A semiconductor wafer having dice that include circuitry that is placed into a mode when the circuitry receives an alternating signal having certain characteristics. The alternating signal may be supplied from a system controller through a probe, probe pad, and conductive path on the wafer. In a preferred embodiment, the conductive path simultaneously carries a VCC power signal and the alternating signal to the circuitry. However, the alternating signal may be carried on a conductive path different from the one carrying the VCC signal. A great deal of information may be conveyed through the alternating signal, making other signals unnecessary in controlling, testing, stressing, and repairing dice on the wafer. For example, clocking information may be conveyed through the alternating signal. The circuitry may be placed in different modes in response to different characteristics of the alternating signal. The alternating signal and a VCC power signal are received through a single contact on each die. A wafer mode controlling system includes a system controller to control application of the alternating signals and other signals to the dice on the wafer. The semiconductor wafer mode controlling system may also control a probe positioning controller including an array of probes that selectively brings the probes into contact with the probe pads, whereby the alternating signal having the certain characteristics is transmitted from the probe to the circuitry through the probe pad and conductive path and the circuitry of each of the dice is placed into the mode.

1. Field of the Invention
The invention relates to a semiconductor wafer mode controlling assembly and, more particularly, to such an assembly in which modes of circuitry of dice (IC's) on the wafer are controlled through alternating signals applied to the dice through probe pads on the wafers. The invention also includes methods for constructing and operating such wafers and the assembly.
2. State of the Art
Typically, finished integrated circuit chip assemblies include a die or dice attached to a lead frame and encapsuled with an encapsulant. Numerous expensive and time consuming steps are involved in producing such chip assemblies. These steps may include the following: (1) forming dice on a wafer substrate, (2) testing the dice, (3) cutting dice from the wafer, (4) connecting a die or dice to a lead-frame, (5) encapsulating the die or dice, lead frame, connecting wires, and any auxiliary circuitry, (6) performing burn-in and providing other stresses to the dice, and (7) testing the assembly.
Defects in a finished chip assembly can prevent it from operating as intended. In spite of painstaking attention to detail, defects may be introduced at various levels of production. For example, manufacturing defects in the die may cause a failure. It has been found, however, that some defects are manifest immediately, while other defects are manifest only after the die has been operated for some period of time.
Reliability curves are used to express a hazard rate or instantaneous failure rate h(t) over time t, and often have a "bath tub" shape. The reliability curves for many, if not all, IC's are generally like that shown in FIG. 1. The reliability curve in FIG. 1 may be divided into three regions: (1) an infant mortality region, (2) a random failures region, and (3) a wearout region.
The infant mortality region begins at time t.sub.0, which occurs upon completion of the manufacturing process and initial electrical test. Some IC's, of course, fail the initial electrical test. Inherent manufacturing defects are generally expected in a small percentage of IC's, even though the IC's are functional at time t.sub.0. Because of these inherent manufacturing defects (that may be caused by contamination and/or process variability), these IC's have shorter lifetimes than the remaining population. Typically known as IC's suffering "infant mortalities," while the IC's may constitute a small fraction of the total population, they are the largest contributor to early-life failure rates.
Once IC's subject to infant mortality failure rates have been removed from the IC population, the remaining IC's have a very low and stable field failure rate. The relatively flat, bottom portion of the bathtub curve, referred to as the random failure region, represents stable field-failure rates which occur after the IC failures due to infant mortalities have been removed and before IC wearout occurs.
Eventually, as wearout occurs, the failure rate of the IC's begins to increase rapidly. However, the average lifetime of an IC is not clearly understood, because most lab tests simulate only a few years of normal IC operation.
"Burn-in" refers to the process of accelerating failures that occur during the infant mortality phase of component life in order to remove the inherently weaker IC's. The process has been regarded as critical for product reliability since the semiconductor industry began. There have been two basic types of burn-in. During the process known as "static" burn-in, temperatures are increased (or sometimes decreased) while only some of the pins on a test IC are biased. No data is written to the IC, nor is the IC exercised under stress during static burn-in. During "un-monitored dynamic" burn-in, temperatures are increased while the pins on the test IC are biased. The IC is cycled under stress, and data patterns are written to the IC but not read. Hence, there is no way of knowing whether the data written is retained by the cell.
In recent years, as memory systems have grown in complexity, the need for more and more reliable components has escalated. This need has been met in two ways. First, manufacturing process technology has reached a level of maturity and stability where inherent manufacturing defects, caused by contamination and process variation, have been reduced. As a result, latent failures have been significantly reduced, resulting in lower field failure rates. Secondly, more sophisticated methods of screening infant mortalities have been developed. As IC manufacturing practices have become more consistent, it has become clear that burn-in systems that simply provide stress stimuli in the form of high temperature and VCC (power) to the IC under test may be inadequate in two areas: (1) such burn-in systems cannot detect and screen infant mortality failure rates measured in small fractions of a percent; (2) such burn-in systems are unable to confirm random failure rates that are claimed to be significantly lower than 100 FITs (ie., fewer than 100 failures per billion IC hours) at normal system operating conditions.
To address these issues, an "intelligent" burn-in approach can be utilized. The term intelligent burn-in, as used in this discussion, refers to the ability to combine functional, programmable testing with the traditional burn-in cycling of the IC under test in the same chamber. Advantages to this approach include:
(1) The ability to identify when a failure occurs and, thereby, compute infant mortality rates as a function of burn-in time. As a result, an optimal burn-in time for each product family can be established.
(2) The ability to correlate bum-in failure rates with life test data typically obtained by IC manufacturers to determine the field failure rates of their products.
(3) The ability to incorporate into the burn-in process certain tests traditionally performed using automatic test equipment (ATE) systems, thereby reducing costs.
Some IC's have internal test modes not accessible during normal operation. These test modes may be invoked on ATE by applying a high voltage to a single pin. The IC is then addressed in a manner so as to specify the operating mode of interest. Operating modes such as data compression, grounded substrate, and cell plate biasing can be enabled, thus allowing evaluation of IC sensitivities and help in isolating possible failure mechanisms.
The electrical characterization data gathered from these tests is used to identify which part of the circuit appears to be malfunctioning, the possible location(s) on the IC, and the probable type or nature of the defect. To facilitate discussion and reporting, failures are often classified according to their electrical characteristics, referred to as the failure mode. Typical classification of these modes includes the following: single cell defect, adjacent cell defect, row failure, column failure, address failure, open pin, supply leakage, pin leakage, standby current leakage, and entire array failure (all dead cells).
In anticipation that some IC's will have defects, many IC's are designed with redundancies. In such IC's, a defective section of the IC may be shut off and a redundant but properly operating section activated and used in place of the defective section. For example, typical integrated memory circuits include arrays of memory cells arranged in rows and columns. In many such integrated memory arrays, several redundant rows and columns are provided to be used as substitutes for defective rows or columns of memory. When a defective row or column is identified, rather than treating the entire array as defective, a redundant row or column is substituted for the defective row or column. This substitution is performed by assigning the address of the defective row or column to the redundant row or column such that, when an address signal corresponding to the defective row or column is received, the redundant row or column is addressed instead.
To make substitution of the redundant row or column substantially transparent to a system employing the memory circuit, the memory circuit may include an address detection circuit. The address detection circuit monitors the row and column addresses and, when the address of a defective row or column is received, enables the redundant row or column instead.
One type of address detection circuit is a fuse-bank address detection circuit. Fuse-bank address detection circuits employ a bank of sense lines where each sense line corresponds to a bit of an address. The sense lines are programmed by blowing fuses in the sense lines in a pattern corresponding to the address of the defective row or column. Addresses are then detected by first applying a test voltage across the bank of sense lines. Then, bits of the address are applied to the sense lines. If the pattern of blown fuses corresponds exactly to the pattern of address bits, the sense lines all block current and the voltage across the bank remains high. Otherwise, at least one sense line conducts and the voltage falls. A high voltage thus indicates the programmed address has been detected. A low voltage indicates a different address has been applied.
Antifuses have been used in place of conventional fuses. Antifuses are capacitive-type structures that, in their unblown states, form open circuits. Antifuses may be "blown" by applying a high voltage across the antifuse. The high voltage causes the capacitive-type structure to break down, forming a conductive path through the antifuse. Various flash devices may be used.
Typically, IC's have numerous contacts that provide interfaces between the circuits within the die and the outside world. The contacts are used for bond pads to which bond wires are connected. The bond wires are also connected to the lead frame. The contacts (bond pads) may be used for various signals including those for addressing, data (DQ), VCC (power), VSS (ground), and control. However, physically, the contacts are extremely small or tiny. As such, it is impractical and expensive to provide direct connections between each of the contacts and probes used in, for example, testing, stressing, or repairing of the IC. Probe pads that are much larger than die contacts have been placed on, for example, the edge of the wafer. However, the sheer volume of contacts limits the number of contacts to which probe pads may be practically connected.
If there is a defect in an IC, it is desirable to discover the defect as early as possible in the manufacturing process for a finished chip assembly. In that case, if it is determined that the defect cannot be repaired, the time and expense of completing a chip assembly will not be expended. Further, some repairs may be less expensive to repair at an earlier stage of production of the chip assembly.
Accordingly, it would be desirable to test, stress, and, if necessary, attempt to repair IC's while they are still on a wafer, rather than in a packaged chip assembly.
U.S. Pat. No. 5,504,369 to Dasse et al. describes an apparatus for performing wafer level testing of integrated circuit dice. Burn-in is described as being performed while the dice are still connected to the wafer. Conductors are connected between wafer contact pads and contacts bonding pads) on dice. In a preferred embodiment, the conductors supply six voltage signals: power supply high voltage level signal, data signal, reset signal, clock signal, power supply memory programming voltage level signal, and ground voltage level signal. For the following reasons, connecting six conductors to each die has a considerable effect in terms of wafer real estate and/or processing steps. There are a large number of dice on the wafer. Current requirements dictate using numerous wafer contact pads and conductors to supply signals to the dice. Included extra conductors for redundancies increase the number by at least a factor of two. Further, the conductors are positioned on top of the dice and/or in the dicing lanes (streets or street area of the wafer). Placing all six conductors in the dicing lanes requires either stacking the conductors one on top of the other in a dicing lane, and/or widening the dicing lane (which may reduce the number of dice of the wafer). Placing several conductors over the dice requires additional processing steps. The processing steps may be further increased where conductors run both vertically and horizontally.
Accordingly, there is a need for an assembly in which a variety of signals may be supplied to dice in wafer form through a small number of contacts and conductive paths.


The present invention concerns a damping apparatus for the damping of vibrations in tool holders, machine elements and work pieces in machine tools and in other objects that are exposed to unwanted vibrations. The damping apparatus is adapted to be provided in or on the object and includes a substantially cylindrically shaped damping body with a boring going there through and a longitudinal central body that is rigidly connectable to the object that is to be damped. The damping body is connected to the longitudinal central body through elastic elements. The connection is made such that the elastic elements are substantially exposed to shear forces during damping.

1. Field of the Invention
The present invention concerns a damping apparatus that particularly but not exclusively is designed for boring bars and similar tool holding bars used in machine tools. Typical examples are boring bars used for chip cutting machining (turning, milling, etc.) on weak constructions, such as shafts and similar elements. The apparatus may also be used on "clampings", other parts of a machine, and works pieces. Self generating oscillations are typically a result of the dynamic rigidity of a construction being too small.
2. Description of the Related Art
Similar damping apparatuses are previously known, and a related apparatus is shown in NO patent 128 725. This patent concerns a damping device that necessarily must be placed in a boring in the boring bar, because the boring itself constitutes an important part of the damping device, in that the damping effect is a result of an interaction between the damping body and the boring itself, through resilient elements provided between the damping body and the boring.
The development evolves towards an increased ration between length/diameter (overhang) on tool holders. This results in a reduction of the dynamic rigidity of the tool holder and this again impose new requirements to the damping device that must be adapted accordingly. The problem with the damping device according to the known art is that to adapt the damping device to these new conditions, the frequency of the damping body must be lowered. To achieve this, either resilient elements with a lower spring constant, or a damping body with a larger mass is required.
The density of the damping bodies used to day is already among the highest commercially available. To increase the mass, the volume of the damping body must therefore be increased. This will result in problems related to space and size and weakening of the construction where the damping apparatus is to be placed.
To be able to reduce the spring constant with solutions according to the known art, as for instance described in NO patent 172 677, must accordingly either the material in the resilient element be changed to a softer material with a lower spring constant, or the strength of the resilient element must be reduced by reducing the size of the element. At the same time, the resilient elements must resist heat that is developed during the chip cutting process, and as a result of energy absorption in the material, in addition to being dimensioned to withstand forces they are exposed to. This has proved to be contradicting properties.
The conclusion is that the solutions according to the known art therefore not is well suited in the development towards an increased length/diameter ratio and a lower natural frequency for a system that is to be damped, due to limitations in material properties amongst other things.
High rotational speeds are often used, and it is therefore also important that a damping system can withstand fast rotation. This has also proved problematic with apparatuses according to the known art.

Damping apparatus for the damping of vibrations


A shock resistant device. A printed circuit board comprising electronics and a frequency reference is rigidly mounted to a central support member. The electronics can be mounted to both surfaces of the printed circuit board. The central support member is mounted to an enclosure via wire rope isolators. The central support member is designed to maximize rigidity at minimum mass. The central support member can comprise a thin wall metal mesh or honeycomb. At least a portion of the central support member directly contacts the printed circuit board beneath the frequency reference.

Use of the global positioning system (GPS) has enabled the earth moving industry to be far more precise in constructing, for example, roads, building foundations and open mines. Global positioning system receivers, e.g., electronics capable of receiving and processing global positioning system radio signals to determine a position on the Earth, are frequently placed on earth moving equipment, for example, bull dozers, graders, plows, excavators and the like. Global positioning system receivers commonly record positions for such earth moving equipment. It is becoming more common for global positioning system receivers to guide earth moving equipment to predetermined positions. The Site Vision Automatic Grade Control System, commercially available from Trimble Navigation Limited of Sunnyvale, Calif. is an example of such systems.
A GPS system generally determines the position of the receiving antenna. As the blade of earth moving equipment is responsible for moving dirt and rocks, it is desirable to locate the antenna on the blade. Conventional GPS systems for bladed earth moving equipment generally comprise an antenna mounted on a mast, e.g., 1.5 meters in length, mounted to and rising above the earth moving blade. The mast enables improved reception of the GPS radio signals, as well as moving the antenna equipment out of the way of most debris thrown off by the earth moving operations.
The GPS receiver electronics for such systems are conventionally placed elsewhere on the earth moving equipment, for example on an engine cover or in the cab area. More specifically, in the conventional art, the GPS receiver electronics cannot be mounted on the blade attached mast, due to the extreme shock and vibration conditions of such blades.
The blades of earth moving equipment comprise one of the most violent shock and vibration environments known to man. Such blades typically endure accelerations of 50 to over 900 times the acceleration of gravity in multiple axes virtually constantly. In addition, the blades are subject to constant vibration over a wide spectrum of frequencies. Further, the mast generally contributes some multiplicative acceleration due to its length and slight bending. In general, electronic assemblies, e.g., integrated circuits and discrete components mounted on a printed circuit board, cannot survive such shock and vibration conditions. For example, integrated circuit pins can be lifted from a printed circuit board, and traces within a printed circuit board can be broken, rendering the electronic assembly non functional.
In addition, radio frequency receivers, e.g., a global positioning system receiver, typically require a highly precise and stable frequency reference. In most cases, a quartz crystal is utilized in such applications as it has desirable precision and stability characteristics. However, quartz crystals rely upon resonant mechanical movements of the crystal to achieve electrical oscillations due to the piezo-electric effect. Shock and vibration conditions common to earth moving blades can easily upset the motions of a crystal frequency reference, resulting in deleterious frequency changes or breakage, rendering the receiver inoperative.
For these reasons and others, GPS receiver electronics are conventionally not mounted to the blades of earth moving equipment. Rather, GPS receiver electronics are conventionally mounted on an engine cover or in the cab area of the earth moving equipment. A blade mounted antenna is typically coupled to receiver electronics via a radio frequency (RF) cable.
RF cabling, e.g., coaxial cable, running from a separate antenna to receiver electronics, inherently attenuates a received signal and is susceptible to induced noise. As an unfortunate consequence, received signal quality at the separated receiver is degraded from that received at the antenna and less than desired.
In addition, such RF cabling is exposed to a severe environment, including dirt, rocks and other debris flying over the top of a blade. Further, both ends of the cable, e.g., the blade mounted antenna and receiver electronics mounted elsewhere, are subject to shock and vibration, inducing a variety of mechanical stresses on such cabling. RF connectors, designed to achieve a constant impedance when coupling RF cabling to antennas and/or receiver electronics, are especially fragile. Such cabling and connector systems are subject to frequent damage, incurring not only direct repair costs, but also significant financial losses due to lack of productivity for an expensive piece of earth moving equipment and valuable operator while awaiting repair.
Thus, it has been a lot felt and unresolved need to mount global positioning system electronics directly to the blades of earth moving equipment. In addition, it is desirable to mount a receiving antenna directly to such global positioning system electronics. Further, it is desirable to meet the above-mentioned needs in a manner that is compatible and complimentary with existing designs for global positioning system electronics.


A model information control system ("MICS") is used in conjunction with a user-defined information model and one or more conventional information system program modules or "functions"to execute business applications. Following each execution of an action defined by the information model, an Expected Behavior Control System ("EBCS") determines if the resulting behavior is consistent with expected behavior and conforms the behavior to the expected behavior if necessary. The EBCS may also change the behavior of an application processing system or application program by enforcing a new behavior for the application processing system or application program without modifying them. The MICS includes an event-action-state machine that manipulates the user-defined information model and the functions.

Information system developers are facing a much different competitive environment than in the recent past. Over the past several years, the emphasis has changed from data processing to management of information systems to decision support systems to strategic information systems. In order to keep up with changes in business, information developers must build systems which are flexible enough to adopt changes in business functions without at the same time incurring excessive maintenance and related costs.
Over the last twenty years or so, software development automation has progressed along three distinct and separate paths. One path pursued increased programming efficiency by automating program coding activities. The result was the development of non-procedural interpretive languages such as fourth generation languages (4GL) and program generators. The second path sought to achieve design effectiveness by bringing structure and rigor to analysis and design. The second path resulted in the development of structured methods of flowcharting programs or dividing programs into functional modules. More recently, automation of such structured methods has been achieved through computer aided software engineering ("CASE") graphic diagraming tools. The third path focused on reusability by taking a database approach to development using objects and data abstraction. This approach initially used a construct known as a data dictionary for accessing information about the data and the relationships among data elements. More recently, such techniques have comprised object-oriented systems and have incorporated so-called information resources dictionaries for storing and accessing objects, programs and data.
Because each of these paths and approaches has merits, there have been attempts made to integrate all of the different tools of the three different paths under the umbrella of information engineering. For example, there is an evolving ANSI standard for repository technology, and IBM has set forth "AD/Cycle," which defines methods to manage all information resources including application specification, programming tools, software programs, software program codes and data.
These approaches, however, do not resolve the problem of application program maintenance. Maintenance and other related support of computer software applications is often expensive, time consuming and unreliable. In order to eliminate maintenance cost, essentially one needs to eliminate application programs themselves. This would have the attendant benefit of reducing the information engineering application development cycle of specification, design, implementation and execution. Neither the three application development paths nor the integrated approaches described above adequately address the maintenance problem or how to solve it.
Another problem with prior art information processing systems relates to the detection of errors in the actions initiated by the application programs run by an application processing system. Prior art techniques focus on the fault arising from an action performing data processing operations and methods for correcting the fault or of continuing system operation despite the fault. However, in many application processing systems, the application program fault is not necessarily resident with the application program. These application programs performing the actions are well tested and implemented. The problem is that the application programs are not providing the expected behavior because an action which is supposed to occur is not occurring or some action occurs which is not supposed to occur.
These type of problems normally remain undetected until the application program breaks down or until poor performance is revealed due to unnecessary processing of actions. In a traditional system, the user must trace the processing flow and observe each action within the processing flow to analyze the performance of the system or to identify errors. Thus, it would be advantageous and very useful to have a system which conforms expected behavior or enforces specific behavior of each action of the application processing system and eliminates incorrect or unnecessary processing to optimize system performance.

Method and apparatus for automated conformance and enforcement of behavior in application processing systems


This invention relates to a water-based composition having at least one of ant-bacterial or anti-fungal properties and use thereof for skin care and for fabric treatment. The composition is not only effective as an anti-bacterial and/or anti-fungal material when included in a skin care gel or lotion for topical use, such as in a sun screen composition, or in conjunction with sanitary elastic gloves as a coating therein, it is gentle to the user""s skin and may include constituents which advantageously indicate its presence. The composition is not only effective as an anti-bacterial and/or anti-fungal material when used as a liquid to treat fabric employed for personal hygiene aids including disposable diapers for children and adults, sanitary napkins, and wipes, it is gentle to the skin and may be formulated to provide odor control. Users include humans and animals.

This invention relates to a water-based composition having at least one of anti-bacterial or anti-fungal properties and use thereof for skin care and for fabric treatment. The composition is not only effective as an anti-bacterial and/or anti-fungal material when included in a skin care gel or lotion for topical use, such as in a sun screen composition, or in conjunction with sanitary elastic gloves as a coating therein, it is gentle to the user""s skin and may include constituents which advantageously indicate its presence. The composition is not only effective as an anti-bacterial and/or anti-fungal material when used as a liquid to treat fabric employed for personal hygiene aids including disposable diapers for children and adults, sanitary napkins, and wipes, it is gentle to the skin and may be formulated to provide odor control. Users include humans and animals.
Since about May, 1997 the inventor began offering for sale a lotion, which is a water-based composition useful as an antiseptic barrier for pre- and post-milking, and dry period treatment of the teats of milk cows under the trade name tSHIELD(trademark) (Quest Research, Inc.). This composition is formulated as a soothing dip or lotion for topical application or is impregnated in toweling used as a cleansing wipe. The lotion product shields the skin of the cow against bacterial penetration for up to four days and may be marked with a dye to indicate its presence and hence provide an effectiveness indicator.
The composition includes four anti-bacterially-active constituents known to target bacteria commonly found for this application, namely, in % by weight based on the weight of the total composition, 0.30% of a Quaternium 12 (C.T.F.A. name, i.e., a Cosmetic, Toiletries, and Fragrances Association name), such as BORDAC 2250 a disinfectant manufactured by Lonza, Inc.; 2.80% of a Cetrimonium chloride (C.T.F.A. name), which is cetyl trimethyl ammonium chloride, a disinfectant manufactured by Lonza, Inc, under the tradename CARSOQUAT CT-429; 2.80% of a combination of Behentrimonium metholsulfate and stearyl alcohol (C.T.F.A. name), which is a disinfectant manufactured by ISP Corporation; and 0.10% Cetylpyridinium chloride.
The composition additionally includes silicone fluids, i.e., 0.90% of SILICONE 344 and 0.70% of SILICONE 1401 (manufactured by Dow Corning) to improve adherence of the lotion to the cow""s teats, as well as other ingredients including emulsifiers, colorants, such as about 0.0023% by weight of FDandC Red, fragrances, and diluents, such as from about 85 to about 90% deionized water.
In about May, 1998, the inventor began offering for sale a water-based gel composition useful as an anti-bacterial hand wash for humans, particularly in medical hygiene applications, under the trade name QUATRO-DERM(trademark) (Quest Research, Inc.). This composition includes four active constituents, hence the name xe2x80x9cquatroxe2x80x9d, namely, in % by weight based on the weight of the total composition, 0.1% of a Quaternium 12 (C.T.F.A. name), such as BORDAC 2250 a disinfectant manufactured by Lonza, Inc.; 0.5% of Didecyl-imethyl ammonium chloride; 1.0% of a Cetrimonium Chloride (C.T.F.A. name), which is cetyl trimethyl ammonium chloride, a disinfectant manufactured by Lonza, Inc. under the tradename CARSOQUAT CT-429; and 0.04% of CHG 20% (a chlorohexidine gluconate manufactured by Degussa AG).
The composition additionally includes various other constituents, such as 1.25% of METHOCEL 40-101 (manufactured by Dow Chemical Corporation) as a thickening agent to provide a viscosity of about 4000 centipoise to the composition, and 0.5% GERMABEN II (manufactured by ISP Corporation) as a formaldehyde donor for the composition.
This composition was not as gentle to the user""s skin as was desired, suffered from color instability, and, in any event, was not free of formaldehyde due to the presence of GERMABEN II.
It is an object of the present invention to provide an anti-bacterial composition, which is gentle, which can be used repetitively, and yet which is ant-bacterially effective for humans and animals.
It is another object of the present invention to provide an anti-bacterial composition, which is gentle, which can be used repetitively, and yet which is ant-bacterially effective for humans and animals, and which leaves no visible residue yet has a sustained functional activity.
It is a further object of the present invention to provide an anti-fungal composition, which is gentle, which can be used repetitively, and yet which is effective as an anti-fungal material for humans and animals.
It is another object of the present invention to provide a fabric hygiene article, such as a disposable diaper (child and adult), a feminine hygiene pad, and a wipe for men and women but having particular utility for women for use in the groin, rectum, inner ears, eyelids, and for makeup removal which also treats the skin, containing the anti-bacterial and/or antifungal composition of the present invention.
It is yet another object of the present invention to provide a sanitary elastic glove having a coating provided on at least the inner surface thereof comprising an anti-bacterial and/or anti-fungal composition of the present invention.
These and other objects are accomplished by the present invention which provides a composition which is a gel or lotion and which has at least one of ant-bacterial or anti-fungal properties, comprising from about 85 to about 90% by weight of pure water, such as deionized water, from about 0.80 to about 1.3% by weight of Cetrimonium chloride; and from about 0.07 to about 0.08% by weight of at least one substance selected from the group consisting of Benzalkonium chloride and Grapefruit seed extract; from about 0.15 to about 0.35% by weight of Didecyl-dimethyl ammonium chloride; and from about 0.08% to about 1.55% of Quaternium 22.
The gel or lotion composition is a non-toxic, non-flammable, nondrying, non-irritating cleanser. It is advantageously alcohol-free, pH balanced, and does not leave any residue on body parts such as the breasts of nursing mothers or in the mother""s milk.
The compositions according to the invention contain no toxic metals, such as arsenic, and no formaldehyde, yet have a very long shelf life. The compositions are gentle enough for any skin type including, but not limited to, lips, breasts, groin, rectal, and eye areas, and may be used repetitively with no adverse effects.
The present invention additionally provides a fabric hygiene article selected from the group consisting of a disposable diaper, a feminine hygiene pad, and a wipe, comprising a fabric assembly; and a water-based composition comprised of from about 85 to about 90% by weight of water; from about 2.20 to about 3.00% by weight of a mixture of Behentrimonium methosulfate and stearyl alcohol; from about 0.15 to about 0.33% by weight of Quatemium 12; from about from about 0.80 to about 3.00% by weight of Cetrimonium chloride; and from about 0.08% to about 1.55% of Cetylpyridinium chloride present in an amount which is at least effective to provide anti-bacterial and/or anti-fingal properties to the surface of the fabric assembly which contacts the user. The amount of composition used may range up to an amount which does not substantially prevent moisture uptake by the fabric assembly. The wipe is preferably completely saturated by the water-based composition and is made of a non-woven fabric composed of a material such as a natural material, for example, a cotton pulp, or a synthetic material such as polyester fibers.
The present invention further provides a sanitary glove, comprising a glove comprised of an elastic material; and a coating provided on at least a part of the inner surface of the glove and being comprised of a water-based composition having at least one of anti-bacterial or anti-fungal properties and comprising from about 85 to about 90% by weight of water; from about 2.20 to about 3.00% by weight of a mixture of Behentrimonium methosulfate and stearyl alcohol; from about 0.15 to about 0.33% by weight of Quaternium 12; from about 0.80 to about 3.00% by weight of Cetrimonium chloride; and from about 0.08% to about 1.55% of Cetylpyridinium chloride.
The composition for skin care of the present invention includes four ant-bacterially active constituents, namely, from about 0.80 to about 1.30%, preferably about 1.20%, by weight of Cetrimonium chloride and from about 0.07 to about 0.08%, preferably about 0.08%, by weight of at least one substance selected from the group consisting of Benzalkonium chloride and Grapefruit seed extract; from about 0.15 to about 0.35%, preferably about 0.30, by weight of Didecyl-imethyl ammonium chloride; and from about 0.08% to about 1.55%, preferably about 0.1%, of Quaternium 22 (C.T.F.A. name), such as those manufactured by manufactured by Lonza, Inc. as anti-bacterially effective constituents. These materials are additionally effective as anti-fungal materials. When one or more of these four active constituents are used in small concentrations, they then function more as a preservative.
The composition of the present invention may additionally include thickening agents, such as from about 0.09 to about 1.20%, preferably about 1.00%, by weight of NATRASOOL HHR 250 manufactured by Aqualon Corporation or METHOCEL 40-101 manufactured by Dow.
The composition additionally may includes moisturizers, such as from about 0.09 to about 0.12%, preferably about 0.10%, by weight of aloe vera extract. Lanolin or glycerine may be included, and additional materials such as Vitamin E and citric acid may be added.
The composition may additionally include an orgonolepticically effective constituent for odor control, namely, from about 1.00 to about 2.50%, preferably about 2.50%, by weight of a sodium salt of an organic sesquicarbonate, such as those manufactured by Dow Chemical.
The anti-bacterial composition for sanitary elastic glove application of the present invention includes four anti-bacterially active constituents, namely, from about 0.15 to about 0.33%, preferably about 0.30%, by weight of Quaternium 12 (C.T.F.A. name) such as that manufactured by Lonza, Inc.; from about 0.80 to about 3.00%, preferably 2.80%, by weight of Cetrimonium chloride; from about 2.20 to about 3.00%, preferably about 2.80%, by weight of a mixture of Behentrimonium methosulfate and stearyl alcohol (C.T.F.A. name); and from about 0.08 to about 1.55%, preferably 0.10% by weight of Cetylpyridinium chloride (C.T.F.A. name), such as those manufactured by Croda, as anti-bacterially effective constituents. These materials are additionally effective as anti-fingal materials.
The composition of the present invention additionally includes thickening agents, such as from about 0.80 to about 1.20%, preferably about 0.90%, by weight of CYCLOMETHICONE manufactured by Dow Chemical, and from about 0.05 to about 0.90%, preferably about 0.07%, by weight of CYCLOMETHICONE DIMETHICONOL manufactured by Dow Chemical.
The composition additionally includes moisturizers, such as from about 0.09 to about 0.12%, preferably about 0.10%, by weight of aloe vera extract, and Vitamin E and glycerin.
The composition may additionally include an orgonolepticically effective constituent for odor control, namely, from about 1.00 to about 2.50%, preferably about 2.50%, by weight of a sodium salt of an organic sesquicarbonate.
The composition may additionally include an indicator for activity which advises a human user or observer of the presence or absence of the composition either by color, or absence thereof, or by fragrance or absence thereof. For example, a dye may be employed such as, by way of example but not limitation, FDandC Red #28 or Red Fluorescent #40. The dye material, moreover, may have any suitable color and may change color depending on the pH of the skin of the recipient. Any suitable water-soluble fragrance may be used, such as those manufactured by ARILYESSENCE. For example, cherry fragrance may be included.

Anti-bacterial composition and use thereof for skin care and fabric treatment


An XRF (XRF=x-ray fluorescence) measurement apparatus (1) has an x-ray source (2) for generating x-rays (4), x-ray optics (3) for directing x-rays (4) from the x-ray source (2) to a sample (5) and an EDS (EDS=energy dispersive spectroscopy) detector (7) for detecting fluorescent x-rays (14) from the sample (5). The apparatus is characterized in that the sample (5) is a wafer (6), in particular a Si wafer, wherein the x-ray optics (3) is positioned to direct the x-rays (4) onto the bevel (12) of the wafer (6). The x-ray source (2) plus the x-ray optics (3) has a brilliance of at least 5*107 counts/sec mm2, preferably at least 1*108counts/sec mm2. The apparatus allows an improved contamination control of wafers, in particular silicon wafers.

The invention relates to an XRF (XRF=x-ray fluorescence) measurement apparatus, comprising                an x-ray source for generating x-rays,        x-ray optics for directing x-rays from the x-ray source to a sample,        the sample,        and an EDS (EDS=energy dispersive spectroscopy) detector for detecting fluorescent x-rays from the sample.
Such an XRF measurement apparatus is known from U.S. Pat. No. 5,778,039 A.
Wafers, in particular silicon wafers, are a basic component in the production of semiconductor electronics. These semiconductor electronics are based on pn-transitions, in particular in diodes and transistors. Semiconductor material of p-type and n-type is produced by carefully controlling the chemical composition of a basic material (such as silicon). More specifically, dopant materials having a number of valence electrons different from the basic material are deliberately added to the basic material.
However, contaminations may act similar to dopant materials, changing the properties of the semiconductor material in an unintended way. Accordingly, semiconductor production is performed under clean room conditions, and the contamination levels are monitored closely.
For silicon wafers, it has been proposed to examine the flat side surfaces of the wafer by means of TXRF (total reflection x-ray fluorescence) spectroscopy. In TXRF, a typically monochromatic x-ray beam is directed to a sample surface, and characteristic x-rays resulting from the refilling of depleted deep electron shells of the sample material are detected. Contaminations of the sample surface result in x-ray peaks at additional wavelengths, as compared to the sample material alone. XRF spectra may be evaluated quantitatively, for determining the amount of contaminations. The flat side surface may be completely scanned with the x-ray beam ("wafer mapping"), if desired.
During production processes, wafers have to be transported at numerous occasions. For this purpose, grippers typically act on the bevel of the wafer; the bevel is also sometimes called "grip edge". Thus contaminations of the flat side surfaces of the wafer shall be avoided.
However, contaminations of the bevel may be passed on to the flat surfaces later on, for example by surface diffusion, in particular at elevated temperatures. Therefore, bevel contaminations should be avoided, too, and accordingly, bevel contaminations should be monitored for this purpose.
For monitoring bevel contaminations, it is possible to wipe the edge of the wafer with a receptive carrier (such as a cotton bud), and to analyze the receptive carrier, for example with ICP-MS (inductively coupled plasma mass spectrometry). However, this is a complex and time-consuming procedure, and the receptive carrier itself may contaminate the wafer.
It is the object of the invention to allow an improved contamination control of wafers, in particular silicon wafers.

XRF measurement apparatus for detecting contaminations on the bevel of a wafer


According to the invention, to correct the curvature characteristic in output due to individual differences between frequency output type hot-wire flow meters, a frequency output type hot-wire flow meter includes a heating resistor disposed in the measurement target fluid and a voltage frequency conversion circuit for converting the air flow rate voltage signal that is proportional to the current flowing through the heating resistor. The voltage frequency conversion circuit converts the air flow rate voltage signal non-linearly to generate the output frequency.

An exemplary conventional frequency output type hot-wire flow meter is described with reference to FIG. 12. The frequency output type hot-wire flow meter comprises a heating resistor 101 disposed in measurement target air flow, a fixed resistor 102 connected to the heating resistor 101 in series, a buffer circuit 103, and a voltage frequency conversion circuit 104. The target air mass flow is measured based on the heating resistor current I101 that flows through the heating resistor 101. The measurement principle of flow rate for the hot-wire flow meter is well known and the detailed description of the measurement principle is omitted herein.
The air flow rate voltage signal Vi proportional to the heating resistor current I101 is obtained from the heating resistor current I101. The air flow rate voltage signal Vi is supplied to the voltage frequency conversion circuit 104 through the buffer circuit 103. The voltage frequency conversion circuit 104 converts the air flow rate voltage signal Vi linearly to generate the output frequency Fo as described below.
An exemplary voltage frequency conversion circuit 104 is described with reference to FIG. 13. The voltage frequency conversion circuit 104 comprises two constant current sources 11 and 12, a switch 15, a switch change-over circuit 19 for generating a switch change-over signal, and an integrating capacitor 21 connected to the output side of the switch 15, and a buffer circuit 27.
Two constant current sources 11 and 12 receive the air flow rate voltage signal Vi and output the air flow rate current signal Ii that is proportional to the air flow rate voltage signal Vi respectively. Two constant current sources 11 and 12 may be, for example, a current mirror circuit. One of the two constant current sources is connected to the integrating capacitor 21 by means of the switch 15. When the first constant current source 11 is connected to the integrating capacitor 21, the air flow rate current signal Ii flows in such a direction that charges are accumulated in the integrating capacitor 21. As the result, the voltage Vic of the integrating capacitor 21 rises. When the second constant current source 12 is connected to the integrating capacitor 21, the air flow rate current signal flows in such a direction that charges are released from the integrating capacitor 21. As the result, the voltage Vic of the integrating capacitor 21 falls.
The changing rate of the voltage Vic of the integrating capacitor 21 is proportional to the air flow rate current signal Ii. In other words, the changing rate of the voltage Vic of the integrating capacitor 21 is proportional to the air flow rate voltage signal Vi.
Operation of the voltage frequency conversion circuit 104 is described with reference to FIG. 14. The switch change-over circuit 19 has an upper limit threshold voltage Vthh and a lower limit voltage Vthl(Vthh>Vthl) and compares the voltage Vic of the integrating capacitor 21 with the threshold voltage to generate a change-over signal. If the voltage Vic of the integrating capacitor 21 is lower than the upper threshold voltage Vthh, the switch change-over circuit 19 generates a change-over signal so that the first constant current source 11 is connected to the integrating capacitor 21. As the result, the voltage Vic of the integrating capacitor 21 rises.
When the voltage Vic of the integrating capacitor 21 reaches the upper threshold voltage Vthh, the switch change-over circuit 19 generates a change-over signal so that the second constant current source 12 is connected to the integrating capacitor 21. As the result, the voltage Vic of the integrating capacitor 21 falls. When the voltage Vic of the integrating capacitor 21 reaches the lower threshold voltage Vthl, the switch change-over circuit 19 generates a change-over signal so that the first constant current source 11 is connected to the integrating capacitor 21. As the result, the voltage Vic of the integrating capacitor 21 rises.
The buffer circuit 27 generates a voltage signal that corresponds to the voltage Vic of the integrating capacitor 21. Therefore triangular waves are generated as shown in FIG. 14.
As described hereinabove, the changing rate of the voltage Vic of the integrating capacitor 21 is proportional to the air flow rate current signal Ii. Therefore the gradient of the triangular wave is proportional to the air flow rate current signal Ii. The larger gradient of the triangular wave results in the larger frequency Fo of the triangular wave, and the smaller gradient of a triangular wave results in the smaller frequency Fo of the triangular wave. Therefore the frequency Fo of the triangular wave is proportional to the air flow rate current signal Ii. In other words, the frequency Fo of the triangular wave is proportional to the air flow rate voltage signal Vi. The frequency Fo of the triangular wave output from the voltage frequency conversion circuit 104 is represented according to the following equation.Fo=Vi/(R·C·dVth)=Ii/(C·dVth)   Equation 1
Wherein R denotes the resistance value of the fixed resistor 10 connected to the air flow rate voltage signal Vi, C denotes the electrostatic capacity of the integrating capacitor 21, and dvth denotes the rage of change of the voltage Vic of the integrating capacitor 21, namely the difference between the maximum value and the minimum value. R, C, and dvth are all constant values.
As represented according to the equation 1, the air flow rate voltage signal Vi is converted linearly to obtain the output frequency Fo in the voltage frequency conversion circuit 104 of the conventional frequency output type hot-wire flow meter. The period T of a triangular wave is represented according to the following equation.
                    T        =                              1            /            Fo                    =                                                    (                                  1                  /                  Vi                                )                            ·                              (                                  R                  ·                  C                  ·                  dVth                                )                                                                                =                                          (                                  1                  /                  Ii                                )                            ·                              (                                  C                  ·                  dVth                                )                                                                        Equation                                                  2
Curvature of an output of the conventional frequency output type hot-wire flow meter that is caused by the difference between individual hot-wire flow meters is described with reference to FIG. 15A, FIG. 15B, and FIG. 15C. FIG. 15A is a graph showing the relation between the actual air flow rate Vair and the air flow rate voltage signal Vi obtained from the heating resistor. The straight line M shows an exemplary standard characteristic of the frequency output type hot-wire flow meter. The curve X shows characteristic that deviates from the standard characteristic due to individual difference. In other words, the relation between the actual air flow rate Vair and the air flow rate voltage signal has a curvature deviated from the standard characteristic.
FIG. 15B shows the conversion relation between the air flow rate voltage signal Vi and the output frequency Fo. The straight line L shows the linear conversion relation between the air flow rate voltage signal Vi and the output frequency Fo, and shows the frequency conversion relation in the voltage frequency conversion circuit 104 of the conventional frequency output type hot-wire flow meter.
FIG. 15C shows the relation between the actual air flow rate Vair and the output frequency Fo obtained by converting the air flow rate voltage signal Vi according to the conversion relation shown in FIG. 15B. A curve M×L shown in FIG. 15C shows a result obtained by linearly converting the air flow rate voltage signal Vi obtained by means of the frequency output type hot-wire flow meter having the standard characteristic shown by the straight line M in FIG. 15A according to the straight line L shown in FIG. 15B. A curve X×L shown in FIG. 15C shows a result obtained by linearly converting the air flow rate voltage signal Vi by means of the frequency output type hot-wire flow meter having the curvature characteristic shown by the curve X in FIG. 15A according to the straight line L shown in FIG. 15B.
As it is obvious from the comparison between the curve M×L and the curve X×L, the frequency output type hot-wire flow meter having the standard characteristic shows a linear relation between the actual air flow rate Vair and the output frequency Fo, but on the other hand the frequency output type hot-wire flow meter having the curvature characteristic shows a non-linear relation between the actual air flow rate Vair and the output frequency Fo. For example, a product that shows characteristic of the straight line M×L may pass inspection, but a product that shows characteristic of the curve X×L may not pass inspection.
A standard characteristic is shown by the straight line M in FIG. 15A, but the standard characteristic may be a curve. The curve X shown in FIG. 15A is an exemplary curvature characteristic, and curvature characteristic can be various as shown by a curve Y.
The voltage output type air flow meter has been known as well as the frequency output type air flow meter. A technique for correcting the non-linear characteristic relation between the mass flow rate of the measurement target and the output voltage signal has been known. JP-A No. 190647/1999 discloses a technique of correction arithmetic using a microcomputer for the voltage output type hot-wire flow meter.
JP-A No. 337382/1999, JP-A No. 94406/1996, and JP-A No. 62012/1996 disclose techniques for correcting non-linear characteristic using a linearizing circuit for the voltage output type hot-wire flow meter.
However, these techniques are used to correct non-linear characteristic, but are not used to correct the curvature characteristic of output due to individual difference between flow meters. A negative feedback amplifier circuit using an operational amplifier corrects the output of the above-mentioned linearizing circuit. The curvature characteristic of output cannot be corrected by this technique because the flow rate signal and the output signal are in a linear relation.
[Patent document 1]
JP-A No. 190647/1999
[Patent document 2]
JP-A No. 337382/1999
[Patent document 3]
JP-A No. 94406/1996
[Patent document 4]
JP-A No. 62012/1996
As described hereinabove, the frequency output type hot-wire flow meter causes the curvature characteristic of output due to individual difference between fluid passages and heating resistors, and due to change of production line, production lot, and the likes.

Frequency output type hot-wire flow meter


A nonvolatile memory device includes a first memory chip and a second memory chip connected to a controller through the same channel. The first memory chip generates a first signal from a first internal clock signal based on a clock signal received from the controller. The second memory chip generates a second signal from a second internal clock signal based on the clock signal, and performs a phase calibration operation on the second signal on the basis of a phase of the first signal by delaying the second internal clock signal based on a phase difference between the first and second signals.

The inventive concepts provide memory devices, and more particularly to, nonvolatile memory devices including a plurality of memory chips and storage devices including the nonvolatile memory devices.
A storage device may include a nonvolatile memory and a controller controlling the nonvolatile memory. In the related art, communication between the nonvolatile memory and the controller is performed at a low operation frequency compared to a memory system including a high-speed memory such as dynamic random access memory (DRAM) or static random access memory (SRAM). However, communication between the nonvolatile memory and the controller has been recently required to be performed at a high operation frequency.

Nonvolatile memory device and storage device including the nonvolatile memory device


Disclosed are salt compositions of lysinol and dicarboxylic acids; and lysinol derived polymers including polyamide, polyimide, polyurea, cross-linked polyurea comprising urethane linkages, polyurea foams, cross-linked polyurea foams, and lysinol-epoxy thermoset.

The production of chemical products, chemical intermediates, monomers, and polymers is an important industry. The chemical industry supplies many of the raw materials and finished products that are in use today. Many of the components that are supplied by the chemical industry are produced using petroleum feedstocks as the initial source. Some of these components can be refined or otherwise purified directly from petroleum. Other components need to be subjected to further processes or chemical reactions to produce the desired products or intermediates.
With a growing world population, the demand for products produced by the chemical industry is increasing. This growing demand places a high burden on the petroleum feedstock, a non-renewable resource that is becoming increasingly costly to obtain due to diminishing resources.
A need exists to produce chemical products and chemical intermediates from resources other than petroleum. There have been attempts in the past to produce chemicals wherein at least part of the molecule is renewably resourced, i.e., is produced from non-petroleum or non-fossil carbon feedstock. Further, there is a need for polymers and materials derived from renewable resources. There is also a need for renewably sourced chemical products, chemical intermediates, monomers, and polymers containing nitrogen.
Lysine is an amino acid manufactured on very large scale by fermentation of sugars and other renewable carbon sources. Lysine and its derivatives, for example lysinol, are therefore potentially useful renewably resourced chemicals that are alternatives to nitrogen-containing, petroleum-derived chemicals.
Hence, there is a need for renewably sourced polymers derived from lysinol such as polyamide, polyimide, polyurea, polyurethane and lysinol-epoxy thermoset.

Polymers derived from renewably resourced lysinol


Methods and compositions for evaluating the affinity of one or more ligands of interest are provided. In particular, a ligand sensor device (LSD) comprising a sensor coupled to a peptide of interest is provided. Assays using the LSD allow detection of ligand-peptide interactions directly in tissue samples and thus provide an in vitro assay to characterize peptide ligands. The LSD and assays find particular use in characterizing cell-specific peptides isolated from in vivo screening in animals to determine their suitability for use in human therapy.

Often the successful treatment of disorders and diseases is hampered by a lack of specificity. Pharmaceuticals which are very effective for treating a disorder in one organ or tissue may have undesirable effects in other tissues and thus limit the usefulness of the treatment. In this way, the effectiveness of drugs and therapeutic genes depends on tissue-specific delivery. One prospect for achieving tissue-specific delivery of drugs is the use of ligands which bind to specific cell types. However, the development of tissue-specific ligands for many differentiated tissues is limited by a lack of information on their cell-specific surface receptors. One solution to this problem is the selection of ligands using phage display libraries. This approach requires no prior knowledge of the target cell receptor expression and function (Barry et al. (1996) Nature Med. 2:299–305). The screening of M13 phage display peptide libraries was first employed to select cell-specific ligands in vitro, and it has also proven useful for the rapid in vivo discovery of small molecule ligands specific to various organs and tissues (Pasqualini and Ruoslahti (1996) Nature 380:364–366; Pasqualini (1999) Q. J. Nucl Med. 43:159–162; Samoylova and Smith (1999) Muscle & Nerve 22:460–466). Peptides identified via phage display screening were used to achieve selective delivery of the cytotoxic drug doxorubicin to tumors, thereby decreasing side effects from the drug's effects on untargeted organs and systems (Arap et al. (1998) Science 279:377–380). Specific gelatinase inhibitors identified from phage display peptide libraries can prevent the migration of human endothelial cells and tumor cells, thereby reducing tumor growth in mice bearing human tumors (Koivunen et al. (1999) Nat. Biotechnol. 17:768–774). Phage display screening can also be used to improve the properties of known proteins or nucleic acids. For example, the selectivity of intravenously administered adenoviral vectors was improved significantly by the insertion of phage derived peptide motifs into the H1 loop of the fiber knob protein (Reynolds et al. (1999) Gene Ther. 6:1336–1339).
Thus, peptides generated by phage display may have both therapeutic and diagnostic utility. They can be useful for the development of gene therapy vectors or drugs targeting various organs and tissues. However, while the in vivo phage display screening protocol has been successful in identifying tissue-specific ligands in mice and dogs, in vivo screening requires euthanasia and thus cannot be applied to humans. Thus, there remains a need for compositions and methods for the identification of interspecies cell-specific peptides, particularly for use in humans. Identification of interspecies cell-specific peptides by selection in multiple animal species and then determination of their affinity to human tissues would allow isolation of tissue-specific molecules that may be used as targeting ligands in gene/drug therapy protocols.
"Biosensors" have been reported in the literature, but the reported devices have low sensitivity or long response times. Decker et al. ((2000) J. Immunol. Methods 233:159–165) reported that more than 90 minutes were needed to measure phage binding by peptide fragments immobilized by biotin/streptavidin coupling. Hengerer et al. ((1999) Biotechniques 26: 956–60, 962, 964) reported binding of phage antibodies to antigen immobilized on a quartz crystal microbalance with a time constant of about 100 min. These long response times are not compatible with rapid screening and make large-scale screening unwieldy. Therefore, there remains a need for a biosensor which can rapidly detect specific proteins.


An OADM device is provided with a variable optical attenuator 73 for attenuating a light signal into which a received light signal is demultiplexed by an optical demultiplexing functional unit 71, a modulating circuit 7 for piggybacking an ID number of a corresponding transmitting port onto the light signal by using the variable optical attenuator, an optical reception detector 84 for detecting the light level of a light signal received via a receiving port, a demodulating circuit 85 for extracting the ID number from the light level detected by the optical reception detector, an ID number management unit 91 for determining whether the ID number extracted by the demodulating circuit matches an ID number set thereby, and a notifying unit 9 for notifying a connection failure occurring in an optical patch cable 14 when the ID number management unit determines that there is a mismatch between the ID numbers.

A wavelength multiplexed light signal network which employs OADM devices using a wavelength division multiplex (WDM) technique are placed in operation under present circumstances in accordance with a path setting in which the network is closed within a ring which consists of about several to more than ten OADM devices. However, two or more rings of this type exist actually, and a wavelength multiplexed light signal network is configured in a form in which the two or more rings are connected in a row. Therefore, there will be a demand for a larger path setting in which a wavelength multiplexed light signal network is placed in operation across a plurality of rings, and attention is given to a wavelength select switch (WSS) as a means for implementing this demand.
On the other hand, in a wavelength division multiplex device, such as an OADM device, an optical demultiplexing unit which demultiplexes a light signal and an optical multiplexing unit which multiplexes light signals are connected to each other via an optical patch cable, and an optical multiplexing/demultiplexing unit which consists of the optical demultiplexing unit and the optical multiplexing unit and an interface unit for connecting with another device are connected to each other via an optical patch cable. However, because the system is based on the premise that a connection job of connecting between units using such an optical patch cable is done manually by a worker, the detection of a connection failure caused by an erroneous operation in the connection job is a very important issue at the time of quick construction, at the time of restoring the system to proper working condition when an emergency failure is occurring, etc.
Because when the optical multiplexing/demultiplexing unit wavelength-demultiplexes a wavelength multiplexed light signal into light signals having individual wavelengths, or inversely multiplexes light signals having individual wavelengths into a wavelength multiplexed light signal, the transmission of the light signals is carried out only in a single direction, there is a one-to-one correspondence between the transmitting ports of the optical demultiplexing unit and the receiving ports of the optical multiplexing unit, and this correspondence is determined beforehand and mechanically in the system. Therefore, the worker should just connect an optical patch cable between two transmitting and receiving ports which are determined mechanically without errors.
Such an OADM device detects and compares the light level of a light signal transmitted from a transmitting port of an optical demultiplexing unit thereof, and the light level of a light signal received at a receiving port of an optical multiplexing unit thereof with each other to detect a connection failure occurring in an optical patch cable. More specifically, after connecting between a transmitting port a and a receiving port a by using an optical patch cable a first, for example, the light level of a light signal at the transmitting port a and the light level of a light signal at the receiving port a are detected and compared with each other. When both the light levels have appropriate values, it is determined that the optical patch cable a is connected normally between the transmitting port and the receiving port, whereas when both the light levels do not have appropriate values, it is determined that a connection failure occurs in the optical patch cable a for connecting between the transmitting port and the receiving port. Then, the next transmitting port b and the receiving port b are connected to each other by using an optical patch cable b, and the light level of a light signal at the transmitting port b and the light level of a light signal at the receiving port b are detected and compared with each other to determine the connection state of the optical patch cable b. After that, a process of detecting a connection failure is carried out on all remaining optical patch cables in the same way (for example, refer to patent reference 1).
However, because when an optical multiplexing/demultiplexing unit has a wavelength select switch, the optical multiplexing/demultiplexing unit can determine whether or not to have no choice but to wavelength-demultiplex a wavelength multiplexed light signal input thereto into light signals having different wavelengths, the OADM device can be set up to transmit two or more light signals having different wavelengths (n transmission signals/n reception signals) via each port. In this setup, arbitrary ports can be specified and therefore a light signal can be transmitted via many paths. Therefore, ports which are connected to each other by using an optical patch cable are not determined uniquely and mechanically, and therefore a connection failure occurring in an optical patch cable cannot be detected only through the detection and comparison of the light levels mentioned above.
To solve this problem, in an OADM device having such a wavelength select switch, each light amplifier is used to piggyback the ID number of a transmitting port onto a light signal transmitted from an optical demultiplexing unit and the ID number is extracted from the light signal received at a receiving port of an optical multiplexing unit, and the detection of a connection failure occurring in an optical patch cable is carried out for each light amplifier (for example, refer to patent reference 2).

Optical add-drop multiplexer (OADM) device


The sensor unit (1) of the present invention comprises a housing (2) which is adapted to be mounted on a DIN rail (10) closely one next to another as a sensor unit array, and to be connected to a sensor head (4a and 5a) via a cable (4 and 5). The housing (2) accommodates a sensing circuit system (101, 102; 201 to 205) for achieving a desired sensing function in cooperation with the sensor head (4a and 5a), a first optical communication circuit system (210, 211) including a light emitting device (206) and a light receiving device (207) for conducting an optical bi-directional communication with one of the adjacent sensor units in the multiple sensor unit array, and a second optical communication circuit system (212, 213) including a light emitting device (208) and a light receiving device (209) for conducting an optical bi-directional communication with the other of the adjacent sensor units, whereby the sensor unit (1,1) is enabled to conduct an optical bi-directional communication with each of the adjacent sensor units in the multiple sensor unit array.

The present invention relates to a sensor unit which is suitable for use in a multiple sensor unit array of a main body unit for an optical fiber type photoelectric sensor, a proximate sensor having a separate sensor head, an ultrasonic sensor having a separate sensor head or the like, and in particular to a sensor unit which is suitable for performing a bi-directional optical data communication between the adjacent sensor units.
Various sensors such as photoelectric sensors, proximate sensors and ultrasonic sensors are used for detecting the presence or position of an object as a part of factory automation (FA). In particular, optical fiber type photoelectric sensors that have separate sensor heads are widely used in compact and high-density machines which are required to be controlled because such sensors can be mounted in a limited space. The term xe2x80x9csensorxe2x80x9d as used herein includes those producing a switching output by comparing a detected value with a threshold value as well as those for producing the detected value as an analog or a digital value.
In the case of a sensor having a separate sensor head as is the case with an optical fiber type photoelectric sensor, the sensor head and the main body unit are joined by a cable (consisting of an optical fiber cable in the case of a photoelectric sensor, or an electric cable in the case of a proximate sensor or an ultrasonic sensor). The main body unit is sometimes called as an amplifier unit in the industry. The main body unit is called in the following description as a xe2x80x9csensor unitxe2x80x9d.
The housing of a sensor unit accommodates various circuits such as a drive circuit for driving a sensor head and a signal processing circuits for processing the signal from the sensor head and generating an output signal of a desired form. In other words, the sensor unit housing accommodates a sensing circuit system which achieves a desired sensing function in cooperation with the sensor head.
Conventionally, sensor units for use in a multiple sensor unit array have been developed with the aim to accommodate a large number of sensor units in a console board or the like. Such a sensor system incorporating a large number of sensor units closely one next to another is illustrated in FIG. 14. The illustrated sensor units each consist of a main body unit (often called as an amplifier unit) of an optical fiber type photoelectric sensor.
As shown in the drawing, this sensor system comprises a DIN rail 301 placed inside a control console or the like, and a plurality of sensor units 300, 300, . . . which are adapted to be used in a multiple sensor unit array and mounted on the DIN rail 301 closely one next to another. In other words, each sensor unit 300 is mounted on the DIN rail 301 in alignment with other sensor units by fitting a DIN rail mount groove 302 formed in the bottom surface of the housing onto the DIN rail 301.
A pair of optical fiber cables consisting of an outgoing optical fiber cable 303 and an incoming optical fiber cable 304 extend from the rear surface of the housing of each sensor unit 300, and the free ends of these optical fiber cables 303 and 304 are connected to sensor heads 303a and 304a which are placed in a detection region.
An electric cable (or cord) 305 extends from the front surface of the sensor unit 300 to produce a switching output or a signal indicating the intensity of the received light which is generated by the sensing circuit system (not shown in the drawing) inside the unit housing. This electric cable 305 is connected to external control equipment such as a programmable logic controller (PLC) which is not shown in the drawing.
As the presence or position of an object is detected by the sensor heads 303a and 304a of the optical fiber cables 303 and 304 according to the change in the transmitted or reflected light, by virtue of the prescribed operation of the sensing circuit system of the sensor unit 300, a detection signal (a switching output or a signal indicating the intensity of the received light) is forwarded to control equipment such as a programmable logic controller (PLC) via the cable 305.
Thus, according to the sensor system described above, because the outer profile of the housing of each sensor unit 300 has a flat configuration with its small side aligned with the direction of the array, and is provided with a DIN rail mount groove 302 in its bottom surface, if the control console is provided with a DIN rail 301, a large number of such independent sensor units 300 can be mounted on the DIN rail 301 closely one next to another in a highly compact fashion.
In recent years, the sensing circuit system incorporated in the sensor unit is given with a progressively higher functionality and performance so that the sensor unit may be adapted to a greater variety of objects and a wider range of detecting conditions. Therefore, there is a growing need to set up the conditions for a larger number of data items for each sensor unit and to monitor the sensor unit to place the sensor unit in an optimum condition for detecting a greater variety of objects and a wider range of detecting conditions.
Such set-up work has been conventionally performed manually by manipulating small set-up keys provided on outer surface of each sensor unit housing while viewing a display unit which is typically difficult to read. Therefore, such work has been known to be irritating and time-consuming.
The sensor unit housing is made smaller and smaller because of the growing demand for more compact design. This trend severely hampers the effort to solve the problems associated with the inconvenience in manipulating the set-up keys on the sensor unit housing and the difficulty in reading the display on the sensor unit.
The inventors have conducted a research to the end of eliminating such problems of the prior art, and have conceived the idea that if each pair of adjacent sensor units in a sensor unit array can transfer data between them in both directions, it will become possible to provide a data set-up unit of good manipulability at an end of the sensor unit array which is easily accessible, and to transfer the data from the data set-up unit to each sensor unit. Also, it will become possible to transfer the data of each sensor unit to the sensor unit at an end of the array so that the data may be monitored on a data display device which provides a favorable visibility.
Implementation of such an idea requires an arrangement which allows a bi-directional data transfer between each pair of adjacent sensor units. However, in the technical field of sensor systems, no appropriate prior art is available that serves this purpose.
For instance, Japanese patent laid open publication (kokai) No. 9-64712 discloses a detection switch system in which a female connector and a male connector are provided on opposing surfaces of each pair of adjacent detection switches (which correspond to the sensor units of the present invention), and are joined together electrically so that the control circuit board of each detection switch may be supplied with electric power for the adjacent detection switch, and the light emission timing may be suitably varied from one detection switch to another by passing an external synchronization signal from the upstream detection switch to the downstream detection switch with a suitable time delay.
However, to achieve such a bi-directional data transfer system contemplated by the inventors, it is necessary to arrange a large number of sensor units, typically from 16 to 64 sensor units, in a series. Therefore, when a contact type connector is used for signal transfer means between each pair of adjacent sensor units as shown in the above publication, the signal transmission path contains so many contact points which may become faulty that such an arrangement would be too unreliable for any practical purpose.
Because the synchronization signal in this prior patent publication is intended for delaying the timing of light emission, the transfer of data takes place only in one direction, and this prior art is therefore based on a concept which is fundamentally different from that of the bi-directional data transfer contemplated by the inventors.
Also, the contact type connector disclosed in this prior patent publication requires a projection and a recess to be provided on either side surface of the sensor unit housing, and this not only necessitates a higher precision for the metallic die assembly for molding the sensor unit housing but also causes some inconvenience in stocking and packaging the parts of sensor unit. Because the connector involves a male and female engagement, when any particular sensor unit has become faulty and is required to be replaced, it is not possible to remove only the faulty sensor unit from the DIN rail, and the maintenance work such as replacing a sensor unit tends to require an excessive amount of work.
This invention was made in view of such problems of the prior art, and its primary object is to provide a sensor unit which allows a reliable bi-directional data transfer between each pair of adjacent sensor units in a sensor system using an array of sensor units.
Another object of the present invention is to provide a sensor unit which allows a reliable bi-direction data transfer between each pair of adjacent sensor units, and has flat housing side surfaces so that each sensor unit may be replaced without being interfered by the adjacent sensor units, and the manufacturing cost may be reduced through simplification of the design of the metallic molding die assembly.
Yet another object of the present invention is to provide a sensor unit which allows a reliable bi-directional data transfer between each pair of adjacent sensor units in a sensor system using an array of sensor units so that more enhanced data set-up manipulation and monitoring may be enabled through integration of various functions in each sensor unit.
Other objects and advantages of the present invention will become apparent to a person skilled in the art from the following description.
The sensor unit of the present invention is provided with a housing that allows a number of such sensor units to be arranged closely one next to another, and is adapted to be connected to a sensor head via a cable.
The xe2x80x9ccablexe2x80x9d as used herein means an optical fiber cable in the case of a photoelectric sensor, and an electric cable (cord) in the case of a proximate sensor or an ultrasonic sensor. The arrangement for mounting a number of sensor units is not limited to the one using a DIN rail, but may consist of any means or structure for mounting a number of sensor units.
The housing accommodates a sensing circuit system, and first and second optical communication circuits.
The sensing circuit system performs the desired sensing function in cooperation with the sensor head. The xe2x80x9cdesired sensing functionxe2x80x9d as used herein may vary depending on the kind of the sensor unit (photoelectric sensor, proximate sensor, ultrasonic sensor, and so on).
For instance, when the sensor unit consists of a photoelectric sensor, the sensing function consists of a photoelectric detecting function of either transmission or reflection type using a detection medium consisting of a detection light beam (of visible light, infrared light or the like). When the sensor unit consists of a proximate sensor, the sensing function consists of an object detecting function which is based on the change in properties such as the oscillation amplitude and oscillation frequency of an internal oscillation circuit due to the presence of an object in proximity. When the sensor unit consists of an ultrasonic sensor, the desired sensing function consists of an object detection function based on the use of a detection medium consisting of ultrasonic sound.
The xe2x80x9csensing circuit systemxe2x80x9d as used herein includes not only hardware for achieving the desired sensing function but also software which operates a microprocessor so as to perform specific functions.
The first optical communication circuit system comprises a light emitting device and a light receiving device for conducting a bi-directional communication with one of the adjacent sensor units when a plurality of such sensor units are arranged closely one next to another. Likewise, the second optical communication circuit system comprises a light emitting device and a light receiving device for conducting a bi-directional communication with the other of the adjacent sensor units when a plurality of such sensor units are arranged closely one next to another.
The xe2x80x9cbi-directional optical communicationxe2x80x9d as used herein means that not only transmission but also reception is enabled. It however does not matter if the bi-directional optical communication is conducted in full duplex mode or half duplex mode.
The first and second optical communication circuit systems each include not only a light emitting device such as a light emitting diode and a light receiving device such as a photodiode but also various other electric components that are required for optical communication such as software for transmission, a parallel/serial conversion circuit, a light emitting device drive circuit, a light receiving device output amplifier circuit, a serial/parallel conversion circuit and software for reception.
The term xe2x80x9coptical communication circuit systemxe2x80x9d is used herein to distinguish from the xe2x80x9csensing circuit systemxe2x80x9d. The structure of the optical signal transmission path between the light emitting device and light receiving device within the sensor housing can be freely selected. Light guiding means such as optical fiber cables, prisms and mirrors may be used to form all of or a part of the optical path between the light emitting device and light receiving device.
According to this structure, a bi-directional optical communication is enabled between each pair of adjacent sensor units in an array of sensor units, and as there is no need for a connector relying on a physical contact for transmission of signals between the adjacent sensor units, a high level of reliability can be ensured even when a large number of sensor units are arranged in an array for signal transfer.
According to a preferred embodiment of the present invention, the housing is provided with a first optical communication window provided on one side thereof for conducting an optical bi-directional communication with one of the adjacent sensor units in the sensor unit array, a second optical communication window provided on the other side thereof for conducting an optical bi-directional communication with the other of the adjacent sensor units in the sensor unit array, whereby the sensor unit is enabled to conduct an optical bi-directional communication with each of the adjacent sensor units in the sensor unit array via a corresponding one of the optical communication windows.
According to this structure, because the optical communication between each pair of adjacent sensor units is accomplished via the optical communication windows, the sides of the housing may consist of flat surfaces so that a significant cost reduction can be accomplished owing to the simplification of the metallic die assembly for molding the housing, and the simplification of the stocking and packaging of the sensor unit. Furthermore, when an array of such sensor units are mounted on a DIN rail closely one next to another, there is no mechanical interference between adjacent sensor units, and the work required in replacing one of the sensor units is simplified.
The optical communication window provided on each side of the housing may be fitted with a visible light cut-off filter, an optical lens or the like. Such a structure improves the efficiency in emission and reception of light and reduces noises in the optical communication by the light emitting device and light receiving device so that the tolerance in the relative positioning of adjacent sensor units is increased, and the reliability of the optical communication is improved.
The optical lens provided in the optical communication window on each side of the housing may consist of a semi-cylindrical lens having a flat surface facing outward and shared by the light emitting device and light receiving device, the light emitting device and light receiving device being arranged along an axial direction of the semi-cylindrical lens, and being reversed in position from one side of the housing to the other so as to complementarily oppose the counterparts thereof in the corresponding adjacent sensor unit in the sensor unit array.
According to this arrangement, because the single optical lens can be used for both emission and reception of light, the optical system can be simplified in structure, the work required in aligning the optical center lines is simplified, and a cost reduction can be accomplished.
The sensor unit of the present invention may further comprise data transfer control means for enabling a bi-directional transfer of data between each pair of adjacent sensor units in the manner of a bucket brigade by controlling the first and second optical communication circuit systems.
According to this structure, by passing the data received from one of the adjacent sensor units to the other adjacent sensor unit, a quick data transfer from one sensor unit to another can be accomplished.
As can be readily appreciated, the sensor unit of the present invention may consist of a photoelectric sensor, a proximate sensor or an ultrasonic sensor by appropriately designing the sensing circuit system.
A sensor system of the present invention incorporating a sensor unit array consisting of a large number of such sensor units has a novel structure, and provides novel advantages.
Specifically, according to the sensor system of the present invention, because a bi-directional exchange of signals between adjacent sensor units is enabled, it is possible to monitor a large number of sensor units or arbitrarily selected sensor units with a simple operation, in particular without requiring to individually operate the associated sensor units, by forwarding a monitor request command to the particular sensor units from an end of the sensor unit array via the intervening sensor units to be executed by the associated sensor units, and having responses therefrom returned to the source of the request command or the sensor unit at the end of the sensor unit array.
In a similar fashion, by replacing the monitor request command with a data setting command, setting of data to a large number of sensor units or arbitrarily selected sensor units can be executed with a simple operation, instead of individually operating the associated sensor units.

Sensor unit for use in a multiple sensor unit array


A method is described for providing an estimate of the state of a stationary or moving contact in a three dimensional ocean. The method comprises the steps of collecting information about a location of an observer during a sequence of time, information from at least one sensor about a position of the contact relative to the observer during the time sequence, and a knowledge vector. Transforming the information into a series of three dimensional geographical grids. Examining the grids to identify hypothesized contact paths and analyzing the hypothesized contact paths to produce an estimate of the state of the contact with respect to the location of the observer. A device for providing the estimate of the state of a stationary or moving contact includes a grid stimulation block for transforming the collected information into the three dimensional geographical grids. A fusion block where grids corresponding to similar time intervals are combined or fused. A correlation block for identifying possible contact paths and for producing path likelihood vectors and an estimation block for providing the estimate of the state of the moving contact. The device further includes a controller for providing knowledge to the aforementioned blocks.

1. Field of the Invention
The present invention relates to a method for providing an estimate of the position, speed, and direction of travel of a contact or target and a system for performing said method.
2. Description of the Prior Art
Computer based technology has advanced to the point where artificial systems have been developed which simulate the operation of the human brain. These systems are known as neural networks. Typically, the systems use numerous nonlinear computational elements operating in parallel and arranged in patterns reminiscent of biological neural networks. Each computational element or neuron is connected via weights or synapses that are adapted during training to improve performance. Many of these systems exhibit self-learning by changing their synaptic weights until the correct output is achieved in response to a particular input. As a consequence, these systems have lent themselves to use in a number of different applications.
One such application is target imaging and identification systems. U.S. Pat. No. 4,995,088 to Farhat illustrates a data analysis system for such an application. Farhat's data analysis system comprises a first array for receiving input data comprising a plurality of neural elements for transmitting data signals and memory means for processing the data signals transmitted by the elements of the first array. The memory means has associatively stored therein in accordance with a Hebbian model of learning for neural networks, at least one quantized feature space classifier of a known data set. The system further comprises a second array having a plurality of neural elements for receiving the data signals processed by the memory matrix. The neural elements of the second array are operatively coupled in feedback with the neural elements of the first array wherein the neural elements of the second array provide feedback input for the neural elements of the first array. In a preferred embodiment of the Farhat system, the neural elements of the first array comprise light emitting elements and the neural elements of the second array photo-detectors.
A second application is contact state estimation. The general contact state estimation, or target motion analysis, problem is to estimate contact location and motion from all available information. This information may include available sensor readings, environmental data, contact kinematics, and historical data. A three dimensional ocean modeling method in conjunction with a data fusion technique must be employed in order to exploit all available information in ascertaining a contact's state.
In a broad sense, each sensor reading provides constraints on the contact state. If sufficient observations are available, and if assumptions are made about the contact motion (such as constant speed and heading), then the contact state may be constrained to a single solution. Due to uncertainty, or error, associated with physical sensor readings, contact state determination becomes a parameter estimation problem. Noisy sensor readings will preclude an exact solution for contact state; therefore, a method must be employed to determine the most likely state estimate.
U.S. Pat. No. 5,488,589 to DeAngelis describes a system and method for contact state estimation that incorporates three dimensional ocean modeling with a data fusion technique to exploit all available information in ascertaining a contact's state. However, in estimating the state of a moving contact, the system and method of the DeAngelis patent constrains the motion of a contact to a model in which the contact follows a course defined by a constant heading and a constant speed at a constant depth. Such a limitation reduces the accuracy of contact state estimates, particularly in an environment where a majority of the contacts are capable of travel at varying speeds, headings and depths.
Thus, what is needed is a method and device for contact state estimation that does not constrain the motion of the contact to a single model of constant motion, that does not require significant computational demands and that incorporates fusion of multiple sensor information and a-priori information.

Neural network based contact state estimator

The United States of America as represented by the Secretary of the Navy