The invention relates to a component arrangement which has the following features:                a semiconductor body (10),        a dielectric layer (20) which is applied to one face of the semiconductor body (10),        a planar transformer with a primary winding (40) and a secondary winding (30), which are isolated from one another by the dielectric layer (20) and are arranged at a distance from one another in a vertical direction with respect to the one face of the semiconductor body,        a first planar winding section (31) and a second planar winding section (32) of the secondary winding (30), which are arranged at a distance from one another in the vertical direction and are electrically conductively connected to one another, with a first connection (34) of the first winding section (31) forming a first connection of the secondary winding, and a first connection (36) of the second winding section (32) forming a second connection of the secondary winding.

One component arrangement is described, by way of example, in DE 102 32 642 A1. FIG. 1 shows one such known component arrangement in the form of a side view (FIG. 1a), a plan view of the planar windings (FIG. 1b), and in the form of an electrical equivalent circuit (FIG. 1c).
In this component arrangement, a dielectric layer 120 is arranged on a semiconductor body 110 and electrically isolates a primary winding 140 and a secondary winding 130 of a planar transformer from one another. The secondary winding 130 is connected, for example, to integrated circuit components (which are not illustrated in any more detail) in the semiconductor body. The primary winding may be connected to other circuit components in the same semiconductor body 110 or in another semiconductor body (not illustrated). The circuit components to which the primary winding 150 is connected form, in particular, a transmission circuit, and the components to which the secondary winding is connected form, in particular, a receiving circuit for a data transmission device, in which the transformer is used as an inductive coupling element between the transmitter and receiver, and at the same time as a potential barrier between the transmitter and receiver.
The primary winding 140 and the secondary winding 130 are each arranged as a conductor loop with two or more turns on in each case one (metallization) level in the dielectric layer 120, and thus form a planar transformer without a transformer core, which is referred to in the following text as a coreless transformer.
In the equivalent circuit shown in FIG. 1c, C140 and C130 denote the capacitances of the primary winding 140 and of the secondary winding 130, which in each case act between connections 140_1, 140_2 and, respectively 130_1, 130_2 of the respective winding 140, 130. R140 and R130 denote the resistances of the primary winding 140 and of the secondary winding 130, and L140 and L130 denote the inductances of the primary winding and of the secondary winding 130. The coupling factor k between the primary coil is less than unity, k·L140 denotes the coupling inductance on the primary side of the transformer in the equivalent circuit, and k·L130 denotes the coupling inductance on the secondary side of the transformer. (1-k)·L140 and, respectively (1-k)·L140 denote the stray inductances, which are dependent on the coupling factor. Csub/2 denotes parasitic capacitances in FIG. 1c, which result from any capacitive coupling between the secondary winding 130 and the semiconductor body.
Parasitic effects also result in capacitive coupling between the primary winding 140 and the secondary winding 130. C134/2 in FIG. 1c denotes the parasitic capacitances which result from this and respectively occur between one of the connections 141_1, 141_2 of the primary winding 140 and one of the connections of the secondary winding 130.
Coreless transformers of the type explained above are used, for example, in half-bridge circuits for the transmission of a drive signal from a control circuit to a high-side switch in the half-bridge circuit, in order to decouple the potentials in the drive circuit and in the high-side switch. In circuit arrangements such as these, electromagnetic interference signals occur during switching processes of the high-side and low-side switches which form the half-bridge circuit and are normally in the form of power transistors, and these interference signals can induce interference voltages in the windings of the transformer. These interference voltages are produced by displacement currents in the parasitic capacitances between the primary winding and the secondary winding and may, in some circumstances, reach the level of useful signals to be transmitted.
In conventional iron-core transformers, which have been known for a long time, the effect of parasitic capacitances is reduced by the use of a shielding layer between the primary winding and the secondary winding of the transformer.
In so-called pulse transformers, which are used for signal transmission, the primary winding and the secondary winding are arranged as far apart from one another as possible on a torroidal annular core, although this does not significantly reduce the parasitic capacitances, since, as before, there is still a large capacitance between the windings and the annular core.
Differential transmission methods are known for signal transmission using planar coreless transformers, and these allow detection of interference signals which are injected into the transmission path. Methods such as these are described, by way of example, in DE 102 29 860 A1. These transmission methods are, however, comparatively complex.

Component arrangement with a planar transformer


A significantly improved plastic or wood cutting-chopping board which has four legs, each dimensioned and shaped such that when board surface is impacted by a cleaver or mallet, each of the legs can depress through three stages of compression-resistance independently and each to a degree determined by the point of impact of the cleaver on the board relative to the legs. The impact of the cleaver or mallet is dissipated in the compression of the legs resulting in significantly less vibration being transmitted to the countertop or tabletop and consequently significantly less noise, in relation to the conventional, stationary cutting-chopping board. The board, upon impact, will depress to the level where the upward force of the compressed legs on the board equals the downward impact force of the cleaver or mallet on the board. The legs or compressible support members can be variously sized and shaped as attachable support members to the board or can be a continuous extension of the board's cutting-chopping area, sized and shaped so as to provide the compression-resistance to the impact force exerted, on the board, by the action of the cleaver or mallet.

1. Field of Invention
This invention relates to a kitchenware item, specifically to countertop cutting-chopping boards used for supporting food while the food is being cut, chopped or malleted.
2. Prior Art
Oftentimes, cooking starts with cutting, chopping or malleting food. Typically, a type of cutting-chopping board is used to support the food during the cutting, chopping or malleting process.
Originally, boards were designed based on the following three factors: minimum damage to the knife or cleaver blade edge; ease of cleaning board surface; and for commercially used "boards", ability to hold heavy slabs of meat.
For plastic boards, damage to the knife or cleaver blade edge was minimized by using relatively soft plastics such as polyethylene or polypropylene.
For wood boards, damage to the knife or cleaver blade was minimized by using relatively soft woods, cut and glued lengthwise or sidewise. Boards made from the harder woods such as maple, were end grain constructed, which reduced damage to the blade edges because the action of the knife blade or the impact of the cleaver spread the wood fibers instead of cutting across the fibers as was the case, on the boards, constructed with lengthwise or sidewise cut wood.
Ease of cleaning a countertop board surface was achieved by the light weight of the plastic and most of the wooden boards, making them portable and therefore easy to rinse, after use, in the kitchen sink. Recently, thick, very dense and therefore very heavy rubber pads, ideal for extending the lives of frequently used cutting and chopping tools have surfaced in restaurant kitchens and are sometimes placed and used on the traditional, commercial, four legged heavy maple butcher blocks. This eliminates the need to constantly shave the end grain surface of the butcher block because of scouring and for cleaning.
Also recently, some of the countertop plastic boards have silicone dipped corners or thin lines of rubber on the underside, of the board, to reduce slipping, during use.
However, what has always been a problem when chopping on a plastic or wooden (or rubber) board on a countertop with a cleaver or a meat softening mallet, is the significant amount of vibrations (and consequent noise) transmitted from the impact of the chopping cleaver or meat mallet on the cutting-chopping board, to the countertop and to items located on the countertop, near the board, Even the expensive 2-3 inch wooden boards, when hit with a chopping or pounding tool shake-up the countertop and are very noisy.
A common practice is to try different spots on the countertop and use the board at the least noisiest spot. I've found that placing the board on one of the front corners of the kitchen sink when chopping to be the least noisy. However, positioning the board and stability while chopping, can be challenging.


Provided is a computer system including: a computer running as a DB server; a storage system including a plurality of disk drives for storing data; and a management module, in which: at least one of the plurality of disk drives stores data of a DB schema written by the computer; the management module specifies the DB schema to be accessed based on a received query, transmits, to the storage system, an instruction to copy at least a portion of the data of the specified DB schema from the disk drive to a memory, and transmits, to the storage system, an instruction to control an rpm of the disk drive that stores the data of the specified DB schema; and the storage system controls the rpm of the disk drive based on the instruction. Accordingly, power consumption of the storage system can be reduced even if installed disks increase in number.

A technology disclosed herein relates to a computer system for operating a database (hereinafter, referred to as "DB") and a storage system for storing data of the DB, in particular, a technique of reducing power consumption of a storage system.
There currently exist many different applications based on a DB, which makes it extremely important to employ a database management system (hereinafter, referred to as "DBMS") for performing a series of processing/management involving the DB. One of the characteristics of the DB is handling an enormous amount of data. Therefore, in general, many computer systems in which a DBMS operates (hereinafter, referred to as "DB systems") have such a system configuration that a computer on which a DBMS (hereinafter, referred to as "DB server") runs is coupled to a storage system including a plurality of disk drives (in other words, having a large capacity) to store data of the DB in the storage system.
The data of the DB managed by the DBMS tends to be increasing year by year, which further increases in capacity of the storage system. As one of methods of increasing the capacity of a storage system, there is a method of increasing the number of installed disks. The increase in the number of installed disks leads to an increase in storage area, but the rotations of the disks consume more power. Therefore, the increase in the number of disks raises a problem in that power consumption of the entire storage system becomes larger. JP 2000-293314 A is known as an example of a technique for reducing the power consumption of the storage system.
JP 2000-293314 A discloses a technique of controlling power-saving conditions of disk drives (in other words, powering on/off and selection of a power-saving mode) if a disk array system does not receive an access request from a host system within a predetermined time. Upon reception of the access request from the host system, the disk array system turns on power of a disk drive to be accessed if the power thereof is off, and then executes the access.
From the viewpoint of a single disk (hard disk drive), the power consumption relates to an rpm of the disk. To be specific, the lower the rpm is, the lower the power consumption is, while the higher the rpm is, the higher the power consumption is. "ACM SIGARCH Computer Architecture News, Proceedings of the 30th annual international symposium on Computer architecture ISCA '03, Volume 31 Issue 2" discloses a technique of the disk capable of dynamically changing the rpm. According to this technique, it is possible to control the power consumption by setting the rpm of the disk to be low.
JP 2005-258735 A discloses a technique of improving performance of the DB system by causing the DBMS to read out data to be accessed from the disk of the storage system in advance based on a query plan created by the DBMS upon execution of a query, and to write the data into a cache memory. Such processing of reading data to be accessed from the disk in advance and holding the data in a memory is called "prefetch".

Method of reducing storage power consumption by use of prefetch and computer system using the same


A class AB folded-cascode amplifier having improved gain-bandwidth product, comprises a differential input circuit including a differential transistor pair coupled to a source of tail current and responsive to a differential input signal for conducting a first current, a cascode circuit coupled to the differential input circuit for supplying a second current thereto, and a class AB output stage. A compensation circuit is configured for feeding back mutually complementary compensation signals from an output node to the differential input circuit.

The folded-cascode amplifier is a widely used topology in analog circuits. Its advantage over other amplifier types is in better gain-bandwidth performance as a result of reduced Miller capacitance and in increased input common-mode range that normally includes one of the supply rails. A class AB type amplifier, used in moderately high power applications, is characterized in that each half conducts through more than a half cycle but less than a full cycle, and normally is implemented by a push-pull output transistor pair.
Shown in FIG. 1 is a circuit diagram of a class AB folded-cascode amplifier circuit 10 of a type known in the prior art, which comprises an input differential pair circuit 12, a cascode circuit 14 that includes cascode transistors M13, M14 and a load circuit comprising current mirror 16, and a class AB output stage 18 powered from supply lines V+, V−. Input circuit 12 is a differential transistor amplifier in the form of a differential input transistor pair M11, M12 having their gates receiving the input signal at vINP and vINM to be amplified, their drains connected to current sources I2, I3 and their sources connected commonly to a source of tail current I1. Cascode transistors M13, M14, connected to the input transistor pair M11, M12 and current sources I2, I3, and which function as current buffers, are gate biased into saturation by a gate voltage VB1 produced by a source of bias voltage, not shown.
Coupled to cascode transistors M13, M14 and comprising the load 16 of the input differential pair circuit 12, is a wide swing cascode current mirror 16 that consists of transistors M15-M18, configured as shown with an interconnection between the gate of M15 and drain of M17. The current mirror 16 alternatively could be configured as other than as a wide-swing cascode type shown by interconnecting the gate and drain only of M15.
Class AB output stage 18 comprises complementary driver transistors M2P, M2N, serially connected as shown, with common node at vOUT driving load RL, CL. The driver transistors M2P, M2N are controlled by a conventional class AB control circuit 19. A Miller compensation network comprising capacitors CC1, CC2 and RN1, RN2 between the drains and gates of M2P, M2N, is implemented in conventional form in the class AB topology described.
In the simple Miller compensation arrangement, the amplifier is stabilized through RC compensation networks which split the first and second poles of the uncompensated amplifier further apart compared to nominal. However, a problem that arises with simple Miller compensation is in the feedforward path from node A and node B to the output node. Because in this configuration the noninverting signal can pass to the output node, degradation in the frequency response of the amplifier occurs. And although provision of nulling resistors RN1 and RN2 in the feedforward paths reduces the magnitude of the feedforward signal, the problem is only mitigated to a limited extent. As the size of the nulling resistors is increased, the introduced LHP zero moves closer to the crossover frequency, degrading gain margin.
Cascode compensation to improve the gain-bandwidth product of amplifiers by blocking the feedforward signal with a current buffer in the compensation path has been practiced, using an explicit (added) current buffer (see Ahuja, An Improved Frequency Compensation Technique for CMOS Operational Amplifiers, IEEE Journal of Solid State Circuits, Vol. SC-18, No 6, December 1983, pp 629-622) or embedded (existing) cascode transistor in the input stage 12 for Class A amplifiers (see Ribner and Copeland, IEEE Journal of Solid State Circuits, Vol. SC-19, No 6, December 1984, pp 919-925). Compensation of fully differential operational amplifiers is also presented and analyzed by Hurst et al., IEEE Transactions on Circuits and Systems—1: Regulator Papers, Vol. 51, No. 2, February 2004, pp. 275-285) and Yao et al., Fast-settling CMOS Two-stage Operational Transconductance Amplifiers and Their Systematic Design, IEEE International Symposium on Circuits and Systems, Vol. 2, pp. II-839-11-842), all incorporated herein by reference. These approaches, however, are not applicable to class AB amplifiers. It would be desirable to provide a class AB folded-cascode amplifier topology having improved gain-bandwidth performance.

Class AB folded-cascode amplifier having cascode compensation


The invention is a heat sink assembly for the removal of heat from semiconductor and power converter modules. The packaging design for semiconductor modules and power converter modules provides efficient heat removal and a tight Faraday Cage. There is a heat transfer layer sandwiched between a CPU module and a power converter module. The heat sink assembly includes a heat transfer layer, a fin stack, and a series of heat pipes. The heat transfer layer has a slot for passage of power cables and sense lines which connects both the CPU module and the power converter module, and the power converter module and the printed circuit board. The heat sink chamber also serves as a Faraday Cage and thus attenuates EMI from the semiconductor module, the power converter module, the power cables, and the sense lines.

As the state of development of semiconductor components has moved to increased levels of integration, the amount of heat these devices generate has significantly increased. Components handling large quantities of current such as power transistors and integrated circuits generate large amounts of heat. For instance, as indicated in U.S. Pat. No. 5,598,320, it is commonly known that the current generation of P5 microprocessor chips, such as Intel Corporation's Pentium.RTM. Pro microprocessor, generate a significant amount of heat during operation. If this heat is not adequately removed, the increased temperatures generated by the semiconductor components will damage the components. As the computer industry moves toward ever increasing integration of these components, this will continue to be a common problem for the industry.
One approach for solving the heat dissipation problem is to include components which transfer or dissipate heat by means of heat sinks, including heat dissipation plates, fin stacks, and heat pipes. These devices keep the microprocessor chip and related circuitry below the maximum recommended operating temperature by transferring or dissipating heat away from the chip and related circuitry.
A typical heat sink component dissipates heat from a semiconductor component by maintaining thermal contact with the component. The thermal contact area is maximized for the efficient dissipation of heat. A heat sink includes a plate made up of conductive metal and a thermal interface to optimize the heat transfer from the semiconductor component. The heat sink transfers heat from the semiconductor component to less heat-sensitive locations. A typical heat sink maintains thermal contact between the thermal conducting plate and the semiconductor component to dissipate heat in an efficient manner.
A typical heat sink includes a plurality of protrusions, called fins, that increase the overall surface area of the heat sink which increases the heat dissipation capacity, resulting in a more efficient heat transfer system. A fin assembly can be comprised of plate-like radiating fins or pin-like radiating fins and protrudes from a heat sink body for efficient heat dissipation. Increasing the heat dissipating surface area improves the heat dissipating efficiency of the heat sink component. Fin stacks can be particularly effective at dissipating heat due to the increased surface area. The enlarged surface area created by the fins dissipates the heat generated by the semiconductor components more efficiently than a heat sink thermal plate alone.
Heat pipes are another effective method of transferring heat from the critical area of the semiconductor components and related circuitry to the heat fins. As discussed in U.S. Pat. No. 5,598,320, the heat pipe generally improves the heat dissipation features of a heat sink by carrying heat from the microprocessor component and related circuitry to an area where there is sufficient air flow to effectively dissipate heat.
A heat pipe is situated in thermal contact with a semiconductor component such that heat is transferred from the area surrounding the semiconductor component to the fin stack. A heat pipe may be a hollow tube that is filled, in part, with a fluid such as water. As discussed in U.S. Pat. No. 4,675,783, heat pipes have been found generally to cool more efficiently than heat sinks with heat dissipating plates. Recently, more computer vendors have combined heat sink and heat pipe solutions to increase efficiency for overall heat dissipation in semiconductor devices.
There is continuing pressure to lower the cost of computer systems. This, coupled with the increase in semiconductor component integration have created a need to provide for the control of a variety of thermal conditions in a low cost package.
A power converter converts one form of energy to another. As discussed in U.S. Pat. No. 5,621,635, heat sinks have been attached to the outside of a printed circuit board containing a power converter, to aid in heat dissipation. Some of the problems addressed by past power converter and heat sink technologies include: the large amount of space required on the circuit board; the general inefficiency of heat dissipation when large numbers of thermal interfaces are used; the cost of manufacturing which can be high if ceramic substrate or thermally enhanced boards are used; and the difficulty in maintaining high degrees of reliability. One typical solution to the problem of minimizing heat dissipation from a power converter is to ensure that intimate physical contact between a power converter and a heat sink is achieved.
Another packaging problem in the industry is containing electromagnetic (EMI) or radio frequency (RFI) disturbances generated by semiconductor components. Hereinafter EMI and RFI disturbances will be referred to as "EMI". A Faraday Cage solution to the EMI problem is an enclosure which attenuates EMI emission. It is designed to effectively shield EMI disturbances while permitting air flow for dissipation of heat. As discussed in U.S. Pat. No. 5,398,822, EMI is contained by enclosing the area surrounding semiconductor modules in order to prevent EMI discharge. This works in counterbalance to the need to open up the areas surrounding semiconductor modules for the dissipation of heat. EMI enclosures often are made of sheet metal with a plurality of small holes for ventilation. EMI enclosures are often coupled with the use of fans to move air through the small ventilation holes to accelerate heat dissipation.
The problem with the past technology is that semiconductor modules and power converter modules generate significant heat which must be efficiently dissipated. They also generate EMI which must be shielded. This has led to difficulties in designing inexpensive packaging of semiconductor modules in which heat dissipance and EMI reduction are efficiently controlled.

Heat sink and Faraday Cage assembly for a semiconductor module and a power converter


A semiconductor integrated device, provided with a semiconductor chip on which a semiconductor integrated circuit is formed and a support substrate laminated on at least one surface of the semiconductor chip, wherein the semiconductor chip and the support substrate are fastened using resin having particle-the minimum film thickness of the resin is larger than the maximum particle diameter of the filler.

1. Field of the Invention
The present invention relates to a semiconductor integrated device having a support substrate fastened to at least one surface of a semiconductor chip so as hold resin mixed with microparticles (Filler) between the semiconductor chip and the support substrate, and a method of manufacturing the same.
2. Description of the Related Art
Recently, chip-sized packages (CSP) such as ball grid arrays (BGA) have been widely used in order to reduce the size of chips for implementing semiconductor integrated devices. For example, in order to miniaturize a digital camera that uses a. CCD image sensor, a chip-sized package is adopted in the implementation of the CCD image sensor.
FIG. 8 is a perspective view of one example of a semiconductor integrated device applying a chip-sized package, viewed from the front surface and a rear surface.
First and second support substrates 12, 14 are fastened to the front surface and rear surface of a semiconductor chip 10 using insulating resin 16, 17, and the first and second support substrates 12, 14 not only increase the structural strength of the semiconductor chip 10, but also protect against contamination from the outside. A plurality of ball shaped terminals 18 are provided on an outer surface of the second support substrate 14, and inner wiring of the semiconductor chip 10 and the ball-shaped terminals 18 are connected using external wiring 20. It is possible to establish contact between the semiconductor chip 10 and external elements using the ball shaped terminals 18.
FIG. 9 is a process flowchart for a semiconductor integrated device adopting a chip-sized package. Here, in order to clarify the description, part of a semiconductor substrate 22 is shown expanded schematically. Separate semiconductor integrated circuits 24 divided by a scribe line are formed on the surface of the semiconductor substrate 22. An insulating film 26 such as an oxide film is formed on the semiconductor integrated circuits 24, and inner wiring 28 connecting to wiring inside the semiconductor integrated circuits 24 is arranged on the insulating film 26. The inner wiring 28 is used to achieve contact between the semiconductor integrated circuits 24 and external parts (S10).
Next, a first support substrate 12 is fastened to the front surface of the semiconductor substrate 22 with an insulating resin material 16, constituting an adhesive, interposed between the two. After that, the semiconductor substrate 22 is made into a thin film by subjecting it to a grinding process from the rear surface. Next, etching processing is carried out from the rear surface side of a semiconductor chip 10 along scribe lines dividing the semiconductor integrated circuits 24, to expose the insulating film 26 between adjacent semiconductor integrated circuits 24 (S12).
Next, a second support substrate 14 is fastened to the rear surface of the semiconductor substrate 22 with an insulating resin material 17, constituting an adhesive, interposed between the two, and a laminated body 100 is formed by sandwiching the semiconductor substrate 22 with the first and second support substrates 12, 14. Also, buffer members 32 are provided on the outer surface of the second support substrate at positions where ball-shaped terminals will later be arranged. These buffer members 32 play a cushioning role for softening stress acting on the ball-shaped terminals 18.
Next, using a dicing saw, an inverse V-shaped groove 34 is formed by cutting along the scribe lines from the second support substrate 14 side (S16). The inner wiring 28 of a contact section 30 is also disconnected by cutting, and end sections 36 of the inner wiring 28 are exposed at the inner surface of the grove 34.
A metal film is formed on an outer surface of the second support substrate 14 and the inner surface of the groove 34, and outer wiring 20 is formed by performing patterning of this metal film using a photolithography technique. The outer wiring 20 is patterned so as to connect between end sections 36 of the inner wiring 28 and the buffer members 32 (S18).
Also, a protective film 38 is formed on the outer wiring 20 and ball-shaped terminals 18 are formed on the buffer members 32, and the semiconductor integrated device implemented as a chip-sized package is completed by cutting along the scribe lines (S20).
For example, in the case of adopting a chip-sized package in a CCD image sensor, since the semiconductor integrated device 24 side is a light-receiving surface, a transparent material such as glass having high optical transmittance is used at least in the first support substrate 12. Epoxy resin or the like having high transmittance can also be used in the insulating resin for fastening the first support substrate 12 and the semiconductor chip 10.
On the other hand, in the case of using an organic material such as epoxy resin in the insulating resin 17 for fastening the second support substrate 14, stress is generated between the insulating resin 17 and the semiconductor substrate 22 due to different thermal expansion coefficients. As a result, problems arise such as twisting of and degradation in the characteristics of the semiconductor chip 10. For this reason, filler having grains, such as silicon dioxide (SiO2) or magnesium oxide having a lower thermal expansion coefficient than an organic material (microparticles) is mixed in with the insulating resin 17 for fastening the semiconductor chip 10 and the second support substrate 14, to make the overall thermal expansion coefficient consistent with the thermal expansion coefficient of the semiconductor substrate 22.

Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof


A trifunctional molecule comprising a target-specific ligand, a ligand that binds a protein associated with the TCR complex and a T cell receptor signaling domain polypeptide is provided. Engineering T cells with this novel receptor engenders antigen specific activation of numerous T cell functions, including cytokine production, degranulation and cytolysis.

Cancer is a major health challenge, with over 150,000 cases of cancer expected to be diagnosed in Canada in 2013 alone. While patients with early stage disease can be treated effectively by conventional therapies (surgery, radiation, chemotherapy), few options are available to patients with advanced disease and those options are typically palliative in nature. Active immunotherapy seeks to employ the patient's immune system to clear tumor deposits and offers an exciting option to patients who have failed conventional therapies (Humphries, 2013). Indeed, several clinical studies have demonstrated that immunotherapy with T cells can be curative in patients with advanced melanoma, confirming the utility of this approach (Humphries, 2013). Additionally, patients suffering from chronic lymphocytic leukemia (CLL) and acute lymphoblastic leukemia (ALL) have also been effectively treated and cured with T cell immunotherapy (Fry and Mackall, 2013) (Kochenderfer and Rosenberg, 2013). While there are several immunotherapy approaches, the engineering of T cells with chimeric receptors allows any patient's immune cells to be targeted against any desirable target in a major histocompatibility complex (MHC) independent manner. To date, the chimeric receptors used for engineering T cells consist of a targeting domain, usually a single-chain fragment variable (scFv); a transmembrane domain; and a cytosolic domain that contains signaling elements from the T cell receptor and associated proteins (Dotti et al., 2009). Such chimeric receptors have been referred to as "T-body", "Chimeric Antigen Receptor" (CAR) or "Chimeric Immune Receptor" (CIR)—currently, most researchers use the term "CAR" (Dotti et al., 2009). These CARs are considered in modular terms and scientists have spent considerable time investigating the influence of different cytoplasmic signaling domains on CAR function. The first-generation CARs employed a single signaling domain from either CD3ζ or FcεR1γ. Second-generations CARs combined the signaling domain of CD3ζ with the cytoplasmic domain of costimulatory receptors from either the CD28 or TNFR family of receptors (Dotti et al., 2009). Third-generation CARs combined multiple costimulatory domains, but there is concern that third-generation CARs may lose antigen-specificity (Han et al., 2013). Most CAR-engineered T cells that are being tested in the clinic employ second-generation CARs where CD3ζ is coupled to the cytoplasmic domain of either CD28 or CD137 (Han et al., 2013) (Finney et al., 2004) (Milone et al., 2009).
While CAR-engineered T cells have shown considerable promise in clinical application, they rely on a synthetic method for replacing the activation signal that is provided by the T cell receptor (TCR). Since this synthetic receptor does not deliver all of the signaling components associated with the TCR (ex. CD3epsilon, Lck), it remains unclear whether the T cells are optimally activated by the CAR or how the CAR activation affects T cell differentiation (ex. progression to memory). Furthermore, since the CAR signaling domains are disconnected from their natural regulatory partners by the very nature of the CAR structure, there is also an inherent risk that CARs may lead to a low-level of constitutive activation which could result in off-target toxicities.
Given these limitations, it is preferable to re-direct T cells to attack tumors via their natural TCR. To this end, a class of recombinant proteins termed "Bispecific T-cell Engagers" (BiTEs) has been created (Chames and Baty, 2009) (Portell et al., 2013). These proteins employ bispecific antibody fragments to crosslink T-cell TCR receptors with target antigens. This leads to efficient T-cell activation, triggering cytotoxicity. Similarly, bi-specific antibodies have been generated that accomplish this goal and some scientists have simply linked anti-CD3 antibodies to tumor-specific antibodies employing chemical linkage (Chames and Baty, 2009). While these bi-specific proteins have demonstrated some activity in vitro, GMP production, short biological half-lives and bioavailability represent significant challenges to the successful use of these molecules in cancer treatment. Additionally, these molecules also fail to properly recapitulate natural TCR signaling because they do not engage the TCR co-receptors (CD8 and CD4).
Accordingly, a need remains for T cell-antigen couplers with enhanced activity and safety compared to traditional CARs.

This patent is subject to a terminal disclaimer.

Trifunctional T cell-antigen coupler and methods and uses thereof


An aggregation node establishes a first session using a traffic-engineering label distribution protocol. The first session has a next hop adjacent to the aggregation node and positioned within a same network as the aggregation node. The aggregation node also establishes a second session using a traffic-engineering label distribution protocol, wherein the second session has a remote next hop positioned at a border between the network and a second network. The aggregation node sends a message destined for the remote next hop over the second session for establishing an end-to-end traffic engineered label switched path for a FEC specified in a label request message received from an access node, wherein the message includes the same the data indicating constraint information that was received by the aggregation node in the label request message.

A computer network is composed of a set of nodes and a set of links that connect one node to another. For instance, a computer network may be composed of a set of routers while the set of links may be cables between the routers. When a first node in the network sends a message to a second node in the network, the message may pass through many links and many nodes. The links and nodes the message passes through while traveling from the first node to the second node is referred to as a path.
Packet-based computer networks increasingly utilize label switching protocols for traffic engineering and other purposes. In a label switching network, label switching routers (LSRs) use Multi-Protocol Label Switching (MPLS) signaling protocols to establish label switched paths (LSPs). The LSRs utilize MPLS protocols to receive MPLS label mappings from downstream LSRs and to advertise MPLS label mappings to upstream LSRs. When an LSR receives an MPLS packet from an upstream router, it switches the MPLS label according to the information in its forwarding table and forwards the packet to the appropriate downstream LSR.
MPLS can be deployed in core and aggregation network and provides a mature and stable basis for large networks. MPLS can also be used in access networks, e.g. such as mobile or Digital Subscriber Line (DSL) backhaul networks. MPLS is used on two different layers: the Transport Layer and the Service Layer (e.g., for MPLS virtual private networks (VPNs)). In both cases, the protocols and the encapsulation are identical, but the use of MPLS is different especially concerning the signaling, the control plane, the provisioning, the scalability and the frequency of updates. On the service layer, only service specific information is exchanged, and every service can potentially deploy its own architecture and individual protocols. The services run on top of the transport layer.
A Seamless MPLS network is a network in which all forwarding of packets within the network, from the time a packet enters the network until it leaves the network, is done based on MPLS. The motivation of Seamless MPLS is to provide an architecture which supports a wide variety of different services on a single MPLS platform fully integrating access, aggregation and core network. The architecture can be used for residential services, mobile backhaul, business services and supports fast reroute, redundancy and load balancing. Seamless MPLS provides the deployment of service creation points which can be virtually everywhere in the network, enabling network and service providers with a flexible service and service creation. Service creation can be done based on the existing requirements without the needs for dedicated service creation areas on fixed locations. With the flexibility of Seamless MPLS, the service creation can be done anywhere in the network and easily moved between different locations.

End-to-end traffic engineering label switched paths in seamless MPLS


In a tool exchanger apparatus of a machine tool including a turret which turns around an axis inclining with respect to a vertical direction and which conveys tools, forces applied to tool gripping portions are calculated from a resultant force of a centrifugal force, gravity and an inertial force applied to each of the tools, using a weight and a position of each of the tools and a turning speed and a turning acceleration of the turret for each of turning phases when the turret turns, and the turning speed and the turning acceleration of the turret are determined for each of the turning phases.

Field of the Invention
The present invention relates to a tool exchanger apparatus of a machine tool for indexing a tool by turning motion of a turret.
Description of the Related Art
A tool exchanger apparatus for automatically changing tools mounted on a main shaft of a machine tool is conventionally used. A plurality of tools required for an operation is set, in advance, in the tool exchanger apparatus, and the tool mounted on the main shaft of the machine tool is automatically changed to another tool designated in accordance with a machining state.
In such a tool exchanger apparatus, the tools are conveyed by the turning motion of the turret, but when the turning motion is carried out for conveying the tool, it is necessary to prevent the tool from falling off.
Hence, the following techniques to prevent a tool from falling off are known.
Japanese Patent Application Laid-Open No. 8-115113 discloses a technique in which a machine tool includes a weight data storage, weight data of tools which is input by a data inputting portion is stored in the weight data storage, and an operation of a turret of the machine tool is controlled based on the weight data.
Japanese Patent Application Laid-Open No. 2005-205503 discloses a technique in which, when a turret which conveys a tool of a machine tool is turned, a centrifugal force applied to the tool is estimated, and a maximum turning speed is determined based on the estimated centrifugal force and a gripping force on the tool in a tool gripping portion of the turret.
According to the techniques disclosed in Japanese Patent Application Laid-Open No. 8-115113 and Japanese Patent Application Laid-Open No. 2005-205503, by appropriately setting the turning speed of the turret at the time of the indexing operation of a tool based on the weight data of the tool and the centrifugal force applied to the tool, it is possible not only to prevent the tool from falling off, but also to shorten a tool changing time. According to the techniques disclosed in Japanese Patent Application Laid-Open No. 8-115113 and Japanese Patent Application Laid-Open No. 2005-205503, however, the turning speed is constant with respect to a weight of a tool on the turret. However, when a turning axis of the turret inclines with respect to a vertical direction, a direction with respect to the axis of a weight applied to the tool changes in accordance with a turning phase of the turret. Accordingly, if the turret is turned at a constant speed, there may be a margin with respect to a limit speed of a turning motion depending upon the turning phase, resulting in insufficient reduction in tool changing time.

Tool exchanger apparatus of machine tool


This invention relates to a process for the production of resilient, flexible polyurethane foams. This process comprises reacting. A) polyisocyanates or polyisocyanate prepolymers, PA1 B) compounds having at least two isocyanate-reactive hydrogen atoms and a molecular weight of 500 to 18000, PA1 C) optionally, compounds having at least two isocyanate-reactive hydrogen atoms and a molecular weight from 32 to 499, PA1 D) water, PA1 E) optionally, blowing agents, PA1 F) activators, stabilizers and other per se known additives, and PA1 G) one or more crosslinking agents, PA1 wherein component B) comprises PA1 component G) comprises one or more alkanolamine crosslinking agents which correspond to the general formula ##STR1## in which m represents an integer between 0 and 2, PA1 n represents an integer between 1 and 3 and PA1 R represents a hydrogen atom or a methyl group.. B)i) at least one polyether polyol having of a functionality of 4 to 8 preferably of 4.5 to 8, more preferably of 5 to 7, and PA2 B)ii) at least one polyol containing a filler from the group of PUD-, SAN- or PIPA-modified polyols of a functionality of 2.5 to 4,. and

This invention relates to a process for the production of resilient, flexible polyurethane foams.
There are essentially two major groups of products which are of industrial significance as flexible and resilient cellular upholstery materials. These are, on the one hand, flexible and resilient polyurethanes and, on the other, latex foams. There are differences between the two product groups with regard to starting materials, production processes and mechanical properties and with regard to the use thereof Latex foams accordingly have a somewhat different compressive strength curve profile to DIN 53577 or ISO 3386, parts 1 and 2. Unlike polyurethane foams, latex foams do not exhibit a distinct plateau in compressive strength, but instead exhibit an almost linear increase in compressive strength within a defined compression range. This property is desirable or even necessary for certain applications. The average bulk density of latex foams is at least 60 kg/m.sup.3 or usually higher, and such foams exhibit compressive strengths of between 3 and 4.5 kPa. Such grades of foam are preferably used for the production of high quality mattresses.
Polyurethane foams normally exhibit higher compressive strengths within this bulk density range and furthermore a different compressive strength/compression profile.
It would be desirable to influence the compressive strength/compression profile of polyurethane foams in such a manner that behavior similar or identical to that of latex is achieved while retaining elevated resilience. These polyurethane foams should additionally exhibit low residual deformation and low moist ageing values. This is a particularly important criterion.
DE-A 19,508,079 describes a process for the production of resilient foams of low hardness which have very good mechanical properties in the lower bulk density range.
However, using the curing process specified therein, difficulties arise in achieving the required range of properties at higher bulk densities.
Accordingly, an object of the present invention was to provide a process for the production of highly resilient polyurethane foams having behavior similar or identical to that of latex, combined with good ageing behavior, particularly moist ageing behavior. This process should consistently yield polyurethane foams having this range of properties within a bulk density range from approx. 30 to 65 kg/m.sup.3.

Process for the production of resilient, flexible polyurethane foams


A wireless network may report the location of assets to a call routing apparatus to aid in the routing of calls.

Many office buildings have a large number of telephones in cubicles, offices, and in common areas. When a call comes in for an intended recipient that is not near the telephone, the telephone typically rings many times before stopping, possibly annoying other people in the vicinity of the telephone.
For the reasons stated above, and for other reasons stated below which will become apparent to those skilled in the art upon reading and understanding the present specification, there is a need in the art for improved call routing systems.

Call routing in a location-aware network


Oxygen is produced by compressing air to provide a first and a second pressurized air stream, separating the first pressurized air stream into an oxygen-rich product stream and a nitrogen-rich byproduct stream, and combining the nitrogen-rich byproduct stream with the second pressurized air stream. The resulting combined stream is heated by indirect heat exchange with a hot process stream and is work expanded in a gas turbine expander. At least a portion of the expander shaft work is utilized for the air compression step. Fuel is combusted with the expander discharge stream to provide the hot process stream for heating the combined stream prior to expansion. The use of this integrated indirectly-fired gas turbine to provide pressurized feed air for the air separation system improves the availability and reliability of the integrated system compared with conventional directly-fired gas turbine systems.

Gas turbine systems provide shaft work by the expansion of hot pressurized gas streams produced directly or indirectly by the combustion of solid, liquid, or gaseous fuels. A gas turbine system utilizes one or more air compressors mechanically linked with one or more turboexpanders to provide shaft work for transportation, power generation, industrial processes, and many other well-known applications.
Gas turbine systems known in the art can be classified as directly-fired, indirectly-fired, or combination systems. In a directly-fired gas turbine system, compressed air is combusted with a fuel, typically a gas or light hydrocarbon liquid, and the hot pressurized combustion gases are expanded directly in the turboexpander. Additional work can be recovered from the hot turboexpander exhaust, for example by generating steam for expansion in a steam turbine. Directly-fired gas turbine systems are open systems in which the turboexpander working fluid (i.e. combustion products) is discharged to the atmosphere after appropriate heat recovery.
In an indirectly-fired gas turbine system, a working fluid (typically air) is compressed in the gas turbine compressor, heated by indirect heat exchange with a hot external gas stream (typically obtained by the combustion of a solid, liquid, or gaseous fuel) to yield hot pressurized air, and expanded in the turboexpander to generate shaft work. The turboexpander exhaust may be used to preheat the combustion air or may be introduced directly into the combustion step. Indirectly-fired gas turbines can be operated in a closed cycle wherein a recirculating gaseous working fluid is compressed, heated, expanded, and cooled using a totally integrated compressor and turboexpander.
Combined gas turbine systems are known in the art in which a directly-fired gas turbine is integrated with an indirectly-fired gas turbine. In such systems the indirectly-fired gas turbine may be a partially-closed system in which a major portion of the indirectly-fired turbine exhaust is cooled and recycled to the compressor.
The types of gas turbine systems summarized above are described in detail in standard textbooks such as The Mechanical Engineer's Handbook, Edited by M. Kurtz, John Wiley & Sons, Inc, 1986, Chapter 72, pp. 1984-2009 and Marks' Standard Handbook for Mechanical Engineers, edited by E. A. Avallone and T. Baumeister III, McGraw-Hill Book Co., New York, Ninth Edition (1987), pp. 9-118 to 9-123.
The separation of air into its components is accomplished by compressing air, pretreating the compressed air as necessary to remove certain contaminants, and separating the purified compressed air by known methods of cryogenic distillation, pressure swing adsorption, permeable polymeric membranes, or high temperature ceramic mixed conductor membranes. Power for compressing the air can be provided by electric motors, gas or steam turbines, or combinations of electric motors and gas or steam turbine drivers. Compressor driver selection is dictated by numerous design factors such as the type of air separation process, size of the process plant, location, electricity cost, fuel availability, and potential for integration of the air separation process with the compressor driver. In addition, the air separation system and compressor driver may be integrated with a process utilizing the product(s) of the air separation process.
A gas turbine is the preferred compressor driver in a number of air separation processes. One of these is the integrated gasification combined cycle (IGCC) process in which coal or other carbonaceous material is gasified with oxygen and the produced gas is cleaned to yield a low-sulfur fuel gas. This fuel gas is utilized in a direct-fired gas turbine which drives a generator to produce electric power with reduced environmental emissions. The oxygen is produced by cryogenic air separation wherein some or all of the compressed air feed may be provided by the gas turbine compressor, and the nitrogen-rich byproduct gas from the air separation system is compressed and introduced into the gas turbine combustor.
A general review of the current art in IGCC power generation systems is given by D. M. Todd in an article entitled "Clean Coal Technologies for Gas Turbines" presented at the GE Turbine State-of-the-Art Technology Seminar, July 1993, pp. 1-18. A review of various integration techniques and the impact thereof on GCC economics is given in a paper by A. D. Rao et al entitled "Integration of Texaco TQ Gasification with Elevated Pressure ASU" presented at the 13.sup.th EPRI Conference on Gasification Power Plants, San Francisco, Calif., Oct. 19-21, 1994. In a paper entitled "Improved IGCC Power Output and Economics Incorporating a Supplementary Gas Turbine" presented at the 13th EPRI Conference on Gasification Power Plants, San Francisco, Calif., Oct. 19-21, 1994, A. R. Smith et al review several modes of integration between the gas turbine and the air separation unit in an IGCC process.
The utilization of the nitrogen-rich byproduct stream by compression and injection into the combustor of an IGCC system is described in representative U.S. Pat. Nos. 4,250,704; 4,697,415; 5,081,845; 5,406,786; and 5,740,673. Another method of utilizing the nitrogen-rich waste stream in an integrated air separation/gas turbine system is described in U.S Pat. Nos. 3,731,495; 4,019,314; and 5,406,786 wherein this stream is optionally heated and introduced directly into the gas turbine expander without prior compression.
The use of an indirectly-fired gas turbine with a cryogenic air separation system is described in Great Britain Patent Specification 1 455 960. An air separation unit is integrated with a steam generation system in which a nitrogen-rich waste stream is heated by indirect heat exchange with hot compressed air from the air separation unit main air compressor, the heated nitrogen-rich stream is further heated indirectly in a fired heater, and the final hot nitrogen-rich stream is work expanded in a dedicated nitrogen expansion turbine. The work generated by this expansion turbine drives the air separation unit main air compressor. The nitrogen expansion turbine exhaust and the combustion gases from the fired heater are introduced separately into a fired steam generator to raise steam, a portion of which may be expanded in a steam turbine to drive the air separation unit main air compressor. Cooled nitrogen is withdrawn from the steam generator and may be used elsewhere if desired. Optionally, the combustion gases from the fired heater are expanded in a turbine which drives a compressor to provide combustion air to a separate fired heater which heats the nitrogen-rich stream prior to expansion. In another option, the nitrogen expansion turbine exhaust and the combustion gases from the fired heater are combined and introduced into the economizer and air preheater sections of the fired steam generator.
An indirectly-fired gas turbine IGCC system is described in U.S. Pat. No. 4,785,621 wherein the fuel gas from the gasifier is introduced into a directly-fired gas turbine which generates power. A separate indirectly-fired gas turbine system provides extracted air for the air separation system, the exhaust gas from the directly-fired gas turbine expander heats compressed air by indirect heat exchange, and the heated compressed air is expanded in the indirectly-fired gas turbine expander. Nitrogen-rich waste gas from the air separation system is mixed with the compressed air before the indirect heating and expansion steps. Exhaust from the indirectly-fired gas turbine expander is discharged to the atmosphere or used for supplemental heat recovery.
Gas turbines are the preferred drivers in processes to separate air at high temperatures in ceramic mixed conductor membrane systems. Directly-fired gas turbines for this application are described in U.S. Pat. Nos. 4,545,787; 5,516,359; 5,562,754; 5,565,017; and 5,657,624. A directly-fired gas turbine is utilized with a ceramic mixed conductor membrane air separation system which provides oxygen to a direct reduction iron recovery process as described in U.S. Pat. No. 5,643,354. Indirectly-fired gas turbines for this application are described in U.S. Pat. No. 5,035,727 and in an article entitled "Coproduction of Power, Steam, and Oxygen in Coal or Low Quality Fuel Combustion Systems" in Research Disclosure, March 1995, pp. 181-186.
The turboexpander of a directly-fired gas turbine generally requires more maintenance and has a lower onstream operating availability than the turboexpander of an indirectly-fired gas turbine. This occurs because the motive gas in the directly-fired gas turbine contains combustion products including water, carbon dioxide, sulfur compounds, and particulates, and these byproducts can cause fouling, erosion, and corrosion of the turboexpander internals thereby decreasing operating availability. The motive gas in an indirectly-fired gas turbine, on the other hand, contains no combustion products and the turboexpander therefore will operate with reduced fouling, erosion, and corrosion problems and will have a higher operating availability. This advantage of an indirectly-fired gas turbine is offset by the requirement for a high temperature nonrecuperative type of gas-gas heat exchanger to heat the motive gas before expansion, which is not required in a directly-fired gas turbine. The higher operating availability of the indirectly-fired gas turbine, however, may make it an attractive driver choice in certain applications.
The present invention discloses the use of an indirectly-fired gas turbine system to provide compressed air feed for an air separation system in applications where high driver availability is required. The invention utilizes the integration of an indirectly-fired gas turbine with the air separation system for the production of oxygen with efficient utilization of the nitrogen-rich byproduct.

High availability gas turbine drive for an air separation unit


A method is for restoring a signal of a defective channel of a beam detector, which has a multitude of channels and by means of which projections are recorded from different directions of projection. The channels of the beam detector each have a detector element with channel electronics connected downstream thereform. The signal of the defective channel is restored while using neighboring signals of an M-neighborhood of the same projection and from adjacent signals of an M-neighborhood of additional projections.

In medical diagnostics, for example, computer tomography serves the purpose of producing non-overlapping tomographs. In the case of x-ray computer tomography, these tomographs are calculated with the aid of a computer from data that are recorded during the circular or spiral revolution of an x-ray tube and a suitable detector about the patient (see Kalender, W. A.: Computertomographie. Grundlagen, Gerätetechnologie, Bildqualität, Anwendungen. [Computer tomography. Fundamentals, equipment technology, image quality, applications.] Publicis MCD Verlag, Munich, 2000). The aim is to obtain tomographs in the shortest possible time.
Because of their excessively slow data collection rate, conventional CT devices having a so-called single-row detector, that is to say a detector that has a single detector row or row-type arrangement of detector elements, are not capable of meeting the growing clinical demands (high-resolution recording of complete organs during a pause in breath, large-volume angiographs, three-dimensional representations of anatomical structures with isotropic and high resolution).
Although it would be possible to increase the data collection rate by reducing the time of revolution of the x-ray tube and detector, mechanical limits are soon encountered in so doing. In order, nevertheless, to permit a further increase in the data collection rate, CT devices have recently been developed which have a so-called multirow detector, that is to say a detector that has several rows, for example 4 rows, of detector elements (see Kalender loc. Cit.).
A data collection rate that is further increased by way of so-called area detectors, that is to say multirow detectors with a high number of rows (for example 64 detector rows) is being aimed at, and is the subject matter of the current development.
If a detector channel has defects or is entirely defective, its corrupted or missing signal leads to inconsistencies in the total data volume that have a disadvantageous effect on the quality of the reconstructed tomographs. For example, depending on the number of channels affected and on the type of defect, annular to linear artifacts appear that cover structures in the object being examined. In the most favorable case, they are merely perceived as disturbing by the viewer. But frequently, they influence the diagnosis disadvantageously or even render it entirely impossible.
FIG. 1a illustrates a tomograph of the shoulder area of a human patient recorded by a CT device with an entirely intact detector. If, for example, 64 of 2688 channels of the detector are defective, a tomograph in accordance with FIG. 1b may result. In this case, it is severely affected by artifacts in the case in which the defective channels have a constant signal level in each case independently of the number of x-ray quanta actually impinging on the corresponding detector element. For the sake of simplicity, the term defective channel will always be used below independently of whether a channel is entirely defective or only operating in a defective way.
The cause of a defective channel can be both defects in the actual detector element itself, and defects in the downstream electronic signal processing unit. Consequently, a defect can be eliminated by exchanging the relevant detector element and/or the relevant part of the electronic signal processing unit. Such an exchange is, however, time-consuming and costly.
Methods have therefore been developed that render it possible to restore the signals of defective channels in order thus to be able to dispense with an exchange, or to be able to delay the latter at least until no interruption of the operation of the CT device is necessary. Instead of the tomograph in accordance with FIG. 1b, the application of a correction method known from DE 199 21 763 A1 results in the tomograph in accordance with FIG. 1c which, although clearly having fewer artifacts, is far from being free of artifacts.
In the case of multirow detectors with N rows, the number of the channels is N times the number of the channels present in the case of a single-row detector. In the case of multirow detectors, in particular, however, in the case of area detectors, the probability of a defect therefore rises by at least N times compared with a single-row detector. The economic use of multi-row and area detectors is therefore brought into question because of the high probability of frequently having to exchange detector elements or parts of the electronic signal processing unit.

Method and medical device designed for implementing this method


A fixing structure for lenses and a frame of eyeglasses is provided. A combining element integrally formed on a top of said styled lenses is concavely provided with a containing groove facing inwardly at a segment corresponding to styled lenses. Two sides of the containing grooves are provided with a wider distance at the outer end and narrow in toward the inner end. A hole is provided at a center and two sides on an upper flange of the combining element, respectively, so as to contain the strip on the two sides of the frame formed wider on the outer end and narrower on the inner end. The strip of the frame with the middle portion extended into a nose pad portion is provided with a protrusion corresponding to the hole opened on the combining element on top of the lenses, such that the two may be engaged together when assembled. A concave portion is provided at a bottom of a leg connecting element on the two sides of the frame, so as to support the two ends of the lenses when assembled.

Conventionally, eyeglasses are designed to be assembled with great variety to enhance an overall appearance and aesthetics when assembled. Additionally, eyeglasses are designed so that it can be easily disassembled when making additional process thereof. Therefore, a variety of assembly and implementation applied on the structure of the elements of the designed eyeglasses by related manufacturers has both advantages and disadvantages. Correspondingly, users can select particular eyeglasses in accordance with their needs.

Fixing structure for lenses and frame of eyeglasses


A multi-functional device is attached to a secure network and includes a control circuit. The control circuit receives indications as to whether a user is authenticated to use the multi-functional device and in response, generates and sends a control signal to the multi-functional device. As long as the multi-functional device continues to receive the control signal, the multi-functional device remains in an operational mode to allow the authenticated user to access the multi-functional device functions. If the multi-functional device ceases to receive the control signal, the multi-functional device deactivates itself.

There are many different entities that utilize multi-functional devices (MFDs) connected to a secure network. For example, consider a government agency that utilizes photocopier devices, scanning devices, printers, computing devices, and the like, connected to the secure network. In operation, user may employ these MFDs, and others like them, to create, copy, and disseminate classified information. However, due to the sensitive nature of the information, the MFDs are generally placed into secure areas, rooms, or vaults, for example, to limit their access to unauthorized users. Often times, however, such positioning is not optimal. For example, buildings and/or rooms may need to be renovated to ensure the security of these devices, as well as to efficiently limit access to only authorized users. In many cases, the renovation costs to facilitate such restrictions are substantial.


Disclosed herein are an electrochemical system, a hydrogen gas fueling system, a cascade system, and methods for using the same. The hydrogen gas fueling system comprises a multiple-stage compressor disposed in fluid communication with a hydrogen gas source, the compressor configured to cool hydrogen gas received at a stage of the compressor, a cascade section comprising at least two hydrogen gas storage zones disposed in fluid communication with the compressor at the outlet of the compressor, and a hydrogen gas dispensing section disposed in fluid communication with the cascade section.

This disclosure relates to electrochemical cells, and, more particularly, to a hydrogen fueling system that preferably comprises a cascading system.
Electrochemical cells are energy conversion devices, usually classified as either electrolysis cells or fuel cells. Proton exchange membrane electrolysis cells can function as hydrogen generators by electrolytically decomposing water to produce hydrogen and oxygen gases. Referring to FIG. 1, a section of an anode feed electrolysis cell of the prior art is shown generally at 10 and is hereinafter referred to as "cell 10." Reactant water 12 is fed into cell 10 at an oxygen electrode (anode) 14 to form oxygen gas 16, electrons, and hydrogen ions (protons) 15. The chemical reaction is facilitated by the positive terminal of a power source 18 connected to anode 14 and the negative terminal of power source 18 connected to a hydrogen electrode (cathode) 20. Oxygen gas 16 and a first portion 22 of water are discharged from cell 10, while the protons 15 and second portion 24 of the water migrate across a proton exchange membrane 26 to cathode 20. At cathode 20, hydrogen gas 28 is formed and removed, generally through a gas delivery line. Second portion 24 of water, which is entrained with hydrogen gas, is also removed from cathode 20.
An electrolysis cell system may include a number of individual cells arranged in a stack with reactant water being directed through the cells via input and output conduits formed within the stack structure. The cells within the stack are sequentially arranged, and each one includes a membrane electrode assembly defined by a proton exchange membrane disposed between a cathode and an anode. The cathode, anode, or both may be gas diffusion electrodes that facilitate gas diffusion to the proton exchange membrane. Each membrane electrode assembly is in fluid communication with a flow field positioned adjacent to the membrane electrode assembly. The flow fields are defined by structures that facilitate fluid movement and membrane hydration within each individual cell.
The second portion of water, which is entrained with hydrogen gas, is discharged from the cathode side of the cell and is fed to a phase separation unit to separate the hydrogen gas from the water, thereby increasing the hydrogen gas yield and the overall efficiency of the cell in general. The removed hydrogen gas may be fed directly to a unit for use as a fuel. Alternately, the removed hydrogen gas may be fed to a storage facility, e.g., a cylinder, a tank, or a similar type of containment vessel for its subsequent use as a fuel.
If the hydrogen gas is fed to a storage facility, it may be compressed to more economically utilize space and/or to facilitate its transport. Compression may also be necessary if the final pressure at which the gas is to be utilized is greater than the pressure at which the gas is generated. In such a case, the gas should be generated, compressed to a high pressure, and stored at the high pressure for subsequent use.
While existing electrolysis cell systems are suitable for their intended purposes, there still remains a need for improvements, particularly regarding the storage and dispensing of hydrogen gas at pressures greater than the pressures at which the gas is generated. Therefore, a need exists for an electrolysis cell system that is capable of generating, effectively compressing, storing, and dispensing the gas for final use as a fuel.


Machines and systems for chemical, foodstuffs and pharmaceuticals industry are subject to particularly demanding requirements for hygiene. In particular, equipment used in such machines, must avoid any gaps, in which dirt, bacteria or germs could settle. To avoid this, a hygiene-compliant display and control device having a front plate is proposed, having a peripheral groove, which is open on the outer peripheral surface of the front plate, on the outer edge of the front plate, and a sealing element fitted in the peripheral groove. The outer peripheral surface of the sealing element is arranged flush with the outer peripheral surface of the front plate, and a number of clamping arrangements with a pressing element are provided on the display and control device distributed around the periphery. One axial end of the pressing element engages with a fixing frame, which rests on the mounting plate, or with the mounting plate.

1. Field of the Invention
The present invention relates to a hygiene-compliant display and control device having a front plate as well as a mounting plate and a sealing element which is arranged between front plate and mounting plate.
2. Discussion of Background Information
Machines and systems for the chemical, foodstuffs and pharmaceuticals industry are subject to particularly demanding requirements for hygiene, especially in the case of "open" processes in which the products can come into direct or indirect contact with the manufacturing equipment. Criteria here include resistance to corrosion and a defined surface quality as well as low susceptibility to contamination and cleaning friendliness. This also means a high level of robustness, as along with water jets and cleaning agents, high-pressure cleaners are often used in the necessary frequent cleaning operations. In addition, standards for the nature of the equipment have been developed in order to satisfy these requirements, e.g. protection class IP69K according to EN 60529. Here the number 6 means protection of the electrical equipment against the ingress of solid bodies including dust by complete sealing, and 9K means protection against the ingress of water during high-pressure or steam-jet cleaning.
While appropriately designed electrical cabinets protect many automation components, display and control devices, which are often arranged directly in the workplace, are affected directly by the requirements of this norm and must likewise have the defined protection class, e.g. IP69K. In addition, the materials used must be able to cope with the cleaning chemicals and the temperature, the seals must prevent the ingress of liquids, even under pressure, and the electronics must also be able to withstand the changes in temperature which occur.
Conventional seals are unable to fulfill these requirements and are therefore unsuitable, as a gap in which bacteria and germs and other contamination can settle and accumulate always remains between the components to be sealed, which is inadmissible for the demanding hygiene-compliant requirements.
A seal arrangement, which seals radially inwards between two hollow components, is in turn disclosed in DE 21 37 810 A. Here, an open peripheral gap, in which a sealing element is fitted flush with the inner peripheral surface, is provided radially inwards on a component. However, from this publication, it cannot be seen how the two components are pressed together in order to effect an adequate sealing of the sealing elements.

Hygiene-compliant display and control device

BERNECKER + RAINER INDUSTRIE-ELEKTRONIK Ges.m.b.H.


An optical circuit is provided in which electric circuit parts and optical circuit parts are integrated in a stack on a printed substrate. The optical circuit is provided with a lid having a temperature regulation function that uses a temperature control element and an optical fiber block capable of optical input and output. Temperature control of optical circuit elements can be efficiently performed by mounting electric circuit parts and optical circuit parts on a printed substrate in advance by a reflow step using OBO technology and subsequently attaching a lid that includes a temperature control element.

The present invention relates to an integrated optical circuit. More specifically, the present invention relates to an efficient cooling mechanism and cooling method of an optical element in an integrated optical circuit.
Internet traffic is continuously increasing with expanding utilization of big data and the like, resulting in simultaneous demands being made for higher speeds and wider bandwidths but lower power consumption in optical communication networks. An optical transceiver is a key apparatus that is responsible for conversion between optical signals and electric signals in a communication network. In optical transceivers, for the purpose of attaining mutual compatibility among vendors, sizes, pin arrangements, functions, optical/electric connector shapes, monitoring control interfaces, and the like are designed as a common standard. For example, according to a representative CFP (Centum gigabit Form factor Pluggable) standard, a group of parts constituting an optical transceiver are integrated and mounted in certain form factors to be packaged.
FIG. 1 is a diagram illustrating a concept of packaging in optical transceivers. In FIG. 1, (a) functionally shows a configuration of an optical transceiver 100. The optical transceiver 100 is constituted by a light source 105, a modulator 103, an optical receiver 104, a control circuit 106 thereof, and the like. The receiver 104 has an input terminal 102 for receiving an input optical signal from an optical fiber, the modulator 103 has an output terminal 101 for outputting a modulated optical signal to an optical fiber, and terminals 107 and 108 for a transmission signal and a reception signal in the form of electric signals.
In FIG. 1, (b) is a diagram illustrating a concept of packaging of optical transceivers in an optical communication apparatus. An optical communication apparatus 110 represents a two-dimensional drawing as viewed from above a chassis of the apparatus, and optical transceivers 100-1 to 100-n shown in (a) in FIG. 1 are arranged so as to be gathered to one side of the chassis of the apparatus. An advantage of packaging optical transceivers is that high level of maintainability of the optical communication apparatus 110 is attained. Optical transceivers packaged according to the CFP standard are configured so as to be hot plug-enabled. By packaging a group of optical parts as a front end of an optical communication apparatus and collectively one-dimensionally arranging the packages 100-1 to 100-n on one side (for example, a left side of (a) in FIG. 1) of the apparatus, optical transceivers can be replaced. For example, in response to a failure of an optical transceiver or performance of an optical transceiver becoming obsolete, the optical transceiver in question can be extracted from the chassis of the optical communication apparatus 110 and replaced with a new optical transceiver.
In contrast to packaged optical transceivers such as those described above, an optical transceiver using on-board optics (OBO) technology is gathering attention. OBO refers to a mounting mode in which, instead of packaging an optical transceiver as shown in FIG. 1, a group of parts of an optical transceiver is directly bonded to a printed substrate or a board inside a communication apparatus.
FIG. 2 is a conceptual diagram of an optical communication apparatus mounted with OBO technology. An optical communication apparatus 210 represents a two-dimensional drawing as viewed from above a chassis of the apparatus, and a printed substrate 201 is provided inside the apparatus. Five sets of optical transceivers 200-1 to 200-5 are constructed on the printed substrate 201. Each optical transceiver includes an optical modulator 213, an optical receiver 214, a light source 215, a control circuit 216, and the like in a same manner to (a) in FIG. 1. An advantage of using OBO technology is that necessary parts are no longer required with packaging of optical parts and reductions in the number of parts and in mounting cost are likely to reduce cost of the communication device.
In addition, when a mode of a packaged optical transceiver is not adopted, optical parts are no longer attached and detached. Therefore, there is no longer a constraint in terms of arrangement of having to one-dimensionally mount optical transceivers in a single row along an end of a board in an optical communication apparatus as shown in (b) in FIG. 1. Conversely, since a degree of freedom in arranging optical parts (electrical parts) in the optical communication apparatus increases, the optical parts can be two-dimensionally arranged at arbitrary locations on the board. As a result, improved mounting density of parts contributes toward downsizing of the optical communication apparatus. In addition, heat management of the optical communication apparatus through ingenious arrangements of the optical parts also contributes toward reducing power consumption of the optical communication apparatus.
To begin with, a motivation for introducing OBO technology is to realize lower cost. To this end, the following two points are important. Firstly, since optical parts are to be bonded onto a board, each optical part must have a flat interface such as a ball grid array (BGA). Secondly, the parts must be able to withstand heat of a reflow step (must be reflowable). A self-alignment effect of the reflow step being accurately exerted is also important from the perspective of reducing accuracy when mounting parts. Furthermore, in addition to an electrical coupling between the optical parts and the board due to BGA, an optical coupling between the optical parts and the board must also be realized in an inexpensive manner.

NIPPON TELEGRAPH AND TELEPHONE CORPORATION


A signal processing apparatus processes a signal which has a plurality of spectral sensitivity characteristics and in which the information amount of a signal related to at least one of the spectral sensitivity characteristics is larger than the information amount of any one of signals related to the other spectral sensitivity characteristics. A wavelet transform section resolves the signal of the spectral sensitivity characteristic having a large information amount into high- and low-frequency components. An R- and B-signal correlation coefficient calculating section calculates correlation coefficients between the low-frequency component derived and the signals of the spectral sensitivity characteristics having a small information amount. An R- and B-signal high-frequency creating section creates high-frequency components of the signals of the spectral sensitivity characteristics having a small information amount based on the correlation coefficients derived and the high-frequency component. An R- and B-signal inverse wavelet transform section synthesizes the high-frequency components thus derived and the signals of the spectral sensitivity characteristics having a small information amount to output an output signal with high definition.

This invention relates to a signal processing apparatus, and more particularly to a signal processing apparatus for frequency-resolving or-decomposing an input signal based on the spectral sensitivity characteristic and deriving a high-definition signal by using the high-frequency component of a signal of a spectral sensitivity characteristic containing a large amount of information to estimate the high-frequency component of a signal of another spectral sensitivity characteristic containing a less amount of information.
Recently, image input devices which are inexpensive and light in weight and each use a single-plate type imaging device are widely used. In the single-plate type imaging device, in order to derive color information of a subject from one sheet of imaging device, color filters are arranged in a mosaic form on the light receiving surface. FIG. 18 shows the arrangement of a complementary color mosaic filter of cyan (Cy), magenta (Mg), yellow (Ye) and green (G) which is generally used.
In FIG. 18, luminance signals and color difference signals for the n-th line and (n+1)th line of an even field are respectively denoted by Y.sub.o,n, Y.sub.o,n+1 and C.sub.o,n, C.sub.o,n+1. Likewise, luminance signals and color difference signals for the n-th line and (n+1)th line of an odd field are respectively denoted by Y.sub.e,n, Y.sub.e,n+1 and C.sub.e,n, C.sub.e,n+1. In this case, the above signals can be expressed by the following equations. EQU Y.sub.o,n =Y.sub.o,n+1 =Y.sub.e,n C.sub.e,n+1 =2R+3G+2B (1) EQU C.sub.o,n =C.sub.e,n =2R-G (2) EQU C.sub.o,n+1 =C.sub.e,n+1 =2B-G (3)
Cy, Mg and Ye are expressed by the following equations by use of green (G), red (R) and blue (B). EQU Cy=G+B (4) EQU Mg=R+B (5) EQU Ye=R+G (6)
As indicated by the equation (1), the luminance signals are created on all of the lines in the even field and odd field. However, as indicated by the equations (2) and (3), the two color difference signals are created on every other lines, and lines on which color difference signals are not created are compensated for by interpolation. After this, three primary colors of R, G, B can be derived by performing the matrix operation. In the above method, the color signal has an information amount only half that of the luminance signal.
In Jap. Pat. Appln. KOKAI Publication No. 5-56446, there is disclosed a method for correcting the color difference signals by use of the luminance signal components instead of performing the simple interpolation by use of only the color difference signals as described before. That is, the luminance signal Y and the color difference signal C are processed by use of a low-pass filter to derive low-frequency components Y.sub.low and C.sub.low and a color signal C' obtained after correction is represented by the low-frequency components as indicated by the following equation. EQU C'=Y(C.sub.low /Y.sub.low) (7)
This means that the color difference signal C' after correction can be replaced by a signal obtained by correcting the luminance signal.
However, first, the above prior art technique only corrects the color signal by linear interpolation or by replacing the same by a signal obtained by correcting the luminance signal and cannot cope with correction of the color signal with high precision.
Second, the above prior art technique only corrects the color signal by interpolating the color signal by use of adjacent color signals or by replacing the same by a signal obtained by correcting the luminance signal on the same coordinate and cannot cope with a case where the continuity of the signal is degraded at the edge portion or the like or where the degree of correlation with the luminance signal is low.
Third, the above prior art technique only corrects the color signal by linear interpolation or by replacing the same by a signal obtained by correcting the luminance signal and cannot cope with a case where a high-frequency component of frequency higher than an input signal is created.
Fourth, the above prior art technique only corrects the color signal by linear interpolation or by replacing the same by a signal obtained by correcting the luminance signal and cannot cope with optimum correction for high- and low-frequency components.

Signal processing apparatus capable of correcting high-frequency component of color signal with high precision


A camera, adapted for recording individual sound files to be re-recorded onto associated photographic prints, includes an operator interface for pre-selecting photographic print characteristics which would affect the amount of recording time available on an associated photographic print. An audio memory is adapted to store sound files to be re-recorded onto associated photographic prints. An indicator is adapted to provide an operator-recognizable indication of recording time available as a function of print characteristics pre-selected by an operator. The print characteristics may include a print""s two-dimensional surface area, a print""s shape, a sound file""s type or sound quality.

This invention relates to photographic still cameras and photofinishing systems for providing audio recording and playback in association with individual still photographic prints, and more particularly to recording variable amounts of data in accordance with the expected characteristics of the print of the image being photographed.
Cameras and systems for providing audio recording and playback in association with individual photographic still prints are known in the art. An example of such a system is disclosed in commonly assigned U.S. Pat. No. 5,276,472 to Bell et al., which describes a still photographic system with audio recording capability. Audio to be recorded in association with individual exposed frames is digitized and stored in a temporary memory in the camera. When the film is advanced to the next exposure frame, the stored digital audio signal is recorded on a magnetic layer on the film. At the photofinisher, the digital audio signal is read from the film and converted to a suitable format, such as a bar code or binary coded blister marks, which are impressed on the photoprint for subsequent playback.
Examples of such systems are disclosed in commonly assigned U.S. Pat. No. 5,692,225 to Bernardi et al. describes a system in which messages are stored in camera on-board memory or in detachable message memory modules or cards to be forwarded with an exposed film strip to a photofinisher for read out and printing on the prints. In the U.S. Pat. No. 5,128,700 to Inoue et al., the sound data is recorded in a first memory (e.g., a sound card) and data indicating correspondence between photographed frames of a film and the sound data is recorded in a second memory (e.g., a film).
Not all sound files or data files are the same size when printed as an invisible encodement. The area taken up by the encodement varies with the amount of data and the storage density, which in turn is a function of the resolving power of the printing and detection equipment used. Digital sound files that are moderately compressed and of more than one or two seconds in duration, represent relatively large printed encodements. While there is no space problem if an encodement is small relative to a related printed visible image, large encodements are problematic because, for a given encodement format, the encodement may not fit on the face of a related printed visible image.
There are many storage methods available for adding supplemental data to images, such as by using two-dimensional barcode printing on a print to record digital information. This method provides a limited area for the encodement. Accordingly, it is required that sound/data recorded has a limited size. If the sound files are too large when they are being added to the images, they must be edited before being added to the image. This procedure is cumbersome and requires a complex operator interface. Therefore for simplicity, there exists a need for limiting the size of a sound file at the recording stage.
In a camera, this file size can be set by shutting off the recording function after a given length of time. Therefore there is a need to limit the amount of recording time to coincide with the expected output print characteristics.
The area available for the encodement varies with the two-dimensional area of the print. Some camera formats, such as APS, provide for pre-selection of output print shape (height to width ratio). See for example U.S. Pat. No. 5,471,265 to Shibata et al.
It is known to restrict the allotted recording time, such as disclosed in commonly assigned U.S. Pat. No. 5,878,292 to Bell et al. or to provide the operator with a variable amount of recording time as in commonly assigned U.S. Pat. No. 5,530,501 to Bell. It is also known to display the amount of time remaining within which to record such as taught in U.S. Pat. No. 5,530,473 to Sakai et al. and U.S. Pat. No. 5,489,955 to Satoh et al,
However it is not known to determine the amount of recording time available based upon the pre-selection of individual frame output print characteristics. All of the prior art sound recording limits are either arbitrarily set to a fixed amount of time, or are determined by storage limits which do not depend upon individual frame expected output print characteristics.
Given that there is a limited two dimensional area available on a print to record a sound file, it is required that any file to be recorded have a limited size. In a camera, this file size can be set by shutting off the recording function after a given length of time. This invention sets the limit for recording time based on operator-selected inputs on the camera. These inputs may include sound quality desired, type of sound to be recorded, and expected print shape and size. These operator-selected characteristics all influence the amount of recording time available. For example, the type of sound to be recorded, such as music, ambient sounds, or annotation, influences the preferred digital compression algorithm to be implemented at the photofinisher. The sound quality desired dictates the amount of allowable compression. The print format (such as for APS) or expected final print size provides the final image area that can be recorded upon in an over-the-image (or back-of-the-print) recording application.
The invention, and its objects and advantages, will become more apparent in the detailed description of the preferred embodiments presented below.

Camera with variable sound capture file size based on expected print characteristics


A perpendicular magnetic recording head which moves in a track direction of a recording layer of a perpendicular magnetic recording medium to write information on the recording layer or read information from the recording layer. The perpendicular magnetic recording head includes: the perpendicular magnetic recording medium including a soft magnetic underlayer and the recording layer; a write head including a main pole that applies a magnetic field to, and writes information to, the recording layer and a return pole having a first end which is connected to the main pole and having a second end which is spaced apart from the main pole over an air bearing surface (ABS) of the perpendicular magnetic recording head which is adjacent to the recording layer; and a permanent magnet formed on at least one side of the write head.

1. Field of the Invention
Apparatuses consistent with the present invention relate to a perpendicular magnetic recording head, and more particularly, to a perpendicular magnetic recording head in which a magnetic material is formed to control the magnetization direction of a soft magnetic underlayer of a perpendicular magnetic recording medium.
2. Description of the Related Art
With the advent of the Information Age, the amount of digital information that a person or organization deals with has significantly increased. For example, many people use computers that have high data processing speeds and large information storage capacities to access the Internet and obtain various pieces of information. Central processing unit (CPU) chips and computer peripheral units have been improved to enhance the speed of data processing in computers, and various types of high density information storage media like hard disks are being developed to enhance data storage capabilities of computers.
Recently, various types of recording media have been introduced. Most of the recording media use a magnetic layer as a data recording layer. Data recording types for magnetic recording media can be classified into longitudinal magnetic recording and perpendicular magnetic recording.
In longitudinal magnetic recording, data is recorded using the parallel alignment of the magnetization of the magnetic layer on a surface of the magnetic layer. In perpendicular magnetic recording, data is recorded using the perpendicular alignment of the magnetization of the magnetic layer on a surface of the magnetic layer. From the perspective of data recording density, the perpendicular magnetic recording is more advantageous than the longitudinal magnetic recording.
FIG. 1A is a cross-sectional view of a conventional perpendicular magnetic recording head. Referring to FIG. 1A, the conventional magnetic recording head includes a perpendicular magnetic recording medium 10, a write head 100 writing data on the recording medium 10, and a read head 110 reading data from the perpendicular magnetic recording medium 10.
The write head 100 includes a main pole P1, a return pole P2, and a coil C. The main pole P1 and the return pole P2 may be formed of a magnetic material, e.g., NiFe, and may have different coercivities due to different compositions. The main pole P1 and the return pole P2 are directly used to write data on a recording layer 13 of the perpendicular magnetic recording medium 10. An auxiliary pole 101 may be formed on a side of the main pole P1 to concentrate the magnetic field generated in the main pole P1 while data is recorded in a selected region of the perpendicular magnetic recording medium 10. The coil C surrounds the main pole P1 and generates a magnetic field.
The read head 110 includes first and second magnetic shield layers S1 and S2 and a data reading magnetoresistance device 111 positioned between the first and second magnetic shield layers S1 and S2. While data is read from a predetermined area of a selected track, the first and second shield layers S1 and S2 shield the magnetic field generated by magnetic elements near the magnetoresistance device 111 from affecting the predetermined area. The data reading magnetoresistance device 111 may be a giant magnetoresistance (GMR) device or a tunneling magnetoresistance (TMR) device.
FIG. 1B is an enlarged view of portion A of FIG. 1A. A method of recording information on the perpendicular magnetic recording medium 10 will now be explained with reference to FIG. 1B. The magnetic field applied from the main pole P1 due to the coil C magnetizes the recording layer 13 in a perpendicular Z-axis direction to record data. The magnetic field passes through an intermediate layer 12 and a soft magnetic underlayer 11 and returns to the return pole P2. The perpendicular magnetic recording medium 10 travels in an X-axis direction continuously having information recorded on a predetermined track. Magnetic domains with independent magnetization directions are formed in the soft magnetic underlayer 11 made of a magnetic material. The magnetic field applied from the main pole P1 and passing through the soft magnetic underlayer 11 affects the magnetic domains of the soft magnetic underlayer 11 thereby changing the magnetization directions thereof. After data is recorded on the recording layer 13, the magnetic domains with the changed magnetization directions in the soft magnetic underlayer 11 may change the magnetization directions of magnetic domains in the recording layer 13. In this case, the data retention characteristics of the recording layer 13 are degraded. Furthermore, the changed magnetization direction of the domains in the soft magnetic underlayer 11 leads to formation of magnetic domain walls. And such kind of domain walls formation is highly undesirable since it generate magnetic noise signal during the reading process.
Accordingly, there is an attempt to fix the magnetization direction of the soft magnetic underlayer 11 by forming an antiferromagnetic layer made of IrMn, a ferromagnetic layer made of NiFe, and a spacer layer made of Ru under the soft magnetic underlayer 11. However, such an attempt increases the thickness of the perpendicular magnetic recording medium 10, thereby increasing the thickness of a storage medium using multi-layered disks and complicating manufacturing processes. This also increases the manufacturing cost and complexity. Also, since the coupling constant between the ferromagnetic layer and the soft magnetic underlayer 11 is small, it is difficult to fix the magnetization direction of the soft magnetic underlayer 11.