The present invention relates to a method for producing cubic boron nitride abrasive grains used for producing a grinding wheel, etc., and to cubic boron nitride abrasive grains. The method comprises maintaining a mixture containing hexagonal boron nitride and seed crystals of cubic boron nitride under pressure and temperature conditions where cubic boron nitride remains thermodynamically stable, characterized in that the seed crystals contain cubic boron nitride twin crystals.

1. Field of the Invention
The present invention relates to a method for producing cubic boron nitride abrasive grains used for producing a grinding wheel, etc., and to cubic boron nitride abrasive grains.
2. Description of the Related Art
Cubic boron nitride is second to diamond in hardness and its chemical stability is higher than that of diamond. Thus, cubic boron nitride is increasingly employed as abrasive grains for producing grinding material, polishing material, or cutting material.
A variety of methods for producing cubic boron nitride have been proposed. Among them, best known and widely employed in the industrial field is a method in which hexagonal boron nitride is maintained in the presence of a substance such as solvents (also called as catalysts) under conditions where cubic boron nitride remains thermodynamically stable (approximately 4-6 GPa, approximately 1,400-1,600° C.), to thereby transform hexagonal boron nitride directly into cubic boron nitride (disclosed, for example, in Japanese Patent Publication (kokoku) Nos. 59-39362, 3-14495, 3-47132, and 3-15488).
The cubic boron nitride abrasive grains obtained through any of these methods have high hardness and chemical stability as mentioned above, and are employed in electroplated grinding wheels, metal-bonded grinding wheels, etc.
The cubic boron nitride abrasive grains obtained through any of the aforementioned methods are almost spherical (i.e., blocky abrasive grains). Thus, these abrasive grains are not suitably employed in grinding by means of a vitrified bonded grinding wheel which is required to have low grinding power.
Japanese Patent Application Laid-Open (kokai) No. 9-169971 discloses that "cubic boron nitride abrasive grains having a sharp shape and a relatively low level of defects" are used in order to enhance low grinding power of a grinding wheel employing cubic boron nitride abrasive grains, leading to "sustained low grinding power." Although a grinding wheel employing cubic boron nitride abrasive grains produced through the above method attains improved grinding power as compared with a conventional grinding wheel employing blocky abrasive grains, grinding wheels of lower grinding power have been demanded in the industry.
The bond for use in the grinding surface of a vitrified bonded grinding wheel is melted to bind intergrain spaces during firing and provides strong bond strength after solidification through cooling. In order to attain excellent grinding power of a porous grinding wheel such as a vitrified bonded grinding wheel, porosity of the grinding wheel must be increased.
However, when the amount of a bond is reduced so as to increase porosity, retention of the abrasive grains is weakened, allowing falling of an increasing number of abrasive grains due to a load during grinding. Accordingly, the surface roughness of a work material deteriorates, and the interval between dressing operations is shortened, failing to attain a satisfactory grinding ratio. When the percentage of abrasive grain is reduced, the level of bridge structure among abrasive grains is lowered, to thereby decrease the hardness of the grinding wheel, even though retention of the abrasive grains is sufficient. Thus, the number of abrasive grains which cannot withstand the load imposed during grinding increases, resulting in falling of an increased number of abrasive grains and failing to attain a satisfactory grinding ratio.
In order to solve these problems, there is also proposed a method in which an aggregate is added so as to compensate for the reduction in abrasive particles or a bond. However, when an aggregate is added, the porosity of a grinding wheel decreases, thereby inhibiting enhancement of low grinding power.

Method for producing cubic boron nitride abrasive grains


To provide a pressure-sensitive adhesive component that can be quickly and easily used to fix an ankle joint by persons having no expert knowledge on taping without causing problems such as difficulty in wearing shoes due to thickening upon application of the tape, a pressure-sensitive adhesive component includes a bottom portion; a first tape-shaped body; and a second tape-shaped body, wherein a cut is provided between the first and second tape-shaped bodies running in a longitudinal direction, the first tape-shaped body including a first front tape body and a first rear tape body, and the second tape-shaped body including a second front tape body and a second rear tape body, and wherein a ratio of a width of the front tape body to a width of the rear tape body is within the range of 5:5 to 5:3.

1. Field of the Invention
The present invention relates to a pressure-sensitive adhesive component for an ankle and to a method for using it. More particularly, the present invention relates to a pressure-sensitive adhesive component used for fixing ankle joints and the like in the fields of medicine, sports, chiropractic and so on and to a method for using such a pressure-sensitive adhesive component.
2. Description of Related Art
An ankle is a portion of a body that supports the body and thus is loaded with the body weight and that tends to suffer a sprained ankle in porting, daily life and so on. Since the ankle is closely involved in walking, a pain in the ankle makes daily motion difficult. Accordingly, there has been a keen desire for a countermeasure to alleviate the pain that occurs in the ankle. For example, a treatment to fix the ankle joint and the like has been performed.
A method for fixing the ankle joint and the like without requiring expert knowledge includes a method of attaching a supporter around an ankle disclosed in Japanese Patent Application Laid-Open No. 10-24055. The supporter has a shin pad formed to have a large thickness and use of the pad results in thickening of the ankle so that one cannot wear shoes or the like when he or she has attached the shin pad around the ankle. This is inconvenient to daily life motions. Further, a supporter for a foot joint made of an elastic tape-shaped body, including an anchor strap that winds up around an ankle, a figure eight strap that winds up around a dorsum of the foot and a sole of the foot in the form of a figure eight (8), and a stirrup strap that winds up around the foot from a medial malleolus to a lateral malleolus through the sole is disclosed in Japanese Patent Application Laid-Open No. 10-248865. The supporter loosens with a lapse of time, thus failing to fix the ankle joint and the like sufficiently.
Fixing or otherwise restricting the movement of an ankle joint by using a pressure-sensitive adhesive tape in order to alleviate the pain of the ankle (taping) is a conventional treatment performed in the fields of sports and medicine. Appropriate taping can sufficiently fix the ankle to alleviate the pain of the ankle and will not reduce the ability of the ankle and the like to move. However, the conventional treatment has the defect that appropriate taping cannot be readily performed since expert knowledge is required for performing such taping. Also, it has the problem that taping by spirally winding a pressure-sensitive adhesive tape around an ankle in an overlapping manner tends to cause local circulation disturbance and nervous disturbance due to over constriction.

Pressure-sensitive adhesive component for ankle and use thereof


There are provided a phase shift circuit and a power factor correction circuit including the same. The phase shift circuit includes a switching circuit unit charging power in or discharging power from a capacitor through a plurality of switching devices and comparing a voltage of the capacitor with a predetermined reference voltage, and a clock generating unit generating a reference clock signal based on an output of the switching circuit unit, wherein the switching circuit unit turns the plurality of switching devices on or off, based on currents from inductors respectively included in a main circuit and a sub-circuit of a power factor correction circuit to determine a polarity of the voltage of the capacitor.

1. Field of the Invention
The present invention relates to a phase shift circuit capable of significantly decreasing an electromagnetic interference (EMI) component of an input/output signal by adjusting a phase difference between driving signals of switches operating a main circuit and a sub-circuit included in a power factor correction circuit, and a power factor correction circuit including the same.
2. Description of the Related Art
Recently, in the electrical appliance and electronic device fields, research into a method of removing harmonic components generated in an input terminal of an electronic apparatus in order to significantly decrease an effect on a power line of an electrical appliance or electronic device and reduce interference with other appliances and devices has been actively undertaken. As an efficient method of removing harmonic components, a power factor correction (PFC) circuit may be used. A power factor correction circuit may be classified as a passive-type power factor correction circuit or an active-type power factor correction circuit, according to whether or not it includes a switch. The passive-type power factor correction circuit has disadvantages in that a form factor thereof may be large, and an effect thereof may not be great. Therefore, recently, active-type power factor correction circuits have been widely used.
Among active-type power factor correction circuits, an interleaving-type power factor correction circuit using at least two identical power factor correction circuits connected to each other in parallel has characteristics that depend on a phase difference between signals for operating a plurality of circuits connected to each other in parallel. For example, when it is assumed that two identical power factor correction circuits are connected to each other in parallel in a master-slave scheme, in the case in which driving signals for operating switches respectively included in the two identical power factor correction circuits have a phase difference of 180 degrees therebetween, an electromagnetic interference (EMI) component of an input/output signal may be significantly decreased. When the phase difference between the driving signals for a main circuit and a sub-circuit deviates from 180 degrees, a ripple component of an input current increases, such that an EMI component increases.
In the interleaving-type power factor correction circuit, various type phase shift circuits have been suggested in order to maintain a phase difference between switching devices included in respective circuits at a required value. However, in the phase shift circuit suggested in the related art, a selection condition in selecting a current source included in the circuit was limited or it was difficult to accurately generate a required phase difference.
In the following Related Art Documents, Patent Document 1, which relates to an interleaved-type switching converter, and an apparatus and method of controlling the same, discloses a method of switching power in an interleaving scheme to generate a control signal and maintaining a phase difference at a required value, for example, 180 degrees. Patent Document 2, which relates to a phase shift and synchronization circuit, discloses a feature of adjusting a sink between control signals of the respective switching devices in an interleaving-type power factor correction circuit. However, neither Patent Document 1 nor Patent Document 2 discloses a feature of changing a polarity of a voltage of a capacitor in a circuit controlling a phase difference to operate a switch at a required phase difference.

Phase shift circuit and power factor correction circuit including the same

University of Seoul Industry Cooperation Foundation


An ignition device for propellant of a projectile having its aft section ending deeply rearward within a shell case comprises a strand holder, a primer head, and flexible ignition strands with the primer head, when installed, being supported by the shell case and supporting the strand holder which in turn preferably supports the aft end of the projectile. The ignition strands, symmetrically disposed, contact the propellant and in preferred embodiments also contact the projectile, and/or the interior of the shell case, as well as the propellant, and extend along the body section of the strand holder and through conduits therein into a combustion chamber, formed intermediate the installed primer head and a platform section of the strand holder, and with the combustion chamber containing an igniter booster charge susceptible to ignition by a firing means adapted to be used with the primer head.

Cased, large-caliber ammunition, such as rounds for tank guns, artillery, and the like, comprising a projectile and a propellant for the projectile are known and common for various military weaponry. This ammunition ordinarily depends on standard bayonet-type primers and the like for ignition of the propellant, which propels the projectile upon firing of the ammunition round. However, as projectiles useful in ammunition become of such extended length so as to extend rearwardly deeply into the aft portion of the ammunition there is reached a rearward point whereat usage of standard bayonet primers no longer is feasible and/or possible It is believed not known heretofore is: a useful ignition device or system, which employs flexible ignition strands for propellant ignition when the projectile to be propelled by the propellant extends aft so far as to contact a primer head in an ignition device, such as useful upon replacing a customarily employed bayonet-type ignition system for propellant.
The invention's ignition device or system solves problems related to propellant ignition of cased, large caliber ammunition (e.g. for tanks) with deep projectile intrusion into the propellant bed. There are problems which arise when extended length projectiles or penetrators are used. Having reached the point where the intrusion of the penetrator rearward precluded use of any of the standard bayonet primers for propellant ignition, a need arose for devices and new concepts for flexible ignition strands to be extended into the propellant bed. The invention provides a means of (1) initiating the flexible ignition strands; (2) facilitating ammunition LAP (load-assembly-pack), (3) facilitating the downloading of the ammunition should the need arise, (4) supporting the projectile inside the case to improve structural integrity for handling and transportation, and (5) providing projectile stability during early travel when asymmetric forces generate the most destructive transverse moments.
The invention provides a means to initiate strands of ignition material distributed anywhere throughout the propellant bed of cased, large caliber ammunition, including base pad ignition of stick propellant. If there is extended intrusion of the projectile into the case and hence the propellant bed, the invention provides a strand holder, which also will stabilize the projectile during early travel (the first two to three inches) in the bore. The invention requires no design changes of external associated metal parts with, more specifically, no changes being made in the design of the case base. The external appearance of the ammunition round will be unaffected so that no changes in user training will be necessary. The principal modifications of a conventional primer head are: the extension of the mounting threads; the replacement of the primer tube threads with a tapered opening; the press-fit ignition element is the same one that's used in the standard head design; and the closing plug is changed only in that it is shortened on the end away from the black powder charge. This permits utilization of standard internal parts with no or minimal modifications. Extension of the head mounting threads provides a means to attach a strand holder/projectile stabilizer. This not only greatly facilitates the Load-Assemble-Pack (LAP) procedure, but also makes down loading much easier.
Of importance to the invention's ignition device or system is a combination of a primer head and a strand holder. This combination resolves and solves problems related to the application of the invention's ignition device used to initiate strands of propellant ignition material in the bed of large caliber, cased (e.g. tank) ammunition. It is useful with a strand ignition system to replace the standard bayonet primer and especially when projectile intrusion into the propellant bed precludes the use of the bayonet primer. It provides a firm link between the ignition device and ammunition case base, and performs the function of the usual primer head. It thus provides for (1) a primer head enabling usage of ignition strands in the ignition system; (2) greatly simplified ammunition LAP; (3) easier ammunition down loading; and (4) superior projectile support inside the case which improves ammunition structural integrity during transportation and/or rough handling and early projectile launch.

Strand ignition for propellant of shell-coated projectile

The United States of America as represented by the Secretary of the Army


A unit dose sustained-release oral dosage form containing a plurality of melt-extruded particles, each consisting essentially of a therapeutically active agent, one or more retardants, and an optional water-insoluble binder is disclosed. The particles have a length of from about 0.1 to about 12 mm and can be of varying diameters and each unit dose provides a release of therapeutically active agents over at least about 8 hours. Methods of preparing the unit doses as well as extrusion processes and methods of treatment are also disclosed.

The present invention relates to a process of making granulates or multiparticulates which are useful, for example, in pharmaceutical dosage forms. In particular, the invention relates to a process for melt-extruding pharmaceutical agents with excipients to form multiparticulates suitable for inclusion in solid dosage forms such as capsules, tablets and the like.
It is known in the pharmaceutical art to prepare compositions which provide for controlled (slow) release of pharmacologically active substances contained in the compositions after oral administration to humans and animals. Such slow release compositions are used to delay absorption of a medicament until it has reached certain portions of the alimentary tract. Such sustained-release of a medicament in the alimentary tract further maintains a desired concentration of said medicament in the blood stream for a longer duration than would occur if conventional rapid release dosage forms are administered.
Over the years, several different methods of preparing controlled release pharmaceutical dosage forms have been suggested. For example, direct compression techniques, wet granulation techniques, encapsulation techniques and the like have been proposed to deliver pharmaceutically active ingredients to the alimentary tract over extended periods.
Melt granulation techniques have also been suggested to provide controlled release formulations. Melt granulation usually involves mechanically working an active ingredient in particulate form with one or more suitable binders and/or pharmaceutically acceptable excipients in a mixer until one or more of the binders melts and adheres to the surface of the particulate, eventually building up granules.
PCT International Publication No. WO 92/06679 discloses melt granulating methods for producing pellets containing therapeutically active substances. The method includes mechanically working a mixture containing the active substance in cohesive form with a binder having a melting point of 40-100.degree. C., while supplying sufficient energy to melt the binder and form "overmoist" spherical pellets and thereafter adding an additional cohesive substance while maintaining the mechanical working to finally produce dry pellets.
PCT International Publication No. WO 93/18753 also discloses another melt extrusion process for preparing sustained-release pellets. This method includes pelletizing a mixture containing drug in finely divided form and a binder which includes one or more water-insoluble-wax-like binder substances with a melting point above 40.degree. C. using a high shear mixer.
In the spite of the foregoing advances, a need for further alternatives in the field of controlled release formulations has been sought. The present invention addresses this need.


A recursive digital filter has a recursive arithmetic operation circuit and an output compensation circuit. The output compensation circuit outputs a value of zero as output data of the recursive digital filter, even if the data input to the recursive arithmetic operation circuit is zero.

1. Field of the Invention
The present invention relates to a recursive type digital filter having a feedback path.
2. Description of the Prior Art
FIG. 6 is a diagram showing a configuration of a conventional recursive type digital filter. In FIG. 6, the reference number 1 designates an input terminal through which a data item is received and inputted to the recursive type digital filter, 2 denotes a plurality of multipliers, 3 denotes a plurality of adders, 4 indicates a plurality of registers for storing data as delay values for the input data, and 5 designates an output terminal through which the data is output as output data to outside of the conventional recursive type digital filter.
Each multiplier 2 multiplies data by a coefficient in a coefficient table shown in FIG. 1. This conventional recursive type digital filter is capable of performing a 20 bit significant digit arithmetic operation.
Next, a description will now be given of the operation of the conventional recursive type digital filter shown in FIG. 6.
In general, the conventional recursive type digital filter is used for digital signal processing of audio devices, for example. This digital filter inputs an audio digital signal and performs a predetermined operation for the received audio digital data and outputs the audio digital signal without noise to external devices.
In FIG. 6, the multiplier 2 multiplies a data item such, as the input data item received through the input terminal 1, by a pre-set coefficient value that has been set previously. The input data item is added by the adder 3 and delayed in time using data stored in the register 4. Finally, the desired audio digital data item is provided through the output terminal 5 to external devices.
In addition to this feature, as shown in FIG. 6, the conventional recursive type digital filter has a feedback path. When data is received once through the input terminal 1, the operation result is fed back to the input terminal 1 through the feedback path. Thereby, the data that does not satisfy causality is output through the output terminal 5 to external devices.
Since the conventional recursive type digital filter has the configuration described above, there is a drawback in which the output data from the output terminal 5 can not converge to zero, namely, the phenomenon of a limit cycle occurs, by a rounding error caused by the operation of a limited significant digit as the 20 bit significant digit even if the input data item becomes "0".
This phenomenon will now be explained in detail by using numerical values.
Firstly, an optional data item is inputted to the input terminal 1. Secondly, the data "0" is inputted through the input terminal 1, for example. In addition, when the data as the operation result converges to zero from a positive value, the 20 bit data item is changed as follows:
000000000000000.0010 (2), PA1 000000000000000.0001 (2), and PA1 000000000000000.0000 (2). PA1 1111111111111111.1101 (2), PA1 1111111111111111.1110 (2), and PA1 1111111111111111.1111 (2),
Thus, the 20 bit data item approaches "0" at every repeating of the data output through the output terminal 5. After this, the output data converges to zero.
However, the conventional recursive type digital filter shown in FIG. 6 has a drawback that the output data item converges toward zero and converges to -1 when the output data item converges to zero from a negative value. Therefore it is difficult for the output data item to converge to zero correctly. This 20 bit data item is expressed by using a 2's complement notation as follows:
where the most significant bit indicates a sign bit.


A dielectric film production process comprising a baking step in which a dielectric film is formed by heating a precursor layer formed on a metal layer, wherein the metal layer contains at least one type of metal selected from the group consisting of Cu, Ni, Al, stainless steel and austenitic nickel-chromium-based superalloy and during at least part of the baking step the precursor layer is heated in a reduced pressure atmosphere.

1. Field of the Invention
The present invention relates to a dielectric film and to a process for its fabrication. A application Ser. No. 11/492,943 filed Jul. 26, 2006, issued as U.S. Pat. No. 7,539,005 on May 26, 2009 is related to the present application. The disclosure of the prior application is hereby incorporated herein by reference in its entirety.
2. Related Background Art
Solution methods are known as methods for forming dielectric films containing metal oxides such as barium strontium titanate (BST) on metal layers. In such solution methods, a solution containing prescribed starting materials is coated onto a metal layer and dried, and the formed precursor layer is baked to form a dielectric film. However, when the metal composing the metal layer is a readily oxidizing metal such as Cu or Ni, the metal layer becomes oxidized during the baking, thereby losing conductivity. When oxidation of the metal occurs, even if the dielectric constant of the dielectric layer itself is increased, for example, the capacity of the capacitor does not adequately increase. In order to prevent oxidation of the metal layer, therefore, there have been proposed methods such as a method of providing a buffer layer on the metal layer (W. Fan et al., Journal of Applied Physics, Vol. 94, No. 9, p. 6192), and methods of accomplishing the baking in a reducing environment such as H2O/H2 mixed gas or the like (Brian Laughlin et al., 2003 MRS Fall Meeting, Symposium C, 2003, p. 70; Jeff Dawley et al., 2003 MRS Fall Meeting, Symposium C, 2003, p. 70; R. J. Ong, J. Mater. Res., 2003, Vol. 18, No. 10, p. 2310).
The following publications are also concerned with formation of dielectric films: Jon-Paul Maria et al., J. Am. Ceram. Soc., Vol. 84, No. 10, p. 2436; Y. Fujisaki et al., Jpn. J. Appl. Phys., 2003, Vol. 42, p. L267; Y Fujisaki et al., Jpn. J. Appl. Phys., 2002, Vol. 41, p. L1164; and Japanese Patent Publication No. 3188179.

Method for fabricating dielectric on metal by baking dielectric precursor under reduced pressure atmosphere


A guide wire includes a wire body having a tapered portion disposed on a distal end portion thereof and having an outside diameter progressively reduced toward a distal end thereof. The guide wire includes a coil disposed in covering relation to the distal end portion of the wire body and a helically shaped wire. The coil includes an increasing wire-diameter portion where the diameter of the wire increases continuously toward a distal end thereof, the increasing wire-diameter portion being disposed in covering relation to the outer circumference of at least a portion of the tapered portion in a longitudinal direction.

Guide wires are used to guide catheters for use in the treatment of body regions that are difficult to operate on surgically, the treatment of body regions through minimally invasive surgery, and the inspection of blood vessels by cardiac angiography. For example, to perform PCI (Percutaneous Coronary Intervention) under X-ray radioscopy, the distal end of a guide wire is placed to project from the distal end of a balloon catheter, and the guide wire together with the balloon catheter is inserted into the blood vessel up to a position near the constricted area of the coronary artery in question for guiding the distal end of the balloon catheter to the position near the constricted area.
An example of a guide wire used in the above treatment is disclosed in U.S. Pat. No. 5,797,857. The disclosed guide wire includes a flexible wire body (core), a coil (a metal coil for X-ray angiography) disposed in surrounding relation to the distal end of the wire body, and a covering layer (a covering member of synthetic resin, a hydrophilic lubricating layer) covering the outermost surfaces of the wire body and the coil.
When the guide wire disclosed in U.S. Pat. No. 5,797,857 is used to guide the catheter as described above, the following phenomena tend to occur depending on the state of the coronary artery such as the degree of curvature of the coronary artery:
If the guide wire is pushed in when the coil of the guide wire reaches (is inserted into) a sharp bend of the coronary artery, for example, undue forces (tending to cause a plastic deformation) are liable to be applied to the coil. At this time, a turn of the wire of the coil rides onto an adjacent turn of the wire, thus tending to plastically deform the coil. Therefore, the coil will not recover its ordinary (normal) state, and the pushing force applied from the proximal end of the wire body will not be reliably transmitted to the distal end of the wire body, i.e., the guide wire pushing capability is greatly reduced.
Though the coil of the guide wire disclosed in U.S. Pat. No. 5,797,857 has the hydrophilic lubricating layer, a relatively large frictional resistance is developed between the hydrophilic lubricating layer and a sharp bend of the coronary artery depending on the thickness of the guide wire when the coil of the guide wire reaches (is inserted into) the sharp bend of the coronary artery. Therefore, the torque from the proximal end of the guide wire is not reliably transmitted through the coil to the distal end of the wire body, i.e., the torque transmitting capability is greatly reduced.


A crystalline rare-earth oxide or sulfide which has an average particle diameter of 10 nm or less and in which the rare-earth element has a low valance, in particular, crystalline EuO or EuS of nano size. The rare-earth oxide or sulfide is produced by irradiating an inorganic acid salt or organic acid salt of a rare-earth element having a high valence with a light in the range of from UV to visible light in the presence of: a compound which, upon irradiation with the light in the range of from UV to visible light induces a photooxidation-reduction reaction and simultaneously converts the rare-earth ions having a high valence into ions having a low valence; and a cholagen source compound which immediately reacts with the low valence ions to form a cholagen compound.

Oxide, sulfide, selenide or telluride of rare-earth, which is a chalcogen semi conductor, is an important fundamental material used in various fields such as luminescent material, optoelectronics material, photo-magnetic material or magnetic material. Particularly, EuO or EuS which uses low valence Eu (II) (di-valent) are important material as a photo-magnetic material which displays magnetic-optical Faraday effect and Kerr effect.
In the meanwhile, di-valent Eu (II) ion can not exist stable and easily oxidized to tri-valent Eu (III). Therefore, in the ordinary condition, it is not possible to use Eu (II) salt as a material to synthesis EuO. So, conventionally, a thermo structural rearrangement method characterizing to treat Eu metal or Eu (III) salt by high temperature higher than 1000° C. is used for the synthesis of low valence EuO. [edited by Ginya Adachi "Chemistry of rare-earth" Kagaku Dojin, p398 (1999)].
Further, the method to prepare said compound by reacting Eu metal with liquid ammonia (−77° C.) is proposed [D. E. Eastman, F. Holtzberg and S. Methferrel, Phey. Rev. Lett., 23, 5, 226 (1969)]. However, above mentioned methods are belonging to high energy process, further, according to said preparation methods, it is difficult to adjust the particle size of generated Eu (II) semi-conductor. Therefore, the diameter of the finest one among the obtained Eu (II) semi-conductor is several μm, and it is necessary to make the atmosphere temperature to very low temperature (6K) to generate photo-magnetic property.
In general, when the size of a solid particle is minimized to the order of nano meter, the quantum size effect appears. Therefore, the Eu (II) semi-conductor whose particle size is minimized to nano meter is predicted to generate specific property such as hard magnetism, strong luminescent or photo-magneticity at the room temperature. However, up to the present, it is recognized that the preparation of Eu (II) semi-conductor of low valence having above mentioned specific properties is impossible.
While, there is a paper reporting that when an UV-ray (254 nm) is irradiated to Eu (III) ion in methanol, Eu (II) ion can be generated [document: M.Kusaba, N.Nakashima, W. Awamura, Ylzawa and C. Yamanaka, Chem. Phys. Lett., 197.136(1992)].
However, there are no paper reporting the preparation of oxide or sulfide compound of Eu (II) of low valence and nano size, further, there are also no paper reporting the preparation of Eu (II) semi-conductor by ray irradiation utilizing above mentioned photo-chemical reaction.
The object to be dissolved by the present invention is to provide a crystalline particle of (chalcogenide compound of low valence) oxide or sulfide of Eu (II) which generates quantum efficiency, especially to provide stable crystalline particles of nano size having narrow particle size distribution, further to provide a method for producing said crystalline particles.
The inventors of the present invention have carried out earnest study to solve above mentioned object. And, have investigated to apply the phenomenon disclosed in above mentioned document to the production of oxide or sulfide of nano size Eu (II), namely, said phenomenon is that: when an VV-ray shorter than 300 nm, for example, an UV-ray by a fluorescent lamp which radiates ray of 254 nm is irradiated to Eu (III) ion in methanol, Eu (II) ion can be generated. During the study, salts which supply Eu (III) ion, reagents forming the reaction atmosphere such as solvent which generate Eu (II) ion, generated EU (II) ion are investigated, particularly, the preferable combinations of oxygen or sulfur atoms supplying compounds which provide the environment to form oxide or sulfide are investigated.
In above mentioned investigation, various agents mentioned below were used.    1. As the salt to supply said Eu (III) ion, salt of inorganic acid, especially nitrate (6 hydrate) and salt of organic acid such as salts of mono-carboxylic acid, di-carboxylic acid or tri-carboxylic acid are used.    2. As the solvent to form the reaction atmosphere, polar solvent which dissolve above mentioned salts, for example, alcoholic solvent such as methanol or ethanol or ether are used.    3. At the irradiation of light to said reaction system, a compound to generate a radical which makes Eu (III) reduce to Eu (II), such as methanol (in this case methanol also acts as a solvent) or water (e.g. crystal water of inorganic salt) are coexisted and used as an agent. Still more,    4. The oxygen or sulfur supplying compound generated by said reduction which reacts rapidly with Eu (II), for example, urea as the supplying compound of oxygen or thio urea as the supplying compound for sulfur are used as the coexisted agents.
Under said atmospheric condition for reaction, when the light from the ultra violet region to the visible region, for example the light of 200 nm to 1000 m wavelength region is irradiated, EuO or EuS are generated as the very fine particle whose particle size is equal to or smaller than 10 nm, equal to or larger than 4 nm, and having narrow particle size distribution. That is, the object of the present invention is dissolved. As a light source, laser beam can be used, further the light source of longer wavelength region which brings multiphoton excitation can be used as a light source. Furthermore, the compound which indicates photosensitizing effect can be used together with.

Rare-earth oxide or sulfide of nano size and process for producing the same through photochemical reaction


An image sensor package includes an image sensor having an upper surface with an active area and bond pads formed thereon. A noncritical region of the upper surface is between the active area and the bond pads. A window overlies the active area and is supported on the noncritical region by a window support. The window, window support and image sensor define a sealed cavity and the active area is located within the cavity. In particular, the active area is located within the cavity, which is sealed to protect the active area against external moisture, dust and contamination.

The present invention relates generally to the packaging of electronic components. More particularly, the present invention relates to an image sensor package.
Image sensors are well known to those of skill in the art. An image sensor included an active area, which was responsive to electromagnetic radiation. To avoid obstructing or distorting the electromagnetic radiation which struck the active area of the image sensor, it was important to avoid contamination, e.g., from dust, of the active area.
Image sensors were fabricated from a silicon wafer. More particularly, a plurality of image sensors were formed in a single silicon wafer. The silicon wafer was singulated, sometimes called cut-up or diced, to separate the image sensors from one another. However, during this wafer singulation, silicon shards were generated. These silicon shards had a tendency to contaminate and scratch the active areas of the image sensors. As a result, image sensors were damaged or destroying, which undesirably decreased the yield. However, to reduce cost, is important to have a high yield.
The singulated image sensor was then used to fabricate an image sensor assembly. In one conventional assembly, the image sensor was located within a housing, which supported a window. Radiation passed through the window and struck the active area of the image sensor, which responded to the radiation.
More particularly, the image sensor was mounted to a printed circuit mother board. After the image sensor was mounted, the housing was mounted around the image sensor and to the print circuit mother board. This housing provided a hermetic like seal around the image sensor, while at the same time, supported the window above the image sensor.
As the art moves to smaller and lighter weight electronic devices, it becomes increasingly important that the size of the image sensor assembly used within these electronic devices is small. Disadvantageously, the conventional image sensor assembly described above required a housing to support the window and to hermetically seal the image sensor. However, this housing was relatively bulky and extended upwards from the printed circuit mother board a significant distance, e.g., 0.100 inches (2.54 mm) to 0.120 inches (3.05 mm) or more. As a result, the image sensor assembly was relatively large.
Another important characteristic of an image sensor assembly was the temperature at which condensation formed within the housing of the image sensor assembly, i.e., the dew point of the image sensor assembly. In particular, it was important to have a low dew point to insure satisfactory performance of the image sensor assembly over a broad range of temperatures.
In accordance with the present invention, an image sensor package includes an image sensor having an upper surface with an active area and bond pads formed thereon. A noncritical region of the upper surface is between the active area and the bond pads. A window overlies the active area and is supported on the noncritical region by a window support.
The window, window support and image sensor define a sealed cavity and the active area is located within the cavity. In particular, the active area is located within the cavity, which is sealed to protect the active area against external moisture, dust and contamination.
Recall that in the prior art, a window was supported above an image sensor with a housing. This housing was typically formed of ceramic, which was relatively expensive. Advantageously, the image sensor package in accordance with present invention eliminates the need for a housing of the prior art. Accordingly, the image sensor package is significantly less expensive to manufacture than image sensor assemblies of the prior art.
Further, since the window is attached directly to the image sensor by the window support, a distance, sometimes called the Z height, between the window and the upper surface of the image sensor can be made relatively small. As a result, the image sensor package can be made relatively thin compared to a prior art image sensor assembly.
In contrast, the housing of the prior art image sensor assembly was relatively bulky and extended upwards from the printed circuit mother board a significant distance. Since the image sensor package in accordance with the present invention can be made relatively thin, the image sensor package is well suited for use with miniature lightweight electronic devices, which require thin and lightweight image sensor assemblies.
Further, since the Z height is relatively small, the volume of the cavity is also relatively small. By minimizing the volume of the cavity, the amount of any moisture trapped within the cavity is also minimized. This, in turn, essentially eliminates the possibility of moisture condensation on the interior surface of the window or on the active area of the image sensor. As a result, the image sensor package in accordance with the present invention has a very low or nonexistent dew point.
In contrast, prior art image sensor assemblies had a significant dew point, i.e., a temperature at which condensation formed within the housing, which enclosed the image sensor and supported the window. Since the housing was relatively bulky and held a relatively large volume of air, moisture had a tendency to get trapped within the housing and to condense on the interior surface of the window or on the active area of the image sensor.
To avoid this condensation, it was important to avoid subjecting the image sensor assembly to extreme low temperatures. Disadvantageously, this limited the temperature range over which the image sensor assembly would satisfactorily perform. Alternatively, the image sensor assembly was fabricated in a low humidity environment to avoid trapping moisture within the housing and was hermetically sealed by the housing to keep out moisture. This added complexity, which increased the cost of the image sensor assembly. Further, in the event that the hermetic seal of the housing failed, the image sensor was damaged or destroyed.
Since the image sensor package in accordance with present invention has a very low or nonexistent dew point, the image sensor package operates satisfactorily over a broader range of temperatures and, more particularly, at lower temperatures than image sensor assemblies of the prior art.
Also in accordance with the present invention, a method of fabricating a plurality of image sensor packages in an array to reduce cost is presented. The method includes applying a bead to a noncritical region of an upper surface of an image sensor, the upper surface including an active area and bond pads, the noncritical region being between the active area and the bond pads. A window is mounted to the image sensor with the bead.
In one embodiment, the image sensor is one of a plurality of image sensors integrally connected together. In accordance with this embodiment, the method further includes singulating the plurality of image sensors.
Of importance, the active areas of the image sensors are protected by the windows (in combination with the window supports) during singulation. More particularly, the windows protect the active areas from contamination and scratching during singulation, e.g., from silicon shards. The windows also protect the active areas during subsequent processing of the image sensor package, e.g., during subsequent wire bonding and/or encapsulation and/or molding. As a result, damage or destruction of the image sensors is avoided. Accordingly, yield is increased and package cost is reduced compared to the prior art.
Further, by forming a plurality of image sensor packages simultaneously, several advantages are realized. One advantage is that it is less labor intensive to handle and process a plurality of image sensor packages simultaneously rather than to handle and process each image sensor package on an individual basis. Another advantage is that usage of materials is more efficient when an array of image sensor packages is fabricated. By reducing labor and using less material, the cost associated with each image sensor package is minimized.

Image sensor package having sealed cavity over active area


The present disclosure relates to a driving assistance system, includes: a light detection and ranging module configured to detect position parameters of objects around the light detection and ranging module; a LiFi driving module connected to the light detection and ranging module and being capable of receiving the position parameters and modulating the position parameters to generate a LiFi signal; and a lighting module connected to the LiFi driving module, and configured to provide lighting and transmit the LiFi signal.

With the coming of the age of intelligence, intelligent driving technology has been increasingly studied. To assist driving, a detection device such as vehicle-mounted radar needs to be installed on a vehicle to detect the positional relationship between the vehicle and surrounding objects.
Some position detection devices currently installed on the vehicle mostly feed the distance parameter between the detected object and the vehicle installed with a radar itself directly to said vehicle to assist driving, thereby avoiding an occurrence of the collision accident. However, when the distance between two vehicles are too short, the vehicle preceding another vehicle cannot realize the danger of collision. If before the occurrence of collision accident, the preceding vehicle can get this and take measures timely, the probability of occurring traffic accidents may be more effectively reduced. Nevertheless, there is no way to send dangerous information directly to the preceding vehicle at present. In addition, when the level of autonomous driving is higher, the current internet of vehicles that relies on 5G or WiFi is suitable for large-scale data interaction, but high-speed private information transmission between specific vehicles cannot be achieved, for example, the distress information, the information on road condition, etc. cannot be transmitted timely between travelling vehicles.


An antireflection film wherein, even where exposure light enters obliquely in a liquid immersion lithography technique, a sufficiently reduced reflectance can be achieved at the interface between a resist layer and a silicon substrate. A two-layer antireflection film is used in exposure by an exposure system having a wavelength of 190 to 195 nm and a numerical aperture of 1.0 or less and formed between the resist layer and the silicon substrate. Where complex refractive indices N1 and N2 and film thicknesses of upper and lower layers of the antireflection film are represented by n1-k1i, n2-k2i and d1, d2, respectively, and a predetermined combination of values of [n10, k10, d10, n20, k20, d20] is selected, n1, k1, d1, n2, k2 and d2 satisfy {(n1-n10)/(n1m-n10)}2+{(k1-k10)/(k1m-k10)}2+{(d1-d10)/(d1m-d10)}2+{(n2-n20)/(n2m-n20)}2+{(k2-k20)/(k2m-k20)}2+{(d2-d20)/(d2m-d20)}2≦1.

This invention relates to an antireflection film which is used for exposure of a resist film in a fabrication process of a semiconductor device and an exposure-method in which an antireflection film is used.
In the field of semiconductor devices, together with the advancement of high integration of semiconductor devices, it has become a pressing need to establish a new process technique which permits working of very fine patterns of, for example, 65 nm or less. For the working of fine patterns, a photolithography technique is required essentially. The photolithography technique at present uses an argon-fluorine (ArF) excimer laser of the wavelength of 193 nm as an exposure light source in order to assure an enhanced optical resolution thanks to a reduced wavelength of exposure light (illumination light) so as to be ready for very fine working.
A silicon semiconductor substrate is patterned usually using a photosensitive resist layer formed by coating on the surface of the silicon semiconductor substrate. However, where the reflectance of exposure light (illumination light) at the interface between the resist layer and the silicon semiconductor substrate which serves as a substrate for the resist layer is high, a standing wave is induced conspicuously in the resist layer. As a result, side faces of the resist layer patterned by development exhibit a concave and convex shape in accordance with the shape of the standing wave. Therefore, there is a problem that a pattern of a good rectangular shape cannot be formed on the resist layer. It is to be noted that a pattern formed on a resist layer is sometimes called resist pattern. For example, the reflectance where a resist layer having a refractive index of 1.70 is formed on the surface of a silicon semiconductor substrate using exposure light of a wavelength of 193 nm is a very high value of approximately 60% where the exposure light is incident perpendicularly to the resist layer.
In order to solve such a problem as described above, according to a conventional photolithography technique wherein exposure light of a wavelength of 193 nm is used, an antireflection film of a single layer is formed between the silicon semiconductor substrate and the resist layer. For example, where the complex refractive index is represented by N0 (where N0=n0-k0i), if an antireflection film of a thickness of 100 nm having such values as n0=1.75 and k0=0.30 is formed on the silicon semiconductor substrate and a resist layer having a refractive index of 1.70 is formed on the antireflection film, then the reflectance is reduced by a great amount to approximately 2% where the exposure light is incident perpendicularly to the resist layer.
A related technique is disclosed, for example, in Japanese Patent Laid-open No. 2001-242630 (hereinafter referred to as Patent Document 1) or Boontarika, Ozawa and Someya, Extended Abstracts (The 65th Meeting2004); The Japan Society of Applied Physics, 2p-R-9 (hereinafter referred to as Non-Patent Document 1).


A process and apparatus is provided for imparting linear motion to tooling. The tooling is attached to a manipulator device having two different length arms. The tooling may be moved linearly from a first point to a second point by adjusting the angles of the first and second arms for a number of intermediate points extending along a straight line between the first and second points and along which the tooling passes.

The present invention relates to robotic manipulator devices for effecting motion of associated tooling from one position to another. More specifically, the present invention relates to a process and apparatus for imparting linear motion of associated tooling from one position to another.
Robotic manipulator devices are used in industry to perform operations such as welding, assembling parts, material handling, deburring, palletizing, and the like. Typically, the robotic manipulator devices perform the above operations repetitively on a number of identical workpieces. Various types of tooling are coupled to the end of the manipulator devices to perform the desired operations described above.
Robotic manipulator devices having first and second arms of equal lengths are known in the art. Pivotable movement of the first arm is effected by a first motor and pivotable movement of the second arm, which is pivotally connected to the first arm, is effected by a second motor. A tool or workpiece holder is coupled to the distal end of the second arm. Oftentimes it is desirable to move the tool or workpiece holder along a linear path. For example, it may be required to move a workpiece along a straight-line path to load it within a workpiece holder. Movement of the tool or workpiece along a linear path can typically be accomplished by driving the two motors at generally the same speed, assuming the gearing used to transfer rotational motion from the first motor to the first arm is of the same ratio as the gearing used to transfer rotational motion from the second motor to the second arm.
Such a manipulator is oftentimes sufficient for performing most functions. However, if the manipulator is intended to be used in a work space or an enclosure having a vertical dimension which differs substantially from a horizontal dimension, it may contact one of the walls defining the work space or the enclosure as it moves to either its retracted-most position or its extended-most position. For example, if the enclosure has a horizontal dimension which is greater than the vertical dimension, the first arm may contact the upper-most wall of the enclosure when the device is moved to its retracted-most position.
It would be desirable to have a robotic manipulator device comprising first and second arms which is capable of moving within an enclosure having a horizontal dimension which differs from the vertical dimension and which is capable of moving along a straight-line path.

Process and apparatus for imparting linear motion to tooling attached to the end of a manipulator device having two different length arms


A system for autonomous decentralized control in which a client terminal and a center server are connected, as a network through a WAN and/or LAN, to a remote control server connected to a monitored/-controlled target device through a control communication network. The system is characterized in that a virtual machine, which is described as the other self of the monitored/controlled target device having the same information as that possessed by the monitored/controlled target device, and which is a software object having communication protocols used for communication with the monitored/controlled target device and concealed in the software object, is moved in the system with transparency and/or is held in the client terminal, the center server, or the remote control server.

Hitherto, to monitor and control various industrial devices, apparatuses, etc. located in a plurality of remote positions and to collect data measured using various measuring instruments, including electronic meters, it has been required to issue commands from a monitoring/-control center or a data collection center to instruct an industrial personal computer or general computer, which functions as a server computer installed in each site and operates in accordance with programs described in a special assembly language or the C language, to collect monitored/controlled data and to execute a control program for control of the controlled target device, etc., and to transmit the result of device operation, the monitored measurement data, etc. to the monitoring/-control center through radio wirelessly or via public telephone lines or dedicated lines.
In such a case, the monitoring/control center has issued commands to or has received data, etc. from the personal computers or the general computers, or the various measuring instruments installed in the plurality of remote positions through individual communications using radio or telephone connection each time an occasion requires.
Therefore, a system must have been constructed by resorting to specialized makers, expert persons, etc., who are well skilled in communication protocols and control programs, and software such as dedicated programs must have been developed. Those situations have resulted in a higher system price, a lower transmission rate of commands, data, etc., and an increased communication cost.

Remote control server, center server, and system constituted them


In a C-MOS type output circuit, desired connections between a P-MOS transistor and an N-MOS transistor are achieved without forming a third wiring layer. In a semiconductor integrated circuit device in which a group of P-MOS transistors and a group of N-MOS transistors are formed on a semiconductor substrate, in which the transistors are arranged with their channel length aligned with the direction in which free space is available within the semiconductor chip, and in which the transistors are connected in a predetermined manner with wiring patterns laid on the semiconductor substrate, a power source line and a ground line, each formed as a wiring pattern in a second wiring layer, each have a portion thereof separated from a remaining portion thereof by a circular groove so that an isolated wiring region is formed within each of the power source line and the ground line so as to be connected, by way of a via hole, to wiring patterns that are formed linearly and parallel to one another in a first wiring layer to connect between the group of P-MOS transistors and the group of N-MOS transistors.

1. Field of the Invention
The present invention relates to a semiconductor integrated circuit device, and particularly to a semiconductor integrated circuit device having a C-MOS (complementary metal-oxide semiconductor) type structure.
2. Description of the Prior Art
FIG. 5 illustrates a conventional semiconductor integrated circuit device 100 having a number of I/O (input/output) cells 90a, 90b, 90c, . . . , 90n formed therein. Each of such I/O cells typically has an output circuit in which a P-MOS transistor and an N-MOS transistor are connected in a C-MOS structure.
In this type of semiconductor integrated circuit device, in particular where very small transistors are formed as in an LSI chip, an increase in driving capacity is achieved by connecting a plurality of such CMOS structures in parallel as shown in FIG. 9. In FIG. 9, P1, P2, . . . , Pn represent P-MOS transistors; N1, N2, . . . , Nn represent N-MOS transistors; V.sub.DD represents a power source line; V.sub.SS represents a ground line; numeral 91 represents an output terminal.
Conventionally, two types of layout have been known for forming such an output circuit on a semiconductor substrate: the layout shown in FIG. 3 (a first conventional example) and the layout shown in FIG. 4 (a second conventional example). In FIG. 3, which shows the first conventional example, numeral 95 represents a wiring pattern, formed in a first wiring layer, that is connected to the source S1 of the P-MOS transistors by way of a contact hole 74 and connected to the source of the N-MOS transistors by way of a contact hole 84.
Numeral 96 represents another wiring pattern, also formed in the first wiring layer, that is similarly connected to the drain D1 of the P-MOS transistors by way of contact holes 75 and 76 and connected to the drain D1 of the N-MOS transistors by way of contact holes 85 and 86. Numeral 97 represents still another wiring pattern, also formed in the first wiring layer, that is connected to the source S2 of the P-MOS transistors by way of a contact hole 77 and connected to the source S2 of the N-MOS transistors by way of a contact hole 87.
Numeral 72 represents the gate electrode of the first P-MOS transistor, and numeral 73 represents the gate electrode of the second P-MOS transistor. On the other hand, numerals 82 and 83 represent the gate electrodes of the first and second N-MOS transistors, respectively. The power source line V.sub.DD and the ground line V.sub.SS are both formed as a wiring pattern in a second wiring layer.
In FIG. 4, which shows the second conventional example, the orientation of the transistors is different by 90 degrees as compared with the first conventional example. Numeral 101 represents a wiring pattern, formed in a third wiring layer, that serves to couple the P-MOS transistors with the N-MOS transistors. The power source line V.sub.DD and the ground line V.sub.SS are both formed as a wiring pattern in a second wiring layer. Numerals 102 to 106 represent wiring patterns formed in a first wiring layer.
When the number of transistors is increased to increase the driving capacity, the dimension WX shown in FIG. 3 that corresponds to the width of a single transistor needs to be multiplied by an integer. Whereas FIG. 3 shows a case where two transistors are formed on each of the P-MOS and N-MOS sides, FIG. 6A shows a case where six transistors are formed, a nd FIG. 6B shows a case where one more transistor is added thereto. Note that, for simplicity's sake, only the transistors on the P-MOS side are shown in FIGS. 6A and 6B. Here, the channel length of the transistors extends in the direction "X", and their channel width extends in the direction "Y".
In FIG. 6A, G1 to G6 represent the gate electrodes of the P-MOS transistors; that is, there are six P-MOS transistors. Here, addition of one more transistor is achieved, as shown in FIG. 6B, by increasing the number of transistors in the lateral direction. G7 represents the gate electrode of the added transistor.
However, as shown in FIG. 5, the size and shape of the I/O cells 90a to 90n are predetermined for each type of semiconductor integrated circuit device 100, and therefore, in most cases, it is simply impossible to increase the dimension XA any further. In such a case, in the first conventional example (FIG. 3), it is inevitable to increase the transistors in the direction "Y", as shown in FIG. 7. This, however, creates wasted space.
On the other hand, in the second conventional example (FIG. 4), where the channel length extends in the direction "Y" and the channel width extends in the direction "X", it is possible to increase the transistors efficiently in the direction "Y", as shown in FIG. 8. However, this second conventional example inconveniently requires a wiring pattern 101 (see FIG. 4) in a third wiring layer to connect the P-MOS side to the N-MOS side.

Wiring pattern for a semiconductor integrated circuit device


An integral thermo-press complex brassiere cup structure. The structure includes an external lining body, an internal lining body, a bag, a bag covering layer coupled on the surface of the bag made of a soft poor thermal conductor, and a material adhering layer disposed at the attaching surface of the internal and external lining bodies. The material adhering layer adheres the surface of the bag covering layer at an appropriate position between the internal and external lining bodies, and places both internal and external lining bodies into a high-temperature thermo-press mold for an integral molding process. The heat produced by the high-temperature mold is conducted through the internal and external lining bodies and delayed or blocked by the bag covering layer as to weaken the heat conducted to the bag.

1. Field of the Invention
The present invention relates to a brassiere cup, more particularly a complex brassiere cup structure worn by a female to beautify her figure.
2. Description of the Related Art
As social concepts become more liberal, women are getting more independent and have a more aggressive attitude to show off their figure with most of them being fastidious about their choice of underwear. To provide a variety of underwear products for female users, manufacturers are enthusiastic to pursue improvements and variations for the functions and artistic look of the underwear.
In recent years, brassiere designs tend to have centralized and lift-up support effects. Therefore, it is necessary to add padding bags to the structure of a brasserie and to use the padding bags to adjust the shape of female breasts to visually enhance the artistic look. to FIGS. 1 and 2 show the prior-art brassieres that comprise a fabric 11, 12 at the front and the back of a brassiere cup, foam layers 14, 14′ respectively disposed inside, a padding bag 13 disposed at an appropriate position between the front and back fabrics 11, 12, with the padding bag 13 being made of two pieces of tough plastic films 131 (where a PU material is commonly used for this purpose) and which is filled with a liquid 132 or air. An upper mold 3′ and a lower mold 3 are used for the high-temperature thermo-press molding process to produce a brassiere cup with a predetermined curvature.
Although a perfect centralized and lift-up support effect is accomplished after a woman wears this type of brassiere, there are still many technical problems of the manufacturing process that remain for manufacturers to overcome. Particularly, this type of brassiere cup makes use of a high temperature up to 200° C. for its press molding. Even with a padding bag 13 enclosed by two foam layers 14, 14′, the upper mold 3′ and the lower mold 3′ will not be in direct contact during the thermo-press manufacturing, since the plastic film 131 can stand only a temperature of about 150° C., and will be melted or cracked easily when the manufacturing temperature gets too high. In serious cases, the defective products are eliminated directly after the inspection during the manufacturing process; but for a slightly melted case, particularly the one filled with a liquid 132, the defect cannot be found immediately during the inspection. As a result, the liquid 132 will leak and taint other underwear during the transportation, or will make other clothes dirty during the laundry process. This definitely constitutes quite a negative impact on the quality control of a brassiere cup production. Therefore, a manufacturer's objective is to include finding a way to reduce the possibility of having the padding bag 13 deformed or melted in order to maintain the product quality, to maximize the manufacturing yield rate, and minimize the defective rate for the manufacturing process.

Integral thermo-press molding complex brassiere cup structure


A method and a system for automatically performing diagnostics of various operational parameters of digital video recorders, cameras, peripheral and associated components encompassing a video system, are provided. Script files are provided including diagnostic instructions, which are executed according to a schedule. The diagnostics for example include catalogue size verification, live working check for each camera, camera analysis of the image brightness and camera movement verification. Automated repair of the cameras is also possible. Preferably, the instructions are executed through an interface remotely interacting with the user control software of the cameras.

The influx of digital video recorders, either completely digital or hybrids, unto the marketplace has compounded the issues of the performance of video networks by giving the end users a false sense of security afforded by the remote connectivity nature of their machine's operation.
This is clearly indicated by the fact that those digital video recorders basically replace analog video recorders and are component, not system based solutions. As the wording would imply, a component-based solution rarely, if ever, looks at the whole of the components around its borders to properly integrate and produce results. A single component cannot control the quality and integrity of the devices connected to it. Stated simply, once the digital video recorder is installed, nothing will let the users know of current failures or give them the ability to automatically verify performance across their network of operations. In some cases, failures can only be discovered once an end user manually calls the remote site and requests an error file download. Another known method is to have the remote machine call into a central area once a failure is detected, such as a loss of video, which of course is only possible if the CPU, modems, and software are still able to perform such a task and if no generalized failure causes all machines to simultaneously connect to the central site and crash the communication links or any authenticating process.
Current digital video recorder solutions are not able to periodically and automatically send crucial pre-programmed centrally directed information so as to continuously adjust various functions, to elevate performance and to offer greater peace of mind. This commonly accepted operational philosophy actually renders the end user blind as to the performance levels of the multitude of recorders and associated devices over his network. Furthermore, the operator is unable to detect even minor deviation issues which can greatly affect image quality and output precision. These deviations can for example include a defaced camera where the image rendered is unacceptable, basic video data having color burst or missing or incorrect synch. The basic "video loss" detection methods employed in the industry are unable to react to such variations. This has a great impact on criminal case to be resolved in video security systems and also applies to video systems used for process control, automation and video monitoring as the image output depends solely on the healthy functionality of the video system, with no concrete and quantifiable verification of operation. The output precision and accuracy is a major factor in rendering identifiable images which can be used for case prosecution or any post analysis work.
The manual option of locating errors is not practical or even possible when a large number of machines must be verified. No known current technology can automatically detect, verify, align/adjust parameters and/or alert via multiple methods and levels. In addition, no prior art digital video recorder or system can report the complete sequence for evaluation or analysis regardless of the make of digital video recorder in use.
Some forms of monitoring or diagnostic of camera networks in general are known in the prior art. For example, published US patent application no. U.S. 2003/0081125 A1 (SHELDON et al.), concerns a system and method for monitoring and diagnosis of a video network's performance. The invention is particularly directed to a video conferencing system and provides a diagnosis node, ensuring proper transmission of video data from each device. It does not, however, address the question of proper working of the video devices of the network. U.S. Pat. No. 4,774,570 (ARAKI) concerns a system for processing video signals for detecting changes in video data. It belongs to the field of security monitoring systems including a network of cameras. An automatic analysis of the image recorded by the cameras is made to detect a change therein and therefore identify activity in the field of vision of the camera. Again, however, this invention is not related to diagnosis of the camera's proper functioning. U.S. Pat. No. 4,566,036 (KADOSAWA), U.S. Pat. No. 4,609,939 (KOZAWA et al.), U.S. Pat. No. 5,568,183 (CORTJENS et al.), U.S. Pat. No. 6,208,379 (OYA et al.) and US published patent applications nos. U.S. 2002/0171741 A1 (TONKIN et al.) and U.S. 2003/0206232 A1 (SUZUKI et al.), all relate to the positioning and control of cameras in a video network system.
None of the documents above provides for the diagnosis of components of a digital video recording network such as cameras, digital video recorders and peripheral devices, and for an automatic checking of their proper functioning. Such concepts are known for single cameras, such as taught by U.S. Pat. No. 5,274,446 (ASHIDA). ASHIDA provides a transmission apparatus with self-diagnostic capabilities. It is more particularly directed to television conference systems. It provides a camera apparatus which is not only capable of self diagnosis, but provides such information automatically and is also capable of recovery for a detected flaw if it occurs. Its working is based on image comparison between video signals acquired at different times. It does not however seem to mention the integration of such a camera in a digital video network. Similarly, U.S. Pat. No. 4,544,952 (PHAM VAN CANG), U.S. Pat. No. 4,608,593 (MIYAJI et al.), U.S. Pat. No. 4,901,147 (TAJIMA), U.S. Pat. No. 5,055,928 (KLINGELHOFER) and U.S. Pat. No. 5,778,008 (SHIMIZU et al.), all concern some form of diagnosis of a single camera device. However, these documents fail to teach how such diagnostic capabilities could apply in the context of a network of cameras or video recorders and associated devices.
In view of the above, there is therefore a need for a manner of providing automatic diagnostics and repair of digital video systems over a network which is practical and can be used for networks having a large number of cameras.

System and method for the automated, remote diagnostic of the operation of a digital video recording network


The invention is an apparatus and method for extending a cover for a golf cart. The invention is preferably configured for attachment to a support frame of a golf cart, wherein the support frame supports a roof for the golf cart. The apparatus includes a stationary main frame member, brackets for mounting the stationary main frame member to the golf cart, a movable frame member, and a cover. The stationary main frame member is suitable for receipt by the brackets, which are in turn mounted to the upper portion of the support frame and possibly to the roof of the golf cart. The movable frame member is operatively secured to the stationary main frame member, and configured to pivotably rotate over a portion of the rear compartment of the golf cart. The cover is configured for attachment to the movable frame member so that when the movable frame member rotates over a portion of the rear compartment of the golf cart, the cover covers a portion of the rear compartment of the golf cart.

Golfing is a popular pastime for many people of all ages. Golfers occasionally use a motorized golf cart to transport their golf equipment while playing golf. Many golf carts include a rear compartment into which a golf bag and clubs can be positioned during the use of a cart. Commonly, the rear compartment is uncovered, even if the cart includes a top section for covering the seating compartment of the cart. Hence, the golf bag and clubs positioned in the rear compartment of the cart are unprotected from weather, elements, or precipitation, such as rainfall. A golfer's grip on his clubs, and his game, can be adversely affected if the grips of his clubs become wet. Thus, it is desirable to protect a golfer's bag and clubs from weather precipitation while the bag and clubs are positioned in the rear compartment of the golf cart.
At least one type of cover attaches to conventional golf carts and provides protection to a golf bag and clubs positioned in a rear compartment of the golf cart. However, a user's access to other accessories in the rear compartment of the golf cart can be hindered by the positioning of the cover with respect to the cart. Thus, there is a need in the art for a golf cart cover that does not interfere with a user's access to the rear compartment of the cart, yet provides a cover for the rear compartment.
Yet another type of cover attaches directly to the roof of a golf cart. Unfortunately, this type of cover tends to sway back and forth relative to the golf cart, and has relatively little structural support. The movement of the golf cart, combined with occasional or steady winds, causes this type of cover to vibrate and shake, causing unpleasant noise, vibration, or otherwise potentially damaging clubs or other accessories carried in the rear compartment of the golf cart. Therefore, there is a need in the art to provide an attachment to a golf cart that has improved structural support.
In addition, it is preferable that the cover be easily and conveniently retrofitted to any conventional golf cart, or any newly designed golf cart. There is a need in the art to be certain that a suitable cover attachment is provided for many various golf cart designs. Further, as new cart models are devised, it is preferable that the cover be readily adapted to such new models.


A start-assist circuit for increasing the fuel-injection voltage during the startup of an internal combustion engine having fuel injectors, a starter solenoid, and a battery is provided. The boost circuit receives the battery DC power and then boosts the battery voltage to provide an output having a level sufficient for a fuel injection solenoid during the start process.

1. Field of the Invention
The present invention relates in general to internal combustion engines having fuel injectors and more particularly to circuitry for increasing the fuel injection solenoid voltage above that of the battery voltage during the starting process of such an engine.
2. Description of Related Art Including Information Disclosed Under 37 CFR 1.97 and 1.98
It is well known that starting an internal combustion engine can sometimes be difficult for engines that have fuel injectors which often run at fuel injector solenoid activation voltages greater than 13 to 14 volts as is typically provided by the battery. Since the amount of fuel provided to the engine may be determined by the voltage applied to the fuel injector solenoids, a fuel injector which may be required to deliver fuel demands necessitating up to a 40-volt input will be limited to the amount of fuel provided by a 13-to-14-volt input during the starting process. When the engine is running, a demand for fuel in excess of that provided by a 13-to-14-volt is not a problem since the engine alternator may provide an output of greater than 40 volts. However, during the starting process, the alternator, of course, does not generate sufficient output and the only power source generally available is the battery, which normally will have an output of 13 to 14 volts with minimal load and significantly less under the cranking load experienced during the starting process.
Therefore, it would be extremely advantageous to have a power source available during the startup of a fuel injected internal combustion engine which could provide a voltage output to the fuel injectors significantly higher than the battery voltage so that an effective charge of fuel could be provided to the cylinders of the internal combustion engine during the starting process.


A novel stent compression instrument is used for holding a stent therein during shipping to a hospital and for thereafter crimping the stent onto a balloon catheter. The stent compression instrument includes a body having a central bore; a flexible diaphragm having an axial lumen and mounted within the body central bore, thereby defining a chamber between the body and the diaphragm, and first and second sealing structures for providing seals at opposite ends of the chamber. The diaphragm is formed from a generally tubular, thin wall into which the stent is placed therein and is expandable under a negative pressure condition to expand within the body and compressible under pressure to crimp the stent onto a balloon catheter. Holding structure, which is formed from at least one thickened wall portion along the length of the diaphragm wall, is associated with the diaphragm for holding the stent therewithin and to prevent movement of the stent once positioned therewithin when the diaphragm is subjected to a negative pressure condition. In the preferred embodiment, positioning structure is provided which is formed from a thickened wall portion along the length of the diaphragm wall which is spaced from the holding structure, is also associated with the diaphragm for positioning the stent within the lumen and preventing the further axial movement of the stent relative to the lumen when the stent is placed therein.

This invention is directed to a novel stent holder/compression instrument for holding and properly positioning a stent therein, in which the stent can be positioned and held without handling by an operator. The present invention is further directed to a novel method for positioning a stent within the novel stent holder/compression instrument. This invention is further directed to a novel instrument which can be used to ship a stent to a hospital and thereafter be used to crimp the stent onto a balloon catheter.
In order to improve the effectiveness of vascular angioplasty in relieving blockage or repairing cardiovascular damage, an expandable stainless steel mesh stent of tubular configuration has been developed for vascular implantation. The mesh stent is used to prevent arteries from closing (restenosis) after vascular balloon angioplasty. The stent is introduced into the artery by a balloon catheter on which the stent has been previously crimped and the stent is then dilated against the vascular implantation site by expansion of the balloon catheter. Precisely locating, implanting and expanding the stent requires that it be securely carried on the balloon catheter for both transport to the implantation site and expansion by the balloon.
A stent compression instrument is disclosed in U.S. patent application Ser. No. 08/745,317 which is commonly owned by the assignee herein, and employs a thin, elastomeric tubular diaphragm inside a housing to exert uniform forces on a stent to compress the stent onto and around a balloon catheter. The disclosure of said prior application is incorporated herein by reference. A stent in a neutral expanded state is placed over a balloon section of a catheter. The tubular diaphragm within the housing is expanded and the stent and balloon catheter are placed inside the diaphragm of the compression instrument. As pressurization forces are applied to the diaphragm, the stent is compressed and collapsed until the stent is rigidly and uniformly affixed to the balloon catheter. The stent loaded catheter is now ready for use and subsequent expansion of the stent by the catheter during implantation. This method requires handling of both the stent and the balloon catheter during the attachment or crimping procedure.
Improved stents with a delicate coating which enhances and improves the stent's efficacy are currently being tested and considered for use. The coatings could be damaged, by touching for example, during this handling phase.
The present invention provides a novel stent holder/compression instrument and method for attaching an expandable stent to a balloon catheter which eliminates the handling of the stent by an operator during attachment. The present invention also provides a novel instrument which can be used to ship a stent to a hospital and thereafter be used to crimp the stent onto a balloon catheter. Other features and advantages of the present invention will become apparent upon a reading of the attached specification in combination with an examination of the drawings.


Alkyl-linked nucleotide non-homogeneous solid supports and nucleotide affinity media comprising an alkyl-linked nucleotide are provided. The linker is generally a hydrophobic linker that can be a 3, 4, 5, 6, 7, 8, 9, 10, or a longer carbon chain. Also included in the invention are methods for synthesis of an alkyl-linked nucleotide, nucleotide affinity media and methods of use thereof for affinity chromatography and screening methods.

Previous methods of preparing ligands, such as nucleotides, for use in affinity chromatography have typically coupled the nucleotide to a solid matrix through the N6 amino group on the purine ring, or via a hydroxyl group of the ribose moiety. However, these ligands are not always effective ligands for affinity chromatography, usually because of steric hindrance or the orientation of the ligand on the solid matrix. The studies of the molecular structures of some nucleotide binding proteins, such as kinases, support these findings.
Recently, in an alternative method, the nucleotide, adenosine triphosphate (ATP), was coupled to an affinity resin indirectly through the gamma-phosphate group of ATP via an aminophenyl moiety. Linking ATP to a resin via an aminophenyl group attached to the gamma-phosphate of ATP has advantages over earlier nucleotide affinity media.
However, a need still exists to develop a still more efficient method for synthesis of nucleotide affinity media that are suitable for use in affinity chromatography and screening methods.


The novel compounds of formula I: ##STR1## wherein A represents an optionally substituted 5- or 6-membered heteroaromatic group or an optionally substituted aryl group or a difluorobenzodioxolyl group;. B represents an optionally substituted cyclic hydrocarbon or thienyl, an alkyl, alkenyl or alkynyl group or independently has one of the meanings of A; PA1 n represents an integer from 0 to 2; PA1 R represents a hydrogen atom, a halogen atom, an optionally substituted alkyl, alkenyl, alkynyl, alkoxy, alkoxyalkyl, dialkoxyalkyl, alkoxyalkoxy, alkylthio, amino, alkylamino, dialkylamino or alkoxyamino group or a formamidino or cyano group; PA1 X.sub.1 and X.sub.2 independently represent an oxygen or sulphur atom, and the herbicidal use of these compounds.

Selective herbicidal compounds play an important role in agriculture and related fields. Growers seek herbicides that kill pest plants, but do not reduce crop yield. Although numerous selective herbicides have been described, there is nevertheless a considerable interest in new compounds having a superior or different activities, because the known herbicidal compounds either are not suitable for application in certain crops, or are not sufficiently selective.
Selective herbicides the active ingredients of which are pyrindine derivatives, and particularly 2,6-substituted pyridines, are known from EP0570293, EP0692474, EP0693490 and WO 94/22833. However, 2,6-disubstituted pyridine derivatives containing two or three additional substituents have not yet been described.

Herbicidal substituted pyridine compounds


A muffler-filter apparatus having a particulate trap using filter tubes with high temperature filter materials, like fiber in the form of yarn, woven yarn mat, or a non-woven, random array fiber mat, or various foams. Filter tubes have various structural configurations and are regenerated by axial propagation using ring heaters or stub rod heaters, by heating the entire length of the filter tube with a rod heater or some other full-length heater configuration. For regeneration, exhaust flow is bypassed using various valve configurations including a poppet valve, a shutter valve, or a tubular valve. Filter tube filters may also be self-regenerated by the heat from the exhaust gases as controlled by a throttle valve or on inclusion of fuel additives which lower particulate ignition temperature.

Particulate emissions (black smoke) from diesel engines is significant. Diesel particulate material strongly absorbs light and leads to degraded visibility, particularly when there are several diesel-engine vehicles in an area. Diesel particulate material furthermore is easily respirated and is consequently of concern since it potentially includes mutagenic and carcinogenic chemicals. As a result of these and other reasons, various levels of governments regulate particulate emissions from diesel engines.
In response to the need to reduce engine particulate emissions, vehicle and engine manufacturers are attempting both to develop engines which produce cleaner exhaust and to develop particulate trap systems which clean the exhaust before emission to atmosphere. The latter approach is relevant to the present invention. The latter approach in general uses a device known as a trap-oxidizer. A trap-oxidizer system generally includes a temperature resistant filter (the trap) from which particulates are periodically burned off (oxidized), a process commonly known as regeneration. The traps must be regularly regenerated so as not to become excessively loaded and create an undesirable back pressure thereby decreasing engine efficiency.
Possible traps for capturing diesel particulate emissions primarily include cellular ceramic elements (see U.S. Pat. No. 4,276,071) and catalytic wire-mesh devices (see U.S. Pat. No. 3,499,269).
Trap-oxidizer regeneration systems can be divided into two major groups primarily on the basis of control philosophy. One group is positive regeneration systems; the other group is self-regeneration systems. Positive regeneration systems include the use of a fuel-fed burner (see U.S. Pat. No. 4,167,852), use of an electric heater (see U.S. Pat. No. 4,851,015) or use of techniques which aim to raise the temperature of exhaust gas temperature at selected times (see U.S. Pat. No. 4,211,075). Self-regeneration systems are directed, for example, to the use of catalytic treated traps to lower the ignition temperature of the captured particulates.
Currently, a popular trap is one which uses a cellular ceramic element and a popular regeneration method is one which uses a face electric heater to initiate regeneration of the trap. Although such trap and method can serve the particulate cleaning purpose well, cellular ceramic elements are subject to failure by cracking due usually to heat gradients caused by uneven burns, and experience with cellular ceramic/electric heater systems also makes it clear that it would be a distinct advantage to have a system which reduced the requirements of vehicular supplied power. The present invention, in its various embodiments, provides improved performance in these areas.

Trap apparatus with tubular filter element