In order to improve linearlity of analog current outputs with respect to input digital codes in a D-A converter formed by a matrix array of unit current sources, respective current source cells forming the matrix are connected by analog ground wires (101 to 105 ) along respective rows. Analog ground wires (301, 302 ) connect left sides of the analog ground wires (102, 104) and right sides of the analog ground wires (101, 103, 105) to pads (41, 42 ) respectively, to ground the same. Thus, large-small relations of current distributions are reversed in respective rows, whereby influences by the current distributions are cancelled.

1. Field of the Invention
The present invention relates to a D-A converter, and more particularly, it relates to a current cell matrix DA converter which comprises a cell array arranged in the form of a matrix.
2. Description of the Background Art
FIG. 29 schematically illustrates a matrix of current source cells forming a part of a conventional current cell matrix D-A converter. Throughout the specification, the rows, i.e., the transverse lists of such a matrix are successively numbered starting with 1 from top to bottom. On the other hand, the columns, i.e., the vertical lists of the matrix are successively alphabetized starting from A from left to right. These numbers and symbols are encircled in the drawings. In order to specify one element of such a matrix, the number and symbol indicating its row and column are combined such as "1A" for the cell which is located on the upper left corner of the matrix, for example. Such combinations may also appear in the drawings.
Each of the current source cells 1A, 1B, . . . , 5D, 5E arranged in five rows and five columns comprises a unit current source 20 and a changeover switch 21. Referring to FIG. 29, these reference numerals appear only in relation to the current source cell 1A, for the purpose of simplification.
First ends of the unit current sources 20 are connected along the row direction by row-directionally extending analog source lines (analog ground wires) 101 to 105, and grounded by a column-directionally extending analog ground wire 300. Second ends of the unit current sources 20 are connected to first and second output terminals 31 and 32 through the changeover switches 21 and lead wires 201a to 205a and 201b to 205b respectively. The first and second output terminals 31 and 32 complementarily supply output currents to the exterior.
In the D-A converter having the aforementioned structure, the current source cells 1A, 1B, . . . , 5D, 5E drive the changeover switches 21 provided therein in response to input digital codes, to connect the unit current sources 20 to either one of the first and second output terminals 31 and 32. Thus, currents which are responsive to the input digital codes flow to the first output terminal 31, for D-A conversion.
FIG. 30 is a more simplified version of FIG. 29. In order to clarify the connection between the analog ground wires 300 and 101 to 105 and the lead wires 201a to 205a and 201b to 205b, the unit current sources 20 and the changeover switches 21 are omitted and the contours of the cells are shown in broken lines. In general, the analog ground wires 101 to 105 which are connected by the analog ground wire 300 are further connected to a pad 40 in common, to be grounded.
In the conventional current cell matrix D-A converter, however, the analog ground wires 101 to 105 connecting the first ones of the unit current sources provided in the current source cells are unidirectionally extracted toward the right side in FIGS. 29 and 30, for example, to be connected in common by the analog ground wire 300, and then connected to one or more pads provided in the same direction.
The unit current sources 20 are generally driven by a bias voltage which is supplied to all current source cells in common, to supply currents whose values depend on the bias voltage. When potentials in the analog ground wires 101 to 105 are distributed, therefore, the bias voltage so effectively fluctuates that the currents supplied from the output terminals 31 and 32 to the exterior are not necessarily an integral times those of the unit current sources 20.
For example, FIG. 31 shows an equivalent circuit around the cells 1A to 1E being connected by the analog ground wire 101, which is provided with a distributed resistance shown by ground wire resistances 14a to 14d. Due to such ground wire resistances 14a to 14d, potential distribution which is reduced from the cell 1A toward the cell 1E is caused in the analog ground wire 101.
Therefore, bias conditions for the unit current sources 20 are varied with the cells, and output currents of the unit current sources 20 are varied with the positions of the cells. Namely, current distribution which is increased from the cell 1A toward the cell 1E is caused as conceptually shown in the lowermost stage of FIG. 31.
If the analog ground wire 101 is grounded on its left side, on the other hand, potential distribution which is increased from the cell 1A toward the cell 1E is caused in the analog ground wire 101, while current distribution which is reduced from the cell 1A toward the cell 1E is caused as conceptually shown in the lowermost stage of FIG. 32.
This also applies to the cells which are column-directionally arranged. The analog ground wire 300 connects the analog ground wires 101 to 105 on the right side thereof, while the same is grounded on its lower part through the pad 40. Due to the distributed resistance caused in the analog ground wire 300, therefore, current distribution which is increased from the cell 1A toward the cell 5A is also caused in the column direction.
FIGS. 33A and 33B conceptually illustrates row-directional current distribution and column-directional current distribution, respectively. In practice, however, the unit current sources 20 are discretely provided in the respective cells, and states of current distribution are as shown in FIGS. 34A and 34B in correspondence to FIGS. 33A and 33B, respectively. Referring to FIGS. 341 and 34B, numerals shown in frames represent values of currents actually fed by the unit current sources 20 of the respective cells assuming that the unit current sources 20 feed currents of 5 when the ground wire resistances 14a to 14d are zero.
In the conventional D-A converter, the values of the currents fed by the unit current sources 20 differ from each other both in row and column directions, as hereinabove described. Thus, the actual analog outputs with respect to values represented by input digital codes are deteriorated in linearity with respect to ideal analog outputs.


A retainer board, holding a semiconductor wafer having a plurality of integrated circuit terminals for testing a semiconductor chip, is provided in confronting relation to a probe sheet having a plurality of probe terminals electrically connected to their corresponding integrated circuit terminals. An insulating substrate, having wiring electrically connected to the plural probe terminals, is provided on the probe sheet in opposed relation to the retainer board. An elastic member is interposed between the probe sheet and the insulating substrate. The retainer board and the probe sheet are brought into so closer relationship that each integrated circuit terminal of the semiconductor wafer held by the retainer board is electrically connected to its corresponding probe terminal of the probe sheet.

The present invention relates to a technology for simultaneously testing a plurality of integrated circuits formed on a semiconductor wafer in a wafer condition.
Advances in size reduction and cost reduction of recent electronic components incorporating semiconductor IC (integrated circuit) devices are so remarkable that requirements to the size reduction and cost reduction of the semiconductor IC devices are becoming more severe.
In general, a manufacturing of a semiconductor IC device is as follows. First of all, a semiconductor chip and a lead frame are electrically connected with each other by means of a bonding wire. Thereafter, the semiconductor chip is sealed by resin or ceramic and then mounted on a printed board. However, the requirements of reducing the size of an electronic component have introduced a method of directly mounting on a circuit board a semiconductor IC device in a bare chip or chip condition to guarantee quality at low cost. The bare chip or chip condition generally represents a condition of semiconductor IC device which is just cut off a semiconductor wafer.
In order to guarantee quality of bare chips, it is necessary to execute a burn-in screening of a semiconductor IC device in the wafer condition.
However, the burn-in screening of the semiconductor wafer is complicated in handling the semiconductor wafer; thus, the requirement to low cost could not be satisfied. Furthermore, executing the burn-in screening of the plural bare chips on a semiconductor wafer is time-consuming since it requires to execute the burn-in screening separately and repeatedly one by ene or group by group. Thus, in view of time and cost, it does not bring practical merits.
Accordingly, it is earnestly required to realize a simultaneous execution of the burn-in screening of all the bare chips in the wafer condition.
FIG. 32 is a schematic view showing a testing method of a semiconductor wafer using a conventional prober. As shown in FIG. 32, a semiconductor wafer 202 is fixed on a wafer stage 201 provided in the prober. A probe card 204, having probe needles 203, . . . ,203 made of for example tungsten, is disposed above the semiconductor wafer 202. These probe needles 203, . . . ,203 are brought into contact with IC terminals on the semiconductor wafer 202, so that an electric power voltage or signal can be supplied to the integrated circuit by means of a tester or the like to detect an output signal from the integrated circuit chip by chip. For testing the same kind of integrated circuits in a short time, a full automatic prober is normally used since it has an alignment function and is capable of automatically executing a measurement of chip one by one. In FIG. 32, a reference numeral 205 represents a wiring pattern and a reference numeral 206 represents an external electrode terminal.
Hereinafter, a conventional testing method of a semiconductor wafer using a full automatic prober will be explained with reference to FIGS. 32 and 33.
First of all, in a step SB1, the semiconductor wafer 202 is automatically transported from a wafer carrier onto the wafer stage 201. Next, in a step SB2, positioning of the semiconductor wafer 202 is carried out using a CCD camera or the like so that IC terminals on the semiconductor wafer 202 can be brought into contact with the probe needles 203, . . . 203. Then, in a step SB3, the wafer stage 201 is shifted below the probe card 204 so that the semiconductor wafer 202 is placed below the probe card 204.
Subsequently, in a step SB4, the probe needles 203, . . . ,203 are brought into contact with the IC terminals on the semiconductor wafer 202. An electric power voltage or signal is applied to the integrated circuit to measure an output signal from the integrated circuit, thereby executing a test of the integrated circuit. After finishing the test of one integrated circuit, the wafer stage 201 is shifted to the next integrated circuit. Then, the probe needles 203, . . . ,203 are brought into contact with the terminals of the next integrated circuit to execute a measurement of the next integrated circuit.
According to the conventional testing method of a semiconductor wafer using a full automatic prober, a plurality of integrated circuits on the semiconductor wafer 202 are successively measured in the manner above-described. When the test of all the integrated circuits is completed, the semiconductor wafer 202 is returned from the wafer stage 201 to the wafer carrier in a step SB5. For a plurality of semiconductor wafers 202, . . . ,202, above-described steps are repeatedly executed to accomplish a measurement of each semiconductor wafer 202. When the measurement of all the semiconductor wafers 202 is finished, operation of the full automatic prober ends.
A method of shortening a test time per chip would be, for example, to provide a self test circuit (i.e. BIST circuit) to execute the burn-in screening (high-speed operation) of memories such as DRAM by means of a prober.
Executing the burn-in screening processing in the wafer condition according to the previously-described testing method of a semiconductor wafer using a prober would require a time not longer than 1 minute in total for the shifting of the semiconductor wafer 202 in the procedures of the steps SB1, SB3 and SB5 and the positioning of the semiconductor wafer 202 in the step SB2. However, the burn-in screening in the step SB4 usually requires several to several tens hours. The conventional testing method of a semiconductor wafer using a prober is disadvantageous in that it necessitates to test semiconductor wafers one by one. Accordingly, it takes an extremely long time to test a great amount of semiconductor wafers. This will results in a huge increase of cost for manufacturing an LSI chip.
Another disadvantage of the testing operation using an automatic prober is an exclusive usage of the probe during tests, because the alignment function cannot be used for tests for other kinds of semiconductor wafers or other purposes.
Providing a BIST circuit for shortening a test time per chip, applied to DRAM or the like, leads to an increase of a chip area and reduces the number of chips per wafer, thus causing a problem of increasing chip cost.
To execute the burn-in screening of bare chips at a time in the wafer condition, it is necessary to simultaneously apply an electric power voltage or signal to a plurality of chips formed on the same wafer, to operate all of these plural chips. To this end, it will be necessary to prepare a probe card having numerous probe needles (e.g. several thousands or more). However, the conventional needle type probe card cannot meet such a need in view of great number of pins and cost increase.
Proposed to solve such a problem is a thin film type probe card having bumps on a flexible substrate (Refer to Nitto Technical Reports Vol. 28, No. 2 (October 1990) PP. 57-62)
Hereinafter, the burn-in screening using a flexible substrate with bumps will be explained.
FIGS. 34(a) and 34(b) are cross-sectional views illustrating the probing condition when a flexible substrate with bumps is used. In FIGS. 34 (a) and 34(b), a reference numeral 211 represents a probe card which comprises a polyimide substrate 218, a wiring layer 217 formed on the polyimide substrate 218, bump electrodes 216, . . . ,216, and a through hole wiring connecting the wiring layer 217 and the bump electrodes 216, . . . ,216.
As illustrated in FIG. 34(a), the probe card 211 is pushed against a semiconductor wafer 212 serving as a tested substrate so that a pad 215 on the semiconductor wafer 212 is electrically connected to a corresponding bump 216 of the probe card 211. If testing condition is in a room temperature, a test will be feasible in this condition by simply applying an electric power voltage or signal to the bump 216 via the wiring layer 217.
However, a diameter of the semiconductor wafer 212 possibly increases up to, foe example, 6 inches in the probing using the conventional probe card 211, causing deflection of the semiconductor wafer 212 and/or unevenness in height of the bump 216 which lead to a first problem of making some of electrical connections useless between the bumps 216, . . . ,216 and the pads 215, . . . ,215.
The burn-in screening generally requires a step of increasing the temperature of the semiconductor wafer 212 to execute temperature acceleration. FIG. 34(b) shows a cross-sectional structure of the semiconductor wafer 212 heated from the room temperature 25.degree. C. to 125.degree. C. In FIG. 34(b), the left-hand portion shows condition of a center of the semiconductor wafer 212, while the right-hand portion shows condition of a periphery of the semiconductor wafer 212.
Polyimide constituting the polyimide substrate 218 has a thermal expansion coefficient larger than that of silicon constituting the semiconductor wafer 212. (More specifically, the thermal expansion coefficient of polyimide is 16.times.10.sup.-6 /.degree. C., while the thermal expansion coefficient of silicon is 3.5.times.10.sup.-6 /.degree. C.) Thus, dislocation between the bump 216 and its corresponding pad 215 is found at the peripheral portion of the semiconductor wafer 212. More specifically, if the semiconductor wafer 212 of 6 inches and the probe card 211 are aligned in position at a room temperature and then heated to 100.degree. C., the probe card 211 will cause a thermal expansion of 160 .mu.m while the semiconductor wafer 212 will cause a thermal expansion of 35 .mu.m. In other words, a dislocation between the pad 215 and the bump 216 will increase up to an approximately 125 .mu.m at the outermost periphery of the semiconductor wafer 212. Such a dislocation due to difference of thermal expansion is so serious that electrical connection between the pad 215 and its corresponding bump 216 cannot be maintained in the peripheral region of the semiconductor wafer 212.
As explained above, according to the conventional burn-in screening, the semiconductor wafer is heated during the burn-in screening. The probe card brought into contact with the semiconductor wafer is also heated. Thus, difference of thermal expansion coefficients between the semiconductor wafer and the probe card causes a serious dislocation therebetween, resulting in a second problem that electrical connection between a pad and its corresponding bump cannot be maintained at the periphery of the semiconductor wafer.
To execute the burn-in screening of bare chips in the wafer condition, it is necessary to operate each bare chip by simultaneously applying an electric power voltage or signal to a plurality of bare chips formed on a single semiconductor wafer. However, supplying an electric power voltage or signal to each bare chip independently is not practical in view of cost since the number of wiring patterns exclusively formed on the semiconductor wafer increases up to several thousands or several tens thousands. To reduce the number of independently or exclusively provided wiring patterns, it is necessary to commonly use the wiring patterns as many as possible.
However, if extraordinary current flows through one bare chip connected to such a common wiring pattern, adverse effect of extraordinary current will spread to other bare chips associated. Thus, it becomes impossible to execute an ordinary burn-in screening.
Accordingly, in executing the burn-in screening, it is necessary to electrically remove such an extraordinary bare chip from the common wiring pattern.
Hereinafter, a method disclosed in the Unexamined Japanese Patent Application No. HEI 1-227467/1989 will be explained as one example of the burn-in screening of bare chips in the wafer condition.
FIG. 35 shows one of plural bare chips formed on a semiconductor wafer. In FIG. 35, a reference numeral 240 represents a bare chip, a reference numeral 243 represents an electric power source pad of the bare chip 240, a reference numeral 244 represents a GND pad of the bare chip 240, a reference numeral 241 represents a burn-in electric power source pad, and a reference numeral 242 represents a P-channel type transistor. The transistor 242 has a drain connected to the burn-in electric power source pad 241 and a source connected to the electric power source pad 243. Furthermore, in FIG. 35, a reference numeral 245a represents a first pad connected to the gate of transistor 242, and reference numerals 245b and 245c represent second and third pads respectively connected to the first pad 245a via a thin aluminum pattern of, for example, 3 um width. A first resistance 246a is interposed between the GND pad 244 and the second pad 245b. This first resistance 246a has a relatively low resistant value (e.g. 10 k.OMEGA.). A second resistance 246b is interposed between the burn-in electric power source pad 241 and the third pad 245c. This second resistance 246b has a relatively high resistant value (e.g. 100 k.OMEGA.).
First of all, before a burn-in screening, a wafer test is executed by probing electric power source pad 243, GND pad 244, first to third pads 245a-245c using a stationary probe needle (not shown) connected to an external measurement device (not shown). The external measurement device applies an electric power voltage to the electric power source pad 243 and applies a GND voltage to the GND pad 244. Furthermore, the first pad 245a is given an "H" level signal. As the transistor 242 is in an OFF condition under such a condition, no current flows between the electric power source pad 243 and the burn-in pad 241. Thus, a test of the bare chip 240 is feasible.
When the bare chip 240 is found to be a non-defective as a result of the test of the bare chip 240, the next bare chip is subsequently tested. On the contrary, if the bare chip 240 is found to be a defective, the external measurement device supplies large current (e.g. 100 mA) between the first pad 245a and the second pad 245b to fuse the shin aluminum pattern interposed between the first pad 245a and the second pad 245b before going on a test of the next bare chip.
By doing the wafer test in this manner before the burn-in screening, the burn-in screening can be effectively carried out. More specifically, when the burn-in electric power source pad 241 is applied an electric voltage in the burn-in screening, the transistor 242 is turned on in the case the bare chip 240 is found a non-defective in the wafer test because the gate voltage of the transistor 242 becomes an "L" level due to existence of the second resistance 246b having a resistant value larger than that of the first resistance 246a. Thus, the burn-in voltage is supplied to the electric power source pad 243 through the transistor 242. On the other hand, the thin aluminum pattern between the first pad 245a and the second pad 245b is fused off in a case the bare chip 240 is found a defective in the wafer test. Therefore, the gate voltage of the transistor 242 becomes an "H" level, and the transistor 242 is turned off. Thus, the burn-in voltage is not supplied to the electric power source pad 243, preventing electric current from flowing through the defective bare chip 240.
As described above, electric power source current is surely prevented from flowing through the defective chip even if an electric voltage is applied to the burn-in electric power source pad 241. Hence, adverse effect is not given to the non-defective chips in the burn-in screening.
However, above-described arrangement requires to form on each bare chip 240 excessive elements such as transistor 242, first and second resistances 246a, 246b, burn-in electric power source pad 241, first to third pads 245a-245c and aluminum pattern acting as a fuse. Furthermore, an electric voltage is applied through the transistor 242 in the burn-in screening and, therefore, an electric voltage applied to the burn-in electric power source pad 241 is not directly applied to the internal electric power source. Thus, a third problem arises in that a significant voltage drop is induced in the bare chip 240.

Semiconductor wafer package, method and apparatus for connecting testing IC terminals of semiconductor wafer and probe terminals, testing method of a semiconductor integrated circuit, probe card and its manufacturing method

Matsushita Electric Industrial Co., Ltd.


In a network device for setting a configuration definition remotely, a storage generates, upon changing a first (current) IP address to a second IP address, a virtual address which holds the second IP address, a message transceiver transmits a response request message whose source IP address is the second IP address, and a configuration definition setting portion changes the first IP address to the second IP address when the response message for the request is received.

1. Field of the Invention
The present invention relates to a network device, and in particular to a network device in which setting a configuration definition is remotely performed.
Together with a recent highly developed communication technology, a network device configuring a network has been provided with various functions supporting a VLAN network or the like, and has become more and more complicated and sophisticated. In many cases, a setting operation for making the network device support a predetermined VLAN network, namely a setting operation of a configuration definition is remotely performed from a terminal. In such a setting operation, it is important to hold a connection of a setting operation path between the network device and the terminal.
2. Description of the Related Art
As an example of a prior art network device, a router can be mentioned for connecting a LAN structured in a small office/home office (SOHO) or the like to an IP network. This router is provided with an operational key and an indicator, and by using these operational key and indicator, sets communication conditions, starts up communication confirmation, makes reference to fault information and the like (see e.g. patent documents 1 and 2).
However, since numerous relevant network devices generally exist, the setting of the network device is not performed on the site of each network device, but is remotely performed from the terminal through a setting operation path. For setting the network device in the IP network, for example, a remote setting operation by using a Telnet connection is general.
For this remote setting operation, a connectivity at an IP level is required between the network device and a setting terminal. In the absence of the connectivity, the network device becomes inaccessible from the setting terminal.
[Patent document 1] Japanese Patent Application Laid-open No. 11-98170 (page 2, FIG. 3)
[Patent document 2] Japanese Patent Application Laid-open No. 11-98171 (page 2, FIG. 3)
A reachability being lost at the IP level between the network device and the terminal during the remote setting operation from the setting terminal is caused by the following error settings (1) and (2):    (1) Error setting of an IP address as a configuration definition (IP address of management VLAN in case of L2 device);    (2) Error setting of a VLAN of a port to which a setting terminal belonging to a management VLAN is connected as a configuration definition (VLAN environment of L2 device).
When the error setting (1) or (2) occurs, the remote setting operation from the terminal is disabled, so that a setting operation by a console connection becomes necessary at a site where the network device is installed.

Network device for remote setting operations


A method and apparatus are described that permit an analyte concentration to be estimated from a measurement in the presence of compounds that interfere with the measurement. The method reduces the error in the analyte concentration in the presence of interferents. The method includes the use of a set of measurements obtained for a large population having a range of known analyte and interfering compound concentrations. From a sample measurement, which may or may not be one of the population, likely present interferents are identified, and a calibration vector is calculated.

1. Field of the Invention
Certain embodiments disclosed herein relate to a method and apparatus for determining the concentration of an analyte in a sample, and more particularly to a method and system that minimize the error in determining the analyte concentration due to the presence of sample components that interfere with the analyte measurement.
2. Discussion of the Background
Spectroscopic analysis is a powerful technique for determining the presence of one or more analytes in a sample by monitoring the interaction of light with the sample. Examples of spectroscopic measurements include, but are not limited to, the determination of the amount of light transmitted, absorbed, or scattered from a sample at one or more wavelengths. Thus, for example, absorption analysis includes determining the decrease in the intensity of light transmitted through a sample at one or more wavelengths, and then comparing the change in intensity with an absorption model based, for example, on Beer's law.

Method and apparatus for determining an analyte concentration in a sample having interferents


The present invention provides tumor necrosis factor and apoptosis ligand-related leukocyte-expressed ligand 1 receptor (TALL-1R) polypeptides and nucleic acid molecules encoding the same. The invention also provides selective binding agents, vectors, host cells, and methods for producing TALL-1R polypeptides. The invention further provides pharmaceutical compositions and methods for the diagnosis, treatment, amelioration, and/or prevention of diseases, disorders, and conditions associated with TALL-1R polypeptides.

Technical advances in the identification, cloning, expression, and manipulation of nucleic acid molecules and the deciphering of the human genome have greatly accelerated the discovery of novel therapeutics. Rapid nucleic acid sequencing techniques can now generate sequence information at unprecedented rates and, coupled with computational analyses, allow the assembly of overlapping sequences into partial and entire genomes and the identification of polypeptide-encoding regions. A comparison of a predicted amino acid sequence against a database compilation of known amino acid sequences allows one to determine the extent of homology to previously identified sequences and/or structural landmarks. The cloning and expression of a polypeptide-encoding region of a nucleic acid molecule provides a polypeptide product for structural and functional analyses. The manipulation of nucleic acid molecules and encoded polypeptides may confer advantageous properties on a product for use as a therapeutic.
In spite of the significant technical advances in genome research over the past decade, the potential for the development of novel therapeutics based on the human genome is still largely unrealized. Many genes encoding potentially beneficial polypeptide therapeutics or those encoding polypeptides, which may act as "targets" for therapeutic molecules, have still not been identified. Accordingly, it is an object of the invention to identify novel polypeptides, and nucleic acid molecules encoding the same, which have diagnostic or therapeutic benefit.
The isolation of nucleic acid sequences encoding tumor necrosis factors (TNFs) α and β led to the identification of a superfamily of TNF cytokines that includes fas ligand (FasL), CD27 ligand (CD27L), CD30 ligand (CD30L), CD40 ligand (CD40L), TNF-related apoptosis-inducing ligand (TRAIL, also designated as AGP-1), osteoprotegerin binding protein (OPG-BP or OPG ligand), 4-1BB ligand, LIGHT, APRIL, and TALL-1 (also designated as BAFF, THANK, BlyS, and zTNF4). See Smith et al., 1994, Cell 76:959-62; Lacey et al., 1998, Cell 93:165-76; Chichepotiche et al., 1997, J. Biol. Chem. 272:32401-10; Mauri et al., 1998, Immunity 8:21-30; Hahne et al., 1998, J. Exp. Med. 188:1185-90; Shu et al., 1999, J. Leukocyte Biology 65:680-83. The members of this ligand family are unified by their structure, particularly at the C-terminus, and expression in immune compartments (Smith et al., 1994). Furthermore, with the exception of LT-α, all of the members of this family are type II transmembrane proteins, characterized by a conserved 150 amino acid region within the C-terminal extracellular domain, which folds into a characteristic β-pleated sheet sandwich and trimerizes. This conserved region can be proteolyticaly released, thus generating a soluble functional form (Banner et al., 1993, Cell 73:431-45).
Many members within this ligand family are expressed in lymphoid enriched tissues and play important roles in the immune system development and modulation (Smith et al., 1994). For example, TNFα, which is mainly synthesized by macrophages, has been shown to be an important mediator for inflammatory responses and immune defenses (Tracey and Cerami, 1994, Annu. Rev. Med. 45:491-503). Fas-L, which is predominantly expressed in activated T cells, has been shown to modulate TCR-mediated apoptosis in thymocytes (Nagata and Suda, 1995, Immunology Today 16:39-43; Castrim et al., 1996, Immunity 5:617-27). CD40L, which is also expressed in activated T cells, provides an essential signal for B cell survival, proliferation, and immunoglobulin isotype switching (Noelle, 1996, Immunity 4:415-19).
The cognate receptors for most of the TNF ligand family members have been identified. These receptors share characteristic multiple cysteine-rich repeats within their extracellular domains, and do not possess catalytic motifs within cytoplasmic regions (Smith et al., 1994). The receptors signal through direct interactions with death domain proteins (e.g., TRADD, FADD, and RIP) or with the TRAF proteins (e.g., TRAF2, TRAF3, TRAF5, and TRAF6), triggering divergent and overlapping signaling pathways, e.g., apoptosis, NF-B activation, or JNK activation (Wallach et al., 1999, Ann. Rev. Immunol. 17: 331-67). These signaling events lead to cell death, proliferation, activation, or differentiation. The expression profile of each receptor member varies. For example, while TNFR1 is expressed in a broad spectrum of tissues and cell types, the cell surface receptor for OPGL is mainly restricted to the osteoclasts (Hsu et al., 1999, Proc. Natl. Acad. Sci. U.S.A. 96:3540-45).
The TNF family ligand TALL-1 is a type II transmembrane protein that is produced by cells of myeloid origin. TALL-1 is known to bind to two other members of the TNFR family: transmembrane activator and calcium modulator and cyclophilin ligand interactor (TACI) and B cell maturation antigen (BCMA). It is an object of the invention to identify nucleic acids encoding a receptor for TALL-1. Since TALL-1 is believed to play a role in inflammatory and immune processes, TALL-1R molecules would have wide application in the medical arts, particularly in treating autoimmune and inflammatory disorders.

TALL-1 receptor molecules and uses thereof


When encoding/decoding a current block of a current picture using intra block copy (“BC”) prediction, the location of a reference block is constrained so that it can be entirely within an inner search area of the current picture or entirely within an outer search area of the current picture, but cannot overlap both the inner search area and the outer search area. In some hardware-based implementations, on-chip memory buffers sample values of the inner search area, and off-chip memory buffers sample values of the outer search area. By enforcing this constraint on the location of the reference block, an encoder/decoder can avoid memory access operations that are split between on-chip memory and off-chip memory when retrieving the sample values of the reference block. At the same time, a reference block close to the current block may be used for intra BC prediction, helping compression efficiency.

Engineers use compression (also called source coding or source encoding) to reduce the bit rate of digital video. Compression decreases the cost of storing and transmitting video information by converting the information into a lower bit rate form. Decompression (also called decoding) reconstructs a version of the original information from the compressed form. A "codec" is an encoder/decoder system.
Over the last 30 years, various video codec standards have been adopted, including the ITU-T H.261, H.262 (MPEG-2 or ISO/IEC 13818-2), H.263, H.264 (MPEG-4 AVC or ISO/IEC 14496-10), and H.265 (HEVC or ISO/IEC 23008-2) standards, the MPEG-1 (ISO/IEC 11172-2) and MPEG-4 Visual (ISO/IEC 14496-2) standards, and the SMPTE 421M (VC-1) standard. More recently, various extensions to the H.265 standard (e.g., for scalable video coding/decoding, for coding/decoding of video with higher fidelity in terms of sample bit depth or chroma sampling rate, for screen content) have also been adopted. A video codec standard typically defines options for the syntax of an encoded video bitstream, detailing parameters in the bitstream when particular features are used in encoding and decoding. In many cases, a video codec standard also provides details about the decoding operations a decoder should perform to achieve conforming results in decoding. Aside from codec standards, various codec formats such as VP8, VP9, and AV1 (currently under development) define other options for the syntax of an encoded video bitstream and corresponding decoding operations.
Intra block copy ("BC") is a prediction mode in the H.265 standard. An intra BC prediction mode is also under consideration for the AV1 format. For intra BC prediction, the sample values of a current block of a picture are predicted using previously reconstructed sample values of a reference block in the same picture. A block vector ("BV") value indicates a displacement from the current block to the reference block in the same picture. The BV value can be signaled in the bitstream. In particular, intra BC prediction can be effective for encoding screen content.
In intra BC prediction mode for the H.265 standard, a reference block is allowed to be anywhere in previously reconstructed content in the same picture, even right next to the current block. This can make intra BC prediction mode very effective in terms of lowering bit rate and improving quality, since a nearby reference block may closely match the current block. In hardware implementations of intra BC prediction mode for the H.265 standard, however, memory access operations for a reference block can be slow and inefficient. A hardware-based encoder or hardware-based decoder typically stores sample values in fast "on-chip" memory (such as a fast cache) during reconstruction of those sample values, when the sample values are accessed frequently. Because size of the on-chip memory is limited, the hardware-based encoder/decoder eventually transfers a batch of reconstructed sample values to slower "off-chip" memory (such as dynamic random access memory). In the off-chip memory, the reconstructed sample values may still be accessed for intra BC prediction mode or other prediction, but memory access operations are slower. In particular, in hardware implementations of intra BC prediction mode for the H.265 standard, memory access operations can be slow and inefficient when one part of a reference block (close to the current block) is stored in on-chip memory but the rest of the reference block (further from the current block) is separately stored in off-chip memory.
In contrast, in some current implementations of intra BC prediction mode for the AV1 format, a reference block is constrained to be outside a "superblock" that includes the current unit being encoded/decoded with intra BC prediction, or the reference block is constrained to be outside the superblock that includes the current unit and also outside the previous superblock. With such a constraint on locations of reference blocks, intra BC prediction is more "hardware friendly"—slow, inefficient memory access operations can be avoided in hardware implementations—but intra BC prediction may be less effective in terms of lowering bit rate and improving quality.

Constraints on locations of reference blocks for intra block copy prediction


Despite the frangibility of additive-free granules of brominated anionic styrenic polymer, pellets of unadulterated brominated anionic styrenic polymer are provided having 50 wt % or more bromine content, in which 70 wt % or more of the pellets are retained on a US No. 40 sieve and no more than 30 wt % are retained on a US No. 5 sieve. These pellets contain no binding agent and they do not break apart or revert to small particles and finely divided powder, typically called “fines” when subjected to ordinary handling. More specifically, no more than about 5 wt %, preferably no more than about 3 wt %, and more preferably no more than about 1 wt % of these pellets as formed and packaged are fines or dusts that can pass through a US No. 40 sieve.

Brominated anionic styrenic polymers are excellent flame retardants. Very desirable methods for preparing such polymeric flame retardants are described in U.S. Pat. Nos. 5,677,390; 5,686,538; 5,767,203; 5,852,131; 5,916,978; and 6,207,765.
A characteristic of brominated anionic styrenic polymers such as brominated anionic polystyrene is its propensity to form substantial amounts of small particles and powders when attempts are made to pelletize the product. It appears that upon formation the pellets, unless bound together by an extraneous binding agent or the like, tend to break apart and to revert to small particles and finely-divided powder, typically referred to as "fines". Because of this characteristic, various conventional pelletizing procedures are unsuitable for producing brominated anionic styrenic polymers essentially free of fines. As can be readily appreciated, the existence of fines in a product of this type this is not only detrimental to the appearance of the pelletized product but in addition is undesired by the consumer.
In order to effectively use brominated anionic styrenic polymers as flame retardants in certain thermoplastic polymers, the use of binding agents or other extraneous materials to maintain the integrity of the flame retardant in pelletized form, is also deemed undesirable by the consumer. Thus, there is a need for a way of producing unadulterated pelletized brominated anionic styrenic polymers that do not form undesirable amounts of fines during their preparation and packaging.

This patent is subject to a terminal disclaimer.

Pelletized brominated anionic styrenic polymers and their preparation and use


Techniques and solutions are described for compressing data and facilitating access to compressed data. Compression can be applied to proper data subsets of a data set, such as to columns of a table. Using various methods, the proper data subsets can be evaluated to be included in a group of proper data subsets to be compressed using a first compression technique, where unselected proper data subsets are not compressed using the first compression technique. Data in the data set can be reordered based on a reordering sequence for the proper data subsets. Reordering data in the data set can improve compression when at least a portion of the proper data subsets are compressed. A data structure is provided that facilitates accessing specified data stored in a compressed format.

Software applications, particularly enterprise level software applications, often are desired to access enormous volumes of data. Storing such data can be problematic, particularly if it is desired to store the data in a format that can be quickly processed by a computer, such as storing the data in RAM. Various compression techniques have been developed for storing data, both in primary memory, such as RAM, or in secondary storage, such as disk-based technologies.
As a particular example, it is typically desired that OLAP database applications be able to process extremely large volumes of data quickly. Some database systems, such as SAP HANA, of SAP SE, of Walldorf, Germany, use in-memory column-store techniques. In a column-store database, data is maintained in storage in column format, where each column contains data for that column for multiple rows, as opposed to storing data on a row-by-row basis, where data for multiple columns is stored for each row, in a row-store database. Column-store databases can be useful, including because they can take advantage of compression techniques such as dictionary compression and run-length encoding. However, due to large data volumes, and other issues involving compressed data, such as being able to locate particular data values quickly, improved compression techniques and techniques for managing and accessing compressed data are still of significant interest.


A pressurized gas system controls a gas flow from one or more gas pressure storage vessels by means of an electronically controlled electro-mechanical shut-off valve located in close proximity to each of the vessels. The shut-off valves are electrically wired to actuation switches on the control panel. Pressure transducers mounted on each vessel provide a signal output which is electrically connected to a digital numeric display located on the control panel so that the pressure of each vessel can be monitored. Gas flow from the vessels is controlled by means of the electric shut-off valves operated from the control panel. A pressure regulator at the air access station controls the final output pressure delivered to the tool or personnel air bottle.

Rescue type vehicles such as fire trucks often carry a supply of compressed air which is contained in a bank of pressurized vessels or cylinders. The compressed air cylinders are housed on the vehicle in a remote storage compartment. Pressurized lines run from each cylinder to a panel of pressure gauges and controls usually located on the side of the truck. The cylinders are plumbed in parallel and have feed lines which run to a compressed air station on the truck adjacent the control panel. Rescue personnel carry backpack mounted air bottles which supply their individual personal breathing apparatus. As these air bottles become depleted, they are refilled at the truck compressed air station. The compressed air is also used to power hand tools and for other purposes.
Pressure of the supply cylinders on the fire truck is monitored by the gauges on the control panel. As the compressed air is used, the cylinders are switched from one to another in a cascade fashion as the pressure in each cylinder drops below a given point to ensure that the fill station is at all times provided with air of sufficient quantity and pressure. Manual valves on the control panel are turned to release air from each cylinder as needed. The problem with this arrangement is that each supply cylinder has a separate live air hose running to a gauge on the control panel and then lines to the air station. This system uses a great deal of air hose plumbing which takes up space, adds weight, and requires constant maintenance since leaks may develop in the myriad of air lines which travel to and from the supply cylinders to the control panel and then from the control panel to the fill station. This is detrimental to the fire truck in which space and weight are at a premium. Reliability is also of paramount importance for rescue vehicles. There is therefore a need in the art of rescue vehicles for a more efficient, compact, lighter weight, and more reliable system for monitoring, regulating, and delivering air from the reservoir tanks to the compressed air access station.

Vehicle mounted compressed air distribution system


A belt scale calibration system for calibrating a belt scale that is mounted with respect to a conveyor belt. The belt scale calibration system includes a load inducing assembly and a load induced assembly. The load inducing assembly engages the conveyor belt proximate to the belt scale. The load induced assembly is operably connected to the load inducing assembly. Applying a force to the load induced assembly produces a force on the load inducing assembly which the load inducing assembly transmits to the conveyor belt for calibrating the belt scale.

The present invention relates generally to a system for calibrating scales. More particularly, the present invention relates to a system for calibrating belt scales.
In conjunction with the sale of many types of bulk materials, it is necessary to weigh the bulk materials to ensure the accuracy of the amount of bulk materials being sold. When very large amounts of bulk materials are sold, such as in ore mining operations, it is typically not possible to place the bulk materials onto a stationary scale for weighing. Conveyor belt scales have been developed for these circumstances that permit the bulk materials to be weighed as the bulk materials are transported on a conveyor belt.
When belt scales are used, it is typically necessary to perform periodic calibrations of the belt scale to ensure that the weight indicated by the belt scale is actually correct. In certain industries, calibration of belt scales is required by law.
One technique for calibrating a conveyor belt scale involves passing a known amount of material over the conveyor belt scale to verify the accuracy of the conveyor belt scale. To verify the accuracy of the belt scale at various weights, it is necessary to run several tests at multiple weights.
One common method of calibrating conveyor belt scales involves placing an accurately weighted length of a roller chain on the conveyor belt and then passing the roller chain over the belt scale. One drawback of this technique is that the weight of the roller chain cannot be varied. As such, the roller chain only ensures accuracy of the conveyor belt scale at the tested weight. Additionally, the roller chains must be calibrated on a yearly basis.
For example, Blubaugh, U.S. Pat. No. 3,396,573, discloses an assembly that has a plurality of interconnected wheeled trucks that each have a known weight. The assembly is attached in a fixed position over the belt scale while the conveyor belt is moving beneath the assembly to calibrate the belt scale.
Jones, U.S. Pat. No. 2,974,518, describes a belt scale calibration system where weights are placed on an elongated frame. The force of the weight on the elongated frame is applied to the conveyor belt through a rotatable wheel. The weight measured by the belt scale is then compared to the weight on the elongated frame.
Wilson et al., U.S. Pat. No. 3,976,150, describes a structure for use in calibrating a belt scale. The Wilson et al. structure includes a frame that extends over the conveyor belt and which is mounted to the belt scale. Placing a known amount of weight on the frame allows the belt scale to be calibrated.
Karpa, U.S. Pat. No. 4,658,921, discloses an apparatus for calculating a stationary scale. The apparatus includes a frame mounted over the scale and a hydraulic press mounted to the frame for applying force to the scale.
McDonald, U.S. Pat. Nos. 3,656,337 and 3,850,023, describe a calibration system in which the conveyor belt is lifted off the belt scale and a calibration load is placed on the belt scale.
Laurent, U.S. Pat. No. 4,309,896, discloses a weighing system that includes at least one flexible body. The flexible body compresses in response to a force placed thereon. Compression of the flexible body causes hydraulic fluid to be transmitted to a pressure transducer. Laurent also discloses the use of smaller flexible body attached to the pressure transducer for calibrating the pressure transducer.

Hydraulic actuated belt scale calibration system


The present invention provides a process of producing unsaturated acids from unsaturated aldehydes by fixed-bed catalytic partial oxidation in a shell-and-tube heat exchanger-type reactor, as well as a shell-and-tube heat exchanger-type reactor for use in the process. In the invention, second-stage reaction zone of mainly producing unsaturated acids by the catalytic vapor phase oxidation of an unsaturated aldehyde-containing gas mixture produced in a first-stage reaction zone with molecular oxygen is divided into two or more shell spaces by at least one partition. Each of the divided shell spaces is filled with a heat transfer medium, and the heat transfer medium in each shell space is maintained at isothermal temperature or a temperature difference of 0-5° C. Also, in order to protect catalyst layers from a highly exothermic reaction, the process is performed at a limited temperature difference between the temperature at a hot spot and the temperature of the heat transfer medium. Also, in order to facilitate the removal of heat generation at a location where the partition is placed, a reaction inhibition layer is disposed in that location. The improved heat control system for reactors provided according to the present invention can secure the heat stability of the catalyst layer, reduce the amount of byproducts, and increase the yield of a final product.

A process of producing unsaturated aldehydes and unsaturated acids from olefins corresponds to typical catalytic vapor phase oxidation.
Generally, catalytic vapor phase oxidation is carried out by charging one or more kinds of granular catalysts into a reactor tube (catalytic tube), supplying feed gas into a reactor through a pipe, and contacting the feed gas with the catalyst in the reactor tube. Reaction heat generated during the reaction is removed by heat exchange with a heat transfer medium whose temperature is maintained at a predetermined temperature. The heat transfer medium for heat exchange is provided on the outer surface of the catalytic tube so as to perform heat transfer. The mixture containing the desired product is collected, recovered and sent to a purification step through a pipe. Since the catalytic vapor phase oxidation is a highly exothermic reaction, it is very important to control the reaction temperature in a certain range and to reduce the size of the temperature peak at a hot spot occurring in a reaction zone.
The partial oxidation of olefin uses a multimetal oxide containing molybdenum and bismuth or vanadium or a mixture thereof, as a catalyst. Typical examples thereof include a process for the production of acrolein or acrylic acid by the oxidation of propylene, a process for the production of phthalic anhydride by the partial oxidation of naphthalene or orthoxylene, and a process for the production of maleic anhydride by the partial oxidation of benzene, butylene or butadiene.
Generally, acrylic acid, a final product, is produced from propylene by a two-stage process of vapor phase catalytic partial oxidation. In a first stage, propylene is oxidized by oxygen, dilution inert gas, steam and a certain amount of a catalyst, so as to mainly produce acrolein, and in a second stage, the produced acrolein is oxidized by oxygen, inert dilution gas, steam and a certain amount of a catalyst, so as to produce acrylic acid. The catalyst used in the first stage is a Mo—Bi-based oxidation catalyst which oxidizes propylene to mainly produce acrolein. Also, some acrolein is continuously oxidized on such a catalyst to produce acrylic acid. The catalyst used in the second stage is a Mo—V-based oxidation catalyst, which oxidizes mainly acrolein in acrolein-containing gas mixture produced in the first-stage, thus mainly producing acrylic acid.
A reactor for performing such a process is provided either in such a manner that both the two-stages can be performed in one catalytic tube or in such a manner that the two stages can be performed in different catalytic tubes (see U.S. Pat. No. 4,256,783).
Meanwhile, acrylic acid manufacturers now conduct diversified efforts to improve the structure of such a reactor, or to propose the most suitable catalyst to induce oxidation, or to improve process operations, so as to increase the production of acrylic acid by the reactor.
In part of such prior efforts, propylene which is supplied into the reactor is used at high space velocity or high concentration. In this case, there are problems in that rapid oxidation in the reactor occurs, making it difficult to control the resulting reaction temperature, and also a high temperature at hot spot in the catalyst layer of the reactor and a heat accumulation around the hot spot are produced, resulting in an increase in the production of byproducts, such as carbon monoxide, carbon dioxide and acetic acid, thus reducing the yield of acrylic acid.
Furthermore, in the case of producing acrylic acid using a high space velocity and high concentration of propylene, as an abnormal increase in temperature occurs in the reactor, various problems, such as the loss of active ingredients from the catalyst layer, a reduction in the number of active sites caused by the sintering of metal components, are caused, thus deteriorating the function of the catalyst layer.
Accordingly, in the production of acrylic acid, the control of the heat of reaction in the relevant reactor is important of all things. Particularly, not only the formation of hot spots in the catalytic layer but also the accumulation of heat around the hot spot must be inhibited, and the reactor must be effectively controlled such that the hot spots do not lead to reactor runaway (a state where the reactor is not controlled or explodes by a highly exothermic reaction).
Thus, it is very important to inhibit hot spots and heat accumulation around the hot spot so as to extend the life cycle of a catalyst and inhibit side reactions, thus increasing the yield of a product such as acrylic acid. To achieve this inhibition, various attempts have been steadily made.
A fundamental method is to form several catalyst layers having activities that vary according to the moving direction of reactants (hereinafter, referred to as the "axial direction"). Namely, at a reactor inlet side where hot spots generate, a catalytic layer with low activity is formed, and catalyst layers whose activities increase slowly toward a reactor outlet side are formed. Typical methods for controlling catalytic activity include: a method of making catalytic particles by mixing a catalytic material with inactive materials (e.g., U.S. Pat. No. 3,801,634, Japanese patent No. 53-30688B, and Japanese patent No. 63-38831); a method of controlling activity and selectivity by either changing the kind of alkali metals and controlling the amount thereof (e.g., U.S. Pat. No. 6,563,000); a method of controlling activity by adjusting the occupied volume of catalytic particles (e.g., U.S. Pat. No. 5,719,318); and a method for controlling activity by controlling sintering temperature in the preparation of a catalyst (e.g., U.S. Pat. No. 6,028,220). However, such methods have some effects but still need to be improved.
Furthermore, in order to more effectively use the above-mentioned technologies, a reactor system needs to be designed such that it is suitable for oxidation with excessive heat generation. Particularly, in order to inhibit the inactivation of a catalyst caused by excessive heat generation, it is necessary to establish an efficient heat control system capable of controlling excessively high peak temperature at hot spots, thermal accumulation around the hot spot and runaway. For the establishment of the efficient heat control system, studies have been performed on the introduction of a perforated shield plate (e.g., U.S. Pat. No. 4,256,783, European patent No. 293224A, and Japanese patent No. 52-83936), the establishment of circulation pathway of molten salts by the placement of various baffles (e.g., U.S. Pat. No. 3,871,445), the design of an oxidation reactor integrated with a cooling heat exchanger (e.g., U.S. Pat. No. 3,147,084), a multi-stage heat control structure using an improved heat exchanger system (e.g., Korean patent application No. 10-2002-40043, and PCT/KR02/02074), etc.

Method of producing unsaturated acid in fixed-bed catalytic partial oxidation reactor with enhanced heat control system


Systems and methods for inferring a schema for a text file are provided. The systems and methods perform operations including: accessing a file comprising a plurality of textual records, each textual record of the plurality of textual records being associated with one or more columns of data; sampling a set of textual records from the plurality of textural records; obtaining a hierarchy comprising a plurality of levels of schema types; determining whether an individual column of the one or more columns of data corresponding to the set of textual records is successfully associated with a first level of the plurality of levels of the schema types and, in response, associating a schema type represented by the first level with the individual column of the one or more columns of data corresponding to the plurality of textual records.

Databases are widely used for data storage and access in computing applications. A goal of database storage is to provide enormous sums of information in an organized manner so that it can be accessed, managed, updated, and shared. In a database, data may be organized into rows, columns, and tables. Databases are used by various entities and companies for storing information that may need to be accessed or analyzed. Various operations performed on a database, such as joins and unions, involve combining query results obtained from different data sources (e.g., different tables, possibly on different databases) into a single query result. The accuracy and efficiency at which various operations can be performed is impacted by the schema associated with various rows/columns of the tables.


An excess slip control device for a driving wheel, comprising a driving wheel speed sensor for detecting a driving wheel speed of a vehicle, a slip determining means for determining a slip condition of a driving wheel according to an output from the driving wheel speed sensor, a fuel supply suppressing means for suppressing fuel supply to an engine according to an output from the slip determining means, and a retard control means for controlling an ignition timing to a retard position according to an output from the slip determining means. Thus, the fuel quantity to be supplied to the engine and the ignition timing are controlled according to the slip condition of the driving wheel. Accordingly, an operational shock due to a fluctuation in engine torque may be reduced to thereby improve the drivability, and a control lag may be also eliminated.

The present invention relates to an excess slip control device for a driving wheel, and more particularly to a control device for controlling excess slip of the driving wheel by controlling fuel supply to an engine and controlling an ignition timing.
In a conventional excess slip control device for a driving wheel, a slip condition of the driving wheel is detected according to a driving wheel speed or the like, and when a predetermined slip condition is detected, fuel supply to an engine is suppressed (cut, for example) to reduce an engine output, thus preventing the excess slip of the driving wheel. Such a control device has been proposed by the present applicant in Japanese Patent Application No. 62-145920, for example. In this control device, when a predetermined slip condition is detected, stop of fuel supply to the engine (which will be hereinafter referred to as fuel cut) and reduction of the fuel supply is alternately repeated so as to prevent an operational shock due to rapid decrease in engine torque and improve the drivability.
However, in the above prior art device, when the operational condition is shifted to a fuel cut region that is a region where the predetermined slip condition is detected, or the operational condition is shifted from the fuel cut region, a fuel quantity to be supplied to the engine is largely fluctuated. As a result, a fluctuation in engine torque cannot be sufficiently prevented, and it is yet necessary to improve the suppression of the operational shock. Further, even when it is determined that the fuel cut should be carried out, the fuel cut is not carried out with respect to any cylinder in a compression stroke or an explosion stroke at the timing of determination, resulting in the generation of control lag.

Excess slip control device for driving wheel


Magnetic heads are fabricated by slicing and dicing wafers into row bars, which undergo frontside lapping and backside lapping. These lapping processes, as well as other processes, induce stresses on the row bars that are released prior to finalizing the magnetic head. Ultrasonic impact technology is used to release the stress in the row bars and to clean the row bars at the same time. Ultrasonic impact technology is used after the row bars have been wire bonded without having to de-bond the row bars.

Magnetic disk drives are used to store and retrieve data in many electronic devices including computers, televisions, video recorders, servers, digital recorders, etc. A typical magnetic disk drive includes a head having a slider and a transducer with a read and write element that is in very close proximity to a surface of a rotatable magnetic disk. As the magnetic disk rotates beneath the head, a thin air bearing is formed between the surface of the magnetic disk and an air bearing surface (ABS) of the slider. The read and write elements of the head are alternatively used to read and write data while a suspension assembly positions the head along magnetic tracks on the magnetic disk. The magnetic tracks on the magnetic disks are typically concentric circular regions on the magnetic disks, onto which data can be stored by writing to it and retrieved by reading from it.
The slider is aerodynamically designed to fly above a rotating magnetic disk by virtue of an air bearing created between the ABS of the slider and the rotating magnetic disk. The ABS is the portion of the slider surface which is closest to the rotating magnetic disk, which is typically the head portion of the slider. In order to maximize the efficiency of the head, the sensing elements (i.e., the read and write heads) are designed to have precise dimensional relationships to each other. In addition, the distance between the ABS and the rotating magnetic disk is tightly controlled. The dimension that relates to the write function is known as the throat height and the dimension that relates to the read function is known as the stripe height. Both the stripe height and the throat height are controlled by lapping processes.
Multiple lapping processes are performed on row bars, which are rows of sliders/heads, and include backside lapping followed by frontside lapping. During the lapping process, row bars are mounted on a separate lapping tool at each lapping operation using an adhesive, tape and/or separate double-sided adhesive film. The lapping process alters and removes materials, as well as polishes, the row bars, which creates stresses on and within the surfaces of the row bars that are lapped. If these stresses are not released and are left in the finished magnetic head, which is made from a row bar, the stresses can cause the finished magnetic head to be damaged later. Therefore, these stresses are released and corrected during the manufacturing process. The damage occurs because magnetic heads which are stressed are also unstable and can change their shape later after they have been installed in a hard drive. The magnetic head's shape changes because of instability, which results from stress built up. When this change occurs it is referred to as "POPPING" because the change is a permanent over coat protrusion (POP) that occurs on the surface of the head and resembles the magnetic head surface popping up. Therefore, as part of the manufacturing process, the stress built up in the head, which is a result of processes like lapping, is released in order to stabilize the head and avoid "POPPING" later.
Conventional methods of releasing these stresses involve annealing the head at high temperatures to induce the "POPPING" to occur and therefore remove the instability from the magnetic head. The conventional high temperature annealing process, which is used to relieve stresses, is optimally performed just prior to the final lapping operation and after the rough lapping operation. However, using high temperature annealing on row bars of magnetic heads, after rough lapping, requires the row bars to be de-bonded from a lapping row tool because high temperature annealing can destroy the adhesive and mounted wire bond board. These steps of bonding and de-bonding wires to row bars require significant extra processing steps that are expensive.
Therefore, what is needed is a system and method that releases stresses built up in row bars as a result of fabrication processes, such as lapping, as well as reduces the number of times that wires are bonded and de-bonded to row bars and thus lowers magnetic head fabrication costs.

Method to stress relieve a magnetic recording head transducer utilizing ultrasonic cavitation


A method of producing a semiconductor device including the steps of depositing a refractory metal gate electrode at a predetermined region of a semi-insulating substrate surface, and thereafter depositing an insulating film at regions other than the gate electrode region, wherein the production of the insulating film is carried out by an electron cyclotron resonance plasma CVD method while applying a high frequency electrical bias to the substrate.

FIGS. 7(a) to 7(a) show cross-sectional views of the major production process steps of a method of producing a semiconductor device according to the prior art.
First of all, as shown in FIG. 7(a), an active layer 2 is produced at a desired position on a semi insulating GaAs substrate 1 by ion implantation. Thereafter, as shown in FIG. 7(b), a refractory metal silicide layer, such as WSix layer 3 is plated on the entire surface of semi-insulating GaAs substrate 1 by sputtering or deposition another deposition process and a gate pattern comprising photoresist film 6 is formed on a portion where a gate is to be produced.
Next, as shown in FIG. 7(c), the WSix layer 3 is selectively etched by reactive ion etching (hereinafter referred to as RIE) using CF.sub.4 +O.sub.2 or SF.sub.6 gas using the photoresist film 6 as a mask. Then, ion implantation using the selectively etched WSix layer 3, that is, a refractory metal gate, as a mask and annealing are carried out to produce a high concentration doping layer 4 (FIG. 7(d)). Thereafter, as shown in figure 7(e), an insulating film (SiO2 film) 5 is deposited on the entire surface of semi-insulating GaAs substrate 1 in a plasma CVD apparatus. As shown in FIG. 7(f), a photoresist film 9 is deposited thereon to flatten the surface.
Thereafter, the WSix layer 3 is exposed by etching the photoresist film 9 and the insulating film 5 at equal rates (FIG. 7(g)). Thereafter, as shown in FIG. 7(h), the photoresist film 7 is formed into a pattern, and the multiple layer, low resistance metal film 8 such as Ti/Mo/Au, is deposited and lifted off. Thereafter, as shown in FIG. 7(i), a source and drain electrode 10 are deposited.
In the production method of a semiconductor device according to the prior art, however, it is necessary to expose the WSix film surface uniformly over the entire surface of wafer in the process of exposing the top portion of the refractory metal gate electrode (WSix film) 3. To achieve that result, a high uniformity in the insulating film thickness and in the planarity of the surface of photoresist film are required, thereby resulting in reduction in the yield.
Furthermore, the growth of the insulating film, depositing of the photoresist film, or etching back of the photoresist film have to be conducted by separate apparatus, thereby resulting in problems in the work efficiency.

Method of producing a semiconductor device using electron cyclotron resonance plasma CVD and substrate biasing


An extended binary encoding for a plurality of inputs is sensed using a two-phase process. In a first phase binary values are sensed at the inputs. In the second phase, inputs sensed as having a first binary signal value are driven to a second binary value to test whether other inputs which had the first binary signal value also change to the second binary value indicative of a direct connection between the inputs. Accordingly, an enhanced binary encoding is achieved by evaluating not only the binary signal value at the inputs, but also which inputs are connected together, the selective interconnection of inputs extending the 2.sup.N options available for conventional binary encoding.

This invention relates to binary input devices and methods.
In many digital systems, different configurations are required, where the particular configuration needs to be sensed by the digital system. If a large number of configurations is required, a binary encoding may be used where the number of options available is 2.sup.N, wherein N is the number of pins used. As the name suggests, binary systems have only two possible values per pin (usually high and low).
Often, configuration options for hardware are encoded using jumpers, the number of options being determined by the number of option pins. Often the number of pins available on an integrated circuit is at a premium due to cost and/or functionality requirements.
Three level (trinary or tri-state) encoding is known, where each pin has three possible values, namely high, low and mid. The electronic circuitry required to sense trinary levels is more complex than that required to sense binary levels. However, a disadvantage of trinary encoding systems is that the encoding has a base of three, whereas most digital systems operate on a base of two (i.e. binary). This leads to undesirable technical complexities as well as difficulties for users not used to working to base three, as well as the need for additional level discriminating circuitry.
Accordingly, the invention seeks to provide an enhanced encoding which can provide more options than conventional binary encoding without the need for the tri-level discriminating circuitry required for trinary encoding.


An adaptive engine speed control system for a grass mowing machine having an internal combustion engine, a hydrostatic traction drive circuit and a hydraulic mowing circuit for operating a plurality of cutting units. A controller provides a traction feedback output signal if the grass mowing machine is moving at an actual ground speed that is below a pedal based desired ground speed, and uses the traction feedback output signal to command the internal combustion engine to an increased speed above a pedal based engine speed control range.

Grass mowing machines such as riding greensmowers, trim and surround mowers and fairway mowers may include internal combustion engines to power a hydrostatic traction drive circuit and hydraulic mowing circuit. The internal combustion engine may produce maximum power at maximum engine speed, but it may be desirable to run the engine at lower speeds to achieve better economy or noise reduction. Power requirements needed to maintain the desired ground speed may increase in sloping terrain or other conditions. Additionally, power requirements for hydraulic mowing circuits may increase in wet grass, verticutting or other conditions.
An engine speed control system for a mower is needed that can run at low power in economy or low noise modes, but can increase power if the mower encounters terrain or other circumstances with greater power requirements. An engine speed control system is needed that allows operators to only run the engine at speeds required for the work being done, and can adapt the engine speed when necessary. An engine speed control system is needed that reduces fuel consumption and noise levels experienced around the mower. An engine speed control system is needed that does not require sensors to measure hydraulic pressure of the hydrostatic traction drive circuit and/or hydraulic mowing circuit to determine power requirements.


Encryption and decryption sites are initially assigned identical one time Vernam like pads, (OTP), and each site is provided with identical compendiums of byte modifying instructions identified by instruction IDs. Encryption is implemented by a random first subset of instructions applied to the current OTP to generate a new OTP. A second subset of random instructions is applied to the message for encryption. The list of IDs of the first subset of instructions is XORed with the current OTP. The list of IDs of the second subset of instructions and the encrypted message are each XORed with the new OTP and all XORed outputs are concatenated into the payload. Decryption is implemented by applying the encryption steps to the payload in reverse order to recover the message and new OTP. A secure, new OTP is therefore available both at the encryption and decryption sites without having been transmitted.

1. Field of the Invention
This invention relates to transmission of information, and in particular to the use of cryptographic encipherment to provide secure communication.
2. Description Relative to the Prior Art
The Vernam cipher is the only known unbreakable method of encryption. Gilbert Vernam developed it in 1917 during WWI while working for AT&T. It makes use of a one-time pad that must be exchanged between the sender and receiver via a secure channel (e.g. face-to-face). The pad must be generated in a totally random manner and must never be reused. Each pad-page must be as long as the largest message. The sender encrypts a plaintext message by combining it with the current pad page via the XOR function. The receiver decrypts the cipher text message by combining it with his current pad page via the XOR function. Both parties discard the current pad page. This procedure repeats itself until the pad is gone. Then, a new pad must be generated and manually distributed in a secure manner. Since each byte in the pad-page sequence is totally random, an attacker is forced to try every possible combination of byte values to arrive at a very large number of potential plaintext meanings.
A method for generating, automatically distributing and using a sufficiently random one-time pad for a Vernam like cipher is disclosed by the present invention.

Communication security apparatus and method of using same


The present invention concerns the preparation of composite biomaterials constituted by hyaluronic acid and the derivatives thereof in combination with polymers that have electrically conductive properties. In particular, the methods of preparing biomedical devices formed by a two- or three-dimensional polysaccharide matrix and by an electrically conductive membrane. The matrix is constituted by hyaluronic acid derivatives in the form of membranes, woven fabrics, nonwoven felts, meshes, gauzes, guide channels or sponges, while the electrically conductive membrane is constituted by a film of polypyrrole (polymer conductor) in combination with hyaluronic acid or a derivative thereof (doping agent).

Hyaluronic acid is a natural, linear polysaccharide constituted by a repetitive monomeric unit formed by d-glucuronic acid and N-acetylglucosamine. It is to be found in almost all the soft tissues of higher organisms and plays a vital role in many biological processes linked with the repair and recovery of tissue function.
Hyaluronic acid derivatives and their transformation into biomaterials such as, for example, membranes, nonwoven felts, meshes and sponges, for use in the biomedical and surgical fields, have been amply described in patent No. EP 0216453 B1. The key property of these products is their biodegradability, because once they have been implanted in the application site, they favour the release of native hyaluronic acid that is able to exercise its own biological functions (D. Campoccia et al., Biomaterials, vol. 19 (1998), page 2101).
Among other applications for ester derivatives of hyaluronic acid, EP 0652778 B1 claims the preparation of guide channels constituted by a combination of meshes immersed in a continuous polysaccharide matrix. Although these devices seem in some way to favour the growth of neurites and axons in short sections of damaged nerves, they are not able fully to support the process of repairing nerve function because of their rapid degradation.
It is an accepted fact that electric charges carried by a conductive material play a decisive role in increasing neuronal length and thereby accelerating nerve regeneration. In order to obtain these results, past techniques have exploited electric and magnetic fields generated externally or by introducing electric current directly through a section of damaged nerve. Neuronal growth has been demonstrated using materials with piezoelectric properties, such as polyvinylene difluoride (PVDF), the effect of which is attributable to the transient surface charges generated as a result of repeated mechanical stress. (R. F. Valentini et al., biomaterials, vol. 13, page 183 (1992)). The application of exogenous electromagnetic fields in in vitro and in vivo studies has shown better migration of the neuronal cells, this effect probably being due to a combination of biological mechanisms that depend on the redistribution of cytoskeletal proteins, such as actin and other molecules, on modifications in their formation and their capacity for favouring electric signals between parts of damaged nerve.
Although all these systems have proved to be partially effective, the use of piezoelectric materials and external electromagnetic fields have strong limitations. Without outside stimulation, the former are only able to generate electric properties for a limited period only, often insufficient for the functions they are to perform. Electromagnetic fields, on the other hand, cannot be focused exclusively on the nerve area to be regenerated and this may have unwanted effects on the surrounding healthy tissues.
More recently, polypyrrole has been used as a polymer to conduct electric signals in the biomedical field. Some particular applications described in the literature suggest that polypyrrole is a suitable matrix for the release of neurotransmitters or to make biosensors in association with other polymers and as a biomaterial with electroconductive properties to be used in the sector of nerve regeneration (V. Shastri et al., WO 97/16545; C. Schmidt, Tissue Engineering, vol. 26, 1999, page 617; J. Collier et al., Biomed. Mater. Res., 50, 2000, page 574). The special biological function demonstrated by polypyrrole (enabling nerve cells to take and grow) seems to be closely linked with the state of oxidation and the degree of hydrophilia due to the association with a particular doping agent, that may be constituted by an inorganic salt or by an anionic polysaccharide or polymer.
G. Robila et al. (J. Of Applied Polymer Sci., vol. 66, 1997, page 591) describe the use of polyurethane sulphate as a doping agent for use in making composite biomaterials based on polypyrrole, while C. Schmidt et al. (Proc. Nat. Acad. Sci. USA, vol. 94, 1997, page 8948) present a series of results from in vitro and in vivo studies to determine the cell response induced by the implantation of a composite biomaterial constituted by polypyrrole in association with polystyrene sulphate as doping agent.
Among the hyaluronic acid derivatives with a marked anionic charge linked with the type of chemical modification conducted on the polymer chain, of particular interest are those obtained by substituting the hydroxy functions with sulphated groups. These composites have already been described by Barbucci et al (EP 0702699 B1), who detail the preparation of biopolymers with anticoagulant properties intended for biomedical applications where there is contact with the blood. Again for the preparation of biomaterials with haemocompatible properties, the same R. Barbucci describes, in patent application No. PCT WO99/43728, composites constituted by polyurethane chemically linked with sulphated hyaluronic acid derivatives.
Although the electropolymerisation reaction of pyrrole with HA and polystyrene sulphonate (PSS) is well known as a procedure of synthesis to obtain biocompatible polymer films, both in the form of a single layer (PPy/HA and PPy/PSS) and as multiple layers ("Synthesis and characterisation of polypyrrole-hyaluronic acid composite biomaterials for tissue engineering applications", Collier et al., J. Biomed. Mater. Res., 50, 574-584, 2000; PCT Publication No. WO 97/16545), the inventive aspect that characterises the present invention consists in using esterified hyaluronic acid derivatives (HYAFF®), e.g. in the form of woven, non-woven fabrics and guide channels, as supporting materials on which to activate the polymerisation reaction between PPy and PSS, hyaluronic acid, HAOSO3, HYOXX™ and the derivatives thereof, obtaining composites that can be grafted directly into living organisms.

Electrically conductive polymeric biomaterials, the process for their preparation and the use thereof in the biomedical and healthcare field


Various MEMS filter elements or modules are disclosed. One such MEMS filter module (34) includes a first film (70) and a second film (46) that are spaced and interconnected by a plurality of supports (78). A plurality of first flow ports (74) extend through the first film (70), and a plurality of second flow ports (50) extend through the second film (46). A plurality of annular filter walls (54) extend from the second film (46) toward the first film (70), and are separated therefrom by a filter trap gap (58). A filter trap chamber (62) is disposed on each side of each filter trap gap (58). Therefore, fluid will flow into one filter trap chamber (62), through a filter trap gap (58), and into another filter trap chamber (62), whether the flow is introduced into the filter module (34) through the first flow ports (74) or the second flow ports (50).

Filters are used in a large number of applications. The filtering media used by a filter may be in the form of a porous material or combination of porous materials. Both the pore size and the distribution of pores may of course have an effect on the filtering capabilities of the filtering media. For instance, if the filtering media is produced in a manner where adjacent pores could overlap, a larger pore may be formed. Although this may be acceptable for certain applications, it may not be for others (e.g., filtering biological fluids).


A process for milling amorphous solids using a milling apparatus can result in particles having a median particle diameter d50 of <1.5 μm. The process includes: operating a mill in a milling phase with an operating medium selected from the group consisting of gas, vapor, steam, a gas containing steam and mixtures thereof, and heating a milling chamber in a heat-up phase before the actual operation with the operating medium in such a way that a temperature in the milling chamber, the mill exit or both, is higher than a dew point of the operating medium.

1. Field of the Invention
The invention relates to pulverulent amorphous solids having a very small median particle size and a narrow particle size distribution, a process for the preparation thereof and the use thereof.
2. Discussion of the Background
Finely divided, amorphous silica and silicates have been produced industrially for decades. As a rule, the very fine milling is carried out in spiral jet mills or opposed jet mills using compressed air as milling gas, e.g. EP 0139279.
It is known that the achievable particle diameter is proportional to the square root of the inverse of the impact velocity of the particles. The impact velocity in turn is predetermined by the jet velocity of the expanding gas jets of the respective milling medium from the nozzles used. For this reason, superheated steam can preferably be used for generating very small particle sizes, since the acceleration power of steam is about 50% greater than that of air. However, the use of steam has the disadvantage that condensation may occur in the entire milling system, particularly during the startup of the mill, which as a rule results in the formation of agglomerates and crusts during the milling process.
The median particle diameters d50 achieved with the use of conventional jet mills in the milling of amorphous silica, silicates or silica gels have therefore been substantially above 1 μm to date. Thus, for example, U.S. Pat. No. 3,367,742 describes a process for milling aerogels, in which aerogels having a median particle diameter of 1.8 to 2.2 μm are obtained. Milling to a median particle diameter of less than 1 μm is, however, not possible with this technique. Furthermore, the particles of U.S. Pat. No. 3,367,742 have a broad particle size distribution with particle diameters of 0.1 to 5.5 μm and a fraction of 15 to 20% of particles >2 μm. A large fraction of large particles, i.e. >2 μm, is disadvantageous for applications in coating systems since as a result thin coats having a smooth surface cannot be produced. U.S. Pat. No. 2,856,268 describes the combined milling and drying of silica gels in vapour jet mills. However, the median particle diameters achieved thereby were substantially above 2 μm.
An alternative possibility for milling is wet comminution, e.g. in ball mills. This leads to very finely divided suspensions of the products to be milled, cf. for example WO 200002814. It is not possible with the aid of this technology to isolate a finely divided, agglomerate-free dry product from these suspensions, in particular without changing the porosymmetric properties.


A method of and an apparatus for transmitting a universal plug and play audio/video (UPnP-AV) stream is disclosed, which transmits a media stream from a media server to an media renderer, using an integrated protocol which combines an universal plug and play (UPnP) audio/video (AV) protocol and a residential Ethernet (ResE) subscription protocol. According to the method, an integrated protocol combining an UPnP-AV protocol and an Ethernet protocol can be used. Additionally, a secured quality of service (QoS) can be provided for the UPnP-AV stream.

1. Field of the Invention
Apparatuses and methods consistent with the present invention relate to transmitting a universal plug and play audio/video stream, and more particularly, to transmitting a universal plug and play audio/video (UPnP-AV) stream, which transmits a media stream using an integrated protocol of an UPnP-AV protocol for a home network service and a residential Ethernet subscription protocol.
2. Description of the Related Art
Generally, a universal plug and play (UPNP) is a networking architecture, which enables network home devices, such as PCs, PDAs, printers, wideband routers, home appliances, and others, to perform plug and play functions in home networks.
UPNP is a technology of extending a simple ability of plug and play of devices in an operating system (OS) to the entire network. Also, UPNP-AV has been developed in a general UPNP architecture, especially for an AV content transmission among network devices. In addition to UPNP, experience of zero-configuration multimedia becomes possible at home.
Currently, a residential Ethernet is a new standardization scheme in the IEEE 802 Working Group. The residential Ethernet provides a time-sensitive delivery with respect to a reliable point-to-point universal intermediate-layer cable media among endpoints. The AV applications can set isochronous stream connections on the residential Ethernet.
Currently, UPnP-AV support four types of transmission protocols, such as "http-get", "rtsp-rtp-udp", "internal", and "ice 61883", clearly defined. However, in the UPnP-AV, an integrated transmission protocol, in addition to the residential Ethernet, has not yet been considered.
In addition, the residential Ethernet (ResE) can provide secured quality of service (QoS) 2-layer connections for the AV stream. However, in the actual AV applications, it has not been considered how to use such a connection service.

Method of and apparatus for transmitting universal plug and play audio/video stream


This disclosure describes, in part, techniques and systems for enabling new devices introduced into respective environments (“provisionee devices”) to be provisioned by existing devices in the respective environments (“provisioner devices”) in a manner in which the provisioning requests sent by the provisioner devices are allocated over time and, thus, do not overwhelm the provisioning system(s) at any given time.

As use of client computing devices continues to proliferate, so too does the need to provision each new computing device that a user introduces into her home or business. However, provisioning a computing device can be tedious and confusing, and may include steps such as joining the device to a local network, registering the device with a content provider, logging into an account of the user at the content provider, and/or the like. These provisioning operations may impede the ability of users to make these devices operational.


Medical electrical leads are provided including fixation features for acute and chronic fixation of a portion of the respective leads within the cardiac venous system. The medical electrical lead includes an elongate body having proximal and distal regions. Tissue contacting portions are selectively located in the distal region to contact an inner surface of the cardiac vessel when the lead is in an implanted position. The tissue contacting portion(s) include fixation features adapted to frictionally engage the inner surface of the cardiac vessel and promote tissue in-growth for chronic fixation. In some embodiments, the fixation features are detachable from the lead such that the lead can be extracted from its implanted position after tissue in-growth occurs.

Implantable medical devices for treating irregular contractions of the heart with electrical stimuli are known. Exemplary implantable devices are defibrillators and pacemakers. Various types of electrical leads for defibrillators and pacemakers have been suggested, many of which are placed transvenously. Such leads are introduced into the patient's vasculature at a venous access site and travel through veins to the sites where the leads' electrodes will be implanted or otherwise contact target coronary tissue. Electrodes for transvenously-placed leads can be implanted in the endocardium (the tissue lining the inside of the heart) of the right atrium or ventricle, or alternatively, in the branch vessels of the coronary venous system. In particular, lead electrodes can be implanted in the coronary sinus or a branch vessel thereof for sensing and/or stimulation of the left side of the heart (i.e., the left ventricle).
Various techniques have been used to facilitate fixation of the foregoing types of leads at the desired implantation sites. For leads partially implanted within the coronary venous system, fixation techniques should provide both acute and chronic fixation for withstanding natural heart motion and retrograde blood flow which naturally tend to push the lead out of its implanted position. Additionally, it is desirable to permit and facilitate partial or complete removal of the lead and fixation structures after implantation if necessary or desired.
There is thus a need for devices and methods for fixation of cardiac leads within the coronary vasculature which provides both acute and chronic fixation yet still permits removal of the leads as desired.

Medical electrical lead with friction-enhancing fixation features


A system and method for remapping surface areas of vehicle environment that include receiving a plurality of images of the surface areas of the vehicle environment from a computing device. The system and method also include evaluating the plurality of images to determine an optical flow value associated with at least one pixel of at least two images of the plurality of images. The system and method additionally include determining at least one surface area that includes an external environment of the vehicle. The system and method further include remapping the surface areas by filtering the at least one surface area from which the external environment is captured and rendering at least one surface area graphical augmentation on at least one remapped surface area of the vehicle environment.

Augmented reality is being increasingly used in and around vehicles to augment vehicle environments with one or more augmented reality graphical objects. In many cases, augmented reality vehicle environments may be presented to a user wearing a head mounted display system. In particular, passengers seated within a vehicle may wear the head mounted display systems to execute software such as games and graphical applications to view immersive augmented reality environments that are overlaid upon one or more surface areas of the vehicle.
In particular, many head mounted display systems have outward facing cameras that capture the viewpoint of the passengers. Within the vehicle, the outward facing cameras capture the viewpoint that includes a full environment of the vehicle in order to augment the view and provide the augmented reality environments. The full environment may include an interior portion of a cabin of the vehicle and an exterior environment surrounding the vehicle that may be captured through one or more windows of the vehicle. In many cases, the exterior environment of the vehicle includes a dynamic environment that often changes rapidly as the vehicle is being operated and moved. Augmentation of the dynamic exterior environment together with the interior portion of the cabin of the vehicle may result in a distorted viewpoint of the full environment of the vehicle. Consequently, the passengers wearing the head mounted display systems are not provided with an augmented reality environment that provides a clear and immersive experience when executing the games and graphical applications.

System and method for remapping surface areas of a vehicle environment