A signal traffic routing method for a signaling network, for example, a No. 7 signaling network, includes analyzing a signal message when a message transfer unit receives a signal message and determining a route of a final destination of the received signal message, selecting a link for transferring a signal message at a link set of the thusly determined route based on a link determination history and link determination data, updating the link determination history and link determination data based on the selected link, and transferring a signal message through the selected link, thereby enhancing an availability and performance of the signaling network by distributing a signal traffic to all available link of a link set. The message transfer unit preferably comprises a message discrimination unit, a message distribution unit and a message routing unit that distributes a signal traffic to an available route at each signal transfer point.

1. Field of the Invention
The invention relates to a signal traffic routing method for a signaling network, and in particular to a signal traffic routing method for a No. 7 signaling network.
2. Background of the Related Art
Generally, a No. 7 signaling system is a signaling method which is recommended by the ITU in a communication standard Q.70X. Namely, the above-described No. 7 signaling system is a common channel signaling (CCS) method which fully separates a communication route and a signaling route. The CSS method thereby transmits and receives a plurality of voice signals through an independent channel differently from a conventional method in which the communication route and signaling route are co-used.
At a signal transfer point of a No. 7 signaling network, a signal traffic is distributed to available routes based on a certain load sharing method and is distributed to available links of a link set of a corresponding route. The above-described signal traffic is routed based on a 4-bit (0000˜1111) SLS (Signaling Link Selection) field, a 14-bit originating point code, and a destination point code.
In a method for distributing a signal traffic to a link of the link set, the signal traffic is distributed based on a SLS value in a routing label of a signal message with respect to each available link. At this time, a SLS value which is available for the signal message is 16 of 4-bit (0000˜111111) in maximum, and each link transfers a signal traffic having a certain SLS.
FIG. 1 schematically illustrates a No. 7 signaling network. As shown therein, there are six signal transfer points from a first signal point A to a sixth signal point F. Each signal transfer point corresponds to a switch or node.
FIG. 2 schematically illustrates that the standard routing label message has a length of 32 bits.
As shown in FIG. 2, the Destination Point Code (DPC) indicates the destination point of the message. The Origination point code (OPC) indicates the originating point of the message. The coding of these codes is in pure binary. Within each field, the least significant bit occupies the first position and is transmitted first. And the signaling link selection (SLS) filed is used, where appropriate, in performing load sharing.
Assuming that all link sets of the No. 7 signaling network are available, and at least two available links are provided from a certain signal point to the next signal point for a transfer of a signal message in the No. 7 signaling network of FIG. 1, the operation of the system is performed as follows.
First, a link setting method of a conventional signaling network will be explained. When a signal traffic is generated between the first signal point A to the sixth signal point F of a corresponding No. 7 signaling network, a traffic routing operation is performed in a sequence that a certain routine is first determined, and a link for an actual transmission of a signal message is determined.
In the normal state, the traffic routing operation is performed based on four signal routes: A->B->D->F, A->B->E->F, A->C->D->F and A->C->E->F which are the optimum signal routes from a signal point A to a signal point F. The routes which are formed through more than four signal transfer points are not obtained in the normal state.
As shown in FIG. 1, the routing of the signal traffic is determined from the first signal point A to the sixth signal point F. There are two available links at the link set from the first signal point to a neighboring signal point. The first link is set so that the SLS transfers a signal message of 0000˜0111, and the second link is set so that the SLS transfers a signal message of 1000˜1111.
When a traffic in which the SLS value is 0000˜0111 is transferred to the signal point A of the assumed No. 7 signaling network, a signal message routing is performed only for the first link based on a load distribution of the link set, and the signal message routing is not actually performed for the second link. In the related art, since the SLS of the signal message is previously defined and is used, even when more than two links are available in the link set, a signal traffic is concentrated on a certain link (for example, the first link), the availability and reliability of the link are significantly decreased in the No. 7 signaling network. The above references are incorporated by reference herein where appropriate for appropriate teachings of additional or alternative details, features and/or technical background.

Signal traffic routing method for a signaling network


A Stirling refrigeration system (1) comprises two Stirling refrigeration units (4a, 4b) incorporating respective working gas end (WGE) heat exchangers (35a, 35b) and radiators (65a, 65b). Cooling water circulates through a first radiator (65a), a first WGE heat exchanger (35a), a second radiator (65a), a second WGE heat exchanger (35a), and a cooling-water pump (67) in sequence. To facilitate deaeration of the cooling-water circuit at time of feeding cooling water, An air release duct (85) is provided at the maximal point of the cooling-water circuit. An air release valve (79) is formed in the open end of the air release duct (85) so that the air remaining in the cooling-water circuit can be easily released. The Stirling refrigeration system is compact in dimensions.

A Stirling refrigeration unit has been known as a compact refrigeration unit operable at fairly low temperatures with a high performance coefficient and a high refrigeration efficiency. In addition, it has an advantage that it is operable with an environmentally friendly Freon substitute.
For this reason, a Stirling cooling unit has been considered as a versatile refrigeration unit for use in, for example, refrigerators, freezers, throw-in type air conditioners for business and domestic use, and low-temperature fluid circulation systems, constant low-temperature boxes, thermostatic ovens, heat-shock test equipments, freeze-drying machines, temperature-characteristics test equipments, blood and cell preservation apparatuses, coolers, and various kinds of measuring apparatuses.
FIG. 1 is a schematic circuit diagram of a Stirling refrigeration system 100. As shown in FIG. 1, the Stirling refrigeration system 100 comprises Stirling refrigeration unit 110, a water-cooling unit 120, and a heat transport unit 130. Cold-refrigerant is provided to a refrigeration apparatus 101.
In the example shown in FIG. 1, in order to attain high refrigeration performance, the Stirling refrigeration system 100 is provided with two Stirling refrigeration units 110 connected in series, along with two water-cooling units 120.
Each of the Stirling refrigeration units 110 comprises a compression unit 114, an expansion unit 118, and a heat accumulation unit 119, as shown in FIG. 2. The compression unit 114 has a compression cylinder 112 and a compression piston 111 for compressing a working gas contained in the compression space 113 defined by the compression cylinder 112 and the piston 111. The working gas is compressed by the piston 111. The expansion unit 118 allows the working gas in an expansion space 117 defined by an expansion piston 115 and an expansion cylinder 116 to expand as the expansion piston 115 reciprocates in the expansion cylinder 116. A heat accumulation unit 119 is provided in a gas passage S communicating with the compression space 113 and the expansion space 117.
A motor 109 is provided to drive a crank mechanism 108 for converting the rotational motion of the motor 109 to reciprocal motions of the compression piston 111 and the expansion piston 115, thereby compressing and expanding the working gas.
The compressed working gas passes through the gas passage S to the heat accumulation unit 119, where the gas is cooled, and then to the expansion space 117 where the gas expands to lower its temperature.
A cold head 131 provided in the header of the expansion unit 118 is cooled by the cold gas. Thus, a secondary refrigerant circulating through the cold head 131 is cooled.
After expanded in the expansion unit 118, the working gas returns to the compression unit 114 through the heat accumulation unit 119, completing the Stirling cycle.
It is noted that the compression piston 111 leads the expansion piston 115 in phase by about 90 degrees.
The heat transport unit 130 shown in FIG. 1 has a secondary refrigerant pump 132, a tank 133, a liquid-gas separator 134, and a pressure regulation bellows 135. The secondary refrigerant pump 132 pressurizes the secondary refrigerant, causing the secondary refrigerant to circulate through a secondary refrigerant circuit connecting the cold head 131 with the refrigeration apparatus 101. The tank 133 adjusts the flow of the secondary refrigerant that circulates through the secondary refrigerant circuit. The liquid-gas separator 134 receives the secondary refrigerant returning from the refrigeration apparatus 101 and separates the liquid component and the gaseous component of the refrigerant (the separation will be referred to gas-liquid separation). The pressure regulation bellows 135 absorbs pressure fluctuations occurring in the secondary refrigerant circuit.
The liquid-gas separator 134 has a gas-liquid separation tube 136 and a gas recovery tube 137. The gas-liquid separation tube 136 has a shape of a generally inverted U-shape and is connected to a tube for returning the secondary refrigerant from the refrigeration apparatus 101. The gas recovery tube 137 has one end connected to a top section of the gas-liquid separation tube 136, and another end connected to the upper end of the tank 133 to communicate with the free space of the tank 133.
The gas-liquid separation is performed in the gas-liquid separation tube 136 by causing only the gaseous component of the refrigerant to flow upward in the tube 136 when the secondary refrigerant flow upward in the gas-liquid separation tube 136 after it has returned from the refrigeration apparatus 101. The gaseous secondary refrigerant separated in the gas-liquid separation process is stored in the tank 133 via the gas recovery tube 137.
It will be understood that the secondary refrigerant undergoes a volumetric change due to a change in temperature as it refrigerates the refrigeration apparatus 101.
Since the heat transport unit 130 is a closed cycle, the pressure in the secondary refrigerant circuit will change if the secondary refrigerant changes its volume. The pressure regulation bellows 135 alleviates this pressure change.
Thus, the pressure regulation bellows 135 is adapted to increase its length as the pressure in the secondary refrigerant circuit increases, and decreases its length as the pressure decreases. Accordingly, the pressure inside the secondary refrigerant circuit is maintained at a substantially constant pressure.
It should be noted that the temperature of the working gas rises as it is compressed in the compression unit 114 and that the efficiency of cooling the working gas would undesirably decline if the hot working gas were directly led to the heat accumulation unit 119 before it is led to the expansion unit 118.
Hence, in order to circumvent this adverse effect, the working gas is cooled by the water-cooling unit 120 provided in the gas passage S between the compression unit 114 and the heat accumulation unit 119.
The water-cooling unit 120 includes a heat exchanger (not shown)for cooling the working gas (referred to as working gas end (WGE) heat exchanger), a radiator 121, and a cooling-water pump 122. The WGE heat exchanger effects heat exchange between the working gas and the cooling water. The radiator 121 effects heat exchange between the cooling water and the atmosphere. The cooling-water pump 122 circulates the cooling water through the WGE heat exchanger and the radiator 121.
The radiator 121 has a main body which includes a continuous fluid tube 125 having a multiplicity of parallel sections 123 and curved sections 124 connecting the parallel sections, and a plurality of fins 126 fitted on the parallel sections 123.
Fins 126 effect heat transfer between the cooling water flowing inside the fluid tube 125 and the atmosphere.
In this way the working gas is cooled by liberating its thermal energy from fins 126 to the atmosphere to enhance refrigeration efficiency.
As described above, this Stirling refrigeration system 100 has two Stirling refrigeration units 110 and two water-cooling units 120, to enhance its refrigeration power. For this reason, Stirling refrigeration system 100 described above also requires two cooling-water pumps 122. This arrangement, however, has a disadvantage that Stirling refrigeration system becomes large in dimensions and hence requires a large installation area.
Further, deaeration of the cooling-water circuit is difficult, though it is necessary when filling cooling water to the water-cooling unit 120. This can happen because the water-cooling unit 120 includes many vertical tubes and curved sections (convex sections) connecting the vertical tubes, which can easily trap air. Hence, a considerable amount of air remains in the tubes.
If the air continues to remain in the tubes, the cooling-water pump 122 will fail pumping the refrigerant, only "biting" the air (the failure of pumping referred to as "air-biting"), which can damage the shaft of the pump 122 and cause a loud noise.
Furthermore, since the fluid tube 125 of the radiator 121 has many parallel section 123 and curved sections 124, if the parallel sections 123 are inclined during the installation of the radiator 121, air will remain inside the parallel sections 123, which will degrade the heat radiation efficiency of the water-cooling radiator 121.

This patent is subject to a terminal disclaimer.


A hot water supply system according to the present invention includes: a hot water supply unit configured to supply hot water; an opening and closing valve configured to connect a hot water supply pipe, which is configured to supply hot water to a user from the hot water supply unit, and a cold water supply pipe, which is configured to supply cold water introduced from a cold water inflow pipe to the user, to allow water to flow or configured to disconnect the hot water supply pipe from the cold water supply pipe to block the water from flowing; a circulation pump configured to circulate water supplied from the hot water supply unit through the hot water supply pipe, the opening and closing valve, the cold water supply pipe, and the hot water supply unit; and a control unit configured to, when a water-preheating signal of the user is input, open the opening and closing valve, and operate the circulation pump to preheat water which is to be supplied to the user.

A hot water supply system is a system configured to heat cold water so that the water has a predetermined temperature in a short time and supply the hot water so that a user conveniently uses the hot water.
Such a hot water supply system burns oil or gas as a fuel using a burner, heats water using combustion heat generated during a combustion process, and provides the heated water to a user as necessary.
While the user opens a hot water valve to use hot water, and an operation for hot water is started, and hot water is heated to an optimal temperature, since cold water is discharged and thrown away through a hot water discharging port, waste of water energy occurs, the user has to wait until the hot water having the optimal temperature is supplied, and thus there is a problem in that hot water use is inconvenient.
To solve such a problem, "Method for controlling hot water pre-heating of hot water heater according to hot water using pattern of user" is disclosed in Korean Patent Publication No. 10-2013-0126299.
According to the related art of the method of preheating water, it is determined that water needs to be preheated according to a hot water using pattern of a user, and the water is preheated prior to being used by the user.
However, when the user preheats water prior to using the hot water, energy may be wasted.
FIG. 1 is a view illustrating a conventional hot water supply system which is a system configured to preheat water while circulating the water in a case in which a water-preheating signal of a user is detected.
The hot water supply system of FIG. 1 includes a water-preheating signal generating unit 50 configured to generate a water-preheating signal by detecting a case in which a user desires to preheat water using a sensor or when a user pushes a button, and when the water-preheating signal is input in a control unit, the control unit operates a circulation pump 40 to sequentially circulate water supplied from a hot water supply apparatus 20 through a hot water supply pipe 12, the circulation pump 40, a cold water supply pipe 13, a cold water inflow pipe 11, and a hot water supply apparatus 20 to preheat water. After such a preheating process is performed, when the user opens a hot water valve 31, the hot water having a temperature desired by the user is supplied.
A reference numeral "10," "30," and "32" respectively denote a cold water inflow pipe through which cold water is introduced, a tap, and a cold water valve.
However, according to such a conventional hot water supply system, the circulation pump 40 is provided on a pipe connected to the hot water supply pipe 12 and the cold water supply pipe 13, and hot water and cold water may be mixed through the connected pipe. Accordingly, when a user opens the cold water valve 32 to use cold water while hot water circulates for preheating, there is a problem in that the hot water in the hot water supply pipe 12 is discharged through the circulation pump 40 and the cold water valve 32. Conversely, when the user opens the hot water valve 31 to use hot water in a state in which an operation of the circulation pump 40 is stopped, there is a problem in that cold water of the cold water supply pipe 13 is discharged through the circulation pump 40 and the hot water valve 32.

Hot water supply system having preheating function and method for controlling same


A bicycle cable disc brake is provided with a cam assembly that has improved efficiency during movement under high pressure. Basically, the cable disc brake has a cable housing, a pair of friction members and an actuated mechanism. The first friction member is movably coupled to the caliper housing between a release position and a braking position. The second caliper is also coupled to the caliper housing and arranged substantially parallel to the first friction member to form a rotor receiving slot therebetween. The actuated mechanism is movably coupled to the caliper housing to move the first friction member from the release position towards the second friction member to the braking position. The actuated mechanism has a pair of cam members movably arranged between an axially retracted position and an axially extended position with a guide member interconnecting the cam members during movement between the axial retracted position and the axially extended position. In the preferred embodiment, the guide member is a guide pin that extends from one of the cam members and is received in a bore of the other cam member.

1. Field of the Invention
This invention generally relates to a cable operated disc brake for a bicycle. More specifically, the present invention relates to a cable operated disc brake with cam members for moving a friction member.
2. Background Information
Bicycling is becoming an increasingly popular form of recreation as well as a means of transportation. Moreover, bicycling has become a very popular competitive sport. Whether the bicycle is used for recreation, transportation or competition, the bicycle industry is constantly improving their components. One particular component of the bicycle, which has been extensively redesigned over the past years, is the braking systems of bicycles. In particular, the braking power of the braking systems is constantly being increased.
There are several types of bicycle brake devices, which are currently available on the market. Examples of some types of common bicycle brake devices include rim brakes, caliper brakes and disc brakes. If a rider wants a very high performance brake system, then the rider typically wants a disc brake system. Disc brake systems provide a substantial braking power in relationship to the amount of braking force applied to the brake lever. Moreover, disc brake systems typically provide a high level of consistency in all types of weather and riding conditions. Of course, riders constantly desire better performance from disc braking systems, i.e., disc brake systems that have more braking power.
Conventionally, a disc brake is composed of a pair of brake pads that are movably mounted to a caliper housing. The brake pads are pressed against a disc or rotor that is fixed to the wheel to halt the rotation of the disc and thus the wheel. The brake pads are moved toward the disc hydraulically or mechanically such as by a cam mechanism. The hydraulic disc brake systems are typically complicated in construction and expensive to manufacture. Moreover, hydraulic disc brake systems are often quite heavy in construction.
The mechanical disc brake system includes a caliper housing with one brake pad that is fixed to the caliper housing and one brake pad that is movably mounted to the caliper housing by a cam mechanism. A swinging arm is coupled to the cam mechanism to move the movable pad by a cam action. Typically, a conventional brake cable is coupled to a brake lever to move the swinging arm, and thus, operate the cam mechanism. While mechanical disc brake systems are typically less expensive and lighter than hydraulic disc brake systems, mechanical disc brake systems can still be complicated in construction and require many parts resulting in expensive manufacturing costs, as with a hydraulic disc brake system. Another drawback of many mechanical disc brake systems is that the cam mechanism often has a loss of efficiency during a movement of the cam mechanism under high pressure.
In view of the above, there exists a need for a disc brake, which overcomes the problems of prior art disc brakes. This invention addresses this need in the prior art as well as other needs, which will become apparent to those skilled in the art from this disclosure.


A communication device which implements a voice communicating function, a OS updating function, a voice recognition system, a tag function, a voice recognition noise filtering function, a sound/beep auto off function, a voice recognition system auto off function, a voice recognition email function, a voice communication text converting function, a target device location indicating function, an audio/video data capturing system, a caller ID function, a call blocking function, a navigation system, an auto emergency calling system, a cellular TV function, a GPS search engine function, a mobile ignition key function, a word processing function, a start up software function, and a stereo audio data output function.

The invention relates to a communication device and more particularly to the communication device which has a capability to communicate with another communication device in a wireless fashion.
U.S. Patent Publication No 20030119562 is introduced as a prior art of the present invention of which the summary is the following: "There are provided a task display switching method, a portable apparatus and a portable communications apparatus which, when a plurality of application software are activated and processed in parallel, make it possible to switch a display between each of the application software with ease. According to the task display switching method, the portable apparatus and the portable communications apparatus of the present invention, in a portable apparatus capable of processing a plurality of tasks in parallel and of displaying a plurality of display regions for displaying data, an icon associated with a task displayed on a first display region is generated automatically or manually, and the generated icon is displayed in a second display region. When any icon thus generated is selected from a plurality of icons displayed on the second display region, the task associated with the selected icon is restored and displayed in the first display region," However, the foregoing prior art does not disclose the communication device which implements a voice communicating function, a OS updating function, a voice recognition system, a tag function, a voice recognition noise filtering function, a sound/beep auto off function, a voice recognition system auto off function, a voice recognition email function, a voice communication text converting function, a target device location indicating function, an audio/video data capturing system, a caller ID function, a call blocking function, a navigation system, an auto emergency calling system, a cellular TV function, a GPS search engine function, a mobile ignition key function, a word processing function, a start up software function, and a stereo audio data output function.
For the avoidance of doubt, the number of the prior arts introduced herein (and/or in IDS) may be of a large one, however, applicant has no intent to hide the more relevant prior art(s) in the less relevant ones.


A connector capable of preventing a contact portion of a contact from being damaged. The contact is held by a housing having an accommodating portion for accommodating an inserting portion of an inverter board. The contact has a contact portion which is capable of being brought into contact with the inserting portion accommodated in the accommodating portion along the direction of the thickness of the inverter board. A slider which brings the contact portion of the contact into and out of contact with the inserting portion of an inverter board by sliding is slidably mounted on the housing.

1. Field of the Invention
This invention relates to a connector, and more particularly to a connector for use in e.g. a liquid-crystal display.
2. Description of the Related Art
Conventionally, there has been proposed a lamp-holding structure for connecting a lamp and an inverter board (see Japanese Laid-Open Patent Publication (Kokai) No. 2004-335227). The lamp-holding structure is comprised of a contact, a lamp-holding member, and a covering member.
The contact is comprised of a pressure contact portion, a contact spring portion, a holding portion, and a connection portion. The pressure contact portion is brought into pressure contact with a lamp terminal of the lamp held by the covering member. The contact spring portion is opposed to a holding board disposed at the top end surface of the lamp holding member in the direction of the thickness of the holding board. Further, the contact spring portion is movable in the vertical direction. The front end of the contact spring portion is warped upward. The holding portion is press-fitted in the lamp holding member. Thus, the contact is held by the lamp holding member. The connection portion connects between the pressure contact portion and the contact spring portion.
The lamp holding member has a first accommodating portion for accommodating the covering member and the connection portion of the contact.
The covering member has a lamp accommodating portion for accommodating one end of the lamp and a terminal inserting portion into which a lamp terminal of the lamp is inserted.
To hold the lamp by the lamp-holding structure, first, by press-fitting the holding portion of the contact in the lamp holding member, the contact is caused to be held by the lamp holding member. When the contact is held by the lamp holding member, the connection portion of the contact is received into the first accommodating portion of the lamp holing member.
Next, the lamp terminal of the lamp is inserted into the terminal inserting portion of the covering member, and one end of the lamp is received into the lamp accommodating portion of the covering member.
Finally, the covering member is received into the first accommodating portion of the lamp holing member. When the covering member is received into the first accommodating portion, the pressure contact portion of the contact is brought into pressure contact with the lamp terminal of the lamp.
To electrically connect between the lamp and the inverter board by the lamp-holding structure, it is only necessary to insert one end of the inverter board between the holding board disposed on the upper end surface of the lamp holding member and the contact spring portion of the contact along the upper end surface of the lamp holding member. As described above, since the front end of the contact spring portion of the contact is warped upward, when one end of the inverter board is inserted between the holding board and the contact spring portion of the contact along the upper end surface of the lamp holding member, the contact spring portion smoothly climbs onto the upper surface of the inverter board.
In the above-described lamp-holding structure, when inserting one end of the inverter board between the holding board and the contact spring portion of the contact along the upper end surface of the lamp holding member, there is a fear that the contact spring portion does not normally climb onto the inverter board but is pressed against the inverter board, causing the contact spring portion to be bent.

Connector capable of suppressing board—induced contact damage

Japan Aviation Electronics Industry, Limited


In a golf putter the head of the putter has a receptacle having a shape which in part conforms to the shape of a golf ball and has an opening in the bottom of the putter head. The opening is adapted to partially receive a golf ball, the bottom surface of the club is raised across the front and rear portions of the receptacle which allows for the smooth movement of the putter over the grass.

Due to its great popularity numerous devices and items have been developed for the sport of golfing. One area that has received a great deal of attention is ball retrieval devices. These devices come in a wide variety of styles but may be generally defined by the particular environment in which they operate.
The first type of ball retrieval devices to be discussed here are those which are used to retrieve golf balls from water hazards. The basic components of such devices generally include a telescoping type handle which enables the user to reach out far enough into the water hazard to retrieve the ball and an open net or cage-like device at one end of the handle which allows for drainage during the retrieval process.
A second type of ball retrieval device is utilized to accumulate a number of golf balls at one time. Such devices can be in the form of automatic sweepers which roll over the balls and sweep them up off the ground and into a bin. Another device of this type is often in the shape of an elongated tube which has a variable or pressure response opening at one end. In this latter device the tube opening is pressed over the ball, and by use of a type of "O" ring securement :means the ball is squeezed past the restricted opening and into the tube.
A third type of device is designed to pick the golf ball up off of the ground or from within the putting green golf ball cup. One type of device for accomplishing this function is a movable claw-type grabbing device which is attached to a pole. Generally, a trigger mechanism on the pole handle enables the user to open and close the claws in order to pick up the ball.
Thus, while a myriad of items have attempted to fill the need of providing an acceptable ball retrieval device, to date, none have achieved the type of success that would be expected. It is believed that the failure of these devices to achieve wide use and acceptance have been for several reasons.
Many of the devices are manufactured to stand alone and therefore must be purchased as an addition to one's golf clubs. Such an approach is not only more expensive, but also requires the golfer to carry an additional device in his golf bag.
One shortcoming of the claw-type device as discussed above as well as those devices which use "O" rings is that both can cause damage to the golf ball. More specifically, the claw mechanism can mark the ball when it is moved to its closed position and the "O" ring devices can mark the ball when it is being pushed through the restricted opening into the receptacle. Perhaps more importantly, one of the most common uses for such devices is in the retrieval of the golf ball from the putting green cup. However, where pressure must be applied to squeeze the ball past the restricted opening or where the claw is being operated it is possible to damage or disrupt the cup. For example, the constant pressure applied against the cup as one tries to push the ball past the restricted opening can cause the cup to become more recessed or alternately may result in a tilting of the cup. Similarly, the claw can engage the drainage openings normally found in the cup and upon removal of the claw the cup may become tilted or otherwise dislodged.
Further difficulties are often encountered when trying to incorporate a ball retrieval feature directly into the golf club. While this approach is generally attempted in order to overcome the aforementioned drawbacks of the stand alone device, it can only be successful if the effectiveness of the club is not diminished.
Accordingly, it is an objective of this invention to incorporate a ball retrieval feature into a golf club without diminishing the ability of the club to fulfill its primary function.
Another object of this invention is to develop a ball retrieval device which can be used without damaging the ball being retrieved.
Yet a further object of this invention is to develop a retrieval device which can be used to retrieve a ball from the putting green cup without dislodging or otherwise disrupting the position of the cup.
These and other objects are accomplished with the subject invention as will become apparent from a study of this disclosure.


A cast core process is used to fabricate a very small, precision wound helical antenna having readily repeatable configuration parameters for use in a high GHz multi-element (e.g., phased array) antenna. A dielectric core member is formed by shaping a solid mandrel having a precision helical groove. After a mold is formed around the mandrel and cured, the mandrel is extracted, so that it may be used to make additional identical molds. A dielectric mixture is injected into the mold's cavity, and cured. The mold is then removed, and antenna wire is tightly wound and bonded into the dielectric core's helical groove. The antenna wire-wrapped core is then mechanically and electrically attached to a baseplate laminate structure, that includes a tuning circuit, so that the antenna may be physically mounted to a support member and connected to an associated transmit--receive module.

Continuing improvements in circuit manufacturing technologies in developing smaller sized components for achieving higher operational frequencies (smaller wavelengths) has been accompanied by a need to reduce the dimensions of both signal processing and interface circuitry support hardware and their associated radio frequency antenna structures. In such reduced size, high frequency communication systems, helically wound antennas, such as those supported by low loss foam cores, are particularly attractive, as their radiation characteristics and relatively narrow physical configurations readily lend themselves to implementing physically compact phased array architectures that provide for electronically controlled shaping and pointing of an antenna's directivity pattern.
However, as operational frequencies have reached into the multidigit GHz range, achieving dimensional tolerances in large numbers of like components has become a major challenge to system designers and manufacturers. For example, in a relatively large number element phased array antenna operating at frequency in a range of 15-35 GHz, and containing several hundred to a thousand or more antenna elements, each antenna element may have on the order of twenty turns helically wound within a length of only several inches and a diameter of less than a quarter of an inch.
While conventional fabrication techniques, such as those which employ crossed-slat templates, diagrammatically illustrated in FIG. 1 at 11 and 12 to form a winding 14, may be sufficient to form helical windings for relatively large sized applications (since relatively small variations in dimensions or shape may not significantly degrade the electrical characteristics of the overall antenna), they are inadequate for very small sized elements (multi-GHz applications), where minute parametric variations are reflected as substantial percentage of the dimensions of each element. As a consequence, unless each element is effectively identically configured to conform with a given specification, there is no assurance that the antenna will perform as intended. This lack of predictability is essentially fatal to the successful manufacture and deployment of a high numbered multi-element antenna structure, especially one that may have up to a thousand elements.

Cast core fabrication of helically wound antenna


A variable vane assembly according to an example of the present disclosure includes an actuator. A connection linkage is pivotable by the actuator. A component receives direct input from the connection linkage providing a cam surface. A driving linkage is interfaced with the cam surface. A variable vane is coupled to the driving linkage. The pivoting of the component and cam surface causes the driving linkage to pivot the vane.

This disclosure relates to gas turbine engines, and more particularly to variable vane assemblies in gas turbine engines.
Gas turbine engines typically include one or more compressor sections, a combustor section, and one or more turbine sections. In some gas turbine engines, variable vanes are included, such as in the compressor section. Such variable vanes can be pivoted to different angles suitable for different operating conditions of the gas turbine engine. A mechanical linkage is typically used to pivot the variable vanes.
Mechanical linkages in the prior art utilize an actuator to pivot a bellcrank to pivot variable vanes. A bellcrank is a crank having multiple arms that pivot about a pivot point where the arms meet. Links are typically connected to the arms, such that when a force is applied by one of the links to its connected arm, all arms pivot about the pivot point, causing the other connected links to move. In the prior art variable vane systems, the bellcrank includes an arm directly connected to a driving linkage that drives the variable vanes to pivot.

Profiled bellcrank vane actuation system


A driving method and a plasma display apparatus of a plasma display panel, that provides stable operations even if the width of a scan pulse is reduced, has been disclosed. In this apparatus, an auxiliary scan pulse is applied to an X electrode after a scan pulse applied to a Y electrode (second electrode) is removed. In this way, a discharge is caused to occur between an address electrode and the Y electrode propagates to the space between the X electrode and the Y electrode, and the discharge between the X electrode and the Y electrode develops after the scan pulse is removed and a sufficient amount of wall charges is formed.

The present invention relates to a driving method and a plasma display apparatus of a three-electrode AC type plasma display panel.
A plasma display apparatus (PDP apparatus) has been put to practical use as a plane display. A description is given below with an example of a three-electrode AC type plasma display panel.
FIG. 1 is a diagram that shows the structure of a normal plasma display panel. As shown schematically, on a substrate 1, plural X (first) electrodes X1, X2, . . . , and Y (second) electrodes Y1, Y2, . . . that extend in one direction are arranged adjacently by turns and plural address electrodes A are further arranged in the direction perpendicular to that of the X electrodes and the Y electrodes. Between the address electrodes, stripe-shaped ribs 2 that extend along the address electrodes are formed. Normally, the X electrodes and the Y electrodes are formed on one of two substrates, the address electrodes are formed on the other substrate, the two substrates are arranged in such a way as to oppose each other, and a gas for discharge is sealed in into a space between them. Display cells are formed at the crossings of pairs of the X electrodes and the Y electrodes, that is, the pair of X1 and Y1, the pair of X2, Y2, . . . and the address electrodes A. Display lines L1, L2, . . . , are, therefore, formed in correspondence with the pairs of the X electrodes and the Y electrodes, that is the pair of X1 and Y1, the pair of X2 and Y2, . . . , as shown schematically.
FIG. 2 is a block diagram that shows the general structure of a conventional PDP apparatus, that uses a plasma display panel 10, shown in FIG. 1. As shown schematically, the PDP apparatus comprises an address driver (a third drive circuit) 11 that selectively applies a voltage to the address electrode A, a Y electrode drive circuit (a second drive circuit) 12 that drives the Y electrode, an X electrode drive circuit (a first drive circuit) 16 that drives the X electrode, and a control circuit 19. The Y electrode drive circuit 12 comprises a scan driver 13 that generates a scan pulse to be applied sequentially to the Y electrode during the address period, a sustain pulse circuit 14 that generates a sustain pulse to be applied sequentially to the Y electrode during the sustain discharge period, and a reset/address voltage generation circuit 15 that generates a voltage to be applied commonly to the Y electrode during the reset period and that except for the scan pulse to be applied commonly to the Y electrode during the address period. The X electrode drive circuit 16 comprises a sustain pulse circuit 17 that generates a sustain pulse to be applied commonly to the Y electrode during the sustain discharge period and a reset/address voltage generation circuit 18 that generates a voltage to be applied commonly to the X electrode during the reset period and the address period.
FIG. 3 is a diagram that shows the drive waveforms of the PDP apparatus in FIG. 2. As shown schematically, one action cycle comprises a reset period during which all the display cells are brought into a uniform state, an address period during which a display cell to be lit is selected, and a sustain discharge period during which only the selected display cell is lit. The luminance is determined by the number of sustain pulses in the sustain discharge period. When the frequency of the sustain pulse is constant, the number of sustain pulses is in proportion to the length of the sustain discharge period. The PDP apparatus is only able to select the lit or unlit state of each display cell, therefore, when an image with gradation is displayed, one display field is constructed by plural subfields which have the action cycle shown in FIG. 3, and the length of the sustain discharge period of which differs at least in part, and the subfields to be lit are selected for each display cell.
In the reset period, the address driver 11 applies 0V to all the address electrodes and the reset/address voltage generation circuit 18 of the X electrode drive circuit 16 and the reset/address voltage generation circuit 15 of the Y electrode drive circuit 12 apply the voltages as shown in FIG. 3 to all the X electrodes and all the Y electrodes. The reset period is composed of a write portion that applies a positive voltage to the Y electrode as well as applying a negative voltage to the X electrode and an erase portion that applies a negative voltage to the Y electrode as well as applying a positive voltage to the X electrode. In the write portion, after the negative voltage applied to the X electrode is changed gradually, a positive voltage that changes gradually is applied to the Y electrode, and wall charges are formed in all the display cells by a slight discharge. In the erase portion, the voltage applied to the X electrode is switched to a positive one and simultaneously a negative voltage that changes gradually is applied to the Y electrode so that the wall charges in all the display cells are erased or adjusted to a certain amount by a slight discharge. In the address period, in a state in which a voltage Vx is being applied to all the X electrodes, the scan pulse is applied sequentially to the Y electrode and the address pulse that corresponds to the display data is applied selectively to the address electrode in synchronization with the scan pulse. An address discharge is caused to occur in the cell at the crossing of the Y electrode to which the scan pulse is applied and the address electrode to which the address pulse is applied, and no discharge is caused to occur in the cell at the crossing of the address electrode to which the address pulse is not applied. Wall charges are formed in the cell in which the address discharge is caused to occur and each display cell is brought into a state that corresponds to the display data. In the sustain discharge period, in a state in which 0V is being applied to the address electrode, a sustain pulse that change between 0V and a voltage Vs is applied alternately to the Y electrode and the x electrode. A sustain discharge is caused to occur in the cell in which wall charges are accumulated during the address period because the voltage due to the wall charges is added to the sustain pulse and the discharge start voltage is exceeded, and no sustain discharge is caused to occur in the cell in which no wall charge is accumulate during the address period. The wall charges are formed alternately on the Y electrode and the X electrode by the sustain discharge, and the sustain discharge continues as long as the sustain pulse is being applied.
The typical method of the PDP apparatus is described above as an example, but various kinds of methods are put to practical use and there are many examples of modifications.
Recently, the display apparatus has been highly improved in capacity and resolution, and the plasma display panel has increased the number of lines from approximately 500 to 1,000. Moreover, it is required that the number of levels in gradation should be increased and that the number of subfields should be increased to avoid the false contour when a motion video is displayed, which is inherent in a device that performs display using subfields. If the number of display lines is increased, the number of times an addressing is performed is increased and the time to be assigned to one address action, that is, the width of the scan pulse becomes shorter. If the number of subfields is increased, the time to be assigned to the address period becomes shorter and it is necessary to shorten the width of the scan pulse. If, however, the width of the scan pulse is shortened, a problem occurs in that no address discharge is caused to occur, even though an address pulse is applied, and display data cannot be written correctly.
One of the methods to solve the problem is the so-called dual scan method, in which the address period is halved by dividing the address electrode horizontally and performing the address action simultaneously in the upper screen and the lower screen. This method, however, brings about a problem that two address drivers to drive the address electrode are required, resulting in the disadvantage of a higher cost.
Another method has been proposed in which the address of one display line is performed at a high-speed. For example, sufficient space charges that are generated by the reset discharge during the reset period are made to remain, thereby the address discharge is made more likely to occur and the delay time of the address discharge is shortened. It is, however, necessary to increase the intensity of the reset discharge in order to generate a sufficient amount of space charges and a problem is caused in that the quality of display is degraded because the entire surface light emission intensity due to the reset discharge increases and the contrast is degraded.
Moreover, there is another method in which the voltage to be applied during the address discharge is increased to promote the development of the discharge and the address discharge is completed in a short time. This method, however, brings about various problems of such as crosstalk between the neighboring cells and lack of control of the discharge.
On the other hand, Japanese unexamined Patent Publication (Kokai) No. 9-311661 has disclosed the method in which the absolute value of the voltage of the scan pulse to be applied to the Y electrode is reduced by providing the scan driver also to the X electrode drive circuit and by applying the scan pulse of the opposite polarity to the X electrode in synchronization with the application of scan pulse to the Y electrode during the address period. The advantage of this method lies in the fact that the withstand voltage of the drive circuit can be reduced, but the same problem, as described above, may occur when the width of the scan pulse becomes short.
The address discharge is started when the address pulse is applied to the address electrode and the scan pulse is applied to the Y electrode, but an amount of wall charges enough to cause the sustain discharge to occur is not generated only by the discharge between the address electrode and the Y electrode. A high voltage, therefore, is applied to the X electrode so that the discharge caused to occur between the address electrode and the Y electrode causes the discharge to occur between the X electrode and the Y electrode, and the discharge between the X electrode and the Y electrode is completed after it develops to generate the wall charges necessary for the sustain discharge. If the time required for the series of these actions is too short, the discharge between the X electrode and the Y electrode does not develop even though the discharge between the address electrode and the Y electrode is caused to occur, and a state is brought about in which a sufficient amount of wall charges is not formed (a state of imperfect address discharge), therefore, it seems that the sustain discharge is not caused to occur. The term "development of the discharge" described above is used because a certain length of time is required to generate a sufficient amount of wall charges after the discharge is completed.
As described above, the problem lies in the fact that the width of the address pulse needs to be shortened to increase the number of display lines and to improve the gradation reproduction, but this adversely affects the stable actions.

Driving method and plasma display apparatus of plasma display panel


In an element isolation region defining an element formation region, there is formed an element isolation unit including an element isolation unit and the other element isolation unit. The other element isolation unit is arranged in a direction intersecting a direction in which the element isolation unit extends from the element isolation unit. The element isolation unit includes a sidewall oxide film formed in a trench, a titanium film, a titanium nitride film, and a tungsten film. The tungsten film is formed to cover the bottom surface of a trench in the element isolation unit and to close an opening end of a trench in the other element isolation unit. A plug is formed in contact with the tungsten film of the element isolation unit.

Semiconductor devices have an element isolation structure having a deep trench applied thereto, as a structure for electrically isolating semiconductor elements formed on a semiconductor substrate. This element isolation structure is called a DTI (Deep Trench Isolation). Japanese Unexamined. Patent Application Publication No. 2013-222838 discloses an example of this DTI.
This element isolation structure has an element isolation unit in a form where a conductor unit for fixing the semiconductor substrate at a predetermined potential is formed. In this element isolation unit, there is formed the conductor unit through an intervening sidewall insulating film, interposed therebetween, on the side wall of the deep trench. The conductor unit is formed in contact with the semiconductor substrate on the bottom surface of the deep trench. A tungsten film is formed also in the deep trench, as the conductor unit. A contact unit (plug) for applying a predetermined potential to the tungsten is formed.

Semiconductor device and its manufacturing method


A portable telephone produces either beep sound or melody sound as incoming call sound. The melody sound is produced based on music data, which are stored in advance or downloaded from the prescribed distribution center, wherein the music data represent the melody of a single musical tune in different arrangements that are respectively assigned to time zones in advance. Hence, the portable telephone produces the same melody in different arrangements in response to time zones, to which the time for receiving an incoming call belong.

Conventionally, there are provided analog cellular systems and digital cellular systems, examples of which are known as personal digital cellular telecommunication systems (PDC) and personal handyphone systems (PHS). Upon reception of incoming calls from calling parties, portable telephones produce prescribed incoming call sounds to notify users or subscribers of reception of incoming calls. As incoming call sounds, portable telephones conventionally produce beep sounds, which may be offensive to ears of users. Recently, portable telephones produce melody sounds as incoming call sounds, which are substituted for conventional beep sounds.
However, melody sounds produced by portable telephones are monotonous because melody sounds may correspond to simple musical tones of prescribed musical tunes that are constant in tonality and have poor variations and poor expressions. That is, conventional portable telephones are disadvantageous in that users easily loose interests in hearing monotonous melody sounds for use in notification of reception of incoming calls.
This invention is made in consideration of the aforementioned circumstances, so it is an object of the invention to provide a portable telephone that is capable of producing incoming call melody sound having rich variations and rich expressions.


A weapon mounting system including a base and an upright for supporting a weapon holder. The weapon holder is supported for sliding movement along the upright.

The present invention relates generally to weapon holders and, more particularly, to mounting devices for supporting weapons within the passenger compartment of an automotive vehicle.
Weapon mounting systems, or gun racks, for supporting weapons inside of passenger compartments of automotive vehicles are well-known in the art. The prior art teaches that such gun racks may be mounted against a window, a screen, or a wall of a vehicle in order to support a weapon in a generally horizontal manner. In addition, it is known to provide vehicle gun racks for supporting a gun in an upstanding position, as illustrated in U.S. Pat. No. 4,747,280 to Shaw.
It is also known to provide a gun rack for supporting a gun adjacent to the ceiling of a vehicle passenger compartment, particularly for the purposes of concealing the gun and for providing access to the gun carried by the gun rack to a person in a front seat of the vehicle. For example, U.S. Pat. No. 5,816,546 to Miller, which is assigned to the assignee of the present invention, and is expressly incorporated by reference herein, discloses an illustrative clamp for a vehicle gun rack.
Additional illustrative prior art weapon mounting systems are disclosed in U.S. Pat. No. 6,986,446 to Murray et al., which is assigned to the assignee of the present invention, and is expressly incorporated by reference herein.
According to an illustrative embodiment of the present disclosure, a weapon mounting system includes an upright extending upwardly relative to a floor of a vehicle. The upright includes a lower end, an upper end, a first track extending between the lower end and the upper end, and a second track spaced apart from the first track and extending between the lower end and the upper end. A first weapon holder is supported by the upright. A first slide mount is received within the first track of the upright end is coupled to the first weapon holder. The first slide mount is supported by the track for sliding movement in a released mode of operation, and is secured in position in a fixed mode of operation. The first weapon holder is vertically moveable along the upright when the first slide mount is in the released mode of operation. An article lockbox is coupled to the upright.
According to a further illustrative embodiment of the present disclosure, a weapon mounting system includes an upright, the upright including a lower end, an upper end, a first track extending between the lower end and the upper end, and a second track extending between the lower end and the upper end. A first weapon holder is supported by the upright. A first slide mount is received within the first track and is coupled to the first weapon holder, wherein the first weapon holder is adjustable along the upright. A second weapon holder is supported by the upright. A second slide mount is received within the second track and is coupled to the second weapon holder, wherein the second weapon holder is adjustable along the upright independent of the first weapon holder. The second weapon holder is in laterally spaced relation to the first weapon holder such that the second weapon holder may be positioned horizontally adjacent to the first weapon holder without interference therebetween.
According to another illustrative embodiment of the present disclosure, a weapon mounting system includes a base member configured to be supported by a floor of a vehicle and an upright extending upwardly from the base member in a vertical direction. The upright includes a lower end, an upper end, a front face, a rear face, a first side face, and a second side face. A first track extends between the lower end and the upper end in the first side face, a second track extends between the lower end and the upper end in the second side face, and a third track extends between the lower end and the upper end in the front face. A first weapon holder is supported by the upright. A first slide mount is received within the first track and is coupled to the first weapon holder, wherein the first weapon holder is adjustable along the upright. A second weapon holder is supported by the upright. A second slide mount is received within the second track and is coupled to the second weapon holder, wherein the second weapon holder is adjustable along the upright. An article lock box is supported by the upright. A third mount is received within the third track and is coupled to the article lock box, wherein the article lock box is adjustable along the upright. The article lock box includes a housing, a lid coupled to the housing for pivoting movement between a closed position and an open position, and a lock to secure the lid in the closed position.
Additional features and advantages of the present invention will become apparent to those skilled in the art upon consideration of the following detailed description of the illustrative embodiment exemplifying the best mode of carrying out the invention as presently perceived.


An infrared detector based on CNT yarns includes a first electrode, a second electrode and a composite film between the first electrode and the second electrode. A first end of the composite film is electrically connected to the first electrode. A second end of the composite film and the second electrode cooperatively define a gap therebetween. The composite film is capable of extending in a direction towards the second electrode and, thereby forming an electrical connection between the first and the second electrodes when the composite film is illuminated by infrared light. The composite film includes a polymer layer, a plurality of semiconducting CNT yarns dispersed in the polymer layer, and a plurality of metallic CNT yarns dispersed in the polymer layer. Each semiconducting CNT yarn includes a plurality of twisted semiconducting CNTs. Each metallic CNT yarn includes a plurality of twisted metallic CNTs.

1. Technical Field
The present invention relates to infrared detectors, and particularly to an infrared detector with carbon nanotube (CNT) yarns.
2. Description of Related Art
Infrared radiation is used in a number of applications in the fields of industry, agriculture, medicine, science, communications, and remote sending from space. Infrared detectors have been employed in a variety of fields, such as human body detection, fire detectors, and etc. Typical infrared detectors have complex structures and are expensive.
Therefore, a new infrared detector is desired to overcome the above mentioned problems.

Infrared detector with carbon nanotube yarns


A method and apparatus are provided for remediating contaminated soil having volatilizable organic pollutants in a heated treatment zone, preferably a rotary drum, in gas/solids contact with superheated steam. Treatment gases from the treatment zone are repressurized and reheated for reuse in the treatment zone. Superheated steam is maintained in a closed loop and is maintained at superheated conditions. Vaporized organic pollutants and superheated steam are removed from the closed loop of superheated steam for cooling and condensation to condense water and condense liquid volatilizable organic pollutants and uncondensed organic pollutant vapors.

Soil remediation is well established as a procedure for complying with environmental clean-up requirements. Continued accumulations of volatilizable organic pollutants in the soil around chemical plants, petroleum plants, manufacturing plants, gasoline filling stations, and agricultural chemical deposits (e.g., pesticides, herbicides, fungicides, etc.) may be considered as a threat to surface water and ground water or a threat to one or more other circumstance which is regulated by environmental laws and rules. Where contaminated soil is objectionable, there are numerous regulations to be considered.
The present invention is concerned with contaminated soil remediation where the volatilizable organic content of the soil exceeds the allowable regulatory maxima but is preferably less than about five weight percent of the soil and more particularly less than about two weight percent of the soil. Examples of suitable soils include solids such as topsoil, river sediments, bedrock, alluvium, and particulate fill materials such as cinders, gravel and slag.
Several procedures for remediating contaminated soils are shown in U.S. Pat. Nos. 4,738,206; 4,974,528; 5,072,674; 5,103,578; 5,121,699; 5,142,998; 5,152,233; 5,187,131; (heat supply for devolatilization by heated flight conveyor) U.S. Pat. Nos. 4,738,206; 5,072,674; 5,142,998; (indirect heating means, e.g. electric heaters or heat exchange fluids) U.S. Pat. No. 5,103,578; and (fuel oil or fuel gas combustion) U.S. Pat. Nos. 4,974,528; 5,121,699; 5,152,233.
None of the prior art processes employ superheated steam in gas/solids contact with the contaminated soil in a system wherein superheated steam and the volatilized and/or volatilizable organic pollutants recirculate with the system at temperatures which maintain the superheated system in a superheated state, i.e., wherein the steam is maintained above its saturation temperature at all times.

Method and apparatus for soil remediation with superheated steam thermal desorption and recycle


A pump assembly includes a rotating component and a stationary component coupled to the rotating component such that the stationary component substantially circumscribes at least a portion of the rotating component. A high pressure outlet extends at least partially through the rotating and stationary components. An inlet is positioned a predefined distance from the high pressure outlet. The inlet extends at least partially through the rotating and stationary components. A solid fuel flow is channeled from the inlet to the outlet as the rotating component rotates. A flow control member is coupled to the rotating and stationary components in a first predefined position. The flow control member is selectively moveable from the first predefined position to a second predefined position to form a seal within the pump assembly such that the solid fuel flow and a fluid flow are substantially restricted from being channeled back into the inlet.

The field of the invention relates generally to systems that include solid feed, such as particulate matter, and, more particularly, to a pump assembly that may be used in such systems to substantially restrict backflow within the system.
At least some known systems, such as, but not limited to, dry feed systems and gasification systems, may channel or transport fluids and/or a solid feed, such as particulate matter. For example, gasification systems, such as integrated gasification combined-cycle (IGCC) plants, include a fuel and particulate supply system that is coupled upstream from a gasifier for channeling fuel and particulates to the gasifier. More specifically, in such systems, solid fuel, such as coal, may be channeled to the gasifier, wherein syngas may be generated.
The solid fuel may be channeled to the gasifier using a feed system that includes a solid feed pump that transports the solid fuel along a moving path from an inlet to an outlet. At least some known inlet systems for the solid feed pump are contained within a relatively large pressure vessel with an isolating valve positioned about the vessel. The valve is used to restrict any backflow of the solid fuel. In order to effectively restrict the backflow of the solid fuel, it is necessary for the valve to be large enough to match the inlet pipe and it is necessary for the valve to be pressure rated. Moreover, the pressure vessel needs to be rated for the pump outlet pressure. Such pressure vessels are relatively large and relatively heavy, and such pressure vessels may require additional structure to support the weight. Accordingly, such requisites for the inlet system can be costly. Further, the inlet system may also incorporate load cells and vibrators that are mounted inside the pressure vessel. Due to the positioning of the cells and the vibrators within the pressure vessel, such components require specialized pass-through assemblies and maintenance of the components may be difficult.

Methods for restricting backflow of solids in a pump assembly


The invention is directed to an ATM-System adapted three-step switching unit, including an input circuit including a number of incoming group related conductors connected to a first switching stage, an output circuit including a number of outgoing group related conductors connected to a second switching stage and a third switching stage. A control unit coacts with said switching stages in order to connect one of said incoming conductors with a selected outgoing conductor by way of a connecting path, pointed out through the third switching stage. Each of the outgoing conductors belonging to the first switching stage coacts with an electro-optical converter. The respective connections between the first switching stage and the third switching stage consist of an optical conductor. The third switching stage is adapted to transfer optical information-carrying signals through the connecting path. The connections between the third switching stage and the second switching stage consist of optical conductors and incoming conductors belonging to said second switching stage, which are pre-connected by an opto-electrical converter.

Multi step switching, pertaining to the kind described above, are previously known in a number of various embodiments and the principal construction and the dimensioning rules concerning a none blocking three stage switching unit are shown and described in more detail in the publication "ISDN and Broadband ISDN" under the section 2:3 "Space-Division Switching" and specifically on page 33 with reference to FIG. 2.8.
The principal construction of a three stage switching unit is here described and dimensioned to be able to provide a none blocking signal transmission at a passage of incoming connections.
The structure of used first, second and third switching stages is not given in detail.
It is, nevertheless, known to form said switching stages so that these are adapted to pass used electrical information-carrying digitized signals, whereby electrical conductors are related to each other and structured according to the pattern indicated by the publication.
Taking the significant features of the present invention under consideration it can also be mentioned that it is previously known to be able to receive electrical information-carrying signals and to, through electro-optical converters, convert these to optical pulses of light and to transmit these light pulses on an optical conductor to an opto-electrical converter which receives said optical pulses and transmits corresponding electrical information-carrying signals.
Such optical information-carrying systems have been used within various electro technical applications, such as large switching units, in order to transmit information-carrying signals longer distances, as in between different or similar cubicles.
Taking the significant features, and thereto significant measures, of the present invention under further consideration it can be mentioned that totally optical switching units are previously known and described through the publication "Technical Digest of Conference on Optical Fiber Communication" in the article "Feasibility demonstration of 2,5 Gbit/s 16.times.16 ATM photonic switching matrix" on pages 93 to 94, by the authors D. Chiaroni et al and the publication "Proc. Topical Meeting on Optical Amplifiers and their Applications, postdeadline paper", 1992, in the article "Monolithically integrated 4.times.4 InGaAsP/InP laser amplifier gate switch arrays" on pages 38 to 42, by the authors M. Gustafsson et al.
In these referred publications it is described the usage of controllable optical switching components, such as optical switching matrixes, whereby optical light pulses, appearing on one of a number of available group related incoming optical conductors, can be selected and switched through a core to a, one of several available, selected outgoing optical conductor.
In order to simplify the understanding of the features if the present invention a reference to the publication "Proc. European Conference on Optical Communication", 1990, with the article "Characterization of a 1,5 m three-electrode DFB laser" on pages 279 to 282, by the authors R. J. S. Pedersen et al, can be made where it is described a tunable laser related transmitter.
A receiver in a laser related application is described in the publication "Proc. European Conference on Optical Communication", 1991, with the article "Performance of DBR active filters in 2.4 Gb/s systems" on pages 445 to 448, by the authors O. Sahlen et al.
The principles of said transmitter and receiver can be used within the present invention.
That which is shown and described in the following publication is also a part of the related art.
"Wavelength Conversion Laser Diodes Application to Wavelength-Division Photonic Cross-Connect Node with Multistage Configuration" H. Rokugawa et al. IEICE Trans. on Communication, Vol. E75-B, No. 4, April 1992, pages 267-274.
A three stage switching structure or unit is, through this publication, previously known with a principle construction that coincides with the basic conditions of the present invention.
It is here indicated (according to FIG. 1) the use of an opto-electrical signal converting stage (O/E), a stage intended to process electrical signals (ESP), an electro-optical signal converting stage (E/O), a switching stage adapted to optical signals (OSP), an opto-electrical signal converting stage (O/E), a stage intended to process electrical signals (ESP) and an electro-optical signal converting stage (E/O).
An connecting arrangement for the switching stage (OSP) is described in principal with reference to FIG. 2 which is specifically adapted to a wavelength separation, so that signals with different wavelengths can pass simultaneously through one single optical fiber and the conditions to increase the flexibility and capacity of such an optical communication network has thereby been created.
It can be specifically mentioned that the switching stages used here are dimensioned for one and the same capacity and that the optical switching stage (OSP) is dimensioned and adapted to the O/E- and E/O-stages.
The switching unit is thus dimensioned and adapted to a selected capacity and the possibilities to a gradual extension is neither indicated or mentioned.
It is further made clear, through that which is described in FIG. 2, that all outputs are connected to all inputs through the used optical stage.
It is besides this described possibilities to let a selected wavelength from every selected source (1.1-1.n) to an incoming block to be mixed before an optical signal with several wavelengths (.sub.1 -.sub.n) is transmitted through an outgoing block.
A separation of wavelengths is thus performed here to a number of possible receivers.
A requirement on an optical switching unit of this kind is that the selected light intensity of the information-carrying signals appearing on one of the inputs must be high enough to be sufficient to all the outputs.
A specially relevant prior art is found in the article "Trend of Photonic Switching Systems" S. Suzuki et al. IEICE, Trans. on Communication, Vol. E75-B, No. 4, April 1992, pages 235-242.
It is here described a number of switching units, intended to be able to transmit broadband signals.
The switching structure according to FIG. 15 can be regarded as being of a certain importance.
It is here described a switching equipment adapted to ATM-system using ATM-cells where the ATM-cells intended to pass through are connected or a multiplexing unit (MUX S/P) which restructure incoming parallel related ATM-cells to a serial related ATM-cell structure on one single conductor and these serial related ATM-cells can be stored within a memory.
Every ATM-cell, regardless of required bandwidth, is now to pass through the optical matrix connection OSM which requires a high speed, meaning that a speed corresponding to ATM-technology is here required through the complete connecting system.
A control of the OSM-stage is required so that, for every ATM-cell that is to pass through the OSM-stage, a selected input connection can be connected with a selected output connection.

ATM-system adapted three stage switching unit


A method and an apparatus for measuring insulating film thickness, such as the width of sidewall spacers. The method includes positioning a first test structure having a first resistance at a first location on a semiconductor wafer and positioning a second test structure having a second resistance different from the first resistance at a second location on the semiconductor wafer. The method also includes measuring the first resistance of the first test structure and measuring the second resistance of the second test structure. The method also includes determining an average characteristic of the first test structure and the second test structure, other than resistance, based on the first resistance of the first test structure and the second resistance of the second test structure.

1. Field of the Invention
This invention relates generally to semiconductor manufacturing, and, more particularly, to a method and apparatus for electrically measuring insulating film thickness, such as the width of sidewall spacers.
2. Description of the Related Art
The technology explosion in the manufacturing industry has resulted in many new and innovative manufacturing processes. Today""s manufacturing processes, particularly semiconductor manufacturing processes, call for a large number of important steps. These process steps are usually vital, and therefore, require a number of inputs that are generally fine-tuned to maintain proper manufacturing control.
The manufacture of semiconductor devices requires a number of discrete process steps to create a packaged semiconductor device from raw semiconductor material. The various processes, from the initial growth of the semiconductor material, the slicing of the semiconductor crystal into individual wafers, the fabrication stages (etching, doping, ion implanting, or the like), to the packaging and final testing of the completed device, are so different from one another and specialized that the processes may be performed in different manufacturing locations that contain different control schemes.
Generally, a set of processing steps is performed on a group of semiconductor wafers, sometimes referred to as a lot, using a semiconductor-manufacturing tool called an exposure tool or a stepper. As an example, an etch process may be performed on the semiconductor wafers to shape objects on the semiconductor wafer, such as polysilicon lines, each of which may function as a gate electrode for a transistor. As another example, a plurality of metal lines, e.g., aluminum or copper, may be formed that serve as conductive lines that connect one conductive region on the semiconductor wafer to another. The manufacturing tools communicate with a manufacturing framework or a network of processing modules. Each manufacturing tool is generally connected to an equipment interface. The equipment interface is connected to a machine interface to which a manufacturing network is connected, thereby facilitating communications between the manufacturing tool and the manufacturing framework. The machine interface can generally be part of an advanced process control (APC) system. The APC system initiates a control script, which can be a software program that automatically retrieves the data needed to execute a manufacturing process.
FIG. 1 illustrates a typical wafer 100 comprising a semiconductor 105. The wafer 100 typically includes a plurality of individual semiconductor die 150 arranged in a grid, with spaces, called scribe lines, 155 between individual ones of the semiconductor die 150. Photolithography steps are typically performed by a stepper on approximately one to four die locations at a time, depending on the specific photomask employed. Photolithography steps are generally performed to form patterned layers of photoresist above one or more process layers that are to be patterned. The patterned photoresist layer can be used as a mask during etching processes, wet or dry, performed on the underlying layer or layers of material, e.g., a layer of polysilicon, metal or insulating material, to transfer the desired pattern to the underlying layer. The patterned layer of photoresist is comprised of a plurality of features, e.g., line-type features, such as a polysilicon line, or opening-type features, that are to be replicated in an underlying process layer. The wafer 100 may typically have one or more indicia for alignment purposes, such as a notch 110 and/or registration marks 115.
Turning now to FIG. 2A, various features 200A that may be associated with any one of the semiconductor die 150 are shown. As noted above, the fabrication stages may include doping a source region 205 and a drain region 210 in a semiconductor substrate of the wafer 100. A gate region 220 may also be created on or in the semiconductor substrate. The gate region 220 has associated with it a length (LGATE) 225. Also associated with the gate region 220 is an effective gate length (LEFF) 230. The effective gate length 230 corresponds to the distance between the source region 205 and the drain region 210 in which the gate region 220 is present.
Using the features 200A and associated characteristics of FIG. 2A, optimizations designed to increase circuit speed are discussed. Three parameters for circuit speed are the gate capacitance, the transistor drive current, and the transistor leakage current. The gate capacitance is proportional to the gate length 225. That is, for a larger gate length 225 the gate capacitance is higher. The transistor drive current is inversely proportional to the effective gate length 230. That is, for a smaller effective gate length 230 the transistor drive current is higher. The transistor leakage current is also inversely proportional to the effective gate length 230. That is, for a smaller effective gate length 230 the transistor leakage current is higher. While a larger transistor drive current may be preferred, a smaller transistor leakage current is preferred.
The delay, xcfx84, for a given transistor must be low for the overall circuit speed to be optimized. The delay is proportional to the gate capacitance (C) and the gate voltage (V) and inversely proportional to the drive current (Idrive).   τ  =      CV          I      drive
Optimizing for circuit speed calls for controlling the effective gate length 230 while making the gate length 225 small. As a smaller gate length 225 leads to a smaller gate capacitance, for the same drive current, the delay is low. The semiconductor industry has looked for ways to accomplish this goal.
Turning to FIG. 2B, one way to achieve the goal above is to use sidewall spacers 250, a type of insulating film, in an attempt to limit leakage current. Various improved features 200B that may be associated with any one of the semiconductor die 150 are shown. As noted above, the fabrication stages may include doping the source region, shown as a source region 205A before the sidewall spacers are formed and a source region 205B after the sidewall spacers are formed. Likewise, the fabrication stages may include doping the drain region, shown as a drain region 210A before the sidewall spacers are formed and doping a drain region 210B after the sidewall spacers are formed. The gate region 220 is also shown with its associated length (LGATE) 225. Also associated with the gate region 220 are an old effective gate length 230A before the sidewall spacers and a new effective gate length 230B after the sidewall spacers.
The sidewall spacers 250 provide an increased effective gate length 230 for a given gate length 225. Put another way, for an effective gate length 230, the given gate length 225 can be made smaller. When using sidewall spacers 250, the width of the sidewall spacers 250 must be monitored closely if the performance of the finished circuit is to be predicted with any confidence. One aspect of the present invention is directed to monitoring the width of insulating films, at least in part, using the sidewall spacers as an illustrative example.
In one aspect of the present invention, a method is provided for measuring insulating film thickness, such as the width of sidewall spacers. The method includes positioning a first test structure having a first resistance at a first location on a semiconductor wafer and positioning a second test structure having a second resistance different from the first resistance at a second location on the semiconductor wafer. The method also includes measuring the first resistance of the first test structure and measuring the second resistance of the second test structure. The method also includes determining an average characteristic of the first test structure and the second test structure, other than resistance, based on the first resistance of the first test structure and the second resistance of the second test structure.
In another aspect of the present invention, an apparatus is provided. The apparatus includes a semiconductor substrate, a first test structure integrated into the semiconductor substrate, and a second test structure integrated into the semiconductor substrate. The first test structure includes a first highly doped region, a first gate region and a second gate region separated by at least a portion of the first highly doped region, a first insulating layer adjacent to the first gate region towards the second gate region, and a second insulating layer adjacent to the second gate region towards the first gate region. The first insulating layer and the second insulating layer are separated by a first non-zero distance. The second test structure includes a second highly doped region, a third gate region and a fourth gate region separated by at least a portion of the second highly doped region, a third insulating layer adjacent to the third gate region towards the fourth gate region, and a fourth insulating layer adjacent to the fourth gate region towards the third gate region. The third insulating layer and the fourth insulating layer are separated by a second non-zero distance different from the first non-zero distance. The first test structure and the second test structure are configured for determination of the average thickness of insulating layers through measuring a first resistance between the first highly doped region and a first adjacent highly doped region that is also proximate with the first gate region and the second gate region and measuring a second resistance between the second highly doped region and a second adjacent highly doped region that is also proximate with the third gate region and the fourth gate region.
In still another aspect of the present invention, a system of automatic process control measuring insulating film thickness, such as the width of sidewall spacers, to monitor the process stream and possibly modify the process stream. The system includes a computer system, a manufacturing model coupled with the computer system, a machine interface coupled with the manufacturing model, a processing tool configured to process semiconductor wafers and coupled to receive at least one control input parameter signal from the machine interface, and a metrology tool coupled with the first processing tool and the second processing tool. The manufacturing model is configured to generate and modify at least one control input parameter. The machine interface is configured to receive process recipes from the manufacturing model. The metrology tool is configured to acquire metrology data. The metrology data includes a resistance from each test structure associated with a semiconductor wafer. The metrology tool is configured to provide the resistance to the computer system to determine an average characteristic of a parameter other than resistance of the semiconductor wafer.

Method and apparatus for electrically measuring insulating film thickness


The invention is directed at composite materials, articles including the composite materials, and methods for producing and using them. The composite material includes regions that differ in one or more properties. The composite material generally includes a first metallic sheet, a second metallic sheet; one or more metallic inserts interposed between the first and second metallic sheets; and a polymeric layer (e.g., a core layer) interposed between the first and second metallic sheets. The polymeric layer preferably includes a thermoplastic polymer. Preferably, the composite material includes a first region having an insert interposed between the metallic sheets so that the first region (relative to the second region) has a high tensile strength, a high thickness, a high density, or any combination thereof.

Numerous metal parts require regions that have relatively demanding properties and other regions having less demanding properties. To reduce the weight and/or material usage of the part, there have been various technologies for machining, cutting, or otherwise tailoring a monolithic metal part.
For example, recent developments in part weight reduction have been achieved by using tailor welded blanks that include metal of different thickness welded together along an edge. Examples of tailor welded blanks, methods of production, welding of such blanks and applications for tailor welded blanks are described in U.S. Pat. No. 7,062,853 (by Reed et al.), U.S. Pat. No. 6,957,848, (by Walther), and U.S. Pat. No. 7,543,384 (by Ni et al.), and in "Tailor Welded Blanks", I-Car Advantage Online, Dec. 6, 2004 (available at http://www.i-car.com/pdf/advantage/online/2004/120604.pdf), all incorporated herein by reference in their entirety.
Notwithstanding the weight reductions achieved in tailor welded blanks, there continues to be a need for a material system that can achieve further weight reductions, cost reductions, are easy to manufacture, are easy to processor, are easy to weld to other parts, or any combination thereof. There is also a need for such materials that have sound dampening properties, good corrosion resistance, can be easily formed (e.g., in one or more regions), or any combination thereof.

Composite materials including regions differing in properties and methods


A recessed housing and cover are held together by self-tapping screws. The housing is provided with a half round extension having an inner diameter slightly larger than the outer diameter of the cable. The cable insulation is removed to about the middle of the extension and is held tightly to the extension and the assembly by means of two layers of heat shrunk plastic tubing. Wires from the cable to the pins of a multi-pin military type connector are contained within the recess. The military connector is provided with a surrounding flange which is held in engagement with a pair of outrigger bosses on the recessed housing. The recessed housing and the top cover are also provided with opposed flanges for engagement with the flange of the military type connector.. Alternatively when the connector must be repaired in the field the heat shrinkable tubing may be replaced with tightly wrapped stretchy elastomeric electrical tape, or additional pieces of heat shrinkable tubing may be left on the assembled cable for later use when repairs are necessary.

Standard rectangular military type connectors such as M24308/4-15 AMP No. 79-35 must be provided with a housing to protect the back end of the connector and the fine wires of the cable where the cable insulation has been removed and to provide a tight connection between the housing, the connector, and the cable so that the cable cannot be pulled out of the housing, destroying the connections.
The housings provided by the connector manufacturers utilize various clamps for rigidly gripping the cable. However these clamps usually engage the cable over a very short distance and repeated flexing of the cable at the clamp leads to cable failure. Furthermore, the housings provided by the manufacturers are very expensive and the cables usually exit the housing directly behind and in a direction away from the connector which is undesirable from the standpoint of space and cable layout in many instances.


A method includes detecting, by a Local Control Network (LCN) Monitor, a transmission of a data packet from a first device to at least one second device over the LCN. The LCN Monitor is not a source or destination of the data packet. The method also includes obtaining, by the LCN Monitor, a copy of the transmitted data packet. The method further includes decoding, by the LCN Monitor, the obtained data packet. In addition, the method includes storing, by the LCN Monitor, the decoded data packet in a storage device.

Devices in an industrial process control and automation system often continuously communicate with one another to perform various functions related to process control and optimization. These devices typically communicate with one another without tracking or recording their communications. Some industrial process control and automation systems include one or more process historians that can record specific types of data, but many transmissions between devices in the industrial process control and automation systems are used and then discarded without long-term storage.

System and method for capturing and displaying packets and other messages in local control network (LCN)


A device includes a test pad on a chip. A first microbump has a first surface area that is less than a surface area of the test pad. A first conductive path couples the test pad to the first microbump. A second microbump has a second surface area that is less than the surface area of the test pad. A second conductive path couples the test pad to the second microbump.

Integrated circuits have experienced continuous rapid growth due to constant improvements in the integration density of various electronic components (i.e., transistors, diodes, resistors, capacitors, etc.). For the most part, this improvement in integration density has come from repeated reductions in minimum feature size, allowing more components to be integrated into a given chip area.
The volume occupied by the integrated components is near the surface of the semiconductor wafer. Although dramatic improvements in lithography have resulted in considerable improvements in two-dimensional (2D) integrated circuit formation, there are physical limitations to the density that can be achieved in two dimensions. One of these limitations is the minimum size needed to make these components. Further, when more devices are put into one chip, more complex designs are required. An additional limitation comes from the significant gains in the number and length of interconnections between devices as the number of devices increases. When the number and length of interconnections increase, both circuit resistive-capacitive (RC) delay and power consumption increase.
Three-dimensional integrated circuits (3DIC) were thus formed to address issues raised by increase in circuit densities. The dies are stacked, with wire-bonding, flip-chip bonding, and/or through-silicon vias (TSV) being used to stack the dies together and to connect the dies to package substrates. Circuit probe (CP) testing of advanced semiconductor chips and 3DIC with high device density becomes challenging.

Testing of semiconductor chips with microbumps

Taiwan Semiconductor Manufacturing Co., Ltd.