When a change of an output signal is detected by an output-signal-state-change detector, a continuous-change performing part controls an output impedance changing part, which is provided between an output buffer and a signal line, so as to continuously change an output impedance from low impedance to high impedance, at the changing timing of the output signal.

1. Field of the Invention
The present invention relates to a signal output circuit for outputting signals to the transmission line, especially to a signal output system by which, for instance, a waveform distortion on the signal line caused by a high-speed signaling can be suppressed.
2. Description of the Related Arts
FIG. 17 shows the semiconductor integrated circuit with output impedance self correction circuit disclosed in Unexamined Japanese Patent Publication No. 10-261948.
In the semiconductor integrated circuit with output impedance self correction circuit of FIG. 17, an internal circuit 105 of a semiconductor integrated circuit 107 is connected to an output circuit 101, and an output terminal 102 is connected to a receiving circuit 108 via a transmission line 109 having an impedance, such as a cable or a print wiring board. According to this conventional art, the input to the receiving circuit 108 needs no termination process, and the input impedance is supposed to be infinite.
The initial state of the output circuit 101, in this conventional art, is set to have the maximum output impedance, meaning the minimum drive ability, at the time just after the power-on of the semiconductor integrated circuit 107. Then, the output impedance is going to be sequentially adjusted.
The internal circuit 105 transmits a test pattern signal to the output circuit 101 in order that the output terminal 102 may repeatedly output a signal of low level and a signal of high level, meaning Low levelxe2x86x92High levelxe2x86x92Low levelxe2x86x92High level.
When the output signal begins the transition from Low level to High level, an initial amplitude voltage output from the output circuit 101 is detected at a specific sampling timing by using an output voltage detecting circuit 103. Then, until the detected initial amplitude voltage is found to be around the half of the maximum output amplitude value, meaning until the output impedance is found to be equal to the impedance of the transmission line 109, the sampling test is repeated by way of changing the output impedance of the output circuit 101, at an impedance control signal generating circuit 101.
The value of the output impedance at the time of becoming equal to that of the transmission line 109 is stored in the impedance control signal generating circuit 104. Then, when a signal is output from the output circuit 101, the output impedance of the output circuit 101 is controlled to be the above value.
FIG. 18 shows signal waveforms according to the above conventional art. An output-terminal-waveform 110 indicates a signal waveform at the output terminal 102 of FIG. 17. A receiving-circuit-input-waveform 111 indicates a signal waveform at the input terminal (not shown) of the receiving circuit 108.
Though an output signal from the output terminal 101 is reflected at the receiving circuit 108, the output signal is not re-reflected at the output terminal 102 because the output impedance of the: output circuit 101 is matched with the characteristic impedance of the transmission line 109. Consequently, useless ringing is not generated.
The followings are problems of the conventional signal output system, resulted from the above-stated configuration.
FIG. 19 shows a general bus line. Each of devices No. 2 through No. 5, that is 202 through 205, is connected to a bus line 207 via a branch line 208. Each of the bus lines 207 and the branch lines 208 has the characteristic impedance of 50xcexa9 and the length of 5 cm.
In FIG. 19, when the above buffer is applied to each of the devices, the output impedance is automatically adjusted to be around 50xcexa9. FIG. 20 shows a simulation result of input waveforms of the No. 2 device 202 and the No. 6 device 206, simulated by using a circuit simulator (SPICE), in the case of the No. 1 device 201 outputting signals which are periodically varied in the toggling state in 200 MHz (5 nsec) cycle. In FIG. 20, the waveform in a solid line denotes the input waveform to the No. 2 device 202 and the waveform in a broken line denotes the input waveform to the No. 6 device 206. A signal at the device, such as No. 2 device 202, closer connected to the output driver (in this case, No. 1 device 201) rises later than other devices far connected to the output terminal, because of the reflection effect. In FIG. 20 case, only about 700 psec is kept as a time for performing the setup.
Consequently, the above defect based on the conventional art principle as shown in FIG. 17 makes the high-speed transmission difficult and enormously restricts the degree of freedom of circuit design.
In view of the foregoing, it is one of objects of the present invention to provide a signal output system in which a wave distortion generated in the high-speed signal transmission is suppressed and the bus operation speed is enhanced, by way of dynamically controlling an output impedance at the beginning of a signal transmission in order to change the output impedance to high from low.
It is another object of the present invention to provide a signal output system in which an output current is suppressed by changing the output impedance from low to high at the beginning of a signal transmission.
It is another object of the present invention to provide a signal output system in which the degree of freedom of circuit design is not restricted because, as stated above, a wave distortion generated in the high-speed signal transmission can be suppressed.
According to one aspect of the present invention, a digital signal output circuit for outputting an output signal to a signal line via an output buffer comprises
an output impedance changing part, connected between the output buffer and the signal line, for changing an output impedance,
an output-signal-state-change detector for detecting a change of the output signal, and
a continuous-change performing part for controlling the output impedance changing part, at a changing timing of the output signal, so as to continuously change the output impedance, when the output-signal-state-change detector detects the change of the output signal.
According to another aspect of the present invention, in the digital signal output circuit, the continuous-change performing part controls the output impedance changing part, at the changing timing of the output signal, so as to continuously change the output impedance from low to high, when the output-signal-state-change detector detects the change of the output signal.
The above and other objects, features, and advantages of the invention will be more apparent from the following description when taken in connection with the accompanying drawings.


A method and apparatus is provided for a voltage translator for performing a voltage-level translation of a signal. The voltage translator of the present invention includes a first transistor that is coupled to a control signal. The control signal is in a first voltage range. The voltage translator also includes a first one-shot circuit driven by the first transistor. The first one-shot circuit is capable of providing a pulse. The voltage translator also includes a second transistor capable of receiving a complementary signal of the control signal. A first pair and a second pair of transistors are included in the voltage translator. Each pair of transistors is operatively coupled to the first and second transistors. The first and second pairs of transistors are adapted to provide a transition of a signal from a first voltage range to a second voltage range.

1. Field of the Invention
This invention relates generally to an electronic device, and, more specifically, to providing a voltage translator for transitioning from a first voltage level to a second voltage level.
2. Description of the Related Art
Modern integrated circuit devices are comprised of millions of semiconductor devices, e.g., transistors, formed above a semiconductor substrate, such as silicon. These devices are very densely packed, i.e., there is little space between them. Similarly, densely packed electrically conducting lines may also be formed in the semiconductor substrate. By forming selected electrical connections between selected semiconductor devices and selected conducting lines, circuits capable of performing complex functions may be created. For example, bits of data may be stored by providing electrical current to a plurality of bit lines and an orthogonal plurality of wordlines that may be electrically coupled to one or more capacitors in a semiconductor memory.
The semiconductor memory may be a dynamic random access memory, a flash memory, and the like. The semiconductor memory typically comprises an array of memory cells, address decoding circuitry for selecting one, or a group, of the memory cells for reading or writing data, sensing circuitry for detecting the digital state of the selected memory cell or memory cells, and input/output lines to receive the sensed data and convey that information for eventual output from the semiconductor memory. In many cases, the array of memory cells will be sub-divided into several sub-arrays, or subsets, of the complete collection of memory cells. For example, a semiconductor memory having 16 megabits (224 bits) of storage capacity, may be divided into 64 sub-arrays, each having 256K (218) memory cells.
In electronic devices today, many integrated circuit chips use designs that are used to promote savings and power consumption. This is particularly true for mobile and wireless type devices. Many times, devices, such as microprocessors, memories, and other integrated circuit chips are designed to operate at lower operating voltages. Often, more than one operating voltage may be implemented into a single integrated circuit chip. There are various portions of a circuit that are implemented into an integrated circuit chip that, for various reasons, operate at different voltage levels. These reasons may include operating speed, type of devices being used in the circuit, efficient switching voltages, and the like.
In order to provide efficient operation of a device, such as an integrated circuit chip, a transition between various operating voltage modes is desirable. For example, operation from the operating range of VCC to ground may be modified for operation from VCC to VBB, wherein VBB may be a voltage level that is above or below ground. Therefore, efficient switching to and from VCC -ground operating levels to VCC−VBB is desirable. State-of-the-art designs implement a switching between various voltage levels, however, many inefficiencies may result, including current leakage and slow transitions in the designs of today.
In order to translate operating voltages, designers have implemented inverters that translate an operating voltage from VCC to ground to a second inverter that translates from VCC to VBB. However, this proves to be problematic since it is difficult to completely shut off the second inverter stage since the voltage generally does not fall all the way to ground. In other words, with two inverters, one inverter has a negative node tied to ground, and when the input of that inverter goes to logic high, the output will go to ground. However, when the second input to the second inverter goes to VBB there is a leakage current since a positive voltage on the second inverter exists. To overcome this problem, designers have moved towards a translator type design that translates voltage levels.
Turning now to FIG. 1, a typical prior art circuit for implementing the switching of supply voltage levels is illustrated. FIG. 1 illustrates a prior art voltage level translator 100 for translating a voltage level from VCC to VSS (ground) to VCC to VBB. Upon assertion of the negative true logic signal IN on a line 105, a P-channel transistor 110, whose source is coupled to VCC on the line 103, is activated. Upon the assertion of IN (i.e., a transition from high to low of the signal IN on the line 105), a line 107 coupled to the drain of the transistor 110 is transitioned to a level of VCC. The complementary signal of IN, which is INB on a line 115, is sent to another P-channel transistor 120 whose source is coupled to VCC on a line 123. Upon the assertion of IN, the signal INB on the line 115 transitions to logic-high, therefore, the drain of transistor 120, which is coupled to a signal OUT on a line 135, is disconnected from VCC. The complementary signal to OUT on the line 135 is a signal OUTB on a line 125, which is the inverse of OUT.
The transition of the signal OUTB on the line 125, which is also coupled to a drain of an N-channel transistor 140, whose source is coupled to VBB via a line 145. Therefore, the N-channel transistor 140 will be turned off. At the same time, the complementary signal OUTB on the line 125 is also coupled to a gate 153 of a second N-channel transistor 150, whose source is coupled to VBB via a line 155. Therefore, during this time, when the complementary signal OUTB on the line 125 is high, the N-channel transistor 150 is turned on. When the N-channel transistor 150 is turned on, a connection to VBB to OUT on the line 135 is established. Therefore, an operating voltage level of VCC to VBB is established upon the assertion of IN on the line 105.
Currently, in order to implement the prior art voltage level translator 100, P-channel devices used in such circuits are usually substantially large. Therefore, there are transition delays due to these types of P-channel devices, which cause the transition from VCC to ground to VCC−VBB to be inefficient. Another problem is that when the voltage level translator 100 receives an input that goes to logic low (on the line 105), and the OUTB on the line 125 goes to logic high, this transition occurs in a substantially fast manner. However, the opposite state, where the output OUT on the line 135 transitions from logic low to a logic high state, there is a delay in the pull down because N-channel transistors are relatively weak compared to the typical P-channel transistors that are used. One of the reasons that the N-channels in the circuit are smaller is because the voltage level translator 100 may not properly switch if they are made of a similar size as the P-channel transistors. This could create a problem when the nodes of the output OUT, on the line 135 and OUTB on line 125 transition to a low state, and since transitioning to a low state is a very slow transition, the transition may occur fast enough to regain its voltage level back up to the level of VBB. Therefore, the transition going to VBB becomes too slow. This runs contrary to the motivation of switching from VCC to a VBB mode, therefore, a relatively fast switching is needed for proper voltage level transition for efficient operation of the circuitry supported by the voltage level translator 100.
These transition problems are exacerbated by the more recent drive to reduce the operating voltage level of VCC. Designers are generally pushing for lower and lower VCC levels, which causes even further delays in the transitions described above. This is true because if the P-channel transistors get weaker because VCC gets smaller, then there is very little gate-source voltage so the P-channels transistors have to make a bigger drive to make a proper transition. As the transition of the transistor moves from logic low to logic high, there is a drive that is pulling the transistor down, therefore, the transition is not properly made often, causing excessive current consumption. The industry generally lacks an efficient method and apparatus for translating efficiently from a voltage level of VCC to VSS to a voltage level of VCC to VBB.
The present invention is directed to overcoming, or at least reducing, the effects of, one or more of the problems set forth above.

Voltage translator for multiple voltage operations


A method and system for debug and test using replicated logic is described. A representation of a circuit is compiled. The circuit includes a replicated portion and delay logic to delay inputs into the replicated portion. The circuit may also include trigger logic and clock control logic to enable execution of the replicated portion of the circuit to be paused when a trigger condition occurs. The compiled representation of the circuit may be programmed into a hardware device. A debugger may then be invoked. One or more triggering signals are selected. For each selected triggering signal, one or more states are selected to setup a trigger condition. The hardware device may then be run. The replicated portion of the circuit will be paused when the trigger condition occurs. The states of registers in the replicated portion of the circuit and the sequence of inputs that led to the trigger condition are recorded. This recorded data may then used to generate a test to be run on a software simulator when the circuit is modified.

For the design of digital circuits, designers often employ computer aided techniques. Standard languages, such as Hardware Description Languages (HDLs), have been developed to describe digital circuits to aid in the design and simulation of complex digital circuits. As device technology continues to advance, various product design tools have been developed to adapt HDLs for use with newer devices and design styles.
After the HDL code is written and compiled, the design of an integrated circuit (IC) or a system which includes multiple ICs must be verified to be correct. Continually advancing processing technology and the corresponding explosion in design size and complexity have led to verification problems for complex circuit designs, such as Application Specific Integrated Circuits (ASICs) that are difficult to solve using traditional simulation tools and techniques.
As a result, some designers build prototype boards using multiple ICs such as field programmable gate arrays (FPGAs) to verify their ASIC designs. However, there are still problems with debugging the hardware design. When an error is detected during debug, designers may attempt to tap signals of interest from the circuit and use a logic analyzer to determine the cause of the error. However, this is a difficult process and is often not effective, especially in the case of intermittent errors. Errors that have already occurred are often difficult to repeat and reconstruct.

This patent is subject to a terminal disclaimer.

Method and system for debug and test using replicated logic


An ignition control apparatus for an internal combustion engine of the present invention has a switching circuit and a control circuit. The switching circuit includes a first switch controlling a main current constituting the most portion of the coil current, a second switch controlling a sensing current constituting the coil current together with the main current; and a temperature sensor detecting temperatures of the first and the second switches, which are realized by semiconductors. The control circuit, which is heat-isolated from the switching circuit, includes a current limiting circuit operating the first switch and the second switch to adjust the coil current to a predetermined value based on the sensing current, and a thermal shutoff circuit turning off both the first switch and the second switch when the temperature detected by the temperature sensor exceeds a predetermined threshold value.

Some kind of ignition apparatus has IGBT (insulated gate bipolar transistor), which is a switching semiconductor, therein to control a current through an ignition coil connected with a spark plug. A short circuit or a contact of a wiring for controlling the IGBT with a power supply wiring makes control signal sent from an ECU (electrical control unit) continue for a long period of time to keep turning on the IGBT. In this case, the IGBT generates much heat, so as to break itself, that is, to cause a short circuit between the collector and the emitter thereof. Then, the IGBT flows a current continuously through a primary winding of the ignition coil, so that the ignition coil overheats to break itself.
U.S. Pat. No. 5,664,550B (JP3216972B) discloses an apparatus comprising an IGBT, a control circuit generating a control signal for the IGBT and a heat detection circuit, which detects a predetermined high level of heat generation at the IGBT. When the heat detection circuit detects the predetermined high level of heat, the detection circuit turns off the IGBT automatically. When a temperature of the IGBT falls down to the predetermined level again, a latch circuit continues to keep the control signal turned off to prevent the current through the IGBT from flowing without sufficient fall of the temperature in the IGBT. The IGBT keeps turned off until the control circuit determines to turn on the IGBT again.
Further, in the above apparatus, another IGBT takes out a little portion of the current through the ignition coil to detect the current value through the IGBT controlling the current through the ignition coil. Then a current limiting circuit controls a gate voltage of the IGBTs based on the current value. Thus, the current through the ignition coil settles at a predetermined level.
However, sometimes the heat generation at the ignition coil precedes the heat generation at the IGBTs due to high ambient temperatures and large resistance of the primary winding of the ignition coil is relatively large. In this case, the heat generation increases the resistance of the coil, so that the current is determined not by the current limiting circuit but by the resistance of the coil. Thus, the IGBTs operate in a saturation region, and the heat generation at the IGBTs is relatively small, without making the temperature of the die locating the IGBTs high. Accordingly, the heat detection circuit fails to turn off the IGBTs, so that the current keeps flowing through the ignition coil, and the ignition coil breaks by the heat generation thereof.

Ignition control apparatus for internal combustion engine


Disclosed are anti-sickling human hemoglobins for use as sickle cell anemia therapeutics.

This invention relates to recombinant anti-sickling hemoglobins suitable for use as therapeutics for the treatment of sickle cell anemia.
The gene that encodes hemoglobin S (the defect leading to sickle cell anemia) is inherited as an autosomal trait and occurs in the heterozygous condition as the sickle trait in 8-10% of black persons in the Unites States. Two major clinical features characterize sickle cell anemia: (1) chronic hemolysis that is stable and only moderately debilitating, and (2) acute, episodic vaso-occlusive crises that cause organ failure and account for most of the mortality and morbidity associated with the disease.
The molecular basis for sickle cell disease is an A to T transversion in the 6th codon of the human .beta.-globin gene. This simple transversion changes a polar glutamic acid residue to a non-polar valine (Ingram et al., Nature 178:792, 1956; Ingram et al., Nature 180:326, 1957) in the .beta.-globin polypeptide and, thus, drastically decreases the solubility of this hemoglobin (termed Hb S). When the intracellular concentration of Hb S is high and the partial pressure of oxygen is low in the capillary beds, the non-polar valine, which is on the surface of the hemoglobin molecule, interacts with two other non-polar residues on the surface of a second hemoglobin molecule, and initiates aggregation (Padlan et al., J. Biol. Chem. 260:8280-8291, 1985; Wishner et al., J. Mol. Biol. 98:179-194, 1975). Once approximately 10 hemoglobin monomers interact, long polymers rapidly accumulate, and complex 14-stranded fibers are formed (Crepeau et al., Nature 274:616-617, 1978; Dykes et al., J. Mol. Biol. 130:451-472, 1979; Eaton et al., Blood 70:1245-1266, 1987; Hofrichter et al., Proc. Natl. Acad. Sci USA 71:4864-4868, 1974). The formation of these fibers reduces the flexibility of red blood cells and leads to the occlusion of small capillaries. Intracellular fiber formation also results in erythrocyte membrane damage and increased red cell lysis (Noguchi et al., Blood 58:1057, 1981; Brittenham et al., Blood 65:183, 1985). The ensuing disease is characterized by a chronic hemolytic anemia with episodes of severe pain, and tissue damage that can result in stroke, kidney failure, heart disease, infection, and other complications (Bunn et al., Hemoglobin: Molecular, Genetic, and Clinical Aspects. (W. B. Saunders, Philadelphia, 1986)).


A LOG-type liquid crystal display device includes a picture display area having liquid crystal cells arranged at crossings of gate lines and data lines, gate driver integrated circuits for driving the gate lines are mounted on gate tape carrier packages, data driver integrated circuits for driving the data lines are mounted on data tape carrier packages, line-on-glass type signal lines arranged at an outer portion of the picture display area for applying driving signals to the gate drive integrated circuits. A voltage difference compensating means is connected to each of the gate driver integrated circuits to compensate for voltage differences between the driving signals according to line resistance differences between the line-on-glass type signal lines.

1. Field of the Invention
The present invention relates to liquid crystal displays, and more particularly to line-on-glass (LOG)-type liquid crystal displays capable of compensating for signal voltage differences between gate driver integrated circuits due to intrinsic line resistances of LOG-type patterns on liquid crystal display panels.
2. Description of the Related Art
Generally, liquid crystal displays (LCDs) use an electric field to control light transmittance characteristics of liquid crystal material. Accordingly, LCDs typically include a liquid crystal display panel having a plurality of liquid crystal cells arranged in a matrix pattern and a driving circuit for driving the liquid crystal cells to display a picture on the liquid crystal display panel.
The liquid crystal cells are arranged on the liquid crystal display panel at locations where gate lines are found to cross data lines. Electric fields may be applied to the liquid crystal material by pixel and common electrodes arranged in the liquid crystal display panel. Each pixel electrode is connected to any one of data lines via source and drain electrodes of switching devices such as thin film transistors. Gate electrodes of each thin film transistor are connected to corresponding gate lines, thereby allowing pixel voltage signals to be applied to each of the pixel electrodes of each gate line.
The driving circuit includes a gate driver for driving the gate lines, a data driver for driving the data lines, a timing controller for controlling the gate and data drivers, and a power supply for supplying driving voltages used in driving the LCD. The timing controller controls the gate and data drivers by controlling a driving timing of the gate and data drivers and applying pixel data signals to the data driver. Driving voltages generated by the power supply include common (Vcom), gate high (Vgh), gate low (Vgl) voltages, etc. The gate driver sequentially applies scanning signals to the gate lines, thereby sequentially driving the liquid crystal cells on the liquid crystal display panel one gate line at a time. The data driver applies data voltage signals to each of the data lines whenever a gate line receives a gate signal. Accordingly, LCDs control light transmittance characteristics of liquid crystal material using electric fields applied between pixel and common electrodes in accordance with pixel voltage signals specific to a liquid crystal cell.
Data and gate drivers are directly connected to the liquid crystal display panel and are provided as a plurality of integrated circuits (ICs). Each of the gate driver ICs and data driver ICs are mounted to the liquid crystal display panel using tape carrier package (TCP) or chip on glass (COG) techniques. Further TCP-type gate and data driver ICs are connected to the liquid crystal display panel via a tape automated bonding (TAB) technique.
TCP-type gate and data driver ICs, connected to the liquid crystal display panel by the TAB technique, receive control signals and direct current (DC) voltage signals transmitted over signal lines provided on a printed circuit board (PCB). For example, data driver ICs are connected to each other in series, via signal lines mounted on a data PCB, receive control signals from the timing controller, and receive pixel data signals and driving voltages from the power supply. Gate driver ICs are connected to each other in series, via signal lines mounted on a gate PCB, receive control signals from the timing controller, and receive driving voltages from the power supply.
COG-type gate and data driver ICs are connected to each other via signal lines formed using a line-on-glass (LOG) technique. Mounted on a lower glass substrate of the liquid crystal display panel, the signal lines formed using the LOG technique receive control signals from the timing controller and power supply and driving voltages from the power supply.
Even when the various driver ICs are connected to liquid crystal display panels via the TAB technique, the LOG technique is typically adopted to eliminate the PCB and provide a thinner overall liquid crystal display. For example, signal lines connecting the gate driver ICs are relatively small and are provided directly on the liquid crystal display panel. Accordingly, gate driver ICs are connected to the liquid crystal display via the TAB technique, connected to each other in series via signal lines mounted on a lower glass substrate of the liquid crystal display panel, and receive control and driving voltage signals (i.e., gate driving signals).
Referring to FIG. 1, liquid crystal displays including LOG signal lines (e.g., formed without the gate PCB) typically include a liquid crystal display panel 1, a plurality of data TCPs 8 connected between a first side of the liquid crystal display panel 1 and a data PCB 12, a plurality of gate TCPs connected to a second side of the liquid crystal display panel 1, data driver ICs 10 mounted on the data TCPs 8, and gate driver ICs 16 mounted on the gate TCPs 14.
The liquid crystal display panel 1 includes a lower substrate 2 supporting signal lines and a thin film transistor array, an upper substrate 4 supporting a color filter array, and a layer liquid crystal material injected between the lower and upper substrates 2 and 4, respectively. The liquid crystal display panel 1 further includes a picture display area 21 having liquid crystal cells arranged where gate lines 20 and data lines 18 cross each other. The data driver ICs 10 convert digital pixel data signals into analog pixel voltage signals and apply the analog pixel voltage signals to the data lines 18.
Data pads and gate pads (not shown) are arranged at respective ends of the data and gate lines 18 and 20 at an outer portion of the lower substrate 2, outside the picture display area 21. An LOG signal line group 26 is positioned within the outer area and transmits gate driving signals to the gate driver ICs 16.
Data TCPs 8 include input pads 24 and output pads 25 for electrically connecting the data driver IC 10 mounted thereon to the data PCB 12 and the data lines 18. The input pads 24 of the data TCP 8 are electrically connected to the output pads of the data PCB 12 while the output pads 25 of the data TCP 8 are electrically connected to the data pads arranged on the lower substrate 2. A first data TCP 8 is further provided with a gate driving signal transmission group 22. The gate driving signal transmission group 22 electrically connects the LOG signal line group 26 to the timing controller and power supply via the data PCB 12.
Each of the gate TCPs 14 includes a gate driving signal transmission line group 28 and output pads 30 electrically connecting the gate driver ICs 16 mounted thereon to the LOG signal line group 26 and the gate lines 20, respectively. Accordingly, the output pads 30 are electrically connected to the gate pads arranged on the lower substrate 2.
Each gate driver IC 16 sequentially applies a scanning signal (e.g., a gate high voltage signal (Vgh)) to each of the gate lines 20 in response to inputted control signals. Further, the gate driver ICs 16 apply a gate low voltage signal (Vgl) to each of the gate lines 20 that do not receive the gate high voltage signal (Vgh).
The LOG signal line group 26 typically consists of signal transmission lines and transmits direct current (DC) voltage signals (e.g., gate high voltage (Vgh), gate low voltage (Vgl), common voltage (Vcom), ground voltage (GND), supply voltage (Vcc) signals, etc.) and gate control signals (e.g., gate start pulse (GSP), gate shift clock (GSC), gate enable (GOE) signals, etc.).
Referring now to FIG. 2, individual signal transmission lines within the LOG signal line group 26 are arranged in a fine parallel pattern and are provided within a narrow space, similar to a space where signal lines in gate and data pads are positioned at outer portions of the picture display area 21. Signal transmission lines within the LOG signal line group 26 are formed of the same metal as the gate metal layer and are arranged on the lower substrate 2. Gate insulating and protective films 34 and 36, respectively, are disposed over the LOG signal line group 26. Being formed from the same material as the gate metal, signal transmission lines within the LOG signal line group 26 typically have a resistivity of 0.046 and are formed simultaneously with the gate lines 20. Thus, the LOG signal line group 26 has a larger resistance than signal lines, typically made of a material such as copper, formed in the gate PCB. As resistance values of signal transmission lines within the LOG signal line group 26 are proportional to their lengths, the resistance of signal transmission lines increases as the distance from the data PCB 12 increases. Accordingly, gate driving signals, transmitted via the LOG signal line group 26, become attenuated, their voltage values become distorted, and the quality of pictures capable of being displayed on the liquid crystal display becomes deteriorated.
For example, distortion of the gate low voltage signal (Vgl) transmitted through the LOG signal line group 26 affects the picture quality displayed within the picture display area 21. Gate low voltage signals (Vgl) maintain the pixel voltage charged within the liquid crystal cell between intervals when the gate high voltage (Vgh) is charged within the pixel. Accordingly, as the gate low voltage signal is distorted, the pixel voltage within the liquid crystal cell becomes distorted.
Referring still to FIG. 2, LOG gate low voltage transmission lines VGLL, arranged within the LOG signal line group 26, supply the gate low voltage (Vgl) and include first to fourth LOG gate low voltage transmission lines VGLL1 to VGLL4. The first to fourth LOG gate low voltage transmission lines VGLL1 to VGLL4 electrically connect the first data TCP 8 and first to fourth gate TCPs 14A to 14D, respectively. The first to fourth LOG-type gate low voltage transmission lines VGLL1 to VGLL4 have intrinsic line resistance values a, b, c, and d, proportional to their lengths, and are connected to each other in series via the first to fourth gate TCPs 14A to 14D.
The line resistance values a, b, c, and d alter the gate low voltages (Vgl) supplied to each gate driver IC 16. For example, the first gate driver IC 16, mounted on the first gate TCP 14A, is supplied with a first gate low voltage (VGL1). The voltage value drop of the first gate low voltage (VGL1) is proportional to the first line resistance value a of the first LOG gate low voltage transmission line (VGLL1). The first gate low voltage (VGL1) is applied to gate lines at a first horizontal line block A via the first gate driver IC 16.
The second gate driver IC 16, mounted on the second gate TCP 14B, is supplied with a second gate low voltage (VGL2). The voltage value drop of the second gate low voltage (VGL2) is proportional to the first and second line resistance values of the first and second LOG gate low voltage transmission lines (VGLL1 and VGLL2) connected to each other in series, a+b. The second gate low voltage (VGL2) is applied to gate lines at a second horizontal line block B via the second gate driver IC 16.
The third gate driver IC 16, mounted on the third gate TCP 14C, is supplied with a third gate low voltage (VGL3). The voltage value drop of the third gate low voltage (VGL3) is proportional to the first, second, and third line resistance values of the first to third LOG gate low voltage transmission lines (VGLL1 to VGLL3) connected to each other in series, a+b+c. The third gate low voltage (VGL3) is applied to gate lines at a third horizontal line block C via the third gate driver IC 16.
The fourth gate driver IC 16, mounted on the fourth gate TCP 14D, is supplied with a fourth gate low voltage (VGL4). The voltage value drop of the fourth gate low voltage (VGL4) is proportional to the first to fourth line resistance values of the first to fourth LOG gate low voltage transmission lines (VGLL1 to VGLL4) connected to each other in series, a+b+c+d. The fourth gate low voltage (VGL4) is applied to gate lines at a fourth horizontal line block D via the fourth gate driver IC 16.
As differences between the gate low voltages VGL1 to VGL4 applied to the gate lines via each gate driver IC 16 occur, the brightness to which images are displayed across the horizontal line blocks A to D becomes non-uniform. The non-uniform brightness across horizontal line blocks A to D induces a cross-line phenomenon (32) that divides the screen in brightness values and thereby deteriorates the picture quality of the liquid crystal display. Between the first gate driver IC 16 and the fourth gate driver IC 16, first to fourth line resistance values a, b, c, and d are added to each other. Accordingly, the first gate low voltage (VGL1) is greater than the second gate low voltage (VGL2), the second gate low voltage (VGL2) is greater than the third gate low voltage (VGL3), and the third gate low voltage (VGL3) is greater than the fourth gate low voltage (VGL4).
For each of the gate driver ICs 16, gate low voltage differences such as those described above can be compensated for by providing a plurality of LOG gate low voltage transmission lines independently connected to their corresponding gate driver ICs 16 and/or by enlarging the cross-sectional area of the signal transmission lines. However, these compensation solutions are difficult to satisfactorily achieve because the area in which the LOG signal line group 26 is located is not expandable and providing independently connected LOG gate low voltage transmission lines with enlarged cross-sectional areas within such small, confined spaces is difficult.
Accordingly, gate low voltage differences caused by the line resistance must be compensated for without altering the design of the LOG gate low voltage line VGLL.

Liquid crystal display of line-on-glass type having voltage difference compensating means


A method for integrating a thin film resistor (60) into an interconnect process flow. Metal interconnect lines (40) are formed over a semiconductor body (10). An interlevel dielectric (50) is then formed over the metal interconnect lines (40). Conductively filled vias (62) are then formed through the interlevel dielectric (50) to the metal interconnect lines (40). A thin film resistor (60) is then formed connecting between at least two of the conductively filled vias (62) using a single mask step. Connection to the resistor (60) is from below using a via process sequence already required for connecting between interconnect layers (40, 64). Thus, only one additional mask step is required to incorporate the resistor (60).

The invention is generally related to the field of thin film resistors in integrated circuits and more specifically to a one mask solution for integrating a thin film resistor into an interconnect process flow.
Thin film resistors are utilized in electronic circuits in many important technological applications. The resistors may be part of an individual device, or may be part of a complex hybrid circuit or integrated circuit. Some specific examples of thin film resistors in integrated circuits are the resistive ladder network in an analog to-digital converter, and current limiting and load resistors in emitter follower amplifiers.
Film resistors can comprise a variety of materials including tantalum nitride (TaN), silicon chromium (SiCr), and nickel chromium (NiCr). These resistor materials are generally evaporated or sputtered onto a substrate wafer at a metal interconnect level and subsequently patterned and etched. The thin film resistors require an electrical connection to be made to them. Thus, two mask layers are required. One, TFRES, is to form the resistor itself and the other, TFHEAD, is used to form the resistor xe2x80x9cheadsxe2x80x9d or contact points of the resistor. Connection is made from an overlying metal interconnect layer to the resistor heads. The resistor heads are required to protect the resistor during the via etch needed to make contact between the overlying metal interconnect layer and the resistor. In addition to two masks, multiple deposition and dry/wet etch steps are required to incorporate the resistor.
Morris (U.S. Pat. No. 5,485,138, issued Jan. 16, 1996) describes a method of forming an inverted thin film resistor. The resistor structure is deposited directly on top of the metallic interconnects. The metallic interconnects are formed. An interlevel dielectric layer is deposited over the metallic interconnects and polished back to expose the top surface of the metallic interconnects. The resistor is then formed on a portion of the interlevel dielectric and a portion of the metallic interconnect.
The invention is a method for integrating a thin film resistor into an interconnect process flow. Metal interconnect lines are formed over a semiconductor body. An interlevel dielectric is then formed over the metal interconnect lines. Conductively filled vias are then formed through the interlevel dielectric to the metal interconnect lines. A thin film resistor is then formed connecting between at least two of the conductively filled vias using a single mask step. Connection to the resistor is from below using a via process sequence already required for connecting between interconnect layer. Thus, only one additional mask step is required to incorporate the resistor.
This and other advantages will be apparent to those of ordinary skill in the art having reference to the specification in conjunction with the drawings.

One mask solution for the integration of the thin film resistor


A fire protective coating and method for applying same to a composite strure are provided. The coating is a composition of matter comprising a phenolic resin and strength reinforcing fibers embedded within the phenolic resin. The method of coating the structure with the composition of matter uses a phenolic resin in the liquid state. In this way, a mixture of the phenolic resin and strength reinforcing fibers can be applied to the structure's surface by conventional spraying techniques. As the mixture on the surface cures, a fire protective coating is formed on the structure's surface.

Use of composite materials as structural components for the marine and aerospace industries dates back to the 1940's. Typically, the composite materials are polyester or epoxy resin based. While choice of a particular composite is dictated by application, generally any one of the composites is the optimal choice with respect to strength, weight, cost, etc., when compared with other materials (e.g., metal, wood, etc.).
Unfortunately, experience has shown that most organic matrix materials, particularly the conventional polyester and epoxy types, support combustion and generate large quantities of smoke when burning. It has thus become necessary to place restrictions on using such materials in certain applications until such time that these materials can offer improved fire performance. Towards this end, it has been proposed that phenolic laminates be used as a sacrificial fire barrier formed on the individual, composite material structure components. Phenolic laminates, when compared with the polyester and epoxy resins, exhibit higher ignition resistance, low flammability and generate far lesser amounts of smoke. Phenolic laminates, however, possess poor bonding properties due to their higher void content. Since the laminates are made from continuous roving, debonding causes large portions of laminate ply to peel and, subsequently, fall off. Thus, the phenolic laminates frequently break up and fall off the structural component to which they have been bonded. Furthermore, since the phenolic laminates are formed on each individual structural component, fire protection discontinuities are formed between assembled components. Finally, high labor cost is associated with the laminated components since the laminates are typically hand laid.

Fire protective coating and method for applying same to a structure

The United States of America as represented by the Secretary of the Navy


Provided are water-dissipatable, sulfo-containing polyesters and polyester-amides having copolymerized therein thermally stable near infrared flourophoric compounds. The polymers are useful in coating or ink compositions, which are in turn useful for marking articles for identification/authentication purposes. Also provided is a method for invisibly marking such articles and a method for detecting and sorting articles by utilizing the near infrared flourophoric ink or coating compositions.

It is known (U.S. Pat. No. 4,540,595) that one may mark documents such as bank checks by the use of inks that fluoresce in the near infrared region, i.e., generally between 650 and 800 nm, for automatic identification. Fluorescent phenoxazine dyes of the formula ##STR1## wherein R.sub.1 and R are alkyl and X.sup.- is an anion are shown to be effective near-infrared fluorescing compounds for this purpose. Attempts to use these compounds to impart fluorescence in the near infrared by adding them to water dissipatable polymers have failed because of poor thermal stability.
It has been proposed (G. Patonay, Analytical Chemistry, Vol. 63, No. 6, 1991, pp 321-327) to use near infrared fluorescent compounds for fluorogenic labels for biomolecules; however, the disclosed fluorescent compounds have poor thermal stability and are not suitable for adding to water dissipatable polymers during preparation.
This present invention, as described below, relates to water-dissipatable (i.e., dispersible) polymeric compositions which are useful in the formulation of near infrared fluorescent inks, paints and film forming compositions. The polymeric compositions are unique in that the near infrared fluorophores (NIRF's) are copolymerized therein and thus are not extractable, exudable, sublimable or leachable from the polymeric composition. Also, since the NIRF is bound to polymer chain by covalent bonds or incorporated into the backbone of the polymer by covalent bonds, toxicological concerns are minimized because of low potential for exposure to humans. The inks, paints and film forming compositions prepared from the polymeric compositions of this invention are especially useful in "marking" or "tagging" various items, e.g. security documents, bank checks and other printed or coated materials where subsequent detection or identification is desired.

Water-dissipatable polyesters and amides containing near infrared fluorescent compounds copolymerized therein


The present disclosure generally relates to devices that can be used for mounting and securing skis, snowboards, among other equipment to vehicle roof racks (e.g., luggage racks, factory-installed racks, after-market racks, etc.), such as those having crossbars. In an exemplary embodiment, there is a device suitable for use in securing an article to a vehicle roof rack having one or more crossbars. The device generally includes at least one hook component including a curved portion configured to be hooked under a crossbar of a vehicle roof rack. The device also includes a clamping apparatus operable for creating a clamping force to secure the device and the article to the crossbar.

This section provides background information related to the present disclosure, which is not necessarily prior art.
Most ski racks, snowboard racks, and other racks as well as adapters for racks are designed to fit on certain crossbars, such as those having a specific shape and profile. Significantly, the typical rack or adapter is installed first, and then the skis, snowboards and other objects are secured to the rack or adapter.
Generally, for example, ski or snowboard attachments or adapters cannot hold the skis or equipment securely enough to be held only against one adapter (i.e., on one crossbar). Thus, conventional adapters are typically provided in pairs that attach to the two crossbars at the front and back of the rack.
There are various types of ski racks, sports racks, luggage or roof racks, adapters/attachments, and systems for attaching skis, snowboards, and other equipment. For the purpose of this application, the terms "skis" or "snowboards" as used herein are intended to be generic and include all types of ski or similar sized sports equipment that are mounted on roof racks. Similarly, the terms "rack", "adapter", "attachments", "sports rack", "cross members", "crossbars", "side rails," or other such terms are also intended to refer generically to bars, brackets, and other assemblies, permanently or removably installed on the roof of cars or other vehicles in order to transport or carry skis, other sports-related equipment, and non-sports related equipment.
The scope of present disclosure includes ski, sports equipment, and other type carriers and racks designed to adapt to cross members of multi- or single-function rack adapters or attachments, including two-sided, hinged or scissor-type ski rack systems (e.g., where the ski rack adapter after being installed on the crossbars is open to accept or remove skis or snowboards, etc.) and various other designs, many of which involve after-market racks or rack systems. Generally, rack towers (side supports) attach to a vehicle or side rails mount to the vehicle's door moldings or rain gutters or the sides of the roof above the gutters. Attached to the towers are crossbars or members spanning across the car, with one crossbar, for example, between each of the two sets of towers. Specialized rack attachments or carriers (e.g., for skis, bikes, kayaks, canoes, etc.) are commonly mounted on the cross members/bars and added/removed as needed depending on the season or time of year and the desired function for various sport equipment or other items being secured to the rack and roof of the vehicle.
Many factory installed roof racks for vehicles (e.g., luggage racks or otherwise, etc.) also have cross members, or in some cases, only side rails for luggage or cargo (e.g., to which after-market cross members can be added). Specialty adapters sold by the vehicle, rack manufacturers, or third-party manufacturers are designed for specialty uses to carry similar sport and other equipment as mentioned for the aftermarket racks above. Because sports racks for specific equipment like skis, and specialty adapters for skis must be installed separately (i.e., before installing the equipment they are designed for), the inventor hereof has recognized that owners/users oftentimes avoid the inconvenience of extra or frequent installations and uninstalling or removal, and instead simply leave the specialty adapters installed on the beyond when needed despite the added wind noise, drag, and inconvenience when other seasons require installation of other specialized adapters.
Many of these specialty brackets, adapters, etc., are designed to fit only one or a subset of the crossbars or members, which come in a variety of sizes and cross sectional shapes (e.g., square, spheroid, prolate spheroid, round, etc.). Some fit a variety of shaped crossbars though not always in an optimal condition as the shape of the crossbar and adapter brackets may not match well. In many cases, generic adapters (adapters that are not designed for or matched to a specific cross section crossbar) have either four attachment points or bolts, such that require significant time to install and remove the generic adapters.
Additionally, specialty adapters or components for skis, snowboards, bikes, poles, etc., often are not capable of being quickly installed and/or removed as such specialty adapters are not designed with quick release. Instead, such specialty adapters may require two or more nut/bolt assemblies in order to be secured to each attachment point on the cross members (typically there are two cross members). Due to this inconvenience, the inventor hereof has recognized that adapters are often left installed for the season or beyond the immediate need or use to hold or carry the designated equipment, as the time to change the adapters for the different equipment often deters the use of the proper adapters. For example, a single ski alternatively might be secured with bungee cords or other means rather than by fully installing, then de-installing the ski adapters/racks.

Devices and methods for securing skis, snowboards, etc. to crossbars of vehicle roof racks


A system for displaying products for purchase on any document displayed on any computer device, comprising conducting a statistical frequency analysis of the word occurrence in the document to determine the primary subject matter of the document and/or keywords in the document, selecting products which are relevant to the subject matter and keywords of the document, either by manual selection or by automatic selection. Automatic selection is accomplished by conducting a statistical frequency analysis of the word occurrence in the product descriptions to determine the keywords in the product descriptions and matching the keywords from the document with the keywords from the product descriptions.

The Internet delivers trillions of words to billions of screens. The Net contains an enormous amount of material. Systems exist which survey web sites to determine the traffic (hits) that take place for a given web page. Some systems exist which will suggest products to a user based upon their selection of a particular web page or a particular topic. No system exists however, to analyze survey statistics to select and suggest e-commerce products that would be of interest to those persons selecting particular content and portions of that content, to suggest highly related products that can be purchased by the user. This would be highly beneficial to create a market for those products to persons that are already recognized to be interested in a particular subject.
For example, while searching an article on basketball, various products could be suggested on the screen for purchase, such as sports supplies, sports clothing and books and magazines on the subject of basketball. If it could be determined that the searcher was particularly interested in professional basketball, the products suggested could be narrowed to be more relevant to that interest.


An electrical wedge connector with a sleeve and a one-piece wedge. The wedge has a rearward extension extending at one lateral side. When the wedge is fully inserted into the sleeve, the rear end of the wedge is substantially located inside the sleeve. However, the rearward extension extends past the rear end of the sleeve to provide a grasping surface. The rearward extension is preferably collapsible.

1. Field of the Invention
The present invention relates to electrical connectors and, more particularly, to a wedge connector.
2. Prior Art
U.S. Pat. No. 4,650,273 discloses an electrical connector with a general "C" shaped sleeve and a wedge. The wedge is stamped and formed from sheet metal and has a tab at its front end. The tab engages a front end of the sleeve to resist withdrawal of the wedge from the sleeve. U.S. Pat. No. 5,006,081 discloses a wedge connector with a "C" shaped sleeve having a hole in its middle section for engaging a dimple on a stamped and formed sheet metal wedge.

Electrical wedge connector with collapsible rear extension


The use of photon sieves may be as a pupil defining element in an illumination system; a field of defining elements in an illumination system; a pupil lens element in a projection lens; a color correction system in the projection system; or as a transmitting diffractive element for EUV.

1. Field of the Invention
The present invention relates to an optical system in a lithographic apparatus and a method for manufacturing a device.
2. Description of the Related Art
A lithographic apparatus is a machine that applies a desired pattern onto a substrate or part of a substrate. A lithographic apparatus may be used, for example, in the manufacture of flat panel displays, integrated circuits (ICs) and other devices involving fine structures. In a conventional apparatus, a patterning device, which may be referred to as a mask or a reticle, may be used to generate a circuit pattern corresponding to an individual layer of a flat panel display (or other device). This pattern may be transferred on (part of) the substrate (e.g. a glass plate), e.g. via imaging onto a layer of radiation-sensitive material (resist) provided on the substrate.
Instead of a circuit pattern, the patterning device may be used to generate other patterns, for example a color filter pattern, or a matrix of dots. Instead of a mask, the patterning device may include a patterning array that includes an array of individually controllable elements. An advantage of such a system compared to a mask-based system is that the pattern can be changed more quickly and for less cost.
A flat panel display substrate may be rectangular in shape. Lithographic apparatus designed to expose a substrate of this type may provide an exposure region which covers a full width of the rectangular substrate, or which covers a portion of the width (for example half of the width). The substrate may be scanned underneath the exposure region, while the mask or reticle is synchronously scanned through the beam. In this way, the pattern is transferred to the substrate. If the exposure region covers the full width of the substrate then exposure may be completed with a single scan. If the exposure region covers, for example, half of the width of the substrate, then the substrate may be moved transversely after the first scan, and a further scan is typically performed to expose the remainder of the substrate.
The aim of lithography is to achieve more and smaller patterns on substrates in order to make smaller devices such as ICs. A difficulty lies in focusing the radiation onto a patterning device, and then focusing the patterned radiation onto the increasingly small and more densely packed target area of the substrate. This is particularly difficult with short wavelength radiation such as X-rays, EUV or DUV (with typical wavelengths such as 248 or 193 nm), that cannot be focused enough using traditional lenses used for visible light and the like. Furthermore, there are several areas in lithography that require efficient and delicate focusing of radiation that traditional methods do not achieve. Traditionally, focusing elements have included glass lenses. However, glass lenses have a relatively large cross sectional and surface area and so the layout of glass lenses is limited. Furthermore, glass has a specific lifetime and may be prone to chipping or clouding. Furthermore, low wavelength radiation (such as X-rays) does not transmit or refract through glass.

Photon sieve for optical systems in micro-lithography


A medical device and method of using the device such as during laparascopic procedures for reducing the size of specimens so that they can be removed from the body by a minimally invasive surgical technique. The device is thermally activated and is useable in conjunction with or as part of a tissue isolation bag. The device includes an inner wall defining an empty space for receiving surgically removed tissue. The member is in an expanded condition at body temperature but shrinks to a smaller specimen reducing configuration wherein the empty space becomes smaller when the member is heated to a temperature above body temperature. By careful selection of the material for the specimen reduction device, a range of specific shrink temperatures may be obtained which are suitable for use within the body. For example, the member can be of a shape memory metal or a shape memory polymer.

1. Field of the Invention
The invention relates to a medical device useful during laparascopic procedures for reducing the size of specimens so that they can be removed from a body by a minimally invasive surgical technique.
2. Description of Related Art
During the removal of a diseased gallbladder, an inflamed appendix, or other procedure using laparoendoscopic techniques it is frequently necessary to remove objects which are larger than the tubular structure (e.g., trocar) through which the procedure is being conducted. One method of reducing the size of such object is to use a device such as a morcellator, which, in conjunction with a suitable tissue isolation bag, mechanically reduces the size of the object by a grinding or flailing action. The isolation bag can then be subsequently withdrawn through the trocar. If such a device is not available, or is ineffective, then the surgeon must increase the size of the hole through which he is working, which is not desirable. The current invention offers a much improved method of tissue or stone reduction.
U.S. Pat. No. 5,037,379 ("Clayman") discloses a surgical tissue bag for percutaneously debulking tissue by inserting the bag through an access sheath into a body cavity, inserting surgically removed tissue through an open end of the bag, closing the end of the bag and pulling the closed end out of the body cavity, opening the end of the bag and morcellating or debulking the tissue through the open end of the bag while the remainder of the bag remains in the body cavity. The bag is made of flexible and foldable material and includes an inner layer of puncture resistant material such as nylon in either a woven or solid layer form for resisting penetration by a surgical morcellating instrument. The outer layer of the bag is made of a moisture proof material such as plastisol.
U.S. Pat. No. 5,074,867 ("Wilk") discloses a procedure for removing a gall bladder wherein a sheet-like membrane having wires connected to corners thereof is used to remove the gall bladder. The gall bladder may or may not be pre-crushed by means of a crushing forceps prior to pulling on the wires to cover the gall bladder and remove the membrane and gall bladder from the patient.
U.S. Pat. No. 5,037,427 ("Harada") discloses a stent made of a bidirectional shape memory alloy such as nickel-titanium (Ni-Ti) binary alloy, copper-aluminum-nickel (Cu-Al-Ni) ternary alloy or copper-zinc-aluminum (Cu-Zn-Al) ternary alloy. The stent has a small diameter at 15.degree. C. and lower and has a larger diameter at body temperature (about 35.degree. to 37.degree. C.). The stent can be formed of spirally wound flat wire, a longitudinally split cylindrical tube, a net in the form of a cylindrical tube, or a cylindrical tube. In use, the stent is shrunk onto a catheter tube, the catheter is introduced into a tubular organ while cooling the stent with ice-cooled physiologic saline, the stent is heated by heat of the living body and the stent expands into contact with the inner wall of the tubular organ.


A model predictive control apparatus includes an initial solution generation section, an abnormality handling section, and an objective function adjustment section. The abnormality handling section performs initial solution generation when it is determined that performed optimization is abnormal. The initial solution generation section generates an initial optimal value of a future time series control input in accordance with an initial objective function, without reference to a candidate value of the time series control input. The objective function adjustment section adjusts the current objective function so that the current objective function varies stepwise with time toward the normal objective function when it is determined that the current objective function is different from the normal objective function.

The present invention relates generally to model predictive control apparatus, and more particularly to model predictive control apparatus for automotive vehicles which predicts future dynamic behaviors of the host vehicle and target vehicles around the host vehicle, and optimizes a control input to the host vehicle in accordance with the prediction.
In recent years, there have been proposed and disclosed various model predictive control (MPC, or model-based predictive control (MPDC)) systems. In general, a model predictive control method is configured to predict a time series of a state of a system in accordance with a mathematical model of the system, to define an objective function to numerically evaluate the predicted time series system state and a future time series of a control input to force the system state to track its setpoint, to calculate an optimal value of a future time series of the control input which minimizes the objective function, and to input the calculated optimal value of the control input to the system.
A Published Japanese Patent Application No. H7(1995)-191709 (hereinafter referred to as "H7-191709") shows a parameter setting method for the model predictive control. The method disclosed in H7-191709 is configured to check the condition numbers of matrices whose inverse matrices are calculated and used in its computational process, when parameters of a model predictive control system are changed, and to adjust a weight for a control input in an associated objective function so that the condition numbers are held within predetermined bounds. Incidentally, the condition number of a matrix A is the ratio of its maximum singular value to its minimum singular value. The condition number is a measure of the sensitivity of solution of Ax=b to perturbations of A or b (x and b are vectors). In other words, the condition number is a measure of the numerical accuracy of its inverse matrix A−1. In general, with increasing condition number of a matrix, the numerical accuracy of its inverse matrix decreases so that it becomes more difficult to accurately calculate its inverse matrix. Thus, the method disclosed in H7-191709 has intention to prevent the control input from violating its constraints due to computational errors or computational abnormality, monitoring the condition numbers of the matrices concerned. When there is a possibility that a large condition number adversely affects the control computation, the method increases the weights for the control input in the objective function to equivalently reduce the condition number, and to hold the stability of the control computation.
A Published Japanese Patent Application No. 2000-135934 shows an automatic vehicular velocity control apparatus for automotive vehicle, which has intention to follow up a preceding vehicle which is running ahead of the vehicle at an appropriate inter-vehicle distance when the preceding vehicle has been recognized. In addition, a reference "T. Ohtsuka, "Continuation/GMRES method for fast algorithm of nonlinear receding horizon control" Proc. 39th IEEE Conference on Decision and Control, pp. 766-771, 2000" shows an algorithm for model predictive control in which the control input to a system is updated by a differential equation to trace the solution of an associated two-point boundary-value problem.


Systems and techniques for printing on a workpiece. In one implementation, a print system has a collection of print elements arranged to span a print area, a workpiece conveyor to move a workpiece through the print area, and a detector to detect a position of the workpiece in the print area. The print system also has control electronics to instruct the collection of print elements to print an image on the workpiece substantially immediately when the collection of print elements receive the instruction through an optical communication path.

This disclosure relates to printing systems.
When an image such as a picture or a page of text is to be printed, image data generally is translated by a computer system from one format into another format understandable by a printer and then relayed to a print buffer associated with the printer. The print buffer receives the translated image data and stores at least a portion of the image data for subsequent printing by the printer.
Many printers include multiple discrete print elements (e.g., an inkjet nozzle in an inkjet print module). The print elements can be deployed to print selected components of the image. For example, selected print elements can be deployed to print at selected locations on a workpiece. As another example, in color printing, selected print elements can be deployed to print selected colors. Control electronics can coordinate the printing of images by deploying the print elements to print image data from the print buffer.
The print elements in a printer can be arranged in groups called print modules. The print elements in a module can be grouped according to the deployment of the constituent elements. For example, print elements that print at a selected array of positions can be grouped in a print module. As another example, print elements that print the same color (at a selected array of positions) can be grouped into a print module.


The present application pertains to testing methods and apparatus useful in single phase or two-phase liquid immersion cooling systems. Single phase systems use a fluid similar to mineral oil in which to immerse the servers. As the fluid is heated by the operating servers the fluid is circulated to one or more heat exchangers for cooling so the fluid never boils. In contrast, two-phase systems cool heat generating computer components which cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Using the testing methods and apparatuses herein one may design and test more efficient components and systems. More specifically, the one or more heating elements are both passive and intelligent. They may be used to mimic the power load of a server which is used in the load testing of immersion cooling so actual servers are not required to test various aspects of the liquid immersion cooling units.

Single phase immersion cooling systems and processes are described in, for example, U.S. Pat. No. 9,992,914 which is incorporated herein by reference. Single phase systems may immerse the computer components or servers in a suitable liquid coolant such as a dielectric liquid coolant, including without limitation vegetable oil, mineral oil (otherwise known as transformer oil), or any liquid coolant having similar features (e.g., a non-flammable, non-toxic liquid with dielectric strength better than or comparable to air). The coolant is circulated to a heat exchanger which removes heat absorbed by the coolant so it is cooled and recycled. Two-phase liquid immersion cooling systems and processes are described in, for example, U.S. Pat. No. 10,477,726 which is incorporated herein by reference. In such systems and processes heat generating computer components cause a dielectric fluid in its liquid phase to vaporize. The dielectric vapor is then condensed back into a liquid phase and used to cool the computer components. Such systems are complex and must be designed to be both efficient and effective to adequately protect the expensive computing components from damage due to, for example, excess heat and/or impurities in the system. Accordingly, what is needed are testing methodologies and testing apparatuses so one may optimize designs and/or ensure that a particular design will perform as needed to protect the computing components in a single phase or two phase system.
Advantageously, the present application meets the aforementioned needs and more. In one embodiment, the present application, pertains to a heat blade assembly for testing single phase or two phase liquid immersion cooling components. The assembly comprises a chassis; a heat carrying material operably connected to the chassis; one or more wiring termination blocks configured to distribute electrical current through a circuit to the heat carrying material; one or more fuses between the wire termination blocks and heat carrying material; a current transducer configured to acquire data relating to operating current; and a solid state relay configured to allow control of the assembly by a multi-unit testing management system.
In other embodiments, the present application pertains to various testing methods employing the heat blade assembly.

Testing methods and apparatuses using simulated servers


Provided is an information processing apparatus capable of combining the addition of a plurality of items in an original file in various forms, and outputting the file. A storage unit correlates additional content identification information for identifying additional content that is content added to the original file or content after change; additional content manager information for identifying a manager of the additional content; and add location identification information for identifying a location where the additional content is to be provided in the original file with the additional content and stores the information. A control unit provides the additional content that is extracted from a file other than the original file based on the additional content identification information, or that is acquired from the manager based on the additional content manager information to the original file based on the add location identification information, and causes the file to be outputted as the output target file.

The present disclosure relates to an information processing apparatus that is equipped with a function of adding new content to an original file, and outputting the file.
An apparatus that is capable of generating one file that is based on a plurality files and outputting (transmitting, printing, or the like) the file is known. For example, an apparatus that attaches an image of another image file to a certain one document file before outputting the file is known. For example, in first typical technology, there is an apparatus that attaches image data of a seal (approval seal or the like) to a specified location in a document file, and outputs the file as a new document file. When performing this work, approval of a manager of the seal is required, however, in the first typical technology, configuration is such that this approval is suitably performed.
In the first typical technology, the main body of the document file that is finally outputted is just the original document file, and after image data of the seal is attached to this original document file, the file is taken to be the final document file. On the other hand, in second typical technology, there is an apparatus that combines a plurality of document files to obtain a new document file, and outputs this document file as one printing job.
With this technology, a user does not perform work of creating a document file to be finally outputted, but rather the document file to finally be outputted is automatically created on the apparatus side from a prepared plurality of files and then can be outputted. As a result, the burden on the user may be reduced. Particularly, when the location where a seal is inserted in a document file in the first typical technology, or when the format of combining a plurality of document files in the second typical technology is determined in advance, the work of creating a new document file is easy, so particularly efficient processing may be performed.

Information processing apparatus equipped with function of adding new content to original file and outputting file


Methods and apparatuses are described for removing a contaminant, such as a vaporous trace metal contaminant like mercury, from a gas stream. In one embodiment, a primary particulate collection device that removes particulate matter is used. In this embodiment, a sorbent filter is placed within the housing of the primary particulate collection device, such as an electrostatic precipitator or a baghouse, to adsorb the contaminant of interest. In another embodiment, a sorbent filter is placed within a scrubber, such as a wet scrubber, to adsorb the contaminant of interest. In some embodiments, the invention provides methods and apparatuses that can advantageously be retrofit into existing particulate collection equipment. In some embodiments, the invention provides methods and apparatuses that in addition to removal of a contaminant additionally remove particulate matter from a gas stream.

1. Background of the Invention
The invention relates generally to the removal of vapor phase contaminants from a gas stream. More specifically, the invention is directed to a method and apparatus for the removal of vapor phase contaminants, such as mercury, from the flue gas of a combustion system.
2. Description of Related Art
The emission of trace metals from utility power plants is an important. In particular, special attention has been given to trace contaminants, including, for example, mercury (Hg), in terms of their release into the environment and corresponding impacts on the environment. Generally, trace contaminants include those vaporous chemical species present in relatively low concentrations in a given gas stream as well as solid particulate matter. For example, mercury is present in flue gas from a fossil-fuel-fired combustion system in very low concentrations (<1 ppb) and forms a number of volatile compounds that are difficult to remove. Specially designed and costly emissions-control systems are required to effectively capture these trace amounts of mercury.
Several approaches have previously been adopted for removing mercury from gas streams. These techniques include passing the gas stream through a fixed or fluidized sorbent filter or structure or using a wet scrubbing system. Approaches using fixed bed technologies normally pass the mercury containing gas through a bed consisting of sorbent particles or through various structures such as honeycombs, screens, or fibers that are coated with a sorbent. Common sorbents include activated carbon and noble metals such as gold and silver. In many cases where noble metals are used, the structure is coated with the noble metal sorbent while the support underneath is made of ceramic or metallic materials. The sorbents in these fixed structures can be periodically regenerated by heating the structure and driving off the adsorbed mercury (see, for example, U.S. Pat. Nos. 5,409,522 and 5,419,884, which are incorporated by reference herein in their entireties). The mercury driven off can then be recovered or removed separately.
However, in regenerating the sorbent in such fixed bed systems, the bed must be taken off-line periodically. This necessitates that a second bed be used and remain on-line while the first one is regenerating. In addition, the beds need to be located downstream of a primary particulate collection device to remove all of the solid suspended particles in the gas stream and to avoid pluggage. These fixed bed systems also require significant space since they need to remove vapor phase contaminants, such as mercury, for long periods of time without having to be replaced or regenerated, and they are very difficult to retrofit into existing systems, such as into the ductwork of power plants, without major modifications and high pressure drop penalties (e.g., 10-30 inches of water).
U.S. Pat. Nos. 5,948,143 and 6,136,072, which are incorporated by reference herein in their entireties, describe concepts that addressed some of these problems through the use of porous tubes and plates that can be regenerated and cleaned while in the presence of flue gas containing particles. These porous tubes and plates are cleaned by a series of back pulses across their walls. However, the fabrication of porous tubes and plates is complex and relatively expensive. The tubes and plates are also heavy and difficult to install and heat due to the thick wall requirements.
Therefore, a need remains for a cost-effective method and apparatus for removing trace contaminants, in particular mercury, from gas streams, including, for example, the flue gas of a coal-fired combustion system. In addition, there is a need for an improved process and apparatus for removing such contaminants that can be easily retrofitted into an existing combustion system.

Sorbent filter for the removal of vapor phase contaminants


A visual steering wheel direction indicator for a self-propelled machine. The indicator may additionally exhibit an indicator of the amount that the steering wheel must be turned in order to reach neutral. The indicator may be integrated into a neutral start system.

The present invention relates generally to self-propelled harvesting machines, and more particularly to a steering wheel direction indicator for a neutral start system on an agricultural windrower.
It is known in the prior art that the safety of self-propelled machinery is sometimes improved by the integration of a neutral start requirement to prevent unexpected machinery movement upon startup. Many devices, mechanical and electronic, are available for this purpose. It is not however, common practice to require a fully neutral positioning of the steering wheel in a hydrostatic drive system. Such requirement promotes even more safety, for operators, bystanders and the machinery, by eliminating the possibility of not only unexpected forward motion, but also sideways movement.
Hydrostatic drive systems are often configured with the pump attached directly to the engine without a clutch or other mechanism to stop output flow of the pump while the engine is running. The vehicle is then subject to movement based on the pump displacement control, which most commonly is moved selectively through forward-neutral-reverse positions by the operator. Currently, vehicles equipped with this type of drive system utilize a mechanical latch to trap the displacement control in neutral for starting. The latch also activates a switch or series of switches to complete the electrical starting circuit. Most of these systems include several moving parts and require complicated adjustment to maintain functionality.
It would be of great advantage to provide a steering wheel direction indicator system as part of a neutral start on a self-propelled machine that prevents all inadvertent movement of the machine upon startup.

Steering wheel direction indicator for neutral start


The simultaneous abatement of NO and SO.sub.2 in flue gas is provided by an absorption process and apparatus utilizing an absorbent composition comprising an aqueous solution of chelates and sulfite salts. Metal chelates oxidized to an inactive state are electrochemically reduced. In the electrochemical cell, nickel or stainless steel anode materials are stable and may be used in the place of platinum coated anode materials when the anolyte pH is maintained greater than 12. At these conditions, the anode is corrosion resistant with a long operating time between replacement. Ultrafiltration or Donnan dialysis may be used to separate the chelate sorbents from the waste salts to reduce the loss of expensive chelate sorbents. Alternatively, an anionic exchange membrane can be used to electrodialytically separate waste sulfur/nitrogen salts from the absorbent solution.

Emissions control of sulfur dioxide and nitric oxide in flue gas streams resulting from the combustion of carbon-based fuels in power plants is an advancing art. There is a burgeoning need for an efficient and inexpensive process for abating such pollutant gases to meet ever increasing environmental concerns and the growing need to utilize plentiful, but pollutant-producing fuels, such as coal, to replace diminishing petroleum reserves.
In a widely employed practice, sulfur dioxide-containing flue gases are scrubbed with an aqueous lime or limestone slurry. Sulfur dioxide is removed by precipitation of hydrated CaSO.sub.4 and CaSO.sub.3 salts. A common variation of this process utilizes SO.sub.2 sorbents such as sodium carbonates to produce a bisulfite intermediate. The sorbent may be subsequently regenerated by contacting the bisulfite with lime or limestone. The insoluble calcium salts produced thereby are typically disposed of in landfills.
Metal chelates, and ferrous chelates in particular, have been introduced to address the problem of NO abatement such as, for example, in U.S. Pat. No. 4,732,744 to Chang et al.; No. 4,612,175 to Harkness et al.; No. 4,708,854 to Grinstead; No. 4,615,780 to Walker; and No. 4,126,529 to DeBerry. In these references, SO.sub.2 is scrubbed concurrently by a SO.sub.2 sorbent such as water soluble sulfite, bisulfite and carbonate salts. The SO.sub.2 and NO are typically removed as a soluble sulfur/nitrogen salt waste stream. Separation of these byproduct salts from chelate sorbents also present in the waste steam is accomplished by various techniques such as, for example, in Chang by a crystallization separation process, in Walker and DeBerry by electrodialysis or in Grinstead by ultrafiltration or dialysis.
Related U.S. Pat. Nos. describing the use of chelate sorbents include No. 4,013,430 to Adachi et al.; No. 3,984,522 to Saito et al.; No. 4,044,101 and No. 4,081,509 to Hisamatsu et al.; No. 4,079,118 and No. 4,091,074 and No. 4,079,118 to Gorai; No. 4,158,044 to Takabatake et al.; No. 4,331,639; No. 4,448,899 and No. 4,597,954 to Hass; Nos. 3,991,161; 3,992,508; 4,055,623 and No. 4,087,372 to Saitoh et al.; and No. 3,932,585 to Moriguchi et al. Related articles include S. G. Chang et al., American Chemical Society Symposium Series, No. 188, (1982) and S. A. Bedell et al., Hydrocarbon Processing, Jan. 1988, pp. 63-66.
Electrochemical reduction of oxidized chelate absorbents is disclosed in several references. In DeBerry, the electrochemical cell comprises a series of compartments separated by a series of anionic and cationic membranes. Preferred anode electrodes are said to be made from non-corroding materials handling high current densities such as lead and lead alloys. In Walker, the electrochemical cell is said to comprise a stack of compartments separated by alternating bipolar and anionic selective membranes. Other references disclosing electrochemical reduction of chelates in a SO.sub.2 /NO abatement process include U.S. Pat. No. 4,607,234 to Hoelter; Japanese Patent JA-086017(05.02.76); Chemical Abstracts (CA) 84:169057u (Hasui, et al.); CA 84:169058v (Miki et al.); and CA 90:209418v (Sato et al.). See also, S. A. Bedell et al., Industrial & Chemical Research Vol 26, No. 11, (1988), pp. 2092-2095; Susan S. Tsai et al., Environmental Progress, May 1989, pp 126-129; S. S. Tsai et al., Presentation Paper-American Institute of Chemical Engineers (AICHE), (1987); S. S. Tsai et al., Presentation Paper-AICHE, #81B, (1988); S. S. Tsai et al., Presentation Paper-Air & Waste Management Assoc. Annual Meeting 90-101.4, Jun. 24-29 (1990); and D. J. Zabcik, Presentation Paper-Combined FGD and Dry SO.sub.2 Control Symposium, Oct. 25-28 (1988).
The use of a variety of electrode materials in various different electrochemical processes are described in several references. U.S. Pat. No. 4,814,051 to Bedell discloses platinized titanium or tantalum which have enhanced stability in an electrochemical cell used to regenerate an alkanolamine sorbent for H.sub.2 S. Other U.S. Pat. Nos. 2,768,945 to Shapiro; No. 4,592,814 and No. 4,608,136 to Vaughan et al.; and No. 3,723,264 to Leduc.
It is desirable that a process be devised for the efficient removal of SO.sub.2 and NO from flue gas streams wherein the oxidized chelate absorbents may be reduced, in a simple, two-compartment electrochemical cell wherein the electrodes have high current densities and are stable in the operating environment. In addition, it is desirable that the chelate sorbents be separated from the waste salts for recycle to the absorber for lower operation costs and more efficient operation.

Process for absorption of sulfur dioxide and nitric oxide from flue gas


A fastener delivery system including a feed tube coupled to a delivery location at a second end of the feed tube. The fastener delivery system includes a fastener feed mechanism comprised of a coil wound around a coupler. The coupler is coupled to the feed tube at a first end of the feed tube. The fastener delivery system includes a fastener positioning device configured to receive a fastener. The fastener positioning device is connected to the coupler and operates to inject the fastener into the coupler. A current is applied through the coil to generate a magnetic field. The magnetic field interacts with the fastener and thereby projects the fastener through the feed tube towards the delivery location.

Commercially available automated industrial fastening systems implement a compressed air fastener delivery system to deliver a fastener to a fastener tool through a tube. However, moving an item with compressed air results in a noisy delivery process that requires additional cost for providing a fastener to a fastener tool
The background description provided here is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure.

Automated electromagnetic fastener delivery system


A modular, gas-driven power distribution system includes a gasoline-operated module delivering power to a connector having a rotatable element enabling a plurality of mechanical devices to be detachably coupled to the connector to receive power through the rotatable element. The plurality of connectable devices includes a powered oar adapted for nautical purposes. The oar preferably comprises a shaft having a proximal end adapted for detachable coupling to the connector forming part of the gasoline-operated module, and a distal end transitioning into a paddle shape terminating in a rotating prop. A rotatable axle is disposed centrally within the shaft, the axle having a proximal end adapted for detachable coupling to the rotatable element to deliver power to the rotating prop. In addition to the powered oar embodiment, the invention preferably also facilitates interconnection to a reciprocating saw and electrical generator, each having a motive power receiving end adapted for detachable coupling to the rotatable element of the gasoline-operated module.

It has been found that the small, two-cycle gasoline engines found on weed-mowing equipment may be utilized for other purposes. In particular, it is noted that many commercially available weed mowers of this kind, which are sold under trade names such as WeedEater.RTM. or WeedWhip.RTM., feature a coupling between the tube which delivers power to the rotating head and the powerpack which is of a standard configuration, including a recessed quarter square drive.
The power delivery module may be made available for other applications by disengaging the power-delivery tube from the gas-driven powerpack and connecting one of a variety of mechanically operable accessories to the standard coupling. In particular, the weed-trimming shaft assembly may be replaced with a devices such as an electrical generator, reciprocating saw, or powered oar in accordance with the teachings of the instant invention. Although a power pack for boats has been described in U.S. Pat. No. 3,498,253, this unit is electrically powered, and the drive mechanism is integral to the drive shaft, thereby preventing disassembly for other applications. In addition, the drive shaft is substantially rigid, thereby precluding a slight flex which has been found to be advantageous in relation to strong water currents.

Modular gas-driven power distribution system


An electrophotographic fixing member is provided, which is excellent in toner releasability and hard to change in rubber elasticity of a silicone rubber elastic layer. The fixing member is laminated with a substrate, a cured silicone rubber layer, a cured silicone rubber adhesive layer and a fluorine resin layer, wherein when infrared light absorption strength ratios (1020 cm−1/1260 cm−1) at 1020 cm−1 and 1260 cm−1 determined by sampling the portions of 5 μm and 20 μm from the outer surface of the cured silicone rubber layer are taken as α(5) and α(20), respectively, a relationship of α(5) and α(20) satisfies1.03≦α(5)/α(20)≦1.30and α(20) is 0.8 or more and 1.2 or less.

1. Field of the Invention
The present invention relates to a manufacturing method of an electrophotographic fixing member and an electrophotographic fixing member. It also relates to a fixing apparatus and an electrophotographic image forming apparatus using the same.
2. Description of the Related Art
In general, in a heat-fixing apparatus used for electrophotographic system, members of rotation such as a pair of heated rollers and rollers, a film and a roller, and a belt and a roller are press-contacted.
A recording material holding an image by an unfixed toner is introduced into a press-contact region formed between these members of rotations and heated, thereby to melt the toner to fix the image on the recording material.
The member of rotation to which the unfixed toner image held on the recording material contacts is referred to as a fixing member, and according to its form, it is referred to as a fixing roller, a fixing film, and a fixing belt.
These fixing members are known to dispose silicone rubber layers having heat resistance on a substrate formed by metal or heat resisting resin and the like and coat these layers with release layers made of fluorine resin with silicone rubber adhesives. As a silicone rubber composition used for the formation of the silicone rubber layer, an addition curing type silicone rubber is in heave usage in view of workability.
Further, as the silicone rubber adhesive, the one using an addition curing type silicone rubber adhesive is known, which has a self-adhesiveness in a liquid state or a pasty state (Japanese Patent Application Laid Open No. 2005-238765). This is because the addition curing type silicone rubber adhesive adheres the silicone rubber layer with the release layer made of fluorine resin in a good state.
The fixing member having a configuration as described above can enclose and melt the toner image without compressing it excessively because of an excellent elastic deformation of the silicone rubber layer. Hence, this has an effect of preventing an image displacement and bleeding and improving a color mixture. Further, this has an effect of following the unevenness of a fiber of the paper severing as a heated medium and preventing the occurrence of an irregularity of toner melting.
However, when the surface of the cured silicone rubber layer formed by using the addition curing silicone rubber is adhered with a fluorine resin layer serving as the release layer by using the addition curing type silicone rubber adhesive, the following problem has arisen. That is, the component of the silicone rubber adhesive inside the cured silicone rubber layer has infiltrated, and an unsaturated aliphatic group in the cured silicone rubber layer has been often reacted with active hydrogen in the adhesive, thereby inviting the rising in the hardness of the cured silicone rubber layer.
As a result, there are often the cases where the surface hardness of the fixing member rises, thereby diminishing the excellent advantage brought about by the elastic deformation of the silicone rubber layer.
Japanese Patent Application Laid-Open No. 2006-030801 proposes, with a view to solve such a problem, to suppress an amount of the unsaturated aliphatic group remaining in the silicone rubber layer after cross-linking of the silicone rubber layer. By adopting such a configuration, the reaction with the unsaturated aliphatic group in the silicone rubber layer and the active hydrogen in the adhesive can be suppressed. As a result, the rise in hardness of the silicone rubber layer accompanied with the use of the addition curing type silicone adhesive can be effectively suppressed.

Electrophotographic fixing member and manufacturing method thereof, fixing apparatus, and electrophotographic image forming apparatus