. 2,602,434 discloses an arrangement for controlling the start of opening and the stroke of an inlet valve for an internal combustion engine. A lever is provided to control when the inlet valve starts to open. By turning this lever, it is possible to turn an opening-time control edge, which runs obliquely to the axial direction of a piston that can be deflected by a cam. In order to limit the stroke of another piston connected to the inlet valve, another lever can be used to turn a control edge, which is located on the piston in question and opens a relief line to a pressure medium reservoir.

Device to control valves of an internal combustion engine, especially the gas supply valve of a gas engine


A zoom lens including a first lens group and a second lens group is provided. Refractive powers of the first lens group and the second lens group are respectively negative and positive. The first lens group includes a first lens, a second lens, and a third lens arranged in sequence from an object side to an image side. The second lens group is disposed between the first lens group and the image side, and includes a fourth lens, a fifth lens, a sixth lens, a seventh lens, and an eighth lens arranged in sequence from the object side to the image side. The zoom lens satisfies −2.4<f1/fw<−1.0, wherein f1 is the effective focal length of the first lens group, and fw is the effective focal length of the zoom lens at a wide end.

Field of the Invention
The invention relates to a lens. More particularly, the invention relates to a zoom lens.
Description of Related Art
Generally speaking, zoom lenses that are commonly available to the market are large-aperture and wide-angle zoom lenses. However, a wide-angle lens is not capable of clearly recognizing distant images and therefore, when being applied to long-distance security monitoring in locations, such as long corridors, long type shelves in shopping malls and so on, the large-aperture and wide-angle zoom lenses can not satisfy the demands of clearly recognizing distant images.
On the other hand, in a zoom lens, aspheric lenses are used to achieve a wide angle so as to mitigate image aberrations and chromatic aberrations. Aspheric lenses may achieve good effects of aberration correction; however, too much use of aspheric lens would result in dramatically cost rise.
Accordingly, how to achieve good image quality of the zoom lenses and the reduction of production cost has been a major subject of the development in the related field.
For instance, in U.S. Pat. Nos. 7,405,885, 7,061,687, 7,489,452 and 4,348,082 as well as U.S. publication Nos. 2010182677 and 2006034000, zoom lenses are disclosed.


A method and apparatus for performing a membership verification or an access control in a wireless communication system is provided. A mobility management entity (MME) performs the membership verification or the access control of a user equipment (UE), and transmits verified UE membership information to a target HeNB.

Universal mobile telecommunications system (UMTS) is a 3rd generation (3G) asynchronous mobile communication system operating in wideband code division multiple access (WCDMA) based on European systems, global system for mobile communications (GSM) and general packet radio services (GPRS). The long-term evolution (LTE) of UMTS is under discussion by the 3rd generation partnership project (3GPP) that standardized UMTS.
The 3GPP LTE is a technology for enabling high-speed packet communications. Many schemes have been proposed for the LTE objective including those that aim to reduce user and provider costs, improve service quality, and expand and improve coverage and system capacity. The 3GPP LTE requires reduced cost per bit, increased service availability, flexible use of a frequency band, a simple structure, an open interface, and adequate power consumption of a terminal as an upper-level requirement.
FIG. 1 shows network structure of an evolved universal mobile telecommunication system (E-UMTS). The E-UMTS may be also referred to as an LTE system. The communication network is widely deployed to provide a variety of communication services such as voice over internet protocol (VoIP) through IMS and packet data.
As illustrated in FIG. 1, the E-UMTS network includes an evolved UMTS terrestrial radio access network (E-UTRAN), an evolved packet core (EPC) and one or more user equipment. The E-UTRAN may include one or more evolved NodeB (eNB) 20, and a plurality of user equipment (UE) 10. One or more E-UTRAN mobility management entity (MME)/system architecture evolution (SAE) gateways (S-GW) 30 may be positioned at the end of the network and connected to an external network.
As used herein, "downlink" refers to communication from eNB 20 to UE 10, and "uplink" refers to communication from the UE to an eNB. UE 10 refers to communication equipment carried by a user and may be also referred to as a mobile station (MS), a user terminal (UT), a subscriber station (SS) or a wireless device.
An eNB 20 provides end points of a user plane and a control plane to the UE 10. MME/S-GW 30 provides an end point of a session and mobility management function for UE 10. The eNB and MME/S-GW may be connected via an S1 interface.
The eNB 20 is generally a fixed station that communicates with a UE 10, and may also be referred to as a base station (BS) or an access point. One eNB 20 may be deployed per cell. An interface for transmitting user traffic or control traffic may be used between eNBs 20.
The MME provides various functions including non-access stratum (NAS) signaling to eNBs 20, NAS signaling security, access stratum (AS) security control, Inter core network (CN) node signaling for mobility between 3GPP access networks, Idle mode UE reachability (including control and execution of paging retransmission), tracking area list management (for UE in idle and active mode), packet data network (PDN) GW and serving GW selection, MME selection for handovers with MME change, serving GPRS support node (SGSN) selection for handovers to 2G or 3G 3GPP access networks, roaming, authentication, bearer management functions including dedicated bearer establishment, support for public warning system (PWS) (which includes earthquake and tsunami warning system (ETWS) and commercial mobile alert system (CMAS)) message transmission. The S-GW host provides assorted functions including per-user based packet filtering (by e.g. deep packet inspection), lawful interception, UE internet protocol (IP) address allocation, transport level packet marking in the downlink, UL and DL service level charging, gating and rate enforcement, DL rate enforcement based on APN-AMBR. For clarity MME/S-GW 30 will be referred to herein simply as a "gateway," but it is understood that this entity includes both an MME and an SAE gateway.
A plurality of nodes may be connected between eNB 20 and gateway 30 via the S1 interface. The eNBs 20 may be connected to each other via an X2 interface and neighboring eNBs may have a meshed network structure that has the X2 interface.
FIG. 2 shows architecture of a typical E-UTRAN and a typical EPC. As illustrated, eNB 20 may perform functions of selection for gateway 30, routing toward the gateway during a radio resource control (RRC) activation, scheduling and transmitting of paging messages, scheduling and transmitting of broadcast channel (BCH) information, dynamic allocation of resources to UEs 10 in both uplink and downlink, configuration and provisioning of eNB measurements, radio bearer control, radio admission control (RAC), and connection mobility control in LTE_ACTIVE state. In the EPC, and as noted above, gateway 30 may perform functions of paging origination, LTE_IDLE state management, ciphering of the user plane, SAE bearer control, and ciphering and integrity protection of NAS signaling.
FIG. 3 shows a user-plane protocol and a control-plane protocol stack for the E-UMTS.
FIG. 3(a) is block diagram depicting the user-plane protocol, and FIG. 3(b) is block diagram depicting the control-plane protocol. As illustrated, the protocol layers may be divided into a first layer (L1), a second layer (L2) and a third layer (L3) based upon the three lower layers of an open system interconnection (OSI) standard model that is well known in the art of communication systems.
The physical layer, the L1, provides an information transmission service to an upper layer by using a physical channel. The physical layer is connected with a medium access control (MAC) layer located at a higher level through a transport channel, and data between the MAC layer and the physical layer is transferred via the transport channel. Between different physical layers, namely, between physical layers of a transmission side and a reception side, data is transferred via the physical channel.
The MAC layer of the L2 provides services to a radio link control (RLC) layer (which is a higher layer) via a logical channel. The RLC layer of the L2 supports the transmission of data with reliability. It should be noted that the RLC layer illustrated in FIGS. 3(a) and 3(b) is depicted because if the RLC functions are implemented in and performed by the MAC layer, the RLC layer itself is not required. A packet data convergence protocol (PDCP) layer of the L2 performs a header compression function that reduces unnecessary control information such that data being transmitted by employing IP packets, such as IPv4 or IPv6, can be efficiently sent over a radio (wireless) interface that has a relatively small bandwidth.
A radio resource control (RRC) layer located at the lowest portion of the L3 is only defined in the control plane and controls logical channels, transport channels and the physical channels in relation to the configuration, reconfiguration, and release of the radio bearers (RBs). Here, the RB signifies a service provided by the L2 for data transmission between the terminal and the UTRAN.
As illustrated in FIG. 3(a), the RLC and MAC layers (terminated in an eNB 20 on the network side) may perform functions such as scheduling, automatic repeat request (ARQ), and hybrid automatic repeat request (HARQ). The PDCP layer (terminated in eNB 20 on the network side) may perform the user plane functions such as header compression, integrity protection, and ciphering.
As illustrated in FIG. 3(b), the RLC and MAC layers (terminated in an eNodeB 20 on the network side) perform the same functions for the control plane. As illustrated, the RRC layer (terminated in an eNB 20 on the network side) may perform functions such as broadcasting, paging, RRC connection management, RB control, mobility functions, and UE measurement reporting and controlling. The NAS control protocol (terminated in the MME of gateway 30 on the network side) may perform functions such as a SAE bearer management, authentication, LTE_IDLE mobility handling, paging origination in LTE_IDLE, and security control for the signaling between the gateway and UE 10.
The RRC state may be divided into two different states such as a RRC_IDLE and a RRC_CONNECTED. In RRC_IDLE state, the UE 10 may receive broadcasts of system information and paging information while the UE specifies a discontinuous reception (DRX) configured by NAS, and the UE has been allocated an identification (ID) which uniquely identifies the UE in a tracking area and may perform PLMN selection and cell re-selection. Also, in RRC_IDLE state, no RRC context is stored in the eNB.
In RRC_CONNECTED state, the UE 10 has an E-UTRAN RRC connection and a context in the E-UTRAN, such that transmitting and/or receiving data to/from the network (eNB) becomes possible. Also, the UE 10 can report channel quality information and feedback information to the eNB.
In RRC_CONNECTED state, the E-UTRAN knows the cell to which the UE 10 belongs. Therefore, the network can transmit and/or receive data to/from UE 10, the network can control mobility (handover and inter-radio access technologies (RAT) cell change order to GSM EDGE radio access network (GERAN) with network assisted cell change (NACC)) of the UE, and the network can perform cell measurements for a neighboring cell.
In RRC_IDLE state, the UE 10 specifies the paging DRX cycle. Specifically, the UE 10 monitors a paging signal at a specific paging occasion of every UE specific paging DRX cycle.
The paging occasion is a time interval during which a paging signal is transmitted. The UE 10 has its own paging occasion.
A paging message is transmitted over all cells belonging to the same tracking area. If the UE 10 moves from one tracking area to another tracking area, the UE will send a tracking area update message to the network to update its location.
FIG. 4 shows an example of structure of a physical channel.
The physical channel transfers signaling and data between layer L1 of a UE and eNB. As illustrated in FIG. 4, the physical channel transfers the signaling and data with a radio resource, which consists of one or more sub-carriers in frequency and one more symbols in time.
One sub-frame, which is 1 ms in length, consists of several symbols. The particular symbol(s) of the sub-frame, such as the first symbol of the sub-frame, can be used for downlink control channel (PDCCH). PDCCHs carry dyn amic allocated resources, such as PRBs and modulation and coding scheme (MCS).
A transport channel transfers signaling and data between the L1 and MAC layers. A physical channel is mapped to a transport channel.
Downlink transport channel types include a broadcast channel (BCH), a downlink shared channel (DL-SCH), a paging channel (PCH) and a multicast channel (MCH). The BCH is used for transmitting system information. The DL-SCH supports HARQ, dynamic link adaptation by varying the modulation, coding and transmit power, and both dynamic and semi-static resource allocation. The DL-SCH also may enable broadcast in the entire cell and the use of beamforming. The PCH is used for paging a UE. The MCH is used for multicast or broadcast service transmission.
Uplink transport channel types include an uplink shared channel (UL-SCH) and random access channel(s) (RACH). The UL-SCH supports HARQ and dynamic link adaptation by varying the transmit power and potentially modulation and coding. The UL-SCH also may enable the use of beamforming. The RACH is normally used for initial access to a cell.
The MAC sublayer provides data transfer services on logical channels. A set of logical channel types is defined for different data transfer services offered by MAC. Each logical channel type is defined according to the type of information transferred.
Logical channels are generally classified into two groups. The two groups are control channels for the transfer of control plane information and traffic channels for the transfer of user plane information.
Control channels are used for transfer of control plane information only. The control channels provided by MAC include a broadcast control channel (BCCH), a paging control channel (PCCH), a common control channel (CCCH), a multicast control channel (MCCH) and a dedicated control channel (DCCH). The BCCH is a downlink channel for broadcasting system control information. The PCCH is a downlink channel that transfers paging information and is used when the network does not know the location cell of a UE. The CCCH is used by UEs having no RRC connection with the network. The MCCH is a point-to-multipoint downlink channel used for transmitting MBMS control information from the network to a UE. The DCCH is a point-to-point bi-directional channel used by UEs having an RRC connection that transmits dedicated control information between a UE and the network.
Traffic channels are used for the transfer of user plane information only. The traffic channels provided by MAC include a dedicated traffic channel (DTCH) and a multicast traffic channel (MTCH). The DTCH is a point-to-point channel, dedicated to one UE for the transfer of user information and can exist in both uplink and downlink. The MTCH is a point-to-multipoint downlink channel for transmitting traffic data from the network to the UE.
Uplink connections between logical channels and transport channels include a DCCH that can be mapped to UL-SCH, a DTCH that can be mapped to UL-SCH and a CCCH that can be mapped to UL-SCH. Downlink connections between logical channels and transport channels include a BCCH that can be mapped to BCH or DL-SCH, a PCCH that can be mapped to PCH, a DCCH that can be mapped to DL-SCH, and a DTCH that can be mapped to DL-SCH, a MCCH that can be mapped to MCH, and a MTCH that can be mapped to MCH.
The specification of a home eNB (HeNB) is currently ongoing in 3GPP LTE. It may be referred to Paragraph 4.6.1 of 3GPP (3rd generation partnership project) TS 36.300 V10.2.0 (2010-12). The HeNB is a small base station designed for use in residential or small business environment. The HeNB may be a femto cell or a pico cell. The HeNB is short range about tens of meter, installed by the consumer for better indoor voice and data reception.
FIG. 5 shows logical architecture of an E-UTRAN HeNB.
Referring to FIG. 5, a HeNB 50 may be connected with an EPC 60 through an S1 interface. A HeNB gateway (55, HeNB GW) may be deployed between the HeNB 50 and the EPC 60 to allow the S1 interface and to scale to support a large number of HeNBs. The HeNB GW 55 serves as a concentrator for the C(control)-Plane, specifically the S1-MME interface. The S1-U interface from the HeNB 50 may be terminated at the HeNB GW 55, or a direct logical U(user)-Plane connection between HeNB 50 and S-GW 56 may be used. The S1 interface may be defined as the interface between the HeNB GW 55 and the core network, between the HeNB 50 and the HeNB GW 55, between the HeNB 50 and the core network, and between the eNB and the core network. Also, the HeNB GW 55 appears to the MME as an eNB. The HeNB GW 55 appears to the HeNB as an MME. The S1 interface between the HeNB 50 and the EPC 60 is the same whether the HeNB 50 is connected to the EPC 60 via a HeNB GW 55 or not.
A closed subscriber group (CSG) identifies subscribers of an operator who are permitted to access one or more cells but which have restricted access (CSG cells). A CSG cell broadcasts a CSG indicator set to true and a specific CSG identity. A HeNB may be a CSG cell. The CSG cell operates with an open mode or a closed mode. When the CSG cell operates with an open mode, the HeNB operates as a normal eNB. When the CSG cell operates with a closed mode, the HeNB provides services only to its associated CSG members. That is, the HeNB may perform access control which is a process that checks whether a UE is allowed to access and to be granted services in a CSG cell. A CSG whitelist is a list stored in a UE containing the CSG identities of the CSG cells to which the subscriber belongs.
A hybrid cell is a cell broadcasting a CSG indicator set to false and a specific CSG identity. This cell is accessible as a CSG cell by UEs which are members of the CSG cell and as a normal cell by all other UEs. The hybrid cell may check whether a UE is a member or non-member of the hybrid cell. This process may be referred as a membership verification. The UEs which are members of the CSG cell may have a higher priority than other UEs to access to the hybrid cell. The hybrid cell may be referred as a CSG cell which operates with a hybrid mode.
FIG. 6 shows overall architecture with deployed HeNB GW.
It may be referred to Paragraph 4.6.1 of 3GPP (3rd generation partnership project) TS 36.300 V9.3.0 (2010-03). Referring to FIG. 6, an E-UTRAN may include one or more eNB 60, one or more HeNB 70 and a HeNB GW 79. One or more E-UTRAN MME/S-GW 69 may be positioned at the end of the network and connected to an external network. The one or more eNB 60 may be connected to each other through the X2 interface. The one or more eNB 60 may be connected to the MME/S-GW 69 through the S1 interface. The HeNB GW 79 may be connected to the MME/S-GW 69 through the S1 interface. The one or more HeNB 70 may be connected to the HeNB GW 79 through the S1 interface or may be connected to the MME/S-GW 69 through the S1 interface. The one or more HeNB 70 may not be connected to each other.
Based on the structure in FIG. 6, if a user equipment (UE) served currently by an HeNB or an eNB requests handover to another HeNB, the path will go through the core network. That is, the handover should be performed through the S1 interface. This handover procedure can be big signaling impact on the core network, which has to deal with a lot of processing. In addition, a handover delay can occur as the handover is performed through the core network, which may be sensitive to UE in a certain situation.
FIG. 7 shows another overall architecture with deployed HeNB GW.
It may be referred to Paragraph 4.6.1 of 3GPP (3rd generation partnership project) TS 36.300 V10.2.0 (2010-12). Referring to FIG. 7, the HeNBs 90 may be connected to each other through the X2 interface. The HeNBs 90 connected to each other through the X2 interface should have same CSG identifiers (IDs) or the target HeNB should operate with the open mode.
FIG. 8 shows a direct connection between HeNBs without deployed HeNB GW.
Referring to FIG. 8, the one or more HeNB 90 may be connected to the MME/S-GW 89 through the S1 interface. The HeNBs 90 may be connected to each other through the X2 interface directly. The HeNBs 90 connected to each other through the X2 interface should have same CSG identifiers (IDs) or the target HeNB should operate with the open mode.
That is, only the HeNBs with the same CSG IDs or the target HeNB which operate with the open mode can have the direct X2 interface even if some HeNB may support the hybrid mode, which can be accessed by any UEs. If the conditions are satisfied, a handover may be performed through the direct X2 interface between HeNBs.
However, the signaling impact problem on the core network and the handover delay problem may still exist due to the implementation limitations. If the CSG IDs are different for the source HeNB and the target HeNB or in case of a handover from the macro eNB to the HeNB, a handover through the S1 interface has to be used. The handover through the S1 interface also has to be used when the target HeNB operates with the hybrid mode even though a UE is not a member of the target HeNB.
In order to solve the problem described above, existing X2 handover procedure can be a solution. However, it is required that how to perform a membership verification of a UE for efficient X2 handover procedure when the target HeNB is a hybrid cell. In addition, it is required that how to perform an access control when the target HeNB operates with the closes mode.

Method and apparatus for performing membership verification or access control in wireless communication system


There is provided a charging system including at least one battery device that includes a secondary cell therein, a charging device that performs contactless power transmission to transmit power to the battery device, and a charging control device that controls the contactless power transmission between the charging device and the battery device, wherein the battery device is a hexagonal cylinder having a bottom surface with a substantially regular hexagonal shape and having a predetermined height, wherein the charging device is a hexagonal cylinder having a bottom surface with a substantially regular hexagonal shape and having a predetermined height, and wherein the contactless power transmission is performed between the charging device and the battery device under control of the charging control device by stacking the battery device on the charging device.

The present invention relates to a power supply system, a charging control device, and a battery device.
Existing power systems are designed to transmit power generated by power plants to offices or homes via power networks constructed of electric substations, power wires, and the like. Accordingly, to realize power transmission to offices and homes, reliable power networks constructed to transmit power generated by power plants are a prerequisite. Most of the power supply systems of the related art are also designed on the assumption that reliable power networks are installed.

Power supply system, charging system, and charging control device including a battery and a charging device with a shape of hexagonal cylinder


A socket is provided for receiving electronic packages having different first and second sizes. The socket comprises a base housing having a top surface including an array of pin receiving chambers as well as base side walls. The socket also comprises a cover having a top surface including an array of holes corresponding to the array of pin receiving chambers. The cover also includes cover side walls that slidably engage the base side walls. Further, the socket comprises first and second locating members provided on at least one of the base housing and cover. The first locating member is positioned to engage and align an electronic package having a first size with the array of holes in the cover, and the second locating member is positioned to engage and align an electronic package of a second size with the array of holes in the cover.

Certain embodiments of the present invention generally relate to a socket that can accept differently sized electronic packages.
Pin grid array (PGA) sockets are used to accept electronic packages on printed circuit boards. PGA sockets facilitate electrical communication between a large number of pins born on electronic packages (such as microprocessors) and electrical components to which the PGA sockets are mounted (such as circuit boards). Zero insertion force PGA sockets utilize a cover that is slidably movable on a base between open and closed positions. The sliding movement may be actuated, for example, by a lever. The cover has a hole array configured to match a pin array on an electronic package. Similarly, the base has an array of pin receiving chambers configured to accept the pin array of the electronic package. The electronic package is mated to the socket by first placing the electronic package such that its pins penetrate the holes of the cover. With the cover in the open position, the pins penetrate through the holes of the cover and into the pin receiving chambers of the base but are not electrically connected to the pin receiving chambers of the base. When the cover is slid to the closed position, the pins are electrically connected to the base via the pin receiving chambers.
Improper alignment of the electronic package and socket during mating can result in damage to the pins and/or pin receiving chambers. Additionally, attempting to mount the electronic package to the cover when the cover is in the closed position can also result in damage to the pins and/or the pin receiving chambers. Thus, the socket may incorporate features that aid in the alignment of the electronic package.
Changes in electronic package design have resulted in electronic packages that have similar pin arrays but different outside dimensions. Current sockets, however, only provide for the alignment of a single size of electronic package, and cannot align differently sized electronic packages. Thus, it is required to use different sockets to accommodate differently sized electronic packages, and if the electronic package for an electrical system is changed, the socket must also be changed, resulting in larger required inventories of parts and the time, expense, and inconvenience associated with changing sockets.
It is an object of at least certain embodiments of the present invention to overcome the above-noted and other disadvantages of PGA sockets.
At least one embodiment of the present invention is provided including a socket for receiving electronic packages having different first and second sizes. The socket comprises a base housing having a top surface including an array of pin receiving chambers as well as base side walls. The socket also comprises a cover having a top surface including an array of holes corresponding to the array of pin receiving chambers. The cover also includes cover side walls that slidably engage the base side walls. Further, the socket comprises first and second locating members provided on at least one of the base housing and cover. The first locating member is positioned to engage and align an electronic package having a first size with the array of holes in the cover, and the second locating member is positioned to engage and align an electronic package of a second size with the array of holes in the cover. Optionally, either the first and/or second locating member may be adapted to engage an electronic package during mounting to the socket but not after mounting to the socket. The socket may also comprise relieved portions from the top surface of the cover to facilitate removal of an electronic package from the socket.
The first and second locating members may provide a mechanical stop that locates electronic packages in at least one of a lateral and a longitudinal direction. Further, one of the first and second locating members may extend above the top surface of the cover, and the other of the locating members may recess beneath the top surface of the cover. In this regard, the locating member that recesses beneath the top surface of the cover may be adapted to engage and align an electronic package in both a longitudinal and a lateral direction.
One of the first and second locating members may be provided on the base housing while the other locating member is provided on the cover.
Further, at least one of the first and second locating members may be adapted for visual alignment of an electronic package. In this regard, the locating member adapted for visual alignment may be common to the base housing and the cover.
One of the locating members may also be a resiliently flexible locating member. The resiliently flexible locating member comprises a flexing portion affixed to the socket, and is adapted to engage and align an electronic package having a first size and be deflected substantially beneath the top surface of the cover when an electronic package having a second size is mounted to the socket.
At least one embodiment of the present invention provides an electrical system including an electronic package and a socket. The electronic package comprises an array of pins. The socket is configured to receive the electronic package and an electronic package having a different size. The socket comprises a base having a top surface including an array of pin receiving chambers corresponding to the array of pins. The base also includes base side walls. Further, the socket comprises a cover having a top surface including an array of holes corresponding to the array of pin receiving chambers and the array of pins. The cover includes cover side walls connected to the top surface which slidably engage the base side walls, allowing the array of pins to be slid into and out of engagement with the array of pin receiving chambers. The socket further comprises first and second aligning surfaces on at least on of the base and cover. The first aligning surface is positioned to align the electronic package with the array of holes in the cover, while the second aligning surface is positioned to align an electronic package having a different size with the array of holes in the cover. Optionally, the aligning surfaces may be configured to provide a mechanical stop and/or visual alignment. An aligning surface adapted for visual alignment may further be adapted to facilitate removal of the electronic package from the socket.
At least one embodiment of the present invention provides a socket for receiving electronic packages having different first and second sizes. The socket comprises a base housing having a top surface including an array of pin receiving chambers. The base housing also has base side walls. The socket also comprises a cover having a top surface including an array of holes corresponding to the array of pin receiving chambers. Further, the cover includes cover side walls that slidably engage the base side walls. The socket also comprises a first locating member on the base housing positioned to engage and align an electronic package of a first size with the array of holes in the cover.
Certain embodiments of the present invention thus provide a socket capable of aligning variously sized electronic packages. Certain embodiments of the present invention also provide a socket that prevents electronic packages from being mounted to the socket when the socket is in the closed position.


The ink unit of a printer has a memory circuit (memory element) for non-contact communication. The memory circuit has a hold mode M2 in which memory access commands from the transmitter/receiver are not received, and an active mode M4 in which memory access is permitted upon receipt of a memory access command. The memory circuit shifts into active mode M4 if the ID contained in the active mode command matches its own ID when an active mode command containing the cartridge ID is received from the transmitter/receiver while in hold mode M2. The reception of an anti-collision start command from the transmitter/receiver while in hold mode M2 results in a shift to anti-collision mode M3 to check the ID.

1. Field of the Invention
The present invention relates to technology for non-contact communication between a device such as a printer and a cartridge containing a consumable component such as an ink.
2. Description of the Related Art
After being opened, for example, after a period of about six months, the quality of the ink in ink units (ink cartridges) for ink jet printers may deteriorate as a result of the environment in which it is used. Owing to such ink deterioration, high printing quality thus may not be achieved sometimes, and the print head of the printer may be adversely affected. An example of a way to deal with this problem is to provide the ink unit with a memory device such as an EEPROM, and to make sure that data for specifying the expiration period of the ink is stored in memory. A transmitter/receiver provided in the printer main unit can communicate with the memory through contact terminals to read the data concerning the expiration period of the ink. In addition to data related to the expiration period, data such as that relating to the amount of ink remaining in each ink unit may also be stored. The contact terminals may, however, become dirty, interfering with the transmission of data from the ink unit, and the need for precise alignment between the contact terminals on the ink unit and contact structure in the printer main unit complicates printer main unit construction.
An alternative to the contact type memory such as EEPROM is a structure in which a non-contact type of memory element is provided, and radio transmission is managed by a read/write sensor provided in the printer main unit.
However, because of the substantial distance over which radio transmission occurs, radio transmissions involving the use of non-contact type memory elements can result in the accidental reading of data in nearby memory elements different from the intended memory element, that is, signals can be mixed. In the case of color ink jet printers, for example, a plurality of different ink units for a plurality of different color inks are arranged at a short pitch from each other on a carriage (ink unit support member), and because the transmitted radio waves reach several of the ink units, there sometimes occurs erroneous communication with an adjacent ink unit instead of the intended ink unit.
Attempts have been made to pre-store ID information unique to each non-contact memory element, and to have the ID information first read by the printer main unit, so as to ensure proper communication as each element was distinguished through the use of the ID information during subsequent communication. However, since the procedure for reading the ID information includes a process for preventing mixed signals, referred to as an anti-collision process, running the ID information reading process for every communication process on each unit can result in a much longer communication process overall. This is undesirable, as it may degrade printer performance.

Non-contact communication between device and cartridge containing consumable component


A sustained release microsphere preparation which is produced by including a hydrophobic antipsychotic drug such as bromperidol, haloperidol or the like into a base composed of a high molecular weight polymer having in vivo histocompatibility such as polylactic acid, poly(lactic-co-glycolic)acid or the like, and a process for the production thereof.

It is said that, in the drug therapy of mental diseases, maintenance therapy by continuous administration is effective in preventing recidivism of symptoms, whereby it is possible to guide patients in their daily lives. However, since the current maintenance therapy with antipsychotic drugs is carried out by orally administering tablets or fine granules once a day or dividing the daily dose into several doses per day, decreased patient compliance during the maintenance therapy causes recidivism of symptoms or re-hospitalization. Consequently, current maintenance therapy has a drawback in that certain means must be employed to improve compliance after rehabilitation or during outpatient maintenance therapy.
In order to resolve this problem, long acting injections containing drugs in the form of decanoic acid ester or enanthic acid ester have been used. For example, decanoic acid esters of haloperidol and bromperidol are disclosed in JP-A-56-8318 (the term "JP-A" as used herein means "unexamined published Japanese Patent Application"), and decanoic acid ester or enanthic acid ester of fluphenazine is also known and used in this therapeutic field.
However, these prior art long acting injections have drawbacks in that their administration route is limited to intramuscular injection, resistance at the time of administration is large because they are oil injections while the dispersibility of oil in muscular tissue is low, and their administration gives patients severe pain. In addition, there is a possibility that their effects may vary depending on individuals and their ages because, though the esters of active ingredients show a sustained release effect in the living body by gradually releasing their active moieties due to the influence of esterase, release of drugs in the living body generally depends on their transition rate from, the administered site into the lymphoid system and also on enzyme activity. Accordingly, it is desirable to develop new long acting injections in which the drugs themselves as opposed to their esters can be used.
On the other hand, each of JP-A-62-201816, JP-B-1-57087 and JP-B-2-124814 (the term "JP-B" as used herein means "examined Japanese Patent Publication") discloses sustained release microcapsules which make possible the administration of water soluble drugs at an interval of once a week or once a month, and production processes therefor. Also, JP-A-55-33414 discloses a so-called in-water drying method in which a hydrophobic drug and a polylactic acid are dissolved in a common organic solvent, the resulting solution is emulsified by adding a phase separation agent and then the solvent is removed by evaporation to obtain fine particles.
U.S. Pat. No. 4,994,281 discloses polylactic acid microspheres, prepared by the in-water drying method, containing a physiologically active substance (haloperidol, chlorpromazine, etc.) and having an average particle size of about 0.1 to 10 .mu.m.

Sustained release microsphere preparation containing antipsychotic drug

Yoshitomi Pharmaceutical Industries, Ltd.


A positioning apparatus including a movable member having a plurality of magnets, and a plurality of coils arranged in X- and Y-axial directions, for displacing the movable member in the X- and Y-axial directions, and in a rotational direction around the Z-axis.

1. Field of the Invention
The present invention relates to a positioning apparatus, and in particular, though not exclusively, to a positioning apparatus used in an exposure apparatus and/or survey equipment.
2. Description of the Related Art
A conventional exposure apparatus can have a positioning apparatus for positioning a wafer or a reticle. Japanese Patent Laid-Open No. 2004-254489 discusses a stage unit using a surface motor, as a wafer stage, for positioning a wafer.
FIG. 8A illustrates a top view which shows the wafer stage 8 discussed in Japanese Patent Laid-Open No. 2004-254489, and FIG. 8B illustrates a sectional view which shows the wafer stage 8 as viewed sidewise.
Referring to these figures, a movable member 1 (stage) includes a magnet unit 2 in which permanent magnets are arranged in the so-called Halbach array at its bottom surface, and a base member 3, which has a coil unit 4 in which a plurality of coils are arranged. Magnetic fluxes generated from these permanent magnets and currents fed to the coils produce a Lorentz's force by which the movable member 1 is displaced.
FIGS. 9A to 9B illustrate views which show a configuration of coils and permanent magnets discussed in the Japanese Patent Laid-Open No. 2004-254489, as viewed from above in FIGS. 8A and 8B, and in which the stage is shown being see-through in order to facilitate the understanding of the configuration thereof. A plurality of coils 5 having linear portions in the X-axial direction are arranged in the Y-axial direction, and current having predetermined phases are fed to those of the coils 5 which are located underneath the magnets so as to displace the stage in the Y-axial direction. Further, with the provision of a plurality of coils having linear portions in the Y-axial direction, which are arranged in the X-axial direction, the stage can be displaced in the X-axial direction. It is noted here that the magnet unit 2 has such a magnetic configuration that the Halbach array has deficient parts 6 from which permanent magnets are in part removed as shown in FIG. 9A, or the Halbach array has additional parts in which permanent magnets are in part added 7 as shown in FIG. 9B. With this magnet configuration, currents are fed to coils underneath a pair of deficient parts 6 or additional parts 7 so as to induce forces in reverse direction, respectively therefrom, so as to cause the stage 1 to displace in the θz direction (a rotational direction around the Z-axis).
As illustrated in FIG. 9A, if defective portions are provided in permanent magnets having an array sequence, permanent magnets used for X- and Y-axial displacements can be removed, resulting in decreased drive efficiency. As illustrated in FIG. 9B, if additional portions are provided in permanent magnets having an array sequence, separates Coils for θz drive can be used in addition to coils for X- and Y-axial drives in order to increase efficiency of the drive. In this case, since a current applied for the θz drive is different from currents applied for the X- or Y-axial drive, different current drives can be used, that is, an increase in the number of current drivers results in increased costs. Further, since the additional magnets overhang outward by a large degree, the stage itself would have a larger size, the larger the carriage, the larger the apparatus and as well the larger the heating value of a drive unit, resulting in difficulty in maintaining increased accuracy.

Positioning apparatus, exposure apparatus using thereof and device manufacturing method


A motor driving circuit for full-wave single-phase driving a motor includes a position detection unit, a turn-on signal generation unit, and switching devices that define an H-bridge circuit. The turn-on signal generation unit includes a differential amplifier arranged to produce a trapezoid wave signal, and a square wave generation circuit arranged to produce a square wave signal, wherein the trapezoid and the square wave signals are respectively supplied to control terminals of lower switching devices in the H-bridge circuit. Further, one of the lower switching devices is turned on and off according to a voltage level of the square wave signal, and the remaining lower switching device is turned on and off when a voltage of the trapezoid wave signal becomes higher than an operation voltage of the remaining lower switching device, wherein a non-conducting interval is provided for the motor coil according to the operation voltage.

1. Field of the Invention
The present invention relates to a motor driving circuit, and, more particularly, to a motor driving circuit for single-phase full-wave driving a single-phase brushless DC motor (hereinafter, simply referred to as a motor).
2. Description of the Related Art
In the case of driving a motor in a single-phase full-wave mode, an H-bridge circuit configuration is generally used. However, when a commutation occurs at a motor coil in an H-bridge circuit, transistors arranged at an upper arm and a lower arm in the H-bridge circuit may be short-circuited for an extremely short time interval at the times of turn-on and turn-off of each transistor, thereby causing a through current. For preventing such a through current, a generally employed method is to introduce a dead time at each of the times of the turn-on and turn-off of each transistor.
FIG. 10 is a circuit diagram showing a conventional motor driving circuit, which is disclosed in, e.g., Japanese Patent Application Publication No. 2005-269855.
In FIG. 10, the reference character 1 designates a Hall element for detecting positions of magnetic poles in a magnet. Further, a comparator circuit includes a first comparator 2 for converting an output voltage into a first square wave signal; and a second comparator 3 for producing a second square wave signal that corresponds to an inverse voltage of an output of the first comparator 2. Additionally, ZD refers to a Zener diode, R11-R21 refer to resistors, C11 and C12 refer to capacitors, and D11 and D12 refer to diodes.
Further, a dead time circuit includes a first dead time circuit having resistor R16 and capacitor C12 configured to smooth a rising edge in a voltage waveform of the first square wave signal; and a second dead time circuit having resistor R17 and capacitor C11 configured to smooth a rising edge in a voltage waveform of the second square wave signal.
In addition, an H-bridge circuit includes a lower arm having a first transistor Tr1 and a second transistor Tr2 which are MOSFET transistors; and an upper arm having a third transistor Tr3 and a fourth transistor Tr4 which are PNP transistors, and a motor coil 6.
FIGS. 11A to 11F are timing charts describing operations of the conventional motor driving circuit. More specifically, FIG. 11A shows an output voltage of the Hall element 1; FIG. 11B shows the first square wave signal obtained as the output voltage of the first comparator; FIG. 11C shows an output voltage of the first dead time circuit; FIG. 11D shows an output voltage of the second dead time circuit; FIG. 11E shows an ON/OFF signal of the first transistor Tr1; and FIG. 11F shows an ON/OFF signal of the second transistor Tr2.
By using the dead time circuits including resistors and capacitors, the rising times of the voltage waveforms of the first and the second square wave signal are increased as respectively shown in FIGS. 11C and 11D. Further, due to the influence of the cutoff voltage between the gate and the source of each of the transistors Tr1 and Tr2 on the turn-on and turn-off operations thereof, dead times Td1 and Td2 are secured while the transistors Tr1 and Tr2 are being turned on, respectively, as shown in FIGS. 11E and 11F. The dead times prevent the through currents at the respective transistors in the H-bridge circuit.
Further, as a method for enhancing the motor efficiency, it has been commonly proposed that the electric conduction is prohibited during an initial stage and a final stage of a half-period (equivalent to an electric angle of 180°) in a counter-electromotive force waveform, and is allowed during the time the counter electromotive force reaches a predetermined level. In this regard, Japanese Patent No. 3239054, for example, discloses a method of controlling a conduction angle in the case of half-wave driving.
As discussed above, in the conventional motor driving circuit, the dead time circuit has to be provided to prevent the through current that may flow through the motor coil during the time of a commutation. This increases the number of electric components, which in turn results in a cost increase. Further, also in case of driving the motor by setting a conduction angle for enhancing the motor efficiency, a relatively large number of electric components are required, thereby complicating the circuit.


The presence of an acid catalyst in a clearcoat composition enables the production of a wrinkle-free coating in a process comprising the simultaneous curing of applied layers of both a waterborne basecoat composition as well as a solventborne clearcoat composition. The waterborne basecoat composition comprises an organic resin, a crosslinker, and a free amine. The solventborne clearcoat composition comprises an acid catalyst in an amount significantly higher than the quantity normally used in high solids original equipment manufacturer clearcoat compositions, a polymer which is crosslinkable with melamine, and a monomeric melamine type crosslinking resin for crosslinking the polymer. The process is most preferably used to make an automotive quality topcoat.

1. Field of the Invention
The present invention relates to processes for coating substrates with a solventborne clearcoat composition over a waterborne basecoat composition.
2. Discussion of Background Material
In prior art processes for making coated objects, particularly automotive coatings, manufacturers have utilized coating systems which involve the use of both basecoats and clearcoats. Traditionally, both the basecoats and clearcoats were applied as solventborne compositions. However, more recently manufacturers have become increasingly concerned about environmental impact due to the emission of organic solvents into the atmosphere during the application and curing of solventborne coating compositions. As a result of this concern and environmental regulations associated therewith, it is becoming increasingly desirable to utilize waterborne coating compositions.
It has been found that if a waterborne basecoat composition containing free amine is applied to a substrate, followed by the application of a traditional solventborne clearcoat composition comprising a monomeric melamine as a crosslinking resin, upon simultaneous curing of both layers, the resulting cured film appears "wrinkled". This appearance is undesirable and lacks commercial value. It has been found that clearcoat compositions utilizing polymeric melamine do not exhibit this wrinkling problem. As a result, the current commercially available clearcoat compositions utilize polymeric melamine as the crosslinking entity, as opposed to monomeric melamine. However, the use of monomeric melamine could permit formulating a higher solids composition and could result in improved physical properties of the resulting coating, if only the wrinkling problem could be solved.
The inventor of the present invention has unexpectedly discovered that the above described advantages of high solids concentration and improved physical properties can be achieved by utilizing a solventborne monomeric melamine clearcoat composition which comprises a high level of acid catalyst. Such a composition has been unexpectedly found to achieve the advantages of improved physical film properties as well as increased solids content in the clearcoat composition, while avoiding entirely the wrinkling problem described above.
However, compositions comprising a "high level of acid catalyst", in combination with monomeric melamine, are not new. Such compositions have previously been utilized in the "refinish" industry, i.e. in the repainting of automotive body panels after damage to the finish. However, such repair processes do not utilize waterborne basecoat compositions in combination with the high level of acid catalyst, monomeric melamine-containing clearcoat compositions. That is, such use of a high level of acid catalyst in monomeric melamine compositions has traditionally been limited to use in conjunction with solventborne basecoats. Furthermore, such repair processes are carried out at low temperature (i.e. temperatures of from about 160.degree. F. to about 210.degree. F.).
In contrast, the process of the present invention utilizes a high level of acid catalyst in a monomeric melamine composition applied over a layer of an uncured waterborne basecoat, not to mention use over a waterborne basecoat which further comprise a free amine.
In the art of producing automotive topcoats, it is desirable to utilize less organic solvent in coating compositions which are "organic solvent based". Organic solvents serve to disperse (and dissolve) polymers, oligomers, monomers, and other organic components in the composition, in order that the viscosity of the mixture is low enough that the dispersion can be sprayed, etc. However, the presence of organic solvents in the coating composition ultimately results in the release of the organic solvent into the atmosphere, because the solvent is released in a curing step carried out at elevated temperatures. One way of reducing the amount of organic solvent released into the atmosphere is to utilize low viscosity components in the mixture, so that less organic solvent is needed to achieve the desired viscosity. One example of such a low viscosity crosslinking agent is monomeric melamine.
As was described above, the use of monomeric melamine as a crosslinking agent has been found to be unsatisfactory in the event that it is present in a solventborne clearcoat composition which is applied over a waterborne basecoat composition comprising an amine, followed by simultaneous curing of both the resulting uncured waterborne basecoat layer, as well as the uncured solventborne clearcoat layer coating composition (for the clearcoat). The result is a cured coating which exhibits a most unsatisfactory "wrinkled" appearance. Such wrinkled coatings have no substantial commercial value.
However, the present invention provides a process by which an uncured layer of a solventborne clearcoat composition comprising a monomeric melamine can be applied directly over an uncured layer of a waterborne basecoat composition comprising an amine, with both of the layers thereafter being simultaneously cured, to produce a substantially wrinkle-free, cured coating. A first advantage of this process is that less organic solvent need be used (hence less organic solvent is released into the environment). A second advantage of this process is that a higher concentration of solids can be present in the solventborne clearcoat composition, which reduces the volume of composition required. A third advantage of this process is that the resulting cured coating exhibits improved physical properties.
The process of the present invention produces the above-described advantages through the use of a relatively high concentration of an acid catalyst in the solventborne clearcoat composition. This high level of acid catalyst ensures an adequate degree of catalysis for the crosslinking of the organic polymer in the clearcoat composition. That is, the high level of the acid catalyst ensures adequate crosslinking during the curing step, regardless of the presence of the free amine, which has a retarding effect upon the crosslinking of the organic polymer. Thus the acid catalyst is present in a quantity sufficient to both: (1) provide the necessary catalysis for the crosslinking reaction required for the curing of the clearcoat composition, and (2) prevent an undesired retardation of the crosslinking of the clearcoat composition.

Process for making wrinkle-free coating using solventborne clearcoat composition over waterborne basecoat composition


A hub for a human powered vehicle includes a rotation axis, a hub body formed generally symmetrically about the rotation axis, the hub body having a radially-outward-facing surface that includes a plurality of surface features for improving the aerodynamic efficiency of the hub as it passes through a fluid, and a wheel assembly attachment member formed along a circumference of the hub body, the wheel assembly attachment member being structured for attachment to one of a plurality of spokes and the center of a disc wheel. The surface features may include a series of depressions or a series of projections, and such features may have a dimple shape that can be formed in a variety of shapes including those with a cylindrical wall and a planar bottom or a hemispherical bottom. Alternately, such surface features may have a hemispherical shape.

Technology underlying the design of bicycle components has evolved in recent years. Increasingly, bicycle wheels, hubs, cranks, handlebars, frames and the like, are being designed not only to be sturdy and easy to manufacture, but also to have increasingly lighter weight and improved performance characteristics. A variety of techniques have been used to achieve lighter weights, with most of the design efforts being centered on the choice of materials from which the individual bicycle components are made. In particular, other techniques employed in the manufacture of bicycle hubs include improving the quality of the bearings used in the hubs, and improving the tolerances of the bearing and race assemblies. A typical result of such techniques, for example, may be a reduction in the frictional resistance related to the hub's rotation about the axle of the wheel.
Currently, two primary types of bicycle wheels are used, namely disc and spoke wheels. Examples of disc-shaped wheels include the models 900, 909 and 999 disc wheels sold by Compositech, Inc. of Speedway, Ind. under its ZIPP® SPEED WEAPONRY® brand. An example of such a disc-shaped wheel is also shown in FIGS. 1 and 2 of the Applicant's co-pending Ording '785 Patent. Although the ZIPP Wheels are used mostly on bicycles, they may also be used on other human-powered vehicles such as wheel chairs.
A disc wheel is a wheel that includes a hub at its center and a wheel body having a solid, generally planar disc-shaped surface that extends from the central hub to the perimetral tire engaging surface of the wheel. Although disc wheels are far less commonly used than spoke type wheels, disc wheels are much more aerodynamically efficient wheels and are used by bicycle racers in time trial events, sprint events, and track events, because of their highly prized low aerodynamic resistance properties.
The second typical type of human-powered vehicle wheel is a spoke-type wheel. A spoke-type wheel is disclosed and discussed in Ording and Poertner, U.S. Pat. No. 6,991,298, issued on 31 Jan. 2006, and assigned to the Assignee of the instant invention.
A spoke-type wheel includes an endless ring shaped rim and a central hub. A plurality of spokes extend between the centrally positioned hub and the ring shaped rim to connect the hub and rim, so that the rim is supported about the central hub. Individual spokes may be tightened so that this rim support is kept nearly the same at individual points around the rim. Such a tightening process may be part of a tuning procedure for a wheel that may also include balancing the wheel using weights, alignment, etc. Although spoke-type wheels do not have aerodynamic resistance properties as low as those for disc wheels, they are far more commonly used than disc wheels because they provide better all around performance in non-controlled conditions, such as one would encounter when riding on an open road. For example, a disc wheel may suffer the disadvantage of acting as a "sail" which, because of its large surface area, tends to cause instability for a bicycle when cross winds are encountered.
Common to both wheel types is the use of a hub at the center of the completed wheel.
As noted in the Ording '176 Application, the Applicants discovered that adding surface features to either a disc or spoke-type wheel helps to improve the aerodynamic efficiency of the wheel, by lowering the aerodynamic resistance of the wheel as the wheel moves forward through the air when a bicycle is being ridden.
The Applicants have found that the design and use of aerodynamic surface features in a hub member can also provide significantly improved properties to the bicycle wheel.


An infrared sensor for temperature sensing comprises a cap covering a substrate; an IR-radiation filtering window in the cap transparent to IR radiation; a first sensing element comprising a set of N thermocouples on the substrate covered by the cap, whose hot junctions may receive radiation; a second sensing element comprising a set of N thermocouples on the substrate covered by the cap whose hot junctions may not receive radiation; first connection modules for connecting a number N1 of thermocouples of the first sensing element, second connection modules for connecting a number N2 of thermocouples of the second sensing; connecting means for connecting an output of the first connection modules of the first sensing element with an output of the second connection modules of the second sensing element, and an output of the combined outputs of the sensing elements.

The temperature of an object may be measured by measuring the amount of infrared radiation emitted by heat sources. The emission of infrared (IR) radiation is higher with increase of source temperature. In traditional IR temperature sensors, the sensor is provided with a shielding cap which filters infrared radiation for transmission, blocking the rest. For instance, visible light may be blocked by a silicon filter, which lets substantially solely IR radiation pass. The IR radiation may be emitted by an object of interest, which is a heat source.
The shielding cap is typically thermally isolated from the sensing element, for instance by leaving a spatial gap of air or vacuum between the cap and the sensing element. The IR radiation is then collected by the sensing element, which heats up due to the collected energy. This sensing element may for example be a radiation absorbing membrane. The heating results in a temperature change. This temperature change is detected, for example by the hot contact of a thermocouple. The difference of temperature between the sensing element and a reference produces a readable electrical voltage signal which depends on the amount of IR radiation received from the object of interest (and hence, of the temperature of the object of interest). In the case of thermocouples, the reference is provided by a cold contact. The difference of temperature between the hot contact (the sensing element) and cold contact (the reference) creates a small voltage, which can be read as a measurement value for the amount of heat, emitted from the heat source, entering the detector. Hence the measurement value of the voltage is a value representative for the temperature of the heat source.
Normally the hot contact is attached to a membrane which absorbs the infrared radiation and the cold contact is attached to the bulk matrix of the device. Several factors contribute to errors in the measurement. The sensing element may receive parasitic signals from sources other than the object of interest, for instance from the detector housing. The increase of the reference temperature may also affect the measurement. In case of thermocouples, the bulk reference temperature may increase (for instance, due to environmental conditions) and create an offset, thus diminishing the accuracy of the measurement. Document U.S. Pat. No. 6,236,046 shows a detector comprising a first substrate, an active primary sensing element and a cap with a window allowing IR radiation to reach the active sensing element. The sensing element comprises a thermocouple with its cold junction attached to the first reference substrate. An additional passive secondary detector is allowed to receive IR radiation from the first reference substrate, so the offset is compensated by subtracting the signal of the additional detector from the signal of the active sensing element.
However, in practice, the parasitic contributions and the offset are not completely eliminated. For instance, the signals of the active and passive detectors may not compensate optimally due to differences in the characteristic and construction of the sensing elements. This may result in an offset value existing even when no object of interest (no heat source) is present.

Infrared sensor with sensor temperature compensation


A liquid crystal display device using a flexible film as a panel substrate is produced such that the panel substrate is connected to a drive circuit substrate detachable for reuse, that transparent electrodes on the panel substrate are free of damage from conductive particles in the connection, and that a hotmelt adhesive for connection may be prevented by a simple arrangement from being deteriorated with outside air. The liquid crystal display device employs the panel substrates of flexible film, in which transparent electrode terminals formed on the panel substrate are connected to wiring terminals formed on a drive circuit substrate. A radiation-setting adhesive such as an ultraviolet-curing adhesive and a photo-setting adhesive is coated on a surface of a connection portion forming the transparent electrode terminals of the panel substrate. Conductive members are projectively provided on a surface of a connection portion forming the wiring terminals of the drive circuit substrate. A hotmelt adhesive covers a surface of the drive circuit substrate including the conductive members.

1. Field of the Invention
The present invention relates to a liquid crystal display device and a process for producing it. More particularly, the invention relates to the connection between a connection terminal portion of a transparent electrode and an electrode connection portion formed on a drive circuit substrate in a liquid crystal display device having upper and lower substrates of flexible film.
2. Description of the Related Art
A conventional liquid crystal display device is formed such that a pair of panel substrates are laminated with a small gap between them and that a liquid crystal is filled in the gap. In such a liquid crystal display device, an anisotropic conductive film is used for connection of wiring terminals on a drive circuit substrate with transparent electrode terminals formed on a panel substrate. The anisotropic conductive film is a thermoplastic adhesive, a thermosetting adhesive, or an adhesive mass in which conductive particles are dispersed.
If an inspection finds a defect, the connection between the panel substrate and the drive circuit substrate is separated in order to allow the reuse of the substrates. There is a method known to enable the separation of the connection between the panel substrate and the drive circuit substrate, which uses two adhesives different in thermal hardening temperature for connection between the substrates. In this method, the substrates are connected at a first thermal hardening temperature. If an inspection finds a defect in a liquid crystal display unit with the substrate. thus connected, the connection is softened at a second temperature higher than the first thermal hardening temperature, to separate the drive circuit substrate from the panel substrate.
This connection method may be applied to a liquid crystal display device using a glass plate for panel substrate, but cannot be applied to those using a flexible film such as polymer film for panel substrate. A flexible film substrate reveals a low heat resisting temperature. For example, a polyester film has a glass transition point of 80.degree. C. A substrate of polyester film would have a thermal expansion and contraction at a temperature over the glass transition point of polyester, for example about 130.degree. C., which results in breakage of transparent electrodes (ITO: Indium Tin Oxide electrodes) on the substrate. If substrates are connected by the above-mentioned connection method using two adhesives different in thermal hardening temperature, a temperature difference of 20.degree.-30.degree. C. is necessary in thermal hardening temperature between the two adhesives. A thermoplastic resin such as polyester film has a softening point of about 130.degree. C., while a thermosetting adhesive normally has a thermal hardening temperature of about 170.degree. C. Therefore, the above connection method is not suitable for application to a separable connection of panel substrate.
Further, if a polyester is used as a panel substrate, a bonding strength between transparent electrodes (ITO) and the polyester substrate is lower than that between the transparent electrodes (ITO) and an anisotropic conductive film. Thus the transparent electrodes (ITO) would be stripped from the polyester substrate when the drive circuit substrate is separated from the polyester substrate for reuse. This causes difficulties in separation and in reuse of the substrates.
As explained above, conductive particles are dispersed for example in a hotmelt adhesive for connection. The conductive particles may be metal particles of nickel, solder, silver, or other metal, or, gold-plated plastic beads with a diameter of several .mu.m to several ten's .mu.m. If a panel substrate is made of glass, the conductive particles could be crushed upon heat press for connection between the panel substrate and the drive circuit substrate, thereby face-contacting with the transparent electrodes on the glass substrate. In contrast, if a panel substrate is made of polymer film, the conductive particles may damage a transparent electrode. For example, a conductive particle may break a transparent electrode and another particle may cause cracks in the transparent electrode, because the polymer film substrate is softer than the conductive particles. Such damages cause unstable contact between the polymer film substrate and the conductive particles due to a difference in thermal expansion and contraction between the materials after aging. This results in poor contact between the materials.

Liquid crystal display device and method of producing the same having an improved connection between a flexible film substrate and a drive circuit substrate


An apparatus for generating an acoustic signal which has a dielectric substrate having opposed first and second sides. A pair of electrodes are mounted on the first surface of the substrate so that the electrodes are spaced apart from each other. A high voltage power source is electrically connected to the electrodes to produce a high voltage electric potential between the electrodes and this high voltage electric potential is less than a level sufficient to create a surface arc discharge along the first surface of the dielectric substrate. An electrical conductor strip is mounted to the second side of the substrate. A trigger signal circuit then applies a trigger voltage signal to either the electrical connector strip or one of the electrodes which varies the electric field between the electrodes in an amount sufficient to ionize air adjacent one of the electrodes and create a surface arc discharge along the first surface of the dielectric between the electrodes which generates the acoustic impulse as a byproduct of the discharge.

I. Field of the Invention
The present invention relates to a device for generating an acoustic signal as a product of surface arc discharge between two electrodes.
II. Description of Related Art
There are many previously known devices which rely upon an electric arc discharge between two electrodes to generate an acoustic pulse of high volume. Such devices have many uses, but are particularly useful for crowd control and as a non-lethal weapon.
One such device is disclosed in U.S. Pat. No. 5,903,518 to Benwell et al. In the Benwell et al. patent, a pair of spaced electrodes are contained within a housing and separated by an air gap. A high voltage power supply is electrically connected to the electrodes so that a high voltage electric potential is created between the electrodes.
In order to initiate the electric arc between the electrodes across the air gap, a high voltage signal is applied to a trigger electrode positioned in between the electrodes. The potential between the trigger electrode and the main electrodes is then sufficient to ionize the air between the electrodes thus forming an electrically conductive path and creating an arc discharge between the electrodes. A high volume acoustic pulse, in addition to heat and light, results from the arc discharge.
The previously known devices for generating an acoustic pulse using an arc discharge across an air gap, however, are disadvantageous for several reasons. One disadvantage of these previously known devices is that the distance between the electrodes, and thus the ultimate length of the electric arc between the electrodes, is limited which limits the length of the electric arc discharge. This limited length for the electric arc discharge limits the acoustical output from the device.
While it is possible to increase the length of the arc discharge through air by increasing the high voltage power supply applied to the electrodes, the use of such extremely high voltage power sources is not only expensive, but also potentially hazardous.

Apparatus for generating an acoustic signal

United States of America as represented by the Secretary of the Army


Multilayered films produced by coextruding or laminating films comprised of at least one layer of polymethylpentene, at least one layer of a polyamide and an intermediate polymeric adhesive layer. The polyamide layer allows the polymethylpentene layer to be stretched up to 6 times its original length. Such a high orientation ratio for the mulitlayered film increases the mechanical strength and toughness properties of the film. The mulitlayered films are suitable for use as release films for high temperature composite applications such as printed circuit boards.

1. Field of the Invention
The present invention relates to polymeric films and methods for making the same. More particularly, this invention pertains to polymethylpentene-containing films having improved mechanical, thermal and release properties when exposed to high temperatures.
2. Description of the Prior Art
It is known in the art to produce mulitlayered polymeric films containing a polymethylpentene ("PMP") layer and a thermoplastic layer. For example, U.S. Pat. No. 5,106,692 discloses a delamination resistant structure of layers of PMP and various thermoplastic resins in which a specific adhesive interlayer blend is sandwiched between the layers. The adhesive interlayer blend is a specific blend by a specified weight percent of an ethylene/alpha olefin random copolymer, a functionalized polyolefin, and a tackifier. Such patent discloses that the thermoplastic resins may be polyethylene, polypropylene, nylon, polycarbonate, ethylene/alpha-olefin copolymers, poly(4-methyl-pentene-1), polyacrylate, polymethyl methacrylate, polyvinyl chloride, polyvinylidene chloride, polystyrene, poly-p-xylene, polyesters, and polyamides.
Because of their good water barrier properties, multilayered PMP-thermoplastic films are often laminated to metal sheets for use in the manufacture of corrosion resistant cans for beverages and valve cups for aerosol containers, as in U.S. Pat. No. 5,079,052.
Mulitlayered PMP-polyolefin films are also useful as release films for various high temperature composites such as thermoset composite laminates used in the aerospace industry and printed circuit boards ("PCB"), such as in U.S. Pat. No. 5,080,979. However, because such films typically lose their dimensional stability at temperatures in excess of about 350.degree. F. (177.degree. C.), these films must be cured at lower temperatures for a long period of time. Other known polyolefin release films disadvantageously leave olefin residue on the PCB surface after curing.
It would be desirable to produce a PMP-containing film that retains its dimensional stability and release properties at high temperatures. It would further be desirable to reduce the production cycle time for high temperature composites by using a release film which can be cured both rapidly and without leaving a residue on the surface of the composites.


A computer-implemented low-code development platform is provided including a user interface and having access to a library of step macros configured for user configuration and interconnection via the user interface to generate executable code. Each step macro includes a step configuration generator and an execution code generator. The step configuration generator is configured to generate a step configuration file based on user-configurable data points configurable via the user interface. The execution code generator is configured to generate executable code in the form of a compiled step file configured for storage in memory and execution by a processor of a computing system. The execution code generator receives and inputs the step configuration file into a metaprogramming component configured to interpret the user-configurable data points of the step configuration file and to generate and output the compiled step file.

A low-code development platform is a software platform that provides a software development environment that users can use to create application software through graphical user interfaces and configuration instead of traditional computer programming, often termed "hand coding".
Typically, such platforms may focus on design and development of a particular kind of application: such as databases, business processes, or user interfaces such as web applications. Such platforms may produce entirely operational applications or require additional coding for specific situations. Low-code development platforms may aid in reducing the amount of hand coding, enabling accelerated delivery of business applications. Such platforms may permit a wider range of people to contribute to an application's development as opposed to only those with formal programming skills as may be the case with traditional hand coding. Initial cost of setup, training, and deployment of an application can also be lowered through the use of a low-code development platform.
Existing low-code development platforms may not adequately interpret and display source code schematically in a user interface and there is accordingly scope for improvement.
The preceding discussion of the background to the invention is intended only to facilitate an understanding of the present invention. It should be appreciated that the discussion is not an acknowledgment or admission that any of the material referred to was part of the common general knowledge in the art as at the priority date of the application.


The present invention relates to a support-attached resin film for an interlayer insulating layer, including a support, and a resin composition layer formed on one side surface of the support in which the support has particles exposed on the one side surface, and an average maximum height of exposed portions of the particles is 1.0 μm or less, or the support has no particles exposed on the one side surface, a multilayer printed wiring board using the support-attached resin film for an interlayer insulating layer, and the multilayer printed-wiring board.

In recent years, for a multilayer printed wiring board to be used for electronic devices, communication devices, etc. there is a growing demand for acceleration of an arithmetic processing speed as well as miniaturization, weight reduction, and high density wiring. As a method for manufacturing a multilayer printed wiring board that meets these requirements, for example, a build-up type multilayer printed wiring board is becoming mainstream, in which a prepreg or the like is used as an insulating layer, and only necessary portions are connected through via holes formed by laser irradiation, etc. so that a wiring layer is formed.
In order to realize fine wiring of the multilayer printed wiring board, high smoothness is required for the insulating layer that forms wiring. However, when the above via holes are formed, in some cases, the surface of the insulating layer around the via holes is damaged by laser, and the unevenness of the surface of the insulating layer around the via holes becomes large, which may disrupt fine wiring.
As a method for solving this problem, PTL 1 discloses a construction method in which an adhesive film composed of a support having a release layer, and an organic insulating resin layer is laminated on a core substrate, and is thermally cured with the support attached, and then drilling is performed with laser or a drill while the support is attached or after the support is peeled off. According to this construction method, since the support is attached to the surface of the insulating layer during the drilling processing, a damage to the vicinity of via holes may be suppressed.

Resin film for interlayer insulating layer with support, multilayer printed circuit board, and method of manufacturing multilayer printed circuit board


Techniques and devices are provided for injecting transactions within computer systems having a plurality of multi-processor clusters. Each cluster includes a plurality of nodes, including processors, a service processor and an interconnection controller interconnected by point-to-point intra-cluster links. The processors and the interconnection controller in each cluster make transactions via an intra-cluster transaction protocol. Inter-cluster links are formed between interconnection controllers of different clusters. Each of the processors and the interconnection controller in a cluster has a test interface for communicating with the service processor. The service processor is configured to make an injected transaction according to the intra-cluster transaction protocol via one of the test interfaces. In preferred embodiments, the service processor is configured to make an injected transaction according to the intra-cluster transaction protocol via a test interface of an interconnection controller in the same cluster.

The present invention relates generally to multi-processor computer systems. More specifically, the present invention provides techniques for building computer systems having a plurality of multi-processor clusters.
A relatively new approach to the design of multi-processor systems replaces broadcast communication among processors with a point-to-point data transfer mechanism in which the processors communicate similarly to network nodes in a tightly-coupled computing system. That is, the processors are interconnected via a plurality of communication links and requests are transferred among the processors over the links according to routing tables associated with each processor. The intent is to increase the amount of information transmitted within a multi-processor platform per unit time.
Previous implementations of such systems have had shortcomings. Some of these shortcomings relate to obtaining debugging information while the system is running. For example, prior implementations do not provide the ability to determine a configuration state of nodes in a cluster while the system is running. Instead, the system would need to be brought down in order to determine such configurations. Similarly, prior implementations have had a limited ability to respond to information determined during a debugging operation. For example, it would be desirable to fix problems such as deadlocks due to dropped packets, etc., without bringing the system down. It is therefore desirable to provide methods and devices by which multiple-cluster computing systems have improved troubleshooting and debugging functionality.

Methods and devices for injecting commands in systems having multiple multi-processor clusters


An editor or software engineering tool may be configured to represent program code as a doubly-linked list of lexical tokens and to maintain, coincident with an operation that modifies contents of the list, an undo object that identifies opposing end nodes of a sublist of one or more lexical tokens corresponding to a substring that is either inserted into or removed from the list by the operation. In this way, lexical tokens corresponding to an inserted substring can be readily and efficiently excised to restore a pre-insertion tokenized list state. Similarly, lexical tokens corresponding to a removed substring can be readily and efficiently reinstated to restore a pre-deletion tokenized list state. Advantageously, undo support once employed to restore a prior tokenized list state is symmetrically available to support redo operations. In some embodiments in accordance with the present invention, undo-redo entries are maintained in an operation ordered set that is traversed to support one or more operations in either the undo or redo directions. In some realizations, such an ordered set of undo-redo entries is maintained by, or in conjunction with, an undo-redo manager.

1. Field of the Invention
The present invention relates generally to interactive software engineering tools including editors for source code such as a programming or mark-up language, and more particularly to facilities for supporting undo and/or redo operations on a token-oriented representation.
2. Description of the Related Art
In an editor for computer programs, it may be desirable to represent program code using a token-oriented representation, rather than as simply a linear sequence of characters. In such a representation, the linear sequence of characters that corresponds to program code may be divided into substrings corresponding to the lexical tokens of the particular language. In some implementations, this representation of a stream of tokens can updated incrementally after each user action (for example, after each keystroke) using techniques such as those described in U.S. Pat. No. 5,737,608 to Van De Vanter, entitled "PER KEYSTROKE INCREMENTAL LEXING USING A CONVENTIONAL BATCH LEXER." In general, such updates may require the insertion and/or deletion of tokens in or from the token stream.
A commonly supported and highly desirable function of conventional text editors is "Undo-Redo." This function permits a user to reverse the effects of the most recently performed editing operation (i.e., to Undo it), and then optionally to reverse the undo in order to get back to the original state (i.e., Redo the Undo). It is generally desirable for such Undo-Redo functionality to permit a compound or multi-step Undo operation, thereby permitting the user to unwind as many of the most recently performed editing operations as desired. A compound Redo correspondingly reverses a sequence of Undo operations.

This patent is subject to a terminal disclaimer.

Undo/redo technique for token-oriented representation of program code


A cleaning method using vaporized solvent is provided. A solvent-containing vapor is generated, wherein the solvent-containing vapor comprises a solvent. The solvent-containing vapor is conducted to a substrate having debris or contaminants to clean the substrate, wherein the solvent-containing vapor condenses to form a liquid on a surface of the substrate. The liquid phase of the solvent-containing vapor is changed to a solid phase. The solid phase of the solvent-containing vapor is changed back to a liquid phase. The substrate is spun dried to remove the solvent-containing vapor in liquid phase and any debris or contaminants.

Semiconductor devices are produced and used throughout the world in electronic and various other types of devices. Semiconductor devices are formed on semiconductor chips, and are often referred to as chips, which include millions of features and components that combine to form an integrated circuit or other semiconductor device. There is a constant push to increase integration levels of semiconductor devices by including more components on a chip of a given size, so that the increased functionality can be achieved on each semiconductor device chip. As such, semiconductor device features continue to shrink and there is an ongoing drive to shrink features and components further. One aspect of feature sizes that continue to shrink is the production of high aspect ratio features on or in a substrate.
For example, the lateral dimensions of holes, trenches, gaps, or other features that extend downwardly into a substrate or into a film or films formed over a substrate, continue to shrink. Advanced processing techniques allow for these holes, trenches, or gaps with shrinking lateral dimensions to be formed deeper and deeper into substrates or film or films formed above the substrates. As such, the aspect ratio continues to become greater.
Practically every substrate upon which semiconductor devices are being formed undergoes multiple wet processing operations. The wet processing operations include cleaning operations and etching operations. As the aspect ratio of holes, trenches, or gaps formed on or over the substrate become greater, it becomes increasingly more difficult for the cleaning or etching solvents to extend downward to completely fill the holes, trenches, or gaps and the efficiency of the cleaning process becomes lower. If the etching or cleaning solvent does not extend to the bottom of the holes, trenches, or gaps, undesirable residue or debris can remain after cleaning operations and undesirable material intended to be etched, can remain after etching operations. This is due, at least in part, to surface tension of the solvent liquid that is introduced onto the surface as an etching or cleaning fluid, and can also be due to reaction products or by-products.
There is also a solid-air surface tension on the surface of the substrate that can result in voids, i.e. air bubbles, when a substrate is undergoing wet processing. This results in small areas on the substrate that are not reached by the solvent liquid.
Also, it is difficult for the wet solvent that is used in the cleaning or etching process to flow into and out of voids or openings that may exist in microscopic residue, debris, or contaminants on the substrate.
To enhance the particle removal efficiency, some cleaning methods use physical force, such as megasonic power, ultrasonic power, or fluid jet to assist the solvent in removing undesirable residue. However, the physical force or pressure from the sprayed solvent may cause lateral damage, such as pattern collapse (e.g., photoresist layer or permanent layer), especially in advance node devices.

Device manufacturing cleaning process using vaporized solvent

Taiwan Semiconductor Manufacturing Company, Ltd.