A method for processing a silver halide photographic element having a support on the bottom and a light sensitive silver halide emulsion layer on the top, comprising:. directing a ray of infrared light in a direction so as to fall on the top side of the element; PA1 detecting the presence or absence of infrared light reflected from the top of the element whereby the presence or absence of the element can be determined; and PA1 using the detection of the reflected infrared light to control a processing step.. The invention also provides a device capable of performing the method as described.

A number of methods are available for the automated or semi-automated processing of photographic elements containing one or more light-sensitive silver halide emulsion layers on a support. As used herein the term "processing" is intended to include any step for handling or processing the element, whether in connection with the manufacture or development processing of the element. To simplify the terminology herein, it is assumed that the desired orientation for processing is with the support on the bottom and with the light-sensitive layer(s) on the top, and therefore reference to the top of the element means the side of the support where the sensitized layers are intended to be during processing. Of course, if the sensitized layers are intended to be other than on the top of the support during processing, top would refer to that intended side.
Automated processing in the form of so-called "minilabs" are located in supermarkets, shopping malls etc. to accomplish the automatic and accurate processing of film to provide color prints and slides. Professional offices use automated equipment to process x-rays in order to provide prompt, accurate diagnoses. In any of these systems, it is desirable to be able to automatically detect the presence of a photographic element to be processed so that the presence can be used to control a handling or processing step. For example, detecting the presence of the element in a particular location may help: determine the size of the element; detect defects in the element, perforations, etc.; count the number of elements processed; activate transport of the element to the next station for processing; turn on dryer motors to dry the element following processing; activate chemical replenishment of the processing baths; initiate splicing of the element to the preceding element for ultimate batch processing etc.
The commonly used method for detecting the presence of the photographic element is through transmissive infrared ray detection. A ray emitter is located on one side of the element and a detector on the other side. When the element is transported to a position between the emitter and detector, the ray is not transmitted because it is absorbed by the element in its path. The absorption is accomplished in part by the silver present in the element and also in part by the other film components such as absorber dyes, gel etc.
This method of detection presents problems with modern film technology. Advances in silver halide technology have resulted in the use of photographic elements which have become increasingly thinner. Moreover, the silver levels in film have been steadily reduced in order to reduce raw material costs and in order to reduce the emission of heavy metals associated with processing and disposal of silver halide materials.
As a result of modern advances, it has become a problem with certain equipment that the levels of silver and other components contained in photographic elements have been reduced to such an extent that the photographic element cannot be detected by use of the transmissive infrared detector method. Even when the element is present, it is so thin that the infrared ray is largely transmitted through the element which results in the element not being detected. While the equipment can readily handle thicker elements, it will not function properly when a thin film is processed. In some cases it may be possible to override the automatic control when a thin element is to be processed, but it is desirable to be able to rely on a completely automatic system. In other cases it may be possible to adjust the sensitivity of the infrared transmissive detector, but this may entail costly technical assistance. Further, as films become increasingly thinner, the sensitivity needed to detect the difference between the absence and presence of the element makes the system more subject to error as a result of noise or distortion.
A film splicing device available on the market uses detectors of transmitted infrared rays to ascertain the presence of film to be processed. The device also uses a single detector of reflected infrared rays located on the support or bottom side of a properly oriented photographic element to be processed as a means of determining whether the element has inadvertently been spliced with the wrong side up. This misorientation is undesirable since the rollers or other means used to transport the element should contact the support side of the element in order to avoid scratching the imaging layers during process, undesirably degrading the image. This device and method do not employ the detection of infrared rays reflected from the top or imaging layer side of the support.
It is a problem to be solved to provide a method and device for the reliable detection of both conventional and thin film during the handling and processing of a photographic element.

Device and method for handling and processing photographic film


Disclosed herein are compositions comprising gelatin, collagen, and a chromophore that produces a reactive oxygen species upon exposure to electromagnetic radiation. These compositions have also been found to be strong tissue adhesives that crosslinks the composition and tissue and are effective in closing and sealing wounds, fixation of grafts/implants and anastomoses.

There has been heightened interest in developing light activated tissue solders and sealants as a substitute for conventional closure methods such as the fixation of grafts/implants and anastomoses. Advantages include speed of closure, reduced infection due to the elimination of foreign matter, evidence of accelerated wound healing and the ease of use in complex surgery, especially when watertight seals, limited access or small repair size are important factors. Laser activation provides a directed energy source for precise placement of the sealing material and can amplify the crosslinking mechanism for bonding together incisional edges or wound tissue flaps.
Numerous studies have reported the efficacy of light activated materials to join soft tissues. The availability of a variety of laser output powers, wavelengths, which match the optical properties of tissue, as well as the development of protein composites, layered materials and those modified with growth factors, chromophores, or photochemicals have advanced the technology. Applications range from urologic anastomoses, small diameter vascular anastomoses, nerve anastomosis and skin closures.
Photothermal processes modulate the strength of the repair and may reach a precise temperature set by the choice of laser and material composition to obtain protein reconstruction at the glue/tissue interface with minimal damage to peripheral tissue. Some of these glue constructs tend to undergo blood dilution during surgery with mechanical alteration thereby weakening the repair. The stronger adhesives are often brittle, inflexible and not easily adapted to different tissue geometries.
In comparison, photochemical processes involve the breaking photosensitizer bonds, in the presence of energetic light such as UVA, with the resultant generation of reactive species that catalyze and accelerate the formation of linkages to underlying tissue.
Methods to date have not gained clinical acceptance. The major reasons include the high level of surgeon skill that is required, the strength, toxicity and resorbability of the tissue adhesive, the potential for irreparable laser damage and cost of the laser system.

This patent is subject to a terminal disclaimer.

Light activated composite tissue adhesives


A plurality of modules, each adapted to generate repetitive RF pulses are connected to a common coarse DC power supply. Each of the modules, which include a pulsed load, has a switching transistor connected in series with the load, and a precise voltage connected to its base to regulate the voltage during each of the individual pulses. A capacitor may be connected in each of the modules for improving the rise time of the individual pulses.

The present invention relates to a power supply distribution system; and more particularly to a pulsed voltage supply for a plurality of parallel connected modules of a power amplifier.
Solid-state power amplifiers for radar applications, for example, require a high degree of pulse-to-pulse phase and amplitude stability. The principal limitation on this stability is the quality of the power supply voltage at the RF amplifier transistors that are rendered conductive to constitute a pulsed load of the appropriate frequency. Both the phase and output amplitude of a class B or C power amplifier change with variations in the voltages of these RF transistors. The required RF stability, therefore, is directly dependent upon the stability of the supply voltage; and such required voltage stability for such applications, for example, may be in the several millivolt region for high performance radar systems.
Heretofore, and referring to FIG. 1, a coarse DC voltage supply referred to at 10 may be derived by a rectifier bridge or inverter power supply, for example. A DC precision regulator 11 which is utilized to remove inverter ripple and other voltage perturbations, includes a power supply transistor 12 having its collector and emitter portions connected in series in output line 13 of the power supply 10. The precision regulator conventionally includes a voltage reference source 14 connected to the base portion of the transistor 12 to cause the transistor 12 to conduct to charge a capacitor bank 15 that is connected across the output 13 and an output 16 of the regulator 11 to provide energy storage for each of a plurality of RF amplifier modules 17 and 18. The individual modules are connected in parallel to the outputs 13 and 16 of the precision regulator 11 downstream of the capacitor 15. Each of the modules 17 and 18 may include one or more inductors such as 21 and 22 connected in series with the emitter and collector terminals of RF transistors 23 and 24, respectively. The series connected inductors and their associated RF transistors are connected across suitable conductors 25 and 26 in each respective modules 17 and 18 which are connected to the capacitor to the output leads of the regulator 11. The pulsed output may be obtained on lines 27 and 28 through parallel connected secondary inductive windings 29 and 30. A conventional amplifier 31 having an RF input is connected to the base portions of each of the transistors to drive the transistors at the appropriate frequency. A capacitor 43 which is 1 to 2% the size of the bank 15 may be connected across leads 25 and 26 of its respective module to increase the rise time of the pulses.
To summarize the operation of the prior art arrangement of FIG. 1, reference is made to the wave forms of FIG. 2. A wave form referred to as 32 illustrates the voltage at the output of the DC supply 10 at point A as shown in FIG. 1 which includes the ripple connected with such voltage and the drooping effects at 33 and 34 caused by the regulation of the load in the plurality of modules 17 and 18. A typical voltage wave form 35 occurs at the output of the regulator 11 at point B shows the ripple removed, but a slight droop in such voltage value at 36 and 37 which occurs in charging the capacitor bank 15. A wave form 38 at 39 and 40 illustrates the general nature of the current at points A and B of FIG. 1 in response to the drawing of current by the modules 18 and 17 upstream of the capacitor bank 15. Wave forms 41 and 42 represent the peak current for the duration of each of the pulses downstream of the capacitor bank 15. Each of the plurality of solid-state power modules draw high current pulses out of the common energy storage bank 15 at the RF pulse width and repetition rate to which is supplied a relatively constant current from the regulator 11. For radar applications, the pulse duty cycles may typically range from 1% to 10%. Thus, the peak currents from the capacitor bank 15 may be ten to one hundred times greater than the average current from the precision regulator 11 which recharges it. The capacitor bank 15 is required to store many times the individual pulse energy in order to minimize voltage droop during each pulse, which in turn, produces amplitude and phase droop in each of the RF pulses. In addition, the capacitor bank 15 must be precisely recharged before each pulse in order to maintain identity between successive pulses. The recharging problem may be particularly severe for applications where the pulse repetition rate is staggered. Exponential charging or lead ringing produces different recharge voltages for different interpulse periods.
Therefore, it is desirable to provide a power system for a plurality of parallel connected modules that reduces the energy storage requirements, yet improves the stability of the amplifier, and simplifies the power distribution.


An air cleaner includes a filter element, a case having an opening and being configured to accommodate the filter element, and a lid configured to close the opening. The case includes a wall including a first surface and a second surface that are formed on at least one of an outer surface and an inner surface of the case and are continuous with each other in an opening direction of the opening through intermediation of a stepped portion. The case further includes a rib formed on at least one of the first surface and the second surface to extend in the opening direction.

A vehicle such as a recreational vehicle (RV) is often used on rough terrain where foreign matter, such as dust, is kicked up around the RV. Accordingly, an air cleaner having a larger sized case is needed to protect a surface area of a filter element.
An air cleaner case is generally a molded product typically formed by injection molding. Ribs are sometimes formed to reinforce a wall of the air cleaner case. In U.S. Pat. No. 8,337,579, an air cleaner is described having ribs formed on an inner side of a case so as to extend toward an opening of the case.


The present invention provides a novel combine harvester and associated method configured for gathering grain test data. In general, the combine harvester includes a grain diverting assembly that is configured to selectively divert grain from a grain harvesting path to a grain testing path for the purpose of gathering the grain test data. In various embodiments, the present invention may return the tested grain to the grain harvesting path for further delivery to a primary grain hopper. The present invention may also provide a sampling cup and sample delivery system that allows a sample of the diverted grain to be automatically gathered and delivered to a combine harvester operator location.

A combine harvester (also known simply as a "combine") is a well-known machine used in agricultural applications. In general, combines are designed to travel through crop fields in order to harvest crop materials. Although combines may have various configurations, most are designed to separate grain from material-other-than-grain ("MOG"). Harvested grain is typically stored on board the combine and MOG is disposed back onto the crop field.
In general, a typical combine includes a crop harvesting apparatus (also referred to as a "header"), a threshing apparatus, and a grain delivery system. Although some headers may be used for various crops, a typical header is designed for use with a specific type of crop. As such, the header may be removable from the combine so that other headers configured for use with other crops may be attached in its place.
As the combine moves through a crop field, the header cuts the crops such that the resulting crop material (which at this point includes both grain and non-grain crop material) may be fed rearwardly into the threshing apparatus. Although there are various configurations of threshing apparatuses, a typical axial-flow threshing apparatus includes a threshing rotor which is mounted axially within the combine and which is substantially surrounded by a rotor housing comprising an arrangement of relatively small openings. As the crop material travels rearwardly through the threshing apparatus, the threshing rotor threshes the crop material against the inside surface of the rotor housing. This action separates grain from the MOG.
The MOG typically continues to move through the rotor housing due to the rotation of the rotor and is ultimately released out of the tail end of the rotor and is disposed onto the crop field, in some cases aided by a supplemental spreading device. The smaller grain falls through the openings of the rotor housing and onto a series of sieves that move back and forth. The sieves include an arrangement of smaller openings that further separate the heavier grain from any other non-grain crop material.
Once the grain falls through the moving sieves, it reaches a grain pan. A clean grain auger may be proximate the bottom of the pan. The clean grain auger moves the grain transversely to one side of the combine, where it travels to the grain hopper via a clean grain elevator. Typically, the moving sieves, clean grain auger, and clean grain elevator are mechanically actuated via a belt and pulley system driven by the combine engine so as to associate the speed of the sieves, auger, and grain elevator with the speed of the combine engine.
In a typical harvesting application, the combine is configured to send all of the harvested grain directly to the grain hopper. In some instances, however, it would be desirable to test and/or sample at least a portion of the harvested grain for various characteristics. Such instances could arise, for example, in research applications where crop fields may include experimental crops or other crops for which gathering test data may be advantageous. In addition, commercial harvesting applications could also benefit from an ability to test and/or sample at least a portion of the harvested grain.
As a result, there is a need in the art for a combine harvester and method configured for gathering grain test data. In addition, there is a need in the art for a combine harvester and method configured to sample at least a portion of the tested grain. In various embodiments, the combine harvester and method should provide the ability to selectively test and/or sample the grain without substantially affecting normal operation of the combine.

Combine harvester and associated method for selectively gathering grain test data


A transfer member for transferring ink, paint, and other like vehicles containing organic solvents and a process for its preparation are disclosed, characterized in that the member comprises a polymerized, cross-linked polyurethane, particulate silica, and a bonding amount of a reacted silane. Preferably, the cross-linked polyurethane is prepared by interreacting an organopolyisocyanate with a mixture of hydroxyl-containing organic compounds, such as an organodiol, an organotriol, and optionally, an organopolyol containing more than three hydroxyl groups.

Transfer members usually in the form of rollers are commonly used in many industries for applying or transferring a coat or covering to a substrate. For example, rollers are used to apply organic liquid solutions or dispersions of all kinds such as paint, ink, adhesives, hot melts, etc., to various surfaces for decorative or protective purposes. Still other types of application may be effected by rollers, such as the application of an imitation or simulation wood graining to metal surfaces.
Ink transfer members of this type, especially printer's rollers, graining rollers, etc., require a peculiar combination of properties and are subject to severe use. One problem that has long plagued the use of transfer members is their susceptibility to the solvating action of organic solvents, such as benzene, toluol, acetone, and the like, which constantly contact and spread over the member. Under these circumstances, the hardness of the member increases during use because solvents leach away those components which keep the transfer member at a relatively durometer. The organic solvents may also attack a roller causing it to swell out of true and still otherwise destroy its useful physical properties. Wash-up fluids can be the worst offenders. Presses equipped with automatic wash-up features have to operate quickly and so use strong solvents.
One roller used in the printing industry is prepared from a composition of animal glue or such glue modified with glycerine. Rollers of this type, however, have certain disadvantages in that they are vulnerable to atmospheric conditions and to the action of ingredients contained in commercially used inks such as the described solvents. Rollers of this type are also quite hygroscopic and tend to absorb moisture and swell when the humidity is high. Further, in warm weather, the glue compositions become warm and flexible while, conversely, in cold weather they tend to become hard. The glue-glycerine rollers are relatively inexpensive but often have to be re-cast or re-surfaced because of their tendency to change in hardness, crack, and at times disintegrate during use.
Various substitutes have been proposed, such as rubber and vulcanized oil compositions. However, these materials are also quite susceptible to the action of oils and solvents in inks and the like. Rubber rollers especially are apt to swell. Moreover when these rollers dry, they are not only harder but shrink in size.
In order to impart some dimensional stability to ink transfer rollers, blankets, and the like, it has been proposed to use stronger and harder resins from which to form such transfer members, for example, synthetic resins having a Shore A hardness of about 75 to 90. However, such resins are not tacky and have a smooth, shiny surface, such that the ink transfer or ink carrying qualities are seriously adversely affected. On the other hand, if softer, more resilient resins are used, the transfer member is subject to undesired stretching and distortion which can force it out of true. Synthetic rubber inking transfer members which have tended to replace glue glycerine transfer members in modern high-speed presses are more stable but are inadequate for other reasons. For example, some polyurethanes have a tendency to depolymerize in use. Copolymers of butadiene and acrylonitrile harden and crack on exposure to oxygen.
Another type of inking roller in use has a surface formed of a polyester-based polyurethane. Such rollers are useful with hydrocarbon-based inks but have the disadvantage of being readily penetrable by vegetable oil inks which are commonly used in lithographic processes. Due to such penetration, a film of ink forms on the roller surface which creates a residual color-carryover problem, since any future printing is done on a film of ink rather than on the roller surface.
Rollers of the type last described have also been found to be quite susceptible to the action of certain solvents, such as the toluol solvents, that are used in graining inks and also swell due to contact with such solvents. Further, such polyurethanes have a tendency to revert to the liquid state unless an inhibiting agent is incorporated. Use of such an agent increases the cost and complicates the manufacture of the ink-transfer member.
In more recent years a hard rubber has been used in forming inking rollers and the like. While such hard rubber inking rollers have certain advantages, they still leave much to be desired. In particular, hard rubber transfer members have a limited life due to mechanical damage, swelling due to adsorption of an ink vehicle or organic solvent, and the development on the surface of a glaze which causes stripping. It is often necessary to clean such rollers every week or even more frequently.
My prior U.S. Pat. No. 2,538,751 discloses an inking roller of the glue-based type having a surface layer formed from a polyalkylene polysulfide synthetic resin containing an extender.
My prior U.S. Pat. No. 2,598,167 discloses a roller having a surface of animal glue and a central body of vesicular, similar animal glue and a softening material.
My prior U.S. Pat. No. 3,387,074 discloses a process for preparing an ink transfer member such as a printer's blanket from a liquid polyurethane reaction mix by the use of a sheet backing member which is subsequently removed to form the member.
My prior U.S. Pat. No. 3,475,803 discloses a roller for applying ink and the like comprising a layer of resilient cellular material and an outer surface of polyurethane overlying and surrounding the cellular material. The polyurethane is formed from the reaction of a polyethylene glycol, a polyol cross-linking agent, and an isocyanate.
U.S. Pat. No. 3,724,047 to Peterson discloses a polyurethane inking sleeve for a printing roller body which is made by mixing millable, curable polyurethane, a curing agent, plasticizer and fillers and then forming a sheet from the mixture. The sheet is overwrapped about a suitable mandrel and then cured after which the resultant structure is shaped by grinding to provide a tube of uniform wall thickness.


A patient-matched cutting block including a surface or point contact features adapted to at least partially conform to or reference a patient specific anatomy. The cutting block having guide slots configured for guiding the movement of cutting tools relative to the patient specific anatomy or features configured to mate to and guide standard cutting guides relative to patient specific anatomy in order to form plateau and eminence resections of the patient specific anatomy.

Patient-matched or patient-specific implant guides are used during orthopaedic procedures to accurately insert pins, guide cuts, and place implants. The patient-matched guides are generally based on data received from an MRI or CT scan of the patient and rely on matching an anatomic feature for correct positioning of the guide during a surgical procedure.
Generally these patient matched guides are held in place by pins or screws to reduce the risk of slipping during surgery. Pins are typically inserted into healthy bone outside of the rejection area to ensure continued stability and to avoid interference with surgical instruments used during the procedure.
There remains a need for a less damaging solution that reduces the amount of damage to healthy bone and retains at least a portion of the tibial eminence during use of surgical instrument guides while maintaining the ease of use and speed associated with patient-matched guides.
There also remains a need for improved structural rigidity of the features guiding cutting/tools relative to patient specific anatomy.
There also remains a need for a means within patient matched instrumentation of making resections which result in the appropriate balance soft tissue tension.
There also remains a need for patient matched instrumentation able to orient and guide the additional resections required for preserving at least a portion of the proximal tibia.

Patient-matched instrumentation and methods


A lead- and arsenic-free borosilicate glass having an improved melting characteristic is described. The melting rate of the glass was improved dramatically by making the composition substantially free of MgO and CaO and adding 1.0 to 4.0 weight percent BaO. The improved melting characteristic yielded up to a ninety-nine percent reduction in the number of unmelted batch stones.

This invention is related to borosilicate glasses and in particular to lead- and arsenic-free borosilicate glasses. In another aspect, this invention is related to glass envelopes for electric lamps.
In recent years, the glass industry has been moving toward the elimination of lead and arsenic from borosilicate glass compositions. For example, commonly-owned U.S. Pat. No. 6,284,686, which is incorporated herein by reference, describes a useful lead- and arsenic-free borosilicate glass composition for use in electric lamps (OSRAM SYLVANIA Type SG773). Other lead- and arsenic-free borosilicate glasses used to manufacture electric lamps include types 8486 and 8487 manufactured by Schott Glas.
While the elimination of lead and arsenic is beneficial to the environment, their elimination can result in an increase in the number of glass defects, particularly knots, stones, and cord. It is believed that the majority of the defects which occur in lead- and arsenic-free borosilicate glasses are caused by incomplete melting and a reduced convective mixing of the batch components, e.g., knots and stones are the remnants of incomplete melting and surface scum. Therefore, it would be desirable to improve the melting characteristics of lead- and arsenic-free borosilicate glasses to reduce the number of glass defects.
It is an object of the invention to obviate the disadvantages of the prior art.
It is another object of the invention to reduce the number of glass defects which occur when melting lead- and arsenic-free borosilicate glasses.
It is yet another object of the invention to improve the melting characteristics of lead- and arsenic-free borosilicate glasses.
These and other objects and advantages of the invention are achieved by substantially eliminating MgO and CaO from the borosilicate glass formulation and adding from 1.0 to 4.0 weight percent of BaO. In particular, there is provided a lead- and arsenic-free borosilicate glass having a composition which comprises in weight percent:
wherein the sum of Na2O, K2O and Li2O is from 4.7 to 6.5 weight percent and the composition is substantially free of MgO and CaO.
Preferably, the borosilicate glass of this invention has a BaO content from 2.0 weight percent to 4.0 weight percent, and more preferably, 2.0 weight percent.
In a narrower aspect, the lead- and arsenic-free borosilicate glass of this invention has a composition which comprises in weight percent:
wherein the sum of Na2O, K2O and Li2O is from 4.7 to 6.5 weight percent and the composition is substantially free of MgO and CaO.
For a better understanding of the present invention, together with other and further objects, advantages and capabilities thereof, reference is made to the following disclosure and appended claims.
Glass defects resulting from incomplete melting and reduced convective mixing tends to be more of a problem for gas-fired melters as compared to electric glass furnaces. Gas-fired melters produce glass melts with molten surface layers and rely on convective currents in the melt for mixing the molten surface with the bulk. Electric glass furnaces are usually cold crowned so that gravity acts to pull the cooler, denser glass at the surface into the melt. The cooler surface also reduces volatilization and surface scum formation. Therefore, although the glass of this invention may be melted in most conventional glass melters, including electric furnaces, the improved melting characteristic it provides is particularly advantageous for gas-fired melters as described herein.
During the melting process in a gas-fired melter, fining gases can float refractory grains (primarily sand grains) to the surface of the melt, resulting in density gradients. An accumulation of sand grains at the melt surface will be difficult to mix with the underlying, higher density glass. A silica-rich surface scum can result. To prevent scum formation, convective forces are needed to move sand grains back into the melt to complete the melting process. With gas-fired melters, it is common practice to install a single or dual bubbler row in the melter to assist convective mixing. This method is only partially effective in preventing silica scum.
Lowering melt surface tension of the borosilicate glass was investigated as a means to improve convective mixing. Melting experiments have shown that with lead-and arsenic-containing borosilicate glasses, convective mixing is quite vigorous. Both PbO and As2O3 lower melt surface tension. BaO is also known to lower the surface tension of glass.
However, other alkaline earths, such as MgO, CaO, and SrO are all known to increase surface tension. (See, e.g., W. A. Weyl and E. C. Marboe, The Constitution of Glasses: A Dynamic Interpretation, Vol II, (1964), pp 639-644; and M. B. Volf, Chemical Approach to Glass, Elsevier, (1984)). It was discovered that the melting and fining characteristics of the Type SG773 lead- and arsenic-free borosilicate glass described in U.S. Pat. No. 6,284,686 could be dramatically improved when MgO and CaO were removed from the glass composition and from 1.0-4.0 weight percent (wt. %) BaO added. In particular, ninety-nine percent fewer stones (unmelted raw material particles) have been observed compared to a typical SG773 glass. This dramatic improvement is believed to be the result of better convective mixing in the melt caused by lowering the melt""s surface tension.
It is common practice for manufacturers of prior art borosilicate glass compositions to use dolomite, CaMg (CO3)2, as an inexpensive source of MgO and CaO. Dolomite is not used in the borosilicate composition of this invention since MgO and CaO are not contained in the glass composition. However, although CaO are MgO are not purposefully added to the borosilicate glass of this invention, small amounts of CaO and MgO cannot be completely excluded since Mg and Ca impurities may be present in some of the naturally occurring batch materials. Therefore, as used herein, substantially free of MgO and CaO means that the aggregate amounts of MgO and CaO in the glass composition do not exceed about 0.15 weight percent (wt. %).
Both anhydrous borax (ABX) and 5-mol borax (BX), Na2O.B2O3. 5H2O, have been used as sources of B2O3 and Na2O in borosilicate glass compositions. Laboratory experiments have shown that silica grains are floated the most when 5-mol borax is used as the borax containing raw material. In particular, the greatest improvement in the melting rate observed thus far was for a batch containing 4 wt. % BaO (no dolomite) melted with a 5-mol borax.

Lead- and arsenic-free borosilicate glass having improved melting characteristic


A dock float having a sealed elongated buoyant hollow housing with at least one longitudinal channel for securing a joist to which decking is supported. A floatable marine dock is constructed by interconnecting two similar floats by securing header boards in laterally extending recesses in the ends of each float. The width of the floatable dock is determined by the length of the header boards and decking. The length of the floatable docks may be varied by juxtapositioning in an end to end manner any required number of floats.

Various designs of floatable marine docks are known. A typical construction for a floatable marine dock is shown in U.S. Pat. No. 2,986,749 ('749), T. J. Webber et at., issued on Jun. 6, 1961. Patent '749 discloses a floatable dock having a rectangular frame made of aluminium and deck plates connected thereto. For buoyancy, a floatation device consisting of a foam plastic substance is positioned inside the frame.
It is known to substitute suitable materials in the floatable dock construction disclosed in Patent '749 depending on its intended application and cost. For example, the frame and decking may be made of suitable metals, plastics or woods. In addition, floatation devices may be in the form of metal or plastic barrels or drums; women boxes; or hollow fibreglass structures.
Floatable marine docks are commonly used on bodies of water that are difficult to access. Consequently, pre-fabricated floatable docks are difficult to transport to the body of water on which they are to be used due to their shape and size. Furthermore, the construction of a floatable marine dock, for example the floatable dock disclosed in Patent '749, is complex and, accordingly, requires special tools and significant labour and skill. Thus, a floatable dock having a simple construction that could be quickly and easily assembled by a carpenter or handyman using standard tools and a minimum of materials would be desirable.


A method and an apparatus for performing periodic correction of metrology data. At least one semiconductor wafer is processed. Metrology data from the processed semiconductor wafer is acquired. At least one test wafer is processed. Test wafer metrology data from the processed test wafer is acquired. A test wafer metrology calibration process is performed upon the acquired metrology data using the acquired test wafer metrology data to produce a calibrated metrology data. At least one control input parameter adjustment is performed for subsequent manufacturing processes based upon the calibrated

1. Field of the Invention
This invention relates generally to semiconductor manufacturing, and, more particularly, to a method and apparatus for performing a periodic calibration of metrology data results.
2. Description of the Related Art
The technology explosion in the manufacturing industry has resulted in many new and innovative manufacturing processes. Today""s manufacturing processes, particularly semiconductor manufacturing processes, call for a large number of important steps. These process steps are usually vital, and therefore, require a number of inputs that are generally fine-tuned to maintain proper manufacturing control.
The manufacture of semiconductor devices requires a number of discrete process steps to create a packaged semiconductor device from raw semiconductor material. The various processes, from the initial growth of the semiconductor material, the slicing of the semiconductor crystal into individual wafers, the fabrication stages (etching, doping, ion implanting, or the like), to the packaging and final testing of the completed device, are so different from one another and specialized that the processes may be performed in different manufacturing locations that contain different control schemes.
Generally, a set of processing steps is performed on a group of semiconductor wafers, sometimes referred to as a lot, using a semiconductor manufacturing tool called an exposure tool or a stepper. Typically, an etch process is then performed on the semiconductor wafers to shape objects on the semiconductor wafer, such as polysilicon lines, each of which may function as a gate electrode for a transistor. As another example, a plurality of metal lines, e.g., aluminum, may be formed that serve as conductive lines that connect one conductive region on the semiconductor wafer to another. The manufacturing tools communicate with a manufacturing framework or a network of processing modules. Each manufacturing tool is generally connected to an equipment interface. The equipment interface is connected to a machine interface to which a manufacturing network is connected, thereby facilitating communications between the manufacturing tool and the manufacturing framework. The machine interface can generally be part of an advanced process control (APC) system. The APC system initiates a control script, which can be a software program that automatically retrieves the data needed to execute a manufacturing process.
FIG. 1A illustrates a typical semiconductor wafer 105. The wafer 105 typically includes a plurality of individual semiconductor die arranged in a grid 150. Photolithography steps are typically performed by a stepper on approximately one to four die locations at a time, depending on the specific photomask employed. Photolithography steps are generally performed to form patterned layers of photoresist above one or more process layers that are to be patterned. The patterned photoresist layer can be used as a mask during etching processes, wet or dry, performed on the underlying layer or layers of material, e.g., a layer of polysilicon, metal or insulating material, to transfer the desired pattern to the underlying layer. The patterned layer of photoresist is comprised of a plurality of features, e.g., linetype features, such as a polysilicon line, or opening-type features, that are to be replicated in an underlying process layer.
Turning now to FIG. 1B, once at least one manufacturing process is performed upon the semiconductor wafers 105, a metrology tool 350 is used to perform a metrology data acquisition process. The metrology tool 350 acquires metrology data from the processed semiconductor wafers 105. Accuracy of the results acquired by the metrology tool is very important. Metrology data provides information relating to the quality of the processes performed on the semiconductor wafers, the condition of the semiconductor wafers 105 being processed, and information relating to the performance of the devices produced from the processed semiconductor wafers 105. Often, data from the metrology data acquisition process is used to perform adjustments to other manufacturing processes performed on the semiconductor wafers 105. Also, metrology data is used to predict errors that may occur on semiconductor wafers 105 that are subsequently processed. The predicted errors are then used to calculate control parameters for a manufacturing tool during subsequent processing of semiconductor wafers 105.
Many times, metrology tools 350 operate with a slight amount of measurement variation from one time period to another. For example, a particular metrology tool 350 may produce slightly different measurement results from one day to another. Often, environmental factors, such as temperature, pressure, etc., can vary from day to day, causing variations in the operation of the metrology tools 350. Furthermore, other undetectable random variations in the operation of the metrology tools 350 can occur from one time period to another. These variations can cause errors in adjustments made to manufacturing operations during an attempt to compensate for measured errors. For example, metrology tools 350 may be used to measure the critical dimensions (CD) of a feature formed on a semiconductor wafer using a photolithography process. Based upon the CD measurements, adjustments to the photolithography process, such as exposure time, exposure light intensity, etc., are made to compensate for any CD errors detected. Since critical dimension data are represented by very minute measurement, any errors in the CD data can result in significant errors in the overall structures of the features on semiconductor wafers 105. Due to variations in the accuracy of the metrology tool 350 from one time period to another, quality and operation of devices produced from the processed semiconductor wafers 105 can significantly vary from one time period to another.
The present invention is directed to overcoming, or at least reducing the effects of, one or more of the problems set forth above.
In one embodiment of the present, a method is provided for performing periodic correction of metrology data. At least one semiconductor wafer is processed. Metrology data from the processed semiconductor wafer is acquired. At least one test wafer is processed. Test wafer metrology data from the processed test wafer is acquired. A test wafer metrology calibration process is performed upon the acquired metrology data using the acquired test wafer metrology data to produce a calibrated metrology data. At least one control input parameter adjustment is performed for subsequent manufacturing processes based upon the calibrated metrology data.
In another embodiment of the present invention, a system is provided for performing periodic correction of metrology data. The system of the present invention comprises: a metrology tool adapted to acquire metrology data from a processed semiconductor wafer; a metrology tool database electronically coupled to the metrology tool, the metrology tool database being adapted to store metrology data; a test wafer database electronically coupled to the metrology tool, the test wafer database being adapted to store test wafer metrology data; and a process control electronically coupled with the metrology tool database and the test wafer database, the process control being adapted to acquire data from the metrology tool database and the test wafer database to calibrate the metrology data and determine at least one control input parameter for processing a semiconductor wafer.

Method and apparatus for periodic correction of metrology data


A multiple coil electromagnetic pickup converts into signals the flux varions produced by the passing of the teeth of a sound wheel. The pickup comprises at least two assemblies each consisting of at least one coil, one pole piece and one straight magnet all axially aligned, the assemblies being arranged in parallel to each other and magnetically insulated from each other by a screen. Measurement of rotational speed produces two output signals.

The invention pertains to speed measuring devices and more particularly to a multiple coil electromagnetic pickup capable of converting into signals the flux variations produced by the passing of the teeth of a sound wheel connected to a moving mechanism.
Such pick-ups are known, comprising a magnetic bar at the end of which is wound a multilayer coil. More generally, and in order to reduce the diameter of such pick-ups, the coil is mounted on a pole piece which is mechanically attached to the extremity of a bar with as small an air gap as possible. The use of electromagnetic pickups in aviation, and more generally in circuits which must have particularly high reliability, has led technicians to duplicate each device, resulting in more significant bulk. The problem is appreciably the same when it is necessary to reproduce the received information on a second reading or recording device. This requirement has led to the present technology, consisting of placing several windings on a single magnetic circuit. This technique entails certain drawbacks:
it produces a mutual inductance higher than 0.95; since the windings then behave as a transformer, every parasitic signal which arrives at one of the windings is transmitted to the others due to the inductive and capacitive effects. The result is that the operational reliability of devices connected to such windings is compromised;
when one winding is short-circuited, the output power available in the other is significantly attenuated and may affect the reliability of the system. In order to make this phenomenon acceptable, the pickup must be overdimensioned or the procedures of French Pat. No. 2,075,781 must be applied. According to that patent, the signal attenuation in the non-short-circuited coil is eliminated by magnetically coupling the two coils. Thus, when one of the coils is short-circuited, the induced voltage in the other coil increases slightly. The increase in the induced current in the short-circuited coil causes a larger inverse flux to develop in the core of the non-short-circuited coil and, consequently, an increase in the voltage supplied by the coil. A pickup embodied in this manner is a closed magnetic circuit pickup and is relatively difficult to make, given the fact that the two pole pieces form a stator, one of them being placed at one end of the magnet and the other at the end of the coils, which is not in contact with the magnet. This relatively bulky arrangement cannot yield a pickup of very small size.
Another proposal consists of winding multiple windings in accordance with the "several wires in hand" technique; but in this case the electrical insulation between the windings is weak and causes significant problems.

Societe Nationale d'Etude et de Construction de Moteurs d'Aviation


An acupressure glove includes upper and lower skins which closely adhere to the back and palm of a hand, respectively, when worn by a user, the skins defining a cavity therebetween for receiving a hand; a plurality of receiving holes in the upper and lower skins; a plurality of hollow acupressure protuberances for applying acupressure to the hand, the protuberances being positioned within the cavity in association with selected receiving holes, each acupressure protuberance including a flat sheet portion which lies against the inner surface of one skin, a narrow neck portion extending toward the other skin from the flat sheet portion and a bulbous portion extending toward the other skin from the narrow neck portion, the narrow neck portion and the bulbous portion being hollow and the flat sheet portion having an opening which opens into the narrow neck portion; and a plurality of securing protuberances extending into the receiving holes and engaged within the plurality of hollow acupressure protuberances, respectively, for retaining the acupressure protuberances to the upper and lower skins, each securing protuberance including a second flat sheet portion which lies against an outer surface of one skin, a second narrow neck portion extending toward the other skin from the second flat sheet portion and a second bulbous portion extending toward the other skin from the second narrow neck portion, the bulbous portion having an outer dimension greater than the neck portion of the acupressure protuberances.

This invention relates to acupressure gloves with adhered acupressure devices in the form of acupressure protuberances being made of non-ferrous metals for cooperation with blood vessels distributed on the palms, backs of hands or finger parts of the human body.
More specifically, it relates to an invention activating the living body activity by acupressure and ion treatment effect by means of the projected protuberances being made of non-ferrous materials.
In the interior of the human body there is a minute living electric current which operates or runs the living body. This current relates to electric physiological phenomena of muscle contractions, etc. If the balance of such minute living electric current is destroyed by an external influence of stress, etc., a magnetic change can occur, resulting in the living organization be inharmonious.
As a result of the above, in a part of the body in which there occurs a large disproportion, a disease or pain develops. Generally, as a means to settle this symptom, medicines such as painkillers have been prescribed. This therapy loses in some cases the effect of the medicine.
Accordingly, a magnetic physical means is needed to overcome this problem.
In the cuticle of the palms, the backs of the hands or finger parts, the pressure points corresponding to each part of the human body is distributed.
On the other hand, the cuticle of the skin has cations, and its endothelium has anions. Thus, when a force is applied to pressure points on the skin of the hands or fingers with a pressure device generating anions, the corresponding human body can be balanced.
As a pressuring device as described above, it is known to apply pressuring acupressure protuberance generating anions to the pressure points of the skin with adhesive tape. Also known is an acupressure device which provides a number of protuberances in a pattern, which applies a force upon being gripped by a hand.
Conventional pressuring devices as the above were, however, made to apply pressure to pressure points with adhesive materials. For this reason, the adhesive materials were easily separated from the skin because of the weakened adhesive power by sweat.
Furthermore, there was a roll-shaped acupressure device, which has acupressure protuberances, being gripped by a hand. In this case, the treatment effect was declined because the pressing positions of the acupressure protuberances were incorrect. It was inconvenient for a user to use because of the pressure applied with acupressure protuberances for a long time.

Acupressure gloves adhered acupressure devices


A method and apparatus for non-uniformity compensation for infrared focal plane arrays in an infrared imaging device (10) including a calibration operation and a correction operation. The calibration operation measures the response (24) generated by the detector elements (14) in the focal plane array (16) to a wide range of known signal flux levels of infrared radiation (22) produced by a uniform black body under controlled conditions. The responses (24) are then stored as a digital video signal (27) in a look-up table memory (38). The correction operation achieves the near real-time compensation of a second response of the detector element (14) to the signal flux level of infrared radiation (22) produced by objects in the field of view surveyed by the imaging device (10) by comparing the second response to the stored digital video signals (27) and interpolates the second response to a corrected digital video output signal (31).

1. Technical Field
The present invention relates generally to infrared imaging devices and, more particularly, to a method and apparatus for compensating for the nonuniformity of response of the detector elements of an infrared focal plane array.
2. Discussion
Infrared imaging devices convert invisible infrared energy into useful forms such as visible images. This is accomplished by first detecting infrared radiation which is emitted or reflected from objects in a field of view and then producing resultant data corresponding to the signal flux level of the infrared radiation that is detected. Generally, infrared imaging devices include an optical system for receiving the infrared radiation, detector elements, such as in a focal plane array, for producing a response corresponding to the signal flux level of the infrared radiation received through the optical system, an electronics unit for processing the response produced by the detector elements and generating a corresponding digital output, and may also include an output display unit, such as a cathode-ray tube (CRT), for displaying a resultant visible image, if desired.
The operation of an infrared imaging device may generally be described as follows: the optical system surveys a field of view and causes infrared radiation to be directed toward the detector elements, each of which correspond to discrete points, or pixels; each detector element then generates an analog response, such as a voltage or current, corresponding to the signal flux level of the infrared radiation received by that detector element; the analog response is then processed in the electronics unit which produces a digital signal output; and, finally, the output is converted into a useable form, such as a visible image generated by an output display unit. Typically, this procedure is continuously repeated for generating a series of useable data in near real-time, depending upon the imaging application desired to be performed.
However, through experience it has been learned that because each individual detector element in a focal plane array is not identical, each detector element may produce a different response to a given signal flux level of infrared radiation that it receives. That is, a detector element "A" and a detector element "B" may be exposed to the same signal flux level of infrared radiation, however, each detector element may generate a unique analog response. In addition, the converse may also be true. That is, a detector element "A" and a detector element "B" may be exposed to different signal flux levels of infrared radiation, however, each detector element may generate the same analog response. This phenomenon is well-known as "non-uniformity of response" or, simply, "non-uniformity." It has also been learned that the relationship between the response produced by a detector element in relation to various signal flux levels of infrared radiation is non-linear.
Consequently, infrared imaging devices must compensate for the variations between detector elements and correct them to an "absolute scale" in order to produce consistent and reliable image data.
A means to accomplish the necessary "non-uniformity compensation" so that accurate image data may be generated by the infrared imaging device has been to calibrate each detector element in the focal plane array with the electronics unit. In this manner, the electronics unit produces a "corrected" digital signal output which reflects a "normalized" value for the signal flux level of infrared radiation that is received by a given detector element. Typically, non-uniformity compensation has been accomplished by the use of a two-point or a four-point calibration method having analog gain and offset adjustments. However, this technique has presented the disadvantage of allowing the analog response of any particular detector element to be compensated for non-uniformity only over a narrow dynamic range of signal flux levels of infrared radiation. Therefore, previous non-uniformity compensation schemes have been inadequate where the field of view of the imaging device has contained a wide dynamic range of signal flux levels of infrared radiation, such as a "cold" sky and a "hot" terrain.
In light of the forgoing discussion, it is a principal object of the present invention to provide a method and apparatus for non-uniformity compensation for use in the focal plane array of an infrared imaging device capable of compensating for non-uniformity over a wide dynamic range of signal flux levels of infrared radiation. In addition, it is another object of the present invention to provide a focal plane array uniform response which can be calibrated as an absolute radiometer.

Wide dynamic range non-uniformity compensation for infrared focal plane arrays


A stop for stopping articles moving along a conveyor includes a stop arm mounted for rotation about a cam shaft, which, when rotated, moves said stop arm from an extended position to a retracted position.

The present invention relates to conveyors, and, in particular, to a stop that is used to stop articles that are moving along the conveyor.
Stops have been used on conveyors for some time, particularly in assembly operations, where the product is assembled at various stops along the conveyor line. Some stops use a cylinder to gradually decelerate the article and cushion the stopping action, so that the articles being conveyed are not jolted when they are stopped. However, when the article is released, the stop is usually slid straight down, and the pallet or other article tends to jump as it is released by this mechanism, so that the jarring of the articles takes place upon release. The pallet also tends to wear at the corner, because of this jumping action. Also, the stop is constantly under load as it is holding the article against the force of the conveyor, and sliding the stop with that constant force on it creates substantial friction. It is also very difficult to seal the linear bearing surface, which means that dirt gets into the bearing surface, causing wear and other problems.


The invention provides a method of interacting with interactive items in a user interface. A user interface is provided which includes a control region and a display region. A plurality of interactive items are displayed in the display region. The user interface tracks the position and movement of a pointer in the control region, and interprets the movement and/or position of the pointer. Movement along a first predefined axis is interpreted as focus pointing only, movement along a second predefined axis is interpreted as view pointing only. Movement having components along both axes is interpreted as both view pointing and focus pointing, enabling both view pointing and focus pointing to be substantially simultaneously performed.

A user interface typically provides a number of interactive items which need to be navigated through by a user in order to locate a target interactive item. The number of items available in a user interface may be such that it is not possible to display all of the items in a suitable manner on a display associated with the user interface at once. In order to locate or navigate to the target interactive item, it may necessary to perform certain actions to locate the target interactive item. The actions may be, for example, to scroll, pan, zoom, page or the like. When a specific target interactive item has been located, and a user wishes to locate a next target interactive item, the user may again need to perform certain actions in order to locate the next target interactive item. The act of manipulating the display of the user interface in order to alter the displayed targets therein may be referred to as "view pointing". A pointer in the user interface is moved in a particular manner so that the view is suitably altered until the target becomes visible in the display.
In the remainder of the specification, the term "view pointing" should be construed to mean any action which alters a display of a user interface, including, but not limited to, elements such as panning, zooming, paging, changing the orientation of an item, the location of an item on the display, the transparency level of an item, making an item appear or disappear, fade in or out, or the like. It should be noted that the action of zooming may include or involve other actions such as increasing a size, changing an orientation or location of an item, making an item appear or disappear, or the like.
When a target interactive item is visible in the display, a user typically navigates the pointer to the target in order to select it. This may be referred to as "focus pointing". A pointer in the display is moved in a particular manner so that the target may be selected, viewed or discovered. In this specification, focus pointing refers to any action which affects a specific focal point or area on a user interface, including, but not limited to, moving an interactive item, moving a cursor, or interacting with a specific target interactive item.
View pointing and focus pointing may be referred to as "target-directed movements". A target interactive item may be any interactive item, where an interactive item could be, for example, a document, content item, event, file, folder, container, media item, music item, photo, video, title, clip, message, entry, text, tag, data point, character, emoji, icon, link, button, application, program, executable file, digital file, icon, menu item, hypertext link, button or any other target that may be positioned in a display region of a user interface as part of a number of such interactive items. Throughout this specification, the term "interactive item" should be broadly interpreted and is used to refer to any target provided by a user interface and which a user may wish to select, whether or not it is visible to the user at a given point in time.
A pointer may typically be a cursor provided by a user interface and controlled by an input device such as a mouse. The pointer may also be the position, movement and/or touch of any other pointing tool or the body of the user in a control region provided by the user interface. In cases where touch-sensitive displays are employed, the pointer is typically a finger or fingers of the user. Implementations have further been developed wherein electronic devices are equipped with z-axis tracking. In such a case, a device may, for example, be capable of tracking the position and/or movement of a pointer in a region above a display plane such as a touch-sensitive electronic device.
Known user interfaces generally provide different target-directed movements as distinct modes. For example, only one form of view pointing may be activated at a given point in time, and a particular signal may be required from the user in order to enter a desired mode or switch between modes. For example, in conventional "point and click" user interfaces, scrolling may be achieved by operating a scroll wheel located on a mouse, while zooming may be achieved by pressing a certain key on a keyboard while operating the scroll wheel. In touch-sensitive devices, certain discrete gestures such as pinching the screen may achieve zooming, while other gestures such as swiping may achieve scrolling.
U.S. Pat. No. 8,654,076 discloses a method of switching between three distinct modes when using an electronic device equipped with z-axis tracking. In a normal mode, a number of interactive items are displayed on a touch screen. In this mode, the pointer, which is typically a finger of a user, is out of a tracking range of the device. Once the pointer hovers over the touch screen within the tracking range but without touching it, a zooming and panning mode is entered. Once a touch input is provided, a pointing mode is entered. In this mode, panning is prevented and the user is capable of moving the pointer to select a target interactive item.
A problem associated with methods such as those described above is that at least some target-directed movements, including scrolling, zooming, panning and moving the pointer to select a target interactive object, may be implemented as distinct modes. A user may thus not be able to simultaneously perform, for example, zooming and scrolling. Furthermore, the efficiency of such user interfaces may be unsatisfactory, as the user may be required to alternate between different modes, potentially resulting in repetitions of "point and click" to ultimately select a target on an interactive object.
The present invention aims to alleviate this and other problems, at least to some extent.

Target-directed movement in a user interface


A communications network, for example forming a local exchange carrier telephone network, utilizes three layers of fiber optic rings. The point of demarcation between customer premises media and network media comprises an intelligent soft network interface device or “soft NID”. First layer rings carry telephone and data communications between the soft NIDs and remote terminals. Several remote terminals in an area communicate via one of the next higher level rings to a host digital terminal. The host digital terminals communicate with each other via a backbone optical fiber ring, and a media gateway controller on this ring provides high level service logic. The remote terminals and preferably the host digital terminals are service switching points (SSPs), for intelligent services provided by the network. Local legacy switches connect to remote terminals, whereas a router on the backbone provides communications to other networks, including legacy long distance networks.

Increasingly, there is a need for a carrier network architecture capable of providing a variety of communication services, for example, ranging from voice grade telephone service to packet switched data services and broadband digital communications services. Modern society continues to create exponentially increasing demands for communication of various forms of information. Desired services now range from simple text and voice communications up through broadband communications for video and multimedia applications.
The existing telephone network has fostered much of this growth. However, the current architecture of that network, essentially designed in the 1960s, uses time division multiplex technology optimized for voice grade telephone services. Although many users are satisfied with the services of such a network, increasingly many customers are exploring competing options for obtaining communication services that involve much higher-rate digital communications. Consequently, telephone carriers are faced with a need to migrate the existing services up to a higher capacity network that will support those services as well as the newer broadband digital services demanded by sophisticated customers. These trends are forcing telephone service carriers to migrate to a fast packet network architecture supporting broadband services. Existing end office switches simply cannot handle broadband services and are not readily adaptable to the fast packet operations. A number of proposals have been suggested to upgrade or replace the telephone network, to provide the newer types of services.
For example, U.S. Pat. No. 5,864,415 to Williams et al. discloses a fiber-to-the-home network architecture. Optical fiber extends from the central office to an intelligent interface device within the home. The intelligent interface device provides interconnections to various analog and digital communication media within the home, including a telephone line and a data network (10BaseT cable). The Williams patent also suggests use of a ring architecture, for the higher-level portions of the network.
U.S. Pat. No. 5,541,917 to Robert D. Farris discloses an advanced intelligent network type communication system, which provides both telephone service and broadband service. The disclosed architecture includes service switching point (SSP) type telephone central offices, signaling transfer points (STPs) and a central controller implemented as an integrated service control point (ISCP). At least some services are provided via SSP type host digital terminals (HDTs) and/or asynchronous transfer mode (ATM) type SSP switches. The HDT, for example, communicates via optical fiber to optical network units (ONUs) at the curb-side, and it communicates with higher level elements of the network via fiber.
Recent proposals for fiber optic metro area networks, such as that described in the white paper: Sistanizadeh, "Managed IP Optical Internetworking, a Regional IP-over-Fiber Network Service Architecture," © 2000 Yipes Communications, Inc., suggest a multi-layered optical fiber ring network. A first level ring connects Ethernet switches that provide access for customer equipment to Ethernet switches in the distribution plane. A next level ring connects a number of the distribution switches, and this ring connects to a switch at a hub on the national ring network.
While these proposals for network architecture separately address some of the needs of the carrier, such as the incumbent local exchange carrier, from that carrier's perspective, each has certain shortcomings. For example, many of the more recent proposals, such as that by Sistanizadeh, have emphasized handling of broadband data traffic. Although these proposals envision carrying voice (e.g. as voice over IP traffic), they have not adequately addressed issues regarding service control, particularly in such a manner as to enable seamless migration of the wide range of existing telephone services from the old TDM switch network up to the newly proposed packet or ATM based network. Consequently, they have not really addressed issues of serving both newer broadband based applications as well as legacy telephone applications, which many telephone customers will continue to demand (and pay for) for many years to come.
Also several U.S. pre-grant patent publications to Benedyk et al. (US2001/0055380), Sugiyama et al. (US2001/0024438) and Suzuki (US2001/0027983) disclose proposals for using media gateways to interface time division multiplexing (TDM) based telephone equipment to IP-based wide area data networks. These documents also teach control of telephone service through the media gateways at least in part by control functionality provided by one or more media gateway controllers. These architectures apparently are intended as a migration or partial upgrade strategy for the existing telephone carriers. In a somewhat similar vein, Telica (of Marlboro, Mass.) offers a system for interfacing older telephone switches to an IP-based backbone network. Telica proposes a network architecture in which a specialized gateway device interfaces telephone calls and other communications to and from a packet data core network. Although the functions may be integrated in a single device or 'box' having both switching fabric and service logic, they have also suggested the possibility of a more distributed implementation. These proposals have focused on enhanced transport in higher levels of the network. Although such an approach alleviates congestion at the tandem level, that approach does not address issues relating to broadband service transport through levels beyond the backbone. The broadband services do not consistently extend to and through the last mile to the actual customer premises.
Hence a continuing need exists for a network architecture and elements thereof that will efficiently provide a combination of broadband services and telephone services, which will enable a carrier to continue to support existing telephone services as well as meet demands for ever greater digital bandwidth for newer broadband applications out to the network edge. A related need exists for such a network to seamlessly support telephone applications, whether for newer customers serviced through the enhanced broadband elements of the network or for customers accessing the network through remaining legacy equipment.

Multi-layer ring architecture for fiber-to-the-home telco carrier network


A test design assistance device 10 acquires information about the number of levels indicating the number of values which can be obtained for each factor in a plurality of factors of a test target, selects a matrix capable of allocating all of factors in a maximum number of levels information in the matrix capable of allocating factors in multilevel generated based on an orthogonal table, sets the maximum number of the number of levels in the levels of factors which are not allocated as a focused number of levels, and allocates factors in the focused number of levels to the matrix when the number of columns capable of allocating the factors in the focused number of levels is equal to greater than the number of factors in the focused number of levels, in the selected matrix.

1. Technical Field
The present invention is related to a test design assistance device, a test design assistance method, a program, and a computer-readable medium.
2. Related Art
A test may be performed in order to confirm whether or not an abnormal action occurs due to a combination of settings between a plurality of factors in software or the like.
In a case where the combination of settings between the plurality of factors is tested by using an orthogonal table, (n+1) tests are required to be performed with respect to the number of factors n when the number of levels which included in all of the factors is two, and thus a test case is linearly increased with respect to an increase in the number of factors. For this reason, a method has been proposed in which orthogonal tables which have only the same level of factors are laterally connected to each other only by the number of columns thereof, then the laterally connected orthogonal tables are vertically formed into two stages, and the number of factors n2 can be performed with the test case of 2n−1 and the orthogonal table at the lower stage by using a test matrix which is generated by cyclically shifting the order of columns one by one for each orthogonal table.

Test design assistance device, test design assistance method, program and computer-readable medium


A composite composed of vulcanized rubber and thermoplastic resin which adheres tightly to the rubber can be obtained by treating the surface of the vulcanized rubber with at least one of halogen, halogen generating compound and halogenoid, and bonding melted polyamide resin, polyester resin, styrene series resin or acrylic resin to the above treated rubber surface region by the injection or extrusion molding.

1. Field of the Invention
The present invention relates to a method of bonding vulcanized rubber to resin. 2. Description of the Prior Art
Among recently developed various thermoplastic resins, resins called as engineering plastics are known. These resins are polyamide resin, polyester resin, polycarbonate resin, polyacetal resin, polysulfone resin, silicone resin, polyphenylene oxide resin, polyimide resin, ABS resin, methacrylic resin and the like, and many of them are excellent in mechanical strength, heat resistance, creep resistance, chemical resistance, electrical property, dimensional stability and the like, and can be widely used in place of metals, such as iron, zinc, aluminum and the like, under various use conditions.
In general, industrial rubber products are composites composed of rubber and metal; rubber and plastics; and rubber and inorganic substance, but major part of the rubber products are composites composed of rubber and metal. However, in recent industrial rubber products, the rubber-metal composite tends to be replaced by a rubber-resin composite. Industrial rubber composites are now required to have a light weight, excellent corrosion resistance, chemical resistance, wear resistance and electrical property, and a low friction coefficient.
When the composites of rubber and plastics are produced, the rubber must be tightly bonded to the plastics. In the conventional method for bonding rubber to plastics, a chlorine-containing adhesive is applied on the surface of a resin molded article obtained by the extrusion molding and the resin molded article is bonded to an unvulcanized rubber through the adhesive layer by vulcanization. However, this method of bonding resin molded article to rubber through vulcanization has the following drawbacks. That is, the adhesion strength between the resin molded article and the rubber lowers or the resin molded article cracks due to the repeating cooling and heating cycles or to the heat aging during the vulcanization step, and further the adhesion strength varies depending upon the kind of the resin. Moreover, when thermoplastic resins having a low melting point are used among thermoplastic resins, the resin molded article deforms due to the high temperature and pressure during the vulcanization.

Method of bonding vulcanized rubber to resin


A connecting device (1) for the rotationally fixed connection of first and second shafts (2, 3) that can rotate relative to one another. The connecting device (1) comprises an axially movable connecting element (5) designed such that, in a first axial position (A), the connecting element (5) forms an interlock between the first and second shafts (2, 3) and, in a second axial position (B), the connecting element (5) releases the interlock. The connecting device (1) also comprises an actuating system (6, 8, 9, 10, 11) for moving the connecting element between the first and second axial positions (A, B) and a stop (16) which limits the axial movement of the connecting element (5) in the first or second axial position (A, B). An impact damper (17) is provided for the stop (16) in order to reduce annoying noise when the connecting element (5) strikes against the stop (16).

In a vehicle drive-train such a connecting device serves in particular for engaging an all-wheel shaft or wheel driveshaft, also called an axle driveshaft or side-shaft, or for connecting the two halves of an all-wheel shaft or wheel driveshaft. For example, in a vehicle drive-train having a number of drivable drive axles, it makes it possible to switch over between an all-wheel operating mode, in which more than one or indeed all the drive axles of the vehicle drive-train are driven, and a two-wheel operating mode in which fewer or indeed only one of the drive axles of the vehicle drive-train are driven, and conversely.
For example, DE 198 37 417 A1 (FIG. 2) discloses such a connecting device of a vehicle drive-train for the rotationally fixed connection of two shafts, i.e. an automatic clutch for connecting a front axle to a wheel spindle. The connecting device comprises an electromagnet by which a clutch ring can be moved axially to a first position in which the clutch ring releases an interlock between the shafts, and also comprises a spring by which the clutch ring can be moved axially to a second position in which the clutch ring produces an interlock between the shafts.
The previously unpublished document DE 10 2011 085 839 discloses another connecting device for connecting two shafts. This connecting device comprises on the one hand a sliding sleeve with a groove or step flank arranged on it, and an adjusting means that can be engaged in a switchable manner in the groove/step flank. This displaces the sliding sleeve to a first position when the adjusting means engage in the groove or step flank and the sliding sleeve is rotated, whereby the sliding sleeve releases an interlock between the shafts. On the other hand the connecting device comprises a spring by which, when the adjusting means are disengaged from the groove/step flank, the sliding sleeve can be moved to a second position in which the sliding sleeve produces an interlock between the shafts.
Inasmuch as the shift positions of the clutch ring or the sliding sleeve are defined by a mechanical stop, the impact of the clutch ring or sliding sleeve against the stop can be hard when it is moved to the corresponding shift position. This can lead to disturbing knocking noises.

Connecting device for two shafts having a rebound cushion


A light-emitting element package includes a package body having a cavity; a first lead frame and a second lead frame disposed on the package body; a light-emitting element disposed on the bottom surface of the cavity and electrically connected to the first lead frame and the second lead frame; and a molding part surrounding the light-emitting element and disposed in at least a portion of the cavity. Each of the lead frames includes a first part corresponding to a portion of the bottom surface and side walls of the cavity; a second part corresponding to a portion of an upper surface and outer side surfaces of the package body; and a connection part disposed between the first part and the second part width of the connection part is narrower than the width of the first part and the second part in a region adjacent to the connection part.

Light-emitting devices, such as light-emitting diodes and laser diodes, which use a Group III-V or Group II-VI compound semiconductor material, are capable of rendering various colors, such as red, green, blue, and ultraviolet, by virtue of the development of thin-film growth technologies and device materials, are capable of producing white light at high efficiency using fluorescent materials or through color mixing, and have advantages such as low power consumption, semi-permanent lifespan, fast response speed, safety, and environmental friendliness as compared to conventional light sources, such as fluorescent lamps and incandescent lamps.
Therefore, such light-emitting devices are increasingly applied to transmission modules of optical communication units, light-emitting diode backlights as a replacement for cold cathode fluorescent lamps (CCFLs) constituting backlights of liquid crystal display (LCD) devices, lighting apparatuses using white light-emitting diodes as a replacement for fluorescent lamps or incandescent lamps, headlights for vehicles, and traffic lights.
A light-emitting device is configured such that a light-emitting structure, including a first conductive semiconductor layer, an active layer and a second conductive semiconductor layer, is disposed on a substrate and such that a first electrode and a second electrode are respectively disposed on the first conductive semiconductor layer and the second conductive semiconductor layer. Electrons injected through the first conductive semiconductor layer and holes injected through the second conductive semiconductor layer meet each other to emit light having energy determined by the inherent energy band of a constituent material of the active layer.
A light-emitting device package may be configured such that a light-emitting device is electrically connected with a pair of lead frames on a package body. When the lead frames are secured to the package body, bending portions may be formed.
The bending portions may cause separation of the lead frames from the package body. If the package body and the lead frames are separated from each other, moisture or other foreign substances may permeate a gap therebetween, leading to deterioration in sealing performance of the light-emitting device package.

Light-emitting element package having lead frame with connection portion


A semiconductor device includes a substrate and a doped hafnium oxide layer disposed on the substrate, the doped hafnium oxide layer including a hafnium oxide layer doped with doping atoms and having tetragonal unit lattices, an ion size of the doping atom being greater than an ion size of a hafnium atom.

1. Field
Embodiments disclosed herein relate to semiconductor devices, and more particularly, to semiconductor devices including a dielectric layer.
2. Description of the Related Art
Semiconductor devices may be used in many electronic devices because they may provide multi-functionality, miniaturization and/or low power consumption. Semiconductor devices may include various material layers such as a semiconductor layer, a conductive layer and/or a dielectric layer. The dielectric layers may have various uses in semiconductor devices. For example, dielectric layers may be used in insulating an upper conductive layer from a lower conductive layer, as a gate dielectric layer of a MOS transistor, or as a capacitor dielectric layer. Based on the various uses of dielectric layers, semiconductor devices may require dielectric layers that have superior characteristics. Moreover, it may also be necessary to improve manufacturing process margins for the dielectric layers.

Semiconductor devices including a dielectric layer


A vehicle headrest support includes a tubular body having an elongated slot extending through the sidewall. The slot is dimensioned to permit the support to snap onto the support rod of a headrest attached to a vehicle seat. An upper surface of the support is inclined in a forward direction to tilt the headrest forward toward the occupant's head. A lower end is formed with a substantially flat surface to engage the vehicle seat. The support is particularly suitable as an aftermarket device for attaching to the support rod of an existing vehicle headrest and seat. The support attaches to the support rod of the headrest to prevent pivotal movement of the headrest with respect to the support rod and to prevent the headrest from collapsing toward the vehicle seat upon impact of the occupant's head during a rear end collision.

Headrests are required on all vehicle seats to reduce the likelihood of severe head and neck injuries caused by rear end collisions. During a rear end collision, the occupant's head is thrown backwards at great force. Initially, upon impact, the occupant's torso moves forward as the vehicle is pushed forward, while the head lags behind. The head then rotates to the rear, bending or extending the neck backward in an extension-rotation motion. Then the head rebounds forward causing a flexed neck posture. The headrest on the vehicle seat is designed to limit the rearward rotation of the head and neck thereby reducing the risk of injury.
To minimize head and neck injury, the headrest must be positioned to engage the occupant's head during impact and prevent the head from being thrown backwards. Most vehicles are provided with an adjustment mechanism to enable the headrest to be selectively adjusted at the proper height. Unfortunately, many occupants find the headrest bothersome and lower the height of the headrest to its lowermost position where it provides little or no benefit.
Moreover, the adjustment mechanism must be sufficiently strong to withstand the impact from the head during a rear end collision without flexing, bending or collapsing to an extent such that the head and neck rotate too far rearward. During impact, the occupant's head typically is thrown rearwardly and rotates where it strikes the headrest in a downwardly inclined direction. In this manner, the impact force is generally rearwardly and downwardly rather than in a rearward direction only. Therefore, it is necessary to provide a headrest which will withstand the downward force of the head during impact in addition to withstanding the rearward force.
Although most automobile manufacturers provide some means for adjusting the height of the headrest, many of these adjusting mechanisms do not withstand the impact during a rear end collision. Presently, approximately two-thirds of the vehicles on the road today have head restraints that are rated very poor by the Insurance Institute for Highway Safety. Typically, almost 60% of all claims for insured accidents are a direct result of neck injuries from whiplash. Many of those injuries are caused by rear end collisions which can cause serious and lasting injuries at speeds as low as 12 miles per hour.
The data collected by the Insurance Institute for Highway Safety shows that many of the adjustment mechanisms on the head restraints do not adequately withstand the impact during a rear end collision. The head restraints often flex and pivot or rotate backwards upon impact which allows the head of the occupant to rotate rearwardly resulting in head and neck injuries. In addition, the adjustment mechanisms are shown to fail which allows the head restraint to retract or collapse to its lowermost position during impact. With the head restraint in its lowermost position, the restraint is not able to prevent the rearward neck rotation and, thus, is not able to prevent head and neck injuries.
Numerous devices have been proposed for providing suitable locking devices for vehicle headrests. An example for such a locking mechanism is disclosed in U.S. Pat. No. 3,544,162 to Uchiyamada. This device is intended to prevent the headrest from collapsing during rear end collisions, but is not adaptable to existing headrests. Accordingly, there Is a continuing need in the art for an improved vehicle headrest.


Disclosed are a light emitting device and a method of manufacturing the same. The light emitting device includes a second electrode layer, a light emitting semiconductor layer including a second conductive semiconductor layer, an active layer, and a first conductive semiconductor layer on the second electrode layer, a reflective member spaced apart from the light emitting semiconductor layer on the second electrode layer, and a first electrode layer on the first conductive semiconductor layer.

Recently, various studies and researches have been carried out regarding a device employing a light emitting diode (LED) as a light emitting device.
The LED converts an electrical signal into light by using the characteristic of a compound semiconductor. The LED has the stack structure of a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer and emits light through the active layer as power is applied thereto. The first conductive semiconductor layer may serve as an N-type semiconductor layer, and the second conductive semiconductor layer may serve as a P-type semiconductor layer, or vice versa.
Meanwhile, in such a light emitting device, the light emitted from the active layer is discharged through a lateral side as well as a top surface of the light emitting device, so that light emitting efficiency may be degraded.


To measure partial oxygen pressure in gases, particularly exhaust gases of automotive-type combustion engines, a solid electrolyte plate of elongated rectangular configuration has at least one electrode pair applied to a single surface thereof, which is exposed to the measuring gas. Preferably, the gap between electrodes is elongated, by forming the electrodes in comb-interdigited form. A thermocouple - temperature sensor can be applied between connecting tracks for the electrodes which extend longitudinally of the electrolyte plate towards the other end thereof, through a sealing mass holding the plate within a housing, the other end forming, simultaneously, a connection terminal for connection to an electric connector or plug. A heating element can be placed on the obverse side of the plate, preferably in the position in the gap between the electrodes. More than one such sensor element may be secured in the same housing, and, for example, two such plates, back to back, with the heating element therebetween, spaced from each other, or as a common block. The sensor may be used for potentiometric and/or polarographic measurement, depending upon cover coatings on the electrodes which control exposure thereof to the gases, catalytic or non-catalytic action of the electrodes (for example being of platinum or gold, respectively) and whether a voltage is applied across the electrode terminals, or the sensor is to operate as an electrochemical cell. Such sensor can be inexpensively made, are suitable for mass production, and flexible with respect to their mode of operation.

Various types of such sensors have been proposed and are described in the general and in the patent literature, and reference is made to the above-referenced patents and applications and publications. The referenced U.S. Pat. No. 4,157,282 describes a plate-like solid electrolyte body on which electrodes are applied at opposite sides, the body being exposed to the gas to be measured, and providing a voltage signals which depends on the oxygen concentration in the test gas. This type of sensor is referred to as a potentiometric sensor. The referenced U.S. Pat. No. 3,691,023 describes a sensor on which a solid electrolyte body is provided in plate form on which electrodes are applied to opposite sides thereof, and on which electrodes a voltage is applied. The electric current to the electrodes will be limited by the gas phase diffusion, and the output signal of the sensor will then depend on the oxygen content of the exhaust gas. This type of sensor, that is, a current limit sensor, is also referred to as a polarographic sensor. The patent also describes a separate heating element for the sensor which provides a suitable working temperature for the solid electrolyte body. U.S. application Ser. No. 6,093, of Jan. 24, 1979, DIETZ, also relates to a polarographic sensor with a porous coating on the sensing electrode, through which the test gas must diffuse. This sensor has a tubular solid electrolyte body with a closed end. The inner space of the tubular body has a reference gas, for example ambient air applied thereto.
The physical construction of such sensors still provides problems, particularly of sensors which are not intended for stationary installation, for example in the smoke stack of a boiler, but rather are to be used in automotive applications where they are subject to widely varying temperature fluctuations, shock and vibration.

Electrochemical sensor structure to determine oxygen content in combustion exhaust gases


A loudspeaker enclosure includes a fluid diode to control air flow into and/or out of the enclosure.

1. Field of the Invention
The present invention relates to loudspeakers, and more particularly to incorporation of a fluid diode into the air path of a speaker enclosure.
2. Background and Related Art
Loudspeakers are commonly used to reproduce recorded audio information. Efforts are ongoing to improve performance of loudspeakers' reproduction of recorded audio information.