A method for managing a wireless connection of an Unmanned Aerial Vehicle (UAV) is described herein. The method may include detecting a handover condition for the UAV within a wireless network, wherein the UAV is connected to a source cell in the wireless network when the handover condition is detected; determining, in response to detecting the handover condition, a target cell in the wireless network based on a flight path of the UAV; and initiating a handover of the UAV from the source cell to the target cell.

The Federal Aviation Administration (FAA) and National Aeronautics and Space Administration (NASA) are defining an Unmanned Aerial Vehicle (UAV) Traffic Management (UTM) framework/system. Such a system seeks to present an effective management structure for UAV traffic. In this vein, the UTM is sought to act as an enabler to promote widespread use of UAVs in both commercial and recreational settings while at the same time minimizing the perils to manned air traffic and surrounding pieces of infrastructure. The UTM system is designed to work autonomously, with no active human air traffic controller constantly supervising and monitoring the airspace.
Besides enforcing constraints and directives from the FAA and other regulatory/governmental agencies, the UTM can provide supplemental data services to UAV operators. Such services could include terrain information, weather information, communication coverage, spatial occupancy of other UAVs, surveillance information of a mission area, or performance information of specific aircraft. The UTM also allows private and public entities to provide constraints, notifications, and other necessary information to carry out UAV missions in a safe manner. A UAV Service Supplier (USS) in the UTM architecture is the entity that collects all required information from other entities or connects information consumers with their providers upon request.
A UTM system will commonly be used for the planning, scheduling and execution of a UAV mission. When a UAV operator is planning for a UAV mission (e.g., a package delivery mission), the UAV operator will post the planned mission request to the USS. The USS will check that the planned mission is allowed by a Flight Information Management System (FIMS) and, if permitted and with no scheduling conflicts, the UAV operator will eventually be granted a "go ahead" to carry out the mission. At this stage, the USS could send all relevant information, including the flight path, to the UAV operator. Once the mission is in progress, the USS can issue fresh notifications to the UAV operator if any mission conditions change during the allocated time slot of the mission (e.g., fresh new constraints are issued, weather emergencies arise or the airspace becomes congested).
To maintain safe operations of a UAV, command and control (C2) link connectivity is paramount. A UAV operator issues commands to a UAV over this channel to maintain control of the UAV to carry out the mission. If this C2 link fails to consistently provide connectivity and access to the UAV, the mission success and safety is in jeopardy.

Planned continuity of unmanned aerial vehicle (UAV) link connectivity in UAV traffic management systems


An FDTS/DF equalizer using absolute value calculation includes: a feed-forward filter receiving and filtering a sampled signal; a feed-back filter filtering a restored data; a subtractor obtaining a difference between signals respectively filtered by the feed-forward filter and the feed-back filter; and a detector receiving the subtracted signal and detecting a data using absolute value calculation. The FDTS/DF equalizer in the reproducing terminal which reproduces a data passing through a channel performs an absolute value operation by using the adder, so that the number of gates can be reduced, the calculation speed can be improved, and the size of a chip can be reduced.

1. Field of the Invention
The present invention relates to an equalizer of a digital optical disk recording/reproducing system, and more particularly, to a fixed delay tree search/decision feedback equalizer using an absolute value calculation in a reproducing terminal which reproduces a data passing through a channel and a data restoring method using the same.
2. Description of the Background Art
Recently, as a recording density of a recording medium of an optical recording/reproducing system increases, an intersymbol interference is increased between recording data. Thus, a technique allowing a reading terminal of the recording/reproducing system to accurately restore a data is required.
FIG. 1 is a schematic block diagram showing the construction of a general digital optical recording/reproducing system.
As shown in FIG. 1, a data recording terminal 100 of the digital optical recording/reproducing system includes an A/D converter 110 sampling an image/audio signal to digital data; a coding unit 120 for coding the image/audio signal; a recording waveform generating unit 130 generating a recording waveform according to a characteristic of an optical recording medium; a laser disc (LD) drive unit 140 driving an optical diode corresponding to the recording waveform, and a phase lock loop (PLL) 150 for synchronizing in recording a data.
A data reading terminal 200 of the digital optical recording/reproducing system includes: a radio frequency amplifying unit 210 reading and amplifying a data stored in the optical recording medium; an automatic gain controller 220 controlling a gain of the radio frequency amplified signal; a synchronizing unit 240 compensating a time delay; an A/D converter 230 sampling the gain controlled signal to digital data; an equalizer 250 restoring the sampled digital data; a decoding unit 260 removing a noise generated to the restored digital data and detecting and correcting an error for channel transmission; and a D/A converter 270 restoring the decoded digital data to its original image/audio signal.
The operation of the digital optical recording/reproducing system constructed as described above will now be explained.
First, the A/D converter 110 samples an inputted image/audio signal and converts the signal into a digital data.
Then, the coding unit 120 codes the digital data in order to minimize an error or a noise in transmission of the digital data through channel.
Then, the recording waveform generating unit 130 generates a waveform for being recorded in a storing medium according to the coded digital signal, and the LD drive unit 140 records a signal corresponding to the waveform in the storing medium 160.
The radio frequency amplifying unit 210 amplifies the signal detected from the storing medium 160, and the automatic gain controller 220 controls the gain of the amplified signal to a certain level.
Then, the A/D converter 230 samples the gain-controlled signal to digital data, and the equalizer 250 restores the sampled signal as a data.
At this time, the synchronizing unit 240 synchronizes the equalizer 250 and the A/D converter 230 in order to prevent occurrence of a time delay in sampling and data restoring.
Thereafter, the decoding unit 260 removes a noise of the data generated in transmitting it through a channel, detects and corrects an error, and then, the D/A converter 270 restores an original image/audio signal.
At this time, in order to restore an accurate data, the equalizer 250 of the reproducing terminal 200 generally uses a decoding algorithm of a maximum likelihood sequence detection (MLSD) method.
However, the MLSD method is implemented on the basis of a means square error (MSE) in which a minimum distance is computed by the square of an error between the signal inputted to the equalizer 250 and a reference signal and a decoding is performed according to a path metric that accumulates the computed minimum distances.
However, a multiplier used for the minimum distance computation exposes the following problems.
That is, in a high density digital video disc (DVD) system of 15 GB (giga byte) level, a calculation speed of a higher speed is requested, and if it is substantially implemented as an application-specific integrated circuit (ASIC), the computation amount is increased, so that a calculation speed is slow. And since many gates are used, a chip is enlarged in size.
In addition, in order to improve the speed in operating the minimum distance using the MLSD method, if a different calculation method (i.e., an absolute value calculation) is used, a performance is rather degraded.

Fixed delay tree search/decision feedback equalizer using absolute value calculation and data restoring method using the same


A tool includes a pair of spaced apart substantially parallel arms carrying a mounting member to which are detachably connected axially oriented driver and drill elements. The mounting member is moveable along the arms reciprocally between a first position where it is manually rotated to select the axial orientation of the driver and drill elements and a second locked position to hold the driver and drill elements in a selected axial orientation until the mounting member is return to the first position. The locking function is provided by a spring element actuated upon the mounting member being moved from the first position to the second position to apply pressure against the mounting member while in the second position.

In the construction and renovation of commercial and residential buildings as well as in various manufacturing operations, it is often necessary to perform repeated drilling and driving operations. For example, a hole is drilled into a wall or ceiling surface and then a screw or other type of fastener is driven into the drilled hole. U.S. patent application Ser. No. 10/902,732, filed Jul. 29, 2004, entitled Reversible Drill and Drive Tool, assigned to Alltrade Tools LLC, and U.S. Pat. Nos. 4,512,693 and 4,676,703 are illustrative of tools that can be attached to a power drill to allow this drill to both drill a hole and drive in a screw or another type of fastener.


Systems and techniques for filtering of radiofrequency signals. A plurality of tunable cross-couple resonators are connected using capacitive coupling elements to form a cross-coupled bandpass filter. A center frequency of the filter may be set based on frequencies of the resonators and a fractional bandwidth of the filter may be set based on states of the capacitive coupling elements. Programmable zeroes of the filter may be set based on states of reactive elements coupling selected pairs of the resonators. The reactive elements may be capacitive, for zeroes below the center frequency, or inductive, for zeroes above the center frequency.

As the popularity of wireless cellular data communications devices, and the demands made on them, continue to increase, the demands on the frequency spectrum available for such communication become greater and greater, with network operators and device manufacturers under increasing pressure to use frequencies as efficiently as possible in order to avoid saturating the available frequency bands.

Methods and apparatus for signal filtering


A specimen container configured for cryogenic processing of a specimen includes an elongate member, a first specimen processing medium contained within a lumen of the elongate member at a first position, a second specimen processing medium contained within the lumen of the elongate member at a second position located distal to the first position, and a barrier positioned between the first and second specimen processing mediums such that the first and second specimen processing mediums are spaced apart from each other within the lumen of the elongate member.

Low temperature specimen carriers, such as cryopreservation devices, are used in the field of assisted reproductive technology (ART) to store and preserve living reproductive specimens (e.g., oocytes, embryos, and blastocysts). Cryopreservation refers to a process in which specimens are preserved over extended periods of time by cooling to sub-zero temperatures. For example, a cryopreservation device can house and support specimens undergoing vitrification, which is the rapid transition of a substance from a liquid phase to a solid phase (e.g., glass) without the formation of ice crystals within cells of the specimen.
Typical protocols for vitrifying a reproductive specimen include accessing a carrier (e.g., a petri dish, a test tube, or flask) in which the specimen is disposed multiple times to expose the specimen to multiple processing solutions. Such protocols further include subsequently transferring the specimen to a cryopreservation device, and then exposing the cryopreservation device, containing the specimen therein, to a cooling medium (e.g., liquid nitrogen) to cause the cells of the specimen to rapidly cool to a glass state before ice crystals can form within the cells. The cryopreservation device can be stored in the cooling medium until the specimen is ready to be used in reproductive procedures.


Wafers are previously positioned so that the wafer orientation flat is oriented in a particular direction. A transporting means then moves and places the previously positioned wafer on a bonding stage where bumps are formed on the wafer by means of a bonding head. The transporting means has a sensor for detecting the position of the orientation flat of a wafer on the bonding stage from a position above the bonding stage, thereby avoiding the adverse effects of heat from the bonding stage during orientation flat detection.

1. Field of the Invention
The present invention relates to a bump bonding apparatus for forming, by means of a wire bonding technique, bumps for establishing an electrical connection to an electrode part of an IC chip. More specifically, the present invention relates to a bump bonding apparatus and method for forming such bumps on the wafer before being cut into IC chips.
2. Description of Related Art
Demand for smaller and lighter electronic devices has accelerated in recent years, particularly with respect to portable devices, and this has significantly increased demand for smaller IC chips for use in these electronic devices.
Conventionally, in a bump bonding apparatus, a single wafer is diced into a plurality of individual IC chips, and each IC chip is transported and positioned onto the bonding stage for bonding by ones, to form bumps at the electrode parts on the IC chip. Such bump bonding apparatuses, however, suffer from numerous technical problems, including: low production efficiency; difficulty in moving and handling the IC chips with a tray; and difficulty in positioning the IC chips with good precision.
Some of these problems can be addressed by forming bumps for individual IC chips before dicing the wafers into individual chips.
As described more fully below, however, forming bumps directly onto the undiced wafer presents a different set of technical difficulties as compared with handling the individual IC chips, and these problems must therefore be resolved in practice.
For example, while the wafers supplied to the bump bonding apparatus are stacked on multiple shelves in the wafer carrier, the wafers are loose in the carrier. Therefore, after the wafers are extracted from the carrier and regulated for their position on the positioning table, these wafers are moved to the bonding stage. The wafers are circular discs having a straight orientation flat cut into one edge of the wafer. On the positioning table, it is necessary to regulate a center of the wafer in position and regulate the circumferential location of the orientation flat. This requires a complex mechanism, such as a turntable and means for positioning the wafer from four directions around the wafer circumference. Positioning is also time consuming. Because the wafers are loose in the carrier, there is also the further danger of carrier vibration causing a wafer to fall out from its storage location.
When bumps are formed at various points around the entire surface of the stationary wafer with a large area, the relative movement distance of the bonding head and bonding stage becomes rather long. Therefore, a longer arm is required for the bonding mechanism. This makes it mechanically difficult to assure sufficient positioning precision. These problems can be addressed by dividing the wafer circumferentially into a plurality of segments for bump formation, turning the wafer about its center when all bumps in one segment are formed, positioning the next segment for bump formation, and then forming the bumps in that segment.
In such a case, if the bonding stage, on which the wafer is fixed, is turned, it heats up the stage. Thus, thermal expansion and contraction of the turn drive mechanism makes consistent, high precision positioning difficult. This heat problem can be addressed in part by blowing a turn air flow to the bottom of the wafer to float and turn the wafer, and stopping the turn of the wafer based either on a timer or visual inspection by an operator. A problem with this method, however, is that minute variations in the turning air flow cause the wafer to move irregularly, easily producing variations in rotational positioning. Therefore, consistent, stable wafer positioning is difficult with the method.
Through extensive research focused on the various technical problems presented by directly forming bumps on an IC wafer before wafer dicing, the inventors of the present invention proposed, in Japanese Patent application No. 3-323064, a bump bonding apparatus and bump forming method that effectively resolves the above-noted problems.
However, while the above-noted bump bonding apparatus and bump forming method effectively solves the conventional problems described above, there remain a number of technical problems to be solved in order to yet further improve productivity, reduce cost, and improve quality.
With a conventional bump bonding apparatus, for example, the wafers are stored and supplied to the bump bonding apparatus in a stack on a plurality of shelves formed in the carrier. To make positioning the wafers on the bonding stage easier, a position regulating means is provided on the extractor for extracting the wafers from the carrier. A four-points, chuck holds the wafer at four points after regulating the orientation flat to be oriented in a specific direction using the position regulating means, and moves the wafer to the bonding stage. Inserting the wafers in the carrier is a manual task performed by the operator. The operator must carefully insert each wafer in the carrier with the orientation flat oriented in a specific direction, so that the later positioning operation can proceed smoothly.
This means that the operator may need to repeatedly handle a wafer in order to position the orientation flat properly. In addition to making the operator work greater, this also increases the potential for damage to high cost wafers. Further, in such a case, the wafer is regulated for its position before being transported to the bonding stage. This also increases the number of times for wafer handling, and thus increases the potential for wafer damage.
Also further, when the chuck holds the wafer at several points around the edge of the wafer for transport, it is also possible for one of the chucking points to be on the orientation flat of the wafer. If the chuck holds the wafer at only a few points, such as four points in the case of a 4-chucking points type chuck, the wafer may not be properly centered in the chuck. This means that despite efforts to regulate the wafer for its position, the orientation flat may become out of position, while the wafer is transported onto the bonding stage.
A sensor provided on the bonding stage is also used to detect the position of the orientation flat on the boding stage in a conventional bump bonding apparatus. The bonding stage typically reaches temperatures of approximately 300 degrees centigrade. Therefore, expensive heat resistant sensors capable of withstanding such temperatures must be used for the orientation flat sensor, and this contributes to higher cost.
A conventional bump bonding apparatus also typically has an orientation flat sensor located on only one side of the bonding stage. This makes wafer positioning difficult when the wafer is divided circumferentially into plural segments for bump formation, and the wafer is sequentially turned about its center to form bumps in one section at a time. The air blowing means that is used for pushing the wafer to one side is also provided only in one direction, on which the orientation flat sensor is mounted. Furthermore, while only one orientation flat sensor is provided, a plurality of sensors is preferably provided along the base line of the orientation flat (the cut edge on the outside edge of the wafer) to improve the precision for detecting the orientation flat.
As also noted above, in a conventional apparatus, the method is proposed, wherein the wafer is divided circumferentially into a plurality of segments and is turned about its center to sequentially form bumps in each segment, and an air blowing means for floating and turning is therefore used. In this case, however, since the wafer has been heated on the bonding stage and is also cooled down by the air flow for floating, turning, or, pushing it to one side, the resulting rapid temperature change may adversely affect the wafer.
Yet further, when the wafer is floated on air for a turn above the bonding stage, consistently stable wafer turning is needed in order to increase orientation flat detection precision. Depending upon such factors as the wafer material and shape, however, stabilizing wafer turning under specific conditions can be difficult with conventional technology. For example, when the surface roughness on the back side of the wafer exceeds a particular level, such as with quartz and lithium tantalate wafers, the friction coefficient of the back side of the wafer to the bonding stage surface is high and the wafer does not slide easily. This makes it necessary to use a relatively strong air flow, but when the air flow is increased, air flow turbulence is increased. Thus, this makes it even more difficult to stabilize the wafer turning. A relatively strong air flow is also needed to start turning a heavy or large wafer. Increasing the air flow, however, also increases the effect of wafer inertia. This reduces the precision for stopping the wafer at the end of its turn, and thus leads to orientation flat detection error.
With consideration for the aforementioned problems of the related art, an object of the present invention is therefore to provide a bump bonding apparatus and bump formation method achieving a further increase in productivity, a reduction in cost, and an increase in quality when forming electrode bumps directly on a wafer before dicing it.
To achieve the above object, a first aspect of the present invention relates to a bump bonding apparatus for forming bumps by means of a bonding head on a wafer that has been transported onto a bonding stage using a wafer transporting means. In this case, a wafer has been previously regulated for its position so that an orientation flat formed at a circumferential edge of the wafer is oriented in a specific direction. The transporting portion of this bump bonding apparatus comprises an orientation flat detecting means for detecting the location of the orientation flat of the wafer on the bonding stage.
By thus providing the orientation flat detecting means on the transporting portion, the sensor is not subject to the high temperature heat of the bonding stage, which is different from the related art in which the sensor is provided on the bonding stage. It is therefore not necessary to use a particularly high temperature resistant sensor. Furthermore, since the orientation flat detecting means can move in conjunction with movement of the transporting portion, the location of orientation flat detection is not limited to one side of the bonding stage, which is different from the related art in which the sensor is fixed at one side of the bonding stage.
The orientation flat detecting means is preferably an optical sensor having a light emitting element and a receptor element, and is provided on a chucking means of the transporting portion. By using an optical sensor, the position of the orientation flat can be more reliably detected. In addition, by providing the sensor on the chucking means of the wafer transporting portion, the orientation flat, can be detected from above the wafer, or more specifically from above the bonding stage, thereby more reliably avoiding the effects of heat from the bonding stage.
Yet further preferably, there is a plurality of the detecting means arranged in a direction perpendicular to the travel direction of the transporting portion. By thus arranging a plurality of the detecting means perpendicularly to the direction of the transporting means travel, orientation flat detection with even greater precision can be achieved.
Yet further preferably, a bevel with a specific slope is formed in the top surface of the bonding stage at and near the edge of the bonding stage. By thus forming appropriately sloped bevels on the bonding stage, when detecting an orientation flat from above the wafer, a detection light emitted from the detecting means is reflected at the bevel in different directions from that of incidence when the orientation flat is desirably positioned directly below the sensor. More specifically, when the orientation flat is positioned directly below the sensor, the detection beam will not be reflected from the top of the bonding stage back to the receptor, and will thus not interfere with orientation flat detection.
Yet further preferably, a pair of positioning rollers is provided on both right and left sides of the bonding stage. A floating air blower for floating a wafer, a turning air blower for turning a wafer, a first positioning air outlet for pushing a turning wafer to a pair of the positioning rollers on one side and stopping its turn, and a second positioning air outlet for pushing a turning wafer to a pair of the positioning rollers on the other side, are provided on the top surface of the bonding stage. A switching means is also provided for switching the air supply to the first and second regulating air outlets. It is therefore possible to push the wafer to either side of the bonding stage. In this case, since the orientation flat sensor can also move in conjunction with the transporting means, detecting the orientation flat is not limited to only one side of the bonding stage, and the orientation flat can be detected at either side of it.
A bump bonding apparatus according to a second aspect of the present invention forms bumps by means of a bonding head on a wafer supplied to a bonding stage. The apparatus has a pair of positioning rollers disposed on both right and left sides of the bonding stage and has, on the top surface of the bonding stage, a floating air blower for floating a wafer and a turning air blower for turning a wafer, and a positioning air outlet for pushing a turning wafer to a pair of the positioning rollers on at least one side and stopping its turn. The bonding stage comprises a stage plate in which the air outlets are disposed, a heat block disposed below the stage plate, and an air chamber provided in the stage plate. The air chamber leads to each of the air outlets and can temporarily store supply air from outside.
The air chamber in this bump bonding apparatus allows the supply air from outside to warm a certain degree in the air chamber before it is ejected from the air outlets to the bottom of the wafer. Thus, when air is blown from the air outlets against the bottom of the wafer to float, turn, or position a wafer heated on the bonding stage, the temperature gradient of ejected-air cooling of the heated wafer is more gradual than with a conventional bump bonding apparatus. Thus, the effects of wafer cooling by these ejected-air streams can be effectively avoided.
A bump bonding apparatus according to a third aspect of the present invention forms bumps by means of a bonding head on a wafer supplied to a bonding stage. This apparatus has on the top surface of the bonding stage a floating air blower for floating a wafer and a turning air blower for turning a wafer, and the air flow from the turning air blower against a back side of the wafer during wafer turn is variable.
By thus varying the air flow against the backside of the wafer during wafer turn, the air flow can be adjusted according to the wafer material, shape, and size. The air flow can thus be controlled to achieve stable wafer turn.
Yet further preferably, the turning air blower comprises: a plurality of turning air outlets disposed in the substantial same circumference on the top of the bonding stage; an air supply path of which one end leads to the turning air outlets, and the other end branches; a normal turning air supplying means disposed at one branch of the air supply path; and an auxiliary turning air supplying means disposed at another branch of the air supply path and operable in addition to the normal turning air supplying means. Additionally, the air flow to the back side of a wafer from the turning air blower can be changed by controlling the air supplying means to supply air at a specific flow rate. Therefore, it is possible to control the air flow to a specific level at the air supplying means disposed on the opposite end of the air supply path from the plurality of turning air outlets. Thereby, the air flow to the back side of the wafer from the turning air outlets is varied. Air supply can thus be adjusted according to the wafer material, size, and shape to achieve stable wafer turn. It is also possible to smoothly slow wafer turn from high speed to low speed without completely interrupting the air supply because air supplied from both supplying means is ejected from the same air outlets.
Alternatively, the turning air blower comprises: a plurality of turning air outlets disposed on a first circumference on the top of the bonding stage; an auxiliary turning air outlet disposed on a second circumference on the top of the bonding stage; a normal turning air supplying means disposed at the other end of an air supply path of which a first end leads to turning air outlets; and an auxiliary turning air supplying means disposed at the other end of an air supply path of which a first end leads to auxiliary turning air outlets, and which is operable in addition to the normal turning air supplying means. In this case, the air flow to the back side of a wafer from the turning air blower can be changed by controlling the air supplying means to supply air at a specific flow rate. Therefore, it is possible to control the air flow to a specific level at the air supplying means disposed on the opposite end of the air supply path from the plurality of turning air outlets, and thereby vary the air flow to the back side of the wafer from the turning air outlets. Air supply can thus be adjusted according to the wafer material, size, and shape to achieve stable wafer turn.
Yet further preferably, air flow is controllable in the normal turning air blower and/or the auxiliary turning air blower. This enables even more precise control of the air flow from the air outlets, enables air flow to be smoothly changed, and can thus further stabilize wafer turn.
Yet further preferably, the air flow to the backside of the wafer during wafer turn is controllable by supplying air in steps from the auxiliary turning air blower. By thus enabling air flow from the auxiliary turning air blower to be increased in steps at the start of turning, air flow from the air outlets can be smoothly changed, wafer turn can be gradually started, and wafer slipping due to rapid starting can be prevented. Further, the air flow to the backside of the wafer during wafer turn is controllable by intermittently supplying air from the auxiliary turning air blower. By thus intermittently supplying auxiliary air during wafer turn, low speed, stable wafer turn can be maintained even with wafers having a surface roughness on the back side exceeding a particular level that tends to cause the wafer to stop easily on the bonding stage.
Yet further preferably, the air outlets of the turning air blower are disposed on top of the bonding stage on a circumference at or near the wafer edge, or a circumference thereinside. In this case, air for turning the wafer is ejected from the bonding stage, thereby distributing torque across the backside of the wafer and enabling stable wafer turn. This is particularly effective with large wafers.
There is yet further preferably an orientation flat detecting means for detecting the position of a wafer orientation flat on the bonding stage. It is thus possible to detect the position of the orientation flat after the wafer is turned on the bonding stage, and thereby confirm the orientation of the wafer on the bonding stage.
A bump bonding apparatus according to a fourth aspect of the present invention forms bumps by means of a bonding head on a wafer, which has been previously regulated for its position so that an orientation flat formed at a circumferential edge of the wafer is oriented in a specific direction, and has been transported onto a bonding stage by a transporting portion. The transporting portion comprises a chucking means for holding a wafer at six points.
With the 6-points chucking means of the present invention, the wafer will not be shifted off-center even if the chuck holds the wafer with one of the chucking points being on the orientation flat. Thus, offset positioning of the orientation flat can be effectively prevented when a wafer is transported onto the bonding stage, which is different from a 4-points chucking means.
A bump bonding apparatus according to a fifth aspect of the present invention has a loading station having a carrier for storing a plurality of wafers stacked therein with a specific gap therebetween, and a lifter for positioning the carrier at a specific vertical position. This apparatus forms bumps by means of a bonding head on a wafer extracted from the carrier by an extracting means and placed on a bonding stage by means of a transporting means. It further comprises at the loading station: a detecting means for detecting whether an orientation flat of a wafer in the carrier is within a specific range for a reference position, and means for notifying the operator when the detecting means detects the orientation flat to not be within this specific range for the reference position.
The orientation flat detecting means can thus reliably detect whether the wafer is desirably positioned, and the operator can be notified of the result. The operator""s task of inserting wafers into the carrier is thus made easier, the job of adjusting the position of the orientation; flat can be simplified, and the need for manually handling the wafers can be reduced. It is to be noted that the orientation flat detecting means is preferably located at the lifter of the loading station.
Yet further preferably the orientation flat detecting means is a plurality of optical sensors having a light emitting element and a receptor element disposed perpendicularly to the direction of wafer extraction from the carrier. Using optical sensors for the orientation flat detecting means thus assures reliable orientation flat detection, while also simplifying both the detecting means and its mounting structure. Providing a plurality of sensors as described above also enables even higher detection precision.
A bump bonding method according to a sixth aspect of the present invention forms bumps on a wafer supplied to a bonding stage by means of a bonding head. A floating air blower for floating a wafer and a turning air blower for turning a wafer are provided on the bonding stage, and the method comprises a step for variably controlling air flow from the turning air blower to a back side of the wafer during wafer turn.
It is therefore possible to vary the air flow to the back side of the wafer during wafer turn, and thus adjust the air supply according to the wafer material, size, and shape to achieve stable wafer turn.
Yet further preferably, in step for variably controlling air flow from the turning air blower during wafer turn, air from the turning air blower is supplied by stages. By thus increasing turning air flow by stages at the start of the turning, air flow from the air outlets can be smoothly changed, wafer turn can be gradually started, and wafer slipping due to rapid starting can be prevented.
Further alternatively, the air flow to the backside of the wafer during wafer turn can be intermittently supplied from the auxiliary turning air blower. By thus intermittently supplying air during wafer turn, low speed, stable wafer turn can be maintained even with wafers having a surface roughness on the back side exceeding a particular level that tends to cause the wafer to stop easily on the bonding stage.
Yet further preferably, an orientation flat detecting means is provided for detecting the position of the orientation flat of a wafer on the bonding stage after wafer turn. In this case, the position of the orientation flat can be detected after wafer turn to confirm the orientation of the wafer on the bonding stage.
Other objects and attainments together with a fuller understanding of the invention will become apparent and appreciated by referring to the following description and claims taken in conjunction with the accompanying drawings.

Matsushita Electric Industrial Co., Ltd.


A linear actuator (8) in which a squeeze protection device is arranged, where the device is located in connection with the rear fixture (17) on the motor (10). The squeeze protection device is based on a piezo element (23), which as a module (22) is built into the actuator (8), so that it is passed through by the forces, exerted by the actuator (8). The piezo element (23) is equipped with cables (30), which are connected to a printed circuit board (31) in the actuator (8), where the connections for the actuator (8) are collected, so that the signal from the squeeze protection in an easy manner may be communicated to a control device (6), which can stop the motor (10) or briefly reverse the direction of the movement and thus release a trapped object.

1. Field of the Invention
The invention relates to an actuator with squeeze protection.
2. The Prior Art
The explanation of the invention starts with a linear actuator of the type that includes a linear movable, tubular activation element. A linear actuator includes an electric motor which, through a transmission, drives a spindle. On the spindle rides a spindle nut, to which one end of the tubular activation element is secured. The other end of the tubular activation element is secured with a front fixture to a movable element in a structure in which the actuator is incorporated, while a rear fixture is secured in the stationary part of the structure, or vice versa. By rotating the spindle nut, this will either move outwards or inwardly on the spindle, depending on the direction of rotation, and the tube section thus will move axially outwardly or retract in a manner corresponding to the piston rod on a telescopic cylinder.
Linear actuators are widely used in adjustable furniture, such as beds, chairs or tables, for adjusting, e.g., the height, of a table or the mattress surface of a bed.
In relation to adjustable furniture, personal safety is an area of priority. A linear actuator exerts large forces during the adjustment of an article of furniture, for which reason there is a risk for personal injury if a body part is caught in the furniture. Even though the consideration for personal safety is the main objective, a further consideration should also be shown for the actuator. In case of an adjustable table, an encounter with a windowsill/computer shelf or another table could, e.g., block the movement and result in the actuator being overloaded and damaged.
A device for squeeze protection in connection with a table is known from U.S. Pat. No. 5,495,811 to Ergoflex Systems, where a trapped object will activate a switch in the form of a ribbon switch, which subsequently interrupts the power supply to the actuator. The device requires the contact element to be spread out over all surfaces where there might be a risk of squeezing. In case of a table where squeezing may occur between an object and the upper side and underside of the tabletop, respectively, the outlined solution is difficult to implement and not practical.
Another device is known from US 2003/0052626 A1 to Dewert Antriebsund Systemtechnik, where a measurement of the motor current is carried out as an expression for the load on the motor. A blocking of the mechanism would cause the motor current to rise momentarily, as a result of which the current to the motor may be interrupted to avoid squeezing of an object and overload of the appliance and the motor. The arrangement is as far as it goes fine by being a simple solution which is easy to implement. The challenge is that the load on an adjustable table varies with the amount of equipment which is placed on the table and the position of the equipment. The same applies to a bed, where the load depends on the weight of the person using the bed and whether the person is fully or partly positioned in the bed. As the actuator must be able to exert forces which counteract the load, a threshold for the limitation of the motor current will have to be so high that no gentle protection from injuries due to squeezing is provided for the person.
A squeeze protection for use in connection with an actuator is further known from WO 03/056976 to Linak A/S. The squeeze protection is arranged in a housing, which with a special fixture can form a connection between the actuator and the table top. The device may be supplied with new systems but is also suitable for retrofitting. The solution is as far as it goes fine but complicated as the electrical connection for the squeeze protection will have to be separately led to the operation unit. Further, it is beset with great difficulties to install the device. Another factor is that the constructional height of the column is extended by the height of the device, for which reason the lowest adjustment height for the column is undesirably increased. Since the device consists of many parts, it is also relatively expensive.
A solution is thus needed which safely but in a simpler manner solves the problem of injuries due to squeezing during the adjustment of the above-mentioned adjustable articles of furniture.
The purpose of the invention is to provide a solution to the outlined problem, i.e., to achieve a safe squeeze protection, which in addition to being simple and compact also functions independently from the load on the appliance. Further, a solution is desired which if possible is completely integrated with the actuator, so that unnecessary wiring and assembling is avoided. A solution is sought which as far as possible cooperates with the existing parts in the actuator and thus in an integration does not take up more space and is inexpensive.


In an offset fixing operational amplifier circuit, an operational amplifier circuit includes an input stage containing a first constant current source, a second constant current source, a first differential pair and a second differential pair. A bias circuit supplies a bias voltage to the operational amplifier circuit. An offset fixing circuit controls the input stage in accordance with an input voltage of the operational amplifier circuit.

The present invention relates to an operational amplifier circuit, and more particularly, it relates to an operational amplifier circuit for fixing an offset voltage to a constant value in an output dynamic range.
Recently, with respect to liquid crystal panels and organic EL panels particularly for use in portable equipment, compact mobile equipment and large panel equipment, there are increasing demands for an operational amplifier circuit capable of outputting a constant offset in a wide output voltage range with small power consumption. In conventional technique, an operational amplifier circuit is generally used for realizing a wide output voltage range, but it has been impossible to fix an offset to a constant value in a wide output range because of restriction in the circuit configuration.
A conventional operational amplifier circuit will now be described with reference to FIG. 18. The operational amplifier circuit roughly includes three parts, that is, an input stage, a phase compensating part and an output stage. The operational amplifier circuit receives bias voltages VBP0, VBP1, VBP2, VBP3, VBP4, VBN0, VBN1, VBN2, VBN3 and VBN4 from a bias circuit for performing a given operation.
Offset specialization of the conventional operational amplifier circuit will now be described with reference to FIGS. 10A through 10E. A waveform of FIG. 10A is obtained when an input voltage INP is changed from a potential resulting from addition of an overdrive voltage to a voltage AVSS to a potential resulting from subtraction of the overdrive voltage from a voltage AVDD. At this point, a current flowing to a transistor MP1, that is, a PMOS current source of the input stage, is indicated by Idp1 and a current flowing to a transistor MN1, that is, an NMOS current source, is indicated by Idn1. A waveform of FIG. 10B shows a current characteristic of the current Idp1 flowing to the PMOS transistor MP1 when the voltage INP is changed from the potential resulting from the addition of the overdrive voltage to the voltage AVSS to the potential resulting from the subtraction of the overdrive voltage from the voltage AVDD. In a period t3, no current flows because PMOS differential pair transistors MP2 and MP3 are in an off state. A waveform of FIG. 10C shows a current characteristic of the current Idn1 flowing to the NMOS transistor MN1 when the voltage INP is changed from the potential resulting from the addition of the overdrive voltage to the voltage AVSS to the potential resulting from the subtraction of the overdrive voltage from the voltage AVDD. In a period t1, no current flows because transistors MN2 and MN3 are in an off state.
A waveform of FIG. 10D shows a current characteristic obtained as a sum of the current characteristics of the currents Idp1 and Idn1 obtained when the voltage INP is changed from the potential resulting from the addition of the overdrive voltage to the voltage AVSS to the potential resulting from the subtraction of the overdrive voltage from the voltage AVDD. In the period t1, since the NMOS current source MN1 is halted, a current value obtained as a sum of the currents Idp1 and Idn1 is equal to the current value of the current Idp1. In a period t2, since both the NMOS current source MN1 and the PMOS current source MP1 are operated, a current value obtained in this period is equal to a current value obtained as the sum of the currents Idp1 and Idn1. In the period t3, since the PMOS current source MP1 is halted, a current value obtained as the sum of the currents Idp1 and Idn1 is equal to the current value of the current Idn1.
A waveform of FIG. 10E shows an offset characteristic obtained when the voltage INP is changed from the potential resulting from the addition of the overdrive voltage to the voltage AVSS to the potential resulting from the subtraction of the overdrive voltage from the voltage AVDD. Owing to the characteristic of an ideal operational amplifier, a gain is larger and an offset value is smaller when a current obtained as the sum of the currents Idp1 and Idn1 is larger. On the other hand, when the current is smaller, the gain is smaller and the offset value is larger. Specifically, based on the current characteristic obtained as the sum of the currents Idp1 and Idn1 shown in FIG. 10D, the offset value is larger in the periods t1 and t3 and is smaller in the period t2. In other words, since the gain of the input stage is varied in accordance with the input voltage value, the offset value is also varied in accordance with the input voltage value, and thus, a constant offset cannot be realized.

Offset fixing operational amplifier circuit


Tools, systems, kits, and methods for both repairing and refreshing cosmetic makeups are discussed. One such tool may be a spatula. Other such tools may be press tools for pressing and compacting makeup. In some embodiments, such press tools may be double ended, with two different sized and/or different shaped presses per given press tool, with a handle between such different sized and/or such different shaped presses, to accommodate different sized and different shaped makeup pans. A container with repair-mousse, of a predetermined formula, may be used to treat broken and/or un-fresh makeup to repair and/or refresh such makeup to a desired consistency.

Cosmetics makeup, such as powders, mineral based makeups, blush, foundation, bronzers, concealers, eyeliners, mascaras, creams, nail polish, and the like, are often expensive; yet, also are often prone to being broken and/or becoming un-fresh; either one of which may result in a waste of money any money.
For example, and particularly with respect to powder based makeups, if accidentally dropped, the preferred consistency of the powder based makeup may be fractured, spilled, and/or otherwise disturbed, such that the resulting broken-makeup may now no longer be properly used; potentially resulting in the waste of money and time.
Similarly, whether broken or not, as makeup ages and/or is exposed to environmental conditions, such as humidity and air, that exposed makeup may become un-fresh and thus less desirable to use.
There is then a need in the art for tools, systems, kits, and methods for repairing such broken-makeup, so that once repaired, the now repaired makeup may be readily used again; without needing to purchase new makeup.
And likewise, there is a need in the art for tools, systems, kits, and methods for refreshing un-fresh makeup, so that once refreshed, the now refreshed makeup may be readily used again.
It is to these ends that the present invention has been developed.

This patent is subject to a terminal disclaimer.

Makeup repair system, kit, method, and tools


A magnetic flowmeter has a tube for supporting fluid flow and a circuit for indicating when the tube is empty. The circuit includes an amplifier connected to two electrodes in the tube and a variable resistor. The amplifier produces an oscillating signal when the tube is empty.. The circuit is calibrated for a particular fluid by finding a range of resistances for the variable resistor at which the circuit provides an accurate indication that the tube is empty, and storing information in the processor indicating a resistance in the range for the fluid.

This invention relates to magnetic flowmeters with empty tube detection circuitry.
Magnetic flowmeters measure the rate of flow of a process fluid through a tube. Magnetic coils mounted on opposite sides of the tube produce a magnetic field perpendicular to the direction of fluid flow in the tube. Electrodes placed in the tube measure a resulting current in the fluid that is perpendicular to both the direction of fluid flow and the magnetic field. A processor converts the output of the electrodes to a measure of the rate of fluid flow.
Some magnetic flowmeters are equipped with a circuit that detects the presence of fluid in the tube and prevents the flowmeter from measuring a non-zero flow rate when the tube is empty. One such circuit, manufactured by Fischer and Porter, produces an oscillating signal to indicate that the tube is full. The oscillating signal disappears when the tube is empty.

Magnetic flowmeter with empty tube detection


A method for preparing an aqueous suspension of nanocapsules comprising an oily core surrounded by a polymeric shell, comprises mixing first and second phases, wherein the first oily phase comprises a hydrophobic polymer, an oil or a mixture of oils, at least one active ingredient, and a surfactant TA1. The oily phase is brought to a temperature T1 higher than the melting point of the hydrophobic polymer, the hydrophobic polymer being miscible, at this temperature T1, with the mixture of the surfactant TA1 and the oil or mixture of oils, and the active ingredient being miscible, soluble or solubilized in the mixture of the surfactant TA1 and the oil or mixture of oils. The second polar phase comprises a hydrophilic polymer in the form of a hydrogel in an aqueous solution containing a surfactant TA2, to form the nanocapsules in an aqueous suspension.

Nanoparticles belong to a family of colloidal vectors which can be used, for example, for administering active ingredients, such as therapeutic molecules, in humans or animals. Such colloidal vectors preserve these active ingredients and can enable their controlled and/or sustained release at their site of action. Nanocapsules and nanospheres constitute two distinct groups of nanoparticles. Nanocapsules are formed from an aqueous or oily core coated with a polymeric membrane; nanospheres are formed from a polymeric matrix. The polymers which are part of the composition of nanoparticles are characterized by a high hydrophobicity (e.g. polyesters).
An aqueous suspension of polymeric nanocapsules is most commonly produced according to two techniques:                by interfacial polymer deposition (H. Fessi, F. Puisieux, J. P. Devissaguet, N. Ammoury, and S. Benita. Nanocapsule formation by interfacial polymer deposition following solvent displacement, International Journal of Pharmaceutics 55: R1-R4 (1989));        by emulsion-diffusion (D. Moinard-Checot, Y. Chevalier, S. Briancon, L. Beney, and H. Fessi. Mechanism of nanocapsules formation by the emulsion-diffusion process. Journal of Colloid and Interface Science In Press, Corrected Proof: 77).
These two techniques require the use of organic solvents in order to dissolve the constitutive hydrophobic polymers of the polymeric membrane of the nanocapsules.
The technique of obtaining an aqueous suspension of polymeric nanoparticles by interfacial polymer deposition, which is the most common method for producing nanocapsules, is based on the deposition of preformed polymers at the interface between (i) an organic solvent mixed with an oil and (ii) an aqueous solution. In this process, a solution is prepared containing, e.g., an active ingredient in an organic solvent which is soluble or very soluble in water, such as acetone (with or without lipophilic surfactant). An oil which is miscible in the organic solvent but immiscible in water is added to the previous organic solution. The organic solution is then dispersed, by mechanical stirring, in the polar phase most commonly containing a hydrophilic surfactant (e.g., poloxamer, polysorbate 80). The organic solvent diffuses in the polar phase and this results in aggregation of the polymer around the lipid droplets responsible for the formation of the nanocapsules. The organic solvent can be dispersed in the polar phase by tangential membrane filtration followed by mechanical stirring (I. Limayem Blouza, C. Charcosset, S. Sfar and H. Fessi. Preparation and characterization of spironolacton-loaded nanocapsules for paediatric use International Journal of Pharmaceutics 325:124-131(2006)). The organic solvent is removed either by dialysis or, most commonly, by evaporation under reduced pressure.
The emulsion-diffusion technique (D. Moinard-Checot, Y. Chevalier, S. Briancon, L. Beney, and H. Fessi. Mechanism of nanocapsules formation by the emulsion-diffusion process. Journal of Colloid and Interface Science In Press, Corrected Proof: 77), for its part, consists in forming an emulsion in which the oily phase contains a biodegradable polymer and a partially water-miscible solvent (e.g., ethyl acetate, solubility: 8.3 g/100 ml at 20° C.) and or the polar phase containing an emulsifier is saturated with ethyl acetate. The addition of water to this emulsion causes diffusion of the solvent of the oil droplets toward the external phase, which leads to precipitation of the polymer around the oil droplets, and therefore the formation of nanocapsules. The organic solvent is removed either by dialysis or, most commonly, by evaporation under reduced pressure.
Consequently, the current methods for producing nanocapsules all comprise a preliminary step of dissolving the hydrophobic polymers in a mixture of one or more volatile organic solvents (e.g., acetone, ethyl acetate). The "spontaneous" formation of the nanocapsules is provided by the dispersion of the organic solutions of hydrophobic polymers in a polar mixture (e.g., most commonly aqueous solutions). The final production step requires evaporation under vacuum or dialysis of the organic solvents. The verification of the elimination of these solvents and the detection of possible traces thereof in the final preparation both constitute procedures which are lengthy and expensive and which require, on the industrial scale, the designing and setting up of complex infrastructures.

Method for producing nanocapsules in the absence of an organic solvent, and nanocapsules produced thereby


The present invention relates to a cleaning implement formed from spunbond fiber webs having a basis weight less than about 85 grams per square meter and wherein the fibers comprise macrofibers having an average fiber diameter greater than 50 microns and less than about 500 microns. A section of macrofiber web having a mass between about 10 and 30 grams is bundled into a deformable three-dimensional shape which is about 8 to 25 cm in at least one dimension. The cleaning implement is particularly well suited for use in conjunction with shower gels or soaps for washing the body.

Woven, mesh and nonwoven materials have been used in various forms to carry and/or work surface active agents. Nonwoven materials have heretofore been used within wipes and cleaning pads. In addition, woven and mesh materials have been designed to apply liquid cleaning agents such as, for example, for use in cleaning and washing the body, especially for removing dirt and dead skin therefrom.
For example, U.S. Pat. Nos. 4,793,941 to Serviak et al. and 5,053,157 to Lloyd disclose a laundry detergent impregnated within a nonwoven web which is suitable for delivering a proper amount of detergent for each wash load. Similarly, U.S. Pat. No. 4,775,582 to Abba et al. discloses a meltblown nonwoven wet wipe for personal care uses. Although the prior art active agent impregnated nonwoven pads of microfibers may be useful in certain applications they may not be well suited to those applications requiring high strength or the ability to generate a rich lather in a scrubbing or cleaning action.
An improved and highly useful nonwoven pad for applying active agents is disclosed in U.S. Pat. No. 5,605,749, to Pike et al. which discloses a pad comprising a porous high loft structure of crimped conjugate spunbond fibers impregnated with a topically applicable active agent. A variety of active agents suitable for use with the pad include, for example, polishing agents, waxes, cleansers, moisturizers, germicidal solutions and/or topical medicaments. The pad disclosed in Pike et al. exhibits high strength and abrasion resistance while also having excellent absorbency. Thus, this pad exhibits both increased strength and an increased capacity to hold active agents relative to microfiber materials. Accordingly, the nonwoven pad of Pike et al. is an excellent structure for carrying and applying active agents in a variety of applications. However, in those applications in which it is desirable to generate a rich lather in the scrubbing action, a varied structure may be desirable. In addition, the increased absorbent characteristics of this pad may likewise be undesirable in certain applications, such as in a bath sponge where the excellent absorbency may cause the pad to become waterlogged or otherwise heavier than desired.
Hand held scrubbers comprising diamond mesh netting are disclosed in U.S. Pat. No. 4,462,135 to Sanford, U.S. Pat. No. 5,144,744 to Campagnoli and European Application publication No. WO 95/00116. These scrubbers employ a mesh netting and, thus, employ a uniform pattern of spaced intersecting strands. Such diamond mesh netting has long been used to wrap foodstuffs, fruit, poultry and other items for some time. However, the above referenced patents and application describe use of such mesh netting for use as a hand held scrubber.
However, many existing scrubbers suffer from a propensity to develop mold, mildew or growth of other organic matter. In this regard many soaps and shower gels support mold growth and, thus, designs which do not allow the scrubber to be efficiently rinsed of cleanser or allow the scrubber to dry quickly may accelerate the growth of mold or other organisms which is obviously undesirable. In addition, many scrubbers, such as many mesh netting scrubbers, fail to provide a soft and/or cloth-like feel whereas scrubbers with good hand and a softer feel are highly desirable in cleaning implements intended for washing the body, particularly when used to wash the more sensitive areas of the skin.
Therefore there exists a need for high strength nonwoven material having good abrasion resistance with a structure suitable for providing excellent lather generation and cleaning action. Moreover, there exists a need for a nonwoven material adapted for generating lather which dries quickly and which may be readily flushed of cleanser. Further, there exists a need for such a nonwoven material and scrubber made therefrom which provides improved tactile properties. Further, there exists a need for a nonwoven material and scrubber made therefrom which does not absorb excess cleanser and/or water when in use.


The invention relates to the driving circuit and method of an active matrix organic electro-luminescence display. The writing thin film transistor (TFT) gates of all pixels on the scan line are connected to the scan line. The resetting TFT gates of all pixels on the scan line are connected to the front scan line of the previous row. The switching TFT gates of all pixels within the driving block are connected to the block control line of the driving block. The above block division control and pixel driving circuit design can be used to present gray scale by modulating the display time-ratio. This invention makes use of block separation control and pixel driving circuit design to improve the defect of the timing-inefficiency of the existing digital driving technology tremendously.

Organic electro-luminescence (OEL) displays can be divided into passive matrix type and active matrix type according to the driving method. The so-called active matrix organic light-emitting displays (AMOLED) is to use the thin film transistor (TFT) and the capacitor to store image signals and control the luminance and gray scale of OLED.
Though the manufacturing cost is lower and the technology is common for passive matrix OLED; however, the resolution of the panel can't be enhanced due to its driving method. Therefore, the size of the applied products is limited less than 5 inches, which is confined to low resolution and small size market. The active matrix driving method needs to be applied for finer and larger screens. The so-called active matrix means to store image signals by capacitors. Thus, the original brightness of pixels can be maintained after scanning. In this way, extreme brightness of OLED is not needed, longer operation life is guaranteed and requirements for high resolution can be achieved. Active matrix OLED can be put into practice by combining OLED and TFT technology, which not only meets stricter requirements for smoothness and resolution on the monitor market, but also reveals the superb features of OLED to the full extent.
For driving technology at present, development of AMOLED has two directions; one is the analog method and the other one is the digital way. The reason why digital driving is developed is because TFT elements with excellent features (e.g. threshold voltage and mobility) can't be produced through the current LTPS process. Nevertheless, the stringent demands for LTPS process are not required for digital driving since the image non-uniformity due to the characteristic variation of TFT elements can be compensated merely through a simple 2T1C driving circuit.
As a result, digital driving technology will play a certain role in the development of AMOLED in the future if shortcomings of digital driving method can be corrected efficiently and the integrated driving system can be established.
For the application of digital driving technology at the moment, time-ratio and area-ratio modulation methods are used for gray scale. Take the U.S. Pat. No. 6,452,341 as an example for time-ratio technology. It is based on the separation structure of a writing time 61 and a display time 62 (Program Display Separation) for the realization of digital driving scheme. As FIG. 6 shows, 1˜N refers to the scan line and 1˜M refers to the display line. For each sub-frame, the writing time 61 is the same, but the display time 62 is T, 2T, 4T, 8T, 16T and 32T in order respectively from SF1 through SF6. Though this approach is easy to implement and the hardware system is less complicated; however, time utility rate is low since the total writing time 61 from sub-frame SF1 through SF6 occupies a certain portion of the frame time.
For instance, refer to the U.S. Pat. No. 6,452,341 as FIG. 7 indicates. The gray scale is achieved by time-ratio modulation and control of the organic electro-luminescence element with a common cathode potential 71 (VH or VL). Thus, when the resolution of the display panel is 176×240 with the scanning frequency of 120 KHz, the writing time 61 of one sub-frame equals to ( 1/120 K)×240=2 ms. Consequently, the total writing time 61 for the six sub-frames SF1˜SF6 will be 12 ms, which occupies 60% of the frame time 20 ms (1 Frame= 1/50 sec). As OLED is not illuminated during the writing time 61, the display time utility rate only achieves 40%, which is quite low.
This flaw is acceptable for small size applications; however, this problem needs to be overcome for large size or higher resolution requirement in the future. To promote application of digital driving technology, certain solutions are required to correct the defect of low time utility rate of the conventional driving scheme—program display separation.
One of the solutions is to increase the operating frequency, including scanning frequency and data shifting frequency, etc. This method has no problems for earlier display system that uses external driving IC; however, the solution of built-in driving circuit LTPS-TFT adopted to cope with the development trend of system-on-glass (SOG) cannot easily support very high frequency operation.
Japan Patent No. 2001-343933 discloses an AMOLED driving circuit. FIG. 8 shows the circuit of each pixel. The driving circuit in every pixel includes a Writing TFT 81, an Erase TFT 82, a Driving TFT 83, a Storage Capacitance 84, a Write Scan Line 85, a Erase Scan Line 86, a Data Line 87, a Supply Line 88, a Organic Electro-luminescence Element 89. The gate of Writing TFT 81 in the driving circuit is connected to Write Scan Line 85 and the gate of Erase TFT 82 is connected to Erase Scan Line 86. Gray scale is achieved by modulating display time ratio of the frame in this patent, which improves the flaw of low time utility rate in the driving structure of program display separation. Whereas, two sets of scan drivers are required in addition to the Data Driver 91. One of them is Write Scan Driver 92 connecting to Write Scan Line 85 for data writing. Another is Erase Scan Driver 93 connecting to Erase Scan Line 86 for data erasing as FIG. 9 shows. In this way, an extra set of scan driver is required, which also increases the module cost of monitors.

Driving circuit and driving method of active matrix organic electro-luminescence display


The present invention relates to methods for diagnosing cornification disorders and metabolic diseases. More specifically, the present invention relates to an in vitro method for diagnosing and/or predicting a cornification disorder in a subject, comprising determining the presence or the absence of a genetic variation in the Patatin-like phospholipase domain-containing protein 1 (PNPLA1) gene sequence in a biological sample from said subject, as compared with the PNPLA1 gene sequence of a healthy non-carrier subject, wherein the presence of said genetic variation indicates that said subject suffers from or is at risk of suffering from said cornification disorder. The method according to the invention allows for example diagnosing ichthyosis in dogs of the Golden Retriever breed.

Ichthyosis is a skin disease that is wide-spread among dogs of the Golden Retriever breed. The symptoms of ichthyosis include excessive scaling of large, variably pigmented flakes of skin in otherwise healthy dogs. The condition affects young dogs of either sex and is characterised by symmetrical, predominantly ventro-lateral scaling and hyperpigmentation of the trunk.
An article reporting 50 cases of ichthyosis in dogs of Golden Retriever breed was first published in 2007 (Guaguere et al., 2007 Veterinary Dermatology. 18:382-383). A genetic aetiology, with single-trait autosomal recessive mode of inheritance, was then proposed in 2008 (Mauldin et al., 2008 Vet Pathol. 45:174-80; Cadiergues et al., 2008 Vet Dermatol. 19:120-9). Dermatological signs of Golden Retriever ichthyosis include a mild to moderate or severe generalised scaling with initially small to large whitish scales and progressively blackish scales. The ventral glabrous skin is hyperpigmented and rough, similar to sandpaper.
Histopathological features are characterised by moderate to severe laminated or compact orthokeratotic epidermal hyperkeratosis composed of many keratin layers, without significant involvement of the stratum granulosum. Epidermis has a pleated appearance, and diffuse epidermal melanin pigmentation was observed in most cases. Keratinocytes from the basal and spinous layers seem to form agglutinated cell masses. Some keratinocytes with lipidic vacuoles are regularly visible in the stratum granulosum. Rete ridges of the epidermis give a pleated appearance resembling a garland (Guaguere et al., 2009, J Small Anim Pract. 50:227-35). Ultrastructural findings reveal laminated or compact keratin layers and numerous persistent corneodesmosomes within the stratum corneum. Melanosomes are found throughout the epidermis, as well as lipidic vacuoles within the stratum corneum.
In summary, the histopathological and ultrastructural characteristics strongly suggest that Golden Retriever ichthyosis is a non epidermolytic, retention ichthyosis, caused by absence of corneodesmosomal degradation, transmitted through an autosomal recessive mode (Guaguere et al., 2009, J Small Anim Pract. 50:227-35).
In addition to dogs of Golden Retriever breed, ichthyosis is also found in other dogs such as dogs of Cavalier King Charles Spaniel, Irish Soft Coated Wheaten Terrier, Collie, American Bulldog, American Staffordshire Terrier, Dobermann, Rottweiler, Australian Terrier, Manchester Terrier, Boston Terrier, West Highland White Terrier, Norfolk terrier and Jack Russel terrier breed.
Ichthyosis is also found in human beings. In human, ichthyosis is a family of generalized skin disorders wherein the patients have dry, thickened, scaly or flaky skin. The severity of symptoms can vary enormously, from the mildest types such as ichthyosis vulgaris which may be mistaken for normal dry skin, up to life-threatening conditions such as harlequin type ichthyosis. Some types of ichthyoses occur in isolation without associated abnormalities (e.g. ichthyosis vulgaris, X-linked ichthyosis, bullous congenital, ichthyosiform erythroderma and ichthyosis lamellaris), while other types of ichthyoses are part of a syndrome that involves multiple organs (e.g. Netherton syndrome, Dorfman-Chanarin syndrome, Refsum's disease and Sjögren-Larsson syndrome). Apart from acquired ichthyosis due to a systemic disease such as e.g. leprosy, hypothyroidism, lymphoma or AIDS, all types of ichthyosis appear to be inherited diseases. For instance, lamellar ichthyosis, Refsum's disease and Sjögren-Larsson syndrome are autosomal recessive diseases.
Genes at least partially associated with some types of human ichthyoses have been identified (see e.g. Akiyama and Shimizu. 2008 Exp Dermatol. 17:373-82; Oji. V, 2010, Hautarzt, 61(10):891-902). At present, a dozen of genes have been identified but all human cases are far from having a known molecular defect. In dogs, the genetic defect has been identified for 2 breeds segregating ichthyosis, namely the Norfolk terrier and the Jack Russel terrier. In the Norfolk terrier breed, a mutation in the Keratin 10 gene was identified in 2005 (Credille et al., 2005 Br J. Dermatol. 153:51-8.). In the Jack Russel terrier breed, a mutation in the TGM1 gene was found (Credille et al., Br J Dermatol. 2009 161:265-72 2009).
However, the genes involved in Golden Retriever ichthyosis, in other affected dog breeds, and in several human familial or sporadic cases of ichthyosis, still remain to be identified.
Currently, there is no method for predicting the risk of suffering from Golden Retriever ichthyosis and the diagnosis requires a skin biopsy and an histopathologic analysis. Such a method would be of great value not only in the field of veterinary medicine, but also in the field of human medicine.
Among dogs, the Golden Retriever breed is a very popular breed with an estimated population of 8000 births per year in France. A method for predicting the risk of suffering from ichthyosis would allow selecting pups which are neither at risk of developing the disease, nor carrier of the disease. It would also allow selecting dogs suitable for reproduction.
There is thus a need for a method for diagnosing ichthyosis and/or predicting the risk of suffering from ichthyosis or transmitting the disease to the progeny.

CENTRE NATIONAL DE LA RECHERCHE SCIENTIFIQUE (C.N.R.S.)


An articulating implant system is provided for fixation to a bone. The articulating implant system includes a fixation component for fixation to the bone and an articulating member for articulating against bone or cartilage. Specifically, a modular ulnar implant is provided in accordance with the articulating implant system of the present invention wherein the fixation component is a stem for insertion into the intramedullary canal of the distal ulna and the articulating member is a head for articulating with the radial sigmoid notch.

Both the proximal and distal radioulnar joints are synovial joints. The proximal joint lies between the head of the radius and the radial notch of the ulna. The distal radioulnar joint is separated from the wrist by an articular disc that extends from the base of the ulnar styloid process to the radius.
The distal radioulnar joint is a pivot-joint formed between the head of the ulna and the ulnar notch on the lower end of the radius. The articular surfaces are connected together by the volar radioulnar ligament, the dorsal radioulnar ligament, and the articular disk. The volar radioulnar ligament is a narrow band of fibers extending from the anterior margin of the ulnar notch of the radius to the front of the head of the ulna. The dorsal radioulnar ligament extends between corresponding surfaces on the dorsal aspect of the articulation. The articular disk is triangular in shape, and is placed transversely beneath the head of the ulna, binding the lower ends of the ulna and radius firmly together. Its periphery is thicker than its center, which is occasionally perforated. It is attached by its apex to a depression between the styloid process and the head of the ulna; and by its base, which is thin, to the prominent edge of the radius, which separates the ulnar notch from the carpal articular surface. Its margins are united to the ligaments of the wrist-joint. Its upper surface, smooth and concave, articulates with the head of the ulna, forming an arthrodial joint; its under surface, also concave and smooth, forms part of the wrist-joint and articulates with the triangular bone and medial part of the lunate. Both surfaces are clothed by synovial membrane; the upper, by that of the distal radioulnar articulation, the under, by that of the wrist.
The radius articulates in pronation and supination on the distal ulna. The ulna, a relatively straight forearm bone linked to the wrist, translates dorsal-palmarly to accept the modestly bowed radius. Since the sigmoid fossa socket in most wrists is relatively flat, ligaments are required to support the distal ulna. These ligaments include the triangular fibrocartilage (TFC), the extensor carpi ulnaris (ECU) subsheath, and the ulnar collateral ligament complex. The stabilizing elements of the triangular fibrocartilage (TFC), extensor carpi ulnaris (ECU) subsheath, and the ulnar collateral complex are well recognized along with the importance of a distal ulna component (ulnar head) for transfer of compressive loads between the ulnar carpus and the distal ulna across the distal radioulnar joint. The distal radioulnar joint shares loading forces that occur with forearm rotation and gripping. The arc of pronation and supination averages 150 to 160 degrees with the most useful portion being between 80 degrees pronation and 45 degrees supination.
One of the most common fractures in humans is fracture of the distal radius. Inherent bony instability, soft tissue damage, and frequent associated injuries make the distal radius fractures very difficult to treat. Distal radius fractures are usually caused by a fall on an outstretched hand. When a person falls on an outstretched hand, the hand suddenly becomes rigid, and the momentum from the fall will cause both a twisting force and a compressing force on the forearm. The kind of injury these forces are likely to cause depends on the age of the person who is injured. In children, and in older adults, such a fall is likely to result in a fracture of the radius. Distal radius fractures may also result from direct trauma such as might occur during an auto accident.
There are several types of fractures. A non-displaced fracture is one in which the bone cracks and the broken pieces stay in alignment. A torus or ripple fracture bends the back of the radius away from the growth plate. A displaced fracture is one in which the bone breaks in two or more pieces that move out of alignment. Such a break may be extremely painful and produces a deformity that is easily seen. An open or compound fracture is one in which the ends of the bone are displaced and pierce the skin. In these cases, there is a significant risk of infection.
For displaced broken bones to heal properly and without serious complications, they need to be set and held in place for the body to repair and replace the damaged bone. The process usually takes between 4 and 12 weeks. Some fractures may be set without surgery, the bones being held in place first with a splint and then, after healing has started, with a cast. If the bones are seriously displaced, however, or if there is damage that needs to be repaired, surgery may be needed and the bones may need to be held together with pins or wire.
Closed treatment methods including casting, pins and plaster, and external fixation have frequently yielded unsatisfactory results. Treatment using formal open reduction and internal fixation with the conventional plate system, when achieving anatomic reduction and early mobilization, has produced some promising results. The value of immediate mobilization of the injured joints is clear.
With distal radial fractures, muscles may gradually weaken from lack of use during bone healing. A patient may need physical therapy in order to regain proper use of the wrist.
Ligament disruption, ulnar styloid fractures, and fractures into the distal radioulnar joint are common occurrences following fractures of the distal radius and other rotational instability injuries of the forearm. Fracture or dislocation involving the distal radioulnar joint often results in a loss of forearm rotation related to either instability or incongruity between the sigmoid fossa of the distal radius and the ulnar head. A variety of different fractures involving the distal radius may cause this condition including the Colles' fracture and the Galeazzi fractures.
When there is loss of stability of the distal radioulnar joint, there is subsequent weakness in grip and pinch as well as potential loss of forearm rotation. Instability may also be associated with either an injury to the triangular fibrocartilage or to the ulnar styloid. When instability is present, a number of ligament reconstructive procedures have been devised to assist in treating the unstable distal ulna. Unfortunately, ligament reconstruction of the distal ulna is often incomplete in restoring stability, and joint replacement is often necessary.
Where there is an incongruity of the joint surface involving either the articulation of the ulnar head with the sigmoid fossa of the distal radius, or if there is a significant ulnar impaction syndrome between the distal articular surface of the head of the ulna and the ulna carpus, a joint replacement may be necessary. Specifically, this may include either joint replacement of the distal ulna or operative procedures designed to shorten the ulna or resect all or part of the distal ulna (i.e. Darrach, Bowers, or matched resection procedures).
Implants or prostheses are employed for restoring damaged upper and lower extremity bones such as fingers, wrists, elbows, knees and ankles of human patients. These prostheses are especially useful in the reconstruction of joints which, for example, have been damaged by pathological conditions such as rheumatoid arthritis, degenerative arthritis, aseptic necrosis, and for treating trauma which may have a debilitating effect on articular joints.
There are three types of arthroplasties: 1) unconstrained, 2) semi-constrained and 3) fully constrained. A common flaw with all of these current joint replacement designs is the inability to reconstruct and re-attach the replaced joint's vital native capsular and ligamentous restraints, which dictate, in large measure, the behavior and stability of the joint (i.e., its kinematics).
The primary reasons for wrist replacement surgery are to relieve pain and to maintain function in the wrist and hand. The primary indications, therefore, for reconstruction of the distal radioulnar joint by prosthetic replacement (ulnar head replacement only) are generally related to a fracture of the distal ulna or a fracture extending into the distal radioulnar joint producing post-traumatic arthritis. Degenerative arthritis from other causes is also a primary indication. This is considered if there is associated arthritis and an ulnar shortening procedure is contraindicated. Osteoarthritis, the most common form of arthritis, results from a gradual wearing away of the cartilage covering on bones. A third condition for primary ulna replacement is rheumatoid arthritis with a painful and unstable distal radioulnar joint. Rheumatoid arthritis is a chronic inflammatory disease of the joints that results in pain, stiffness and swelling. Rheumatoid arthritis usually affects several joints on both the right and left sides of the body. Both forms of arthritis may affect the strength of the fingers and hand, making it difficult to grip or pinch. In some cases, fusing the wrist bones together will reduce or eliminate pain and improve grip strength. However, if the bones are fused together, the ability of the wrist to move and bend is lost. Wrist replacement surgery may enable retention or recovery of wrist movements. In these situations, prosthetic replacement of the distal ulna with soft tissue advancement may be beneficial.
A distal ulnar prosthesis is also suitable to correct a previous resection of the distal ulna that has failed. Such will be the case for both partial resection of the joint articular surface and complete resection of the distal ulna. When faced with failed distal ulna resection, one has options towards reconstruction without restoring the distal radioulnar joint (DRUJ). For example, a failed distal ulna may be corrected by a pronator quadratus interposition, or, if there has been only a partial resection, a fusion of the distal radioulnar joint combined with a proximal pseudarthrosis (Suave-Kapandji procedure). These procedures, however, do not restore the normal DRUJ function of motion or load transfer and may be associated with instability of the distal ulna and proximal impingement of the ulna on the distal radius. In these cases, a distal ulna prosthesis is generally preferable. A distal ulnar prosthesis is also suitable to correct a previous prosthetic replacement such as a silicone ulnar head replacement which has failed.
A distal ulnar prosthesis attachable to a soft tissue pocket including the triangular fibrocartilage, ECU subsheath, and ulnar collateral ligament complex to thereby maintain distal radioulnar joint stability, which aligns anatomically with the sigmoid fossa of the distal radius and is isosymmetric with the anatomic center of rotation of the forearm, and that allows for a normal forearm rotation of approximately 150-170 degrees would be desirable. More specifically, it would be desirable to have such a modular distal ulnar prosthesis wherein there is no risk of separation of the two components (the stem and the head) due to biomechanical forces from the tissues attached by suture to the implant.


A variable vane assembly including a variable stator vane disposed in a main flow gaspath, the variable stator vane having a vane stem. The assembly also includes a case located at a radially outward location of the variable stator vane, the vane stem extending through a port of the case, the port defined by a port wall, a clearance defined by the vane stem and a port wall to allow gas from the main flow gaspath to pass therethrough. The assembly further includes a synchronization ring spaced from the case to define a gap. The assembly yet further includes a vane arm operatively coupled to a synchronization ring and to the vane stem, the vane arm redirecting gas from the main flow gaspath to the synchronization ring.

Exemplary embodiments pertain to the art of gas turbine engines and, more particularly, to a thermally compensate synchronization ring of a variable stator vane assembly.
Some turbine engines include a plurality of engine sections such as, for example, a fan section, a compressor section, a combustor section and a turbine section. The turbine engine may also include a variable area vane arrangement. Such a vane arrangement may be configured to guide and/or adjust the flow of gas into a respective one of the engine sections. Alternatively, the vane arrangement may be configured to guide and/or adjust the flow of gas between adjacent stages of a respective one of the engine sections. Some variable area vane arrangements include a plurality of adjustable stator vanes that are rotatably connected to an inner and outer vane platforms, or engine casing walls. Each of the stator vanes may be rotated about a respective axis using a vane arm. A vane arm may be a sheet metal or machined piece that transmits load from a synchronizing ring to a variable vane stem.
Variable vane accuracy is a challenge that directly impacts the stall margin of an engine's fan and compressor. Accuracy is directly impacted by thermal differences between an actuation system's synchronization ring and the case it is mounted on because these thermal differences impact the positioning of the synchronization ring. Active thermal compensation solutions are typically avoided due to the significant weight impact.

Thermally compensated synchronization ring of a variable stator vane assembly


Included are embodiments for subframe interleaving. At least one embodiment of a method includes receiving at least one subframe, the at least one subframe being derived from a plurality of frames of data and interspersing at least a portion of the at least one subframe according to a predetermined subframe interleaving strategy.

In many communications systems, disturbances may be received in a plurality of different forms. More specifically, a communications system may receive stationary noise and/or non-stationary noise. Stationary noise may include Additive White Gaussian Noise (AWGN) and/or other types of stationary noise. Non-stationary noise may include impulse noise and/or other noise that may cause a burst disturbance to a received signal.
Immunity to both stationary and non-stationary disturbances may be improved by using a "Signal to Noise Ratio (SNR) margin" (expressed in decibels (dB)), which may be configured to determine the available SNR overhead in case of a sudden increase in noise variance. Typical margin values, which may be in the range of a few dB, may become useless in the presence of these high-energy bursts. Classical techniques to protect coded systems against such interferences without the use of external codes employ channel interleaving to spread burst-errors, thereby improving the burst-error-correction capability. However, these techniques suffer from one or more technical drawbacks.
Thus, a heretofore unaddressed need exists in the industry to address the aforementioned deficiencies and inadequacies.


An apparatus (1′) for transportation, installation and retrieval of marine structures (10) is disclosed and illustrated. It comprises at least two suitably connected vessels (1,2) with adjustable buoyancy, each having a first end (5) and a second end (8). The apparatus is equipped with lifting mechanism for lifting a marine structure on and from it. The vessels (1,2) are connected to each other at each said first end (5) at an angle (4) and are free at each said second end (8), thus forming a V-shape. The invention also embraces the methodology for transportation, installation and retrieval of marine structures, using the apparatus (1′).

In off-shore operations such as oil and gas explorations and productions, transportation, installation and retrieval of marine structures are very common. Such marine structures include off-shore platforms, jackets supporting such platforms, towers for bridges and windmills and other gravity based structures. It is also known that such marine structures are towed to appropriate locations by vessels, barges, hulls and other bodies having adjustable buoyancy as known to persons skilled in the art. These are effectively used for installation of marine structures. Further, such vessels/barges have been effectively used for retrieval of marine structures, once their life span is over or for shifting those structures to other sites of operation.
U.S. Pat. No. 5,607,260 discloses an apparatus and a method for installation and removal of large multi ton deck packages. It teaches the use of two barges which can support a large multi ton load. A variable dimensional truss assembly is supported by the barge and forms a load transfer interface between the barge and the deck package.
The above prior art document, like most prior art techniques uses two parallel barges, which have to be interconnected with substantially large beams. This makes the arrangement less sturdy and a bit cumbersome, for loading and removing the marine structure, on and from the deck of the vessel. That apart, the top portion of the apparatus has height restriction due to the truss assembly. Hence, height restrictions exist in respect of the structure to be towed or installed or retrieved. That apart, positioning of the barges around the structure to be carried or installed or lifted is also another problem.
International PCT publication number WO 00/78604 discloses a vessel, which is a U-shaped pontoon foundation for removal and installation of marine structures. Columns are attached to the pontoon foundation, extending upwards. A tubular rotational beam is fixed to the top of the transverse pontoon and it is engaged with a bracket attached to a side of the jacket leg to be lifted. Then lifting is done with the help of a lifting frame and de-ballasting.
The above document does teach use of a U-shaped pontoon foundation which enables convenient positioning of the vessel, around a platform being installed or a platform being removed. However, the positioning, lifting and removal is dependent on a lifting frame on the top portion of the pontoon foundation, which naturally imposes a height restriction.
Hence, there has been a need for an apparatus for transportation, installation and removal of marine structures, which has a sturdy structure, requires less length of coupling beams for connecting the units of the apparatus and has free space above of the loading zone. There has been also a need for providing a methodology for transportation, installation and retrieval of marine structures which is simple and quick.
The present invention meets the above mentioned needs and other associated needs by providing an apparatus which has at least two basic units of adjustable buoyancy, which are coupled together in a substantially V-shaped form.

Apparatus and a method for transportation, installation and retrieval of marine structures


A turbine shroud assembly of a gas turbine engine includes seal segments made from ceramic matrix composite materials. The mounting assembly used to support the seal segments has heat shields adapted to resist radiant heating from the seal segments, especially portions of the seal adjacent to a primary gas path along the turbine shroud assembly.

Gas turbine engines are used to power aircraft, watercraft, power generators, and the like. Gas turbine engines typically include a compressor, a combustor, and a turbine. The compressor compresses air drawn into the engine and delivers high pressure air to the combustor. In the combustor, fuel is mixed with the high pressure air and is ignited. Products of the combustion reaction in the combustor are directed into the turbine where work is extracted to drive the compressor and, sometimes, an output shaft, fan, or propeller. In some applications, shroud assemblies define flow paths to assist in guiding exhaust products through the turbine.

Ceramic matrix composite hanger heat shield