A manufacturing method of a minute structure having fine structures on opposing inner surfaces, includes the steps of forming a first pattern in a surface of a first layer, forming a sacrificial layer on the patterned surface of the first layer, forming a second pattern on a surface of the sacrificial layer, forming a second layer on the sacrificial layer and a portion of the surface of the first layer, and removing a member constituting the sacrificial layer. In the step of forming the first pattern on the first layer and the step of forming the second pattern on the sacrificial layer, the patterns are formed using the same alignment marks as references. This manufacturing method can realize highly accurate alignment even when plural lenses or DOEs are used.

In recent years, semiconductor devices in which a resin structure is provided on a semiconductor element by using a semiconductor process have increased. For example, an MLA (microlens array) and a DOE (diffraction optical element) are known in which a lens is formed on an image sensor such as a CCD or a CMOS in an integral manner.
In particular, plural MLAs or DOEs are used frequently for complex processing for increase in focusing efficiency, color difference correction, or the like. For employing plural MLAs or DOEs, the alignment accuracy and its adjustment during manufacture are important.
Patent Document 1 entitled "Diffraction Optical Element and Optical System Using It" discloses a method for improving the wavelength dependency of the diffraction efficiency using diffraction optical elements that are accumulated in two or more stacked layers on a substrate. In this document, a technique is introduced in which the edges of each diffraction grating can be caused to assume obtuse angles by chamfering the edge portion of each grating portion, whereby the processability of a grating shape at the time of cutting or the like and the shape transferability at the time of molding of edge portions are increased. Patent Document 1: Japanese Unexamined Patent Application Publication No. H11-223717

Minute structure and its manufacturing method


Invasive side-firing electrohydraulic lithotripsy probes that creates a substantially annular shockwave to break up concretions are disclosed. Generally, the side-firing electrohydraulic lithotripsy probe includes a lithotripter tip including a first electrode and a second electrode. The first electrode is positioned at a distal end of the lithotripter tip and the second electrode is positioned in the lithotripter tip such that an end of the second electrode is coaxially aligned with an end of the first electrode. An electric arc between the first and second electrodes causes a shockwave to radiate radially from the lithotripter tip.

Electrohydraulic lithotripsy has been used in the medical field, primarily for breaking concretions in the urinary or biliary track. Conventional lithotripsy probes produce a shockwave that radiates axially from a distal end of the lithotripsy probe. While a shockwave radiating axially from a distal end of a lithotripsy probe is useful in breaking up concretions such as a kidney stone, it is often difficult to use these types of probes to break up annular concretions, such as concretions around a heart valve. Accordingly, improved lithotripsy probes are desirable for breaking up concretions that are not located axially from a distal end of a lithotripsy probe.

This patent is subject to a terminal disclaimer.

Radially-firing electrohydraulic lithotripsy probe


The hold member has a small-diameter portion and a large-diameter portion. An inner cylinder and an outer cylinder are disposed around the hold member in a concentric manner. The upper end of the hold member is affixed to a wire and suspended therefrom. A clearance is formed between the small-diameter portion and the inner cylinder. Clearances are created between the outer peripheral surface of the inner cylinder and the inner peripheral surface of the outer cylinder.

1. Field of the Invention
This invention relates to a seed-crystal holder installed in single-crystal pulling devices, which is used for holding seed crystals while applying a magnetic field to a melted liquid, such as silicon melted liquid, and pulling single crystals therefrom.
2. Description of the Related Art
Conventionally, in the process of pulling single-crystal ingots such as silicon single-crystal ingots, a seed crystal 10 is brought into contact with melted liquid 6 and magnetic field is applied laterally to melted liquid 6 by means of the magnets 8, then the seed crystal 10 is rotated to pull the semiconductor ingot 60.
The essential requirements for a seed-crystal holder adapted to hold seed crystals are superior heat endurance and adequate weight. If it has not enough endurance, single crystal contaminated with the material of the seed crystal holder. If it is too light, it is not capable of obtaining a stable rotation of the seed crystal holder. Several materials such as molybdenum and graphite meet the above requirements. However, the drawback of such conductive materials as molybdenum and graphite is that a braking torque having a tendency to stop the rotation of the seed-crystal holder is produced along with the electric current induced by electromagnetic induction of magnetic field. The magnitude of the electric current induced depends on the magnetic-flux density of the magnet field, the rotation speed of the seed crystal, and the conductivity of the material of seed crystal holder. The higher magnetic-flux density, rotation speed and conductivity, the larger magnitude of the lectric current and the breaking torque.
There are several ways to overcome the brake torque problem, such as "SEED-CRYSTAL HOLDER FOR SINGLE-CRYSTAL PULLING DEVICES WITH MAGNETIC FIELD APPLIED THEREON" disclosed in EXAMINED JAPANESE PATENT PUBLICATION HEI 5-11077. The body of the seed-crystal holder is made of non-conductive materials such as ceramic, and thus electromagnetic induction is eliminated.
However, if the body of the seed-crystal holder is made of non-conductive materials such as ceramic whose specific gravity is less than that of molybdenum, then the weight of the seed-crystal holder becomes about 1/3 of that of a conventional one. Such light-weight seed-crystal holders is not applicable to handle the increased weight load resulting from the enlargement of the diameter of each semiconductor ingot, and steady rotation can not be obtained.
In other words, the cable for suspending the seed-crystal holder must be thicker accompanying with increased diameters of semiconductor ingots. If a light seed-crystal holder is installed on a cable that is thicker than conventional one, the cable can not be kept in the state of being vertically suspended. That is the cause of rotational wobbing of the seed crystal holder. Then, the ingot grown becomes bent, and it proves impossible to control of its diameter.

Seed-crystal holder for single-crystal pulling devices with magnetic field applied thereto


In an example embodiment, an integrated circuit (IC) comprises a device die having a top-side surface and an under-side surface, the top-side surface having bond pads connected to active circuit elements, the under-side surface having a conductive surface. A first set of lead frame clips having upper portions and lower portions, are solder-anchored, on the upper portions, to a first set of bond pads; the lower portions are flush with the conductive surface. Wires are bonded to an additional set of bond pads opposite the first set of bond pads and to lower lead frame portions of a second set of lead frame clips opposite the first set of lead frame clips; the lower lead frame portions of the second set of lead frame clips are flush with the conductive surface. The device is encapsulated in a molding compound leaving exposed the conductive surface and underside surfaces of the first and second sets of the lead frame portions.

The electronics industry continues to rely upon advances in semiconductor technologies to realize higher-function devices in more compact areas. For many applications realizing higher-functioning devices requires integrating a large number of electronic devices into a single silicon wafer. As the number of electronic devices per given area of the silicon wafer increases, the manufacturing process becomes more difficult.
Many varieties of semiconductor devices have been manufactured having various applications in numerous disciplines. Such silicon-based semiconductor devices often include metal-oxide-semiconductor field-effect transistors (MOSFET), such as p-channel MOS (PMOS), n-channel MOS (NMOS) and complementary MOS (CMOS) transistors, bipolar transistors, BiCMOS transistors. Such MOSFET devices include an insulating material between a conductive gate and silicon-like substrate; therefore, these devices are generally referred to as IGFETs (insulated-gate FET).
Having manufactured a number of electronic devices on a wafer substrate, a particular challenge is to package these devices for their given purpose. As the complexity of portable systems increases, there is a commensurate need to reduce the size of the individual components which make up the system; the system often is laid out on a printed circuit substrate. One way to reduce the size of individual components is through techniques that reduce the size of packages which contain these devices. There is a need for packaging which reduces the amount of printed circuit substrate space consumed. Further, in reducing amount of consumed space, the power-handling capabilities of the package/device assembly must also be enhanced.


The present invention relates to a heel cushion structure for a sneaker capable of adjusting the characteristic of the sneaker flexibly. The main body of the heel cushion structure is provided with plural separable elastic elements, so that the wearer is able to selectively screw different functional separable elastic elements according to personal needs. Thus, the wearer can selectively use the elastic elements according to personal needs. The cushion effect of the heel cushion structure of the sneaker can be adjusted by changing the separable elastic elements. Thereby, the present invention is truly a heel cushion structure that can flexibly adjust the characteristics of the sneaker.

1. Field of the Invention
The present invention relates to a heel cushion structure for a sneaker which is stalled at the lower edge of the rear of the sneaker, and more particularly to a heel cushion structure which is capable of flexibly adjusting the cushion effect of the sneaker.
2. Description of the Prior Arts
A sneaker is normally provided at its heel portion with an elastic element which is capable of supporting the wearer's weight and cushion the pressure. Vary kinds of elastic units used on the sneaker have become the sneaker producer's selling point. Hence, how to make a better elastic element that can satisfy the wearer's needs has become the most important thing in the sneaker manufacturing trade.
Most of the sneakers on the market are installed in its heel portion with an integral heel cushion structure which is made by elastic ejection, so that the heel block is able to support the weight and to produce a cushion effect. The preferable design is to make an air chamber (so-called air sneaker) inside the heel block. However, this conventional design still has some problems which are explained as follows:
First, the function, the characteristic and the elastic force of the conventional heel cushion cannot be changed once the sneaker is produced. However, different wearers with the same foot size may have different weights. In this case, the sneaker cannot satisfy different wearers' needs who have the same foot size (for example: heavy weight wearer should wear the sneaker with relatively hard heel cushion, and the light weight wearer preferably wear the sneaker with relatively soft heel cushion).
Second, after a certain time of use, the heel cushion of the sneaker will lose elasticity and supporting force gradually (the heel cushion with air chamber will also lose supporting force after the ambient structure is fatigued), especially, the heel cushion with air chamber is likely to be punctured by a sharp object and lose the cushion effect. For this reason, the wearer has to desert the sneaker, so that the problems are arisen, for example, the service life of this conventional sneaker is shortened, the wearer's money is wasted, and even causing an environmental protection problem. If the structure of the heel cushion is enforced (by strengthening the ambient structure), then the elasticity of the heel cushion (or the heel air cushion) will be weakened.
Third, a professional athlete has to wear different sneakers with different function and elasticity according to different situations, such as the ground, the landform and even the weather. Therefore, many different sneakers must be prepared, and this is inconvenient to carry.
The present invention has arisen to mitigate and/or obviate the afore-described disadvantages.


A method and handheld electronic device for detecting and providing notification of a device drop are provided. In accordance with one embodiment, there is provided a method for detecting and providing notification of a device drop on an electronic device, comprising: measuring acceleration using an accelerometer of the electronic device; monitoring for and detecting freefall events in accordance with the acceleration measurements; and issuing an alert when a freefall event is detected.

Handheld electronic devices are easily lost due to their small size and the variety of places and situations where such devices are carried and used. It is not uncommon for a device user to lose his or her device when it falls out of a pocket, bag, carrying case, holster, etc. Unless the device user hears the device hit the ground or feels the device slip away, the device is likely to be left where it falls. While solutions exist which allow users to attempt locate lost devices, these solutions are only useful after the device loss has been discovered by the user. Often significant time has past since the device has been lost and the device user can attempt to recover the device. This increases the chance that the lost device will not be recovered, and inconveniences the user even when the device can be recovered due to the lost time without the device, and the time and cost associated with retrieving the device or having the device delivered to the user.
Thus, there remains a need for improved device notification systems, and more particularly to improved methods and handheld electronic devices for detecting and providing notification of a device drop.

Method and handheld electronic device for detecting and providing notification of a device drop


The invention relates to a surgical instrument comprising a handling part and a tool part that encompasses at least one movably mounted tool which is actuated via a force-transmitting and/or actuating mechanism. Said force-transmitting and/or actuating mechanism is operated from the handling part and is provided with a fluid-operated drive unit. In order to improve said surgical instrument such that the same can be operated with as much sensitivity as possible, the movably mounted tool can be impinged upon a first actuation force in a first driven position while being impinged upon by at least one second actuation force in a least one second driven position with the aid of the drive unit.

The present invention relates to a surgical instrument comprising a handling part and a tool part, wherein the tool part comprises at least one movably mounted tool, which is actuable by means of a force-transmitting and/or actuating mechanism that is operable from the handling part, and that the force-transmitting and/or actuating mechanism comprises a fluid-operable drive unit.
Surgical instruments of the initially described type are known for example in the form of bone punches for the removal of bone, cartilage or similar tissue. The drawback of the known bone punches is that sensitive actuation of the movably mounted tool by means of the fluid-operable drive unit is either possible only to a limited extent or even totally impossible. The reason for this is that the drive unit can either be loaded with a fluid flow of specific pressure or not. This however has the disadvantageous consequence that, in the event of actuation of the actuating mechanism, the instrument is generally transferred abruptly from an inoperative or basic position into a working position or vice versa. This may lead for example to a bone punch removing, not a desired tissue area, but a tissue area lying adjacent thereto.
Therefore, it would be desirable to provide a surgical instrument of the initially described type which may be operated as sensitively as possible.


The present invention relates to a coating composition and a pigment dispersant comprising aldimine having the formula ##STR1## wherein R.sub.1 is alkyl, aryl, cycloaliphatic or substituted alkyl, aryl, cycloaliphatic or heterocyclic group, and R.sub.2 is monomeric or polymeric aliphatic, aromatic, arylaliphatic or cycloaliphatic group which may contain O, N, S, or Si.. The coating composition further comprises:. b) an isocyanate compound having ubetdione functionality, PA2 c) at least one moisture absorbing compound, and PA2 d) acid catalyst,. wherein the coating composition demonstrates increased pot life and decreased dry time.

1. Field of the Invention
The present invention relates to aldimine based coating compositions, aldimine based pigment dispersions, and coating compositions containing the aldimine dispersions.
2. Description of the Prior Art
It is known in the art to use dialdimines, diketimines and hindered diamines to modify polyol compositions to decrease overall viscosity of a polyol composition, while maintaining and improving network building and overall physical properties. This is disclosed in Mormile et al. U.S. Pat. No. 5,214,086.
It is known in the art to utilize coating compositions comprising aldimines and isocyanates containing uretdione functionality. This is disclosed in Patent GB 1, 064, 841, to Haggis. However, coating compositions comprising aldimines and uretdiones exhibit problems of short pot life, due to moisture in the coating system introduced by solvents, impurities in the system, hydration of pigments or fillers and atmospheric moisture. The presence of moisture in the system requires introduction of moisture scavengers that slow down dry time. It is an object of the present invention to provide coating compositions containing aldimine and uretdione isocyanates with improved pot life and to provide a method for improving the pot life of these coating compositions. It is a further object of the invention to improve dry or cure times for these coating compositions.
An additional object of the present invention is to provide pigment or filler dispersions comprising aldimine for use in a coating composition including isocyanate having uretdione functionality and coating compositions comprising these pigment dispersions.

Aldimine based coating compositions and pigment dispersions


A microtome (1), having a knife (9) for sectioning a specimen (5) for subsequent microscopic examination, is described. The microtome (1) comprises a cooled specimen holder (2) for receiving the specimen (5), the specimen holder (2) being connected to a coolant circuit (3). Additionally associated with the specimen holder (2) is a cooled thermal conduction plate (4) that can be placed over the specimen (5).

Microtomes for sectioning frozen or cooled specimens comprise a special cooling device. The samples to be sectioned are cooled, in this context, to a specific predetermined temperature. The temperatures are as a rule between −10° C. and −50° C. To ensure a constant temperature, either the microtomes are arranged in complexly encapsulated cryostat chambers and the latter are appropriately cooled, or separate refrigeration devices are provided that can be attached to the microtome. A microtome having a cryostat chamber and a refrigeration device is presented, for example, in DE 44 34 937 C1 and its counterpart U.S. Pat. No. 5,711,200. In this document, the entire cryostat chamber is cooled by way of the refrigeration device.
A temperature regulating device for the specimen receptacle in a cryostat microtome is disclosed in DE 94 21 559 U1. Associated with the specimen receptacle is a specimen head on which the specimen to be sectioned can be mounted. The specimen receptacle is equipped with cooling hoses for cooling the specimen head and the specimen.
The company document "LEITZ 1512 Rotationsmikrotom, Anleitung, Liste [Rotary microtome, instructions, list] 311.530-047, April 1981, Ernst Leitz Wetzlar GmbH" discloses a microtome (Leitz 1512) having an attachable, separate "Kryomat 1700" cooling unit. Here a freezing chamber having a coolant connector hose is mounted in the specimen clamp of the microtome. The specimen stages with the samples are slid onto the freezing chamber and cooled there.
The above-described devices for sectioning cooled or frozen samples have proven successful in practical use.
With very thick specimens or specimens embedded in paraffin, however, it has been found that the heat generated by the sectioning operation at the surface of the specimen cannot be dissipated quickly enough. The result is that the sample begins to thaw in the region of the sectioned surface, and the sectioning temperature is thus no longer optimal. For this reason, in practical use the specimens are removed from the specimen receptacle and brought back to the requisite temperature on separate cooling plates. This procedure is of course very time-consuming, since each specimen change necessitates a realignment of the specimen with respect to the knife edge.


The present invention relates to an extendable vehicle rack arrangement (10) comprising a first and a second load carrier foot (3, 4) and comprising a stationary part (12) attached to said first and second load carrier foot (3, 4) and a displaceable part (11). The stationary part (12) is pivotally connected to at least one of the load carrier feet (3, 4). The extendable vehicle rack arrangement (10) is advantageously an extendable vehicle top rack arrangement. The present invention provides for a solution which effectively reduces or neutralizes the intrinsic forces which can be imparted to an extendable vehicle rack arrangement during or after attachment to a vehicle, thereby providing an easier extension of the displaceable part (11).

Car top rack systems, or roof rack arrangements, can be of the static type, having no movable parts, or of the slideable type, having an extendable load carrying surface. An extendable roof rack arrangement is disclosed in the published patent application WO 2005/44618, which discloses an extendable cross bar system. The extendable cross bar system comprises a stationary portion and an extendable portion. A sliding low friction pad is arranged between the stationary portion and the extendable portion to reduce the friction between these portions.
Another vehicle roof rack system is disclosed in the patent publication AU 2003231667 A1. This document discloses a solution which incorporates an inner and outer member, the inner member being slideable to an extended position. The vehicle roof rack system comprises a special end section to provide a neat end cap for the aperture formed by the outer member. Both these documents are silent about the problems which arise when using slideable members in roof rack systems. The documents are further silent about the problems which can arise from the intrinsic forces imparted to the roof rack system e.g. from the load carrier feet.
Generally there are two different types of load carrier feet used in roof rack systems; clamp rack feet (including rack feets for rails) and fix point feet. A load carrier foot which uses a clamping force imparted between a support surface and a gripping member as primary attachment force is generally of the clamp rack type, and a load carrier foot which are cooperating with pre prepared positions on the vehicle, is generally of a fix point foot.
During attachment of a clamp rack load carrier foot to the roof of the vehicle, the clamp rack load carrier foot rests on the roof and a grip member engages a ledge on the vehicle. The grip member is thereafter forced in an upwardly by means of attachment means, such as a screw. The attachment means imparts a clamping force between the support surface and the grip member which retains the clamp rack load carrier foot to the roof of the vehicle. A problem with a clamp rack load carrier foot of this type is that this force also imparts the clamp rack load carrier foot with a force component which acts to rotate the clamp rack load carrier foot towards the roof of the vehicle, i.e. each clamp rack load carrier foot tend to force themselves towards each other during attachment. As a consequence, intrinsic forces are formed within the load carrying bar. This could manifest itself by that the stationary part of the roof rack system bends, i.e. forms an arc shape along its length. Such intrinsic forces severely affect the performance of an extendable roof rack system as the extendable part can stick on the arc shaped stationary part. Intrinsic forces imparted via the clamp rack load carrier foot could also arise from misaligned load carrier feet or a wrongly positioned or assembled load carrier foot.


A pivotable support shaft for connecting a display with a base member and supporting the display is disclosed. The support is designed to enable the display to have different postures in working condition and package and transporting condition. For example, in the working condition, the screen of the display may be pivotable between a pitch-up angle of about 20° and a pitch-down angle of about −20°, and in the package and transporting condition, the screen of the display may be pivoted down to a pitch-down angle of about −90° where the screen faces downwardly to reduce the package size and improve the transportation stability.

Displays, such as liquid crystal displays, are rotatably mounted on a base member by a pivotable support shaft. Support shaft assemblies available now generally have a fixed pivot range. i.e., they are able to pivot within a fixed range of pitch angle. However, it may be desired that the display have different postures in working condition and package and transporting condition. For example, in the working condition, the screen of the display may be pivotable between a pitch-up angle of about 20° and a pitch-down angle of about −20°, and in the package and transporting condition, the screen of the display may be pivoted down to a pitch-down angle of about −90° where the screen faces downwardly to reduce the package size and improve the transportation stability. This requires the displays having different pivot ranges which cannot be achieved by known support shaft assemblies.

Shenzhen Mindray Bio-Medical Electronics Co., Ltd.


Fire resistant glazing units, processes for the manufacture of such fire resistant glazing units, the use of fire resistant glazing units in construction, and constructions comprising such glazing units. A fire resistant glazing unit may include two panes of glass which are arranged together with a seal to enclose a fire-resistant interlayer. The seal is adapted to breach in the event of a fire causing increased pressure between the panes, releasing pressure before it can build up and cause a pane to break in an unfavourable manner.

Glazing, such as "insulated glazing units" (IGUs) and the like, is widely used in both domestic environments (e.g. in double-glazed windows for homes) and in industrial settings. Most types of glazing rely on glass panes for support and to provided transparency, but the vulnerability of glass to thermal shock means that such glazing is typically not well suited to environments where there is an inherent fire risk. To minimise fire safety issues, many countries impose safety regulations that specify a certain fire resistance that needs to be exhibited by glazing used in a particular location.
In much of Europe, regulations classify the fire resistance of glazing by the measurement of the minimum time for which the glazing maintains: (i) its structural integrity (termed E); (ii) its structural integrity and radiation reduction within specified limits (termed EW); and (iii) its structural integrity and insulation within specified limits (termed EI) when exposed to a fire. Standard tests to determine the classification of the fire resistance of glazing are known and typically involve exposing the one side of the glazing unit (the "fire side" or "hot side") to a fire and monitoring the integrity of the glazing, and/or temperature levels on the opposing side of the glazing (the "cold side") over time.
Fire resistant glazing in which the internal space between the glass panes is filled with an interlayer of aqueous fire-resistant gel (i.e. a hydrogel) are described in U.S. Pat. No. 4,264,681 B [SAINT GOBAIN], WO 2003/061963 [FLAMRO], and WO 2009/071409 [FLAMRO]. Fire resistant glazing comprising silicate based fire resistant interlayers are also known (for example WO 2008/084083 [PILKINGTON], WO 2008/053247 [PILKINGTON] and WO 2011/027163 [PILKINGTON]). These types of fire resistant glazing are commonly referred to either as glazing units or glazing laminates.
A known issue of many types of fire resistant glazing is that in some circumstances, associated with the type of fire and wider glazing system, when the glazing is exposed to fire, pressure can build up in the fire-resistant interlayer between the panes. This problem may occur in any fire-resistant interlayer which is intumescent (i.e. swells because of heat exposure) or produces gas when heated, and is a particular issue for gel interlayers which release water vapour in a fire. This water vapour is then itself heated resulting in high pressure steam between the glazing panes.
A high pressure between the panes means that when the fire side pane cracks due to heat shock, a relatively large amount of stored energy is released. Such an energy release can in particular circumstances cause mechanisms forming part of the glazing system to fail, with a concomitant loss of fire protection. For example, where the glazing system is a door, the door may open, or its hinges may detach, causing the door to fail. Alternatively, clips, beading or other fixings used in the glazing system may come loose, severely affecting its ability to resist fire.
Some efforts have been made to address the above issues. U.S. Patent Publication No. 2013/0196091 [SAINT GOBAIN] mentions a fire proof glazing comprising one or more glazing panes containing a defined local weakness. It is suggested that if pressure increases between the panes during a fire, these weaknesses may cause the fire side pane to break early, venting built up pressure.
However, glazing units that comprise a defined local weakness in one or more panes are inherently less durable than normal units, and may fail more easily during manufacture, installation or normal use. For example, such panes may crack more easily, or develop other flaws that hamper the ability of the glazing unit to resist fire, reduce the unit's operational lifetime (e.g. by allowing the ingress of air and moisture which might cause decomposition of the fire-resistant interlayer) or blemish the visual appearance of the unit.
It is an object of the present invention to address these issues and provide a fire-resistant glazing unit which mitigates issues caused by pressure build up in the interlayer between the unit panes without compromising the structural integrity of the panes themselves, which are not only key contributors to the fire resistance of the glazing unit, but are relied on for support and visual effect.


An on-line optical inspection and monitoring system is externally mounted to existing man way service access within the combustor housing. A replacement man way cover having an optical window is mounted to the combustor housing. One or more optical cameras are oriented so that the camera field of view (FOV) is directed through the man way cover optical window. The camera FOV is moved to plural positions within the combustion section, such as under control of an automated motion control system, and images are captured. Multiple images are combined to form a composite image, which may include an image of an entire transition within the combustion section. Visual images and/or infrared (IR) thermal images may be captured. Thermal image information is correlated with component temperature. Image information is utilized to determine vibration characteristics of the imaged components.

1. Field of the Invention
The invention relates to on-line optical monitoring within a gas turbine combustor section, and more particularly to an optical system and inspection method that mounts one or more optical cameras outside a combustor man way service access on a man way cover having an optical window. The external camera field of view is oriented through the optical window and captures images of combustion section internal components, such as transitions. Image information is used to inspect, monitor and/or map one or more of observable structural condition, vibration and/or temperature distributions within the combustor section.
2. Description of the Prior Art
Monitoring of steady state and transient temperature and/or vibration characteristics within a gas turbine combustor section, and especially the transition components, are desirable tools for turbine design, validation and operation. Those components are susceptible to induced temperature and vibration transient excitations caused by combustion gas dynamics. Given the efficiency and emissions criteria, the operation of gas turbines requires a balancing of design and operational approaches to maintain efficiency, meet emission standards, and avoid vibrational and/or thermal damage due to undesired combustion dynamics characteristics. Thus during gas turbine engine design and subsequent field operation it is beneficial to monitor either or both of combustion thermal and vibration characteristics, whether transient or steady-state, that may damage combustor components such as transitions.
In particular, on-line vibration and thermal monitoring of combustor transitions with instruments is difficult given the local pressure and temperature conditions within a combustor. Known combustion characteristic monitoring instrumentation include single thermocouples or thermocouple arrays oriented within the combustor, that associate temperature and/or changes in temperature with combustion characteristics. However, even an array of thermocouples only provides localized temperature information at discrete locations that may not necessarily be extrapolated to determine temperature conditions in other combustor locations that do not have thermocouples. On-line monitoring instruments embedded within the combustor section are subject to greater temperature and pressure environments than ambient conditions outside the combustor section. Embedded instruments are susceptible to damage from hot pressurized combustion gasses, reducing their potential service reliability, and lifetime. Failed embedded instruments require engine shutdown—hence service interruption—to facilitate their removal or replacement.
Other known gas turbine combustor section temperature and vibration monitoring instrumentation determine local characteristics at monitored sites. However, as with thermocouple arrays, the localized information obtained at discrete locations that may not necessarily be extrapolated to determine similar information in other combustor locations. Exemplary known localized temperature and vibration monitoring instrumentation sensors include: embedded pressure transducers (e.g., piezo-electric transducers); embedded and externally mounted accelerometers; and optical systems that associate flame luminescence with combustion thermoacoustic vibration characteristics. The previously cited commonly owned co-pending United States patent application entitled "System For Remote Vibration Detection On Combustor Basket And Transition In Gas Turbines", filed Aug. 22, 2012 and assigned Ser. No. 13/591,635 is directed to externally mounted photonic transmitters and receivers that reflect photons off combustor section internal surfaces and correlate the reflections with internal vibration characteristics. The externally mounted transmitters and receivers pass photons through optical windows affixed to inspection ports and the like. Other laser-optical sensors employing backscatter, diffraction or phase-Doppler principles have been proposed for monitoring cooling water injection content and droplet distribution within the combustor.
Thus, a need exists for an on-line gas turbine combustor section optical image monitoring system that is capable of inspecting, monitoring and/or mapping one or more of visual images, vibration and/or temperature distributions within the combustor section, such as along the length of a combustor transition.
Another need exists for an on-line gas turbine combustor section optical image monitoring system that is externally mounted to a gas turbine combustor without altering the housing structure.
Another need exists for an on-line gas turbine combustor section optical image monitoring system that scans and gathers image information along a substantial length of the combustor section from a single viewing location.

System and method for on line monitoring within a gas turbine combustor section


In a method, system, and computer-readable medium having instructions for adding directives for JavaScript files directly into source code, a source file for preprocessing is received and the source file is written in a client-side scripting language, the source file is parsed, directive information is identified within the source file, metadata is associated with the directive during preprocessing, metadata associated is retrieved with a preprocessed directive, a request to access metadata associated with a preprocessed directive in the source file is received and the preprocessed directive is the directive from the source file, and at least a portion of markup language is generated for a web page in accordance with metadata associated with the preprocessed directive in response to the request.

The subject matter discussed in the background section should not be assumed to be prior art merely as a result of its mention in the background section. Similarly, a problem mentioned in the background section or associated with the subject matter of the background section should not be assumed to have been previously recognized in the prior art. The subject matter in the background section merely represents different approaches, which in and of themselves may also be inventions.
In conventional database systems, users access their data resources in one logical database. A user of such a conventional system typically retrieves data from and stores data on the system using the user's own systems. A user system might remotely access one of a plurality of server systems that might in turn access the database system. Data retrieval from the system might include the issuance of a query from the user system to the database system. The database system might process the request for information received in the query and send to the user system information relevant to the request on a webpage. The rapid and efficient retrieval of accurate information and subsequent delivery of this information to the user system has been and continues to be a goal of administrators of database systems.
Oracle Corporation JavaScript™ (hereinafter JavaScript) is a programming language and/or scripting language that may be used with a web browser at the client-side (e.g. user system) to provide enhanced user interfaces and dynamic websites. Approaches to delivering JavaScript to the client-side include sending all of JavaScript for the website to client for every page delivered which may unnecessarily slow the delivery of information because all of the JavaScript may not be used on the webpage. Unfortunately, conventional database approaches might become inefficient if, for example, all of the JavaScript for a website is sent to the client for each webpage when a fraction of the JavaScript is utilized on the webpage.
Accordingly, it is desirable to provide techniques enabling a way to deliver JavaScript more efficiently to the user of the database system, and/or to improve efficiency of the database system.

Adding directives for JavaScript files directly into source code in a multi-tenant database environment


A negative ion source includes a plasma chamber, a microwave source, a negative ion converter, a magnetic filter and a beam formation mechanism. The plasma chamber contains gas to be ionized. The microwave source transmits microwaves to the plasma chamber to ionize the gas into atomic species including hyperthermal neutral atoms. The negative ion converter converts the hyperthermal neutral atoms to negative ions. The magnetic filter reduces a temperature of an electron density provided between the plasma chamber and the negative ion converter. The beam formation mechanism extract the negative ions.

This section is intended to provide a background or context to the invention recited in the claims. The description herein may include concepts that could be pursued, but are not necessarily ones that have been previously conceived or pursued. Therefore, unless otherwise indicated herein, what is described in this section is not prior art to the description and claims in this application and is not admitted to be prior art by inclusion in this section.
Ion sources are used across a wide range of applications including basic science research, medical applications, and semiconductor production. In many cases, the performance and reliability of very large, complex, and expensive systems is limited by the performance and reliability of the ion source, which often represents a relatively small part of the total system in terms of size and cost. Thus, advances in ion source technologies can lead to drastic improvements in system performance relatively quickly. However, ion sources are complex devices that often suffer from reliability issues when pushed to high currents, as is often demanded by the rest of the system.
Lifetime and reliability issues are especially troublesome for existing negative ion sources, such as negative hydrogen (H−) ion sources. Nonetheless, negative ion sources are still commonly used across a broad range of applications due to the fact that for many applications, downstream system components require negative rather than positive ions. Conventional negative ion sources may have, for example, a relatively short lifetime of only a few hundred hours. This lifetime decreases even further when operated at full power (e.g., 15 mA). Furthermore, conventional negative ion sources may encounter other problems including high power requirements (15 kW) and high gas load (18-20 sccm) on the downstream vacuum components.
A reliable, long lifetime negative ion source has applications in silicon cleaving for photovoltaic semiconductor applications, isotope production and separation, cyclotron injection systems, and accelerator mass spectrometry. Cyclotrons are widely used across medical and industrial fields. As technology continues to develop, it appears that ion source injectors could become limiting factors with regard to beam current and accelerator performance. There are several technical reasons why it is preferable to inject negative rather than positive ions into cyclotrons, and the low current and short lifetime of existing ion sources will potentially limit the performance of next-generation cyclotrons. Similarly, ion beams are used in a wide range of settings in the semiconductor industry. Better ion sources translate to cheaper, more efficient, and more effective production techniques for circuit components that are the building blocks of all modern IC-based technologies
In another example, the negative ion source may be used in the field of magnetic confinement fusion energy. For decades scientists have sought to develop an energy source based on nuclear fusion reactions, as it could potentially provide an essentially unlimited amount of clean energy with virtually no harmful byproducts. Though fusion energy technologies have advanced immensely over the past several decades, there are still a number of technical challenges that prevented the development of a clean fusion energy reactor. One challenge faced by fusion energy is unreliable high current negative ion sources. Existing negative ion fusion injectors use filaments and/or magnetically coupled plasmas that suffer from many of the deficiencies discussed above. A reliable, long lifetime negative ion source could drastically increase the ion source conversion efficiency, lifetime, reliability, and current output. Developing such a negative ion source could be a major step forward in developing a clean, reliable fusion energy source.
A need exists for improved technology, including technology related to a new type of ion source that can produce high DC current output (up to 10 mA) and have a long lifetime (greater than 1 month).

High reliability, long lifetime, negative ion source


An integrated communications link in a communications network that is provided with apparatus which allows dynamic allocability of bandwidth among a plurality of channels. At least three different types of information can be carried on these channels, and the bandwidth of these channels are dynamic so that it can be changed according to a determinable scheme. The link also sends error control information with a message that informs the receiver how the bandwidth is to be allocated, this error control information providing an extremely high level of assurance that the receiver of the information will know how the received information is to be allocated.

In today's world, there is a growing requirement for transferring different types of information over various distances via communications links. This information can be, for example, data generated by a computer, imaging data from a video camera, or any other of a number of different forms of data. This data often has to share the communications link with voice circuits that carry human conversations.
In modern communication systems, the carrying of multiple conversations over a common link is most frequently accomplished by the well-known methods of time division multiplexing (TDM) or frequency division multiplexing (FDM). One common multiplexing system is the American T1 system which has a link of 1.544 Mbit/sec that is divided into 24 slots of 64 Kbit/sec. This division is implemented by continuously sending "frames" of 192 bits. Each frame is divided into 24 slots, so that each slot has 8 bits. Since each slot can carry a different conversation, 24 different conversations can be carried simultaneously over the T1 system link, with 8 bits of each conversation transmitted every frame.
The different types of information (voice, data, image, etc.) that can be carried over a link have different transmission characteristics and requirements. For example, voice information (a conversation) is characterized by low to medium bandwidth and low latency. Latency is the period of time between the occurrence of an event and the time at which the event is recognized, while bandwidth is defined here as the bits transmitted per second. (Since a defined number of frames are transmitted per second, the number of bits allocated within a single frame will also be referred to as bandwidth). By contrast, computer data can have low to high bandwidth and relatively high latency. Image data can have extremely high bandwidth and low to high latencies.
As stated above, the different types of information must often be carried over the same link. There is, for example, at least one proposed system that provides an integrated network that carries both data and voice information over the same link. (For ease of description, all other types of information besides voice, such as computer data, image information, etc., will be henceforth referred to as "data".) This network is the Integrated Services Digital Network (ISDN), proposed as an industry standard.
The ISDN network allows both voice and data to be carried over the same link, with voice occupying some slots, and data occupying other slots, with at least one slot acting as a control slot. The information carried in the control slot tells the receiver how the slots in each frame are allocated, i.e., which slots are assigned to which receivers at any particular time. An example follows, with reference to FIG. 1.
The 24 slots of a frame carried by the ISDN system is shown in FIG. 1. The first slot is a slot for control, and is thus the control channel. The remaining 23 slots can be assigned to 23 different, simultaneous transfers of information. Each separate transfer of information is labeled a channel, so that the ISDN system can support up to 23 separate channels, and one control channel. However, each channel can occupy one or more contiguous slots.
The ISDN system suffers from a number of drawbacks. One of these drawbacks is its inflexibility in its allocation of slots. For example, assume that one type of information transfer needs higher bandwidth than can be provided by one slot. In the ISDN system, this is accomplished by grouping together a number of contiguous slots, to form a channel having higher bandwidth since each frame is now allocated to carry more information for that particular information transfer.
The requirement that the slots be contiguous for information carried over the same channel leads to inefficient use of the link in the ISDN systems. This is because certain allocations can cause, for example, only single slots to be available when a channel needs two or more contiguous slots. In such a circumstance, either the channel waits for two contiguous slots to become free, or a re-allocation must be performed. In either case, the link is being inefficiently used.
Another drawback to the ISDN system is the relatively long time it takes to change the allocation scheme of the slots When the allocation scheme is to be changed, the sender sends the receiver the new allocation scheme. Upon receipt of the new allocation scheme, the receiver will then send back an acknowledgment signal. The sender starts sending information according to the new allocation scheme only when it receives the acknowledgment signal from the receiver. During this whole time period, no useful information can be sent because both sender and receiver cannot be sure that the receiver has the correct new allocation scheme until after the sender receives the acknowledgment signal. When the link spans the entire country so that the propagation of the signals takes a relatively long time (30 m sec, for example), the acknowledgment method of changing the allocation scheme is undesirably slow.
A need therefore exists for an integrated network that can carry both voice and data over the same link, this network providing flexibility in its allocation of slots. The network should also be able to switch the allocation scheme very quickly and transparently, so that information can be transferred during the switching process.

Integrated communication link having a dynamically allocatable bandwidth and protocol for transmission of allocation information over the link


A high power light emitting device assembly with electro-static-discharge (ESD) protection ability and the method of manufacturing the same, the assembly comprising: at least two sub-mounts, respectively being electrically connected to an anode electrode and a cathode electrode, each being made of a metal of high electric conductivity and high thermal conductivity; a light emitting device, arranged on the sub-mounts; and an ESD protection die, sandwiched and glued between the sub-mounts, for enabling the high-power operating light emitting device to have good heat dissipating path while preventing the same to be damaged by transient power overload of static surge.

Light emitting diode (LED) is a semiconductor diode that emits incoherent monochromatic light when electrically biased in the forward direction, that LED is considered to be the next level of technology when it comes to a light bulb. LED development began with infrared and red devices made with gallium arsenide (GaAs) since 1960. Advances in materials science have made possible the production of devices with ever shorter wavelengths, producing light in a variety of colors such as LEDs made of aluminum gallium indium phosphide (AlGaInP) for emitting high-brightness orange-red, orange, yellow, and green. Recently, as the breakthrough of epitaxy technology, commercially viable blue LEDs based on the wide band gap semiconductor gallium nitride (GaN) were invented by Shuji Nakamura while working in Japan at Nichia Corporation in 1993 and became widely available in the late 1990s. They can be added to existing red and green LEDs to produce white light, though white LEDs today rarely use this principle. Most "white" LEDs in production today use a blue GaN LED covered by a yellowish phosphor coating that can be employed as the illuminating device of the future. Compared to incandescent lights, LEDs are of interest because of the inherent characteristics: (1) They are compact; (2) They have a very long life, offering high reliability; (3) They can be driven by low-voltage DC; (4) They can be modulated (turned off and on) at high speeds; (5) They have good color mixing ability, offering almost endless color changing possibilities; (6) The light produced thereby is highly directional; (7) They have good vibration resisting ability; (8) They can produce incoherent monochromatic light. In addition, LEDs are considered to be environmental friendly since there is no mercury contained therein as there are in fluorescence bulbs. However, there are still disadvantages of using LEDs that require to be overcome, which primary are as following: (a) LEDs are currently more expensive than more conventional lighting technologie, whereas the additional expense partially stems from the relatively low lumen output and drive circuitry/power supplies needed. (b) LED performance largely depends on the ambient temperature of the operating environment, whereas "Driving" an LED 'hard' in high ambient temperatures may result in overheating of the LED package, eventually to device failure, and thus adequate heat-sinking is required to maintain long life.
In order to enhance brightness, a high brightness LED requires a larger current, i.e. about 350 mA˜1000 mA, compared with conventional LEDs. However, the waste heat resulting from the high power operation must be effectively managed and dissipated, such that the luminescence efficiency of the LED can be enhanced while preventing the same from damaged by overheating. Currently, a LED fabrication process of flip-chip technology is commonly adopted for overcoming the problems of luminescence efficiency enhancing and heat dissipating, wherein the designing of an improved sub-mount is the focal point for improving heat dissipating ability of LEDs. There are already a variety of LED packages taking advantage of the forgoing flip-chip process and improved sub-mount.
Moreover, another LED package problem encountered is related to electrostatic discharge (ESD), that is highly probable to cause adverse affect on the quality and production yield of LED, and thus cause the production of high brightness LEDs to be more expensive. The reasoning is that LEDs can be damaged or degraded by human touch since there may be static electricity, as high as 2000V˜3000V, accumulated in a human body in dry ambient. In reality, the substrate of a red LED made of aluminum gallium indium phosphide (AlGaInP) is a semiconductor substrate, which has good conductivity and thus is capable of preventing the accumulation of static electric charges. On the other hand, blue LEDs, especially those made of InGaN, must be fabricated on a specific substrate by an epitaxy procedure, such as a sapphire substrate and a 6H—SiC substrates, for facilitating the formation of the InGaN crystal. Selecting between a sapphire substrate and a 6H—SiC substrate, the sapphire substrate is usually being adopted for fabricating a blue LED as it has characteristics superior to those of the 6H—SiC substrate. In addition to the cost of fabricating blue, green or white LEDs is much higher than LEDs of other colors, LEDs made of sapphire substrate is comparatively highly vulnerable to electrostatic discharge since sapphire is an insulation material that is easier to cause electrostatic effect comparing to red LEDs. Therefore, it is important to add certain ESD protection dies in LED packages.
ESD protection in conventional LED packages is realized by connecting a LED with a zener diode in a parallel-connection manner, that is illustrated in the circuitry shown in FIG. 1. When the circuitry of FIG. 1 is working normally while subjecting to a normal operating voltage, the high power LED 11 is subjected to a forward bias of about 3V˜4V and the zener diode 12 is subjected to a reverse bias. It is known that the breakdown voltage of a typical zener diode is about 7V, which is controlled by the doping density of the zener diode. Therefore, as the LED 11 is conducted to illuminate while subjecting to the normal operating voltage, the zener diode 12 is not conducted and waste no power. But, when a transient static of high-voltage is generated, which is ranged between 2 kV to 15 kV, both the LED 11 and the zener diode will be conducted, moreover, as the voltage of the static is exceeding the breakdown voltage of the zener diode 12, the resistance of the zener diode 12 will be far lower than the internal resistance of the LED 11 such that almost all the current resulting from the static will flow pass the zener diode 12, and thus the operating voltage is stabilized and the LED 11 is protected from the ESD.
There are already a variety of LED packages using zener diode for ESD protection. One such LED package is disclosed in U.S. Pat. No. 6,054,716, entitled "Semiconductor light emitting device having a protecting device", shown in FIG. 2. As seen in FIG. 2, a LED 53 is disposed at the bottom of the bowl-like structure 61 arranged on top of the leadframe 52a while a zener diode 55 is disposed at the top of the bowl-like structure 61. Since the LED 53 and the zener diode 55 are all connected by a wire bonding method, there are three bonding wires 66, 67, 68 and two pads 63, 65 arranged over the top of the LED 53, which are going to block the light emitting from the LED 53 and thus cause the brightness of the LED package to reduce greatly. In addition, as the LED 53 is connected to the bottom of the bowl-like structure 61 through its sapphire substrate 57, whose thermal conductivity is comparatively pretty low, i.e. about 25 W/m*K, such that the waste heat generated by the LED 53 can not be discharge smoothly. Therefore, the LED package shown in FIG. 2 is not suitable to be applied in high brightness applications.
Another such LED package is disclosed in U.S. Pat. No. 6,333,522, entitled "Light-emitting element, semiconductor light-emitting device and manufacturing methods thereof", shown in FIG. 3. As seen in FIG. 3, a LED 1 is mounted face-down on a zener diode 2′ by a flip-chip process, wherein the LED 1 is parallel-connected to the zener diode 2′ by connecting the p-side electrode 5′ of the LED 1 to the n-side electrode 8 of the zener diode 2′ while connecting the n-side electrode 6′ of the LED 1 to the p-side electrode 7′ of the zener diode 2′ and a p-type semiconductor region 21 of the zener diode 2′ is formed by selectively implanting impurity ions into an n-type silicon substrate 20. As shown in FIG. 3, The LED package is characterized in that a the LED 1 is mounted on leadframes 13a and 13b with the zener diode 2′ having p-side and n-side electrodes interposed therebetween, not directly on the leadframes, wherein the zener diode 2′ is die-bonded to the die pad with an Ag paste 14, while having an n-side electrode 9 on the back face thereof in contact with the die pad of the leadframe 13a; and the p-side and n-side electrodes 5′ and 6′ of the LED 1 are electrically connected to the n-side and p-side electrodes 8 and 7′ of the zener diode 2′ via Au microbump 12′ and 11′, respectively, while the p-side electrode of the zener diode 2′ is connected by wire bonding to the lead frame 13b via an Au wire 17. Since the connection of the LED package of FIG. 3 is realized by a flip chip process, there is no bonding wire crossing over the light emitting surface of the LED 1 such that the obstruction of light caused by the disposition of wires and bonding pads, as those shown in FIG. 2, can be prevented. However, the LED package of FIG. 3 still has shortcomings listed as following:                (1) Since the alignment of the LED 1 and the zener diode 2′ is difficult to realize, the production yield is difficult to increase.        (2) In order to prevent the overflow of the Ag paste 14, the thickness of the zener diode 2′ must exceed a specific thickness.        (3) The size of the Au microbumps 11′, 12′ must be small enough since over-sized Au microbumps 11′, 12′ might cause shortage between the n-side and p-side electrodes 8 and 7′ of the zener diode 2′.        (4) Since the sub-mount of the LED 1 is a silicon-based zener diode 2′ that its thickness is specified to exceed a certain limit, the heat dissipating ability of the LED package is not satisfactory comparing to those made of metal substrate with low thermal resistance.
Please refer to FIG. 4 and FIG. 5, which are respectively a schematic diagram showing a LED package of Lumileds Lighting, LLC., and a schematic diagram showing a circuit of the LED package of FIG. 4. The LED 7″ shown in FIG. 4 claims to be the brightest point light source currently available, that is fabricated by a principle similar to that of FIG. 3 as the sub-mounts of the two LEDs are all made of silicon, while enabling zener diodes 72 to be formed in the silicon sub-mount 71. The difference between the two LED packages is that a pair of zener diodes 72, arranged back to back, are formed in the sub-mount 71 for ESD protection, instead of only one zener diode being formed. In addition, instead of the leadframes of FIG. 3, the bottom of the LED 7″ is connect to a flat metal block 73 of high conductivity, such as copper or aluminum, that is employed as heat dissipating path and thus the overall thermal resistance of the LED package is reduce. Nevertheless, since the forgoing LED package still use silicon sub-mount, its thermal resistance, similar to that of FIG. 3, is still not satisfactory.
From the prior-art LED packages described above, one can conclude that current high power LEDs with ESD protection ability still have shortcomings as following:                (1) If the electrical connection of a LED is enabled using a wire bonding means, the heat generated thereby must be dissipated through its sapphire substrate of low thermal conductivity, such that the overall thermal resistance of the LED package can not be reduced.        (2) If the bonding wires and bonding pads are disposed at the discharging direction of the light emitted by the LED, not only the light emitted thereby is blocked, but also the light emitting area is decreased, and thus the brightness of the LED is reduced.        (3) Since the thermal resistance of conventional leadframe-type LED package is comparatively too large, a larger, thinner sub-mount is required for reducing thermal resistance of the overall LED package.        (4) If zener diodes are adopted as sub-mount of an LED package, the thickness thereof is restricted in order to prevent the overflow of silver paste such that thickness of the LED package can not be reduced.        (5) Although the heat dissipating efficiency of a silicon sub-mount is acceptable it is still inferior to that of metal substrate.
Therefore, an improved light emitting device assembly with ESD protection ability is required.

High power light emitting device assembly utilizing ESD protective means sandwiched between dual sub-mounts

Industrial Technology Research Institute


A liquid crystal display device includes an array substrate having a plurality of pixel electrodes in a matrix form, a counter substrate having a counter electrode opposed to the pixel electrodes, a liquid crystal layer including liquid crystal molecules disposed between the array and counter substrate, a first and second alignment layers, the first alignment layer disposed between the array substrate and the liquid crystal layer, the second alignment layer disposed between the counter substrate and the liquid crystal layer, and each of which are treated so as to give a predetermined pre-tilt angle to the liquid crystal molecules, and a shield electrode disposed a region applied a lateral electric field which is against to a direction of the pre-tilt angle. A potential difference between the shield electrode and the counter electrode is adjusted to a first potential difference during a first period, and the potential difference between the shield electrode and the counter electrode is adjusted to a second potential difference, which is smaller than the first potential difference, during a second period continuing after the first period so as to apply an alternating current voltage between the counter electrode and the shield electrode.

1. Technical Field of the Invention
This invention relates to a liquid crystal display device that has a pair of substrates and a liquid crystal layer as an optical modulating layer therebetween, and a method of driving the same.
2. Discription of the Related Art
In recent years, taking advantage of their thinness, light weight and low power consumption, liquid crystal display devices have been used in various fields as display devices for personal computers, word processors, and also as projection type display devices.
Active matrix type display devices having pixel electrodes, each of which is connected with a switching element respectively, can realize an excellent display image without crosstalk between adjacent display pixels, and have been studied and developed vigorously.
Herein after, it will be briefly explained that a construction, for instance, of a light transmission type active matrix liquid crystal display device. This liquid crystal display device provides an array substrate, a counter substrate, a liquid crystal layer coupled with alignment layers on each substrates.
The array substrate, for instance, provides a plurality of signal and scanning lines in a matrix form, thin film transistors (TFTs) as a switching element formed at the vicinity of each crossing points thereof, and pixel electrodes made of I.T.O.(Indium Tin Oxide) connected with the switching elements on a glass substrate.
The counter substrate provides a light shielding layer formed on a glass substrate so as to shield a light passing through peripheral areas of pixel electrodes and a light irradiating toward the TFTs, and a counter electrode made of I.T.O. and formed on the light shielding layer via an insulating layer.
Now, regarding to each display pixels of this liquid crystal display device, a pixel electrode potential (Ve) of the display pixel changes under the influence of a leak current through the TFT and parasitic capacities of the TFT. Therefor, it is necessary to provide a storage capacitor (Cs) parallel to the liquid crystal capacity (Clc) so as to reduce the pixel electrode potential change, and the following two structures are well known.
The first structure is that the storage capacitors (Cs) are constructed with storage capacitor lines arranged in parallel with the scanning lines on the grass substrate of the array substrate, the pixel electrodes of which a part is overlapped with the storage capacitor lines respectively, and an insulating layer formed therebetween.
The second structure is that the storage capacitors (Cs) are constructed with the scanning lines, the pixel electrodes of which a part is overlapped with the neighboring scanning lines, and an insulating layer formed therebetween.
The second structure has an advantage to realize a high aperture ratio comparing to the first structure because of its arrangement without the independent storage capacitor lines.
In the liquid crystal display device mentioned above, it has been known that reverse image regions, which can not be controlled to the normal display state, have occurred in area where lateral electric fields between electrodes on the array substrate are against a pre-tilt direction of liquid crystal molecules, and the liquid crystal molecules are aligned along with the lateral electric fields.
In FIG. 7, 103, 111, 121, and 151 indicate signal lines, scanning lines, and TFTs, respectively. A solid and dot arrow lines indicate rubbing treatment directions of alignment layers on the array and counter substrates, respectively. And a twisted nematic (TN) liquid crystal layer including liquid crystal molecules is held between the substrates and the liquid crystal molecules is twisted at 90 degrees between the substrates.
The lateral electric fields which are against the pre-tilt direction of the liquid crystal molecules have occurred between the pixel electrodes 151, and the signal and scanning lines 103 and 111 and the pixel electrode 151 adjacent thereto, and an oblique line region in this Figure becomes a reverse image region.
It will be understood by this Figure that the reverse image region may extend in the pixel electrode 151 in accordance with an intensity of the lateral electric fields.
To eliminate the occurrence of the reverse image regions, it has been known that a liquid crystal display device, for instance, provides the scanning lines each of which comprises an extended portion extended between the signal line and pixel electrode electrically shielding the lateral electric field generated therebetween.
The inventors have newly found out by their own study and investigation that the occurrence of the reverse image regions can not be eliminated, even if the structure mentioned above is introduced.

Liquid crystal display device and method of driving the same


An electrode plate for use in plasma etching, which includes a vitreous carbon material produced from a polycarbodiimide resin as a raw material, or from a phenolic resin and a polycarbodiimide resin each as a raw material.. The vitreous carbon material produced from a polycarbodiimide resin or from a phenolic resin and a polycarbodiimide resin, has no or substantially no pores and has a high strength. Therefore, it exhibits excellent properties when used in an electrode plate for plasma etching.

(1) Field of the Invention
The present invention relates to an electrode plate and a jig for use in plasma etching, which are used in the plasma etching of a wafer for production of a semiconductor integrated circuit.
(2) Prior Art
With the recent progress of the techniques for production of finer and more dense semiconductor integrated circuit, there has become increasingly important the plasma etching capable of forming a fine pattern on a wafer with high precision using parallel plate electrodes.
The material for the electrodes used in said plasma etching must have electrical conductivity, chemical stability, etc. As the material, there has been tried, for example, graphite. This graphite material is produced by mixing a coke or carbon powder with a binder (e.g., tar or pitch), molding the mixture and firing the molded material to graphitize it. Therefore, the material is difficult to produce so as to have a dense and homogeneous composition and, when fitted in a plasma etching apparatus as an electrode plate to conduct the plasma etching of a wafer, detaching of carbon particles from the electrode plate, occurs which accelerates the consumption of the electrode plate or stains the wafer (this hinders pattern formation).
Under such a situation, it is under investigation to use a vitreous carbon which has an isotropic composition and a high hardness, as an electrode plate for plasma etching. The vitreous carbon whose use as an electrode plate for plasma etching is currently being investigated, includes, for example, those produced as follows.
Japanese Patent Application Kokai (Laid-Open) No. 252942/1987 discloses an electrode plate for use in plasma etching comprising a high-purity vitreous carbon. According to the document, the vitreous carbon is produced by curing, in a plate form, a liquid furan resin, a phenolic resin, a mixture thereof, or a mixture of one of said liquid resins with a powder of same type curable resin and then firing the cured plate in an inert gas. According to the document, an example of such a vitreous carbon has a bulk density of 1.45 g/cm.sup.3, a porosity of 3%, a Shore hardness of 75, a bending strength of 580 kgf/cm.sup.2 and an elastic modulus of 2,430 kgf/cm.sup.2.
In the vitreous carbon produced by the above process, however, the pores formed during the molding step remain in the final product, or the volatile components are evaporated during the heat treatment step and thereby a large number of pores of large diameters (e.g., about 2 mm) are generated, as mentioned in Japanese Patent Application Kokai (Laid-Open) No. 285086/1991.
Also, Japanese Patent Application Kokai (Laid-Open) No. 285086/4991 discloses a vitreous carbon which is produced by basically the same process as in the above-mentioned Japanese Patent Application Kokai (Laid-Open) No. 252942/1987, that is, by subjecting a thermosetting resin (e.g., modified furan resin) to defoaming, curing the defoamed resin in a plate form and then firing the cured plate in an inert gas. This vitreous carbon as well has a porosity of 0.02-0.2%.
The above document makes no mention of properties other than porosity. However, the above vitreous carbon is presumed to have about the same properties as the vitreous carbon of the Japanese Patent Application Kokai (Laid-Open) No. 252942/1987 because it is produced using basically the same raw material and process as in the Japanese Patent Application Kokai (Laid-Open) No. 252942/1987.
Thus, in the conventional processes for production of vitreous carbon, water is generated by the dehydration reaction taking place in the curing step because a phenolic resin or a furan resin is used as a raw material; therefore, the formation of pores in the firing step for cured resin is inevitable. These pores, when the resulting vitreous carbon is used as an electrode plate for plasma etching, bring about an increase in specific surface area and reduction in oxidation resistance and strength.
Further in the vitreous carbons produced by the conventional processes, insufficient strength of the cured resin per se and the pores generated in the dehydration step pose a restriction in mechanical properties of said vitreous carbons.

Electrode plate and jig for use in plasma etching


A gas bag module comprises a gas bag with a gas bag wall having a front wall serving as an impact surface for an occupant, where, in an inflated state of said gas bag, the front wall has a centric orifice as a transition to an indentation. The indentation is formed by restraining a center section of the gas bag wall during inflation and preventing the center section from moving freely. The orifice is surrounded by a stabilizer defined by a closed ring in a region of the orifice and the stabilizer is a part separate from the gas bag wall.

Gas bag modules are known which comprise a gas bag with a gas bag wall having a front wall serving as an impact surface for an occupant, where, in an inflated state of said gas bag, the front wall has a centric orifice as a transition to an indentation. The indentation is formed by restraining a center section during inflation and preventing the center section of the gas bag wall from moving freely.
A gas bag shaped in such a manner offers a more comfortable restraining effect for the vehicle occupant than a conventional balloon-shaped gas bag, since the substantially annular restraint chamber effects a more gentle support of the vehicle occupant in a combined action with the non-inflated indentation (the orifice of which is of course designed such that the head of the vehicle occupant cannot come into contact with any vehicle parts). However, elaborate cuts are necessary to give the gas bag the desired shape in the inflated state, which results in high manufacturing expense.
It is an object of the invention to simplify the shaping of a gas bag for such a gas bag module.


A fitness apparatus includes a first frame, a second frame, a nose part, a linear elastic element, and a lever. The second frame and the nose part are coaxially and pivotally connected to the first frame. The nose part is swingly connected to the second frame. The lever drives the linear elastic element. The linear elastic element is extendedly bounced and blocked on the first frame. When the second frame pivotally swings against the first frame, the movable range of the linear elastic element will be constrained by the lever because of its high stiffness. In addition, the linear elastic element can stably bounce instead of hitting the inner wall of the first frame. Therefore, the fitness apparatus using the lever can prevent the linear elastic element from sounds of hitting and attrition, so as to achieve the purpose of low noise and increasing the life time of components.

1. Technical Field
The present disclosure relates to a fitness apparatus. More particularly, the present disclosure relates to a fitness apparatus employing a solid structure of lever.
2. Description of Related Art
In general, a fitness apparatus with multiple functionalities includes a repeatedly clamping-and-releasing frame to assist doing sit-ups, push-ups, or abdominal workouts, so as to achieve the purpose on single apparatus for providing multiple functionalities for physical exercises.
Conventional clamping-frame fitness apparatus utilizes a torsion spring or a linear elastic element to provide the restoring force. However, the torsion spring usually provides larger restoring force than required, which is not suitable for a user with smaller physical strength. The torsion spring can easily be elastic fatigued and deformed. Moreover, when a user wants to adjust the restoring force of a used torsion spring, the user would need to replace to a new one, and it is never an easy and convenient job. Therefore, conventional clamping-frame fitness apparatus cannot meet varies demands among all users. Furthermore, it is difficult for users to adjust the restoring force of the torsion spring by themselves. The usability of the conventional fitness apparatus is limited owing to difficulties on adjustment.
In addition, when the fitness apparatus uses a linear elastic element to provide the restoring force, a cable is utilized to directly or indirectly drive the linear elastic element. The cable has suitable restoring force. Users can adjust the restoring force of the torsion spring by themselves, so as to achieve the requirement on customization. Unfortunately, the structure of the cable is flexible. When the cable drives the linear elastic element, it needs more guiding component to direct the cable. Moreover, the cable cannot effectively block the displacement or swinging range of the linear elastic element, and it is easy to hit the other components of fitness apparatus due to large bouncing. The problem of collision noise and component wear will reduce the user's comfort, purchase intention and component life of fitness apparatus.


Methods and systems are defined that support, in a radio access network, measuring the latency between the radio access network and each respective access gateway of a plurality of access gateways. From these measurements, a list of access gateways, rank ordered from lowest to highest latency, is created. If the radio access network receives an incoming call indication designating that an associated incoming call is latency-sensitive, the radio access network will preferably assign the incoming call to an access gateway that is one with a measured respective round trip latency less than or equal to a median measured respective round trip latency. Additionally, the radio access network maintains a profile for at least some wireless communication devices that use its services. When the radio access network receives an incoming call indication for a wireless communication device, the radio access network preferably determines, from the wireless communication device's profile, if the wireless communication device has a history of heavy network usage. If the wireless communication device has a history of heavy network usage, the radio access network preferably assigns the incoming call to an access gateway that is one with a measured respective round trip latency greater than or equal to the median measured respective round trip latency.

In a wireless communication system, it is desirable for the system to maintain a high quality of service. One aspect of quality of service is the latency, or latencies, experienced by subscribers as they perform various tasks, such as surfing the web, initiating a push-to-talk (PTT) session, or initiating a voice over Internet Protocol (VoIP) call. For instance, the latency associated with initiating a VoIP call might be measured from the time the subscriber presses a "talk" button on his or her wireless communication device (WCD), to the time that the subscriber hears an indication that the VoIP call is connected, such as a ringing tone. If a subscriber experiences latencies that are too high, the subscriber may become frustrated with the service, which could lead them to complain about the service or even cancel the service. In order to maintain and expand its customer base, an operator of a wireless communication system may try to minimize the latency experienced by subscribers as much as possible. As more traditionally circuit-switched applications, such as PTT and voice telephony, are ported to packet-switched data networks, the operator needs to carefully manage the resources of the data networks to ensure that the latencies experienced by subscribers do not have a deleterious impact on the subscribers' perception of the operator's service.
Many wireless access networks comprise a radio access network (RAN) and a core network. The RAN includes base transceiver stations (BTSs), base station controllers (BSCs) and other devices that allow wireless communication devices (WCDs) to benefit from wireless data access. The core network includes a plurality of access gateways and other devices that route and manage packet data traffic. A function of the RAN is to select an appropriate access gateway for each incoming call from a WCD.
One method of access gateway selection, as described in Section 3.17.3 of the Third Generation Partnership Project 2 (3GPP2) specification entitled, "Interoperability Specification (IOS) for cdma2000 Access Network Interfaces—Part 3 Features," is as follows. The RAN maintains a list of candidate access gateways. Each access gateway in the list is typically indexed by one of the access gateway's IP addresses. For an access gateway list with N entries, the entries are sorted in ascending order of their IP addresses, and then numbered 0 to N−1 according to this sorted order.
Each WCD is assigned an International Mobile Subscriber Identity (IMSI), which is a unique number associated with the WCD, typically taking the form of the WCD's phone number. When an incoming call from a WCD arrives, the RAN extracts the four least significant digits from the WCD's IMSI and performs a modulo N hash function on these digits. The resulting number, which will be an integer between 0 and N−1 inclusive, is used to index the list of IP addresses. The access gateway with the IP address associated with the integer is selected to serve the incoming call, and the incoming call is then routed from the WCD to that access gateway. If the RAN determines that an access gateway is non-responsive or if an access gateway transmits an error message to the RAN, the RAN may remove the access gateway from the list.
This method attempts to balance the number of WCDs assigned to each access gateway through the use of the hash function. However, in doing so, the RAN does not take into account the current latency, or any other performance factors, of each access gateway.

Method and system for access gateway selection


A locking arrangement for interlocking two or more overlapped panels includes an outer panel having a locking tab at least partially covering a first aperture, the locking tab being connected at a base to the outer panel along a foldable portion. An inner panel has a retention tab at least partially covering a retention aperture, the retention tab being connected at a base to the inner panel along a foldable portion. The inner and outer panels are overlapped so that the locking and retention tabs are substantially overlapped with the foldable portions thereof in opposed relationship whereby the locking tab may be driven through the first aperture and the retention aperture to displace the retention tab into a mutually locked and braced position. The locking tab may be released from the locked and braced relationship by a pull tab struck from both the locking tab and the outer panel, the pull tab being connected to the locking tab and extending into the outer panel through the foldable portion.

The present invention relates to an arrangement for interlocking a two or more overlapped paperboard panels, such as is done in connection with paperboard cartons for packaging. More particularly, the invention relates to such an arrangement which includes means for releasing the locking arrangement when it is desired to remove the packaged product or products from the carton.
Locking arrangements for use in connection with paperboard cartons are well known. A simple punch-type lock can be seen by reference to U.S. Pat. No. 3,128,010. A locking tab is foldably connected to a first panel, while a second, underlying panel includes an aperture covered by a retention tab which is aligned with the tab. The tab is driven through the aperture to secure the panels together. An important consideration for locking devices of this type is retention of the locking tab in position. As can be readily recognized, it is important that the locking tab not be released when the carton is in use for carrying product. Many arrangements for securing the locking tab into its locked position are well known in the art.
A further example of a retention tab may be seen by reference to U.S. patent application Ser. No. 08/060,866. There, a top-gripping carrier for bottles is shown on which the bottles are secured by positioning of the bottle necks in apertures formed in upper and lower panels of the carrier. The bottle-receiving apertures are formed of a generally keyhole shape so that sliding movement of the upper and lower panels with respect to each other secures the bottles. The panels are in turn fixed into their relative positions by a punch-lock arrangement wherein a locking tab is driven into a receiving aperture.
It may be difficult or awkward for the purchaser of such a package to remove the bottles from the carrier for use. One possibility is to release the locking tabs and move the panels with respect to each other in a reverse operation of the packaging of the product. However, the locking tabs are designed not to be easily released to avoid unwanted opening of the package. The tabs are located in a relatively crowded portion of the package, being positioned near the bottle necks and several overlapped paperboard panels, making manipulation of the tabs difficult. Further, it is not immediately obvious to the user how the operation may be performed. A second alternative is to simply tear the carton, although the several layers of paperboard in close proximity to each other make even this approach difficult.
It is known to provide perforated tear strips in the walls of a paperboard carton to simplify release of the packaged product. However, this may reduce the strength of the carrier and assures that the carrier cannot be reused, for example, to carry empty bottles back to the point of purchase for recycling and/or refund.
What is needed, therefore, is an improved release means for use with locking arrangements for paperboard cartons. Such a means should be relatively easy to use and understand, but should not detract from the performance or appearance of the carton.

Panel locking arrangement with release means


A wearable computing device reads near-invisible one- or two-dimensional barcodes having a size of 100 microns to one millimeter. The device includes a magnifying lens, a digital camera, a processor, program memory and a wireless communication module, all supported on a wearable device body. The wearable device body may be an eyeglass frame, a watch body or wristband, a headband or sweatband or a cap or other headgear, among other possibilities. Applications of the wearable computing device include unattended shopping in a physical retail store.

Advances continue to be proposed in the fields of automation and data acquisition and management.
According to one recent development, an unattended retail store has been established. By "unattended" is meant that there is no checkout counter. Users who carry mobile devices running an appropriate application ("app") enter the store and collect items they wish to purchase. The store is equipped with numerous video cameras and image interpretation computing capabilities. The video cameras and computing capabilities are able to track and identify the user's movements and product items collected by the user and to generate a purchase transaction total accordingly. Payment information (e.g., credit card account) for the user is obtained by the store computing equipment based on communication with the user's mobile device app and/or via a card-on-file arrangement. The store computing equipment then can charge the purchase transaction total to the user's payment card system account.
One drawback with the unattended store as described above is the large number of cameras and/or other sensors required, and the resulting very high cost of constructing the store. It would be desirable to reduce the cost of providing an unattended retail store.
More generally, it would be desirable to improve systems for identification/authentication of individuals, and to improve systems for detecting and/or identifying objects viewed by individuals and/or present in their environment.

Nano-code-based reporting and authentication systems


An image recording apparatus includes a rotational tray including a supporting surface for supporting a recording medium and a retaining mechanism. The rotational tray is attached to the housing to be rotatable so that an angle between the rotational tray and a side surface of the housing is changeable. The retaining mechanism is able to retain the rotational tray in one of: an open state in which a second discharging slot formed in the side surface of the housing is opened and the recording medium discharged from the second discharging slot is supportable by the supporting surface; a closed state in which the second discharging slot is closed by the supporting surface; and an intermediate state between the open state and the closed state, in which the recording medium discharged from the second discharging slot can be guided in a direction along the supporting surface.

1. Field of the Invention
The present invention relates to an image recording apparatus.
2. Description of Related Art
A known printer includes a face-up sheet discharge tray provided on a side wall of a housing and a face-down sheet discharge tray provided on an upper wall of the housing. In such a printer, for example, an upstream conveyance passage and two downstream conveyance passages may be formed. The upstream conveyance passage passes an image formation position where image formation on a recording medium is performed by an image formation unit. The two downstream conveyance passages are connected to an end of the upstream conveyance passage and guide recording sheets to the two sheet discharge trays, respectively. The conveyance destination of a recording sheet conveyed on the upstream conveyance passage is switchable by a flapper between the two downstream conveyance passages. On each of these three conveyance passages, a conveyor roller (sheet discharge roller) is provided to convey recording sheets.
In the printer above, while the downstream conveyance passage for guiding a recording sheet to the face-down sheet discharge tray may be a curved conveyance passage having a curved part which is curved, the downstream conveyance passage for guiding a recording sheet to the face-up sheet discharge tray may be a linear conveyance passage which is substantially linear in shape. In this printer, a recording sheet with at least a predetermined degree of flexibility is discharged to the face-down sheet discharge tray via the curved conveyance passage. In the meanwhile, a recording sheet without at least the predetermined degree of flexibility is discharged to the face-up sheet discharge tray via the linear conveyance passage.
In regard to the above, in the printer above, when the leading end of a recording sheet is arranged to reach the conveyor roller on the downstream conveyance passage while an image is being recorded on that recording sheet, the conveyance force of the conveyor roller is applied to the recording sheet on which the image is being recorded. In this case, if the conveyance speed of the conveyor roller on the downstream conveyance passage is arranged to be equal to or higher than the conveyance speed of the conveyor roller on the upstream conveyance passage, the recording sheet is pulled downstream after the leading end of the recording sheet reaches the conveyor roller provided on the downstream conveyance passage. As a result, the recording position of the image on the recording sheet recorded by the image formation unit is deviated, and hence the quality of the image recorded on the recording sheet is deteriorated.
For this reason, in the printer above, the conveyance speed of the conveyor roller provided on the curved conveyance passage on which a flexible recording sheet is conveyed is arranged to be lower than the conveyance speed of the conveyor roller provided on the upstream conveyance passage. As the conveyance speeds are arranged in this way, when an image is recorded on a flexible recording sheet, the recording sheet is warped between the conveyor roller on the upstream conveyance passage and the conveyor roller on the curved conveyance passage, with the result that the recording sheet is not pulled downstream and hence the deterioration in the quality of the image recorded on the recording sheet is restrained. In this regard, the conveyance speed of the conveyor roller provided on the linear conveyance passage on which a recording sheet without at least the predetermined degree of flexibility is conveyed is arranged to be substantially identical with the conveyance speed of the upstream conveyor roller, because, for example, the recording sheet cannot be warped.
An image recording apparatus is preferably able to record an image on a recording sheet which is longer than a regular recording sheet. In the printer above, provided that the conveyance speed of the conveyor roller provided on each conveyance passage is arranged as described above, when a long recording sheet is discharged to the face-down sheet discharge tray via the curved conveyance passage, the amount of warpage of the recording sheet between the conveyor rollers is larger than the amount of warpage of a regular recording sheet. The inventor of the subject application has found that, when an image is formed at around the tail end of such a recording sheet by the image formation unit, the quality of the image recorded on the recording sheet is deteriorated on account of a large amount of warpage of the recording sheet.
In the meanwhile, when a long recording sheet is discharged to the face-up sheet discharge tray provided on the side wall of the housing, the deterioration in the quality of the image recorded on the recording sheet is restrained as compared to the case where the recording sheet is discharged to the face-down sheet discharge tray. However, a large space to which a long recording sheet is discharged must be provided at a side of the housing, with the result that the installation space of the image recording apparatus is large.