Apparatus and method are provided that can be advantageously included in a timing phase-locked loop for finally adjusting the period of a timing signal being controlled by that loop. The loop filter receives the timing signal and generates a loop error signal indicative of whether the period of the timing signal should be held the same, increased or decreased. A strobe signal is also generated each time that the timing signal is to be so corrected. The error signal and strobe signal are provided to a function generator such as a state machine. Each time that the function generator is strobed by the strobe signal, it produces a count signal whose value is representative of N, N+C or N-C, where N and C are integers and C represents a preset desired increment of change for the timing signal per strobe, i.e. the fineness of the adjustment of the timing signal. When not strobed by the strobe signal, the state machine produces a count signal of value N. When the state machine is strobed by the strobe signal and the error signal indicates that the timing signal should be held as is, the state machine remains in a first state such that the count signal has a value of N. If the state machine is strobed by the strobe signal and the error signal indicates that the period of the timing signal should be increased, then the state machine moves to a second state such that a digital count signal of N+C is generated once, after which the state machine returns to the first state. If the state machine is strobed by the strobe signal and the error signal indicates that the period of the timing signal should be decreased, then the state machine is moved to a third state such that a digital count signal of N-C is produced once, after which the state machine returns to the first state. The count signal is provided in parallel to a divide-by counter, which also receives a clock signal having a fixed frequency N times the frequency of the timing signal. The counter divides the clock signal by the value of the count signal to produce the timing signal. This timing signal is provided to the loop filter. The timing signal can also be used for example to clock in data.

There exist applications in which there is a need to provide a variable-rate clock for timing recovery in direct-sequence spread spectrum (DSSS) communication systems. The present invention fulfills that need.
Various direct-sequence spread spectrum (DSSS) communication systems are known. For example, see U.S. Pat. No. 5,060,180 issued Oct. 22, 1991 for "Programmable Digital Loop Filter" by Samuel C. Kingston et al; U.S. Pat. No. 5,128,958 issued Jul. 7, 1992 for "Digital Time Error Signal Generator" by Samuel C. Kingston et al; and U.S. Pat. No. 5,099,494 issued Mar. 24, 1992 for "Six Channel Digital Demodulator" by Samuel C. Kingston et al, each of which are hereby incorporated by reference herein. Each of the three above-identified Kingston et al patents refers to or includes a clock error signal Es for controlling a clock synthesizer. Kingston et al '180 shows a clock synthesizer 77 in its FIG. 2. Kingston et al '958 shows a clock synthesizer 76 in its FIG. 2. Kingston et al '494 refers to a clock synthesizer at column 3, line 48.
In Kingston et al '180, a programmable second order loop filter is provided with first and second programmable scaling circuits arranged in parallel and having their outputs connected to first and second programmable one bit serial adders respectively. The output of the second programmable serial adder is coupled to the input of the first programmable serial adder and has its output coupled to the input of a programmable output stage so as to provide the ability to maintain the average quantization bit error to one-half of one bit of the least significant bit of the full loop filter width even though the output does not use or employ all of the significant bits. FIG. 2 of the Kingston et al '180 patent shows a phase-locked loop employing a clock synthesizer 77 and passing through receiver stages 10, demodulator 54, line 55, switch 67, line 76, clock synthesizer 77, line 78, master clock or system clock 72, line 73, timing and control circuit 74 and line 53 applied to the clock input of receiver stages 10.
In Kingston et al '958, a time error signal generator of the type employed in symbol time tracking loops is provided with a pre-accumulate and scale circuit for receiving an input data stream which is applied to a digital early sample-late sample circuit for generation of an error signal indicative of a time magnitude difference between the analog transition time of the data and the chip strobe time multiplied by the sign of the data. The output of the early sample-late sample circuit is applied to a second accumulate and scale circuit for generating an accumulated error signal which is applied to an inverter. The inverter is provided with a decision directed tracking input indicative of the sign of the data sample and is employed to invert the accumulated error signal when the sign of the analog data is negative. The output of the inverter provides a digital time error tracking signal which is adapted to be coupled to a clock generation circuit or clock synthesizer for generating the tracking loop system clock as well as other strobe timing signals. Kingston et al '958 shows a phase-locked loop passing through its second order filter 74 and clock synthesizer 76, the latter producing the system clock 53 applied to components 51, 29 and 42.
Kingston et al '494 describes a six channel programmable digital demodulator of the type designed to be manufactured as an integrated circuit with other components. This demodulator comprises a code channel, a level channel and a phase channel, each of which includes two accumulate and scale circuits. Each of the accumulate and scale circuits is connected to an I or a Q channel of the data which has been despread after being received from the communications receiver. The outputs of two of the accumulate and scale circuits are applied to a two to one multiplexor which is controlled by a command generator to provide a selectable output defining a clock error signal. The remaining four accumulate and scale circuits are connected to a first four to one multiplexor to provide a selectable output defining a clock error signal. The same four remaining outputs from the accumulate and scale circuits are connected to a second four to one multiplexor having an output defining a carrier error signal.

Variable rate clock for timing recovery and method therefor


The irrigation controller is for directing the times and duration of the flow of water to a set of irrigation zones within an irrigation system in accordance with irrigation program and schedule data. The irrigation controller includes a microprocessor and a memory which are programmed with an embedded Web server. The embedded Web server can send and receive irrigation program and schedule data in the hypertext mark-up language (HTML) format. The irrigation controller communicates HTML formatted program and schedule data through an on-board Ethernet chipset to a local area network (LAN). Accordingly, irrigation controller program and schedule data may be interactively accessed from any network accessing device having a standard Web browser which is connected to the LAN, such as for example a personal computer with a Web browser connected to the LAN. Moreover, if the LAN is connected to the Internet, the program and schedule data may be viewed or changed from a web accessing device connected to the Internet.

Irrigation controllers are used to control the scheduling and duration of the flow of water to irrigation devices such as sprinkler heads. Sprinkler heads are typically grouped in zones which are supplied by valves which are in turn controlled by an irrigation controller. Typically, irrigation controllers include a clock, a programmable microprocessor or other type of timing device and an input device that allows the user to change the scheduling and duration of the operation of the various zones within the system. Some present irrigation controllers are designed for computer access. However, computers that interface with present systems must have specialized software or specialized hardware and software for receiving and interpreting program and schedule data from an irrigation controller.
The need for specialized software or specialized hardware and software presents problems when attempting to program or reprogram an irrigation controller from a computer. The computer must first be outfitted with the specialized software or specialized hardware and software before it can be used to program or reprogram existing irrigation controllers. This increases the expense and difficulty of establishing a remote contact with an irrigation controller—especially when the user is borrowing or using a computer he or she does not own.


Disclosed is a circuit board for display device which includes a main circuit board and a flexible circuit board. The main circuit board has a power input pad and a power receiving pad that are exposed to the outside. A power supply voltage is applied to the power input pad. The flexible circuit board is coupled on one surface of the main circuit board. The flexible circuit board is configured to electrically connect the power input pad and the power receiving pad. A display device including the circuit board has a panel input pad receiving the power supply voltage from the main circuit board.

1. Field
One or more embodiments relate to a circuit board for display device and a display device including the same.
2. Description of the Related Art
A large-scaled display device and an increase in pixels necessitate sufficient supplying of a power supply voltage. In order to supply a power stably, a display device is configured to a power supply voltage to a display panel using a separate circuit board.
A display device has been designed to widen a display area and to narrow a vessel region (or, a non-display area). Reduction of the vessel region forces a mounting area of a circuit board to be reduced. As an upper area of the circuit board is reduced, the higher integration of circuit and a multi-layer structure are required.
As described above, as a design of a circuit board is varied, a cost needed to make a display device and a circuit board may rise.
In a circuit board with a narrow area, if a power supply voltage is transferred via an inner layer of the circuit board, it may affect peripheral signal terminals. This means that signal interference is generated. Thus, a malfunction of the display device is caused.

Circuit board for display device and display device having the same


In a method and apparatus for press bending a metal plate, a punch is inserted into a recess of a die to bend a plate. The punch has a first edge formed away from a die and a second edge formed near the die. A corner of the recess of the die opposed to the punch is chamfered. The chamfered face has a third edge formed at the border of the top side of the die at the chamfered recess. In a first half of the press bending, the plate is bent with the first and third edges serving as lines of contact. Subsequently, the plate is further bent with the second edge serving as a line of contact. A portion of the punch between the first and second edges is held in a non-contact state with the plate throughout steps of press bending the plate.

1. Field of the Invention
This invention relates to improved techniques for press bending a malleable plate, such as a metal plate, by inserting a punch into a recess of a die. More particularly, the present invention relates to such press bending techniques for deforming the malleable plate into a shape conforming to a distal end face and a side face of the punch, thereby bending the plate into a desired shape.
2. Description of the Related Art
Japanese Laid-Open Patent Publication No. 3-264116 discloses a related conventional method of press bending a metal plate. This conventional method will be described with reference to FIGS. 7 and 8. Press 1 has been adapted for bending both ends of a steel plate W approximately at right angles to a central portion of the steel plate W, and thereby form a product generally having a U-shape in cross section. Such a press has been previously used to manufacture bumpers for automobiles.
The press 1 includes a die 4 fixed at a predetermined position and a vertically movable punch 2. FIG. 7 illustrates an example in which the bending operation of the steel plate W by the punch 2 and die 4 has been completed.
The punch 2 is formed into a thick plate-like shape and has, between bottom and side faces thereof, two corners or rounded edges that serve to bend the plate W. Each corner is chamfered into a rounded face 2r. The punch 2 has a distal end, namely, a bottom or terminated end formed with a shallow groove 2m for the plate W to permit metal to be transferred from the central portion of the plate to the bent corners during the bending process.
The die 4 has a recess 4m into which the punch 2 is inserted. Each opening edge between a top face 4u and a side face 4s of the recess 4m also is chamfered to a rounded face 4f. Each corner between the side face 4s and a bottom face 4b of the recess 4m also is chamfered to a rounded face 4r which forms the bent portion Wt of the metal plate W (see FIG. 8(C)) in co-operation with the punch 2. The clearance between the punch 2 and the recess 4m of the die 4 is set to be as small as possible to enhance bending accuracy.
In the press bending operation, the flat plate W is set on the top face 4u of the die 4, and the punch 2 is then moved downward. The punch 2 is inserted into the recess 4m of the die 4 (see FIG. 8(A)). In the process of the punch 2 moving to reach its lowest position (see FIG. 8(B)), the plate W is deformed into a shape conforming to the distal end face and side faces of the punch 2, so that both ends of the plate W are bent approximately at right angles to its central portion.
According to the above-described method, the clearance between the punch 2 and the recess 4m of the die 4 is set to be as small as possible, and the opening edge of the recess 4m is formed as the rounded face 4f. Accordingly, both ends of the plate W are brought into face-to-face contact with the rounded face 4f of the die 4 when the punch 2 is inserted into the recess 4m of the die 4 to bend the plate W (see FIG. 8(A)). Subsequent to the face-to-face contact with the rounded face 4f, the ends of the plate W are pressed into the clearance between the punch 2 and the recess 4m (see FIG. 8(B)). In other words, both ends of the plate W are rubbed against the rounded face 4f and thereafter pressed into the clearance. Therefore, each end of the plate W is pressed by the punch 2 and the die 4 with an unrelieved stress remaining in each end. The remaining stress tends to deform each bent edge to conform to the rounded face 4f of the die 4. This unrelieved stress results in local warping Ws or swelling Wh as shown in FIG. 8(D), when the product W is taken out of the press 1 after being bent.
Furthermore, the bent portion Wt of the plate W is closely pressed between the rounded face 2r of the punch 2 and the rounded face 4r of the recess 4m. Accordingly, a stress resulting from the difference in the length between the inside corner and the outside corner of the bent portion Wt of the plate W remains in the bent portion Wt. The remaining stress tends to stretch the inside corner of the bent portion Wt, resulting at the bent portion Wt as shown in FIG. 8(C). Thus, the above-described conventional press bending method does not accurately reproduce the desired shape for the bent products.

Method and apparatus for bending malleable plates


An implantable cardiac stimulation device for determining whether a patient has asymptomatic diabetes. A pulse generator delivers pacing pulses to the heart. A sensing circuit senses internal cardiac signals. A processor is programmed to measure at least one characteristic of the cardiac signals, which are processed to determine whether the patient has asymptomatic diabetes. Relative changes in the measured characteristics over time are indicative of whether the patient has asymptomatic diabetes. The measured characteristics may include, alone or in combination, T-wave morphology, corrected QT internal, QT dispersion and signal averaged QRS width.

Implantable cardiac devices ("ICDs") are well known in the art, and may operate to treat a variety of heart conditions. For example, included within the penumbra of ICDs are pacemakers, which may operate to maintain a healthy heart rate in a patient, or may operate to maintain a heart rate above a prescribed limit, such as, for example, to treat a bradycardia. Other examples of ICDs include cardioverter-defibrillators, which may operate to terminate potentially unhealthy arrhythmias or fibrillations. Some ICDs include both pacing circuitry and cardioverter-defibrillator circuitry. Other ICDs are designed to monitor a patient's heartbeat for diagnostic purposes.
Diabetes and heart disease share common risk factors, such as, for example, high blood pressure and cholesterol. Moreover, patients whose treatment for various heart conditions requires an ICD, are typically of an age group that is likely to develop diabetes during treatment with the ICD.
Abnormal cardiac rhythms, as measured by external electrocardiograms ("ECGs"), are known to be associated with diabetes. For example, T-wave oversensing in an ICD due to hyperglycemia has been reported. Specifically, it has been demonstrated that T-wave oversensing in the ICD was dependent on elevated serum glucose levels. Additionally, it has been reported that resting ECGs from young diabetics displayed prolonged corrected QT intervals.
Other studies have reported that ECGs showing flat or inverted T-waves were definitively associated with diabetes in otherwise healthy individuals. In fact, some reports suggest that there is an unusual prevalence of undetected diabetes among apparently healthy men who have non-specific T-wave abnormalities.
Even other studies have surmised that external ECGs could be used as an early marker for hypoglycemia because ECGs displayed a decrease in T-wave amplitude with declining blood glucose concentrations, while R-wave amplitudes remained unchanged. Accordingly, external ECGs facilitated observations that the R:T-wave ratio increased progressively in diabetic patients as blood glucose concentrations dipped to subnormal and hypoglycemic levels. It has been suggested that changes in external ECGs could be useful for detecting hypoglycemia and that a portable ECG recording system programmed with an algorithm capable of recognizing abnormal ECG patterns could alert a patient to check blood glucose levels if the measured R:T-wave ratio falls outside a pre-defined range.
Moreover, a system and method for monitoring diabetes-related blood constituents has been described. Specifically, the system provides a sensor that infers changes in blood glucose levels based upon external ECG signals and analyzes the external ECG signals to determine whether a group of parameters, including QRS, T-wave absolute mean, RMS values, QRS intervals, QT intervals, and RR intervals, is indicative of decreased blood glucose and/or insulin levels.
Accordingly, it would be advantageous to develop an ICD that, in addition to treating a particular heart condition, also is capable of continuously monitoring the patient's heartbeat for abnormal cardiac signals indicative of diabetes. Even more advantageous would be an ICD capable of monitoring at least one characteristic from internal cardiac signals, as opposed to monitoring external ECGs. Still more advantageous would be an ICD capable of monitoring multiple characteristics of the heartbeat to more accurately assess whether the patient has an abnormal heartbeat indicative of the early onset of diabetes and further capable of alerting the patient and physician of detected abnormalities as early as possible to increase the chances of effective diabetes treatment.

Implantable cardiac stimulation device and method for detecting asymptomatic diabetes


Material scraps can be collected and resized. The resized scrap can be distributed to create a recovered material layer, which layer (with or without one or more carrier layers and/or additional elements) can then be subjected to heat and/or pressure so as to create a pliable composite panel. That pliable composite panel, or a portion thereof, may then be used to create an upper shell or another article.

For many types of footwear, a manufacturer creates an upper by cutting one or more sheet material elements from a larger panel of that same material. The manufacturer may, depending on the shoe design, join together multiple cut elements to create an upper shell. This shell can then undergo further fabrication operations and ultimately be joined to a sole structure.
Cutting upper elements from larger sheets of material creates scrap. After cutting elements from a stock material sheet, for example, the remaining parts of that sheet may be too small for use in other aspects of the upper fabrication process. Reducing scrap is often an important factor when planning production. For example, a manufacturer may cut elements from a larger sheet by arranging cutting dies so as to maximize the number of elements obtained from that sheet. In some cases, the design for a shoe upper may be affected by the amount of scrap likely to be generated. For example, a designer might desire a particular shape for an upper element so as to achieve a particular aesthetic or to achieve some other goal. However, it may be difficult to cut that shape from commercially available sheets of a particular material without leaving large amounts of unusable scrap. As a result, the designer may be forced to change the shape of the upper element so that more of the commercially available sheet can be utilized.
Even in moderately sized production runs, a large volume of scrap might be generated. Such scrap often enters the waste stream and is frequently burned. Recycling this scrap can be difficult. For example, some upper designs may incorporate multiple types of materials. Not all of those materials may be recyclable, or one material may be recyclable for some purposes and another may only be recyclable for different purposes. Separating these different types material scraps for recycling might be labor intensive or otherwise impractical.
The above concerns are not limited to manufacturing of footwear. Many other types of goods can include manufacturing operations that generate scrap, which scrap may be difficult to recycle or otherwise dispose of in an environmentally-conscious manner. For commercial, environmental and other reasons, there remains a need for ways to reduce the amount of material scrap that enters the waste stream during production of shoes and/or other types of goods.

Forming portion of an article from fabrication scrap, and products thereof


A method of submitting orders for products includes a customer preparing an order for submission to a supplier server. When the order is submitted to the supplier server, the supplier server determines whether the customer submitting the order is authorized to submit the order to the supplier. If not, the supplier server forwards the order to another customer who is authorized to submit the order. After forwarding the order, the order may be consolidated with other orders for resubmission to the supplier server.

Due to the logistical complexities of unpacking and shipping, a main supplier of goods will often provide a discount if a buyer purchases case quantities of goods. For example, if a product comes twelve to a case, a supplier might give a five percent discount for each case purchased as opposed to the same number purchased as single quantities.
At the same time, some customers interested in purchasing goods are not allowed to purchase goods direct from the main supplier. Suppliers often restrict direct purchasers to those having a unique relationship with the supplier, such as those buying a large volume of goods or those with consistently high sales volumes. In those situations, the direct purchasers then may supply several other customers with goods.
The direct purchaser usually desires to purchase products in case quantities whenever possible in order to obtain a case discount offered by the supplier. However, if the direct purchaser supplies to a number of smaller or down-line customers, he may obtain several orders for products that are not in case quantities. Therefore, to obtain the case discount, the direct purchaser must consolidate the orders from the various customers in order to determine if a case discount is available. If the direct purchaser is processing numerous orders from many other customers, the direct purchaser may have great difficulty consolidating the order, and thus would not be able to take full advantage of case discounts, thereby increasing the cost of the goods to all customers.
A system and method for consolidating orders whereby the direct purchaser could automatically consolidate orders from other customers is thus highly desirable.


Method and apparatus for storing and moving an x-ray detector assembly in and out of the field of radiation produced by a radiation therapy simulator source while remaining affixed to the gantry of the simulator and retaining the functional attributes of a standard radiation therapy simulator cassette holder. When mounted to the simulator, the apparatus of the present invention has the ability to position an x-ray cassette in a fixed position relative to the radiation source, allow for the use of an image intensifier tube by being effectively radiolucent over the tube, and incorporating a mechanism which is capable of absorbing a degree of movement independent of the gantry while simultaneously activating a switch mechanism which can be used to stop gantry rotation, thereby preventing damage to the device or that which it contacts.

The present invention relates to a method and apparatus for mounting the detector array of a CT (computed tomography) scanner to a conventional radiation therapy simulator (RTS) for use of the simulator to produce scans without inhibiting the simulator's fluoroscope and plain film acquisition modes when scans are not being acquired. More specifically, the present invention is directed to a method and apparatus for use in connection with the CT scanner described in co-pending applications Ser. Nos. 07/718,544 and 07/850,346, both assigned to W. L. Systems, Inc. The invention described in that co-pending application is a method and apparatus for back projecting a CT scan using a conventional radiation therapy simulator without rendering the simulator incapable of being used for treatment planning purposes. The present invention facilitates that use by providing the method and apparatus for mounting the detector array of that apparatus to the simulator while still providing for the use of the simulator as a radiation therapy simulator. In that manner, the CT scanner is also used to enhance treatment planning.
The method and apparatus of the present invention has the additional advantage of providing a safety override for the simulator to which the apparatus is mounted. Specifically, the apparatus stops the rotation of the gantry or movement of the fixture supporting the image intensifier tube of the simulator in the event that an object is encountered during rotation or other movement, thereby decreasing the likelihood of damage to the apparatus of the present invention, the simulator, or the encountered object.
Other advantages, and the objects of the present invention will be apparent from the following detailed description of the preferred embodiment thereof.

Method and apparatus for mounting the detector array of a CT scanner to a radiation therapy simulator


A method of making a semiconductor structure, comprises etching a nitride layer with a plasma to form a patterned nitride layer. The nitride layer is on a semiconductor substrate, a photoresist layer is on the nitride layer, and the plasma is prepared from a gas mixture comprising CF4 and CHF3 at a pressure of at least 10 mTorr.

Modern integrated circuits are constructed with up to several million active devices, such as transistors and capacitors, formed in and on a semiconductor substrate. Interconnections between the active devices are created by providing a plurality of conductive interconnection layers, such as polycrystalline silicon and metal, which are etched to form conductors for carrying signals. The conductive layers and interlayer dielectrics are deposited on the silicon substrate wafer in succession, with each layer being, for example, on the order of 1 micron in thickness.
A gate structure is an element of a transistor. FIG. 1 illustrates an example of a gate stack 8. A semiconductor substrate 10 supports a gate insulating layer 16, which overlaps doped regions (source/drain regions) in the substrate (12 and 14), and the gate insulating layer supports a gate 18, which is typically polycrystalline silicon. On the gate is a metallic layer 30. The metallic layer may be separated from the gate by one or more other layers, such as nitrides, oxides, or silicides, illustrated collectively as barrier layer 20. The metallic layer may in turn support one or more other layers (collectively 40), such as nitrides, oxides, or silicides. Oxide 22 may be formed on the sides of the gate to protect the gate oxide at the foot of the gate stack; and insulating spacers 24 may be formed on either side of the gate stack. Furthermore, contacts to the source/drain regions in the substrate, and to the gate structure, may be formed.
Self-aligned contacts (SAC) allow the design of a semiconductor device to have a distance between the gate and the via contact to the substrate, to be at most one-half the minimum gate width. Typically, SAC uses a nitride layer on the gate stack, together with spacers that include nitride, to prevent a misaligned contact from contacting the gate itself. If the nitride were not present, then the etch used to form the hole which will become the contact would pass through the dielectric layer all the way to the gate. When present, the nitride layer and spacers acts as an etch stop, preventing misalignment from forming a hole all the way to the gate, and therefore allowing design of the device to have a much smaller average distance between the contact and the gate.
The nitride layer on the gate stack has at least a thickness of 800 angstroms when used for forming SAC. If used only for other purposes, such as an etch-stop layer or a hard mask, a thickness of less than 800 angstroms is used. Also, the thickness of at least 800 angstroms is the thickness after the dielectric layer has been formed; the nitride layer is usually thicker when originally formed, allowing for a loss of about 500 angstroms during the gate etch (i.e. thickness for the hard mask function), and a loss of about 200 angstroms during nitride spacer formation.
There is an ongoing need to reduce the size of the elements within integrated circuits and semiconductor structures. As the size of an element is reduced, shorter wavelength radiation is need to for exposing the photoresist in order to obtain the smaller features desired. Consequently, photoresists sensitive to the shorter wavelength radiation must also be used. In order to obtain features on the order of 0.1 micron, radiation having a wavelength of 193 nm is used, and the photoresists sensitive to this wavelength are referred to as 193 nm resists. A variety of these resists are commercially available, such as T9269 (from Clariant International, Ltd., Muttenz, Switzerland), 6A100 (Tokyo Ohka Kogyo, Kawasaki-shi, Japan), and AR414 and AR237 (both from Japan Synthetic Rubber Co., Ltd., Tokyo, Japan).
An undesirable problem that arises, however, is that the etching processes have been optimized for the specific photoresists, and switching to different photoresists along with a reduction is scale, can result in problems, such as an increase in line-edge roughness (see "An Experimentally Validated Analytical Model For Gate Line-Edge Roughness (LER) Effects on Technology Scaling" Diaz, C. H., et al., IEEE Electronic Device Letters, Vol. 22, No. 6, pp. 287–89 (June 2001)). Increased line-edge roughness will result in device deficiencies, and a reduction in device yield.


A frequency synthesizer (51) arranged in a phase locked loop fashion to provide an output signal with a preselected frequency within a controlled lock time from a voltage controlled oscillator (51), having: a phase detector (55) with a controllable gain, that provides an error signal proportional to the controllable gain and corresponding to a phase difference between a reference signal and a feedback signal, an adapt circuit (121) for setting the controllable gain to an adapt value (205), and a tracking circuit (123) for setting the controllable gain to a tracking value (207) by adjusting the controllable gain in a predetermined and controlled fashion from the adapt value (205) to the tracking value (207).

Communications receivers and transmitters that operate on multiple frequencies may be required to switch from one to a second such frequency. This switching of frequencies ordinarily entails reprogramming some form of a frequency synthesizer and waiting for such synthesizer to re-acquire frequency lock on the new frequency. In more advanced systems and applications such as scanning or packet data or TDMA or frequency hopped spread spectrum systems the length of time required to re-acquire or initially acquire lock is critical with premiums being placed on shorter lock acquisition times.
At the same time the dynamics of phase lock loop based frequency synthesizers entail a trade off or compromise between the time required for acquiring lock (lock time) and other loop characteristics such as a noise spectral density about the synthesized frequency. Generally, other things being equal a shorter lock time results in a higher noise spectral density. In numerous applications this higher noise spectral density may be considered unacceptable. Therefore practitioners have used adaptive phase locked loops of various configurations. Adaptation has often taken one of or a combination of two forms including either a two state loop bandwidth or loop gain. The broad bandwidth or high gain state is used until the phase locked loop has achieved a certain degree of lock acquisition followed by a switch to a narrower bandwidth or lower loop gain. This approach helps achieve a short lock time and an acceptable noise spectral density.
However, switching between bandwidths or switching between gains tends to generate discontinuities within the phase locked loop. Adding insult to injury, these discontinuities must be eliminated (tracked out) by the phase locked loop while such loop is in it's slowest response, i.e. low gain or narrow bandwidth, mode. Avoiding these discontinuities has been attempted in a switched bandwidth type adaptive phase locked loop frequency synthesizer but at the cost of excessive complexity and/or introduction of other potential noise sources. Therefore a clear need exists for a readily implemented phase locked loop frequency synthesizer that exhibits a fast lock time and acceptable noise characteristics.

Frequency synthesizer employing a continuously adaptive phase detector and method


Prior-art high speed TTL-to-CMOS input buffers consume a large amount of power supply current through the input transistors when the input voltage is held at a mid-range level between V.sub.DD and V.sub.SS (e.g., 2.0 volts). The inventive input buffer includes a resistance in series with the p-channel pull-up transistor on the input inverter, in order to limit this current. In addition, to retain high operating speed, a p-channel shunt transistor is placed in parallel with the resistance, and controlled by the buffer output signal. This shunt transistor effectively bypasses the resistance from the circuit when the buffer output goes low, thereby providing high operating speed.

1. Field of the Invention
The present invention relates to an integrated circuit having a complementary (e.g., CMOS) input buffer.
2. Description of the Prior Art
Integrated circuits (ICs) use one or more input buffers to interface with external circuitry that supplies digital or analog signals to the IC. In the case of CMOS (from Complementary Metal Oxide Semiconductor) integrated circuits, the input buffer typically takes the form shown in FIG. 1. An input voltage V.sub.in is applied to the gates of p-channel pull-up transistor 11 and n-channel pull-down transistor 12, which form an input inverter complementary pair. The drains of input transistors 11 and 12 are coupled to common node 13, which drives the gates of the output inverter complementary pair, transistors 14 and 15. This output inverter is usually included to provide additional capability to chive various other circuitry on the IC from the buffer output node 16. One criteria of buffer operation is propagation delay, which is the difference in time that the input crosses the switching threshold of the input inverter pair (typically about 1.5 volts) to the time the output (node 16) crosses the voltage of 1/2 V.sub.DD (typically about 2.5 volts). Another criteria is power consumption, which depends in large part upon the current I.sub.1 that flows through the input inverter.
In the case of buffers designed to receive transistor-transistor logic (TTL) voltage levels, the current I.sub.1 may become undesirably large. This is because the TTL logic levels are, at worst case, 0.8 volts (low) or 2.0 volts (high). These voltages are usually above the conduction thresholds of CMOS transistors 11 and 12. That is, the p-channel input transistor (I 1) and n-channel input transistor (12) may both be conducting at V.sub.in =0.8 volts, and typically even more conducting at V.sub.in =2.0 volts. Therefore, since DC voltages may be present at these levels when TTL input signals are supplied, a relatively large current I.sub.1 may flow, causing undesirably high power consumption by the input buffer. One technique of limiting this current flow is to make the input transistors smaller, which increases their "on" resistance. However, that has the undesirable effect of limiting the speed of the input transistors. Hence, a solution to the problem has been sought by other means.
One technique that has been successfully adopted in practice is shown in U.S. Pat. No. 672,243 co-assigned herewith. That technique makes use of a transition detector to control a voltage boosting means connected to the input of the first inverter, and may be considered a "feed-forward" technique. However, that technique requires a relatively large number of additional transistors. In another approach, a voltage-dropping transistor is inserted between the positive power supply (V.sub.DD) and the p-channel input transistor; see, for example, U.S. Pat. No. 4,471,242. The reduced operating voltage prevents the p-channel input transistor from turning on when the lowest level of a logic "1" is present. However, that approach typically results in a significant reduction of operating speed.

CMOS input buffer with high speed and low power


In an exclusive lock management in common to both the In-Band and the Out-of-band, a lock control technique of a storage system capable of removing the factor that may cause the discrepancy in the configuration information in a disk array system is disclosed. In the storage system, a shared memory in a DKC of a storage subsystem has lock management information for uniformly managing the operation authority for the configuration information in the shared memory that is used in common by both the channels of the host terminals and the management client terminals, and a CPU in the DKC gives the operation authority for changing the configuration information to either the host machine or the management client based on the lock management information in the shared memory in response to an access request from the host terminals or the management client terminals.

According to the examinations by the inventors of the present invention, the followings are known as the conventional storage systems and the control techniques thereof.
For example, in a storage system according to the prior art, the SAN (Storage Area Network) environment in which storages of large capacity and high functionalities are built on the network has been developed. Also, since various types of host machines are connected, data compatibility means is required and the needs for NAS (Network Attached Storage) in the SAN environment have been increased. Under these circumstances, a manager to manage and control the storages on the SAN environment has become indispensable. For example, as for the connection between storages and host machines in the SAN environment, Block Storage access of SCSI (Small Computer System Interface) by FibreChannel is used, and on the other hand, in the NAS environment, the connection is done by network protocols such as NFS (Network File System) by the Ethernet (registered trademark) and so forth.
The control techniques of these storage systems include an In-Band method in which a storage interface with host machines is used and an Out-of-Band method in which other interface physically and logically different from the interface to acquire the storage data from host machines is used. These methods are selectively employed depending on the respective purposes and the conditions of the applications and the interfaces loaded in the host machines. In order to use both of the methods, a technique is disclosed in Japanese Patent Application Laid-Open Publication No. 2003-241903, in which the connections in the storage system are unified by the interface for storage access and the interface for management control, and the storage data and the storage management control are realized by using the single connection network.

Storage system and control method thereof for uniformly managing the operation authority of a disk array system


Interferon-alpha (IFNα) analog proteins modified by chemical attachment of at least one hydrophilic polymer moiety, such as polyethylene glycol chain, are described. In one embodiment, the IFNα analog protein has an amino acid sequence that differs from a native human IFNα interferon-alpha by one or more amino acid residues in the N-terminal region, comprised of between about residues 1-27, inclusive, by one or more substitutions selected based on the amino acid residue at the corresponding position of a mature interferon-tau (IFNτ) protein. Methods of treating viral diseases and other disorders with the polymer-modified IFNα analog protein are also described.

Interferons (IFNs) are classified into two distinct groups: type I interferons, including IFNα, IFNβ, IFNτ, and IFNω (also known as IFNαII); and type II interferons, represented by IFNγ (reviewed by DeMaeyer, E., et al., INTERFERONS AND OTHER REGULATORY CYTOKINES, John Wiley and Sons, New York (1988)). Human interferon alpha (HuIFNα) is a type I interferon consisting of approximately 25 known distinct subtypes. These HuIFNα are highly pleiotropic cytokines with broad-spectrum antiviral, antiproliferative, and immunomodulatory properties. Specifically, they inhibit replication of a variety of RNA- and DNA-containing viruses, inhibit the growth of malignant cells, affect the expression of a variety of oncogenes, and activate natural killer cells.
A subtype of HuIFNα, HuIFNα2, has been used in the treatment of various viral diseases and cancers. However, at the doses required for therapeutic effects, patients often suffer from toxic side effects including "flu-like symptoms", malaise, anorexia, neutropenia, and abnormal liver function. Many patients cannot tolerate the side effects and treatment with IFNα is discontinued.
Attempts to provide an IFNα that does not cause intolerable side effects have led to development of, for example, hybrid IFNs, consensus IFNα, and long-acting interferons, such as pegylated IFNα. Examples of IFNαs modified with polyethylene glycol (PEG) include the pegylated interferon alpha-2b (PEG Intron®) and alpha-2a (Pegasys®), where 12 kDa polyethylene glycol or a 40 kDa branched-chain PEG chain, respectively, are attached to the INFα.
However, the safety profiles of these PEG-modified IFNαs were qualitatively similar or worse than those of the corresponding native proteins (Bukowski R. M. et al., Cancer; 95(2):389-96 (2002); Bukowski R. M. et al., Journal of Clinical Oncology; 20(18):3841-3949 (2002); Motzer, R. J. et al., J. Clin. Oncol., 19(5):1312-9 (2001); Tong M. J., Journal of Interferon and Cytokine Research, 18:81-86 (1998); Yao G. B. et al., Journal of Gastroenterology and Hepatolog., 15:1165-1170 (2000); Heathcote E. J. et al, N. Engl. J. Med., 343(23):1673-80 (2000); Tong M. J. et al., Hepatology; 26(3):747-54 (1997)). The most commonly reported adverse effects were nausea, anorexia, fatigue and rigors, the incidence of which were dose-related. In addition, with longer duration of therapy, dose-limiting toxicities including severe fatigue, neurotoxicity, liver function abnormalities, and myelosuppression were observed at doses of 7.5 μg/kg or higher for PEG Intron® (Bukowski R. M. et al., Cancer; 95(2):389-96 (2002)). Even consensus IFNα at a dose of >9 μg was not tolerated by all patients, and a dose reduction was needed for some patients to complete a study (Yao G. B. et al., Journal of Gastroenterology and Hepatolog., 15:1165-1170 (2000)). Thus, the current pegylated forms of IFNαs and consensus IFNα have failed to address the toxicity problems with IFNα therapy.
There remains a need in the art for an improved polymer modified IFNα.

This patent is subject to a terminal disclaimer.

Low-toxicity, long-circulating human interferon-alpha PEGylated mutants


Methods, systems, and devices for wireless communications are described. In a random access (RACH) procedure, a user equipment (UE) may transmit a first RACH message (e.g., RACH Message A (MsgA)) to a base station, which may include an indication of a modulation order, a maximum number of repetitions for RACH Message B (MsgB) data, or both. The base station may multiplex random access responses (RARs) for UEs into second RACH messages (e.g., RACH MsgBs) based on the indication(s) and may transmit these RACH MsgBs. The UE may receive and decode a downlink control information (DCI) portion of a RACH MsgB but may determine not to decode the data portion of the RACH MsgB if an indication in the DCI of the modulation order, the threshold number of repetitions, or both does not match the value reported by the UE. Otherwise, the UE may decode the full RACH MsgB.

Wireless communications systems are widely deployed to provide various types of communication content such as voice, video, packet data, messaging, broadcast, and so on. These systems may be capable of supporting communication with multiple users by sharing the available system resources (e.g., time, frequency, and power). Examples of such multiple-access systems include fourth generation (4G) systems such as Long Term Evolution (LTE) systems, LTE-Advanced (LTE-A) systems, or LTE-A Pro systems, and fifth generation (5G) systems which may be referred to as New Radio (NR) systems. These systems may employ technologies such as code division multiple access (CDMA), time division multiple access (TDMA), frequency division multiple access (FDMA), orthogonal FDMA (OFDMA), or discrete Fourier transform spread orthogonal frequency division multiplexing (DFT-S-OFDM). A wireless multiple-access communications system may include one or more base stations or one or more network access nodes, each simultaneously supporting communication for multiple communication devices, which may be otherwise known as user equipment (UE).
In some cases, a base station and a UE operating in a wireless communications system may perform a random access (RACH) procedure in order to complete a handover, adjust a network connection, switch from an idle mode to a connected mode, or perform some combination of these or other connection establishment processes. If performing a two-step RACH procedure, a UE may send a first RACH message—such as a RACH Message A (MsgA)—to a base station, and the base station may respond to one or more UEs with a second RACH message, such as a RACH Message B (MsgB). In some cases, the base station may receive multiple RACH MsgAs from multiple UEs in the system. However, the base station may fail to efficiently reserve resources for RACH MsgB transmissions in response, and each UE monitoring for a response may experience significant latency, complexity of processing, or both due the number of RACH procedures handled concurrently by the base station. Efficient RACH MsgB group transmission techniques may be desirable.

UE-assisted group response for two-step random access procedure


The invention provides a resonator piece, a resonator, an oscillator and an electronic device that can prevent in advance defects from arising in the electrodes and whose frequency characteristics of the resonator piece and CI value are stable. The resonator piece can include a base portion in which a base portion electrode portion is formed, resonating arm portions, groove portions including groove electrode portions, side surface electrode portions, groove electrode-use connection electrode portions, and side surface electrode-use connection electrode portions. The width of the base portion side of openings of the groove portions is formed narrower than the width of other portions, with connection electrode disposition portions for disposing the groove electrode-use connection electrode portions or the side surface electrode-use connection electrode portions being formed near the narrowly formed openings of the groove portions, and the shapes of the openings of the groove portions are formed so as to be substantially symmetrical with respect to hypothetical lines disposed along the longitudinal direction at width-direction centers of the groove portions.

1. Field of Invention
The present invention relates to a resonator piece comprising, for example, crystal, a resonator including the resonator piece, an oscillator disposed with the resonator, and an electronic device.
2. Description of Related Art
Conventionally, a crystal tuning fork resonator piece, which is, for example, a resonator piece, is configured as shown, for example, in FIG. 9. The crystal tuning fork resonator piece 10 includes a base portion 11 and two arm portions 12 and 13 that are formed so as to project from the base portion 11. Additionally, grooves 12a and 13a are disposed in the two arm portions 12 and 13. The grooves 12a and 13a are similarly disposed on back surfaces of the arm portions 12 and 13 that are not shown in FIG. 9.
For this reason, as shown in FIG. 10, which is a cross-sectional view along E–E′ of FIG. 9, the arm portions 12 and 13 are formed so that the cross-sectional shapes thereof have substantial "H" shapes. The substantially H-shaped crystal tuning fork resonator piece 10 has the characteristic that, even if the size of the resonator piece is made significantly compact than the conventional piece, resonation loss of the arm portions 12 and 13 is kept low and the CI value (crystal impedance or equivalent series resistance) can also be kept low.
For this reason, the substantially H-shaped crystal tuning fork resonator piece 10 is particularly suited, for example, for a resonator of which compactness and high-precision performance are demanded. As this resonator, there is a compact resonator or the like whose resonance frequency is, for example, 32.768 kH, and using the substantially H-shaped crystal tuning fork resonator piece 10 as a resonator piece in this resonator is being investigated. Additionally, a compact resonator or the like whose resonance frequency is 32.768 kH will eventually be incorporated and used in precision equipment, such as watches and the like.
When a current is applied from the outside to the above mentioned substantially H-shaped crystal tuning fork resonator piece 10, the arm portions 12 and 13 resonate. Specifically, groove electrodes are formed in the grooves 12a and 13a shown in FIGS. 9 and 10, and side surface electrodes are formed in both side surfaces 12b and 13b, which are surfaces of the arm portions 12 and 13 in which the grooves 12a and 13a are not disposed. Additionally, when the current is applied, an electrical field arises between the groove electrodes and the side surface electrodes, so that the arm portions 12 and 13 resonate.
As described above, the current is applied to the groove electrodes and the side surface electrodes from the outside. Specifically, the current is supplied from the outside to the groove electrodes and the side surface electrodes via a base portion electrode disposed at the base portion 11 of the crystal tuning fork resonator piece 10.
For this reason, connection electrodes that connect the base portion electrode with the groove electrodes and the side surface electrodes become necessary. Of these connection electrodes, a groove electrode-use connection electrode that connects the base portion electrode with the groove electrodes is disposed at a base portion surface 11c in FIG. 9. Also, side surface electrode-use connection electrodes that connect the base portion electrode and the side surface electrodes are disposed, for example, at the base portion surface 11c and an arm portion surface 12c.
However, because the groove 12a and the groove electrode are formed in the arm portion surface 12c, the side surface electrode-use connection electrode disposed at the arm portion surface 12c must be disposed in a portion where the groove 12a is not formed (diagonal line portion in FIG. 9), therefore, the side surface electrode-use connection electrode is disposed in this region.

Resonator piece, resonator, oscillator and electronic device


A laundry treatment device includes a washing module configured to perform operation related to washing, a camera configured to capture an image of a tag attached to a laundry, and a processor configured to acquire laundry information of a plurality of laundries, to convert the acquired laundry information into encoding data, and to acquire values of laundry control variables corresponding to the converted encoding data based on a laundry course learning model learned using a plurality of reference data through a deep learning algorithm.

In modern times, laundry treatment devices or laundry assisting devices are essential appliances in every home.
Clothes, bedclothes or dolls which need to be washed are made of various materials and requirements for washing differ between the materials. Accordingly, current washing machines or laundry assisting devices provide various laundry courses in order to provide laundry functions suitable for various materials.
Meanwhile, conventional laundry treatment devices or laundry assisting devices may provide a predetermined laundry course selected by a user or provide a laundry course reflecting parameters set by a user for each laundry step in each washing operation.
However, a conventional laundry treatment device provides a laundry course that reflects only parameters set by the user for each laundry step even when one type of laundry or various types of laundries is put.
In this case, a specific laundry may be damaged or may not be appropriately washed.

Laundry treatment device and method of determining laundry course thereof


A method and system for decoupling slicing and encoding of media content is described.

The Internet is becoming a primary method for distributing media content (e.g., video and audio or audio) and other information to end users. It is currently possible to download music, video, games, and other media information to computers, cell phones, and virtually any network capable device. The percentage of people accessing the Internet for media content is growing rapidly. The quality of the viewer experience is a key barrier to the growth of video viewing on-line. Consumer expectations for online video are set by their television and movie viewing experiences.
Audience numbers for streaming video on the web are rapidly growing, and there are a growing interest and demand for viewing video on the Internet. Streaming of data files or "streaming media" refers to technology that delivers sequential media content at a rate sufficient to present the media content to a user at the originally anticipated playback speed without significant interruption. Unlike downloaded data of a media file, streamed data may be stored in memory until the data is played back and then subsequently deleted after a specified amount of time has passed.
The process for preparing media content for adaptive streaming typically involves taking a source content file, such as a movie, or a source content feed (e.g., a broadcast signal), and splitting it into temporal chunks or slices, and encoding each slice at a different quality level. Typically, the different quality levels are achieved by encoding the source media content at different bit rates according to encoding profiles. During playback, and as network conditions fluctuate, a consuming application selects a slice at one of the different quality levels that is best suited for the present network throughput, and the consuming applications adjusts the quality up or down as available bandwidth increases or decreases by selecting subsequent slices at the appropriate quality levels.
Streaming media content over the Internet has some challenges, as compared to regular broadcasts over the air, satellite, or cable. Although the adaptive streaming approach provides many advantages, one major disadvantage is that each temporal slice must be encoded multiple times, often a dozen or more, depending on the desired number of quality levels and playback devices or platforms. Also, the computational resources required to encode into the multiple formats is often quite large, as is the necessary bandwidth required to move the encoded slices to their location on a web server from which they are served during playback.

Decoupled slicing and encoding of media content


The present invention relates to a method of removing a metal from a stream of hot gas, wherein a particulate material comprising calcium and aluminum-silicate is contacted in the hot gas to absorb metal present in the hot gas. According to the invention, a meta-kaolin-containing substance is introduced in the hot gas, said meta-kaolin-containing substance being formed by thermally converting a material chosen from the group of I) waste paper, and ii) residue from the paper industry. The invention may be used to remove metals before, during or after the combustion or gasification of fossil fuels, biomass and organic waste.

The present invention relates to a method of removing a metal, in particular a heavy metal, from a stream of hot gas, wherein a particulate material comprising calcium and aluminum-silicate is contacted with the hot gas containing metal in the gaseous phase, which particulate material adsorbs the metal.
Such a method is known in the art, for example for the cleansing of flue gas released during the combustion of coal. A mixture of calcium hydroxide particles and kaolin (an aluminum silicate) particles is introduced in the hot flue gas to adsorb a metal present, such as lead or nickel. The mixture is a physical mixture. Special care is taken to use particles as small as possible. High-grade kaolin, characterized by its small particle size, is used to obtain optimum performance. Kaolin is the compound actually adsorbing the metal. The function of calcium hydroxide is to scavenge negatively charged ions such as sulfate and chloride, which have an adverse effect on the performance of the kaolin.
This method has several disadvantages. Firstly, the starting materials, and in particular kaolin, are expensive. Furthermore, virgin kaolin is a finite natural resource. Secondly, extremely fine grinding and/or the use of precipitation techniques adds to the cost.
The object of the present invention is to alleviate the above mentioned disadvantages.

Method of removing a metal from a stream of hot gas


A foamed glass article for preparing surfaces, the use therefor, and a method of making same are provided. The foamed glass article is in the form of a block, disk or similar product, and is used for preparing surfaces such as by sanding, rubbing and scraping the same to clean, abrade, polish, smooth, or the like such a surface. The foamed glass article is formed from a starting mixture that comprised glass, 0.10-20% by weight of at least one non-carbon/sulfate based foaming agent, and optionally an additional abrasive material. A mixture of powdered glass and non-carbon/sulfate based foaming agent can be placed in a mold and heated so that the mixture sinters and subsequently foams. Thereafter, the foamed mixture is annealed.

The present invention relates to a foamed glass article, such as a block, disk or similar product, for preparing or treating hard surfaces, and also relates to the use of and a method of making such a product.
Surfaces of many different articles and materials have to be prepared either to make them immediately ready for use or to prepare them for subsequent treatment. Such surface preparation includes sanding, rubbing and scraping a surface to clean, abrade, polish, etc. such a surface. For example, painted surfaces, such as metal, wood, plastic, fiberglass, and the like frequently have to be repainted. Prior to being repainted, these surfaces have to be sanded or otherwise cleaned and smoothed so that a new coat of paint or other treatment can be applied to such a surface. Similarly, rough surfaces of various materials frequently need to be sanded or otherwise smoothed so that they can be painted and treated. Grills, griddles, barbecues, and the like frequently need to be degreased, cleaned and/or polished. Rust, stains and grease frequently have to be removed from pots and pans, glazed porcelain, ceramic or glass tiles, baked-on enameled metal fixtures, concrete, glass shower doors and the like.
Various products are known for preparing the aforementioned wide variety of surfaces. Such products, which are generally limited to specific applications, include sandpaper, pumice, chemicals, steel, woven and non-woven plastic pads, wire brushes, knurled metal files, and the like. None of the known products provide a universal product for all of the aforementioned surfaces, and all have their inherent drawbacks. For example, sandpaper tears easily and wears out fast. In addition, sandpaper produces fine air-borne dust and the abrasive surface of the sandpaper quickly becomes clogged, especially when sanding paint from a surface. In addition, sandpaper does not work well on metal, and can gouge or scratch an underlying surface. Furthermore, grit or granular material embedded in the sandpaper dulls, thus quickly reducing the effectiveness of the sandpaper. In addition, in order to obtain a smooth surface, sandpaper of increasingly finer grit must be used throughout the process. Finally, sandpaper will not conform to irregular, i.e. non-planar, surfaces, especially when the sandpaper is mounted on a flat block or a sanding machine. The use of pumice is environmentally unfriendly in that pumice must be strip mined and is a non-renewable resource. Furthermore, the quality of pumice is inconsistent and cannot be regulated, so that a uniform product cannot be guaranteed. In addition, pumice blocks are not suitable for sanding applications. Chemicals are inconvenient to use, are often toxic, and are ineffective on some deeply stained surfaces. In addition, the use of chemicals frequently requires further products and subsequent further treatment of a surface in order to prepare it. Also, some chemicals will not work underwater. Rigid metal files and the like, in addition to becoming clogged, will not conform to an irregular angled or rounded surface.
It is therefore an object of the present invention to provide an economical yet effective universal mechanical surface preparation product that is easy to produce and will overcome the aforementioned drawbacks.
In particular, it is a further object of the present invention to provide a superior surface preparation product, such as for sanding, smoothing, cleaning and polishing a surface, that comprises foamed glass. This glass can be of virgin glass, or can be made from a mixture, the main constituent of which is recycled waste glass, thus providing a very economical product that at the same time is a very environmentally friendly use for waste glass.

Foamed glass article for preparing surfaces, use therefor, and method of making same


A microorganism having a capability of introducing a 7.beta.-hydroxyl group into a 7-unsubstituted bile acid, and a process for preparing a bile acid having a 7.beta.-hydroxyl group characterized by bringing the above microorganism into contact with a 7-unsubstituted bile acid to convert the acid to a bile acid having a 7.beta.-hydroxyl group. The process permits ursodeoxycholic acid useful as a cholagogue and intermediates therefor to be efficiently prepared.

For introducing a 7.beta.-hydroxyl group into a 7-unsubstituted bile acid utilizing the conversion by a microorganism, the following methods have been known:
1) A process for preparing 3.alpha., 7.beta., 12.alpha.-trihydroxy-5.beta.-cholanic acid (hereinafter, referred to as ursocholic acid) from 3.alpha., 12.alpha.-dihydroxy-5.beta.-cholanic acid (hereinafter, referred to as deoxycholic acid) using one or more microorganisms belonging to the genus Pleurotus, the genus Coriolus, the genus Daedaleopsis, the genus Panaeolus, the genus Marasmius, the genus Crinipellis, the genus Pholiota or the genus Fusarium. (Japanese Patent Publication No. 34038 of 1989)
2) A process for preparing ursodeoxycholic acid from 3.alpha.-hydroxy-5.beta.-cholanic acid (hereinafter, referred to as lithocholic acid) using a microorganism belonging to the genus Fusarium. (Japanese Patent Publication No. 29397 of 1991)
3) A process for preparing a conjugated form of ursodeoxycholic acid from a conjugated form of lithocholic acid using a microorganism belonging to the genus Mortierella. (Japanese Patent Publication No. 29438 of 1993)
When a 7.beta.-hydroxyl group was introduced using these microorganisms, however, it was necessary to adjust the concentration of a substrate at a level as low as approximately 0.02-0.1% v/w. Therefore, a great technical problem arose that a colossal apparatus for production was required when production at an industrial scale was carried out.
On the other hand, microorganisms of the genus Penicillium have been known having a bile acid-converting capacity by introducing a 1.beta.-hydroxyl group and a 15.beta.-hydroxyl group (Journal of Lipid Research, Vol. 22, p. 1225 (1981) ); no microorganism of the genus Penicillium, however, has been known to have a bile acid-converting capacity by introducing a 7.beta.-hydroxyl group.

Bile acid converting microorganism and process for preparing bile acid


An apparatus for programmably converting the operating voltage of a CPU & chipset by means of the firmware programmably setting the operating voltage, instead of by means of adjusting jumpers, is disclosed. The apparatus includes an address decoder unit, a programmable data memory, a DC to DC converter and a feedback resistance switching circuit. In operation, the computer inputs an address signal and a data signal required for changing the operating voltage to the address decoder unit. After being decoded, the data is written into the programmable data memory. Then the programmable data memory outputs a selection signal to change the internal resistance of the feedback resistance switching circuit, thereby to convert the output voltage of the DC to DC converter.

1. Field of the Invention
The present invention relates to an apparatus for programmably converting an operating voltage of a CPU and chipset, and more particularly to an apparatus for programmably converting an operating voltage of a CPU and chipset by means of a firmware, instead of by a jumper.
2. Description of Related Art
Recently, with the increase of computer manufacturers and the differences of their manufacture techniques, the specifications of operating voltages of the central processing units (CPU) and the chipset have become various. For example, for a Pentium.RTM. (Pentium.RTM. is a registered trademark of Intel Corporation) CPU used in a personal computer, the operating voltages of the CPUs manufactured by INTEL, CYRIX and AMD are different. Even though the CPUs are produced by one manufacturer, they are distinct. For instance, the SSS numbered in a back of the Pentium.RTM. CPU indicates an operating voltage of 3.3 volts and the VMU indicates an operating voltage of 3.45 volts. While a CYRIX CPU has the operating voltages such as 3.3 volts and 3.52 volts according to its number. Also, a high frequency CPU requiring a voltage regulation module (VRM) has the operating voltages such as 2.5 volts and 2.7 volts. Consequently, to support above mentioned CPUs, the manufacturers have to provide a plurality sets of jumpers or built-in voltage converters within a computer for users to adjust the operating voltage of the CPU and the chipset.
FIG. 1 shows a schematic view of a conventional regulation circuit. The conventional regulation circuit comprises a DC to DC converter 10, a feedback resistor Rf and a fixed resistor R1. Said feedback resistor Rf and the fixed resistor R1 form a resistance multiplying circuit for enabling the output voltage Vout to input a reference voltage Vref, through the multiplying circuit, to the DC to DC converter 10, thereby to change the resistance of the feedback resistor Rf, the reference voltage Vref and thus the output voltage Vout of the DC to DC converter 10. To send out a group of various voltages from above mentioned structure, a set of jumpers cooperating with resistors of different resistances are used in the regulation circuit, which is the most popular method used nowadays. As shown in FIG. 2, which shows a schematic view of a conventional multistage regulation circuit according to above method, the regulation circuit uses three feedback resistors 21 each connected in series with a jumper set 22. By this arrangement, various feedback resistances are obtained and the operating voltage can be changed.
It is understood that this kind of apparatus and method has several disadvantages. One is that a series of steps such as disassembling the computer, comparing with the handbook and adjusting the jumper or switch are required when the operating voltage is desired to be adjusted. A second disadvantage is that using the jumper for selectively skip connecting may cause an error set. A third disadvantage is that the metal jumper may be aged and oxidized due to humidity and may cause a defective contact. Therefore, there is a need for above apparatus to be improved.
The present invention provides an improved apparatus for programmably converting the operating voltage of a CPU & chipset to mitigate and/or obviate the aforementioned problems.

Apparatus for programmably converting an operating voltage of a CPU and chipset


A segmented flow path assembly and spline seals therefore are provided. A method for cooling a spline seal is also provided. In one exemplary aspect, a spline seal is provided that may be positioned at least in part in a groove defined by a first flowpath segment and at least in part in a oppositely facing groove defined by an adjacent flowpath segment. The spline seal may span the gap between the adjacent flowpath segments and provide sealing therefore. The spline seal includes features that allow a cooling flow to bypass the spline seal to cool the hot side of the seal as well as to meter the flow by the seal.

A gas turbine engine generally includes, in serial flow order, a compressor section, a combustion section, a turbine section and an exhaust section. In operation, air enters an inlet of the compressor section where one or more axial compressors progressively compress the air until it reaches the combustion section. Fuel is mixed with the compressed air and burned within the combustion section to provide combustion gases. The combustion gases are routed from the combustion section through a hot gas path defined within the turbine section and then are exhausted from the turbine section via the exhaust section.
Gas turbine engines typically include various segmented flowpath assemblies, such as nozzle and shroud assemblies. The nozzle and shroud assemblies typically include a plurality of circumferentially spaced segments with gaps extending between adjacent segments. The gaps accommodate thermal growth and reduce thermal stress in the flowpath segments. Such flowpath segments are more commonly being formed of ceramic matrix composite (CMC) materials and other high temperature materials that have higher temperature capabilities, e.g., compared to flowpath segments formed of more traditional materials. By forming flowpath segments with high temperature materials, the flowpath gas temperature may be increased and thus the engine may be operated more efficiently.
Spline seals are commonly used in gas turbine engines and are typically positioned within opposing grooves machined into the end faces of adjacent flowpath segments. Spline seals are typically made of high temperature alloys and thus have more limited high temperature capabilities, e.g., compared to the CMC flowpath segments. Therefore, spline seals may require a dedicated cooling flow. Conventional flowpath segments may include small cooling features, such as e.g., castellations, slits, or the like, machined into the end faces of adjacent flowpath segments to allow a cooling airflow to bypass the spline seal and meter the flow. The cooling airflow cools the spline seal from its cold side, then bypasses the spline seal and cools the seal along the hot side of the seal and mixes with the hot gas thereby lowering the temperature of the gas in proximity of the seal. The cooling airflow prevents oxidation, creep induced deformation, burning through, or other heat induced damage to the seal. The cooling slots or grooves must be machined with tight tolerances into the end faces of flowpath segments so that the amount of cooling airflow that bypasses the spline seal is controlled. Machining cooling features into flowpath segments is challenging, time consuming, and adds cost to the product. Moreover, if errors are made, the scrap cost is significant as flowpath segments are relatively expensive components to manufacture.
Accordingly, a segmented flowpath assembly and spline seal that address one or more of the challenges noted above would be useful.

Spline seal with cooling features for turbine engines


Disclosed are a photo-sensitive compound and a photoresist composition containing the same, for forming ultra-fine photoresist patterns. The photo-sensitive compound is resented by following Formula 1,

The photolithography is a process used to form a circuit pattern of a semiconductor chip or a display element from a semiconductor wafer or a glass for the display element. The photoresist composition is the most essential materials to the photolithography process. So, recently, as the patterns for semiconductor devices and the display elements are finer, the need for the photoresist composition having high resolution is more increased.
Conventional acid-amplified photoresist composition includes a polymer resin, a photo-acid generator (PAG) and a base additive. Since the conventional photoresist composition includes the polymer resin as a main component, it has excellent mechanical properties such as processiblity, coating stability, etching resistance and can be easily removed after the succeeding process including an etching process, an ion implantation process etc. It has been known that the size of the polymer resin determines the critical resolution of the photoresist composition. That is, when the size of the polymer resin of the photoresist composition is larger than the pattern to be formed, it is difficult to form a fine pattern in a desired resolution. Also, since the polymer resin is an aggregate of polymer chains having various structures and sizes, i.e. non-uniform mixture, it is more difficult to form a fine pattern using the polymer resin. Accordingly, it has been known that by using the conventional photoresist composition, manufacturing a fine-structured semiconductor device having a design rule of less than 65 nm is difficult. For overcoming the above mentioned problems, a study of new photoresist materials which can substitute for the polymer resin is demanded.

Photo-sensitive compound and photoresist composition including the same

Abstract: wherein x is an integer of 1 to 5, y is an integer of 2 to 6, R is a C2˜C20 hydrocarbon group. The photoresist composition comprises 1˜85 weight % of a photo-sensitive compound represented by following Formula 1, 1˜55 weight % of a compound which reacts with a hydroxyl group (—OH) of the compound represented by Formula 1 to combine with the photo-sensitive compound represented by Formula 1; 1˜15 weight % of a photo-acid generator; and 12˜97 weight % of an organic solvent.


A method of maintaining a file system of a computer in a known correct state begins by reserving a workspace in the file system itself. Upon a predetermined occurrence, file system organizing data structures are examined to determine and store in the workspace information reflecting a current state of the file system. The information preferably includes an inode table that identifies a status of each inode in the file system and a block map that maps all data blocks that are in use. The inode table is used verify the correctness of the root directory tree and that all in-use inodes are connected. Use of the inode table obviates recursive traversal of the inodes to verify the root directory and thus saves considerable processing time. Processor memory is not being used to support the current state information, eliminating the requirement for processor memory in proportion to file system size. After checking, the current stat is adjusted to the known correct state.

Computer systems typically include mass storage devices configured as a "file system." Mass storage devices include hard drives, optical disk drives, magnetic tape drives, solid state disk drives and bubble memories. Software routines for maintaining such a file system are known in the art as "check and repair" utilities. For example, in the UNIX Operating System, a utility called "fsck" is used to verify control information and the directories of the file system after an unscheduled event such as a power outage. The "fsck" command bypasses standard file access methods and compares directory and control information in an effort to identify any disk blocks or control structures (known as inodes) that are not accounted for within the file system. Errors in the state of the file system are then addressed in an attempt to return the system to a known correct state. A similar routine, called "chkdsk" is used in DOS-based systems.
When a check and repair operation is carried out, normal file system access cannot take place. As a result, prior art check and repair utilities are quite cumbersome on systems having a large amount of mounted disk storage and/or that are required in "mission critical" operating environments. The "fsck" utility uses a small amount of processor memory for a workspace, but it runs very slowly because it makes multiple passes, even on a correct file. It is thus much too slow for use with very large file systems or for time-sensitive computer environments that must be up and running 24 hours a day, seven days a week. The "chkdsk" utility runs more quickly, but it uses too much memory in proportion to file system size to be useful for such large systems or in mission critical environments.
Thus, file system check and repair techniques currently available in the marketplace always impose compromises in that they are either too slow or require too much memory. As a result, it has not been possible to scale these routines and provide efficient check and repair functionality over a wide range of processor, memory and file system operating requirements, or to provide adequate "mission critical" response rates.
There is therefore a long felt need in the marketplace for a file system check and repair utility that solves these and other problems of the prior art.

Computer file system check and repair utility

International Business Machines Corporation


Disclosed herein is a method for forming an isolation film of a semiconductor memory device. According to the disclosure, in a pre-treatment cleaning process performed before a tunnel oxide film is formed, a SC-1 cleaning process is performed at a temperature ranging from 60° C. to 70° C. Therefore, oxide films in a cell region and a peripheral region are recessed even in the SC-1 cleaning process as well as a DHF cleaning process. A DHF cleaning time can be thus reduced. Accordingly, the method can minimize loss of a silicon substrate by DHF and can thus control the depth of a moat.

1. Field of the Disclosure
The disclosure generally relates to a method for forming an isolation film of a semiconductor memory device. More specifically, the disclosure relates to a method of forming an isolation film of a semiconductor memory device in which, when a process of forming the isolation film of the semiconductor memory device using Shallow Trench Isolation (STI) is performed, a cleaning process time using a DHF solution, which is performed from a process of forming a trenches to the process of forming the isolation film, can be shortened to minimize the depth of a moat formed in the isolation film.
2. Brief Description of Related Technology
Generally, in memory devices such as a flash memory device, Shallow Trench Isolation (STI) is employed as an isolation film formation process. The STI has solved a problem that is generated in an existing LOCOS (LOCal Oxidation of Silicon) mode, e.g., a bird's beak phenomenon. Such a STI method includes forming a trench, depositing a High Density Plasma (HDP) oxide film so that the trenches is gap-filled, and then polishing the oxide film using a Chemical Mechanical Polishing (CMP) process to form an isolation film.
In the isolation film formation process using STI, however, a moat (or micro trench) in which an edge portion of the isolation film is sunken is generated. This moat is generated at the interface between the sidewall of the trenches and the HDP oxide film due to a cleaning process, which is repeatedly performed several times upon isolation film formation process using STI. It has been generally known that this moat is generated because the HDP oxide film is not sufficiently filled in that portion in terms of its structure and is thus relatively weak against a cleaning solution that is used during the cleaning process. This moat results in degraded operating characteristics of the semiconductor memory device. Particularly, in a NAND-type flash memory device, the moat has a great influence upon the threshold voltage of a cell, the leakage current, critical dimension of an active region and so on, which are electrical properties. It has recently becomes an important issue to control the depth of the moat.
Generally, in the case of a method for forming an isolation film of a Dynamic Random Access Memory (DRAM) device or a NAND flash memory device using STI, a cleaning process is performed approximately 10 to 15 times until the isolation film is formed after a trenches formation process. Usually, the cleaning process is performed using Diluted HF (DHF) and SC-1 NH4OH/H2O2/H2O) solution. In the case of the NAND-type flash memory device, a moat of about 150′ in depth is formed by this repetitive cleaning process. Among this repetitive cleaning process, the cleaning process for stripping a pad oxide film of a cell region after the HDP oxide film is deposited is carried out in order to recess a gate oxide film of a high voltage region and a low voltage region being a peripheral region at a given thickness as well as the stripping of the pad oxide film. In this case, in order to recess the gate oxide film at a given thickness, a time taken to perform the cleaning process is increased that much and the depth of the moat becomes deep accordingly. This degrades device characteristics.

Method for forming isolation layer in semiconductor memory device


A method for operating an X-ray analysis device is characterized by the following steps: a) recording a first data set in a first relative spatial position of a source, an object and a detector; b) displacement and/or rotation of the detector in the detector plane relative to the source and the object, whereby the relative position of source and object is not changed; c) recording a second data set In the position displaced according to step b); and d) superposition of the recorded data sets to form an overall data set, wherein the pixels of the recorded data sets are combined corresponding to their actual relative position with respect to the source and object.

The invention concerns a method for operating an X-ray analysis device with an X-ray radiation source, an object under investigation which is irradiated with X-ray radiation, and a planar two-dimensional array detector with pixel elements for locally resolved detection of the X-ray radiation emitted by the object, wherein a data set is obtained, in particular, in the form of a digitized diffractogram and/or spectrum. The invention also concerns an X-ray analysis device for carrying out the method.
Two-dimensional array detectors, which are used in X-ray analysis devices of the above-mentioned type, are known i.a. from Gerhard Lutz "Semi-conductor radiation detectors", B. Mikulec et al. "Development of Segmented Semiconductor Arrays for Quantum Imaging" Elsevier Science, N. Wermes "Pixel detectors for particle physics and imaging applications" Elsevier Science Direct and Edwin M. Westbrook National Institute of Health Förderantrag www.brunel.ac.uk/research/rose/3D/publications.html. These array detectors consist of a plurality of photo-sensitive pixel elements which are arranged in the form of an array on a chip. The sensor chip is usually in bump bonding contact with an ASIC (Application Specific Circuit), which comprises electronic channels, amplifiers and discriminators. Since the photo-sensitive pixel elements are integrally connected to the ASIC, exchange of a faulty pixel element is not possible. Faulty, in particular, blind pixel elements represent a substantial technical problem. Attempts have been made to reduce the number of blind pixel elements through manufacturing improvements. Due to the large complexity of the hybrid production (sensor, bump bonds, highly integrated ASIC), only very expensive pixel detectors with 100% functionality will be available in the near future. One usually accepts the existence of individual blind pixel elements and the resulting missing information in the corresponding regions.
To avoid the resulting disturbing effect of e.g. black image regions (dead pixels), several pixels are conventionally combined into one super pixel. This method, however, reduces the resolution of the associated measurements. If effects on the size of one pixel element are to be observed, individual blind pixel elements can seriously falsify the data, since precisely those dead pixel regions could contain important information.
In addition to two-dimensional array detectors, one-dimensional detectors are also disclosed (H. Göbel, Adv. in X-Ray Analysis 22 (1978) 255–265) which can be displaced using a goniometer through changing the 2Θ value over the region which is of interest for the measurement and permit detection of differing measuring regions by different pixels. However, these methods only permit one-dimensional recordings. Moreover, the optics for focussing the radiation onto the detector must be displaced along with the detector, which disadvantageously requires the structure of the arrangement to be particularly stable.
It is therefore the underlying purpose of the present invention to propose a method for operating an X-ray analysis device having a two-dimensional array detector with pixel elements which reduces the number of or eliminates dead pixels in the data set despite the presence of blind pixel elements in the detector to thereby obtain as complete a data set as possible as well as an X-ray analysis device for carrying out this method.

Method for operating an x-ray analysis apparatus with two-dimensional array detector and x-ray analysis apparatus for carrying out the method


The present invention relates to the combination of PM01183 with several anticancer drugs, in particular other anticancer drugs selected from antitumor platinum coordination complexes, antimetabolites, mitotic inhibitors, anticancer antibiotics, topoisomerase I and/or II inhibitors, proteasome inhibitors, histone deacetylase inhibitors, nitrogen mustard alkylating agents, nitrosourea alkylating agents, nonclassical alkylating agents, estrogen antagonists, androgen antagonists, mTOR inhibitors, tyrosine kinase inhibitors, and other agents selected from aplidine, ET-743, PM02734 and PM00104, and the use of these combinations in the treatment of cancer.

Cancer develops when cells in a part of the body begin to grow out of control. Although there are many kinds of cancer, they all arise from out-of-control growth of abnormal cells. Cancer cells can invade nearby tissues and can spread through the bloodstream and lymphatic system to other parts of the body. There are several main types of cancer. Carcinoma is a malignant neoplasm, which is an uncontrolled and progressive abnormal growth, arising from epithelial cells. Epithelial cells cover internal and external surfaces of the body, including organs, lining of vessels, and other small cavities. Sarcoma is cancer arising from cells in bone, cartilage, fat, muscle, blood vessels, or other connective or supportive tissue. Leukemia is cancer that arises in blood-forming tissue such as the bone marrow, and causes large numbers of abnormal blood cells to be produced and enter the bloodstream. Lymphoma and multiple myeloma are cancers that arise from cells of the immune system.
In addition, cancer is invasive and tends to infiltrate the surrounding tissues and give rise to metastases. It can spread directly into surrounding tissues and also may be spread through the lymphatic and circulatory systems to other parts of the body.
Many treatments are available for cancer, including surgery and radiation for localised disease, and chemotherapy. However, the efficacy of available treatments for many cancer types is limited, and new, improved forms of treatment showing clinical benefits are needed. This is especially true for those patients presenting with advanced and/or metastatic disease and for patients relapsing with progressive disease after having been previously treated with established therapies which become ineffective or intolerable due to acquisition of resistance or to limitations in administration of the therapies due to associated toxicities.
Since the 1950s, significant advances have been made in the chemotherapeutic management of cancer. Unfortunately, more than 50% of all cancer patients either do not respond to initial therapy or experience relapse after an initial response to treatment and ultimately die from progressive metastatic disease. Thus, the ongoing commitment to the design and discovery of new anticancer agents is critically important.
Chemotherapy, in its classic form, has been focused primarily on killing rapidly proliferating cancer cells by targeting general cellular metabolic processes, including DNA, RNA, and protein biosynthesis. Chemotherapy drugs are divided into several groups based on how they affect specific chemical substances within cancer cells, which cellular activities or processes the drug interferes with, and which specific phases of the cell cycle the drug affects. The most commonly used types of chemotherapy drugs include: DNA-alkylating drugs (such as cyclophosphamide, ifosfamide, cisplatin, carboplatin, dacarbazine), antimetabolites (5-fluorouracil, capecitabine, 6-mercaptopurine, methotrexate, gemcitabine, cytarabine, fludarabine), mitotic inhibitors (such as paclitaxel, docetaxel, vinblastine, vincristine), anticancer antibiotics (such as daunorubicin, doxorubicin, epirubicin, idarubicin, mitoxantrone), topoisomerase I and/or II inhibitors (such as topotecan, irinotecan, etoposide, teniposide), and hormone therapy (such as tamoxifen, flutamide).
The ideal antitumor drug would kill cancer cells selectively, with a wide index relative to its toxicity towards non-cancer cells and it would also retain its efficacy against cancer cells, even after prolonged exposure to the drug. Unfortunately, none of the current chemotherapies with these agents posses an ideal profile. Most posses very narrow therapeutic indexes and, in addition, cancerous cells exposed to slightly sublethal concentrations of a chemotherapeutic agent may develop resistance to such an agent, and quite often cross-resistance to several other antitumor agents.
PM01183, also known as tryptamicidin, is a synthetic alkaloid which is currently in clinical trials for the treatment of cancer, and has the following chemical structure:

PM01183 has demonstrated a highly potent in vitro activity against solid and non-solid tumour cell lines as well as a significant in vivo activity in several xenografted human tumor cell lines in mice, such as those for breast, kidney and ovarian cancer.
PM01183 exerts its anticancer effects through the covalent modification of guanines in the DNA minor groove that eventually give rise to DNA double-strand break, S-phase arrest and apoptosis in cancer cells. Further information regarding this compound can be found in WO 03/01427; 100th AACR Annual Meeting, Apr. 18-22, 2009, Denver, Colo., Abstract Nr. 2679 and Abstract Nr. 4525; and Leal J F M et al. Br. J. Pharmacol. 2010, 161, 1099-1110.
Since cancer is a leading cause of death in animals and humans, several efforts have been and are still being undertaken in order to obtain a therapy active and safe to be administered to patients suffering from a cancer. The problem to be solved by the present invention is to provide anticancer therapies that are useful in the treatment of cancer.

Combination therapy with an antitumor alkaloid