A method for charging plurality of electric vehicles is provided. The method includes determining predicted usage information for the plurality of electric vehicles based on past information for the plurality of vehicles. The predicted usage information, among other information, includes a first total energy needed to be provided to the plurality of vehicles to reach a respective desired state of charge set point. The method further includes optimizing power to be provided to the plurality of vehicles to generate an optimal power requirement plan based on a first cost incurred to charge the vehicles with the first total energy. Furthermore, the method includes scheduling charging of the plurality of vehicles through at least one charging station according to the optimal power requirement plan and a priority associated with each of the plurality of vehicles.

Embodiments of the present invention relate generally to the field of electric vehicles, and specifically, to a method and system for charging electric vehicles.
Growing prices and depleting availability of conventional sources of fuel for vehicles, like petrol, diesel, and natural gas, has given way to the usage of energy storage mechanisms, such as electric batteries, in vehicles. Electric vehicles, as vehicles with energy storage mechanisms are called, are now an important part of the automobile industry with every automobile manufacturer launching electric vehicles.
The electric storage mechanisms, which store energy for the vehicle's consumption, need periodic charging to replenish the charge consumed by the vehicles. Vehicles are generally charged utilizing power generation mechanisms on the vehicle, or charging stations at residences or offices, or on-street charging stations located at public places.
While charging through charging stations, vehicles are plugged in to a charging station/point that is coupled to a power source, such as a utility grid, or a local generator. Charging points/stations are configured to charge an electric vehicle to a state of charge desired by the vehicle user. The charging stations draw power from the power source to provide energy to the vehicles to meet their state of charge requirements. An electric vehicle user thus decides the state of charge she wishes to maintain in the vehicle and charges the vehicle accordingly. Since each vehicle utilizes the charging station individually, available charging station resources are not utilized efficiently, as some vehicles may carry more charge than required and some vehicles may not have enough charge to operate.
Charging management systems, designed to add efficiency to vehicle charging, predict future usage of a vehicle based on past data available from the vehicle to determine the desired state of charge for the vehicle to operate efficiently. Predictive models are designed based on historic usage data for electric vehicles and are provided to charging management systems to determine predicted usage information. The management systems are further configured to transmit charging commands to the charging point/stations to charge the vehicle according to the calculated predicted usage information.
Although the predicted usage information provides important information to the charging station with respect to a single vehicle in isolation, the present day charging management systems do not take into account the change in desired state of charge requirements based on the presence of multiple electric vehicles. The power sources that provide power to the charging stations are, often times, also sources of power to other facilities located in the vicinity of the charging station. Present day charging management systems also do not optimize charging requirements of the vehicles so as to effectively provide charge to all the vehicles to meet at least their minimum requirements and at the same time allow the power source to cater to the power needs of other facilities connected to it.
Existing predictive models also do not take into account a stress in demand felt by power sources when the number of vehicles being charged at charging stations increases. For example, in a densely populated region, a fleet of vehicles being charged at a charging station could lead to greater concentration of power being supplied to the single charging station as opposed to the rest of the region. In similar vein, existing predictive models also do not take into account the stress related to costs felt by charging station providers in making power available for multiple vehicles associated with it.
Hence, there is a need for a method and system for charging of electric vehicles that provides for optimization of resources available with the charging station.

Method and system for charging of electric vehicles


A power converter apparatus that includes a substrate, plate-like positive and negative interconnection members, capacitors, and a cover is disclosed. Pairs of groups of switching elements are mounted on the substrate. The cover is arranged over the substrate to encompass the switching elements, the positive interconnection member, the negative interconnection member, and the capacitor. The positive interconnection member and the negative interconnection member each have a terminal portion that is joined to a circuit pattern on the substrate by ultrasonic bonding.

The present invention relates to a power converter apparatus. In particular, the invention relates to a semiconductor device (power semiconductor module) having a semiconductor circuit that converts an alternating current to a direct current or to a power converter apparatus (inverter apparatus) having a capacitor module that forms a DC smoothing circuit in the power semiconductor module, where its interconnection inductance is required to be reduced.
Japanese Laid-Open Patent Publication No. 2006-318953 discloses a connection structure of terminals of semiconductor apparatus that reduces the inductance of a pair of interconnection members connected to a pair of electrode terminals of an external apparatus. The interconnection members of the above publication are shaped like plates, and arranged to be adjacent to face each other. The flowing directions of currents in the interconnection members are opposite to each other. The interconnection members are joined to the electrode terminals of the semiconductor apparatus to be connected to the interconnection members by ultrasonic bonding, resistance welding, or soldering. A pair of the electrode terminals of the external apparatus are exemplified by the positive terminal and the negative terminal of a capacitor.
Japanese Laid-Open Patent Publication No. 2005-347561 discloses a structure and a configuration that reduce the inductance in each of the internal wiring of a power semiconductor module, the internal wiring of a capacitor module, and the external wiring from the capacitor module to the semiconductor module. Japanese Laid-Open Patent Publication No. 2005-347561 discloses a plurality of insulated substrates 72 provided on a base 71 as shown in FIGS. 11A and 11B. A switching chip 73 and a diode chip 74 are provided on each insulated substrate 72. A positive conductor 75 and a negative conductor 76 are laminated, while being insulated from each other, on the top surface of each of the switching chip 73 and the diode chip 74. An insulation case (not shown) is arranged over the base 71 to cover the insulated substrates 72, the switching chips 73, the diode chips 74, the positive conductor 75, and the negative conductor 76. The positive conductor 75 and the negative conductor 76 include flat plate-like main conductors 75a, 76a and belt-like sub-conductors 75b, 76b formed at ends of the main conductors 75a, 76a, respectively. The sub-conductor 75b of the positive conductor 75 and the sub-conductor 76b of the negative conductor 76 are adjacent to each other while being insulated from each other, and form external terminals P2, N2, respectively. Japanese Laid-Open Patent Publication No. 2005-347561 also discloses an inverter apparatus in which a capacitor module is located on an insulation case of the a power semiconductor module. The capacitor module includes a positive conductor and a negative conductor that are connected to a capacitor element. The positive and negative conductors are each formed by a plate-like main conductor and belt-like sub-conductors. The two plate-like main conductors are laminated together, while being insulated from each other. The belt-like sub-conductors are provided at ends of the main conductors and laminated together, while being insulated from each other. Ends of the sub-conductors form the external connecting terminals. Japanese Laid-Open Patent Publication No. 2005-347561 further discloses an inverter apparatus having branched conductors each provided in an upright state on one of the main conductors 75a and 76a of the positive conductor 75 and the negative conductor 76. Each branched conductor has a branched conductor connected to the capacitor element.
Although Japanese Laid-Open Patent Publication No. 2006-318953 discloses a semiconductor apparatus that reduces the interconnection inductance of the wiring between a capacitor and joint portions of the external terminals of a semiconductor module, the publication discloses no configuration for reducing the inductance of the interior of the semiconductor module. Further, Japanese Laid-Open Patent Publication No. 2006-318953 discloses no structure of a semiconductor apparatus in which a capacitor is accommodated in a case.
Japanese Laid-Open Patent Publication No. 2005-347561 discloses a configuration that reduces the inductance in each of the internal wiring of a power semiconductor module and the internal wiring of a capacitor module, and a configuration that reduces the inductance of external connecting terminals. Japanese Laid-Open Patent Publication No. 2005-347561 also discloses a configuration in which a capacitor module is accommodated in an insulation case of a power semiconductor module.
In the manufacturing process of the inverter apparatus of Japanese Laid-Open Patent Publication No. 2005-347561, in which a capacitor module is accommodated in an insulation case of a power semiconductor module, the terminals of an interconnection member need to be joined to wiring patterns of an insulated substrate with the capacitor mounted on the interconnection member. If the joint is achieved by soldering, the temperature is significantly increased in the vicinity of the capacitor. Accordingly, a special capacitor with enhanced heat resistance needs to be used. However, Japanese Laid-Open Patent Publication No. 2005-347561 has no disclosure regarding the need for such a special capacitor. Also, Japanese Laid-Open Patent Publication No. 2005-347561 has no disclosure whatsoever about whether the insulated substrate 72 is joined by soldering to the connecting conductors that connect the positive conductor 75 and the negative conductor 76 to the insulated substrate 72. However, since it is assumed that soldering is used from the shape of the illustrated connecting conductor, a special capacitor with enhanced heat resistance needs to be used.


A semiconductor device in accordance with the present invention includes IC chips (semiconductor elements) (2, 3, 4) having solder bumps (24) (projecting electrodes) formed on electrode pads, and a first wiring board (1) having connection terminals (7) to which the respective solder bumps (24) of the IC chips (2, 3, 4) are connected, external connection terminals (8) for connection to an external apparatus, and conductor wires (9) provided in respective groove portions formed in a board surface and connected to the respective connection terminals (7). In spite of the reduced pitch of the conductor wires (9), the presence of the groove portions enables an increase in cross section, allowing a reduction in wiring resistance.

Continuous development of more multifunctional and faster semiconductor devices has resulted in an increase in the number of electrode pads (hereinafter referred to as IC pads) provided on an IC chip for connections to an external circuit. Accordingly, a wire bonding scheme of connecting IC pads formed on the periphery of the IC chip to an external circuit via wires has reached performance limits. Thus, a flip chip scheme has been more frequently adopted which involves connecting the IC pads to the external circuit via bumps (projecting electrodes) in order to increase the number of IC pads while minimizing the size of the IC chip.
However, to mount an IC chip with a large number of IC pads on a mother board (mounting board) in an electronic apparatus in accordance with the flip chip scheme, it is necessary to match the land pitch of the mother board with the pad pitch of the IC pads. Consequently, the mother board must be an expensive wiring board on which fine wires can be formed. This is not economical.
Thus, attempts have been made to make wiring rules lenient by using, as an intermediate board (interposer), a resin board (for example, a buildup wiring board) or a ceramic wiring board produced in accordance with intermediate wiring rules between those for the pad pitch of the IC pads and those for an inexpensive mother board.
The interposer also serves to relax thermal stress imposed on solder connections between the IC pads (in actuality, bumps formed on the IC pads) on the IC chip and mounting lands on the mother board, that is, thermal stress resulting from a difference in the coefficient of liner thermal expansion between the IC chip and the mother board (see, for example, Japanese Patent Laid-Open No. 9-64236 and Japanese Patent Laid-Open No. 2001-102492).
However, for resin wiring boards, wires are formed using a plating technique called an additive method. Accordingly, the wiring pitch is limited in terms of the flatness of a base board. For ceramic wiring boards, wires are formed by printing with a conductive paste, preventing the formation of fine wires.
Thus, to cope with the further reduced pitch of the IC pads, a proposal has been made to use a silicon wiring board as a first interposer to increase the pad pitch and to connect the silicon wiring board to a second interposer (for example, a resin wiring board).
However, for silicon wiring boards, wires are formed by deposition or the like, preventing an increase in the cross section of each wire. The wiring resistance of connection wires thus poses a problem when the silicon wiring board is used as an interposer between a high-speed signal or large-current IC chip and an external circuit.
To cope with this problem, a proposal has been made of a structure in which a low-melting-point metal layer is integrally formed on a wiring layer comprising output signal wires or the like through which a relatively large current flows (see, for example, Japanese Patent Laid-Open 61-194744). With this structure, as shown in FIG. 7, a low-melting-point metal layer 103 is formed on a selected wire such as an aluminum wire 102 on a silicon wiring board 101 by a deposition process. The low-melting-point metal layer 103 is then melted and integrated with the wire, while being raised by surface tension. This increases the wiring cross section. The sectional shape of the low-melting-point metal layer 103 portion becomes semi-circular as shown in the figure.
However, for small-pitch wiring, the width of each wire itself needs to be reduced. It is thus difficult to increase the cross section even by raising the low-melting-point metal layer on the wire as described above.

Semiconductor device having recessed connector portions


A cavity configured by electrically connecting an earth conductor formed on a multilayer dielectric substrate and on which a plurality of high frequency circuits are mounted, and a shield cover member. A waveguide aperture is formed on the earth conductor on which the high frequency circuits are mounted and is electrically coupled to the cavity, and an end-short-circuited dielectric waveguide formed in a direction of layer lamination of the multilayer dielectric substrate is connected to the waveguide aperture, and has a length approximately ¼ of an effective wavelength in the substrate of a signal wave. Spatial isolation between the high frequency circuits is ensured by an inexpensive and simple configuration using the single cavity.

In a high frequency package on which high frequency circuits operating at a high frequency band such as a microwave band or a millimeter band are to be mounted, the high frequency circuits are often mounted in a cavity electrically shielded by a metal frame or the like, in view of stability in the operation, EMI (radiated spurious) standard and the like.
In Patent Document 1, to avoid space interference between semiconductor chips of different functions, a package assembly is divided by a seal ring or individual cover member into a plurality of sections (cavities), the semiconductor chips are mounted on each of the divided sections with respect to each function, and the semiconductor chips on the sections are electrically connected by using a feedthrough.
Patent Document 1: Japanese Patent Application Laid-open No. H10-41421

High frequency storing case and high frequency module


A device housing includes a substrate and a color layer formed on the substrate. The color layer consists substantially of titanium zirconium carbonitride. The color layer has an L* value between about 70 to about 80, an a* value between about 10 to about 15, and an b* value between about 22 to about 30 in the CIE LAB color space. The color layer provides a yellow color for the device housing. A method for making the device housing is also described.

1. Technical Field
The present disclosure generally relates to device housings and a method for manufacturing the device housings, particularly device housings having a yellow and metallic appearance and a method for making the device housings.
2. Description of Related Art
Vacuum deposition is used to form a thin film or coating on housings of portable electronic devices, to improve abrasion resistance. However, typical vacuum deposition only can deposit black or gold coatings on the housing, limiting the possible variations in appearance compared to other processes, such as anodic treatment.
Therefore, there is room for improvement within the art.

Device housing and method for making same

SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.


Systems, methods, and other embodiments associated with complex event pattern building are described. One example method includes receiving, on a server-side, requests associated with user interactions with interactive menus. The method includes responding to the requests with commands that build a set of event-condition-action, data that describes an action to take in response to an occurrence of a complex event pattern. The example method may also include automatically converting the event-condition-action data into a programmatic construct that configures a complex event pattern engine to initiate the specified action in response to detecting an occurrence of the complex event pattern.

In data processing environments, complex patterns of events representing exceptions, threats, and opportunities occur across application space and time, Businesses can benefit from identifying these patterns and responding automatically. Complex event processing (CEP) is designed to model event patterns, filter, aggregate, and store event histories, and respond to complex event patterns in real time. Typical complex event processing engines employ a rich type system to model events, and define a language to allow declarative specification of event patterns. Some conventional CEP engines model their type system after relational databases. These systems use SQL-like predicates to describe operations on contents of events. This type of system may be difficult for a typical business user without technical training to approach. Furthermore, CEP engines based on Java® type systems may also be difficult to approach for a business user without technical training.
For example, some typical CEP engines employ complex language constructs to allow event pattern specification. This may cause languages used to define event patterns to be highly technical. Unlike IT applications that are developed once and deployed, complex event patterns that identify exceptions, threats, and opportunities in business applications may be highly dynamic, and may be created and managed by non-technical business users. Creating a language that is detailed enough to capture a broad array of complex event patterns and making it friendly for a business user is challenging. Additionally, some CEP engine vendors offer a thick client user interface tool that allows building and visualizing event patterns. However, due to the underlying languages utilized for defining event patterns, these tools may still be technical in nature and may not be able to be part of larger applications suites catered for business users. Furthermore, the thick client user interface may make it difficult and/or expensive to operate conventional systems on multiple clients and from mobile devices.

Interactive complex event pattern builder and visualizer


A method, a device and a system for establishing neighboring base station connections are provided according to the present invention. In the method, access information of a base station on a bearer network is obtained dynamically, neighborhood information of the base station is obtained according to the access information, and a neighboring base station connection is established according to the access information and the neighborhood information of the base station.

In Long Term Evolution (LTE, Long Term Evolution) network architecture, a base station has two types of interfaces: S1 interface and X2 interface, where the S1 interface is configured for connection between a base station and a gateway, and the X2 interface is configured for connection between neighboring base stations on a bearer network. For the convenience of description, a connection between neighboring base stations on a bearer network may be briefly referred to as a neighboring base station connection, also called an X2 connection.
In the LTE stage, as the coverage radius of base stations is smaller than the coverage radius of base stations in conventional network architecture, the density of base stations needs to be increased, and the number of bearer nodes in a corresponding bearer network is also increased. Meanwhile, as all neighboring base stations need to directly communicate with one another, the number of communication connections between neighboring base stations provided on the bearer network will be very large, that is, a very large number of connections need to be established through the X2 interface. An existing technical solution is adopting a static configuration scheme to complete establishment of connections between neighboring base stations on the bearer network. The bearer network needs to obtain a neighborhood relationship of the base stations in advance, and a network management system of the bearer network completes configuration of circuit connections for the bearer network, so as to achieve mutual communication between neighboring base stations. When the static configuration scheme is adopted to establish connections between neighboring base stations, the networking efficiency is low, and the operation and maintenance cost is high.

Method, device and system for establishing neighboring base station connections


An enclosed electrical circuit and method for manufacturing the electrical circuit are provided. Initially a flexible substrate is formed with a plurality of electrical circuits. By way of example, each circuit can contain a conductive trace, a battery and a die, all in electrical communication. During the manufacturing process, a barrier is placed on the substrate and a curable encapsulant is poured into a cavity formed by the barrier and the substrate to encapsulate each circuit. The barrier can be formed as a compartmentalized dam having a separate cavity for each circuit, as a perimeter dam having a single cavity, or as a spacer sheet having a separate cavity for each circuit formed by a pattern of cut outs. Following the encapsulation step, the electrical circuits can be singulated into separate encapsulated circuits.

Advancements in semiconductor technology have lead to the production of large scale integrated circuits (e.g., chips) which have brought about a revolution in the electronics industry. Packaged and unpackaged semiconductor dice and associated micro-circuitry are now widely used in the production of a variety of electronic devices (e.g., portable computers, calculators, watches, cordless telephones, radios, tape recorders, security systems, etc.). As the development of such portable electronic devices continues, a need has arisen for advancements in the technology relating to forming and packaging devices which employ micro-circuitry.
One of the problems associated with conventional micro-circuitry is that the components typically are mounted on a rigid substrate such as a printed circuit board. This substrate must be such that its structural integrity is sufficient to support the weight of the components and to protect the components from damage. The resulting structural rigidity is often a detriment. Some applications require some flexibility in the substrate to accommodate odd configurations or to avoid breaking of the substrate upon impact with other objects.
To allow the miniaturization to advance while providing sufficient support and flexibility, enclosed micro-circuits have evolved. In the past, these enclosed micro-circuits were sometimes manufactured using a flexible substrate, for example, polyester. A conductive trace was formed on the substrate and various electronic components were then attached to substrate in electrical communication with the conductive trace to form the micro-circuit. The micro-circuit was enclosed by bonding a second polyester sheet over the top of the circuitry. In this configuration, the micro-circuitry was enclosed by a flexible polyester sheet on either side of the micro-circuit.
The method of manufacturing the micro-circuit by enclosing it within two polyester sheets has been somewhat successful. On the other hand, if the components of the circuit are too large, this method of manufacture does not function satisfactorily. Specifically, in the situation where components are more than 1.0 mm tall, the top, and sometimes both the top and bottom sheet, had to stretch over or around the oversized component. The unequal stretching of the top and bottom sheets resulted in wrinkles in the sheets and misalignment between the sheets. Both the wrinkles and the misalignment are unacceptable.
The unacceptable nature of this design was especially apparent where components approached 2.5 mm or more in thickness. Examples of larger components would be batteries which are often necessary for a self-contained electrical circuit. Likewise, this enclosed micro-circuit failed where components had variable heights and outside configurations. As was the case with individually excessive heights, the unequal heights and unequal configurations resulted in stretching, bunching and misalignment. When manufacturers attempted to build arrays of enclosed micro-circuits, they found that the stretching, bunching and misaligning problems were additive and necessitated even thinner components and more equally spaced and sized components to fall within acceptable production limits.
For some applications, a rugged, completely self-contained micro-circuit capable of receiving information, storing information and transmitting information, without physical connection to other components is necessary. The previously described enclosed circuit design was not able to accommodate this need.
In view of the deficiencies in the prior art, the present invention is directed to an improved micro-circuit design that allows the circuit components to be enclosed in a flexible package. Accordingly, it is an object of the present invention to provide an improved micro-circuit and method of manufacture.
It is a further object of the present invention to provide an enclosed micro-circuit that is inexpensive and easy to manufacture, yet offers a high degree of reliability while minimizing the possibility of damage to the internal components.
It is yet another object of the present invention to provide a micro-circuit that is enclosed using a flexible substrate and an encapsulant that entirely surrounds the components, yet still allows a relatively high degree of flexibility.
It is a still further object of the present invention to provide a micro-circuit that can be manufactured in multiple units and then singulated into individual micro-circuits.
It is a still further object of the present invention to provide a self-contained, enclosed micro-circuit able to receive information, store the information in a memory and transmit information as required.
Other objects, advantages and capabilities of the present invention will become more apparent as the description proceeds.

Substrate assembly including a compartmental dam for use in the manufacturing of an enclosed electrical circuit using an encapsulant


A connector assembly includes a shell, an insulator held by the shell and a center contact held by the insulator. The center contact has a terminating segment. The connector assembly also includes a compound dielectric surrounding the terminating segment. The compound dielectric is positioned between the terminating segment and the shell. The compound dielectric includes a first dielectric layer that at least partially surrounds the center contact. The compound dielectric also includes a second dielectric layer at least partially surrounding the first dielectric layer. The second dielectric layer has a different dielectric constant than the dielectric constant of the first layer.

The subject matter herein relates generally to RF connectors.
Due to their favorable electrical characteristics, coaxial cables and connectors have grown in popularity for interconnecting electronic devices and peripheral systems. Typically, one connector is mounted to a circuit board of an electronic device at an input/output port of the device and extends through an exterior housing of the device for connection with a coaxial cable connector. The connectors include an inner conductor coaxially disposed within an outer conductor, with a dielectric material separating the inner and outer conductors.
A typical application utilizing coaxial cable connectors is a radio-frequency (RF) application having RF connectors designed to work at radio frequencies in the UHF, VHF, and/or microwave range. RF connectors are typically used with coaxial cables and are designed to maintain the shielding that the coaxial design offers. RF connectors are typically designed to minimize the change in transmission line impedance at the connection by utilizing contacts that have a short contact length. In most coaxial cable applications, it is preferable to match the impedance between the source and the destination electrical components located at opposite ends of the coaxial cable. When sections of coaxial cable are interconnected by connector assemblies, it is equably preferable that the impedance remain matched through the interconnection.
Conventional coaxial connectors include a matable interface. The interface may include a plug and a compatible receptacle. The matable plug has a variable length to allow compression along the axial direction of the matable plug. The matable plug compresses when mated with the receptacle. The matable plug typically has greater impedance when extended, and approaches optimal impedance when fully compressed.
Known RF connectors having variable length matable plugs are not without disadvantages. For instance, the matable plug may not be fully compressed, thus having a sub-optimal impedance. The sub-optimal impedance may impact electrical performance of the connector. The further the plug is from being fully compressed, the worse the electrical performance.
A need remains for a connector assembly with a matable plug that provides optimal impedance without being fully compressed. A need remains for a connector assembly that may be mated in a safe and reliable manner.


Presence information is shared between a plurality of applications, to grasp a change of presence information of a different kind of application.

The present invention relates to a technique of sharing presence information in instant messaging.
Recently, a technique of instant messaging (so-called text chat) for sending an inputted text to another terminal in real time is rapidly coming into wide use (See NIKKEI COMMUNICATION 2003.9.22, P150-P158, "Technical Commentary—SIP (Session Initiation Protocol)" (hereinafter, referred to as "Non-patent Document 1")). Although it is needless to say that the technique of instant messaging is used for personal purposes, various methods are being studied for applying this technique in business situations such as communication from a staff member on a business trip, an online conference for a project, and the like. The technique of instant messaging employs SIMPLE (SIP for instant Messaging and Presence Leveraging Extension), which is an extension of SIP (Session Initiation Protocol). SIP is prescribed in RFC3261 issued by a standardization group, IETF (Internet Engineering Task Force).

Presence information sharing method and system

Abstract: An IM(X) server 3 receives a notification of a change of presence information from a client A1 (S902), and sends a change notification message for notifying the change of the presence information to a presence server 5 (S906). Then, the presence server 5 sends the change notification message received from the IM(X) server 3 to the IM(Y) server 4 (S908). The IM(Y) server 4 sends the change notification message received from the presence server 5 to a client B2 (S910).


A large intestinal dissociative hard capsule comprising a capsule mainly composed of chitosan, the viscosity at 20.degree. C. of a solution obtained by dissolving the chitosan in an aqueous 1% by weight acetic acid solution being not higher than 100 cps and the degree of deacetilation of the chitosan being from 60 mol % to 98 mol %, having a coated layer of a polymer soluble in a liquid having pH of at least 5 on the surface of the capsule.

Hitherto, for facilitating taking medicines mainly having a strong bitterness and iritative property, gelatin hard capsules have been used. Also, these capsules are generally classified into ordinary gastric hard capsules which are dissolved in a stomach and entero soluble hard capsules which are not dissolved in a stomach but are dissociated in the small intestines. As the enteric capsules, there are known gelatin capsules, the surfaces of the capsules being coated with an alkali-soluble polymer and capsules using an alkali-soluble polymer itself as the base. These capsules utilize the difference in the solubility of the capsules by the difference in pH in the digestive organs. That is, these capsules are not dissolved in a strong acidic stomach having pH of from 1 to 3 but are dissolved in the weak alkaline small intestine such as the intestinum duodenum, the intestinum jejunum, and the intestinum ilium each having ph of from 7.5 to 9.3.
On the other hand, it has been clarified that peptide such as insulin and calcitonin, the absorption of which in digestive organs has been considered to be difficult, is very efficiently absorbed in the large intestine of the colon and the rectum. However, when a peptide preparation encapsulated in ordinary gelatin capsules is simply orally administered, the gelatin capsules are dissolved in a stomach to release the medicament, which is easily decomposed by gastric juices and intestinal protease such as pepsine, trypsin, etc., and loses its effect before reaching the large intestine. Also, even when the medicament is encapsulated in the entero soluble hard capsules as described above, these capsule medicine may pass through a stomach without being dissolved but are relatively easily dissolved in the intestinum duodenum and the small intestine, thereby the medicament is released, the decomposition thereof by intestinal protease can not be avoided, and the effective medical effect can not be expected.
Furthermore, there are similar problems in the medical treatment of a large intestine disease by the PG,4 administration of medicine. For example, for the medical treatment for a ulcerative colitis, 5-aminosalicylic acid or prednisolone is used but when such an anti-inflammatory agent is orally administered in a state of being encapsulated in conventional capsules, the medicament is almost absorbed in the small intestine, thereby a large amount of administration is required for obtaining the medical effect and hence there is a large possibility of causing a side action.
For solving the foregoing problems, it has been desired to develop large intestinal dissociative capsules capable of making local administration of a medicament to the large intestine.

Large intestinal dissociative hard capsules


Provided is an organic light emitting display device. The organic light emitting display device comprises a first substrate, a second substrate facing the first substrate, a transistor on the first substrate, a first contact electrode disposed on the transistor and connected to a source or a drain of the transistor, a subpixel on the second substrate, and a first spacer projected to make an upper electrode included in the subpixel to be in contact with the first contact electrode. An upper surface area of the first spacer is about 0.5% to 20% of an upper surface area of the subpixel.

1. Field of the Invention
This document relates to an organic light emitting display device.
2. Related Art
An organic light emitting element used in an organic light emitting display device was a self emissive element comprising an emission layer disposed between two electrodes formed on a substrate.
The organic light emitting display device is classified into a top-emission type, a bottom-emission type, and a dual-emission type according to a light emission direction. The organic light emitting display device is also classified into a passive matrix type and an active matrix type according to a driving method.
The organic light emitting display device selects one from a plurality of subpixels arranged in matrix and controls the selected pixel to emit light by applying a scan signal, a data signal, and power to the plurality of subpixels arranged in matrix, thereby displaying images.
Meanwhile, some of organic light emitting display devices according to the related art comprise a first substrate and a second substrate. Each of the first and second substrates includes a transistor and an organic light emitting diode, and the first substrate and the second substrate are sealed together through adhesive member. Such an organic light emitting display device according to the related art also includes a spacer that is protruded for helping electric connection between the transistor on the first substrate and the organic light emitting diode on the second substrate.
However, a contact electrode connected to a source or a drain of the transistor may be poorly contacted with an upper electrode on the spacer of an organic light emitting diode when the first substrate and the second substrate are sealed together in the organic light emitting display device according to the related art. Such poor contact causes a black dot detect on a subpixel or abnormal operation of an element. Therefore, such a problem needs to be solved.


Disclosed is a method for acquiring a user signal from among several received from multiple users in a single burst. The method includes receiving a plurality of user signals in a single transmission burst, suppressing multiuser interference among at least some of the plurality of received signals, and determining a carrier frequency of at least one signal from among the interference suppressed plurality of received signals. Said signals may rotate due to a lack of synchronization while being equalized. Also described is a multiuser receiver for acquiring at least one user signal from among several user signals received from multiple users in a single burst. An antenna is for receiving a plurality of user signals in a single spread spectrum transmission burst, a matched filter is for despreading the signals, a multiuser equalizer is for suppressing mutual interference among at least a portion of the plurality of user signals, and a carrier lock circuit is for determining a carrier frequency of at least one user signal of the portion.

To meet the need for ever-increasing information capacity in wireless communication systems, research efforts have recently turned to the physical layer to increase spectral efficiency. One aspect of this research relevant to certain embodiments of this invention is in the area of multiuser receivers. These receivers seek to minimize interference between mutual users of a spread spectrum wireless system, and generally include multiuser detectors, linear decorrelators, and linear minimum mean-square-error (MMSE) receivers. An important distinction between multiuser receivers and their matched-filter counterparts is that multiuser receivers delve into the structure of interference among different (simultaneous) users or the system in order to demodulate the signal of one particular user of interest
Certain prior art receivers increase either information-carrying capacity (traditional capacity, such as defined by the Shannon limit), or user capacity, the latter being the maximum number of users for which a multiuser receiver may reliably demodulate the intended signal. For example, one type of multiuser receiver resolves multiple access interference (MAI) using knowledge of either all (conventional) or none (blind) of the interfering users, though in practice this knowledge in the receiver is incomplete. Another approach is for the multiuser receiver in an ultra-wideband system to combine energy from the multiple users at the densest portion of the multipath channel while disregarding both wideband and narrowband interference. As with much research in spread spectrum wireless communications, these appear to rely on the difference in user power levels being within a quite narrow band.
Regardless of the practical application of the above receivers to cellular communications where effective power control among users is a viable assumption, there exist wireless systems where that assumption does not hold, and where Doppler effects are so great that power control is not practical, in particular in system which transmit data in bursts. Such a system 20 is shown in FIG. 1.
FIG. 1 depicts a series of nodes communicating with one another over a wireless network, preferably secure. Assume a first node 22 carries a multiuser receiver, and wishes to receive communications from any of the other nodes. A second 24 and third 26 node are nearest to the first, and traditional power control may be adequate between them and the first node 22. A fourth 28 and fifth 30 nodes are located proximal to one another as compared to the first node 22, but are moving in different directions at high speed. Doppler effects are opposed and not negligible. Direct power control to the extent achieved in cellular communications is impractical for them, because each node 28, 30 changes its distance from the first node 22 rapidly, and power control cannot keep up with the spatial changes between nodes. As the fourth node 28 closes on the first node 22, its signal carries a higher power level that will obscure the signal from the fifth node 30, whose power level as seen by the first node 22 is decreasing. Traditional open/closed loop power control will lag behind the power levels of the various users seen by the first node 22, essentially blinding it to at least some of the transmissions from the other nodes.
Anticipatory power control based on expected relative position might resolve the above problem were the system 20 a cellular one. Traditional power control presumes that only a single node need receive transmissions from multiple users. In that model individual cellular users can adjust their transmission power such that all received power levels at the cellular base station are equal. But the system 20 of FIG. 1 is a mesh network, and any of the various nodes may include a multiuser receiver to receive transmissions from any other node. In that instance, anticipatory power control may work to constrain received signals to within a narrow power range for one of the nodes, but will expand, even beyond a range that would exist in the absence of power control, the power range for those same signals when they are received by other nodes (depending upon the location of those other nodes).
The above is generally termed in the art as a near-far power imbalance. In the system 20 of FIG. 1, the difference in power for various signals received at the first node 22 may be several orders of magnitude. At any given instant, the first node 22 may seek to receive a signal from what it sees as the strongest fourth node 28 and a weakest seventh node 34. A sixth node 32 may simultaneously seek to receive a signal from what it sees as an intermediate strength fifth node 30 and a weakest second node 24.
In the prior art, coherent multiuser receivers are used to resolve the different user signals. However, they have difficulty in resolving chip and carrier frequency in the presence of large multiuser interference, and often operate reliably only under high signal to noise ratios. What is needed in the art is a multiuser receiver and method that permit detection of multiple spread spectrum users even in the presence of large Doppler uncertainties, large power imbalances, and/or low signal to noise ratios.

Non-coherent multiuser receiver and method for aiding carrier acquisition in a spread spectrum system


A touch sensing apparatus is disclosed, comprising a light transmissive panel that defines a touch surface, an opposite rear surface, and panel sides extending between the touch surface and rear surface. The panel sides define a perimeter of the light transmissive panel. The touch sensing apparatus comprises a plurality of light emitters and detectors arranged along the perimeter and adjacent the panel sides, a light guide arranged along the perimeter and having a first reflective surface comprising a diffusive light scattering element. The light emitters are arranged to emit a respective beam of light onto the diffusive light scattering element so as to generate propagating light that diffusively propagates above the touch surface, wherein the light detectors are arranged to receive detection light generated as said propagating light impinges on the diffusive light scattering element, and wherein the diffusive light scattering element is arranged at least partly outside the panel sides and extending at least partly above the touch surface.

In one category of touch-sensitive panels known as 'above surface optical touch systems', a set of optical emitters are arranged around the periphery of a touch surface to emit light that is reflected to travel and propagate above the touch surface. A set of light detectors are also arranged around the periphery of the touch surface to receive light from the set of emitters from above the touch surface. An object that touches the touch surface will attenuate the light on one or more propagation paths of the light and cause a change in the light received by one or more of the detectors. The location (coordinates), shape or area of the object may be determined by analysing the received light at the detectors.
In a variant of such 'above surface optical touch system', illustrated in FIG. 1, the light from the emitters 109 propagate above the touch surface 102 of the panel via reflection or scattering on an edge reflector or diffusor 130. The light will then continue until deflected by a corresponding edge reflector at an opposing edge of the light transmissive panel, where the light will be scattered back down through the transmissive panel and onto the detectors. Thus, irrespectively of the propagation path, via FTIR or above-surface reflection, the light is initially coupled into the light transmissive panel 101, via a rear surface 106 thereof. Such solution may allow for tolerating larger variations of the properties of the edges of the panel since the edges lie in the outside periphery of the components and light paths mentioned above. However, there may be some signal loss with respect to the part of the light that is scattered to travel above the touch surface, since this light is also coupled through the panel. Furthermore, such an arrangement necessitates that the diffusor 130 overlays the edges 131 of the touch surface 102, so that area available for the touch surface is reduced and that height is added along the edges of the panel. Adding components on top of the light transmissive panel may also compromise the robustness of the system. For example, the thermal expansion coefficients of such components and the light transmissive panel may be different, causing the components to come loose from the panel as a result of temperature variations during operation of the touch system. Even a small or local detachment may cause a significant decrease in the performance of the system.
Some prior art systems rely on coupling and propagation of collimated light across the light transmissive panel. Such systems are however cumbersome to reliably implement due to the small tolerances with respect to the alignment of the components thereof. E.g. the light emitters- and detectors need to be precisely aligned in relation to various lenses and reflect the light via concave and/or convex reflection and/or refraction to get the desired collimation. Such precise alignment may be difficult to achieve in mass production. The use of collimated light, or light reflected by means of specular reflection, also adds to this complexity, which in turn results in a more expensive and less compact system. Furthermore, to reduce system cost, it may be desirable to minimize the number of electro-optical components.

Optical coupling in touch-sensing systems


There is provided a method for culturing a microorganism in which a particular polynucleotide or a recombinant vector comprising it/them is introduced with an intermediate compound necessary for biosynthesis of pyripyropene A. The method of the present invention allows for the production of pyripyropene.

1. Field of Invention
The present invention relates to a method for producing pyripyropene, more specifically, a method for producing pyripyropene A, E, O or the like.
2. Background Art
Pyripyropene A has, as disclosed in Japanese Patent Laid-Open Publication No. 360895/1992 (Patent Document 1) and Journal of Antibiotics (1993), 46(7), 1168-9 (Non-patent Document 1), an inhibitory activity against ACAT (acyl CoA cholesterol acyltransferase) and application thereof to treatment of diseases caused by cholesterol accumulation or the like is expected.
As a pyripyropene A-producing fungus, Aspergillus fumigatus FO-1289 strain has been disclosed in Japanese Patent Laid-Open Publication No. 360895/1992 (Patent Document 1); Eupenicillium reticulosporum NRRL-3446 strain has been disclosed in Applied and Environmental Microbiology (1995), 61(12), 4429-35 (Non-patent Document 2); Penicillium griseofulvum F1959 strain has been disclosed in WO2004/060065 (Patent Document 2); and Penicillium coprobium PF1169 strain has been disclosed in Journal of Technical Disclosure 500997/2008 (Patent Document 3).
Further, as a biosynthetic route of pyripyropene A, a putative biosynthetic route in Aspergillus fumigatus FO-1289 strain has been disclosed in Journal of Organic Chemistry (1996), 61, 882-886 (Non-patent Document 3) and Chemical Review (2005), 105, 4559-4580 (Non-patent Document 4). These documents have disclosed that, in Aspergillus fumigatus FO-1289 strain, partial structures individually synthesized by polyketide synthase or prenyltransferase are linked to synthesize pyripyropene A by a cyclase.

This patent is subject to a terminal disclaimer.


A non-volatile storage element disposed at an integrated circuit is disclosed. The storage element includes a first resistive element having a first magnetic tunnel junction (MTJ) element, a first node coupled to the first resistive element, a second resistive element having of a second MTJ element, a second node coupled to the second resistive element, a sense amplifier having a first input coupled to the first node, a second input coupled to the second node, and an output, and a first conductor disposed to conduct a first current to set the first resistive element to a first resistive value and the second resistive element to a second resistive value different from the first resistive value.

As semiconductor process technology shrinks in dimensions, the leakage current associated with applying power to CMOS circuits greatly increases. One factor limiting the ability of semiconductor integrated circuits to turn off power when not in use is the necessity to retain the state of latch elements in the integrated circuit. Because the latch elements are typically volatile storage, disabling power would cause the loss of the stored state of the latch elements, leading to a loss of critical data. However, in some devices this loss of critical data is undesirable. For example, for a portable, battery-powered, or other device that frequently enters a low-power mode, it is desirable to retain critical system data, so that the device can exit the low power mode without an extensive startup procedure.
Accordingly, there is a need for a non-volatile storage element usable in an integrated circuit that is able to retain the state of the storage element in the absence of power to the integrated circuit.

Non-volatile memory cell and methods thereof


A mobile telephone comprises a telephony unit to process wireless telephony signals and a browser to enable the user to navigate hypermedia information via a wireless network. The telephony unit receives a signal indicating an incoming telephone call with Caller-ID information. The telephony unit provides the Caller-ID information to the browser, which uses the Caller-ID information to identify an action or data previously associated with the Caller-ID information. In one embodiment, the browser looks up ring tone data associated with the Caller-ID information and provides the ring tone data to the telephony unit, which causes a ring tone to be generated based on the ring tone data. Distinctive ring tones may be associated with particular callers or groups of callers. The browser may request ring tone data from a remote server over the wireless network.

Wireless telecommunications is the technology upon which cellular telephones and many other commonly used mobile communications and computing devices are based. This technology has undergone rapidly advancements in recent years and has been adopted worldwide with unprecedented speed. Cellular telephony in particular has the benefit of allowing people to communicate with each other from virtually any location. However, this technology is also increasingly impinging upon users' privacy.
In the past, one could escape the often-intrusive ring of the telephone simply by leaving one's home or the office. Driving in one's car was sometimes a welcome (albeit short-lived) escape from the telephone. Now, however, as people carry their cellular telephones with them almost everywhere they go, they can be reached at virtually any time and in virtually any place by anyone who has their mobile telephone number. More and more commonly, the caller is unknown to the user or may not be someone with whom the user wishes to speak. Thus, for many users, the greater accessibility which a cellular telephone provides also threatens to make the device a nuisance.
To mitigate this effect, many newer-generation cellular telephones have display screens and are equipped to receive and display information provided by a caller identification service ("Caller-ID", also known as Calling Number Identification, or "CNID"). Currently there are two types of Caller-ID services for wireless devices. The first (often referred to as "basic" service) only returns the calling number or an error message and the date/time of the call. The second ("enhanced" Caller-ID) also may return the directory information about the calling number. At a minimum, the name of the subscriber is returned. The subscriber is not necessarily the same as the caller, however; the telephone company has no way to determine who is actually on the line.
It is often inconvenient, however, for the user to have to look at the display screen, and it may be quite hazardous to do so if, for example, the user is driving an automobile. Furthermore, the Caller-ID information sometimes includes the telephone number of the caller but not the caller's name, as noted above. In such cases, if the user has a large number of personal contacts or a poor memory, the user may not recognize the telephone number, even though the caller may be someone with whom the user would like to speak. Accordingly, a better solution to the problem of identifying callers on mobile telephones is needed.

Method and apparatus for using Caller ID information in a browser of a mobile communication device


Apparatus for continuously determining the areal density along a length of a material includes a radioactive source and a scintillating receiver. In a first embodiment, the invention measures the thickness of a traveling web simultaneously at multiple points across its full width. The apparatus includes a radioactive source which extends across one side of the web. A detector array, on the opposite side of the web, detects the emission from the source through the web. The array includes scintillating fibers and multi- or single-anode photomultipliers which may be connected by a scintillating or non-scintillating fiber optic elements to the photomultiplier. In a second embodiment, the invention continuously detects the fill level of a plurality of containers as they are conveyed between the receiver and detector. A scintillating fiber receiver may have its fibers arranged either vertically or horizontally. When arranged horizontally, the fibers may be grouped and conduct photons to single anodes of a multi-anode photomultiplier tube to provide direct physical measurement of the fill level. Still another receiver includes a plastic scintillator sheet directly coupled to a photomultiplier tube.

This invention relates to the continuous measurement of the areal density of a material or object. Any material which tends to attenuate a radioactive source as the material is moved between a radioactive source and a receiver in direct proportion to its areal density, i.e. the density of the material times its thickness. The present invention includes a scintillator for sensing the attenuated radiation which traverses the material and generates light which may be transmitted by a light pipe to an anode of a photomultiplier device for further amplification and processing. The receiver has several embodiments which uniquely utilize scintillating materials and, in some cases, combining them with light pipes for continuous measurement of the areal density of the material throughout a substantial length or width thereof. One receiver embodiment includes a plurality of scintillating optical fibers which may be arranged contiguously and transversely to the radiation source such that light generated by the scintillator embedded in the fiber is piped directly through the fiber to a photomultiplier device for collection and amplification. If a multi-anode photomultiplier device is utilized, the areal density of the material at specific locations thereof may be conveniently collected on a continuous basis. When position data is not desired, a scintillator may be directly coupled to the photomultiplier device. In still other embodiments, a scintillator film may be utilized with optical fibers as light pipes only for transmitting the photons from the scintillator film to the photomultiplier device.
The subject invention may be utilized in several different formats and applications, depending upon the desires of the user. Several of these are disclosed and described herein with specific features adapted for implementing the invention to the specific task at hand. However, the scope of the invention should be considered to be broader than the scope of the particular examples and applications disclosed herein which are intended to be merely exemplary thereof.
One specific application of this invention relates to the continuous measurement of the areal density of a traveling web, and in particular, to the determination of the areal density thereof simultaneously at multiple points which substantially cover the entire width thereof. The preferred embodiment discloses an application of this invention to the problem of determining the basis weight of a paper web, however, the invention may be used to determine the areal density Of many different kinds of materials, such as metal, woven materials such as cotton and synthetic textiles, and non-woven materials such as plastics, etc. Thusly, although the term web is used throughout, it should be understood that it refers to any of these materials.
Presently, the basis weight of a web of paper is determined using a single source which emits Beta or Gamma radiation particles. The radiation passes through the paper web and is measured by a detector on the other side of the web of paper. As it passes through the web, the beam of radiation is attenuated. The attenuation is proportional to the density and thickness of the web, as expressed in terms of its areal density. Thus, the signal received is proportional to the basis weight of the paper web.
The source that is used is generally quite small, only an inch or two in diameter. Consequently, the detector must be mobile to measure the full width of the paper web. Presently, the detector is mounted on an endless belt and travels to and fro across the width of the paper. Thus, at any one time, the information received is only determinative of the areal density of the paper at a single point. To determine the basis weight of the paper, thousands of measurements have to be taken as the device scans across the paper. Because the paper is moving past the measuring device quickly, i.e. up to 7,000 FPM for newsprint, the time spent by the device in measuring a specific part of the web, in the cross direction, is limited. Further, because only an average basis weight, over many thousands of feet of paper, can be determined, it is not possible to use the present scanners to investigate short time span variables which affect basis weight and therefore affect product quality.
Another example of a prior art device is shown in U.S. Pat. No. 3,868,510 entitled Method for Sensing Profile of Sheet or Plate Materials. This device discloses a radiation thickness detector which utilizes a radiation source which is physically moved transversely to a moving sheet of steel. The detector comprises a flat detector plate made from a scintillator with a number of light pipes secured to the scintillator for routing light generated therein to a single anode photomultiplier such as a photoelectron multiplication tube. This device, as with the other prior art device disclosed herein, measures the relative thickness of the moving web at only one point, that point being where the source is positioned. Therefore, this device provides a position sensitive measurement of the thickness of the web also.
In accordance with the invention, one of the preferred embodiments discloses a paper basis weight detector for simultaneously determining the basis weight of a web of paper at multiple points across the width thereof. The detector includes a stationary radioactive source which emits radiation which passes through the paper web. A stationary receiver detects the radiation which passes through the web and converts the radiation to light of a known wavelength. A multi-anode photomultiplier tube (or array of photomultiplier tubes) optically connected to the receiver collects the light which is generated by the receiver. The output of the photomultiplier tube is directed to an analyzer which counts the light photons generated and thereby determines the basis weight of said paper webs.
The receiver includes a plurality of scintillating optical fibers formed into an array. The fibers preferably extend transversely to the direction of motion of said paper web. The array is approximately 2-3 cm in width and 15 cm in length. The array, however, may be of an endless variety of dimensions. The receiver preferably includes a plurality of such arrays which, together, extend the width of the paper.
The fibers of the array extend from the detection region to the photomultiplier tube. The scintillating fibers from each array may be joined into a single non-scintillating fiber optic element which is connected to the photomultiplier tube. Preferably, each array of fiber optics is connected to a different anode to allow for discrete measurement at multiple points across the width of the paper web.
The receiver may alternately comprise a scintillator and non-scintillating optical fibers connected thereto. The scintillator may include a scintillating or phosphor screen to which the fibers are connected in an array. Alternatively, the scintillator may include a plurality of discrete scintillating elements, there being one such element at an end of each said fiber. Preferably, each array of fiber optics is connected to a separate anode of the photomultiplier tube to allow simultaneous measurement at multiple points across the paper web.
The detector preferably can detect a wide range of radiation particles, and in an experimental prototype can detect, e.g., approximately 5.5.times.10.sup.6 Beta and related radiation particles/second. To accomplish this, the source preferably includes a source of Strontium-90, Cesium-137, or other similar radioactive or X-ray emitting source. The source strength used depends upon the specific measurement intended. The Beta particles or X-rays emitted by the source may, optionally, be passed through a collimator.
Still another specific application of the subject invention relates to the continuous measurement of the fill level of a beverage can as a plurality of beverage cans are conveyed therepast. In this application, a linear radioactive source is positioned directly opposite a receiver, and both are spaced apart to provide a path for the plurality of containers as they are conveyed therethrough. A typical example for this specific application would include the detection of a fill level of beer or soft drink in an aluminum can. The receiver may be comprised of an array of scintillating fibers, with the array being oriented either vertically or horizontally. Also, the array may be positioned along the entire height of the container, or may instead be arranged to cover only that upper portion of the container which might be expected to be partially empty. Additionally, the horizontal array of fibers may be grouped and separately coupled to individual anodes of a multi-anode photomultiplier tube, or other photomultiplier device, such that a more accurate indication of the actual fill level may be detected. Alternately, either the vertical or horizontal array of scintillating fibers may be connected to a single anode photomultiplier tube and the relative strength of the signal would be representative of the level of fill in the particular container being sensed. In this particular embodiment of the receiver, scintillating fibers may be used, or, as suggested in other embodiments of other examples herein, a scintillator sheet with optical fiber may be used, or portions of scintillating fiber integrally joined to optical fiber. In still a third embodiment of this specific application, the receiver may be comprised of a plastic scintillator sheet which is directly coupled to a single anode photomultiplier tube, thereby eliminating the use of any optical fibers, scintillating or non-scintillating. In this embodiment, the relative strength of the signal would be an indicator of the fill level of fluid in the container.
One of the objects of the present invention is to provide a radioactive areal density detector with a receiver having a scintillator for converting radiation which traverses an object or material whose areal density is to be detected into a light signal representative thereof. A photomultiplier device may be conveniently coupled to the scintillator and amplifies the light signal for further use. The scintillator may be comprised of either scintillating fibers, or a scintillator material. Optical fibers, if used, conveniently light pipe the photons generated by the scintillator to the photomultiplier device. A single or multi-anode photomultiplier device can provide either one signal, or multiple signals, representative of areal densities at different physical locations throughout the material or device being sensed. The scintillating fibers may be arranged, horizontally, vertically, or in other arrangements as suits the particular application. Specific embodiments representing applications of the present invention in solving particular problems incorporate additional inventive features.
Another object of the present invention is to provide an apparatus which can simultaneously and continuously, in addition to very quickly, determine the thickness of a traveling web at multiple points across the width thereof. Such cannot currently be done with moving scanners.
Another object is to provide such an apparatus which will provide basis weight measurements of a paper web at much shorter time intervals than presently possible.
Another object is to provide such an apparatus which can be situated either at the web end or the dry end of a web of paper.
Another object is to provide such an apparatus which will produce an accurate weight profile of the full width and length of the web.
Another object of the present invention is to provide an apparatus which can continuously, in addition to very quickly, determine the fill level of a fluid in a container. The apparatus may include a linear radioactive source and a receiver mounted in spaced apart relationship such that the plurality of containers may be conveniently conveyed therebetween.
Another object of the present invention is to provide such an apparatus with a receiver incorporating scintillating fibers arranged in an array which is either vertically or horizontally situated with respect to the containers.
Another object of the invention is to provide such an apparatus which may detect the fill level in the container based on the relative strength of the radiation which traverses the container.
Another object of the invention is to provide such an apparatus which will provide a direct physical measurement of the fill level of fluid in a container by utilizing groups of scintillating fibers arranged horizontally with the output of each group being separately collected and amplified to provide separate signals.
These and other objects will become apparent to those skilled in the art in light of the following disclosure and accompanying drawings.

Radioactive areal density detector with scintillating receiver


A method and apparatus for a reinforced leadframe to substrate attachment in a semiconductor assembly. In one embodiment, a printed circuit board having a plurality of electrically coupled electrical contact regions and wire bond areas formed thereon has a leadframe attached thereto such that each of the bonding fingers of the leadframe is coupled to a respective electrical contact region on the printed circuit board. A ribbon of B-staged epoxy is disposed on the leadframe such that the leadframe is disposed between the ribbon of B-staged epoxy and the printed circuit board. An integrated-circuit die is mounted on the printed circuit board with the bonding fingers of the leadframe peripherally surrounding the integrated circuit die. The bonding pads on the integrated-circuit die are electrically coupled to respective wire bond areas on the printed circuit board. By placing the ribbon of B-staged epoxy over the leadframe, the connection between each bonding finger of the leadframe and the respective electrical contact region is reinforced. Thus, the present claimed invention reduces separation between each bonding finger of the leadframe and the respective electrical contact region of the printed circuit board thereby providing improved reliability and yield in such semiconductor assemblies.

1. Field of the Invention
This invention relates to semiconductor manufacturing techniques. Specifically, the present invention relates to reinforced attachment of a leadframe to a substrate.
2. Prior Art
Leadframes are commonly attached to substrates to form a leadframe/substrate assembly. Often, the leadframe is attached to the substrate with the smaller inner tips of the bonding fingers attached to the substrate. An integrated-circuit die is then attached to the substrate within the central opening contained within the leadframe. Bonding pads on the integrated-circuit die are electrically connected to respective bonding fingers to form a semiconductor assembly.
However, during subsequent handling of the leadframe, the bonding fingers of the leadframe may lift or detach from the substrate. If such detachment occurs the reliability of the semiconductor assembly is severely degraded. The degradation of reliability may occur as a result of compromised electrical connection between the integrated-circuit die and the detached bonding fingers, shorting due to contact between the detached bonding fingers and adjacent bonding fingers, or for numerous other reasons.
Additionally, the problem of bonding finger detachment from the substrate is compounded as ultra-fine pitch leadframes are developed. That is, with even greater numbers of bonding fingers per leadframe and with the bonding fingers become correspondingly smaller or thinner, the integrity of the attachment of the leadframe bonding fingers to the substrate is of greater concern.
In seeking to reinforce the leadframe to substrate attachment, it is desired to keep the cost of the assembly to a minimum, and insure that any reinforcement means are compatible with standard subsequent processing steps.
Thus, the need has arisen for means to reinforce leadframe to substrate attachment which does not substantially increase the cost of the assembly and which is compatible with standard subsequent processing steps.

Reinforced leadframe to substrate attachment


A method for making bicycle frames includes a step of preparing a seat tube and a head tube and both of which are then put in concavities of two first movable mold parts on a base board. A top tube and a down tube are prepared by carbon-fiber sheets and connected between the seat tube and the head tube. Two connection ends made by carbon-fiber sheets are connected to the seat tube. Two second movable mold parts are mounted to the first movable mold parts and air is then blown into the top tube, down tube and the two connection ends to inflate the carbon-fiber sheets to contact against inner peripheries of the concavities under high temperature and pressure to let the carbon-fiber sheets be solidified.

A conventional method for making an integral bicycle frame generally requires a mold set including an upper mold and a lower molds and each of which has concavities so that the metal bicycle frames such as aluminum frames are formed in the concavities. However, the bicycle frames requires a large mold set and the cost of the mold set is expensive. The bicycle frames may have different sizes and each size needs a mold set so that the expense for the mold sets of different sizes is a heavy load for the manufacturers.
The present invention intends to provide a method for making a bicycle frame with movable mold parts which can be arranged at desired position so as to manufacture the bicycle frames of different sizes.


Methods and apparatus for synchronizing a first clock of a transmit node and a second clock of a receive node in a packet network are provided. Receive time stamps are generated for transferred packets at a receive node in-accordance with the second clock. Propagation delay variation is filtered from receive time stamp intervals through a filter in accordance with a frequency of the second clock. The filtered receive time stamp intervals and transmit time stamp intervals of the transferred packets are input into a phase locked loop to generate a new frequency for the second clock. The filter and the second clock are updated in accordance with the new frequency for synchronization with the first clock of the transfer node.

During operation, telecommunication equipment requires timing synchronization for proper communication purposes. Traditional synchronization methods utilize expensive specialized circuits to provide synchronization signals. Currently, with the prevalence of packet networks, such as, for example, Ethernet, cost can be reduced for timing synchronization by transmitting timing synchronization signals between telecommunication equipment within the packet network. However, due to the store-and-forward operation of packet networks, the synchronization signals or messages will experience an uncertain delay, which will affect the accuracy of synchronization. This uncertainty in delay is commonly referred to as packet delay variation (PDV). To improve timing synchronization accuracy, it is necessary for such delay to be significantly reduced or eliminated.
There are two known categories of methods for providing timing synchronization with reduced PDV. These categories include probabilistic filtering algorithms and long time averaging.
A probabilistic filtering algorithm filters out any large packet delays and uses the small packet delays for calculation of correction factors and timing synchronization of a local clock of a receive node with a transmit clock of a transmit node. This method usually has high complexity. The process of obtaining satisfactory small delays for calculation is random, therefore, successful performance of the probabilistic filtering algorithms in the short-term is not guaranteed.
In a second category, long time averaging provides a method that averages the delay of multiple transferred packets in order to eliminate the PDV. However, in an actual system, obtaining an absolute time is difficult because the local clock of the receive node is not accurate and requires synchronization. Any adjustment of the local clock may adversely affect the result of the delay averaging. Moreover, this method is not flexible, in that the result of the averaging cannot be controlled.

Methods and apparatus for timing synchronization in packet networks


The present invention discloses a coolant header for hot rolled strip cooling devices, which cools a hot rolled strip fed from a finish rolling mill. The header includes a body provided with a plurality of discharging holes formed through the lower surface of the body such that the discharging holes are arranged along the width of the hot rolled strip and at least three rows of discharging holes are arranged along the length of the hot rolled strip; a coolant pipe provided in the coolant header, with an outlet hole formed on a side surface of the coolant pipe to discharge coolant; an inclined plate placed in front of the outlet hole of the coolant pipe such that the plate is inclined downwards, thus evenly distributing the coolant discharged from the outlet hole over the entire surface of the coolant header; a perforated plate placed above the discharging holes and causing the coolant to flow uniformly; and a flow stabilizing filter placed between the discharging holes and the perforated plate and causing the coolant to flow in a stabilized laminar manner. The present invention discharges a great amount of stabilized flow coolant onto the hot rolled strip, thus maximizing the strip cooling efficiency.

Hot rolled strips, which are sequentially fed from a hot strip mill, are cooled while passing over a run-out table of the mill. In the above state, the process for cooling the hot rolled strips has typically been executed by spraying coolant from nozzles of a coolant header onto a hot rolled strip. Conventional coolant headers, which spray coolant onto hot rolled strips from nozzles, have been classified into turbulent flow-type headers, spray-type headers and laminar flow-type headers according to the coolant spraying style.
The turbulent flow-type coolant headers are configured such that high pressure is applied to the interior of a coolant header and coolant is sprayed onto a hot rolled strip. Thus, the turbulent flow-type headers necessarily have new devices to produce high pressure, thus having complex construction and increasing installation costs. Furthermore, the velocity of coolant sprayed from nozzles of the turbulent flow-type coolant header is very high, so that the flow of coolant which is sprayed from the nozzles and cools the hot rolled strips is unstable. Thus, when the turbulent flow-type coolant headers are used to cool hot rolled strips, large temperature deviations may be induced in each of the strips along the width of the strip.
On the contrary, the spray-type coolant headers to spray coolant through nozzles having small diameters may evenly spray coolant over the overall surface area of each hot rolled strip. However, the spray-type coolant headers are problematic in that the flow rate of coolant sprayed from a header per unit time is not too enough at normal pressure condition, so that the header cannot quickly cool the hot rolled strips and, furthermore, the strip cooling efficiency is reduced. Thus, it is not easy for the spray-type coolant headers to control the temperature of the strips while cooling the strips.
The laminar flow-type coolant headers solve the problems of the two above-mentioned types of coolant headers by discharging relatively stabilized coolant and by evenly cooling the hot rolled strips along the width of each strip.
FIG. 1 illustrates a sectional area of a conventional laminar flow-type coolant header having the above-mentioned properties.
As shown in FIG. 1, the conventional laminar flow-type coolant header comprises an outer tub 10 to store coolant therein, two inner tubs 20 to guide the coolant current discharged from the header onto the surface of a hot rolled strip, and a coolant supply pipe 30 to supply the coolant to the outer tub 10. In the coolant header, both the inner tubs 20 and the coolant supply pipe 30 are arranged along the width of the hot rolled strip.
The coolant supply pipe 30 is arranged between the two inner tubs 20 which are arranged in two lines, with two coolant outlet holes 31 formed on an end of the coolant supply pipe 30 so as to supply the coolant to the respective inner tubs 20. However, when the coolant discharged from the outlet holes 31 is directly introduced into the inner tubs 20, the coolant may flow undesirably quickly and become unstable. Thus, to allow the outlet coolant to flow stably, the outlet holes 31 are placed lower than the inlet holes of the inner tubs 20. Furthermore, to cause the coolant to reliably flow in the laminar flow pattern, both a perforated plate 40 and a flow stabilizing filter 50 are placed in a path through which the coolant flows to each inner tub 20. Therefore, the coolant, finally discharged from the inner tubs 20 through discharging holes 21, flows in a very stable flow pattern.
However, the conventional laminar flow-type coolant header having the above-mentioned construction is problematic in that, because the header has only two rows of discharging holes 21 in a single outer tub 10, the header may not discharge a large amount of coolant onto a hot rolled strip at one time, thus failing to provide a high cooling rate. Therefore, to quickly cool a hot rolled strip having a high temperature using the conventional laminar flow-type coolant headers, a great number of coolant headers must be coupled together in series, thus enlarging the size of a hot rolled strip cooling device and increasing the installation costs of the device.

Hot rolled strip cooling device with coolant header


A compressible footwear that may include a compressible sole and a compressible upper part that is mechanically coupled to the compressible sole. The compressible sole consisting essentially of multiple compressible cells that are made of a flexible material and have top openings and bottom openings. The multiple compressible cells span over at least a majority of the compressible sole and are configured to undergo a compression while substantially maintaining a thickness of the compressible sole.

Footwear such as shoes, slippers, flip-flops, and sandals include a sole and may also include additional elements such as but not limited to an upper part of the footwear.
U.S. Pat. Nos. 7,032,328, 6,883,254, 6,138,385, 4,593,482, 4,507,879, 4,485,568, 4,446,633, 7,032,328, 8,011,119, US2017/119092, US2017/182723, US2015/230548, US2014/373396, US2011/094125, US2010/095554, US2007/051015, US2007/220777, US2006/156576, US2005/060913, US2020/046062, JP2012217827, CN210143932U, CN203969360U, CN207236239U, CN102488351, CN201139113Y, KR101626730, BR102019000782, WO2002/007553, WO2013/005344, WO2018/092023 and "Inventor Spotlight: Oluwaseyi Sosanya and his 3d Weaver Loom", published by Radhika Seth on 4 Jul. 2014 (https://www.solidsmack.com/3d-cad-technology/inventor-spotlight-oluwaseyi-sosanya-3d-weaver-loom/), illustrate various prior art shoes and/or soles.
U.S. Pat. No. 7,376,999 illustrates the need to store a slipper in a confined space and teaches of a slipper having shape memory. The slipper can be rolled up.
US2017/182723, particularly FIGS. 3A, 3B, 11A, 11B, 29A and 29B, may prima facie appear as the closest prior art. US2017/182723 teaches method of forming a structural honeycomb includes cutting and folding a substrate sheet according to predetermined cutting and folding patterns and fold angles that cause the sheet to form a honeycomb having cells that each have at least one face abutting, or nearly abutting, the face of another cell. The honeycomb according to US2017/182723 is then stabilized by joining abutting, or nearly abutting, faces to hold the honeycomb together. The honeycomb in US2017/182723 may have a prespecified three-dimensional shape. The folding pattern according to US2017/182723 may include corrugation, canted corrugation, or zig-zag folds. Joining may employ fixed and/or reversible joinery, including slotted cross section, tabbed strip, angled strip, integral skin, sewn, or laced. At least some folds in US2017/182723 may be partially-closed to create bends and twists in the honeycomb structure. Some surfaces of the honeycomb according to US2017/182723 may be covered with a skin or face sheet. The substrate sheet in US2017/182723 may have flexible electronic traces.
Ofer Tvoua et al. in U.S. Pat. No. 8,011,119 disclose a personally adjustable footwear with at least one sole layer including: a toe portion, a heel portion, and an intermediate portion. The intermediate portion in U.S. Pat. No. 8,011,119 has openings passing vertically through the layer so that the intermediate portion is elastically flexible to allow relative longitudinal displacement of the toe portion and the heel portion to vary a length of the layer without significant variation in a thickness of the layer. A retention mechanism in U.S. Pat. No. 8,011,119 selectively fixes the toe and heel portions in any of a number of relative positions.

Compressible sole for compressible footwear and method of manufacturing compressible footwear


The user of plasma light technology and remote lighting control techniques may enable a single master controller to control a large number of lighting fixtures. Multiple lighting fixtures may be equipped with control applications. Each control application may control the radio frequency driver of a lighting fixture that drives the plasma bulbs of the lighting fixture to produce light output for growing plants. The master controlled may execute on one or more computing devices. The master controller may send input instructions to the control applications of the lighting fixtures via a network. The instructions may be implemented by the control applications to command the radio frequency drivers to regulate a spectral distribution and/or intensity of the light output of the lighting fixtures.

Horticultural grow lights are subject to performance tradeoffs between multiple factors. The multiple factors may include power efficiency, light intensity, and quality of light coverage. With respect to efficiency, some conventional solutions are energy intensive and produce excessive heat radiation. For example, high intensity discharge (HID) bulbs may degrade over time, which means they have to be replaced regularly to maximize photosynthetic activity. Light emitting diode (LED) lights have longer lifespans but are difficult to service and often fail to produce a full light spectrum.
With respect to intensity, plants generally thrive with 600 μMols of light during their vegetative growth stage, and 800 μMols to 1000 μMols for the flowering stage. As used herein, Mol refers to one mole of light that illuminates a surface, specifically Avogadro's number of photons illuminating the surface. Both stages rely on even distribution of light across an intended canopy space to achieve maximum growth.
With respect to quality of light coverage, plants have been evolving for millions of years under light spectrum from the sun. Recreating that light spectrum in an indoor environment has always been a challenge. For example, some lighting solutions rely on different types of light sources, such as a combination of high pressure sodium (HPS) bulbs, metal halide (MH) bulbs, and ultraviolet (UV) bulbs to create a well-rounded light spectrum. LED lights may easily target specific wavelengths, but a full light spectrum may at best be created using a large array of diodes having varied color temperatures. However, the use of such a large array of diodes adds hardware complexity and may generate excessive heat. Furthermore, lighting solutions that are able to avoid the problems of incandescent lights, HID lights, and LED lights may not have controllers with sufficient control fidelity or solution integration.

Intelligent radio-controlled plasma light


A computer-implemented method according to one embodiment includes creating a single data log; storing data from a plurality of different data streams in at least one data unit of the single data log; and allocating an additional data unit to the single data log in response to one or more criteria.

The present invention relates to data storage, and more specifically, this invention relates to storing data efficiently within a data log.
Data logs are a popular way to implement the storage of data within a system. Currently, data from separate data streams is stored within separate data logs. However, each time one of the separate data logs needs to grow in size, a processor and storage resource-intensive allocation operation needs to be performed.

Aggregating separate data within a single data log wherein single data log is divided in a plurality of blocks assigned to plurality of different streams

International Business Machines Corporation


A method for preparing field muskmelon oil includes the following steps: S1, removing foreign matter, including: removing the foreign matter in field muskmelon seeds; S2, low-temperature pressing, including: performing the low-temperature pressing on the field muskmelon seeds after removing the foreign matter in step S1 to obtain an oil residue mixture; S3, filtering and removing impurities: filtering the oil residue mixture obtained by the low-temperature pressing in step S2 to remove the impurities to obtain a primary oil; and S4, centrifugal separation, including: centrifugally separating the primary oil obtained by filtering and removing impurities in step S3 to obtain the field muskmelon oil. The new method avoids using high-temperatures resulting in optimal yield of nutritional content and no harmful byproducts.

Field muskmelon (Cucumis melo L. var agrestis Naud.) is a common annual vegetable with the advantages of drought tolerance, waterlogging tolerance, strong adaptability and large yield. Field muskmelon seeds are nutrient-dense, and contain a mass of oil, which can be used for oil processing. However, there is no method for preparing field muskmelon oil in the prior art. Prior oil processing techniques typically use some form of pressure application in combination with an increase in temperature.

Extraction methods of field muskmelon seed oil


In an echo suppressor, a frequency bin component detector compares a far-end signal amplitude spectrum with a threshold value for each frequency bin to determine whether or not each frequency bin includes a frequency component. A frequency bin echo path characteristic estimator uses the far-end signal amplitude spectrum in the frequency bins determined to have a frequency component by the frequency bin component detector and the near-end input signal amplitude spectrum of corresponding frequency bins to estimate the echo path characteristics of the frequency bins. An estimated echo signal calculation-and-echo suppressor section calculates estimated echo signals based on the echo path characteristic in each frequency bin and the far-end signal amplitude spectrum to suppress the estimated echo signals from the near-end input signal amplitude spectrum.

1. Field of the Invention
The present invention relates to an echo suppressor, and more particularly to an echo suppressor for use in, for example, a telephonic conference system, such as a video teleconference system.
2. Description of the Background Art
For example, in a loudspeaker-assisted telephone conference system such as a video conference system or telephone conference system, when the talker speaks on a microphone, for example, part of his or her voice radiated from loudspeakers may be caught by microphones to return to the talker side in the form of acoustic echo signals. Since acoustic echo signals may severely hinder telephone speech quality, a lot of research and development has been heretofore conducted solutions for suppressing acoustic echo.
Solutions for suppressing acoustic echo may include echo suppressors. The echo suppressor may be implemented by a sort of calculator calculating echo path characteristics, estimated echo signals and an echo suppression gain from far-end and near-end input signals, and multiplying the near-end input signal by the echo suppression gain to thereby suppress acoustic echo signals. One of such echo suppressors is proposed by C. Faller, et al., "ESTIMATING THE DELAY AND COLORATION EFFECT OF THE ACOUSTIC ECHO PATH FOR LOW COMPLEXITY ECHO SUPPRESSION", Proc. Intl. Works, on Acoust. Echo and Noise Control (IWAENC) 2005, pp. 53-56, October 2005.
According to C. Faller, et al., the proposed echo suppressor calculates an echo path characteristic based on far-end and near-end input signals of past frames. The resultant echo path characteristic is multiplied by the far-end signal to obtain an estimated echo signal. The echo suppressor in turn calculates an echo suppression gain based on the near-end input signal and estimated echo signals. The near-end input signal is multiplied by the echo suppression gain, thus suppressing echo signals.
However, incoming far-end signals may generally include frequency bins corresponding to the valleys of the fine structures of speech signals and/or having frequency components smaller on the spectrum envelope of sound signals. Therefore, the frequency components of small frequency bins in a far-end signal may be buried in frequency components of the corresponding frequency bins of background noise.
Under those circumstances, when the echo suppressor set forth in C. Faller, et al., calculates out echo path characteristics of the frequency bins, values entirely different from actual echo path characteristics are obtained to update the echo path characteristics accordingly. Consequently, estimated echo path characteristics may become different from actual ones. This raises a problem that acoustic echo signals cannot be suppressed appropriately.

Echo suppressor using past echo path characteristics for updating