A planar array antenna having a switching matrix that couples an RF signal to two distributed ferrite scanning line feeds that feed a planar continuous transverse stub array antenna. The scanning line feeds couple RF energy to the antenna from opposite sides to form a total of four beams offset in space that each cover different angular scan sectors. The antenna has reduced complexity and lower design and production costs. The use of dual ferrite scanning line feeds, the switching matrix, and the continuous transverse stub antenna to obtain wide-angle scanning provides significantly improved performance. The present invention uses the two distributed ferrite scanning line feeds to obtain greater scan coverage at upper millimeter-wave frequencies, where realizable ferrite materials are less active and provide diminished scan capability. The scanning line feeds and planar array antenna may be designed so that the four scan sectors are contiguous, to increase the angular scan coverage of the antenna. The switching matrix is used to sequentially feed each of four RF ports, which effectively produces a single beam that scans over the four contiguous scan sectors.

The present invention relates generally to microwave antennas, and more particularly, to a microwave antenna having wide angle scanning capability.
Prior art teaches how a scanning line feed can be fed from its opposite ends to form two beams that are offset in space. Such scanning line feeds are described in articles by Nester, et al. entitled "Bidirectional Series Fed Slot Array", Symp. Digest, IEEE Antennas and Propagation Society International Symposium (Stanford, Calif.), June 1977, pg. 76, or Kinsey entitled "FAST Multibeam Antenna Concept", RADC-TR-85-170, Proc. Phased Arrays 1985 Symposium (Hanscom AFB, Mass.), September 1985, pp. 33-56.
There is increasing interest in low-cost, one-dimensional electronically scanned antennas for military and commercial applications, such as W-band targeting radars and forward looking radar automotive systems at 77 GHz, for example. Low-cost two-dimensional scanning can be realized by using the aforementioned one-dimensional electronic scan antenna in conjunction with a 360.degree. gimbal in the second axis. Conventional scanning techniques, such as PIN diodes, discrete ferrite phase shifters or transmit/receive (T/R) modules are generally either not available, not producible, or are relatively unaffordable at W-band.
Ferrite phase scanning antennas that radiate into free space are described in the technical literature. Ferrite phase scanning antennas are discussed in articles by Stern, et al. entitled "A mm-Wave Homogeneous Ferrite Phase Scan Antenna," Microwave Journal, Vol. 30, No. 4, April 1987, pp. 101-108, and U.S. Pat. No. 4,691,208 entitled "Ferrite Waveguide Scanning Antenna", for example.
A ferrite scanning line feed is a device that is similar to the previously discussed scanning line feed, and has the same limitations in scan range. The distinction is that the line feed is specifically designed to radiate into a parallel-plate region of a planar array antenna, which may be either air or dielectrically filled. Further, the scanning line feed is designed using bidirectional array excitation synthesis to be fed from either end, producing two well-formed beams offset in space.
A major disadvantage of the prior art is the limited scan coverage that can be realized with ferrite phase scanned antennas at high millimeter-wave frequencies, typically on the order of from 40 GHz and above. It would therefore be an advance in the art to have a planar array antenna that does not require a multitude of line feeds that are scanned with discrete phase shifters, such as those described in the Kinsey article, for example. It would also be an advantage to have a planar array antenna that has reduced complexity with much lower design and production costs. Accordingly, it is an objective of the present invention to provide for a microwave antenna having wide angle scanning capability.

Microwave antenna having wide angle scanning capability


A method for determining a sub-beam add signal (SBAD) value is provided. At first, a jth read SBAD value is obtained at the jth read status. Next, the jth write SBAD value is determined according to the (j−1)th write SBAD gain at the jth write status. Then, the jth SBAD multiple is obtained according to the jth write SBAD value and the jth read SBAD value. Next, the (j−1)th write SBAD gain is changed into the jth write SBAD gain according to the jth SBAD multiple. At last, the level of the (j+1)th write SBAD value is adjusted according to the jth write SBAD gain at the (j+1)th write status.

1. Field of the Invention
The invention relates in general to a method for generating a sub-beam add signal (SBAD) value, and more particularly to a method for reducing the difference between the read SBAD value and the write SBAD value.
2. Description of the Related Art
Living in modern times when science and technology advance rapidly and the applications of pictures, music, movies and computer software are gaining a greater popularity, high capacity disc such as CD, CD-R, CD-RW, DVD, DVD-R and DVD-RW have become an important software carriage to modern people in their everyday lives. Besides, the optical disc drives for reading/writing the optical disc are therefore become an essential peripheral of a personal computer.
As shown in FIG. 1A, a partial diagram showing the status after a conventional disc is formatted is shown. In the conventional method of formatting a disc 70, the optical disc drive would format the optical disc 70 as a lead-in region 71, a data packet write area 72 and a lead-out region 73, wherein the data packet write area 72 has a plurality of tracks for storing data with each and every of the tracks has a plurality of blocks disposed thereon. However, when parts of the tracks on the data packet write area 72 have defects such as scratches or fingerprints, the optical disc drive is unable to detect any defects on the optical disc 70 according to the above formatting method. It is very likely that the optical disc drive would have data written on defective blocks, causing incomplete data writing and largely affecting the quality of data writing.
To avoid the data being written on defective tracks, a "Mount Rainier" disc formatting method is provided. When the optical disc drive formats a disc according to the Mount Rainier method, the optical disc drive would first of all detect whether any defects exist on the optical disc. During the detecting process, the optical pick-up head of the optical disc drive would emit a Laser light having three or five beams onto the optical disc. Take the five-beam Laser light for example, the five beams comprise a main-beam and four sub-beams, wherein two sub-beams and another two sub-beams are symmetrically positioned at the two sides of the main-beam. The five beams are emitted onto the optical disc and form a corresponding main-spot and four corresponding sub-spots thereon. The optical pick-up head receives and senses the reflected beams of the four sub-beams reflected from the optical disc to generate a corresponding sub-beam add signal (SBAD).
As shown in FIGS. 1B-1C, the optical disc drive has a defect threshold range, whose range is −200 mV˜400 mV for instance, and whether the spot at which the Laser light is emitted has defects or not is determined according to the comparison between the defect threshold range and the wave pattern of the SBAD. When the optical disc has defects such as scratches or fingerprints, the optical disc drive would generate a downward-projected SBAD 75 or an upward-projected SBAD 76, wherein each and every spot of the downward-projected SBAD 75 or the upward-projected SBAD 76 corresponds to an SBAD value. In FIG. 1B, the downward-projected SBAD 75 has a lowest point A, corresponding to a minimum SBAD value, wherein the minimum SBAD value is smaller than −200 mV. In FIG. 1C, the upward-projected SBAD 76 has a highest point B, corresponding to a maximum SBAD value, wherein the maximum SBAD value is larger than the 400 mV. Therefore, the optical disc drive would determine whether the SBAD value falls within the defect threshold range so as to conclude whether the spot at which the Laser light is emitted has defects or not. The block with a defect is regarded as a bad block.
As shown in FIG. 1D, after the optical disc drive complete defect detection of the optical disc 80, the optical disc drive would format the optical disc 80 as a lead-in region 81, a data packet write area 82, a data replacement area 83 and a lead-out region 84. The optical disc drive creates a main defect table 85 in the lead-in region 81, and further backups the main defect table 85 in the lead-out region 84 to record the address or the time domain of a bad block 86 on the optical disc 80. Unlike the conventional method which would have data written onto a bad block 86 with defects disposed thereon, the optical disc drive would not do the same. According to the main defect table 85, the optical disc drive would have data written onto the data replacement area 83 and records the data's writing position on the data replacement area 83. Consequently, the completeness and reliability of data can be maintained.
During the process of having data written onto the optical disc according to the Mount Rainier method, the optical disc drive adopts a sequential write method and divides the data into N data packets. The optical disc drive has the N data packets written onto the optical disc during the N read status and N write status with every read status followed by a write status. During the N read status, the optical disc drive uses a read laser power to read the optical disc, uses a stand-by status to perform focusing servo control and holding servo, and then waits for next data writing. During the N write status, the optical disc drive uses a write laser power to have the N data packets written onto the optical disc. After reading the optical disc at the ith read status, the optical disc drive is immediately switched to the ith write status from the ith read status and has the ith data packet written onto the optical disc, wherein i ranges from 1 to N. Such write method is also called "packet write method". Besides, when the optical disc drive is respectively at the read status and the write status, the optical pick-up head still receives the reflected beams of the four sub-beams reflected from the optical disc to generate a corresponding read SBAD signal and a corresponding write SBAD value.
As shown in FIG. 1E, when switched from a read status to a subsequent write status, the optical disc drive would vibrate under high speed rotation because the writing power of the laser light is higher than the reading power of the laser light, causing the SBAD level to upsurge at least 400 mV, resulting in a write SBAD value higher than the read SBAD value. For example, the write SBAD value and the read SBAD are respectively equal to 2.2 V and 1.7 V. When the optical disc drive compares the write SBAD value with the defect threshold range, the write SBAD value would fall outside the range of the defect threshold range, causing the optical disc drive to mis-determine that defects exist on the optical disc and result in an erroneous detection of defects. Therefore, the optical disc drive would have each and every of the data packets written onto data replacement area of the optical disc. Due to a small capacity, the data replacement area will soon be full loaded, causing write failure to occur.

Method for determining sub-beam add signal (SBAD) value


A power supply system for driving reactor coolant recirculation pumps within an advanced boiling water reactor is configured in such a manner that: at least one normal-operation busbar branches off from either a main on-site power line or from a power line for auxiliary power generation that branches off from the main on-site power line, with a house transformer therebetween; at least one MG set is connected to one of these normal-operation busbars; one static adjustable-frequency power supply device is connected to each MG set; and a plurality of recirculation pumps is connected to each static adjustable-frequency power supply device.

1. Field of the Invention
The present invention relates to a power supply system for driving reactor coolant recirculation pumps in an advanced boiling water nuclear reactor and, in particular, to a power supply system for driving reactor coolant recirculation pumps which has a simple configuration and which is capable of keeping the plant functioning with a high degree of reliability if components thereof should fail.
2. Description of Related Art
In the power-generating plant of an advanced boiling water reactor (hereinafter abbreviated to ABWR), the coolant of the reactor is circulated by a number of reactor coolant recirculation pumps, such as ten pumps (where each is an reactor internal pump, hereinafter abbreviated to RIP). These RIPs use an internal recirculation method to circulate the coolant directly within the reactor of the ABWR.
The amount of coolant circulated by these RIPs is related to the reactivity of the core of the reactor, so this fact can be used to control the amount of coolant that is circulated by the RIPs and thus control the output of the reactor. Any halting of the RIPs by unforeseen causes has an effect on the health of the reactor (coolant) recirculation system (hereinafter abbreviated to RRS), and it could also stop the entire generating plant. Thus the power supply system for driving the RIPs must have a configuration such that the flow rate in the RIPs can be controlled and also the plant can be kept functioning with a high degree of reliability if components of the power system should fail.
The configuration of a prior-art power supply system for driving the reactor coolant recirculation pumps of an advanced boiling water nuclear generating plant is shown in FIG. 35. In this power supply system, an RRS has ten recirculation pumps RIP and each recirculation pump RIP has a static adjustable-frequency power supply device (an adjustable-speed drive, hereinafter abbreviated to ASD). Each static adjustable-frequency power supply device ASD causes changes in the power frequency to control the speed of the corresponding RIP, thus adjusting the flow rate through the core to implement output control of the reactor. An inverter method is generally used for this.
In this prior-art power supply system for driving reactor coolant recirculation pumps, the ten recirculation pumps RIP are divided into two groups of five pumps connected to two normal-operation busbars A and B. The normal-operation busbars A and B are designed to supply power to auxiliary devices of the generating plant, such as the recirculation pumps RIP, and each is connected to a main on-site power line 2 by a house transformer HT. These normal-operation busbars A and B are provided as metal-enclosed switchgear (M/C), and each is designed so that the cables of auxiliary generating equipment such as the recirculation pumps, reactor water feed pumps, etc. can be connected thereto.
With each of the normal-operation busbars A and B, two of the static adjustable-frequency power supply devices ASD are connected directly to the busbar and three of the static adjustable-frequency power supply devices ASD are each connected thereto by an MG set 3, which is usually configured of an electric motor M and a generator G with a flywheel FW attached. Such an MG set 3 causes the generator G with attached flywheel FW to rotate by driving the electric motor M, enabling electrical power to be supplied to the corresponding recirculation pumps RIP.
The main on-site power line 2 is supplied with electrical power by a main generator SG that is rotated by steam from the reactor to generate electricity. The power supplied to the main on-site power line 2 is supplied to the recirculation pumps RIP through the house transformers HT on the one hand, and it is also transmitted to external transmission cables through a transmission transformer MT.
With this prior-art power supply system for driving reactor coolant recirculation pumps in an advanced boiling water nuclear generating plant, the power generated by the main generator SG is supplied to the static adjustable-frequency power supply devices ASD through the house transformers HT, normal-operation busbars A and B, and MG sets 3, etc., and the frequencies of voltages flowing thereto can be controlled by the static adjustable-frequency power supply devices ASD to control the rotational speeds of the corresponding RIPs. This adjusts the flow rate of coolant passing through the core, enabling control over the output of the reactor.
This configuration also makes it possible to prevent three or more recirculation pumps RIP from stopping simultaneously, even if a single failure occurs in one of the MG sets 3 or static adjustable-frequency power supply devices ASD that configure the power supply system for driving reactor coolant recirculation pumps.
However, with this prior-art power supply system for driving reactor coolant recirculation pumps, one static adjustable-frequency power supply device ASD is provided for driving each of the recirculation pumps RIP. Thus the installation configuration is complicated and also expensive. With a prior-art system of this configuration, a failure caused by the stopping of a recirculation pump RIP by the failure of one static adjustable-frequency power supply device ASD goes no further than that one unit and so has little effect, but, on the other hand, there is a large number of static adjustable-frequency power supply devices ASD. For that reason, there has long been a requirement in the art to provide the power supply system for driving reactor coolant recirculation pumps with an installation configuration that is as simple as possible.
Furthermore, if one MG set should fail in the above-described prior-art power supply system for driving reactor coolant recirculation pumps, three recirculation pumps RIP are halted. However, if three or more RIPs are halted simultaneously, it is difficult to absolutely guarantee the flow rate of coolant through the core of the ABWR, which could lead to a drop in the rated output of the nuclear generating plant.
Thus there is a requirement in the art, particularly in the development of the next generation of boiling water reactors, to provide a configuration that ensures that simultaneous failures of RIPs are restricted to no more than two RIPs, a 100% flow rate is guaranteed without any problems in the core even when two RIPs have halted (with at least eight RIPs still operating), and thus the rated output of the nuclear generating plant can be maintained.
An objective of this invention is therefore to provide a power supply system for driving reactor coolant recirculation pumps that has a simple configuration with a reduced number of ASDs in the ABWR.
Another objective of this invention is to provide a power supply system for driving reactor coolant recirculation pumps in which there is an extremely low probability of any number of RIPs halting simultaneously, other than two RIPs, and which makes it possible to maintain the rated output of the plant if two RIPs should halt simultaneously.

Power supply system for driving reactor coolant recirculation pumps


Techniques are described herein that are capable of translating programming language patterns into database schema patterns. Examples of a programming language pattern include but are not limited to a source code pattern, an intermediate language code pattern, metadata associated with a source code pattern, metadata associated with an intermediate language code pattern, or any combination thereof. The programming language patterns may define objects that are included in an object model. Database schema patterns that define a database are automatically (e.g., inferentially) created based on respective programming language patterns that define objects of an object model. The programming language patterns are automatically mapped to the respective database schema patterns.

Creating an application in a general-purpose programming language that maps to a relational database for data storage traditionally involves substantial manual effort by a human developer. For example, conventional techniques for creating a database for use with regard to an application typically involve the human developer explicitly setting up the database and manually ensuring mapping of the database with regard to the application and other configuration of the database. For instance, the human developer may explicitly draft code to map relational schema that is associated with the database to constructs of the programming language. Accordingly, these conventional techniques may place a substantial burden on the human developer to understand the mapping and configuration to be used for creating the database, to make appropriate choices with respect to creating the database, and/or to be capable of implementing the mapping and configuration so that the database functions as intended.

Translating programming language patterns into database schema patterns


An N-FET headswitch has improved performance (e.g., less leakage current, lower ON resistance, and smaller area) over a conventional P-FET headswitch. The N-FET headswitch includes at least one N-FET device and couples between a power supply and a load circuit, which may be, e.g., a microprocessor, a digital signal processor, or a memory unit. The headswitch couples the power supply to the load circuit when the headswitch is enabled and cuts off the power supply from the load circuit when disabled. A charge pump couples to the headswitch and provides a control signal. This control signal is sufficiently high when the headswitch is enabled to ensure that the N-FET device operates in a linear region and has a small drain to source voltage drop. The headswitch may be operated as a power switch or in a feedback configuration to implement a linear or a digital voltage regulator.

I. Field
The present invention relates generally to circuits, and more specifically to a power headswitch.
II. Background
Integrated circuit (IC) fabrication technology continually improves and, as a result, the size of transistors continues to shrink. This enables more transistors and more complicated circuits to be fabricated on an IC die or, alternatively, a smaller die to be used for a given circuit. Smaller transistor size also supports faster operating speed and provides other benefits.
For complementary metal oxide semiconductor (CMOS) technology, which is widely used for digital circuits and some analog circuits, a major issue with shrinking transistor size is standby power. A smaller transistor geometry results in higher electric field (E-field), which stresses a transistor and causes oxide breakdown. To decrease the E-field, a lower power supply voltage is often used for smaller geometry transistors. Unfortunately, the lower power supply voltage also increases the delay of the transistors, which is undesirable for high-speed circuits. To improve the delay, the threshold voltage of the transistors is reduced. However, the lower threshold voltage and smaller transistor geometry result in higher leakage current (or standby current), which is the current passing through a transistor when it is turned off.
Leakage current becomes more problematic as CMOS technology scales smaller. It can be shown that leakage current increases at a high rate with respect to the decrease in transistor size. To illustrate the point, a microprocessor implemented in 0.13 μm (micrometer) CMOS technology may dissipate tens of micro-amps to one milli-amp in standby current when it is powered down. In contrast, it has been estimated that with current technology trends the same microprocessor implemented in 30 nm (nanometer) CMOS technology may dissipate as much as one Ampere of standby current when powered down, which is a thousand or more times greater than the standby current for 0.13 μm CMOS technology. (0.13 μm and 30 nm refer to the "feature" or device length, which is the effective length of a transistor implemented by the CMOS technology.) Leakage current consumes power and reduces standby time for a portable device (e.g., a cellular phone) that uses battery power.
One method of combating high leakage current and reducing standby power consumption in large digital VLSI (very large scale integration) designs is to cut off the power supply to a digital circuit when it is turned off. The power supply may be cut off with either a headswitch or a footswitch. A headswitch is a switch placed between the power supply and the digital circuit. A footswitch is a switch placed between the digital circuit and circuit ground.
A headswitch is conventionally implemented with a P-channel field effect transistor (P-FET) device, which is also referred to as a P-channel transistor. The P-FET device is designed with a sufficiently large size (i.e., the width of the device is sufficiently wide) so that the ON resistance is small and the voltage drop across the device is reduced when the device is turned on. This ensures that power dissipation by the P-FET device is within a desired limit when the device is turned on. However, the large P-FET device size also results in high leakage current when the device is turned off, which is undesirable. Moreover, other issues are encountered when the P-FET device is used as a headswitch, as described below.
There is therefore a need in the art for a headswitch with improved performance over the conventional P-FET headswitch.


A delay-locked loop 300 that includes: an adjustable frequency source (320) for generating a clock signal (322) having an adjustable frequency; an adjustment and tap selection controller (310) for determining a first frequency as a function of a second frequency and for causing the frequency source to adjust the frequency of the clock signal to substantially the first frequency, the second frequency being the desired frequency of a first output signal; a delay line (330) configured to receive the clock signal for generating a plurality of phase-shifted clock signals; and a first selection circuit (370) for receiving the plurality of phase-shifted clock signals and for selecting, one at a time and under the control of the adjustment and tap selection controller, a first sequence of the phase-shifted clock signals for generating the first output signal having substantially the second frequency.

A number of devices, for instance mobile applications such as portable devices, require the use of a frequency synthesizer for operation. One such frequency synthesizer includes a digital-to-phase converter having a digital delay-locked loop (DLL). FIG. 1 illustrates a schematic diagram of a prior art DLL 10 configuration for generating an output signal 72 at a desired frequency Fout. DLL 10 comprises a fixed frequency synthesizer 20 for generating a clock signal 22 having a frequency of Fclk. DLL 10 further comprises: a delay line 30 having N number of adjustable delay elements D1 through DN; a phase detector 40, a charge pump 50 and a loop filter 60, which make up a stabilization circuit for DLL 10; a selection circuit 70 that may be, for instance, a multiplexer (also referred to herein as a "MUX"); and a digital control device 90.
In operation, delay line 30 receives the clock signal 22 into an input and then generates a set of time delayed clock signals at a plurality of outputs. The time delays are generated by delay elements D1 through DN, which are connected in cascade and which may be, for instance, inverter gates, transmission line gates, and the like, depending upon a desired DLL implementation. Moreover, an overall time delay between a signal at first point on the delay line, which is typically an input of the first delay element D1, and a signal at a second point on the delay line, which is typically the output of the Nth delay element DN, is controlled by a bias voltage Vtune input into delay line 30. This overall delay may be, for instance, a wavelength (i.e., 360 degrees) which is 1 period of clock signal 22, a half wavelength (i.e., 180 degrees) which is ½ period of clock signal 22, or whatever delay is required for a particular application. Ideally, each delay element will replicate the input waveform, with a time delay, at the delay element output that is equal to the total delay from the input of delay element D1 through the output of delay element DN divided by the total number of delay elements (i.e., N).
Each delay element D1–DN has an output tap T1–TN, respectively, which is connected to an input of MUX 70. In addition, a tap T0 is connected between the input of the delay element D1 and an input of MUX 70 in order to supply the clock signal 22 thereto. Each delay element D1–DN delays the propagation of the clock signal 22 and outputs on its corresponding output tap T1–TN, respectively, a corresponding phase shifted clock signal. Accordingly, the number N of phase-shifted clock signals output by delay elements D1–DN are supplied via output taps T1–TN to the inputs of MUX 70 along with the clock signal 22 output on tap T0.
To ensure stability during operation, DLL 10 includes phase detector 40 that is typically connected to receive the clock signal 22 from synthesizer 20 and a phase shifted clock signal from delay line 30, which in this instance is the signal at the output of delay element DN. Phase detector 40 compares the phase difference between the clock signal 22 and the phase shifted clock signal to a predetermined desired phase shift and outputs to the charge pump an error signal that is a function of the result of this comparison. Those of ordinary skill in the art should realize that phase detector 40 could be configured for comparing the phase difference between the signals at any two points on the delay line to the predetermined desired phase shift and outputting the corresponding error signal.
The charge pump 50 deposits a corresponding charge on the loop filter 60, which in turn converts the error signal into a DLL tuning signal which is supplied to delay line 30 to adjust the bias voltage Vtune in a manner that maintains the phase relationship between the phase shifted clock signal and the clock signal 22 during operation of DLL 10, i.e., until the total delay through the delay line is the desired delay. Once DLL 10 has stabilized, MUX 70 operates in a conventional way under the control of digital control 90 to connect, one at a time, a sequence of phase-shifted clock signals at taps T0–TN to corresponding outputs of MUX 70 to provide an output signal at the desired output frequency Fout. The digital control device 90 is typically a tap selection controller that comprises two accumulators, one to determine when to connect a tap to an output terminal and another to determine which tap to connect. This tap selection sequence is typically based on Fout, Fclk and N.
There are a finite number of transitions that can be selected from the delay line 30 to create an output signal at a desired frequency. The possible error associated with the selection of a given tap to create the output signal causes a quantization effect which creates spurious signal outputs (spurious being undesired spectral components). The effect can be minimal if the selected frequency and the clock signal frequency happen to fall on certain values. However, in general the spurious free dynamic range will be limited by the quantization effect of the taps.
FIG. 2 illustrates the misalignment between the desired output signal transitions and those of the actual output signal 72 generated in DLL 10. This misalignment is caused by a round off error which results in spurious signals generated at the output 72 of MUX 70. Let us assume that delay line 30 includes four delay elements D1 through D4. FIG. 2, accordingly, illustrates clock signal 22 (i.e. waveform 210 having no time delay or a zero phase shift) and three corresponding time delayed or phase-shifted clock signals (i.e., waveforms 220, 230 and 240) output therefrom. Assuming a total delay from the input of D1 to the output of D4 is one wavelength, the waveform output from D4 would be equivalent to waveform 210. As FIG. 2 illustrates, each waveform ideally has the same frequency as the clock signal 22 (i.e., Fclk) but may have a different delay in time. Moreover, in this illustration from a time t0 to a time t4, twenty-two edge transition times or delay times (i.e., d0 through d21) are generated from which MUX 70 can select to generate the desired output waveform 260.
Given the number of taps, the frequency of the clock signal 22, and the desired output frequency, the potential delay times can be calculated by digital control device 90 and selected by MUX 70 to generate a corresponding output signal 250. This relationship may, for instance, be represented by the following equation:Fclk=(M*Fout)/N, for M≧N  (1)where Fclk is the frequency of the clock signal 22, Fout is the desired output frequency, N is the number of taps and M represents the delays that would be required to generate the desired output signal waveform 260. This relationship may, alternatively, be represented by the following equation:Tout=(M*Tclk)/N, for M≧N  (2)where M and N are the same as in equation (1), Tclk is the period of Fclk, Tout is the period of Fout and Tclk/N represents a delay caused by a single delay element. Ideally, to generate an output signal having no spurious signals, M would equal an integer number of delays (i.e., delays=Tclk/N). However, typically this is not the case. Generally, M is a non-integer multiple of delays and taps are then selected above and below the desired multiple of delays thereby generating a waveform 250 that has the desired output period on average.
Referring again to FIG. 2, assume that M=5.4, for example, for a given Tout, Tclk and N. In this case, the edge transition times for the desired output waveform 260 would be at 5.4 delays, 10.8 delays, 16.2 delays, 21.6 delays, etc. To generate the closest waveform 250 to the desired waveform 260, the desired delays would be rounded to the nearest integer multiple of delays, e.g., 5 delays (d5), 11 delays (d11), 16 delays (d16), 22 delays (d22), etc. This round-off error or quantization effect causes the spurious outputs. Thus, the farther the actual selected delay is from the desired delay (i.e., the larger the round-off error) the larger the corresponding spurious signal being generated at the output.
One way known in the art of improving the spurious performance or reducing the spurious level relative to the desired output signal is to increase the number of taps in the delay line 30. This would result in the actual selected delays being closer to the desired delays (i.e., smaller round-off errors) and resulting smaller spurious signals being generated at the output. However, a limitation of this solution is that each tap that is added degrades the noise performance of the DLL and increases the complexity of the tap selection circuitry 70. In addition, although theoretically an infinite number of taps may be added, practically the number of taps possible is limited as present day technologies will not support the complex level of circuitry needed if the number of taps increases beyond a certain point, e.g., where the tap selection network switching delay approaches a 10% fraction of Tclk.
Another method known in the art for improving the spurious performance is the use of dither. However, in general, while the use of dither reduces the spurious energy at specific frequencies, it also essentially spreads this energy over a broader bandwidth thereby creating a floor of quantization noise. Thus, to decrease the spurious signal, and accordingly this wide band noise, to an acceptable level in certain applications, an unrealizable number of taps in addition to the dither would be required.
Thus, there exists a need for a DLL configuration that minimizes the level of spurious signals without requiring more taps to be added to the DLL and that further does not require the use of dither with its associated wide band noise.


A power amplifier circuit includes an amplifier transistor having a base, a collector, a bias circuit, and a first resistance element connected between the base of the amplifier transistor and the bias circuit. The bias circuit includes a voltage generation circuit, a first transistor having a base to which a first direct-current voltage is supplied, and an emitter from which the bias current or voltage is supplied, a second transistor having a base to which a second direct-current voltage is supplied, and an emitter connected to the emitter of the first transistor, a signal supply circuit disposed between the base of the amplifier transistor and the base of the second transistor, and an impedance circuit disposed between the base of the first transistor and the base of the second transistor.

The present disclosure relates to a power amplifier circuit. A power amplifier circuit to be incorporated in a mobile communication device such as a cellular phone typically includes a bipolar transistor as an amplifier. Bipolar transistors have a thermal positive feedback characteristic in which as the temperature of the element increases, collector current increases, which further raises the temperature of the element, leading to a further increase in collector current. To suppress an increase in collector current caused by an increase in temperature, a configuration is available in which, for example, a resistance element (hereinafter also referred to as a ballast resistor) is connected between a base of a bipolar transistor and a base bias voltage supply terminal. In this configuration, a voltage drop across the ballast resistor suppresses an increase in base current, and, as a result, an increase in collector current is also suppressed.
In a configuration including a ballast resistor, when base current increases with an increase in the power level of an input signal, voltage drop increases across the ballast resistor, which causes a decrease in base voltage. As a result, power gain may decrease with the amplitude of the collector current, which is independent of the amplitude of the base current, and the linearity of the amplifier may deteriorate. To prevent the deterioration of the linearity, for example, Japanese Unexamined Patent Application Publication No. 2003-324325 discloses a power amplifier including a capacitance element between a signal input terminal and a base bias voltage supply terminal. With this configuration, power supplied from the signal input terminal can be transmitted to the base bias voltage supply terminal. Thus, a reduction in base voltage is suppressed, and linearity is improved.
In the configuration disclosed in Japanese Unexamined Patent Application Publication No. 2003-324325, the capacitance element connected between the signal input terminal and the base bias voltage supply terminal may be part of a matching circuit viewed from the signal input terminal. That is, the capacitance element may affect matching between the input impedance of an amplifier and the output impedance of a circuit preceding the amplifier.

This patent is subject to a terminal disclaimer.


This invention provides a structured luggage system that allows for maximum versatility in luggage piece dimensions and using two luggage pieces. Each of the two luggage pieces can be converted from a full-height luggage piece to an approximately half-height piece with relative ease. The lower or main piece includes conventional wheels and a retractable/extendible handle for easy transport. The upper or secondary piece is adapted to stack on and be secured to the extended handle and (in full-height configuration) offer a secondary grip for added stability adjacent to the handle grip. The lower piece includes an inner central septum that can be sealed or opened to selectively define either a two-compartment piece or large, single compartment piece. Each compartment includes easily removable stiffeners in corresponding side pockets. By removing the upper compartment stiffeners, the pocket can be collapsed into a thickened top that includes the septum as the thickened top's inside face. By also removing the bottom set of stiffeners, the bottom compartment can be collapsed, allowing the entire main/lower piece to be compressed for easy storage.

1. Field of the Invention
This invention relates to semi-rigid "structured" luggage and more particularly to integrated sets of luggage with collapsible features.
2. Background Information
Luggage is an essential part of business and pleasure travel. As the needs of travelers become more varied, it is highly desirable to provide luggage that can meet those varied demands. Sometimes a large set of luggage is needed, while other times, only a small bag is called for. Often a luggage piece must fill the dual roles of checked baggage and around-the-town tote. In homes and hotels storage is often at a premium. Providing a wide range of specialized luggage pieces to fill all the different luggage needs that may arise, may undesirable tax that storage space.
In addition, travelers now generally prefer wheeled luggage, providing a versatile luggage system that also allows for easy, wheeled motion is highly desirable.


A rotor assembly for an agricultural baler. The rotor assembly has a rotor shaft having a central portion and first and second end portions either side of the central portion. The rotor assembly further has a number of tine plates to be arranged axially along the rotor shaft, each of the tine plates having one or more tines. The tine plates are arranged such that there is an angular spacing between the tines of adjacent ones of the tine plates. A magnitude of the angular spacing is greater or smaller at the central portion than at the first and second end portions of the rotor shaft.

Agricultural balers are used to consolidate and package crop material so as to facilitate the storage and handling of the crop material for later use. For example, when the crop is hay a mower-conditioner is typically used to cut and condition the crop material for windrow drying in the sun. As another example, when the crop is straw an agricultural combine discharges non-grain crop material from the rear of the combine defining the straw which is to be picked up by the baler. The cut crop material is usually dried, and a baler, such as a large square baler or round baler, straddles the windrows and travels along the windrows to pick up the crop material and form it into bales.
On a large square baler, pickup apparatus at the front of the baler gathers the cut and windrowed crop material from the ground. The pickup apparatus includes a pickup roll, and optionally may include other components such as side shields, stub augers, a wind guard, etc. A rotor cutter apparatus is then used to move the crop material from the pickup apparatus to a pre-compression chamber or duct. The rotor cutter apparatus forms a so-called 'wad' of crop within the pre-compression chamber which is then transferred to a main bale chamber.
Stuffer apparatus transfers the wad of crop material in charges from the pre-compression chamber to the main bale chamber. Typically, the stuffer apparatus includes stuffer forks which are used to move the wad of crop material from the pre-compression chamber to the main bale chamber, in sequence with the reciprocating action of a plunger within the main bale chamber.
In the main bale chamber, after the wad is injected into the bale chamber, the plunger compresses the wad of crop material into a so-called 'flake' against previously formed flakes to form a bale and, at the same time, gradually advances the bale towards the outlet of the bale chamber. Pressure exerted by the walls of the bale chamber dictates the frictional force needed to overcome friction and shift the flakes in the chamber. An increased force to shift the flakes causes the plunger to compact the flakes tighter, and thereby produce a higher-density bale.
The bale chamber typically has three moving walls (a top wall and two side walls), which may be positioned by two hydraulically controlled actuators connected to a cam mechanism. When enough flakes have been added and the bale reaches a full (or other predetermined) size, a number of knotters are actuated which wrap and tie twine, cord, or the like around the bale while it is still in the main chamber. The twine is cut and the formed bale is ejected out the back of the baler as a new bale is formed.
Returning to the rotor cutter apparatus, typically this includes a rotor assembly having a rotor shaft and a number of tine plates arranged axially along the rotor shaft and which rotate with the rotor shaft. Each of the tine plates has one or more tines which, as the rotor shaft rotates, engage with the crop to move the crop material from the pickup unit towards a knife rack. The knife rack typically has knives for cutting the crop into smaller pieces before it reaches the pre-compression chamber.
As well as simply moving the crop towards the pre-compression chamber, it is desirable for the rotor assembly to arrange the collected crop so that the crop is equally distributed as it is loaded into the pre-compression chamber. This ensures that the entire pre-compression chamber is filled, which assists in allowing a desired bale rate of the baler to be reached. In order to distribute the crop, typically the tine plates are arranged on the rotor shaft such that the tines form a particular pattern or shape. For example, it is known to arrange the tine plates so that the tines form or define a 'V'-shape or profile with a corner at a central or middle portion of the rotor shaft and two straight lines extending out towards end or side portions of the rotor shaft. However, such a rotor shape may not provide equal distribution of the crop in certain cases. For instance, for relatively wide-windrow crop collection the amount of crop filling at the sides of the pre-compression chamber can be too high to provide an optimal or desired bale shape. Also, for relatively narrow-windrow crop collection the V-rotor transports the crop to the pre-compression chamber with little or no spreading, which leads to unequal crop distribution in the pre-compression chamber.
It is an aim of the present invention to address one or more disadvantages associated with the prior art.

Rotor assembly for an agricultural baler


A SiOC layer and/or a SiC layer of an etch stop layer may be improved by altering the process used to form them. In a bi-layer structure, a SiOC layer and/or a SiC layer may be improved to provide better reliability. A silicon carbide (SiC) layer may be used to form a single-layer etch stop layer, while also acting as a glue layer to improve interface adhesion. Preferably, the SiC layer is formed in a reaction chamber having a flow of substantially pure trimetholsilane (3MS) streamed into and through the reaction chamber under a pressure of less than about 2 torr therein. Preferably, the reaction chamber is energized with high frequency RF power of about 100 watts or more. Preferably, the SiOC layer is formed in a reaction chamber having a flow of 3MS and CO2, and is energized with low frequency RF power of about 100 watts or more.

A nitrogen-free etch stop layer is currently preferred for copper dual damascene structures having a low-k dielectric intermetal layer to avoid problems caused by outgassing from the low-k dielectric (e.g., via poisoning, resist scumming, via blinding). Currently a bi-layer structure is often used for providing a nitrogen-free etch stop layer for 90 nm and above technologies, for example. A SiOC layer is currently used as a nitrogen-free etch stop for the dual damascene process. SiOC is currently adopted for its low-k dielectric properties and inter-metal dielectric etch selectivity. A bottom SiC layer is currently used as a glue layer to improve the adhesion between the underlying layer and the etch stop layer. When part of the underlying layer includes copper (e.g., for metal interconnects and/or contacts), the SiC layer also prevents the SiOC from oxidizing the copper. However, a bi-layer structure often causes additional interface adhesion concerns, due in part to the current quality of the SiOC and SiC layers. Also, the use of and processing of the SiOC as the etch stop layer introduces the problem of oxidizing copper in the underlying layer. Thus, it would be desirable to be able to eliminate the bi-layer structure for nitrogen-free etch stop layers, as well as limiting or eliminating the use of SiOC as an etch stop layer material in some cases (e.g., 65 nm technology).

Taiwan Semiconductor Manufacturing Company, Ltd.


A method of maintaining an electronic device, the method including the steps of monitoring ambient an environmental condition such as temperature or humidity; monitoring a self-test initialization criterion; performing an automatic device self-test if the self-test criterion is met and if the environmental condition is within a predetermined range; and not performing the automatic device self-test if the self-test criterion is met but the environmental condition is outside the predetermined range. In a preferred embodiment, the device is an external defibrillator.

1. Field of the Invention
This invention relates generally to electronic devices and environment-dependent methods of maintaining the devices and indicating operational status of the devices. In particular, this invention relates to temperature-dependent methods of maintaining external defibrillators and indicating their operational status.
2. Description of the Prior Art
Electronic devices that are infrequently used may be designed to perform automatic self-tests on a preset schedule, in response to an event or condition, or otherwise and to indicate the results of those self-tests to a potential user. An example can be found in certain external defibrillators that automatically self-test battery capacity and other defibrillator functions and components and indicate the results of those self-tests (ie., the device's operational status) through visual displays and/or audible tones.
U.S. patent application Ser. No. 08/240,272 describes a battery-operated automatic external defibrillator (AED) designed for infrequent use. The device described in that patent application performs a variety of daily, weekly and monthly self-tests while in stand-by mode (i.e., when not powered-on to treat a patient, to review past treatment events, etc.) and indicates the operational status of the device using an "OK" or "Not OK" fail-safe display and through an audible tone generator. One of the device parameters monitored during the self-tests is remaining battery capacity.
The '272 application also suggests performing a group of self-tests automatically in response to exposure of the defibrillator to temperature extremes, although the exact nature of the environmentally-triggered self-tests is not disclosed.
The disclosure of the '272 application is incorporated herein by reference.

Environment-responsive method for maintaining an electronic device such as an external defibrillator


A recessed luminaire is described. The luminaire may include an aiming system allowing a rotation angle and/or a tilt angle of a light source to be adjusted while the light source is in operation. Additionally, the luminaire includes a light shield that is coupled to the aiming system such that the light shield may move in relation to the tilt angle and the orientation of the light source. The aiming system may be further coupled to a support panel such that rotation of the aiming system is provided by a rotatable coupling between one or more leaf Springs of the aiming system, and an upper surface of the support panel.

Light fixtures or luminaires are commonly used in a variety of commercial and residential settings. While many types of luminaires exist, one popular type is a recessed luminaire. One advantage of a recessed luminaire, depending on the design, is that the majority of the structure of the luminaire may be mounted in the ceiling or wall so that it does not noticeably extend beyond the mounting surface, thereby providing an appearance with limited visibility of constituent components when the luminaire is installed.
A luminaire being installed in a ceiling is typically installed by first mounting a housing, or support panel, to a one or more ceiling supports so that the housing is aligned with the planned surface of the ceiling. This alignment process can be difficult as the actual surface is not there when the housing is being aligned. Next a surface material, which may be drywall, drop ceiling tiles or any other suitable surface material, is installed after the housing of the luminaire is installed. To allow the luminaire to function, a hole is provided in the surface. Often a trim plate with a flange is attached to the housing so as to cover up an edge of the hole, as well as internal components of the luminaire.
Upon installation of a luminaire, one or more adjustments me be made to an orientation and/or angle of a constituent light source. Current luminaires make it difficult to aim the light source (otherwise referred to as a bulb or lamp) while the luminaire is on; as such, adjusting the aim often requires turning the power off, partially disassembling the luminaire, making an adjustment in the light source aiming assembly, reassembling the luminaire and then turning the power back on to see if the adjustment correctly aimed the light source in the desired direction. This process is made more troublesome if one or more lens and/or filters are used to shape the light emitted from the light source because often the lens and/or filters need to be carefully orientated. As a consequence, such an aiming process may be tedious, time consuming, and expensive; however, the ability to adjust one or more of an orientation and/or an angle of a light source of a luminaire allows said luminaire to provide a variety of lighting effects in addition to down lighting, such as accent or wall-wash lighting.
Therefore, a need exists for improvements in luminaire design, including improvements in one or more mechanisms for aiming a light source associated with the luminaire.


A method for processing semiconductor wafers is disclosed. A semiconductor wafer is provided to a semiconductor processing stage where a block copolymer surfactant (BCS) is applied to the wafer surface. In one embodiment, the BCS includes a hydrophobic portion and a hydrophilic portion. Alternatively, the BCS may be a silicone-containing BCS. In one embodiment, the BCS is within an aqueous solution where the concentration of the BCS within the aqueous solution is less than one percent by weight. Also disclosed is an aqueous solution including abrasive particles and a BCS having a hydrophobic portion and a hydrophilic portion. The abrasive particles may include silica, alumina, or ceria.

Chemical mechanical polishing (CMP) has been widely adopted in semiconductor manufacturing process for planarization of a layer, especially a copper layer, on a wafer surface. More specifically, a copper layer is deposited over a dielectric layer to fill openings within the dielectric layer. To remove portions of the copper layer that are not within the openings (i.e., to form interconnects that are electrically isolated from each other), a slurry and a pad are used. Typically, the wafer is rinsed immediately following planarization (i.e., while the wafer is still in contact with the pad) to remove any unwanted surface defects, such as slurry particles or other residuals. Additional rinsing may be performed after transferring the wafer to a scrubber or noncontact cleaning tool to remove any surface defects that were not removed during the rinse on the pad.
Due to the complex nature of the chemistry and CMP process, it is possible that components of the slurry react with the copper layer to form defects on the surface of the wafer because as the amount of copper that is exposed during planarization increases (e.g. an increase in the number of openings and/or the size of openings), the number of surface defects also increases. The surface defects are typically less than 1 centimeter in area and are commonly referred to as stains, precipitates, carbon particles, carbon residual, slurry residual, or organic residuals. Much is unknown as to the exact cause and the exact composition of the surface precipitates. However, they are believed to be clusters, of material that include carbon. It is desirable to decrease the number of surface defects as they lead to yield loss.
One proposed solution to minimize defects is to use polyethylene glycol (PEG) as a surfactant in the slurry. However, the addition of PEG does not consistently decrease surface defects. In addition, concentrations in excess of 1 weight percent (10000 ppm) of PEG may need to be added to the slurry. The relatively high concentration of PEG can cause several problems including poor filtration and has a negative cost impact. Therefore, there is a need for a reliable solution to minimize surface defects that does not require large additive concentrations.
Skilled artisans appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help improve the understanding of the embodiments of the present invention.

Method of using an aqueous solution and composition thereof


A positive touch surgical endoscopic cannula assembly in which one, or both, of liquid or gas may be introduced or removed from a body cavity during surgery. The device contains a valving mechanism responsive to finger or thumb touch of the surgeon and having a conically shaped force resistor which is partially inverted during movement of the valve between open and closed positions. The partial inversion of the flexible resistor is detectable through an actuator to the hand or thumb of the operator to positively indicate positioning of the valve head and seat members.

(1) Field of the Invention
The invention relates to a surgical endoscopic suction/irrigation cannula assembly including a valve actuator.
(2) Brief Description of the Prior Art
Surgical endoscopic procedures typically follow three steps. First, a cannula, such as a Veress cannula, is inserted into the abdominal cavity through the abdominal wall and the cavity is inflated with insufflating gas which is passed through the cannula tubular housing. After insufflation, a small incision is made in the skin and a standard trocar spike is thrust into the inflated abdomen through the bore of the trocar tube. The spike is inserted for purposes of puncturing or cutting of the abdominal wall and piercing the fascio and peritoneum inside the cavity. After removal of the spike, a suction/irrigation cannula is inserted through the trocar housing and into the opening so that fluids may be drained from the body cavity.
Endoscopic surgery also includes the introduction through a trocar tube of a number of auxiliary surgical instruments such as, for example, a laparoscope, or the like. Heretofore, in many surgical instances, endoscopic surgery procedures have been performed through the trocar tubular housing by sequential insertion and removal of surgical instruments as they are needed. As the surgery is performed using such instruments, many situations require concurrent introduction or removal of gaseous or liquid fluid materials immediate the area of the surgery. Thus, removal of the surgical instrument from the body cavity through the trocar tubular housing and reinsertion through the trocar housing of a device for transmission of the gaseous or liquid substance not only complicates the surgical procedure, but is also time consuming and may introduce unforeseeable consequences to the surgical operation.
Endoscopic surgery is a very fine art, demanding extremely controlled movements of the surgeon's hand in the operation of the surgical instruments through the trocar housing. Therefore, any valves or other components which are required to be manually manipulated by the surgeon must be extremely sensitive and manipulatable in direct response to a very minor application of pressure or movement of the surgeon's hand or finger.
In copending application Ser. No. 656,951, filed Feb. 19, 1991, now U.S. Pat. No. 5,125,910, and entitled "Surgical Endoscopic Suction/Irrigation Cannula Assembly", and assigned to the same assignee as the present invention, there is shown and disclosed a "trumpet"--like valve assembly and cannula for use in irrigation/suction techniques for endoscopic surgery. The present invention is provided in order to enhance the sensitivity of such a device to hand manipulation by the surgeon and to afford the surgeon a positive "feel", indicative of the movement of the valve to the open position. Accordingly, the invention permits the introduction or removal of fluid to or from the body cavity during surgery by activation with only a minor amount of pressure through the surgeon's finger and provides a positive indication, transmittable through the device and the operating finger of the surgeon, indicative of the positioning of the valve head to open a fluid flow passageway.
The present invention also provides for introduction or removal of fluid from the body cavity during surgery through the cannula housing through which an auxiliary device may be inserted at any time during the surgery without removal of the valve actuator device. Thus, an auxiliary endoscopic instrument may be utilized concurrently with the device of the present invention to introduce and/or remove gaseous or liquid fluids from the body cavity during the surgical operation.

Surgical endoscopic cannula with positive touch


Systems and methods to stir an electromagnetic (EM) field of an EM reverberation chamber are disclosed. A particular system includes an EM reverberation chamber. The system also includes a transmit antenna and a receive antenna operable to generate an EM field within the EM reverberation chamber. The system further includes a variable charged particle source to stir the EM field by varying introduction of charged particles into the EM field.

Electromagnetic (EM) reverberation chambers are used to perform various tests on devices. For certain tests, an EM reverberation chamber subjects a device under test to an EM field. The EM reverberation chamber may include a stirring device to stir the EM field. For example, the EM reverberation chamber may include a movable metal paddle that is moved to stir the EM field.


A seal (34) for a fuel cell (10), which includes multiple bipolar plates (13) and at least one membrane electrode assembly (12), the seal (34) having a seal body (40) surrounding a free inner chamber (42) is provided. It is provided that at least two flow barriers (46) pointing into the inner chamber (42) are formed as a single piece with the seal body (40), the flow barriers (46) being situated at a distance from the seal body (40) by at least one connecting element (48).

Fuel cells which include bipolar plates and a membrane electrode assembly situated therebetween have seals which are situated in a seal space around an active area of the fuel cell. Tolerances in the x and y directions as well as the dimensions of the compressed seal influence how wide the seal space is defined. The remaining space between the seal space and the compressed seal may define one or multiple bypass paths.
In the event that the seal is situated on the membrane electrode assembly, this bypass path may occupy a not inconsiderable portion. In some cases, as much as forty percent of the gas may flow via this bypass path. This problem may result, for example, in the fact that the stability decreases, a greater sensitivity at low stoichiometric ratios arises, the water management process deteriorates and/or the optimum operating conditions change.
On the bipolar plates in fuel cells, part of the gas, generally hydrogen and air, bypasses the active surface without participating in the reaction. These bypass paths reduce the pressure loss of the flow in the flow field.
DE 11 2005 002 035 T5 proposes a seal configuration, with the aid of which bypass areas are reduced. For this purpose, sub-seals are situated on both sides of a membrane electrode assembly, between the latter and adjacent bipolar plates. An elastomer sealing element, which spreads apart individual layers of the membrane electrode assembly, is provided within the membrane electrode assembly. A cross-sectional surface of the bypass is reduced by this spreading apart.


The present invention provides a method for producing a fluorine-containing halide, comprising reacting a fluorine-containing sulfonyl halide or fluorine-containing disulfonyl chloride with a metal halide or metal component in the present or absence of a solvent. In accordance with the present invention, a fluorine-containing bromide, fluorine-containing iodide or fluorine-containing chloride can be readily produced in high yield at low cost, using an industrially advantageous process.

Fluorine-containing halides represented by chemical formulae RflBr, RflI and RflCl, wherein Rfl is a saturated or unsaturated fluorine-containing group, are compounds useful as the intermediates for chemicals, pharmaceuticals, agrochemicals, resins and the like. For example, fluorine-containing saturated alkyl bromides are used as blood substitutes, perfluoroalkylating agents and the like. Fluorine-containing unsaturated bromides, fluorine-containing unsaturated iodides and the like are also useful as monomer components for the production of functional materials, because they have replaceable bromine or iodine as a functional group.
A method for producing a fluorine-containing halide is known which converts a sulfonyl chloride represented by chemical formula RflSO2Cl to a fluorine-containing bromide represented by chemical formula RflBr, in accordance with reaction formula 1 shown below (see, for example, Patent Document 1 listed below):

This method, however, employs HBr, a corrosive gas, at high pressures, and produces as a byproduct HCl, which is similarly a corrosive gas, thus causing corrosion of the reaction vessel. Moreover, the reaction has to be carried out in the absence of water, making it difficult to handle reagents. In addition, the reaction needs to be carried out in a high temperature ranging from about 90 to about 150° C.
Another method is known which produces RflBr in accordance with reaction formula 2 shown below (see Patent Document 2 listed below):RflSO2Cl+quaternary (ammonium or phosphonium) bromide→RflBr+SO2+quaternary (ammonium or phosphonium) chloride   formula 2
The drawbacks of this method are that the use of an expensive quaternary (ammonium or phosphonium) bromide as a starting material is necessary, and that a large amount of byproduct, i.e., a quaternary (ammonium or phosphonium) chloride, is produced as a waste material.
Moreover, a method is known for synthesizing a fluorine-containing chloride represented by chemical formula RflCl using a sulfonyl chloride represented by chemical formula RflSO2Cl as a starting material, wherein RflCl is produced in accordance with the reaction formula shown below (see Patent Document 3 shown below):

This method, however, is also industrially disadvantageous in that the reaction has to be carried out at a high temperature.
No process is known for synthesizing a fluorine-containing iodide represented by RflI using a sulfonyl chloride represented by chemical formula RflSO2Cl as a starting material.    [Patent Document 1] U.S. Pat. No. 4912269    [Patent Document 2] U.S. Pat. No. 5057633    [Patent Document 3] Journal of Fluorine Chemistry, 25 (1984), 491-504

Method for producing fluorine-containing halide


A method includes simulating operation of a fiber optic gyroscope during a digital simulation. The simulation includes performing an iterative loop that includes simulating an intensity of light from a fiber coil of the fiber optic gyroscope and simulating operation of one or more control loops within the fiber optic gyroscope using the simulated intensity of the light. The intensity of the light is simulated using a sine/cosine function based on at least one angular rate-related effect injected into the simulation as a Sagnac phase shift. The simulated operation of a first of the one or more control loops attempts to reduce or eliminate the Sagnac phase shift. The method also includes storing, outputting, and/or using results of the simulation. The at least one angular rate-related effect could include rotation of the fiber coil and/or mechanical vibration of the fiber coil.

Fiber optic gyroscopes are used in a variety of applications to detect changes in orientation. For example, fiber optic gyroscopes can be used in the navigation systems of guided missiles and vehicles such as aircraft, spacecraft, ships, and submarines.
Fiber optic gyroscopes operate based on the interference generated by beams of light. In a conventional fiber optic gyroscope, a fiber optic cable is coiled, and beams of light are injected into the coil at opposite ends of the coil. Due to the Sagnac effect, rotation of the coil causes the light beam traveling in the direction of rotation to experience a slightly longer path delay than the light beam traveling in the opposite direction. This creates a small phase shift between the beams of light. This phase shift can be measured and used to precisely identify the angular velocity of the rotation experienced by the coil.

Simulator for simulating the operation of a fiber optic gyroscope


A package for sterilized, absorbable medical devices is disclosed. The package has a plurality of cavities in communication with a vent, wherein the vent is preferably centrally located. After sterilization, the package is sealed adjacent to the vent thereby providing individual hermetically sealed sterile cavities which are cut away from the package to form unitary packages.

Packages for medical devices, including surgical needles and sutures are well known in the art. Surgical sutures are typically manufactured with surgical needles mounted to one or both ends of the suture. The surgical needle and suture combinations are typically packaged in a variety of conventional packages. One type of conventional package typically used is a folder package made from a stiff, medical grade paper. A folder package will typically have a plurality of foldable panels and cut-out tabs and tab pockets. In addition, a needle park is typically mounted to one of the panels for receiving and holding one or more surgical needles. In order to package a surgical suture and surgical needle combination in a conventional folder package, the needle is first typically mounted in a needle park, then the suture is wound onto one or more of the panels and the folder package is folded and locked to securely maintain the needle and suture in the panel. Folder packages for surgical needles and sutures are illustrated and disclosed in the following patents which are incorporated by reference: U.S. Pat. Nos. 4,126,221, 4,120,395 and 5,555,976.
Another type of conventionally used suture package is a molded plastic tray package having a central floor surrounded by an outer winding channel for receiving and retaining a suture, e.g., an oval channel. This type of package typically has a centrally located needle park molded into the package. A surgical needle mounted to a surgical suture is typically packaged in the winding channel by initially mounting the surgical needle in the needle park and then winding the suture in the channel. Winding is typically accomplished by mounting the tray package in a fixture and rotating the fixture and mounted package. A cover may be mounted to the top of the winding channel package, or the package may have molded retainer elements, in order to maintain the suture in the channel. Suture tray packages having winding channels are illustrated in the following which are incorporated by reference: U.S. Pat. Nos. 4,967,902, 5,213,210 and 5,230,424.
Surgical needles and sutures are typically sold by the manufacturer as sterile products. In order to sterilize a packaged surgical needle and suture, it is first necessary to place the primary package into an outer package. The outer package is then sealed and functions as a biobarrier to pathogens, in particular, bacteria. The outer packages are often referred to in this art as envelopes or pouches, and the biobarriers are often referred to as microbial barriers. There are various types of conventional materials which are useful to construct these outer packages, including foil laminates, polymer films, TYVEK.RTM. spun polymer films and the like. There are a variety of conventional processes which can be used to sterilize packaged surgical needles and sutures including autoclaving, radiation sterilization and ethylene oxide sterilization. In general, the packaging material utilized for the outer package is selected on the basis of the sterilization technique utilized and the material of construction of the medical device.
Ethylene oxide sterilization is a sterilization process of choice for many medical devices. In a conventional ethylene oxide sterilization process for medical devices, the packaged devices contained in sealed outer envelopes or pouches are initially subjected to a vacuum, next to a predetermined level of water vapor, and then to a conventional ethylene oxide gas sterilant for a predetermined time at a predetermined temperature. The cycle is calculated to effectively kill off any pathogenic bioburden with an acceptable safety factor. At the end of the sterilization phase of the cycle, the packages are exposed to a vacuum sufficient to effectively remove the sterilant gas from the interiors of the envelopes or pouches along with any sterilant gas residues from the packages and the medical devices, thus completing the sterilization cycle. Since the moisture and the sterilant gas must have access to the interior of the outer package and the inner primary package containing the medical device, it is typically necessary to have some sort of gas permeable material present in the outer package to allow air, water vapor and sterilant gas to enter and exit the outer package. A conventional outer package (envelope or pouch) for use with ethylene oxide sterilization processes typically has a top clear polymer film which is gas impervious. The clear film is sealed or bonded about its periphery to a bottom microbial barrier member constructed of paper or a film of TYVEK.RTM. spun polymer (or an equivalent) which is gas permeable. Moisture and sterilant gas can move across the microbial barrier member into and out of the outer package.
Certain types of medical devices, such as surgical sutures, are designed to absorb when implanted into the human body. These absorbable sutures are made from conventional, widely known absorbable polymers which are moisture sensitive. In order to maintain the strength and integrity of the absorbable medical devices and prevent degradation while being shipped, or stored prior to use, it is essential that the outer package be moisture impervious, i.e., hermetically sealed. Accordingly, the conventional gas permeable microbial barrier outer pouch packages cannot be used for absorbable medical devices. It is necessary to use an outer package which is impervious to water vapor and gases, such as a conventional polymer/metal foil laminate pouches typically referred to in this art as a "foil pouch".
It is desirable to sterilize packaged synthetic, absorbable medical devices, such as surgical sutures, using ethylene oxide sterilization processes. Radiation or high temperatures may adversely affect the absorbable polymers. However, sealed foil pouches are also impervious to sterilant gas. In order to compensate for this and utilize foil packages in ethylene oxide gas sterilization processes, processes have been developed using foil pouches having gas permeable or pervious vents (e.g., TYVEK.RTM. polymer). The gas permeable vents are mounted to an open end of the foil package and allow the passage of air, water vapor and sterilant gas into the interior of the package. After sterilization, the foil package is sealed adjacent to the vent, and the vent is cut away or otherwise removed, thereby producing a gas impervious hermetically sealed package. Yet another type of foil package having a vent is a pouch-type package having a vent mounted adjacent to an end of the package, wherein the vent is sealed to one side of the package creating a vented section. After sterilization, the package is sealed adjacent to the vent, and the package is cut away for the vented section. This vented package will be described in more detail hereinbelow.
Alternatively, processes have been developed for sterilizing foil packages without the use of gas permeable vents. This is done by sealing the foil package substantially about its periphery (e.g., on three sides) but leaving a portion of the package open, typically the top end, as a pathway for the sterilant gas, etc. This type of process is known as an "open vent" process. In an open vent process, after the sterilization cycle has been completed the opening in each package is sealed under aseptic conditions, providing for a hermetically sealed foil package having a sterile interior. An example of such a process is disclosed in U.S. Pat. No. 3,815,315 which is incorporated by reference. Another example of an open vent sterilization process useful for an open vent package is contained in U.S. Pat. No. 5,464,580 which is incorporated by reference.
It is known to form foil packages in a multiple pack format to contain multiple suture packages. These outer packages have multiple cavities, for example, eight cavities. A surgical suture package is placed in each cavity, and each cavity is sealed about its periphery on three sides, leaving an opening(i.e., an open vent) in communication with each cavity. After ethylene oxide sterilization, the openings are subsequently sealed aseptically, and the packages are separated into unitary packages. Such sterilization processes, foil packages and methods of forming the packages are disclosed in U.S. Pat. Nos. 5,464,580 and 5,623,810 which are incorporated by reference. Although such foil packages having multiple cavities are conventionally utilized, there are some disadvantages associated with their use. For example, in order to sterilize the multiple cavity packages, the pathway to each cavity must be kept open. Then, after sterilization, the packages must be maintained in aseptic environments prior to and during sealing. It is known that it is difficult and costly to maintain aseptic conditions in large volumetric facilities required for aseptic package storage and sealing. In addition, moisture must be precisely controlled in the aseptic environments to prevent degradation of bioabsorbable medical devices. It is also known that different levels of sterilization may be attainable with packages having microbial barriers versus packages having open vents.
Accordingly, there is a need in this art for a novel foil package, especially a multiple cavity foil package, for absorbable sutures and other medical devices which does not require aseptic sealing after sterilization and which can be immediately placed in a nonsterile environment prior to further processing for conversion to a hermetically sealed, sterile package. There is a further need for processes for sterilizing surgical sutures and needles and other medical devices in foil packages or pouches, in particular multiple cavity foil packages, without the need for aseptic processing.

Microbial barrier vented package for sterile medical devices and method of packaging


A flexible electronic display device is provided comprising a substrate; an imaging layer zone; a transparent superstrate; and a thermal control layer. The device is able to resist thermal deformation caused by the heating generated by the operation of the display.

There is substantial and growing interest in the development of flexible electronic circuitry for applications that range from intelligent labels for inventory control, to large format flexible displays. This technology has great potential for many such applications due to the inherent low costs and high throughput of the manufacturing process.
From a structural perspective, flexible electronic circuits are essentially a multilayer stack of thin film laminates. These laminates can range in thickness from a few nanometers, to hundreds of microns. When these structures carry an electrical current, joule heating takes place, and there is a potential for deleterious structural deformation due to the mismatch of thermal expansion coefficients from one layer to the next. The prior art has attempted to address the aforementioned drawbacks and disadvantages, but has achieved mixed results.
For example, in order to redistribute thermal stress, the use of a spacer layer between the thin film and a more rigid layer of a multilayer flexible electronic device has been devised. Although this technique is applied in U.S. Pat. Nos. 6,281,452B1 and 6,678,949 in order to minimize thermal stress, it is nonetheless characterized by drawbacks. This method is generally less than ideal, since it adds unnecessary thickness to a device that is required to be sufficiently thin. Additionally, such thickness restrictions hinder the possibility of employing additional layers that may be needed to minimize thermal stress.
U.S. Pat. No. 5,319,479 discloses a multilayer device, comprised of an electronic element, a plastic substrate, and a thin film, wherein the thermal deformation of the thin film is minimized by plastic substrate and the electronic element. This method has a distinct disadvantage in that it does not provide flexibility in adjusting the coefficient of thermal expansion and the thickness of the respective layers.

Elimination of thermal deformation in electronic structures


A system and method of coupling acoustic and electrical stimulation of noninvasive neuromodulation is a therapeutic system and method preferably designed for the diagnosis and/or treatment of neurodegenerative diseases and neurological disorders including, but not limited to, tinnitus, hyperacusis, sleep disorder, depression, anxiety, dizziness, migraine, or ear suffocation. The system includes acoustic signal devices for deep brain electrical stimulation and electrical pulse devices for shallow brain electrical stimulation. Further, the system includes a signal-coupling module that includes an algorithm for coupling acoustic signals to electrical pulses. Parameters of each the acoustic signals and the electrical pulses are adjusted in order for the acoustic signals to be coupled to the electrical pulses. These parameters can also be adjusted based on patient feedback. Furthermore, the system can synchronously output the coupled acoustic signals and the coupled electrical pulses, asynchronously output the acoustic signals, or the electrical pulses based on patient feedback.

Neurodegenerative diseases and neurological disorders such as, not limited to, tinnitus, hyperacusis, sleep disorder, depression, anxiety, dizziness, ear suffocation affect million of people worldwide. These neurodegenerative diseases and neurological disorders include symptoms which negatively affect neurons in the human brain, the spine, and head area of a human. There are various treatment methods for these types of diseases and disorders. Two of the most effective treatment methods include deep brain electrical stimulation and shallow brain electrical stimulation. Deep brain electrical stimulation is primarily provided through audio outputs, and shallow brain electrical stimulation is primarily provided through the electrical pulses. These two stimulation methods have been used separately and together for diagnosis and/or treatment of neurodegenerative diseases and neurological disorders. This has been proven effective, but there is still room for improvement.
Therefore, the objective of the present invention is to improve the diagnosis and/or treatment of neurodegenerative diseases and neurological disorders by coupling acoustic and electrical stimulation of noninvasive neuromodulation. The noninvasive neuromodulation approach is formed by means of the coupled and automatic adjustable deep brain electrical stimulation and shallow brain electrical stimulation systems. The deep brain electrical stimulation is by means of an external acoustic stimulation, whose acoustic signals are delivered to the ear canal via the headphone or speaker, and then are converted to the electrical signals by means of the cochlea, the electrical signals transmit through the auditory pathways and nonauditory pathways in the deep brain, the electrical signals modulate the neurological systems, improving the nerve noise signal filter function, activating neuron firing to form the nerve pulses transmitting through the nerves, desynchronizing abnormal signals generated by the neurological disorders, and thus reducing or eliminating the neurological disorder signals. The auditory pathways are of the thalamus, primary auditor cortex, secondary auditory cortex, anterior auditory field, peripheral system, etc. for the auditory functions. The nonauditory pathways are of the hippocampus amygdale for the memory and emotion functions, the somatosensory pathways for sensing, and the cingulate gyms for attention and consciousness.

System and method of coupling acoustic and electrical stimulation of noninvasive neuromodulation for diagnosis and/or treatment


A visible-light-responsive three-dimensional fine cell-structured photocatalytic filter in accordance with the present invention includes a sponge-like porous structure (B) containing an anatase-type titanium oxide coating formed on a surface of a sponge-like porous structural body (A) which has a porosity of 85 vol % or more. The sponge-like porous structural body (A) is composed of one material selected from the group consisting of one metal selected from the group consisting of (a) to (e): (a) carbon and either or both of silicon and a silicon alloy; (b) silicon carbide and at least one material selected from the group consisting of silicon, a silicon alloy, and carbon; (c) silicon nitride and at least one material selected from the group consisting of silicon, a silicon alloy, carbon, and silicon carbide; (d) carbon; and (e) carbon and one metal selected from the group consisting of titanium, vanadium, chromium, manganese, iron, cobalt, nickel, copper, ruthenium, rhodium, palladium, silver, platinum, and gold.

Placed in sunlight or under a fluorescent lamp, especially at ultraviolet wavelengths, titanium oxide shows strong oxidation on its surface due to photocatalytic action. It is well-known that the oxidation removes organic compounds and toxic matter, such as bacteria, that are in contact with the titanium oxide. See Japanese patent 2883761 (published on Jun. 22, 1993; registered on Feb. 5, 1999; hereinafter, "patent document" 1), for example. However, titanium oxide is powdery; if it is used as such, the powdery titanium oxide (titanium oxide powder) may scatter in gas or fluid. Titanium oxide powder needs be in a solid form for convenient use. How this "fixing" of titanium oxide powder is done greatly affects the probability of the titanium oxide coming in contact with toxic substances. Further, if no light reaches titanium oxide, no photocatalytic action occurs. Conventionally, titanium oxide is fixed onto substrates of various shapes as described in patent document 1: many other alternatives are also proposed including films, glass beads, silica gel, and stainless steel wool.
In Japanese Unexamined Patent Publication, or Tokukai, 2001-179246 (published on Jul. 3, 2001; hereinafter, "patent document" 2), one of the inventors of the present invention suggested a purifier device using fine hollow glass spheres coated with titanium oxide. The purifier device (not shown) has a light source and an enclosure tube. The space between the light source and tube is filled with numerous fine, hollow glass spheres coated with titanium oxide. The device is capable of purifying polluted fluid by simple operation and without concern for secondary pollution. However, the fine, hollow glass spheres do not allow sufficient ultraviolet to reach the titanium oxide. Demands are there for further improvement on the photocatalytic action.
Hence, the purifier device of patent document 2 suggested by one of the inventors of the present invention is indeed innovative, but falls short of stretching the photocatalyst to the limit.
With growing use of photocatalysts, expectations are rising also for visible-light-responsive three-dimensional fine cell-structured photocatalytic filters that function in sunlight and under other visible light sources, as well as across the ultraviolet range of spectrum, at high efficiency. We expect that if we can purify polluted air and water in sunlight at high efficiency, we will not have to use electricity, and the use of photocatalysts will dramatically expand.

Visible-light-responsive three-dimensional fine cell-structured photocatalytic filter, its manufacturing method and purifier device

National Institute of Advanced Industrial Science and Technology


Provided is a process for the formation of nitrated compounds by the nitration of hydrocarbon compounds with dilute nitric acid. Also provided are processes for preparing industrially useful downstream derivatives of the nitrated compounds, as well as novel nitrated compounds and derivatives, and methods of using the derivatives in various applications.

The nitration of hydrocarbons generally produces a variety of products depending upon the reaction conditions and the feedstock structure. Certain products, however, may be more desirable than others and it has been a long-time goal to selectively produce the more useful nitrated compounds at the expense of less useful compounds, such as oxidation byproducts.
In contrast to commercial vapor phase nitration, the mixed vapor-liquid phase or high pressure nitration of hydrocarbons has been postulated in the past to be a technique by which desirable nitroparaffins can be potentially produced. See e.g., U.S. Pat. No. 2,489,320 (Nygaard et al.) and Albright, L. F., "Nitration of Paraffins," Chem. Engr., (1966) pp. 149-156. The prior art mixed vapor-liquid phase process, however, was never practical for a number of reasons, including because the conversion of nitric acid is low, the nitric acid is not readily recoverable, problems with reactor corrosion by the nitric acid, and difficulty in controlling reaction exotherm.
Obtaining a high yield of nitrated hydrocarbons is a critical economic factor to be considered since low yields necessitate the use of more feed and therefore result in higher costs. Furthermore, when nitric acid is used as the nitrating agent, the unreacted nitric acid becomes a waste product and costs are incurred for proper disposal of the waste. High conversion of the reactant hydrocarbon is also economically critical in order to minimize capital and energy expenses associated with the purification and recycling of unreacted reactants. A need exists, therefore, for more economical, selective, and environmentally friendly processes for the manufacture of nitrated hydrocarbons and their derivatives.

Nitrated hydrocarbons, derivatives, and processes for their manufacture