Biological nutrient removal (BNR) in municipal wastewater treatment to remove carbonaceous substrates, nutrients and phosphorus, has recently become increasingly popular worldwide due to increasingly stringent regulations. Biological fluidized bed (BFB) technology, which could be potentially used for BNR processes, can provide some advantages such as high efficiency and compact structure. This present invention incorporates the fixed-film biological fluidized bed technology with the biological nutrient removal in a liquid-solid circulating fluidized bed, which has achieved the simultaneous elimination of organic carbon, nitrogen and phosphorus, in a very efficient manner and with very compact space requirements. The BNR-LSCFB has two fluidized beds, running as anoxic/anaerobic and aerobic processes to accomplish simultaneous nitrification and denitrification and to remove carbonaceous substrates, nutrients and phosphorus, with continuous liquid and solids recirculation through the anoxic/anaerobic bed and the aerobic bed. The new BNR-LSCFB system is not only an excellent alternative for conventional activated sludge type BNR technologies but is also capable of processing much higher loadings and suitable for industrial applications.

Fluidization technology has been developed for close to one century from its first application to coal gasification by Winkler in the 1920s [1]. Since then, fluidized beds have been used for many different applications such as gas-liquid, liquid-solid, and gas-liquid-solid contactors and to carry out a variety of different processes as chemical and biological reactors.
The application of fluidized beds to the biological wastewater treatment processes originated from observations of denitrification, made whilst using activated carbon to remove organic compounds from chemically treated sewage in a fluidized bed [2]. Since then, biological fluidized beds (BFBs) have been investigated for carbon oxidation, nitrification, denitrification and anaerobic treatment, for a wide variety of waters and wastewaters [3, 4, 5, 6]. In contrast to conventional biofilm reactors, in which media are fixed, the media immobilized on particles in a BFB are suspended by drag force exerted by the upflowing wastewater. Hence, BFBs have the advantages of increased liquid-solid interfacial area, enhanced contact between liquid and media, and increased liquid flowrate.
Biological fluidized beds are usually liquid-solid fluidized beds or gas-liquid-solid fluidized beds when air is added to the system for aerobic process. Fluidization of liquid-solid systems is controlled by the liquid flow rate [7]. For a given liquid-solid system, the bed is initially fixed when liquid flow rate is lower than the minimum fluidization velocity, Umf. When liquid velocity exceeds Umf, the operation of the bed is transferred into the conventional particulate liquid-solid fluidization regime. In a conventional particulate liquid-solid fluidized bed, solid particles are nearly uniformly suspended in the liquid and are therefore in good contact with the liquid phase, with excellent interfacial mass transfer due to the continuous movement of the particles in the liquid and the drag exerted by the liquid. With a further increase of the liquid velocity, some particles begin to be transported out of the bed. At this time, the fluidized bed is in the transition from the conventional fluidization regime to the circulating fluidization regime [7, 8, 9, 10]. When the liquid velocity is sufficiently high, large quantity of particles are transported out of the bed. At this point, the bed has entered the circulating fluidization regime to form a circulating fluidized bed (CFB). Circulating fluidized bed (CFB) provides even higher liquid-solid contact mass transfer efficiency and higher liquid throughput than conventional fluidization. It also facilitates easy solid feed into and discharge from the beds. In the case of gas-liquid-solid (three-phase) fluidized bed, air or other gases is injected, normally at or near the bottom of the bed, to assist the liquid in fluidizing the solid particles. Gas passes through the bed as rising bubbles while interacting with the liquid and solid particles. Similar transitions occur from the fixed bed, to a conventional gas-liquid-solid (three-phase) fluidized bed, and then to a circulating gas-liquid-solid (three-phase) fluidized bed [11-13].
The advantages of BFBs can be utilized to increase the efficiency of wastewater treatment processes. Traditionally, the most conventional and widely used design for municipal and industrial wastewater treatment is the activated sludge (AS) process, which employs a primary clarifier, an aeration tank, and a secondary clarifier. Phosphorus removal is achieved by chemical addition and nitrogen is merely converted from the more toxic ammonia form to nitrates. The process is classified as a suspended-growth system in which microbes responsible for treatment are in suspension. "Fixed-film" bioreactors have some advantages over the conventional activated sludge process. In fixed-film bioreactors, bacterial films are immobilized on an attachment media rather than remain in suspension by themselves. Due to the immobilization of biomass on media, the loss of biomass by shearing is the only mechanism for the escape of biosolids in the bioreactor effluent. The sloughed biomass is mostly decaying biomass that has good settling characteristics and can be readily separated from the liquid [14]. The most salient advantage of fixed-film vis-à-vis suspended growth systems is higher biomass densities per unit volume, resulting not only in more compact bioreactor sizes but also better ability to handle shock organic loadings as well as mitigate inhibition and toxic impacts. Other advantages include enhanced retention of biosolids, and better sludge settling characteristics which affect sizing of secondary clarifiers. The most commonly used fixed-film processes in wastewater treatment are trickling filters, and rotating biological contactors (RBCS) [15]. Anaerobic filters [16] and aerated biological filters [17], are also used, albeit less frequently than trickling filters and RBCs. When the biofilm is immobilized on solid carriers, the advantages of biological fluidized beds (BFBs), such as increased liquid-solid interfacial area and enhanced contact between liquid and media, can be utilized to further increase the efficiency of the fixed-film bioreactors [18]. It should be noted that such biological fluidized beds fixed-film bioreactors are all operated in the conventional particulate fluidization regime, with relatively low liquid velocities.
These processes (suspended growth and fixed-film bioreactors including fixed-film BFB), however, can only achieve secondary effluent quality and additional treatment is required for nitrogen (N) and phosphorus (P) removals. To address the above problem and in response to increasingly stringent effluent nutrient criteria as a result of deteriorating surface water quality, biological nutrient removal (BNR) processes have become increasingly popular recently. In BNR processes, nitrogen and phosphorus can be removed simultaneously. These BNR processes, as shown in FIG. 1, are essentially suspended growth systems, which employ a combination of anaerobic, anoxic, and aerobic suspended growth biological reactors with or without primary clarification. BNR processes involve diverse microbial groups and utilize the ability of selected microbes, known as phosphorous accumulating organisms (PAO) to undertake luxury phosphorus uptake, whereby some of the phosphorus stored in the cells is released during anaerobic conditions to be followed by a greater phosphorus uptake during aerobic conditions. Furthermore denitrifying bacteria that can elicit oxygen from nitrates reduce the organic loading to be treated aerobically.
BNR processes are known to offer several advantages over the more conventional activated sludge processes, namely superior effluent quality, a significant reduction in aeration energy requirements due to utilization of formed nitrates to remove organic matter, improved sludge settling characteristics, a reduction in sludge quantities due to lower bacterial yields in the anoxic tanks, and the elimination/minimization of chemical sludge. Although BNR activated sludge systems require more process controls as compared to conventional activated sludge systems, advances in process controls and data logging capabilities have significantly reduced human requirements and thus both systems now require comparable operator attendance. Consequently these BNR processes offer significant savings in both capital and operation/maintenance cost, in addition to the advantages of BNR over conventional activated sludge systems and their ability to meet stringent total nitrogen and phosphorus effluent criteria.
On the other hand, however, the reliability of the activated sludge BNR process in response to influent changes both in terms of quantity and characteristics (i.e. COD —Chemical Oxygen Demand), N, P, COD/P and COD/N ratios) have been questioned to the extent that many BNR plants have standby chemical dosing systems for P removal. Incomplete denitrification and low food to microorganisms (F/M) ratio have been observed to cause filamentous bulking conditions in BNR activated sludge systems [19, 20]. In some cases, external sources of carbon may be required to achieve P & N removal, because of low concentrations of readily biodegradable organics.
In view of the aforementioned shortcomings of the suspended growth BNR processes, there is a need to develop more effective BNR wastewater treatment processes. It would be ideal if the BNR concept can be combined with the fixed-film BFB process so that advantages of both processes can be utilized simultaneously. So far, no BFBs (without the combination with BNR) have accomplished effective phosphorus removal without using some chemical methods [21, 22]. To the best of our knowledge, a reliable BFB fixed-film BNR process that simultaneously achieves biological phosphorus and nitrogen removal has not been developed. Although nitrogen removal by simultaneous nitrification-denitrification has been accomplished in biological filters [23] by alternating oxic and anoxic conditions within the filter, very low nitrogen removal efficiencies (˜20% influent nitrogen) have been achieved.
It would be very advantageous to provide a high-efficiency biological fluidized bed for simultaneous removal of carbon, nitrogen and phosphate. However, one of the key difficulties is how to arrange the three different processes, anaerobic, anoxic and aerobic processes, in an integrated fluidized bed system.

Liquid-solid circulating fluidized bed waste water treatment system for simultaneous carbon, nitrogen and phosphorus removal


A washing machine includes a laundry-detergent and fabric-softener drawer that can be pulled out of the machine. A movement assist device is provided that cooperates with the drawer so as to assist an opening and/or closing movement of the drawer. The movement assist device includes a scroll spring for causing a restoring force for an autonomous closing procedure of the drawer.

The state of the art describes laundry-detergent and fabric-softener drawers that cooperate especially with so-called mechanisms that assist the opening and closing movement of the drawer. Thus, for example, German patent DE 39 24 586 C2 discloses a washing machine having a movable laundry-detergent tray that has an electromagnetically actuatable drive means. Here, the drawer cooperates with a toothed rack which, in turn, engages with a toothed wheel that is driven by an electric motor. In this manner, the drawer is opened and closed by means of a control button in the front of the machine housing. A device of this kind is also known from German patent application DE 103 55 671 A1 as well as from European patent application EP 1 403 415 A2.
A drawback of these embodiments known from the state of the art is considered to be the fact that the production of the drawer is cost-intensive since it involves the additional motor with gears, which also calls for additional wiring, especially since more assembly work is required, whereby the laundry-detergent and fabric-softener drawer can only be operated when the washing machine is electrically connected.
U.S. Pat. No. 4,828,344 describes a furniture drawer that cooperates with assisting means for the opening and closing movement. A gear is used as the assisting means, comprising a toothed wheel that is mounted in the shaft and that cooperates with a toothed rack on the drawer. The toothed rack is made to rotate by means of a spiral spring, the teeth of the toothed wheel engaging in the teeth of the toothed rack on the drawer, thereby converting the rotation of the toothed wheel into a linear sliding movement. The spiral spring is completely wound up and secured when the drawer is pushed into the accommodation shaft. The spring is released by pushing on the drawer. When the spring is unwound, the toothed wheel is made to rotate, as a result of which the drawer is moved out of the shaft. However, the proper functioning of the gear requires that, if at all possible, no dirt should get into the teeth, since this could hamper or prevent the movement.

Washing machine with laundry-detergent drawer having means to assist an opening or closing movement


A coin processing device includes: a conveying unit that conveys a coin in a conveyance direction; first and second material sensors detect material of the conveyed coin to obtain material detection data; first and second position sensors detect a position of the conveyed coin to obtain position detection data; a correcting unit that corrects the material detection data based on the position detection data to obtain corrected material detection data; and an identifying unit that identifies the conveyed coin based on the corrected material detection data.

1. Field of the Invention
The present invention relates to a coin processing device.
Priority is claimed on Japanese Patent Application No. 2014-023673, filed Feb. 10, 2014, the content of which is incorporated herein by reference.
2. Description of Related Art
There is known a coin identifying device that detects magnetic data with a magnetic sensor based on a timing of detecting coins with a timing sensor, and identifies the denomination of a coin based on the magnetic data (for example, refer to Japanese Unexamined Patent Application, First Publication No. 2001-143119).
There is a coin processing device that adjusts the interval of opposing guide walls of a conveying unit to a passage width corresponding to the counting target denomination, and while conveying a coin between these guide walls identifies with a material sensor whether or not it is a coin of the counting target denomination and counts it accordingly. In this kind of coin processing device, there is a possibility of the identification accuracy decreasing when the adjustment accuracy of the interval between the opposing guide walls is insufficient.


An optical scanner includes a housing having first and second obliquely adjoining windows. Disposed in the housing is a laser for projecting a laser beam against a rotatable spinner having a plurality of mirrored facets for sequentially reflecting the laser beam to effect a scan beam. A plurality of pattern mirrors are optically aligned with the spinner for reflecting the scan beam through the first and second windows to effect a plurality of individual scan lines arranged in first and second patterns corresponding with the first and second windows. The pattern mirrors include a triad set of mirrors optically aligned in series between the spinner and the first window for scanning the first scan pattern to a back edge of the first window for scanning at least the back side of a multisided item.

The present invention relates generally to optical scanners, and, ore specifically, to a dual aperture optical scanner.
U.S. Pat. No. 5,229,588--Detwiler et al discloses an exemplary dual aperture optical scanner for reading a bar code positioned on the surface of an article or item. A laser diode projects a laser beam against a polygon spinner having a plurality of mirrored facets which reflect the laser beam in sequence against various pattern mirrors for producing scan lines which project outwardly through horizontal and vertical apertures or windows. The pattern mirrors are arranged in sets of primary and secondary mirrors specifically oriented in space for generating specific scan lines. As the spinner rotates during operation, the scan beam traces the pattern mirrors in sequence for generating a finite number of scan lines. By mounting each facet of the spinner at a different elevation angle, corresponding, parallel sets of scan lines may be generated from the same sets of mirrors.
Each item has several sides and is typically in the form of a rectangular box having six sides including a front side facing the vertical window, an opposite back side, a bottom side facing the horizontal window, an opposite top side, and leading and trailing sides defined by the relative swiping of the item across the windows. A typical bar code includes a series of varying width alternating bars and spaces arranged in a conventional manner, such as a one-dimensional Uniform Product Code (UPC), for recording suitable data such as identity of the item to which it is attached. The bar code is printed on a label which may be mounted on any of the six sides of the item.
By using a dual aperture scanner, more sides of an item may be illuminated with scan lines for increasing the performance of the optical scanner for reading variously positioned bar codes irrespective of the sweeping orientation of the item past the windows. In this way, bar codes may be read with more accuracy and reliability over a greater range of item orientation in space to thereby increase throughput of the items being scanned.
A bar code may be positioned on the item in either a ladder orientation with the bars being spaced apart vertically on the item in a ladder fashion, or in a picket orientation with the bars being spaced apart horizontally in a picket fence fashion. In order to properly read a bar code, a scan line must traverse in sequence the alternating bars and spaces, and therefore ladder bar codes and picket bar codes require different orientation of the scan lines for effecting a successful read thereof.
In a practical configuration of dual aperture optical scanners, a finite number of pattern mirrors and spinner facets may be used to produce a finite number of scan lines which defines the total scan budget. The pattern mirrors are suitably configured and positioned in the limited volume of the scanner housing to produce scan lines of various orientation through the horizontal and vertical windows for reading ladder and picket bar codes over a preferred range of item orientation relative to the windows.
The pattern mirrors are therefore disposed to generate a first pattern of scan lines through the horizontal window, and a second pattern of scan lines through the vertical window which splits the scan budget for covering various sides of the item. The first scan pattern in the horizontal window is configured for scanning at least the bottom side of the item, and the second scan pattern through the vertical window is configured for scanning at least the front side of the item, with limited leading and trailing side coverage of the item also being provided by these two windows.
In U.S. Pat. No. 5,229,588 identified above, the vertical window provides a scan line pattern for scanning both ladder and picket bar codes from the front side of the item. It also provides scan lines for scanning ladder bar codes on the leading and trailing sides. And, the scan line pattern from the horizontal window is effective for scanning bar codes on the bottom side of the item. It also provides scan lines for scanning picket bar codes on the leading and trailing sides. However, this dual aperture scanner lacks the ability to scan the back side of the item, including ladder bar codes thereon.
Accordingly, it is desired to provide an enhanced dual aperture optical scanner effective for additionally scanning the back side of an item, with improved leading and trailing side coverage for ladder bar codes.


Techniques for enabling relay assisted peer discovery in a wireless communication network are disclosed. A relay may receive, from at least one user equipment (UE), at least one hashed expression to transmit. Further, a relay may compute a time dependent hash of the at least one hashed expression to transmit. The relay may broadcast, and the second UEs may receive, the time dependent hash of the at least one hashed expression. The UE may be, for example, an eNodeB. The hashed expression may be a time varied hashed expression.

I. Field
The present disclosure relates generally to communication, and more specifically to techniques for supporting peer-to-peer (P2P) communication.
II. Background
Wireless communication networks are widely deployed to provide various communication content, such as voice, video, packet data, messaging, broadcast, etc. These wireless networks may be multiple-access networks configured to support multiple users by sharing the available network resources. Examples of such multiple-access networks include Code Division Multiple Access (CDMA) networks, Time Division Multiple Access (TDMA) networks, Frequency Division Multiple Access (FDMA) networks, Orthogonal FDMA (OFDMA) networks, and Single-Carrier FDMA (SC-FDMA) networks. A wireless communication network may also be referred to as a wide area network (WAN).
A wireless communication network may include a number of base stations (also referred to as evolved node Bs, eNodeBs, or eNBs) that can support communication for a number of user equipments (UEs). In a WAN, communication by UEs typically occurs via uplink/downlink channels between the UEs and a base station. A UE is thus enabled to communicate with a base station.
However, if two UEs are in the vicinity of each other, they may be enabled to communicate directly, that is, without communicating through the base station. A UE may thus be enabled to communicate peer-to-peer (P2P), also referred to as device-to-device (D2D), with one or more other UEs.
It may be desirable to efficiently support P2P communication for UEs, such as to enable new types of services, to improve available services, such by eliminating interference, and/or to reduce the traffic load on base stations.


An optical reproducing apparatus that uses a hologram laser module and is applicable to a DVD Multi drive, wherein five sub spots of light in total that are most suitable to perform the differential push-pull tracking both for DVD-RAM and for DVD-R/RW are irradiated on the disk, respectively, and influence of several sub spots that are unnecessary in recording and reproducing a disk is canceled out by calculation, to realize an optical head that is compatible with the DVD Multi drive using a hologram laser module, and thereby providing a small-size, high-performance optical reproducing apparatus.

1. Field of the Invention
This invention relates to an optical disk apparatus, and more particularly to an optical head technology whereby plural classifications of optical disks are reproduced.
2. Description of Related Art
As commercial optical disks of a current size of 120 mm, there stand abreast a variety of standards such as DVD-ROM, DVD-RAM, DVD-R, DVD-RW, CD-R, and CD-RW in addition to the conventional music CD and CD-ROM according to the difference in recording density, capability of recording, erase, and rewriting, reliability, and distinction of application. A problem has been pointed out that these existing plural standards introduce confusions among common users, and recently optical disk apparatuses in conformity to a standard called "DVD Multi," indicating capability of recording and reproducing all of these optical disks, have been released as commercial products.
As one of differences among the above-mentioned plural classifications of optical disks, first there can be enumerated a difference in wavelength between CD systems and DVD systems. In the beginning of release of DVD, to achieve compatibility in reproducing CDs on DVD apparatuses, the apparatus used a red semiconductor laser expressly meant for DVD. However, since CD-R in which reproduction wavelength is limited to the same infrared wavelength as the conventional CD has become popular rapidly, such an apparatus that has both the red semiconductor laser and the infrared semiconductor laser in it and uses the infrared semiconductor laser for the CD systems has become established generally.
As other differences, there can be enumerated differences in shapes of a pit sequence and of a guide groove used for tracking (hereinafter, referred to as "guide groove" as a generic term indicating the both) and a difference in the tracking system associated with those differences. For the tracking system, mainly CD-ROM uses the twin beam method; CD-R, RW, DVD-R, RW use the differential push-pull method; DVD-ROM uses the differential phase detection method; and DVD-RAM uses the push-pull method that uses a polarization-dependent diffraction grating.
The push-pull method is a method in which imbalance of a reflected light intensity distribution generated on a pupil plane of the objective lens resulting from diffraction of light by the guide groove and an interference effect between beams of the diffracted light. The imbalance of the intensity distribution on the pupil plane can be obtained by detecting the spots by two-segment detectors on planes shifted somewhat from the focal plane, on which normally the detector is placed, and obtaining a differential signal between detected signals. This is used as a tracking error signal. Since the imbalance of the intensity distribution is caused by the interference effect between beams of the diffracted light, the detection sensitivity of the tracking error by this method becomes highest when the guide groove depth is equal to an optical depth of ⅛ wavelength and the guide groove width is one-half the guide groove pitch—here, the optical depth is assumed as a depth reduced to ½ wavelength or less where the diffraction and interference effects at that depth become equivalent to those of the original (not reduced) depth using a wavelength in the substrate of the optical disk as a reference. Further, at the optical depth of ¼ wavelength, theoretically the tracking error signal amplitude by the push-pull method becomes zero. With respect to the tracking error signal detection by the push-pull method, a problem has been pointed out for many years. This is a problem that a false tracking error signal (hereinafter referred to as "offset") is generated because, when the objective lens is moved in connection with the tracking operation (hereinafter referred to as "lens shift"), the optical spot on the photodetector also moves in accordance with the movement.
One of methods proposed as a method for preventing this is the differential push-pull method, which is disclosed by the second embodiment of JP-A No. 94246/1986. In the differential push-pull method, two sub spots are arranged, on both sides of a focused spot on the disk plane, at a distance shifted from the focused spot in a radial direction by one-half the guide groove pitch, and the differential signal between the push-pull signal by the central focused spot (hereinafter referred to as a "main spot") and the push-pull signals of the sub spots is used as the tracking error signal. The offset associated with the lens shift occurs in the same polarity for the main spot and for the sub spots, whereas the tracking error signal occurs in the reverse polarity for the main spot and for the sub spots because the main spot and the sub spots are arranged with their positions being shifted by one-half the guide groove pitch. Therefore, by obtaining the differential signal of these error signals, a component of the tracking error signal is enhanced and the offset is canceled out. A diffraction grating that generally has a row of linear unit gratings is used to form the sub spots, and sub-spot positions on the disk are adjusted by rotation adjustment of the grating.
Another method for preventing occurrence of the offset by the lens shift in the push-pull method is a method that uses the polarization-dependent diffraction grating. The polarization-dependent diffraction grating is a diffraction grating made of a birefringent material such as anisotropic optical crystals and liquid crystals, and it has a function of acting as a diffraction grating for one linear polarization whereas it has a function of generating no diffracted light for linear polarization perpendicular to that linear polarization because phase difference caused by the grating becomes an integral multiple of the wavelength of the light. If this component is integrated with a quarter-wave plate in one body and linearly polarized light from which no diffracted light is produced while passing through the component is entered into the integrated body, the incident light passes through the quarter-wave plate and is transformed to circularly polarized light without being diffracted by the polarization-dependent diffraction grating. When this light is reflected by an optical disk etc. and reenters the polarization-dependent diffraction grating, diffraction effect takes place in the polarization-dependent diffraction grating because after first passing through the quarter-wave plate the light is transformed into linearly polarized light whose polarization direction is perpendicular to that of the linearly polarized light at the time of entering the integrated body for the first time. This arrangement can provide a diffraction grating that does not diffract the light in an outward travel and diffracts the light only in a homeward travel. Based on this principle, a grating has been formed to diffract two regions of light that are to be separated and detected by the push-pull method in different directions, and is moved together with the objective lens as one body for the tracking. If light fluxes after being separated by the polarization-dependent diffraction grating are detected by the photodetectors whose light detecting regions are large enough to receive the flux without failing to receive any portion thereof even when the lens shift is done, there is effectively no displacement of the received light flux with respect to a dividing line of the light flux. Thereby, the occurrence of the offset can be mitigated. However, this method is incomplete in suppressing the offset as compared with the differential push-pull method. The occurrence of the offset by the lens shift is affected not only by the movement of the dividing line for dividing the light flux but also by displacement between the optical axis of the objective lens and the center of the intensity distribution caused by a fact that the intensity distribution of the out-going light from the semiconductor laser has a Gaussian distribution. In the method in which the polarization-dependent diffraction grating is moved together with the objective lens in one body, the effect by the movement of the dividing line is dissolved, but the influence by the displacement of the center of the intensity distribution remains. Therefore, this method may turn to be insufficient in cases where the push-pull signal amplitude is small, to be more precise, a case where the guide groove pitch is narrow as compared with the focused spot, a case where the guide groove is shallow, a case where the guide groove width is narrow as compared with the guide groove pitch, etc., that is, cases where the remaining offset becomes notably large.
In the twin beam method, two sub spots are formed on the both sides of the focused spot on the disk, and they are arranged at positions shifted from the main focused spot in a radial direction by one-quarter the guide groove pitch. The tracking error signal is obtained by detecting variation in the total reflected light quantity of each sub spot caused by tracking error between the guide groove on the disk and the sub spots and finding a difference signal between the total reflected light quantities. To form the sub spots, normally a diffraction grating that has a row of linear unit gratings is used, and the sub-spot positions on the disk are adjusted by rotating the grating. Since in the twin beam method the tracking error is obtained by detecting the variations in the total reflected light quantities, its detection sensitivity becomes highest when the guide groove depth is equal to an optical depth of ¼ wavelength where the total reflected light quantity exhibits a largest change. Further, since the signal is obtained not from the distribution but from the total light quantity, there does not occur offset that is caused by the lens shift and may become a problem in the push-pull method. Further, since this method requires that the reflected light quantity when the spot is on the guide groove differ from the reflected light quantity when the spot is between the guide grooves, if the guide groove width and a spacing between the guide grooves are the same in dimension, the signal cannot be detected theoretically.
The differential phase detection method is a method that is used in DVD-ROM, in which detected is the phase difference between two signal waveforms each of which is obtained by adding the received light quantities falling on diagonally located two regions of the four-segment regions of the photodetector that is produced by an interference effect of the diffracted light fluxes caused by the pit sequence and is proportional to the tracking error on time base. The phase difference becomes largest when the optical depth of the pit is equal to ¼ wavelength, which agrees with an optical depth at which a reproduced signal amplitude becomes largest. When the optical depth of the pit is ¼ wavelength, the offset by the lens shift does not occur theoretically as well.
As mentioned in the foregoing, in terms of features of the tracking methods, suitable tracking methods are chosen for respective classifications of disks.
That is, in DVD-ROM, since the recording density is high and the optical depth of the pit that were previously recorded is set to ¼ wavelength in order to make the signal percentage modulation large, the differential phase detection method is suitable. It is thought possible to apply the twin beam method. However, the differential phase detection method can perform detection with only one spot, and hence the differential phase detection method is chosen. The push-pull method cannot be applied because theoretically the signal amplitude reduces to zero.
In CD-ROM, the phase depth of the pit is set to ⅙ wavelength in order that the tracking error signal can be detected even by the push-pull method in specifications. Therefore, considering the influence of the lens shift upon the offset, the twin beam method is suitable. However, even in the differential phase detection method, a method where by the offset is mitigated by improvement of signal processing has been developed.
In DVD-RAM, the guide groove width is set identical to the spacing between the guide grooves, and the land and groove recording system whereby information is recorded both on the guide groove and between the guide grooves is used. For this reason, the twin beam method is not used therefor, and a method that uses the polarization-dependent diffraction grating is commonly used because the guide groove pitch is wider than that of the under-mentioned DVD-R etc. and can provide a sufficiently large push-pull signal. Although the differential push-pull method has a larger effect of suppressing the offset, the method that uses the polarization-dependent diffraction grating that uses only one beam has been chosen in terms of securing a sufficient margin of light intensity for the recording.
In DVD-R, DVD-RW, CD-R, and CD-RW, the guide groove pitches are narrower than that of the land groove method and information is recorded on the guide grooves whose phase depths are shallow. For this reason, the method that uses the polarization-dependent diffraction grating reduces the effect of suppressing the offset. Further, these optical disks are featured especially by being a low price, it is often the case that the differential push-pull method is chosen rather than the method that uses a somewhat costly polarization-dependent diffraction grating. However, since generally these disks are intended to be equivalent to DVD-ROM and CD-ROM when being reproduced, the same tracking method as DVD-ROM and CD-ROM is applicable in principle when being reproduced.
The optical heads for recording and reproducing the respective optical disks are required to be miniaturized in connection with miniaturization and thinner design of the apparatuses. For example, a hologram laser module capable of reproducing both DVD and CD is disclosed by JP-A No. 120568/1997 (the first conventional example). The hologram laser module is such that a semiconductor laser, a photodetector, and a hologram for guiding reflected light from the optical disk to the photodetector are modularized into one body. In this conventional example, the twin beam method is employed for both DVD and CD (in this conventional example, being referred to as "three beam method"). On the other hand, an optical head that uses a modularized part that is supposed to be used for recording on DVD is disclosed by JP-A No. 126297/2001 (the second conventional example). In this example, a semiconductor laser and a photodetector are modularized into one body, but a hologram for guiding the reflected light from the disk to the photodetector are integrated with the objective lens, being separated from the module. This configuration is adopted because the tracking of recording optical disks, such as DVD-RAM, is assumed.
Further, in the DVD Multi drive described previously, in order to perform tracking of the above-mentioned all classifications of disks, it is very likely that a method in which the polarization-dependent diffraction grating is moved together with the objective lens as one body will be used. In this case, although the offset by the lens shift is not removed completely and its influence remains for DVD whose tracking error signal amplitude is small or the like, this incompleteness is solved by margin allocation design of the whole system.
In the above-mentioned first conventional example, since the twin beam method is employed to execute the tracking control of DVD and CD, no tracking error signal can be obtained for DVD-RAM whose guide groove width is equal to the spacing between the guide grooves. Further, in DVD-R/RW etc. whose guide groove is shallow, the tracking error signal amplitude becomes extremely small. For these reasons, this conventional example is not suitable for recording disks, and hence cannot be applied to the DVD Multi drive.
In the above-mentioned second conventional example, since the polarization-dependent diffraction grating is used to execute the tracking control by the push-pull method, the offset by the lens shift occurs in DVD-R/RW. Further, since it is necessary to mount the polarization-dependent diffraction grating on the objective lens to be an integrated combination, its weight will be a problem in enhancing the speed in the future. Moreover, since the polarization-dependent diffraction grating is independent from the module wherein the semiconductor laser and the photodetector were integrated, it is likely that displacement between the polarization-dependent diffraction grating and the module due to temperature variation and/or change over time will occur. The occurrence of the displacement deteriorates accuracy of focus control of the focused spot and of tracking control, causing degradation of the reproduced signal.
As a method whereby a hologram (diffraction grating) for branching off detected light without generating the offset by the lens shift even in DVD-RAM and DVD-RW can be integrated with the semiconductor laser and the photodetector, there is the differential push-pull method. However, it is necessary to arrange the sub spots on the disk at positions shifted from the main spot in a radial direction by one-half the guide groove pitch, but the guide groove pitch is almost two times different between DVD-RAM and DV-RW. DVD-RAM is based on the land groove system whereby information is recorded both on the guide groove and between the guide grooves, whereas DVD-RW etc. are based on a method whereby information is recorded only on the guide groove. Since the both have almost the same recording density, the guide groove pitch of DVD-RAM is two times wider than that of DVD-RW etc. Therefore, positions of the sub spots that are necessary for the differential push-pull method are different for DVD-RAM and for DVD-RW etc., and hence the differential push-pull method cannot be compatible for the two kinds of systems.


Provided is a method of producing a semiconductor device having an organic semiconductor layer, which includes the steps of providing a crystallization promoting layer on a substrate; providing an organic semiconductor precursor on the crystallization promoting layer; and applying light energy and thermal energy simultaneously to the organic semiconductor precursor to form a layer containing an organic semiconductor. Thereby, an organic semiconductor device is provided which is low cost and has excellent durability.

1. Field of the Invention
The present invention relates to a method of producing a semiconductor device by use of a precursor of an organic semiconductor compound.
2. Description of the Related Art
The development of thin-film transistors employing an organic semiconductor gradually began to become more active in the latter half of the 1980s. In recent years the basic performance of thin-film transistors employing an organic semiconductor now exceeds the basic performance of thin-film transistors employing amorphous silicon. There are often cases where organic semiconductor materials have a high affinity with a plastic substrate on which a semiconductor device, such as a thin-film field effect transistor (FET), is formed. Therefore, organic semiconductor materials are desirable as the material for a semiconductor layer in devices which are required to have flexibility or light weight. Further, it is possible for a part of the organic semiconductor material to form a film by application of a solution or by use of a printing method. If such a material is used, a device with a large area can be fabricated at low cost.
Examples of organic semiconductor materials which have hitherto been proposed include the following. First, there are included acenes disclosed in Japanese Patent Application Laid-Open No. H05-55568 such as pentacene and tetracene; low-molecular compounds disclosed in Japanese Patent Application Laid-Open No. H05-190877 such as phthalocyanines including lead phthalocyanine, perylene and tetracarboxylic acid derivatives thereof; and high-molecular compounds disclosed in Japanese Patent Application Laid-Open No. H08-264805, such as aromatic oligomers typified by thiophene hexamers referred to as α-thienyl or sexythiophene, as well as polythiophene, polythienylenevinylene and poly-p-phenylenevinylene. Incidentally, many of these compounds are also disclosed in Advanced Material, Vol. 2, pp. 99-117, 2002.
The characteristics such as non-linear optical characteristics, electrical conductivity and semiconductor characteristics, which are required when producing a device with the above compounds being used for a semiconductor layer, do not depend only on the purity of a material but also largely depend on the crystallinity and orientation of the material.
Meanwhile, many of low-molecular compounds having a π-conjugated system extended (e.g., pentacene) have high crystallinity and are insoluble in solvents. Therefore, thin-films of most of these compounds are generally formed by using a vacuum deposition process. While it is known that pentacene exhibits a high electric field effect mobility, there has been a problem that pentacene is unstable in the atmosphere, easily oxidized and susceptible to degradation. Moreover, in the case of using a vacuum film forming technique such as vacuum-deposition process, the merits of the organic semiconductor material in enabling production at low cost are lost.
On the other hand, there are often cases where organic semiconductors using a π-conjugated polymer are able to easily form a thin film using a solution coating process or a similar technique. Therefore, applied development of organic semiconductor films using a π-conjugated polymer has been progressing due to the fact that such films often have excellent formability ("Japanese Journal of Applied Physics", Japan Society of Applied Physics, Vol. 30, pp. 596-598, 1991). In the case of π-conjugated polymers, it is known that the state of arrangement of molecular chains thereof has a large influence on the electrical conductivity. Similarly, it has been reported that the electric field effect mobility of π-conjugated polymer field effect transistors largely depends on the state of arrangement of molecular chains in a semiconductor layer ("Nature", Nature Publishing Group, Vol. 401, pp. 685-687, 1999). However, since the arrangement of molecular chains of π-conjugated polymers is effected in a period from coating of a solution to its drying, there is a possibility that the state of arrangement of molecular chains may vary greatly depending on changes in environment or a kind of coating methods. Thus, there is a concern that the electric field effect mobility varies depending on coating conditions, which makes stable production difficult.
In recent years there has also been reported a FET which employs a film in which a thin film made of a soluble precursor of pentacene is formed by coating, which is then converted to pentacene by heat-treatment or light irradiation ("J. Appl. Phys.", Vol. 79, p. 2136, 1996; WO A1 2004079834; Japanese Patent Application Laid-Open No. 2004-221318). In the case of converting the precursor to pentacene by heat-treatment, there have been the problems that a high-temperature treatment is required for the conversion to pentacene, and that eliminated components with a large mass need to be removed by pressure reduction. On the other hand, in the case of converting the precursor to pentacene by light irradiation, while a high-temperature treatment is not required, there still remains the problem that obtained pentacene is unstable in the atmosphere, easily oxidized and susceptible to degradation.
As described above, hitherto, when producing a semiconductor device using an organic semiconductor compound such as a field effect transistor, a semiconductor layer has been formed having good crystallinity and orientation by undergoing a vapor deposition step or the like. However, there have been the problems that vapor deposition is expensive, and acenes, which are typical organic semiconductors, are susceptible to be oxidized to be thereby degraded. Further, while coating methods are low cost, because the arrangement state of molecular chains can be disrupted unless the coating conditions are strictly controlled, the variability in characteristics between individual devices has been a concern.

Production method of semiconductor device


An antenna comprises a conductive foil layer (16) which forms a ground plane, a conductive foil element (20) spaced from the ground plane, and a dielectric substrate (14) separating the foil element from the ground plane, the dielectric substrate being of an extruded plastics material having a cellular configuration in cross-section. More particularly, the dielectric substrate comprises one or more superimposed substrate sheets of extruded plastics material, with the or each substrate sheet comprising a pair of spaced, parallel skins (38) and webs (40) extending between and separating the skins. A method of applying the foil element to the dielectric substrate and of making the antenna and various component parts thereof are also disclosed.

This invention relates to an antenna and to a method of making such antenna and component parts thereof.
Flat panel antennas generally have one or more radiator elements or patches and a feed circuit for the patches, the patches and the feed circuit being of thin flat conductive material and being separated from a conductive ground plane by means of one or more layers of a dielectric substrate. The most common method of making such antennas involves the use of photolithographic or etching techniques on thin copper sheets laminated on microwave substrate materials. The substrate materials are relatively high loss materials and are expensive. Styrofoam has also been used as a dielectric material, but this suffers from moisture retention which is detrimental to the performance of the antenna.
It is an object of the Invention to provide an antenna construction which makes use of low cost and, in the case of the dielectric material, low loss materials, which can be die-cut with sufficient accuracy to enable repeatable high volume assembly.
According to the invention there is provided an antenna which comprises means forming a ground plane, a conductive foil element spaced from the ground plane, and a dielectric substrate separating the conductive foil element from the ground plane, the substrate being of an extruded plastics material having a cellular configuration in cross-section.
Thus, the substrate may be of the kind of extruded plastics material that comprises a pair of spaced, parallel skins and webs extending between and separating the skins. Such material is also referred to generically as xe2x80x9ccorrugated plasticxe2x80x9d because of its resemblance to corrugated cardboard. It is commonly used in the packaging and signage industries. One such type of material is available commercially in South Africa as xe2x80x9cCoruplasxe2x80x9d, which is an extruded polypropylene material.
The substrate may comprise two or more superimposed sheets of extruded plastics material, each said sheet having a pair of spaced, parallel skins and webs extending between and separating the skins.
Where the antenna includes one or more radiator elements, the conductive foil element may be configured to form a feed circuit for the radiator element or elements.
The feed circuit may be a microstrip feed circuit, or it may be a stripline feed circuit.
In another form of the invention the conductive foil element may be configured to form said radiator element or elements.
The dielectric substrate may comprise a pair of superimposed lower and upper sheets of dielectric material, each said sheet being of an extruded plastics material having a cellular configuration in cross-section, and the upper sheet having an edge which is within the periphery of the lower sheet, the conductive element being a one-piece element having a first portion which is supported by the upper face of the lower sheet, a second portion which extends up said edge to the upper face of the upper sheet, and a third portion which is supported by the upper face of the upper sheet.
In yet another form of the invention the conductive element may be a one-piece element which is configured to form said radiator element or elements and a feed circuit for the radiator element or elements.
In this event the dielectric substrate may comprise a pair of superimposed lower and upper sheets of dielectric material, each said sheet being of an extruded plastics material having a cellular configuration in cross-section, and the upper sheet having an edge which is within the periphery of the lower sheet, wherein that part of said conductive element which forms the feed circuit has a first portion which is supported by the upper face of the lower sheet and a second portion which extends up said edge to the upper face of the upper sheet, and wherein that part of said conductive element which forms the radiator element or elements is supported by the upper face of the upper sheet.
The conductive foil element may comprise a die-cut conductive foil element.
Further according to the invention there is provided a method of making an antenna having a dielectric substrate and a conductive foil element on the substrate, the foil element having a predetermined outline, which method comprises:
providing the substrate as a sheet of extruded plastics material having a cellular configuration in cross-section;
providing a sheet of conductive foil and die-cutting the foil sheet along said outline, in such a manner that bridge portions of foil remain between that part of the foil sheet which is inside the outline and that part of the foil sheet which is outside the outline;
applying the foil sheet, after it has been die-cut, to the substrate sheet, there being an adhesive between that part of the foil sheet which is inside the outline and the substrate sheet, so that that part of the foil sheet which is inside the outline becomes attached to the substrate sheets by means of the adhesive; and
thereafter removing that part of the foil sheet which is outside the outline by severing the bridge portions.
The adhesive may, prior to applying the foil sheet to the substrate sheet, be applied to the substrate sheet across a selected area corresponding roughly to the area defined by said outline.
The adhesive may be applied to the substrate sheet by means of a silk-screening process.
A protective peel-off sheet may be applied to the dielectric sheet after the adhesive has been applied to the dielectric sheet, to cover the adhesive, and the peel-off sheet subsequently, prior to applying said foil sheet, removed.
Still further according to the invention there is provided a method of making a component part of an antenna, which component part comprises a dielectric substrate and a layer of conductive foil adhered to the dielectric substrate, wherein the assembly of substrate and conductive foil layer is die-cut by means of a die-cutting apparatus having a base and a head with die-cutting blades, the head and the base moving towards one another during a die-cutting operation, and wherein said assembly is placed on the base with the side of the conductive foil layer being adjacent the base, whereby the die-cutting blades penetrate the assembly from the side of the dielectric sheet and move towards the side of the conductive foil layer.

Antenna and method of making such antenna and component parts thereof


A system for selectively inserting and/or extracting an electronics module into and/or from a receiving system. The system includes a lever configured to rotatably attach to a portion of the receiving system. The lever is rotatable between a first position corresponding to an at least partially uninstalled position of the electronics module with respect to the receiving system and a second position corresponding to an installed position of the electronics module with respect to the receiving system. The lever includes a first bearing surface configured to engage with and apply a force on a portion of the electronics module when the lever is rotated in a first direction, and a second bearing surface configured to engage with and apply a force on a portion of the electronics module when the lever is rotated in a second direction.

Modern electronic systems are often implemented using removable units containing electronic components. These units (referred to herein as electronics modules or circuit cards) are operatively connected to a receiving platform, chassis or motherboard of a larger card receiving system via one or more removable electronic connectors. FIG. 1 partially illustrates a circuit card or LRU receiving system 10. System 10 may include a receiving platform 14, such as a cooling chassis or cold wall, onto which a circuit card 12, including a plurality of electronic components 11, is to be placed and secured in an operative state. Circuit card 12 may comprise electrical connectors 16 configured to engage with corresponding connectors (not shown) on receiving platform 14 (or a motherboard thereof). Once installed, circuit card 12 may be secured to receiving platform 14 via a clamping device 19 (only a portion of which is shown).
These arrangements provide for quick replacement or repair, simplified system packaging and reduced cost. However, installing and/or removing these circuit cards may require the application of significant force onto the card to overcome friction or other reactive forces required to engage or disengage these electronic connectors. According to embodiments of the prior art, forces required to insert and/or extract circuit card 12 from an installed position may be applied in the indicated directions via, for example, a handle 18 arranged thereon. Other prior art solutions aimed at aiding in the process of circuit card insertion and extraction include the use of moveable mechanical devices arranged on the circuit card. However, as these devices are fitted to the circuit cards themselves, card complexity and overall costs are greatly increased, as each circuit card, as well as all replacement and/or backup circuit cards, must be fitted with the devices. Mounting devices on the receiving side of a system (e.g. to receiving platform 14) can greatly reduce costs, limiting the number of devices required. However, current receiving side mounted solutions include devices for aiding only in circuit card extraction, and lack the functionality to perform insertion or installation operations.
Improved systems and methods for aiding in both the insertion and extraction of circuit cards are desired.

Insertion-extraction device for circuit card assemblies resident to the circuit receiving side


A ringback tone, indicative of an emotional state that is input by a user of a called communication device, is selected to play to a calling communication device during a call to the called communication device.

Known ringback tone services allow a user of a called communication device to preselect a ringback tone to be played to a calling communication device. Traditionally, the calling party would hear a standard ringing sound before the called party answers the call. The ringback tone service replaces that standard ringing sound with a ringback tone selected by the user of the called communication device. For example, the ringback tone service allows the user of the called communication device to customize the ringing sound that a user of the calling communication device hears while calling the called communication device.
To set up the ringback tone service, the user of the called communication device sends ringback tone selection criteria to a ringback tone service component. The ringback tone selection criteria indicate which ringback tone to play in various circumstances. For example, the ringback tone selection criteria may instruct the ringback tone service component to play a first user-selected ringback tone for any call with a first set of characteristics, and to play a second user-selected ringback tone for any call with a second set of characteristics.
The ringback tone service only allows quantitative and objective ringback tone selection criteria to determine which ringback tone to play to the calling communication device. For example, the user may input any combination of time of day criteria, day of week criteria, day of year criteria, and/or calling party number or identity criteria. The ringback tone service component compares objective characteristics of the incoming call to the ringback tone selection criteria to determine which ringback tone to play to the calling communication device. The ringback tone service does not allow the user to create ringback tone selection criteria based on subjective factors. As one shortcoming, the ringback tone service limits the level of customization provided to the user of the called communication device by not allowing subjective ringback tone selection criteria.
Thus, a need exists for one or more ringback tone selection criteria based on subjective factors selected by a user of a called communication device.

Selection of ringback tone indicative of emotional state that is input by user of called communication device


The present technology includes improved gas distribution designs for forming uniform plasmas during semiconductor processing operations or for treating the interior of semiconductor processing chambers. While conventional gas distribution assemblies may receive a specific reactant or reactant ratio which is then distributed into the plasma region, the presently described technology allows for improved control of the reactant input distribution. The technology allows for separate flows of reactants to different regions of the plasma to offset any irregularities observed in process uniformity. A first precursor may be delivered to the center of the plasma above the center of the substrate/pedestal while a second precursor may be delivered to an outer portion of the plasma above an outer portion of the substrate/pedestal. In so doing, a substrate residing on the pedestal may experience a more uniform etch or deposition profile across the entire surface.

Integrated circuits are made possible by processes which produce intricately patterned material layers on substrate surfaces. Producing patterned material on a substrate requires controlled methods for forming and removing material. The uniformity of a plasma used to excite reactants may directly impact the final product. Plasma uniformity fluctuations in a remote plasma may result in regions of high etch or deposition rate near the edge of a substrate relative to the center or vice versa. Etch uniformity has been controlled by adjusting the spacing between the substrate surface and a showerhead but etch rate is also altered. Depending on the degree of variation along the surface of the substrate, device failure may occur due to the inconsistencies produced by the etch process.
Additionally, plasma uniformity has been found to exhibit instability especially in the presence of fluorine and other electronegative species. Electronegative species may not relinquish electrons as readily which makes the maintenance of a symmetric plasma more difficult. A plasma which is symmetric about the surface of the substrate enables an etch process to be made more uniform.
Thus, there is a need for improved systems and methods that can be used to produce high quality devices and structures. These and other needs are addressed by the present technology.

This patent is subject to a terminal disclaimer.

Multi-zone gas distribution systems and methods


A double egress frame and door unit comprising: a first jamb having a first jamb stop thereon and having a soffit adjacent the stop; a second jamb having a second jamb stop thereon and having a soffit adjacent the stop; a first door swinging in a first direction and being connected to the first jamb by hinges; a second door swinging in a second direction opposite to the first direction and being connected to the second jamb by hinges; a header connected to an upper end of the first and second jambs, the header having first and second header stops thereon, the first header stop being coplanar with the first jamb stop, the second header stop being coplanar with the second jamb stop; and the hinges connecting the first door to the first jamb and connecting the second door to the second jamb permitting each door to swing clear of the soffit of the jambs when the doors are in an open position.

This invention relates generally to doors and door frames and more particularly to double egress doors and door frames.
Double egress frames are designed to separate corridors into fire control sections and to control the traffic flow in the corridor without providing an obstacle. The frame is designed to allow the doors to swing in opposite directions without interference with one another. The doors when closed block the corridor and prohibit the passage of flames from one section to another. The profile of the jambs is a three step shape. The center step is where the door is located.
Although the double egress is used to provide fire separation, the frame can also be used as a strict traffic control device. Since the doors open in opposite direction, traffic is diverted to the right side (left side if required) of the corridor.
The double offset in the frame reduces the corridor opening width. The reduction in the corridor width and subsequent door width violates some building codes that require a minimum clear opening width.
The foregoing illustrates limitations known to exist in present double egress doors and door frames. Thus, it is apparent that it would be advantageous to provide an alternative directed to overcoming one or more of the limitations set forth above. Accordingly, a suitable alternative is provided including features more fully disclosed hereinafter.


A universal alignment guide for universally positioning an instrument with respect to a bone to facilitate resecting the bone along desired orientations. The alignment guide comprises a spheroidal base and a collar coupled to the base in a manner to allow universal motion of the collar with respect to the base. The base of the alignment guide is attached to a bone anchor implanted in a bone, and the collar is attached to an instrument, such as a resection guide. With respect to a distal femur, the alignment guide facilitates simultaneous positioning and locking of the resection guide in flexion/extension, varus/valgus, internal/external rotation, and proximal/distal orientations.

1. Field of the Invention
The invention relates to methods and instrumentation for use in preparing a bone surface for attachment of a prosthesis. More particularly, the invention relates to methods and instrumentation for aiding in the alignment and positioning of a resection guide relative to bone surfaces, in order to resect the bone surfaces and prepare them for attachment of endoprostheses. A common procedure in which this invention may be employed is knee arthroplasty.
2. Brief Description of the Prior Art
Joint replacement procedures, such as total knee arthroplasty, involve replacement of the load bearing surfaces of bones with artificial components. Proper implantation of these components, or implants, requires detailed measurements of the joint as well as accurate resections of the bone surfaces in preparation for their attachment to their respective components.
As used herein, when referring to bones or other body parts, the term "proximal" means closest to the heart, and the term "distal" means more distant from the heart. When referring to tools and instruments, the term "proximal" means closest to the practitioner, and the term "distal" means distant from the practitioner.
In attempting to duplicate the natural behavior of the joint, replacement components require specific positioning and attachment to the bones of the joint that they are to replace, in accordance with the detailed measurements. Commonly, since the bone-contacting surface of an implant, for example a distal femoral component, has a specific geometry, the bone to which it is to be attached must be accurately resected and shaped to mate with the geometry of the implant and provide the implant's proper alignment in the joint.
Measurement and placement of the distal femoral component, for example, requires determination of the following four orientations prior to implantation: proximal/distal, flexion/extension, varus/valgus, and internal/external rotation.
Various techniques and instruments are known for facilitating making these measurements and then resecting the bone surfaces accordingly. Examples of such are found in published U.S. patent application Ser. Nos. 20020133160, 20020133161, 20020133162 and 20020133163, as well as U.S. patent application Ser. No. 09/974,524, entitled "Methods and Tools for Femoral Resection in Knee Surgery". These applications teach an alignment guide coupled to a bone anchor that is attached to the distal femur. The alignment guide is also joined to a resection guide via an attachment rod. Orientation and locking of the resection guide is done via three cam locks on the alignment guide. One cam lock is for adjusting and locking varus/valgus orientation, another is for flexion/extension, and a third is for proximal distal orientation of the resection guide relative to the distal femur. This alignment guide is therefore designed for independent locking of three orientation positions of the resection guide. Removal of the resection guide and attachment of further instruments would provide additional positioning capabilities.
Recently, various computerized systems have been introduced to aid the practitioner during different surgical procedures. These systems include multiple video cameras which are deployed above the surgical site and a plurality of dynamic reference frame (DRF) devices, also known as trackers, which are attached to body parts and surgical instruments. The trackers are generally LED devices which are visible to the cameras. Using software designed for a particular surgical procedure, a computer receiving input from the cameras guides the placement of surgical instruments.
Additionally, computer-assisted surgery has been developed which utilizes a tracking system that can relate positions on the patients and/or instruments to stored X-ray, CT scan and MRI data previously obtained for the patient. More recently, image free computer-aided surgery has been utilized where mechanical relationships can be calculated from anatomical reference points such as in joint arthroplasty. These systems are used intra-operatively for performing various surgical procedures, including replacement of artificial joints.
It has been especially useful to utilize trackable medical instruments for use in procedures utilizing computer-assisted image guided or image free medical and surgical navigation systems. Systems using body images are shown in U.S. Pat. Nos. 5,383,454 to Bucholz and 6,021,343 to Foley et al. In general, these image-guided systems use computer stored digital images of a body part obtained, for example, by CT scans taken before surgery, to generate images on a display, such as a CRT monitor screen, during surgery. These images are used in connection with real time information for representing the position of a surgical instrument with respect to the body part. The systems typically include tracking devices such as, for example, a tracker having LEDs and attachable to a surgical instrument as well as a patient's body part, a tracking array used in real time during surgery to track the position of the body part and the instrument via the tracker, and a monitor screen to display images representing the body and the position of the instrument relative to the stored images as the surgical procedure is performed.
An image-free type system is shown in U.S. Pat. No. 6,385,475. Some systems of this type include virtual joint images. In such systems, active or passive marker elements are attached to bones on opposite sides of a joint and a measuring device, such as an optical sensing camera coupled to a data processing system to which signals corresponding to the positioning data of the marker elements is supplied by the optical camera system, is used to correlate the markers on opposite sides of the joint. With a pointer mounted tracker, it is possible to locate various anatomic reference points on the joints to allow the system to position a cutting instrument such as a reamer or saw blade.
The prior art instrumnts used for determining the correct orientations for tibial and femoral resection in total knee arthroplasty, for example, leave room for optimization with respect to their designs, interaction with computer-assisted surgery instrumentation, as well as speed and ease of use.


A laser beam printer includes a casing with a discharge tray disposed on the top surface of the casing. A cutout part is formed in the top surface of the casing and an opening is formed in the front surface of the casing for facilitating mounting and removal of a process cartridge. The opening can be closed with a cover. When the cover is in a closed position, a top cover part of the cover blocks the cutout part. At this time, the top cover part and a main discharge tray part of the discharge tray are adjacent to one another and function to support paper. When the cover is in an open position, the cutout part is exposed; the top cover part is separated from the main discharge tray part; and the paper is supported by the main discharge tray alone.

1. Field of the Invention
The present invention relates to an image forming device.
2. Related Art
Image-forming devices well known in the art include a front access type printer. This type of printer has a casing formed with an opening in its front surface, and a cover capable of swinging open and closed on the casing to expose or cover the opening. Hence, process cartridges and other detachable parts can be installed to or removed from the casing through the opening by opening this cover. Because of its user-friendliness, this construction has been made employed in various practical devices, such as that disclosed in Japanese unexamined patent application publication No. 2002-111243.
To meet today's demands, however, devices must not only be user-friendly, but also thin and compact. In order to satisfy these needs, restrictions have been placed on the layout of these devices. Accordingly, when conventional configurations are used, a grip formed on the process cartridge or other detachable part is difficult to grip during replacement operations, and levers or other operating parts located inside the printer are difficult to operate. If the device is configured to be lower in height, for example, either the height of the opening formed in the front surface of the device must be decreased or the position of the entire opening must be lowered, making access from the front more difficult.


A plasma processing system comprises a processing chamber into and from which processing gas is inlet and outlet; a pair of electrodes disposed so as to mutually oppose within the processing chamber; a RF feeding apparatus for generating plasma between the pair of electrodes; a retaining/removal apparatus for retaining a substrate to be processed on and removal from a sample table while one of the pair of electrodes is taken as the sample table; and a detection apparatus for detecting the electrostatic-chucking state of the substrate and for detecting removal state of electrical charges from the substrate, on the basis of variations in impedance arising between the sample table and the substrate.

1. Field of the Invention
The present invention relates to a plasma processing system, and to a plasma processing method, and to a method of manufacturing a semiconductor device using the plasma processing system and method. More particularly, the present invention relates to a method of manufacturing a semiconductor device in which a wafer is chucked and secured by utilization of an electrostatic chuck.
2. Description of the Background Art
A method of manufacturing an integrated circuit called an IC or a LSI usually employs an etching process in a process of forming a pattern. In a system to be used for the etching process, there has been employed an electrostatic chuck for securing a wafer to an electrode. The wafer is secured by means of utilizing an electrostatic force developing in the electrode. The electrostatic force is generated by means of applying a high frequency, such as microwaves, to the inside of a processing chamber where the wafer is to be processed.
FIG. 3 is a view for describing the structure of a conventional plasma processing system (wafer etching system).
In FIG. 3, reference numeral 1 designates awafer. For instance, there is used a Si wafer 8 inches in diameter as the wafer 1. Although not shown, a film to be etched, for example, an oxide film (SiO2) is formed on the wafer 1. Reference numeral 2 designates an insulating coating placed on a power electrode 3 disposed in a processing chamber (not shown). The wafer 1 is to come into contact with the insulating coating 2. For instance, a film containing titania or alumina is used as material of the insulating coating 2. The power electrode 3 chucks and retains the wafer 1 thereon by way of the insulating coating 2. For instance, an aluminum alloy A5052 is used as material for the power electrode 3. Reference numeral 4 designates a matching circuit for matching the voltage of a high-frequency power supply 5 and the voltage applied to the power electrode 3.
The high-frequency power supply 5 produces a voltage for producing plasma to be used for effecting an etching reaction. Further, the high-frequency power supply 5 produces a voltage to be used for securing the wafer 1 to the power electrode 3. The voltage supplied by the high-frequency power supply 5 is about 1 KV, and a power supply frequency is 13.56 MHz. Reference numeral 6 designates a ground electrode serving as a ground at the time of development of the plasma. The size of the ground electrode 6 corresponds with the diameter of the wafer 1. An aluminum alloy A5052 is used as a material of the ground electrode 6. Reference numeral 7 designates a variable resistor used for adjusting the matching circuit 4. Thereby, the matching circuit 4 matches the power electrode 3 to the high-frequency power supply 5. Reference numeral 8 designates a DC (direct current) power supply capable of switching between application of a negative voltage and application of a positive voltage. Reference numeral 9 designates a cooling gas supplied from a cooling gas system (not shown), the cooling gas 9 being used for removal the wafer 1. For example, N2 gas is used as the cooling gas 9.
Etching process of the wafer 1 is performed through use of the above system while the processing chamber is maintained in a high vacuum (usually 10−7 Torr or thereabouts).
Next, procedures for processing a wafer will be described.
First, the wafer 1 is transported onto the power electrode 3 by use of unillustrated transport apparatus, such as a robot. Next, a positive power of about 1 KV is applied from the DC power supply 8 to the power electrode 3. Thus, the wafer 1 is secured to the power electrode 3 by means of the electrostatic attracting force developing in the power electrode 3. At this time, an electrostatic attracting force of 600 g or more is exerted on the power electrode 3 in the vertical direction.
Next, a high-frequency voltage, which is used for developing plasma between the power electrode 3 and the ground electrode 6, is applied from the high-frequency power supply 5. Thereby, an etching process of the wafer 1 is performed. At this time, the matching circuit 4 matches the voltage of the high-frequency power supply 5 to the voltage applied to the power electrode 3.
After completion of the etching process, the polarity of the voltage, which is supplied by the DC power supply 8, to be used for chucking the wafer 1 is switched in the DC power supply 8. Namely, a maximum of −2 KV of negative voltage is applied to the power electrode 3. Thereby, electrical charges of the power electrode 3 are removed. Next, the cooling gas 9 to be used for removal the wafer 1 is supplied. Thus, the wafer 1 is removed from the power electrode 3. Finally, the wafer 1 removed from the power electrode 3 is transported from the power electrode 3 through use of transport apparatus, such as a robot.
The conventional wafer etching system (plasma processing system) sets forth the following problems.
The method of removing the wafer 1 using a cooling gas 9 fails to correctly remove electric charges from the wafer 1, and to detect the wafer 1, and to detect removal of the wafer 1 from the electrostatic chuck.
Therefore, deviation of the wafer 1 due to anomalous operation of a removal mechanism results in a transport failure or in a fracture of the wafer 1.
Further, the throughput of the wafer 1 is not improved for reasons of the failure to detect removal of the wafer, thus deteriorating productivity.

Plasma processing system in which wafer is retained by electrostatic chuck


Systems and methods are disclosed for applying a controllable and predictable muscle oscillation to a portion of a body such as a character in a predetermined and intuitive way. Positions of separate muscle locations are analyzed throughout a timeline. A third derivative with respect to time of the positions of the separate muscles is calculated to measure a change of acceleration for a particular point of interest. The change in the acceleration gives positive or negative changes in the applied forces. The direction and magnitude of the applied forces is passed onto a part of a solution that creates a procedural oscillation based on the magnitude and the direction of the applied forces in the muscle space.

Character animation has become increasingly sophisticated. For example, besides just animating the movements of characters, character bodies animate within themselves, e.g., deforming in response to character movements and collisions. For example, deformation parameters may provide for bulging of skin surfaces when a character flexes a joint.
More sophisticated techniques for skin deformation include the simulation of muscles. The muscles may be defined by a geometry with control points, and collision detection may be employed to move or to deform the muscle geometry as muscles interact with bones or other muscles.
However, such techniques have not to date resulted in satisfactory visual effects in all circumstances. For example, complicated dynamic simulations, e.g., those employing continuum mechanics, where elements in a subsequent frame are calculated by consideration of forces on objects in a prior frame, are computationally intensive and highly inconvenient.


In response to detection of a skid of drive wheels based on an increase in angular acceleration α of a rotating shaft of a motor, the control procedure of the invention refers to a map representing a variation in maximum torque Tmax against the angular acceleration α and sets torque restriction of the motor to limit the torque level of the motor to the maximum torque Tmax corresponding to a peak value of the angular acceleration α. When the torque restriction sufficiently lowers the angular acceleration α to detect convergence of the skid, the control procedure cancels the torque restriction to a certain level of the maximum torque Tmax corresponding to a torque restoration limit δ1, which is set according to the degree of the skid. The torque restoration limit δ1 (that is, the maximum torque Tmax) is cancelled in a stepwise manner by a cancellation rate and a cancellation time corresponding to an additional accelerator depression relative to an accelerator opening at the time of detection of the skid. The control procedure sets the greater cancellation rate and the shorter cancellation time with an increase in additional accelerator depression.

One proposed motor control apparatus restricts torque output from a motor to a drive shaft, in response to occurrence of a skid due to wheelspin of drive wheels with the torque output from the motor (see, for example, Japanese Patent Laid-Open Gazette No. 10-304514). This motor control apparatus restricts the torque level output from the motor in response to detection of a skid based on an increase in angular acceleration of the drive wheels (that is, a time variation of angular velocity), while canceling the torque restriction of the motor in response to elimination of the skid by the torque restriction.
This prior art motor control apparatus uniformly cancels the torque restriction, regardless of the driver's demand. This may cause the driver to feel uncomfortable and worsen the drivability.
The applicant of the present invention has disclosed a vehicle skid control technique that regulates a degree of torque restriction, which is set in response to occurrence of a skid, according to an accelerator opening or a driver's step-on amount of an accelerator pedal and regulates a degree of cancellation of the torque restriction in response to elimination of the skid (see Japanese Patent Laid-Open Gazette No. 2001-295676).

Motor control apparatus and motor control method


A guide preferably of small size preferably two and a half inches square is disclosed for establishing reveal on doors and window frames during molding installation without having to do measuring and marking. In one embodiment two square blocks making up the guide are fixedly attached to each other and a different guide is used for different molding reveals. In another preferred embodiment of the present invention, the position of the two blocks relative to each other is adjustable such that one block moves along the other block only along a diagonal providing a simple single adjustment which provides the same amount of reveal on two orthogonal sides of the guide.

Typically the molding which covers the gap between the window or door frame and the drywall or other surfacing of the interior of a building is offset from the edge of the window or door frame by a dimension such as a quarter of an inch, an eighth of an inch, three eighths of an inch or the like. This process of installing this molding often requires multiple measurements and markings on the framing to install the molding correctly along the entire length of the window or door frame. This is a time consuming process which also places marks on the window or door framing which then must be removed in the case of staining or adequately painted over. Further, it is time consuming to measure and mark the frame in multiple locations.
Several attempts have been made at providing such a guide or jig for the installation of molding, but these have not been satisfactory. For example, see U.S. Pat. No. 5,737,844-Brumley, No. 5,604,988-Costelloe, and No. 5,123,172-Thrun.

Guide for establishing reveal on door and window frames during molding installation


The present invention is generally directed to plasma state monitoring to control etching processes and across-wafer uniformity, and a system for performing same. In one illustrative embodiment, the method comprises generating a plasma within an etching tool, monitoring at least one characteristic of the generated plasma, and controlling at least one parameter of a plasma etching process performed in the tool based upon the monitored at least one characteristic of the plasma. In another illustrative embodiment, the method comprises generating a plasma within an etch tool, performing a plasma etching process within the etch tool, determining at least one characteristic of the plasma, and controlling at least one parameter of the etching process based upon a comparison of the determined at least one characteristic of the plasma and a target value for the determined at least one characteristic of the plasma.

1. Field of the Invention
The present invention is generally related to the field of semiconductor manufacturing and, more particularly, to plasma state monitoring to control etching processes and across-wafer uniformity, and a system for performing same.
2. Description of the Related Art
There is a constant drive within the semiconductor industry to increase the quality, reliability and throughput of integrated circuit devices, e.g., microprocessors, memory devices, and the like. This drive is fueled by consumer demands for higher quality computers and electronic devices that operate more reliably. These demands have resulted in a continual improvement in the manufacture of semiconductor devices, e.g., transistors, as well as in the manufacture of integrated circuit devices incorporating such transistors. Additionally, reducing the defects in the manufacture of the components of a typical transistor also lowers the overall cost per transistor as well as the cost of integrated circuit devices incorporating such transistors.
As device dimensions have continued to decrease, the ability to precisely form very small features to their desired dimension has become more important. Variations in the physical dimensions of such features can adversely impact device performance and reduce product yields. For example, the critical dimension and profile of gate electrode structures of transistors is one area where a very high degree of precision is desired. Absent precise control, adverse consequences may follow. For example, if the critical dimension of the gate electrode is greater than the target or design critical dimension, the transistor may not operate as fast as desired by the product design requirements. Conversely, if the critical dimension of the gate electrode structure is less than the target value, off-state leakage currents may be higher than desired. This situation is particularly problematic for integrated circuit devices intended for mobile telecommunication applications and those intended for mobile computing devices.
Etching processes are frequently employed in semiconductor manufacturing to define a variety of different types of features, such as gate electrode structures, conductive metal lines, openings in insulating layers, trenches in a semiconducting substrate, sidewall spacers, etc. Such etching processes, be they anisotropic or isotropic in nature, are very complex processes that involve a vast variety of interrelated variables, such as gas flow rates, temperature, pressure, power, etc. Such complexities make it difficult to control etching processes such that the resulting features exhibit the desired physical dimensions and/or profile.
Moreover, in some cases, wafers exhibiting across-wafer irregularities are sent to an etch tool for processing. For example, a deposited layer of material may be thicker near an edge region of the wafer and relatively thinner near the central region of the wafer. This thickness variation may be due to a variety of factors. In that case, performing a standard etch process that is based upon the premise that the process layer on the incoming wafer exhibits substantially uniform across-wafer thickness characteristics may lead to severe process errors. For example, if a deposited layer is thicker near the edge of the wafer, an endpoint etch process may be performed for too long of a duration, thereby overetching the deposited area in the middle region of the wafer. Such overetching may cause undesirable damage to the underlying process layer or increase the likelihood that features formed in the deposited layer may exhibit less than desired profiles. As a result, the devices produced by such processes may produce completed integrated circuit devices of an unacceptable quality.
The present invention is directed to overcoming, or at least reducing the effects of, one or more of the problems set forth above.

Plasma state monitoring to control etching processes and across-wafer uniformity, and system for performing same


The invention concerns a conveyor belt scraper (10) which includes blade segments (12) each arranged to scrape a portion of the width of a conveyor belt (22). Each blade segment is supported by a bracket (14) which is mounted to a link (16.1) of a deformable, parallelogram linkage (16). An inflatable hose (30) extends through and acts on the linkages to urge the blade segments against the conveyor belt. The link has a projecting, holed boss (42) and the bracket has a recess (40.3) to receive the boss with the hole of the boss aligned with a hole in the base of the recess to receive a fastener (50) that connects the bracket to the linkage in thermally transmitting relationship. This relationship reduces heat degradation of components of the scraper.

This invention relates to a conveyor belt scraper.
U.S. Pat. No. 6,076,656 describes a conveyor belt scraper which includes a segmented scraper blade composed of blade segments arranged side by side on blade segment supports each of which includes a parallelogram linkage. A gas inflated biasing means, typically an inflatable tube or hose, extends through the linkages and is inflated to cause the linkages to displace the blade segments towards the belt surface. The individual mounting of the blade segments enables them to wear at different rates, to take account of different belt loading conditions across the width of the belt, while still maintaining an effective scraping action.
Conveyor belt scrapers according to U.S. Pat. No. 6,076,656 are marketed under the trade marks DIRTWHACKER® and SCAVENGER®. These scrapers include, for each parallelogram linkage, a flexible curtain which hangs over the linkage and prevents material which is scraped off the conveyor belt from falling directly onto the linkage. This reduces the risk of the falling material fouling and jamming the linkage. There is also a rigid plastics deflector extending over the curtain on one side of the linkage to deflect material away from the linkage and curtain to provide further protection to the linkage and also to prevent material from falling directly onto the curtain and causing premature damage to it.
The known scrapers as described above work well in practice. Problems have however been encountered in situations where the conveyor belt runs "dry", i.e. there is no conveyed material on the belt.
Frictional contact between the scraper and the belt generates substantial heat. In the conventional, practical arrangement the deflector and curtain, which is typically made of natural rubber, are clamped between the blade segment and a bracket formation on the linkage. The deflector and curtain accordingly act as thermal insulators between these components. When there is material on the belt which is scraped off by the scraper at least some of the thermally generated heat is conveyed away from the assembly by the material itself. However when the belt runs "dry", there is no such removal of heat and excessive heat can build up in the assembly, possibly leading to heat deterioration of the curtain and deformation or even melting of the plastics deflector. This in turn can lead to a loosening of the connection between the bracket and the linkage. The loosened bracket, i.e. blade segment, can then vibrate or chatter against the belt, resulting in further build-up of heat and rapid wear to the blade and also to the other mechanical components.
A solution to this particular problem would be to avoid running the belt "dry". However many handling plants have control systems and protocols which automatically run conveyor belts even when there is no material to convey.
Rapid wear of the scraper apparatus can also take place in situations where particularly abrasive particulate material is transported by the conveyor belt. It has been observed that the deflector itself can undergo rapid wear as a result of the material falling onto it. It is believed that such wear is mainly attributable to the fact that the deflector is oriented at a relatively acute angle relative to the horizontal and so is largely exposed to vertically falling material which rapidly abrades it. If the deflector and curtain are worn through, the mechanical linkage itself will be exposed directly to the falling material scraped off the belt, and this may have the effect of shortening the life of the scraper.
The present invention seeks to provide, in a conveyor belt scraper of the type here in question, features which can contribute to reducing the rate of wear of the scraper apparatus.


A bidirectional DC-DC converter includes a series circuit of a first winding of a first reactor, a second reactor, and a first switch connected to both ends of a first DC power source, a series circuit of a second switch and a second DC power source connected to both ends of the first switch, a series circuit of a second winding of the first reactor, a third reactor, a first selector switch, and a first diode connected to both ends of a series circuit of the second reactor and the first switch, a series circuit of a second selector switch, a second diode, and the second DC power source connected to both ends of a series circuit of the first selector switch and first diode, and a controller turning on/off the switches and the selector switches.

As is disclosed as a car-mounted power converter in Japanese Unexamined Patent Application Publication No. 2009-261136, there is known a bidirectional DC-DC converter capable of achieving high efficiency and low noise. FIG. 1 is a circuit diagram illustrating a bidirectional DC-DC converter according to a related art. In FIG. 1, the bidirectional DC-DC converter steps up a DC voltage of a DC power source V1 and supplies the stepped-up voltage to a DC power source V2. Also, it steps down a DC voltage of the DC power source V2 and supplies the stepped-down voltage to the DC power source V1. Namely, the bidirectional DC-DC converter is a circuit having a step-up chopper circuit provided with a power regenerative function so as to operate, at the time of power regeneration, as a step-down chopper circuit.
A reactor Lc includes a winding 1c having the number of turns of n3 and a winding 1a having the number of turns of n1, the windings being wound around a core (not illustrated), electromagnetically coupled with each other, and connected in series. Both ends of the DC power source V1 are connected to a first series circuit that includes the winding 1c of the reactor Lc and a switch Tr11. Connected between the collector and emitter of the switch Tr11 is a second series circuit that includes the winding 1a of the reactor Lc, a reactor La1, a switch Tr14, a switch Tr12, and the DC power source V2. The reactor La1 may be a leakage inductance between the windings 1a and 1c of the reactor Lc.
Connected between the collector and emitter of the switch Tr11 is a third series circuit that includes a switch Tr13 and the DC power source V2.
Each of the switches Tr11 to Tr14 is an insulated gate bipolar transistor (IGBT) having a gate, an emitter, and a collector.
Connected in parallel between the collector and emitter of the switch Tr11 is a diode D11, connected in parallel between the collector and emitter of the switch Tr12 is a diode D12, connected in parallel between the collector and emitter of the switch Tr13 is a diode D13, and connected in parallel between the collector and emitter of the switch Tr14 is a diode D14.
A controller 100 applies control signals to control terminals of the switches Tr11, Tr12, Tr13, and Tr14 to turn on/off these switches, thereby carrying out step-up and step-down operations of DC voltage.
The bidirectional DC-DC converter with such a configuration according to the related art turns on/off the switches to carry out the step-up and step-down operations of DC voltage. During the step-up or step-down operation, the related art realizes a soft switching operation on each switch, as well as a recovery-less turn-off operation on each diode.

National University Corporation Shimane University