Disclosed is equipment for charged-particle beam lithography capable of executing exposure even when an electron beam with a bad property is produced due to a failure in some multibeam forming element, without replacing the failing multibeam forming element and without reducing the exposure accuracy. The equipment includes means for forming a plurality of charged-particle beams arranged at predetermined intervals; a plurality of blankers which act on the plurality of charged-particle beams individually; a common blanker which acts on all of the plurality of charged-particle beams; and a blanking restriction for causing those charged-particle beams which are given predetermined deflection by the plurality of blankers to reach onto a sample, with a signal applied to the common blanker, and blocking those charged-particle beams which are not given the predetermined deflection by the plurality of blankers to the sample. The equipment blocks beams with bad properties to the sample and executes exposure using only those beams which have bad properties.

The present invention relates to a semiconductor manufacture technology to be used in semiconductor processes, and, more particularly, to an exposure technology for charged-particle beam lithography which exposes a pattern on a substrate like a wafer, or a master like a mask or reticle using a plurality of charged-particle beams.
With the recent remarkable advancement on the miniaturization of circuit patterns and high scale integration, the electron beam exposure that is used in fabrication of photomasks demands a higher processing speed as well as a higher accuracy. The direct exposure system which directly exposes a pattern on a wafer using an electron beam and which is promising as the next generation lithography technology faces the throughput as the first challenge for mass production of devices.
To improve the throughput, the electron beam exposure is advancing in the direction of increasing the area of electron beams that can be irradiated at a time. As the point beam system that uses point beams suffers a poor throughput too low for mass production, the variable forming system that uses beams having size-changeable rectangular cross sections has been developed. While the system has a throughput higher by one to two digits than the point beam system, it still has a lot of issues on the throughput that should be cleared for exposure of miniaturized patterns with high integration. Developed in this respect is the cell projection system that makes the cross section of a beam into a desired shape using a cell mask with respect to specific patterns which are frequently used. While this system has a large merit on semiconductor circuits which involve many repetitive patterns, such as a memory circuit, it is hard to achieve for semiconductor circuits which involve few repetitive patterns, such as a logic circuit, because of multiple patterns that should be prepared on a cell mask.
One way to solve the problem is a multibeam system which irradiates a plurality of electron beams on a sample, deflects the electron beams to scan on the sample, and individually turns on or off the electron beams according to a pattern to be exposed, thereby exposing the pattern. Because this system can expose an arbitrary pattern without using a mask, the throughput can be improved further.
Such multibeam electron beam exposing systems are disclosed in, for example, Japanese Patent Application Laid-Open No. 2001-267221 and Japanese Patent Application Laid-Open No. 2002-319532. An example of an electron beam exposing apparatus will be described referring to a schematic diagram in FIG. 1.
Reference symbol "101" denotes a crossover image which is formed by an electron gun. With the crossover 101 being a light source, a condenser lens 102 forms an approximately parallel electron beams. The condenser lens in this example is an electromagnetic lens. Reference symbol "103" is an aperture array having apertures arrayed two-dimensionally. Reference symbol "104" is a lens array having electrostatic lenses having the same focal length arrayed two-dimensionally. Reference symbols "105" and "106" are deflector arrays each having a two-dimensional array of electrostatic deflectors which can be driven individually. Reference symbol "107" is a blanker array having a two-dimensional array of electrostatic blankers which can be driven individually.
The approximately parallel electron beams formed by the condenser lens 102 are split into a plurality of electron beams by the aperture array 103. The split electron beams form intermediate images of the crossover 101 at the height of the blanker array 107 by the respective electrostatic lenses of the lens array 104. At this time, the deflector arrays 105 and 106 individually adjust the paths of the electron beams to cause the associated intermediate images of the electron sources to pass at desired positions in the associated blankers in the blanker array 107.
The blankers in the blanker array 107 individually control whether or not to irradiate the associated electron beams on a sample 115. Specifically, the electron beam that is deflected by the associated blanker is blocked by a blanking restriction 109 and is not irradiated on the sample 115. As the electron beam that is not deflected by the blanker array 107 is not blocked by the blanking restriction 109, the beam is irradiated on the sample 115.
As mentioned above, the aperture array 103, the lens array 104, the deflector arrays 105 and 106, and the blanker array 107 form a plurality of intermediate images of the crossover and control whether or not to irradiate each electron beam on the sample 115. The aperture array 103, the lens array 104, the deflector arrays 105 and 106, and the blanker array 107 together are called a multibeam forming device 108.
The intermediate images of the crossover that are formed by the multibeam forming device 108 and are individually controlled whether or not to be irradiated on the sample 115 are projected in reduced size on the sample 115 set on a stage 116 by electromagnetic lenses 110, 111, 112 and 113. The position of the size-reduced projected image is determined by the amount of deflection by a deflector 114.
For such a multibeam system, a method of detecting the occurrence of a failure and the location of a failure in a blanking aperture array which forms a charged-particle beam has been proposed as disclosed in, for example, Japanese Patent Application Laid-Open No. 11-186144.
Further, Japanese Patent Application Laid-Open No. 2000-43317, for example, proposes a method capable of performing an exposure process even with some LDs broken or unable to emit light in a multibeam exposure apparatus using LDs.

Method of charged particle beam lithography and equipment for charged particle beam lithography


Systems and methods are provided for the removal and disposal of chromium form an aqueous medium. The systems and methods include the removal of chromium from a source by contact with either natural or synthetic zeolite that has been modified with a ferrous ion or other like substance. The spent zeolite is disposed of and replaced with freshly modified zeolite. In some cases the systems and methods are performed under de-oxidizing conditions.

Cities and towns throughout the world depend on clean potable water supplies. The dependence on clean water has increased as the population of the world has increased, especially as industrial use of rivers and lakes have become commonplace. The increased industrial use of fresh water supplies has resulted in a corresponding decrease in water quality throughout the world, due principally to industrial related release of pollutants into the water supplies. The decrease in water quality is contravening to the world's increased dependence on clean potable water supplies, requiring a concerted effort toward both minimizing the release of pollution into the water supplies and removing existing pollution in water supplies throughout the world.
One particularly concerning pollutant in many water supplies is hexa-valent chromium. Hexa-valent chromium is a valence of chromium, a metallic element of atomic number 24, group VIB of the periotic table, whose ions can form many different coordinated compounds in aqueous solution. Hexa-valent chromium has been used in numerous industrial applications, for example, as an alloying and plating element on metals and plastic substrates, as a protective coating within the automobile industry, as a biocide in cooling waters, and as a constituent of inorganic pigments. Due to its widespread use in numerous manufacturing processes in numerous geographic locations, over a longer period of time, six-valent chromium and chromium containing compounds, have found their way into many of the water supplies of the world. This especially true for ground water supplies in and around locations that participated in the above described industrial applications.
Hexa-valent chromium has been shown to be carcinogenic, i.e., a cause of cancer, and corrosive to tissue, i.e., causing ulcers and dermatitis over prolonged contact with the skin. High or even moderate levels of hexa-valent chromium in a water supply is therefore a major health concern for those individuals consuming or coming in contact with such water supply. Therefore, there is a need to find efficient, cost effective hexa-valent-chromium removal systems for use on water sources through the world.
Conventional methods for removing hexa-valent chromium (Cr+6) from water supplies have focused on either anion exchange resins or chromium reduction and precipitation techniques. In particular, where the Cr+6 is at very low concentrations, an ion exchange resin is utilized for its removal. However, where the Cr+6 is at higher concentrations, the Cr+6 is first reduced to Cr+3 and precipitated out of solution as chromium hydroxide (Cr(OH)3) (requiring the use of sulfur dioxide, sodium sulfate, sodium metabisulfite, and zero-valent iron). Note that chromium hydroxide has very low solubility between pH 5 and 10, i.e., the range of pH for most water supplies. These commercial techniques for removal of Cr+6 from water supplies therefore require either the use of expensive ion exchange resins or reduction to form a precipitate of the Cr+3 from the water source.
Against this backdrop the present invention was developed.

Hexa-valent chromium removal from aqueous media using ferrous-form zeolite materials


A process for the separation and purification of hafnium and zirconium.

Zircon ore contains zirconium, as its major component, and hafnium (generally from 1 to 3% by weight). For its use in nuclear power, after carbochlorination of the ore, zirconium has to be purged as far as possible of hafnium, which is therefore found in the residual fractions of the processes for the purification of zirconium. The hafnium may, in turn, be used, and this necessitates the individual purification thereof.
For example, one of the most effective processes currently used for the purification of zirconium is that known as the process for separation in molten salts or extractive distillation in molten salts (FR-A-2 250 707 and FR-A-2 629 360). This process uses a distillation column having a plurality of plates, each supporting a layer of molten salts. A mixture of ZrCl4 and HfCl4, which is derived from the carbochlorination of the zircon ore, is introduced into the column in a gaseous state. A ZrCl4 fraction is recovered in the solvent phase at the base of the column, whereas a residual fraction enriched with HfCl4 is produced in the vapour phase at the top of the column. This residual fraction may thus, for example, comprise approximately 70% ZrCl4 and 30% HfCl4 (% by mass). An industrial plant operating in accordance with the principle may be reconditioned in order to treat this residual fraction and recover the hafnium, resulting in discontinuous operation of the plant.
Moreover, the demand of specific industries for ever-more-pure hafnium has also created a need for a process allowing large amounts of very pure hafnium to be purified.

Process for the separation and purification of hafnium and zirconium


A light-emitting device in which variation in luminance among pixels is suppressed. The light-emitting device includes a pixel; a first circuit configured to generate a signal containing information on a value of current extracted from the pixel; and a second circuit configured to correct an image signal in accordance with the signal. The pixel includes a light-emitting element; a transistor for controlling supply of the current to the light-emitting element in accordance with the image signal; a first switch configured to control connection between a gate and a drain of the transistor or between the gate of the transistor and a wiring; and a second switch configured to control extraction of the current from the pixel.

1. Field of the Invention
The present invention relates to an object, a method, or a manufacturing method. The present invention relates to a process, a machine, manufacture, or a composition of matter. In particular, one embodiment of the present invention relates to a semiconductor device, a display device, a light-emitting device, a driving method thereof, or a manufacturing method thereof. One embodiment of the present invention relates to a light-emitting device in which a transistor is provided in each pixel.
2. Description of the Related Art
In an active matrix light-emitting device including light-emitting elements, in general, at least a light-emitting element, a transistor (a switching transistor) that controls input of image signals to pixels, and a transistor (a driving transistor) that controls the value of current supplied to the light-emitting element in response to an image signal are provided in each pixel. In a light-emitting device having the above structure, drain current of a driving transistor is supplied to a light-emitting element; thus, when the threshold voltage of driving transistors varies among pixels, the luminance of light-emitting elements varies correspondingly.
Patent Document 1 discloses a display device in which the threshold voltage of a TFT (a driver element) is corrected inside a pixel so that variations in threshold voltages do not influence the luminance of a light-emitting element. Patent Document 2 to 4 disclose display devices for monitoring outside the pixels.

Semiconductor Energy Laboratory Co., Ltd.


An apparatus and method for joining adjacent members, wherein the members are placed in an overlapping layered relationship. The members are clamped between a die and a blank holder. Once clamped, a clinching operation is performed on the members to create at least a partial bond between them. In addition to the clinching operation, a level of vibrational energy is imparted to at least one of the members to reduce clamping force requirements, promote material flow and deformation and provide increased joint strength.

Ultrasonic metal welding is a solid-state welding process that produces coalescence through the simultaneous application of localized high-frequency vibratory energy and moderate clamping forces. Ultrasonic welding of various materials is known and can be used to join dissimilar metals and can weld both thin sections and thin to thick sections. It can weld through most oxides and surface oils and creates negligible odor and fumes. Ultrasonic welding requires no welding consumables and is typically cost efficient. Energy consumption is low relative to resistance spot welding and variable costs are significantly lower than for self-pierce rivets.
Ultrasonic welding normally involves vibrating overlapping or adjacent workpieces clamped between a sonotrode and an anvil. Frictional forces occurring between the vibrating workpieces create a bond or weld that occurs at the interface between the workpieces, effectively joining them to one another.
Clinching is a low-cost, mechanical fastening process that can be used to join both similar and dissimilar materials of varying thickness. Clinching involves clamping the sheets in a die and using a punch to squeeze the sheets between the punch and the die causing sideways movement of the material to form an interlock or joint between the sheets. The process does not result in a heat-affected zone, requires no joining consumables, is characterized by long tool life and low maintenance requirements and does not require high current electrical systems. Clinching operations, however, employ large clamping forces, thereby requiring heavy equipment frames that can impose access limitations. In addition, clinch joints are characterized by lower peel and shear strengths than resistance spot welds and self-pierce riveted joints.
In addition, the clinching operation may require substantial deformation of the sheet material to be joined in order to form a proper bond. In some cases, the deformation can be particularly difficult, specifically when joining high-strength metal sheets, which tend to be more brittle and thus may develop cracks or stress in the joint area.
Therefore, there is a need in the art to provide an apparatus for joining two members or workpieces that utilizes or takes advantage of the benefits of both clinching and ultrasonic welding. Combining the use of ultrasonic energy with clinching overcomes limitations associated with traditional clinching operations and enhances ultrasonic metal welding capability. Accordingly, the combination of clinching and ultrasonic welding can reduce clamping force requirements, promote material flow and deformation and result in increased joint strength.

Apparatus and method for forming a joint between adjacent members


A new easy load extendable/retractable bottom dishwasher rack for raising to a height equal to that of a top rack. The inventive device includes a rack dimensioned for being received within a dishwasher. The rack is adapted for holding dishes and flatwares therein. The rack has a pair of upper tracks disposed on a lower surface thereof. A pair of lower tracks are provided with each having a pair of forward wheels and a pair of rearward wheels extending downwardly therefrom. The wheels are slidably received within opposed door tracks of a door of the dishwasher. A pair of scissor-action support assemblies extend between the pair of upper tracks and the pair of lower tracks. Lower ends of the support assemblies are coupled with the lower tracks. A forward lower end is pivotally coupled with the lower track. A rear lower end has a roller disposed thereon for being slidable within the lower tracks. Upper ends of the support assemblies are coupled with the upper tracks. The upper ends each have a pair of wheels coupled thereto with a space disposed between the wheels.

1. Field of the Invention
The present invention relates to dishwasher racks and more particularly pertains to a new easy load extendable/retractable bottom dishwasher rack for raising to a height equal to that of a top rack.
2. Description of the Prior Art
The use of dishwasher racks is known in the prior art. More specifically, dishwasher racks heretofore devised and utilized are known to consist basically of familiar, expected and obvious structural configurations, notwithstanding the myriad of designs encompassed by the crowded prior art which have been developed for the fulfillment of countless objectives and requirements.
Known prior art dishwasher racks include U.S. Pat. No. 3,982,802 to Bailey; U.S. Pat. No. 4,573,663 to Nussbaum; U.S. Pat. No. Des. 289,812 to Alvemarker; U.S. Pat. No. 5,205,419 to Purtilo; U.S. Pat. No. 5,211,189 to Santarossa; and U.S. Pat. No. 4,053,073 to Franchin.
While these devices fulfill their respective, particular objectives and requirements, the aforementioned patents do not disclose a new easy load extendable/retractabic bottom dishwasher rack. The inventive device includes a rack dimensioned for being received within a dishwasher. The rack is adapted for holding dishes and flatwares therein. The rack has a pair of upper tracks disposed on a lower surface thereof. A pair of lower tracks are provided with each having a pair of forward wheels and a pair of rearward wheels extending downwardly therefrom. The wheels are slidably received within opposed door tracks of a door of the dishwasher. A pair of scissor-action support assemblies extend between the pair of upper tracks and the pair of lower tracks. Lower ends of the support assemblies are coupled with the lower tracks. A forward lower end is pivotally coupled with the lower track. A rear lower end has a roller disposed thereon for being slidable within the lower tracks. Upper ends of the support assemblies are coupled with the upper tracks. The upper ends each have a pair of wheels coupled thereto with a space disposed between the wheels.
In these respects, the easy load extendable/retractable bottom dishwasher rack according to the present invention substantially departs from the conventional concepts and designs of the prior art, and in so doing provides an apparatus primarily developed for the purpose of raising to a height equal to that of a top rack.

Easy load extendable/retractable bottom dishwasher rack


A plurality of images of a plurality of sections in an object are processed by using a ROI-specifying unit to specify a three-dimensional (3D) ROI (region of interest) at a region to be targeted in a three-dimensional space formed by the images. A deciding unit is then used to select one or more sections crossing the three-dimensional ROI, and a display unit is used to display images of the selected sections. The image of each of the selected sections includes an area crossing the 3D ROI. The ROI-specifying unit operates to place the 3D ROI at a region to be targeted on a first image of a section and three-dimensionally locates the 3D ROI at the region to be targeted by using both the first image and a second image of another section.

1. Technical Field of the Invention
The present invention relates to a method and apparatus for processing a plurality of sectional images of an object to be diagnosed with the use of a three-dimensional ROI (region of interest) such as spherical ROI.
2. Description of Related Art
Recently, medical imaging modalities, such as X-ray CT scanners and MRI (magnetic resonance imaging) systems, have become popular in medical facilities in which medical diagnosis and treatment is actually performed. Such medical imaging modalities are able to easily produce a large quantity of images of each patient (i.e., object to be diagnosed) in the course of medically examining or treating the patient.
For example, the MRI system has the capability of acquiring a large number of images of a patient by using a magnetic resonance imaging technique. With this technique, nuclear spins in an object placed in a static magnetic field are magnetically excited by an RF signal of a Larmor frequency of the nuclear spins. This excitement makes it possible that an MR signal emanated from the object due to the excitation is acquired and an image is reconstructed using the MR signal.
For imaging various sections of a patient using the magnetic resonance imaging, the direction of each section can be decided freely and the same region within the patient can be imaged in various different directions. Thus, this imaging capability will easily produce, if necessary, a large number of images in the process of diagnosing each patient. For a doctor's comparative observation of images, there has been a demand that the same region to be imaged be clearly pointed out on each of a plurality of images, when the images are displayed. Conventionally, this pointing-out function has been realized in various ways, such as by presentation of one or more mutual relationships between or among sections that have been imaged or by presentation of positional information about images to be displayed.
However, the conventional pointing-out techniques are not sufficient for easily and precisely supplying positional information about the same imaged region among plural sectional images. To be specific, though the same region is depicted in various sectional images, understanding where the region on any sectional image is located on the other sectional images is rather difficult for doctors or others. The reason is that, since various sections different imaging directions may also be imaged differently from each other, whereby an offset of each section is changed subtly. Such a difficulty is not limited to MRI systems, but is also true of X-ray CT scanner systems.

Method and apparatus for processing images using three-dimensional ROI


A link-processing device for displaying a summary of linked information before the link is called up is disclosed. The link processing device includes an acquisition module, an extracting module, and a displaying module. The acquisition module acquires structured information containing: link-generating information for generating links between multiple resources; and predetermined supplemental information indicating characteristics of the resource. A setting is provided for whether all resources are to be acquired or not. Based on this setting at least one resource is acquired and displayed. If all resources are to be acquired, the extracting module extracts a section of each resource except for the resource display object and/or extracts from the structured information supplemental information regarding each resource except for the resource display object. If any of the resources have been acquired, supplemental information for each of the resources other than the acquired resources is extracted from the structured information. The displaying module displays extracted information for each resource.

1. Technical Field
The present invention relates to technology for easily and efficiently referencing hyperlinks within a current structured document or between it and other structured documents while, for example, the current structured document is being displayed or edited.
In the present invention, "structured document" means electronic document information that has been structuralized based upon predetermined structural elements, and described in languages such as SGML (Standard Generalized Markup Language, ISO 8879:1986) and XML (extensible Markup Language, W3C recommendation).
A "resource," furthermore, indicates a denotable unit of information or services assigned to a link. All or an arbitrary portion of a structured document or non-structured document can be a resource. Specific examples of resources include files containing text data and image data, pictures, text documents, programs, and query results.
"Non-structured document" means electronic document information that has not been structuralized, such as standard text data, image data, and bitmap data.
"Linking" signifies the interrelating of a plurality of resources. By actuating the applicable place within the resources of a link source—for example, by selecting a word and double-clicking that selection with a mouse—a user can traverse ("jump") to the linked resource. The "displayability" of a structured document signifies the ability of the contents of a structured document described in accordance with standards such as the above-noted SGML and XML to be output visually.
2. Description of Related Art
With the rapid growth of the Internet in recent years, it has become possible to refer to various types of information easily by linking different information to a single web page. Information linked to other information is displayed using different font colors, underlining, bordering, or the like, to distinguish it from information that is not linked to other information. Of these display methods, FIG. 13 shows an example wherein underlining is used in the display. The user is able to recognize the presence of a link from the underlining and can call up the linked resource by actuating that place.
However, even if the user can recognize the presence of a link to other information in a document being displayed, the user cannot tell, for example, what kind of information is at the linked resource, what the relationship between the linked items is, without actually displaying the linked resource. Also, the user cannot know whether the information at the linked resource actually exists. Furthermore, wherein a link destination refers to a document in part, the user cannot confirm what section of the link destination document is being referenced and cannot be edited, nor which sections, not being referenced, are passages in the original that can be edited.
Also, while users can easily create a wide variety of links, this also means that it is easy to link any information to third parties' web pages. In such cases, before referring to—i.e., "going/jumping to"—the linked information, the user cannot know information such as where the link destination is and who the author of the linked information is. Furthermore, in cases of reusing linked resource information, problems may arise with linked information copyrights. However, the existence of copyrights or trademarks on the linked information is not indicated to the user until the user goes to the link destination.
Furthermore, referring to linked information requires performing operations such as clicking a mouse each time. Thus, referring to linked information takes time and reaching desired information can be time-consuming.

Method for processing links and device for the same


An optical distance measuring apparatus operable in accordance with an optical intensity modulating process to optically measure a distance between a driver's vehicle and a vehicle running ahead of his vehicle includes a light emitting portion serving as a light source to emit a distance measuring light beam, an optical lens system, a light receiving portion for receiving a reflected light reflected from the vehicle running ahead of the driver's vehicle through the optical lens system, and a processing system for correcting phase delay between the distance measuring light beam and the reflected light beam utilizing reference light beams emitted from a plurality of reference light sources to determine the distance. A processing system for determining the distance based on a time difference between the time when the distance measuring light beam is emitted from the light emitting portion and the time when the reflected light beam is received by the light receiving portion may be substituted for the processing system for the correcting phase delay between the distance measuring light beam and the reflected light beam. In addition, the system includes an apparatus for mounting on a vehicle body optical distance measuring apparatuses, each operable as a light emitting/receiving portion.

1. Field of the Invention
The present invention relates generally to an optical distance measuring apparatus employable for a movable type distance measuring system. More particularly, the present invention relates to an optical distance measuring apparatus of the foregoing type operable in conformity with an optical intensity modulating process. Further, the present invention relates to an apparatus for mounting on a vehicle body optical distance measuring apparatuses each having a light emitting/receiving portion operable in accordance with an optical intensity modulating process.
2. Description of the Related Art
To facilitate understanding of the present invention, two typical conventional optical distance measuring apparatuses will briefly be described below with reference to FIG. 1 and FIG. 2.
FIG. 1 is an illustrative view of a conventional two-eyed type optical distance measuring apparatus which schematically shows the structure of the apparatus. As shown in the drawing, the apparatus includes a lens 1 for emitting a modulated light beam from a light source 6 and a lens 2 for receiving a light beam reflected from a corner cube 3 placed on a measuring point, and both the lenses 1 and 2 are accommodated in a housing 4.
Next, FIG. 2 is an illustrative view of a conventional one-eyed type optical distance measuring apparatus which schematically shows the structure of the apparatus. This apparatus is constructed such that a light beam modulated for the purpose of measuring a distance is emitted from a light source 6 through a prism 10 and a light emitting/receiving lens 9 and a light reflected from a corner cube 3 placed on a measuring point is received by a light receiving element 7 via the light emitting/receiving lens 9 and the prism 10, and these components are accommodated in a housing 4 of the apparatus.
Although illustration is neglected, each of the conventional optical distance measuring apparatuses shown in FIG. 1 and FIG. 2 is provided with a mechanism for changing a light passage for a reference light beam serving as a reference to a light passage for a distance measuring light beam and vice versa, and moreover, a mechanism for equalizing a quantity of the reference light beam to a quantity of the measuring light.
A common problem to the conventional optical distance measuring apparatuses shown in FIG. 1 and FIG. 2 is that a distance measuring operation is restrictively performed only within the range of 1 to 2 km. In recent years, however, earnest requests have been raised from users for providing an optical distance measuring apparatus which assures that a longer distance ranging from 5 to 10 km can be measured reliably. To satisfy these requests, it is necessary that an output from the light source 6 is substantially enlarged.
Another common problem to the conventional optical distance measuring apparatuses is that when an output from the light source 6 is enlarged, a slight quantity of reflected light is received by the light receiving element 7 as a stray light via the lens surfaces and a reference light passage 5 arranged in the housing 4, resulting in each measured value being erroneously processed.
Another common problem to the conventional optical distance measuring apparatuses is that since the housing of each conventional apparatus is provided with a movable portion, the housing is susceptible to a series of vibrations, causing each measured value to be erroneously displayed on the screen of a displaying portion.
An additional common problem to the conventional optical measuring apparatuses is the fact that each optical distance measuring apparatus and head lamps are separately fabricated and they are then arranged at different locations on a vehicle body, resulting in a complicated mounting arrangement.
Further, optical axes of the head lamps and an optical axis of the optical distance measuring apparatus are separately adjusted only by performing time-consuming and complicated operations.
Since the head lamps and the optical distance measuring apparatus are separately designed and constructed, and moreover, they are separately fabricated as mentioned above, there arises a problem that it is difficult to design them based on a common technical concept.
Moreover, since infrared rays are utilized to operate the optical distance measuring apparatus, an additional problem is that it is troublesome and time-consuming to properly adjust the optical axis of each optical distance measuring apparatus after it is mounted together with head lamps on the vehicle body.


A boat rack apparatus for carrying a boat on a vehicle roof rack includes a plurality of conformable support members. Each support member has an expanse that contacts a boat hull. The expanse is supported by a rib arrangement, including a spring rib and a load rib. The spring rib underlies a flexible portion of the expanse. The load rib provides vertical support to the expanse. The support member adapts to different boat hull shapes.

Popularity for small boats and related sports has increased in recent years. New innovations in boat materials and hull designs have made sports such as kayaking and canoeing more accessible to a wide range of enthusiasts from the novice to the experienced outdoorsmen. Small boats are now commonly used for recreation in rivers, lakes, and oceans.
As more people become involved in small boating sports, there has been an increased demand for boat transport devices. Boats are often too big to fit inside a vehicle. Trailers may be cumbersome or unusable on some automobiles, particularly if a sportsman wishes to transport the boat over rough terrain. Therefore, vehicle roof racks have become the frequently preferred transport device for carrying small boats.
Accessories for conventional vehicle racks are available for transporting boats. For example, an accessory may use a cradle type berth to support a boat hull. However, a problem with cradle type racks is that they may be unsatisfactory for some hull shapes. Boat hulls come in different shapes. FIG. 1 shows examples of different boat hull profiles. Some hulls are wider, while others are narrower. Some are rounded while others have one or more distinct angles. These differences in hull shape create difficulties with a one design fits all boat accessory. Prior boat racks typically work well for one boat design and not so well for other designs because they do not provide adequate capacity to adjust and conform to different hull profiles.
If the hull does not adequately fit the cradle due to hull shape or inclination of the hull sides, the craft may roll back and forth on the hull as it is transported. This can put undue strain on the hull. An unsatisfactory solution has been to place towels or other types of padding between the rack and the boat hull, to prevent the boat from slipping and also providing extra support along the hull. However, suitable padding material may not be available or may not adequately support the boat.
An objective of the invention is to provide a boat rack design that is adaptable to different boat hull shapes, while also being simple to manufacture, rugged and substantially weatherproof.


A process for making a spin valve magnetoresistive (SVMR) sensor includes forming a nickel-oxide (NiO) layer as the antiferromagnetic layer for pinning the magnetization of the pinned ferromagnetic layer in the SVMR sensor. The process includes forming the NiO layer directly on a substrate, which may be a wafer base having an alumina layer formed on it, by ion beam sputtering (IBS) a Ni target while simultaneously introducing oxygen into the IBS system. The high energy noble gas positive ions, which are typically Xe+ ions, eject the Ni atoms from the target with sufficient energy that they aid in the dissociation of the O.sub.2 at the substrate surface. The Xe+ beam is non-neutralized, thus simplifying the process for forming the subsequent layers of the SVMR sensor and increasing the throughput of the system. The alumina substrate can be formed on the wafer base prior to formation of the NiO layer by ion sputterring an Al target in the IBS system in the presence of the same oxygen atmosphere used for the subsequently deposited NiO layer. The SVMR sensor made according to the process has a ferromagnetic layer pinned by a substantially greater exchange field from the NiO layer and significantly improved magnetoresistance over SVMR sensors with NiO antiferromagnetic layers formed by prior art processes.

Giant magnetoresistance (GMR) has been observed in a variety of magnetic multilayered structures, the essential feature being at least two ferromagnetic metal layers separated by a nonferromagnetic metal layer. This GMR effect has been found in a variety of systems, such as Fe/Cr, Co/Cu, or Co/Ru multilayers exhibiting strong antiferromagnetic coupling of the ferromagnetic layers, as well as in essentially uncoupled layered structures in which the magnetization orientation in one of the two ferromagnetic layers is fixed or pinned. The physical origin is the same in all types of structures: the application of an external magnetic field causes a variation in the relative orientation of neighboring ferromagnetic layers. This in turn causes a change in the spin-dependent scattering of conduction electrons and thus the electrical resistance of the structure. The resistance of the structure thus changes as the relative alignment of the magnetizations of the ferromagnetic layers changes.
A particularly useful application of GMR is a sandwich structure comprising two uncoupled ferromagnetic layers separated by a nonmagnetic metallic layer in which the magnetization of one of the ferromagnetic layers is pinned. The pinning may be achieved by depositing the layer onto an antiferromagnetic layer to exchange couple the two layers. This results in a spin valve magnetoresistive (SVMR) sensor in which only the unpinned or free ferromagnetic layer is free to rotate in the presence of an external magnetic field. IBM's U.S. Pat. No. 5,206,590 discloses a basic SVMR sensor for use as a read sensor or head for reading magnetically recorded data in a magnetic recording disk drive. IBM's U.S. Pat. No. 5,159,513 discloses a SVMR sensor in which at least one of the ferromagnetic layers is of cobalt or a cobalt alloy, and in which the magnetizations of the two ferromagnetic layers are maintained substantially perpendicular to each other at zero externally applied magnetic field by exchange coupling of the pinned ferromagnetic layer to an antiferromagnetic layer.
Most previously described SVMR sensors use Fe--Mn, typically Fe.sub.50 Mn.sub.50, as the antiferromagnetic layer deposited on the pinned layer for exchange coupling to fix or pin the magnetization of the pinned layer. Through exchange anisotropy with the Fe--Mn antiferromagnet, the magnetization of the pinned layer is held rigid against small field excitations, such as those that occur from the signal field to be sensed. Fe--Mn couples to nickel-iron (Ni--Fe), cobalt (Co), and iron (Fe) with an interfacial energy of 0.08 erg/cm.sup.2, and therefore is able to provide an exchange bias field in excess of the 200 Oerstead (Oe) for typical pinned layer magnetic moments. This is sufficient exchange energy to provide reasonably stable SVMR sensors. However, Fe--Mn has poor corrosion resistance.
All SVMR sensors have an interlayer exchange coupling field (H.sub.i) between the free and pinned ferromagnetic layers caused by such things as magnetostatic interactions, pin holes in the films and electronic effects. It is desirable to have a SVMR sensor with a generally low H.sub.i. SVMR sensors with the pinned layer on the bottom, i.e., on the substrate used to support the read head, require thinner Fe--Mn layers (e.g., 90 .ANG. instead of 150 .ANG.) to obtain an H.sub.i, lower than approximately 25 Oe. However, thinner Fe--Mn layers are undesirable because they have a lower blocking temperature (e.g., 130.degree. C. vs. 160.degree. C.). The blocking temperature is the temperature above which the exchange field between the Fe--Mn antiferromagnetic layer and the pinned ferromagnetic layer vanishes.
For these reasons the use of nickel-oxide (NiO) as a replacement for Fe--Mn in SVMR sensors has been proposed. The properties of SVMR sensors with NiO antiferromagnetic layers has been described by H. Hoyashi et al., Journal of the Magnetism Society of Japan, Vol. 18, p. 355 (1994); and T. C. Anthony et al., IEEE Trans. Mag., Vol. MAG-30, p. 3819 (1994). However, these results showed exchange bias fields of only about 100 Oe, which are too low for SVMR sensor applications. The NiO antiferromagnetic layers have been deposited by conventional DC or RF sputtering from a NiO target. Reactive DC or RF sputtering of a Ni target in the presence of an Ar--O.sub.2 gas to form NiO antiferromagnetic layers has been described in IBM's European patent application EP-751499, published Jan. 2, 1997, and by Shen et al., "Exchange coupling between NiO and NiFe thin films", J. Appl. Phys. 79 (8), 15 Apr. 1996, pp. 5008-5010.
The use of direction beam sputtering of a NiO target in the absence of oxygen to form an NiO antiferromagnetic layer has been described by Michel et al., "NiO Exchange Bias Layers Grown by Direct Ion Beam Sputtering of a Nickel Oxide Target", IEEE Trans. Mag., Vol. 32, No. 5, Sep. 1995, pp. 4651-4653. However, because NiO is an insulator the high energy positive ions directed at the NiO target will charge the target and ultimately prevent further ions from reaching it. Thus it is necessary to neutralize the beam by adding electrons from a hot filament wire located in the ion gun. The use of a neutralized beam complicates the SVMR sensor fabrication process because the neutralized beam is not needed to deposit the additional layers that make up the sensor and because the limited life of the filament requires the system to be shut down while the wire is replaced. In addition, the deposition rate reported by Michel et al. (0.1 .ANG./sec) would require approximately 70 minutes to deposit a 420 .ANG. layer, which is far too slow for volume production of SVMR sensors. Such a long deposition time also increases the amount of oxygen that gets distributed throughout the system, which increases the wait time needed to clear the system of oxygen before subsequent layers of the SVMR sensor can be deposited.
What is needed is a process for depositing a NiO antiferromagnetic layer that is rapid and compatible with the deposition of the other SVMR sensor layers, and which results in a SVMR sensor with good corrosion resistance, high exchange coupling between the NiO antiferromagnetic layer and the pinned ferromagnetic layer, and a low H.sub.i between the free and pinned ferromagnetic layers.

Method for making a spin valve magnetoresistive sensor

International Business Machines Corporation


A deposition mask that prevents the occurrence of defects when forming an encapsulation film or securing a long lifespan of the encapsulation film, a method of manufacturing a display apparatus by using the deposition mask, and a display apparatus manufactured by the method. The deposition mask has a first portion and a second portion, the second portion being thicker that the first portion; at least one opening in the first portion, deposition materials being passed through the opening; and a plurality of through-holes in the first portion adjacent to and surrounding the opening, the through-holes extending from an upper surface to a lower surface of the first portion, light being passed through the opening and the plurality of through-holes to irradiate the deposition materials.

1. Field of the Invention
The present invention relates to a deposition mask, a method of manufacturing a display apparatus by using the deposition mask, and a display apparatus manufactured by the method, and more particularly, to a deposition mask that prevents the occurrence of defects when forming an encapsulation film so that a long lifespan of the encapsulation film is ensured, a method of manufacturing a display apparatus by using the deposition mask, and a display apparatus manufactured by the method.
2. Description of the Related Art
Generally, a process of manufacturing a display apparatus includes a deposition process for forming a certain film on a substrate. In the deposition process, a mask including an opening corresponding to a portion where a film on a substrate is to be formed is closely attached to the substrate or is placed around the substrate, and then materials are discharged from a source on a predetermined area of a substrate after passing through the opening.
However, in the case of a mask used in the conventional deposition process, structures such as an already formed film may be damaged in a deposition process for forming a certain film, or defects, delamination, or lifespan reduction of a form film may be caused.

Deposition mask, method of manufacturing display apparatus by using the deposition mask, and display apparatus manufactured by the method


A method for setting a mode of a server includes setting the mode of the server to the negative mode when the sever boots, monitoring the network to detect a DHCP offer packet provided by another DHCP server in the network, setting the mode of the server to the positive mode when no DHCP offer packet is provided by the another DHCP server in the network and analyzing the DHCP offer packet to determine the mode of the another DHCP server when the DHCP offer packet is provided by the another DHCP server in the network. The modes of the server can be set automatically according to a state of a network in which the server works.

1. Technical Field
Embodiments of the present disclosure generally relate to servers, and more particularly to a method for setting a mode of a server.
2. Description of Related Art
A server include a system with hardware and software that responds to requests across a computer network to provide, or help to provide network service.
The dynamic host configuration protocol (DHCP) is a network protocol used to configure devices that are connected to a network so the devices can communicate on the network using the Internet protocol (IP). In the network, in accordance with transmission control protocol/Internet protocol (TCP/IP), a client can communicate with other devices in the network with an IP address. A DHCP server may allocate an IP address to the client in response to a request received from the client. With dynamic allocation, if there is the request from a client, the DHCP server selects and allocates an IP address which is not presently allocated to other clients, within an IP address range preset by a network manager.
However, several DHCP servers in the network may allocate IP addresses to the client in response to the request, and the client will use one IP address that is received firstly, which cause a waste of IP addresses and a conflict among the DHCP servers in the network.

Server and method for setting a mode of the server


A free-ink inkjet pen is adapted to be fluidically coupled to a positive pressure, off-axis ink reservoir. The pen includes a pressure regulator mechanism in an ink accumulation chamber fluidically coupled to a print head mechanism maintained at a predetermined back pressure by the pressure regulator. A flexible bag is maintained at atmospheric pressure within the accumulator and acts as an actuator against a pressure regulator bias. In the preferred embodiment, the pressure regulator mechanism includes an actuation lever and a pressure regulation lever biased toward each other. The flexible bag is mounted between the levers where by expanding and contracting both levers are actuated appropriately. A variety of bag fabrication configurations, bag materials, and valve seat materials are disclosed.

1. Field of the Invention
The present invention relates generally to the field of inkjet printing and, more particularly, to the delivery of ink to inkjet print heads and, more specifically to a regulator for a free-ink inkjet pen.
2. Description of Related Art
Inkjet technology is relatively well developed. The basics of this technology are described by W. J. Lloyd and H. T. Taub in "Inkjet Devices," Chapter 13 on Output Hardcopy Devices (Ed. R. C. Durbeck and S. Sherr, Academic Press, San Diego, 1988) and in various articles in the Hewlett-Packard Journal, Vol. 36, No. 5 (May 1985), Vol. 39, No. 4 (August 1988), Vol. 39, No. 5 (October 1988), Vol. 43, No. 4, (August 1992), Vol. 43, No. 6 (December 1992) and Vol. 45, No. 1 (February 1994).
The typical thermal inkjet print head has an array of precisely formed nozzles attached to a print head substrate that incorporates an array of firing chambers that received liquid ink (i.e., colorants dissolved or dispersed in a solvent) from an ink reservoir. In what is sometimes referred to as a disposable print cartridge, the ink reservoir is an integral element with the print head, sometimes referred to as on-axis. Alternatively, the pen can be a free-ink type print mechanism, where the ink is supplied to the print head mechanism from a separate, self-contained ink supply such as a biased ink bladder or bag--as shown in U.S. Pat. No. 5,359,353 (Hunt et al.) assigned to the common assignee of the present invention and incorporated herein by reference--sometimes referred to in the art as off-axis. An on-axis regulator mechanism is provided with the pen to control ink flow and print head pressure; one such regulator mechanism is disclosed by S. Dana Seccombe et al. in U.S. patent application Ser. No. 08/409,255, a continuation-in-part of Ser. No. 08/065,957 for an Apparatus for Providing Ink to a Printhead (sic).
Each firing chamber has a thin-film resistor, known as a firing resistor or heater resistor, located opposite the nozzle such that ink can collect between the heater resistor and the nozzle. When electric printing pulses heat the print head firing resistor, a small portion of the ink near it vaporizes and ejects a drop of ink from the print head via a nozzle orifice. The nozzles are arranged in a matrix array. Properly sequencing the operation of each firing resistor causes alphanumeric characters or graphics images to form on paper as the print head is scanned across adjacently positioned print media and a dot matrix of ink drops is printed to form a graphics image and alphanumeric characters.
In an effort to reduce the cost and size of inkjet printers and to reduce the cost per printed page, engineers have developed inkjet printers having small, moving print heads that are connected to large stationary ink reservoirs by flexible ink tubes. This development is called "off-axis" printing. In such printers the mass of the print head is sharply reduced so that the cost of the print head drive system and the overall size of the printer can be minimized. In addition, separating the ink reservoir from the print head has allowed the ink to be replaced as it is consumed without requiring frequent replacement of the costly print heads.
With the development of off-axis printing has come the need for numerous flow restrictions to the ink between the ink reservoir and the print head. These restrictions include additional orifices, or ink ports, narrow conduits, and shut-off valves. To overcome these flow restrictions and also to provide ink drops suitably over a range of printing speeds, ink is now transported to the print head at an elevated pressure and a pressure reducer has been added to deliver the ink to the print head at an optimum back pressure (an internal pressure gauged at the print head that is substantially less than the pressure at the ink reservoir and through the conduits).
One complication in the evolution of off-axis printing is the increasing need to maintain the back pressure of the ink at the print head to within as small a range as possible. Changes in back pressure greatly affect print density and print quality, and major changes in back pressure can cause either the ink to drool out of the nozzles or to deprime the print cartridge.
There are several causes for such changes in back pressure. One cause occurs when air is entrapped within the print cartridge and the print cartridge is subjected to changes in environmental parameters such as altitude, acceleration, and temperature ("air" as used herein includes both ambient air and gases that are out gassed from the ink chemical itself. If the air entrapped in a print pen acts according to the Ideal Gas Law, PV=nRT, then any changes in any of these parameters will cause corresponding changes in print head back pressure. Another cause is the delay between the time the print head starts to eject ink during on-demand printing and the time the pressure regulator actuates to restore the back pressure.
These complications as well as the use of pressurized ink delivery have all resulted in a need for more accurate back pressure regulation at inkjet print heads and for more precise compensation techniques.


A cowling assembly for a vehicle comprises a general external surface having secured to or adjacent thereto, an elongate lightning diverter element which, at least when subjected to a high electric field, is electrically conductive, wherein a portion of the diverter element is arranged to project from the general external surface.

This invention relates to a cowling assembly for a vehicle and more particularly to a forward cowling, such as a nose cap assembly or a radome for an aircraft.
Operational equipment such as radar and the like sensory equipment, is commonly forwardly mounted on an aircraft e.g. in the nose of the aircraft.
The equipment is protected from the environment by a nose cap assembly which on most aircraft is constructed predominantly of a material which is transparent to electromagnetic radiation at the operational frequencies of the equipment, such material typically comprising a fibre reinforced, honeycomb construction.
Such materials however do not provide protection against lightning which can puncture the nose-cap and attach on to the equipment, thus causing severe damage.


A tire is provided, on a surface thereof, an applicaiton having a top layer exposed to the air and a bottom layer in contact with the tire. The top layer can be a rigid element and/or a marking covering, or a device for measuring or monitoring the tire. The bottom layer is a foam having a void ratio of at least 40%, a thickness of at least 0.5 mm, and a density ranging from 0.02 g/cm3 to 0.5 g/cm3.

The invention concerns the application of coverings and/or elements to the surface of rubber articles, in particular tires. More particularly, it concerns the application of these elements and/or coverings after the vulcanization of such articles. The invention concerns in particular the marking, colored or not, of part of the surface of the tire by applying a rigid or non-rigid element and/or a covering.
The tires can carry, for decorative or identification purposes, a marking, colored or not, directly applied to part of the generally external surface of the tire. "Marking" means, in the text, any element or covering affixed to the said surface of the tire, generally after its vulcanization. This marking can consist of a so-called rigid element, a soft element, a layer of lacquer, a coat of paint, etc.
"Rigid element" means elements incapable of following the successive deformations of a tire when it is running. These so-called rigid elements can according to circumstances be completely non-deformable or flexible but non-elastic to the scale of the deformations of the tire. In other words, they can, where necessary, bend but be incapable of following the local variations in the area of the surface of the tire following changes in radius of curvature of the said tire. These elements can consist of metal, plastic, elastomer, ceramic, etc.
The marking of a tire, produced in an appropriate material, can be in one or more colors, including white. However, producing markings, colored or not, on tires poses great difficulties.
Such markings are intended to cover at least part of the surface of tires. Since it is a case of a surface covering, these markings are particularly intended to cover surfaces of tire covers said to be "non-wearing", that is to say which are not in contact with the road under normal conditions of use of the said tires. Thus such colored markings, having decorative and identification purposes in particular, can constitute at least partially the external surface of a tire cover sidewall or groove bottoms of the tread.
The complexity of directly covering the surface of tires with such markings is well known to persons skilled in the art. There exist in fact two major difficulties in this implementation, firstly the nature of the compositions in the tire which acts on the markings, as will be seen more explicitly below, and secondly the stresses to which the tire is subjected when it is running which cause significant deformations of the tire and therefore of its surface, to which the markings must be able to adapt.
The vulcanized compositions of diene rubbers, both natural and synthetic, because of the presence of double bonds on their molecular chains, are liable to deteriorate more or less rapidly after prolonged exposure to the atmosphere, because of known mechanisms of oxidation and ozonolysis. These degradation mechanisms are also accelerated under the combined action of heat by thermo-oxidation, or that of light by photo-oxidation (see for example: "Photo-oxydation and stabilisation of polymers", Trends in Polym. Sci., Vol. 4, No 3, 1996, 92-98; "Degradation mechanisms of rubbers", Int. Polym. Sci. and Technol., Vol 22, No 12, 1995, 47-57).
It has been possible to inhibit all these phenomena of degradation of the tire, linked to its aging, little by little by virtue of the development and introduction into diene rubber compositions intended for the manufacture of tires of various antidegrading agents such as antioxidants or antiozonants. Compounds have even been found which are able to fulfil these two functions simultaneously; the most effective, both as antioxidants or antiozonants, are in a known manner derivatives of quinoline, such as for example 2,2,4-trimethyl-1,2-dihydroquinoline ("TMQ") or derivatives of p-phenylenediamine ("PPD") even more active than the first, such as for example N-1,3-dimethylbutyl-N′-phenyl-p-phenylenediamine ("6-PPD") or N-isopropyl-N′-phenyl-p-phenylenediamine ("I-PPD"). These antidegradants of the TMQ and PPD type, sometimes even combined, are today very widespread and used in an almost routine manner in conventional diene rubber compositions filled at least partly with carbon black, giving them their characteristic black color.
However, the agents cited above, in particular TMQ or PPD derivatives, are not stable under light and, under the effect of UV radiation, generated colored chemical substances which cause an impairment of the color of the rubber compositions containing them, staining them dark brown.
In addition, antidegradants are mobile on the molecular scale within the rubber composition containing them. This mobility extends to the compositions adjacent to that initially containing the antidegradants. Thus these antidegradants are liable to migrate into a colored marking composition fixed to the rubber composition containing them, and to stain it.
Moreover, in order to limit the degradation due to ozone, elastomer compositions also normally incorporate waxes which, statically, afford additional protection with respect to antiozonants by the formation of a protective surface coating. However, the waxes, which are also characterised by their ability to migrate as far as the surface of the rubber articles, modify the external appearance of the surfaces of the elastomer compositions by staining them or making them dull and grey. This phenomenon is referred to as the "blooming" of the waxes.
This is why it is extremely complex to produce a marking of durable appearance, colored or not, intended to cover part of the external surface of tire covers resisting staining and alteration due to the antioxidants, antiozonants and waxes present in the elastomer compositions used in tires.
The majority of solutions propose the development of color markings whose composition combines both the various constituents for obtaining color and non-migration of the waxes or staining products. However, it is also necessary, as stated, for the marking to be capable of enduring the mechanical stresses to which the tire is subjected.
However, the solutions to these two problems which are accessible at the present time are often opposing and are therefore not satisfactory for improving the compromise between durable appearance and resistance to mechanical stresses. This is because:                when the covering is sufficiently flexible to accommodate repeated deformations throughout the life of the tire, the molecular mobilities are too great therein for completely preventing the migrations of these staining products;        when the coating is rigid, thus restricting the molecular mobility, it is no longer capable of following the deformations of a tire without causing excessively great concentrations of stresses which, according to circumstances, will result in a detachment or breakage of the covering.
It therefore proves necessary, in order to obtain durable marking, to be able at least to reduce or even eliminate the impairment of the color and/or the brightness of the marking affixed to the external surface of a tire, whilst conferring on it an ability to accommodate deformations of the tire.

Tire having an element or covering attached to a surface thereof


A non-aqueous electrolyte secondary battery capable of withstanding a reflow temperature has a positive electrode having a conductive material, a binder, and an electrode active material selected from the group consisting of LiCoO2, LiNiO2 and LiMn2O4. A negative electrode has a conductive material, a binder and an electrode active material selected from the group consisting of a titanium oxide having an anatase structure, lithium titanate having a spinel structure and a molybdenum oxide. An electrolyte has a supporting salt and a non-aqueous solvent having a boiling point greater than 200xc2x0 C. A gasket is comprised of a material having a heat deformation temperature greater than 230xc2x0 C. A separator is disposed between the positive electrode and the negative electrode and is comprised of a material having a heat deformation temperature greater than 230xc2x0 C. At least one of the positive electrode and the negative electrode comprises an electrode heat-treated to a temperature of 250xc2x0 C. to 450xc2x0 C. for deactivating a thermally active portion of each of the conductive material, the binder and the electrode active material thereof.

1. Field of the Invention
This invention relates to a coin type (button type) non-aqueous electrolyte secondary battery using a material capable of storing and emitting lithium as an active material for both negative and positive electrodes, and a lithium ion-conductive non-aqueous electrolyte.
2. Background of the Invention
The coil type (button type) non-aqueous electrolyte secondary battery according to the prior art has the features that it has a high energy density and is light in weight. Because of such features, the application of the coin type non-aqueous electrolyte secondary battery to a back-up power source for appliances has been increasing.
Almost all the conventional coil type (button type) non-aqueous electrolyte secondary batteries have to add lithium in any form to an active material of a negative electrode. In the case of a battery using a lithium-aluminum alloy for the negative electrode and a 3 V-class lithium-containing manganese oxide for the positive electrode, for example, it has been necessary to press-bond lithium to aluminum of the negative electrode. In the case of a battery using carbon for the negative electrode and the 3 V-class lithium-containing manganese oxide for the positive electrode, it has been necessary to electrochemically introduce lithium to the negative electrode.
In the batteries of the kind described above, the material of a gasket for keeping air- and gas-tightness of the battery and insulation between the positive and negative electrodes is of utmost importance. Economical polypropylene has been used in the past as the material of the gasket because it is excellent in chemical resistance, flexibility and creep resistance, has high moldability and can be injection-molded.
When the battery is used mainly as the memory back-up power source, the battery is soldered in most cases to a printed substrate together with a memory device after terminals for soldering are welded to the battery. This soldering to the printed substrate has been conducted conventionally by using a soldering iron. However, as a greater number of electronic components are required to be mounted inside the same area of the printed substrate with scale-down or higher functions of appliances, it has become more and more difficult to secure the space into which the soldering iron is inserted. Automation of the soldering work itself has been required in order to reduce the cost of the soldering work.
Therefore, a method has been developed which applies in advance a solder cream, or the like, to soldered portions on the printed substrate, mounts the components onto such portions or supplies a small solder ball to each portion after the components are mounted, and passes the printed substrate assembly having the components mounted thereto through a furnace of a high temperature atmosphere set to 200 to 300xc2x0 C., for example, so that the soldered portions reach a temperature higher than the melting point of the solder so as to fuse the solder and to thereby execute soldering (hereinafter called xe2x80x9creflow solderingxe2x80x9d). The coin type (button type) non-aqueous electrolyte secondary battery having the conventional construction involves the drawback that the function of the battery is lost at the time of reflow soldering because the battery does not use the materials in consideration of the heat resistance.
Because almost all the conventional coin type (button type) non-aqueous electrolyte secondary batteries need to add lithium in any form to the active materials of the negative and positive electrodes during the production process as described above, the production method has to use the lithium metal which is difficult to handle.
When lithium is added in any form to the active materials of the negative and positive electrodes during the production process, the secondary battery lacks stability in reflow soldering.
In a coin type (button type) non-aqueous electrolyte secondary battery using a 3 V-class lithium-containing manganese oxide Li4Mn5O12 for the positive electrode and an lithium-aluminum alloy for the negative electrode, for example, the electrolyte and the lithium alloy react with each other during reflow soldering in almost all combinations of the electrolytes and heat-resistant battery members, and invite drastic swell and rupture.
In another coin type (button type) non-aqueous electrolyte secondary battery using the 3 V-class lithium-containing manganese oxide Li4Mn5O12 for the positive electrode and carbon, with which lithium is brought into contact or in to which lithium is doped electrochemically, for the negative electrode, too, the electrolyte and the negative plated doped with lithium react with reach other and invite drastic swell and rupture.
In the conventional coin type (button type) non-aqueous electrolyte secondary battery, all of the electrolyte, the separator and the gasket cannot withstand the reflow temperature. Therefore, boiling and fusion develop.
Even when the material is changed to a heat-resistant material for each of the electrodes and other members, a battery capable of coping with the reflow temperature cannot be fabricated. Though the problem of swell and rupture at the reflow temperature can be solved, another problem occurs that the battery characteristics get extremely deteriorated.
For, even though the material may seem stable, the combination of such materials is not so selected as to achieve the highest stability and performance.
In order to solve the problems described above, it is an object of the present invention to provide a battery capable of exhibiting satisfactory characteristics even after reflow soldering, by employing all of the following means for improvement.
(1) Heat-resistant Electrodes and Members are Selected.
The battery of the present invention uses a positive electrode active material formed of LiCoO2, LiNiO2 or LiMn2O4, each being an oxide containing mobile lithium. Anatase type titanium oxide (TiO2), lithium titanate having a spinel structure or a molybdenum oxide is used for the negative electrode.
LiCoO2, LiNiO2 and LiMnO4 as the oxide containing mobile lithium, anatase type titanium oxide and spinel type lithium titanate are difficult to invite a drastic reaction at the reflow temperature. Therefore, in order to obtain a battery that allows reflow soldering, heat-resistant materials are used for the electrolyte, the separator and the gasket as the constituent elements of the battery.
(2) Heat Stability of the Electrode Active Materials is Further Improved.
As a result of various studies conducted so as to improve stability of the electrode active materials, it has been found that the highest stability can be achieved at the reflow temperature by reducing the quantity of dust.
(3) Degradation of Battery Characteristics is Restricted by Heat-treatment of the Electrodes.
Electrodes comprising the electrode active material, a conduction adjuvant and an organic binder are heat-treated at 200 to 450xc2x0 C. Consequently, the active portions of the active material, organic binder and conduction adjuvant (dust, non-reacted portions during synthesis, etc.) are rendered inactive, and wettability between the electrolyte and the electrode is improved. Because the electrolyte having particularly high stability has a high viscosity and does not easily permeate into the electrode, the combined effect with the heat-treatment is great.
The optimum combination of these technical means gives the coin type (button type) non-aqueous electrolyte secondary battery capable of withstanding the reflow temperature.
(4) The Best Combination is Searched in the Selection of the Electrolyte and the Heat-resistant Members.

Non-aqueous electrolyte secondary battery having heat-resistant electrodes


A process for reacting, in the presence of a particular calcium containing catalyst, an amine having an active hydrogen and one or more of a fatty acid ester or a fatty acid.

1. Field of the Invention
The present invention is directed to novel methods of preparing fatty amides and their derivatives, such as betaines and their phosphorous-containing or sulfur-containing analogues. Among other things, the products are useful as surface active agents.
2. Description of Related Art
Fatty amide production generally involves the reaction of a fatty acid source, such as a triglyceride, with an amine. Similarly, fatty amidoamine production generally involves the reaction of N,N-dimethylaminopropylamine ("DMAPA") with a triglyceride, such as coconut oil, using an alkaline catalyst such as sodium methylate at elevated temperatures. This results in a viscous, highly colored blend of the corresponding amidoamine and glycerol. The present invention is directed to a method for synthesizing such fatty amidoamines (and products formed from such amidoamines) and other amides using a calcium-containing catalyst which results in a more desirable overall product composition.


A device, system, and processor-readable medium for untreated grey water treatment and reuse are disclosed. Untreated grey water entering a building's plumbing system is tested for recyclability before it routes for treatment and reuse or disposal through a building's sewer line. Certain sensors decide how to route the untreated grey water through treatment in the device. Treatments to untreated grey water could include multi-level filtration and heating/cooling cycles for a prescribed time period to produce treated grey water meeting EPA-approved standards. Once treated, the treated grey water is routed to treated grey water tanks where it is stored for later use in a building's toilets and landscaping.

Efficient usage of water resources is essential for conservation of scarce natural resources and reducing financial strain on families and businesses. Water is typically used for showers and baths, faucets, washing machines, toilets, landscaping, and other uses. The average household in the United States utilizes between 700 and 10,000 gallons of water per month depending on the number of people per household and the types of water usage (i.e. landscaping). A large proportion of potentially recyclable and reusable water generated by households and businesses is lost to waste. That portion which is recycled is known as grey water. Currently, recycled grey water is often unpurified and unfiltered for reuse. Untreated grey water poses a health hazard for the people and businesses.
The waste of potentially recyclable grey water also places a financial burden upon households and businesses. Households and buildings that do not efficiently recycle and reuse water incur hundreds of dollars of additional costs per year due to water waste. The average household water bill in the United States ranges from $25 to over $100 per month. Additionally, water waste places strain on scarce water resources. The recent experience of the 2011-2017 California Drought highlights the necessity of efficient reuse of water by businesses and households. The unprecedented drought prompted a number of water usage restrictions in order to conserve limited resources, including a mandatory 25% reduction in water usage by all California residents and businesses in 2015.
Accordingly, the method, system, apparatus, and software program described herein is intended to solve such problems so that grey water is recycled, purified, and safely reused in a building's plumbing instead of being lost to waste.

This patent is subject to a terminal disclaimer.


A kinetic response system comprising an impact member to receive an impact force thereto, one or more annular guides positioned proximate the impact member, one or more projectile masses to respectively travel along the one or more annular guides, a kinetic energy converter to accelerate the one or more projectile masses along the one or more annular guides, and a controller to selectively trigger the kinetic energy converter to accelerate the one or more projectile masses along the one or more annular guides. The one or more projectile masses being accelerated in response to the impact force contributing to acceleration of the impact member above a defined threshold. The accelerated projectile masses create a rotational force to cause a kinetic push against the impact member in opposition to the impact force.

Safety systems are known in the prior art. Such safety systems typically include helmets, face shields, steel toed boots, and equivalents. In the prior art, the safety systems are entirely passive, and each safety system absorbs whatever forces and energies that would otherwise injure the user who wears the safety system.
The prior art for non-passive safety systems is limited. There is a U.S. Pat. No. 6,014,769, filed by Baudou et al. and issued on Jan. 18, 2000, that has a limited means to use stored energy which involves reducing the inertial effect of attached mass to a helmet. The disclosed invention is designed to use stored energy to separate a heavy item attached to a helmet during a deceleration event in order to mitigate the inertial effect on the head. The separation energy is not designed to do more than simply isolate the helmet from an attached mass. There is no disclosure to add energy more than is required to separate the masses.
There is a U.S. Pat. No. 5,524,374, filed by Gernstein et al. and issued on Jun. 11, 1996, that discloses the use of stored energy to "deliver impact energy to the shotgun in a direction opposite to that of the recoil energy and at a time that is selected to most effectively neutralize that recoil energy." The patent discloses creating a force in line with that created by the accelerating bullet that is able to effectively neutralize the kickback. No part of this patent discloses creating forces other than in line with barrel.


The present invention is an array substrate for use in a liquid crystal display device, which includes a first double-layered metal structure and a second double-layered metal structure. The first double-layered metal structure includes a gate electrode, a gate line and a gate pad electrode on a substrate, wherein all of the gate electrode, the gate line and the gate pad electrode have a first barrier metal layer and a first copper layer. The second double-layered metal structure includes a data line, source and drain electrodes, a capacitor electrode, and a data pad electrode, wherein all of the data line, the source and drain electrodes, the capacitor electrode and the data pad electrode have a second barrier metal layer and a second copper layer.

1. Field of the Invention
The present invention relates to a liquid crystal display (LCD) device, and more particularly, to an array substrate having gate and data lines with a double-layered structure.
2. Discussion of the Related Art
In general, since flat panel display devices are thin, low weight, and have low power consumption, they are increasingly being used for displays for portable devices. Among the various types of flat panel display devices, liquid crystal display (LCD) devices are widely used for laptop computers and desktop monitors because of their superiority in resolution, color image display, and display quality.
LCD devices use the optical anisotropy and polarization properties of liquid crystal molecules to produce a desired image. Liquid crystal molecules have a definite intermolecular orientation that results from their peculiar characteristics. The specific orientation can be modified by an electric field that is applied across the liquid crystal molecules. In other words, electric fields applied across the liquid crystal molecules can change the orientation of the liquid crystal molecules. Due to optical anisotropy, incident light is refracted according to the orientation of the liquid crystal molecules.
Specifically, the LCD devices have upper and lower substrates with electrodes that are spaced apart and face each other, and a liquid crystal material is interposed therebetween. Accordingly, when a voltage is applied to the liquid crystal material by the electrodes of each substrate, an alignment direction of the liquid crystal molecules is changed in accordance with the applied voltage to display images. By controlling the applied voltage, the LCD device provides various transmittances for rays of light to display image data.
The liquid crystal display (LCD) devices have wide application in office automation (OA) and video equipment because of their light weight, thin design, and low power consumption characteristics. Among the different types of LCD devices, active matrix LCDs (AM-LCDs), which have thin film transistors and pixel electrodes arranged in a matrix form, offer high resolution and superiority in displaying moving images. A typical LCD panel has an upper substrate, a lower substrate and a liquid crystal material layer interposed therebetween. The upper substrate, commonly referred to as a color filter substrate, includes a common electrode and color filters. The lower substrate, commonly referred to as an array substrate, includes switching elements, such as thin film transistors (TFT's), and pixel electrodes, for example.
As previously described, operation of an LCD device is based on the principle that the alignment direction of the liquid crystal molecules is dependent upon an applied electric field between the common electrode and the pixel electrode. Accordingly, the liquid crystal molecules function as an optical modulation element having variable optical characteristics that depend upon polarity of the applied voltage.
As shown in FIG. 1, gate lines 33 are disposed in a transverse direction and data lines 53 are disposed in a longitudinal direction. The data lines 53 perpendicularly cross the gate lines 33 such that the crossing of the gate and data lines 33 and 53 defines a matrix of pixel regions P. A switching device such as a thin film transistor T is disposed in each pixel region P near a crossing of the gate and data lines 33 and 53. A gate pad electrode 35 is formed at the end of each gate line 33. This gate pad electrode 35 has a wider width than the gate line 33. A data pad electrode 55 is formed at the end of each data line 53, and similarly has a wider width than the data line 53. On each gate pad electrode 35, a gate pad terminal 71 is formed of a transparent, electrically conductive material. A data pad terminal 73 of transparent conductive material is likewise formed on each data pad electrode 55. The gate and data pad terminals 71 and 73 receive electrical signals by way of the external driving circuits.
In each pixel region P, a pixel electrode 69 is disposed so as to come into contact with the thin film transistor T. A storage capacitor C is also formed in a portion of each pixel region P. In each pixel region P in this example, the storage capacitor C is formed over the gate line 33 and is connected in parallel with the pixel electrode 69.
Each thin film transistor T includes a gate electrode 31 extending from the gate line 33, an active layer 39 formed of silicon, a source electrode 49 extending from the data line 53, and a drain electrode 51 contacting the pixel electrode 69. Meanwhile, the storage capacitor C includes a portion of the gate line 33 as a first electrode, a capacitor electrode 57 as a second electrode, and an insulator (not shown) disposed therebetween. The capacitor electrode 57 is formed of the same material as the source and drain electrodes 49 and 51 and communicates with the pixel electrode 69 through a storage contact hole 63.
In the related art shown in FIG. 1, the gate electrode 31 and the gate line 33 are generally formed of aluminum or aluminum alloy in order to prevent signal delay. Alternatively, the gate electrode 31 and the gate line 33 can be formed of a double-layer of an aluminum layer that can be formed of an aluminum alloy layer and an additional metal layer because the aluminum and aluminum alloy are weak at acid during the process. Furthermore, all of the source electrode 49, the drain electrode 51, the data line 53 and the data pad electrode 55 can also be formed of aluminum or aluminum alloy. At this time, an additional metal layer is also formed on the aluminum or aluminum alloy layer.
Now with reference to FIGS. 2A-2J and FIGS. 3A-3J, fabrication process steps of forming an array substrate will be explained in detail according to a related art. FIGS. 2A to 2J are cross sectional views taken along a line II-II′ of FIG. 1 and illustrates a process of forming a pixel according to the related art. FIGS. 3A to 3J are cross sectional views taken along a line III-III′ of FIG. 1 and illustrates a process of forming pads according to the related art. In the process shown in FIGS. 2A-2J and FIGS. 3A-3J, the gate line, the gate electrode and the gate pad electrode have a double-layered structure including aluminum. The aluminum in the gate line reduces the RC delay because it has a low resistance. However, aluminum is delicate to acidity and susceptible to developing hillocks during a high temperature manufacturing or patterning process, possibly resulting in line defects. For this reason, molybdenum or chromium is formed on the aluminum or aluminum alloy, thereby forming the double-layered structure as follows.
Referring to FIGS. 2A and 3A, aluminum (Al) or aluminum neodymium (AlNd) is deposited on a substrate 21, thereby forming a first metal layer 23a. Then, molybdenum is deposited on the first metal layer 23a, and thus a second metal layer 23b is formed. Thereafter, a photoresist layer 25 is formed on the second metal layer 23b of molybdenum. After forming the photoresist layer 25, a mask M having light-transmitting portions A and light-shielding portions B is disposed over the photoresist 25, and then a light exposure is performed to the photoresist 25. Thereafter, the photoresist 25 is developed to form a photoresist pattern on the double layer of first and second metal layers 23a and 23b.
In FIGS. 2B and 3B, after developing the photoresist 25, photoresist patterns 27 remain and the second metal layer 23b is exposed. Thereafter, the substrate 21 having the photoresist patterns 27 is baked in an oven to form the semicircular shape as shown in FIGS. 2B and 3B.
Now referring to FIGS. 2C and 3C, the exposed portions of the second metal layer 23b and the underlay first metal layer 23a are etched under a wet etching process. Therefore, first and second metal patterns 29a and 29b are formed underneath the photoresist patterns 27. During the wet etching process, since the first metal layer 23a of aluminum or aluminum alloy is etched faster than the second metal layer 23b of molybdenum by the etching solution, the second metal patterns 29b overhang on the first metal patterns 29a, as shown in FIGS. 2C and 3C. This overhang phenomenon of the second metal patterns 29b causes the later-formed insulator to have deposition defects. Namely, if the insulator (not shown) is formed in a later step to cover the first and second metal patterns 29a and 29b of FIGS. 2C and 3C, the insulator may have defects caused by the overhanging brims of the second metal patterns 29b.
To overcome this problem, an additional dry etch of the first and second metal patterns 29a and 29b is required. FIGS. 2D and 3D show the photoresist patterns 27, the first metal patterns 29a and the second metal patterns 29b after the dry etching process. The dry etch slightly removes and laminates the side portions of the photoresist patterns 27 and the side portions of the first and second metal patterns 29a and 29b. Therefore, the first and second patterns 29a and 29b have a smooth taper shape without any steps or overhangs on their sides.
After the dry etch process, the photoresist patterns 27 are stripped away as shown in FIGS. 2E and 3E. Therefore, the gate electrode 31, the gate line 33 and the gate pad electrode 35 are formed to have a double-layered structure of aluminum or aluminum alloy and molybdenum. As described in FIG. 1, the gate electrode 31 extends from the gate line 33 and the gate pad electrode 35 is at the end of the gate line 33.
Now referring to FIGS. 2F and 3F, a gate insulation layer 37 is formed on the substrate 21 to cover the double-layered gate electrode 31, line 33 and pad electrode 35. The gate insulation layer 37 is an inorganic material, such as silicon nitride (SiNX) or silicon oxide (SiO2). Thereafter, amorphous silicon (a-Si:H) and n+ doped amorphous silicon (n+a-Si:H) are sequentially formed on the gate insulation layer 37 and then patterned to form an active layer 39 and an ohmic contact layer 41 over the gate electrode 31.
Next in FIGS. 2G and 3G, third to fifth metal layers 43, 45 and 47 are sequentially formed on the gate insulation layer 37 to cover both the active layer 37 and the ohmic contact layer 41. Here, the third and fifth metal layers 43 and 47 are molybdenum (Mo) and the fourth metal layer 45 interposed therebetween is aluminum (Al). Therefore, the triple-layered structure of Mo/Al/Mo is disposed on the gate insulation layer 37.
Thereafter, the third to fifth metal layers 43, 45 and 47 are simultaneously patterned as shown in FIGS. 2H and 3H. Thus, a source electrode 49, a drain electrode 51, a data line 53, a data pad electrode 55 and a capacitor electrode 57, all of which have the triple-layered structure, are formed over the substrate 21. The source electrode 49 extends from the data line 53 and contacts the ohmic contact layer 41. The drain electrode 51 is spaced apart from the source electrode 49 and also contacts the ohmic contact layer 41. As mentioned with reference to FIG. 1, the data pad electrode 55 is at the end of the data line 53, and the capacitor electrode 57 is shaped like an island and disposed above the double-layered gate line 33. After forming the source and drain electrodes 49 and 51, a portion of the ohmic contact layer 41 between the source and drain electrodes 49 and 51 is removed to form a channel region.
Meanwhile, the source and drain electrodes 49 and 51 and the data line 53 can be formed of a single layer of molybdenum or chromium. However, doing so may result in signal delay in those electrodes and ion the data line such that it is hard to obtain uniform image quality all over the liquid crystal panel.
In contrast, when the source and drain electrodes 49 and 51 and the data line 53 include metal having a low resistance, such as aluminum, the electrical signals flow without the signal delay such that the array substrate can be fabricated in a large size. Therefore, the source and drain electrodes 49 and 51 and the data lines 53 herein include the aluminum layer therein. Further, when aluminum is used for the source and drain electrodes 49 and 51, the molybdenum layers are formed on both upper and lower surfaces of the aluminum layer. The third metal of molybdenum formed underneath the aluminum layer acts to prevent a spiking phenomenon in which the aluminum layer penetrates into the active layer 39 or the ohmic contact layer 41. The fifth metal of molybdenum formed on the aluminum layer acts to reduce contact resistance between the aluminum layer and a later-formed transparent electrode. For these reasons, the source and drain electrodes 49 and 51 and the data line 53 are formed to have the triple-layered structure of Mo/Al/Mo.
Now in FIGS. 2I and 3I, a passivation layer 59, which is an insulation material, is formed all over the substrate 21. The passivation layer 59 covers the source and drain electrodes 49 and 51, the data line 53, the data pad electrode 55 and the storage capacitor 57. By patterning the passivation layer 59, a drain contact hole 61, a storage contact hole 63, a gate pad contact hole 65, and a data pad contact hole 67 are formed. The drain contact hole 61 exposes a portion of the drain electrode, the storage contact hole 63 exposes a portion of the capacitor electrode 57, the gate pad contact hole 65 exposes a portion of the gate pad 35, and the data pad contact hole 67 exposes a portion of the data pad 55.
In FIGS. 2J and 3J, a transparent conductive material is deposited on the passivation layer 59 having the above-mentioned holes, and then this transparent conductive material is patterned to form a pixel electrode 69, a gate pad terminal 71 and a data pad terminal 73. The transparent conductive material is one of indium tin oxide (ITO) and indium zinc oxide (IZO). The pixel electrode 69 contacts the drain electrode 51 and the capacitor electrode 57 through the drain contact hole 61 and storage contact hole 63, respectively. Further, the gate pad terminal 71 contacts the gate pad 35 through the gate pad contact hole 65, and the data pad terminal 73 contacts the data pad 55 through the data pad contact hole 67. Accordingly, the array substrate of the related art is complete.
The above-mentioned process includes five mask processes. Further, the gate electrode 31 and the gate line 33 need to undergo the double-etching process (the wet etching process and the dry etching process). Therefore, the method of forming the array substrate according to the related art requires a lot of process time.
In the related art shown in FIGS. 2A-2J and 3A-3J, the source and drain electrodes 49 and 51, the data line 53 and the data pad electrode 55, all of which have the triple-layered structure, are formed by an etching solution that simultaneously etches aluminum and molybdenum. Thus, an electrochemical reaction, such as a Galvanic Reaction, will be caused by the etching solution during this etching process. As the molybdenum layer becomes thicker, it is much difficult to overcome the electrochemical reaction. During the etching process of patterning the third to fifth metal layers, the molybdenum layers disposed on the upper and lower surfaces of the aluminum layer are overetched. Especially, when the third molybdenum layer underlying the fourth aluminum layer is overly etched, the fourth aluminum layer collapses and contacts the active layer in the thin film transistor. The connection between the aluminum layer and the active layer will increase the leakage current and deteriorate the operating characteristics of the thin film transistor.
FIG. 4 is an enlarged cross-sectional view of a portion D of FIG. 2J and illustrates an overetching in the third and fifth metal layers of the drain electrode. As shown, the molybdenum layers 43 and 47 are overetched rather than the aluminum layer 45. This phenomenon of overetching also occurs in the source electrode 51, the data line 53 and the data pad electrode 55. The overetching of the molybdenum layers 43 and 47 causes the passivation layer 59 to not be formed properly over the substrate 21. Furthermore, the overetching of the molybdenum layer 43 causes the aluminum layer 45 to contact the active layer 39 and/or the ohmic contact layer 41 because the aluminum layer 45 is pressed by the passivation layer 59, thereby increasing the leakage current in the thin film transistor. The increase of the OFF current deteriorates the electrical characteristics of the thin film transistor.

Array substrate for LCD device having dual metal-layer gate and data lines and manufacturing method thereof