A control solution packet for calibrating a bodily fluid sampling device includes a container, a control solution pressurized within the container, and a membrane for covering and sealing the container. The control solution can be pressurized before or during calibration so as to ensure the appropriate amount of control solution is delivered to the bodily fluid sampling device. The control solution is manufactured to have a viscosity that controls delivery of the control solution to the device. The membrane is permeable by a piercing device of the bodily fluid sampling device and seals around the piercing device during calibration. In another aspect, the container is in the form of a capsule or dosing attachment that contains the control solution along with a sponge-like material.

The present invention generally relates to methods and devices for the calibration of a bodily fluid sampling device, and more specifically, but not exclusively, concerns a control solution packet for delivery of a control solution to a bodily fluid sampling device.
The need for simple methods to determine the biological and chemical constituents in bodily fluids has increased as point of care testing has gained in popularity. A common application is the self-monitoring of blood glucose concentrations by patients with diabetes. These patients frequently administer insulin or take other therapeutic actions based on the test results. As testing is generally recommended multiple times daily and may occur in any setting, an easy to use and relatively inexpensive method to accomplish this task is required. Self-administered bodily fluid sampling devices, such as glucose meter devices, are typically used to perform such testing.
Bodily fluid monitoring devices can collect a blood sample, or other bodily fluid samples, in a number of ways. For instance, in one less traumatic technique, a glucose monitoring device having a small hollow needle or lancet is used to pierce the patient's skin. The device is pressed against the skin to force a small sample of the monitored bodily fluid, such as blood or interstitial fluid, up the needle and into a testing area of the device. Once in the testing area, the fluid sample can be analyzed using any one of a number of techniques, such as using a chemically reactive test strip, measuring the sample's electrical properties or measuring the optical properties of the sample (i.e., infrared analysis). Examples of such devices are disclosed in U.S. Pat. Nos. 6,203,504, issued to Latteral et al. on Mar. 20, 2001, and 6,152,889, issued to Sopp et al. on Nov. 28, 2001, which are hereby incorporated by reference in their entirety.
With the advent of home testing, the bodily fluid sampling device and associated disposables have to be periodically tested to ensure that both are providing accurate test results. Typically, the bodily fluid sampling device is calibrated by loading a calibration strip into the device. Inaccurate calibration readings may result when the user fails to follow the proper testing procedures.
If the user feels that the disposable test strips are not providing an accurate reading, then the accuracy of the disposable test strips can be tested utilizing a control solution that has a known value. For example, a liquid control solution may be applied to a test strip which is then inserted into the meter. In order to utilize a control solution, the user is therefore required to perform a plurality of steps, any of which can lead to the introduction of errors in the control solution testing, thereby potentially leading to erroneous results. Moreover, by not calibrating the device in the manner in which it is used, problems associated with the operation of the device, such as contamination, may remain undetected.
Therefore, there is a need for methods and devices that enable a user to easily and quickly perform a control test on a bodily fluid sampling device and that reduces or eliminates any chance of error occurring during the control test.

Device and kit for calibrating bodily fluid sampling devices


A method of manufacturing a semiconductor device is provided by performing plasma processing on a substrate to be processed by using a plasma processing apparatus including a processing chamber, a lower electrode, an upper electrode, a plurality of lifter pins, a focus ring, a lifter pin for focus ring and an electrical connection mechanism.

1. Field of the Invention
The present invention relates to a method of manufacturing a semiconductor device.
2. Description of the Related Art
Conventionally, in a process of manufacturing a semiconductor device, an apparatus for performing various processes, for example, etching or film forming, on a substrate (for example, a semiconductor wafer) disposed on a holding stage in a processing chamber is used. Also, it is known that the apparatus is provided with a plurality of lifter pins that protrude from the holding stage and can move vertically and support the substrate when the substrate is held on the holding stage in the processing chamber and when the substrate is transferred from the holding stage. (for example, refer to Patent Document 1)
Also, there is known a capacity-coupled plasma processing apparatus where the holding stage in the processing chamber serves as a lower electrode and plasma is generated by applying high-frequency power between the holding stage and an upper electrode disposed to face the holding stage.
[Patent Document 1] Japanese Laid-Open Patent Publication No. 2003-293138

Method of manufacturing semiconductor device


An apparatus for dispensing medications, including: a dispensing device storing prescription information including: identification of each medication included in a first plurality of medications; a respective dosage for each medication; and a plurality of time spans, including respective points in time, for dispensing the first plurality of medications; a cassette installed in the dispensing device and including a plurality of sealed compartments, each compartment in the plurality of sealed compartments configured to store at least one respective pill for each medication in a second plurality of medications; and at least one dispensing port. The dispensing device is configured to, within each time span in the plurality of time spans and when the second plurality of medications is in compliance with the prescription information: access each compartment via the at least one dispensing port; and extract every at least one first pill from each compartment.

Medication adherence, including patient adherence to medication regimens is an important aspect of any system providing medical services. Specifically, lack of medical adherence has a negative effect on outcomes and increases costs associated with providing medical services. For example, research shows that:                1. Approximately 25% of patients prescribed medications for a new illness fail to fill their initial prescription;        2. Approximately half of patients taking maintenance medications for a chronic disease stop taking their medications within the first year; and,        3. The estimated cost of unnecessary medical treatment attributable to medication non-adherence is $290B annually.
Several solutions have been proposed to address the problem of medical adherence with respect to medication regimens. One solution path is to provide more coordinated delivery of medications to the patient, especially since many people have prescriptions for multiple medications, each requiring different dosage regimens. For example, it is known for a pharmacy to deliver multiple medications by mail in blister-pack format. Each blister in the package contains all medications to be taken at one time. There may be two to four blisters per day. Each package will typically contain a week's worth of a patient's medications. The patient is required to burst the appropriate blister at the appropriate time, remove the pills, and take them. However, there are known problems with this approach. For example, the medication administration is 'open loop', that is, there is no way for a health care provider, pharmacy, or other interested party to determine of if the pills were removed from a blister at the appropriate time and taken by the patient at the appropriate time. The blister pack must be amenable to handling and shipping, for example, relatively inexpensive, light weight, and easy filled. However, such a configuration may not be an optimal configuration for a patient to use.
It is also is known to use home-based medication dispensers. For example, the patient or a designated caregiver is required to periodically pre-load the appropriate pills into provided cups, according to each pill's dosage regimen. The pre-loaded cups are then placed into the dispenser. The dispenser then releases each cup's contents at a designated time. The dispenser, being an active device, can alert the patient via audible alarm that medication is due to be taken. The dispenser can also communicate via telephone line with a remote caregiver or monitoring service. However, there are problems with the dispensers. The patient and/or caregiver must be responsible to fulfill multiple prescriptions, which may be out of synch with each other. Any pill packing errors by the patient or caregiver will not be detected by the dispenser. Any potential medication interactions will not be flagged since different prescriptions are not coordinated.

Apparatus and system with pre-loaded cassette for dispensing multiple medications and methods therefore


A dispensing container comprising a molded plastic bottle and a cap. The molded plastic bottle has a top closed end, a cylindrical side wall, and a shoulder section at a dispensing end of the side wall. The shoulder has one or more indented portions which form the positioning lugs in the shoulder section. The plastic bottle also has a neck with external threads defining a mouth. The cap is selectively connected to the neck. The cap has an internally threaded cuff for interconnection with the external threads of the neck. The cap also has structure for dispensing of an enclosed material which is near the mouth. The cap is cup-shaped with a face and a cylindrical wall extending from the face to define an interior of the cap. When the cap is connected to the neck, the indented portions which form the positioning lugs in the shoulder are hidden from view within the interior of the cap.

This invention relates to a container and, more particularly, to a dispensing container for selectively dispensing flowable material. The container utilizes lugs which properly orient the container for printing on the container. During use, the lugs are hidden from view in order to add to the overall appearance of the container.
Dispensing containers are known for holding flowable materials, such as bath products, shampoos, conditioners and soaps. Such containers typically have a base for supporting the container and an opening at the opposite end of the base for dispensing product from an inner cavity of the container. A cap usually secures the container during periods of non-use.
In most containers, flowable material gravitates toward the base, which is at the opposite end of the opening of the container. In such containers, when the container is nearly empty, it is difficult to dispense material which is seated at the base opposite the opening. A container which is designed so that the dispensing opening is at the base of the container where the container is supported is useful, because the content, such as shampoo or soap, may be dispensed more readily.
It is necessary to label dispensing containers with information regarding the type of materials contained within. Often, identification information and trademarks are placed on the front of the container, while instructions for use and ingredient and manufacturing information are placed on the back of the container. In order for automated printing machines to determine which side of the container is the front and which side is the back, lugs or indented areas are formed on the outside of the containers. Printing equipment grasps the container by these lugs and orients the container before printing. In this way, printing machines properly orient the container before printing on it allowing rapid and effective printing.
The printing lugs typically must be formed on the outside of the containers where they are readily accessible to automated printing devices. In the past, the lugs have been formed in the closed bottom end of the container. Since the container rests on the bottom, the lugs are normally not visible and do not detract from the appearance of the container. For an improved inverted container that is designed so that the dispensing opening is at the base of the container and the closed end is at the top of the container, however, the lugs are quite visible and detract from the otherwise smooth appearance of the container.
A design wherein an inverted container design with printing lugs could be utilized, while at the same time disguising the lugs from view, would be a useful improvement to the art.

Dispensing container with concealed lugs


A stacked integrated circuit package system is provided forming a first stack layer having a first integrated circuit die on a first substrate, forming a second stack layer having a second integrated circuit die on a second substrate, and mechanically and electrically connecting a spacer layer having a first passive component between the second stack layer and the first stack layer.

Modern consumer electronics, such as smart phones, personal digital assistants, and location based services devices, as well as enterprise electronics, such as servers and storage arrays, are packing more integrated circuits into an ever shrinking physical space with expectations for decreasing cost. Every new generation of integrated circuits with increased operating frequency, performance and the higher level of large scale integration have underscored the need for back mixed-signal solutions. Numerous technologies have been developed to meet these requirements. Some of the research and development strategies focus on new technologies while others focus on improving the mature package technologies.
The continued emphasis in the semiconductor technology is to create improved performance semiconductor devices at competitive prices. This emphasis over the years has resulted in extreme miniaturization of semiconductor devices, made possible by continued advances of semiconductor processes and materials in combination with new and sophisticated device designs. Numerous integrated circuit designs are aimed for mixed-signal designs by incorporating analog functions. One of the major challenges in the creation of analog processing circuitry (using digital processing procedures and equipment) is that a number of the components that are used for analog circuitry are large in size and are therefore not readily integrated into integrated circuits. The main components that offer a challenge in this respect are capacitors, resistors, and inductors, since these components are, for typical analog processing circuits, are of considerable size.
In response to the demands for improved package performance and analog circuitry integration, other approaches pack discrete analog devices into the integrated circuit package. This mixed-signal integrated circuit technology or system in package (SIP) is another approach to reduce the space required for the integrated circuits content. Stacking integrated circuits is another approach to pack more integrated circuit content while minimizing the dimensions of the package. But these packaging types have some problems requiring additional process steps and physical space.
Thus, a need still remains for the stacked integrated circuit package system providing low cost manufacturing as well as improved performance. In view of the ever-increasing need to save costs and improve efficiencies, it is more and more critical that answers be found to these problems.
Solutions to these problems have been long sought but prior developments have not taught or suggested any solutions and, thus, solutions to these problems have long eluded those skilled in the art.

Stacked integrated circuits package system with passive components


A source-follower-type analogue buffer with an active load, a new compensating operation and a display with the source-follower-type analogue buffers are developed to reduce an error voltage which is the difference between an input voltage and an output voltage of the analogue buffer. The source-follower type analogue buffer can also minimize the variation from both the charging time and the device characteristics and maximize the range of the input voltage.

1. Field of Invention
The present invention relates to an analogue buffer. More particularly, the present invention relates to a source-follow type analogue buffer using poly-Si TFTs for an active matrix display.
2. Description of Related Art
Low temperature poly-Si (LTPS) thin film transistors (TFTs) allow for peripheral integration of driving circuits with a pixel panel of an active matrix display due to a high current driving capability. However, it is well known that the integration of whole driving circuit with poly-Si TFTs is very difficult due to the rather poor characteristics and non-uniformity of poly-Si TFTs compared with single crystal Si large scale integrated circuits (LSIs). Among the driving circuits using poly-Si TFTs, analogue buffers are indispensable to drive the load capacitance of the data bus in the panel. Source follower is considered an excellent candidate for the analogue buffer circuit for the "System on Panel (SOP)" application because of its simplicity and low power dissipation.
A typical source follower 100 using a LTPS TFT in an active matrix display is shown in FIG. 1A. The gate of the TFT 110 in the source follower 100 coupled to a input voltage Vin and the drain of the TFT 110 is coupled to an operation voltage Vdd. The source of the TFT 110 is coupled to ground through a load capacitor (Cload). The waveform of output voltage Vout of the source follower 100 is depicted in FIG. 1B. It is observed that the final output voltage Vout is not kept constant, but exceeds the value of Vin-Vth expected in principle, where the Vth is a threshold voltage of the TFT 110. It is ascribed to the sub-threshold current. As shown in FIG. 1C, which depicts drain current(ID) and the voltage between gate and source of the TFT 110 (VGS) curves, the sub-threshold swing of LTPS TFTs is about 0.3V/dec which is much larger than that of a metal-oxide-semiconductor field effect transistor (MOSFET) (0.06V/dec). Consequently, the typical source follower 100, as an analogue buffer for active matrix display, will be sensitive to the charging time for various product specifications such as frame rates for the active matrix displays and can not have a constant output voltage.
A further conventional source follower using a poly-Si TFT in a liquid crystal display is shown in FIG. 2A. The source follower 200 includes TFTs M1 and M2, a capacitor C1 and a plurality of switches S1˜S4. Node N1, coupled to an input voltage Vin through the switch S1, is connected to node N2 under control of the switch S2 and also connected to a gate of the TFT M1. Node N2 is connected to node N3 under control of the switch S3 and is further connected to node N4. Node N3 is connected to one terminal of the capacitor C1 and a gate terminal of the TFT M2. Node N4 is connected to a data line under control of the switch S4. The voltage level of the node N4 is an output voltage Vout of the source follower 200. A source of the TFT M1 is connected to the ground and the drain of the TFT M1 is connected to node N4, the output terminal. The TFT M2 is a PMOS transistor and its drain is connected to an operation voltage Vdd and its source is connected to the node N4.
Refer to FIG. 2B, which shows a relationship between the input voltage Vin and the output voltage Vout as denoted by the reference number 210. In a perfect case for the source follower, the output voltage Vout should be the same as the input voltage Vin. However, an error voltage which is the difference between the input voltage Vin and the output voltage Vout exists in a practical case. As denoted by the reference number 220, it shows that when the input voltage Vin is increased, the output voltage Vout is not the same as the input voltage Vin and the error voltage is floating from about 80 mV to about 175 mV if the input Vin is changed from 2.5V to 8V. If an output voltage of the source follower is large for driving in the display, for example, 10V, the error voltage may not cause serious influence on the driving operation. However, if the output voltage of the source follower is small for driving in the display voltage, for example, 0.5V˜2V, the error voltage may be larger than one gray scale voltage, which will cause serious influence on the display quality.

This patent is subject to a terminal disclaimer.

Source-follower type analogue buffer, compensating operation method thereof, and display therewith


A bidirectional slide lock includes a first clip and a second clip that are slid and locked together. The first clip has a longitudinal axis, a pair of pawls, and a pair of flanges. The second clip has a longitudinal axis, a pair of pawl stops, and a pair of clip flanges. Both pair of flanges retentively engaging one another to hold the clips together to prevent movement away from one another. The pawls engage the pawl stops to hold clips against longitudinal movement. The bidirectional slide lock also has springs biasing the pawls toward the second clip so as to retain pawls in retentive engagement with the pawl stops. The method of use includes moving the first and second clips longitudinally relative to one another so that the flanges move into retentive engagement and cause each of the pawl ends to engage one of the pawl stops.

The present invention relates to a bidirectional slide lock and method of using same.
Parts and clips are used for surface mounting handles and decorative trim. The typical fastener for mounting handles and decorative trim locks in only one direction. Therefore, at least two locks are required to mount a handle or a piece of decorative trim.
On occasion, the need arises to mount a handle with only one device centrally located. These occasions may arise when a handle cannot accommodate two fasteners because of size limitations. In addition, a handle or decorative trim may be more easily reversible if it has one centrally located symmetrical fastener as opposed to two fasteners located at the extremities of the handle. Furthermore, a user may wish to centrally locate a fastener to facilitate a variety of different designs that would be unable to be accommodated by two fasteners located at the extremities.
Accordingly, there is a need for a single fastener that can individually hold a handle or a piece of decorative trim to a refrigerator or other body. Therefore a primary objective of the present invention is the provision of a fastener than can be slid into place and locked in two directions so that it cannot be removed without the use of tools.
A further objective of the present invention is the provision of a fastener which can be reversed from an upright position to an upside down position.
A further objective of the present invention is the provision of a fastener that does not require more than a centrally located screw to fasten the handle in place.
A still further objective of the present invention is the ability to easily remove the handle from the door using a tool.
A further objective of the present invention is the provision of a fastener which is symmetrical and therefore easily reversible.
A further objective of the present invention is the provision of a fastener which is relatively inexpensive to manufacture, efficient in use, and simple in operation.

Bidirectional slide lock and method of using same


When conducting a color-shift-correcting mode using a registration mark formed by the image forming section on an image carrier, the image detecting section outputs the image detection signal representing the line width of the registration mark and the control section calculates the line width of the registration mark from the image detection signal. The control section compares a line width of the registration mark with a predetermined reference value of the line width to discriminate between abnormality and normality. If normality, the control section continues the color-shift-correcting mode and if abnormality the control section conducts the image forming system restoration mode after stopping the execution of the color-shift-correcting mode. Therefore, even in the case where a white spot is generated for some reasons on the registration mark, the color-shift-correcting mode can be conducted on the normal registration mark with the help of the image forming system restoration mode.

1. Field of the Invention
The present invention relates to an image forming apparatus which is suitably applied to a color printer and a color copying machine both of a tandem type each having a photoconductor drum and further a color-shift-correcting mode and a color multifunctional machine composed of the aforesaid printer or the copying machine, and to an image forming method.
2. Description of Related Art
A color printer and a color copying machine both of a tandem type and a color multifunctional machine composed of the aforesaid printer or the copying machine have become popular in recent years. In each of these color image forming apparatus, there are provided a laser writing unit, a developing unit, a photoconductor drum, an intermediate transfer belt and a fixing unit, for each of yellow (Y), magenta (M), cyan (C) and black (BK) colors.
For example, the laser writing unit for Y color is arranged so that it draws an electrostatic latent image on the photoconductor drum based on information for color image forming. In the developing unit, toner for Y color is stuck to the electrostatic latent image drawn on the photoconductor drum to form a color toner image. The toner image is transferred onto the intermediate transfer belt from the photoconductor drum. The same process as in the foregoing is carried out for each of M, C and BK colors. The color toner image transferred onto the intermediate transfer belt is further transferred onto a sheet of paper, and then is fixed by the fixing unit.
In the image forming apparatus of this kind, it is essential, for maintaining the optimum quality of color image forming, to correct an image forming section so that color-shift may not be caused among yellow (Y), magenta (M), cyan (C) and black (BK) which reproduce R color, G color and B color of images in a document (hereinafter referred to as color-shift-correcting mode). The color-shift is generally caused by the tolerance for assembling of the writing unit and the photoconductor drum. It is considered that changes in temperatures in the open air or changes of temperatures in an apparatus resulted from the continuous use of the apparatus cause supporting portions for the laser writing unit and the photoconductor drum to be expanded or contracted to generate an aging positional shift thereof resulting in the color-shift.
With respect to the color-shift-correcting mode, a registration mark formed on the intermediate transfer belt or on a paper transfer belt is detected by a detecting means for detecting color-shift (hereinafter referred to a registration mark sensor) such as a reflection type sensor, and each amount of shifting for main scanning, sub-scanning, lateral magnification and skew for other colors is calculated for those of the reference color, whereby, image forming timing is adjusted, to correct the color-shift.
Concerning the color image forming apparatus of this kind, Patent Document 1 discloses an image forming apparatus, a method of controlling the apparatus and a memory medium. This image forming apparatus is provided with a pattern forming means, a pattern detecting means, a pulse width calculating means, a discriminating means and with a calculating means. In the course of calculating an amount of color-shift, the pattern forming means forms a color-shift detecting pattern on an endless-shaped belt through the photoconductor drum.
The pattern detecting means detects the color-shift detecting pattern formed on the endless-shaped belt, and outputs pattern detection signals to the pulse width calculating means. The pulse width calculating means calculates a pulse width by detecting rising time and falling of the pattern detection signals. The discriminating means compares a pulse width outputted from the pulse width calculating means with a pulse width threshold value established in advance, to discriminate the color-shift detecting pattern from a scratch on the belt. The calculating means calculates an amount of shift of each detected color for the reference color, based on the pattern detection data discriminated by the discriminating means from the color-shift detecting pattern.
If the image forming apparatus is constructed as in the foregoing, the color-shift detecting pattern can be discriminated precisely from a scratch on a belt, whereby, an amount of color-shift can be calculated by using only pattern detection data relating to the color-shift detecting pattern.
Further, Patent Document 2 discloses a color image recording method and an apparatus for the same. In this color image recording apparatus, electrostatic latent images for Y, M and C colors are formed on the photoconductor drum in the course of adjusting color balance, then, an electrostatic latent image for each color is developed by a developing unit for each color, and toner images each being of each color of Y, M and C colors are superposed each other on the photoconductor drum, thus, the superposed color toner image is detected by a toner concentration sensor.
A color balancing means inputs a toner concentration detection value obtained by the toner concentration sensor and an image density reference value established in advance to compare them to discriminate between abnormality and normality of image density. For toner of a color discriminated to be abnormal by the color balancing means, electrostatic latent images for the color are formed forcibly on the photoconductor drum, and the electrostatic latent images are developed by the developer for the color so that the toner for the color may be consumed.
If the color image forming apparatus is constructed as in the foregoing, a color image having excellent color balance can be reproduced on an appropriated image density, even in the case where image density is lowered for developing agents of each color, in spite of the toner concentration that is substantially the prescribed value.
(Patent Document 1) TOKKAI 2002-023444 (page 4, FIG. 1)
(Patent Document 2) TOKKAIHEI 05-323780 (page 5, FIG. 1)
A color image forming apparatus in the conventional example has the following problems.
i. When a white spot phenomenon is generated for some reasons on a registration mark, when practicing a color-shift-correcting mode in a color image forming apparatus shown in Patent Document 1 or in a color image recording apparatus shown in Patent Document 2, there is a risk that an amount of color-shift cannot be calculated precisely. The white spot phenomenon in this case is as follows; toner in a trace amount remaining on, and paper dust fine particles sticking unwontedly to, a photoconductor drum in the preceding cycle of charging, exposure, developing and cleaning, are not removed, and these remaining toner and paper dust fine particles prevent normal exposure in the following cycle of charging, exposure, developing and cleaning, resulting in the phenomenon that a part of the registration mark is developed to be white.
If this white spot portion of the registration mark is detected by the registration mark sensor, the mark is detected to be thinner than a width of the reference line in the design of the mark, resulting in a problem that an error is caused in a calculated value of a distance between marks, and in a risk that a precise amount of color-shift cannot be calculated.
ii. If the white spot portion is intermingled in the registration mark, the pattern detection data related to the registration mark having thereon the white spot portion are judged accidentally to be a crack on a belt, in Patent Document 1, and its data are excluded. Thus, the number of data is reduced by an amount corresponding to the excluded data, resulting in lowered reliability such as an average value.
iii. In accordance with Patent Document 2, in the course of adjusting color balance, electrostatic latent images for Y, M and C colors are formed on a photoconductor drum, then, an electrostatic latent image for each color is developed by a developing unit for each color, and toner images each being of each color of Y, M and C colors are superposed each other on the photoconductor drum, and thereby, the image density of the superposed color toner image is detected. Therefore, even when the color balance adjusting technology of this kind is applied on the color-shift correcting mode as it is, it is impossible to calculate a distance between respective colors for Y, M, C and BK. Further, on the color-shift-correcting mode, there is even a risk that toner of each color for respective colors of Y, M, C and BK are used wastefully, because toner for respective colors for Y, M, C and BK are not superposed.
In view of the foregoing, the present invention was attained.

Image forming apparatus and method of image forming

Konica Minolta Business Technologies, Inc.


The animal anchor disclosed has a substantially horizontally extending body member which includes a central hub portion, an annular outer portion surrounding the hub portion, and spoke portions interconnecting the central hub and annular outer portions. The hub has a swivel hook for connecting a leash or chain. A majority of the weight of the body member is disposed in the annular outer portions making the anchor difficult to tip.

This invention relates to an animal anchor, and more particularly to an anchor which serves as a tie-off for dogs and other small animals.
There has long been a need for a reliable and convenient tie-off for dogs and other small animals. Conventional tie-offs require the fastening of the tie-off to the ground using a stake which is driven or screwed into the ground. Devices of this kind are found in the prior art U.S. Pat. No. 2,087,176; No. 2,435,081; and No. 2,525,890. These three patented devices have a swivel connection at the top so the animal can move in a circle without tangling, but all of them feature a stake which is driven into the ground in order to anchor the device.
Other prior art methods of animal tie-offs include cables or ropes around trees or posts, which may result in tangling, or tie-offs which are moveable along a cable strung between trees or posts.
It is an object of this invention to provide an animal anchor which is a moveable, self-contained unit that is free from tangling, does not require a driven stake or screw anchor and is attractive and virtually indestructible, providing years of use.
It is another object of this invention to provide an animal anchor which is very easy on, i.e., almost totally non-destructive of, the grass and may be easily moved from one location to another so that there is less tendency to wear a track in the grass.


A new cultivar of Cotinus obovatus, ‘Northstar’, characterized by its cold hardiness in U.S.D.A. Zone 3, its heavy bloom of pink inflorescences in mid summer, its red and orange fall foliage color, its drought tolerance once established, and its adaptability for growth in poor soils, a wide range of soil pH, and partial sun.

The present invention relates to a new and distinct cultivar of American smoketree, botanically known as Cotinus obovatus 'Northstar' and will be referred to hereafter by its cultivar name, 'Northstar'.
The Inventor discovered 'Northstar' as a naturally occurring whole plant mutation of Cotinus obovatus in summer of 1996 in a residential garden in Star Lake, Ottertail County, Minn. The parentage of 'Northstar' is unknown as it is presumed to be a seedling of unnamed selections of Cotinus obovatus.
Asexual reproduction of the new cultivar was first accomplished by softwood cuttings in Battle Lake, Minn. in 1997. The characteristics of this cultivar have been determined by cuttings and in vitro propagation to be stable and are reproduced true to type in successive generations.


In a method for implementation of a magnetic resonance examination, and a magnetic resonance apparatus, and an array for acquisition of magnetic resonance signals, and a magnetic resonance signal at a magnetic resonance frequency are acquired from an examination region with an array of frequency conversion units after an RF excitation and are radiated as frequency-converted signals. The resulting signal field is acquired by a number of reception antennas of a second antenna array, which are arranged at different spatial positions and thus allow a spatial resolution of the frequency-converted signals. The acquired acquisition signals are used for image reconstruction.

1. Field of the Invention
The present invention concerns a method for implementation of a magnetic resonance examination (MR examination) with an MR apparatus, of the type wherein MR signals with an MR frequency are acquired from an examination region with an antenna array after a radio-frequency excitation (RF excitation). The invention furthermore concerns a magnetic resonance apparatus and an antenna array for acquisition of magnetic resonance signals.
2. Description of the Prior Art
MR examinations enable spatially-resolved imaging of an examination region. For reasons of the achievable signal-to-noise ratio, in MR apparatuses it is advantageous to use local or surface coils for acquisition of MR signals from only a limited small region of the subject. Such coils are normally connected with an evaluation device via cables. The cables and the necessary plug contacts represent a limitation to the user-friendliness and the reliability of the surface coil and the corresponding signal transmission. It is known to transfer magnetic resonance signals from the coil arrangement to the evaluation unit via an optical cable.
It is also known to convert an acquired magnetic resonance signal into another frequency and to wirelessly transmit it to the evaluation device. Such a linear frequency conversion with transistor or diode mixers is known, for example, from DE 41 26 537 A1. The receiver for the frequency-converted signal is located only a few meters from the site of the evaluation unit. If an array of coils that supply MR signals independently of one another is used for the acquisition of MR signals from different body segments, these MR signals are then converted into different frequencies. In the frequency conversion, the MR signal is mixed with a mixer signal having a constant frequency in a mixing stage.
Furthermore, a linear frequency conversion with parametric amplification is known from DE 102 19 749 A1. In the transmission method based thereupon, an MR signal is acquired by an MR reception antenna at an MR frequency and is supplied to a non-linear reactance. Auxiliary (supplementary) energy is supplied by an auxiliary antenna with at least one auxiliary frequency. One part of the auxiliary energy is acquired by the auxiliary reception antenna and supplied with the auxiliary frequency to the non-linear reactance and there is mixed together with the MR signal to form a mix signal with a mix frequency. The mix signal is supplied to a mix signal transmission antenna and is emitted thereby. It is subsequently acquired by a mix signal reception antenna and supplied to the evaluation device.
When an additive signal at an additive frequency, that is equal to the difference of the auxiliary frequency and the magnetic resonance frequency is generated by the non-linear reactance and the additive signal is supplied to an absorption circuit resonant at the additive frequency, a higher radiated energy results at the mix frequency. The absorption circuit is connected in parallel with, for example, the non-linear reactance. The energy emitted by the mix signal transmission antenna becomes greater the further that the auxiliary frequency deviates from the MR frequency. Such an energy supply enables a locally-acquired MR signal to be wirelessly transmitted to a control and evaluation device in a simple manner. A transfer of MR signals that are acquired by a number of coils of an array is also possible with the method according to DE 102 19 749 A1. For this purpose, the auxiliary frequencies and the mix frequencies resulting from the auxiliary frequencies and the MR signals are selected such that the individual auxiliary and mix signal frequencies do not mutually influence one another. It is thereby even possible to emit an auxiliary signal via a single broadband auxiliary transmission antenna, with the auxiliary signal containing a number of auxiliary frequencies that differ from one another. The auxiliary signal can be acquired by a single broadband auxiliary reception antenna and be supplied to the mixer arrangements via input filter circuits.
A transmission method for an analog magnetic resonance signal by means of frequency modulation is known from DE 101 48 462 C1. Method for digital transmission with time, frequency or code multiplexing are known from telecommunications.

Method, examination apparatus and antenna array for magnetic resonance data acquisition


A wafer is transported on a blade of a robot along a path through a port into a module of semiconductor manufacturing equipment. The port has a transverse axis intersecting the path. Dynamic alignment uses two through-beam sensors positioned along the transverse axis to determine the position of the center of the wafer with respect to the center of the blade as the wafer is transported. Positioning of the sensors according to latency characteristics of the sensors assures that the moving wafer will break or make a beam of a first of the sensors and that the first sensor will generate a first transition signal before the moving wafer will break or make a beam of a second of the sensors and before the second sensor generates a second transition signal. The dynamic alignment may be performed with respect to wafers having different sizes.

1. Field of the Invention
The present invention relates generally to transferring wafers among modules of semiconductor processing equipment, and more particularly to dynamic alignment of each wafer with a support blade that carries the wafer, wherein dynamic alignment apparatus and methods determine the location of a center of the wafer with respect to a center of the blade as the blade moves the wafer through a slot from one module to another module.
2. Description of the Related Art
In the manufacture of semiconductor devices, process chambers are interfaced to permit transfer of wafers or substrates, for example, between the interfaced chambers. Such transfer is via transport modules that move the wafers, for example, through slots or ports that are provided in the adjacent walls of the interfaced chambers. Transport modules are generally used in conjunction with a variety of wafer processing modules, which may include semiconductor etching systems, material deposition systems, and flat panel display etching systems. Due to the growing demands for cleanliness and high processing precision, there has been a growing need to reduce the amount of human interaction during and between processing steps. This need has been partially met with the implementation of vacuum transport modules which operate as an intermediate wafer handling apparatus (typically maintained at a reduced pressure, e.g., vacuum conditions). By way of example, a vacuum transport module may be physically located between one or more clean room storage facilities where wafers are stored, and multiple wafer processing modules where the wafers are actually processed, e.g., etched or have deposition performed thereon. In this manner, when a wafer is required for processing, a robot arm located within the transport module may be employed to retrieve a selected wafer from storage and place it into one of the multiple processing modules.
As is well known to those skilled in the art, the arrangement of transport modules to xe2x80x9ctransportxe2x80x9d wafers among multiple storage facilities and processing modules is frequently referred to as a xe2x80x9ccluster tool architecturexe2x80x9d system. FIG. 1 depicts a typical semiconductor process cluster architecture 100 illustrating the various chambers that interface with a vacuum transport module 106. Vacuum transport module 106 is shown coupled to three processing modules 108a-108c which may be individually optimized to perform various fabrication processes. By way of example, processing modules 108a-108c may be implemented to perform transformer coupled plasma (TCP) substrate etching, layer depositions, and/or sputtering.
Connected to vacuum transport module 106 is a load lock 104 that may be implemented to introduce wafers into vacuum transport module 106. Load lock 104 may be coupled to a clean room 102 where wafers are stored. In addition to being a retrieving and serving mechanism, load lock 104 also serves as a pressure-varying interface between vacuum transport module 106 and clean room 102. Therefore, vacuum transport module 106 may be kept at a constant pressure (e.g., vacuum), while clean room 102 is kept at atmospheric pressure.
Consistent with the growing demands for cleanliness and high processing precision, the amount of human interaction during and between processing steps has been reduced by the use of robots for wafer transfer. Such transfer may be from the clean room 102 to the load lock 104, or from the load lock 104 to the vacuum transport module 106, or from the vacuum transport module 106 to a processing module 108a, for example. While such robots substantially reduce the amount of human contact with each wafer, problems have been experienced in the use of robots for wafer transfer. For example, in a clean room a blade of a robot may be used to pick a wafer from a cassette and place it on fingers provided in the load lock 104. However, the center of the wafer may not be accurately positioned relative to the fingers. As a result, when the blade of the robot of the vacuum transport module 106 picks the wafer from the fingers of the load lock 104, the center of the wafer may not be properly located, or aligned, relative to the center of the blade. This improper wafer center-blade center alignment, also referred to as xe2x80x9cwafer-blade misalignmentxe2x80x9d or simply xe2x80x9cwafer misalignment,xe2x80x9d continues as the robot performs an xe2x80x9cextendxe2x80x9d operation, by which the blade (and the wafer carried by the blade) are moved through a slot in the processing module and by which the wafer is placed on pins in the processing module 108a, for example.
Even if there was proper original wafer-blade alignment when the wafer was initially placed in the exemplary processing module 108a, and even though the wafer may have thus been properly aligned during processing in the exemplary processing module 108a, the proper alignment may be interfered with. For example, electrostatic chucks generally used in the exemplary processing modules 108a may have a residual electrostatic field that is not completely discharged after completion of the processing. In this situation, the processed wafer may suddenly become detached from the chuck. As a result, the wafer may become improperly positioned with respect to the robot blade that picks the processed wafer off the chuck. Thus, when the blade of the robot of the vacuum transport module 106 picks the processed wafer off the chuck, the center of the wafer may not be properly located, or aligned, relative to the center of the blade. This wafer misalignment may continue as the robot performs a xe2x80x9cretractxe2x80x9d operation, by which the blade (and the wafer carried by the blade) are moved through the slot in the processing module 108a. Such wafer misalignment may also continue during a subsequent extend operation by which the wafer is placed in another one of the processing modules 108b, or in the load lock 104.
Wafer misalignment is a source of wafer processing errors, and is of course to be avoided. It is also clear that the amount of time the robots take to transfer a wafer among the modules (the xe2x80x9cwafer transfer timexe2x80x9d) is an amount of time that is not available for performing processing on the wafer, i.e., the wafer transport time is wasted time. Thus, there is an unfilled need to both monitor the amount of such wafer misalignment, and to perform such monitoring without greatly increasing the wafer transfer time.
However, a problem complicating such monitoring of wafer misalignment is that a wafer may be transferred from (or to) the one vacuum transport module 106 to (or from) as many as six, for example, processing modules, e.g., 108a. In the past, attempts to determine whether a wafer is properly aligned on the blade of a robot have included use of many sensors between adjacent modules. Sensors on opposite sides of a wafer transfer path have been located symmetrically with respect to the wafer transfer path. The symmetrically opposed sensors produce simultaneous output signals, and one data processor has to be provided for each such sensor. The combination of these factors (i.e., the possible use of six processing modules plus the vacuum transport module, the use of many symmetrically located opposing sensors per module, and the use of one data processor per sensor) result in increased complexity and the need for many costly processors for a cluster tool architecture. In view of the need to provide cluster tool architectures that are more cost-efficient, the incorporation of separate data processors for each sensor can make a system prohibitively expensive.
Another aspect of providing cluster tool architectures that are more cost-efficient relates to the cost of machining the modules and the load locks to provide apertures in which sensors, such as through-beam sensors, may be received. As the accuracy of such machining is increased to more accurately locate the sensors with respect to the robots, for example, there are increased costs of such precision machining. What is needed is a way of requiring less accuracy in machining the apertures for the sensors without sacrificing the accuracy of detections made using the sensors.
The use of such through-beam sensors also presents problems in the design of apparatus for monitoring wafer misalignment. For example, when a wafer moves through a light beam of such a through-beam sensor and breaks the beam, it takes a period of time (latency period) for the sensor to output a pulse indicative of the breaking of the beam. Since the wafer is moving relative to the sensor, and when the purpose of the sensor is to determine the location of the wafer, by the time the output pulse is generated (at the end of the latency period) the wafer will have moved from the location of the wafer when the beam was broken. The latency period is a source of errors in the use of the through-beam sensors. What is also needed then is a way of reducing the errors caused by the latency period of through-beam sensors.
In view of the foregoing, there is a need for methods and apparatus for wafer alignment that operate while the wafer is being transported without increasing the wafer transport time (e.g., without reducing the rate of transfer of the wafer among the modules or load locks). Such method and apparatus should not only reduce the number of data processors per sensor, but reduce the total number of data processors used for determination of wafer misalignment in an entire cluster tool architecture. Such method and apparatus desirably also require less accuracy in machining the apertures for the sensors, without sacrificing the accuracy of detections made using the sensors. Another aspect of the desired method and apparatus is to eliminate the latency period as a source of errors in using through-beam sensors to make wafer alignment determinations.
Broadly speaking, the present invention fills these needs by providing dynamic alignment of each wafer with a support blade that carries the wafer, wherein dynamic alignment apparatus and methods determine the location of a center of the wafer with respect to a center of the blade as the blade moves the wafer through a module port or slot from one module to another module. By determining the offset of the wafer relative to the blade, the robot can use this determined offset to enable precision alignment and placement in process chambers of the cluster tool architecture.
One aspect of the present invention is a method and apparatus for determining wafer misalignment that provides sensors operative while the wafer is being transported and without increasing the wafer transport time, that is, without reducing the rate of transfer of the wafer among the modules or load locks.
Another aspect of the present invention is the use of a calibration wafer of known physical characteristics to calibrate a blade, a robot, and newly machined apertures which receive wafer sensors. The calibration method and apparatus of the invention require less accuracy in machining the apertures for the sensors, without sacrificing the accuracy of wafer alignment determinations made using the sensors, because the calibration accurately determines the location of each sensor after the sensor has been inserted into the aperture. A calibration method uses the calibration wafer to calibrate a system for generating data indicating the position of a center of a wafer relative to a center of a blade of a wafer transport robot, wherein the wafer is provided with at least one edge.
The method starts by mounting the wafer transport robot adjacent to semiconductor manufacturing equipment having a port so that the robot moves the wafer through the port along a wafer transport axis. At least two sensors are spaced along the port on an axis that is transverse to the wafer transport axis. The sensors are tripped by the presence of the wafer edge and by the absence of the wafer following the presence of the wafer edge. Each time one of the sensors is tripped the tripped one of the sensors is effective to generate a separate data item. A calibration wafer of known dimensions is secured to the blade in a position centered with respect to the center of the blade. Data is captured as to the position of the sensors relative to the robot by causing the robot to move the calibration wafer through the port and past the sensors. The sensors generate the separate data items, each of the separate data items indicating the location of one of the edges of the calibration wafer as the calibration wafer moves past the sensors. An accurate determination is made as to the location of the sensor with respect to the robot by using the location of the robot corresponding to each separate data item, and using data as to the radius of the calibration wafer, and using the separate data items.
In another aspect of the present invention, only one data processor is needed regardless of how many sensors are provided per module and regardless of which of many modules is receiving or supplying a wafer. The method and apparatus of the present invention not only reduce the number of data processors per sensor, but reduce the total number of data processors used for determination of wafer misalignment in an entire cluster tool architecture. This advantage results in part from accounting for the latency period of through-beam sensors when positioning such sensors relative to the path of the wafer. In detail, the need for only one processor results from positioning such sensors along a transverse axis of a module slot in a non-symmetrical manner so as to assure that a first such sensor generates a transition signal and in response to the transition signal the robot position information related to that signal is stored before a second such sensor generates a next transition signal.
An apparatus having these characteristics is provided for generating data indicating the position of a center of the wafer relative to the center of a blade of a wafer transport robot as the blade moves the wafer at a controlled rate of transfer along a path that extends through a plane defined by a facet of a module of semiconductor manufacturing equipment. Initially, a sensor positioning axis extends in the plane and intersects the path. A first sensor is mounted in the plane, on the positioning axis, and spaced from the path by a first distance so as to sense the wafer moving in the path. The first sensor has a latency period between a first time of sensing the wafer and a later time at which robot position data is stored in response to a transition signal output by the first sensor to indicate the sensing of the wafer.
A second sensor is mounted in the plane, on the positioning axis, and spaced from the path by a second distance so as to sense the wafer moving in the path. The second distance is different from the first distance by an amount such that at the given rate the time between a first moment at which the wafer is sensed by the first sensor and a second moment at which the wafer is sensed by the second sensor is not less than the latency period.
An apparatus having these characteristics is also provided for generating data indicating the position of a wafer relative to a blade of a wafer transport robot as the blade continuously moves the wafer along a path that extends through a plane defined by one of a plurality of facets of a plurality of modules of semiconductor manufacturing equipment. A sensor positioning axis extends in each of the planes and intersects the respective path. A first sensor is mounted in each of the planes, on the respective positioning axis, and spaced from the respective path by a first distance so as to sense the wafer moving in the respective path. The first sensor has a first latency period between a first time at which the first sensor senses the wafer in the respective path and a later time at which robot position data is stored in response to a first transition signal output by the first sensor to indicate a first sensing of the wafer in the respective path.
A second sensor is mounted in each of the planes, on the respective positioning axis, and spaced from the respective path by a second distance so as to sense the wafer moving in the respective path. The second sensor outputs a second transition signal indicating a second sensing of the wafer in the respective path. For each second sensor with respect to each first sensor, the second distance is different from the first distance by a selected amount. That amount assures that a first moment at which the wafer moving in the respective path is sensed by the first sensor, plus the first latency period, is not later in time than a second moment at which the wafer moving in the same respective path is sensed by the second sensor. In this manner, before the second sensor senses the wafer in the respective path, the first transition signal is output by the first sensor in response to the first sensor sensing the wafer in the respective path and the robot position data is stored.
Accordingly, there is temporal spacing of the first and second transition signals output by the respective first and second sensors. An important result of the temporal spacing of the transition signals is that only one processor is needed for receiving each of the first and second transition signals. In other words, because the transition signals are not generated at the same time, there is no need for multiple processors that operate simultaneously to process the transition signals. Although the transition signals are temporally spaced, the wafer movement may continue without interruption, such that throughput of wafers through the system is not reduced.
Such apparatus is also provided for wafers having different physical characteristics, such as a 200 mm or a 300 mm wafer diameter. Of course modifications can be made to the apparatus to accommodate smaller or larger substrates. The apparatus generates data indicating the position of the center of the wafer relative to the center of a blade of a wafer transport robot as the blade continuously moves the wafer along a path that extends through a plane defined by one of a plurality of facets of a plurality of modules of semiconductor manufacturing equipment. A sensor positioning axis extends in each of the planes and intersects the respective path. The wafer may have either of a first and a second physical characteristic, such as the 200 mm diameter or the 300 mm diameter, for example. The robot may cause the blade and the wafer carried by the blade to move in an extend motion through the respective plane into the respective module, or to move in a retract motion through the respective plane from the respective module. A first sensor is mounted in each of the planes, on the respective positioning axis, and spaced from the respective path by a first distance so as to sense the wafer moving in the respective path. The first sensor has a first latency period between a first time at which the first sensor senses the wafer in the respective path and a later time at which robot position data is stored in response to a first transition signal indicating the sensing of the wafer in the respective path.
A second sensor is also provided for use with either the 200 mm diameter wafers or the 300 mm diameter wafers. For the 200 mm wafers, the second sensor is mounted in each of the planes, on the respective positioning axis, and spaced from the respective path by a second distance so as to sense the wafer moving in the respective path. The second sensor outputs a second transition signal indicating the sensing of the wafer in the respective path. For each second sensor with respect to each first sensor, the second distance is different from the first distance by a selected amount. That amount assures that a first moment at which the wafer having the first physical characteristic and moving in the respective path is sensed by the first sensor, plus the first latency period, is not later in time than a second moment at which the wafer having the first physical characteristic and moving in the same respective path is sensed by the second sensor.
In this manner, before the second sensor senses the wafer in the respective path, the first transition signal is output by the first sensor in response to the first sensor sensing the wafer having the first physical characteristic and in the respective path, and the robot position data is stored. As a result, for the wafer having the first physical characteristic there is temporal spacing of the first and second transition signals output by the respective first and second sensors.
For the 300 mm diameter wafers, the second sensor is also mounted in each of the planes and on the respective positioning axis, but is relocated so as to be spaced from the respective path-by a third distance. As relocated, the second sensor senses the wafer having the second physical characteristic and moving in the respective path. For ease of description, the relocated second sensor spaced by the third distance is referred to as the xe2x80x9cthirdxe2x80x9d sensor. The third sensor has a third latency period between a third time at which the third sensor senses the wafer in the respective path and a later time. The later time occurs once the third sensor outputs a third transition signal indicating the sensing of the wafer having the second physical characteristic and in the respective path and robot position data is stored. For each third sensor with respect to each first sensor, the third distance is different from the first distance by an amount such that a third moment at which the wafer having the second physical characteristic and moving in the respective path is sensed by the third sensor, plus the third latency period, is not later in time than a fourth moment at which the wafer having the second physical characteristic and moving in the same respective path is sensed by the first sensor.
Accordingly, before the first sensor senses the wafer having the second physical characteristic and in the respective path, the third transition signal is output by the third sensor in response to the third sensor sensing the wafer having the second physical characteristic and in the respective path. For the wafer having the second physical characteristic, the first and third transition signals are output by the respective first and third sensors in temporal spacing. In view of the provision of a plurality of facets and sensors on the plane of each facet, logic circuitry is used to combine all of the outputs represented by the transition signals from all of the facets through which the wafer may be moved.
A method aspect of the present invention also provides the benefit of requiring only one processor to process the transition signals. The method provides data indicating the position of the center of a wafer with respect to the center of a blade carrying the wafer, and includes an operation of mounting the wafer on the blade for movement with the blade along a path. There is also an operation o f providing a first sensor along a transverse axis that has a center at an intersection with the path, the first sensor being on one side of the center. A next operation provides a second sensor along the transverse axis and on the other side of the center, the second sensor and the first sensor being spaced by a selected distance.
The wafer is continuously moved along the path so that the first sensor is triggered by the wafer and generates a first transition signal and the second sensor is triggered by the wafer and generates a second transition signal. The need for only one processor results from placing each of the first and second sensors along the transverse axis according to a latency characteristic of the sensor so that the wafer moving through the port will be sensed by individual ones of the plurality of sensors at temporally-spaced times. The temporally-spaced times allow the first of the sensors to sense the wafer and generate a first transition signal, and allow the robot position data corresponding to each first transition signal to be stored, all before the second of the sensors senses the wafer and generates a second transition signal. Stated alternatively, the selected distance is selected to temporally space the moments in time at which the first and second sensors are triggered by the wafer so that the first transition signal is generated and the robot position data corresponding to each first transition signal is stored before the wafer triggers the second sensor.
Other aspects and advantages of the invention will become apparent from the following detailed description, taken in conjunction with the accompanying drawings, illustrating by way of example the principles of the invention.

Method of and apparatus for dynamic alignment of substrates


A virtual storage server and library manager are configured to avoid a lengthy check-in process for selected physical volumes. In one embodiment, the selected physical volumes are volumes that were in a checked-in state previous to a disaster. Other volumes are checked-in normally. The present invention leverages information within the virtual storage server to efficiently recovery from disasters that destroy state information within the library manager. The improved recovery method, apparatus, and system, reduce the downtime associated with disasters within removable media virtual storage systems.

1. The Field of the Invention
The invention relates to methods, means, and systems for archiving data. Specifically, the invention relates to methods, apparatus, and systems for efficiently recovering from disasters within virtual storage systems comprising removable media storage units.
2. The Relevant Art
Removable media libraries are used to store large amounts of computer data. The computer data is typically recorded on a plurality of removable media such as magnetic tape cartridges or optical disk cartridges. The plurality of cartridges may be housed in a system of storage bins which are accessible by an accessor mechanism, typically a robotic arm. The accessor mechanism moves the cartridges between the storage bins and the storage units or drives for reading and writing. In many systems, the activities of the accessor are controlled by a separate computer or server known as a library manager.
Computer data stored on the removable media are typically arranged in data volume units that originally corresponded to the storage capacity of legacy cartridges. The capacity of such storage media has grown substantially in recent years. Application software and system utilities written to use removable media libraries typically assume the smaller volumes in order to ensure backward compatibility with legacy systems. Thus, the average size of data volumes in most computer or data processing centers is significantly less than the capacity of the current removable media cartridges.
A virtual storage server (VSS) is a recent development that utilizes the full capacity of a current media by storing multiple logical data volumes onto a single physical (or stacked) volume. Data which would have been stored in multiple, mostly unused physical volumes are collected and stored onto "stacked" physical volumes as separately accessible logical volumes. Older physical drives are often emulated by virtual storage servers in a transparent manner to provide backward compatibility with legacy systems. Additionally, virtual storage servers often contain local storage drives and/or large memories which are used to cache logical volumes and thereby increase performance.
In order to properly manage access to both physical and logical volumes, certain information must be collected and managed within both the library manager and the virtual storage server. Typically, that information is stored in separate databases within the library manager and the virtual storage server, some of which may be redundant. In the event of disasters, information within the library manager and the virtual storage server databases must be rebuilt. Due to the amount of information involved and the slow access rate of physical volumes, a physical volume check-in process may consume several seconds per volume—which in large libraries results in disaster recovery sequences that require several hours of additional downtime.
What is needed are means and methods to reduce the duration of disaster recovery sequences. In particular, means and methods are needed to leverage the information that may be available within a virtual storage server database and thereby streamline a physical volume check-in process.

Method for improving the recovery time from a lost database in a VTS automation system

International Business Machines Corporation


Methods and compositions are provided for high resolution HLA typing using microsatellite repeats in the HLA region of the genome. Alleles from these markers are shown to be in tight linkage disequilibrium with HLA-DQ/DR alleles. The methods can be carried out on amplified nucleic acid produced by the polymerase chain reaction using the novel primers of the present invention. The microsatellite marker characterization may be employed in the association of diseases to HLA. The typing methods may be further employed in determining the suitability of a donor for tissue transplantation, including bone marrow transplantation, and in determining an individual's susceptibility to HLA associated diseases, particularly autoimmune diseases.

Genetic susceptibility for more than forty diseases, most of them autoimmune in nature, is associated with genes encoded within the major histocompatibility complex (MHC), particularly the class I (HLA-A, B, C) and class II (Ia, HLA-D) MHC molecules. In many cases, the disease associations are strongest with HLA class II DR and DQ, suggesting that the DR/DQ subregion may be more important than other parts of the HLA region for autoimmunity dysfunction. Due to strong linkage disequilibrium in this genomic region for some populations, it is difficult to determine the specific genes involved in disease susceptibility.
In some cases, this difficulty can be circumvented by studying disease association in various ethnic groups. For example, in African populations, opportunities for ancestral intra-HLA recombinations (crossovers) have been numerous and haplotypic diversity is greater. In these populations, linkage disequilibria between specific HLA-DR and -DQ alleles is often weaker, which can help determine which region (DR or DQ) is more specifically involved in disease susceptibility. In addition, for some autoimmune diseases, complementation of HLA-DQA1 and -DQB1 alleles seems predisposed to disease as strongly as cis located alleles, thus suggesting the involvement of the DQ heterodimer itself rather than HLA-DR or another linked gene. The relatively limited number of haplotypic combinations found in all ethnic groups means that these strategies are not always applicable. Finer analyses of the association between HLA region genes and disease could therefore benefit from the definition of additional polymorphisms in the DR and DQ regions.
Due to their high degree of polymorphism in most mammalian species, microsatellite markers such as the (CA).sub.n, repeats, or GT on the complementary strand, are candidates for use in related gene mapping studies. The (CA).sub.n repeat sequences are estimated to occur every 30 kb in the haploid human genome. However, such repetitive elements are typically quite unstable, giving rise to very high mutation rates. Because of these high mutation rates, the utility of multialleleic markers for linkage disequilibrium studies has been uncertain. Thus, one would not expect that specific alleles of multiallelic markers would be significantly associated with particular genes.
Although HLA typing provides valuable information regarding disease susceptibility and suitability of tissue/organ transplantation donors, traditional methods of obtaining this information are laborious and expensive. One commonly used approach employs serological evaluation. To do so, HLA class I and II antigens are typed using a complement mediated lymphocytotoxicity test using purified T or B lymphocytes. HLA class I and II specific antisera are purified using naturally immunized individuals, in general multipare women.
Although HLA typing using serological methods to identify class I (A, B, and C) antigens are widely used, DNA-based methods have become more widespread to type HLA class II antigens (DR, DQ, and DP). The most common DNA-based method used is oligotyping. In this method, the polymerase chain reaction (PCR) is combined with dot-blot hybridization with sequence-specific oligonucleotide probes (SSOP) (e.g. forward or reverse dot blotting). PCR-SSP (sequence specific primer) and PCR-SSCP (single strand comformation polymorphism) methods represent other common DNA typing techniques used for HLA typing.
Our co-pending application Ser. No. 08/391,374, now abandoned discloses the unexpected finding that a polymorphic microsatellite marker in the HLA DQ region of the genome gives rise to distinct alleles which are strongly associated with specific HLA DQ alleles. This finding indicates that microsatellite markers in the HLA region can be useful in predicting HLA type. As HLA typing provides valuable information regarding disease susceptibility and suitability of donor tissue for transplantation, microsatellite markers which can predict HLA type are therefore useful in these capacities as well. Additional microsatellite markers from the HLA region are herein disclosed, providing further basis for a novel method of HLA typing which is simple, rapid, and inexpensive relative to traditional HLA typing methods.

Methods and compositions for high resolution HLA typing

TGE Board of Trustees of the Leland Stanford Junior University


A method for heat-treatment of tungsten based alloys, capable of improving impact toughness while keeping tensile strength and elongation. The method comprises maintaining a sintered tungsten based alloy consisting of 86 to 99 weight % tungsten and the balance at least one selected from a group consisting of nickel, iron, copper, cobalt and molybdenum, at a temperature ranged from 950.degree. to 1,350.degree. C. for a maintenance time of one minute to 24 hours, quenching the sintered alloy in water or in oil, and repeating the maintaining and quenching steps.

1. Field of The Invention
The present invention relates to tungsten based alloys, and more particularly to a method for heat-treatment of tungsten based alloys, capable of improving impact toughness, namely, impact energy while keeping tensile strength and elongation.
2. Description of the Prior Art
Tungsten based heavy alloys contain tungsten of at least 90 weight %. They also contain nickel, iron and/or copper.
Referring to FIG. 1, there is illustrated a typical microstructure of the tungsten based alloys. As shown in FIG. 1, the microstructure comprises spherical tungsten grains (BCC) and a matrix phase (FCC) which consists of nickel, iron and tungsten or of nickel, copper and tungsten. The tungsten based alloys are usually manufactured by a liquid phase sintering process which is a kind of powder metallurgy. This liquid phase sintering process is illustrated in FIG. 2.
Tungsten based heavy alloys exhibit a high density of 16 to 19.1 g/cm.sup.3, a superior tensile strength of 700 to 950 MPa, a high elongation of 5 to 25% and a superior formability or machinability, depending on their alloy compositions such as tungsten, nickel, iron and/or copper contents. Thus, the tungsten based heavy alloys are widely used in fields requiring both a small volume and a heavy weight.
For example, the tungsten based heavy alloys are widely used for rotors, balance weights for aircrafts and shield materials against radioactive rays in commercial industry fields and core materials for kinetic energy penetrators in military industry fields. Recently, the speed of rotors and aircrafts is on an increasing trend. Such a trend involves a requirement for increasing a stability of structural elements against fracture. Where the tungsten heavy alloys are used as the materials for penetrators, it is believed that the penetration depth increases with increasing impact toughness.
As mentioned above, the tungsten heavy alloy is a kind of composite material comprising hard tungsten grains and a ductile matrix phase and having two kinds of characteristic interfaces, namely, tungsten-matrix and tungsten-tungsten interfaces. It is known that the bonding strength of the tungsten-matrix interface is higher than that of the tungsten-tungsten interface. Accordingly, the impact toughness of tungsten heavy alloys is considerably dependant on the relative fraction of tungsten-tungsten and tungsten-matrix interfaces.
On the other hand, it is also known that the bonding strength of the tungsten-matrix interfaces is greatly decreased due to a segregation of impurities. For maximizing the impact toughness of tungsten heavy alloys, accordingly, it is required to minimize both the relative fraction of the tungsten-tungsten interfaces and the segregation of impurities in the tungsten-matrix interfaces.
Now, the variation in bonding strength caused by the segregation of impurities in the tungsten-matrix interfaces will be described.
The decrease of bonding strength at the tungsten-matrix interfaces is caused by the fact that impurities such as phosphorous, sulphur and carbon contained in the raw materials and hydrogen are segregated in the tungsten-matrix interfaces, due to the difference in solubility. Thus, for enhancing the impact toughness of tungsten heavy alloys, it is required to remove the hydrogen and to prevent the segregation of impurities at tungsten-matrix interfaces by using a heat-treatment after sintering.
Referring to FIG. 3 there is illustrated a conventional heat-treatment proposes for removing the hydrogen and preventing the segregation of impurities. This heat-treatment comprises the steps of maintaining a sintered tungsten heavy alloy at a temperature of 1,000.degree. to 1,200.degree. C. in an atmosphere of an inert gas such as nitrogen or argon or in a vacuum and then water quenching.
The purpose of the maintaining at such a high temperature is to remove the remaining hydrogen and to diffuse out the segregation of impurities. On the other hand, the water quenching makes it possible to prevent the re-segregation of impurities. Hence, the heat-treatment greatly contributes to an increase in impact toughness of the tungsten heavy alloy.
Although the impact toughness is increased by solving the problems of the brittleness caused by the hydrogen and the segregation of impurities at tungsten-matrix interfaces, the conventional heat-treatment method has a limitation on the increase in impact toughness, in that the relative fraction of tungsten-tungsten interfaces which are the most brittle interfaces of tungsten heavy alloys can not be controlled.
Accordingly, it is required to develop a method for changing brittle tungsten-tungsten interfaces to strong tungsten-matrix interfaces so as to obtain an improvement in impact toughness.

Repeated sintering of tungsten based heavy alloys for improved impact toughness


In one aspect, the invention relates to a method for analyzing qualitative data. The method includes the step of providing a plurality of evaluation categories and a respective ranking system. Providing a closed curvilinear graph in which each unit of radius corresponds to a rank in the ranking system is another step of the method. Another step in the method includes placing each evaluation category at a location on the circumference of the closed curvilinear graph. The steps of the method also include providing the evaluation categories and ranking system to an entity being evaluated. The entity selects a rank in response in each respective category according to the method. Plotting the ranking of each respective category as a node in the closed curvilinear graph in response to the ranking by the entity is another step in the method.

Various representational formats have developed over time to organize and to represent information. Specifically, organizational charts, tables, decision trees, and histograms are some of the traditional formats for organizing and reporting data. Once the underlying data is organized into a particular format, it can be used for a desired purpose. However, the utility of these traditional formats are often subject to certain limitations.
Some format specific limitations arise because the representational capacity of a given format is exceeded by the amount of data required to accurately model a system. For example, a table of data cannot represent a large and complex system without becoming voluminous and unwieldy for a human analyst to parse. As a result, tables and other formats sometimes enforce an unrealistic view of the world where only one facet of a larger system is considered in isolation. Accordingly, data representation techniques that encourage analytic approaches that expand perspectives and change outmoded norms are needed. However, other limitations result when dealing with complex systems.
Mismatches between the nature of the data format and the nature of the underlying data can lead to another data format limitation. For example, a table of increasing values may indicate a pattern at first viewing. However, without supplemental calculations, the details of the pattern remain obscured. Thus, some of the traditional representation formats introduced above are inherently limited. As such, they are best suited for simple data and systems.
In contrast, complex systems or relationships with periodic or persistent non-linear components cannot always be easily handled by traditional data representations. Flexible and intuitive approaches to data representation are needed to address these deficiencies.
Currently, data representation and analytic tools based upon conventional teachings are difficult to use. They often include non-intuitive interfaces that make it difficult to extract meaningful information about the larger system. As discussed above, various limitations exist with regard to traditional data representation formats. Consequently, a need therefore exists for techniques and apparatus that are intuitive, adaptable, and suitable for modeling complex systems or individual system components.


A gas engine system has a control unit including: a first determination section for determining, as a first determination, whether the gas pressure is a low pressure less than a predetermined pressure, while the control device recognizes the gas valve is closed; a second determination section for determining, as a second determination, whether the gas pressure is a high pressure equal to or more than the predetermined pressure, while the control device recognizes that the gas valve is open, if the first determination determines the gas pressure is the low pressure; a start-up section for performing the first and second determinations before start of engine operation when receiving a start-up command; and an operation start section for opening the valve and starting the engine, if the first determination determines the gas pressure is the low pressure, and if the second determination determines the pressure is the high pressure.

Conventionally, in order to detect a pressure in a gas pipe for supplying a gas to a gas engine, a pressure sensor is provided on the gas pipe. An example of a gas pressure detection device is shown in FIG. 2 of Patent Document 1. On the gas pipe, a pressure sensor, gas valves for opening and closing the gas pipe, and a gas engine are disposed in order. The gas valves consist of two electromagnetic valves and a pressure adjustment valve. When the gas valve opens the gas pipe, the pressure in the gas pipe changes. The pressure change in the gas pipe is detected by the pressure sensor.
The detection device of Patent Document 1 always monitors an output signal of a pressure switch, whereby when the gas pressure in the gas pipe is reduced, the detection device shuts down the gas engine. The reason for this is as follows: If operation of the gas engine is continued in a state in which the gas pressure is reduced, the pressure in the gas pipe becomes a negative pressure, so that there is fear of the occurrence of failure in which air is mixed in the gas pipe from an opening formed in the gas pipe, for example, from a gas supply port to other gas equipment. In the detection device of Patent Document 1, the reduction in the gas pressure is detected, whereby the occurrence of such failure can be prevented.
Incidentally, for power saving, a pressure switch having a b-contact is widely used as the pressure sensor in Japan. When the gas pressure is higher than a set pressure, the b-contact is open, which becomes a non-conductive state. On the other hand, when the gas pressure is lower than the set pressure, the b-contact is closed, which becomes a conductive state. That is, when the gas pressure is lower than the set pressure, a detection signal is outputted from the pressure switch, and when the gas pressure is higher than the set pressure, the signal is not outputted from the pressure switch. Namely, since the pressure switch becomes the conductive state only at the occurrence of an abnormality in which the gas pressure in the gas pipe is reduced more than the set pressure, power consumption of the pressure switch is kept low. In particular, if a battery is used as a power supply for the pressure switch instead of a system power supply, the battery life can be extended.

Gas engine system with detection function of abnormality occurrence of gas pressure detection mechanism


A turn-around device for packets, in particular packets of cigarettes, wherein the packets are fed successively, with a first surface facing forwards, to a turn-around station, from which they are extracted, with a second surface facing forwards, by a gripper conveyor, which travels through the turn-around station perpendicularly to the second surface, and has a number of grippers, each of which defines a pocket for a relative packet, and closes gradually onto the packet to control its position as it is extracted from the turn-around station with the second surface facing forwards.

Known turn-around devices of the above type normally comprise an input conveyor operating in a first given direction and in a given travelling plane; and a toothed turn-around wheel rotating about an axis perpendicular to said travelling plane, and which engages the packets laterally and moves them, in the travelling plane, into a second direction normally crosswise to the first direction.
Turn-around devices of the above type have several drawbacks, mainly due to the fact that, as a tooth on the turn-around wheel strikes the side of a packet on the input conveyor, the packet is accelerated sharply crosswise, and not only has a tendency to be damaged by the relatively severe stress to which it is subjected, but is also detached by inertia from the relative tooth on the turn-around wheel, which thus loses position control of the packet, so that braking devices are required to bring the turned-around packets back under control.


An electric restoring switch is provided with a button (13) that allows actuation about an eccentric axle (14) and has attached to it at least one link (16) transferring the actuation, and is provided with a contact spring (17) that is arranged in a housing (1) supporting connectors (10) and featuring a notched contact tongue (18). To arrive at a switch that manages without complex parts, allows easy assembly, offers a reliable switching feel and, besides, is small in its structure, the link (16) of the button (13) acts on a switching member (20) which is aligned approximately parallel to the direction of actuation (19) of the button (13), is assembled elastically and is pivotable, the pivot (21) of the switching member (20) being situated away from the axle (14) of the button (13), and the switching member (20) carrying a cam (22) that acts on the contact tongue (18) of the contact (17) fitted parallel to the direction of actuation (19) of the button (13).

The invention relates to an electric restoring switch comprised of a button that allows actuation about an eccentric axle and carries at least one link that transfers the actuation, and of a contact spring which is arranged in a housing supporting electric connectors and features a notched contact tongue.
Known from DE-GM 71 38 974 is an electric restoring switch in which a bearing for the pivot axle of the button is arranged eccentrically and above a contact rail. The button features a link that acts on an elastic contact tongue of a contact spring, which contact tongue is notched out of the elastic contact spring. The contact spring is arranged approximately perpendicularly to the button in the housing. It has only one fixed bearing about which it pivots under the effect of the link contained on the button, as the button is actuated. The contact tongue is responsible for the position of the button and for the necessary contact force. This configuration necessitates a large-area design of the housing bottom and that the contact spring has a complex shape, so as to assure resetting as well as the contact force. Heat buildup due to the flow of current through the contact spring, however, will cause the spring force to diminish and the superficial forward resistance to increase, leading to a temperature buildup.
Furthermore, DE 34 21 021 C2 discloses an electric restoring switch with a button to which two links are molded symmetrically, between which a cam is fitted which alternately plunges in two depressions of a contact spring, thereby causing the contact spring to pivot to its opposite position. The two links are elastic and shaped, on their sides facing the cam, in such a way that the cam returns upon completed actuation again to its zero position. This configuration of the link and of the cam is relatively expensive and requires great accuracy in their manufacture. The recoil of the cam depends on the spring properties of the plastic material, and thus on its fatigue strength.sup.1. FNT .sup.1 Translator: "Halterungsbedtandigkeit" durability as a holding device! appears to be a typographic error; proper term is presumably "Alterungsbestandigkeit" fatigue strength!


A method and apparatus for secured data transmission is provided. The base station determines a first precoding matrix based on channel information of an eavesdropper. The base station determines a second precoding matrix and a third precoding matrix. The base station generates the secure data by precoding first user data for a target user with the first precoding matrix and the second precoding matrix. The base station transmits the secure data signal to the target user. The second precoding matrix is determined based on the first precoding matrix and the first channel information. The third precoding matrix is determined based on the first channel information and the second channel information.

1. Field of the Invention
The present invention relates to data transmission schemes and more specifically to a method and apparatus for secure data transmission.
2. Related Art
Information security of wireless communications has become a very important issue with a growing number of wireless communication applications. Due to the broadcast nature of wireless medium, the wireless security is inherently more vulnerable than the wired security. In wireless networks, the eavesdropper may overhear signals transmitted from a transmitter and interpret the messages more easily than in wired networks.
In most of the existing methods to guarantee the security of transmitting signals, a transmitter generates signals coded by cryptography. Both a transmitter transmitting the signals coded by cryptography and a receiver receiving the signals coded by cryptography should have secret key to guarantee the security of the signals. Wireless communication system should perform key management to decode the signal coded by cryptography. However, performing the key management in a wireless communication system can be difficult and complex process. To overcome the difficult and complex operation of the key management in the wireless communication system, physical layer security techniques have been proposed.
Most of the works in the area of physical layer security have focused only on the scenario of point-to-point communications, i.e., the single user case, which typically involves one transmitter and one receiver in the presence of an eavesdropper. The natural extension is to consider multiple users. In particular, the case of multiple (legitimate) receivers, known as the broadcast channel (BC), is an important scenario.
Most of the works in the area of physical layer security are also based on an assumption which the eavesdropper's channel was assumed to be a degraded version of the legitimate user's channel. Later, This assumption should be extended to the non-degraded case, where the eavesdropper's channel is not necessarily a degraded version of the legitimate user's channel, and also applied to Gaussian channels.

Method and apparatus for secure data transmission