To increase the aperture ratio of a transflective liquid crystal display device and suppress a light leakage. Provided is a transflective liquid crystal display device that includes: within a unit pixel, a reflective area including a pixel electrode and a common electrode as a pair and a reflector, and a transmissive area including a pixel electrode and a common electrode as a pair; a liquid crystal layer provided to the reflective area and the transmissive area; storage capacitances for the reflective area and the transmissive area provided in a lower layer of the reflector for changing a potential of the pixel electrode by following a potential of the common electrode; and a suppressing device for suppressing a light leakage in the liquid crystal layer when the pixel electrode is affected by a potential of the reflector due to capacitance coupling generated between the reflector and the pixel electrode.

1. Field of the Invention
This invention relates to a liquid crystal display device. More specifically, this invention relates to a liquid crystal display device whose liquid crystals in a display region are driven for display, in which the display region includes both a reflective area for achieving display by reflecting light that makes incident from outside and a transmissive area for achieving display by transmitting light from a rear part.
2. Description of the Related Art
Liquid crystal display devices can be broadly classified into transmissive liquid crystal display devices and reflective liquid crystal display devices. In general, a transmissive liquid crystal display device has a backlight light source, and displays an image by controlling an amount of transmitted light from the backlight light source. A reflective liquid crystal display device has a reflector for reflecting light from outside, and displays an image by utilizing the light reflected by the reflector as a display light source. The reflective liquid crystal display device requires no backlight light source, so that it has an advantage over the transmissive liquid crystal display device in terms of reducing the power consumption, the thickness, and the weight of the device. However, the reflective liquid crystal display device has such a shortcoming that the contrast and visibility become deteriorated under a dark condition, since it uses light in the surroundings as the display light source.
In the meantime, transflective liquid crystal display devices that have advantages of both the transmissive liquid crystal display device and the reflective liquid crystal display device have been put into practical use as displays of portable telephones and mobile terminals. A transflective liquid crystal display device has a transmissive area and a reflective area within a unit pixel. The transmissive area transmits light from a backlight light source, and uses the backlight light source as a display light source. The reflective area has a reflector, and uses external light that is reflected by the reflector as a display light source. With the transflective liquid crystal display device, it is possible to reduce the power consumption by putting out the backlight light source and displaying an image with the reflective areas under a bright condition. Further, it is also possible to display an image even under a dark condition by putting on the backlight light source and displaying an image with the transmissive areas when the surrounding condition turns dark.
Further, as a liquid crystal panel and a liquid crystal display device having a wide range of visible view angles, a transverse electric field mode such as an IPS mode (In-Plane switching) that is generally referred to as a wide view angle liquid crystal panel has been put into practical use. With this IPS-mode liquid crystal panel, liquid crystal molecules are aligned uniaxially by being in parallel to a substrate, and a voltage is applied in parallel to the substrate so as to rotate the liquid crystal molecules while keeping a balanced state with the substrate. That is, the liquid crystal molecules do not rise against the substrate even when the voltage is applied, so that the wide view angles can be obtained theoretically. Further, the IPS-mode liquid crystal display device has a pixel electrode and a common electrode formed on the same substrate, and a lateral electric field is applied to a liquid crystal layer. With the IPS-mode liquid crystal display device, wider view angles than that of a TN-mode liquid crystal display device, for example, can be achieved by displaying an image through rotating the liquid crystal molecules in a direction parallel to the substrate.
When the IPS mode is employed for a related transflective liquid crystal display device, black display and white display are inverted. Thus, if the transmissive area is normally black under a normal driving system, the reflective area becomes normally white.
FIG. 17A and FIG. 17B illustrate schematic sectional views of a unit pixel of the related transflective liquid crystal display device. As shown in FIG. 17A and FIG. 17B, the unit pixel of the transflective liquid crystal display device includes a back-face side substrate 501, a viewer-side substrate 502, and a liquid crystal layer 503 sandwiched between both substrates. The unit pixel includes, in a pixel area, a reflective area 521 for reflecting light from the viewer side, and a transmissive area 522 for transmitting light from the back-face side, and the liquid crystal layer 503 of the reflective area 521 and the transmissive area 522 is driven with a transverse electric field by a voltage that is applied in parallel to the substrate face.
Further, the back-face side substrate 501 and the viewer-side substrate 502 include a first polarizing plate 520 and a second polarizing plate 523, respectively, on the outer side thereof. Furthermore, two kinds of electrodes, i.e. pixel electrodes 511 and common electrodes 512, are formed on the surface of the back-face side substrate 501 on the liquid crystal layer side. In a part of the area where the pixel electrode 511 and the common electrodes 512 are formed, a reflector 515 and an insulating layer 516 are provided between those electrodes and the back-face side substrate 501. The thickness of the liquid crystal layer 503 of the reflective area 521 is a half the thickness of the liquid crystal layer 503 of the transmissive area 522, because of an existence of the insulating layer 516. Further, a backlight 504 functioning as a light source for transmissive display is provided on the outer side (lower side) of the polarizing plate (first polarizing plate) of the back-face side substrate 501.
Further, as illustrated with dotted lines in FIG. 17A and FIG. 17B, the first polarizing plate 520 and the second polarizing plate 523 are arranged in such a manner that the polarizing axes thereof become orthogonal to each other. In the liquid crystal layer 503, the liquid crystal molecules are aligned to face in a direction that is shifted from the polarizing axis (light transmitting axis) of the first polarizing plate 520 by 90 degrees, when no voltage is applied. For example, if the polarizing axis of the first polarizing plate 520 is 0 degree, the polarizing axis of the second polarizing plate 523 is set as 90 degrees, and the major axis direction of the liquid crystal molecules of the liquid crystal layer 503 is set as 90 degrees. In the liquid crystal layer 503, a cell gap in the transmissive area 522 is so adjusted that retardation Δnd (Δn is refractive index anisotropy of the liquid crystal molecules, d is a cell gap of the liquid crystal) becomes λ/2 (λ is a wavelength of light; e.g., λ=550 nm when green light is taken as reference), while a cell gap in the reflective area 521 is so adjusted that the retardation becomes λ/4.
Now, by referring to FIG. 17A, there is described an optical action of the unit pixel of the transflective liquid crystal display device in the above-described structure, when no voltage is applied to the liquid crystal layer 503. First, linear polarized light in the direction of 90 degrees (longitudinal direction) that has passed through the second polarizing plate 523 (referred to as "90-degree linear polarized light" hereinafter) makes incident on the liquid crystal layer 503 of the reflective area 521. In the liquid crystal layer 503, the optical axis of the linear polarized light that makes incident on the liquid crystal layer 503 and the major axis direction of the liquid crystal molecules are consistent. Therefore, the incident light in the state of 90-degree linear polarized light as it is transmits through the liquid crystal layer 503, and it is reflected by the reflector 515. In a case of the linear polarized light, it remains in the state of the linear polarized light even after being reflected. Thus, the reflected light in the state of 90-degree linear polarized light again makes incident on the liquid crystal layer 503. Further, the 90-degree linear polarized light as it is exits from the liquid crystal layer 503 and makes incident on the second polarizing plate 523. The polarizing axis of the second polarizing plate 523 is also 90 degrees, so that the 90-degree linear polarized light transmits through the second polarizing plate 523. Therefore, when there is no voltage applied, the reflective area 521 provides white display.
Next, described is the transmissive area 522 where no voltage is applied. The transverse linear polarized light that has passed through the first polarizing plate 520 makes incident on the liquid crystal layer 503 of the transmissive area 522. In the liquid crystal layer 503, the polarizing direction of the incident light and the major axis direction of the molecules are orthogonal to each other, so that the transverse linear polarized light passes therethrough without changing the polarized state, and makes incident on the second polarizing plate 523. Since the polarizing axis of the second polarizing plate 523 is 90 degrees, the transmitted light cannot passes through the second polarizing plate 523, which results in providing black display.
Next, by referring to FIG. 17B, there is described an optical action of the unit pixel of the transflective liquid crystal display device in the above-described structure, when a voltage is applied to the liquid crystal layer 503. First, linear polarized light in the direction of 90 degrees (longitudinal direction) that has passed through the second polarizing plate 523 makes incident on the liquid crystal layer 503 of the reflective area 521. By applying the voltage, the major axis direction of the liquid crystal in the liquid crystal layer 503 is changed from 0 degree to 45 degrees on the substrate plane. In the liquid crystal layer 503, the polarizing direction of the incident light and the major axis direction of the liquid crystal molecules are shifted from each other by 45 degrees, and the retardation of the liquid crystal is set as λ/4. Therefore, the longitudinal linear polarized light that has made incident on the liquid crystal layer 503 is turned into clockwise circular polarized light, and it makes incident on the reflector 515. The clockwise circular polarized light is reflected by the reflector 515 and turned into counterclockwise circular polarized light. The counterclockwise circular polarized light that has made incident on the liquid crystal layer 503 passes through the liquid crystal layer 503 again, which turns into transverse (0-degree) linear polarized light and makes incident on the second polarizing plate 523. Since the polarizing axis of the second polarizing plate 523 is 90 degrees, the reflected light cannot pass through the reflector 515, which results in providing black display.
Then, the transverse linear polarized light that has passed through the first polarizing plate 520 makes incident on the liquid crystal layer 503 of the transmissive area 522. By applying the voltage, the major axis direction of the liquid crystal molecules in the liquid crystal layer 503 is changed from 0 degree to 45 degrees on the substrate plane. In the liquid crystal layer 503, the polarizing direction of the incident light and the major axis direction of the liquid crystal molecules are shifted from each other by 45 degrees, and the retardation of the liquid crystal is set as λ/2. Therefore, the transverse linear polarized light that has made incident on the liquid crystal layer 503 is turned into longitudinal-direction linear polarized light, and it makes incident on the second polarizing plate 523. Therefore, in the transmissive area 522, the second polarizing plate 523 let through the backlight that has passed through the first polarizing plate 520, which results in providing white display.
With the transflective liquid crystal display device described above, there is such an inconvenience that white display and black display are inverted in the reflective area 521 and the transmissive area 522 in both cases where an electric field is applied to the liquid crystal layer 503 and where it is not applied.
As a measure for this, it is possible to provide consistency in displays of the reflective area and the transmissive area through applying voltages different from each other to the liquid crystal layer in the reflective area and the transmissive area of the transflective liquid crystal display device. For example, in the above-described IPS transflective liquid crystal display device, it is possible to apply different voltages to each of the reflective area and the transmissive area through setting a signal inputted to the common electrode of the reflective area (referred to as a reflective common signal hereinafter) and a signal inputted to the common electrode of the transmissive area (referred to as a transmissive common signal hereinafter) to be in opposite phases from each other.
Now, examples of waveforms of each input signal at the time of black display are shown in FIG. 18. There is a potential difference generated in the reflective area between the pixel electrode and the common electrode in a scanning line selected period, and a voltage is applied to the liquid crystal layer (Vlc of FIG. 18A), which results in providing black display. In the meantime, a signal that is in an inverted phase from that of the reflective common signal is inputted to the transmissive common electrode of the transmissive area. Thus, there is no potential difference generated between the pixel electrode and the common electrode in the scanning line selected period, so that no voltage is applied to the liquid crystal layer (Vlc of FIG. 18B), which also results in providing black display. Further, in order to keep the voltage to be applied to each liquid crystal layer within one frame period, it is necessary for the potential of the pixel electrode to change by following the potential of the common electrode. Since the voltages held in the transmissive area and the reflective area are different, it is necessary to provide a storage capacitance to each of the reflective area and the transmissive area.
Now, changes in the potentials of each electrode at the time of black display will be described. As shown in FIG. 19A, in the reflective area, it is necessary to apply a voltage to the liquid crystal layer at the time of black display. Thus, a potential difference (assumed to be 5V in this case) is generated between the common electrode and the pixel electrode in a scanning line selected period. Thereafter, potentials of the pixel electrode and a reflector 1 become floated in a scanning line non-selected period. Thus, the potentials of the pixel electrode and the reflector 1 are to follow the reflective common signal by synchronizing with it through forming a capacitance with the common electrode. Further, as shown in FIG. 19B, in the transmissive area, no voltage is applied to the liquid crystal layer at the time of black display. Thus, the potentials of the common electrode and the pixel electrode in the scanning line selected period become consistent. Thereafter, in the scanning line non-selected period, the potentials of the pixel electrode and the reflector are to follow the transmissive common signal by synchronizing with it through forming a capacitance with the common electrode.
Further, there is also disclosed a unit pixel structure with which displays of the reflective area and the transmissive area can be made uniform by controlling drives of the IPS transflective liquid crystal display device through providing a storage capacitance, respectively, to the reflective area and the transmissive area of the liquid crystal layer for applying different voltages from each other to the respective areas (Japanese Unexamined Patent Application 2005-191061: Patent Document 1). In Patent Document 1, two TFTs (Thin Film Transistors) corresponding to each of the reflective and transmissive areas as well as a first and a second common electrodes corresponding to each of the reflective and transmissive areas are provided. The reflective area and the transmissive area of the liquid crystal layer are driven by inputting signals that are inverted from each other to the two common electrodes.
Furthermore, there is also disclosed a liquid crystal display device in which: a transistor and a storage capacitance are provided by corresponding to each of a reflective area and a transmissive area; and a transistor Tr and storage capacitance lines CsrL and CstL are provided to each of the reflective area and the transmissive area (Japanese Unexamined Patent Publication 2005-189570: Patent Document 2). In Patent Document 2, the storage capacitance of the reflective area is formed with the pixel electrode and the storage capacitance line CsrL of the reflective area, and the storage capacitance of the transmissive area is formed with the pixel electrode and the storage capacitance line CstL of the transmissive area. Thereby, the storage capacitance is individually formed in each of the reflective area and the transmissive area. With this, different potentials can be applied to the pixel electrodes of the reflective area and the transmissive area. Further, the aperture ratio of the liquid crystal display device can be increased by forming the storage capacitance of the transmissive area in a lower layer of the reflector of the reflective area.
However, with the transverse electric field type transflective liquid crystal display device described above, it is not possible to achieve an excellent display by simply forming the storage capacitances for the reflective area and the transmissive area in the lower layer of the reflector. For example, when the reflective pixel electrode and the transmissive pixel electrode for forming the storage capacitance are disposed in the lower layer of the reflector in the structure of Patent Document 1, capacitance coupling occurs between both pixel electrodes and the reflector. Thus, the potentials of the pixel electrodes are shifted. Therefore, an offset voltage to be described later is applied to the liquid crystal layer, which causes deterioration in the contrast due to a leakage of light. There is also a similar problem raised when the reflective storage capacitance forming part and the transmissive storage capacitance forming part are overlapped with a layer that is made of another conductive substance.

Transflective liquid crystal display device


A chair has a seat back with removable front and rear upholstered covers. The covers are held to the back by hidden release levers which prevent unauthorized removal of the covers.

This invention relates to a chair construction. There are prior constructions in which parts of the chair are removable, to facilitate assembly and to permit repair or replacement of cushions and upholstery. A disadvantage of many such constructions is that they may be disassembled by curious users who are not authorized to do so. Also, such constructions may have conspicuous protruding release mechanisms which detract from the appearance of the chair, and may be dangerous.


A nozzle for producing an ultrahigh-pressure fluid fan jet is shown and described. In a preferred embodiment, the nozzle has an inner surface defined by a conical bore extending from a first end to a second end, thereby creating an entrance orifice and an exit orifice in the first and second ends, respectively. A wedge-shaped notch extends inward from the second end towards the first end to a sufficient depth such that the shape of the exit orifice is defined by the intersection of the conical bore and the wedge-shaped notch. As pressurized fluid passes through the nozzle and out the exit orifice, the shape of the exit orifice causes the pressurized fluid to exit in the form of a fan jet having a substantially oval cross-section. This fan jet may be swept across a surface to be cleaned thereby selectively removing a layer of material from an underlying surface evenly and completely, without damaging the underlying surface. The fan jet may also be used to cut a fibrous or hard material.

Numerous tasks, for example cutting, cleaning, milling, and kerfing, may be accomplished through the use of a stream of pressurized fluid, typically water, generated by high-pressure, positive displacement pumps or other suitable means. Such pumps pressurize a fluid by having a reciprocating plunger that draws the fluid from an inlet area into a pressurization chamber during an intake stroke, and acts against the fluid during a pumping stroke, thereby forcing pressurized fluid to pass from the pressurization chamber into an outlet chamber, from which it is collected into a manifold. The pressurized fluid is then directed through the nozzle of a tool thereby creating an ultrahigh-pressure jet that may be used to perform a particular task, for example cutting a sheet of metal or cleaning a surface, such as on aircraft parts. Such jets may reach pressures up to and beyond 55,000 psi.
In the past, such ultrahigh-pressure fluid tasks have been accomplished using nozzles that produce a column of pressurized fluid having a circular cross-section. Rotating such a round jet is equivalent to moving a point. As a result, a round jet may be well-suited for direct use in certain tasks, for example, cutting out odd shapes such as a diaper. For other tasks, such as cleaning, round jets require relatively complex methods of use and may not provide optimum results.
For example, when cleaning a surface, it is desirable and often necessary to remove a layer of matter from an underlying surface without damaging the underlying surface. It is also often necessary to have a 100% clean surface. To clean a surface with a round jet, it is necessary to move the round jet, or point, in a circular pattern in an attempt to clean the entire surface. However, such a method produces a pattern in which some areas on the surface being cleaned are hit multiple times while other areas of various shapes are not hit at all by the jet. As a result, the surface is not 100% clean, and the underlying surface will be damaged and uneven.
A need therefore exists for an improved method of cleaning surfaces and accomplishing other ultrahigh-pressure fluid tasks.


A dishwashing machine having a wash tank (1) arranged to be supplied with fresh supply water through an appropriate water supply circuit (8-14). The machine is adapted to perform operational cycles including a washing phase and at least one rinsing phase. A water recovery system (14, 15) is provided to store in a reservoir (11) water from the last rinse for re-using during a subsequent washing cycle. The reservoir (11) is a part of the water supply circuit (8-14) so that the reservoir is capable of being flushed by the fresh water delivered into the tank (1,4) when the supply circuit is opened.

The present invention relates to a washing machine, in particular a dishwashing machine, adapted to reclaim water used in at least one operational step or phase of a washing process.
As shown in patent specifications as EPO 0 287 990 and Germany 29 10 140 clothes washing machines are known in which water from a rinse phase is collected in an appropriate reservoir. The reservoir is connected in parallel with the washing machine for reuse of the water in a pre-wash or main wash phase of a subsequent washing process.
U.S. Pat. No. 4,810,306 further discloses an industrial-type dishwashing machine in which part of the water used for washing and all of the water used for rinsing is collected and stored in a reservoir. The so formed mixture is then used for a subsequent washing cycle.
Such arrangements are effective in bringing about an appreciable energy saving effect, but share the drawback that the rinse and/or wash water stored in the reservoir is at least partially contaminated, i.e., polluted. As a consequence, over time, the reservoir can be subject to heavy sedimentation or scaling to an unacceptable extent. In addition, a likely formation and build-up of molds, fungi and/or bacteria may affect the hygienic condition of the dishwashing machine.

Washing machine with water recovery arrangement

Electrolux Zanussi Elettrodomestici S.p.A.


A boat for use in wafer processing technology such as associated with semiconductor wafers. The boat consists of a relatively flat bottom plate having a plurality of substantially parallel V-cut notches therein on which the bottom of the wafer rests and two parallel side rails disposed above and on either side of the flat bottom plate for holding the sides of the wafer. The two side rails includes a plurality of opposed U-shaped notches cut in parallel along the inner surface of the side rails for movably securing the opposite side edges of the wafer placed in the boat. Each pair of opposed U-shaped notches being offset with respect to a V-cut notch operatively associated therewith. Such boats are applicable to wafer handling areas including oxidation, diffusion, low pressure chemical vapor deposition (LPCVD), plasma etching, chemical etching, photoresist coating, baking, stripping, ultrasonic cleaning, and other automatic wafer handling operations. In addition to applicability to semiconductor processing technology, the boat is also applicable to other electronic processing technology such as the processing of magnetic bubble substrate materials.

There are a wide variety of commercially available boats for processing silicon wafers in semiconductor technology. Although such boats are typically for use with silicon wafers or wafers composed of a single semiconductor material, more recent developments in semiconductor technology have been making use of binary materials in which the wafer is composed of more than one element. An example of such a wafer is a silicon-on-sapphire wafer in which one side is composed of silicon whereas the other side is sapphire. When such wafers, as well as silicon wafers, are heated and cooled during a circuit fabrication process, the temperature of one surface increases faster than the other due to difference in thermal properties such as heat absorption, heat conduction, and radiation, or other factors such as in the spacing between adjacent wafers. Thus the thermal expansion of one material is different from the other resulting in a warping of the wafer into a shape much like a potato chip. When the commercially available boats designed for silicon technology are used with such wafers of binary materials, the wafer warpage often exceeds the wafer breaking point and the constraints and pressures imposed on the designs of the prior art processing boats jam the wafers in a given position so that the wafers have a greater tendency to break as they warp during the fabrication process.
The same breakage problem is also present (although to a smaller extent) in silicon wafers due to warpage during processing. In particular during the warping process the effective diameter of the wafer decreases and the wafer settles deeper into the various grooves provided in the prior art boats. As the wafers gradually reach thermal equilibrium the wafers begin to straighten out and as the wafer diameter again increases the wafers jam and break due to the changed position.
The wafer breakage due to the thermal shock and warping is observed in the bulk silicon processing for NMOS, PMOS, CMOS or bipolar circuits. In this case, the front surface of the silicon wafers is polished to a mirror-like surface while the back side is merely lapped. These two surfaces also have different thermal properties and the wafers warp during heating and cooling. Thus, a certain wafer breakage rate exists even in the bulk silicon processing although the breakage rate is lower than the SOS wafers. Magnetic garnet wafers and GaAs wafers have a similar breakage problem as SOS wafers.
Prior to the present invention there has not been a suitable boat for handling and processing wafers, particularly wafers composed of binary material, without an unacceptable breakage percentage.


A kite which in a simplest embodiment comprises a central rectangular section having one edge joined to an edge of one rectangular side section and an opposite edge joined to an edge of an opposite side section wherein, reach edge to edge junction has a tube secured to the sheet along a junction line. Each of four corners of the kite are secured to one of four cords respectively, permitting a user to maneuver the kite while the kite is in flight. The use of tubes permits joining one such kite, to another, by inserting one end of a rod into one tube of one kite and another end of the rod into a tube of another kite such that the central sections of the kites are coplanar and each side section of each module is coplanar with a side section of the other kite respectively. Use of tubes to construct the frame provides strength and light weight to the kite construction.

This kite relates to stunt kites and particularly to a kite that can be assembled in several configurations, is launchable with only one operator, can perform controlled stunts, and can be constructed as a very small kite or a very large kite.
Mankind""s fascination with things that fly was first manifested by the development of the kite. These manifestations continue to appear in different forms.
For example, kites are constructed to resemble birds or as boxes. Two or more cords of attachment are applied to the kite to perform xe2x80x9cstuntsxe2x80x9d such as diving, and turning. Kites have been developed to engage in xe2x80x9ckite fightsxe2x80x9d with other kites in which one kite flier attempts to maneuver his kite so as to cut the string of his opponent""s kite.
U.S. Pat. No. 4,799,634 to Bezulieu discloses a kite with means for dropping a parachute.
U.S. Pat. No. 5,322,247 to Munday et al discloses a kite having a sail shape and four cords attached to the kite for causing the kite to travel and turn in any direction.
U.S. Pat. No. 5,328,134 to Powers discloses a kite having a delta frame with dual control lines and quad control lines.
U.S. Pat. No. 5,556,057 to Davis discloses a kite which changes geometry and aerodynamic form in flight and has a flexible leading edge spar.
The present invention introduces the idea of a kite that has features that parallel the present active interest in space stations.
It is an object of this invention to provide a kite that has a modular construction, each module being capable of flight. It is another object to use materials that are very economical and lightweight so that very small kites can be constructed. It is a further object that the kite be adaptable to added features such as great maneuverability and the ability to carry objects aloft and which are then released.
This invention is directed toward a kite whose frame is constructed of paper or plastic tubes, such as drinking straws. The straws are joined by any one of several ways. They may be joined end to end by inserting the crimped end of one tube into the uncrimped end of another tube. Or they may be joined end to end by having the end of each tube telescope into a short tube section having an axial slit in one side permitting the section to expand to permit insertion of the tubes to be joined.
The frame is constructed with light weight paper or plastic tube which permits construction of various kite constructions according to the imagination of the kite flier.


A rotary positioning system includes a prime movement device having a plurality of windings spatially distributed to cause a rotor to assume, upon commanded energization of the windings, different ones of discrete angular positions. The system also includes a temperature variable power supply which compensates for the rotor's temperature-dependent variation in damping.

This invention relates to rotary positioning devices of the type wherein a shaft can be commanded to rotate to any one of a predetermined number of fixed angular positions. In the preferred application, the invention relates to electromagnetic wheel indicators of the type having symbols marked upon the drum of a rotor that can turn to bring any of the symbols to a display station.
In typical electromagnetic wheel indicators, the angular orientation of a permanent magnet rotor is governed by an electromagnetic stator which is capable of establishing, upon receiving appropriate command signals, any one of a plurality of differently oriented magnetic fields. As the stator field is changed to a new orientation, the rotor appropriately realigns itself therewith and thus the rotor is capable of assuming any one of a plurality of discrete angular positions. Typically, attached to the rotor is a symbol-bearing wheel and at each particular rotor angle position a particular symbol registers in a display station. Such devices are well known and understood in the art. See for instance U.S. Pat. Nos. 3,411,155, 3,636,557, and 3,636,550.
A common problem with such devices is that of performance variation with temperature changes. More specifically, such devices frequently provide sluggish or overdamped response at cold temperatures while providing underdamped response at room or higher temperatures. Previous attempts to solve such problem have included adjustments in lubricant viscosity and/or adjustments and magnetic strength.

Temperature compensated rotary positioner


According to one embodiment, a content reproducing apparatus includes a wireless communication unit which performs wireless communication with a plurality of wireless communication apparatuses, a reproducing unit which reproduces streaming data received by the wireless communication unit depending on a predetermined reproducing order, and a control unit which starts a communication connection process between the wireless communication apparatus which stores streaming data to be reproduced next in the reproducing order and the wireless communication unit at a predetermined period of time before reproduction end prediction time of the streaming data which is being reproduced by the reproducing unit.

1. Field
One embodiment of the invention relates to a content reproducing apparatus which acquires content data such as audio data or video data by wireless communication to reproduce the content data and a communication method for the content reproducing apparatus.
2. Description of the Related Art
As is well known, in recent years, along with the popularization of a wireless communication technique and a digital processing technique, a system which transmits streaming data such as audio data and video data by wireless communication is increasingly demanded. For example, there is a system which performs communication with a plurality of wireless communication apparatuses by wireless communication such as Bluetooth (registered trademark) to acquire audio data by streaming and causes a user to hear the content with wireless headphones.
Jpn. Pat. Appln. KOKAI Publication No. 2005-39432 discloses a technique related to a reproducing apparatus with a communication function wherein packet reproducing time is calculated from an entire reproducing time of content data and a current reproducing elapsed time, the reproducing time and the entire reproducing time are compared with each other to measure an elapsed time, and, when the elapsed time runs out, streaming communication from a wireless communication apparatus is ended.
However, in the technique described in Jpn. Pat. Appln. KOKAI Publication No. 2005-39432, the streaming communication is ended depending predicted end time in streaming communication with one wireless communication apparatus. For this reason, when a plurality of content data items stored in a plurality of wireless communication apparatuses are to be sequentially acquired/reproduced, in particular, a long time is taken to start communication with a new wireless communication apparatus. As a result, a time in which reproduction of content data such as music is impossible may occur at a start of communication with a new wireless communication apparatus. This may interrupt continuous reproduction of the content data to generate a long silent interval, so that the convenience of a user may be spoiled.

Content reproducing apparatus and communication method therefor


Anti-rotation keys are typically used in applications where an end of a threaded stud is received in a housing, and where the opposite end of the stud projects from the housing to allow attachment of another component to the housing. Once partially received in the housing, further rotation of the stud is prevented by an anti-rotation key. The disclosed anti-rotation key is self-retaining, in that it prevents itself from “backing out” of the channel due to vibration or thermal expansion of the housing, etc., while also being removable from the channel if desired.

This disclosure relates to an anti-rotation key, and in particular to a self-retaining anti-rotation key.
Anti-rotation keys are typically used in applications, such as fastener assemblies, where an end of a threaded stud is received in a housing, and where the opposite end of the stud projects from the housing to allow attachment of another component to the housing. Once partially received in the housing, further rotation of the stud is prevented by an anti-rotation key.


A device which measures the mutual coherence function of a laser beam. The device includes: a screen 1 in which openings 3 to 11 are disposed on the path of the beam 2 and allow pencils of light 19, 29 and 34 to pass; an interferometer constituted by an optical plate 13, a dihedron 14 and a mirror 21; a phase modulator 22 disposed on a branch of the interferometer; receivers 23 to 27 which receive the pencils of light 20 and 33 which emerge from the interferometer; and a processing circuit 36. Application to the analysis of a laser beam.

It is known that the coherence of a laser beam is currently evaluated by measuring the proportion of energy of the beam which is inside a cone whose apex angle is called the angle of divergence.
But this measurement takes into account only the spatial divergence of the beam and it appears insufficient to study in particular the propagation of a laser beam.
A mutual coherence function of a laser beam has therefore been defined, said function characterizing in particular the time coherence of the beam, i.e. the perturbations and the fluctuations of the phase of the laser wave. This definition is set forth in chapter 10, paragraph 3, pages 499 to 505 of the book "Principles of Optics" By Max Born and Emil Wolf (published by Pergamon in 1964--Second revised edition).
The present invention aims to measure the time coherence of a laser beam.

Device which measures the mutual coherence function of a laser beam


A rack for supporting recording media adjacent to a wall surface is provided. The inventive device includes a first vertical member and a second vertical member securable to a wall surface. A plurality of shelf assemblies extend between the vertical assemblies for receiving and supporting recording media relative to the wall surface. Adjustment assemblies couple each of the shelf assemblies to the vertical members and permit angular adjustment of the shelf assembly about a horizontal axis extending orthogonally through the vertical members so as to position an upper rear corner of the recording media against the wall surface to which the device is attached.

1. Field of the Invention
The present invention relates to shelf structures and more particularly pertains to a rack for supporting recording media adjacent to a wail surface.
2. Description of the Prior Art
The use of shelf structures is known in the prior art. More specifically, shelf structures heretofore devised and utilized are known to consist basically of familiar, expected and obvious structural configurations, notwithstanding the myriad of designs encompassed by the crowded prior art which have been developed for the fulfillment of countless objectives and requirements.
Known prior art shelf structures include U.S. Pat. No. 5,211,292; U.S. Pat. No. 5,031,780; U.S. Pat. No. 4,971,206; U.S. Pat. No. 4,650,080; and U.S. Pat. No. 4,573,588.
While these devices fulfill their respective, particular objectives and requirements, the aforementioned patents do not disclose a rack for supporting recording media adjacent to a wall surface which includes a first vertical member and a second vertical member securable to a wall surface, a plurality of shelf assemblies extending between the vertical assemblies for receiving and supporting recording media relative to the wall surface, and adjustment assemblies couple each of the shelf assemblies to the vertical members and permit angular adjustment of the shelf assembly about a horizontal axis extending orthogonally through the vertical members so as to position an upper rear corner of the recording media against the wall surface to which the device is attached.
In these respects, the adjustable angle wall mounted rack according to the present invention substantially departs from the conventional concepts and designs of the prior art, and in so doing provides an apparatus primarily developed for the purpose of supporting recording media adjacent to a wall surface.


A gas generator and process for converting a fuel into an oxygen-depleted gas and/or hydrogen-enriched gas. The gas generator is preferably used for generating protection gas or reducing gas for start up, shut down or emergency shut down of a SOFC or SOEC. The process for converting fuel into oxygen-depleted gas and/or a hydrogen-enriched gas includes combusting the fuel in a primary catalytic burner with an oxygen-containing gas to produce a flue gas with oxygen, combusting or partially oxidizing the flue gas comprising oxygen with excess fuel in a secondary catalytic burner to produce a gas with hydrogen and carbon monoxide, and reducing the trace amounts of oxygen from the gas comprising traces of oxygen and obtaining an oxygen-depleted gas, or reducing the carbon monoxide present in the gas by conversion to carbon dioxide or methane to obtain a hydrogen-enriched gas.

Fuel cells directly convert chemical energy of a fuel into electricity. Recent development is directed to improving the performance of SOFCs because these fuel cells are able to convert a wide variety of fuels with a high efficiency.
A single SOFC comprises a solid oxide dense electrolyte sandwiched between an anode (fuel electrode) and a cathode (oxygen electrode), said anode and cathode each having fine pores or channels for supplying the reactants. Upon passing an oxygen-containing gas such as air along the cathode, the oxygen molecules contact the cathode/electrolyte interface where they are electrochemically reduced to oxygen ions. These ions diffuse into the electrolyte material and migrate towards the anode where they electrochemically oxidize the fuel at the anode/electrolyte interface. The electrochemical reactions within the fuel cell provide electricity for an external circuit. The fuel cell may further comprise a support having fine pores or channels, which enable the controlled distribution of the fuel. A plurality of SOFCs may be connected in series via interconnects to form a so-called "SOFC stack".
A SOFC may be operated reverse, i.e., as an electrolysis cell (SOEC), which directly converts electricity into chemical energy of a fuel. For example, the electrochemical decomposition of steam leads to hydrogen and oxygen, or the electrochemical decomposition of carbon dioxide leads to carbon monoxide and oxygen. This means that the electrolysis of a mixture of steam and carbon dioxide leads to a mixture of hydrogen and carbon monoxide (syngas), which in turn can be converted into fuels such as methanol or dimethyl ether (DME) using well-known process technologies. SOECs have the potential of efficiently converting renewable energies such as wind energy, photovoltaic energy or hydropower. Recent developments are directed to reversible solid oxide cells (SOCs), which may be used both as SOFC and SOEC.
The anode and the cathode of a SOFC are made from materials having electrical conductivity but no ion conductivity, whereas the electrolyte thereof is made from a material having ion conductivity but no electrical conductivity.
Suitable materials for the cathode, the electrolyte, and the anode of a SOFC are known in the art (see, for example, U.S. Pat. No. 7,498,095 and WO-A-01/43524). A commonly used cathode material is lanthanum strontium manganite (LSM), a cermet such as yttria stabilized zirconia (YSZ), or a composite thereof. The anode material is generally a cermet such as YSZ. If hydrogen is used as the fuel it is electrochemically oxidized by the oxygen ions at the anode/electrolyte interface. In case a hydrocarbon such as methane is to be used as the fuel, a reforming catalyst such as nickel is added to the anode material. The catalyst assists in converting the fuel into hydrogen, known as internal reforming. The solid oxide electrolyte material is generally a ceramic material such as YSZ, which exhibits sufficient ion conductivity only at high temperatures. Therefore, a SOFC has to be operated at an elevated temperature (usually at least 300° C.) in order to achieve a high current density and power output.
An anode comprising a reforming catalyst is not resistant to oxygen while the SOFC is warmed up to above a certain temperature, i.e., about 200° C. Oxygen at elevated temperatures can damage the anode reforming catalyst due to low redox stability. Therefore, the SOFC stack must be protected against an oxidizing gas during start up and shut down.
WO-A-2008/001119 discloses the use of a blanket gas based on an inert gas during shut down of a SOFC stack. This publication further discloses the use of a catalytic partial oxidation reactor to produce reducing gas, which comprises carbon monoxide and hydrogen, in order to protect a SOFC stack against an oxidizing gas during start up and shut down.
One advantage of reducing gas is that only anode channels need to be purged while air on the cathode side can be used for heating up or cooling down during start up and shut down, respectively. Hydrogen can basically protect nickel particles of the anode surface to react with oxygen ions, which may be transferred from the cathode to the anode via the electrolyte.
However, reducing gas has two major drawbacks. First, hydrogen and carbon monoxide cannot be purged into the atmosphere. The catalytic burner of a SOFC system needs to be operated during start up and shut down of the fuel cell to burn the toxic and explosive gases. This may cause several difficulties regarding the process operability and safety.
Second, carbon monoxide at low temperatures (usually less than 300° C.) may react with nickel nano-particles on the anode surface and on the pre-reforming/reforming catalyst, which leads to the formation of nickel carbonyl (Ni(CO)4; boiling point 43° C.). Nickel carbonyl is highly volatile and extremely toxic. Even a low concentration of this compound in the air can be fatal (LC50=3 ppm). Moreover, nickel carbonyl may be thermally decomposed inside the catalytic burner, which leads to a deactivation of the catalyst.
On the other hand, protection gas can be easily purged into the atmosphere and has no interaction with catalyst and fuel cell materials. However, it cannot protect the reforming catalyst at the anode surface against oxygen ions, which may diffuse through the solid electrolyte from the cathode side. This problem is more serious at high temperatures close to the operating temperature of the fuel cell where the ion conductivity of the electrolyte is high.
Therefore, protection gas may be used when the SOFC stack temperature is below 300° C. while the catalytic burner may not be operating. Normally, above this temperature, the catalytic burner temperature in the system is beyond the minimum operating temperature; therefore, reducing gas can be used to protect the SOFC stack. Since the reducing gas has a low carbon monoxide content, there is less chance for carbon formation.
The above-described problems also arise during start up and shut down of a SOEC.

Gas generator and processes for the conversion of a fuel into an oxygen-depleted gas and/or hydrogen-enriched gas


A nuclear medicine (NM) multi-head imaging system is provided that includes a gantry, plural detector units mounted to the gantry, and at least one processor. Each detector unit defines a detector unit position and corresponding view oriented toward a center of the bore, and is configured to acquire imaging information over a sweep range. The at least one processor is operably coupled to at least one of the detector units, and is configured to acquire, via the detector units, imaging information. The imaging information includes focused imaging information corresponding to a focused region and background imaging information corresponding to surrounding tissue of the focused region. The at least one processor is also configured to reconstruct an image using the focused imaging information and the background imaging information using a first reconstruction technique for the focused imaging information and a different, second reconstruction technique for the background imaging information.

The subject matter disclosed herein relates generally to medical imaging systems, and more particularly to radiation detection systems.
In nuclear medicine (NM) imaging, such as single photon emission computed tomography (SPECT) or positron emission tomography (PET) imaging, radiopharmaceuticals are administered internally to a patient. Detectors (e.g., gamma cameras), typically installed on a gantry, capture the radiation emitted by the radiopharmaceuticals and this information is used, by a computer, to form images. The NM images primarily show physiological function of, for example, the patient or a portion of the patient being imaged.
An NM imaging system may be configured as a multi-head imaging system having several individual detectors distributed about the gantry. Each detector may pivot or sweep to provide a range over which the detector may acquire information that is larger than a stationary field of view of the detector. Focus-based acquisition may improve image quality in a focused region, but image quality in an out-of-focus region may be significantly degraded, which may pose problems in clinical protocols that use both regions for clinical analysis and diagnosis.

Systems and methods for image quality enhancement for out of focus regions for multi-head camera


When manufacturing a functional film to be formed by using a plasma CVD method while transporting an elongated substrate in a longitudinal direction, an object is to provide a manufacturing method which can prevent a product or the inside of a film forming system from being contaminated during the exposure to air after the film forming is stopped, and can improve productivity and a product quality. The object is achieved by introducing a gas for the exposure to the air into the film forming system after hindering a surface of a film forming electrode from coming into contact with the air inside the film forming system.

1. Field of the Invention
The present invention relates to a manufacturing method of a functional film such as a gas barrier film by forming a film using a plasma CVD method while transporting an elongated substrate in the longitudinal direction.
2. Description of the Related Art
Various types of devices such as an optical element, a display device of a liquid crystal display or an organic EL display, a semiconductor device, and a thin film solar cell have adopted various types of functional films (functional sheet) such as optical films of a gas barrier film, a protective film, an optical filter and an anti-reflection film.
The plasma CVD method has been used in manufacturing these functional films.
In addition, without being limited to the plasma CVD method, in order to efficiently form a film while ensuring high productivity, it is preferable to continuously form the film while transporting an elongated substrate (web-shaped substrate) in the longitudinal direction.
As a device for implementing such a film forming method, a so-called Roll to Roll (hereinafter, referred to as R to R) film forming device has been known which feeds a substrate from a substrate roll formed by winding the elongated substrate in a roll shape and winds the film formed substrate in a roll shape.
The R to R film forming device feeds the elongated substrate along a predetermined transportation route from the substrate roll to a winding shaft (passing the substrate to a predetermined transportation route) in a predetermined route including a film forming position, synchronizes feeding of the substrate from the substrate roll with winding of the film formed substrate by using the winding shaft, and continuously forms the film on the substrate transported in the longitudinal direction at the film forming position.
As is well known, the plasma CVD (capacity coupled plasma CVD) method is to generate a plasma and form the film in such a manner that an electrode pair configured to have a film forming electrode and a counter electrode is formed by interposing the film forming substrate therebetween, a film forming gas (process gas) is supplied to across the electrode pair, and a high frequency power is supplied to the film forming electrode.
Here, in the film forming by using the plasma CVD (film forming by using the vapor phase deposition) method, in the film forming system, the film may adhere to or may be deposited on various areas other than the substrate. In particular, a large amount of the film may adhere to a surface of the film forming electrode (opposing surface to the counter electrode (substrate)).
In a general single wafer processing type (batch type) film forming device which sequentially takes in and out the film forming substrate (processing substrate), if the film forming is completed, a cleaning gas is introduced into the film forming system instead of the film forming gas to remove the film adhering to the film forming electrode.
However, in order to improve productivity, the R to R device which continuously performs the film forming for a long period of time may result in the film forming electrode on which a very large amount of the film is deposited. Therefore, it requires a lot of time to remove the film adhering to the film forming electrode by using the cleaning gas, thereby causing significantly lowered productivity.
Therefore, in the R to R device, in order to quickly perform the cleaning (purification) on the film forming electrode, a method has been considered which removes the film forming electrode and parts to replace them with a new film forming electrode and the like (cleaned film forming electrode and the like), and externally cleans the film forming electrode on which the film is deposited.


An apparatus for displaying a flag on a vehicle while the vehicle moves at a high speed includes a first suction cup assembly adapted to be releasably secured to the vehicle, a second suction cup assembly adapted to be releasably secured to the vehicle, a first attachment device secured to the first suction cup assembly, a second attachment device secured to the second suction cup assembly, and a flag pole secured, at a first location along the flag pole, to the first attachment device and secured, at a second location along the flag pole, to the second attachment device, wherein the first location is spaced apart from the second location.

Flag holders are configured to secure a flag relative to an object. Generally, the flag holder is attached to the object and one or more flags are coupled to the flag holder. When the object is a movable object, such as a vehicle, maintaining the attachment between the flag holder and the movable object, when moving, can be difficult due to the pull-off forces, acting on the flag holder, primarily caused by the drag of the flag.
A wide variety of flag holders for vehicles exist, mostly for displaying flags or banners at low or negligible speeds. Some of these holders simply involve engaging a shaft to a vehicle window for a small flag, such as is disclosed by U.S. Pat. No. 6,010,107. Other flag holders employ some type of strap or suction cup design for small flags, such as those disclosed by U.S. Pat. Nos. 5,042,418, 5,483,916, and 7,878,139.
Small flags, which may be able to remain mounted to an automobile at highway speeds, are not likely to be seen or read by others who are also travelling at highway speeds. A large banner holder system has been devised for displaying a banner on the top of a vehicle, as shown in U.S. Patent Application Publication No. 2005/0066558 A1, but is not practical because it is large and unwieldly. It is also likely to generate major wind resistance at high speeds, which it would not be able to withstand. Consequently, there is a need to develop a device for enabling a vehicle to visibly and safely display large flags at high speeds.


An apparatus for preventing the self-excited vibration of a static pressure bearing device includes a movable bed and a porous pad. The movable bed is noncontactly supported by the static pressure of pressurized fluid spouted from the porous pad toward the surface of a fixed bed. The porous pad is designed such that the natural frequency of a vibration system including the movable bed is regulated so that among the fluctuation components of the static pressure when the dimension of a bearing gap varies periodically, a periodic fluctuation component having a phase delay of 90.degree. relative to a decrease in the dimension of the bearing gap may be positive and of a frequency equal to the aforementioned natural frequency.

1. Field of the Invention
This invention relates to a static pressure bearing device for use in an XY stage of a semiconductor exposing apparatus, or the positioning stages of a precision machine tool and a precision measuring machine or the like.
2. Related Background Art
The XY stage of a semiconductor exposing apparatus and the positioning stages of a precision machine tool and a precision measuring machine or the like require highly accurate positioning and for this purpose, use is made of a static pressure bearing device for noncontactly supporting or guiding the XY stage or the positioning stage relative to a bed plate or the like.
The bearing characteristic of static pressure bearing devices greatly differ depending on the type of restrictor spouting pressurized gas used, and particularly, the frequency characteristic of the pressure fluctuation of a bearing gap when vibration in the XY stage or the positioning stage is generated is substantially constant in a static pressure bearing device of the conventional surface restrictor type or the orifice restrictor type, and the rigidity or the like thereof is not greatly varied by the vibration of the XY stage or the positioning stage. However, a static pressure bearing device of the porous restrictor type, as compared with the surface restrictor type or the orifice restrictor type, has the advantage that high bearing rigidity is obtained even if the amount of supply of pressurized fluid is small, while bearing rigidity may be remarkably reduced or the static pressure bearing device may cause self-excited vibration when vibration is generated in the positioning stage or the XY stage.
FIGS. 10 and 11 of the accompanying drawings are graphs obtained by measuring the pressure fluctuation of gas in the bearing gap of a static pressure bearing device of the porous restrictor type when the dimension of the bearing gap varies periodically, detecting a pressure fluctuation component (hereinafter referred to as the "Re component") of the same phase as the periodical reduction in the dimension of the bearing gap and a pressure fluctuation component (hereinafter referred to as the "Im component") having a phase delay of 90.degree. relative thereto, and obtaining the frequency characteristics of these components. As can be seen from these figures, when for example, the natural frequency of the XY stage or the positioning stage is 150-160 Hz, the Im component is of a negative value and therefore, self-excited vibration as shown in FIG. 12 of the accompanying drawings is generated and as a result, the positioning accuracy of the XY stage or the positioning stage may be remarkably reduced, and the apparatus may be damaged by increasing vibration.
Accordingly, by using a static pressure bearing device of the porous restrictor type in which a predetermined amount of clogging is generated in advance to thereby vary the bearing characteristic or severely restrict permeability or transmittance of porous material, it is contrived to prevent the self-excited vibration of the static pressure bearing device of the porous restrictor type.


A semiconductor device is disclosed which improves the breakdown voltage of a planar-type junction edge terminating structure. The device includes an n-type semiconductor substrate layer common to an active section and an edge terminating section. An n-type drift region is formed selectively on the n-type semiconductor substrate layer in the active section and a p-type partition region is formed selectively on the n-type semiconductor substrate layer in the active section. A p-type base/body region is formed on the n-type drift region and the partition region. A source electrode is connected electrically to the p-type base/body region. A p-type partition region is formed in the edge terminating section between the p-type base/body region and the scribe plane of the semiconductor device such that the p-type partition region in the edge terminating section surrounds the p-type base/body region. A drain electrode is connected electrically to the n-type semiconductor substrate layer.

A. Field of the Invention
The present invention relates to semiconductor devices and the method of manufacturing the semiconductor devices. Specifically, the invention relates to power semiconductor devices such as a diode, an insulated gate field effect transistor having a metal-insulator-semiconductor structure (hereinafter referred to as a "MISFET"), and an insulated gate bipolar transistor (hereinafter referred to as an "IGBT") which include a specific edge terminating structure disposed therein.
B. Description of the Related Art
Generally, many pieces of a semiconductor device such as a diode, a MISFET, and an IGBT are formed in a semiconductor wafer. Many power semiconductor devices employ a planar-type junction edge terminating structure. Since the section that has the planar-type junction edge terminating structure includes a portion, in which equipotential surfaces curve sharply, electric field localization is caused more easily in the section having the planar-type junction edge terminating structure than on the flat junction in the active section of the semiconductor devices. (Hereinafter, the section having an edge terminating structure will be referred to as the "edge terminating section.")
Once a high-electric-field portion is caused in the edge terminating section, the electric field strength reaches the critical value, which causes breakdown, faster in the edge terminating section than in the active section. Therefore, breakdown is caused at a voltage lower than the designed breakdown voltage. To obviate this problem, a floating guard ring structure, a field plate structure, a reduced-surface-electric-field structure (hereinafter referred to as a "RESURF structure"), and appropriate combinations of these structures are employed for the planar-type junction edge terminating structure to secure the designed breakdown voltage (cf. Publication of Unexamined Japanese Patent Application Hei. 2 (1990)-22869 (Counterpart U.S. Pat. No. 4,904,609, Counterpart U.S. Pat. No. 4,999,684) and Publication of Unexamined Japanese Patent Application 2001-85727).
Super-junction semiconductor devices, which include an alternating conductivity type layer including p-type partition regions and n-type drift regions arranged alternately (hereinafter referred to as a "super-junction layer) and extended into the edge terminating section, have been known to the ordinary skilled person in the art (cf. Publication of Unexamined Japanese Patent Application 2004-319732 (Counterpart U.S. Pat. No. 6,849,900) and Publication of Unexamined Japanese Patent Application 2003-115589). In the semiconductor devices described in these two documents, the super-junction layer in the edge terminating section has a structure that facilitates keeping charge valance between the p-type partition regions and the n-type drift regions. Alternatively, the edge terminating section includes an additional semiconductor layer, the conductivity type thereof is the same with the conductivity type of the drift layer, and any of a floating guard ring structure, a field plate structure, and a RESURF structure formed on the additional semiconductor layer.
A super-junction semiconductor device, which includes an insulator region around the active section including a super-junction layer and sustains the breakdown voltage with the insulator region, has been known to the ordinary skilled person in the art (cf. Publication of Unexamined Japanese Patent Application 2001-244461).
The super-junction semiconductor device is a semiconductor device in which the drift layer is neither uniform nor of one conductivity type but comprised instead of semiconductor regions of a first conductivity type (e.g., n-type drift regions) and semiconductor regions of a second conductivity type (e.g., p-type partition regions) laminated alternately.
However, in many semiconductor devices, the conventional planar-type junction edge terminating structure is formed around the active section and the surface of the edge terminating structure is coplanar with the surface of the active section including a main junction that sustains the breakdown voltage. In this case, an electric field strength rise is caused by the flat pn-junction and a high-electric-field portion is caused by the electric field localization due to the existence of a portion which has a curvature on the junction plane in the edge terminating section. Due to the multiplier effect of the electric field strength rise and the resulting high-electric-field portion, the electric field strength reaches the critical value that causes breakdown faster in the edge terminating section than in the active section, causing a low breakdown voltage. Here, the main junction that sustains the breakdown voltage is a pn-junction, to which a voltage is applied in the reverse direction.
In view of the foregoing, it would be desirable to obviate the problems described above. It would be also desirable to provide a semiconductor device that improves the breakdown voltage of the junction edge terminating structure. It would be further desirable to provide a method of manufacturing the semiconductor device that improves the breakdown voltage of the junction edge terminating structure.
The present invention is directed to overcoming or at least reducing the effects of one or more of the problems set forth above.

Semiconductor device having improved breakdown voltage and method of manufacturing the same


A load-hauling device includes a pair of karabiners, each having an array of pulleys, a pulley rope fixed at one end to one of the karabiners below its respective pulley array, to anchor that end of the rope, the pulley rope passing sequentially between the pulleys of each pulley array to provide a mechanical advantage at the free end of the pulley rope when pulled, a rotatable locking cam mounted between a cam yoke fixed around an end pulley of one of the pulley arrays, wherein the cam includes a cam spring to bias the cam to engage with the rope and permit movement of the rope in one direction while preventing movement of the rope in the other direction, the cam including an integral trigger and locking mechanism to selectively disengage the cam from the rope and allow the device to release a load carried thereby.

It is well known that rope pulley systems are useful in providing a mechanical advantage for lifting or lowering a load, the magnitude of the mechanical advantage typically being a function of the number and/or diametric size of each pulley wheel so that relatively heavy loads can be lifted or lowered by a single person pulling or releasing by hand the pulley rope. Thus, a typical rescue pulley system can easily support the weight of an accident victim and the rescuer during the rescue operation, often with a mechanical advantage in terms of force applied to or released from the pulley rope of 5 or 6 to one.
Many pulley rescue systems are known which are particularly suitable for so called self-rescuing, such as is described in DE202013003344, although they are not usually suitable for e.g. accident victims who are unconscious or otherwise disabled. In such circumstances the pulley system has to cope with the combined weight of the rescuer and accident victim, who may be secured by a harness to a stretcher, leaving the rescuer with the task of single-handedly raising or lowering the victim from a secure position up to the fully extended limit of the pulley system, and thereafter repositioning the pulley system for the next phase of the rescue. This requires the rescuer to pull on the free end of the pulley rope in order to raise or lower the entire load carried by the pulley system, and then to reposition anchors such as 'rope grabs' sufficiently securely for the next phase of safely raising or lowering the combined load. In order to do this, the pulley system must be restrained from running in the opposite direction required of the rescuer, this usually being achieved by means of a one-way brake system permitting the pulley rope to travel in one direction only during the lifting stage of the rescue whilst permitting controlled decent of the combined load being carried by the pulley system, as required. Such rope braking and rope releasing mechanisms can be complicated to operate by the rescuer, more particularly when in extreme circumstances, such as in confined spaces or within complex steel structures.
The present invention is derived from the realisation that there is a need for a simpler system of engaging or disengaging, as the case may be, the pulley rope brake from the pulley system.

Pulley systems for hauling or lowering loads


Subscriber units operating within a communication system are selectively addressed and required to solve a "Puzzle" generated by a central device (controller) of a two-way communication system. The "Puzzle" comprises one or more digital words and an operand, which provides instructions to the subscriber unit as to how to generate an answer. The subscriber units cannot anticipate either the occurrence nor the content of a particular "Puzzle". All subscriber units (both authorized and unauthorized) must return an answer to the "Puzzle" or they may be denied access to the two-way communication system. Also, unauthorized subscriber units may be detected when the central device receives multiple answers to a "Puzzle".

Password controlled systems are known. In such systems, access to a resource (such as a central computer) is denied unless a predetermined code (password) is initially provided.
In a two-way communication system, subscribers each have an identification (ID) code, which may be analogized to a simple password control mechanism. Whenever a subscriber desires to communicate, a request (which includes the ID code) may be transmitted to a central location. If the subscriber is authorized (i.e., the ID code is recognized by the system) communication is permitted. Unauthorized (unrecognized) subscribers are denied access to the communication resources. For example, operators of Specialized Mobile Radio (SMR) systems provide a communication service to their subscribers in return for a basic monthly rate (which may also include a variable charge depending upon the amount of "air time" used by each subscriber). Each subscriber is billed for each ID code that the system is programmed to recognize. Generally, each subscriber has unlimited access to the SMR system so long as the service bills are paid.
The need for the present invention grew out of the realization by some SMR operators that some of the subscribers are duplicating (or permitting others to duplicate) the memory device that contains the ID code, and installing the duplicated devices in several radios. In this way, the basic monthly fee per unit is avoided since several subscribers now have the "same" ID code. The loss of revenue to the SMR operators is both significant and growing. Although legal recourse may be available, it is both time consuming and costly. Typically, the SMR operator has invested hundreds of thousands of dollars to provide the communication service, and the additional cost and burden of policing the system may be intolerable.
From the above discussion, it will be apparent that conventional password systems are completely unsuited to address this problem. The fundamental problem with simple password systems is that they presuppose that a subscriber desires to maintain the password in secrecy, thereby assisting in the effort to control who has access to the resource. Accordingly, the addition of a separate password (perhaps entered on a keypad of a radio) would be fruitless since this password could be easily disseminated by those who currently duplicate the ID codes. Further, requiring individuals to enter a password prior to requesting a communication channel goes against the custom and practice of the communication industry, and may be overly burdensome to the subscribers. Thus, a need exists to provide a method for allowing easy access to a communication system, while still providing protection to the operators of such communication systems.

Method and apparatus for controlling access to a communication system


A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the dice with the temporary test package bases, and an automated robot arm system is employed to retrieve and assemble the dice with the various package components. The invention has particular utility in the burn-in and other pre-packaging testing of dice to establish known good dice (KGD).

1. Field of the Invention
The present invention relates generally to computer-aided methods and systems for manufacturing products in a high volume, automated, continuous process and, more particularly, to improved methods and apparatus for automated retrieval, alignment, placement and securement of singulated bare semiconductor dice within preformed packages for testing and burn-in, followed by optional subsequent removal of the dice from the packages.
2. State of the Art
Integrated circuit devices are well-known in the prior art. Such devices, or so-called "dice," may include a large number of active semiconductor components (such as diodes, transistors) in combination with (e.g., in one or more circuits with) various passive components (such as capacitors, resistors), all residing on a "chip" or die of silicon or, less typically, gallium arsenide. The combination of components results in a semiconductor or integrated circuit die which performs one or more specific functions, such as a microprocessor die or a memory die, as exemplified by ROM, PROM, EPROM, EEPROM, DRAM and SRAM.
Such dice are normally designed to be supported or carried in a package having a plurality of externally-accessible pins or leads, to which terminals such as bond pads on the die are electrically connected within the package to access other electronic components employed in combination with the die. A package provides mechanical support and protection for the die, may serve as a heat sink, and is normally square or rectangular in shape. The packages typically comprise a filled polymer compound transfer molded about a die, wire-bonded or otherwise electrically connected, and physically supported by a lead frame structure, or a two-piece preformed ceramic package to which the die is physically and electrically connected before the package lid is secured. Metal packages are also used, although generally in small quantities and for so-called "military spec" applications.
Packaging defective dice or unknown bad dice (UBD) which are packaged, tested and then scrapped after proven defective in post-packaging testing is inefficient and costly. Accordingly, the bare dice are often tested for continuity during the die fabrication process and before packaging. Such testing may be and has been accomplished by placing bare die in temporary packages having terminals aligned with the terminals (bond pads) of the die to provide electrical access to the devices on the die and subjecting the die via the assembled package to extensive testing, which includes burn-in and discrete testing. Exemplary state-of-the-art fixtures and temporary packages for die testing are disclosed in U.S. Pat. Nos. 5,367,253 and 5,519,332 (to some of the inventors named herein); U.S. Pat. Nos. 5,448,165; 5,475,317; 5,468,157; 5,468,158; 5,483,174; 5,451,165; 5,479,105; 5,088,190; and 5,073,117. U.S. Pat. Nos. 5,367,253 and 5,519,332, assigned to the assignee of the present application, are each hereby incorporated herein for all purposes by this reference.
Discrete testing includes testing the die devices for speed and for errors which may occur after fabrication and after burn-in. Burn-in testing is conducted at elevated potentials and for a prolonged period of time, typically 24 hours, at varying and reduced and elevated temperatures such as -15.degree. C. to 125.degree. C. to accelerate failure mechanisms such that die devices which have the potential to prematurely fail during normal operation can be identified and eliminated. Dice which survive discrete testing and burn-in are termed "known good die," or KGD.
Failure of one die on a multi-chip module (MCM), including a so-called single in-line memory module (SIMM), compromises performance of the entire module or, if identified after assembly but before shipment to the customer, at the least initiates a relatively costly and time-consuming rework process to replace the bad die if the entire MCM is not to be scrapped. Even if individual die yield is relatively high, the combination of such dice in an MCM, nonetheless, produces an abysmal module yield. For example, if a particular MCM design includes twenty (20) dice with an average "good die" yield rate of 97.3%, the overall yield rate would be predicted to be a dismal 57.3%, which is not commercially viable. Moreover, subjecting the printed circuit or other die carrier of the MCM to burn-in may not be desirable as causing unnecessary stress on elements of the MCM other than the die. Therefore, employing KGD in an MCM is perceived as an optimum way to fabricate high-reliability multi-die products.
However, while desirable, testing bare, unpackaged dice requires a significant amount of handling. The temporary package must not only be compatible with test and burn-in procedures, but must also physically secure and electrically access the die without damaging the die at the bond pads or elsewhere. Similarly, assembly of the die with the package and disassembly after testing must be effected without die damage. The small size of the die itself and minute pitch (spacing) of the bond pads of the die, as well as the fragile nature of the thin bond pads and protective layer covering devices and circuit elements on the active surface of the die, makes a somewhat complex task extremely delicate. Performing these operations at high speeds with requisite accuracy and repeatability has proven beyond the capabilities of the state of the art.
Bond pads are discrete conductive areas on the active face of the die which are used for connecting the internal die circuitry to the conductors of the package. Accurate positioning of the die within the temporary package is therefore critical since alignment of the die bond pads relative to the contacts of the temporary package electrical conductors must be effected in order to subject the die to testing.
Precising die packaging includes mechanically locating a component in a precise position or placement. Various "precising" methods for this purpose are known in the art. However, there have been several problems associated with such precising methods and systems. For example, it has proven difficult to position the die bond pads in electrical contact with temporary package electrical contacts in an accurate and consistent manner so as to facilitate a repeatable, high volume, continuous assembly process of dice within temporary packages. Another disadvantage associated with prior art equipment and processes is that the die is often destroyed or damaged upon contact with the temporary package, lowering product yield and profit margins. Accurate, repeatable positioning placement and securement of the die in the temporary package is thus critical to providing acceptable KGD qualification on a commercial basis.
One attempt to overcome the problems associated with the prior art has been to precise dice and packages by mechanical fixturing. However, assembly tolerances used in mechanical fixturing techniques are often insufficiently fine to prevent improper alignment. Mechanical fixturing also leads to damage of the die or temporary package. While such techniques have proven useful in improving the accuracy and reliability of the die placement, these techniques do not enable dice to be precisely positioned within temporary packages in a manner that allows production efficiencies capable of supporting large volume operations.
Other systems for alignment and, optionally, placement of various bare and packaged dice are also known in the art. See, for example, U.S. Pat. Nos. 4,526,646; 4,543,659; 4,736,437; 5,052,606; 5,059,559; 5,113,565; 5,123,823; 5,145;099; 5,238,174; 5,288,698; 5,463,227; and 5,471,310 for vision-based systems. A commercially available vision-based aligner bonder for flip chip bonding, offered by Research Devices of Piscataway, New Jersey, has also been modified by the assignee of the present invention for manual alignment of bare dice with the electrical contacts of a temporary package employed in KGD qualification. It is believed that certain aspects of the commercial Research Devices system may be disclosed in U.S. Pat. No. 4,899,921. A description of the modified Research Devices system appears in the aforementioned U.S. Pat. No. 5,519,332, assigned to the assignee of the present invention and incorporated herein for all purposes by this reference. A discussion of vision systems' potential applications in the semiconductor industry and associated problems appears in "A Vision of Vision in the Gigabit Era," SEMICONDUCTOR INTERNATIONAL, June 1993, pp. 120-122, 124.
While the foregoing mechanical and visual alignment systems, with ancillary mechanisms for die handling, have achieved some success in their intended applications, to the inventors' knowledge there exists no fully-automated bare die and package assembly and disassembly system capable of accurate and repeatable operation at a speed making KGD qualification or characterization commercially viable for use as a matter of course in the die fabrication process.
Accordingly, there remains a long-felt need in the semiconductor industry to provide for improved methods and apparatus for assembling dice to be tested with temporary packages (and subsequently disassembling the dice from the packages) in a high volume, cost-efficient and reliable manner. Toward that end, it is essential that the semiconductor or integrated circuit die be positioned and secured within the temporary packages in an automated manner such that die bond pads are aligned with and suitably biased toward temporary package electrical contacts without physical damage to the die structure.

Method and apparatus for automatically positioning electronic dice within component packages


There is provided a method for rectifying a vinyl compound liquor. The method includes the steps of a) providing a rectification column operated at a temperature and pressure and b) feeding the vinyl compound liquor to be rectified into the rectification column, wherein the pressure of the rectification column and the temperature of the fed vinyl compound liquor are controlled, such that the temperature of the fed vinyl compound liquor ranges from its bubble point at the pressure of the rectification column to 10° C. lower than the bubble point.

The vinyl compound is a kind of important chemical raw material, the polymeric characteristic of its unsaturated double bond (active vinyl) makes the vinyl compound to be used as a polymerization monomer to prepare various polymers.
The vinyl compound obtained by chemical synthesis or separation process usually contains various impurities. It is necessary to remove the impurities from the vinyl compound by rectification since they will negatively effect the sequent polymerization process.
However, the vinyl compound tends to proceed frequently undesired spontaneous polymerization under the high temperature and the high pressure during its rectification. Taking the methyl (meth)acrylate, for example, because of the α,β-unsaturated double bond (active vinyl), it has a tendency to proceed free radical polymerization, especially tends to polymerize spontaneously (i.e., spontaneous polymerization) under the effect of heat or light. Polymers formed by the spontaneous polymerization during rectification will deposit on the surface of the evaporator (because of its high temperature, the probability of forming the polymer is increased), thereby undesirably deteriorating heat transfer and clogging internals of the rectification column, causing unwanted pressure loss, and finally resulting in the stoppage of the rectification column. The interruption of the operation is unavoidable during rectifying the vinyl compound, therefore, to laboriously remove polymers formed.
In order to ensure a stable and continuous operation of the vinyl compound-rectification column for a long period of time, the prior art has developed methods for preventing clogging, such as a method of blowing a gas having a polymerization inhibiting action, or adding a sort or sorts of known polymerization inhibitors thereinto. Conventional polymerization inhibitors (hereinafter referred to as "inhibitor") include N-oxyl compounds such as tert-butyl nitroxide, 2,2,6,6-tetramethyl-4-hydroxypiperidyl-1-oxyl, 2,2,6,6-tetramethylpiperidyl-1-oxyl, 2,2,5,5-tetramethyl-1-oxyl-pyrrolidine, 2,2,6,6-tetramethylpiperidino-oxyl and 4-hydroxy-2,2,6,6-tetramethylpiperidino-oxyl; phenol compounds such as hydroquinone, methoquinone, pyrogallol, catechol and resorcin; phenothiazine compounds such as phenothiazine, 3,7-dioctyl phenothiazine and bis-(α-dimethylbenzyl)phenothiazine; and copper compounds such as cupric chloride, copper acetate, copper carbonate, copper acrylate, copper dimethyldithiocarbamate, copper diethyldithiocarbamate and copper dibutyldithiocarbamate; as well as manganese salt, etc.
Polymerization is a complex chemical reaction procedure, which usually comprises the following three steps: chain initiation, chain growth, and implosion. Firstly, the monomer produces living free radicals under the effect of light, heat, or initiator. When one of the free radicals collides with another monomer molecule, a reaction occurs, forming new free radicals that are multiples of the monomer molecules to proceed chain growth process. When the spontaneous polymerization of the monomer proceeds to a certain degree, the process stream will become viscous, the popcorn type polymers tend to be formed easily and the phenomenon of implosion is likely to be observed. The formation mechanism of popcorn type polymer is comparatively complex, any of the tiny particles in popcorn type in the raw materials, the rusts or the burrs remained on the surface of the process pipe may initiate the formation and quick propagation of the popcorn type polymer. The key for preventing the spontaneous polymerization is to control the chain propagation, which can be attained by the addition of various high efficient inhibitors. The oxygen in the air itself is not only an efficient inhibitor, but also can make the other inhibitors performing their function of preventing polymerization to the greatest extent as well.
However, even if the above methods have been used, the phenomenon of spontaneous polymerization during rectifying the vinyl compound, such as methyl (meth)acrylate, will still frequently occur, although the spontaneous polymerization has somewhat been inhibited as compared to the rectifying process without the above methods. As a result, it is difficult to ensure a stable and continuous operation of the vinyl compound-rectification column for a long period of time, needing to remove the polymer formed by the spontaneous polymerization from the rectification column periodically.
Accordingly, it is still necessity to develop a method for rectifying vinyl compound, which method is capable of preventing the vinyl compound from spontaneous polymerization during its rectification process.

Method for producing (meth)acrylic acid and (meth)acrylic esters