A text enhanced voice menu system includes data storage, a voice communication path, a text communication path and switch logic. The data storage stores audio information for producing a voice menu, and stores text information for producing a text version of the voice menu. The voice communication path generates a voice menu from the audio information. The text communication path generates a text menu from the text information. The switch logic selects one of the voice menu and the text menu to be transmitted over a connection line.

1. Field of the Invention
The present invention concerns use of telecommunication and pertains particularly to a text-enhanced voice menu system.
2. Related Information
With the advent of telephone voice menus, many businesses, government agencies and individuals are able to off load redundant tasks onto a voice-automated menu system.
Public switched telephone networks can be used to transfer video as well as audio information. For example, U.S. Pat. No. 5,450,123 issued on Sep. 12, 1995 to David B. Smith for METHOD TO ENHANCE VOICE COMMUNICATIONS USING ENCODED ONE-WAY VIDEO SIGNALS UNDER BI-DIRECTIONAL USER OR NETWORK CONTROL FOR TRANSMITTING STORED OR REAL-TIME VIDEO OR IMAGE INFORMATION, discloses an arrangement for supplying audio and video signals from separate sources to a video telecommunication station. U.S. Pat. No. 5,583,922 issued on Dec. 10, 1996 to Richard A. Davis, et al., for TELECOMMUNICATION SYSTEM FOR AUTOMATIC SWITCHING BETWEEN VOICE AND VISUAL DATA COMMUNICATIONS USING FORMS, discloses a telecommunication system which provides voice and data communications over a conventional telephone line between a server station and a client station using visual forms. U.S. Pat. No. 5,528,672 issued on Jun. 18, 1996 to Gerald M. Wert for TELEPHONE SYSTEM WITH SUBSCRIBER SELECTED AUDIO AND IMAGE ANNOUNCEMENTS, discloses a telephone network system which routes audio and image announcements into a call originating from a local telephone station of a calling party. U.S. Pat. No. 5,524,141 issued on Jun. 4, 1996 to David A Braun et al. for SYSTEM AND METHOD FOR PROVIDING DIRECTORY INFORMATION OVER A TELEPHONY NETWORK USING ADSI, discloses a system and method for accessing directory information over a telephony network employing the ADSI protocol and for presenting the directory information at the user""s conventional television monitor.
Additionally, in addition to audio and video images, data in various formats can be sent over a telephone network. For example, U.S. Pat. No. 4,922,516 issued on May 1, 1990 to Myron C. Butler et al. for TELEPHONE TECHNICIAN""S TERMINALS WITH AUTO-SELECTION OF DIAL PULSE ON DTMF SIGNALLING, discloses a field terminal for use in communicating in diverse modes with a central technician access network. U.S. Pat. No. 5,060,257 issued on Oct. 22, 1991 to George Penalver for VIDEOTEX TERMINAL FOR RECEIVING TELECOPIES, discloses a videotex terminal capable of receiving telecopies. U.S. Pat. No. 5,479,498 issued on Dec. 26, 1995 to Yigal Brandman et al. for DIGITAL LINE CARD HAVING UNIVERSAL PORT FOR UPGRADING ELECTRONIC MESSAGING SYSTEM, discloses a digital line card for use in an electronic messaging system which enables the receipt of voice and text or image data over a single communications port. U.S. Pat. No. 4,897,865 issued on Jan. 30, 1990 to Albert Canuel for TELEPHONE DATA COLLECTION DEVICE, discloses a telephone data terminal and data collection network for communicating data over a telephone system using DTMF tone dialing. U.S. Pat. No. 5,485,370 issued on Jan. 16, 1996 to Leslie C. Moss et al. for HOME SERVICES DELIVERY SYSTEM WITH INTELLIGENT TERMINAL EMULATOR, discloses communication between a user-friendly terminal, such as a xe2x80x9chome terminalxe2x80x9d shaped to resemble a conventional telephone, and a number of service provider computers such as financial institutions. U.S. Pat. No. 5,457,731 issued on Oct. 10, 1995 to Joe H. Witherspoon for EMERGENCY TELECOMMUNICATIONS DEVICE FOR THE DISABLED, discloses an emergency telecommunication system for the hearing or speech impaired which includes an interface electrically connecting the emergency system to a telephone communication system.
Despite the various usages of telephone networks to communicate other forms of data in addition to audio, there has been no text enhanced implementation of a voice-automated menu system for use with an enhanced telephone.
In accordance with the preferred embodiment of the present invention, a text enhanced voice menu system is presented. A server for the text enhanced voice menu system includes data storage, a voice communication path, a text communication path and switch logic. The data storage stores audio information for producing a voice menu, and stores text information for producing a text version of the voice menu. The voice communication path generates a voice menu from the audio information. The text communication path generates a text menu from the text information. The switch logic selects one of the voice menu and the text menu to be transmitted over a connection line.
The present invention allows for flexibility in handling phone calls by allowing voice menus to be presented alternatively in text menu format.

Siemens Information and Communication Networks, Inc


A vehicle seat of the present invention has an engaged member, an engagement member and a guide portion. The engagement member is provided on the seat body so as to be movable between a restraint position and a restraint release position. The engagement member is capable of moving to the restraint position, so as to be advanced to a position in which the engagement member faces the engaged member, and is capable of moving to the restraint release position, so as to be retracted to a position in which the engagement member does not face the engaged member. The guide portion is capable of moving the engagement member to the restraint position when the seat body moves to the retracted position, and is capable of moving the engagement member to the restraint release position when the seat body is advanced from the retracted position.

A technique regarding the vehicle seat described above is disclosed in Japanese Laid-Open Patent Publication No. 2005-14672.
As illustrated in FIG. 13, this vehicle seat has a seat body 101, and a longitudinal slide mechanism 102 that is disposed on a vehicle floor F and is capable of moving the seat body 101 in a longitudinal direction of the vehicle. Disposed on a slide base 102t of the slide mechanism 102 is a rotation mechanism 104 that is capable of rotating the seat body 101 between a seating position in which the seat body 101 faces the front side of the vehicle and a laterally facing position in which the seat body 101 faces the door opening. Also, disposed on a rotation base 105 of the rotation mechanism 104 are a first slide mechanism 106 that is capable of advancing or retracting the seat body 101 relative to the vehicle exterior while the seat body 101 is in the laterally facing position, and a vertically moving mechanism 107 that is capable of lowering and raising the seat body 101 as the seat body 101 is advanced or retracted by the first slide mechanism 106. Further, disposed on a vertically moving base (not shown) of the vertically moving mechanism 107 is a second slide mechanism (not shown) that is capable of advancing or retracting the seat body 101.
Attached to a side surface of the seat body 101 is a locking hook 101f that protrudes downward and then extends backward. Further, when the seat body 101 is returned to a retracted position by the second slide mechanism, the locking hook 101f is capable of being inserted into a horizontally extending hole-shaped slide engagement portion 107k of the vertically moving mechanism 107 from before thereof. The locking hook 101f and the slide engagement portion 107k are constructed so as to not obstruct advancing motion and retracting motion of the seat body 101 cause by the second slide mechanism and to engage each other when the seat body 101 is moved forwardly-upwardly by a seatbelt loading.
Also, a bracket 110 is vertically disposed on and fixed to a side surface of the slide base 102t of the longitudinal slide mechanism 102. The bracket 110 has a rotation locking hook 111 that is formed at an upper end thereof. Further, a rotation engagement portion 105k is provided on a side surface of the rotation base 105 at a position corresponding to the rotation locking hook 111. Further, when the rotation base 105 is returned to the seating position in which the rotation base 105 faces the front side of the vehicle, the rotation locking hook 111 is inserted into an opening formed in the rotation engagement portion 105k. The rotation locking hook 111 and the rotation engagement portion 105k are constructed so as to not obstruct rotational motion of the rotation base 105 and to engage each other when the seat body 101 is moved forwardly-upwardly by the seatbelt loading.
A slide engagement portion 114 is fixed to the vehicle floor F so as to extend along the longitudinal slide mechanism 102. Further, a slide locking hook 112 formed in a lower end of the bracket 110 is positioned directly below the slide engagement portion 114. The slide locking hook 112 and the slide engagement portion 114 are constructed so as to not obstruct longitudinal sliding motion of the slide base 102t, and are engaged with each other when the seat body 101 is moved forwardly-upwardly by the seatbelt loading.
Thus, when the seat body 101 is moved forwardly-upwardly by the seatbelt loading while the seat body 101 is in the seating position in which the seat body 101 faces the front side of the vehicle, the locking hook 101f of the seat body 101 and the slide engagement portion 107k of the vertically moving mechanism 107 engage each other, so that the seat body 101 is retained on the rotation base 105. Further, the rotation engagement portion 105k of the rotation base 105 engages the rotation locking hook 111 of the bracket 110. Further, the slide locking hook 112 of the bracket 110 engages the slide engagement portion 114 of the vehicle floor F. As a result, the seat body 101 is retained on the vehicle floor F.


In a machining device for machining precision, in particular dental, workpieces in a machining chamber surrounded by a housing, having an inspection window with two gripping holes arranged to the two sides of the inspection window, the machining chamber is preferably connected or connectable to a suction device and arranged in the machining chamber is at least one blasting nozzle for blasting and/or a demolding tool for demolding and/or an air nozzle for blowing off the workpiece.

The machining of precision, in particular dental, workpieces is in most cases associated with dangers for the person carrying out the machining. This is caused firstly by the machining itself and/or by the materials of the workpiece. For example, when blasting workpieces there is the danger of injury from the blasting medium itself and also by the dust that is caused by blasting, consisting of the blasting medium itself and also machined-off particles of the workpieces. In particular dental workpieces consist of materials, e.g. quartz materials, that are hazardous to health particularly in the form of small particles, e.g. dust (see danger of silicosis).
Dental workpieces are in many cases cast pieces that are cast according to models. A wax model is first made which is embedded in a moulding material which in many cases contains quartz. The wax is then melted out and liquid metal is cast into the thus gained hollow space (negative form) for which different casting methods can be used. After cooling, the moulding material must be removed. This process, described in the art as extracting or demolding is done by cracking it open with extracting or demolding means, e.g. a chisel. Particles and in particular health hazardous dust are thus necessarily freed, from which the person carrying out the machining must be protected. To ensure this, machining devices, in particular those for blasting workpieces, have been developed having a machining chamber surrounded by a housing to which a suction device can be or is connected so that particles and dust released in this way can be discharged without endangering the health of the operator. By means of a window and two sealable gripping openings for the hands, the operator has manual access to and visual contact with the machining chamber for carrying out the machining.

Machining device for machining precision, in particular dental, workpieces in a machining chamber surrounded by a housing


A method of processing a substrate that enables the amount removed of a surface damaged layer to be controlled easily, and enable a decrease in wiring reliability to be prevented. A surface damaged layer having a reduced carbon concentration of a carbon-containing low dielectric constant insulating film on a substrate is exposed to an atmosphere of a mixed gas containing ammonia and hydrogen fluoride under a predetermined pressure. The surface damaged layer that has been exposed to the atmosphere of the mixed gas is heated to a predetermined temperature.

1. Field of the Invention
The present invention relates to a method of processing a substrate, and a method of and program for manufacturing an electronic device, and more particularly to a method of manufacturing an electronic device having a low dielectric constant insulating film formed on a surface thereof.
2. Description of the Related Art
In a method of manufacturing an electronic device in which an electronic device is manufactured from a silicon wafer (hereinafter referred to merely as a "wafer"), a film formation step of forming a conductive film or an insulating film on a surface of the wafer by CVD (chemical vapor deposition) or the like, a lithography step of forming a photoresist layer in a desired pattern on the formed conductive film or insulating film, and an etching step of fabricating the conductive film into gate electrodes, or fabricating wiring grooves or contact holes in the insulating film, with plasma using the photoresist layer as a mask are repeatedly implemented in this order.
An electronic device manufactured using such a method of manufacturing an electronic device thus has a structure in which insulating films are disposed between conductive films that form electrodes or wiring. Such an insulating film is generally referred to as an "interlayer insulating film".
In recent years, there have been demands to realize a higher degree of integration for electronic devices, and to achieve this, the dimension to which wiring grooves are required to be fabricated has become smaller, and the required spacing between adjacent pieces of wiring has also become narrower. As the wiring groove fabrication dimension becomes smaller and the wiring spacing becomes narrower, the parasitic resistance R and the parasitic capacitance C of the wiring increases, and hence wiring delay (RC delay) caused thereby arises, and thus the speed of transmission of signals along the wiring decreases. Such wiring delay increases as the parasitic resistance R and the parasitic capacitance C increase, and hence to resolve the problem of wiring delay, the parasitic resistance R and the parasitic capacitance C must be reduced.
As a technique for reducing the parasitic capacitance C, reducing the relative dielectric constant of an interlayer insulating film is effective, and hence various low-relative dielectric constant (low-K) interlayer insulating films have been developed.
In general, SiO2 is used as a material of interlayer insulating films. As a method of reducing the relative dielectric constant of SiO2, a method in which the SiO2 is doped with fluorine is known, but the doped fluorine tends to be released from the SiO2, and hence SiOC type low dielectric constant interlayer insulating film materials, organic polymer type coated low dielectric constant interlayer insulating film materials, for example "SiLK" (registered trademark, The Dow Chemical Company), and so on that are doped with carbon instead of fluorine are currently being developed. Here, a relative dielectric constant of not more than 3.0 is referred to as a "low dielectric constant". Materials representative of those used in low dielectric constant interlayer insulating films are shown in Table 1 below.
TABLE 1Relative dielectricTypeMaterialconstantInorganicSiO2  4SiOF3.4 to 3.6Si—H-containing SiO2 (HSQ)2.8 to 3.0Porous silica film<3.0Organic filmCarbon-containing SiO2 (SiOC)2.7 to 2.9Methyl group-containing SiO2 (MSQ)2.7 to 2.9Porous MSQ2.4 to 2.7Polymeric filmsPolyimide film3.0 to 3.5PARERIN film2.7 to 3.0PTFE Film2.0 to 2.4Amorphous carbon (F added)<2.5
However, for an SiOC type low dielectric constant interlayer insulating film or organic polymer type coated low dielectric constant interlayer insulating film, a surface damaged layer having a reduced carbon concentration is formed on a disposed surface of the interlayer insulating film upon carrying out plasma processing in, for example, a reactive ion etching step of fabricating a wiring groove or the like in the interlayer insulating film, or an ashing step of removing a photoresist layer formed on the interlayer insulating film (see, for example, D. Shamiryan, "Comparative study of SiOCH low-k films with varied porosity interacting with etching and cleaning plasma", J. Vac. Sci. Technol. B20(5), American Vacuum Society, September 2002, p. 1928). Such a surface damaged layer has similar properties to SiO2 (the native oxide), being readily dissolved in a subsequently implemented wet etching step using a liquid chemical (HF, NH4F, etc.), and moreover undergoing volume shrinkage in a heat treatment step. It is thus necessary to implement the etching step or ashing step such that a surface damaged layer is not formed, or else remove a formed surface damaged layer before the surface damaged layer is covered with a conductive film or the like.
As an ashing process in which a surface damaged layer is not formed, a process using an H2O (water) plasma instead of an O2 (oxygen) plasma is known (see, for example, Yoda, "Ko-seino haisen gijutsu" ("High-performance wiring techniques", Toshiba Review, Vol. 59, No. 8, 2004, p. 18), and as a method of removing a surface damaged layer, a method of removal through liquid chemical treatment using an organic solvent and NH4F (see, for example, Japanese Laid-open Patent Publication (Kokai) No. 2002-303993) is known.
However, in the process using plasma, a high energy is applied by the plasma to the electronic devices, which have a high degree of integration and hence have fine wiring, and hence the fine wiring may be damaged.
It is thus preferable to use the method of removing the surface damaged layer through liquid chemical treatment that does not use plasma. However, with such liquid chemical treatment, the surface damaged layer continues to be removed while in contact with the liquid chemical, and hence it is difficult to control the amount removed of the surface damaged layer, and furthermore after removal of the surface damaged layer, the surface of the low dielectric constant interlayer insulating film becomes hydrophilic due to OH groups (hydroxyl groups) formed thereon through water in the liquid chemical, and as a result there is a problem that the wiring reliability decreases through moisture absorption.

This patent is subject to a terminal disclaimer.

Method of processing substrate, and method of and program for manufacturing electronic device


A new variety of hybrid lily plant bearing large upfacing flowers of excellent form and long persistence, both on the plant and as cut-flowers. The pastel orange flowers of the new hybrid are particularly characterized by their tiny, pollen-free anthers and their starry form, with all tepals approximately the same width. This combination is completely new in the Asiatic hybird divisions of lilies suited to forcing and to mass commercial cultivation. The variety is resistant to fusarium disease and shows tolerance of virus. The bulbs may be precooled and forced for cut-flower production. The clone is vigorous and is a good grower and propagator.

My new variety of lily plant originated as a seedling which first flowered in 1986 in't Zandt, the Netherlands. The breeding efforts had as their objective the production of Asiatic hybrid lilies with upfacing, large-sized pollen-free flowers, suited to forcing into flower out of season, heretofore unknown in the lily breeding art. I achieved the desired objective by intercrossing a small-flowered, pollen-free white upfacing unnamed seedling with a tall, exceptionally vigorous, large-flowered orange unnamed seedling. Both parents were produced by me and never released. The seed parent for `Grandview` was a pollen-free, albino-flowered mutant Asiatic hybrid produced by open-pollination of `Sunkissed` (unpatented). `Sunkissed` was commercially available as a garden lily during the 1970's. The pollen parent for `Grandview` was produced by open pollination of `Chinook` (unpatented). `Chinook` was grown commercially in the United States and the Netherlands as a garden lily and cutflower variety during the 1970's and 1980's.
The flowers of my new lily are characterized by large, upfacing peach to pastel orange flowers with tiny, pollen-free anthers. The flowers have an unusual starry form, with all tepals approximately the same width. In addition, the clone possesses to a high degree desirable characteristics of hybird vigor. The clone is a good grower and propagator, as observed at 't Zandt, the Netherlands.
My new variety of lily plant has been asexually reproduced by me and under my direction at 't Zandt, the Netherlands. Successive generations produced by natural propagation from bulblets, by bulb scale propagation, and by tissue culturing from bulb scale explants have demonstrated that the novel and distinctive characteristics of my new variety are fixed and hold true under asexual propagation from generation to generation.


A system for tensioning and locking a safety strand to a number of sequentially arranged stanchions is provided. The system includes tensioning means for applying a tensile force to one end of the safety strand when the safety strand is passed through a passage bore of each of the sequentially arranged stanchions and the other end of the safety strand is secured to an immovable object. Locking mechanisms are provided that each include a cable cradle having a receiving channel for receiving a portion of the safety strand, a clamping arrangement for engaging and trapping the portion of the safety strand within the receiving channel, and a device for securing the cable cradle and clamping arrangement to a stanchion. The cable cradle and securing device are configured so that when the cable cradle is secured to the selected stanchion, the receiving channel is in registry with the passage bore.

The present invention relates generally to the field of safety barriers and more particularly to a system for maintaining tension in safety wires.
It is common practice in the construction industry to build a temporary or movable platform for a construction worker to stand on, and for supporting tools and materials. The platform may be supported by the ground, or may be suspended from above, or may be attached to a nearby large object such as the side of a ship. The platform may also be known as scaffolding, or staging. The platform may be used for constructing ships or constructing buildings.
It is common practice to place a safety barrier along the outside of the platform, in order to prevent the construction worker from falling from the platform. Falling from the platform may severely injure or kill the construction worker. Similarly, safety barriers may be placed around the perimeter of a dangerous hole or dangerous machinery. The term platform is defined broadly, and includes any approximately horizontal working surface from which a worker may fall. For example, the deck of a ship may be a platform.
Specifically, one common practice in the industry is to rig a safety strand through posts spaced at regular intervals along one or more edges of the platform. These posts may also be known as safety uprights, poles, or stanchions. The posts may be formed from any rigid member such as steel or iron channel stock having a hollow rectangular cross section, angle iron stock with an "L" shaped cross section, or pipe. The posts may be integrated into a support bracket for the platform, and the support bracket may be bolted or welded to the side of a ship or other structure. Horizontal wood or aluminum decking may link the support brackets to create a horizontal working platform.
The posts are typically linked with a safety strand in the form of a steel cable, or other line to prevent the construction worker from accidentally falling from the exterior edges of the platform. The steel cable may be positioned at any height, but is typically positioned at about waist high (about four feet high) above the horizontal surface of the platform. Additional cables may be positioned at other heights for additional safety. For example a second cable may be positioned horizontally at about two feet high. At the end of the platform, the cables may be attached directly to the structure.
The safety strand is attached to the vertical posts by various fastening techniques. One conventional fastening technique involves threading the cable through a hole in the post, looping the cable around the post and then proceeding to the next post. This technique, which may be referred to as "round turn" technique may also include forming a simple overhand knot to secure the strand to the post.
One problem with the round turn technique is that it requires the strand to be relatively flexible. This may place limitations on the material or diameter of the strand. In some cases, the strand may be sufficiently flexible to form a knot, but the resulting attachment may be relatively loose. This, in turn, may limit the ability to maintain sufficient tension in the strand.
Another problem with the round turn approach is that, even if a high degree of tension can be established initially, it may be difficult to maintain this tension. Workers have a tendency to lean on safety strands or place materials against them, which places the strand under additional tension. Application and removal of such additional loads can cause the strands to slacken over time.
The present invention eliminates the "round turn" technique, and creates a stable and secure attachment of the cable to the post. This stable and secure attachment creates and maintains a tight cable with relatively high tension.

System and method for tensioning and locking a safety strand

Newport News Shipbuilding and Dry Dock Company


A system and method to compensate for data defects within a magneto-optical computer memory device comprises a data channel coupled to the memory device for receiving and processing data signals, and a detector channel coupled to the data channel for detecting the data defects and then generating corresponding defect-skipping pulses. The data channel responsively uses the defect-skipping pulses to compensate for the data defects and thus maintain reliability of the data signals.

1. Field of the Invention
This invention relates generally to memory systems and more particularly to a system and method to compensate for data defects within a magneto-optical computer memory device.
2. Description of the Background Art
Providing reliable storage and retrieval techniques for digital information is an important consideration of manufacturers, designers and users of computing systems. In magneto-optical storage devices that use flying heads, digital data is written onto and read from the front surfaces of rotating disks of MO storage media. Referring now to FIG. 1(a), a plan view of a front surface 112 of a magneto-optical storage medium 110 is shown. In magneto-optical storage devices, digital data is typically written into and read from a series of concentric or spiral tracks 114 located on the surface 112 of storage medium 110. In practice, the digital data is read from the front surface 112 of storage medium 110 by projecting a laser-generated light beam from a flying head onto a selected track 114 while storage medium 110 is rotating, and then sensing the amplitude and polarization of light reflected back from the surface 112 of storage medium 110.
Referring now to FIG. 1(b), a cross-sectional view of the FIG. 1 magneto-optical storage medium 110 is shown. In operation, a flying head (not shown) is positioned above front surface 112. FIG. 1(b) includes several examples which illustrate possible causes of unreliable or invalid data in magneto-optical storage devices. The FIG. 1(b) examples include a corrosion defect 116, particulate contamination 118 and a "bright spot" 120. These examples are presented for purposes of illustration and defective data may readily be caused by various other factors.
The FIG. 1(b) examples each significantly alter the data read from the surface 112 of storage medium 110. Corrosion defect 116 and particulate contamination 118 each reduce the reflective properties of surface 112. This change in reflectivity reduces the MO signal amplitude of data read from storage medium 110. In contrast, bright spot 120 causes increased reflectivity in surface 112. This increase also reduces the mark sizes of data stored on storage medium 110, because bright spot 120 reflects the laser beam used to heat storage medium 110 during the data writing process. Bright spot 120 thus prevents data from being effectively written to storage medium 110.
In addition, front surface media is more prone to significant data defects due to causes such as particulate contamination 118. Conventional MO media has an active layer buried some distance below the media surface. Particulate contamination on conventional MO media may therefore be out-of-focus and hence unreadable. In contrast, the present invention uses front surface media 110 above which a flying recording head (containing optics and magnetic-field modulation coils) is used to record and sense MO data marks directly from the front surface 112 of storage medium 110. Particulate contamination 118 on front surface 112 thus has a greater impact on the data signal read from storage medium 110.
As discussed above, corrosion defects 116, particulate contamination 118, and bright spots 120 may cause data defects in front surface magneto-optical storage devices. Furthermore, magneto-optical storage devices may be unable to compensate for these data defects. Magneto-optical devices often contain automatic gain controls (AGCs) to control data amplitude and phase-locked oscillators (PLOs) to synchronize the data flow. A significant dropout or data defect, however, may disrupt AGC and PLO operation so severely that the magneto-optical device is unable to restore normal data amplitude or data synchronization. From the above discussion, it becomes apparent that the magneto-optical data is not sufficiently robust to defects. Therefore, an improved system and method are needed to compensate for data defects within a front surface media magneto-optical memory device.

System and method to compensate for data defects within a magneto-optical computer memory device


Aspects of the disclosure relate to controlling a first vehicle in an autonomous driving mode. While doing so, a second vehicle may be identified. This vehicle may be determined to be a tailgating vehicle. An initial allowable discomfort value representing expected discomfort of an occupant of the first vehicle and expected discomfort of an occupant of the second vehicle may be identified. Determining a speed profile for a future trajectory of the first vehicle that meets the value may be attempted based on a set of factors corresponding to a reaction of the tailgating vehicle. When a speed profile that meets the value cannot be determined, the value may be adjusted until a speed profile that meets the value is determined. The speed profile that meets an adjusted value is used to control the first vehicle in the autonomous driving mode.

Autonomous vehicles, for instance, vehicles that do not require a human driver, can be used to aid in the transport of passengers or items from one location to another. Such vehicles may operate in a fully autonomous mode where passengers may provide some initial input, such as a pickup or destination location, and the vehicle maneuvers itself to that location, for instance, by determining and following a route which may require the vehicle to respond to and interact with other road users such as vehicles, pedestrians, bicyclists, etc.

Using discomfort for speed planning in responding to tailgating vehicles for autonomous vehicles


A gas chromatography (GC) system comprises: a sample injector adapted to receive a liquid sample into an interior cavity thereof and to volatilize the liquid sample; a GC column configured to receive the volatilized sample from the sample injector; a carrier gas inlet line fluidically coupled to a gas inlet port of the sample injector; a septum purge vent line fluidically coupled to a first gas outlet port of the sample injector; a split-flow vent line fluidically coupled to a second gas outlet port of the sample injector; and a vacuum system configured to apply vacuum to the septum purge vent line, the split-flow vent line and the interior cavity of the sample injector. Alternatively, the vacuum system may be coupled to a vacuum port of the sample injector. A separate flow of helium gas may be supplied to an inlet of the GC column.

Traditional split/splitless (SSL) or programmed temperature vaporizing (PTV) injection ports for gas chromatographs typically consume large volumes of carrier gas by virtue of what is used at the split vent and septum purge vent rather than what is utilized for the actual analytical separation (column flow). To illustrate, a capillary column flow of approximately 1 standard cubic centimeter per minute (sccm) may have 50 sccm or more of split flow and 5 sccm of septum purge flow. One prior art method to reduce this consumption, e.g., "gas saver", can reduce the split flow following an injection period. Reducing the split flow to too low a value, however, can result in undesirable elevated baselines. This may be caused by a continual outgassing of higher molecular weight contaminants introduced from the sample matrix, outgassing of polymeric seals such as O-rings, injection port septa and/or coring of such septa, or be caused by oxidation of the column stationary phase due to larger concentrations of oxygen which has back-diffused through the septum. Reducing these contaminants has traditionally been accomplished through dilution by using large split flows. Thus, significant quantities of carrier gas may be consumed, even during chromatograph idle periods.
FIG. 1 illustrates a conventional gas supply and exhaust system 25 and associated split/splitless injector 1 of the prior art. The split/splitless (SSL) injector 1 is provided for receiving injections of liquid samples from a syringe (not illustrated), for flash vaporizing the liquid samples by application of heat, for mixing the volatilized sample material with a carrier gas and for providing a portion of the volatilized sample material to a gas chromatograph column 20. The carrier gas supply, e.g. helium, is introduced under pressure into a gas inlet line 7 by means of a gas fitting 3. A controlled pressure of the carrier gas is provided to the injector by an electronic pressure controller (not shown) which results in a controlled flow of carrier gas through column 20. A fine porosity filter 4, e.g. a stainless steel fit, removes any particulate matter that may foul operation of a proportional valve 5 that is disposed downstream in the gas inlet line 7. The proportional valve 5 maintains a setpoint pressure within the body of the injector 1 in response to measurements provided by pressure sensor 8 in order to establish a calculated flow in the analytical column in accordance with the Poiseuille equation. The pressure sensor 8 provides a feedback loop to a control circuit of the electronic pressure controller. Optionally, a chemical trap 6 is included in the gas inlet line 7 to scrub the carrier gas of potential contaminants, e.g. hydrocarbons and/or oxygen.
As is known, generally only a portion (and, frequently, only a small portion) of the volatilized sample material and carrier gas flow actually enters the column 20. The remainder of the volatilized sample material and carrier gas flow is exhausted from the system by means of septum purge vent line 13 and, frequently, split flow vent line 14. Flow restrictor 11 and flow restrictor 18, disposed, respectively, in the septum purge vent line 13 and split flow vent line 14 maintain a pressure difference between the exhaust ports 12, 19, which are at ambient pressure, and the higher-pressure segments of the vent lines 13, 14 that are adjacent to the injector 1. Pressure sensors 10, 17 measure the pressures of the high-pressure segments of the vent lines 13, 14. This information is provided as continuous feedback to the electronic pressure controller which calculates the pressure differences across the flow restrictors 11, 18 and operates the proportional valves 9, 16 so as to maintain desired flow rates within the vent lines 13, 14, in accordance with a mathematical calculation or calibrated lookup table. A chemical trap 15 may be included in the split flow vent line 14 to protect the proportional valve 16 from contamination by various oils and greases that may volatilize from the sample or outgas from injector components. Another similar chemical trap (not shown) may also be included in the septum purge vent line 13.
The injector 1 includes two basic modes of operation: split and splitless. In the split injection mode, a split flow is established that exits the split vent line 14. This mode of operation is used for injection of concentrated analytes to prevent overloading of the column or saturation of the detection system used at the terminal end of the column. In the splitless mode of operation, the split vent line 14 is closed (i.e., proportional valve 16 is closed) during a sample injection to cause the bulk of the sample material to be transferred to the capillary column. After a specified time interval, the split vent, line is once again opened to vent residual solvent vapors and to dilute any contaminants that might outgas from contaminated surfaces.
In both the split and splitless modes, far greater amounts of carrier gas are used for split flow and septum purge flow than are required for the gas chromatography (GC) column flow carrying out the analytical separation. During idle times following a split or splitless injection, large volumes of split flow are typically maintained to dilute outgassing of residual contaminants. Even during idle times, when the chromatography system is not in use and the column is cooled to room temperature, the injector remains at above-ambient temperature and under a continued flow of gas. This results in a large consumption of high purity gas, e.g. helium.
Helium, which is a finite natural resource, is becoming increasingly expensive and difficult to procure in some areas of the world. Helium is often the preferred gas of choice due to sensitivity, efficiency, chemical inertness, safety or other concerns. Alternative carrier gasses, e.g. hydrogen or nitrogen, can be used in some instances. For a mass spectrometer detection based system, hydrogen decreases sensitivity for electron ionization (EI) and can cause dehydrohalogenation reactions in the ion source while nitrogen can result in charge exchange reactions, and is known to be less efficient as a carrier gas. Thus, there is a need in the art for gas chromatography systems that conserve helium by restricting the times at which helium gas flow is applied to only those times when such helium flow is required and by restricting the flow rate of helium at such times to be not significantly greater than the minimum flow rate required.

Evacuable inlet for gas chromatograph injector


A lens holding frame includes a plurality of conical protrusions. The plural conical protrusions include a pitch of greater than or equal to 0.1 mm and less than or equal to 2.0 mm.

1. Technical Field
The technology disclosed herein relates to a lens barrel having a surface shape for scattering incident light.
2. Background Information
For a camera equipped with a lens barrel, a method has been conventionally proposed that extremely fine convexo-concave portions, aligned at a pitch (distance between adjacent apices) of less than or equal to light wavelength, are formed on the inner surface of the lens barrel (see Japan Laid-open Patent Application Publication No. JP-A-2007-304466).
However, the surface shape, formed by the fine convexo-concave portions described in the Publication No. JP-A-2007-304466, has a low strength and is easily damaged or broken. This poses a drawback of difficulty in handling of the surface shape in the assembling process of the lens barrel.
The present technology has been produced in view of the aforementioned situation. It is an object of the present technology to provide a lens barrel having a surface shape with an enhanced strength.

Panasonic Intellectual Property Management Co., Ltd.


A communication unit (10) transmits a first signal (12) that has a plurality of holes (44) therein during the occurrence of which another communication unit may interrupt. A repeater (14) receives the first signal and transmits a second signal (16) comprising the information in the first signal, and a plurality of digital coded squelch words synchronized with the holes to indicate the location of at least one of the holes in the first signal (i.e., the time at which at least one of the holes will occur). In one embodiment, each hole occurs after each pair of coded squelch words, and accordingly the pairs of coded squelch words are marked to indicate the times of occurrence of holes in the first signal.

Electronic quasi-duplex communication units use holes in their transmissions to allow other radios receiving those transmissions to interrupt the transmissions, thus obtaining quasi-duplex communication. The interrupting communication unit must send a (high speed data) request packet at the proper time (i.e., when the other radio is "listening"). Therefore, electronic duplex radio communication systems require transmission of synchronization or timing signals informing the receiving radios the location of those holes to enable them to interrupt at the proper time. This is done with low-speed signaling. Moreover, it is desirable for electronic duplex radios to be compatible with existing simplex communication systems. The simplex communication systems include a plurality of simplex communication units with sequential, as opposed to simultaneous, talk and listen capability. In simplex systems, the communication units are generally grouped with each other such that communications directed at one group is not heard by others in different groups. Such selective communication capability is achieved by sub-audible coded squelch signals. Such coded squelch signals could comprise analog sub-audible tone coded squelch signals or digital coded squelch signals.
Quasi-duplex communication units may not operate in a simplex communication system because such system does not provide hole timing information to enable the communication units perform their interruption routines for establishing a quasi-duplex communication. On the other hand, the quasi-duplex communication systems do not provide the coded squelch capability needed for selective communication among the simplex communication units. It is, therefore, desired to provide communication capability among quasi-duplex communication units and the simplex communication units in an integrated communication system.


Disclosed are a laser ablation system and method for determining the presence of trace elements in liquid samples such as oils, and/or in powder samples. A sample containing microporous membrane is utilized to prevent "splashing", "splattering" and/or "scattering" of liquid and/or powder sample when laser contained sample effectively "nebulizing" energy is applied. The present invention is typically used in combination with an inductively coupled plasma and a detector system, such as an Atomic Emission Spectrometer or Mass Spectrometer.

Analysis of low viscosity liquid and/or powder samples to determine the presence of analytes, (eg. trace elements and/or contaminates etc.), present therein, is often accomplished by "nebulization", followed by injection of said nebulization products into a detector system which can be comprised of, for instance, an Inductively Coupled Plasma-Atomic Emission Spectrometer (ICP-AES) or an Inductively Coupled Plasma-Mass Spectrometer (ICP-MS) system. Nebulization of low viscosity liquid sample or solvated powder sample, for instance, can often be easily achieved by Pneumatic, Direct Injection and Ultrasonic etc. sample nebulizer systems. Said nebulizer systems generally produce numerous small diameter droplets of analyte containing liquid, (eg. solvent), which, typically after desolvation, are suitable for injection into an Inductively Couple Plasma (ICP). (Note that a patent to Zhu et al., U.S. Pat. No. 5,259,254 describes an Ultrasonic Nebulizer system and a patent to Wiederin, U.S. Pat. No. 5,212,365 describes a Direct Injection Micronebulizer System).
High viscosity liquid samples, however, often can not be directly subjected to nebulization because of their viscosity limited flow properties. As a result, known sample preparation methods such as Ashing, Acid Digestion and/or Organic Solvent Dilution are practiced to provide a sample which can be effectively nebulized by typical nebulizer systems, and entered to an ICP-AES and/or ICP-MS. It is well recognized, however, that said Ashing, Acid Digestion and/or Organic Solvent Dilution sample preparation approaches are tedious and time consuming and practice thereof often does not result in desired sample analysis sensitivity and accuracy. The ashing approach, for instance, (which utilizes an oven or microwave source to convert a sample to an ash), often results in vaporization of, poor recovery of, and poor detection of highly volatile elements, (eg. boron, vanadium, arsenic, sulfur and phospherous), and as mentioned, said procedure can be very time consuming. The acid digestion approach, (which involves digestion of a sample by an acid (eg. nitric), followed by mixture with a solvent), is also very tedious and time consuming. For emphasis, it is noted that a simple low viscosity liquid sample nebulization procedure might require one (1) minute or so to practice, while an acid digestion might require, relatively speaking, four (4) to eight (8) hours. As well, the Organic Solvent Dilution approach often leads to introduction of added volatile organic solvents into a subsequently utilized ICP, and said volatile organic solvents can cause plasma instability and low analyte detection sensitivity.
An alternative sample preparation approach, which can produce effectively "nebulized" sample products appropriate for entry to an ICP, involves Laser Ablation. (It is noted that the practice of Laser Ablation involves application of focused Laser contain energy onto a sample, and requires on the order of seconds to practice). It is known that Laser Ablation is very well suited to use with solid samples, however, when Laser contained energy is applied to liquids and/or powder samples, the result often includes "splattering", "splashing" and/or "scattering" effects, rather than, (or in addition to), the desired effective "nebulization" effects. To date said "splattering", "splashing" and/or "scattering" effects have made application of Laser Ablation to "nebulize" liquid and/or powder samples impractical. A system and method which would essentially eliminate said "splattering", "splashing" and/or "scattering" effects, and which would allow Laser contained energy to be applied to a liquid and/or powder sample with the primary result being production of effectively "nebulized" sample, would therefore be of great utility. The present invention provides such a system and method.
With the foregoing in mind a search of patents was conducted with the result being that very little was found. A patent to Carlhoff et al., U.S. Pat. No. 5,537,207, however, was identified, as was a patent to Kirkpatric et al., U.S. Pat. No. 5,194,910. The former patent describes use of Lasers to produce a plasma from which are emitted wavelengths that identify the carbon-black content in materials, while the later patent describes spectroscopic analysis of light transmitted through oil. No known prior art, however, describes or even remotely suggests the sequestering of liquid and/or powder samples in pores present in a microporous membrane prior to application of Laser contained energy thereto to ablate said combination liquid and/or powder sample and microporous membrane, with the result primarily being effective "nebulization" of said liquid and/or powder sample, without accompanying, undesirable "splattering", "splashing" and/or "scattering". The present invention teaches such a utility providing system and method.

System and method of determining trace elements in high viscosity liquids, and powders, utilizing laser-ablation


Systems and methods for pipe lining systems and methods of use are described. Systems and methods may include a CIPP lateral liner that is inserted into a bladder forming a CIPP liner assembly that can be inserted into a pipe line for a pipe repair. CIPP liner assembly can include a membrane that produces superior results compared to the prior art. A backing ring may be used with these systems and methods.

Needs exist for improved systems and methods for repairing pipes, including underground sewer pipes. Underground pipes can leak or become susceptible to inflow and infiltration ("I/I") for a number of reasons. Junctures where lateral pipe lines meet or branch from main line pipes are one area that can require unique repair methods.
Lateral pipe lines are often the pipes that lead from a main pipe line to smaller pipes or homes. For example, main pipe lines often run generally horizontally relative to the ground and a lateral pipe line is installed at some upward angle off of the main pipe line. A lateral pipe line may be positioned at 90 degrees relative to a main pipe, i.e., a "T", or an angle less than 90 degrees, i.e., a "Y". At times, lateral pipe lines are installed after main pipe lines have been installed and the juncture may have never been properly sealed.
In some situations, a hole may be required in a main pipe line, e.g., for a lateral pipe line to be inserted or connected to the main pipe line. This may allow for I/I from the moment the lateral pipe line is installed. Even for lateral pipe lines initially installed correctly, problems can arise over time that damage or weaken the juncture allowing for I/I. The surrounding earth may shift, plant roots may infiltrate the juncture, or flexural problems such as those from cars passing over underground pipes, may arise and cause I/I at the juncture.
Prior art devices and methods have attempted to solve this problem using various cured-in-place pipe (CIPP) repairs devices but have not done so successfully. Some prior art methods rely on a "T" or "Y" shaped liner that is inserted in the main pipe line and lateral pipe line to repair the damaged juncture. These devices and methods, however, have not achieved sufficient results. Moreover, positioning the repair device in the pipe so that it can be positioned in the correct location underground can be time consuming and difficult, especially once a liner is saturated in resin. A prior art example is described in U.S. Pat. No. 6,039,079, which is incorporated by reference in its entirety, but the examples of that disclosure do not adequately solve the problems solved by the devices and methods described herein, such as inter alia, providing improved adherence to a host pipe. Another prior art example that did not solve the problems solved by the devices and methods described herein is U.S. Pat. No. 7,503,349, which is incorporated by reference in its entirety.


A connecting structure of a first holding device and a second holding device that are respectively configured to hold a first elongated member and a second elongated member, may include a cylindrical anchor formed on the first holding device and having an engagement claw, and an insertion hole formed on the second holding device and configured such that the anchor is introduced thereinto and the engagement claw engages a circumferential periphery thereof. The first and second holding devices are configured to be rotated relative to each other about an axis of the anchor in a connected condition of the first holding device and the second holding device in which the engagement claw engages the circumferential periphery of the insertion hole. The first and second holding devices include a distortion prevention mechanism configured to prevent the anchor from being distorted in the connected condition of the first and second holding devices.

The disclosure relates to holding device connecting structures. More specifically, the disclosure relates to holding device connecting structures that are configured to connect or couple two holding devices each of which is configured to hold an elongated article (e.g., wiring harness).
Conventionally, a combination of two holding devices (clips) that are respectively configured to hold two elongated articles (e.g., two wiring harnesses) at regular intervals are known. Such a combination of the holding devices is taught, for example, by Japanese Patent No. 3314115. In the combination of the holding devices taught by Japanese Patent No. 3314115, the holding devices are rotatably connected to each other via connecting shafts, so as to rotate relative to each other. According to the combination of the holding devices, even if relative misalignment of the elongated articles is produced, the holding devices may rotate relative to each other, so that such misalignment of the elongated articles may be effectively absorbed. As a result, the elongated articles may be suitably held by the holding devices.
However, in the combination of the holding devices, when the holding devices are unexpectedly subjected to an excessive external force via the elongated articles held thereby, the connecting shafts of the holding devices may be excessively skewed or distorted. As a result, the holding devices may be prevented from smoothly rotating relative to each other.
Therefore, there is a need in the art for an improved holding device connecting structure.


A power conversion device formed of a converter for rectifying a single-phase AC  voltage to a DC voltage and an inverter for driving an AC motor by converting the DC voltage to an AC voltage includes: a first compensation unit that uses a frequency component twice the frequency of the single-phase AC voltage with respect to the DC voltage outputted from the converter or a current outputted from the inverter as a compensation value for at least one of a torque command value, a current command value, a voltage command value, a frequency command value, and a phase angle command value; and a second compensation unit that uses the DC voltage outputted from the converter or a current outputted from the inverter after being subjected to low frequency cut-off processing and gain processing.

For example, a drive device of an electric car adopts a configuration in which AC from a power collector, such as a pantograph sliding on wiring connected to an AC power supply, is converted to DC by a converter via a transformer, and DC is further converted to three-phase AC power via an inverter so as to drive a three-phase induction motor.
In the power conversion device in the related art of this type, a DC voltage at an output end of the converter is superimposed with a component that pulsates at twice the frequency of an AC power-supply voltage and this component becomes a factor of a beat in an output current of the three-phase induction motor. In order to suppress this beat phenomenon, there has been proposed a technique aimed at cancelling out a frequency twice the frequency of an AC power-supply voltage in the DC voltage by detecting a harmonic component twice the frequency of the AC power-supply voltage and adjusting a slip frequency of the induction motor on the basis of the detection result (see PTL 1 and PTL 2). By increasing a capacity of a smoothing capacitor provided to a DC stage, this pulsation frequency component can be reduced to some extent but cannot be removed completely. Also, such an increase of the capacity raises a problem that a size of the device becomes larger.


A printing control system, including a printer control apparatus and a host control apparatus, the printer control apparatus including: a first communication unit configured to transmit to the host control apparatus a reception request signal, which is for prompting the host control apparatus to transmit a transmission request signal; and a second communication unit configured to transmit data to the host control apparatus when receiving the transmission request signal, the host control apparatus including: a third communication unit configured to receive the reception request signal; and a fourth communication unit configured to, when receiving the reception request signal, transmit the transmission request signal, which is for prompting the printer control apparatus to transmit the data.

1. Field of the Invention
The present invention relates to a printer control apparatus, a printing control method, and a printing control system.
2. Description of the Related Art
There have been known printing control systems in which a host-side control apparatus and a printer-side control apparatus are connected by a Universal Serial Bus (USB) interface.
In such printing control systems, communication between a host (a host control apparatus) and a device (a device control apparatus) that have a master-slave relationship is controlled and, when data is to be transmitted from the device side to the host side, the device side is not allowed to transmit the data to the host side until a transmission request signal from the host side is received on the device side. The host side does not know when data to be transmitted is generated on the device side, and accordingly needs to send a transmission request signal regularly to the device side.
The host side in the systems described above also needs to regularly send a check request signal to the device side in order to check the error status on the device side regularly. Receiving the check request signal, the device side transmits a response signal to the host side.
A known technology of this type is to regularly transmit from a host to a printer apparatus (a device control apparatus) a signal that indicates that the connection between the host and the printer apparatus is in a normal state.
However, printing control systems of the related art have a problem in that increasing the frequency of transmission of the signal that is transmitted regularly from the host slows down the overall communication speed of the system. Decreasing the frequency of transmission gives rise to an opposite problem in that the amount of data waiting to be transmitted builds up, which causes troubles such as a loss of data to be transmitted from the device and the shutting down of the device.
For those reasons, a printer control apparatus, a printing control method, and a printing control system that are capable of improving the overall communication efficiency of a system have been waited for in the technical field of the present invention.

Printer control apparatus, printing control method, and printing control system for transmitting a reception request signal and adjusting a transmission interval of a transmission request signal


A current control device capable of performing widely applicable failure detection without a motor rotation speed sensor is provided. A current control semiconductor element includes, on a same semiconductor chip, a transistor that drives load, a current detection circuit that detects current of the load, a compensator that calculates an on-duty of the transistor from a current command value and a current value output from the current detection circuit, and a PWM timer that generates a pulse turning on the transistor on the basis of the on-duty. A microcontroller sends the current command value to the current control semiconductor element, receives the current value output from the current detection circuit and the on-duty output from the compensator from the current control semiconductor element, and detects failure of the current control semiconductor element on the basis of the received current value and on-duty.

There has been widely used an electric actuator such as a motor and a solenoid in order to convert an electrical signal into mechanical movement or hydraulic pressure with the increase in electronic control of various controlled objects. On the other hand, when an electric actuator is used for control that involves human life such as control in a motor vehicle, the electric actuator is required to have high reliability.
In order to improve reliability of an electric actuator, it is necessary to reliably detect failure of a current control device which is used in the electric actuator, and then, depending on the type of the detected failure, perform a fail-stop function for stopping the failed current control device so as to prevent an unsafe state of a host system, or a fail-operative function for continuing current control while avoiding the use of a failure part when the current control is possible.
As a current control device that detects failure of a current detection circuit whose failure is difficult to be detected, there is known one that detects failure of a current detection circuit by using the output of a motor rotation speed sensor in addition to the output of the current detection circuit (see PTL 1, for example).


A semiconductor device comprising a first insulating layer formed above a semiconductor substrate, and comprising a first insulating material, a second insulating material and a hole, a relative dielectric constant of the first insulating material being 3 or less, a Young's modulus of the first insulating material being 10 GPa or less, a linear expansivity of the first insulating material being greater than 30×10−6° C.−1, and a linear expansivity of the second insulating material being 30×10−6° C.−1 or less, and a second insulating layer formed on the first insulating layer, the second insulating layer having a groove connected to the hole, wherein a linear expansivity α of the first insulating layer within 6 μm from the hole is 30×10−6° C.−1 or less, where

1. Field of the Invention
The present invention relates to a semiconductor device having a via plug formed from Cu.
2. Description of the Related Art
In order to accelerate an LSI operation, an insulating film with a low dielectric constant is used as an interlayer insulating film. This insulating film is formed by lowering a density of a material for the film or eliminating polarity in the material. For example, a porous material is generally produced in order to lower a material density. As a result of lowering a film density in order to lower a relative dielectric constant, there is a tendency that the Young's modulus decreases with a decrease in relative dielectric constant, thus the linear expansivity increases. In particular, in recent years, in a low dielectric insulating film with a relative dielectric constant of 3.0 or less used to reduce a low dielectric constant, in general, the Young's modulus has been as low as 10 GPa or less, and the linear expansivity has been greater than 30×10−6° C.−1.
In a high temperature process such as annealing or sintering, with an electrically conductive material such as a barrier metal or an interlayer insulating film, a thermal stress is generated due to a linear expansivity difference from materials which form interfaces, respectively. A linear expansivity of Cu which is a wiring material is as great as about 16 to 30×10−6° C.−1 in the temperature range from room temperature to 500° C. However, a barrier metal layer used between Cu and an interlayer insulating film includes a high melting point metal such as Ta or Ti or its component, with a linear expansivity is 10×10−6° C.−1 or less.
Therefore, in the case where a low dielectric constant insulating film has been used as an interlayer insulating film, a high concentration of a great tensile stress occurs with a barrier metal layer which is smaller than both of Cu and the insulating film with a low dielectric constant in linear expansivity. Since it is sandwiched between Cu having a comparatively high linear expansivity and the insulating film with a low dielectric constant. A thermal stress generated with this barrier metal increases with an increase in linear expansivity of a low dielectric constant insulating film disposed in the periphery of an electrically conducting layer such as a wire or a via plug. In particular, in the case where the linear expansivity of the insulating film with a low dielectric constant is greater than that of Cu (30×10−6° C.−1), a thermal stress applied to the barrier metal layer rapidly increases.
At a side wall portion of the via plug, film thickness of the barrier metal is thinner than that of another portion. Thus, there is a possibility that a crack occurs because of a thermal stress which affects a barrier metal layer. In general, a low dielectric constant insulating film has a low breakage strength, and the crack generated with the barrier metal layer may be advanced up to the inside of the low dielectric constant insulating film. As a result, with respect to an electrically conductive material such as Cu which is in a compression stress state at a high temperature, a short-circuit failure may occur due to the breakage caused by a crack (Jpn. Pat. Appln. KOKAI Publication No. 2003-197742).

Abstract: α    =                  ∑                  i          =          1                                            v          i                                  α          i                      ,vi and αi are a volume ratio and a linear expansivity of an i-th insulating material.


A device for delivery of flowable media, especially of lubricants, includes a pump (1) driven by a motor and forming a component of a line system. At least one heating element (21) activated by energy supply is located outside of the housing (3) of the pump (1) in a position enabling heat transfer to the housing (3).

In known means of this type, under certain unfavorable operating conditions the danger exists that malfunctions, for example, a drop of delivery output, pump overload, or even its failure will occur. These difficulties can occur especially when overly low oil temperatures occur as lubricating oils are being delivered in a lubricant circuit. These operating states prevail, for example, during cold running phases of certain systems, or occur in wind power plants under winter conditions that can last over longer time intervals. The corresponding strong increase in the viscosity of the lubricating oils to be delivered leads at least to a reduction of the delivery output, resulting in danger to the assigned machinery system, or in less favorable cases leads to overloading or even failure of the pump. This situation in turn entails corresponding subsequent damage to the pertinent system.

Means for delivery of flowable media, especially lubricants


A non-packaged semiconductor chip testing apparatus includes a lead frame having chips with a plurality of leads which are electrically isolated from the other leads, and are supported by adhesive tape and bonded to the chip via wires. The lead frame is placed on a holding plate having windows, so that the leads of the lead frame are exposed through the windows and contact test probes located under the plate. The test probes, such as pogo pins or bending leads, extend upwardly from a substrate. A base receives the substrate, with cables extending from a lower surface of the substrate passing through openings in the base, where they then connect a test board. After being pressed down by a pressing cover, the lead frame on the holding plate moves down so that the leads may contact the test probes. The pressing cover is movable up and down. Guide pins on the base are simultaneously inserted into through holes of the holding plate and lead frame, and extend into recesses in the pressing cover to ensure alignment.

1. Field of the Invention
The present invention relates generally to a testing apparatus for semiconductor devices, and more particularly, to an apparatus which is used to perform an alternating current (AC) test and a burn-in test on non-packaged or bare semiconductor chips.
2. Description of the Related Art
The semiconductor industry is now producing multi-chip modules (MCM) in which multiple semiconductor chips are mounted on a circuit board, rather than utilizing a single chip package. The multi-chip module (MCM) have several advantages including faster operating speeds, larger capacity, and higher integration densities.
Although these advantages are significant, the MCM suffers some drawbacks. As compared with the single chip package technique, the MCM has an increased integration scale, but the production yield is significantly decreased. Such a low yield means that an undesirably large quantity of material must be discarded or reworked, which is very expensive and labor intensive.
Therefore, it is important to identify known good die (KGD) to increase the production yield of the MCM. Known good die (KGD) are semiconductor chips which are not packaged but which have proven to be reliable after completing tests at the same level as the conventional package technique. The successful development of the MCM depends on the availability of the KGD.
Semiconductor chips are generally subjected to a series of test procedures in order to assure the reliability of the chips. One of these test procedures is an AC test in which all input and output terminals are connected to a test signal generating circuit to verify the transferring characteristics between the incoming and outgoing signals.
Another test is a burn-in test in which a given chip is overstressed, that is, the chip is subjected to higher than normal operating temperatures and voltages to verify its lifetime. These tests allow a manufacturer to identify defective chips and preclude potential failures which may occur after assembly or processing.
However, bare chips do not have external leads so it is difficult to electrically connect a non-packaged chip or a bare chip to the test signal generating circuit unless the chip is packaged. Thus, the tests are generally carried out by packaging the chip with external leads connected to chip pads, and connecting the external leads to a test socket, which is then mounted onto a test board. But, this test technique has disadvantages such as the cost involved in packaging a potentially inferior chip. Also, the tests are performed on one chip at a time, which limits the number of bare chips that may be tested in a given amount of time.
An apparent solution to these problems was proposed in U.S. Pat. No. 5,006,792, which provides a flip chip test socket adapter to perform the AC and burn-in tests with a bare chip, in which a plurality of solder bumps are formed on the bonding pads of the chip. As stated in the '792 patent, the flip chip is inserted into the test socket adapter and is subjected to the tests. The test socket adapter includes a substrate provided with cantilever beams to accommodate silicon substrates that are not perfectly flat or solder bumps that are not identical in size. The test socket adapter allows the bare chip to be tested prior to being packaged.
However, in this conventional technique, expensive chip test equipment must be provided so as to precisely form the solder bumps on the bonding pads of the chip due to a fine pitch between the bonding pads. Another problem is that the chip test is performed on only one chip at a time in order to assure the reliability. Thus, the cost for one validating a KGD is increased and the testing procedure is not advantageous for producing a large number of the KGDs. Furthermore, the chip must be individually handled during the test which makes it more difficult. Moreover, whenever the structure of the chip to be tested is changed, the structure of the above-described socket adapter must also be modified to correspond to different configurations of bonding pads.
Another technique for testing the bare chip is disclosed in U.S. Pat. No. 5,479,105 which provides a die testing apparatus including a lead frame which has bare chips mounted on die pads. The die pads are supported by tie bars and the leads are supported by an adhesion tape. The bare chips are connected to leads through wires. The lead frame is placed in a test socket which includes an under socket and an upper socket. The under socket has slot grooves and the upper socket, which is connected via a hinge with the under socket, has slot holes and test probes contacting the leads of the lead frame. The lead frame is fixed between the upper and under sockets by means of pins penetrating the slot holes and guiding holes located at a periphery of the lead frame, and then being inserted into the slot grooves. One side of the lead frame is fixed between the upper and under sockets by a clamp. The test socket, which has a plug portion with electrical contacts thereon, is located at an edge of the socket so that it can be plugged into a testing board.
Although this testing technique overcomes the problems of the above-described technique, it still suffers some drawbacks. First, since the plug portion of this test socket must be perpendicularly inserted into a test board, the lead frame having the bare chips connected to leads through the wires is oriented in an upright position. Accordingly, the wires are liable to break under harsh environments. Second, pins must be inserted through the slot holes, guiding holes and the slot grooves whenever the test socket is closed, which takes time and lowers productivity.

Testing apparatus for non-packaged semiconductor chip


A process for preparing a sign that includes the steps of providing a sheet of material; defining on a surface of the sheet a series of image-bearig areas and non-image-bearing areas; treating the surface of the sheet with an essentially solvent-free composition comprising a colorant and a polymeric binder to selectively deposit the composition on the non-image-bearing areas of the surface of the sheet; and fusing the composition to create a continuous polymer film on the non-image-bearing areas.

This invention relates to manufacturing signs such as traffic signs and license plates.
Signs such as traffic signs and license plates feature a backing in which a series of images, e.g., alpha-numeric characters, symbols, artwork, and the like (the "image-bearing areas") is set against a background (the "non-image-bearing areas"). The characters may be clear, in which case the background is colored. Alternatively, the sign may consist of colored characters set against a clear background. The characters typically are formed using techniques such as embossing (in which the characters are defined mechanically) or printing (in which the characters are defined electronically or digitally).
Often the signs are provided with a retroreflective property to enhance visibility. This may take the form, e.g., of a retroreflective sheet placed over the image-bearing and non-image-bearing areas. Alternatively, the backing itself may be a retroreflective sheet. To protect the sign from, e.g. weathering and abrasion, a clear "top coat" may be included as well.

Minnesota Mining and Manufacturing Company


An irrigation cannula is provided for irrigating a chest cavity during thoracoscopic surgery. The cannula includes a bowl with a drain opening, and a hollow leg extending from the bowl beneath the drain opening. An obturator has an upper handle and a lower end which is manually pushed through the drain opening and into the leg so that a handle resides in or above the bowl and a tip extends beyond the end of the leg. The obturator facilitates insertion of the cannula leg through the incision and into the chest cavity. After the cannula is in position, an irrigation solution is added to the bowl, and drain through the leg into the chest cavity.

During chest surgery, it is sometimes necessary to fill the pleural space with a large volume of irrigation solution in order to check for bronchial stump leaks, or to facilitate cleaning and evacuation of debris and other biologic substances from the chest cavity. There are no prior art devices which manually accomplish this irrigation function. Existing prior art devices for chest surgery require the use of power and have been expensive and complex.
Therefore, a primary objective of the present invention is the provision of a thoracoscopic irrigation cannula for manually irrigating the chest cavity during chest surgery.
Another objective of the present invention is the provision of a thoracoscopic irrigation cannula which can rapidly deliver large volumes of solution to the pleural cavity through thoracoscopic surgical incisions between the ribs with minimal slippage.
A further objective of the present invention is the provision of a thoracoscopic irrigation cannula that is simple and safe to use, and easy to manufacture. For example, the need to provide a power source is eliminated.
These and other objectives will become apparent from the following description of the invention.


A drill hole measuring device and a rock drilling unit equipped with the measuring device. The measuring device (1) comprises a protective element (3), inside which a sensor (6) can be transferred by means of a transfer device (4).

The invention relates to a drill hole measuring device comprising: a frame; at least one sensor; an elongated transmission element connected to the sensor; at least one transfer device, by which the transmission element can be moved longitudinally in at least one direction for moving the sensor in the drill hole.
The invention also relates to a rock drilling unit comprising: at least one feeding beam; at least one rock drilling apparatus, which is movable with respect to the feeding beam; and at least one measuring device for measuring drill holes, the measuring device comprising: a frame; at least one sensor that can be arranged in a drill hole; an elongated transmission element connected to the sensor; and at least one transfer device, by which the transmission element can be moved longitudinally for moving the sensor in the drill hole.
In measuring the straightness and dimensions of downward-oriented drill holes it is typical that a sensor, supported by a cable, is lowered into the drill hole. The measuring device may comprise a winch, by which the sensor can be lowered and lifted in the drill hole. Alternatively the measuring device can be arranged in connection with the drilling boom, whereby the sensor is inserted into the drill hole by means of a suitable transfer device and a flexible transmission element, such as a hose or a rod. A device of this kind is disclosed in U.S. Pat. No. 6,460,630. Prior art solutions, however, have a draw-back that the handling of the sensors is difficult and while being transferred the sensor is subjected to knocks and mechanical stress. Sensitive sensors may get damaged and both measuring inaccuracy and extra costs may occur.

Drill hole measuring device and rock drilling unit


Methods and systems of the prior art for cleansing a plurality of seriate filter cells in automatic backwash filters by backwashing the cells one at a time with backwash liquid wherein the cleansing operation on the active cell is prevented from moving to a further cell until the contaminant content of the waste liquid issuing from the previous cell reaches a predetermined low level are improved by overriding such prevention even though such content remains too high when a prescribed quantity of waste liquid has issued from the previous cell, e.g., as determined by a timer or fluid meter.

1. Field of the Invention
This application relates broadly to improvements in automatic backwash filtering systems. More particularly, it concerns improved devices and methods for control of backwash operations in such systems.
2. Description of the Prior Art
Automatic backwash filter systems are known in the art as exemplified in U.S. Pat. Nos. 3,239,061; 4,133,766; 4,617,131; 4,764,288; 5,089,117 and 5,147,560 currently assigned to Infilco Degremont Inc., the assignee of the invention disclosed herein. The disclosures of these patents are incorporated herein by reference.
A principal use of automatic backwash filter systems is to produce potable water in water treatment plants many of which are subject to state or other governmental regulatory agencies that set standards and conditions concerning the operation of the systems and the quality of the effluent. For example, many such agencies require that, following backwash in filter beds of a potable water treatment plant, the effluent from such filter beds can not be placed back on the service line, but must be sent to waste, until their contaminant content reaches a predetermined acceptable low level, e.g., a turbidity of <0.25 NTU. When this contaminant content level is reached, the filter beds can be put back in service.
The Nichols U.S. Pat. Nos. 5,089,117 and 5,147,560 respectively disclose methods and apparatus for monitoring the operation of automatic backwash filters through turbidity measurement of effluent and halt movement of backwashing from one cell (bed) to a subsequent cell until the level of turbidity of effluent from the active cell has reached a required value. However, these methods and apparatus do not address the often occurring need to keep the automatic backwash filter in service even when one or more of the many cells therein do not operate in a manner to meet the contaminant content requirement. The present invention addressed this situation and provides devices and methods that permit operation of the automatic backwash filter to continue in spite of the presence therein of one or more problem cells.

Filter bed backwashing devices and methods


Systems and methods are disclosed for event-based application control. A system extension is configured to leverage an endpoint security API for monitoring event activity within operating system kernel processes. The system extension registers with the endpoint security API particular event types for which the system extension would like to receive notifications. In response to receiving notifications regarding detected events corresponding to the registered event types, the system extension determines if the event, and its corresponding process, are safe and allowable to execute. In various embodiments, the system leverages whitelists, blacklists, and rules policies for making a safeness determination regarding the event notification. The system extension transmits this determination to the operating system via the endpoint security API.

Computer operating systems have generally provided developers with access to kernel space for various reasons, such as, for example, for allowing dynamic loading of code (e.g., plug-ins, KEXTS, etc.) into kernel space for monitoring activity within the kernel space. However, newer versions of operating systems, such as the MACOS® operating system, no longer allow such access to kernel space for some activities, as some kernel access mechanisms (e.g., KEXTS) were prone to introducing detrimental inefficiencies into the executed process (e.g., "frozen screens" in response to a hanging state of an executed process). Instead, these newer operating system versions provide limited access to activity from user space (e.g., via Apple's Endpoint Security API), without providing access to kernel-level control of the activities. Therefore, there exists a long-felt but unresolved need for systems and methods for controlling applications based on events identified within the kernel space, without directly accessing the kernel space.

Systems and methods for event-based application control


A teat dip applicator and method direct a teat dip to a teat cup liner head that defines a chamber and nozzle through which teat dip flows to coat an animal teat prior to and during detachment of a milker unit from a dairy animal.

This invention relates generally to teat dips for dairy animals and more particularly to methods and apparatus for applying teat dip to dairy animal teats and udders after milking and before detachment from a milker unit.
After milking, a dairy animal's teats can be protected with a post-milking dip ("post-dip") that protects the teats from infection. The post-dip is typically applied by an operator by dipping a liquid, spraying a liquid or applying a foam. This process is performed each time the animals are milked, and is generally useful in reducing the incidence of mastitis.
One approach to simplifying this procedure is to apply the post-dip before the milker unit is detached as disclosed in WO 02/23976 A1, which is incorporated herein by reference. Nonetheless, with such a system there may only be limited coverage of the teat. Therefore, there is a need for apparatus and methods for applying post-dip to a dairy animal's teats and udder in an efficient manner.

Liner contact automatic teat dip applicator


A sealing strip to be used with the rim of a wheel, particularly the rim of a so-called box section bicycle rim, as well as a rim equipped with such a sealing strip, and a wheel having such rim and sealing strip. The sealing strip is formed by a continuous annular strip having, in cross section, a median depression, forming a U-shaped radial groove provided to be positioned within in the central well of the rim, two lateral extensions provided to be supported upon on the interior edges of the rim that border of the well, and two lateral walls provided to extend along the flanges of the rim. The walls of the sealing strip are extended by a pair of lips that project toward the inside relative to the walls of the sealing strip, the lips being adapted to be positioned adjacent the lips of the rim.

1. Field of the Invention
The invention relates to a sealing strip to be used with the rim of a wheel, such as the rim of a bicycle wheel, as well as to a rim equipped with such a sealing strip. The invention also relates to a wheel, particularly a bicycle wheel, having a rim equipped with such a sealing strip.
More specifically, the invention relates to a sealing strip that is provided to facilitate the mounting of a tubeless tire.
2. Description of Background and Relevant Information
Traditionally, a rim has an outer annular channel provided to receive a pneumatic tire, and the bridge that demarcates the base of this channel is bored with openings that are used to position the spoke nipples or the spokes themselves according to the spoke arrangement that is implemented for the wheel.
The use of a tubeless tire mounted upon the rim has advantages including, in particular, less weight of the complete wheel, less inertia, a better contact of the wheel with the ground and, consequently, an improved grip with the surface of the ground, and less risk of a flat because of a reduced risk of pinching.
There are wheels for tubeless tires for which the upper bridge is not bored with openings for spokes. Because this bridge is not bored, it is therefore air impermeable. Such a construction is described, for example, in the patent publication EP 893 280 and U.S. Pat. No. 6,257,676.
For conventional rims whose upper bridge is bored with openings, it has been desired to cover this bridge with a strip of material that blocks the openings of the bridge in a manner that is air impermeable.
Such constructions are described, for example, in patent documents DE 37 15 669, EP 615 865, U.S. Pat. No. 5,538,058, FR 2 744 953, and DE 201 08 416. There are also devices commercially made by MAXXIS®, TREK®, and PANARACER®.
Existing systems yield good results; however, they are not completely satisfactory. Indeed, there are numerous problems to overcome.
First of all, there is the mounting of the strip of material itself on the rim, its retention on the rim, and the mounting of the tire. Secondly, there is the problem of inflating the tire and, more particularly, the problem of inflating with a pump having a low output, i.e., a light-duty pump.
Additionally, there is the problem of the seal, or impermeability, between the tire and the base of the rim.
The shape of a rim that has, on the outside, the shape described in EP 893 280 and U.S. Pat. No. 6,257,676 has yielded good results with regard to primary inflation. However, it has been noted that, particularly in the case of high pressure, the tire beads can rise out of their seatings. There is then the risk that the bead can locally separate from the base of the rim. Air can then pass behind the strip of material, i.e., between the strip of material and the rim itself. This air passes into the rim housing and escapes through the openings of the housing. This air is lost, generating a loss of pressure in the tire.

Sealing strip for a rim of a wheel and a rim having a sealing strip


An object can be deformed in a remarkably short processing time. The image processing system (10) comprises: a first mesh creating section (36) for creating data on such an intermediate triangular mesh that the secondary error metric representative of the difference between an original triangular mesh and a processed intermediate triangular mesh is minimized for a triangular mesh of original shape while allowing rotation and enlargement/contraction thereof according to information about a plurality of handle positions including the points to be fixed and moved in the triangular mesh: and a second mesh creating section (38) for creating the data on such a final triangular mesh that the error metric representative of the difference between the intermediate triangular mesh and the final triangular mesh is minimized while allowing rotation and translation of the intermediate triangular mesh but not allowing uneven distortion, stretching and enlargement/contraction thereof.

The technologies have been proposed for operating, for example, moving, rotating, expanding/contracting or bending a two-dimensional object in an image in accordance with an instruction by a user. Conventionally, for such an operation, an object in an image is divided by triangle meshes, and the object is deformed by deforming the meshes.
The application of a predefined skeleton has been known as a method for operating a form. When a user operates the form of the skeleton, an image processing system adjusts the entire form in accordance with the form of the operated skeleton. However, defining the skeleton form is not easy processing and is not effective for an object without a clear skeleton structure, such as an amoeba, which is a problem.
Free Form Deformation (FFD) is another publicly known method. A user divides a space into multiple domains and operates a domain by moving a control point, which defines each domain. However, setting FFD takes time, and a user must manually operate many vertices, which is a problem.    [Non-Patent Document 1] "Laplacian Surface Editing", Orga Solkine et al., Eurographics/ACM SIGGRAPH Symposium, 179-188, [online], Jul. 9, 2004, [searched on Feb. 23, 2005], the Internet <URL: http://www-sop.inria.fr/geometrica/events/sgp2004/program.html>


This invention provides a semiconductor device that can minimize deterioration of electric characteristics of the semiconductor device while minimizing the amount of etching required. In the semiconductor device of the invention, a pad electrode layer formed of a first barrier layer and an aluminum layer laminated thereon is formed on a top surface of a semiconductor substrate. A supporting substrate is further attached on the top surface of the semiconductor substrate. A second barrier layer is formed on a back surface of the semiconductor substrate and in a via hole formed from the back surface of the semiconductor substrate to the first barrier layer. Furthermore, a wiring layer is formed in the via hole so as to completely fill the via hole or so as not to completely fill the via hole. A ball-shaped terminal is formed on the wiring layer.

1. Field of the Invention
This invention relates to a semiconductor device and a manufacturing method thereof, particularly, to a semiconductor device having a semiconductor substrate formed with a via hole and a manufacturing method thereof.
2. Description of the Related Art
Conventionally, a BGA (ball grip array) type semiconductor devices have been known as a kind of a chip size package having almost same outside dimensions as those of a semiconductor die. In this BGA type semiconductor device, a plurality of ball-shaped terminals made of a metal such as solder is arrayed in a grid pattern on one surface of the package, and electrically connected with the semiconductor die mounted on the other side of the package.
When this BGA type semiconductor device is mounted on electronic equipment, the semiconductor die is electrically connected with an external circuit on a printed circuit board by compression bonding of the ball-shaped terminals to wiring patterns on the printed circuit board.
Such a BGA type semiconductor device has advantages in providing a large number of ball-shaped terminals and in reducing size over other CSP type semiconductor devices such as SOP (Small Outline Package) and QFP (Quad Flat Package), which have lead pins protruding from their sides. The BGA type semiconductor device is used as an image sensor chip for a digital camera incorporated into a mobile telephone, for example. In this case, a supporting substrate made of, for example, glass is attached to a surface or both surfaces of the semiconductor die. The relating technology is disclosed in the Japanese Patent Application Publication No. 2002-512436.
Next, descriptions will be made on the BGA type semiconductor device and the manufacturing method thereof of the conventional art in a case where a sheet of supporting substrate is attached to the semiconductor die, with reference to drawings.
FIGS. 5 to 7 are cross-sectional views of the BGA type semiconductor device and the manufacturing method thereof of the conventional art, which are applicable to the image sensor chip. First, as shown in FIG. 5, a pad electrode layer 34 made of an aluminum layer or an aluminum alloy layer is formed on a top surface of a semiconductor substrate 30 with an insulation film, for example, an oxide film 31 interposed therebetween. Then, a supporting substrate 36 made of, for example, a glass is further attached on the top surface of the semiconductor substrate 30 including the pad electrode layer 34 with a resin layer 35 interposed therebetween.
Next, as shown in FIG. 6, a resist layer 37 is formed on a back surface of the semiconductor substrate 30, having an opening in a position corresponding to the pad electrode layer 34. Then, dry etching is performed to the semiconductor substrate 30 by using this resist layer 37 as a mask to form a via hole 38 from the back surface of the semiconductor substrate 30 to the pad electrode layer 34. On a part of the pad electrode layer 34 at a bottom of the via hole 38 formed by the etching, an aluminum oxide 50 (e.g. Al2O3 compound) is formed during etching.
Then, as shown in FIG. 7, a barrier layer 39 is formed on the back surface of the semiconductor substrate 30 including inside the via hole 38. A seed layer for plating 40 is formed on the barrier layer 39, and plating is performed to this seed layer 40 to form a re-distribution layer 41 made of, for example, copper (Cu). Furthermore, a protection layer (not shown) is formed on the re-distribution layer 41, and an opening is formed in a predetermined position of the protection layer to form a ball-shaped terminal 42 being in contact with the re-distribution layer 41.
Then, although not shown, the semiconductor substrate and the layers laminated thereon are cut off and separated into individual semiconductor dice. In this way, the BGA type semiconductor device where the pad electrode layer 34 and the ball-shaped terminal 42 are electrically connected with each other is formed.
However, when the via hole 38 is formed by the etching, the aluminum oxide 50 formed on the bottom thereof is positioned on a part of the pad electrode layer 34, thereby forming high resistance between the pad electrode layer 34 and the re-distribution layer 41. Furthermore, the aluminum oxide 50 degrades covering characteristics of the pad electrode layer 34 for the re-distribution layer 41, thereby easily causing damages such as disconnection of the re-distribution layer 41. This causes a problem of deteriorating the characteristics of the semiconductor device.
Although this problem seems to be solved by removing this aluminum oxide 50 by further etching, the etching process adds to the complexity of the manufacturing process.

Semiconductor device with a barrier layer and a metal layer