A multi-chip package substrate for both flip-chip bumping and wire-bonding applications comprises a substrate body having a top surface and a bottom surface. A plurality of bumping pads and a plurality of wire-bonding pads are formed on the top surface. The bumping pads are disposed on the top surface of the substrate body and a pre-solder material is formed on the bumped pads. The wire-bonding pads are disposed on the top surface of the substrate body and a Ni/Au layer is formed on the wire-bonding pads. In order to avoid the bumping pads and the wire-bonding pads from oxidation during packaging processes. The pre-solder material fully covers the bumping pads to avoid the Au intermetallics generated in a plurality of bumps on a bumped chip during packaging processes. The reliability of the multi-chip stacked package for both flip-chip bumping and wire-bonding applications will be greatly improved.

In the conventional multi-chip package, a plurality of chips are electrically connected to a substrate by means of flip-chip bumping and wire-bonding technologies, the chips includes a bumped chip and a wire-bonding chip that are stacked back-to-back. A multi-chip stacked package 100 is disclosed in U.S. Pat. No. 6,157,080. Referring to FIG. 1, the multi-chip stacked package mainly includes a substrate 110, a bumped chip120, a wire-bonding chip 130, a package body 160 and a plurality of solder balls 170. The substrate 110 has a plurality of bumping pads 111 and a plurality of wire-bonding pads 112 formed on the top surface of the substrate 110. The bumped chip120 is flip-chip mounted to the bumping pads 111 of the substrate 110 via a plurality of bumps 140. The wire-bonding chip 130 is attached to the back surface of the bumped chip 120. And a plurality of bonding pads of the wire-bonding chip 130 are further electrically connected to the wire-bonding pads 112 of the substrate 110 by a plurality of bonding wires 150. After electrical connection, the package body 160 is formed on the top surface of the substrate 110 in order to encapsulate the bumped chip 120 the wire-bonding chip 130, the bumps 140 and the bonding wires 150. The solder balls 170 are placed on the bottom surface of the substrate 110. However, the oxidization-resistance structures of the bumping pads 111 and the wire-bonding pads 112 on the substrate 110 are not shown. Normally a reflow step is performed after flip-chip assembly prior to wire bonding. When the wire-bonding pads 112 or the bumping pads 111 are oxidized during packaging processes, the electrical connection of the bonding wires 150 or the bumps 140 are hard to bond to the wire-bonding pads 112 or the bumping pads 111, as the results, the productivity and yield will decrease.
Another conventional structure of contact pad of the package substrate is disclosed in R.O.C. Taiwan Patent No. 515,061 entitled "Ni/Au electroplating process and structure for electrical contact pads of chip package substrate". In order to protect the contact pads of the substrate, the exposed surfaces of the contact pads are plated with a Ni/Au layer so as to protect the contact pads from oxidation during packaging processes. However, the contact pads with plated Ni/Au layer are only for the connection of the Au bonding wires. However, when the solder bumps of the bumped chip are bonded to the Ni/Au layer, the embrittlement of Au will easily happen.
In the foregoing package substrate, when a plurality of bumping pads and a plurality of wire-bonding pads are simultaneously formed on the same surface of the substrate for assembling a back-to-back multi-chip package. The bumping pads are also electroplated with a Ni/Au layer, the solder bumps and the Ni/Au layer on the bumping pads can trigger Au embrittlement during the solder bumps reflow process. Initially, Au element of the Ni/Au layer on the outermost surface will migrate into the solder bumps extremely fast. After complete reaction of the Au layer, then the Ni layer begins to react with the solder bumps to form a pin-shaped Ni3Sn4 intermetallic layer, and the Au element enters the solder bumps to form a (Au1−XNiX)Sn4 intermetallic layer at the bonding interface after reflow. The (Au1−XNiX)Sn4 intermetallic layer is unstable so that it will accumulate at the bonding interface of the bumps of bumped chip and bonding pads of the substrate. The (Au1−XNiX)Sn4 intermetallic layer will expand gradually until the whole bonding interface is covered. The (Au1−XNiX)Sn4 intermetallic layer is fragile so that the bonding interface will easily crack, that is so-called Au embrittlement. Especially, the area of the bumping pads is smaller than the area of the conventional solder ball pads, since the bumping pads are used to mount the bumps of the bumped chip, not solder balls for BGA packages. The Au concentration in the bumps will be higher than that in the conventional solder balls where the Ni/Au electroplated layer is supposed to be the same thickness on the bumping pads and on the solder ball pads. Therefore, the reliability of the packaging body is seriously affected due to too much (Au1−XNiX)Sn4 intermetallic in the bumps.

Multi-chip package substrate for flip-chip and wire bonding

Advanced Semiconductor Engineering, Inc.


The present application discloses a magnetic sensor, fabrication process of perforated integrated circuit module and the magnetic sensor; the magnetic sensor comprises: a head cover, a shaft sleeve, a hollow rotating shaft, a ring alnico, a magnetic sensitive chip matrix, a printed circuit board, a device for output signal and a bottom case; all of them have a through hole except said device for output signal, said magnetic sensitive chip matrix is soldered on said printed circuit board, said device for output signal connects to said printed circuit board electrically, said printed circuit board is mounted below said hollow rotating shaft, and said head cover is mounted on said bottom case to form a cavity, said device for output signal passes out of said cavity. This magnetic sensor can be penetrated by an external shaft and has a thin thickness.

Nowadays, intelligent robots are a very popular research field. Robot joints are the basic components of robots. The quality of robot joints directly affects the performance of robots. At present, most of the robot joints use closed-loop brakes for motion control. Almost all the closed-loop brakes use magnetic sensors as signal feedback electronic components, which provide extremely high-precision output signals in a full 360-degree rotation range.
The magnetic sensor usually works together with an output shaft of motor or an output shaft of speed reduction mechanism to generate an angle or position feedback signal. The output shaft of the motor or the output shaft of the speed reduction mechanism must be stably connected with the magnetic sensor in order to rotate the ring magnet synchronously with the output shaft, and then the magnetic sensor can correctly sense the rotation angle of the output shaft.
However, the existing magnetic sensor generally employs a magnetic sensing integrated circuit (IC), which is a technique of packaging an integrated circuit with an insulating plastic or ceramic material. The shell of the integrated circuit (IC) is covered with epoxy resin, and the inside of the integrated circuit (IC) has many complicated lead frame and wiring. The IC cannot be penetrated, it will damage the internal circuit if making a hole in the IC, and it also must reserves a certain space for the output shaft of the motor or the output shaft of the speed reduction mechanism to insert, which results in the overall thickness of the magnetic sensor designed by such an IC is too large, and the magnetic sensor must be placed at the extreme end of the output shaft, which is not conducive to the design of the servo system (rudder) and the design of the robot joint.

Magnetic sensor, fabrication process of perforated integrated circuit module and fabrication process of the magnetic sensor

SHENZHEN OVA SMART SENSOR TECHNOLOGY LTD


A computer acquires a captured image obtained by capturing an image of an object existing in a space and an image capturing position where the image was captured. Then, the computer determines a virtual-image capturing position, a virtually captured image, obtained when an image of a model generated based on structure data of the object is captured from the virtual-image capturing position, satisfying a specified correspondence relationship with the captured image having been obtained; and determines a position in the space with which the model is associated, based on the acquired image capturing position and positional relationship between the model and the virtual-image capturing position.

Recent years, systems that display images using augmented reality (AR) technology have been widely used. In some cases, mixed reality (MR) technology is used along with AR technology. A system using AR technology and MR technology (AR/MR technology) is capable of, for example, displaying an image of the real world obtained by capturing an image of an object using a camera mounted on a smartphone or the like and computer graphic (CG) data at the same time. Accordingly, the user is able to see AR/VR images or videos in which the real world and CG data are displayed at the same time through a smartphone or the monitor of a head mounted display (HMD).
As related technologies, information processing apparatuses have been proposed which hold three-dimensional model data including multiple line segments constituting an object, acquire an image of the object captured by an image capturing apparatus, and detect from the acquired image the line segments corresponding to the line segments included in the three-dimensional model data. The information processing apparatuses perform a position-attitude calculation process, based on the correspondence between the detected line segments and the held line segments, and calculate information on the position and attitude of the image capturing apparatus with respect to the object the image of which is captured by the image capturing apparatus (for example, see Japanese Laid-open Patent Publication No. 2014-26670).
The use of AR/MR technology also makes it possible to display near an object a model generated using design data used during the design of the object. However, in comparing the object and the model, it may be easier to notice the difference between the object and the model when the object and the model are displayed being superposed with each other than when they are displayed side by side. In this case, when the user looks for the difference between the object and the model, it is preferable that the positions of the object and the model be associated accurately when they are displayed. However, it is difficult to associate the position of the object and the display position of the model with each other accurately.

Determination program, determination method, and information processing apparatus


A semiconductor device capable of reducing a thickness, an electronic product employing the same, and a method of fabricating the same are provided. The method of fabricating a semiconductor device includes preparing a semiconductor substrate having first and second active regions. A first transistor in the first active region includes a first gate pattern and first impurity regions. A second transistor the second active region includes a second gate pattern and second impurity regions. A first conductive pattern is on the first transistor, wherein at least a part of the first conductive pattern is disposed at a same distance from an upper surface of the semiconductor substrate as at least a part of the second gate pattern. The first conductive pattern may be formed on the first transistor while the second transistor is formed.

1. Field of the Invention
Example embodiments relate to a semiconductor device, to an electronic product employing the same, and to methods of fabricating the same. More particularly, example embodiments relate to a semiconductor device having a reduced thickness, an electronic product employing the same, and methods of fabricating the same.
2. Description of the Related Art
Lately, to meet a demand for smaller semiconductor chips that are used for electronic products and require lower power consumption, research into reducing the size of an element constituting the semiconductor chips is being progressively carried out.

Semiconductor device having reduced thickness, electronic product employing the same, and methods of fabricating the same


A system includes a transmitter is configured to transmit an electromagnetic signal to a receiver, which is configured to receive the electromagnetic signal and another electromagnetic signal for mixing therewith. Propagation paths of the signals to the transmitter and receiver include a first propagation path of the electromagnetic signal to the transmitter, and a second propagation path of the other electromagnetic signal to the receiver. The arrangement, which is located along either or each of the propagation paths of signals to the transmitter and receiver, is configured to alter the length of a respective propagation path. And the processor configured to recover an amplitude and phase of the transmitted electromagnetic signal, including being configured to receive a sequence of samples of the received electromagnetic signal, and Discrete Fourier Transformation process the sequence of samples.

Spectrometry using continuous wave (CW) tunable sources with narrow spectral linewidth and long coherence lengths has well-known advantages associated with high spectral contrast, frequency selectivity and excellent sensitivity. Scanning CW terahertz (THz) spectrometers are a prime example of this technology. In such systems, phase stability in the transmitter-to-receiver demodulation processing may be required to obtain an accurate measurement of the transmitted electric-field intensity and to characterize any resulting absorption losses from samples in the spectrometer. However, spurious thermal and mechanical disturbances may undesirably generate variations in path length that modulate the received field intensity. It would therefore be desirable to design a system and method of controlling and modulating the path length to improve demodulation signal to noise ratio and stability.
Also, conventional signal processing techniques typically utilize lock-in amplifier (LIA) technology to demodulate a synchronous signal that may be generated by a phase-sensitive spectrometer. These LIAs, however, may be costly, complex and not otherwise readily miniaturized. It would therefore also be desirable to design a system and method of demodulating such a synchronous signal in a manner that may overcome the drawbacks of conventional LIAs.

System and method for signal extraction by path modulation


A method for correcting artifact effects is a multi-primary color matrix display is provided where the display is populated by an array of red-green-blue (RGB) pixels and of non-RGB pixels. The method includes receiving all-RGB data in an all-RGB format; converting the all-RGB data into multi-primary data in accordance with a predefined multi-primary color scheme, testing for and applying one or more artifact correction modifications to each of primary colors that is not represented by all pixels, wherein the modification includes shifting of intensity production of a given non-primary color to a metameric equivalent of pixels in one or more adjacent RGB pixels.

1. Technical Field
The present disclosure of invention relates to multicolored image producing displays such as liquid crystal displays (LCDs) and more particularly to displays employing multi primary color matrices as their repeat unit.
2. Discussion of Related Technology
LCD displays (or other alike displays) that rely on backlighting and that utilize multi primary color matrices (more than just three primary and different colored sub-pixels in each of repeated matrix units) can provide the advantage of potential increase in displayable color gamut as well as the advantage of potential increase in power consumption efficiency (for example in backlighted LCD panels in terms of power consumption by the backlighting unit versus the displayed luminance).
In an exemplary multi-primary color matrix layout, a square-shaped and repeated matrix unit (MxU) that is capable of providing a full color gamut, is arranged to consist of 12 rectangular sub-pixels while using just 5 different colors—namely, 3 sub-pixels that are Red, 2 that are Green, 4 that are Blue, 2 that are Yellow and 1 that is Cyan. Such a full color and repeated matrix unit (MxU) can be seen as being divided into four square-shaped pixels, two of them being RGB pixels, 1 being a RYB pixel and 1 being a CYB pixel. One such matrix layout is shown in FIG. 1A. FIG. 1B shows an alternative variation. FIG. 1C is similar except that there are 2 RYB square pixels and only 1 RGB square pixel (the fourth pixel is a RGC pixel).
It is to be understood that for this disclosure, the image defining data signals that are originally received by the corresponding display panel is at a higher and optically less efficient pixel resolution, namely, the received image defining data signals represent an image definition having approximately twice the RGB resolution in both the horizontal and vertical directions as compared to the resolution producible for an all-one-color object by the illustrated repeat color units (MxU's) of FIGS. 1A-1C. More specifically, if the received image defining data signals are seen as defining four RGB squares in a corresponding square configuration, then in FIGS. 1A-1B, two of those original four RGB squares may be thought of as having been removed and replaced by something else while in FIG. 1C, three of those original four RGB squares may be thought of as having been removed and replaced by something else.
In other words and yet more specifically, the multi-primary color matrix layout (MxU layout) of FIG. 1A is different from a standard sub-pixel layout having all same RGB pixels. This change in layout, while beneficial for scope of producible color gamut and for efficiency of output luminance versus backlighting power consumption, may adversely affect two visual aspects. First, when trying to display different ones of uniform color fields (e.g. an all Red field next to an all Green field), the displayed textures are different from that which would be seen on a standard RGB panel because some colors (e.g., Red and Cyan in one example given below) are displayed in a more spotty (less spatially frequent and spatially uniform) way than are others (e.g., Green and Yellow in one example given below) and thus the multi-primary color matrix layouts (MxU layout) of, for example, FIGS. 1A and 1B create a false texture artifact when pure color fields are displayed. Second, since the original data arrives at the all RGB pixels resolution and since in the remapping to the gamut space of the modified multi-primary color matrix layouts (MxU layout) of, for example, FIGS. 1A and 1B, the gamut remapping eliminates some of the RGB pixels. Thus; not all colors are present in all pixels of the modified MxU layout, and thus loss of details and/or other artifacts may occur when attempting to present certain colored image features such as for example a single-pixel wide line (e.g. such as may occur when displaying single pixel wide lines and/or very fine thickness text).
It is to be understood that this background of the technology section is intended to provide useful background for understanding the here disclosed technology and as such, the technology background section may include ideas, concepts or recognitions that were not part of what was known or appreciated by those skilled in the pertinent art prior to corresponding invention dates of subject matter disclosed herein.

Correcting anamolous texture and feature width effects in a display that uses a multi primary color unit scheme


A robotic strong arm (RSA) for assisting in the transfer of a person from a first surface to a second surface, comprising: first and second members, wherein in each member comprises a prismatic joint having first and second ends and comprising inner and outer shells and a motor for powered linear movement of the outer shell with respect to the inner shell; a first powered joint interconnecting the second end of the first member with the first end of the second member, wherein the first powered joint provides movement of the second member with respect to the first member; wherein the first end of the first member is attached to a rotatable base and wherein the rotatable base is movably attached for powered movement along a component associated with, and extending around at least a portion of a periphery about, the first surface; and a computer controller for controlling movements of the outer shells, first powered joint, rotation of the rotatable base and movement of the rotatable base and RSA along the component.

The present disclosure relates to a novel Robotic Strong Arm (RSA) and device to aid in the transfer of people with disabilities to and from their wheelchairs or electric powered wheelchair onto other surfaces.
There are approximately 1.5 million people in the United States who have disabilities that require them to use a wheelchair. One study found that 60% of people reported shoulder pain since beginning their wheelchair use. In comparison, only about 4.7% of the general population report regular shoulder pain. Sitting pivot transfers (SPTs) are ranked among the most strenuous daily tasks of wheelchair users. Repetitions of this task over time can be detrimental for the shoulder and elbow joints of wheelchair users.
Biomechanics
There are variations in wheelchair users' movements when transferring themselves depending on their level of injury. When a patient transfers him/herself from a wheelchair to another surface, most of their weight is initially supported by their trailing upper extremity (U/E). As they lose contact with the seat, weight is shifted to the leading U/E. During wheelchair transfers, large forces are placed on the shoulder and elbow joints. The leading shoulder encounters higher displacement and velocities than the trailing one. This can cause damage in the leading arm to be accelerated and the onset of pain in this arm to occur sooner.
When wheelchair users are transferred by other people, the biomechanics of the transfer take on a different form. Strain is still placed on the wheelchair-users shoulder joints, although it is more evenly distributed across the sagittal plane. There is also an additional factor of strain placed on the lower back of the person assisting with the transfer. One study found that a pivot transfer puts 112 lbs of force onto the clinician assisting with the transfer and raises their risk of developing a lower back disorder to 38.8%.
Injuries
Between 1973 and 1987, 770 wheelchair-related accidents that led to death were reported to the U.S. Consumer Products Safety Commission. 8.1% of these accidents were caused by falls during transfers. Between 1986 and 1990, there were an estimated 36,000 wheelchair-related accidents in the U.S. that resulted in a visit to the emergency department. 17% of these accidents were due to falls during transfers. In 2003, more than 100,000 wheelchair related injuries were treated in U.S. emergency departments, showing an upward trend in the number of injuries over time.
When wheelchair users are transferred by other people, there is an additional risk of injury to the caretaker. In one study, of the 48 accidents reported by the 174 participants, 15.5% involved attendants. There were more than 1,325,000 home care workers or clinicians in the United States in 2004. This group is expected to grow by 56% from 2004 to 2014. Lower back injuries are a major risk for this group, and one estimate found that 10.5% of back injuries in the United States are associated with transferring patients. In one study investigating bed to chair transfers, it was found that healthcare workers experience up to 3500N of compressive forces during a single transfer. In another study where lifts were implemented in a hospital to assist with patient transfers, it was found that over a 3 year period, there was a 70% decrease in claims cost at the intervention facility. The cost of compensation for injuries at this facility also decreased, with a 241% increase in the comparison facility.
Lifts
One technique that is used in many healthcare facilities is to move patients around using ceiling-lifts. In one study where lifts were added to an extended care unit, 71.4% of care staff reported that it became their preferred method of transferring patients and 96% believed that the ceiling lifts made lifting residents easier. While these lifts effectively transfer people without placing as much strain on the caretaker, they are often not used because they are time-consuming. In many cases, legislation concerning the implementation of lifts is focused on the caretakers' comfort and safety as opposed to the patients'. In rare cases, these lifts can even subject the patient to bruising or skin tearing. Another major concern when transferring patients using a lift system is that the patient may feel that being moved around in such a manner is undignified.
High-Tech Devices
Few high tech devices are report in the literature. One such device is the Home Lift, Position, and Rehabilitation chair (HLPR) is currently being developed and will be able to lift a patient, rotate, and place him/her on a toilet, chair, or bed. However, this chair is meant for home use only and an incline of 10 degrees can cause tipping.
The transfer device market is populated by well-established players with products that have been available for a long time. Patient lifts are the most common type of lift that are characterized by having 4 caster wheels, 2 long legs, and a lift arm that is operated using a manual or powered hydraulic jack. The person is placed in a sling, hoisted vertically with the lift arm. Two well-known manufactures of this type of device are Hoyer and Invacare. Another type, more typical of institutional settings (and some highly modified homes), is the overhead lift. This type of lift system utilizes a track or gantry rail system mounted to the ceiling over a strategic area, such as a bed or bathroom, which a winch unit travels on. The person is placed in a sling, they are hoisted by the winch, and the care giver moves them about on the track or gantry.
Numerous other types of devices, ranging from low tech to high tech, exist for aiding with transfers. On the low tech side, transfer boards which are a short piece of smooth laminated wood that can be placed between person's chair and the surface they are transferring to or from. The caregiver then slides (often more like dragging) the person across board and onto the destination surface. Some devices are highly specialized. The Hover Jack (Hover Tech International) is an inflatable cushion that is specifically designed to aid a caregiver in lifting people off the floor and into a bed. There are many styles of chairs that specifically designed to help lower people in an out of bath tubs. On the high tech side is Panasonic's transfer assist robot (http://www.youtube.com/watch?v=LBMJCI-FzrM), which acts much like a forklift for moving people.

University of Pittsburgh—Of The Commonwealth System of Higher Education

The United States of America as Represented by the Department of Veterans Affairs


Systems and methods for categorizing communication data are described herein. The systems and methods enable an IMS core network to register a user equipment as a 5G-capable device and store communication data in a manner that differentiates the communication data from non-5G devices. Once identified as a 5G-capable device and information that 5G coverage is available is received, the registration message from the user equipment to the IMS core is modified to configure the IMS core to store the communication data as 5G communication data rather than non-5G communication data.

Advancements in cellular technology provide for the introduction of new types of cellular networks. These types of networks include 4th Generation (4G), 4G Long-Term-Evolution (LTE), and a new 5th Generation (5G) network, as well as others. Newer generations of networks aim to provide increased performance or capabilities over prior networks. For example, the new 5G network aims to provide increased data services, allowing users to download or stream movies and other media content at faster rates than current 4G or 4G LTE networks.
However, due to the costs associated with the equipment necessary to operate new network designs, as well as the cost of the user equipment purchased by users of the networks, there will often be more than one type of network servicing an area. For example, it is not uncommon to find mobile network operators operating 3rd Generation (3G), 4G, and LTE networks in the same area. With the advent of 5G, the trend of maintaining the operation of legacy networks is expected to continue, with the LTE networks supporting voice communications and the 5G networks supporting most of the data communications.

Systems and methods for network categorization


A wiring substrate to be used in a variety of electronic apparatuses, and an input device, such as an optically transparent touch panel, using the same wiring substrate, and a method of manufacturing the same input device are disclosed. The invention simplifies a construction of the wiring substrate, reduces the number of manufacturing steps of the substrate, and makes all the connectors of the substrate in a single-sheet structure. The electrical and mechanical connections of those connectors to other connecting means can be thus highly reliable. Plural wiring patterns 22, 23, 24 and 25, and connectors 22A, 23A, 24A and 25A are formed on a first principal surface of wiring substrate 20. Substrate 20 includes flexible bending section P—P, and when substrate 20 is bend along bending section P—P, some connectors such as 24A, 25A are placed on a second principal surface opposite to the first one, so that wiring substrate 20 is formed.

In recent years, electronic apparatuses have been sophisticated and diversified. This market trend is accompanied by an increment of electronic apparatuses equipped with an input device such as an optically transparent touch panel on the front face of a display element such as a liquid crystal display (LCD). A user recognizes and selects, via this input device, texts, marks, or symbols shown on the display element, thereby switching the functions of the electronic apparatus.
In the description hereinafter, position-relating terms such as "top surface", "underside", "right side", and "left side" are used. Those terms express a relative relation about positions of elements or sections when the drawings are viewed from the front, and they do not indicate an absolute relation about the positions.
In the description hereinafter, phrases such as "a first principal surface", and "a second principal surface" are used. The "first principal face" does not always mean a front face of elements such as a wiring substrate, and the "second principal surface" does not always mean a back face thereof In other words, an opposite side of the first principal surface is the second principal surface.
A conventional input device is described hereinafter with reference to FIG. 7–FIG. 9.
FIG. 7 shows a perspective view of a conventional optically transparent touch panel(hereinafter referred to as touch panel), and FIG. 8 shows a perspective view of an essential part of a wiring substrate employed in the touch panel shown in FIG. 1. The upper panel 1 is made from polyethylene terephthalate or polycarbonate film. Optically transparent upper panel 1 has optically transparent upper conductive layer 2 on its whole surface or a selective surface area. Conductive layer 2 is made from indium oxide or tin oxide, and formed on the surface by spattering.
A pair of upper electrodes 3, 4 formed by printing paste such as silver or carbon on upper panel 1 at which the base of upper conductive layer 2 is exposed in a given pattern by etching or laser-cutting. A pair of leaders 3A, 4A are prepared at the ends of upper electrodes 3, 4 respectively.
Lower panel 5 made from glass, acrylic, or poly-carbonate resin includes lower conductive layer 6 of optically transparent and similar to upper conductive layer 2 on its entire area of a principle surface or a selective area thereof. A pair of lower electrodes 7, 8 are formed on lower panel 5 from which lower electrode layer 6 has been removed.
Lower electrodes 7, 8 have a pair of lower leaders 7A, 8A at their ends respectively. Lower conductive layer 6 has plural dot-spacers (not shown) at its given places for maintaining a given space between upper conductive layer 2 and lower conductive layer 6. The dot spacers are formed at given intervals and made from insulating resin such as epoxy or silicon.
Upper and lower panels 1 and 2 are bonded at their circumferences with frame-like spacer 9 having adhesive applied to its upper and lower faces so that upper and lower conductive layers 2, 6 can oppose to each other with a given space maintained. Between the leaders of upper and lower panels 1 and 5, flexible wiring substrate 10, having plural wiring patterns and connectors formed on both the surfaces of substrate 10, is inserted to be held.
As shown in FIG. 8, wiring substrate 10 has a narrower section and a wider section. On a first principal surface of the narrower section, plural wiring patterns 12, 13, 14 and 15 are formed, and on the wider section of substrate 10, connectors 12A, 13A, 14B and 15B are formed independently. Wiring patterns 12 and 13 are coupled to connectors 12A and 13A respectively at their ends.
Wiring patterns 14 and 15 are coupled to wiring patterns formed on a second principal surface of wiring substrate 10 via through-holes 14A, 15A filled with conductive agent. Connectors 14B, 15B are formed on a wider section of the second principal surface independently.
FIG. 9 shows a sectional view of wiring substrate 10. Anisotropic conductive agent 11 is applied on the leaders of upper and lower panels 1, 5 as well as respective connectors of substrate 10, and upper leaders 3A, 4A are coupled to connectors 12A, 13A of the first principal surface of substrate 10 respectively. Lower leaders 7A, 8A of lower panel 5 are respectively coupled to connectors 14B, 15B disposed on the second principal surface of substrate 10. The conventional optically transparent touch panel is thus formed.
In the foregoing construction, an optically transparent touch panel is mounted on the front face of the display element such as an LCD, and each one of the wiring patterns of wiring substrate 10 is coupled to a detecting circuit (not shown) of an electronic apparatus by connectors. The upper face of upper panel 1, namely, the operation panel, is depressed by a finger or a pen, thereby bowing upper panel 1, and the depressed section of upper conductive layer 2 is brought into contact with lower conductive layer 6. The detecting circuit (not shown) applies voltage across upper electrodes 3, 4 as well as lower electrodes 7, 8, for detecting a resistance ratio of those electrodes, so that the position depressed is detected, and a function of the electronic apparatus can be switched to another function.
However, the conventional wiring substrate and the input device employing the same substrate have required double-sided wiring patterns and through-holes, so that the construction of the wiring substrate becomes complicated, which is accompanied by an increment of the number of manufacturing steps. As a result, the input device is obliged to be expensive.
Prior art of the present invention is disclosed in Japanese Patent Unexamined Publication No. 2003-108302. U.S. Pat. No. 6,304,251 also discloses a flat cable similar to the present invention shown in FIGS. 6 and 7.

Matsushita Electric Industrial Co., Ltd.


A manufacturing method for a thin board-shaped fired piezoelectric body has: a step of manufacturing, using a piezoelectric material, a green sheet having a ratio T/L of 0.000002 to 0.2, where T is the thickness and L is the maximum length within the surface after firing; and a step of obtaining the thin board-shaped fired piezoelectric body with reinforcing members for firing by performing firing after disposing the reinforcing members for firing by scattering at least on one surface of the green sheet so as to exclude the areas to be the thin board-shaped fired piezoelectric body later. The piezoelectric body which has excellent planarity and a thin board shape can be manufactured at low cost by the method.

1. Field of the Invention
The present invention relates to a manufacturing method for a thin board-shaped piezoelectric body having both the surfaces formed of fired surfaces and having excellent planarity.
2. Description of Related Art
Recently, there has been desired a displacement control device capable of adjusting the optical path length and the position in sub-micrometer in the fields of optics, precision machinery, semi-conductor manufacturing, etc. In response to this, development of piezoelectric devices is proceeding. The piezoelectric devices are a piezoelectric actuator utilizing strain (deformation) based on the reverse piezoelectric effect and the like caused upon applying an electric field to a ferroelectric body or an antiferroelectric body, a piezoelectric sensor utilizing charge generation caused upon applying stress to the ferroelectric body/antiferroelectric body on the basis of a similar effect, and the like. The core of these piezoelectric devices is a fired piezoelectric body and a piezoelectric element obtained by holding the piezoelectric body between electrodes.
The fired piezoelectric body (fired piezoelectric body) can be manufactured by firing at high temperature. The fired piezoelectric body can obtain large displacement with a high piezoelectric constant by appropriately selecting the kinds of additives. Since the piezoelectric element constituted of such a fired piezoelectric body can obtain large displacement even when it is small, it is suitably employed as a drive portion of the aforementioned displacement control device.
There are the following Patent Documents 1 and 2 as the prior art documents regarding a manufacturing method for a piezoelectric body.

Manufacturing method for thin board-shaped fired piezoelectric body


A method of producing an electrode including decreasing a yield stress of a slurry containing an active material to two-thirds or less, and applying the slurry to a current collector.

1. Field of the Invention
The present invention relates to a method of producing an electrode and also to a method of producing a nonaqueous electrolyte battery.
2. Description of the Related Art
A remarkable attention is currently focused on nonaqueous electrolyte batteries having a high energy density as power sources for hybrid electric vehicles and as accumulators for generators using natural energy such as solar light and wind power. In these applications, changes in the amount of power generation and load as a function of time are abrupt and therefore, secondary batteries having high ability in fast charge and discharge of large current, that is, a large-current performance are required.
In order to cope with such a requirement, technical developments for improving the large-current performance of a nonaqueous electrolyte battery are being made. As one example of these techniques, a method using a positive or negative electrode active material having a smaller particle diameter, that is, a larger specific surface area is given. When the specific surface area of the active material is increased, the contact area between the active material and a nonaqueous electrolyte is increased. As a result, lithium ions can be transferred from the active material to the electrolyte with lower resistance, and therefore, battery voltage is not reduced when large current flows, thereby attaining a large-current performance.
Although the inventors of the present invention also have tried to improve the large-current performance of a battery by repeated contrivance to reduce the size of a particle of the active material, this, on the other hand, gives rise to new problems as the size of a particle decreases. In a process for producing an electrode of a nonaqueous electrolyte battery, first, an active material is suspended, together with a conductive agent and a binder, in a nonaqueous solvent to prepare a slurry. When this slurry was applied to a current collector used as a support through a die coater, the thickness of the coating was not fixed but became non-uniform. In an electrode in which the coating amount is non-uniform like this, current is concentrated on a part decreased in coating amount when flowing large current, with the result that only the part on which current is concentrated deteriorates quickly. As a result, this promotes deterioration of the capacity of the nonaqueous electrolyte battery and at the same time, increases electric resistance, causing a reduction in large-current performance.
JP-A 2004-321969 (KOKAI) relates to a coating apparatus in which a coating solution is continuously supplied from the central part of an extrusion type die coater. This invention intends to try to eliminate uneven thickness of a coating film and surface lines. JP-A 2004-321969 (KOKAI) is provided with at least one stirrer in a place where a coating solution is supplied to the die coater. And the aformentioned at least one stirrer is arranged between the part connecting a coating solution tank with a supply pipe and the distribution section of the die coater. Specifically, in the example, a stirrer is disposed at a position adjacent to the inside or outside of the supply port of the die coater. In this case, as the stirrer, a static mixer or a mesh filter is used.
Meanwhile, in the coating apparatus described in JP-A 2002-301417 (KOKAI), coating solutions stored in two supply tanks, that is, an A supply tank 18 and a B supply tank 19 respectively are mixed with each other and the obtained mixture solution is applied to a support 1 by using an extrusion die coater 4. The A supply tank 18 and the B supply tank 19 each have a feeder pump 10. A static mixer 20 is disposed between the extrusion die coater 4 and the feeder pump 10 to thereby mix the coating solution contained in the A supply tank 18 with the coating solution contained in the B supply tank 19 in the static mixer 20.

Method of producing electrode and method of producing nonaqueous electrolyte battery


A system and a method for determining a position of a single phase fault to ground in a feeder line are provided. The feeder line is electrically connected to an electrical substation via a substation bus. The system includes first and second sensors electrically coupled to a transformer in the electrical substation. The system further includes a processor that determines a reactance value based on measured electrical characteristics and a predetermined constant. The processor accesses a table having a plurality of position identifiers associated with positions on the feeder line, and a plurality of reactance component values corresponding to positions on the feeder line relative to the substation bus. The processor selects a first reactance component value from the plurality of reactance component values in the table to determine the position of a fault.

Power distribution systems have electrical substations that provide electricity to feeder lines. The feeder lines route the electricity to various parts of a metropolitan area. However, when a single phase fault to ground undesirably occurs in a feeder line, the routing of electricity through the feeder line may be interrupted. However, power line repairmen may have difficulty in finding a position of the single phase fault in the feeder line. Accordingly, the inventor herein has recognized that it would be beneficial to provide a system for automatically determining a position of the single phase fault in a feeder line.

System and method for determining a position of a single phase fault to ground in a feeder line

Consolidated Edison Company of New York, Inc.


A control apparatus is configured for adjusting a control value for a refrigerating machine of a cooling system and performing control of the cooling system in conformity with an environmental condition. A controller has a data base having environmental condition cells in which control values for the refrigerating machine are respectively registered in association with respective environmental conditions. The control apparatus outputs a control value suitable for the present cooling state to the refrigerating machine, registers the control value in an environmental condition cell conformed with the present environmental condition and changes the control value to construct the data base when the environmental condition varies, the controller refers to an environmental condition cell conformed with the environmental condition, corrects a control value registered at the environmental condition cell in accordance with a tendency that the control value has been changed, and outputs the corrected control value to the refrigerating machine.

Plural low-temperature showcases such as freezing/refrigerating showcases or the like are installed in a store such as a supermarket or the like, and provided to display and sell foods while freezing or refrigerating the foods. In this case, an evaporator of each low-temperature showcase is circulatingly supplied with refrigerant from a refrigerating machine installed at the outside of the store (in a machine room or the like). In this case, there is a case where different marker's products are used as the low-temperature showcase and the refrigerating machine respectively to construct a refrigeration circuit of a cooling system in some stores.
From the viewpoint of approach to environment problems and reduction in energy cost, much attention has been recently paid to countermeasures to reduce power consumption in a cooling system even in stores such as supermarkets, etc. In order to reduce the power consumption, it is important to enhance the operation efficiency of the low-temperature showcases and the refrigerating machine themselves, but it is possible to reduce the power consumption on the assumption that respective devices constituting the cooling system are cooperated with one another on the whole in the overall cooling system containing the low-temperature showcases and the refrigerating machine.
Therefore, there has been recently developed a control apparatus provided with a database having plural registration places each of which is associated with each of different environmental conditions, each environmental condition comprising a store inside (in-store) temperature, a store outside (out-of-store) temperature and a time zone. Control data concerning a low-pressure side pressure set value for stopping a refrigerating machine has been learned and stored at each registration place every environmental condition to thereby construct the database. The control data are used directly or used with correction thereto by referring to control data at a registration place conformed with a present environmental condition and determination result data as to whether the cooling state of the low-temperature showcase at that time is good or not (for example, see Patent Document 1).
According to the control apparatus described above, it is possible to predict the shift of the operation environment and perform fine control while quickly following the predicted shift.

PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.


A controlling apparatus and a controlling method of an optical switching device are capable of automatically correcting angle deviations of tilt-mirrors to thereby reduce an optical loss. To this end, such as in a three-dimension type optical switching device including a first mirror array and a second mirror array each arranged in a plane thereof with a plurality of tilt-mirrors, angles of reflection surfaces of which are controllable, the controlling apparatus branches a part of an optical signal reflected by the output side second tilt-mirror array, receives the branched light by an image sensor to thereby generate position information of the branched light, compares, by a control circuit, the position information with initial position information previously set corresponding to target values of the angles of the reflecting surfaces of the respective tilt-mirrors, to thereby detect an error in the arriving position of the optical signal, and correction controls the angles of the reflecting surfaces of the tilt-mirrors, based on the detected error.

(1) Field of the Invention
The present invention relates to a switching control technique in an optical switching device, and more particularly to a controlling apparatus and a controlling method of an optical switching device utilizing reflection type tilt-mirrors based on a micromachining (MEMS: Micro Electric Mechanical system) technique.
(2) Description of the Related Art
Recently, an increase in traffic in the Internet and the like has resulted in an increased demand for optical networks. Under these circumstances, attention has been directed to the introduction of an optical switching device for directly switching large-capacity and high-speed data in the form of optical signals. Conventional techniques for realizing such an optical switching device having the nature of large capacity and high speed have mainly included methods for mechanically switching optical fibers, for combining waveguides with one another or the like. However, in such conventional techniques, a multistage constitution is required to be adopted, thereby resulting in an extremely large optical loss within the optical switching device and resulting in limitations in coping with the increase of the number of channels, so that it has been difficult to realize an optical switching device capable of coping with several tens or more channels.
Under the above circumstances, attention has been directed to an optical switch utilizing tilt-mirrors (hereinafter called "MEMS mirrors") fabricated by applying a micromachining (MEMS) technique, since such an optical switch is superior to other switches in terms of downsized, wavelength independency and polarization independency, for example. Particularly, for example, as shown in FIG. 45, an optical switching device of three-dimensional type constituted by combining two collimator arrays 1A, 1B each having a plurality of collimators two-dimensionally arranged and two MEMS mirror arrays 2A, 2B each having a plurality of MEMS mirrors two-dimensionally arranged, is expected since reduction of an optical loss, increase of the capacity, and realization of multiple channels are possible.
In the aforementioned three-dimensional type optical switching device utilizing the MEMS mirror arrays 2A, 2B, however, due to angle deviations between MEMS mirrors, it is likely that deviations occur in inputs of optical signals to output fibers connected to output side collimators, thereby causing a factor which increases the optical loss within the optical switching device.
FIG. 46 exemplarily shows the above content, in which FIG. 46A is a plan view showing an example of an optical path from an input point to an output point of an optical signal in the optical switching device, and FIG. 46B is a plan view exemplifying respective states where optical signals are input to output fibers, respectively. Note, in FIG. 46, input side and output side collimators are omitted, so as to comprehensively show the states of optical paths in the optical switching device.
In FIG. 46, a light reflected by an output side MEMS mirror is required to be input perpendicularly to a core portion of an output fiber, as indicated by "OK" in FIG. 46B, and such a light should not be deviated from the core as indicated by "NG1" and "NG3" nor obliquely input to the core as indicated by "NG2" in FIG. 46B.
Such defective coupling of an optical signal to an output fiber is caused by a slight angle deviation, even if an input port and an output port of the optical signal have been determined, and angles to be controlled for respective input side and output side MEMS mirrors are known numeric values. Specifically, an angle deviation of the order of 0.050° in MEMS mirror causes an optical loss of a few dB. Concerning angle deviations of MEMS mirrors, it is difficult to judge which one of paired MEMS mirrors is deviated and how much the deviation is, because it is impossible to individually monitor the optical signal power corresponding to the angle of each mirror.
To correct the aforementioned angle deviations of MEMS mirrors, it is conceivable a method to detect light position information of an optical signal propagated from an output side MEMS mirror to an associated collimator, such as by a CCD image sensor. However, it is not easy for this method to detect differences between the "OK" and "NG2", and between the "NG1" and "NG3" in FIG. 46B. Namely, such a method has a defect in that it is difficult to detect incident angle information of light. Particularly, in the state of "NG2", it is difficult to judge whether or not the light is being correctly output.
As another method to correct angle deviations of MEMS mirrors, it is further conceivable a method to monitor, for example, the power of optical signal coupled to an output fiber, so as to feedback control the angle of each MEMS mirror based on the monitored result. In this method, however, it is impossible to adopt such a system to feedback control the angles of MEMS mirrors so that the monitored optical powers are brought to previously set initial values, because a target value of optical power of each channel can not be determined to be constant due to variations and the like in optical powers of multiple channels to be input to the optical switching device. Further, since it is also difficult to confirm whether or not the optical power presently being monitored is a maximum value, it is therefore difficult to realize the aforementioned feedback control.

Controlling apparatus and controlling method of optical switching device


A ladies purse comprises an ornamental clasp in which the ornament can be easily changed to allow the purse to be used with different apparel or for different social occasions. The clasp consists of a first magnetic clasp component fixed to the front panel of the purse. A second magnetic clasp component is fixed to the closure flap of the purse. The clasp components engage magnetically to secure the closure flap to the front panel. The second magnetic clasp component comprises an ornament mount for mounting a replaceable ornament on the closure flap of the purse.

The present invention relates to ladies purses and handbags and, more particularly, to purses having replaceable ornaments.
Ladies purses and handbags serve several important functions including convenient carrying and concealment of makeup, toiletries, keys, valuables and other items. Purses and handbags also serve as fashion accessories which may result in the need to buy, store and maintain a number of purses to complement different wardrobes and for different social occasions. The cost, storage and maintenance requirements to maintain the desired range of purse and handbag fashions may become prohibitive from a cost and storage standpoint.
U.S. Pat. No. 2,656,870 discloses a lady's handbag in which the decorative effects can be changed by a replaceable front panel of the purse. The panel is retained by a thumb nut. Although the appearance of the purse may be changed, the front panel must be made stiff, requiring the purse to be rigid.
U.S. Pat. No. 2,090,937 discloses a handbag with a hinged member which is used to retain gloves on the handbag. The member comprises initials which can be removeably mounted. A conventional clasp is utilized.
U.S. Pat. No. 2,006,463 discloses a locking device for a ladies handbag comprising removable colored plates. A knob must be rotated in register with a block in order to release the clasp.
Theses and other devices for handbags have not solved the need for a handbag which provides a method of quickly and easily changing the appearance and use of a handbag, and also provides a quick and convenient clasp.


Disclosed are systems and methods for generating ratings for content items based on a user's consumption history. The content items may comprise various forms of media content, including, video, audio, Internet webpages, etc. When a user or consumption device accesses content items, a computing device may monitor the amount of the content items consumed by a user over one or more consumption sessions. In one embodiment, threshold values may be identified for one or more rating levels of a rating scale associated with the content items, and a rating for a content item may be generated based on the amount of the content item consumed by the user or the amount paid for the content item by the user. The computing device may calibrate or update generated ratings by measuring accuracy of the ratings and adjusting one or more threshold values associated with the content items.

Content users have a large variety of content options at their disposal. A user often has hundreds of channels or services available to watch at any given time, and many additional items of content that the user can choose to watch. Sifting through this content can be difficult. Some systems collect feedback from users in an effort to identify desirable content so that recommendations can be made. Such feedback collection systems, however, are rendered less effective when users do not offer their feedback. Accordingly, there remains a need to improve content recommendation systems.


The present invention provides systems and methods for reducing the ‘cold start’ TTFF of navigation receivers. The systems and methods receive geographical information from a user, such as the nearest city, state or country, and use this geographical information to approximate the position of the receiver. The systems and methods then make use of the approximate position to reduce the ‘cold start’ TTFF. In an embodiment, the approximate position of the receiver is determined from a co-ordinate database in the receiver based on the geographical information provided by the user. In another embodiment, a user provides geographical information to the receiver through a displayed map with several stages of zooming capability.

With the development of radio and space technologies, several satellites based navigation systems have already been built and more will be in use in the near future. One example of such satellites based navigation systems is Global Positioning System (GPS), which is built and operated by the United States Department of Defense. The system uses twenty-four or more satellites orbiting the earth at an altitude of about 11,000 miles with a period of about twelve hours. These satellites are placed in six different orbits such that at any time a minimum of six satellites are visible at any location on the surface of the earth except in the polar region. Each satellite transmits a time and position signal referenced to an atomic clock. A typical GPS receiver locks onto this signal and extracts the data contained in it. Using signals from a sufficient number of satellites, a GPS receiver can calculate its position, velocity, altitude, and time. The Russian built GLONASS and the European Union proposed Galileo are the two other important satellite based navigation systems.
A GPS receiver has to acquire and track at least four satellite signals before starting to compute the position which is also known as position fix. The time required to fix the position depends upon how fast the satellite signals can be acquired and tracked. This signal acquisition involves a search of the carrier frequency including the Doppler due to the motion between the satellite and the navigation receiver. In addition to this frequency search the receiver should also search for the actual code phase of the received signal. Thus the search is a two dimensional search and takes most of the Time-To-First-Fix (TTFF). It is always desirable to lower this TTFF so that a fast position estimation is possible. This resulted in the operation of the receiver in different modes such as 'hot start', 'warm start' and 'cold start'. In the 'hot start' mode the receiver has current ephemeris and the position and time, and therefore the list of the visible satellites and the Doppler associated with each satellite may be determined. Thus only the visible satellites are searched. Since the carrier frequency including the Doppler is known, the frequency search range or the number of frequency bins that need to be searched is also decreased. Thus the 'hot start' results in a shorter TTFF of usually around 7-10 seconds. In 'warm start' the receiver has non-current ephemeris but the initial position and time are known as accurately as in the case of 'hot start'. Thus the Doppler cannot be determined accurately as in the case of 'hot start' due to the higher number of frequency bins that need to be searched. Thus the 'warm start' TTFF has a typical value of 30-35 seconds. In the third mode, known as 'cold start', the receiver has no knowledge of position, time or ephemeris but may have almanac in the memory. Thus a search for all the satellites in the constellation is required. In addition to this the Doppler frequency is also not known. As a result the frequency search range in this case is far wider with a large number of frequency bins. Thus the receiver in the 'cold start' mode has the highest TTFF, which can be as large as 80-100 seconds.
It is not always possible to store the above information in the receiver at all times or the receiver might have moved over a long distance before the receiver is powered on. Under such conditions it is necessary to resort to 'cold start'.
Therefore, there is a need to reduce the 'cold start' TTFF of navigation receivers.

Method of enhanced cold start and associated user interface for navigational receivers


Systems and methods for monitoring biofilm growth are provided. A method comprises supporting at least one coupon in a water reservoir, wherein the water reservoir feeds water into a tower interior, removing the at least one coupon from the water reservoir, and measuring a level of biofilm growth on the at least one coupon. The level of biofilm growth on the at least one coupon is predictive of a level of biofilm growth within the tower interior. Providing an indicator of predictive biofilm growth may allow measures to be taken to prevent biofilm growth in other sectors or areas of the tower.

Cooling towers are a widespread and effective heat transfer medium in industrial and utility type applications, thanks to the availability and high heat capacity of water. Cooling towers may be used to dissipate waste heat from air conditioning, industrial and power generation processes, among other uses. Proper maintenance of water quality within a cooling tower is important for the equipment to operate reliably, safely, and economically.
As water evaporates from the cooling tower and dissolved solids in the water begin to concentrate, there is a potential for microorganism growth. When microbial organisms reach a critical population, a slime layer or biofilm is formed. This slime layer contains both organic and inorganic matter. Some microorganisms excrete polymers and other protective substances which can encapsulate the microorganisms, protecting them from external environmental conditions. Biofilm growth generally occurs at interfaces between phases, for example, at an interface of air and water, and at an interface of water and a surface of the cooling tower.
As a result of biofilm formation, mixed populations of microorganisms can attach themselves to surface layers, causing the microorganisms to no longer be flushed away by cooling tower water flow and allowing for the growth of harmful bacteria, fungus, and macrobiota (e.g., protozoa including amoeba that support the growth of Legionella) that cannot otherwise survive in the bulk water. Biofilms protect microorganisms from disinfectants, causing water disinfection to be significantly more difficult when a biofilm is present. Within the protected biofilm layer, microorganisms can cause corrosion of the walls of the cooling towers and heat exchange systems. Moreover, biofilm creates an isolation layer on heat-exchange systems, causing them to no longer function properly and reduce efficiency in the heat exchanger, as well as blockage of filters, weirs, and screens in the system. The fill in a cooling tower can become so laden with biofilm that the entire cooling tower can collapse from the weight of the biofilm. Microorganisms present in the biofilm may accelerate oxygen uptake, causing an oxygen deficiency in the system. Some microorganisms may produce a number of organic acids, which causes a decrease in pH of the water in the cooling tower. Additionally, biofilms are a source of reinoculation (splash zones, dead spots, etc.) and reduced biocide performance. There are also potential health risks associated with biofilms in cooling water systems, such as Legionella, for example.
Reducing biofilm promotes the conservation of water, as more clean water is able to be recycled. Monitoring water quality improves the cycle number of water uses and reduces cooling system maintenance cost. Additionally, reducing biofilm on heat exchangers can also reduce the energy required to produce the same level of cooling.
Currently, it is common for service engineers to detect biofilm by sight or touch, at which point the biofilm is already well established. More scientifically robust methods are desired to detect biofilms before severe contamination occurs.
U.S. Patent Publication No. 2012/0085452 A1, published Apr. 12, 2012, discloses a corrosion coupon holder for fitting within a pipeline. However, monitoring and/or measurement of biofilm growth is different from monitoring and/or measurement of general corrosion not due to biofilm growth. Biofilm growth includes the adherence of live organisms to a coupon followed by extracellular polymeric substance (EPS) production and inorganic materials becoming entrapped in the biofilm EPS. Mature biofilm can be identified by the naked eye and scraped off of the coupon. Earlier stages of biofilm may be difficult to see by the naked eye, but organisms can be recovered from the surface of the coupon. Any corrosion resulting from the biofilm will be visible as deep pits form where galvanic cells were formed by the biofilm. While certain chemicals can create pitting corrosion, these pits will likely be more uniform in nature than the pitting corrosion from biofilm. The pitting corrosion from biofilm is generally not uniform in nature.
General corrosion is a uniform corrosion across the surface of the metal, and is measured differently from coupons. General corrosion is measured as the mil thickness of metal lost per year (mpy). When this measure is applied to any under deposit corrosion from biofilm, the mpy level is extremely low, even though there may be deep pits of corrosion. This is because metal is not being removed generally, but rather in specific locations. Thus, monitoring and measuring for biofilm growth and associated corrosion due to biofilm growth is different than monitoring and measuring for general corrosion that is not due to biofilm growth.

Methods and systems for monitoring biofilm growth


Spreadable fat-containing food products, such as confectionery spreads, with improved structural stability and good organoleptic properties, and methods of their production are disclosed. The products include glyceride compositions which are characterized by having a healthy fatty acid profile, such as a reduced level of saturated fatty acids (SAFA).

Food Industries produces a large number of spreadable products, such as marmalade, spreadable cheese, margarine, chocolate spreads, etc. These products are characterized by a soft texture, which allows them to be spread on a surface of a food product such as on a slice of bread.
Producers of margarines have made already quite some efforts to improve and optimize the nutritional profile of their products. Margarines are emulsions, in particular water-in-oil (W/O) emulsions, that contain a considerable amount of water and that are produced according to specific emulsifying processes, which allow the producers to incorporate very high amounts of liquid oils, combined with a hard fat, a so called hardstock. The final product is stored in the fridge and has a soft texture which makes the product easily spreadable.
Another important category of spreadable products, are spreadable confectionery products, like the so-called chocolate spreads or confectionery spreads. These products often contain nut paste. These products contain sugar or a sugar replacer, other dry ingredients for instance cocoa powder and/or milk powder and/or whey powder, and fat, mostly vegetable fat and mostly an emulsifier, such as lecithin. In the case that the spread also contains nut paste, like hazelnut, almond, etc., the nuts contribute to both of the dry ingredients (i.e. the fat-free dry matter part of the nuts) and the fat phase by the presence of nut oil, which is a liquid oil.
In this product category, a number of food producers have tried to improve the healthy image or nutritional properties of their products, although with varying and limited success.
Some products appeared on the market with a non-palm label. However, the fatty acid profile of such products proves that there is still room for important nutritional improvement. The SAFA level of these products is still too high, and also their level of atherogenic fatty acids is quite considerable.
WO 2010/149323 relates to soft cocoa butter compositions and their use in food, beverage and cosmetic applications. The advantage of using cocoa butter and cocoa butter fractions is said to be their superior taste and creamy mouth-feel, compared to palm oil for instance. Pure cocoa butter is also perceived by the consumer for its healthier and higher quality. A disadvantage of using oil blends of cocoa butter with other oils and fats versus soft cocoa butter fractions, is said to be the tendency to separate in the food product over time, meaning a reduced shelf life and a difficulty to maintain the target hardness.
As to the soft cocoa butter fractions, they are obtained through 1- or 2-step fractionation of a cocoa butter which has first been subjected to an interesterification process.
WO 2010/149323 further described the use of soft cocoa butter fractions as spreads, such as chocolate and praline flavoured spreads. In such spreads, preferably cocoa butter super-olein will be used in combination with sugar, cocoa powder and/or cocoa mass, milk powder and lecithin, and optionally also hazelnut paste, whey powder and flavouring agents. WO 2010/149323 describes the recipes of the spreads. In particular, in example 7 of WO 2010/149323 the production of a chocolate spread, based on cocoa butter super-olein is described. Optimal organoleptic properties are obtained through the use of cocoa butter as ingredient and good functional properties in terms of no oiling-out and a stable texture are obtained, mainly through the use of an interesterification process, creating asymmetrical triglycerides, which show a low tendency to re-crystallise. However, the spreads remain to have a number of issues. First, the spreads do not have optimal nutritional properties. Based on the figures for cocoa butter super-olein in table 1 and 2, it can be concluded that the C16 and C18 contents are 19.73% and 26.34% respectively. This means that the SAFA content is at least 46.07%, which is quite high. Second, the texture of the spreads strongly depends on the temperature. The SFC profile at 20° C. is 4.62%, while at 10° C. it is already 25.99%. This sharp increase means that the product will be spreadable at room temperature, but when stored in the fridge it will be far too hard to be spread on the surface of a food product.
EP 2 443 935 A1 describes an edible product containing 15-80 wt % of triglycerides, 20-85 wt % of filler, and at most 15 wt % water, wherein the triglycerides contain as acid residues 20-70 wt % of total SAFA, at most 5 wt % of TFA, thereby C8, C10 and C12 in a weight ratio of (C8+C10+C12)/total SAFA of at least 10% and a weight ratio of (C8+C10)/C12 of at least 5%, whereby the weight ratio D/B is at least 1.5 and the weight ratio of B/total SAFA is at most 0.5, in which D represents the sum of the amounts of all monounsaturated fatty acid (MUFA) and polyunsaturated fatty acid (PUFA), and B represents the sum of the amounts of C14 and C16, and which triglyceride composition has an SFC at 20° C. of at least 5 wt %. EP 2 443 935 A1 further describes a process for the production of the edible product, and triglyceride compositions which are suitable intermediates for certain of the process variants. The fats that can be used are a combination of a non-lauric hard fat with high C18 content, a lauric fat and optionally a liquid oil. The edible products obtained have a firm structure, which makes them suitable for applications like fillings and creams. Preferred Solid Fat Content (SFC) at 20° C. is at least 10, preferably at least 15, most preferably at least 20 wt %. Preferably the non-lauric hard fat component has a melting point of at least 25° C., or at least 27° C. or most preferably at least 30° C. The preparation of the edible product requires no special processing in case the hard fat component contains a lauric fat: simple cooling may be applied without stabilization, similar to the common processing of lauric fats. This is an advantage of having a hard lauric fat component. However, disadvantage of such fats are their high SAFA content, for instance 90% for coconut oil, and the tendency to develop a soapy flavor upon storage. The SAFA content of the total fat composition is at least 20 wt % and maximum 70 wt %. In the Examples of EP 2 443 935 A1, the SAFA content is in the range of from 31 wt % to 64 wt %, mainly depending on the percentage of lauric fat component present in the fat blend.
WO 2011/161213 describes a non-temper, texture providing fat composition. This fat composition comprises 10-65 wt % of one or more vegetable oils having a slip melting point of no more than 25° C., and 35-90 wt % of one or more vegetable fats having a slip melting point of more than 25° C.; wherein in said one or more vegetable fats at least 90 wt % of the constituent fatty acid chains are longer than C12, the ratio of C16:0/C18:0-C24:0 is no more than 4, and the ratio SSU/SUS is at least 1, and wherein in said composition the content of S3-type of triglycerides is at least 0.5 wt %, wherein the groups S designates identical or different saturated fatty acids and the groups U designates identical or different unsaturated fatty acids. In a preferred embodiment, a SAFA content is of no more than 65 wt %. In the Examples, the SAFA content is in the range of from 39.4 wt % to 52.0 wt %. To obtain the non-temper texture providing properties, the presence of a considerable amount of asymmetrical SSU triglycerides is required as well as a minimum amount of high melting S3 triglycerides.
Optimal nutritional properties means no or negligible amount of trans fatty acids, a very limited amount of saturated fatty acids, whereby, for the kind of saturated fatty acids present in the fat component, those should be preferred with the lowest adverse cholesterogenic effects.
The nutritional properties of food products, and of oils and fats in particular are of increasing importance in view of the increasing awareness of an unbalanced diet and a lack of physical activity. These are the main risk factors for the incidence of cardiovascular diseases (CVD) and the main cause of mortality in more developed countries. There is more and more evidence supporting the correlation between the high levels of trans fatty acid residues and saturated fatty acid residues in the fats in the human diet and high cholesterol levels in the blood. There is also growing evidence supporting that different types of saturated fatty acid residues (i.e. differing according to chain length) may have different cholesterogenic effects. An analysis from designed controlled studies was made by H. Müller et al. (Lipids, Vol. 36, No. 8, pages 783-791 (2001)). H. Müller et al. describes predictive equations for total blood cholesterol and for LDL cholesterol levels, associated with the use of particular fatty acid residue. From this study a number of conclusions may be drawn: C14 acid residue has shown the highest hypercholesterolemic effect, 7 to 12 times higher than C12 acid residue. 016 acid residue is situated in between C12 and C14. Stearic acid residue is considered neutral. MUFA and PUFA are hypocholesterolemic, with the strongest effect shown for the PUFA.
Other authors have also drawn attention to the fact that different fatty acid residues may have different effects on LDL- and HDL-cholesterol (A. Aro, Lipid Forum Conference on Trans Fatty Acids, Aarhus (Dk) 2003). According to A. Aro, C14 acid residue increases LDL-cholesterol more than the HDL-type, while the opposite is stated for C12 acid residue. For C16 acid residue, this effect is stated to be even worse than for C14 acid residue.
From these and other studies it may then be concluded that MUFA and PUFA have hypocholesterolemic effects, C18 has a neutral effect, C12, C14 and C16 have a hypercholesterolemic effect, which is the strongest for C14 and C16.
Other products contain lower levels of SAFA, combining liquid oils with a fully hydrogenated fat, like palm fat, as a hardstock. However, consumers prefers non-hydrogenated fats, since the consumers associate hydrogenated fats with the presence of trans fatty acids. High melting fat components are also not preferred from an organoleptic point of view, since they melt above body temperature.
Still another category combines non-hydrogenated palm oil with liquid oil. These products are confronted with a functional problem, in that upon storage, they exhibit a high risk of recrystallization. As a result of this, after a certain period, quite big crystals may appear in the product, giving it a grainy and unpleasant mouthfeel. To limit the risk of recrystallization, the presence of cocoa butter in such chocolate spreads is limited as much as possible. The fatty acid profile of these products can also be further approved.
Optimal organoleptic properties means that the product should have a nice melting in the mouth, meaning that no waxiness or graininess should be observed. There should be no development of soapy flavor, which is a risk that exists when using lauric fats. Preferably the recipe allows the use of a certain amount of cocoa butter or cocoa mass, imparting the real chocolate taste.
WO 2007090477 A1 describes structured, fat continuous edible products, wherein the edible products contain, expressed on total product basis, less than 30 wt %, less than 28 wt. %, preferably less than 25 wt. % of SAFA, between 20 and 100 wt % of a triglyceride composition, between 0 and 80 wt % of a filler material, less than 15 wt % of water and wherein the triglyceride composition contains with respect to the weight of the triglyceride composition, less than 45 wt % of SAFA, less than 10 wt % of trans unsaturated fatty acids, at least 8 wt % of SUS triglycerides, wherein S is a C16-18 SAFA, U is unsaturated fatty acid having at least 18 C atoms, less than 15 wt % of S3, at least 90 wt % of C8-18 fatty acids, at least 75 wt. % of C18 fatty acids including saturated and unsaturated fatty acids, has an SFC at 20° C. of between 5 and 50%.
Typical examples are given of creams that are made with fats having a SAFA content between 24% and 35% and an SFC at 20° C. of more than 15%, for example 18%. The creams obtained have a firm structure, for example more than 200 gr measured using an SMS-texture meter with a 3 mm diameter probe at 20° C., speed 0.5 mm/sec, depth 10 mm or more than 800 gr measured using an SMS-texture meter with a 6 mm diameter probe at 20° C., speed 0.5 mm/sec, depth 10 mm. The fats used are preferably a combination of a hard fat with a high StOSt-content and a liquid oil. The StOSt to POSt ratio of the triglyceride composition is preferable at least 2.5, preferably ate least 4, more preferably at least 5, most preferably at least 6.
In order to build a strong and stable structure, a tempering process is preferably applied, similar to that commonly used in the production of chocolate. Tempering can be done with a tempering machine, applying a cooling step, for instance to an optimal temperature between 22 and 28° C., followed by a reheating step, or the tempering can be obtained through addition of a temper seeding material, for instance at a temperature of 29° C.
WO 2016/032392 describes a process for preparing a cocoa biomass with a modified fat phase by mixing a cocoa biomass having a fat phase 1 with a vegetable fat phase 2, thereby forming fat phase 3 in the cocoa biomass, followed by separating fat phase 3 from the cocoa biomass to a desired level of the cocoa biomass. WO 2016/032392 demonstrates in example 6 how a cocoa powder with a modified fat phase can be used in a chocolate spread, while keeping the cocoa taste and with a longer shelf life without any recrystallization. The vegetable fat used to prepare the chocolate spread is a combination of 95% of sunflower oil with 5% of a high melting hard stock, consisting of 50% of fully hydrogenated palmstearine with 50% of fully hydrogenated High Erucic rapeseed oil. It is further demonstrated in tables 17 and 18 of WO 2016/032392 that only the spread with a very low amount of symmetrical SatOSat triglycerides keeps a better shelf life regarding recrystallization.
WO 2015/072913 describes a cocoa butter stabilizing vegetable fat composition, comprising components A and B, said component A being present in an amount of > or =50% (w/w) of said cocoa butter stabilizing fat composition, said component B being present in an amount of 1-12% (w/w) of said cocoa butter stabilizing fat composition, wherein said component A is an interesterified fat blend consisting of 3-25% C16:0+C18:0, 75-97% C18:1+C18:2, and C18:0/C16:0 is >1.0, StUU+UStU is >8% (w/w), where StUU and UStU are triglycerides and where St stands for stearic acid and U stands for C18:1 and C18:2, and component A having a slip melting point of <25° C., and wherein component B is a hardstock consisting of: 70-99% C16:0+C18:0, 1-30% C18:1+C18:2, and C18:0/C16:0>0.4. This cocoa butter stabilizing fat composition is typically used in a spreadable fat product, for instance in a chocolate spread. The improvements obtained with such composition appear to be a better spreadability over a wide temperature range, lower risk for oil separation or recrystallization, especially when the recipe contains high amounts of cocoa butter. WO 2015/072913 made use of an interesterification process that creates asymmetrical triglycerides, which decreases the tendency to re-crystallisation, as known from WO 2010/149323. It also uses a hardstock with a high melting point as can be seen from the high C16:0+C18:0 content of 70-99%. An example of such hardstock is a combination of shea oil with palmstearine. Palmstearine contains high amounts of tripalmitin, a triglyceride having a melting point of 66-67° C. The use of palmstearine to create heat stability and to bind oil is well known, e.g. from WO 2014/195498, discussed herein below. According to WO 2015/072913 the hardstock is needed to provide a suitable solid fat content to the composition and to ensure that no oil separation happens at a high temperature. Nonetheless, the working examples of WO2015/072913 are completely silent about the solid fat content at a higher temperature and possible effects thereof on the melting behaviour in the mouth.
WO 2014/195498 describes an edible composition comprising at least 20 wt % of a vegetable fat, from 0 to 5% wt % of water and from 0 to 80 wt % of other edible ingredients. The composition has a hardness of from 5 to 110 g, measured by a Brookfield texture Analyser CT3 1000 at 20° C. using a 4.5 mm probe, 5 mm depth at a speed of 0.5 mm/s and the fat has a SFC at 20° C. of from 5 to 22%. The objective was to provide edible products with a sufficiently hard structure, while using fats with a limited SAFA content. This could be achieved by making use of a composition produced by a process using liquefied or supercritical gas and by combining liquid oils with "a relatively low amount of high melting fat component, which usually comprises significant levels of SAFA". The presence of the high melting fat can also be seen in the SFC at 40° C., which is preferably between 3 and 15%. Preferred hard fats are palm oil stearine, e.g. with an IV between 8 and 20 or interesterified blends of palm stearine and palm kernel fat. Palm stearine with IV 14 has a SAFA content of 88% of which the large majority is palmitic acid (C16). Tripalmitin is a major triglyceride present in palmstearine, having a melting point of 66-67° C. Palmkernel fat is a lauric fat, of which the majority of SAFA consist of lauric (C12), myristic (C14) and palmitic acid.
The structured fats of WO 2014/195498 are softer than those of WO 2007090477 A1, which makes them fit for use in emulsified spreads, e.g. with a water content of 50%, as demonstrated in the examples.
The disadvantages of the solutions provided by WO 2014/195498 are the presence of high melting fat components, imparting a bad melting and waxiness in the mouth, upon eating. The fats also have a bad nutritional profile, the phenomenon of post-hardening of the filling can not be avoided (increase of hardness by 56% after 6 weeks storage).
EP 3 005 875 A1 describes a method for preparing a filled bakery product, the filling composition comprising at least one powdered food ingredient and a fat blend comprising from 15 to 67 wt % of a temper hard fat and from 85 to 33 wt % of a liquid oil, wherein the temper hard fat has a solid fat content of at least 60 wt % at 20° C., wherein the liquid oil has a solid fat content of less than 15 wt % at 20° C. and wherein the fat blend has a saturated fatty acid residue content of from 16 to 42 wt % and a polyunsaturated fatty acid residue content of less than 40 wt %, based on the total weight of fatty acid residues of the fat blend. The filling has preferably a low fat content e.g. from 23 to 33 wt %. The aim of this method was to make products that are more solid and less spreadable, compared to standard palm based fillings. Nut oils, like hazelnut oil, are considered as less preferred in this application.
It should be noted that in all these prior art documents, confectionery spreads are made starting from a fat having at least 5% solid fat content at 20° C. or containing a hardstock has a high melting point, such as more than 60° C., so that it is the fat that can provide sufficient structure to the final edible product. However, such fats are not suitable for making spreadable and fat-containing food products which are characterized by having an optimal healthy fatty acid profile combined with the right functional and organoleptic properties, i.e. with the right and stable structure and fulfilling the desired organoleptic requirements, such as good taste and nice melting in the mouth.
Hence, there is a strong need in this field to provide spreadable, fat-containing, food products having optimal nutritional properties, in terms of the SAFA-level and the types of SAFA present therein which have no or very low adverse effects on blood cholesterol, combined with having good organoleptic properties, i.e. have a nice melting in the mouth, and show no waxiness or graininess and having the right functional properties such as a stable structure upon storage, no re-crystallisation, no oiling out and a good heat stability.


An adhesion-enhanced polyimide film which includes a core layer composed of a polyimide (a) having high rigidity and a low linear expansion coefficient, at least one side of which has a thin-layer formed by heating a coated layer including a heat-resistant surface treatment agent and a polyimide precursor which yields a highly heat-resistant amorphous polyimide (B).

Polyimides, which have excellent properties including heat resistance, dimensional stability, dynamic characteristics, electrical properties, environmental resistance and flame retardance, as well as high flexibility, are widely used as flexible printed boards and tape automated bonding boards employed for mounting of semiconductor integrated circuits. In these fields, polyimide films are used as insulating supports for laminated bodies produced by lamination with metal foils, such as copper foils, via adhesives.
In recent years there has been increasing demand for thinner polyimide films with higher functionality, in the fields of electrical and electronic devices and semiconductors.
Polyimide films with higher rigidity and lower linear expansion coefficients are preferred for better handling properties during working and for higher dimensional precision of laminated bodies obtained by lamination with metal layers, but on the other hand such films also have inferior adhesive properties and give laminated bodies with lower peel strength, thus impairing the reliability of the obtained products. This tendency becomes more pronounced with smaller polyimide film thicknesses.
Many strategies have been proposed in the past to improve the adhesion of polyimide films. For example, it is known that using a polyimide film having a discharge-treated surface improves the peel strength of laminated bodies obtained by lamination with copper foils via adhesives or direct lamination with metal layers (Japanese Unexamined Patent Publication No. 63-61030, Japanese Unexamined Patent Publication No. 2-53932, Japanese Unexamined Patent Publication No. 2-134241, Japanese Unexamined Patent Publication No. 3-56541, Japanese Unexamined Patent Publication No. 5-1160, Japanese Unexamined Patent Publication No. 5-78505, Japanese Unexamined Patent Publication No. 5-152378, Japanese Unexamined Patent Publication No. 5-222219, Japanese Unexamined Patent Publication No. 5-279497, Japanese Unexamined Patent Publication No. 10-12779).
It is also known that using a polyimide film having its surface treated with a surface-treatment agent improves the peel strength of laminated bodies which are obtained by lamination with copper foils via adhesives or direct lamination with metal layers (Japanese Unexamined Patent Publication No. 63-68641, Japanese Unexamined Patent Publication No. 63-99282, Japanese Examined Patent Publication No. 6-2828, Japanese Unexamined Patent Publication No. 9-48864, Japanese Unexamined Patent Publication No. 11-29852).
Moreover, it is known that using a multilayer polyimide film obtained by laminating a polyimide film with another thermoplastic polymer, such as a thermoplastic polyimide thin layer, also improves the peel strength of laminated bodies obtained by lamination with copper foils via adhesives or direct lamination with metal layers (Japanese Unexamined Patent Publication No. 63-218349, Japanese Unexamined Patent Publication No. 6-210794, Japanese Unexamined Patent Publication No. 2003-251773).
However, the peel strengths of laminated bodies produced using such surface-modified polyimide films have been insufficient, and this situation has resulted in reduced productivity while also constituting an impediment to increased device sizes and complicating efforts at manufacture on a commercial scale.
For this reason, there have been proposed in recent years a method of performing treatment with a surface treatment agent after lamination of a polyimide film with a thermo-plastic polyimide thin layer (Japanese Unexamined Patent Publication No. 2000-239423), and a method of performing treatment with a surface treatment agent after treatment of the polyimide film surface by plasma discharge (Japanese Unexamined Patent Publication No. 11-29852).
Nevertheless, there is much need of improvement because these polyimide films do not always provide sufficient peel strength to laminated bodies and, especially, to laminated bodies prepared by lamination with metal foils such as copper foils via adhesives, while organic materials other than polyimides are problematic due to inadequate mechanical properties (tensile modulus) or thermal properties (linear expansion coefficient).

Adhesion-enhanced polyimide film, process for its production, and laminated body


A peer-to-peer IT (Information Technology) backbone. The system includes at least one IT server and a plurality of client computers arranged in a peer-to-peer IT backbone. Each of the client computers includes an in-band processor, an out-of-band (OOB) microcontroller, and a storage device coupled to the in-band processor and OOB microcontroller. The storage device includes a reserved area for the OOB microcontroller to enable an IT-administration to push IT payloads from the at least one IT server onto the reserved area of at least one of the plurality of client computers. The IT payloads are disseminated throughout the peer-to-peer IT backbone by the OOB microcontroller of the client computers.

1. Field of the Invention
The present invention is generally related to the field of networks. More particularly, the present invention is related to a system and method for establishing a peer-to-peer IT (Information Technology) backbone.
2. Description
In large data centers and/or corporate environments, an IT (Information Technology) server may manage a thousand or more client computers on their network. When an IT server pushes configuration changes to the client computers in its network, the IT server must maintain a point-to-point connection to each client computer to transfer the data. This not only causes a lot of traffic on the network, but also consumes a large amount of the IT server's time. The IT server then becomes the single point of failure. If the IT server goes down, then all of the client computers on the network have essentially lost their external resources.
Often times, there is a need for the IT server to disseminate updates as quickly as possible. For example, when a virus attack is taking place, large data centers or corporate environments need to quickly disseminate a patch to their corresponding workstations to prevent the virus from infecting their network. Having the IT server disseminate these updates using one-to-one links with each client computer that it services is very time consuming and places a heavy burden on the IT server's ability to manage efficiently.
Thus, what is needed is a system and method that lessens the burden of IT administration yet leverages the existing network infrastructure to allow for scalable and fault-tolerant configurations of network systems. What is also needed is a method for enabling an operating system (OS) or a platform-related update to be disseminated to workstations in the network in an efficient manner. What is further needed is a method for distributing configuration tasks so that a peer node, and even possibly an IT server, may fail without impeding the provisioning/management of the network that the IT server manages.

System and method to establish a peer-to-peer IT backbone