A fluid ejection device, a method and an operation method thereof are disclosed. The fluid ejection device includes a substrate, a beam and an activation pad. The substrate has an orifice, and the beam includes a fixed portion and a cantilever portion and is disposed over the substrate, wherein the cantilever portion is disposed over the orifice. Furthermore, the activation pad is disposed between the cantilever portion of the beam and the substrate. Because the fluid ejection device of the present invention is fabricated by using micro-electromechanical technology, and therefore it possible to obtain a fluid ejection device capable of ejecting the fluid from the orifice at a high-speed and also the quantity fluid ejected can be very small.

1. Field of the Invention
The present invention relates to a fluid ejection device, a fabrication method and an operating method thereof, adapted for an ink-jet printing head; and more particularly to a micro-electromechanical system (MEMS) fluid ejection device, a fabrication method and an operating method thereof.
2. Description of Related Art
To date, the ink-jet technology includes the bubble ink-jet technology and the piezoelectric ink-jet technology.
FIGS. 1A and 1B are schematic drawings showing an ink-jet head and an operation of the prior art bubble ink-jet technology. Referring to FIG. 1A, in the ink-jet head 100 adopted by the prior art bubble technology, the ink 104 is heated by a heater 102 for generating the bubble 106. Thereafter, the ink 104 is ejected from a nozzle 108 under the pressure of the bubble 106.
Referring to FIG. 1B, when the heater 102 stops heating, the bubble 106 in the ink 104 will not be inflated and remain flat as the result of cooling down. The surface tension of the ink 104 will create tensile force to pull back the ink 104. Accordingly, the operation of the thermal sensing ink-jet technology is performed. The printing speed of the bubble ink-jet technology is about micro-second level. The disadvantage is that the ink is easily ejected due to pressure and the ejection force of the ink cannot be controlled. The ink is adversely affected by law of inertia at the nozzle, resulting in non-uniformity or ink residuals. The other disadvantage is that, because the ink-jet head of the bubble ink-jet technology is usually under high temperature situation due to use of heater, and therefore the ink-jet head is easily damaged, especially in absence of ink therein.
FIGS. 2A-2C are schematic drawings showing an ink-jet head and an operation of the prior art piezoelectric ink-jet technology. Referring to FIG. 2A, the ink-jet head 200 of the prior art piezoelectric ink-jet technology uses a quartz crystal 202 to control the ejection of the ink 204. The ink-jet head 200 comprises a nozzle 208. When electricity is applied to the quartz crystal, the quartz crystal 202 generates a fixed oscillation frequency. When electricity applied to the quartz crystal is removed, the ink is pulled back.
Referring to FIG. 2B, when electricity is applied to the quartz crystal 202, the quartz crystal 202 expands and ejects the ink 204 from the nozzle 208. Because the piezoelectric ink-jet technology does not need thermal transformation, the damage the to ink-jet head due to thermal issue can be avoided.
Referring to FIG. 2C, when the supply of electricity to the quartz crystal is cut, the quartz crystal 202 shrinks to the original size for pulling the ink 204 back. The printing speed of the piezoelectric ink-jet technology is also about micro-second level. The problem is that it is not possible to further reduce the quantity of ejected ink.


The present invention is generally related to a network computing device including a first processor communicating with a second processor as a proxy for a client device when authenticating access privileges of the client device. The present invention may include more than two processors where at least one of the multiple processors may be optimized for performing one or more control functions and one or more other processors may be optimized for transferring data or administrating the transfer of data through a gateway or firewall.

Field of the Invention
The present invention is generally related to a network computing device including a first processor communicating with a second processor as a proxy for a client device when authenticating access privileges of the client device. More specifically, the present invention relates to the first processor running software to communicate with the second processor as if it were a client device where the software running on the first processor does not validate the authenticity of the client device.
Description of the Related Art
Client devices attempting to gain access to a resource in a networked computing environment are commonly authenticated before being allowed to access data or programs stored at the resource. A client device commonly gains access to a specific resource after sending a request to access the resource and after credentials of the client device have been authenticated.
The authentication of credentials from a client device may include communications between the client device, a gateway or firewall, and an authentication server. After an authentication process has been completed, the gateway or firewall may allow the client device to communicate with a computing resource in a networked computing environment. The computing resource may be a computer or a server that is distinct from the authentication server that was communicated with during the authentication process of the client device.
Information used to authenticate the credentials of a client device may include, yet are not limited to a password, a user name, a security certificate, or other information provided by the client device. The authentication information provided by the client device may be compared with information at or provided by an authentication server. A gateway or firewall located between the client device and the authentication server may also perform an authentication process where credentials of a server or a client device may be authenticated. In some configurations, a gateway or firewall may act as the authentication server itself.
When additional security is desired the authentication of a client device may be performed after a secure socket layer (SSL) communication session has been established. The authentication of the credentials of a client device may therefore be performed with our without establishing an SSL communication session. When an SSL communication session is used, it is commonly established after establishing a transmission control protocol (TCP) session between a client device and a computing device.
Today computing devices including gateways and firewalls commonly include multiple processors (i.e., a multi-processor) where at least one of the multiple processors may be optimized for performing one or more control functions. In these systems one or more other processors may be optimized from transferring data between a client device and a computing resource. The functionality of a processor optimized for transferring data, i.e. a data plane (DP) processor, may process the movement of data (i.e., data traffic) according to a set of access rule or other settings that may be configured by a processor optimized for control functions, i.e. a control plane (CP) processor.
Frequently data passing through a gateway or a firewall is administrated by a one or more DP processors. The communication of data through the gateway or firewall may be optimized by using software that is designed to transfer data that includes little or no program code for performing control functions. Similarly, software optimized for performing control functions includes little or no program code that optimizes the transfer of data through the gateway or firewall. CP processors may include a full set of operating system (OS) software, where DP processors include an entirely different set program code. A gateway/firewall that includes multiple processors that may also communicate with a client device using a single communication path or socket. A socket is an endpoint implemented in software that establishes bidirectional communication between a program that communicates information between a computer or server and one or more client programs. A socket is known to associate a computer/server program with a specificlogical port on a machine where it runs such that a client program may communicate with a compute/server program over the socket that is associated with the port.
A client device, therefore, may not communicate simultaneously with a CP processor and an DP processor over the single communication pathway. Conventionally if a DP processor is used to authenticate a client device, program code associated with the DP processor must be overly complex because it must include all of the software required to authenticate a client device. Similarly, if a CP processor is used to authenticate a client device, the CP processor may be overloaded handling information relating to SSL virtual private network (VPN) data traffic transmitted between a computing resource and the client device after an authentication process has been completed. In either instance, the performance of the CP processor or the DP processor cannot be fully optimized using currently available multi-processor computing systems.
What is needed is a system and a method for optimizing the performance of CP processors and DP processors in a multi-processor system that does not require a DP processor to validate the credentials of a client device and that does not require a CP processor to administrate the transfer of data through a computing device.

Proxy authentication for a multiple core network device


A trench is formed in a substrate with an upper region and a lower region. The trench is subsequently widened in its upper region and in its lower region by isotropic etching. In the upper region, an insulating collar is formed that is designated as a buried insulating collar due to the widened trench. The insulating collar is removed in the vicinity of the surface of the substrate, through which the substrate is exposed in this region. Here, a selective epitaxial layer is subsequently grown in the trench, through which a subsequently formed selection transistor can be formed in perpendicular fashion over the trench, or very close to the trench. In addition, through the widened trench the electrode surface of the capacitor electrodes is enlarged, which ensures an increased storage capacity.

The invention lies in the semiconductor and memory technology fields. More specifically, the invention pertains to a method for manufacturing a trench capacitor that can be a component of a memory cell of a semiconductor memory.
Semiconductor memories, such as for example DRAMs (Dynamic Random Access Memories), are made up of a cell field and peripheral drive control equipment. Individual memory cells are situated in the cell field.
A DRAM chip contains a matrix of memory cells that are arranged in the form of rows and columns, and are controlled by word lines and bit lines. The reading out of data from the memory cells, or the writing of data to the memory cells, is accomplished through the activation of suitable word lines and bit lines.
Conventionally, a memory cell of a DRAM contains a transistor that is connected with a capacitor. Among other things, the transistor is made up of two diffusion regions that are separated from one another by a channel that is controlled by a gate. One diffusion region is called the drain region, and the other diffusion region is called the source region.
One of the diffusion regions is connected with a bit line, the other diffusion region is connected with a capacitor, and the gate is connected with a word line. Through application of suitable voltages to the gate, the transistor is controlled in such a way that a flow of current between the diffusion regions through the channel is switched on and switched off.
Due to the progressive miniaturization of memory components, the integration density is continually being increased. The continual increasing of the integration density means that the surface available per memory cell is constantly decreasing. This has the result that the selection transistor and the storage capacitor of a memory cell are subjected to a constant reduction in their geometrical dimensions.
The continuing effort towards miniaturization of memory devices promotes the design of DRAMs having greater density and smaller characteristic size, i.e., smaller memory cell surface. In order to manufacture memory cells that require a smaller surface area, smaller components, such as for example capacitors, are used. However, the use of smaller capacitors results in a lower storage capacity of the individual capacitor, which in turn can have an adverse effect on the functional capability and applicability of the memory device. For example, read amplifiers require a sufficient signal level for the reliable reading out of the information stored in the memory cells. The ratio of storage capacity to bit line capacity is decisive in the determination of the signal level. If the storage capacity becomes too small, this ratio can be too small to produce a sufficient signal for the controlling of the read amplifier. Likewise, a smaller storage capacity requires a higher refresh frequency. An additional disadvantage of a capacitor that has been reduced in its geometrical dimensions is to be found in the electrical supply lines, which are likewise fashioned with a reduced cross-section, through which the resistance of the supply lines is increased and the speed of the individual memory cell is reduced.
According to U.S. Pat. No. 5,744,386 it is known to produce a selective epitaxial layer on an exposed lateral wall in trench capacitors for the formation of a vertical selection transistor.
According to U.S. Pat. No. 6,066,527, it is known, for example, to produce an insulating collar in an upper region of a trench.
It is accordingly an object of the invention to provide a method of fabricating a trench capacitor of a memory cell of a semiconductor memory, which overcomes the above-mentioned disadvantages of the heretofore-known devices and methods of this general type and which provides for lower manufacturing costs and increased capacitance of the trench capacitor.
With the foregoing and other objects in view there is provided, in accordance with the invention, a method of manufacturing a trench capacitor, which comprises the following method steps:
providing a substrate with a substrate surface;
forming a trench with an upper region, a lower region, and a side wall in the substrate, the upper region being closer to the substrate surface than the lower region;
isotropically etching the trench to widen the trench in the upper region and the lower region;
conformally depositing a first insulating layer in the trench;
etching the first insulating layer with directed etching to form the first insulating layer as a lateral edge web;
removing the first insulating layer from the lower region of the trench, thereby forming an insulating collar in the upper region from the first insulating layer, the collar extending into the trench from the substrate surface down to a first sinking depth;
forming a capacitor dielectric on the substrate in the lower region of the trench and on the insulating collar in the upper region of the trench;
filling the trench with a conductive trench filling;
sinking the insulating collar into the trench down to a second sinking depth located between the substrate surface and the first sinking depth, and exposing the substrate on the side wall of the trench, above the second sinking depth;
sinking the conductive trench filling and the capacitor dielectric into the trench down to a third sinking depth located between the first sinking depth and the second sinking depth;
selective-epitaxially growing a selective epitaxial layer on the exposed side wall of the trench; and
forming an electrical contact between the conductive trench filling and a doping region of a selection transistor. With the novel process there is formed a trench capacitor having a buried insulating collar and an epitaxial layer is formed, which is grown above the insulating collar in the trench, starting at the substrate. The buried insulating collar has the advantage that the trench capacitor is formed with a larger diameter than is provided by the lithographic mask used for its structuring. In this way, the trench capacitor is formed with a larger cross-sectional surface, which on the one hand enables a larger surface of the electrodes of the trench capacitor, through which the capacitance of the trench capacitor is increased, and on the other hand enables a larger cross-sectional surface for the conductive trench filling that forms the inner capacitor electrode of the trench capacitor and forms an electrical connection between the inner capacitor electrode B through the insulating sleeve formed by the insulating collar B to a doping region of a selection transistor. Through the enlarged cross-sectional surface of the conductive trench filling in the tubular insulating jacket formed by the insulating collar, a reduced electrical resistance is enabled, through which the time required for reading out and for storing an item of information in the trench capacitor can be reduced. The inventive combination of the buried insulating collar with a selective epitaxial layer grown above the insulating collar in the trench makes it possible to form the selection transistor of the memory cell closer to the trench capacitor, thus reducing the overall surface claimed by the memory cell. In this way, leakage currents between adjacent contact regions are likewise reduced.
An advantageous construction of the inventive method provides that a masking layer is situated on the substrate surface, and the directed etching of the first insulating layer is carried out selectively to the masking layer with etching gas containing carbon fluoride, such as C4F8, C5F8, or C2F6. Through the described etching with the named etching gases, the first insulating layer is formed in the trench as a lateral edge web. Because a widening of the trench was previously carried out, the masking layer blocks or screens the side wall of the trench, so that the insulating layer remains on the side wall of the trench during the directed etching.
A further construction of the inventive method provides that with the first insulating layer an oxidation step is carried out, at a temperature between 900xc2x0 C. and 1050xc2x0 C., for a duration between 20 and 90 minutes, in an atmosphere containing oxygen and/or nitrogen, in order to seal the first insulating layer.
This method step is suitable for the sealing of an insulating layer deposited by means of a CVD (Chemical vapor Deposition) or LPCVD (Low Pressure CVD) process, through which leakage currents through the insulating layer and at its boundary surface are reduced.
A further method step provides that an etching mask is formed in the upper region of the trench on the insulating layer, said mask being used as an etching mask in the removal of the insulating layer from the lower region of the trench. The etching mask is formed in the upper region of the trench in order to cover the first insulating layer there during an etching, and to protect it from the etching substance. During the etching, the first insulating layer is then removed from the lower region of the trench, while it remains in the upper region of the trench. In this way, the insulating collar is structured out of the first insulating layer and is formed in the upper region of the trench.
A further method step provides that in the trench, a first trench filling is deposited on the first insulating layer and is sunk into the trench up to a first sinking depth, whereby the first trench filling is removed from the upper region of the trench, and a conformal masking layer is deposited in the upper region of the trench on the first insulating layer and on the first trench filling, and is isotropically etched back, whereby lateral edge webs are formed on the first insulating layer that are used as an etching mask for the removal of the first insulating layer from the lower region of the trench. This method at first forms a first trench filling that is sunk into the trench up to a first sinking depth. Above the first trench filling, a masking layer is applied in conformal fashion on the first insulating layer and on the trench filling. The masking layer is subsequently etched with a directed etching step, through which the masking layer is formed as a lateral edge web (spacer) on the first insulating layer, above the first trench filling. The lateral edge webs are now subsequently used as an etching mask in order to protect the first insulating layer in the upper region of the trench, while the first insulating layer is removed from the lower region of the trench.
A further method step provides that in the trench a masking layer is deposited in conformal fashion on the first insulating layer and in the trench, a first trench filling is brought in on the masking layer and is sunk into the trench up to a first sinking depth, whereby the first trench filling is removed from the upper region of the trench, and the masking layer situated above the first sinking depth on the first insulating layer is converted into a modified masking layer through the bringing in of dopant on its surface, and the first trench filling is removed selectively to the modified masking layer from the lower region of the trench, and the masking layer is removed selectively to the modified masking layer from the lower region of the trench, and the modified masking layer is used as an etching mask for the removal of the first insulating layer from the lower region of the trench. This is a further method variant, involving the formation of an etching mask in the upper region of the trench on the first insulating layer, so that the first insulating layer can be removed from the lower region of the trench, while it remains in the upper region of the trench. For this purpose, first a conformal masking layer is deposited in the upper region and in the lower region of the trench on the first insulating layer. Subsequently, the first trench filling is filled in the trench and is sunk into the trench up to the first sinking depth. Here, the masking layer in the lower region of the trench is covered by the first trench filling, and is exposed in the upper region of the trench above the first sinking depth. Subsequently, the masking layer is converted through the bringing in of dopant at its surface. As a p-dopant, for example boron, indium, or gallium can be used, and as an n-dopant phosphorus, arsenic, and antimony are suitable, as well as oxygen or nitrogen.
Subsequently, the first trench filling is removed selectively to the modified masking layer from the lower region of the trench. Because the masking layer in the lower region of the trench has a different doping than does the modified masking layer in the upper region of the trench, the masking layer can likewise be removed selectively to the modified masking layer from the lower region of the trench. Subsequently, the modified masking layer acts as an etching mask in the removal of the first insulating layer from the lower region of the trench.
If, for example, an amorphous silicon layer is used as a masking layer, this layer can be doped with boron by means of a plasma doping. Subsequently, the first trench filling, made up for example of photoresist, is removed from the lower region of the trench. Subsequently, the removal of the masking layer can take place selectively to the modified masking layer doped with boron, by means of a KOH etching.
A further method step provides that a buried plate is formed around the lower region of the trench, whereby dopant is brought into the substrate. This is possible for example by means of a gas phase doping with arsenic or phosphorus. The buried plate acts as an outer capacitor electrode of the trench capacitor, and may be electrically connected with other buried plates of adjacent trench capacitors via a buried layer, to form a common counter-electrode.
A further method step provides that a capacitor dielectric is formed in the lower region of the trench on the substrate and in the upper region of the trench on the insulating collar. The capacitor dielectric is used as an insulating layer between the two capacitor electrodes of the trench capacitor, which form the outer capacitor electrode of the buried plate. A further construction of the inventive method provides that the conductive trench filling is sunk up to the second sinking depth, and subsequently the capacitor dielectric is etched isotropically, whereby it is etched back up to the second sinking depth, and subsequently the insulating collar is etched isotropically, whereby this collar is etched back up to the second sinking depth, and subsequently the conductive trench filling is sunk in up to the third sinking depth, and subsequently the capacitor dielectric is isotropically etched, whereby it is etched back up to the third sinking depth.
The specified method steps form a structure wherein the conductive trench filling and the capacitor dielectric are sunk into the trench up to the third sinking depth, and the first insulating layer is sunk into the trench up to the second sinking depth. The second sinking depth is thereby situated between the first sinking depth and the substrate surface, and the third sinking depth is situated between the first sinking depth and the second sinking depth. This has the advantage that the subsequently grown selective epitaxy grows for example only on the side wall of the trench above the second sinking depth, which is situated at a distance from the third sinking depth, and thus from the filling height of the conductive trench filling.
A further method step provides that a contact layer is formed in the trench on the conductive trench filling. The contact layer has the advantage that it prevents an epitaxial growth on the contact layer, and thus on the conductive trench filling, in the subsequent selective epitaxy. Through this, for example a polycrystalline growth is avoided.
A further method step provides that an intermediate layer is formed on the selectively grown epitaxial layer. The intermediate layer has the advantage that the monocrystalline substrate and the epitaxially grown layer can be protected from crystal imperfections which could otherwise progress out of the trench into the substrate, and could result in damage to the selection transistor.
A further method step provides that a process step is carried out at a temperature between 900xc2x0 C. and 1050xc2x0 C. in an atmosphere containing hydrogen, at a pressure of approximately 20 Torr (2666 Pascal), whereby crystal defects are reduced in the epitaxially grown layer.
The process step can also be carried out at a temperature between 500xc2x0 C. and 900xc2x0 C., at a pressure of less than 10xe2x88x928 Torr, whereby the selective epitaxy is carried out in UHV (ultra-high vacuum).
Other features which are considered as characteristic for the invention are set forth in the appended claims.
Although the invention is illustrated and described herein as embodied in a method for manufacturing a trench capacitor of a memory cell of a semiconductor memory, it is nevertheless not intended to be limited to the details shown, since various modifications and structural changes may be made therein without departing from the spirit of the invention and within the scope and range of equivalents of the claims.

Method for manufacturing a trench capacitor of a memory cell of a semiconductor memory


A color image processing apparatus comprises a printer for printing an image corresponding to an original image scanned by an scanner. An image memory is provided into which signals from the color scanner respectively corresponding to plural colors are written and from which signals to be transmitted to the printer are read. The image memory is arranged such that a signal for a writing operation and a signal for a reading operation are substantially simultaneously input. A memory control unit addresses the image memory in either the writing operation or the reading operation. The memory control unit comprises a writing address counter, a reading address counter and a control means. The control means controls the writing address counter and the reading address counter such that image data is read from the image memory before the writing of the image data into the memory is completed.

1. Field of the Invention
The present invention relates to an image forming apparatus for reading and processing an image placed on an original document support and recording an image corresponding to such original image, and in particularly to such image forming apparatus capable of effecting plural different processing modes.
2. Related Background Art
In case of reproducing an original image on a sheet with different processings in different image areas, for example with different image magnifications in different area, such reproduction has been obtained by preparing two copies and obtaining a paste-up from these two copies. However such paste-up is not necessarily beautiful at the contour, and is cumbersome to make for the user.
Situation is also the same in case of taking a part of two original images and reproducing these on a same recording sheet with different processings. Though there have been developed complex color image editing apparatus in order to meet requirements such as inserting a color image into a black-and-white character original or moving a color image within a page, but such apparatus require an editing image memory, are expensive and complex in operation and are therefore unsuitable for the use in usual offices. Also in the usual color copying machines, even if image synthesis is achieved by making a paste-up as explained before, the obtained results are not satisfactory since the black characters may lose their image quality or the junctions of paste-up may become noticeable on the copy.
In the conventional color copying machines, a copy is obtained by separating the original image into three primary colors blue, green and red, and constructing a copy image with complementary color materials of yellow, magenta and cyan, which can be toners or inks employed for example in an electrophotographic process, a thermal transfer process or an ink jet process. However, in any process, since the color image has to be formed by superposing different coloring materials in succession, there inevitably results a color aberration, in the reproduction of fine lines, particularly of black characters, so that such black images appear as the mottles of different colors which are unpleasant for observation. Recently developed digital copying machines are trying to improve the image quality of black characters through new technologies such as black extraction, undercolor removal, edge enhancement etc., but these technologies are not yet complete and may at the same time deteriorate the image quality due to an edge enhancement noise in a halftone image if such halftone image area is included in the original image. In order to avoid such drawback there has been conceived to separate the image into a character image area and a halftone image area and to apply optimum processes respectively to edge area and halftone image area, but such method has never been conducted in complete manner.

Color image processing apparatus with memory interface synchronization between image scanner and printer operations


Dental hygiene filament, for use as dental floss or as bristles for a tooth brush for flossing and/or brushing teeth, comprising an elongated body defining an exterior surface having an abrasive, granular substance, such as pumice, uniformly distributed thereon. The granular material is firmly attached to the filament so that, when used as dental floss, pulling on the ends of the floss between the teeth allows for aggressive and efficient removal of plaque while moving the dental floss across the surface, as recommended by dentists. In addition, the irregular surface area acts to cause additional frictional interaction between the filament's granular material and the tooth surface, quickly and efficiently removing the plaque and providing a greater surface area for removing plaque. Each filament embodiment may include a microbicide for preventing bacterial growth.

1. Field of the Invention
This invention relates to dental hygiene filament, and, more particularly to a filament used for dental floss and tooth brush bristles which has an improved ability for removing plaque from teeth by virtue of providing an interdental cleaning filament with an irregular surface profile for improved cleaning efficiency.
2. Description of the Background Art
The primary aim of dental self-care is the prevention of tooth decay and removal of plaque. Plaque is a gummy film made up of polysaccharides and bacteria that adheres to your teeth, particularly along the gum line. Preventing the buildup of plaque is recognized as one of the best ways to avoid tooth decay and periodontal disease. Plaque not only leads to cavities, but also eventually combines with certain minerals in saliva to form tartar (also called calculus). Such deposits, both above and below the gum line, lead to periodontal disease such as gingivitis. Symptoms of periodontal disease include bleeding, swollen and receding gums, bad breath, and, ultimately, loose teeth. In addition, destruction of underlying bone and loss of teeth occur in advanced stages. Accordingly, a number of devices are known in the art for use in dental self-care to prevent the buildup of plaque and food particles from the teeth and gums.
The primary instruments for removing plaque and preventing tooth decay and gum disease rely on filament devices such as the tooth brush and dental floss. Tooth brushes are well known instruments used in dental self-care. The typical tooth brush includes a handle portion and a head portion containing a plurality of bristles. Tooth brush bristles are typically formed of flexible, water-repellent nylon bristles with rounded or tapered ends. The tooth brush, and, specifically, the brush bristles, are maneuvered by the user around the teeth and gums while brushing. Typically, toothpaste, or even baking soda, is used as an abrasive for cleaning surfaces of the teeth. In addition, interdental brushes, which have a cylindrical or conical array of bristles, are commonly used in cleaning spaces between teeth.
Furthermore, flossing is an important part of any dental hygiene program. The benefits of using dental floss or tape for preventing the build-up of plaque and for removing food particles and bacteria from between teeth and below the gum line is well recognized in the dental art. Dental floss and tape (hereinafter "floss") are made of round or flat nylon fiber. Dental floss is typically inserted between teeth at various angles and moved in an up-and-down or back-and-forth motion across the surfaces of the teeth. The string diameter is quite small to allow it to fit between the teeth of people who have very close fitting teeth. One of the great advantages that dental floss has in removing plaque is that plaque readily sticks to the surface of a tooth, requiring some type of mechanical application to remove it. Brushing does not readily access between the teeth sufficiently to remove plaque along the tooth surface, especially near the gum line. If the plaque is not efficiently removed, gingivitis and loss of gum bone can literally cause a person to lose their teeth.
Use of the term dental filament herein shall broadly refer to dental floss, dental tape, and/or tooth brush bristles. One of the problems with using conventional dental hygiene instruments is that it can be very time consuming as the dental filament must be aggressively tensioned against each tooth for adequate plaque removal. Accordingly, there exists a need for an improved dental filament for use with dental hygiene devices, such as dental floss or tape and tooth brushes, for providing improved removal of plaque, food particles and the like.
The present invention provides a more efficient dental filament by improving the mechanical interaction between the filament and the tooth surfaces, thereby requiring less effort by the user and faster removal of plaque residing on the tooth surface, so that one can quickly and readily clean one's teeth by flossing and brushing, greatly reducing the time that it takes for each cleaning.


An information processing apparatus comprises: a protocol pass-preventing device provided between a data transmission side and a data reception side, for causing only a predetermined protocol to pass through the protocol pass-preventing device; description means provided on the data transmission side, for describing a protocol which cannot pass through the protocol pass-preventing device in a data area of a protocol which can pass through the protocol pass-preventing device; and extraction means provided on the data reception side, for extracting the protocol which cannot pass through the protocol pass-preventing device from the data area of the protocol data which can pass through the protocol pass-preventing device. As a consequence, such an information processing apparatus capable of performing communication by using the impermissible protocol can be provided even in such a case that the information processing apparatus are isolated from each other by the protocol pass-preventing device such as the firewall.

1. Field of the Invention
The present invention is related to an information processing system containing an information processing apparatus at transmission side, an information processing apparatus at reception side, and a protocol pass-preventing device such as to a firewall which are connected between the transmission-side information processing apparatus and the reception-side information processing apparatus, and also is related to an information processing method executed in this information processing system.
2. Description of the Conventional Art
Normally, no communication can be carried out by using impermissible protocols between information processing apparatus which are isolated from each other by firewalls. Conventionally, there are two methods as methods capable of establishing communications by using impermissible protocols. In a first method, setting of a firewall is changed and thus, an impermissible protocol can pass through information processing apparatus. In other words, this first method corresponds to such a method for setting such that this impermissible protocol is defined as a permissible protocol. The second method corresponds to a method for utilizing IPSec and L2F (Layer2 Forwarding), which are used in VPN (Virtual Private Network). This second method corresponds to such a method for executing encapsulation by using the protocol corresponding to either the second layer (data link layer) or the third layer (network layer) in the OSI (Open Systems Interconnection) 7-layers model.
FIG. 3 is a block diagram for schematically showing a conventional information processing system to which the above-described second method is applied.
In FIG. 3, reference numeral 11 shows a transmission-sided information processing apparatus, reference number 12 represents a transmission-sided VPN apparatus, reference numeral 13 indicates a transmission-sided firewall, and reference numeral 14 represents a reception-sided firewall which is connected via the Internet to the transmission-sided firewall 13. Also, reference numeral 15 indicates a reception-sided VPN apparatus, and reference numeral 16 denotes a reception-sided information processing apparatus.
With reference to the conventional information processing system with employment of such an arrangement, operations thereof will now be explained by using FIG. 4. That is, FIG. 4 is a flow chart for describing process operations of the conventional information processing system shown in FIG. 3.
First, the transmission-sided information processing apparatus 11 produces data to be transmitted (step S21). After the data has been produced, this data is transmitted from the transmission-sided information processing apparatus 11 to the reception-sided information processing apparatus 16 (step S22) When the data passes through the transmission-sided VPN apparatus 12, this transmission-sided VPN apparatus 12 applies the protocol header of either the second layer (data link layer) or the third layer (network layer) of the OSI 7-layer model to the original data produced by the transmission-sided information processing apparatus 11. In the other words, the transmission-sided VPN apparatus 12 performs the encapsulation (step S23). The data to which this protocol header has been applied passes through the transmission-sided firewall 13 (step S24). Also, the data to which this protocol header has been applied passes through the reception-sided firewall 14 (step S25). When the above-described data passes through the reception-sided VPN apparatus 15, this reception-sided VPN apparatus 15 deletes the protocol header from this data, which has been applied by the transmission-sided VPN apparatus 12 at the above-described step S23 (step S26) Then, the reception-sided VPN apparatus 15 transmits such data from which the protocol header has been deleted to the reception-sided information processing apparatus 16 (step S27). In other words, the reception-sided VPN apparatus 15 sends the original data which has been formed by the transmission-sided information processing apparatus 11 to the reception-sided information processing apparatus 16. The reception-sided information processing apparatus 16 receives this transmitted data so as to analyze this transmitted data (step S28).
Even in the case that such a method is used, in order that these encapsulated data may pass through the transmission-sided firewall 13 and the reception-sided firewall 14 in the above-described steps S24 and S25, setting of these firewalls must be previously changed with respect to the transmission-sided firewall 13 and the reception-sided firewall 14. A difference of this method from the first method is to have such a setup that the protocol header is applied to the transmitted data in the step S23, and this protocol header can be deleted therefrom in the step S26. As a consequence, such a feature can be established in which any persons who do not know this setup cannot make up any communication, and thus, this featured setup can compensate for a lack of security which is caused by the above-described change in setting of the firewalls. In other words, this conventional method implies that a reliable relationship can be established among respective networks where information processing apparatus are present.
However, in such a case that while an impermissible protocol is used, a communication is made between information processing apparatus which are isolated from each other by firewalls, if setting of the firewalls is merely changed, then the following problems may occur. That is, security is deteriorated, and also such a cumbersome operation is necessarily required that setting of the firewalls is changed every time the communication is carried out. Also, in the case of the VPN network, there is another problem that a reliable relationship must be previously established between two networks which are isolated from each other by employing firewalls, and such a communication issued from a network where such a reliable relationship could not be established is also interrupted.
In this conventional information processing system and also the conventional information processing method, even in such a case that the information processing apparatus are isolated from each other by the protocol pass-preventing device such as the firewall, there is a request that the communication can be made by employing the impermissible protocol while setting of the protocol pass-preventing device is not changed, but also, a specific reliable relationship is not established between the information processing apparatus which are isolated by the protocol pass-preventing device.

Information processing system and information processing method capable of communicating with impermissible protocol

Matsushita Electric Industrial Co., Ltd.


A diagnostic imaging system is provided that includes an image acquisition component, a transmitter operatively coupled to the image acquisition component to transmit a signal therefrom, and a beamformer operatively coupled to the image acquisition component to receive image data therefrom. Also included is a processor configured to assemble images from the acquired image data and a display configured to display the images. The image acquisition component includes a multi-headed probe that has a plurality of transducers configured to permit a change of active transducers during an imaging session without a change of the image acquisition component.

Diagnostic imaging, and in particular, medical imaging may use different imaging modalities to scan a patient or region of interest. For example, to perform an echography, a probe or transducer is placed in contact with a patient's skin. Different probe geometries can be used during an examination to optimize acquisition of images. However, using known ultrasound examination systems, a sonographer must perform additional actions to change a probe during or between patient examinations to use different probe geometries. The time and effort required to change probes can cause physical stress for the sonographer or patient and affect the duration of a patient exam. To reduce these issues, additional connectors could be provided for each of the probes having different geometries. However, providing additional connectors increases the size and portability of the probes, which in many applications is undesirable.

This patent is subject to a terminal disclaimer.

Multi-headed imaging probe and imaging system using same


Development of network-based computing resources can be enhanced through the use of methods and systems that allow for controlled editing of specification data used in an automated build process in a user-friendly way. Particularly, one or more software tools can be used to allow editing of application programming interfaces (API) specification data such as Web Application Description Language (WADL) or Web Service Description Language (WSDL) and/or to allow editing of elements used to generate software development kit (SDK) documentation relied upon by an automatic build system. For example, a first interface may be configured for editing parameter values and parameter types related to functionality of the API while a second interface may restrict use to editing descriptive aspects of the API such as the SDK.

Web services and web applications include software systems that support machine-to-machine interaction over a network. For example, a web service or web application may comprise one or more application programming interfaces (APIs) that can be accessed over a network and executed on a remote system hosting the requested service or application. Typically, available functionality is specified in an API and corresponding documentation for use in invoking the web service. For instance, some web services may be defined using the Web Application Description Language (WADL), which is an XML-based format that describes services in a machine-processable way and/or the Web Service Description Language (WSDL), which is an XML format for describing web services, such as by defining ports and messages.
Development of a web service or web application can raise logistical challenges. For example, the web service/application may be developed to include a software development kit (SDK) for clients that includes detailed reference documentation, client libraries for invoking the web service/application in target languages, and sample applications/code. This effort may be difficult to coordinate among multiple parties responsible for various aspects of the project.
As an example, in some existing development workflows, technical writers are not permitted direct access to WADL or WSDL data. Instead, they may deal indirectly with data that is difficult to edit and which may be out of date. Furthermore, there may be some delay between when the technical writer makes a contribution and when the changes to the SDK can be seen by the writer. Similar issues may occur for other personnel, such as software engineers wishing to add or update an API.

Methods and systems for managing data service specifications


Computer-implemented methods and systems for displaying nodes on a display device, wherein the nodes have a hierarchical context. Positional information associated with a plurality of nodes is used to generate a display for the nodes. The generated node display maintains hierarchical contextual information about the nodes.

In the field of computer graphical user interfaces (GUIs), there is competition between the amount of space available for representing data and the usability of the interface to be produced. In representing hierarchical data, this competition is extremely important because the user of this data gains important information not only from the data itself, but also from the relationships between the data.
Historically, hierarchical data has been represented in a structured layout that helps in the understanding of parent-child relationships in the data. One approach has been to display the data in a top-down manner wherein children nodes are shown connected to their parent node with positions below the parent node. Another approach includes displaying the data in a left-right manner wherein children nodes are shown connected to their parent node with positions to the right of a parent node.
These approaches encounter multiple difficulties when the display is altered, such as when a user changes the focus of a node display. Several approaches encounter difficulty in illustrating parent-child relationship even from the initial display of the nodes. Such approaches can remove or render ambiguous the hierarchical relationship hints present in a structured hierarchical arrangement, thus making the layout more difficult to comprehend.

Computer-implemented node-link processing systems and methods


An electronic sound processor creates reverberation effects using a simulated impulse function. The simulated impulse response is generated by combining frequency bands of white noise. The power of each band decays exponentially in time. The time constants are generated from the characteristics of a real or imaginary listening space. A reverberated sound signal is generated from an original sound signal by convolution of the original signal and the simulated impulse response. The method can adapted to generated stereophonic signals and to generate a forward and inverse reverb effect using only one set of multiplications.

Field of the Invention
The present invention relates to an electronic musical instrument and more particularly to a multi-timbral percussion instrument having spatial convolution.
Multi-timbral percussion instruments can produce sounds based upon actual digital recordings of "real" instruments. Such type of sounds can be any type of percussion sound such as drum sounds and the like. It would be highly desirable to provide a multi-timbral percussion instrument which could directly implement artificial reverberation such as from real and/or imaginary structures without actually visiting or building those structure.

Multi-timbral percussion instrument having spatial convolution


A method for determining a position of a selected area of a sheet of material relative to a reference plane includes launching a first incident light beam at the selected area of the sheet of material such that the first incident light beam strikes the selected area at a first position and a first angle, thereby producing a first reflected light beam. A second incident light beam is launched at the selected area of the sheet of material such that the second incident light beam strikes the selected area at a second position and a second angle, thereby producing a second reflected light beam. The second position and second angle are different from the first position and first angle, respectively. The first reflected light beam and the second reflected light beam are intercepted at the reference plane. Information related to positions at which the reflected light beams were intercepted and angles at which the incident light beams were launched were received and correlated to the position of the selected area relative to the reference plane.

Fusion draw process is used to make a sheet of material from molten material, such as molten glass. The general fusion draw process is described in U.S. Pat. Nos. 3,338,696 and 3,682,609, both issued to Dockerty. Typically, the fusion draw process involves delivering molten material into a trough and overflowing the molten material down the sides of the trough in a controlled manner. The separate streams of material flowing down the sides of the trough merge at the root of the trough into a single stream of material, which is drawn into a continuous sheet of material. The continuous sheet of material is separated into discrete pieces at the bottom of the fusion draw machine. A key advantage of this process is that the surfaces of the sheet of material do not come in contact with the sides of the trough or other forming equipment and therefore are pristine. Another benefit of the process is that the sheet of material is very flat and has a uniform thickness.
Large sheets of glass produced by fusion draw process are a key component in making large flat panel displays. Alternatively, they can be diced to make other devices such as active electronic devices, photovoltaic devices, and biological arrays. However, as the demand for even larger sheets of material increases, so does the difficulty in producing and handling of these sheets. For example, sheet scoring and separation processes at the bottom of the fusion draw machine (FDM) contribute significantly to the sheet motion in the forming zone of the FDM. Sheet motion in the forming zone can negatively impact the level of stress and stress variation within the sheet, possibly leading to distortion in the final product. The larger the sheet being handled, the more significant the effect of sheet motion can be on the stress level and variation with the sheet.
Corning Incorporated, the assignee of the present invention, has developed various techniques for minimizing sheet motion at the bottom of the draw. One such technique involves scoring the glass sheet by laser, thereby avoiding physical contact with the glass sheet that can result in sheet motion, as described in U.S. patent application Ser. No. 12/008,949. Another technique involves use of a conformable nosing device to engage a glass sheet while the glass sheet is being scored, thereby reducing motion of the glass sheet during scoring, as described in U.S. patent application Publication No, US2008/0276646. Another technique involves separation of the glass sheet without bending the glass sheet, as described in U.S. Patent Application Publication No. US2007/0039990. These techniques require real-time information about the position of selected areas of the glass sheet relative to a reference plane. Such information at different elevations of the FDM is also useful in fine-tuning and optimizing the draw process.

Method and apparatus for determining sheet position using information from two distinct light beams each at a different position and a different angle


An atomizer assembly (10) drives an atomizing bell (108) to apply paint onto a part (14). The atomizer assembly (10) includes a core (24) having at least one paint line (26) extending therethrough, a turbine device (40) circumscribing an axis (A) and disposed in the core (24), and a turbine unit (62) surrounding the pain line (26) and having a shaft (104) rotatable relative the turbine device (40) with several turbine blades (130) connected to the shaft (104). A plurality of nozzles (64, 66, 68) are defined in the turbine device (40) and are positioned relative a turbine wheel (106) connected to the shaft (104) to drive fluid, i.e. gas onto the turbine blades (130). An annular wall (94) extends outwardly from one of the terminal ends of the turbine device (40) to define a seat (96) for engaging the core (24) to maintain a fixed gap between the paint line (26) and the shaft (104) and to eliminate contact therebetween.

A production paint application process where paint is applied to a substrate, such as, for example a vehicle body moving through a paint booth, requires paint to be transferred from a paint reservoir to a paint applicator robot disposed in the paint booth, where paint is applied by a rotary atomizer as an integral part of the paint applicator robot. Typically, the rotary atomizer includes a turbine device disposed in a housing, a rotating bell unit having a shaft connected to a bell cup and disposed in and rotatable relative to the turbine device and the housing. The bell cup has a generally conical overflow surface between a radially inward central axial opening and a radially outward atomizing edge. At or near the radially outward atomizing edge, the angle of the overflow surface relative to the axis of the bell cup decreases sharply to form a lip adjacent the atomizing edge. The purpose of this lip is to generally direct the atomized paint more axially forward and reduce radial scatter. Typically, an air shaping ring is attached to the turbine device to improve distribution of the paint onto the vehicle body being painted.
The art is replete with prior art designs of an air shaping rings for a rotary atomizer. The U.S. Pat. No. 5,775,598 to Takayama et al.; U.S. Pat. No. 5,727,735 to Baumann et al.; U.S. Pat. No. 6,189,804 and U.S. Pat. No. 6,623,561 both to Vetter et al.; and the United States Patent Publication Nos. 2005/0001077 and 2003/0010840 both to Kon et al. The United States Patent Publication No. 2005/0001077 to Kon et al., for example, teaches a rotary atomizer having a housing, a turbine device disposed in the housing, a bell unit disposed in and rotatable relative the turbine device. An air shaping ring is disposed about the turbine device and is connected to the housing by a partially threaded fastener extending to a hook to interconnect the air shaping ring with the housing. This design is complex and requires additional component, such as the aforementioned fastener to interconnect the housing with the air shaping ring.
The U.S. Pat. No. 6,623,561 to Vetter et al., on the other hand, teaches a rotary atomizer having a housing, a turbine device disposed in the housing, a bell unit disposed in and rotatable relative the turbine device. An air shaping ring is disposed about the turbine device and between the turbine device and the housing. The air shaping ring of the U.S. Pat. No. 6,623,561 to Vetter et al. does not require additional components, such as, for example, partially threaded fastener extending to a hook, taught by the United States Patent Publication No. 2005/0001077 to Kon et al. to interconnect the air shaping ring with the housing. Hence, the air shaping ring and the turbine device taught by the U.S. Pat. No. 6,623,561 to Vetter et al. do not provide for constant surface to surface contact between the air shaping ring and the turbine device. In addition, none of the prior art patents teaches an improved design of the atomizer having improved rigidly stabilized connection between the turbine device and the housing for maintaining a fixed air gap between the shaft and a paint pipe or line extending through the shaft for keeping the shaft at a fixed distance relative to the paint line as the shaft rotates around the axis.
The goal of the invention is therefore to provide an improved design of the turbine device to eliminate at least one of the aforementioned problems associated with prior art atomizers.


A method for detecting an analyte according to the present invention includes: a first step of supplying a specimen to a detection device having a first ligand that is immobilized on a substrate and is capable of specifically binding to the analyte, the specimen being supplied onto the substrate of the detection device, and then causing the analyte included in the specimen to bind to the first ligand; a second step of supplying, onto the substrate, a second ligand that is labeled with a marker and is capable of specifically binding to the analyte, and then causing the second ligand to bind to the analyte bound to the first ligand; and a third step of measuring the second ligand bound to the analyte, wherein in the second step, carboxymethyl dextran is supplied onto the substrate.

In general immunoassays, an analyte (antigen) is bound to an immobilized first ligand (solid antibody), that analyte is bound to a labeled second ligand (labeled antibody), a sandwich system of first ligand-analyte-second ligand is formed, and at a time point when the binding of the first ligand, the analyte, and the second ligand has been achieved to a certain extent, the analyte is detected by measuring the labeled second ligand.
As one of such immunoassay devices, an SPFS device that enables detection of an analyte to be performed with high accuracy based on the principle of surface plasmon-field enhanced fluorescence spectroscopy (SPFS), to which a surface plasmon resonance phenomenon is applied, may be mentioned.
Surface plasmon-field enhanced fluorescence spectroscopy is a method for detecting an analyte in an infinitesimal amount at an ultralow concentration, by generating surface plasmon light (compressional waves) on a metal thin film surface under the conditions in which excitation light such as laser light irradiated from a light source undergoes attenuated total reflectance (ATR) at the metal thin film surface, thereby increasing the amount of photons carried by the excitation light irradiated from a light source to the range of from several dozen times to several hundred times, thus obtaining an effect of enhancing the electric field of the surface plasmon light, thereby efficiently exciting a fluorescent substance bound to an analyte captured in the vicinity of the metal thin film surface through this electric field enhancing effect, and observing this fluorescence.
An immunoassay such as SPFS is a highly sensitive method for detecting an analyte; however, in a case in which the binding force (affinity) between the analyte (antigen) and the second ligand (labeled antibody) is weak, since the second ligand cannot bind precisely to the analyte, the accuracy of detection for the analyte is not high.
As one method of enhancing the accuracy of detection for an analyte, a method of enhancing the accuracy of detection for an analyte by incorporating carboxymethyl dextran into a dilute solution of a specimen, thereby capturing the contaminants included in the specimen with carboxymethyl dextran, and thus suppressing an increase in the blank caused by the contaminants, is disclosed in Patent Literature 1.
However, in this method, an enhancement in the accuracy of detection brought by lowering of the blank can be expected; however, in a case in which the binding force between the analyte and the second ligand is weak, since the detection sensitivity for the analyte is not high per se, there are limitations in enhancing the accuracy of detection for the analyte.


Rather than attaching a preamble to a data traffic subpacket, a preamble channel is transmitted along with a traffic channel. In a system wherein the data traffic subpackets are variably sized, preambles can also be variably sized if a target station can decode variably sized preambles. A method and apparatus for decoding variably sized preamble subpackets are presented herein.

I. Field of the Invention
The present invention relates generally to communications, and more specifically, to decoding preambles transmitted on preamble channels.
II. Background
The field of wireless communications has many applications including, e.g., cordless telephones, paging, wireless local loops, personal digital assistants (PDAs), Internet telephony, and satellite communication systems. A particularly important application is cellular telephone systems for mobile subscribers. (As used herein, the term "cellular" encompasses both cellular and personal communications services (PCS) frequencies.) Various over-the-air interfaces have been developed for such cellular telephone systems including, e.g., frequency division multiple access (FDMA), time division multiple access (TDMA), and code division multiple access (CDMA). In connection therewith, various domestic and international standards have been established including, e.g., Advanced Mobile Phone Service (AMPS), Global System for Mobile (GSM), and Interim Standard 95 (IS-95). In particular, IS-95 and its derivatives, IS-95A, IS-95B, ANSI J-STD-008 (often referred to collectively herein as IS-95), and proposed high-data-rate systems for data, etc. are promulgated by the Telecommunication Industry Association (TIA), the International Telecommunications Union (ITU), and other well known standards bodies.
Cellular telephone systems configured in accordance with the use of the IS-95 standard employ CDMA signal processing techniques to provide highly efficient and robust cellular telephone service. Exemplary cellular telephone systems configured substantially in accordance with the use of the IS-95 standard are described in U.S. Pat. Nos. 5,103,459 and 4,901,307, which are assigned to the assignee of the present invention and fully incorporated herein by reference. An exemplary described system utilizing CDMA techniques is the cdma2000 ITU-R Radio Transmission Technology (RTT) Candidate Submission (referred to herein as cdma2000), issued by the TIA. The standard for cdma2000 is given in draft versions of IS-2000 and has been approved by the TIA. The cdma2000 proposal is backwards compatible with IS-95 systems. Another CDMA standard is the W-CDMA standard, as embodied in 3rd Generation Partnership Project "3GPP", Document Nos. 3G TS 25.211, 3G TS 25.212, 3G TS 25.213, and 3G TS 25.214.
In the CDMA systems introduced above, voice and data traffic can be carried in message frames of various lengths. Typically, a remote station in the range of a base station must receive and decode a plurality of message frames in order to determine the complete voice and data payload information. Preambles are attached to the message frames to convey information as to the number of message frames that will carry a given payload. In addition to the number of frames that are needed to carry the full payload, preambles can also carry information identifying the target destinations and the transmission rates of the message frames. Other information, such as the radio link protocol (RLP) sequence numbers of the message frames, can also be included. Hence, the accurate decoding of message frames is dependent upon the detection and decoding of the preambles attached to said message frames. It is desirable to increase the ability of a target station to accurately detect and decode preambles, which would lead to more accurate detection and decoding of payload information.


An optical element and lighting module are provided with increased light output, uniformity of brightness and color, and controlled lighting distributions. The optical element functions simultaneously as an outcoupling TIR light guide and a direct throughput lens. Additionally, areas typically dedicated to bezels or edge reflectors can be greatly reduced or eliminated due to decreased hotspotting to provide a fixture face with a very high percentage of light emitting area. It provides typical benefits of an edge-lit light guide design including thin forms and shallow depth, extended emitting area, and single or dual peak off axis light distributions particularly useful in applications such as indirect illumination of ceilings, wall washing, aisle lighting, exterior façade lighting and area lighting as well as other lighting applications. Embodiments are described for direct, indirect, and direct:indirect illumination in recessed, surface and suspended fixture configurations.

Lighting systems incorporating optical waveguides positioned close to the light source provide significant benefits such as thin form factor and adjustable lighting output. However, efficient optical coupling from the light source to the waveguide is difficult to achieve and typically 10% to 30% of light is lost. Traditional approaches that target full edge coupling of light into optical waveguides typically lose efficiency by having low utilization of uncoupled light and of light that enters the input edge but escapes light guide on a non-output face or near the edge where the output is blocked by a bezel or reflector. Often bezels are deemed necessary to hide "hotspotting", non-uniform brightness close to light sources due to excessive outcoupling near the edge. In addition, light sources such as LEDs often have a variation of their color output over angle that are typically accentuated by coupling into optical light guides.

Optical element and lighting module with multimode output


A system for managing innovation challenges includes a computing apparatus having a processor and a memory with computer readable program code, wherein the processor under control of the computer readable program code is configured to implement, a content management system that operates to automatically generate an innovation challenge for students based on a common template that includes student eligibility requirements, a user management system that operates to collect user information, obtains parental or guardian consent, and determines individual student eligibility for specific innovation challenges, a submission management system that operates to automate ingestion, display, storage, and judging of challenge entry submissions, and a dashboard display that operates to manage innovation challenge participation.

Presently available innovation challenge management tools are limited in that they typically host a limited scope of challenges, have limited functionality, limited or no curriculum, do not accommodate minor entrants or entrants under 13 years of age, or they are individually hosted on a microsite where each challenge uses hard coding or off-the shelf system tools in order to be implemented. In some instances, educators and students may have limited visibility into the system, and consent, when required, may be difficult to obtain or manage. Furthermore, the file formats for challenge submission entries may be limited, which limits the kinds of challenges the platform can host. Existing solutions typically do not have the technology infrastructure in place to provide educators, students, parents and/or challenge administrators with a comprehensive set of tools for managing and participating in innovation challenges, contests, and associated activities.

System and method for managing innovation challenges


A miniature zinc-air cell employing an anode cup that has an inner indium layer deposited over a copper layer on a conductive substrate such that the indium layer contacts the anodic mixture of the cell so that the anodic mixture can be made with little or no mercury. A method for producing anode cups is also disclosed.

Alkaline electrochemical cells employing a zinc anode have become commercially important as a relatively high rate source of electrical energy. The alkaline electrolyte, which is usually concentrated aqueous potassium hydroxide, is a principal factor contributing to the ability of these cells to deliver high rates of electrical energy compared to the older Leclanche cells which utilize zinc chloride and/or ammonium chloride electrolytes. However, as is so often the case with technological advances, the presence of alkali in an electrochemical cell is a mixed blessing. For instance, alkali strongly promotes the reaction of water with zinc causing corrosion. Unless means are employed to control this reaction, the shelf life of alkaline zinc cells would be unacceptably short. In addition, since hydrogen gas is released in the reaction between alkali and zinc, there may be a danger of cell disassembly.
In commercial alkaline zinc cells, the reaction between zinc and alkali has been controlled or reduced to an acceptable rate by the addition of mercury to the cell. Unfortunately, it has recently become apparent that the introduction of mercury into the environment may be a hazard to human health as well as to other forms of life. While individual cells contain only a small amount of mercury, the very large number of zinc alkaline cells marketed today could cause significant quantities of mercury to enter the environment upon disposal of such cells.
U.S. Pat. No. 3,847,699 disclosed an alkaline zinc-manganese dioxide cell in which the proportion of mercury needed to achieve acceptable storage life can be reduced by the addition of small amounts of an ethylene oxide polymer.
U.S. Pat. No. 4,500,614 discloses an alkaline cell having an anode prepared by amalgamating an alloy powder made of zinc and at least two metals selected from the group consisting of gallium, indium and thallium. The metals are incorporated in the cell to reduce the amount of mercury required to prevent corrosion of the zinc in an alkaline electrolyte which causes generation of hydrogen gas and subsequent leakage of the electrolyte.
German Patent 1,086,309 discloses an alkaline zinc cell in which an indium compound is added to the electrolyte and/or indium metal is alloyed with refined zinc so as to protect the zinc against corrosion in an acidic, neutral or alkaline electrolyte.
Japanese Publication No. 1958-3204, published Apr. 26, 1958, recites that the addition of 0.0001% to 2.0% indium can be added to pure zinc base alloy containing one, two, or more of the metallic elements Fe, Cd, Cr, Pb, Ca, Hg, Bi, Sb, Al, Ag, Mg, Si, Ni, Mn, etc., to form a zinc alloy which has a high corrosion resistance and which is suitable for use in primary cells.
Japanese unexamined patent application 01-307161 is directed to a mercury-free alkaline cell wherein the negative electrode's collector is coated with indium and/or lead in which the coating can be supplied by any method such as electroplating.
As seen from the above, manufacturers of alkaline batteries have invested substantial amounts of time and money in the effort to develop mercury-free batteries. The first batteries to incorporate mercury-free constructions were the AA, C and D standard alkaline batteries. These batteries have historically used the largest quantities of mercury per cell and are the most common sizes and type purchased by consumers. Therefore, removing mercury from these batteries was the best way to significantly reduce the quantity of mercury that is currently entering the general waste stream when used alkaline cells are thrown away.
In addition to developing mercury-free standard alkaline batteries, battery manufacturers have also sought to develop miniature zinc-air battery constructions that are free of mercury. While a layman may believe that the technology used to produce mercury-free standard alkaline batteries can be used to produce mercury-free miniature zinc-air batteries, the manufacturers of miniature zinc-air batteries have found that additional technology had to be developed before mercury-free miniature zinc-air cells could be manufactured on a commercial basis. The construction of a miniature zinc-air battery is substantially different from the construction of a standard alkaline battery. These differences in construction have forced battery manufacturers to develop processes and techniques that pertain only to the miniature zinc-air cells.
It is an object of the present invention to provide a miniature zinc-air cell which has a reduced amount of mercury of less than 6%, preferably less than 3%, in the zinc-containing electrode and most preferably having a mercury-free zinc-containing electrode.
It is another object of the present invention to provide a miniature zinc-air cell with a zinc-containing electrode that is substantially free or completely free of mercury and wherein the surface of the electrode cup contacting the zinc-containing electrode has an undercoat of copper and a top coat of indium.
It is another object of the present invention to provide a method for producing an indium coated cup for housing a zinc-containing electrode of a miniature zinc-air cell.
These and other objects of the invention will be apparent from the following description.

Miniature zinc-air cell having an indium plated anode cupe


An improved method is provided to enhance skin appearance and health, in which skin is cleaned (or exfoliated) and conditioned by use of microelements affixed to a base element or hand-held patch. For the microstructure used in the improved method, the dimensions of the microelements are controlled so as to remove a certain number of layers of skin cells and to accumulate and retain those skin cells, along with other foreign substances, into areas between the microelements. In another embodiment of the improved method, a conditioning compound or therapeutic active can be applied to the exfoliated skin to enhance the skin. Moreover, the amount of skin cells accumulated using the improved method represents a self-limiting maximum quantity that cannot be substantially exceeded regardless of the number of attempts by a user to re-use the microstructure apparatus associated with the improved method. Some of the microelement shapes are purposefully designed with distal ends that exhibit sharp edges rather than sharp tips to reduce skin irritation resulting from use of the improved method.

Human skin is the largest organ. Skin and hair are the surfaces of the human body that are visible to others and the appearance of skin is important to good grooming and health. Human skin comprises several layers, the outermost is the stratum corneum, which comprises dead skin cells and makes up a substantial portion of the first protective barrier of the body. Most skin comprises a stratum corneum which is 15–20 layers of dead cells thick (about 10–20 microns in thickness). However, some "durable" skin layers, such as heels or calluses, can comprise a stratum corneum which is from 100–150 microns thick. On average, the skin naturally sheds at least one skin layer each day, and the first one to four layers of skin may be removed without affecting the protective nature of skin or the health thereof. In fact, removing up to four (4) layers of the stratum corneum may provide a skin surface area onto which make-up may be more uniformly applied and once applied has a more aesthetically pleasing appearance.
The removal of up to the first ten (10) layers of skin may also instigate resolution of and/or removal of unwanted comedones which themselves may be the result of skin pores being blocked by bacteria, dirt, dead cells, make-up, etc. The removal of skin layers in a safe and convenient manner can be indirectly accomplished in a limited manner by washing (or scrubbing) with an abrasive cloth, for example, a terry cloth sheet, but only skin cells which are about to shed are removed. However, make-up can be deposited into opened pores and if not thoroughly rinsed can leave the skin with an unwanted film of dirt, dead skin cells, oxidized oil.
There is therefore a long felt need for a system for providing enhanced skin health and appearance by helping to remove the outermost layer of human skin. There is also a need for a system which is capable of delivering to human skin one or more treatments which result in a smooth skin condition which facilitates the application of appearance enhancement compositions, cosmetics, and other materials or actives.
In conventional skin treatment or preparation methodologies, the skin cells scraped loose tend to become airborne when a mechanical scrubber is used. These airborne skin cells are distasteful at best, and could represent some type of health hazard in certain situations. In view of this situation, there further is a need to prepare skin in a manner such that most or all of the removed or "loose" skin cells do not become airborne.
In conventional skin treatment or preparation methodologies, the user has great control over the quantity of skin cells that are scraped loose from the skin, simply by rubbing harder, or by rubbing a larger (or smaller) number of strokes. This can be an undesirable situation, since the person may possibly injure himself or herself by being too vigorous, or since the person may achieve nothing by not being vigorous enough. It would be a significant improvement to provide an article of manufacture that can essentially guarantee that a predetermined maximum quantity of skin cells will be removed by application of that article on skin, such that the article's use is essentially fool-proof by virtue of its effects being self-limiting, so that only a maximum amount of skin cells can be removed, regardless of the user's very vigorous attempts to continue the rubbing strokes.

Microstructures and method for treating and conditioning skin which cause less irritation during exfoliation


A structure analysis device includes a memory and a processor configured to obtain model information, evaluate a size of a model in accordance with the model information, select, in accordance with the evaluated size, either a direct method or an iterative method as a first algorithm of a simultaneous linear equation of a structure analysis solver that uses a finite element method, and execute structure analysis of the model by using the first algorithm.

In the related art, a structure analysis technology using a finite element method is known. In structure analysis using the finite element method, for example, by solving simultaneous linear equations, displacement or stress of a structure is obtained. Since computational complexity of solving the simultaneous linear equation is large and it takes time to calculate the simultaneous linear equation, there are various technologies for solving the simultaneous linear equation at high speed using a calculator. As a solution of the simultaneous linear equation, for example, a direct method and an iterative method can be used as a large classification. For example, the direct method is a solution of directly solving the simultaneous linear equation by triangulating a coefficient matrix, whereas the iterative method is a solution method of finding an approximate solution by iterative calculation.
As an algorithm of the simultaneous linear equation solution represented by the direct method and the iterative method, various technologies to solve more quickly by using the calculator more efficiently are developed. For example, an algorithm of the direct method in a sparse matrix direction is introduced in Yusaku Yamamoto: "Direct solution of sparse matrix simultaneous linear equation". An algorithm of the iterative method suitable for a parallel process and a calculation example of the algorithm are introduced in Ohara Toshiyasu, Kawashima Yasuhiro, and Fujino Seiji: "Shorter processing time for FEM structure analysis by Hybrid iterative solver", Proceedings of the Conference on Computational Engineering and Society 19, 4p, 2014-06.

Structure analysis device and structure analysis method


A method and system for performing floating point additive arithmetic operations of long operands in a narrow dataflow. The operands include first and second floating point numbers having first and second mantissas, respectively, the second operand greater than the first operand. The mantissas are both separated into a low portion and a high portion, the high portions are loaded into N-bit operand registers. The high portion of the first mantissa is aligned with respect to the high portion of the second mantissa, the high portions are then moved into 2N-bit registers. The low portion of the first mantissa is aligned in accordance with the alignment of the first mantissa high portion. The low portions of both mantissas are then concatenated into the registers, the first mantissa concatenated using a hold-function circuit. A 2N-bit-wide adder performs the additive arithmetic operation on the concatenated mantissas.

Arithmetic processing circuitry for binary numbers as known in the art typically employs floating point arithmetic in accordance with the IEEE 754 binary format, or with the Hex-Extended format standard as implemented for example in IBM S/390 floating point processing circuitry. Floating point arithmetic, used in addition, multiplication, and division, first normalizes the binary numbers to be added, multiplied, or divided by shifting the binary numbers until, for a positive number, the first non-zero digit (i.e., 1) is immediately to the left of the radix point such that the mantissa part of the binary numbers is greater than or equal to 1 and less than 2. A negative binary number will have leading ones. Thus, to normalize a negative number, the number is shifted so that the first zero is immediately to the left of the radix point.
For multiplication, the normalized binary numbers are then multiplied and their exponents are added. For division, the normalized binary numbers are divided and their exponents are subtracted. For addition and subtraction, the normalized numbers are shifted (i.e., aligned) so that their exponents are equal, then the numbers are added or subtracted, respectively.
A fused ADD/multiply (FPU) circuit of the above type and operation is disclosed in U.S. Pat. No. 5,993,051, titled "COMBINED LEADING ONE AND LEADING ZERO ANTICIPATION." An ADD circuit, which is able to be used either for instructions which operate on operands of regular length (e.g. 64 bit) or of extended length (e.g. 128 bit) is disclosed in, for example, IBM S/390 and z/Series computer systems produced in the year of 1999 or later, and in associated documentation such as "z/Architecture Principles of Operation," International Business Machines Publication No. SA22-7832-00 (First Edition, December 2000), also in form of fused Multiply/Add circuitry. The regular use of e.g. a 64-bit dataflow is referred to herein as "narrow" dataflow in view of a "longer" 128-bit operand perspective.
The Instruction of a MULTIPLY AND ADD is described in "z/Architecture Principles of Operation," International Business Machines Publication No. SA22-7832-00 (First Edition, December 2000), chapter 19.
The S/390 hardware processor architecture requires a so-called "extended" add (and subtract) operation, in which an instruction has a mantissa of 112 bits, but the fraction dataflow width is only 56 bits for the input registers and for the aligner unit (optimized for 'long' instructions).
Therein, a sum S is calculated from operands A and B:S=A+B,
where the mantissa of the floating point number having the smaller exponent is aligned according to the exponent difference between the bigger and the smaller exponent of the floating-point number. Within a "narrow" fraction dataflow optimized for 'long' operands, an extended (or quad precision) operand is divided into two (or respectively more) parts, and a respective number of suboperations are performed, to calculate the result sum.
An example is given as follows:
Definitions:                Exp (A) LESS THAN OR EQUAL TO Exp (B)        A=Ahigh+Alow         B=Bhigh+Blow         Aaligned-high=aligned(Ahigh)        Aaligned-low=aligned (A) i.e. Aaligned-low=aligned(Ahigh)+aligned(Alow),        Shigh=high part of raw sum        Slow=low part of raw sum.
The following suboperations are performed in prior art, as given by the IBM S/390 architecture:
1. Calculate Exponent difference: the difference determines a shift amount for further alignment steps;
2. Align Ahigh (shift right) by amount of exponent difference which results in Aaligned-high, i.e. the operand A's mantissa is in the range of Bhigh;
3. Align Alow to the range of Blow->save as Alow-aligned-low
4. Align Ahigh to the range of Blow->save as Ahigh-aligned-low
5. Build Aaligned-low by concatenating Alow-aligned-low and Ahigh-aligned-low
6. Add Aaligned-low and Blow;—to get Sraw-low and save carry_out
7. Add Aaligned-high and Bhigh and saved carry_out to get Sraw-high
8. Do Normalization—build the final normalized Sum Shigh and Slow out of Sraw-high and Sraw-low (different cases, since Sraw can have leading zeros)
This operation typically takes 13 cycles in prior art implementations, such as specified in the above IBM S/390 architecture.
The disadvantage of prior art implementations such as the IBM S/390 architecture is the high number of 13 cycles used, and the fact that the control logic required to do the above suboperations is complex, since the respective normalization procedure is complex.
For the foregoing reasons, therefore, there is a need in the art for an improved floating point adder unit and corresponding method for extended floating point ADD operations in a "narrow" dataflow.

Advanced execution of extended floating-point add operations in a narrow dataflow

International Business Machines Corporation


The present invention relates to an optical substrate comprising a transparent substrate, a low refractive index layer, whose refractive index is lower than that of the transparent substrate, disposed over the transparent substrate, and a solgel film disposed over the low refractive index layer; a light emitting element having a first electrode, a light emitting layer and a second electrode over the solgel film of this optical substrate; and a display device provided with this light emitting element.

1. Field of the Invention
The present invention relates to an optical substrate for light emitting elements, a light emitting element using it, a display device using the light emitting element, and manufacturing methods thereof.
2. Description of the Related Art
Along with the advance of information and communication technology over the recent years, diverse display devices have been developed. Among them is the self-luminescent organic electroluminescence (EL) element, which is attracting interest for its high display quality and thinness.
The organic EL element is a self-luminescent element embodying the principle that recombination energy between holes injected from the anode and electrons injected from the cathode causes fluorescent substance to emit light by applying an electric fields. Since a report was published on a laminated low voltage-driven organic EL element, many research attempts have been made on organic EL elements composed of one organic material or another. One example is an element using tris(8-quinolinol) aluminum for the light emitting layer and a triphenyldiamine derivative for the hole transport layer. Advantages of the laminated structure include enhanced efficiencies of hole injection into the light emitting layer and of the generation of exciters, the latter being generated from a recombination by blocking the electrons injected from the cathode, and the enclosure of exciters generated within the light emitting layer. Other known element structures for organic EL elements such as the two-layered one cited above include a three-layered structure comprising a hole transport layer, a light emitting layer and an electron transport layer. These laminated elements embody many contrivances in element structure or formation method intended to enhance the efficiency of recombination of injected holes and electrons. Also, the wavelength of emitted light can be changed by using a different material for the light emitting layer.
However, in an organic EL element, there is a constraint to the probability of singlet generation due to the dependence of spin statistics at the time of carrier recombination, resulting in an upper limit to light emitting efficiency. The level of this upper limit is known to be about 25%. When an iridium complex is used as the dopant material for the light emitting layer, luminescence from the triplet exciter of iridium arises at a high probability and this, combined with the utilization of the singlet exciter, enables exciter generation at a high probability of 75 to 100%.
Incidentally, organic EL elements and the like confine light by a total reflection effect as an optical phenomenon characteristic of them. As the refractive index of the light emitting layer or the transparent electrode is higher than that of the substrate or air, light whose angle of emission is at or above a critical angle is totally reflected by the transparent electrode/substrate interface or the substrate/air interface, and cannot be extracted out of the substrate. Supposing that the refractive index of the organic layer including the emitting layer is 1.6, that of the transparent electrode 2.0 and that of the substrate 1.5, the quantity of light emitted outside, namely the efficiency of light extraction is no more than 20% or so. For this reason, the limit of energy conversion efficiency is never high, only about 5% including the probability of singlet generation or, even if the triple exciter is utilized, no more than 15 to 20% in total. This poses a problem not only to organic EL elements but also to plane-light emitting elements in general, whose light emitting material discharges light.
As a method to enhance this light extraction efficiency, it is proposed in Patent Document 1 (Japanese Patent Laid-Open No. 2001-202827) to arrange a low refractive index layer between the substrate and the transparent electrode, and this laminated structure is shown in FIG. 11. According to this disclosed method, the presence of a transparent electroconductive film (transparent electrode layer) 302 in contact with at least one surface of a low refractive index body 301 serves to enhance the rate of extracting the light passing the low refractive index body 301 into the atmosphere and this enhanced rate of extracting the light outside, and the refractive index 1.003 to 1.300 of the low refractive index body 301 enable the light passing the low refractive index body 301 to be more efficiently extracted into the atmosphere, resulting in a higher extracting ratio of light to be extracted to the outside. Furthermore, an ultra-low refractive index dose to 1 is realized by using silica aerogel for the low refractive index body 301.
Also, Patent Document 2 (Japanese Patent Laid-Open No. 2002-278477) discloses an invention by the same inventor in which the light emitting element of Patent Document 1 is applied to a thin film transistor (TFT) substrate. According to this disclosed technique, a low refractive index layer on the other side surface of the transparent electroconductive layer than the light emitting layer is within a range of 1.01 to 1.3.
Further, Non-Patent Document 1 (T. Tsutsui, Adv. Mater. 2001, 13, No. 15, August 3, pp. 1149-1152) discloses a structure in which an organic EL element is provided over a substrate having a silica aerogel film of 10 μm in thickness arranged as the low refractive index layer, a silicon oxide (SiO2) film of 50 nm in thickness arranged over the silica aerogel film, and a transparent electrode (ITO) of 100 nm in thickness arranged over the silicon oxide film. The silicon oxide film here is formed by sputtering. The reference states that the external quantum efficient of the disclosed structure is 1.8 times higher than that of an element structure having no silica aerogel film.
However, the above related arts leave room for improvement in the following respects.
The structures described in Patent Documents 1 and 2, in which a low refractive index layer is arranged between the substrate and the transparent electrode layer, are effective in that the efficiency of light extraction is enhanced by collecting the light within a critical angle, but the reflection of light by the interface between the transparent electrode and the low refractive index layer makes the enhancement of light extraction efficiency still insufficient. When a porous silica aerogel film is used to obtain an ultra-low refractive index layer, the mechanical strength of the film is extremely weak. Further, when the transparent electrode is patterned in a wet process, the etchant flowing round from the porous silica aerogel film makes it difficult to form the prescribed pattern. Moreover, the surface roughness of the porous film invites inter-electrode leaks and pixel short, giving rise to unstable light emission or failure to emit light. Thus, these techniques are still inadequate as light extraction methods that can be applied to organic EL elements.
The method described in Non-Patent Document 1 by which a silicon oxide film is formed by sputtering over a silica aerogel film of 10 μm in thickness is also inadequate in that the sputtered film does not serve to improve surface roughness of the silica aerogel film, and similarly invites interelectrode leaks and pixel short. Further it is difficult to form a silica aerogel film as thick as 10 μm with sufficient uniformity, and accordingly element characteristics are susceptible to fluctuation. If this method is to be applied to a display device provided with a thin film transistor (TFT), the 10 μm film thickness will make it difficult to form contact holes needed for connecting the pixel electrode and the source electrode of the TFT, making the intended application impossible.

Optical substrate, light emitting element, display device and manufacturing methods thereof