A fuel reformer for reforming hydrocarbon base fuel into hydrogen rich gas, with one embodiment comprised of material containing at least 15 to 25% by mass Cr, 8 to 35% by mass Ni, 2 to 4% by mass Si and the remainder Fe and inevitable impurities (C, Mn, P, S or others). The material provides sigma brittleness resistance and cementation resistance, and provides a reformer that is lightweight, low-cost, highly reliable and durable. A second embodiment adds to the composition 0.05 to 1% by mass Nb, providing improved oxidation resistance, cementation resistance, intergranular corrosion resistance, with further improved reliability and durability.

In the case of reforming a hydrocarbon base fuel, for example methane, into a hydrogen rich gas (endothermic reaction) through water vapor reforming, the operating temperature of the reformer is approximately 700° C. (outlet temperature of reforming catalyst layer); however, the surface temperature of the material composing the reformed is supposed to be equal or superior to about 1000° C. in the vicinity of the heating portion of the reformer. In addition, a hydrocarbon base fuel mixed with steam is introduced in the fuel reformer, and reformed into a gas containing hydrogen about 75%, carbon monoxide on the order of about 10 and several % and carbon dioxide on the order of about 10 and several %. Consequently, as for materials composing the fuel reformer, a material that can resist to such a high temperature and an environment containing steam, hydrogen, carbon monoxide, carbon dioxide, or others is required.
In the case of steel material containing Cr, generally, a steel material to be used under a high temperature is required to resist to the oxidation. In general, a dense oxide of Cr is formed on the surface, acts as protection film, and protects the base material. Moreover, the addition of Ni together with Cr increases the heat resistance and stabilizes also the structure. For instance, the stainless base material is an alloyed steel containing Cr and Ni for the purpose of improving the corrosion resistance, and is a steel containing Cr by about 11 mass % or more.
The stainless base material used for heat resistance has been improved by JIS on the basis of SUS302 of SUS 300s, and ordinarily, Cr concentration of stainless base material used for heat resistance is 15 mass % or more, and contained on the order of 25 mass % in SUS310S. The oxidation resistance is improved with the increase of Cr concentration; however, an abnormal setting occurs around 700 to 800° C. (950 to 1100 K), provoking degradation at the same time [a degradation phenomenon occurring together with the deposition of intermetallic compound σphase comprising mainly FeCr at 830° C. (1100K) or less is called sigma brittleness and tends to occur easily with the increase of Cr quantity].
On the other hand, in a high temperature atmosphere containing hydrocarbon base gas, carbon monoxide or carbon dioxide, C contained in the atmosphere penetrates into the steel (into the base metal), provoking cementation. As the cementation progresses, carbon binds with Cr in the steel, forms Cr carbide at the grain boundary, Cr concentration in the base material lowers, making difficult to form a dense Cr oxide on the surface and reducing the oxidation resistance and, at the same time, intergranular corrosive cracking might be provoked by the Cr carbide deposited on the grain boundary.
Therefore, in order to make the sigma brittleness resistance and the cementation resistance compatible, it is necessary to maintain the oxidation resistance all the way controlling the Cr concentration and, to limit the cementation. As mentioned above, inside the reformer, the compatibility of sigma brittleness resistance and cementation resistance is required.
The fuel reformer is used, for instance, to supply a fuel cell with hydrogen rich gas.
The fuel cell system of the related art has a scale of several tens KW or more, increasing the size of reformer for the reactor is used a thick material in order to make the sigma brittleness resistance and the cementation resistance compatible, provoking problems of heavy weight and high material cost.
Even a small reformer, conventionally, has been using a heat resistant alloy (SUS310S or the like) or super alloy (Incoloy800 or the like) of Cr:20 mass % or more and Ni:18 mass % or more; however, heat resistant alloy, especially super alloy such as Incoloy800 or the like of Cr:20 mass % or more and Ni:18 mass % or more is extremely expensive. Moreover, even in a reformer using a reaction tube material of super alloy, cementation phenomenon was observed in the vicinity of the catalyst layer after the reforming test (after 100 cycles, 800 hours), confirming its insufficiency.
On the other hand, a fuel reformer material containing C 0.1 wt % or less, Cr 17 to 23 wt %, Ni 8 to 29 wt %, Nb 0.1 to 0.4 wt %, containing one or two elements chosen from Ti, Zr by 0.05 to 0.3 wt %, and further containing N 0.02 to 0.05 wt %, B 0.003 to 0.01 wt % and composed of remaining Fe and inevitable impurities (Japan Patent Publication Laid-Open HEI 5-339679) is proposed.
Though this reformer material is excellent in creep rupture strength and oxidation resistance and generates quite scarcely a harmful σ phase, but does not consider the cementation, decreases Cr content in the base material as the cementation progresses as mentioned above, making difficult to form a dense Cr oxide on the surface and increasing the possibility of causing intergranular corrosion.
The object of the present invention is to provide a light, low cost and cheap, highly reliable and long life fuel reformer, that resolves conventional problems, and provides the sigma brittleness resistance and the cementation resistance, without increasing the wall thickness of the reformer in order to make the sigma brittleness resistance and the cementation resistance compatible.


A platform-based imaging system includes a nanotechnology-modified lens assembly mounted on the platform. A nanotechnology-modified information processing module is provided to receive information from the lens assembly. A nanotechnology-modified connection mechanism operatively and remotely connects the lens assembly with the information processing module.

The advantages of platform-based imaging has been long-recognized. Long-range imaging has been known from the time that human observers first went aloft in balloons to make sketches of armies below. Long-range imaging has evolved to include aerial surveillance via powered flight through satellite imaging. Close-range platform-based imaging began with the first magnifying optics, and now employs electron microscopes to detect characteristics of submolecular objects. The need to discriminate and map characteristics of a variety of surfaces led to the development of multispectral instruments to gather and classify information. However, multispectral instruments only record a few bands of the electromagnetic spectrum. Thus, they have little ability to identify a wide variety of surface attributes.
These deficiencies gave rise to techniques involving subdividing the ultraviolet, visible and infrared spectra into distinct "bins", known as Multispectral Imaging (MSI). In MSI, multiple images of a scene or object are created using light from different parts of the spectrum. If the proper wavelengths are selected, multispectral images can be used to detect an item of interest, such as mineral deposits, camouflage, thermal emissions, and hazardous wastes.
A primary goal of using multispectral remote sensing image data is to discriminate, classify, identify, and quantify materials present in the image. Another important application is subpixel surface characteristic detection, allowing identification of surface attributes having sizes smaller than the pixel resolution. Also important is abundance estimation, which allows detection of concentrations of different signature spectra present in pixels. One difficulty in remote sensing image analysis is that a scene pixel can be mixed linearly or nonlinearly by different materials resident in the pixel, where direct application of commonly used image analysis techniques generally do not work well.
Hyperspectral imaging (HSI) is a method in which remotely sensed data is typically collected using an opto-electrical system that measures reflected solar irradiance. Hyperspectral sensors currently collect data in hundreds of narrow, contiguous wavelengths, so that for each pixel in an image, a reflectance spectrum can be derived that is dependent upon the composition and structure of materials present. Many substances have a unique spectral signature that can be used for identification. In the alternative, the reflective properties of characteristics known to be present can be identified, then "learned" by processing software so as to be readily identified. Moreover, the hundreds of channels allow the detection or identification of more than one material in a pixel. This capability is unique to hyperspectral remote sensing.
The difference between multispectral and hyperspectral is the far greater spectral resolution of the latter achieved by splitting the reflected solar irradiance into many more channels. HSI, like MSI, is a passive technique, in that it depends upon the sun or some other independent illumination source. However, in contract to MSI, HSI creates a larger number of images from contiguous, rather than disjoint, regions of the spectrum, typically, with much finer resolution. This increased sampling of the spectrum provides a great increase in information. Many remote sensing tasks which are impractical or impossible with an MSI system can be accomplished with HSI. The wealth of information available from HSI makes it useful in a variety of applications, such as mineral exploration, hazardous waste remediation, habitat mapping, invasive vegetation detection, and ecosystem monitoring, to name but a few.
One example of an airborne hyperspectral imaging system is the ESSI Probe-1 hyperspectral instrument from Earth Search Science, Inc. The Probe-1 hyperspectral remote sensing airborne system records high resolution spectral reflectance from the earth's surface. Probe-1 is a scanning instrument which records 512 cross-track pixels, each covering 128 wavelengths of light in the 400–2,500 nanometer range. Pixel size is typically between 5 and ten meters on a side as determined by the aircraft's altitude above the surface. Higher resolution is possible if the sensor is mounted on a helicopter rather than a fixed-wing aircraft.
Probe-1 images are built up by collecting successive scan lines as the aircraft moves forward. The size of the imagery in the along-track dimension is determined by the length of the flight line. For example, a 20 kilometer line with 5 meter pixels would be 4,000 by 512 pixels, for a total of 2 million pixels covering over 50 square kilometers. A reflectance spectrum covering 128 wavelengths from visible light through the near infrared and short-wavelength infrared can be derived for each pixel. The field of view of the Probe-1 (60 degrees) allows Earth Search to collect date over large areas quickly.
While the advantages of hyperspectral imaging are many, the mechanisms by which such imaging has been accomplished have presented several problems. For example, optics used in known sensors are typically relatively bulky and unwieldy. In long-range hyperspectral sensors, the gimbaled mounting systems require special structure for mounting and operation. The Probe-1 instrument, while effective, occupies a relatively large amount of cabin space. Known optics require a combination of low altitude, slow airspeed, and degree of stability difficult to obtain using standard aircraft. Similarly, close-range platform-based systems are often difficult to operate in desired applications, such as those requiring close proximity to a living human subject.
Nanotechnology, also known as molecular nanotechnolgy, allows for control of the material world at the nanoscale by taking advantage of quantum-level properties. Nanotechnology provides the means by which systems and materials can be built with exacting specifications and characteristics. The composition and structural modification of existing materials on the nanometer scale can drastically enhance some properties and lead to unprecedented physical effects. In the case of simple materials, structural modification on the nanometer scale may yield an entirely new class materials, whose chemical and physical properties are significantly different from those of the bulk material. This is the bottom-up approach to the manipulation of materials on the nanometer scale and then their assembly into larger scale structures.
Micro-Electro-Mechanical Systems (MEMS) technology is a related and interwoven field of nanotechnology. MEMS technology enables the integration of mechanical, electrical, chemical, thermal, fluidic, magnetic, and optical components on a microscopic scale. MEMS contain elements which allow for the interconversion of energy between these different domains using fabrication techniques leveraged off microelectronics. MEMS devices operate on a sub-conventional scale: minimum feature sizes for micromachining processes often measure under a tenth of a micron. Forces generated by microactuators range from piconewtons to millinewtons, and the displacement of microstructures can be measured to less than a picometer. The incorporation of nanotechnology-modified components and MEMS into a hyperspectral imaging sensor like the Probe-1 can solve the present issues in the field.
In light of the foregoing, there is a need for a MEMS or nanotechnology-modified simple, platform-based remote sensing system capable of overcoming or deducing the drawbacks of known systems, which to be utilized for the imaging and mapping of surface characteristics. The present invention provides such a device.


A method for detecting and tracking turns of a maneuvering target comprises the steps of determining first and second radar information of the maneuvering target. The first and second radar information and a set of target speeds are used to determine a set of turn radii for the maneuvering target. The first and second radar information and a set of target arc speeds are used to determine a second set of turn radii for the maneuvering target. The set of turn radii and the set of target speeds define a speed-radius curve, and the second set of turn radii and the set of target arc speeds define an arc speed-radius curve. An intersection of the speed-radius and arc speed-radius curves is located, and the intersection is used to determine whether the maneuvering target has made a turn.

Many existing radar systems have the ability to track targets. A common method for tracking targets involves using a tracking filter to provide estimates of a target's future behavior. As new radar information is received, it is associated with a particular target's track based on the degree to which the information matches an estimate from the filter. Each position estimate from the filter has an associated area of interest, or gate, around it. The size of the gate is determined by the error tolerance of the radar measurements. Radar reports in a gate are associated with an existing target track based on the closeness of the report to the filter's estimate. A Kalman filter is often used as the tracking filter in existing systems. This method is adequate for tracking targets with straight line trajectories.
Data association tracking based upon model estimation has a high computational burden. Models operate under the assumption that the past behavior of a target is an indicator of future behavior. If a target is moving along a straight line, then makes an unanticipated turn, the model extrapolates an estimated position for the target further along the straight line. If the model is designed to recover from this type of turn, it must have a search window, or gate, large enough to include the target after the turn. In the next radar scan, since the target is not where the model expected it to be and there may be a possibility that the target was not detected, the model extrapolates another expected position along the straight line. With each successive radar scan, the error between the estimated position and the true position of the target grows, and the search window area required to recover the target grows as the square of the model error. Many more radar returns must be evaluated to determine if they fit any trajectory model. The number of track possibilities grows exponentially as the number of scans increases. This imposes a high computational burden on the radar tracking system. There is a need for a method for detecting and tracking maneuvering targets that has a much more modest computational burden.
In present tracking methods, maneuvering targets may never initiate tracks, while others may initiate tracks without sufficient characterization for track following. Targets having shallow weave trajectories may be initialized as straight line trajectories with poor tracking qualities. Targets having deep weave trajectories may be initialized as arcs, also with poor tracking qualities. Targets with intermediate weave trajectories may never initiate tracks in these methods. If a weave trajectory is initialized as a line or arc with large filter errors, it may be passed on to another method that can extract maneuver parameters such as period, amplitude, phase, or heading. These parameters may be used to characterize a weave model so that predictions and subsequent data association may be made for track following. Each of these maneuver parameters adds an additional computational burden to the model. There is a need for a method for tracking maneuvering targets that locates targets having intermediate weave trajectories and does not require complete model characterization.
One method for detecting maneuvering targets, as disclosed in U.S. Pat. No. 5,124,433 to Alouani et al., detects a target's maneuver by measuring the magnitude of residuals, or deviations from expected values, for a constant velocity filter. In this method, a certain amount of filter error is taken as an indication that the target has made a maneuver. Producing the residuals is very costly in terms of computational time. This method may detect maneuvers, but it has a high computational burden.
When tracking a maneuvering target, degradation of the performance of a Kalman filter can be severe, especially in acceleration estimates. A solution to this problem has been proposed by Ruzicka in U.S. Pat. No. 5,313,212. Ruzicka provides a post processor to correct the outputs of a Kalman filter for bias errors. This bias correction does improve the estimates of the filter, but the correction involves complicated calculations in line of sight (LOS) coordinates. This method improves the performance of Kalman filter based trackers, but it does nothing to ease the computational burden of detecting and tracking maneuvering targets. There is a need for a method for tracking maneuvering targets that does not depend on Kalman filters.
In U.S. Pat. No. 5,631,653, Reedy discloses a system and method for detecting maneuvers, which gathers observed data in aircraft-relative coordinates, and then transforms the data into observation-relative inertial coordinates before comparing the data to estimates based on the target's past behavior. This method involves vector calculations in at least two different coordinate systems, and predicts a target's future behavior based on its past behavior. There is a need for a method for tracking maneuvering targets that does not predict a target's behavior based on its past behavior.
It is an object of the present invention to provide a maneuver detection method that is computationally simpler than existing maneuver detectors, and does not depend on the use of a conventional tracking filter.
It is a further object of the present invention to provide a maneuver detection method that does not use target information that is defined by a particular coordinate system.
It is a further object of the present invention to provide a search capability to find targets with known speeds that may have unexpectedly turned.
It is a further object of the present invention to provide a method for detecting and tracking maneuvering targets that does not require complete model characterization.

Method for tracking and detecting turns of maneuvering targets


An automated material handling system that includes an extractor/buffer apparatus capable of simultaneously accessing multiple Work-In-Process (WIP) parts, thereby providing a highly efficient interface between WIP storage locations and transport equipment. The extractor/buffer apparatus includes multiple extractor/buffer modules, each module being configured to interface with a location for holding WIP parts that is a number of WIP parts deep. Each module includes a platform for holding multiple WIP parts. Further, multiple modules may be disposed side-by-side to form an extractor/buffer apparatus capable of handling multiple rows of WIP parts.

The present application relates generally to automated material handling systems, and more specifically to an automated material handling system including an improved extractor/buffer apparatus that provides a highly efficient interface between storage locations and transport equipment for Work-In-Process (WIP) parts.
Automated material handling systems are known that employ WIP storage units and transport equipment to store WIP parts and to move them between workstations and/or processing machines in a product manufacturing environment. For example, such an automated material handling system may be employed in the fabrication of Integrated Circuit (IC) chips. A typical process of fabricating IC chips includes various processing steps such as deposition, cleaning, ion implantation, etching, and passivation steps. Each of these steps in the IC chip fabrication process may be performed by a different processing machine such as a chemical vapor deposition chamber, an ion implantation chamber, or an etcher. Further, the WIP parts, in this case, semiconductor wafers, are typically moved between the different workstations and/or processing machines multiple times to perform the various steps required for fabricating the IC chips.
A conventional automated material handling system used in an IC chip fabrication process comprises a plurality of WIP storage units for storing semiconductor wafers, and transport equipment including overhead hoists and conveyors for moving the wafers between the storage units, workstations, and processing machines on the IC chip manufacturing floor. The wafers are typically loaded into carriers such as Front Opening Unified Pods (FOUPs), each of which may be selectively accessed via an overhead hoist traveling on a suspended track. In a typical system configuration, the FOUPs are accessed by overhead hoists from locations underneath the track. Accordingly, each overhead hoist is typically moved along the suspended track to a position directly above a selected location, lowered toward the selected location, and operated to pick/place a FOUP from/to that location.
In the conventional automated material handling system, overhead hoists are employed to move FOUPs relatively short distances while conveyors are employed to move the FOUPs longer distances across the IC chip manufacturing floor. For example, a conveyor used in an IC chip manufacturing environment may comprise a conveyor belt, or a platform configured to travel along a rail. In the typical system configuration, overhead hoists may be employed to pick/place respective FOUPs from/to one or more conveyors. The overhead hoists may also be used to pick respective FOUPs from the conveyors and to place the FOUPs to input/output ports of a workstation or processing machine, and vice versa. The overhead hoists typically access the FOUPs from the conveyors positioned underneath the suspended track.
One drawback of the above-described conventional automated material handling system is that each overhead hoist employed therein typically picks/places only one FOUP at a time. This can significantly impede throughput in a system capable of handling hundreds of FOUPs. Further, each overhead hoist typically accesses just a single level of storage underneath the suspended track. This is also problematic because providing only one level of WIP storage on the product manufacturing floor can increase costs due to the inefficient use of floor space. To access multiple levels of storage underneath the track, storage units must typically be configured to move a selected FOUP from its current position within the storage unit to a position at the level accessible to the overhead hoist, thereby further impeding the system throughput. In addition, such storage units typically have many moving parts such as rollers, bearings, and motors that are subject to failure, which not only increases costs but also diminishes the reliability of the overall system.
Moreover, because the overhead hoists are typically configured to access FOUPs from locations underneath the suspended track, a minimum amount of space is required between the ceiling and floor of the IC chip manufacturing facility to accommodate the track and the overhead hoist. This further limits the amount of space in the manufacturing facility that might otherwise be used for storing semiconductor wafers. In addition, because only one level of storage is accessible to each overhead hoist, multiple overhead hoists must normally queue up at a storage unit to access FOUPs from that storage unit, thereby further lowering system throughput.
It would therefore be desirable to have an automated material handling system that provides enhanced material handling efficiency while overcoming the drawbacks of conventional automated material handling systems.


A modular and reversible manifold assembly for a pump calibration gauge. The assembly includes a tubular body having a first end and an opposed second end. A first inlet connection extends substantially perpendicular to the tubular body. A gauge connection on the first end of the tubular body is provided for connection to a pump calibration gauge. A pump connection on the second end of the tubular body is provided for connection to a metering pump. A second inlet connection extends substantially perpendicular to the tubular body opposed to the first inlet connection wherein either the first or second inlet connection is connected to a liquid storage tank or another modular and reversible manifold assembly.

1. Field of the Invention
The present invention relates to a modular and reversible manifold assembly for a pump setting gauge. In particular, the present invention is directed to a modular and reversible manifold assembly for liquid chemical injection from a liquid storage tank to a metering pump. The manifold assembly is a link between the chemical storage tank, the pump setting gauge and the metering pump.
2. Prior Art
It is sometimes desirable to inject liquid chemical additives from a liquid chemical storage tank or reservoir. The chemical injection may be desirable for various industrial and energy operations. Typically, the liquid chemical additive is moved from the storage tank to the desired application or process by a metering pump which injects the chemical additive in measured amounts over measured durations.
The chemical additives may be used in a variety of applications. Examples include injecting chemical additive to prevent buildup of scale or corrosion in pipelines. Chemical additives may also be injected to prevent ice or hydrates from forming in oil or gas wells during cold weather. Additionally, chemicals may be injected for hydrogen sulfide (H2S) reduction. Additionally, surfactants may be injected to de-liquefy subterranean gas wells. Chemicals may be required in other industrial processes or applications as well.
A pump setting or calibration gauge is often utilized in fluid communication between the liquid storage tank and the pump.
The pump calibration gauge can provide a visual indication of the level of liquid chemical in the storage tank. Additionally, the pump calibration gauge can initially and periodically calibrate or verify the rate of metering pump injection.
Accordingly, it would be desirable to provide a modular and reversible manifold assembly which permits orientation of the component parts in alternative positions for alternative placement of the calibration gauge and the metering pump.
It would also be desirable to provide a modular and reversible manifold assembly to permit multiple manifold assemblies to be connected together so that a single liquid chemical storage tank or reservoir can service multiple applications with multiple metering pump systems that utilize liquid chemical injection.

Modular and reversible manifold assembly for a pump settling gauge


A system for achieving a four-stroke cycle with a single rotation of a crankshaft in an internal combustion engine having a crank, a crank pin freely rotatable in a slide block of a runner 40. The runner 40 pivots on a pin rigidly attached to the bottom of an engine casing. The runner also pivots on the end of a link arm. The link arm pivots on a pin of a piston moving in a cylinder along a predefined stroke.

In internal combustion engines, particularly in four-stroke engines, the cycle is carried out in two rotations of the crankshaft. This uses the traditional link arm-crank system, which requires a full descent and return of the piston for a full turn to occur with a single rotation of the crankshaft. This situation leads to irregularities in the transferred torque and to stray inertial forces. These actions disrupt the balance of the engine.
A 0.5 reduction in ratio should be introduced in the transmission from the crankshaft rotation to the cam-shafts so as to assure proper distribution. This process, however, complicates engine kinematics, thus weakening the engine itself.
For a pre-determined number of cylinders, the power supplied is limited by the maximum inertial forces which can be supported by the pistons. Moreover, the effort to raise the power-to-weight ratio by increasing crankshaft rotation speed necessitates the addition of a substantial reduction mechanism, taking into account rotation speeds to be transferred to the wheels. This leads to rapid cylinder and piston wear.
Rapid engines require close and constant supervision of the number of crankshaft rotations. It must be taken into account that, as described above, during high speeds of operation, the link arm and pistons are quite close to the point of breaking down; high output is obtained at this cost.
A mechanism allowing a four-stroke engine to perform a cycle in a single rotation of the crankshaft is already known (French Patent Request No. 2,622,251). The aim of this mechanism is to increase the output of internal combustion engines and to simplify their construction. Its principal features are its orbital link arm, mounted on the oblique crankpin of a crankshaft, attached to the piston with an auxiliary link arm. Operation of this system requires replacing the classical rotation pin, joining the piston to the link arm with a swivel joint allowing orbital displacement of the auxiliary link arm. This complicates the structure, weakens the bond between the link arm and the piston and generates considerable cyclic end thrusting on the crankshaft. This can cause vibrations which are detrimental to the performance of the crankshaft bearings.
The object of this invention is to overcome these disadvantages. This invention, in its present form, resolves the problem of creating a new system for transforming linear piston displacement in an internal combustion engine to shaft rotation, thus allowing the association of two descents and returns of a piston with a single rotation of the shaft.

System for achieving four-stroke cycle in an internal combustion engine with a single rotation of the crankshaft


A system and method for issuing an alarm when the separation distance between a monitoring module associated with an object (animate or inanimate) and an alert module exceeds a preset threshold distance thereby forming a leadless electronic tether between the object and the object owner. A monitoring module comprises a portable transmitter provides a signal to an alert module comprising a receiver and a processor. The alert module is adapted to determine a separation distance between the monitoring module and the alert module based on an attribute of the signal. When the separation distance exceeds a predetermined threshold, the alert module issues an alert. Alternatively, when the monitoring module signal is not received by the alert module, an alert is issued.

This invention relates generally to monitoring animate and inanimate objects. More particularly the present invention is a form of electronic leash for animals, an electronic tag for people, and an electronic "tether" for portable objects carried by individuals.
Finding an object requires there be some perception that the object is missing. In the case of valuable objects, the delay in perception may be costly. How many times does a person notice many hours later, that a purse or other object has been left at a store or restaurant? By that time, the object may be out of range of the finding device, either because the owner has left the vicinity of the object or the object has been removed from the vicinity of the owner.
"Electronic tethers" have been proposed using a variety of technology. The most common system uses a monitoring module and an alert module. In this system, the monitoring module comprises a transmitter. The alert module receives a signal from the monitoring module and determines the distance between the alert module and the monitoring module. When a predetermined distance is exceeded, the alert module issues an alarm. Variations of this system add a transmitter in the monitoring module to allow the alert module to poll the monitoring module and to react when the monitoring module fails to respond.
In co-owned U.S. application Ser. No.: 10/911,018, an "electronic tether" is described that uses an RFID tag as the monitoring module. The alert module comprises an RFID polling system. The system issues an alert when an RFID tag fails to respond to a polling signal.
In co-owned U.S. application Ser. No.: 10/832,498, an "electronic tether" is described that uses an audio signal as a polling signal. The monitoring module and the alert module each have a clock that is synchronized to a common time. The distance between the alert module and the monitoring module is determined by the propagation time of an audio signal sent by the monitoring module to the alert module.
What would be truly useful would be a system that comprises an "electronic leash" or "electronic tether" which can be variably preset by an animal owner or object owner and operated so as to prevent the animal, person or object from becoming separated from its owner. Such a system would further be capable of identifying a specific animal, person, or object that is missing from a group of monitored animals or objects. Without meaning any disparagement, this application shall refer to people, animals and objects collectively as objects. Similarly, the term "owner" as used herein is synonymous with owner, parent, caregiver and the like.


A centraliser segment (11) comprising a first collar portion(15), a second collar portion (17) and bow element (19) extending between said first collar portion and said second collar portion to maintain the collar portions in spaced relation to each other, said bow portions having an intermediate portion which lies to one side of the plane accommodating the collar portions, a first connector element (21) provided at one end of the collar portions and second connector element (23) provided at the other end of the collar portions, said first connector elements are engagable with said second connector elements of the same or another centraliser segment such that one or more said centraliser segments are connectable together to form a centraliser which in use is capable of being received around a borehole casing, said first and second connector element having an adjustment element which can cause the diameter of the centraliser can be varied by operation of the adjustment element (41) wherein the adjustment is controllably and continuously variable over a range of diameters.

One application of the centraliser is to centralise a borehole casing. Such borehole casings may be used, for example, in water wells, oil wells and gas wells. A centraliser which has been previously proposed by the inventor is disclosed in AU200143778. In locating the centraliser in position it is necessary to adjust the diameter of the centraliser in order that it becomes snugly supported around the borehole casing.
The discussion throughout this specification, of the background and prior art to the invention is intended only to facilitate an understanding of the present invention. It should be appreciated that the discussion is not an acknowledgement or admission that any of the material referred to was part of the common general knowledge in Australia and the world as at the priority date of the application.


A circuit for a pulse width modulating a sensor (12) has been provided. The circuit includes a first switch (22) for alternately coupling the sensor between first and second supply voltage terminals. The circuit also includes second (24) and third (28) switches and first and second capacitors for sampling the differential voltage appearing at outputs of the sensor when the first switch is in a closed state.

Pressure sensors are well known in the art for measuring the difference between pressures applied simultaneously to opposite sides of a diaphragm of the sensor to produce a differential output voltage at respective outputs. Typically, a pressure sensor is coupled between first and second power supply terminals, and provides a differential output voltage that is relative to the pressure sensed by the pressure sensor. Such a pressure sensor is the MPX2000 family of pressure sensors manufactured by Motorola, Inc.
As the voltage applied across the pressure sensor increases (via the first and second power supply terminals), the sensitivity of the pressure sensor correspondingly increases, but so does the power dissipation. Further, this power dissipation may be unacceptable for pressure sensors that are utilized in battery applications.
Hence, there exists a need for an improved pressure sensor for sensing low pressures and having reduced power dissipation.


Microencapsulated pyrethroidal cockroach-controlling composition is provided, which has an excellent residual effect. The composition comprises phenylxylylethane and a pyrethroidal compound and is encapsulated in microcapsules formed of a polyurethane wall which have an average particle diameter of not more than 80 .mu.m, a wall thickness of not more than 0.3 .mu.m, and a value of the average particle diameter/wall thickness of 100-400.

The present invention relates to a microencapsulated cockroach-controlling composition wherein an insecticide having a 3-phenoxybenzyl group and phenylxylylethane are encapsulated in microcapsules having polyurethane wall which have an average particle diameter of not more than 80 .mu.m, a wall thickness of not more than 0.3 .mu.m and a value of the average particle diameter/wall thickness of 100-400.
Controlling cockroach has been mainly carried out by a residual spray method.
At present, formulations such as emulsifiable concentrate, solubilized emulsion concentrate and oil solution which contain, for example, an organophosphorus insecticide or pyrethroidal insecticide as an active ingredient are used for the residual spray.
Especially residual efficacy and safety are desired factors to formulations used for the residual spray. If the residual efficacy is to be enhanced with the conventional formulations such as emulsifiable concentrate, solubilized emulsion concentrate and oil solution a high application dosage is required, which may bring about problem in safety. Thus, formulations being safer and having greater in efficacy are increasingly demanded.
Under the circumstances, research and development of so-called microencapsulation technique that an active ingredient is enclosed in a wall material have become intensive. As microencapsulated insecticides, those which contain organophosphorus insecticide as an active ingredient are disclosed in Japanese Patent Kokai No. 62-161706 and those which contain pyrethroidal insecticide as an active ingredient are disclosed in Japanese Patent Kokoku No. 55-38325.
In some cases, microencapsulation of insecticides might be effective for improving residual efficacy.
However, residual efficacy of microencapsulated insecticides varies depending upon a particle diameter of microcapsule and a wall thickness. Optimum particle diameter and wall thickness should be chosen in order to maintain residual efficacy for a prolonged period of time. The optimum range naturally varies depending on varieties of insect pests to be controlled and of insecticides.
In general, microencapsulation of insecticides having a polyurethane wall is performed by interfacial polymerization using a polyfunctional isocyanate.
The interfacial polymerization method essentially requires a step of homogeneously mixing an active ingredient to be enclosed in capsules with polyfunctional isocyanate.
In the case when the active ingredient is a pyrethroidal insecticide, an organic solvent may be added as so-called cosolvent when the insecticide is mixed with a polyfunctional isocyanate which is sometimes high in viscosity, since this insecticide is generally high in viscosity and sometimes is in the form of crystal. Japanese Patent Kokoku No. 55-38325 mentions "For example, as usual organic solvents, there may be selected from hydrocarbons such as xylene, toluene, hexane and heptane, chlorinated hydrocarbons such as carbon tetrachloride and chloroform, ketones such as methylisobutyl ketone, methyl ethyl ketone and cyclohexanone and esters such as diethyl phthalate and n-butyl acetate."
However, these known techniques are not necessarily satisfactory when some pyrethroidal insecticides are used as an active ingredient for cockroach-controlling.
The inventors have made intensive study on optimum ranges of particle diameter and wall thickness of microcapsules and on selection of optimum organic solvents when an insecticide having a 3-phenoxybenzyl group is encapsulated as a core material in a polyurethane wall and then this is used for cockroach-controlling.
As a result, it has been found that some insecticides having a 3-phenoxybenzyl group microencapsulated as a core material in polyurethane wall using phenylxylylethane as a cosolvent have residual efficacy for a prolonged period of time for cockroach-controlling.


A monoport airgun for seismic exploration has a single discharge port extending continuously for 360.degree. around its longitudinal axis. This airgun has a first housing providing a firing chamber containing pressurized gaseous fluid (gas) and a second housing providing an operating chamber. The first and second housings are positioned in alignment along the longitudinal axis. They are spaced apart along this axis for defining the discharge port between them extending continuously around the axis. The two housings of the monoport airgun are interconnected solely by a guide member concentric with the axis. A shuttle encircling the guide member is movable therealong between closed and open positions. In closed position, the shuttle closes the firing chamber for retaining pressurized gas therein. In open position, the shuttle opens the firing chamber to the discharge port for allowing pressurized gas to blast from the firing chamber through the discharge port. The discharge port which extends continuously around the axis flares outwardly in generally exponential horn-like configuration for enhancing effectiveness of the discharge port in generating seismic energy waves. A passageway in the guide member supplies pressurized gas from the operating chamber to the firing chamber when the shuttle is in closed position. This passageway is blocked by the shuttle in open position.

Airguns are used for seismic exploration. They are impulsive energy sources which are triggered to discharge a powerful blast of pressurized gaseous fluid from the airgun. This pressurized gaseous fluid usually is compressed air. However, other pressurized gaseous fluids can be used. Thus, the term "pressurized gaseous fluid" as used herein is intended to include a pressurized gas and a pressurized mixture of gases, for example, compressed air, compressed Nitrogen, compressed Carbon Dioxide, and compressed gaseous products of combustion.
The surrounding ambient "water medium" as described herein is intended to include salt water, fresh water, water-filled muddy areas and watery marsh or swamp areas. The powerful blast of pressurized gaseous fluid issuing from the airgun through the discharge port suddenly transfers energy into such a surrounding water medium for generating seismic energy waves which are propagated into the Earth for providing seismic exploration data.
To achieve deep penetration of seismic energy into the Earth and to provide more definitive seismic data, it is desirable to maximize the transfer of energy from the blast of gaseous fluid into the surrounding water medium and also desirable to maximize peak pressure of an initial pressure pulse generated by this blast relative to peak pressure of any secondary pressure pulse created in the water medium subsequent to the initial peak pressure pulse.

Monoport airgun for seismic exploration having discharge port extending continuously for 360 degree around its axis


Disclosed is a liquid crystal display device comprising a pair of facing substrates; a plurality of thin film transistors formed on one of the facing substrates; a plurality of pixel electrodes driven according to the actuation of the thin film transistors. The present invention provides a liquid crystal display device comprising a lower substrate; a plurality of gate bus lines formed on the lower substrate and to which selecting signals are applied parallel to each other; a plurality of common electrodes formed on the lower substrate; a plurality of thin film transistors connected to the gate bus lines and the common electrodes respectively; a plurality of pixel electrodes formed on the lower substrate and to which voltage signals from the common electrodes are applied in accordance with action of the thin film transistors; an upper substrate disposed oppositely to the lower substrate; a plurality of data bus lines formed on the upper substrate parallel to each other and to which image signals are applied; a plurality of color filters formed on the upper substrate above the data bus lines; and a plurality of transparent electrodes arranged on top of the color filters such that they are in contact with the data bus lines.

1. Field of the Invention
The present invention relates to a liquid crystal display device, and more specifically to a liquid crystal display device comprising a pair of substrates opposed to each other, a plurality of thin film transistors formed on one of the substrates, and a plurality of pixel electrodes driven according to the action of the thin film transistors.
2. Description of the Related Art
Liquid crystal display devices are widely used in TVs, and graphic displays. One of these liquid crystal display devices is an active matrix type liquid crystal display device which has high response speed, and many pixel electrodes. Also, active researches are in progress toward active matrix type liquid crystal display devices with higher picture quality, larger size, and color display.
In the active matrix type liquid crystal display devices, gate bus lines and data bus lines are arranged on a lower substrate. At the intersections of the gate bus lines and data bus lines, pixel electrodes and switching devices such as diodes or transistors are arranged.
Since a drive of the pixel electrodes are controlled independently by the switching devices, their high speed driving is possible, and equipping a large number of pixels and realizing large size display therein are also possible.
In a conventional active matrix type liquid crystal display device as shown in FIG. 1, a plurality of gate bus lines 2 are arranged in a first direction P, parallel to each other on a lower substrate 1. Each of gate electrodes 2A is a part of respective gate bus lines 2, wherein the gate lines 2 each is protruded perpendicularly from a predetermined location of the respective gate bus lines 2. An amorphous silicon layer 4 is arranged on top of surface the gate electrodes 2A. A plurality of data bus lines 7 are arranged in a second direction Q is perpendicular to the gate bus lines 2, parallel to each other, so as to form a matrix shape of unit cells along with the gate bus lines 2. The gate bus lines 2 and the data bus lines 7 have a gate insulation layer (not shown) interposed between them so as to be electrically insulated from each other. Each of source electrodes 7A is a part of their respective data bus lines 7, and is protruded by a predetermined distance to be overlapping with one side of the amorphous silicon layer 4. Each of drain electrode 7B overlaps with the other side of the amorphous silicon layer 4. A plurality of thin film transistors TFT comprise the gate electrodes 2A, the amorphous silicon layer 4, the source electrodes 7A and the drain electrodes 7B. A plurality of pixel electrodes 8 are arranged inside their respective unit cells, and contact with the drain electrodes 7B. Storage electrodes 2B are disposed beneath the pixel electrodes 8, forming storage capacitors therewith. The storage electrodes 2B are made of non-transparent material.
As shown in FIG. 2, an upper substrate opposite to the lower substrate 1 includes a plurality of color filters 11 having the same shape as the pixel electrodes 8 on the lower substrate 1 so as to correspond with the same. A black matrix 12 is arranged to surround the respective outer portions of the color filters 11 to prevent scattering of colors of the color filters 11, and to prevent leakage of light from the lower substrate 1. The black matrix 12 is made of a non-transparent material. A transparent electrode (not shown) is coated over the color filters 11 and the black matrix 12, and is electrically grounded along with the storage electrodes 2B.
In the liquid crystal display having a structure as described above, if a scanning selecting signal is applied to one of the gate bus lines 2, and an image signal is transmitted to a corresponding data bus line 7, thin film transistors TFT located at the intersection of the data bus line 7 and the gate bus line 2 to which the scanning selecting signals were applied are turned on, and the corresponding pixel electrode 8 is driven. Then the image signal loaded into the data bus lines 7 flows from the source electrodes 7A to the drain electrodes 7B and is then applied to the pixel electrodes 8 being in contact with drain electrodes 7B, thereby driving the pixel electrodes 8.
In a result, a predetermined electric field is formed between the pixel electrodes 8 and the grounded transparent electrodes (not shown), and the liquid crystal molecules are activated. However, at intersections(shown as X in FIG. 1) of the gate bus lines 2 and a data bus lines 7, the foregoing liquid crystal display devices have a gate insulation film(not shown) disposed only between the gate bus lines 2 and the data bus lines 7. Hence, if a slight damage should arise at these gate insulation film, short circuit between gate bus lines 2 and data bus lines 7 is apt to happen.
Also, as the intersections of gate bus lines 2 and data bus lines 7, and data bus lines 7 and storage electrodes 2B increase, parasitic capacitance also increases. This causes the signal delay time T=RC to increase. Moreover, since the storage electrodes 2B are formed on the surfaces of the pixel electrodes 7, the transmitting area of light is blocked. Hence aperture ratio of the liquid crystal displays is reduced.

Hyundai Electronics Industries Co., Ltd.


A large flat panel display having a plurality of tile display modules with capability in the range of 12 or more lines per inch, being precisely manufactured and aligned such that the interpixel spacing between two adjacent tiles maintains the uniformly periodic spacing of the interpixel spacing within tiles. The display is addressed as a single monolithic display, without reference to the plurality of individual tiles making up the display. All of the interconnections between tiles are located between tiles in the "shadow area", unless all tiles can have an edge around the periphery of the display. Also disclosed are methods of making and assembling the tiles and the displays.

The ultimate television set will hang on the living room wall like a picture, and be at most a few inches thick. The most promising technology in this field today is the liquid crystal display (LCD). Liquid crystal displays have been commercially available for more than 20 years, but until recently have been restricted to relatively small size. Such displays are ubiquitous in watches, calculators, radios, and other products requiring indicators and some small number of alphanumeric characters. Recently, improvements in liquid crystal technology has occurred, allowing larger high line density displays to be manufactured. These have achieved widespread acceptance in portable computers, very light laptop computers, and dedicated word processors. Other products include flat screen and projection television systems. Additional improvements in the technology have led to full color displays, which are now in production.
The original LCD technology, commonly used in watches and calculators and the like, was termed "passive matrix". Row and column lines were energized to activate a specific LCD spot (picture element or "pixel") at the intersection of the row and column. The display was continually scanned to turn each pixel on or off as needed.
The more modern technique, currently used in most laptops, includes the addition of active switches to control the action of the liquid crystal at each picture element or pixel. The active switch can be a thin film diode or a thin film transistor, and, for large displays, the number of active elements approaches the number of transistors in a dynamic memory chip. These displays are termed "Active Matrix Liquid Crystal Displays", or "AMLCD". The result is higher speed, higher contrast, and higher overall brightness. The use of these active devices to control "light valves" greatly simplifies the electronics of the display, but the cost of these improvements is the added fabrication sequence to deposit the active devices at each pixel, and the need for leads to each device, a total of hundreds of thousands of devices for each display.
The keys to the economical production of AMLCD are the yield of the complex sequential process and the number of displays that may be cut from a panel.
A common problem in the manufacture of large area panel displays is that of a relatively low yield. This is usually expressed in defects per unit area--for example, 0.01 defects/cm.sup.2 corresponds approximately with 1993 manufacturing practice in Japan (see Liquid Crystal Flat Panel Displays, William C. O'Mara, 1993, p. 105). At this defect level, the yield for a 10" diagonal display, common in laptop computers, is about 90% at best, which results in a cost of $500-$1,000 per display. The larger the display, the lower the yield, using conventional technology. If a 10" display has a yield of 80%, a 35" display (approximately 12 times larger in area) would have a yield of 0.8.sup.12, or 6%, or six good displays out of one hundred, without rework or repair. Large-screen TVs of 25-35" diagonal would not be economical with such a yield rate and current production methods. First generation panels are currently available up to about 17" in size. Second generation panels, expected by about 1996, will be up to around 21", while third generation panels, some 5-10 years in the future, may be expected to be as much as 29".
To reach larger sizes where monolithics are not economical due to the problems discussed above, a plurality of relatively small "tile" displays can be connected together in precise alignment to form the larger display, one suitable alignment technique being described in copending U.S. patent application Ser. No. 08/297,958, filed Aug. 31, 1994. Sharp, a Japanese display manufacturer, has recently announced a tiling product which fails to meet the requirement of uniformly periodic pixel spacing. In tiled displays, each of the tiles may be individually tested before assembly, and defective tiles discarded. The yield loss is then due only to the assembly operations and factors relating to system performance specifications. Furthermore, the assembly may be designed to be reworkable by removal and replacement of tiles.
The present invention relates, in general, to a method for making these tiled displays for use in large area panel displays, and more particularly to a technique for producing and assembling such small display tiles into a large area display and selectively electrically interconnecting the tiles while at the same time mechanically positioning them to meet the desired optical specifications.
This disclosure describes a unique approach to the design and fabrication of flat panel displays through the utilization of innovative interconnection designs and assembly technology, some of which are adapted from state of the art assembly of semiconductors and enhanced to account for optical as well as electronic specifications.
In AMLCD flat panel displays that are lighted from the back, all pixel locations must be spaced center to center with a uniform periodicity, and lighting intensity must be uniform. In addition, the solid angle of light being emitted from each pixel should be large and uniform. Moreover, the electrical lines for each pixel cannot obstruct the light-transmitting part of the light valve (the switchable section of the LCD display which actually forms the pixel).
These specifications are all new to display technology, requiring careful design and technology improvements to handle precise locations of the pixels and to achieve continuity in observed pixel spacing from tile to tile.
New packaging designs and processes to enhance tiling capability described herein will allow displays to be made that are much larger than monolithic displays.
Within a tile, maintaining the interpixel spacing and routing the electrical connections is a function of the monolithic fabrication process, but at the perimeter the tile must be connected to neighboring tiles. In semiconductor manufacturing, this edge space (known as a "kerf" area) is generally wasted to accommodate bonding sites and room for cutting. In tiled optical displays, however, neighboring pixels on neighboring tiles must appear to the eye to be the same size as all others and must have uniformly periodic spacing within each tile, and across the tile boundaries. There is little room for a kerf.


A projection system includes an image capturing unit which, when a first pattern image is projected on a first projection area, captures an image capture area including the first projection area and at least a portion of a second projection area which overlaps the first projection area to obtain a first captured image and, when a second pattern image is projected on the second projection area, captures the image capture area to obtain a second captured image, a first projection unit which projects a first partial projection-target image extracted from a projection target image based on the first and second captured images and the projection target image on the first projection area, and a second projection unit which projects a second partial projection-target image extracted from the projection target image based on the first and second captured images and the projection target image on the second projection area.

1. Field of the Invention
The present invention relates generally to a projection system and a projection method.
2. Description of the Related Art
Some type of known projection systems, such as a multiple projection system, is configured to use multiple projection apparatuses such as projectors in projecting multiple partial projection-target images which make up a projection target image on a projection medium such as a screen, thereby forming an image of high brightness and high resolution. An example of such a multiple projection system is disclosed in Japanese Laid-open Patent Publication No. 2006-349791.
Such a projection system typically determines partial projection-target images to be projected by projection apparatuses using a captured image where a projection medium and pattern images projected by the projection apparatuses are captured, and therefore requires that an image capture device be arranged or a wide-angle lens be used so that such captured images can be obtained.
However, it is necessary to arrange the image capture device at a certain distance or further away from the projection medium so that such a captured image as that described above can be captured. As a result, a rather severe constraint is imposed on arrangement, which can make such a projection system inapplicable depending on an environment where the system is used. Employing a wide-angle lens to obtain such a captured image as that described above will undesirably increase cost.
Under the circumstances, there is a need for a projection system and a projection method which allow reducing cost and constraint on arrangement.
It is an object of the present invention to at least partially solve the problem in the conventional technology.


A controllable Pockels cell system has a switching unit that can apply voltage to the Pockels cell. The Pockels cell system also features a delay unit that enables setting of a precise time when voltage is applied or removed from the Pockels cell. This allows displacing in time the voltage pulse applied to the Pockels cell, in this manner also displacing in time the transmission pulse of the Pockels cell with an analyzer located behind the Pockels cell. Thus it is possible to individually control the amplitude of selected laser pulses. The switching unit can either be a simple push-pull circuit or a bridge circuit made from two push-pull circuits.

Commonly used devices for switching laser pulses are optical switches or modulators placed in the beam path within or outside of a laser resonator. Optical modulators include both electro-optical modulators and acousto-optical modulators. An important parameter for selecting the type of modulator is the attainable switching time. Using acousto-optical modulators, the switching time is determined by the speed of sound and the diameter of the laser beam. In some cases these parameters render the attainable switching speed too slow for a number of applications, such as suppressing pre- or post-pulses to a laser pulse that is extracted from an optical cavity. Electro-optical modulators have faster switching speeds and have in recent time been improved, now also allowing the high repetition rates that are attainable with acousto-optical modulators.
As their main element, common electro-optical modulators use a Pockels cell with variable optical properties, and an element sensitive to the polarization direction of the light beam, such as a reflective analyzer with constant optical properties. A Pockels cell normally comprises a birefringent crystal, which is suitably oriented with respect to the propagating light beam and to which a voltage of a few hundred to a few thousand volts is applied for changing the polarization of the incident light beam. Combined with the polarization sensitive element, these elements can be used for switching the light beam propagating through these elements on and/or off, of for changing the path of the light beam by optical element that are sensitive to the polarization of the incident light beam.
Using a suitable high voltage supply that can be switching between two voltage values the Pockels cell can switch the propagating laser beam between two orthogonal states of polarization. The difference of these two voltage values is a function of the parameters of the crystal material that is used and the wavelength of the propagating laser beam to be switched. In some applications both transitions from high to low voltage and vice versa must take place within a few nanoseconds, while some other applications only require one of the transitions to be as fast as a few nanoseconds, whereas the other transition can take place also in a time of microseconds.
Such an electro-optical modulator with a Pockels cell and a switchable high voltage supply can be used to optically switch laser pulses of short duration such as a few nanoseconds (ns), or ultrashort duration such as picoseconds (ps) or femtoseconds (fs), either changing their intensity or their propagation path. Such ultrashort laser pulses can be generated by known principles such as mode locking, Q-switching or gain switching. Mode-locked laser pulses usually have high repetition rates above 1 MHz, typically from 40 MHz to 200 MHz, for solid state lasers, and low pulse energies in the order of nanojoules, typically from 0.1 nJ to 50 nJ. If it is necessary to extract single laser pulses or groups of laser pulses from a continuous ps or fs pulse trains, it is often advantageous to use Pockels cells for this purpose. To do this, the voltage applied to the Pockels cell must be switched completely on or off in the time interval between two pulses, which is typically between 5 ns and 25 ns.
Often ultrashort laser pulses of significantly higher energy than mode-locked laser pulses (e.g., 1,000-fold to 100,000-fold) are necessary for applications such as material processing or nanolinear optical science. In this case, the extracted mode-locked laser pulses are injected into an optical amplifier, passing its amplifying stage the number of times necessary to achieve the desired energy level.
German Patent No. DE 102 51 888 B4 discloses an electrical control for Pockels cells and a laser system employing a Pockels cell with such an electrical control for selecting laser pulses. The electrical control has been modified from the commonly known H-configuration by adding at lest one high voltage switch. This switch can either replace the commonly used recharging resistor or be placed in parallel to it. Such an electrical control can efficiently select individual laser pulses, allowing the precise generation of pulse sequences with defined time intervals for certain applications.
The amplitude of a laser pulse transmitted through an electro-optical modulator is controlled by the amplitude of the voltage signal applied to the Pockels cell. The voltage amplitude can only be varied in time scales in the order of milliseconds. In this way, it is not possible to control the amplitude of consecutive laser pulses, which is desired for certain applications such as material processing.


A sliding roof system includes at least one guide rail, a carriage that is shiftable in the guide rail, and a cover support which together with a cover can be adjusted by shifting the carriage between a closed position, a lifted venting position, and a lowered open position. The cover support is provided with studs that engage in the carriage. The carriage is located outside a contour of the cover as seen in a top view of the sliding roof system.

The invention relates to a sliding roof system that includes at least one guide rail, a carriage shiftable in the guide rail, a cover support that can be adjusted by shifting the carriage between a closed position, a lifted venting position, and a lowered open position, and where the cover support is provided with studs that engage in the carriage.
A cover is connected with the cover support of the sliding roof system and closes a roof opening in the closed position of the sliding roof system. In the lifted venting position, a rear edge of the cover, as seen in a traveling direction of a vehicle, is raised outwards relative to a roof. In the open position, the cover is shifted to lie underneath a roof sheet that is located behind the roof opening.
In general, an aim with such sliding roof systems is that an opening exposed by the cover, which does not necessarily have to be identical with the roof opening, is as large as possible. It is also desirable that a clear width of the opening, which is perceived by a vehicle occupant, i.e. transverse to a vehicle longitudinal axis, is as large as possible.
It is the object of the invention to further develop a sliding roof system of the type initially mentioned to the effect that a particularly large clear width of the opening will be produced.


The present invention relates to thermoplastic polymer compounds comprising a blend of a chlorinated polyvinyl chloride and an impact modifier containing a polyorganosiloxane and polyalkyl(meth)acrylate. The novel thermoplastic compound has improved stability and toughness and exhibits a low rate of heat release.

It is well known to the art and literature that a chlorinated vinyl polymer referred to as chlorinated polyvinyl chloride, hereinafter CPVC, has excellent high temperature performance characteristics, among other desirable physical properties. Typically, commercial CPVC has about 57 percent to about 69 percent by weight of bound chlorine, and is most conveniently prepared by the chlorination of polyvinyl chloride (hereinafter PVC) as described in U.S. Pat. Nos. 2,996,489; 3,100,762; 3,334,077; 3,334,078; 3,506,637; 3,534,013; 3,591,571; 4,049,517. U.S. Pat. No. 5,216,088 describes a two step process for forming CPVC containing at least 70 percent by weight chlorine.
The term CPVC is used herein to define a chlorinated vinyl chloride polymer having in excess of about 57 percent by weight of bound chlorine based upon the total weight the polymer. CPVC has become an important specialty polymer due to its relatively low cost, high glass transition temperature, high heat distortion temperature, outstanding flame and smoke properties, chemical inertness, and low sensitivity to hydrocarbon feed stock costs. The glass transition temperature of CPVC generally increases as the percentage of chlorine increases. However, as the chlorine content increases, the CPVC resin becomes more difficult to process. In addition, a well known undesirable characteristic of CPVC resin is that it inherently has low impact properties, a characteristic which is also common to vinyl chloride homopolymers.
The poor processability of CPVC resins is exemplified by milling CPVC on a two roll mill at elevated temperatures which results in high torque and high temperatures as well as decomposition of the CPVC. Softening additives or plasticizers have been added to CPVC in order to improve its processability. Although its processability is somewhat improved, these additives produce undesirable effects. Some of the more significant detrimental effects produced by inclusion of these softening or plasticizer additives are lower heat distortion temperatures, softness and weakness in terms of lower tensile strength, and less desirable chemical properties than those exhibited by CPVC alone. These negative attributes of the additives on CPVC impede the usefulness of the modified CPVC in the manufacture of rigid plastic articles.
The increasing demand for CPVC pipes, vessels, valve bodies and fittings, and the fact that an impact-deficient CPVC matrix can be improved by compounding and blending it with other polymers, has instigated concerted efforts to develop better impact modified compounds. Most of these efforts have been channeled toward rigid CPVC applications where acceptable impact strength and dimensional stability under heat are critical. These include the manufacture of exterior structural products, rigid panels, pipes and conduits, injection-molded and thermoformed industrial parts, appliance housings, and various other types of containers, both large and small.
U.S. Pat. No. 3,264,375 to Robert W. Jones relates to rubber-modified styrene-type polymers. More particularly, the Jones Patent relates to processes for preparing such materials and for producing rubber-in-monomer solutions to be employed in preparing such materials.
U.S. Pat. No. 4,173,598 to Castelazo et. al. relates to processes for making polymeric compositions which have methacrylic and/or acrylic chains grafted onto a copolymerized vinyl diene substrate. The compositions are particularly useful as impact modifiers for polyvinyl chlorides.
U.S. Pat. No. 4,362,845 to Kamata et. al. relates to a composition with high impact resistance and little fish eyes content, comprising 97 to 60 parts by weight of a polyvinyl chloride-base resin and 3 to 40 parts by weight of a graft copolymer obtained by the three-stage graft polymerization of 65 to 25 parts by weight of a monomer combination (B) comprising 12 to 57 percent by weight of methyl methacrylate, 1 to 24 percent by weight of at least one of alkyl acrylates having a C.sub.1-18 -alkyl group, 80 to 40 percent by weight of styrene and 0 to 3 percent by weight of a polyfunctional crosslinking agent having one or more alkyl groups in the molecule onto 35 to 75 parts by weight of a butadiene-base elastomer (A) containing 30 percent by weight or more of 1,3-butadiene units.
Although the impact modified CPVC compounds described above are useful, the compounds contain carbon based impact modifiers and therefore provide more fuel to increase the rate of heat release and smoke generation when the compounds are burned. The addition of these types of impact modifiers to CPVC therefore produces less desirable properties in the compound than CPVC alone.
Therefore, a thermoplastic polymer compound comprising chlorinated polyvinyl chloride and an impact modifier having improved properties is desired. Preferably, the thermoplastic polymer compound will have increased stability, toughness and a low rate of heat release and smoke generation.

Chlorinated polyvinyl chloride compounds having improved stability, toughness and a low rate of heat release and smoke generation


The invention relates to an image receiving sheet which is a retransfer sheet for forming an image on an optional transferred medium The image receiving sheet comprises a support member, a transparent layer and a thermoplastic fine particles layer Light having an image information is irradiated toward a photosensitive recording medium having microcapsules which change their hardness by being exposed to one of heat or light. Then, a chemical latent image corresponding to the image is represented by the microcapsules having different hardness. When the photosensitive recording medium and the image receiving sheet are superposed and pressed against each other, the unhardened microcapsules are ruptured and the pigment or dye in the unhardened microcapsules flows from the ruptured microcapsules. The pigment or dye that flows from the microcapsules is absorbed into the thermoplastic fine particles layer. As a result, a visible image corresponding to the image is formed on the image receiving sheet. The image receiving sheet is placed on the transferred medium and they are thermally pressed against each other. When the support member is peeled off, the image covered with the transparent layer remains as a transfer on the transferred medium.

1. Filed of the Invention
The invention relates to an image receiving sheet for forming an image thereon when the image receiving sheet is closely held against a photosensitive recording medium and is pressed thereto, and for transferring the image thus transferred on the image receiving sheet onto an optional image receiving medium.
2. Description of Related Art
Conventionally, there is an image recording method which is disclosed in Japanese Laid-Open Patent Publication No. 61-275742. In the image recording method, a plurality of microcapsules each encapsulating therein not only color forming material made from dye or pigment but also, at least, silver halide, reducing agent, and polymerizable compound, are employed. More specifically, a photosensitive recording medium having a base sheet with the microcapsules uniformly coated thereon is used. When each of the microcapsules is exposed to light, the microcapsule forms an latent image speck therein. Therefore, when the light having an image information selectively exposes the photosensitive recording medium, some of the microcapsules are exposed and others are not exposed. The exposed microcapsules each form the latent image speck therein. Each of the microcapsules having the latent image speck is hardened by heat. However, each of the microcapsules which does not form the latent image speck therein is not hardened by heat. Thus, a first latent image is formed on the photosensitive recording medium. In other words, the first latent image is represented by microcapsules having the latent image speck therein and the microcapsules having no latent image speck therein.
Next, the photosensitive recording medium, which was exposed to the light having the image information, is heated by a heating device. The microcapsules having the latent image speck therein are hardened and a second latent image is thereby formed on the photosensitive recording medium. In other words, the second latent image is represented by the hardened microcapsules and the unhardened microcapsules. After this, the photosensitive recording medium is superposed on the image receiving sheet and is pressed thereto The unhardened microcapsules are ruptured and the color forming materials, made from dye or pigment, flow out of each of the ruptured microcapsules and are transferred onto the image receiving sheet. As a result, an image is formed on the image receiving sheet. The above-mentioned conventional image recording method is therefore capable of performing a highly-sensitive image recording operation of a dry type for recording a desired image on the image receiving sheet.
However, with the above-mentioned conventional image forming method, it is impossible to transfer the image onto an optional article having an arbitrary shape. For example, it is impossible to transfer the image onto cloth having a size that is too large to be introduced into a pressing device for pressing the photosensitive image recording medium toward the cloth.
To address the above-mentioned problem, an applicant of the present invention previously proposed an image receiving sheet 23 in the specifications and drawings of U.S. patent application Ser. No. 07/911,978, filed Jul. 10, 1992. As shown in FIG. 6, the proposed image receiving sheet 23 includes a support member 20 and a porous absorbing layer 22 provided thereon. The porous absorbing layer 22 contains fine particles 21 having a heat-meltable or thermoplastic property.
Hereinafter, a method of forming an image on an optional transferred medium having an arbitrary shape with the image receiving sheet 23 and the photosensitive recording medium will be explained.
First, as described above, the photosensitive recording medium which is exposed to the light, having the image formation, is then heated by the heating device. Then, the second latent image bearing surface of the photosensitive recording medium, that is, the microcapsules side thereof is superposed on and pressed toward the porous absorbing layer 22 of the image receiving sheet 23 so that the unhardened microcapsules are ruptured. The dye or the pigment flows from the ruptured microcapsules. The dye or the pigment from the ruptured microcapsules is absorbed in spaces between the fine particles 21 and held therein. As a result, the image is formed on the porous absorbing layer 22.
Next, the image receiving sheet 23 is peeled from the photosensitive recording medium. Further, the image receiving sheet 23, having the porous absorbing layer 22 thereon, is placed, face down, on the optional transferred medium. The image receiving sheet 23 is pressed toward the transferred medium and, further, heated by an iron or other heat source. Thus, the porous absorbing layer 22 is melted onto the optional transferred medium and attaches thereto. Finally, the supporting layer 20 of the image receiving sheet 23 is peeled off so that the image (re-transferred image) is left formed on the transferred medium.
The retransferred image formed by the transferring method using the above-mentioned image receiving sheet 23, contains a polymerizable compound which is a stimulus to the skin, such as TMPTA [trimethylolpropane triacrylate]. Therefore, there is a fear that some persons may have a reaction, such as itchy skin, when they touch the surface of the retransferred image.


A sense amplifier circuit includes an enable signal generation unit configured to generate an enable signal when a change in a voltage level of input signals is sensed; a sink unit configured to provide a sense voltage in response to the enable signal; and a sense unit configured to generate an output signal in response to the sense voltage and the input signals.

1. Technical Field
The present invention generally relates to a semiconductor device, to a sense amplifier circuit, and a semiconductor device using the same.
2. Related Art
A semiconductor device is driven by for power and thus is configured to include a sense amplifier circuit for sensing a difference in the voltage level and for converting the difference into a digital level. A sense amplifier circuit may sense a difference between the voltage levels of input signals. An input signal having a relatively high voltage level according to a result of the sensing is amplified in a high level and outputted, and an input signal having a relatively low voltage level according to a result of the sensing is amplified in a low level and outputted. A sense amplifier circuit using another method amplifies an input signal, having a relatively low voltage level, into a signal of a low level so that the input signal having a relatively low voltage level is clearly distinguished from an input signal having a relatively high voltage level.
FIG. 1 is a diagram illustrating the construction of a known sense amplifier circuit. Referring to FIG. 1, the sense amplifier circuit 10 includes first to fifth transistors N1, N2, N3, N4, and N5, respectively. The left side of the sense amplifier circuit 10 corresponds to an input terminal, and the right side thereof corresponds to an output terminal. The first transistor N1 is turned on in response to a sense control signal EN when a signal is transmitted from the input terminal to the output terminal, thus supplying a ground voltage VSS. The degree of turn-on of the second and the third transistors N2 and N3 varies according to the levels of input signals IN and INB when a signal is transmitted from the input terminal to the output terminal. Accordingly, the first to third transistors N1, N2, and N3, respectively, may generate output signals OUT and OUTB by amplifying the input signals IN and INB. The fourth and the fifth transistors N4 and N5 are turned off when a signal is transmitted from the input terminal to the output terminal, but are turned on in response to a control signal WE when a signal is transmitted from the output terminal to the input terminal. When the fourth and the fifth transistors N4 and N5 are turned on, they couple the input terminal and the output terminal.
The operation of the sense amplifier circuit 10 when a signal is transmitted from the input terminal to the output terminal is as follows. When the input signal IN has a higher level than the input signal INB, the degree of turn-on of the second transistor N2 is greater than the degree of turn-on of the third transistor N3. Accordingly, the output terminal OUTB drops to a ground voltage (VSS) level faster than the output terminal OUT. When the output signal OUTB reaches the ground voltage (VSS) level, a difference in the voltage level of the input signals IN and INB is amplified and thus the amplified output signals OUT and OUTB may be outputted through the output terminal.
The sense amplifier circuit 10 starts a sense amplification operation when the sense control signal EN is enabled. The sense control signal EN turns on the first transistor N1 that supplies the ground voltage VSS, Accordingly, a point in time at which the sense control signal EN is enabled is closely related to a precise operation of the sense amplifier circuit 10. For example, if the input signals IN and INB are not supplied at normal points in time, the levels of the output signals OUT and OUTB may be reversed or points in time at which the output signals OUT and OUTB are generated may be delayed.
Furthermore, even when a mismatch occurs between the second and the third transistors N2 and N3, respectively, which substantially perform a sense operation, the output signals OUT and OUTB may not be normally generated.

Semiconductor device with a sense amplifier unit responsive to a voltage change of input signals and a sense control signal


A method of manufacturing a metal wiring in a semiconductor device includes: forming a via hole by selectively etching an interlayer insulating layer formed on a first metal layer; sequentially forming a first barrier metal layer and a second metal layer on the interlayer insulating layer; etching the first barrier metal layer and the second metal layer in the via hole to a predetermined depth together with selectively etching a surface of the second metal layer; forming a silicon layer on the first barrier metal and the second metal to a predetermined height; forming a second barrier metal layer on the interlayer insulating layer; forming a third metal layer on the second barrier metal layer; and forming a second barrier metal pattern and a third metal layer pattern by patterning the second barrier metal layer and the third metal layer.

As it is well known, a metal wiring is required to apply an electric signal to a semiconductor device, and a metal wiring process having a multi-layer metal structure of at least two metals is currently used for manufacturing a highly integrated semiconductor device. Such a conventional metal wiring process is described in detail with reference to FIGS. 1A to 1G.
FIGS. 1A to 1G are cross-section views showing a method for manufacturing a conventional semiconductor device.
At first, referring to FIG. 1A, a first metal layer 2 is formed by performing a coating process such as a spin coating to apply an electric signal to a semiconductor device (not shown) formed on a semiconductor substrate. Thereafter, an interlayer insulating layer 4 is formed on the first metal layer 2, and the interlayer insulating layer 4 is planarized by applying a chemical mechanical polishing (CMP) process to the formed interlayer insulating layer 4.
In the next step, as shown in FIG. 1B, a photoresist layer is coated on a top of the interlayer insulating layer 4, and a first photoresist layer pattern 6 is formed by selectively removing a portion of the photoresist layer to a predetermined depth by using a pattern mask. A via hole 8, as shown in FIG. 1C, is then formed by etching the interlayer insulating layer 4 using the formed first photoresist layer pattern 6 as a mask. In sequence, the remained first photoresist layer pattern 6 is removed by performing a streaming process.
In the following step, as shown in FIG. 1D, a barrier metal 10 is deposited on top of the interlayer insulating layer 4a having the via hole 8 formed thereon and the first metal layer 2. In addition, a second metal layer 12 is coated on a top of the deposited barrier metal 10 by performing sputtering processes.
Sequentially, by applying, as shown in FIG. 1E, a CMP or an etch-back process to the deposited barrier metal 10 and the coated second metal layer 12, the deposited barrier metal 10 and the coated second metal layer 12 are planarized so as to form a barrier metal 10a and a second metal 12a.
Thereafter, by performing a sputtering process on the surfaces comprising the tops of the interlayer insulating layer 4a, the barrier metal 10a and the second metal 12a, as shown in FIG. 1F, a third metal layer 14 is formed. A photoresist layer is then coated on a top of the third metal layer 14 and a second photoresist layer pattern 16 is formed by patterning the photoresist layer.
Finally, a third metal layer pattern 14a is formed by dry etching the third metal layer 14, wherein the second photoresist layer pattern 16 is utilized as a mask, as shown in FIG. 1G. Accordingly, the first metal layer 2 and the third metal layer pattern 14a are electrically connected by the barrier metal 10a and the second metal 12a.
However, a method for forming a metal wiring of a conventional semiconductor device described above is formed by a previously defined process, and therefore, more fabrication installations are required for foundry companies to manufacture devices capable of operating at a voltage desired by a customer.
Furthermore, because a metal layer is formed in a multi-layer structure to form a metal wiring of the semiconductor device useful at a high voltage, there is an increased probability of generating an error as the number of metal layers increases.

This patent is subject to a terminal disclaimer.

Semiconductor device and method for manufacturing the same


A sealing arrangement between hot runner components includes a sealing component positioned between a first hot runner component and a second hot runner component having a molding material channel extending therebetween. The sealing component includes an opening through which the molding material channel extends. The sealing component is received in a bore in the second hot runner component such that a portion of the sealing component projects beyond the second hot runner component to create a gap between the first hot runner component and the second hot runner component. The sealing component has a hardness that is greater than a hardness of the second hot runner component and less than a hardness of the first hot runner component. Further, the sealing component has a coefficient of thermal expansion that is proximate to a coefficient of thermal expansion of the second hot runner component.

Creating a consistent and reliable seal between the molding material channels of adjacent hot runner components has been a challenge in the industry for many years. To reduce the likelihood of leakage, hot runner manufacturers have tried different sealing components or arrangements between the adjacent hot runner components. For example, high temperature o-ring seals and crush rings have been used; however, these seals are prone to degradation and or collapsing which reduces their overall service life. Often the seal between the adjacent hot runner components is dependent upon the system being heated to within a specific processing temperature range for the seal to be effective. If the system temperature is too low it is probable that the leakage will occur from between the adjacent components. However, if the system is overheated it is also probable that the seal itself will become compromised and its overall effectiveness will be reduced and/or the seal will expand and push the adjacent components apart, which reduces heat transfer therebetween. Such seals are also dependent upon the melt flow index and/or the viscosity of the material being processed in order to prove effective. Accordingly, there has long been a need in the art to provide a predictable reliable seal between adjacent hot runner components that is effective across a range of processing temperatures and for a variety of molding materials.


An engine control device for detecting misfire of an engine. Based on a detected crank angle of the engine, an angular velocity at a first crank angle at which the engine speed is close to a minimum within one combustion cycle of each cylinder is calculated as a pre-combustion angular velocity, and an angular velocity at a second crank angle at which the engine speed is close to a maximum within the same combustion cycle is calculated as a post-combustion angular velocity. An amount of rotation variation caused between the first and second crank angles is calculated based on the pre-combustion and post-combustion angular velocities of the same combustion cycle, and is compared with a predetermined misfire criterion to determine whether or not misfire has occurred. When misfire is detected, a required operation is performed, for example, a warning lamp is turned on or the fuel supply quantity is increased.

1. Field of the Invention
The present invention relates to an engine control device for detecting misfire of an engine and, on detection of misfire, performing counter-misfire control by, for example, issuing a warning or correcting the fuel injection quantity.
2. Description of the Related Art
Incomplete combustion of fuel in engine cylinders is an immediate cause of inconveniences such as deterioration in exhaust gas characteristics, and therefore, the regulations regarding OBD (On-Board Diagnosis) require that a motor vehicle be provided with the function of notifying the driver of the occurrence of misfire, which is a cause of incomplete combustion. The misfire detection is also utilized for various control purposes to avoid the combustion being deteriorated. In the circumstances, there has been a demand for a misfire detection device capable of accurate detection of misfire.
As conventional misfire detection devices, there has been known a device using a misfire detection method based on the period of crank angle (CA), for example. In this method, on the basis of the output from a crank angle sensor, an average angular acceleration is calculated with respect to every combustion cycle corresponding to 180° CA, and the calculated average angular acceleration is compared with a predetermined misfire criterion value to determine whether or not misfire has occurred. The period of the combustion cycle corresponding to 180° CA is, however, affected by external factors other than deterioration of combustion due to misfire, such as reactive movement of the engine during travel on a rough road or the input of load on the engine by an air conditioner etc., and such factors cause error of the average angular acceleration as a result. Accordingly, as measures against the error, the misfire detection is carried out based on three parameters, namely, the absolute value of average angular acceleration, and deviations of the absolute value from the average angular accelerations of preceding and succeeding combustion cycles.
Despite the measures, the conventional misfire detection device is still unable to provide satisfactory accuracy in misfire detection. For example, at the cold start of the engine, catalyst W/U (warming up) control is performed in which activation of the catalyst is accelerated by retarding the ignition timing and making the air-fuel mixture lean. In such an operating state, the engine speed varies greatly due to poor combustion, and also the average angular acceleration of each cycle is strongly influenced by the immediately preceding cycle. With the above misfire detection technique, therefore, it is difficult to discriminate between normal combustion and misfire, and thus accurate misfire detection cannot be expected.
Also, where the catalyst W/U control is performed on the engine using a heavy fuel, which is a fuel with very low volatility intended for use in high-temperature districts, the air-fuel ratio shifts toward the lean side as the amount of fuel adhering to the intake ports increases, deteriorating the combustion. To cope with such heavy fuel, therefore, during the catalyst W/U control, combustion control is carried out in which the fuel injection quantity and the ignition timing are corrected by using the average angular acceleration as an index of combustion, to thereby stabilize the combustion. However, if the calculated average angular acceleration itself contains error as mentioned above, then it is not possible to carry out appropriate correction matching the combustion deterioration level, causing inconveniences such as delay in activation of the catalyst or deterioration in exhaust gas characteristics.
In view of the foregoing, there has been proposed a misfire detection device which is adapted to detect misfire based on an amount of rotation variation during the combustion cycle of each cylinder, as disclosed in Unexamined Japanese Patent Publication No. 2000-205035, for example. In this misfire detection device, the amount of rotation variation during the combustion cycle of each cylinder is calculated based on the time period required for every 30° CA, and if the deviation of a currently calculated rotation variation amount from the rotation variation amount calculated three ignitions (360° CA) before is greater than a misfire criterion value, it is judged that misfire has occurred.
However, in the misfire detection device disclosed in FIGS. 3 and 4 of Unexamined Japanese Patent Publication No. 2000-205035, misfire of a current combustion cycle is determined with the use of the rotation variation amount of the combustion cycle which is three ignitions before the current cycle. Accordingly, the determination result not only reflects the current combustion but is influenced by the combustion three ignitions before.
Specifically, when the current combustion is slightly poor but not to such an extent that misfire is caused, it may possibly be judged that misfire has occurred, if the combustion three ignitions before was very satisfactory and thus the deviation between the rotation variation amounts is greater than the misfire criterion value. Conversely, even when the current combustion is so poor that misfire is caused, it may possibly be judged that no misfire has occurred, if the combustion three ignitions before was poor but not to such an extent that misfire is caused and thus the deviation between the rotation variation amounts is smaller than the misfire criterion value. Consequently, in such situations, the OBD fails to notify the driver of the occurrence of misfire. Also, where the combustion control, as measures to cope with heavy fuel, is performed during the catalyst W/U control, a problem arises in that the fuel injection quantity and the ignition timing fail to be appropriately corrected.

Mitsubishi Jidosha Kogyo Kabushiki Kaisha