An installation tool for mounting a tire to a wheel, the tire and wheel defining a central axis, the tire having opposing annular sides and two circumferential beads that define an opening through the opposing annular sides and the wheel having shoulders for receiving the circumferential bead, the installation tool comprising a shoe having an upper axial side, a lower axial side and an outer radial side, wherein the shoe includes a beveled transition zone that extends across at least a part of at least one of the upper axial side and the outer radial side, the beveled transition zone defining a bead drawing surface that mounts the bead of the tire to the shoulder of the wheel when rotatable movement is introduced between the tire and the shoe.

1. Technical Field
This invention generally relates to tooling and to tooling for mounting tires to wheels.
2. Description of the Related Art
Typical tire/wheel assembly may incorporate one or more automated wheel/tire assembly lines to mount tires onto wheels. This process can involve, amongst other operations, mounting the tire onto the wheel, inflating the wheel to the proper pressure, and balancing the tire/wheel assembly. Some of these operations, if not all, can be done using automated means such as robots or the like. One common approach used for mounting a tire to a wheel is to lay the tire on top of the wheel and then to press against the sidewall of a tire (using a roller wheel or the like) thereby pushing the tire onto the rim. Typically, the roller wheel is circumferentially moved along the sidewall of the tire during the installation operation. Another common technique is to use a guide shoe that fits between the edge of the wheel and the tire bead. The shoe rides along the edge of the wheel as it is rotated about the center axis of the wheel. As the shoe rides along the wheel cage it engages the tire bead and transitions the tire bead onto the wheel. Although roller wheels and guide shoes are commonly used for mounting tires to wheels, they have drawbacks. In the case of roller wheels, the sidewall portion of the tire can be susceptible to scratching, cutting, and otherwise defacing. In the case of guide shoes, because the shoe "rides" along the wheel edge it can abrade the wheel (especially if the wheel is aluminum). The present invention eliminates this problem of potentially damaging the sidewall portion of the tire or defacing the wheel during the mounting operation by eliminating contact between the installation tool and the sidewall portion of the tire and the wheel.


Provided is a carrier frequency recovering apparatus and method based on phase shift. The carrier frequency recovering apparatus can recover carrier frequency based on phase shift caused by a frequency offset to thereby perform demodulation without deterioration, no matter how large the frequency offset is, and minimize structural complexity, although a frequency offset tolerance range is higher than a symbol rate and a method thereof. The carrier frequency recovering apparatus includes a phase shift estimation part for estimating a phase shift value caused by a frequency offset based on a received preamble signal; a compensation part for compensating a receiving signal based on the estimated phase shift value obtained in the phase shift estimation part prior to differential decoding; and a detection part for detecting the compensated signal obtained in the compensation part.

1. Field of the Invention
The present invention relates to an apparatus and method for recovering a carrier frequency of a receiving signal in a wireless packet communication system using differential decoding; and, more particularly, to a carrier frequency recovering apparatus and method that can perform demodulation without deterioration, no matter how large a frequency offset is, and minimize structural complexity, although a frequency offset tolerance range is higher than a symbol rate, just as a Direct Sequence Spread Spectrum (DSSS) Differential Binary Phase Shift Keying (DBPSK) system in a low-rate personal wireless communication network following IEEE 802.15.4 Specification.
2. Description of Related Art
Using a crystal oscillator with a high-precision property is very effective in the respect of reducing frequency offsets caused by errors of the oscillator between a transmitter and a receiver of a wireless communication system. The cost for a crystal oscillator generally accounts for less than 1% of the entire material costs of a common communication device or a household electronic product, such as a mobile phone and a television (TV) set.
However, the cost for a crystal oscillator reaches up to 10% of the entire material costs for each unit product in a system having low-cost and low-data transmission rate as its mottos, such as a Low-Rate Wireless Personal Area Network (LR-WPAN) defined in an IEEE 802.15.4 Specification. Traditionally, TVs and FM radios employ an RF receiver without a crystal oscillator. Since a communication system without a crystal oscillator has a relatively wide transmission bandwidth, compared to the transmission frequency, or it requires manual frequency tuning from a user, it is not appropriate as a modern communication system.
These days, the LR-WPAN system for a low-cost sensor node apparatus that has a receiver without a crystal oscillator comes into the limelight. The LR-WPAN based on the IEEE 802.15.4 defines a carrier frequency offset tolerance value of ±40 ppm, which is a rather large value, to minimize complexity in realization.
In a general Direct Sequence Spread Spectrum (DSSS) system, there is a pilot channel and frequency is recovered by estimating frequency and phase offsets based on pilot signals received through the pilot channel and using a Phase Lock Loop (PLL). The structure has an advantage that frequency and phase offsets are accurately estimated. Thus, it is proper to coherent demodulation.
However, a packet communication system, such as the LR-WPAN system, can hardly support an additional pilot channel. Thus, if there is a preamble, the system should seek to estimate and compensate for a frequency offset by using the preamble. Herein, when differential decoding is used instead of coherent demodulation, the receiver can be simplified and the effect of frequency offset can be reduced.
Differential phase Shift Keying (PSK) is a technology for recovering signals by using a delay value of a previous symbol and phase information of a current symbol. Generally, the receiver using differential decoding has a property that it is robust to phase shift of a small range, which is caused among adjacent symbols, and it can also reduce the effect of phase noise.
The frequency offset tolerance value can be obtained more in differential chip detection (DCD) where signals are detected at a chip level than in differential symbol detection (DSD) where signals are detected at a symbol level.
A LR-WPAN Standard technology following the IEEE 802.15.4 Specification supports a low-rate data service as fast as 20 Kbps/40 Kbps by using a DSSS Differential Binary Phase Shift Keying (DBPSK), which is a symbol level modulation method, in a band of 868 MHz to 915 MHz. The frequency offset tolerance value is ±40 ppm for each of a transmitter and a receiver, and it is ±80 ppm (160 ppm) for the entire system.
The frequency offset tolerance value signifies that frequency offsets are tolerable in a range of 69 KHz to 73 KHz in the band of 868 MHz to 915 MHz. The tolerance value is about two to three times as high as the symbol transmission rate. Thus, it is difficult to synchronize signal reception by using a general frequency recovering method. Although a conventional differential demodulation may be adopted, it deteriorates performance and makes the structure of a receiver complicated. In addition, it increases the costs.
According to the conventional coherent frequency offset estimation apparatus estimates frequency offsets by using the currently received signals, provides the frequency offset estimation information to an oscillator, and multiplies inputted signals by the frequency offset estimation information to thereby compensate for the frequency offset in a low pass filter. An example of the conventional coherent frequency offset estimation apparatus will be described hereafter with reference to FIG. 1.
FIG. 1 is a schematic diagram illustrating a conventional frequency recovering apparatus using a Costas loop. It describes how a carrier is recovered through the Costas loop in a synchronous communication system.
Referring to FIG. 1, receiving signals are multiplied by an orthogonal carrier of a frequency offset component estimated in a numerically controlled oscillator (NCO) 103 at multipliers 100, 101, 102 and 104. Subsequently, offset signals are acquired through an adder 105 and a subtracter 106. The offset signals are multiplied by the outputs of two low pass filters (LPF) 107 and 108 and then filtered in a loop filter 109 to thereby produce an estimated frequency offset. The estimated frequency offset is fed back to the numerically controlled oscillator 103 and drives the numerically controlled oscillator 103.
However, the range of the maximum frequency offset that can be estimated depends on the symbol transmission rate. When the DCD method is used, the range can be extended as much as the chip rate. However, since the DSSS DBPSK method of the LR-WPAN following the IEEE 802.15.4 Specification uses the DSD method, the frequency offset compensation performance is deteriorated remarkably.

Carrier frequency recovering apparatus using phase shift and method thereof

Electronics and Telecommunications Research Institute


Valves for annular conduits and associated systems and methods are disclosed. A fluid transmission system in accordance with one embodiment of the invention includes a first conduit having a first wall aligned with a flow direction in the first conduit and a second conduit disposed annularly around the first conduit with a second wall aligned with the flow direction. An access channel can be positioned to have an aperture in fluid communication with the first conduit and can be isolated from fluid communication with the second conduit. A valve element can be positioned in fluid communication with the access channel and can be movable between a first position and a second position, with the valve element being positioned to allow a first amount of flow through the access channel when in the first position and being positioned to allow no flow or a second amount of flow less than the first amount of flow through the access channel when in the second position. The valve can be installed in aircraft fuel lines or other systems.

Modern aircraft include complex fuel systems that route aviation fuel from fuel tanks to aircraft systems that use the fuel. These aircraft systems can include the primary engines, and/or auxiliary power units (APUs). In the case of an aerial refueling tanker, these systems can also include the fuel lines, manifolds, and associated valving necessary for delivering fuel to a receiver aircraft. In some cases, the fuel lines may pass through "ignition zones," which are typically pressurized compartments in the aircraft (e.g., baggage compartments) that may also house electrical devices. Federal Aviation Administration (FAA) regulations require that fuel lines in such areas must be shrouded and capable of being drained. Accordingly, there is a need in the industry for fuel lines that are both shrouded and convenient to access for draining.

Valves for annular conduits including aircraft fuel conduits and associated systems and methods


An image processing apparatus acquires target image data generated by optically reading a sheet. The sheet includes an original image and an added image. The added image is added on the sheet. The apparatus specifies, from the target image, an added region surrounded by a surrounding line. The apparatus specifies a written target in the added region. The apparatus generates partially-erased image data and supplementary data by using the target image data and a result of the specifying of the written target. The partially-erased image data represents a partially-erased image that is based on the target image with an image inside the added region being erased. The supplementary data concerns the added image. The apparatus generates an image file including the partially-erased image data and the supplementary data so that the partially-erased image and supplementary information can be reproduced in selective one of a simultaneous manner and an independent manner.

A PDF file can include image data and various data such as annotation and is therefore widely used for storing an electronic document with annotations. For example, a conventional image forming apparatus reads a sheet including characters or images added by handwriting to generate a PDF file including image data and the annotation data indicating the handwritten characters or images.

Image processing apparatus generating partially erased image data and supplementary data supplementing partially erased image data


An electrical storage system includes a first electrode, a second electrode, an insulated separator, and an electrolyte. The second electrode is spaced from the first electrode. The insulated separator is disposed between the first electrode and the second electrode. The separator further includes an agar and a fiber material. The electrolyte surrounds the first electrode and the second electrode.

1. Field of the Invention
The invention relates to electrical energy storage systems and, particularly, to an electrical energy storage system used in an electronic product acting as an electrical source.
2. Discussion of Related Art
Electrical energy storage system, such as batteries, includes, inter alia, a cathode, an anode, electrolyte, and an insulated separator. The insulated separator is generally arranged between the anode and the cathode, and separates the anode from the cathode so as to eliminate or reduce the chances of the anode and the cathode short circuiting. In a charge-discharge process of the battery, ions in the electrolyte migrate from the cathode to the anode and vice versa. As such, ions must pass through the insulated separator. Thus, ion migration in the electrolyte is mainly determined by the degree of saturation of the insulated separator with the electrolyte. The degree of saturation of the insulated separator may also affect the internal resistance of the storage systems.
What is needed, therefore, is an electrical energy storage system that includes an insulated separator promoting/having a good saturation with the electrolyte.

Insulated separator for electrical energy storage system


A passive radio frequency identification (RFID) tag includes: a rectifier circuit that rectifies a signal obtained from an antenna and outputs the rectified signal as a DC voltage. A capacitor is connected to an output line of the rectifier circuit. A first regulator circuit generates a first regulator voltage by stabilizing the output DC voltage from the rectifier circuit. A control circuit starts operating when the first regulator voltage is applied, and the control circuit generates a control signal upon receipt of the modulation signal section of the wireless signal. A second regulator circuit generates a second regulator voltage by stabilizing the output DC voltage from the rectifier circuit in response to the control signal and outputs the second regulator voltage to the outside.

Passive RFIDs are a technique by which a tag on a secondary unit operates with radio waves transmitted from a reader/writer of a primary unit as a power source, and information is communicated between the reader/writer and the tag.
Conventional passive RFID tags include: a rectifier circuit that rectifies an alternating current signal that is a signal received from an antenna that receives radio waves; a regulator circuit that stabilizes an output direct current voltage from the rectifier circuit; a control circuit that operates according to an output voltage from the regulator circuit; and a demodulation/modulation circuit that is connected to the antenna, that operates using the output direct current voltage from the rectifier circuit, and that undergoes transmission/reception control by the control circuit. A conventional RFID tag having this configuration is disclosed in Japanese Patent Application Laid-Open Publication No. 2007-122600, for example.
The antenna receives a transmission radio wave from a reader/writer, and the received signal is supplied to the rectifier circuit as an alternating current signal, and converted to a direct current voltage. The direct current voltage is supplied to the regulator circuit and the demodulation/modulation circuit. The control circuit operated by the output voltage of the regulator circuit writes reception data to a memory, and reads data written to the memory and supplies the data as transmission data to the demodulation/modulation circuit. The demodulation/modulation circuit detects and demodulates the received signal and supplies the received signal to the control circuit as reception data as well as modulating transmission data that is a response supplied from the control circuit to the antenna as the transmission signal.

This patent is subject to a terminal disclaimer.


A mobile electronic device has a touch sensitive screen and an accelerometer. A translator is to translate a word or phrase that is in a first human language and that is entered via a first virtual keyboard displayed on the touch sensitive screen, into a second human language. A translator is to cause the touch sensitive screen to display the translated word or phrase and a second virtual keyboard having characters in the second human language, in response to the accelerometer detecting a change in the physical orientation of the device or movement of the device. Other embodiments are also described and claimed.

A basic need for most people when traveling in a foreign country is human language translation. One may be riding in a taxi or about to purchase something when there is a sudden and important need to translate a phrase or statement. For example, one may want to ask the cab driver a question about the route he is taking, or wish to ask a salesperson about alternatives to a particular item he is presenting you. A two-way, portable, electronic language translation device is very useful in such circumstances. Such a device has a display and a keyboard that allows the user to type in a word or phrase in the user's native language. The user then presses a button on the keyboard, and the word or phrase is then translated by built-in data processing circuitry of the device into another language before being displayed. With the display showing the translated phrase, the user may then hand the device to the other party who can then read the translated phrase and then respond using the device in a reverse manner but in her own language.

Mobile device having human language translation capability with positional feedback


A cage lure for attachment to a fishing hook and a fishing line, and for containing bait is disclosed. The cage lure comprises a bait enclosure bag having a flexible meshed construction; a dual spring closure means for closing the open end of the bait enclosure bag; a leader having openable attachment rings, the rings adapted for attachment, in use, to the fishing line and the fishing hook; and means for releasably attaching the bait enclosure bag to the leader, the attachment means comprising at least two loops.

Up until now, when an angler desires to use live bait, it has been necessary to impale the bait on a hook. Conventionally, it has been believed that the bait should be mounted directly on the hook. This has numerous disadvantages. For instance, by forcing the hook through the bait, the bait is thereby injured and will die relatively quickly. Once dead, the bait in incapable of independent movement and will not exhibit the distress signals that attract fish. Forcing a hook through the bait also weakens the tissue of the bait which makes the bait susceptible to falling off the hook; having no bait on the hook will greatly lower the chances of catching fish.
Traditionally, emphasis was placed on bait that was visually attractive to the desired type of fish. It is now recognized that the scent and also the distress signals given off by small animals or insects are used by fish to locate food sources, and hence can be used to attract fish to a baited hook. Thus, the roe of certain fish gives off a scent that will attract other predator fish. It is also becoming increasingly common for fishing supply stores to stock a wide variety of pellets, which contain various scents intended to attract different fish. Sometimes these are sold in liquid form, and are used to saturate a sponge pellet. In either case, the bait is relatively expensive and difficult to retain on a conventional hook.
If an animal or insect is impaled on a hook, frequently it will die quite quickly. If it can be retained alive then it will continue to emit distress signals, e.g. vibrations of various frequencies which may or may not be audible to the human ear, and these can attract appropriate game fish.
When frogs are used as bait, the usual method of hooking the frog is to force the hook through the upper and lower jaws of the frog. Often, novice fishermen hook the frog through its nasal cavity, which hastens the death of the frog greatly, leading more quickly to the disadvantages stated above.
Also, the standard hook lure is not suitable for certain types of bait, such as crickets, grasshoppers and other insects, due to the softness and fragility of the tissue of the bait.
It is therefore desirable to provide a fishing lure in which the bait is securely retained, and which improves the attractiveness of the bait to the fish.
It is further desirable to provide a fishing lure in which live bait remains alive and intact for a lengthy period.


A method of controlling an oxygen concentrator having a first sieve bed operated over successive control periods according to a duty cycle for alternately pressurizing and flushing the first sieve bed and a second sieve bed operated over the successive control periods according to a reciprocal of the duty cycle is disclosed. The duty cycle and the reciprocal duty cycle are adjusted during every second one of the successive control periods to change the pressurizing relative to the flushing of the first sieve bed and to change the flushing relative to the pressurizing of the second sieve bed, for reducing concentration of oxygen produced. The duty cycle and the reciprocal duty cycle are adjusted during remaining control periods to change the flushing relative to the pressurizing of the first sieve bed and to change the pressurizing relative to the flushing of the second sieve bed, such that water vapor is purged from the first and second sieve beds after pressurizing thereof. A pressure-swing adsorption (PSA) subsystem performance check is disclosed. This test is performed as part of a maintenance BIT (Built-In-Test) function. After verifying that the oxygen sensor accuracy is acceptable using prior art techniques, a set of bleed valves are opened to load the oxygen concentrator at a specific flow. The oxygen concentration is then checked via the sensor to determine whether the PSA subsystem is operating to within a predetermined concentration level.

Oxygen generation for aircraft breathing applications requires that the product gas concentration stays within predetermined altitude-dependent minimum and maximum physiological limits. Normally, the minimum oxygen content of the breathable gas is that required to provide, at all cabin altitudes, the same or greater oxygen partial pressure as at sea level. A maximum oxygen concentration is set to reduce the likelihood of partial lung collapse during low-altitude high G maneuvers. More particularly, the risk of partial lung collapse increases with the risk of total adsorption of entrapped pockets of gas in the lungs, which result from distortion of the lungs during high G maneuvers. The risk of total adsorption of the entrapped gas increases with increased oxygen concentration (i.e. reduced nitrogen concentration).
Methods are known for the generation of low-pressure oxygen-enriched air. One such method is referred to as pressure swing adsorption (PSA) and has the advantage of being able to provide oxygen-enriched air in a short period of time after the supply of a suitable feed gas (e.g. pressurized air). The pressure swing adsorption process uses pressure to control adsorption and desorption. According to this process, the nitrogen in pressurized air is adsorbed in a molecular sieve bed while the oxygen passes through the bed. When the molecular sieve in the bed has become nearly saturated, the bed is vented to atmospheric pressure. This causes most of the nitrogen-adsorbed gases to be desorbed and discharged from the bed. In a two-bed system, when one bed is producing oxygen, some of the enriched product gas is flushed back through the (vented) other molecular sieve bed to further lower the partial pressure of the adsorbed gases in the vented bed and to complete the desorption process. Using two beds which are pressurized and flushed alternately provides a continuous flow of product gas and ensures sufficient pressure for the flushing operation.
Aircraft on-board oxygen generation systems (OBOGS) are known in the art. These systems are based on the molecular sieve gas separation process discussed above. Such systems are said to be "self-regulating" since the pressure swing increases with altitude, and therefore the efficiency of the process also increases to ensure sufficient oxygen concentration at high altitudes. More particularly, since each sieve bed is vented to the atmosphere (or cabin) during its regeneration phase, the bed pressure during desorption decreases with increasing altitude, thereby enhancing the desorption process.
In order to keep the oxygen concentration within maximum limits at low altitudes, processes have been developed to reduce the performance of prior art OBOGS. U.S. Pat. Nos. 4,661,124 and 5,004,485 (Humphrey, et al), disclose an alternating bed oxygen generating system with controlled sequential operation of charge and vent valves according to a series of selectable overall cycle times ranging between a minimum and a maximum, in a number of discrete steps. By extending the overall cycle time, efficiency of the system is reduced thereby regulating the product gas oxygen gas to within physiological maximum limits.
In U.S. Pat. No. 4,661,124, the overall cycle time of the molecular sieve beds is controlled using a pressure transducer on the basis of cabin pressure which is indicative of the altitude at which the aircraft is operating.
In U.S. Pat. No. 5,004,485, an oxygen sensor is used to test the gas concentration and a comparator function is implemented to compare the sensed oxygen concentration with values in a look-up table of desired product gas oxygen concentrations at various altitudes. In response to implementing the comparator function the overall cycle time is controlled to provide suitable concentration levels.
Prior art systems employing overall cycle time control, such as disclosed in U.S. Pat. No. 4,661,124 and 5,009,485 (Humphrey et al) suffer from a disadvantage in that it is difficult to accurately control the output oxygen concentration because performance changes occur over a small range (e.g. 4.5 seconds to 5.5 seconds in some systems, whereas cycles ranging from 5.5 seconds to 8.5 seconds do not result in any performance changes).
Dynamic control of system performance to regulate product gas to within the minimum and maximum physiological limits, requires reliable performance of the oxygen sensor connected to the concentrator output. The use of Built-In-Test (BIT) switches is known in the art for initiating integrity tests for current-limiting oxygen sensors. U.S. Pat. No. 5,071,453 (Hradek, et al) discloses a Built-In-Test function for implementing a system self-test for preflight and an oxygen sensor calibration check for operational level maintenance. When the BIT switch is momentarily depressed, a solenoid valve is energized to direct a flow of air through the oxygen sensor. Once the air reaches the sensor, the sensor output begins to drop indicating reduced oxygen concentration. Upon dropping to below a predetermined warning level, an alarm is activated indicating that the self-test has been successful. If the sensor output does not fall below the predetermined warning level within a defined time period such as 20 seconds, the self-test is deemed to have failed and the warning remains activated. The oxygen sensor calibration check involves energizing the same solenoid valve for passing a flow of air through the sensor in response to a lengthened depression of the BIT switch. During the calibration check, the air flow through the sensor is maintained for a longer period (3 minutes) than during the self-test, so that the sensor output falls below the warning level to within a predetermined threshold calibration range, causing activation of the warning signal. If the output of the oxygen sensor does not fall to within the predetermined calibration range within three minutes, the calibration test is deemed to have failed and the warning remains activated after completion of the test.
Although systems such as discussed above are known for testing the operation of oxygen sensors in OBOGS, the lack of maintenance testing systems for oxygen concentrators results in high support equipment requirements including the use of inlet air sources and test sets (to set the concentrator product flow and measure oxygen composition). Inlet air sources can often become contaminated with moisture and oil, and test sets require calibration control.

Oxygen concentrator with beds' duty cycle control and self-test


A folding handle device is disclosed, mountable to an article to be carried, having a rotatable U-shaped handle with leg members adaptable to pivotally receive a mounting shaft, each leg member having a base having planar surfaces in which the handle be held upright or folded. The device further includes two mounting shafts rotatably mounted to the handle through apertures in a planar mounting surface and are retained in place by a nut. A spring between the nut and the bottom side of the mounting surface bias the mounting shaft away from the bottom side of the planar mounting surface. The handle is adapted to facilitate axial movement of the shafts relative to and perpendicular to the planar mounting surface as the handle is rotated between the upright and folded positions, wherein when the handle is either in the upright position or folded position, the spring is under a compressive load, and during the transition from the upright to folded positions and the transition from folded to upright positions, the spring is under a greater compressive load than that when the handle is in the upright position or folded position.

This invention pertains to the art of handles and handle assemblies and more particularly to an improvement in a handle for mounting on an article where the handle may be securely held in an opened position where the handle is accessible, or in a folded position where the handle is securely stored.
The principal object of the present invention is to provide a handle which may be securely held in either an opened or closed position.


Two drive motors (9L, 9R) are provided on both sides of the ball screw (5), and the ball screw is driven by these two drive motors simultaneously. Therefore, the ball nut (17) attached to the worktable and in mesh with the ball screw (5) can be moved reciprocatingly to move and locate the worktable (15) on which workpiece (W) is clamped. Since the ball screw can be rotated by the two drive motors together, even if a ball screw of large lead is used, the maximum rotational speed and the maximum acceleration can be both increased, so that the workpiece can be located in position in a short time. In addition, since the torsional stress and strain generated in the ball screw can be both reduced, the locating precision can be further improved. When the workpiece feeding apparatus is applied to a turret punch press, for instance, the carriage (49) is driven and located in the X-axis direction, and the carriage base (39) is driven and located in the Y-axis direction, both by use of the above-mentioned workpiece feeding apparatus.

1. Field of the Invention
The present invention relates to a workpiece feeding apparatus for a plate processing machine, and more specifically to a work feeding apparatus for a plate processing machine which can locate work at high speed.
2. Description of the Prior Art
FIG. 1 shows a typical example of a workpiece feeding apparatus mounted on a worktable for a punch press, for instance.
In more detail, a ball screw 103 extending in a workpiece feed direction (the right and left in FIG. 1) is rotatably supported by two bearings 101L and 101R. This ball screw 103 is rotated by a drive motor 107 mounted on one (e.g., left) side of the ball screw 103 via a gear mechanism 105, for instance. On the other hand, a ball nut 115 in mesh with the ball screw 103 is attached to the lower surface of a worktable 113. The worktable 113 is provided with a slider 111 movable along a guide rail 109 fixed so as to extend in the workpiece feed direction.
Therefore, when the motor 107 is driven, since the ball screw 103 is driven or rotated by the motor 107 via the gear mechanism 105, the ball nut 115 is moved along the ball screw 103, so that worktable 113 can be moved in both the rightward and leftward in the workpiece feed direction.
In the above-mentioned prior art workpiece feeding apparatus, the maximum speed of the worktable 113 for clamping workpiece W is decided on the basis of both the maximum number of revolutions of the drive motor 107 and the lead of the ball screw 103. In this case, however, since there exists a limit of the maximum number of revolutions of the drive motor 107, when the feed speed is required to increase, it is necessary to increase only the lead of the ball screw 103.
When the lead of the ball screw 103 is simply increased, since an inertia (i.e., load) of the motor shaft increases, the output torque required for the drive motor 107 also increases. On the other hand, however, since there exists a limit of the output torque of the drive motor 107, there exists a problem in that it is impossible to simply increase the lead of the ball screw 103, as with the case of the punch press in which high acceleration or high deceleration motion is often required for the worktable, in particular.
Here, it should be noted that the maximum speed of the ball screw and the worktable feeding efficiency are different from each other. In more detail, FIG. 2A shows the worktable speed when the ball screw 103 of a small lead is used, and FIG. 2B shows the worktable speed when the ball screw 103 of a large lead is used, on condition that the output torque of the drive motor 107 is the same. In the case shown in FIG. 2A, although the total time t1 from when the worktable 113 begins moving to when it stops moving is relatively short, the maximum speed Vmax of the ball screw 103 is low. In the case shown in FIG. 2B, although the maximum speed Vmax of the ball screw 103 can be increased, the total time t2 from when the worktable 113 begins moving to when it stops moving is relatively long. In other words, when the lead of the ball screw 103 is simply increased as shown in FIG. 2B, although the maximum speed Vmax can be increased, since the acceleration of the motor 107 is low, a long time is required from when the worktable 113 begins moving to when it stops moving, with the result that the work feeding efficiency becomes low on the contrary. On the other hand, since there exists a limit of the maximum torque of the drive motor 107, it is impossible to increase the acceleration of the worktable 113.

Workpiece feeding apparatus for a turret punch press


Solutions comprising: (i) at least one organic semiconductor, (ii) at least one organic solvent A having a boiling point, and (iii) at least one organic solvent B having a boiling point; wherein the at least one organic semiconductor comprises at least one high molecular weight component, wherein the at least one organic solvent A is a good solvent for the at least one organic semiconductor, wherein the at least one organic solvent B is a poor solvent for the at least one organic semiconductor; and wherein the boiling point of the at least one solvent A is greater than the boiling point of the at least one solvent B; and the use of such solutions in processes for forming organic semiconductor layers on substrates and devices formed by such processes.

The present invention relates to solutions of organic semiconductors, and to the use thereof in the electronics industry.
The use of organic semiconductors as functional materials has been reality for some time or is expected in the near future in a number of different applications which can be ascribed to the electronics industry in the broadest sense. The development of organic transistors (O-TFTs, O-FETs), organic integrated circuits (O-ICs) and organic solar cells (O-SCs) is already very well advanced at the research stage, so that market introduction can be expected in the next few years. In the case of organic electroluminescent devices (OLEDs), the market introduction has already taken place, as confirmed, for example, by the car radios from Pioneer or a digital camera from Kodak with an "organic display". A first product is also available on the market in the case of polymeric light-emitting diodes (PLEDs) in the form of a small display in a shaver from Philips N. V. The general structure of such PLEDs is shown in WO 90/13148. In spite of all advances, significant improvements are still necessary in order to make these displays a true competitor to the liquid-crystal displays (LCDs) which currently dominate the market.
In order to obtain full-colour display devices, it is necessary to develop coating methods which allow the three primary colours (red, green, blue) to be applied in a spatially separated manner. Since the polymers are generally applied from solution, printing processes are a means of choice here. Owing to the good controllability, the achievable resolution and the large variability, it is principally ink-jet printing (IJP) processes that are currently being worked on. In principle, however, other printing processes, such as, for example, offset printing, transfer printing or gravure printing processes, are also suitable. On the other hand, corresponding colour displays can also be produced by photolithographic processes; in this case, area-coating processes can then be used, as are also described below for single-colour displays. For all these possibilities, suitable polymer solutions which are on the one hand suitable for printing, but on the other hand also do not impair the properties of the PLEDs, are required. Suitable polymer solutions are also required for single-colour display devices, which can be produced, for example, by spin coating. Since it is generally known that the choice of solvents and also the solubility of the polymers in this solvent or the solvent mixture has a crucial effect on the morphology of the film formed, the electroluminescence behaviour can also be controlled thereby.
WO 02/069119 describes solutions of organic semiconductors for use in ink-jet printing processes in which solvent mixtures comprising a poor solvent having a relatively high boiling point and a good solvent having a relatively low boiling point are used. Evaporation of the more volatile solvent rapidly produces during drying a saturated solution of the material, which consequently precipitates. This prevents radial flow of the material to the edges of the pixel and facilitates relatively uniform material distribution. However, this method has the crucial disadvantage that the material does not dry uniformly, but instead a precipitate forms which results in clear inhomogeneities of the film. US 2003/0127977 shows, for example by SEM (scanning electron microscopy), that a film exhibits poor properties if the material precipitates during drying. This makes uniform and homogeneous electroluminescence from the pixel impossible. Furthermore, the irregularity of the film means that a uniform current flow is impossible. It is thought that preferred current channels thereby form, which ultimately result in short circuits and thus significantly lower stability of the device. Some experience which these experiments have recreated has furthermore shown that these inhomogeneous pixels result in a reduction in the luminous efficiency. Thus, although these solutions possibly result in improved applicational properties for ink-jet printing, such solutions cannot be widely used if these are accompanied by an impairment of the electroluminescence properties.
WO 02/072714 proposes solutions in a mixture of two (or also three) solvents, where both solvents have a boiling point of below 200° C. and one solvent has a boiling point between 140° C. and 200° C., which furthermore contain no benzylic CH2 and CH groups and have certain restrictions for the substituents on aromatic solvents. It is described as particularly favourable if the solution thickens rapidly. This is achieved by using binary or ternary solvent mixtures in which the organic semiconductor has the lowest solubility in the solvent having the highest boiling point or is very thick or gelatinous in this solvent. A rapid increase in viscosity then occurs during thickening. However, it is not always possible to find suitable solvent systems having such a composition in which the organic semiconductor thickens rapidly without precipitating in the process.
EP 1134269 describes that it is particularly advantageous for solutions of polymeric fluorescent substances which have at least one arylene-vinylene unit to have a content of poor solvent of not more than 10,000 ppm, preferably not more than 5000 ppm (determined by gas chromatography), where the lower limit is not defined. Elsewhere in the description, the preferred upper limit is even indicated as a content of poor solvent of not more than 1000 ppm, which corresponds to about 0.1% by weight (at comparable density). Poor solvents are described as being especially alcohols, in particular methanol, ethanol and isopropanol. The advantage of these solutions is stated to be a higher luminous efficiency, which is confirmed in one example (with a poly-para-phenylenevinylene derivative).

Organic semiconductor solutions, processes for forming organic semiconductor layers therewith and devices containing such layers


A highly efficient and versatile system for high speed functional testing of finished RFID tags. Common materials are used in key areas, like the antenna enclosure 3a and 3b, to cut the cost of the system. A standard RFID reader (11) is used along with a real time microcontroller (13) and sensors (5, 7) to test each tag on a continuous web (21) good or bad. Bad tags can be ignored, marked, or removed from the web. The system is designed to be mounted to existing press and rewind equipment, enabling an incremental investment in RFID technology.

1. Field of Invention
This invention generally relates to the production of Radio Frequency Identification Device (RFID) tags, specifically to the reliable testing of finished RFID tags and labels at high speed in a production environment.
2. Prior Art
RFID tags and labels have a combination of antennas and analog and/or digital electronics, which may include for example communications electronics, data memory, and control logic. RFID tags and labels are widely used to associate an object with an identification code. For example, RFID tags are used in conjunction with security-locks in cars, for access control to buildings, and for tracking inventory and parcels. Some examples of RFID tags and labels appear in U.S. Pat. Nos. 6,850,080 (Hiroki 2005), 6,429,831 (Babb 2002), 6,940,408 (Ferguson et al. 2005), 6,784,789 (Eroglu et al. 2004), 6,535,175 (Brady et al. 2003), 6,827,817 (Bleckmann et al. 2004), 6,780,265 (Bleckmann et al. 2004), and 6,451,154 (Grabau et al. 2002).
RFID tags are wireless devices which communicate only with wireless base stations. Those base stations are commonly called RFID readers.
Radio Frequency Identification Device (RFID) tags are manufactured through the execution of a number of steps:
(a) Integrated Circuit (IC) chips are manufactured and tested. The testing is performed according to many methods, including those disclosed in U.S. Pat. Nos. 6,850,080 (Hiroki 2005) and 6,429,831 (Babb 2002).
(b) The IC chips are attached to antennas. The resulting assemblies, commonly called "inlays," are tested. Testing is performed according to many methods, including those disclosed in U.S. Pat. Nos. 6,940,408 (Ferguson et al. 2005), 6,784,789 (Eroglu et al. 2004) and 6,535,175 (Brady et al. 2003). Most tests on inlays are performed with specialized, expensive, equipment that measures the electrical characteristics of the inlay rather than performing a direct functional test of the finished inlay. Tested Inlays are commonly delivered as a continuous web, on a roll, for further processing.
(c) Inlays are cut from the roll and inserted into paper labels, cloth labels, plastic housings and other assemblies needed for various applications, through a process generally called "conversion." The resulting assemblies, commonly called "tags," are tested. Testing is performed according to many methods, including a number of slow, labor intensive methods described below. Finished RFID tags are commonly delivered as a continuous web, on a roll, for further processing. U.S. Pat. Nos. 6,827,817 (Bleckmann et al. 2004) and 6,780,265 (Bleckmann et al. 2004) disclose methods for manufacturing RFID tags but do not discuss testing. U.S. Pat. No. 6,451,154 (Grabau et al. 2002), "RFID Manufacturing Concepts," states minimally, "The paper web moves past a station where conventional RFID read/writer equipment is provided. The equipment practices at least one of verifying the functionality of, or programming, the chips of inlets prior to the formation of a composite web," this being the only mention of testing in the patent. Such functional testing is not trivial or obvious to implement. This patent does not disclose enough information to develop an effective subsystem for RFID tag testing.
Common Practices
Many enterprises pass finished RFID tags in front of an RFID reader and employ technicians to watch lights or other indicators that show that each tag is being read. Each tag that fails to read is then immediately replaced by the technician, or marked for later replacement. These manual test methods, while very slow and labor intensive, are widely used because they incur very low equipment cost on the enterprise.
Several vendors of RFID equipment have included in their equipment the ability to perform actions based on logical triggers. Some of these vendors have attempted to create RFID test systems by connecting an optical gap sensor to the trigger input of such an RFID reader. The theory of operation of such a system is that the gap between labels can drive the timing of any testing that needs to be done. However, those systems have a number of weaknesses. Most of those weaknesses involve timing and electrical requirements associated with the support of sensors and actuators. For example, the trigger inputs of most RFID readers are not fast enough to react to the signal produced by an optical gap sensor when the interlabel gap moves past the sensor at the high speeds common to production environments. One very important weakness of such a setup is the spatial relationship between the interlabel gap and the RFID tag within the label. An RFID test system based solely on optical gap sensing with no position detection will require constant mechanical adjustment of the optical gap sensor to accommodate physical differences between production runs. Further, such systems do not control the timing of their outputs. The RFID reader replies when its programmed actions are complete, with no regard for the timing requirements of the system to which it is connected. Some have proposed extending this design philosophy to the marking of bad RFID tags, simply by connecting a marker to the "bad tag" signal output of the RFID reader. For all the reasons above, this will not work fast enough or consistently enough for production environments.
Many enterprises purchase and use a special tester for RFID tags. These testers commonly incorporate mechanisms for positioning individual RFID tags on a continuous web in front of an RFID reader. The reader, controlled by a separate computer, then performs a series of tests on each RFID tag to be so positioned. At the end of the test, the web is advanced to the next tag position. Each tag that fails the test is marked for later replacement. This special purpose RFID test device has a number of disadvantages:
(a) Since the continuous web of RFID tags must be stopped in order to test each tag, the system wastes a lot of time stopping and restarting the continuous web.
(b) Since the tests are controlled by a separate computer, the system wastes a lot of time sending the same commands to the RFID reader for each tag tested.
(c) Since the tester is a separate device that stands alone from other devices, workers must transfer rolls of RFID tags to and from this device.
Antennas and Shielding
One challenge faced by designers of short range RFID systems, including test systems, printers, and label applicators, is antenna design. Most short range RFID systems use a small antenna similar in size to the RFID tag itself. These antennas must generally be positioned very close to the RFID tag in order to function correctly. That means that each tag must stop in front the antenna for the duration of the test, which further implies that no device based on these small antennas can be operated with continuous web motion.
Another challenge faced by designers of short range RFID systems, including test systems, printers, and label applicators, is antenna shielding. If one and only one RFID tag is to be tested, all other tags in the vicinity must be shielded from the reader, or the reader must be shielded from them. Most designs use reflective metal surfaces, absorptive ferrite materials, or a combination of reflective and absorptive elements. The approach has a number of drawbacks, including excess RF reflections, complexity and cost.

Apparatus and method for real time functional testing of RFID tags


A center backfire inner heat regenerative energy saving high efficiency furnace and tank integration reduction furnace system comprises a furnace section and a heating section. The furnace section includes a reduction tank, a material inlet door, a magnesium crystal collecting machine, and a residue exhaust pipe. The reduction tank includes a tank body, a centre combustion room, and plural fume exhaust pipes. The material inlet door is connected to a material charging room between the center combustion room and the tank body, and the magnesium crystal collecting machine is provided with a crystal cover communicating with the material charging room, and a water recycling condensation equipment outside the crystal cover. The residue exhaust pipe is connected to the material charging room and provided with a residue exhaust door and a water dispersing heat separating cover. The heating section includes a burner connected to the center combustion room.

1. Field of the Invention
This invention refers to a metal reducing furnace, and more particularly to a center backfire inner heat regenerative energy saving high efficiency furnace and tank integration reduction furnace system which is used for refining magnesium.
2. Description of the Prior Art
The traditional magnesium refining technology is called Pidgeon which uses a horizontal furnace. Plural reduction tanks are distributed horizontally inside the furnace. The reduction tanks are filled up with reactant pellet. Firstly the reduction tanks are heated up by the outside radiant heat of reverberator, afterwards the reduction tanks transmit the heat radiation to the reactant pellet, and then the pellet mutually relay transmits heat. This is a peripheral heating (as shown in FIG. 5). If using this kind of heating method, continuous experiments prove that the heat transmission rate is low within the reduction tank, the temperature gradient is high, the temperature evenness is not good, and the transmission diameter of the heat radiation is big. Because of the above reasons, it takes a long period of time (10-12 hours a cycle) to let the material within the tank reach its reduction temperature (1150-1200° C.). Besides that, the volume of the reduction tank is too small and every time it can only stuff several hundred kilograms of material. It needs more furnaces and tanks to reach the production requirement. The method of Piegeon has many drawbacks, such as low efficiency, high labor intensity, energy consuming, low yielding of the magnesium, and environmental pollution.

Center backfire inner heat regenerative energy saving high efficiency furnace and tank integration reduction furnace system


A lottery ticket including at least one first play area and at least one second play area in which authenticating indicia is printed beneath the scratch-off layer in the second play area and on top of the scratch-off layer in the second play area. If the player decides not to play the second play area, the authenticating indicia on top of the scratch-off layer in the second play area authenticates the lottery ticket and the prize that is won. If the second play area is played, then the authenticating indicia printed below the scratch-off layer is employed as the authenticating indicia.

Lottery tickets of the scratch-off variety are well known and played by a significant number of players in the United States and in other countries of the world. Scratch-off games typically have the player remove a scratch-off layer from a designated play area to expose multiple indicia in which certain patterns of the play indicia or game symbols, if present, constitute a winning prize.
There has been a growing tendency to introduce scratch-off lottery tickets in which the type of game or play action involves more than merely removing a scratch-off layer to ultimately determine if a prize has been won. The object is to provide the player with an additional form of amusement.
One such lottery ticket is a scratch-off lottery ticket with a first play area as is customary with lottery tickets. Play indicia are provided beneath the scratch-off layer and if removal of the scratch-off layer of all or part of the game area in accordance with the instructions of the lottery game reveals a prize winning combination, then the player may win a prize. Such lottery tickets also include a second play area in which the player may optionally risk the prize that is won in the first play area by removing the scratch-off layer from the second play area. If a prize enhancing symbol is present, then the value of a prize won in the first play area will be enhanced. On the other hand, if a prize reducing symbol is present, the value of the prize may be decreased or even eliminated.
While the attractiveness of a lottery ticket game to the purchasing public depends in part on the prize structure and the type of game being played, the success of the lottery system also depends on the ability of lottery sponsors to provide sufficient protection against counterfeiting and the like of lottery tickets (i.e. the ability to authenticate/validate that a ticket presented for claiming a prize is a proper ticket and the prizes claimed on the ticket are also proper).
In dual play area type lottery tickets described above, there is a concern that unscrupulous retail agents may manipulate the lottery system by fraudulent claiming of winning tickets. For example, the lottery ticket agent may perpetuate fraud on winning tickets in which a prize has been awarded in the first play area and the player has opted not to play the second play area. The retail agent may pay off the prize designated in the first play area and then remove the scratch-off layer in the second play area to see if a prize enhancing symbol is present. If so, the retail agent proceeds to collect the enhanced prize from the lottery sponsor. If the lottery sponsor requires the retail agent to turn in all tickets, then the retail agent will need to look below the scratch-off layer (e.g. by pinholing) to observe whether a prize enhancing symbol is present before removing the scratch-off layer.
In this type of lottery ticket, each of the first play area and the second play area are provided with identical authentication indicia which if read by an optical scanner can authenticate the ticket. However, the presence of the same indicia in the first and second play areas enables an unscrupulous retail agent to circumvent the system and obtain the benefit associated with tickets collected in which the player has not played the second play area and the second play area contains a prize enhancing symbol. This is because in part, the optical scanner does not effectively differentiate between lottery tickets in which only the first play area was played and lottery tickets in which both the first and second play areas were played.
It would therefore be a significant advance in the art of protecting such dual play area lottery game tickets from counterfeiting or misplaying if enhanced security can be provided in connection with the second play area.
It would be a further significant advance in the art if an authentication/validation system could be developed in which authentication/validation of a properly played second play area negates authentication/validation of the same ticket for the first play area.

Dual play area lottery game with enhanced authentication system


An ultrasound system and related method for forming 2D C-scan images and/or collecting 3D image data from 2D transducer arrays. The system including in part a 2D transducer array of elements, transmit voltage generation means for each element, a memory buffer with or part of channels for each element, and a receive beamformer. On a time serial or sequential basis, several times for each line of firing, the contents of the per element memory buffer are read into the beamformer with different focusing values for each buffer reading cycle. In this way, the beamformer can calculate beamformed image values for multiple points per line firing cycle—or per each line of signals between the transducer array and receive beamformer.

Ultrasonic imaging is widely used in many settings, including medical applications. Of particular importance is the use of ultrasound data in the study of tissue. Physicians may use acquired ultrasound data to assist guiding a catheter through a patient's body, or to non-invasively locate vessels prior to IV insertions. The insertion of needles may also be further complicated in some people whose veins are not readily apparent from the skin's surface, for example, in people with thick layers of fat or infants whose veins are small and difficult to detect. In other circumstances involving shock, arteries that need to be accessed to sample blood gasses shrink in response and thus become even more difficult to detect. For some situations, it may be necessary to surgically cut through the body in order to access the desired internal features, a process that is risky and may cause unnecessary delays to treatment.
A typical ultrasonic imaging system includes an array of transducers, a transmit beamformer, and a receive beamformer. The transmit beamformer supplies electrical waveform signals to the transducer arrays, which in turn produce associated ultrasonic signals. Structures in front of the transducer arrays scatter ultrasonic energy back to the transducers, which then generates receive electrical signals. The electrical receive signals are delayed for selected times specific to each transducer so that ultrasonic energy scattered from selected regions adds coherently, while ultrasonic energy from other regions does not. Array processing techniques for processing received signals in this way are known as beamforming and are well known to those in the field.
Current low cost ultrasound imaging devices are either mechanically scanned devices or one dimensional (1D) phased arrays, which are single rows of parallel elements spaced in the azimuthal direction. Each of these can produce a B-scan—an image 'slice' that is perpendicular to the face of the transducer and the skin's surface. Beamforming in one dimension can be realized through a relatively straightforward implementation using a linear array of sensors and a beamformiing processor that delays each sensor output by the appropriate amount, weights each sensor output by multiplying by the desired weighting factor, and sums the outputs of the multiplying operation.
While the B-scan can be swept through a volume of tissue and the user can, in principle, visualize the three-dimensional (3D) anatomy, such visualization requires significant training and experience. The C-scan, on the other hand, displays images parallel to the skin's surface, giving the impression of viewing the tissue of interest with the perspective of a clear 'window' through the skin. The two systems are illustrated in FIGS. 1(A)-(B) and 2, which respectively show conventional 2D B-Scan and 2D C-Scan operations. Referring to FIGS. 1(A)-(B), having a 1D array 5 in the B-Scan mode, each fired acoustic line 10 in the B-Scan mode results in a long sequence or 'line' of image data or points 11. However, referring to FIG. 2, in the C-Scan mode, only one image point 11 in the total sequence of points for each line 10 of firing is essentially obtained.
The C-Scan requires the use of a 2D array 6 processing a 3D volume of data. A beamforming processor becomes much more complex when a 2D sensor array is used. Not only does the number of time delay operations increase as the square of the size of the array, but also the physical structures required to connect each sensor to its corresponding delay becomes increasingly complex. The complexity is increased by the need for continuous operation. Conventional ultrasound systems have beamformers that continuously update beamformed received echo data so that images are displayed in "real time," or as the echo signals arrive. Since the speed of sound is slow, it becomes necessary for all imaging data along a particular beam line to be continuously formed for that line, and accordingly, it is generally not acceptable to form images with discrete, fixed receive beamforming (or focusing) parameters through multiple signal transmissions.
The vast majority of ultrasound phased arrays that have been researched and used in industry have been 1D transducer arrays. In recent years, there has been some growth in developments involving 1.5D arrays, which consists of a small number of elements (i.e., frequently less than 8) spaced in the elevation direction. Although work has been performed on 2D arrays, progress has generally proven to be extremely challenging. This results from a combination of fabrication difficulties with the transducers, particularly in the electrical connections, and the cost and bulk of the required beamforming hardware. While the hardware challenge diminishes with improvements in integrated circuits, it is evident that achieving a fully populated 2D array is very challenging.
In summary, there is great interest in producing high quality C-Scan images. However, multi-dimensional ultrasonic systems using the 2D arrays required to produce C-scan images are unrealistically high in implementation complexity, size and cost. Moreover, current multi-dimensional ultrasonic systems typically process full 3D volumes of image data. Lacking in particular is a system that efficiently realizes the unique simplifications possible for 2D C-Scans, for which only one plane of data is required for display, as opposed to a full 3D data set normally acquired using 2D transducer arrays. As illustrated, it is evident from the prior art exemplified in FIG. 2 that a significant portion of the time during acquisition in the C-Scan mode is wasted where the received signals make no contribution to the final image. Thus, the conventional multi-dimensional imaging system potentially wastes considerable processing power in producing C-Scan images, and can realize greater efficiency by appreciating that the final 2D image is limited in its cross sectional volume to a single plane of data.

Efficient ultrasound system for two-dimensional C-scan imaging and related method thereof

University of Virginia Patent Foundation


The present disclosure relates generally to a permanent magnet, brushless motor comprising a primary rotor having alternating magnetic poles around a circumference, a secondary rotor similar to the primary rotor. The primary rotor may be free to rotate by approximately plus or minus one pole of the secondary rotor. As such, when the two rotor components have opposite polarities aligned, the motor may be in a field weakened state. Generally, the field weakened state may be the normal state of the motor. As a significant load is encountered, the rotors may automatically transition to a non-weakened state wherein similar polarities are aligned on the rotors. A permanent magnet, brushless motor as described herein may be employed at a motor level or integrated into a linear actuator, wherein the rotor of the permanent magnet, brushless motor may include a hollow shaft.

Various industries, and particularly the manufacturing industry, among others, have utilized rotary motors and linear actuators to control movements of automated welding guns, automated clamping fixtures, and the like. For example, in the automotive industry, injection molding industry, and various other industries, actuation and control of welding guns and clamping fixtures and controlled linear movement of other fixtures and devices have been accomplished using fluid actuators, such as pneumatic or hydraulic actuators. While fluid actuators have functioned reasonably well for these purposes, they inherently embody various limitations. One, because of the possibility of leaks and failure of seals, etc., there is always the concern of contamination of the worksite by a leaking fluid. Second, fluid actuators necessarily require a source of pressurized fluid, and thus, a fluid supply system. This leads to significant maintenance and other costs. Third, limitations sometimes exist with respect to the accuracy and positioning of linear movement and the adjustability of such movement.
The use of permanent magnet, brushless motors is also well known. A permanent magnet, brushless motor is described in co-pending U.S. patent application Ser. No. 11/031,539, filed Jan. 7, 2005, entitled "Electric Actuator," and published as Publication No. 2005/0253469, the entirety of which is hereby incorporated by reference herein. The relationship between the rotation and torque of prior art permanent magnet, brushless motors is inversely proportional. That is, as the torque linearly decreases, the rotation speed, or number of rotations, increases.
In some prior art permanent magnet, brushless motors, a field weakening technique wherein the total magnetic flux is lowered to achieve high speed rotation has been employed. For example, a brushless motor that includes a field weakening technique is described in U.S. Pat. No. 5,821,710, issued to Masuzawa, et al. The brushless motor in Masuzawa includes two field permanent magnets having poles of different polarities alternately arranged in the direction of rotation, wherein one of the field permanent magnets is rotatable with respect to the other field permanent magnet. A mechanism for changing the phase of the magnetic poles of the field permanent magnets is provided to place the field permanent magnets out of phase as rotation increases. The mechanism uses arc-shaped governors held in a default, low rotation position using springs. The governors are forced into a high rotation position due to centrifugal force caused by the higher speed rotation. The high rotation position causes the field permanent magnets to be positioned out of phase, thus weakening the magnetic field.
Accordingly, there is a need in the art for improved apparatus and methods for a permanent magnet, brushless motor having field weakening capability which overcomes the deficiencies and limitations of the prior art. Particularly, there is a need in the art for apparatus and methods for a permanent magnet, brushless motor that may automatically transition from a field weakened position upon encountering a significant load.

Permanent magnet motor or actuator with field weakening capability


A fibrinolytic enzyme such as urokinase, tissue plasminogen activator or streptokinase is covalently bounded to a bioadaptable porous crystalline glass to produce a thrombolytic material. Production of the glass involves combining 40-50 mol% calcium oxide, 20-30 mol% titanium dioxide and 25-35 mol% diphosphorous pentoxide to form a mixture, and combining the mixture with 0.5-4.0 mol% disodium oxide. A bioreactor for converting plasminogen in blood into plasmin can be prepared by packing the material in a column. When finely comminuted, the material can be administered into the blood of a patient for removing blood clots.

1. Field of the Invention
This invention relates to a novel bioadaptable material capable of dissolving blood clots. More particularly, this invention relates to a bioadaptable material having a fibrinolytic enzyme such as urokinase or tissue plasminogen activator (hereinafter abbreviated as "TPA") immobilized on a bioadaptable porous crystallized glass. This material has the function of continuously converting plasminogen in blood into plasmin.
2. Description of the Prior Art
Blood clots are clots of blood which occur in blood vessels. When blood clots occur, they clog fine peripheral blood vessels in the human body and may cause paralysis of the hands and feet, cerebral infarct, and myocardial infarct.
The main component of blood clots is a scleroprotein called a "fibrin". This fibrin is known be decomposed by the enzyme plasmin. Plasmin is known to be present in the blood generally in the form of plasminogen, a precursor. The thrombolytic agents in popular use today include those which convert this plasminogen into plasmin and those which suppress coagulation of blood [Biochim. Biophys. Acta. Vol. 24 (1957), pp. 278-282 and Agric. Biol. Chem. 55 (5), 1,225-1,232 (1991)].
As substances which convert plasminogen into Plasmin, there can be mentioned fibrinolytic enzymes such as urokinase and TPA. Urokinase specifically acts on plasminogen, severing the alginin-valine bond thereof, and consequently converting the plasminogen into plasmin. In the past, urokinase was obtained by extraction from human urine. In recent years, however mass-production of the urokinase has been realized by the introduction of a method involving the culturing of urokinase-producing renal cells and a method of gene recombination.
TPA exhibits better ability to dissolve blood clots than urokinase because it converts plasminogen into Plasmin through union therewith and, at the same time, unites with fibrin thereby producing an environment allowing the plasmin to act easily with the fibrin. Since TPA occurs only in a very small amount in the uterus and blood vessel walls in human beings, studies have been actively pursued in search of a method for mass-production of TPA by gene recombination or cell culture. Such methods are now on the verge of being commercialized.
When a fibrinolytic enzyme such as urokinase or TPA is used as a thrombolytic agent to combat thrombosis, it is generally administered by direct injection into the patient's blood vessels. In this case, the disadvantage arises that the activity of converting plasminogen into plasmin is quickly deteriorated as by the fibrinolytic enzyme inhibiting factor in the blood and, at the same time, the plasmin activated by the fibrinolytic enzyme is quickly deprived of the thrombolytic activity by the action of the plasmin inhibiting agent in the blood.
Advances in biotechnology in recent years have led to the development of bioreactors whose elements comprise immobilized enzymes (enzymes immobilized on a carrier) and immobilized microorganisms (microorganisms immobilized on a carrier) and such bioreactors have come to be widely used in the production of useful substances, quality control in the process of production of amino acids, the analysis of foodstuffs, and clinical diagnosis.
Various methods have been proposed for the immobilization of enzymes. The carrier bonding method is one. This method accomplishes the deposition of a given enzyme by physically adsorbing the enzyme on a water-insoluble carrier [Biotechnology and Bioengineering, Vol. XXI, pp. 461 to 476 (1979), John Wiley & Sons Inc.], ion bonding and covalent bonding [Science, Vol. 166, pp. 615 to 617 (1969)]. Among these methods, the covalent bonding method is used for the broadest range of enzyme types.
As the water-insoluble carrier, inorganic porous substances are commonly used. When a fibrinolytic enzyme such as urokinase or TPA is bonded to a conventional inorganic porous substance, the porous substance may exude harmful ions through its surface or the fine surface texture of the porous substance may decay and allow the bound fibrinolytic enzyme to escape.
An object of this invention is to provide a bioadaptable material which maintains an enzymatic activity stably and efficiently for a long time and, on being administered into a patient's body of adsorbed on blood vessels, exhibits a thrombolytic activity, i.e. the function of continuously converting the plasminogen in the blood into plasmin.

Bioadaptable porous crystalline glass containing an immobilized fibrinolytic enzyme for dissolving blood clots

Agency of Industrial Science & Technology, Ministry of International Trade & Industry


In a wiring system provided by the present invention, a first conductive wire is provided on a surface on one side of an dielectric layer of a semiconductor device, a second conductive wire made of an Al like metal is provided on a surface on the other side of the dielectric layer, a connection hole is drilled through the dielectric layer, the first and second conductive wires are connected to each other through the connection hole, and a compensation pattern made of the Al like metal is created in the second conductive wire, so that generation of voids in the Al like metal of the second conductive wire due to an electro-migration phenomenon is prevented, enhancing the reliability of the wire.

In general, the present invention relates to a multilayer wiring structure of a semiconductor device. In particular, the present invention relates to aluminum like metal wiring for semiconductor devices.
With high integration of semiconductor devices, the dimension rule gets thinner and thinner and it becomes necessary to connect upper-layer wires to lower-layer wires wiring with a wiring material through via holes and contact holes with a high aspect ratio in a wiring process. The contact holes and via holes are referred to hereafter simply as connection holes, a generic name for both.
One of the technologies for creating wires embedded into the connection holes described above is the sputtering technique. In general, a technique of embedding a refractory metal to a connection hole by means of the CVD (the abbreviation of Chemical Vapor Deposition) method is adopted. The CVD method is an excellent chemical vapor phase growth method for getting a metal embedded into a connection hole with a high aspect ratio.
In the process technology, the chemical vapor phase growth method of a refractory metal is adopted. One of known processes is a selected CVD process which adopts a combination of a blanket CVD method and an etch-back method. With this technique, a so-called plug is created in a connection hole by getting a refractory metal embedded into the connection hole.
In addition, the so-called barrier metal layered structure is adopted. In the barrier metal layered structure, a conductive refractory metal or compound such as titanium (Ti), titanium nitride (TiN), titanium oxide-nitride (TiON) and titanium tungsten (TiW) is created on the upper-surface and lower-surface sides of the aluminum (Al) like wire. In the barrier metal layered structure, a redundancy effect prevents the entire wiring from being broken even if the Al like wire itself is broken.
On the other hand, there is a method by which an upper-layer wire material is embedded in a connection hole. To be more specific, an Al reflow technology has been developed for flowing the upper-layer wiring material into a connection hole through heat treatment during or after a process of growing an Al like metal film. It should be noted that, in some cases, the technique of flowing the upper-layer wiring material into a connection hole during the growing process is called a high-temperature sputtering method while the technique of flowing the upper-layer wiring material into a connection hole after the growing process is referred to as the Al reflow method. In the following description, none the less, both the techniques are referred to as the Al reflow method.
With the technology for getting an Al like metal embedded into a connection hole by means of the Al reflow method, the Al like metal is heated to a temperature higher than the recrystallization temperature of the Al like metal but lower than the fusing point of the Al like metal during or after the growing process in order to flow the Al like metal. It should be noted that the recrystallization temperature varies from compound to compound but it is normally higher than 350.degree. C. Then, the flowing Al like metal is directed to get embedded into the connection hole.
In a wiring structure wherein a plug is created from a refractory metal embedded in a connection hole by a CVD method, however, voids result due to an electromigration (EM) phenomenon.
This phenomenon is studied and reported in documents such as the Proceedings of the 30th IEEE International Reliability Physics Symposium, 1992, Pages 338 to 343 authored by Jiang Tao et al.
An example of the void generation is explained by referring to FIGS. 1 to 3. As shown in FIG. 1, lower-layer wires 111 and 112 made of an Al like metal and an upper-layer wire 113 also made of an Al like metal are connected to each other by plugs 117 and 118 made of a refractory metal created inside connection holes 115 and 116 which are created through an interlayer dielectric film 114 between the lower-layer wires 111 and 112 and the upper-layer wire 113. In such a wiring structure, a current flows for example from the lower-layer wire 112 to the upper-layer wire 113 through the plug 118 and then from the upper-layer wire 113 to the lower-layer wire 111 through the plug 117. In the figure, the paths of electrons e.sup.- are indicated by arrows. As shown in the figure, the electrons e.sup.- flow from the lower-layer wire 111 to the upper-layer wire 113 through the plug 117 and then from the upper-layer wire 113 to the lower-layer wire 112 through the plug 118. Since the electrons e.sup.- flow through the plugs 117 and 118, EM (electromigration) phenomena occur therein. Accordingly, Al migrates from the upper-layer wire 113 in contact with the plug 117 and the lower-layer wire 112 in contact with the plug 118. For this reason, the amounts of Al at those portions become insufficient, resulting in voids 121 and 122 therein. As a result, the upper-layer and lower-layer wires 113 and 112 are broken, causing reliability to deteriorate.
On the other hand, voids also result from an EM phenomenon even in a barrier metal layered structure.
The generation of such voids is explained as follows. As shown in FIG. 2, main portions of lower-layer wires 111 and 112 are made of an Al like metal 131 whereas a main portion of an upper-layer wire 113 is made of an Al like metal 132. The lower-layer wires 111 and 112 and the upper-layer wire 113 are connected to each other by plugs 117 and 118 made of a refractory metal created inside connection holes 115 and 116 which are created through an interlayer dielectric film 114 between the lower-layer wires 111 and 112 and the upper-layer wire 113. Barrier metal layers 133 and 134 each made of a refractory metal or a compound are created on the upper surfaces of the lower-layer wires 111 and 112 respectively. On the other hand, a barrier metal layer 135 made of a refractory metal or a compound is created on the lower surface of the upper-layer wires 113. In this barrier metal layered structure, a wire is not broken easily due to an EM phenomenon in comparison with the wiring structure shown in FIG. 1. None the less, a current flows through the Al like metals 131 and 132 which each have a low resistance.
For example, a current flows from the lower-layer wire 112 to the upper-layer wire 113 through the plug 118 and then from the upper-layer wire 113 to the lower-layer wire 111 through the plug 117. In this case, electrons e.sup.- flow from the lower-layer wire 111 to the upper-layer wire 113 through the plug 117 and then from the upper-layer wire 113 to the lower-layer wire 112 through the plug 118. Such a current causes EM deterioration to occur at the upper-layer wire 113 in contact with the plug 117 and the lower-layer 112 in contact with the plug 118, resulting in voids 123 and 124 therein. As a result, reliability deteriorates.
In addition, in a wiring structure wherein an Al like metal is embedded into a connection hole by using the Al reflow technique, voids are also generated as well due to an EM phenomenon.
The generation of voids in a wiring structure built by means of the Al reflow technique is explained by referring to FIG. 3. As shown in the figure, lower-layer wires 111 and 112 made of an Al like metal and an upper-layer wire 113 also made of an Al like metal are connected to each other by connection holes 115 and 116 which are created through an interlayer dielectric film 114 between the lower-layer wires 111 and 112 and the upper-layer wire 113. In addition, in order to improve the wettability between the upper-layer wire 113 and the underlying interlayer dielectric film 114 as well as to enhance the EM-proof characteristic and the endurance characteristic against stress induced voiding of the upper-layer wire 113, an adhesion layer (including a barrier metal) 141 is normally created beneath the upper-layer wire 113. Typically, the adhesion layer is made of titanium (Ti) or titanium nitride (TiN). Much like the configuration shown in FIG. 8, for example, a current flows from the lower-layer wire 112 to the lower-layer wire 111 through the upper-layer wire 113. In such a case, EM deterioration occurs at the upper-layer wire 113 inside the connection hole 115 and at the lower-layer wire 112 beneath the connection hole 116, resulting in voids 125 and 126 therein. As a result, reliability deteriorates.
In general, an EM phenomenon occurs when electrons collide with metal atoms, in this case, Al atoms, causing the atoms to migrate due to an electron wind force (or electrons' colliding force). If EM phenomena occur uniformly over the entire wiring structure, the atom concentration in the wiring structure itself does not change, generating no voids therein. In actuality, however, a portion in which EM phenomena do not occur uniformly exists in the wiring structure.
In a portion in which there is a biggest difference in the number of migrating atoms, that is, in a portion in which the number of departing atoms is largest in comparison with the number of incoming atoms, a failure can be said to occur due to an EM phenomenon.
In each of the connection holes shown in FIGS. 1 to 3, more than one types of metals each with a high fusing point other than the Al like metal or a compound of such metals exist, being crossed by the current path. Thus, a boundary surface, where electrons flow out from the metals with a high fusing point or a compound of such metals to the Al like metal layer, has a most insufficient number of Al atoms. As a result, an EM failure occurs therein.
FIGS. 4-1 to 4-4 show Al-atom flows caused by an EM phenomenon. As shown in FIG. 4-1, an atomic current flows for example in a direction indicated by an arrow. As shown in FIG. 4-2, a portion with an insufficient number of Al atoms is depletion. A depletion region is caused by migration of atoms from the depletion region to a destination called an accumulation region, resulting in a difference in Al-atom concentration between the Al like metals at the depletion and accumulation regions. The difference in Al-atom concentration in turn gives rise to a stress gradient as is shown in FIG. 4-3. For this reason, a force works to push back Al atoms in the reverse direction from the accumulation region with an excess amount of Al metal to the depletion region with an insufficient amount of Al metal. The stress gradient induces an atomic current in the reverse direction as shown in FIG. 4-4. The flow of Al atoms in the reverse direction is normally called a back flow. Thus, the final EM phenomenon must be considered to be attributed to a net atomic current which is equal in quantity to the difference between the atomic flow caused by the force of the electron wind (that is, the colliding force of electrons) and the back flow.
FIG. 5-1 is a diagram roughly showing a cross section of a wiring structure whereas FIG. 5-2 is a rough layout diagram thereof. On a boundary surface between an Al like metal 211 and a refractory metal 213 above a connection hole 213, a stress gradient which is developed toward a region in the Al like metal 211 with an insufficient number of Al atoms exits in an area outside the current path. It should be noted that electrons e.sub.- flow in a direction opposite to that of the current. As a result, Al atoms are supplied to the region with an insufficient number of Al atoms from all the surroundings of the portion due to this stress gradient. In addition, the area of the Al like metal 211 outside the current path, in which this stress gradient is developed, has only a length of the order of w1, an aligment margin for the exposure apparatus. Accordingly, a void 214 is observed in the Al like metal 211 during examination of the surroundings of the connection hole after an EM test.

Aluminum like metal wiring for semiconductor devices


A pivot apparatus adapted to connect a host and a display includes a rotary base having a first part and a second part, a connecting plate, a pivot component, a first connecting rod and a hook. The first part is embedded at the host. The second part has a rotary shaft embedded at a first edge of the connecting plate. The pivot component is pivotally connected between a rear surface of the display and a second edge of the connecting plate. The first connecting rod is slidably disposed at the connecting plate and has at least a locking hole. The hook is disposed at the rear surface and passes through the connecting plate to be slidably disposed in the locking hole. The hook is used to interfere with the first connecting rod to restrict the rotation of the display by the pivot component relative to the connecting plate.

1. Field of the Invention
The invention relates to an electronic device and a pivot apparatus thereof and, more particularly, to a foldable electronic device and the pivot apparatus thereof.
2. Description of the Related Art
In the information age nowadays, the dependency of people on electronic products increases day by day. Since the electronic devices nowadays are required to have advantages such as high speed, high efficiency and being light, thin, short and small, foldable electronic devices such as a notebook computer, a portable phone, a personal digital assistant (PDA) and so on gradually become the main stream. These foldable electronic devices become necessary tools in people's daily life.
Generally, the foldable electronic devices are foldable to reduce the accommodating space and to achieve the objective of being light, thin, short and small. Generally, the foldable electronic device is usually composed of a display and a host. In addition, a pivot apparatus is connected at the edges of the display and the host to allow the user to open or close the foldable electronic device by rotating the display and the host about the pivot apparatus.

Foldable electronic device and pivot apparatus thereof


The present disclosure provides an attachment device comprising a first subassembly, comprising a mounting component, a retainer component, coupled to a second subassembly comprising a first rotatable component, a second rotatable component, and a trigger assembly. The mounting component comprises an opening defining at least one slot. The retainer component is coupled to the mounting component defining a first cavity. The spring component, housed in the first cavity, is coupled to the retainer component. The first rotatable component is coupled to the second rotatable component to define a second cavity extending from a first surface of the first rotatable component to a second surface of the second rotatable component. A trigger actuator of the trigger assembly is housed in the second cavity. The first rotatable component defines at least one tab defined to be received within the at least one slot of the mounting component.

Wearable electronic devices such as, ring scanners, are typically used in warehouse and logistics environments to scan one-dimensional (1D) or two-dimensional (2D) machine-readable symbols such as barcodes, Data Matrix, etc. Such ring scanners are typically worn on a user's finger. To operate the ring scanner, the user aims the finger attached to the ring scanner towards the intended symbol and actuates the ring scanner by depressing a trigger button provided on the ring scanner with the user's thumb.


The disclosed systems and method provide for an audio playback device to form a Bluetooth connection with an audio source device based on audio generated by an acoustic transducer. The audio is encoded with Bluetooth connectivity data corresponding to the audio source device. The acoustic transducer can be arranged on the audio source device, or it can be arranged on an audio playback device connected to the audio source device via a Bluetooth connection. The audio is received by a microphone of an audio playback device. The audio playback device then extracts the Bluetooth connectivity information from the audio, and forms a Bluetooth connection with the audio source device. If the Bluetooth connection is a Broadcast Audio stream, as defined by the LE Audio standard, multiple audio playback devices can be able to connect audio source device, allowing for a communal listening experience.

Aspects and implementations of the present disclosure are generally directed to audio-based near field communication, particularly in relation to communication via Bluetooth.
Bluetooth connections require the exchange of connectivity information between devices. The connectivity information can include pairing information. Pairing is the process of establishing a secure connection between two Bluetooth-enabled devices. Pairing information includes a key and information to identify one of the devices for future connections. Currently, connectivity information is most often conveyed over the Bluetooth frequency band of 2.4 GHz. In some other cases, connectivity information can be shared over the near field communication (NFC) band of 13.56 MHz when the devices are within 4 cm of each other. However, in certain circumstances, it may be advantageous to exchange the connectivity information via other means.
Further, as Bluetooth-enabled playback devices become more ubiquitous, there may be a desire for communal listening experiences between multiple users. For example, a couple watching a video on a tablet computer on public transportation may wish to communally listen to the audio via their individual earbuds or headsets to avoid disturbing the other riders. In another example, a sports bar showing different sporting events on different television sets may wish to allow its patrons to listen to the audio of the television sets via their individual Bluetooth-enabled playback devices. While it may be possible to exchange connectivity information between these devices via NFC, there are instances where the use of NFC is inconvenient or impractical. Accordingly, there is a need for a system for conveniently sharing Bluetooth connectivity information to enable communal listening experiences.


A semiconductor device comprising a substrate having a well region, at least one well pickup region formed on the substrate to surround the well pickup region, a first drain region formed on the substrate to be positioned on one side of the source region, and a first gate electrode formed on the substrate to be positioned between the source region and the first drain region.

In general, a memory device is divided into a p-type transistor and an n-type transistor. Further, memory devices usually comprise poles, commonly referred to as: a source region, a drain region, a gate electrode, and a substrate.
Among the four poles, the substrate includes a structure that is commonly called a well. Wells are generally characterized by a lower concentration of impurities than that of the source and drain regions, e.g., by about 1/10000 or 1/100000. In addition, substrates generally have two types of wells, namely, an n-type well and a p-type well.
Wells are located in a well-region. Within the well region, a well pickup region is formed to stabilize the potential of the well region.
FIG. 1 illustrates a conventional semiconductor device, having a substrate 100 and a well region 105. Well region 105 further comprises a first drain region 102a, a source region 103, and a second drain region 102b; a first gate electrode 101a positioned between the first drain region 102a and the source region 103; a second gate electrode 101b positioned between the second drain region 102b and the source region 103. First gate electrode 101a and second gate electrode 101b are connected via a gate electrode connector 101c. Well region 105 also typically comprises a well pickup region 104.
The first and second gate electrodes 101a and 101b, the source region 103, the first and second drain regions 102a and 102b, and the well pickup region 104 are electrically connected to external wiring lines (not shown), respectively, through contact metals 111, 113, 112a, 112b, and 114.
In the conventional semiconductor device, the well pickup region 104 is formed at the edge of the substrate 100, which results in an increase of the size of the device.

Semiconductor device and method of fabricating the same


A method for machining and finishing a metallic member to provide a finished product without any additional process uses a lathe and a milling process. A non-circular metallic member on a worktable is rotated, and lathe tool moved backwards and forwards to machine the peripheral top portion of the metallic member. The path of the lathe tool machines curved surfaces of the top portion of the metallic member. The rotation of the metallic member is then stopped, and a milling cutter is brought to meet the peripheral sidewall of the metallic member. The movement and feeding of the milling cutter is predetermined. The worktable rotates the metallic member to enable one end edge of the peripheral sidewall and then another to face the milling cutter, and have the end edge chamfered by the milling cutter.

1. Technical Field
The present disclosure generally relates to methods for machining a metallic member, and particularly, to a method for machining member using lathing and milling.
2. Description of the Related Art
An electronic device such as a tabletop computer or a mobile phone may have a housing made of metal. The metallic housing includes a top portion and a peripheral sidewall extending from a peripheral edge of the top portion. The top portion has a greater surface area than that of the peripheral sidewall and has a non-circular flat surface or non-circular curved surface. The peripheral sidewall has four side surfaces arranged in order and adjacent two side surface connected by corners. In related manufacturing fields, if a milling process is employed to machine the metallic housing, some tracks occur on the top portion that has been a milled because of intermittent contact and interrupted milling by the milling cutter. Then a polishing process needs to be applied for a better appearance, thus the efficiency of the milling process is reduced. If a lathe process is adopted to machine the metallic member, it is difficult to machine a surface which is not circular. The lathe is not suitable to machine the peripheral sidewalls because of the four corners of the peripheral sidewall. Thus a number of additional machining processes must be added to machine the metallic housing.
Therefore, there is room for improvement within the art.

Method for machining metallic member using lathing and milling

FU DING ELECTRONICAL TECHNOLOGY (JIASHAN) CO., LTD.