A technique for assembling a multi-chip module does not necessitate more than one pass through a die attach machine. The technique involves attaching a smaller die to a larger die without using a die attach machine. The larger die may be attached to a support structure using a die attach machine. In some embodiments, the larger die is affixed to the support structure first and in other embodiments, the smaller die is affixed to the larger die first.

This invention relates generally to assembling integrated circuit dice into packages.
For a number of reasons, it may be desirable to package two dice together in a single package. For example, the components provided in a separate die may not be capable of being integrated in a single integrated circuit. For example, different process technologies may be used in each die. In addition, basic incompatibilities between components on each die may necessitate separate die fabrication. Once the dice are fabricated independently, it may be desirable to package them in a single package so that a single set of contacts may be used to connect with each of the dice.
The handling of dice, which may be stacked, to form a composite creates a number of difficulties. Predominantly, semiconductor assembly equipment is adapted to produce packages containing a single die. Thus, techniques are needed to assemble the dice.
Conventional dice assembly techniques may involve a pair of passes through a die attach machine. For example, a larger of two dice to be stacked may be attached to a support structure in a die attach machine. Thereafter, the support structure may be run through the die attach machine again to attach the smaller die to a larger die.
The repeated passes through the die attach machine may be disadvantageous for a number of different reasons. For example, the assembly process is complicated by the multiple passes through the die attach machine. In some cases the die attach process may be relatively expensive. In some cases the thermal budget may be impacted by the die attach process.
Die attach machines usually use an organic-based adhesive to attach the support structure to the die or to attach one die to another die. The adhesive may be applied in an uncured or soft phase between the surfaces to be joined. The adhesive is then cured through exposure to elevated temperatures for a specified time period. The carrier material is typically an epoxy resin or polyimide. The carrier provides the adhesion and mechanical strength along the bond line. The carrier may be filled with metal particles in the event electrical and thermal conductivity is required or with non-metallic particles such as alumina, if the ultimate bond should be an insulator.
Three types of polymer adhesives that are often used in die attach processes are epoxies, cyanate esters and polyimides. Epoxies use relatively low cure temperatures (125-175xc2x0 C.) and have moderate glass transition temperatures (100-155xc2x0 C.). However, epoxies vary in their ability to absorb and outgas moisture and other contaminants. Cyanate ester adhesives use higher cure temperatures (300xc2x0 C) and have relatively higher glass transition temperatures (240xc2x0 C.). However, unlike epoxy adhesives, cyanate esters have low outgassing characteristics as well as low ionic contents. Finally, polyimide adhesives use high cure temperatures (greater than 400xc2x0 C.) and like cyanate esters have a high glass transition temperature. A variety of conductive fillers including silver, gold or copper and non-conductive fillers, such as alumina, diamond, glass fabric, silica or ceramic may be used with the adhesive.
Thus, in addition the complexity inherent in the die attach process, in some cases the thermal exposure may be disadvantageous both to shallow junctions in advanced devices and to the wire bonds or other elements whose electrical performance may be affected.
Circuits that are susceptible to outgassing and moisture generally use a metallurgical attachment technique. Solder or metal eutectic alloys may provide good thermal conductivity but because of their electrical conductivity they may not be used if the backside of the die must be insulated from the support structure. Solders and eutectic alloys generally use higher processing temperatures and thereby impose constraints on work flow. For example, if a gold-tin die attach operation is scheduled after other chips in a multi-chip module have been wire bonded, the high temperatures used may degrade the wire bonds or degrade the electrical performance of the actual device.
Thus, for a variety of reasons, it may be desirable in making multi-chip modules, to reduce the number of times that the module or any part thereof must be exposed to the die attach process.
In accordance with one aspect, a method of assembling multi-chip modules includes using a die attach machine to attach a first, relatively larger die to a support structure. A second, relatively smaller die is affixed to the larger die without using a die attach machine.
Other aspects are set forth in the accompanying detailed description and claims.


A shopping bag and carrying pouch therefor in which the pouch is of unique construction comprising a generally circularshaped rear panel, a pair of arcuately shaped, band-like members are connected to the rear panel member, and top and bottom front panel members connected to the front edges of the band-like members. The members which make up the panels are interconnected in such a manner as to provide secure overlocking closure of the pouch for compact storage of a shopping bag without requiring the use of a fastener on the pouch.

1. Field of the Invention
The present invention relates generally to shopping bags and carrying pouches therefor. More particularly, the invention concerns an easy-to-use, self-closing, self-contained and highly-compact pouch for storage of reusable and disposable shopping bags.
2. Discussion of the Invention
Various types of shopping bags with companion pouches have been suggested in the past. Such prior art devices are typically fabricated from netting material with the pouch attached to the body of the bag itself, either at the base or at the mouth of the shopping bag. The method of insertion of the shopping bag into the pouch for transport and storage typically requires rolling or folding of the shopping bag in a very specific way so that it will fit into the pouch. If the bag is not properly rolled or folded, the pouch very often cannot be closed. After proper insertion of the bag into the pouch, the prior art pouches are generally closed with a button or zippered fastener thereby requiring a separate and somewhat cumbersome step in accomplishing secure closure of the pouch. Because of the aforementioned drawbacks, the prior art shopping bag and pouch combinations are so difficult to use that they are frequently discarded in frustration after one or two uses.


A metal atomic layer and an oxygen atomic layer are formed in this order by ALD, followed by rapid heating through RTA (Rapid Thermal Annealing). This cycle of steps is repeated to form a high dielectric constant film.

This is a U.S. national stage of application No. PCT/JP2004/004076, filed on 24 Mar. 2004. Priority under 35 U.S.C. §119(a) and 35 U.S.C. §365(b) is claimed from Japanese Application No. 2003-083692, filed 25 Mar. 2003, the disclosure of which is also incorporated herein by reference.
1. Field of the Invention
The invention relates to a deposition system which is capable of forming a metal compound thin film by atomic layer.
2. Description of the Related Art
In recent years, intensive studies have been made on the use of high dielectric constant thin films, called high-k, as materials for constituting semiconductor devices. High dielectric constant thin films are formed by such methods as CVD (Chemical Vapor Deposition), ALD (Atomic layer deposition), and sputtering. Of these, ALD is a method for forming a thin film by cyclic supply of reactants for chemical substitution, not by thermal decomposition. This method provides a superior capability for split-level coating as compared to physical deposition methods such as sputtering, and also allows low-temperature processes. It is thus considered as a promising method for forming a high dielectric constant thin film to constitute a semiconductor device (for example, see Japanese Laid-Open Patent Applications 2001-152339, 2001-254181, and 2002-314072).
A system for conducting this ALD-based deposition appears in Japanese Laid-Open Patent Application 2001-254181. This deposition system is one for achieving the process of supplying a first source gas to a substrate placed in a deposition chamber, purging this source gas, and then supplying a second source gas thereto. Switching the source gases and the purge gas alternately at speed allows deposition through the foregoing process, whereby atomic layers can be deposited layer by layer.
Now, Japanese Laid-Open Patent Application 2002-314072 (FIG. 8) describes a deposition system which has a chamber for performing deposition processing and a chamber for performing preprocessing separately. FIG. 14 is a diagram schematically showing the structure of this ALD system. The same document describes that when the ALD system deposits Al2O3 on a silicon substrate, terminating hydrogen on the silicon surface shall be desorbed. For example, this hydrogen desorption process is performed in an atmosphere of 400° C. or above in temperature, whereas Al2O3 is deposited at around 300° C. When these processes are performed continuously in an ordinary ALD system, the sample must be once raised to 400° C. or above in temperature for the sake of the hydrogen desorption process, and then the deposition is performed after a wait until the sample temperature falls to around 300° C. Then, performing the series of operations wafer by wafer increases the number of processes of the ALD system, thereby making the cost of the semiconductor device higher.
The deposition system shown in FIG. 14 is to address this problem. The ALD system has a sample introduction chamber 13 which accommodates to-be-processed and processed samples, a reaction chamber 12 where depositing a predetermined film on a sample is carried out, and a conveyor system which conveys the samples in succession. Aside from these, the ALD system is also provided with a hydrogen desorption chamber 11 which performs the hydrogen desorption process. In the hydrogen desorption chamber 11, the hydrogen desorption process is carried out by using a heating lamp 16. This configuration allows the hydrogen desorption process and the deposition of the dielectric film, having different processing temperatures, to be performed continuously. Because of the provision of the respective chambers for performing the deposition processing and the preprocessing, it is possible to perform the processes continuously without waiting for the temperature to settle. Then, it has been concluded that the number of processes of the semiconductor device can be decreased to reduce the manufacturing cost of the semiconductor device.
Any of the deposition systems for performing such ALD-based deposition is basically configured so that a source gas and a purge gas are supplied alternately. Hereinafter, a typical ALD deposition process to be achieved by these deposition systems will be described with reference to FIG. 1. Here, the description will deal with the case of an aluminum oxide film.
Initially, a substrate is placed in the reactive chamber, and then a film material A is supplied to the surface of the substrate. Here, trimethyl aluminum (Al(CH3)3; referred to as "TMA") is supplied (S101).
Next, the material A is exhausted from the reaction chamber by inactive gas purging (S102). Next, a reactive gas is supplied to the reaction chamber (S103). The reactive gas may be oxygen, water vapor, or the like. As a result, an oxygen atomic layer is formed on the atomic layer made of the material A. To remove resulting by-products and the reactive gas hanging in the vapor phase, inactive gas purging is then performed to exhaust the air (S104).
The foregoing steps S101 to S104 are repeated to form a high dielectric constant thin film. Subsequently, whether a predetermined thickness is reached or not is checked by a thickness measuring device which is arranged on the deposition system (S107). If it is confirmed that the predetermined thickness is reached (Yes at S107), then thermal annealing is performed for the sake of film refining processing (S108). This thermal annealing is performed after the completion of the layer formation (Japanese Laid-Open Patent Application No. 2001-152339, paragraph 0047). This completes the deposition steps.
In such a deposition process, however, impurities resulting from the materials used in the ALD have sometimes remained in the high dielectric constant thin film or induced film defects. In this respect, description will be given with reference to FIGS. 2A and 2B. FIGS. 2A and 2B are schematic diagrams showing the layer structure of a high dielectric constant thin film formed by the steps of FIG. 1. FIGS. 2A and 2B correspond to the states before and after the film refining processing by the thermal annealing shown in S108 of FIG. 1, respectively.
Before the thermal annealing, as shown in FIG. 2A, impurities are distributed throughout the high dielectric constant thin film. After the annealing, impurities are removed from the entire film. The film is also densified. Nevertheless, in the lower areas of the high dielectric constant thin film or near the substrate in particular, impurities tend to be removed insufficiently and remain intact. In addition, since metal oxides are typically prone to crystallization, the film can be partially crystallized in the annealed state of FIG. 2B. The residual impurities and the film crystallization described above may contribute to deterioration in the characteristics of the device that contains the high dielectric constant thin film. For example, when the high dielectric constant thin film is applied to the gate insulating film of a transistor, it may cause an increase in leak current, deviations in threshold characteristics, etc.
To solve these problems, it is desired to adopt a deposition method that not only supplies the source gases and the purge gas alternately but also exercises control of higher sophistication on the film quality. To achieve such a new deposition method, the deposition system itself must also be sophisticated in function.
Related Art List
JPA laid open 2001-152339
JPA laid open 2001-254181
JPA laid open 2002-314072 (FIG. 8)


Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial and lateral thermal conductivities.

1. Field of the Invention
This invention relates to the removal of heat generated by an integrated circuit and the components used in chip assembly and packaging to facilitate said heat removal. More specifically, this invention discloses the application of self-assembled nano-structures for improving the performance of heat sink structures coupled to integrated circuit devices.
2. Description of the Related Art
Prior art used to cool semiconductor ICs incorporates the use of large and expensive chip packaging having externally mounted, finned heat sinks coupled to the ceramic or plastic encapsulated IC chip. As the speed and density of modem integrated circuits increase, the power generated by these chips also increases, often in geometric proportion to increasing density and functionality. In the video processing and CPU application areas, the ability to dissipate the heat being generated by current ICs is becoming a serious limitation in the advance of technology. In the current art, relatively large interface-thermal-resistances are added when the die is 'attached' to a heat spreader, heat pipe or heat sink. These multiple interfaces have the undesired side effect of increasing total die to heat sink resistance and making heat transfer more difficult.
FIG. 1 (Prior Art) is a cross section schematic view of a simplified integrated circuit structure. Transistor structure 102 is formed near the top surface of substrate 100. Electrical interconnects 106 are used to make contact with transistor 102 and numerous other similar devices (not shown) on the substrate 100. "Solder balls" 104 are utilized to complete the interconnect of the integrated circuit to a printed circuit board or wire leadframe. This type of package is often referred to as a "flip chip" device. In the current art, heat generated by transistor 102 is extracted through the substrate 100 to the back surface of the chip. A heat transfer bonding layer 108 may be utilized to enhance heat conduction by reducing interfacial heat transfer resistance created by air gaps and surface irregularities. Typically, this layer may be composed of a thermal grease or thermally conductive epoxy. These materials, while better that solid surface/surface contact, still have a relatively poor thermal conductivity when compared to solid metals. As a result, the backside chip surface interface still presents a significant thermal resistance which limits the power that can be extracted from the chip.
Recently, U.S. Patent Application Publication number US2003/0117770 has disclosed a process of forming a thermal interface that employs carbon nano-tubes to reduce thermal resistance between an electronic device and a heat sink. Bundles of aligned nano-tubes receive injected polymeric material in molten form to produce a composite which is placed between the electronic device and the heat sink. The nano-tubes are aligned parallel to the direction of heat energy. However, the polymeric filler does little to spread heat laterally, potentially creating localized hot spots on the device surface. The use of bundles of aligned carbon nano-tubes may result in reduced thermal conduction as well. Theoretical molecular dynamics simulations have shown that isolated carbon nano-tubes show unusually high thermal conductivity, but that the thermal conductivity degrades by an order of magnitude when carbon nano-tube bundles are formed with tube-to-tube contacts (see for example Savas Berber, et al, Physics Review Letters, 84, no. 20, 4613, May 2000). U.S. Patent Application Publication US2003/231471 discloses an integrated circuit package that utilizes single wall or double wall carbon nano-tube arrays grown subsequent to the deposition of CVD diamond films. Due to the roughness of CVD diamond films, carbon nano-tubes are utilized to aid in making thermal contact between the surfaces of the circuit silicon die and of the integrated heat spreader. The interstitial voids between the nano-tubes are not filled in order to maintain flexibility. This disclosure, however, fails to provide any method to reduce matting and nano-tube to nano-tube contact, which reduces the effective thermal conductivity of the structure. Although CVD diamond films are good conductors, they may not be thermally compatible (from an expansion perspective) with a number of other metallic materials utilized in various heat sink structures. Additionally, commonly known techniques for growing carbon nano-tubes would preclude carbon nanotube deposition directly on a silicon circuit die, since these techniques require temperatures in the range of 700 to 800° C. Exposing a completed circuit die to these elevated temperatures is not a recommended practice.
What is needed is a method and structure by which interface resistances are minimized by integrating several thermal components to maximize heat transfer from hot surfaces on the integrated circuit.

This patent is subject to a terminal disclaimer.

System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler


An injector head for medical use is provided with a tilt sense circuit between a switch circuit and a body control unit for sensing a tilt of the injector head, converting a signal output from the switch circuit to a prescribed signal and outputting it to the body control unit. Accordingly, an injector head is provided which can be operated without care at the time of injection of contrast medium into a patient.

1. Field of the Invention
The present invention relates to an injector head for medical use, and more particularly relates to improvement of the structure of the injector head for medical use.
2. Description of the Background Art
Various apparatuses for testing the function of the human body have been developed recently. One example is a circulatory organ x-ray diagnostic apparatus for diagnosing the function of the circulatory organ of the human body. With reference to FIG. 2, a general description of the circulatory organ x-ray diagnostic apparatus will be given.
A circulatory organ x-ray diagnostic apparatus 100 is provided with a rail 103 attached to a ceiling 101. An x-ray apparatus 102 which is movable freely in X and Y directions is attached to rail 103. A catheter table 104 for laying a patient 106 at a prescribed position is arranged at a prescribed position.
A side of catheter table 104 has a guide rail 108. Guide rail 108 has an equipment attached for performing the procedure necessary for the x-ray diagnosis for patient 106. In FIG. 2, for example, a support unit 200 is mounted on guide rail 108, and an injector head for medical use 112 for injecting contrast medium into patient 106 is attached to support unit 200 via a stanchion 114. By moving support unit 200 along guide rail 108 medical injector head 112 can be positioned at patient 106, and interference with any other apparatus can be avoided.
A syringe 10 into which the contrast medium is injected is attached to medical injector head 112. When the contrast medium is injected into patient 106 using medical injector head 112, medical injector head 112 is inclined downward such that an injection unit 10a of syringe 10 faces downward. Even if air bubbles enter syringe 10, injection of air bubbles into patient 106 can be prevented by arranging injection unit 10a of syringe 10 to face downward in order to collect the air bubbles in the rear end portion of syringe 10 as shown in FIG. 3A.
On the other hand, when the air bubbles entering syringe 10 are to be discharged or the contrast medium is to be sucked into syringe 10, medical injector head 112 is inclined upward such that injection unit 10a of syringe 10 faces upward as shown in FIG. 3B. The air bubbles entering syringe 10 at the time of the sucking can easily be discharged from injection unit 10a of syringe 10 to the outside after the injection.
Next with reference to FIG. 4, the mechanism of injector head for medical use 112 is described.
Medical injector head 112 includes a plunger 21 joined to a piston 20 provided in syringe 10. Rotation of a motor 30 is propagated to a ball screw 22, and plunger 21 can be moved forward and backward by ball screw 22.
Motor 30 is provided with a potentiometer 23 for sensing a position of plunger 21. A plunger position signal S3 output from potentiometer 23 is supplied to a body control unit 200.
A motor drive voltage S2 is output from body control unit 200 to motor 30. When an amount of injection of the contrast medium into a patient is input to a control panel 150, a corresponding signal is output from control panel 150 to body control unit 200, and motor drive voltage S2 is output from body control unit 200 to motor 30. At this time, plunger position signal S3 is supplied from potentiometer 23 to body control unit 200 as a feedback signal. Accordingly, the position of plunger 21 can be controlled correctly, and the contrast medium can be injected highly accurately into the patient.
Injector head for medical use 112 is further provided with an switch 50 for advancing and retracting plunger 21 by manual operation, as well as a manual knob 112b (see FIG. 3A). A variable forward/reverse switch is utilized as switch 50 which is capable of varying the speed in forward and backward movements by changing the position on the switch to be pressed.
A signal from switch 50 is output to a switch circuit 40 and a switch signal S100 is supplied to body control unit 200. Motor drive voltage S2 is thereafter output from body control unit 200 to motor 30.
When the contrast medium is injected into patient 106 by inclining medical injector head 112 downward as shown in FIG. 3A, sucking is performed slowly in order to check if a catheter is inserted into the blood vessel of patient 106. If the blood rises into the catheter, it means that the catheter has been surely inserted into the blood vessel.
In this case, if the contrast medium is sucked at higher speed, the blood flows backward into the catheter and enters syringe 10. An operator of injector head 112 such as a nurse or a medical technologist needs to operate switch 50 or manual knob 112b such that the piston is moved very carefully and slowly.


A semiconductor memory device includes a command decoder, a refresh address counter, an address delivery unit, and an address output selector. The command decoder decodes a command signal to generate a refresh signal. The refresh address counter generates a refresh address in response to the refresh signal. The address delivery unit delivers one of the refresh address and an address from outside of the semiconductor memory device to a memory core area. The address output selector outputs the refresh address to the outside of the semiconductor memory device.

The present invention relates to a semiconductor memory device; and, more particularly, to a refresh operation of a semiconductor memory device.
Generally, a semiconductor memory device is a semiconductor device for storing a great amount of data. This semiconductor memory device is divided into a data storage area for storing data and a peripheral and input/output area for accessing the data stored in the data storage area. The data storage area is provided with a plurality of unit cells, each of which stores a single datum. The peripheral and input/output area is provided with a variety of circuits for effectively accessing data of the unit cells in the data storage area.
A dynamic random access memory (DRAM), a most widely used semiconductor memory device, is designed in a manner that one unit cell is implemented with a single MOS transistor and a single capacitor. In order to store more data, the MOS transistor and capacitor constituting each of the unit cells in the data storage area are manufactured in as small a size as possible.
Since a semiconductor memory device, such as a DRAM, uses a capacitor as a basic component of data storage, the data stored therein should be refreshed at regular intervals. This is because the charge amount stored in the capacitor gets lost as time goes by, in view of the nature of the capacitor. The semiconductor memory device performs the operation of supplementing the lost amount of charge before the charge amount stored in the capacitor constituting the unit cell decreases less than a predetermined amount. This operation is called a refresh operation.
The refresh operation includes an auto refresh operation and a self refresh operation. The auto refresh operation refers to an operation that takes a refresh command from outside of the semiconductor memory device, internally generates an address to be refreshed, and then performs the refresh operation during the data access of the semiconductor memory device. The self refresh operation refers to an operation that accepts a start command related to the self refresh from the outside of the semiconductor memory device, internally generates a refresh command and an address to be refreshed, and then executes the refresh operation when the semiconductor memory device is not performing a data access operation, such as a power down mode and the like.
In order to know if the self refresh or auto refresh operation is being properly performed at predetermined intervals, it is required to check whether there is any change by data access after the refresh operation is finished. However, this method accesses stored data whenever the refresh operation is finished, which uses much test time and there is no way of knowing where problems, if any, occur during the refresh operation.
FIG. 1 is a waveform view describing a self refresh operation of a semiconductor memory device.
First, with a test mode signal TM1 being enabled, when the memory device enters a self refresh mode by a command EXTERNAL COMMAND inputted from outside of the semiconductor memory device, a refresh timer provided therein generates a refresh enable signal OSC every preset period. The refresh operation is carried out whenever the refresh enable signal OSC gets activated. At this time, a clock enable signal CKE is at a logic low level, which is in a deactivation state. An internal clock is internally generated by buffering a system clock CLK provided from the outside. The internal clock is inputted to a counter provided in the semiconductor memory device, wherein the counter counts the internal clock. Meanwhile, when the refresh enable signal OSC gets in an activation state, control signals 01 and 02 of pulse shape are produced at a rising edge of the refresh enable signal OSC. The control signal 01 is used to latch a value counted in the counter and the control signal 02 is used to initialize the counter.
The value counted in the counter is latched in a register R/G until the refresh enable signal OSC is activated again, and then outputted to the outside through an input/output line I/O and a data output buffer DQ. In this manner, it is possible to know the refresh state at the outside by providing the counted valued stored in the register to the outside whenever the refresh enable signal OSC is activated. As shown in FIG. 1, after the refresh enable signal OSC is activated, the value 2710 counted in the counter is outputted to the outside when the next refresh enable signal OSC is activated.
However, even though it is possible to know whether the refresh operation is performed by outputting the counted value when the refresh operation is made, it is difficult to know the accurate refresh period and the exact location where the refresh operation is performed. This happens because the counted value can be outputted to the outside whenever the refresh operation is performed.


The disclosure presents methods and apparatus that can be used to generate a software source code according to a user-provided specification based on example snippets searched from the Internet or a local database, comprising: providing a user-defined specification of the target program including input data, output data, a function or algorithm, and other parameters; decomposing the function into sub-functions if necessary; searching a list of related programming example codes and snippets of each sub-function; analyzing and ranking the search results; selecting and extracting the best snippet source codes; refactoring and reformatting the codes; gluing and testing the generated codes. The final source codes are supposed to be compiled successfully and implement the desired function and meet the performance requirements. Even the final compilation success is not guaranteed the described method and apparatus can help on a best-effort basis and reduce a great effort in programming.

For a given software programming language, it has detailed references, specifications and examples of each function API, including syntax, parameter(s) required, return value(s), operation description, etc. However, this information is far from enough to guide a developer in composing a complete program for a given task, especially if the task is relatively complicated. Although there are a lot of code examples and snippets that can be collected from many channels and resources, it still requires great time and effort on the developers' part to search, collect, and digest code to produce a target program depending on their skills and experience.
Keeping up with the ever-evolving technologies in the software industry is becoming more and more difficult and pressuring. Popular program languages are evolving very quickly over time. For example, Fortran was once the most popular language for scientific and industry programming language; before being replaced soon after by C and C++. Now, the most widely used programming languages have become Python and a few web programming languages. Because of this issue, software development is becoming increasingly challenging, time-consuming, and difficult. It is also getting harder for software developers to gain enough experience.
Therefore, there is a need to automatically or semi-automatically generate the custom software program's source code based on the user's high-level requirements. The user only needs to define the input data and its data structure, the output data and its data structure, the software's desired functions or logic, and the miscellaneous configuration parameters like which program language is required, what the run-time performance is, and/or the dependent libraries for compilation.
A method that can automatically or semi-automatically generate the software is called software code generating. The corresponding system is called code generator. Existing code generators are limited in many ways. Many of them only generate to compiled software code instead of software source code, and only allow small deviations from the templates. They also do not store and use previously generated code that could be reused. As many programming models and algorithms are reusable, re-programming each of them again and again is a big waste of time and resources. Most of the existing source code generators can only generate code based on limited pre-defined code templates from local storage. None of the known code generating methods or generators use real-time Internet-sourced information, which may contain new data updated at the last second.
One of the useful Internet-sourced information is code snippets. In programming, a snippet is a small region of reusable source code, machine code, or text. Ordinarily, these are formally defined operative units to incorporate into larger programming modules. Code refactoring is the process of restructuring existing computer code, or changing the factoring, without changing its external behavior. It is intended to improve nonfunctional attributes of the software, such as enhancing code readability, maintainability, and extensibility. An Application Programming Interface (API) acts as a medium between two communicating entities or applications. It functions by sending some of the internal functions of the home application to a destination application. An API call is when an API is requested to fetch data from another application. Two snippets can each be refactored to meet the API requirements between them and combined to generate a piece of new code for an advanced function.
For any given task or problem, the high-level description can be split into four parts: input data, context or module logic, and output data, and configuration parameters. Input data refers to the initial data under processing. Context or module logic includes the main processing methods and functions. The output data is the expected final processed result. The configuration parameters could be language setups, run time environment, deployment requirements, etc.
The disclosure presents a novel method and system to offload developers' effort on programming language, by making use of existing code snippets and examples sourced from the Internet and a local code database to generate a software source code automatically or semi-automatically. The user only needs to define a high-level profile or requirements by providing a description of the input data, output data, function logic, and configuration parameters. The method and system present developers with either complete chained snippets woven together or chained snippet calls with added gluing codes in between. Each snippet may also have reference articles or usage examples explaining its principle and how it can be used. This provides developers with a quick and easy way to complete the basic programming code, which greatly shortens the overall software development time. The debugging process is also simplified, as the code snippets used usually have already tested and debugged. Since the snippets are collected from the Internet, which evolves organically with new technology, developers can easily stay up to date on new languages, algorithms, or programming methodologies.

Source code generation from web-sourced snippets


This invention provides a hologram thermal transfer sheet that can realize thermal transfer treatment with high efficiency. The thermal transfer sheet comprises a base material sheet and a transparent transfer layer provided separably on the base material sheet, characterized in that a hologram layer is provided on at least a part of the transparent transfer layer. There are also provided a process for producing the thermal transfer sheet and an image formed material produced by the transfer of this thermal transfer sheet.

Holograms is generally a record of an interference pattern of light and can realize visual perception of a change in color and three-dimensional images depending upon a light source or viewing angle. An advanced technique is required for the formation of the hologram, and even a slight distortion of the hologram image is visually easily perceived. Therefore, holograms have hitherto been utilized, for example, for preventing forgery or alteration of articles such as credit cards, bank cards, and ID cards.

Thermal transfer sheet, process for producing the same, and image formed object produced by transfer of said thermal transfer sheet


An electrical connector including a wire clamp that restricts wire movement within an electrical connector assembly to facilitate reducing wire chafing and arcing is described. The electrical connector assembly couples to at least one wire and also includes a backshell. The wire extends from an overbraid through the connector assembly to electrical pins. The backshell includes an overbraid clamping portion that includes exterior and interior surfaces, and an opening extending therebetween. The wire clamp includes two body portions that define at least one opening sized to receive the wire. A plurality of ribs extend into each wire clamp opening.

This invention relates generally to electrical connectors and, more particularly, to methods and apparatus for making electrical connections.
Complex wiring harnesess include electrical connector assemblies that connect wires leading from one system to another system. Known connector assemblies include a connector backshell. At least one wire is routed through the backshell and electrically connected to electrical contacts that include pins or sockets contained within the harness. A wire overbraid is installed circumferentially around the backshell to prevent the wires from being inadvertently pulled from the electrical connector assembly. The overbraid is terminated with a banding clamp.
Typically the connector assemblies contain electrical sockets that include a machined tube and leaf spring design that provide a contact force to retain pins extending from a mating connector within the socket. Due to the stiffness of the insulated wire, and since the wires are unrestrained within the backshell, relative motion between the system coupled to the connector assembly system and the system coupled to the receiving socket may induce vibration forces the pins. Additionally, motion may induce vibrations into the pins that is then induced into the wire. Such vibrations may cause arcing between the leaf spring and the mating pins, between adjacent contacts, or between the pins and the socket. Over time, continued arcing may lead to over-heating of the connection and/or eventual failure of the connector assembly.
In an exemplary embodiment, a wire clamp restricts wire movement within an electrical connector assembly and facilitates a reduction in arcing within the electrical connection and facilitates a reduction of wire chafing a backshell. The electrical connector assembly couples to at least one wire and includes the backshell and the wire clamp. The wire extends from an overbraid through the backshell to the electrical connector assembly to connect to electrical pins contained within the electrical connector assembly. The backshell includes an overbraid clamping portion including an exterior surface, an interior surface, and an opening extending therebetween. In the exemplary embodiment, the wire clamp includes a single or a multiple split body portion that defines at least one opening for receiving the wire. A plurality of ribs extend into each wire clamp opening and a banding clamp extends circumferentially around the backshell overbraid clamping portion.
In use, at least one of the portions of the wire clamp is inserted through the backshell opening and the wire is routed through the backshell. In a multi-split body portion, the second wire clamp portion is attached to the first wire clamp portion and the backshell overbraid clamping portion is inserted within the overbraid. The banding clamp is tightened around the overbraid and forces the first and second body wire clamp body portions together such that the ribs secure each wire to the backshell. The wire clamp restricts motion of the wires within the backshell, thus limiting motion of the electrical pins. As a result, the wire clamp facilitates reducing arcing between the electrical pins as a result of movement, and facilitates eliminating wire chafing within the backshell.

Methods and apparatus for electrical connections


This invention relates to a mechanism for tooth clearance adjustment and linear actuation. In certain aspects of the invention, a mechanism for gear clearance adjustment comprises a retaining element, on which a first gear wheel is mounted, and a carrier element, on which a gear rack or a second gear wheel is mounted. The carrier element or on the retaining element includes at least one clearance adjustment device arranged by a fastening device.

It is necessary for tooth meshing clearance and tooth tip clearance to be set on gear wheel or rack and pinion drives to achieve precise adjustment movement. If such a tooth tip clearance is too large, a traversing path may be incorrectly adjusted such that, for example, a machining operation on a workpiece, which is arranged on a traversable carriage, may be inexactly executed. If the tooth tip clearance is too small, there is increased wear between the gear rack and the gear wheel.
A linear actuator, in particular a rack and pinion drive, is known from DE 10 2004 448 A1, in which the tooth tip clearance between a gear wheel and a gear rack can be adjusted by means of an actuator. This actuator is known, for example, as a piezo actuator, a shape memory actuator, or an electrically or hydraulically operated actuator, which adjusts a gear wheel to the height of the gear rack in order to ensure zero backlash/freedom from play and dual-flank contact.
In order to achieve an adjustment of the tooth clearance and tooth tip clearance with a high level of accuracy, the existing version requires a very high-quality and space-consuming actuator and control system design, which is very expensive.

Mechanism for tooth clearance adjustment and linear actuation


A circuit for millimeter wave signals, having a housing, mounted on a circuit board, that accommodates a high-frequency component, wherein the housing forms, on at least one housing wall facing away from the circuit board, a coupling structure for millimeter wave signals to which a hollow conductor is coupled outside the housing.

Such circuits are used for example in radar sensors for motor vehicles in order to produce and/or process the radar signals. The high-frequency component is typically an integrated semiconductor component (MMIC, or Monolithic Microwave Integrated Circuit) that is encapsulated in a housing suitable for surface-mounting technique, for example an eWLB (embedded Wafer Level Ball Grid) housing. The fastening and electrical contacting of the high-frequency component on the circuit board takes place for example using spherical solder contacts. Via these contacts, both low-frequency signals used for power supply and to control the component and also the actual high-frequency signals are transmitted.
The object of the present invention is to create a circuit for millimeter wave signals that can be produced more easily.
According to the present invention, this object is achieved in that the housing forms, on at least one housing wall facing away from the circuit board, a coupling structure for the millimeter wave signals, to which a hollow conductor is coupled outside the housing.
According to the present invention, in this way the millimeter wave signals are coupled in and/or out immediately through the wall of the housing, bypassing the galvanic contacts on the side facing the circuit board.
This solution has the advantage that a high-frequency-capable substrate is no longer required for the circuit board, thus saving costs. Because the galvanic contacts are then used only to transmit low-frequency signals, they also no longer need be high-frequency-capable, so that larger production tolerances can be permitted, thus achieving further savings.
The term "hollow conductor" is also used here for hollow conductor structures whose hollow space contains a dielectric.
The housing wall on which the coupling structure is formed can be a side wall of the housing that is oriented at a right angle to the circuit board, or preferably can be the housing wall parallel to the circuit board on the side opposite the circuit board.
The coupling structure in the housing is preferably formed by a wave conductor that can be filled with a dielectric and that is realized in such a way that it conducts the millimeter waves to the housing wall and couples them out through this wall, so that further conducting can then take place via the hollow conductor situated outside the housing. Preferably, for this purpose the hollow conductor has, at its end adjacent to the housing, an adapting structure that provides a strong and largely impact-free coupling between the housing and a hollow conductor.
In an advantageous specific embodiment, the hollow conductor is formed in a hood that covers the housing and that can be mounted on the circuit board independently of the housing. This hood can at the same time form a wave trap that enables a reduction of the insertion loss. A plurality of coupling points for a plurality of hollow conductors can be formed on one and the same housing. In this case, at the same time the mentioned wave traps improve the insulation of the plurality of coupling points from one another.


A facility for authoring a document is described. The facility receives first user input that identifies content to be included in the document. The identified content is in a first form. The facility also receives second user input that specifies a transformation operation to be performed on the identified content in order to transform the identified content from the first form into a second form. The facility applies the specified transformation operation to transform the identified content from the first form into the second form for display.

It is common for electronic documents to be rigorously categorized into types: word processing documents containing mostly text; spreadsheets containing mostly numbers and formulae organized into a grid; slideshow documents organized into a sequence of slides having room for minimal content based on the typical need for them to be legible at a distance; business drawings in which text is associated with shapes connected in a particular configuration, etc. This rigorous categorization is related to the fact that different documents of different types are typically created and edited using different, monolithic applications. For example, word processing documents tend to be created and edited using a different application than spreadsheet documents.


A system and method for detecting radiation indicative of fire, such as forest fire. In one embodiment, a threshold energy level is determined based on ambient sensor conditions. A sensor unit may be setup to scan a predetermined area for electromagnetic radiation. Any detected electromagnetic radiation may then be band pass filtered to a wavelength range centered about a predetermined frequency associated with the presence of fire. The resulting energy level signal may then be further filter to pass only those signals which exhibit a “flicker” frequency. If the resulting filtered signal exceeds the threshold signal, a fire notification signal may then be generated.

1. Field of the Invention
The invention relates generally to the detection of radiation energy, and more particularly to the use of radiation sensitive sensors to detect physical phenomenon such as emergent forest fires.
2. Description of Related Art
With cities around the world becoming more severely congested and polluted, compounded by the high cost of living in urban areas, increasing numbers of the population are moving into the Wildland Urban Interface (WUI) —those areas where forest and grasslands border residential development. The appeal of a rural setting and the privacy of a larger parcel of land provide an idyllic environment for many families.
However, as more families move into the WUI, there are an increased number of shared boundaries between population and wildland areas. This has resulted in an increased risk of wildfire that endangers structures and lives. This is due in part to more human activity near wildland areas which increases the chance of fire from human; carelessness or unavoidable accidents; fires started by natural causes, such as lightning; and aesthetic landscape preferences often place decorative, fuel rich trees and bushes in close proximity to structures.
Wildland firefighters were originally trained in conventional methods and practices of dealing with wildfires in which there were minimal structures and human habitation. However, much of the development in the WUI has been oriented toward the aesthetics of living in a forested area, and has not incorporated fire safety features in the design of the roads, water systems, structures or landscaping. For example, in order to preserve the natural environment, road systems leading to the homes are often narrow and present difficult access challenges for multiple large, public safety vehicles in the event of an emergency. In view of these circumstances, there is increased reliance on homeowners to take more responsibility for their personal safety and for the protection of their homes.
The changing role and level of risk of the firefighter in the growing WUI necessitates a rethinking of responsibilities for safety. The current trend is for the homeowner to take more responsibility for their safety by incorporating a defensible space around their dwellings. This includes using landscaping that reduces fire risk by virtue of its location as well its level of fire resistance.
Increasing homeowner responsibility also necessitates incorporating means for detecting and suppressing fires quickly when they occur. There are a number of gels and foam products that retard fires and can prevent them from burning down structures when applied properly. There are many substantiated instances in which a properly foamed or gelled home escaped being burned by a voracious wildfire as it moved through the WUI. However, successful protection of a structure in a wildfire, regardless of the suppression technique employed, requires proper advanced notice and preparation. In the case of unoccupied homes, such vacation homes, there are presently no effective means for providing the necessary advanced notification of a proximate wildfire. Thus, there is a need for a system and method of providing the detection of a wildfires which avoids the aforementioned problems.


Process for the manufacture of dental or maxillo-facial prostheses, particularly endo-osseous prostheses or pivots, in which a layer of pure aluminum is deposited on a conductive substrate, preferably a metal, which forms the core of the prosthesis. The aluminum layer is obtained by electrochemical deposition of pure aluminum with non-aqueous electrolyte base of the type which has an aluminumorganic complex bath. The layer is then oxidized by anodization such that an alumina layer which is sealed and electrically insulated, is obtained, separating the core and the biological tissues surrounding the prosthesis.

1. Field of the Invention
The invention relates to the processes for the manufacture of prosthetic elements, such as dental and maxillo-facial elements, and elements produced by such processes.
2. Discussion of Background Information
A number of materials were tested for the purpose of reconstructing or repairing hard biological tissues, namely bones or teeth. These materials, often called biomaterials, should have appropriate mechanical properties and not cause chemical reactions detrimental for tissues coming into contact with a prosthesis made with these materials.
In this respect, the qualities of metal oxides, in particular those of alumina, Al.sub.2 O.sub.3, the principal oxide of aluminum are known. Indeed, alumina is an extremely chemically stable compound, and is therefore considered as being inert in a biological medium. In addition, the hardness of alumina, four to five times higher, depending on its state, than the hardness of titanium alloys makes it a biomaterial which is mechanically superior to widely used titanium alloys. Moreover, the cost of titanium alloys is high compared with that of alumina. Therefore, alumina is particularly advantageous for the production of prostheses for use in a biological medium.
Known processes for manufacturing alumina prostheses, or prostheses coated with alumina, do however have serious disadvantages. Indeed, at present, it is now known how to use alumina except in the form of deposited or projected ceramics, i.e., the production of a layer of alumina either consists in the sintering of powders which are then amalgamated or in a thermal spraying process (by means of an electron torch, for example). These techniques, applied to the coating of prostheses or implants are described for example in the U.S. Pat. No. 4,556,389, in EP-211 676, in FR-2 318 617, and in International Application WO 87/00030.
However, these techniques are disadvantageous because:
either the layer of alumina deposited on the prosthesis is thin, and the porosity of the ceramic causes a risk of bacterial invasion which could lead to an infection,
or the layer is thick, around several tenths to several millimeters, and is fragile, and brittle, in spite of a porosity liable to promote the osteogenesis (regeneration of the bone around the prosthesis) without risk of infection.
Moreover, in both cases, the interface between the prosthesis and the layer of sintered or sprayed alumina is not unalterable since there only exists a mechanical retention between these two media. The layer of alumina is therefore not particularly adhesive.
Finally, should be noted that sintering and thermal spraying are not adapted to the deposit of ceramics on complex shapes, such as a threading, that occur frequently on prostheses or implanted prosthetic elements. These processes result in heterogeneous deposits of varying thickness covering the shapes. Moreover, even if it remains possible to reshape a profile in a layer of alumina ceramic which is sufficiently thick, the hardness of this oxide makes the work difficult and not very accurate.

Process for the manufacture of prosthetic elements and elements produced thereby


Embodiments of computer-implemented methods, systems, computing devices, and computer-readable media (transitory and non-transitory) are described herein for accelerating a task that includes operation of a plurality of software modules among a plurality of parallel processing threads. In various embodiments, operation of the software modules may include postponement of operation of a first of the plurality of software modules in a first of the processing threads until a determination that the first software module is not deemed in operation. In various embodiments, the first software module may be deemed in operation while itself in operation or while awaiting completion of operation of any other software module called by the first software module.

The background description provided herein is for the purpose of generally presenting the context of the disclosure. Work of the presently named inventors, to the extent it is described in this background section, as well as aspects of the description that may not otherwise qualify as prior art at the time of filing, are neither expressly nor impliedly admitted as prior art against the present disclosure. Unless otherwise indicated herein, the approaches described in this section are not prior art to the claims in the present disclosure and are not admitted to be prior art by inclusion in this section.
Proper use of parallel computing can greatly enhance the efficiency of computing, providing a better user experience. For example, as use of mobile computing devices such as smart phones and computing tablets increases, start-up times become more important to the user experience. During system boot, multiple boot modules (e.g., software executable images) may be operated to initialize multiple devices and/or interfaces of a computing device. Many mobile computing devices have multiple processors, and thus are capable of parallel execution of software. However, boot modules typically are designed for serial operation.

Operation of software modules in parallel


There is provided a screw for fastening a wooden member which includes: a shank that extends along a datum line; a head that is disposed at an end of the shank and has a plate portion having a cross-section that narrows as it goes to the shank such that the boundary of the cross-section and the datum line make a plate angle; and a tapered blade that protrudes from the outer side of the plate portion, has a bottom perpendicular to the datum line and a side making an obtuse angle with the bottom, and has a taper angle that is made by the side and the datum line and is 2.50° to 12.5° smaller than the plate angle.

Field of the Invention
The present invention relates to a screw for fastening a wooden member.
Description of the Related Art
In general, screws are used to fasten furniture or wooden members for construction.
In use of screws in the related art, a user combines objects by forming a screw hole in one of the objects and then tightens a screw in the hole. Accordingly, there is a need of a first step of forming a hole and a second step of inserting a screw into the hole. Therefore, the entire process is complicated and there is a limit in increasing efficiency of work by reducing the work time.
As an alternative, drill type screws with a blade on the end of the shank have been used. The drill type screws can be driven into a wooden member riot through two steps, but at a time.

Screw for coupling wooden members together


An image forming apparatus, which realizes a buffering function which enables post-processing without decreasing the productivity and increasing the size. At least one image is formed on a sheet. A double-sided sheet conveying path is provided, which the sheet passes when being conveyed back to the image forming unit again to form an image on an opposite side surface of the sheet after an image is formed on one side surface of the sheet. A retaining member is provided on the double-sided sheet conveying path to retain the sheet on the double-sided sheet conveying path. A post-processing device carries out post-processing on sheets on which images have been formed by the image forming unit. A CPU circuit section, which controls conveyance of the sheet, provides control to convey the sheet on which the at least one image has been formed by the image forming unit to the double-sided sheet conveying path, cause the retaining member to temporarily retain the sheet on the double-sided sheet conveying path, and then convey the sheet to the post-processing device.

1. Field of the Invention
The present invention relates to an image forming apparatus such as a copying machine and a laser beam printer, and an image forming method.
2. Description of the Related Art
There has been known an image forming apparatus having a post-processing apparatus connected to a sheet discharge opening of the image forming apparatus to carry out various types of post-processing including stapling, punching, folding, and book binding for sheets on which the image forming apparatus has completed image formation.
When the post-processing apparatus is made to carry out the post-processing, it is necessary to keep long enough the intervals which are constant and at which sheets are discharged from a main body of the image forming apparatus, or to temporarily pool or buffer the discharged sheets on a stage prior to a post-processing section of the post processing apparatus (a buffering function), so as not to disturb or hinder the post-processing carried out by the post-processing section. Among inexpensive image forming apparatuses with a low productivity, there is a type which is adapted to widen the intervals at which sheets are discharged, but many image forming apparatuses are generally provided with the buffering function so as to increase the productivity, as disclosed in Japanese Laid-Open Patent Publication (Kokai) No. H11-130328 and Japanese Laid-Open Publication (Kokai) No. 2001-097631.
However, if the main body of the image forming apparatus or the post-processing apparatus incorporates the buffering function, a space occupied by a buffering section, a drive mechanism used for the buffering section, and other component parts pose a problem that the main body of the image forming apparatus or the post-processing apparatus increases in size. This also leads to an increased cost.

Image forming apparatus having a post-processing apparatus with a controller for controlling conveyance of double-sided sheets


An apparatus for heating and cooling an article is provided. The apparatus comprises an enclosure having top, bottom, and side walls and an entrance and an exit. A first belt system comprising one or more belts extends from a loading position through a portion of the enclosure. The first belt system has a loading end and an unloading end. A second belt system comprising one or more belts extends from the unloading end of the first belt system to an unloading position. The second belt system has a loading end and an unloading end. The enclosure includes one or more heating sources positioned adjacent the first belt system for heating the first belt system.

"Wafer bumping" refers to a semiconductor packaging technology that prepares microchips for flip chip attachment onto an integrated circuit package or other electronic assembly. There are numerous different methods of wafer bumping, but the process typically involves placing tiny amounts of electrically conductive material onto the input/output pads of a wafer and then subjecting the wafer assembly with the electrically conductive material to a thermal process known as mass solder reflow. Controlling the wafer temperature is critically important to allow the solder to reflow while at the same time preventing damage to the wafer.
One prior art method of performing a solder reflow process is known in the industry as hot-plate technology. Hot-plate technology utilizes conduction, where the wafer is placed on a flat thermal mass precisely maintained at a given temperature. Conduction heating of the type employed in hot-plate technology is beneficial because the temperature of the wafer will not go higher than the temperature of the thermal mass (hot-plate) on which the wafer is sitting. Traditionally, hot-plate technology requires a system having multiple isolated hot plate stages and a means of moving the wafer to be reflowed from stage to stage to achieve proper heating.
There are several disadvantages to the prior art hot-plate type reflow system. First, because of their thermal mass, hot plates are slow to heat up and to cool down. Therefore, a lot of production time is lost when it is necessary to change set point temperature for a high temperature solder alloy to a lower temperature for a low temperature solder. Second, a pusher bar is typically used to push wafers from stage to stage. Spacing between pusher bars are established for a particular sized wafer, for example, eight-inch and twelve-inch wafers, etc. If the equipment is used with smaller wafers than it was designed for, production capacity is lost. Third, fluxes residues are formed from the wafers as they are heated, and the fluxes residues accumulate on plate surfaces. One source of flux is an organic acid that is put on a wafer to provide viscosity and to remove oxides on metal surface that inhibit good electrical connections. When passing through the various hot plates, the wafers get dirty from being pushed through the condensed fluxes, and have to be cleaned in an additional, costly step.
Fourth, commercially available hot plate equipment does not provide a controlled atmosphere surrounding the reflow and cooling areas that is capable of maintaining an inert atmosphere or reactive gas atmosphere that contains less than five parts per million oxygen molecules, and so allowing oxidation to occur. Fifth, the gas that is used in the prior art systems to control atmosphere causes wafer movement which makes in line processing using cassette to cassette loading equipment more difficult to use. Sixth, the condensed fluxes must frequently be manually removed from numerous parts of the hot-plate equipment causing significant lost production time and considerable expense.

Apparatus and method for heating and cooling an article


A video projection device includes an optical engine which projects video light, an aspherical mirror which reflects the video light projected by the optical engine with a reflective surface formed in a rotationally symmetrical shape centering on an optical axis, a reflective screen on which the video light reflected by the aspherical mirror is projected, a shielding housing which houses the optical engine, the aspherical mirror, and an electric circuit portion which electrically drives the optical engine, and a strut member which connects a rear surface portion of the shielding housing, and a rear surface portion of the reflective screen in a state where the rear surface portion of the shielding housing and the rear surface portion of the reflective screen are positioned.

Field of the Invention
The present invention relates to a video projection device that displays, on a large-sized reflective screen, a video enlarged and projected from an optical engine including a reflective image forming element such as a DMD.
Description of the Background Art
For example, a reflective front projector described in Japanese Patent Application Laid-open. No. H05-336479 (1993) includes a console housing in which a projection unit emitting video light and an electric circuit portion are installed, a large-sized reflective screen is fixed to the front upper part of the console housing, and a plane mirror which reflects the video light emitted from the projection unit is arranged on the front part of the console housing. This reflective front projector is configured such that the reflective screen fixed to the front upper part of the console housing is housed in the console housing when the reflective front projector is not used as a projector because a video is not seen.
The plane mirror reflecting the video light is installed on a movable front board with respect to the console housing, and the front board is housed in the console housing when the reflective front projector is not used as a projector. After the reflective screen and the front board with the plane mirror installed thereon are housed in the console housing, the reflective front projector can be used as a box-shaped TV stand since the top surface of the console housing is flat, and space saving of the device when not used as a projector is realized.
Such a device has a problem that, each time a video is seen, it is necessary to take out the housed screen from the console housing and pull out the housed front board with the plane mirror installed thereon, which requires time and effort. Additionally, the device has a problem that the front board is opened at the time of use, scattered light of projection light from the projection unit toward the plane mirror affects a screen surface, and the resolution feeling of a video projected on the screen is lowered. Furthermore, it has been demanded that screen distortion on the screen is reduced as small as possible.


A method of controlling the operation of an electrohydraulic brake booster to achieve a desired pedal feel. The method includes sensing brake pedal movement from a fully retracted rest position before a significant resistance to travel of the brake pedal is developed. The method further includes generating a command pulse that results in application of pressurized hydraulic fluid to the boost piston assembly sufficient to overcome preloaded spring forces and seal friction in the boost piston assembly that would otherwise tend to resist further brake pedal travel. The method further includes providing a control signal override when a brake pedal "bounce" condition is detected to avoid undesired vehicle braking. A brake pedal bounce condition may occur if the brake pedal is released suddenly so that the brake pedal returns to the fully retracted rest position rapidly enough to bounce off of a mechanical stop at that position and move in the brake apply direction.

This invention relates in general to brake systems for motor vehicles, and in particular to a method of controlling electrohydraulic boosters for vehicle brake systems.
Conventional vehicle brake systems are constructed such that the braking force developed by the system is generally proportional to the force applied by the vehicle operator on a vehicle brake pedal. The pedal is linked to a piston in a master cylinder that moves to pressurize the fluid of the brake system, and thus actuate the individual wheel brakes. Generally, in order to provide a sufficiently high pressure to operate the wheel brakes without requiring an excessive effort by the operator, most vehicles include a "boosted" power brake system wherein the force applied to the brake pedal by the operator is amplified or boosted before being applied to the master cylinder. In automobiles and light trucks, this is typically accomplished by incorporating either a vacuum or hydraulically operated boost piston assembly between the brake pedal and the master cylinder.
Vacuum operated boost piston assemblies utilize the pressure differences between the atmosphere and the vehicle's engine vacuum to develop a force across a boost piston or diaphragm. The force developed by this differential pressure across the boost piston may be many times that that could be developed by the operator by pressing against the pedal, and is applied to the piston of the master cylinder to actuate the brakes.
In brake systems with electrohydraulic brake boosters, hydraulic boost piston assemblies utilize the pressure developed by a hydraulic system, such as the vehicle's power steering system, to apply a force to a boost piston that is connected to operate a master cylinder of the brake system. Hydraulic boost piston assemblies of this type, and the associated brake boost pressure control systems, are described, for example, in International Patent Application Nos. PCT/US97/08151 and PCT/TJS97/07640, the disclosures of that are hereby incorporated by reference. The force applied to the piston of the brake system master cylinder via the boost piston of the hydraulic boost system, may be many times that that could be applied by the operator of the vehicle without a boost system. Electronic controls are provided that regulate the application of force by the boost piston according to pre-programmed instructions. Because of this electronic control of the hydraulic brake boosters, these brake boosters can easily be integrated into systems where the electronic control of the brake boost is used for traction control (TC), anti-lock braking (ABS), vehicle stability control (VSC), hill hold, theft protection, collision avoidance, panic brake assist, brake induced vehicular deceleration control, brake pedal travel control, and brake "pedal feel" characteristic tailoring. "Pedal feel" refers to the relationship between the force a driver applies to a brake pedal during vehicle braking and the resultant movement of the brake pedal.

Electrohydraulic brake booster and method of controlling same for smooth brake pedal feel


A photovoltaic device and method of making same. A layer of p-doped microcrystalline diamond is deposited on a layer of n-doped ultrananocrystalline diamond such as by providing a substrate in a chamber, providing a first atmosphere containing about 1% by volume CH4 and about 99% by volume H2 with dopant quantities of a boron compound, subjecting the atmosphere to microwave energy to deposit a p-doped microcrystalline diamond layer on the substrate, providing a second atmosphere of about 1% by volume CH4 and about 89% by volume Ar and about 10% by volume N2, subjecting the second atmosphere to microwave energy to deposit a n-doped ultrananocrystalline diamond layer on the p-doped microcrystalline diamond layer. Electrodes and leads are added to conduct electrical energy when the layers are irradiated.

The efficient conversion of solar energy into electricity has been a major goal of the global search for renewable energy sources. Considerable progress has been made in this search with the development of photovoltaic devices based on silicon (Si). The Si solar cell depends on the fabrication of p-n junctions usually produced by doping Si with B (p-type) and with P (n-type). Single crystal Si, polycrystalline Si, or amorphous hydrogenated Si can be employed. With the latter material, thin film ˜1 μm thick cells can be constructed because of the high absorption coefficient of amorphous Si for solar radiation compared to crystalline Si. Solar cells based on Si have a theoretical conversion efficiency of 22%. However, various loss factors prevent one from reaching the theoretical efficiency and thin film cells generally have conversion efficiencies of 5-8%. One of the principal reasons for the low conversion efficiency is the fact that the band gap of Si is ˜1 ev. Solar photons with energies less than 1 ev are not effective in generating an electrical current. On the other hand, photons with energies higher than 1 ev appear to generate no more than one electron-hole pair so that much of the excess energy is degraded to lattice vibrational energy and appears as heat. To improve cell performance, composite cells have been developed consisting of several materials stacked one on top of the other. The variation in the band gaps of these materials allows selective absorption of photons of different energies to occur so that the overall efficiency of such a composite cell is increased. Fabrication of such composite cells of course increases the cost of the devices considerably.
An intensive search has been made during the last twenty years for materials that would allow one to increase the photon to electricity conversion efficiency without adding substantially to the cost of the photovoltaic cells. A material for this purpose ideally would have the property of making optimal use of photons with energies spanning the solar spectrum on the surface of the earth, that is to say photon energies in the range of 0.5-5 ev. To make use of the solar photons, the material must have a high absorption coefficient over the entire solar spectral range. The material should have a wide band gap of 5-6 ev, be electrically conducting, and be capable of being doped both n and p type. Furthermore, the electronic structure and the electron-photon coupling must be such as to allow the creation of electron-hole pairs which are effective in sustaining an electric current with good quantum efficiency over the whole solar spectral range. Considering the stringent materials requirements which have just been enumerated, it is not surprising that no material has been found up to now which satisfies all of the above named criteria.
The present invention is a new photovoltaic device based on carbon in the form of diamond which can function as a high efficiency solar cell and a method of making same. The discovery, development characterization and uses of ultrananocrystalline diamond films (UNCD) that is diamond having average diameters in the range of from about 3 nanometers to about 15 nanometers has been the subject of a number of earlier patents, such as U.S. Pat. No. 5,989,511, and Ser. No. 10/398,329 filed Apr. 4, 2003, the disclosures of which are herein incorporated by reference, teach the nitrogen doping of UNCD films to enhance the electrical conductivity and therefore the electron emission and electrochemical properties of UNCD. The nature of the carriers giving rise to the conductivity has been found to be n-type by Hall effect measurements.

The United States of America as represented by the United States Department of Energy


A wide-angle optical system includes a first group having negative and positive lenses, a second group having a catadioptric optical element, and a third group. The catadioptric optical element includes a first surface at an object side, a second surface at an image side, and a third surface. The first surface has a first transmission surface and a first reflection surface disposed therearound. The second surface has a second transmission surface and a second reflection surface disposed therearound. The third surface is a circular conical transmission surface that is disposed between the first surface and the second surface and an apex of which is located at the object side.

A known optical system includes a first optical element having negative refractive power and a second optical element having positive refractive power. The first optical element causes forward light to be transmitted therethrough and causes lateral light to be reflected at a reflection surface located at the image side. The second optical element combines the two light paths from the front and lateral directions via the first optical element so as to form images thereof on a single image acquisition element. The optical system thus has a super-wide field angle so that both forward and lateral images can be observed at the same time (for example, see Patent Literatures 1 and 2).
In the optical system in Patent Literature 1, lateral light is refracted after being incident on a cylindrical surface of the first optical element, is sequentially reflected once at the reflection surface located at the image side and once at a reflection surface located at the object side opposite from the image side, and is subsequently transmitted through a transmission surface provided near the central axis at the image side so as to be incident on a positive optical element.
In Patent Literature 2, lateral light reflected only once at the reflection surface at the image side of the first optical element and forward light refracted after coming from the object side and transmitted through the transmission surface at the image side are incident on the positive optical element.


A bone tap may be used to deliver fluid into bone to stabilize and/or strengthen the bone. The bone tap may include a passage. A distal portion of the bone tap may be threaded. In some embodiments, openings in a distal portion of the bone tap may communicate with the passage. The bone tap may be driven into bone, and material may be introduced to the passage. Material introduced to the passage may enter the bone through the openings. Thread flights of the bone tap proximal to the openings may inhibit retrograde backflow of material during introduction of the material into the bone. Material deposited in the bone may strengthen a bone and/or augment fixation of a bone fastener in the bone.

1. Field of the Invention
The present invention generally relates to apparatus and methods for treatment of human bone. Embodiments of the invention relate to spinal stabilization systems and methods that may be used to treat damaged or diseased bone. Embodiments of the invention relate to systems and methods used to augment fixation of bone fasteners. Embodiments of the invention relate to systems and methods used in vertebroplasty.
2. Description of Related Art
Bone may be treated for damage or degeneration arising from a variety of causes, such as trauma, disease, and/or aging. For example, stabilization of a spine may involve implantation of a system to provide fixation of a portion of the spinal column. As another example, treatment of diseased bone tissue (e.g., a bone tumor) may involve removal of the tumor followed by stabilization procedures to strengthen and/or support remaining bone.
Weakened or softened bone may be difficult to treat with conventional stabilization techniques. For example, spinal stabilization procedures may fail in osteoporotic vertebrae. Osteoporosis (i.e., a bone condition characterized by reduction in bone mass and increased susceptibility to fracture after minimal trauma) may cause loosening and/or pullout of bone fasteners, possibly leading to failure of the spinal stabilization system. Pullout strength may be increased by introducing bone cement (e.g., polymethylmethacrylate) into bone proximate a bone fastener. U.S. Pat. No. 6,565,572 to Chappius, which is incorporated by reference as if fully set forth herein, describes a fenestrated surgical screw. The design allows material to be delivered through a passage in a body of the screw into a skeletal member. Holes in the shank of the screw communicate with the passage and allow injected bone cement to pass into bone surrounding the screw. After curing, the bone cement fixes the screw in place in the bone. A fenestrated bone screw that has been cured in place may be difficult to remove should a subsequent procedure be necessary due to infection, further injury, and/or other causes.
Treatment for fractured or diseased bone may include minimally invasive procedures such as vertebroplasty. In a vertebroplasty procedure, bone cement may be injected into a vertebra to stabilize a fracture and relieve pain associated with the fracture. Other treatments may include steps to restore a natural height of a fractured vertebra followed by injection of bone cement or other material into a cavity in the vertebra. For example, a surgeon may use an inflatable balloon to compact bone, then inject a biomaterial into a cavity. Such balloon procedures have been referred to as "kyphoplasty," and equipment for such procedures may be available from Kyphon, Inc.
One method for introducing bone cement into a vertebra is through a biopsy needle (e.g., a Jamshidi® needle) inserted in an opening in the bone. Limitations of such methods of cement introduction may include retrograde flowback of bone cement along the needle and limited vertebral body fill. Local complications from bone cement leakage (i.e., retrograde flowback) may include radiculopathy and cord compression. Systemic complications from bone cement leakage may include fever, infection, pulmonary embolism, fat embolism, hypoxia, hypotension, myocardial infarction, and sudden death.


A mobile phone (1) includes: a blank area detection section (55) which detects a blank area whose size is determined by subtracting, from an entire area of a display screen, an image display area where an image is displayed and a character string display area where a character string is displayed; and a reposition control section (51) which changes the position or size of at least one of the image and the character string from an initial state, in such a way as to allow the image and the character string to be displayed in a single display screen. On this account, an image and a character string associated therewith are efficiently displayable in a single screen.

In accordance with the improvement in functions of mobile information terminals, image data which has typically been received by large information terminals such as desktop PCs becomes receivable and viewable by mobile information terminals such as mobile phones.
Since a mobile information terminal has a small display screen, characters in an image to be viewed may be blurred due to downsizing of the image and may not be illegible.
In this regard, Japanese Laid-Open Patent Application No. 2003-108284 (published on Apr. 11, 2003) discloses an image display apparatus arranged such that a display area of the image display apparatus is divided into two areas, and an image is displayed in one sub display area whereas a, character string in the image is displayed in the other sub display area.
This conventional art, however, is disadvantageous in that, since the size of the sub display area for character string is fixed, the sub display area may not be possible to display all of the character string if the number of the characters is large or if the character size is increased in consideration of viewability. Also, on the other hand, when the number of characters to be displayed is small, a redundant part of the sub display area cannot be used for displaying an image. The display area is therefore not effectively used.

Display apparatus, method for display, display program, and computer-readable storage medium


Imaging apparatus and methods of homogenizing ink are described. In one implementation an imaging apparatus includes an ink supply to provide ink to be used in printing, and a printhead to apply the ink during printing. A conduit system couples the ink supply and the printhead in fluid flowing relation. A pump is operably coupled to the conduit system. In operation, the pump causes the ink to circulate between the ink supply and the printhead. A timing device measures an idle-time since the pump was last in operation. A controller receives the idle-time measurement from the timing device, and actuates the pump when a selected idle-time is reached. In another implementation, a method for homogenizing ink includes providing a pump, then automatically actuating the pump to homogenize ink within an ink delivery system each time the ink delivery system has been resting for a selected idle-time.

A wide variety of imaging apparatus and printing devices are used to produce printed materials. Such printing equipment typically includes an ink delivery system which functions to deliver liquid ink from an ink supply to one or more printheads. The printheads then apply the ink to an imaging media.
One popular type of printing apparatus are the ink-jet printers. Ink-jet printers are widely used as a means of producing high quality printing. A typical ink-jet printer includes an ink delivery system which delivers ink to one or more printheads. Each of these printheads generally has several nozzles which function to eject ink during the printing process.
As a popular printing apparatus, ink-jet printers are used in a variety of settings, and are subjected to a range of operating conditions and demands. For example, some ink-jet printers are used frequently, while others are used rarely and thus experience extended idle times. Some ink-jet printers remain stationary in an office or home, while others are transported to various locations where they are used to perform printing functions. Ink-jet printers are subjected to a variety of environmental conditions, which may include, but are not limited to, extreme temperatures, varying degrees of humidity, air-borne pollutants, direct sun-light and frequent movement. As a result of these diverse use patterns and operating conditions, ink-jet printers operate under a variety of environmental conditions. One situation that may result from long idle times or varying environmental conditions is a thickening of the ink within the printhead due to fluid loss (i.e., vaporization or migration of the carrying fluid used to transport the ink pigments), which can cause poor print quality or printhead failure. To accommodate these diverse use patterns and operating conditions, it is desirable to develop printing apparatus which will satisfy such demands.

Imaging apparatus and methods for homogenizing ink

Hewlett-Packard Development Company, L.P.


A filter medium for strainers used in the emergency sump of a nuclear power plant ECCS. The filter medium is employed with double wall, concentric tube type strainer modules. The filter medium is preferably constructed of a woven or knitted stainless steel wire material and is shaped in a cylinder so that it can be inserted between two concentric strainer walls, concentric tube type strainer in such a manner that water that passes through the strainer must pass through and be filtered by the filter medium before the water can be pumped to the reactor core. The filter medium is inserted through the bottom of the strainer module and is held in place by an x-shaped retainer. The filter creates varied approach velocity of the fluid and results in non-uniform fibrous debris accumulation on the strainer, insuring acceptable strainer debris hydraulic head loss.

1. Field of the Invention
The present invention relates to a filter medium that is used in conjunction with concentric tube type strainers used in emergency core cooling systems (ECCS) of nuclear power plants. Specifically, the present invention is a woven or knitted stainless steel filter medium that is inserted between an external and an internal double wall concentric tube type strainer and through which water must pass and be filtered after the water passes through the strainer and before the water can be pumped to the reactor core. This filter medium alters the approach velocity of the water at the strainer surface resulting in non-uniform fibrous debris accumulation on the strainer surface which better insures acceptable strainer debris hydraulic head loss.
2. Description of the Related Art
The containment sump, which is also known as the emergency or recirculation sump, is part of the Emergency Core Cooling System or ECCS of a nuclear power plant. The ECCS is one of several safety systems required by the Nuclear Regulatory Commission or NRC in every nuclear power plant constructed in the United States. The ECCS is required in order to mitigate a design basis accident.
The containment sump collects reactor coolant and chemically reactive spray solutions following a loss-of-coolant-accident or LOCA. The containment sump serves as the water source to support long-term recirculation for the functions of residual heat removal, emergency core cooling, and containment atmosphere cleanup. Thus this water source and related equipment are important safety components of the nuclear power plant.
Typically, the containment sump is surrounded by a debris strainer to prevent debris from entering the ECCS suction lines. The strainer is constructed with a plurality of perforated strainer modules that serve to strain and filter out fibrous and particulate debris and other material from recirculation water that enters the nuclear power plant containment sump during an emergency core cooling event. It is important to filter out this debris from the water before the water passes into the pumps of the ECCS. Debris can block or restrict flow through the openings in the strainer or, if allowed to pass through the strainer and into the pumps of the ECCS, can damage the ECCS pumps and components in the systems served by the ECCS pumps such as the reactor.
The present invention reduces or eliminates debris and other material that potentially passes through the strainers used in nuclear power plant containment sumps. For a typical strainer, debris quantities that can bypass or pass through the openings of the emergency strainers are typically on the order of five percent or more of the total debris and material that deposits onto the strainer surface. Thus a significant amount of debris typically will pass through the strainer. The amount of debris and material passing through the strainer has been shown to have potentially adverse affects on equipment and components downstream of the strainer. This can include excessive wear, plugging, blockage, fouling, etc. This can result in equipment failure, decreased equipment life, clogging of the reactor fuel cooling paths, etc. Hence the purpose of the present invention is to reduce or eliminate the bypassing of debris and material in order to minimize or eliminate adverse affects on downstream equipment and components.
The nuclear power industry has not employed any type of filter medium in association with the strainers that could become clogged because this could result in loss of head pressure, cause loss of suction on the pumps resulting in cavitation, and thereby preventing the flow of cooling water to the reactor. Thus, the addition of filter medium to the strainers goes against current practice in the industry.
The present invention consists of the primary strainer device, which is typically constructed of perforated stainless steel, coupled with a custom designed filter medium insert of stainless steel knitted or woven wire mesh. The drawings that are attached depict a particular perforated strainer design and utilize a cylindrical knitted wire mesh shape filter medium to act as the secondary filter. However, the filtering medium can be produced in various shapes and configurations for use with different strainer configurations.
The knitted or woven wire mesh filter medium is customized by using various diameters, densities, crimping styles, and configurations to optimize the reduction of bypassed debris and other material for each particular application. The knitted or woven wire mesh is located inside of or on the downstream side of the primary strainer and, as such, serves as a secondary filtering medium, with the strainer serving the primary filtering function. The debris straining effect of the primary strainer combines with the secondary filter to produce a system that greatly reduces bypassed debris and other material potentially encountered during recirculation operation of the ECCS and it does so with no significant increase in fluid pressure drop across the combination strainer and filter.
The combination strainer and filter of the present invention produces two physical factors that reduce or eliminate the bypassing of debris and other material. The first is bypass resistance and the second is entrapment of the debris or other material on the filter medium.
Bypass resistance is the physical resistance to debris and other material from passing through openings in the primary strainer. Use of the knitted or woven wire mesh secondary filter medium in combination with the strainer causes an increase in bypass resistance associated with the primary strainer. This bypass resistance factor tends to cause a significant fraction of the debris and other material that may otherwise pass through the primary strainer to remain on the upstream surface of the primary strainer.
For debris and other material that manages to pass through the openings in the primary strainer, the knitted or woven wire mesh secondary filter medium entraps most, if not all, of the remaining debris and other material within the convoluted wire mesh structure, and thus prevents it from passing into the downstream flow of cooling water traveling to the ECCS pumps.
The present invention is designed to function as a totally passive device without requiring electrical power, periodic replacement, or human intervention or operation, other than periodic inspections approximately once every 18 to 24 months. The use of stainless steel material for the filter medium will ensure the present invention has long term functionality, will not be affected by corrosive conditions, and can remain submerged in the containment water conditions expected following a postulated LOCA.
As discussed in U.S. Nuclear Regulatory Commission (NRC) Regulatory Guide 1.82, Revision 3, "Water Sources for Long Term Recirculation Cooling Following a Loss-of-Coolant Accident", an emergency core cooling recirculation strainer system needs to be designed and evaluated to address a "thin bed" of fibrous debris. It is commonly known from industry testing that this "thin bed" of fibrous debris combined with a large particulate debris load can result in significant clogging and blockage of water flow through the strainer system. A desired feature of the strainer system is for the strainer system to accumulate or "load" fibrous debris in a non-uniform debris pattern. A thin uniform layer of fibrous debris combined with particulate debris can produce significant blockage.
However, if the fibrous debris accumulates thicker in one area and thinner in another area, the blockage of water flow will be less, resulting in less hydraulic head loss through the strainer system.
The present invention enhances the non-uniform fibrous debris accumulation on the surface of the strainer. In addition to the secondary filtering capabilities of the present invention, the knitted woven wire mesh filter provides an internal flow resistance medium within the strainer. The water flow path is first through the strainer surface, then through the filter medium and finally into the general flow stream to the suction of the emergency core cooling system. This flow path, which passes radially through the filter medium along the length of the strainer, produces an increasing pressure drop of the fluid until exiting the strainer into the general flow stream. This increasing pressure drop results in a varied approach velocity of the bulk fluid to the strainer surface such that the approach velocity is higher at the base of the strainer and lower at the end of the strainer. This varied approach velocity of the bulk fluid results in fibrous debris accumulating in a pattern of a thicker debris bed accumulation at the base of the strainer tapering to a thinner debris bed at the end of the strainer. This non-uniform debris accumulation feature enhances the present invention's ability to accommodate "thin bed" fibrous debris loads to better insure acceptable strainer debris hydraulic head loss.

Filter medium for strainers used in nuclear reactor emergency core cooling systems