A method of controlling electric power supplied to a heater includes controlling the electric power supplied to the heater by a first method until a temperature of the heater reaches an upper limit of a pre-heating temperature section; and controlling the electric power supplied to the heater by a second method to a target temperature that is higher than the upper limit, when the temperature of the heater reaches the upper limit.

Recently, there has been increasing demand for alternative ways of overcoming the disadvantages of common cigarettes. For example, there is an increasing demand for a method of generating aerosol by heating an aerosol generating material in cigarettes, rather than by burning cigarettes. Accordingly, research into a heating-type cigarette and a heating-type aerosol generator has been actively conducted.
An aerosol generator generally includes a heater that heats an aerosol generating material to generate aerosol, and includes an additional main controller unit (MCU) for controlling electric power supplied to the heater.
When high electric power is supplied to the heater of the aerosol generator in a short time period in order to ensure a fast pre-heating speed, the temperature of the heater rapidly rises, and thereby causing an overshoot effect, by which the heater is heated to a temperature that is well above a target temperature. The overshoot effect may damage various modules included in the aerosol generator, and moreover may provide a user inhaling the aerosol with an unpleasant smoking experience.
In addition, when the temperature of the heater is increased by a proportional integral difference (PID) control method, the overshoot effect of the heater does not occur due to characteristics of a PID control algorithm, but a standby time of the user increases due to a very slow pre-heating speed.

Method for preventing overshoot of heater in aerosol generation apparatus, and aerosol generation apparatus for implementing method


Techniques for ultra-high density connection are disclosed. In one embodiment, an ultra-high density connector includes a bundle of substantially parallel elongate cylindrical elements, where each cylindrical element is substantially in contact with at least one adjacent cylindrical element. Ends of the elongate cylindrical elements are disposed differentially with respect to each other to define a three-dimensional interdigitating mating surface. At least one of the elongate cylindrical elements has an electrically conductive contact positioned to tangentially engage a corresponding electrical contact of a mating connector.

Electronic systems are ubiquitous today, and electronic systems often require a variety of electrical connectors. Many different types of electrical interconnection are used, for example, cable to cable, cable to circuit board, circuit board to circuit board, integrated circuit package to circuit board, semiconductor die to integrated circuit package. Techniques for creating electrical interconnections vary depending on the situation, and include pin and socket connectors, card edge connectors, splices, elastomeric connectors, etc. Some connections are permanent and others temporary, allowing plugging together and unplugging a mating pair of connectors.
Across many different electrical interconnection techniques, a common desire to achieve high density interconnection appears. With the prevalence of miniaturized electronics, such as cell phone, personal digital assistants, and the like, the need for high density interconnection is great.
Referring to connector mating pairs in more detail, various formats of connectors are known which can be plugged together and unplugged. For example, a well-known 9-pin miniature circular connector is used for interconnection between a personal computer and peripherals such as a keyboard or mouse. Many common connectors are constructed from a plastic or rubber housing into which stamped metal contacts are placed. Pins are provided on one connector, and sockets on the mating connector, such that the pins plug or slide into the sockets when the connectors are mated. Connector contacts can be arranged in rows or circular patterns and are held within the housing various techniques. Some higher quality connectors use machined contacts and ceramic bodies to provide increased precision.
The state of the art in mateable connectors is demonstrated by so-called "nano-miniature" connectors which provide contact spacing of about 0.025 inch. Such spacing can theoretically provide interconnect density of up to 1600 connections per square inch, although typical connectors provide only one or two rows of contacts and under 100 contacts total. More common are so-called "micro-miniature" connectors with contact spacing of about 0.05 inch to 0.1 inch, providing theoretical interconnect density of a few hundred connections per square inch. In practice, however, housings included in such connectors result in actual connection density considerably below these theoretical values. Although common 32 AWG wires are about 0.008 inch (about 200 micrometer) in diameter (excluding insulation), the connector technology is relatively large compared to the wires. Even smaller wires are available. Connection of wires to these connectors is typically performed by crimping, clamping, insulation displacement blades, or soldering. Placing connectors onto a wire bundle can be a tedious and expensive manufacturing processing.
In some applications, there is also a need to include other types of connections, such as fluid or optical connections in additional to electrical connections. Few techniques for making both electrical and other types of connections simultaneously are known.

This patent is subject to a terminal disclaimer.


A method for communication processing, applied to a terminal device having installed therein multiple subscriber identity module (SIM) cards including a data primary card and a data secondary card each supporting a New Radio (NR) communication function, includes: conducting statistics on cell information of cells supporting the NR communication function; and determining, according to the cell information, whether a cell to which the data secondary card is registered is a cell supporting the NR communication function, and in response to the cell to which the data secondary card is registered being the cell supporting the NR communication function, enabling the NR communication function of the data secondary card and controlling the data secondary card to perform cell measurement.

Along with the development of communication technology, the development of the fifth generation (5G) new radio (NR) communication technology has been in the drive to maturity stage. 5G NR communication is sometimes abbreviated as 5G communication or NR communication.
In the related art, a terminal device supports communication based on a single subscriber identity module (SIM) card, and also supports communication based on multiple SIM cards. 5G communication based on a single SIM card has been in the drive to maturity stage, and will soon begin to lead the 5G communication based on multiple SIM cards. 5G communication based on multiple SIM cards can be understood as multiple SIM cards having their 5G communication functions enabled. In 5G communication based on multiple SIM cards, it is usually configured with a data primary card and a data secondary card, and only the data primary card can be actually connected to the 5G network, whereas typically the data secondary card can be merely connected to a cell having 5G anchor points, and will not be actually connected to the 5G network.
In the process of 5G communication based on multiple SIM cards, through the enabling of the 5G communication functions of multiple SIM cards, the data primary card that is actually connected to the 5G network can be switched among the multiple SIM cards, which may cause problems regarding power consumption.

Method and device for communication processing, and storage medium

Beijing Xiaomi Mobile Software Co., Ltd.


A method for validating pharmaceutical compositions' weight is disclosed. The method may involve a pharmaceutical composition weight validation system, which may include a pharmaceutical manufacturing process, a barcode scanning, weighing the pharmaceutical compositions with a pharmaceutical balance, sending the barcode scanning and weight information to a database, and having a user accessing the information through a user interface. Additionally, the method for validating pharmaceutical compositions' weight may include entering inventory into the system, formulating the batch, storing weight information, manufacturing the batch, assigning and printing a barcode on the pharmaceutical products, scanning the barcode, weighing the pharmaceutical compositions, populating and storing the weight data, checking if weight is correct in pharmaceutical compositions, and correcting the weight of pharmaceutical compositions.

1. Field of the Disclosure
The present disclosure relates generally to pharmaceutical operations, and more specifically to a method for validating weight in pharmaceutical compositions.
2. Background Information
In order to fulfill patient prescriptions, pharmacies stock and manage an extensive inventory of pharmaceutical products. These products are packaged in pharmaceutical product containers including any suitable type of package such as bottles, boxes, and bags, among others. To keep track of the different items in inventories, as well as for reducing number of medication errors in hospitals and healthcare centers, the FDA has specified that the packaging of all human drugs be labeled with a linear bar code including the National Drug Code (NDC), number that serves as a universal product identifier. This 10-digit code identifies the labeler/vendor, product, trade package size, the specific strength, the dosage, and the formula for a specific firm. These barcodes exhibit benefits such as improving operational efficiency, saving time for taking inventory, reducing errors, and cutting inventory costs.
Generally, after scanning barcodes from pharmaceutical compositions, these are weighed in pharmaceutical balances, after which a pharmacist may print a weight receipt according to the weight measured by the balance. Afterwards, this weight is hand-typed into the system, but because the system does not ensure that the pharmaceutical composition has the correct weight, the process may continue without any automatic weight validation process. Additionally, hand-typing the weight of the pharmaceutical compositions may lead to type-off mistakes, and consequently quality and monetary losses. Quality control and efficiency of pharmaceutical operations are considered to be a major concern.

Method for validation of pharmaceutical formulation composition weight

PROFESSIONAL COMPOUNDING CENTERS OF AMERICA (PCCA)


A system for providing bound checking to insure memory accessed, including indirect object access through pointers, is within a range of defined object bounds is disclosed herein. Embodiments of the present disclosure provide hardware and software methodology for bound checking, where bound checking is performed in hardware and in parallel with the execution of the memory accesses using dedicated hardware. There is reduced overhead associated with the enforcement of bound checking, and hardware is modified to include new registers and/or instructions for bound checking support. An exception is raised when an out of bound violation is detected. According to some embodiments, a compiler extracts bound information from the respective programming language (e.g. C/C++, Java) and generates tables with special APIs known to the hardware that enables both execution of the program and bound checking to be performed simultaneously.

Accessing or modifying data outside of an allocated address space is a well-known problem in programming languages. An unintended memory reference can cause faults, data corruption or breaches in the security of an entire system, potentially causing substantial damage to the system and the underlying data. Memory references that occur outside of an allocated memory space may render software unreliable, and these errors may be difficult to detect in many cases.
Programming languages such as Java, for example, implement secure memory access methodologies in programming semantics. In Java, every memory access is guaranteed to be safe and within the range of addresses as intended by the programmer. However, Java does not support the use of pointers to objects; therefore it is much easier to enforce data access security in Java when compared to languages such as C/C++, for example, that do support the use of pointers. In C/C++, knowledge regarding bounds to which a pointer to an object can point is lost, and it is almost impossible to identify and test for potential illegal memory accesses at run time when the data is accessed.
Conventionally, memory accesses bound checking is usually performed in software. A compiler generates bound checking code and memory address checking is performed at runtime. An error is issued if an out of bound memory addresses is detected. However, this process substantially degrades performance of the code being executed because a substantial amount of checking is involved. Special compiler optimizations have been developed to move bound checks out of loops, for example, to code segments that are less frequently executed.
Some specialized hardware, such as employed by certain types of Intel processors, for example, support software bound checking libraries (e.g. Intel Parallel Studio XE 2013) to improve the performance of bound checking operations. Generally, a compiler generates code and prepares bound checking data for the new hardware memory instructions. These machines execute bound checking code in parallel with the execution of the rest of the code using different cores. However, pointers are excluded in these systems, as mentioned above. Better bound checking is needed.

Hardware and software methodologies for detecting illegal memory address of a memory access operation


In an interface control semiconductor integrated circuit including a plurality of protocol circuits for processing a protocol such as AV- or PC-oriented protocols engaged in an IEEE 1394 standard-compliant data transmission, power consumption is reduced. To achieve this, the interface control semiconductor integrated circuit including the protocol circuits is provided with a plurality of switches associated with the respective protocol circuits and each of the switches performs a switching between supply and shut-off of a clock. A clock is supplied to one of the protocol circuits which should be used whereas clock to unused protocol circuits are shut-off, by controlling each of the switches.

The present invention relates to data transmission systems, and in particular, to a power management technique suitable for a protocol circuit in a data transmission system provided with an IEEE 1394 interface.
Digital AV equipment such as digital televisions (DTV), digital video camera (DVC) and set-top box (STB) is now becoming widespread. As a method for data transmission among the digital AV equipment, an IEEE 1394 standard-compliant serial data transmission is mainly adopted.
On the other hand, a large number of PC peripheral equipment such as CD-ROM drives and DVD drives with IEEE 1394 interfaces are coming along. However, the PC peripheral equipment and the digital AV equipment use different protocols. Therefore, even if the PC peripheral equipment and the digital AV equipment are provided with the same type of IEEE 1394 terminals, data cannot be exchanged directly between them.
Protocols engaged in IEEE 1394 standard-compliant serial data transmission are broadly divided into an AV-oriented type and a PC-oriented type. The AV-oriented protocol (hereinafter, referred to as "AV protocol") uses an IEEE 1394-compliant isochronous transmission, notably IEC61883 standard. On the other hand, the PC-oriented protocol (hereinafter, referred to as "PC protocol") uses an IEEE 1394 standard-compliant asynchronous transmission, notably Serial Bus Protocol (SBP)-2 standard.
Conventionally, interface control semiconductor integrated circuits for controlling IEEE 1394 interfaces (hereinafter, referred to as "1394LSIs") are divided into two types, one is provided with AV protocol circuits and the other is provided with PC protocol circuits. Therefore, in the case of data transmission to both of the AV and PC protocols, it is necessary to use two types of 1394LSIs, i.e., an AV-oriented type and a PC-oriented type. However, recently, there has been an increasing demand for using these two protocols especially in digital AV equipment, and thus a 1394LSI with protocol circuits of both of the AV- and PC-oriented types has been developed.
FIG. 9 shows a configuration of the 1394LSI with the protocol circuits of both of the AV- and PC-oriented types. A 1394LSI 100 includes: a PHY 11 for performing initialization and arbitration of a repeater and an IEEE 1394 bus; a LINK control section 12 for exchanging data with the PHY 11; and a plurality of protocol circuits 13a, 13b and 13c. The protocol circuit 13a is an ISO control section for controlling an isochronous transmission to process AV-oriented data such as MPEG2 data and audio data. The protocol circuit 13b is an authentication control section for performing encryption based on a digital transmission content protection (DTCP) standard on an isochronous packet. The protocol circuit 13c is an SBP-2 control section for controlling an asynchronous transmission and processing PC-oriented data. With the debut of such a 1394LSI with a plurality of protocol circuits, a product cost is reduced due to the reduced number of LSIs, a system configuration is simplified, the time required for the development is reduced, for example, in a data transmission system for an IEEE 1394 standard-compliant transmission of AV- and PC-oriented data.
The plurality of protocol circuits incorporated in the 1394LSI described above are not used at the same time. Nevertheless, clocks are always supplied also to unused protocol circuits, resulting in unnecessary power consumption.
Such 1394LSIs as described above are currently incorporated in stationary digital equipment such as DTV or DVD drives in most cases. Since the stationary digital equipment can be supplied with power from commercial power sources, it is unnecessary to consider power consumption by unused protocol circuits in the stationary digital equipment. However, mobile equipment using, as a recording medium, a device such as a DVD or a HDD handling PC-oriented data is expected to come along in future. The mobile equipment is driven mainly by a battery, and thus power consumption will be a particularly important factor. The power consumption by unused protocol circuits should be avoided especially in 1394LSIs incorporated in such mobile equipment.

System for controlling the clock to each of a plurality of protocol circuits of an interface control integrated circuit based on the type of data to be transmitted

Matsushita Electric Industrial Co., Ltd.


The invention relates to a process for the stabilization of sludge or other waste with a high organic matter content derived from treatment operations of industrial and/or urban effluent, or from drinking water treatment operations of surface or ground water, said sludge containing at least one part dry matter essentially made up of fermentable organic matter, characterized in that it is conducted at ambient temperature and atmospheric pressure, and in that it comprises a stage consisting of acidifying said sludge with at least one strong acid to a pH of between 1.5 and 3.5, a stage consisting of adding at least one nitrite salt to said sludge at a concentration of between 10 and 500 mg N.NO.sub.2 /l sludge, and in that it consists of maintaining the mixture made up of said sludge, said acid and said nitrite salt in contact for a period of between 5 minutes and 12 hours, under permanent or intermittent mixing.

1. Field of the Invention
The invention relates to the treatment of sludge with a high content of fermentable organic matter, in particular sludge derived from processes for urban and industrial waste water treatment, drinking water treatments using surface or ground water, or sludge derived from network cleaning operations. The invention also applies to the treatment of other waste from treatment facilities such as screen debris, fats and sand.
More precisely, the invention relates to a process for stabilizing such sludge or waste, that is to say in particular for its deodorization or sanitization.
In France, the quantity of sludge produced by wastewater and drinking water plants is over one million tonnes of dry matter per year. Approximately, one half of this sludge is put to agricultural use while 35% is stored in waste tips. As the production of this sludge is on the increase, it should not cause a hazard for the environment or human health. This sludge contains germs of which some are pathogenic (Coliform bacteria, salmonellae, helminth eggs. . . ). In addition, it is highly fermentable and is a source of gas generation (amines, hydrogen sulphide, mercaptans) giving rise to olfactory nuisances.
These considerations account for the necessity, for the above-mentioned treatment sectors, to make provision for at least one stage of sludge stabilization intended to obtain sludge that is no longer undergoing change, or at least undergoing very slow change, both at biological level and at physico-chemical level.
This sludge is made up of a soluble part and a dry matter part. The dry matter comprises approximately 30% mineral compounds and approximately 70% of so-called "volatile" organic matter. Traditionally, the main objective of sludge stabilization treatments is in particular to reduce its fermentable ability by oxidizing the organic matter for its improved bio-assimilation or by eliminating the reducing germs which are the cause of fermentation.
As specified above, sludge stabilization treatments are also intended to meet two main objectives:
sludge sanitization by reducing the number of potentially pathogenic germs; PA1 sludge deodorization by reducing its fermentable capacity, that is to say by reducing the number of reducing bacteria (in particular sulphato-reducing germs) and/or by reducing organic matter concentration. PA1 aerobic digestion PA1 anaerobic digestion PA1 chemical packaging PA1 thermal packaging PA1 one is a stabilization process known to men of the art under the name SYNOX PA1 the other is a stabilization process using gaseous nitrogen oxides. PA1 pretreatment of sludge including a decrease in pH of between 2.5 and 3, adjusting dry matter content up to 2.5-3.5% by weight, and heating the sludge to a temperature of 40.degree. C.; PA1 oxidation of the sludge by contact with 5% ozonated air for 30 to 60 minutes, with a view to reducing its organic matter concentration; pre-treatment and oxidation are conducted in a reactor under pressure (6 to 9 bars); PA1 optional post-treatment using sodium nitrite which is added to reduce the concentration of viruses. PA1 long stay lengths (aerobic and anaerobic digestion) PA1 production of malodorous gases (anaerobic digestion leading to biogas release, quickliming which produces ammonia, thermal packaging requiring high energy consumption and generating volatile fatty acids). PA1 increase in sludge volume--quickliming) PA1 limited time duration of stabilization PA1 high complexity and high implementation costs PA1 sometimes mediocre performance regarding deodorization and sanitization. PA1 complete deodorization of the sludge (inhibited formation of H.sub.2 S, CH.sub.3 SH and organic sulphides), PA1 elimination of faecal contamination germs (total and thermotolerant Coliforms, streptococci), PA1 elimination of parasitic eggs (helminth eggs). PA1 complete deodorization of the sludge (inhibited formation of H.sub.2 S, CH.sub.3 SH and organic sulphides), PA1 elimination of faecal contamination germs (total and thermotolerant Coliforms, stroptococci), PA1 elimination of parasitic eggs (helminth eggs, Ascaris, Taenia, Trichuris. . ), and also, PA1 elimination of spore-forming bacteria (Clostridium spores . . ), PA1 elimination of Protozoa (Giardia, Cryptosporidium . . . ).
Also, the stabilization stage must, for reasons relating to operating costs, cause the least possible deterioration to sludge dehydrating capacity This parameter has a direct effect on polymer consumption required by treatment processes to convert sludge to other uses or to store as waste.
2. Description of the Prior Art
There are numerous stabilization processes in the state of the art for such sludge. They are essentially classified as follows:
More recently, two new processes were examined but have not yet, as at the date of filing of this present application, been properly developed at industrial level.
All these processes can be applied to sludge having a relatively high concentration of dry matter, frequently between 50 and 100 g/l. This therefore requires that this sludge is submitted to preliminary thickening treatment generally by settling or flotation. Treatment facilities must therefore be designed so that they are of sufficient size to allow a minimum contact time of 24 hours.
Aerobic digestion reduces organic matter concentration and consists of extended aeration of sludge so that the development of the aerobic microorganisms it contains can be continued until elimination of the organic matter substrate, achieving self-oxidation of these microorganisms.
Aerobic stabilization can be conducted at 30.degree.-40.degree. C. (mesophil stabilization) or at 45.degree.-60.degree. C. (thermophil stabilization). In the latter case, the temperature increase leads to partial sanitization of the sludge.
The stay length of the sludge in aerobic stabilization reactors is generally 10 to 15 days which achieves 30 to 40% elimination of organic matter, 90-96% elimination of sulphurated matter emission, and a reduction of over 2 log in faecal germs. If the facilities in which this aerobic stabilization is carried out are covered and insulated, the degradation of organic matter produces an increase in temperature which accelerates the digestion process. The length of stay can therefore be reduced by half, down to 5 to 6 days.
Anaerobic stabilization consists of degrading organic matter with strictly anaerobic bacteria under specific environmental conditions ( redox potential in the region of--250 mV, neutral pH) until the formation of methane. Methanisation of the organic matter can take place under ambient, mesophil or thermophil conditions and requires a stay length of 20 to 30 days. Under these conditions, degradation of organic matter generally reaches 40 to 50%. The odour index is reduced by 70 to 80% and pathogenic germs by 1 to 2 log.
Chemical packaging using lime is used at different stages of sludge treatment. Lime (quicklime) can trap the water contained in the sludge during a disintegration reaction and greatly increases its siccative properties. In addition to this increased drying, quicklime plays a powerful stabilizing role through strong alkalinization of the medium, which allows extensive destruction of pathogenic agents (sanitization) and of the microorganisms responsible for anaerobic fermentation leading to a decrease in the emission of sulphur pollutants. The use of quicklime generally enables faecal germs to be reduced by 4 to 5 log and the flow of sulphurated molecules (H.sub.2 S, mercaptans) by over 90%. However, the rise in pH which results from its use causes the release of ammonia and therefore an olfactory nuisance. Also, the addition of quicklime leads to an increase in sludge mass in proportion to treatment level of at least 30%. Moreover, the stabilization obtained with quicklime is fairly short-lived, generally 8 to 30 days according to the proportion of quicklime added.
Sludge treatment by thermal packaging consists of treating sludge at high temperature (150.degree.-220.degree. C.) under high pressure (15 to 20 bars) for 30 to 40 minutes to achieve sanitization and partial conversion of the organic matter it contains into biodegradable, soluble compounds (alcohols, aldehydes, volatile fatty acids) so as to destroy the colloid slats and thereby improve subsequent stages of thickening and dehydration. The main drawback of the process lies in the olfactory nuisances generated by resulting organic molecules such as butyraldehydes, butyric compounds, valeraldehydes. . . and its very high energy cost which means that this process is increasingly less used.
Among the above-mentioned processes recently developed, the SYNOX process consists of treating raw sludge in several stages comprising:
The main disadvantage of this process is that it is very complex both in design and implementation. It requires at least two reactors and is most costly from an energy viewpoint since it includes the stages of O.sub.3 production, heating, and pressurizing.
Another process described in French Patent n.degree. 9310335 filed under the name of the Applicant, recommends the use of oxides of gaseous nitrogen for sludge stabilization.
This process consists of transferring nitrogen oxides to a liquid sludge (nitrogen monoxide, nitrogen dioxide, nitrogen protoxide. . . ) that are either pure or diluted in a mixture with another gas, and of assuring a contact time of less than 5 hours between the sludge and the nitrogen oxides.
Although it achieves very good levels of performance in respect of sludge deodorization (odour reduction: 3 to 4 log) and sanitization (germ reduction: 4 log) within a much reduced contact time (a few hours) compared with sludge stabilization processes (20 to 30 days for anaerobic stabilization, approximately 10 days for thermophil aerobic stabilization), this latter process using nitrogen oxides nevertheless has two disadvantages.
Firstly, this process implies the presence, in the air exiting the reactor, of residual nitrogen oxide which must be eliminated, necessitating fairly costly additional treatments.
Also, this process implies relatively high investment costs connected with the production of NO.sub.x, in particular in the case of in situ production, by thermal oxidation of ammonia.
In conclusion, the disadvantages of known sludge stabilization processes already in operation or still only at the development stage are as follows:
Also, these processes frequently lead to refermenting of the stabilized sludge over time and during storage in areas provided for this purpose. Table 1 below summarises the performances of the chief processes in the current state of technique:
TABLE 1 __________________________________________________________________________ Anaerobic Aerobic digestion stabilization Quickliming SYNOX NOX __________________________________________________________________________ Type of thickened thickened dehydrated raw raw sludge Length of stay 20 to 30 6-12 days -- 60' to several 4 h days hours Volatile m. 45-50% 35-40% -- -- -- variation Deodorization H2S:1-2 log H2S:2-3/4-5 log. H2S >5 log -- H2S = 5 log CH3SH = 4 log Sanitization T < 30.degree./T > 50.degree. C. Coliform 1.5 log 0.5 to 1/3 to 5 3 log 5 log >5-6 log Streptococci 1.5 log log 3 log >5-6 log 3 log Clostrid. Sp. <0.5 log 0.5 to 1/3 to 5 -- >4-5 log 1 log log 3 to 5 log __________________________________________________________________________

Omnium De Traitements et de Valorisation


A device for programmable delay of an analog signal in an acoustic antenna that comprises at least one analog/digital converter circuit delivering, from the analog signal, a digital signal at a first sampling frequency, followed by a delay memory receiving the digital signal in write mode, making it possible to store M consecutive samples in memory. A circuit for write and read access to the delay memory is provided to address the delay memory in write and read mode, which, under read access control, delivers a series of samples delayed by a defined value, a function of the number of samples M stored therein. A sub-sampling circuit receives the delayed digital signal and delivers a sub-sampled delayed digital signal at a second sampling frequency less than the first sampling frequency.

In present-day sound pick-up systems, acoustic antennae are formed by several microphones, which are configured in such a way as to carry out sound pick-up aiming to cause only slight degradation of the sound signal. To this end, a programmable pure delay signal is introduced into the signal delivered by each microphone, so as either to correct for the physical geometry of the acoustic antenna produced, or to steer the receiving pattern of the acoustic antenna in a given direction with respect to the axis of symmetry of the acoustic antenna. The signals appropriately delayed for each microphone are then summed in order to deliver a resultant signal representative of the sound signal.
A first solution for performing this delay function consists in inserting analog delay lines in cascade with each microphone. This solution, however, exhibits the drawbacks and limitations of analog systems, that is to say inadequate reproducibility and precision for professional applications.
A second solution may consist, however, on the basis of a signal digitized either after each microphone or after summing, this digitized signal consisting of successive samples separated by a sampling period T, in storing these samples in memory. This is because the memory storage of N successive samples has the effect of delaying the transmission of the signal, subjected to this memory storage, by a delay duration of .DELTA.=N.times.T. The delay .DELTA. must however be greater than the duration of the sampling period T, with the desired precision. For sampling frequencies of 16 kHz and 48 kHz, the sampling period is equal to 62.5 .mu.s and 20.8 .mu.s respectively.
In certain specific professional applications, the values of sampling period are greater, with a precision of 1 .mu.s.
In such a case, it is not possible to apply the delay directly to the samples arising from the analog/digital conversion.
It is then necessary to raise the frequency of sampling of the signal delivered by the microphones, by oversampling. For a frequency of the samples, after oversampling, equal to F.sub.2, the frequency of the samples before oversampling being equal to F.sub.1, the duration of the period of the samples after oversampling is divided in the ratio K=F.sub.2 /F.sub.1. The value of this ratio is determined by the value of F.sub.1, the sampling frequency, and by the precision sought for the delay applied.
For example, for F.sub.1 =16 kHz and for a precision, the minimum delay, .DELTA.m=1 .mu.s, the value of K is K=63. The value adopted is the value, the immediately higher multiple of two, K=64.
Such a device is represented diagrammatically in FIG. 1a in which T.sub.2 =1/F.sub.2 is much less than 1 .mu.s, the delay applied, .DELTA.=M.times.T.sub.2, corresponding to the memory storage of M samples. Passing the delayed oversampled signal through a sub-sampling filter, of ratio 1/K, performing the inverse operation, brings the delayed signal back to the sampling frequency F.sub.1.
Such a device, described particularly in the document U.S. Pat. No. 3,997,772, makes it possible to introduce a programmed delay of less than the sampling period. However, no integrated component exists capable of performing such a function.
In a general way, as represented in FIG. 1b, it is necessary to use a digital signal processor DSP to implement the oversampling filter, management of the samples in the external memory and the sub-sampling filter. The delay is obtained by writing the samples into the external memory and rereading previously memory-stored samples. The choice of the over- and sub-sampling filters is important. If they are chosen with many coefficients, frequency response is perfect, at the price of high computing power (about 4 MIPS--Mega Instructions Per Second--for F.sub.1 =16 kHz and filters with 256 coefficients), although out-of-band rejection of 70 dB nevertheless causes a slight degradation of the signal.
If, on the other hand, they are chosen to have a lower number of coefficients, 64 coefficients for F.sub.1 =16 kHz, the computing power is certainly reduced to 1 MIPS, but the response curve is greatly degraded, by the presence of undulations in the passband and by poor out-of-band rejection, less than 30 dB, entailing a significant degradation in the signal.
Hence, for a small acoustic antenna including 10 microphones, implementing such delay circuits requires computing power lying between 10 and 40 MIPS. For an acoustic antenna including 64 microphones, an antenna more particularly intended for video conferencing applications, the computing power necessary lies between 64 and 256 MIPS, which requires the use of 2 to 6 DSPs, digital signal processors, to which must be added the external delay memories. The cost of implementing such antennae, even in the case of small antennae, is therefore very high.
In current techniques for analog/digital conversion, a conventional converter usually comprises an anti-aliasing analog filter, in accordance with the Shannon theorem, the signal obtained, limited in frequency, being converted by successive approximation with respect to a reference voltage. The precision of the converter depends on the precision of the comparison with the reference voltage. This type of device requires an analog filter, the cutoff frequency of which is a function of the sampling frequency, which makes it necessary to change the analog filter when changing the sampling frequency. These converters are therefore very inflexible in use.
More recently, another category of analog/digital converters has been developed, these converters including a plurality of conversion stages in cascade each driven by a different sampling frequency.
Such a type of converter is represented in FIG. 1c, and corresponds in a non-limiting way to a converter known as a "delta sigma" converter, denoted .DELTA..SIGMA. converter.
Following first-order low-pass analog filtering, a converter stage quantizes the filtered analog signal at a high rate, F.sub.1 =4 MHz (4096 kHz) for a sampling frequency of F.sub.3 =16 kHz, over a low number of bits, 1, 2 or 3 bits, by virtue of a .DELTA..SIGMA. conversion module shifting the quantization noise to the high frequencies. The converted signal is brought back to an intermediate frequency, for example F.sub.1 =16.times.F.sub.2, i.e. F.sub.2 =256 kHz, by means of a first low-pass filter, over a larger number of bits, then brought back to the format of the sampled signal by passing through a second sub-sampling filter, of low-pass type, over the final number of bits, 16 for example, and at the sampling frequency of F.sub.3 =16 kHz. The advantage of this device resides in the fact that the anti-aliasing filtering function is performed digitally and that the cutoff frequency is adjusted automatically as a function of the final chosen sampling frequency F.sub.3.
Such analog/digital conversion devices are very flexible in use, since it suffices to apply the signal, originating from a microphone for example, directly to the input of the analog filter, and to supply the sampling frequency F.sub.3, the frequencies F.sub.2 and F.sub.1 being able to be deduced from it.

Device for programmable delay of an analog signal and corresponding programmable acoustic antenna


A line driver circuit, an electro-optic device, and a display apparatus efficiently reduce cost by reducing process dimensions and effectively shorten display panel development turn-around time by simplifying the reconfiguration of output voltages. The liquid crystal apparatus 10 has an LCD panel 20, a signal driver 30, a scan driver 50, and a power supply circuit 80, each of which is controlled by an LCD controller 60. Signal driver 30 contains an interface unit 200 for converting a first voltage specified for a low voltage process to a second voltage specified for a high voltage process. The interface circuitry within interface unit 200 is made up devices using a medium voltage process. Interface unit 200 receives and converts low voltage signals (i.e. first voltage level) supplied from LCD controller 60 to high voltage signals (i.e. second voltage level), and supplies the level-shifted voltage signal to scan driver 50 or power supply circuit 80.

1. Field of the Invention
The present invention relates to a line driver circuit, and to an electro-optic device and a display device using the same.
2. Description of Related Art
Display panels, such as liquid crystal displays, are used as display units in electronic devices, such as cell phones for example, in an effort to achieve low power consumption and reduce the size and weight of the electronic devices. Since delivering video and still images with high content value has become possible with the rapid spread and acceptance of cell phones in recent years, high image quality has also become necessary for display panels in cell phones, and other devices used to deliver video/image contents.
Active matrix liquid crystal panels using thin film transistor ("TFT" below) liquid crystals are known as one type of liquid crystal panel achieving high image quality in the display unit of such electronic devices. Organic EL panels using organic EL elements are another type.
In an active matrix liquid crystal panel using TFT liquid crystals, a high voltage is required for driving the display, the value of the high voltage being dependent upon the liquid crystal material and TFT transistor capacity. As a result, the driver circuit (line driver circuit) and power supply circuit for driving an active matrix, LCD panel display, must be manufactured using a high breakdown voltage process.
There is therefore a problem that even as device geometry processes continues to get smaller, the benefits of low cost offered by reduced dimensions cannot be realized in LCD panel drivers.

Line drive circuit, electro-optic device, and display device


A method for making a plastic film having a three-dimensionally structured and colored surface includes the steps of: providing the film with a three-dimensional surface structure via a shaping process; determining the provided topography of the film surface via a scanning process; and, applying a coloring to the surface after the topography of the surface has been determined. A device configured to apply the coloring to the surface is controlled such that the application of the coloring to the surface is changeable in dependence upon at least one of topological data of the surface and macroscopic shapes of the surface.

Production methods of this type for plastic films are known. For instance, DE 43 24 970 A1 discloses a method for producing three-dimensionally structured surfaces with the aid of an embossing roll, the surface of the embossing roll representing the negative form of the surface to be embossed. This technique is used for the production of thermoplastic films as a substitute for natural surfaces with a highly complex structure, such as calf leather, buffalo leather, et cetera, which has fine pores and is provided with a complex grain structure. Here, the surface of a positive form is machined with the aid of laser engraving, the laser (beam) being controlled in the process by way of data which were previously obtained with the aid of optical or mechanical scanning of the original surface. A method of this type can be used firstly to produce an embossing roll directly and without the requirement of further intermediate steps. Secondly, a method of this type also permits the production of intermediate forms or intermediate rolls which correspondingly contain the positive or the negative of the surface structure of the original surface.
U.S. Pat. No. 5,886,317 discloses a method for engraving a pattern into the surface of a workpiece, in which the surface information in the form of electric control signals is likewise generated and is stored with the aid of optical or mechanical scanning of a surface of a pattern master, which surface information is then used to control the engraving laser. Here, in the region of the transitions or joints, the surface information which is obtained there from the pattern master is engraved multiple times one after another onto the workpiece as an identical pattern. It is also disclosed to engrave the same surface information multiple times and/or alternately in an inverse information sequence (that is, forward and backward), and also to apply it with a certain randomness. By way of methods of this type, the transitions become somewhat softer, but still remain visible.
These methods in the prior art are suitable for the previously customary production of films which are more or less single-color, with the exception of a somewhat slightly "cloudy" coloring or large-area color change, as exists between different functional regions in films of this type, for example in dashboard films between the region close to or below the windshield, which region is to be configured to be as low-reflective and dull-colored as possible, and the region in the footwell which is to appear as comfortable and bright-colored as possible.
Color changes of this type are produced nowadays by way of, for example, gravure printing methods, in which the film which is provided with a surface structure or an embossing is colored in a color printing unit with the aid of color impression rolls. Methods of this type are expensive and inflexible, since always only the same color transition can be produced by way of one roll. In addition, the printed image cannot be reproduced in a suitable quality without relatively great expenditure.
When work is carried out by way of a classic printing unit, a reproducible homogeneity can be produced only with difficulty, since the press setting (throwing on of the rolls) usually takes place indirectly via the setting of the press nip. If the thickness of the material fluctuates, more or less of the structure is provided with coloring depending on the pressure or the pressure distribution, and the printed image and therefore the color application and the color distribution vary.
Films with color transitions are produced nowadays in large-scale production for different vehicles. Some color separation lines which are of very striking configuration even have to be hidden behind a cover which separates the two color regions, on account of the unsatisfactory printed image.
All the known methods have disadvantages such that either color boundaries cannot be produced accurately, or that "flowing" color transitions from one color to the other require considerable outlay for multiple rotary printing and, in addition, produce a printed image which can have fluctuations during the production. Moreover, the observer often has the perception that structures of the embossed three-dimensional surface of films of this type and the coloring do not "fit together" and sees and feels, for example, immediately that artificial leather in no way achieves the visual and haptic impression of the original.
The subjective evaluation by way of the human eye is still an extremely precise way of assessing a structural surface, which up to now has not been capable of being replaced by way of automatic methods, which evaluation by way of the human eye clearly registers even very small changes in the appearance or color of the surface. Transitions or boundary regions, the formation of repeating patterns and moulette stripes are as clearly noticeable as colorings which seem to be "unnatural". Moreover, the phenomenon exists that the human eye assesses a surface which is observed from a relatively great distance in a completely different way to an observation at a small distance. It can therefore be the case that, for instance, an artificial leather surface which is observed in detail and from a small distance appears homogeneous, whereas the same artificial leather surface is discerned as being bumpy, streaky and unnatural in color when observed from a distance of several meters.

Method for making a colored plastic film


A clamp useful as part of a sign holder which displays identifying characteristics of merchandize on a display rack support rod of circular cross-section. The clamp has an upper housing and a lower housing hingably connected together. The free ends of the housings engage each other as they are overlapped one over the other. When the upper and lower housings overlap, teeth on each are resiliently urged toward each other to engage each other to releasably lock the housings into any desired one of a plurality of relative rod encircling positions. Friction pads are urged by the upper and lower housings against the rod. The pads compress in response to increasing the amount of overlap by relative movement of the upper and lower housings. The clamp completely encircles the rod.

U.S. Pat. No. 4,687,788, whose contents are incorporated herein by reference, discloses a sign holder for use on a rod of rectangular cross-section that serves as a horizontal support of a display rack for merchandise. Such a sign holder is positioned to separate two adjacent groups of merchandise when magnetically clamped onto the rod.
The sign holder of this patent has a magnetic clamp which is configured to have an inverted L-shape defined by a horizontal portion and a vertical portion. The horizontal portion rests on the top flat surface of the rod and has an opening for receiving a sign post. The vertical portion has magnets for magnetically attracting the side flat surface of the rod.
While this L-shaped magnetic clamp works well for clamping onto a rod with a rectangular cross-section, it would be desirable to provide a sign holder that has a clamp which is better suited for use on a rod which lacks flat surfaces, such as a rod which has a circular cross-section. Such rods are also used as horizontal display rack supports for merchandise, such as clothing. Clamps are known which completely encircle the rod with circular cross-section and whose ends are secured together by a fastening screw.


Methods and an apparatus for providing an intrinsically safe chamber door for a processing chamber capable of operating at high pressures are provided. One exemplary apparatus includes a processing chamber for a substrate where the chamber is configured to operate at a positive pressure. The processing chamber includes a port loading slot for providing access for the substrate into and out of the chamber. A chamber door positioned inside the chamber is included. The chamber door is configured to seal against an internal surface of the chamber thereby blocking access through the port loading slot. An internal pressure of the chamber assists in sealing the chamber door against the internal surface of the chamber. Also included is a door actuating mechanism configured to move the door along a door path where the door path is positioned at an angle to a path to be traversed by the substrate.

1. Field of the Invention
This invention relates generally to methods and apparatus for sealing a chamber and more particularly for providing a door mechanism that is intrinsically safe and capable of withstanding high pressures within a chamber.
2. Description of the Related Art
High pressure processing of semiconductor substrates is taking on greater importance because of the advent of new formulations for inter-layer dielectrics (ILD). Other technological trends, such as the reduction in size of various interconnect features, are also hastening the move to non-conventional process technologies such as high pressure. Some of these newer ILD materials are incompatible with traditional methods for removal of photoresist and post-etch residue. Conventional methods of removing photorersist, such as the use of plasma processes, cause damage to the ILD. Plasma processes, typically employing the excitation of oxidizing species such as oxygen and fluorine-containing gases using Radio Frequency (RF) or microwave (MW) energy may not distinguish between the photoresist and the underlying ILD. This is especially true of organic and organosilicate glass materials such as Dow Chemical's SILK™, Novellus Systems' CORAL™, Applied Materials' BLACK DIAMOND™, etc.
Plasma processes damage these ILD materials by either etching them and causing loss of critical dimensions, or by chemically altering them and causing an increase in their capacitance. Wet processes such as the use of solvents like N-methyl pyrilidone (NMP), hydroxylamines, etc. are limited by their ability to wet ever-decreasing feature sizes. As feature sizes shrink below 100 nm, the ability to get active chemicals into features such as vias and trenches becomes limited by surface tension. Wet processes are also not desirable for porous ILD materials. Absorption of water and other solvents in the pores of the ILD could result in the increase of capacitance. As an example of high pressure process, super critical carbon dioxide is being used for removal of photoresist and post etch residue from some of the newer ILD formulations. With super critical carbon dioxide processing, the chamber can achieve an internal pressure up to 5000 pounds per square inch (psi). The processing capability of super critical carbon dioxide is augmented by the addition of small quantities of chemical additives. These additives enhance solubility of photorersist and post etch-residue in the super critical carbon dioxide or provide reactivity necessary to break up polymeric or other chemical bonds in the residue. Of course, the use of high pressure brings with it safety concerns. For example, any leaks from the chamber may lead to emissions of the additive chemicals into the environment outside the chamber. An additional source of concern is the high stresses to which the components of the process chamber are subjected. Proper design of the wafer load port or door is necessary to prevent leakage of process fluid and mechanical failure of the door itself.
At the same time, the semiconductor industry is moving to processing single wafers as opposed to batch processing. As the transition from 200 mm substrates to 300 mm substrates becomes more pervasive, the movement to processing single wafers accelerates further.
The combination of these two trends requires development of single-substrate high-pressure chambers. As part of these chamber designs, there must be a port for loading the substrate into the chamber for processing. A great deal of consideration must be given to design of these ports and to the door mechanism that seals the port during processing. The door must have the capability of both sealing against leakage of process fluids under large internal chamber pressures (up to 5000 psi) and be sufficiently strong to withstand the high mechanical stresses imposed by such large operating pressures. Additionally, the door must be reliable enough to withstand the repeated pressurizing and de-pressurizing associated with processing single wafers.
Since most semiconductor processing chambers work at atmospheric pressure or below, door safety is not of consequence. Moreover, for vacuum chambers an external door is the preferred design since the higher external pressure enhances door sealing by exerting a force on the door against its seal. While an external door may work well for a vacuum chamber, they suffer from several disadvantages in a high pressure environment. For example, since the force due to the internal chamber pressure is working against the seal that the external door makes with the chamber, the structure to hold the door securely against the seal at high pressures has to be fairly massive. Accordingly, an externally sealed door with the attendant need for massive actuation and sealing components takes up more space. This increases the substrate-handling robot's reach requirements. Moreover, provision of these actuation components complicates the design of external exhaust ducts and hoods necessary to capture fugitive emissions from an open door or to account for the failure of a door seal during processing.
U.S. Pat. No. 6,228,563 to Starov et al. describes such an external door mechanism for a high pressure chamber. The location and size of the external door mechanism is also shown therein. The shortcomings of such an approach are evident from the massive and complicated actuation mechanisms necessary to restrain and support the door against an internal chamber pressure. Other mechanisms for removing the door from the axis of substrate motion are also necessary. Additionally, the substrate load ports must make allowance for partial insertion of the thick portion of a substrate-handling robot's end effector. This allowance increases the area over which the internal chamber pressure may act on an external door.
U.S. Pat. No. 5,857,368 to Grunes et al and U.S. Pat. No. 5,518,771 to Jeffryes et al. describe another means of accessing the interior of a high-pressure semiconductor processing chamber. Hydraulic presses are employed to move the upper and lower chamber halves away from each other to create an opening through which a semiconductor substrate may be introduced into a process cavity. Because the same mechanisms that move the chamber halves away from each other also have to support the large internal load generated by process pressure, these mechanisms are massive. Movement of large components involves overcoming large inertial forces and can lengthen the time necessary to remove a processed substrate and replace it with an unprocessed substrate, which in turn decreases throughput.
As a result, there is a need to solve the problems of the prior art to provide an intrinsically safe and robust door capable of handling high pressure semiconductor processing.

Method and apparatus for sealing substrate load port in a high pressure reactor


A base insulating layer of an FPC board includes a rectangular first insulating portion and a second insulating portion that outwardly extends from one side of the first insulating portion. A conductor layer is formed on one surface of the base insulating layer. The conductor layer includes a pair of rectangular collector portions and a pair of extraction conductor portions that extend in a long-sized shape from the collector portions. One collector portion is formed in a first region of the first insulating portion of the base insulating layer, and the other collector portion is formed in a second region of the first insulating portion. One extraction conductor portion extends from the one collector portion to the second insulating portion, and the other extraction conductor portion extends from the other collector portion to the second insulating portion.

1. Field of the Invention
The present invention relates to a printed circuit board and a fuel cell using the same.
2. Description of the Background Art
Batteries that are small in size and have high capacitance are desired for mobile equipment such as cellular telephones. Therefore, fuel cells capable of providing high energy densities compared to conventional batteries such as lithium secondary batteries have been developed. Examples of the fuel cells include a direct methanol fuel cell.
In the direct methanol fuel cell, methanol is decomposed by a catalyst, forming hydrogen ions. The hydrogen ions are reacted with oxygen in the air to generate electrical power. In this case, chemical energy can be converted into electrical energy with extremely high efficiency, so that a significantly high energy density can be obtained.
A flexible printed circuit board (hereinafter abbreviated as an FPC board), for example, is provided within such a direct methanol fuel cell as a collector circuit (see JP 2004-200064 A, for example). Here, a configuration of the conventional fuel cell is described using FIG. 6. FIG. 6(a) is a plan view of the FPC board used in the conventional fuel cell, and FIG. 6(b) is a sectional view showing the configuration of the conventional fuel cell.
As shown in FIG. 6(a), a pair of conductor layers 52a, 52b is formed on one surface of the FPC board 51. In addition, extraction electrodes 53a, 53b are provided so as to extend out of the conductor layers 52a, 52b, respectively.
As shown in FIG. 6(b), a fuel cell 50 is constituted by the FPC board 51, a film electrode junction 54 and a housing 55. The film electrode junction 54 is composed of a polyelectrolyte film 54a, a fuel electrode 54b and an air electrode 54c. The fuel electrode 54b is formed on one surface of the polyelectrolyte film 54a, and the air electrode 54c is formed on the other surface of the polyelectrolyte film 54a. The housing 55 is composed of a pair of half portions 55a, 55b. The half portion 55a is provided with fuel passages 56 into which fuel (methanol) flows, and the half portion 55b is provided with air passages 57 into which air flows.
The FPC board 51 is bent with its one surface on which the conductor layers 52a, 52b are formed as an inner side. The film electrode junction 54 is sandwiched between the conductor layers 52a, 52b of the bent FPC board 51. Gaskets 58a, 58b are disposed in the periphery of the FPC board 51. Then, the half portions 55a, 55b of the housing 55 are attached so as to cover a portion, excluding the extraction electrodes 53a, 53b, of the FPC board 51 from both sides of the FPC board 51. Various types of external circuits such as electronic components are electrically connected to the extraction electrodes 53a, 53b that are exposed from the housing 55.
In this fuel cell 50, methanol is supplied to the fuel electrode 54b of the film electrode junction 54 through the fuel passages 56 of the half portion 55a. Moreover, air is supplied to the air electrode 54c of the film electrode junction 54 through the air passages 57 of the half portion 55b. In this case, methanol is decomposed into hydrogen ions and carbon dioxide by a catalyst to form electrons in the fuel electrode 54b.
The hydrogen ions decomposed from the methanol pass through the polyelectrolyte film 54a to reach the air electrode 54c, and then react with oxygen in the air supplied to the air electrode 54c on the catalyst. Thus, the electrons are consumed while water is formed in the air electrode 54c. This causes the electrons to move between the conductor layers 52a, 52b of the FPC board 51 and supplies electrical power to the external circuits.
In the conventional FPC board 51 used in the fuel cell 50, the extraction electrode 53a is formed on its one end side and the extraction electrode 53b is formed on its other end side as described above. Therefore, the extraction electrodes 53a, 53b are arranged on different surfaces in a state where the FPC board 51 is bent. In this case, complicated operation of alignment is required when the external circuits are connected to the extraction electrodes 53a, 53b. In addition, reliability of connection between the external circuits and the extraction electrodes 53a, 53b is not sufficiently ensured, and problems such as a positional shift are generated.


A mobile device is configured to wirelessly authenticate with a reader device. The mobile device may receive an acoustic signal from a user, and a command may be determined based on the acoustic signal. The mobile device may transmit the command to the reader device if the mobile device and the reader device are authenticated. The reader device may receive the command, and may analyze the command to determine an action to be performed. The reader device may then perform the action if the mobile device is authorized to request the command to be performed.

Electronic systems often include a user interface through which a user can communicate with the system. For example, in electronic access control systems, a user interface is commonly used to identify a user, and the access control system allows access if the user is determined to be an authorized user. For example, certain conventional user interfaces include a keypad or a credential reader. These systems may have certain limitations including, for example, the amount of time it takes for the user to operate the interface. Therefore, a need remains for further improvements in systems and methods for interfacing with electronic systems.


A variation in electrical characteristics, such as a negative shift of the threshold voltage or an increase in S value, of a fin-type transistor including an oxide semiconductor material is prevented. An oxide semiconductor film is sandwiched between a plurality of gate electrodes with an insulating film provided between the oxide semiconductor film and each of the gate electrodes. Specifically, a first gate insulating film is provided to cover a first gate electrode, an oxide semiconductor film is provided to be in contact with the first gate insulating film and extend beyond the first gate electrode, a second gate insulating film is provided to cover at least the oxide semiconductor film, and a second gate electrode is provided to be in contact with part of the second gate insulating film and extend beyond the first gate electrode.

Transistors in which an active layer is formed using a semiconductor thin film which is formed over a substrate having an insulating surface are widely used in electronic devices such as integrated circuits (ICs) and image display devices (display devices).
Conventional thin film transistors mostly have what is called a planar structure, in which a semiconductor film, an insulating film, an electrode, and the like are stacked over a plane. Owing to advances in manufacturing processes which enable miniaturization of such transistors, channel width is reduced, which causes a reduction in on-state current. Therefore, in recent years, a transistor having a novel structure which is an alternative to the conventional planar structure has been developed. For example, Patent Document 1 discloses a fin-type transistor in which a polycrystalline silicon film is used as an active layer (referred to as a semiconductor thin film in Patent Document 1).

Semiconductor device and method for manufacturing the same

Semiconductor Energy Laboratory Co., Ltd.


A method of applying a post-render motion blur to an object may include receiving a first image of the object. The first image need not be motion blurred, and the first image may include a first pixel and rendered color information for the first pixel. The method may also include receiving a second image of the object. The second image may be motion blurred, and the second image may include a second pixel and a location of the second pixel before the second image was motion blurred. Areas that are occluded in the second image may be identified and colored using a third image rendering only those areas. Unoccluded areas of the second image may be colored using information from the first image.

The term motion blur is used to describe the visual streaking effect of moving objects in a still image. In traditional photography, motion blur is the effect of an image changing its position as it is being recorded due to rapid movement that is faster than the shutter exposure time. In computer animation, two-dimensional images can be rendered from three-dimensional models in order to generate successive frames for a movie or video game. In contrast to a physical photograph, computer rendered images can capture a single instant in time, and thus motion blur need not be a part of rendered images. However, without the simulated effect of motion blur, the animation of still images tends to produce movements that seems choppy and segmented to the human eye. For example, computer animation without motion blur can tend to resemble traditional stop-action animation where the model's position is changed between each frame. In order to produce more realistic animations, a motion blur effect can be added by the renderer as each frame is generated. This can have the effect of smearing the still images in each frame according to a direction of motion.


A computer-implemented method for capturing content may include (i) displaying, within a graphical user interface of a media recording application that records media through an input device, a clickable reaction button, (ii) receiving a click of the clickable reaction button within the graphical user interface of the media recording application, and (ii) in response to receiving the click of the clickable reaction button within the graphical user interface of the media recording application, performing both capturing, by the media recording application, media content through the input device recording metadata indicating that a user reacted to the captured media content such that the metadata specifies a reaction that corresponds to the clickable reaction button. Various other methods, systems, and computer-readable media are also disclosed.

In the modern field of social networking applications, users typically seek to share with other friends both captured content, such as photographs and videos, and indications of how the users and others reacted to that content. For example, some social networking applications may enable a user to first capture a photograph and then upload the photograph to the social networking application through a backend server. Subsequently, a friend of the user may observe on a news feed that the user uploaded the photograph to the social networking application. In this example, the social networking application may further enable the friend to click an emoji icon to indicate an emotion, corresponding to a facial expression of the emoji icon, that the friend felt when observing the photograph.
Although the techniques outlined above may enable users to share content with their friends, these techniques may nevertheless fail to optimize user experience along one or more dimensions. For example, the multi-step sequence for capturing, uploading, and/or annotating content may be inefficient for a variety of different reasons, as further discussed below. The instant disclosure, therefore, identifies and addresses a need for improved systems and methods for capturing content.

Systems and methods for capturing content


A load simulator and switch are connected to a power source of a plasma processing device. The switch allows the load simulator to be electrically connected to the power source to allow testing of the power source. The switch and load simulator allow the testing of the power source without mechanically removing the power source from the plasma processing device. In addition, the switch allows the connection of the load simulator to the power source while the power source is on, avoiding the requirement of turning off the power source before connecting the load simulator.

The present invention relates to plasma devices. More particularly, the present invention relates to an improved plasma processing device.
Plasma processing devices may be used in manufacturing. Plasma processing devices may use power systems to generate and sustain a plasma.
To facilitate discussion, FIG. 1 is a schematic view of a prior plasma processing device 10, comprising a plasma process unit 12, a pump manifold 14 supporting the plasma process unit 12, a lower transfer chamber 16 supporting the pump manifold 14, and a power source 18 connected to the lower transfer chamber 16. The plasma process unit 12, pump manifold 14, and lower transfer chamber 16 collectively form a plasma process module. The plasma process unit 12, comprises an upper electrode 20 spaced apart from a lower electrode 22. A lead 24 extends from the lower electrode 22, through the pump manifold 14 and the lower transfer chamber 16 to provide an electrical connection between the lower electrode 22 and the power source 18. An example of a power source 18 is a One Box(trademark) radio frequency (rf) power source, which comprises a first generator 28, a second generator 30, and a match box 32 electrically connected to the first generator 28 and the second generator 30. In this example, the first generator 28 provides a 2 MHz output and the second generator 30 provides a 27 MHz output. The match box 32 may provide electrical diagnostics and impedance matching. An output connector 34 extends from the match box 32. The lead 24 is electrically connected to the output connector 34, which may be a 5 inch diameter piece of silver coated copper plug and where the lead may be connected to the output connector 34 by a screw or bolt. Nut and bolt sets 36 may provide a mechanical connection to connect the power source 18 to the lower transfer chamber 16. A bottom cover 38 covers the bottom of the lower transfer chamber 16. An interlock switch 40 is placed near the cover 38 and is electrically connected to the first generator 28 and the second generator 30, so that when the cover is removed from the lower transfer chamber 16 the interlock switch 40 causes the first generator 28 and the second generator 30 to be powered down to reduce electrical shock hazards.
In the testing of the power source 18 in the prior art, to facilitate discussion, FIG. 2 is a schematic view of a power source 18 of a plasma processing device being tested and FIG. 3 is a flow chart of the testing procedure of the power source 18.
In the testing of the power source 18, a power source problem may be suspected (step 304). The first and second generators 28, 30 may be turned off and powered down (step 308). The power source 18 may be disconnected from the plasma process module (step 312), which might take 15 to 30 minutes. To do this, the bottom cover 38 may be removed from the lower transfer chamber 16 to provide access to nut and bolt sets 36. The removal of the bottom cover 38 may trigger the interlock switch 40, which may shut down the generators 28, 30 if they are not already turned off. The nut and bolt sets 36 may be removed. Typically a power source 18 may be connected by 6 to 7 nut and bolt sets 36. In addition, the lead 24 may be disconnected from the output connector 34. The power source 18 may be moved away from the plasma process module (step 316) to create enough space to connect the load simulator 44, which might take 5-45 minutes. A load simulator 44 connected to a 50 ohm terminator 46 may be connected to the output connector 34 of the power source 18 (step 320). The generators 28, 30 may be turned on and powered up (step 324) which may take 10 minutes, to determine if there are any problems with the power source 18 (step 328). Diagnostic instruments within the first and second generators 28, 30 or within the match box 32 may be able to determine if the power source 18 is working properly, when connected to the load simulator 44.
If it is determined that the power source 18 is working correctly, then to reconnect the power source, the first and second generators 28, 30 may be powered off (step 332). The power source 18 may then be disconnected from the load simulator 44 and the power terminator 46 (step 336). The power source 18 may then be moved to the plasma process module (step 340). The lead 24 may be connected to the output connector 34. The power source 18 may then be connected to the lower transfer chamber 16 of the plasma process module (step 344). The 6 to 7 nut and bolt sets 36 may be used to complete the connection. The bottom cover 38 may be placed on the lower transfer chamber 16 to set the interlock switch 40 so that it is not triggered. The first and second generators 28, 30 may the be powered on (step 348).
The connecting and disconnecting of the power source 18 and the powering up and powering down of the generators may be time consuming and hazardous and may require a high level of expertise to be done correctly. In addition, the connecting and disconnecting of the output connector 34 and the lead 24 may cause the connection between the output connector 34 and the lead 24 to be less reliable. The many steps involved increase the chance of mistakes with high voltage and current devices.
In view of the foregoing, it is desirable to provide a simple method and apparatus for testing a power source of a plasma process device.
The invention relates, in one embodiment, to a plasma processing apparatus, comprising: a plasma process module; an electrode within the plasma process module; a switch electrically connected to the electrode; a load simulator electrically connected to the switch; a power source electrically connected to the switch, wherein the switch is electrically connected between the power source and the load simulator.
The invention relates, in a second embodiment, to a method for testing a generator in a plasma processing device while the generator is running, comprising the steps of: setting the generator to provide a near minimum (which is low or zero) power output, while the generator remains on; through a switch electrically connected to the generator, connecting a load simulator to the generator; increasing the output of the generator; and determining if the generator is providing sufficient power.


A liquid droplet ejecting apparatus having: a pressurizing device; a pressure generation chamber whose volume expands or contracts by a movement of the pressurizing device; a liquid droplet ejecting head having a nozzle communicating with the pressure generation chamber; and a drive signal generator which generates the drive signal for operating the pressurizing device, and causing to eject liquid droplets through the nozzle, wherein the drive signal comprises: an expansion pulse to expand the volume of the pressure generation chamber; a first contraction pulse following the expansion pulse to contract the volume; and a second contraction pulse after the first contraction pulse to contract the volume, wherein a pulse width of the expansion pulse is 0.7AL through 1.3AL, and a pulse width of the first contraction pulse is 0.3 AL through 1.5 AL, where AL is ½ of an acoustic resonance period of the pressure generation chamber.

1. Field of the Invention
This invention relates to a liquid droplet ejecting apparatus and a method of driving a liquid droplet ejecting head which ejects liquid droplets through nozzles.
2. Description of Related Arts
An ink jet recording head (hereinafter simply referred to as a recording head) is used to record images with very small ink droplets. A liquid droplet ejecting head as the ink jet recording head which ejects liquid droplets through nozzles jets out liquid droplets onto a recording medium such as a sheet of recording paper by giving a pressure to a pressure generation chamber.
Various kinds of pressurizing devices have been available to give pressures to the pressure generation chambers. Among the pressurizing devices, we briefly explain a recording head which is disclosed by Patent Document 1 referring to FIGS. 12(a) and (b). The partition walls of the pressure generation chamber are made of piezoelectric elements and deformed to eject ink droplets through nozzles.
As shown in FIGS. 12(a) and (b), the above shear-mode recording head 600 contains bottom wall 601, ceiling wall 602 and shear-mode actuator walls 603 therebetween. Each actuator wall 603 contains lower wall 607 which is bonded to bottom wall 601 and polarized in the arrow direction 611 and upper wall 605 which is bonded to ceiling wall 602 and polarized in the arrow direction 609. A pair of actuator walls 603 forms ink flow channel 613 which work as a pressure generation chamber therebetween. Nearby actuator walls 603 of two pairs of adjacent actuator walls form space 615 which is narrower than ink flow channel 613. This space 615 is a dummy channel and does not eject ink. In other words, this head is a so-called dummy channel type head.
Nozzles plate 617 with nozzle 618 is firmly fixed to one end of each ink flow channel 613. Each surface of actuator wall 603 has a metal layer of electrode 619 or 621. Each of electrodes 619 and 621 is covered with an insulating layer (not shown in drawings) to insulate from ink. Electrodes 621 facing to space 615 is connected to ground 623. Electrode 619 provided in ink flow channel 613 is connected to silicone chip 625 which works as an actuator driving circuit.
Meanwhile, for fast recording of ink jet images, it is necessary to drive recording head 600 at a high-frequency and eject ink droplets at shorter cycles. Specifically, to accomplish high-frequency greyscale driving, it is necessary to eject an ink droplet and the next droplet promptly and stably through the identical nozzle.
For this purpose, Patent Document 1 discloses a method of applying a cancellation pulse after ejecting an ink ejection pulse to reduce a pressure change in ink flow channel 613 which is a pressure generation chamber.
In other words, this method applies a cancellation pulse to generate a pressure wave whose phase is opposite to a pressure change in ink flow channel 613 a preset time later after an ink droplet is ejected. As shown in FIG. 13, a cancellation pulses D (pulse width AL) whose phase is opposite to that of ejection pulse C is applied to electrode 619 of ink flow channel 613 time lapse AL later after ejection pulse C falls. Here, AL is ½ of an acoustic resonance period of the pressure generation chamber.
The voltage value of the cancellation pulse is determined according to the amplitude of a pressure change to cancel the change (for example, 0.6 time of the ejection pulse voltage). When receiving this cancellation pulse, actuator wall 603 deforms in a direction opposite to deformation of the actuator wall at the time of ink ejection. This eliminates a change in ink ejection velocity when the frequency of drive pulses is changed and consequently improves the printout quality. This also enables quick stable ejection of a succeeding ink droplet after ejection of an ink droplet through an identical nozzle. Consequently, the recording head can be driven at a high frequency and eject ink droplets at a shorter cycle.
[Patent Document 1] Japanese Non-Examined Patent Publication 2003-276200
This method like a conventional driving method can cancel a pressure wave in a pressure generation chamber by applying a cancellation pulse. Thereby, the recording head can greatly attenuate the meniscus vibration due to a pressure wave in the pressure generation chamber and start ejection of the next ink droplet.
FIG. 5(b) shows a behavior of an ink meniscus in a nozzle and how a liquid droplet is ejected in a conventional driving method. FIG. 5(b) shows nozzle 23, ink pillar 102, ink droplet 101, main droplet 11, satellite droplet 12, and meniscus M. FIGS. 5(a), (b) will be explained in detail later.
From present inventors' stock of information, the following is found:
When a cancellation pulse is applied to cancel a pressure wave as disclosed in the above prior art as shown in FIG. 5(b), ink pillar 102 still has its root in meniscus M. (See FIG. 5(b)-(3) and (5).) As ink pillar 102 extends away from nozzle 23, ink pillar 102 is pulled by the moving energy of the main droplet and becomes longer since only the surface tension of the ink works to cut off the ink pillar 102. Then, the separated ink droplet 101 also becomes longer and consequently the velocity difference between the top and tail of the ink droplet becomes greater. When the flying force of the liquid pillar overcomes the surface tension which works to cut off the liquid pillar, ink droplet 101 is apt to part into main droplet 11 which has a preset volume and a preset ejection velocity and satellite droplets 12 each of which has smaller volume and ejection velocity than those of the main droplet volume. Consequently, the number of satellite droplets 12 increases. (See FIG. 5(b)-(9) and (10).)
This phenomenon appears more eminently when ink of a low surface tension or high viscosity is ejected.
Such satellite droplets 12 will land off the landing position of main droplet 11, which causes the deterioration of image qualities.
In the above ink jet recording head, any crud in the vicinity of a nozzle on the outer side of the nozzle forming member will interfere with the ejection of ink, causing the ejected ink to change its flight, to be dragged in and deposited near the nozzle. Further, it frequently occurs that satellite droplets 12 float around the recording head and are deposited near the nozzles on the outer side of the nozzle forming member. This also causes the above problem.
Besides, when satellite droplets 12 increase its number, the ink mist increases in the recording apparatus. The ink mist will contaminate the inside of the apparatus and, in an extreme case, the ink mist deposits on electric contacts and causes malfunction of the apparatus.
This invention has been made in view of the above problems and an object of this invention is to provide a liquid droplet ejecting apparatus which can be driven at a high-frequency, reduce the number of satellite droplets, and ejects liquid droplets steadily, and a method of driving a liquid droplet ejecting head to accomplish the object.

Liquid droplet ejecting apparatus and a method of driving a liquid droplet ejecting head


An image forming apparatus includes a coordinate converter that corrects an image position in one pixel unit by converting a coordinate, a gradation value converter that corrects the image position in less-than-one pixel unit by converting a gradation value, an image outputting unit that forms a detection toner image including an intermediate gradation pixel onto an image bearing member that can bear a toner image, and a light reflection characteristic detector that detects a light reflection characteristic of the detection toner image. The gradation value converter is adjusted in accordance with a detection output of the light reflection characteristic detector.

1. Field of the Invention
The present invention relates to an electrophotographic image forming apparatus such as a printer or a color copying machine.
2. Description of the Related Art
In recent years, an increase in image formation speed of electrophographic color image forming apparatuses has increased the types of tandem color image forming apparatuses. A tandem color image forming apparatus includes a photosensitive drum and developing devices, and successively transfers images of different colors onto a recording medium or an image conveying belt. The number of developing devices is the same as the number of coloring materials. The tandem color image forming apparatus is known to have a plurality of factors that cause misregistration. Accordingly, various methods are proposed to deal with these factors.
One factor involves ununiformity and mounting displacement of a lens in a deflection scanner and displacement of the deflection scanner when it is mounted to the body of the color image forming apparatus. In this case, a scanning line is inclined and bent. The inclination and bending depend upon color, thereby resulting in misregistration.
Japanese Patent Laid-Open No. 2002-116394 discusses a method of overcoming misregistration. In the method, in the step of assembling a deflection scanner, the bending amount of a scanning line is measured with an optical sensor, a lens is mechanically rotated to adjust the bending of the scanning line, and then the deflection scanner is secured to an image forming apparatus body with an adhesive.
Japanese Patent Laid-Open No. 2003-241131 discusses another method. In the method, in the step of mounting a deflection scanner to a color image forming apparatus body, the inclination of a scanning line is measured with an optical sensor, the deflection scanner is mechanically inclined to adjust the inclination of the scanning line, and then the deflection scanner is mounted to the color image forming apparatus body.
Japanese Patent Laid-Open No. 2004-170755 discusses still another method. In the method, the inclination and bending amount of a scanning line are measured with an optical sensor, and bitmap image data is corrected so as to cancel the inclination and the bending to form an image based on the corrected data. Since this method allows misregistration to be electrically corrected as a result of processing the image data, it does not require a mechanical adjuster or an adjusting step during the assembly. From these two points, this method allows misregistration to be corrected at a lower cost compared to the methods discussed in Japanese Patent Laid-Open No. 2003-241131 and 2003-241131. There are two methods of electrically correcting misregistration. One method is performed in one pixel unit and the other method is performed in less-than-one pixel unit. In the correction in one pixel unit, pixels are shifted in a subscanning direction in one pixel unit in accordance with the amounts by which the inclination and bending are corrected. In the correction in less-than-one pixel unit, gradation values of bit image data are adjusted for front and back pixels in the subscanning direction. By this correction, it is possible to eliminate an unnatural step at a shifted boundary resulting from the correction in one pixel unit, so that an image can be smoothed.
However, correcting misregistration by the method that is discussed in Japanese Patent Laid-Open No. 2004-170755 may cause a density variation in a fine image. The density variation of a fine image will be described with reference to FIG. 14. An input image 601 is a thin line of one dot. When an image 602 produced by performing color misregistration correction on the input image 601 is actually formed, an output image resulting from the correction of the color misregistration becomes a thin-line image having an ununiform density even though the input image 601 is a thin-line image having a constant density. This is caused by the electrophotographic image forming apparatus not being generally good at forming an isolated pixel with an image gradation value and an actual image density value remaining proportional to each other. Accordingly, this weakness causes noticeable density variation to occur in the fine image formed by a thin line.


A wire saw apparatus including: a plurality of wire guides; a wire row formed of a wire which is wound around the plurality of wire guides and configured to reciprocatively travel in an axial direction; a nozzle configured to supply a coolant or slurry to the wire; a workpiece-holding portion configured to suspend and hold a workpiece plate having a workpiece bonded thereto with a beam interposed therebetween; a workpiece-feeding mechanism configured to press the workpiece against the wire row; and a mechanism configured to adjust a parallelism of axes of the plurality of wire guides around which the wire row is formed. Thereby, a wire saw apparatus and a method for manufacturing a wafer are provided which enable manufacturing of a wafer having any warp shape by controlling a warp in a wire travelling direction of a sliced workpiece.

Semiconductor wafers such as silicon wafers are sliced off from a workpiece such as silicon ingot by using a cutting apparatus such as a wire saw apparatus 101 as shown in FIG. 8. Typically, the wire saw apparatus 101 includes a wire row 104 that is formed by winding a wire 102 around multiple wire guides 103, and the wire 102 reciprocatively travels in an axial direction. Further, the wire saw apparatus 101 includes: a nozzle 108 configured to supply a slurry 109 to the wire 102; a workpiece-holding portion 107 configured to suspend and hold a workpiece plate 106 having a workpiece W bonded thereto with a beam 105 interposed between the workpiece plate 106 and the workpiece W; and a workpiece-feeding mechanism 110 configured to push relatively down and press the workpiece W against the wire row 104. Such wire saw apparatus 101 can slice the workpiece W into wafers by pressing the workpiece W against the wire row 104.
Meanwhile, slicing with a wire saw causes sliced workpieces to warp. This warpage caused by slicing with a wire saw is determined by the change over time in relative positions between the workpiece (ingot) and the wire during cutting. It is generally believed that warp is formed in a slicing direction by the influences of: thermal deformation of an apparatus casing and thermal expansion of main rollers, around which a wire is wound, and an ingot during cutting that is from the beginning to the end of slicing. Hence, it has been disclosed that such warp in the slicing direction can be improved by controlling the temperatures of slurry and cooling water for main roller spindles (Patent Documents 1 to 3).

Wire saw apparatus and method for manufacturing wafer


An aluminum alloy fin material for a heat exchanger in the present invention comprises an aluminum alloy having a composition containing Mn: 1.2 to 2.0%, Cu: 0.05 to 0.20%, Si: 0.5 to 1.30%, Fe: 0.05 to 0.5%, and Zn: 1.0 to 3.0% by mass and a remainder comprising Al and an unavoidable impurity, further containing one or two or more of Ti: 0.01 to 0.20%, Cr: 0.01 to 0.20% and Mg: 0.01 to 0.20% by mass as desired, and, after heating in brazing, has a tensile strength of 140 MPa or more, a proof stress of 50 MPa or more, an electrical conductivity of 42% IACS or more, an average grain diameter of 150 μm or more and less than 700 μm, and a potential of −800 mV or more and −720 mV or less.

Field of the Invention
The present invention relates to an aluminum alloy fin material excellent in strength, electrical conductivity, and brazeability used in an automobile heat exchanger, a method for manufacturing the aluminum alloy fin material for a heat exchanger, and a heat exchanger comprising the aluminum alloy fin material for a heat exchanger.
Description of the Related Art
High strength, high electrical conductivity, and brazeability after brazing are required of fin materials for automobile heat exchangers. But, all these properties are in a trade-off relationship, and therefore it is conventionally considered to be difficult to satisfy all properties. In the past, for example, Japanese Patent Laid-Open No. 2008-038166 and Japanese Patent Laid-Open No. 2001-335901 proposed fin materials excellent in strength and electrical conductivity after brazing. The fin materials proposed by Japanese Patent Laid-Open No. 2008-038166 and Japanese Patent Laid-Open No. 2001-335901 are fabricated by a manufacturing method based on a continuous casting and rolling method (referred to as "CC method") in which the slag cooling rate during casting is very fast, for example, several tens of ° C./s or more, and a thin plate is directly fabricated from a molten metal.
On the other hand, for example, in a fin material using a semicontinuous casting method (hereinafter referred to as "DC method") in which the slag cooling rate during casting is 10° C./s or less, crystallized products as fine as those in continuous casting are not obtained during casting, and the crystallized product size is 1 μm or more and is likely to coarsen. In this case, coarse crystallized products present in the material become nucleation sites for recrystallization during heating in brazing, and thus the grains are likely to refine, erosion starting from grain boundaries is likely to occur, and the brazeability is poor.
In addition, in the semicontinuous casting method, heat treatment at a high temperature around 500° C. referred to as homogenization treatment is generally applied to an ingot obtained by casting for the purpose of the homogenization of segregation, and the like. Further, soaking treatment at 500° C. or more is essential before hot rolling in order to suppress a reduction in deformation resistance and the occurrence of cracks during rolling.
But, due to the heat treatment applied to the material according to the DC method, the precipitation of the added elements dissolved in a supersaturated state during casting occurs, and when the heat treatment temperature is a high temperature of 500° C. or more, the second-phase particles are likely to coarsen, and influence on strength decrease is unavoidable.
As described above, in the DC method, the most general casting method, it is difficult to achieve high strength, high electrical conduction, and brazeability at the same time.
For such a problem, for example, Japanese Patent Laid-Open No. 2012-26008 proposes fin materials in which high strength and high electrical conductivity after brazing are achieved by defining the composition ratio of Mn, Si, and Fe and the types and dispersed state of the intermetallic compounds though the DC method is used. But, although these fin materials have an electrical conductivity as high as about 48% IACS after brazing, they have a strength of only about 130 MPa after brazing and do not have sufficient properties.
The present invention has been made with the above circumstances as a background, and it is an object of the present invention to provide an aluminum alloy fin material for a heat exchanger, having further improved strength and having brazeability improved by grain coarsening while ensuring an electrical conductivity of 42% IACS or more after brazing.

Aluminum alloy fin material for heat exchanger excellent in strength, electrical conductivity, and brazeability, method for manufacturing aluminum alloy fin material for heat exchanger, and heat exchanger comprising aluminum alloy fin material for heat exchanger