Laser light is emitted from a laser oscillator, and the laser light is made to enter a beam expander optical system including a concave lens through a correction lens. The laser oscillator, the correction lens and the concave lens are disposed so that, when an emission point of the laser oscillator is a first conjugate point, a point at which an image at the first conjugate point is formed through the correction lens is a second conjugate point, a distance between the correction lens and the second conjugate point is b, a focal length of the concave lens is f, and a distance between the correction lens and the concave lens is X, the X satisfies b−3|f|≦X≦b+|f|.

1. Field of the Invention
The present invention relates to a laser light irradiation apparatus and a laser light irradiation method, and particularly relates to a laser light irradiation apparatus and a laser light irradiation method using a beam expander optical system.
2. Description of the Related Art
Recently, a technique for manufacturing a thin film transistor (hereinafter referred to as a TFT) over a substrate has been drastically advanced and developed for being applied to an active matrix display device. In particular, a TFT using a polycrystalline semiconductor film has a higher electron field-effect mobility (also referred to as a mobility) than a conventional TFT using an amorphous semiconductor film; accordingly, high-speed operation is possible. Therefore, although the control of a pixel has been conventionally carried out by a driver circuit which is provided outside a substrate, the control can be carried out by a driver circuit which is formed over the same substrate as the one over which a pixel is formed.
As a substrate used for a semiconductor device, a glass substrate is expected more than a quartz substrate and a single-crystalline semiconductor substrate in terms of cost. The glass substrate has poor heat resistance and is easily deformed by heat. Therefore, when a semiconductor film is crystallized in order to form a TFT using a polycrystalline semiconductor film over a glass substrate, a method for crystallizing a semiconductor film by being irradiated with a laser beam is often used to avoid thermal deformation of the glass substrate.
Features of the crystallization of a semiconductor film by laser light are that, compared with an annealing method utilizing radiation heating or conductive heating, processing time can be drastically reduced, a semiconductor substrate or a semiconductor film over a substrate is selectively or locally heated so that the substrate is hardly thermal-damaged, and the like.
Generally, laser light oscillated from a laser oscillator has a Gaussian spatial intensity distribution. Therefore, in the case where an irradiation object is directly irradiated with laser light oscillated from a laser oscillator, the energy distribution varies in an irradiated region. For example, when crystallization or improvement of film quality is conducted by irradiating a semiconductor film of silicon or the like with laser light, if the semiconductor film is directly irradiated with laser light having a Gaussian spatial intensity distribution, in a central portion and an edge portion of an irradiated region, the energy distribution is different so that melt time of the semiconductor film varies. Consequently, crystallinity of the semiconductor film becomes nonuniform, and a semiconductor film having a desired characteristic cannot be obtained.
Accordingly, in general, after the spatial intensity distribution of laser light oscillated from a laser oscillator is uniformed by using some kind of laser light shaping means, an irradiation object is irradiated with the laser light. For example, as the laser light shaping means, a beam expander optical system is widely used (for example. Reference 1: Japanese Published Patent Application No. H7-41845).

This patent is subject to a terminal disclaimer.

Laser light irradiation apparatus and laser light irradiation method

Semiconductor Energy Laboratory Co., Ltd.


An engine testing device for dynamic pressure loss and valve seal-tightness testing of a running four-stroke engine includes: a first pressure gauge detecting a pressure value in an air intake line to a cylinder of the engine and outputting a first output signal indicative of the pressure value detected; a second pressure gauge detecting a pressure value in an exhaust line of the engine and outputting a second output signal indicative of the pressure value detected; a trigger device detecting an electrical signal indicative of when a selected cylinder of the engine is the particular active cylinder; and a measured value detection device detecting the output signals of the first and second pressure gauges and an output signal of the trigger device, such that an association between points in time of the pressure measurements and the particular active cylinder is enabled.

1. Field of the Invention
The present invention relates to a device and a method for testing pressure loss and valve seal-tightness on a four-stroke internal combustion engine.
2. Description of the Related Art
For vehicle testing technology in repair shops, vehicle system analysis (VSA) engine testing devices or repair shop testing systems, including engine testers, are known, for example the FSA 740 edition of the applicant of the present patent application, which combine the customary functions of classical engine testers in one device. These functions include the measurement of engine-related signals such as primary and secondary ignition coils, control signals for ignition modules, rotational speed, cylinder 1 synchronization, and setting of the ignition timing. These types of VSA engine testing devices may also carry out customary checking and testing functions on recent vehicles, including reading out error memories and actual values, as well as controlling actuators, operating a signal generator for simulating sensor signals for testing sensors together with supply lines and plug-in connections, in particular in the installed state, testing components for the exact location of an error of the component in the installed state, the measuring technique and the display device being preset for the particular components. These types of engine testing devices may also be equipped with one or multiple modules for measuring vehicle emissions.
Vehicle system analysis (VSA) engine testing device 100 shown as an example in FIG. 1 is designed for use in a repair shop, in particular a motor vehicle repair shop. Engine testing device 100 is set up on a rollable stand provided with lockable rollers as shown in FIG. 1, for example, and includes a measuring unit 102, as an essential element, in which the signals are received by the various measuring sensors and converted into internally usable electrical signals, an expansion module 104 for newly added measuring functions relating in particular to the measurement of exhaust gases, a PC 106 having diskette, CD, and DVD drives as well as memory card and USB connections for external accessory devices, a display device 108, for example a monitor in particular, which is connected to the PC, input devices which are connected to PC 106, such as a keyboard 110 and a mouse 112 in particular, a printer 114, likewise connected to PC 106, for outputting measurement reports, an extendable printer cover 116 for protecting the printer and for placing tools for easy access for service personnel, a removable remote control unit 118 for remote operation of engine testing device 100, a remote control receiver 120 for receiving signals emitted by remote control unit 118, a Bluetooth USB adapter 122 and a terminal strip 130 for measuring unit 102, strip 130 being equipped with a plurality of input sockets, some of which are different, for various measuring sensors and control units, and being situated, for example, on a bottom side of measuring unit 102 (as indicated in FIG. 1) or on a back side (not shown) of engine testing device 100 situated in the rollable stand.
As mentioned above, terminal strip 130 of measuring unit 102 includes a plurality of connection sockets, some of which are different, for the various measuring sensors, for example a connection socket 132 for a temperature sensor, a connection socket 134 for the positive and negative battery terminals, a connection socket 136 for a terminal 1 measuring sensor or a terminal 15 measuring sensor, or a measuring sensor of the EFT, TN, or TD series, a connection socket 138 for a trigger device controlled by units of the ignition device of an engine to be tested, a connection socket 140 for a serial interface, for example an RS232 interface, a connection socket 142 for a sensor for measuring a negative high voltage, for example a KV− sensor, a connection socket 144 for a USB connection for a data link to the PC, a connection socket 146 for a sensor for a positive high voltage, for example a KV+ sensor, a connection socket 148 for a voltage supply of measuring unit 102 which is usable as a power supply output of measuring unit 102, a connection socket 150 for a measuring line used in many known standardized sensors, i.e., a so-called channel 1 (CH1) multimeter line or, for example, a current probe for a measuring range of up to 30 A, a connection socket 152 for a further measuring line used in various known standardized sensors, i.e., a so-called channel 2 (CH2) multimeter line or, for example, a current probe for a measuring range of up to 30 A or up to 1000 A, for example, a connection socket 154 for a stroboscope, a connection socket 156 for an air pressure sensor, and a connection socket 158 for a fluid pressure gauge. One example of a so-called clip-on trigger sensor 64 designed for use with a four-stroke internal combustion engine is shown as an example in FIG. 5.
Pressure loss testing on four-stroke internal combustion engines is presently carried out statically, i.e., with the engine idling. A static pressure loss test is relatively time-consuming, since it requires removal of various components of the engine, including the spark plugs, glow plugs, injector nozzles, etc. After the components have been removed, the piston of each individual cylinder of the engine must be brought into the so-called top dead center (TDC) of the compression stroke and fixed. A pressure loss tester is subsequently connected, acted on by compressed air, and calibrated. The pressure loss may be subsequently read off on an appropriate pressure testing device. A possible source of error, i.e., a cause of a possible pressure loss, must be ascertained by locating the air leak. It is not possible to draw conclusions concerning the seal-tightness during actual operation of the engine, i.e., with the engine running, using this type of statically conducted pressure loss testing.

Device and method for dynamic pressure loss and valve seal-tightness testing on a four stroke internal combustion engine


Continuousness and stability of an effect of preventing hip hemlines from rising in walking or a crouching posture are improved. A clothing has: a front body 11 and back body 12 which are stretchable; and a gusset 13 which is disposed between an inner crotch front portion 22 of the lower end of the front body 11 and an inner crotch rear portion 23 of the lower end of the back body 12, to cover a groin portion. The curvature of the rear end portion 13b which is formed in the gusset 13 into a convex arcuate shape is made larger than that of the inner crotch rear portion 23 which is formed in the lower end of the back body 12 into a concave arcuate shape, and the rear end portion 13b and the inner crotch rear portion 23 are stitched together to dispose a dart 26 which three-dimensinalizes so as to suit a bulged shape of a buttock lower portion.

As a clothing such as shorts or a bathing suit in which a countermeasure for preventing the hip hemline from rising is taken, the applicant of the present application has proposed a clothing such as shown in FIGS. 5 to 7 (see Patent literature 1). In the shorts, lower end portions of right and left edges 32, 32 of a stretchable front body 31 are formed into curved edges 32a that are outward convex as shown in FIGS. 5 and 6, lower portions 34a of right and left edges 34, 34 of a back body 33 are cut into a shape which is spread as moving downward, the portions extending from vertical intermediate positions to lower end portions, and the both portions 32a, 34a are stitched together. According to the configuration, it is possible to obtain adequate three-dimensional bulges which are similar to the body shape in the vicinity of the hip hem, in a non-worn state. In a worn state, therefore, the hip hemlines 35 can deeply fit to the gluteal groove portion to deeply envelop the buttock lower portion as shown in FIG. 7. This cooperates with the function of rubber tapes 37 stitched to the peripheries of leg openings 36 to prevent rising of the hip hemlines 35 from a position C to a position D in FIG. 8, from occurring. The rise may occur when the posture of a person is changed from a standing posture to a sitting posture, a bending or crouching posture, or the like.
As shown in FIG. 7, in a worn state, seamlines L of the right and left edges 34, 34 of the back body 33, and the right and left edges 32, 32 of the front body 31 are formed so as to reach the hip hemlines 35 with outward detouring around the tops T of the buttocks. According to the configuration, loose wrinkles and bagginess in portions of the shorts or the like corresponding to the buttock lower portion and the gluteal groove portion are hardly produced in a standing posture, and a beautiful hip hemline is obtained.    Patent literature 1: Japanese Patent No. 3,389,573


10-Deacetylbaccatin III is selectively acylated to baccatin III and derivatives thereof in high yield with anhydrides (e.g. acetic anhydride), catalysed by Lewis acids. Extremely effective catalysts in this reaction are compounds of the formula ML.sub.x wherein M is a rare earth metal and L is a anion, preferably a strong electron withdrawing counterion such as triflate.

The limited availability of the potent antitumour compound paclitaxel (1), isolated from the bark of the Pacific yew tree (Taxus Brevifolia), has motivated scientists to develop an alternative paclitaxel source (Farina (ed.), The Chemistry and pharmacology of Taxol.RTM. and its derivatives, Elsevier Science Amsterdam, 1995, p 7-53). An attractive alternative is the semisynthesis from a paclitaxel precursor isolated from a renewable source. Though many precursors have been isolated and converted into paclitaxel and analogues, these semisyntheses are either too complex, (for example taxine B (Wiegerinck et al., J. Org. Chem., 1996, 61, 7092)), or the amount of isolated precursor is too low (like baccatin III (2) (Halsall et al., J. Chem. Soc., Chem. Commun., 1970, 216)) to be economically feasible. A useful precursor was discovered by Potier et al (C. R. Acad. Sc., 1981, 293, serie II, 501), who isolated 10-deacetylbaccatin III (3) from the leaves of the European yew (Taxus Baccata). Meanwhile it has been demonstrated that this precursor can be isolated relatively easy and in significant amounts (Pilard et al., PCT Application, WO 94/07882). ##STR1##
In the first reported semisynthesis by Greene et al (J. Am. Chem. Soc., 1988, 110, 5917), 10-deacetylbaccatin III is converted into paclitaxel in four steps (scheme 1). Under what are claimed to be carefully optmised conditions, 10-deacetylbaccatin III (3) is protected at the C7-position using 20 equivalents of triethylsilyl chloride in pyridin at 0.degree. C. (c.y. 78%). Acylation with 10 equivalents of acetylchloride for 48 hours at 0.degree. C. results in 7-triethylsilyl-baccatin III in 86% yield. Treatment with excess protected side chain in the presence of di-2-pyridyl carbonate (DPC) and 4 thylamino pyridine (DMAP) at 73.degree. C. for 100 hours gave protected paclitaxel in 80% yield at 50% conversion. Deprotection of the C7- and C2'-position in 89% yield gave paclitaxel (1) in an overall yield of 24% starting from 10-deacetylbaccatin III (3) (48% when based on 50% conversion in step three). ##STR2##
The attachment of the side chain, the weakest point in the synthesis described above, has been improved through the years. For example, Holton et al. developed a process involving the use of .beta.-lactam (4) to couple to 7-triethylsilylbaccatin III in 92% yield to obtain paclitaxel in an overall yield of 61% from 10-deacetylbaccatin III (Holton et al., Eur. Patent Application, 0,400,971). A second improved introduction of the side chain in 100% yield at 77% conversion involves an oxazinone (5). The overall yield from 10-deacetylbaccatin III is 66% (Holton et al., Eur. Patent Application 0,428,376). A third example of a high-yield side chain attachment to 7-triethylsilylbaccatin III uses oxazolidine (6) (94% yield), resulting in an overall yield of 64% (Greene et al., J. Chem. Soc., Chem. Commun., 1994, 2591). ##STR3##
The examples above illustrate that the weak point in the paclitaxel semisynthesis is no longer the attachment of the protected side chain but the conversion of 10-deacetylbaccatin III into C7-O-protected baccatin III.

Method for the preparation of baccatin III and derivatives thereof from 10-deacetylbaccatin III


The invention relates to a stator frame (12) for a submerged linear generator. According to the invention the stator frame (12) includes a cylindrical tube of metal with mounting means (13, 14, 15, 16) for mounting stator packages to the inside wall of the tube. The stator frame (12) also is the external circumferential wall of the linear generator. The invention also relates to the use of such a stator frame (12) and to a method for manufacturing a linear generator with such a stator frame (12).

Wave movements in the sea and in large inland lakes constitute a potential source of energy that has scarcely been exploited so far. However various suggestions have been made to use the vertical movements of the sea for producing electrical power in a generator. Since a point on the sea surface makes a reciprocating vertical movement it is suitable to use a linear generator to produce the electric power.
WO 03/058055 discloses such a wave power unit where the moving part of the generator, i.e. the part that corresponds to the rotor in a rotating generator and in the present application called translator, reciprocates in relation to the stator of the generator. In that disclosure the stator is anchored in the sea bed. The translator is by flexible connection means, such as a wire, cable or a chain connected to a body floating on the sea.
The stator and the translator of the generator are encapsulated in a water-tight housing. Since the generator is located closed to or at the sea bottom service and maintenance thereof is complicated. This requires that the generator is very reliable in operation. Furthermore, in order to provide a competitive energy source in a commercial scale, it is important to minimize the costs for manufacturing and assembling the generator. The requirements on high reliability and low manufacturing costs imply an optimized design and construction of the generator

Stator frame for a submerged linear generator


A component with an internal conductor is so configured that it is ruptured at a predetermined position while forming an arc, if predetermined current/voltage conditions occur at the terminals of the component. The component includes a circuit element which is so arranged that an arc formed at the predetermined position can act on the circuit element such that the circuit element alters its electrical properties.

The invention relates to a component with an internal conductor, which is so configured that it is ruptured at a predetermined position whilst forming an arc if predetermined current/voltage conditions occur at terminals of the component.
A component of the type referred to above is, for instance, a fuse component embodied as a chip fuse. When the current flow through the chip fuse exceeds a maximum value for a predetermined period of time, the fuse can blow, i.e. a fusible conductor can rupture. Beginning at the rupture point, an arc forms in the fuse component, which enables a continued flow of current between the terminals of the chip fuse, notwithstanding the ruptured fusible conductor. The arc and the thus continuing current flow are undesired. Particularly in the event of a short circuit, with very high currents transported via the arc, undesired damage of the fuse element and the surrounding circuit can occur. At least a limitation of the current flowing via the arc on rupturing in the event of a short circuit is therefore desirable. Such a current limitation could be produced, for instance, by a resistance connected in series with the fuse component. Such a series resistance would, however, be disruptive in normal operation with the fuse intact because as small as possible a resistance of the fuse component is desired.
It is thus the object of the invention to provide a component with which a fuse component may be produced, in which a reduced current flow is possible in the event of rupturing without having a negative effect on the operating parameters in normal operation (before rupturing).

Self-configuring component by means of arcing


The present invention relates to a prefabricated boat. The prefabricated boat comprises a body part being composed of a plurality of division members capable of being assembled, an armor part for wrapping around and fixing the body part assembled into a single body, and an air tube mounted on a desired position of the inner face of the armor part. The armor part has the form of a bag and is provided with an opening for receiving the plurality of division members constituting the body part. Air is injected into the air tube to expand it in the state that the armor part wraps around the body part. Due to the expansion force of the air tube, the division members constituting the body part are fixed firmly, thereby preventing the relative movements between the division members.

The conventional leisure boat is too expensive for the public users to own, and needs a separate equipment and place in order to transport and store. Therefore, there have been many limitations in using the convention leisure boats. In order to solve these problems, a rubber boat or a small ship capable of assembling has been proposed.
However, in case of the rubber boat, if it has a scratch generated by an external impact, the boat embraces the danger of air leakage all the time. Although its storage and transportation is not difficult, it is a nuisance that air must be injected whenever in use. Similarly, in case of the small ships capable of assembling and disassembling, the assembling and disassembling work is troublesome and needs a separate tool, etc, and thus can be easily owned or used by a general person.
Furthermore, even if the conventional leisure boat or ship can be disassembled or assembled, it is too heavy for a general person to transport by hand in person. Therefore, in case where it is to be used in a canyon or the like, which is not accessible by a car, its transportation is very difficult or inconvenient. Most of the conventional leisure ships are too expensive for general peoples to own. Accordingly, such a leisure involving these boats or ships is limited to people having above a certain level of financial capability.


A cooler is disclosed. An illustrative embodiment of the cooler includes a thermally-insulated cooler receptacle having a receptacle interior and a thermally-insulated cooler lid carried by the cooler receptacle and positional between open and closed positions. A pressure switch is carried by the cooler receptacle. The pressure switch is closed when the cooler lid is in the open position and open when the cooler lid is in the closed position. A plurality of LEDs is provided in the receptacle interior and connected to the pressure switch. A power source is connected to the pressure switch.

Coolers are commonly used to transport food and/or beverages in a cold condition. A typical conventional cooler includes an insulated receptacle having a pivoting or removable insulated lid. Various food items and/or beverages can be contained in the receptacle with ice to keep the items or beverages cold during travel, for example. In a dark environment, however, it can be difficult to discern the contents of the cooler.


The invention provides a human metaxin protein and polynucleotides which identify and encode MTXP-1. The invention also provides expression vectors, host cells, agonists, antibodies and antagonists. The invention also provides methods for treating disorders associated with expression of MTXP-1.

The murine thrombospondin 3 gene which encodes a epithelial mucin, thrombospondin (TSP3), and the glucocerebrosidase gene, which encodes a lysososmal hydrolase, glucocerebrosidase (GC), are closely linked on the same chromosome, 3E-F1 (Bomstein, P. et al. (1995) Proc. Natl. Acad. Sci. 92:4547-51). TSP3 is a member of a family of at least three thrombospondin proteins encoded by homologous genes in both human and mouse. TSPs are glycoproteins that are secreted by a wide variety of epithelial and mesenchymal cells and are involved in developmental changes in the embryo and in response to injury in the adult. In addition, TSPs foster neurite outgrowth, stimulate and inhibit cell growth and migration, and inhibit angiogenesis (Bornstein, P. (1992) FASEB J. 6:3290-99). GC is a lysosomal hydrolase that degrades glucosylceramide, and a deficiency in this enzyme causes the most common form of lysosomal storage disease, Gaucher disease (Bornstein et al., supra).
A third gene was found in the region between the genes for TSP3 and GC which has been termed metaxin (MTX) from the greek "in between" (Bornstein et al., supra). A similar arrangement of genes is found in humans (Long, G.L. et al. (1996) Genomics 33:177-84). MTX and TSP3 share a common promoter sequence, and the initial nuclear transcripts of MTX and GC may overlap. Thus coordinate regulation of expression of these three genes may reflect metabolic interrelationships among GC, TSP3, and MTX. Metaxin is expressed ubiquitously in tissues of the young adult mouse. Although the specific function of MTX is unknown, a mutation in the mouse gene is lethal early in embryonic gestation and suggests that MTX may be required for embryonic development.
MTX is approximately 90% identical in mouse and human. It is characterized by relatively high levels (10-15%) of leucine, and acidic and basic residues. MTX is a mitochondrial protein encoded by a nuclear gene, but does not contain an amino-terminal signal sequence or N-glycosylation sites. A putative hydrophobic transmembrane domain is found near the carboxy-terminus.
The discovery of a new metaxin protein and the polynucleotides encoding it satisfies a need in the art by providing new compositions which are useful in the diagnosis, prevention and treatment of cancer, immune disorders, and developmental disorders.


A new family of chromium boride coatings having excellent adhesive wear and corrosion resistance is disclosed. The coatings comprise hard, ultrafine, chromium boride particles dispersed in a metal matrix, the particles having an average particle size of less than one micron and constituting less than about 30 volume percent of the coating, the balance being metal matrix. The metal matrix may be composed of nickel or a nickel base alloy containing a metal selected from the group consisting of chromium, silicon and iron. The coatings may be prepared by a process which comprises depositing a mechanically blended powder mixture of chromium metal or a chromium alloy or mixture of both, and a boron-containing alloy onto a substrate and then heat treating the as-deposited coating. The heat treatment effects a diffusion reaction between the deposited elements resulting in the formation of ultrafine particles of chromium boride dispersed in a metal matrix. The coating can be deposited onto the substrate using any of the known deposition techniques.

1. Field of the Invention
The present invention relates to chromium boride coatings having excellent adhesive wear and corrosion resistance and to a process for preparing such coatings. More particularly, the invention relates to hard, dense, low-porosity, wear and corrosion resistant coatings containing ultrafine chromium boride particles dispersed in a metallic matrix. The invention also relates to a process for preparing such coatings in situ by thermal spray and diffusion reaction techniques.
Throughout the specification, reference will be made to plasma arc spraying and detonation gun (D-Gun) techniques for depositing coatings. Typical detonation gun techniques are disclosed in U.S. Pat. Nos. 2,714,563 and 2,950,867. Plasma arc spraying techniques are disclosed in U.S. Pat. Nos. 2,858,411 and 3,016,447. Other thermal spray techniques are also known, for example, so called "high velocity" plasma and "hypersonic" combustion spray processes, as well as the various flame spray processes. Heat treatment of the coatings is necessary and may be done after deposition in a vacuum or inert gas furnace or by electron beam, laser beam, induction heating, transferred plasma arc or other techniques. Alternative deposition techniques such as slurries, filled fabrics or electrophoresis, followed by heat treatment, are also known. Still other methods include simultaneous deposition and fusion utilizing plasma transferred arc, laser or electron beam surface fusion with or without post deposition heat treatment.
2. Background Art
In the petroleum industry, mechanical gate valves are commonly used for handling a variety of corrosive liquids under high hydraulic pressures. During operation of these valves, the gate is required to move against a valve seat quite rapidly under high mechanical force in order to close and seal the valve. Such conditions create severe adhesive and erosive wear on the metallic surfaces of both the gate and valve seat which can lead to early failure of the valve.
It is common practice in the petroleum industry to employ mechanical gate valves having adhesive and erosive resistant coatings applied to the mating metallic gate and valve seat surfaces. Due to differences in substrate materials and types of wear mechanism involved, the coatings applied to the gate and valve seat surfaces are usually different. For example, a detonation gun tungsten carbide based coating has been used successfully to protect the metallic gate surfaces against adhesive wear while the valve seat has been protected by a Ni-Cr-B-Si-Fe alloy applied as an overlay by known welding techniques.
A problem with these particular coating combinations has been that the valve seat coating is not compatible with many heat treated and hardenable alloys which are useful as substrate materials. For example, a conventional Ni-Cr-B-Si-Fe coating alloy, when applied as an overlay to a valve seat made of AISI 410 stainless steel or AISI 4130 steel usually fails by cracking or spalling after heat treatment. This is due to a mismatch in expansion rates between the substrate and coating. Accordingly, there is a present need to develop new coatings which can be employed with a greater variety of substrate materials.

Union Carbide Coatings Service Corporation


A hook for single-cylinder circular knitting or stocking machines with cylinder and circular or semicircular plate. The hook comprises an elongated and flat hook body which has a claw-shaped longitudinal tip. The hook also comprises an elastic-lamina element which is associated with a lateral face of the hook body and has a claw-shaped tip which faces the claw-shaped tip of the hook body. A passage is formed between the lamina element and the hook body and is suitable to be crossed by a needle of the knitting or stocking machine; the claw-shaped tip of the lamina element can flex elastically towards and away from the hook body, respectively to close the claw-shaped tip of the hook body and to allow the extraction of the needle inserted in the passage towards the claw-shaped tip of the hook body.

The present invention relates to a hook for single-cylinder circular knitting or stocking machines with cylinder and circular or semicircular plate.
Conventional single-cylinder circular knitting or stocking machines can close a longitudinal end of the tubular knitted item during its manufacture.
These machines are generally provided with a semicircular plate which is arranged above the needle cylinder of the machine and can be overturned, substantially through a 180.degree. angle, about a diametrical axis of the needle cylinder in order to face one half or the other of the needle cylinder.
Inside the semicircular plate there is a plurality of double radial grooves, and inside each double groove there are two or more hooks whose claw-shaped tips are mutually opposite. The hooks of each double groove can be actuated individually in order to engage the loops formed by the needles of one half of the needle cylinder and to retain them inside the claw-shaped tips during the overturning of the semicircular plate about the diametrical axis. After overturning, the hooks are actuated again so as to release the previously retained loops, which are engaged by the needles of the other half of the needle cylinder.
Through the transfer of the formed loops from one half of the needle cylinder to the needles of the other half of the needle cylinder, an axial end of the tubular item manufactured by the circular knitting or stocking machine is closed.
In order to engage and retain the loops of knitting during the overturning of the semicircular plate, it is necessary to use, for each one of the double grooves of the semicircular plate, at least one pair of hooks in which the tip directed towards the outside of the semicircular plate is claw-shaped and in which the claw-shaped tips of the two hooks are mutually opposite so that by means of the coordinated actuation of the two hooks along the corresponding double groove it is possible to open or close the claw-shaped tip of a hook by means of the claw-shaped tip of the other hook that is arranged adjacent thereto.
As a consequence of this fact, it is necessary to provide a plurality of double grooves inside the semicircular plate in order to accommodate and guide the two hooks.
Other machines use, in order to manufacture items with a closed axial end, a circular plate which is divided into two halves, a first one of which can be overturned below the other circular plate half in order to transfer the loops from the needles of one half of the needle cylinder to the needles of the other half of the cylinder.
In any case, the fact of having to provide two hooks for each loop of knitting to be transferred is a complication of the structure of the machine, also in view of the fact that the hooks of the various pairs must be actuated independently of each other in order to engage or release the knitting loops.

Hook for single-cylinder circular knitting or stocking machines with cylinder and circular or semicircular plate


A laser apparatus that includes a laser light generation section, an optical amplification section, a wavelength conversion section and a suppressing section is provided. The laser light generation section includes a single wavelength oscillatory laser and generates pulsed light having a single wavelength within a wavelength range ranging from about 1.51 to 1.59 μm. The optical amplification section includes an optical fiber amplifier and is optically connected to the laser light generation section to amplify the pulsed light. The wavelength conversion section includes a nonlinear optical crystal and is optically connected to the optical amplification section to perform wavelength conversion of the amplified pulsed light into ultraviolet light. The suppressing section suppresses expansion of a wavelength width of light originated in a nonlinear effect of an optical element between the single wavelength oscillatory laser and the wavelength conversion section.

For example, an exposure apparatus used in a photolithography process for manufacturing a semiconductor integrated circuit optically reduces and projectively exposes a circuit pattern accurately rendered on a reticle (photomask) used as a mask, onto the photoresist-coated surface of a wafer as a substrate. In the exposure, shortening of an exposure-light wavelength (exposure wavelength) is one of the most simple and effective methods to reduce the minimum pattern size (resolution) on the wafer. Hereinbelow, a description will be made regarding conditions that should be provided to configure an exposure light source, in addition to those for the implementation of the wavelength shortening of the exposure-light.
First, for example, an optical output of several watts is required. The optical output is required to reduce time necessary for exposure and transfer of an integrate circuit pattern and thereby to increase a throughput.
Second, when the exposure light is ultraviolet light having a wavelength of 300 nm or shorter, an optical material which can be used for a reflector member (lens) of a projection optical system is limited, and hence the difficulty increases for compensation of the chromatic aberration. For this reason, monochromaticity of the exposure light is required, and the spectral linewidth needs to be controlled to be about 1 pm or less.
Third, the timelike coherence increases in association with the reduction in the spectral linewidth. As such, when light having a narrow spectral linewidth (wavelength width) is emitted as it is, an unnecessary interference pattern called "speckle" is generated. Therefore, in the exposure light source, the spatial coherence needs to be reduced to suppress generation of the speckles.
One of conventional short-wavelength light sources satisfying these conditions is a light source using an excimer laser in which the laser oscillation wavelength itself is a short wavelength. Another conventional short-wavelength light source is of a type using harmonic waves generation of an infrared or visible-range laser.
A KrF excimer laser (having a wavelength of 248 nm) is used as the above-described former short-wavelength light source. Currently, an exposure light source using a shorter-wavelength ArF excimer laser (having a wavelength of 193 nm) is under development. In addition, a proposal has been made for use of an F2 laser (having a wavelength of 157 nm), which is one of excimer lasers. However, these excimer lasers are of a large scale, and the oscillatory frequency thereof is at about a level of several kHz in a present stage. This requires a per-pulse energy to be increased to increase a per-unit-time radiation energy. This arises various problems. For example, the transmittance of an optical component tends to vary because of so-called compaction and the like, complicated maintenance is required and hence costs are increased.
As the aforementioned latter method, there is a method that uses a secondary nonlinear optical effect of a nonlinear optical crystal, and thereby converts long wavelength light (infrared light or visible light) into ultraviolet light of short wavelength. For example, a publication ("Longitudinally diode pumped continuous wave 3.5W green laser", L. Y. Liu, M. Oka, W. Wiechmann and S. Kubota; Optics Letters, vol. 19, p 189(1994)) discloses a laser source that performs a wavelength conversion of light emitted from a solid-state laser excited by a semiconductor laser beam. The publication regarding the aforementioned conventional example describes a method of performing a wavelength conversion for a 1,064 nm laser beam generated by an Nd:YAG laser by using a nonlinear optical crystal, and thereby generates light of a 4th-harmonic-wave of 266-nm. The solid-state laser is a generic name of lasers using a solid-state laser medium.
In addition, for example, Japanese Patent Application Laid-Open No. 8-334803 and corresponding U.S. Pat. No. 5,838,709 proposed an array laser. The array laser is formed to include a plurality of laser elements in a matrix form (for example, a 10×10 matrix). Each of the laser elements is formed to include a laser-beam generating section including a semiconductor laser, and a wavelength conversion section for performing wavelength conversion for light emitted from the laser-beam generating section into ultraviolet light by using a nonlinear optical crystal.
The conventional array laser thus constituted enables an overall-device light output to be a high output while mitigating light outputs of the individual laser elements to be lower. This enables burden onto the individual nonlinear optical crystals to be lessened. On the other hand, however, since the individual laser elements are independent of one another, to apply the lasers to an exposure apparatus, oscillatory spectra of the overall laser elements need to be set identical with one another at the overall width up to a level of 1 pm.
For the above reason, for example, the length of a resonator of each of the laser elements needs to be adjusted, or a wavelength-selecting device needs to be inserted into the resonator to cause the laser element to autonomously oscillate with the same wavelength in a single longitudinal mode. In this connection, these methods arises other problems. For example, the aforementioned adjustment requires a sensitive arrangement; and in proportion to the increase in the constituent laser elements, the complexity of the configuration needs to be increased to cause the overall devices to oscillate with the same wavelength.
On the other hand, known methods of actively unifying the wavelengths of the plurality of lasers include an injection seed method (for example, see, "Walter Koechner; Solid-state Laser Engineering, 3rd Edition, Springer Series in Optical Science, Vol. 1, Springer-Verlag, ISBN 0-387-53756-2, pp.246–249"). According to this method, light from a single laser light source having a narrow spectral linewidth is split into a plurality of laser elements, and the laser beams are used as induction waves to tune the individual laser elements, and in addition, to causes the spectral linewidths to be narrow bandwidths. However, the method has problems in that it requires an optical system for separating the seed light into the individual laser elements and an oscillatory-wavelength tuning control section, thereby increase complexity of the configuration.
In addition, the array laser as described above enables the overall device to be significantly smaller than that with the conventional excimer laser, it still causes difficulty in packaging so as to reduce the diameter of overall arrayed output beams to several centimeters or smaller. The array laser thus configured has additional problems. For example, each of the arrays requires the wavelength modulator section, thereby increasing the cost. In addition, suppose misalignment has occurred in a part of the laser elements constituting the array, or damage has occurred with the constituent optical elements. In this case, the overall array needs to be once disassembled, the defective part of the laser elements needs to be taken out for repair, and the array needs to be reassembled after repair.
The light source may possibly be configured using optical fibers. However, when light having a high intensity is propagated by simply using the optical fibers, problems can occur in that the wavelength width of the propagated light expands because of the influence of various factors attributed to nonlinear effects of the optical fibers. The factors include self phase modulation (hereinafter will be referred to as "SPM"), stimulated raman scattering (hereinafter will be referred to as "SRS") and stimulated brillouin scattering (hereinafter will be referred to as "SBS"). The wavelength width thus expanded reduces the margin for controlling the spectral linewidth of the exposure light to be 1 pm or less.
In view of the above, a primary object of the present invention is to provide an exposure apparatus including a laser device that can be used for a light source of the exposure apparatus, that enables the exposure apparatus to be miniaturized, and that enables the maintainability to be enhanced.
A second object of the present invention is to provide an exposure apparatus including a laser device capable of suppressing the expansion of the wavelength width attributed to an nonlinear effect of a used optical element.
A third object of the present invention is to provide an exposure apparatus including a laser device which enables the oscillatory frequency to be increased, and enables the spatial coherence to be reduced, as well as enabling the overall oscillatory spectral linewidth to be narrowed with a simple configuration.
Additional object of the present invention is to provide an exposing method using the aforementioned exposure apparatus, a device-manufacturing method and an efficient manufacturing method of the aforementioned exposure apparatus.


A method, computer system, and a computer program product for intelligently synchronizing exercise music for an instructor based group workout is provided. The present invention may include identifying at least one goal workout. The present invention may then include receiving a plurality of verbal cues associated with an instructor and a plurality of nonverbal cues associated with the instructor. The present invention may also include analyzing the received plurality of verbal cues and the received plurality of nonverbal cues. The present invention may further include generating the exercise music based on the analyzed plurality of verbal cues and analyzed plurality of nonverbal cues.

The present invention relates generally to the field of computing, and more particularly to data processing.
Becoming and remaining motivated to exercise on a regular basis is challenging for most people. As such, some people choose to go to the gym and work out in a group. An integral aspect of a workout is the background music utilized by the instructors to encourage participants to workout. However, a workout group may become overcrowded thereby creating a difficult environment for a participant to keep up with the workout and for the instructor to follow the music sequence in the group due to the varied experience level of the participants.

Intelligent exercise music synchronization

International Business Machines Corporation


Exemplary embodiments of the present invention provide a method to form a patterned conductive film by modifying a conductive thin film on a substrate irrespective of the material used for the substrate. Exemplary embodiments include a substrate having a conductive layer containing a conductive material and a photothermal conversion layer containing a photothermal conversion material that converts light energy into heat energy that is irradiated with a laser beam to fire at least part of the conductive layer with the photothermal conversion material.

1. Field of Invention
Exemplary embodiments of the present invention provide methods to form a patterned conductive film, electrooptical devices, and electronic appliances.
2. Description of Related Art
The related art includes a conductive thin film formed on a substrate modified by heat treatment. Related art document Japanese Unexamined Patent Application Publication No. 5-21387 discloses a laser annealing technique to modify a thin metal film formed on a substrate by laser irradiation.

Method for forming patterned conductive film, electrooptical device, and electronic appliance


Conductive structures for electrically conductive pads of a circuit board and fabrication method thereof are proposed. The fabrication method includes: providing a circuit board with a plurality of first, second and third electrically conductive pads; forming first and second conductive layers on the circuit board; forming first and second resist layers respectively on the first and second conductive layers, the resist layers having a plurality of openings for exposing the conductive layers on the pads; forming a metal layer in the openings of the first and second resist layers; and forming a first connecting layer on the metal layer; forming third and fourth resist layers on the first and second resist layers respectively, the third resist layer having a plurality of openings for exposing the first connecting layer on the metal layer on the second electrically.

1. Field of the Invention
The present invention relates generally to conductive structures for electrically conductive pads of a circuit board and fabrication method thereof, and more particularly to a fabrication method of different conductive structures for electrically conductive pads on surface of a circuit board for different electronic component connections.
2. Description of Related Art
In a flip chip package, a plurality of electrode pads is disposed on surface of an IC chip and a plurality of solder bumps is formed on the electrode pads. Corresponding to the electrode pads and the solder bumps, a plurality of electrically conductive pads and solder bumps is formed on an organic circuit board such that the IC chip can be disposed on the packaging substrate with its active surface facing down.
Due to increasing demands for electronic products having high speed, high functionality and small size, application field of the flip chip technology is increasing. Meanwhile, in order to further improve electrical performance of the electronic products, passive components such as resistors, capacitors and inductors become necessary in a flip chip package. The passive components are generally disposed on the circuit board by surface mounting technology. As a result, solder bumps and surface mounting component conductive structures exist on the circuit board at the same time. Materials of forming the solder bumps and the surface mounting component conductive structures are designed to be different in height and size so as to match different kinds of electronic components.
The industry usually uses chemical deposition and stencil printing technology to form solder materials on a circuit board.
FIGS. 1A to 1E show a conventional method of forming different conductive structures for electrically conductive pads of a circuit board. As shown in FIG. 1A, an organic insulating protection layer 21 is formed on a circuit board 20 having a plurality of electrically conductive pads 201, and then patterned so as to form a plurality of openings 211 for exposing the electrically conductive pads 201. As shown in FIG. 1B, a metal adhesion layer 22 is formed in the openings 211 on the electrically conductive pads 201 by sputtering, evaporation or electroless plating (or called chemical deposition). As shown in FIGS. 1C and 1D, a stencil 23 having grids 23a is used to form solder materials 24 on part of the metal adhesion layer 22 on the electrically conductive pads 201 of the circuit board 20. As shown in FIG. 1E, solder bumps 24′ are formed by reflowing the solder materials 24. Thus, the metal adhesion layer and solder bumps made of different material are formed on the electrically conductive pads 201 for different component connections.
However, in the stencil printing process, the higher the solder materials, the more difficult it is to control the height of solder bumps or solder balls in subsequent process. Thereby, solder bumps or solder balls of uneven heights are formed in the reflow process, which adversely affects the electrical connection between the chip and the circuit board. Meanwhile, the stencil printing method can easily cause too much solder material to be melted in the reflow process, which thus leads to bridge phenomenon (solder materials joined together at neighboring electrically conductive pads) and short circuit problem. In addition, it is difficult to provide fine pitch electrically conductive pads through such a method. Moreover, the use of too much solder material is not good for environment.

Conductive structures for electrically conductive pads of circuit board and fabrication method thereof

Phoenix Precision Technology Corporation


A mask and method of forming a mask for forming electrode patterns having both closely spaced lines and lines with greater separation between them. The mask uses a pattern formed using attenuating phase shifting material for the region of the mask with lines with greater separation and a binary pattern formed using opaque material in the region of the mask with closely spaced lines. The mask design data is used to determine the mask regions using attenuating phase shifting material and the regions of the mask using a binary pattern. The mask is illuminated using off axis illumination, preferably quadrapole off axis illumination. The mask is formed using electron beam exposure of a resist using more than one exposure dose so that only one layer of resist is required to form the two regions of the mask one using attenuating phase shifting material and one using a binary pattern.

(1) Field of the Invention
This invention relates to the use of masks using attenuating phase shifting material for regions of the pattern with relatively large spaces between lines and binary mask patterns using opaque material for regions of the pattern with relatively small spaces between lines on the same mask substrate. The mask is illuminated using off axis illumination when using the mask to form a pattern on an integrated circuit wafer. The mask is formed using a single resist layer exposed using multiple electron beam exposure doses.
(2) Description of the Related Art
U.S. Pat. No. 5,481,332 to Shiraishi describes a projection exposure method and apparatus for improved image transfer from photomasks having periodic and non-periodic patterns. The projection optical system uses off axis illumination to illuminate the photomask.
U.S. Pat. No. 5,503,951 to Flanders et al. describes a method of forming a photomask using attenuating phase shifting material.
U.S. Pat. No. 5,480,747 to Vasudev describes a method of forming a photomask using attenuating phase shifting material and using embedded absorbers.
A patent application ( ) entitled xe2x80x9cA NEW DOUBLE LAYER METHOD FOR FABRICATING A RIM TYPE ATTENUATING PHASE SHIFTING MASKxe2x80x9d, Ser. No. 08/956,971, Filed on Oct. 3, 1997, and assigned to the same assignee describes a method of forming multiple patterns in a single layer of resist using two different electron beam exposure doses.
A patent application ( ) entitled xe2x80x9cA MASK AND SIMPLIFIED METHOD OF FORMING A MASK INTEGRATING ATTENUATING PHASE SHIFTING MASK PATTERNS AND BINARY MASK PATTERNS ON THE SAME MASK SUBSTRATExe2x80x9d, Ser. No. 09/020,502, Filed on Feb. 9, 1998, and assigned to the same assignee describes a binary mask pattern and a rim type attenuating phase shifting mask pattern formed on the same transparent mask substrate.
A paper entitled xe2x80x9cOptimization of the optical phase shift in attenuated PSM and application to quarter micron deep-UV lithography for logicsxe2x80x9d by K. Ronse et al., SPIE Vol. 2197, pages 86-98 discusses optical techniques to achieve optimization of attenuated phase shifting masks.
A paper entitled xe2x80x9cQuarter Micron Lithography System with Oblique Illumination and Pupil Filterxe2x80x9d by S. Orii et al., SPIE Vol. 2197, pages 854-868 discusses the usefullness of pupil filtering.
A paper entitled xe2x80x9cDependency of side-lobe effect of half-tone phase shift mask on substrate material and topology, and its solutionsxe2x80x9d by Sung-Chul Lim et al., SPIE Vol. 2512, pages 372-383 discusses loss of resist due to side lobe effect.
In the manufacture of semiconductor integrated circuit wafers photolithographic processing methods having good resolution and a large depth of focus are required to form fine lines. The need for very close spacing between the fine lines places added requirements on the photolithographic processing. In regions of the pattern where the spacing between the fine lines is relatively large the use of masks using attenuating phase shifting material produces good results. In those regions of the pattern where the spacing between the fine lines is small, however, attenuating phase shifting material will not give good results due to side lobe effect.
In regions of the pattern where the spacing between the fine lines is small improved results can be obtained using binary masks and off axis illumination, OAI, of the masks. In the case where the parallel lines are in predominantly one direction dipole illumination using off axis illumination works well. In those cases where the parallel lines are in more than one direction quadrapole illumination using off axis illumination will be required.
It is a principle objective of this invention to provide a method of forming a mask having both attenuating phase shifting patterns and binary patterns on the same mask.
It is another principle objective of this invention to provide a method of exposing a layer of photoresist on a substrate using quadrapole off axis illumination of a mask having both attenuating phase shifting patterns and binary patterns on the same mask.
It is another principle objective of this invention to provide a mask having both attenuating phase shifting patterns and binary patterns on the same mask.
These objectives are achieved by forming a layer of attenuating phase shifting material on a transparent mask substrate. A layer of opaque material is formed on the layer of attenuating phase shifting material. The patterns are then formed in both the layer of opaque material and the layer of attenuating phase shifting material. In that part of the pattern comprising lines and spaces wherein the ratio of the width of the spaces between lines to the line width is large the opaque material is removed from the pattern and the pattern is formed using attenuating phase shifting material. In that part of the pattern comprising lines and spaces wherein the ratio of the width of the spaces between lines to the line width is small the opaque material is left in place and forms a binary pattern. The design data used to form the mask is analyzed to determine the regions of the mask in which the opaque material is removed and which regions of the mask the opaque material is left in place.
The mask is then used in a projection system to form the image of the mask on an integrated circuit wafer having a layer of photoresist formed thereon. The mask is illuminated using off axis illumination, preferably quadrapole off axis illumination, and the light passing through the mask is focussed on the layer of photoresist formed on the integrated circuit wafer.
In one embodiment the mask is formed using a single layer of resist. A layer of attenuating phase shifting material is formed on a transparent mask substrate and a layer of opaque material is formed on the layer of attenuating phase shifting material. A layer of resist is formed on the layer of opaque material. The region of the mask where the ratio of the spacing between the lines to the line width is large is exposed with a first exposure dose and the region of the mask where the ratio of the spacing between the lines is small is exposed with a second exposure dose. The resist is then developed leaving a thinner resist pattern in the region of the mask where the ratio of the spacing between the lines to the line width is large. That part of the opaque material and attenuating phase shifting material not covered by resist is then etched away. The resist is then partially etched away thereby removing resist from the region of the mask where the ratio of the spacing between the lines to the line width is large. The opaque material is then etched away from the region of the mask where the ratio of the spacing between the lines to the line width is large leaving a pattern formed of attenuating phase shifting material only. The remaining resist is then removed and the mask is completed.

Type mask for combining off axis illumination and attenuating phase shifting mask patterns

Taiwan Semiconductor Manufacturing Company


Software is prevented from being distributed due to a human-caused error. A software distribution system includes a software distribution server that uses a campaign to manage an update of a function for an in-vehicle device of a vehicle and remotely distributes software based on the campaign, a terminal that executes input and output, and a software update device that is attached to the vehicle and configured to download the distributed software and install the software in the in-vehicle device. In the software distribution system, when the creation of the campaign is requested, statistical information of updated amounts of the software updated based on the most recent multiple campaigns in the target in-vehicle device for the requested campaign is compared with an updated amount of the software updated based on the requested campaign. When a predetermined requirement is satisfied, the requested campaign is not created and a predetermined alert is notified.

The present invention relates to a software distribution system, a software distribution server, and a software distribution method and is suitable to be applied to a software distribution system, a software distribution server, and a software distribution method that enable software to be remotely updated for a device attached to a vehicle such as a car.
In recent years, with the development of driving support functions and automatic driving techniques, the sizes of software installed in in-vehicle devices (electric control unit (ECU)) have been increased. The number of cases where the ECU software needs to be updated for test version upgrades at design and development stages, the handling of a recall due to a software failure, collective version upgrades before and after mass productions, and the like is increasing. There are increasing expectations for a software distribution technique for remotely updating ECU software for cars or so-called Over-the-Air (OTA) distribution by applying a wireless remote software update technique, which has been used for traditional mobile phones and televisions, to cars in order to efficiently handle the increase in the number of cases where the software needs to be updated.
For example, Japanese Patent No. 5829839 discloses a program provision system that prevents a user from operating an in-vehicle device during an update of a program of a control device installed in a vehicle. The program provision system disclosed in Japanese Patent No. 5829839 can effectively complete the update of the program (software) by giving an instruction to update the program when the user of the vehicle is sufficiently far away from the vehicle so as not to operate the in-vehicle device during the update of the program.

Software distribution system, software distribution server, and software distribution method


The present invention include non-porous adherent coatings of chemically inert high purity poly-oligomers deposited on substrates. The coatings are applied and cured on the substrates at relatively low temperatures which permits the coating process to be performed with temperature sensitive structures such as magnets, electronic circuits, electrodes, and bonding pads in place on the substrate. Coated substrates, such as sensors and fluid conduits, have an effective thickness of the protective non-porous coating that is chemically bonded to a surface of the substrate that will be contacted with a fluid. The adherent non-porous coating on the substrate protect it from corrosion, particle generation, swelling, or delamination caused by contact with the fluid.

There is a continuous effort to develop pressure sensors, chemical sensors, and housing materials that are lower in cost and smaller in size, yet are characterized by high reliability, sensitivity, and linearity. For example, multiple pressure sensors, temperature, and optical sensors having sensing diaphragms, cavities, and resistive elements can be made on a single silicon wafer using semiconductor fabrication processes. In the processing of such cells, sensor elements such as the thin diaphragm of a pressure sensor are formed in a silicon wafer through preferential chemical etching. Ion implantation and diffusion techniques are then used to drive doping elements into the diaphragm, forming resistive bridge circuit elements whose electrical resistance changes with strain. As a result, deflection of the diaphragm causes a change in resistance value of the piezoresistive elements, which can then be correlated to the magnitude of the pressure applied to the diaphragm.
The use of standard single-crystal silicon wafers and standard semiconductor device fabrication processes allows many such cells to be fabricated from a single wafer, providing some economy of scale. However, silicon is susceptible to chemical attack, particle generation, and erosion by various media, particularly in applications where a high-pressure, temperature, and corrosive fluids are to be sensed, e.g., semiconductor manufacturing, long term medical implants, and automotive applications. One particularly difficult and sensitive application of integrated circuits, semiconductors and metal electrodes is in electrical or electronic device implantation in a human or animal body. Extra-cellular fluids within the body are saline, and often contain a number of other ions or other electrolytes. At body temperatures, severe and rapid corrosion may lead to rapid and untimely failure of the device. For such applications, a pressure, temperature, or chemical sensor and fluid handling devices in contact with these fluids (i.e. catheters, pumps, heat exchangers, or conduits) must also be of high chemical purity, physically rugged and resistant to the hostile environment of the sensed medium. It would be advantageous that a micromachined silicon sensor cell include some form of protection in order to realize its superior operational characteristics in the chemically hostile environment. Current methods for producing media-compatible, high-pressure sensors include enclosing a silicon sensing chip in an inert fluid, such as a silicone oil or gel, and then further separating the sensing chip from the medium to be sensed with a metal diaphragm, such that pressure must be transmitted through the metal diaphragm and fluid to the sensing chip. While achieving some of the operational advantages of silicon pressure transducer cells, the manufacturing processes for these sensors are relatively expensive and complicated.
Piezoelectric and capacitive pressure sensors are typically thin ceramic plates or diaphragms that may be coated with thick-film electrodes or bridge elements to form capacitors or strain sensing elements. However, each of these also have certain disadvantages, such as complex circuitry to detect capacitance changes, the requirement for ceramic-to-ceramic bonds, and a maximum pressure capability typically not exceeding about 1000 psi (about 7 MPa). For higher pressures, metal diaphragms have found use as the sensing element, however these diaphragms are not generally useful in corrosive aqueous solutions. Metal diaphragms generally deflect more for a given thickness and pressure than ceramic diaphragms. With metal diaphragms bridge elements or electrodes may be deposited on to a dielectric insulating layer on the metal followed by thin-film polysilicon or metal deposited on the metal diaphragm to form the bridge or electrode structures. For example, a thin-film polysilicon layer is deposited on the dielectric to form the piezoresistors of the bridge, followed by thin-film metallization to provide electrical interconnects. As is conventional, the thin-film layers are typically deposited by such processes as chemical or physical vapor deposition. The equipment necessary for these processes is expensive, and deposition rates are extremely slow and difficult to use with complex structures and large structures like housings, bellows, or conduits. Deposition of the thin-film layers requires multiple patterning, exposure, developing and stripping steps for the required thin-film photoresists and metallization, and must be carried out in a controlled environment to assure that no air borne particles are present on the surface to be coated. In addition, because such processes deposit thin-films usually no thicker than 10,000 angstroms, the surface of the metal diaphragm must be extremely smooth to avoid rough surface features penetrating through or producing discontinuities in the deposited thin films. Finally, the resistance of the resulting polysilicon thin-film piezoresistors can vary dramatically with temperature.
Typically, a sensor is contained within a chemically and mechanically protective housing. The housing essentially surrounds the sensor and any associated electronics for sensor excitation and signal processing. While this provides mechanical protection for the sensor, protection from hazardous chemicals and contaminants in the medium must also be provided. In one type of pressure sensor assembly, a silicone gel, fluorosilicone gel, or silicone oil is applied over the external surface of a pressure sensor and essentially partially fills the housing in which the pressure sensor is mounted. The gel or oil is covered with a membrane. The manufacture of these cells can be cumbersome and expensive.
Various materials have been developed to provide an electrically insulative moisture barrier over a substrate. Among the more prominent of these are aromatic polyimides such as those sold under the trade designation "Kevlar" by E.I. DuPont de Nemours, & Co. However, polyimides are highly viscous, difficult to deposit, and can easily entrain gas bubbles leading to film defects. Parylene N coatings are produced by vaporizing a di(p-xylylene) dimer, pyrolyzing the vapor to produce p-xylylene free radicals, and condensing a poly-oligomer from the vapor onto a substrate that is maintained at a relatively low temperature, typically ambient or below ambient. Parylene N is derived from di(p-xylylene), while parylene C is derived from di(monochloro-p-xylylene), and parylene D is derived from di(dichloro-p-xylylene).
Although parylenes have generally advantageous electrical, chemical resistance and moisture barrier properties, it has been found that these poly-oligomers do not adhere well to many substrate surfaces, particularly under wet conditions. Although these poly-oligomers are quite resistant to liquid water under most conditions, they are subject to penetration by water vapor which may condense at the interface between the parylene film and the substrate, forming liquid water which tends to delaminate the film from the substrate. Vapor deposited parylene films are also generally quite crystalline and are subject to cracking which may also create paths for penetration of moisture to the substrate surface. Parylene has been used to protect devices and larger substrates, or a thermally bonded fluorinated polymer casing has been used. Both have been found to offer relatively poor performance in critical applications. The parylene coatings suffer from high diffusion rates, and the thermally bonded devices, provided the devices or substrate can tolerate the processing conditions, have been known to undergo mechanical stress cracking at the bond seams.
These organic coatings may be used either alone or together with fluorosilicone gels. Fluorosilicone gels are used to protect the sensor device, wirebonds, portions of the package, and leads. Fluorosilicone gels have several disadvantages including an incompatibility with fuels (e.g., swelling).

Non-porous adherent inert coatings and methods of making


A Viterbi decoding circuit performs Viterbi decoding on the basis of a reproduced signal obtained by reading an optical disc. A decoded bit sequence is fed to a first specific pattern detection circuit and a first reverse pattern detection circuit. A path metric difference ΔM is fed to a reproduced signal evaluation circuit. The reproduced signal evaluation circuit extracts path metric differences for a specific pattern and a reverse pattern detected by the first specific pattern detection circuit and the first reverse pattern detection circuit and evaluates the reproduced signal on the basis of results. The evaluation uses not only the bit sequence for which the ideal SAM value is a minimum. The invention achieves accurate evaluation for reproduction.

Conventionally, jitter is often used as an index in the evaluation of quality of signals reproduced from an optical disc. However, in view of a recent trend to detect data with PRML (Partial Response Maximum Likelihood) to achieve high density recording, Jitter, which varies with time, does not make a suitable quality index. Another evaluation index used is the bit error rate of PRML data detection results, which however requires measurement of a lot of sample bits and is likely to be affected by defects caused by scratches on the disc and other factors.
With such a background, T. Perkins, "A Window Margin Like Procedure for Evaluating PRML Channel Performance," IEEE Transactions on Magnetics, Vol. 31, No. 2, 1995, pp. 1109-1114 suggests a quality evaluation method for reproduced signals called "SAM (Sequenced Amplitude Margin)."
The concept of SAM will be described in reference to FIGS. 33 and 34. An example is taken here in which a bit sequence recorded by (1,7) RLL (Run Length Limited) encoding is decoded by PRML based on PR (1,2,1).
As shown in FIG. 33, the reproduced signal waveform for an ideal 1T mark which reflects PR (1,2,1) and is free of distortion and noise has a 1:2:1 sample level ratio for each channel clock. "T" is the time equivalent to one cycle of a channel clock. An "nT mark" is a mark which has a length equivalent to nT. The reproduced signal waveform for a mark longer than or equal to 2T is obtainable through superimposition of waveforms like this one for a 1T mark. For example, the sample level ratio is 1:3:3:1 for a 2T mark, 1:3:4:3:1 for a 3T mark, and 1:3:4:4:3:1 for a 4T mark. An ideal reproduced signal waveform for a given bit sequence is thus known. There are five ideal sample levels: 0, 1, 2, 3, and 4. For convenience, the sample levels are normalized for maximum amplitudes of ±1. The five normalized, ideal sample levels are −1, −0.5, 0, +0.5, and +1.
Viterbi decoding is employed here as a specific way to realize PRML decoding. Let us examine the trellis diagram shown in FIG. 34 which is drawn for the Viterbi decoding with the sample levels specified above. In FIG. 34, S(00), S(01), S(10), and S(11) denote different states. State S(00) indicates that the preceding bit is a 0 and the current bit is a 0. State S(01) indicates that the preceding bit is a 0 and the current bit is a 1. State S(10) indicates that the preceding bit is a 1 and the current bit is a 0. State S(11) indicates that the preceding bit is a 1 and the current bit is a 1.
A line connecting one state to another is called a branch, indicating a state transition. For example, the S(00)-to-S(01) branch represents a "001" bit sequence. In FIG. 34, letters a to f are allocated to identify individual branches. The identifying letters are accompanied by an ideal waveform level expected in the state transition. For example, the ideal level for "a" is −1 because the letter represents a "000" bit sequence. The ideal level for "b" is −0.5 because the letter represents a "100" bit sequence. The S(01)-to-S(10) and S(10)-to-S(01) branches are missing from the diagram, because the "010" and "101" bit sequences cannot occur due to the d=1 Run Length Limit in the (1,7) RLL code which is a modulation scheme where the shortest mark length is 2T.
In a trellis diagram, a "path" is formed by connecting continuous branches from a given state via another. To consider all possible paths is to consider all possible bit sequences. The most likely path, or "correct path", can be determined by comparing the signal waveform actually reproduced from the optical storage medium with every ideal waveform expected from the paths to find the ideal waveform that is the closest to the reproduced waveform, that is, the one with the least Euclidean distance from the reproduced waveform.
Now, a Viterbi decoding procedure based on a trellis diagram will be specifically described. At a given time, there are two paths merging at each of states S(O) and S(11), whereas there is a single path coming in to each of S(01) and S(10). Of the two paths merging at S(00) and S(11), retain as the survivor path the one with a less Euclidean distance between the ideal waveform for each path and the reproduced signal waveform. This leaves four paths each terminating at a different one of the four states at a given time. The square of the Euclidean distance between the ideal waveform for the path and the reproduced signal waveform is termed the path metric. The path metric is calculated by summing up branch metrics for all branches making up the path (the branch metric is the square of the difference between the ideal sample level of the branch and the sample level of a reproduced signal waveform.
Let X[t] represent the sample level of the reproduced signal waveform at time t; Ba[t], Bb[t], Bc[t], Bd[t], Be[t], and Bf[t] represent branch metrics for the respective branches a, b, c, d, e, f at time t; and M(00)[t], M(01)[t], M(10)[t], and M(11)[t] represent path metrics for the respective survivor paths leading to states S(00), S(01), S(10), and S(11) at time t. These branch metrics and path metrics are calculated by the following set of equations (1) and (2):Ba[t]=(X[t]+1)^2Bb[t]=Bc[t]=(X[t]+0.5)^2Bd[t]=Be[t]=(X[t]−0.5)^2Bf[t]=(X[t]−1)^2  (1)M(00)[t]=Min{M(00)[t−1]+Ba[t],M(10)[t−1]+Bb[t]}M(01)[t]=M(00)[t−1]+Bc[t]M(10)[t]=M(11)[t−1]+Bd[t]M(11)[t]=Min{M(01)[t−1]+Be[t],M(11)[t−1]+Bf[t]}  (2)
Note that Min{m,n}=m if m≦n and n if m>n.
The process of selecting a smaller path metric from M(00)[t] and M(11)[t] corresponds to the determination of a survivor path.
By repeating the procedure for determining the survivor path every time a sample value for the reproduced signal waveform is received, the path with a greater path metric is removed, so that the number of paths decrements to one. This path is regarded as the correct path so that the original data bit sequence is correctly reproduced.
Here, let us now consider conditions under which Viterbi decoding is correctly done. For the correct path to be ultimately chosen, the path metric must be less for the correct path than for the other path (error path) every time the survivor path is determined. These conditions are expressed by the following set of equations (3):
(3) For a correct bit sequence ending with 000,ΔM=(M(10)[t−1]+Bb[t])−(M(00)[t−1]+Ba[t])>0
For a correct bit sequence ending with 100,ΔM=(M(00)[t−1]+Ba[t])−(M(10)[t−1]+Bb[t])>0
For a correct bit sequence ending with 011,ΔM=(M(11)[t−1]+Bf[t])−(M(01)[t−1]+Be[t])>0
For a correct bit sequence ending with 111,ΔM=(M(01)[t−1]+Be[t])−(M(11)[t−1]+Bf[t])>0
For a correct bit sequence ending with 001 or 110,                ΔM>0 because the survivor path is always determined correctly.
In the set of equations (3), ΔM is a path metric difference between two paths one of which will be the survivor path. The difference is termed the SAM. To allow no error occurrence, it is required that SAM>0. This fact indicates that error occurrence is increasingly unlikely with increasing SAM value.
A method of evaluating system reliability using SAM is suggested in U.S. Pat. No. 5,938,791 (Date of patent, Aug. 17, 199). According to the method, the reliability of a reproduction device is examined with the standard deviation of the frequency distribution of SAM as an evaluation index.
FIG. 35(a) is a SAM frequency distribution graph prepared from an actual signal reproduced from a (1,7) RLL code sequence recorded on an optical disc. As apparent from these results, a typical SAM distribution has a plurality of peaks. This is because in the calculation of a SAM for all reproduced signals, the Euclidean distance between the correct and error paths differs from one bit sequence to the other.
Now referring to FIG. 35(b), for completely noise-free, ideal reproduced signals from (1,7) RLL code sequences, the SAM frequency distribution shows a plurality of ideal discrete values: namely, 1.5, 2.5, 3.5, 4.5, 5, 6, 7, 8, and 9. The frequencies of the ideal values vary because the ideal values involve different numbers of bit sequences, and the bit sequences occur at different frequencies in the (1,7) RLL code sequences. Actual values deviate from these ideal values due to various noise on the reproduced signal, resulting in multiple distributions being superimposed as shown in FIG. 35(a).
The U.S. Pat. No. 5,938,791 technique generates a SAM distribution as an evaluation index by selecting a bit sequence which, due to noise, yields a SAM<0 at a high probability and a minimum ideal SAM value of (1.5). Although some two or more bit sequences yield the minimum ideal SAM value. The technique however does not distinguish between those bit sequences. In addition, the technique does not use the bit sequences that do not yield the minimum ideal SAM value. Thus, information is insufficient for use in the evaluation of reproduced signals at high accuracy.

Signal quality evaluation device, information read/write device, signal quality evaluation method, write conditions determining method, signal quality evaluation computer program, computer-readable storage medium containing signal quality evaluation computer program


A machine tool for multiple working for material removal from surfaces of bodies including a working station in which a plurality of rotary tools are positioned around a feed trajectory of said bodies; and guide means in which the bodies to be worked are made to translate one after another along said feed trajectory with a predetermined orientation position. At least one pair of rotary tools of said working station, intended to interact with the surfaces to be worked, inside slits in said bodies, in combination with each other and with guide means provided with partitions, help to keep said bodies in position during their related transit through said working station.

In the prior art, methods are already known from document U.S. Pat. No. 4,761,918 for grinding pump rotor surfaces involving the working, with stationary support, of a set of rotors that have slits which are channel-shaped, radial, which are drawn near in a pack with the slits correspondingly aligned and in which the slits are run through one after another by a disk grinding wheel translating with a movement one way then the other parallel to the axis of the rotors.
The grinding is carried out, one slot at a time, for all of the slots in the pack that, subsequently and by means of an angular rotation of the entire pack about its own axis, are in an orderly way exposed to the interaction of the grinding wheel until the grinding operations on all of the rotors to be worked have been completed.
Prior art techniques that can be traced back to the above-mentioned operating method have the fundamental disadvantage of requiring long working times and proportionally high working costs.

Machine tool for multiple working of surfaces of bodies


An automated commodity customer delivery driven method/system to manage commodity sales by acquiring a chance of purchase of a selecting customer as well as another new customer for a relevant commodity by assuring availability of the inventory for both customers of the relevant commodity. The shop inventory for the selecting customer is acquired according to acceptance of a temporary reservation status for requesting acquisition of the inventory of the selected commodity and the inventory in the shop that was acquired for the selecting customer is returned to the number of inventories for selling to the other new customer, based upon a specified method of transferring the selected commodity to the selecting customer.

1. Field of the Invention
The present invention relates to a commodity sales management system. Particularly, the present invention relates to a commodity purchasing management system for acquiring chances of purchase by new customers, while attaining the inventory for the customers who have selected the commodities.
2. Description of the Related Art
A selling or shopping method at a shop may be roughly classified into two types of selling methods. In one selling method, a customer carries a commodity selected from those being displayed to a determined place of settlement, such as a place where a cash register is installed, and purchases the relevant commodity at the place of settlement. The selling method has been employed, for example, at a shop such as a supermarket for dealing with miscellaneous commodities for daily use.
In another selling method, the desired commodity may be purchased by designating a commodity to be purchased at the place of settlement using a commodity card attached to a corresponding commodity in a showcase. This selling method is employed, for example, at a volume retailer or the like of household electric appliances. The practical sequence in this selling method is as follows.
First, a customer decides to purchase based upon samples of commodities displayed in the showcase by evaluating the same with a hand or the like and then obtains commodity cards as many as the commodities desired to be purchased from the commodity cards attached to the showcase or the like corresponding to the desired commodities. When the customer presents the commodity cards at the place of settlement, the commodities to be purchased may be designated and these commodities are transferred or delivered after the settlement.
Accordingly, in this selling method using the commodity cards described above, it is required that the number of commodity cards attached to the corresponding commodities in the showcase indicates the number of commodities in inventories provided for selling. However, a customer having obtained the commodity card does not always purchase the commodity designated by the commodity card. Moreover, in some cases, the commodity card may be taken by other action, such as mischief or the like, or a commodity card may be replaced or misplaced with that attached to another commodity. Therefore, the number of commodity cards often does not adequately indicate the number of commodities in inventories provided for selling. Accordingly, even when the inventory provided for selling is prepared, the commodity card is sometimes missing, resulting in the situation that a chance of purchase of/by a customer who is hoping to purchase a certain commodity may be lost.
In view of eliminating such disadvantage, supplement of commodity cards must be performed adequately so that the number of commodity cards attached to the commodities in the showcase is always matched with the number of commodities in inventories provided for selling. However, for example, there can be a situation when a customer is discussing or contemplating purchase of the relevant commodity from which the attached commodity card has been removed by other customer and the other customer who is in the course of moving to the place of settlement has the commodity card of the relevant commodity. Therefore, when a commodity card supplement is made at a time of adjusting the number of commodity cards so that the commodity card is matched with the number of commodities in inventories provided for selling, there can be a situation in which commodity cards within the shop exceed the number of commodities in inventories provided for selling. In this case, a situation may be generated that a customer who has obtained a commodity card cannot purchase such commodity, because the commodity cards exceed the number of inventory commodities.

Commodity purchasing management system and method


The disclosure includes a system and method for recommending social activity data and social conversation to a user. The system includes a processor and a memory storing instructions that, when executed, cause the system to: determine one or more topics associated with a message based at least in part on message data included in the message; determine knowledge data describing the one or more topics associated with the message; determine social activity data describing one or more user activities associated with a group of one or more social users based at least in part on the knowledge data, the one or more user activities describe the one or more topics; and determine graphical user interface data for displaying the social activity data associated with the message.

The present disclosure relates to social networks.
Many users share links or start a conversation through emails. However, email is not an optimal mechanism for sharing links or for engaging in a conversation. Social networks are changing the way users communicate with one another by providing a better mechanism for users to easily share information and engage in a conversation with other users.

Encouraging conversation in a social network


The combination scooter/backpack is an article carrying device with the capacity to be converted into a wheeled land vehicle, and therefore has two modes of usage. The article carrying device resembles a conventional backpack with two straps positioned to be placed over the user's shoulders, entitled backpack mode. The wheeled land vehicle functions as a popular collapsible scooter, two wheels mounted upon a board member with propulsion means provided by user's contact with the ground, entitled scooter mode. A horizontal handlebar is positioned at the top of the combination and serves to steer the front wheel during scooter mode. Conversion between backpack mode and scooter mode is accomplished with the raising and lowering of said handlebar and the manipulation of releasable fasteners and latches. In both backpack and scooter modes, a cover circumferentially surrounds the combination scooter/backpack to secure and protect components that are not in use.

The presented invention involves an apparatus for article carrying. The apparatus is generally a wheeled article carrier with the capacity to convert into a rider-operated scooter. Additionally, the article carrying function of the apparatus is not lost when the scooter is in use.
Presently, students and travelers of all ages employ back or shoulder carried devices to carry their belongings. Supporting these heavy loads, especially over extended periods of time, has been shown to promote muscular and skeletal back injuries. This occurs most commonly while walking long distances, for example, a child's walk to and from school or a tourist's path to and from a train station. The present invention allows those distances to be traversed without any stress on the back, therefore saving the child, or user, from injury. Currently this product exists as two separate products, a backpack and a scooter, but they cannot be used together in the beneficial manner this invention proposes. Combining the equipment therefore creates a unique solution to an everyday problem.


A pressure sensor apparatus and method that incorporates a silicon frit bonded cap. The pressure sensor includes a silicon sensor wafer with diaphragms at a bottom surface thereof, a silicon cap wafer mounted on the topside of each sensor wafer, a plurality of silicon sensor die formed on the sensor wafer, a silicon cap wafer etched to create a plurality of reference cavities on the topside of the diaphragm, a thin glass frit to form a wafer-to-wafer bond between the sensor wafer and cap wafer. Sensing devices such as semiconductor die/sensor, peizoresistors, can be used to sense the pressure. The wafer-to-wafer frit bonding improves the output signal drift and the thermal performance of the pressure sensor minimizes the thermal mismatch created by anodic bonded glass wafers.

Pressure sensors find a variety of industrial and commercial applications, such as automotive vehicles, hydraulic systems, engine testing, and so forth. Gage pressure sensors, vacuum pressure sensors, differential pressure sensors, absolute pressure sensors and barometric pressure sensors, for example, represent different types of pressure sensors widely accepted in industry today. Depending on particular aspects of their characteristics, each one of these sensor types can be used for a different application. Such devices can be adapted for use for, example, with high-accuracy pressure measurements in hostile media, such as corrosive liquids and gases and hence, need to be robust, reliable while maintaining a long lifetime with greater corrosion resistance.
Some pressure sensors use dry air as the pressure media. Media other than dry air often produces adverse effects, however, on the sensor's performance and long-term stability. For example, a known compensated semiconductor pressure sensor has been adapted for use as a fluid media compatible integrated pressure sensor. Such a device generally includes a sensor capsule, a semiconductor die, a diaphragm region responsive to applied pressure, an outer frame region, a stress isolation region to couple the rim region to the outer frame region, and a silicon cap bonded to the outer frame region of the semiconductor die to cover the diaphragm region. Such a sensor, however, lacks the ability to interact properly with fluid media as well as gaseous media and also faces drawbacks such as corrosion.
Another type of known pressure sensor is based on the formation of a topside reference cavity for a pressure sensor. Such a device includes a silicon diaphragm having bottom and top surface and media being applied to the bottom surface. The cap is glass such as Pyrex and is attached by anodic bonding. The media pressure is sensed by the pressure sensor in relation to the reference pressure sealed on the topside of the diaphragm. This device, however, faces some major problems like output signal drift.
A further known semiconductor pressure sensor includes a first semiconductor layer that forms a base, an insulating layer formed on the first semiconductor layer, a second semiconductor layer formed on the insulating layer and a diaphragm portion constituting a pressure-sensitive region. The methods of formation of the layers for such a device are difficult to use in harsh media such as fluid media or gaseous media.
Pressure sensors should be compatible with fluid media as well as gaseous media if such devices are to work efficiently and with the greatest possible accuracy. Such pressure sensors should ideally be able to operate with improved thermal expansion matching and improved signal output drift. Therefore, there is a need for a pressure sensor that overcomes the aforementioned drawbacks.

Pressure sensor with silicon frit bonded cap