A rollable sun cap having a visor (10) having a body (10a) having upper and lower outer skins (13 and 14) adapted to cover the upper and lower portions of a core material thereof and a finishing edge (16) coupled by sewing to the outer circumference of the body (10a) and a band type hair portion (20) provided on the inner circumference of the visor (10) and having male and female magic tapes (24 and 25) detachably mounted on both ends thereof, the rollable sun cap including: adhesive surfaces (13a) formed on the inner surfaces of the upper and lower outer skins (13 and 14) facing the core material; and band type core materials (11) provided as the core material of the body (10a) of the visor (10).

1. Field of the Invention
The present invention relates to a rollable sun cap, and more particularly, to a rollable sun cap that is provided with a body of a visor rollably formed in such a manner where band type core materials are spaced apart from each other by a given distance between upper and lower outer skins, and an elastic support wire mounted on the outer circumference of the body of the visor to maintain the given distance between the neighboring band type core materials, without having any distortion on the given distance, and to keep the shape of the visor when spread out, so that the sun cap can be rolled up for convenient storage when not in use and the visor can be spread out tightly, without any distorted portions, when the rolled up sun cap is spread out to be put on a wearer's head.
2. Background of the Related Art
As one of the prior art documents, there is disclosed Korean Patent No. 10-069190 (entitled "cap with partially incised brim"), wherein the cap includes a crown as a body of the cap made of at least one or more panels and a brim attached to the front lower end portion of the crown and having a core made of any one of soft, medium, and hard materials and upper and lower fabrics adapted to cover the core, the core having at least one or more partially incised portions formed thereon.
In the conventional practice, the core 2 of the brim has a plurality of incised lines 3 spaced apart from each other by a given distance thereon, thereby allowing the cap to be rolled up.
By the way, as shown in FIG. 11, both ends of the incised lines 3 are connected to the brim body, without any separation, thereby forming connection portions 4.
The core 2 of the brim is formed of a generally thin synthetic resin plate having a thickness of about 1 to 2 mm, and accordingly, even though the incised lines are not formed on the thin synthetic resin plate, the brim can be rolled up by means of the characteristics of the soft material. Further, at this time, the incised lines 3 are spaced apart from each other by the given distance on the core 2 made of the thin synthetic resin plate, so that the brim can be rolled up more gently.
By the way, both ends of the incised lines 3 are not incised up to the outside, but are connected integrally to the brim by means of the connection portions 4, so that when the core 2 is rolled up to a small-sized cylindrical shape or when the connection portions 4 are drastically bent, the connection portions 4 of the core 2 made of the thin synthetic resin plate may be cut or distorted.
If the cap having the core 2 on which the connection portions 4 are cut or bent is put on a wearer's head, the outer circumferential portion of the brim looks bent by the cut portion 5 or the bent portion 6 of each connection portion 4, thereby giving bad influences on the outer appearance of the cap.
On the other hand, it will be noted that the brim explained in the conventional practice is the same as a visor as will be explained in the present invention and the incised lines in the conventional practice are similar to a plurality of band type core materials spaced apart from each other by a given distance as will be discussed in the present invention.


A driving roller for conveying a sheet to a sheet punching unit, and a sheet inverting unit including a driving roll capable of being driven to rotate by the driving roller are provided between a branching point, at which a return path of a sheet conveying path is branched, and a sheet punching unit. When a subsequent sheet for which a punching process is performed next reaches the sheet inverting unit, the sheet to which the punching process has been performed by the sheet punching unit is conveyed to the return path by the driving roll while making the sheet pass by a subsequent sheet conveyed to the sheet punching unit by the driving roller.

1. Field of the Invention
The present disclosure relates to a sheet processing device and an image forming system. More particularly, the present disclosure relates to a sheet processing device and an image forming system which includes a punching unit configured to perform a punching process in a sheet efficiently.
2. Description of the Related Art
There has been an image forming system in which a sheet processing device is provided in image forming apparatus, such as a copier, a laser beam printer, a facsimile machine and a multi-functional peripheral thereof. The sheet processing device performs, for example, stapling or punching in a sheet in which an image has been formed. In such a sheet processing device, when the punching process is performed in a sheet, the sheet which is being conveyed is first positioned at a position at which the punching process is to be performed. At that position, the punching process is performed to the sheet by the punching unit (see Japanese Patent Laid-Open No. 2006-069785).
In such a related art sheet processing device and an image forming system which includes the sheet processing device, at the time of the punching process, after the sheet is positioned one at a time by a positioning unit, the punching process is performed to the sheet by the punching unit and then the sheet to which the punching process has been performed is conveyed. However, in such a configuration, since a subsequent sheet is not able to be conveyed to the positioning unit until the conveyance of the preceding sheet from the positioning unit and the punching unit is completed, the punching process is not able to be performed efficiently.
Therefore, if the thus-configured sheet processing device is connected to image forming apparatus with high productivity with short sheet feeding intervals, the productivity of the image forming apparatus is adversely affected by the capability of the sheet processing device. That is, it is necessary to perform the punching process by the sheet processing device efficiently in order to maintain high productivity of the entire image formation system.
In view of the aforementioned, the present invention provides a sheet processing device and an image forming system capable of performing a punching process efficiently.

Sheet processing device and image forming system


A peptide, wherein the peptide comprises an amino acid sequence expressed by the following SEQ ID NO: 1, an amino acid sequence expressed by the following SEQ ID NO: 2, an amino acid sequence expressed by the following SEQ ID NO: 3, an amino acid sequence expressed by the following SEQ ID NO: 4, or any combination thereof:

1. Field of the Invention
The present invention relates to a peptide that permeates the blood-brain barrier, a drug transporter, an antipoliovirus agent, a blood-brain barrier permeating agent, and a transferrin receptor capturing body.
2. Description of the Related Art
The blood-brain barrier (BBB) in the central nervous system strictly restricts intake of substances to the central nervous system. This is because the blood-brain barrier is physically narrowed with densely populated vascular endothelial cells and other cells, and these cells have physiological functions of restricting intake of substances. The mechanism of permeation of substances through the blood-brain barrier has not yet been revealed. At present, even if disorders occur in the central nervous system, drugs cannot be delivered to target sites in the central nervous system.
Disorders in the central nervous system include: infections caused by, for example, poliovirus and Japanese encephalitis virus; and neurodegenerative diseases such as Alzheimer's disease, Parkinson's disease and Huntington's chorea. Infections in the central nervous system have been prevented by vaccination, and infected patients have mainly undergone symptomatic therapy. In this manner, effective therapeutic methods have not yet been found.
One proposed therapeutic drug against poliovirus is an antivirus agent composition containing citric acid and/or zinc, L-arginine and an acceptable carrier (see Japanese Patent Application Laid-Open (JP-A) No. 2009-298800) and another proposed therapeutic drug is an antivirus agent containing selegiline as an active ingredient (see JP-A No. 2004-292399). These antivirus agents cannot permeate the blood-brain barrier, which is problematic in use.
In an attempt to utilize drugs more safely and effectively, the recent interest has focused not only on the dosage form suitable to drugs but also on drug delivery methods for efficiently delivering drugs to target sites in the body. In particular, demand has arisen for practical use of a drug delivery system (DDS) as a transporting system for delivering a drug at a required timing in a required amount to a required site.
In the central nervous system, a method using a virus vector has been proposed (see, for example, JP-A No. 2009-159988). However, this method has a problem in terms of safety and has not been practically used so far. At present, there has not been found a DDS that allows drugs to permeate the blood-brain barrier.
Meanwhile, viruses permeate the blood-brain barrier to infect the central nervous system. For example, poliovirus (PV), which is a positive single-stranded RNA virus belonging to the genus Enterovirus of the family Picornaviridae, is a cause of polio (poliomyelitis) and known to have neurotropism. A natural host thereof is only human but experimentally, poliovirus can infect primates. Poliovirus infects human via an oral route, proliferates in the digestive tract, and invades blood via the tonsil or the Peyer's patch. Then, poliovirus permeates the blood-brain barrier to invade the central nervous system, where it mainly infects motor nerve cells to destroy their cell functions. As a result, infected patients suffer from paralysis of their limbs. The central nervous system is also known to have a route through which poliovirus is transported from the skeletal muscle in a retrograde fashion on the nerve axon to reach motor nerve cells.
As for a poliovirus receptor (PVR), CD155 is known to be involved with poliovirus infection (see Koike S et al., EMBO J. 1990 October; 9(10): 3217-24.).
However, studies using a transgenic mouse with a PVR gene introduced suggest that CD155 is not involved with the permeation of poliovirus through the blood-brain barrier (see Yang W X et al., Virology. 1997 Mar. 17; 229(2): 421-8.). This finding indicates that another receptor is presumably involved with the permeation of poliovirus through the blood-brain barrier.
Although revealing the mechanism of poliovirus infection is thought to reveal the blood-brain barrier permeation mechanism from blood to the central nervous system, the mechanism of poliovirus infection has not yet been revealed.

Drug transporter permeating blood-brain barrier, peptide and use thereof

Abstract: (SEQ ID NO: 1)ALGDSLYGAASLN; (SEQ ID NO: 2)MTVDNPASTTNKDKLFSVWK; (SEQ ID NO; 3)PGAVPEK;and (SEQ ID NO: 4)STKDLTTY.


A method, system, and computer program product for segmenting data into variable size blocks based on content defined positions. Segmenting probabilities and associated segmenting conditions are defined. The segmenting conditions are ordered in accordance with the associated segmenting probabilities to form a hierarchy of the segmenting conditions. A segmenting condition associated with a highest segmenting probability is defined to be a lowest level segmenting condition in the hierarchy of the segmenting conditions. The segmenting condition associated with a lowest segmenting probability is defined to be a highest level segmenting condition in the hierarchy of the segmenting conditions. Hash values are calculated for each seed block in each consecutive byte position in the data. Each one of the hash values is evaluated using the segmenting conditions. A segmenting position is determined in the data for each hash value that satisfies one of the segmenting conditions.

1. Field of the Invention
The present invention relates in general to computers, and more particularly to hierarchical content defined segmentation of data in a computing environment.
2. Description of the Related Art
In today's society, computer systems are commonplace. Computer systems may be found in the workplace, at home, or at school. Computer systems may include data storage systems, or disk storage systems, to process and store data. Large amounts of data have to be processed daily and the current trend suggests that these amounts will continue being ever-increasing in the foreseeable future. An efficient way to alleviate the problem is by using deduplication. The idea underlying a deduplication system is to exploit the fact that large parts of the available data are copied again and again, by locating repeated data and storing only its first occurrence. Subsequent copies are replaced with pointers to the stored occurrence, which significantly reduces the storage requirements if the data is indeed repetitive.

Hierarchical content defined segmentation of data


An electronic device may be provided with a phased antenna array controlled by phase and magnitude controllers within an integrated circuit. The array may be formed on antenna layers and the integrated circuit may be mounted to transmission line layers of a dielectric substrate. A ground plane may separate the transmission line layers from the antenna layers. A connector may be mounted to the surface of the transmission line layers and may be coupled to the integrated circuit using conductive traces. A passive resonator may be formed in the antenna layers and may include conductive structures that resonate at one-quarter of the effective wavelength of operation of the array to form an open circuit impedance for surface currents generated on the ground plane by the array. This may serve to block the surface currents from scattering at an edge of the ground plane and leaking onto the integrated circuit.

This relates generally to electronic devices and, more particularly, to electronic devices with wireless communications circuitry.
Electronic devices often include wireless communications circuitry. For example, cellular telephones, computers, and other devices often contain antennas and wireless transceivers for supporting wireless communications.
It may be desirable to support wireless communications in millimeter wave and centimeter wave communications bands. Millimeter wave communications, which are sometimes referred to as extremely high frequency (EHF) communications, and centimeter wave communications involve communications at frequencies of about 10-300 GHz. In order to support millimeter and centimeter wave communications, an array of antennas is formed on a substrate. Transmission lines for the array are embedded within the substrate.
Operation at these frequencies may support high bandwidths, but may raise significant challenges. For example, it can be difficult to ensure that amplifier circuitry and other radio-frequency components on the substrate are sufficiently isolated from surface currents generated by the antennas. Spreading the radio-frequency components on the substrate far apart from each other typically improves isolation. However, at the same time, manufacturers are continually striving to implement wireless communications circuitry such as antenna arrays using compact structures to satisfy consumer demand for small form factor wireless devices.
It would therefore be desirable to be able to provide electronic devices with improved wireless communications circuitry such as communications circuitry that supports millimeter wave communications.

Electronic devices having antenna module isolation structures


The present invention provides a method for assembling a head gimbal assembly useful in a hard disk drive and for testing such an assembly. In a method in accord with the present invention a head/slider is mounted to a circuited gimbal in an automated assembly machine. Following this step the head/slider circuited gimbal assembly will be subjected a dynamic electrical test with those head/slider circuited gimbal assemblies not passing being sorted from the lot. Following this step the head/slider circuited assembly will be attached to a suspension.

The hard disk drive is the principal device used for long term, bulk memory storage in today's computers. The hard disk drive includes a rotating disk and a head gimbal assembly that is attached to actuator arm in the disk drive and that is held thereby closely adjacent to the rotating disk. The head gimbal assembly consists of several distinct components including a suspension, a gimbal, a flex circuit, and a slider with its integral read/write head. The rotating disk is coated with a magnetic or read/write media that is selectively magnetized by a read/write head to store information thereon. In operation, an electric current is provided to the read/write head, which creates and applies a magnetic field to the disk as the disk rotates relative to the head. The current is selectively controlled such that the applied magnetic field selectively reverses, thereby preferentially magnetizing elective areas of the disk. Each magnetized area consists of a north and south pole selectively oriented in one of two preferred directions. Magnetized areas having a north pole pointing in one of the two direction are designated as a "0" and in the other direction as a "1." In this way the binary language of computers consisting of zeroes and ones is assembled and data and programs, which comprise zeroes and ones in binary computer language, are stored on the hard disk. To read the information, current read/write heads sense changes in the current flowing through the head as the magnetized areas of the disk pass by and recognizes the current changes as a 0 or 1.
Typical hard disk drives include multiple disks and multiple read/write heads. As the disks rotate in the disk drive, air flow from the spinning disks interacts with the bearing surface on the slider to create an air bearing, which is used to place the read/write head at the designed distance from the disk media, also known as the hard disk drive's magnetic spacing. If the head is too far away from the media, signal loss will occur and if the head is too close to the media, the head could mechanically crash, that is, actually come into contact with the disk, resulting in damage to the head or the media and often a complete hard drive failure.
Currently, the hard disk drive industry is striving to increase the amount of data or information that can be stored in a predetermined area. That is, the industry is trying to increase the quantity of information stored per unit area of the disk. To do this, the magnetized disk media areas, which are representative of the stored data, must be smaller and closer together. In turn, this requires that the sliders as well as the magnetic spacing be smaller. As the sliders are made smaller, they become increasingly sensitive to factors causing spacing variation. The key mechanical factors that determine the proper magnetic spacing are the bearing manufacturing tolerances, the load placed on the slider from the suspension, and the torque acting on the slider from the suspension and assembly tolerances.
The performance of the read/write head is critical to the long-term operation of a hard drive. These devices include small component parts operating under extreme conditions. Precision manufacturing and quality control testing of these parts prior to their incorporation into the finished hard disk drive is therefore desirable to ensure that only quality components make it into the disk drives before being sold to the consumer.
One of the critical components in the hard disk drive is the head gimbal assembly. The head gimbal assembly has traditionally been assembled together by hand in several steps. Presently, a head gimbal assembly process includes, broadly stated, steps including the adhesive attachment of a slider to a suspension, the routing of leads to electrically connect the head to the disk drive electronics, and the testing the electrical performance of the head while the suspension holds it over a test disk. Many problems are encountered with the present process resulting in high costs and poor magnetic spacing tolerances.
One of the problems is that the present system is labor intensive. This creates many potential opportunities for the generation of electrostatic charges, which can damage the components with an electrostatic discharge (ESD) or electrical overstress (EOS).
Another example of a problem relates to the electrical connection made between the head termination pads on the slider and the electrical interconnect or flex circuit running along the suspension after the slider is attached to the suspension. These electrical connections are difficult to make for several reasons. For example, the slider is positioned with respect to the gimbal load point and not necessarily the electrical leads on the suspension, which can cause the electrical connection to be difficult and unreliable. In addition, because the intricate surface features of the head/slider and suspension make it difficult to hold in a fixture, the bonding process, which requires a significant force to achieve a good bond, often leads to damage of the suspension.
After attachment of the slider to the suspension, each head is tested while the suspension holds the slider over a rotating testing disk. This test is known as a dynamic electrical test (DET). Current DET test procedures require that the head gimbal assembly be held in the loaded position at the correct magnetic spacing or Z-height with respect to the spinning testing disk, making both loading the assembly and automating this test difficult. In addition, mechanical and head tolerances can cause a poor signal, making it difficult to discern the source of any poor performance. Further, the DET results indicate that a head is bad and must be discarded, then the manufacturer must throw away not only the head/slider but also the suspension to which it is bonded. This is a source for significant yield cost.
Static angles are currently measured with the suspension clamped and held in its loaded state, by lifting the beam with a pin near its center. While the slider bond pad is the point of interest, it is impossible to load it and measure it at the same time, without affecting the static angle. The act of bringing the suspension to its loaded position causes clamping and fixturing to be difficult as well as forces one to account for a pitch bias, because the loading is not at the suspension bond pad. In addition, if the loading mechanism is not perfectly centered on the load beam, the act of loading can cause a roll bias in the angle measurement.
In the past, some have measured static angles in the unloaded condition, but the measurement reference was the plane of the suspension beam and not the mounting plate plane (actuator arm interface). This reference problem resulted in an unpredictable bias between the measured static angles and the real static angles.
Placing the read/write slider on the suspension is primarily a manually process wherein pins or cavities in tooling hold each component in alignment. While the position target is to align the suspension load point to the designed location on the slider air bearing, tolerances make this a difficult task. U.S. Pat. No. 4,866,836 addresses these tolerances by optically aligning the slider body to the suspension (dimple) load point. This technique alleviates the load point source of torque variation, but it does not address the torque from suspension, circuit, bond line parallelism and slider parallelism tolerances.
Several techniques have been attempted to "bond out" the static angles from the suspension and slider (parallelism). These are described in U.S. Pat. Nos. 5,608,590; 5,473,488; 5,661,619; 5,729,889 and 5,636,089. These concepts attempt to counter torque from static angle tolerances by allowing the adhesive to form a wedge between the slider and suspension bonding surfaces. These techniques do not address torque from load point tolerances and the adhesive wedge is difficult to control, at best, thus it does not "bond out" the static angle tolerances.
U.S. Pat. Nos. 5,198,945 and 5,282,102 teach integrated flexure suspensions that reduce some load position errors, but do not address torque from static angle tolerance, bond line parallelism or slider parallelism.
U.S. Pat. No. 5,682,780 is an example of a suspension adjustment technology used to decrease some of the static angle variation from the suspension components, which involves deforming the mechanical suspension. It does not address load point, bond line parallelism or slider parallelism sources of torque.
A technique has been used to measure the torque acting on the slider body and shift the slider relative to the suspension to minimize the torque during slider bonding. This technique is shown in U.S. Pat. No. 5,371,939. While this technique adjusts slider position to account for torque from static angles, load point, and slider parallelism, it requires aligning the slider with the suspension in a loaded position and requires that small actuated fixtures come in contact with the slider body. Bringing the suspension to the loaded position involves precise clamping and very controlled distances between that clamp surface and the loading surface. Thus, inherently, this technique is difficult to automate and achieve high throughput.
The foregoing discussion of current head gimbal assembly procedures has highlighted several of the problems with the current assembly procedures and pointed out the long-felt but unsatisfied needs of the industry. Thus, there is a need for a method of only aligning the head termination pads to the interconnect leads rather than the gimbal load point as well as a need for simplifying the fixturing to reduce damage to the suspension. Also, there is a need for a fast, automatable method for performing a dynamic electrical head test before the head is mounted to a suspension. Yet again, there is a need for a fast, automatable method of mounting a slider without the use of complicated tools and applying a load, which does not damage the suspension and accounts for static angle torques. Additionally, there is a need for a fast, automatable static angle measurement system that does not require loading the suspension, but uses a predictable and functional reference surface. Finally, there is a need for a fast, automatable method to align and attach a slider to a suspension, while accounting for all sources of torque variation.


A vehicle wheel speed sensor incorporated on an axle spindle hub and hub cap assembly of the type using permanent magnets to generate a magnetic field having a magnetic path conducted through a plurality of teeth on a flange extending from the hub cap into a plurality of teeth on a stator with relative motion therebetween upon rotation of the wheel where the frequency of the change in the magnetic reluctance varies at a frequency proportional to the wheel speed. The stator is mounted to the end of the axle spindle by a securing bolt so that the stator can be easily removed for service without disturbing the axle bearings. As a part of the stator assembly, a locating plate is provided which allows the operating gap between the teeth formed in the flange and the teeth formed in the stator to be easily established upon assembly of the hub cap to the wheel hub by allowing the rotor to contact the locating plate when the hub cap securing bolts have been loosened and the axle is supported. The flange pilots on the inner annular surface in the wheel hub thereby reducing the cost of assembly and improving overall functionality.

Prior art wheel speed sensors for vehicles have generally fallen into two broad categories, those employing either active or passive sensors. Active sensors require a power signal to be fed to a sensor component, whereas passive sensors need no outside power and usually consist of a coil surrounding a magnet material which is positioned in close proximity to a circular shaped element having a plurality of teeth which rotates with the wheel hub. The coil and magnet are mounted to a stationary part of the vehicle or axle assembly and the relative motion of the teeth in the rotor passing over a magnetized pole piece induces a change in reluctance which can be detected in an electronics package which is connected to the coil. A device of this type is described in U.S. Pat. No. 4,986,605, the disclosure which is expressly incorporated herein by reference, where a pulser and sensor unit are located inside the wheel hub mounted on the axle spindle in close proximity to a rotor connected to the wheel hub having a series of rectangular teeth.
Another type of passive wheel speed sensor is described in U.S. Pat. No. 3,887,046 and describes a sensor having a stator and a rotor where the stator is mounted on an axle and includes an electrical coil of wire surrounding the axle where the coil sets in a metal carrier having pole pieces and a plurality of magnets angularly disposed where the pole pieces are in close proximity to a multi-segmented rotor which is mounted to a hub cap which turns with the wheel hub.
A problem with these types of wheel speed sensors is that they require precision fabrication of the components so that, upon assembly, the limited clearance of the pole pieces to the rotor is maintained throughout the rotation of the wheel hub and hub cap assembly so that the signal due to the passing of the rotor teeth over the pole pieces is maximized.
Also, another problem with devices of this type is that the mounting of the stator piece is secured by the axle mount and is piloted on the outside diameter of the axle spindle which results in a large and complicated mounting system for the stator disc. If service of the stator is required, the prior art systems require that the spindle retention nut be disturbed which complicates the servicing process. Another problem occurs upon reassembly where the clearance between the rotor and the stator pole pieces is difficult to set and poor sensor performance is the potential result of that difficulty.
Another problem with wheel speed sensor assemblies is that the rotor cap often sets the clearance between the stator and the rotor and this rotor cap is simply clamped through some type of fastening means making the setting of the operator clearance between the stator and the rotor quite difficult. Some method of piloting the rotor cap to the hub and wheel structure would facilitate sensor assembly setup for proper operating clearance.
In the prior art, the rotor and hub cap were two different parts which were assembled together. This assembly process involved pressing into the hub cap a pre-shaped rotor. However, during this process it is very difficult to maintain the required roundness and tolerances for the rotor to be properly functional and rotate in close proximity relative to the stator. To assure this function, the rotor typically has to be machined after assembly with the attendant adding machining and pre-shaping adding considerable cost to the product.

Vehicle wheel speed sensor employing an adaptable rotor cap


The present disclosure provides a login method for a client application and a corresponding server. The method includes: sending an access token to a browser of a terminal and creating a corresponding relationship between the access token and user information of a user after the user has successfully logged into a web application via the browser of the terminal; receiving a relationship creating request from the browser and creating a corresponding relationship between device information of the terminal and the access token in accordance with the relationship creating request, wherein the relationship creating request includes the device information of the terminal and the access token; receiving a login request of a client application, the login request including the device information of the terminal that operates the client application; determining the access token corresponding to the device information of the terminal that operates the client application based on the created corresponding relationship between the device information and the access token; and determining the user information which corresponds to the access token based on the created corresponding relationship between the access token and the user information, and performing a login operation of the client application program based on the user information. The technical scheme of the present disclosure can achieve login without re-inputting information such as a user name and a password when a client application is to be logged in after a web application in a terminal has successfully been logged in.

With the rapid development of mobile Internet technology, smart terminals have become more popular and have drawn increasing attention from users. Various application programs are developed for the smart terminals. Whether for a client application program (i.e., App) or a web page application program (i.e., web App), a user is usually required to perform a login.
Currently, a single sign-on scheme across multiple web page applications has been implemented. The principle for achieving the scheme is as follows: a user visits a website A and performs a login operation; after the login is successful, a server of the website A writes a cookie, which is called a "token", to the user's browser to indicate that the user has already logged in, and stores the user's information in a cache of the server, where a key for the cache is the token and the value is the user's information; when the user visits a website B, the browser first visits a certain URL of the website A (this URL will automatically jump to the website B) and sends the cookie to the website B as an http parameter; and the website B verifies the validity of the token, searches for the user's information in the server using the token, performs a login, and deletes cache information corresponding to the token.
Although the above existing technology can achieve a single sign on across multiple websites, this technology is unable to achieve a single sign on between a client application on a mobile terminal and a website because the browser is unable to send the cookie directly to an application program.

Login method for client application and corresponding server


An example device can include a reserve print materials container, an access port coupled to the reserve print materials container to receive, from a replenishment device, print materials directly to the reserve print materials container in-situ, and a main print materials container coupled to the reserve print materials container to receive print materials from the reserve print materials container.

Printing devices, such as printers, copiers, etc., may be used to form markings on a physical medium, such as text, images, etc. In some examples, imaging systems may form markings on the physical medium by performing a print job. A print job can include forming markings such as text and/or images by transferring print materials to the physical medium.

Hewlett-Packard Development Company, L.P.


A crawler traveling device includes a sprocket and a rubber crawler. The sprocket is provided with a wheel portion that is mounted to a driving axle and tooth portions. The tooth portions are provided at side portions of the wheel portion, spaced apart in a sprocket circumferential direction. The rubber crawler is provided with a rubber body that is wrapped round the sprocket, a wheel portion support face that is provided at an inner periphery portion of the rubber body, and engaging recess portions. The engaging recess portions are provided, spaced apart in a crawler peripheral direction, at each of two crawler width direction side portions of the inner periphery portion to sandwich the wheel portion support face. The engaging recess portions are recessed toward the crawler outer side and the tooth portions can be inserted into and engaged with the engaging recess portions.

Heretofore, crawler traveling devices have come to be widely used for traveling parts of agricultural machinery, construction machinery, civil engineering machinery and the like. A crawler traveling device of this kind is structured by a driving wheel, an idler wheel and track rollers, and an endless-shaped elastic crawler that is wrapped round these wheels.
These crawler traveling devices include a crawler traveling device (for example, Japanese Patent Application Laid-Open (JP-A) No. H11-198871) in which taper-shaped drive protrusions are formed at an inner periphery portion of a rubber crawler, at constant intervals in a peripheral direction. Circular rod-shaped drive pins protrude from side face edge portions of a driving wheel and push against angled faces of the drive protrusions. Thus, driving force is transmitted to the rubber crawler.

Crawler traveling device and elastic crawler


A fork lift truck capacity monitor or alerting device informs operators of the weight on the forks and fork height and alerts operators whenever truck speed is above creep with the forks raised above a collapsed height or whenever the forks are raised above a recommended height for a given load. The alerting device includes a control circuit that receives inputs from a speed sensor, a fork height sensor and a weight sensor and reads a memory storing data correlating load weights with maximum recommended fork heights. A truck icon is displayed on a display panel. A plurality of height zone lamps representing the weight of the load on the forks are arranged in a vertical column over the truck icon and selectively illuminated according to the load on the forks. A plurality of lamps represent the height of the forks with the fork height lamps, which include one lamp positioned to represent a lowered position of the forks and a plurality of lamps equal in number to the height zone lamps and placed horizontally opposite therefrom, being selectively illuminated according to the height of the forks. An alarm signal alerts operators whenever the forks are raised above the recommended height for a given load weight, or whenever truck speed exceeds a predetermined maximum speed and the forks are above the collapsed height. The alarm signal may include a combination of an audible signal, a text message, and a flashing lamp.

This invention relates to an improved method and apparatus for providing information to a fork lift truck operator regarding the vertical position of forks of the truck, the height to which the forks can be raised for a given load and the speed of the truck by means of a display and an audible alarm.
Fork lift trucks, such as rider reach lift trucks, are often provided with a placard or plate on which capacity information is placed, e.g., information as to how high the forks may be raised with various loads on the forks. A capacity plate may include a table which states load weight versus recommended fork height indicating for a given truck that a load of 2500 pounds may be lifted to a recommended maximum height of 321 inches, a load of 3000 pounds may be lifted to a recommended maximum height of 300 inches, a load of 4000 may be lifted to a recommended maximum height of 270 inches, and so forth. It is apparent that such information can be used by the operator to determine heights to which a given load can be lifted and/or load size which can be lifted to a given height. The center of the load is also an important consideration. For example, if a load is moved from 24 inches forward of the mast to 34 inches forward of the mast, the load capacity may be reduced from 3000 pounds to 2100 pounds.
There is a need for a more convenient, attention getting, way of providing an operator with the information necessary to operate a fork lift truck to assist the operator in estimating or determining the weight of the load, the height of the forks and the speed of the truck.

Method and apparatus for providing operating information to an operator of a fork lift truck


A hinge (50) for a panel (26) allows movement of the panel (26) between a closed position inside a framed opening and an open position away from the opening. In an exemplary embodiment, the hinge (50) is used to attach a fan cowl panel (26) to a jet engine (20). To prevent loading the hinge (56) in an axial direction when the panel (26) is in the closed position, the panel (26) is movable axially along the hinge line (66). In the past this has resulted in the fan cowl panel (26) being misaligned during closure between the inlet cowl panel (22) and the thrust reverser cowl panel (24) resulting in damage to the fan cowl panel (26) and surrounding structure. The hinge (50) of the present invention automatically aligns a V-blade (38) of the fan cowl panel (26) with a V-groove (40) of the inlet cowl panel (22) during closure of the fan cowl panel (56) in order to overcome this misalignment problem.

The function of a hinge is typically to support a door, gate, panel or similar device for pivoting movement between a closed position inside a framed opening and an open position outside the opening. The hinge is typically designed so that the panel is movable only about the pivot axis of the hinge. Therefore, when the panel is moved to the closed position, it is usually aligned within the framed opening.
Sometimes, it is desirable to permit the panel to move axially along the hinge axis as well as to pivot about the hinge axis. This can create problems when the panel is moved to the closed position and the panel is not aligned with the framed opening. For example, such misalignment can prevent the panel from closing properly. In addition, any overlap between the panel and the frame can result in damage to these components when they contact each other during closing.
A situation where it is desirable for the panel to be movable axially along the hinge line involves the cowl panels on an aircraft jet engine. Referring to FIG. 1 of the drawings, there is shown a conventional aircraft jet engine indicated at 20 having inlet cowl 22 at the forward end of the engine, a pair of opposing curved, C-shaped thrust reverser panels 24 (only one of which is shown) at the rear end, and a pair of fan cowl panels 26 (only one of which is shown) positioned intermediate between the inlet cowl 22 and the thrust reverser panels 24.
In order to provide access for mechanics to an engine 28 located behind the panels, both fan cowl panels 26 are movable between a closed position shown in FIG. 1 and an open position shown in FIG. 2 where only the port fan cowl panel is shown open. As shown in FIG. 3, the fan cowl panel 26 is connected to a forward extending beam 30 of a strut 31 by three (forward, middle and aft) upper hinges 32 which allow the bottom of the panel 26 to be moved upward and outward from the engine 28 as shown in FIG. 2.
In conventional hinge design for engine cowl panels, the fan cowl panel 26 is free to move in a fore and aft direction along an axial hinge line designated by a line numbered 33 in FIG. 2. More particularly, each hinge 30 has a longer axial dimension than the width of the fitting (not shown) which attaches the panel 26 to the hinge 30. This allows the panel 26 to have a limited amount of movement in the fore and aft direction (relative to the engine) along the hinge axis 33.
The purpose of designing the hinge 32 to allow such axial freedom of movement is to prevent reacting certain flight loads to the hinge. More specifically, during flight when the fan cowl 26 is in the closed position, it is joined with the inlet cowl by a conventional blade and groove arrangement indicated at 34 in FIG. 4. That is, a forward edge portion 36 of the fan cowl 26 includes an annular blade (known as a "V-blade") 38 which projects inward from the inner surface of the fan cowl 26 and which extends vertically between the top and bottom of the fan cowl. When the fan cowl 26 is in the closed position, the blade 38 fits inside an annular groove 40 (known as a "V-groove") which extends vertically between the top and bottom of the inlet cowl 22 at a rear edge portion 42 of the inlet cowl.
Because there can be significant relative motion between the engine 28 and the inlet cowl 22 (with the fan cowl 26 firmly attached thereto), the fan cowl hinges 32 take both vertical and side loads, but do not take loads in the axial direction. That is, certain loads are transmitted axially to the fan cowl 26 from the inlet cowl 22. To avoid reacting these loads at the fan cowl hinges 26 and thereby avoiding possible damage to these hinges, the fan cowl hinges are designed as discussed above to permit movement of the fan cowl panels 26 relative to the strut 31 in an axial direction along the fan cowl hinges 32.
Although the aforementioned conventional design avoids unwanted loading of the fan cowl hinges 32 in the axial direction, it results in problems during the closing of the fan cowls 26 after completing ground maintenance on the engine. During the maintenance activity, it is possible for the fan cowl panel 26 to be pushed up against the forward or rear portions of the hinge fitting thereby causing misalignment.
More specifically, during closure it is difficult to properly align the fan cowl panels 26 between the inlet cowl 22 and the thrust reverser panels 24 so that the V-blade 38 is aligned with the V-groove 40 (FIG. 4). Moreover, these panels are quite large, can be difficult to maneuver, and provide a broad area which is subject to being blown and buffeted by wind. Furthermore, it is difficult for the maintenance personnel who are positioned below the engine, to determine whether the fan cowl panel 26 is properly aligned so that the V-groove blade 38 is aligned with the V-groove 40 at the top part of the engine during the initial portion of the closing sequence.
A typical problem during the initial part of the closing sequence occurs at the upper part of the engine when the forward edge 36 (FIG. 2) of the fan cowl panel 26 overlaps a rearward edge 42 of the inlet cowl so that the V-groove blade 38 is misaligned with the V-groove 40. When the mechanic closes the fan cowl panel, the V-blade 38 either misses the V-groove 40 entirely (fan cowl 26 fully aft) or the segment of the V-blade 38 nearest the hinge 30 contacts the inlet cowl structure forward of the V-groove 40. This can cause significant damage to the fan cowl and surrounding structure. In most of these instances, the mechanic is unaware that damage is occurring because the area of damage is out of view (on top of the engine) where there are large leverage forces at the misaligned contact points.


A high resolution sub-surface imaging and analysis system includes at least one repetitive, broad spectral width, optical signal generator. It further includes an optical processing system which provides a probe and a reference beam, applies the probe beam to the target to be analyzed, recombines the beams interferometrically and varies the coherence phase relationship of the two beams. It further includes electronic control and processing systems.

In a typical imaging and analysis system a target (or sample) is scanned in two dimensions by a probe signal. A corresponding detected signal provides information about the scanned points in the target which can then be displayed as an image and analyzed visually or can be analyzed electronically by an electronic processing system.
Sub-surface imaging is a powerful technique for non-destructive imaging or quantitative analysis of a variety of targets (also referred to as samples) including, semiconductor wafers, materials, human tissue, etc. The analysis can include scanning for defects, discontinuities, or in the case of tissue, abnormalities such as malignant growths.
High resolution sub-surface imaging is particularly valuable in the case of in vivo analysis of human tissue, where, non-destructive, non-invasive sub-surface scanning allows convenient analysis of potentially abnormal tissue without the need for a costly, time consuming and invasive biopsy.
Two dimensional scanning of imaging systems typically consists of scanning in one dimension along one direction or axis then, at a lower speed, scanning or stepping in a direction orthogonal to the first direction. Scanning is typically accomplished by electro mechanical devices, such as galvanometers or moving coils actuators. Other scanning technologies include rotating polygons which are expensive, physically large and have significant alignment issues or acousto-optic (AO) scanners which are expensive, require significant RF power and, since the angular deviation is small, involve systems that are physically large.
A typical sub-surface imaging technology, such as confocal microscopy, can generate tomographic images, for example of tissue, containing information similar to biopsy sections, by scanning a one dimensional array, parallel to the surface of the tissue (x-scan), at varying depths (z-scan) in tissues. The series of one dimensional scans at various depths can be displayed as a single tomographic image. High resolution is achieved by having a high numerical aperture (NA) focusing lens. Such lenses have an undesirable trade off between working distance and physical size of the lens. To achieve both high resolution and long working distance require large and therefore very expensive lenses. These systems also typically have undesirable moving parts or expensive and high power consumption AO modulators.
Another sub-surface imaging technology, optical coherence tomography, can also generate tomographic, biopsy like images. Such systems use a Super-luminescence diode (SLD) as the optical source. The SLD output beam has a broad bandwidth and short coherence length. Optical coherence tomography involves splitting the output beam into a probe and reference beam. The probe beam is applied to the system to be imaged or analyzed (the target). Light scattered or reflected back from the target is combined with the reference beam to form the measurement signal.
Because of the short coherence length only light that is scattered or reflected from a depth within the target such that the total optical path lengths of the probe and reference are equal combine interferometrically. Thus the interferometric signal provides a measurement of the scattering or reflection value at a particular depth within the target. By varying the length of the reference path length, a measurement of the scattering values at various depths can be measured and in this manner, the z-axis can be scanned. The reference path length is typically varied by physically moving a reflecting mirror.
In this case, high resolution in one dimension is achieved by using an SLD with a broad wavelength range (or large spectral width). This is typically limited by the properties of the material comprising the SLD, which represents a limitation on the achievable resolution. Because z dimension scanning requires varying the path length, at least some of the above mentioned limitations, such as mechanical moving parts or expensive AO modulators, apply to this imaging method also and, in general, these limitations represent a barrier to applying current imaging technologies to compact, cost effective high resolution applications.
Furthermore, SLDs emit incoherent light that consists of amplified spontaneous emissions with associated wide angle beam divergence which have the undesirable beam handling and noise problems. The beam is also a continuous wave (CW) source with no opportunity for temporal based signal enhancement. Also, because of the random nature of spontaneous emission, the reference signal must be derived from same SLD signal and have equal optical path length as the probe signal. Therefore the relative optical path length must be physically changed by a scanning mechanism and the reference path length must be of similar magnitude to the probe path length. These aspects cause systems based on SLD sources have significantly lower signal to noise characteristics and present problems in practical high resolution implementations.
In general one or more of these aspects of high cost components, moving parts, high power consumption and large physical size make existing imaging systems unsuitable for cost effective, compact, robust, high resolution imaging systems. There is therefore an unmet need for a cost effective, compact, robust, high resolution sub-surface imaging or analysis system.


A contextual input device includes a plurality of tactually discernable keys disposed in a predetermined configuration which replicates a particular relationship among a plurality of items associated with a known physical object. The tactually discernable keys are typically labeled with Braille type. The known physical object is typically a collection of related items grouped together by some common relationship. A computer-implemented process determines whether an input signal represents a selection of an item from among a plurality of items or an attribute pertaining to an item among the plurality of items. Once the selected item or attribute pertaining to an item is determined, the computer-implemented process transforms a user's selection from the input signal into an analog audio signal which is then audibly output as human speech with an electro-acoustic transducer.

This disclosure generally relates to a computer implementation and more specifically to a computer-implemented process and apparatus for presenting information in a particular physical format and for transforming this information into an audio output based upon a user's tactile selection.
Visually impaired individuals are frequently challenged by difficulties in perceiving spatial and/or other relationships using available tactual information. This situation presents itself in numerous ways to a visually impaired person in everyday life as there are few frames of reference available through the sense of touch from which he or she may conceptualize the world around them. Accordingly, there is a need in the relevant art that provides a way for a visually impaired person to conceptualize spatial and/or other relationships using the sense of touch. The approaches described in this section could be pursued, but are not necessarily approaches that have been previously conceived or pursued. Therefore, unless otherwise indicated herein, the approaches described in this section are not prior art to the claims in this application and are not admitted to be prior art by inclusion in this section.

This patent is subject to a terminal disclaimer.

Transforming a tactually selected user input into an audio output


The present invention is a method for providing chip scale package. The method of the present invention includes providing a die with a first side, a second side, and a plurality of edges; applying a substance which protects against electrostatic discharge to the first side of the die and to the plurality of edges; and providing components on the second side of the die. The method of the present invention protects the chip scale package from electrostatic discharges. Markings may also be placed on the substance without damaging the chip in the package.

The present invention relates to microprocessors, and more particularly to the manufacturing of chip scale packages.
Chip scale packages of microprocessors are sensitive to electrostatic discharges. How well they are protected from electrostatic discharges is an important concern. xe2x80x9cChip scale packagesxe2x80x9d, as used in this application, refers to packages in which the carrier on which the chip sits is approximately the same size as the chip. FIG. 1 illustrates a cross-section of a chip scale package manufactured with a conventional method Tessara BGA(copyright). The package 100 includes a chip 110 with a die 120. The die 120 is conventionally composed of a silicon material. The die 120 has a front side 10 and a back side 20. The circuitry (not shown) of the chip 110 is located on the face of the front side 10. The package 100 also includes a carrier (tape) 130 with an array of balls 140 connected to the front side 10 of the chip 110. The balls 140 are soldered to a carrier, in this example a printed circuit board (PCB). The array of balls 140 facilitates the connections between the circuitry on the die 120 and the substrate 150. To facilitate the connections between the die 120 and the balls 140, wires or tabs 160 are connected therebetween via bondingpads 170.
FIG. 2 is a flow chart illustrating a conventional method of manufacturing a chip scale package. Referring to FIGS. 1 and 2 together, first, the conventional wafer fabrication process is performed, via step 202. The wafer is manufactured with a Silicon die 120. The back side 20 of the die 120 is mounted on a tacky plastic tape, via step 204. Using a thin diamond saw, columns and rows of cells are sawed from the front side 10 of the die 120 completely through the Si and into the tacky plastic, via step 206. Then, a carrier tape with chip components (balls and a fan-in pattern of connections between the balls and the chip) such as the one developed by Tessara, Inc., are placed on the front side of the die 120, via step 208. The tape manufactured by Tessara is well known in the art and will not be further described here. A bonding tool is used to bond the wires or tabs 160 to the bonding pads 170, via step 210. With a needle-like tool, viable portions of the die 120 with carrier tape are ejected from the tacky plastic, via step 212. This leaves non-viable portions of the die 120 attached to the tacky plastic. Good dice and bonded carrier tape are place in tray, via step 214, retaining viable portions of the die 120 on the chip 110 while leaving non-viable portions on the tacky plastic. The tape and the non-viable portions of the die 120 are then thrown away. Data may be marked on the back side 20 of the die 120, via step 216. The data may include information such as the lot number, part number, and the speed of the chip 110. The resulting chip 110 has viable die with carrier, balls, and other components attached, as shown in FIG. 1. This chip 110 is then mounted onto a printed circuit board 150, via step 218, to form the final chip scale package 100.
A problem with the conventional method of manufacturing a chip scale packaging 100 related to the fact that the back side 20 of the die 120 is exposed to many environmental 20 factors. The exposed die renders the chip 110 particularly sensitive to possible electrostatic discharge (ESD). ESD can damage the chip 110 in two ways. First, the exposed die 120 can come in contact with a charged object which discharges to the chip 110. This is commonly referred to as the human body model (HBM). Second, the exposed die 120 may come in close proximity to a highly charged body, which induces a charge in the chip 110. This is commonly referred to as the charge device model (CDM). In both models, a high current occurs in the chip 10 for a short period of time, which damages one or more active areas of the chip 110. Thus, the package 100 manufactured with the conventional method is thus particularly sensitive to ESD.
Another problem with the conventional method of manufacturing a chip scale package 100 involves the marking of the package 100 on the back side 20 of the die 120. Infrared (IR) Lasers are often used to write this data directly into the die 120. However, the laser IR travels through the silicon die 120 since silicon is transparent to infrared light (not true of green light). When the light reaches the balls 140 on the front side 10 of the die 120, which are typically composed of Aluminum or some other metal, the light""s energy are deposited on the balls 140 since metals are not transparent to infrared light. This energy causes local melting of the Aluminum metal patterns of the balls 140, damaging the chip 110.
Accordingly, there exists a need for a method of manufacturing a chip scale package which will provide protection against electrostatic discharge and allow the writing of data using an infrared laser onto the chip in the package without causing damage. The present invention addresses such a need.
The present invention is a method for providing chip scale package. The method of the present invention includes providing a die with a first side, a second side, and a plurality of edges; applying a substance which protects against electrostatic discharge to the first side of the die and to the plurality of edges; and providing components on the second side of the die. The method of the present invention protects the chip scale package from electrostatic discharges. High contrast, colored markings may also be placed on the substance without damaging the chip in the package.

Method to improve chip scale package electrostatic discharge performance and suppress marking artifacts


The data latch circuit of the invention includes a means for short-circuiting an input terminal and an output terminal of an inverter and by connecting the input terminal to one electrode of a capacitor and sampling a data signal or a reference potential to the other electrode of the capacitor, an accurate operation can be obtained without being influenced by variations in the TFT characteristics even when the amplitude of an input signal is small relatively to the width of a power supply voltage.

In recent years, development of active matrix display devices such as a liquid crystal display device and a light emitting device has been advancing in response to the demand for its application to mobile devices and the like. In particular, technologies for integrally forming pixel circuits and driver circuits (hereinafter collectively referred to as an 'internal circuit') using thin film transistors (Thin Film Transistors; TFTs) formed of polycrystalline semiconductors (poly-Si; polysilicon) formed on an insulator are actively developed. The internal circuit includes a source signal line driver circuit, a gate signal line driver circuit or the like. These driver circuits or the like control the pixel circuits which are arranged in matrix.
In addition, the internal circuit is connected to a controller IC or the like (hereinafter referred to as an 'external circuit') through an FPC (Flexible Printed Circuit) and the operation is controlled. Generally, a drive voltage (namely, amplitude of a signal) of an IC used as an external circuit is lower than a drive voltage of an internal circuit in view of reduction in power consumption. At present, an IC which operates at a voltage of 3.3 V is typically used as an external circuit, while a drive voltage of an internal circuit is at 10 V, which is higher as compared to that of the external circuit. Therefore, it is necessary in the case of inputting a signal at 3.3 V from the external circuit to the internal circuit that the amplitude of the signal is converted with a level shift circuit or the like so as to be at around 10 V.
However, in the case of level shifting in the external circuit, such problems arise as an increase of components such as a level shift IC and a power supply IC and an increase in the power consumption. On the other hand, in the case of level shifting in the internal circuit before inputting to a shift register, a data latch circuit or the like, such problems arise as an increase in a layout area and the power consumption or the difficulty of high frequency operation. Therefore, it is required a method for directly inputting a signal having an amplitude of a low voltage from an external circuit to a shift register, a data latch circuit or the like which compose a driver circuit of the internal circuit to obtain an accurate operation (this method is hereinafter referred to as 'low voltage drive').
As a driving method of an active matrix display device, there are a digital drive method and an analog drive method. In the case of using the digital drive method, a data latch circuit which samples digital video signals in sequence according to sampling pulses from a shift register is required in the a source signal line driver circuit which compose a internal circuit.
Among data latch circuits, there is the one which deals with an input of a low voltage signal (refer to the following Patent Document 1.).
(Patent Document 1: Japanese Patent Laid-Open No. Hei11-184440)
However, the data latch circuit which deal with an input of a low voltage signal may malfunction due to the influence of variations in the TFT characteristics.
Now, a general conventional data latch circuit is shown in FIG. 2(A). The data latch circuit includes a clocked inverter 2005 and an inverter 2006. The clocked inverter 2005 includes P-channel TFTs 2001 and 2002 and N-channel TFTs 2003 and 2004 all connected in series. The gate electrode of the P-channel TFT 2001 is input with a sampling pulse (LAT) from a shift register while the source electrode have a connecting structure such that a power supply VDD is supplied. The gate electrode of the N-channel TFT 2004 is input with an inverted pulse (LATB) of the sampling pulse (LAT) while the source electrode have a connecting structure such that a power supply VSS is supplied. The gate electrodes of the P-channel TFT 2002 and the N-channel TFT 2003 are input with a digital signal (DATA). In addition, the drain electrodes of the P-channel TFT 2002 and the N-channel TFT 2003 are connected to the inverter 2006.
FIG. 2(B) is a timing chart of the conventional data latch circuit in FIG. 2(A). Operation of the conventional data latch circuit is described with reference to FIGS. 2(A) and 2(B). It should be noted that a digital signal (hereinafter referred to as a 'data signal') to be input has a digital format, that is a signal having a potential representing '1' and a potential representing '0'. In this specification, the level of the potential representing '1' is referred to as 'H level' and a potential representing '0' is referred to as 'L level' in any case, regardless of the potential. The potential level satisfies L level<H level unless specially described.
First, in a period T1, the sampling pulse (LAT) at L level is input from a shift register. Then, the LAT is at L level and the LATB is at H level, turning ON the P-channel TFT 2001 and the N-channel TFT 2004. At this time, when the DATA is at H level, the P-channel TFT 2002 is turned OFF while the N-channel TFT 2003 is turned ON, thus the clocked inverter 2005 outputs VSS. On the other hand, when the DATA is at L level, the P-channel TFT 2002 is turned ON while the N-channel TFT 2003 is turned OFF, thus the clocked inverter 2005 outputs VDD.
(Problems to be Solved by the Invention)
In the conventional data latch circuit, its drive is described with reference to FIGS. 2A and 2B in the case of performing low voltage drive, that is the case of directly inputting the digital signal DATA from an external circuit. It is assumed here that VSS is −2 V, VDD is 5 V, H level each of LAT and LATB is 5 V, L level is −2 V, and H level of DATA is 3V, and L level is at 0 V.
First, in the period T1, a sampling pulse, LAT is input from a shift register. Then, the LAT is at L level (−2V) while the LATB is at H level (5V), thereby turning ON the P-channel TFT 2001 and the N-channel 2004. At this time, when the DATA is at H level (3V), the P-channel TFT 2002 is turned OFF while the N-channel TFT 2003 is turned ON. Thus, the clocked inverter 2005 outputs VSS. At this time, however, if the threshold voltage |VTH| of the P-channel TFT 2002 is 2 V or less, the P-channel TFT 2002 is incidentally turned ON and thus a leakage current flows.
Furthermore, the characteristics of the P-channel TFT 2002 and the N-channel TFT, in particular, the threshold characteristics vary. As a result, when the ON current of the P-channel TFT 2002 at |Vgs|=2 V is larger than the ON current of the N-channel TFT 2003 at |Vgs|=5 V, the logic is inverted, which causes the output of the clocked inverter 2005 to be at VDD, not VSS.
On the other hand, when the DATA is at L level (0V) and when the |VTH| of the N-channel TFT 2003 is 2 V or less, the N-channel TFT 2003 is incidentally turned ON and thus a leakage current flows. Furthermore, when the ON current of the N-channel TFT 2003 at |Vgs|=2 V is larger than the ON current of the P-channel TFT 2002 at |Vgs|=5 V, the logic is inverted, which causes the output of the clocked inverter 2005 to be at VSS, not VDD.
The invention is made in view of the foregoing problems and provides a data latch circuit which is hardly influenced by variations in the TFT characteristics, and capable of operating with low power consumption and high frequency.

Data latch circuit and electronic device

Semiconductor Energy Laboratory Co., Ltd.


A window cover for a military vehicle which includes both upper and lower armored plates angled away from an underlying vehicle window, an upper reflector overlying the underside of the upper armored plate, and a lower reflector, penetrable by projectiles, positioned in front of the lower armored plate. The window cover allows an occupant of the vehicle to view outside the vehicle window, as light is reflected off the lower reflector onto the upper reflector and then toward the occupant.

1. Field of the Invention
The invention disclosed herein relates to a military vehicle window cover for protecting an underlying windshield, and more specifically to a military vehicle window cover using a combination of mirrors and plates of bullet-proof armor to deflect or stop incoming fire while allowing unobstructed visibility through the vehicle's window.
2. Description of the Background of the Invention
Bullet-resistant glass-pane windows, while offering some improvement to battle zone survivability, have by nature many unwanted traits that have limited their effectiveness at maintaining functionality of a vehicle under fire and safety of the occupants within that vehicle. A bullet-resistant window is a multi-layered assembly of plastic and glass, held in place with a single welded frame and adds hundreds of pounds of excess weight to a vehicle, causing a high cost of replacement when damaged and vehicle performance to suffer due to the added weight. Additionally, with the layered construction of a bullet-resistant window, night vision gear is rendered inoperable and loss of visibility through the window is a certainty due to the shattering of the bullet-resistant glass when projectiles, such as bullets and shrapnel, hit its surface.
Improvements have been made in this art, notably U.S. Pat. No. 5,452,641, which proposes a transparent armor piercing protection system with angled, mirrored louvers in an aperture with a sheet of transparent armor provided adjacent to the aperture. When a projectile strikes the louvers, the louvers will either stop the projectile or cause it to fragment, with the remaining fragments stopped by the adjacent sheet of transparent armor. The solution of louvers themselves does not essentially solve the problems of weight or visibility loss, as each louver is constructed to stop or fragment projectiles, adding to the overall weight and marring the mirrored surface of each louver. Additionally, the adjacent sheet of transparent armor fractures when stopping or deflecting projectiles, and loss of vision still occurs.


An operating apparatus for a medical device and a corresponding operating method are provided. The operating apparatus includes a projector that is configured for real, virtual, or real and virtual projection of an operator surface onto a display element, and a capture facility for non-contact capturing of an interaction of an operator with the projected operator surface. A sensor system for independent detection of the interaction is arranged separately from the capture facility on the display element.

The present embodiments relate to an operating apparatus for a medical device and an operating method for operating a medical device using an operating apparatus of this type.
US 2015/0248170 A1 discloses a method and a system for providing a virtual user interface related to a totem. The user interface is created based on a detected manipulation of the totem. The virtual user interface is rendered at map points determined from a virtual world model. The map points are linked to a position of the totem, so that the user interface, when viewed by a user, appears to be stationary at the position of the totem.

Operating apparatus and operating method for operating a medical device


A process for the production of a homogeneous, thermoplastically processible melt. The process includes a. introduction of chemically modified starch into an intake zone of an extruder and conveyance thereof to a receiving zone, b. addition of a prehomogenized liquid mixture of plasticizer, emulsifier, and additives, followed by mixing and further conveyance of the starch liquid mixture through the receiving zone at elevated temperature, c. destructurization of the modified starch without adding any water and conveyance of the starch and mixture at elevated temperature to form a homogeneous, thermoplastically processible melt, d. degassing of the melt at elevated temperature and under reduced pressure, and e. extrusion thereof through a die at elevated temperature and pressure.

It is desirable to use starch, which is a vegetable carbohydrate, as a natural plastic material, in various areas employing known methods of plastics processing. Owing to their granular structure, however, natural starches must be destructurized before they can be thermoplastically processed.
U.S. Pat. No. 4,673,438 describes a six-stage injection molding process for producing a shaped article from a starch-water composition having a water content of 5% to 30% by weight. A disadvantage of the high water content is that a special apparatus is required so that the plasticizer water does not escape in the form of steam at the high processing temperatures.
WO-OS 90/05 161 describes a process for producing thermoplastically processible starch, wherein the reduction of the melt temperature of the starch or starch derivatives is achieved by addition of at least 5% to 35% by weight of additives having a defined solubility parameter. WO-OS 90/14 938 provides a process for producing a shaped article from water and starch material having a high amylose content; the process includes degasification.
The methods of both of the above-mentioned WO Applications have certain disadvantages. When employing processes which are normal in the plastics industry in which the additives (for example plasticizers) are introduced into the polymer melt in the solid state downstream of the feed zone, inhomogeneities in the starch melt and the granulates derived therefrom are produced. Thus, the remainder of the processing operation is impaired as, for example, by strand breakages. Moreover, it is not possible to produce a homogeneous, thermoplastically processible starch melt with apparatus customary in the plastics industry and designed for the processing of polymers. The prior art lacks the necessary teaching for this.
Furthermore, the usual method of controlling the melt viscosity via the plasticizer content has proven unsuitable, as the necessary large quantities of plasticizers also reduce the stability of the melt so that the melt stream tears; this is particularly disadvantageous during the production of films.

Process and apparatus for producing starch melt and products obtainable by this process


The present application discloses methods and devices for intercommunication between mobile terminals based on digital networks. A first mobile terminal may connect to a uniquely identified server based on a first terminal identifier corresponding to the first mobile terminal. In addition, the first mobile terminal may connect to the server through a default connection setup embedded in the first terminal identifier. By acquiring terminal identifiers corresponding to interacting mobile terminals, the first mobile terminal may establish communication channels with the interacting mobile terminals. After adding the terminal identifiers of the interacting mobile terminals to the contact lists of the first mobile terminal, different regions of the first mobile terminal may be designated to the interacting mobile terminals so that the regions may display the status of communication and serve as interfaces to control receiving, playing, recording, and transmitting digital contents encoding voice messages.

Two-way radios, or walkie-talkies, are portable radio transceivers that do not require any network connection for sound or voice exchanges. Two-way radio is more suitable for frequent contacts between fixed partners because no connection or exchange charges are generated. The device was first developed for the military but later became widely used. The main features of two-way radios include: half-duplex mode (you can only accept or send voice exchanges at a particular time) and you need to press a button before the contents can be transferred. Most two-way radios look like a typical hand-held mobile phone with an antenna on the top.
Traditional two-way radios use antenna for transmitting and receiving radio signals. Although it does not require network support or generate charges, two-way radios still have the following disadvantages: the communication is significantly limited by distance; the devices must be purchased and sometimes supplemental transmitting devices need to be purchased separately, making the overall cost very high; the two-way radios may only communicate between one another, without any connection to regular mobile phones and other devices; most countries heavily regulate radio frequencies—using public frequencies jeopardizes privacy, but using other frequencies needs government approval.
In order to solve the above problems of the conventional two-way radio, some application programs have been developed for mobile phones. After installing one of the application programs, users may communicate with one another in a similar manner as a conventional two-way radio, though the communication is based on digital network technologies such as WiFi, GRPS, and 3G. Such an approach eliminates disadvantages such as distance limitations, purchasing of separate intercom equipments, lack of privacy protection, and government regulations of frequencies. However, this approach also requires the users to download, install, and get familiar with the application software, resulting in complex operation and causing inconvenience.
Accordingly, it is necessary and desirable to provide a new technology, so as to resolve the technical problem and improve the above-mentioned approach.

Intercommunication methods and devices based on digital networks

TECENT TECHNOLOGY (SHENZHEN) COMPANY LIMITED


A circuit may be configured detect current in different phases of an N-phase power converter. The circuit may comprise a first set of elements defining at least part of a first current loop associated with a first phase of the power converter, wherein the first set of elements is configured to detect current during the first phase of the power converter. In addition, the circuit may comprise a second set of elements defining at least part of a second current loop associated with a second phase of the power converter, wherein the second set of elements is configured to detect current during the second phase of the power converter when a duty cycle associated with the different phases is greater than 100/N, and wherein the first set of elements is configured to detect current during the second phase of the power converter when the duty cycle is less than 100/N.

In many systems, power converters are used to control voltage and/or current levels withing the system. Power converters may comprise buck converters, boost converters, buck/boost converters, or other types. Some buck converters, for example, may comprise an LC circuit that is connected to a switch node, where the switch node is positioned between a high-side power switch and a low-side power switch. The high-side and low-side power switches are controlled by driver circuits via modulation control signals, such as pulse width modulation (PWM) signals, pulse frequency modulation (PFM) signals, pulse duration modulation signals, pulse density modulation signals, or another type of modulation control signal.
In particular, modulation control signals can be applied to the gates of the high-side and low-side power switches to control the on/off switching of the power switches. The on/off switching of the power switches effectively controls the delivery of power to the switch node that is located between the high-side switch and the low-side switch that form a half bridge. In this way, by controlling the high-side and low-side switches of a DC/DC converter, a desired level of current and voltage can be output from the DC/DC converter in order to provide power to a load or another component of the system.
Multiphase power converters have been developed to deliver high levels of current, and to adapt to changing load conditions. Multiphase power converters typically include separate inductors for each phase of the power converter. Current can be delivered in phases though the different inductors to achieve a higher level of overall current through the power converter. It is often desirable to monitor the current delivered in different phases of a multiphase power converter, and it is desirable to achieve current balance among the different phases. Where there is current mismatch between different phases, this can sometimes result in thermal imbalances or other undesirable effects or degradation in the performance of the power converter circuit.

Dynamic current detection loops for multiphase power converter


As is described above, an optical wavelength division multiplexing and transmission apparatus according to the present invention has the configuration in which a plurality of slave racks coupling to a master rack can be additionally installed one after another with the master rack. Therefore, in cases where it is desired to expand a function of a transmitter and a function of a receiver due to the increase of a quality of information to be transmitted, the additional installation of the slave rack can be performed without exerting influence on a communication means installed in advance and currently used. Accordingly, it can be expected that the optical wavelength division multiplexing and transmission apparatus is adapted for the optical communication service which is more and more increased in the future.

FIG. 1 is a block diagram showing the configuration of a conventional optical wavelength division multiplexing and transmission apparatus. In FIG. 1, 101 indicates a transmitter end rack. 102 indicates a rack of a receiver end. The transmitter end rack 101 accommodates an optical wavelength multiplexer 111 and an amplifier 112. A plurality of input optical wavelength signals are multiplexed in the optical wavelength multiplexer 111, and an output of the optical wavelength multiplexer 111 is optically-amplified in the amplifier 112. The receiver end rack 102 accommodates an amplifier 114 and an optical wavelength demultiplexer 115. A multiplexed signal is transmitted and optically-amplified in the amplifier 114, and an output of the amplifier 114 is demultiplexed in the optical wavelength demultiplexer 115 to a plurality of optical wavelength signals having wavelengths different from each other. 113 indicates an optical transmission line formed of an optical fiber which connects the transmitter end rack 101 and the receiver end rack 102. A plurality of optical relaying units are normally placed at appropriate positions of the optical transmission line 113. However, the optical relaying units are omitted in this specification to simplify the description.
Next, an operation will be described below.
In a wavelength division multiplexing and transmission system (hereinafter, called WDM transmission system), a large number of types of information are respectively assigned to a plurality of optical wavelength signals having wavelengths different from each other to convert the types of information into the optical wavelength signals. In the transmitter end rack 101, the converted optical wavelength signals λ1, λ2, λ3, . . . and λn are taken out from the optical wavelength multiplexer 111 as a multiplexed signal. This multiplexed signal is amplified in the amplifier 112 and is sent out to the optical transmission line 113. In the receiver end rack 102, the multiplexed signal transmitted through the optical transmission line 113 is amplified in the amplifier 114 and is demultiplexed to the optical wavelength signals λ1, λ2, λ3, . . . and λn having wavelengths different from each other in the optical wavelength demultiplexer 115. The optical wavelength signals λ1, λ2, λ3, . . . and λn taken out from the optical wavelength demultiplexer 115 are demodulated in a latter stage to a plurality of electric signals denoting the types of original information.
Because the conventional optical wavelength division multiplexing and transmission apparatus has the above-described configuration, it is not easy to expand a multiplex function so as to increase the number of optical wavelength signals. A plurality of wavelengths of a plurality of optical wavelength signals multiplexed in an optical wavelength multiplexer are set to be placed at wavelength intervals so as not to interfere with each other. Therefore, in cases where the number of optical wavelength signals multiplexed with each other is increased due to the increase of a quantity of information to be transmitted, wavelengths assigned to pieces of information and possible to be processed in both an optical wavelength multiplexer and an optical wavelength demultiplexer run short. In this case, it is required to replace both the optical wavelength multiplexer and the optical wavelength demultiplexer with both another optical wavelength multiplexer and another optical wavelength demultiplexer in which additional optical wavelength signals can be received and processed. However, because both the optical wavelength multiplexer and the optical wavelength demultiplexer set in operation are taken out from the conventional optical wavelength division multiplexing and transmission apparatus, the communication is interrupted during the replacement. Therefore, a problem has arisen that it is not easy to actually perform the replacement.
The present invention is provided to solve the above-described problem, and the object of the present invention is to provide an optical wavelength division multiplexing and transmission apparatus in which both an optical wavelength multiplexer and an optical wavelength demultiplexer for an early operation are installed at an processing capacity corresponding to a prescribed number of optical wavelength signals to suppress an initial cost and a plurality of groups of other optical wavelength multiplexers and other optical wavelength demultiplexers suitable for the demand of communication are additionally installed one after another while maintaining a communication condition.

Optical wavelength division multiplexing device


A curable composition includes a polyfunctional polymerizable compound A1 represented by the following general formula (1) and a polyfunctional compound A2 which differs from A1.

1. Field of the Invention
The present invention relates to a curable composition and an image forming method using the same.
2. Description of the Related Art
A compound which is cured by crosslinking a binder or the like by applying energy such as light and heat is widely used in industrial applications of coating materials, paints, printing inks, adhesives, optical materials, laminate materials in electronic devices, electrically insulating materials, resist materials, or the like, as a raw material for various polymers or curable compositions. For example, the weather resistance or durability of an image is increased by blending a curable compound which is cured by irradiation with actinic energy rays such as ultraviolet rays as a curing agent or a crosslinking agent into an ink or paint, and irradiating the blend with ultraviolet rays or the like after image formation to polymerize crosslinkable compounds, thereby forming a cured film.
Various polyfunctional polymerizable compounds have been studied as the curable compound.
Examples of a functional group of the polyfunctional polymerizable compound include groups containing ethylenically unsaturated groups, such as a (meth)acryloyl group, a vinyl group, and a maleimide group, an epoxy group, an oxetane ring group, an isocyanate group, a hydroxyl group, and a carboxyl group. Among these, an ethylenically unsaturated group has high stability and easily undergoes polymerization by light irradiation or heating in the presence of a polymerization initiator, and therefore, a polyfunctional polymerizable compound having an ethylenically unsaturated group has a wide range of applications.
As a compound having a (meth)acryloyl group, polyfunctional (meth)acryloylamide compounds have also been actively studied, in addition to polyfunctional (meth)acrylates. Regarding polyfunctional (meth)acryloylamide compounds, applications in, for example, actinic energy ray-irradiated aqueous inks (see JP2005-307198A) or conductive polymer paints (see JP2007-31372A) have been studied.

Curable composition and image forming method

Abstract: (In the formula, R1 represents a hydrogen atom or a methyl group. L1 represents a linear or branched alkylene group having 2 to 4 carbon atoms. However, L1 does not have a structure in which the oxygen atom and the nitrogen atom bonded on both ends of L1 are bonded to the same carbon atom of L1. L2 represents a divalent linking group. k represents 2 or 3. x, y, and z each independently represent integers of 0 to 6, and x+y+z equals 0 to 18.)


A semiconductor device has a semiconductor die with a plurality of bumps formed over a surface of the first semiconductor die. A penetrable adhesive layer is formed over a temporary carrier. The adhesive layer can include a plurality of slots. The semiconductor die is mounted to the carrier by embedding the bumps into the penetrable adhesive layer. The semiconductor die and interconnect structure can be separated by a gap. An encapsulant is deposited over the first semiconductor die. The bumps embedded into the penetrable adhesive layer reduce shifting of the first semiconductor die while depositing the encapsulant. The carrier is removed. An interconnect structure is formed over the semiconductor die. The interconnect structure is electrically connected to the bumps. A thermally conductive bump is formed over the semiconductor die, and a heat sink is mounted to the interconnect structure and thermally connected to the thermally conductive bump.

Semiconductor devices are commonly found in modern electronic products. Semiconductor devices vary in the number and density of electrical components. Discrete semiconductor devices generally contain one type of electrical component, e.g., light emitting diode (LED), small signal transistor, resistor, capacitor, inductor, and power metal oxide semiconductor field effect transistor (MOSFET). Integrated semiconductor devices typically contain hundreds to millions of electrical components. Examples of integrated semiconductor devices include microcontrollers, microprocessors, charged-coupled devices (CCDs), solar cells, and digital micro-mirror devices (DMDs).
Semiconductor devices perform a wide range of functions such as high-speed calculations, transmitting and receiving electromagnetic signals, controlling electronic devices, transforming sunlight to electricity, and creating visual projections for television displays. Semiconductor devices are found in the fields of entertainment, communications, power conversion, networks, computers, and consumer products. Semiconductor devices are also found in military applications, aviation, automotive, industrial controllers, and office equipment.
Semiconductor devices exploit the electrical properties of semiconductor materials. The atomic structure of semiconductor material allows its electrical conductivity to be manipulated by the application of an electric field or base current or through the process of doping. Doping introduces impurities into the semiconductor material to manipulate and control the conductivity of the semiconductor device.
A semiconductor device contains active and passive electrical structures. Active structures, including bipolar and field effect transistors, control the flow of electrical current. By varying levels of doping and application of an electric field or base current, the transistor either promotes or restricts the flow of electrical current. Passive structures, including resistors, capacitors, and inductors, create a relationship between voltage and current necessary to perform a variety of electrical functions. The passive and active structures are electrically connected to form circuits, which enable the semiconductor device to perform high-speed calculations and other useful functions.
Semiconductor devices are generally manufactured using two complex manufacturing processes, i.e., front-end manufacturing, and back-end manufacturing, each involving potentially hundreds of steps. Front-end manufacturing involves the formation of a plurality of die on the surface of a semiconductor wafer. Each die is typically identical and contains circuits formed by electrically connecting active and passive components. Back-end manufacturing involves singulating individual die from the finished wafer and packaging the die to provide structural support and environmental isolation.
One goal of semiconductor manufacturing is to produce smaller semiconductor devices. Smaller devices typically consume less power, have higher performance, and can be produced more efficiently. In addition, smaller semiconductor devices have a smaller footprint, which is desirable for smaller end products. A smaller die size may be achieved by improvements in the front-end process resulting in die with smaller, higher density active and passive components. Back-end processes may result in semiconductor device packages with a smaller footprint by improvements in electrical interconnection and packaging materials.
In a fan-out wafer level chip scale package (FO-WLCSP), a semiconductor die is commonly mounted to a temporary support carrier with an adhesive layer. An encapsulant or molding compound is deposited over the semiconductor die for environmental protection from external elements and contaminants. The encapsulation process imposes forces on the semiconductor die as the encapsulant is deposited around the die. The adhesive layer over the carrier may be insufficient to hold the semiconductor die in place during encapsulation. The forces can cause vertical or lateral shifting or movement of the semiconductor die.
Following encapsulation, the temporary carrier and adhesive layer are removed and a build-up interconnect structure is formed over the semiconductor die and encapsulant. A plurality of vias must be formed through the insulating layer of the interconnect structure to make electrical connection to the contact pads on the semiconductor die. The vias are formed by mechanical drilling or laser cutting. The via formation often leaves residue and other contaminants on the contact pads, which can interfere with electrical connection and reduce electrical performance.

Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation


A soft switched PWM AC to DC power converter for a DC power supply is disclosed. The power supply includes a power factor corrector (PFC) converter with a power boost topology, a DC/DC converter with a forward topology and a fly-back converter which serves as an auxiliary power supply for the controller components. The three converters are synchronized by a gate array logic (GAL) IC to minimize EMI noise. The GAL also conditions the PWM for the PFC and the DC/DC converter to provide very precise switching control. Synchronizing and PWM timing signals are derived by the GAL using a high-speed clock signal that is input to the GAL as a data input. The clock signal is repeatedly divided using synchronous division to yield a digital monostable timing signal that enables very precise control of converter switches.

It is generally recognized that there are benefits to be realized by operating pulse-width-modulated (PWM) converters at high frequencies. High-frequency operation permits lower cost and lighter weight converters to be constructed. Soft switching permits even higher switching frequencies. In order to successfully realize a PWM that operates at high frequencies, however, it is necessary to achieve very precise control of the PWM switches and to precisely synchronize the different converters used in the power supply. While many designs for such power supplies have been invented, to date a design which enables PWM control and converter synchronization precise enough for an efficient and robust power supply has not been developed.

Soft switched PWM AC to DC converter with gate array logic control