A composition for cleaning a fluid delivery system includes an agent which controls the rheology of the fluid so that its apparent viscosity decreases as the fluid is subjected to a shear force. In particular applications, the viscosity of the composition is greater than 600 centipoise when it is not subject to any shear and less than 600 centipoise when subject to a shear of at least 10 1/sec. The fluid may be thixotropic or a Bingham plastic, in some instances. In a specific embodiment, the viscosity of the composition is greater than 3000 centipoise when it is not subject to shear, less than 3000 centipoise at a shear of 10 1/sec, less than 1000 centipoise at a shear of 30 1/sec, and less than 600 centipoise at a shear of 60 1/sec. Also disclosed are methods for cleaning a fluid delivery system with these compositions.

Systems for the large scale painting of motor vehicles, vehicle components, fixtures, appliances, and other mass produced items of manufacture are relatively complex and include fluid lines, tanks, valves, and the like. Likewise other fluid handling systems such as food or chemical processing equipment include similar structures. The internal surfaces of such systems are often cleaned by pumping one or more cleaning fluids therethrough and in some instances, such cleaning fluids include a particulate material therein which aids in the cleaning process. In a typical cleaning process, a number of precleaners and/or rinse fluids are also passed through the system prior to and/or after the use of the particulate containing cleaning fluid.
In the context of cleaning a paint delivery system, various cleaning fluids of the type which are the subject of this present patent application function to solvate deposits and remove debris from a paint line system. These deposits and debris can include hardened paint residues as well as particulates resultant from contaminants in the paint, metal particles which are shed by valving, pipe joints, pumps and the like, traces of pigment and so forth. It is generally desirable that line cleaning compositions have a relatively low viscosity so that the agents can effectively flow through and penetrate all portions of the delivery system. In addition, it is generally desirable to avoid high viscosity fluids, since pumping, valving and other components of the system are not engineered for handling such high viscosity fluids.
While low viscosity cleaning compositions are desired, there are problems associated therewith, since low viscosity fluids are not very effective at suspending particulate materials. This is not a problem when the fluid is flowing relatively rapidly; but when the fluid flow slows as a result of passing through sumps or other drops in the system, or when flow is terminated, suspended particles can rapidly settle out of low viscosity fluids thereby negating the effects of the cleaning process. But, as noted above, use of high viscosity cleaning fluids is undesirable, and in some instances can actually damage pumps, valves and other components. Therefore, it will be appreciated that there is a need for a class of line cleaning compositions including precleaners, cleaners, purgents, rinses, scouring agents and the like which are capable of efficiently suspending particulate matter therein. Such fluids should also be compatible with the structure and operational requirements of paint delivery systems and associated cleaning equipment.
In many instances, the industry is now turning to the use of water-based paints and other process fluids. Hence, there is a need for paint line cleaning compositions which are compatible with water-based paints. Such compositions should be effective in removing residues of water-based paints and in purging lines of water-based paints. Such compositions must also be compatible with subsequently introduced water-based process fluids.
As will be explained hereinbelow, the present invention provides a system of line cleaning compositions which have very specifically controlled rheological properties. The compositions of the present invention have a very high resting viscosity, but thin to a low viscosity when a particular shear threshold is passed. In this manner, the fluids of the present invention are very efficient at suspending and retaining particulate matter; but, their viscosity thins in use to enable effective cleaning and prevent any mechanical burden or damage to associated equipment. These and other advantages of the invention will be discussed in detail hereinbelow.

Method and composition for cleaning a fluid delivery system


An electronic timepiece with an internal antenna has an antenna that has an elongated magnetic core formed from a magnetic body and a coil wound around the magnetic core, and can receive external wireless information, the magnetic core having a coil winding part to which the coil is wound in the lengthwise center part of the magnetic core, and a pair of lead parts extending from both ends of the coil winding part; a module that houses the antenna and processes the external wireless information; and a magnetic member that is positioned with a predetermined gap between the magnetic member and the lead part at a position that is not superposed on a coil-overlapping area that overlaps the coil winding part of the antenna and is superposed on at least a part of a lead-overlapping area that overlaps the pair of lead parts when the electronic timepiece with internal antenna is viewed in plan view from the timepiece thickness direction of the electronic timepiece with internal antenna.

1. Field of Invention
The present invention relates to an electronic timepiece with an internal antenna enabling receiving external radio frequency signals through the antenna.
2. Description of Related Art
Electronic timepieces with an internal antenna are known from the literature. Typical of such timepieces is a radio-controlled timepiece that receives external radio frequency signals carrying time information from an external source and uses this information to adjust the time kept by the timepiece. In order to improve antenna performance in this type of electronic timepiece with an internal antenna, Japanese Unexamined Patent Appl. Pub. JP-A-2005-269234 and Japanese Unexamined Patent Appl. Pub. JP-A-2007-184894 teach configurations that improve the flux collection effect of the antenna.
The wristwatch described in Japanese Unexamined Patent Appl. Pub. JP-A-2005-269234 has an internal antenna that includes a laminated core part, a winding part having a wire wound around the laminated core, and end caps affixed to both ends of the laminated core part.
The wristwatch described in Japanese Unexamined Patent Appl. Pub. JP-A-2007-184894 uses a configuration having a core, a core case housing the core, a coil wound around the core case, and an amorphous thin film applied to a part of the core to which the coil is not wound.
With the configuration of the related art that attaches an end cap to both ends of the laminated core part of the antenna as described in Japanese Unexamined Patent Appl. Pub. JP-A-2005-269234, the end caps increase the size of the timepiece module accordingly and interfere with forming the timepiece thinner and smaller.
Furthermore, a problem with the configuration that affixes an amorphous thin film to the core as described in Japanese Unexamined Patent Appl. Pub. JP-A-2007-184894 is that the amorphous thin film becomes easily damaged when shock is applied to the timepiece. Damage to the thin film can be prevented by additionally providing a support member, but providing such a support member also increases the size of the timepiece.

Electronic timepiece with internal antenna


A method for fabricating a high-density silicon-on-insulator (SOI) cross-point memory array and an array structure are provided. The method includes the following steps: selectively forming a hard mask on an SOI substrate, defining memory areas, active device areas, and top electrode areas; etching to remove the exposed silicon (Si) surfaces; selectively forming metal sidewalls adjacent the hard mask; filling the memory areas with memory resistor material; removing the hard mask, exposing the underlying Si active device areas; forming an overlying layer of oxide; etching the oxide to form contact holes to the active device areas; forming diodes in the contact holes; and, forming bottom electrode lines overlying the diodes.

1. Field of the Invention
This invention generally relates to integrated circuit (IC) memory fabrication and, more particularly, to a high-density resistor random access memory (RRAM) array structure and fabrication process.
2. Description of the Related Art
Conventionally, RRAMs are fabricated on bulk silicon. As is well known in the art, there is a relatively high degree and leakage current and capacitance associated with memory cells fabricated on bulk silicon, that translates into degraded read and write times. However, applications are beginning to demand that RRAM programming pulse widths be as narrow as 10 nanoseconds (ns). Silicon-on-insulator (SOI) CMOS devices are known to have a significantly higher speed than corresponding bulk silicon devices. Therefore, a SOI substrate RRAM would be desirable for very high-speed memory circuits.
An SOI substrate is made from a silicon (Si) layer that overlies an insulator material, such as sapphire or oxide. The insulation layer of an SOI substrate completely isolates associated NMOS and PMOS transistors, to prevent the occurrence of latch-up. Further, the device channel doping need not overcompensate, and the diffusion regions do not have bottom junctions. All these factor lead to a reduction in parasitic capacitance.
In a pending application entitled, DUAL-TRENCH ISOLATED CROSSPOINT MEMORY ARRAY AND METHOD FOR FABRICATING SAME, invented by Hsu et al., Ser. No. 10/350,643, filed Jan. 23, 2003, and which is incorporated herein by reference, a vertical one resistor/one diode (1R1D) structure is described that can be used to form a high density memory array. The structure forms P+ on a highly conductive buried N+ bit line. The resulting thickness of the P+N junction, however, is at least 500 nanometers (nm), and not suitable for SOI processes.
FIG. 1 is a partial cross-sectional view of a dual trench isolated 1R1D RAM on bulk silicon wafer (pending art). A shallow trench extends, at least partially, into the P+ layer to avoid the leakage current drawn from the bottom electrode, to the N+ bit line. The conductivity of the N+ bit line is no higher than 1 kilo-ohm (Kohm) per square if the thickness is less than 500 nm. Therefore, the minimum thickness of the SOI film has to be in the order of 500 nm in order to provide low parasitic resistance. However, the thickness of a periphery circuit area can be much thinner than that of the memory area, and this thickness difference is too large for a state-of-the-art lithograph tool to handle.
It would he advantageous it a process were developed to increase the density of memory cells formed in an SOI RRAM array.
It would be advantageous if an SOI RRAM array could be formed to take advantage of the minimum available feature size.

This patent is subject to a terminal disclaimer.

High-density SOI cross-point memory fabricating method


Process and equipment for the removal of crud from the interface between aqueous and organic layers in SX settlers in which at least one rotatable auger is positioned at or near the interface to remove crud continuously or intermittently from the interface.

This invention relates to equipment and methods for the removal of crud formed at the interface between aqueous and organic phases in solvent extraction processes for the recovery of metal from metal ores.
A major problem in solvent extraction plants used for the solvent extraction of metal values from aqueous solutions obtained from the leaching of metal ores is the formation of interfacial sludge, commonly referred to as gunk or crud. Excess crud formation can lead to a number of problems, requiring the regular removal of the crud from the settling tanks. Known methods for the removal of crud are almost all labor intensive, i. e. involve the physical removal of the crud by an operator.
Since the crud is at least about 50% organic, it is economically important to recover most if not all of the entrained organic phase.
The present invention relates to novel methods and equipment that function effectively to remove the crud without the need for constant operator monitoring.
The process of the invention is carried out by means of at least one rotating auger (conveyor screw) positioned at the interface between the aqueous and organic phases in an SX settler used in the solvent extraction process for recovering metal from metal ores, e.g. copper ores, nickel ores, zinc ores, uranium ores, etc. The rotating auger(s) are run continuously or intermittently at timed intervals to remove crud from the liquids interface. The SX settlers are sometimes referred to as mixer-settlers.

Interfacial crud removal system for solvent extraction and method for solvent extraction


Systems and methods for random access communication in accordance with various embodiments of the invention are described in which receivers can handle uncoordinated transmissions of a large and unknown number of transmitters. Communication systems in accordance with many embodiments of the invention include a plurality of transmitters that encode message data as symbols using a rateless code. During transmission, the transmitters receive feedback messages at a predetermined set of potential decoding times until an end of epoch message is received. A receiver transmits at least one start of epoch message and, at each of a predetermined set of decoding times, determines whether a decoding rule is satisfied. When the decoding rule is satisfied, the receiver can decode at least one message from observed symbols based upon the rateless code. The receiver can end the transmission epoch by transmitting an end of epoch message.

Random access is a common medium access control scheme utilized when multiple transmitters share a common channel. In a random access channel, sometimes called a multiple access channel, the channel is shared by multiple transmitters (i.e. a multiple-transmitter channel). Random access channels are multiple-transmitter channels characterized in that messages are not scheduled in advance. Each transmitter that has access to a random access channel can attempt to transmit at any time (or time slot), which can cause collisions that typically result in the transmitters being denied access to the channel and/or information loss.
Wireless access points including (but not limited to) WiFi hot spots and cellular base stations often utilize random access channels to setup communications via channels requiring scheduled access. In heavily utilized networks, random access channels utilized to schedule network resources are often the network's most critical bottleneck.
Multiple-transmitter channels are understood in information theory when the number and identities of transmitters are fixed and known. Even in this known-transmitter regime, information-theoretic solutions are often too complex to implement. As a result, orthogonalization methods, such as TDMA, FDMA, and orthogonal CDMA, are often used instead. Orthogonalization strategies simplify coding by scheduling the transmitters, but such methods can at best attain sum-rate equal to the single-transmitter capacity of the channel, which is significantly smaller than the maximal multi-transmitter sum-rate.
Most random access protocols currently in use rely on collision avoidance, which typically cannot surpass the single-transmitter capacity of the channel and may be significantly worse since an unknown transmitter set can make it difficult to schedule or coordinate among transmitters. Collision avoidance can be achieved through variations of the legacy (slotted) ALOHA and carrier sense multiple access (CSMA) algorithms. ALOHA, which uses random transmission times and back-off schedules, achieves only about 37% of the single-transmitter capacity of the channel. In CSMA, each transmitter tries to avoid collisions by verifying the absence of other traffic before starting a transmission over the shared channel. When collisions do occur, for example because two transmitters begin transmission at the same time, all transmissions are aborted, and a jamming signal is sent to be sure that all transmitters are aware of the collision. The procedure starts again at a random time, which again introduces inefficiencies.
The state of the art in random access coding is "treating interference as noise," which is part of newer CDMA-based standards. While this strategy can deal with random access better than ALOHA, it is still far inferior to the theoretical limits. Two-layer MAC decoders, with outer layer codes that work to remove channel noise and inner layer codes that work to resolve conflicts have been proposed. However, these systems rely on codes designed for a predetermined number of transmitters, k; it is not clear how robust they are to randomness in the transmitters' arrivals and departures.


An actuator includes: at least one drive motor; an outlet (22); an adjustable torque limiter which is disposed between the/each motor and the outlet (22), the torque limiter having a mobile element (100) which is used to set the maximum torque transmitted; and a case which houses the motor and the torque limiter. The case is provided with an opening (110) for accessing the mobile element (100) used to set the maximum torque transmitted and the torque limiter is mounted in the case.

In a number of fields, it is necessary for actuators to be provided with a torque limiter. This torque limiter is constituted, for example, by friction members which are held compressed together, the compression force of these friction members defining the sliding torque between these two members. The torque transmitted is limited to the sliding torque.
In practice, it is advantageous for the torque limiter to be calibrated before assembly. In an actuator, the torque limiter is generally preceded and/or followed by other reduction gear members, such as an epicyclic reduction gear, or reduction steps which are provided between the drive motor(s) and the torque limiter.
Owing to the machining differences between the various components which can be used from one actuator to another, it is difficult to determine by means of calculation the calibration of the torque limiter in accordance with the other elements of the actuator in order to ensure a maximum predetermined torque at the output member of the actuator.


Floor panel with a substrate, including thermoplastic material, a decor provided thereon, and, on at least one pair of opposite edges, coupling parts realized at least partially from the substrate. The coupling parts allow to effect a mechanical locking between two of floor panels, where the substrate includes a rigid substrate layer of thermoplastic material, and a glass fiber layer is present in the floor panel.

Document WO 2013/026559 describes such floor panel, wherein the substrate comprises one or more substrate layers of soft or flexible polyvinyl chloride, abbreviated PVC. However, such floor panel entrains a number of problems. For example, there is a not to be neglected risk of telegraphy effects. Herein, after a certain period of time imperfections in the underlying surface or subfloor on which the panels are installed will become visible on the surface of the panels. When installing the panels in a room with much incident sunlight, such as a veranda or the like, there is also a high risk of the occurrence of pushed-up edges and/or the formation of gaps between the mutually coupled panels. This is the result of the expansion/shrinkage the substrate is undergoing with varying temperatures. Although the use of a glass fiber layer may increase the dimensional stability of the floor panel, this often still has proven insufficient in order to avoid the last-mentioned problems. Moreover, the panels are relatively flexible and bendable, due to which the installation thereof cannot always performed equally smooth. Moreover, the lacquer layer present on the upper side of the panel mostly scores insufficient in the field of wear resistance, scratch resistance, stain resistance and the like.
The floor panel which is known from document WO 2014/006593 already tackles a number of the mentioned problems. It has a rigid substrate layer formed by means of extrusion, which comprises, on the one hand, high-density polyethylene, abbreviated HDPE, or PVC and, on the other hand, powder of bamboo, wood and/or cork. This substrate layer is glued together with a veneer layer, such as a decorative vinyl layer. This floor panel already offers a considerably higher resistance against telegraphy effects. Due to the rigidity thereof, it is also easier to install. However, it also has disadvantages. So, the flatness of the floor panel cannot be guaranteed. There is a considerable risk that it will warp. Moreover, the floor panel seems to be sensitive for the forming of indentations in the upper side thereof, for example, when table or chair legs are standing thereupon. Further, delamination problems may occur, wherein the veneer layer becomes detached from the substrate layer.

Floor panel and method for manufacturing a floor panel


A gutta-percha point, used as a root canal plugging material in an endodontic treatment, is disclosed. The gutta-percha point has a plurality of engraved or embossed marks as working length marks on its upper portion. Each of the engraved or embossed marks is preferably painted with a distinguishable color along a circumferential surface. The above marks are formed on the point within a marking range while being spaced out at intervals of 1 mm and 2 mm. The marking range starts at a position, spaced apart from the apex of the point by 18 mm, and ends at a position spaced apart from the apex by 24 mm. The gutta-percha point thus allows an endodontist to be free from a repeated marking of working lengths on such points during an endodontic treatment, thus allowing the endodontic treatment to be accomplished within a desired short period of time. Due to the working length marks, the gutta-percha point is precisely inserted into an access cavity of a decayed tooth by a desired depth, thus being free from forming a dead space in the root canal or piercing the apical tissue.

1. Field of the Invention
The present invention relates, in general, to gutta-percha points used as plugging materials for root canals in endodontic treatments and, more particularly, to an endodontic gutta-percha point having working length marks at its upper portion.
2. Description of the Prior Art
As well known to those skilled in the art, gutta percha is a material, which is extracted from palaguium or payena generic plants of sapotaceae, the native plants of the Malay Archipelago. The gutta percha has a semisolid phase at an ordinary temperature, but is changed in the phase when it is pressurized or heated. When the gutta percha is heated to a temperature higher than 60° C., it becomes a plastic.
Gutta-percha points, used as plugging materials for a root canal in an endodontic treatment, may be different in their concentrations of components according to manufacturers of the points. However, most of gutta-percha points typically consist of 66% of zinc oxide, 20% of gutta percha, 11% of heavy metal sulphate (a radio-opacity material), and 3% of wax or resin used as a plasticizer.
Such gutta-percha points are problematic in that it is somewhat difficult to insert the points into narrow root canals and it is necessary to use a sealer in order to seal the root canals after inserting the points into the canals.
Another problem, experienced in typical gutta-percha points, resides in that they may be easily broken when a period of time has passed after manufacture.
However, the gutta-percha points preferably meet most of the needs typically desired from plugging materials for root canals in endodontic treatments.
Since the gutta-percha points are plastic materials, they are preferably accepted by an access cavity for the root canal and are easy to treat.
In addition, it is somewhat easy to remove the gutta-percha points from root canals in the case of a root canal retreatment or a dentodic operation. The gutta-percha points also have a low toxic effect to an apical tissue.
Gutta-percha points, which are marketed now, are generally classified into two types: standardized points and conventional points.
The standardized gutta-percha points are sized and tapered in the same scale as that of typical endodontic instruments, thus being more generally used by endodontists.
Such gutta percha has been used as a material of endodontic plugging points for 100 years or more. However, there has not been proposed another material which is more acceptable or preferable than the gutta percha as a material of the endodontic plugging points. Therefore, the gutta-percha points are widely and preferably used as root canal plugging points in endodontic treatments.
FIGS. 3a to 3g schematically show an endodontic treatment process of treating a decayed root canal using the conventional gutta-percha points.
A root canal is typically infected as follows. As shown in FIG. 3a, a tooth "T" is initially decayed at the enamel 31. The decaying of the tooth is, thereafter, propagated to the dentine 32, the pulp cavity 33 and the root canal 34 in order. The pulp tissue in the tooth T is also infected in accordance with the propagation of decaying. When the pulp tissue is decayed, a patient feels pain.
A root canal treatment for such a decayed tooth T is carried out as follows. In order to treat the decayed tooth T, it is primarily necessary to prepare an access cavity 35 in the tooth T as shown in FIG. 3b.
In order to form such an access cavity 35, the decayed portions of both the enamel 31 and the dentine 32 are removed from the tooth T using an endodontic instrument, such as a file or a reamer. In such a case, the decayed pulp tissue has to be also removed. The access cavity 35 is enlarged by smoothing the interior surface of the cavity 35 using the endodontic instrument. The enlarged and smoothed cavity 35 is finally sterilized and dried using paper points.
After the access cavity 35 is primarily formed in the tooth T, it is necessary to measure a working length WL from the top of the tooth T to the apical foramen 36 as shown in FIG. 3c.
In such a case, the measurement of the working length WL in the decayed tooth T is for limiting the access area for endodontic instruments, medicines and plugging materials so as to prevent the apical tissue from any damage during both an access cavity preparation process and a root canal plugging process.
Of course, there may be different working lengths WL in accordance with patients, teeth T, and positions of apical foramens 36. However, such working lengths WL typically range from about 18 mm to about 24 mm.
The measurement of the working length WL is performed using a file 37 with a silicon rubber stopper 38. That is, in order to measure the working length WL, the file 37 is primarily inserted into the access cavity 35 until the apex of the file 37 reaches a position around the apical foramen 36 without piercing the apical tissue or giving pain to the tissue. Thereafter, an X-ray inspection is carried out so as to determined whether the apex of the file 37 is appropriately accepted by the apical foramen 36 or not. When the X-ray inspection shows that the apex of the file 37 is appropriately accepted by the apical foramen 36, the stopper 38 is adjusted along the file 37 until the stopper 38 meets the top of the tooth T. In such a case, the length from the apex of the file 37 to the stopper 38 is the working length WL.
The working length WL on the file 37 is measured using an endodontic ruler which shows the length WL as a numerical value. Thereafter, gutta-percha points, including master and accessory points, are measured using the endodontic ruler so as to determine a length, which is equal to the calculated working length WL, on each point. In such a case, the length measurement of the gutta-percha points is started from the sharpened apex of each point. After measuring a working length WL of each gutta-percha point using the endodontic ruler, the end of the length WL opposite to the apex is marked on each point prior to starting a root canal plugging process using the points. The root canal plugging process is shown in FIG. 3d.
In the root canal plugging process, a sealer is primarily applied to the access cavity 35. Thereafter, the master point of the gutta-percha points is inserted into the tooth T until the mark of the working length WL on the master point is aligned with the top of the tooth T. The insertion of the master point is followed by an insertion of accessory points. That is, after the insertion of the master point, a plurality of accessory points of the gutta-percha points are inserted into the access cavity 35 at positions around the master point using a spreader. The insertion of the accessory point is also carried out through a lateral condensation method. In the root canal plugging process, it is also necessary to prevent any gap from being left in the access cavity 35 filled with the points.
In the above plugging process, it is preferable to make the apex of each gutta-percha point precisely aligned with the apical foramen 36 of the access cavity 35.
When the apex of each gutta-percha point fails to reach the apical foramen 36, a dead space is formed at an area between the apex of the point and the apical foramen 36. Such a dead space may allow a propagation of bacteria at that space and this forces the patient to suffer from the root canal retreatment. On the other hand, when the sharpened apex of each gutta-percha point exceeds the apical foramen 36 and pierces into the apical tissue, the apex of the point pressurizes the apical tissue and gives the patient pain.
Therefore, it is necessary to insert the gutta-percha points, particularly, the master point, into the access cavity 35 with the apex of each point being appropriately accepted by the apical foramen 36. In order to accomplish the above object, it is very important to precisely mark the working length WL on each point, particularly, the master point, and to precisely insert the points into the access cavity 35 by the working length WL.
After inserting the gutta-percha points into the access cavity 35, the upper portions of the points are removed using a plugger with the lower portions of the points being left in the enlarged root canal as shown in FIG. 3e.
FIG. 3f shows an amalgam 39 filling in the upper portion of the access cavity 35 with the gutta-percha points plugging the enlarged root canal.
As shown in FIG. 3g, a gold crown 40 is, thereafter, exteriorly set on the top portion of the tooth T filled with both the gutta-percha points and the amalgam 39 in the access cavity 35. An endodontic treatment process is thus accomplished.
However, the above-mentioned process gives inconvenience to both endodontists and patients due to a structural defect of the typical gutta-percha points. That is, in the above process, it is necessary for an endodontist to measure a working length WL using a file 37. The working length WL on the file 37 is measured using an endodontic ruler which shows the length WL as a numerical value. Thereafter, gutta-percha points, including master and accessory points, are measured using the endodontic ruler so as to determine a length, which is equal to the calculated working length WL, on each point prior to marking the upper end of the length WL opposite to the apex of each point. However, typical gutta-percha points 20 are free from any working length marks on its surface as shown in FIG. 1. Therefore, it is necessary for endodontists to mark the working lengths WL on the gutta-percha points 20 during root canal treatments. In order to mark the working lengths WL on the points 20, each point 20 may be bent at a position corresponding to the upper end of the length WL, thus forming a bent portion 21 on the point 20 as shown in FIG. 2a. Alternatively, the working length WL may be marked on each point 20 by pressing the point 20 using an appropriate marking instrument, such as a pincette, at a position corresponding to the upper end of the length WL, thus forming a pressed mark 22 on the point 20. Of course, there may be other methods of forming the mark of the working length WL on each of the gutta-percha points 20.
Therefore, the typical gutta-percha points 20 are problematic in that they force an endodontist to repeatedly and manually measure a working length-WL and to form the bent portions 21 or the pressed marks 22 on the points 20 during a root canal treatment. Such gutta-percha points 20 thus consume time and this is inconvenient to both the endodontists and patients since it is necessary to precisely perform a root canal treatment within a somewhat short period of time with the mouth of a patient being continuously and fully opened.
Furthermore, there may occur an undesired error while measuring a working length WL with an endodontic ruler or forming a bent portion 21 or a pressed mark 22 on each point 20 so as to mark the working length WL on each point 20 during a root canal treatment. Such an error makes the apexes of the points 20 fail to be precisely aligned with an apical foramen 36. This regrettably results in an operational error during a root canal treatment.

Endodontic gutta-percha point with working length marks


The present invention relates to methods and compositions for the direct detection of analytes using color changes that occur in immobilized biopolymeric material in response to selective binding of analytes to their surface. In particular, the present invention provides methods and compositions related to the encapsulation of biopolymeric material into metal oxide glass using the sol-gel method.

The present invention relates to methods and compositions for the direct detection of analytes using color changes that occur in immobilized biopolymeric material in response to selective binding of analytes to their surface.
A major goal of analyte detection research is to develop inexpensive, fast, reliable, and sensitive detectors. Unfortunately, the technologies developed to date have only met some of these goals, and no single device has sufficiently attained a majority of them.
Classical detection methods such as liquid chromatography (LC), gas chromatography (GC), and supercritical fluid chromatography (SFC), in combination with mass spectrometry, are widely used and provide accurate identification of analytes and quantitative data. However, these techniques are time consuming, extremely expensive, require sample preconcentration, and are difficult or impossible to adapt to field use.
Biosensors (i.e., devices containing biological material linked to a transducing apparatus) have been developed to overcome some of the shortcomings of the classical analyte detection techniques. Many currently used biosensors are associated with transducer devices that use photometry, fluorimetry, and chemiluminescence; fiber optics and direct optical sensing (e.g., grating coupler); surface plasmon resonance; potendiometric and amperometric electrodes; field effect transistors; piezoelectric sensing; and surface acoustic wave (Krxc3xa4mer, J. AOAC Intern. 79: 1245 [1996]). However, there are major drawbacks to these devices, including their dependence on a transducing device, which prevents miniaturization and requires a power source. These disadvantages make such devices too complex, expensive, or unmanageable for many routine analyte detection applications such as field work or home use. Additionally, many of these devices are limited by the lack of stability and availability of the biological materials (e.g., proteins, antibodies, cells, and organelles).
Immunoassay methods are also used for detecting certain types of analytes. In these methods, antibodies are developed to specifically bind to a target of interest (e.g., an analyte). By labeling the antibody (e.g., with dye or fluorescent or radioactive material), binding of the antibody to an analyte can be detected. However, immunoassay methods are limited in that they require production of antibodies against each analyte of interest. Antibodies cannot be generated against some types of analytes and their generation can be time consuming and expensive.
The art remains in need of analyte detectors that provide the specificity of biosensors but also provide the cost-efficiency, stability, accuracy, reliability, reproducibility, and robustness that is lacking from available technologies. In particular, development of devices that can be miniaturized with controlled shapes and that do not rely on an energy source would also be very beneficial, particularly for routine field work and home use.
The present invention relates to methods and compositions for the direct detection of analytes using color changes that occur in immobilized biopolymeric material in response to selective binding of analytes to their surface.
The present invention provides various methods and compositions useful for the detection of analytes.
In one embodiment, the present invention provides methods for immobilizing biopolymeric material: providing a metal oxide, biopolymeric material, an acid, a buffer, and a sonicating means; sonicating the metal oxide and the acid using the sonicating means to produce a sonicated solution; adding the buffer to the sonicated solution to produce a buffered solution; and adding the biopolymeric material to the buffered solution to produce an organic/inorganic solution.
In alternative embodiments of the methods, the present invention further comprises the steps of applying the organic/inorganic solution to a formation support to produce a formed organic/inorganic solution; and gelling the formed organic/inorganic solution to produce an organic/inorganic device.
In preferred embodiments, the metal oxide comprises tetramethylorthosilicate, although it is contemplated that any material that can be used to produce substantially transparent, porous glass will be used in the methods of the present invention.
In some embodiments, the biopolymeric material is selected from the group consisting of liposomes, films, multilayers, braided, lamellar, helical, tubular, and fiber-like shapes, solvated rods, solvated coils, and combinations thereof.
In other embodiments, the biopolymeric material comprises a plurality of self-assembling monomers selected from the group consisting of diacetylenes, acetylenes, alkenes, thiophenes, polythiophenes, imides, acrylamides, methacrylates, vinylether, malic anhydride, urethanes, allylamines, siloxanes anilines, pyrroles, vinylpyridinium, and combinations thereof, although any self-assembling monomer that will form biopolymeric material is contemplated by the present invention. In preferred embodiments, the diacetylenes are selected from a group consisting of 5,7-docosadiynoic acid, 10,12-pentacosadiynoic acid, 5,7-pentacosadiynoic acid, and combinations thereof. In yet other embodiments, the self-assembling monomers contain head groups selected from the group consisting of carboxylic acid, hydroxyl groups, amine groups, amino acid derivatives, and hydrophobic groups, although any head group that exists or can be synthesized on self-assembling monomers is contemplated by the presently claimed invention.
In some preferred embodiments, the biopolymeric material further comprises a ligand. In some embodiments, the ligand is selected from the group consisting of peptides, carbohydrates, nucleic acids, biotin, drugs, chromophores, antigens, chelating compounds, molecular recognition complexes, ionic groups, polymerizable groups, linker groups, electron donors, electron acceptor groups, hydrophobic groups, hydrophilic groups, receptor binding groups, antibodies, and combinations thereof, although any ligand that can be linked to, or associated with, biopolymeric material is contemplated by the present invention.
In some preferred embodiments, the acid comprises hydrochloric acid, while in other preferred embodiments, the buffer comprises 3-[N-Morpholino]propanesulfonic acid. In other embodiments, the sonicating is conducted at a temperature from 0xc2x0 C. to 20xc2x0 C.
The present invention further provides an organic/inoiganic device produced according to any and all of the methods described above. In addition, the present invention provides biopolymeric material encapsulated in sol-gel glass. In some embodiments, the glass comprises tetramethylorthosilicate.
In some preferred embodiments, the biopolymeric material encapsulated in sol-gel glass is selected from the group consisting of liposomes, films, multilayers, braided, lamellar, helical, tubular, and fiber-like shapes, solvated rods, solvated coils, and combinations thereof. In particularly preferred embodiments, the biopolymeric material comprises self-assembling monomer selected from the group consisting of diacetylenes, acetylenes, alkenes, thiophenes, polythiophenes, imides, acrylamides, methacrylates, vinylether, malic anhydride, urethanes, allylamines, siloxanes anilines, pyrroles, vinylpyridinium, and combinations thereof, although any self-assembling monomer that will form biopolyrneric material is contemplated by the present invention. In preferred embodiments, the diacetylenes are selected from a group consisting of 5,7-docosadiynoic acid, 10,12-pentacosadiynoic acid, 5,7-pentacosadiynoic acid, and combinations thereof. In yet other embodiments, the self-assembling monomers contain head groups selected from the group consisting of carboxylic acid, hydroxyl groups, amine groups, amino acid derivatives, and hydrophobic groups, although any head group that exists or can be synthesized on self-assembling monomers is contemplated by the presently claimed invention.
In some preferred embodiments, the biopolymeric material encapsulated in sol-gel glass further comprises a ligand. In some embodiments, the ligand is selected from the group consisting of peptides, carbohydrates, nucleic acids, biotin, drugs, chromophores, antigens, chelating compounds, molecular recognition complexes, ionic groups, polymerizable groups, linker groups, electron donors, electron acceptor groups, hydrophobic groups, hydrophilic groups, receptor binding groups, antibodies, and combinations thereof, although any ligand that can be linked to, or associated with, biopolymeric material is contemplated by the present invention.
The present invention further provides methods for detecting analytes: providing biopolymeric material encapsulated in sol-gel glass, a detection means, and one or more analyte; exposing the biopolymeric material encapsulated in sol-gel glass to the analyte to produce a response; and detecting said response using the detection means.
In preferred embodiments, the glass comprises tetramethylorthosilicate, although it is contemplated that any material that can be used to produce substantially transparent, porous glass will be used in the methods of the present invention.
In some embodiments, the biopolymeric material is selected from the group consisting of liposomes, films, multilayers, braided, lamellar, helical, tubular, and fiber-like shapes, solvated rods, solvated coils, and combinations thereof.
In other embodiments, the biopolymeric material comprises a plurality of self-assembling monomers selected from the group consisting of diacetylenes, acetylenes, alkenes, thiophenes, polythiophenes, imides, acrylamides, methacrylates, vinylether, malic anhydride, urethanes, allylamines, siloxanes anilines, pyrroles, vinylpyridinium, and combinations thereof, although any self-assembling monomer that will form biopolymeric material is contemplated by the present invention. In preferred embodiments, the diacetylenes are selected from a group consisting of 5,7-docosadiynoic acid, 10,12-pentacosadiynoic acid, 5,7-pentacosadiynoic acid, and combinations thereof. In yet other embodiments, the self-assembling monomers contain head groups selected from the group consisting of carboxylic acid, hydroxyl groups, amine groups, amino acid derivatives, and hydrophobic groups, although any head group that exists or can be synthesized on self-assembling monomers is contemplated by the presently claimed invention.
In some preferred embodiments, the biopolymeric material further comprises a ligand. In some embodiments, the ligand is selected from the group consisting of peptides, carbohydrates, nucleic acids, biotin, drugs, chromophores, antigens, chelating compounds, molecular recognition complexes, ionic groups, polymerizable groups, linker groups, electron donors, electron acceptor groups, hydrophobic groups, hydrophilic groups, receptor binding groups, antibodies, and combinations thereof, although any ligand that can be linked to, or associated with, biopolymeric material is contemplated by the present invention.
In some embodiments, the analyte is selected from the group consisting of small molecules, pathogens, bacteria, membrane receptors, membrane fragments, enzymes, drugs, antibodies, and combinations thereof, although any analyte that can be detected through its interaction with a ligand or the biopolymeric material is contemplated by the present invention.
In yet other embodiments, the biopolymeric material encapsulated in sol-gel glass comprises a badge.
In preferred embodiments, the detection means is selected from the group consisting of visual inspection, spectrometry, optical fiber, quartz oscillators, electrode surfaces, and scintillation, although any detection means that provides analysis of the presence of an analyte is contemplated by the present invention.
In some embodiments, the response is used as a competitive binding measurement to quantitate and characterize the presence of natural binding sites. In other embodiments, the biopolymeric material encapsulated in sol-gel glass comprises an array.

Sol-gel matrices for direct colorimetric detection of analytes


Methods, systems, and apparatus, including computer programs encoded on computer storage media, for developing cognitive and behavioral metrics associated with a user. In some implementations, a system obtains data from a writing implement, the data indicative of a user performing a task by writing with the writing implement against a receiving device. The system extracts features from the obtained data. The system determines metrics that reflect characteristics of the user, the metrics that reflect cognitive characteristics of the user and metrics that reflect behavioral characteristics of the user. Based on the extracted features and the determined metrics, the system generates a user profile for the user. Based on the features indicating characteristics of the writing behavior of the user, the system modifies the generated user profile as a performance of the user changes over time. The system provides recommendations to improve the performance of the user.

Conventional test-taking methods typically focus on whether an individual answers a question correctly or incorrectly. In these conventional methods, a test can pose a question for an individual to answer in a subjective response or through objectivity, by selecting among one or more answers. However, these conventional test-taking methods only evaluate whether an answer is correct and do not evaluate or focus on the individual taking the test.

Using biometric data intelligence for education management


A hula-hoop adapted to be whirled around the body of a player by movement of the hips. The hoop includes an inflatable annular core formed of plastic film or other flexible material enclosed within an annular fabric casing to provide a hoop of high strength which when not in use can be collapsed and folded to assume a compact state for storage and shipment.

1. Field of Invention
This invention relates generally to a hula-hoop, and more particularly to a collapsible hoop of this type formed by an inflatable core enclosed within a fabric casing.
2. Status of Prior Art
A hula is a Polynesian dance characterized by undulating hips. The hula dance may have inspired the Hula-Hoop, the trademark for a light-weight plastic ring which is whirled around the body of a player for play or exercise by movement of the hips.
A hula-hoop plastic ring has a relatively large diameter and since its form is fixed, it has certain practical drawbacks. Thus if a child wishes to take both a ball and a hula-hoop to a park or playground, he may have difficulty in doing so. Should the ball be inflatable, it can be collapsed and carried in the child's backpack. But a conventional hula-hoop cannot be collapsed, and its diameter is such that it is awkward for a child or even an adult to carry. Moreover, a hula-hoop, when sold in a toy store, takes an inordinate amount of space, for it cannot be collapsed to fit into a relatively small box.
Of prior art interest is U.S. Pat. No. 4,384,382 to Spector which discloses a pneumatic playball that has the configuration and appearance of a standard pneumatic athletic ball, such as a regulation basketball.
The Spector ball is constituted by an inner inflatable balloon confined within a fabric outer casing. The outer casing is formed by contoured segments of high strength, non-stretchable fabric material stitched together to create, when the casing is fully expanded, a play ball of the desired shape and size, such as a football or soccer ball. The balloon is a conventional thin-skin rubber balloon whose stem initially projects through a slit in the fabric casing. After inflating the balloon with air so that it conforms to the casing, the stem is then tied into a knot to seal the balloon, and the tied stem is pushed into the casing under the slit.
An unconfined rubber balloon has little strength and is easily burst. But when the same balloon is inflated within the confines of a non-stretchable fabric casing, even though the balloon, per se, is inherently weak, the casing does not permit any region of the balloon to further expand beyond its existing degree of expansion; hence the balloon will not burst even if the ball is given a hard kick.
A significant advantage of an inflatable ball of this type is that it can be collapsed to assume a highly compact state for storage and shipment. And unlike a conventional ball, it can be packaged in a small box or other container. The present invention seeks to impart the same advantage to a hula-hoop.


Systems and methods are disclosed for multi-objective energy management of micro-grids. A two-layer control method is used. In the first layer which is the advisory layer, a Model Predictive Control (MPC) method is used as a long term scheduler. The result of this layer will be used as optimality constraints in the second layer. In the second layer, a real-time controller guarantees a second-by-second balance between supply and demand subject to the constraints provided by the advisory layer.

The present invention relates to multi-objective energy management methods for micro-grids.
A micro-grid is the integration of loads, energy resources, and storage devices. From the operating point of view, a micro-grid is counted as one independent entity which is able to work either in grid-tied or islanded mode. Micro-grid's energy resources can include utility connection, micro-gas turbines and renewable generations such as fuel cells, wind turbines, and solar panels. It is expected and desirable that a considerable amount of demand for each micro-grid is supplied by its own renewable generations. On the other hand, the intermittent nature of most distributed generations (DGs) such as wind and photovoltaic (PV) introduces a significant uncertainty in the operation of a micro-grid. This makes the conventional unit commitment more erroneous and unreliable. Therefore, a real-time management framework as a supervisory control is an absolute necessary procedure within a micro-grid similar to the various regulatory actions in conventional power systems. The first objective for this management system is real-time dispatching of energy generations in a way that minimizes the operational cost while it guarantees the balance between supply and demand at the presence of unpredictable variations of DGs.
In order to relax the issue of sudden unpredicted unbalances between supply and demand, energy storage devices are normally utilized. Among various types of storage devices, batteries are most favorable option and also the most expensive component of micro-grid. In grid-tied micro-grids, any shortage in the supply side (power outputs from DGs and the scheduled power from the grid) should be met whether by the battery or by purchasing extra power from the grid or a combination of both. At the first glance, it might be preferred to use battery first since it is charge free. But irregular usage pattern of batteries shortens their life span and may cause a replacement cost for batteries. Three parameters affect batteries' life: 1—Depth of discharge (DoD) 2—Discharge power and 3—temperature.
It is expected and desirable that a considerable amount of demand for each micro-grid is supplied by its own local generations. The intermittent nature of most distributed generations (DGs) introduces a significant uncertainty in the operation of a micro-grid. Having more comprehensive forecasting about the renewable generations, we are able to manage the micro-grid more efficient. Hence, a long term predictive controller seems to be necessary to make the optimal decisions based on long term forecasted profiles of renewables and load. On the other hand, we need a real-time manager. It means the controller should be able to guarantee the second-by-second balance between supply and demand and deal with all fluctuations in the system. Hence, as the first problem, a management system is required to optimize both long term predictive control objective and real-time control objective simultaneously.
In order to relax the issue of sudden unpredicted unbalances between supply and demand, battery is normally utilized which is also the most expensive component of micro-grid. On the other hand, irregular usage pattern of battery shortens its life span and may cause a replacement cost for battery. Based on this idea, in micro-grids operation, it should be tried to utilize battery's power in a way that maximizes their lifetime. Therefore, maximizing the battery lifetime is an important objective that should be considered besides the energy cost minimization objective in the operation of micro-grids. Therefore, as the second problem, a multi-objective management system is needed to optimize the battery lifetime and energy cost at the same time.
Previous attempts were based on passive control of energy storage units. An example is schedule-based control in which a storage unit charges and discharges at certain times during the day. There are also some other researches which attempt to optimize the operation of micro-grid by solving an optimization problem. But they just consider and minimize the energy cost of operation; thus they cannot guarantee an optimal operation of the storage unit.

Multi-objective energy management methods for micro-grids


By incorporating an ITO electrode which is more transparent than polysilicon, and designing the pixel such that it has asymmetric gates with as much as possible of its light sensitive region covered by an ITO electrode, light sensitivity is increased. To solve the problem of impurity diffusion from the ITO electrode into the silicon below, the conventional Silicon Dioxide gate dielectric was replaced with an Oxide/Nitride/Oxide stack. Employing at least some polysilicon electrodes with ITO electrodes is desirable to allow entrance passages through which hydrogen passivation can be accomplished. The pixel architecture can be designed to increase sensitivity further by other design choices. The first of these choices is to incorporate a lenslet on each pixel such that as much as possible of the light falling on the pixel is made to pass through the portion of the pixel covered with ITO. The pixel light sensitivity improves not only because the light passes through the more transparent ITO electrode, but also because some of the light that would have fallen on the LOD region and would be lost, is now collected. The second method is for color CCD sensors with color filter patterns, such as the "BAYER" color filter pattern to name just one, to have the overlap of the color filters, which does not allow light transmission, to occur over the less sensitive area of the pixel, which is the area covered with the polysilicon electrode. For proper operation a slight modification of the vertical clock timing is needed.

In order to reduce the cost, power consumption, weight, and volume of digital cameras, it is necessary to make the CCD image sensor as small as possible while maintaining the required resolution. This is typically accomplished by decreasing the pixel size. However, for optics having the same focal number, the smaller pixel receives less total light and consequently the sensor is less sensitive. One method of increasing light sensitivity is to incorporate an Indium Tin Oxide (ITO) electrode which is more transparent than polysilicon, and to design the pixel with asymmetric gates so that as much as possible of its light sensitive region is covered with ITO.
However, in full frame CCD image sensors, ITO electrodes employed to replace the second level polysilicon electrode can result in significant amounts of impurities leaching out of the ITO electrode and into the Silicon below, significantly altering the surface channel potentials. Both p- and n-type impurities are found to diffuse through the gate dielectric and into the silicon surface. The surface impurities form interface states that are populated during normal device operation, causing a further shift in the channel potentials. While the leaching out of these impurities does not result in catastrophic conditions for the device, it does present a situation in which the operating point of the devices shift with time. Also, the large density of surface states, caused by the impurities at the Silicon/Silicon Dioxide interface, cause signal loss to occur due to a phenomenon called "charge pumping."
A PhD. Thesis by Christianus Hermanus Leopold Weijtens at the Technical University of Eindhoven, entitled, "Indium Tin Oxide for Solid-State Image Sensors," attempted to use a silicon nitride (Si.sub.3 N.sub.4) layer within image sensors to prevent the leaching of material from ITO electrodes into the silicon below. There was a shortcoming in these attempts because: (1) the ITO electrode would not properly adhere to the Si.sub.3 N.sub.4 layer; and (2) the lack of hydrogen passivation of the silicon surface at the interface with the silicon dioxide gate dielectric.
Another issue which can effect pixel sensitivity within image sensors is that of light falling in regions of the pixel that are not light sensitive, such as the drain required for the formulation of the antiblooming LOD structure. This loss of sensitivity cannot be recovered by the mere substitution of a polysilicon electrode with an ITO electrode.
Still other problems exist in image sensing devices employing color filter patterns. These color filters are arranged in patterns in which the color filters overlap. In patterns such as the "BAYER" color filter pattern, to name just one, the non-overlapping areas do not allow light transmission. Typically these areas between the color filters are over a sensitive area of the pixel, leading to a sensitivity loss.
As can be seen by the foregoing discussion, there remains a need in the art for pixel architectures that result in pixel designs that improve the sensitivity of image sensing devices.

Method of fabricating a image sensor having ITO electrodes with overlapping color filters for increased sensitivity


The disclosure describes an exemplary method of using a dual layer feature on a mask in an integrated circuit fabrication process to provide for use of the mask at multiple wavelengths. This method can include providing a dual layer feature over a mask, where the dual layer feature is configured with layers of selected thicknesses which allow the mask to be used at multiple wavelengths; and subjecting the dual layer feature and the mask to a beam at one of the multiple wavelengths.

The present specification relates generally to the field of integrated circuits and to methods of manufacturing integrated circuits. More particularly, the present specification relates to both a binary and an attenuating phase-shifting mask for use at multiple wavelengths.
Semiconductor devices or integrated circuits (ICs) can include millions of devices, such as, transistors. Ultra-large scale integrated (ULSI) circuits can include complementary metal oxide semiconductor (CMOS) field effect transistors (FET). Despite the ability of conventional systems and processes to put millions of.devices on an IC, there is still a need to decrease the size of IC device features, and, thus, increase the number of devices on an IC.
One limitation to the smallness of IC critical dimensions is lithography. In general, projection lithography refers to processes for pattern transfer between various media. It is a technique used for integrated circuit fabrication in which a silicon slice, the wafer, is coated uniformly with a radiation-sensitive film, the resist, and an exposing source (such as light, x-rays, or an electron beam) illuminates selected areas of the surface through an intervening master template, the mask, for a particular pattern. The lithographic coating is generally a radiation-sensitized coating suitable for receiving a projected image of the subject pattern. Once the image is projected, it is indelibly formed in the coating. The projected image may be either a negative or a positive of the subject pattern.
Exposure of the coating through a transparency causes the image area to become selectively crosslinked and consequently either more or less soluble (depending on the coating) in a particular solvent developer. The more soluble (i.e., uncrosslinked) or deprotected areas are removed in the developing process to leave the pattern image in the coating as less soluble polymer.
Projection lithography is a powerful and essential tool for microelectronics processing. As feature sizes are driven smaller and smaller, optical systems are approaching their limits caused by the wavelengths of the optical radiation.
One alternative to optical projection lithography is EUV lithography. EUV lithography reduces feature size of circuit elements by lithographically imaging them with radiation of a shorter wavelength. xe2x80x9cLongxe2x80x9d or xe2x80x9csoftxe2x80x9d x-rays (a.k.a, extreme ultraviolet (EUV)), wavelength range of lambda=50 to 700 angstroms are used in an effort to achieve smaller desired feature sizes.
In EUV lithography, EUV radiation can be projected onto a resonant-reflective reticle. The resonant-reflective reticle reflects a substantial portion of the EUV radiation which carries an IC pattern formed on the reticle to an all resonant-reflective imaging system (e.g., series of high precision mirrors). A demagnified image of the reticle pattern is projected onto a resist coated wafer. The entire reticle pattern is exposed onto the wafer by synchronously scanning the mask and the wafer (i.e., a step-and-scan exposure).
Phase-shifting mask technology has been used to improve the resolution and depth of focus of the photolithographic process. Phase-shifting mask technology refers to a photolithographic mask which selectively alters the phase of the light passing through certain areas of the mask to improve resolution and depth of focus according to principles of destructive interference. For example, in a simple attenuating phase shifting mask, a layer of material is selectively located to attenuate light passing through it and shift the light 180 degrees out of phase from light passing through adjacent areas not covered by the phase shifting material. This 180 degree phase difference causes any light overlapping from two adjacent apertures to interfere destructively, thereby reducing the width of the feature at the wafer. An attenuating phase shifting mask differs from an alternating phase shifting mask in that the alternating phase shifting mask generally does not have a partially transmitting phase shifting material, but rather includes trenches in the mask to shift the phase of transmitted light adjacent to the features.
An exemplary mask 10 is illustrated in FIG. 1. Mask 10 can be either a binary mask with an anti-reflect layer over chrome or an attenuating phase-shifting mask. If used as an attenuating phase-shifting mask, the mask 10 includes a transparent mask blank layer 12 and a shifting material layer 14. Shifting material layer 14 provides a printed circuit pattern and selectively attenuates the transmission of light from transparent layer 12 to a layer of resist on a semiconductor wafer. The light transmitted through shifting material layer 14 is attenuated and phase-shifted 180 degrees from the transmission of light through clear portions of phase-shifting mask, such as portions 18. As the light travels between phase-shifting mask 10 and the resist layer of a semiconductor wafer below (not shown), the light attenuated from phase-shifting mask 10 by shifting material layer 14 interferes constructively with the light transmitted through phase-shifting mask 10 at portions 18, to provide improved resolution and depth of focus.
Alternatively, the mask 10 can be a binary mask where layer 14 is an anti-reflective layer disposed over opaque chrome material. The clear areas 18 are designed to transmit light at highest intensity and the opaque areas 14 are designed to block the light completely. While this does not have the highest resolution, it is an example of mask 10 can be constructed.
As mentioned, various different wavelengths of light are used in different photolithographic processes. The optimal wavelength of light is based on many factors, such as the composition of the resist, the desired critical dimension (CD) of the integrated.circuit, the type of lithographic equipment, etc. Often, the optimal wavelength of light must be determined by performing a lithography test with photolithographic equipment having different wavelengths. When binary or phase-shifting masks are utilized at different wavelengths, two different masks must be fabricated for the given type with each mask being suitable for phase shifting or binary transmission of light of the desired wavelength. The fabrication of phase-shifting and binary test masks is costly. Further, comparison of the effect of the two different wavelengths printing processes is difficult. Having a test mask that is suitable for multiple wavelengths is of great utility in qualifying processes at different avelengths and makes the masks useable for multiple design rule (CD) enerations at the different wavelengths.
Thus, there is a need to pattern IC devices using non-onventional lithographic techniques. Further, there is a need to form maller feature sizes, such as, smaller gates. Yet further, there is a need to have either binary or attenuating phase-shifting masks useful at multiple wavelengths.
An exemplary embodiment is related to a method of using a dual layer feature on a mask in an integrated circuit fabrication process to provide for use of the mask at multiple wavelengths. This method can include providing a dual layer feature over a mask, where the dual layer feature is configured with layers of selected thicknesses which allow the mask to be used at multiple wavelengths; and subjecting the dual layer feature and the mask to a beam at one of the multiple wavelengths at a time. This dual layer feature can be an attenuating phase-shifting layer for an attenuating phase-shifting mask or it can be a dual layer anti-reflective coating over an additional opaque layer, such as, chrome forming a binary mask.
Another exemplary embodiment is related to a method of testing a lithographic mask design using a mask configured for use with multiple light or radiation beams of different wavelengths. This method can include providing at least two layers of material over a mask, removing a portion of the at least two layers of material to form a feature, and providing a beam at a wavelength to the mask and the at least two layers of material. The at least two layers of material have thicknesses selected to allow the mask to be used with multiple wavelengths.
Another embodiment is related to either an attenuating phase shift mask or a binary mask for use with multiple wavelengths. The mask can include a blank mask layer and a dual layer system disposed over the blank mask. The dual layer system forms segments of an anti-reflective layer over chrome (binary) or an attenuating phase-shifting material (att. -PSM) selectively placed over the blank mask layer.
Other principle features and advantages of the present invention will become apparent to those skilled in the art upon review of the following drawings, the detailed description, and the appended claims.

Binary and attenuating phase-shifting masks for multiple wavelengths


A display device having a control circuit for changing a time period of applying a signal voltage to each of the signal lines and a scanning voltage to each of the scanning lines within one vertical scanning period (T). The control circuit controls each of horizontal scanning periods (t1 to tm) in such a manner that the period is gradually increased from the scanning line located close to a vertical driving circuit to the scanning line located remote from the vertical driving circuit. In this way, when writing a signal voltage to a pixel via the signal lines, the target potential is reached at each pixel within the time period of applying the signal voltage.

The present invention relates to a display device comprising:                a matrix of rows and columns of pixels,        a group of first wires, each first wire coupled to a respective one of the rows of pixels,        a group of second wires, each second wire coupled to a respective one of the columns of pixels,        first voltage applying means for applying a scanning voltage to each of the first wires successively and        second voltage applying means for applying respective signal voltages to each of the second wires in synchronization with the scanning voltage successively applied to the first wires.
In recent years, electronic devices equipped with flat panel displays such as a liquid crystal display (hereinafter referred to as "LCD"), a plasma display panel (PDP), a field emission display (FED) and an organic EL (electroluminescence) display as display devices are becoming widespread rapidly. Above all, the widespread use of electronic devices equipped with LCDs is remarkable and they cover a fairly broad spectrum of applications.
Examples of LCDs include so-called active matrix type LCDs using thin film transistors hereinafter referred to as "TFTs". These TFTs make it possible to implement an LCD provided with multiple scanning lines as, for example, required for large screen or high definition displays, with excellent display performance such as contrast and on/off response. Such an active matrix type LCD generally comprises an array of pixels arranged in a matrix of horizontal and vertical lines. Horizontal lines are also called scanning lines or rows; vertical lines are also called signal lines or columns. Driving circuits are provided for both the horizontal and vertical lines, and each pixel is provided with a TFT as a switching element. In this LCD, the horizontal driving circuit cyclically supplies a sequential scanning voltage to the scanning lines for driving TFTs line by line in sequence, while the vertical driving circuit, operating in synchronization with the horizontal driving circuit, selectively supplies signal voltages to the signal lines according to an image signal. In this way, pixels are selected through the scanning lines one row of pixels at a time from top to bottom. Signal voltages are applied to each of the respective electrodes of the pixels on the selected scanning line via the corresponding signal lines in a sequential manner. The signal voltages are written at the respective electrodes of the pixels and an image is displayed on the display panel. Thus, within a period during which one scanning line is selected, hereinafter also referred to as "horizontal scanning period", the signal voltages are supplied to the pixels corresponding to the scanning line.
However, since the signal lines are normally made of a conductive material, the above-mentioned conventional LCD has a problem that a time constant of the signal line affects the display performance of the LCD. This often becomes problematic especially in such a case as a large display and a high definition display.
FIG. 4 is a timing chart when a voltage is applied to each pixel of the conventional LCD. FIGS. 4A to 4E illustrate signals on the scanning lines of the first to third rows R1, R2, R3, the (M-1)th row RM-1 and the Mth row RM and FIG. 4F illustrates a signal, indicated by NES, of an arbitrary signal line close to the horizontal driving circuit and FIG. 4G illustrates a signal, indicated by FES, of a signal line remote from the horizontal driving circuit. As shown in FIGS. 4A to 4E, the horizontal scanning period t is the time period allocated to each line for scanning this line. During a vertical scanning period T the selection of all scanning lines is completed once. For this reason, if the time constant increases, the signal voltages, while writing pixels on the nearer end side NES close to the vertical driving circuit, reach still the target potential TP during the horizontal scanning period t as shown in FIG. 4F, whereas for pixels on the farther end side FES remote from the vertical driving circuit, the waveforms of the signal voltages applied to the signal lines become less steep and the signal voltages do not reach the target potential TP within the horizontal scanning period t, making it difficult to write correct signal voltages to the pixels. This would lead to deterioration of the display performance of the device such as brightness deviations.
A possible way to solve this problem is to lengthen each horizontal scanning period t. However, simply lengthening each horizontal scanning period t means lengthening the vertical scanning period T, which would lead to deterioration of display quality due to flickering.

Device and method for varying the row scanning time to compensate the signal attenuation depending on the distance between pixel rows and column driver


A floating fastener comprises a retainer and a captive nut held within a cavity of the retainer. The nut is star-shaped with four points spaced equally apart and with four valleys on the periphery of the nut between the points creating the overall star-shape of the nut. Likewise, the cavity in the retainer corresponds to the shape and contour of the nut but sized so that there is a substantial gap between them. Permissible lateral float of the nut can be maximized by employing a particular angularity of the sides of the valleys in relation to other dimensions of the fastener.

As manufacturing become more and more cost competitive there is an ever increasing need for fastening systems which allow for a wider degree of manufacturing tolerance. Rapid mass-production of components often results is component dimensions which vary from the ideal specification. To accommodate this situation, fasteners which attach components accommodate such variations by allowing a range of misalignment. Internally threaded fasteners, i.e. nuts, are often supplied with a retainer that loosely hold the nut inside against rotation. Some examples include "cage nuts" and a category of "floating fasteners". Some of these fasteners have retainer attachment means that clinch to the receiving panel by the deformation of the panel material. Examples are those manufactured by Penn Engineering Corp. as shown in their sales bulletin entitled, "Floating Self-Clinching Fasteners". These fastener are constructed with a square nut held within a somewhat larger square cavity of a retainer with clinch attachment features. As relative torque is applied between the nut and the retainer, the corners of the nut bear against the inside of the retainer cavity to resist rotation of the nut.
As there is the need for the maximization of performance in all manufacturing, it is desired to provide a floating fastener with the greatest degree of float within the requirements of size and strength. This is a main object of the present invention.


The present invention is an improved protective cover for use in protecting a wearer against liquid contact, even under highly demanding conditions. The invention describes a seam that joins two laminates where the seam provides against leakage and air passage according to tests described in the text.

1. Field of the Invention
The present invention relates to garments and other covers used to protect against passage of air and water.
2. Description of Related Art
Conventional gloves made from silicone or other "rubber" elastomer have proven to be relatively good protective barriers. These products are quite impermeable to most contaminants and are inexpensive enough to be discarded after each use. However, rubber gloves have a number of deficiencies, including being impermeable to moisture vapor (making them very uncomfortable to wear for long periods of time), being subject to deterioration when exposed to certain chemicals or other adverse environmental conditions, and being prone to puncture and tears.
One answer to the uncomfortable nature of conventional rubber gloves is to employ gloves made from a waterproof and breathable material, such as expanded polytetrafluoroethylene (PTFE) made in accordance with U.S. Pat. No. 3,953,566 to Gore. Expanded PTFE as a membrane comprises a lattice of polymeric nodes and interconnected fibrils that creates an effective microporous barrier. This barrier repels water and other liquids while allowing moisture vapor to escape. A barrier of expanded PTFE has also been demonstrated to be quite effective at isolating contaminants, such as microorganisms.
Gloves, and glove inserts made from expanded PTFE and fabric composites are commercially available under the trademark GORE-TEX from W. L. Gore & Associates, Inc., Newark, Del. For many uses these gloves are considered to be the state-of-the-art in waterproof/breathable protection. Despite their effectiveness in a wide variety of applications, it has now been determined that at least certain gloves made from this composite do not consistently pass certain highly demanding tests, such as those for microbial protection. While these gloves are thoroughly waterproof through both the membrane and the seams, according to certain tests it has been determined that some penetration can occur through these gloves over an extended period of time. Further study has demonstrated that, although the composite material in these gloves does present a successful shield, surprisingly it is the seams of these gloves that are prone to leakage under heavy demands.
Conventional seams in expanded PTFE and fabric composites are generally formed by applying a bead of adhesive between fabric layers and sealing the seams together, sometimes under some elevated heat and pressure. Another approach in seam construction is to apply high heat and pressure to a polymeric coating so as to melt-flow and bond two layers together. Despite the effectiveness of these approaches in avoiding water penetration, it has been determined that these seams are not effective strong barriers to sub-microscopic contaminants, such as viruses suspended in a body fluid simulant (42.+-.2 dynes/cm), or liquid over an extended period of exposure.
Previous glove inserts used in ski gloves and similar applications are not consistently airproof as measured by a "Whole Glove Leak Tester" (WGLT). While these inserts are waterproof as measured by a 5 minute dunk test (see ANSI/NFPA 1973 "Gloves for Structural Fire Fighting" test Chapter 5-12), and a 1 minute fill test, these inserts are not durably waterproof as measured by 1 hour wicking dye test.
Inserts used in military applications are airproof as measured by the WGLT and waterproof as measured by a 15 minute water fill test. However, these inserts are not durably waterproof as measured by the 1 hour wicking dye test.
Most recently, the United States has raised its standards for leakage protection, requesting that the glove should be able to pass a 24 hour wicking dye test. Until the present invention, no previous glove construction could assure compliance with such a rigorous standard.
Accordingly, it is a primary purpose of the present invention to provide an improved protective cover that is comfortable to wear yet provides a durable and highly effective barrier to air and water penetration.
These and other purposes of the present invention will become evident from review of the following specification.

Protective covers with water and air impenetrable seams


A semiconductor device includes a lower substrate having at least one wiring pattern formed of a plurality of wirings, a semiconductor chip positioned above the lower substrate and electrically connected to the wirings, an intermediate member which seals the semiconductor chip in columnar form and substantially, and an upper plate which substantially covers a whole upper surface of the intermediate member. A thermal expansion coefficient of the upper plate and a thermal expansion coefficient of the lower substrate are set substantially identical.

The present invention relates to a semiconductor device wherein a semiconductor chip is electrically connected to a lower substrate and sealed, and a method for manufacturing the same.
In a conventional semiconductor device, a plurality of circuit wirings are provided in a wiring substrate or board used as a lower substrate formed of a glass epoxy resin containing glass fiber. A semiconductor chip is electrically connected to the circuit wirings and mounted thereto. The semiconductor chip mounted to the wiring board is sealed with a first encapsulating resin layer substantially equal to the wiring board in thermal expansion coefficient, followed by being heated, whereby it is temporarily cured. After the temporary curing of the first encapsulating resin layer, a second encapsulating resin layer formed of a high Tg resin matched with the wiring board in thermal expansion coefficient is applied so as to reach the thickness equivalent to the wiring board. The first and second encapsulating resin layers are thermoset and thereby manufactured. Excessive thermal expansion of the first encapsulating resin layer, which will exceed a glass transition temperature Tg upon heat treatment in a reflow process at the mounting of the semiconductor device to a mounting board or a printed circuit board, is suppressed by the second encapsulating resin layer not exceeding the glass transition temperature Tg to thereby prevent warpage of the semiconductor device.
There is also known a semiconductor device wherein after temporary curing of a first encapsulating resin layer, a high rigid member comprised of a metal or the like smaller than a range in which an encapsulating resin layer is applied, is disposed on the first encapsulating resin layer, followed by application of a second encapsulating resin layer, which in turn is thermoset to enhance the rigidity of the semiconductor device, thereby preventing warpage of the semiconductor device in a reflow process (refer to, for example, a patent document 1 (Japanese Unexamined Patent Publication No. Hei 10 (1998)-112515 (paragraph 0019 in page 4- paragraph 0031 in page 5 and paragraphs 0031-0033 in page 5, and FIGS. 1 and 3)).
However, a problem arises in that that when the technique of the patent document 1 referred to above is used for a lower substrate such as a silicon substrate whose thermal expansion coefficient is less than or equal to half the thermal expansion coefficient of the encapsulating resin layer, warpage caused by the difference between the thermal expansion coefficients of the silicon substrate and the encapsulating resin layer occurs in the semiconductor device when the silicon substrate equipped with the semiconductor chip is sealed with the encapsulating resin layer and cured by heating and cooled in its manufacturing process, i.e., the heat-cured encapsulating resin layer is more shrunk upon cooling to cause dish-shaped warpage in the semiconductor device.
Incidentally, the patent document 1 does not cause the above problem because the semiconductor chip mounted onto the wiring board formed of the glass epoxy resin is sealed with the first encapsulating resin layer approximately equal to the wiring board in thermal expansion coefficient.
Also the patent document 1 does not cause the above problem because since the high rigid member formed of the metal or the like (having a length of about half according to FIG. 3 in the patent document 1) smaller than the range in which the encapsulating resin layer is applied onto the first encapsulating resin layer, is disposed after the temporary curing of the first encapsulating resin layer, the amounts of shrinkage of the wiring board and the high rigid member reach the same degree because the length of the high rigid member less than or equal to half in thermal expansion coefficient is set to about half the length of the wiring board even though the second encapsulating resin layer is subsequently applied and thermoset.

Semiconductor device including substrate and upper plate having reduced warpage