A technique for shaping a ribbon-shaped ion beam is disclosed. In one particular exemplary embodiment, the technique may be realized as an apparatus for shaping a ribbon-shaped ion beam. The apparatus may comprise an electrostatic lens having a substantially rectangular aperture for a ribbon-shaped ion beam to pass through, wherein a plurality of focusing elements are positioned along short edges of the aperture, and wherein each focusing element is separately biased and oriented to shape the ribbon-shaped ion beam.

Ion implanters are widely used in semiconductor manufacturing to selectively alter conductivity of materials. In a typical ion implanter, ions generated from an ion source are directed through a series of beam-line components which include one or more analyzing magnets and a plurality of electrodes. The analyzing magnets select desired ion species, filter out contaminant species and ions having incorrect energies, also adjusting ion beam quality at a target wafer. Suitably shaped electrodes can be used to modify the energy and the shape of the ion beam.
FIG. 1 shows a known ion implanter 100 which comprises an ion source 102, extraction electrodes 104, a 90° magnet analyzer 106, a first deceleration (D1) stage 108, a 70° magnet analyzer 110, and a second deceleration (D2) stage 112. The D1 and D2 deceleration stages (also known as "deceleration lenses") are each comprised of multiple electrodes with a defined aperture to allow an ion beam to pass therethrough. By applying different combinations of voltage potentials to the multiple electrodes, the D1 and D2 deceleration lenses can manipulate ion energies and cause the ion beam to hit a target wafer at a desired energy.
The above-mentioned D1 or D2 deceleration lenses are typically electrostatic triode (or tetrode) deceleration lenses. FIG. 2 shows a perspective view of a conventional electrostatic triode deceleration lens 200. The electrostatic triode deceleration lens 200 comprises three sets of electrodes: entrance electrodes 202 (also referred to as "terminal electrodes"), suppression electrodes 204 (or "focusing electrodes"), and exit electrodes 206 (also referred to as "ground electrodes" though not necessarily connected to earth ground). A conventional electrostatic tetrode deceleration lens is similar to the electrostatic triode deceleration lens 200, except that a tetrode lens has an additional set of suppression electrodes (or focusing electrodes) between the suppression electrodes 204 and the exit electrodes 206.
In the electrostatic triode deceleration lens 200, each set of electrodes may have a space to allow an ion beam 20 to pass therethrough (e.g., in the +z direction along the beam direction). As shown in FIG. 2, each set of electrodes may include two conductive pieces electrically coupled to each other to share a same voltage potential. Alternatively, each set of electrodes may be a one-piece structure with an aperture for the ion beam 20 to pass therethrough. As such, each set of electrodes are effectively a single electrode having a single voltage potential. For simplicity, each set of electrodes are referred to in singular. That is, the entrance electrodes 202 are referred to as an "entrance electrode 202," the suppression electrodes 204 are referred to as a "suppression electrode 204," and the exit electrodes 206 are referred to as an "exit electrode 206."
In operation, the entrance electrode 202, the suppression electrode 204, and the exit electrode 206 are independently biased such that the energy of the ion beam 20 is manipulated in the following fashion. The ion beam 20 may enter the electrostatic triode deceleration lens 200 through the entrance electrode 202 and may have an initial energy of, for example, 10-20 keV. Ions in the ion beam 20 may be accelerated between the entrance electrode 202 and the suppression electrode 204. Upon reaching the suppression electrode 204, the ion beam 20 may have an energy of, for example, approximately 30 keV or higher. Between the suppression electrode 204 and the exit electrode 206, the ions in the ion beam 20 may be decelerated, typically to an energy that is closer to the one used for ion implantation of a target wafer. Therefore, the ion beam 20 may have an energy of, for example, approximately 3-5 keV or lower when it exits the electrostatic triode deceleration lens 200.
The significant changes in ion energies that take place in the electrostatic triode deceleration lens 200 can have a substantial impact on a shape of the ion beam 20. FIG. 3 shows a top view of the electrostatic triode deceleration lens 200. As is well known, space charge effects are more significant in low-energy ion beams than in high-energy ion beams. Therefore, as the ion beam 20 is accelerated between the entrance electrode 202 and the suppression electrode 204, little change is observed in the shape of the ion beam 20. However, when the ion energy is drastically reduced between the suppression electrode 204 and the exit electrode 206, the ion beam 20 tends to expand in both X and Y dimensions at its edges. As a result, a considerable number of ions may be lost before they reach the target wafer, and the effective dose of the ion beam 20 is reduced.
There have been attempts to reduce the above-described space charge effect in an electrostatic triode lens. In one approach, for example, Pierce geometry, well known to those skilled in the art, is introduced to each electrode in the electrostatic triode deceleration lens. That is, each electrode is bent at its tip to a defined angle such that electric fields inside the electrostatic triode lens are such that they generate focusing forces counteracting the space charge spreading effects at the edge of an ion beam. However, this approach can only achieve a limited success in controlling ion beam shapes. Despite a changed shape, each electrode still remains one conductive piece biased with a single voltage potential. As a result, generation of the focusing forces at the edge of the ion beam is constrained by the overall voltage potential applied to the electrode. In addition, one particular shape of an electrode may be useful for adjustment of only one particular beam shape or the purveyance of the ion beam.
In view of the foregoing, it would be desirable to provide a technique for providing an electrostatic lens which overcomes the above-described inadequacies and shortcomings.

Technique for shaping a ribbon-shaped ion beam

Varian Semiconductor Equipment Associates, Inc.


The current disclosure describes components, systems, and methods for assessing the size and style of rain gutters. One embodiment is a kit that includes an extension rod and a plurality of measurement templates. The extension rod includes a pivotable head and a magnet. Each of the plurality of measurement templates includes a body and at least one metal component. The body of each measurement template is arranged such that it conforms to the inside or outside dimensions or contours of a rain gutter. The measurement templates are arranged to physically engage with rain gutters when assessing rain gutters. The measurement templates can assess K-style, half-round style, and fascia style rain gutters.

Rain gutter systems are commonly used for residential homes, building, and other structures to manage rainwater by collecting the rainwater and channeling that rainwater away from the structure. Such management of rainwater can be critical for the overall maintenance and condition of the structure by reducing or eliminating damage to the structure and its foundation that can be caused by uncontrolled rainwater.
After such rain gutter systems are installed on structures, the rain gutter systems themselves may need maintenance or enhancements over time. For example, a component or section of a rain gutter system can be damage by high winds, hail, falling branches and trees, or other such adverse event and subsequently require repair. In another example, it may be desirable to enhance the efficacy of a rain gutter system with the addition of a gutter guard system. Gutter guard systems are often comprised of components or systems that are typically attached to or incorporated into rain gutter systems to prevent leaves, pine needles, branches, soot, shingle grit, and other such debris from entering the rain gutter. The selection of components and installation of a gutter guard system is dependent on the size and style of the rain gutter system. In any event, it is advantageous for a repairperson or installer to know the size and style of gutter that is to be repaired or enhanced. This is especially so when an installer needs to achieve a custom fit when installing a gutter guard system on a rain gutter system mounted on a building with unique structure and/or roofline requirements.
There are many different sizes and styles of rain gutters on the market in the United States and internationally. The differences in rain gutter sizes and styles are driven by a number of factors including different architectural styles for homes and buildings in different geographical regions and regional homebuilder and contractor trade practices that develop over time. Such different architectural styles can also be driven by differences in climate and weather patterns (for example, annual rain and snow fall), historical influences, availability of building materials, and so on.
Three styles of rain gutters make up a majority of the market—"K-style" gutters, "half-round gutters," and "fascia-style" gutters. FIG. 1 illustrates an exemplary K-style gutter 10. Typically, K-style gutters have a generally flat back section 12 that engages the structure and a flat bottom section 14 extending away from the structure that is generally perpendicular to the back section 12. A front section 16 extends upward and angles away from the bottom section 14 such that it forms an obtuse angle between the bottom section 14 and front section 16. The front section 16 typically includes a front lip 18 that is curled inward toward the interior of the gutter 10. The back section 12 also includes a rear edge or lip 20 that is slightly bent outward. Sizes for K-style gutters 10 are determined by the approximate distance from the front lip 18 of the front section 16 to the rear lip 20 of the back section 12, and typically come in sizes from about four inches to about seven inches, with the five inch and six inch variations being the most common.
FIGS. 2 and 3 illustrates exemplary half-round gutters 30, 50. As its name implies, a half-round gutter includes a body 32, 52 that is shaped as approximately a half-section of a tube. The half-round gutter 30, 50 is installed such that a back portion 34, 54 of the gutter 30, 50 is typically spaced apart from the structure due to connecting hardware. Such connecting hardware is typically inserted between the structure and the gutter 30, 50 so as to cause a slight relief for structure. However, there are also embodiments where an installed half-round gutter 30, 50 is installed such that the half-round gutter 30, 50 is in contact with the structure. In either embodiment the half-round gutter typically has a reinforced rear lip or hem 36, 56 as part of the back portion 34, 54 which is typically positioned just under the roofline of the structure. A front portion 38, 58 of the gutter 30, 50 typically includes a front lip 40, 60. In one example, as illustrated in FIG. 2, the front lip 40 can be arranged such that it curls inward toward the interior of the gutter 30. Such an arrangement is commonly referred to as a reverse curve half-round gutter. In another example, as illustrated in FIG. 3, the front lip 60 can be arranged such that it curls outward away from the interior of the gutter 50. Such an arrangement is commonly referred to as a standard half-round gutter. Sizes for half-round gutters 30, 50 are determined by the approximate distance from the front lip 40, 60 of the front section to the reinforced rear lip or hem 36, 56 of the back section 34, 54 and typically come in sizes from about four inches to about eight inches, with five and six inch variations common for standard half-round gutters and the reverse curve half-round gutters being more common in the six inch variation.
FIG. 4 illustrates an exemplary fascia-style gutter 80. Fascia-style gutters 80 are typically secured to rafter tails of the structure or roofline. Typically, fascia-style gutters 80 have a generally flat back section 82 that engages the rater tail or other similar portion of the structure and/or roofline. Optionally, the back section 82 can include an extended edge 84 protruding from the back section 82 (as illustrated in FIG. 4), which can be referred to in the industry as a "winged" or "winged-backed" fascia gutter. A bottom section 86 extends generally perpendicular away from the back section 82, and is generally shorter than the bottom section of a K-style gutter. A front section 88 extends upward and angles away from the bottom section 86 such that it forms an obtuse angle between the bottom section 86 and front section 88. This obtuse angle is generally larger than the similarly situated angle in a K-style gutter. The front section 88 typically includes a front lip 90 that is bent inward toward the interior of the gutter 80. Sizes for fascia-style gutters are determined by the approximate distance from the front lip 90 of the front section 88 to the back section 82, and typically come in sizes from about four inches to about six inches.
As will be appreciated, to make repairs to a rain gutter system or to install a gutter guard system, it can be difficult and time consuming for a repairperson, installer or salesperson to move to a position proximate to the rain gutter system where the repairperson, installer, or salesperson can physically measure the gutters that need repair or enhancement. It is advantageous if the repairperson, installer, or salesperson can assess the size and style of the rain gutter from the ground level. Thus, there is a need for components, systems, and methods for accurately assessing and determining the size and style of already installed rain gutter system from a generally remote position.

This patent is subject to a terminal disclaimer.


The game hoist apparatus is attachable to a tow hitch of a pickup truck or similar vehicle. The game hoist can be taken to the site in the bed of the truck and speedily installed in the tow hitch for hanging, cleaning and butchering large game, such as deer. The hoist includes a folding tubular boom of square cross-section, and having a winch, pulleys and a spreader bar for supporting the game animal. A stabilizer fixture on the end of the boom engages the spreader bar to prevent the game from twisting. The boom is made up of two sections which are locked in place at a swivel bracket by removable pins for operation, and unlocked by removing the pins for folding the unit for storage or transit. The boom lower end is supported from an attachment bar which is inserted into a tow hitch and locked in place with the hitch pin.

A. Cross Reference To Related Applications
The present application claims priority from earlier filed provisional application, Ser. No. 60/822,427, filed 10/27/2004, entitled "Folding Boom Lift Crane", by the same inventor.
B. Field of the Invention
The present invention relates to vehicle-mounted game hoists for lifting and skinning game. More specifically, the invention is a collapsible game hanger which prevents the game from twisting, which is installable on the trailer hitch of a pickup truck, and enables an open tailgate while utilizing the game hanger apparatus
C. Description of the Prior Art
There are a number of prior art game hanger devices of various configurations which are available in the industry. Some of these devices are mounted from a tree or other external support. Other of the prior art devices are intended to be mounted on the trailer hitch of a pickup truck or similar vehicle to facilitate transport of the hanger device to the vicinity of the downed game.
For example, U.S. Pat. No. 5,791,858, issued on Aug. 11, 1998 to Kenneth W. Sasser, describes a vehicle mounted game skinning device that is separable and connected to a receiver hitch assembly via a pin. The apparatus includes a winch and pulley assembly, an adjustable boom assembly and a gambrel for hoisting an animal. Despite its advantages, the gambrel device which is utilized can readily twist when the game is hoisted and the overall device does not allow room for the tailgate of the truck to be lowered.
U.S. Pat. No. 4,806,063, issued on Feb. 21, 1989 to W. Clifton York, describes a portable wild game hoist that is separable for storage and comprises a winch and pulley assembly with a gambrel that attaches to the ball hitch. The assembly is stabilized by straps that attach to the vehicle fender wells and a torsion bar on the boom which bears against the closed tailgate or a plate which rests on the hitch ball. Once again, the device features a twistable gambrel and anchoring elements which do not permit the lowering of the gate.
U.S. Pat. No. 5,540,537, issued on Jul. 30, 1996 to Wilmer M. Welch, describes a portable hoist which mounts to a trailer hitch drawbar receiver of a pickup truck that can use either a block and tackle or a pulley to support the winch cable. The device is located in close proximity to the tailgate, which must be closed, and the swinging terminal hook of the block and tackle or pulley system would allow the game to twist while being dressed.
The above references are not intended to be an all inclusive list of the relevant prior art but are believed to be representative of the state of the art. Despite the advantages offered by these improved designs, certain disadvantages continued to exist.
There is a need for a game hoist apparatus which can be readily attached and supported from the trailer hitch of a pickup truck or similar vehicle which will allow the tailgate to be opened in use, which prevents the game from twisting during skinning, and which can subsequently be quickly and easily detached from the trailer hitch and folded for transport or storage.


A wind-powered generator includes a housing having an inlet, an outlet, and a throat that are coaxial about an axis of symmetry of the housing. A nacelle includes a first rotor mounted on a first end of the nacelle and positioned at least partially within the inlet, the first rotor outputting a first power output, and a second rotor mounted on a second end of the nacelle, the second rotor being positioned at least partially within the outlet and having a diameter less than the first rotor. The second rotor outputting a second power output. The first and second power outputs are combined to provide a combined power output, and a nacelle ratio between outer diameters of the nacelle at the inlet and at the outlet is between about 1.60-1.70, and a housing ratio between inner diameters of the housing at the inlet and at the outlet is about 1.85-1.97.

Green energy (e.g., solar, wind, hydro, etc.) has seen a rapid rise in importance during the past decade, due at least in part to a global consciousness regarding fossil fuel consumption and its impact on the environment. As more consumers have begun to feel a desire to do "their part" for ensuring a healthy environment, the demand for improved devices to enable such consumers to aid in the global effort has increased.
While many consumers would like to contribute to the global effort by utilizing green energy, not all consumers have the ability to do so. For example, depending a consumer's location, energy producers utilizing green energy may be limited or even non-existent. Further, initial investment in green energy sources/generators can be high, thus discouraging energy producers from stepping into the market, and limiting many consumers ability to capitalize on the available, green energy sources.
Wind is one readily available power source and can be found in almost every location at most times. However, due to certain constraints (e.g., neighbor complaints, housing regulations, wildlife danger, etc.) consumers may be unable to even consider installation of a wind-powered generator.
Further, even in locations where wind-powered generators may be considered, based on certain aspects associated with various locations (e.g., wind shear, obstacles, etc.), wind airflow may be insufficient to generate stable power output using presently known wind turbines.
Therefore, despite many consumers' desire to derive power from wind, the proposition is often too costly and inefficient to be of interest.
U.S. Pat. No. 9,869,299 discloses a wind energy system and method for using the same.


Featured is a fixing device provided in an image forming device that includes a heat roll, a pressurization roll, an application member and a blade member. The heat roll has a surface that is heated to a desired temperature by a heating source and the pressurization roll presses a recorded medium (e.g., a paper sheet) holding an unfixed image to the heat roll. In this way, the unfixed image is fixed to the recorded medium by passing it between the heat roll and pressurization roll. The application member applies a release agent to the heat roll for preventing adherence of the unfixed image held on the recorded medium to the heat roll, where the release agent is impregnated to the application member and applied to the heat roll by capillary action. The blade member controls the application of the release agent so it is uniformly applied to the heat roll and removes excessive release agent to be applied on the heat roll. The application and blade members are positioned so that opposing end surfaces are adjacent to each other. In a more particular embodiment, the blade member is positioned adjacent a tip of the capillary of the application member. This advantageously results in suppressing a remaining release agent upstream of the blade member by the application member and automatically controlling the amount of the release agent carried up by the application member. In this way, the application region in the tip portion of the application member is in a saturated state and the excessive supply of the release agent is limited, which leads to stabilization of the supply quantity and the prevention of excessive release agent. Additionally, such an arrangement also prevents the dripping of the excessive release agent when applying the release agent.

The present invention relates to a fixing device for heat-fixing an unfixed toner image (yet to be fixed toner image) on a sheet (paper) which is a recorded medium equipped in an image forming device such as a copying machine, laser beam printer, facsimile and the like using an electrophotograph method.
The image forming device utilizing an electrophotograph method creates a manifest image by powder toner from a latent image formed on a photosensitive body having a photosensitive layer which works as a recording medium, and transfers said manifested toner image onto a sheet-type paper which is the recorded medium, and since said toner is yet to be fixed, heat is applied to melt the toner, and then pressure is added thereto to fix said toner image onto the paper. In order to do so, a fixing device is provided on the downstream side of a paper conveyance passage which passes through an image forming region, for example, just before a discharge portion of the paper.
One example of conventional fixing device disclosed for example in Japanese Laid-Open Patent Publication No.6-202518, is formed of a heat roll having in the interior thereof a heater lamp comprising a halogen lamp as the heating source and a pressurization roll pressurized to said heat roll by a predetermined pressurization force, and is positioned on the upstream side of a discharge portion of the conveyance passage which passes through an image forming portion, wherein a toner image on a sheet-type paper formed at the image forming portion is contacted to the heat roll, and by the heat of the heat roll and the pressurization force, the toner image is heat-fixed to the sheet.
In the fixing device, the heat roll contacts the toner when fixing the toner on the sheet of paper, so the toner adheres to the heat roll. In order to remove the toner on the heat roll, a cleaning web and the like are mounted. In this case, so as to reduce the cleaning load, an application device for applying a release agent of a silicon oil and the like on the surface of heat roll is equipped, thereby performing the fixing operation while aggressively preventing toner from being adhered to the heat roll.
The application device supplies and applies the release agent stored in a tank by sucking up the release agent with an application member to an application roll being pressed against and rotated against a surface of the heat roll, thereby applying the release agent applied to the application roll onto the heat roll. The application member has one end portion being submerged to the release agent in the tank, and the other end being pressed against the application roll. The application member sucks up the release agent utilizing a capillary phenomenon (action), and applies the same to the application roll on the pressed portion. Thereby, the application member comprises of a felt and the like.
The application of release agent by the application member comprising a felt and the like is not stable of its application quantity. Therefore, the application quantity to the application roll is uneven. So when applying the release agent to the heat roll, an excessive application and the like will occur, which causes fouling of the sheet by the release agent or the fouling of the interior of the image forming device including the fixing device by the dripping of the excessive release agent. Therefore, a blade for removing the excessive release agent applied by the application member and for limiting the amount of the release agent on the surface of application roll so as to form an even layer (film thickness) is mounted on the downstream side of the rotational direction of the application roll.
The blade is a rubber blade for example having elasticity, wherein the tip end portion thereof is pressed against the surface of application roll. Therefore, a uniformly controlled (limited) release agent layer (film) will be formed on the surface of application roll, even in the direction of rotational axis, after the blade has passed through the surface.
The excessive release agent removed from the surface of application roll by the blade will either be sucked by the application member and returned to the tank, or gets over the application member and returned to the tank. Thereby, the unnecessary release agent will be collected and circulated for supply.
According to the conventional fixing device disclosed in the above-mentioned publication, the release agent could be uniformly applied to the heat roll, which prevents the excessive application of the release agent to the roll. Therefore, fouling of the paper by the release agent will not happen.
However, when removing the excessive release agent by the blade, the excessive release agent will, get over the application member to be collected by a tank and to be reused, but on the other hand, a part of the excessive release agent will drip off from the both end portions of the blade, which will not be collected by the tank, fouling the interior of the fixing device with the release agent.
This happens because the blade and the application member are mounted with a sufficient space in between so as to maintain the excessive release agent. When the amount of release agent being collected at this area increases, the excessive release agent will drip off from the both end portions of the blade.
The above-mentioned problem will now be explained in detail. By the starting of operation of the fixing device, the application roll will be rotated, and the release agent being sucked up by the capillary action of the application member will be supplied to the rotating application roll by the viscosity of the release agent. The application member supplies the release agent to the application roll, and at its tip portion, the release agent will be in an unsaturated state. So as to compensate the lack of release agent at the tip portion, the release agent will further be carried up by the capillary action, and will be supplied to the application roll. When such supply of the release agent is continued, the adherence quantity (supply quantity) of the release agent from the application member to the surface of application roll will, though the amount may differ by the characteristics and the surface roughness of the material of application roll, be approximately in the order of 10.sup.-3 g/cm.sup.2.
However, the amount of release agent necessary for fixing the image, or the adherence quantity of the release agent after the passing of the blade, is approximately 1/10 of that amount. Therefore, most of the release agent being applied by the application member is wiped away by the blade. The excessive or surplus release agent generated as above will travel along the edge portion which is the contacting portion of the application roll and the blade, and will drip off from the both side end portions of the blade as release agent drops. The interior of the fixing device and the image forming device will be fouled by the release agent if the dripping release agent will not be collected.
Therefore, the tank must be large enough to cover the whole lower area of the application roll for collecting the excessive release agent, and the tank should be positioned so as to protrude from the both side end portions of the application roll in the direction of rotational axis. Therefore, the application device itself will become large, and as a result, the whole fixing device will become large. Further, there is a need to mount a means for collecting the release agent, which will raise the cost.
Therefore, a device is considered where the amount of release agent supplied to the application member for applying the release agent to the application roll is limited, so that no excessive release agent will be applied to the application roll. For example, the above-mentioned Japanese Laid-Open Patent Publication No.6-202518 discloses a plan to stabilize the supply quantity of the release agent by mounting a filter cover made of a porous fluoroplastic and the like to the contacting portion of the tip of the application member and the application roll.
However, it is very troublesome to mount a fluoroplastic cover to the application member itself, and if the porous state is uneven, the quantity of supply will be changed greatly, and uniform application may not be performed by such supply disorder. Further, the application member will become expensive.
Further, the above-mentioned publication also proposes to remove the application member, and to mount a supply pump of the release agent, which pumps up the release agent and to spray the release agent through an application nozzle to the application roll. According to such structure, the amount of release agent to be supplied by the supply pump could easily be adjusted, which enables to control the supply of excessive release agent, and to reduce the amount of release agent to be removed by the blade, thereby enabling to restrict the dripping off and the like of the release agent.
However, such device requires a large-scale means such as supply pumps and application nozzles. This not only increases the size of the device, but also raises the cost greatly, so it is not suitable for the miniaturization or the cost-reduction in a device.
On the other hand, in the case where the excessive release agent is removed by the blade and collected by the tank for the reuse, the release agent may be deteriorated by the long-term use. In recent years, though, the release agent to be used in such devices utilize a silicon system oil which is chemically highly stable, and the problem of deterioration is solved to some extent.
However, by recycling and reusing the release agent, foreign matters such as the additive included in the toner or the toner itself will simultaneously be collected with the collection of the release agent. That is, the foreign matter adhered to the heat roll performing the fixing process will be adhered to the application roll, and will manage to pass through the application member and removed by the blade, and collected to the tank. As a result, many impurities will be mixed into the release agent, damaging the release ability or the glossiness of the image, and creates the cause of offsets.
This problem could not be solved by the above-mentioned methods, and it is a problem that could not be solved when recycling and reusing the release agent.
Therefore, a supply pump could be mounted without reusing the release agent, and by limiting the amount of supply, the release agent corresponding to the reduced amount of release agent could be applied. However, in such case, the size of the device will be increased as was explained above, and the problem of raise in the cost is left unsolved.

Fixing device equipped in image forming device


A system and method for guard point licensing is provided. Licensed software executing on a storage system is modified to include one or more guard points to ensure that appropriate licenses have been obtained by a customer. During initialization of a guard point, a management system obtains a first random number (R1) from the first system and passes R1 and an application specific context command to the second system. The second system returns to the management system a pass phrase and a second random number (R2), which are then forwarded to the first system. The pass phrase is a data structure identifying the system that generated the pass phrase as well as containing the application specific context command. The above steps are then repeated with the first and second systems inverted.

A storage system is a computer that provides storage service relating to the organization of information on writable persistent storage devices, such as memories, tapes or disks. The storage system is commonly deployed within a storage area network (SAN) or a network attached storage (NAS) environment. When used within a NAS environment, the storage system may be embodied as a file server including an operating system that implements a file system to logically organize the information as a hierarchical structure of directories and files on, e.g. the disks. Each "on-disk" file may be implemented as a set of data structures, e.g., disk blocks, configured to store information, such as the actual user data for the file. A directory, on the other hand, may be implemented as a specially formatted file in which information about other files and directories are stored. As used herein a file is defined to be any logical storage container that contains a fixed or variable amount of data storage space, and that may be allocated storage out of a larger pool of available data storage space. As such, the term file, as used herein and unless the context otherwise dictates, can also mean a container, object or any other storage entity that does not correspond directly to a set of fixed data storage devices. A file system is, generally, a computer system for managing such files, including the allocation of fixed storage space to store files on a temporary basis.
The file server, or storage system, may be further configured to operate according to a client/server model of information delivery to thereby allow many client systems (clients) to access shared resources, such as files, stored on the storage system. Sharing of files is a hallmark of a NAS system, which is enabled because of its semantic level of access to files and file systems. Storage of information on a NAS system is typically deployed over a computer network comprising a geographically distributed collection of interconnected communication links, such as Ethernet, that allow clients to remotely access the information (files) on the storage system. The clients typically communicate with the storage system by exchanging discrete frames or packets of data according to pre-defined protocols, such as the Transmission Control Protocol/Internet Protocol (TCP/IP).
In the client/server model, the client may comprise an application executing on a computer that "connects" to the storage system over a computer network, such as a point-to-point link, shared local area network, wide area network or virtual private network implemented over a public network, such as the Internet. NAS systems generally utilize file-based access protocols; therefore, each client may request the services of the storage system by issuing file system protocol messages (in the form of packets) to the file system over the network identifying one or more files to be accessed without regard to specific locations, e.g., blocks, in which the data are stored on disk. By supporting a plurality of file system protocols, such as the conventional Common Internet File System (CIFS), the Network File System (NFS) and the Direct Access File System (DAFS) protocols, the utility of the storage system may be enhanced for networking clients.
A SAN is a high-speed network that enables establishment of direct connections between a storage system and its storage devices. The SAN may thus be viewed as an extension to a storage bus and, as such, an operating system of the storage system enables access to stored information using block-based access protocols over the "extended bus". In this context, the extended bus is typically embodied as Fibre Channel (FC) or Ethernet media adapted to operate with block access protocols, such as Small Computer Systems Interface (SCSI) protocol encapsulation over FC or TCP/IP/Ethernet.
A SAN arrangement or deployment allows decoupling of storage from the storage system, such as an application server, and some level of information storage sharing at the application server level. There are, however, environments wherein a SAN is dedicated to a single server. In some SAN deployments, the information is organized in the form of databases, while in others a file-based organization is employed. Where the information is organized as files, the client requesting the information maintains file mappings and manages file semantics, while its requests (and server responses) address the information in terms of block addressing on disk using, e.g., a logical unit number (lun).
Certain storage systems may support multi-protocol access and, to that end, enable clients to access data via both block and file-level requests. One example of such a storage system is described in U.S. patent application Ser. No. 10/215,917, entitled MULTI-PROTOCOL STORAGE APPLIANCE THAT PROVIDES INTEGRATED SUPPORT FOR FILE AND BLOCK ACCESS PROTOCOLS, by Brian Pawlowski, et al.
Certain storage systems may also include functionality to mirror data from a source storage system to a destination storage system. Furthermore, many storage system implementations include other capabilities that are utilized amongst a plurality of storage systems including, e.g., load balancing, mirroring, backup and/or restore operations, etc. Storage system vendors may utilize a multi-tiered licensing model for these functionalities, i.e., the same functionality may be licensed at different price points for different types of storage systems. For example, higher-end enterprise class storage systems may be licensed at a higher price point than lower-end storage systems intended for use by small/medium businesses. The difference in price points may reflect improved functionality available on enterprise class systems and/or the ability to cross subsidize costs, i.e., to lower prices for licensed functionality available on lower-end storage system functionalities by charging more for the same functionality available on higher-end systems. Storage system vendors may utilize tiered licensing schemes for various other functions, e.g., licensing of certain data access protocols, etc.
A noted disadvantage of such multi-tiered licensing arises when, e.g., a customer purchases both an enterprise class storage system and one or more lower-end storage systems. The user may utilize the licensed functionality of the lower-end storage system to interoperate with the enterprise class storage system, thereby recognizing a substantial cost savings to the customer and lost revenue to the vendor. For example, a customer may purchase an enterprise class storage system for use as its primary storage system. The customer may also purchase a lower-end storage system for use as a mirroring destination, which typically costs substantially less than a license for such functionality on the enterprise class storage system. Similar disparities in licensing may occur in other non-storage system environments including, e.g., in application service provider environments, etc.

System and method for differentiated cross-licensing for services across heterogeneous systems using transient keys


A separator includes an electrically conductive flat plate and two electrically conductive channel plates superposed on each other with the electrically conductive flat plate interposed therebetween. The separator includes a plurality of manifolds for passing a reaction fluid to an adjacent cell are provided in the electrically conductive flat plate, and a plurality of zigzag or straight through-channels for permitting the flowing of the reaction fluid from the manifolds are formed in each of the two channel plates. The separator includes the through-channels in any one of the two electrically conductive channel plates disposed so that they are partially overlapped with the manifolds in the electrically conductive flat plate, and the through-channels in the other electrically conductive channel plate are formed to be partially larger than the contour of the electrically conductive flat plate.

1. Field of the Invention
The present invention relates to a separator, i.e. a Bipolar Plate separator, which is a member of a fuel cell, and a fuel cell using it.
2. Related Art
There are several types of fuel cells, depending on the type of an electrolyte. A phosphoric acid-type fuel cell is of a type using phosphoric acid infiltrated in a support, and is operated at 150 to 220° C. A molten carbonate-type fuel cell is made using a mixture of lithium carbonate and potassium carbonate molded in an electrolyte support, and is operated at 600 to 700° C. A solid oxide-type fuel cell uses stabilized zirconia having an oxygen ion-conducting property as an electrolyte, and is operated at 700 to 1,000° C. In both of the fuel cells, hydrogen, a reformed gas, hydrocarbons or the like is used as fuel, and air is used as an oxidizing gas.
Among various fuel cells, a polymer electrolyte fuel cell (PEFC) and a direct methanol-type fuel cell (DMFC) have a main feature in that a carbon electrode having a catalyst such as platinum carried thereon is bonded to opposite surfaces of a membrane-shaped solid electrolyte formed of a polymer. This assembly is called MEA (a membrane electrode assembly which is also referred to as a membrane/electrode integrated structure). The polymer electrolyte fuel cell assumes a structure called as a separator, in which MEA is clamped between a pair of plates in which channels for a fuel gas (a hydrogen-containing gas) and an oxidizing gas (oxygen or air).
Herein, fuel and an active substance as an oxidizing agent are called collectively a reaction fluid. When each of the fuel and the oxidizing agent is a gas, it called particularly a reaction gas. The following is the description taking, as an example, a case where the fuel and the fluid as the oxidizing agent are gasses.
Usually, MEA and a separator are clamped through a porous carbon sheet. This porous carbon sheet is called a gas diffusion layer and has a function to supply the reaction gas to an electrode with a good efficiency and uniformly. An assembly comprising the MEA, the separator and the gas diffusion layer combined to one another into a set is referred to as a single cell. The fuel cell stack is a structure made by laminating a plurality of simplex cells one on another. The separator has a role to supply the reaction gas to the electrode with a good efficiency, and a power can be taken out by supplying the reaction gas to the fuel cell and applying an appropriate load. This is accompanied by the generation of a heat such as a reaction heat and a joule heat. To remove this heat, usually, the fuel cell is provided with a separator for passing cooling water to a portion of the above-described separator.
The separator has a role to transmit a power to an adjacent cell, while suppressing the loss of energy and hence, is usually formed of a carbon-based conductive material and has through-channels formed therein for passing the reaction gas and a cooling medium. It is also investigated that a thin metal plate is used as a separator material in addition to the carbon-based material. A separator made of a metal has merits that the separator is inexpensive in material cost is low; the separator is easy to form by stamping; and the separator can be made compactly and with a reduced weight, because a thin plate can be used.
In a case of a separator having channels and formed by pressing of a thin metal plate, the processability or workability is restricted to a limit of the processability of a metal material and for this reason, it is difficult to form a channel having a desired depth and a desired width by processing. This causes evil influences that the uniformity of the flowing of the reaction gas is not obtained and that a sufficient area of contact with the electrode cannot be provided, and as a result, it is difficult to provide a desired power-generating performance. Even if the formation of a desired groove by processing is possible, a warpage or a strain may be generated in the separator produced after the processing, and a required finishing accuracy may be not provided in some cases, thereby bringing about the leakage of the reaction gas and an increase in contact resistance.
Another drawback of the separator formed by the pressing of the metal is a problem that each of apexes produced after the formation of the grooves has a curvature, and in a case of an integrated MEA comprising a gas diffusion layer and MEA formed integrally with each other, an area of contact with the integrated MEA is smaller and as a result, the resistance is increased, and a good power-generation performance cannot be obtained. To solve this problem, it is a conventional practice to remove the apex portions having the curvature to flatten the separator (for example, see JP-A-2003-173791).
It is also a conventional practice to form a single separator by a thin metal plate and a carbon paper cut into a channel-defining configuration without carrying out the pressing (for example, see JP-A-2000-123850 and JP-A-2000-294257). The separator of this structure can be produced at a reduced cost. In addition, the channels are created by cutting the carbon paper and hence, the finishing accuracy is higher. Further, the surface of contact of the gas diffusion layer is flat and hence, there is not a problem as arisen in the case of the separator produced by the pressing of the metal.
Besides, in general, the fuel cell generates heat with the generation of a power. Usually, it is required in the fuel cell that cooling water is passed to a cooling cell mounted within the cell to remove a heat and is subjected to the heat exchange. It has been also designed that an oxidizing gas itself is used as a cooling medium in some of molten carbonate-type fuel cells. In the solid polymer electrolyte fuel cell, however, it is not that the cooling by the gas medium is carried out in the majority of cases, for a reason that the temperature of the cell is lower, for a reason that an auxiliary power as small as possible is demanded from the viewpoint of increasing the power-generating efficiency, and for another reason. If the cooling efficiency of the fuel cell is improved, the need for use of a cooling cell, a cooling water pump, a heat exchanger and the like is eliminated and consequently, the simplification of the system is realized.
The separator formed from the thin metal plate and the carbon paper cut into the channel-defining configuration as the gas channel member has many advantages. However, the carbon paper defining the channels is divided into a large number of pieces and hence, a plurality of channel members subdivided in accordance with an increase in number of channels are required. As a result, the following problem is arisen: The number of parts for constituting the cell is increased, and these parts are bound together by a conductive material, resulting in an increase in number of manufacturing steps. In the inventions described in JP-A-2000-123850 and JP-A-2000-294257, it is also a subject to be solved that the prevention of the metal corrosion occurring on the surface of the metallic separator which is in contact with the channel portions is not taken into consideration. In an environment of the cell, the metallic portion is corroded, or a non-conductive passivation film is grown on the metallic portion. As a result, the deterioration of the fuel cell might occur due to an increase in contact resistance, the pollution of the electrodes and the electrolyte membrane by a corrosion product and the like. In addition, no attention is especially paid to the cooling of the body of the fuel cell in all of the above-described patent documents.
It is an object of the present invention to provide a separator which can be produced using a reduced number of parts as compared with the prior art using a carbon paper cut into a channel-defining configuration and which has a higher cooling effect, and a fuel cell including such separator.

Separator for fuel cell and fuel cell containing the separator


Human fetal neuro-derived cell lines are implanted into host tissues. The methods allow for treatment of a variety of neurological disorders and other diseases. A preferred cell line is SVG.

The present invention relates generally to methods for treating a host by implanting genetically unrelated cells in the host. More particularly, the present invention provides methods of treating a host by implantation of immortalized human fetal neuro-derived cells.
Organ transplantation has become a successful and widely practiced means of treating a variety of diseases. Cardiac, renal, and even liver transplants are almost routine in many medical centers. Unfortunately, disorders of many organs are not amenable to treatment with whole organ transplants. For example, lesions of the central nervous system may not be treated by whole organ transplants to replace damaged tissue.
Because replacement of injured tissue by whole organ transplant therapy is not possible for many diseases, or even for all patients having appropriate diseases, attempts have been made to develop methods of transplanting cells. Sun et al., Biomat., Art. Cells, Art. Org., 15:483-496 (1987). Parenchymal lesions which result in a deficiency of a biologically active compound may be treated by transplanting isolated cells or cell clusters that secrete the biologically active compound. For example, diabetic animals have been successfully treated by implantation of islets of Langerhans separated from donor pancreases. Noel et al., Metabolism, 31:184 (1982).
Cell transplant therapy is particularly appealing for treatment of neurological diseases. Solid tissue transplantation is especially inappropriate for neurological diseases for several reasons. Open surgical exposure of the brain, as required for solid tissue transplantation, can cause irreparable damage to nervous system pathways resulting in clinical neurological deficits. Also, neurological function often depends on complex intercellular connections which can not be surgically established. Further, cells of the central nervous system are exquisitely sensitive to anoxia and nutrient deprivation. Rapid vascularization of solid tissue transplants is critical as cells in the interior of solid tissue transplants often lack sufficient perfusion to maintain viability. Stenevi et al., Brain Res., 114:1-20 (1976).
One common neurological syndrome, Parkinsonism has been the object of attempts at cell transplant therapy. Bjorklund et al., Brain Res., 177:555-560 (1979); Lindvall et al., Science, 247:574-577 (1990); Freed, Restor. Neurol. Neurosci., 3:109-134 (1991). Parkinsonism is caused by a loss of dopamine-producing neurons in the substantia nigra of the basal ganglia. Burns et al., N. Engl. J. Med., 312:1418-1421 (1985); Wolff et al., Neurobiology, 86:9011-9014 (1989). Parkinson's disease, a disease of unknown etiology which is characterized by the clinical manifestations of Parkinsonism, is caused idiopathic destruction of these dopamine-producing neurons. Parkinsonism may be caused by a variety of drugs, e.g., antipsychotic agents, or chemical agents, e.g., 1-methyl-4-phenyl-1,2,3,6-tetrahydropyridine. Burns et al., Proc. Natl. Acad. Sci. USA, 80:4546-4550 (1983) and Bankiewicz et al., Life Sci., 39:7-16 (1986).
Attempts have been made to reverse the clinical manifestations of experimentally-induced Parkinsonism by transplanting dopaminergic cells into the striatum of affected animals. Genetically modified fibroblasts (transfected with DNA encoding tyrosine hydroxylase) have been successfully transplanted into animals having lesions of dopaminergic pathways. Motor function and behavior of the animals improved following implantation of the dopamine producing fibroblasts. Wolff et al., Proc. Natl. Acad. Sci. USA, 86:9011-9014 (1989); Fisher et al., Neuron, 6:371-380 (1991). Graft survival may be enhanced, and hence clinical improvement prolonged, by transplantation of fetal tissue, as compared to cells obtained following birth. Gage and Fisher, Neuron, 6:1-12 (1991). Fresh fetal dopaminergic neurons have been transplanted into the caudate nucleus of monkeys following chemical injury to the nigrostriatal dopamine system. Following transplantation, the injury-induced behavioral deficits improved. Bankiewicz et al., J. Neurosurg., 72:231-244 (1990) and Taylor et al., Prog. Brain Res., 82:543-559 (1990).
Humans suffering from Parkinsonism have been treated by striatal implantation of dopaminergic neurons. Lindvall et al., Arch. Neurol., 46:615-631 (1989); Widner et al., New Engl. J. Med., 327:1556-1563 (1992). The transplanted cells were obtained from abortions. Prior to the abortions, the women were screened for antibodies to several disease causing viruses. Following surgery, the treated patients exhibited improvement of neurological function. The patients required maintenance immunosuppressive therapy, however.
Recent investigations indicate that trophic factors released from support cells of the central nervous system (e.g., astrocytes and oligodendrocytes) are critical to survival of neurons in cell culture. O'Malley et al., Exp. Neurol., 112:40-48 (1991). Implanted fibroblasts that were genetically altered to express nerve growth factor have been shown to enhance survival of cholinergic neurons of the basal forebrain following injury to the fimbria-fornix which causes demise of acetylcholine neurons in the basal forebrain as seen in Alzheimer's disease. Rosenberg et al., Science, 242:1575-1577 (1988).
While previous attempts at cell transplant therapy for neurological disorders have provided encouraging results, several significant problems remain. The supply of fetal tissue for cellular transplants is quite limited. To ensure maximum viability, the fetal cells must be freshly harvested prior to transplantation. This requires coordinating the implantation procedure with elective abortions. Even then, fetal tissue has not been widely available in the United States. Also, the gestational age of the fetus from which cells are obtained influences graft survival. Gage and Fisher, supra. Obtaining fetal tissue of only certain gestational ages adds additional limitations to the availability of fetal cells for transplant. Further, ethical considerations make some potential transplant recipients reluctant to undergo the procedure when fresh fetal cells are implanted.
Because the fetal tissue is obtained from fresh abortuses, a significant risk of infectious contamination exists. Although women undergoing abortions which will supply fetal tissue are screened for a variety of infections, some infections, e.g. HIV, may not be clinically detectable and thus, not identified during the screening process. Therefore, if widely practiced, transplants of fresh fetal cells would likely cause many infectious sequelae.
Use of immortalized cell lines could overcome many of these difficulties of availability and infection only one immortalized human fetal neuro-derived cell line has been reported, however. Major et al., Proc. Natl. Acad. Sci. USA, 82:1257-1262 (1985) and U.S. Pat. No. 4,707,448. Further, immortalized cell lines, by their very nature, are predisposed to causing tumor formation following in vivo transplantation. Therefore, therapeutic intracerebral transplantations of immortalized cells carry a high risk of causing intracranial tumors, and even tumors having a benign histology may carry a poor prognosis when present within the calvarium.
Transplants of genetically unrelated cells carry the risk of immunological graft rejection and intracerebral inflammation. Widner and Brundin, Brain Res. Rev., 13:287-324 (1988). All transplants of genetically unrelated cells carry this risk. Therefore, patients treated by intracerebral cell transplant have required long-term maintenance immunosuppression which, even in the absence of transplanted immortalized cells, carries a high risk of infectious and malignant complications. The transplantation of immortalized cells only magnifies the risk of these complications.
What is urgently needed in the art are methods of therapeutically implanting immortalized human fetal neuro-derived cells. Ideally, the methods would not result in tumor formation or elicit intense inflammation following transplantation. Desirably, the methods could employ cells derived from cell lines so that the risk of infectious contamination and limited cellular availability would be minimized. Quite surprisingly, the present invention fulfills these and other related needs.

Use of neuro-glial cell lines for transplantation therapy

The United States of America as represented by the Department of Health and Human Services


Provided is a data transmission system, including: a transmitting device configured to transmit a data signal; a receiving device configured to receive the transmitted data signal; and a transmission path for transmitting the data signal, the receiving device including: a detection unit configured to detect a timing at which a polarity of the received data signal is inverted; a plurality of resistors to be selectively connected to a terminal side of the transmission path; and a switching unit configured to switch the plurality of resistors based on the detected timing, the switching unit being configured to select a resistor having a higher resistance value than a characteristic impedance of the transmission path, during a first period, which is a predetermined period from a time point at which the polarity is inverted, and to select, after the first period, a resistor having the same resistance value as the characteristic impedance.

1. Technical Field
This application relates to a data transmission system and a receiving device.
2. Description of the Related Art
Hitherto, in high-speed serial data transmission, there has been known a problem in that a data signal transmitted from a transmitting device (source device) is affected by the characteristics of a transmission path to cause the deterioration of an eye pattern of the data signal, resulting in signal quality degradation. Regarding this problem, a technology called "pre-emphasis" has been proposed as a technology for improving the eye pattern of the data signal (Japanese Patent Application Laid-open No. 2013-128190).

Data transmission system and receiving device

PANASONIC LIQUID CRYSTAL DISPLAY CO., LTD.


An organic blend chemical additive comprising more than 50 wt. % organic solvent (e.g. methanol and/or ethylene glycol), less than 10 wt. % water, a nitrate salt, a maleic acid copolymer, and optionally an imidazoline may be delivered to a production well through a conduit having a stainless steel and corrosion resistant metal alloy surface, such as a capillary string or an umbilical tubing, the organic blend chemical additive being shown to be useful in inhibiting localized corrosion of and improving the repassivation of the equipment or conduit.

It is well known that steel and alloy made tubulars and equipment used in the production of oil and gas are exposed to corrosive environments. Such environments generally contain acid gases (CO2 and H2S) and brines of various salinities. Under such conditions, the steel or alloy will corrode, possibly leading to equipment failures, injuries, environmental damage, and economic loss.
While the rate at which corrosion will occur depends on a number of factors, such as the type of metal or alloy, partial pressure of the acid gases, salinity, pH, temperature, etc., some sort of corrosion almost inevitably occurs. One way to mitigate this problem is to introduce corrosion inhibitors in the hydrocarbon production system.
Corrosion inhibitors are widely introduced into oil and gas production wells and pipeline transmission lines to help prevent or reduce corrosion of carbon steels surfaces coming into contact with fluids or gases produced from wells.
Methanol-based organic blends containing corrosion and scale inhibitors are sometimes delivered to production fluids or gases through capillary strings and umbilical tubing to aid in reducing or preventing corrosion of or formation of scale upon carbon steel surfaces in the well that come into contact with the production fluid or gas. However, the use of such methanol-based organic blends, because of the presence of chlorides, have been shown to generate pitting corrosion of (i.e. localized corrosion) and to reduce the repassivation ability of the stainless steel (e.g. 316L) and corrosion resistant alloy (e.g. Duplex 2205) capillary strings and umbilical tubing that are being used to deliver chemicals into the production well.
It would be advantageous to develop an organic chemical blend additive that would help to inhibit this localized corrosion of the stainless steel or corrosion resistant alloy made capillary string and umbilical tubing while still being useful to inhibit corrosion of and reduce scale formation upon other metal surfaces in a production well.

Organic blend additive useful for inhibiting localized corrosion of equipment used in oil and gas production


This loop antenna is provided with: an insulating substrate; an antenna portion that is a conductor provided on the substrate and includes a first feeding portion, a second feeding portion, and an antenna mesh portion having a mesh structure and forming a loop shape by connecting the two feeding portions to each other; and a dummy pattern part portion that is a conductor having a mesh structure and provided in a region surrounded by the antenna portion, and is isolated from the antenna portion. The dummy pattern portion has at least one cut portion that cuts a path included in the mesh structure.

A loop antenna is an antenna including two power feeding portions and a loop-shaped conductor that connects the two power feeding portions to each other. The loop antenna may adopt a mesh structure for the loop-shaped conductor to form the conductor into a thin film shape, so that the conductor becomes inconspicuous.
A film-shaped loop antenna is sometimes placed on a front windshield of an automobile, or in a similar place. This is because it is desired from design and decorative appearance that the loop antenna be inconspicuous and not be visually recognized as an antenna in such cases.
In Patent Document 1, there is proposed a film antenna in which a conductive pattern 3A made from a mesh-shaped conductor and forming an antenna circuit is located on a surface of a resin film, and a pattern 3B having a color and a shape that are visually similar to those of the mesh-shaped conductor is formed in an area outside the conductive pattern 3A (see FIG. 25). Patent Document 1 describes that the pattern 3B formed in the area outside the conductive pattern 3A is electrically separated from the conductive pattern 3A, which forms the antenna circuit, as illustrated in FIG. 25.
According to Patent Document 1, it becomes hard to recognize the conductive pattern 3A by forming the conductive pattern 3A, which forms the antenna circuit, and the pattern in a margin of the antenna circuit into a mesh shape, with the result that cosmetic appeal is improved.

Japan Aviation Electronics Industry, Limited


A method of and an apparatus for determining real-time data latency are disclosed. The method may include creating a plurality of outgoing data packets having an outgoing time stamp and a group identifier. The outgoing data packets may be transmitted onto a network. A plurality of incoming data packets may be received over the network. For each of the incoming data packets, a round-trip time delay for the incoming data packet may be calculated. Statistics for the incoming data packets may be updated based on the round-trip time delay and the group identifier included in the incoming data packet. The method may be implemented on an apparatus.

1. Field of the Invention
This invention relates, in general, to data transmission, and more particularly, to methods of determine time delay for a round-trip transmission of data and apparatuses therefor.
2. Description of Related Art
A user accessing a computer server across a computer network must transmit data across the computer network from the user's computer to the computer server and must also receive data across the computer network from the computer server to the user's computer. Therefore, the user requires fast data transmission rates across the computer network and requires, in particular, fast round-trip data transmission across the computer network. However, as computer networks continuously grow in size and complexity, the data transmission rates associated with the larger and more complex computer networks may decrease. Accordingly, a need exists for a method of determining a time delay for the round-trip transmission of data and an apparatus therefor.
For simplicity and clarity of illustration, the same reference numerals in different figures denote the same elements, and descriptions and details of well-known features and techniques are omitted to avoid unnecessarily obscuring the invention.
Furthermore, the terms first, second, third, fourth, and the like in the description and in the claims, if any, are used for distinguishing between similar elements and not necessarily for describing a sequential or chronological order. However, it is understood that the embodiments of the invention described herein are capable of operation in other sequences than described or illustrated herein. It is further understood that the terms so used are interchangeable under appropriate circumstances.


The invention provides methods for cloning mammals that allow the donor chromosomes or donor cells to be reprogrammed prior to insertion into an enucleated oocyte. The invention also features methods of inserting chromosomes or nuclei into recipient cells.

In general, the invention features improved methods for cloning mammals and methods for inserting chromosomes, nuclei, or chromatin masses into recipient cells.
The cloning of mammals allows the production of multiple mammals with an identical DNA content. The donor genetic material used to generate these mammals may be selected or engineered such that the cloned mammals have desirable properties, such as increased resistance to disease. Unfortunately, the efficiency of cloning mammals using donor somatic cells is generally low, resulting in only about 1–2% of nuclear transplant embryos developing to term (Polejaeva et al, Nature 407:86–90, 2000). A significant problem with cloning is the loss of mid to late term pregnancies and the low viability of the offspring. Thus, more efficient methods are needed for cloning mammals. These improved methods may reduce the cost and time required to generate multiple viable offspring.

Methods for cloning non-human mammals using reprogrammed donor chromatin or donor cells


Methods, systems, and apparatus, including computer programs encoded on computer storage media, for determining geographic locations. One of the methods includes obtaining a sequence of events, each of the events including geographical location information, from a first device to be located; determining, for each event and each of a plurality of geographical locations, a probability that the respective event was obtained from a second device given that the second device is located at the respective geographical location; determining a probability that the sequence of events was obtained from the second device, including using a model representing how sequences of events are generated by network devices; and determining for each of the plurality of geographical locations a probability that the first device is located at the respective geographical location using the probability that the sequence of events was obtained.

This specification relates to determining geographical locations of network devices. Network devices can be physically located at different geographical locations ("geo-locations") across the world.
Network devices can include routers, bridges, switches, and repeaters, as well as user devices which can be operated by a user. User devices, for example, personal computers and smart phones, that are coupled to a network, for example, the Internet, enable users of the devices to access resources stored on computers and storage devices that are also coupled to the network.

Determining geo-locations of users from user activities


In the preferred embodiments, a method to reduce gate leakage and dispersion of group III-nitride field effect devices covered with a thin in-situ SiN layer is provided. This can be obtained by introducing a second passivation layer on top of the in-situ SiN-layer, in combination with cleaning of the in-situ SiN before gate deposition and before deposition of the second passivation layer.

AlGaN/GaN transistors find their applications in high frequency, high power electronics. Due to their intrinsic properties, i.e. high mobility and high breakdown field, they are suited to serve as amplifiers and switches in telecom and power devices, respectively.
The dispersion, i.e. degradation of the output current under large signal operation at high frequency, is an important problem in AlGaN/GaN transistors. G. Meneghesso, et. al (in IEEE Transactions on Electron Devices, Vol. 51, No. 10, October 2004) report surface states as a cause of the dispersion effect. To avoid or minimize the effect of dispersion, Huili Xing et al. (in IEEE Electron Device Letters, Vol. 25, No. 4, April 2004) installed a field plate on top of the gate.
Another problem is the reverse leakage current of the gate Schottky contact (see Hashizume, T. et al. in Appl. Phys. Lett., vol. 84, pp. 4884-4886, 2004). Hyeongnam Kim et al. (in Appl. Phys. Lett. vol. 86, pp 143505, 2005) showed that a high leakage current leads to losses in the transistor and will influence the reliability.
In EP1612866 a method for manufacturing a group III-nitride field effect device is presented by covering the surface with a thin SiN layer in the same reactor prior to cooling down the structure. Also the corresponding device is presented.
Oxidation of Si3N4 has been reported by Raider, S. I. in J. Electrochem. Soc.: Solid State Science and Technology, April 1976. These oxide states can provide carriers and perform a surface leakage path.

Surface treatment and passivation of AlGaN/GaN HEMT

Katholieke Universiteit Leuven, K.U. Leuven R&D


A lead-free solder alloy having a relatively low melting temperature and suitable for use to solder electronic devices consists essentially of: from 7 to 10 wt % of Zn; at least one of from 0.01 to 1 wt % of Ni, from 0.1 to 3.5 wt % of Ag, and from 0.1 to 3 wt % of Cu; optionally at least one of from 0.2 to 6 wt % of Bi, from 0.5 to 3 wt % of In, and from 0.001 to 1 wt % of P; and a balance of Sn. Another such lead-free solder alloy consists essentially of: from 2 to 10 wt % of Zn; from 10 to 30 wt % of Bi; from 0.05 to 2 wt % of Ag; optionally from 0.001 to 1 wt % of P, and a balance of Sn. These solder alloys have a tensile strength of at least 5 kgf/mm2 and at least 10% elongation.

The present invention relates to solder alloys which are completely free from lead and yet suitable for use in soldering of electronic devices without producing thermal damage.
Sn-Pb alloys have been used in soldering since ancient times, and they are still most popular for soldering electronic devices to printed circuit boards or other substrates.
When they are to be discarded, electronic appliances including televisions, radios, audio or video recorders, computers, copying or printing machines, etc. may be disposed of in landfills, since they are composed of various materials such as synthetic resins used for housings and printed circuit boards, and metals used for wires and other electric connections, and frames, and are not suitable for disposal by incineration.
In recent years, the phenomenon of acid rain has become serious since the acidity of rain is increasing mainly due to discharge of sulfur oxide into the atmosphere by extensive use of fossil fuels such as gasolines and fuel (heavy) oils. Acid rain causes the solders used in discarded electronic appliances present in landfills to dissolve and penetrate into the ground. If such contaminated groundwater is ingested by a person for many years, the accumulation of lead in the person""s body may result in lead poisoning (plumbism). From this viewpoint, there is a need of a lead-free solder alloy in the electronics industry.
Conventional lead-free solder alloys are Sn-based alloys such as Sn-Ag and Sn-Sb alloys. In Sn-Ag alloys, an Sn-3.5Ag alloy is the eutectic composition with a melting temperature of 221xc2x0 C. Even if this composition having the lowest melting temperature among Sn-Ag alloys is used as a solder alloy, the soldering temperature will be as high as from 260xc2x0 C. to 280xc2x0 C., which may cause thermal damage to heat-sensitive electronic devices during soldering, thereby deteriorating their functions or rupturing the devices. Of Sn-Sb alloys, an Sn-5Sb alloy has the lowest melting temperature, but its melting temperature is as high as 235xc2x0 C. in the solidus line and 240xc2x0 C. in the liquidus line. Therefore, the soldering temperature is in the range of from 280xc2x0 C. to 300xc2x0 C., which is still higher than that of the Sn-3.5Ag alloy, and thermal damage to heat-sensitive electronic devices cannot be avoided.
In view of the relatively high melting temperatures of Sn-Ag and Sn-Sb alloys as solder alloys, many attempts to lower their melting temperatures have been proposed. See, for example, Japanese Patent Applications Laid-Open (JP A1) Nos. 6-15476(1994), 6-344180(1994), 7-1178(1995), 7-40079(1995), and 7-51883(1995).
The solder alloys disclosed in these Japanese patent applications contain Bi and/or In (indium) in a large proportion in order to lower the melting temperatures. Although Bi and In are both effective for decreasing the melting temperatures of Sn-Ag and Sn-Sb solder alloys, the addition of Bi and/or In in a large amount is accompanied by the following problems. Addition of Bi in a large proportion makes the solder alloys very hard and brittle. As a result, it is impossible or difficult to subject the solder alloys to plastic working into wire, or when they are used to solder electronic devices, the soldered joints may be readily detached when subjected to only a slight impact. Addition of indium in a large proportion to solder alloys is undesirable due to its very high cost.
In order to avoid thermal damage to electronic devices during soldering, the soldering temperature should be 250xc2x0 C. or lower, and in order to perform soldering at such a temperature, it is desirable that the liquidus temperature of the solder alloy be 210xc2x0 C. or lower and preferably 200xc2x0 C. or lower.
However, with the above-described approaches to lower the melting temperatures of Sn-Ag and Sn-Sb solder alloys by addition of Bi and/or In, it is difficult to decrease the liquidus temperature of the alloys to 200xc2x0 C. or lower unless Bi and/or In is added in a large amount. Furthermore, even though it is possible to provide a solder alloy having a liquidus temperature lowered to 200xc2x0 C. or lower by such a means, the solidus temperature thereof, at which solidification of the alloy is completed, may also be lowered even more, so that it takes a prolonged period of time to completely solidify the solder alloy in soldered joints formed by soldering. As a result, if the soldered joints is subjected to any vibration or impact before they are completely solidified, they may be cracked.
Another problem of conventional lead-free solder alloys is that those lead-free alloys having liquidus temperatures which are low enough to be close to their solidus temperatures do not have satisfactory mechanical properties such as tensile strength and elongation, thereby forming soldered joints which have poor bonding strength or which are liable to be detached upon impact.
It is an object of the present invention to provide lead-free solder alloys having a liquidus temperature which is below 210xc2x0 C. and preferably below 200xc2x0 C. and a solidus temperature or peak temperature, at which solidification of the alloy is completed or substantially completed, is relatively close to the liquidus temperature.
It is another object of the present invention to provide lead-free solder alloys which have good bonding strength when used for soldering.
A more specific object of the present invention is to provide a lead-free solder alloy having the following properties.
1) It can be used at a soldering temperature below 250xc2x0 C. and preferably from 230xc2x0 C. to 240xc2x0 C. so as to prevent thermal damage to heat-sensitive electronic devices during soldering.
2) It has quite good solderability.
3) It has a narrow (solidification) temperature range between the liquidus and solidus temperatures (or peak temperate at which solidification is substantially completed) such that the alloy is rapidly solidified after soldering in order to prevent the resulting soldered joints from being cracked when vibration or an impact is applied immediately after soldering, the temperature range being close to the eutectic temperature of Sn-Pb alloy.
4) It produces soldered joints having a bonding strength which is high enough to prevent the joints from being detached upon application of an impact.
5) It can be easily subjected to plastic working into wire such that it can be used for soldering with a solder iron.
An Sn-based alloy having a eutectic temperature close to that of an Sn-Pb eutectic alloy (183xc2x0 C.) is an Sn-9Zn alloy (eutectic temperature: 199xc2x0 C.). However, the mechanical strength, particularly the tensile strength of the Sn-9Zn alloy is not so high that it cannot form soldered joints having good bonding strength. We have found that addition of Ni, Ag, and/or Cu is quite effective in order to improve the tensile strength and hence bonding strength of Sn-Zn alloys to such a degree that they can be adequately used to solder electronic devices.
The melting temperatures of the resulting alloys having improved tensile strength may be increased to such a degree that electronic devices may be thermally damaged during soldering, particularly when Ag is added. In such cases, addition of Bi in a relatively large amount along with Ag results in improvement in the tensile strength of Sn-Zn alloys without a significant increase in the melting temperatures.
The present invention provides a lead-free solder alloy consisting essentially of:
(1) A lead-free solder alloy consisting essentially of:
from 7 to 10 wt % of Zn,
at least one of from 0.01 to 1 wt % of Ni, from 0.1 to 3.5 wt % of Ag, and from 0.1 to 3 wt % of Cu,
from 0 to 6 wt % of Bi,
from 0 to 3 wt % of In,
from 0 to 1 wt % of P, and
a balance of Sn.
(2) The lead-free solder alloy of (1) which contains at least one of from 0.2 to 6 wt % of Bi and from 0.5 to 3 wt % of In.
(3) A lead-free solder alloy of (1) which consists essentially of:
from 7 to 10 wt % of Zn,
at least one of from 0.1 to 3.5 wt % of Ag, and from 0.1 to 3 wt % of Cu,
from 0 to 6 wt % of Bi,
from 0 to 3 wt % of In,
from 0 to 1 wt % of P, and
a balance of Sn.
(4) The lead-free solder alloy of (3) which contains at least one of from 0.2 to 6 wt % of Bi and from 0.5 to 3 wt % of In.
(5) The lead-free solder alloy of (1) which has a tensile strength of at least 5 kgf/mm2 and at least 10% elongation.
(6) The lead-free solder alloy of (1) which has a liquidus temperature of 210xc2x0 C. or lower and a solidus temperature of 180xc2x0 C. or higher.
(7) A lead-free solder alloy consisting essentially of:
from 2 to 10 wt % of Zn,
from 10 to 30 wt % of Bi,
from 0.05 to 2 wt % of Ag,
from 0 to 1 wt % of P, and
a balance of Sn.
(8) The lead-free solder alloy of (7) which has a tensile strength of at least 10 kgf/mm2 and at least 10% elongation.
(9) The lead-free solder alloy of (7) which has a liquidus temperature of 200xc2x0 C. or lower and a peak temperature of 170xc2x0 C. or higher.
(10) The lead-free solder alloy of one of from (1) to (9) which contains from 0.001 to 1 wt % of P.
(11) A lead-free solder alloy consisting essentially of:
from 2 to 10 wt % of Zn,
from 0.01 to 1 wt % of Ni,
from 0.2 to 30 wt % of Bi, and
a balance of Sn,
said solder alloy having a tensile strength of at least 5 kgf/mm2 and an elongation of at least 10%.
(12) A lead-free solder alloy consisting essentially of:
from 2 to 10 wt % of Zn,
from 0.1 to 3 wt % of Cu,
from 0.2 to 30 wt % of Bi, and
a balance of Sn,
said solder alloy having a tensile strength of at least 5 kgf/mm2 and an elongation of at least 10%.
(13) A lead-free solder alloy consisting essentially of:
from 2 to 10 wt % of Zn,
from 0.01 to 1 wt % of Ni,
from 0.1 to 3 wt % of Cu,
from 0.2 to 30 wt % of Bi, and
a balance of Sn,
said solder alloy having a tensile strength of at least 5 kgf/mm2 and an elongation of at least 10%.
(14) The lead-free solder alloy of one of from (11) to (13) which contains from 7 to 10 wt % of Zn.
(15) The lead-free solder alloy of (14) which contains from 0.001 to 1 wt % of P.

Matsushita Electric Industrial Co., Ltd.


Novel insulin precursors and insulin precursor analogs comprising a connecting peptide (mini C-peptide) of preferably up to 15 amino acid residues and comprising at least one Gly are provided. The precursors can be converted into human insulin or a human insulin analog. The precursors will typically have a distance between B27 (atom CG2) and A1 (atom CA) of less than 5 Å.

Yeast organisms produce a number of proteins that have a function outside the cell. Such proteins are referred to as secreted proteins. These secreted proteins are expressed initially inside the cell in a precursor or a pre-form containing a pre-peptide sequence ensuring effective direction (translocation) of the expressed product across the membrane of the endoplasmic reticulum (ER). The pre-peptide, normally named a signal peptide, is generally cleaved off from the desired product during translocation. Once entered in the secretory pathway, the protein is transported to the Golgi apparatus. From the Golgi, the protein can follow different routes that lead to compartments such as the cell vacuole or the cell membrane, or it can be routed out of the cell to be secreted to the external medium (Pfeffer et al. (1987) Ann. Rev. Biochem. 56:829-852).
Insulin is a polypeptide hormone secreted by β-cells of the pancreas and consists of two polypeptide chains, A and B, which are linked by two inter-chain disulphide bridges. Furthermore, the A-chain features one intra-chain disulphide bridge.
The hormone is synthesized as a single-chain precursor proinsulin (preproinsulin) consisting of a prepeptide of 24 amino acid followed by proinsulin containing 86 amino acids, in the configuration: prepeptide -B-Arg Arg-C-Lys Arg-A, in which C is a connecting peptide of 31 amino acids. Arg-Arg and Lys-Arg are cleavage sites for cleavage of the connecting peptide from the A and B chains.
Three major methods have been used for the production of human insulin in microorganisms. Two involve Escherichia coli, with either the expression of a large fusion protein in the cytoplasm (Frank et al. (1981) in Peptides: Proceedings of the 7th American Peptide Chemistry Symposium (Rich & Gross, eds.), Pierce Chemical Co., Rockford, Ill. pp 729-739), or use a signal peptide to enable secretion into the periplasmic space (Chan et al. (1981) PNAS 78:5401-5404). A third method utilizes Saccharomyces cerevisiae to secrete an insulin precursor into the medium (Thim et al. (1986) PNAS 83:6766-6770). The prior art discloses a limited number of insulin precursors which are expressed in either E. coli or Saccharomyces cerevisiae, vide U.S. Pat. No. 5,962,267, WO 95/16708, EP 0055945, EP 0163529, EP 0347845 and EP 0741188.

Method for making insulin precursors and insulin precursor analogues having improved fermentation yield in yeast


In one embodiment, a pad is formed on a substrate surface. The pad is connected with a connecting pattern. A first mask is formed on the substrate. The first mask has a first opening exposing at least a portion of the pad and a portion of the connecting pattern. A second mask is formed on the first mask. The second mask has a second opening exposing at least a portion of the pad and a portion of the connecting pattern. A boundary surface or sidewall of the first opening is not coplanar with a boundary surface or sidewall of the second opening. Therefore, stresses may be prevented from concentrating on the boundary surface of the first opening, thereby allowing dispersion of the stresses and restraining pattern cracks.

1. Field of the Invention
The present invention relates to a wiring substrate for a ball grid array (BGA) package and a method for manufacturing such a wiring substrate and in particular, to a wiring substrate having a non-solder mask defined (NSMD) type solder ball pad for a BGA package and a method for manufacturing such a wiring substrate.
2. Description of the Related Art
The electronic industry desires to manufacture products with light weight, small size, high speed, multi-function, high performance and high reliability at competitive prices. The package assembly technique achieves this goal. With the package assembly technique, a ball grid array (BGA) package has been developed. The BGA package has advantages to a conventional plastic package, for example reduced mounting area and improved electrical characteristics.
The BGA package uses a wiring substrate, such as a printed circuit board (PCB), instead of the lead frame used by the conventional plastic package. The wiring substrate provides an entire surface for forming solder balls, allowing improved mounting density on a motherboard.
Referring to FIGS. 1 through 4, a wiring substrate 10 for a BGA package has wiring patterns 30. The wiring patterns 30 include solder ball pads 32 for forming solder balls 50 as external connection terminals. The wiring patterns 30 formed on the lower surface of the wiring substrate 10 are electrically connected to the wiring patterns (not shown) formed on the upper surface of the wiring substrate 10 through via holes 38. The solder ball pads 32 may be non-solder mask defined (NSMD) type solder ball pads. The solder ball pad 32 and a portion of the connecting pattern 34 connected to the solder ball pad 32 are exposed through an opening 43 of a solder mask 40. Reference numeral 24 is an exposed portion of a substrate body 20.
The wiring pattern 30 is formed on the lower surface of the substrate body 20 and may comprise a copper wiring layer. The solder ball pad 32 and a portion of the connecting pattern 34 are exposed through the opening 43 of the solder mask 40 and may be liable to oxidation. After formation of the opening 43, a plating layer 36 is formed to protect the exposed portion of solder ball pad 32 and connecting pattern 34. The plating layer 36 may also establish a reliable connection with the solder ball 50. The plating layer 36 may typically comprise a nickel plating layer 35 and a gold plating layer 37. Before formation of the plating layer 36, an acid cleaning process may be performed for removal of an oxidation film formed on surfaces of the solder ball pad 32 and the connecting pattern 34.
The conventional NSMD type substrate 10 has defects. For example, pattern cracks may occur during a reliability test, such as a thermal cycling test following the manufacture of the BGA package. The pattern crack relates to where a portion of connecting pattern 34 adjacent to a boundary surface 43a is cut off from the boundary surface. The pattern cracks may result from stresses concentrated on the boundary surface 43a located between the opening 43 and the connecting pattern 34, due to the difference of coefficients of thermal expansion (CTE) between the solder mask 40 and the copper wiring layer materials being great. The CTE of a typical solder mask 40 is 60×10−6/C. ° or 160×10−6/C. ° depending on the material, while that of a typical substrate body 20 is 16×10−6/C. ° and typically a copper wiring layer has a CTE of 16×10−6/C. °.
Further, the exposed solder ball pad 32 and connecting pattern 34 may be etched during the acid cleaning process. The exposed connecting pattern 34 may thereby be thinner than the connecting pattern 34 covered by the solder mask 40. The difference of thickness may generate a step 33 at the boundary surface 43a.
As described above, the plating layer 36 is formed on the copper wiring layer including the solder ball pad 32 and the connecting pattern 34. The boundary surface 43a may form a boundary between a copper/nickel/gold structure and a copper/solder mask structure.
Accordingly, stresses may concentrate on the boundary surface 43a during thermal cycling. The pattern cracks may occur at the connecting pattern 34 located adjacent to a relatively weak portion, i.e. the boundary surface 43a.

Non-solder mask defined (NSMD) type wiring substrate for ball grid array (BGA) package and method for manufacturing such a wiring substrate


A memory device including an array of resistive memory cells, which are arranged in columns and rows, and wherein each resistive memory cell each is connected to a word line, to a bit line, and to a reference electrode. The word lines are assigned to the rows and the bit lines are assigned to the columns. The resistive state of the resistive memory cells corresponds to a logical state thereof, and the memory device further comprises an evaluation device, which is coupled to the bit lines, for evaluating the resistive state of at least one of the resistive memory cells during a reading operation. The respective resistive memory cell is selected by addressing the word line to which the resistive memory cell is connected.

Conventional electronic data memories, such as DRAM or Flash-RAM, are facing certain limitations as demands to modern data memories are steadily increasing. Above all, modern data memories must meet the requirement to combine a high density of information, fast memory access speed, and non-volatility. The latter non-volatility is increasingly important, since the memory content must be reliably maintained without supplying energy in—for example—mobile applications.
Present electronic data memory concepts, such as the DRAM or the Flash-RAM, store the data in information units based on charged or uncharged capacitors. In the case of a DRAM, these capacitors must be refreshed continuously, as they are kept small in order to achieve a high density of information. Therefore, a separate electronic circuitry for constant reading and rewriting of the information content is necessary.
Increasing the capacitors' size, as in a Flash-RAM, allows for the storage of information for a longer time span. The increased size of the data storage units however, then substantially limits integration and access speed. Additionally, higher operating voltages are required in a Flash-RAM, which further impose restrictions on integration and access speed.
In order to combine non-volatility with fast access and high integration, alternatives to the DRAM and the Flash-RAM are subject to intense scientific and industrial research. Amongst others, the so-called resistive data storage media are most promising candidates for such a replacement and an enhancement of current technologies.
Resistive data memories take advantage of various physical effects to cause a distinguishable and stable change of the electric resistance of special material systems. These systems include, for example, perovskite materials, phase change materials, and the so-called solid electrolytes. Memory cells employing solid electrolytes are also known as programmable metallization cells (PMC) or conductive brigding cells wherein an entire memory is referred to as CB-RAM. In a solid electrolyte a stable conductive bridging is formed by paths of metal ions being mobile in the solid electrolyte. These paths can be generated and decomposed by means of an electric field.
Similar to a classical DRAM device, a memory device employing a resistive memory medium will comprise memory cells, which are arranged in an array of rows and columns. In this way billions of memory cells are integrated on a single chip. Since a large array of memory cells results in thousands of word and bit lines, it is furthermore desirable to pool a set of bit lines in order to simplify the external electronic circuitry. This pooling is usually carried out by means of a multiplexing unit, which connects one bit line out of a set of bit lines to an evaluation unit, while disconnecting the remaining bit lines.
Although the integration of a multiplexing unit greatly simplifies the handling of large numbers of bit lines, only one bit line out of a set of bit lines is connected to an output port at a time. The remaining bit lines are disconnected from all external circuitry and hence may electrically float. This usually results in an undesired charging of the respective bit lines, which is mainly due to capacitive coupling between neighbouring bit lines and leakage currents.
When a floating bit line is to be evaluated it must be first discharged and brought to a respective potential. Since the measured potential of a bit line eventually determines the logical state of the memory cell during a reading operation, compensation for parasitic charging effects of the bit lines must be suppressed. One method for eliminating these undesired charging effects is to connect a bit line to the evaluation unit by a multiplexing unit and to wait until all parasitic charge on the bit line has levelled trough the low impedance of the evaluation unit. This method requires additional time for every reading operation and hence strongly limits access speed and performance of the memory device.

Memory device having an array of resistive memory cells


A shaft 6 includes full length layers provided wholly in a longitudinal direction of the shaft, and a tip end partial layer provided on a tip part of the shaft. The full length layers include a bias layer and a straight layer. The tip end partial layer includes an inner glass fiber reinforced layer. When a full length of the shaft is defined as Ls, and a distance between a tip end of the shaft and a center of gravity G of the shaft is defined as Lg, a ratio (Lg/Ls) is equal to or greater than 0.52 and equal to or less than 0.65. A weight of the shaft is equal to or less than 65 g. Preferably, the inner glass fiber reinforced layer is positioned inside the bias layer.

Field of the Invention
The present invention relates to a golf club shaft.
Description of the Related Art
A so-called carbon shaft has been known as a golf club shaft. A sheet winding process has been known as a method for manufacturing the carbon shaft. In the sheet winding process, a laminated constitution is obtained by winding a prepreg around a mandrel.
The prepreg includes a resin and a fiber. Many types of prepregs exist. A plurality of prepregs having different resin contents have been known. In the present application, the prepreg is also referred to as a prepreg sheet or a sheet.
In the sheet winding process, the type of a sheet, the disposal of the sheet, and the orientation of a fiber can be selected.
A shaft having a reinforced layer disposed on a thin diameter side portion is disclosed in Japanese Patent No. 3317619. The elastic modulus of a carbon fiber contained in the reinforced layer is 5 to 150 GPa.
A shaft including a middle elastic high strength carbon fiber reinforced resin sheet and a low elastic carbon fiber reinforced resin sheet to reinforce the TIP side of the shaft is disclosed in Japanese Patent Application Laid-Open No. 2004-81230(US 2004/0038744). The reinforcing fiber of the low elastic carbon fiber reinforced resin sheet has a tensile elastic modulus of 5 to 10 ton/mm2 and a compressive fracture strain of equal to or greater than 2.0%. The low elastic carbon fiber reinforced resin sheet is disposed on the outer layer side of the middle elastic high strength carbon fiber reinforced resin sheet.
In Japanese Patent No. 4157357, a composite prepreg having a PAN based carbon fiber and a pitch based low elastic fiber is used. In the composite prepreg, the elastic modulus of the PAN based carbon fiber is 200 GPa or greater and 500 GPa or less, and the elastic modulus of the pitch based low elastic fiber is 45 GPa or greater and 160 GPa or less.
Japanese Patent Application Laid-Open No. 10-329247 discloses a tubular body including an inner layer and an outer layer laminated outside the inner layer. The inner layer includes a reinforcing fiber and a resin. The outer layer includes a glass fiber and a resin. The ratio of the thickness of the outer layer to the total thickness of the tubular body is 5 to 35%.
Japanese Patent Application Laid-Open No. 2002-35186 discloses a golf club having a head weight of equal to or greater than 175 g and a club length of equal to or greater than 46 inch. If the total mass of a portion excluding a head is defined as A and the mass of a butt portion formed between a back end of a grip and a point separated by 170 mm from the back end is defined as B in the golf club, the ratio of the mass B to the total mass A is 55% or greater and 70% or less.