The present invention provides a RFID tag structure having anti-reuse function, comprising a substrate; a pattern formed on a surface of the substrate; and an adhesive layer provided on a surface of the pattern which is not in contact with the substrate, wherein the adhesive forces of the adhesive layer are stronger than the binding strengths generated between the pattern and the substrate, and the adhesive layer is capable of being adhered on an article to be adhered and a RFID tag is formed thereby; when the RFID tag is separated from the article to be adhered, the substrate is released from the article to be adhered, the pattern and the adhesive layer are still remained on the article to be adhered, thereby preventing the RFID tag from being reused and fulfilling the objective of anti-reuse and anti-counterfeit. The present invention also provides a manufacture method thereof.

1. Field of the Invention
The present invention relates to a RFID tag structure and manufacture method thereof, especially to a RFID tag structure having anti-reuse function and manufacture method thereof capable of fulfilling the objective and purpose of anti-reuse.
2. Description of Related Art
A radio frequency identification (RFID) tag can be used to record the production locations, manufacture procedure, logistic quality control and other management purposes, and the specified codes in a chip contained in the tag can be used for fulfilling anti-counterfeit function. As such, utilizing the RFID tag to perform product identification for fulfilling the purpose of anti-reuse and anti-counterfeit is a main stream in the marketplace.
Referring to FIG. 1, which is a schematic view illustrating the application of a conventional RFID tag. As shown in FIG. 1, when a conventional RFID tag 100 is used, the RFID tag 100 is adhered on an article 200 to be adhered, wherein the adhered article 200 is e.g. but not limited to a plastic film, and several cutting lines 210 are formed on the RFID tag under the condition of not breaking the natural function of the RFID tag 100; when the RFID tag 100 is desired to be separated from the adhered article 200, a pattern 110 formed on the RFID tag 100 would be broken along the cutting lines 210, thereby fulfilling the objective of anti-counterfeit and preventing the RFID tag from being reused. However, if a person carefully and intentionally removes the RFID tag 100, the pattern 110 can still be completely remained after the removal, so the RFID tag 100 may be reused, thereby the uniqueness of the RFID tag 100 is no longer provided.


A system including initialization, imaging, alignment, processing, and setting modules. The initialization module obtains patient parameters for a patient and procedure and surgeon parameters. The initialization module selects first settings for an x-ray source based on the patient, procedure, and surgeon parameters. The image module obtains a first sample set of images of a region-of-interest of the patient and a master sample set of images. The first sample set was acquired as a result of the x-ray source operating according to the first settings. The alignment module aligns the first sample set to the master sample set. The processing module processes pixel data corresponding to a result of the alignment based on a pixel parameter or one of the patient parameters. The setting module adjusts the first settings to provide updated settings. X-ray dosage associated with the updated settings is less than x-ray dosage associated with the first settings.

This section provides background information related to the present disclosure which is not necessarily prior art.
A subject, such as a human patient, may select or be required to undergo a surgical procedure to correct or augment an anatomy of the patient. The augmentation of the anatomy can include various procedures, such as movement or augmentation of bone, insertion of implantable devices, or other appropriate procedures. A surgeon can perform the procedure on the patient based on images of the patient, which can be acquired using an x-ray scanner having an imaging system. The images may be acquired prior to, during and/or subsequent to the procedure. The imaging system may be, for example, an O-Arm® medical imaging system such as those sold by Medtronic, Inc. or C-Arm imaging system. The images may be fluoroscopic or radiographic images depending on an operating mode of the imaging system.
The acquired images of the patient can assist a surgeon in planning and performing the procedure, as well as evaluating results of the procedure. A surgeon may select a two dimensional image or a three dimensional image representation of the patient. The images can assist the surgeon in performing a procedure with a less invasive technique by allowing the surgeon to view the anatomy of the patient without removing overlying tissue (including dermal and muscular tissue) when performing a procedure.
An O-Arm imaging system includes an 'O'-shaped gantry and an 'O'-shaped rotor. A C-Arm imaging system includes a 'C'-shaped gantry and a 'C'-shaped rotor. Each of these imaging systems typically includes an x-ray source and an x-ray detector mounted opposite each other on the corresponding rotor. Each of the x-ray sources generates x-rays, which are directed at a subject. Each of the x-ray detectors detects the x-rays subsequent to the x-rays passing through the subject.
As an example, an imaging system may include an x-ray source, an x-ray detector, and a generator. The generator converts a low-voltage (e.g., 400 volts (V)) to a high-voltage (e.g., 150 kilo-volts (kV)). The high-voltage is provided to the x-ray source to generate x-rays. For a same dosage period and amount of current, the higher the low-voltage and thus the higher the high-voltage, the higher the dosage of x-rays received by the patient. Similarly, for the same low-voltage, the higher the current level and/or the longer the dosage period, the higher the dosage of x-rays received by the patient.
The voltage, current and dosage periods can be adjusted by a surgeon (or system operator). A surgeon may intuitively increase the voltage, current and/or dosage periods in an attempt to provide improved images. This not only increases x-ray dosage to a patient, but can also decrease quality of acquired images. Increasing voltage, current and/or dosage periods can cause: x-ray detectors to be overloaded; images to be "grainy" and/or "spotted"; and/or image quality to decrease during a procedure.

This patent is subject to a terminal disclaimer.

Apparatus and method for maintaining image quality while minimizing x-ray dosage of a patient


Embodiments relate to cementing operations and, more particularly, in certain embodiments, to settable compositions that comprise kiln dust and wollastonite and methods of use in subterranean formations. An embodiment discloses a method of cementing comprising: providing a settable composition comprising kiln dust, wollastonite, and water; and allowing the settable composition to set.

In general, well treatments include a wide variety of methods that may be performed in oil, gas, geothermal and/or water wells, such as drilling, completion and workover methods. The drilling, completion and workover methods may include, but are not limited to, drilling, fracturing, acidizing, logging, cementing, gravel packing, perforating and conformance methods. Many of these well treatments are designed to enhance and/or facilitate the recovery of desirable fluids from a subterranean well.
In cementing methods, such as well construction and remedial cementing, settable compositions are commonly utilized. As used herein, the term "settable composition" refers to a composition(s) that hydraulically sets or otherwise develops compressive strength. Settable compositions may be used in primary cementing operations whereby pipe strings, such as casing and liners, are cemented in well bores. In performing primary cementing, a settable composition may be pumped into an annulus between a subterranean formation and the pipe string disposed in the subterranean formation. The settable composition should set in the annulus, thereby forming an annular sheath of hardened cement (e.g., a cement sheath) that should support and position the pipe string in the well bore and bond the exterior surface of the pipe string to the walls of the well bore. Settable compositions also may be used in remedial cementing methods, such as the placement of cement plugs, and in squeeze cementing for sealing voids in a pipe string, cement sheath, gravel pack, formation, and the like. Settable compositions may also be used in surface applications, for example, construction cementing.
Settable compositions for use in subterranean formations may further include Portland cement. Portland cement generally is a major component of the cost for the settable compositions. Other components may be included in the settable composition in addition to, or in place of, the Portland cement. Such components may include fly ash, slag, shale, zeolite, metakaolin, pumice, perlite, lime, silica, rice-hull ash, micro-fine cement, lime kiln dust, and the like. However, the operating conditions for wells are becoming more challenging and demanding, and the search for new materials continues to meet these challenges.

Compositions comprising kiln dust and wollastonite and methods of use in subterranean formations


A body heating/cooling garment which utilizes fluid-carrying tubes and provides both air and vapor permeability to promote convective heat transfer while also providing conductive heat transfer.

For some time it has been a critical requirement for both soldiers and for those operating in extreme temperature environments, especially in the Arctic and in the desert, that a garment be provided which is both air and vapor permeable while at the same time having synthetic tubing carrying cooling or heating fluids in which close body contact is made with the tubing.
Typically, a heating/cooling garment, such as a vest, is made in which tubing is attached to a liner, with the liner then attached to fabric which forms the outer portion of the garment. While a wide variety of such garments exist, garments for this purpose are desirably stretchable and flexible to conform to the body of the individual, not only to provide mobility for arms and legs, but also to hold the cooling tubes closer to the body for more efficient heat transfer to the heating or cooling fluid. Additionally, flexibility produces less damage to the tubing during the flexure of the garment, with the garment being less susceptible to being torn when the material is flexible. Moreover, there is a requirement for lightweight construction, launderability, and dry cleanability. Additionally, since pressures within the tubing can reach 100 psi, the mating of the tubing to its substrate must be fluid pressure insensitive.
In the past, such a garment has involved the sewing of tubing to a substrate or liner which is porous enough to provide both for internal vapors to escape as well as to provide for air permeability. However, a major problem with sewn tubing is a problem called needleholing, in which every inch of the tubing is sewn to the porous substrate. Not only is there a potential problem in terms of pinhole puncturing of the tubing during the sewing process, the threads themselves provide a major irritant when these tubes are pressed into contact with the body. Additionally, since a T-shirt made in this manner can take as long as one day to manufacture and another day to test, the sewing method is intolerably slow and expensive, with registration problems of the tubing with a predetermined pattern making automatic sewing all but impossible.
Another reason that stitching is avoided is in so-called chemical protective clothing. Here, stitching tubing to any substrate for use in this application will result in needle holes, the size of which will permit unwanted chemicals to transit from one side of the garment to the other. Sewn tubing type garments are exemplified by Exotemp Ltd. heat transfer garments.
In order to provide an alternative to the sewn-in tubing, heating/cooling garments have been made with a bladder sealed at its edges, with the cooling fluid being contained within the bladder. However, while bladder-type garments do in fact conduct heat away from the body or conduct heat to the body, due to the two-coated fabrics which are joined together by heat, the resulting garment is non-breathable, non-stretchable and non-flexible. Additionally, there is a flexibility problem because of the large volume of liquid which is captured in the garment. Also, there is only one method of removing heat, e.g., conduction, since a bladder-type garment poses an impermeable barrier against natural sweating. Such a cooling garment thus completely eliminates the possibility of evaporative or convective cooling. Further, the edges of the bladder can come apart when subjected to pressures higher than 30 psi. Bladder type garments are exemplified by COOLVEST Model 17 manufactured by ILC DOVER.
Bladder type garments aside, methods other than sewing have been used to attach tubing to a liner or substrate. One such method involves brushing or rolling adhesives onto liners.
While brushed on or rolled on adhesives have been used in an attempt to adhere tubing to liners, the result is that all lining porosity is destroyed when the adhesive is massively applied across the substrate.
There is also a technique for adhesively taping the tubing to a liner, with adhesive tape contacting the liner to either side of the tube along its length. This system is exceedingly difficult to implement due to the fact that when the tubing is formed around small radius corners, the overlying strip of tape has to be notched to go around the corners. Also, it will be appreciated that the tape retards stretchability and permeability, adds unwanted stiffness to the garment and does not result in secure fastening of the tubing to the liner.
In general, heating or cooling garments are exemplified by U.S. Pat. Nos. 3,451,812; 3,425,486; 3,419,702; 4,691,762; 4,718,429; and 4,998,415. Other types of systems for body heating and cooling are illustrated in U.S. Pat. Nos. 4,114,620 and 5,062,424.
None of the above patents describe the utilization of a substrate or liner which is both air permeable and vapor permeable to which tubing is attached using fusible fabrics.
In summary, it is important to provide a garment that does not restrict the evaporative process in that it does not restrict the natural evaporation process of the human body, thereby preventing heat stress. It is therefore important that the garment not trap vapor as is the case with both bladder-type garments and those garments which have an excessive amount of adhesive blocking the naturally occurring pores in the liner. While some of the sewn in tubing garments provide for many of the above features, needleholing due to stitching and exhorbitant amounts of time spent in making the garment, as well as testing it after manufacture, preclude large scale usage. The sewn method precludes use in chemical protective uniform applications. Also, the sewn tubing method can be uncomfortable to the wearer.

The United States of America as represented by the Secretary of the Army


A master processing apparatus for performing a master processing operation on a target substrate includes a frame, a supply, and a processor. The supply includes a plurality of pouches. The pouch holder enables the pouches to be successively exposed as a leading pouch in an operative position wherein one of the sheets of the leading pouch can be unfolded away from the other sheet to open the leading pouch into an open position for receipt of the target substrate.

Master processing apparatuses for performing master processing operations, such as laminating, adhesive transfer, magnet making and other such operations are known in the art. Some of these apparatuses use a pair of feed rolls containing wound supplies of stock materials, which may be mounted individually to the apparatus frame, as is shown in U.S. Pat. No. 5,584,962, or which may be mounted together to the apparatus frame by a cartridge, as is shown in U.S. Pat. No. 5,580,417 (each of these patents are hereby incorporated into the present application by reference). Other types of apparatuses use pouches made of a piece of stock material folded in half. These pouches are typically used for laminating, and are used by placing the target substrate between the pouch halves and then feeding the pouch individually into the apparatus for application of pressure and/or heat.
On one hand, pouches have the advantage of coming in predetermined sizes and can avoid the need for cutting and trimming after the processing operation. On the other hand, cartridge type and individual feed roll type apparatuses have the advantages of the ease of mounting the supplies and avoiding the need for feeding individual pouches into the apparatus for each operation.
The present invention endeavors to provide a solution combining the advantages of using pouches and of using a cartridge together.


Presented systems and methods can facilitate efficient information storage and tracking operations, including translation look aside buffer operations. In one embodiment, the systems and methods effectively allow the caching of invalid entries (with the attendant benefits e.g., regarding power, resource usage, stalls, etc), while maintaining the illusion that the TLBs do not in fact cache invalid entries (e.g., act in compliance with architectural rules). In one exemplary implementation, an “unreal” TLB entry effectively serves as a hint that the linear address in question currently has no valid mapping. In one exemplary implementation, speculative operations that hit an unreal entry are discarded; architectural operations that hit an unreal entry discard the entry and perform a normal page walk, either obtaining a valid entry, or raising an architectural fault.

Electronic systems and circuits have made a significant contribution towards the advancement of modern society and are utilized in a number of applications to achieve advantageous results. Numerous electronic technologies such as digital computers, calculators, audio devices, video equipment, and telephone systems have facilitated increased productivity and reduced costs in analyzing and communicating data in most areas of business, science, education and entertainment. These activities often involve storage of information. The manner in which the electronic devices perform storage operations can have a significant impact on performance and end results. However, traditional attempts at information storage have many limitations and can be very complex and complicated.
In modern microprocessors, the CPU execution core may speculatively execute memory LOAD instructions even through it is not known at the time of the speculative execution whether: (a) the LOAD instruction actually needs to be executed (as opposed to being the result of, e.g., a branch misprediction) and/or (b) the address used by the LOAD instruction has the architecturally correct value. The speculation can occur implicitly in hardware as a result of speculative execution in processors (e.g., related to out-of-order processing, in-order processing, pipeline processing, branch prediction processing, etc.), or it can be explicit in the software, through mechanisms such as the speculative loads of the Intel Itanium architecture (e.g., http://www.inntel.com/design/itanium/manuals/iiasdmanual.htm). In addition, prefetch operations (e.g., including pre-fetches inserted by semi-autonomous hardware engines such as stream-detections pre-fetchers, etc.) can be considered a form of speculative load.
Some traditional software code paradigms may include loading a value from memory conditional on some check. The aim of the check might be to guard against dereferencing illegal addresses. Due to speculation, however, the LOAD (corresponding to dereferencing the pointer) may execute before the condition and/or corresponding conditional branch have been evaluated and/or resolved, and thus the LOAD may speculatively reference an illegal address. Often, it is the case that "invalid" addresses (e.g., in particular the "null" page at linear address zero, etc.) are not given legal mappings by the operating system (e.g., the page is marked as "not present", etc.), with the intent of exposing as page faults any "bad" pointer dereferencing or missing pointer validity checks by the software. In many conventional architectures (e.g., x86 or ARM), the hardware TLBs are not permitted to cache not-present entries; this typically manifests itself as an architectural rule that when an operating system changes a page mapping from invalid to valid, it need not invalidate the TLBs (e.g., which by decree do not hold invalid mappings, etc.).
However, when TLBs are not allowed to cache invalid entries, successive references to a "bad" address typically miss in the TLB, and generate separate requests ("page walk requests"), aimed at producing a valid mapping (yet ultimately fail to produce a valid TLB entry). These requests typically consume power, may introduce additional stalls into the system, and/or complicate fault handling. It may be desirable to "squash" these requests early, but traditional approaches directed at actually caching invalid mappings in the TLB (which might attempt to achieve an early "squash") typically violate the architectural rule alluded to above.

Translation lookaside buffer entry systems and methods


A method for thawing and infusing partially frozen fruits or vegetables. Individually quick frozen fruits or vegetables are introduced into a mixing kettle. An infusion solution is circulated from a solution tank, through a bed of fruits or vegetables, and back to a solution tank. The infusion solution is maintained at a temperature of about 45° to about 50° F. and at a Brix of about 40° to about 50°. The infusion solution is pumped and circulated at a high rate which reduces thaw time but does not result in product degradation. After thawing, the pumping and re-circulating rate is decreased to allow for increased infusion efficiency. Pressure pulses are applied to the product in the mixing tank which decreases the infusion time. Thus, thawed and infused fruit and vegetables are produced quickly and with minimal product degradation.

1. Technical Field
The present invention relates to a method for the simultaneous thawing and infusion of partially frozen fruits and vegetables. Further the invention prevents exposure of the fruit and vegetables to high temperatures which negatively impact product appearance and thus results in a better product.
2. Description of Related Art
Fruits and vegetables are very important in any diet. They provide many nutritional benefits such as antioxidants and many vitamins. However, fruits and vegetables perish fairly quickly and thus other methods have developed to prolong their shelf life.
One such method of prolonging the shelf life of a fruit or vegetable is by freezing. Often a frozen fruit or vegetable when thawed more closely resembles a fresh fruit or vegetable than does a canned fruit or vegetable. In the production of other final products using fruits or vegetables as ingredients, freezing provides processing flexibility. Depending on the fruit and vegetable, individually quick frozen (IQF) fruits and vegetables can be either a whole fruit or vegetable which is then frozen, or cut up pieces of fruits or vegetables which are then frozen. IQF product allows for processing flexibility in that the processing plant does not have to be geographically located in close proximity with the growing operation. Further, because an IQF product has already been soiled, cleaned, and de-stemmed, de-cored, de-pitted, etc., using an IQF product eliminates the necessity for such steps at the processing plant. Finally, because freezing prolongs the shelf life, using IQF product allows processors to produce year round rather than being limited to the relevant growing season. Thus, it is desirable for food processing plants to be able to use IQF products as an ingredient.
Thawing of the IQF products, however, can be very energy intensive. Thawing, as used herein, refers to increasing the IQF product to an internal temperature greater than about 32° F. Traditional methods of thawing IQF product include subjecting them to hot water, steam, etc., which can negatively impact texture, flavor, and the appearance of the fruit or vegetable due to partial cooking of the fruit and vegetables. Such flaws can carry over into the final product. While exposure of IQF product to high temperatures has a negative impact on product characteristics, it also has a negative impact on process microbial stability. Additionally, subjecting the fruit and vegetable to hot water or steam necessarily creates a waste stream comprised of water and fruit or vegetable pieces, typically at elevated temperatures. This results in undesired waste of water, fruit or vegetables, and heat energy
Another method food processors employ to enhance fruit or vegetables is infusion. Infusion of fruits and vegetables is a common method to develop shelf stable intermediate and or finished products. Infusion is a process which utilizes the concentration difference of dissolved solids in a solution and the food product to osmotically exchange solids into the food. Many different methods for the infusion of fruits and vegetables are well known in the art. Many of these methods employ varying solutes such as corn syrup solids, fructo-oligosaccharides, fruit juices and other simple sugars which are used to incorporate solids in fruits and vegetables.
An example of prior art that utilizes infusion is illustrated by U.S. Pat. No. 6,524,640 to Sinha. Sinha discloses immersing IQF product into a kettle of infusion solution of corn syrup, glycerin, and salt at a temperature of about 120° F. The kettle is then re-heated and the contents allowed to infuse until the product has reached a target concentration. However, as discussed above, this method includes subjecting the IQF product to high temperatures which can negatively impact the fruit or vegetable.
Accordingly, it is desirable to have a method for the thawing of an IQF product which minimizes the negative impact on the fruit or vegetable, yet which takes place as quickly as possible while reducing energy consumption. It is further desirable that any such method result in increased microbial stability. By minimizing the negative impact on the IQF product, it is desirable to produce a product with improved product appearance, taste, and texture. It is also advantageous to provide an infusion method which can increase the nutritional value of the IQF product while minimizing any damage to the IQF product. Further, it is desirable that the thawing fluid and the infusion solution comprise the same solution, reducing the waste of additional streams. Finally, it is desirable that the method of thawing and infusion take place at the same time and in the same equipment. This will allow for decreased operating expenses, capital expenses, and operating time.

Processing technique to thaw partially frozen fruits and vegetables and incorporating solids


Novel 3,4-dihydroxychalcone derivatives useful as a pharmaceutical material, and novel anti-inflammatory preparations. The 3,4-dihydroxychalcone derivatives are compounds of the formula [I], ##STR1## wherein X is a substituted phenyl group represented, e.g., by the formula (i), ##STR2## in which R.sup.1 is a hydrogen atom or an alkyl group and R.sup.2 is an alkyl group, an alkoxy group or an --OH group (excluding an OH-group in the 4-position). or salts thereof. The anti-inflammatory preparations contain one of the above 3,4-dihydroxychalcone derivatives as an active ingredient.

1. Field of the Invention
The present invention relates to chalcone derivatives and a pharmaceutical preparation containing one of the chalcone derivatives. In particular, it relates to 3,4-dihydroxychalcone derivatives and an anti-inflammatory preparation containing one of the 3,4-dihydroxychalcone derivatives.
2. Prior Art
It is known that 3,4-dihydroxychalcone and its derivatives have the activity to inhibit the oxidation of edible oils [Food Chemistry (1983, 12) 205-212].
JP,A 61-76433 discloses that 3-(3,4-dihydroxyphenyl)-1-(2,3,4-trimethoxyphenyl)-2-propen-1-one [=3,4-(2',3',4'-trimethoxy)dihydroxychalcone] has antiallergic activity, and JP,A 63-297847 discloses that 2',3',3,4-tetrahydroxychalcone has extensive anti-inflammatory activity.
Further, although based on in vitro experimental results, it has been revealed that 3,4-dihydroxychalcone and 3,4-dihydroxychalcone derivatives such as 2',3,4-trihydroxychalcone, 4',3,4-trihydroxychalcone and 2',4',3,4-tetrahydroxychalcone have the inhibiting activity have the inhibiting activity against enzymes which are to cause inflammation [PROSTAGLADINSS (1985, 30 (3) 357)].
As described above, studies are now under way concerning the activities of a variety of 3,4-dihydroxychalcone derivatives.


A weed pulling system has a pair of similarly configured rods in a cylindrical configuration, a pair of similarly configured gripping heads on the ends of the rods movable toward and away from each other; and a pair of similarly configured replaceable pads having an exterior gripping surface and an interior surface removably receivable on an associated head.

1. Field of the Invention
The present invention relates to a weed pulling system and more particularly pertains to facilitating the safe, rapid and convenient pulling of weeds and other undesirable vegetation.
2. Description of the Prior Art
The use of weed pulling systems of known designs and configurations is known in the prior art. More specifically, weed pulling systems of known designs and configurations previously devised and utilized for the purpose of pulling weeds are known to consist basically of familiar, expected, and obvious structural configurations, notwithstanding the myriad of designs encompassed by the crowded prior art which has been developed for the fulfillment of countless objectives and requirements.
By way of example, U.S. Pat. No. 6,405,411 issued Jun. 18, 2002 to Rucker relates to a wick trimmer and capture device. U.S. Pat. No. 3,990,146 issued Nov. 9, 1976 to Asselta relates to a plant cupping and lifting device. Lastly, U.S. Pat. No. 3,328,066 issued Jun. 27, 1967 to Johnston relates to a pickup device for trash.
While these devices fulfill their respective, particular objectives and requirements, the aforementioned patents do not describe weed pulling system that allows facilitating the safe, rapid and convenient pulling of weeds and other undesirable vegetation.
In this respect, the weed pulling system according to the present invention substantially departs from the conventional concepts and designs of the prior art, and in doing so provides an apparatus primarily developed for the purpose of facilitating the safe, rapid and convenient pulling of weeds and other undesirable vegetation.
Therefore, it can be appreciated that there exists a continuing need for a new and improved weed pulling system which can be used for facilitating the safe, rapid and convenient pulling of weeds and other undesirable vegetation. In this regard, the present invention substantially fulfills this need.


A coated abrasive comprising maker and size coats with improved color stability is obtained by the use of a bisphenol/formaldehyde resin binder in either the maker or, more preferably, the size coat.

The present invention relates to coated abrasives and particularly those made using a phenol/formaldehyde binder in either a maker or size coat.
A coated abrasive is conventionally made by application of layer of a binder resin, (called a maker coat), to a backing material followed by a layer of abrasive grits and then at least partial cure of the resin binder to anchor the grits to the backing. A size coat is then typically applied over the abrasive grits and the cured. The main function of the size coat is to improve the retention of the abrasive particles to the substrate. In some cases it is advantageous to apply over the size coat a further layer comprising a binder and a functional additive such as a grinding aid, a lubricant or an antistatic agent. The binder resin used in each layer is frequently the same to avoid compatibility problems potentially associated with the use of dissimilar resins.
The most commonly used binder resins, particularly where abrasive grits with hydrophilic surfaces such as alumina-based abrasives are used, are phenolic resins. These have many very significant virtues such as hardness, adaptability, water-dispersibility and relatively low cost. They do however have a disadvantage that can be a practical problem. Many manufacturers prefer to associate at least some of their products with a particular color which is added in the form of a dye or pigment added to the binder formulation for at least the size coat. With such a commercial strategy, it is important that the color remain essentially constant from one production run to the next and within the same run. Unfortunately however resole resins, which are base catalyzed, in the presence of oxygen undergo over time a partial oxidation to form quinone derivatives which have a reddish color. This interferes with the added color and, since the degree of interference depends on the age of the resole and the degree of oxidation it has experienced, the extent of the interference, and therefore the resultant shade of the product, will vary significantly.
One way in which this problem has been approached in the past is the incorporation of a second binder component, such as a melamine resin, that inhibits the oxidation. This however is not a perfect solution because it leads to mixture stability problems and a consequent reduction in shelf life of the binder blend. Alternatively it has been suggested that an ammonium salt, such as ammonium aluminum fluoride or ammonium hydrogen fluoride, be incorporated in the binder. This is the approach advocated in U.S. Pat. Nos. 5,110,320 and 5,232,468. Quite substantial amounts of the additive are required however with up to about 40% by weight of the total alkali metal catalyzed phenolic resin being taught. This too can lead to compatibility and shelf life problems.
A novel approach to this problem has now been devised which avoids the need to load up the binder resin formulation with additives. The novel approach uses a binder with the virtues of phenolic resin binders but with significantly enhanced color stability. As an added bonus, the strong odor of phenol which characterizes many coated abrasives operations using phenolic binders is significantly reduced.


According to the present invention there is provided a polyester composition comprising an aromatic polyester having copolymerized therein a compound containing at least one sulfonic acid group or sulfonic acid metal salt group, and crosslinked polymer particles, preferably crosslinked polymer particles coated with a water-soluble polymer. The particles are incorporated in a slurried state into the polymer. There is also provided a laminate film containing the polymer with the particles thus incorporated therein.. The polyester composition is superior in uniform dispersibility of the particles, re-agglomeratin does not occur in melt-storage for a long time, and films formed using the polyester composition are superior in traveling performance and abrasion resistance.

Polyesters, particularly polyethylene terephthalate, are widely used as fibers, films and other shaped articles because of having superior physical and chemical properties. However, contrary to such superior properties it is also known that there occur undesirable troubles such as the deterioration of tile working efficiency and of the product value because of poor process passing property in a film or other shaped article-forming process for obtaining the aforementioned shaped articles and poor slipperiness in the handling of products.
In connection with such problems, there have been proposed many methods for improving the surface slipperiness of products by incorporating fine particles in polyesters to impart moderate concave and convex shapes to the surfaces of the shaped articles, and some of the methods have been adopted practically. For example, there is known a method (e.g. Japanese Patent Laid Open Nos. JP55-133431A and JP57-125247A) wherein inert inorganic particles such as the particles of silicon oxide, titanium dioxide, calcium carbonate, talc or kaolinite, or fine particles of organic polymers such as benzoguanamine-formaldehyde resin, polytetr; afluoroethylene-hexafluoropropylene copolymer or polyphenyl ester resin, are added to a polyester preparing reaction system.
However, in the method of adding inert inorganic particles, the affinity for polyester is generally poor, so when formed into a film for example, voids are formed in the vicinity of the particles. Besides, coarse particles are often mixed into the polyester, and even if pulverizing or classifying operations are performed for removing such coarse particles, the incorporation of the coarse particles is unavoidable. If such voids are formed or coarse particles are present, then in the case of films for which transparency is required, such as, for example, films for printing plates and microfilm, the transparency will be markedly deteriorated, and in the case of films for capacitors, a bad influence will be exerted on electrical properties. Further, in the case of a film for magnetic tapes, electro-magnetic conversion properties will be deteriorated, or drop-out will occur, thus resulting in impairment of the film quality.
On the other hand, according to the method of adding fine particles of an organic polymer, the affinity for polyester is generally good, but it is difficult to obtain uniform and fine particles, and even if such fine particles are obtained, their dispersibility in the polyester is poor. For example, the particles will agglomerate in the polyester. Thus, incorporation of coarse particles is unavoidable.
Recently, with respect to films for which transparency is required, films for capacitors and films for magnetic tapes, a higher quality has been required, and a film superior in slipperiness, having a uniform surface and containing particles superior in the affinity for polyester has been desired.
It is an object of the present invention to eliminate the above-mentioned disadvantages of the conventional particles adding methods.
More particularly, the objects of the present invention are to provide a polyester composition wherein crosslinked polymer particles maintain a uniform monodisperse state even when held in a melted state for a long time, said polyester having specific functional groups, to provide a process for preparing the same and to provide a polyester film superor in all of slipperiness, surface unifomity, transparency and abrasion resistance.

Polyester composition, process for preparing same, and film formed using same


The present invention contemplates a translucent, preferably clear, anhydrous gel composition (for example a solid stick, soft solid, cream as well as any form commonly referred to as a gel), especially an antiperspirant stick composition, comprising: (a) dibenzylidene sorbitol; (b) a selected derivatized guar, especially an hydroxy C.sub.3 -C.sub.4 alkyl guar having a level of hydroxyalkylation of 0.4-1.5 molar substitution ("MS"); and (c) a solvent selected so that is will not react with the DBS itself or, if an acid catalyst is present, will not react in the presence of DBS with an acid catalyst such as an antiperspirant active salt.

Dibenzylidene sorbitol (also called dibenzaldehyde monosorbitol acetal, or dibenzyl monosorbitol acetal or dibenzylidene monosorbitol acetal) and derivatives thereof such as those which are substituted on one or both of the aromatic rings with a fluorine or methoxy group and those which have the sorbitol portion replaced with other reduced sugars such as xylitol or ribitol as described in U.S. Pat. No. 5,609,855 assigned to Procter & Gamble (collectively referred to as dibenzylidene sorbitol or "DBS") may be used in various food and cosmetic applications. For cosmetic uses the more interesting ones are those focused on obtaining a translucent or clear products. While dibenzylidene sorbitol is stable in alkaline or neutral media, such compounds are not stable in acidic media. In an acidic environment, such as in the presence of acidic antiperspirant materials, and when in the presence of even small amounts of water, the dibenzylidene sorbitol deteriorates and breaks down. Also, the use of DBS sometimes causes problems in the aesthetics of cosmetic products or problems with structural properties. Accordingly, there is a need to find a way to form products containing DBS which are stable and which have acceptable aesthetics.
There have been various attempts to work with DBS. Some of these efforts have focused on the stability of DBS. United Kingdom Patent GB 2 280 111, assigned to Union Camp Corporation, describes a gel stick composition comprising a dihydric alcohol as a primary solvent, a co-solvent such as low molecular weight polyethylene glycol, water and/or glycerine, a buffering agent and DBS as a gelling agent.
U.S. Pat. No. 4,720,381 to Schamper et al notes stability problems with this approach and itself describes the use of solvents having less reactive alcohol groups or alcohols with selected chain lengths in a DBS composition.
U.S. Pat. No. 4,816,261 to Luebbe et al describes stable deodorant gel stick compositions comprising DBS with a polar solvent and a coupling agent such as polypropylene glycol ethers of fatty alcohols.
U.S. Pat. No. 4,518,582 to Schamper, et al discloses an antiperspirant stick composition containing dibenzyl monosorbitol acetal in the presence of acidic antiperspirant-active salts, which composition is stable for extended periods of time at elevated temperatures. The composition contains at least a reactive solvent (such as water, methanol, ethanol, n-propanol, ethylene glycol, 1,2-propylene glycol, 1,3-propylene glycol, etc.), dibenzyl monosorbitol acetal, an antiperspirant-active compound, and a gel stabilizer, the gel stabilizer such as magnesium sulfate, zinc acetate and hexamethylenetetramine and mixtures thereof. This patent discloses that the stabilizer prevents or retards deterioration of the gelled sticks, especially when exposed to elevated temperatures.
Another patent disclosing stabilizers for solid gel antiperspirant sticks containing an acidic antiperspirant-active compound in the presence of dibenzyl monosorbitol acetal is U.S. Pat. No. 4,719,102 to Randhawa, et al. This patent discloses that the sticks include a solvent which is a small, polar organic compound such as cyclic esters, amides, amines, ketones, ureas, carbamates, sulfoxides and sulfones, and their open chain analogs; a cosolvent such as primary or low molecular weight alcohols and/or glycols; dibenzyl monosorbitol acetal; an antiperspirant-active compound; and a gel stabilizer such as N-(2-hydroxyethyl) fatty (C.sub.8 -C.sub.20) acid amides, magnesium sulfate, zinc acetate, acetamide monoethanol amine and hexamethylenetetramine, and mixtures thereof.
U.S. Pat. No. 4,722,835 to Schamper, et al also discloses antiperspirant gel stick compositions gelled with dibenzyl monosorbitol acetal and containing an acidic antiperspirant compound, and also containing a stabilizer for the gel. This patent teaches that the compositions include a solvent which is a small, polar organic compound, as discussed previously in connection with U.S. Pat. No. 4,719,102; dibenzyl monosorbitol acetal; an antiperspirant-active compound; and a gel stabilizer such as (such as zinc oxide, calcium acetate, magnesium oxide, calcium carbonate, calcium hydroxide, magnesium carbonate, sodium carbonate, zinc carbonate and potassium carbonate). This patent discloses that these basic metallic salt gel stabilizers can stabilize the gel, even at high temperatures.
Other patent documents also disclose antiperspirant sticks gelled with a dibenzylidene sorbitol and include stabilizers for the gel.
EP Application No. 451,002 A2 discloses a stable, substantially anhydrous and substantially lower monohydric alcohol free, transparent, gelled, antiperspirant composition gelled by dibenzylidene monosorbitol acetal, containing acidic antiperspirants, and utilizing dihydric alcohols containing 3 to 6 carbon atoms as solvents, with the acetal being stabilized against hydrolysis and the formation of benzaldehyde by the presence of a stabilizing amount of a selected organic base, the organic base being a weakly basic, nitrogen-containing, organic compound.
EP Application No. 512,770 A1 discloses a stable, substantially anhydrous and substantially lower aliphatic monohydroxy alcohol free cosmetic composition gelled by dibenzylidene monosorbitol acetal, and containing acidic antiperspirant compounds and utilizing dihydroxy aliphatic alcohols containing 3-6 carbon atoms as solvents, wherein the dibenzylidene monosorbitol acetal gelling agent is stabilized against hydrolysis and the formation of benzaldehyde by the presence of a stabilizing amount of a selected inorganic base, the inorganic base including alkali and alkaline earth metal oxides, hydroxides, carbonates or bicarbonates, and trivalent metallic hydroxides.
PCT No. WO92/19221 discloses solid antiperspirant compositions in gel stick form, having an acid pH, and including (1) an antiperspirant active; (2) a gelling agent selected from the group consisting of substituted and unsubstituted dibenzylidene alditols; (3) a solvent for the gelling agent, preferably including a solvent material selected from the group consisting of monohydric and polyhydric alcohols, and mixtures thereof; and (4) a gelling agent stabilizer, the stabilizer being a basic metallic salt of an acid having a pKa of from about 3.8 to about 6.5 at 25 degrees C., the salt being at least partially soluble in the composition and being selected from the group consisting of C.sub.4 -C.sub.6) dicarboxylate salts, C.sub.6 -C.sub.8 monocarboxylate salts, and substituted or unsubstituted benzoate salts, and mixtures thereof, the gelling agent stabilizer not containing amino or amido functionalities. This patent document teaches that for clear or translucent sticks, the gelling agent stabilizer present in the composition should be fully soluble in the composition, in order to minimize refraction of light.
The foregoing patent documents also disclose methods for forming the disclosed antiperspirant stick compositions containing the antiperspirant materials and gelling agent. In particular, attention is directed to U.S. Pat. No. 4,719,102 and U.S. Pat. No. 4,722,835. Each of these patents discloses processes of forming the stick compositions, including dissolving the antiperspirant active in one phase and the dibenzyl monosorbitol acetal gellant in another phase. The two phases are then combined and poured into a mold or into the final package. The other components are added to either of the two phases depending on the compatibility of the component with the phases. More phases can be utilized, if desired, by forming a separate solution of some of the components, with the separate phases then being added to either of the two main phases; or all of the phases could be poured together at the end, as, for example, with a multi-stream filling head or an in-line mixer.
PCT No. WO92/19221 discloses a process of forming an antiperspirant gel stick, including preparing a solution containing the gelling agent, a solvent for the gelling agent, and the gelling agent stabilizer; mixing an antiperspirant active into such solution; and cooling the solution to form a gel.
There have also been efforts to develop DBS compositions to improve the aesthetics and/or mechanical properties while not sacrificing stability.
U.S. Pat. No. 4,346,097 to Roehl discloses a solid translucent gelled antiperspirant composition comprising DBS with an oleaginous compound (such as selected siloxanes, selected esters with an aliphatic character and branched chain hydrocarbons) to reduce stickiness.
PCT Publication Number 96/26709 to Vu et al describes a clear gel cosmetic stick which includes a liquid vehicle, an antiperspirant salt dissolved in the liquid vehicle, DBS and one or both of hydroxypropyl cellulose and a chelating agent. The hydroxypropyl cellulose maintains the hardness of the stick.
U.S. Pat. No. 4,863,721 to Beck et al describes the use of particulate cellulose ether polymers such as hydroxyethyl cellulose in antiperspirant compositions which are substantially free of polar solvents.
European Patent 0 260 030 B1 assigned to Unilever N. V. describes a transparent deodorant stick containing DBS and a thickening agent such as a chemically modified cellulose, polyacrylic acid, and/or polyacrylic acid copolymers and mixtures of the foregoing.
None of these references however, describes the use of guar such as a hydroxypropyl guar in connection with DBS and other components for a clear underarm product such as an antiperspirant stick. In particular it is noted that cellulose and guar are based on different carbohydrate building blocks that are arranged in a different way and, hence, give different properties in selected applications. Cellulose is water insoluble and gives plants the ability to maintain height. Cellulose is a linear polymer made of glucose units linked in a beta arrangement 1 to 4. Guar, on the other hand, is water soluble and is used to protect propagating plant seed. Guar is a branched polymer made from a linear backbone of mannose units linked in a beta arrangement 1 to 4 with random side chain attachments of galactose units linked to the mannose units in an alpha arrangement 1 to 6. Derivatives such as propylene glycol or butylene glycol ethers of either cellulose or guar would also reflect these structural differences.
Prior teachings of guar components in cosmetic applications include hair and or body care such as cleansing agents (see for example, U.S. Pat. No. 4,374,825 to Bolich et al; U.S. Pat. No. 4,556,510 to Holsopple; and U.S. Pat. No. 4,678,606 to Akhter et al.
While, as seen in the foregoing, there has been numerous efforts to find satisfactory cosmetic compositions suitable for use in forming underarm products such as deodorants and antiperspirants, for example, antiperspirant sticks, including clear antiperspirant gel sticks, containing acidic antiperspirant active ingredients and gelled with a dibenzylidene sorbitol, it is still desired to provide improved products, including, but not limited to, a clear stick composition containing an acidic antiperspirant active ingredient and gelled with dibenzylidene sorbitol and a selected guar which has increased stability over extended periods of times, and wherein deterioration of the gelling agent, and production of benzaldehyde due to such deterioration, are reduced. It is also still desired to provide an efficient manufacturing process for such cosmetic compositions.
It is a further object of the present invention to provide a clear antiperspirant and/or deodorant solid gel stick composition, which may contain an antiperspirant active salt and which is gelled by dibenzylidene sorbitol and a guar, the stick having structural integrity over extended periods of time (that is, to provide a rigid solid stick maintaining rigidity over extended periods of time).
It is a still further object of the present invention to provide a method of manufacturing clear antiperspirant solid gel stick compositions, utilizing dibenzylidene sorbitol and guar as a gelling system, wherein the processing for forming the stick is simplified.

Clear antiperspirant stick with dibenzylidene sorbitol and guar and process of making same


A method of executing a trusted application on a trusted security zone enabled electronic device. The method comprises responsive to a trusted security subzone not being provisioned on the electronic device, generating, by a server, a temporary trust token, transmitting the temporary trust token to the electronic device, and comparing the temporary trust token with a plurality of trust tokens stored in the electronic device to determine the trustworthiness of the temporary trust token. The method further comprises responsive to the temporary trust token being determined to be trustworthy, provisioning the non-provisioned trusted security subzone on the electronic device to be a temporary trust enablement, transmitting the trusted application through an encrypted channel to the temporary trust enablement, executing the trusted application in the temporary trust enablement, and removing the trusted application, the temporary trust enablement, and the temporary trust token when the trusted application is completed.

Network capable electronic devices are becoming increasingly prevalent in our daily lives. More and more electronic devices that did not have network capabilities are now built to be network capable. Cloud computing (network computing) where a program or application runs on a connected server or servers instead of on a local computing device is evolving into an era when high speed media content exchange is more and more involved in cloud computing systems.

Network based temporary trust extension to a remote or mobile device enabled via specialized cloud services


To enable stable collision avoidance operation without the need to install an infrastructure or the like even in a dangerous area where running out is likely to occur. An autonomous moving body according to the present invention includes: a distance measuring sensor that measures a distance to an object existing in an environment; a distance information acquisition unit that acquires a distance measurement value of the distance measuring sensor as distance information on a measurement point; and a dangerous area extraction unit that categorizes adjacent measurement points as an identical object according to a distance difference between the measurement points, and extracts an endpoint of the object as a dangerous area when the categorized object itself has a size equal to or larger than a predetermined threshold and when an opening formed between endpoints of the objects has a width equal to or larger than a predetermined threshold, in which the autonomous moving body travels so as to avoid a collision in the extracted dangerous area.

Robots that autonomously move in an environment have been developed. The environment where robots move includes a dangerous area, such as an intersection, where a person or a moving obstacle is likely to run out in front of the robots. In the case of entering such a dangerous area, some robots detect a person or a moving obstacle by using an external sensor mounted therein and start deceleration to avoid a collision after the detection. Such robots may collide with a person or a moving obstacle running out in front of the robots, due to a delay of a collision avoidance operation. In view of this, autonomous mobile robots are required to perform a safe travel control to avoid a collision in the dangerous areas where running out is likely to occur.
Patent Literature 1 discloses a technique for preventing deceleration to avoid contact with surrounding walls during movement along a narrow passage. In Patent Literature 1, a sensor monitoring range for determining the necessity of deceleration is dynamically changed based on information about infrastructure installed in advance in areas in the vicinity of intersections.
Further, Patent Literatures 2 to 5 disclose other techniques related to the present invention. For example, Patent Literature 2 discloses an obstacle avoidance apparatus that detects a risk level of an obstacle at every predetermined prediction time, and travels to a destination while avoiding a risk according to the risk level. Furthermore, Patent Literature 3 discloses a collision prevention operating method for an unmanned self-traveling body which determines whether positional data of another unmanned self-traveling body is included in an area, and controls the unmanned self-traveling body to stop when the positional data is included in a stop area, and to decelerate when the positional data is included in a deceleration area.

Autonomous moving body and control method thereof


A method is described for repairing failure points, regions or locations in an electronic device to have a perfect function when a semiconductor device including an LCD of other electronic device has defects. Described is a method of transferring a single or multi-layer thin film piece into a recess with the physical properties of the thin film piece unchanged.

An Extended Video Graphics Array (XGA) Liquid Crystal Display (LCD) having 1024×768 pixels has approximately 2.36 million pixels. Each pixel is driven by a Thin Film Transistor (TFT). It is very difficult to manufacture sub-pixels without any defects in the manufacturing process of such LCD. For this reason, a limited number of point, region or location defects are ordinarily allowed.
There is a case where one defective sub-pixel can cause a malfunction, which causes a picture element to generate different colors or bright points appear when a black color should appear. In this case, an entirely different color from peripheral colors appear or only one point shines in white color when filling all of the display completely with black color, which leads to low contrast of the screen. Consequently, point defects appear on the display. One of the methods for repairing point defects is disclosed in Japanese Laid-Open Patent Publication No. 6-11675, for example. The method is to change bright point defects to dark point defects by covering the bright point defective portion with black color or leaving an ink of a heat transfer sheet on the bright point defective portion. Or, defects are repaired by a self-leak method which is a fake repair method to make dark/bright points to be inconspicuous dots. Either of these methods were not repair solutions to remove defects because these methods only make dark/bright points to be inconspicuous dots. It was unavoidable that a remarkable yield loss occurred when we addressed severe requirements from customers such as "Point defect free".
The Japanese Laid-Open Patent Publication No. 9-230128 discloses a method that a defective filter is removed with a YAG (Yttrium Aluminum Garnet) laser beam and then the colored layer is transferred to the portion where the filter previously existed. Further, the Japanese Laid-Open Patent Publication No. 7-253583 and No. 8-150487 or the like disclose repair methods for defective conductor sections or insulator sections. Such methods are effective for removing defects. These methods were not, however, applicable to such materials as semiconductor layers because materials free of discoloring and deterioration were exclusively used even when being melted by heating. That was resulted from the need for temporally melting the colored layer and the conductors or the like using a semiconductor laser beam. Furthermore, it was impossible to repair a thin film comprising 2 layers or more simultaneously.
It is an object of the present invention to provide a method of repairing a failed point, region, location or pixel to have a perfect function when a semiconductor device including an LCD or other electronic device has defects.
It is another object of the present invention to transfer a single or multi-layer film to the other portion with its characteristics unchanged.

Defect repair apparatus for an electronic device

Abstract: An electronic device is described incorporating a substrate; and a plurality of thin films laminated on the substrate and part of the thin films are formed on a predetermined circuit pattern, wherein a transfer film for repairing a defect is fitted into a recess where the low layers of the thin films are exposed by removing part of a single or multi-layer thin films covering a defective portion included on the thin films and its surrounding portion. Further, a method of repairing a defective portion included in the electronic device comprises the steps of: removing the thin films covering the defective portion and its surrounding portion to form a recess and exposing the lower layers of the thin films; and fitting a transfer film into the recess to attach the transfer film onto the exposed thin films.


Low temperature processed back side redistribution lines (RDLs) are disclosed. Low temperature processed back side RDLs may be electrically connected to the active surface devices of a semiconductor substrate using through wafer interconnects (TWIs). The TWIs may be formed prior to forming the RDLs, after forming the RDLs, or substantially simultaneously to forming the RDLs. The material for the back side RDLs and various other associated materials, such as dielectrics and conductive via filler materials, are processed at temperatures sufficiently low so as to not damage the semiconductor devices or associated components contained on the active surface of the semiconductor substrate. The low temperature processed back side RDLs of the present invention may be employed with optically interactive semiconductor devices and semiconductor memory devices, among many others. Semiconductor devices employing the RDLs of the present invention may be stacked and electrically connected theretogether.

1. Field of the Invention
The present invention relates to low temperature processes for forming back side redistribution layers for semiconductor devices. More particularly, the present invention relates to low temperature processing for back side redistribution layers as suitable for use in optically interactive semiconductor devices and other semiconductor devices, and resulting structures.
2. State of the Art
Interconnection and packaging-related issues are among the factors that determine not only the number of circuits that can be integrated on a semiconductor die or "chip," but also the performance of the chip. These issues have gained in importance as advances in chip design have led to reduced sizes of transistors and enhanced chip performance. The industry has come to realize that merely having a fast chip will not necessarily result in a fast system. The fast chip must also be supported by equally fast and reliable electrical connections. Essentially, on-chip connections, in conjunction with those of the chip's associated packaging, supply the chip with signals and power, provide signals from the chip and redistribute the tightly spaced or pitched terminals or bond pads of the chip to the terminals of a carrier substrate, such as a printed circuit board.
Flip-chip technology is well known to those of ordinary skill in the art, as the technology has been in use for over 30 years and continues to develop. A flip-chip semiconductor device conventionally comprises a semiconductor die having an active surface having active integrated circuitry components formed therein and bearing contacts such as bond pads, and an opposing back surface devoid of active components or, usually, of any features whatsoever. A dielectric layer, for example, of silicon dioxide or silicon nitride, may be formed over the active surface by techniques well known in the art. Apertures may be defined in the dielectric layer (also termed a "passivation layer") using well-known photolithographic techniques to mask and pattern the dielectric layer and etch the same with hydrofluoric acid to expose the contacts or bond pads on the active surface. The bond pads may be respectively connected to traces of a redistribution layer on the dielectric layer in the form of redistribution lines in a well-known manner, for example, by evaporating or sputtering a layer of aluminum or an alloy thereof over the passivation layer, followed by masking and etching the layer to define the traces. The redistribution lines of the redistribution layer enable the external connections of the semiconductor device provided by the relatively compact arrangement of closely spaced or pitched bond pads to be distributed over a larger surface area with wider spacing or pitch between external connections to higher-level packaging. Discrete conductive elements, such as solder bumps or balls, are typically placed upon a pad located at an end of each redistribution line to enable electrical connection with contact pads or terminals on the higher-level packaging, usually comprising a carrier substrate such as a printed circuit board. The flip-chip semiconductor device, with the solder bumps on its active surface, is "flipped" and attached face down to a surface of the carrier substrate, with each solder bump on the semiconductor device being positioned on the appropriate contact pad or terminal of the carrier substrate. The assembly of the flip-chip semiconductor device and the carrier substrate is then heated so as to reflow the solder bumps to a molten state and thus connect each bond pad on the semiconductor device through its associated redistribution line and solder bump to an associated contact pad or terminal on the carrier substrate. Because the flip-chip arrangement does not require leads of a lead frame or other carrier structure coupled to a semiconductor die and extending beyond the lateral periphery thereof, it provides a compact assembly in terms of the semiconductor die's "footprint" on the carrier substrate.
Redistribution lines may also be located on the back side of a semiconductor die and electrically connected to the bond pads of the active surface through conductive filled vias that extend through the semiconductor die. U.S. patent application Ser. No. 10/209,823 entitled, "Semiconductor Dice Having Back Side Redistribution Layer Accessed Using Through-Silicon Vias, Methods of Fabrication and Assemblies," assigned to the assignee of the present invention and the disclosure of which is hereby incorporated by reference herein, teaches use of rerouting redistribution lines on a back side of a semiconductor die accessed from an active surface of a semiconductor substrate through vias. While such a redistribution layer may help reduce the necessary footprint from a semiconductor die and helps alleviate cross-talk between adjacent redistribution lines, the processing techniques employed do not accommodate the sensitive, easily damaged nature of the various components on the active surface.
For example, optically interactive semiconductor devices, such as complementary metal oxide semiconductor (CMOS) imagers, employ particularly temperature sensitive components in the form of microlenses disposed on their active surfaces, which begin to degrade at about 220° C. Semiconductor memory devices, while not as limiting with respect to temperature-induced damage, experience subsequent operational difficulties when exposed to temperatures of 250° C. and may sustain irreparable damage commencing at about 300° C. exposure.
Accordingly, a need exists for methods of fabricating back side redistribution lines and associated structures, such as conductive vias, that do not damage any of the active surface circuitry of a semiconductor device or components associated with such semiconductor devices.

Low temperature methods of forming back side redistribution layers in association with through wafer interconnects, semiconductor devices including same, and assemblies


Methods and apparatus are disclosed for exposing a reticle pattern onto a sensitive substrate (such as a sensitized semiconductor wafer) by projection-exposure at high focusing precision. According to the method, multiple evaluation marks are projected onto an area of the surface to form images of the evaluation marks. An image of a measurement mark is projected on or near at least some of the evaluation marks. Respective Z-direction displacements of each evaluation mark relative to a reference plane are detected by detecting a characteristic of the respective measurement mark that varies with a change in position of the measurement mark relative to the respective evaluation mark. Based on such measurements, an axial relationship of the projection-optical system relative to the substrate can be changed to place the substrate at a best-focus position before exposing the substrate with a reticle pattern. Associated apparatus are also disclosed.

In photolithography as used for manufacturing semiconductor devices, liquid-crystal display devices, thin-film magnetic heads, and the like, a projection-exposure apparatus (e.g., a "stepper") is generally used to project a pattern, defined by a photomask ("mask") or reticle (either referred to generally below as a "reticle"), onto a sensitive surface of a semiconductor wafer, glass plate or other suitable substrate (referred to below as a "wafer"). The surface of the wafer is "sensitive" because it is coated with a photoresist or other suitable light-sensitive composition in a manner analogous to a photographic emulsion. Such projection-exposure apparatus typically include a projection-optical system (comprising a projection lens and illumination-light optics) that must exhibit excellent image-formation characteristics in order to transfer an image of the pattern image of the reticle onto the wafer with high resolution.
To such end, image-formation characteristics such as image-surface inclination and curvature of field of the projection-optical system are periodically measured. Correction of certain image-formation characteristics is usually performed based on the measurement results.
The projection-exposure apparatus generally include wafer stages comprising a Z-tilt stage that can adjust the wafer's axial position (height) and inclination in the Z direction and an XY stage that positions the wafer at a desired position on the XY plane.
Based on the premise that the wafer stage, especially the running guideways of the wafer stage, is nearly perfectly flat, measurement of the image-formation characteristics of the projection-optical system is conventionally performed as shown in FIGS. 16 and 17, wherein FIG. 17 shows a portion of the XY plane of FIG. 16. In both figures, measurements are taken of certain aspects of the image surface (on the wafer 3B) in the exposure field IAR (indicated by dashed line in FIG. 17) of the projection-optical system 1.
In FIG. 16, a focal-point-detection device 50 (comprising a light transmitter 50a and a light receiver 50b) is operable to detect the focal point of a wafer 3B situated downstream of the projection-optical system 1. In FIG. 16, the Z axis is parallel to the optical axis AX of the projection-optical system 1; the X and Y axes are on a plane perpendicular to the Z axis. A detection beam FL, produced by the light transmitter 50a, propagates at an angle to the optical axis AX toward a fixed detection point C located on or near the optical axis AX on the wafer 3B. The light transmitter 50a transmits a slit image onto the detection point C. The detection beam FL is reflected by the wafer 3B and enters the light receiver 50b. The light receiver 50b produces an output signal corresponding to the height position of a measurement point P1 on the wafer 3B corresponding to the detection point C. As shown in FIG. 16, there is a swell in the surface S of the wafer 3B. To prevent the swell from affecting the image-surface measurement, exposure is performed in the following sequence:
(1) The XY stage 5 is actuated to move the measurement point P1 on the surface S of the wafer 3B to the detection point C, and the Z-tilt stage 7 is actuated as required to place the measurement point P1 at the desired location (at the detection point C).
(2) With the Z-tilt stage 7 in a fixed position, the XY stage 5 is actuated to position the measurement point P1 at a measurement location A located at one end of the exposure field IAR. (In FIG. 16 the curved broken line shows the wafer position before actuation of the XY stage 5, and the curved solid line shows the wafer position afterward.) As shown in FIG. 17, wafer movement causes the area AR1, illustrated with broken lines on the wafer 3B that correspond to the exposure field IAR, to shift to the exposure field IAR. With the wafer 3B then remaining fixed, an illuminating light flux, generated by an illumination light source (not shown) located upstream of the projection-optical system 1, is irradiated onto a test pattern defined on the reticle (not shown, but located upstream of the projection-optical system and downstream of the illumination light source). The image IPA of the test pattern is exposed onto the measurement point P1 on the wafer 3B. In this scheme, the test-pattern image IPA is made up of multiple slit marks extending in the X direction and multiple slit marks extending in the Y direction (FIG. 17).
(3) The Z-tilt stage 7 is then actuated and the actions described in (1) and (2) above are repeated at multiple wafer elevations (Z-dimension positions) by changing the height of wafer 3B. The previously exposed test-pattern image IPA and the newly exposed test-pattern image IPA on the wafer do not overlap because the exposure position on the wafer 3B is slightly displaced in the XY plane each time as a result of moving the wafer each time in the Z direction.
(4) The actions described above in (1)-(3) are repeated at multiple locations other than position A on the wafer in the exposure field IAR.
(5) The exposed wafer 3B is developed; the exposed pattern reveals the position in the Z direction yielding the best image resolution for each position inside the exposure field IAR.
By the actions in (1)-(5), it is possible to determine how much curvature and inclination exists with respect to the image-formation surface of each position within the exposure field IAR, with the running guideway of the XY stage 5 as the reference.
In the conventional technique described above, a measurement error with respect to image-formation characteristics can arise if the flatness of the XY stage 5 running guideway is not sufficiently precise. This is especially because the XY stage 5 moves until the action described in (2) performs an exposure only after the action described in (1) establishes (measures) the height of the measurement point P1. There is a practical limit to the flatness of the running guideways of the XY stage 5. Also, the flatness tolerance of the running guideways of the XY stage tends to increase over time after repeated use. Also, as the numerical aperture of projection-optical systems increases so as to allow for further refinement of semiconductor elements and the like made using projection exposure, the required depth of focus has been decreasing.
Therefore, since the requirements for image formation, such as the image-surface curvature and inclination of the projection-optical system, have become more stringent, it is now impossible to ignore errors with respect to image-formation characteristics that accompany insufficient flatness of the XY stage running guideways. This problem cannot be avoided when using conventional methods and apparatus.
Moreover, since it is necessary to repeat the actions described above in (1)-(3) for each of the multiple measurement positions inside the exposure field IAR, the amount of time it takes to do the measurement increases in proportion to the number of measurement positions. This disadvantageously results in reduced throughput (productivity).
Furthermore, projection-exposing the reticle pattern onto the wafer involves an operation in which the patterned surface of the reticle is aligned with the wafer surface; that is, the focal points are aligned. As described above, depth of focus has recently been decreasing in projection-optical systems. Even when an i-line wavelength (365 nm) is used for exposure illumination, the depth of focus is only about 0.7 .mu.m. In addition, the trend is toward greater increases in the size of the projection field of the projection-optical system.
Reference is made to U.S. Pat. No. 5,118,957 in which, in order to achieve satisfactory focal-point alignment across a wide exposure field, a slit image is projected obliquely relative to the optical axis AX (i.e., not projected through the projection-optical system) onto each of multiple measurement points inside the shot region (exposure field) of a wafer. A focal-point detector system (multiple-point AF system based on the oblique-incidence method) is used to receive and analyze light from each reflected image by a two-dimensional array sensor.
Reference is also made to U.S. Pat. No. 5,502,311 (corresponding to Japanese Laid-Open patent document no. Hei 5-190423) disclosing a separate optical system used for detecting focal points of the reticle pattern versus the wafer. The '311 patent also describes a method for calibrating such a multiple-point AF system with respect to the best-focus image surface at the time of projection exposure.
The multiple-point AF system disclosed in the '311 patent does not include a separate optical system for each measurement point. Rather the '311 patent discloses embodiments in which a "pin-hole" image from a light source is projected through a common optical system onto the wafer surface. The image directed by the optical system onto each measurement point on the wafer surface is reflected from the wafer surface and directed by the optical system to a detector. Each reflected image is separately detected using a two-dimensional sensor array in the detector.
According to the prior art, calibration of a multiple-point auto-focus (AF) system involves a determination of any offset between respective sensors corresponding to each measurement point. Correction of the offset between sensors involves servo control of the Z stage in consideration of each offset.
The focus calibration method described in the '311 patent uses a TTL (through-the-lens; i.e., through the projection-optical system) focus detection system and an oblique-incidence type multiple-point AF system to individually determine the offsets at each measurement point. An approximate plane is identified by means of the least-squares method using the determined offsets. The offsets of each measurement point are corrected and calculated with an approximate plane as a new reference. Thereafter, good focusing is achieved across the entire shot region (exposure field) on the wafer by vertically moving and/or tilting the Z stage so that the output signals obtained at each measurement point are equal to the offsets previously corrected and calculated.
It has been discovered, however, that focus can be blurred when attempting to expose a reticle pattern in a shot region after aligning the Z position of the shot region on the wafer using an oblique-incidence-type multiple-point AF system as summarized above in which focus calibration is performed by finding individual offsets at each measurement point. Moreover, careful investigation has revealed unstable circumstances in which the degree of focus disparity characteristic of a wafer having a certain type of exposure layer differs from the degree of focus disparity characteristic of a wafer having a different type of exposure layer. Also, it has been found that the focusing precision obtained with the oblique-incidence type multiple-point AF system varies with the wafer type.

Methods for measuring image-formation characteristics of a projection-optical system


A socket retaining mechanism to allow maintenance or construction personnel to quickly identify and gain access to a particularly sized socket. The present invention provides a socket retaining mechanism, preferably adapted to be worn on a utility belt, wherein a plurality of socket retaining mechanisms are strung from the utility belt, with each socket retainer being adapted to hold a particular socket. Each socket retainer includes means for retaining a socket thereon, and means for releasing a socket therefrom when it is so desired by the worker. As opposed to prior art systems, the present system increases the efficiency of the worker in that less time is required for searching for the socket of interest.

Sockets, socket sets, and socket wrenches are common types of hand tools which are used by various maintenance and construction personnel to facilitate attachment and detachment of nuts and bolts typically having hexagonal heads. Depending upon the size of the hexagonal head, an appropriately sized socket will be used to attach to the head for rotation thereof. The actual rotation can be generated either by hand using a wrench, ratchet, or otherwise, or with a power tool which generates the force necessary for rotation. Such sockets can be manufactured to correspond to shapes other than conventional hexagonal heads, and in addition, can be sized to accommodate both the U.S. and Metric standards of measurement.
If a particular user of such a socket set is located or positioned such that an entire tool box or socket set can be made available for ready access to the variously sized sockets, various trays and holding mechanisms can be used to lay out the sockets in descending or ascending order according to size to allow the user to quickly identify and grasp the socket of interest. U.S. Pat. No. 5,573,116 discloses such a tray which displays variously sized sockets for access by a user.
However, certain maintenance and construction personnel are required to be mobile and as a result are limited in the quantity of tools which can be carried about the work site. Various means have therefore been developed to allow a worker to carry certain specifically defined tools through the use of a utility belt or the like. For example, U.S. Pat. No. 5,512,165 discloses a personal tool box which can be attached to a utility belt and, through the use of a plurality of shelves, can pivot about a portion of the tool box to allow the user to access variously sized tools including sockets. However, such a system is bulky and prone to inadvertent disengagement of the tools and sockets from the tool box.
Alternatively, a loop or strand of cable or wire can be formed to allow for the sockets to be strung end-to-end on the loop with a means being provided to close the loop to retain the sockets thereon. U.S. Pat. No. 5,139,144 discloses such a system wherein the loop can be carried about by the user. However, since the sockets are strung end-to-end on the loop, unless the socket of interest is the one closest to the end of the loop, a number of sockets will necessarily have to be removed to allow access to the socket of interest, which in turn will require the undesired sockets to be restrung upon the loop after the desired socket is removed. This necessarily results in a slow and frustrating process.
The problems indicated above especially manifest themselves when the maintenance or construction worker is required to act quickly, and therefore does not have the luxury of removing a number of sockets strung end-to-end upon a loop, or searching through a number of different compartments to find the socket of interest. For example, a maintenance worker required to keep a production machine on-line quite often has to make quick decisions for quick repairs which therefore requires that the worker not waste time in searching for the tool required for the given job. A system which would allow the worker to gain quick identification and access of the tool or socket of interest would therefore result in a more efficient worker, and ultimately in lower cost of maintenance or manufacture in the product or system with which the worker is associated.


A Virtual Rack module for a programmable logic controller. The Virtual Rack module comprises a subroutine written using a programming language understandable to the programmable logic controller, preferably using the relay ladder logic programming language. The main control program and the Virtual Rack module are compiled on the programming terminal connected to the programmable logic controller and then downloaded into the memory of the programmable logic controller. Once downloaded, the programmer can use configuration screens generated by the Virtual Rack module and displayed on the programming terminal to configure various input and output devices independent of when and where the input and output devices are connected to the programmable logic controller.

1. Field of the Invention
The invention relates in general to methods of developing ladder logic programs for Programmable Logic Controllers (PLCs). In particular, the invention provides a method of creating a "generic" control system for automating the configuration of I/O modules, and more importantly, the automatic generation of I/O channels for allowing the assignment and configuration of the I/O module at runtime.
2. Related Art
Programmable logic controllers (PLCs) perform many of the control functions for assembly line machines, machine tools, and other types of industrial equipment in accordance with a stored program. The control program comprises a series of process control instructions that are read out and executed to examine the condition of selected sensing devices on the controlled equipment, and to energize or deenergize selected operating devices. A typical PLC, such as a type manufactured by Allen-Bradley Company, is capable of executing a number of categories of instructions, including a standard set of arithmetic, logical, move, diagnostic, register, comparison, and data transfer instructions as in any computer.
The International Electrotechnical Commission (IEC) 1131 committee has developed a common set of programming interfaces and four basic languages for programming PLCs, regardless of the manufacturer. The four basic languages are ladder diagram (ladder logic), instruction list, structured text, and function block diagram. A fifth basic language, sequential function charts, is used within the four basic languages.
Electrical engineers write most of the control software using the ladder logic programming language. Ladder logic originated with electricians and electrical maintenance operations and, although adapted, ladder logic still uses a standardized set of symbols from that discipline to represent electrical sequences of operations. A series of electrical relay contacts, timer, counters and the like, are laid out in software to control various hardware field devices.
Ladder logic diagrams are used to represent the interconnections of field devices in such a way that the activation of one device could turn on another according to a predetermined sequence of events. It starts at the top of a sequence of actions, then moves down in steps. Once completed, it repeats the whole sequence.
Instruction list is a low-level language similar to assembler language. Only one operation, such as storing a value in a register, is allowed per line of coding. It is useful for smaller applications or for optimizing parts of an application.
Structured text is a high-level block structure language that has a syntax that resembles Pascal. It can be used to express complex statements involving variables representing a wide range of different types of data, including analog and digital values. There also are specific data types for the management of time, dates, and durations, which are important to batch processing applications.
Function block diagram is a graphical language that allows program elements that appear as blocks to be "wired" together in a form similar to a circuit diagram. Function blocks are standard blocks that execute algorithms such as for equipment in a Process Instrument Diagram (PID). Function block diagrams are well-suited for applications that involve the flow of information or data between control components.
A language that pervades all other languages is sequential function chart (SFC). This graphical language is a way of organizing programs written in the other four in such a way as to accomplish sequential control. SFC provides a diagrammatic representation of program sequences. It supports alternative sequence selections and parallel sequences.
Typically, the industry uses a standard approach to design an automated control system using various proprietary hardware in conjunction with customized software. This standard approach has serious drawbacks. First, the proprietary hardware will eventually become obsolete because a change of hardware usually necessitates a corresponding change in the control system. Second, minor changes from site to site can result in short term delays due to recoding and debugging. As a result, long term cost increases because many different versions or multiple control systems of the same control system generating a complex support problem. Third, there is no consistent performance or data from the multiple control systems because each control system is not identical. Finally, in a hard-wired, hard-coded system, the end user has little ability to modify the system to meet the changing needs of the end user.
In view of the foregoing, it is an object of the invention to provide a method of producing a generic control system designed to work with any hardware in the control system by using a Virtual Rack I/O module. The generic control system is both very capable and highly configurable to the specific task. To produce a generic, robotic paint control system, for example, the generic control system would consider all variations to the theme found in the entire scope of that industry. The generic control system would include all types of hardware interfacing, control strategy as well as considering the variables in the product to be painted. With the generic control system, understanding the control system is no longer a concern to the end user, the end user needs only to "configure" the generic control system to generate a specific control system that performs the required task.
Because the I/O hardware and wiring are separate from the control logic, the generic approach of a generic control system using the Virtual Rack I/O module has several distinct advantages from the standard approach. First, future changes in hardware can be accommodated by the system without modifying the software. Second, a generic control system does not compromise the control system design or scope. Third, a generic control system can be installed as an upgrade to an existing automated control system without risk or overhead to the end user. Fourth, a generic control system provides one standard control system for a wide variety of applications, thereby reducing cost while ensuring site-wide consistent performance and data. Fifth, a generic control system is highly configurable so that the end user has the power and flexibility to modify hardware, control strategy or scope by changing the system's configuration. Finally, a generic control system does not need to be modified and can be rapidly installed from site to site.

Generic control systems using a virtual rack module