A device is disclosed for measuring the position (location and orientation) in the six degrees of freedom of a receiving antenna with respect to a transmitting antenna utilizing multiple frequency AC magnetic signals. The transmitting component consists of two or more transmitting antenna of known location and orientation relative to one another. The transmitting antenna are driven simultaneously by an AC excitation, with each antenna occupying one or more unique positions in the frequency spectrum. The receiving antennas measure the transmitted AC magnetic field plus distortions caused by conductive metals. A computer then extracts the distortion component and removes it from the received signals providing the correct position and orientation output to a high degree of accuracy.

The present invention relates to devices for measuring the position of receiving antennas relative to transmitting antennas using multiple frequency magnetic fields. Particularly, though not exclusively, the disclosed devices measure position in six degrees of freedom, namely motion of translation in three coordinate directions (location) and rotational motion about three coordinate axes (orientation), location being commonly defined by X, Y, and Z linear coordinates referring to three mutually perpendicular directions and orientation being commonly described by pitch, roll, and azimuth angular coordinates about three mutually perpendicular axes usually coincident with the three mutually perpendicular directions.
As used herein "position" means location and/or orientation location.
The concept of using transmitting and receiving components with electromagnetic coupling is well known in the prior art with respect to biomechanics and computerized animation, where a subject or performer wears a number or receiver components at known strategic locations on the body, typically major arm and leg bones, shoulders, spine, hands, feet, and head. This information is then used by computing systems to precisely show the relative motions of the points in question, giving a computer generated image realistic movements. When conductive materials are present, they generate eddy current fields, which distort the received magnetic field waveform, which distorts the output of the system unless the system utilizes some distortion reducing technique.
U.S. Pat. No. 4,849,692 (Blood), U.S. Pat. No. 4,945,305 (Blood), and U.S. Pat. No. 5,640,170 (Anderson) describe the use of time domain techniques to wait for the eddy current fields to decay fully. U.S. Pat. No. 5,767,669 (Hansen and Ashe) describes a system which uses time domain techniques to measure the eddy field distortion component directly and removes it from the received signal. The disadvantage of these systems is that the receivers are quite sensitive to the low frequency (under 30 Hz) error components induced in their outputs when the sense coils are rotated in the earth's magnetic field. This motion induced component can be much larger than the component of interest when transmitter to receiver distance is large, as the transmit field falls off with the cube of distance while the Earth's field remains essentially constant. Also, since these systems use sequential time division multiplexed transmitter signals, each transmitter must be energized and sufficient time must be given for the eddy components to decay or stabilize before a receiver measurement is taken. In practice this time is on the order of 2.5 mS. Since there are generally 4 distinct transmitter states consisting of sequential energization of the X, Y, and Z coils, plus one "off" interval, these systems require approximately 10 mS to acquire a sample while maintaining reasonable eddy current distortion rejection. This translates to an effective receiver sample rate Fs of 100 hertz. Since the filters on the receivers must be designed to respond to the rapidly changing transmitter signal and must not contribute to output distortion, they are typically set at a bandwidth Fp of 2 KHz. It is thus seen that the aforementioned systems inherently do not meet the Nyquist criteria, which state that a sampled system must not have frequency components present at the sampling input which exceed one half of the sampling rate if aliasing is to be avoided. External interference signals and noise between Fs and 2 Fp are thus aliased. Of particular concern are the harmonics of the power grid, which extend from 50 Hz to beyond 1 KHz. These frequency components are aliased into the passband of the system digital lowpass filters. The aliased components are quite noticeable at bandwidths of greater than 1 Hz, beyond which the output data can and does become excessively noisy in many common environments. The narrow passband required to avoid this phenomenon results in the system having a very slow response, which is unacceptable for many applications. The noise is also increased, as the ratio of Fs/2 to Fp is typically 40:1, meaning the system samples at 100 Hz while the low pass filters pass all frequency components up to 2 KHz. A system satisfying the Nyquist criteria would need to sample at 4 KHz. Since noise is proportional to the square root of bandwidth, it can be seen that, given an equivalent set of operating parameters, the time domain eddy current compensation systems will be several times noisier than a system satisfying the Nyquist sampling criteria.
The following prior art is also known to Applicant:
U.S. Pat. No. 5,168,222 (Volsin and Monin) discloses a sequentially energized transmitter producing AC magnetic fields. Such a system will not satisfy the Nyquist criteria since the individual transmitter coils must be energized for at least 2 pi/.omega. seconds as dictated by claim 1(e). Such timing results in aliasing of the received signals. This system uses an in phase (I) and quadrature (q) detection scheme at a single frequency to reduce metal distortion effects. Of special interest is the q term, whose value is influenced both by the proximity of the metal and its conductivity. A metal plate of given area, thickness, and spatial position relative to the system in question will result in a particular value of the q term which is then used to correct the error in the I term due to the eddy field of the metal. By changing the thickness or composition of this plate (e.g. from aluminum to stainless steel), a different value of position will be obtained out of this system without moving either the transmitter or receiver, since the system does not attempt to correct for variations in the q term due to conductivity variations in nearby metallic structures.
U.S. Pat. No. 5,347,289 (Elhardt) discloses a system in which the detection method is independent of the amplitude of the received signal, this characteristic being achieved by using rotating magnetic field vectors. The system computes position based on timing information derived from the sensing of the rotating field vector, formed by the summation of fields at a point in space due to the sin(.omega.t) transmit axis and the cos(.omega.t) transmit axis. Mathematically, this equation is A cos(.omega.t)-B sin(.omega.t)=sqrt(A 2+B 2)*cos(.omega.t+(tan-1 (B/A)). Since the system is concerned with the arrival of the vector at the receiver in some steady state condition, it must then also be sensitive to the steady state phase shift term given as the inverse tangent of B/A. Due to the fact that the sin(.omega.t) and cos(.omega.t) fields are not spatially co-located in both position and orientation, it is obvious that each will pass through a somewhat different region of space. If there is metal in the environment, then the received field will be distorted in amplitude by the metallic eddy currents. Since the two field components do not pass through the same space, it follows that they can and in fact do incur different amounts of eddy current distortion. This has the effect of changing the B/A ratio, and it follows that the phase term tan-1(A/B) is thus distorted. Since the timing information in the system is derived from the phase of the received field, and the phase of the received field is susceptible to distortion by metallic eddy currents, it follows that the system position output will be degraded by the presence of metal. The device described also does not correct for variations in the system response due to conductivity changes in the metal environment. Thus, changing the composition, thickness, or shape of metallic objects near the system will cause the system to output different values for position even when the receiver and transmitter positions do not change. In column 10 and FIG. 7, a system utilizing 2 frequencies is disclosed. One frequency is 11 KHz and the other 30 to 100 Hz. The low frequency component is used to provide an accurate but slow update, while the higher frequency is used to provide a less accurate but higher update rate signal. Through some undescribed methodology it appears that the goal is to combine the two outputs into one single accurate but rapid output. This system is, thus, essentially, the combination of two prior art systems using an appropriate filter to combine the two outputs into one. Such a system inherently results in nonlinearities of the output both at the beginning and end of receiver motion, as the system utilizes the more rapid but less accurate sensing means during the period of motion, but, when motion stops, must somehow transition to a different position derived from the slower but more accurate sensing means. This generally results in a period of undesirable false motion, where the position output continues to change from the less accurate value to the more accurate value during a period where the receiver is stationary.
U.S. Pat. No. 5,640,170 (Anderson) discloses a transmitter configuration using a spiral conductor pattern over a conductive ground plane in order to produce a low distortion field over the configuration. This method of reducing conductive material eddy current distortion is not related to the method disclosed in this patent.

Eddy current error-reduced AC magnetic position measurement system


A combustion method is provided for carrying out combustion with reduced generation of nitrogen oxides. The combustion method involves partially combusting a fluid fuel stream with a low velocity oxidant and thereafter mixing and combusting the resulting product with a secondary oxidant stream diluted with ambient gas. The velocity of the secondary oxidant stream is either increased to reduce the nitrogen oxides emission level or adjusted to provide the desired secondary oxidant/low velocity oxidant ratio which is useful for further decreasing the formation of nitrogen oxides. Normally, increasing the ratio and/or velocity further decreases the nitrogen oxides emission level. When liquid fuel is employed, it is atomized with atomizing fluid in such a manner to produce a liquid fuel stream having a very narrow spray angle. The production of such a stream allows the burner to be operated without water cooling. Moreover, such a stream, when combined with the above combustion method, unexpectedly provides effective and efficient combustion with reduced generation of nitrogen oxides.

Nitrogen oxides are generated in a significant amount in many combustion processes. Since nitrogen oxides are known pollutants, it is desirable to reduce their generation during the combustion. To reduce nitrogen oxides generation, an oxygen enriched air or technically pure oxygen has been used in lieu of air as the oxidant to reduce the amount of nitrogen introduced per an equivalent amount of oxygen into a combustion zone. However, the use of an oxygen enriched air or technically pure oxygen as the oxidant causes the combustion processes to be carried out at high temperature. High temperature combustion kinetically favors the formation of nitrogen oxides and adversely affects the structural life of burners, particularly non-water cooled burners.
U.S. Pat. Nos. 5,076,779 and 5,242,296 disclose combustion methods wherein the formation of nitrogen oxides is suppressed. The combustion methods include diluting an oxidant stream with furnace gases in an oxidant mixing zone to form a diluted stream and then combusting fuel in the presence of the diluted stream in a reaction zone to avoid the conditions which favor nitrogen oxide formation. The fuel may be initially subject to partial combustion in the presence of a substoichiometric amount of oxidant before it is completely combusted in the presence of the diluted stream. These methods are shown to significantly reduce generation of nitrogen oxides. However, it is desirable to further reduce the nitrogen oxides emission.
The need for effective combustion with reduced generation of nitrogen oxides is increased when liquid fuel is involved. Due to the complexities associated with liquid fuel atomization and combustion, the reduction of the nitrogen oxide emission level is difficult. If a non-water cooled burner is employed within a refractory port of the furnace wall, the ejected liquid fuel from the burner can contact the refractory port and cause soot deposition which eventually could foul the burner.
Accordingly, it is an object of the invention to effectively and efficiently combust fuel, particularly liquid fuel, with the further reduction of nitrogen oxide generation.
It is another object of the invention to combust liquid fuel with non-water cooled burners and lances without causing a significant amount of soot deposition.
It is yet another object of the invention to combust liquid fuel with reduction of the flame temperature.

Staged combustion for reducing nitrogen oxides


A silage bag filling machine for compactly loading an elongate polymer silage storage bag includes a generally horizontal chamber through which a ram reciprocates in a generally horizontal direction, forcing silage from the chamber into a frame which carries the gathered sidewall of the silage storage bag. The frame has a curved upper surface and an open bottom. The bag filling machine is supported on wheels and is forced gradually forward as the bag fills, against the restraint of an adjustable brake. An loading elevator mounted to the side of the bag filling machine feeds silage into the horizontal chamber.

The present invention pertains to the filling of elongate storage bags for silage feed for farm livestock. In the raising of livestock and particularly the raising of dairy cattle, hay and green corn are cut to a specified fiber length and are stored on the farm in silage bunkers or in lengthy large-diameter plastic silage bags which may extend for considerable length. The plastic bags are relatively thick-walled flexible bags which are available in various cross sectional areas, but generally four-foot to nine-foot diameter bags are used for silage storage. These bags are ideally filled compactly with silage allowing few air pockets so that the silage feed remains in good condition for months at a time.
Filling of the lengthy silage bags is currently accomplished by use of one of two types of machines which force silage into the bags. In one type of machine, silage is forced into the elongate storage bag by use of a transverse rotating roller which is fitted with radial arms which sweep the silage into the bag. A backstop is retained to the machine by cables attached to winches mounted on either side of the machine. The backstop is used to prevent the bag from being forced away from the machine before it is filled to proper compaction. In another type of machine, a screw auger oriented to the axis of the bag forces silage therealong into the interior of the bag. Both types of machines are typically powered from the power take off shaft of a farm tractor and require substantial power to operate.
The conventional machines require substantial power to operate them, namely at least ninety hp, and in addition, the cables which extend along the sides of the bag tend to abrade the bag, leading to breaks in the sidewall of the bag along its length, which leads to loss of the desired airtight packaging.


A hub for a bicycle, including a hub body, and a torque tube disposed in the hub body. A first mating element is disposed at a first end of the torque tube and a second mating element is disposed at a second end thereof. Each of the first mating element and the second mating element includes an anti-rotation hub feature, and the torque tube transfers torque between the first mating element and the second mating element.

This invention relates to bicycle hubs, and more particularly, to a bicycle front wheel hub. In particular, the invention relates to a bicycle front wheel hub with a torque tube.
A typical bicycle frame set has a bicycle fork for mounting a wheel to the bicycle. A typical fork has a pair of spaced apart fork legs (or at least one fork leg), each leg having a dropout at a terminal end. The dropouts have inner sides (facing each other), outer sides opposite the inner sides, and an elongated aperture formed therein to form a slot to receive a hub for a connection of the wheel to the fork. The hub of the bicycle wheel is mounted on the skewer, and thus a wheel may be mounted and fastened on the bicycle frame by inserting and fastening the skewer into the slot and on the dropout.
Significant torsion forces can be applied to the wheel and thus the fork, such as during braking, steering and from forces encountered by rough terrain, for example. One particular example of such force is generated when braking forces are applied to the wheel by a bicycle disc brake. Disc brakes have typically been used in off-road and racing applications, both downhill and cross-country. Disc brakes include a brake disc mounted on the hub adjacent the center of the wheel and a brake pad mounted adjacent the brake disc. The brake pad engages the brake disc to slow down rotation of the bicycle wheel.
Due to the forces that arise when the disc brake is applied to slow rotation of the bicycle wheel, forces generated by disc brakes can induce a twisting torque which can be detrimental to steering precision.
Bicycles with suspension forks, and in particular telescopic upside down (USD) forks (with stanchions at the bottom) are particularly prone to suffering twisting forces due to steering, braking and operation off-road, for example. This is due to the fact that the USD fork stanchions are only connected through the hub. Typical bicycle hubs have internal rotational connections between the left mounting surface and the right mounting surface which can allow both fork legs of a USD fork to flex and rotate independently—a tendency if minimized improves the functioning of the fork.
There is a demand, therefore, to provide a bicycle with a structure or mechanism that prevents or reduces the effects of torsion forces. The invention satisfies the demand.

Bicycle front wheel hub with torque tube


A method is provided for tracking at least one use of at least one piece of multimedia content on a terminal connected to a communication network. The piece of content is transmitted to the terminal in the form of at least one description file generated according to a predetermined description format. The method includes using the piece of content by a user of the terminal, including activation of at least one interaction element; implementing at least one instruction followed by the use associated with the activated interaction element; executing the use tracking instruction controlling storage of at least one piece of information concerning the activation of the interaction element, or use tracking information; and transmitting by the terminal the piece of use tracking information to a tracking terminal in charge of processing the use tracking information.

A certain number of techniques are known, which enable tracking of content use on a terminal, among which are included the processing of content server logs, techniques using markers, techniques implementing scripts or else techniques implementing application extensions in the terminal.
1. Processing of Server Logs
This technique consists in applying a computer programme to the content server logs, which generally uses the HTTP protocol. This programme adds a line of textual information to the end of the log file upon each content request.
This line contains a set of information such as the origin of the request, the protocol and the type of request, the address of the requested content, success or an error code, the type of browser, the original content of the request . . . .
By cross-referencing between the various lines added, and by assuming that there is a single user per origin of the request, the downloading information for a content family by a user can be reconstructed.
The disadvantages of this technique of the prior art lies in the fact that it is not possible to differentiate between content downloaded onto a terminal, i.e., the request of which was followed by success, and used by the terminal, and content pre-loaded onto the terminal with a view to later consumption or use, when the terminal is in a mode unconnected to the communication network or offline.
Another disadvantage is that it is not possible to track content consumed multiple times, when the terminal is in disconnected mode.
Neither does this technique enable differentiation between the downloading of content and content use activity, such as partial reproduction of the content, backing up certain elements of the content . . . .
2. Techniques Implementing Markers or "Tags"
The principle of these techniques ("Accrue Insight," "ESTAT'PRO," "WEBandSTATS," "Weboscope," "Webtrends Reporting Series," "Wysistats" . . . ) is to call up content, an image or a URL, using parameters enabling the user to be "tracked," and to pull up available information via JavaScript.
They therefore require code to be inserted into the access pages of the content server.
They thus enable access to a service to be traced, even if it is carried out entirely in a description language with script, such as Flash.
For example, in content anticipating user interactivity, which enables reading of an element of the scene to be initiated, a message can also be sent to an external server when the action is initiated, in order to record this reading.
However, one disadvantage of these techniques is that they require an outside server in order to record the tracing request.
In addition, these techniques do not work in connected mode.
3. Techniques Implementing Scripts
These techniques implement an interpreted programme, which is written in a language such as "ECMA-Script" or "Action-Script," which creates the tracking information and sends same to the server responsible for processing this information.
One disadvantage of these techniques lies in the fact that this information cannot be stored on the terminal, for security reasons.
As a matter of fact, it is unadvisable to perform "scripting" and at the same time write into the memory of a terminal. For example, security restrictions are specified for the use of Java applets when they come from the Web (no permanent file writing on the terminal).
These techniques do not work, therefore, when the terminal is in disconnected mode.
4. Reader Application Extensions
These techniques consist in installing a special reader on the terminal, e.g., such as the iPod, which has a proprietary Apple reader, and which, for example, stores the information relating to the number of musical content consumptions, and then synchronizes same with the computer.
One disadvantage of this technique lies in the use of a proprietary reader, which provides the programme enabling tracking.

Method for creating content, method for tracking content use actions, and corresponding terminal and signals


A substrate processing apparatus includes a coating section, a developing section, a heat-treating section and a transport mechanism. The coating section has first processing units each for performing a coverage process to supply a photoresist solution to a substrate and cover a surface of the substrate with the photoresist solution, a second processing unit for spinning the substrate, after the coverage process, at high speed to make the photoresist solution into a film, dry the photoresist film, and clean the substrate. All substrates are processed with the same coating conditions to suppress differences in quality among the substrates. The first and second processing units perform the respective processes concurrently to improve the throughput of substrate processing.

(1) Field of the Invention
The present invention relates to substrate processing apparatus for processing substrates such as semiconductor wafers and glass substrates for liquid crystal displays. More particularly, the invention relates to a coating technique for supplying a coating solution such as a photoresist solution to form a film of coating solution on substrates.
(2) Description of the Related Art
Drawbacks of the Prior Art:
(I) A series of coating processes for forming a film of photoresist, for example, on a substrate may broadly be divided into the following processes. A first process is a xe2x80x9ccoverage processxe2x80x9d for supplying a photoresist solution to the substrate to cover the entire surface of the substrate with the photoresist solution. A second process is a xe2x80x9cleveling processxe2x80x9d for making the photoresist solution on the substrate into a film. A third process is a xe2x80x9cdrying processxe2x80x9d for drying the film of photoresist solution formed on the substrate. A fourth process, carried out as necessary, is a xe2x80x9cremoving processxe2x80x9d for removing unwanted parts of the photoresist adhering to edges on the upper or front surface of the substrate having the film of photoresist formed thereon, and the photoresist adhering to the back surface of the substrate.
A conventional substrate processing apparatus having a coating unit carries out the above first to third processes or first to fourth processes consecutively with the single coating unit. Where, for example, a substrate processing apparatus has a spin coating unit for coating a substrate in a spin, the coating unit includes a spin chuck rotatable about a vertical axis while holding the substrate in horizontal posture, a coating solution supply nozzle for supplying a photoresist solution to the substrate held by the spin chuck, and a solvent supply nozzle for supplying a solvent to the back surface and edges of the substrate. The substrate processing apparatus having such a single coating unit consumes approximately 60 seconds in processing one substrate.
Incidentally, photoresists of the chemical amplification type that are becoming the mainline solution today are susceptible to the influence of a chemical contamination caused by atmospheric ammonia and the like. To minimize the time in which a substrate is exposed to atmosphere, the above substrate processing apparatus having the coating unit is connected with an exposing apparatus (i.e. stepper) that prints patterns on the substrate with a photoresist film formed thereon, to constitute an xe2x80x9cin-line systemxe2x80x9d widely employed for consecutively performing a series of operations from a coating process to an exposing process.
The exposing apparatus connected to the substrate processing apparatus consumes approximately 30 seconds in processing one substrate. To secure a throughput equal to that of the exposing apparatus, the conventional substrate processing apparatus is provided with a plurality of (e.g. two) coating units for carrying out the first to third processes (or first to fourth processes) concurrently.
The coating units of the conventional substrate processing apparatus must form photoresist films on substrates with an average film thickness and a thickness distribution within specified ranges. For this purpose, coating conditions such as resist discharge, resist temperature, and temperature and humidity within the coating unit are adjusted for each coating unit.
However, circuit patterns printed and developed on the substrates with the photoresist films formed thereon by the respective coating units show that serious variations in quality such as precision of the developed patterns occur among the substrates.
(II) Conventional substrate processing apparatus may have various coating units for performing a coating process by supplying a coating solution such as a photoresist solution to substrates. One such example is a thermal transfer type coating unit that first supplies a coating solution to an applicator sheet, applies the sheet to a substrate to supply the coating solution to the substrate, and separates the sheet from the substrate after heat treatment, thereby transferring a coating film from the sheet to the substrate. Another example is a scan type coating unit having a slit nozzle that discharges a coating solution while scanning or sweeping over a substrate maintained still, to supply the coating solution to the substrate. A third type of coating unit is what is known as a spin coater that supplies a coating solution adjacent the center of a substrate spinning at high speed, spreading the coating solution from the center of the substrate by the centrifugal force of the substrate to form a film of coating solution over the entire surface of the substrate.
A photolithographic procedure where the coating solution is a photoresist solution, for example, includes a series of processes such as (1) supplying the photoresist solution to the substrate to form a photoresist film on the substrate (coating process), (2) an exposing process for exposing the substrate coated with the photoresist film, and (3) developing the exposed substrate (developing process).
Usually, the coating process (1) and developing process (3) are carried out in the same substrate processing apparatus using a coating unit, while the exposing process (2) is carried out by an exposing apparatus which is an external processing apparatus associated with the substrate processing apparatus. Substrates are transferred between the substrate processing apparatus and exposing apparatus through an interface forming a part of the substrate processing apparatus.
However, such a conventional construction has the following drawbacks.
The substrate having undergone the coating process (1) could be exposed in a defective manner (i.e. defocused) in the exposing apparatus.
That is, where different positions on the surface of the substrate are at different heights from the lens of the exposing apparatus, the variations in the height could exceed the depth of focus of the lens, thereby causing a blur. This results in a defective exposure to affect the uniformity in line width of patterns obtained from the exposing process. Conventionally, such a defective exposure is considered due to particles adhering to the surface of the substrate, or ununiformity of the photoresist film formed on the substrate. To avoid the defective exposure, it is conventional practice to clean the surface of the substrate before the coating process or, in the case of a spin coater, adjust the spinning speed of the substrate to uniform the photoresist film. However, such surface cleaning alone has proved no ultimate solution to the defective exposure.
(III) Improved throughput in particular among the processing capabilities of the substrate processing apparatus is desired nowadays. For this purpose, measures have been taken not only to improve transport capability but to increase the number of processing units for performing the same series of processes in parallel.
FIG. 1 is a conceptual diagram of a parallel processing in which step A is carried out concurrently by using two processing units. Step A has a processing time of 60 seconds, for example. This apparatus has an improved throughput of 30 seconds owing to the parallel processing. However, such a technique of parallel processing relying on an increased number of processing units entails disadvantages of increased cost and enlargement of the apparatus.
A technique for overcoming such disadvantages has been proposed in Japanese Patent No. 3164739, for example. In the technique proposed in this patent, a process is divided to reduce the processing time consumed by each step, thereby to reduce the number of parallel processing units. Thus, throughput may be maintained while achieving a cost reduction and compactness of the apparatus. FIG. 2 is a conceptual diagram of an apparatus using such a technique. In this apparatus, step A is divided into step B (with a processing time of 30 seconds) and step C (with a processing time of 30 seconds) to be carried out in series by dedicated processing units, respectively. Thus, the process shown in FIG. 2 also has a throughput of 30 seconds as in the case shown in FIG. 1.
Each of the dedicated processing units used in such an apparatus may have a construction specialized for the intended process. Thus, while maintaining the same throughput, the apparatus construction may be simplified and reduced in size to achieve a cost reduction and the like. Since all substrates are processed by the same processing unit, less individual differences occur with final products.
However, the technique described in the above patent does not allow an equal processing time for the divided steps in an actual processing situation. The step consuming the longer time limits the throughput, resulting in a throughput reduction.
The present invention has been made having regard to the state of the art noted above, and its object is to provide a substrate processing apparatus for improving the throughput of substrate processing and checking quality variations among substrates, or for coating substrates with high precision and efficiently processing the substrates in combination with an external processing apparatus, or for avoiding a reduction in throughput even when part of processing consumes an extended time.
To overcome the disadvantage noted in section (I) above, Inventors have made intensive research and attained the following finding.
When exposing and developing conditions are set according to substrates processed by one coating unit, these substrates will be satisfactory in quality, but substrates processed by the other coating unit are found inferior in quality to the first-mentioned substrates. That is, the respective coating units must be in agreement as to various coating conditions in order to suppress quality variations among the substrates. In practice, however, the coating units have components with varied characteristics, which makes it difficult to bring the coating conditions of the coating units into strict agreement. Thus, instead of performing a parallel processing with a plurality of coating units, a series of film forming processes may be divided into separate time series, the divided processes being carried out successively by using a plurality of separate processing units. Based on this finding, the present invention provides the following construction.
A substrate processing apparatus, according to the invention, comprises a coating section for forming a film of coating solution on a substrate, wherein the coating section performs a series of film forming processes including a coverage process for supplying a coating solution to the substrate and covering a surface of the substrate with the coating solution, a leveling process for making the coating solution on the substrate into a film, and a drying process for drying the film of coating solution formed on the substrate, the coating section including a plurality of separate processing units for successively performing the series of film forming processes as divided into separate time series.
The substrate processing apparatus processes all substrates with the same coating conditions since a plurality of separate processing units are used for performing a series of film forming processes as divided into separate time series. This minimizes variations in quality among the substrates. Moreover, throughput may be improved since the processing units perform the divided processes concurrently.
The series of film forming processes may be divided in any way. For example, the plurality of separate processing units may include a coverage unit for performing the coverage process, and a leveling and drying unit for performing the leveling process and the drying process on the substrate processed by the coverage unit. The processing units may include a coverage and leveling unit for performing the coverage process and the leveling process, and a drying unit for performing the drying process on the substrate processed by the coverage and leveling unit. The processing units may include a coverage unit for performing the coverage process, a leveling unit for performing the leveling process on the substrate processed by the coverage unit, and a drying unit for performing the drying process on the substrate processed by the leveling unit.
The series of film forming processes may include a removing process for removing unwanted parts of the photoresist solution from the substrate, the coating section including a plurality of separate processing units for successively performing the series of film forming processes including the removing process as divided into separate time series.
The series of film forming processes including the above removing process may also be divided in any way. For example, the plurality of separate processing units may include a coverage unit for performing the coverage process, and a leveling, drying and removing unit for performing the leveling process, the drying process and the removing process. The processing units may include a coverage and leveling unit for performing the coverage process and the leveling process, and a drying and removing unit for performing the drying process and the removing process. The processing units may include a coverage, leveling and drying unit for performing the coverage process, the leveling process and the drying process, and a removing unit for performing the removing process. The processing units may include a coverage unit for performing the coverage process, a leveling unit for performing the leveling process, and a drying and removing unit for performing the drying process and the removing process. The processing units may include a coverage unit for performing the coverage process, a leveling and drying unit for performing the leveling process and the drying process, and a removing unit for performing the removing process. The processing units may include a coverage and leveling unit for performing the coverage process and the leveling process, a drying unit for performing the drying process, and a removing unit for performing the removing process. The processing units may include a coverage unit for performing the coverage process, a leveling unit for performing the leveling process, a drying unit for performing the drying process, and a removing unit for performing the removing process.
The removing process may be an edge rinsing for removing the film of coating solution from edges of the substrate, or a back rinsing for removing the coating solution from a back surface of the substrate.
In another aspect of the invention, a substrate processing apparatus comprises a coating section for forming a film of coating solution on a substrate, a developing section for developing the substrate after a coating process and an exposing process, a heat-treating section for heat-treating the substrate before and after the coating and developing processes, and a transport mechanism for transporting the substrate to each processing section, wherein the coating section performs a series of film forming processes including a coverage process for supplying a coating solution on the substrate and covering a surface of the substrate with the coating solution, a leveling process for making the coating solution on the substrate into a film, and a drying process for drying the film of coating solution formed on the substrate, the coating section including a plurality of separate processing units for successively performing the series of film forming processes as divided into separate time series.
With this substrate processing apparatus, a plurality of separate processing units successively perform a series of film forming processes as divided into separate time series. This stabilizes the quality of substrates, and improves the throughput of the substrate processing apparatus.
Preferably, the coating section further includes a dedicated transport mechanism for transporting the substrate between the plurality of separate processing units. In this case, the main transport mechanism of this substrate processing apparatus transports the substrate between the coating section, developing station and heat-treating section, and the dedicated transport mechanism is used to transport the substrate between the plurality of processing units in the coating section. That is, the dedicated transport mechanism undertakes to transport the substrate in the coating section, to avoid lowering of the throughput of the substrate processing apparatus due to an excessive burden falling on the main transport mechanism.
This specification discloses the following solution also:
(1) A substrate processing apparatus comprising a plurality of processing sections for performing predetermined processes on a substrate, a main transport mechanism for transporting the substrate between the processing sections, and a dedicated transport mechanism for transporting the substrate between certain of the processing sections in place of the main transport mechanism.
Where, for example, a substrate processing apparatus comprises a plurality of processing sections such as a coating section for forming a photoresist film on a substrate, a developing section for developing the substrate, and a heat-treating section for heat-treating the substrate, and a main transport mechanism used to transport the substrate between these processing sections, the transporting speed and substrate transfer speed of the main transport mechanism have upper limits although the processing efficiency of each processing section may be increased. Such upper limits may constrain the throughput of the substrate processing apparatus from being increased above a certain level. In the apparatus (1) noted above, the dedicated transport mechanism bears the duty of transporting the substrate between particular processing sections. This reduces the burden on the main transport mechanism, thereby improving the throughput of the substrate processing apparatus.
(2) A substrate processing apparatus as defined in (1) above, wherein the plurality of processing sections are arranged in vertical stages, the main transport mechanism being vertically movable for transporting the substrate at least between upper and lower processing sections, and the dedicated transport mechanism being used to transport the substrate between particular processing sections arranged at the same height.
With the apparatus (2) noted above, since the dedicated transport mechanism is used to transport the substrate between particular processing sections arranged at the same height, the substrate may be transported quickly between the particular processing sections. The dedicated transport mechanism may easily avoid interference with the main transport mechanism which moves vertically.
(3) A substrate processing apparatus as defined in (2) above, wherein the particular processing sections arranged at the same height are separate processing units for performing a series of film forming processes including a coverage process to supply a coating solution to substrate and cover a surface of the substrate with the coating solution, a leveling process for making the coating solution into a film on the substrate, and a drying process for drying the film of coating solution formed on the substrate, as divided into separate time series, the dedicated transport mechanism being used to transport the substrate between the separate processing units.
(4) A substrate processing apparatus as defined in (2) above, wherein the particular processing sections arranged at the same height are separate processing units for performing a series of film forming processes including a coverage process to supply a coating solution to substrate and cover a surface of the substrate with the coating solution, a leveling process for making the coating solution into a film on the substrate, a drying process for drying the film of coating solution formed on the substrate, and a removing process for removing unwanted parts of the coating solution from the substrate, as divided into separate time series, the dedicated transport mechanism being used to transport the substrate between the separate processing units.
With the apparatus (3) or (4) noted above, the dedicated transport mechanism transports the substrate between the plurality of processing units which perform the series of film forming processes as divided into separate time series. This reduces the burden on the main transport mechanism, and also avoids an inconvenience of contaminating other substrates with the coating solution adhering to the main transport mechanism as a result of transporting the substrate still in the course of forming a film.
To overcome the disadvantage noted in section (II) above, Inventors have made intensive research and obtained the following finding.
It has been thought heretofore that a cause of defective exposure is only on the front surface of a substrate. By thinking from a different angle, various experiments have been carried out on an assumption that a cause of defective exposure is also on the back surface of the substrate. The back surface of the substrate has been found to have unwanted parts of a coating solution having moved thereto when supplied to the front surface of the substrate, marks made when the back surface of the substrate is held by a suction type vacuum chuck in a process preceding an exposing process, or stains such as particles adhering to the back surface. It has been confirmed that defective exposure is reduced by removing such marks and stains from the back surface of the substrate. As a well-known technique of removing stains from the back surface of the substrate, for example, back rinsing may be carried out to deliver a cleaning solution from a nozzle opposite the back surface to wash the stains away from the back surface of the substrate. However, the coating processing and the cleaning process such as back rinsing noted above are carried out in series. There is a limitation to removal of stains from the back surface of the substrate by such a series processing. Further, stains may be transferred from a processed substrate to a support table on which the substrate is placed, and such stains may adhere even to a succeeding substrate to be processed. On the other hand, it is conceivable to improve the ability of removing stains adhering to the back surface of the substrate by regularly cleaning the substrate processing apparatus, particularly the support table in the coating section. However, this is a time-consuming operation involving moving of peripherals. To reduce the chance of defective exposure in the exposing process performed subsequently, the coating process and the cleaning process for removing stains from the back surface of the substrate may be performed separately. Based on this finding, the present invention provides the following construction.
A substrate processing apparatus, according to the invention, comprises a coating section including a first processing section for supplying a coating solution to a substrate, and a second processing section for supplying a cleaning solution to the substrate processed by the first processing section, wherein the first processing section includes a first substrate holding device for holding the substrate in horizontal posture while supporting a first support area on a back surface of the substrate, and a coating solution supplying device for supplying the coating solution to a front surface of the substrate held by the first substrate holding device; and the second processing section includes a second substrate holding device for holding the substrate in horizontal posture while supporting a second support area different from the first support area, and a cleaning solution supplying device for supplying the cleaning solution to clean a part or whole of the first support area on the back surface of the substrate held by the second substrate holding device.
With the substrate processing apparatus according to the invention, the first processing section is assigned with the coating process for supplying the coating solution from the coating solution supplying device to the front surface of the substrate to coat the front surface, and the second processing section is assigned with the cleaning process for supplying the cleaning solution from the cleaning solution supplying device to the back surface of the substrate to remove stains from the back surface of the substrate. Thus, the coating process and cleaning process are performed separately by the first and second processing sections, respectively. Further, the first processing section includes the first substrate holding device for holding the substrate in horizontal posture while supporting a first support area on the back surface of the substrate. The second processing section includes the second substrate holding device for holding the substrate in horizontal posture while supporting a second support area different from the first support area. The cleaning solution is supplied to clean a part or whole of the first support area on the back surface of the substrate held by the second substrate holding device. This improves the ability to remove stains from the back surface of the substrate. As a result, the substrate may be coated with high precision.
As a technique for the second substrate holding device to support the second support area different from the first support area, for example, the first substrate holding device may be constructed to hold the substrate in horizontal posture by supporting a central portion of the back surface of the substrate, and the second substrate holding device may be constructed to hold the substrate in horizontal posture by supporting edges of the substrate. Alternatively, the first substrate holding device may be constructed to hold the substrate in horizontal posture by supporting the first support area including a central portion of the back surface of the substrate, and the second substrate holding device may be constructed to hold the substrate in horizontal posture by supporting the second support area including the central portion of the back surface of the substrate.
To support the central portion of the back surface of the substrate, the first substrate holding device may be a vacuum chuck for holding the substrate in horizontal posture by suction-supporting the central portion of the back surface of the substrate.
As the latter technique, for example, the second substrate holding device may support the second support area different from the first support area, such that the first and second support areas are staggered relative to each other while including the central portion on the back surface of the substrate. Alternatively, the first and second substrate holding devices may be constructed such that the second support area is smaller than the first support area.
For the purpose of making the second support area smaller than the first support area, specifically, each of the first and second substrate holding devices may comprise a vacuum chuck for holding the substrate in horizontal posture by suction-supporting a central portion on the back surface of the substrate, the vacuum chuck acting as the second substrate holding device having a smaller diameter than the vacuum chuck acting as the first substrate holding device.
As a different technique for the second substrate holding device to support the second support area different from the first support area, for example, the first or second substrate holding device supports a plurality of locations (e.g. three locations) other than the central portion and edges. Alternatively, the substrate processing apparatus may further comprise a reversing device for turning over the substrate and placing the substrate back in position between the processes in the first and second processing sections, whereby the substrate is turned over by the reversing device so that the second substrate holding device holds the substrate in horizontal posture while supporting the second support area different from the first support area.
The cleaning process for removing stains from the substrate is not limited to the stains adhering to the back surface noted above, but may be applied to stains adhering, for example, to edges on the front surface of the substrate or to edges on the back surface of the substrate (e.g. edge rinsing). In the substrate processing apparatus according to the present invention, such edge cleaning process may be assigned to the first process section or second process section. For example, at least one of the first processing section and the second processing section may include an edge cleaning device for cleaning edges of the substrate.
In one preferred example of including the edge cleaning device in at least one of the first processing section and the second processing section, the edge cleaning device is disposed in the first processing section, the apparatus further comprising a first transport device for supporting the edges of the substrate and transporting the substrate between the first processing section and the second processing section, the first processing section performing a coating process on the front surface of the substrate, and an edge cleaning process for cleaning the edges of the substrate, the first transporting device transporting the substrate, after the coating process and the edge cleaning process, from the first processing section to the second processing section, and the second processing section performing a cleaning process for cleaning the part or whole of the first support area on the back surface of the substrate received from the first transport device.
The above feature is particularly useful with a transport device such as the first transport device that supports the edges of the substrate and transports the substrate between the first processing section and second processing section. That is, the first processing section first carries out the coating process for coating the surface of the substrate, and the edge rinsing process for removing stains from the edges of the substrate. Thus, no stains are present on the edges of the substrate when the first transport device supports the edges of the substrate and transports the substrate to the second processing section. Where the substrate is transported to the second processing section without carrying out the edge rinsing process in the first processing section to remove the stains from the edges of the substrate, the stains adhering to the edges of the substrate will not only adhere to the first transport device, but also affect, by staining, even the second processing section through the first transport device. The above construction effectively reduces contamination of the first transport device and the adverse effect on the second processing section.
In a further aspect of the invention, a substrate processing apparatus comprises a coating section for forming a film of coating solution on a substrate; wherein the coating section includes a first processing section for supplying a coating solution to the substrate, and a second processing section for supplying a cleaning solution to the substrate processed by the first processing section; the apparatus further comprising a second transport device for transporting the substrate between a plurality of processing sections including the first and second processing sections, the first processing section including a first substrate holding device for holding the substrate in horizontal posture while supporting a first support area on a back surface of the substrate, and a coating solution supplying device for supplying the coating solution to a front surface of the substrate held by the first substrate holding device; and the second processing section including a second substrate holding device for holding the substrate in horizontal posture while supporting a second support area different from the first support area, and a cleaning solution supplying device for supplying the cleaning solution to clean a part or whole of the first support area on the back surface of the substrate held by the second substrate holding device.
The above apparatus includes the second transport device for transporting the substrate between a plurality of processing sections including the first and second processing sections. This enables an efficient performance of a series of substrate processes including the coating process and the cleaning process for removing stains from the back surface of the substrate.
In a still further aspect of the invention, a substrate processing apparatus comprises a coating section for forming a film of coating solution on a substrate; wherein the coating section includes a first processing section for supplying a coating solution to the substrate, and a second processing section for supplying a cleaning solution to the substrate processed by the first processing section; the apparatus further comprising a second transport device for transporting the substrate between a plurality of processing sections including the first and second processing sections, an external processing apparatus connected to the substrate processing apparatus, and an interface for relaying transfer of the substrate between the processing sections and the external processing apparatus; the first processing section including a first substrate holding device for holding the substrate in horizontal posture while supporting a first support area on a back surface of the substrate, and a coating solution supplying device for supplying the coating solution to a front surface of the substrate held by the first substrate holding device; and the second processing section including a second substrate holding device for holding the substrate in horizontal posture while supporting a second support area different from the first support area, and a cleaning solution supplying device for supplying the cleaning solution to clean a part or whole of the first support area on the back surface of the substrate held by the second substrate holding device.
The above apparatus includes the external processing apparatus connected to the substrate processing apparatus, and the interface for relaying transfer of the substrate between the processing sections and the external processing apparatus. The substrate coated with high precision in the coating section is transported through the interface to the external processing apparatus. Since the substrate is coated with high precision, the substrate processing may be performed efficiently in the external processing apparatus.
The external processing apparatus may be an exposing apparatus for exposing the substrate after a coating process. Where the external processing apparatus is an exposing apparatus, since the substrate is coated with high precision in the coating section, defective exposure due to stains adhering to the back surface of the substrate may be reduced, compared with the prior art.
The above apparatus overcomes the disadvantage noted in section (II) above, that is to remove stains from the back surface of the substrate. However, the cleaning solution may be applied only to the back surface of the substrate. Unless the cleaning solution is applied to peripheral surfaces of the substrate, stains adhering to the peripheral surfaces may not be removed therefrom. This specification discloses a substrate processing apparatus different from the above apparatus, based on the above finding, to remove stains from the peripheral surfaces of the substrate efficiently, as follows:
(5) A substrate processing apparatus comprising a coating section including a third processing section for supplying a coating solution to a substrate, and a second processing section for supplying a cleaning solution to the substrate processed by the first processing section, wherein the third processing section includes a third substrate holding device for holding the substrate in horizontal posture while supporting peripheral surfaces of the substrate, and a coating solution supplying device for supplying the coating solution to a front surface of the substrate held by the third substrate holding device; and the second processing section includes a second substrate holding device for holding the substrate in horizontal posture while supporting areas different from the peripheral surfaces of the substrate supported by the third substrate holding device, and a cleaning solution supplying device for supplying the cleaning solution to clean at least the peripheral surfaces of the substrate supported by the third substrate holding device.
In the foregoing apparatus for overcoming the disadvantage (II), the back surface of the substrate may be replaced with the peripheral surfaces of the substrate, that is the construction as set forth in the invention (5) above, stains may be removed from the peripheral surfaces of the substrate. The term xe2x80x9cperipheral surfaces of the substratexe2x80x9d used herein is intended to mean vertical surfaces, or side surfaces, bridging the front surface and back surface which are horizontal surfaces. The term xe2x80x9cedges of the substratexe2x80x9d is intended to mean edges of the front surface and back surface including the peripheral surfaces of the substrate.
To overcome the disadvantage (III) noted hereinbefore, the present invention provides a substrate processing apparatus comprising a plurality of processing units for performing one stage of operation in which a processing object is in form of a particular substance on a substrate or in a particular form of energy relating to the substrate, the one stage being divided into a plurality of processes each involving an increase or decrease of the processing object; and a transport mechanism for transporting the substrate to the plurality of processing units; at least the processing units including a plurality of first partial processing units, and a second partial processing unit for performing a partial process having a shorter processing time than a process performed by each of the first partial processing units; the plurality of first partial processing units performing a parallel processing.
Generally, the plurality of processing units in the present invention share processes involving an increase or decrease of xe2x80x9cprocessing objectsxe2x80x9d, and a chain of such processes constitutes one stage. The xe2x80x9cprocessing objectsxe2x80x9d here include a xe2x80x9cchemicalxe2x80x9d in a xe2x80x9cchemical processxe2x80x9d, xe2x80x9cheatxe2x80x9d in a xe2x80x9cheat treatmentxe2x80x9d (heating and cooling), xe2x80x9cforeign mattersxe2x80x9d in a xe2x80x9ccleaning processxe2x80x9d, xe2x80x9cmoisturexe2x80x9d on wafers in a xe2x80x9cdrying processxe2x80x9d, and a xe2x80x9clayer to be exposedxe2x80x9d in an xe2x80x9cexposing processxe2x80x9d.
With the substrate processing apparatus according to the invention, a plurality of processing units perform one stage of operation in which a processing object is in form of a particular substance on a substrate or in a particular form of energy relating to the substrate, the one stage being divided into a plurality of processes performed concurrently and each involving an increase or decrease of the processing object. This feature can avoid throughput being limited by a process requiring a long processing time where a difference in processing time occurs between the partial processing units.
For example, the processing object may be a chemical applied to the substrate, the first partial processing units performing a chemical coating process on the substrate. Then, throughput may be maintained even where, with the increase in substrate size, the chemical coating process tends to require an extended processing time. Particularly where the chemical is a resist, throughput may be maintained for a resist coating process which forms an important part of substrate processing.
In one preferred example of chemical coating process, the second partial processing unit performs a rinsing process including a back rinsing process for removing the chemical from the substrate. With the second partial processing unit performing the rinsing process including the back rinsing process, the other processing units may be simplified. Preferably, each of the first partial processing units and the second partial processing unit has a spin chuck for holding and spinning the substrate, the spin chuck of the second partial processing unit being smaller in diameter than the spin chuck of each of the first partial processing units. Since the spin chuck of the second partial processing unit is smaller than the spin chuck of each of the first partial processing units, particles having adhered to the back surface in each first partial processing unit may be washed away in the larger quantity for the smaller chuck, to reduce particles on the back surface.
Similarly, it is preferred in performing the chemical coating process that each of the first partial processing units performs a first edge rinsing process for edges of the substrate coated with the chemical. With each of the first partial processing units performing the first edge rinsing process for edges of the substrate coated with the chemical, a defective transport may be prevented from occurring when the substrate is transported from each of the first partial processing units. Preferably, the rinsing process includes a second edge rinsing process, the first edge rinsing process covering a smaller range on the substrate than the second edge rinsing process. With this feature, the edge rinsing function of each first processing unit is simplified to simplify the construction of the first processing unit.
In another preferred embodiment for performing the chemical coating process, the substrate processing apparatus further comprises a device for controlling at least one of temperature and humidity only in a space accommodating the first partial processing units, to be within a predetermined range. This apparatus has a simplified construction compared with the case of controlling the temperature and humidity of all the spaces in the apparatus.
In a further preferred embodiment for performing the chemical coating process, the substrate processing apparatus further comprises a chemical nozzle for delivering the chemical, the plurality of first partial processing units sharing the chemical nozzle. With the chemical nozzle shared by the plurality of first partial processing units, there is no need to provide a chemical nozzle for each first partial processing unit. Thus, the apparatus may be reduced in cost, while reducing individual differences among the substrates manufactured.
In the substrate processing apparatus for overcoming the disadvantage (III) noted above, it is preferred that the plurality of first partial processing units are spatially isolated on a basis of processing units performing the same process, at least during the process. With this construction, the substrate processed in each first processing unit is prevented from being affected by other processes performed separately.


An elastic strand laminate, and a method of making an elastic strand laminate. The elastic strand laminate includes a plurality of self-adhering elastic strands made up of an elastomeric adhesive composition. The self-adhering elastic strands can be laminated to one or more facing sheets using conventional hot melt equipment.

This invention is directed to an elastic strand laminate made up of elastic strands self-adhered to one or more facing sheets.
Personal care garments often include elasticized portions to create a gasket-like fit around certain openings, such as waist openings and leg openings. Elastic laminates can be used in the manufacture of such garments to avoid complicated elastic-attachment steps during the garment manufacturing process.
One type of elastomeric laminate is a stretch-bonded laminate that includes elastic strands produced from an extruder and bonded to a facing sheet or sheets using a hot melt adhesive. Laminates including pre-made elastic strands can be processed online but require an elastic attachment adhesive with high add-on in order to reduce strand slippage. The cost of making stretch-bonded laminates can be relatively high due to the cost of the facing sheet or sheets, plus the cost of the elastic strands, plus the cost of the adhesive.
Another type of elastomeric laminate can be made using a vertical filament laminate-stretch-bonded laminate (VFL-SBL) process. However, the VFL-SBL process must be in off-line operation due to process complexity.
Elastomeric adhesive compositions are multifunctional in the sense that they function as an elastomer in a nonwoven composite while also serving as a hot melt adhesive for bonding substrates. Elastomeric adhesive compositions in the form of elastomeric adhesive films are currently recognized as suitable for use in the manufacture of personal care articles. More particularly, elastomeric adhesive compositions can be used to bond facing materials, such as spunbond, to one another while simultaneously elasticizing the resulting laminate. The resulting laminate can be used to form an elastomeric portion of an absorbent article, such as a region surrounding a waist opening and/or a leg opening.
Non-woven elastic adhesive film laminates may require high output of adhesive add-on to achieve a tension target for product application. High add-on of the film laminate may generate a bulky, thick feel and appearance, and high cost. Furthermore, the high adhesive output requirement for the film formation would make on-line processing even more difficult due to the limitation of hot melt equipment output capacity. Also, such film lamination processes are relatively complex and need more precise control than strand lamination since a film edge thinning effect may cause the film to break during stretching.
Some elastomeric adhesive compositions lose their adhesiveness when the compositions are stretched and then bonded between two nonwoven substrates. The elasticity of these elastomeric adhesive compositions (in terms of tension decay) is negatively affected when laminates including the compositions are aged at elevated temperatures, for example around 130 degrees Fahrenheit, which is commonly experienced under hot boxcar storage conditions. It appears that the poor tension and adhesion of such elastomeric adhesive compositions results from the chosen base polymer, tackifier, and plasticizer chemistries as well as the unbalanced ratio of polymer to low molecular weight species in the formulation.
There is a need or desire for an elastic laminate having improved elastic and adhesion properties which can be made in a relatively simple process with reduced raw material usage while still providing adequate tension for product application.

This patent is subject to a terminal disclaimer.


A wireless communication apparatus having a wired interface for wired connection to a terminal device and a wireless unit for connection to a terminal device wirelessly discriminates the state of power supply at start-up and, based upon the result of discrimination, relays data communication between the terminal device connected to the wired interface and another terminal device connected by the wireless unit.

A method in which a digital camera and a printer are connected directly by wire to perform printing has already been proposed. Control information and print data are exchanged between the printer and the digital camera by an operating flow described in, e.g., Patent Document 1 [Japanese Patent Application Laid-Open No. 2004-9388 (Patent Registration No. 03530847)].
Further, a technique in which a signal is switched between networks of different physical layers is disclosed in, e.g., Patent Document 2 [U.S. Pat. No. 6,529,522 (Japanese Patent Application Laid-Open No. 10-257119)].
In the description that follows, the printer of the present invention refers to one that is connected to a digital camera physically or logically and is capable of receiving data directly from the digital camera.
FIG. 1 is a diagram illustrating an example of a wired connection between a digital camera 101 and a printer 102. As shown in FIG. 1, the digital camera 101 and the printer 102 are connected directly by a cable 103 such as a USB cable. If image data is to be printed, it is required that the user plug and unplug the cable 102 before and after printing. A wireless system has been considered as a replacement for cables in order to reduce the plugging and unplugging burden on the user.
It is of course possible to simply adopt a wireless system for a wireless-capable digital camera and wireless-capable printer. However, there is also a need to allow a user who utilizes an existing wire-capable printer to enjoy wireless service by connecting a wireless communication device to the existing wire-capable printer.
However, operation of an existing wire-capable printer is such that when the printer is connected by cable, an operating sequence runs and connects the printer to the digital camera automatically, as set forth in Patent Document 1.
Consequently, although a wireless communication device and a printer are connected, there is no guarantee that a wireless connection between a wireless-capable digital camera and the wireless communication device will be established. When a cable is plugged into an existing printer, the printer operates as one with a connected camera. However, in a situation where the digital camera has not been properly connected logically, at an actual communication time, operation becomes unstable and normal operation cannot be guaranteed. If the printer is a wireless-capable printer, the operation of a direct communication protocol can be controlled in accordance to the wireless connection conditions. However, in the case of a wireless communication device attached to an existing printer that supports only wired connection, the device is physically separated. In addition, a printer that supports only wired connection has no wireless-related control means.

Communication apparatus and method of controlling same


According to embodiments a technique for utilizing an error prediction an avoidance component for a transaction processing system is provided. The technique includes identifying critical functions of the transaction processing system, and collecting usage data. The technique also includes determining a focus area based on the usage data for each of the critical functions, and generating a data message for the focus area, the data message combining internal data and the usage data. The technique includes transmitting the data message to a data processing component (DPC), the data message includes DPC timer information used by the DPC for performing a summarization process, and receiving a summary message from the DPC based on the summarization process performed by the DPC. The technique also includes identifying a summary message focus area from the summary message, and determining a condition of the summary message focus area of the summary message.

The present invention relates to computer processing systems, and more specifically, to utilizing an error prediction and avoidance component for a transaction processing system.
Transaction processing systems are used by many corporations for transactions such as payroll, order processing, reservations, employee records, accounts payable, accounts receivable, etc. Each series of operations/tasks for a transaction are bound together for transaction processing. The transaction will either be completed together successfully or fail in its entirety. In the event of an error, the system "rolls back" all of the operations/tasks of the transaction including those individual operations/tasks that were successful. Each transaction must adhere to the ACID properties (atomic, consistent, isolated, and durable). Distributed transactions provide the ability to incorporate distinct operations that are performed on different systems to be processed together as a single transaction. These distributed transactions can be coordinated by a distributed transaction coordinator that resides within each system.

Utilizing an error prediction and avoidance component for a transaction processing system

INTERNATIONAL BUSINESS MACHINES CORPORATION


A check valve includes an outer poppet therein having a central opening therein where the outer poppet is mounted on the internal lip within the body of a valve. The outer poppet is translatable relative to the inner lip and body and an inner poppet is mounted within the central opening of the outer poppet where the inner poppet is also translatable relative to the outer poppet and inner lip. A means for limiting the translation of the outer poppet relative to the internal lip and a means for limiting translation of the inner poppet relative to the internal lip allow the outer and inner poppet to extend between an open position and retracted position to allow improved flow area through the valve.

This invention relates to the field of valves, and more particularly, to a check valve capable of allowing increased fluid flow therethrough.
Check valves are typically used in situations where fluid is required to flow through a pipe in one direction, as pressure on the flow side of the check valve increases, and to prevent the flow of fluid in a reverse direction should the pressure on the flow side decrease. Accordingly, check valves operate as one-way valve allowing fluid to flow in one direction and preventing fluid from flowing in the reverse direction. Check valves are typically used in series with submersible water well pumps which pump fluid from a water well or sump which then flows through a check valve mounted downstream from the submersible pump. The check valve prevents backflow of pumped fluid into the submersible pump after pumping has ceased.
The advent of high capacity water volume submersible pumps has resulted in a need for larger check valves which accommodate increased fluid flow therethrough without suffering excessive pressure drops. Since high capacity pumps require large diameter piping for optimum fluid flow therethrough, check valves must also be capable of handling large amounts of fluid flow therethrough. However, because the space available within water well casings to accommodate check valves is limited, physical constraints are placed upon the design of check valves. For example, the outer diameter of the check valves is limited, at most, to the inside diameter of the water well casing less the space needed for the electrical power cable to operate the submersible pump. Therefore, the innards of the valve must allow for maximum fluid flow within the available outer diameter of the valve.
Conventional check valves utilize a single poppet within a body which allows for a 50% to 60% cross sectional area which is available for the flow of fluid therethrough, relative to the flow area of the pipe supplying fluid through the valve. Therefore, these conventional check valves result in a significant pressure drop in fluid flow across the valve thereby requiring additional pumping power from the submersible pump to achieve the desired head at points downstream from the check valve.
It is therefore an object of the present invention to provide a check valve which will significantly reduce the pressure drop across the check valve thereby requiring less pumping power from a submersible pump.
It is also an object of the present invention to provide an improved check valve which will maximize flow area therethrough without the necessity of increasing the outer diameter of the check valve.


A contact for use in a test set which can be mounted to a load board of a tester apparatus. The contact, which serves to electrically connect at least one lead of a device being tested with a corresponding metallic trace on the load board, has a first end defining multiple contact points. As the contact is rotated about an axis generally perpendicular to a plane defined by the contact, successive contact points are sequentially engaged by a lead of the device being tested.

The testing of integrated circuit devices is performed to ensure that such devices, when sold to a customer, are of as high a degree of quality as possible. Various types of test apparatus have been utilized over the years to accomplish testing. Typically, a tester includes a printed circuit board which has defined thereon a plurality of conductive traces. These traces on the circuit board, or load board, are associated with corresponding functions of the test apparatus.
In order to accomplish testing, it is necessary to interconnect a lead, in the case of a leaded device under test, or a pad, of a nonleaded device under test, to a corresponding trace on the load board. A test set or test socket having a plurality of contacts is interposed between the device under test and the load board in order to effectuate interconnection. A contact is engaged, at an upper end thereof, by the lead or pad of the DUT, depending upon the type of DUT being tested, with its corresponding trace on the load board. A lower end of the contact is in engagement with a trace on the load board.
As technology has progressed, the size, shape and electronic properties of contacts have evolved in response to the construction of test sets and load boards and the architecture of devices to be tested. At one time, it was considered necessary to have a wiping action at the various locations of engagement of the contact ends by the lead or pad of the DUT and the pad on the load board. Such wiping action was deemed to facilitate a good transmission path through the contact because of a good connection at either end thereof. It has become more apparent, however, that the measure of wiping action formerly considered necessary to maintain a good transmission path need not be of a degree as was formerly believed. Further, it has been recognized that excessive wiping action can damage component parts at the various points of engagement of the contact, and thereby significantly decrease the life of the test socket and tester load board. Consequently, various attempts have been made to minimize abrading of one surface relative to another. Various elastomeric mounting means have been devised in an effort to minimize abrasion and consequent deterioration of components.
Another problem which has been discovered is the diminishment of effectiveness of testing as a result of the employment of matte tin on leads and pads of various types of DUTs. Such a material is applied to DUT components which facilitate soldering to an ultimate host circuit board. Because of its softness, however, it easily can progressively become adhered to the contact which the DUT engages as rubbing across engaged surfaces occurs during the testing function. Eventually, matte tin can build up to the point where signal integrity through the contact can become diminished.
It is to these dictates and shortcomings of the prior art that the present invention is directed. The present invention is a contact having a structure which minimizes tin buildup on the contact.

Electronic device test set and contact used therein


In a developing device for developing an electrostatic latent image formed on a photosensitive member in an electrophotographic apparatus, a developing roller and a developing blade are formed such that the hardness of the surface of the developing blade is higher than the hardness of the surface of the developing roller by 30 degrees or more in JIS-A hardness. The developing blade deforms and bites into the developing roller. Accordingly, the developing roller can be brought into tight contact with the developing blade, and a great frictional force is applied to the toner passing between the developing roller and blade to fully charge the toner.

1. Field of the Invention
The present invention relates to a developing device and toner for use in an electrophotographic apparatus for printing images in accordance with an electrophotographic process.
2. Description of the Related Art
In an electrophotographic apparatus, a photosensitive surface of a photosensitive drum is charged by a charging device at a predetermined potential (e.g. -600 v), and then the photosensitive surface of the photosensitive drum is exposed by an exposure unit in accordance with an image to be printed, thus forming an electrostatic latent image is formed on the photosensitive surface of the photosensitive drum. The electrostatic latent image is developed by a developing device in such a manner that toner is attached to the photosensitive surface of the photosensitive drum in accordance with the electrostatic latent image.
In the developing device, toner is carried and conveyed on a developing roller and put in contact with the surface of the photosensitive drum. When the toner on the developing roller is conveyed, it is formed into a film layer by a developing blade which is made of metal and situated in contact with the developing roller. At the same time, the toner is charged by friction to have the same polarity as that of the potential charged on the photosensitive drum (i.e., negative polarity). A developing bias of a low voltage (e.g. -200 v) and of the same polarity as that of the potential of the photosensitive drum is applied to the developing roller. Toner is selectively attached to the photosensitive drum by the function of the electric field produced in accordance with the electrostatic latent image, the developing bias, and the charge of toner. Specifically, toner is not attached to a non-exposed portion on the photosensitive drum, since the potential of the non-exposed portion is higher than that of the toner. On the other hand, toner is attached to an exposed, discharged portion on the photosensitive drum, since the potential of the exposed portion is lower than that of the toner. Thus, a toner image corresponding to the electrostatic latent image is formed on the surface of the photosensitive drum. The toner image is transferred on a printing paper sheet by a transfer device.
Since image development is performed by the function of the electric field, the development process is not normally carried out if the amount of charges of toner does not reach a predetermined level. A so-called "fogging" phenomenon occurs and toner adheres to the non-exposed region. The quality of printed images is degraded by a fogging. Further, toner is wasted by a fogging.
A rubber roller is employed as the developing roller. In general, as the hardness of the rubber roller increases, the manufacturing precision increases. Therefore, a hardness of a conventional developing roller is high.
However, if the hardness of the developing roller is high, the contact between the developing roller and the metal developing blade tends to unstable. Consequently, some toner particles may pass between the developing roller and developing blade so that they receive little friction and have a small amount of charges may present. A fogging occurs due to these toner particles.

Developing device for electrophotographic apparatus