A method and database for generating a report of findings of at least one abnormality evident in a medical image, the medical image including at least a portion of at least one structure of the body, the method includes retrieving a figure of the at least one structure. The retrieved figure is amended to reflect an abnormality. The abnormality is sized with respect to the figure of the at least one structure. The abnormality is placed at a location on the figure of the at least one structure according to an orientation of that abnormality in the medical image to generate an amended figure representative of the medical image for inclusion in the report.

In current medical practice, diagnostic radiographic imaging examinations are usually ordered by clinical healthcare providers and interpreted by radiologists. A written interpretive report is generated by a radiologist and sent to the provider to convey and document the results of the examination. The interpreting radiologist, or other individual performing this function, will generally orally dictate a description and discussion of the abnormalities on the medical images, including text descriptive of his impression of the significance of those abnormalities. A transcriptionist or, in some instances, a computer with voice recognition software, will transform the spoken words of the radiologist into text. The radiologist dictates text documents to fulfill his professional responsibility and to convey the imaging examination results to the provider.
The radiologist is tasked with the mental conversion of an image to text, the text being the only conventional means of conveying, documenting, and communicating the radiologist's interpretation of the medical images. The descriptive text format and wording created for any given radiographic imaging examination in current medical practice will vary depending on the radiologist. Due to variance of the text in free text reporting, it is difficult, if possible at all, to extract statistics suitable for analyzing outcomes from current radiology reports.
Interpreting images is a visual, right brain function in which the radiologist drafts verbal reports of abnormalities against a mental backdrop of knowledge stored in association with images, both images that are learned in training and acquired through experience. Matching the medical images with anatomic diagrams (referred to henceforth as "drawings") allows the radiologist to remain in that visual, right brain function. Verbal dictation, on the other hand, a left brain language function, is tedious, linear, and tiring. Regardless of how carefully the text is formulated, it still cannot compete with a simple picture.
There is an unmet need in the art for a graphic means of generating reports of abnormalities on radiographic imaging examinations, and other kinds of medical examinations.


A head drive mechanism associated with a disk drive device is provided for driving to rotate a magnetic disk. A magnetic head is driven and a signal is recorded on the magnetic disk or a signal already recorded on the disk is reproduced. The head is mounted on a carriage, on which a protrusion is provided, and is driven in a direction parallel to the surface of the disk with the protrusion being engaged with a lead screw when the lead screw is rotated. When the carriage abuts against a stopper located at a predetermined position, the movement of the head in the radial direction of the disk is prevented. A control system further controls rotation of the screw in the direction parallel to the surface of the disk such that the carriage is held abutting against the stopper. Since the protrusion is forced against the thread portion of the screw, the head is moved away from the disk.

The present invention relates to a head drive mechanism for magnetic disk drive device.
Electronic still video cameras are designed so that magnetic heads are used for recording or reproducing video signals onto or from video floppy disks (magnetic disks). While the magnetic disk is not rotated, it may be deformed if the magnetic head is kept abutting thereagainst for a long time. In such a case, the disk drive system is designed to retract the magnetic head from the magnetic disk.
Conventionally, an actuator or the like has been employed to retract the magnetic head from the magnetic disk.
Notwithstanding, the disadvantage pertaining to the use of such an actuator is that the disk drive tends to become not only complicated in construction and large-sized, but also costly.

Head drive mechanism using non-axial lead screw imparted motion


An example medical device for treating a body lumen is disclosed. The medical device includes an expandable scaffold positionable within a body lumen wherein the body lumen has an inner surface. The medical device also includes a support member extending circumferentially around and attached to an outer surface of the expandable scaffold. The support member is configured to be positioned between the outer surface of the expandable scaffold and the inner surface of the body lumen and at least a portion of the support member is configured to shift relative to the inner surface of the body lumen. Further, shifting the support member shifts the scaffold longitudinally from a first position within the body lumen to a second position within the body lumen with the scaffold in an expanded state to accommodate peristalsis.

Implantable medical devices (e.g., expandable stents) may be designed to provide a fluid pathway for digested material, blood, or other fluid to flow therethrough following a medical procedure. Some medical devices may include radially or self-expanding stents which may be implanted transluminally via an endoscope. Additionally, some stents may be implanted in a variety of body lumens such as the esophageal tract, the gastrointestinal tract (including the intestine, stomach and the colon), tracheobronchial tract, urinary tract, biliary tract, vascular system, etc.
In some instances, it may be desirable to design stents to radially reinforce a body lumen at a treatment site while also allowing the body lumen to maintain its functional properties. However, some stents that are designed to include sufficient radial strength to open a body lumen may also tend to migrate along the body lumen due to peristalsis (i.e., the involuntary constriction and relaxation of the muscles of the esophagus, intestine, and colon which push the contents of the canal therethrough). One method to reduce stent migration may include utilizing a support structure in combination with the stent device. For example, in some instances it may be desirable to use a support structure to position the stent within the body lumen (e.g., adjacent to a target site) whereby the support structure allows the stent a degree of maneuverability within the body lumen (e.g., whereby the support structure allows the stent to axially displace along the body lumen to accommodate peristaltic motion).
Therefore, in some instances it may be desirable to design a stent which utilizes a support structure in combination with the stent device. Examples of medical devices including a support structure are disclosed herein.

Stent including displacement capabilities


A fuel cell system 100 includes: a reformer 1 configured to generate a hydrogen-containing gas by using a raw material; a fuel cell 6 configured to generate electric power by using the hydrogen-containing gas; an ammonia remover 5 configured to remove ammonia from the hydrogen-containing gas generated in the reformer before the hydrogen-containing gas is supplied to the fuel cell; a fluid passage configured to allow the ammonia remover to be in communication with the atmosphere; an on-off valve 8 provided on the fluid passage and configured to allow and block the communication between the ammonia remover and the atmosphere; and a controller 80 configured to open the on-off valve in at least one of a water draining process and a water loading process of the ammonia remover.

Household fuel cells and fuel cells for powering automobiles and the like generate electric power by reacting a hydrogen-containing gas with, for example, oxygen in air. The hydrogen-containing gas is generated in a reformer by using methane gas, propane gas, an alcohol, or the like, as a raw material. The hydrogen-containing gas generated in the reformer contains carbon monoxide, ammonia, etc. Such impurities are known to degrade, for example, electrodes of a fuel cell.
In order to suppress the degradation of electrodes and the like, which is caused by ammonia contained in the hydrogen-containing gas, there is a proposed solid polymer fuel cell system configured to remove ammonia from the hydrogen-containing gas by an ammonia remover which removes ammonia by causing the hydrogen-containing gas and water to come into contact with each other, or by causing moisture in the hydrogen-containing gas to be condensed and dissolving ammonia into the condensation water, thereby reducing the concentration of ammonia in the hydrogen-rich gas to 5 ppm or lower. Thereafter, the solid polymer fuel cell system supplies the hydrogen-rich gas to a solid polymer fuel cell (see Patent Literature 1, for example).
Similarly, there is a proposed reformed gas supply apparatus including an ammonia remover configured to cause a reformed gas obtained in a reformer to come into contact with water, such that ammonia contained in the reformed gas is absorbed into the water, thereby removing ammonia from the reformed gas (see Patent Literature 2, for example).
Meanwhile, there is a fuel cell system in which a passage for flowing a hydrogen-containing gas generated in a reforming device is provided with a hydrogen inlet valve 21, a hydrogen outlet valve 28, and a bypass valve 30. These valves are closed while a power generation operation is stopped, and thereby communication between the passage and the atmosphere is blocked (see Patent Literature 3, for example).

Fuel cell system including an ammonia remover and method of operating the same

Panasonic Intellectual Property Management Co., Ltd.


An apparatus, method, and computer readable media for requesting and sending block acknowledgement requests (BARs) and block acknowledgments (BAs) is disclosed. A method for BARs is disclosed. The method may include transmitting data frames to two or more wireless communication devices in accordance with a multi-user multiple-input and multiple-output (MU-MIMO). The method may include transmitting block acknowledgement requests (BARs) for the transmitted data frames to the two or more wireless communication devices in accordance with MU-MIMO. The method may include receiving block acknowledges (BA) of the data frames from the two or more wireless communication devices in accordance with MU-MIMO. A method for BAs is disclosed. The method may include receiving data frames from a second wireless communication device. The method may include receiving a block acknowledgement request from the second wireless communication device The method may include sending a block acknowledgement to the second wireless communication device using MU-MIMO.

Two issues with communicating data over a wireless network are requesting acknowledgements for received data and acknowledging received data. Requesting acknowledgement of received data and acknowledging received data consumes bandwidth. Moreover, with the use of some protocols a large number of stations may be transmitting concurrently in both the spatial domain and time domain. Additionally, consumers often demand more and more bandwidth for their applications.
Thus there are general needs for systems, apparatus, and methods that reduce signaling, bandwidth and delay associated with communicating requests for acknowledgements and communicating acknowledgments.

Wireless device, method, and computer readable media for requesting and sending block acknowledgement


A linear shaft motor (1) has a slider (10) and a tubular magnetic shaft (30). The slider (10) includes an oblong cuboid shaped motor housing (101) having a rectangular cross-section with a longitudinal central bore (180). The motor housing (101) includes at least two longitudinal cooling holes (161, 162, 163, 164, 165, 166, 167, 168) which are part of an integrated fluid cooling circuit. The at least two longitudinal cooling holes (161-168) are distributed symmetrically at a left and at a right side of the central bore (180), whereas the central axis (15) of any of the longitudinal cooling holes (161-168) lays below the topmost portion (20) of the central bore (180) and above the lowermost portion (25) of the central bore (180).

Linear motors (LM) are used with machine tools since many years, in particular with milling machines, where the high acceleration and high speed achieved, and the fact that no maintenance is needed, are a great plus for the process compared with conventional systems in which rotatory motion is converted in a linear motion by means of a ball screw. LM's have also been proposed for use with Electric Discharge Machines (EDM) since more than 30 years (cp. JP63002626A). Electric discharge machines by Sodick are equipped with linear motor drive systems since 1999, only a few years after the introduction with milling machines.
A major issue of flat linear motors and one of the reasons why they have not replaced conventional systems is the strong magnetic attraction force between the iron core of primary part and permanent magnets (secondary), which has to be absorbed by adequate design of the machine structure. This force can be neutralized by a symmetric constitution of the motor itself, as with the U-channel type linear motor, or by symmetric collocation of motors within the machine.
More recently another well-known type of linear motor has been introduced as actuator for machine tools: the linear shaft motor (hereinafter referred to as LSM). Compared with other types of linear motors, LSM have a number of advantages which make them a very attractive solution for the axis actuation in certain machines. In particular the symmetric constitution leads intrinsically to balanced forces. The structural components of the machine are thus loaded essentially in the desired axial direction (thrust direction), like traditional ball screw transmissions, and structural components do not need to be as stiff as for flat LM's.
The shaft consists mainly in a row of permanent magnets producing a strong magnetic field. With the cylindrical constitution of the shaft, the entire cylindrical surface area of magnets can be used to produce thrust. A possible design of the shaft is shown in U.S. Pat. No. 6,040,642 assigned to GMC Co. Ltd. Ironless LSM provide very smooth velocity and position control, and are very energy efficient.
The LSM is preassembled, so that the mounting on the machine is comparably easy. Also, the compact symmetric constitution of the linear shaft motor is beneficial to its integration with machine tools; the motor is mounted in close relation to the respective machine component achieving excellent stiffness in force transmission. However, since the LSM is such directly linked to the respective machine component, at the core of the machine structure, the heat produced in the motor forcer must be evacuated as good as possible to avoid elongation and deformation of the machine structure and consequently a loss of accuracy.
The heating power due to ohmic losses in the copper windings is proportional to I2×R. In normal operation, the heat generated continuously by each LSM in the range considered herein is in the order of several hundred watts. It is to be noted that normal operation is a quasi-permanent condition. Generally a CNC machine tool comprises at least three axis motors, whereas a wire electric discharge machine comprises typically two horizontal axis pairs, and a fifth vertical axis which employs rotary actuation. It goes without saying that the heat immission at the core of the machine structure has to be avoided or at least limited. With the ever more challenging accuracy requirements of machine tools, the heat immission must be intercepted at the source.
Patent document WO2010049969 assigned to Mitsubishi refers to a linear shaft motor equipped with a liquid cooling system comprising a cooling plate (motor coil holder 14) between the motor case and the machine body and two lateral cooling plates. However this cooling concept does not effectively protect the machine body, since a heat transfer to the attachment surface is not avoided. Also the insertion of such plates around and especially above the motor body increases the size of the slider, and the required volume within the machine tool.
In 2012 company Mitsubishi has launched a new series of WEDM (MV-series) using linear shaft motors. Here the problem of heat evacuation has been solved essentially by collocating some cooling plates around the LSM. Of course the height of the LSM with the cooling plates increases significantly.
Patent document U.S. Pat. No. 6,323,567 assigned to Nikon relates to a circulating system for cooling the coil array of shaft-type linear motor, by which the outside surface of the motor is maintained at a set temperature during operation. The coil housing is used to support the coil assembly and provide a fluid passageway to cool the coil assembly. The fluid passageways are distributed around the coils. The coil housing comprises an end section at each end, with fluid inlets/outlets on top of these end sections. The overall size of the shaft-type linear motor by Nikon increases substantially to fit the cooling circuit in the coil housing.
Patent document WO2016025975 assigned to Anca refers to a linear motor, including a mover having a cylindrical body with the coils inside said cylindrical body. The slider has a flange at one end by which the linear motor is securely and easily fixed in the respective machine component. A substantially coolant space is formed between the cylindrical body and the mover housing. Such design requires a considerable space between the moving parts.
Above mentioned cooling circuits are effective, however there is an important limitation, that the cross section of the motor is increased substantially in all directions. In fact the cooling circuits most generally consist in a jacket which is put around the heat source. The size of the motor increases, which in certain cases represents an unacceptable machine design limitation.
The utility model TWM505992U assigned to Excetek displayed in FIG. 1 discloses a WEDM using linear shaft motors. Here the main topic is the implementation of the good rules of mechanical engineering. Here the slider of the LSM is fixedly mounted on a structural component of the machine via its top surface. One thing that is visible here is, that the height of the slider is relevant for its integration between machine parts.
Thus, there is a need for an optimized LSM for high accuracy applications, having smaller size, and particularly a smaller height but an excellent performance and efficient cooling. To take full advantage of the strengths of a LSM in view of best accuracy of the machine tool in which the LSM is used, it is necessary to provide an integrally optimized design.


A process is disclosed for improving the quality of an ammonium diuranate (ADU) precipitate. Ammonium hydroxide is added to a solution of uranyl fluoride in the presence of a polymer such as polyacrylic acid, polyacrylonitrile, or polyacrylamide. The presence of the polymer reduces the particle size of the precipitate and increases its settling rate. A reduced particle size provides an ADU powder which is suitable for nuclear fuel fabrication and an increased settling rate enhances the dewatering operation of the ADU slurry.

In the manufacture of fuel pellets for use in nuclear reactor fuel rods, ammonium diuranate (ADU) is precipitated from a solution of uranyl fluoride by the addition of ammonium hydroxide. The precipitated ADU is then filtered, dried, calcined, and pressed into the pellets.
The filtration of the ADU is facilitated by a rapid settling rate, so that large quantities of slurry can be quickly processed. The calcination and pellet-sintering are facilitated by a precipitate of a small particle size because the greater surface area increases the reaction rate. Unfortunately, a rapid settling rate and a small particle size are generally opposing properties because small particles do not settle rapidly.


A novel process for recovering water insoluble compounds from a fermentation broth includes sequential steps of concentrating, solubilizing and diafiltering the compound of interest, all through a single closed recirculation system to recover the compound for further downstream purification.

Various processes have been used in the past to isolate valuable water insoluble commercial compounds from fermentation broths. Traditional technologies for isolating such compounds employ solid-liquid separations (e.g. filtration, centrifugation, etc.) to isolate the water-insoluble active ingredients and subsequent solid-liquid extractions to recover the activities. For example, the U.S. Pat. Nos. 4,117,118 and 4,215,199 to H arri describe processes for isolating cyclosporins A and B from fermentation broths involving the steps of centrifugation, homogenization, and multiple extractions (using methanol, ethylene chloride, and other water-immiscible organic solvents) with corresponding evaporations (i.e. concentrations). Thereafter, the final extracts are subjected to chromatographic purifications using silica gel and SEPHADEX.RTM. LH20 packings. Similar procedures are employed for isolating other types of water insoluble compounds such as lovastatin (an antihypercholesterolemic) and tacrolimus (FK-506, an immunosuppressant). Although these methodologies are currently used for industrial scale fermentations, they typically require expensive solid-liquid separators and solvent extractors/evaporators/condensers having high energy requirements. In addition, the product recovery yields from such processes are low due to multi-stage operations. Thus, capital investment and subsequent production costs are high.
As another example, the patent to Rudat (U.S. Pat. No. 5,256,547) describes a process for the production and isolation of cyclosporin A which involves mixing the culture with a filter aid such as recrystallized gypsum or calcite meal to form a suspension and filtering the mixture to obtain a moist biomass. The biomass is then dried and extracted two or three times with a lower carboxylic acid ester, or alternatively with a supercritical gas such as carbon dioxide. The extract is then defatted and chromatographed by preparative HPLC using silica gel or alumina oxide. This method offers limited advantages over those disclosed in earlier patents because it still suffers from multiple, complicated, and expensive operations.
Although the use of either microfiltration (M F) or ultrafiltration (UF) to clarify/filter aqueous fermentation broths has been established in the literature, extractions with organic solvents are usually performed as a secondary purification step to recover the active product. As noted above, the conventional purification procedures involve two distinct unit operations, namely, separation and extraction/evaporation. Generally for water insoluble products, the compound is first isolated from the large volume of aqueous fermentation broth and then purified by repeatedly extracting the compound with solvent and evaporating the solvent, so that the compound can be further extracted with a different solvent and evaporated until a concentration is achieved from which ultimate purification can take place. The repeated extractions and evaporations however, render the process very costly for large scale manufacture.
A unique feature of the present invention is in having a continuous processing system that obviates the need for separate extraction and evaporation steps after the initial centrifugation and/or filtration step. This technology offers many advantages over the prior art processes, including simplicity of design, reduced capital and manufacturing costs, and increased recovery yield. Furthermore, unlike the traditional processes, the entire process of the present invention is both automatable and fully contained which reduces both personnel and environmental exposure to the compound. This is an important consideration in that immunosuppressants and other potent therapeutic compounds may be highly toxic.

Process for recovering water insoluble compounds from a fermentation broth


This invention provides an image-forming machine with a user detection system. The image-forming machine has image-forming equipment and at least one sensor. The image-forming equipment may include a photoconductor, one or more chargers, an exposure machine, a toning station, a fusing station, related equipment, and accessories. The image-forming machine may also include a sensor interface and a communication link. The sensor is monitored to detect when a user is near the image-forming machine. An output signal from the sensor indicates a user presence near the image-forming machine. A warm-up procedure is started in response to the output signal of the sensor.

This invention generally relates to image-forming machines having standby operating modes. More particularly, this invention relates to image-forming machines having user detection systems for starting a warm-up procedure from a standby mode.
Image-forming machines are used to transfer images onto paper or other medium. Generally, a photoconductor is selectively charged and optically exposed to form an electrostatic latent image on the surface. Toner is deposited onto the photoconductor surface. The toner is charged, thus adhering to the photoconductor surface in areas corresponding to the electrostatic latent image. The toner image is transferred to the paper or other medium. In a fusing station, the paper is heated for the toner to adhere to the paper. The photoconductor is then refreshed or cleaned to remove any residual toner and charged to make it ready for another image.
At start-up and at reactivation from a standby mode, most image-forming machines have a warm-up period to bring various systems and components into a ready-mode for producing images. Many systems and components are ready in a matter of seconds. However, some systems and components may take several minutes to become ready. In many image-forming machines, the warm-up period does not start until the power button is turned-on or the start sequence is activated to begin the image forming process. By that time, a user may have completed one or more preparation steps to begin the image-forming process. The original images may have been placed in an exposure machine. Paper may have been loaded. The image-forming requirements (pages, contrast, etc.) may have been entered. Additional or other preparation steps may have been done. Then, the user usually needs to wait or return to the machine when the warm-up period is finished.
To avoid delays from the warm-up period, the image-forming machine may be maintained in a ready-mode. Under such conditions, the image-forming machine is ready to use whenever desired. However, this approach increases power consumption and maintenance of the image-forming machine. Some systems and components may prematurely wear-out if kept active during extended periods when the image-forming machine is not used.
The fuser station or system typically has two high-temperature heater rollers in contact with a rubber-coated fuser roller. Heater lamps heat the heater rollers. The heater rollers and the fuser roller are in constant rotation whenever the heater lamps are operating. During this rotation, heat transfers from the surface of the heater rollers to the surface of the fuser roller. The heated fuser roller is used to fuse the toned image onto the paper or other medium. If the image-forming machine has an extended period or periods of inactivity, the rotation of the heater and fuser rollers may prematurely wear out various electromechanical devices within the fuser. Other systems and components may be similarly affected by an extended period or periods of inactivity by the image-forming machine.
Accordingly, there is a need to start the warm-up period of an image-forming machine when a user is detected physically near the image-forming machine.
The invention provides a user detection system for an image-forming machine. The user detection system has at least one sensor to provide an output signal, which is indicative of a user being near the image-forming machine. The image-forming machine starts a warm-up procedure in response to the output signal. The warm-up procedure may start all or part of the systems and components in the image-forming machine. The warm-up procedure also may initially start some of the systems and components, such as the fusing station, and subsequently start the remainder of the image-forming machine.
The image-forming machine may have image forming equipment, which may include a photoconductor, one or more chargers, an exposure machine, a toning station, and a fusing station. The chargers, exposure machine, toning station, and fusing station are positioned adjacent to the photoconductor. The charger electrostatically charges the photoconductor. The exposure machine optically exposes and forms an electrostatic image on the photoconductor. The toning station applies toner on the photoconductor. The toner has a charge to adhere to the electrostatic image. The fusing station heats paper or other medium for the image to adhere to the paper or other medium.
The image-forming machine may have one or more sensors, a sensor interface, and a communication link. The sensors are operatively disposed in one or more sensor operating locations. The sensors are operatively connected via a communication link to a sensor interface. The sensor or sensors provide an output signal to the sensor interface. The output signal is indicative of a user presence near the image-forming machine.
In a method for detecting a user at an image-forming machine having a user detection system, one or more sensors are monitored. The sensors are disposed in one or more sensor operating locations. The activation of the sensors is detected. The activation is indicative of a user presence near the image-forming machine. A warm-up procedure is started for the image-forming machine in response to the activation of the one or more sensors.
Other systems, methods, features, and advantages of the invention will be or will become apparent to one skilled in the art upon examination of the following figures and detailed description. All such additional systems, methods, features, and advantages are intended to be included within this description, within the scope of the invention, and protected by the accompanying claims.

User detection system for an image-forming machine


This invention is a natural lotion that exploits the benefits of Dead Sea salt for helping with the dry skin of a human body, especially on the arms, legs, hands and face. The lotion adds to a base of organic aloe vera juice, organic coconut oil, shea butter, sunflower oil, olive oil, NF emulsified wax (vegetable based), rose hydrosol, and apple cider vinegar. It also includes green tea extract and several pure essential oils like geranium, bergamot, sweet orange and patchouli.

The skin for the human body secretes slightly acidic natural oil called sebum to protect it from becoming too dry. Dry skin is a condition, not a disease, and can be caused by using harsh soaps, itchy clothing, unsuitable body moisturizers, hot and cold weather, hard water and diet. Also medications for such medical conditions as diabetes, psoriasis, hypothyroidism, and malnutrition may cause severe dry skin. See generally, http://www.webmd.boots.com/healthy-skin/guide/causes-dry-skin.
Some signs of dry skin on the human body include itching, flaking, skin redness and cracks, skin tightness after shower. See, http://www.mayoclinic.org/diseases-conditions/dry-skin/basics/symptoms/con-20030009.
The lotion of this invention is especially noted for use with the skin of a human body, particularly the skin on one's arms, legs, hands and face.

This patent is subject to a terminal disclaimer.


A process for fabricating a resin-encapsulated semiconductor device comprises the steps of: (a) forming a plurality of first through holes for external connection in a substrate for mounting semiconductor chips; (b) forming a conductive film on a chip-mounting surface of the substrate and patterning the conductive film into a plurality of patterned wirings and a plurality of lands which cover the entire openings of the first through holes and partially constitute the patterned wirings; (c) mounting two or more semiconductor chips on the chip-mounting surface of the substrate; (d) mounting external connection terminals at the first through holes from a terminal-mounting surface opposite to the chip-mounting surface and connecting the semiconductor chips to the external terminals through the lands; (e) encapsulating the two or more semiconductor chips in one-piece with a resin encapsulant; (f) cutting the substrate with a first cutting blade from the terminal-mounting surface of the substrate; (g) cutting the resin encapsulant with a second cutting blade thinner than the first cutting blade; and (h) dividing the resulting substrate for the individual semiconductor chips.

This application is related to Japanese application No. HEI11-216109 filed on Jul. 30, 1999, whose priority is claimed under 35 USC xc2xa7119, the disclosure of which is incorporated by reference in its entirety.
1. Field of the Invention
The present invention relates to a resin-encapsulated semiconductor device and a process for fabricating the same. More particularly, it relates to a resin-encapsulated semiconductor device of a ball grid array (BGA) type which is called a chip size package (CSP), and a process for fabricating the same.
2. Related Art
Conventionally, resin-encapsulated semiconductor devices of the BGA type called CSP as shown in FIG. 9(c) have been widely utilized.
The resin-encapsulated semiconductor device comprises a wiring substrate 25 for mounting a semiconductor chip which includes thereon a patterned wiring 26, a plurality of first through holes 31 for external connection and a plurality of lands 27 for external connection which cover the entire openings of the first through holes 31 and partially constitute the patterned wiring 26, and a semiconductor chip 21 mounted thereon. The semiconductor chip 21 is electrically connected to the patterned wiring 26 through wire bonding using an Au wire 23. The semiconductor chip 21 and the Au wire 23 are encapsulated with a resin 22 for encapsulation. Further, external terminals 24 for external connection are mounted on a surface opposite to a chip-mounting surface of the wiring substrate 25 and electrically connected to the semiconductor chip 21 via the lands 27.
The resin-encapsulated semiconductor device is fabricated by the following process.
First, the first through holes 31 for mounting the external terminals are formed in an area array matrix of the wiring substrate 25.
On a surface of the wiring substrate 25 where the semiconductor chips 21 are to be mounted, the patterned wiring 26 and the lands 27 for external connection are formed of a conductive film, and marks 30 representative of cutting lines are formed of the conductive film in the periphery of the wiring substrate 25. The lands 27 partially serve as the patterned wiring 26 and cover the respective first through holes 31.
Then, the semiconductor chips 21 are mounted on the wiring substrate 25 and electrically connected to the patterned wiring 26 formed on the wiring substrate 25 through wire bonding using Au wires 23.
The semiconductor chips 21 arranged on the wiring substrate 25 and the Au wires 23 are all encapsulated in one-piece with the resin 22 by a transfer mold technique.
Then, the encapsulated semiconductor chips 21 are divided into individual chips. At this time, as shown in FIG. 9(a), a surface of the wiring substrate 25 where the external terminals are to be mounted is adhered to a jig 33 for fixing the wiring substrate. The chip-mounting surface of the wiring substrate 25 is faced upward so that the marks 30 of cutting lines can be observed from the chip-mounting surface side of the wiring substrate 25. The cutting line is defined by joining a pair of marks 30 formed on the opposite sides of the periphery of the wiring substrate 25. The resin 22 and the underlying wiring substrate 25 are cut and divided with a single cutting blade 29 along the cutting line in one operation as shown in FIG. 9(b).
Thereafter, as shown in FIG. 9(c), the external terminals 24 are mounted at the first through holes 31 from the external terminal mounting surface and subjected to a reflow process to metallically bond the external terminals 24 and the patterned wiring 26 or the lands 27. Thus, an end product is obtained.
In the above-described fabrication process, the semiconductor chips 21 encapsulated with the resin 22 on the wiring substrate 25 are divided into individual chips 21 by cutting. That is, the wiring substrate 25 and the resin 22 formed of different materials are cut in one operation with one cutting blade 29. Therefore, the cutting blade 29 is extremely worn out.
Further, since cut faces of the resin 22 and the wiring substrate 25 are in the same plane, the resin encapsulant 22 and the wiring substrate 25 may be separated from each other at an interface therebetween.
The present invention provides with a process for fabricating a resin-encapsulated semiconductor device comprising the steps of: (a) forming a plurality of first through holes for external connection in a substrate for mounting semiconductor chips; (b) forming a conductive film on a chip-mounting surface of the substrate and patterning the conductive film into a plurality of patterned wirings and a plurality of lands which cover the entire openings of the first through holes and partially constitute the patterned wirings; (c) mounting two or more semiconductor chips on the chip-mounting surface of the substrate; (d) mounting external connection terminals at the first through holes from a terminal-mounting surface opposite to the chip-mounting surface and connecting the semiconductor chips to the external terminals through the lands; (e) encapsulating the two or more semiconductor chips in one-piece with a resin encapsulant; (f) cutting the substrate with a first cutting blade from the terminal-mounting surface of the substrate; (g) cutting the resin encapsulant with a second cutting blade thinner than the first cutting blade; and (h) dividing the resulting substrate for the individual semiconductor chips.
Further, the present invention provides with a resin-encapsulated semiconductor device comprising; a substrate for mounting a semiconductor chip including thereon a patterned wiring, a plurality of first through holes for external connection and a plurality of lands which cover the entire openings of the first through holes and partially constitute the patterned wiring, a semiconductor chip mounted on the substrate, the semiconductor chip being encapsulated with a resin, and terminals for external connection being mounted on a surface opposite to a chip-mounting surface of the substrate and electrically connected to the semiconductor chip through the lands, wherein an edge of the substrate is positioned inside an edge of the resin for encapsulation.
These and other objects of the present application will become more readily apparent from the detailed description given hereinafter. However, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the invention, are given by way of illustration only, since various changes and modifications within the spirit and scope of the invention will become apparent to those skilled in the art from this detailed description.

Resin-encapsulated semiconductor device including resin extending beyond edge of substrate


The present invention relates to a method for foxing a step on a deposition surface of a substrate for depositing a thin film on it. According to the method, the step is formed by etching a portion of the deposition surface of the substrate by emitting a laser beam to the portion.

1. Field of the Invention
The present invention relates to a method for forming a step on a deposition surface of a substrate for a superconducting device utilizing an oxide superconductor, and more specifically a to method for forming a step on a deposition surface of a substrate for a superconducting device such as a step edge type Josephson junction device of an oxide superconductor.
2. Description of Related Art
A Josephson junction device which is one of the most famous superconducting devices can be realized in various structures, for example, a stacked type (tunnel type) junction realized by a thin non-superconductor layer sandwiched between a pair of superconductors, a point contact type junction, a micro bridge type junction and a variable thickness bridge type junction which are composed of a pair of superconductor regions which are weakly linked to each other.
These Josephson junctions have fine structures so that fine processings are required to realize Josephson junction devices.
In order to realize a stacked type junction by using an oxide superconductor, a first oxide superconductor thin film, a non-superconductor thin film and a second oxide superconductor thin film are stacked on a substrate in the named order.
The thickness of the non-superconductor layer of the stacked type junction is determined by the coherence length of the superconductor. In general, the thickness of the non-superconductor layer of the stacked type junction must be within a few times of the coherence length of the superconductor. Since oxide superconductor materials have a very short coherence length, therefore, a thickness of a non-superconductor layer must be about a few nanometers.
However, the superconductor layers and the non-superconductor layer of the stacked type junction must be of high crystallinity for favorable junction properties, which are composed of single crystals or composed of polycrystals which are orientated in an almost same direction. It is difficult to stack an extremely thin and high crystalline non-superconductor layer on an oxide superconductor layer. Additionally, it is very difficult to stack a high crystalline oxide superconductor layer on the non-superconductor layer stacked on an oxide superconductor layer. Though the stacked structure including a first oxide superconductor layer, a non-superconductor layer and a second oxide superconductor layer is realized, the interfaces between the oxide superconductor layers and the non-superconductor layer are not in good condition so that the stacked type junction does not function in good order.
In order to manufacture a point contact type junction, a micro bridge type junction and a variable thickness bridge type junction by using oxide superconductor, very fine processings which realize a weak link of a pair of the superconductors are necessary. It is very difficult to conduct a fine processing with good repeatability.
The point contact type junction has been formed of two oxide superconductor thin films which are in contact with each other in a extremely small area which constitutes the weak link of the Josephson junction.
The micro bridge type junction has been formed of a constant thickness oxide superconductor thin film which is formed on a substrate and which is patterned in a plan view, so that a superconductor thin film region having a greatly narrow width is formed between a pair of superconductor thin film regions having a sufficient width. In other words, the pair of superconductor thin film regions having a sufficient width are coupled to each other by the superconductor thin film region having the greatly narrow width. Namely, a weak link of the Josephson junction in the superconductor thin film is formed at the greatly narrow width region.
On the other hand, the variable thickness bridge type junction has been foraged of an oxide superconductor thin film of a sufficient thickness which is formed on a substrate and which is partially etched or thinned in a thickness direction, so that a thinned oxide superconductor thin film portion is formed between a pair of superconductor thin film portions having the sufficient thickness. In other words, the pair of superconductor thin film portions having the sufficient thickness are coupled to each other by the thinned oxide superconductor thin film portion. Accordingly, a weak link of the Josephson junction is formed at the reduced thickness portion of the oxide superconductor thin film.
As would be understood from the above, characteristics of the Josephson junction device are a close relation to the contact area of the superconductor thin film in the point contact type Josephson device, the width of the superconductor thin film region having the extremely narrow width in the micro bridge type Josephson device, and the thickness of the thinned oxide superconductor thin film portion in the variable thickness bridge type Josephson device, both of which form the weak link of the Josephson junction. Therefore, in order to obtain the desired characteristics with a good repeatability, a high precision on a sub-micron level of the processing such as the etching is required.
The micro bridge type Josephson device can be said to be more preferable than the variable thickness bridge type Josephson device, since the micro bridge type Josephson device has a relatively planer surface, which is preferred in a integrated circuit. However, in order to form the weak link in the micro bridge type Josephson device, it is required to pattern an oxide superconductor thin film having the thickness on the order of 0.5 .mu.m to 1.0 .mu.m into a width of not greater than 0.2 .mu.m. However, it is very difficult to conduct this fine patterning with good repeatability.
On the other hand, in the variable thickness bridge type Josephson device, the very fine pattering is not required in order to form the weak link. However, it is very difficult to uniformly control the remaining thickness of the thinned portion forming the weak link. In addition, the variable thickness bridge type Josephson device cannot have a planer surface by nature. This is not preferable to the integrated circuit application.
In order to resolve the above mentioned problems, researches have been conducted to manufacture a Josephson junction device taking account of the characteristic advantages intrinsic to the oxide superconductor, which permits it to avoid the fine processing of the oxide superconductor.
The superconducting characteristics of the oxide superconductor considerably varys, depending on the crystalline direction. Particularly, the oxide superconductor has a large critical current density in the direction perpendicular to the c-axes of its crystals. Thus, if oxide superconductors having crystalline directions different from each other are joined together, a grain boundary at the interface becomes a barrier of the weak link so that a Josephson junction is formed. A Josephson junction device utilizing this Josephson junction is called an artificial grain boundary type Josephson junction device. A Josephson junction device of this type can be manufactured without the fine processing as mentioned above.
There is shown a sectional view of an example of the artificial grain boundary type Josephson junction device. The artificial grain boundary type Josephson junction device shown in FIG. 1 mainly consists of an oxide superconductor thin film 1 deposited on a deposition surface of an insulator substrate 2 having a step 23. A portion 13 of the oxide superconductor thin film I on the step 23 has a crystal orientation different from those of portions 11 and 12 of the oxide superconductor thin film 1 on deposition surfaces 21 and 22. By this, grain boundaries 51 and 52 are formed between the portions 11 and 13 and between the portions 12 and 13, which constitute a weak link of a Josephson junction.
The preferable height of the step 23 is considered to range from 100 to 500 nanometers and is determined by a thickness of the oxide superconductor thin film.
In order to manufacture the above Josephson junction device, in a prior art, the step of the substrate is generally formed by an ion milling using Ar ions. However, the deposition surface of the substrate is often degraded in its crystallinity by the ion milling process so that an oxide superconductor thin film having high quality can not be deposited on it. In addition, the ion milling is conducted under high vacuum, which requires a lot of time for evacuating, so that the deposition surface of the substrate can not be efficiently processed.
Furthermore, a niobium mask is sometimes used in the above processing of the deposition surface of the substrate, in order to form a steep step. Photoresist which is generally used for a mask of an etching process is rather soft so fix at an edge of a photoresist film gently rises. In case that the deposition surface of the substrate is etched by the ion milling with using a photoresist mask, a step gently rising is formed on the deposition surface. If an oxide superconductor thin film is deposited on the deposition surface having the step gently rising, no grain boundary might be formed in the oxide superconductor thin film. Since niobium is far harder than the photoresist, an edge of a niobium film abruptly rises. By using a niobium film as a mask, a steep step can formed on a deposition surface of a substrate. However, niobium may be remain on the deposition surface of the substrate even after the niobium film is removed. The remaining niobium has an adverse effect on an oxide superconductor thin film deposited on the deposition surface of the substrate.

Method for forming a step on a deposition surface of a substrate for a superconducting device utilizing an oxide superconductor


A dental implant for supporting periodontal tissue and the supporting bone is provided. The dental implant includes an implant member for insertion into a periodontal bone socket, and an anchoring assembly. The anchoring assembly includes a fastening element and radially equidistant cylindrical members. The fastening element engages the implant member within the hollow axial cavity. The root section includes through-holes for radially and forcibly sliding the cylindrical members through them. When the fastening element apically advances within the hollow axial cavity, the cylindrical members generate an anchoring force to anchor the dental implant.

Dental implant therapy offers a method for restoring non-restorable teeth and endentulous dental sites in patients. Most dental implant systems hitherto require surgeries to drill precise pre-designed implant space such that an identically shaped prefabricated dental implant can be inserted into the implant space. Surgically preparing the implant space requires extensive diagnostic planning, invasive surgery, and an extended healing time. If the planned implant sites are close to the sinus or the nerve canal, the placement of the dental implant is unsuitable, and extensive bone graft surgery is generally required to build a suitable implant site before the dental implant can be inserted. Moreover, the invasive surgery may damage the periodontal tissue and supporting bone, and may occasionally result in the potential loss of stability and retention of the dental implant.
Hence, there is a long felt but unresolved need for a method and system for fabricating and installing a dental implant that allows preservation of the supporting periodontal tissue and the supporting bone while maximizing retention and stability of the dental implant.

Fabrication and installation of a dental implant


A measuring device (10) and a measurement method measure a concentration of gaseous/aerosol components of a gas mixture. A reaction carrier (14) has a flow channel (42) defining a reaction chamber (46) having a optically detectable reaction material (48), that reacts with a gas mixture component or with a reaction product. The measuring device (12) includes a gas-conveying assembly (2) with a gas-conveying apparatus (28) conveying the gas mixture and a detection assembly (3), which has a lighting apparatus (37) for lighting the reaction chamber (46), an optical sensor (38) for sensing the optically detectable reaction, and an evaluating unit (4) evaluating sensor data and determining a concentration of the component of the gas mixture. The detection assembly (3) senses a speed of a reaction front (6) propagating in the flow direction in the reaction chamber (46) and determines a preliminary concentration from the speed of the reaction front (6).

Gas detector tubes, which are filled with a reactant, which reacts with a chemical compound to be determined in an optically detectable reaction, are known from the state of the art. For example, a defined quantity of a gas mixture is pumped with a hand pump through the gas detector tube. A concentration of the chemical compound to be measured is subsequently determined by means of a discoloration of the reactant.
Moreover, so-called chip-based measuring systems are known, in which the reactant is provided in a plurality of reaction chambers, which are arranged on a reaction carrier and can be used for a measurement each. The reaction carrier can be inserted into a measuring device, which detects the reaction carrier and carries out a corresponding measuring method for measuring a concentration of the corresponding component of the gas mixture.
The measuring time with such a measuring system may be rather long, for example, several minutes, depending on the type of the chemical compound to be measured and the concentration range to be measured.


An animal body parts phantom comprised of a substrate sheet which is shaped in the form of an animal body part e.g. a thyroid, including a radioactive material substantially uniformly deposited on the substrate, and a tissue simulating material encapsulating and supporting the substrate. A container may be included to provide a mold for the tissue simulating material and to protect the phantom. An additional fat simulating overlay may also be provided to extend the capability of the device.

1. Field of the Invention
The present invention relates to animal body parts calibration phantoms, and in particular to a thyroid calibration phantom for calibration of radiation detection equipment used to measure the uptake of radioactive tracer by the thyroid gland.
2. Description of the Prior Art
Conventional thyroid phantoms employ liquid solutions or dispersions of radio-iodine as the tracer material. Radio-iodine is an extremely toxic material. Accordingly, spills or leaks of such material are hazardous to the health of laboratory personnel.
One such thyroid phantom is manufactured and sold by Radiology Support Devices Inc. of Long Beach, Calif. This device comprises a hollow-shell synthetic resin material in the three-dimensional characteristic butterfly-shape of the thyroid. Posterior ports are provided for filling the device with a liquid solution/dispersion of radio-iodine or the like. A further drawback of this device is that it cannot be completely filled with the liquid. As a result an air bubble is formed which affects the accuracy of the device. Moreover, the device is made to fit snugly into a companion neck phantom which has no capacity to accept other sizes of thyroid phantoms or fat overlay. This presents a problem in calibrating for patients with other than average sized thyroids or heavy patients who have more than the average amount of fat tissue covering their thyroid gland.

Her Majesty in Right of Canada as represented by the Minister of Health and Welfare Canada


Systems and methods for a cloud computing engineering application that can provide new interaction, visualization and interaction techniques along with advertising messaging and business social networking are disclosed.

Computer models of complex systems enable improved system design, development, and implementation through simulation. That is, system models can be created on computers and simulated to assist in the determination of system design parameters. All manner of systems can be modeled, designed and simulated this way, including machinery, factories, electrical power and distribution systems, processing plants, devices, chemical processes, biological systems, and the like. Such design and simulation techniques have resulted in reduced development costs and superior operation.
With many analytical tools, the manner in which data and results are requested from and communicated to the user is often as important as the choice of the analytical tool itself. However, existing systems have not developed new user interface techniques to address the needs of cloud computing engineering solutions and services.
That is, existing technologies are based on decade's old PC or desktop centric user interface paradigms. In fact, current methods have created complexity and a poverty of attention for engineers, researchers and students, and rely on user guides and formal training to overcome the significant learning curves they impose.
Without new techniques in user interfaces, engineering design and simulation systems will struggle to realize the full potential of cloud computing and its ability to democratize how we approach scientific discovery in power and energy engineering.
Greater efforts at creating user interfaces that better organize, visualize and expose data within the context of the internet and cloud computing would provide a much friendlier, exciting and modern environment that can improve design accuracy, minimize complexity, and enable a broader class of users to participate in the discovery of novel solutions to address climate change, and the integration of renewable energy sources.
Computer Aided Design (CAD), Product Lifecycle Management (PLM), and related engineering systems currently deliver collaborative features that have increased the effectiveness of physically dispersed engineering teams. However, none have created collaboration techniques to effect advertising messaging.
Current web messaging methods rely on highly targeted "push" advertisements. Such random communication does not reveal intention very well and the value of this form of advertising is low. The challenge for existing advertising techniques is that users are less tolerant to advertising as they see it to be an intrusion. In fact, as a web site or Internet service becomes more attractive to advertisers, it becomes less appealing to members who see highly targeted ads as invading privacy.
Current business oriented social networking platforms have enhanced the ability for professionals to build their identity, connect with peers, and discover opportunities. None, however, provide a means to effectively validate the technical capabilities and skills members claim.
With existing techniques, engineers can establish a profile claiming to have specific skills and also provide links to past projects or post a static gallery of previous projects as evidence of proficiency or experience. Some methods also use peer recommendations and endorsements to help address the challenge in validating skill claims. While these methods are an improvement, they are still essentially word of mouth techniques that do not solve a technical recruiter's need to measure and validate claimed technical skills. The need for engineers to connect with and manage career opportunities, and collaborate on engineering design projects will become even more essential with the many electrical projects of the energy optimized world.


A process and apparatus for Al.sub.2 O.sub.3 CVD on silicon wafers using aluminum tri-isopropoxide in a high-volume production environment is presented. The conditions required to use ATI in a production environment and provide maximum utilization of ATI are first of all delivery of ATI via direct evaporation. The ATI source bottle is pumped out (bypassing substrates) until propene and isopropanol signals are reduced to 1% of process pressure before start of aluminum oxide deposition. Either IR spectroscopy or mass spectrometry can be used to provide a control signal to the microprocessor controller. Heating the supplied tetramer to 120.degree. C. for two hours assures complete conversion to trimer. The ATI is stored at 90.degree. C. to minimize decomposition during idle periods and allow recovery of trimer upon return to 120.degree. C. for two hours. During periods of demand, the ATI is held at 120.degree. C. to minimize decomposition.

The utility of CVD Al.sub.2 O.sub.3 as a reactive ion etch (RIE) stop layer (during tungsten contact stud patterning) has been clearly demonstrated. For this application, a dense aluminum oxide film is defined as having the following characteristics:
Index of refraction: 1.59-1.62, at 632.8 wavelength PA1 Etch rate (3.6% phosphoric acid at 75.degree. C.): <25 nm/min PA1 Hydroxyl content (OH, by infrared (IR) spectroscopy, absorbance per micron of film thickness at 3500 cm.sup.-1): <0.005 PA1 Shrinkage of film thickness upon annealing (30 min. at 500.degree. C.): <1.5%
The literature indicates that aluminum tri-isopropoxide (Al(OC.sub.3 H.sub.7)), known in the art as ATI, is a viable sub-500.degree. C. Al.sub.2 O.sub.3 precursor. See, for example, J. A. Aboaf, J. Electrochem. Soc., 114, 948 (1967), J. Fournier et at., Mat. Res. Bull., 23, 31 (1988), J. Kwon, J. Saraie and Y. Yodogawa, J. Electrochem Soc., 132, 890 (1985), H. Mutoh et al., J. Electrochem. Soc., 122, 987 (1975), and R. W. J. Morssinkhof et al., "Mechanistic Aspects of the Deposition of Thin Alumina Films Deposited by MOCVD", paper presented at Spring Meeting of the Materials Research Society, San Francisco, Calif. (1990). In these references, ATI is utilized under conditions in which 1) only bubbling is used to deliver ATI to the reactor, 2) a variety of ATI operating temperatures (78.degree.-170.degree. C.) is practiced, 3) deposition repeatability is not demonstrated, and 4) only a single substrate requires coating. However, while the literature describes the use of ATI for Al.sub.2 O.sub.3 deposition, the literature describes bubbling techniques for delivery of ATI but fails to present a workable manufacturing process. In fact, the bubbling technique described in the literature will not work in a manufacturing environment for the reasons discussed in more detail below.

International Business Machines Corporation


The preparation method of an exposure original plate according to the present invention includes a step of subdividing a pattern constituting an exposure original plate into a plurality of rectangular patterns, a step of extracting micro patterns having the size of a side smaller than a prescribed value from among the divided individual rectangular patterns, a step of forming a corrected micro pattern by increasing the size of the side of the extracted micro pattern perpendicular to the side making contact with an adjacent patter at least by the prescribed value, a step of forming a corrected adjacent pattern by retreating the side of the adjacent pattern making contact with the corrected micro pattern by the increased amount corresponding to the prescribed value, and a step of finding EB exposure data for the pattern including the corrected micro pattern and the corrected adjacent pattern, and carrying out EB exposure by the variable shaped beam exposure method based on the EB exposure data.

1. Field of the Invention
The present invention relates to a preparation method of an exposure original plate such as a photo mask and a reticle, and more particularly to a preparation method of forming a required pattern on the original plate by means of an electron beam (referred to as EB hereinafter) exposure.
2. Description of the Prior Art
The preparation of an exposure original plate such as a photo mask and a reticle by the EB exposure technology is accomplished by irradiating an EB sensitive resist formed on a transparent substrate with EBs in a required pattern using an EB exposure system. In the irradiation of EBs in the required pattern, there exists a technology of scanning the EB sensitive resist with one or a plurality of EBs, or a technology of irradiating the EB sensitive resist with an EB or EBs with its cross section formed in a rectangular form. In either case, it is necessary to prepare exposure data corresponding to a desired pattern to be formed, and carry out EB scanning or exposure using the EB exposure system based on the exposure data.
In the preparation of the EB exposure data, the pattern of the exposure original plate is subdivided into a plurality of rectangular patterns, and data processing is executed by recognizing individual divided rectangular patterns. In the data processing, the so-called optical proximity effect correction (OPC), which corrects the pattern for each part by taking the optical proximity effect into account, is employed, where a technique of a bias method or an inner serif method is available. These are technologies which correct parts of the shape of an object pattern by finding the correlations between the shapes of adjacent patterns, the dimensions between the patterns, and the like. For example, in the bias method, when proximity patterns P2 and P3 exist in parts of a linear wiring pattern P1, as shown in FIG. 14A, a wiring pattern in which part of each side of the wiring pattern P1 is deleted to reduce the pattern width according to the OPC as shown in FIG. 14B, is prepared in order to prevent short-circuiting between these patterns in the pattern formed on the exposure original plate, and EB exposure data corresponding to the corrected pattern are generated. In the meantime, in the inner serif method, when a gate electrode pattern P4 for a MOS transistor is bent in U-shape on both sides of a source-drain region SD, for example, as shown in FIG. 15A, in order to prevent an increase in the gate electrode dimension (gate electrode length) as shown by a broken line in the figure in the connection parts between the bent patterns P42, P43 on both sides and the central rectangular pattern P41, gate electrode pattern in which the inner side of the connection part is deleted to reduce the gate electrode length of the connection part, is created as shown in FIG. 15B, and EB exposure data corresponding to the corrected pattern are prepared.
However, with such a pattern correction by OPC, a problem arises in that micro patterns are generated when the corrected pattern is divided into rectangular patterns. Namely, in the case of the wiring pattern P1 in which portions located close to the proximity patterns are partially removed by the bias method as shown in FIG. 14B, division into a plurality of rectangular patterns P10, P11 and P12 as shown in FIG. 14C generates a rectangular pattern P10 with extremely small width direction size in the portion left by the removal, which becomes a micro pattern. In addition, in the case of the gate electrode pattern P4 by which U-shaped bent part is removed by the inner serif method as shown in FIG. 15B, rectangular patterns P44, P45 and P46 with extremely small size in respective width directions are generated in the regions across the removed portions as shown in FIG. 15C, which become micro patterns.
In recognizing the divided individual rectangular patterns, EB exposure data are prepared by regarding even such a micro pattern, recognized as a micro pattern, as an independent pattern, and EB exposure is carried out based on the obtained EB exposure data. In this case, in the EB exposure method using the point beam raster scan method which EB exposes a required pattern while continuously scanning a mask original plate with an EB of minute beam diameter among EB exposure methods, since the diameter of the EB beam can be reduced to about 0.08 μm, it is possible to expose properly a minute pattern of 0.1 μm. However, since a graphic is deleted in the units of about 0.004 μm in the bias method, rounding in the exposed image occurs at the minimum grid of the diameter of the EB beam. Accordingly, the point beam raster scan method is not applicable to the bias method.
In the meantime, when the exposure method using the variable shaped beam vector scan system (referred to as variable shaped beam exposure method hereinafter) is employed as the EB exposure method, since the current minimum grid is 0.002 μm, the problem of rounding will not occur, but there may arise a case in which it is not possible to EB expose a micro pattern as a normal pattern. The variable shaped beam exposure method is a technology in which EB beams are formed into a rectangular beam of required size by an aperture, further reducing it to an EB of beam bundle with a minute rectangle by a reduction lens, and expose an exposure original plate with the reduced EB. Because of this, assuming that beam blur due to optical proximity effect in the periphery of the rectangular bundle of EB is generated at a width of, for example, about 0.1 μm, the effect of the optical proximity effect on the pattern is inevitable when the size of at least one of the sides of the micro pattern is less than 0.1 μm, and it becomes impossible to normally expose a micro pattern. As a result, pattern defects arise in a pattern of prepared exposure original plate, and if a semiconductor device is manufactured using an exposure original plate with such pattern defects, abnormality in the characteristics of the semiconductor device will occur.
For example, when the pattern is divided into rectangular patterns as in FIG. 14C, the micro pattern P1O fails to be exposed normally as shown in FIG. 14D, with the wiring width of the wiring pattern P1 becoming thin at the intermediate part, the wiring resistance is increased or the wiring is disconnected. In the case of the gate pattern P4 in FIG. 15 B, the micro patterns P44, P45 and P46 generated by the division as shown in FIG. 15C fail to be exposed properly, and a gate electrode is formed with the width size, namely the gate electrode length, being especially small in the pattern P41, as shown in FIG. 15D. Accordingly, when micro patterns are generated in the execution of the bias method or the inner serif method, in order to preclude anomalies in the characteristics of the semiconductor device caused by such pattern defects in the exposure original plate, it has been conventional to withdraw the correction portions of the pattern so as to eliminate the micro patterns and to introduce a processing for reinstating the original pattern. As a result, effective use of the bias method or the inner serif method failed, and in that sense elimination of the drawback in the exposure original plate could not be realized.
In Japanese Patent Applications Laid Open, No. 2000-323389 is disclosed a technique, when EB exposure is executed in divided manner, of designing pattern data so as to provide a region where two patterns can be overlapped in a plane, in order to prevent generation of pattern discontinuity in the connection part. However, since this technique is applicable only to a connection part of the patterns and does not apply to micro patterns which do not involve connection with another pattern, such as the micro pattern generated in a part of the pattern by the OPC by the inner serif method as shown in FIG. 15, and is unable to eliminate a drawback due to such a micro pattern.
Moreover, Japanese Patent Applications Laid Open, No. Hei 9-129531 discloses a technique of taking the direction of the pattern division into consideration so as not to generate micro patterns in dividing a pattern into rectangular patterns. Since, however, patterns corrected by the bias method or the inner serif method tend to generate fine irregularities, it is not necessarily possible to prevent the generation of the micro patterns. For example, when the OPC due to the bias method is applied to the edges on the mutually opposite sides, to a linear wiring pattern as shown in FIG. 14, it is inevitable to generate micro patterns in dividing the wiring pattern in either one of longitudinal or lateral direction using the technique described in this disclosure, and it is difficult to eliminate the problem in the above.

Preparation method of exposure original plate


An apparatus for cutting pipes internally includes at least one cutting member, at least one drive member, at least one feed member, and at least one clamping member. The at least one cutting member cuts a pipe internally. The at least one drive member rotates the at least one cutting member to cut the pipe internally. The at least one feed member extend the at least one cutting member against the pipe internally and retracts the at least one cutting member from the pipe internally. The at least one clamping member secures the apparatus to the pipe internally.

Pipes, in or out of the ground, are often needed to be cut internally in order to seal off the pipe. A variety of apparatus, kits, and methods exist for internally cutting pipes. However, these apparatus, kits, and methods often are difficult to use or apply. Such issues may include one or more of the following: difficulty in using the apparatus to cut varying sized pipes, difficulty in centering the apparatus in a pipe, difficulty in securing the apparatus to a pipe, difficulty in abutting a cutting member of the apparatus against a pipe, difficulty in driving a cutting member of the apparatus against a pipe, difficulty in protecting a cutting member of the apparatus in the event of excessive force during cutting a pipe, difficulty in removing the apparatus from a pipe, or one or more other difficulties.
Apparatus, kits, and methods are needed to reduce or eliminate one or more issues of one or more of the current apparatus, kits, and methods for internally cutting a pipe.


A device for holding a printing plate comprises guide frames having a storing space for storing a discharged printing plate discharged from an upper plate cylinder a guide member an actuator for moving the discharged printing plate discharged from the upper plate cylinder between an operation position for storing the discharged printing plate in the storing space and a shelter position released from the upper plate cylinder and a hook element for holding the discharged printing plate in the storing space, a downstream side of the storing space located at the shelter position along a discharged printing plate storing direction is lower than an upstream side thereof and the downstream side of the storing space located at the operation position along a discharged printing plate storing direction is higher than the upstream thereof in order to pick-up/insert a discharged/new printing plate easily.

1. Field of the Invention
The present invention relates to a printing plate holding device for holding a new printing plate supplied to a plate cylinder of a printing press and a discharged printing plate discharged from the plate cylinder.
2. Prior Art
Regarding a conventional printing plate holding device for supplying a new printing plate to a plate cylinder of a printing press and a discharged printing plate discharged from the plate cylinder, it has been disclosed in Japanese Utility Model Registration No.3032484.
In a printing plate holding device disclosed in Japanese Utility Model Registration No. 3032484, a printing plate attaching unit for holding a new/discharged printing plate is sheltered data location above a plate cylinder. In the case of exchanging a printing plate, the printing plate attaching unit is moved to a location near the printing plate. After exchanging a printing plate, the unit is again sheltered at the location above the plate cylinder.
In a printing plate holding device disclosed in Japanese Utility Model Registration No. 3032484, the printing plate attaching unit located at the shelter position is above the plate cylinder. If such a printing plate holding device is applied to a large sized printing press or an upper plate cylinder for a double-sided printing press having upper- and lower plate cylinders, the printing plate attached at the upper plate cylinder at the shelter position is shifted to a level which is too high for an operator for setting/discharging a new/discharged printing plate in the case of exchanging the printing plate. A preparation time becomes longer so that product efficiency is reduced.
To resolve the above drawback, a purpose of the present invention is to provide a printing plate holding device for easily picking up a discharged printing plate and setting a new printing plate.
To resolve the above described subject, a device for holding a printing plate comprises a printing plate storing means with a storing space for storing a discharged printing plate discharged from a plate cylinder or a new printing plate supplied to the plate cylinder, moving means for moving the printing plate storing means between an operation position for storing the printing plate discharged from the plate cylinder in the storing space or supplying the printing plate from the storing space to the plate cylinder and a shelter position released from the plate cylinder and a printing plate holding member for holding the printing plate in the storing space of the printing plate storing means, wherein the device is characterized in that a downstream side of the storing space of the printing plate storing means along a printing plate storing direction or an upstream side thereof along a printing plate supplying direction at the shelter position is located lower than an upstream side along the printing plate storing direction or the downstream side thereof along the printing plate supplying direction, and the downstream side of the storing space of the printing plate storing means along the printing plate storing direction or the upstream side thereof along the printing plate supplying direction at the operation position is higher than the upstream side thereof along the printing plate storing direction or the downstream side thereof along the printing plate supplying direction.
In the above described device for holding a printing plate, wherein the printing plate storing means is a discharged printing plate storing means with the storing space for storing a discharged printing plate discharged from the plate cylinder, the moving means moves the discharged printing plate storing means between an operation position for storing the discharged printing plate discharged from the plate cylinder in the storing space and the shelter position released from the plate cylinder, the printing plate holding member is a discharged printing plate holding member for holding the discharged printing plate in the storing space of the discharged printing plate storing means, a downstream side of the storing space of the discharged printing plate storing means located at the shelter position along a discharged printing plate storing direction is lower than an upstream side thereof and the downstream side of the storing space of the discharged printing plate storing means located at the operation position along the discharged printing plate storing direction is higher than the upstream side thereof.
In the above described device for holding a printing plate, a downstream side of the storing space of the discharged printing plate storing means located at the shelter position along the discharged printing plate storing direction is lower than a downstream of the storing space of the discharged printing plate storing means located at the operation position.
In the above described device for holding a printing plate, the plate cylinder is provided at an upper printing portion located above a traveling path of a printed matter and the shelter position of the discharged printing plate storing means is located at a lower side of the upper printing portion.
In the above described device for holding a printing plate, the device further comprises a pair of right- and left-frames and a cover member for closing at least one part of a space formed between the pair of frames, wherein the storing space of the discharged printing plate storing means located at the shelter position is located at an exterior side with respect to the cover member.
In the above described device for holding a printing plate, the discharged printing plate can be picked up through a side portion of the storing space of the discharged printing plate storing means.
In the above described device for holding a printing plate, the printing plate storing means is new printing plate storing means with the storing space for storing a new printing plate supplied to the plate cylinder, the moving means moves the new printing plate storing means between an operation position for supplying the new printing plate to the plate cylinder and the shelter position released from the plate cylinder, the printing plate holding member is a new printing plate holding member for holding the new printing plate in the storing space of the new printing plate storing means, an upstream side of the storing space of the new printing plate storing means located at the shelter position along a new printing plate supplying direction is lower than an downstream side thereof and the upstream side of the storing space of the new printing plate storing means located at the operation position along the new printing plate supplying direction is higher than the downstream side thereof.
In the above described device for holding a printing plate, an upstream side of the storing space of the new printing plate storing means located at the shelter position along the new printing plate supplying direction is lower than an upstream side of the new printing plate storing means located at the operation position.
In the above described device for holding a printing plate, the plate cylinder is provided at an upper printing portion located above a traveling path of a printed matter, and the shelter position of the new printing plate storing means is located at a lower side of the upper printing portion.
In the above described device for holding a printing plate, the device further comprises a pair of right- and left-frames and a cover member for closing at least one part of a space formed between the pair of frames, wherein the storing space of the new printing plate storing means located at the shelter position is located at an exterior side with respect to the cover member.
In the above described device for holding a printing plate, the new printing plate can be set though a side portion of the storing space of the new printing plate storing means.


An over-current protection device includes first and second electrodes, and a positive temperature coefficient multilayered structure including first, second, and third polymer layers. The first polymer layer is bonded to the first electrode and includes a polymer matrix made from a polymer composition containing a grafted olefin-based polymer. The second polymer layer has a through hole and includes a polymer matrix made from a polymer composition containing a non-grafted olefin-based polymer and substantially free of a grafted olefin-based polymer. The third polymer layer is bonded to the second electrode and includes a polymer matrix made from a polymer composition containing a grafted olefin-based polymer.

Referring to FIG. 1, positive temperature coefficient (PTC) over-current protection device exhibits a PTC effect that renders the same to be useful as a circuit protection device 1. A conventional circuit protection device 1 includes a PTC polymer layer 11 and two electrodes 12 attached to two opposite surfaces of the PTC polymer layer 11. The PTC polymer layer 11 includes a polymer matrix that contains a crystalline region and a non-crystalline region, and a particulate conductive filler dispersed in the non-crystalline region of the polymer matrix and is formed into a continuous conductive path for electrical conduction between the electrodes 12. The PTC effect is a phenomenon that, when the temperature of the polymer matrix is raised to its melting point, crystals in the crystalline region start melting and results in generation of a new non-crystalline region. As the new non-crystalline region is increased to a certain extent and merges with the original non-crystalline region, the conductive path of the particulate conductive filler will become discontinuous and resistance of the PTC polymer material will increase rapidly, thereby resulting in electrical disconnection between the electrodes.
The circuit protection device is used for protecting an electronic apparatus, and the polymer matrix of the PTC polymer layer 11 is selected based on an operating current and an operating voltage of the electronic apparatus. The polymer matrix of the PTC polymer layer 11 is usually made from a polyethylene-based composition. However, the circuit protection device might not have desired electrical conductivity due to a relatively poor adhesion between the PTC polymer layer 11 and the electrodes 12.
U.S. Pat. No. 6,238,598 discloses a PTC polymer blend composition and a circuit protection device. The PTC polymer blend composition includes a non-grafted polyolefin, a grafted polyolefin, and a conductive particulate material. The circuit protection device includes a PTC element having the PTC polymer blend composition and two electrodes respectively connected to two opposite sides of the PTC element. With inclusion of the grafted polyolefin in the PTC polymer blend composition, the circuit protection device has a relatively good electrical stability and good adhesion between the PTC element and the electrodes.
However, volume resistance of the circuit protection device disclosed in U.S. Pat. No. 6,238,598 is not lower than 0.15 ohm-cm. The volume resistance may be reduced (e.g., close to 0.1 ohm-cm) by virtue of excluding the grafted polyolefin from the PTC polymer blend composition. However, peel strength between the electrodes and the PTC element may become lower than 0.4 kG/cm2. As a consequence, the PTC element and the electrodes may be easily separated from each other, thereby resulting in malfunction of the over-current protection device.
In view of the foregoing, there is a need for manufacturing an over-current protection device with desired conductivity and good adhesion.


In an embodiment, the present invention provides a system for generating a visualization a home or building, including a fieldbus commissioning tool with a template library and a graphical commissioning engine for implementing physical devices of the home or building. The template library includes: a set of device templates and device object templates, which contains information how the devices are used; a set of zone templates, which specify the use of the devices which are available within a zone; a set of automation templates and a set of web templates. The fieldbus commissioning tool is connected with a configuration data input unit and an automation studio, the automation studio being receiving building topology information, which are supplied by the fieldbus commissioning tool. Based on the building topology, the automation studio generates a navigation structure of the building to allow access to different areas of the building.

A building management system is used to control and monitor a building or a part of a building, e.g. in functional buildings, hotels, office buildings, hospitals, apartment buildings etc.
The implementing or commissioning of a functional building or part of building, e.g. a hotel, an office-building complex, a hospital or a cinema follows normally a two-step approach.
In a first implementation step, all physical devices, e.g. fieldbus devices, have to be configured with dedicated application parameters and data points for establishing communication to the bus system, which connects the devices of the building automation system. Depending on the underlying technologies, different tools have to be used to execute this implementing step.
The application parameters generally called configuration properties in a local operating network (LON) and parameters in KNX-standard. These are settings that are mainly kept in the persistent memory of devices. They are used to configure the way of working of a device, for instance of working for lights (dimming mode or on/off mode), fan coil device state as standalone, master, slave etc.
Data points generally called network variables in LON and group address in KNX. These are the values for instance will allow changing the temperature offset for a fan coil unit, e.g. a data point used to configure the temperature set point of a fan coil.
In a second implementation step, the visualization of the building has to be setup. Additional commissioning tools and releases are required, which exchange basic data functionalities with the tools the first step.
While in the first step all fieldbus devices have to be placed to their location inside the building, the second step requires the positioning of control elements inside a visual building topology. Currently both steps require manual work and are isolated and independent from each other. Import and export functions are provided to use the data exchange between the different commissioning tools, however during these steps information gets lost and has to be added once again.

System and method for generating a visualization of a building management system


A flexible composite expansion joint material comprises a fluoropolymer containing woven fabric substrate with mutually perpendicular warp and fill yarns. The substrate is subdivided into plural segments which are arranged successively in a longitudinally extending assembly with the warp and fill yarns of each segment extending obliquely with respect to the assembly length. At least one other component extends over the assembly length. The successively arranged substrate segments are spliced together and integrally joined to the other component by lamination under conditions of elevated temperature and pressure.

1. Field of the Invention
This invention relates to composite materials employed in the fabrication of nonmetallic expansion joints, in particular those serving as flue duct seals in low pressure high temperature gas service installations.
2. Description of the Prior Art
Nonmetallic expansion joints are used in both liquid service and gas service installations.
Liquid service expansion joints must be capable of operating under wide ranges of pressure and temperature, e.g., pressures ranging from full vacuum to 150 p.s.i. and higher, and temperatures ranging from below 0xc2x0 F. to 300-400xc2x0 F. Such expansion joints are predominantly manufactured from single ply materials supplied in roll form as xe2x80x9croll goodsxe2x80x9d, e.g., rubber and woven fabrics. Expansion joint manufacturers typically employ molding and hand lay up techniques to produce composites of such materials with relatively thick cross sections on the order of 0.5 inches. The resulting expansion joints are very stiff, thereby requiring significant forces to generate any movement or flexing.
In contrast to the foregoing, gas service expansion joints, more commonly referred to as xe2x80x9cflue duct sealsxe2x80x9d, are designed to operate under relatively low pressure conditions, typically xc2x15 p.s.i., and at temperatures ranging from below 0xc2x0 F. to 1400xc2x0 F. and higher. The composite materials used in the manufacture of flue duct seals can have relatively thin cross sections on the order of 0.006 to 0.25 inches, typically including a single ply of woven fabric combined with both rubbers and perfluoroplastics. Thicker constructions include additional woven fabric plies. Such composite materials are usually manufactured by coating or laminating techniques and are also supplied as roll goods to expansion joint manufacturers. Ideally, these composite materials should be inherently flexible, and capable of readily elongating under relatively low stress conditions.
The woven fabrics used as the load bearing components of expansion joint composites are commonly xe2x80x9csquare weavesxe2x80x9d. Such fabrics are high modulus materials that do not readily stretch or elongate when stressed in the direction of their warp or fill yarns. However, the same materials are capable of readily stretching if they are arranged with their yarns on a bias with respect to the direction of stress. Thus, in situations where the ability to readily stretch or elongate is critical, as is often the case in the expansion joint industry, expansion joint manufacturers have resorted to relatively complex and labor intensive fabrication techniques in order to achieve a bias orientation of the conventional composite materials currently available on the open market.
During at least the last 20-30 years, this has been accomplished by cutting the conventional composite materials into discrete segments which are reoriented by 45xc2x0 and then spliced back together to form so called xe2x80x9cbeltsxe2x80x9d. The belts are then fabricated into expansion joints, with the warp and fill yarns of the load bearing components arranged on a bias with respect to the expected directions of major stress.
This procedure was reasonably suited to the earlier composite materials, which typically comprised single plies of woven fiberglass coated with rubber. Splicing was easily achieved at relatively low temperatures. However, with the enactment of more aggressive air pollution legislation in the late 1960""s and early 1970""s, there arose a need for more sophisticated composite materials, with greater resistance to chemical attack and with a greater ability to span wider gaps between equipment components.
To meet these demands, more complex rubber composites came on the market, with fluoroelastomer coatings and multiple layer constructions containing two or more woven fabric plies. These more complex composite constructions could not readily be subdivided and spliced back together to achieve a bias orientation of the woven fabric load bearing components. Thus, bias orientation remained largely limited to the fabrication of expansion joints from the earlier composite materials.
In the 1980""s and 1990""s, composite expansion joint materials combining woven fabric load bearing components with perfluoroplastics such as polytetrafluoroethylene (PTFE) began acquiring a meaningful market share. However, splicing of these materials involved new fabrication procedures requiring the use of irons heated to elevated temperatures on the order of 725xc2x0 F. Such procedures were unfamiliar to the expansion joint industry. Thus, very little bias production of expansion joints employing these PTFE based composites took place, and then only by cutting the materials into segments which were then reoriented on a bias and spliced back together, as was done earlier with the simple rubber based products.
In recent years, a significant and increasing amount of new power generation is being based worldwide on gas and diesel turbines. This equipment operates at much higher temperatures, with an attendant increase in thermally induced movement between equipment components. This has prompted the development of even more complex fluoropolymer based composite materials, typically comprising PTFE coated woven fabric substrates combined with sophisticated corrosion barriers, thermal barriers and other associated components in multi layer laminated composites.
To date, use of these more sophisticated composite materials in bias oriented configurations has been limited because conventional techniques for doing so dictate that the entire composite must be cut through in order to provide segments which can be reoriented and reassembled by splicing. The procedures for splicing the individual composite plies in a manner that retains their continuity are exceedingly difficult and often unreliable. Failure to properly splice the corrosion and/or thermal barrier components can result in the fabrication of flue duct seals which fail prematurely in service.
Use of these materials without arranging their fabric substrates on a bias has led to other problems, particularly in flue duct seals operating at very high temperatures, where movement between equipment components is most pronounced. For example, the inability of such composite materials to readily elongate or stretch can lead to the formation of severe creases and/or wrinkles. When wrinkles develop, the resulting folds lose the cooling effect of ambient air. This in turn can produce xe2x80x9chot spotsxe2x80x9d or burned areas that will require replacement of the expansion joint within a very short period.
Accordingly, it is an object of the present invention to provide a flexible composite expansion joint material having as its load bearing component a fluoropolymer containing woven fabric substrate which has been segmented and reoriented into a bias configuration, without attendant disruption or compromise in the continuity and integrity of associated fluid corrosion barrier and/or thermal barrier components.
A further objective of the present invention is the provision of an improved method for producing the aforesaid expansion joint material as roll goods for use in the fabrication of flue duct seals.
A flexible composite expansion joint material is formed by laminating together a load bearing component comprising a fluoropolymer containing woven fabric substrate with at least one fluoropolymer fluid corrosion barrier component and/or a nonfluoropolymer thermal barrier component. The fluoropolymer containing fabric substrate is initially subdivided into plural segments, each having mutually perpendicular warp and fill yarns. The substrate segments are then reoriented at 45xc2x0 angles and arranged successively in a longitudinally extending assembly, with the warp and fill yarns of each substrate segment arranged on a bias, i.e., extending obliquely with respect to the assembled length. The assembly of substrate segments is overspread with one or more other components of the composite, including, inter alia, fluoropolymer fluid corrosion barrier film components and/or nonfluoropolymer thermal barrier components. The successive fabric substrate segments are spliced together and integrally joined to the other composite components by lamination under conditions of elevated temperature and pressure. The continuity and integrity of the latter components is thus unaffected by the separate subdivision, reorientation and reassembly of the fabric substrate segments, which takes place prior to their combination with other components of the composite.