Disclosed herein is an indicator position detecting device that reduces unwanted radiation from a sensor section, while being capable of robustly charging a pen-type position indicator with the sensor section, without requiring reduction in area size of a display region and a detecting region of the sensor section even when the overall device size is reduced. The sensor section has an X-axis direction loop coil group and a Y-axis direction loop coil group disposed in intersecting directions. When a transmission signal is supplied to loop coils of at least one of the X-axis direction loop coil group and the Y-axis direction loop coil group, a control circuit controls a selecting circuit so as not to supply the transmission signal to a determined number of loop coils disposed in at least one peripheral region of the sensor section.

1. Technical Field
The present invention relates to an indicator position detecting device including an indicated position detecting sensor of an electromagnetic induction system, and particularly to the control of loop coils formed as the indicated position detecting sensor.
2. Description of the Related Art
A position input device of an electromagnetic induction system has recently been used as an input device for a tablet type PC (personal computer) or the like. The position input device includes a position indicator in the shape of a pen (pen type position indicator) and an indicator position detecting device having an input surface on which pointing operation and the inputting of characters, figures, and the like are performed using the pen type position indicator. The pen type position indicator has a resonance circuit including a coil and a capacitor. On the other hand, the indicator position detecting device has an indicated position detecting sensor (position detecting coils), in which an X-axis direction loop coil group formed by disposing a plurality of loop coils in a horizontal direction (X-axis direction) and a Y-axis direction loop coil group formed by disposing a plurality of loop coils in a vertical direction (Y-axis direction) are laminated.
As an example of detecting a position indicated by the pen type position indicator on the indicator position detecting device, one loop coil is selected from the plurality of loop coils forming the indicated position detecting sensor in predetermined order, and a transmission signal is sent out from the selected loop coil to the pen type position indicator. The capacitor of the pen type position indicator is thereby charged. Next, the loop coil used for the transmission is connected to a receiving circuit to receive a signal transmitted from the resonance circuit of the pen type position indicator. Such signal transmission and reception is performed while the loop coils are sequentially selected, whereby the position indicated by the pen type position indicator can be detected on the indicator position detecting device.
The detection of the position indicated by the pen type position indicator on the indicator position detecting device is described in more detail as follows. First, (1) in order to detect where the pen type indicator is on the indicated position detecting sensor, a global scan, which sequentially selects all of the loop coils and detects the position indicated by the pen type position indicator, is performed to identify roughly the indicated position on the indicated position detecting sensor. Next, (2) a sector scan, which selects only a predetermined number of loop coils around the roughly identified position in order and performs signal transmission and reception, is performed to identify the position indicated by the pen type position indicator accurately. Thus, the position indicated by the pen type position indicator on the indicated position detecting sensor can be detected. Incidentally, various inventions have been made for the position input device of the electromagnetic induction system, and Japanese Patent Laid-Open No. 2002-244806, for example, describes details of an example of configuration of the position input device and the like.
Such a position input device of the electromagnetic induction system is not only used as an external input device of a personal computer or the like but also used as an input device of a tablet type PC as described above or an input device of a high-functionality portable telephone terminal referred to as a smart phone. In this case, the position input device of the electromagnetic induction system is disposed so as to be superposed on a display element such as an LCD or the like.


A method for communicating among a plurality of peer nodes in a network environment is provided. A discovery command is communicated from a current peer node to at least one neighbor peer node, the neighbor peer node in communication with the current peer node. An aggregated list of peer nodes is received at the current peer node, the aggregated list of peer nodes comprising information about at least one peer node in communication with the at least one neighbor node. Programs and systems of using the method are also provided.

1. Field of the Invention
The present invention relates to methods for communicating between two or more "peer" target devices in a network environment. More specifically, the present invention relates to a method for communicating and distributing information, such as files or search commands, in a network environment by establishing first contact from a first peer target device to a predetermined number of neighbor nodes and receiving aggregated information, such as responses to commands and queries, about the network from the neighbor nodes.
2. Description of the Related Art
During current approaches to distributing information, such as files or search commands, to one or more target devices in a network environment, one or more central servers may be used to communicate the information to a plurality of target devices.
Such a centralized system presents some difficulties. For example, an adverse effect on the central server will affect all target devices communicating with the server.
Other approaches to distributing information use a "peer-to-peer" means of distribution, i.e., a system in which two or more target devices are able to communicate directly with each other. Current protocols of "peer-to-peer" distributed searching and file-sharing present certain difficulties, however.
For example, with the Napster "peer-to-peer" protocol, the files to be shared stay on each target device without passing through a server. However, Napster still uses a server to provide the ability to search for particular files and initiate a direct transfer between the clients. Thus, the Napster protocol may encounter some of the server-related difficulties described above. Additionally, the Napster protocol may encounter such peer-to-peer protocol-related problems as network congestion and search results that are constantly changing as target devices enter and leave the network. The Napster protocol may require large bandwidths, may slow communication and may impede results.
Meanwhile, with the Gnutella protocol, the files to be shared stay on each target device. Additionally, the capability to search for particular files and is also available on each target device. Thus, each target device is able to act as both client and server. However, when a search is conducted from an originating target device using the Gnutella protocol, the search results received at the originating target device may change from second to second as other target devices responding to the originating target device enter and leave the network. Furthermore, when a target device has a response to the originating target device, the results are relayed to the originating target device through the intervening target devices that forwarded the original request. As a search spreads over the Gnutella network, the path from the originating target device to another target device with the desired file may become longer and more convoluted. Thus, the search results may be delayed and may even become outdated before they arrive at the originating target device. The transfer of search results from target devices far away from the originating device may require large bandwidths, may slow communication and may impede results.
It would be desirable, therefore, to provide a method of communicating information among a plurality of target devices that is more efficient, reduces network and processor overhead and improves performance.

Method and system for peer to peer communication in a network environment

International Business Machines Corporation


Herein disclosed is a robot arm mechanism comprising a first arm link mechanism and a second arm link mechanism, a robot arm driving mechanism for driving the first arm link mechanism and the second arm link mechanism, and a link retaining mechanism for pivotably retaining the first arm link mechanism and the second arm link mechanism, in which a third arm link and a fourth arm link of the first arm link mechanism are kept forward in a first rotation direction, in which the first arm link mechanism and the second arm link mechanism are extended, thereby enabling to prevent the quadric crank chain constituting the robot arm mechanism from being flattened out while the first arm link mechanism and the second arm link mechanism are extended, and improving resistance to deformation, in comparison with the conventional robot arm mechanism.

1. Field of the Invention
The present invention relates to a robot arm mechanism having arms contracted and extended, and more particularly to a robot arm mechanism incorporating an arm driving mechanism for driving the arms to assume its contracted and extended positions.
2. Description of the Related Art
Up until now, there have been proposed a wide variety of conventional robot arm mechanisms available in the process of producing semiconductors in which the robot arm mechanism is operated to have arms contracted and extended to handle works, i.e., objects to be treated. These objects may include works such as, for example, wafers and other precision parts that are to be transferred and then unloaded onto a work table by the robot arm mechanism.
One typical example of the conventional robot arm mechanism of this type is disclosed in, for example, Japanese Patent Laid-Open Publication No. 2000-208588. Such conventional robot arm mechanism 900 is shown in FIG. 20 as comprising a first arm link mechanism 910, a second arm link mechanism 920, a robot arm driving mechanism 930, and a link retaining mechanism 940.
The first arm link mechanism 910 consists of a quadric crank chain comprising a first arm link 911, a second arm link 912 substantially in parallel relationship with the first arm link 911, a third arm link 913, and a fourth arm link 914 substantially in parallel relationship with the third arm link 913. The second arm link mechanism 920 consists of a quadric crank chain comprising a first arm link 921, a second arm link 922 substantially in parallel relationship with the first arm link 921, a third arm link 923, and a fourth arm link 924 substantially in parallel relationship with the third arm link 923.
The first and second arm links 921, 922 of the second arm link mechanism 920 are substantially equal in length to the first and second arm links 911, 912 of the first arm link mechanism 910, respectively. The third arm link 923 of the second arm link mechanism 920 is integrally formed with and fixedly connected with the third arm link 913 of the first arm link mechanism 910.
The conventional robot arm mechanism 900 has a reference line 900a, and further comprises a robot arm driving mechanism 930. The robot arm driving mechanism 930 is adapted to drive the first arm link mechanism 910 so as to rotate the first arm link 911 and the second arm link 912 of the first arm link mechanism 910 with respect to the reference line 900a.
The link retaining mechanism 940 consists of first and second joint cross linkages. The first joint cross linkage consists of a quadric crank chain comprising a first short link 941, a second short link 942 substantially equal in length to the first short link 941, a second long link 943, and a first long link 944 substantially equal in length to the second long link 943, wherein the first long link 944 of the first joint cross linkage of the link retaining mechanism 940 is crossed with the second long link 943 of the first joint cross linkage of the link retaining mechanism 940. The second joint cross linkage consists of a quadric crank chain comprising a first short link 945, a second short link 946 substantially equal in length to the first short link 945, a second long link 947, and a first long link 948 substantially equal in length to the second long link 947, wherein the first long link 948 of the second joint cross linkage of the link retaining mechanism 940 is crossed with the second long link 947 of the second joint cross linkage of the link retaining mechanism 940. Furthermore, the first short link 941 of the first joint cross linkage of the link retaining mechanism 940 is integrally formed with and fixedly connected with the first arm link 921 of the second arm link mechanism 920, and the second long link 947 of the second joint cross linkage of the link retaining mechanism 940 is integrally formed with and fixedly connected with the first arm link 911 of the first arm link mechanism 910.
The second long link 943 of the first joint cross linkage of the link retaining mechanism 940 is integrally formed with and fixedly connected with the third arm link 913 of the first arm link mechanism 910, and the first short link 945 of the second joint cross linkage of the link retaining mechanism 940 substantially equal in length to the second long link 943 of the first joint cross linkage of the link retaining mechanism 940, and integrally formed with and fixedly connected with the third arm link 923 of the second arm link mechanism 920. The second short link 942 of the first joint cross linkage of the link retaining mechanism 940 integrally formed with and fixedly connected with the first long link 948 of the second joint cross linkage of the link retaining mechanism 940.
The link retaining mechanism 940 thus constructed is adapted to pivotably retain the first arm link mechanism 910 and the second arm link mechanism 920 and keep a first angle θ901 substantially equal to a second angle θ902, wherein the first angle θ901 is an angle formed by the first arm link 911 of the first arm link mechanism 910 with the reference line 900a, and the second angle θ902 is an angle formed by the first arm link 921 of the second arm link mechanism 920 with the reference line 900a.
The conventional robot arm mechanism 900 further comprises a robot arm member 951 having first and second end portions, and a handling member 952 for supporting and handling an object. The first end portion of the robot arm member 951 is integrally formed with and fixedly connected with the fourth arm link 924 of the second arm link mechanism 920. The handling member 952 is connected with the second end portion of the robot arm member 951.
The conventional robot arm mechanism 900 thus constructed makes it possible for the first arm link mechanism 910 and the second arm link mechanism 920 to be contracted and extended to assume its contracted and extended positions.
The conventional robot arm mechanism 900 thus constructed, however, encounters drawbacks resulting from the fact that the quadric crank chains constituting the first arm link mechanism 910, the quadric crank chain constituting the second arm link mechanism 920, and the quadric crank chain constituting the link retaining mechanism 940 may be easily flattened out, and accordingly vulnerable to deformation while the first arm link mechanism 910 and the second arm link mechanism 920 are extended to assume its extended position as shown in FIG. 20.
This means that the conventional robot arm mechanism 900 encounters a problem that the quadric crank chains constituting the first arm link mechanism 910, the quadric crank chain of the second arm link mechanism 920, and the link retaining mechanism 940 may be deformed due to, for example, a temperature change while the first arm link mechanism 910 and the second arm link mechanism 920 are extended, thereby making it difficult for the conventional robot arm mechanism 900 to accurately position the handling member 952 while the first arm link mechanism 910 and the second arm link mechanism 920 are extended, and accordingly aggravating the operating accuracy of the conventional robot arm mechanism 900.
The conventional robot arm mechanism 900 encounters another problem that the quadric crank chains constituting the first arm link mechanism 910, the quadric crank chain of the second arm link mechanism 920, and the link retaining mechanism 940 may be deformed due to, for example, an external force exerted thereon while the first arm link mechanism 910 and the second arm link mechanism 920 are extended, thereby making it difficult for the conventional robot arm mechanism 900 to accurately position the handling member 952 independently of the external force exerted thereon while the first arm link mechanism 910 and the second arm link mechanism 920 are extended, and accordingly aggravating the operating accuracy of the conventional robot arm mechanism 900.
The present invention is made with a view to overcoming the previously mentioned problems inherent to the conventional robot arm mechanism.

This patent is subject to a terminal disclaimer.


Disclosed are methods, systems, and computer program products for decentralized triggerless processing of signaling messages in a multi-application processing environment. According to one method, a signaling message is received at a screening module. At least one application to perform message processing on the signaling message is determined from a screening policy. The signaling message is modified to include application routing information to allow the at least one application to complete signaling message routing. The signaling message is forwarded to, and routed by, the at least one application using the application routing information.

Signaling messages are used within communications networks to communicate information related to call setup, call tear down, call timing, billing, messaging and many related functions. Signaling messages are processed by various applications to achieve the desired functions. Examples of signaling message processing include triggerless processing of ISDN user part (ISUP), telephone user part (TUP), transaction capabilities application part (TCAP), mobile application part (MAP) and session initiation protocol (SIP) signaling messages in a multi-application environment. Some of the message types, such as ISUP and SIP messages relating to call setup, may be subjected to triggerless processing by a signaling message routing node. "Triggerless processing," as used herein, refers to the processing of a received signaling message without requiring an end office trigger to initiate the processing. For example, a signal transfer point (STP) may perform triggerless processing of received ISUP IAM messages requiring local number portability (LNP) lookups by performing LNP database lookups for the IAM messages without requiring end office trigger to initiate the lookups. Another example of triggerless processing that may be performed for received signaling messages includes screening. For example, received ISUP messages may be screened based on one or more parameters in each message and either routed to their respective destinations, or blocked, depending on the results of the screening.
Signaling messages are routed in communications networks through network elements for processing. Some examples of these network elements include an STP, a signaling system number 7 (SS7) Internet protocol (IP) signaling gateway (SG) (collectively SS7-IP SG), an SS7 gateway, a SIP server, a short message gateway (SMG), a softswitch (SS), and a media gateway controller (MGC).
When a signaling message is routed, the signaling message may be routed through and by any of these network elements. Some network elements may include screening functions or modules (hereinafter referred to as screening functions). Screening functions have traditionally been adapted to apply a screening policy to a received signaling message and to route the signaling message after the screening policy has been applied.
Screening policies may include a variety of processing tasks for any given signaling message. These processing tasks may include processing by one or more message processing applications. Example message processing applications include triggerless pre-paid service applications, number portability service applications, location portability service applications, usage measurements service applications, billing service applications, advanced/intelligent routing service applications (e.g., time of day routing, etc.), messaging service applications (e.g., short message service, multimedia message service, instant message service, etc.), presence service, ENUM service, and other signaling message-based network service applications.
Traditionally, screening policies have been implemented by screening functions that manage all aspects of the processing. These screening functions have acted as a cog in a wheel by placing themselves logically in the middle of several processing applications and sequentially sending signaling messages to applications one at a time for processing (as if sending them along the spokes of the wheel to each application). When signaling message processing is completed by any given application, the message is then sent by the application back to the screening function. The screening function then determines, based upon the screening policy, which application should process the message next and sends the message to that application. This repeats until all message processing is completed and the message is received back at the screening function. With the screening policy complete, the screening function may then route the signaling message to the next node in the network.
By handling all processing and routing decisions for every message, screening functions have traditionally managed all aspects of signaling message processing and routing. The traditional approach burdens the screening function with repeated message processing and routing tasks. This repeated processing burden consumes valuable signaling link bandwidth and requires a substantial amount of time.
For example, the SS7 signaling protocol includes various call setup timers that effectively limit the delays that can be incurred between network elements during call setup operations. Each time a signaling message is routed to the screening function and the screening function has to receive and process the message, an element of time delay is introduced. This repeated processing by a screening function may cause the maximum latency permitted by the SS7 ISUP call setup timers to be exceeded.
Bandwidth is also consumed on the order of 2N (where N is the number of applications). To clarify, for each application required to implement a given screening policy, two transmissions of the message occur: one from the screening function to the application; and another from the application back to
Accordingly, in light of these difficulties associated with conventional message screening, there exists a need for improved methods, systems, and computer program products for screening policy implementation.

Methods, systems, and computer program products for decentralized processing of signaling messages in a multi-application processing environment


A computer system consists of a plurality of nodes, each with an associated local host, coupled together with a plurality of point-to-point links. An isochronous data channel is established within the computer system between a first subset of the plurality of nodes. The isochronous data channel includes a linked list of buffers which are used as temporary storage locations for data transmitted on the isochronous data channel. Each node which is part of the isochronous data channel is configured as a sender or a receiver and data transmissions are commenced. The presence of isochronous data in the channel generates an interrupt which signals a central processing unit (CPU) that data is available. The data is transferred to an associated location within the linked list of buffers and the CPU then moves on to other tasks. In other embodiments, data is transferred using DMA techniques rather than interrupt driven events. Buffers can also be used to transmit isochronous data.

The components of a computer system are typically coupled to a common bus for communicating information to one another. Various bus architectures are known in the prior art, and each bus architecture operates according to a communications protocol that defines the manner in which data transfer between components is accomplished.
The Institute of Electrical and Electronic Engineers (IEEE) has promulgated a number of different bus architecture standards including IEEE standards document 1394, entitled Standard for a High Performance Serial Bus (hereinafter "IEEE 1394 Serial Bus Standard"). A typical serial bus having the IEEE 1394 standard architecture is comprised of a multiplicity of nodes that are interconnected via point-to-point links, such as cables, that each connect a single node of the serial bus to another node of the serial bus. Data packets are propagated throughout the serial bus using a number of point-to-point transactions, wherein a node that receives a packet from another node via a first point-to-point link retransmits the received packet via other point-to-point links. A tree network configuration and associated packet handling protocol ensures that each node receives every packet once. The serial bus of the IEEE 1394 Serial Bus Standard may be used as an alternate bus for the parallel backplane of a computer system, as a low cost peripheral bus, or as a bus bridge between architecturally compatible buses.
A communications protocol of the IEEE 1394 Serial Bus Standards specifies two primary types of bus access: asynchronous access and isochronous access. Asynchronous access may be either "fair" or "cycle master". Cycle master access is used by nodes that need the next available opportunity to transfer data. Isochronous access is used by nodes that require guaranteed bandwidth, for example, nodes transmitting video data. The transactions for each type of bus access are comprised of at least one "subaction", wherein a subaction is a complete one-way transfer operation.
In the case of isochronous data transfers and computer systems conforming to the IEEE 1394 Serial Bus Standard, the prior art has attempted to manage the flow of data using dedicated drivers. Drivers are software entities associated with various components of a computer system and, among other functions, operate to configure the components and allow the components to be operable within the overall system. The drivers of the prior art have allowed for the transmission of video data from a digital video camera to a monitor, but have not allowed for real time video transmissions in a multi-tasking environment. In particular, the drivers of the prior art have required that a bus controller, e.g., the computer system's CPU, listen to a data channel at the exclusion of all other processes. As data arrives on the channel, it is stored in a buffer for later transmission to a frame buffer associated with a monitor. A new listen instruction must be issued for each separate isochronous data transmission. That is, if a single transmission corresponds to data for a single scan line of the monitor, for a display of five scan lines, five separate listen instructions are required. Because the data is being sent in real time, this system requires that the processor spend all of its time servicing the isochronous data transmissions, even if no data is currently being transmitted on the bus, without servicing any other tasks. It would, therefore, be desirable to have a means and method for a more efficient management of isochronous data channels in a computer system.

Isochronous channel having a linked list of buffers


A lithographic projection apparatus is provided with an optical system built into the wafer table for producing an image of a wafer mark that is provided on the back side of the wafer. The image is located at the plane of the front side of the wafer and can be viewed by an alignment system from the front side of the wafer. Simultaneous alignment between marks on the back and front of the wafer and a mask can be performed using a pre-existing alignment system. The lithographic projection apparatus is further provided with immersion system for providing a fluid between the lens and the substrate.

1. Field of the Invention
The present invention relates generally to lithographic projection apparatus and methods for use thereof.
2. Description of the Related Art
The term "patterning device" as here employed should be broadly interpreted as referring to devices that can be used to endow an incoming radiation beam with a patterned cross-section, corresponding to a pattern that is to be created in a target portion of the substrate; the term "light valve" can also be used in this context. Generally, said pattern will correspond to a particular functional layer in a device being created in the target portion, such as an integrated circuit or other device (see below). Examples of such patterning device include:
A mask. The concept of a mask is well known in lithography, and it includes mask types such as binary, alternating phase-shift, and attenuated phase-shift, as well as various hybrid mask types. Placement of such a mask in the radiation beam causes selective transmission (in the case of a transmissive mask) or reflection (in the case of a reflective mask) of the radiation impinging on the mask, according to the pattern on the mask. In the case of a mask, the support structure will generally be a mask table, which ensures that the mask can be held at a desired position in the incoming radiation beam, and that it can be moved relative to the beam if so desired.
A programmable mirror array. One example of such a device is a matrix-addressable surface having a viscoelastic control layer and a reflective surface. The basic principle behind such an apparatus is that (for example) addressed areas of the reflective surface reflect incident light as diffracted light, whereas unaddressed areas reflect incident light as undiffracted light. Using an appropriate filter, the said undiffracted light can be filtered out of the reflected beam, leaving only the diffracted light behind; in this manner, the beam becomes patterned according to the addressing pattern of the matrix-adressable surface. An alternative embodiment of a programmable mirror array employs a matrix arrangement of tiny mirrors, each of which can be individually tilted about an axis by applying a suitable localized electric field, or by employing piezoelectric actuators. Once again, the mirrors are matrix-addressable, such that addressed mirrors will reflect an incoming radiation beam in a different direction to unaddressed mirrors; in this manner, the reflected beam is patterned according to the addressing pattern of the matrix-adressable mirrors. The required matrix addressing can be performed using suitable electronic circuits. In both of the situations described here above, the patterning device can comprise one or more programmable mirror arrays, More information on mirror arrays as here referred to can be gleaned, for example, from United States Patents Nos. 5,296,891 and 5,523,193, and PCT patent applications WO 98/38597 and WO 98/33096, which are incorporated herein by reference. In the case of a programmable mirror array, the said support structure may be embodied as a frame or table, for example, which may be fixed or movable as required.
A programmable LCD array. An example of such a construction is given in United States Patent U.S. Pat. No. 5,229,872, which is incorporated herein by reference. As above, the support structure in this case may be embodied as a frame or table, for example, which may be fixed or movable as required.
For purposes of simplicity, the rest of this text may, at certain locations, specifically direct itself to examples involving a mask and mask table; however, the general principles discussed in such instances should be seen in the broader context of the patterning device as here above set forth.
For the sake of simplicity, the projection system may hereinafter be referred to as the "lens"; however, this term should be broadly interpreted as encompassing various types of projection system, including refractive optics, reflective optics, and catadioptric systems, for example. The radiation system may also include components operating according to any of these design types for directing, shaping or controlling the projection beam of radiation, and such components may also be referred to below, collectively or singularly, as a "lens". Further, the lithographic apparatus may be of a type having two or more substrate tables (and/or two or more mask tables). In such "multiple stage" devices the additional tables may be used in parallel, or preparatory steps may be carried out on one or more tables while one or more other tables are being used for exposures. Dual stage lithographic apparatus are described, for example, in U.S. Pat. No. 5,969,441 and U.S. Ser. No. 09/180,011, filed 27 Feb., 1998 (WO 98/40791), incorporated herein by reference.
Lithographic projection apparatus can be used, for example, in the manufacture of integrated circuits (ICs). In such a case, the patterning device may generate a circuit pattern corresponding to an individual layer of the IC, and this pattern can be imaged onto a target portion (comprising one or more dies) on a substrate (silicon wafer) that has been coated with a layer of photosensitive material (resist). In general, a single wafer will contain a whole network of adjacent target portions that are successively irradiated via the projection system, one at a time. In current apparatus, employing patterning by a mask on a mask table, a distinction can be made between two different types of machine. In one type of lithographic projection apparatus, each target portion is irradiated by exposing the entire mask pattern onto the target portion in one go; such an apparatus is commonly referred to as a wafer stepper. In an alternative apparatus—commonly referred to as a step-and-scan apparatus—each target portion is irradiated by progressively scanning the mask pattern under the projection beam in a given reference direction (the "scanning" direction) while synchronously scanning the substrate table parallel or anti-parallel to this direction; since, in general, the projection system will have a magnification factor M (generally <1), the speed V at which the substrate table is scanned will be a factor M times that at which the mask table is scanned. More information with regard to lithographic devices as here described can be gleaned, for example, from U.S. Pat. No. 6,046,792, incorporated herein by reference.
In a manufacturing process using a lithographic projection apparatus according to the invention a pattern (e.g. in a mask) is imaged onto a substrate that is at least partially covered by a layer of energy-sensitive material (resist). Prior to this imaging step, the substrate may undergo various procedures, such as priming, resist coating and a soft bake. After exposure, the substrate may be subjected to other procedures, such as a post-exposure bake (PEB), development, a hard bake and measurement/inspection of the imaged features. This array of procedures is used as a basis to pattern an individual layer of a device, e.g. an IC. Such a patterned layer may then undergo various processes such as etching, ion-implantation (doping), metallization, oxidation, chemo-mechanical polishing, etc., all intended to finish off an individual layer. If several layers are required, then the whole procedure, or a variant thereof, will have to be repeated for each new layer. Eventually, an array of devices will be present on the substrate (wafer). These devices are then separated from one another by a technique such as dicing or sawing, whence the individual devices can be mounted on a carrier, connected to pins, etc. Further information regarding such processes can be obtained, for example, from the book "Microchip Fabrication: A Practical Guide to Semiconductor Processing", Third Edition, by Peter van Zant, McGraw Hill Publishing Co., 1997, ISBN 0-07-0672504, incorporated herein by reference.
Alignment is the process of positioning the image of a specific point on the mask to a specific point on the wafer that is to be exposed. Typically one or more alignment marks, such as a small pattern, are provided on each of the substrate and the mask. A device may consist of many layers that are built up by successive exposures with intermediate processing steps. Before each exposure, alignment is performed to minimize any positional error between the new exposure and the previous ones, such error being termed overlay error.
However, some of the intermediate processing steps, such as chemical mechanical polishing (CMP), rapid thermal annealing, thick layer deposition and deep trench etching, can damage or distort the alignment marks on the substrate or bury them under opaque layers. This can cause overlay errors.
In some technologies, such as micro systems technology (MST) and micro electromechanical systems (MEMS), devices are fabricated from both sides of a substrate. There has been a problem with performing exposures on one side of a substrate such that they are accurately aligned with features previously exposed on the other side of the substrate. An alignment accuracy of the order of 0.5 microns or better is typically required.
New techniques are developed that allow the imaging of patterning devices, having even smaller patterns, by using so-called immersion techniques. This technique is based on the fact that the space between the lens and the substrate contains a fluid, such as water. Since the refractive index of water is higher than the refractive index of air of some low pressure gas, the numerical aperture of the system is increased. This allows to image even smaller patterns, while using the same radiation system and projection system. More information about immersion techniques can for instance be found in EP 1 420 298 A2, EP 1 429 188 and EP 1 420 300 A2.
The presence of water will however influence the alignment measurements. As a result of the presence of water in the space between the lens and the substrate, it becomes difficult to perform alignment measurements on marks provided on the substrate. Furthermore, comparing such 'wet' measurements with previously obtained 'dry' alignment measurements is also rather difficult.
In case a so-called dual stage lithographic apparatus is used, in which alignment measurements may be performed in a first 'dry' measurement position and exposure is done on a second 'wet' exposure position, still measurements must be performed at the second 'wet' position. When the substrate stage is 'swapped' from the 'dry' measurement position to the exposure position, the substrate stage also changes from first to second alignment devices, the first alignment devices being used at the first 'dry' measurement position and the second alignment devices being used at the second 'wet' position. Therefore, additional measurements must be performed at the exposure position, i.e. the 'wet' position, in order to use the previously obtained 'dry' measurements during exposure, thus at the exposure position. Also, the actual alignment of the substrate relative to the reticle can only be performed at the exposure position, i.e. the 'wet' position, since no reticle is present at the measurement position.
In case a single stage lithographic apparatus is used, all measurements must be performed at the exposure position.
In both cases, single and dual stage, alignment measurements must be performed at the 'wet' exposure position, while these measurements are preferably obtained in a 'dry' environment. A straightforward solution to align substrates on the 'wet' exposure position would be to perform all alignment measurements before the water is added. However, this would significantly reduce the throughput of the system.
The possibility to perform alignment measurements during applying water is not possible according to the prior art. This will briefly be explained. In general, two alignment arrangements may be used: an off-axis alignment arrangement and a so-called through-the-lens alignment arrangement (TTL).
An off-axis alignment arrangement can not be used during applying water in the space in between the lens and the substrate, since the off-axis alignment arrangement must, in order to perform measurements, come close to the surface of the substrate. In order to apply water, the lens must also be brought in the vicinity of the substrate. Because of the dimensions of the lens as well as the off-axis alignment arrangement, it is not possible to have them both at the desired position at the same time, making it impossible to perform off-axis alignment measurements while applying water at the same time or while water is present.
Furthermore, it is not possible to perform a TTL-measurement during applying (filling) water. Such a TTL-measurement performs measurements by projecting an alignment beam via an alignment mark provided on the reticle, through the lens to an alignment mark provided on the substrate stage. Underneath this alignment mark provided on the substrate stage a measurement arrangement may be provided, such as for instance a light detector. It will be understood by a person skilled in the art that it is impossible to perform such measurements during applying water, since the rising water level would change the optical density and thus would change the path of the alignment beam and therefore disturb the measurements.
Techniques for performing TTL-alignment after applying water, thus when the water is present, are not developed yet. In some cases, such 'wet' measurements will need to be compared with previously obtained 'dry' measurements, which is also not straightforward. Finally, since applying water is a time-consuming action, the need arises to develop a more time-efficient procedure.


A functional perovskite cell formed on a silicon substrate layer and including a functional layer of bismuth ferrite (BiFeO3 or BFO) sandwiched between two electrode layers. An optional intermediate template layer, for example, of strontium titanate allows the bismuth ferrite layer to be crystallographically aligned with the silicon substrate layer. Other barrier layers of platinum or an intermetallic alloy produce a polycrystalline BFO layer. The cell may be configured as a non-volatile memory cell or a MEMS structure respectively depending upon the ferroelectric and piezoelectric character of BFO. Lanthanum substitution in the BFO increases ferroelectric performance. The films may be grown by MOCVD using a heated vaporizer.

There has been much recent interest and development in electronic devices incorporating a functional metal oxide layer. Perovskite thin films are particularly useful because many perovskite materials exhibit non-linear behavior such as ferroelectricity or have electrical characteristics that depend on other parameters such that they can be used for sensors or actuators.
One such application is a non-volatile ferroelectric memory as I have described in U.S. Pat. No. 6,518,609, incorporated herein by reference in its entirety. The fundamental structure of a ferroelectric memory includes a thin film of ferroelectric material sandwiched between the electrodes of a capacitor. The ferroelectric material has two polarization states. Once the ferroelectric thin film has been poled into one of the two states, it remains in that state without further application of power. Furthermore, the ferroelectric state can be electrically tested. As a result, a ferroelectric capacitor can act as a non-volatile memory. One of the challenges of commercially important ferroelectric memories addressed in the above cited patent is integrating a large number of such ferroelectric cells on a silicon substrate.
Another important application of perovskite thin films includes micro electromechanical system (MEMS) devices. MEMS technology borrows the fabrication techniques developed for silicon integrated circuits to form small mechanical devices in a silicon layer of a substrate that can move and interact with electrical signals. There are several forms of electromechanical actuation. In one form, a piezoelectric layer is formed over a thin cantilevered silicon layer and is connected between two electrical terminals. A voltage applied across the piezoelectric layer causes it and the silicon layer to flex in a predetermined way. Such a structure has been used to form arrays of movable micromirrors for a communication switch. In a complementary form, the structure can act as a pressure sensor. A pressure differential across the cantilevered structure will cause it to flex. The distortion can be electrically detected as a voltage across the piezoelectric layer in a mechanism similar to a microphone. Again, the challenge is to integrate onto a silicon substrate a significant number of such devices including the piezoelectric layer.
Ferroelectric memories and piezoelectric MEMS structures often use a functional metal oxide layer of a perovskite material. One of the most popular perovskite material for these applications is lead zirconium titanate (PbZrxTi1-xO3 or PZT) and its related alloys of lead lanthanum niobium zirconium titanate (PLNZT). It is understood the composition of commercially important perovskite materials is often not strictly stoichiometric. There are other devices which incorporate these and similar perovskite materials, such as non-volatile field effect transistors, pyroelectric infrared sensors, other optical devices, pyrometers, and static ferroelectric RAMs.
Almost all these devices benefit from a high quality perovskite film having well defined crystallinity. In U.S. Pat. No. 6,432,546, I and others have disclosed growing high quality PZT on a layer strontium titanate (SrTiO3 or STO) grown over silicon. In U.S. Pat. Nos. 6,518,609 and 6,781,176, I have described doping the STO to be conductive. I and Schlom in U.S. Pat. No. 6,642,539, incorporated herein by reference in its entirety, have disclosed that the doping elements in STO can be chosen from different substituents.
The use of PZT as the functional metal oxide layer presents some difficulties. It contains a high fraction of lead. Lead is toxic and thus raises environmental issues both during fabrication and for disposal of old devices. Furthermore, lead is considered a heavy metal contaminant in the fabrication of silicon integrated circuits and it may introduce reliability problems in semiconductor circuits.
It would be preferred if functional metal oxide layers exhibiting ferroelectricity, piezoelectricity, and other qualities associated with perovskites have a composition not including lead.

Bismuth ferrite films and devices grown on silicon


A crystal, which is mounted in a rotatable support for use in tuning the wavelength of an optical parametric oscillator, is maintained at a desired temperature by positioning a heating sleeve to thermally coupled to the crystal and its support in such a way that the crystal is still free to rotate. The heating sleeve has an embedded heating element for connecting to an electronic controller whose dynamic output response matches the dynamic temperature characteristics of the combination of components including the crystal, it rotatable holder and the heating sleeve, so as to quickly stabilize changes in the crystal temperature with a minimum amount of overshoot.

The application of coherent optical devices operating in the region of the infrared spectrum from about 3 to about 5 micrometers has proven useful in environmental monitoring. These instruments, in which a laser generates intense infrared pulses in beam widths as small as 30 seconds of arc, measure concentration of gaseous molecules in the earth's atmosphere by radar techniques. Unfortunately these lasers are not tunable over broad ranges.
An optical parametric oscillator (OPO) using an optically nonlinear lithium niobate crystal has proven to be practical for tuning the wavelength of the coherent optical instrument. The lithium niobate crystal in the OPO is employed as the interaction medium for tuning and is pumped by a laser operating substantially at 1.064 micrometers in the infrared in a direction substantially normal to the optic axis of the crystal to produce infrared light in the 3-5 micrometer range. The wavelength is turned by adjusting the mechanical angle theta .theta., at which the incoming laser light strikes the crystal, by rotating the crystal about an appropriate axis. Tuning of the wavelength can also be achieved by varying the temperature of the OPO crystal. It should be appreciated by those skilled in the art, however, that in a singly resonant oscillator only one tuning technique is desired.
Accordingly, it is an object of this invention to precisely control the temperature of the OPO crystal so that tunable oscillations in the optically generated wavelength can be provided by rotating the crystal about an appropriate axis.
Another object of this invention is to provide a coherent optical device having minimal error resulting from temperature variation.
Another object of this invention is to provide a temperature controller for a crystal mounted in a rotatable support which anticipates correction of an error by sensing the rate of change of the error and providing a corresponding correction.

Temperature control of crystals used in optical oscillators


A power supply having an extendable power input port connecting to a connection line to be installed on a side wall of a computer host. The side wall and the power supply form a heat dissipation passage therebetween to improve heated airflow in the computer host and increase heat dissipation effect without affecting electric plugging of the power supply.

1. Field of the Invention
The present invention relates to power supply with an extendable power input port and particularly to a power supply with an altered design of the power input port to provide improved heat dissipation for computer host without affecting electric plugging of the power supply.
2. Brief Discussion of the Related Art
The conventional 1 U specification for computer host (hereinafter called host) has to house various type of data processing elements such as hard disk, interface cards and CPU in a small space, it becomes very crowd. As processing speed and performance constantly improve to meet the requirements of increasingly complex logic calculations and data processing, a great amount of heat is generated during operation. With limited interior space of 1 U and cost concern, it is not possible to add more air fans to improve air convection. How to improve heat dissipation efficiency with the existing air fans has become an issue all vendors try to address.
Refer to FIG. 1 for a R.O.C. Utility patent No. 484721 which provides an airflow channeling structure in a host coupling to a radiation fan assembly. One side wall of the host has an air outlet connecting to the airflow channeling structure to converge the airflow of the air fan assembly to rapidly disperse heat of the main heat source CPU. However due to every vendor has its own CPU specifications, and installation location of the CPU also is different. The airflow channeling structure has to be designed differently according to the different specifications. It is not economic effective.
To resolve this problem, one approach is to find out the common characteristics of all hosts. As the circuit board of most hosts has to be fixed on a selected location, the side wall of the computer where the circuit board is mounted has no additional space for heat dissipation. Only the location where the power supply is installed is changeable. Since the power supply and the air fan assembly are interposed by an interval which does not have any electronic element installed therein, by moving the power supply installation towards the air fan assembly, the power supply and the host side wall may form an additional interval to become a heat dissipation passage. However, such an arrangement creates a new problem. Because most power supply and the power input port are integrated. Moving the power supply rearwards will make plugging of electric power difficult. Moreover, the power supply generally is directly mounted on the side wall of the host. Relocating the power supply inside the host makes anchoring of the power supply a big problem to be overcome.

Power supply having an extendable power input port


In fabricating an MFIC by mounting a semiconductor chip on a substrate having a microstrip line by MBB bonding, a benzocyclobutene (BCB) film is used as a dielectric film of the microstrip line. By providing a means for preventing the deformation, peeling, and cracking of the BCB film during the fabrication process, the thickness of the dielectric film is held substantially equal even after flip-chip mounting, which reduces impedance fluctuations.

The present invention relates to a semiconductor device using flip-chip mounting and to a method of manufacturing the same. In particular, it relates to a semiconductor device having an rf transistor for use at frequencies ranging from the K-band to the millimeter-wave band and to a method of manufacturing the same.
As the remarkable technological progress has been achieved in the field of telecommunications in recent years, the frequency band used in communication devices has upwardly shifted from the microwave band to the millimeter-wave band. This entails a remarkable increase in the operating speed of a transistor used in the communication devices so that a device having a hetero-junction compound semiconductor transistor with a cut-off frequency over 100 GHz has been implemented lately. In such a communication device using radio frequencies ranging from the quasi-microwave band to the millimeter-wave band, however, a method of mounting a semiconductor chip composing a circuit as well as transistor characteristics presents problems. For example, a parasitic capacitance or a parasitic inductance is easily produced in most cases after the mounting step was completed. Since the effects exerted by the parasitic capacitance and the like on the communication devices become larger in proportion to the level of the frequency used in the communication devices, these parasitic reactance components should be reduced more as a higher frequency is used. In the communication devices using frequencies ranging from the microwave band to the millimeter-wave band, the size of a connecting element interposed between circuit components approaches the wavelength of a signal, so that careful consideration should be given to the size of the connecting element at the designing stage. Naturally, extreme precision and accuracy is required of circuit components including passive elements and lines.
To overcome the above problems and implement a low-cost, high-performance semiconductor integrated circuit operating at K-band and millimeter-wave frequencies and having a wide range of applications, a conventional technique termed MFIC (millimeter-wave flip-chip IC) has been proposed (The Institute of Electronics, Information and Communication Engineers, Autumn Conference '94 Term 39th). The technique is an IC (module) technique for reducing the parasitic effects by using a flip-chip bonding technique termed micro-bump bonding (hereinafter referred to as MBB), which enables a high-performance millimeter-wave IC to be implemented at low cost with some design flexibility, while taking advantage of the preciseness and manufacturability of the semiconductor fabrication process.
FIG. 32 is a cross-sectional view partially showing the structure of the MFIC, in which are shown: a substrate 1000 composed of Si or the like; a ground conductive film 1001 composed of an Au film formed on the main side of the substrate 1000; a dielectric film 1002 composed of a SiO.sub.2 film; and an interconnecting conductive film 1003 composed of a conductive material deposited and patterned on the dielectric film 1002. The interconnecting conductive film 1003, the ground conductive film 1001, and the dielectric film 1002 constitute a microstrip line. In the drawing are also shown: electrode pads 1004 included in the interconnecting conductive film 1003; a semiconductor chip 1008 with an embedded rf transistor composed of a compound semiconductor or the like; and electrode pads 1007 disposed on portions of the semiconductor chip 1008. The electrode pads 1007 are electrically connected to the electrode pads 1004 included in the interconnecting conductive film 1003 of the microstrip line via bumps (microbumps) 1006. A light-light setting insulation resin 105 is used to fix the semiconductor chip 1008 onto the substrate 1000 so that the connection provided by the bumps 1006 is enhanced by the contracting force of the light setting insulation resin 1005.
Next, the process of manufacturing the MFIC shown in FIG. 32 will be described with reference to FIGS. 33(a) to 33(e).
First, as shown in FIG. 33(a), the light setting insulation resin 1005 is supplied dropwise onto the substrate 1000 formed with the microstrip line. Next, as shown in FIG. 33(b), the bumps 1006 formed on the electrode pads 1007 of the semiconductor chip 1008 are aligned with the electrode pads 1004 included in the interconnecting conductive film 1003 on the substrate 1000 by using a camera or the like. Then, as shown in FIG. 33(c), the semiconductor chip 1008 is pressed by means of a pressing jig 1010 to extrude the light setting insulation resin 1005 from the space between the bumps 1006 and the electrode pads 1004, while the bumps 1006 are compressed and deformed to sink into the corresponding electrode pads 1004, thereby establishing connection thereto. Then, as shown in FIG. 33(d), the light setting insulation resin 1005 is cured under the radiation of an ultraviolet ray 1011 to fix the semiconductor chip 1008 onto the substrate 1000. During the curing process, the light setting insulation resin 1005 contracts to provide enhanced connection between the electrode pads 1007 and the electrode pads 1004. Then, as shown in FIG. 33(e), the pressing jig 1010 is removed after the curing process, thereby completing the mounting of the semiconductor chip 1008 on the substrate 1000.
By using the flip-chip mounting technique in accordance with the MBB method described above, the thickness of the bump 1006 can be reduced to th order of several micrometers or less so that the parasitic inductance induced by the intervening bumps 1006 is suppressed to an extremely low level (several picohenries), which renders the MFIC sufficiently usable at frequencies in the millimeter band. In a semiconductor device formed by flip-chip mounting employing a solder bump, the size of the bump is as large as about 50 .mu.m so that the bump functions as a distributed constant circuit or an inductor. On the other hand, in the MFIC formed by using flip-chip mounting in accordance with the MBB method, the thickness of the bump 1006 can be reduced to the order of several micrometers so that the function of the bump 1006 as an inductor is negligible. Moreover, since the microstrip line in the MFIC can be fabricated by using the semiconductor fabrication process, patterning can be performed with higher accuracy than in the case of a normal hybrid IC wherein interconnections are provided on a substrate of alumina or the like by employing a printing technique. Compared with an MMIC (millimeter-wave monolithic IC) similarly using the semiconductor fabrication process, the MFIC achieves a remarkable cost reduction since a passive circuit can be formed on a low-cost substrate of Si or the like, not on a substrate of a compound semiconductor.
Although the MFIC has numerous advantages as described above, it also has the following problems.
The first problem is a large loss in an rf signal when it passes through the microstrip line used in the conventional MFIC. Although a SiO.sub.2 film with a low dielectric constant is typically used to compose the dielectric film 1002 shown in FIG. 32, it is difficult to grow the SiO.sub.2 film with a large thickness over 10 .mu.m on the underlying ground conductive film composed of Au. In the case of forming a microstrip line with a characteristic impedance of 50.OMEGA., however, the line width W of the microstrip line and the thickness h of the SiO.sub.2 are determined to have a relationship substantially represented by W=2 h so that the line width W is inevitably reduced if the SiO.sub.2 film is thin. Consequently, the resistance of the line is increased, resulting in a conductor loss. Moreover, the dielectric loss or so-called tan.delta. of the SiO.sub.2 film is as large as about 0.03. The large conductor loss and large dielectric loss combine to increase a loss in the rf signal passing through the microstrip line.
If any material that may form a film with a large thickness over 10 .mu.m is used properly to compose the dielectric film, the line width can be increased and the conductor loss can be reduced, though the impedance remains the same. To form such a comparatively thick insulating film by a simple procedure, there is known a technique for forming an organic film of polyimide or the like that has been used for an interlayer insulating film of multilayer interconnections or a passivation film of an LSI. The technique enables the formation of a comparative thick dielectric film by a simple process including a spin-coating step and a baking step. By repeatedly performing these steps to stack multiple layers on the resulting dielectric film, a thicker film may be obtained. Moreover, since an organic film has a texture softer than that of an inorganic film, the substrate undergoes only a reduced stress even when the film thickness is increased so that the cracking or peeling off of the film due to a difference in coefficient of thermal expansion between the organic film and the substrate is easily prevented.
It is therefore a first object of the present invention to provide a semiconductor device with an embedded rf transistor wherein the dielectric film of the microstrip line is composed of an organic material particularly suitable for that purpose, which optimizes the impedance and prevents an increase in conductor loss.
However, if the organic film is used to compose the dielectric film of the microstrip line in the MFIC, the MFIC presents the second problem that the characteristics exhibited thereby may not be the same as assumed at the designing stage, though the conductor loss can be reduced. When the semiconductor chip 1008 is pressed against the substrate 1000 by means of the pressing jig in the step of mounting the semiconductor chip 1008 on the substrate 1000 via the bumps 1006, the dielectric film 1002 having a soft texture is deformed under the electrode pads 1004. Variations in the thickness of the dielectric film 1002 in the positions corresponding to the electrode pads 1004 cause the deviation of the line impedance from a value assumed at the designing stage, so that it becomes difficult to implement exactly the same performance assumed at the designing stage.
It is therefore a second object of the present invention to provide an MFIC having a microstrip line using a soft, thick dielectric film composed of an organic film or the like yet exhibiting exactly the same characteristic impedance assumed at the designing stage by providing a means for suppressing the deformation of the dielectric film during MBB mounting.
If the dielectric film is composed of a BCB film, the MFIC presents the third problem that the BCB film peels off the ground conductive film, the interconnecting conductive film peels off the BCB film, cracking occurs in the BCB film, or thermal deformation occurs during the manufacturing process. Close investigation has been conducted on the cause of the third problem, proving that unsatisfactory adhesion between the BCB film and the conductive film or the low heat resistance of the BCB film causes the third problem.
It is therefore a third object of the present invention to provide a highly reliable semiconductor device with excellent rf properties and a method of manufacturing the same by providing a means for compensating for the unsatisfactory adhesion and low heat resistance of the BCB film, while taking advantage of the excellent rf properties of the BCB film.

RF semiconductor device and a method for manufacturing the same

Matsushita Electric Industrial Co., Ltd.


A teeth prosthesis for mounting thereon a member having a set of teeth has at least three implants, each implant having opposite ends, one end of each implant being anchored in a bone of a maxilla while an opposite end projects out of a gingiva and defines a head. A customized connecting bar is also provided, the connecting bar being shaped and sized to substantially conform to and face the gingiva and fastened to the implants. A pair of mating bars having standardized sizes and shapes are also provided, consisting of a meso-bar fastened to the connecting bar and an iso-bar removably attached to the meso-bar through an attachment. The teeth prosthesis of the present invention is more economical to produce than prior art devices since it makes use of customized components and only the connecting bar is adjusted for a specific person.

It is well known in the art to provide a teeth prosthesis for a lower or an upper maxilla, the teeth prosthesis being of the type comprising an infrastructure, a suprastructure and means for removable attachment of the suprastructure with the infrastructure.
More particularly, U.S. Pat. No. 5,429,505 (FORTIN) and U.S. Pat. No. 5,674,070 (FORTIN), which is a continuation-in-part of U.S. Pat. No. 5,429,505, relate to a teeth prosthesis, a method of manufacture thereof and a method for mounting and removing a suprastructure thereof. These patents disclose a teeth prosthesis for an upper maxilla including an infrastructure, a suprastructure, and an assembly for removable attachment of the suprastructure with the infrastructure. The infrastructure includes at least three implants, one connection bar, and an assembly for removably fastening the connection bar with and against the head of each of the implants. The suprastructure includes a first member made of cast metal or alloy having an intrados provided with an opening giving access to a housing of such size and depth to allow the housing of the connection bar therein, a second member permanently attached to the first member, and a set of teeth fixed to the first member and the second member. The assembly includes two first fastening members, and a second fastening member. The invention is also directed to a method for the manufacture of such a teeth prosthesis.
However, even though aforesaid prior art teeth prosthesis can perform correctly when installed on the lower or the upper maxilla, the different elements of the teeth prosthesis have to be specifically machined to fit in each user's mouth. This machining involves a very high production cost because each element of the prosthesis must be customised for each user. Moreover, the involved machining procedure is very complicated and it has been demonstrated that the manufacture of such a teeth prosthesis is extremely difficult from a technical point of view. Furthermore, if a user loses an implant, it is actually quite difficult and expensive to replace it, or even impossible with appropriate precision, since all elements are customised. In most cases, the whole assembly must be replaced.
Therefore, there is a need to provide a teeth prosthesis wherein most of the elements are not customised, but are standard. This would allow supplying a more accurate teeth prosthesis to the user at an equivalent or cheaper cost. Moreover, this would also allow providing such a new technology available for most dental laboratories. Furthermore, since the elements of the prosthesis are not customised parts, it would be faster and cheaper to repair the teeth prosthesis with the same precision as the existing prosthesis.

Universal teeth prosthesis and method of manufacturing thereof


An ultrasonic vibration bonding machine which enables appropriate bonding by selecting a pressure curve according to the sizes of portions to be bonded together and the physical properties of their materials and the like. Pressure inside the pressure chamber of an air cylinder which is a pressure control unit for bonding work and the normal rotation and reverse rotation of a motor which constitutes part of a vertical drive unit for bonding work are controlled to bond together a first member and a second member with ultrasonic vibration under pressure which rises from a first pressure set value to a second pressure value from a vibration start time.

1. Field of the Invention
The present invention relates to an ultrasonic vibration bonding machine for bonding a plurality of members which are placed one upon another with ultrasonic vibration.
2. Description of the Prior Art
As disclosed by Japanese Laid-open Patent Application No. 10-22308, the Applicant proposed an ultrasonic vibration bonding machine for bonding a plurality of members which are placed one upon another with ultrasonic vibration.
When a plurality of members which are placed one upon another are to be bonded together by the above ultrasonic vibration bonding machine, the following bonding failures may occur according to the sizes of portions to be bonded together and the physical properties of their materials and the like: the bonded portions are pressed excessively when pressure applied to these portions of the plurality of members placed one upon another is too strong, or the bonded portions are separated from one another when pressure is too weak.
To cope with these, the present invention provides an ultrasonic vibration bonding machine which enables appropriate bonding by selecting a pressure curve according to the sizes of portions to be bonded together and the physical properties of their materials and the like.
According to a first aspect of the present invention, there is provided an ultrasonic vibration bonding machine for bonding a plurality of members placed one upon another with ultrasonic vibration by pressure holding the plurality of members between a resonator supported by a bonding unit and the mount table of a mounting unit and transmitting ultrasonic vibration to the resonator from a transducer connected to the resonator, wherein the bonding unit comprises a vertical drive unit for bonding work and a pressure control unit for bonding work.
According to a second aspect of the present invention, there is provided an ultrasonic vibration bonding machine, wherein the vertical drive unit moves the resonator toward the mount table side of the mounting unit, and the pressure control unit selects pressure for a time interval from the time when the plurality of members placed one upon another are held between the resonator and the mount table to the time when they are bonded together with ultrasonic vibration according to the sizes of portions to be bonded together and the physical properties of their materials and the like. Thereby, the plurality of members placed one upon another are bonded together properly without being pressed excessively or separated from one another.
According to a third aspect of the present invention, there is provided an ultrasonic vibration bonding machine, wherein the bonding unit is composed of a motor and a bolt-nut unit connected to the output shaft of the motor and a holder supporting the resonator. Compared with the case where the bonding unit is composed of a cylinder which moves only linearly, the bonding unit converts rotary motion into linear motion, thereby making it easy to control the speed of the vertical movement of the resonator.
According to a fourth aspect of the present invention, there is provided an ultrasonic vibration bonding machine, wherein the pressure control unit is composed of an air cylinder connected to the output end of the bonding unit and a holder supporting the resonator. Compared with a pressure control unit which is composed of an element other than the air cylinder, the pressure control unit can adjust pressure applied to the plurality of members placed one upon another with air which is a compressed elastic fluid.
According to a fifth aspect of the present invention, there is provided an ultrasonic vibration bonding machine, wherein the pressure control unit comprises a pressure supply system for supplying pressurized air to an equilibrium chamber and a pressure chamber formed in the air cylinder and setting means for setting the pressure of pressurized air to be supplied from the pressure supply system to the equilibrium chamber according to the total weight of elements connected to the pressure control unit and the pressure of pressurized air to be supplied from the pressure supply system to the pressure chamber according to the sizes and materials of members to be bonded together. Therefore, the pressure control unit can set pressure control conditions such as a vibration start pressure set value, first pressure set value, second pressure set value and equilibrium pressure set value.
According to a sixth aspect of the present invention, there is provided an ultrasonic vibration bonding machine, wherein a load sensor is provided on a holder supporting the resonator. Therefore, the total weight of the elements supported by the pressure control unit can be detected accurately and does not need to be calculated.
The above and other objects, features and advantages of the invention will become more apparent from the following description when taken in conjunction with the accompanying drawings.


A plate joiner including a fence support, a drive, and a fence system. The fence support includes a cutter which is arranged and configured to protrude through a cutter slot in a contact surface to make a plunge cut into a surface of a workpiece. The drive is arranged and configured to rotatably drive the cutter through a motor. A preferred fence system includes includes a trunnion which pivotally couples the front fence to the fence system and, at any selected distance from a top face of the workpiece to the fence, maintains a constant distance from the top face of the workpiece to the cutter as the front fence angle is adjusted. A preferred fence system also includes an angle segment member, which has two slots used to position the fence in two ranges of fence angles. A preferred plate joiner is configured, preferably employing an adjustment screw and guide pins, for substantially continuous adjustment of fence height while restraining lateral and tortional movement of the fence and providing an accurate measure, preferably employing a height gauge, of the height of the fence from any point in the thickness of the blade at any fence angle. A preferred plate joiner includes a cutter plunge system arranged and configured, preferably employing a safety lever which physically excludes a larger blade than is conveniently housed at a forward release position, to provide a plurality of release positions that reduce the distance traveled in making a plunge cut for a smaller blade and to prevent a blade from protruding from the tool in a release position.

The present invention relates to a plate joiner including a fence support, a drive, and a fence system. The fence support includes a cutter and a contact surface, which defines a cutter slot. The cutter is arranged and configured to protrude from fence support through cutter slot to make a plunge cut into a surface of a workpiece when the contact surface is pressed against the surface and the cutter is plunged into the workpiece by pushing on a rearward handle portion of the tool. The drive is arranged and configured to rotatably drive the cutter through a motor.
A preferred fence system includes an angle adjustment system arranged and configured to position the fence at a wide range of fence angles and, at any selected distance from a top face of the workpiece to the fence, the distance from the top face of the workpiece to the cutter remains constant as the front fence angle is adjusted. A preferred fence system includes a trunnion which pivotally couples the front fence to the fence system. A preferred fence system also includes an angle segment member, which has two slots used to position the fence in two ranges of fence angles.
A preferred plate joiner is configured for substantially continuous adjustment of fence height while restraining lateral and tortional movement of the fence and providing an accurate measure of the height of the fence from any point in the thickness of the blade. The height adjustment system preferably includes an adjustment screw arranged and configured to provide substantially continuous adjustment of fence height and guide pins which restrain lateral and tortional movement of the fence at the height it is adjusted and locked. A preferred height adjustment system is employed in conjunction with a height gauge arranged and configured to be accurate each selected front fence angle.
A preferred plate joiner includes a cutter plunge system arranged and configured to provide a plurality of release positions that reduce the distance traveled in making a plunge cut for a smaller blade and to prevent a blade from protruding from the tool in a release position. A preferred cutter plunge system includes a safety lever which physically excludes a larger blade than is conveniently housed at a forward release position and directs cutting dust toward a dust release aperature in a forward release position.


A ceramic filter is prepared by mixing together a ceramic powder, a pore forming agent, and any sintering aids required in the sintering of the ceramic powder, forming a tape from the mixture, and molding filter plates from the tape. Two types of annular disk filter plates are formed. A first plate type has an opening on the external annular surface, and a second plate type has an opening on the internal annular surface. The two types of filter plates are stacked in an alternating fashion, and end pieces are added to form a filter assembly. The assembly is sintered to form a filter. The pore forming agent is preferably polystyrene microspheres that are decomposed during the sintering process, leaving porosity that effectively captures particulate impurities when a fluid is passed through the filter in service.

This invention relates to the preparation and structure of filters for removing particulates from fluids, and, more particularly, to a cylindrical filter made from a ceramic having carefully sized open-celled porosity
A filter is a device that removes solid matter from a fluid stream, either a gas or a liquid. Filters are primarily of two types. A screen-type filter creates an obstacle to passage for solid matter larger than the mesh size of a screen. A depth- or media-type filter presents a tortuous path through which the fluid and the entrained solid matter must pass. Solid matter is removed by adherence to the interior walls of the passageway. The media filter is able to remove solid matter smaller than the passageway size. The present invention deals with a filter that removes particulate from a fluid stream by both mechanisms.
The media filter must be constructed of a material that withstands the environmental conditions presented by the fluid stream, such as high temperatures, erosion, and corrosion. It must also have a reliably defined internal passageway structure through which the fluid passes. If the passageways have too large a size or provide too direct a path through the filter body, particles will pass through the filter. If the passageways have too small a size or too indirect a path, the filter presents too great a flow resistance to the fluid and becomes unacceptable as an element in a flow stream. The filter must be fabricated at an acceptably low cost for the particular application.
In some applications, the media filter must be able to withstand high fluid temperatures. The filter element must therefore be made of a ceramic material with a pattern of filtering passageways through the filtration membrane. Ceramic filter membranes can be prepared by loosely packing ceramic powders or using the right combination of sintering modifiers mixed with the ceramic powders. When such a mass is sintered (fired), porosity intentionally remains within the structure and provides the path through which the fluid flows. With this approach it is difficult to attain exactly the desired type of internal path. Even where the desired passageway structure is attained, assembling the filter elements with their supports, end plates, etc. into a filter structure may be difficult due to the difficulties in attaining reliable ceramic-to-metal or ceramic-to-ceramic seals.
There remains a need for a reliable, economically fabricated media filter utilizing ceramic filter elements. Such a filter must have a reliably fashioned internal passageway structure that is reproducible in the sense that each filter will achieve substantially the same filtering action and present the same flow resistance to fluids passing through the filter. The present invention fulfills this need, and further provides related advantages.

Porous ceramic filter and preparation thereof


A method of smoothing a silicon surface formed on a substrate. According to the present invention a substrate having a silicon surface is placed into a chamber and heated to a temperature of between 1000xc2x0-1300xc2x0 C. While the substrate is heated to a temperature between 1000xc2x0-1300xc2x0 C., the silicon surface is exposed to a gas mix comprising H2 and HCl in the chamber to smooth the silicon surface.

1. Field of the Invention
The present invention relates to the field of semiconductor processing and more specifically to a method and apparatus for smoothing a silicon or silicon alloy surface.
2. Discussion of Related Art
Semiconductor devices such as microprocessors and memories are fabricated by various steps including the deposition and removal of silicon films. Silicon deposition and removal steps as well as other process steps can cause the surface of silicon films to become rough and contaminated. Rough and contaminated silicon surfaces can generally lead to poor quality interfaces which can lead to poor device performance and reliability. It would therefore be desirable to be able to accurately, reliably, and uniformly treat a silicon surface in order to remove any surface contaminants contained therein and to provide a smooth silicon surface finish. It would also be desirable to be able to treat a silicon surface in a chamber which could subsequently be used to deposit a silicon film. In this way after removing the surface contaminants and smoothing the silicon surface one could directly deposit a silicon film onto the uncontaminated smooth silicon surface without exposing the treated surface to an oxidizing or contaminating environment.
A method of treating a silicon surface. According to the present invention a substrate having a silicon or silicon alloy surface is placed into a chamber and heated to a temperature of between 1000xc2x0-1300xc2x0 C. While the substrate is heated to a temperature of between 1000xc2x0-1300xc2x0 C., the silicon surface is exposed to a hydrogen containing gas mix comprising H2 and HCl in the chamber to treat the silicon surface.

Apparatus and method for surface finishing a silicon film


A system for transmitting digital data representing an original over plural transmission links, at least some of which have limited bandwidth, including a digital data source storing digital data representing the original, a digital data receiver receiving the digital data representing the original via one of the plural transmission links having limited bandwidth and a digital data transmitter operative to transmit the digital data representing the original to the receiver over a transmission link having a limited bandwidth in plural blocks which are sequentially transmitted at a rate determined by the limited bandwidth, each block being an incomplete collection of data which includes parts of multiple frames, each frame being viewable in a selectable order by the receiver even when less than all of the plural blocks have been received, receipt of subsequent blocks by the receiver being used to cumulatively improve the quality of the digital data viewed by the receiver.

The following U.S. patents have been found in a U.S. patent Search and are believed to be generally relevant to the field of the invention:
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When using various media such as video, audio, text and images, a user generally retrieves the media from a storage device or "server" connected via a network to many computers or users. The server downloads the media to the network and transmits it to the user at the user's request.
There are two basic limitations involved in such data retrieval: delay between the time that a user requests the data and the time when the server downloads it to the network, and bandwidth limitations on data throughput and rate of data transmission. The present invention relates to the second limitation.
One example of such a system includes a CD ROM drive and personal computer which may be located at the same site. Another example includes a network connecting Internet servers and users' personal computers. Such networks are installed in order to facilitate convenient data transmission between users and data distribution from the server to the users' computers.
When a user retrieves the media from a storage device or server, typically connected via a network, the aforesaid bandwidth limitations affect the amount of time required to transmit a video frame from the server to the user, and thus limit the video frame rate. Moreover, when dealing with object movies and panoramas the files being transmitted are extremely large, so that overcoming bandwidth limitations is a critical enabling factor, even for high bandwidth networks.
Currently, two methods are employed to overcome bandwidth limitations: The first is to compress the video frame sequence, thereby speeding up transmission time at the cost of additional downstream processing to decompress the frames prior to display. The second is to copy the entire sequence to an intermediate storage device, such as a user's hard disk, to which the user has higher bandwidth access, at the cost of delaying the viewing of the video until the entire sequence has been delivered.
Known network applications involve streaming data from a server to a client computer (hereinafter also referred to as "client"). "Streaming" refers to serial or parallel transmission of digital data between two computers, by transmitting sequences of bit packets. For example, installation executables on a network server stream files to a client computer performing the installation. Servers with large amounts of memory are used to archive digital movies, which are streamed to a client computer for viewing upon demand. Digital video is broadcast from cable stations to subscribers using streaming. Internet browsers, such as Netscape and Microsoft Explorer, are used to stream data from a server on the web to a client. Internet web sites can contain enormous databases, such as phone directories for all of the cities in the U.S., photographs from art galleries and museums around the world, voluminous encyclopedias, and even copies of all patents ever issued by the U.S. Patent & Trademark Office. Clients using the Internet can search these databases and then request the server to download specific information. This request initiates a streaming event.
In view of the multitude of bandwidths present in complex client/server systems today and the large amounts of data necessary to produce compelling audio, video and imaging presentations, there is a pressing demand for scalable data representation of multimedia data, so that it can be delivered for on-line interactive playback in such a form that the transmission rate can accommodate the client bandwidth. The Internet is an example of a complex system where clients with many different bandwidth constraints demand multimedia data from server sites. There are several low bandwidth rates for modem transmission over phone lines, higher rates for frame relay lines, higher rates for ISDN lines, even higher rates for T1 lines, etc.

Method and systems for scalable representation of multimedia data for progressive asynchronous transmission


The present invention relates to a light weight building material (1) for structural work. The light weight building material (1) comprises at least three walls, a first wall (11), a second wall (12) and a third wall (13) formed from a single piece of galvanized iron sheet to form a triangular-section. However, a circular section may also be used while a rectangular section is preferred. The galvanized iron sheet is cut and cold-rolled to form the light weight building material (1).

With our forest fast diminishing, timber supply is getting scarce and inconsistent in grade. This makes the cost of timber as a building material prohibitively high. Over the years, building contractors and developers have been forced to look for alternative materials to reduce the cost of building construction. Many approaches have been proposed in the past to utilize light weight building material made from metal for structural works such as roof trusses or the likes, however until the present invention, the results have not been very encouraging. In many prior art practices, the truss members are formed from a U-shape section of a metal sheet. In one example, the ends of the legs of the U-section are tightly folded back to form a thick double edge. The top chords in prior art practices are formed of inverted U-shaped sections having flanges projecting
One of the major difficulties with many of the prior art practices to manufacturing of metal roof trusses is that different components are used for bottom chords and the top chords resulting in two different fabrication lines or at least two different set ups for fabrication lines are required. Furthermore, two different stock items must be maintained in inventory. In addition, because of the flanges of the top chord members, it is necessary to provide for cutting the flanges off at least one of the top chords at the apex of the truss.
Due to the unfriendly U-shaped of the building material, handling and working with the building material is rather difficult adding unnecessary cost to the construction. Strength and rigidity of the building material are also suspect. The present invention attempts to solve at least partially if not completely these problems.


Synthetic fiber safety cutting scissors comprising a pair of first and second elongated scissor blades, each having an inner side and an outer side and a continuous cutting edge, a plurality of non-cutting protrusions part of the blade, and a gripping means; and a means for pivotally securing said first and second scissor blades to each other with said inner sides facing towards each other such that the said cutting edges cooperate with each other to cut strands of synthetic fiber. It has been found that with the protrusions that foreign objects such as fingers may be prevented from being intersected at the cutting edge.

The invention relates to safety scissors used to cut synthetic fibers. In particular, the invention is directed to scissors having non-cutting protrusions incorporated with a continuous cutting edge, whereby the protrusions are spaced to prevent foreign objects, such as fingers, from coming into contact with the nip of intersecting continuous cutting edges.
Various types of scissors are well known in the art. With the conventional scissors, the one scissor blade, when the scissors are closed, overlaps the cutting edge of the other scissor blade with its cutting edge throughout a portion of the length thereof so that between the cutting edges and the base of the cutting edge gap there is a nip which cuts the material. Most of such scissors are used to cut hair or cut other articles including synthetic fibers. However, as well known to one who has used scissors, foreign objects such as fingers can come between the cutting edges of the scissors, resulting in injuries.
Numerous types of scissors include projections extending from the cutting edge but providing teeth-like gaps as shown in U.S. Pat. No. 4,170,064 and 4,660,285. Thinning scissors with two serrated cutting edges are already known and shown in German Patent Specification No. 932,476. In these at least one scissor blade has round cutting edge at the bottom of each of the gashes. It is also known for scissors to have serrated cutting edge of the scissor blade made corrugated for use in hair trimming.
However, such scissors have sharp serrated edges and still can pose a safety problem. Furthermore, such scissors were not designed for use in cutting synthetic fibers such as nylon, polyester, etc. It is the objective of the present invention to provide a safety scissor such that foreign objects such as fingers are prevented from entering the cutting edge of the scissor blades.