Mechanical systems having anti-stick mediums applied thereto are provided. In one aspect, exhaust gas recirculation (EGR) valve systems having anti-stick mediums applied thereto are also provided. The anti-stick medium can be applied to any contacting surface, such as but not limited to the valve surface and/or the valve seat surface. The anti-stick medium is intended to prevent the valve surface and the valve seat surface sticking or bonding together, especially with respect to the operation of cooled or cold side EGR systems. If any materials should stick to the anti-stick medium, a portion of the anti-stick medium will break away from the surface, allowing the surface and/or component to function normally. The anti-stick medium can include, without limitation, boron nitride coatings, boron nitride aerosols, boron nitride greases, thin dense chrome platings, perfluoroalkoxy, and combinations thereof.

Current Federal and State legislation generally requires control of vehicle exhaust emissions. Oxides of Nitrogen ("NOx") are one of the exhaust gas emissions that must be controlled. Formation of NOx typically occurs at higher combustion temperatures. A system, generally referred to as the exhaust gas recirculation ("EGR") system, has been developed to reduce peak combustion temperatures that reduce NOx emissions. An illustrative schematic of this system is generally shown in FIG. 1.
In this type of system, a portion of the exhaust gas is recirculated back to the intake manifold where it is combined with incoming charged air. When this mixture is compressed and ignited in the cylinder, the result is a lower combustion temperature and a reduction in NOx. The system typically consists of an EGR valve (1) that controls the flow of exhaust gas to the intake manifold. Conduits (2), (3), and (4) provide the interconnection between the exhaust manifold (5), EGR valve (1), and intake manifold (6). The system shown uses an electrically controlled EGR valve. An engine control unit ("ECU") (7) provides a signal that controls the open and/or closing of the valve. As the EGR valve (1) opens and closes, it will increase or decrease the flow rate of exhaust gas to the intake manifold (6). It is also typical to have a throttle valve (8) to control airflow into the intake manifold and, an exhaust gas cooler (9) to reduce temperature of recirculated exhaust gas.
The required EGR flow rate is dependent upon several factors that include the displacement of the engine and the pressure differential between the exhaust and the intake system. EGR valves may be actuated by pneumatic or electric means. Pneumatically actuated valves depend upon the availability of pressure or vacuum on the vehicle and this may be an undesirable requirement. They also require a means of electrically controlling the pneumatic source to allow overall electrical control of the system. An electric vacuum or pressure regulator is use to provide this control.
Operating force is another factor used in the selection criteria for the type of actuator used for the EGR valve. Higher flow rates require larger valves with greater area and higher operating forces. Lower pressure differential between the exhaust and intake manifold will require larger valves to achieve the desired flow rate. Components in the exhaust gas can accumulate on the valve components and cause them to stick or restrict movement if sufficient operating force is not available.
Referring to FIG. 2, a conventional EGR valve typically includes an actuator/valve assembly (10) and a valve base assembly (20). The EGR valve is typically mounted by fastening the valve body (20A) of the valve body assembly (20) to the intake manifold of the engine. A gasket is typically used as a seal to prevent leakage of exhaust gas to the environment. A valve poppet (30) is installed and retained on a valve stem (40) by any number of suitable methods, such as but not limited to radial riveting. The poppet valve (30) can be keyed to the shaft in a manner that will cause it to rotate with the shaft.
Still referring to FIG. 2, the valve base assembly (20) typically includes a valve seat (50) that is secured by suitable methods such as but not limited to press fit and/or staking. The actuator/valve assembly (10) and the valve body assembly (20) are combined to form the EGR valve. Fasteners (55) are used to secure the two assemblies together. Suitable locating features, in the actuator/valve assembly (10) and valve body assembly (20), are used to align the valve poppet (30) and valve seat (50) such that suitable sealing is provided when the valve poppet (30) is seated on the valve seat (50).
Referring to FIGS. 2 and 3, the EGR valve typically operates in the following manner. The ECU applies an electrical control signal to the actuator/valve assembly (10) that causes the valve poppet (30) to lift off of the valve seat (50). When there is a sufficient pressure differential between the inlet and outlet, the exhaust gas will flow through the EGR valve. The exhaust gas will flow from the inlet (60), into the chamber (70), through the valve seat (50), by the valve poppet (30), into the cavity (80), and to outlet (90). It should be appreciated the EGR system shown employs an EGR cooler that is operable to cool the exhaust gas prior to the exhaust gas reaching the EGR valve.
Components in the exhaust gas can accumulate on the valve components and cause them to stick or restrict movement if sufficient operating force is not available. By way of a non-limiting example, during normal operation of diesel engines, especially those employing cooled EGR systems, the EGR valve poppet often becomes stuck to the valve seat in the closed position, due to excessive build up of various exhaust gas components, which renders the valve inoperable.
More specifically, certain EGR systems that run with cooled exhaust gas (e.g., cooled or cold side EGR systems) may have a tendency to produce a moist vapor like (e.g., lacquer) material, until the engine warms up, which builds up on the valve poppet (30) and valve seat (50) as exhaust gas flows past them, as previously described. This material could combine with a powdery (e.g., soot) type of contamination that is present in the exhaust gas at elevated exhaust gas temperatures (e.g., greater than 140° C.). When the EGR valve is commanded to the closed position, the lacquer, soot or a combination of the two, starts to harden and causes a "bond" to be formed between the valve seat and poppet. This often happens after then engine is shut down for a time duration of about 20 minutes or greater. When the engine is started again, and the EGR valve is commanded to open, the "bond" that has formed prevents the EGR valve from opening when there is insufficient force and or torque available from the EGR valve to overcome the bonded sticking force.
Accordingly, there exists a need for new and improved EGR valve systems that are able to avoid sticking and/or bonding of the various surfaces of the components thereof, especially the valve poppet and valve seat surfaces.


An electronic apparatus includes a storage circuit arranged to store information on a controlled target, a storage control circuit arranged to rewrite the information stored in the storage circuit or to add different information to the information stored in the storage circuit, a power-decreased state detecting circuit arranged to detect an output state of a power source battery, and a control circuit arranged to control actions of the storage circuit and the storage control circuit according to an output of the power-decreased state detecting circuit.

1. Field of the Invention
This invention relates to an electronic apparatus having a storage memory arranged to store conditions of control over the apparatus and other information.
2. Description of the Related Art
The recent advancement of electronic technology has lessened troublesome operations and processes to be performed by operators or users on various apparatuses or equipment manufactured. The electronic technology is now further advancing to provide such an apparatus that is arranged to read what is intended by the operator and to carry out automatic control accordingly.
FIG. 1 shows in a block diagram an example of a control device of a video camera which has prompted the invention of the present application. The control device is of such a system that enables the video camera to read out what is intended by the operator of the video camera and carries out automatic control according to the intention of the operator. More specifically, the control device sees where the visual line of the operator peeping into a viewfinder is directed within an image plane and causes the focal point of an optical system to be adjusted to an object of shooting at which the operator is looking. In other words, the system includes an automatic focusing control circuit which is arranged to have the optical system focused only on an object of shooting at which the operator is looking. Such a technique has been disclosed, for example, in Japanese Patent Applications No. HEI 4-314408 and No. HEI 3-218574.
Referring to FIG. 1, an infrared ray generating device 1 is arranged within a viewfinder unit to illuminate an eyeball 3 of the operator with infrared radiation through an eyepiece 2. The infrared radiation is reflected by the eyeball 3. The reflected infrared radiation is received by a photo-electric converting element 4. A visual line position analyzer 5 is connected to the photo-electric converting element 4 and is arranged to find at which objects of shooting the operator is looking. An arithmetic control device 6 which is composed of a microcomputer, etc., is connected to the visual line position analyzer 5. The arithmetic control device 6 is thus arranged to obtain information on the position of the visual line from the visual line position analyzer 5 and to compute and obtain the coordinates of the visual line within an image plane.
A character generator 7 is connected to the arithmetic control device 6 and is arranged to be used for displaying in characters the visual line position of the operator recognized by the video camera along with some other control information. A display driving device 8 is connected to the character generator 7. A signal formed by the display driving device 8 is supplied to a monitor 9 which is disposed in front of the eyepiece 2.
A lens optical system includes elements arranged to face an object of shooting 10, in alignment, in the order of a focusing lens 11, a variator lens 12, a diaphragm 13 and an image pickup photo-electric converting element 14, which is a CCD or the like. The image pickup photo-electric converting element 14 is arranged to output a video signal. The video signal is supplied to the display driving device 8. An image is displayed at the monitor 9 with the output of the character generator 7 superimposed thereon to permit sighting of it through the eyepiece 2. Further, the output of the image pickup photo-electric converting element 14 is supplied to an AF (automatic focusing) signal processing circuit 67. The output of the AF signal processing circuit 67 is supplied to a control unit 21 which will be described later. The focus is adjusted by moving the focusing lens 11 according to the output of the AF signal processing circuit 67. At that time, if the focus is to be adjusted to an object located in the position of the visual line, a distance measuring area which is not shown is shifted to the visual line position and the focusing action is carried out on the basis of information on an image located within the distance measuring area. The focusing lens 11 is connected to an actuator 15 which is a mechanism arranged to move the focusing lens 11 in the direction of an optical axis with a motor used as a drive source. The variator 12 is also arranged to be moved by an actuator 16 which is connected to the variator lens 12. Another actuator 17 is connected to the diaphragm 13 and is arranged to vary the aperture of the diaphragm 13.
These actuators 15, 16 and 17 are respectively connected to drivers 18, 19 and 20. These drivers 18, 19 and 20 are connected to the control unit 21, which is arranged to control the system and to exchange information with the arithmetic control device 6. A pull-up resistor 22 is connected between the control unit 21 and a power supply. A switch 26 is arranged between the low potential side of the pull-up resistor 22 and the ground. The arithmetic control device 6 is provided with a pull-up resistor 27 connected between the arithmetic control device 6 and a power supply. A switch 28 is disposed between the low potential side of the pull-up resistor 27 and the ground. A power supply circuit 33 is connected to the control unit 21 through lines 29, 30, 31 and 32.
The lines-29 and 30 are arranged to transmit to the control unit 21 information on a power-decreased state of a battery 36. The line 31 is for control over a supply of power to a 5 V line which is provided for the supply of the voltage of a power source of 5 V. The line 32 is arranged to constantly supply the power to the control unit 21 as long as the battery 36 is mounted. Further, the power supply circuit 33 is provided with a line 34 for outputting the power source voltage of 5 V and an unregulated line 35 for supplying the output of the battery 36 directly to the necessary part of the video camera without passing through any constant voltage circuit. The battery 36 is either a primary battery which is a manganese cell or the like and is usable only once or a secondary battery which is a nickel-cadmium battery and is rechargeable. A synchronizing signal generating circuit 37 is connected to the arithmetic control device 6 and the character generator 7. A driving circuit 38 which is connected to the synchronizing signal generating circuit 37 is arranged to drive the image pickup photoelectric converting element 14.
FIG. 2 is a circuit diagram showing the details of the power supply circuit 33. The power supply circuit 33 is arranged to convert the voltage of the battery 36 into a power supply voltage (5 V, for example) for IC circuits disposed within the video camera, to supply information on the power-decreased state (a state obtained when electric power supply capability decreases with a terminal voltage dropped) to the control unit 21 and, in a case where an instruction for bringing the supply of power to an end is given from the control unit 21, to bring the supply of power to the 5 V line 34 to an end.
The power supply circuit 33 consists of DC--DC converters 39 and 40, resistors 41 and 42 which are connected between the ground and the outputs of the DC--DC converters 39 and 40, resistors 44 and 45 which are connected between the battery 36 and the ground, a comparator 47 having the voltage of a connection node 43 between the resistors 41 and 42 and that of a connection node 46 between the resistors 44 and 45 respectively as its input signals, resistors 48 and 49 connected between the output terminal of the DC--DC converter 40 and the ground, resistors 51 and 52 connected between the battery 36 and the ground, a comparator 54 having the voltage of a connection node 50 between the resistors 48 and 49 and that of a connection node 53 between the resistors 51 and 52 respectively as its input signals, and a switch 55 which is disposed between the output terminal of the DC--DC converter 39 and the line 34.
The voltage of the battery 36 is converted into a DC voltage of 5 V by the DC--DC converter 40. The DC voltage thus obtained is divided by the resistors 41 and 42 into a reference voltage V1 and also divided by the resistors 48 and 49 into a reference voltage V2. The reference voltage V1 is arranged to be larger than the other reference voltage V2. The voltage of the battery 36 is further divided by the resistors 44 and 45 into a voltage V3 and by the resistors 51 and 52 into a voltage V4. The reference voltage V1 and the voltage V3 are compared with each other by the comparator 47 while the reference voltage V2 and the voltage V4 are arranged to be compared with each other by the comparator 54.
When the voltage V1 is found to be larger than the voltage V3, the comparator 47 outputs to the line 30 a signal indicating a power-decreased state (indicating that the battery voltage has dropped to such a level that requires replacement of the battery). Upon receipt of this signal, the control unit 21 causes the monitor 9 to make a power-decrease display through the arithmetic control device 6, the character generator 7 and the display driving device 8.
The power-decrease display is made as shown in FIG. 3. A display image plane 1801 shows a power-decrease display 1802 such as "BATT", an image 1803 of an object, and calibration markers 1804 and 1805 for adjustment of a difference in visual line function between the individual operators (hereinafter will be referred to as a personal error). The power-decrease display "BATT" 1802 is made by causing it to flicker. In using the monitor 9, when the operator closes the switch 26 of FIG. 1 to select a visual-line function personal-error adjustment mode, the visual-line function personal-error adjusting markers 1804 and 1805 are displayed on the display image plane 1801. Then, the operator first looks at the marker 1804 and closes the switch 28. By this operation, the position of a visual line which is obtained when the operator looks at the marker 1804 is confirmed. Following this, another visual line position which is obtained when the operator looks at the other marker 1805 is confirmed.
Then, "information on coincidence of the recognition by the apparatus with the visual lines of the operator" obtained when the operator looks at the visual-line function personal-error adjusting markers 1804 and 1805 is stored in a storage part within the arithmetic control device 6. After that, each visual line of the operator is examined on the basis of this information.
When the voltage of the battery 36 further drops until the other reference voltage V2 becomes higher than the voltage V4 after the power-decrease display is made, the comparator 54 outputs to the line 29 a signal for shutting off the power. According to this signal, the control unit 21 opens the switch 55 to cut off the supply of power to each block to forcibly bring the operation of the system to a stop, so that the system can be prevented from coming out of order or from malfunctioning.
In cases where an apparatus is arranged to observe the visual lines of the operators and to control its actions according to these visual lines, the control must be performed after adjustment is made to the personal error of each of the operators according to the personal error of each operator, because the visual lines of one operator differ from those of another.
FIG. 4 is a block diagram showing in detail the internal arrangement of the arithmetic control device 6. The arithmetic control device 6 consists of a storage part 6a which is arranged to carry out an arithmetic process for control and includes a temporary information storing device and another storage part 6b which is arranged to store information on a personal error or nontemporary information which is stored as long as the information is not erased by the operator or a person adjusting the camera. The storage part 6b is composed of an element such as an EEPROM or the like that inhibits erasing and writing unless some special process is performed. The contents of the storage part 6b cannot be updated without using a specific program or a specific instruction. The information on the personal error thus stored is used for operations to be performed thereafter.
However, with the video camera arranged in the manner as described above, the provision of the function of adjusting the personal error of the visual line of the operator tends to bring about the following problem.
Since the duration time of one battery is only one or two hours in general, the power is frequently shut off. The personal error adjusting function, on the hand, can be carried out any time as desired. In a case where the information on the personal error is to be stored in an element such as an EEPROM or the like that is dependent on a run command coming from an external software, if the supply of power becomes unstable while the storing action on the storage part is still in process, some malfunction tends to take place. For example, in such a case, some unspecified figure might be written in as data other than the data of a predetermined address, or some part other than a designated part might be erased in error. Further, if the power is actually shut off due to a power decrease within a period of limited time necessary for writing, it becomes hardly possible to correctly judge the content of the storage part to be a value obtained prior to the data currently applicable, or to be representing a state obtained after completion of rewriting or to be a totally wrong value. Under such a condition, the reliability of the data in storage itself would be lost.
If any abnormal data is stored in the storage part in this manner, a part of a program might become hardly executable. In such a case, even if the operator makes adjustment according to predetermined procedures, the apparatus might fail to smoothly operate.


A buffer conveyor for conveying and buffering products comprises a first elongated conveyor and a second elongated conveyor that can be driven in an opposite direction. The first and the second conveyor extend in a path at least substantially parallel to each other and beside each other. A transfer unit is movable at least substantially parallel to the first and the second conveyor in the aforesaid path and is provided with a transfer device for transferring the products from the first conveyor to the second conveyor. The transfer unit comprises a drive unit for moving the transfer unit, preferably in dependence on the velocities of the first and the second conveyor.

The invention relates to a buffer conveyor for conveying and buffering products, such as parcel goods being conveyed one at a time, in particular boxes, crates, beverage cartons and the like, as well as mass flow goods such as bottles, cans and the like. Such a buffer conveyor comprises at least one first elongated conveyor, which can be driven in a first direction and which has a supply end, a second elongated conveyor, which can be driven in a second, opposite direction and which has a discharge end, which first and second conveyors extend in a path at least substantially parallel to each other and beside each other, a transfer unit, which is movable at least substantially parallel to the first and the second conveyor in the aforesaid path and which is provided with a transfer device for transferring the products from the first conveyor to the second conveyor, which transfer unit comprises a drive unit for driving the transfer unit, preferably in dependence on the velocities of the first and second conveyors.
Such transfer units are known in many embodiments thereof. Several ways of driving the transfer unit are possible. On the one hand buffer conveyors are known in which the transfer unit does not have its own drive unit, but in which the transfer unit is connected to the (drive unit(s) of the) first and second conveyors via a differential, so that the transfer unit is driven by the first and the second conveyor at a velocity dependent on the conveying velocity of said conveyors. Furthermore, buffer conveyors are known in which the transfer unit is driven by a stationary drive motor, which is connected to and drives the transfer unit via a connecting element, such as an endless driving element.

Buffer conveyor for conveying and buffering products

Abstract: The drive unit of the transfer unit comprises a drive motor, which follows the movements of the transfer unit at least in part.


A disk for a disk drive system includes a disk having a track format region including a spoke field region. The spoke field region has a single binary bit to identify angular position of a track with respect to disk head of the disk drive system.

This invention relates generally to track formats for computer disk drives.
Disk drive systems store data magnetically, often in multiple disks each having two storage surfaces. Bytes of information are stored on these surfaces as binary ones and zeros. In order to efficiently store and retrieve bytes of information stored on such disks, disk drive controllers need to know locations on the disk where to write data to and read data from the disk. Each location on a disk is identified, therefore, by short segments of site information stored at various locations on the disk surface. Using this site information, the disk drive can accurately store data to, and retrieve data from, desired locations on the disk surfaces.
Data are stored in multiple concentric circular tracks on one or more surfaces of the disk. On each track are spoke areas separated by user data areas. The spoke areas generally include a spoke number field to discriminate one spoke on a track from another. The information in the spoke number field is used to establish a position of the disk relative to magnetic heads in the disk drive that are used to read and write the disk surface. Techniques which have been used to produce a spoke number include providing a whole spoke number in each spoke field to provide a straightforward technique to identify angular position anywhere on the track. Another technique uses a portion of the full spoke number, such as an N number of LSB""s of the spoke number, in each spoke field. This arrangement also requires that certain spoke fields have a uniquely formatted index spoke in order to fully identify the position of any spoke field when angular position context is lost in the disk drive. The provision of uniquely formatted index spokes are needed since using an N number of bits in the spoke field will result in an ambiguous identification of a spoke beyond a range of 2n spokes.
According to an aspect of the invention, a disk for a disk drive system includes a disk having a track format region including a spoke field region, said spoke field region having a single binary bit to identify angular position of a track with respect to disk head of the disk drive system.
According to an additional aspect of the invention, a disk drive system includes a disk drive and a disk operatively associated with the disk drive, said disk having a plurality of track format regions, each track format region including a spoke field region, said spoke field region having a single binary bit to identify angular position of a track on the disk with respect to the at least one disk head of the disk drive system.
According to a still further aspect of the invention, a servowriter for a disk drive includes a pseudorandom sequence generator to produce a single binary bit of a spoke field region for each of a plurality of track format regions of a disk.
According to a still further aspect of the invention, a method of writing servo areas of a track format includes generating a pseudorandom sequence of vectors and writing the LSB of each vector of the pseudorandom sequence to corresponding spoke number fields of the disk.
One or more advantage may be provided by the invention. The single bit spoke number field 50d is a single bit field which is used to provide an unambiguous identification of angular position. The single bit spoke number field can provide the functions of the conventional spoke number field and the conventional head/surface field with a single bit. The single bit spoke number field uses a single bit to represent the angular position of the disk surface relative to the disk heads. Each of the spoke number fields is populated with a single bit that assumes a binary value of 0 or 1. Each spoke bit is generated in a specified manner such that a complete spoke number identification is obtained from reading a few consecutive spoke numbers anywhere on a track.

Servo area numbering strategy for computer disk drives


Provided is an electrical heating mold. The electrical heating mold includes a mold casing and an electrical heating device disposed in the mold casing. The electrical heating device includes an upper annular heating resistor element group configured to perform heating around a bottleneck, a middle annular vertical-inserted columnar heating resistor element group configured to perform heating around a bottle body, and a lower annular heating resistor element group configured to perform heating around a bottle bottom. The electrical heating mold has a good heating effect, a low processing cost and a simple structure.

A bottle parison needs to be placed in an electrical heating mold so as to be blown into a container bottle, and heating is required during the blowing process so that the bottle parison can be better stretched to form the container bottle. Currently, there are two kinds of electrical heating molds used in the industry. One is to heat a cavity wall of the mold through preheating fluid (such as water or oil). Since a relatively large heat exchange between the cavity wall and the container bottle is required, more preheating fluid is required and thus the preheating fluid needs to have a large reserve. Secondly, since the preheating fluid needs to flow to transfer heat, a flow channel needs to be provided in the mold, and the structure of the flow channel is complex, thus increasing the manufacturing difficulty and manufacturing cost of the mold. The other is to heat the cavity wall of the mold through a resistor. European Patent EP1753597 describes that the resistor is arranged at an interface between a mold casing and a bottom mold. During heating, the heat is dissipated from bottom to top, resulting in poor heating effect of the bottom of the container bottle, which affects the molding quality. Secondly, the resistor has a shape of a coil. Setting the resistor on the bottom mold requires complex processing of the bottom mold, and the processing is difficult and high in cost.

GUANGZHOU TECH-LONG PACKAGING MACHINERY CO., LTD


A semiconductor laser diode is disclosed. In an embodiment a semiconductor laser diode includes a first resonator and a second resonator, the first and second resonators having parallel resonator directions along a longitudinal direction and being monolithically integrated into the semiconductor laser diode, wherein the first resonator includes at least a part of a semiconductor layer sequence having an active layer and an active region configured to be electrically pumped to generate a first light, wherein the longitudinal direction is parallel to a main extension plane of the active layer, and wherein the second resonator has an active region with a laser-active material configured to be optically pumped by at least a part of the first light to produce a second light which is partially emitted outwards from the second resonator.

In many applications, such as projection applications, laser diodes are required that have a sufficiently high output power and at the same time a beam quality that is as independent as possible of current or power in order to be able to focus the laser beam with high efficiency. In order to achieve high optical output powers, broad laser resonator structures are usually used, which often lead to inhomogeneous mode distributions, so-called filamentations, which lead, on the one hand, to a deterioration of the beam quality, especially in the far field, and on the other hand to inhomogeneous intensity distributions on the laser facet, so-called "hot spots" and thus impair the facet stability. This is associated with an increased risk of facet damage. Therefore, laser diodes, which have to meet high requirements regarding beam quality, are limited in their optical power. Conversely, laser diodes with high optical power generally exhibit insufficient beam quality for the reasons mentioned above.
Furthermore, with index-guided and gain-guided laser structures, inhomogeneities can, in the course of process fluctuations, occur in the horizontal wave guidance along the resonator, as a result of which light can escape from the resonator. This scattered light propagates in the laser diode chip to the side of the active region and after being outcoupled via the facet of the laser chip, interferes with the light of the mode guided in the active region, which leads to disturbances in the horizontal far field.


Soft serve frozen food such as ice cream and frozen yogurt is pumped from a sanitary reservoir into a closed loop flow path that includes an emulsion barrel assembly that intimately mixes the ingredients in the food composition into a smooth consistency frozen food product. A dispensing head allows servings of soft serve food to be withdrawn from the closed loop. A clean-in-place system permits all critical parts of the machine that come in contact with food to be cleaned and sanitized without having to take the machine apart.

Current machines for producing soft serve frozen food compositions, such as soft serve ice cream and yogurt, comprise a reservoir of liquid soft serve mix connected to a cylindrical freezing barrel. Mix is either gravity fed or pumped to the freezing barrel where the mix is rapidly frozen by means of a high power refrigeration coil surrounding the freezing barrel. Liquid mix is fed into one end of the freezing barrel and out the other end to a dispensing head where the finished product is withdrawn from the machine. A motor rotates a shaft extending through the center of the barrel. A series of scrapers is mounted on the shaft. The mix in the freezing barrel closest to the interior surface of the barrel freezes and the rotating scrapers skim the frozen mix from the surface of the barrel and fold it into the warmer mix in the center of the barrel. At the same time, the mix is propelled longitudinally through the freezing barrel toward the dispensing head.
The problems with such machines are numerous. They use a large amount of electricity. The design does not efficiently utilize space inside the housing of the machine so that only two flavors typically are possible in a reasonably sized machine. The design also does not continuously produce large quantities of uniform consistency soft serve food product. It also takes a considerable period of time to recharge the machine with frozen food product during high demand periods. Furthermore, the machine must be disassembled to clean the parts in contact with food as required by health and regulatory authorities.

Apparatus for processing, storing, and dispensing soft serve frozen food product


Techniques and mechanisms for using passively collected network data to automatically generate a fingerprint prevalence database without the need for endpoint ground truth. The process first clusters all observations with the same fingerprint string and similar source and destination context. The process then annotates each cluster with descriptive information and uses a rule-based system to derive an informative name from that descriptive information, e.g., “winnt amp client” or “cross-platform browser”. Optionally, the learned database may be augmented by a user to clarify custom process labels. Additionally, the generated database may be used to report the inferred processes in the same way as databases generated with endpoint ground truth.

Network traffic is becoming increasingly encrypted. Indeed, some studies estimate that more than 70% of all network traffic is now encrypted, with this figure expected to continue to grow.
Identifying the process associated with an encrypted traffic session can be quite useful. In the security domain, for example, process identification can be used to detect malware or vulnerable executables on an endpoint. Likewise, in the networking domain, routers and switches may use this information to prioritize traffic or aid in diagnostics, such as analyzing how processes communicate across different network segments.
In some protocols, such as Secure Socket Layer (SSL) and HyperText Transfer Protocol (HTTP), a clear-text/unencrypted description of the process is sent with the traffic, affording at least some degree of ground truth as to the sending process. However, the Transport Layer Security (TLS) protocol lacks this clear-text description of the source process. TLS fingerprinting offers one potential way to make inferences from the cryptographic parameters. TLS fingerprinting identifies the client process that initiated a TLS connection by analyzing data features observed in the initial TLS handshake. As many distinct processes can create the same characteristic TLS fingerprint string, an effective fingerprint system must incorporate destination context (destination IP address, port, and TLS server name) to disambiguate the set of potential processes. The fingerprint system requires a detailed fingerprint prevalence database that includes not just fingerprints and processes, but also the destinations those processes visited, and the prevalence with which those processes visited the destinations. Creating this database requires extensive traffic observations and ground truth about the processes that created them. The process information is expensive or infeasible to collect in some networks. However, some endpoints of networks are historically difficult to collect endpoint ground truth from (e.g., IoT, mobile networks/devices, containers, servers, etc.).

Automatically generating a fingerprint prevalence database without ground truth


A supporting device is adapted to be mounted on a bicycle wheel and includes a central cap unit, a plurality of end seats, and a plurality of covering units. The bicycle wheel includes a hub and a wheel rim. The central cap unit is sleeved fixedly on the hub and has coupling portions. The end seats are connected fixedly on the wheel rim, and are formed respectively with coupling sections registered respectively with the coupling portions. Each of the covering units has an inner end portion connected to a respective one of the coupling portions of the central cap unit and an outer end portion connected to one of the coupling sections of the end seats that is registered with the respective one of the coupling portions, so as to enhance a structural strength of the bicycle wheel.

1. Field of the Invention
This invention relates to a supporting device, more particularly to a supporting device for a bicycle wheel.
2. Description of the Related Art
A conventional bicycle wheel includes a hub, a wheel rim, and a plurality of spokes. Each of the spokes is configured as a narrow stick that has an end connected securely to a spoke-installation portion of the hub, and an opposite end connected fixedly to the wheel rim through a locking member (e.g., a screw). However, the spoke has a relatively weak strength because of its shape and is easily deformed and damaged by external force, thereby affecting structural strength and roundness of the bicycle wheel.
Another conventional bicycle wheel uses a plurality of spoke plates to replace the abovementioned conventional spokes. Each of the spoke plates is sandwiched between and riveted to the hub and the wheel rim so as to enhance the structural strength of the bicycle wheel. However, precise riveting is difficult. Moreover, since the wheel rim is subjected to a relatively large external force during the riveting process, a roundness of the wheel rim is hard to maintain.


A radiation-sensitive composition can be used to prepare positive-working imageable elements having improved solvent resistance and is useful for making lithographic printing plates. The composition includes an alkaline soluble polymeric binder that is a specific poly(vinyl acetal) that exhibits improved resistance to press chemicals, and a radiation absorbing compound.

In lithographic printing, ink receptive regions, known as image areas, are generated on a hydrophilic surface. When the surface is moistened with water and ink is applied, the hydrophilic regions retain the water and repel the ink, the ink receptive regions accept the ink and repel the water. The ink is then transferred to the surface of suitable materials upon which the image is to be reproduced. In some instances, the ink can be first transferred to an intermediate blanket that in turn is used to transfer the ink to the surface of the materials upon which the image is to be reproduced.
Imageable elements useful to prepare lithographic (or offset) printing plates typically comprise one or more imageable layers applied over a hydrophilic surface of a substrate (or intermediate layers). The imageable layer(s) can comprise one or more radiation-sensitive components dispersed within a suitable binder. Following imaging, either the exposed regions or the non-exposed regions of the imageable layer(s) are removed by a suitable developer, revealing the underlying hydrophilic surface of the substrate. If the exposed regions are removed, the element is considered as positive-working. Conversely, if the non-exposed regions are removed, the element is considered as negative-working. In each instance, the regions of the imageable layer(s) that remain are ink-receptive, and the regions of the hydrophilic surface revealed by the developing process accept water or aqueous solutions (typically a fountain solution), and repel ink.
Similarly, positive-working compositions can be used to form resist patterns in printed circuit board (PCB) production, thick-and-thin film circuits, resistors, capacitors, and inductors, multichip devices, integrated circuits, and active semiconductive devices.
"Laser direct imaging" methods (LDI) have been known that directly form an offset printing plate or printing circuit board using digital data from a computer, and provide numerous advantages over the previous processes using masking photographic films. There has been considerable development in this field from more efficient lasers, improved imageable compositions and components thereof.
Thermally sensitive imageable elements can be classified as those that undergo chemical transformation(s) in response to, exposure to, or adsorption of, suitable amounts of thermal energy. The nature of thermally induced chemical transformation may be to ablate the imageable composition in the element, or to change its solubility in a particular developer, or to change the tackiness or hydrophilicity or hydrophobicity of the surface layer of the thermally sensitive layer. As such, thermal imaging can be used to expose predetermined regions of an imageable layer that can serve as a lithographic printing surface or resist pattern in PCB production.
Positive-working imageable compositions containing novolak or other phenolic polymeric binders and diazoquinone imaging components have been prevalent in the lithographic printing plate and photoresist industries for many years. Imageable compositions based on various phenolic resins and infrared radiation absorbing compounds are also well known.
A wide range of thermally-sensitive compositions that are useful in thermal recording materials are described in patent GB 1,245,924 (Brinckman), whereby the solubility of any given area of the imageable layer in a given solvent can be increased by the heating of the layer by indirect exposure to a short duration high intensity visible light and/or infrared radiation transmitted or reflected from the background areas of a graphic original located in contact with the recording material. Several systems are described that operate by many different mechanisms and use different developers ranging from water to chlorinated organic solvents. Included in the disclosed aqueous developable compositions are those that comprise a novolak type phenolic resin. Coated films of such resins are said to show increased solubility upon heating. The compositions may also contain heat-absorbing compounds such as carbon black or Milori Blue (C.I. Pigment Blue 27) to additionally color the images.
Thermally imageable, single and/or multi-layer elements are also described in WO 97/39894 (Hoare et al.), WO 98/42507 (West et al.), WO 99/11458 (Ngueng et al.), U.S. Pat. Nos. 5,840,467 (Kitatani), 6,060,217 (Ngueng et al.), 6,060,218 (Van Damme et al.), 6,110,646 (Urano et al.), 6,117,623 (Kawauchi), 6,143,464 (Kawauchi), 6,294,311 (Shimazu et al.), 6,352,812 (Shimazu et al.), 6,593,055 (Shimazu et al.), 6,352,811 (Patel et al.), 6,358,669 (Savariar-Hauck et al.), and 6,528,228 (Savariar-Hauck et al.), and U.S. Patent Application Publications 2002/0081522 (Miyake et al.) and 2004/0067432 A1 (Kitson et al.).
The industry has focused on the need to diminish the solubility of the exposed regions of phenolic binders (dissolution inhibitors) in the imageable layers before exposure and to enhance their solubility after exposure to suitable thermal energy (dissolution enhancers). WO 2004/081662 (Memetea et al.) describes the use of various phenolic polymers or poly(vinyl acetals) in combination with developability-enhancing compounds of an acidic nature in positive-working compositions and elements. Some particular poly(vinyl acetals) useful in this manner are described in U.S. Pat. Nos. 6,255,033 (Levanon et al.) and 6,541,181 (Levanon et al.).
Some useful poly(vinyl acetals) are described in U.S. Ser. No. 11/677,599 (filed Feb. 22, 2007 by Levanon et al.), EP 1,627,732A1 (Hatanaka et al.), and U.S. Published Patent Applications 2005/0214677 (Nagashima), 2005/0214678 (Nagashima), and 2006/0275698 (My T. Nguen)
Problem To Be Solved
Offset printing plates recently have been the subject of increasing performance demands with respect to resistance to solvents and common printing room chemicals. Printing plates encounter pressroom chemicals such as plate cleaning agents, blanket washing agents, and alcohol substitutes in the fountain solution. Particularly in printing processes using ultraviolet-curable inks, where rinsing agents with a high content of esters, ethers or ketones are used, the chemical resistance of conventional positive-working printing plates can be improved.
Imaged regions in such printing plates should be substantially insoluble in ultraviolet-curable inks and substantially insoluble in solvents, often glycol ethers, used to clean plates during or after a print run. Conventional quinone diazide/phenolic resin-based radiation-sensitive compositions are soluble in glycol ether solvents, and are disfavored for printing with ultraviolet-curable inks.
Another demand is that the imaged regions be substantially insoluble in the fountain solutions (or dampening liquids) that are used to wet the hydrophilic areas of the plates. Conventional fountain solutions are largely made up of water and a small amount of alcohol. More recently, such fountain solutions have been replaced, in some situations, with formulations comprising alternative additives in order to remove inflammable alcohol solvents from press room environments. Additives that have been used in this manner include surfactants and various non-volatile solvents that may be more aggressive towards the radiation-sensitive compositions. Conventional radiation-sensitive compositions are relatively susceptible to attack by replacement fountain solutions.
A need remains for positive-working, thermally imageable elements that have improved bakeable and improved resistant to press chemistries, such as lithographic inks, fountain solutions, and the solvents used in washes, such as UV washes. Bakeability is highly desirable because baking increases the press run length for the printing plates.

This patent is subject to a terminal disclaimer.

Radiation-sensitive compositions and elements with solvent resistant poly(vinyl acetal)s


The invention relates to a method and arrangement for short coherence holography for distance measurement, for profile detection and/or for 3D detection of one or more object elements and/or object areas and/or objects or for readout of holographic volume memories with a holographic interferometer and with at least one short coherence light source. For each optically detected object element in the hologram the holographic interferometer has an optical path difference clearly unequal to zero. At least one spectrally integrally detecting, rastered detector is arranged. The short coherence light source with frequency comb is designed with the optical delay length Y1. Detected holograms are digitally reconstructed. Relative distances of object elements are digitally calculated from the hologram reconstructions, so that a 3D point cloud of object elements and/or object areas and/or objects is produced. Data can be read out optically in parallelized form from holographic volume memories or three-dimensionally structured signatures.

In the determination of an object shape from digitally recorded holograms, Fourier holography, also in multi-wavelength technology, constitutes a good approach to be able to perform the digital reconstruction with comparatively simple algorithms. This was illustrated, among others, in the scientific paper "Digital recording and numerical reconstruction of lensless Fourier-Hologramms in optical metrology" by the authors Christoph Wagner, Sönke Seebacher, Wolfgang Osten, and Werner Jüptner in Applied Optics of Aug. 1, 1999, vol. 38, no. 22, pages 4812 to 4820 [1]. The paper clearly states that Fourier holography can be implemented comparatively well as a holographic method with digital recording, since when the geometry parameters of the holographic arrangement are selected accordingly, the interference fringe densities occurring in the hologram can technically be controlled comparatively well by means of existing digital cameras.
In addition, short-coherence holography constitutes an absolute-measurement measuring method, the potential and advantages of which have been clearly recognized already several years ago, cf. the scientific paper "Applications of short-coherence digital holography in microscopy" by Lluis Martinez-León, Giancarlo Pedrini, and Wolfgang Osten in Applied Optics of Jul. 1, 2005, vol, 44, no. 19, pages 3977 to 3984 [2]. This paper particularly discusses the possibilities and limitations for obtaining a high lateral resolution—as in [1] as well—when determining an object form, while [2] also emphasizes the possibility of depth discrimination particularly for biological objects.
One application of short-coherence holography on the basis of the Fourier approach is shown in the scientific paper [3] "Lensless digital holography with short coherence light source for three-dimensional surface contouring of reflecting micro objects" by Caojin Yuan, Hongchen Zhai, Xiaolei Wang, and Lan Wu in Optics Communications 270 (2007) 176-179. This paper gives an account of a method for digital short-coherence holography according to the Fourier approach for reflecting micro objects with a mechanical depth scan of the object. Here as well, no lenses are used for object imaging and this method also allows optical sectioning, as illustrated in [2]. Here, it is reported that by means of the short-coherence approach particularly the influence of speckling on the reflecting rough object can be reduced. In addition, [3] convincingly illustrates the potential of short-coherence holography in the measurement of rough object surfaces with strong inclination, here for example conical depressions with a large aspect ratio.
As described in [3], in the method for short-coherence holography, only one single area, which—depending on the coherence length of the light source used—is comparatively small in its depth extension, can be addressed holographically. The depth extension of the area is determined by the coherence length of the light used, so that an object with large depth extension and reduced coherence length can only be detected in a comparatively lengthy mechanical object scan with capturing of a plurality of holograms. Thus, when a short-coherent source is applied, it is only possible to holographically detect the object area which in the capturing process in the plane of the hologram detection has an optical path difference smaller than the coherence length of the light forming the hologram.
In a model-like image, this means for the approach according to [3] that an object is scanned in depth with a rung ladder, which only includes one ladder rung and which is gradually shifted in depth to scan the object. In each depth position of the ladder rung, one or more holograms are detected from one or more object points of the object. Therefore, this short-coherence holography method described in [3] can be time-consuming and is thus limited to rather small objects.
Moreover, objects that are further remote, for example at a distance of a few meters, cannot be detected by means of short-coherence holography in the prior art as illustrated in [2] and [3].

Method and arrangement for short coherence holography


Example collaborative filtering techniques provide improved recommendation prediction accuracy by capitalizing on the advantages of both neighborhood and latent factor approaches. One example collaborative filtering technique is based on an optimization framework that allows smooth integration of a neighborhood model with latent factor models, and which provides for the inclusion of implicit user feedback. A disclosed example Singular Value Decomposition (SVD)-based latent factor model facilitates the explanation or disclosure of the reasoning behind recommendations. Another example collaborative filtering model integrates neighborhood modeling and SVD-based latent factor modeling into a single modeling framework. These collaborative filtering techniques can be advantageously deployed in, for example, a multimedia content distribution system of a networked service provider.

Modern consumers are inundated with choices. Electronic retailers and content providers often offer a substantial selection of products to meet a variety of special needs and tastes. Matching consumers with most appropriate products or services is not trivial, yet it is a key in enhancing user satisfaction and loyalty. This emphasizes the prominence of recommender systems, which provide personalized recommendations for products and services that suit a user's taste. Recommender systems generally use either of two strategies: content-based recommendations or collaborative filtering. The content-based approach profiles each user or product to associate users with matching products. For example, a movie profile might describe its genre, the participating actors, its box office popularity, etc. User profiles could include demographic information or answers to a suitable questionnaire. As such, content-based strategies require gathering external information that might not be available or easy to collect. In contrast, collaborative filtering (CF) relies on past user behavior, e.g., their previous transactions or product or service ratings, and does not require the creation of explicit profiles. Notably, collaborative techniques require no domain knowledge and avoid the need for extensive data collection. In addition, relying directly on user behavior facilitates uncovering complex and unexpected patterns that would be difficult or impossible to profile using content-based recommendation techniques.
In order to establish recommendations, conventional collaborative filtering recommender systems compare fundamentally different objects: items against users. There are two primary approaches to facilitate this comparison: neighborhood modeling and latent factor modeling. Conventional neighborhood models center on determining the relationships between items or, alternatively, between users. An item-oriented neighborhood model approach evaluates the preference of a user to an item based on ratings of similar items by the same user. In a sense, this approach transforms users to the item space by viewing them as baskets of rated items. This way, it is not necessary to directly compare users to items, but rather items can be directly related to other items.
Latent factor models, such as those based on Singular Value Decomposition (SVD), comprise an alternative approach by transforming both items and users to the same latent factor space, thus making them directly comparable. The latent factor space attempts to explain ratings by characterizing both items and users on factors automatically inferred from user feedback. For example, when the items are movies, factors might measure obvious dimensions such as comedy vs. drama, amount of action, or orientation to children; as well as less well-defined dimensions such as depth of character development or quirkiness, or completely uninterpretable dimensions. Neighborhood models are most effective at detecting very localized relationships. They rely on a few significant neighborhood relations, often ignoring the vast majority of ratings by a user.
The use of the same reference symbols in different drawings indicates similar or identical items.

Recommender system utilizing collaborative filtering combining explicit and implicit feedback with both neighborhood and latent factor models


A substrate of a case for packaging an electronic component includes a conductive cap bonded to a substrate to cover the electronic component and to tightly seal an enclosed space. The substrate has a substrate body layer, electrodes disposed on the substrate body layer, and a glass ceramic layer disposed on the substrate body layer so as to cover a portion of the electrodes.

1. Field of the Invention
The present invention relates generally to substrates for mounting electronic components and more particularly to a substrate of a case for packaging chip-type electronic components. The present invention also relates to a piezoelectric resonance component including such a substrate.
2. Description of the Related Art
Conventionally, various chip-type piezoelectric resonance components including piezoelectric elements are known. Because the piezoelectric vibrating part in the piezoelectric resonator vibrates, the packaging of the piezoelectric resonator must be done in a manner that does not prevent or hinder the vibration.
FIG. 6 is an assembly view showing an example of a conventional chip-type piezoelectric resonance component.
This chip-type piezoelectric resonance component includes a substrate 51 made of an insulative ceramic such as alumina. On the upper surface of the substrate 51, electrodes 52 to 54 for achieving external electrical connection are provided. Also on the upper surface of the substrate 51, a rectangular-frame-shaped insulative glass layer 55 is disposed.
On the substrate 51, a capacitor 57 is bonded via a conductive adhesive 56. On the capacitor 57, a piezoelectric resonator 58, which vibrates in a thickness shear mode, is bonded by conductive adhesives (not shown).
A metal cap 59 is bonded on the upper surface of the substrate 51 by using an adhesive 60 so as to cover the layered structure including the capacitor 57 and the piezoelectric resonator 58.
The rectangular-frame-shaped insulative glass layer 55 prevents a short-circuit between the metal cap 59 and the electrodes 52 to 54.
FIG. 7 is an assembly view which shows another example of a conventional chip-type piezoelectric resonance component. This piezoelectric resonance component includes a substrate 61 having a dielectric body. The substrate 61 including the dielectric body has three capacitor electrodes, which constitute a three-terminal capacitor. Electrodes 62 and 63 are provided on the upper surface of the substrate 61 and an electrode 64 is disposed on the side surface of the substrate 61. The three-terminal capacitor is defined by the electrodes 62 to 64.
On the upper surface of the substrate 61, a piezoelectric resonator 66 which vibrates in a thickness shear mode is fixed by a conductive adhesive 65. A metal cap 67 is bonded on the upper surface of the base substrate 61 so as to cover the piezoelectric resonator 66. In this example, in order to reliably prevent a short-circuit between the metal cap 67 and the electrodes 62 and 63, an insulator 69 is applied to the metal cap 67 in advance. After hardening, the metal cap 67 is bonded to the substrate 61 via an insulative adhesive 68.
As is apparent from the above, when the substrates 51 and 61 are bonded to the metal caps 59 and 67, respectively, a very difficult and cumbersome process for securing the insulation between the metal cap 59 and the electrodes 52 to 54 provided on the substrate 51, and for securing the insulation between the metal cap 67 and the electrodes 62 and 63 provided on the substrate 61 must be included in the manufacturing process of the conventional piezoelectric resonance components.
With respect to the chip-type piezoelectric resonance component shown in FIG. 6, when the electrodes 52 to 54 are formed by applying and baking a conductive paste after the substrate 51 made of alumina is baked, the baking process is repeated in order to bake the conductive paste, and, furthermore, in order to form the insulative glass layer 55 on the top thereof, insulative glass must be applied thereon and baked again. Because of these extremely cumbersome steps, the cost of the conventional piezoelectric resonance components is very high.
As for the chip-type piezoelectric resonance component shown in FIG. 7, an insulative resin 69 is applied to the metal cap 67 in advance and is hardened thereon. However, since the metal cap 67 is normally formed by deep-drawing a metal plate, the flatness at the opening edge thereof is not satisfactory. Consequently, it becomes extremely difficult to apply the insulative resin 69 on the opening edge of the metal cap 67 in an even manner. It also becomes difficult to obtain a seal between the substrate 61 and the metal cap 67.
As is apparent from the above description, in the manufacture of the chip-type piezoelectric resonance components using metal caps, it is necessary to perform the steps of forming the insulative glass layer 55 on the substrate 51 and applying the insulative resin 69.
In order to overcome the problems described above, preferred embodiments of the present invention provide a substrate on which electric components are mounted and a chip-type piezoelectric resonance component including such a substrate.
The substrate according to preferred embodiments of the present invention provides a simplified structure for preventing a short-circuit between the metal cap and the electrodes on the substrate, facilitates attachment of the metal cap to the substrate, and greatly improves the sealing performance of the space enclosed by the substrate and the metal cap.
A substrate according to a preferred embodiment of the present invention includes a substrate body layer, a plurality of electrodes disposed on the substrate body layer, and a first glass-ceramic layer arranged so as to cover a portion of the electrode disposed on the substrate body layer.
Preferably, the substrate further includes a second glass-ceramic layer disposed on the lower surface of the substrate body layer.
The first and second glass ceramic layers may include one of anorthite-type crystallized glass, forsterite-type crystallized glass, celsian-type crystallized glass, a composite including a ceramic powder and one the above crystallized glasses, and a composite including a ceramic powder and non-crystallized glass.
A piezoelectric resonance component according to another preferred embodiment of the present invention includes the substrate of the above-described preferred embodiment of the present invention, a piezoelectric resonator mounted on the substrate, and a conductive cap bonded to the first glass ceramic layer of the substrate, so as to cover the piezoelectric resonator.
Preferably, the substrate body layer of the substrate includes a dielectric body and a plurality of capacitor electrodes arranged to define a capacitor in the substrate body layer.
Preferably, the first glass-ceramic layer disposed on the upper surface of the substrate has a substantially rectangular-frame shaped configuration.
Preferably, the piezoelectric resonance component is a piezoelectric oscillator.
Because the first glass ceramic layer is disposed on the substrate main body so as to cover a portion of the electrodes, when the substrate body layer includes a dielectric ceramic or an insulative ceramic, the substrate body layer and the glass ceramic layer can be baked at the same time, thus reducing the manufacturing cost of the substrate.
Furthermore, because the upper surface of the glass ceramic layer has excellent flatness, when the metal cap is bonded thereon, the space enclosed by the metal cap and the substrate is tightly sealed.
When the second glass ceramic layer is disposed on the lower surface of the substrate body layer, mechanical strength of the substrate is greatly improved by the second glass ceramic layer. Thus, the reliability of the electronic components using the substrates of various preferred embodiments of the present invention is greatly improved.
When anorthite-type crystallized glass or forsterite-type crystallized is used in the first or second glass layers or both, these crystallized glasses have lower thermal expansion coefficients compared to alumina. Thus, when the metal cap is bonded thereon, the thermal expansion coefficient difference between the metal cap and the substrate is small, and an electronic component having superior thermal stress properties can be obtained.
In the piezoelectric resonance component according to a preferred embodiment of the present invention, a piezoelectric resonator is mounted on the substrate, and the conductive cap is bonded to the glass ceramic layer of the substrate so as to cover the piezoelectric resonator. Thus, the conductive cap can be firmly bonded to the substrate by using an insulative adhesive or other suitable material, and the substrate, as described above, is manufactured at lower cost and has superior mechanical strength. The space enclosed by the substrate and the conductive cap can be tightly sealed, and a highly reliable piezoelectric resonance component can be obtained.
In the piezoelectric resonance component of preferred embodiments of the present invention, when the substrate body layer of the substrate is made of a dielectric body and at least a pair of capacitor electrodes for constituting a capacitor are disposed on the substrate body layer, the capacitor is included in the substrate body layer. Thus, a built-in capacitor type piezoelectric resonance component can be provided.
When the first glass ceramic layer provided on the upper surface of the substrate has a substantially rectangular-frame shaped configuration, by aligning and bonding the substantially rectangular-frame shaped first glass ceramic layer and the opening edge of the conductive cap, the piezoelectric resonator can be fixed in the space surrounded by the first glass ceramic layer. Thus, a piezoelectric resonance component having superior sealing effects can be obtained.
Other features, elements, characteristics and advantages of the present invention will become more apparent from the following detailed description of preferred embodiments with reference to the attached drawings.

Substrate for packaging electronic component and piezoelectric resonance component using the same

c/o Murata Manufacturing Co., Ltd., 26-10, Tenjin 2-chome


A container or carrier for securely carrying a substrate such as a reticle, mask, wafer, or the like during a semiconductor manufacturing process or during the transport of the substrate. The container includes a housing having an opening through which the substrate may be inserted and removed. The housing includes an open box and a lid, the lid securely held in place by a unique latching mechanism. A door that is hinged upon the lid and held in place by biasing springs substantially seals the housing opening. Within the housing are a plurality of suction cups upon which the substrate rests and which apply suction to firmly engage the substrate on only one side when the substrate is in a contained position. The suction cups hold the substrate in the contained position thereby preventing relative motion between the container and the substrate. The invention further provides for increasing the suction applied by the suction cups to the substrate by applying additional suction to modified suction cups from a vacuum pump. The invention also provides a method for securely containing a substrate within a container. The method including the step of fixing the substrate in a contained position within the substrate using suction.

The present invention relates to a container for securely carrying a substrate such as a reticle, mask, wafer, or the like. More particularly, the present invention relates to a container that may be used to store the substrate when not in use or that may be used to contain the substrate for transport.
Semiconductor manufacturing processes involve the use of reticles, masks and wafers which generally take the form of a substantially planar substrate. During the manufacture of semiconductor devices, small particles of foreign material may settle upon the particular substrate and damage the substrate or interfere with a manufacturing process. Great efforts are made to filter all particles from the environment in which semiconductor devices are manufactured and to prevent particles from contacting substrates. A continuing challenge in the industry is to remove smaller and smaller particles, even sub-micron sized particles, from the manufacturing environment and the associated equipment and to eliminate the introduction of particles into the environment from the equipment itself.
Prior devices minimized the settling of particles upon substrates by providing a container that was capable of housing the substrate. U.S. Pat. No. 4,422,547 to Abe et al., for example, described a container comprising a housing body that included an opening for receiving a substrate, a door for closing the opening, and means for fixing the received substrate in the container. The means for fixing the received substrate included a contact member for contacting the upper surface of the substrate to press it against a support surface in the housing when the door was closed. The contact member was adapted to retract to release the substrate when the door was opened. While the Abe et at. container prevented particles generated externally from settling onto the substrate, the device itself generated particles within the container which settled upon the substrate.
Some of the particles generated within the Abe et at. device were produced by the mechanism for fixing the substrate in the container. The mechanism for fixing the substrate in the container included a stainless steel member which rotated within bearings formed in the lid of the container above the substrate. The rotation of the stainless steel member within the bearing generated particles which fell directly upon the substrate. Further, because the contact member contacted the upper surface of the substrate, the contact member itself transferred particles directly to the substrate. Also, because the means for fixing the substrate in the container did not fully prevent relative motion between the substrate and the housing, particles were generated when the substrate rubbed against the container housing. These particles could settle on the substrate.
Improvements were made to the prior devices in an attempt to prevent relative motion between the substrate and the container. Such improvements included placing a silicone material on a ledge formed in the housing upon which the substrate rested. However, the silicone material did not entirely prevent relative motion between the substrate and the housing.
Another concern in constructing a container for a substrate is static electrical charge. Substrates are susceptible to electrical discharge. Even small quantities of electrical charge may create high voltages across portions of the substrate possibly destroying or damaging portions of the substrate and rendering the complete substrate useless. Therefore, it is desirable to house the substrate in a container that prevents electrical charge from propagating to the substrate.

Apparatus and method for securely carrying a substrate


A system for processing Aeromagnetic survey data to determine depth to basement rock is disclosed. The system uses Neural Networks having an input layer of elements, a hidden layer of elements and an output layer of elements which are interconnected by a weighted system of interconnections. A training session using known input and output data is used to train the Neural Network by adjusting the weighting functions repetitively to minimize any error in the output of the Neural Network.

1. The Field of the Invention
The present invention relates to a method for locating magnetic structural bodies within the earth and in particular to a method using neural networks for determining the subsurface location, geometry and depth to basement of these bodies from aeromagnetic data.
2. The Prior Art
Determination of the location and the depth to basement faults and structures in the earth is one of the most important reconnaissance exploration tools in the petroleum exploration industry. This is because many hydrocarbon reservoirs are associated with uplifted basement fault blocks and accurate mapping of subsurface structures greatly improves exploration well success rates and lowers the cost of finding hydrocarbons in sedimentary basins.
Subsurface geologic structure is commonly deduced from the mapping of surface structures and features, well log correlations, and by seismic reflection and refraction profiling. However, surface features do not always reflect deep structure when masked by surficial alluvium and moderately lithified shallow sediments. Also, the high cost of drilling deep exploratory well holes and collecting reflection seismic data often preclude their economic usefulness in delineating deep structures. Thus surveys which measure the magnetic field at or above the earth's surface, particularly from an airplane (aeromagnetics), can be an economic, environmentally attractive alternative to these other methods in unexplored or underexplored sedimentary basins.
Currently, aeromagnetic data are interpreted using combinations of simple computational and empirical techniques. The following Table I lists several of the manual and computer techniques currently used to predict location and depth of magnetic basement structural features.

System for neural network interpretation of aeromagnetic data


A method of manufacturing a piezoelectric thin film resonator forms, after forming a piezoelectric film on a substrate so as to cover a lower electrode formed on the substrate, an electrode material layer for forming an upper electrode above the piezoelectric film, forms a mask of a predetermined form on the electrode material layer, and then etches the electrode material layer to form the upper electrode. Before a step of forming the electrode material layer, a protective layer for protecting the piezoelectric film during etching of the electrode material layer is formed so as to cover at least a part of the piezoelectric film where the upper electrode is not formed, and the electrode material layer is then formed so as to cover the protective layer.

1. Field of the Invention
This invention relates to a method of manufacturing and a manufacturing apparatus for a piezoelectric thin film resonator in which a lower electrode, a piezoelectric film, and an upper electrode are formed in order on a substrate, a piezoelectric thin film resonator manufactured according to this method of manufacturing, and an electronic component constructed so as to include this piezoelectric thin film resonator.
2. Description of the Related Art
As one example of a piezoelectric thin film resonator manufactured according to this kind of method of manufacturing, a piezoelectric thin film element for use as a filter or the like in an electronic appliance, such as a mobile phone, is disclosed by Japanese Laid-Open Patent Publication No. 2001-251159. This piezoelectric thin film element is constructed by forming a lower electrode, a piezoelectric film, and an upper electrode in that order on a silicon substrate. In this case, the silicon substrate is a substrate for a piezoelectric thin film element with a silicon oxide film being formed on an upper surface thereof and a layer of a mask material being formed on a lower surface thereof. Also, a cavity for resonance is formed in the silicon substrate so that during driving, formed in the silicon substrate so that during driving, the lower electrode, the piezoelectric film and the upper electrode can resonate.
When manufacturing this piezoelectric thin film element, first a metal film for forming the lower electrode is formed on the silicon oxide film on the silicon substrate and etching is then carried out to leave parts of the metal film corresponding to the lower electrode and remove unnecessary parts, thereby forming the lower electrode. At this time, as one example, a mask is formed by forming a photoresist layer on the metal film and then exposing and developing the photoresist layer, and then etching is carried out using this mask. Next, the piezoelectric film is formed so as to cover the lower electrode by carrying out sputtering, for example, on the silicon substrate. After this, after the metal film for forming the upper electrode has been formed on the piezoelectric film, etching is carried out to leave parts of the metal film corresponding to the upper electrode and remove unnecessary parts, thereby forming the upper electrode. At this time, in the same way as when the lower electrode is formed, etching is carried out using a mask formed by exposing and developing a photoresist layer, for example. Next, etching is carried out with the mask material formed on the lower surface of the silicon substrate as a mask to form the resonance cavity. After this, by applying an organic resin material so as to cover the piezoelectric film and the upper electrode, an organic resin film is formed, thereby completing the piezoelectric thin film element.
However, by investigating the conventional method of manufacturing a piezoelectric thin film element, the inventors of the present invention discovered the following problem. That is, the conventional method of manufacturing forms the upper electrode by etching a metal film formed on the piezoelectric film. Accordingly, if the upper electrode is formed by wet etching, depending on the combination of the material forming the piezoelectric film and the metal(s) forming the upper electrode, when the etching liquid removes unnecessary parts of the metal film and contacts the surface of the piezoelectric film, the etching liquid for etching the metal film also etches the piezoelectric film. Also, if etching is completed just before the etching liquid starts to etch the piezoelectric film, some parts of the metal film that should be removed will definitely remain on the piezoelectric film. In this case, if the piezoelectric film is etched or parts of the metal film unintentionally remain, the electrical characteristics of the piezoelectric thin film element will not satisfy the desired characteristics for which the piezoelectric thin film element was designed. Accordingly, it is necessary to carry out etching so as to completely remove unnecessary parts of the metal film without etching the piezoelectric film. However, the time required to completely etch the metal film changes every time etching is carried out due to factors such as minute variations in the thickness of the metal film and changes in the temperature of the etching liquid. Accordingly, with the conventional method of manufacturing a piezoelectric thin film element, there is the problem that it is difficult to completely remove unnecessary parts of the metal film without etching the piezoelectric film when forming the upper electrode.

Method of manufacturing a piezoelectric thin film resonator, manufacturing apparatus for a piezoelectric thin film resonator, piezoelectric thin film resonator, and electronic component


A dispenser for applying a material to a surface includes a supply spool rotatable about an axis, a quantity of unused tape stored on the supply spool, and an applicator head about which the tape is passed. The head presses the tape against a surface to deposit a transfer layer of the tape onto the surface. A take-up spool stores a backing layer of the tape after the transfer layer has been deposited on the surface. The take-up spool is also rotatable about the axis. A housing surrounds at least a majority of the tape, a substantial portion of the housing being substantially cylindrical in shape. The tape is guided from the supply spool to the head and from the head to the take-up spool. The applicator head is located substantially along the axis, and the spools are movable along the axis. The tape causes movement of the spools along the axis as the spools are rotated about the axis. The-tape is stored on each spool in a plurality of tape layers thick and a plurality of tape widths wide.

The invention relates generally to the field of material dispensers, and in particular to dispensers from which a material is deposited to a surface from a tape stored in the dispenser.
Correction tape dispensers are used to apply a thin, white, opaque piece of correction tape over visible markings which have been made on a surface. Typically, the tape is used to cover a mistake in text on a piece of paper. After the tape has been applied over the mistake, the correct text can be written on top of the tape to fix the mistake.
U.S. Pat. No. 5,490,898 discloses a fairly typical arrangement of a correction tape dispenser (coating film transfer tool). The tool includes a case 2 formed in a flat box-like shape. Case 2 contains a pay-out reel 6 with a coating film transfer tape T wound thereabout, and a winding reel 7 for collecting the used tape Txe2x80x2. A tape drive D connects the two reels to maintain tension in the tape. The tape includes a backing layer which remains on the reels, and a covering layer for covering the visible image on the surface. Tape T passes around a transfer head H as the tape travels from reel 6 to reel 7. The arrangement of head H causes the tape covering layer to be deposited on the surface contacted by the tape while under pressure from the user.
Tape T and used tape Txe2x80x2 are stored respectively on reels 6 and 7 in a multi-layer thick/single-layer wide arrangement. This way of storing the tape on the reels, and the arrangement of the reels relative to each other and to head H causes the case to have the flat box-like shape. Having this case in such a shape is less than optimal for a correction tape dispenser. First, the case can at least partially block the user""s view of the material being corrected. Second, users would find a dispenser shaped more along the lines of a writing instrument (e.g. a cylindrically shaped pen or pencil) more natural to use when correcting writing on paper.
U.S. Pat. No. 5,049,229 discloses an apparatus for the application of an adhesive film in which the supply reel 5 and take-up reel 11 are both mounted on a shaft or axis 9. The tape is stored on these reels in a manner similar to that described in the previous paragraph (i.e. a multi-layer thick/single-layer wide arrangement). Such an arrangement also results in an apparatus shape having the drawbacks mentioned at the end of the previous paragraph.
The present invention is directed to overcoming one or more of the problems set forth above. Briefly summarized, according to one aspect of the present invention, a dispenser for applying a material to a surface includes a spool rotatable about an axis and a quantity of tape stored on the spool. The tape is passed around an applicator head, the head pressing the tape against a surface to deposit at least a portion of the tape on the surface. The applicator head is located substantially along the axis.
According to another aspect of the invention, a dispenser for applying a material to a surface includes a spool rotatable about an axis. The spool is movable along the axis. A quantity of tape is stored on the spool, the tape causing movement of the spool along the axis as the spool is rotated about the axis.
In accordance with a further aspect of the invention, a dispenser for applying a material to a surface includes a spool and a quantity of tape stored on the spool. The tape has a thickness, a width and a length, and is stored on the spool in a plurality of tape layers thick and a plurality of tape widths wide.
According to another aspect of the invention, a dispenser for applying a material to a surface includes a quantity of tape and a housing which surrounds at least a majority of the tape. A substantial portion of the housing is substantially cylindrical in shape.
The various features of the invention described above enable a correction tape dispenser which is more in the shape of a writing instrument, and thus more naturally wielded by a user of the dispenser.
These and other aspects, objects, features and advantages of the present invention will be more clearly understood and appreciated from a review of the following detailed description of the preferred embodiments and appended claims, and by reference to the accompanying drawings.

Dispenser for applying a material to a surface


The invention relates to a method for more effectively capturing the three-dimensional surface geometry of objects, particularly for teeth and/or intraoral structures, such as when a scanning processing is interrupted. Depth images are created in which the spatial relationships of points of the depth images to one another remain constant, but an overall spatial orientation of each new depth image is different. Points of the depth image that fulfill a first attribute is verified for every pose. The number of points that have this attribute is then counted. The pose that accordingly has the highest count is thus chosen, and an artificial depth image is then generated, in which the ascertained pose is applied “backwards” to create an artificial depth image. The real new depth image can then be transferred into the artificial depth image in order to create a new pose, which may then be verified by computation.

Various forms of intraoral scanners, with which depth images of three-dimensional surface geometries can be gained and then merged in different ways, are known from the state of the art. If, however, the process of scanning is interrupted, various elaborate procedures which frequently require human support become necessary in order to resume an interrupted scanning process. Known automated systems are generally unsuccessful or can only function if the area in which the scan is to be applied "anew" has previously been manually restricted.

Method for capturing the three-dimensional surface geometry of objects


A laser Doppler encoder includes a set of prisms mounted on a fixed base along with an additional prism, an end retroreflector and a laser/detector and a second set of prisms mounted on a moving/rotating base. The laser/detector generates a laser beam that is transmitted through the sets of prisms on the fixed and moving bases as well as the additional prism and the end retroreflector until the laser beam finally reaches a heterodyning detector that is housed coaxially inside the laser/detector. The laser beam is a frequency-stabilized laser beam such that the laser beam that is reflected back to the heterodyning detector is frequency-shifted by the movement of the moving base relative to the fixed base so that the amount of movement (either rotational or linear) of the moving base can be accurately determined. Moreover, the end retroreflector enables the laser Doppler encoder to be readily self-aligned such that the alignment time is substantially reduced and the three-dimensional optical path configuration results in a compact and integrated optical design which optimizes the system's anti-vibration performance. The laser Doppler encoder can be used in conjunction with a high energy resolution monochromator for accurately determining the rotational movement of an arm in the monochromator or can be used in conjunction with a closed looped motion controller for providing feedback on the rotational displacement of the arm of the monochromator so that the arm can be accurately positioned.

1. Field of the Invention
This invention relates to a relatively compact encoder apparatus for precisely measuring linear motion and angular rotation values, and more particularly, to a new and improved laser Doppler encoder that incrementally measures linear and angular displacements by transmitting a laser beam through a self-aligning, multiple reflective optical path.
2. Background of the Invention
It has becomes necessary in connection with manufacturing in high technology industries to very precisely control the motion of tools, automated robots, and control and metrology instrumentation. For example, such precise control of tools has become almost a necessity in lithography, chip manufacturing, and X-ray micromachining for microsensors. In addition, the study of materials and new science with X-rays, such as in the fields of DNA, human genome and structural biology, require high precision motion and detector systems which should function with tolerances in atomic and sub-atomic dimensions (usually a few Angstrom-nanometer levels). In this regard, typical research tools include high-resolution X-ray monochromators (for precise energy discrimination typically one part in a million or better), large-field scanning microscopes, profilometers, and X-ray microscopes.
Linear and angular encoders are digital devices that are utilized in these technologies and instrumentation to determine precisely linear motions and angular rotations of components. The encoders are currently available with resolutions limited to several tenths of a manometer and a few nano-radians in linear and angular resolution, respectively, and are generally limited to linear measurements in about the millimeter range and angular measurements in about a sub-degree range.
In connection with laser Doppler angular encoders (LDAE), no commercially available angular encoder provides a sub-nano-radian resolution in the 5-8 degree measuring range (a laboratory setup encoder has been reported that has achieved a resolution of a few nano-radians, but this is a large setup (about 610 mm.times.1220 mm) that is based on a polarization-encoded Michelson interferometer principle such that the measuring speed is undesirably slow). In the much larger 10-20 nano-radian (nrad) resolution range, an angular sensor currently on the market (Applied Geomechanics, Model-520) has a 10-nrad resolution, but this sensor only covers a measuring range of less than 0.01 degree with a very long measuring settling time (0.1-30 seconds). In the still larger 20-100 nrad resolution range, laser-based machine tool calibration systems exist, such as Hewlett Packard HP-5527B and Zygo ZMI-1000. From a few degrees up to 20-degree angular measuring range, these units provide a 20-100 nrad angular resolution, which is about two orders of magnitude less precise than what needs to be obtained in such a system. In the field of grating-based optical encoders, a model ROD-800 from Heidenhain is available. This encoder has a 250 nrad resolution with a 360-degree measuring range.
As can be appreciated, these types of available encoders are not acceptable for applications where very precise angular rotations measurements (for example, sub-nano-radian angular resolution) are required over at least a 5-8 degree measuring range. What is needed is a relatively compact encoder that provides an adequate, very precise resolution in an acceptable measuring range while providing a relatively fast measuring speed.
In connection with laser Doppler linear encoders (LDLE), a near-Angstrom linear encoder is a critical component for the successful development of a sub-nanometer resolution X-ray microprobe and a mirror-based X-ray interferometer. The development of a high-resolution X-ray microscope using near-Angstrom linear encoder technology could offer unprecedented capabilities for studying grain boundaries, interfaces, structures of materials and biological systems. The X-ray interferometer technology also can be valuable to calibrate the linear encoder.
The best currently available near-Angstrom linear sensor is based on the principle of capacitance measurement and has about 0.7 Angstrom resolution. However, its measuring range is only about 20 .mu.m with 2.5 mm/sec maximum measuring speed. When the measuring range is extended to the maximum of about 1.2 mm, the resolution of the capacitance sensor drops to 0.5 nm. On the other hand, the best commercial available laser interferometer system has 0.6 nm resolution with a size of 100 mm.times.100 mm.times.500 mm.
Accordingly, it is an object of the present invention to provide a new and improved compact laser Doppler encoder that is capable of measuring angular movements in the sub-nano-radian range and linear measurements in the sub-nano-meter range.
It is another object of the present invention to provide a new and improved laser Doppler encoder having very precise resolution of linear and angular rotation measurements by determining how the displacement of a target affects a laser beam that is transmitted through a self-aligning, multiple reflective optical path.
It is yet another object of the present invention to provide a new and improved laser Doppler encoder having a set of prisms on a fixed base and a set of prisms on a moving base so that the beam generated by a laser on the fixed base is reflected a substantial number of times between the prisms on the fixed and moving bases to increase the resolution of the encoder.
It is still another object of the present invention to provide a new and improved laser Doppler angular encoder for use with a high energy resolution monochromator and a laser Doppler linear encoder for use in the fields of X-ray lithography, large-field scanning microscopes, X-ray microscopes and X-ray micromachining.
Yet another object of the present invention is to provide a new and improved laser Doppler distance meter that is used with a closed loop feedback circuit to control a motion reduction mechanism to precisely position a movable base with respect to a stationary base.

Optical design for laser encoder resolution extension and angular measurement