The invention relates to optics comprising adjustable optical elements and, if desired, lenses of fixed focal lens. By use of an appropriate controller for the adjustable optical elements, characteristics of the optics can be advantageously varied. For this purpose, systems are provided which are suitable for use as surgical stereo-microscope, objective, ocular or zoom. A zoomable imaging optics comprises lenses and of variable optical power, which are oppositely controlled by means of a controller to change an imaging ratio, so that the optical power of the one lens is increased and the optical power of the other lens is decreased. Moreover, the imaging optics may comprise still further assemblies of fixed optical power.

1. Field of the Invention
The invention relates to imaging optics with adjustable optical power. The imaging optics is an optics of very general nature for use, for example, in a camera, telescope, a microscope or other optics. Furthermore, the invention relates to a method of adjusting an optical power in particular of a zoomable imaging optics.
Furthermore, the invention relates to a stereo-microscopy system for generating a magnified stereoscopic image of an object, as well as to a corresponding stereo-microscopy method.
A zoomable imaging optics is an imaging optics, the imaging ratio or magnification of which is variable.
2. Brief Description of Related Art
A conventional zoomable imaging optics comprises three lens assemblies, one of which is fixedly mounted in a support and the two other ones are displaceable along an optical axis of the optics to vary a magnification. In order to correctly displace these two lens assemblies relative to one another and relative to the fixedly positioned lens assembly, quite complex mechanics are required. Moreover, the necessary displacement of the lens assemblies requires the optics to have a relatively large minimum overall length.
From U.S. Pat. No. 4,820,028 a zoomable optics is known comprising a lens of variable optical power for changing the magnification, so that a mechanical displacement of lenses along the optical axis is not necessary. The lens of variable optical power forms part of an optics which, moreover, comprises plural lenses of fixed optical power and enables a relatively good compensation of imaging aberrations at a specific setting of the lens of variable optical power. However, if the optical power of the lens of variable optical power is varied to change the magnification, imaging aberrations occur which have a disturbing effect.
A conventional stereo-microscopy system comprises a left-hand stereo optics for generating a left-hand partial image of the stereoscopic image, as well as a right-hand partial stereo optics for generating a right-hand partial image of the stereoscopic image.
U.S. Pat. No. 6,081,372, for example, discloses a stereo-microscopy system of the so-called "Grenough" type, wherein each one of the left-hand partial stereo optics and the right-hand partial stereo optics comprises a separate objective assembly. Principal axes of both partial stereo optics are oriented at an angle relative to one another such that they intersect in an object plane of the two objective assemblies. If, in such a stereo-microscopy system, a working distance between the object plane and the objective assemblies is to be changed, the angle between the two principal axes must be changed accordingly, which renders the required mechanics unreasonably complex under practical aspects.
DE 90 16 892 U1 and U.S. Pat. No. 5,701,196 disclose stereo-microscopy systems, wherein an objective is provided for transforming an object-side beam bundle, emanating from an object plane of the objective, into an image-side beam bundle, and wherein left-hand partial stereo optics and right-hand partial stereo optics are provided in the respective image-side beam bundle and extract therefrom a left-hand partial beam bundle and a right-hand partial beam bundle, respectively, to generate therefrom the left-hand partial image and the right-hand partial image, respectively, of the stereoscopic image. The principal axes of the two partial beam bundles of the left-hand and right-hand partial stereo optics are fixedly positioned spaced apart from another and traverse the common objective also spaced apart from each other. The objective provides an optical power of a round lens. The objective comprises at least one assembly of positive optical power and one assembly of negative optical power, a distance between the two assemblies being variable to change a working distance between the objective and an object plane of the objective. In contrast to the stereo-microscopy system known from U.S. Pat. No. 6,081,372, no angle need to be changed between the principal axes of the two partial stereo optics in order to change a working distance.
The stereo-microscopy systems known from DE 90 16 892 U1 and U.S. Pat. No. 5,701,196 have proved successful in practice as far as the change of the working distance is concerned, but exhibit different optical characteristics, as against a comparable stereo-microscope with fixed working distance, i.e., wherein the working distance is not changeable. For example, in the stereo-microscopy system known from DE 90 16 892 U1, the assembly having a negative optical power is disposed closer to the object plane than the assembly having a positive optical power. Consequently, a principal plane of the objective is disposed, viewed from the object plane of the objective, behind the objective. Accordingly, a focal length of the objective is longer than a working distance between objective and objective plane. Due to the, as compared to the working distance, long focal length, the objective exhibits a total magnification, stereo impression and resolution which are diminished as compared to the corresponding objective with fixed focal length in which the focal length corresponds about to the working distance.
In the stereo-microscopy system known from U.S. Pat. No. 5,701,196, the assembly of positive optical power is disposed closer to the object plane than the lens assembly of negative optical power. As a result, a principal axis of the objective is disposed between the objective and the object plane. Accordingly, a focal length of the objective is shorter than a working distance between the object plane and the objective as such. This causes a decrease in the object field diameter and the depth of field as well as in an increase in the overall length, the overall volume and weight as compared to a corresponding objective with fixed focal length.

Imaging optics with adjustable optical power and method of adjusting an optical power of an optics


A conveyor system has a pair of main conveyor belts having confronting inner stretches oriented horizontally and vertically adjacent one another parallel to a transport direction and extending through a weighing station. The belts are spaced to grip vertical sides of a succession of objects and moved to advance the objects between them in the direction through the weighing station. A weighing conveyor belt has a horizontally oriented and upwardly directed stretch between and underneath the main belts at the station. The main-belt stretches are deflected apart generally only at the station for releasing objects gripped by the main belts and setting them to rest with their full weights on the weighing belt in the weighing station. The weighing belt moves to advance the objects through the weighing station. This way the objects on the weighing belt can be individually weighed.

Conveyors are widely used and are in particular employed in packing machines in which objects are packed into packages such as cartons, boxes or the like and are subsequently shipped off to the client. One way to ensure that a package that has been automatically packed holds the correct number of objects is to weigh it. To do this, the packages typically have to be taken out of production line and passed through a weighing apparatus, then returned to the production line. Such a procedure is fairly complex.


Provided is a bilirubin derivative-based ultrasound contrast agent for diagnosis and treatment. The fine particles including the bilirubin derivative are sensitive to reactive oxygen species (ROS), bind with hydrophobic drugs, and can effectively chelate metals such as iron oxide nanoparticles. Therefore, the fine particle of the present invention can be used as an ultrasound contrast agent for diagnosis, as a magnetic resonance imaging contrast agent, or as a carrier for hydrophobic drugs or platinum-based drugs.

Ultrasound refers to sound waves with frequency higher than 20,000 Hz, which is outside the human hearing range. Ultrasonic waves are spread, reflected, absorbed, and dispersed at various interfaces such as internal organs, bones, muscle tissues, and blood. Imaging technique using the difference in signal between interfaces is known as ultrasonography.
An ultrasound imaging device is one of the most widely used medical diagnostic technologies, with its excellent mobility and accessibility. An ultrasound imaging device is the safest and fastest diagnostic technique compared to techniques such as magnetic resonance imaging (MRI) and computed tomography (CT). It is a low-cost, high-efficiency diagnostic technique. However, since the image quality is low compared to techniques such as MRI, CT, and PET, various ultrasound contrast agents have been developed to improve the image quality.
An ultrasound contrast agent is a form of microbubble or nanobubble including a hydrophobic gas core, located at the center, surrounded by a shell of proteins, (phospho)lipids, or polymers. When the gaseous bubble of the ultrasound contrast agent enters the bloodstream, which is an aqueous environment, and is exposed to ultrasound, resonance and ultrasound dispersion occurs. This increases the image signal, and a clearer image can be obtained.
However, in order to enhance the image at a desired location, the contrast agent bubbles must not burst due to temperature or pressure changes at the interface between the gas and the liquid. Therefore, the substances constituting the shell, which surrounds the ultrasound contrast agent, must impart structural stability to the bubbles and be little influenced by the body's immune system.
Hydrophobic molecules have mainly been studied as candidate substances that make contact with the core of the ultrasound contrast agent. Recent studies have branched beyond diagnosis using ultrasound, and have been attempting to non-invasively treat diseases using ultrasound. In particular, high-intensity focused ultrasound (HIFU) that uses non-ionizing ultrasonic waves to generate heat in a focused area of tissues has been used to burn the tissue area (thermal ablation). Further, ultrasound contrast agents that simultaneously perform diagnosis and treatment have emerged as a new modality.

Bilirubin derivative-based diagnostic and therapeutic ultrasound contrast agent


The method enables an axial movement, in particular in the form of a pendulum motion of a numerically controlled axis to be carried out with minimal computational expenditure of time and energy. For this purpose, the pendulum profile is subdivided into the time intervals (t.sub.n-1,t.sub.n), in which different motion processes (acceleration, no velocity or constant velocity) take place. In each system clock, it is checked in which time interval (t.sub.n-1,t.sub.n), the sum of the already output system clocks (i.sub.N T) lies, so that with the corresponding, previously determined path-time equation (S.sub.n (t)), the path segments to be output by the control are calculated and can be output to the operating mechanism of the axis. A change in the tool path feedrate by means of an override setpoint selection can be effected in the fine interpolator by multiplying the system clocks (T) by a constant factor (f).

The present invention relates generally to methods for controlling machine tools or robots, and more particularly to a method for controlling the acceleration and velocity (i.e. the feedrate) of at least one controllable axis of a machine tool or robot.
In certain machining processes, which are performed with numerically controlled machine tools or robots, a so-called pendulum or oscillating motion is superimposed on a movement along a trajectory. From robotics, two different solutions for generating this pendulum motion are known. They can be described by the terms "cartesian" and "axis-specific" oscillation, i.e. swinging in pendulum fashion. In the case of "cartesian" oscillation, the cartesian coordinates of the pendulum figure or pendulum curve are specified and transformed by the robot control into a robot-specific coordinate system. It is not a question in this case of actually superimposing a pendulum motion on any path at all, but rather of producing the actual path right from the start in the form of a pendulum motion. Since this method requires a control setpoint selection for all robot axes, it entails a large computing capacity and considerable time.
The axis-specific pendulum movement pertains to an actual superimposition of a pendulum motion on to any movement along a trajectory. The movement along a trajectory is calculated by the numerical control for all axes of a machine tool or a robot, and the pendulum motion is carried out each time from the last axis, that is usually the tool-bearing axis.
One advantage of the "axis-specific" pendulum movement is that a time-consuming conversion of the cartesian pendulum values into axis-specific values, as is required in the case of cartesian pendulum movement, need not be performed. Thus, higher pendulum frequencies can be reached with axis-specific pendulum movement than with cartesian pendulum movement, so that axis-specific pendulum movement still remains relevant technology.
When previous axis-specific pendulum methods are applied, the acceleration and deceleration ramp calculation for generating the motion of the pendulum axis is carried out in the fine interpolator. For that reason, on the one hand, the time needed to calculate the pendulum motion is still relatively long and, on the other hand, the acceleration and the pendulum velocity must be constantly monitored, so that permissible limiting values are not exceeded.
Another disadvantage of the axis-specific pendulum method lies in the fact that a change in the tool path feedrate cannot be taken into consideration by the pendulum motion, which change is supposedly able to be initiated by the user by stipulating an override value, for example, or can be automatically initiated by means of sensors. This is because the calculations with respect to a change in the tool path feedrate are already carried out in the cartesian interpolator, which is connected to the fine interpolator. An override setpoint selection, through which means the tool path feedrate is decelerated, for example, would cause the pendulum figure to become distorted, since the velocity of the pendulum movement does not change with the tool path feed rate.
The present invention is directed to the problem of developing a method for controlling the acceleration and velocity of at least one numerically controllable axis of a machine tool or robot, with which the above-mentioned disadvantages are avoided.

Method for controlling the acceleration and velocity of at least one controllable axis of a machine tool or robot


The method of the invention provides an improved method for converting primary printer color values to combinations of the primary printer color values and black to achieve improved printer output color representations. The method includes the following steps. A first balanced set of primary printer color combinations (e.g., CMY) is initially derived which provides a balanced gray representation at various levels of primary color concentration. A second balanced set of primary printer color combinations (e.g., CMYK) is derived which provides a balanced gray representation at various levels of color concentration. Next, a set of primary printer colors (CMY) with K is derived, using the first balanced set, which best represents shadow colors, and a maximum color value is chosen therefrom. Then, a similar set of primary printer colors is calculated which best represents highlight values, by interpolating from the chosen maximum color value to a white value. CMYK color values are then determined, using the second set, shadow colors and highlight colors, which represent regions between black, white and maximum color points already found. Next, a color separation action is performed wherein input primary color values are matched, by interpolation, to closest primary printer color values and black that have been derived above. Thereafter, the stored values are utilized to populate a table which enables conversion of input primary printer color values (e.g., CMY) to combinations of such values with black (CMYK) for use during rendering by a printer.

Laser driven color printers and copiers employ transparent toners which enable light to reflect off the page and to be directed back towards the eye. In general, such devices employs Cyan (C), Magenta (M) and Yellow (Y) toners as the principal component colors, from which other colors are created. Light passing through CMY toners has part of its color filtered out or absorbed by the toner such that the reflected light takes on the color of the toners that it passes through. In laser printers (and some copiers), a black (K) toner is used which is opaque to light. If a K toner is overprinted onto CMY to achieve darker colors, such as found in shadows, much of the colorfulness of the shadows is lost. Using K toner exclusively to achieve dark colors also results in much less colorful dark colors because less surrounding colorant is used.
Thus, to increase the range of colors available from a printer/copier, it is necessary to find a correct balance of K and CMY toners to produce dark colors, while allowing the dark colors to remain as colorful as possible.
While the prior art has employed combinations of the three primary colors cyan, magenta and yellow (CMY) to produce darker colors ranging to black, the need to deposit 100% density toner layers for each color causes an excessive amount of toner to be deposited on the media sheet (e.g. up to 300%). Such a high level of toner deposition does not fuse well and, in general, creates unsatisfactory images. Accordingly, prior art printing procedures have utilized combinations of K and CMY toners to achieve dark or shadowed color images.
When a printer receives image data from a host processor, the data is received in the form of either RGB or CMY values. In either case, the received values are converted to CMYK values in order to achieve desired levels of color representation on the final printed document. Such conversion, depending upon the color value parameters that are set by the printer manufacturer, can result in variable color representations when printers of different manufacturers are coupled to a host processor.
Accordingly, it is an object of this invention to provide an improved method for converting primary printer color values to combinations of the primary printer color values with black to achieve improved printer output color representations.
It is another object of this invention to provide an improved method for converting CMY to CMYK, while retaining a maximum gamut of available colors.
It is a further object of this invention to provide an improved method for converting CMY to CMYK, while maintaining toner quantities within determined limits.


Embodiments for controlling condensate in an engine heat exchanger are disclosed. In one example, a method for an engine comprises increasing exhaust gas recirculation (EGR) flow responsive to condensation in an EGR cooler. In this way, condensate in the EGR cooler may be controlled via modulation of EGR flow.

Engine heat exchangers, such as charge air coolers and other coolers, may function to cool the temperature of charge air entering the intake manifold, providing charge air with higher density and thus increased engine power and improved fuel efficiency. Further, cooled charge air may lower combustion temperatures and aid in controlling certain engine emissions. However, under certain conditions, such as when the air in the heat exchanger is cooled below its dew point, condensate can form within the heat exchanger. The condensate may accumulate and then be swept to the engine, causing misfire and other problems; it can also reduce the effectiveness of the heat exchanger over time. Further, particularly in exhaust gas recirculation coolers which cool exhaust being recirculated back to the intake, acidic compounds may be present in the condensate, resulting in degradation to the cooler and/or downstream components.
To prevent the accumulation of condensate within the heat exchanger, a bypass line may be provided around the heat exchanger. During conditions in which condensate is predicted to form in the cooler, the air normally provided to the heat exchanger may be routed through the bypass line to avoid possible deposition of condensate within the heat exchanger. However, such bypass lines may be expensive and increase the complexity of the engine control system strategy. Further, it may be difficult to accurately predict when condensation may form, resulting in unnecessary bypass of the air and increased temperature and decreased density of the charge air.
The inventors have recognized the issues with the above approach and offer a method to at least partly address them. In one embodiment, a method for an engine comprises increasing exhaust gas recirculation (EGR) flow responsive to condensation in an EGR cooler.
In this way, the flow of EGR may be increased in response to condensation in an EGR cooler. In one example, the EGR flow may be increased when an estimated amount of accumulated condensate in the EGR cooler exceeds a threshold. The amount of accumulated condensate in the EGR cooler may be estimated based on both an amount of condensation that forms within the EGR cooler, as well as an amount of condensate that evaporates out of the EGR cooler over a given duration. By tracking both the amount of formed condensate as well as the amount of evaporated condensate, the amount of condensate that actually accumulates in the heat exchanger may be more accurately determined. Further, by adjusting EGR flow responsive to condensation in the cooler, condensate may be removed without utilizing a complicated bypass system, or in addition to such a bypass system.
The above advantages and other advantages, and features of the present description will be readily apparent from the following Detailed Description when taken alone or in connection with the accompanying drawings.
It should be understood that the summary above is provided to introduce in simplified form a selection of concepts that are further described in the detailed description. It is not meant to identify key or essential features of the claimed subject matter, the scope of which is defined uniquely by the claims that follow the detailed description. Furthermore, the claimed subject matter is not limited to implementations that solve any disadvantages noted above or in any part of this disclosure.

Condensate accumulation model for an engine heat exchanger


A pressure sensing apparatus (1) includes an elastically deformable pressure-sensitive diaphragm assembly (13) having a pressure-sensitive metal or metal alloy diaphragm (14). A functional filled dielectric layer (25) is on the diaphragm and includes a base dielectric material and at least one CTE raising filler. A CTE of the functional filled dielectric layer provides a CTE @ 800° C.≧8 ppm/° C., such as ≧10 ppm/° C. A plurality of piezoresistive elements (27) are on the functional filled dielectric layer (25).

For years, those skilled in the art have made continuous efforts to develop pressure sensors that are low in cost and capable of being mass produced, while exhibiting high reliability, sensitivity and linearity. Certain conventionally known pressure sensors have been known to include semiconductor materials with a micromachined sensing diaphragm. In the processing of such structures, a thin diaphragm is often formed in a silicon wafer through chemical etching. Ion implantation and diffusion techniques are then used to drive doping elements into the diaphragm, forming piezoresistive elements whose electrical conductivity changes with strain, such that deflection or deformation of the diaphragm causes a change in resistance of the piezoresistive elements. These changes correspond to the magnitude of pressure applied to the diaphragm. However, silicon is susceptible to chemical attack and erosion, particularly in environments such as where a high-pressure medium is to be sensed. For example, automotive applications that can involve sensing pressures of brake fluid, oil, coolant, transmission fluid, hydraulic fluid, fuel, steering fluid, and engine cylinders, at pressures of two atmospheres or more. For such applications, a pressure sensor must be physically resilient, and resistant to the hostile environment of the sensed medium.
As an alternative to silicon, diaphragms can be formed from metals or ceramics, which tend to be more physically resilient, and resistant to the hostile environment of a sensed medium as compared to silicon. One pressure sensor design positions a sensing component onto a base component comprising a diaphragm assembly that includes a diaphragm at its center, wherein the diaphragm comprises a metal or ceramic. On top of the diaphragm is a dielectric layer. On top of the dielectric layer is generally a plurality of piezoresistive elements.
Although commercially available dielectric compositions, such as DuPont QM44H™, DuPont 5704™, DuPont QS4200™ and ESL 9505-C™, may have good CTE and chemical compatibility with respect to certain ceramic substrates (e.g. alumina), such dielectric compositions generally do not provide have good CTE compatibility and in some cases chemical incompatibility with metal or metal alloy substrates, such as steels. Significantly, CTE mismatches between the substrate material comprising the diaphragm and the dielectric layer on top can result in significant stress caused by differential expansion which can result in bowing and distortion of the diaphragm which can render data from the pressure sensor to be erroneous, or in extreme cases the pressure sensor even becoming inoperable. Bowing and distortion is generally most prevalent in high temperature applications and is also known to occur during fabrication of the pressure sensor itself, particularly during the cool-down cycle associated with the high temperature dielectric firing step (e.g. 850° C.).

Filled dielectric on metal pressure sensor


A switch mode power converter that precisely controls average switching current and operating frequency. The switching control operative in hysteretic average current mode control provides wide bandwidth operation without the need for slope correction. The switching converter ripple current is varied by a frequency comparator in response to a comparison of the switching frequency to a reference frequency. The ripple current is adjusted to obtain correlation between the operating switching frequency and the reference frequency. Peak current levels are precisely controlled and may be limited to prevent component stress levels from being exceeded. Current levels are continuously monitored with a current sense amplifier, or monitored with a high-gain low energy current sampler. Feedback loop independent line and load regulation is provided by continuous current monitoring, or by using variable slope charge and transfer voltage to pulse width converters when operating with a current sampler based system.

Accurate control of peak and average current levels in switch mode power converters is critical to many power conversion applications. Peak current levels must not be exceeded to prevent saturation of the magnetic flux storage medium in the inductor, or magnetic flux storage element. Accurate control of the converter average output current is critical to protect load equipment during system failure modes, such as short circuit conditions, and to protect expensive power conversion elements from damage due to electrical stress. Input current control is needed to reduce the peak stress levels of electromagnetic interference (EMI) input filters components. Also, high power factor correction systems, such as switch mode power factor corrected rectifiers require accurate control of input current levels.
Power conversion systems often require wide bandwidth line and load response to maintain constant current levels into sensitive loads. Light Amplification by Stimulated Emission of Radiation (LASER) loads require precise current control because they respond exponentially to the stimulation current levels that are used to pump the LASER. Very short current stress levels result in catastrophic damage to the LASER, or degradation of the LASER's useable life. Loads, such as organic light emitting diodes, require large pre-charge current pulses, and benefit from being driven by high response rate power converters. Wide bandwidth power converters are needed in portable applications where large output filter capacitors cannot be used to meet load dump demands because they would require too much space.
Rapidly controlled transitions of the power converter output voltage are needed for many types of dynamic loads. This is the case for applications that require a variable output regulation point, such as the radio frequency (RF) power amplifiers in cell phones. The RF power amplifier often requires the highest operating power in cell phone applications. Supplying a variable level power source to the RF power amplifier can increase the RF power amplifier power efficiency significantly.
In RF power amplifier applications, it is important to be able to alter the power source output voltage rapidly, as well as maintain regulation with a minimal value output filter capacitor, if efficiency gains are to be realized. As the RF power amplifier supply is adjusted to meet the transmission power level needs for a specific cell phone environment, there is energy that is wasted in lost output filter capacitor charge. Thus, the power converter should have wide bandwidth response, as opposed to using large output filter capacitors to maintain regulation during rapid load current variations.
It is also critical to RF systems that the power converter have a controllable operating frequency. This is important to insure the switch mode power supply switching noise does not interfere with sensitive RF circuits.
Peak current mode control, average current mode control, and hysteretic average current mode control are typically used to meet some of the demands for power conversion as just described. All of the existing approaches have some adequate features but, unfortunately, these approaches also have many undesirable limitations.
Peak current mode control is typically used to address the needs of wide bandwidth voltage-to-current and voltage-to-voltage power conversion. Peak current mode control operates at a fixed frequency, and improves the bandwidth of the converter by regulating the peak inductor current, and thereby removing the effects of the inductor on the output filter response. Peak current mode control does not accurately regulate average current levels. Peak current mode control improves frequency response, but requires the addition of slope correction for duty cycles greater than 50 percent.
Average current mode control can also be used to meet some of the power conversion requirements as previously described. The operating frequency is fixed, and average current can be controlled accurately. Average current mode control does not require slope correction. However, average current mode control does not provide accurate control of peak current levels. Also, average current mode control uses a high gain current amplifier with ripple feed forward to improve line and load regulation, which can be susceptible to noise. Lastly, average current mode control requires continuously monitored current levels, and their associated losses.
Hysteretic average current mode control provides well regulated current levels and wide bandwidth response, does not require slope correction, but operates at a variable switching frequency, and requires continuously monitored inductor current levels with their associated power losses. A prior art example of a hysteretic average current mode power converter is shown in FIG. 1.
FIG. 1 is a schematic view of a prior art buck hysteretic average current mode converter 10. The buck mode voltage-to-voltage converter topology is presented in this example. However, the two state control method used in hysteretic average current mode control is applicable to many converter topologies, such as, but not limited to, boost, buck-boost, inverting, and active power factor corrected rectifiers.
The first terminal of an inductor 12 is selectively connected to input voltage source 34 with a charge switch 18, and selectively connected to GROUND with a transfer switch 20. The second terminal of the inductor 12 is connected to a filter capacitor 22 and load element 24. The charge switch 18 and transfer switch 20 are controlled by the state of the RS flip-flop (RSFF) 52, which provides the charge transfer control node 50. When the charge transfer control node 50 is in the logic high state, the charge switch 18 is on, and provides a low impedance connection of the inductor 12 between the input voltage source 34, and the filter capacitor 22 and load element 24. When the charge transfer control node 50 is in the logic low state, the charge switch 18 is off, and provides a high impedance disconnect. When the charge transfer control node 50 is in the logic low state, the transfer switch 20 is on, and provides a low impedance connection of the inductor 12 between the filter capacitor 22 and load element 24, and GROUND. When the charge transfer control node 50 is in the logic high state, the transfer switch 20 is off, and provides a high impedance disconnect. The charge switch 18 and transfer switch 20 are typically implemented as break before make switches, which prevents input voltage source 34 to GROUND shoot though currents during switch state transitions.
When the charge transfer control node 50 is in the logic high state, the charge switch 18 is on, and the transfer switch 20 is off. And, the input voltage source 34 is switch connected to the first terminal of the inductor 12. This provides a charging current path for the inductor 12 from the input voltage source 34 to the output node 36, which increases the inductor 12 current. When the charge transfer control node 50 is in the logic low state, the charge switch 18 is off and the transfer switch 20 is on. And, the first terminal of the inductor 12 is switch connected to GROUND through the transfer switch 20, and the second terminal of the inductor 12 is connected to the output node 36. This provides a discharging current path for the inductor 12. Thus, as the charge transfer control node 50 changes logic state, the power converter transitions between charging and discharging the inductor 12. This results in a ripple current as the inductor 12 current achieves a peak current level following the charging period, and a trough current level following the discharge period or transfer period.
The ripple current is monitored by the combination of a current sense element 32, current sense amplifier 14, and supporting passive components. This provides a voltage signal that is proportional to the inductor 12 current at the current monitor node 38. Continuous current monitoring power losses are often high in order to achieve reliable current sense signals, which decreases the power converter efficiency.
During the charging period the inductor 12 current increases, which causes the current monitor node 38 voltage to increase. The current monitor node 38 voltage is compared to the peak demand node 40 voltage by the peak comparator 46. When the current monitor node 38 voltage exceeds the peak demand node 40 voltage, the peak comparator 46 output transitions to the logic high state, and resets the RS flip-flop 52, causing the charge transfer control node 50 to transition to the logic low state. When the charge transfer control node 50 transitions to the logic low state, the charge period is terminated, and the transfer period begins.
During the transfer period the inductor 12 current decreases, which causes the current monitor node 38 voltage to decrease. The current monitor node 38 voltage is compared to the trough demand node 42 voltage by the trough comparator 48. When the current monitor node 38 voltage descends below the trough demand node 42 voltage, the trough comparator 48 output transitions the logic high state, and sets the RS flip-flop 52, causing the charge transfer control node 50 to transition to the logic high state. When the charge transfer control node 50 transitions to the logic high state, the transfer period is terminated, and the charge period begins.
The output node 36 voltage is regulated by controlling the average demand node 44 voltage at the output of the voltage sense amplifier 16 to null the difference between a scaled version of the output node 36 voltage and the voltage reference 35. When the output node 36 is below the desire output voltage level, the average demand node 44 voltage increases, which commands more current to the load element 24 and filter capacitor 22 to increase the voltage at the output node 36. When the output node 36 is above the desired output voltage level, the average demand node 44 voltage decreases, which commands less current to the load element 24 and filter capacitor 22 to decrease the voltage at the output node 36. Thus, the output is voltage regulated as the average demand node 44 voltage is adjusted in response to changes in the output node 36 voltage.
The average demand node 44 is connected to a summation element 28 and a difference element 30. The summation element 28 provides the peak demand node 40 signal by adding the average demand node 44 voltage to one half the ripple demand signal 26. The difference element 30 provides the trough demand node 42 signal by subtracting one half the ripple demand signal 26 from the average demand node 44 voltage. The ripple demand signal 26 is scaled by one half by the multiplication element 54. The ripple demand signal 26 is set to control the ripple current level of the converter, which is proportionally related to the converter switching frequency. However, the converter switching frequency is not accurately controlled, and varies with input voltage source 34, output node 36 voltage, and inductor 12 value. Converter switch frequency variation is highly undesirable for sensitive RF and analog signal condition applications. Therefore, hysteretic average current mode control does not meet the requirements for frequency regulation that are needed for many power conversion applications.
FIG. 2 is a waveform view of prior art signals for the hysteretic average current mode power converter depicted in FIG. 1. This figure illustrates how inductor 12 current, which is proportional to the current monitor node signal 62 voltage, increases and decreases as the peak demand node level 56 and trough demand node level 58 are exceeded and descended below respectively. The average demand node level 60 is centered at one half the ripple demand signal level 70 from the peak demand node level 56 and trough demand node level 58. The charge slope 72 can be calculated by the charge slope equation 64. The transfer slope can be calculated by the transfer slope equation 66. The charge slope equation 64 and transfer slope equation 66 are accurate approximations that are well accepted, and used by power converter designers for deigning switch mode power converters. The switching frequency can be calculated from the charge slope equation 64 and the transfer slope equation 66, and the ripple demand signal level. The switching frequency equation 68 illustrates that conventional hysteretic average current mode control is inversely proportional to inductor 12 ripple current and inductor 12 inductance, and also varies with the input voltage source 34 (Vin) and the output voltage node (Vout).
As illustrated by the description of the prior art, hysteretic average current mode control controls peak, average, and minimum current levels, and achieves wide bandwidth operation without the need for slope correction. However, operating frequency varies with the power converter inductor value, Vin and Vout, and power losses are increased due to continuously monitored inductor current levels.

Frequency regulated hysteretic average current mode converter


A partially crosslinked thermoplastic elastomer composition having an excellent heat-bondability is obtained by dynamically heat-treating a peroxide-crosslinking olefin copolymer rubber with an .alpha.,.beta.-unsaturated carboxylic acid or a derivative thereof in the presence of an organic peroxide.

1. Field of the Invention
The present invention relates to a thermoplastic elastomer composition having an excellent heat-bondability to various resins and metals and having a high rubbery elasticity, a good moldability and a high heat resistance. More particularly, the present invention relates to a partially crosslinked thermoplastic elastomer, which is formed by dynamically heat-treating a peroxide-crosslinking olefin copolymer rubber with an unsaturated carboxylic acid or a derivative thereof in the presence of an organic peroxide.
2. Description of the Prior Art
A thermoplastic elastomer has been known as an energy-saving and resource-saving substitute for a cured rubber.
As the thermoplastic elastomer of this type, there is known, for example, an olefinic thermoplastic elastomer comprising as the main component an ethylene/propylene/non-conjugated diene copolymer rubber. This thermoplastic elastomer is excellent in thermoplastic elastomer performances, but since the bondability to various resins or metals is insufficient, the application range of this thermoplastic elastomer is considerably limited.
Graft modification of the above-mentioned rubber component with maleic anhydride or the like has been tried for improving the bondability. In this case, the bondability is improved, but such a disadvantage as reduction of the rubbery elasticity, the moldability and the like cannot be avoided.
Namely, a thermoplastic elastomer which is excellent in such properties as rubbery elasticity and moldability and has an excellent bondability to various resins and metals has not been known.


The oil pan includes an oil introducing portion that has an oil introducing plate. The oil introducing plate has an insertion hole for receiving a sucking portion of an oil strainer. The oil introducing plate extends from the periphery of the insertion hole toward a side wall of the oil pan. The oil returned from the first oil return passage is introduced to flow along the oil introducing plate via an oil falling hole formed in a baffle plate that is positioned at the bottom of a crank case of the internal combustion engine. The oil introducing portion further includes a plurality of inclined wall portions mounted on a bottom portion of the oil pan in the vicinity of the side wall of the oil pan in order to support the oil introducing plate. Opening portions are formed between the inclined wall portions and the bottom portion of the oil pan. The oil introducing plate of the oil introducing portion is located just below the oil falling hole formed in said baffle plate.

1. Field of the Invention
The present invention relates to an oil pan of an internal combustion engine.
2. Description of the Related Art
Oil for lubricating respective sliding portions of an internal combustion engine is deposited in the oil pan of the internal combustion engine and supplied to those respective sliding portions of the internal combustion engine by means of an oil pump and the like through an oil strainer.
After lubricating a sliding surface between a cylinder and a piston and bearings of a connecting rod and crank shaft of the sliding portions of the internal combustion engine, oil floats in the condition of mist within a crank case. The oil is heated by a high-temperature blow-by gas leaking from the sliding surface between the cylinder and the piston, drops onto a baffle plate, and thereafter returns to the oil pan.
As regards the internal combustion engine, for example, Japanese Utility Model Application Laid-Open NO.HEI4-71716 discloses a structure for preventing the oil strainer from being exposed over the oil surface and sucking air due to the tilt of the oil surface generated at the time of acceleration or deceleration for startup or stop of a vehicle or turning. Therefore, the oil is stably supplied to the respective sliding portions of the internal combustion engine, thereby improving wear resistance.
According to the structure disclosed in this document, a lidded cylindrical baffle plate for defining an oil holding space to surround the oil strainer is provided on an oil sump within the oil pan. This lidded cylindrical baffle plate has a communicating opening hole which communicates with the interior of the oil pan. The oil strainer is inserted into the communicating opening at its lid portion. A dent portion which communicates with the interior of the oil pan is formed at the bottom of this cylindrical body. Consequently, by holding a sufficient amount of oil within the oil holding space by this cylindrical body, oil can be supplied to the respective sliding portions of the internal combustion engine stably even when the oil surface is tilted.
However, the structure of such oil pan allows hot oil recovered after floating within the crank case to enter into the oil holding space through the communicating opening hole formed in the lid portion on the top of the baffle plate. Consequently, the hot oil is supplied to the respective sliding portions of the internal combustion engine from the oil strainer, thereby possibly badly affecting the lubrication performance.


A semiconductor memory device and a method for generating a reference voltage needed for operating the same are disclosed. The semiconductor memory device includes a first decoder configured to generate a default set signal in response to a reset signal and a clock enable signal, a second decoder configured to generate a reference voltage set signal in response, and a reference voltage provider configured to generate an internal reference voltage.

Embodiments of the present invention relate generally to a semiconductor memory device and a method for generating a reference voltage for operating the same, and more particularly to a semiconductor memory device including a reference voltage generator setting up an internal reference voltage, and a method for generating a reference voltage for operating the semiconductor memory device.
Semiconductor memory devices such as Dynamic Random Access Memories (DRAMs) are being widely used in electronic devices. With broadening uses of miniaturized high-speed electronic devices, the efforts to highly integrate the semiconductor devices and to improve its operation speed continue.
Joint Electron Device Engineering Council (JEDEC) serving as a semiconductor standardization organization has standardized a wide Input/Output (I/O) scheme considering a parallel-interface Low Power Double Data Rate (LPDDR) and a die stack package as the next-generation DRAM scheme. Many semiconductor companies are making efforts to develop DRAMs having more improved functions based on JEJEC standard.
With rapid development of mobile devices, the next-generation DRAMs optimized for such mobile devices have been rapidly developed to have smaller sizes and lower power consumption. Specifically, various attempts, such as voltage scaling, structural improvement, new I/O signaling, and signal-integration improvement, have been made to achieve low power consumption as well as to compensate for power consumption due to a high-speed operation.

Semiconductor memory device, system having the same and method for generating reference voltage for operating the same


Solder bumps are fabricated by plating a first solder layer on an underbump metallurgy, plating a second solder layer having higher melting point than the first solder layer on the first solder layer and plating a third solder layer having lower melting point than the second solder layer on the second solder layer. The structure then is heated to below the melting point of the second solder layer but above the melting point of the first solder layer and the third solder layer, to alloy at least some of the first solder layer with at least some of the underbump metallurgy and to round the third solder layer. Accordingly, a trilayer solder bump may be fabricated wherein the first and third layers melt at lower temperatures than the second solder layer, to thereby round the outer surface of the solder bump and alloy the base of the solder bump to the underbump metallurgy, while allowing the structure of the intermediate layer to be preserved. Solder bump fabrication as described above may be particularly useful with lead-tin solder wherein the first solder layer is eutectic lead-tin solder, the second solder layer is lead-tin solder having higher lead content than eutectic lead-tin solder and the third solder layer is eutectic lead-tin solder. In yet other embodiments, the thickness and/or composition of the outer underbump metallurgy layer and/or of the first solder layer may be selected so that upon heating, sufficient tin from the first solder layer is alloyed with at least some of the outer underbump metallurgy layer, such that the first solder layer is converted to a fourth solder layer having the same lead content as the second solder layer. Bilayer solder bumps thereby may be provided.

This invention relates to microelectronic devices and fabrication methods therefor, and more particularly to structures and methods of forming electrical and mechanical connections for a microelectronic substrate, and the connections so formed.
Solder bump technology is widely used for electrical and mechanical interconnection of microelectronic substrates. For example, an integrated circuit chip may be connected to a circuit board or other next level packaging substrate using solder bumps. This connection technology also is referred to as xe2x80x9cControlled Collapse Chip Connectionxe2x80x94C4xe2x80x9d or xe2x80x9cflip-chipxe2x80x9d technology, and will be referred to herein as xe2x80x9csolder bumpsxe2x80x9d.
In solder bump technology, an xe2x80x9cUnderBump Metallurgyxe2x80x9d (UBM) may be formed on a microelectronic substrate having contact pads thereon, for example by evaporation and/or sputtering. A continuous underbump metallurgy generally is provided on the pads and on the substrate between the pads, in order to allow current flow during subsequent solder plating.
In order to define the sites for solder bump formation over the contact pads, a mask is formed, for example by forming a thick layer of photoresist on the underbump metallurgy and patterning the photoresist to expose the underbump metallurgy over the contact pads. Solder pads then may be formed on the exposed areas of the underbump metallurgy, over the contact pads, by electroplating. The plated solder accumulates in the cavities of the photoresist, over the contact pads. The underbump metallurgy between the plated solder then may be etched, using the solder as an etch mask, to break the electrical connection between the solder bumps. The plated solder then may be reflowed to form solder bumps. During reflow, the solder bump also may alloy with the underbump metallurgy, to form an intermetallic. Solder bump fabrication methods and structures are described in U.S. Pat. No. 5,162,257 to Yung; U.S. Pat. No. 5,293,006 to Yung; U.S. Pat. No. 5,447,264 to Koopman et al.; U.S. Pat. No. 5,767,010 to Mis et al.; U.S. Pat. No. 5,793,116 to Rinne et al.; U.S. Pat. No. 5,892,179 to Rinne et al.; U.S. Pat. No. 5,902,686 to Mis; and U.S. Pat. No. 5,963,793 to Rinne et al., and need not be described further herein.
As microelectronic technology continues to advance, it may become increasingly desirable to use solder bump technology in an increasing variety of microelectronic devices. Conventional solder bumps use alloys of lead (Pb)-tin (Sn) solder. In these solder bumps, it may be desirable to maintain a high lead content to allow a high degree of flexibility in the solder bump, which can thereby absorb mechanical stresses that may be caused by thermal expansion coefficient mismatches between the substrates that are connected by the solder bumps. Unfortunately, as the lead content of lead-tin solder increases above or below 37% from eutectic lead-tin solder (63 Sn-37 Pb), the melting point of the solder bump generally increases. This increased melting point may require higher temperatures for solder reflow and/or joining. These higher temperatures may damage microelectronic devices in a microelectronic substrate. Moreover, it may be more difficult to form a strong connection between the solder bump and the underbump metallurgy as the lead content continues to increase.
Attempts to provide high performance solder bump connections are described in U.S. Pat. No. 4,673,772 to Satoh et al.; U.S. Pat. Nos. 5,130,779 and 5,251,806 to Agarwala et al.; U.S. Pat. No. 5,542,174 to Chiu; U.S. Pat. Nos. 5,553,769, 5,859,470 and 5,920,125 to Ellerson et al.; U.S. Pat. No. 5,470,787 to Greer; and in a publication entitled An Extended Eutectic Solder Bump for FCOB to Greer, 1996 Electronic Components and Technology Conference, pp. 546-551. However, notwithstanding these and other attempts, there continues to be a need for solder bumps and fabrication methods that can maintain a high lead content, can reflow at relatively low temperatures and/or can alloy effectively with an underbump metallurgy.
The present invention can provide trilayer/bilayer solder bump fabrication methods by plating a first solder layer on an underbump metallurgy, plating a second solder layer having higher melting point than the first solder layer on the first solder layer and plating a third solder layer having lower melting point than the second solder layer on the second solder layer. The structure then is heated to below the melting point of the second solder layer but above the melting point of the first solder layer and the third solder layer, to alloy at least some of the first solder layer with at least some of the underbump metallurgy and to round the third solder layer. Accordingly, a trilayer solder bump may be fabricated wherein the first and third solder layers melt at lower temperatures than the second solder layer, to thereby round the outer surface of the solder bump and to alloy the base of the solder bump to the underbump metallurgy, while allowing the structure of the intermediate layer to be preserved.
Solder bump fabrication as described above may be particularly useful with lead-tin solder wherein the first solder layer comprises eutectic lead-tin solder, the second solder layer comprises lead-tin solder having higher lead content than eutectic lead-tin solder and the third solder layer comprises eutectic lead-tin solder. In these embodiments, the first and third eutectic lead-tin solder layers can provide a lowest melting point for rounding the top and alloying the base of the solder bump. However, the high lead content of the intermediate (second) solder layer may be preserved to provide flexibility for the bump. Moreover, since the first, second and third solder layers are plated, the columnar plated structure within the intermediate solder layer may be preserved, to thereby allow further increases in flexibility. Thus, the second solder layer may be maintained in its xe2x80x9cas platedxe2x80x9d condition.
Embodiments of the invention may be used with underbump metallurgy systems that include an outer layer of copper. In these embodiments, heating may be performed to alloy sufficient tin from the first solder layer with at least some of the outer layer comprising copper, such that the first solder layer is converted to a fourth solder layer having the same lead content as the second solder layer. This can create a bilayer solder bump wherein the second and fourth solder layers have the same lead content, after reflow, and a eutectic third (outer) rounded layer caps the second solder layer. In yet other embodiments, heating is performed to alloy at least some tin from the first solder layer with at least some of the copper outer layer of the underbump metallurgy, such that the first solder layer is converted to a fourth solder layer having higher lead content than eutectic lead-tin solder, but not having the same lead content as the second solder layer. Accordingly, these embodiments may provide trilayer reflowed solder bumps.
In yet other embodiments, the thickness and/or composition of the copper outer layer and/or of the first solder layer may be selected so that upon heating, sufficient tin from the first solder layer is alloyed with all of the copper in the outer underbump metallurgy layer, such that the first solder layer is converted to a fourth solder layer having same lead content as the second solder layer. Bilayer solder bumps thereby may be provided. In yet other embodiments, the thickness and/or composition of the first solder layer and/or of the outer layer of the underbump metallurgy maybe selected to alloy some tin from the first solder layer with all of the copper in the outer layer, such that all of the outer layer is converted to copper-tin alloy and the first solder layer is converted to a fourth solder layer having higher lead content than eutectic lead-tin solder, but not the same lead content as the second solder layer.
Other embodiments of the present invention may be used with underbump metallurgy systems having a nickel outer layer. As was described above in connection with a copper outer underbump metallurgy layer, the thickness and/or composition of the nickel underbump metallurgy layer and/or of the first solder layer may be controlled to alloy some or all of the nickel and/or convert the first solder layer to higher lead-tin content than eutectic lead-tin solder or the same lead content as the second solder layer.
In yet other embodiments of the invention, the first solder layer comprises about 3000 xc3x85 of eutectic lead-tin solder, the second solder layer preferably comprises about 40 microns of solder having higher lead content than eutectic lead-tin solder, and the third solder layer preferably comprises at least about 10 microns of eutectic lead-tin solder. In order to convert all of the underbump metallurgy outer copper layer to copper-tin alloy, about 5000 xc3x85 of copper may be provided. However, other thicknesses and compositions may be provided according to embodiments of the present invention.
Embodiments of solder bump structures according to the present invention include an underbump metallurgy, a first plated solder layer on the underbump metallurgy, a second plated solder layer on the first solder layer having higher melting point than the first solder layer, and a third plated solder layer on the second solder layer having lower melting point than the second solder layer. In other embodiments, the first plated solder layer and the third plated solder both comprise eutectic lead-tin solder, whereas the second plated solder layer comprises lead-tin solder having higher lead content than eutectic lead-tin solder. The underbump metallurgy preferably includes an outer layer comprising copper or nickel. In yet other embodiments, the second plated solder layer may be wider than the first plated solder layer and the third plated solder layer may be wider than the second plated solder layer. In still other embodiments, the first, second and third plated solder layers each include a plurality of columnar grains that extend across the thickness thereof. Embodiments of solder bump structures of this paragraph may form intermediate structures prior to reflow.
In other embodiments, the first solder layer comprises about 3000 xc3x85 of eutectic lead-tin solder, the underbump metallurgy includes an outer layer of copper of about 5000 xc3x85 in thickness, the second solder layer is about 40 microns in thickness, and the third solder layer is at least about 10 microns in thickness. In other embodiments, the third solder layer comprises lead-tin solder having higher lead content than eutectic lead-tin solder, but lower lead content than the second solder layer. Embodiments of this paragraph also may form intermediate structures prior to reflow.
Other embodiments of solder bump structures according to the present invention include an intermetallic layer comprising an alloy of tin and material other than lead, an intermediate solder layer on the intermetallic layer, and an outer solder layer on the intermediate solder layer having lower melting point than the intermediate solder layer. The intermediate solder layer preferably comprises lead-tin solder having higher lead content than eutectic lead-tin solder, and the outer solder layer preferably comprises eutectic lead-tin solder. The intermetallic layer may comprise an alloy of tin and copper, or an alloy of tin and nickel. In these embodiments, the outer solder layer may be wider than the intermetallic layer. Embodiments of this paragraph may form final solder bump structures after reflow.
In other embodiments, the intermediate solder layer may be about 40 microns in thickness, and the outer solder layer may be at least about 10 microns in thickness. The intermediate solder layer preferably includes columnar grains that extend across the thickness thereof, and the outer solder layer preferably includes a rounded outer surface. Embodiments of this paragraph also may form final solder bump structures after reflow.
Other embodiments of solder bump structures according to the present invention include an underbump metallurgy, a rounded solder bump cap and a solder bump body between the underbump metallurgy and the rounded solder bump cap. The solder bump is wider adjacent the rounded solder bump cap than adjacent the underbump metallurgy. In other embodiments, the solder bump body increases in width from adjacent the underbump metallurgy to adjacent the rounded solder bump cap. In yet other embodiments, the solder bump body continuously increases in width from adjacent the underbump metallurgy to adjacent the rounded solder bump cap. These increased width solder bumps may provide high density connections to underbump metallurgy and large surface area outer connections to other microelectronic substrates.
Accordingly, solder bumps and fabrication methods may be fabricated that can maintain high lead content, low temperature reflow, effective alloying with an underbump metallurgy layer and/or as plated columnar grain structures.

Trilayer/bilayer solder bumps and fabrication methods therefor


A method for hierarchical very large scale integration design comprises representing a structure of the hierarchical very large scale integrated design as a graph comprising design objects. The method further comprises specifying a transformation behavior applied to the design objects, and processing, top-down, the graph to perform the transformation on the hierarchical very large scale integrated design.

1. Field of the Invention
The present invention relates to semiconductor design, and more particularly to a hierarchical system and method for VLSI design.
2. Discussion of Related Art
The design of a Very Large Scale Integration (VLSI) layouts comprises manufacturing layout verification, layout modifications, and verification of design conventions.
Layout verification involves the checking a layout against the design rules (DRC) and a comparison of extracted circuitry against a schematic netlist (LVS).
Layout modifications enhance timing, reliability, and/or manufacturability. A modification is an alteration of the layout without alteration of the logical behavior of the circuitry. Modification steps includes cheesing, i.e., creating patterns of holes, in wide metal areas and filling of spaces to provide uniform density. Modification includes adding redundant vias, and optical proximity correction and other resolution enhancement techniques. Layout modification may be constrained to preserve the existing hierarchy. If not, layout modification has the freedom to exploit rearranging the hierarchy. The degree of freedom available depends on the application.
Methodology checks verify design conventions, e.g., labeling standards for the layout or the observation of contact zones of macros.
An engine for VLSI layout processing has to provide functionality that implements layout verification and modification tasks efficiently. Two mechanisms help in this task.
The hierarchical representation of the VLSI design avoids redundant computations and independent subproblems allow parallel processing.
A VLSI layout processing task, called VLPT, is a composition of basic operations, e.g., expand and shrink, on VLSI design objects, e.g., shapes or levels. Typically the description of a VLPT is given in a high level programming language. The high level language operates primarily on pointsets, attributes, hierarchical structure and concepts derived from interaction principles, e.g., nets based on electrical connectivity (see FIG. 1).
Therefore, a need exists for a system and method for automated hierarchical VLSI design having improved efficiency.

International Business Machines Corporation


An intermodal container tipping apparatus includes an upper support structure configured to be releasably mounted to a container transfer device, such as a reach stacker or crane, and a second support structure configured to be releasably mounted to an intermodal container. The lower supports structure includes at least one arcuate beam. The at least one arcuate beam attaches the lower support structure to the upper support structure. Movement of the at least one arcuate beam relative to the upper support structure causes tipping of the lower support structure and any load attached thereto while substantially maintaining a relative position of the center of gravity of the load.

1. Field of the Invention
The present invention relates generally to equipment for handling intermodal and other transportation containers for transporting materials in bulk, and more particularly to an apparatus configured for attaching to and tipping containers to empty bulk materials from such containers.
2. State of the Art
Intermodal and other transportation containers are often used for transporting various materials in bulk, such as coal, grain, gravel or other materials. One particular application of the use of intermodal containers includes the transportation of waste materials bulk, including various refuse, low level radioactive materials, contaminated soils and the like. Intermodal containers are typically handled by various loading/unloading equipment to transfer the containers between transportation vehicles, such as railroad flat cars, trucks and steamships. For example, a reach stacker may be used to handle and transfer the containers between trucks and railroad flat cars, or to reposition containers in a yard. A reach stacker typically has a telescopic boom to which an expandable attachment (commonly referred to as a "spreader") is attached. The spreader includes a plurality of ISO twist locks that are configured to engage and attach to the intermodal container for lifting. A hydraulic motor and gear reduction system permit clock-wise and counter-clock-wise attachment rotation. Such spreaders are often provided with side shift, manual pile slope capabilities and adjustable guide arms. In addition, electrical safety sensors prevent the twist locks from being locked or unlocked while the spreader is "unseated" and prevent attachment extension or retraction when the twist locks are "locked" or "seated." A twist lock safety interlocking system ensures correct locking procedures. Such reach stackers are manufactured and sold by various companies including the Hyster and Taylor companies. In some instances bulk cargo must be transferred from one intermodal container into another container for shipment, processing or storage or otherwise dumped from the intermodal container. For example, contaminated soil may need to be transferred from an intermodal container to a railroad hopper car for shipment to a remote storage facility. As a result there remains a need for an efficient method of emptying intermodal containers and thereby transferring bulk material from the container into another receptacle.
One known apparatus for assisting the removal of bulk material from an intermodal container is disclosed in U.S. Pat. No. 6,966,741 to Gay et al. Gay et al. discloses an apparatus comprised of upper, middle and lower frames in which the middle and lower frames are arranged to pivot with respect to each other about an axis near one end of the frames. A winch motor is positioned on the upper frame and a cable is attached to the lower frame so that the lower frame can pivot away from the upper and middle frames and empty the contents of the intermodal container. The Gay et al. device, however, can result in unstable conditions during operation in the manner in which it lowers one side of an intermodal container relative to the other thus effectively laterally moving the center of gravity of the intermodal container. As such, there is a further need in the art to provide an intermodal container tipping apparatus that maintains lateral stability of the equipment during the tipping operation by maintaining the center of gravity of the intermodal container during a tipping operation and that is easily adaptable to various types of existing lifting equipment, such as side loaders, reach stackers, cranes, etc.

Apparatus for tipping intermodal containers


A press-connecting joint connector comprises a terminal having a plurality of electrically connected press-connecting blades for electrically connecting a plurality of sheathed wires pressed into the press-connecting blades, a connector body for supporting the terminal therein, the connector body having at least one side wall, a cover, a wire-pressing portion formed on the cover for pressing the wires into the press-connecting blades when the cover is engaged with the connector body, and a notched portion formed in at least one longitudinal end of the at least one side wall of the connector body, wherein at least one of the plurality of wires, when bent, is received by and held against the notched portion to prevent the cover from being disengaged from the connector body by an external force acting on the at least one of the plurality of wires.

1. Field of the Invention
The present invention relates to a press-connecting joint connector, and more particularly, to a press-connecting joint connector for electrically connecting a plurality of wires together.
2. Discussion of the Related Art
Various press-connecting joint connectors have been proposed for electrically connecting a plurality of wires. One example of a conventional press-connecting joint connector is disclosed in Japanese Unexamined Patent Publication No. 58-214283.
FIG. 12 shows an exploded perspective view of a conventional press-connecting joint connector 51. The conventional press-connecting joint connector 51 comprises a terminal 56 made of a metal plate, a strain reduction member 61, a cover 66, and a connector body 63.
The terminal 56 includes a pair of right and left press-connecting blades 53 and 54 juxtaposed at a pitch P1 for electrically connecting two sheathed wires 5 together. The terminal 56 also includes a relief groove 55 formed in a central portion of the terminal 56.
The strain reduction member 61 includes an upstanding cutting plate 58 having a sharp cutting edge at an upper portion thereof, and a strain reduction portion 60 having a pair of end walls 59 disposed parallel to the cutting plate 58. The terminal 56 is held at its tabs 57 by the cutting plate 58.
The cover 66 includes retaining projections 64 and wire receiving grooves 65 at its lower side.
The connector body 63 includes retaining ribs 67 for respectively engaging the retaining projections 64, an upwardly-openable lid 62 pivotally mounted on the connector body 63 for movement between an open and a closed position, and a body cavity for holding the terminal 56 and the strain reduction member 61. A holder groove 68 for holding the terminal 56 is inside the body cavity of the connector body 63.
In the above construction, the strain reduction member 61 is first fitted into the connector body 63, and the terminal 56 is then held in the holder groove 68. Next, the wires 5 are placed in the wire receiving grooves 65, and the cover 66 is press-fitted into the connector body 63 from the top to hold the wires 5 inside the connector body 63. As a result, the wires 5 are cut by the cutting plate 58, and the sheaths of the wires 5 are cut respectively by the press-connecting blades 53 and 54 of the terminal 56. This allows the conductor part of the wires 5 to contact respective ones of the press-connecting blades 53 and 54, so that the wires 5 are electrically connected together. After the retaining projections 64 are engaged with the retaining ribs 67, the lid 62 is pivotally moved into its closed position, and is held in this position by the connector body 63.
Problems associated with the above conventional press-connecting joint connector are as following. As shown in FIG. 13, when the two wires 5 are laterally bent away from each other so that pulling forces with vertical components are exerted on the wires 5, each wire is forced into a gap between the side wall of the connector body 63 and the cover 66. This causes the cover 66 to disengage from the connector body 63.
In addition, as shown in FIG. 12, since the relief groove 55 is formed between the press-connecting blades 53 and 54, the pitch P1 is increased by an amount corresponding to the width of the relief groove 55. This prevents the connector from having a compact design.


A display device is disclosed. The display device includes a first display substrate, an opposite substrate, and a sealing material forming a sealed area including a display area, where the sealing material is disposed between the first display substrate and the opposite substrate. The first display substrate includes a substrate and a flexible thin film, where the flexible thin film includes a first area entirely covering the display area, and a second area beyond the substrate. In addition, a first circuit is disposed on the first area, and a second circuit is disposed on the second area.

The present disclosure relates to the field of displays and particularly to a display device and a method for manufacturing the same.
Thin Film Transistor-Liquid Crystal Displays (TFT-LCDs) with a high display quality, low power consumption, no radiation and other excellent performances have become predominate in the market along with the development of liquid crystal display technologies. An LCD panel generally includes a color filter substrate, and an array substrate, between which liquid crystals are filled, where the liquid crystals are sealed therearound with sealant. With a wider border, the size of the periphery of the LCD panel is larger, the real display area of the display panel is smaller, and a picture is displayed smaller, so the consumer demand for a thinner liquid crystal display panel, and a wider screen cannot be accommodated.
In an existing narrow border design, even with a reduction in width of the border, it may be very difficult to further narrow the border of the liquid crystal display panel due to limitation by the requisite size of a peripheral circuit. Also the peripheral circuit being shrunk extremely due to the narrowed border may result in a degraded charging effect and a lower yield of the circuits.

Display device and method for manufacturing the same

SHANGHAI TIANMA MICRO-ELECTRONICS CO., LTD.


An injection mold for optical discs has a stamper mounted on any one of mold surfaces defining a mold cavity, a cylindrically shaped center pressing member being inserted into and engaged with a center portion of the stamper, and a cylinder piston being placed at a center portion of the mold and movable in forward and backward directions by a fluid pressure in relation to the center pressing member so as to make the center pressing member in contact with the top of the cylinder piston whereby the stamper is detachably mounted on the mold by the center pressing member. The injection mold for optical discs is characterized in that a plurality of crews are provided on the center pressing member at its contact portion to the cylinder piston at circumferentially constant pitch and projections to be engaged with the crews are provided on the top of the cylinder piston, wherein the crews of the center pressing member, the projections and grooves of the cylinder piston, a receiving surface of the mold for positioning the insertion position of the center pressing member with reference to the mold are placed in concentric circle.

The present invention relates to an injection mold for discs such as optical discs, and more particularly to an injection mold for optical discs which has a structure suitable for fixing and exchanging a stamper being mounted on a mold surface of either a movable mold and a stationary mold.
Various structures of a mounting member for mounting the stamper on the mold surface of the mold have been proposed. In general, the stamper is detachably mounted at its peripheral portion and center portion by mounting members.
In the Japanese laid-open utility model publication No. 58-159619, it is disclosed that the stamper is fixed at its peripheral portion by engaging a fixing ring and at its center portion by a stamper fixing pin penetrating the center portion of the stamper, wherein one end of the stamper fixing pin is inserted into a center hole of the mold whilst an opposite end of the stamper fixing pin is provided with a tapered groove so that a wedge-shaped member slidably provided on the mold is engaged with the tapered groove to fix the stamper on the mold.
In the Japanese patent publication No. 62-45809, it is disclosed that the stamper is fixed at its peripheral portion by use of a ring member with screws and at its center portion by a pin-shaped stamper pressing member penetrating the center portion of the stamper, wherein one end of the pin-shaped stamper pressing member is inserted into the mold whilst an opposite end of the pin-shaped stamper pressing member is provided with screws engaged with a gear mechanism externally adjustable to fix and detach the stamper.
The above first conventional structure, where the engagement pin for fixing the center of the stamper provides an advantage of in easy operation but has disadvantages in that the center portion of the stamper is added with offset load whereby the stamper is mounted with a displacement to the mold surface of the mold. This may cause defective mold articles.
The above second conventional structure, where the opposite sides of the engagement pin are fixed with the screws, has disadvantages in complicated operations for detaching the stamper. If, in order to facilitate the external operations, the structure is modified, the modified structure may be complicated resulting in increase in manufacturing cost of the mold.
In order to solve the above problems, the stamper mounting mechanism for mounting the stamper on the mold surface of the mold had been improved for facilitating the fixing and exchanging operations of the stamper and for allowing the quick and sure operations for fixing and exchanging the stamper. The modified stamper mounting mechanism is illustrated in FIGS. 1 and 2. Each of a movable mold 10 and a stationary mold 20 is provided with insert members 12 and 22 in the form of a mold cavity and rings 14 and 24 for positioning the mold cavity. A stamper 30 is provided on the mold surface of the movable mold. Ring members 34 and 36 are mounted in a peripheral portion of the stamper 30. A plurality of claw members 38 are circumferentially and provided at almost constant angle on insides of the ring 14 provided on the movable mold on which the stamper 30 is also mounted. Clearance grooves 40 are provided inside the ring 24 and outside the insert 22 in correspondence to the above claw members 38 so as to allow the claw members 38 to be engaged within the clearance grooves 40 whereby the stamper is detachably mounted at its peripheral portion on the mold surface of the mold.
In the above injection mold, a cyrindrically shaped center pressing member 62 is inserted into and engaged with the center portion of the stamper 30. A plurality of crews 66 are provided on an opposite side of the center pressing member 62 to the side which presses the stamper 30 at circumferentially constant pitch. A cylinder piston 60 forwardly and backwardly operable is placed at the center portion of the movable mold with the mold surface on which the stamper 30 is mounted. An engaging portion is provided at the top of the cylinder piston 60. The engaging portion is made into contact with and engaged with the crews 66 by rotation of the center pressing member. The stamper 30 is detachably mounted on the mold surface of the movable mold by forward and backward movements of the cylinder piston 60.
The cylindrically shaped center pressing member 62 is inserted into and engaged within the center portion of the stamper 30 so as to face to the cylinder piston 60 provided at the center of the movable mold 10. Further, the positioning of the insertion position of the center pressing member 62 to the mold is made by the ring 64 placed at a part of the insert member 12.
In order to fix the center pressing member 62, the crews 66 are provided at circumferentially constant pitch on opposite stamper side (contact portion to the cylinder piston 60 of the center pressing member 62) whilst projections 68 on the top of the cylinder piston 60, which faces to the crews 66, are provided so that the projections 68 are engaged with the crews 66 whereby the center pressing member 62 and the cylinder piston 60 are detachably fixed to each other.
The above third conventional structure has the disadvantages as described below. The ring 64 receives a resin pressure against the center pressing member 62. Since clamp areas formed by the crews 66, the projections 68, and the grooves 70 are positioned inside the ring 64, an inner diameter of the stamper 30 is larger than the diameter of the ring 64. This means it is difficult to reduce the inner diameter of the stamper 30.


Various embodiments of a utility for configuring data sources in a networked computer system are disclosed. A networked computer system may include a number of backend systems hosting a variety of types of data resources including databases produced by a variety of vendors. Application servers running transactional applications as well as many other types of computer systems may be included in the networked system. The data source configuration utility may determine the data source configuration parameters associated with each of the various types of data resources included in the system. When a data source is selected for configuration, the utility may present the configuration parameters corresponding to that particular data source to the user. The utility may create one or more data source configuration files based on parameter values received from the user.

1. Field of the Invention
The invention relates to computer systems and computer software, and more particularly to configuring and verifying data sources in computer systems
2. Description of the Related Art
Enterprise computer systems may include many repositories for information that are accessed by one or more computers to which they are networked. One type of data resource may be relational databases as supplied by vendors such as Oracle, MicroSoft, IBM, Sybase, and others. Many other types of data resources may be included in a networked computer system such as object databases, XML files, Excel files, and web services. In order to access the information stored in a particular type of data resource, an application server within the networked system is typically configured with a driver that includes specific information about how to communicate with that particular data source.
Installation of a data resource driver may involve the entry of system/driver specific information to link various application extensions, utilities, and libraries. In addition to driver installation, a data source corresponding to the data resource may need to be configured on the application server. Procedures and specific information required for driver installation and data source configuration may be highly vendor specific, and in some cases even data resource specific. Each vendor may require the entry of values for a different set of data resource parameters, and may instruct the user in different methods for determining the appropriate values for their system.
Database vendors typically specify a set of configuration parameters that is unique to their own databases. Configuring a data source corresponding to a database often includes searching through a vendor's documentation to discover information regarding appropriate values for configuration parameters, followed by editing various configuration files to incorporate the parameter values. These procedures often result in a proprietary configuration that is specific to a vendor's database product. In some instances a vendor may include some type of utility to assist the user in configuring a specific database product, but again product specific and/or proprietary configurations are typically produced.
The process described above is typically repeated for each different vendor's databases, which are included in a networked computer system. In a system including database products from several vendors, the resultant configuration files may reflect the differences in the various vendors' approaches to specification of configuration parameters. This may add complexity to configuring an application server to make use of the configuration parameters for the different data sources. Once configuration has been accomplished, verification of the configuration normally includes deploying an application and attempting to execute transactions. When problems with the transactions arise, the solution frequently involves iterative adjustment of database configuration parameters and retesting. In large systems, each iteration of application deployment may have a significant impact on system and/or function availability.

Utility for configuring and verifying data sources


An electrical contact for a ball grid array connector is disclosed for providing improved solder ball connection with a substrate. The contacts may be compressed, enabling solder balls of the connector to abut with the substrate prior to reflow. During reflow, the compression may be relieved by the contact extending further into the solder ball, returning the contact to an uncompressed state.

Each contact of a ball grid array (BGA) connector may have a solder ball fixed to an end thereof. The solder balls may be located directly below a connector housing and form a grid array. The BGA connector may be mounted on a circuit substrate, e.g., a printed wiring board, by aligning the BGA with a corresponding array of electrical contact points, e.g., solder pads, on a surface of the substrate. The solder balls may be reflowed to form a solder joint between each connector contact and a corresponding electrical contact point.
The solder balls, however, may not be uniform in shape, size, or location on the contact. This lack of uniformity in the BGA connector may prevent some solder balls from firmly abutting the substrate during reflow.
Therefore, there is a need for a BGA connector and a reflow method that enables the connector to uniformly connect with a substrate.

Ball grid array contacts with spring action


A linkage assembly to connect a tool to a robotic device. The linkage assembly includes a body and a first linkage pair with first and second links that are configured to be connected to a first section of the tool. The linkage assembly also includes a second linkage pair that includes first and second links that are configured to be connected to a second section of the tool. The first linkage pair are powered to provide a force to move the tool relative to the body. The second linkage pair supports the tool and moves with the first linkage pair. Each of the first and second linkage pairs are pivotally connected to the body and may maintain parallel positioning during the movement.

Robotic devices have become an indispensable part of modern manufacturing. The robotic devices are configured to connect to and operative tools that perform a wide variety of jobs. The robotic devices operate the tools to perform many manufacturing tasks tirelessly, in hostile environments, and with high precision and repeatability.
In many robotic manufacturing applications, it is cost-effective to utilize a relatively generic robot device, such as a robotic arm, to accomplish a variety of tasks. For example, in an automotive manufacturing application, a robot arm may be utilized to connect to and position tools that can cut, grind, or otherwise shape metal parts during one phase of production, and perform a variety of welding tasks in another. Different welding tool geometries may be advantageously mated to a particular robot arm to perform welding tasks at different locations or in different orientations.
The connection should provide for the tool to be positioned at a variety of different positions relative to the robotic device. This can include various vertical orientations, extensions, and retractions as necessary to position the tool to perform the desired task. Further, the connection should provide for a fast response to position commands from the robotic device and/or a remote location to provide for rapid positioning of the tool.
The Background section of this document is provided to place embodiments of the present invention in technological and operational context, to assist those of skill in the art in understanding their scope and utility. Unless explicitly identified as such, no statement herein is admitted to be prior art merely by its inclusion in the Background section.

Linkage assembly for attaching a tool to a robotic device


An apparatus for processing and editing an analog audio recording. An analog audio recording device comprises a data receiver for receiving analog audio data and a plurality of analog markers, an analog output for outputting the analog audio data with the plurality of analog markers, and a processing unit coupled to the analog output. The processing unit comprises digitizing circuitry for digitizing the analog audio data with the plurality of analog markers to create a digital audio file comprising digital audio data and a plurality of digital markers. The processing unit also comprises integrated circuit memory storing editing software for editing the digital audio file using the plurality of digital markers to create an edited digital audio file.

It is possible to record analog audio information on a magnetic tape medium or, in the form of discrete charges, on a silicon medium. Recent audio signal compression techniques allow analog audio recordings to be processed for storage in digital form on a computer hard disk, a floppy disk, or other, similar media. Recent advances in signal compression technology make it possible to store more than 1000 hours of analog recording on a single hard disk after being converted to purely digital form and compressed. Audio signal processing capability can be resident on a personal computer (PC), or other computer, in the form of signal processing software. Alternatively, audio signal processing capability can be provided to the computer by an auxiliary digital signal processing (DSP) add-on card or an external DSP peripheral. Once stored in memory on the computer as digital information, voice files can be managed by software written for that purpose.
The cost of hard disk memory continues to decrease. In addition, compression techniques continue to improve, allowing more analog audio information to be stored on less storage space. These developments make use of a computer for storing and manipulating tape-based audio information more attractive. Some disadvantages of tape-based or silicon-based storage of analog audio information are also present with current storage of digital audio information. For example, because the analog or digital audio data is present in a continuous stream, identifying and locating a particular segment requires tedious searching. In addition, editing the audio data to leave out some parts and rearrange others requires identifying and locating segments, and manual cutting and pasting.

Method and apparatus for indexing an analog audio recording and editing a digital version of the indexed audio recording