A package substrate embedded with a semiconductor component includes a substrate, a semiconductor chip, a first dielectric layer, a first circuit layer and first conductive vias. The substrate is formed with an opening for allowing the semiconductor chip to be secured therein. The semiconductor chip has an active surface and an inactive surface, wherein a plurality of electrode pads are formed on the active surface thereof and a passivation layer disposed thereon. The first dielectric layer is disposed both on the substrate and the passivation layer, wherein vias are formed at locations corresponding to those of the electrode pads and penetrating the dielectric layer and the passivation layer to expose the electrode pads therefrom. The first circuit layer is disposed on the first dielectric layer and electrically connected to the first conductive vias. The first conductive vias are disposed in the openings of the dielectric and passivation layers and the first circuit layer is electrically connected to the electrode pads, thereby allowing the first conductive vias to be electrically connected to the electrode pads of the chip.

As the semiconductor packaging technology advances, there have been developed various types of packages for semiconductor components. For example, one type of semiconductor component allows a semiconductor chip having an integrated circuit (IC) to be embedded in and electrically integrated with a package substrate. This semiconductor component may desirably reduce the overall size and improve the electrical functionality thereof, and thereby becomes widely adopted.
Referring to FIGS. 1A to 1L, a method for fabricating a conventional package substrate embedded with a semiconductor chip disclosed in U.S. Pat. No. 6,586,276 is shown. As shown in FIG. 1A, a wafer 10 having a plurality of electrode pads 101 is provided. As shown in FIG. 1B, a passivation layer is formed on the wafer 10. As in FIG. 1C, a first opening 110 is formed in the passivation layer 11 to expose the electrode pads 101. As shown in FIG. 1D, the passivation layer 11 and the exposed electrode pads 101 are covered with an adhesion layer 12. As shown in FIG. 1E, a protection layer 13 is then formed on the adhesion layer 12. As shown in FIG. 1F, the wafer 10 is cut to form a plurality of semiconductor chips 10a. As shown in FIG. 1G, a substrate 14 having an opening 140 is provided, and then one semiconductor chip 10a is placed into the opening 140 of the substrate 14 and secured there by a bonding material 15 formed in the gaps between the opening 140 of the substrate 14 and the semiconductor chip 10a. As shown in FIG. 1H, a conductive layer 16 is formed on top of the protection layer 13 of the semiconductor chip 10a, the bonding material 15 and the substrate 14. As shown in FIG. 1I, a resist layer 17 is then formed on the conductive layer 16 having resist openings 170 at locations corresponding to those of the electrode pads 101. As shown in FIG. 1J, expanded pads 18 are electroplated onto portions of the conductive layer 16 within the resist openings 170. As shown in FIG. 1K, the resist layer 17 and the underlying conductive layer 16, protection layer 13 and adhesion layer 12 are removed to expose the expanded pads and the passivation layer 11, wherein the expanded pads 18 are larger than the electrode pads 101 to facilitate alignment during subsequent lamination of a dielectric layer(s) and a circuit layer(s). As shown in FIG. 1L, finally, a circuit build-up structure 19 is then formed on the electrode pads 18, the passivation layer 11 and the substrate 14. The circuit build-up structure 19 includes at least a dielectric layer 191, a circuit layer 192 laminated on the dielectric layer and conductive vias 193 in the dielectric layer electrically connected with the expanded pads 18. The circuit build-up structure 19 further includes a plurality of conductive pads 194 on the surface thereof for electrically connecting the circuit layer 192. An insulating protective layer 195 is also formed on the circuit build-up structure 19 having a plurality of openings 1950 that correspondingly expose the conductive pads 194.
As can be seen from the above, regarding a conventional package substrate embedded with a semiconductor chip, before dicing the wafer 10 into a plurality of semiconductor chips 10a, an adhesion layer 12 has to be formed on the passivation layer 11 and the electrode pads 101, and then a protection layer 13 is formed on the adhesion layer 12. Although the adhesion layer 12 and the protection layer 13 facilitate subsequent processes of the semiconductor chip in the substrate, the exposed portions of the adhesion layer 12 and the protection layer 13 have to be removed before lamination of the dielectric layer 191 and the circuit layer 192 can be performed. As a result, the formation of the expanded pads 18 and electrically connection cannot be performed at the same time, which increases manufacturing cost and time. Furthermore, the electrically connecting structure including the expanded pads 18 and the conductive vias 192 is a complicated structure.
Therefore, there is a need for a package substrate embedded with a semiconductor component, which enables reduction of manufacturing costs and time as well as structural complexity.

Package substrate embedded with semiconductor component


A vehicle seat assembly includes a seat back that is pivotally connected to a seat bottom, a lock mechanism that is configured to inhibit the seat back from pivoting when locked and to permit the seat back to pivot when unlocked, and a release and drive mechanism. The release and drive mechanism includes a mounting member, a drive gear that is rotatable with respect to the mounting member and that is connected to the lock mechanism, and a motor that is connected to the drive gear. The drive gear is rotationally limited to a defined angular range. The motor rotates the drive gear through the defined angular range which moves the lock mechanism to an unlocked state and thereafter causes the seat back to pivot.

1. Field of the Invention
Embodiments of the invention disclosed herein relate to the field of vehicle seat assemblies having a seat back that is pivotable with respect to the seat bottom and include a release and drive mechanism for unlocking the seat back to pivot with respect to the seat bottom and pivoting the seat back with respect to the seat bottom.
2. Background Art
Vehicle seat assemblies having a seat back that is pivotable with respects to an associated seat bottom are known. In some embodiments of such vehicle seat assemblies, it is possible to fold the seat back forward on top of the seat bottom to provide added room and/or additional floor surface for the storage of cargo.
Such vehicle seat assemblies typically include a locking mechanism which inhibit rotation of the seat back with respect to the seat bottom when locked and which permits rotation of the seat back with respect to the seat bottom when unlocked. In such vehicle seat assemblies, the locking mechanism must first be unlocked before the seat back may be folded forward over the seat bottom.
It is desirable to unlock the locking mechanism and control the pivot motion of the seat back using a single motor driven mechanism. Embodiments of the present invention address this and other problems.

Vehicle seat having a recliner mechanism


A power supply unit for an electronic device comprises a three-terminal regulator in a high voltage connection line between a high voltage terminal of a DC power supply circuit and a microcomputer for reducing voltage from the high voltage terminal to a lower first voltage. A low voltage connection line between a low voltage terminal of the power supply circuit and the microcomputer is connected to the high voltage connection line at a connection point on output side of the regulator. In standby mode, voltage from the high voltage terminal, set higher than the first voltage, is reduced by the regulator to the first voltage and supplied to the microcomputer. In power-on mode, voltage from the low voltage terminal, set higher than the first voltage, is applied to the connection point so as to inactivate the regulator and supply the voltage from the low voltage terminal to the microcomputer.

1. Field of the Invention
The present invention relates to a power supply unit for an electronic device such as an electronic device having a tuner.
2. Description of the Related Art
Generally, an electronic device such as a television receiver, to be connected to an AC power supply in use, is internally provided with a power supply unit such as a switching power supply to convert a voltage from the AC power supply to multiple different voltages for output. In the case of a television receiver, an internal switching power supply, for example, is provided to supply multiple kinds of voltages such as a relatively high voltage output (e.g. 33 volts) for operating a tuner and a relatively low voltage output (e.g. 7 volts) for operating a microcomputer. This will be described below with reference to FIG. 2.
FIG. 2 is a schematic block diagram of a conventional power supply unit Pc which is used for a television receiver as an electronic device. Referring to FIG. 2, the conventional power supply unit Pc, which has a DC power supply circuit 103 with multiple voltage output terminals, will be described. The power supply unit Pc comprises a microcomputer 107, a control circuit 106, a DC power supply circuit 103, an on/off controllable four-terminal regulator (high voltage) 108 and an on/off controllable four-terminal regulator (low voltage) 109 as well as regulators attached to the microcomputer 107, on/off controllers operated by the microcomputer 107, and diodes as shown. The DC power supply circuit 103 has two voltage output terminals, i.e. a high voltage terminal 101 for outputting a relatively high voltage V1 and a low voltage terminal 102 for outputting a relatively low voltage V2. The high voltage terminal 101 is connected via a diode to a television tuner 104 of a television receiver (not entirely shown), while the low voltage terminal 102 is connected via a diode to a small load circuit 105 (e.g. a lamp circuit of the television receiver). An AC power source is connected to the primary side of the DC power supply circuit 103.
The DC power supply circuit 103 is connected to the microcomputer 107 via the control circuit 106 which serves as a driver circuit. When a user switches the operation mode of the television receiver from normal power-on (power supply-on) mode to standby (power standby) mode, the microcomputer 107 outputs a voltage reduction command to the control circuit 106 so as to reduce the output voltages V1, V2 of the high voltage terminal 101 and low voltage terminal 102, respectively. Specifically, the output voltages V1 and V2 from the high voltage terminal 101 and low voltage terminal 102 are set to be 33 volts and 8 volts, respectively, when the television receiver is in the power-on mode. When the television receiver is switched to the standby mode, the output voltages from the high voltage terminal 101 and low voltage terminal 102 are reduced to 8 volts and 4 volts, respectively. The standby mode thus allows the power consumption to be significantly saved. Furthermore, the output from the high voltage terminal 101 is connected to the microcomputer 107 via the on/off controllable regulator 108, while the output from the low voltage terminal 102 is connected to the microcomputer 107 via the on/off controllable regulator 109.
For operating the microcomputer 107 in the power supply unit Pc, specifically, the voltage of a voltage supply point (point A) to the microcomputer 107 is to be at least 7 volts. In order to provide the voltage of the voltage supply point (point A), which is to be supplied to the regulators attached to the microcomputer 107, the output voltage from the regulator 108 connected to the high voltage terminal 101 and the output voltage from the regulator 109 connected to the low voltage terminal 102 are switched by controlling the on/off switching of the regulators 108, 109. Note that the regulators 108, 109 are four-terminal on/off controllable regulators, which, when turned on, reduce the voltages from the high voltage terminal 101 and low voltage terminal 102 to 7 volts (the same voltage) so as to output this voltage of 7 volts, and which, when turned off, stop output.
More specifically, when the operation mode of the television receiver is power-on mode, the regulator 108 is switched off while the regulator 109 is switched on, so as to reduce the voltage V2 (8 volts) from the low voltage terminal 102 to 7 volts, which is then supplied to the voltage supply point (point A) to supply the voltage (7 volts) to the regulators attached to the microcomputer 107. On the other hand, when the operation mode is standby mode, the regulator 108 is switched on while the regulator 109 is switched off, so as to reduce the voltage V1 (8 volts) from the high voltage terminal 101 to 7 volts, which is then supplied to the voltage supply point (point A) to supply the voltage (7 volts) to the regulators attached to the microcomputer 107. Thus, the conventional power supply unit Pc is advantageous in that regardless of the operation mode, the input voltage (8 volts) to the regulators 108, 109 is close to the output voltage (7 volts) from the regulators 108, 109, so that the heat loss in the regulators 108, 109 can be reduced. However, the conventional power supply unit Pc at the same time has problems as described below.
That is, there is a risk that there may be a moment when both regulators 108, 109 are in the off state because the timing of switching the regulator 108 on/off is not synchronized with the timing of switching the regulator 109 on/off at such moment. In this case, there is a risk that the supply voltages to the microcomputer 107 may become lower than a minimum required voltage, thereby causing a malfunction. Another problem is that it is required to install, in the microcomputer 107, a control program for the on/off control of the regulators 108, 109. At the same time, the microcomputer 107 is required to have ports for outputting on/off control signals to the regulators 108, 109. This makes it necessary to provide signal lines to be connected to these ports. This is also a problem because it reduces the degree of freedom in circuit design.
Technologies relating to power supply units in this field include those described below. For example, in the electronic device with a power supply unit as described above, a malfunction is caused when the timing of the voltage supply to the microcomputer is not synchronized with the timing of the voltage supply to circuits other than the microcomputer. In order to allow the timing of the voltage supply to the microcomputer to be accurately synchronized with the timing of the voltage supply to other circuits than the microcomputer, a known malfunction prevention device is designed such that multiple voltages output from a power supply unit are converted to the same voltage via a regulator, and are logically summed by a logic circuit, the output of which is input to the microcomputer (refer to e.g. Japanese Laid-open Patent Publication Hei 5-143202).
There is also a system consisting of a modem with a built-in single chip CPU (Central Processing Unit) connected to an external data communication terminal which supplies a voltage to the modem. The modem has a regulator circuit and a DC-DC converter circuit as well as a voltage determination circuit therein for selecting either the regulator circuit or the DC-DC converter circuit according to the kind of voltage supplied from the data communication terminal, so as to form a voltage conversion circuit to supply a predetermined voltage to the single chip CPU through selected one of the regulator circuit and the DC-DC converter circuit (refer to e.g. Japanese Laid-open Patent Publication Hei 8-22335). The technologies described in these patent documents, however, cannot solve the problems as described above.

Power supply unit for an electronic device such as an electronic device having a tuner


A decking extrusion for use in forming the deck members used to construct outdoor decks, docks, and similar structures is disclosed. The extrusion has an elongate planar base panel (7) with a first elongate side edge (8), and a spaced parallel elongate second side edge (9). At least one first elongate leg member (12) extends the length of the first side edge of the base panel, and at least one elongate second leg member (15) spaced from and parallel to the first leg member extends the length of the second side edge of the base panel. A first locking element (17) is formed at the distal end of the first leg member, and a corresponding locking element (30), sized and shaped to receive a second one of the first locking elements therein, is formed at the distal end of the second leg member. The extrusion may also be provided with an intermediate stiffening leg (126) having a transverse flange (127) formed at its distal end parallel to the base panel to add structural rigidity to the extrusion. Two identical ones of the extrusion are joined together to form an elongate deck member by placing the two extrusions in a 180.degree. reverse relationship with respect to one another such that the second locking element of the second extrusion is received on the first locking element of the first extrusion, while the first locking element of the second extrusion is received on the second locking element of the first extrusion, respectively, whereupon the extrusions are joined together in a snap-fit at the respective locking elements to form an elongate hollow box beam or deck member.

Dimensional lumber has long been used in the construction of outdoor structures, to include decks attached to homes, or docks used for access to watercraft, for example. Dimensional lumber offers the advantage of relatively low cost, and it can be quickly and easily cut to size and joined together to form the desired structure. However, a significant disadvantage when using dimensional lumber in outdoor applications, even if the lumber is pressure treated. is the fact that the lumber is exposed to the elements, and over time the lumber will inevitably begin to crack, split, fade, and splinter. This problem can be overcome by painting or staining the exposed surfaces of the lumber and by performing periodic maintenance on the structure, but this becomes a time consuming and expensive ordeal as the lumber weathers over time. Also, lumber is significantly affected by ambient weather conditions, primarily heat and moisture, so that the lumber tends to warp or twist over time.
In the effort to combat these known problems with the use of dimensional lumber in constructing decks and docks, the use of extruded structural components has been developed. These extrusions may be either of a plastic or a metallic material for example, aluminum, or the decking planks may even be comprised of a plastic resin, as was done in U.S. Pat. No. 4,349,297 to Misener. Common examples of extruded decking/docking systems are disclosed in U.S. Pat. Nos. 4,947,595 to Douds, et al., disclosing an extruded metal plank for use in the construction of deck surfaces; 5,009,045, and 5,048,448 to Yoder, disclosing a plank structure for a boat dock and the like, as well as a boat dock structure, respectively; and, more recently, in U.S. Pat. No. 5,613,339 to Pollock, which discloses a decking system using two different extrusions of two different constructions which, when joined together, form an elongate deck plank.
Although the aforementioned patents provided deck planks, or dock structures which address the problems of dimensional lumber, problems still persist with the use of this type of extruded decking. For example, in the patent to Douds, et al., the extruded metal plank most closely resembles decking used in industrial applications, and does not appear to be particularly well-suited for use in residential applications, for example the construction of home decks and docks, due to cost considerations coupled with the fact that exposed flanges are left as a part of the deck extrusion which might lead to accidental injury. Also, as the extrusion of Douds, et al. is made of metal, it may tend to burn the feet of people walking barefoot on a sun exposed deck, as would commonly occur on non-commercial decks or docks, and may be relatively slippery when wet.
Similarly, the '448 patent to Yoder discloses a plank structure for a boat dock which has the disadvantage that a first extruded plastic strip of a first design must be secured to the frame of the deck or dock structure, the strip having a number of protrusions formed therein for receiving the plank structure of the '045 Yoder patent, which thus necessitates that these spaced and opposed strips be precisely aligned with one another during construction of the deck/dock, which, as any person of ordinary skill in the construction arts is aware, becomes a difficult task in the field. Thereafter, an extrusion of a second different construction, the extruded "plank" of the '045 patent, must be positioned over the spaced, parallel, and aligned extrusions disclosed in the '448 Yoder patent, and then fastened thereto.
Similarly, the patent to Pollock discloses a first extrusion which must be placed on the support structure of the deck or dock and fastened thereto, whereupon a second, different extrusion is positioned on top of the first extrusion, and snapped into place to form the deck plank. Moreover, Pollock teaches that these two extrusions are formed of two different plastics, the second or surface extrusion being made of a more pliable material. Similarly, the '045 Yoder patent also discloses the use of two differing plastic materials to extrude the second of the two decking system extrusions used.
Although the patents to Yoder and Pollock offer the advantage of a plastic material, which is well suited for use in residential applications, these patents have the disadvantage that two differing extrusions are used which must be "joined" together to form the deck or dock structure during construction in the field. This necessitates that two different extrusions be manufactured, at significant expense as this impacts the costs of designing and tooling the differing extrusion dies to be used, as well as increasing material costs in that an inventory of two different extrusions must be maintained in order to be able to sell the boat dock structure, or deck plank of the Yoder and Pollock patents, respectively.
One-piece metallic extrusions have been developed which have been constructed and arranged to be fastened to one another in a 180.degree. reverse relationship to form an elongate structural member. Examples of such extrusions are disclosed in U.S. Pat. Nos. 3,282,005 to Birdwell; 4,987,717 to Dameron, Jr.; and 5,031,083 to Claesson. These extrusions, however, appear to be poorly suited for use as load bearing structural components in deck and dock applications, and instead appear to be specialty extrusions. For example, the extrusion of Birdwell is a single one-piece extrusion which is placed in a 180.degree. reverse relationship by sliding the two extrusions together, along their length and end first, to loosely mate them together, whereupon the two extrusions are then tack-welded to hold them in position relative to one another, in conjunction with spacer shims placed between the two extrusions so that the extrusion is loosely formed as a structural box beam. Thereafter, the extrusion is then fastened to a building, for example a building facade, as a decorative and not a load-bearing component by placing spaced fasteners through the slot between the two extrusions to complete the "formation" of the box beam.
Similarly, the extrusion of Dameron, Jr. appears also to be used for decorative and/or non load-bearing purposes, only, although it may also be used as used as a gutter facade, i.e. as a gutter, along the roof line of a residential or commercial structure. The extrusion of Dameron, Jr. may also be used as a box beam, however, but apparently only as a decorative facia or other non-load bearing structural/aesthetic component. The extrusions of Dameron, Jr., as well as the extrusion to Birdwell, are mated by sliding two identical extrusions together, ends first and along their length, once placed in an overlying 180.degree. reverse relationship with respect to one another, to form the extrusions into a box beam. Moreover, the extrusion of Dameron, Jr. would not be useful as a deck or dock component because it appears to be much too fragile to carry or support a load along its length, and its method of assembly is highly impractical for decks/docks because it would require workers to be positioned on ladders outside or off of the structural support framework of the deck or dock, to include even standing in, or floating on water, for example, in order to slide the two extrusions together to form the box beam once a first of the extrusions is fastened to the support framework. This is extremely unworkable in that the construction of decks and docks requires not only speed and efficiency, but safety as well when constructing the structure.
The extrusion of Claesson is used for creating cable runs in which electrical cables, for example, are housed. The extrusion of Claesson, however, also makes provision for the placement of light-emitting diodes, or other light-emitting devices thereon, so that two extrusions, when placed together, form an elongate "box beam" which can apparently be used for decorative purposes also. The extrusion of Claesson, however, offers the disadvantages that it does not have a uniform cross-section which thus leads to differential cooling during the extrusion process as well as leading to uneven material flow through the extrusion die, all of which tends to cause twisting and warping within the extrusion, which must be minimized to the greatest extent possible during the manufacturing process for maximizing production efficiency and minimizing production costs by minimizing waste or spoilage. Moreover, the profile of Claesson results in overlapped side joints, which complicates assembly by requiring careful joining of the two profiles, as well as increased weight, and thus material costs, in the construction of the "profile."
What is needed, therefore, is a one-piece extrusion which can be used to construct an elongate deck plank, and which can be easily and quickly installed in the field for constructing the deck or dock with which the extrusion is being used. What is also needed, but seemingly unavailable in the art, is the provision of a one-piece extrusion which can accomplish this task, yet which can be manufactured of recycled plastic for the purposes of reducing manufacturing costs, and also for benefiting the environment by recycling waste plastics commonly used in consumer and commercial applications and supplies of which are readily available. An additional need is for a one-piece extrusion which will not require a second extrusion which must first be placed in position, and to which a second different extrusion must be fit in order to construct a deck or dock, as well as minimizing both manufacturers', distributors', and contractors' inventory by requiring that only a single style of a one-piece extrusion be maintained in inventory, as opposed to differing extrusions of differing design. Moreover, there is a need for such an extrusion which can be made of either a virgin or recycled plastic, or even a combination of the two.


The present invention relates to a connector (1) for flat flex cables (2), with a housing (3), in which is provided: at least one introduction opening (4) for one end of a flat flex cable, spring contacts (5) for connecting the at least one flat flex cable (2) with contacts (6) or with another flat flex cable (7) and at least one strain relief (8). The strain relief (8) has a slide (9), which is introduced into the introduction opening (4) above the flat flex cable (2), the flat flex cable (2) being bent by a rib (10) on slide (9) into a recess (11) in the bottom of introduction opening (4) until the slide (9) locks into its final position on housing (3).

Such a connector is known, for example, from GB-1,317,264 B1. The connector described therein has, in a housing, spring contacts which are pressed against regions of the flat flex cable that are stripped of insulation, while the opposite-lying ends of these spring contacts are in the shape of female connectors for the uptake of male connectors. The connection of two flat flex cables with one another is carried out by direct contact of the parts of the flat flex cable that are stripped of insulation. The overall structure of the connector described therein has proven to be complicated with respect to its handling and an effective strain relief cannot be recognized.

Connector for flexible flat strip cables


A mixing valve has a valve housing formed with a seat, a flow-controlling valve cartridge fitted to the seat, and a cover engageable over the cartridge, pivotal on the cartridge about a first axis, and formed with an aperture. A handle engaging through the aperture with the cartridge is pivotal through an arc of less than 360.degree. about the first axis with the cover for controlling a characteristic of flow through the valve cartridge and is pivotal about a second axis generally perpendicular to the first axis for controlling another characteristic of flow through the valve cartridge. Interengaging formations on the cover and on the housing allow relative axial movement of the cover and the housing in an angular position of the cover relative to the housing outside the arc and prevent relative axial movement of the cover and the housing inside the arc.

In commonly owned U.S. Pat. No. 4,610,272 a faucet is disclosed having a mixing-valve actuator comprising a valve housing and a valve member movable by a hand lever which is partly accommodated within the housing and operatively connected to the valve member. The hand lever is movable about two axes perpendicular to each other and is provided with an arcuate portion that projects through a slot of a valve cover into the interior of the housing where it is connected to the movable valve member. The arcuate portion has an inner shape that is aligned with the adjacent part of the cover and has a radius extending from a point on one of the axes.
As the lever is rotated about the center axis of the cartridge, on which the cover is normally centered, it control one characteristic of flow through the cartridge, normally mixing ratio and when tipped about a second axis perpendicular to the first axis it controls another characteristic of flow through the cartridge, normally volume. As a rule the cover itself is rotatable on the housing with the lever and is formed with an aperture constituted as a slot centered on a plane including the first axis and perpendicular to the second axis.
The cover is normally a two-piece affair interconnected by a screwthread. It must be carefully assembled and fitted to the housing, and has a tendency to come loose or apart after some use.


A drilling tool is disclosed. The two ends of the drilling tool are respectively connected with an upper drilling tool and a drill bit. The drilling tool includes an axial striking part, a torsional striking part, and an auxiliary part. Under the combined action of a spring and a high-pressure drilling fluid, the hammer of the axial striking part generates an axial striking force to strike the upper housing; and the pendulum of the torsional striking part generates a torsional striking force to strike the lower housing. The reversing switch and the center tube are plugged together to simultaneously reverse torsion and axial striking forces, respectively. The high-pressure drilling fluid pushes the hammer and the pendulum to generate axial and torsional striking forces, respectively, to effectively increase the ROP and reduce the stick-slip phenomenon. The drilling tool is stable and reliable in a complex and changeable downhole environment.

With the gradual exhaustion of shallow land oil and gas resources, the development of the deeper wells, the ultra-deep wells and new oil and gas resources has gradually become a trend. In deeper well and ultra-deep well drilling operations, the ROP is low during the drilling process due to the difference of factors such as stratum drill ability, strong rock wear resistance, rock compressive strength and shear strength, etc. In addition, the elongated drill string system is prone to stick-slip phenomenon, which reduces the efficiency of drilling operations. The existing downhole striking tools are basically a single axial hammer or a single torsional hammer, and their use is effects are general.
Therefore, how to simultaneously generate axial and torsional striking forces to increase the ROP and reduce the stick-slip phenomenon of the drill string system is a key technical problem that this field is eager to solve.


A system and method for parsing a data stream comprises a production rule table populated with production rules, a parser table populated with production rule codes that correspond to production rules within the production rule table, and a direct execution parser to identify production rule codes in the parser table and to retrieve production rules from the production rule table according to the identified production rule codes, the direct execution parser is operable to parse a data stream according to the retrieved production rules.

In the data communications field, a packet is a finite-length (generally several tens to several thousands of octets) digital transmission unit comprising one or more header fields and a data field. The data field may contain virtually any type of digital data. The header fields convey information (in different formats depending on the type of header and options) related to delivery and interpretation of the packet contents. This information may, e.g., identify the packet's source or destination, identify the protocol to be used to interpret the packet, identify the packet's place in a sequence of packets, provide an error correction checksum, or aid packet flow control. The finite length of a packet can vary based on the type of network that the packet is to be transmitted through and the type of application used to present the data.
Typically, packet headers and their functions are arranged in an orderly fashion according to the open-systems interconnection (OSI) reference model. This model partitions packet communications functions into layers, each layer performing specific functions in a manner that can be largely independent of the functions of the other layers. As such, each layer can prepend its own header to a packet, and regard all higher-layer headers as merely part of the data to be transmitted. Layer 1, the physical layer, is concerned with transmission of a bit stream over a physical link. Layer 2, the data link layer, provides mechanisms for the transfer of frames of data across a single physical link, typically using a link-layer header on each frame. Layer 3, the network layer, provides network-wide packet delivery and switching functionality—the well-known Internet Protocol (IP) is a layer 3 protocol. Layer 4, the transport layer, can provide mechanisms for end-to-end delivery of packets, such as end-to-end packet sequencing, flow control, and error recovery—Transmission Control Protocol (TCP), a reliable layer 4 protocol that ensures in-order delivery of an octet stream, and User Datagram Protocol, a simpler layer 4 protocol with no guaranteed delivery, are well-known examples of layer 4 implementations. Layer 5 (the session layer), Layer 6 (the presentation layer), and Layer 7 (the application layer) perform higher-level functions such as communication session management, data formatting, data encryption, and data compression.
Not all packets follow the basic pattern of cascaded headers with a simple payload. For instance, packets can undergo IP fragmentation when transferred through a network and can arrive at a receiver out-of-order. Some protocols, such as the Internet Small Computer Systems Interface (iSCSI) protocol, allow aggregation of multiple headers/data payloads in a single packet and across multiple packets. Since packets are used to transmit secure data over a network, many packets are encrypted before they are sent, which causes some headers to be encrypted as well.
Since these multi-layer packets have a large number of variations, typically, programmable computers are needed to ensure packet processing is performed accurately and effectively. Traditional programmable computers use a von Neumann, or VN, architecture. The VN architecture, in its simplest form, comprises a central processing unit (CPU) and attached memory, usually with some form of input/output to allow useful operations. The VN architecture is attractive, as compared to gate logic, because it can be made "general-purpose" and can be reconfigured relatively quickly; by merely loading a new set of program instructions, the function of a VN machine can be altered to perform even very complex functions, given enough time. The tradeoffs for the flexibility of the VN architecture are complexity and inefficiency. Thus the ability to do almost anything comes at the cost of being able to do a few simple things efficiently.

Parser table/production rule table configuration using CAM and SRAM


The present invention relates to a modifier composition, a stock mixture and a final composition comprising a fluoro elastomer and a thermoplastic polyamide, as well as to the film obtained from the final composition.

It is generally accepted that during the extrusion of plastic, irregularities in the flow appear at the die outlet when a critical shear rate is exceeded. Below this rate, the extrudates are smooth, whereas, above this critical rate, surface defects are observed. These defects, which are referred to as "melt fracture", are in several forms. At a shear rate slightly above the critical rate, the films obtained by extrusion-blow moulding lose their transparency and their sheen. For markedly higher rates, which correspond to a higher production efficiency, homogeneity defects with smooth zones in a rough surface appear. These defects significantly decrease the optical and mechanical properties of the film. The same phenomena may be observed on extruded rods. When the surface of the rods loses its sheen and becomes dull and rough, it is often compared to an "orange skin".
Among the various solutions proposed to overcome this drawback, the use of modifiers is of greater value industrially. Thus, in U.S. Pat. No. 3,334,157, the incorporation of polytetrafluoroethylene improves the optical properties of the polyethylene film. According to U.S. Pat. Nos. 4,855,360 and 5,015,693, a fluoro elastomer in combination with a polyoxyalkylene is used to improve the conversion of hydrocarbon polymers. Organophosphates or organophosphites in combination with a fluoro elastomer have been described in U.S. Pat. Nos. 4,983,677 and 4,863,983 in order also to improve the conversion of hydrocarbon polymers.
However, additives such as anti-blocking agents, fillers, pigments, dyes and stearates, which are essential for the conversion of plastics, interact with these fluoro elastomers and significantly reduce their efficacy. To attempt to overcome this drawback, one process consisting in firstly treating the extruder die with modifiers and then in converting the plastics has been described in patent WO 91/05007. The modifier used contains a functionalized fluoro copolymer comprising tetrafluoroethylene units and a functional group containing a fluoro monomer. This process has the drawback of taking place in two steps.

Composition including a fluoroelastomer and a thermoplastic polyamide and resulting film


Foam for making pads and belts with controlled, reproducible microcellular structure and method of making such foam in a fast and efficient manner. Under constant pressure and temperature, a prepolymer is mixed with the nucleation surfactant in a tank in the presence of a frothing agent metered into the tank by way of a dip tube or sparge. The nitrogen gas is sheared into small bubbles and is drawn off from the headspace of the tank creating a continuous flow of nitrogen. The pressure of the tank may vary from any absolute pressure down to near complete vacuum, thereby all but eliminating the pressure requirement. The froth of the present invention has a more consistent cell structure and increased cell count.

1. Field of the Invention
The present invention relates to an improved foam and method of producing such foam for a variety of applications, including semiconductor polishing pads and belts.
2. Description of the Related Art
Silicon wafers are produced as precursors from which microelectronic semiconductor components are produced. The wafers are sliced or cut from cylindrical silicon crystals, parallel to their major surfaces, to produce thin disks, typically 20-30 centimeters in diameter, although larger or smaller wafers are possible. The resulting wafers must be polished to give flat and planar surfaces for proper formation of electronic components to form integrated chip semiconductor devices. Typically, a 20-cm diameter wafer will produce 100 or more microprocessor chips.
The design size of such integrated chips is steadily decreasing, while the number of layers applied, e.g., by various sequences of depositing, patterning, and etching of features onto the silicon surface, is rising. Present semiconductors typically incorporate up to 8 or more metal layers, and it is expected that future designs will contain even more layers. The decrease in the size of the circuitry and the increase in the number of layers applied are leading to even more stringent requirements on the smoothness and planarity of the silicon and semiconductor wafers throughout the chip manufacturing process, since uneven surfaces may undermine the patterning process and the general integrity of the resulting circuit.
In the semiconductor chip fabrication process, it is well-known that there is a need to polish a semiconductor wafer. This polishing is typically-accomplished by a chemical mechanical process (CMP). One standard CMP wafer polishing technique is to position a wafer over a rotating polishing pad that is usually disk-shaped, and is mounted on a large turntable. A chemical-mechanical polishing slurry is usually applied to the surface of the pad, and the wafer is held in place by an overhead wafer carrier while being polished by the rotating pad and slurry. The slurry is generally made up of an aqueous solution with metallic or non-metallic particles such as, for example, aluminum or silica abrasives that create the added friction for the polishing process.
A significantly different approach is the so-called Linear Planarization Technology (LPT), wherein the polishing pad is mounted onto a supporting belt and is used to polish the wafer, in place of the flat turntable form of the polishing tool. The belt used in this method is described in EP-A-0696495 and comprises an endless sheet of steel or other high strength material, having a conventional flat polyurethane polishing pad affixed to it with adhesive. As with the rotating pad, the pad used for LPT CMP polishing receives a chemical-mechanical polishing slurry that is distributed over the surface of the belt.
State of the art semiconductor polishing pads are made from high density polyurethane foams that have a functional porous structure, which aids the distribution of the chemical-mechanical polishing slurry and reduces hydroplaning, for example. Such pads are formed from a polymeric composition that comprise a dispersion of thin-walled, hollow plastic beads or "microspheres," which can potentially provide a controlled and consistent microcellular structure.
However, there are some limitations to the use of hollow microspheres in polishing pads. The size and shape of the foam's cells are restricted to the limited sizes and shapes of the commercially available microspheres. In addition, microspheres may be too abrasive for some delicate polishing operations, e.g. certain steps in semiconductor manufacturing including, but not limited to, chemical mechanical polishing of soft metal layers. Typically, the microspheres are extremely light weight and flammable, posing significant material handling difficulties, including dust explosion hazards. The lightweight microspheres are also difficult to disperse in the polyurethane resins. They tend to clump and foul process equipment, and often entrain significant amounts of air, which leads to problematic variations in porosity of the cured foam. Also, the microspheres can distort, collapse, or melt if processed at high temperatures that are routinely used in processing polyurethanes and other potential pad materials.
Foam density, a measurement of the mass of froth per unit volume, is one of the most important properties of froth, directly affecting the durability and support of the foam. It is commonly measured and expressed in pounds per cubic foot (pcf) or kilograms per cubic meter (kg/m3), but may also be stated as g/cc. Foam density is directly related to the specific gravity of the foam.
Although there are several conventional ways to create high density polyurethane foam, including mechanical frothing and chemical blowing processes, pads produced by the conventional methods have not been successful in semiconductor polishing. While the polishing pads produced by the conventional method may be suitable for polishing glass and other low technology applications, they have not been as successful in semiconductor polishing, which is a more precise and more delicate application, because of the variability in pad cell structure and pad properties. Often times, the density of the foam produced by these conventional frothing methods varies greatly due to the conventional methods' inability to consistently produce foam within a preferable range of specific gravities or because of impurities, e.g. oxygen, contained within the foam. Another significant drawback of the prior art frothing methods is the time involved in producing the froth. Consequently, there is a need for a time efficient method of manufacturing froth falling within an optimal specific gravity range.


An electrical receptacle assembly includes an electrically insulative board, such as a silicon-based printed circuit board (PCB), with electrical contacts mounted to the board to form a high voltage AC receptacle configured to receive a male plug associated with an electrical consumer. The electrical contacts may be mechanically connected directly to the board and receive electrical power from respective wires fitted with terminal connectors, or may be supported in receptacle assemblies that receive electrical power from conductors embedded in the board. Optionally, the electrical contacts are mounted directly to a separate receptacle board that extends outwardly from a main board. A low voltage receptacle and associated circuitry may be incorporated into the receptacle assembly, which may further include an outer housing to facilitate mounting in a work area or the like.

The need or desire to incorporate electrical power outlets in different locations has increased as portable electronic devices such as mobile phones, portable media players, laptop computers, and the like have proliferated, since these devices often require charging of onboard batteries. Such devices or their charging cords often require access to high voltage (e.g., 110V AC or 220V AC) power outlets, which are typically assembled into bulky housings using techniques and hardware such as butt splices for lengths of wire or other conductors, and numerous threaded fasteners.

PCB-mounted high voltage electrical outlet


The invention relates to a luminaire with at least one LED and a method for operating the luminaire. The luminaire has a sensor for detecting at least a part of the light emitted by the LED and also a control unit for evaluating the sensor signals and for influencing the LED in a manner dependent on the sensor signals. After the luminaire has been switched on, a specific LED current flows and the light intensity of the LED is checked. In the case of a light intensity below a reference value, the LED current is raised by a defined value.

1. Technical Field
The invention relates to a luminaire with at least one LED as luminous means and a method for operating the luminaire.
2. Prior Art
The light intensity of luminaires with LEDs is subject to fluctuations depending on the age and on the temperature of the LEDs. The ageing process has a particularly serious effect. A reduction of the light intensity to just 50% or less is possible. The light intensity changes only slowly and the alteration can hardly be perceived from the vicinity of operators.
A reduction of the light intensity is particularly critical in connection with applications for which specific luminous ranges are legally prescribed. A main area of application of the invention is navigation luminaires on ships. Luminaires of this type are also referred to as position lanterns and must have a luminous range of two nautical miles in the USA, for example. Other countries have in part different regulations.
When the light intensity of the LED decreases, the actual luminous range may fall below the legally prescribed value, so that the envisaged function is no longer fulfilled. Even without the presence of legal provisions, maintaining a specific light intensity for a luminaire is advantageous and desirable, for instance for illuminating traffic areas or properties or in connection with other types of signal and position luminaires.

Luminaire with LED(s) and method for operating the luminaire


Provided are a sense amplifier driver and a semiconductor device comprising the same. The sense amplifier driver outputting an enable signal for enabling a sense amplifier includes a first inverter, which receives an input signal and outputs an output signal swung between a ground voltage and a control voltage that is determined by the amount of an off-current flowing through at least one transistor existing in an inactive memory block, and a second inverter, which receives the output signal of the first inverter and delays and buffers the output signal of the first inverter by a period of time inversely proportional to a level of the control voltage. A point of time when the enable signal is activated varies according to a level of the control voltage. The semiconductor device detects data in response to the enable signal.

1. Field of the Invention
The present invention relates to a semiconductor device, and more particularly, to a sense amplifier driver, which is not affected by an off-current in a semiconductor device manufactured in a high temperature, fast process, and a semiconductor device comprising the same. Further, the present invention relates to a method of generating a sense amplifier enable signal, which is not affected by an off-current, and a method of detecting data using the sense amplifier enable signal.
2. Description of the Related Art
FIG. 1 is a diagram of a conventional memory cell used in a semiconductor device. Referring to FIG. 1, a memory cell 10 is comprised of one transistor 11 and one capacitor 12.
In general, the transistor 11 has a gate connected to a word line WL and one end connected to a bit line BL. The capacitor 12 for storing data is connected between the other end of the transistor 11 and a ground voltage source VSS.
As a deep submicron technology is developed, a threshold voltage of the transistor 11 decreases to improve the performance of the transistor 11. Here, the performance of the transistor 11 can be represented by the amount of a current Idsat that can flow from the transistor 11 in a turn-on state.
However, when the threshold voltage of the transistor 11 decreases, the amount of a current (referred to as 'on-current' hereinafter) that can flow from the transistor 11 in a turn-on state increases, and the amount of a leakage current (referred to as 'off-current' hereinafter) that flows through the transistor in a turn-off state increases.
An off-current Ioff generally changes according to variations in voltage or type of process, for example, according to whether the process is a fast process or a slow process. Here, the fast process is a process for manufacturing a transistor having high on-current Idsat, and the slow process is a process for manufacturing a transistor having low on-current Idsat.
However, under specific conditions, for example, in a high-temperature, fast process, the off-current Ioff increases enough to affect the on-current Idsat. In particular, considering a difference between the on-current Idsat and the off-current Ioff during the high-temperature, fast process in a structure where a plurality of memory cells constitute an array, advantages taken by lowering threshold voltages of the memory cells considerably decrease.
When a memory device provided with a memory cell is designed, there is a limitation in lowering the threshold voltage of the memory cell due to such an off-current.

Sense amplifier driver and semiconductor device comprising the same


A semiconductor memory device may include a semiconductor substrate, a control gate electrode recessed in the semiconductor substrate, a storage node layer between the control gate electrode and the semiconductor substrate, a tunneling insulating layer between the storage node layer and the semiconductor substrate, a blocking insulating layer between the storage node layer and the control gate electrode, and first and second channel regions surrounding the control gate electrode and separated by a pair of opposing separating insulating layers. A method of operating the semiconductor memory device may include programming data in the storage node layer by charge tunneling through the blocking insulating layer, thus achieving relatively high reliability and efficiency.

1. Technical Field
Example embodiments relate to a semiconductor memory device having a recessed control gate electrode.
2. Description of the Related Art
Semiconductor memory devices have become more integrated and faster in operation in response to the recent trend toward smaller and faster devices in the semiconductor industry. For example, three-dimensional (3-D) semiconductor memory devices have been introduced as alternatives to conventional planar semiconductor memory devices. A 3-D semiconductor memory device may include a control gate electrode recessed in a semiconductor substrate.
3-D nonvolatile semiconductor memory devices may have higher channel areas and operating currents than conventional planar semiconductor memory devices. The higher operating currents may result in increases in the speeds of the 3-D semiconductor memory devices. However, unit cells of the 3-D semiconductor memory devices may occupy relatively large areas and operate at a one bit level, thus presenting obstacles to increasing the integration density of the 3-D semiconductor memory devices.
Additionally, source and drain regions of the 3-D semiconductor memory devices may also occupy relatively large areas. For example, negative AND (NAND) type semiconductor memory devices may be configured such that the source and drain regions are alternately arranged, thus occupying relatively large areas and limiting integration density. Furthermore, the distribution of the electric field density of the 3-D semiconductor memory devices may not be uniform, thus decreasing efficiency and reliability in the programming and erasing operations.

Method of operating a semiconductor memory device having a recessed control gate electrode


A semiconductor device includes a plurality of first inductors having a spiral shape and provided in a modulator of a transmitting side, and a plurality of second inductors having a horseshoe shape and provided in an oscillator of a receiving side, the plurality of second inductors being arranged such that an opening of plurality of second inductors is disposed opposite to the plurality of first inductors. The semiconductor device performs a transmission process and a reception process using a radio wave.

Field of the Invention
The present invention relates to a semiconductor device, and is suitably usable for a semiconductor device having a structure capable of reducing unnecessary wave (spurious) of a transmitting unit, for example.
Description of the Background Art
Mobile communication devices such as mobile phones, personal digital assistants (PDAs), WiFi® (Wireless Fidelity) transceivers, and other communication devices transmit/receive communication signals in various frequencies.
In particular, in a mobile phone or the like, an LTE (Long Term Evolution)/W-CDMA/GSM® triple mode transceiver or the like has been used.
For efficient communication, transmission and reception signals have frequencies several times higher than baseband information signals that carry information to be communicated. Accordingly, each of such transceivers has to up-convert a transmission signal and down-convert a reception signal using a frequency modulator.
In response to a request for downsizing, such a transceiver is frequently formed as one chip. Accordingly, circuits of the transmitting unit and the receiving unit may cause generation of noise in the receiving unit and the transmitting unit, respectively. In particular, due to an influence of magnetic field generated by current flowing in each circuit, current is induced in the other circuit, disadvantageously. As a technique for preventing such noise, the following techniques have been disclosed.
Japanese Patent Laying-Open No. 2004-228144 (Patent Document 1) has an object to implement a structure capable of suppressing inductors from being deteriorated in properties due to magnetic coupling between the inductors in an array-type coil component including a plurality of coils. In the coil component of the invention disclosed in Japanese Patent Laying-Open No. 2004-228144 (Patent Document 1), a plurality of coils are disposed in a stacked member, which includes insulator layers stacked on each other, such that they are adjacent to each other in a direction perpendicular to the stacking direction. Each of the coils is formed of a linear conductor and has a substantially spiral shape or substantially helical shape. Between adjacent coils, linear conductors close to and opposite to each other have extended lines substantially orthogonally crossing each other on the same surface of the insulator layer.
Japanese Patent Laying-Open No. 2005-327931 (Patent Document 2) has an object to provide an integrated inductor capable of suppressing self-mixing resulting from coupling between integrated inductors, and allowing for simplification of circuit and reduction of chip size and power consumption, as well as a receiving circuit employing such an integrated inductor. In the invention disclosed in Japanese Patent Laying-Open No. 2005-327931 (Patent Document 2), at least two conductor layers are provided on a substrate. First and second inductor units are provided which have helical shapes, are formed of the first conductor layer, and are disposed adjacent to each other. The first and second inductor units are connected to each other such that a direction of current in the first inductor unit is opposite to a direction of current in the second inductor unit. For connection between an external circuit and each of the first and second inductor units, the second conductor layer provides at least two portions crossing the first conductor layer.
In particular, an in-phase component (common mode) of a signal generated from a local oscillator of a receiving unit is leaked to a frequency converter of a transmitting unit, i.e., is leaked to a quadrature modulator, and is mixed with the third harmonic of the transmission wave to result in generation of spurious.
The leakage of the signal generated by the local oscillator of the receiving unit is caused by magnetic coupling between a horseshoe-shaped inductor of the oscillator of the receiving unit and a spiral-shaped inductor of the quadrature modulator.
For example, in the case where a transceiver operates at a Band 1 (transmission frequency: 1920 MHz to 1980 MHz; reception frequency: 2110 MHz to 2170 MHz), this unnecessary wave (spurious) falls to a GPS band (1575.42 MHz=3*1955 MHz−2*2145 MHz; the frequency of the signal generated by the local oscillator of the receiving unit is twice as large as the reception frequency). This causes deterioration of reception sensitivity of a GPS receiver provided on the same substrate, disadvantageously.
In the prior art, Japanese Patent Laying-Open No. 2004-228144 (Patent Document 1), the two inductors are arranged such that their "L-shaped" portions face each other, thereby reducing leakage of a signal between the inductors irrespective of in-phase component or differential component. However, Japanese Patent Laying-Open No. 2004-228144 does not fully contemplate to reduce unnecessary wave (spurious) when the in-phase component (common mode) is leaked to the spiral-shaped inductor.
Meanwhile, in Japanese Patent Laying-Open No. 2005-327931 (Patent Document 2), 8-shaped inductors are used for the local oscillator and a low noise amplifier of the receiving circuit, thereby reducing interference between both the circuits. However, Japanese Patent Laying-Open No. 2005-327931 does not fully contemplate to reduce unnecessary wave (spurious) when the in-phase component (common mode) is leaked to the spiral-shaped inductor.

This patent is subject to a terminal disclaimer.

Semiconductor device including spiral shape inductor and horseshoe shape inductor


A host device communicating with a plurality of accessory devices transmits audio data packets via a broadcast channel to the plurality of accessory devices. When one of the plurality of accessory devices determines an audio data packet has not been received, the accessory device sends a negative-acknowledgement signal (NACK) via a unicast channel. The NACK indicates that the at least one of the accessory devices did not receive at least one audio data packet. The host device retransmits the at least one audio data packet indicated as not being received via the broadcast channel to the plurality of accessory devices. Other aspects are also described and claimed.

Many electronic devices may make use of different communication technologies. For example, electronic devices may communicate using Bluetooth technology. A Bluetooth host device may communicate with multiple Bluetooth devices. The Bluetooth host device may stream an audio stream to each of the Bluetooth devices. Current Bluetooth technology provides for sending separate audio streams on separate channels to each of the multiple Bluetooth devices. Sending an individual audio stream to each receiving device can create an encumbering overhead on the host device which multiplies as the number of receiving devices is increased.


The present invention is directed to a method of preparing compositions enriched in compounds containing carbon chains of varying degrees of unsaturation using argentation chromatography. The present method utilizes an argentized cationic resin or a conditioned argentized alumina to separate compounds containing saturated or mono-unsaturated carbon chains from compounds having polyunsaturated carbon chains present in a starting composition. The invention is particularly useful for preparing a composition enriched in polyunsaturated fatty acid alkyl esters from mixtures of fatty acid esters in a starting composition derived from vegetable oils. The present invention is also directed to a method of preparing a conditioned argentized alumina adsorbent having increased selectivity for compounds containing one or more polyunsaturated carbon chains.

1. Field of the Invention
The present invention is related to methods of preparing compositions enriched in compounds containing carbon chains having various degrees of saturation. The present method is related to simulated moving bed chromatography using an argentized adsorbent.
2. Background of the Invention
The use of silver ion chromatography for separation of fatty acid methyl esters (FAME) by the degree of unsaturation of the fatty acid moiety is known (Nikolova-Damyanova, B., Advances in Lipid Methodology-Five:43-123, Oily Press Library (2003)). Silver ion thin-layer chromatography (TLC) and batch column chromatography of FAME uses silver-treated silicic acid, silica gel or ion-exchange resin as a support (Nikolova-Damyanova, B., Advances in Lipid Methodology-Five:43-123, Oily Press Library (2003)). Alumina has been used without silver ion for separation of paraffins from olefins (U.S. Pat. No. 2,985,589); however, aluminosilicates were the preferred supports. Argentized (silver-ion treated) neutral alumina has also been used to separate cis from trans octadecene olefins (Chapman, L. and Kuemmel, D., Anal. Chem. 37:1598-1600 (1965)). For separation of FAME by TLC, argentized alumina has been used to separate methyl stearate, methyl oleate, and methyl linoleate (Zinkel, D. and Rowe, J., J. Chromatogr. 13:74-77 (1964)); later, these were also separated from methyl linolenate, trans configurations, and methyl esters of longer-chain fatty acids (Breuer, B. et al., J. Chromatogr. Sci. 25:302-306 (1987)). However, these analytical separations are carried out discontinuously (batchwise) and are not amenable to use in large scale to produce commercially useful quantities of composition enriched in carbon compounds having a desired degree of unsaturation.
Liquid chromatography (LC) separation of FAME on silica-based supports such as silica gel (U.S. Pat. No. 5,672,726) and silicic acid (de Vries, B., J. Amer. Oil Chem. Soc. 40:184-186 (1963)) has been reported. Argentized macroreticular ion-exchange resin, such as Amberlite XE-284 (Scholfield, C., J. Amer. Oil Chem. Soc. 57:332-334 (1980); Scholfield, C. and Mounts, T., J. Amer. Oil Chem. Soc. 54:319-321 (1977); DeJarlais, W., et al., J. Amer. Oil Chem. Soc. 60:975-978 (1983)), and argentized ion exchange resins with strong sulfonic acid groups (U.S. Pat. Nos. 4,305,882; 6,153,774; and 6,410,763) have also been used for LC separation of FAME on the basis of unsaturation and double bond isomers (cis or trans). The use of alumina as a support for separation of FAME has been advised against because it reacts with some lipids and solvents (Monchilova, S. and Nikolova-Damyanova, B., J. Sep. Sci. 26:261-270 (2004)). Silica gel is the most widely used support for LC separation of FAME (Cert, A. and Moreda, W., J. Chromatog. A 823:291-297 (1998)). However, these batch processes operate discontinuously, rendering them unattractive for large-scale separation of compounds based on desired degree of unsaturation.
It is widely taught that great care is needed in the preparation of argentized supports for the separation of lipids (Nikolova-Damyanova, B., Advances in Lipid Methodology-Five:43-123, Oily Press Library (2003); Breuer, B., et al., J. Chromatogr. Sci. 25:302-306 (1987)). Difficulties cited include the lack of robustness and homogeneity in available support materials, (Cert, A. and Moreda, W., J. Chromatog. A823:291-297 (1998)) and inherent instability due to sensitivity to light and moisture (Monchilova, S. and Nikolova-Damyanova, B., J. Sep. Sci. 26:261-270 (2004)). Recommended precautions include protecting argentized supports from exposure to light by packing into stainless steel columns (DeJarlais, W., et al., J. Amer. Oil Chem. Soc. 60: 975-978 (1983)) or wrapping with a dark cloth (de Vries, B., J. Amer. Oil Chem. Soc. 40:184-186 (1963); U.S. Pat. Nos. 6,153,774 and 6,410,763). This precaution is not limited to argentized silica; heat activation treatment of argentized alumina TLC plates was limited to 15 minutes and 70° C. to prevent darkening of the adsorbent (Breuer, B., et al., J. Chromatogr. Sci. 25:302-306 (1987)).
Although simulated moving bed (SMB) chromatography has been used for many years in the separation of sugars and petrochemicals (Juza, M., J. Chromatog. A865:35-49 (1999)), it has had limited application in separation of oily substances. SMB has been used with supercritical CO2 to extract oilseeds and separate alpha-tocopherol from oleic acid (Bertucco, A., et al., J. Supercritical Fluids 8:138-148 (1995)). A solid bed technique employing zeolites exchanged with potassium has been applied to separation of methyl oleate and methyl linoleate from methyl stearate and methyl palmitate; however, no silver ion is used in the process (U.S. Pat. No. 4,049,688).

Method of preparing a composition using argentation chromatography


Methods for forming three-layer thin-film battery (TFB) structures by sequential electrophoretic deposition (EPD) on a single conductive substrate. The TFBs may be two-dimensional or three-dimensional. The sequential EPD includes EPD of a first battery electrode followed by EPD of a porous separator on the first electrode and by EPD of a second battery electrode on the porous separator. In some embodiments of a Li or Li-ion TFB, the separator includes a Li ion conducting solid. In some embodiments of a Li or Li-ion TFB, the separator includes an inorganic porous solid rendered ionically conductive by impregnation with a liquid or polymer. In some embodiments, the TFBs are coated and sealed with an EPDd PEEK layer.

TFBs comprise a "stack" of two, one negative ("anode") and one positive ("cathode") thin-film active material electrode layers (referred to henceforth simply as "electrodes") separated by an ionically conducting and electronically insulating ("non-conducting") separator layer. Hereinafter, the various battery layers are mentioned without use of the word "layer". The thickness of each electrode may range from sub-micrometer ("sub-micron") to a few microns. The thickness of the separator may range from sub-micron to a few tens of microns. The stack is formed on a substrate. If one or both electrodes are not sufficiently electronically conductive, thin film current collectors ("CC"s) are provided to facilitate electron current flow in an external circuit. One such CC is formed on the substrate prior to the formation of the TFB stack.
3D-TFBs, as disclosed for example in U.S. Pat. No. 6,197,450 to Nathan et al., are formed inside perforations (through-holes or cavities) of a substrate as well as on any remaining original (planar) surface of the substrate. Each perforation may include a partial or full stack of concentric layers forming a "concentric microbattery" or "CMB". Such 3D-TFBs combine the known advantages of 2D-TFBs with an order of magnitude and more increase in power and energy per footprint (original substrate area). A general known problem with CMBs is the difficulty of forming a solid separator using wet chemistry. Also, known art does not teach electrochemical deposition of a full three layer battery stack.
"Electrophoresis" refers to the motion of charged particles in a liquid under an applied electric field. Electrophoresis can be used to deposit materials in the form of thin films (layers), coatings and bulk products. The deposition process is commonly termed "electrophoretic deposition" (EPD). Reviews of EPD include those by Van der Biest and Vandeperre, Ann. Rev. Mater. Sci., 29 (1999) 327-352 and by Corni et al., J. Europ. Ceram. Soc., 28 (2008) 1353-1367. The EPD of layers faces a hurdle in the requirement that the solid to be deposited be available as a colloidal suspension or powder with grains smaller that a required layer thickness.
EPD has been used to produce bulk battery electrodes, see e.g., Kanamura et al., Electrochemical and Solid-State Letters, 3 (2000) 259-262, and Kanamura et al., J. Power Sources, 97-98 (2001) 294-297. The use of EPD to prepare film (thick or thin) battery components has been extremely limited, and applied mainly to positive electrodes (cathodes). Structures and materials investigated include thick films of LiNi0.5Mn1.5O4 [Caballero et al., J. Power Sources 158 (2005) 583-590] and relatively thin films of Li4Ti5O12 [Sugiura et al., Functional Mater. Lett. 2(1) (2009) 9-12]. A general concern and trend in the EPD of TFB electrodes it to make them dense (as opposed to porous).
Electrophoretic assembly of electrochemical devices is also disclosed by Chiang et al. in U.S. Pat. No. 7,662,265. Their methods requite always use of two current collectors ("terminals") for EPD of mutually repulsive electrodes, and cannot be used to EPD TFBs on a single current collector.

Electrophoretic deposition of thin film batteries


The apparatus is an enclosed engine generator assembly with air intake and air discharge openings into the enclosure in which the engine is installed and the radiator for engine cooling moved from the conventional position in front of the engine to a location at the bottom of the enclosure and between the supports for the assembly. The arrangement permits an assembly with a shorter overall length, but no significant increase in the height, which facilitates installation aboard vehicles.

This invention deals generally with engine generator sets and more specifically with the layout of the various engine generator components to reduce the size of the enclosure within which an engine generator may be operated.
Engine generator sets are much more common in our society than one would first suspect. Recreational vehicles frequently have them aboard in order to generate the power to run appliances and entertainment devices without running the much larger vehicle engine. Furthermore, virtually all emergency vehicles, other than police cars, also have independent engine generators for lights and other necessary equipment.
Because all equipment aboard such vehicles is actually competing for space, there is continuing effort to reduce the size of on-board engine generators, but such equipment has unique requirements. First, because the engine of the combination produces significant audible noise, they are usually installed in a sound insulated enclosure. However, since the engine requires combustion air and generates exhaust gases and heat, there must be openings into the enclosure for cool air inlet and hot air and exhaust outputs. Furthermore, such engine generator sets are usually installed on the vehicles in such a manner that there is no access to the engine and generator from the top, from one side, or from either end of the engine generator axis. This leaves only one side and the bottom of the enclosure for access not only for cooling, but also for servicing. Since standard engine generator sets require axially air flow through a front mounted radiator, ducting must be added to the front of the set to pull air in, and that adds considerably to the length of the enclosure.
There is substantial benefit to be derived from an engine generator installation with a reduced length, provided there is no required increase in height or width of the enclosure.

Reduced length engine generator assembly


Described is a system and method for providing differentiated service levels to wireless devices in a wireless network. The method comprises receiving, on a first network arrangement connected to a network, an authentication request from a wireless device. The network uses a first access protocol having a plurality of access categories and the wireless device uses a second access protocol. The authentication request including one of the plurality of access categories. The wireless device is verified to ensure that it is authorized to communicate at the one of the plurality of access categories. When the wireless device is verified as authorized, a response is communicated to a second network arrangement that indicates the one of the plurality of access categories is used for communications with the wireless device.

Quality-of-Service ("QoS") is an important issue for the delivery of data in communications networks. Users expect to receive transmissions with an expected level of performance. The QoS maintains the level of performance when contingent conditions arise (e.g., network congestion).
Another important issue in the communications networks is backward compatibility of devices using legacy protocols. As the communications networks are improved, backward compatibility for legacy devices (which do not import the improvements in the communications networks) is highly desired. For example, an IEEE 802.11e protocol is an emerging wireless standard aimed at providing the QoS and thus, intends to replace older standards (e.g., 802.11a, 802.11b). Devices utilizing the older standards may be unable to take advantage of the improvements provided by the 802.11e protocol. Accordingly, a need exists for a system allowing the legacy devices to be more compatible with the 802.11e protocol by accessing the prioritized QoS.

System and method for providing differentiated service levels to wireless devices in a wireless network


Techniques for manipulating graphic objects in response to gestures provided with a user interface device are disclosed. The technique includes indicating when a gesture associated with the graphics objects is to use a determined action. Others gestures are locked out from using the determined action with other graphic objects. Graphic objects are manipulated on the display based on the indication that the gesture associated with one of the graphics objects is to use the determined action.

This application relates to manipulating graphic objects on a display in response to user generated gestures.
With the new range of hardware and software available, it has become possible to create interfaces that respond directly to touch. Specifically these new paradigms allow more than one touch to be processed at the same time—allowing for more natural navigation and commands. Examples of these emerging technologies are Microsoft Surface, the Apple iphone, and Windows 7 with a Multi-touch display (such as a HP Touchsmart).
While these technologies implement an API set that support 'gestures', all of these are considered to be single level—that is to say they are all handled at the same priority, and do not deal with a hierarchical set of gestures.


A push-pull type self-oscillating power converter uses a main power transformer connected to a current transformer in series in such a way that a secondary current flowing through secondary sides of the two transformers is feedback to the primary side of the current drive transformer to generate a drive current for driving two switches. The drive current is proportional to the secondary current in the secondary side of the main power transformer.

1. Field of the Invention
The present invention relates to a DC to DC power converter, and more particularly, to a simple inexpensive power converter providing high efficient power conversion and low no-load power consumption.
2. Description of the Prior Arts
Increasing demands on green requirements, like stand-by power consumption and high efficiency, have left the power electronics industry with the challenge to improve these characteristics, resulting in overall bigger and more expensive power converters. Most power supply designers seek their solution in highly complex resonant type converters with often problematic mass production issues to control the relevant parasitic.


A system and method are provided for the training and testing of prediction algorithms. According to an exemplary embodiment of the invention the method generates optimum training, testing and/or validation data sets from a common general database by applying a genetic algorithm to populations of testing and training subsets used in connection with a given prediction algorithm. In exemplary embodiments the prediction algorithm operated upon is an artificial neural network. As well, in preferred exemplary embodiments, the most predictive independent variables of the records of the common database are automatically selected in a pre-processing phase. Such preprocessing phase applies a genetic algorithm to populations of prediction algorithms which vary as to number and content of input variables, where the prediction algorithms representing the selections of input variables which have the best testing performances and the minimum input variables are promoted for the processing of the new generations according to a defined selection algorithm.

Modern prediction algorithms are systems that have a high degree of machine intelligence. Machine intelligence can be defined, for example, as the ability to emulate or duplicate in data processing devices the sensory processing and decision making capabilities of human beings. Intelligent systems have the ability, for example, to autonomously learn and adapt in uncertain or partially known environments. It is this feature that has facilitated the commercial acceptance of prediction algorithms.
An artificial neural network (ANN) approach to machine intelligence is based upon the study of the human brain and its emergent properties. Artificial neural networks are generally well known. Such artificial neural networks are data processing systems that have been constructed to make use of some of the organizational principles that are believed to be used by the human brain. In a generic neural network or connectionist model, for example, there are three main components: an artificial neuron, a network topology and a learning algorithm or strategy.
The artificial neurons are processing elements where most of the computation is done. The neurons receive inputs from, for example, other neurons, or from an environment by means of synapses or by interconnection pass outputs to other neurons. The processing elements of an artificial neural network are connected together and overall system behaviour is determined by, for example, the structure and strengths of these connections. A network structure for these elements consists of neurons, or processing elements. The neurons are arranged in groups or layers. Multi-layer systems contain, for example, input and output neurons layers that receive or emit signals to the environment, and neurons which form so called hidden units, which are organised in one or more so-called hidden layer(s). The hidden layers perform non-linear mappings and contribute to the complexity of reliably training a system.
The connections between neurons in different layers propagate signals in one of two ways: feed-forward signals and feedback signals. Feed-forward signals only allow information to flow in one direction. Feedback signals allow information to flow in either direction and/or recursively.
Further, each connected pair of neurons in a neural network has an associated adjustable value or weight. A weight represents the connection strength between a pair of interconnected neurons. The collective weights of all neuronal connections in a neural network are stored in a memory, such as, for example, in a weight matrix.
Learning in an artificial neural network can be defined as any change in a network's memory, or weight matrix. Training a neural network is necessary so that the network will produce a desired output for a given input. Basically, there are two kinds of training or learning of such networks, categorized as unsupervised learning and supervised learning. Unsupervised learning, or self-organization, is a process that does not involve an external teacher. Only local information and internal control strategies are relied upon. Examples of unsupervised learning are implementations of Adaptive Resonance Theory and Hopfield networks.
Supervised learning, on the other hand, relies on an external teacher, such as, for example, a training and testing database. A typical supervised learning algorithm is, for example, back propagation. In particular, supervised training consists of feeding a set of input data to a initialized ANN for which an associated set of one-to-one mapped output data is known. The output data computed by the ANN are then compared with the known output data and the error between the ANN's mapping and the known output data is calculated according to, for example, a distance function or metric. This error is then used to calculate a new weight matrix, or memory, and the training and testing steps are repeated until the desired level of fitness or certainty has been reached, i.e., the error or distance function decreases below a defined threshold.
Supervised training normally uses a training algorithm implementing some optimization techniques which are applied to change the weights or values to provide an accurate mapping. The optimization techniques generally fall within one of two categories, namely stochastic or deterministic techniques.
Stochastic techniques include evolutionary algorithms which help in avoiding leaning instabilities and slowly locate a near global optimum, i.e. a minimum in the error surface, for the weights.
Deterministic methods, on the other hand, such as the well known gradient descent technique, quickly find a minimum but are susceptible to local minima.
Other kinds of learning techniques may be generally defined as error-correction learning. One type of learning technique adjusts a connection weight matrix in proportion to a difference between desired and computed values of each neuron in the output layer. Another example of error-correction learning is reinforcement learning. This is a technique by which weights are reinforced for properly performed actions and diminished for inappropriate ones. Performance of the output layer is captured in a single scalar error value.
These different types of training techniques are disclosed, for example in U.S. Pat. Nos. 6,269,351, 5,214,746, 5,832,446. Each of these patents purports to focus on the training algorithm of an ANN, and purports to improve same.
On the other hand, U.S. Pat. Nos. 6,212,508 and 6,269,351 purport to refer to the problem of appropriate definition of a training and/or testing data set for an ANN. However, in each of these cases, the only problem considered is the selection of a duly representative training set from among a group of data records, not an optimization of a database from which a training data set can be selected.
In general training data selection is a nontrivial task. An ANN is only as representative of the functional mapping it emulates as the data used to train it. Thus, any features or characteristics of the mapping that are not included (or hinted at) within the training data will not be represented in the ANN. Selection of a good representative sample requires analysis of historical data and much trial and error. A sufficient number of points must be selected from each area of the data set that represents or reveals a new or different aspect, behaviour or property of the mapping. This selection is generally accomplished with some form of stratified random sampling, i.e., by defining the various regions and randomly selecting a certain number of points from each region of interest.
Addressing the problem, U.S. Pat. No. 6,269,351 is a system and method for selecting a representative training from a group of data records. Such methods adaptively increase the size of a training dataset during training if a training algorithm fails to reach an intermediate error goal with respect to the entire set of data records. Once an intermediate error goal is reached with respect to the entire data set, a lower error goal is then set and the training algorithm is repeated until the set error goal corresponds to a defined final training state. If not optimally done, in order to include the requisite representative data points to capture the inherent mapping rule the testing set can grow very large, necessitating increased complexity and decreasing the number of data points available for a testing set.
As well, U.S. Pat. No. 6,212,508 purports to disclose a process for conditioning the input variables to a neural network. Such method involves the formation of time series from input variables to the network, where such time series are then subdivided into intervals whose length depends on how far back in time the measured variables contained therein extend. Interval lengths are selected to be larger the further the interval extends back in time. By means of convolution using a bell-shaped function, a representative input value for the neural network is obtained from all the measured variables contained in an interval. Al input variables obtained in this way are fed to the network simultaneously during training and during operation.
None of these approaches, however, refer to the problem of optimizing the distribution of records of a common database into separate training subsets and testing subsets. One of the most difficult problems faced with when training an Artificial Neural Network (ANN) is establishing the size and quality of the training and testing sets. Most of the time, the preset available data set is either too small or too complex to simply be divided into two subsets according to some pseudo-random criterion as is commonly done in known training and testing procedures.
Accordingly, a random distribution of a data set into two or three subsets only makes sense if it is assumed that a simple function represents the overall data set in an optimal way. Generally, however, data are discrete hyper-points of some unknown non-linear function, and this assumption fails.
Furthermore, a pseudo random distribution of all of the available data into a training set and a testing set does not take into account the problem of outliers. The unknown non-linear function can be approximated by a prediction algorithm such as, for example, an ANN.
Thus, a need exists for a method and system to optimize a database for the training and testing of prediction algorithms so as to be able to best approximate an unknown nonlinear function or mapping.

System and method for optimization of a database for the training and testing of prediction algorithms


A method and device for measuring a channel status between a first user equipment (UE) and a second UE. The method performed by the second UE includes: receiving control information related to a dedicated sounding zone from a base station through at least one of the plurality of downlink subframes, where the dedicated sounding zone is radio resource allocated for receiving a sounding signal; and receiving the sounding signal from the first UE, where the sounding signal is included in an initial symbol of an initial subframe of the plurality of uplink subframes, and where the initial symbol is included in the dedicated sounding zone. The method also includes measuring the channel status between the first UE and the second UE by using the sounding signal; and reporting a result of measurement for the channel status to the base station.

1. Field of the Invention
The present invention relates to a wireless access system supporting a cooperative communication, and particularly, to a method and apparatus for measuring a channel status between mobile stations.
2. Related Art
Standardization for a cooperative-MIMO (CO-MIMO) and a signal transmission through a relay or femto cell in an IEEE 802.16m system or LTE (-A) system is in progress to enhance transmission efficiency and throughput of mobile stations (MSs) with poor channel status among MSs positioned in a cell.
Further, besides methods of supporting MSs using a base station or a femto cell or relay that operates as a base station as described above, research for cooperative communication (e.g., mobile relaying) that transmits signals through cooperation between MSs or a client cooperation (CC) is recently underway for the 802.16 systems or LTE (-A) systems.
Current cellular wireless transmission systems define transmission/reception methods between a base station and an MS. In such case, the base station may transmit signals to the MS using a femto BS or relay station (RS) so as to effectively transmit signals to the MS.
In the foregoing, the femto-BS or RS plays a role as a base station. In the current IEEE 802.16 and 3GPP LTE/LTE-A standards, signal transmission over links between BS (or femto-BS)-MS, BS-RS, and MS-RS are being actively standardized.
However, more research is being conducted not only on device-to-device communication between the human type device (HTC), but also on device-to-device communication between machine type devices (MTCs) with increasing demand for lower power consumption, transmission reliability, or enhanced throughput.

Method and apparatus for measuring a channel status between terminals in a wireless access system that supports cooperative communication


To provide a substrate processing apparatus, including a control unit that performs control to transfer a prescribed substrate into each chamber, wherein when error is detected during transfer of the substrate, the control unit performs control to: specify a place where the error is generated; select a fallback operation table according to a processing status of the substrate, which is the table defining a processing content for each part of the substrate processing apparatus including the place where the error is generated; and transfer the substrate based on the selected fallback operation table.

1. Technical Field
The present invention relates to a substrate processing apparatus including a process chamber for collectively processing a prescribed number of substrate, a substrate processing method, a non-transitory computer-readable recording medium, and a substrate transfer method.
2. Description of Related Art
In a substrate processing apparatus including a process chamber for collectively processing a prescribed number of substrate, shortage occurs in some cases in the number of a product substrate required for collective processing. If substrate processing is performed while not placing a substrate for filling the shortage on a substrate placing piece in the process chamber, a generated product is adhered to the substrate placing piece for example, thus having an adverse influence on the processing thereafter on this substrate placing piece. Therefore, there is a method of performing substrate processing by filling the shortage of the substrate with a dummy substrate. For example, patent document 1 discloses a technique of achieving a uniform substrate processing by filling a free space with a dummy lot, which is the space generated on the substrate placing piece at a last of lots.
Meanwhile, when a prescribed number of substrate is transferred into the process chamber, error is sometimes generated at a prescribed place of the substrate processing apparatus. In such a case, there is a necessity for disconnecting the place where the error is generated, and performing a fallback operation for continuing the substrate processing. For example, patent document 2 discloses a technique of switching the processing from a process chamber where the error is generated, to a normal process chamber, to continue the substrate processing, thus improving a production efficiency.
In the substrate processing apparatus including the process chamber for collectively processing a prescribed number of substrate, the substrate during transfer stays at a prescribed position in the substrate processing apparatus when error is generated during transfer of the substrate. Therefore, the shortage of the substrate occurs, although they are required for the collective processing in the process chamber. Such a shortage of the substrate is filled with the dummy substrate. However, if the shortage of the substrate cannot be filled with the dummy substrate for some reason, there is no choice but stop the processing.
Patent document 1:
    Japanese Patent Laid Open Publication No. 2001-250780Patent document 2:    Japanese Patent Laid Open Publication No. 2006-339662

Substrate processing apparatus, substrate processing method, non-transitory computer-readable recording medium, and substrate transfer method


A method for managing data items retrieved for storage in a prefetch memory buffer includes determining a probability that a first data item will be requested for retrieval. The method includes estimating a first request time at which the new data item will be requested. The method also includes determining a time differential for the first data item, wherein the time differential is determined based on current time and the first request time. The method includes calculating a first prefetch priority value for the first data item based on the first data item probability and the time differential. The method includes randomly comparing the first prefetch priority value of the first data item to the prefetch priority values of the one or more stored data items to identify at least one stored data item having a prefetch priority value lower than the first prefetch priority value.

The currently described disclosure relates to managing a prefetch buffer with probabilistic access predictions. Storage systems usually "prefetch" data from one or more disks for temporary storage in memory, e.g., Dynamic Random Access Memory (DRAM), when the system perceives that the pre-fetched data might be requested in the near future. The method used to predict which data will be needed is imperfect and usually relies on an extrapolation from observed data accesses by a user. In addition, the total amount of memory available to store such data is limited. Hence, when a new access is identified or predicted, the system necessarily must determine whether to prefetch additional data, and if so, which data currently in memory to evict to make space for storing the newly prefetched data.

Managing a prefetch buffer with probabilistic access predictions