The present invention provides vaccine and pharmaceutical compositions for treating or preventing bacterial inventions. The vaccine compositions of the invention include a carbapenemase such as a serine carbapenemase, a metallo-β-lactamase or an immunogenic fragment thereof. The pharmaceutical compositions include an anti-carbapenemase antibody or fragment thereof. Also provided are methods for treating and preventing a bacterial infection using the vaccine and pharmaceutical compositions of the invention. The invention further provides antibody conjugates that include an antibody or fragment thereof conjugated to a siderophore or an analog thereof.

The present invention relates generally to compositions and methods for treating or preventing bacterial infections, and more specifically to treating or preventing infections caused by extreme drug resistant bacteria expressing a carbapenemase.
In the last decade, multi-drug resistant organisms have become endemic in healthcare systems throughout the world. Of highest priority for new treatment strategies are infections caused by extreme drug resistant (XDR) gram negative bacilli, which are resistant to carbapenems and all other antibiotics except for colistin or tigecycline. For example, infections caused by XDR Klebsiella pneumoniae that express the serine carbapenemase K. pneumonia carbapenemase (KPC) have spread across the United States. Moreover, infections caused by these KPC bacteria are associated with an approximate 50% mortality rate. Like KPC, a recently identified metallo-β-lactamase resistance mechanism termed the New Delhi metallo-β-lactamase (NDM-1), which is spread by transmissible plasmids, has been found globally. For example, NDM-1 bacteria have been found in Asia, Western Europe and the United States. The global health concerns regarding these bacteria are even further exacerbated by the dearth of drugs in the commercial pipeline that may have activity against these organisms.
KPC-expressing K. pneumoniae are increasingly common and cause substantial morbidity and mortality. The initial outbreak of carbapenem-resistant K. pneumoniae expressing the KPC enzyme occurred in North Carolina in 1996. Yigit et al., Antimicrob. Agents Chemother. 45:1151-1161 (2001). Shortly thereafter the organism appeared in New York City, where it has since become endemic in hospitals. Bratu et al., Antimicrob Agents Chemother. 49:3018-3020 (2005); Gootz et al. Antimicrob. Agents Chemother. 53:1998-2004 (2009); Bradford et al., Clin. Infect. Dis. 39:55-60 (2004) and Woodford et al., Antimicrob. Agents Chemother. 48:4793-4799 (2004). For example, in just two months, four hospitals in Brooklyn, N.Y. cultured more than sixty KPC-expressing isolates of K. pneumoniae, which represented a quarter of all the K. pneumoniae isolates encountered. Bratu et al., supra. Subsequently KPC-expressing isolates spread to most states in the United States, as well as through Europe, Asia, and Latin America. Kitchel et al., Antimicrob. Agents Chemother. 53:3365-3370 (2009); Zarkotou et al., Clin. Microbiol. Infect. 17(2):1798-1803 (2011); Cuzon et al., Antimicrob. Agents Chemother. 52:796-797 (2008); Navon-Venezia et al., Antimicrob. Agents Chemother. 53:818-820 (2009); Kitchel et al., Antimicrob. Agents Chemother. 53:4511-4513 (2009); Qi et al., J. Antimicrob. Chemother. 66:307-312 (2011); Villegas et al., Antimicrob. Agents Chemother. 50:2880-2882 (2006); and Deshpande et al., Diagn. Microbiol. Infect. Dis. 56:367-372 (2006). The US Centers for Disease Control reported the molecular typing results of strains they had accumulated from thirty-three US states, as well as Israel and India. Kitchel et al., Antimicrob. Agents Chemother. 53:3365-3370 (2009). A single strain type, ST 258, accounted for 70% of these isolates.
The most common sites of infection caused by KPC-expressing bacteria include the lung, the blood, and the abdomen, although other sites may be involved as well (e.g., urine and wounds). Gasink et al., Infect. Control Hosp. Epidemiol. 30:1180-1185 (2009). By multivariate analysis, risk factors for acquisition of KPC-expressing K. pneumoniae, compared to carbapenem-susceptible bacteria, included severe illness (odds ratio [OR] 4), prior fluoroquinolone use (OR 3), and prior extended-spectrum cephalosporin use (OR 3). Gasink et al., supra; and Schwaber et al. Antimicrob. Agents Chemother. 52:1028-1033 (2008). In another study, infection caused by KPC-expressing K. pneumoniae was independently associated with receipt of mechanical ventilation, longer length of stay before infection, and exposure to cephalosporins and carbapenems. Patel et al., Infect. Control Hosp. Epidemiol. 29:1099-1106 (2008).
In multiple studies, infection caused by KPC-producing K. pneumoniae was independently associated with in-hospital mortality. In several case control studies, absolute in hospital mortality rates of patients infected with KPC-expressing K. pneumoniae ranged from 32 to 44% versus 9 to 13% mortality rates for infections caused by carbapenem-susceptible K. pneumoniae. Gasink et al., supra; Schwaber et al., supra; and Patel et al., supra. In a case series from New York, the in hospital mortality of patients bacteremic with KPC-expressing K. pneumoniae was ˜50%. Bratu et al., supra; Zarkotou et al., supra; and Patel et al., supra. The mortality was even worse (61%) in patients infected with KPC-expressing K. pneumoniae who received initially ineffective therapy. Zarkotou et al., supra. In another case series, the mortality rate of patients infected by KPC-expressing K. pneumoniae was 59% among patients in the intensive care unit and 38% among non-ICU patients. Souli et al. Clin. Infect. Dis. 50:364-73 (2010).
Even worse outcomes are seen with truly pan-drug resistant strains. For example, in a case control study of patients with colistin susceptible vs. colistin resistant KPC expressing K. pneumoniae, the mortality rate of patients with colistin-susceptible strains was 54%. Zarkotou et al., supra. By comparison, the mortality rate of patients with colistin-resistant strains was an alarming 75%. These unacceptably high mortality rates, and the rising incidence of KPC-expressing strains and pan-resistance among those strains, underscore the need for new therapeutic strategies to deal with these infections.
NDM-1-expressing gram negative bacteria are also spreading rapidly and globally. The initial description of NDM-1 occurred in a Swedish patient of Indian descent who acquired a urinary tract infection (UTI) during a trip to New Delhi. Yong et al., Antimicrob. Agents Chemother. 53:5046-5054 (2009). The follow up case series described isolates of both E. coli and K. pneumoniae expressing NDM-1 found throughout India. Kumarasamy et al., Lancet Infect. Dis. 10:597-602 (2010). Numerous patients brought their infections back to Europe. The strains were all resistant to all antibiotics except tigecycline and colistin, and up to 10% of the strains were resistant to both of these antibiotics and were pan-drug resistant (PDR) strains. Since then bacteria from numerous other genera, including Enterobacter, Acinetobacter, Shigella, Vibrio, Aeromonas, and Pseudomonas, have been described to express NDM-1. Moreover, these organisms have been found throughout China, Japan, Europe, Africa, Canada, Australia, and in the United States. Moellering et al., N. Engl. J. Med. 363:2377-2379 (2010); Castanheira et al., Antimicrob. Agents Chemother. 55:1274-8 (2011); Poirel et al., Antimicrob. Agents Chemother. 54:4914-4916 (2010); Poirel et al., Antimicrob. Agents Chemother. 55:934-936 (2011); Struelens et al., Euro. Surveill. 15(46): pii: 19716 (2010); Bonomo, Clin. Infect. Dis. 52:485-487 (2011); Tijet et al., Emerg. Infect. Dis. 17:306-307 (2011); Chen et al., J. Antimicrob. Chemother. 66:1255-1259 (2011); and Yamamoto et al., J. Infect. Chemother. 17:435-439 (2011). NDM-1-expressing gram negative bacilli have also been cultured from foreign nationals cared for in forward deployed military medical units, creating potential for their transfer to US military personnel. Ake et al., Infect. Control Hosp. Epidemiol. 32:545-552 (2011); and Sutter et al., Infect. Control Hosp. Epidemiol. 32:854-60 (2011).
In addition to spreading into multiple genera, individual E. coli strains expressing NDM-1 have been found to be of multiple strain types, underscoring the ecological diversity of the resistance mechanism. Mushtaq et al., J. Antimicrob. Chemother. 66:2002-2005 (2011). Unfortunately, diverse genera expressing NDM-1 have been found widely distributed in environmental sources throughout India, underscoring the ability of the organism to spread in communities outside of a healthcare setting. Walsh et al., Lancet Infect. Dis. 11:355-362 (2011); and Peirano et al., Emerg. Infect. Dis. 17:242-244 (2011). NDM-1 will likely continue to spread both in communities and in healthcare settings in the United States, and throughout the world.
Thus, new ways to prevent or treat infections caused by XDR gram negative bacilli are needed. This invention satisfies this need and provides related advantages.

Compositions and methods for immunization against bacteria expressing a carbapenemase

LOS ANGELES BIOMEDICAL RESEARCH INSTITUTE AT HARBOR-UCLA MEDICAL CENTER


In a thermal overload protection system three system variables are sensed and provide the inputs required for a calculation conducted in real time at one second intervals. The system variables include ambient inlet air temperature to the alternator, alternator stator winding embedded sensor temperature, and traction motor armature current. A traction motor current limit is calculated using the inlet air temperature and the sensor temperature. The thermal overload is then controlled in response to the traction motor current.

The present invention relates to thermal overloads and, more specifically, to thermal overload protection for locomotive traction alternators.
It is well known in the art to provide overload protection for rotating electrical machinery. Existing methodology employed relies on the use of stator winding temperature sensors to provide a signal for either alarm, load reduction, or "trip" of the alternator, if temperatures beyond a given limit are encountered. This would usually be the result of some type of electrical overload. The protective action function would be carried out by either reducing the load manually or tripping the alternator circuit breaker.
Overload protection for rotating electrical machinery is intended to provide a means of preventing excessive overheating of the electrical winding insulation system. The protection used has been similar for most types of rotating electrical machines and the devices employed typically fall into one of several categories. For example, the device employed may be a time-delay overcurrent device or relay, a thermal relay or device operated by machine electrical current, a temperature relay or device operated by an embedded winding temperature sensor or thermostat, or a combination of these devices.
The protection option chosen is usually to provide an alarm to an operator, to disconnect or trip the alternator from its load, or to permit short overload excursions compatible with the inverse-time overload limit curve of the machine. The use of embedded winding sensors is currently the preferred method for thermal protection. Most large machines usually employ Resistance Temperature Detectors (RTD's) embedded in the stator windings for the purpose of directly sensing stator winding temperatures.
Unfortunately, locomotive traction alternators have not typically been protected against damaging thermal overloads due to the philosophy that permissible traction motor short-time rating limits will prevent alternator temperatures from reaching excessive levels. It is seen then that there exists a need for a thermal protection control which provides a smooth and gradual reduction in the alternator electrical load.

Thermal protection for locomotive main traction alternators


An electronic device includes a DC/DC converter supplied with an external power supply, and an electronic circuit having a power supply input to which an output of the DC/DC converter is supplied. A converted voltage that is the output of the DC/DC converter is lower than a center value of a recommended operating condition for a voltage of the power supply input of the electronic circuit.

1. Field of the Invention
This invention generally relates to an electronic device, a method for controlling the same, and an optical semiconductor device. More particularly, the present invention relates to an electronic device equipped with a DC/DC converter, a method for controlling such an electronic device, and an optical semiconductor module.
2. Description of the Related Art
Electronic devices having electronic circuits are used in various fields. Electronic circuits built in the electronic devices are supplied as semiconductor devices such as integrated circuits. The electronic devices are supplied with a power supply voltage that falls within a defined range prescribed as a recommended operating condition. The recommended operating condition is an operating condition guaranteed by the supplier of the electronic circuits. The electronic circuits incorporated into the electronic devices are supplied with the power supply voltages within the range of the recommended operating condition.
A conventional electronic device will now be described. FIG. 1 is a block diagram of an electronic device 60a equipped with an electronic circuit 50. The electronic device 60a may include multiple electronic circuits 50. Here, it is assumed that the electronic device 60a has one electronic circuit 50. The recommended operating condition for a power supply input to the electronic circuit 50 is assumed as Vc(1±α) where Vc is the center value of the recommended operating condition for the voltage of the power supply input to the electronic circuit 50, while the lower limit Vmin of the recommended operating condition is equal to Vc(1−α) and the upper limit Vmax thereof is equal to Vc(1+α). When the electronic circuit 50 is supplied with Vc, Vmin or Vmax, the electronic circuit 50 consumes current Ic, Imin=Ic(1−β) or Imax=Ic(1+β), respectively. The power supply inputs of the electronic circuit 50 are directly connected to an external power supply outside of the electronic device 60a and ground. Generally, the power supply voltage Vc is applied to the electronic circuit 50.
FIG. 2 is a block diagram for explaining the voltage of an external power supply generally used. As shown in the left-side portion of FIG. 2, the recommended operating condition for the power supply input voltage of the electronic circuit 50 ranges from Vmin to Vmax at the center of V1. When a variation (assumed as Vs) in the power supply voltage is considered, the usable range as the power supply input to the electronic circuit 50 is V2 that ranges from Vmin+Vs to Vmax−Vs. When it is further considered that there is a voltage drop Vd that develops in a connector and a substrate line in the circuit from the external power supply to the electronic circuit 50, the voltage supplied from the external power supply falls within a range V3 of Vmin+Vs+Vd to Vmax−Vs+Vd. When variations in the power supply voltage are considered as mentioned above, the voltage of the external power supply is used in the vicinity of Vc. If the circuit is greatly affected by the voltage drop, the voltage of the external power supply is used in the vicinity of Vc+Vd.
When it is assumed that Vc is supplied from the external power supply for the electronic device 60a without considering the influence of the voltage drop, the voltage of the power supply input to the electronic circuit 50 is Vc, and power P of the electronic device 60a (that is, the electronic circuit 50) is expressed as follows:P=Vc×Ic  (1)where Ic is current consumed in the electronic circuit 50 as has been defined previously.
In the electronic device 60a, Vmax is the allowable maximum voltage of the external power supply as long as the recommended operating condition of the power supply input to the electronic circuit 50 is satisfied. When Vmax is supplied from the external power supply, the maximum power Pmax of the electronic circuit 50 is expressed as follows:Pmax=Vc(1+α)×Ic(1+β)  (2)As described above, when the voltage of the external power supply varies, the power of the electronic device 60a is changed.
Japanese Patent Application Publication No. 2005-245152 discloses a DC/DC converter.
The electronic devices are required to reduce power consumed in the internal electronic circuits.

Electronic device, method for controlling the same, and optical semiconductor module


A method of characterizing an aerosol, the method comprising illuminating aerosol particles located within a measurement volume with a first electromagnetic radiation pulse emitted from a first source and receiving one or more electromagnetic radiation returns that have been scattered by the aerosol particles illuminated by the first electromagnetic radiation pulse at one or more sensors, illuminating the aerosol particles within the measurement volume with a second electromagnetic radiation pulse emitted from a second source and receiving a one or more electromagnetic radiation returns scattered by the aerosol particles illuminated by the second electromagnetic radiation pulse at the one or more sensors, determine at least one of intensity based on the one or more electromagnetic radiation returns, and determine an aerosol parameter based on an algorithm and the at least one intensity.

This disclosure relates generally to the characterization of aerosols and aerosol particles. More particularly, this disclosure relates to the use of scattered electromagnetic radiation to characterize aerosols and aerosol particles.
Vision systems, such as those for aircraft, require testing in relevant environmental and meteorological conditions capable of affecting visibility conditions. Due to the transient nature of many aerosols, testing the impact of various aerosols, such as fog, ash, or smoke, on visibility conditions is conventionally performed by simulating those conditions in a chamber. However, in order for the simulated conditions to be relevant for testing vision systems, simulated conditions must reflect real-world visibility conditions and, thus, real-world aerosol conditions. For simulations conducted in test chambers, it is further important for the aerosol conditions to be consistent throughout the chamber and to understand variations in aerosol conditions at various positions within the chamber. Specialized equipment exists for measuring characterizing aerosols in test conditions, but this equipment is generally expensive to construct, purchase, and operate.
Aircraft also have a need to characterize aerosols while in flight. Aerosol characterization can aid in, for example, cloud detection and systems to alert pilots to potential icing hazards. Likewise, aerosol characterization can aid in detection of other hazards, such as ash clouds.


A regulating valve comprising a housing having a cylindrical valve chamber, the valve chamber being provided with at least one inlet and at least two outlets, the inlet and the outlets being at least partially closeable as needed by a common valve body arranged in the valve chamber and rotatable around an axis, the valve body being operable by an actuator, the inlet and/or at least one of the outlets being surrounded by a sealing device on the side of the housing facing the valve body and the sealing device being able to be brought into sealing engagement with the valve body under elastic preload. The valve body is designed having the shape of the segment of a cylinder and is bounded on the peripheral side by two boundary surfaces which each have an edge on the side facing the housing, the edge overtravelling the inlet during its opening being designed as an efflux edge and having an elliptically shaped recess extending in axial direction. Configured in the valve body is a duct-shaped opening which extends between the boundary surfaces and penetrates them.

The invention relates to a regulating valve of the type comprising a housing with a cylindrical valve chamber that has at least one inlet and at least two outlets. The inlet and the outlets of this type of valve can be at least partially closed as needed by a common valve body arranged in the valve chamber and rotatable around an axis. The valve body is designed as a rotary valve and is operable by an actuator. The inlet and/or at least one of the outlets is surrounded by a seal which can be brought into sealing engagement with the valve body under elastic preload.
Such a regulating valve is known from German Patent Application 26 32 476. The regulating valve in that patent application is designed as a valve for controlling flow and is used in a mixing faucet for mixing cold and hot water. Both the inlets and the outlets are arranged diametrically opposite one another, respectively, the inlets and the outlets being arranged at right angles to one other.
In that device, the actuating forces required to move the valve body to open the inlets, through the strong acceleration of the flow at the efflux edge of the valve body, are considerable, since the suction effects arising upon opening act upon the valve body in a manner that cause it to want to close. To overcome the suction forces, the actuator for that device should be designed to be correspondingly strong, which is a disadvantage economically and with regard to the compact dimensions of the valve.


Techniques for concurrent transmission of audio and ultrasound are described. In an example, a computing device generates, in a digital domain, mixed audio data from multiple sets of audio data, each set corresponding to a different audio channel. The computing device also generates, in the digital domain, ultrasound data, and generates serial data by providing the mixed audio data and the ultrasound data as different inputs to an I2S mixing module. In an analog domain, the computing device generates an output signal based at least in part on the serial data, and sends the output signal to a speaker.

A computing device can support multiple functionalities via one or more user interfaces. A voice user interface (VUI) can receive speech input for an operation, play a response to the speech input, and play an output of executing the operation. For instance, the speech input may corresponds to a request to play audio and the execution of the operation may result in streaming the audio from an audio source. Supporting different functionalities can necessitate specific hardware and software configurations of the computing device and specific power management of a power source of the computing device.

Concurrent transmission of audio and ultrasound


In the preferred embodiment, a thick regular-k dielectric is formed on a substrate. A tungsten plug is formed in the thick regular-k dielectric. The thick regular-k dielectric is recessed and a thin low-k dielectric is formed on the thick regular-k dielectric. The thin low-k dielectric acts as a glue layer and as an etch stop layer. A thick low-k dielectric is formed on the thin low-k material. Optionally, an opening is formed through the thick low-k dielectric to expose the tungsten plug. The opening is then filled with copper or copper alloys.

As integrated circuit scaling proceeds into the deep sub-micron regime, the number of transistors on high performance, high density ICs is in the tens of millions, in accordance with the historical trend of Moore's Law. This has necessitated that such ICs feature multiple layers of high-density metal interconnects, and that the layers be separated by inter level dielectrics (ILD), also sometimes known as inter-metal dielectrics (IMD). The parasitic capacitance associated with these metal interconnections has become a major factor that limits the circuit speed of such high performance ICs. A conventional ILD (also known as regular-k dielectric) typically has a dielectric constant (also known as k value) of about 3.8 to about 8.0. However, the relatively high-k value of the regular-k dielectrics results in high parasitic capacitance. Recently, low-k dielectrics such as CVD black diamond (a trademark of Applied Materials), which has a k value of about 3.0, have been widely used by the semiconductor industry to reduce the parasitic capacitance between the metal lines, hence improving circuit performance. The k value of SiO2 (about 3.8 to 4.2) is typically used as the dividing line between a low-k and a regular-k.
However, low-k materials cannot be used as the first level dielectric since their physical and chemical properties are significantly different from the regular-k materials. For example, low-k materials typically have high leakage current, low breakdown voltage, bad adhesion to caps and liners, and low thermal stability, so that using a low-k material close to the devices may degrade performance.
To solve the parasitic capacitance problem, a composite structure consisting of two layers is frequently used. The layer close to the devices is formed of regular-k materials, and the layer away from the devices is formed of low-k materials. This effectively lowers the parasitic capacitance. However, a new problem is introduced. In a metal structure comprising a regular-k dielectric, in which tungsten (including a conductor liner/barrier such as titanium nitride) is typically used as contact plugs and a thick low-k dielectric, the adhesion between the thick regular-k dielectric and the thick low-k dielectric is not stable. This will lead to film delamination and in turn cause low chip yield.

Stable metal structure with tungsten plug

Taiwan Semiconductor Manufacturing Company, Ltd.


In one embodiment, a system includes a hardware processor and logic integrated with and/or executable by the processor or media access control (MAC) functionality of a network port, the logic being adapted to initialize a link between a receiving endpoint and a sending endpoint, the receiving and sending endpoints being connected in a network fabric, wherein at least one virtual link is created within the link, receive an amount of available flow credits from the receiving endpoint, wherein the amount of available flow credits are used to determine a capacity to process packets at the receiving endpoint, and transmit one or more packets to the receiving endpoint until all packets are sent or the amount of available flow credits is insufficient to process additional packets, wherein exchange of flow credits is performed on a per virtual link basis.

The present invention relates to data center management and file systems, and more specifically, this invention relates to using credit-based flow control in lossless Ethernet networks.
Currently available lossless Ethernet networks do not allow for credit-based flow control where how traffic flows are prioritized and handled is determined based on an available amount of credit. Instead, conventional lossless Ethernet networks, and more specifically the switches used therein, when an issue or problem arises and a packet is undeliverable, simply discard the packet, and in some instances, retransmit the discarded packets at a later time. This approach adds additional latency to the network when a packet is undeliverable, and may result in some packets being dropped permanently, even in the lossless Ethernet network.
Ethernet is becoming more and more popular and some conventional switched fabric networks may make use of credit-based flow control, such as InfiniBand and other network protocols; however, these credit-based flow control systems are not applicable nor are they capable of being used in Ethernet networks or to utilize existing Ethernet frame formats and protocols.

Credit-based flow control in lossless ethernet networks

International Business Machines Corporation


A bush assembly is seated in a housing, having an outer sleeve (10), an inner tube (12) and a resilient body (14) connecting the inner tube (12) and the outer sleeve (10). The outer sleeve (10) has projections (20) from its outer surface that abut the inner surface of the housing (40) and cause local deformations on the sleeve around the projections (20). The local deformations around the projections (20) cause the radial gap (16) between the inner tube (12) and the outer sleeve (10) to change circumferentially and thus bush has different radial stiffness in different directions.

1. Field of the Invention
The present invention relates to a bush assembly, to a method of manufacturing such a bush assembly and to a bush for use in such an assembly. It is particularly, but not exclusively, concerned with a bush assembly for use in a sub frame of an automobile.
2. Summary of the Prior Art
One known bush for use in a automobile between the chambers and the sub frame has an outer sleeve and a tube in the sleeve, the sleeve and the tube being interconnected by a resilient body. The sleeve is then mounted in a housing such as a bracket. Then the bracket may be attached to, or embedded in, the sub frame and the tube attached to the chassis, or vice versa. Thus active movement of the sleeve and the tube, and hence the chassis and the relevant part of the sub frame, are resisted by the resilience of the resilient body.
In such a bush assembly, the stiffness of the assembly, and hence its effect on vibrations is determined by the resilient body. However, it is been found desirable to have different radial stiffnesses in different directions.

Avon Vibration Management Systems Limited


A mold 20B for foam molding which allows efficient production of the foam molded product with accurately finished outer surface, and easy release of the molded product from the mold in the foam molding method is formed of an upper mold portion 21B and a lower mold portion 22B. The gas feed means 23 formed of the valve box 25, the valve element 26 and the like is attached to an opening formed in the bottom surface of the lower mold portion 22B. The recess portions 51 are formed in each part of the opposite side surfaces 50a and 50c of the cavity 50. The protruding portions 52 are formed on the lower surface of the upper mold portion 21B so as to be fit to the corresponding recess portion 51. Upon completion of curing, the upper mold portion is separated to open the mold, air is supplied into the valve box 25 such that air is fed to a space between the molded product 31B and the bottom surface of the lower mold portion 22B to push up the molded product 31B so as to be released from the mold. The empty spaces formed by extraction of the protruding portions 52, 52 allow insertion of the tool and finger thereinto to take the molded product 31B from the mold.

For the purpose of molding the rigid polyurethane foam, the urethane raw liquid is supplied to a lower mold portion of a mold including upper and lower mold portions so as to produce the foam by clamping the mold. The mold is then opened to release the molded product after curing.
Generally, the mold for foam molding structured to push up the molded product with an ejector pin provided in the lower mold portion for the mold release has been well known. However, the mark resulting from pushing of the ejector pin is likely to be left on the molded product.
Japanese Unexamined Patent Application Publication No. 9-234748 discloses the efficient mold release method without using the aforementioned ejector pin. Specifically, in the disclosed foam molding method, the film is applied along the cavity surface of the lower mold portion, air is fed between the film and the cavity surface to release the film from the cavity surface upon the mold release after the mold opening, and the molded product is extruded outside the lower mold portion by the film.
FIGS. 6a, 6b and 6c are sectional views each showing the generally employed method and the mold used therein as disclosed in the aforementioned publication. The mold is formed of an upper mold portion 2 and a lower mold portion 3 which may be joined and separated. A cavity 4 is formed in the lower mold portion 3.
A polypropylene film 6 which is preliminarily formed to be either similar or identical to the cavity 4 through vacuum forming process is applied to the lower mold portion 3. The film 6 is held on the upper end surface of the lower mold portion 3 with fixation pins 7 and interposed between packings 9 for film air seal disposed on the upper end surface of the lower mold portion 3 and film holders 8 so as to be strongly fixed onto the lower mold portion 3.
A box-like air chamber 10 is formed below the bottom of the lower mold portion 3, to which one end of an air pipe 12 provided with a pressure regulating valve 11 is connected. The other end of the air pipe 12 is connected to an air introduction/suction unit 13, for example, a vacuum pump. The air chamber 10 is communicated with the cavity 4 of the lower mold portion via a plurality of air communication holes (air holes) 14.
In the case where the rigid polyurethane foam molded product is produced using the mold 1, a predetermined amount of the raw material of the rigid polyurethane foam is introduced to the vacuum molded polypropylene film 6 within the cavity 4, and the mold is clamped by joining the upper mold portion 2 with the lower mold portion 3. After the foaming and expansion as shown in FIG. 6a, the upper mold portion 2 is separated to open the mold, and the air introduction/suction unit 13 is activated as shown in FIG. 6b to feed air to a gap 15 between the film 6 and the cavity 4 via the air pipe 12, the air chamber 10 and the air communication holes 14 to push up a molded product 16 together with the film 6. The molded product 16, thus, may be taken out.
Thereafter, air is sucked by the air introduction/suction unit 13 to bring the film 6 into tight fit with the cavity surface, and the process proceeds to the subsequent molding cycle.
In another method for the efficient mold release without using the ejector pin, the air feed means including the valve box and the valve element disposed therein so as to be movable up and down may be provided in the bottom surface of the lower mold portion. Upon the mold release after opening the mold, air is fed to the air feed means to cause the valve element to protrude into the cavity such that the molded product is extruded outside the lower mold portion.
FIGS. 7a and 7b are sectional views each representing the aforementioned method and the mold used therein. FIGS. 8a and 8b are sectional views each representing the air feed means.
The mold 20 is formed of an upper mold portion 21 and a lower mold portion 22.
The lower mold portion 22 includes a cavity 24, and air feed means 23 is disposed in the bottom surface of the lower mold portion 22. The air feed means 23 includes a valve box 25 attached to an opening of the bottom surface of the lower mold portion 22, a valve element 26 disposed within the valve box 25 so as to be movable up and down, and an air tube 25a having one end connected to the lower end of the valve box 25, and the other end connected to an oxygen tank. The valve element 26 is an inverted tapered mushroom valve having a flat top surface. A flange 26a is provided at the lower end of the valve element 26.
The valve box 25 as a cylindrical vessel has an open top surface and a closed bottom surface. Two upper and lower protrusions 27 and 28 are formed on the inner peripheral surface, which interpose the flange 26a.
Coil springs 30 each serving as an urging member are disposed between the upper protrusions 27 and the flange portion 26a in the urged state. The valve element 26 is urged downward by the coil springs 30. The valve element 26 is closed in the state where the flange portion 26a is pushed against the protrusions 28. At this time, the top surface of the valve element 26 is flush with the bottom surface of the lower mold portion 22. The upper end surface of the valve box 25 is also flush with the bottom surface of the lower mold portion 22. The air tube 25a is attached to the lower portion of the valve box 25.
The molding process to produce the molded product using the mold 20 will be described hereinafter.
In the state where the valve element 26 is closed as shown in FIG. 8a, a mold release agent is applied to the inner surface of the mold 20. Then the raw liquid, for example, urethane and the like is supplied into the lower mold portion 22, and the mold is clamped by moving the upper mold portion to produce the foam as shown in FIG. 7a. Upon completion of curing, the upper mold portion is separated to open the mold as shown in FIG. 7b to allow air to be fed into the valve box 25 such that a molded product 31 is pushed up by the air pressure to be released from the mold.
When air is fed into the valve box 25 through the air tube 25a, the valve element 26 is pushed up by the air pressure against the urging force of the coil springs 30 as shown in FIG. 8b. Air is fed into the space between the bottom surface of the lower mold portion 22 and the molded product 31 from the valve box 25 to push up the molded product 31 to be released from the lower mold portion 22.
When the air feed to the valve box 25 is stopped after the mold release, the valve element 26 is pushed down under the urging force of the coil springs 30 to return to the original state as shown in FIG. 8a. The molding process proceeds to the next cycle.
In the method for releasing the molded product from the cavity of the lower mold portion by the air pressure, if the molded product 31 has a large thickness as shown in FIGS. 7a and 7b, the molded product 31 is pushed up sufficiently by the air pressure. The resultant floating height L of the molded product floating from the upper surface of the lower mold portion 22 is sufficiently large. The operator is allowed to grip the portion of the molded product 31 floating from the lower mold portion 22 so as to easily take the molded product 31 from the lower mold portion 22.
Referring to FIGS. 9a and 9b, if the depth of the cavity 24A formed in the lower mold portion 22A of the mold 20A is substantially small, and accordingly, the molded product 31A has a small thickness, the air pressure is likely to leak from the lower side of the molded product 31A. Accordingly, the resultant floating height L of the molded product 31A is likely to become small. The operator has difficulty in gripping the floating portion of the molded product 31A to be released from the mold.

Mold for foam molding and foam molding method


A mobile satellite communication terminal capable of performing satellite communication both indoors and outdoors. In an indoor mode, the mobile satellite communication terminal includes an indoor terminal for carrying out transmission or reception of a signal through a ground radio link and a repeater terminal installed in such a location that the repeater terminal can get an unobstructed view of a satellite for carrying out transmission or reception of a signal through a satellite communication link. In an outdoor mode, an antenna of the indoor unit is replaced by an antenna for the satellite communication link, whereby the indoor terminal can be used as an outdoor terminal.

The present invention relates to mobile satellite communication terminals for use in a mobile satellite communications system and more particularly, to a mobile satellite communication terminal which can be used not only outdoors but also indoors.
A prior art mobile satellite communication terminal will be explained referring to FIG. 1 showing a diagram for explaining a schematic arrangement of the mobile satellite communications system. The system includes a central earth station 1, a plurality of mobile satellite communication terminals 40-1, 40-2 and 40-3 (which will be sometimes referred to merely as "terminals", hereinafter), and a satellite 2.
More in detail, the terminals 40-1 to 40-3 comprise mobile satellite communication terminals all having the same arrangements and easily portable.
In the illustrated example, one 40-1, e.g., of these terminals 40-1 to 40-3, which is used outdoors, is connected to the central earth station 1 through the satellite 2. In this case, even when moved in between mountains or buildings, the terminal 40-1 can communicate with the central earth station 1 so long as the terminal 40-1 is located within such a range that the terminal can get an unobstructed view of the satellite 2.
In the illustrated example, the terminal 40-2 is installed within such a structure as a building. In this case, when the terminal 40-2 is mounted, e.g., at such a location as in the vicinity of a window 21 that the terminal can get an unobstructed view of the satellite inside of the structure, the terminal can communicate with the central earth station 1 because the attenuation of electromagnetic wave signal caused by the structure is as small as negligible.
Meanwhile, since the terminal 40-3 is positioned at such a location away from the window 21 inside the structure, the terminal cannot get a unbroken view of the satellite 2, the terminal 40-3 cannot transmit send/receive signals with respect to the satellite for the satellite communication.
For the purpose of enabling the terminal 40-3 to attain its communication with the central earth station 1, it is required for the terminal 40-1 to be moved to such a location as in the vicinity of the window that the terminal can receive electromagnetic waves from the satellite as in the case of the terminal 40-2.
As mentioned above, in the prior art mobile satellite communications system, when there is an obstruction which blocks a spatial communication channel or link between the mobile satellite communication terminal and satellite, the communication therebetween becomes impossible. In particular, inside of such a structure as a building, such communication can be established only at such a limited location as in the vicinity of a window.
Thus, even when the mobile satellite communication terminal is of a mobile type, there is a problem that it is impossible to use the terminal with a high flexibility.
An example of the aforementioned mobile satellite communications system is disclosed in a literature, PTC's 93 Proceedings, pp. 835-840, entitled "INMARSAT-M PORTABLE MES."


A portable gymnastic device comprising a suspension means having two opposed and complementary rigid hooks, which are pivotally connected together and to a U-shaped frame by a pin. Hooked upper ends of the hooks are engaged over a horizontal cross member of the doorframe or a horizontal bar. The hooks are normally biased to a closed position permanently by the spring. A rope is connected with the U-shaped frame by a knot, which is placed on a top end of the rope. A handle is connected with a bottom end of the rope by suitable means such as a cam within the handle. On the bottom end of the rope several handles may be set on different levels to accommodate different height users and different exercises.

1. Field of the Invention
The present invention generally relates to training and exercise devices, and, more specifically, to a portable gymnastic exercise device that can be quickly and easily set up on and then removed from any door casing or frame or other support structure or member.
2. Description of the Prior Art
The use of pincer mechanisms for suspending different items from an overhead member, such as a casing or frame of a doorway within a wall, is well known. Pincers are generally devices that utilize complementary hooks that are pivoted to each other to urge inwardly-directed hooks or Jaws towards each other in response to a downward force acting on the pincer, as exemplified in U.S. Pat. No. 4,258,895.
Pincer type mechanisms have also been utilized to suspend numerous other items such as swings for infants or children, as disclosed in U.S. Pat. Nos. 1,956,502 and 3,314,636. While most pincer mechanisms close to apply pressure to the supporting member as a result of a downwardly acting force some pincer mechanisms use some form of biasing means, such as a tension spring, to tend to close or bring the opposing hooks together even in the absence of a downwardly acting force on the device. The aforementioned U.S. Pat. No. 3,314,636 teaches the use of such a tension spring. A similar pincer mechanism is disclosed in U.S. Pat. No. 3,441,147 for hanging garments on a rod that is suspended by using a pair of spaced or opposing pincer devices.
U.S. Pat. No. 7,381,173 discloses a training apparatus that uses a pair of opposing brackets that function as hooks, although the disclosed attaching mechanism does not include pincers. The brackets are used to support a horizontal member to which an exercise device, such as a handle loop, is attached. A cleatlock is used to adjust the height of the handle loops. However, the training apparatus includes a number of parts that must be manually adjusted to secure it to a doorframe. Besides the inconvenience of attaching and disconnecting the device from the supporting structure, improper adjustments can result in failure by inadvertent disconnection of the brackets from the supporting frame and potential injury to the user.
Numerous training devices use pincer-type clamping elements, each including a pair of hooks pivoted to each other that can be engaged over a casing by hooked upper ends, are well known. As indicated, such pincer devices frequently use springs or the like to urge the hooks to come together to a closed condition so that the pincers securely engage and remain attached to an upper frame or support member, including a horizontal bar.
An early portable gymnastic apparatus is disclosed in U.S. Pat. No. 1,126,857 in which a hook is attachable to a casing of a doorframe, the hooks supporting a training bar and/or a pair of spaced handgrips. The device, however, includes numerous parts and needs significant manual adjustments to properly secure the device to a support member, such as a doorframe. Since only one hook is used adjustments and setup is more critical and subject to failure.
In U.S. Pat. No. 3,716,232 an exercise apparatus for attachment to an overhead frame is disclosed. While the pincer mechanisms are used the pincers support a rod. Also, since no biasing members are provided setup and adjustment must be performed manually by means of set screws. The setup, therefore, may be inconvenient and time-consuming. Because bars are utilize, the overall structure is bulky and heavy and not readily transported from one location to another. A similar clamping apparatus is disclosed in U.S. Pat. No. 2,206,328 intended to be used for exercise bars, swings or the like in the doorway. As in the aforementioned device, the pincers must be manually adjusted, leaving room for human error and failure.
An elaborate construction is used for an exercise device disclosed in U.S. Pat. No. 1,430,573 in which the hooks are pressed against the supporting frame by means of a yoke and screw mechanism to support a rod. The device is bulky and heavy and not readily transportable. A similar clamping device is disclosed in U.S. Pat. No. 3,526,399 for supporting a rotatably mounted exercising device with support frames.
In U.S. Pat. No. 5,429,571 a personal trainer is disclosed that utilizes a pincer mechanism for engaging the doorframe and a resistance unit is provided intended to be gripped by a user by means of a horizontal bar or handle. The resistance unit provides resistance as the handle is moved upwardly and downwardly on a belt while the user tensions the device by stepping on a stirrup close to the ground. The device is intended to be primarily used while the person exercising stands erect, although the patent also teaches a way for the user to exercise the stomach muscles while in a kneeling position.
The known exercise devices tend to be large, bulky and heavy and are typically complicated in construction and expensive to manufacture and purchase. They are not readily transportable and can be effectively used only by a very limited segment of the population who are heavily into exercise. The average person needs a device that can be easily transported and used even by those that have limited physical strength or who are physically challenged.


A method, computer program, and computer system are provided for image segmentation. Image data, such as biological image data, is received. One or more objects associated with the received image data is detected. One or more regions of interest are determined within the receive image data corresponding to one or more segments based on the detected objects.

Instance segmentation of biological images can be divided into two types: box-free instance segmentation and box-based instance segmentation. Box-free instance segmentation methods segment the object instances by analyzing the instance morphology properties (e.g., object contours, textures, and shapes) without the aid of object bounding boxes. Box-free instance segmentation methods usually suffer from separating the touching objects.

System and method for instance segmentation in pathological images using object-guided framework


The present invention provides method and apparatus for surface treatment which, when employed in process steps of manufacturing semiconductor devices, can result in the final products having enhanced reliability. According to the surface processing method, an object to be processed W is introduced in a processing vessel 10, which is then supplied with ClF3 gas serving as cleaning gas from a supply unit 26. The ClF3 gas is bound to the surface of the object to be processed W, and although the supply of the gas to the processing vessel is interrupted, the ClF3 gas bound to the surface of the object to be processed W serves to clean the surface of the object to be processed. Next, reducing gas is introduced into the processing vessel W to remove chlorine from the object to be processed W, the chlorine being derived from the ClF3 gas. After that, the introduction of the reducing gas is interrupted, and the cleaned object to be processed W is exported from the processing vessel 10. In addition to that, a surface processing apparatus 1 and other processing devices are arranged in a cluster device so that an object to be processed therein is transported among them from one to another under a vacuum environment.

In general, in fabricating semiconductor integrated circuits (semiconductor devices), substrates such as semiconductor wafers as object to be processed under treatment repetitively undergo predetermined procedures of film formation and pattern etching to build a number of desired devices.
During a variety of process steps applied to a object to be processed (substrate), the object, such as semiconductor wafer (hereinafter referred to as "wafer(s)"), had to be transported among processing units from one to another, and the wafers were unavoidably exposed to the atmospheric air during transport. Certain portions of wafer surfaces exposed to the atmospheric air (e.g., exposed portions of silicon substrates at the bottoms of contact-holes, or exposed portions of metal layers at the bottoms of through-holes) often got into reaction with oxygen and moisture in the air, and made native oxide films. There was also the possibility of producing chemical oxides on exposed surfaces due to reactions of such exposed portions with chemicals during wet cleaning (e.g., RCA cleaning). Additionally, there was another possibility that wafer surfaces were contaminated with substances such as metals during the transport of the wafers among the processing steps and among processing units.
Such oxides including native oxide films and chemical oxides (referred to as "native oxides" hereinafter) and metal contaminants degrade semiconductor properties such as electric properties, and thus, it has been usual to perform surface treatment to the wafer surfaces to remove the oxides and metal contaminants from them and clean them.
A typical technique conventionally employed as surface treatment to remove native oxide films and other undesired substances was wet cleaning (e.g. RCA cleaning) which immersed wafers in a liquid chemical such as HF solution to remove native oxide films and others. However, along with progressively increased density of integration and miniaturization of semiconductor devices, their dimensions including line widths and diameters of contact-holes are getting more and more miniaturized, which results in, for example, increasing aspect ratios of contact-holes and reducing their diameters to an extent around 0.2 to 0.3 μm or even smaller (e.g., 0.12 μm). Miniaturization to that extent caused the problems that liquid chemicals failed to sufficiently impregnate minute contact-holes, or on the contrary, liquid chemicals in the contact-holes could not go out therefrom due to their surface tensions. These problems sometimes led to the fatal disadvantage that native oxide films developed at the bottoms of the contact-holes could not be sufficiently removed.
In treating a multi-layered structure through the wet cleaning, since its respective layers exposed along walls of contact-holes made therethrough were different in etching rate, it caused further problems, such as irregularities in level of the wall surfaces of the contact-holes.
FIGS. 8A and 8B of attached drawings illustrate a contact-hole 202 for making electrical contact to a drain and a source formed on a surface of a wafer W of silicon (Si), for example. Hole diameter D shown in FIG. 8A is in the range from 0.2 to 0.3 μm, approximately. Multi-layered wall surfaces of the hole 202 are defined by silicon oxide films (SiO2) of three layers, for example, which are stacked in different film formation steps. For example, the first SiO2 film 204 is formed by thermal oxidization on the surface of the wafer W, the second SiO2 film 206 is made of phosphor-doped glass by spin coating, and the third SiO2 film 208 is made of silica glass. In addition to that, as shown in FIG. 8A, a native oxide film 210 is produced at the bottom of the contact-hole 202.
In such a three-layer-stacked layer, the SiO2 films 204, 206 and 208 are different in etching rate relative to a liquid chemical during wet cleaning. After the native oxide film 210 is removed by the wet cleaning, as shown in FIG. 8B, irregularities 209 are produced due to differences in etching rate, or border areas between adjacent layers where the liquid chemical can seep more easily are excessively eroded (see notches in the drawing). This is also a problem involved in the conventional wet-cleaning technique.
To overcome the above-mentioned disadvantages in the existing wet-cleaning technique, various alternative methods called dry-cleaning techniques (etching techniques) have been proposed as a replacement for wet-cleaning techniques relying on liquid chemicals, which used an etching gas to remove native oxide films (see, for example, Japanese Patent Laid-Open Publication No. hei 4-206526 and Japanese Patent Laid-Open Publication No. hei 6-196455).
Typically used is sputter etching with argon gas and H2 gas a method of removing native oxide films by dry cleaning.
In a method for burying through holes of semiconductor wafers with a metal as disclosed in Japanese Patent Laid-Open Publication No. hei 4-206526 referred to above, native oxide films or others are removed by pre-treating base metals partially exposed in a preliminary processing chamber, especially treating oxidized films overlying the metal films by supplying and heating ClF3 gas. Then that method transports the pre-treated wafers from the preliminary processing chamber to a film deposition chamber by a transport means without exposing them to the atmospheric air to conduct selective CVD of metals.
In the method of processing the wafers as disclosed in the above-identified Japanese Patent Laid-Open Publication No. hei 6-196455, wafers are placed in an atmosphere of a mixed gas of ClF3 and H2, and ultraviolet rays are irradiated to the mixed gas to thereby remove native oxide films produced on the wafers without heating the wafers.
However, the prior art sputter etching techniques relying on argon gas and hydrogen gas had the possibility of damaging contacts in the wafers, and there was the demand for a dry-cleaning technique using a low energy.
Additionally, the known cleaning technique using ClF3 gas involved the following problems:
That is, there was the problem that chlorine, derived from the ClF3 gas used for the cleaning, corroded metal films and others on wafers, and the resultant products of the semiconductor devices were degraded in yield and reliability. Since ClF3 gas is a chlorine-contained gas, after wafer surfaces were cleaned by using ClF3 gas, chlorine remained on the wafers in form of chlorine atoms combined with silicon or metals existing on wafer surfaces, for example, and the residual chlorine corrode metal films and others (as wirings of semiconductor devices, for example) formed on the wafers. Therefore, it invited deterioration of electrical properties of semiconductor, and degraded the reliability and yield of semiconductor devices as finished products.
Furthermore, there was the problem that reaction by the ClF3 gas excessively progressed, inviting damages to wafers and degradation of the yield and reliability of semiconductor devices as finished products. More specifically, after wafer surfaces were cleaned by using ClF3 gas, not only native oxides but also insulating films of SiO2 and metal films of Al intentionally formed on the wafers were undesirably etched by reaction with the ClF3 gas. When insulating films serving as interlayer insulating films in semiconductor devices and metal films serving as wiring in semiconductor devices are excessively etched, the resultant semiconductor devices degrade in electrical properties, and this inevitably results in decreasing the reliability and yield of semiconductor devices as final products.
The present invention is directed to overcoming the above-mentioned problems involved in the conventional cleaning technique for object surfaces to be processed, and it is an object of the present invention to provide a surface processing method and an apparatus therefor, which can improve the reliability of final products when used in process steps of manufacturing semiconductor devices.

Method and apparatus for surface treatment


Disclosed is a sprinter training aid which pulls the sprinter forward in an over speed condition, for the purpose of exercise the muscles which pull the leg forward when running, such the hip flexor muscles. Two devices can be used, one pulling the sprinter forward and one pulling the sprinter backward at the start of a run. The backward pulling at the start of the run exercises the sprinter's muscles which are used when going from a stationary position, to a full speed sprint. The device which pulls the sprinter forward would take over when the rearward pulling device shut off, and pull the sprinter to an over speed condition. Include in the device is a cable and cable winder, and a motor, computer, and a wireless connection to a data compilation computer.

Running requires the muscles of the leg to lift the leg up and then pull the leg down. The speed and rate of the leg going up must match the speed of the leg going down. Following the premise that a chain is as strong as its weakest link, the runner's rate of turnover (strides per second) is limited by whichever muscle group is the weakest or slowest (the muscle group that lifts the leg or the muscle group that lowers the leg).
The lower back-glute-ham group of muscles that drives the legs down includes much bigger muscles than the hip flexor group which pulls the leg up. Additionally, the lowering of the leg is assisted by gravity while the hip flexor group has to work against gravity to get its work done to pull the leg forward and up. It is for these reasons that the hip flexor group is the limiting factor in stride frequency, and requires the most developmental focus if increased speed is the goal. The sprinter training device of the invention is designed with this in mind, to increase the athlete's stride frequency by increasing the power generated by the hip flexor group. It achieves this by altering the run cycle so that the hip flexor group is targeted for muscle development, much like lifting weights for the hip flexor group.
The following formula is a description of the physics of hip flexor movement.
Hip Flexor Power Development:                A. The leg has a defined weight.        B. The swinging leg, on its way backward, moves at a measurable speed.        C. Weight (load)×Speed=Power.
The weight of the leg multiplied by the speed that the leg is moving will determine the power required to stop the limb and change its direction and move it forward. By forcing an athlete to run faster than the athlete's unassisted speed, the speed factor of the power equation is modified and therefore, the athlete's power is increased. It is in the increase in power that allows the athlete to achieve higher speeds and thus have greater speed endurance.
Fast Twitch Maintenance:
By causing the muscles of the leg to be energized in a more rapid sequence, the nervous system of the sprinter's leg is adapted to faster firing of the muscles involved in the run cycle.
Nervous Adaption:
If a runner ran downhill for 30 meters, he/she would most certainly run faster than a flying 30 meter run (natural, unassisted maximum velocity). This is because the nervous system is much more cooperative when the muscles that are innervated are relaxed.
However running downhill has been shown to not be the optimal way to increase speed. When running downhill, the runner is assisted by gravity, which tends to continue to accelerate the runner to his/her terminal speed, a condition in which relaxation is not possible. The pattern of nerve innervation and muscle firing sequence is altered from that of the unassisted running cycle. When the maximum over speed rate is achieved when running downhill, the runner adapts his run cycle, muscle innervation sequence and muscle firing pattern to cause the runner to lean backwards, apply breaking pressure to the feet when they are on the ground to absorb increased foot strike from the downhill posture, and in many subtle ways to change the downhill run cycle from that of the unassisted run cycle.
Downhill running puts the ankle joint at an unnatural position concerning the initial heel contact. It extends the ankle joint, negating its ability to add impulse to the body. By contrast, the machine of the invention allows the runner to have the same ankle position that he would use if he were unassisted. Because the runner is not at his or her maximum velocity, the runner does not "put on the brakes" nor change his posture, shifting the center of gravity backward.
Natural Running Curve:
All runners have to overcome the load of the body at the beginning of any run. Use of the motor of the device to pull the runner backward at the start of the sprint adds a slight load to the runner in order to exaggerate the runner's normal load (inertia). Running downhill or with the assistance of a bungee cord, for example, removes this normal load and is counterproductive to acceleration training.


A single-crystal substrate is prepared which has the (100) crystal plane with a step line formed therein by cleaving an MgO single crystal. By evaporating metal onto the cleavage plane, with a mask wire of platinum disposed at a distance from the cleavage plane and extended in a direction across the step line, a pair of metal thin film electrodes separated by a gap are epitaxially grown. By this, a step line corresponding to the cleavage-plane step line is formed in the surface of each of the metal thin film electrodes. Metal is further evaporated onto the metal thin film electrodes at a low rate, by which nano-size thin wires extending along the step lines are grown so that they approach each other and are finally connected to each other.

The present invention relates to a method of fabricating nano-size thin wires with a diameter of 100 nm or under and devices having such nano-size thin wires.
A thin metallic wire of a 100 nm diameter or smaller has specific properties called quantum conduction phenomena, such as follows: (a) Phase information of conduction electrons survives and the electron wave interference effect becomes obvious. (b) Ohm's law is often broken and the electrical conductivity (and consequently thermal conductivity as well) of the wire depends on the configuration of the metal as well as its diameter and length. (c) The conductivity greatly fluctuates and noise is observed depending on the configuration of the sample and the positions of impurity atoms. (d) A marked surface effect is produced. (e) Visible light enters throughout the thin wire, causing a decrease in its conductivity.
Two methods have been proposed to fabricate nano-size thin wires. According to a first method called the IBM laboratory method, a gold (Au) evaporated film is formed on the surface of a graphite substrate, then an arbitrary thin line, along which a thin wire is desired to obtain, is drawn on the Au evaporated film by means of an electron beam, and at the same time, carbon (C), which results from the decomposition of a residual gas such as CH.sub.4, is deposited onto the thin line. After the carbon film is grown to a proper thickness, the Au evaporated film is removed by argon (At) sputtering, and at the same time, the carbon line deposited thereon is also removed. As a result, the gold underlying the carbon thus removed remains unremoved, providing a nano-size thin wire of the same shape as that of the thin line drawn by the electron beam. According to the second method by Yale University, a step line is formed by argon sputtering on the surface of a glass substrate, then a metal thin film is evaporated onto the substrate surface where the step line was formed, and argon sputtering is performed again obliquely, leaving an Au thin wire in the shade of the step line.
With the first-mentioned prior art method in which the Au evaporated film surrounding the thin carbon line and the carbon line deposited on the Au film are removed at the same time and the gold line underlying the carbon line is left unremoved, it is necessary that carbon be deposited thick, and therefore, the Au evaporated film must be scanned repeatedly by the electron beam along the thin line. This consumes much time, and hence constitutes an obstacle to mass production of thin wires and inevitably raises their manufacturing costs. The second-mentioned conventional method is defective in that the crystal growth of the thin wire is not uniform under the influence of the glass substrate and that during sputtering using argon (Ar) ions the thin wire is contaminated (with an impurity entering it) and the wire surface is roughened.
Since the conventional thin wire is formed directly on the substrate as mentioned above, it is likely to be affected physically by an interaction between the substrate and the thin wire. Moreover, there is a fear that atoms forming the substrate and/or impurity elements in the substrate enter into the thin wire to form an alloy which chemically affects the thin wire. In addition, the thin wire cannot be separated from the substrate.

Method of fabricating nano-size thin wires and devices made of such thin wires


A solvent system for the removal of acid gases from mixed gas streams is provided. Also provided is a process for removing acid gases from mixed gas streams using the disclosed solvent systems. The solvent systems may be utilized within a gas processing system.

Various strategies are being pursued to minimize the production and/or release of undesirable emissions from combustion processes. One such strategy is the development of technologies for the specific removal of acid gases from gas mixtures, such as the exhausts of carbon combustion processes. The separation of acid gases, such as CO2, from gas mixtures has been carried out industrially for over a hundred years, although no known process has been used on a large scale such as that required by large, industrial power plants. Of the numerous processes used for CO2 separation, current technology mainly focuses on the use of various solvents, such as alkali carbonates in the BENFIELD™ Process (UOP, LLC), alcoholamines in the ECONAMINE FG PLUS™ process (Fluor Corporation), and alcohols, diols, and ethers in the RECTISOL® process (Lurgi, GMBH) and the SELEXOL™ solvent (The Dow Chemical Company). In a typical solvent-based process, the gas mixture to be treated is passed through a liquid solvent that interacts with acidic compounds in the gas stream (e.g., CO2 and SO2) and separates them from non-acidic components. The liquid becomes rich in the acid-gas components, which are then removed under a different set of operating conditions so that the solvent can be recycled for additional acid-gas removal.
Methods for removal of the acid-gas components from rich solvents involve pressure and temperature change. Depending on the temperature of the gas mixture and the partial pressure of the acid-gas in the mixture, certain solvents are preferred for specific applications. When a solvent operates to interact with an acid-gas by chemical absorption, an exothermic chemical reaction occurs. The reversal of this reaction requires at least the amount of energy to be added back to the rich solvent that was produced by the forward reaction, not to mention the energy needed to bring the rich solvent to the temperature where reversal is appreciable and to maintain conditions to complete the reverse reaction to an appreciable extent. The energy required to obtain purified acid-gas from the rich solvent contributes to the cost of the purified product. In particular, the cost of the purified acid-gas has become a significant hurdle for the application of solvent technologies to fossil-fuel fired power plants for the removal of acid gases from flue gas.
Non-aqueous solvents have been used to remove CO2 from natural gas streams and require less energy for regeneration. Single-component alcoholic physisorption solvents such as RECTISOL™ and SELEXOL® are commercially available for CO2 separation but perform poorly in the humid, near-ambient pressure conditions associated with flue gas. Alcoholamines and amines have been combined with alcohols, diols, and cyclic carbonates by various researches to form "hybrid solvents" whose reaction mechanisms and kinetics have been studied in the literature. See, Alvarez-Fuster, et al., Chem. Eng. Sci. 1981, 36, 1513; Ali, et al., Separation and Purification Technology 2000, 18, 163; Usubharatana, et al., Energy Procedia 2009, 1, 95; and Park, et al., Sep. Sci. Technol. 2005, 40, 1885. In addition, a process known as the "phase-transitional absorption method" has been disclosed in relation to methods for deacidizing gaseous mixtures, which generally consists of the absorption of acid gases into an "absorbing phase" of less density than water consisting of a nitrogenous base and an alcohol, followed by transfer of the absorbed acid gas into an aqueous "carrier phase". The aqueous carrier phase can be regenerated in a regenerator. The process claims to save energy by absorbing an acid gas at a faster rate than in an absorbing phase alone, and by avoiding the energy required to pump a rich absorbing phase to a separate regenerator by utilizing gravity to transfer the acid gas between phases in a single column for absorption and regeneration.
Another group of non-aqueous liquids which could be developed to address many of the problems affecting CO2 solvents are room temperature switchable ionic liquids. These equimolar mixtures of amidine or guanidine nitrogen bases and alcohols are non-ionic room temperature liquids that react with CO2 to form room-temperature ionic liquids. Typically, the conductivity of equimolar mixtures increases by one or two orders of magnitude when CO2 is added. Importantly, these solvents have higher CO2 loadings than some aqueous amines, and are regenerable under milder conditions. While these solvents are a promising alternative technology, they are not well-suited for flue gas applications due to their chemistries with respect to water, which typically is a major component of flue gas. CO2 is captured via the formation of amidinium and guanidinium alkyl carbonate salts derived from the conjugate bases of the deprotonated alcohol components. However, the alkyl carbonate esters are typically hydrolyzed in water under basic conditions, resulting in bicarbonate salts.
Accordingly, it would be beneficial to formulate a new solvent system capable of effectively removing acid gases from gas streams (particularly water-containing gas streams) and which can be regenerated at a lower temperature and energy load than the solvents currently utilized for such purposes.

Regenerable solvent mixtures for acid-gas separation


A printhead IC for an inkjet printer, the inkjet printer having a print engine controller (PEC) for sending print data to the printhead IC, the printhead IC comprising: an array of nozzles for ejecting drops of printing fluid onto a media substrate; and, drive circuitry for driving the array of nozzles, the drive circuitry being configured to extract a clock signal from the data transmission from the PEC.

Inkjet printers eject drops of ink through an array of nozzles to effect printing on a media substrate. The nozzles are typically formed on a silicon wafer substrate using semiconductor fabrication techniques. Each nozzle is a MEMS (micro electromechanical systems) device driven by associated drive circuitry formed on the same silicon wafer substrate. The MEMS nozzle devices and associated drive circuitry formed on a single nozzle is commonly referred to as a printhead integrated circuit (IC).
Some inkjet printheads have a single printhead IC. These are scanning type printheads that traverse back and forth across the width of a page as the printer indexes the length of the page past the printhead. The Applicant has developed a range of pagewidth printheads that have a nozzle array as long as the printing width of the page. These printheads remain stationary in the printer as the page is fed past. This allows much higher print speeds but is more complicated in terms of controlling the operation of a much larger array of nozzles.
The pagewidth array of nozzles is made up of a series of separate printhead IC's placed end to end. Skilled workers in this field will appreciate that more printhead IC's can be fabricated on the unprocessed circular silicon wafers if each IC is short rather than long. Furthermore, localized fabrication defects can render an entire printhead IC defective. Hence there is less chance that each individual IC will be defective if they are shorter.
The print data for each printhead IC in the pagewidth array of nozzles, is generated by another microprocessor in the printer, often referred to as a print engine controller (PEC). With the pagewidth array consisting of a series of separate printhead IC's, and each printhead IC needing a print data signal and a clocking signal at the least, the total number of connections between the PEC and the pagewidth array of printhead IC's can be numerous.
The Applicant has found that it is beneficial to provide the pagewidth printhead in the form of a replaceable cartridge. If nozzle clogging or actuator burn out reduce the print quality to an unacceptable level, the user simply replaces the printhead instead of the entire printer. However, user expectation demands that the printhead replacement process be as simple and failsafe as possible. Therefore, the number of interconnections between the PEC and the printhead should be minimized.

This patent is subject to a terminal disclaimer.

Printhead IC with clock recovery circuit


In an apparatus for transporting sheets along a travel path, a registration mechanism for aligning a sheet relative to the travel path. The registration mechanism comprises a support for a sheet moving along the travel path and a pair of frusto-conical rollers. The frusto-conical rollers are mounted for rotation about common axis, with the apex portions of the respective frusto-conical rollers oriented in the same direction relative to the common axis. The common axis is located to lie in a plane parallel to the plane of a sheet in the travel path and extend in a direction transverse to the direction of movement of a sheet along the travel path. The plane containing the axis is spaced from the sheet supporting means a distance such that the frusto-conical rollers are in nip relation with the sheet supporting means so as to urge a sheet in the travel path in the direction of movement along the travel path and in a direction transverse to the direction of movement with a minimum of skew induced in such sheet.

The present invention relates in general to registration mechanisms for sheet transport apparatus, and more particularly, to a registration mechanism employing a pair of tandem frusto-conical rollers for effecting edge registration of a transported sheet.
In modern reproduction apparatus, such as printers or copiers or the like, information is reproduced on receiver members such as cut sheets of paper for example. Typically the receiver members are transported seriatim along a path and registered in the path so as to be located to receive a developed image-wise-pattern corresponding to the information to be reproduced. The developed image-wise pattern is transferred to the receiver member and fixed thereto to form the desired reproduction. The particular registration of the receiver member with the developed image-wise pattern is critical in forming an acceptable reproduction. In view of the accuracy of registration required in certain reproduction apparatus, it has been found necessary to provide for both in-track and cross-track alignment.
Registration apparatus which provide for cross-track alignment by the use of a frusto-conical roller are well known; see for example, U.S. Pat. No. 3,929,327, issued Dec. 30, 1975, in the name of Olson. As described in the above patent, the radial deformation of the frusto-conical roller exerts forces on a transported sheet to urge the sheet in the transport (in-track) direction as well as to provide a torque on the sheet to rotate the sheet into engagement with an elongated lateral registration edge. Continued transport of the sheet then causes the sheet to become aligned, in a direction transverse (cross-track) to the transport direction, against the elongated lateral registration edge. However, this arrangement requires substantial movement of the sheet in the transport direction before cross-track alignment is completed. In a reproduction apparatus operating at a relatively high speed with a short sheet travel path, there may not be enough travel distance to assure the desired cross-track alignment. Furthermore, the provision of the elongated lateral registration edge serves to impart friction forces to the sheet being aligned, and as a result may adversely impact the overall registration function of the registration apparatus.

Tandem frusto-conical roller mechanism for receiver member edge registration


In various embodiments, a switched-mode power supply is provided. The switched-mode power supply includes at least two output stages. Each output stage has a converter. A frequency of at least one of the output stages is modulated by way of a modulation unit configured to provide a modulation signal that is combined with a switching signal for driving a switching element of the converter of the at least one output stage.

In a switched-mode power supply having a plurality of similar output stages, undesired synchronization effects may occur between the output stages.
Such undesired synchronization may occur for example in the case of an LED driver having two buck output drivers. The cause of the synchronization is magnetic and/or capacitive coupling of the spatially close output stages. The phases and frequencies of the currents and voltages in the output stages converge with one another, which may lead to false output parameters or to fluctuations at the output. These fluctuations, in the case of the LED driver, may become visible in the emitted light as flicker that is able to be perceived in a disruptive manner.
A conventional way to avoid such disruptive synchronizations is to operate the individual output stages at significantly different frequencies, such that undesired synchronization is not able to occur on account of the frequency differences. However, specifically in the case of LED drivers, it is necessary for them to cover a large output current and voltage range. Therefore, it is not possible to prevent frequencies (or their integer multiples) from becoming very close to one another at certain operating points and thus resulting in the undesired synchronization effects.

Switched-mode power supply having a plurality of output stages


A voltage-controlled amplifier for a signal processing system includes an input voltage reception end, a first voltage-to-current converter, a reference current generator, a gain adjustment circuit, a first current mirror, and an output circuit. The voltage-controlled amplifier adjusts a gain according to a variable control voltage, so as to transfer an input voltage to an output voltage according to the adjusted gain. When adjusting the gain, the present invention changes only an alternating current part of the input voltage, and can decrease noise, the production cost, and increase integration degree.

1. Field of the Invention
The present invention provides a voltage-controlled amplifier, and more particularly, a voltage-controlled amplifier with low noise, low distortion, high integration degree, and low cost.
2. Description of the Prior Art
A voltage-controlled amplifier, or VCA, can be seen as a three-terminal unit, including an input end, an output end, and a control signal reception end, utilized for changing a gain according to a control signal. The VCA is usually used in a multimedia electric device, such as a DVD player, a VCD player, a portable video player, a digital TV, etc. A user can adjust volume, contrast, brightness, or a channel of the multimedia electric device through the VCA.
The VCA has become more and more important owing to a variety of signal types. The prior art VCAs (voltage-controlled amplifiers) are manufactured with a bipolar process or a BiCMOS (bipolar complementary metal oxide semiconductor) process. A VCA, manufactured with the bipolar process, can operate in a high speed and drive a high current, but cannot be integrated with a digital circuit. In comparison, a VCA, manufactured with the BiCMOS process, combines advantages of a BJT and a CMOS, including high speed, high current driving, low power, high input impedance, high noise margin, etc. However, cost of the BiCMOS manufacturing process is too high. Therefore, a VCA with low noise, low distortion, high integration degree, and low cost is needed.

Voltage-controlled amplifier for a signal processing system


A position-tracking system for tracking the position of an object is disclosed. According to various embodiments, the tracking system includes a tracking device that is connected to or otherwise affixed to the object to be tracked. The tracking device may include, among other things, an inertial sensor assembly, radio transceivers and a processor. The position tracking system may also include a host processing system that is in communication with the tracking device. The position tracking system may provide variable-resolution position information based on the environment in which the object is moving. In a “wide resolution” area, the system may compute a general position for the object based on a wireless telephone network Cell-ID/map correlation architecture. In a high-resolution area, greater position resolution may be realized from the combination of a wireless aiding system and inputs from the inertial sensors. In the high-resolution mode, the system may exploit distinct patterns of motion that can be identified as motion “signatures” that are characteristic of certain types of motion. Kinematic (or object movement) models may be constructed based on these motion signatures and the position tracking system may estimate the state of the object based on the kinematic model for the current mode of the object. Adaptive and cascaded Kalman filtering may be employed in the analysis to more accurately estimate the position and velocity of the object based on the motion pattern identified.

The present invention is generally directed to systems and methods for tracking the position of objects.
Position-tracking systems seek to identify the location of mobile objects in real-time and are used in a wide variety of applications, including transportation, logistics management, healthcare, security, etc. Position-tracking systems that can provide continuous location information are desirable for applications that require non-interrupted visibility of the mobile object through a journey. For objects that are moved with a vehicle (such as inter-modal shipping containers or trailers), being able to locate the position of the objects in real-time can help improve the efficiency of supply-chain and inventory management while reducing the loss in productivity of assets. As businesses increasingly depend on a global supply chain and distribution networks, more goods and assets are being moved around for longer distances and with more parties involved in the process. In order to facilitate an automated, error-free data exchange for logistics management, the availability of continuous information about these assets in real-time is more valuable than "discrete" information that is only available for certain regions, albeit with perhaps higher position resolution.
Existing position-tracking systems typically employ satellite, radio wave or other wireless technologies. However, such systems typically suffer from limitations caused by line-of-sight requirements for location signals and/or interference caused by the environment in which they operate (e.g., multi-path fading or radio waves in an indoor setting). In addition, although much effort has gone into extending the operating range for Global Positioning System (GPS) and GPS-like technologies with more and more sophisticated software implementations, GPS systems are still generally ineffective and unreliable for location tracking indoors or in other environments where obstructions to the satellite signals present challenges. Further, other non-GPS based position technologies that have been proposed to date are largely based on a "local GPS" system using an assembly of locally deployed wireless antennas to mimic the function of the GPS satellites. Due to the high cost of designing and implementing such systems, however, they remain a costly proposition.
Other object-tracking technologies, such as RF ID tags or bar codes, may be acceptable for tracking objects where the objects generally travel only within a small, controlled environment, such as a warehouse, where their travel paths are static and well-defined. These technologies, however, cannot suitably track the position of the object once it leaves the controlled environment.

Position-tracking device for position-tracking system


A vehicle drive unit assembly having a housing having a hollow interior portion therein with a size and shape to receive and/or retain at least a portion of a gear assembly. At least a portion of a shroud having an inner surface, an outer surface, a first side, a second side, a first end portion, a second end portion and an intermediate portion is disposed within the hollow interior portion of the housing. One or more first shroud channels having extend inward into a body portion of the shroud from at least a portion of the second side of the shroud. At least a portion of one or more inlet openings of the shroud are disposed in the second side of the shroud and at least a portion of the one or more outlet openings of the shroud are disposed within the inner surface of the shroud.

Various drive train systems are widely used in order to transmit an amount of rotational power generated by a source of rotational power to one or more driven components. For example, the source of rotational power may be an engine or motor that generates an amount of rotational power needed to drive one or more wheel assemblies.
Typically, a vehicle drive train includes the use of one or more drive unit assemblies that transmit an amount of the rotational power generated by the engine to the one or more wheel assemblies of the vehicle. A conventional drive unit assembly includes the use of one or more gears meshed together within a housing. In order to improve the overall life and durability of the drive unit assemblies, an amount of lubrication fluid is included within the housing to lubricate the gears of the drive unit assemblies. Some lubricating systems are pump driven in order to supply an amount of lubrication fluid to the various elements within the drive unit assembly. In contrast, some lubricating systems utilize splash lubrication methods which are not as reliable as the pump lubrication systems. In the conventional splash lubrication systems, an amount of lubricant clings to the rotating component of the drive unit assembly as they pass through the lubricant within a sump or reservoir. The lubricant is then slung or thrown away from the rotating component due to centrifugal forces exerted onto the lubricating fluid when in operation. As a result, the splash lubrication methods do not generally insure that lubricant will be accurately or sufficiently supplied to the various elements of the drive unit assembly. The problem with the splash lubrication systems is that the drive unit assembly suffers from various parasitic and/or churning losses that result from the resistance offered by the rotating components through the lubricant within the sump or reservoir of the drive unit assembly. This reduces the overall efficiency of the drive unit assemblies and reduces the amount of rotational power that is transmitted from the engine to the wheels of the vehicle.
It would be advantageous to develop a drive unit assembly that has an improved overall efficiency, while also ensuring all the components of the drive unit assembly are adequately lubricated for performance and longevity.


An ink cartridge has a flexible ink bag that stores ink and undergoes expansion and contraction movement in accordance with fluctuations in the amount of ink stored. The ink bag is accommodated in a housing and has an ink inlet port for supplying ink into the ink bag and an ink outlet port for discharging stored ink. An inflow port and an outlet port are formed in a front surface of the housing for connection to the ink inlet port and ink outlet port, respectively, of the ink bag. First and second detection windows are formed on respective first and second opposite side surfaces of the housing. A plate member is mounted on the ink bag for movement therewith in response to fluctuations in the amount of ink stored in the ink bag. The plate member has a protruding portion that closes the second detection window during movement thereof to detect the full state of the ink bag. A lever has a structure separate and independent from the plate member and is mounted to undergo movement with the plate member to close the first detection window to detect an empty state of the ink bag.

The present invention relates to an ink cartridge for use in an inkjet-type recording apparatus that ejects ink droplets by nozzles, and records an image, a character and the like on a recording sheet, and relates to a recording apparatus including the ink cartridge.
At present, a large number of inkjet-type recording apparatuses (inkjet printers), each of which ejects ink droplets on a recorded medium such as a recording sheet, and records an image, a character and the like thereon, are provided. Each of these inkjet printers supplies ink to a recording head through an ink supply tube from a main tank in an inside of which the ink is hermetically filled in advance, and ejects the ink droplets from nozzles of the recording head on the recording sheet, thereby performs such recording.
As a type of the inkjet printers as described above, there is one in which a sub tank serving as an ink container with a smaller capacity than that of the main tank is provided between the main tank and the nozzles. In this type of the inkjet printer, the ink that is caused to flow out of the main tank is temporarily stored in the sub tank, and the stored ink is supplied from the sub tank to the nozzles.
In the inkjet printer including the sub tank, in order that the ink can always be supplied from the sub tank to the nozzles, it is necessary to grasp a residual amount of the ink in the sub tank, and to supply a fixed amount of the ink from the main tank to the sub tank when the ink in the sub tank runs out. As a mechanism for this purpose, for example, an ink residual amount detection mechanism described in Patent Document 1 is known.
The ink residual amount detection mechanism described in JP 2003-112433 A includes: a base member of a fixing system; a container (ink bag) that is freely expansible or contractible in response to a change of an amount of liquid ink stored in an inside thereof, in which one side thereof is disposed on the base member; a moving member (plate) that is disposed on the other side of the container so that the container can be located between the moving member concerned and the base member, and moves in response to the expansion or contraction of the container; a first detecting means for detecting one of end portions of the moving member that moves as the container expands by an increase of the amount of ink; a second detecting means for detecting the other end portion of the moving member that moves as the container contracts by a decrease of the amount of ink; and an abutting member against which the other end portion of the moving member that moves as the container expands by the increase of the amount of ink abuts.
Specifically, in the ink residual amount detection mechanism described in JP 2003-112433 A, the flexible ink bag is used as the sub tank, one of side surfaces of the ink bag is directly adhered onto the base member fixed to the inkjet printer, and the another side surface is adhered onto the moving member. Then, when the ink in the inside of the ink bag is decreased to a preset minimum amount or less, the other end portion of the moving member is detected by the second detecting means, and the ink is caused to flow into the ink bag from the main tank. After that, when the ink is caused to flow into the ink bag up to a preset maximum amount, the one end portion of the moving member is detected by the first detecting means, and such inflow of the ink is stopped.
In accordance with the mechanism as described above, the ink is always stored in the inside of the ink bag, and accordingly, the ink can always be supplied to the nozzles from the ink bag serving as the sub tank.
Incidentally, even with the above-mentioned ink bag that is used as the sub tank and supplied with the ink from the main tank, it is necessary to periodically exchange the ink bag since the ink bag itself is deteriorated with time.
However, the ink container for use in the above-mentioned ink residual amount detection mechanism described in Patent Document 1 is not one in which the ink bag is housed in a housing, but one in which the ink bag is directly adhered onto the inkjet printer, and accordingly, it has taken a lot of time and labor to exchange the ink bag. In addition, it has been necessary to accurately fix the ink bag to a predetermined position of the base member. In the case where the position to which the ink bag is fixed shifts from the predetermined position, the moving member adhered onto the ink bag is not accurately positioned with respect to the detecting means, and it has been possible that erroneous detection may occur regarding the residual amount of ink.