An absorbent dressing for absorbing exudate from a wound is disclosed. The absorbent dressing contains a plurality of dried absorbent hydrogel particles sealed within a porous container. The porous container is non-adherent to the wound, and the hydrogel particles remained sealed within the container after absorbing the wound exudate. In a preferred embodiment, the particles are dried polyacrylonitrile hydrogel particles, and the porous container is in the form of a sachet bag made from nylon, cotton, polyester, polypropylene and the like.

Dermal wound healing is a natural process which occurs whenever there is a break in the surface of the skin. An orderly, progressive process begins to take place in several stages, commencing with an inflammatory response necessary for natural sterilization of the area, clotting, and preparation of the wound for its natural progress toward closure.
The second stage of wound repair primarily involves migration of necessary cells to the wound site. These cells, which also appear in an ordered sequence during the second stage of healing, include key white cells, followed by polymorphonuclear leukocytes and macrophages--all essential to initiation of the repair process. These cells serve to clean up the wound and to deliver an endogenous mixture of growth factors to the wound site. In addition to white cells, fibroblasts from the wound periphery migrate to and into the site to deposit collagen, glycosaminoglycans, and other extracellular matrix components, providing the basis for granulation tissue formation. These macromolecules, in conjunction with capillary endothelial cells and new blood vessels, form the new tissue required to repair the defect.
The third stage of dermal wound healing involves proliferation of the cell types mentioned above together with subsequent increases in the amount of granulation tissue and coverage of the area with new epithelium.
Throughout the healing process, wounds produce a variety of fluids, generally known as wound exudate. The composition and quantity of this exudate may differ by wound type and with each stage of the wound's healing process. Exudate may vary--consisting primarily of blood and serous fluids to highly concentrated protein solutions. In general, wound exudate provides the necessary source of growth factors, nutrients and cells that are essential to the wound repair process. However, as with many biological processes, the amount of wound exudate must be controlled because over-production can provide a media for bacterial proliferation or lead to maceration of the surrounding healthy tissue. Conversely, inadequate types or amounts of wound exudate, or drying of the wound fluid, will lead to scab formation and impaired wound healing.
The control of wound exudate, referred to as moisture control, has become a major focus in current wound dressing design. The major categories of moist or synthetic wound dressings currently in use are thin films, hydrocolloids, hydrogels, and alginates. All of these various types of dressings control wound exudate through combinations of absorption, moisturization, and moisture permeability. The overall aim of moist wound dressings is to maintain the appropriate balance of moisture in the wound environment, which is essential to allow the natural wound healing process to occur.
Wound dressings which maintain a moist wound environment range from gels to thin films, foams, alginates, and hydrocolloids (see, e.g., Szycher et al., J. Biomater. Appl. 7:142-213, 1992). Thin film wound dressings consist of synthetic polymeric films which have one side coated with a pressure sensitive adhesive. This type of wound dressing has little or no absorptive ability and manages moisture primarily by the moisture vapor permeability of the polymeric film. Pooling and concentration of wound exudate under these dressings is commonly observed.
Hydrocolloids is a term commonly used to describe a family of wound management products consisting of gel forming agents combined with elastomers and adhesives attached to a polyurethane film or foam. This type of dressing usually has poor moisture vapor permeability, but some absorptive capability. These dressings typically absorb wound exudate by becoming thicker and forming a gelatinous material over the wound which has to be washed from the wound at each dressing change.
Hydrogel wound dressings are sheet dressings often supplied with an impermeable polymeric backing sheet. The presence of the backing sheet prevents the partially hydrated hydrogel from dehydrating and drying onto the wound bed. The hydrogels are similar to the hydrocolloids in their ability to absorb and manage wound exudate. Generally, hydrogel dressings do not dissolve into the wound bed as do hydrocolloids.
Foam dressings are generally manufactured from polymeric materials such as hydrophylic polyurethane. These foams contain open cells facing the wound surface which serve to absorb wound exudate by a sponge type mechanism. As with all sponges, the absorbed exudate is not tightly bound in the foam and a certain amount can be "squeezed" from the dressing upon removal.
Alginates are highly absorbent wound dressings composed of a variety of alginic acids extracted from certain species of seaweeds. The addition of a calcium salt during processing allows the formation of insoluble fibers which can be woven or formed into wound dressings of various sizes and shapes. During use, alginate wound dressing typically swell and form a soft gel in the wound bed. This gel must be washed from the wound bed at each dressing change.
In addition to the above, EP-A1-0 171 268 discloses a dressing for use in deep wounds which comprises small pieces of absorbent polyurethane foam contained within a porous bag or sachet. In a similar manner, EP-A1-0 575 090 discloses products suitable for absorbing wound exudate comprising particles of alginate or alginic acid enclosed in perforated bags.
Despite the wide variety of wound dressings available, chronic wounds are still a serious medical situation and there is a need for advanced wound care dressings which manage the moist wound environment. This includes the need for moisture controlling and absorbing wound dressings which do not leave a residue in the wound bed and which retain fluid when removed. The present invention fulfills these needs and provides further related advantages.

Absorbent hydrogel particles and use thereof in wound dressings


Apparatuses and methods based thereon are provided for utilizing washing attachments in portable manner. A washing attachment may comprise a movement component and a washing component. The movement component is adapted to connect the washing attachment to a driving device that is operable to provide a driving force to the washing attachment. The washing component is adapted to fit within a space in the container when the washing attachment is applied to the container, and is configured to facilitate laundry washing within the space when the driving force is applied to the washing attachment. The washing component may be an auger component having a helical-shaped structure. The helical-shaped structure may comprise helical extensions (e.g., spiral blades) configured to generate washing movement in the space. When the driving device is a power drill, the helical-shaped structure may be designed such that the spacing between spiral blades of the structure is 0.9 inches.

Existing methods and apparatuses, if any exist, for facilitating portable laundry and clothes washing may be costly, cumbersome and inefficient. Further limitations and disadvantages of conventional and traditional approaches will become apparent to one of skill in the art, through comparison of such approaches with some aspects of the present method and apparatus set forth in the remainder of this disclosure with reference to the drawings.


The present invention provides an engaging member which enables a male member and a female member to be engaged with each other easily by sliding them relatively along the longitudinal direction and having a high engaging force, and a manufacturing method thereof. This engaging member includes the male member to be attached on one of components to be connected with each other and the female member to be attached on the other of the components. Engaging projecting portion with which the female member engages is provided on a side edge in the longitudinal direction of the male member. The female member includes an accommodating portion formed along the longitudinal direction so as to accommodate the male member. Hook-shaped portions with which the engaging projecting portion of the male member engages are formed along the longitudinal direction inside the accommodating portion. One of the accommodating portion of the male member and the female member has an engaging portion so as to protrude laterally and the other member includes an engaged portion with which the engaging portion engages.

1. Field of the Invention
The present invention relates to an engaging member for engaging end edge portions of separate components to be connected with each other and a manufacturing method thereof.
2. Description of the Related Art
Conventionally, there has been disclosed an air/water tightness mesh fastener which is an engaging member comprised of a male member and a female member such that they are flexible and can be engaged with each other due to elastic deformation, for example, in Japanese Utility Model Laid-Open Publication No. 5-76310. This fastener comprises a male engaging row and a female engaging row. The male engaging row is formed such that an entire section perpendicular to the longitudinal direction is in the shape of an arrow and engaging portions are provided on both sides of a head portion. The female engaging row is so formed that an entire section perpendicular to the longitudinal direction is shaped in letter U. Then, hooking portions are provided on opening edges of a U-shaped concave groove portion such that they oppose each other. Pressing portion is provided bridging side walls of the concave groove portion and a hollow portion is formed at a deeper position.
Engagement between the male engaging row and female engaging row is carried out by an engagement slider or manually. When a head portion of the male engaging row is inserted into the groove portion, the engaging portions engages with the hooking portions.
In case of the above described prior art, the male engaging row is pressed into the groove portion at right angle with respect to the longitudinal direction of the female engaging row so that the hooking portion is elastically deformed so as to achieve an engagement between the male engaging row and the female engaging row. Thus, an operation for adjusting the engagement position is troublesome and the engagement is not carried out easily if the members do not have some extent of stiffness in the engaging direction. Further, the female engaging row needs an appropriate elasticity because both engaging rows can be engaged with each other by respective elastic deformation, while the engaging force between the male engaging row and female engaging row increases as the stiffness of both increases. Therefore, easiness of engagement contradicts the engaging force. Further, the engaging member having this structure keeps the engagement against a force perpendicular to the longitudinal direction of the engaging portion. Therefore, this engaging member cannot resist a force parallel to the longitudinal direction. If an end portion in the longitudinal direction is not closed, the male engaging row is easily slipped out of the female engaging row.
The present invention has been achieved to solve the above described problems and therefore, an object of the invention is to provide an engaging member which enables a male member and a female member to be engaged with each other easily by sliding them relatively along the longitudinal direction and having a high engaging force and a manufacturing method thereof.
To achieve the above object, according to an aspect of the present invention, there is provided an engaging member comprising a male member to be attached on one of components to be connected with each other and a female member to be attached on the other of the components, engaging projecting portions with which the female member engages being provided on a side edge in the longitudinal direction of the male member, the female member including an accommodating portion formed along the longitudinal direction so as to accommodate the male member and hook-shaped portions with which the engaging projecting portion of the male member engages being formed along the longitudinal direction inside the accommodating portion. In the engaging member, one of the male member and the accommodating portion of the female member has an engaging portion so as to protrude and the other member includes an engaged portion with which the engaging portion engages.
Preferably, a plurality of the engaging portions are formed continuously along the engaging projecting portion of the male member and a plurality of the engaged portions are formed in the accommodating portion of the female member along the longitudinal direction. Further, the engaging portion has a face at right angle with respect to the longitudinal direction of the male member from a front end to a proximal end and a face inclined downward with respect to the longitudinal direction of the male member.
Further preferably, the aforementioned male member is engaged with the female member by inserting the engaging projecting portion from an end portion of the accommodating portion of the female member by sliding relatively in parallel. The shape of the engaging portion may be shaped in saw tooth wave, triangular wave, rectangular wave, trapezoidal wave or other.
According to another aspect of the present invention, there is provided an engaging member made of synthetic resin or the like, comprising a male member to be attached on one of components to be connected with each other and a female member to be attached on the other of the components, an engaging projecting portion with which the female member engages being provided on a side edge in the longitudinal direction of the male member, the female member including an accommodating portion formed along the longitudinal direction so as to accommodate the male member, and hook-shaped portions with which the engaging projecting portion of the male member engages being formed along the longitudinal direction inside the accommodating portion. In the engaging member, the male member has engaging pieces formed to extend at a predetermined pitch and elastically deformed within the accommodating portion of the female member and the female member contains at least an engaged portion with which the engaging pieces engage provided in the accommodating portion. The engaging pieces are extended inclinedly in an opposite direction with respect to the insertion direction into the female member and the engaged portion is composed of concave portion such as through hole formed within the accommodating portion.
Preferably, the engaging projecting portion of the male member is provided to protrude on both side faces along the longitudinal direction of the male member while the engaging pieces are formed continuously along a longitudinal edge of the male member. At least one of the end portions opposing each other when the male member and the female member engage with each other is cut out obliquely with respect to the insertion direction.
The aforementioned male member is engaged with the female member by inserting the engaging projecting portion from an end portion in the longitudinal direction of the accommodating portion of the female member by sliding relatively in parallel. The shape of the engaging portion may be shaped in wave, acute-angle triangular wave, narrow rectangular wave, narrow trapezoidal wave or other as long as it is flexible.
According to a still another aspect of the present invention, there is provided an engaging member made of synthetic resin or the like, comprising a male member to be attached on one of components to be connected with each other and a female member to be attached on the other of the components and formed to be flexible than the male member, engaging projecting portion with which the female member engages being provided on a side edge in the longitudinal direction of the male member, the female member including an accommodating portion formed so as to accommodate the male member and hook-shaped portions with which the engaging projecting portion of the male member engages being formed along the longitudinal direction inside the accommodating portion. In the engaging member, the male member has one or a plurality of engaging pieces formed so as to extend sideways thereof such that the male member is capable of sliding within the accommodating portion of the female member while deforming the female member and the female member contains one or a plurality of engaged portions with which the engaging pieces engage. The aforementioned engaged portion is formed of a concave portion such as a through hole formed within the accommodating portion.
The engaging piece has a face at right angle with respect to the longitudinal direction of the male member from its front end to its proximal end and a face inclined downward with respect to the longitudinal direction of the male member.
According to a further aspect of the present invention, there is provided a manufacturing method of an engaging member comprising the steps of: forming a male member to be attached on one of components to be connected with each other and a female member to be attached on the other of the components by extruding as a long member having a predetermined sectional shape; deforming side faces of the male member and female member as the long members by pressing with a pressing die heated at a predetermined temperature substantially at right angle with respect to the longitudinal direction thereof so as to form engaging portions and engaged portions engageable with each other: and cutting the long members into a predetermined length so as to form the respective engaging members.
According to another aspect of the invention, there is provided a manufacturing method of the engaging member, in which the male member to be attached on one of components to be connected with each other and the female member to be attached on the other of the components are formed by extrusion as a long member having a predetermined sectional shape. The male member and female member as the long members are punched out with a predetermined die or the like so as to form the engaging pieces and engaged portions. Then, the long members are cut into a predetermined length so as to form the respective engaging members.
The engaging member of the present invention achieves engagement of the male member and female member by sliding relatively in the longitudinal direction. With the connected state, the engaging projecting portion of the male member engages with the hook-shaped portion of the female member, thereby resisting a pulling force at right angle with respect to the longitudinal direction. Further, the engagement between the engaging pieces and engaged portions can resist a force in the longitudinal direction so that the connected state is maintained.

Engaging member and manufacturing method thereof


Methods for making nanocomposites are provided. In an embodiment, such a method comprises combining a first type of nanostructure with a bulk material in water or an aqueous solution, the first type of nanostructure functionalized with a functional group capable of undergoing van der Waals interactions with the bulk material, whereby the first type of nanostructure induces exfoliation of the bulk material to provide a second, different type of nanostructure while inducing association between the first and second types of nanostructures to form the nanocomposite.

Two-dimensional (2D) nanomaterials have drawn tremendous interest due to their unique structural and electronic properties.1-4 Nanocomposites with 2D nanomaterials as a host matrix have demonstrated enhanced mechanical, thermal, and catalytic properties for a range of applications including optoelectronics, catalysis, energy, and biomedicine.5-9 Regarding biomedicine however, the existing technology for glucose detection is based on an electrochemical method. It requires a glucose test strip and a device called glucometer that is powered by a battery. The patient has to prick blood from his/her finger and transfer onto test strip which is inserted in glucometer which gives a reading of blood glucose level. The test is invasive and blood pricking is inconvenient for many patients, especially elderly people and kids.

Nanocomposites, nanocomposite sensors and related methods


A quaternary alloy sputtering target composed of copper (Cu), indium (In), gallium (Ga) and selenium (Se), wherein a composition ratio of the respective elements is represented by a formula of CuxIn1-yGaySea (in the formula, 0.84≦x≦0.98, 0<y≦0.5, a=(1/2)x+3/2), and a structure observed via EPMA is configured only from a Cu(In, Ga)Se2 phase without any heterogenous phase of Cu2Se or Cu(In, Ga)3Se5. Provided is a CIGS quaternary alloy sputtering target which is subject to hardly any abnormal discharge even when sputtered for a long period, which is free of any heterogenous phase of Cu2Se or Cu(In, Ga)3Se5 which causes the deterioration in the conversion efficiency of the film after being sputter-deposited, and which can produce a film having superior in-plane uniformity. Additionally provided is a CIGS quaternary alloy sputtering target having a predetermined bulk resistance and a high density.

The present invention relates to a Cu—In—Ga—Se (hereinafter referred to as "CIGS" where appropriate) quaternary alloy sputtering target that is used upon forming a CIGS quaternary alloy thin film to become a light-absorbing layer of thin-film solar cells.
In recent years, the technical development of CIGS-based solar cells with high conversion efficiency for use as thin-film solar cells has advanced. As a method of producing the light-absorbing layer of such thin-film solar cells, the vapor-deposition technique and the selenization method are known. Nevertheless, the solar cells produced via the vapor-deposition technique are advantageous of having high conversion efficiency, but have drawbacks; namely, low deposition rate, high cost, and low productivity.
Meanwhile, the selenization method is suitable for industrial mass production, but a complex and dangerous process of performing heat treatment and selenization in a selenium hydride atmosphere gas is required after preparing a laminated film of Cu—Ga and In, and there are drawbacks in terms of cost and time.
Thus, attempts are being made for preparing a CIGS quaternary alloy light-absorbing layer in a single sputtering process by using a CIGS quaternary alloy sputtering target. At present, a CIGS quaternary alloy sputtering target suitable for forming a light-absorbing layer has not yet been achieved.
Patent Document 1 discloses a method of producing a CIGS quaternary alloy sputtering target by: using a Cu molten metal as the starting material; adding Se thereto to prepare a Cu—Se-based binary alloy molten metal; subsequently placing In therein to prepare a Cu—Se—In alloy molten metal; thereafter placing Ga therein to prepare a Cu—Se—In—Ga alloy molten metal; solidifying this to form a CIGS quaternary alloy ingot; thereafter subjecting the ingot to dry grounding; and then hot-pressing the pulverized powder.
Nevertheless, with the CIGS quaternary alloy sputtering target obtained based on the foregoing production method, Patent Document 1 fails to clarify the target structure, film characteristics after being deposited, density, oxygen concentration, and other matters which are issues during sputtering.
Patent Document 2 describes that a Cu—Se powder, a Cu—In powder, a Cu—Ga powder and a Cu—In—Ga powder are mixed and subject to hot pressing, and lays emphasis on safely producing a target for deposition of a chalcopyrite-type semiconductor, but does not in any way clarify the target structure, film characteristics after being deposited, density, oxygen concentration and other matters.
Moreover, Non-Patent Document 1 discloses a method of producing a CIGS quaternary alloy sputtering target by preparing mechanical alloy powder to become the nanopowder raw material, and thereafter performing HIP (Hot Isostatic Pressing) treatment thereto, and further discloses the characteristics of the obtained target.
Nevertheless, with respect to the characteristics of the CIGS quaternary alloy sputtering target obtained based on the foregoing production method, Non-Patent Document 1 qualitatively describes that the density was high, but fails to clarify any specific numerical values of the density.
Moreover, while it is anticipated that the oxygen concentration is high since nanopowder is being used, Non-Patent Document 1 also fails to clarify the oxygen concentration of the sintered compact. In addition, since expensive nanopowder is being used as the raw material, it is inappropriate as a solar cell material which is demanded of low cost.
Moreover, Non-Patent Document 2 discloses a sintered compact having a composition of Cu(In0.8Ga0.2)Se2, density of 5.5 g/cm3, and relative density of 97%. Nevertheless, there is the only description about its production method that the uniquely synthesized raw material powder is sintered via hot press, and the specific production method is not indicated. Moreover, Non-Patent Document 2 also fails to provide any description regarding the oxygen concentration of the obtained sintered compact, target structure, and film characteristics after being deposited.
Non-Patent Document 3 describes technology for preparing a CuIn0.7Ga0.3Se2 alloy sputtering target by subjecting the respective powders of Cu, In, Ga, and Se to mechanical alloying, and additionally performing hot isostatic pressing thereto at 750° C. and 100 MPa. Non-Patent Document 3 describes that the crystal grain size is approximately 50 nm. Nevertheless, Non-Patent Document 3 does not in any way describe the target structure and film characteristics after being sputter-deposited.
Non-Patent Document 4 describes technology for producing a CIGS target by using a powder raw material of CuIn0.72Ga0.28Se2 and subjecting this powder to hot press. Non-Patent Document 4 describes that it is thereby possible to produce a high-density target, and that the structure of this CIGS target contains Cu2Se, In2Se3, and Ga2Se3.
Nevertheless, what becomes a problem in the target structure is the existence of numerous heterogenous phases other than the Cu(In, Ga)Se2 phase. The existence of this kind of heterogenous phase structure induces the deterioration of the conversion efficiency. Non-Patent Document 4 has not recognition of this fact.    [Patent Document 1] Japanese Laid-Open Patent Publication No. 2008-163367    [Patent Document 2] Japanese Laid-Open Patent Publication No. 2009-287092    [Non-Patent Document 1] Thin Solid Films 332 (1998) 340-344    [Non-Patent Document 2] November 2009 issue of Electronic Materials, pages 42 to 45    [Non-Patent Document 3] Written by C. Suryanarayana and 4 others, "Synthesis and processing of a Cu—In—Ga—Se sputtering target" Thin Solid Films 332 (1998) 340-344    [Non-Patent Document 4] Written by Zhang Ning and 2 others, "An investigation on preparation of CIGS targets by sintering process", Materials Science and Engineering B 166 (2010) 34-40

Cu—In—Ga—Se quaternary alloy sputtering target


A cell transmission rate control scheme in ATM network, capable of preventing incorrect updating of information in a resource management (RM) cell. The RM cell having an explicit cell rate field is transmitted and returned between the first and second end-nodes. A first cell transmission rate value written in the explicit cell rate field of the RM cell transmitted by the first end-node is stored at a control unit provided on the ATM network, and a second cell transmission rate value written in the explicit cell rate field of the RM cell returned by the second end-node is detected at the control unit. When the second cell transmission rate value is larger than the first cell transmission rate value, the second cell transmission rate value is rewritten into the first cell transmission rate value in the explicit cell rate field of the RM cell returned by the second end-node at the control unit.

1. Field of the Invention
The present invention relates to a method and a system for controlling a transmission rate of fixed length packets, called cells, which are transferred in an ATM (Asynchronous Transfer Mode) network.
2. Description of the Background Art
In a conventional data transfer utilizing the ATM network, when a user sets up a virtual connection between a source end-node and a destination end-node to carry out the data transfer, the following connection admission control is carried out. Namely, a user requests to a network in advance a desired quality of service (peak cell rate, average cell rate, etc.) for cell transmission, and a network which receives this request permits the connection set up only when the requested quality of service can be provided without adversely affecting the other network users and secures a bandwidth corresponding to the requested quality of service.
Also, at a time of cell transmission after the connection set up, the network monitors whether the cell transmission made by the terminal is in accordance with the quality of service requested at a time of the connection set up request, and when the cell transmission in violation of the requested quality of service is detected, the cells of the detected cell transmission are judged as violation cells, and the network applies a policing control to regulate the violation cells such as UPC/NPC (Usage Parameter Control/Network Parameter Control).
Presently, in the recent ATM Forum, there is a proposition for a new service called ABR (Available Bit Rate) service. In this ABR service, unlike the conventional service described above, a user requests a maximum cell rate (peak cell rate) and a minimum cell rate for the cell transmission at a time of the connection set up, but the cell transmission at the maximum cell rate is not always guaranteed at a time of the cell transmission by the user, although the cell transmission at the minimum cell rate is always guaranteed. In other words, in the ABR service, there is no need for the network to secure the bandwidth in correspondence to the requested connection. In this manner, it is possible for the ABR service to increase a number of simultaneously connected connections compared with the conventional service described above. As a consequence, there arises a possibility for an occurrence of a congestion at a switch in the network. Note that the congestion indicates a state in which it becomes impossible for a switch to provide a desired service as too many cells in excess of a prescribed processing power arrive at the switch. This terminology will be used throughout the following description.
In order to minimize an occurrence of the congestion at a switch in the ATM network, the ATM Forum has proposed a flow control algorithm called EPRCA (Enhanced Proportional Rate Control Algorithm) for realizing the ABR service (see, ATM Forum contribution 94-0735R1). In addition, the ATM Forum has specified source behaviour, destination behavior, and intermediate switch behavior in relation to this algorithm. According to this, the flow control to be made in conjunction with the ABR service operates according to an RM (Resource Management) cell.
FIG. 1 shows an exemplary format for the RM cell, which is in agreement with the format for an RM cell to be used at a time of providing the ABR service as determined by the TM (Traffic Management) working group of the ATM Forum. In this RM cell (53 octets) of FIG. 1, ATM header (5 octets) is a header similar to that of a usual cell, where a PT (Payload Type) field in this header has a value 8 in order to indicate that it is the RM cell. ID (1 octet) is a protocol identifier, which is always set to 0 by the source end-node. DIR (1 bit) is a direction identifier which is set to 0 if it is the RM cell transmitted from the source end-node to the destination end-node, or to 1 if it is the RM cell returned from the destination end-node to the source end-node. CI (1 bit) is a congestion indication, which is normally set to 0 (no congestion), but which is set to 1 when a congestion occurs at a switch unit in the network, CCR (2 octets) is a current cell transmission rate at the source end-node which is set by the source end-node. MCR (2 octets) is a minimum cell transmission rate determined at a time of the connection set up which is also set by the source end-node. ER (2 octets) is a maximum cell transmission rate determined at a time of the connection set up which is also set by the source end-node at a time of transmitting the RM cell, but which is overwritten by a value smaller than an original ER value according to the congestion state in the network when the RM cell is passing through the switch or returned at the destination end-node.
FIG. 2 shows an outline of the ABR service using the RM cell of FIG. 1. A configuration shown in FIG. 2 includes end-nodes 21 and 22 formed by terminals or switches for carrying out cell transmission and reception, a switch unit 23 connected between the end-nodes 21 and 22, and virtual connections 24 and 25 connecting between the end-nodes 21 and 22. Here, the virtual connection 24 is a connection to be used at a time of transferring cells from the end-node 21 to the end-node 22, and the virtual connection 25 is a connection to be used at a time of transferring cells from the end-node 22 to the end-node 21. In the following, regarding the end-node 21 as the source end-node and the end-node 22 as the destination end-node, the outline of the ABR service in a case of carrying out the data transfer from the end-node 21 to the end-node 22 will be described.
The end-node 21 transmits the usual data cells, while also transmitting the RM cell with a current cell transmission rate entered in the CCR (Current Cell Rate) field and the maximum cell transmission rate in the ER (Explicit cell Rate) field at predetermined regular intervals, to the end-node 22 via the same virtual connection 24 as used by the data cells. When this RM cell is received at the end-node 22, the DIR value of the received RM cell is changed to 1, and then the received RM cell is returned to the end-node 21 via the virtual connection 25.
When the switch 23 through which the virtual connection 24 for transferring the data cells is passing fell into the congestion state, the switch 23 is permitted to reduce the ER value of the RM cell transferred on the virtual connection 24 or 25 in order to indicate the congestion level at this switch 23, and/or to set up a CI (Congestion Indication) in the RM cell transferred on the virtual connection 25. Also, instead of reducing the ER value of the RM cell, the switch 23 which fell into the congestion state is permitted to set up an EFCI (Explicit Forward Congestion Indication) in the cell transferred on the virtual connection 24, so that the end-node 22 which received this cell can recognize the occurrence of the congestion and reduce the ER value of the RM cell there.
Then, the end-node 21 which received the RM cell returned at the end-node 22 reads out values in the CI field, the ER field, etc. of the RM cell, and changes the subsequent cell transmission rate according to these values.
In this manner, depending on a level of the congestion at the switch in the ATM network, the cell flow transmitted from the end-node 21 can be controlled, and as a result, it becomes possible to realize the recovery from the congestion according to this algorithm. Note that more than one switches may exist between the end-nodes 21 and 22.
Now, in the above described flow control algorithm, it is permitted for the ER value in the RM cell to be reduced by the end-node 22 or the switch 23 according to the congestion state. However, when the end-node 22 or the switch 23 increased the ER value in the RM cell by error due to malfunction, the ER field is going to have a value which is not reflecting the congestion state of the ATM network, and as a result, the end-node 21 determines the subsequent cell transmission rate on a basis of this erroneous ER value, so that there will be a possibility for the congestion to get worse.
In addition, the end-node 21 for transmitting cells is the only one which controls an amount of cells flowing into the network in response to the occurrence of the congestion in the ATM network, so that when the flow control algorithm execution unit within the end-node 21 fails to function normally, there will be no means for adjusting an amount of cells flowing into the network, and there will be a possibility for the switch in the ATM network to fall into a severe congestion, and a possibility for the quality of service of the other connections utilizing this same ATM network to get degraded.
Thus when the conventionally known flow control algorithm alone is applied, the information in the RM cell (the ER value in particular) may not be updated correctly due to an erroneous operation at the destination end-node or the switch, and an ability to recover from the congestion may be lowered due to an erroneous operation at the source end-node.

Method and system for controlling cell transmission rate in ATM network using resource management cell


A method for optimizing construction of a car body includes selecting body element(s) and obtaining first deformation values therefor from a fully-trimmed model of a first car body construction based on measured dynamic values or simulated dynamic data in a dynamic load simulation during a time period; determining force(s) to be applied to a reduced model of the first car body construction in an equivalent static load simulation model to achieve second deformation values of the element(s) for the reduced model, the second values correspond to the first values for the same element(s); applying in the equivalent static load simulation model, the determined force(s) to a reduced model of an alternative car body construction to achieve third deformation values of the element(s) for the reduced model of the second car body construction; determining if the third values are within a predetermined deformation range for the second car body construction.

In modern vehicle construction and design processes, a car body or parts of a car body are simulated in mathematical or computerized models to better understand the structural behaviour of the car construction. There are many different computer simulation models available that can be used in different stages of the car design process. Real test vehicles may also be used, and many times both real life vehicle testing procedures and vehicle model computer simulations are used in the construction process. Computerized models of vehicles are commonly used to substitute real vehicle models in the optimization processes needed when developing new vehicles. The computerized models are reducing costs and development time.
Important aspects in the design process are the deformations of different parts of the car body construction, where the car body stiffness has a major impact on the squeak & rattle performance of a car. A stiff car body construction can reduce the excitation level of different interior assemblies used in the car construction, such as for example interior structures like the door panels, the car body panels and the cockpit. Also the reduced motions at the seals in closure gaps of the car body can through a stiff car body construction improve the noise, vibration, and harshness (NVH) performance of the car and reduce the risk for squeak & rattle throughout the car. Therefore, a requirement that is limiting the deformation of the car body would be desirable. However, a too stiff car body construction could have a negative impact on the crashworthiness of the car. The deformation of the car body construction that is needed to absorb energy in a crash situation may be limited in a construction with a high stiffness. There is thus a need in the design of a car construction to optimize the construction based on different parameters, such as the stiffness of different parts of the car body.
One common way to determine the stiffness of the car body construction is to use a static torsional stiffness calculation model or to simulate the first torsional mode of a non-trimmed car body only, and through these models the stiffness of a complex body structure is in each case reflected by a single value only. The local stiffness in the different areas of the car, like for example the front part, the rear part, the lower part of the body and the upper part of the body are not specifically considered which makes the use of a static or dynamic torsional stiffness calculation model unreliable.
There is thus a need for an improved way of optimizing the construction of a car body through computer simulations in computer models, where the structural behaviour of the car is reproduced through mathematical modelling of the car structure.

Method for optimizing the construction of a car body

NINGBO GEELY AUTOMOBILE RESEARCH & DEVELOPMENT CO.


A hierarchy is defined that includes encryption keys associated with different first and second levels of the hierarchy, where the second level includes fewer of the encryption keys than the first level. The encryption keys of the first level secure a plurality of data objects. The encryption keys of the first level are grouped into key groups that respectively include one or more of the encryption keys of the first level. The one or more of the encryption keys of the first level included in each of the key groups are secured with a respective one of the encryption keys of the second level.

Cloud computing includes the provision of computational resources on demand via a computer network. The resources can be embodied as various infrastructure services (e.g. compute, storage, etc.) as well as applications, databases, file services, email, etc. In the traditional model of computing, both data and software are typically fully contained on the user's computer; in cloud computing, the user's computer may contain little software or data (perhaps an operating system and/or web browser), and may serve as little more than a display terminal for processes occurring on a network of external computers. A cloud computing service (or an aggregation of multiple cloud resources) may be generally referred to as the "Cloud".
Cloud storage may include a model of networked computer data storage where data is stored on multiple virtual servers, rather than being hosted on dedicated servers. Hosting companies may operate large data centers, and customers who desire their data to be hosted may buy or lease storage capacity from them to meet storage needs. The data center operators, in the background, may virtualize the resources according to the requirements of the customer and expose them as virtual servers, which the customers can themselves manage. Physically, the resource may span across multiple servers.
The expected proliferation of cloud computing and data storage is a consideration in designing highly scalable systems with lesser total cost of ownership (TCO), and security may be a concern for organizations to start storing their data in the cloud. However, known encryption practices and algorithms may be less than ideal for use with a cloud-based system, in light of the size and rate of growth of the data. In particular, such encryption algorithms may be limited in the ability to scale dynamically for higher volumes of data, and thus, may not be feasible for use in a system built on a cloud infrastructure. Also, as such encryption practices may require frequent rotation of encryption keys, these approaches may result in service level agreements (SLAs) that grow along with data size.

Multi-level key hierarchy for securing cloud-based data sets


An improving structure of adjustable sliding device that can be stretched and shortened in its length, comprises a base, an upper frame, a middle frame and a sliding device. The base further comprises a flat horizontal unit and two side plates which are formed perpendicularly to the flat horizontal unit. One of side plates is a vertical plate formed perpendicularly on one side of the flat horizontal unit and another side plate is a L-shaped plate formed perpendicularly on another side of the flat horizontal unit. The sliding device comprises an upper unit and a bottom unit. A slot is formed at a middle part of the upper unit and the bottom unit, wherein a plurality of horizontal rotating units are located on the upper unit and the bottom unit so that the upper frame, the base and the middle frame can be correspondingly assembled together.

1. Field of Invention
The present invention relates generally to an improving structure of adjustable sliding device. More particularly, the present invention relates to an improving structure of adjustable sliding device that is made of materials with hardness resistance and consists simple assembled components, which reduce the manufacturing costs and simplify the assembled structure.
2. Description of the Related Art
The conventional sliding structure either is utilized in a keyboard sliding pad for a desk computer or in a drawer of a closet. The conventional structure is a sliding structure comprising a plurality of sliding devices with suitable length that wrapped up in several layers. A plurality of rotating wheels are located within the sliding devices, wherein those rotating wheels consisting low friction so that the sliding devices can slide against each other smoothly. The rotating wheels are utilized to vary positions of the sliding devices according to stretched or shorten lengths of the sliding structure. So that the sliding structure can be various its potions so that it can be utilized in a drawer or a keyboard sliding pad.
However, the conventional sliding structure consists other defects as followings:                1. the sliding devices are assembled by wrapped the sliding devices in several layers, as a result, the number of the sliding devices that can be assembled within the layers is restricted. As a matter of fact, the extended length of the sliding devices is limited. Further, due to the assembled method of the conventional sliding structure, the sliding device locating on the outer most layer would subject to the maximum of cross-sectional friction. Thus, the conventional sliding structure is not convenient to be utilized and utilization is restricted.        2. the sliding devices are assembled by wrapped the sliding devices in several layers. The inner most layer of the sliding device would subject to the minimum cross-sectional friction, as a result, ends of the sliding devices of the assembled structure lack of high hardness resistance. Therefore, the utilization of the conventional sliding structure is restricted.        3. due to the design of conventional sliding structure, the sliding devices of the conventional sliding structure are subjected to various different cross-sectional friction. As a result, the sliding devices cannot be interacted correspondingly or its assembled structure cannot be operated smoothly. Thus, the excess components of sliding devices assemblies resulting manufacturing cost and cost of the product management. Therefore, the present invention provides an improving adjustable sliding structure that is free of all the defects of the conventional structure.


An exercise device includes a frame, a pair of foot supports, and at least one four-bar linkage assembly coupled to the frame. The at least one linkage assembly is coupled to at least one of the foot supports. The four-bar linkage assembly directs the foot support in a generally elliptical motion while in use. The generally elliptical motion defines a major dimension extending at an angle from horizontal that is within the range of about thirty degrees (30°) to about seventy-five degrees (75°) and the major dimension having a length that is within the range of about ten inches to about eighteen inches.

The benefits of regular aerobic exercise have been well established and accepted. However, due to time constraints, inclement weather, and other reasons, many people are prevented from outdoor aerobic activities such as walking, jogging, running, and swimming. As a result, a variety of indoor exercise equipment has been developed for aerobic activity. It is generally desirable to exercise a large number of different muscles over a significantly large range of motion so as to provide for balanced physical development, to maximize muscle length and flexibility, and to achieve optimum levels of aerobic exercise. It is further advantageous for exercise equipment to provide smooth and natural motion, thus avoiding significant jarring and strain that can damage both muscles and joints.
While various exercise systems are known in the prior art, these systems suffer from a variety of shortcomings that limit their benefits and/or include unnecessary risks and undesirable features. For example, stationary bicycles are a popular exercise system in the prior art; however, these machines employ a sitting position that utilizes only a relatively small number of muscles, through a fairly limited range of motion. Cross-country skiing exercise devices are also utilized to simulate the gliding motion of cross-country skiing. While cross-country skiing devices exercise more muscles than stationary bicycles, the substantially flat shuffling foot motion provided by the ski devices limits the range of motion of some of the muscles being exercised. Treadmills are still a further type of exercise device in the prior art. Treadmills allow natural walking or jogging motions in a relatively limited area. A drawback of the treadmill, however, is that significant jarring of the hip, knee, ankle, and other joints of the body may occur through use of this device.
Another type of exercise device simulates stair climbing. Such devices can be composed of foot levers that are pivotally mounted to a frame at their forward ends and have foot-receiving pads at their rearward ends. The user pushes his/her feet down against the foot levers to simulate stair climbing. Resistance to the downward movement of the foot levers is provided by springs, fluid shock absorbers and/or other elements. These devices exercise more muscles than stationary bicycles; however, the rather limited range of up-and-down motion utilized does not necessarily exercise the user's leg muscles through a large range of motion. Further, the substantially vertical reciprocating motion of such stair climbing exercise machines can result in the application of undesirable impact loads to the hips, knees, and ankles of the user. In addition, the up and down reciprocating motion can induce a hyperextension of the knee. One attempt to reduce such loads in the prior art includes adding cushioning to the pedals of the stair climbing exercise machines.
Another drawback of existing stair climbing exercise machines is that such machines enable a user to take very small rapid steps during use. Such motion does not take the larger leg and gluteus muscles through large enough displacement to result in a significant cardio exercise. Rather, such smaller, faster stepping motions focus more on the generally undesirable anaerobic power system and not the desired aerobic endurance system.
A further limitation of a majority of exercise systems in the prior art lies in the limited types of motions that they can produce. A relatively new class of exercise devices is capable of producing generally elliptical motion that better simulates the natural stride of a person. Such exercise systems create elliptical motion, as referred to herein, when the path traveled by a user's feet while using the exercise system follows a generally ellipse-shaped path of travel. Elliptical motion is much more natural and analogous to running, jogging, and walking than the linear-type, back and forth motions produced by some prior art exercise equipment; however, devices that create an elliptical motion are generally limited to analogizing to running, jogging, and walking motions.
What would thus be desirable is an exercise device that provides for smooth natural action and exercises a relatively large number of muscles through a large range of motion. It would be further desirable for an exercise device to produce a user selectable raised, or highly angled, generally elliptical motion that simulates natural climbing or stepping motion. It would be further desirable for an exercise device to provide a relatively higher Relative Perceived Exertion (RPE) relative to the elliptical machines of the prior art. It would be further desirable for an exercise device to exercise muscles that are not exercised by elliptical machines of the prior art. It would also be advantageous to provide an exercise machine that allows for simulation of a stepping or climbing motion without allowing for the use of undesirable small rapid stepping movements.


Various techniques of forming isolation structures between adjacent diffusion regions are disclosed. In one technique, a thermally-grown oxide isolation structure is gouged out, and subsequent poly extending into the gouged out isolation structure is substantially level with the diffusion 58 region. In another technique, a trench (bathtub) is formed, lightly oxidized, overfilled with polysilicon or amorphous silicon, gouged out, and thermally treated to form a substantially planar isolation structure. In another technique, an isolation structure exhibiting bird's-heads and bird's-beaks is polished until the bird's-beaks are removed. Gouging of the diffusion area may be permitted to occur. A bipolar transistor structure can be formed in the gouged diffusion area, and will exhibit reduced spacing between the intrinsic base and collector without proportionally reduced spacing between the extrinsic base and the collector.

Electrical isolation of semiconductor integrated transistors from one another can be achieved by laterally (in the plane of the wafer) isolating "active" regions of the device with insulating material. Two techniques are common: 1) selectively oxidizing wafer silicon surrounding the active region (known as "LOCOS", or Local Oxidation of Silicon), or 2) depositing insulating material, such as silicon dioxide ("oxide") in a trench (or "bathtub") around the active region. The former, selectively oxidizing to form a field (isolation) oxide region, is discussed in the main hereinafter.
One known technique of forming isolation oxide around a diffusion area is Local Oxidation Of Silicon ("LOCOS"). In the typical LOCOS process, a mask (e.g., nitride) is applied to the wafer, a trench is etched, the wafer is heated, and oxide "grows" predominantly in the trench. In this manner, an isolation structure is created that extends both into the wafer and some height above the wafer. In a "semi-recessed" version of this process, the height of the oxide structure above wafer level is approximately 45% of the total thickness of the as-grown oxide. In a "fully-sunk" ("fully-recessed") version of this process, the isolation structure can grow to a height of about 25-45% of the total oxide thickness, above wafer level. No matter how it is grown, the resulting oxide structure has a prominent portion above wafer level, resulting in an irregular top surface wafer topography. It is known to polish the wafer to remove the prominent portion of the isolation structure, but this usually involves steps ensuring that the isolation oxide structure does not become gouged out below wafer level, especially if a polish stop (e.g., nitride cap or mask layer) is employed to protect the diffusion region.
LOCOS is described in U.S. Pat. Nos. 4,897,364, 4,903,109 and 4,927,780, incorporated by reference herein.
Subsequent deposition of polysilicon ("poly"), which may typically follow the LOCOS process, usually places poly on top of the diffusion areas and on top of the LOCOS oxide. The top of the poly is typically 3000-4000.ANG. above the level of the diffusion area, simply because of the normal poly thickness. The poly that is located above the LOCOS region is another 4000-5000.ANG. above the level of the top of the poly over the diffusion region, simply because of the prominence (not polished) of the oxide in the LOCOS area. For this reason, the difference in height between the diffusion area and the poly over the LOCOS area can be as great as 8000.ANG.. This large difference in height is very undesirable, but is the natural consequence of the process as currently implemented.
FIG. 1 graphically illustrates the situation, and shows a semiconductor device 110 having a silicon wafer 112, a diffusion area (active region) 114 and field oxide areas (e.g., LOCOS) 116 adjacent the diffusion region 114. Inasmuch as the field oxide areas 116 are thermally formed, they exhibit a raised topography at the wafer surface. U.S. Pat. Nos. 4,892,845, 4,897,150, 4,918,510, 4,935,378, 4,935,804, 4,954,214, 4,954,459 and 4,966,861 illustrate structures of this general type, and are incorporated by reference herein.
A polysilicon layer 118 is deposited over the diffusion area 114, and extends from the diffusion region 114 to at least partially over the adjacent field oxide areas 116. The polysilicon layer is shown segmented, discontinuous at the center of the diffusion region 114, but is can be contiguous and extend entirely over the diffusion region. An overlying, generally-conformal insulating oxide layer 120 is deposited over the wafer. Vias 122a and 122b are formed through the insulating oxide 120--one via 122a for making contact with the diffusion area 114 at wafer level, and another via 122b for making contact with the poly 118 over the field oxide area 116. Evidently, the vias 122a and 122b are of unequal depth (even if the insulating layer 120 is subsequently planarized), which causes problems with subsequent via-filling. As mentioned hereinabove, the via 122b to the poly over the field oxide area is shallower by the height (above wafer level) of the field oxide area plus the poly thickness. The problems associated with filling vias of unequal depth are discussed described in commonly-owned U.S. Pat. Nos. 4,708,770 and 4,879,257, incorporated by reference herein.
Another problem is that the top surface of the insulating layer 120 is highly irregular (not smooth and non-planar). This irregular top surface topography will propagate through subsequent depositions, if left unchecked, making subsequent processing steps more complicated (e.g., requiring a planarization step).
As mentioned above, planarizing the isolation and diffusion regions (e.g., by polishing back the oxide prominence) is complicated by the different hardnesses of the isolation oxide and the (essentially silicon) diffusion region. The diffusion region, essentially native silicon, is softer than oxide (SiO.sub.2), but a polishing stop can be incorporated over the diffusion region. In either case, material hardness differences are the problem.
Consider, for example, the case of a "fully-sunken" LOCOS oxide structure exhibiting a "Bird's-Beak", as shown in FIG. 4A. In the typical implementation of polishing the LOCOS structure (to remove the "Bird's-Head"), the polishing is stopped before the Bird's Beak is totally removed. This is objectionable, because the Bird's-Beak extends laterally into the diffusion area in the polished structure, as shown in FIG. 4B. The bird's-beak is one of the most objectionable aspects of conventional dielectric isolation schemes, and a polish technique that does not effectively remove this structure, without resorting to deposited dielectric films, is lacking in utility.

Techniques for forming isolation structures


A transfer mechanism includes a main rotating member, a first driving unit, a support mechanism, a holding unit, a second driving unit and control unit and transfers a sheet member from a pickup position to a delivery position. The support mechanism is connected to the main rotating member and the holding unit. The control unit controls the second driving unit in such a manner that, when the sheet member is placed in at least one of the pickup position and the delivery position, a position of the holding unit is not substantially changed in a state where the main rotating member rotates around the rotational axis in the first rotation direction.

In general bag supply apparatuses, a swing arm as illustrated in FIG. 1 of Japanese patent application publication No. 4-6021 is often used. According to this type of device, a swing arm reciprocates between the position where a bag is to be taken out from a magazine (reservoir) and the position where a bag is delivered to a packaging machine side device (for example, a gripper or the like), so that pickup and delivery of a bag are carried out in a continuous manner.
Further, in the apparatus disclosed in Japanese patent application publication No. 2001-341703, a rotating member is used, and a suction holding member for picking up a bag is attached around the rotating member. When the rotating member rotates at a constant speed and the suction holding member is disposed at a pickup position above the magazine, the suction holding member is regulated by swinging the suction holding member in a direction opposite to the rotation direction of the rotating member.

Transfer mechanism and bag supply apparatus


A single stage flow modulator for performing comprehensive chromatography comprises a first chromatographic column, a valve fluidically coupled to at least two fluid conduits, wherein when in a first position, the valve directs a control flow to direct an output of the first chromatographic column to a first detector, and wherein when in a second position, the valve directs a control flow to direct a portion of an output of the first chromatographic column to a second chromatographic column, wherein the portion of the output of the first chromatographic column directed to the second chromatographic column is continuously modulated throughout a sample run.

Gas chromatography (GC) is generally performed using one or more columns to separate a sample of material into its constituent components. In conventional comprehensive two-dimensional gas chromatography, referred to as comprehensive GC-GC or GCxGC, two columns of different selectivity are linearly coupled to provide enhanced separation of complex chemical mixtures that cannot be realized by either column alone. Examples of complex matrices include fuels (e.g., gasoline, jet fuel, kerosene, diesel fuel), oils (e.g., crude oil, lubricating oils), extracts from environmental samples (e.g., air, water, and soil), food extracts and clinical samples (e.g., blood, plasma, urine, tissue extracts).
In prior GCxGC analysis systems, a one-stage or a two-stage modulator located between the primary column and the secondary column transfers the effluent from the first column to the second column. In a two-stage modulator the first stage of the modulator collects the effluent from the primary column and the second stage of the modulator transfers, or injects the collected effluent to the secondary column. Two stage modulators are typically designed as thermal or flow-switching modulators.
A thermal two-stage modulator typically uses a cryogenic material to cool the effluent in the first stage prior to transfer to the second stage. The second stage of the modulator heats the effluent prior to injecting the effluent into the secondary column. Cooling the effluent concentrates the chromatographic peaks, which improves the analysis in the secondary column. Unfortunately, thermal two-stage modulators are complicated to design and manufacture, and require the use of a cryogenic material to cool the effluent from the primary column.
A flow-switching modulator is typically less complex than a thermal two-stage modulator and does not require a cryogenic material. However, a flow-switching two-stage modulator requires the use of complex fluid couplings that must be carefully and precisely dimensioned and scaled. These requirements lead to limitations of the GC column dimensions and require reconfiguring the components and couplings of the modulator when changing columns and/or operating conditions. Flow switching also requires higher than optimum flow rates in the secondary column(s) and places limitations on the flow ratio between the primary column and the secondary column.
In a prior one-stage modulator, a fast acting diaphragm valve transfers the effluent from the primary column to the secondary column. While a diaphragm valve modulator is relatively simple to fabricate and operate, it suffers from other limitations. For example, a diaphragm valve modulator cannot be operated at temperatures exceeding approximately 250 degrees Celsius (C). This restricts the use of such a modulator to lower boiling samples. Further, mechanical valves, such as diaphragm valves, are subject to transient, temporary pressure and flow fluctuations immediately after actuation. Depending on the dimensions of the fluid couplings in the system, this can interfere with the precise transfer of the sample from the primary column to the secondary column. Further, in such a diaphragm valve, the sample material passes through the valve body, where the sample may come into contact with active or adsorptive sites from the valve material or material used to construct the valve. These sites may contaminate the sample and skew the analysis.
Therefore, it would be desirable to have the ability to efficiently perform comprehensive two-dimensional GC analysis.

Single stage flow modulator for performing comprehensive chromatography


A semiconductor wafer heat treatment apparatus and method, which can carry out a heat treatment to suppress variations in line widths within a surface on a semiconductor wafer and the like, includes: a heating plate for heating a semiconductor wafer to a predetermined temperature; a temperature measuring unit for measuring temperatures when heating the semiconductor wafer or a semiconductor wafer equivalent placed on the heating plate, at portions divided into a plurality of regions; and a controller for controlling the temperatures of the semiconductor wafer, and based on the temperature measurement result of the temperature measuring unit, the controller controls the temperature in heating the semiconductor wafer, for each of the plurality of regions. In cooling after the heating process, based on the temperature measurement result, the controller controls the temperature in cooling the semiconductor wafer, for each of the plurality of regions.

1. Field of the Invention
The present invention relates to a heat treatment apparatus and a heat treatment method of a semiconductor wafer, and relates more particularly to a heat treatment apparatus and a heat treatment method of a semiconductor wafer that is used in a manufacturing step of a semiconductor device, such as a PEB (Post Exposure Bake) processing step of a resist film of a chemically amplified type and the like.
2. Description of Related Art
In the manufacturing step of a semiconductor device, the photolithography technique for forming a pattern of photo-resist film has become more and more important in order to attain the further hyperfine structure of the semiconductor device.
For example, in a case of a resist film of the chemically amplified type, the heat treatment referred to as the PEB process is carried out before a developing process is carried out after a process for exposing the resist film. This is carried out in order that acid generated in an exposed region is amplified by the heat treatment, thereby obtaining an exposed line width.
FIG. 5 is a diagrammatically configurative view showing a heat treatment apparatus for carrying out the heat treatment such as the above-mentioned PEB process and the like.
A heating plate 100 for heating the semiconductor wafer, for example, on which the resist film of the chemically amplified type is formed and which is exposed to a predetermined pattern, to a predetermined temperature contains therein heaters 101 divided into, for example, seven regions.
A power supply switch 102 through which a temperature can be set is connected to the respective heaters 101. By turning on the switch, the heating plate 100 is heated to a preset temperature (for example, 130° C.).
In order to use the above-mentioned heat treatment apparatus and perform the PEB process on the semiconductor wafer, for example, at the power supply switch 102, the temperature is set at 130° C., and the semiconductor wafer after the exposure is placed on the heating plate 100 heated to the set temperature after the switch is turned on. Then, the heat treatment of a predetermined time period is performed on the semiconductor wafer. The heat treatment period may be, for example, 90 seconds.
Then, after the elapse of this heat treatment period, the semiconductor wafer is cooled for 60 to 90 seconds and cooled to a normal temperature of about 23° C. (refer to a patent document 1) following hereto. At this time, the semiconductor wafer is cooled by moving the semiconductor wafer from the heating plate 100 onto a cooling plate (not shown) that contains therein a water cooled tube.
[Patent Document 1]
Japanese Patent Application Laid Open (JP-A 2001-23893) (Especially, Paragraph Number 0033)
However, when the above-mentioned heat treatment apparatus is used to carry out the PEB process, a tolerance of variation in a line width is previously large, with regard to the line width of the resist film generated as the result of the execution of the PEB process. Thus, the variation in the temperature of the PEB process is not especially considered, which leads to a problem in controllability of the line width within the surface on the semiconductor wafer. In particular, the problem that the above-mentioned conventional heat treatment apparatus can not suppress the variation in the line width becomes severe toward the hyperfine structure on and after the 0.1 μm-generation.
For example, FIG. 6 is a profile of the temperature variations in the PEB process. The vertical axis indicates the values of the temperature variations, and the horizontal axis indicates the process time.
Temperature variations in an initial period of the PEB process between 0 and about 20 seconds are temperature variations when it is heated to a predetermined temperature, and temperature variations on and after 90 seconds are temperature variations when it is cooled from the temperature of the PEB process.
FIGS. 7A to 7C are views in which the temperatures in the PEB process measured at the respective positions of the semiconductor wafer are plotted. FIG. 7A shows a period between 0 and about 20 seconds during which the temperature rises, and FIG. 7B shows a period between about 20 and 90 seconds during which the temperature is stable in the predetermined PEB processing temperatures, and FIG. 7C shows a period of cooling down on and after 90 seconds, respectively.
They are measured from the center of the semiconductor wafer to the outer circumference thereof, and the respective measured points are all plotted. Thus, the profile has the width corresponding to the variation in the temperatures.
For example, the width of the temperature variation in the temperature rising period is 21.2° C., the width of the temperature variation in the over-shooting region immediately after the temperature has risen is 1.56° C., and the width of the temperature variation in the stable temperature period at the end point (90 seconds) in the PEB process is 0.2° C. Also, the width of the temperature variation in the cooling period is greater than that of the temperature rising period.
For example, in the temperature rising period of FIG. 7A, the outer circumference is higher in temperature than the center of the semiconductor wafer, and in the cooling period of FIG. 7C, the center is higher in temperature than the outer circumference of the semiconductor wafer, as a tendency thereof.
As mentioned above, it is understood that the PEB process has the variation in the processing temperatures within the surface on the semiconductor wafer and that the variation is greater in particular in the temperature rising period and the cooling period of the process.
FIG. 8A is a graph showing a line width when the PEB processing temperature is the highest temperature in an isolated pattern having a line width of 70 nm and a line width (CD (Critical Dimension) value) when it is the lowest temperature, which are calculated from a simulation. Under a proper dose amount, the difference between the line widths reaches 6.8 nm.
Also, FIG. 8B is a graph showing a line width when the PEB processing temperature is the highest temperature in a pattern of a line space of a line width of 90 nm and a line width (CD value) when it is the lowest temperature, which are calculated from the simulation. Under the proper dose amount, the difference between the line widths reaches 9.9 nm.
As mentioned above, in the PEB process based on a conventional method, the variation in the PEB processing temperatures within the surface on the semiconductor wafer is severe. Thus, it is desired to carry out the heat treatment while suppressing the variation.
Also, suppressing of the variation is required not only in the PEB process. For example, even for another heat treatment to be performed on the resist film, such as a pre-baking process for evaporating solvent in the resist film after the formation of the resist film and the like, or the heat treatment using a heating plate which is performed on the semiconductor wafer, it is similarly desired to carry out the heat treatment while suppressing the variation in them within the surface on the semiconductor wafer.
The present invention is accomplished in view of the above-mentioned problems. Accordingly, there has been a need to provide a heat treatment apparatus and a heat treatment method of a semiconductor wafer, which can carry out a heat treatment so as to suppress variations in line widths within a surface on a semiconductor wafer and the like.

Heat treatment apparatus and method of semiconductor wafer


The present invention relates in general to implantable compositions, and method for preparing same, containing a calcium salt-containing component, optionally demineralized bone, a plurality of discrete fibers, optionally a flow additive, and optionally continuous reinforcing fibers or an array of organized fibers in the form of mesh. Advantageously, the discrete fibers have a specific aspect ratio (length/diameter) from about 50:1 to about 1000:1. The addition of a small amount of discrete fibers and/or the continuous reinforcing fibers or fiber mesh can cause drastic increases in certain mechanical properties including flexural strength, flexural toughness, and/or screw pullout strength.

One particular area of interest with regard to bone cements or calcium phosphate compositions focuses on the addition of viscosity-modifying agents to make the compositions liquid-like or flowable. Flowability is a consideration especially when the bone cements or calcium phosphate compositions are used as an aid to filling voids in bone, to treating bone defects, or to augment the stability of other implantable devices in vivo. Without adequate flowability, bone cements typically are molded by hand to fit a particular bone void or defect. However, non-flowable cements cannot be used when it is necessary or desired to fill a hole, void, or defect in a bone larger than the area from which a surgeon can access the hole, void, or defect. In addition, non-flowable cements cannot be easily created in situ to fill a particular hole, void, or defect, but must be prefabricated. If the molded bone cement does not fit or cannot be forced to do so by external pressure of a surgeon once relatively in place, it does not create a sufficient implantable construct to facilitate healing and/or bone regrowth.
Another particular area of interest with regard to bone cements or calcium phosphate compositions focuses on reinforcing its bone cements with fibers, usually relatively long fibers, or fiber meshes. Much of the prior art in implantable composite materials focuses on a strong and resilient matrix impregnated with reinforcing filler particles, whiskers, or meshes. Often the ceramic bone cements are strong enough but are brittle and not sufficiently resistant to catastrophic failure (e.g., through cracking) to function as the matrix material. Polymers, usually resorbable, generally perform that reinforcing function. Resorbable implant materials, such as polylactides and polyglycolides, as compared to traditional, non-resorbable metal or composite materials, for example, have the advantage of being biocompatible, of being biodegradable after a period of time, and of not requiring removal, e.g., in bone fixation or repair applications. These qualities are especially important for implant matrices that are designed to be temporary place fillers (and in some cases, stabilizing components) for healing and/or regrowth, e.g., of bone voids or defects.
In addition, with most composites, the reinforcing material is different than the matrix material, in the hopes that the most beneficial set of properties can be amplified from each component, while the less desirable characteristics of each component are preferably reduced. As a result, the fibers used are generally ceramic in nature or of a (co)polymer composition of different chemistry. However, there is little prior art addressing implantable materials containing resorbable or biodegradable fibers in a ceramic matrix. One example of fiber-reinforced ceramic matrices can be found in a Xu et al. article entitled "Reinforcement of a Self-Setting Calcium Phosphate Cement with Different Fibers," in J. Biomed. Mater. Res., 2000, vol. 52, pp. 107-114 ("the Xu article").
The Xu Article discloses water-based calcium phosphate cements that were reinforced with fibers of aramid (KEVLAR), carbon, E-glass, and POLYGLACTIN. It discloses fiber lengths of 3 mm, 8 mm, 25 mm, 75 mm, and 200 mm, with fiber volume fraction loadings of 1.9%-9.5% in CPC powder, which contains a mixture of tetracalcium phosphate and anhydrous dicalcium phosphate, which react in an aqueous environment to form hydroxyapatite. The POLYGLACTIN fibers in the Xu article are 90/10 copolymers of glycolide/lactide and had a measured diameter of about 200 microns.
It is, therefore, desirable to obtain a fiber-reinforced and/or flowable calcium salt-containing composite material for implantation that exhibits improvements in key mechanical properties as a result of a specific combination of properties of the ingredients, particularly fiber length, fiber diameter or width, fiber aspect ratio, flow additive incorporation, continuous fiber/stent/mesh incorporation, or the like, or a combination of multiple variables.

Bone cement compositions having fiber-reinforcement and/or increased flowability


A balloon weight and ribbon assembly includes a spool having a length of ribbon wound thereabout, the ribbon being secured at one end to the spool and at the other end to a breakaway tab which initially comprises a part and parcel of the spool. A dimple in the tab accommodates receipt of a double knot at one end of the ribbon, while a slot in the spool accommodates receipt of a double knot of the ribbon at the opposite end. A piece of double backed adhesive tape is provided on the breakaway tab to allow for securement of the tab to the neck or tail of an inflated balloon.

The use of balloons as a "favor" or at parties, celebrations, and other events is now extremely well known. Millions of balloons are so used each year. Generally such balloons are attached to either a stick and a cup or a ribbon so that they can be restrained by the user. Additionally, the balloons are typically filled with helium gas to provide a "lift", allowing them to stay aloft at the end of the tethered ribbon or stick. Of particular concern of many localities is assurances that such inflated balloons are restrained from free flight into electrical power lines and transformers as well as the atmosphere. Particular concern exists with respect to Mylar or metallic balloons, which pose a threat to electrical transmission wires, and which are not biodegradable. Many municipalities and other governmental agencies consider such balloons to pose at least some threat to the environment. Accordingly, many governmental agencies require that such metallic balloons be tethered to a weight, with the weight being sufficient to prevent the balloon from free flight into the atmosphere.
It has previously been known to employ a weight at the end of a ribbon tethered to a balloon, to restrain the balloon from free flight. Most often, there is a necessity for the retail clerk to cut a length of ribbon, attach one end of it to the weight, and to knot or otherwise attach the opposite end to the balloon. The operation is extremely time consuming, and occasionally ineffective. To hasten the operation by the retail clerk, some balloon weights have been provided with a pre-attached length of ribbon, such that the retail clerk need only attach the opposite end to the balloon. Again, such attachment is typically made by tieing and knotting. Moreover, in the prior art the actual securement and winding of the ribbon to the weight is quite labor intensive, with the operation not being conducive to automation.


An overcharge preventing device for a high energy density battery such as a lithium ion battery comprises a voltage sensor means for sensing a voltage of a battery that is being charged, a current feeder means for feeding a current to a heat generating means when a voltage sensed by said voltage sensor means exceeds a preset voltage, and a repeatedly usable thermal actuator means that is thermally coupled to said heat generation means incorporated in a charging current circuit. Upon overcharging of the battery, the thermal actuator means is actuated by heat generated from the heat generating means to interrupt feeding of a charging current to the battery. Upon elimination of an overcharged state, the charging current circuit in the thermal actuator means is resumed to recharge the battery.

The present invention relates generally to an overcharge preventing device for secondary batteries, and more particularly to an overcharge preventing device for a specific secondary battery of high energy density, e.g., a lithium ion battery using a lithium ion doping or de-doping material as an active negative electrode material.
A lithium ion battery using a lithium ion doping or de-doping carbonaceous material can output high voltage and has high energy density albeit being light in weight, and so is now widely used on portable equipment. Although secondary batteries may be used over and over by charging, yet their performance may become worse upon charging. Especially in the case of a lithium ion battery, various safety devices are incorporated therein so as to prevent overcharging which may otherwise cause an electrolyte leakage due to the actuation of a pressure valve due to gas generation, resulting in thermal runaway, and fuming.
The lithium ion battery is charged in a constant voltage, constant current charging mode to prevent overcharging. Insofar as the charging voltage of a charger is kept constant, overcharging is unlikely to occur.
However, this is not true of the case where the charger fails, or the lithium battery is charged without recourse to a dedicated charger, e.g., using a charger of high charging voltage; the lithium ion battery is overcharged.
To avoid this problem, the inventors have filed Japanese Patent Application No. 286757/1986 to come up with a secondary battery protector comprising a battery voltage sensor and a switch for cutting off a charging current by the voltage sensor, so that upon detection of overcharge, the charging current is cut off to interrupt charging.
The present invention is directed to a protector for a secondary battery having high energy density such as a lithium ion battery using a lithium ion doping or de-doping carbonaceous material as an active negative electrode material. A particular object of the invention is to provide a secondary battery protector which, upon overcharging, is actuated to interrupt charging and, upon elimination of the overcharged state, is actuated to recharge the battery.


A method for transmitting electronic information items over a network includes registering a first user via a first client machine and a second user via a second client machine with a discovery machine wherein the first client machine, the second client machine and the discovery machine are coupled to a network. A communication is initiated from the second user via the second client machine to the first user via the client machine through the discovery machine. It is determined that the first user will accept the communication and a direct link is established between the first client machine and the second client machine and the communication is delivered.

Over the last five to ten years, the Internet and related utilization of email has revolutionized the way businesses, entities and individuals complete transactions and communicate. Individuals can now buy goods and services and pay bills with a few clicks of a mouse. Businesses have innovated new methods of operations that streamline costs and open new channels of revenue all via the Internet. Additionally, the widespread use of instant messaging has demonstrated that the Internet is a preferred communication vehicle.
While the Internet has certainly increased a person's choice of how to interact with others, the new choices are not without disadvantages. Email, for example, is still primarily based on a standard developed in the late 1980's and does not take into account contemporary concerns for security. Security concerns encompass, but are not limited, to transfer of computer viruses, unsolicited email (spam) and ID authentication (how does a person really know an email came from the identified sender?). Additionally, once a person sends an email message, they cannot control how the information is further propagated.
Instant messaging helps to solve the discontinuity of conversations formerly conducted via email. But, if an online conversation is unexpectedly terminated, the conversation is not easily re-started since no record was kept Instant messaging also has the ID authentication issue, which can discourage its use for some individuals.
The world of e-commerce also has its drawbacks. Servers can easily be overloaded at peak holiday shopping periods. Smaller businesses often cannot afford the initial investment to create an Internet presence. Local merchants are resentful that local consumers buy goods, offered locally, from competitors in other cities. Additionally, services that require an interaction between a customer and vendor have not been adequately implemented onto the World Wide Web.
Although secure communications schemes have been developed based on the use of public/private key pairs, such schemes are not without their disadvantages. For persons to be able to communicate with an individual, that individual's public key must be available for others to use. Finding the public key of an individual to communicate with them is a hassle that inhibits the use of secure communication and goes a long way toward explaining why such schemes have not become widely adopted. Another problem arises is a user loses their private key. In that unfortunate (but all too common) circumstance, the user must acquire a new public/private key pair. This is an additional layer of hassle, particularly for all their correspondents who must now go fetch that user's new public key.
In modern society the concept of personal identity has become blurred to mean something other than what it should. It has become common to confuse the credentials that have been given to a person as being that person's identity. Confusing credentials with identity has the disadvantage that it does not establish a relationship. A person's identity should be based on their relationships with other persons, not tokens that represent credentials.
Accordingly, what is needed is a method and system to improve communication over a network or Internet, increase security and foster the growth of business of all sizes locally and in other geographic areas. What is also needed is a way to provide secure communications that does not rely on the use of public keys that are inconvenient to find. What is also needed is a way to enforce the contextual relationship that is implied by identity.

Managed information transmission of electronic items in a network environment