A vehicle body front structure includes a front bumper face positioned in front of a front bumper beam, wherein the front bumper face includes an upper face member provided with a license plate mounting portion, and a lower face member provided with an external air introduction opening. The vehicle body front structure further includes a front panel positioned above the upper face member.

A front end of a vehicle is typically provided with a pair of headlights, a license plate, and an external air introduction opening for introducing external air into the engine room. In a known vehicle body front structure, the front end of the vehicle is provided with a bumper grille having openings for headlights and grill parts for introducing external air into an engine room defined behind the bumper grille, and a bumper main body extending laterally in a vertically middle part of the bumper grille. A lower part of the bumper grille is centrally provided with a license plate mounting portion. See JPH10-53080A. According to this prior art, an access hole is provided in a part of the bumper grille adjacent to the license plate mounting portion to permit access to an oil filter. The access hole is normally closed by a cover consisting of a grill structure matching with the remaining part of the bumper grille.
In this prior art structure, the structure of the bumper grille is so complex that a correspondingly complex metallic mold is required for manufacturing the bumper grille. Even a minor design change in the bumper grille requires the entire bumper grille to be redesigned.


A step and scan exposure system projects a reticle image onto a semiconductor wafer mounted on a semiconductor wafer stage by a projection optical system in a slit scan scheme, focusing illumination light on the semiconductor wafer to form a plurality of focus sense areas arranged in a direction perpendicular to a scanning direction, receiving reflected illumination light by a plurality of photodetectors, and controlling the wafer stage by the signals from the plurality of photodetectors. In one embodiment, the signals from the plurality of photodetectors are selected, for controlling the wafer stage, corresponding to designated regions for focusing on the semiconductor wafer.

1. Field of the Invention
The present invention relates to a projection exposure system and method for a semiconductor wafer, and further relates to a semiconductor device manufactured using the above system or method. More specifically, the present invention relates to an improvement in exposure focusing and leveling, of the step and scan exposure system and method.
2. Background Art
Referring to FIG. 1 and FIG. 2(a) to FIG. 2(c), a description will be made of a step and scan exposure system and method, or a slit scan-type projection exposure system and method, to which the invention is directed (this type of apparatus will be hereinafter referred to as "scan-type stepper" where appropriate) and, particularly, to an example of how focusing and leveling are performed in the system and method.
FIG. 1 shows the configuration of a scan-type stepper. FIG. 2(a) shows a slit-like exposure area projected onto the wafer, and FIG. 2(b) and FIG. 2(c) show pattern forming plates of an illumination-side and a reception-side for an auto-focus function, respectively.
The principle of operation of the scan-type stepper will be described below. A pattern on a reticle 2 is projected onto a semiconductor wafer 8 in a slit-like exposure area 7, that is formed by illumination light, emitted from an illumination system 1 and passed through a projection optical system 6. FIG. 2(a) shows a slit-like exposure area 7 (or a slit-like exposure field) formed on the semiconductor wafer 8.
The entire exposure area of the wafer 8 is exposed by moving or scanning the reticle 2, mounted on a reticle stage 3, and the wafer 8, mounted on a wafer-side XY stage 11, in opposite directions. In this operation, the reticle stage 3 and the wafer-side XY stage 11 are properly synchronized with each other in terms of scanning speeds, alignment, etc., by a main controller 16 via a reticle stage controller 13, and a wafer-side XYZ stage controller 15.
Further, in the above operation, a Z position and an inclination of the wafer 8 are measured by a focusing and leveling sensor system 17 to 27 (described later in detail), and a Z stage wafer position detector 14. The signals are input to the main controller 16. The main controller 16 controls the wafer Z stage 12, via the wafer XYZ stage controller 15, so that the exposure surface of the wafer 8 is positioned at the image surface of the slit-like exposure area 7, that is formed by the projection optical system 6.
Next, the principle of operation of the focusing and leveling sensor system 17 to 27 and the wafer Z stage position detector 14 will be described. Illumination light, that is different from exposure light, and does not cause a chemical change in a photoresist formed on the wafer 8, is introduced from an illumination optical system (not shown) via an optical fiber 17. The illumination emitted from the optical fiber 17 is applied to a pattern forming plate 19 of the illumination-side, via a condenser lens 18. FIG. 2(b) shows the shape of the pattern forming plate 19 of the illumination-side. The illumination light passes through a plurality of openings formed in the pattern forming plate 19 of the illumination-side.
Returning to FIG. 1, the illumination light that has passed through the pattern forming plate 19 of the illumination-side, is projected onto the exposure surface of the wafer 8 via a lens 20, a mirror 21, and a projection objective lens 22. As a result, an image of a pattern, on the pattern forming plate 19 of the illumination-side, is formed as focus sense areas on the exposure surface of the wafer 8 in the inclined pattern. FIG. 2(a) shows a state where a plurality of focus sense areas F1 to Fn are arranged in the slit-like exposure area 7.
Returning to FIG. 1, the illumination light reflected by the wafer 8 is projected onto photodetecting surfaces of photodetectors 27, via a condensing objective lens 23, a mirror 24, an imaging lens 25, and a pattern plate 26 of the reception-side. FIG. 2(c) shows the shape of the pattern plate 26 of the reception-side, which is the same as that of the pattern plate 19 of the illumination side.
Returning to FIG. 1, an image of the pattern on the pattern forming plate 19 of the illumination-side is formed on the photodetecting surfaces of the photodetectors 27. If the Z position of the wafer 8 is varied, the illumination light reflected by the wafer 8 is shifted in the X direction on the pattern plate 26 of the reception-side. As a result, the quantity of light beam that passes through the pattern plate 26 of the reception-side and reaches the photodetectors 27, varies. Thus, the Z position of the wafer 8 is converted into the position in the X direction, on the pattern plate 26 of the reception-side, and light quantity on the photodetectors 27. The light quantity is further converted into a voltage through current to voltage conversion, and supplied to the Z stage wafer position detector 14 as a focus signal. The wafer-side Z stage position detector 14 performs a computation on the focus signal that is received from each photodetector 27, and supplies a resulting signal to the main controller 16.
Reference numeral 4 denotes a reticle stage interferometer mirror. Reference numeral 5 denotes a reticle stage interferometer. Reference numeral 9 denotes a wafer stage interferometer mirror. Reference numeral 10 denotes a wafer stage interferometer.
Next, the conventional method of signal processing will be described. FIG. 11(a) to FIG. 11(c) illustrate a state of focusing and leveling on a semiconductor chip in a conventional exposing method of a scan-type stepper. Consider an exposure area in a semiconductor chip, a memory-incorporated logic, for example, having a pattern layout shown in FIG. 11(a). In an auto-focusing system of the scan-type stepper, focus sense areas F1 to Fn are formed perpendicularly to a scanning direction as shown in FIG. 11(a). The plurality of photodetectors 27 (see FIG. 2(c)); (hereinafter referred to as focus sensors AF1 to AFn where appropriate) corresponding to the respective focus sense areas F1 to Fn, perform sensing along the scanning direction at the time of the exposure or prior to the exposure.
Conventionally, auto-focusing is performed by using a signal, such as an average value; (.SIGMA.SFn)/n of the focus signals SF1 to SFn from all the focus sensors AF1-AFn, for instance. Namely, the wafer-side XY stage 11, on which the wafer 8 is absorbed, and the wafer-side Z stage 12, are vertically moved including a leveling correction or inclination correction.
FIG. 11(b) and FIG. 11(c) illustrate states of focusing and leveling obtained on a semiconductor wafer, or more specifically a semiconductor chip, by the above-described conventional auto-scan method. FIG. 11(a) shows regions-1 and regions-2 having a level difference in between on the semiconductor chip surface and an arrangement of focus sense areas F1 to Fn formed on those regions.
FIG. 11(b) and FIG. 11(c) show leveling states in cases where a line A1-B1 or A2-B2 in FIG. 11(a) are illuminated, respectively. Where a level difference exists in the direction perpendicular to the semiconductor chip scanning direction, i.e.: X direction, as in the case concerned, the focusing and leveling state on either the line A1-B1 or A2-B2 are such that defocusing of 1/2 of the level difference between the region-1 and the region-2 occurs. For example, if the level difference between the region-1 and the region-2 is 1 .mu.m, the defocusing amounts to 0.5 .mu.m, which is fatal to submicron lithography.
In exposing a semiconductor chip, it is not always the case that a region-1 (a memory region, for example) and a region-2 (a logic region, for example) are exposed in the same step. That is, a region-1 and a region-2 may be exposed by using different masks. When the semiconductor chip is exposed by a scan-type stepper in such a situation, auto-focusing of exposure may be performed separately on either region-1 or region-2 depending on each step.
Therefore, if regions on a chip to be subjected to auto-focusing can be designated by an exposure program for each step, the accuracy of the auto-focusing is improved, because the auto-focusing is not affected by level differences that are formed within regions irrelevant to each step. This method is effective particularly in a case where a semiconductor chip has large level differences and the depth of focus is small.
FIG. 12(a) to FIG. 12(c) illustrate states of focusing and leveling on another semiconductor chip having level differences by the conventional auto-scan method.
FIG. 12(a) shows a region-1 and a region-2 on a semiconductor chip surface having a level difference in a scanning direction, i.e.: Y direction, as indicated by an arrow in the drawing, and an arrangement of focus sense areas F1 to Fn formed on those regions. FIG. 12(b) and FIG. 12(c) show leveling states in cases where the chip surface is illuminated along the line A1-A2 or B1-B2 in FIG. 12(a), respectively.
In this case, when focusing is made on the line B1-B2 in the region-2, defocusing will not arise ideally, because the focus sense areas F1 to Fn are within the region-2 in the scanning direction, i.e.: Y direction, as shown in FIG. 12(c). However, if the chip surface has a level difference in the scanning direction, i.e.: Y direction, defocusing will arise along the line A1-A2 which is in the vicinity of the step edge as shown in FIG. 12(b).
The reason for the above will be explained below. In the auto-focus system of the conventional scan-type stepper, the focus sense areas F1 to Fn form angles of 45.degree. with the scanning direction. Each focus sense area F1 to Fn has a size of about 0.2 mm.times.2.0 mm. Since the length of the focus sense areas F1 to Fn in the Y direction amounts to 1.4 mm (=2 mm/.sqroot.2), for instance, the focusing varies depending on the proportion of areas of the region-1 or region-2 on which the focus sense areas F1 to Fn extend.
Thus, defocusing occurs in an exposure in the vicinity of the boundary of the region-1 and region-2. For example, if the focus sense areas F1 to Fn extend in the region-1 and region-2 at a ratio of 1:2 and the level difference between those regions is 1 .mu.m, the defocusing amounts to 0.33 .mu.m, which is fatal to submicron lithography.
In exposing a semiconductor chip, the region-1, such as a memory area, and the region-2, such as a logic area, are not exposed in the same step. That is, region-1 and region-2 are exposed by using different masks. When this kind of semiconductor chip is exposed by a scan-type stepper, auto-focusing of the exposure may be performed separately on region-1 or region-2 depending on each step.
Therefore, if regions on a chip for auto-focusing can be reduced by improving the shape of the focus sense area, the accuracy of the auto-focusing is improved, because the auto-focusing is not affected by a level difference that is formed with regions irrelevant to each step. This method is effective particularly in a case where a semiconductor chip has large level differences and the depth of focus is small.

Step and scan exposure system and semiconductor device manufactured using said system


A sub-surface safety system for hydrocarbon drilling operations is provided and includes at least one casing within a wellbore that extends into a first portion of a formation from the surface of the formation. A shut-in device is positioned in the casing so as to be below the surface of the formation. The well shut-in device defines a device passageway and is operable to sever a drill string extending through the device passageway and form a barrier in the device passageway that restricts wellbore fluids below the barrier from migrating up the casing to the surface.

In oilfield operations, safety systems typically are employed to manage unplanned well events, such as blow outs. For the well-drilling phase of such operations, conventional safety systems may include blow-out preventers (BOPs). BOPs are typically positioned at or above the surface of the formation, directly below the rig floor or at or near the mud line or ground level. BOP configurations such as this have a number of drawbacks.
Positioning a BOP at or above the surface of the formation exposes the BOP to potential damage from external forces that could render the BOP inoperable. For example, weather events can cause damage to a BOP positioned at or above the surface of the formation. Furthermore, human-operated machines or device such as vehicles, cranes, anchors or the like can damage a BOP located at or above the surface of the formation.
Thus, what is needed is an improved safety system for the drilling phase of oil and gas wells.

Safety system for oil and gas drilling operations


The invention is directed to a method for detecting combustion misfires in an internal combustion engine having a crankshaft and a transducer wheel coupled to the crankshaft and a sensor. The combustion misfires are detected on the basis of a time-dependent trace of the rotational movement of the transducer wheel and the transducer wheel has predetermined segments which pass the sensor. In the method, a sensor is utilized to detect segment times in which the segments pass the sensor so that the sensor produces a sensor signal representing the segment times. The sensor signal is applied as an input signal to first and second lowpass filters mutually connected in parallel thereby obtaining first and second output signals which react with different speeds to changes in the input signal. The difference between the first and second output signals is formed and a measure is, in turn, formed for the changes of the difference. The measure is compared to a threshold value and a movement of the measure above the threshold value is evaluated as a misfire.

Combustion misfires lead to an increase of the toxic substances emitted during operation of the internal combustion engine and can, furthermore, lead to damage of a catalytic converter in the exhaust-gas system of the engine. It is necessary to detect combustion misfires in the entire rpm and load ranges in order to satisfy statutory requirements for on-board monitoring of exhaust-gas relevant functions. In this context, it is known that, for operation with combustion misfires, characteristic changes of the rpm trace of the engine occur with respect to the normal operation without misfires. Normal operation without misfires and operation with misfires can be distinguished from a comparison of these rpm traces.
A method operating on this basis is disclosed in German patent publication 4,138,765 which corresponds to U.S. patent application Ser. No. 07/818,884, filed Jan. 10, 1992, now abandoned.
According to this known method, each cylinder is assigned a crankshaft angular region which is characterized as a segment. The segments are realized, for example, by markings on a transducer wheel coupled to the crankshaft. The segment time is that time in which the crankshaft passes through this angular region. The segment time is dependent, inter alia, on the energy converted in the combustion stroke. Misfires lead to an increase of the segment times detected in synchronism with ignition. According to the known method, a measure for the rough running of the engine is computed from the differences of the segment times. Additionally, slow dynamic operations can be computer compensated. Such dynamic operations are, for example, the increase of the engine rpm during acceleration of the vehicle. A rough-running value, which is computed for each ignition, is likewise compared to a predetermined threshold value in synchronism with ignition. Exceeding this threshold value is evaluated as a misfire. The threshold value is dependent, as required, from operating parameters such as load and rpm.
The reliability with which the misfires are detected in accordance with this method drops perforce by an amount the fewer individual misfires operate upon the rpm of the crankshaft. The reliability of misfire detection therefore drops with an increase in the number of cylinders of the engine and with an increase of rpm as well as with reducing load.

Method of detecting combustion misfires by evaluating RPM fluctuations


A dispenser for a blister pack which contains pills in a matrix of blisters has a support member for receiving the pack with a rupture side of the pack facing the support member. The support member has at least one opening for passage of pills pushed through the rupture side from the blister pack. A tab lid is hinged to the support member in a position covering the blister pack, the tab member having a matrix of tabs, each movably mounted to the tab lid and each positioned to be over a blister of the blister pack. Movement of a tab of the tab lid toward the support member effects compression of a blister to rupture the rupture side and push a pill out of the blister and through the opening of the support member. A cover lid can also be hinged to an opposite edge of the support member to cover the tab lid.

The present invention relates, in general, to pill dispensers, and in particular, to a new and useful dispenser which is specially constructed to dispense pills that have been blister packed.
The use of blister packs to contain pills has become increasingly popular. Blister packs tend to be much more sanitary than loose pills in a bottle and are much less susceptible to tampering. By avoidance of light and moisture, greater product stability is achieved. Blister packs are commonly made of a transparent plastic sheet which has been formed to carry a matrix of depressions or blisters. One pill is received in each depression or blister. A foil or plastic backing is then firmly adhered across the plane of the sheet, sealing the pills in their respective blisters.
To extract a pill, a person must either cut the foil and plastic and then pull the cut edges apart to open one of the blisters, or push the pill through the foil backing to rupture the backing and extract the pill.
Throughout this disclosure, the term "pill" is used to identify not only pressed pills that are usually cylindrical in shape, but also elongated caplets, capsules, tablets, gelcaps and any other form of medication or vitamin amenably to being stored in blister packs.
A problem with known blister packs is that sometimes the pills are difficult to extract from the depression or blister, especially for the elderly and for individuals suffering from symptoms which are meant to be treated by the pill, for example in the case of an individual suffering from a migraine headache who is trying to extract headache medication from its blister pack.
A large number of unit dosage devices are also known, which are generally made of plastic and have multiple compartments, most commonly one compartment for each day of the week or multiple compartments for each day, for those individuals who must take medication more than once a day.
U.S. Pat. No. 5,489,025 to Romick, discloses a unit-dose dispenser which has provision for labelling daily dosages but which is also specially designed to receive blister packed dosages. The Romick patent captures a blister pack between top and bottom plates. Apertures are provided in the top plate for receiving the blisters and in the bottom plate for permitting discharge of a pill which is pressed from a blister. This reference does not make the extraction process any easier since the individual must still directly press the blister firmly to burst the foil below and extract the pill.


A hearing aid comprising a time domain codec. The codec comprises a decoder adapted to generate a decoded output signal based on an input quantization index and an encoder for generating an output quantization index based on an input signal, said encoder comprising said decoder and a predictor receiving an excitation signal derived from said decoder output signal and outputting a prediction signal. The output quantization index is determined by repeated decoding of the quantization indices in order to minimize the error between the input signal and the prediction signal, and the predictor uses a recursive autocorrelation estimate for the error minimization. The invention further provides a method of encoding an audio signal.

1. Field of the Invention
The present invention relates to hearing aids. More specifically, it relates to a hearing aid having a time-domain audio codec for decoding and encoding digital audio signals. The invention further relates to a method of decoding and encoding audio signals.
A hearing aid is embodied as a small, wearable unit comprising one or more microphones, a signal processor, and means for acoustically reproducing sound signals. A hearing aid may additionally comprise means for receiving, processing and reproducing sound signals from other sources, such as a telecoil or an FM receiver. In order to alleviate a hearing loss of a user, the signal processor of the hearing aid is configured to amplify selected frequency bands based on a prerecorded audiogram of the user's hearing loss. For flexibility reasons, the signal processor is preferably a digital signal processor.
2. The Prior Art
Modern day hearing aids are typically equipped with means for one- or two-way wireless communication, i.e. radio communication. Such wireless communication may carry sound signals, such as speech, suitable for being transmitted to and from the hearing aid in a digital form, e.g. between two hearing aids or between a hearing aid and another device. In such radio communication, there is a desire for keeping the transmission bit rate as low as possible, one of the reasons for this being that an increase in bandwidth of a radio communication leads to an increased power consumption, which, in turn, is undesired in a hearing aid.
One way to reduce the bit rate in a digital audio signal is to encode and decode the signals using an encoder/decoder unit or processor, commonly referred to as a codec, implemented as a combination of software and more or less dedicated hardware. However, such reduction of the bit rate comes at a cost.
One attempt to reduce the bandwidth and the delay time is described in the article: 'A Low-Delay CELP Coder for the CCITT 16 kb/s Speech Coding Standard', Juin-Hwey Chen et al, IEEE JOURNAL ON SELECTED AREAS IN COMMUNICATIONS, Vol. 10, No. 5, June 1992. The audio bandwidth, reproduction quality and computational complexity described in that article, however, do not meet the needs in a hearing aid.


A disk brake device includes a pair of brake disks and right and left pairs of pads. Each pad includes a twisting compliant section that extends along a line inclined by an angle relative to a radial direction of the corresponding brake disk. The twisting compliant section facilitates the twisting of the pad about the compliant section. The twisting compliant sections of the right inner pad and the left inner pad are inclined in opposite directions relative to the twisting compliant sections of the right outer pad and the right inner pad. The twisting compliant sections of the right inner pad and the left inner pad are inclined in substantially the same direction with one another.

1. Field of the Invention
The present invention relates to disk brake devices that have a pair of pads adapted to be pressed against a brake disk, including disk brake devices that have a right pair of pads and a left pair of pads that are adapted to be respectively pressed against a vehicle's right-side wheel brake disk and a vehicle's left-side wheel brake disk.
2. Description of the Related Art
In general, a vehicle, such as an automobile, disk brake device includes a right brake disk (a disk is also known as a rotor) and a left brake disk respectively connected to a right wheel and a left wheel. The disk brake device can have a right pair of pads and a left pair of pads that are adapted to be pressed against the right brake disk and the left brake disk. Each pair of right and left pads includes an inner pad and an outer pad. For example, the right pair of pads has an inner pad disposed on the left side of the brake disk and an outer pad disposed on the right side of the brake disk. The left pair of pads is configured oppositely to the right pair of pads.
Heretofore, various countermeasures have been proposed in the known art in order to reduce the squealing sounds produced by the pads of a disk brake device. For example, Japanese Laid-Open Utility Model Publication No. 6-69459 teaches a pad configured to reduce such squealing sounds. The pad of this publication includes a friction member and a back plate that supports the friction member from the back side. A recess is formed in the back plate and extends in a vertical direction (the radial direction of the brake disk). The recess enables the back plate to have a tendency to be easily bent about the recess. Therefore, during the braking operation, the pad may be bent in order to facilitate the pressing of the central portion of the pad upon the brake disk. For this reason, the central portion of the pad may still be pressed against the brake disk even if the central portion of the pad has become slightly concave due to uneven wearing of the pad. Therefore, the friction member may apply relatively uniform surface pressure, reducing the squealing sounds produced by the pad.
However, squealing sounds of a pad may be produced due to various modes of vibration, as shown in FIGS. 4 to 6. FIG. 4 shows a typical first vibration mode. The first vibration mode can manifest in vibration about a single primary bending direction. For example, the primary bending direction shown in FIG. 4 is a bending of the pad about an area across the width of the pad. FIG. 5 shows a second vibration mode. The second vibration mode can manifest in vibration about a single primary twisting direction. Generally, the second vibration mode shown in FIG. 5 is a twisting about an area obliquely extending along the length of the pad. FIG. 6 shows a third vibration mode. The third vibration mode can manifest in vibration about secondary bending locations. As shown in FIG. 6, the secondary bending locations include two bending areas extending across the width of the pad. The third vibration mode involves vibration about each of the two bending areas.
It has been known that the first, second, and third vibration modes produce separate and distinct squealing sounds. The three squealing sounds, P1, P2, and P3, can each have different frequencies, as shown in FIG. 7.
The known pad of the above publication can effectively reduce the squealing sound produced by the first vibration mode, where the vibration occurs about a single primary bending direction. However, use of the known pad does not appear to effectively reduce the squealing sounds that may be produced in the second vibration mode, where the vibration occurs about a primary twisting direction.
In another type of known pad, a recess (slit) is formed in the face of the friction member. In particular, pads are known that have such a recess (or slit) extending along the face of the friction member. However, such a recess has generally been incorporated in order to remove powders that may be produce due to wear of the friction member. Therefore, the direction or orientation of the recess with regard to reducing vibration has typically not been considered as a design factor.


A thin transition layer (13) is employed to provide alignment between an electron wave function (29) and a hole wave function (37) of an optical modulator (10) for a wide range of applied voltage values that are less than a predetermined value. Over this range of voltages, the modulator (10) is in an off state and substantially absorbs incident light (19). For applied voltages in excess of the predetermined value, the electron (29) and hole wave (37) function alignment is diminished thereby allowing light (19) to be transmitted through the modulator (10).

The present invention relates, in general, to semiconductor devices, and more particularly, to a novel optical semiconductor device.
Previously, the semiconductor industry has produced optical modulators in the form of semiconductor devices that vary the amount of light passing through the modulator. Generally, the amount of light passing through the modulator is proportional to the voltage applied to the modulator. In the off state, the modulator absorbs incident light. As the applied voltage increases, the intensity of light transmitted through the modulator also increases. Typically, the transmitted light intensity varies gradually from the off state to the on state. Therefore, a large voltage change is generally required to switch these previous modulators from the off state all the way to the on state. For applications such as digital switching of optical signals, telecommunications, and other applications, the large voltage swings required by the previous optical modulators is a disadvantage.
Another disadvantage of the previous optical modulators is the operating wavelength or the wavelength of light that can be used with the modulators. As the applied voltage varies, the wavelength of light that has the highest transmission (lowest absorption) through the previous modulators also varies. Often, the wavelengths that can be transmitted with low absorption are wavelengths that are not entirely absorbed in the off state. Consequently, this wavelength variation with voltage typically results in a low contrast ratio between the off state and the on state of the previous modulators.
Accordingly, it is desirable to have an optical modulator that has a sharp transition from the off state to the on state, that requires a small voltage change to transition from the off state to the on state, and that has a high contrast ratio.


A sheet conveying apparatus is connected between an image forming apparatus and a post-processing apparatus to receive the sheet ejected from the image forming apparatus, and to eject the sheet to the post-processing apparatus. The sheet conveying apparatus receives, from the post-processing apparatus, a sheet reception line speed information showing a line speed for the post-processing apparatus to receive the sheet, and receives, from the image forming apparatus, a sheet ejection line speed information showing a line speed for the image forming apparatus to eject the sheet. A conveyance line speed control section controls the conveyance line speed at the time of receiving the sheet from the image forming apparatus based on a sheet ejection line speed information, and controls the conveyance line speed at the time of ejecting the sheet to the post-processing apparatus based on a sheet reception line speed information.

The present invention relates to a sheet conveying apparatus connected between an image forming apparatus such as a printer and a post-processing apparatus and to an image forming system.
There has been used a finisher as a post-processing apparatus that conducts post processing such as a punching process and a stapling process, and various types of speed adjusting device have been employed because a sheet conveyance speed of an image forming apparatus is usually higher than that for post processing. With respect to a speed adjustment manner, there are known, for example, a manner wherein a conveyance speed is synchronized between a printer and a finisher (Unexamined Japanese Patent Application Publication No. 2002-311659), a manner to cope with changes of the printer side conveyance speed at the finisher side (Unexamined Japanese Patent Application Publication No. 10-111585) and a manner to make a carry-in roller on the finisher side to be high in speed to conduct receipt at high speed and to adjust a conveyance speed inside the finisher (Unexamined Japanese Patent Application Publication No. 2000-62998) and there are further known a manner where a sheet interval is adjusted by the printer depending on a type of post processing for the post processing conducted for plural sheets (Unexamined Japanese Patent Application Publication No. 11-208979) and a manner to adjust the speed by utilizing stacking on an intermediate tray of the finisher (Unexamined Japanese Patent Application Publication No. 2001-72308).
Since a post-processing apparatus is generally designed and developed as an apparatus exclusive for an image forming apparatus to which the post-processing apparatus is connected, a huge amount of cost is required for development of the apparatus even when the post-processing apparatus is one conducting the same processing.
Therefore, in Unexamined Japanese Patent Application Publication No. 2004-26358, there is proposed a relay conveying apparatus that adjusts operating speeds for the image forming apparatus and the post-processing apparatus, so that a conventional post-processing apparatus may be connected to the image forming apparatus even when specifications of the image forming apparatus are changed.
However, the structure of the aforesaid relay conveying apparatus causes the apparatus to be large in size, which is a problem.

Sheet conveying apparatus and image forming system

Konica Minolta Business Technologies, Inc.


In an infrastructure that uses a mobile order fulfillment system, mobile drive units may be dispatched and instructed to bring inventory holders that include fabric pods to a workstation where at least one of the inventory holders may be operated upon. Such fabric pods may include one or more fabric bin arrays.

Modern inventory systems, such as those used in mail order warehouses, supply chain distribution centers, airport luggage systems, and custom-order manufacturing facilities, face significant challenges in responding to requests for inventory items. As inventory systems grow, the challenges of simultaneously completing large numbers of packing, storing, and other inventory-related tasks become non-trivial.
Increasingly, mobile order fulfillment systems are used within inventory facilities to address these and other concerns. A mobile order fulfillment system may provide automation for bringing ordered items to central workstations for workers to select and pack the ordered items in preparation for shipping. However, in inventory systems tasked with diverse inventory requests, inefficient utilization of storage space can result in lower throughput, unacceptably long response times, and, in general, poor system performance.


A two-component adhesive, sealant, or coating composition containing (i) a first component containing a portion of an alkoxysilane-functional urethane and water; and (ii) a second component containing the remaining portion of the alkoxysilane-functional urethane and a catalyst. The alkoxysilane-functional urethane includes the reaction product of (a) the reaction product of a hydroxy functional compound and a polyisocyanate, that contains isocyanate groups; with (b) an amine functional aspartate. The composition is used in a method of bonding a first substrate to a second substrate. The method includes (a) combining component i) and component ii) to form a mixture, applying a coating of the mixture to at least one surface of the first substrate or the second substrate, and contacting a surface of the first substrate with a surface of the second substrate. The method is used make an assembly.

1. Field of the Invention
The present invention relates to two-component adhesive, sealant, and coating compositions and particularly to two-component compositions containing silylated polyurethanes.
2. Background Art
Adhesives are commonly used to join or fasten two or more adherends. Adherends are considered as being any two or more materials, or pieces of material that are being joined together, including wood, metals, plastics, paper, ceramics, stone, glass, concrete, etc. Adhesives used for these purposes are based on a wide range of technologies, including elastomer/solvent/resin mixtures, epoxies, latexes, polyurethanes, silicones, cyanoacrylates, acrylics, hot melts, and others. Such adhesives can have one or more drawbacks, such as they may contain solvents which are toxic and often flammable, they can be incompatible with one or more classes of adherends, they can have undesirably long cure times and in many cases the bonds they form are of insufficient strength.
It is often desirable for coatings applied to substrates to provide a desirable appearance, in many cases by applying multiple coating layers, the last of which can be a pigmented or unpigmented topcoat. Unfortunately, as the article containing the coated substrate ages, scratches that occur through normal "wear and tear", tend to deteriorate the appearance of the coated surface of the substrate,
A sealant is typically a thin film, often containing a plastic, that is applied onto one or more surfaces on one or more substrates to prevent passage of a liquid or gas through the film. The sealant can be used to prevent exposure of the substrate or is often additionally used to prevent exposure via defects in a substrate or between gaps that can exist between substrates.
Silane functional resins are typically cured or crosslinked in a two-step sequence that requires first a reaction of water with an alkoxysilane group to form a silanol group followed by reaction of the silanol group with either another silanol group or an alkoxy silane. In one-component silane formulations, catalysts are typically included in order to increase the speed of the reactions. In many cases, the absorption of water is a limiting step in the curing or crosslinking process.
U.S. Pat. No. 5,936,032 to Angus, Jr. discloses a two part room temperature vulcanizable silicone adhesive sealant composition consisting of components A and B. Component A includes an alkoxy endcapped polydiorganosiloxane, a condensation curing catalyst, and a polyalkoxysilane crosslinking agent. Component B includes water and a disilanol endstopped polydiorganosiloxane.
U.S. Pat. Nos. 4,386,992 and 4,479,840 to Takegawa, et al. disclose a two-part adhesive that includes an aqueous synthetic resin emulsion adhesive and a gelling agent including a combination of a calcium salt, which can be calcium aspartate and an organic acid salt or an inorganic acid salt.
U.S. Pat. No. 6,649,016 to Wu et al. discloses an adhesive composition useful for bonding glass to a painted substrate that includes one or more polymers having a flexible backbone and silane moieties capable of silanol condensation; one or more titanates or zirconates; and an anhydrous strong organic acid.
U.S. Published Application 20030055197 A1 to Morikawa et al. discloses a laminate adhesive that includes a polyisocyanate curing agent containing an isocyanate group-terminated prepolymer and a silane coupling agent and an active hydrogen group-containing resin.
U.S. Pat. No. 6,114,436 to Roesler discloses moisture-curable compositions containing polyisocyanates having (cyclo)aliphatically-bound isocyanate groups and compounds containing alkoxysilane groups. The moisture-curable compositions can be used in coatings, adhesives or sealants.
U.S. Pat. No. 6,096,823 to Shaffer discloses moisture-curable compounds which have an isocyanate group content and an alkoxysilane group content and optionally contain repeating ethylene oxide units. The alkoxysilane groups are incorporated as the reaction products of a polyisocyanate component and amino compounds containing alkoxysilane groups. The moisture-curable compounds are useful in adhesive or sealing compositions as a binder.
U.S. Pat. No. 5,554,709 to Emmerling et al. discloses moisture-curing alkoxysilane-terminated polyurethanes obtained by reacting polyurethane prepolymers with sulfur-free alkoxysilanes. The moisture-curing alkoxysilane-terminated polyurethanes can be used in sealing and/or adhesive compositions.
However, known adhesives, sealants and coatings utilizing silane functional resins suffer from having a poor or short shelf life and/or stability and/or are slow to cure. Therefore, it would be desirable to identify adhesives containing silane functional resins that have a good or long shelf life and a reasonably fast rate of cure or crosslinking.

This patent is subject to a terminal disclaimer.

Two-component silylated polyurethane adhesive, sealant, and coating compositions


The instant invention provides various formulations comprising combinations of immunostimulating oligonucleotides, polycationic carriers, sterols, saponins, quaternary amines, TLR-3 agonists, glycolipids, and MPL-A or analogs thereof in oil emulsions, use thereof in preparations of immunogenic compositions and vaccines, and use thereof in the treatment of animals.

Bacterial, viral, and parasitic infections are wide spread in humans and animals. Diseases caused by these infectious agents are often resistant to antimicrobial pharmaceutical therapy, leaving no effective means of treatment. Consequently, a vaccinology approach is increasingly used to control infectious disease. A whole infectious pathogen can be made suitable for use in a vaccine formulation after chemical inactivation or appropriate genetic manipulation. Alternatively, a protein subunit of the pathogen can be expressed in a recombinant expression system and purified for use in a vaccine formulation. Vaccines can be made more efficacious by including an appropriate adjuvant in the composition.
The term 'adjuvant' generally refers to any material that increases the humoral or cellular immune response to an antigen. Adjuvants are used to accomplish two objectives: They slow the release of antigens from the injection site, and they enhance stimulation of the immune system. Traditional vaccines are generally composed of a crude preparation of inactivated or killed or modified live pathogenic microorganisms. The impurities associated with these cultures of pathological microorganisms may act as an adjuvant to enhance the immune response. However, the immunity invoked by vaccines that use homogeneous preparations of pathological microorganisms or purified protein subunits as antigens is often poor. The addition of certain exogenous materials such as an adjuvant therefore becomes necessary. Further, in some cases, synthetic and subunit vaccines may be expensive to produce. Also, in some cases, the pathogen cannot be grown on a commercial scale, and thus, synthetic/subunit vaccines represent the only viable option. The addition of an adjuvant may permit the use of a smaller dose of antigen to stimulate a similar immune response, thereby reducing the production cost of the vaccine. Thus, the effectiveness of some injectable medicinal agents may be significantly increased when the agent is combined with an adjuvant.
Many factors must be taken into consideration in the selection of an adjuvant. An adjuvant should cause a relatively slow rate of release and absorption of the antigen in an efficient manner with minimum toxic, allergenic, irritating, and other undesirable effects to the host. To be desirable, an adjuvant should be non-viricidal, biodegradable, capable of consistently creating a high level of immunity, capable of stimulating cross protection, compatible with multiple antigens, efficacious in multiple species, non-toxic, and safe for the host (eg, no injection site reactions). Other desirable characteristics of an adjuvant are that it is capable of micro-dosing, is dose sparing, has excellent shelf stability, is amenable to drying, can be made oil-free, can exist as either a solid or a liquid, is isotonic, is easily manufactured, and is inexpensive to produce. Finally, it is highly desirable for an adjuvant to be configurable so as to induce either a humoral or cellular immune response or both, depending on the requirements of the vaccination scenario. However, the number of adjuvants that can meet the above requirements is limited.
The choice of an adjuvant depends upon the needs for the vaccine, whether it be an increase in the magnitude or function of the antibody response, an increase in cell mediated immune response, an induction of mucosal immunity, or a reduction in antigen dose. A number of adjuvants have been proposed, however, none has been shown to be ideally suited for all vaccines. The first adjuvant reported in the literature was Freund's Complete Adjuvant (FCA) which contains a water-in-oil emulsion and extracts of mycobacterium. Unfortunately, FCA is poorly tolerated and it can cause uncontrolled inflammation. Since the discovery of FCA over 80 years ago efforts have been made to reduce the unwanted side effects of adjuvants.
Some other materials that have been used as adjuvants include metallic oxides (e.g., aluminum hydroxide), alum, inorganic chelates of salts, gelatins, various paraffin-type oils, synthesized resins, alginates, mucoid and polysaccharide compounds, caseinates, and blood-derived substances such as fibrin clots. While these materials are generally efficacious at stimulating the immune system, none has been found to be entirely satisfactory due to adverse effects in the host (e.g., production of sterile abcesses, organ damage, carcinogenicity, or allergenic responses) or undesirable pharmaceutical properties (e.g., rapid dispersion or poor control of dispersion from the injection site, or swelling of the material).


A method for self-instruction of a user's hands on an object such as a musical instrument or sports equipment. The method includes accessing finger placement data corresponding to a sequence of predetermined finger placements on a plurality of objects. A position for each finger is sensed on one or more object representations. A finger placement indication is provided on the one or more object representations. The finger placement indication corresponds to each finger of the based on the finger placement data. Each finger placement indication location is compared with an associated sensed position for each finger and a determination is made whether the finger placement indication matches the sensed position for each finger.

1. Field of the Invention
This invention relates generally to a method and apparatus for self instruction. More specifically, the present invention is directed to directing a user's hand to the proper position of an object and to provide correction of erroneous placement of a user's hand.
2. Background Discussion
Learning an activity, such as a musical instrument or sport, such as golf or tennis, can be a time consuming process that typically involves hiring an experienced professional to explain and teach the proper hand positioning on the object (musical instrument, tennis racquet, golf club etc.). A person who wishes to learn usually takes some type of lesson, such as a small group or private lesson. Many potential students cannot afford the costs of such lessons nor have a scheduling conflict that prevents them from learning the activity.
Even if it is possible to attend lessons and pay for these lessons, every hour of lesson is usually reinforced by several hours of practice time outside of the presence of the instructor. During this practice time, it would be desirable for the instrument to automate the training process to provide instruction/correction while the student is practicing the activity.
Thus, it would be an advancement in the state of the art to facilitate students of an activity, such as learning to play a musical instrument or learning a new sport, to reach their goal by providing a self-instructional tool that provides feedback for the correct hand positioning.

Method and apparatus for self-instruction

Sony Computer Entertainment America Inc.


An apparatus and method for lessening wear on a dolly on a trailer. The apparatus and method also saves the dolly on the trailer.

Semi tractor trailers are loaded and coupled to semi tractors. The semi tractor truck can then be used to move the trailer and the content of the trailer to any desired location. Semi tractors and trailers are used widely in moving commercial goods. Semi tractors and trailers can also be used to move livestock to markets or move a family's personal belongings to a new house hundreds or even thousands of miles away.
Operators of semi trucks, in many instances, disconnect a semi trailer. For example, the operators of semi trucks generally make money while hauling loaded trailers from one spot to another. Therefore, the operator may disconnect a loaded semi trailer when it has reached a destination. The trailer can then be unloaded while the operator of the semi moves another loaded trailer elsewhere. In another instance, the operator may disconnect an empty semi trailer at a location. The trailer can be loaded while the semi tractor is used for other jobs. The operator can then come back and reconnect the now loaded semi trailer and haul it to a selected destination.
Many semi trailers are without a front axle and without front wheels. Generally, the weight of the semi trailer is borne by a fifth wheel on a semi tractor when the semi trailer is attached to the semi tractor. When disconnected, legs known as dollies are used to hold up the end of the semi trailer without the front axle or front wheels. When a full trailer is supported by the legs, a large force is carried on the legs. The semi tractor is generally backed into position where the semi trailer can be attached to the fifth wheel. The chore that remains includes retracting the legs to place the full weight of the semi trailer onto the fifth wheel portion of the semi tractor. A set of gears are turned to retract the legs. When the semi-trailer is loaded, the gears are very difficult to turn. Semi tractor operators can get hurt exerting the amount of force needed to turn the gears to retract the legs. If the semi tractor operator is an employee of a company, workman's compensation claims can result. This can be costly to the owner of a fleet of semi tractors. In addition to potential injuries to semi tractor operators, the large forces needed to turn the gears associated with the dollies can strip the gears. This is again costly in that the parts are expensive and must be replaced before moving the semi trailer. This wastes an operators time in addition to incurring the repair cost. Customers may also be disappointed as the arrival of their freight or cargo in the semi trailer may be delayed. Again, this can result in additional monetary losses if a contract covering the transaction includes penalty costs for delaying shipment. Even if the gears are not stripped, turning the gears under a heavy load wears the gears so that their life is shortened. In other words, the time between stripping the gears associated with the dollies may be shorter than necessary.


A regulated switching power converter generates a converter output having first and second regulated output values under corresponding operating conditions. The converter output transitions between the first and second output values in response to transition of a trigger signal in a transition window between first and second trigger values. A transition step function is based on transition amplitude, transition interval and number of steps, the transition amplitude being a difference between the first and second regulated output values, and the transition interval being a difference between the first and second trigger values. The transition step function generates a step-like transition signal based on values of the trigger signal between the first and second trigger values. During operation in the transition window, the step-like transition signal is included in the regulation reference value to generate a step-like transition of the converter output between the first and second regulated output values.

In large electronic systems it is common practice to use a distribution voltage of around 50 VDC to bring power to individual system cards. Each individual system card converts this 50 VDC to a lower regulated intermediate voltage around 10 VDC by means of an isolated DC/DC converter. The 10 VDC bus is used as an input by one or more point of load converters that provide power to the circuits on the individual system cards. On systems cards that require high power it is common practice to arrange multiple isolated DC/DC converters in parallel to meet the power requirements of the card. It is desirable that the paralleled DC/DC converters share current in a balanced manner. Different schemes for current sharing may be employed, including a scheme known as "droop current sharing" in which each converter in a paralleled arrangement has a negative-slope "droop" output characteristic. It may be desired to switch the output of paralleled DC/DC converters to different regulation points (respective output voltage values) in order to maximize system performance. Since each of the paralleled converters is an independent device, the trigger condition to switch regulation values will be detected by and reacted to within each converter.

Droop current sharing power converter with controlled transitions between regulation set points

Bel Fuse (Macao Commercial Offshore) Limited


Source diffusion layers and drain diffusion layers are alternately formed in lateral device forming regions separated by device isolation regions. Control gate electrodes are formed on both sides of each source diffusion layer through gate ONO films interposed therebetween. Gate electrodes are formed over their corresponding side surfaces of the control gate electrodes through inter-gate electrode insulating films interposed therebetween respectively. The control gate electrodes and the gate electrodes are respectively connected in a vertical direction by a source line and word lines on each device isolation region. Further, an intermediate insulating film is formed over the surface of a silicon substrate formed with memory cells, and each lateral drain diffusion layer is connected to a bit line through contacts.

The present invention relates to a nonvolatile memory, and particularly to a structure of a memory cell and a manufacturing method thereof.
Related arts will be explained using the following cited references:    Patent document 1: Japanese Unexamined Patent Publication No. 2001-168219    Nonpatent document 1: Yutaka Hayashi, et al, "Twin MONOS Cell with Dual Control Gates", 2000 Symposium VLSI Technology Digest of Technical Papers.
FIG. 2 is a configuration diagram of a conventional nonvolatile memory described in the nonpatent document 1 and shows a cross-section of a twin MONOS (Twin Metal-Oxide-Nitride-Oxide-Semiconductor) cell having two control gates separated from each other. One memory cell MC comprises two memory elements ML and MR, one diffusion region D (consisting of diffusion regions D1 and D2) and one word gate WG. The memory elements ML and MR respectively comprise CGL and CGR each equivalent to half of a control gate CG formed of polysilicon, and insulating films, i.e., ONO (Oxide-Nitride-Oxide) films constituted of an oxide film, a nitride film and an oxide film, which are disposed below the CGL and CGR to store electrical charges therein. The pair of memory elements ML and MR is disposed on both sides of the common control gate CG and shares the use of adjacent memory cells MCs and a word gate WG.
The control gates CGL and CGR divided into the two are electrically connected and share the same diffusion regions D which serve as bit lines. However, the ONO films disposed on the sides below the control gates CGL and CGR are separated from each other. The word gates WG, control gates CG and diffusion regions D are electrically connected in a memory array. For example, control lines are respectively provided on the diffusion regions D so as to be parallel with the diffusion regions and orthogonal to word lines.
Write and read operations of such a twin MONOS cell are performed as follows:
When, for example, writing (injection of electrons) is effected on the memory element MR, the potential of the diffusion region D1 on the memory element ML side is set to 0V, and the potential of the diffusion region D2 on the memory element MR side is set to 5V. The potential of the control gate CGL on the memory element ML side is set to 3.3V, and the potential of the control gate CGR on the memory element MR side is set to 6V. Further, the potential of the word gate WG is set to 1.5V. Incidentally, a substrate is at a ground potential GND.
Thus, since the voltage of 5V is applied between the diffusion regions D1 and D2, a current flows from the diffusion region D2 to the diffusion region D1. Some of the electrons that flow from the diffusion region D1 to the diffusion region D2 through the substrate are attracted to the control gate CGR to which the high voltage (6V) is applied, and stored in the corresponding ONO film of the memory element MR as CHE (Channel Hot Electrons).
On the other hand, when the contents of the memory element MR are read, the potential of the diffusion region D1 remains at 0V and the potential of the diffusion region D2 is set to 1.5V. Further, the potential of the control gate CGL is set to 5V and the potential of each of the control gate CGR and word gate WG is set to 2.5V. Incidentally, the substrate is at the ground potential GND. In this state, the contents of the memory element MR are determined according to whether the current flows through the control gate CGR. That is, if the electrons are being stored in the memory element MR, then no current flows. If not so, then the current flows.
Thus, since the twin MONOS cell makes use of such an SSI (Source Side Injection) system that a high voltage is applied to one of two gates arranged in a lateral direction with respect to a channel to bring one to a strong inverse state and bring the other thereof to a weak inverse state, thereby generating a high electric field between the gates to carry out an electron injection, it has the feature that the efficiency of the electron injection is high and high-speed writing can be performed with low power consumption. Since one memory cell MC has the two memory elements ML and MR, the twin MONOS cell has the feature that its densification is enabled.
However, the twin MONOS cell has the following problems.
That is, since it is necessary to form the gates on the ONO films, the structure of the memory cell becomes complicated and strict alignment becomes necessary, whereby Its manufacture becomes difficult. Since the diffusion regions D are formed on the substrate side-by-side so as to adjoin each other, a problem arises in that there is a fear that the influence of a high voltage on each memory element unintended for writing occurs.


A photolithography mask derivation process is provided for improving the overall planarity of interlevel dielectric deposited upon conductors formed by the derived photolithography mask. The photolithography mask is derived such that non-operational conductors are spaced a minimum distance from each other and from operational conductors to present a regular spaced arrangement of conductors upon which a dielectric layer can be deposited and readily planarized using, for example, chemical-mechanical polishing techniques. The resulting interlevel dielectric upper surface is globally planarized to an even elevational level across the entire semiconductor topography. The operational conductors are dissimilar from non-operational conductors in that the operational conductors are connected within a circuit path of an operational integrated circuit. Non-operational conductors are not connected within the integrated circuit path and generally are floating or are connected to a power supply. The non-operational conductors thereby do not contribute to the integrated circuit functionality other than to provide structural planarity to the overlying interlevel dielectric. The mask derivation process is applicable to either a metal interconnect photolithography mask or a polysilicon interconnect photolithography mask.

1. Field of the Invention
This invention relates to semiconductor fabrication and more particularly to a mask generation technique for forming regularly spaced interconnect necessary for optimal planarization. The mask generation technique is applicable to the production of a mask which can produce interconnect on the first or subsequent interconnect levels, upon which a dielectric is placed and thereafter globally planarized through etchback or polish.
2. Description of the Relevant Art
Fabrication of an integrated circuit involves placing numerous devices on a single monolithic substrate. Each device is electrically isolated from the others, but later in the fabrication sequence specific devices are electrically interconnected so as to implement desired circuit function. Interconnect of those devices often takes place on more than one elevational level, each level having a set of substantially coplanar interconnect conductors. The numerous levels of interconnect arranged above a monolithic substrate are generally referred to as a multilevel interconnect structure.
There are numerous challenges involved with producing a multilevel interconnected structure. One of the more complex problems involves planarizing the interlevel dielectric layers formed on each level of interconnect. There are typically two types of interlevel dielectrics: a metal interlevel dielectric and a polysilicon interlevel dielectric. The metal interlevel dielectric is formed upon metal interconnect, either the first, second or subsequent layers of metal within the multilevel interconnect structure. The polysilicon interlevel dielectric is formed only upon polysilicon interconnect, generally the first level of interconnect. Polysilicon or polycide is herein defined as gate polysilicon, local interconnect polysilicon or various other types of polycrystalline material possibly interposed between a pair of capacitor plates.
Planarization of an interlevel dielectric, whether a metal interlevel dielectric or a polysilicon interlevel dielectric, is a matter of degree. There are several types of planarization techniques ranging from minimal planarization (i.e., smoothing); intermediate planarization, involving only isolated or local planarization; or extensive planarization, involving global planarization. Smoothing entails merely lessening the step slopes at the dielectric surface while not significantly reducing the surface elevational disparity. On the other hand, local planarization substantially reduces if not eliminates entirely the elevational disparity in localized areas across the substrate. Global planarization, however, is designed for eliminating elevational disparity over the entire topography of the integrated circuit. As one can imagine, global planarization is extremely difficult to achieve on a multilevel interconnect structure having, for example, two or more levels of interconnect.
Most manufacturers have quantified the level of planarization, and have attributed a planarization factor generally described as "total indicated range" or TIR. If the planarization factor or TIR is small, then subsequent interconnect placed on the interlevel dielectric surface suffers from poor step coverage and generally cannot be accurately patterned due to photolithography depth-of-field limitations. Even though local planarization is achieved, absent global planarization, step coverage and depth-of-field limitations present themselves at the local/global juncture. For example, if a near sub-micron interconnect feature is to be patterned, the TIR, demonstrated as elevational disparity, must be less than 0.5 microns. For deep sub-micron features, the maximum TIR may be as small as 0.1 microns. Absent global planarization, such features cannot be readily obtained. In order to attempt global planarization, conventional planarization processes involve, inter alia, at three separate types of planarization. First, limited planarization is achieved through a sacrificial etchback technique. Sacrificial etchback involves depositing a sacrificial layer across the interlevel dielectric topography, and then removing a sacrificial layer at the same etch rate as the underlying dielectric. The sacrificial etchback technique is well documented, and is generally valid only for the planarization of dielectric topographies in which the underlying features are less than 10.0 microns apart. For large regions between trenches, the step height will not be reduced, since the sacrificial material on top of such features will be the same as the thickness over the adjacent trench. In an effort to overcome the shortcomings of sacrificial etchback, a planarization block masking technique is often used. In this procedure, a liquid material is applied and developed as a planarization film followed by a block mask used to expose and develop this film. The block mask is arranged to protect topography in wide low regions from subsequent etch material. Thus, the planarization block mask allows removal of elevationally high regions commensurate with the protected low regions. Unfortunately, the planarization block mask involves an additional lithography step and a mask which must be produced and aligned with the underlying topography.
A more recent planarization process called chemical-mechanical polishing ("CMP"), overcomes to some extent the limitations of sacrificial etchback and block masking. CMP involves the application of an abrasive slurry and a pad across the entire topography. CMP forces planarization of that topography commensurate with the planarity of the pad surface. Provided the pad surface is relatively flat, the surface would be translated to the interlevel dielectric surface. Unfortunately, however, when force is applied to the pad, the pad will oftentimes conform to the unevenness of that topography. Thus, while high elevational areas (or peaks) receive substantial polishing, low elevational areas (or valleys) are also slightly abraded and removed.
A better understanding of the problems inherent with CMP are illustrated in reference to FIGS. 1 and 2. FIG. 1 depicts a partial cross-section of a semiconductor topography 10. Topography 10 includes a substrate 12 having a level of interconnect 14 fashioned thereon. Interconnect 14 comprises a plurality of substantially coplanar conductors 14a, 14b, and 14c. A relatively small lateral space 16a is formed between conductors 14a and 14b, and a relatively large lateral space 16b is formed between conductors 14b and 14c. Spaces 16 causes a disparity in the upper surface of a subsequently deposited interlevel dielectric 18. Accordingly, dielectric 18 must be planarized in a subsequent processing step shown in FIG. 2.
FIG. 2 illustrates a planarization technique using, for example, CMP. Specifically, the upper surface of interlevel dielectric 18 receives the slurry and polishing pad. The polishing pad inherently flexes or conforms under pressure to the upper surface of dielectric 18, causing the polishing pad to attack and remove dielectric 18 upper surface in large space areas 16b. Accordingly, an upper surface which has large valley areas will retain those valley areas after CMP. An upper surface having, on the other hand, numerous small valley areas will be more optimally planarized in accordance with that shown herein below. It would be desirable, therefore, to reduce to zero the elevational disparity 20, shown in FIG. 2.
While a need exists for attaining global planarization in both large and small spaces, the need must apply to existing planarization processes. It would therefore be desirable to utilize existing planarization techniques, but with a focus upon achieving a more uniform interlevel dielectric upper surface prior to the planarization step. A more uniform dielectric upper surface which can be more readily planarized affords advantages of numerous levels of interconnect and thereby presents a more optimal multilevel interconnect structure. The interconnect structure and dielectric topographies must be equally applicable to either metal interlevel dielectric and polysilicon interlevel dielectric. Thus, an improved planarization process can be applied upon a dielectric upper surface arranged on the first level of interconnect (typically polysilicon) as well as subsequent levels (typically metal) to achieve an overall, globally planarized multilevel interconnect structure.

Mask generation technique for producing an integrated circuit with optimal polysilicon interconnect layout for achieving global planarization


A valve for controlling a fluid flow, including a valve housing, which is provided with a first fluid connection, a fluid channel and a second fluid connection, further including a valve member which is pivotally mounted in the fluid channel, and a drive for introducing a movement onto the valve member, the valve member having a rigid carrier and a flexible membrane with a sealing region which is provided for a sealing abutment against a valve seat and which is fixed to the carrier and to the valve housing by a circumferentially formed fastening region, wherein a deformation region of the flexible membrane is located between the sealing region and the fastening region and is arranged between a first deformation plane and a second deformation plane, the first deformation plane and the second deformation plane each being aligned parallel to a pivot axis determined by the pivot pin and delimiting a deformation space, and wherein the pivot pin is accommodated at least partially in the deformation space.

The invention relates to a valve for controlling a fluid flow, comprising a valve housing which is provided with a first fluid connection and with a second fluid connection and with a fluid channel between the first fluid connection and the second fluid connection, further comprising a valve member, which is pivotably mounted with a pivot pin in the valve housing between a sealing position and a release position, and with a drive for introducing a movement onto an upper side of the valve member, wherein the valve member comprises a rigid carrier and a flexible membrane which is connected or fixed by a sealing region to an underside of the carrier, which underside is oriented opposite to the upper side of the carrier and which flexible membrane is connected or fixed to the valve housing by a circumferential fastening region, wherein a deformation region of the flexible membrane is formed between the sealing region and the circumferential fastening region of the flexible membrane, wherein the sealing region is provided for a sealing abutment against a valve seat formed in the fluid channel opposite the underside of the carrier when the valve member is in the sealing position.
From DE 698 19 715 T2, a valve having an inlet and at least two outlets for a fluid such as a liquid or a gas is known, each of said outlets being provided with a valve seat associated with a membrane adapted to cooperate with said valve seats, said membrane having a dimension larger than that necessary to bear on each of said valve seats. Further, an actuating arrangement is provided for actuating the membrane so that the membrane bears on the valve seats for selective operation of the valve. In this regard, the membrane is configured such that when it is engaged with one of the valve seats, it is disengaged from the other of the valve seats. In addition, an activation arrangement is provided for displacing the membrane such that a new, at least partially unused portion of the membrane is exposed to the valve seat engaged with the membrane.


A power element package includes a semiconductor chip, radiating members, a mold resin member, a lead terminal for control signals, and lead terminals for large electric current. On a heat accepting surface of the radiating member, an insulating layer and a conductive layer are disposed. The lead terminal for control signals is electrically connected with a gate of the semiconductor chip through the conductive layer. An emitter of the semiconductor chip is electrically connected through a solder connection member with a non-insulating portion of the heat accepting surface.

A semiconductor power element used in an inverter circuit for driving an automobile motor is available as a power element package integrated with a mold resin, where a power element is sandwiched between heat sink plates of radiating members (refer to JP-A-2001-156225 or USP-2003/0132530 A1). The power element includes an IGBT (Insulated Gate Bipolar Transistor) as a typical power element. The power element of the IGBT is sandwiched between the heat sink plates while an emitter or collector of the power element is connected using solder with the heat sink plate directly or via a spacer. Here, the heat sink plate functions as a path of a large electric current. A gate (control electrode) of the power element is electrically connected with a lead terminal for control signals that is outwardly protruding from the mold resin via a bonding wire. The power element is thus constructed as a power element package. A plurality of the power element packages is assembled to constitute a module of inverter circuit.
In addition, increase of the dimensions of the heat sink plate is proposed to further reduce thermal resistance of the power element package. This proposal involves problem in connection structure where a power element is connected using the boding wire, as explained above, with a lead terminal for control signals to the power element. Here, to maintain connection reliability a wire length is required to be at most 10 mm. The wire length of more than 10 mm potentially involves, during the resin molding, mutual contact between the adjoining wires or breakage of the wire. The connection structure using the bonding wire is therefore improper for increasing the dimensions of the heat sink.

Molded semiconductor device with heat conducting members


A process for the dehydrogenation of ethylbenzene to styrene with input of heat by a heat-transfer medium on a dehydrogenation catalyst which is essentially located in a tube bundle, wherein the heat-transfer medium flows countercurrently to the reaction mixture in the region of the tube bundle, and, if required, another reaction chamber is located downstream of the tube bundle and is provided with a catalyst for adiabatic reaction.

Various processes have been disclosed for the industrial dehydrogenation of ethylbenzene to styrene (Ullmanns Encyklopadie der technischen Chemie, 4th edition, Vol. 22, page 298). In practical use is the adiabatic process which is usually carried out in two radial-flow reactors which are connected in series, with intermediate heating or feeding in of steam, and which are operated adiabatically, and the isothermal process in which a tube bundle reactor with indirect heat transfer is used. Steam is additionally used in this case too.
It is also known that the space-time yield of the isothermal process in simple tube bundle reactors in which only the tubes are filled with catalyst can be improved by having an adiabatic catalyst layer upstream (DE-A-1 059 437) or downstream (DE-A-1 290 130). DE-A-34 43 118 also describes a combination of an upstream and a downstream reaction zone operated adiabatically with a tube bundle reactor.
However, the feeding-in of a large amount of steam which has been preheated to a high temperature to initiate an adiabatic reaction has the disadvantage that precisely the advantage of the isothermal process, namely the operation with a low steam/ethylbenzene ratio is abandoned and part of the possible space-time yield is dispensed with.


An approach is provided in which the approach uses a scrolling agent to detect when a browser application requests a set of content from a content provider in response to the browser application receiving a request from a user. The scrolling agent issues a number of browser scroll commands to the browser application and receives sets of next content from the content provider accordingly. The approach searches the sets of next content based on a request invoked by the user and generates a set of search results that the approach provides to the user.

Infinite scrolling is highly trending as an interaction behavior on website pages and lists. Massive amounts of data are consumed with the popularity of social media and infinite scrolling offers users an efficient way to browse the information without having to wait for pages to load. Infinite scrolling is advantageous for websites that provide a relatively flat structure, where each unit of content belongs at the same hierarchy level and has a similar chance of being interesting to users.
A website enables infinite scrolling using a plugin that sends requests to a backend server to automatically send the next page of data when the user's scroll position is close to the bottom of a currently loaded page, such as when the scroll position is 80% down the page. By removing the burden of a user having to acquire and click the next page, infinite scrolling keeps the user engaged with the content and less focused on the mechanics of navigating to the next page.

International Business Machines Corporation


A coin hopper includes a rotating disc having recesses that receive and hold coins one by one; a moving body that is disposed at a position corresponding to the recess and moves reciprocally between a holding position and a push-out position; a cam groove including a first route having a substantially circular shape and a second route connected to the first route at first and second branch points and protruding toward the outer periphery of the rotating disc with respect to the first route; and a cam follower disposed in the cam groove provided on a back side of the moving body. The moving body is held at the holding position when the cam follower moves along the first route and moves reciprocally between the holding position and the push-out position when the cam follower moves along the second route.

1. Field of the Invention
The present invention relates to a coin dispensing apparatus that separates coins loaded in bulk one by one, in to a coin dispensing apparatus that separates coins loaded in bulk one by one, conveys the separated coins to a predetermined position and discharges the coins at the predetermined position individually. More specifically, the invention relates to a coin hopper suitably used when handling a plurality of kinds of coins different at least in outer diameter.
The term "coins" used in this specification includes coins as currencies, medals for game machines, substitutes such as tokens, and equivalents thereof.
2. Description of the Related Art
A plurality of kinds of coins that are different in outer diameter or thickness exist, and thus various kinds of so-called size-free coin handling apparatuses capable of handling the plurality of kinds of coins (that is, a plurality of coin denominations) are proposed. For example, the Japanese Non-Examined Patent Publication No. 2014-041396 (FIGS. 3 to 15, Paragraphs 0024 to 0044) and the Japanese Non-Examined Patent Publication No. 2014-120015 (FIG. 2, FIGS. 10 to 17, Paragraphs 0022 to 0040, 0076) disclose coin dispensing apparatuses that separate coins loaded in bulk one by one and deliver the coins individually.
Known as a first related art is a coin separating and delivering device such as that disclosed in the Publication No. 2014-041396. In this coin separating and delivering apparatus, coins are separated and held one by one on an upper surface of a rotating disc disposed in an inclined state in sorting recesses opening on an upper side and on a peripheral edge side thereof, and are delivered to a coin discriminating device. The sorting recesses each include a sorting recessed groove extending from a center to an outer periphery of the rotating disc, and a peripheral side opening and an upper surface side opening defined by a moving body. The moving body is disposed in the sorting recessed groove so as to make a linear reciprocal motion between a sorting position at a bottom portion in the sorting recessed groove and a coin push-out position on the peripheral edge side of the rotating disc. The moving body includes a pushing edge facing the peripheral side opening, and forms a holding recess surrounded by a left side wall and a right side wall of the sorting recess and an arcuate restricting member that surrounds an outer periphery of the rotating disc. The holding recess is formed to allow a single coin having the largest diameter to be positioned therein but not to allow two coins having the smallest diameter to be positioned side by side when the moving body is located at the sorting position. The moving body is driven by a driving device so as to move linearly toward the coin push-out position on the peripheral edge side in a predetermined phase of the rotating disc, then stay at the coin push-out position for a predetermined period, and then move linearly to the sorting position. The driving device includes a plate-shaped cam having a ring shape and disposed on the rotating disc in a fixed manner, and a pair of cam followers positioned inside and outside of the plate-shaped cam integrally with the moving body.
According to the coin separating and delivering device disclosed in the Publication No. 2014-041396, when the rotating disc rotates in a forward rotating direction, the moving body moves linearly from the sorting position toward the coin push-out position in a predetermined phase of the rotating disc, is maintained at the coin push-out position for the predetermined period, and then moves from the coin push-out position to the sorting position. In contrast, in the same manner as the case where the rotating disc rotates in a reverse rotating direction, which is a direction opposite to the forward rotating direction, the moving body moves from the sorting position to the coin push-out position, is maintained at the coin push-out position for the predetermined period, and moves from the coin push-out position to the sorting position. In other words, the moving body moves reciprocally in a predetermined phase range of the rotating disc, in other words, in a phase where the coin is delivered from the coin separating and delivering device to the next process between the sorting position and the coin push-out position irrespective of the rotating direction of the rotating disc.
In the coin separating and delivering device disclosed in the Publication No. 2014-041396, if coin jam occurs in the next process where the coins are delivered, the rotating disc rotates reversely to return the coins from the next process to the separating and delivering device in order to resolve the coin jam. However, the moving body moves reciprocally between the sorting position and the coin push-out position in a predetermined phase range irrespective of the rotating direction of the rotating disc. Therefore, even in the process of returning the coin, a coin is pushed out from the rotating disc to the next process in association with the movement of the moving body from the sorting position toward the coin push-out position. Consequently, since the conveyance of the coin back from the next process to the rotating disc is hindered by the coin pushed out from the rotating disc, a problem that the coin jam is not resolved remains.
A second related art is a coin hopper disclosed in the Publication No. 2014-120015. This coin hopper includes a sorting panel disposed in a bottom hole of a storage chamber where coins are stored in bulk and having circular through holes formed therein. The coins are dropped down from an upside through the through holes by a rotation of the sorting panel, and pushing bodies provided on a back side of the sorting panel push coins in a direction toward a circumference of the sorting panel at a predetermined position one by one. A coin holding plate having substantially the same diameter as the sorting panel is disposed below the sorting panel at a predetermined distance therefrom. The coin holding plate is disposed coaxially with and parallel to the sorting panel to form a coin holding space. The sorting panel is also provided with passages extending toward a circumference thereof which are formed on the back side thereof, continue to the coin holding space, and extend in the direction toward the circumference of the sorting panel. The passages extending to the circumference are each defined by a front guide member positioned in front of the sorting panel and a rear guide member positioned in the rear of the sorting panel in a direction of the forward rotation. When the sorting panel rotates in the forward rotating direction, the pushing bodies are each movable at a predetermined timing between a coin push-out position located in the coin holding space right below the corresponding through hole and a waiting position located on an axis of rotation side of the sorting panel laterally of the through hole and hidden under the sorting panel. The pushing bodies each move gradually from the waiting position toward the coin push-out position, reach the coin push-out position at a position corresponding to the predetermined position, and move gradually toward the waiting position after the arrival to the coin push-out position, so that the coins are moved from the through holes toward the circumference of the sorting panel through the passages extending to the circumference thereof.
The coin hopper disclosed in the Publication No. 2014-120015 is configured to allow the pushing body to move between the waiting position and the coin push-out position at a predetermined timing when the sorting panel rotates in the forward rotating direction. Specifically, the pushing body moves from the waiting position to the coin push-out position, pushes the coin held in the coin holding space from the sorting panel, and then moves from the coin push-out position to the waiting position at a predetermined timing. In contrast, when the sorting panel rotates reversely, the pushing body is held at the waiting position in a range where the pushing body moves between the waiting position and the coin push-out position when the sorting panel rotates in the forward rotating direction. A cam is disposed under the sorting panel, and the cam followers guided by the cam are fixed to the pushing bodies. The cam includes the cam followers, a groove cam that guides the cam followers when the sorting panel rotates in the forward rotating direction, and a reverse rotation groove cam that is branched from the groove cam and guides the cam followers when the sorting panel rotates in the reverse direction. The reverse rotation groove cam has an end on a downstream side in the reverse rotating direction of the sorting panel. Accordingly, when the sorting panel is rotated reversely, the cam follower reaches the end of the reverse rotation groove cam after a predetermined time period has elapsed, and the reverse rotation of the sorting panel is hindered. Therefore, even though the sorting panel is rotated reversely in order to resolve, for example, coin jam occurred in the coin hopper or in the next process of the coin hopper, the period of the reverse rotation of the sorting panel is short, and thus the problem that the coin jam is not resolved remains.


A man's underpants having a penis of the wearer received in an arc-shaped groove of the soft penis separator so as to separate the penis and scrotum from each other, thereby preventing the contacting portion between the penis and scrotum from humidity and odor and also preventing the penis from being moved or inserted between the flesh inside of the thigh during exercising or sitting for long time.

Generally, in case of a man's underpants, when the wearer exercises or has been sitting down for many hours, the penis of the wearer moves, so that it can rub with the flesh inside of the thigh or adhere to the scrotum, thereby being humidified and having a bad blood circulation.
Recently, in order to improve the problem, Korean Utility model registration No. 20-0248 175 discloses a man's underpants in that a pocket cloth having a penis outlet for inserting the penis upward is formed inside the underpants by means of sewing and a compressing band formed at the pocket cloth transversely. The penis and the scrotum of the wearer are separated from each other by the compressing band during wearing thereof, thereby the penis of the wearer can face the lower abdomen of the wearer.
As shown in FIG. 1 and FIG. 2, the conventional man's underpants include a penis outlet 2 for exposing the penis of the wearer outside formed at the front of the underpants 1 transversely, upper and lower pockets 3a and 3b for dividing the exposing area of the penis into upper or lower portion fixed to the front of the penis outlet 2 by sewing, gaps 4 for taking out the penis from the underpants 1 formed at both sides of the pocket cloths 3 cross the penis outlet 2, and a compressing band 5 for supporting the boundary area between the penis and the scrotum formed at the pocket cloth transversely in front of the penis outlet 2 and the gaps 4.
Accordingly, the penis and the scrotum of the wearer are separated from the inside of the underpants 1 and the penis of the wearer faces the lower abdomen of the wearer in an erected state. Also, the penis and the scrotum of the wearer are separated from each other through the compressing band 5, so that it can prevent the penis from being leaned toward the flesh inside of the thigh.
However, when the pocket cloth 3 is formed at the inside of the underpants 1 through sewing such that the penis faces the lower abdomen of the wearer in an erected state, since the separated upper and lower pockets 3a and 3b and compressing band 5 should be formed at the pocket cloth 3, it is difficult to make the underpants 1. Also, it is troublesome in that the penis should be put in the pocket upwards using the hand of the wearer.
Also, since the pocket cloth 3 is located at the inside of the underpants 1 in the form of a lining, the scrotum of the wearer should be inserted into the pocket cloth while widening it with the hand of the wearer. Moreover, the compressing band 5 formed at the pocket cloth transversely can compress the penis and scrotum of the wearer. Accordingly, there is a problem in that it is very hard to wear it.


A condition determination system includes: an operation condition data obtaining unit that obtains operation condition data indicating an operation condition of a facility; and a determination unit that determines, based on the operation condition data, a level of a phenomenon that occurs due to the operation condition of the facility.

When a disaster, such as a severe accident in a nuclear power plant, occurs, disaster measures offices are set up in various related places, and measures are taken. When a disaster occurs, decision-making for measures may be supported by use of a decision-making support system. Examples of the decision-making support system are disclosed in Patent Literature 1 to Patent Literature 3. Further, techniques for managing information at the time of a disaster are described in Patent Literature 4 to Patent Literature 6.

Condition determination system, condition determination method, decision-making support system, computer program, and storage medium


The present invention provides an assembly for extending the bed of a pickup truck, having a hitch receiver and a down folded tailgate past the end of tailgate and providing a ramp function. By supporting the assembly by both an attachment to the hitch receiver and supporting the assembly on the down folded tailgate the assembly can support more weight and at greater distances and angles the previous bed extenders and ramp combinations.

1. Field of the Invention
The present invention relates to a pickup truck bed extender with a ramp. In particular, it relates to a bed extender and ramp capable of extending the bed past normal ramps and extenders and supporting heavy duty equipment.
2. Description of Related Art
Pickup trucks are generally used for transporting both light weight and heavy weight objects. A particular problem is that the bed of a pickup is limited in length and in addition it is difficult to place heavy objects, such as equipment or the like, into a truck bed. One solution has been to remove the pickup truck tailgate or to travel with the gate in the down position. However, this presents problems as objects longer than the bed or down tailgate are not supported underneath.
Further, the ability to support heavier objects has not been addressed with the myriad of pickup truck ramp/extenders. Typically, they support the ramp on one of the attachments to a trailer hitch, cables to the truck body, the bumper or the like. While this provides some support it is only lightweight support and does not provide much horizontal support, if at all, past where the tailgate ends or would end if there were a tailgate.
In U.S. Pat. No. 6,250,874 there is disclosed a cargo ramp which does not extend the bed and is supported entirely by placement in the trailer hitch. It is designed to be used in conjunction with the tailgate in the down position. The ramp extends at quite a distance and suffers from such poor weight distribution that only light weights will prevent the hitch being torn off the truck during use.

Heavy duty cargo bed extender with ramp for pickup trucks


The present invention relates to a system for capturing and storing speech data records comprising:. means for storing parts of a speech data record in a plurality of form fields; PA1 means for the user to input form field indicators; PA1 means for recognizing form field indicators;. wherein the system is operable to store speech data in a speech data record in the form fields according to said indicators.

Work has been done on organising voice recordings in the form of storage folders on a computer system. Several research projects and products have demonstrated how computer-based, digital voice files can be edited using a graphical editor. Either the whole file, or sections of the file, can be moved or copied into folder areas to aid subsequent retrieval. Documented examples are Hindus, D., Schmandt, C., and Horner, C. 1993, Capturing, Structuring and Representing Ubiquitous Audio in ACM Transactions on Information Systems, 11(4), October, pp. 376-400 and Stifelman, L. J. et al 1993, "VoiceNotes: A speech interface for a hand-held voice notetaker", Proc. InterCHI 1993, ACM, New York.
Applicant's earlier European Patent Application No. 679005 discloses a system in which a visual representation of voice data is displayed and iconic tags are used to automatically store associated parts of speech data in predefined storage areas.
Work has also been done on creating index points in voice recordings. It has been shown how index points can be stamped on voice recordings to aid subsequent retrieval of interesting sections of audio. This is common in consumer electronics products such as hi-fi cassette recorders. The paper by Degen, L., Mander, R., and Salomon, G. 1992, "Working with Audio: Integrating Personal Tape Recorders and Desktop Computers", Proc. CHI 1992, ACM, New York discusses a system where the user can associate index markers with a voice file. A system such as described in IBM Technical Disclosure 36/09B (September 1993) "Method of categorising phone messages into message logs" allows searching within the voice file for a specific keyword or phrase.
There has also been work done on eliciting voice input in a structured, form-based manner. Certain telephone answering services generate voice prompts to structure a caller's voice message (an example is described in the paper by Schmandt, C. and Arons, B., 1985, "Phone Slave: A Graphical Telecommunications Interface", Proc. Soc. Information Display, 26(1)). In effect, the caller is filling in a verbal form in response to questions such as:
"What is your name? (BEEP)"; "What are you calling about? (BEEP)"; etc. PA1 means for storing parts of a speech data record in a plurality of form fields; PA1 means for the user to input form field indicators; PA1 means for recognising form field indicators; PA1 a plurality of storage areas for storing speech data records; PA1 means for inputting storage area indicators; PA1 means for recognising storage area indicators;
Such services are becoming popular because they simplify the task of listening to message enquiries and routing them to the correct destination within a company.

Speech data storage organizing system using form field indicators