The present invention discloses a novel method for erasing an ETOX type and an AND type NOR flash memory arrays. The operations of the methods includes block erase which increases the Vt of the memory cell, block erase verify to check if the Vt of the erased cell is greater than a predetermined voltage Vtoff, page reverse program which reduces the Vt of the memory cell below a predetermine voltage Vtmax, reverse program verify which checks that the Vt of the memory cell is below Vtmax, page correction which corrects the Vt of cells on a page basis to be above a predetermined voltage Vtmin, and correction verify which checks that the Vt of the memory cells is above Vtmin. According to the present invention, the erase operation is performed to increase the Vt of erased cells by applying the positive high voltages to the selected word lines with bit lines and source lines grounded. The reverse program operation is performed to decrease the Vt of erased cells by applying the negative high voltage to the selected word lines with the source lines and bit lines grounded. For the ETOX cell an FN tunneling scheme is utilized for the Erase operation and CHE for the correction operation. The AND cell uses FN tunneling for both erase and correction operations.

1. Field of the Invention
The present invention relates to a semiconductor memory and in particular to writing a one-transistor cell, NOR-type, nonvolatile memory array.
2. Discussion of Related Art
A typical one-transistor cell, NOR-type flash array is comprised of a plurality of cells disposed in multiple rows (word lines) and multiple columns (bit lines), and circuits that control a variety of memory operations. These memory operations include erase, program, correct, read, and verify. The drains of flash memory cells are connected together to the corresponding bit lines, which are selected by a y-decoder. The sources of the memory cells are typically connected to common source lines, and the gates are jointly tied to word lines which are selected by an X-decoder. For a CHE (channel hot electron) program operation in an ETOX, NOR-type flash array, +10V is transferred to the selected word line along with +5V and 0V applied to the selected bit line and source line, respectively. This causes, the Vt (threshold voltage) of selected cells to increase after the program operation is performed. In contrast to program operation, xe2x88x9210V and +5V are applied to the selected word lines and source lines, respectively, with the selected bit lines in a floating state during a block erase operation.
After cells have been erased, an erase verify is performed to detect any under erased cells that have threshold voltage, Vt, which is above a predetermined value, Vtmax. For example, Vtmax could be set to around +1.5V, and as long as one cell""s Vt is above 1.5V, an erase pulse is further applied. A successful erase is defined when the Vt of all cells being erased is below +1.5V. Due to the variations of the characteristics of the cells, some cells will be erased faster with their Vt going below a minimum voltages, Vtmin, during erase operation. For example, Vtmin is typically set to be +0.5V, and some cells are erased to a negative threshold voltage, these cells are called xe2x80x9cover-erased cellsxe2x80x9d. As a result, a leakage current will occur and false data will be read.
In U.S. Pat. No. 6,122,198 (Haddad et al.) a method is directed toward erase verify and over erase verify by using a bit-by-bit approach. The threshold voltage of each memory cell is compared to the Vt of a reference cell and an over erase correction pulse is applied to the column containing the over erased cell. The over erase correction is a type of program operation but using a lower voltage applied to the selected word line, which contains over erased cells, to bring the negative Vt of the over-erased cells back to acceptable positive range. As seen from FIG. 1 of prior art, IBL is the total bit line current generated from the sum of I1, I3 and I4 when cell 504 is being erase verified, corrected, or programmed . The cells 502, 506 and 508 conduct with I1, I3 and I4 leakage current, respectively, due to the negative Vt after erase. Cells of 502, 506 and 508 are referred as over-erased cells. The current I1, I3 and I4 varies with bit line voltage, VD. During erase verify read, VD is approximately +1V, and current I1, I3 and I4 will be increased when the voltage VD is increased during the program or correction operation. The leakage current IBL may exceed the supply capability from an on-chip charge pump circuit. As a consequence, the over erased cells render the program and correction operations inoperative. Similarly, the over erase induced leakage current shown in FIG. 2 of prior art can cause the erase verification not to perform correctly. If the sum of leakage current I1, I3 and I4 caused by the over erased cells is higher than the contact current of an ON cell, all the cells will be read as an ON cell, then the erase verification is always falsely passed.
FIG. 3 shows a flow diagram of prior art for detecting and correcting over erased cells. The column address is set to the first column within the array 100 and an address counter is set to zero 102. A bad column flag is set to false 104 and the row address is set to the first cell in the column 106. The addressed cell is measured to determine if the cell is over erased 108. If the cell is over erased 108, the over erased cell is programmed with a single pulse 110 and the bad column flag is set to true 112, after which it is determined if the cell is the last cell in the column 114. If the cell is not over erased 108, it is determined if the cell is the last cell in the column 114. If the cell is not the last cell in the column 114, the row address is incremented 116 and the next cell in the column in measured for an over erase state 108. If the cell is the last cell in the column 114 and if the bad column flag is true 118, a counter is incremented 120, and if the count exceeds a predetermined amount 122, the repair fails and the process ends. If the count does not exceed a predetermined number 122, the bad column flag is set to false 104 and the process is repeated. If the bad column is not true 118 and if the column is the last column 126, the process is complete 125. If the bad column is not true 118 and if the column is not the last column 126, the column address is incremented 128, the address counter is set to false 102 and the process is repeated on the next column. Because of the leakage current from other cells in a column as noted in FIG. 2, the cell 704 being measured for over erase cannot be accurately be verified; therefore, the procedure of FIG. 3 will not work properly.
In FIG. 4A a flow diagram of prior art is shown for a bit-by-bit erase verify. The row address is set to the first row address 402, and the column address is set to the first column address 404. An erase verify is performed 406 on the addressed bit. If the addressed bit is under erased 408, an erase pulse is applied to the memory array 409 and the addressed cell is erase verified 406. If the addressed cell is not under erased 408, and if it is not the last column 412, the column address is incremented 410, and the addressed bit in the next column is erase verified 406. If it is not the last column 412, the row address is incremented 414, and the column address is set to the first address 404. If it is the last row 416, the row address is set to the first address 418 shown in FIG. 4B.
In FIG. 4B is shown a flow diagram of prior art for a bit-by-bit over erase detection and correction. After the row address is set to the first address 418, the column address is set to the first column address 420, and the addressed cell is verified to be erased 422. If the threshold voltage Vt of the addressed cell is not greater than a predetermined minimum 424, an over erase correction pulse is applied to the addressed column 426, and the address cell is again verified 422. If the threshold voltage Vt of the addressed cell is greater than a predetermined minimum 424, and if it is not the last column, the column address is incremented 428. If it is the last column 430, the row address is incremented 432. If it is not the last column 430, the addressed cell in the next column is verified for an erased Vt which is greater than a predetermined minimum 422. If the last row has not been attained 434, the column address is set to the first address 420 and the process continues. If the last row has been attained 434, the row address is set to the first row 436 as shown in FIG. 4C.
Shown in FIG. 4C is a flow diagram of prior art for a bit-by-bit under erase detection and correction. After the row address is set to the first address 436, the column address is set to the first column address 438. The addressed cell is erase verified 440. If the addressed bit is under erased 442, an erase pulse is applied to the array 443, and the cell is again erase verified 440.
If the addressed bit is not under erased 442, the column address is incremented 444, and if it is not the last column 446, the next address bit is erased verified 440. If it is the last column 446, the row address is incremented 448. If it is not the last row 450, the column address is set to the first address 438 and the process is repeated. If it is the last row address 450 and if there were no erase pulses applied in step 443, then the process is complete, else the row address is set to the first address 418 in FIG. 4B and the process is repeated.
U.S. Pat. No. 6,101,123 (Kato et al.) is directed toward programming and erasing a nonvolatile semiconductor memory using a tunneling mechanism. A negative word line voltage permits a lower drain voltage that reduces degradation on gate oxide during programming. U.S. Pat. No. 6,072,722 is directed toward programming and erasing a nonvolatile storage device where electrons are added or removed from a floating through a tunnel oxide. U.S. Pat. No. 5,848,000 (Lee et al.) is directed toward a novel latch structure in a flash memory address decoder to provide high accuracy and flexibility during the read, program and erase operations of a flash memory. U.S. Pat. No. 5,822,252 (Lee et al.) is directed towards a flash memory and decoder to overcome memory cell over erase problems. U.S. Pat. No. 5,748,538 (Lee et al.) is directed toward methods for programming and erasing a memory cell array of a flash EEPROM read only memory. In U.S. Pat. No. 5,237,535 (Mielke et al.) a method is directed towards repairing over erased memory cells in a flash memory array.
An objective of the present invention is to eliminate the leakage current from unselected memory cells which make flash memory operations comprising erase, erase verify, reverse program, reverse program verify, correction and correction verify.
Another objective of the present invention is to provide a tightened threshold voltage distribution utilizing methods of hot carrier injection and Fowler-Nordheim tunneling.
Yet another objective of the present invention is to decrease the voltage threshold of selected cells on a word line by word line basis.
A further objective of the present invention is to apply a ramped correction voltage to selected cells that have been correction verified eliminating any improper identification.
Still another objective of the present invention is to apply a correction pulse with a ramping time of less than one microsecond.
Still yet another objective of the present invention is to provide a memory device with savings in power consumption.
The present invention provides a solution to the previously mentioned drawbacks of the prior art comprising erase, erase verify, reverse program, reverse program verify, correction verify and correction operations in which leakage current is eliminated which avoids an erroneous read operation and cell misidentification during verify. An erase operation is carried out by applying +15V to selected word lines with associated bit lines and source lines grounded. This causes all memory cells will be erased to a high Vt state (Vt greater than Vtoff) after an iterative erase and verification operations, where Vtoff is the minimum threshold voltage for the erase state. Next cells are reverse programmed to lower the Vt of the cells to below a threshold voltage of Vtmax, where Vtmax is the highest reverse programmed threshold voltage. In the present invention, the reverse program is performed on page-by-page basis so that only one cell per bit line is selected which greatly reduces the leakage current and prevents the previously noted leakage problem of prior art. After the reverse program, selected cells are programmed to a narrow distribution of a high Vt state with Vt greater than Vtoff.
The reverse program is accomplished by applying a negative voltage to a selected word line with the bit lines and source lines grounded or floating. Reverse programming decreases the Vt of the cells to a voltage below Vtmax and for some cells to below Vtmin, which become over-erased cells. Since reverse programming is done on a page basis, only one cell for each bit line is selected which for all practical purposes eliminates any leakage current from unselected cells, and the reverse program operation can be supported by an on chip charge pump.
Unlike conventional over erase correction schemes where the number of over erased cells is crucial, a boosted word line voltage is required in the read operation and Vtmax cannot be set too low. The present invention allows Vtmax to be set at a low value, e.g. 1.5V, and Vtmin can be set at a lower value, e.g.0.5V. Thus the distribution of threshold voltages (Vt) can be tightened to a narrow range, bounded by Vtmax and Vtmin. By utilizing the hot carrier injection mechanism or Fowler-Nordheim tunneling scheme on two different corresponding arrays, ETOX-type or AND-type NOR arrays, the correction can be carried out by applying a ramped voltage on the selected word line to bring the over erased Vt cells back to an erased state. The number of the over-erased cells is very critical to conventional flash operations. Vtmax is typically set at a higher value to reduce the number of over-erased cells. As a consequence, a high current-consumption boosted word line voltage is required and wide Vt distribution cell is generated.

Three step write process used for a nonvolatile NOR type EEPROM memory


An apparatus and method for controlling the common mode voltage across a data storage device write head. The write current is supplied by a first plurality of parallel current sources each independently activated to limit the common mode voltage generated across the write head. A plurality of parallel resistive elements responsive to current supplied by a second plurality of parallel current sources bias an output transistor that further controls the write current. Each of the plurality of parallel resistive elements and each of the second plurality of parallel current sources is also independently activated to limiting the common mode voltage generated across the write head.

Disk drive storage system are commonly used for storing data in electronic products including digital cameras, music players, computer systems, and the like. As shown in FIG. 1, a disk drive 10 comprises a magnetic recording medium, in the form of a disk or platter 12 having a hub 13 and a magnetic read/write transducer 14, commonly referred to as a read/write head. The read/write head 14 is attached to or formed integrally with a suspension arm 15 suspended over the disk 12 and affixed to a rotary actuator arm 16. A structural arm 18, fixed to a platform 20 is pivotably connected to the actuator arm 16 at a pivot joint 22. A voice coil motor 24 drives the actuator arm 16 to position the head 14 over a selected position on the disk 12 for writing data to the disk 12 or reading data from the disk 12.
A spindle motor (not shown) rotates the disk 12 while the moving air generated by the rotating disk, in conjunction with the physical features of the suspension arm 15, lifts the read/write head 14 away from the platter 12, allowing the head to glide or fly on a cushion of air slightly above an upper surface of the disk 12. The flying height of the read/write head over the disk surface is typically less than a micron.
An arm electronics module 30, electrically connected to the head 14 by flexible conductive leads 32, includes circuits operative during the data read and write operations. Although the module 30 may be mounted anywhere in the disk drive 10, a location proximate the head 14 minimizes signal losses and induced noise in the read and write head signals. A preferred mounting location for the module 30 comprises a side surface of the structural arm 18 as shown in FIG. 1.
As shown in a partial cross-section and partial block diagram of FIG. 2, the disk 12 comprises a substrate 50 and a thin film 52 disposed thereover. Write current supplied to a write head 14A alters magnetic domains of ferromagnetic material in the thin film 52 to store the data bits as magnetic transitions.
Data bits to be written to the disk 12 are supplied by a processing device 60 to a data write circuit 62 where the data bits are formatted and error detection/correction information appended thereto. To write data bits, the voice coil motor 18 moves the suspension arm 16 to a desired radial position above the surface of the disk 12 while the spindle motor rotates the disk 12 to move a circumferential region to be written under the write head 14A.
A write driver 66A of a preamplifier 66 (in one embodiment disposed within the electronics module 30) supplies a programmed write current (in certain applications between about 10 mA and 70 mA) to the write head 14A responsive to a signal representative of the data to be written to the disk 12 supplied by a data write circuit 62.
During a write operation, the write current supplied by the write driver 66A to the write head 14A (magnetically coupled to a magnetically permeable core not shown) creates a magnetic field that extends from the core across an air gap between the write head 14A and the disk 12. The magnetic field alters a region of magnetic domains in the thin film 52 to store data bits.
The direction of the magnetic field generated by the write head 14A, and thus the direction of the altered magnetic domains, is responsive to the direction of current flow through the write head 14A. Current supplied in a first direction through the write head 14A causes the domains to align in a first direction (representing a date 0 for example) and current supplied in a second direction (representing a data 1 for example) causes the domains to align in a second direction.
In the read mode, transitions between adjacent domains are detected to determine the stored data bit. During read operations a read head 14B (typically comprising a magneto-resistive (MR) sensor, a giant magnetoresistive sensor (GMR), or a tunneling magnetoresistive head (TMR)) senses the magnetic field transitions in the thin film 52 to detect the stored data bits.
The suspension arm 16 moves while the disk 12 rotates to position a read head 14B above a magnetized region to be read. A DC (direct current) bias voltage of between about 0.025V and about 0.3V is supplied to the read head 14B by a read circuit 66B of the preamplifier 66. Magnetic domains in the thin film 52 passing under the read head 14B alter a resistance of the magneto-resistive material, imposing an AC (alternating current) component on the DC bias voltage. The AC component representing the read data bits has a relatively small magnitude (e.g., several millivolts) with respect to the DC bias voltage.
The read circuit 66B amplifies the read signals and supplies the amplified voltages to a data read circuit 72 where error detection/correction is performed, and the data bits detected. The data bits are supplied to a user interface 74, such as an interface to a computer or data processing device (e.g., SATA, SCSI, SAS, PCMCIA interfaces). Amplification of the signal in the read circuit 66B reduces the relative noise contribution of the data read circuit 72 when the signal is processed through the circuit 72.
In other data storage systems, the head 14 can operate with different types of storage media (not shown in the Figures) comprising, for example, a rigid magnetic disk, a flexible magnetic disk, magnetic tape, a magneto-optical disk, and the like.
To increase storage capacity, a disk drive may comprise a plurality of stacked parallel disks 12. A read/write head is associated with each surface of each disk to write data to and read data from a top and bottom surface of each disk.
Ideally, the write current supplied to the write head 14A is a purely differential write current. Thus, the current sources that supply the write current are designed to produce symmetrical voltage/current swings during write operations. However, as is known by those skilled in the art, circuit topology, manufacturing processes and parasitic circuit elements introduce aberrations in the write circuit that generate a common mode signal. Also, when the current sources and other components operative during write operations are turned off, for example at the beginning of a read operation, common mode currents (voltages) are generated and introduced into the write head 14A. Common mode voltage spikes of several volts are not atypical at write turn-off.
The magnetoresistive material of the read head 14B cannot tolerate excessive voltages. In contrast, the thin-film inductor of the write head 14A requires relatively large magnitude, sub-nanosecond voltage swings to write data to high data-rate disk drive systems. Due to the close spacing of the read head 14B and the write head 14A, asymmetrical (i.e., common mode) voltages supplied to the write head 14A may be coupled to the read head 14B, potentially damaging or destroying the read head 14B.
Write current is typically supplied by the write driver 66A, comprising a plurality of current sources each controlled by an emitter follower transistor operative with a corresponding bias resistor. One technique for turning off the write current after a data write operation simultaneously deactivates the current sources and opens switches that control a connection between the bias resistor and its corresponding emitter follower transistor. Since the current sources turn off faster than the resistor-controlled switches open, a common mode voltage nearly equal to the supply voltage is imposed across the write head 14A and therefore coupled to the proximate read head 14B. State-of-the-art read heads (e.g., GMR and TMR heads) cannot tolerate such voltage transients.
As one skilled in the art will appreciate, precise turn-off timing is difficult to achieve and becoming more difficult as larger capacity and faster devices are required by today's hard disk drives. Switching misalignment of only tens of picoseconds can cause the switches to deliver a sufficient charge to swing the voltage on the write head 14A from the positive supply voltage to the negative supply voltage.
It is known to use clamps and catches to slowly lower the voltage in response to a change in a switch position. But these techniques are limited to controlling power down excursions and therefore are not usable during power-up, which can also generate common mode voltages in the write head 14A.
It is also known to slowly increase (and decrease) the circuit bias voltages while the switching devices are in the proper state for biasing. However, timing of the bias voltage increase (and decrease) relative to turning on (off) the switching devices must be carefully controlled as the switching devices can deliver a substantial charge. This technique is further discouraged by fast-mode switching requirements of state-of-the-art heads, requiring a fast bias voltage response during both power up and power down. Thus, a need exists for apparatus and methods for controlling common mode voltages in disk drives and/or other storage devices.

Apparatus and method for controlling common mode voltage of a disk drive write head


The invention relates to a device (1) for cutting wafers (2) into a number of chips with a laser beam (6) injected into a liquid jet (7). A thin flowing liquid layer (9) having a blasting effect is produced on the surface (5) of the wafer (2). This makes it possible to prevent projections resulting during laser cutting from depositing once again on the surface of the wafer. The result is a very high cleanness of the surface after the cutting process. The liquid layer (9) is produced, in particular, so that it is thinner in a machining area (10) around the machining point (8) than outside of the machining area (10). This ensures that the liquid layer is sufficiently thin (14) at the machining point (8) so that enough laser energy for removing material is applied to the wafer surface, and ensures that the liquid layer is sufficiently thick (15) outside of the machining area so that no area of the surface (5) of the wafer (2) dries out.

1. Field of the Invention
The invention relates to a method for machining a workpiece by means of laser radiation injected and guided in a liquid jet, in which the liquid jet having the laser radiation is directed on to a surface of the workpiece and the workpiece is machined at an operating point. The invention relates, further, to a device for machining a workpiece by means of laser radiation which can be directed on to a surface of the workpiece, the workpiece being capable of being machined at an operating point, and the laser radiation being injected and guided in a liquid jet.
2. Description of the Related Art
Laser radiation can be used, particularly in industry, in many different ways for machining the most diverse possible materials, such as, for example, metals, plastics or even ceramics. Machining ranges from cutting, drilling and welding through to material removal or marking.
Typically, in the machining of a workpiece by laser radiation, material is removed from the workpiece. In this case, small material particles occur, what are known as ejections, which settle or melt on the surface of the workpiece again. Depending on the nature of the workpiece and/or of the workpiece surface or of the ejections, it may happen that these bond firmly with one another again. These deposits on the surface of the workpiece may adversely influence the properties of the final product and are therefore usually undesirable. If at all possible, therefore, they have subsequently to be removed again at high outlay. Further, during machining by laser radiation, the workpiece is typically heated, and this may likewise entail undesirable consequences for the workpiece.
WO/9532834 discloses a device in which the laser radiation is injected into a liquid jet which acts as a light guide. As a result, not only can the energy of the laser radiation be brought to the operating point, but the liquid at the same time acts as a coolant which efficiently cools the workpiece in the machining region. Furthermore, vapors, particles and aerosols which occur during machining by laser radiation can be bound or prevented. However, the liquid quantity of the liquid jet into which the laser radiation is injected is not sufficient to flush away completely the ejections occurring during machining.
U.S. Pat. No. 3,991,296 A discloses a further device for machining and segmenting a wafer by means of a laser. In order to prevent machining residues from sticking to the wafer, a closed interspace, through which deionized water flows, is produced, just above the wafer, with the aid of a transparent glass plate. The laser beam directed on to the wafer penetrates through the glass plate and the water layer and then cuts the wafer, while the water is intended to cool the residues occurring in this case and thus to prevent the residues from sticking to the wafer. After cutting, these residues are then simply to be washed away, at most with the aid of low ultrasound.
The disadvantages of this device are that the water layer on the wafer disturbs the laser radiation in such a way (refraction, diffusion, damping) that the laser beam loses both sharpness and energy, so that the workpiece cannot or can no longer be machined efficiently. Moreover, in the method described, it is difficult or even impossible to discharge the melt occurring during machining out of the machining region, since the glass plate prevents the use of a cutting gas. Finally, in spite of the water layer, subsequent cleaning of the final product is necessary.
US 2003/129 814 A1 describes a further method for machining a semiconductor element by means of a laser beam. In order to avoid the diffusion of the laser light on the residues, the silicon substrate is tilted to one side and flushed over with water. As a result, the residues are flushed away around the operating point, and cooling of the substrate takes place at the same time.
In this method, too, the laser beam is diffused and damped by the water layer, thus making it difficult or even impossible to carry out the machining of the silicon substrate. Further, here too it is not possible to discharge the melt out of the machining region on the silicon substrate, since cutting gas which expels the melt cannot be used.


Disclosed herein is a composition, for example, a cosmetic care and/or makeup composition for a keratin material, comprising, in a cosmetically acceptable medium, i) at least one polyester resulting from esterification of at least one Guerbet capped polyester ii) at least one oil of a molar mass ranging from 650 to 10,000 g/mol, and iii) at least one colorant. The composition may possess cosmetic properties and can, for example, endow the makeup or care product with properties of gloss, smoothness of application and comfort. Further disclosed herein is the use of the at least one polyester and the at least one oil with a molar mass ranging from 650 to 10,000 g/mol in a physiologically acceptable composition as an agent for endowing the composition with properties of slip, gloss, comfort, definition, non-migration, enhanced color intensity and/or enhanced color retention after challenge. The compositions unlike those made from oxidatively inferior triglycerides do not form degradative odor bodies during storage and use, making them superior to all other materials.

U.S. patent application 20040241198 to Blin, Xavier; et al. discloses Cosmetic composition comprising at least one polyester resulting from esterification of at least one triglyceride of hydroxylated carboxylic acid(s) and at least one oil with a molar mass of 650 to 10 000 g/mol. The composition of the present invention unlike the application of Bin discloses polyesters with extraordinary oxidative stability, making them far superior to the triglyceride based products of Bin.
We have also found that the Guerbet capped polyesters are outstanding and surprisingly oxidatively stable when used together with so called "pasty compounds". The term "pasty compound" has been used commonly in the are to mean a lipophilic fatty compound, which exhibits a reversible solid/liquid state change and, in the solid state, has an anisotropic crystalline organizational structure, and which, at a temperature of 23° C., comprises a liquid fraction and a solid fraction. An example of such a use is found in United States Patent Application 20040241121 Blin, Xavier; et al. Dec. 2, 2004
In one embodiment, the composition disclosed herein may constitute a makeup product for the body, lips or epidermal derivatives of humans which may have properties, for example, of non-therapeutic treatment and/or care. For example, the composition disclosed herein may constitute a lipstick or lip gloss, a blusher or eye shadow, a tattooing product, a mascara, an eyeliner, a nail varnish, an artificial tanning product for the skin or a hair care or hair coloring product.
Numerous cosmetic compositions exist for which gloss properties in the deposited film are desirable following its application to keratin materials (such as skin, lips, epidermal derivatives). Examples that may be mentioned include lipsticks, nail varnishes and certain hair products.
From this viewpoint, a formulator may have a number of types of base materials at his or her disposal, such as lanolins, which may be used in combination with what are termed as "gloss" oils, such as a) polybutenes, which have a high viscosity, b) fatty alcohol or acid esters with a high carbon number (typically greater than 16), c) certain vegetable oils, d) esters resulting from partial or complete esterification of a hydroxylated aliphatic compound with an aromatic acid, as described in patent application EP 1 097 699, e) polyesters obtained by sequential reaction of castor oil with isostearic acid and then with succinic acid, which are described in U.S. Pat. No. 6,342,527, and the Guerbet capped polyesters of the present invention. Surprisingly, only the Guerbet capped polyesters of the present invention provide the oxidative stability necessary to product truly odor free personal care products
In one embodiment, disclosed herein is a glossy cosmetic care and/or makeup composition for keratin materials, such as skin, lips and epidermal derivatives, which can have improved properties relative to the cosmetic compositions of prior art. For example, deposition of the composition disclosed herein on the keratin materials can be more sharply defined and its color retention can be enhanced.
In one embodiment, the present inventors have found that the use i) of at least one Guerbet capped polyester the topic of Ser. No. 11/002,363 filed Dec. 3, 2004, incorporated herein by reference, with ii) at least one (i.e., one or more than one) oil with a molar mass ranging from 650 to 10 000 g/mol, makes it possible to obtain a cosmetic composition which can be glossy on application and over time, can exhibit at least one property chosen from good application properties, good properties of spreading, of color retention after challenge, of comfort (no tightening or drying out) and of non-migration and whose outlines, when deposited on keratin materials, can be well defined and whose color intensity can be enhanced.
The oil with a molar mass ranging from 650 to 10 000 g/mol is referred to herein as an oil of high molar mass.
In one embodiment, disclosed herein is a composition comprising, in a cosmetically acceptable medium, i) of at least one Guerbet capped polyester the topic of Ser. No. 11/002,363 filed Dec. 3, 2004, incorporated herein by reference, ii) at least one oil of a molar mass ranging from 650 to 10 000 g/mol, and iii) at least one colorant.
In another embodiment, disclosed herein is a cosmetic method of endowing a film of a cosmetic composition with at least one property chosen from gloss on application and over time, good application properties and good properties of spreading, of color retention following challenge, of comfort (no tightening or drying out) and of non-migration, with outlines which, when deposited on keratin materials, are well defined, and with enhanced color intensity, wherein the method comprises including in the composition i) of at least one Guerbet capped polyester the topic of Ser. No. 11/002,363 filed Dec. 3, 2004, incorporated herein by reference, with ii) at least one oil of a molar mass ranging from 650 to 10 000 g/mol, and iii) at least one colorant.
In yet another embodiment, disclosed herein is the use of the combination of i) of at least one Guerbet capped polyester the topic of Ser. No. 11/002,363 filed Dec. 3, 2004, incorporated herein by reference, with and ii) at least one oil of a molar mass ranging from 650 to 10,000 g/mol, in a physiologically acceptable composition comprising at least one colorant for endowing the composition with at least one property chosen from gloss on application and over time, good application properties and good properties of spreading, of outline definition, of comfort (no tightening or drying out) and of non-migration, with enhanced color intensity and with enhanced color retention after challenge, and to provide unexpected oxidatively stability heretofore unknown in the art.
In one embodiment, the composition disclosed herein is free of lanolin or lanolin derivatives.
As disclosed herein, the term "lanolin derivatives" means, for example, liquid lanolin, reduced lanolin, lanolin purified by adsorption, lanolin acetate, lanolin wax, for example the oxypropylenated (5 PO) lanolin wax sold as Emery 1695 by Cognis, isopropyl lanolate, liquid lanolin acetate, hydroxylanolin, polyoxyethylene-lanolin, lanolin fatty acid, hard lanolin fatty acid, cholesteryl esters of lanolin fatty acid, lanolin alcohol, and lanolin alcohol acetate.
In another embodiment, the composition disclosed herein comprises at least one pasty compound other than lanolin derivatives.
The Guerbet capped polyester is the topic of Ser. No. 11/002,363 filed Dec. 3, 2004, incorporated herein by reference.
In one embodiment, the at least one polyester disclosed herein is liquid at ambient temperature (generally ranging from 20° C. to 25° C.) and atmospheric pressure (760 mm Hg).
In another embodiment, the Guerbet capped polyester disclosed herein has a viscosity at 25° C. of more than 500 cP (50 Pa·s), such as ranging from 900 to 10,000 cP (90 to 1000 Pa·s) and further such as from 950 to 5,000 cP (95 to 500 Pa·s). Viscosity, as used herein, is measured with a Brookfield RV or Brookfield "DV-II+" viscometer of type LV equipped with a No. 1 spindle rotating at a speed ranging from 0.5 rpm to 10 rpm. This viscosity measurement is taken when the measurement value has stabilized, generally after 10 minutes.
In another embodiment, the Guerbet capped polyester disclosed herein has a refractive index greater than or equal to 1.47, such as from 1.47 to 1.55, and further such as from 1.48 to 1.55 (wherein the refractive index is defined for the sodium D line). The refractive index is measured at 20° C. by reference to D Ray sodium (589 nm) according to, for example, ASTM Standards D 1218-92, D1500.
According to one embodiment, the Guerbet capped polyester is obtained by two esterification reactions of at least one diol, one diacid and a Guerbet alcohol.
The Guerbet capped polyester conforms to the following structure:A-(B-C)x-B-Awherein:A is
wherein;a in an integer ranging from 3 to 11;b in an integer ranging from 5 to 19, with the proviso that b=a+2;B is —C(O)—CH2—CH2—C(O)—C is a mixture of compounds conforming to the following structure:

wherein;                x is an integer ranging from 3 to 40.
As should be readily understood the succinic acid (HO—C(O)—(CH2)2—C(O)OH) is a diacid that will react with hydroxyl groups to make esters. It will react with the various diols making up the dimer alcohol to make polyesters, that is each succinic carboxyl group will react with each hydroxyl group
Lacking the essential Guerbet alcohol the resulting polymer would be simply a nonending polymer -(B-C)x-. The viscosity would climb to very high levels and the product would be too thick to be functional.
The Guerbet alcohol is monofunctional providing a chain terminator and a way to control the molecular weight. The specific branched alcohol also provides low viscosity and gloss. This allows for the preparation of a high molecular weight low viscosity polymer which is highly prized in the cosmetic business. By regulating the ratio of Guerbet alcohol reacted the molecular weight is regulated, the more Guerbet, the lower the molecular weight.
The Guerbet capped polyester isprepared by the esterification reaction of
(a) a Guerbet alcohol conforming to the following structure:
wherein;a in an integer ranging from 3 to 11;b in an integer ranging from 5 to 19, with the proviso that b=a+2;(b) succinic acid conforming to the following structure:HO—C(O)—CH2—CH2—C(O)—OHand(c) dimer alcohol, a mixture of compounds conforming to the following structure:

wherein;                x is an integer ranging from 3 to 40.


The present invention provides a parking system having a parking meter in close proximity to a corresponding parking bay in which a user's vehicle is able to be parked. A payment receiving means is further provided for receiving payment and thereafter establishing a parking period in which the vehicle is able to be legitimately parked in the bay. There is provided a communication means for sending a message to the user's mobile phone prior to the expiry of the parking period. The message alerts the user that the parking period will soon expire and that the user must either move the vehicle before the expiry of the parking period or make an additional payment, if allowable, to remain legitimately parked.

With population growth on the increase, the infrastructure of many large cities is under strain. The amount of vehicle parking is often at a premium and parking systems can be employed to regulate parking availability wherein users are charged a fee which is generally related to the amount of time their vehicle is parked in a given parking area. Parking systems are commonly used to regulate parking availability for metered parking and car parks.
AU 01/00192 discloses a parking system used for regulating metered parking wherein a meter is situated in close proximity to a corresponding parking bay. When a user's vehicle is parked, the user is generally required to pay a fee at the meter corresponding to the amount of time in which the user estimates that parking will be required. Once paid, the user effectively establishes an account.
Upon expiry of the account, the user may be subject to receiving a fine issued by a law enforcement officer if the vehicle remains parked within the parking bay regulated by the parking system. The account can be "topped up" by the user periodically, however, there is often a maximum allowable tim limit permitted for parking a vehicle in a given parking bay. Exceeding this limit could also undesirably result in the user being issued with a parking fine.
AU 03/00457 discloses a parking system for regulating parking in a car park comprising a plurality of parking spaces in which a vehicle can park. A user is issued with an account when initially parking and, in contrast to metered parking, the account time balance increases over time. The user is then charged a fee when exiting the car park which generally corresponds to the amount of time in which the user is parked within the car park.
WO 01/73701 discloses a method wherein a user may initiate a call from a mobile phone to a parking system and, when connected, check the credit balance linked to their pre-paid account. The onus is therefore undesirably on the user to check their credit balance and hence time remaining for a vehicle to be legitimately parked in a car park.

This patent is subject to a terminal disclaimer.


A user equipment for wireless communications includes a memory configured to store a peak reduction tone (PRT) table and a processor configured to retrieve a plurality of PRT sequences from the PRT table. The plurality of PRT sequences includes a first PRT sequence based upon a first data rate and a second PRT sequence based upon a second data rate. The second data rate is larger than the first data rate, and the second PRT sequence is a subset of the first PRT sequence. The user equipment also includes a power amplifier operable to transmit data with the first PRT sequence according to the first data rate or with the second PRT sequence according to the second data rate.

Power amplifiers, including commercial power amplifiers, have a non-linear behavior if operated at input power levels at or greater than their 1 dB compression point levels. This non-linearity results in in-band and out-of-band distortion of an input signal and degraded error vector management (EVM) at the receiver. To avoid or reduce non-linearity in the output signal, a power amplifier may be operated at a gain setting that is several dB lower than the saturation point of the power amplifier. But the amount of gain backoff for the power amplifier depends upon the peak-to-average-power ratio (PAPR) of the output signal. To avoid saturation, the gain backoff may be tied to the PAPR. A signal with a high PAPR would thus require a corresponding large amount of backoff.
Orthogonal frequency-division multiplexed (OFDM) signals are known to suffer from significant PAPR that grows rapidly as the number of resource blocks increases. For example, fifth generation (5G) new radio (NR) may allow higher data rates than long term evolution (LTE). The higher data rates may result in an increased OFDM resource block size, thereby increasing the PAPR. To avoid saturation and clipping, a 5G power amplifier must thus use a relatively high amount of gain backoff. But operation at such a high gain backoff results in poor efficiency and other issues.


The invention has for its object to provide a base station for UMTS which makes it possible to implement the transmission of different transmission methods and of different time-slot types in the simplest possible manner. The base station according to the invention is a so-called node B of a UMTS mobile radio system. It includes a downlink power control unit. This unit is designed to transfer to a so-called chip processing unit for carrying out the CDMA coding at least one unit of information about at least one time-slot type to be transmitted. The downlink power control unit is a processor, for example. The implementation is done by suitable software programming of the processor. Using the received information, the chip processing unit generates a suitable time-slot type for a current time slot. This time-slot type is then CDMA-coded.

In UMTS, different transmission methods must be implemented, such as compressed mode, in which predetermined time-slot types must be transmitted in transmission gaps.
The information about the occurrence of compressed mode can be stored, for example, in the chip processing unit within a base station. This has the disadvantage that because of the implementation of the chip processing unit as, e.g., an ASIC, a hardware solution is necessary which is expensive and inflexible, i.e., not subsequently changeable.

UMTS base station supporting multiple transmission methods


The present invention discloses a process for forming a photoresist pattern in a semiconductor device. In this process, first, a semiconductor substrate where an objective layer for the formation of a pattern is formed thereon, is provided. Afterwards, an alkaline aqueous solution is formed on the semiconductor substrate using either spray, coating, or deposition method. Thereafter, a priming step is performed. Lastly, a photoresist pattern is formed on the semiconductor substrate.

1. Field of the Invention
This invention generally relates to a process of forming a pattern for formation of a semiconductor device, more particularly to a process for forming a photoresist pattern used in forming a pattern of a layer in a semiconductor device.
2. Description of the Related Art
As a semiconductor device is highly integrated, high miniature and precision of critical dimension are essentially required. As a result, the conventional lithography system is met with limitations in enhancing performance.
A general process of forming a photoresist pattern used in forming a pattern of a layer in a semiconductor device, a photolithography process is described referring to enclosed drawing.
FIG. 1A-1B are cross-sectional views illustrating a process of forming a photoresist pattern according to a conventional method.
Referring to FIG. 1A, in order that a photoresist film 2 is to be coated well on a silicon substrate 1, a prime step is first performed to the surface of the silicon substrate 1. The prime step is a process to make a photoresist film attached strongly on the substrate 1, where the silicon substrate 1 is processed by a chemical etchant and is baked at a selected temperature during the prime step. Thereafter, the photoresist film is coated on the silicon substrate 1.
Referring to FIG. 1B, a predetermined portion of the coated photoresist film 2 is selectively exposed to light, and then the exposed portion is removed by a developing solution, thereby exposing the selected portion of the silicon substrate 1.
FIG. 2 and FIG. 3 show photoresist patterns formed according to the above-mentioned conventional method. FIG. 2 is a plane view showing a photoresist pattern for a space pattern such as a contact hole and FIG. 3 is a cross-sectional view taken along 3--3 line in FIG. 2. Symbol 5 is the outline of the space.
Referring to FIG. 2 and FIG. 3, at an edge portion of an exposed surface of the silicon substrate 1, there is a small amount of residue such as scum 3 and tail 4 from the developed photoresist film 2. The residue 3 and 4 is related with difference in the adhesion force between the silicon substrate 1 and the photoresist film 2.
In order to pattern a layer formed on a wafer, lithography process is performed on the layer. The lithography process is performed at an order of dehydration, photoresist spin coating, pre-bake, exposure, post exposure bake, developement, and inspection steps.
FIG. 4 shows a silicon substrate on which a layer for the patterning is formed when the dehydration step has been completed.
Referring to FIG. 4, the surface of the silicon substrate 1 is covered with a hydrophobic action radical "R".
Return to FIGS. 2 and 3, the hydrophobic action radical R increases the adhesion force between the surface of the silicon substrate 1 and the photoresist film 2 so that, after the developing step is performed to expose a selected portion of the silicon substrate 1 using a chemical solution, a small amount of residue of the photoresist film 2 exists around the outline 5 of the space.
In addition, the residue cause the generation of defects such as a tail and scum phonemena, which contributes to a decrease in product yield.
The defects negatively influences on measuring a pattern size in a semiconductor device, thereby decreasing the reliability of the semiconductor device.
The pattern size is measured at the contact interface 5 between the silicon substrate 1 and photoresist pattern 2 by an apparatus such as scanning electron microscope(SEM), and the measurement is performed by scanning an electron beam to the photoresist pattern 2 and the substrate 1. However, the defect of scum or exists on the exposed silicon substrate 1 and the contact interface 5, it becomes very difficult to measure the pattern size. In addition, though the measured value is attained, there is a degree of error.

Process for forming photoresist pattern in semiconductor device

Hyundai Electronics Industries Co., Ltd.


An apparatus for coupling an optical fiber to an optical device comprises a substrate and a passive alignment member. The substrate having a top surface and a bottom surface. The top surface having a fist groove disposed thereon for holding an optical fiber, and a second groove disposed on the top surface. The second groove being substantially orthogonal to the first groove. The passive alignment member disposed in the second groove. The passive alignment member having selectively etched forward and side pedestals for aligning the optical device to the optical fiber disposed in the first groove.

This invention is related to U.S. Pat. No. 5,420,953 assigned to the assignee of the present invention.
The use of monocrystalline materials has enabled the passive alignment of optical devices to optical fiber for optical communication. The use of such materials to replace the requirements for active device alignment has great potential to effect the low cost, large production of optical links that have application to Fiber to the Home (FTTH) and Fiber to the Office (FTTO). Accordingly, the recent past has seen a great deal of interest and inventive activity in the development of passive alignment based on the use of monocrystalline materials. A common material for such use is monocrystalline silicon, as its crystalline properties are well known in the art. In U.S. Pat. No. 4,210,923 to North, et al., typical techniques for etching silicon is disclosed, and the disclosure of the North, et al. patent is specifically incorporated herein by reference.
One of the preferred set of devices in the optical communication technology is the surface emitting and detecting device. To this end, the use of devices such as Vertical Cavity Surface Emitting Lasers (VCSELS) and photodetectors (such as PIN photodiodes) that have the photosensitive surface to receive or emit light on the top surface has required a great deal of modification to effect the alignment of the device to an optical fiber. In general, to effect the alignment between the device and the fiber using a silicon optical bench, it is required to have the device on a different plane that the fiber, with the light being communicated therebetween by a reflective surface. Examples of such techniques are found for example in U.S. Pat. Nos. 5,073,003 and 4,904,036, to Clark and Blonder, respectively, the disclosures of which are specifically incorporated herein by reference. While such technology has its merits in allowing passive alignment to some extent, it is nonetheless required that the device be actively aligned into position so that light is properly reflected by the reflective surface. Furthermore, the use of a reflective surface decreases coupling efficiency, since there are intrinsic losses incurred at each optical surface through dispersive effects. Accordingly, a more efficient system would allow for in-line coupling between the fiber and the device.
U.S. Pat. No. 5,179,609 to Blonder, et al. discloses an example of the use of silicon waferboard technology to effect the coupling between the device and the fiber in a co-linear fashion. The disclosure of this patent is specifically incorporated herein by reference. This reference makes use of two pieces of monocrystalline material as mounting members that have etched therein detents in complimentary locations on each of the pieces of the mounting members. These detents receive microspheres to effect the alignment of the mounting members to effect the coupling of the device to the fiber. While the reference does disclose the use of other types of alignment fiducials, there are two substantive drawbacks to the invention disclosed in this reference. To effect alignment, there is required a separate member for holding the device to be coupled to the fiber, and another member to hold the optical fiber. Furthermore, the alignment fiducials are separated piece parts that are placed between the waferboard holding the fiber and the waferboard holding the device.
As can be readily appreciated from a study of the disclosure of this reference, the alignment fiducials are an additional processing step requiring additional parts to effect alignment. Furthermore, the alignment fiducials of this reference are a potential source of misplacement and thereby misalignment of the members. Accordingly, what is needed is an apparatus that allows for direct attachment of the optical fiber and the device to a single alignment member. Furthermore, what is needed is an apparatus that enables passive alignment via alignment pedestals and standoffs that are integrally formed from and on the single alignment member. The alignment therebetween is thereby made simply and effectively at a lower cost in manufacture.

Passive alignment frame using monocrystalline material


The present invention provides BZPA products with improved flowability and two methods of producing such BZPA products. Both methods successfully produce BZPA products that are not prone to agglomerate upon storage, and thus the flowability of such BZPA products does not degrade over time. The first method includes mechanically forming the BZPA crystals into large compacted pellets or briquettes without the introduction of any additives or binders. The compacted pellets are large enough that the physical and chemical effects that occur on the surface of small crystal particles are eliminated or minimized, but small enough that the BZPA can be easily handled and used in commercial applications. The second method includes adding a substantially inert anti-caking agent to the BZPA crystals to minimize or retard their tendency to agglomerate. The preferred anti-caking agent is silicon dioxide (SiO2), which is blended with the BZPA crystals in small amounts.

1. Field of Invention
The present invention relates to a method of producing benzene phosphinic acid having improved flowability.
2. Description of Related Art
Benzene phosphinic acid (hereinafter sometimes referred to as "BZPA") is sold in bulk quantities for use in a variety of applications including, for example, as a color stabilizer where hindered phenols are not effective, a modifying agent for use in polyamides, an antioxidant, an intermediate for forming metallic salts used as stabilizers, an accelerator for organic peroxide catalysts, a free radical promoter in emulsion polymerization, an improver of polysiloxane resins, and a corrosion inhibitor on thin aluminum surfaces. BZPA is typically prepared by the hydrolysis of benzene phosphonous dichloride. The resulting aqueous slurry is treated by centrifugation or other filtration means to separate the BZPA particles, which are typically small needle-shape crystals, from the aqueous medium. Upon drying, solid crystals of BZPA are obtained in a powder-like form.
Due to its hygroscopicity and other physical and chemical characteristics, BZPA crystals have a strong tendency to agglomerate. Depending upon various conditions such as the length of time the BZPA crystals are stored, the storage conditions, the storage container shape and size, the temperature and the humidity, the extent of agglomeration may vary from a few lumps or clumps within the powder to a complete solid mass throughout the container. Agglomeration, which is also sometimes described as caking or compaction, renders BZPA difficult to handle, because the material does not flow freely out of the container into which it has been packaged. The agglomeration problem can present a potential safety risk (i.e., back strain) to the individuals who attempt to remove the BZPA from shipping and storage containers.

Benzene phosphinic acid with improved flowability


A system for monitoring and reporting sensor data associated with the delivery of concrete from a provider site to a client site by a concrete delivery mixing truck having a status sensor capable of obtaining slump related data is provided. The status sensor obtains slump related data which is read by a computing device that calculates a slump value, compares the slump value to a delivery slump value, and indicates that a transmission event has occurred if a difference between the delivery slump value and the calculated slump value exceeds a tolerance level. If a transmission event has occurred, event data associated with the transmission event is collected and delivered to a remote location or device.

The present invention relates to delivery vehicles and particularly to delivery vehicles that deliver construction materials. In particular, the present invention relates to the remote monitoring and reporting of sensor data using intelligent resources associated with the delivery vehicle.
Numerous problems are associated with the delivery of construction materials from a provider site to a client site. Although the construction materials are normally prepared carefully at the provider site, materials providers have no reliable means for accurately monitoring the materials during delivery or for determining the status of a particular delivery. This is particularly true in the context of ready-mix concrete delivery. It is common practice to mix the concrete at a provider site and to use mobile concrete delivery mixing trucks to deliver the concrete to a client site where the concrete may be required. Generally, the particulate concrete ingredients are loaded at a provider site that mixes the concrete ingredients according to a predefined recipe that yields concrete appropriate for the desired use.
An important aspect of the mixing process is to control the amount of water added to the concrete mixture. It is known that, if concrete is mixed with excess liquid component, the resulting concrete mix does not dry with the required structural strength. It is also known that the consistency of the concrete mixture may be measured by measuring the slump of the concrete mixture. Accordingly slump tests have been devised so that a sample of the concrete mix can be tested with a slump test prior to actual usage on site. It is also known to install slump sensors onto the concrete mixing trucks that measure the slump of the concrete mixture by monitoring the torque loading on the hydraulic drive which rotates the mixing barrel affixed to the truck. Thus, it is now possible to prepare a concrete mixture with ingredients specially chosen to provide a desired slump.
The slump is chosen based on the particular application to insure that the concrete provides the required strength level, durability, and level of quality for the application. Concrete providers have therefore gone to great lengths to prepare the concrete mixture to insure that these goals are met. A problem arises, however, when the mixing trucks leave the dispatch center and carry the mixture to the site because the concrete providers cannot monitor the slump consistency during transport and after delivery. Often, the mixture is altered after it leaves the dispatch center by adding water to reduce the slump. Although this makes it easier to spread and smooth the mixture, it compromises the quality and integrity of the concrete and leads to structural instability, cracks in the concrete""s surface, discoloration and other undesired defects. This commonly results in disputes between the concrete provider and the client as to whom is responsible for the structural shortcomings. The concrete provider can only state that the concrete mixture was proper when it was shipped, but cannot account for the mixture during transport or unloading. Although existing methods enable the delivery driver to manually read and record the slump of the concrete mixture, it is often difficult to rely on manual recordings because the driver may forget or be persuaded to report inaccurate data.
Several attempts have been made to provide greater control over the concrete mixture after it leaves the provider site. For example, concrete providers have implemented programs to educate the concrete mixing truck drivers about the effects of adding water and other elements to the concrete mixture at the site. The problem persists, however, because the foremen at the delivery site often demand that water be added to ease the installation process. The delivery drivers are often persuaded to comply with these demands and, in many instances, not to report that the mixture was altered. Thus, there is an unsatisfied need for a way to monitor and control the composition of the concrete mixture, particularly the slump, during delivery and unloading.
Another problem apparent in the delivery of concrete products and other construction materials is the inability to monitor and report the status of various deliveries. Current systems track materials delivery by having the delivery driver communicate delivery status directly back to the dispatch site. This approach is problematic because the delivery drivers may not be precise or may misrepresent the actual status in order to hide their own mistakes. Human error also occurs resulting in inaccurate delivery records.
Recent developments in Global Positioning Systems have provided another means to track the location of delivery vehicles. These systems allow the dispatch center to locate the position of the delivery trucks. Based on the positioning data, the dispatch center may be able to determine whether the truck has arrived at the site location or the approximate time it will take the truck to arrive. Although the GPS""s provide a better solution to tracking truck location, they provide no data whatsoever concerning the status of the actually delivery or of the status of the goods being delivered. For example, the vehicle may have arrived at the site and been unable to deliver the materials or goods. Thus, the GPS may indicate that the truck is en route back to the provider site, but it cannot inform the dispatch center if the goods were delivered. Obviously, these systems can be supplemented with radio communications or other manually implemented status updates, but this introduces human error and unreliability.
In large companies with numerous delivery vehicles, there is also a problem with monitoring and sifting through the large volume of data provided by existing systems such as those where delivery status is manually communicated to the dispatch center by the driver. As data for each vehicle is delivered to the dispatch center, some means must be provided to sift through the data to determine the status of the various deliveries and identify any problems in the delivery. Closely linked to this problem are the transaction costs resulting from the transmission of status updates to the dispatch center. Regardless of the method used, the costs of constantly updating the delivery status can be quite large. In systems that provide for periodic updates, there may also be limited bandwidth available for such transmissions. Thus, there is a need for a system that provides pertinent delivery status information but does not provide excessive information that overwhelms the dispatch center and requires unnecessary transmission costs.
The present invention addresses many of the problems previously encountered in the art by providing a system and method for remotely monitoring and reporting sensor data associated with a delivery vehicle. Advantageously, the data is collected and recorded at the delivery vehicle thus minimizing the bandwidth and transmission costs associated with transmitting data back to a dispatch center. The present invention enables the dispatch center to maintain a current record of the status of the delivery by monitoring the delivery data at the delivery vehicle to determine whether a transmission event has occurred. The transmission event provides a robust means enabling the dispatch center to define events that mark the delivery progress. When a transmission event occurs, the sensor data and certain event data associated with the transmission event are preferably transmitted to the dispatch center. Advantageously, this enables the dispatch center to monitor the progress and the status of the delivery without being overwhelmed by unnecessary information. Another advantage of the present invention is that it enables data concerning the delivery vehicle and the materials being transported to be automatically monitored and recorded such that an accurate record is maintained for all activity that occurs during transport and delivery.
According to one aspect of the present invention, a method is provided for remotely monitoring and reporting the status of a delivery to a client site using a delivery vehicle comprising a plurality of associated status sensors communicatively connected to a computing device. The method comprises obtaining sensor data from at least one of the plurality of status sensors and automatically monitoring the sensor data obtained from the status sensor using the computing device. The method further comprises determining whether a predefined transmission event has occurred based on the sensor data obtained from the status sensor and, in response to the occurrence of a transmission event, automatically delivering event data associated at least in part with the transmission event to a predetermined location or device. The event data preferable comprises information indicating the status of the delivery.
According to another aspect of the present invention, a system for monitoring and reporting sensor data associated with the delivery of construction material from a provider site to a client site by a delivery vehicle is provided. The system comprises a plurality of status sensors associated with the delivery vehicle, a communications device that receives and transmits data, and a computing device communicatively connected to the plurality of status sensors and the communications device. The computing device reads sensor data from at least one of the plurality of status sensors at a predetermined interval, monitors the data to determine whether a predefined transmission event has occurred and, in response to the occurrence of a transmission event, transmits event data associated with the transmission event indicating the status of the delivery to a predetermined location or device using the communication device.
In a preferred embodiment of the present invention, the delivery vehicle is a concrete delivery mixing truck that contains status sensors sufficient to read and monitor the slump of the concrete mixture in the mixing barrel. In this embodiment, a system for monitoring and reporting sensor data associated with the delivery of concrete from a provider site to a client site is provided. The system comprises a plurality of status sensors that collect sensor data associated with the concrete delivery mixing truck, including slump-related data. A computing device communicatively connected to the plurality of status sensors reads sensor data from the plurality of status sensors at a predetermined interval. A monitoring and reporting program associated with the computing device analyzes the sensor data, determines whether a transmission event has occurred and, in response to the occurrence of a transmission event, collects event data associated with the transmission event. A communications device communicatively connected to the computing device receives event data from the monitoring and reporting program in response to the occurrence of a transmission event and delivers the event data to a remote location or device.

Methods and systems for remotely monitoring sensor data in delivery vehicles


A solution containing a nonpolymeric epoxy compound for cross linking biological tissues and bioprosthetic materials prepared thereby. The nonpolymeric epoxy compound has the general structural formula: EQU R.sub.1 --CH.sub.2 --O--X--O--CH.sub.2 --R.sub.2. wherein, X is a straight chain aliphatic hydrocarbon having at least four (4) and no more than five (5) carbon atoms bonded directly to one another, said straight chain aliphatic hydrocarbon being devoid of side branches and having terminal carbon atoms at either end thereof, the terminal carbon atoms at the ends of said straight chain aliphatic hydrocarbon being bonded to the oxygen atoms shown in the foregoing general formula, wherein at least one of the terminal groups R.sub.1, or R.sub.2 is an epoxy group and the other of said terminal groups R.sub.1 or R.sub.2 is either a) an epoxy group, or b) an aldehyde group. One preferred crosslinking agent of the above general formula is 1,4, butanediol diglycidyl ether. The solution of the present invention contains no other chemical compounds which would react with either collagen or with the crosslinking agent of the present invention.

i. Collagenous Biological Tissues Used For Prosthetic Grafting
Various tissues of biological origin have heretofore been used as prosthetic grafts for surgical implantation in or attachment to the body of a human being. As used herein, the term "graft" shall refer to any type of tissue or organ used for subsequent implantation or transplantation, including for example, certain cardiovascular tissues (e.g., segments of blood vessels, heart valves, pericardium), integumentary tissues (e.g., skin), tendons, or other tissues which have been harvested from human or other mammalian sources.
Prior to surgical implantation or transplantation of a graft of biological origin, the graft tissue is typically subjected to a chemical tanning or preservation treatment. The preserved tissue is then stored until it is needed for surgical implantation or grafting into the body of a human patient.
Biological tissues of the type used for allergenic or xenogeneic grafting in human beings (e.g., heart valves, pericardium, blood vessel, skin, etc. . . ) typically contain a connective tissue matrix. Such connective tissue matrix acts as the supportive framework for the tissue. The cellular parenchyma of the living tissue is disposed within, and supported by, such connective tissue framework.
Collagen and elastin are two substances which make up the connective tissue framework of most biological tissues. The flexibility or rigidity of biological tissue is determined largely by the relative amounts of collagen and elastin present therewithin and/or the physical structure and configuration of the connective tissue framework.
Collagen is a naturally occurring substance which, on a molecular level, consists of three polypeptide chains intertwined in a coiled helical confirmation. The individual amino acid constituents of each polypeptide chain are connected, by way of carbon bonds, to the adjacent amino acids of a neighboring polypeptide chain. Such amino acid bonding serves to hold the polypeptide chains in the triple helical confirmation of the collagen molecule.
Collagenous biological tissues may be tanned or preserved for subsequent surgical grafting and/or implantation by a chemical "fixing" process wherein the collagen network of the graft tissue is exposed to one or more chemical cross linking agents capable of forming chemical cross linkages between the amine groups of the collagen molecules.
The chemical cross linkages formed by the fixative agent include both "intramolecular" and "intermolecular" cross linkages. Intramolecular cross linkages are formed between the amine groups on neighboring polypeptide chains within a particular collagen molecule, while intermolecular cross linkages are formed between amine groups located on different collagen molecules. In general, it is desirable to accomplish substantially complete intramolecular cross linking of collagen within a biological graft material, with only minimal formation of intermolecular cross linkages within such material. Indeed, a high intramolecular cross link density and low intermolecular cross link density is typically associated with the most desirable preservation and physical properties of the resultant biological graft.

Nonpolymeric epoxy compounds for cross linking biological tissue and bioprosthetic grafts prepared thereby


This invention provides a metal gasket and its production method which prevents damage to folded portions by fold-machining and damage to metal materials after fastening, and expands the range of selection of materials for elastic metal plates, by reducing the thickness of a predetermined region of a elastic metal plate at which folded portions are to be formed. The thickness of the folded portion of the elastic metal plate is reduced from the folding side in an inner region of folded base portions and in regions in which folded free ends are positioned. Bend-machining is made gently at the folded base portions subjected to fold-bend machining, and the folded base portions each have a gap there-inside. The folded free ends do not come into contact with the elastic metal plate due to recessed surfaces. Accordingly, cracks and wrinkles do not occur at the folded base portions, and the folded free ends do not leave friction traces on the elastic metal plate.

1. Field of the Invention
This invention relates to a metal gasket used for sealing opposed fitting surfaces between a cylinder head and a cylinder block in a multiple-cylinder engine, and its production method.
2. Description of the Prior Art
A metal gasket made of a metal material has been used conventionally to seal opposed fitting surfaces between a cylinder head and a cylinder block of an engine. The metal gasket generally has beads in the proximity of holes for combustion chamber, water holes and oil holes of the structural members described above, and when it is fixed by fastening the cylinder head and the cylinder blocks by bolts, etc., the beads form elastic annular contact portions with respect to the opposed fitting surfaces, and seal them around the above holes.
However, a higher output and a smaller weight have been required for recent engines and as one of means for satisfying the requirements, the cylinder head, the cylinder block, etc., tend to be produced by using an aluminum material having a small specific gravity in place of the conventional materials having a great specific gravity such as a steel and a casting. Though light in weight, the aluminum material has low rigidity. Therefore, troubles are likely to occur at the time of fastening of the metal gasket and during the operation of the engine. In other words, the positions of the fastening bolts of the metal gasket are dispersed to outer peripheral portions or relatively to the outer peripheral portions of the metal gasket and are not always disposed uniformly around the holes. Therefore, when the opposed fitting surfaces of the structural materials having the low rigidity are fastened by the bolts through the metal gasket consisting of a single plate, the opposed fitting surfaces are likely to become non-uniform. As a result, a high temperature high pressure combustion gas enters between the opposed fitting surfaces of portions having large distortion, such as the portions between the holes, corrodes and contaminates the beads of the metal gasket interposed between the opposed fitting surfaces, and lowers the seal effect.
Furthermore, since rigidity of these structural materials lowers, relative displacement of the cylinder head to the cylinder block becomes great in accordance with combustion cycles during the engine operation, the gap between the cylinder head and the cylinder block repeatedly increases and decreases, and the temperature of the metal gasket changes greatly in accordance with the operation and stop of the engine. Accordingly, repeated stresses, that is, mechanical stress and thermal stress, act on the metal gasket, too. This load fluctuation stress is most pronounced at portions having the lowest rigidity of the cylinder block and the cylinder head, so that the beads undergo buckling or cracks develop, thereby deteriorating seal performance.
The Applicant of the present invention previously filed a patent application relating to a single plate metal gasket disposed and fastened between the opposed fitting surfaces of the cylinder head and the cylinder block of the engine, and its production method (Japanese Patent Application No. 306295/1990). This metal gasket includes holes formed in a elastic metal plate, beads spaced apart outward in a radial direction from the periphery of the holes and extending along the holes, and folded portions formed by folding the metal plate on the convexed surface side of the beads around the holes and outward in the radial direction. The folded portions of the metal plate are shaped into a predetermined thickness, and are heat-treated. Therefore, when the elastic metal plate is fastened and brought into a pressed state between the opposed fitting surfaces, the beads form annular seal portions with respect to the opposed fitting surfaces and at the same time, the folded portions which have about twice the thickness of the metal plate form another seal portions around the holes, and the beads and the folded portions offset any irregularity of the opposed fitting surfaces, suppress a distortion quantity of the cylinder head occurring due to the repetition of the combustion cycles, reduces the fluctuation load stress, and prevent complete compression of the beads.
In the metal gasket described above, the reference discloses a structure wherein a metal plate having a thickness smaller than that of the metal plate described above is laminated on the external side of the beads other than the portions between the holes in a radial direction and on the convexity surface side of the beads, and an offset between the folded portions and regions which are more outwards than the beads in the radial direction is regulated, a structure wherein a soft metal plate is clamped in the folded portions and folded back when the offset is below a necessary offset, a structure wherein the folded portions are so formed as to be thick in the regions between the holes and to be thin in other regions so as to obtain a high push force in the regions between the holes at which high seal performance is required, and a structure wherein a non-metallic material such as heat- and oil-resistant rubber or resin is applied to both surfaces of the elastic metal plate in order to avoid the direct metal-to-metal contact with the opposed fitting surfaces, to prevent corrosion and contamination of the metal surface and to secure the seal function irrespective of concavo-convexities of the opposed fitting surfaces.
The production method of the metal gasket described above comprises a step of forming in the elastic metal plate perforations having an inner diameter smaller than that of the holes that would have been finished; a step of forming beads along the periphery of the perforations in such a manner as to be spaced outward in the radial direction from the periphery of the perforations; a step of forming folded portions having folded base portions serving as cylinder bore holes by bending outward the metal sheet in the radial direction on the convexity side of the beads around the perforations; a step of applying a compressive force to the folded portions and shaping them into a predetermined thickness; and heat-treating the metal plate having the folded portions formed thereon.
However, the metal gasket described above forms basically the perforations having an inner diameter smaller than that of the holes and includes the elastic metal plate having the folded portions formed by folding outward the plate in the radial direction around the perforations. Accordingly, such a elastic metal plate has a structure where the folded portions are completely folded 180.degree. without a gap at the folded base end portions serving as the holes, and receive a servere stress change at the time of machining. Therefore, damage such as cracks and breakage is likely to occur at the folded portions, or the metal plate is exposed to the repeated stress in accordance with the combustion cycles for a long time after being fixed between the opposed fitting surfaces, even though it is heat-treated, and cracks are likely to occur at the folded base portions.
When the folded portions are formed around the holes, an offset portion corresponding to the thickness of the plate is formed between the periphery of the hole and in a region which is outward in the radial direction from the periphery. If this offset portion is great, the elastic metal plate of the gasket main body compulsively undergoes deformation in the regions inside and outside this offset portion when the metal gasket is fastened between the opposed fitting surfaces of the cylinder head and the cylinder block. This deformation region is originally disadvantageous stress-wise, and cracks, etc., are likely to occur because more compulsive stress acts on it due to the load fluctuation in accordance with the combustion cycles of the engine. Furthermore, when the elastic metal plate has the beads formed into a profile shape extending along the holes for combustion chamber and located outward from the folded portions in the radial direction, strong seal portions are defined at the time of fastening and prevent the leak of the corrosive, high temperature combustion gas from the holes for combustion chamber if the thickness of the folded portions is great, and the role of sealing of the portions having the beads formed thereon is eased that much. Accordingly, the burden of sealing concentrates excessively on the folded portions, and when the folded portions are broken during the use for a long time, the sealing of the beads which is not much strong cannot exhibit effectively the functions of preventing the leak of the combustion gas
When the offset portion of the elastic metal plate by the folded portions described above is higher than a desired height, the height of the offset portion of the folded portions can be regulated to decrease it by laminating a thickness regulation plate on the elastic metal plate, but according to such a regulation method, the regulation plate must be prepared separately. Therefore, the production cost of the metal gasket rises, and when the regulation plate is produced, it must be provided with the shape which coincides with the machining shapes of the beads, etc., of the elastic metal plate. In addition, a lamination on the elastic metal plate becomes necessary, and an apparatus for the lamination becomes also necessary. For these reasons, this method is troublesome and is not economically advantageous.
The free ends of the folded portions are not particularly subjected to chamfering, etc., and come as such into contact with the, surface of the elastic metal plate. Since the elastic metal plate is exposed to the environment in which the stress acts repeatedly for a long time, cracks and traces of friction occur on the surface of the flexible metal plate.
In the production method of the metal gasket, the metal gasket involves the limitations of the thickness, hardness and elongation characteristics of the elastic metal plate used. As to the thickness of the elastic metal plate, the thickness of the folded portions is not adjusted in advance. Therefore, fold-machining must be carried out using the thickness of the elastic metal plate used, and the force required for machining is great, so that a drastic change of the plate thickness occurs at the folded base portions and the folded portions are likely to crack. In the case of so-called "pre-compression" where the plate thickness is adjusted by a press, etc., after the elastic metal plate is folded, the adjustment quantity becomes great. Furthermore, since it is difficult to improve precision of the thickness adjustment and flatness, there is a limit to the thickness of the plate that can be employed.
In connection with the hardness of the elastic metal plate, a material having a high hardness cannot be folded easily. Therefore, a elastic metal plate which is relatively soft with a hardness of below Hv 200 before fold-machining and which can be machined easily but keeps its hardness must be selected and used. In this point, too, there is a limitation to the hardness of the elastic metal plate that can be employed. As to the elongation characteristics of the elastic metal plate, cracks, breakage, distortion, etc., are likely to occur at the folded portions during fold-machining if a material having inferior elongation characteristics is used. Accordingly, an expensive flexible metal plate having good elongation characteristics must be employed in order to prevent the occurrence of cracks, breakage, distortion, and so forth.

Metal gasket and production method thereof


Novel compound called caloxins which are extracellular plasma membrane (PM) Ca2+-pump inhibitors are described. One caloxin is caloxin 2A1 and has the amino acid sequence VSNSNWPSFPSSGGG. Another caloxin is caloxin 3A1 and has the amino acid sequence DSHINNEPSRRRGGGK. The caloxins are useful in inhibiting PM Ca2+-pumps and can be used in the development of treatments of various diseases including hypertension, hypotension, degenerative brain disorders, mood disorders, diabetes, kidney failure and cancer.

Plasma membrane calcium pumps are Ca2+—Mg2+-ATPases that use the energy of hydrolysis of ATP to expel cellular Ca2+. Plasma membrane (PM) Ca2+ pumps are present in all mammalian cells. However, either PM Ca2+ pumps or Na+/Ca2+ exchanger (8,9,17) may remove Ca2+ from the cell after activation or during homeostasis, and the precise role of PM Ca2+ pumps remains to be determined. There are no extracellular PM Ca2+ pump inhibitors available to resolve this issue. In contrast, the Na+ pump inhibitors ouabain and digoxin have been pivotal in our understanding of how this pump affects cell function (7, 12). The sarco(endo)plasmic reticulum Ca2+-ATPase (SERCA) inhibitor thapsigargin, which can diffuse into the cell to act, has also proved very useful in elucidating the role of the SERCA pump (15). PM Ca2+ pumps are encoded by four plasma membrane Ca2+-ATPase (PMCA) genes, and their transcripts can be alternatively spliced (2, 4, 10, 14). The isoform. PMCAlb is most widely expressed. The PM Ca2+ pump protein models show ten transmembrane and five extracellular domains (4). Except for the first putative extracellular domain, their sequences are conserved in different isoforms. All the known functions of the pump are assigned to the cytosolic domains, although mutagenesis of key residues in the PM Ca2+ pump protein shows that transmembrane domains are involved in its activity (5). X-ray diffraction studies of the sarcoplasmic reticulum Ca2+ pump also support a role for transmembrane domains in the pump activity (16). In contrast, it is unknown whether extracellular domains in the PM Ca2+ pump play any role in its function.
There is a need in the art to provide inhibitors of the plasma membrane Ca2+ pump.


A source driving device, capable of reducing stand-by period and saving power consumption, includes a plurality of source drivers connected in series, which include one or more cascade source drivers. The one or more cascade source drivers include one or more first-type cascade source drivers, each of which, at different times to other first-type cascade source drivers, is respectively activated by a pulse signal generated by a previous source driver, and after the activation, is triggered by a frame signal to receive corresponding frame data in the frame signal. Each of the source drivers generates a pulse signal after receiving the corresponding frame data to activate the next source driver.

1. Field of the Invention
The present invention is related to a driving method, driving device and cascade source drivers for a LCD panel, and more particularly, to a driving method, driving device and cascade source drivers reducing power consumption of the LCD panel through reducing standby durations of receivers within the driving device.
2. Description of the Prior Art
With advances in resolution of a liquid crystal display (LCD), throughput between a timing controller and source drivers of a panel driving device rapidly increases, resulting in sides effects of numerous pins, additional power consumption, electromagnetic interference (EMI), etc. Thus, reduced swing differential interfaces, such as a reduced swing differential signaling (RSDS) and a mini low-voltage differential signaling (mini-LVDS), are proposed to overcome those side effects.
Please refer to FIG. 1, which is a schematic diagram of a mini-LVDS interface 100 of a conventional panel driving device. The mini-LVDS interface 100 includes a timing controller 110 and four representative source drivers 120_1-120_4 connected in series. The source drivers 120_1-120_4 respectively include receivers 130_1-130_4, converters 140_1-140_4 and transmitters 150_1-150_4.
The timing controller 110 is arranged to generate a frame signal FRM utilized for providing frame data to the source drivers 120_1-120_4. Meanwhile, the timing controller 110 further generates a system timing generation signal SYS utilized for controlling operation timings of the source drivers 120_1-120_4. The receivers 130_1-130_4 sequentially receive corresponding frame data from the frame signal FRM. The converters 140_1-140_4 respectively convert the frame data into source driving signals VS_1-VS_4. The transmitters 150_1-150_4 respectively transmit the source driving signals VS_1-VS_4 to pixel units of a LCD panel. In addition, after the receivers 130_1-130_3 complete receiving the frame data, the transmitters 150_1-150_3 respectively transmit impulse signals SP1-SP3 to the receivers 130_2-130_4 to trigger the receivers 130_2-130_4 to start the reception.
FIG. 2 is a timing diagram of signals of the mini-LVDS interface 100. Note that, the frame signal FRM includes three representative differential signals LV1, LV2, LV3 simultaneously provided to the receivers 130_1-130_4 of the source drivers 120_1-120_4. Each of the differential signals LV1, LV2, LV3 includes plural data sections DATA separated by blank sections BLK. In addition, at least one of the differential signals, e.g. the differential signal LV1, further includes reset indication sections RST, each arranged to be right after the blank section BLK synchronized with the system timing generation signal SYS, and utilized for synchronizing reception timings of the receivers 130_1-130_4 after the source drivers 120_1-120_4 are activated.
FIG. 3 is a schematic diagram of a driving process 30 of the mini-LVDS interface 100. Please simultaneously refer to from FIG. 1 to FIG. 3 to understand overall operation of the mini-LVDS interface 100. First, since the driving process 30 starts (Step 300), the timing controller 110 generates the frame signal FRM according to the system timing generation signal SYS (Step 302). Next, the source drivers 120_1-120_4 are activated to a standby state after the receivers 130_1-130_4 receives a rising impulse edge of the system timing generation signal SYS (Step 304). Later, the receivers 130_1-130_4 receive the reset indication section RST to synchronize the reception timings through activating internal reception clocks thereof (Step 306).
Since an impulse signal SP is fixed at a high level, the receiver 130_1 starts receiving the data section DATA after it receives reset indication section RST (Step 308). However, the other source drivers 120_2-120_4 remain standby since the corresponding impulses SP1, SP2, SP3 are disabled.
After the receiver 130_1 finishes the reception, the transmitter 150_1 outputs the impulse signal SP1 (Step 310) to trigger the receiver 130_2 of the next source driver 120_2 to start receiving data (Step 312). Similarly, the transmitter 150_2 outputs the impulse signal SP2 after the receiver 130_2 finishes the reception (Step 332) to trigger the next receiver 130_3 to receive data (Step 313). The transmitter 150_3 generates the impulse signal SP3 after the receiver 130_3 finishes the reception (Step 333) to trigger the next receiver 130_4 to start receiving data (Step 314), so as to complete overall data reception of an updating cycle.
At the next rising impulse edge of the system timing generation signal SYS, the converters 140_1-140_4 of the source drivers 120_1-120_4 simultaneously convert the received data section DATA into the source driving signals VS_1-VS_4 (Step 340). Finally, at a falling impulse edge of the system timing generation signal SYS, the transmitters 150_1-150_4 of the source drivers 120_1-120_4 transmit the source driving signals VS_1-VS_4 to pixel units of the LCD panel (Step 350), and the driving process 30 ends (Step 360).
To sum up, when receiving corresponding data section from the frame signal FRM, the source drivers 120_1-120_4 have to be respectively triggered by the impulse signals SP0-SP3 to start receiving data. Other than the impulse signal SP0 fixed at the high level, the impulse signals SP1-SP3 are generated respectively after the receivers 130_1-130_3 finish the reception. As a result, the receivers 130_1-130_4 sequentially receive the corresponding frame data at different times.
However, in the driving process 30, the receivers 130_2-130_4 are activated by the system timing generation signal SYS at time t1, but do not function until respectively triggered by the impulse signals SP1, SP2, SP3 at time t2, t3, t4, which are determined based on when the previous source drivers finish the reception. That is, in standby durations P2, P3, P4, the receivers 130_2-130_4 dissipate power without performing any functions. Therefore, the conventional driving process 30 has to be improved.

Timing controller, source driving device, panel driving device, display device and driving method for reducing power consumption through reducing standby durations


A method for telematic data transfer comprising the steps of: monitoring parameters for personal communications made through a telematics unit in a vehicle between the telematics unit and at least one remote location; determining a communication requirement for communicating between the telematics unit and the remote location; and scheduling and executing the determined communication responsive to the monitored parameters to increase likelihood of success of the determined communication.

The opportunity to utilize wireless features in a mobile vehicle is ever increasing as the automobile is being employed as a communications and entertainment platform as well as a transportation platform. Conventional wireless systems within mobile vehicles, embodied within telematics units, provide voice and minimal data communications.
Telematics units are also utilized as personal calling devices, taking advantage of a telephony device embedded within the telematics unit. In addition to the increased personal calling usage, data transfers to and from vehicles are increasing in frequency and duration. Examples of data transfers are requests for personal calling replenishment units, diagnostic queries, diagnostic reports, and music file downloads.
The increase in personal calling increases risk that a data transfer to or from the vehicle could be interrupted by personal calling. In a known example, a data call is interrupted and terminated when a telematics subscriber initiates a personal call. This condition delays data transfer to and from the telematics unit.

Method and system for telematic data transfer