A comparator includes a P-channel MOS transistor connected at the source thereof to a power source and at the drain thereof to a comparator output and the drain of an N-channel MOS transistor. The source of the N-channel MOS transistor is connected to the ground. The gates of the P-channel MOS transistor and the N-channel MOS transistor are connected to a comparator input. The logic threshold voltage of the comparator is adjusted in accordance with a circuit parameter regarding the P-channel MOS transistor and the N-channel MOS transistor such as, a gate length, a gate width or a voltage of the power source. A result of comparison by the comparator between an analog input value inputted to the comparator input and the logic threshold voltage of the comparator is outputted to the comparator output. An analog to digital converter is constructed using the comparator. The analog to digital converter is reduced in size and allows high speed analog to digital conversion.

1. Field of the Invention
This invention relates to an analog to digital converter which converts an analog input value into a digital value, and more particularly to an analog to digital converter which can be reduced in size and effect analog to digital conversion at a high speed. The present invention further relates to an analog to digital converter which includes a plurality of comparators, and particularly to an analog to digital converter which can restrict a peak value in variation of power supply current and reduce power source noise involved in variation of the power supply current.
2. Prior Art
Analog to digital converters have been employed for a long time in an industrial field for measuring instruments such as, for example, digital voltmeters and programmable power sources. Further, in recent years, analog to digital converters have been and are employed for various public applications such as compact disk players and special applications such as CODEC for connecting a telephone set to a digital data switching network.
Further, analog to digital converters of 6 to 8 bits which can operate at a high speed of 10 to 20 MHz are used for applications of special reproduction and noise reduction in a video tape recorder for home use. As the development of the digital technology proceeds in recent years such that, for example, DRAMs (dynamic random access memories) of a comparatively large capacity are employed at a comparatively low cost, and analog to digital converters are employed widely for image processing apparatus, digital signal processors and so forth. A further higher speed operation is requested for analog to digital converters for use for the image processing apparatus, the digital signal processors and so forth.
A flash type analog to digital converter is known as an analog to digital converter which can operate at a high speed. The flash type analog to digital converter causes, when it is an n-bit flash type analog to digital converter, a total of (2.sup.n -1) comparators to operate at a time to effect analog to digital conversion. Different reference voltages obtained by division of a reference voltage using a resistor ladder wherein a total of 2.sup.n resistance elements having an equal resistance value are connected in series are inputted to the (2.sup.n -1) comparators. Accordingly, each comparator compares an analog signal voltage with a reference voltage inputted thereto. Then, the flash type analog to digital converter outputs an n-bit digital signal encoded in accordance with results of the comparison by the (2.sup.n -1) comparators. With the flash type analog to digital converter, a digital signal corresponding to an inputted analog signal voltage can be obtained at a speed much higher than integrating type analog to digital converters and successive approximation type analog to digital converters.
Further, as an analog to digital converter which can operate at a high speed, an analog to digital converter called two-step flash type analog to digital converter has been proposed in recent years and is disclosed in U.S. Pat. No. 4,533,903. The two-step flash type analog to digital converter first effects, when it is an (m+n) bit analog to digital converter, analog to digital conversion for the upper m bits using a total of (2.sup.m -1) comparators and then effects analog to digital conversion for the lower n bits using a total of (2.sup.n -1) separate comparators. Accordingly, the number of comparators employed in the two step flash type analog to digital converter totals (2.sup.m +2.sup.n -2). This is very small compared to the total number of comparators employed in such popular flash type analog to digital converters as described above.
In recent years, chopper type comparators have been and are employed as comparators for the two-step flash type analog to digital converter described above. In a chopper type comparator, an analog signal voltage is first inputted to a capacitor connected in series to the input of a CMOS (complementary metal oxide semiconductor) inverter, and then the input and the output of the CMOS inverter are short-circuited so that charge Q corresponding to the analog signal voltage is stored into the capacitor. Then, the input and the output of the CMOS inverter are opened, whereafter the capacitor to which the analog signal voltage has been inputted is connected to a reference voltage. In this instance, the CMOS inverter provides an output of a difference value between the analog signal voltage and the reference voltage in accordance with the positive or negative sign.
Another comparator for use with an analog to digital converter is disclosed in Japanese Patent Laid-Open Application No. 1-259628 wherein it includes a differential amplifier and has a correction input terminal. Comparators employing a differential amplifier are widely used in analog to digital converters together with the chopper type comparators described above. The comparator disclosed in Japanese Patent Laid-Open Application No. 1-259628 can provide an analog to digital converter which operates with a high degree of accuracy and at a high speed without being influenced by a variation of offset voltage. For example, the comparator can reduce the problem of the variation in offset voltage caused by a difference between threshold voltages a pair of transistors when MOS (metal oxide semiconductor) transistors are employed for a comparator which employs the differential amplifier.
While the flash type analog to digital converters described above are advantageous in that they can effect analog to digital conversion at a speed much higher than the integrating type analog to digital converters or the successive approximation type analog to digital converters, they have a problem in that the number of comparators involved is very great.
Also the two step flash type analog to digital converter described above has the problem that the number of comparators is still great although the number is reduced compared to the popular flash type analog to digital converters. For example, a two-step flash type analog to digital converter of 8 bits requires a total of 30 (=2.sup.4 +2.sup.4 -2) comparators. Accordingly, the conventional flash type analog to digital converters including the two-step flash type analog to digital converter are disadvantageous in that the circuit scale is great and the chip size when fabricated in an integrated circuit is large
Meanwhile, in the chopper type comparator for use with an analog to digital converter, two voltages are to be compared with each. That is, an analog input value and a reference voltage must be inputted alternately. Accordingly, the operating time for conversion is long. Further, an operation of the chopper type comparator for analog to digital conversion involves charging a capacitor in accordance with an analog input value or with a reference voltage and initialization by discharging through short circuiting. Accordingly, a problem of production of noise is also involved. The chopper type comparator has a further problem that the power dissipation is comparatively high due to the dynamic operation described just above during analog to digital conversion.
On the other hand, the comparator employing a differential amplifier normally has the operating speed of 20 to 30 MHz or so. Accordingly, the comparator cannot be employed for an analog to digital converter which effects a converting operation at a higher speed.

Parallel A/D converter having comparator threshold voltages defined by MOS transistor geometries


A soil excavating apparatus for use in combination with a cleaning/vacuuming machine having at least one high pressure fluid supply in the vacuum line. A soil excavating apparatus is disclosed for use in combination with a cleaning/vacuuming machine having at least one high pressure fluid supply in the vacuum line. The apparatus includes a spray head secured to the vacuum line first end, and disposed substantially thereabout. The spray head is in fluid communication with the pressurized fluid supply. A plurality of inboard spray nozzles are disposed substantially thereabout. The spray head is in fluid communication with the pressurized fluid supply. A plurality of inboard spray nozzles are removably secured to the spray head and extend therefrom. The spray nozzles are angularly oriented to direct the pressurized fluid towards a center line of the vacuum line.

(Not Applicable)
(Not Applicable)
The present invention relates to soil-excavating apparatus and, more particularly, to soil-excavating apparatus adaptable for use in conjunction with portable cleaning/vacuuming machines.
Various ways exist to excavate a hole in the ground. The excavation can proceed manually, using hand tools such as shovels and picks, or mechanically, using various digging and boring devices. Manual techniques tend to be slow and labor intensive. Mechanical techniques tend to be faster, but may be unsuitable where the excavation is for the purpose of locating and exposing products that may be easily damaged, e.g., wires, gas pipe, or other utilities. Even manual techniques may result in injury to a utility, e.g., by being struck by sharp instruments such as a pick or shovel. Consequently, existing techniques for locating or excavating utilities or other sensitive objects are generally not satisfactory and suffer from drawbacks relating to speed and potential damage to objects within the excavation area.
Hydro-excavating techniques have been used for a variety of purposes in the past. However, those techniques have not proved useful to effect confined excavations. Moreover, such techniques may result in wide-spread debris and unsafe working conditions. Accordingly, there exists a need to develop a fluid-excavating apparatus and technique whereby careful excavation may be effected in a relatively small area, with little spread of debris or creation of dangerous working conditions.
It is a further object of the invention to provide an apparatus and technique whereby areas may not only be quickly excavated, but may also be quickly refilled with a minimum spread of debris.
It is a further object of the invention to provide an apparatus and technique for excavating which may utilize different excavating fluids, e.g., water or air, alone or in combination, as appropriate for different soil conditions.
It is yet another object and advantage of the present invention to obtain the above-referenced objects and advantages utilizing existing vacuuming/cleaning trucks, by adapting such vehicles for use in conjunction with the present invention.
A soil excavating apparatus is disclosed for use in combination with a cleaning/vacuuming machine having at least one high pressure fluid supply in the vacuum line. The apparatus includes a spray head secured to the vacuum line first end, and disposed substantially thereabout. The spray head is in fluid communication with the pressurized fluid supply. A plurality of inboard spray nozzles are disposed substantially thereabout. The spray head is in fluid communication with the pressurized fluid supply. A plurality of inboard spray nozzles are removably secured to the spray head and extend therefrom. The spray nozzles are angularly oriented to direct the pressurized fluid towards a center line of the vacuum line.
The fluid supply may be a pressurized water supply, e.g., at 2,000 to 2,500 psi, or a pressurized air supply, at 100 psi. In practice, water and/or air may be utilized as the excavating fluid in accordance with the particular soil conditions and pressurized supplies.
The inboard nozzles are preferably oriented to define non-intersection fluid paths to maximizing boring efficiency of the fluid.
The spray nozzles are preferably oriented at an angle of approximately 22xc2x0 in relation to the vacuum center line. The orientation of the spray nozzles, size of spray nozzle apertures, pressure and flow rates are selected to facilitate breaking up and movement of the soil proximate towards the vacuum line whereupon the soil and fluid are drawn into the vacuum line and transported to the truck.
A plurality of outboard nozzles may also be provided on the spray head, oriented at an angle away from the vacuum center line. The outboard nozzles are operative to excavate an area exterior to the spray head, to widen the area of excavation.


A bean bag toss game is disclosed wherein the pieces of the game are assembled by means of grooves cut into the various sections of the game, allowing the sections of the game device to be secured without screws or collapsible legs. Such an arrangement makes the game sturdier, allows for easy assembly, disassembly, and storage, and allows the game to withstand the impact of small children jumping on the board, thereby reducing the possibility of injuries.

1. Field of the Invention
The present invention discloses a bean bag toss game.
2. Description of the Prior Art
Over the years, there have been a number of developments for the improvement of the bean bag toss game.
U.S. Pat. No. 4,943,065 (DeLapa) discloses a target structure for a bean bag tossing game which has a target surface member having a smooth surface texture and a flexibility or spring action such that when a bean bag strikes the surfaces, it may either slide or bounce depending upon the angle of incidence of the striking bag. The structure is supported off of the ground plane by substantially vertical support members which set the target surface member at an angle with respect to the ground plane. The target surface member and the supporting members are from a single plastic sheet and the support-members are hinged from the target surface member via a living hinge connection formed in the plastic. The front and rear support members are connected along vertical edges to the side support members by hook and loop fastening material affixed to mating edges of adjacent support members. The game may be made of plastic.
U.S. Pat. No. 4,961,586 (Conville) discloses a bag tossing game comprising first and second target assemblies adapted to either be coupled to one another to dispose the tossing game in a transportable mode or to be separated and detached from one another to dispose the game in a playing mode, with each of the assemblies having a resilient playing board comprising an aperture penetrable by said projectiles, leg means projecting away from the board, and socket means defined in each playing board for mating with and receiving leg means emanating from the other playing board when the boards are fitted together, and elevator tray means associated with each playing board adapted to be selectively coupled thereto.
U.S. Design Patent No. 340,082 (DeLapa) discloses an ornamental beanbag tossing game target having a hinged leg structure to support the top portion of the game.
U.S. Pat. No. 5,332,230 (Benedict) discloses a bag toss game apparatus comprising a foldable target structure which includes first, second and third game plates or sides, each having distinctive geometrical configurations arranged for opening an securement in a triangular configuration, wherein a central opening includes a central opening periphery fastener structure about the central opening through each game plate, with the plates being hinged to each other to fold and mount the game for use during play.
U.S. Pat. No. 5,165,695 (Yoder) discloses a transportable bag tossing game. Each target structure is comprised of a single injection molded part having a first wall disposed relatively perpendicular to the supporting plane and an angled second wall having an aperture located along the central longitudinal axis of the target structure.
U.S. Pat. No. 5,056,796 (Conville) discloses a self contained bag tossing game. Each target assembly comprises a resilient, generally rectangular plastic playing board which includes a target aperture. Each target board is inclined for play by two elevator trays which are pivotally coupled to each board. For storage, each elevator tray can be folded into position on the underside of the target board.
Each of the above described inventions have drawbacks. Those toss games that are comprised of a one piece solid structure are difficult to store. Other toss games which have either a hinged elevator tray or feet, or which are screwed together, have a danger of collapsing when small or medium sized children stand or jump on the playing board, as children are prone to do. Consequently, it is helpful to have a toss game which is of the safest possible design.


The improved split resistant tubular heat transfer member of the present invention is directed to an elongated tube having a substantially circular transverse cross-section. The elongated tube hereof has an outer surface and an inner surface, and further has an outer diameter, a defined wall thickness, and an inner diameter. The tube inner surface has disposed therein a plurality of spiral grooves, defining and separating a corresponding plurality of spirally disposed fins extending from the inner diameter of the tube. The respective spirally disposed fins have an inverted substantially V-shape and have further an apex angle of approximately 28.degree.. In some such preferred embodiments the spiral grooves have a ratio of the cross-sectional area thereof to the depth thereof of approximately 0.01475 inches.

The present invention relates to heat exchangers in general and more particularly to an improved split resistant tubular heat transfer member through which refrigerant liquid flows and functions to evaporate or to condense, thereby respectively to accept heat from and to provide heat to a coolant fluid which is disposed in contact with the exterior of the tubular member. Yet further, the present invention is directed to a particularized structure for a tubular heat transfer member which provides resistance to splitting during the manufacture thereof, and does so while retaining its beneficial heat exchange characteristics.
The improved split resistant tubular heat transfer member of the present invention is of the variety used in refrigeration and air conditioning systems utilizing an evaporator and condenser. Generally, the evaporator and condenser are comprised of a plurality of parallel tubes connected at the end to form a refrigerant circuit or circuits. A plurality of fins are connected in heat exchange relationship to the tubes and extend transversely of the tubes. In use, refrigerant is condensed in the condenser and evaporated in the evaporator. Liquid or air is passed over the condenser to condense the refrigerant fluid therein. Air passed over the evaporator is cooled. Cooled air from the evaporator may be used to cool the interior of a space, e.g. room to be cooled.
In the above generalized procedure of refrigerating or air conditioning, the physical characteristics of the heat exchange tube determines the heat transfer efficiency. One certain type of heat transfer tubes which have found acceptance in the prior art utilize a multiplicity of rib-like projections, or "fins", disposed on the interior surface of the tube. In such heat transfer apparatus, a thin film layer of refrigerant liquid is maintained in contact with the interior surface of the tube, and in particular is disposed on the surface of the fins and the grooves therebetween. If the tube used in an evaporator application, this thin film layer is the subjected to evaporation. The multiplicity of rib-like fins increases the surface area available for evaporation and accordingly increases the efficiency of such evaporation. In some prior art ribbed tubing structures, the ribs are disposed in a spiral or helical disposition to cause a controlled degree of turbulence in the refrigerant liquid, which diminishes laminar flow and also serves to break up any insulating barrier layer of vapor from forming on the interior surfaces of the tube.
Several prior art patents have made proposals for improvement of interior rib-containing tubular heat transfer members. Those prior art patents include:
U.S. Pat. No. 4,044,797--Fujie PA1 U.S. Pat. No. 4,480,684--Onishi PA1 U.S. Pat. No. 4,545,428--Onishi PA1 U.S. Pat. No. 4,658,892--Shinohara PA1 U.S. Pat. No. 4,938,282--Zohler PA1 U.S. Pat. No. 4,921,042--Zohler PA1 U.S. Pat. No. 4,118,944--Lord, et al.
These and other various tubular members of the prior art, including several different forms of interiorly disposed rib structures have increased somewhat the efficiency of refrigerant operation. However, such tubing has in several particulars been difficult or inefficient of manufacture, and has likewise resulted in a tendency to split the tube during manufacture.
Rifle tube is used in the manufacture of heat transfer devices called "coils". The coils are constructed by placing tubes (aluminum or copper) through holes stamped into thin sheets of aluminum or copper. For assembly purposes the tube must be smaller than the holes in the sheets, but for heat transfer purposes the tube must be in intimate contact with the sheets. To achieve the intimate contact, a ball is forced through the tube after it is inserted into the sheets. The ball causes the OD of the tube to "expand" into intimate contact with the sheets. This is called the "expansion process".
On smooth tube, the expansion process works well and causes few problems. However, with rifle tube the stress caused by the expansion process is increased in the thin part of the tube wall, causing the tube to split if there is even a minimal defect in the tube. It has been found by the applicants herein that, by increasing the amount of wall available (bottom wall to fin wall ratio) to accommodate the required expansion, the likelihood of the tube splitting can be reduced.
In view of the above difficulties, defects and deficiencies of prior art structures, it is a material object of the improved tubular heat transfer member of the present invention to provide a novel structure having increased resistance to splitting during the manufacture thereof, while at the same time retaining the beneficial heat transfer characteristics of interiorly ribbed tubular heat transfer members.
In addition, the improved split resistant tubular heat transfer member of the present invention has the further beneficial characteristic wherein the fins thereof hold their shape better during the expansion process, thus permitting the structure to retain a larger degree of its beneficial heat transfer characteristics after the expansion process than prior art tubing has been able to accomplish heretofore.
It is a further object of the present invention to provide a versatile and novel tubular structure which may be utilized for evaporation and for condensation functions. These and other objects and advantages of the improved split resistant tubular heat transfer member of the present invention will become known by those skilled in the art upon a review of the following summary of the invention, brief description of the drawing, detailed description of preferred embodiments, appended claims and accompanying drawing.

Split resistant tubular heat transfer member


A test apparatus for testing an electronic device provided with a field effect transistor, which operates in response to a given test pattern, is provided, wherein the test apparatus includes a power supply for providing electric power which drives the electronic device, a pattern generating unit for generating a plurality of test patterns sequentially and providing the electronic device with the test patterns, a leak current detecting unit for detecting a leak current of the field effect transistor, a voltage control unit for controlling a substrate voltage applied to a substrate on which the field effect transistor is provided, in order to maintain the leak current detected by the leak current detecting unit at a predetermined value, and a power supply current measuring unit for measuring a power supply current input to the electronic device at every time when each of the test patterns is applied and deciding acceptability of the electronic device on the basis of the measured power supply currents.

1. Field of the Invention
The present invention relates to a test apparatus and a test method for testing an electronic device in which a field effect transistor is provided, an electronic device in which a field effect transistor operating in response to a given test pattern is provided and a method for manufacturing the device. More particularly, the present invention relates to a test apparatus and a test method for reducing influence of the change of a leak current in the field effect transistor during the test.
2. Description of the Related Art
Conventionally, as a method for testing an electronic device such as semiconductor circuit, a method for measuring a power supply current supplied for the electronic device and detecting an abnormal value of the power supply current has been known. For example, a variety of test patterns are applied to the electronic device, the power supply current is detected in various operating states and the acceptability of the electronic device is decided on the basis of whether the power supply current is within a predetermined range or not.
Since related patent documents have not been found up to the present, the description regarding the documents is omitted.
However, the leak current in the electronic device has been increased due to miniaturization of the electronic device or increase of the number of CMOS included in the electronic device. The leak current changes according to differences among the electronic devices or the change of the temperature. Particularly, for the CMOS, the so-called sub-threshold leak current has high temperature dependence and it is difficult to stabilize the sub-threshold leak current. For this reason, the power supply current supplied to the electronic device changes according to the change of the leak current and the conventional power supply current test has a problem of deciding that an electronic device which has no defect is defective.
Further, regarding the above problem, the method for providing the electronic device with a temperature sensor and a heater and controlling the temperature of the electronic device to be constant has been known. However, this kind of control cannot perform a precise control and make the change of the leak current sufficiently small.

Test apparatus, test method, electronic device, and electronic device manufacturing method


A shaving apparatus includes a razor blade, a reservoir for containing a non-solid shaving aid material, at least one conduit extending between the reservoir and one or more ports, and a pump in fluid communication with one or both of the reservoir and the conduit. Movement of the razor blade actuates the pump, and the pump transfers shaving aid material from the reservoir to the one or more ports.

1. Technical Field
The present invention relates to shaving apparatuses in general, and, more particularly, to shaving apparatuses having mechanisms for providing flowable shaving aid materials.
2. Background Information
The process of removing hair from a dermal surface typically includes the application of a shaving aid material (e.g., shaving cream) to the surface and the separate step of shaving the hair using a razor assembly. The shaving aid material oftentimes includes at least one suitable agent (e.g., a lubricating agent, a drag-reducing agent, a depilatory agent, etc.) that enhances the shaving process. The razor assembly is generally a safety razor having a disposable razor cartridge having at least one razor blade.
Numerous attempts have been made to combine razor assemblies and mechanisms for dispensing shaving aid materials into unitary shaving apparatuses. Typically, a shaving apparatus that is a combination of a razor assembly and a dispensing mechanism will include a reservoir containing the shaving aid material and one or more passages connecting the reservoir to a point of discharge. The shaving aid material is deposited on the surface being shaved at the point at which the shaving aid material is discharged from the passage(s).
A conventional mechanism for dispensing the shaving aid material from the reservoir includes a source of pressurized gas. Pressurized mechanisms, however, are often costly to manufacture and necessitate additional replacement items. Mechanical systems for powering shaving aid material from the reservoir are also available. They typically require the user to provide some type of actuation in addition to the normal shaving stroke. Hence, the ease of shaving is negatively affected. What is needed, therefore, is a shaving apparatus that dispenses shaving aid material without the aforesaid disadvantages of the prior art.


Disclosed are methods, apparatus, and systems of biometric identification and authentication. In one embodiment, a method to authenticate a user at an automated teller machine is disclosed. In this embodiment, the method comprises: retrieving, by a processor of the automated teller machine, a numeric identification data inputted by the user; comparing, by the processor or by a processor of a remote sever, the numeric identification data against a stored set of numeric identification data in a user database stored in a memory communicatively coupled to the automated teller machine; and narrowing, by the processor or by the processor of the remote server, a user population to a first narrowed set of the user population based on the comparison of the numeric identification data against the stored set of numeric identification data. Multiple biometric identification techniques may then be used to authenticate the user at the automated teller machine.

An automated teller machine (ATM) is an apparatus used for performing a financial transaction (e.g., deposit, withdrawal, account balance check, etc.). Today's ATMs often require a user to insert a bank issued ATM card to identify and authenticate the user prior to granting the user access to the user's financial account(s). However, such an ATM card may become lost or stolen or the information on the ATM card may be compromised by identity thieves. While banks have attempted to reduce the likelihood of identity theft by requiring users to input a user-generated identification code (such as a pin code), such codes may also be compromised using keystroke logging technologies.
In addition, the user may simply forget the ATM card at home but may still desire to perform a financial transaction at an ATM. In such a situation, the user may be inconvenienced from having to return home to retrieve the ATM card or may be discouraged from performing the financial transaction completely.

Biometric identification and authentication system


The present invention relates to new water-soluble polyaspartic esters and also to their use in aqueous coating compositions.

Two-component coating compositions comprising a polyisocyanate component binder in combination with a reactive component that is reactive toward isocyanate groups, in particular a polyhydroxyl component, have long been known. They are suitable for producing high-grade coatings, which can be made hard, elastic, abrasion-resistant and solvent-resistant.
In view of the fact that primary amines undergo a spontaneous and rapidly uncontrollable reaction with polyisocyanates they are unsuitable as reaction partners for polyisocyanates in two-component coatings.
EP-A 0 403 921 describes low-viscosity polyaspartic esters which contain secondary amino groups and whose reactivity towards NCO groups is therefore moderate as compared with primary amines. Polyaspartic esters of this kind are particularly suitable for preparing low-solvent or solvent-free coating compositions which exhibit rapid curing.
Polyaspartic esters of this kind are, however, not water-soluble or water-dispersible, and so are not suitable for use in aqueous binders.
In view of the evermore stringent legislation governing permitted levels of volatile organic components in, for example, coating compositions, there is increasing demand for aqueous systems. Aqueous two-component coating compositions have been known for years and are described for example in EP-A 0 358 979.
EP-B 0 818 492 describes aqueous secondary polyamines which are obtained by Michael Addition of polyamines with oligoesters containing maleic ester units. A disadvantage of such products is that reaction of the polyisocyanate may be followed by the formation of hydantoin, as a result of which the oligoester chains are cleaved. This in turn leads to a loss of mechanical properties on the part of the coating.
EP-A 0 849 301 describes aqueous binder mixtures based on polyaspartic esters and aqueous polyisocyanates. A disadvantage, however, is that these polyaspartic esters are not water-dispersible or water-soluble, and so cannot be provided in the form of storage-stable aqueous formulations. The coatings must therefore be produced by adding the aqueous polyisocyanate to the hydrophobic polyaspartic ester, then mixing the system with water and applying it immediately.
For reasons of improved processing, however, it would be desirable to be able to use water-soluble or water-dispersible aspartates or aqueous formulations thereof in such systems.


The accuracy and flexibility of a branch circuit monitor is improved by storing specifications, including error correction factors, for a plurality of current transformers in the monitor's memory and enabling current transformers with stored specifications to be selected for use with the monitor.

The present invention relates a current monitoring system and, more particularly, to a user configurable branch circuit monitor with a memory for storing transducer characteristics.
The total power consumption of a building or other facility is typically monitored by the electric utility with a power meter located between the utility's distribution transformer and the facility's power distribution panel. However, in many instances it is desirable to sub-meter or attribute the facility's power usage and cost to different occupancies, buildings, departments, or cost centers within the facility or to monitor the power consumption of individual loads or groups of loads, such as motors, lighting, heating units, cooling units, etc. These single phase or multi-phase electrical loads are typically connected to one or more of the branch circuits that extend from the facility's power distribution panel. While a power meter may be installed at any location between a load and the distribution panel, typically a power meter capable of monitoring a plurality of circuits is installed proximate the power distribution panel to provide centralized monitoring of the various loads powered from the panel.
Flexibility has favored adoption of digital current and power meters, known as branch circuit monitors, incorporating data processing systems that can monitor a plurality of circuits and determine a number of parameters related to electricity consumption. A digital power meter for measuring electricity consumption by respective branch circuits comprises a plurality of voltage and current transducers that are periodically read by the meter's data processing unit which, in a typical digital power meter, comprises one or more microprocessors or digital signal processors (DSP). The data processing unit periodically reads and stores the outputs of the transducers sensing the magnitudes of the current and voltage and, using this sample data, calculates the current, voltage, power, and other electrical parameters, such as active power, apparent power and reactive power that quantify electricity distribution and consumption. The calculated parameters are typically output to a display for immediate viewing and/or transmitted from the meter's communications interface to another data processing system, such as a building management computer for remote display or further processing, for example formulating instructions to automated building equipment.
While the voltage transducer(s) of a digital power meter can be interconnected anywhere in the wiring that connects the supply and a load, including at the load's terminals, interconnection of voltage transducers and the facility's wiring is facilitated by wiring connections in the power distribution panel. The power distribution panel provides a convenient location for connecting the voltage transducers because typically each phase of the power is conducted by a separate bus bar in the power distribution panel and the voltage and phase is the same for all loads attached to the respective bus bar. The voltage transducers of digital power meters commonly comprise a voltage divider network that is connected to a conductor in which the voltage will be measured.
The current transducers of digital power meters typically comprise current transformers that encircle the respective power cables that interconnect each circuit to the bus bar(s) of the distribution panel. To measure the power consumed by the plurality of loads making up a facility, a current transformer must be installed in each branch circuit connecting the load(s) to the distribution panel. A current transformer typically comprises multiple turns of wire wrapped around the cross-section of a toroidal core. The power cable, conducting the load current, is passed through the aperture in the center of the toroidal core and constitutes the primary winding of the transformer and the wire wrapped around the cross-section of the core comprises the secondary winding of the transformer. Current flowing in the primary winding (primary current) induces a secondary voltage and current in the secondary winding which is quantitatively related to the current in the primary winding. The secondary winding is typically connected to a resistor network and the magnitude of the primary current can be determined from the amplitude of the voltage at the output of the resistor network.
Accurate measurement of electric power also requires compensation for error introduced by the transducers comprising the power meter. For example, the secondary current of a current transformer is ideally equal to the load current flowing in the power cable (the primary winding) divided by the number of turns in the secondary winding. However, magnetization of the core of the transformer produces ratio and phase errors which vary with the magnitude of the current being measured and the configuration of the particular transformer, including factors such as core material and turns ratio. Typically, a power meter is configured for use with a particular transducer and error compensation factors, ascertained by experimentation with sample transducers, are built into the meter and applied by the data processing unit during calculation of the meter's output.
However, a user may desire to use a different transducer than that specified for use with a particular meter or several different transducers may be required because of a wide variation in the magnitude of the current in the various branch circuits or it may be necessary to replace one or more transducers during use. Using transducers that are not matched to the meter results in inaccurate readings from the meter. What is desired, therefore, is a branch circuit monitor providing flexible construction, simplified installation and improved serviceability.


An assembly structure of flexible board and rigid board includes a rigid board, a sub-board and a flexible board. The rigid board defines a locking gap having two side surfaces projecting toward each other to form two resisting portions. The sub-board has a standing portion inserted in the locking gap. Bilateral sides of the standing portion extend outward to form two preventing arms against a bottom surface of the rigid board. The flexible board has a base portion inserted in the locking gap of the rigid board. The base portion has a front surface and a back surface located to a front surface of the sub-board. The front surface of the base portion is against the resisting portions.

1. Field of the Invention
The present invention relates to an assembly structure of flexible board and rigid board, and more particularly to an integration structure by FPC (flexible printed circuit) and PCB (printed circuit board) to firmly accommodate an electronic element, such as a push button.
2. The Related Art
As well known that a FPC has many properties that differ from a PCB, wherein the main difference is that the FPC is of flexibility, and so the FPC is foldable and disposed at will according to a space defined in a product. Therefore, the FPC is widely used in varieties of fields like an electronic product field, a vehicle field and so on, although the FPC is more expensive than the PCB. In recent years the FPC has been made lighter and thinner accompanying the trend toward lighter and thinner electronic products, such as digital cameras, mobile phones, and notebook computers.
Conventionally, the FPC is attached to the PCB through a method of SMT (surface mounted technology) or via a connector. Sometimes, the FPC is glued with the PCB though the method of SMT. Even so, the FPC is not attached to the PCB tightly, which influences the electrical transmission between the FPC and the PCB. Further more, the FPC conventionally connects with electronic equipment, that is, after finishing assembling the FPC and the PCB, particular tools for assembling shall be taken away, and then, the electronic equipment is mounted on the FPC. Therefore, the working processes are complex, reducing work efficiency.

Assembly structure of flexible board and rigid board


Parking a vehicle at a location where parking is possible even when an obstacle is falsely detected. In a parking assistance device 1, an external environment recognition unit 11 recognizes road surface environment around an own vehicle on the basis of information detected by an external environment sensor 4 installed in the own vehicle. The display control unit 17 performs screen display using the HMI device 2 to present, to an occupant of the own vehicle, road surface information indicating the presence of an obstacle on the road surface around the own vehicle on the basis of the road surface environment recognized by the external environment recognition unit 11. The road surface information correction unit 16 corrects the road surface information and invalidates the obstacle. The parking route calculation unit 14 calculates a parking route for parking the own vehicle on the basis of the road surface information corrected by the road surface information correction unit 16.

There is conventionally known a parking assistance device that assists a vehicle to move to an appropriate parking position while avoiding an obstacle at the time of parking the vehicle. Patent Literature 1 discloses a parking assistance device including: an external detection sensor input processing unit that generates surrounding information on the basis of sensor input from an external detection sensor that detects the outside of a vehicle; a parking position setting unit that sets a parking position; a virtual obstacle generation unit that generates virtual information on the basis of the parking position set by the parking position setting unit; and a parking route generation unit that generates a parking route from the current position of the vehicle to the parking position on the basis of the surrounding information and the virtual obstacle information.


An artificial limb provides for positional relation between a first pin for rotatably connecting one end of an air cylinder device to a lower member and a second pin for rotatably connecting the other end of the air cylinder device to an upper member. The attaching position of the second pin is set to satisfy certain predetermined conditions when an artificial limb is in a completely extended state. The position of an air cylinder device (particularly, the attaching position of the second pin) is changed in conformity with a walking speed which is variable in phase such as normal walking, quick walking, and running with small steps. The artificial limb further comprises a pin position change capable of changing the position of a second pin rotatably connected to an upper member in conformity with variation of walking speed. A first example of the pin position change includes a plurality of attachment holes formed on the knee plate of the upper member and the position of the second pin is changed by attaching the second pin selectively to one of the attachment holes. If it is designed such that an elongate hole is formed along a circular arc so that the attaching position to the elongate hole can be changed, the position of the second pin can be changed steplessly or successively.

This invention relates to a prosthetic limb utilizing an air cylinder device for assisting a bending and extending action of the knee, and more particularly to a technology capable of enlarging an effective stroke of an air cylinder device and effective in making a prosthetic limb small in size or in obtaining a motion in conformity with a walking speed of the user.
In general, artificial limbs accompanying with a bending and extending action of the knee comprises an upper member including a knee plate to which a load or weight of the user (amputee) applies, a lower member connected to the upper member at the knee portion, a knee axis rotatably connecting the upper and lower members together, and in addition, an auxiliary means for assisting a bending and extending action of the knee. One typical example of this type of prosthetic leg is an above-knee prosthesis which includes a socket supported on an upper end of the knee plate of the upper member and adapted to receive the stump therein, and a foot member supported on a lower end of the lower member.
A hydraulic cylinder device or an air cylinder device is used as the auxiliary means for assisting a bending and extending action of the knee. U.S. Pat. No. 2,859,451 discloses a prosthetic leg utilizing a hydraulic cylinder device, and U.S. Pat. No. 5,405,407 discloses a prosthetic leg utilizing an air cylinder device. The hydraulic cylinder device and the air cylinder device are different in fluid to be used but the same in function for assisting a bending and extending action of the knee, thereby giving a walking style resembling a natural walk to the prosthetic leg.
Comparing the hydraulic cylinder device with the air cylinder device both as an auxiliary means, an oil as a working fluid of the hydraulic cylinder device has almost no compressive properties. In contrast, an air as a working fluid of the air cylinder device has compressive properties. Therefore, according to the air cylinder device, a repulsive force can be obtained by a compressed energy generated by compressing the air after the knee is bent maximum. In order to effectively utilize such features of the air cylinder device, it is necessary to enlarge an effective stroke of the cylinder. However, any attempt to enlarge an effective stroke of the cylinder is encountered with a difficulty in which the attempt tends to enlarge the size of the prosthetic leg. For this reason, not many specific proposals were made until today for enlarging the effective stroke of the air cylinder device in this type of a prosthetic leg. For example, specific proposals are seen in the above-discussed US patents which teach that if a rod end side of the cylinder device is connected to the upper member through a pin, an available space around the knee will be increased. Also, Japanese Laid-Open Patent Application No. 551/1997 teaches an improvement of U.S. Pat. No. 5,405,407. What is illustrated in the drawings of this laid-open application is only such a very general knowledge that a connecting position of a pin on the rod end side is located backwardly of the knee axis. FIG. 2 of U.S. Pat. No. 2,859,451 and FIG. 4 of Japanese Laid-Open Patent Application No. 551/1997 show a connecting position of a pin on the rod end side which position is located backward and slightly upward of the knee axis. However, they merely show the connecting position of the pin in the drawings and none of them particularly specifies the connecting position. In addition, none of them teaches the technical significance of the connecting position of the pin.

Artificial limb including air cylinder device


A semiconductor device manufacturing method includes the steps of: forming first and second insulation films on a substrate provided with a first wiring; sequentially forming first to third mask layers on the second insulation film; forming a wiring groove pattern in the third mask layer; selectively processing the third mask layer, formed to project into the inside of the wiring groove pattern, into a tapered shape; forming a contact hole pattern in the second and first mask layer, and removing the tapered shape portions of the third mask layer; and forming wiring grooves in the second insulation film by etching using the third mask layer, and forming contact holes in the insulation film by etching using the second and first mask layers.

The present invention relates to a semiconductor device manufacturing method by which it is possible to secure voltage resistance between conduction layers used for wiring, to miniaturize the wiring and to facilitate higher integration.
Attendant on miniaturization and higher integration of semiconductor devices, the delay of electrical signals due to the time constant of wiring becomes a serious problem. Therefore, for conduction layers used in a multi-layer wiring step, copper (Cu) wirings have come to be introduced in place of wirings formed by using aluminum (Al) based alloys. Unlike the metallic materials that have been used in the conventional multi-layer wiring structures such as aluminum, copper is difficult to pattern by dry etching. Therefore, there has been generally used the so-called groove wiring technology (for example, the Damascene process) in which wiring grooves are preliminarily formed between layers and then the grooves are filled with copper to form a wiring pattern. Particularly, the method in which contact holes and wiring grooves are preliminarily formed and then the contact holes and the wiring grooves are simultaneously filled with copper (for example, the dual Damascene process) is effective for reducing the number of steps (see, for example, Japanese Patent Laid-open No. Hei 11-045887).
In addition, since an increase in the wiring capacitance leads to a lowering in the speed of the device, fine multi-layer wiring by use of a low-dielectric-constant film as an inter-layer insulation film is indispensable. Examples of the material for the low-dielectric-constant inter-layer insulation film include not only fluorine-containing silicon oxide (FSG) having a dielectric constant of about 3.5 and having hitherto given comparatively good results but also low-dielectric-constant films having a dielectric constant of about 2.7. Examples of the low-dielectric constant films are organic silicon based polymers represented by polyaryl ethers (PAE) and inorganic materials represented by hydrogensilsesquioxane (HSQ) and methylsilsesquioxane (MSQ). In recent years, even introduction of materials provided with a dielectric constant of about 2.2 by making these exemplar materials porous has been tried.
The dual Damascene process, when applied to the low-dielectric-constant inter-layer insulation film, must be a process that can overcome the following technical restrictions.
First, since the composition of the low-dielectric-constant film is close to the composition of the resist used for patterning, the low-dielectric-constant film is liable to be damaged at the time of the resist removing process. Specifically, it is indispensable that the resist peeling treatment after etching is conducted by use of a resist mask, and the resist regenerating treatment in the case where a treated resist pattern does not fulfill the product specifications can be performed without damaging the low-dielectric-constant film.
Next, a problem exists in connection with the application to the so-called borderless structure in which the wiring and the contact holes do not have registration allowances. Attendant on the miniaturization of semiconductor devices, a processing process capable of coping with the borderless structure is a major premise, at least in the multi-layer wirings of 0.18 μm generation and the latter generations. Therefore, even in the case where simultaneous formation of wiring grooves and contact holes by the dual Damascene process is applied to the inter-layer insulation films including the low-dielectric-constant film, a process accompanied by little variations in the via resistance due to misregistration is indispensable.
Additionally, though an etching blocking film must be present near the bottom portions of wiring grooves in order to form the wiring grooves with good depth controllability, insertion of an etching blocking film with a comparatively high dielectric constant as an inter mediate layer leads to an increase in the inter-layer capacitance. Therefore, there is a demand for a dual Damascene process for a low-dielectric-constant film, inter-layer structure with which the increase in capacitance can be suppressed while controlling the formation of wiring grooves.
Dual Damascene processes completed while paying attention to the above-mentioned technical restrictions have been disclosed (see, for example, Japanese Patent Laid-open Nos. 2000-150519 and 2001-44189). In addition, the present inventor et al have devised a dual Damascene process for a low-dielectric-constant film inter-layer structure including an organic film using a three-layer hard mask, as a dual Damascene process for a low-dielectric-constant film inter-layer structure capable of coping with high-performance devices of the 90 nm generation and the latter generations (see, for example, R. Kanamura et al, "Integration of Cu/low-k Dual-Damascene Interconnects with a Porous PAE/SiOC Hybrid Structure for 65 nm-node High Performance eDRAM", 2003 Symposium on VSI Technology Digest of Technical Papers, pp. 107-108 (2003)).
Now, the problems involved in the case of applying the dual Damascene process to the design rules for fine wiring pitches of the 65 nm generation or the 45 nm generation will be described below, referring to FIGS. 6A to 6H.
As shown in FIG. 6A, on an under insulation film 611 formed on a substrate (not shown), a lower layer wiring 614 of a copper (Cu) film buried wiring structure in which a laminate film composed of an organic film 612 and a silicon oxide (SiO2) film 613, for example, is used as an inter-layer insulation film is formed.
On the silicon oxide film 613, for example, a silicon carbide (SiC) film is formed as an oxidation preventive layer 615 for the Cu film covering the lower layer wiring 614, and a carbon-containing silicon oxide (SiOC) film 616 is formed on the oxidation preventive layer 615. Further, a polyaryl ether (PAE) film, for example, is formed as an organic film 617. Subsequently, a silicon oxide (SiO2) film as a first mask layer 618, a silicon nitride (SiN) film as a second mask layer 619, and a silicon oxide (SiO2) film as a third mask layer 620 are sequentially formed in a laminated form, and a resist pattern 621 for forming wiring grooves is formed on the third mask layer 620.
Next, as shown in FIG. 6B, the resist pattern 621 [see FIG. 6A] is used as an etching mask, and a wiring groove pattern 622 in the third mask layer 620 is formed by a dry etching method. Then, the resist pattern 621 is removed through appropriate after-treatments. Next, a resist pattern 623 for formation of a contact hole pattern is formed. The resist pattern 623 is so formed as to overlap, at least partly, the wiring groove pattern 622. The resist pattern 623 is formed to be aligned relative to the lower layer wiring 614 or the wiring groove pattern 622; in this case, a region 624 of the so-called borderless structure in relation to the wiring groove pattern 622 is generated due to misregistrations which can be generated on a lithography process basis or dispersions of the dimensions of the layers.
Subsequently, as shown in FIG. 6C, the resist pattern 623 [see FIG. 6B] is used as an etching mask, and contact holes 625 are formed in the third mask layer 620 and the second mask layer 619 and the first mask layer 618 by a dry etching method, and then the contact holes 625 are extended to the PAE film 617. Here, the resist pattern 623 can be removed simultaneously with the etching treatment of the PAE film 617. Additionally, the resist pattern 623 gradually recedes during the opening of the contact holes 625 in the PAE film 617, and it is possible to obtain a good opening shape due to the presence of the second mask 6layer 619 composed of silicon nitride.
Next, as shown in FIG. 6D, the third mask layer 620 provided with the wiring groove pattern 622 is used, and the wiring groove pattern 622 is extendedly formed in the second mask layer 619 by a dry etching method. In addition, in the etching step of the second mask layer 619 using the third mask layer 620, the SiOC film 616 exposed at bottom portions of the contact holes can be opened to an intermediate extent. Since the etching selectivity ratio (SiN/SiOC) relative to the SiOC film under the above-mentioned etching conditions can be set to be slightly less than 1, in the case of etching the second mask layer 619 of silicon nitride having a thickness of 50 nm, the contact holes 625 are extendedly formed in the SiOC film 616 in the manner of including a required over-etching amount, and are opened to a depth of about 80 nm.
Subsequently, as shown in FIG. 6E, the contact holes 625 are formed in the SiOC film 616 remaining between the contact hole layers. Here, the first mask layer 618 remaining in the wiring groove regions is simultaneously removed by use of the second mask layer 619 provided with the wiring groove pattern, whereby wiring grooves 629 are formed. In this instance, as shown in FIG. 6F, in the region where the contact holes 625 and the upper layer wiring grooves 629 are in a borderless structure and where the adjacent wiring grooves 629 are arranged in a minimum space, the inter-wiring space is locally narrowed. This corresponds to the PAE film 617 between the wiring groove 629 (on the left side in the figure) and the wiring groove 629 (on the right side in the figure).
Thereafter, the PAE film 617 remaining at bottom portions of the wiring grooves 629 is etched to extendingly form the wiring grooves 629, and the SiC film 615 present at bottom portions of the contact holes 625 extendedly formed is etched, whereby the contact holes 625 are further extended. Thus, a predetermined dual Damascene processing is completed. Then, the narrow space region generated due to misregisterations in the contact hole patterning and dispersions of the dimensions may be narrowed, but not widened, due to an increase of shoulder etch. Incidentally, the second mask layer 619 remaining outside the wiring groove regions is removed in the process of etching the SiC film 615 present at bottom portions of the contact holes 625.
Thereafter, etching debris remaining on side walls of the wiring grooves 629 and the contact holes 625 and the denatured copper layer at bottom portions of the contact holes 625 are cleaned by an after-treatment using an appropriate chemical liquid and a hydrogen annealing treatment. Then, as shown in FIG. 6G, a Ta film as a barrier metal layer 632 is formed, for example, by a sputtering method, and a copper (Cu) film 633 is built up by an electroplating method or a sputtering method, whereby the wiring grooves 629 and the contact holes 625 are filled with a conduction film.
Further, the portions unnecessary as wiring pattern, of the barrier metal layer 632 and the copper film 633 are removed by a chemical mechanical polishing (CMP) method. As a result, as shown in FIG. 6H, upper layer wirings 634 composed of the copper film 633 are formed, and a multi-layer wiring structure of a dual Damascene structure is obtained. In addition, like the lower layer wirings 614, an SiC film 635, for example, as an oxidation preventive layer is formed on the dual Damascene wirings 634. However, at the narrow space portions generated due to misregistrations in the patterning of the contact holes 625 or dispersions of the dimensions, regions 636 of unsatisfactory isolation between the wirings (for example, between the upper layer wiring 634 (on the left side in the figures) and the upper layer wiring 634 (on the right side in the figures)) are formed.
It has been confirmed that the multi-layer wiring produced by the dual Damascene process as above shows a lowering in the yield due to short-circuit defects between the wiring and the adjacent different-potential wiring, since the regions 636 of unsatisfactory isolation between the wirings are generated locally. It has also been found that even in the case where the different-potential wirings are isolated in the range of operation of the semiconductor device, initial defects due to insufficient dielectric strength and abrasion troubles may sometimes be generated in the case of an isolation width of 25 nm or below and in use conditions thereafter.

Semiconductor device manufacturing method that includes forming a wiring pattern with a mask layer that has a tapered shape


A portable, double-bulb halogen work light/floodlight (11) is disclosed. The portable, double-bulb halogen work light/floodlight includes an open-sided housing (17). Mounted in the housing is an undulating reflector (19) that includes at least two valleys in which halogen bulbs (21 and 23) are mounted. The open side of the housing is enclosed by a glass plate (25). Located on the outer face of the glass plate (25) is a grill (29). The base (15) includes a U-shaped base bracket (91) in which the housing (71) is mounted. Lock knobs (95) are used to lock the elevational position of the portable, double-bulb halogen work light/floodlight. Extending outwardly and downwardly from the cross-member (98) of the U-shaped bracket (91) are a plurality of feet (97). Affixed to the top of the housing (17) is a handle (81) surrounded by an insulating sleeve (83).

In recent years, a variety of types of high- and low-profile halogen work lights have been developed. High-profile halogen work lights include halogen lamps mounted on tripods and other elevation-raising mechanisms. Low-profile halogen work lights include halogen lamps supported by tubular frames formed of metal having a three-dimensional zigzag-like shape. Some low-profile halogen work lights combine halogen lamps with other elements, such as AC outlets, reels for extension cords, etc. The tubular frames of low-profile halogen work lights include tubular sections shaped and positioned to lie in a common plane and define a base. The base is designed to be positioned atop a floor or other generally horizontal support surface. An elevation control and locking mechanism that allows the beam of the halogen lamp to be elevated to a desired position and clamped is also usually included in low-profile halogen work lights.
In contrast to halogen work lights, in the past halogen floodlights have generally been large halogen lamps designed for mounting on poles, the side of a building, etc., for lighting a large, fixed location, such as a work yard, parking lot, etc. While halogen work lights can function as portable floodlights, in some environments they have been less powerful than desired. In this regard, halogen work lights normally include halogen bulbs falling in the 150-500 watt range. Halogen floodlights often include 500-watt halogen bulbs. 500-watt lights are sometimes too bright to be used by workers and others who require a nearby light source. One approach to resolving this problem is to include two (or more) lower-watt halogen lamps mounted on a single support structure, such as a telescoping tripod. While useful in some situations, this solution has some disadvantages in other situations. Further, it is more expensive and cumbersome than desired in many instances.
Thus, a need exists for a portable halogen light that can function both as a lower power halogen work light and as a more powerful halogen utility light or floodlight. This invention is directed to fulfilling this need.

Portable, double-bulb halogen work light/floodlight


An exemplary braking method includes monitoring for an upcoming deceleration of an electrified vehicle, permitting an amount of regenerative braking if the upcoming deceleration is detected, and reducing the amount of regenerative braking if the upcoming deceleration is not detected.

Generally, electrified vehicles differ from conventional motor vehicles because electrified vehicles are selectively driven using one or more battery-powered electric machines. Conventional motor vehicles, in contrast to electrified vehicles, are driven exclusively using an internal combustion engine. The electric machines can drive the electrified vehicles instead of, or in addition to, an internal combustion engine. Example electrified vehicles include hybrid electric vehicles (HEVs), plug-in hybrid electric vehicles (PHEVs), fuel cell vehicles (FCVs), and battery electric vehicles (BEVs).
Applying a brake torque can decelerate an electrified vehicle. The brake torque can include some brake torque from friction braking and some brake torque from regenerative braking. Friction braking and unnecessary or excessive regenerative braking can decrease fuel economy in electrified vehicles.

Adaptive regenerative braking method and system


A force-measuring element, having a series connection of at least two capacitors, the force-measuring element being designed in such a way that, under the action of force, a first capacitance of a first capacitor of the at least two capacitors increases and a second capacitance of a second capacitor of the at least two capacitors decreases, in which the force-measuring element is in the form of a connecting element, in which an application of force is provided on a long side of a sleeve of the force-measuring element, and the at least two capacitors are separated by a bar that essentially stands firm during the action of force, so that a first space having the first capacitor above the bar becomes smaller as a result of the application of force, and below the bar a second space becomes larger.

U.S. Pat. No. 6,218,632 describes a differential capacitor in a force-measuring element. In that case, a middle plate, which is implemented as a double plate and belongs to two serially interconnected capacitors, is able to move as a function of the force exerted. In addition, a spring is provided in the rod via which the force is exerted on this middle plate.


A time-of-flight camera includes a photosensor and a reference photosensor. Each of the photosensors have accumulation gates and each are configured as a photomixing detector (PMD). A readout device is connected to the accumulation gates of the photosensor and to the accumulation gates of the reference photosensor. The readout device is configured to read out an electric quantity that corresponds to a charge that is present at respective ones of the accumulation gates. An integration time of accumulating the charges is the same for the photosensor and for the reference photosensor and is dimensioned so as to prevent the reference photosensor from reaching saturation during operation of the time-of-flight camera.

The term "time-of-flight camera system" is meant to encompass not only systems that measure distances directly from the time of flight (TOF) but also and especially all time-of-flight camera systems or 3D-TOF camera systems that acquire time-of-flight information from the phase shift of emitted and received radiation. Particularly well-suited time-of-flight cameras or 3D-TOF cameras are PMD cameras with photonic mixer devices (PMD) of the type described, among others, in European patent application EP 1 777 747, U.S. Pat. No. 6,587,186 and German patent application DE 197 04 496, and commercially available, for example, from the "ifm electronic gmbh" company under the name Frame Grabber O3D. In particular, a PMD camera allows a flexible arrangement of the light source and of the detector, which can be arranged in a housing as well as separately. It goes without saying that the terms "camera" or "camera system" also include cameras or devices that have at least one receiving pixel such as, for instance, the O1D distance sensor made by the applicant.
German patent application DE 10 2004 044 581 A1 likewise discloses a method and a device for the time-of-flight-sensitive measurement of a signal in which the phase and the amplitude of an intensity-modulated input signal are determined. The input signal is mixed with a first reference signal, whereby the phase of the signal is subsequently determined by means of an IQ process employing an odd and even autocorrelation function.
German patent application DE 10 2004 016 625 A1 discloses a PMD system for receiving and processing modulated electromagnetic signals in which a semiconductor is configured to receive and convert electromagnetic radiation into an electric measured quantity. The semiconductor has an input for a modulated signal as well as at least two accumulation electrodes that are connected to an output electronic unit and at whose output a mixture of the received signal and of a modulation signal is provided as an electric signal.


A miniaturized lens assembly includes a first lens, a second lens and a third lens, all of which are arranged in sequence from an object side to an image side along an optical axis. The first lens is a convex-concave lens with negative refractive power and includes a convex surface facing the object side and a concave surface facing the image side. The second lens is with positive refractive power. The third lens is a convex-concave lens with negative refractive power and includes a convex surface facing the object side and a concave surface facing the image side.

1. Field of the Invention
The invention relates to a lens assembly, and more particularly to a miniaturized lens assembly.
2. Description of the Related Art
The first lens of a known lens assembly which is structured by 3 lenses is generally with positive refractive power. Therefore, the field of view is restricted and the application field is affected for such a lens assembly.


A method for implementing a neural network system in an integrated circuit includes presenting digital pulses to word line inputs of a matrix vector multiplier including a plurality of word lines, the word lines forming intersections with a plurality of summing bit lines, a programmable Vt transistor at each intersection having a gate connected to the intersecting word line, a source connected to a fixed potential and a drain connected to the intersecting summing bit line, each digital pulse having a pulse width proportional to an analog quantity. During a charge collection time frame charge collected on each of the summing bit lines from current flowing in the programmable Vt transistor is summed. During a pulse generating time frame digital pulses are generated having pulse widths proportional to the amount of charge that was collected on each summing bit line during the charge collection time frame.

The present invention relates to integrated circuit technology. More particularly, the present invention relates to analog neural networks and to combining analog neural networks with field programmable gate array technology.
Neural networks are built by connecting together several functions including matrix-vector products, rectification (RELU activation function), and a maximum of a set of values (max pooling). An ideal neural network integrated circuit could connect these functions together in a programmable manner.
Building a neural network using digital computation is unsatisfactory because it consumes unreasonable amounts of power. Analog Based Neural Network integrated circuits are efficient at calculating the terms for each layer. The neural network functions are implemented in the analog domain in each layer, but problems arise in routing the analog voltage levels to the next layer. Analog computation of neural network functions consumes less power, but routing a variable voltage is difficult as buffering requires the use of operational amplifiers which introduce errors, and consumes both significant die area and static power. Such routing is currently designed and hardwired into each integrated circuit individually for each application, making it expensive and inflexible. This routing is currently done at the fabrication level.
Incorporating processing in the digital domain can be an attractive alternative to-an all-analog neural network system. It is, however, very expensive to convert back and forth between the digital domain and the analog domain. In addition such conversions slow down a system as well as providing an opportunity to introduce errors into the computations.
FIG. 1 is a block diagram depicting an example of a prior-art matrix vector multiplier unit having input and output digital interfaces. A single integrated circuit will typically contain many of these matrix vector multipliers.
The input interfaces for this prior-art matrix vector multiplier unit are in the form of digital-to-analog (converters (DACs) having analog outputs coupled to the word line inputs W1 through Wn to the matrix vector multiplier unit and the output interfaces are in the form of analog-to-digital converters (ADCs) coupled to the bit lines B1 through Bn of the matrix vector multiplier unit. In one instance of this prior-art implementation both the DACs and the ADCs are 8-bit resolution. The weights are programmed as variable conductances (using for example programmable transistors such as Flash devices) in the matrix vector multiplier and represent the neural network weights. The inputs to the matrix vector multiplier unit are provided by the DACs, producing currents that are the product of the input signal voltage and the variable conductance weights.
When DACs and ADCs having 8-bit resolution are used, over four decades of linearity are required including the about two decades of applied voltage resolution from the 8-bit DAC resolution and assuming about two decades of the 8-bit variable conductance weight resolution when operating in the linear portion of the variable conductance transfer curve. One problem with this scheme occurs when the input voltage is at the high end of the 8-bit range and the programmed variable conductance is at the low end of the transfer curve. Because the low end of the variable conductance transfer curve is non-linear, the accuracy of the matrix vector multiplier unit suffers the most when the input voltage is at the high end of the 8-bit range and the programmed variable conductance is at the low end of the transfer curve.

Method for combining analog neural net with FPGA routing in a monolithic integrated circuit


A vehicle differential includes a housing having bearing seats and a carrier provided with stub shafts which project into the bearing seats. The carrier is supported in the housing on two single row tapered roller bearings which allow the carrier to rotate, but confine it radially and axially. The housing also contains a beveled pinion which meshes with a beveled ring gear that is attached to the carrier. The two bearings are mounted in opposition and each includes a cup that is located in the bearing seat for that bearing, a cone that fits around the stub axle that projects into that bearing seat, and tapered rollers located between the cup and cone. Each bearing seat contains an internal thread and the bearing cup which fits into the seat has an external thread that engages the internal thread. Each cup also carries a locking ring which is engaged by an adjustment tool to turn the cup, but is later deformed into the housing to secure the cup against rotation. By rotating the cups in their bearing seats, one can adjust the setting of the bearings and the mesh setting of the pinion and ring gear.

This invention relates in general to antifriction bearings and more particularly antifriction bearings for vehicle differentials.
The typical differential for an automotive vehicle has a housing in which meshed pinion and ring gears rotate, the former being connected to the transmission for the vehicle and the other being on a differential carrier having stub shafts which rotate in bearings set into the housing. The carrier has a cross shaft on which a pair of beveled gears rotate, and those bevel gears mesh with more bevel gears that are connected to the axle shafts which extend away from the carrier to driven road wheels. The bevel gears connected to the axle shafts have the capacity to rotate within the differential carrier at different angular velocities to compensate for the different angular velocities at which the two axle shafts will rotate when the vehicle negotiates a turn, for example.
Almost universally the two bearings which fit around the carrier shafts to support the carrier are single row tapered roller bearings which are mounted in opposition. As such, the bearings confine the carrier both radially and axially, but nevertheless allow the carrier to rotate in the differential housing with minimal friction. The two bearings are adjusted against one another to a setting which provides a good measure of stability to the carrier—indeed, one in which internal clearances are eliminated from the bearings. The location of the bearings along their common axis controls the mesh setting of the ring gear and the pinion, so the bearings are further adjusted to achieve the correct mesh setting.
In the typical differential the cones (inner races) of the two bearings fit around the two stub shafts on the carrier, while the cups (outer races) fit into the housing where they are backed by cup adjustors which thread into the housing (FIG. 2). By turning the two adjustors one can adjust the bearing setting and the mesh setting.
The cup adjustors represent additional components for the differential and add weight to it, as do locking devices which prevent the adjustors from rotating once they are turned to the positions which provide the proper settings. Moreover, the adjustors occupy space within the differential, and that is reflected in increased width and weight for the differential housing. While the adjustors confine the cups of the bearings axially, they do not prevent the cups from rotating in the housing, and such rotation can produce wear in the housing and on the cups as well.

Bearing arrangement for a vehicle differential


A system provides for strobing or high conspicuity signaling with vehicle hazard and other lights depending upon inputs and parameters.

For non-emergency vehicles (e.g., passenger cars) standard emergency or hazard flasher lights provide a relatively low amount of visual distinction compared with non-emergency lighting (e.g., headlights, daytime running lights, signal lights etc.). Solutions have been provided in the art including high visibility strobing systems such as those described in U.S. Pat. No. 9,481,331 to Tucker et al.
In some cases, a user of a vehicle that is so equipped, may inadvertently deploy a high visibility emergency strobe, or may deploy a high visibility strobe when conditions are not warranted. Over use of high visibility strobes could have the effect of desensitizing the driving public over time. In the short term, deployment of a high visibility strobe may represent a distraction when a genuine emergency does not exist.
What is needed is a system and method for addressing the above and related problems.

Control of high visibility vehicle light communication systems


Example methods, apparatuses, or articles of manufacture are disclosed herein that may be utilized, in whole or in part, to facilitate or support one or more operations or techniques for locating a victim via a first responder's device for use in or with a mobile communication device.

1. Field
The present disclosure relates generally to position or location estimates of mobile communication devices and, more particularly, to locating a victim via a first responder's device for use in or with mobile communication devices.
2. Information
Mobile communication devices, such as, for example, cellular telephones, personal digital assistants, electronic book readers, portable navigation units, laptop computers, or the like are becoming more common every day. As geographic barriers to personal travel decrease, mobile communication devices play a significant role in allowing society to maintain its mobility. Continued advancements in information technology, communications, mobile applications, etc. help to contribute to a rapidly growing market for mobile communication devices, which have become ubiquitous and may already be viewed as "extensions of the hand" altering the manner in which society communicates, does business, or creates value.
Certain mobile communication devices, such as location-aware cellular telephones, smart telephones, or the like may, for example, assist in estimating their geographic locations by communicating with one or more wireless transmitters or receivers over a suitable communications network. For example, mobile communication devices may assist in estimating their relative locations based, at least in part, on wireless signals received or acquired from one or more base stations, access points, location beacons, femtocells, or the like via a cellular telephone or like wireless network using known techniques. In some instances, however, such as, for example, in an emergency situation or like event (e.g., a natural disaster, etc.), a functioning or active cellular or like wireless communications network or associated service may not be available.

Locating a victim via a first responder's device


A circuit element includes a semiconductor chip and a wire for connecting between the semiconductor chip and an additional circuit element. A plurality of wire bond connections electrically connect the wire and the semiconductor chip. The plurality of wire bond connections can be disposed on a surface of the semiconductor chip and on a surface of the wire.

1. Field of the Invention
The present disclosure relates to integrated circuits, and more particularly to wire bonds for integrated circuits, MEMS devices, and the like.
2. Description of Related Art
Wires in power electronics are used to conduct current to and from a device package. The package wires are attached to the electronic components inside the package by way of wire bonds. During operation power electronic modules are subject to temperature sway. Particularly at the wire bonds for semiconductor chips, significant temperature variation can be observed. Wire material, i.e., aluminum and copper, and semiconductor chips, i.e. silicon, have different thermal expansion coefficients. Under the elevated temperature, the wire bond is subject to shear load due to the thermal expansion mismatch. This can lead to wire bond failure. The intensity of thermal mismatch is directly related to three key factors: the temperature sway amplitude, the bond dimension, and the difference in the coefficients of thermal expansion (CTE). Each of these key factors can compromise the reliability of the wire bond. Most work focus on the reduction of the thermal temperature sway by meanings as improvement of the bonding technology to reduce the contact electrical resistance, or use large bond to reduce the current density.
Various approaches have been developed to improve wire bond reliability. The mostly widely used concept is known as double stitch bonding. Instead of one stitch per wire, each wire is stitched multiple times onto a semiconductor chip. Another approach is using a flat ribbon wire instead of a round ribbon wire. The flat ribbon wire can achieve a relatively narrow bond with a bigger contact area. However, the bond dimension of either of these approaches is not reduced.
Such conventional methods and systems have generally been considered satisfactory for their intended purpose. However, there is still a need in the art for improved wire bonds. The present disclosure provides a solution for this need by using a plurality of wire bonds with smaller dimensions.


A method and system for the manufacture of ophthalmic lenses comprising a computer (102) and a CNC machining platform (104) in operative connection with the computer. The CNC machining platform includes a mounting stage (110), a block (106) in releasable connection with the mounting stage, and a machining tool (112). When an unfinished lens blank (108) is properly mounted on the block, the computer is operative to direct the CNC machining platform to perform both back surface generation and patternless edging of the lens blank in one machining cycle. The computer is further operative to direct the CNC machining platform to machine a lap tool for each lens and machine a block for receiving each lens. The block is machined by the platform to include scribe lines for facilitating proper alignment of lens blank.

In the art of ophthalmic lens manufacture, a finished ophthalmic lens is usually made from finished uncut lenses or from semi-finished lens blanks. Finished uncut lenses are lenses that are optically finished on both front and back surfaces and only need to be edged to the proper shape and edge contour to become finished lenses. Most optical laboratories keep an inventory of single vision finished uncut lenses in various powers, sizes, and materials to take care of most of the more common single vision ophthalmic lens prescriptions.
Semi-finished lens blanks have optically finished front surfaces; however, the back surfaces of these blanks need to be generated and fined and are then either polished or coated to produce finished uncut lenses. Finished uncut lenses are then edged to the proper frontal shape and edge contour to fit into spectacle/glasses frames or other mounting structures. Single vision lenses that are outside the normal range of inventoried finished uncut lenses and most multifocals are made from semi-finished lens blanks. Semi-finished lens blanks are made with various front surface curve radii, and have various topographies including spherical, aspheric, hyperbolic, irregular aspheric such as progressive add lenses, and polyspheric such as executive type segmented bifocals and trifocals.
To generate a desired prescription for a lens, calculations are required to determine the topography of the back surface of a lens. Such calculations typically involve variables that include the front surface radii of the semi-finished blank, the index of refraction of the lens blank material, prescription values of the desired lens, statutory values regarding minimum lens thickness, and the physical dimensions of the frame or mounting structure.
In the art, various means have been devised to accomplish the physical process of producing a back surface of optical quality. Most of these methods begin by generating a back surface that approximates the desired back surface topography and surface smoothness. This approximate surface is then fined to a more perfect approximation in both curvature and surface smoothness. After the appropriate accuracy and smoothness is achieved in the fining process, the surface is then polished or surface coated to produce a surface of optical quality. The optically finished lens blank is then edged to the proper shape and edge profile to fit into the frame for which it was made.
Many business entities that sell ophthalmic lenses do lens finishing as a profit center activity and as a way to expedite delivery of single vision lenses. Only a small percentage of these entities also do surfacing of ophthalmic lenses. The business volume of most of these entities cannot justify the costs of acquiring and operating a surfacing laboratory. Surfacing laboratory setup costs have heretofore been several times the cost of setting up a laboratory for edging only.
Hiring qualified technicians for ophthalmic lens finishing or training personnel to perform ophthalmic lens finishing is relatively easy. However, hiring and training optical technicians to operate a surfacing laboratory is not easy. In many communities it is very difficult to find personnel that are trained in surfacing. Technicians who are qualified to do surfacing are generally remunerated at higher pay scales than technicians skilled only in optical finishing.
In addition to the significantly higher equipment and personnel costs of a surfacing lab, there are also higher ongoing costs for the additional lab space required. At least several hundred square feet of operational space and storage space have heretofore been required for a full service surfacing and edging ophthalmic lens laboratory. Consequently there is a need for a system and method of ophthalmic lens manufacture that would significantly reduce the investment required to acquire a surfacing and edging laboratory. There is a further need for a system and method of ophthalmic lens manufacture that significantly reduces the costs associated with operating a surfacing and edging laboratory. Further, there is a need for a system and method of ophthalmic lens manufacture that is operative to perform surfacing and edging by an operator with little skill in the art.
In the prior art, the processes of surfacing and edging are done on at least two separate machines. In the prior art, blocking for surfacing and edging required two separate blocking devices. Also in the prior art, the individual processes of lap tool surfacing and lens cribbing and safety beveling and edge grooving and edge polishing and lens engraving each requires its own machine or device or machine augmentation. Each of these machines or devices or augmentations is to varying degrees expensive to acquire and each of the machines or devices requires laboratory space. Each of these operations, if done by hand, requires the necessary acquisition of skills and application of those skills in order to perform the various operations. Consequently, there is therefore a need for a system and method of ophthalmic lens manufacture that reduces the need to employ a plurality of expensive and complex machines to manufacture lenses.
In the prior art, after a semi-finished lens blank is generated and fined and polished it is de-blocked and inspected and then laid out and blocked again for edging. Blocking for surfacing and blocking for edging are two different procedures that differ in significant ways requiring two different sets of skills and requiring two separate and very different mechanical blocking systems. Repeating the blocking process is necessary in part because the metallic block used for surfacing could interfere with the edging process. This is because portions of the uncut lens that lie under the surfacing block frequently need to be removed during the edging process. If the standard surfacing block were also used during edging, this could result in the metal surfacing block coming into contact with the cutting or grinding surfaces of the edging machine thereby damaging the cutting or grinding surfaces of the edging machine and damaging or destroying the block in the process. Additionally, the need to block a lens twice multiplies the opportunities for error and spoilage and requires the expenditure of time. Consequently there is a need for a method of ophthalmic lens manufacture that eliminates the need to block a lens blank twice for those lenses that require both surfacing and edging.
The prior art describes several types of single point blocking systems. One type describes centering the block on the point of the lens that would occupy the geometric center of the frame when the lens is finished (frame geometric center blocking). Another describes centering the block on the point of the lens that would occupy the optical center of the finished lens (optical center blocking). A third describes centering the block in the geometric center of the semi-finished uncut lens (lens blank geometric center blocking). In prior art, all three of methods are optimized for surfacing by tilting the front surface by the proper amount and in the proper direction to move the optic axis into alignment with the generator feed axis. Only in the case of "frame geometric center blocking" is it possible to optimize for edging. This optimization for edging is accomplished by aligning the front surface normal at the geometric center with the feed axis of the generator.
The "optical center" and "lens blank geometric center" blocking arrangements create relationships between a lens blank and the generator feed axis that are optimal for generating lens back surfaces because errors in thickness at any stage in the process of surface generation and fining will not affect a change in the position of the optical center of the lens. This is because the optic axis does not move as the thickness of the blank decreases. However, in neither of these two cases are the blocking arrangements optimal for edging a lens. In both instances the lens is frequently tilted too much to apply an edge parallel to the normal at the geometric center of the front surface of the finished lens. Applying an edge to a lens at any angle other than parallel to the front surface normal at the geometric center results in edges that are skewed and frequently thicker than necessary and with edge beads that have less than optimal orientations.
A blocking system optimized for edging, like "frame geometric center blocking", wherein the lens blank is blocked on the geometric center of the finished lens and where the normal at the geometric center of the front surface of the finished lens is parallel to the axis of rotation of the edging tool or edge grinding wheel, is not optimal for surfacing. Except for the relatively rare case where there is positional coincidence between the optical center of the lens and the frame geometric center of the lens, the optical center of the lens is made to move or "creep" as the lens is made to decrease in thickness during fining.
A method of lens blocking that is optimized for edging and that is also operative for surface generation would be of considerable utility. It would allow for a single blocking step for both the surface generation of a lens and for the edging of that lens without de-blocking and re-blocking between the steps of surface generation and edging. Therefore there is a need for a system and method of blocking a lens for both surfacing and edging that reduces the problems associated with optical center creep.
Prescription lenses for patients are often generated in pairs for a spectacle frame. Prior art systems typically generate each lens independently. Production cycle times for generating lenses may be reduced by employing multiple surfacing and edging machines in the laboratory to generate pairs of lenses simultaneously, however duplication of equipment doubles the acquisition and operational costs of the laboratory. Thus there exists a need for a system and method of ophthalmic lens manufacture that provides for reduced production cycle times for pairs of prescription lens without significantly increasing costs for the laboratory.
Heat transfer into the lens blank from the heated blocking medium during the blocking procedure is a frequent cause of so called "lens warpage". The greater the amount of heat transfer involved and the more uneven the distribution of that heat transfer is, the greater the chance of producing warpage and ruining the lens or producing a substandard lens. There is therefore a need for a method of ophthalmic lens manufacture that could minimize the transference of heat into the lens blank during blocking, and that could make the distribution of that heat transference uniform over the entire area of the finished lens. Further, there is a need for a system and method of ophthalmic lens manufacture that could eliminate problems associated with heat transfer into the lens during blocking.
The standard block used for lens surfacing is generally smaller than the size of the finished lens being fabricated. The portion of a lens that remains unsupported can undergo flexure when submitted to the forces involved in the generating, fining and polishing processes. This results in flaws or "waves" in the optics of the lens in the areas that underwent the flexure and is a common source of spoilage or of substandard lenses. Consequently, there is a need for a technique that would eliminate these optical flaws caused by flexion of the lens blank during generating and fining and polishing of the lens.
For cosmetic effect, the edges of lenses are sometimes polished. In prior art, when the edge of the lens has a mounting bevel, the bevel on the edge of the lens is polished when the edge is polished. Polishing the mounting bevel reduces the holding friction of the bevel that aids in holding the lens in the frame, and that holding friction is also important in resisting rotation of the lens within the frame. For this reason, a lens that has a polished edge with a polished bevel is more difficult to keep securely mounted and properly oriented in its frame. There is therefore a need for a system and method of ophthalmic lens manufacture that is operative to polish the edge of a lens without polishing the mounting bevel on the edge of the lens.
Prior art systems for lens manufacture are inherently non-mobile, due to the large amounts of laboratory space required to store an inventory of lap tools and the many pieces of heavy laboratory equipment needed to generate and surface and finish lenses. Thus, prior art systems cannot be easily transported to locations such as factories to manufacture safety lenses on-site or military theaters to support the optical needs of military personnel. Consequently, there is a need for an ophthalmic lens manufacturing system that is portable.

This patent is subject to a terminal disclaimer.

System and method for ophthalmic lens manufacture