A lead frame of a plastic encapsulated type semiconductor device is provided with a coating film which has a solderability higher than a solderability of a basic metal of the lead frame, and the coating film has a corrosion potential higher than a corrosion potential of the basic metal. The coating film protects the basic metal from corrosion caused by the plastic encapsulated member. The coating film of the lead frame made of a Fe-Ni alloy is an alloy comprising metal selected from Mo, W, Au, Cr, Cu, metals of the platinum group and a metal selected from Fe, Co, and Ni.

1. Field of the Invention
The present invention relates to a novel plastic encapsulated type semiconductor device and a lead frame comprising Fe-Ni group alloy used for the same.
2. Description of the Prior Art
Two kinds of materials of Cu alloy and Fe-Ni group alloy are used mainly as materials for a lead frame of a plastic encapsulated type semiconductor device. The two kinds of materials have features that, while the former has good thermal conductivity and almost equal thermal expansion coefficient to a resin for encapusulation, the latter has superior oxidation resistance and almost equal thermal expansion coefficient (4.0.about.10.0.times.10.sup.-6 K.sup.-1) to Si (thermal expansion coefficient: 3.6.times.10.sup.-6 K.sup.-1) etc. Currently, accompanying with higher integration of a semiconductor chip, there is a tendency to increase heat generated from a semiconductor tip and to enlarge the size of a semiconductor chip. A lead frame made of Cu alloy is suitable for mounting of a semiconductor chip having large heat generation rate and relatively small size, but for mounting of a semiconductor chip having larger size, the lead frame has a disadvantage in that cracks develop on a device owing to a stress induced by a difference of thermal expansion of the lead frame and the semiconductor chip. Therefore, as a lead frame for mounting of a semiconductor chip of larger size; a lead frame made of Fe-Ni alloy is preferable. But, alloys by prior art such as 42% alloy (42% Ni, residual Fe) and 50% alloy (50% Ni, residual Fe) are inferior to a Cu alloy in corrosion resistance, adhesiveness with a resin, and solderability.
As to means for solving problems of the lead frame made of Fe-Ni alloy, a method to add a chemical element such as Cu to the alloy to improve the characteristics of the alloy itself is disclosed in the JP-A-63-169056 (1988), and another method to put a plating layer of Cu on surface of the lead frame to improve the characteristics of surface of the lead frame is disclosed in the JP-A-63-169056 (1988), and further a method to form a coating film of Ni, Co, Au, Ag, and Cu alloy containing Pd more than 40% is disclosed in the JP-B-63-49382 (1988).
Among the prior arts described above, either of a method to add a chemical element such as Cu etc. to a Fe-Ni alloy and a method to put a metallic layer such as Cu plating layer etc. on surface of a lead frame, are effective in improving corrosion resistance and adhesiveness with a resin of the lead frame. Nevertheless, the former method has a disadvantage of increased thermal stress in the lead frame and the semiconductor tip owing to the increment of thermal expansion coefficient by adding of a chemical element to the alloy, and the latter method has another disadvantage of lowered solderability owing to an oxidation of Cu on the surface of the lead frame in a process of packaging. And, a current trend of high integration needs increasingly higher reliability of a semiconductor package, especially a technique to prevent a crevice corrosion which will be generated at an interface of a lead frame and a resin is indispensable for improvement of reliability on humidity protection. Nevertheless, the prevention of the crevice corrosion was not considered in the prior art. Further, a coating film containing Pd more than 40% has defects when the coating film is formed by plating, and a problem has been existing that the defects accelerate corrosion.


An air intake system for directing intake air to an internal combustion engine of a machine is disclosed. The air intake system may comprise an air compressor configured to increase a pressure of the intake air, and a membrane unit downstream of the air compressor and having a membrane with selectivity for siloxanes. The membrane may have a first side and a second side, and the first side may be exposed to a higher pressure than the second side when the air compressor is operating. The membrane may be configured to separate the intake air into a permeate that traverses the membrane from the first side to the second side, and a retenate that remains on the first side. The permeate may have a higher siloxane content than the retenate. The retenate may be directed to the internal combustion engine for combustion.

Many machines and equipment operate in waste environments such as landfills, waste transfer stations, or recycling stations. In such waste environments, the local atmosphere may include airborne, gas phase siloxanes released from industrial or commercial products, such as electronic products and personal care products. When present in significant amounts, such airborne siloxanes may be inadvertently drawn into the machine's air intake system for combustion along with ambient intake air. Upon combustion, the siloxanes may produce silicon dioxide (SiO2) which may coat engine parts (e.g., valves, turbocharger components, exhaust gas recirculation (EGR) components, etc.), enter the oil, and form deposits on components of the exhaust aftertreatment system such as the diesel oxidation catalyst (DOC) and the diesel particulate filter (DPF).
The coating of SiO2 on engine parts may accelerate wear of the coated parts and reduce engine performance, and may interfere with the ability to overhaul/rebuild the engine. Moreover, exposure of EGR components to SiO2 may lead to reduced heat transfer at the EGR cooler, as well as plugging of the EGR venturi and the EGR intake pressure sensor with SiO2 deposits. Furthermore, prolonged exposure to SiO2 in the exhaust aftertreatment system may lead to an increase in the rate of non-combustible accumulation in the DPF, face-plugging of the DOC and DPF with SiO2 deposits, and increased back pressure. Sensors of the exhaust aftertreatment system (e.g., thermocouples, NOx sensors, etc.) may also become coated or plugged with SiO2 deposits, leading to inaccurate readings or delayed response times. Consequently, high concentrations of siloxanes (e.g., >0.1 mg/m3) in ambient air may undesirably increase machine downtime to replace parts as well as maintenance costs.
To reduce exposure of engine parts and aftertreatment components to SiO2, some stationary machines may pretreat fuel going to the engine to remove siloxanes before combustion. However, such strategies may be impractical for application to mobile machines due to factors such as cost, restriction, service interval requirements, durability requirements, and packaging constraints.
In addition, U.S. Patent Application Publication Number 2016/0258392 discloses a siloxane filtration system to filter out siloxanes from intake air going to a diesel engine of a work vehicle. While effective, strategies providing effective gas phase separation of siloxanes from intake air are still desired. Clearly, there is a need for improved strategies for removing siloxanes from intake air for machines operating in waste environments.

Air intake system with membrane unit for siloxane removal


The flow of a biological fluid to an organ is computer-controlled so that the natural variation of such flow is simulated. Specifically described are control of a blood pump flow output during CPB to mimic normal pulsatile blood flow from the heart and control of a ventilator output to mimic normal breathing of healthy lungs. A pattern of variation over time of instantaneous flow of a biological fluid to an organ of a mammalian species is established, a variable control parameter for regulation of flow of the biological fluid to the organ is generated in accordance with the pattern, and the flow of biological fluid to the organ is controlled in accordance with the variable control parameter.

During cardiopulmonary bypass surgery (CPB), the most common operation conducted in North America, the heart is stopped and the blood which normally returns to the right side of the heart passes through a pump and oxygenating system and is returned to the aorta, thereby bypassing the heart and lungs. The flow of blood is essentially non-pulsatile with a low amplitude waveform having monotonous regularity.
Although a common procedure (in excess of 400,000 open heart procedures per annum are conducted in North America) and although tremendous strides have been made so that open heart surgery is safer for patients, the procedure is not without its dangers. Although the vast majority of patients have marked improvement in their cardiac functional status following their procedure, of concern is the potential for damage to other organ systems which can occur due to the need for CPB.
The following consequences have been identified with conventional non-pulsatile CPB, namely metabolic acidosis, interstitial fluid accumulation, elevated systemic vascular resistance, arteriovenous shunting and impaired brain oxygenation. Of greatest concern is the potential for neurologic damage. Increasingly, well conducted prospective trials have demonstrated an alarming rate of post-operative neuropsychologic disturbances following cardiac surgery. Recent studies have shown that up to 60 percent of patients undergoing open heart surgery have neuropsychologic deficits following their operation, so that as many as 240,000 patients per annum may develop neurologic abnormalities following cardiac surgery. These disturbances are subtle but involve higher cognitive functions of the brain.
Mechanical ventilation of the lungs represents one of the major accomplishments of modern medicine and is one of the cornerstones upon which modern surgery and intensive care is based. Despite many major advances, mechanical ventilation is still associated with a number of alterations in respiratory function which causes morbidity and mortality in patients requiring this type of support. Inability to maintain gas exchange remains one of the major limiting factors with regard to life-support of critically ill patients. Even in healthy patients being ventilated during elective surgery, alterations in gas exchange can be demonstrated. These relate to collapse of small airways and alveoli. Prevention of these alterations would likely represent a major advance in management of all patients requiring ventilatory support. Conventional mechanical ventilation is monotonously regular in delivery of set tidal volume and respiratory rate.
The monotonous regularity of pumping of blood during CPB and of set tidal volume and respiratory rate of a mechanical ventilator is in contrast to the intrinsic spontaneously variable rhythms of heart rate, blood pressure and respiration, associated with a normal functioning heart as well as the considerable range of tidal volume and respiratory rate which a healthy individual demonstrates during breathing.


Dot-pattern-like impurity regions are artificially and locally formed in a channel forming region. The impurity regions restrain the expansion of a drain side depletion layer toward the channel forming region to prevent the short channel effect. The impurity regions allow a channel width W to be substantially fined, and the resultant narrow channel effect releases the lowering of a threshold value voltage which is caused by the short channel effect.

1. Field of the Invention
The present invention relates to the structure of an insulated gate semiconductor device formed using a crystalline semiconductor substrate, for example, a monocrystal silicon substrate or an SOI substrate (SIMOX or the like), and more particularly to the structure of an insulated gate field effect transistor (hereinafter referred to simply as "IG-FET") and a method of manufacturing the same. The present invention relates to a technique of which advantages are especially exhibited in the case of manufacturing a fine device whose channel length is 1 .mu.m or less (representatively, 0.01 to 0.35 .mu.m.
Therefore, the present invention is applicable to a semiconductor integrated circuit such as an IC, a VLSI or a ULSI, which is structured with integrated IG-FETs.
2. Description of the Related Art
In recent years, integrated circuits such as the VLSI are kept on becoming more fine, and the machining dimensions in the order of a deep sub-micron are required, for example, the width of a wiring is 0.18 .mu.m or less, further 0.1 .mu.m or less.
Up to now, the fining of a semiconductor device is progressed in accordance with the scaling rule, and there has been generally known that the fining leads to an improvement in the characteristic of the integrated circuit. However, the fine machining in the order of the sub-micron suffers from a problem that it does not simply accord to the scaling rule.
The representative problem of this type as known is a phenomenon such as a short channel effect. The short channel effect is the phenomenon caused by the reason that as the line width of a gate electrode is shortened, that is, a channel formation region is shortened the charges in the channel formation region becomes to be largely influenced by not only a gate voltage but also the charges in a depletion layer of a source/drain region, an electric field and a potential distribution.
This state is simplified and shown in FIG. 3.
Reference numeral 301 denotes a source region, reference numeral 302 denotes a drain region, reference numeral 303 denotes a channel region, and reference numeral 304 denotes a gate electrode. Also, a dotted line indicated by reference numeral 305 represents a depletion layer which is formed when a drain voltage Vd is small.
Normally, a current that flows in the channel region 303 is controlled by only a gate voltage Vg. In this case, as indicated by reference numeral 305, since the depletion layer which is in the vicinity of the channel region 303 is substantially in parallel with the channel, a uniform electric field is formed.
However, as the drain voltage Vd becomes high, the depletion layer which is in the vicinity of the drain region 302 is expanded toward the channel region 303 and the source region 301, with the result that as indicated by a solid line 306, the charge and the electric field in the drain depletion layer become to influence the depletion layer which is in the vicinity of the source region 301 and the channel region 303. In other words, an on-state current is changed according to a complicated electric field distribution, thereby making it difficult to control the current which flows in the channel region 303 by only the gate voltage Vg.
Here, an energy state in the periphery of the channel formation region when the short channel effect occurs will be described with reference to FIG. 4. In FIG. 4, state graphs indicated by solid lines represent energy bands of the source region 401, the channel formation region 402 and the drain region 403, respectively, when the drain voltage is 0 V.
In this state, when the drain voltage Vd which is sufficiently large is applied, the energy bands are changed into the states indicated by dotted lines in FIG. 4. In other words, the depletion charges and the electric field in the drain region 103 which are formed by the drain voltage Vd influence the charges in the depletion layers of the source and channel regions 401 and 402 so that an energy (potential) state is continuously changed from the source region 401 to the drain region 403.
The deterioration of a threshold value voltage (Vth) and a punch-through phenomenon have been well known as an influence of such a short channel effect on the semiconductor device, for example, the IG-FET. Also, there has been known that a sub-threshold characteristic is deteriorated when an influence of the gate voltage on the drain current by the punch-through phenomenon is lowered.
First, the deterioration of the threshold value voltage is a phenomenon that occurs in an n-channel FET and a p-channel FET, similarly. Also, the degree of the deterioration depends on not only the drain voltage but also a variety of parameters such as the concentration of impurities in a substrate, the depth of source/drain diffusion layer, the thickness of a gate oxide film, a substrate bias and so on.
The deterioration of the threshold value voltage is desirable from a viewpoint of lowering a power consumption, however, there generally arises such a disadvantage that a frequency characteristic is not increased because the drive voltage of the integrate circuit becomes small.
Under that circumstance, up to now, as means for controlling the threshold value voltage, it is general to uniformly add the impurity elements that give one conduction to the entire channel formation region, to control the threshold value voltage with the amount of addition of the impurity elements. However, even with this method, the short channel effect per se cannot be prevented, and the punch-through phenomenon is caused to occur. Also, since the added impurities allow carriers to be scattered, the mobility of carriers is caused to be lowered.
Also, the deterioration of the sub-threshold characteristic which is accompanied by the punch-through phenomenon means that the sub-threshold coefficient (S value) is increased, that is, the switching characteristic of an FET is deteriorated. An influence of the short channel effect on the sub-threshold characteristic is shown in FIG. 5.
FIG. 5 is a graph taking the gate voltage Vg in a horizontal axis and the logarithm of the drain current Id in a vertical axis. The inverse number of a slope (sub-threshold characteristic) in the region 501 is an S value. In FIG. 5, the changes of characteristics when gradually shortening the channel length are compared, and the channel length is shortened toward a direction indicated by an arrow.
As a result, there can be confirmed that the slope of the-characteristic is decreased, that is, the S value is tended to be increased with the channel length being shortened. This means that the switching characteristic of the FET is deteriorated with the channel length being shortened.
The above-description is made to the short channel effect in the case of extremely shortening the length of the channel formation region of the semiconductor device. In the case of extremely narrowing the width of the channel formation region, the phenomenon such as the narrow channel effect also occurs.
What is shown in FIG. 6 is a cross-sectional view showing a normal IG-FET being cut on a plane perpendicular to the channel direction (a direction connecting the source and the drain). Reference numeral 601 denotes a monocrystal silicon substrate, and reference numeral 602 denotes a field oxide film formed through the selectively oxidizing method. The respective semiconductor devices used in the VLSI are separated by the field oxide film 602, respectively.
Also, reference numeral 603 denotes a gate electrode to which a voltage is applied to form a channel region 604. Impurity region 605 is disposed below the field oxide film 602 and functions as a channel stopper.
The narrow channel effect is caused in such a manner that a bird beak portion is which is an intrusion of the field oxide film 602 and the impurity region 605 into the channel region 604 largely influences the channel region 604 as the channel width W is narrowed. In particular, there may be cited an increase in the threshold value voltage and a dependency of the effective channel width on a supply voltage.
In the existing semiconductor industry, a semiconductor integrated circuit which has been integrated up to the limit has been demanded, and it is important to which degree the fining of the respective semiconductor devices can be pursued. However, even if a technique to form a fine pattern in the order of the deep sub-micron is developed, the problem of the above-mentioned short channel effect leads to a fatal obstacle that obstructs the fining of the device.

Insulated gate semiconductor device and method of manufacturing the same

Semiconductor Energy Laboratory Co., Ltd.


A database system has a contention monitor which determines when the level of contention for accessing or inserting records in the database rises above a threshold, and inhibits non-critical access to the database to reduce the level of contention. In a preferred embodiment, the level of contention is determined by periodically measuring the time for an INSERT operation on the database, and comparing the time to a threshold derived from a baseline time measurement for the operation during a time of normal database activity. Thus the contention level is inferred from the time to do the operation, in this case the INSERT query. In one embodiment, the contention monitor notifies a system administrator to take action to reduce the contention. In another embodiment, the contention monitor informs the system to take action automatically according to predetermined selections by the system administrator.

1. Technical Field
This invention generally relates to computer systems, and more specifically relates to access in a computer database system.
2. Background Art
Database systems have been developed that allow a computer to store a large amount of information in a way that allows a user to search for and retrieve specific information in the database. For example, an insurance company may have a database that includes all of its policy holders and their current account information, including payment history, premium amount, policy number, policy type, exclusions to coverage, etc. A database system allows the insurance company to retrieve the account information for a single policy holder among the thousands and perhaps millions of policy holders in its database.
Retrieval of information from a database is typically done using queries. A query usually specifies conditions that apply to one or more columns of the database, and may specify relatively complex logical operations on multiple columns. The database is searched for records that satisfy the query, and those records are returned as the query result. A type of query that accesses the database is INSERT data. Data is typically added to the database using an INSERT. When a job inserts data into the database the database locks out access to other jobs. Contention occurs when one or more jobs attempt to access data that has been locked.
In a large data warehousing environment, real time data querying is very important. When a large number of jobs need to insert and/or access the data at the same time, contention on the database rises, and the time to make the inserts become excessive. The contention may be caused by not only the INSERT jobs but the other parts of the application that are querying and updating the data in real time from user input. In some applications, the jobs that are inserting records to the file are critical and cannot fall behind in processing the incoming data. Simply adding more jobs to make the inserts is not effective because it would merely increase the contention. Without a way to reduce database contention to improve system performance, the computer industry will continue to suffer from excessive delays in database accesses caused by contention in the database.

Inhibiting non-critical access based on measured performance in a database system

International Business Machines Corporation


A high efficiency wavelength up-conversion transparent glass ceramics composition is provided containing a rare earth ion, which can be applied to short wavelength solid lasers, full color displays, infrared light detecting sensors, etc. The ceramic composition has the following chemical composition, in which fluoride fine crystals containing rare earth ions are preferentially precipitated:. ______________________________________ SiO.sub.2 10-60 mol % AlO.sub.1.5 0-40 mol % GaO.sub.1.5 0-40 mol % PbF.sub.2 5-60 mol % CdF.sub.2 0-60 mol % GeO.sub.2 0-30 mol % TiO.sub.2 0-10 mol % ZrO.sub.2 0-10 mol % ReF.sub.3 or ReO.sub.1.5 0.05-30 mol % (Re = Er, Tm, Ho, Yb, Pr, etc.). ______________________________________

1. Field of the Invention
This invention relates to a high efficiency wavelength up-conversion transparent glass ceramics composition containing rare earth ions, which can be applied to short wavelength solid lasers, full color displays, infrared light detecting sensors, etc. and a process for the production of the same.
2. Description of the Related Art
Lately, wavelength up-conversion materials utilizing the electronic transition between a plurality of energy levels of rare earth ions have been watched with keen interest because they can be applied to various fields such as blue or green solid lasers, full color displays, infrared light detecting sensors, etc. As a transparent wavelength up-conversion material with a relatively high conversion efficiency, fluoride single crystals and glasses have hitherto been known however, it is impossible to produce a fluoride single crystal having an optical homogeneity and practical large size on a commercial scale and in an economical manner, since the fluoride single crystal is excellent in conversion efficiency, mechanical strength and chemical stability, but is difficult growth of a high quality one. On the other hand, since the fluoride glass in the form of a fiber is capable of effectively sealing up an excitation light in a fiber core, a visible light fiber laser having the highest infrared conversion efficiency has been obtained at the present time. However, the fluoride glass is inferior to the fluoride single crystal in thermal, mechanical and chemical stability and has problems of durability, reliability, etc. For example, the fluoride glass tends to be deteriorated by erosion with water and when subjected to irradiation by a laser beam with a large power, it is very liable to be damaged. For the preparation of a fluoride glass fiber, furthermore, precise control of the preparation conditions such as temperature, atmosphere, etc. is indispensable, thus resulting in an increase of the production cost.
On the other hand, as a glass having a very high stability, there is known a composition, typical of optical glasses, comprising, as a predominant component, oxides. Ordinary optical glasses containing the so-called glass-forming materials having a very high chemical bonding strength, such as SiO.sub.2, GeO.sub.2, AlO.sub.1.5, BO.sub.1.5, PO.sub.2.5, etc., exhibit high viscosity and are much more excellent in moldability, water resistance, mechanical strength, etc. than fluoride glasses containing ionic bonding compounds. In oxide glasses, however, the emission efficiency from a number of rare earth ion levels is lower by several figures than that of fluorides, and the oxide glasses are not suitable for use as applying devices utilizing emission of rare earth ions, for example, laser materials.
As the wavelength up-conversion material of the prior art, the glass consisting of high quality fluoride meets with a higher production cost and the oxide glass with high stability meets with a lower emission efficiency.

Wavelength up-conversion transparent glass ceramics

Nippon Telegraph and Telephone Corporation


The constriction plate in a fluidized bed incinerator is pivotally mounted for swinging movement down into the windbox. Thereby, the fluidized bed can be rapidly emptied into the windbox, whereby heat sensitive members in the incinerator will not be damaged by the hot refractory particles in the bed.

The present invention relates to an arrangement in incinerator in which fuel is burned in a fluidized bed of refractory particles and the fluidizing air is supplied from a windbox through a constriction plate which carries the fluidized bed
In incinerators operating with a fluidized bed of refractory particles, e.g. sand, pipe coils are often used in the fluidized bed for the circulation of a coolant for cooling the bed. If the circulation of coolant fails, the pipe coils may burn out. A burning out of the coils, the tuyeres or other members arranged in the incinerator may also occur if for other reasons the temperature of the bed should become excessive.
The object of the present invention is to provide an arrangement in incinerators of the above mentioned type which allows the incinerator to be rapidly put out of operation and at the same time protects costly and sensitive elements of the incinerator from the residual heat in the fluidized bed.


The present invention relates generally to catalysts, to methods of making catalysts, to methods of using catalysts, to methods of polymerizing, and to polymers made with such catalysts. More particularly, the present invention relates to polyolefin catalysts and to Ziegler-Natta catalysts, to methods of making such catalysts, to methods of using such catalysts, to polyolefin polymerization, and to polyolefins.

A Ziegler-Natta type polymerization catalyst component can be a complex derived from a halide of a transition metal, for example, titanium, chromium or vanadium, with a metal hydride and/or a metal alkyl that is typically an organoaluminum compound. The catalyst component is usually comprised of a titanium halide supported on a magnesium compound complexed with an alkylaluminum. Usual methods for synthesizing Ziegler-Natta catalyst systems require six or more steps, and the use of expensive specialty chemicals such as blends. Examples of catalyst systems, their methods of preparation and use are provided in U.S. Pat. Nos. 4,107,413; 4,294,721; 4,439,540; 4,114,319; 4,220,554; 4,460,701; 4,562,173; 5,066,738, 6,693,058; 6,174,971; 6,734,134; 6,846,887; 6,864,207; 6,916,895, 6,930,071; and 6,486,274; as well as in U.S. Pat. App. Nos. 2005/0209094; 2003/0018143; 2004/0058803; and 2004/0058802. Any improvement in the production of these catalysts that decrease their cost while maintaining or improving performance would be extremely valuable.


A diverter flowline seal assembly for use in subsea drilling. The seal assembly includes a seal body having an inner diameter end and an outer diameter end formed of an inflatable elastomeric material having a first modulus. The inner diameter end of the seal body includes two diametrically opposed axially inward lip portions and two diametrically opposed axially outward base portions. Integrated with the inflatable elastomeric material at the base portions of the inner diameter end of the seal body is a material having a modulus that is higher than the modulus of the inflatable elastomeric material so as to prevent the radial expansion of the lip portions and the base portions of the inner diameter end of the seal body.

The present invention generally relates to diverters and in particular to a diverter flowline seal used in subsea drilling.
Installing large diameter elastomeric diverter flowline seals can often be difficult since compressing a substantial amount of rubber into sealing position can require substantial force that is not always available. Also, stabbing an external piston type seal into a bore without damaging the seal or surrounding hardware is difficult when the diameters of the seal and surrounding hardware are equal to or greater than the receiving bore diameter. Unidirectional elastomeric seals such as a lip seal can be used to alleviate stabbing problems since they do not require cross-sectional compression of the elastomeric material by utilizing a lip that can easily be bent inward. However, many seal applications require bidirectional sealing and using two lip seals is not desirable since one lip seal must be stabbed in a direction that could snag the lip.
A diverter flowline seal used in subsea drilling that must be stabbed into a mating bore, is an example of a large diameter seal that is difficult to install. A common practice is to use an inflatable seal that, in its preinstalled state, has significant clearance with the mating bore, and when inflated with auxiliary fluid pressure, expands to firmly engage and seal against the bore. This type of seal is easy to install and once inflated provides bidirectional sealing.
Conventional diverter flowline seal designs rely on rigid metal end rings partitioned by a bonded elastomeric sealing element which can be slipped onto and retained on a stabbing mandrel. Elastomeric seals such as o-rings form a seal between the inner diameter of the metal rings and the exterior of the stabbing mandrel. A channel within the stabbing mandrel transmits auxiliary fluid pressure between the two end ring seals and inflates the bonded elastomeric section of the flowline seal assembly after the mandrel is stabbed into position. The inflated bonded elastomeric section expands to contact the receiving bore and a bidirectional seal is created between the diverter flowline seal and the receiving bore. An inherent weakness in this design, however, is located at the bonded boundary between the rigid metal end rings and the inflatable elastomeric section. Fatigue at this highly stressed boundary causes bond separation or tearing of the elastomeric sealing element and initiates a leak.
Another conventional diverter flowline seal design is shown in U.S. Pat. Nos. 5,890,535 and 6,290,231. The diverter flowline seal design shown in these patents eliminates the potential leakage across the bonded area between the rigid metal end rings and the inflatable elastomeric section by moving the sealing bead of the internal seals that seal off against the stabbing mandrel from the inner diameters of the metal rings to lip seals that are formed within the bonded elastomeric section. Shoulders extending from the rigid metal end rings extend over the internal lip seals and restrict expansion of the lip diameters during inflation. The contrasting material modulus at the boundaries of the rigid metal end rings and the inflatable elastomeric section, however, still creates high stress concentrations with the elastomeric section and can initiate tearing at this boundary.

Inflatable seal with fabric expansion restriction


A display panel and a display device are provided. The display panel includes a display area configured to display an image and a dummy pixel area disposed outside of the display area. The dummy pixel area has a plurality of dummy pixels disposed therein. Each dummy pixel includes a pixel protection unit. The dummy pixels are defined by crisscrossing data metal lines and gate metal lines in a vertical direction and a horizontal direction, respectively. A pattern of a projection of a semiconductor layer on the horizontal plane intersects the corresponding data metal line, is separated from the corresponding gate metal line, and is disposed toward a center of each dummy pixel, to prevent the display device from poor display due to contact between the semiconductor layer and the gate metal lines in the dummy pixel area when electrostatic discharge occurs.

Liquid crystal display devices are widely used as display devices for information communication terminals, such as computers and television receivers. In addition, organic light emitting diode (OLED) display devices, field emission devices (FEDs), and the like, as thin display panels, are well known to those skilled in the art. The liquid crystal display device is a device that displays an image by controlling orientation of liquid-crystal molecules enclosed between two substrates by changing an electric field, thereby controlling a degree of transmission light passing through the two substrates and the liquid-crystal molecules.
In the liquid crystal display device, a display panel configured to apply a voltage corresponding to a predetermined gradation value to each pixel of an image includes thin film transistors configured to apply the voltage corresponding to the gradation value to each pixel. In general, a gate of the thin film transistor of the pixel in one row of the image is connected to a signal line (hereinafter referred to as "gate signal line"), and a drive circuit is controlled so as to output a voltage for turning on the thin film transistor to the gate signal line in order. In addition, at an edge of a display area, dummy pixels are arranged outside the display area so that structural changes and electromagnetic changes due to the edge of the display area do not affect display.
Currently, low temperature poly-silicon (LTPS) display devices and single crystalline silicon thin film transistor display devices have no electrostatic discharge (ESD) protection structure in display areas. A dummy pixel area of the display device is a high incidence area of ESD. Electrostatic discharge of a dummy pixel causes a semiconductor layer in the dummy pixel area of the display device to come into contact with a gate metal line and cause a short circuit between the semiconductor layer and the gate metal line, resulting in poor display when the display device displays. Therefore, it is necessary to provide a display device to solve problems existing in existing technologies.

WUHAN CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.


Disclosed is a xerographic printing apparatus and print cartridge including a deformable electrically conductive ring. According to an exemplary embodiment, a xerographic image rendering print cartridge includes a drive shaft, a photoreceptor drum and a deformable electrically conductive ring operatively associated with electrically connecting an inside surface of the photoreceptor drum to the drive shaft to provide a grounding electrical path.

This disclosure relates to xerographic or electrostatographic printing machines, and more particularly to a robust apparatus and method of grounding an electrically conductive drum photoreceptor assembly in such a printing machine. The phrase printing machine includes both printing and copying devices.
As is well known, the electrically conductive photoreceptor in an electrophotographic or xerographic printing machine requires grounding for proper operation. One conventional grounding apparatus and method employs a metal strip mechanically attached to one of the non-metallic flanges that cap the ends of the electrically conductive photoreceptor. One end of the metal strip contacts the inside of the electrically conductive photoreceptor while the other end of the metal strip contacts the center metal shaft which rotates the photoreceptor, thus completing the grounding circuit. Any deformation of the metal strip during assembly, however, can result in loss of ground, either permanently or intermittently. Repair of the metal strip within the photoreceptor is difficult since the end flanges are glued in.
Examples of prior efforts at grounding the conductive photoreceptor include U.S. Pat. No. 5,537,189 entitled "Printing apparatus which grounds photoreceptor independently of CRU" that discloses an electrostatographic printing apparatus having (a) a detachable imaging module including a housing and a photosensitive member, wherein the photosensitive member is partially enclosed within the housing, and wherein the photosensitive member has an outer surface which includes an electrically conductive portion; (b) an electrically grounded component free of attachment to the module; and (c) an electrically conductive part, free of attachment to the module, in contact with both the grounded component and the conductive portion on the outer surface of the photosensitive member, thereby establishing grounding of the photosensitive member, and wherein upon removal of the imaging module the part remains in contact with the grounded component and upon insertion of a new detachable imaging module which has a new photosensitive member having an outer surface that includes an electrically conductive portion, the part contacts the electrically conductive portion on the outer surface of the new photosensitive member, thereby establishing grounding of the new photosensitive member.
U.S. Pat. No. 5,815,773 entitled "Composite photoreceptor flange" discloses an end flange capable of translating a rotational force from an outside source to a hollow cylindrical member is disclosed. The end flange is made from a composition which includes polycarbonate, polytetrafluorethylene, and glass. The end flange may be used to rotate an electrophotographic imaging member past a charging station, for generation of a uniform electrical potential thereon, and subsequent selective discharging of the imaging member and development of an electrostatic latent image. Most notably, mounting of the end flange to the imaging member does not require the use of an adhesive material. This enables successful recycling of the imaging member, and results in significant cost savings.
U.S. Pat. No. 5,752,136 entitled "Imaging member end flange and end flange assembly" discloses a hollow cylindrical electrostatographic imaging member supporting end flange including a disk shaped member, a supporting hub extending axially from the disk shaped member and a metal disk coaxially secured to the hub, the disk comprising a plurality of rectangular tabs extending radially from the disk in a direction away from an imaginary axis of the hub for engagement with the hollow cylindrical electrostatographic imaging member upon insertion of the hub and disk shaped member into one end of the hollow cylindrical electrostatographic imaging member. When this end flange is inserted into one end of the hollow cylindrical electrostatographic imaging member, the plurality of rectangular tabs extending radially from the disk engage the inner surface of the hollow cylindrical electrostatographic imaging member.
U.S. Pat. No. 7,103,297, entitled "Robust Apparatus and Method of Grounding a Drum Photoreceptor Assembly" discloses a photoreceptor grounding apparatus including (a) a flange including a first portion having a first diameter and a second portion having a second and smaller diameter; (b) a conductive plating formed on said flange presenting a relatively large conductive surface area for contactably assembling against walls of the conductive photoreceptor drum; and (c) an electrical connector for electrically connecting the large conductive surface area of the conductive plating to an electrically conductive drive shaft of the xerographic image producing machine.
Unfortunately, it has been found that electrical connections using such tabs or clips is not always properly made due to corrosion of or damage to the tabs or clips which are, of a necessity, made from a lightweight strip of very flexible and hence easily damaged strip of metal. These tabs or clips in addition only present a relatively small surface area to work with, and damage to them often includes bending. They may also be installed improperly and foreign material such as glue used to secure the drum to the flange may also interfere with this connection.

Drive shaft electrical contact for print cartridge photoreceptor grounding


The invention relates to a single-component adhesive system that consists at least of a casting resin, in particular of an epoxy casting resin, and a multivalent alcohol. The low-viscosity adhesive system can be microdosed, is stable in storage, is completely hardenable and is suitable for applications in which the dimensional tolerances are in the .mu.m and sub-.mu.m region.

The invention relates to a casting resin system that is suitable for the formation of glued bonds having dimensional tolerances in the micrometer and sub-micrometer (".mu.m and sub-.mu.m") region.
For micro-glued bonds, adhesive systems are known that consist in general of a resin component and a hardener component. These two-component adhesive systems present problems in the small quantities in which they are required for glued bonds in the micro-region in particular in the exact dosing, mixing and homogenization of the individual components immediately before application. Another disadvantage is that they standardly have an excessively high viscosity, and are thus only at higher temperatures (approx. 70.degree. C.) liquid enough that the application of the adhesive for the microdosing--known as LVA (low-viscosity adhesives) adhesives--can take place. The known two-component systems have the further disadvantage that due to their non-homogeneities in thin layers or small drops they harden only incompletely, even in an inert gas or nitrogen atmosphere. All these factors have the result that up to now it has not been possible to realize, with the required reproducible quality, compounds that are technically acceptable for commercial manufacturing with respect to bond strength and dimensional tolerance in the .mu.m and sub-.mu.m region (smaller than 1 .mu.m).
There is thus a need for an adhesive system that enables an efficient, automated, reliable, low-cost bonding technique for low-cost electronics and optoelectronics systems. In particular, there is a need for adhesive systems for glued bonding in the .mu.m and sub-.mu.m region that can be reliably dosed and hardened in extremely thin layers or small drops. The mentioned dimensions should thereby also be maintained after hardening.

Heat-setting single-component LVA (low-viscosity adhesive) system for bonding in the micro-range


Methods of forming a dielectric layer on a substrate are described, and may include introducing a first precursor into a remote plasma region fluidly coupled with a substrate processing region of a substrate processing chamber A plasma may be formed in the remote plasma region to produce plasma effluents. The plasma effluents may be directed into the substrate processing region. A silicon-containing precursor may be introduced into the substrate processing region, and the silicon-containing precursor may include at least one silicon-silicon bond. The plasma effluents and silicon-containing precursor may be reacted in the processing region to form a silicon-based dielectric layer that is initially flowable when formed on the substrate.

As integrated circuit chipmakers continue increasing the density of circuit elements on each chip, filling the gaps that separate those elements becomes more challenging. The increased circuit element density has necessitated shorter widths between adjacent elements. As the width of these gaps shrink faster than their height, the ratio of height to width (known as the aspect ratio) proportionally increases. It is more difficult to fill a tall and narrow gap (i.e., a high aspect ratio gap) with a uniform film of dielectric material than a shallow and wide gap (i.e., a low aspect ratio gap).
One commonly encountered difficulty with filling high aspect ratio gaps is the formation of voids. In high aspect ratio gaps, there is a tendency of the dielectric material filling the gap to deposit at a faster rate around the top end of the gap. Often the dielectric material will close the top before the gap has been completely filled, leaving a void. Even when the top of the gap does not close prematurely, the uneven growth rate of the dielectric film down the sidewalls of the gap can create a weak seam in the middle of the gapfill. These seams can later result in cracks that adversely affect the physical integrity and dielectric properties of the device.
One technique to avoid the formation of voids and weak seams in dielectric gapfills is to fill the gap at a lower deposition rate. Lower deposition rates can give the dielectric material more time to redistribute on the inside surfaces of the gap to reduce the chances of excessive topside growth. A lower deposition rate may also be the result of increased etching or sputtering that occur at the same time as the dielectric deposition. For example, in HDPCVD dielectric material at the top corners of the gap etch away faster than material on the sidewalls and bottom portion of the gap. This increases the chances that the topside of the gap will remain open so the sidewalls and bottom can completely fill with dielectric material. However, reducing the dielectric deposition rate also results in the deposition taking longer to complete. The longer deposition times decrease the rate at which substrate wafers are processed through the deposition chamber, resulting in a reduced efficiency for chamber.
Thus, there is a need for improved systems and methods for filling short-width, high aspect ratio gaps with a void free dielectric film. These and other problems are addressed by the systems and methods of the present invention.


A method of and apparatus for controlling electric discharge machining in which a machining gap formed between a tool electrode and a workpiece is maintained at an essentially constant size based on a reference servo-feed voltage, and in which a jump action, for moving a tool electrode up and away from a workpiece, and returning it to a position close to the workpiece is controlled. The reference servo-feed voltage and conditions for jump action are optimally set to required values during machining according to the discharge stability. The discharge stability is obtained by comparing the actual values of characteristics required for specifying gap condition, e.g., waiting time for a discharge to occur, the voltage during the waiting time, discharge frequency, to the corresponding theoretical values. The theoretical values are calculated in part according to given machining conditions. Therefore, even when machining conditions change as machining progresses, jump action and servo-feed action are properly controlled.

In general, during electric discharge machining, an electrical discharge induced by a machining pulse between a workpiece and an electrode, results in the removal of a small crater of material from the workpiece. Electric discharge machining is performed by the application of a plurality of electrical discharges in a highly repetitive manner. The spacing between the tool electrode and the workpiece, called the machining gap, is typically on the order of a few microns or tens of microns in size and is typically filled with a dielectric machining liquid, such as water or kerosene. The machining gap may be maintained at a generally constant size by comparing mean gap voltage detected at the gap during machining to a reference servo-feed voltage, and using the comparison result to control machining conditions.
During machining, a machining pulse having an ON state and OFF state under predetermined machining conditions is generated, which in turn produces a current pulse having a nearly constant peak current value and constant pulse width. When preparing to machine, the operator sets machining conditions such as the on-time and off-time of the machining pulses applied across the gap, the peak current value, detection levels for detecting unstable machining, as well as other parameters in accordance with requirements such as the machining area of the workpiece, the machining depth, the dimensional accuracy required, and the surface roughness desired. As machining progresses, the operator may regulate the reference servo-feed voltage. Further, based on his experience or by referring to recommended data table, the operator may regulate a jump cycle and a jump stroke of tool electrode jump action, whereby the electrode is moved up and away from the workpiece and then immediately returned down to a position close to the workpiece, to thereby create a pumping action in order to remove particles produced during machining from the gap. It is known that such particles may result in a decreased material removal rate if left in the gap.
Conditions such as reference servo-feed voltage, the jump cycle and the jump stroke must be regulated so that the conflicting requirements of a high material removal rate and stable discharge machining are effectively balanced. For example, if the jump cycle is shortened and the jump stroke increased, while the stability of discharge will be improved, the material removal rate will be decreased. Therefore, fairly good skill is required on the part of the operator to properly regulate conditions during machining. For example, a skilled operator may observe such conditions as discharge frequency, the waiting time for discharges, i.e., the time during which no discharge occurs even though voltage has been applied across the machining gap, the voltage during the waiting time for discharge and the occurrence of short-circuiting, all by referring to waveforms of the gap voltage using an oscilloscope.
U.S. Pat. No. 5,117,083 issued to Kawamura discloses a jump control system for controlling jump action conditions using a so-called "fuzzy" inference control instead of the intuition and experience of the skilled operator. In this disclosure, in order to control a jump cycle and a jump stroke, the stability of the discharges and the rate of change are inferred based on given fuzzy rules according to detected gap conditions such as the waiting time for discharge, the gap voltage during the waiting time, and the mean voltage.
However, in order to decide whether gap conditions are good or bad, values representative of the gap condition are compared to respective given reference values, which in turn are electrically detected by detecting means. Since reference values must be changed according to changes in the machining conditions, many reference values are set in advance.

Method and apparatus for controlling electric discharge machining


A voice prosthesis is provided for use in a shunt between the trachea and the esophagus of a laryngectomized patient. The voice prosthesis has a tube-shaped metal part (1) with a funnel-shaped expansion (2) that opens towards its tracheal end. Within the path of the stream of air from the trachea to the esophagus there is provided at least one element (3) that is caused to vibrate by the stream of air passing through the prosthesis, thereby producing an audible tone. With this prosthesis, a laryngectomized patient can produce a much more natural sounding voice than has previously been the case.

In the past, vocal rehabilitation of laryngectomies took place, for example, through learning of the so-called esophagus voice, for the creation of which the patient pressed air into his gullet (esophagus) and, through conscious relaxation of the pseudoglottis, was able to release the airstream which was then subject to articulation by his tongue and lips. Another possibility consisted of the use of so-called Servox devices, which were placed into the neck area and which vibrated. The vibration oscillations were subject to articulation through movement of the lips.
The acoustic pattern of the artificial voices produced in these ways does not correspond to a natural acoustic pattern in any way. Very deep and "raspy" artificial voices are produced. It is probably for this reason that use of these artificial voices, especially in female patients, is afflicted by an extremely high psychological inhibition threshold.
At the beginning of the 1980s, surgery could provide an improvement to the extent that a shunt could be inserted between the windpipe (trachea), which was otherwise surgically closed in the area of the pharynx, and the esophagus. So-called voice prostheses were placed into this shunt. The patient could breathe through this surgically created connection between the trachea and the environment through the so-called tracheastoma, which it was also necessary to create when using the earlier surgical techniques, and in more recent times, through the so-called tracheastoma valve, as it is described and claimed in EP-B-O 221 973, for example. If the patient now wanted to speak, he closed the tracheastoma with his finger or the valve closed automatically due to the higher air pressure, so that air could flow from the trachea through the shunt and into the esophagus.
A so-called voice prosthesis of this type is known from DD-275183 A1, for example. The designation of the one-way valve described therein as a voice prosthesis is certainly inappropriate. This valve does nothing except admit an air stream between the trachea and the esophagus, and prevent the entrance of food particles or saliva from the esophagus back into the trachea. The latter is of course extremely important, since otherwise complications such as pneumonia can occur. From a technical standpoint, however, the valve described in the cited reference merely closes off a different source of air when compared with the creation of the esophagus voice described earlier. The artificial voice created with the valve is also extremely deep in its frequency range, and is therefore very difficult to accept, especially for female patients.
DE-A-32 11 126 shows a so-called larynx prosthesis used in a shunt between the trachea and esophagus of a laryngectomized 10 patient, having an open, funnel-shaped expansion toward the tracheal end. This prosthesis does nothing except form a transition between trachea and esophagus, as has already been described in more detail. Similar prostheses are shown in U.S. Pat. No. 4,808,183, EP-A-O 279 484, and EP-A-O 222 509.
Another type of device is shown by DE-A-22 53 496 and JP-A-2-174843, for example. In these, devices are provided that have an extracorporeal tone-generating element in order to make use of an artificially generated frequency for speech modulation. The arrangement as an extracorporeal device is of course very burdensome for the patients, partly because these devices are visible to everyone with whom the patient converses.
Against this background, it is the object of the present invention to provide a voice prosthesis for use in the shunt between the trachea and esophagus of a laryngectomized patient, with which prosthesis the frequency range of the artificial voice can be adapted to the frequency range of the natural voice, and all parts of which can be implanted intracorporeally.


A hand washing timing system includes a housing with a perimeter wall that has a dispensing aperture extending therethrough. A fluid dispensing assembly is mounted in the housing and dispenses fluid outwardly of the dispensing aperture when actuated. The fluid dispensing assembly includes an actuator. A light emitter is mounted on the housing and emits visible light outwardly away from the housing when turned on. A timing assembly is electrically coupled to the light emitter and turns on the light emitter for a specified amount of time when the timing assembly is actuated. The timing assembly is in communication with the fluid dispensing assembly and is actuated when the fluid dispensing assembly is actuated. A light diffuser is mounted on the housing and covers the light emitter to increase a viewing angle of light emitted by the light emitter to at least 120 degrees with respect to the light emitter.

1. Field of the Invention
The present invention relates to hand washing devices and more particularly pertains to a new hand washing device for ensuring that a person washes their hands for a specified amount of time.
2. Description of the Prior Art
The use of hand washing devices is known in the prior art, as are those devices used to ensure that a person washes their hands for a specified amount of time. While these devices fulfill their respective, particular objectives and requirements, the need remains for a system that not only provides a signaling means to a person to wash their hands for a specified amount of time, but which also signals to others that the person is washing their hand for that specified amount of time. In particular, such a system will be useful for supervisors to be able to see that an employee is washing their hands for the proper duration. For caregivers, this will ensure that a patient is being taken care of by an employee with properly sanitized hands. In the food industry, this will allow not only supervisors, but also customers, to see that the food handler has sufficiently cleaned their hands before preparing food. For the above reasons, a system is needed that will allow the viewing of the signaling means from a sufficient distance and viewing angle to ensure that not only the person washing their hands, but also those persons a distance from the person, can see the signaling means.


A device for installing tiles on surfaces to be lined comprises a support, whereto a tile is to be attached by an adhesive, and provided with rabbet coupling elements effective to provide a rabbet coupling with the surface to be lined on which counter rabbet coupling means are anchored.

This invention relates to a device for installing tiles on surfaces to be lined, such as walls and floors.
As is known tiles are currently installed by means of a binder (adhesive, cementitious mortar) interposed between the bottom surface of the tiles and the surface to be lined or coated.
The surface is composed of a layer of cementitious mortar which serves as the substrate and is suitably smoothed and in which are embedded the pipes for the utilities such as heating, water and electricity.
The traditional technique of tile installation has some serious drawbacks. First of all, it is time consuming and requires specialized labor. Moreover, if it becomes necessary to service underlying pipes for making connections or repairs, part of the lining must be pulled down, which most of the times involves replacement of all of the tiles because the ones pulled down, years after their installation, are no longer available.


A soil sampler for insertion into a pilot hole in the earth to extract contaminants in a vapor state. The sampler has an axially forward projection and an axially rearward projection that define a volume together with the body of the sampler and the wall of the pilot hole. Steam passes into the sampler so as to heat a portion of the sampler near the volume so as to volatize the contaminants. The sampler exerts a vacuum on the volume to extract the gaseous contaminants into an analyzer assembly.

The invention pertains to soil samplers, and in particular, to a soil sampler inserted into a pilot hole in the ground and positioned to a selected depth so as to volatize contaminants, and thereafter accumulate and transport contaminants to the surface for analysis.
It was not until 1975 that soil sampling was first attempted as a means to detect and trace ground contaminants. These early applications involved inserting pipes one to one-and-a-half feet into the ground to measure the evolution of both hydrocarbon and non-hydrocarbon gases. Since that time, the concept has taken two somewhat different directions in application; namely, in place passive soil gas sampling devices and mechanically inserted active soil gas sampling ground probes. The mechanically inserted sampling probes have involved large and small sampling approaches and several variations on sample extraction and analysis.
Numerous applications have involved auguring bore holes into the soil, placing a hollow breathing tube into the bore hole and backfilling with the cuttings. Sampling tips for obtaining soil gas samples range from glass tubing with flared openings to porous/sintered bronze cups and various perforated probe tips. These applications all demonstrated the same disadvantage; namely, that the auguring of the bore hole altered the soil gas composition and caused the loss of many of the gases of interest which changed relative as well as overall concentrations. The procedure required several days for the disturbance to equilibrate, which left numerous questions as a result of the variability of gaseous movements through the undisturbed soil. Furthermore, due to the absence of a reliable seal between the sampling point or probe shaft and the atmosphere, the dilution of the gaseous samples was found to cause false negatives and unreliable relative concentration results. Obviously, the above drawbacks detracted from the credibility of any analysis of these soil samples.
Alternative techniques intended to correct the two major deficiencies of the previous method were developed and took the form of mechanically inserting probes with sacrificial penetration tips or perforated well points to the desired depth. The expense involved with sacrificial penetration tips has been a drawback to that approach. This procedure minimized the disturbance of the soil matrix, caused no significant release of soil gases, and provided an improved natural seal between the sampling point and probe shaft and the surface atmosphere. Variations of this type of "breathing" soil probe have been widely applied. The principal limitation of the perforated well-point method was the blinding or clogging of the sample ports with soil during the insertion process. This led to the development of several types of closed well-points which were opened mechanically upon reaching the desired depth by extracting the insertion casing.
Early researchers found the mechanical insertion method to be preferable to the augured insertion technique and more reliable in obtaining accurate, reproducible soil gas samples. However, some of these commercially available well-points continue to experience problems in opening as a result of the high compression experienced during the insertion process. The principal limitation of this process was the relatively high volume of gas within the interior of the probe that needed to be extracted prior to obtaining a representative soil gas sample. Also, dilution of the sample becomes a problem when the volume of the gas within the probe is relatively large. Structural demands required that the probe shafts be relatively heavy to withstand the rigors of the insertion process which limited the freedom to physically down-size the casing shafts. This limitation was overcome by redesigning the well-points to allow for the attachment of laboratory tubing between the well-point and the surface where the sample is withdrawn. The benefit of this process was that a smaller sample volume was necessary to purge the system, and consequently, a sample more representative of the interstitial gases was obtained at the surface sampling point.
The various methods of manually and mechanically inserting the probes range from manual drop-hammers, to hydraulic and mechanical impact hammers, to hydraulic penetration devices. The insertion of the sample point by driving the unit with an impact/percussion hammer on the upper end of the connecting shaft results in greater by-passing of diluting atmospheric gases during sampling. The cause of this problem is the compacting of the soil which contacts the probe shaft during insertion by the vertical impact/force being converted to lateral motion by the combining forces of the impact and the counterpoising resistance to penetration and friction.
Sample extraction techniques have ranged from passive, atmospheric movement of the soil gases to the surface, to low and high vacuum extraction methods. The passive process was based on the natural diffusion of gases from higher concentrations in the soil to the sampling ports in the well-point. Since this process was based on the natural concentration gradient, researchers often found that tight, clayey soils were too restrictive to the natural movement of soil gases. This technique also required considerable time for soil gases to collect within the sampling probe for final drawing for analysis. Therefore, it was limited to relatively high concentrations of volatile contaminants.
The application of low vacuum to the sampling probe was the first attempt to address this limitation. This reduced the time required for the accumulation of soil gases within the sampling probe but did not materially affect the migration of gases through tight soils to the well-point. High vacuum extraction processes were later developed to increase extraction efficiency. However, this technique required the development of gas cleaning systems at the surface since ground water and soil particles were often drawn through the probe. Also, structural improvements to the system were necessary to accommodate the larger pressure differential. A significant additional advantage of the high vacuum systems was the reduction of the partial gas pressure in the sampling zone of the soil causing heavier and more complex molecules to volatilize at the reduced pressures.
Analytical methods used to process the extracted sample have included colormetric gas tubes, gas bag samplers, carbon adsorbing tubes, combustible gas indicators and gas chromatographs. Portable, laboratory quality flame- and photo-ionization detector/gas chromatographs have provided a mechanism whereby the extracted soil gas samples can be separated into their various components and can be analyzed on-site. Gas chromatography has utilized both flame-ionization detectors and photo-ionization detectors, as well as electron capture and far-ultraviolet detectors. The most common processes deliver the sample to the analytical device by the use of gas tight syringes to extract the gas sample, and most recently by extracting gas samples directly from the vacuum pump exit stream. This second procedure is more expeditious but requires care so as not to over pressurize the analytical instrument with exit gases from the vacuum pump. Also, accuracy in measuring the flow of a moving stream as well as incorporating effective gas cleaning devices for removing moisture and soil particles are necessary in order to obtain a representative sample for analysis.
Certain commercially available, closable well points have exhibited a tendency to jam with soil under repeated opening and closing while in the subsurface soil regime. The repeated opening and closing of the well points which is necessary when readings are taken during insertion can result in either the blinding or clogging of the sampling ports or the jamming of the protecting shroud itself restricting the ability to open the point when reaching the succeeding test elevation.
Chemical factors affecting the soil vapor assessment process include the variations in vapor pressures and boiling points of the compounds of interest themselves, and the appropriateness of the detection and analytical devices employed in relation to the contaminant compounds. The relationship between the various soil conditions can be characterized by the following formula. EQU C.sub.g /C.sub.t =1/((P.sub.g K.sub.oc f.sub.oc /K.sub.h)+(O/K.sub.h +a))
where:
C.sub.g /C.sub.t =Relative Vapor Concentration. [(mg/cm.sup.3 .cndot. air)/(mg/cm.sup.3 .cndot. soil)] PA1 P=Bulk Density (g/cm.sup.3) PA1 K.sub.oc =Organic Carbon-Water Partition Coefficient (cm.sup.3 /g) PA1 f.sub.oc =Fraction of organic carbon content (g/g) PA1 K.sub.h =Henry's Constant [unitless ratio] PA1 O=Volummetric Moisture Content (cm.sup.3 /cm.sup.3) PA1 a=Volummetric Air Content (cm.sup.3 /cm.sup.3) PA1 C.sub.v =concentration in vapor phase (i.e., the vapor in soil interstices) (mmHg) PA1 X=mole fraction of compound in solution PA1 C.degree..sub.v =concentration in vapor phase above pure liquid (i.e., vapor pressure) of the component of interest (mmHg) PA1 C.sub.v =concentration in vapor phase PA1 K.sub.H =Henry's Law coefficient PA1 C.sub.w =concentration in aqueous phase
Research into the behavior of wet and dry gaseous compounds and the laws affecting gases have provided a number of constants and predictable reactions for the contaminant compounds commonly found in soil matrices. Soil vapor contaminant assessment is possible since vapors indicative of contamination resulting from volatile organic compounds are present within the voids of the soil interstices. These contaminant vapors evaporate from contaminated water or result from non-aqueous phase liquids (NAPL) released in the vadose (unsaturated) zone of the soil.
Research has shown that both Henry's and Raoult's Laws are important in understanding the equilibrium of contaminant concentrations resulting from volatilization of aqueous and non-aqueous phase liquids. Raoult's law describes the equilibrium vapor phase concentrations above a dissolved contaminant in higher concentrations. EQU Raoult's Law: C.sub.v =X C.degree..sub.v
where:
Henry's Law describes the equilibrium vapor phase concentration above water containing an organic solute at low concentrations. EQU Henry's Law: C.sub.v =K.sub.h C.sub.w
where:
Based on Raoult's and Henry's laws and the vapor pressures of various organic compounds, it is clear that not all contaminants can be detected using soil vapor assessment techniques. The compounds of interest must be sufficiently volatile to enter the vapor phase in sufficiently high concentrations to be extracted and detected and must have an adequately low aqueous solubility so that they do not remain in aqueous solution. Currently, soil vapor analysis are limited by the vapor pressure and Henry's Law constant (i.e., vapor pressure and aqueous solubility) for the compounds of interest. Generally, for the process to be reliable, the contaminant compounds should have a vapor pressure of at least 1.5 mmHg at 25.degree. C. and a Henry's Law constant of at least 0.1 kPam.sup.3 per mole. The list set out below is a partial listing of compounds that are amenable for soil vapor assessments based on current procedures.
______________________________________ VAPOR HENRY'S LAW PRESSURE CONSTANT (mmHg) (kPa M3/mole) ______________________________________ Benzene 95 0.6 Bromoform 5 0.06 Bromomethane 1300 0.5 Carbon Tetrachloride 15 2.0 Chlorobenzene 12 0.4 Cloroethane 700 0.2 Chloroform 190 0.4 Chloromethane 3750 1.0 1,2 Dichlorobenzene 1.5 0.2 1,3 Dichlorobenzene 2 0.4 1,1 Dichloroethene 500 15.0 1,2 Dichloroethene 700 0.1 1,1 Dichloroethene 200 0.6 trans-1,2 300 0.6 Dichloroethene 1,2 Dichloropropane 50 0.4 cis-1,3 40 0.2 Dichloropropene Ethylbenzene 9 0.8 Methylene Chloride 350 0.3 1,1,2,2 5 0.05 Tetrachloroethane Tetracholorethene 15 2.0 Toluene 28 0.7 1,1,1 100 3.0 Trichloroethane 1,1,2 25 0.1 Trichloroethane Trichloroethene 50 0.9 Vinyl Chloride 2200 50.0 o-xylene 6 0.5 m-xylene 8 0.7 p-xylene 8 0.7 ______________________________________
Several researchers have attempted to change the subsurface conditions in an attempt to expand the range of compounds amenable to the soil vapor assessment process. One researcher reported that the detectability of organic compounds depends upon their ability to volatilize into the porous spaces of the soil and that most contaminants volatize either directly from the soil or from dissolved aqueous phase. Since the temperature of the subsurface soil below one meter reflects the mean ground water temperature of 65.degree. F. or less, normal low vacuum gas extraction is generally limited to those compounds having standard condition boiling points of less than 150.degree. F. and vapor pressures greater than 0.002 atmospheres.
The capacity to detect organic compounds by soil vapor techniques depends upon contaminant volatility. Soil vapor concentrations are related to two governing systems: water phase and non-aqueous product phase. Raoult's and Henry's laws are commonly used to understand equilibrium vapor concentrations governing the volatilization from liquids. Therefore, the ability to manipulate or change the variables in these equations will allow for expansion of the range of compounds suitable and detectable by soil vapor extraction techniques. The theory of the interaction between soil temperature and the role of pressure has not been fully developed. However, research and experience have empirically established without question that elevating sub-surface soil temperature and reducing the local atmospheric pressures will result in a broadened spectrum of extractable compounds. It has also been established that the release of volatile gases form a soil matrix is influenced by the moisture content of the soil. Gases adsorb more strongly to dry soil particles and conversely will desorb to a greater extent from moist particle surfaces.
Experience with in situ vacuum extraction has shown that moist soils are dried by the vacuum extraction process. Some decrease in the release of volatile organic compounds will result due to enhanced adsorption between the hydrocarbon molecules and the soil particle surfaces due to drying as extraction progresses. This increased adherence can be reversed or avoided by maintaining adequate soil moisture during the extraction process. This phenomenon is mathematically described by the Relative Vapor Concentration Formula. By applying and moisture heat to the sub-surface soil conditions, ensuring that drying of the soil matrix does not occur, and reducing the ambient pressure in the zone of extraction, compounds with boiling points of up to 400.degree. F. and 0.007 atmospheres vapor pressure can be suitable for soil vapor analysis.


In order to achieve a repair-friendly and maintenance-friendly arrangement with improved conduction away of heat to the outside in a wheel drive, in particular for mobile machines, having a carrying axle (2) which is mounted fixed in terms of rotation to the vehicle frame (1) and which is rotatably connected as a wheel hub to a ring gear (4) via a roller bearing arrangement (3a, 3b), the ring gear (4) being driven via at least one planetary gear mechanism (24) with drive-end sun wheel (16), and an integrated dynamic service brake (24) being provided between the ring gear (4) and the carrying axle (2), it is proposed that the service brake (24) be arranged within the ring gear (4) at the end directly behind a detachable gear mechanism cover (11) and at the outer radius on a hollow-cylinder-shaped brake carrier (10) which forms the end piece of the carrying axle (2) which is fixed in terms of rotation, and that the planetary gear mechanism (34) be arranged behind the service brake (24), viewed from the end, within the ring gear (4).

The invention relates to a wheel drive, in particular for mobile machines, having an integrated dynamic service brake.
Mobile machines, such as fork-lift trucks, forest machines, agricultural machines, etc., are usually moved at speeds of up to 40 km/h. A high degree of manoeuvrability is required with such machines. For these reasons, it has become customary for mobile machines to have direct wheel drives, as opposed to a central drive in which the driving force is transmitted to a pair of wheels. Because the mobile machines of the type in question here already have a hydraulic circuit for moving their working equipment, an adjustable hydraulic motor, which can advantageously be operated with the existing hydraulic circuit, is preferably used as the drive element in the wheel drive.
A wheel drive of the generic type is known from DE 299 10 017 U1. The wheel drive has a carrying axle which is funnel-shaped in the region near to the vehicle and is attached fixed in terms of rotation to the frame of a vehicle. On the carrying axle there is a wheel hub which is mounted so as to be capable of rotating by means of roller bearings. The vehicle wheel can be attached to the wheel hub. The wheel hub is driven by a drive shaft running in the centre of the carrying axle, via a planetary gear mechanism which reduces the rotational speed. The planetary gear mechanism is therefore connected at the input end via its central sun wheel to the drive shaft. At the output end, the planetary wheels are connected directly to the wheel hub, which forms the planetary carrier here.
A dynamic service brake for the wheel drive acts via the outer ring gear of the planetary gear mechanism. The dynamic service brake is embodied as a multidisc brake whose stationary discs are connected to the wheel hub and whose moving discs are connected to the ring gear of the planetary gear mechanism via a ring-carrier. Braking while the wheel drive is operating is carried out by applying pressure medium to a piston which presses the stationary and moving brake discs axially one against the other in order to bring about effective braking of the vehicle, there being an arrangement of alternating stationary and moving discs.
The heat produced during the braking operation is conveyed into the oil bath and conducted away to the outside via the wheel hub. Because of the arrangement of the dynamic service brake at the outer radius in the centre of the wheel hub, the maximum generation of heat occurs in the region where the vehicle wheel is attached. In this region, the conduction of heat away to the outside is unfavourable, that when the service brake experiences extreme stressing the entire wheel drive may overheat. Furthermore, it is disadvantageous that when the wheel drive is serviced or repaired it is necessary to completely dismount the planetary casing. This is possible only when the vehicle wheel has previously been dismantled.
A further wheel drive is known from EP 0 684 401 B1. In contrast to the wheel drive described above, a disc brake is used here as the dynamic service brake. However, the brake disc of the disc brake with its brake shoes which can be activated hydraulically are also arranged in the centre of the wheel drive so that the heat generated by the service brake cannot easily be conducted away to the outside. The planetary gear mechanism for transmitting the driving force from the drive shaft to the wheel hub is also placed at the distal end of the wheel drive here. For servicing and repair purposes, the dynamic service brake and the planetary gear mechanism are also only accessible when the wheel is removed and the pot-shaped housing cap dismounted.
The object of the present invention is to improve further the wheel drive of the generic type to the effect that service-friendly and repair-friendly access to the essential components of the brake and gear mechanism is possible and the risk of overheating of the wheel drive during operation is minimized.
The invention includes the technical teaching that the dynamic service brake of a wheel drive is arranged within the ring gear forming the wheel hub, at the end directly behind a detachable gear mechanism cover and at the outer radius on a hollow-cylinder-shaped brake carrier forming the end piece with carrying axles which are fixed in terms of rotation, the planetary gear mechanism of the service brake being arranged within the ring gear following in the direction of the vehicle frame.
The arrangement according to the invention of the brake components and the mechanism components of the wheel drive is made possible by means of the specific configuration of the brake carrier which represents a prolongation of the carrying axle which is fixed in terms of rotation. As a result, the service brake extends to the distal end of the wheel drive. At this point, as a result of the slipstream, there is improved conduction away of heat directly in the region of the wheel drive in which the braking heat is generated, resulting in improvement to the cooling of the wheel drive. Because the wheel drive is sealed off by means of a flat, end-mounted gear mechanism cover, simple accessibility of the essential components when performing servicing or repairs is ensured. There is no need to remove the vehicle wheel for this purpose.
In order to ensure a space-saving gear mechanism function of the planetary gear mechanism within the wheel drive, the drive-end sun wheel preferably engages with planetary wheels which are secured fixed in terms of rotation to the carrying axle by means of planetary bolts. The planetary wheels roll in turn on an inner toothing which is provided directly on the inner radius of the ring gear.
It is also possible to provide a further preliminary stage of the gear mechanism within the wheel drive in order to convert a desired transmission ratio appropriately for the loading. Preferably, at least one preliminary stage of the gear mechanism is positioned within the hollow-cylinder-like brake carrier, directly behind the detachable gear mechanism cover and thus also in an easily accessible location. The preliminary stage of the gear mechanism is connected at the input end to the drive shaft of the wheel drive and at the output end to the sun wheel of the (main) planetary gear mechanism which is connected downstream in this respect. The preliminary stage of the gear mechanism may be embodied as a single-stage or multistage preliminary planetary gear mechanism. Because of its coaxial design, the arrangement as a planetary gear mechanism is particularly suitable for this. For example, the ring gear of a single-stage preliminary planetary gear mechanism can easily be embodied by means of the gear mechanism cover so as to be fixed in terms of rotation with respect to the ring gear, forming the wheel rim, of the (main) planetary gear mechanism. Due to this, the ring gear of the preliminary stage of the gear mechanism is fitted with at least one or two planetary wheel sets. These planetary wheel sets are preferably arranged behind a separate cover which is arranged coaxially in the gear mechanism cover and which also forms a securing means for the entire drive shaft of the wheel drive.
In addition to the service brake which is activated while travelling, a second brake may also be provided at the input end on the drive shaft, said second brake performing the function of a hand brake, that is to say the function of keeping the vehicle stationary when it is parked.
The invention accordingly comprises the features of construction, combination(s) of elements, and arrangement of parts which will be exemplified in the construction(s) hereinafter set forth, and the scope of the invention will be indicated in the claims.

Wheel drive with integrated dynamic service brake


A cold rolled non-oriented electrical steel sheet having a low iron loss is disclosed. The steel sheet consists of not more than 0.02% of C, 0.1-3.5% of Si, not more than 1.0% of Al, 0.1-1.0% of Mn, 0.03-0.40% of Sn and the remainder being substantially Fe.

(1) Field of the Invention
The present invention relates to a non-oriented electrical steel sheet, and more particularly relates to a cold rolled non-oriented electrical steel sheet having a low iron loss.
(2) Description of the Prior Art
Non-oriented electrical steel sheets are graded by their iron loss. For example, in the JIS, non-oriented electrical steel sheets having a thickness of 0.050 mm are graded as follows. In the S-30 grade steel sheet, W.sub.10/50 must be not higher than 3.70 W/kg and W.sub.15/50 must be not higher than 8.00 W/kg; and in the S-10 grade steel sheet, W.sub.10/50 must be not higher than 1.25 W/kg and W.sub.15/50 must be not higher than 3.10 W/kg.
The iron loss of non-oriented silicon steel sheets is occupied by the hysteresis loss rather than by the eddycurrent loss contrary to the iron loss of oriented electrical steel sheets, and the hysteresis loss occupies generally 60-80% of the total iron loss. The hysteresis loss is in inverse proportion to the crystal grain size. It is an effective means to promote the normal grain growth of recrystallized grains at the final annealing in order to decrease the iron loss, and this means has hitherto been always used in order to lower the iron loss.
The inventors have newly found out that the alloying of Sn to non-oriented silicon steel sheet is effective for lowering the iron loss thereof, and have accomplished the present invention.

Cold rolled non-oriented electrical steel sheet


A data processing system includes at least one transaction processing application and a plurality of data managers which can be accessed by the transaction processing application. Each data manager is responsible for managing a separate data base. The system further includes a work-in-progress store and a work-in-progress store manager for managing the work-in-progress store. Whenever the transaction processing application instructs a data manager to perform an update, the data manager passes information concerning the update to the work-in-progress store manager which records this information in the work-in-progress store, and whenever the application completes a transaction, the data managers perform updates to their respective databases and the work-in-progress store manager is instructed to discard the contents of the work-in-progress store relating to this transaction.

This invention relates to data processing systems and is particularly concerned with data processing systems involving transaction processing and database management.
Support for transaction processing requires the ability to ensure that the effects of data updates associated with a transaction are atomic; that is either all updates are applied or none. This atomicity must be achieved irrespective of failure during the transaction. This capability is often achieved by writing the updates associated with the transaction to a separate log file before they are applied to the database. Only if all of the updates to be applied are secured in the log file is the transaction completed by the data manager applying the updates to the database. Once all of the updates have been applied the transaction must be marked as complete in the log file.
Where a transaction involves more than one such data manager the data managers defer to a separate coordinator to control the progress of the transaction. As before each data manager writes its updates to a log file instead of updating the database. When the user work for the transaction ends the coordinator requests that each data manager puts itself in a state where it is prepared to commit or rollback the transaction (by writing to its own log). When all of the involved data managers have reached this state the coordinator secures the decision to commit the transaction in its own log and tells each data manager to commit any changes. Before replying that it has completed, each data manager records in its own log that it has completed. When all data managers have completed the coordinator records the completion of the transaction in its own log. Each transaction therefore involves 2+2n log writes (where n is the number of data managers involved in the transaction).
The object of the present invention is to provide an improved data processing system in which the number of writes to such log files is reduced.

Transaction processing database system with shared work-in-progress store for logging database changes


A conductive film forming composition includes a fluorine atom-containing migration inhibitor and a metal particle, with the migration inhibitor including at least one selected from the group consisting of compounds represented by General Formulae (1) to (5), (22) and (23) as well as compounds having a group of General Formula (24) and a group of General Formula (25). The conductive film forming composition makes it possible to form a conductive film excellent in conductive characteristics and ion migration inhibiting function.

The present invention relates to a conductive film forming composition, and, more particularly, to a conductive film forming composition that contains a migration inhibitor containing a fluorine atom.
Further, the present invention relates to a conductive film formed by the above conductive film forming composition, and to a wiring board including the conductive film.
Conventionally, a wiring board in which metal wiring (conductive film) is disposed on the surface of an insulating substrate has been widely used in electronic members, semiconductor devices, and the like. As the metal constituting the metal wiring, silver and copper having high conductivity are generally used, but these metals have a problem in that ion migration easily occurs.
As a method of preventing the ion migration of the metals, a method of introducing a specific migration inhibitor into the metal wiring has been proposed (JP2012-99236 A).

Conductive film forming composition, conductive film, and wiring board


A gas turbine engine assembly is connected to a pylon for mounting the gas turbine engine to an aircraft. The assembly has a frame supporting at least one accessory independently of the gas turbine engine. Frame is attached to the pylon at forward and rearward engine mounting locations. The frame includes at least one hollow tube and at least one hollow tube is fluid tight. The one hollow tube is evacuated or contains pressurized fluid and a pressure sensor is provided to detect a change in pressure in the at least one hollow tube to determine if there is a leak in the at least one hollow tube and hence if the frame is damaged. This ensures that the frame may be repaired or replaced before there is a loss of operation of one or more of the accessories which may result in a failure of the gas turbine engine.

Our European patent application 12196908.3, published as EP2607658A2, discloses a gas turbine engine assembly connected to a pylon structure for mounting the gas turbine engine to an aircraft. The assembly has a frame attached to the pylon at forward and rearward engine mounting locations and the frame supports accessories independently of the gas turbine engine. Our European patent application 12196908.3, EP2607658A2, discloses that the accessories are arranged in an accessory mounting zone between the core engine casing and an inner nacelle surrounding the core engine.
The accessory mounting frame is subject to vibrations and/or other loads and these vibrations and/or other loads may result in damage to the accessory mounting frame. If the damage to the accessory mounting frame were to remain undetected and therefore unrepaired, or replaced, it may lead to a failure of one or more portions or the whole of the accessory mounting frame.
The accessory mounting frame carries all the accessories for the gas turbine engine and a failure of the accessory mounting frame may lead to loss of operation of one or more of the accessories, e.g. may lead to a loss of hydraulic supply, a loss of fuel supply, a loss of lubricant supply or a loss of electrical power which may result in a failure of the gas turbine engine.
Therefore the present invention seeks to provide a novel arrangement for detecting damage to the accessory mounting frame which reduces or overcomes the above mentioned problem.

This patent is subject to a terminal disclaimer.

Accessory mounting for a gas turbine engine


A desk having a desk top that is movable with respect to a storage compartment under application of an external force through an open position, an intermediate position, and a closed position. A support member is provided to support the desk top as it moves through these positions. In particular, the support member is adapted so that upon the removal of the external force if the desk top is positioned between the intermediate and closed positions, the desk top will slowly move to its closed position.

Desks have been a commonplace item in schools for many years. One type of desk consists of a hard writing surface that is hingedly connected to a frame having a compartment designed to store books, paper or other school materials. Desks of this type are commonly used for kindergarten or elementary school children of young age and are useful in that a student can store his/her school materials thereby eliminating the need for an independent storage unit such as a school locker.
Desks of this type, however, are not without their drawbacks. One drawback is that young children are acutely susceptible to getting their fingers accidently caught between the desk top and the storage compartment when the desk top is closed. Further, young children are likely to "drop" the desk top rather than gently lowering the desk top onto the storage compartment thereby generating a loud noise which is often disturbing to other students and/or teachers.

Spring-controlled support arm for a desk top


Three-dimensional data that is processed is divided by the number of threads in the third dimensional direction and stored to respective secondary cache memories of the threads. Each thread Fourier transforms data stored in the secondary cache in the first dimensional direction and the second dimensional direction. As a result, a two-dimensional Fourier transform can be performed in parallel at a time. The resultant data that has been two-dimensionally transformed is restored to a shared memory. Each thread Fourier transforms the data in the third dimensional direction.

1. Field of the Invention
The present invention relates to a multi-dimensional Fourier transform parallel processing method for a shared memory type scalar parallel computer.
2. Description of the Related Art
A multi-dimensional Fourier transform for a vector computer has been developed so that the vector length becomes as long as possible. In particular, to perform a high-order Fourier transform such as three dimensional Fourier transform, an algorithm of which a vector length is represented by n1×n2 is used (where n1 and n2 are lengths of data of respective one-dimensional directions).
For fully using the function of a RISC scalar processor, it is important to store data in a cache and reuse the stored data. Thus, before the first dimensional data is Fourier transformed, it is transposed so that the first dimensional data becomes the third dimensional data. Thereafter, the transformed data is re-transposed.
A one-dimensional Fourier transform used in a three-dimensional Fourier transform is performed in such a manner that the vector length becomes long.
However, in a shared memory type scalar parallel computer, unless data stored in a primary cache memory and a secondary cache memory is effectively used and calculated, data is frequently exchanged between a shared memory and a processor. Thus, the resultant overhead becomes large.

Multi-dimensional Fourier transform parallel processing method for shared memory type scalar parallel computer