According to this invention, an oriented copper plate which has a highly developed cube texture and has strength and breaking elongation greater than those of a conventional material having a cube texture, a copper-clad laminate, a flexible circuit board that is excellent in terms of folding flexibility, and an electronic device are provided, and a process for producing the oriented copper plate is established. This invention relates: an oriented copper plate, which contains 0.03% by mass to 1.0% by mass of Cr, the remainder of which is composed of copper and inevitable impurities, wherein the copper plate has a <100> main orientation so that the area percentage of a <100> preferred orientation region is not less than 60.0%, the region satisfying a condition that allows each of a thickness direction of the copper plate and a specific in-plane direction of the copper plate to have an orientation difference of not more than 15° with respect to a <100> basic copper crystal axis of unit lattice of copper, and wherein Cr precipitates having equivalent circle diameters of 4 nm to 52 nm are present at 300 precipitates/μm3 to 12000 precipitates/μm3; a copper-clad laminate and a flexible circuit board using the copper plate; and an electronic devices equipped with the flexible circuit board.

A {100}<001> texture has a stable recrystallization orientation of relatively high purity copper, which is texture orientation that is relatively easy to develop. When copper is rolled so as to be recrystallized, cube orientation is obtained, in which the <100> orientation is aligned with the rolling direction (RD), the normal direction (ND), and the transverse direction (TD) which is orthogonal to RD and ND.
Although it is not easy to stably form a high-density cube texture, it is attempted that a high-density cube texture is industrially utilized for flexible circuit board copper foil (Patent Literature 1 and 2) and rectangular copper wire for solar cell connection (Patent Literature 3 and 4) in recent years. Such cube texture has been realized in practice in some cases. A cube texture is formed on a material, in order to improve fatigue characteristics (Patent Literature 1 and 2) and reduce Young's modulus (Patent Literature 3) and yield strength (Patent Literature 4) for softening.
In general, strain is repeatedly loaded on a metal material that constitutes such flexible circuit board copper foil or rectangular copper wire for solar cell connection. For a flexible circuit board, strain is caused by bending at a hinge portion, a slide portion, or a folding portion of a mobile phone. For a solar cell conductor, heat strain is caused by a difference in the thermal expansion coefficient between silicon and copper.
For both purposes, a case of a fatigue failure of copper that is a metal material has been reported, which would be solved by increasing fatigue strength of copper material. Patent Literature 2 teaches to utilize the fact that a cube texture is excellent in terms of the improvement of fatigue characteristics of copper foil to which a high degree of bending with a small radius of curvature is applied when, for example, copper foil is incorporated into a thin device such as a mobile phone for use. Patent Literature 2 also teaches that anisotropy of mechanical characteristics of such cube texture was utilized to create an idea of a pattern in which the stress direction is aligned with the orientation of high breaking elongation.
In order to improve fatigue characteristics of metal material, it is common to improve metal strength and enhance breaking elongation. For such a purpose, it is common to refine crystal grains. In this regard, although coarsening of grain sizes through cube texture formation is contrary to the above from the viewpoint of material texture, for example, Patent Literature 2 proves that fatigue characteristics may improve by coarsening of crystal grains. It is therefore predicted that when a copper material may have a texture including an advanced cube texture and further have enhanced strength or breaking elongation, the copper material may have enhanced excellent fatigue characteristics.
It is difficult to improve strength and breaking elongation of a material having a highly developed cube texture. As stated above, a cube texture is usually formed by using a stable recrystallization orientation of relatively high-purity copper. This suggests that the number of dislocations or grain boundaries that originally act to increase strength is small. In addition, when it is tried to improve strength by the action of enhancing solid solution or promoting precipitation of alloy elements via alloying, changes in stacking-fault energy might cause the stable recrystallization orientation to vary or precipitates to inhibit grain growth, thereby inhibiting cube texture formation. For such reasons, a copper material having an advanced cube texture is limited in terms of types or concentrations of alloy elements added. In particular, no copper alloy with a highly advanced cube orientation, which contains elements at high concentrations that would promote precipitation, has been found.
As an aside, since a copper material having a developed cube texture is produced by rolling and recrystallization upon industrial production, the <100> main orientation may be in the rolling direction. In other words, the longitudinal direction of a rectangular copper wire for solar cell connection corresponds to the <100> orientation and the stress direction of a flexible circuit board corresponds to the <100> orientation without specific intention. However, when stress is applied in the <100> orientation, the orientation results in the smallest breaking elongation, among possible orientations. Therefore, a material having an advanced cube texture is excellent in terms of fatigue characteristics while the orientation which is most likely to be used (i.e., <100>) is undesirable in terms of fatigue characteristics. For such reasons, it is desirable to improve strength and enhance breaking elongation when stress is applied to a copper material having a highly developed cube texture in the <100> direction.

Oriented copper plate, copper-clad laminate, flexible circuit board, and electronic device

NIPPON STEEL & SUMITOMO METAL CORPORATION


An image processing apparatus including a first image processing unit and a second image processing unit. The first image processing unit is configured to calculate a parameter for image processing based on a first image, but not based on a second image, and execute the image processing on the first image using the parameter. The second image processing unit is configured to execute the image processing on the second image using the parameter.

Conventionally, there are cases where it is desired to execute the same image processing on a plurality of images. For example, in order to correct images contained in a moving image for shaking, JP 2010-10798A discloses a technology that calculates parameters for image processing at respective times of day from images at the respective times of day and corrects the images at the respective times of day using the parameters for image processing at the respective times of day.
However, according to JP 2010-10798A, with respect to a plurality of images on which the same image processing is to be executed, parameters for that image processing are calculated separately. It should be noted that "the same image processing" as used herein means image processing that is realized by the same algorithm and includes cases where different parameters are used. In that case, there is a possibility that an enormous amount of computation time is taken to execute the image processing on the plurality of images. This problem is especially noticeable when image processing parameter calculation is a high-load process.
It is an object of the present invention to provide an image processing apparatus, a recording medium storing an image processing program, and a method of image processing that can reduce computation time taken to execute the same image processing on a plurality of images.

Image processing apparatus, recording medium storing image processing program, and method of image processing


In one embodiment, a method for passive optical network (PON) communication includes broadcasting, by an optical line terminal (OLT), a first message including a first start time of a first quiet window and a first allocation identification number (Alloc-ID), where the first Alloc-ID indicates a first supported upstream line rate associated with the first quiet window. The method also includes receiving, by the OLT from a first optical network unit (ONU) during the first quiet window, a first serial number response, wherein a first transmitting upstream line rate of the first ONU is equal to the first supported upstream line rate.

A passive optical network (PON) is a point-to-multipoint, fiber to the premises fiber-optic access network architecture in which unpowered optical splitters are used to facilitate a single optical fiber to serve multiple premises. For example, a single optical fiber may serve 16-128 premises. A PON may reduce the amount of optical fiber and central office equipment compared to point-to-point architectures. A PON may include an optical line terminal (OLT) at the service provider's central office and a number of optical network units (ONUs) near end users. Downstream signals are broadcast to the premises sharing multiple fibers with encryption to prevent eavesdropping.
A PON uses wavelength division multiplexing (WDM), using one wavelength, for example 1490 nm, for downstream traffic and another wavelength, for example 1310 nm, for upstream traffic. A 1550 nm wavelength is used for optional overlay services, for example radio frequency (RF) analog video.

System and method for passive optical network communication


A pulse igniter for a discharge lamp has a transformer with a primary winding coupled to a first capacitor and a switching element and a secondary winding shunted by a series circuit of a diode and a second capacitor at its output. As a result, the generated ignition voltage is rectified and applied to the lamp for a relatively long time interval, resulting in improved ignition behavior.

This invention relates to a circuit arrangement for igniting a lamp, comprising input terminals for connection to a power supply source,
a first capacitive element, PA1 a first circuit component coupled to the first capacitive element and to the input terminals for generating a charging current from a power supply voltage supplied by the power supply source, said charging current being used for charging the first capacitive element PA1 a transformer having a primary winding and a secondary winding, PA1 a first branch shunting the first capacitive element and comprising a series arrangement of the primary winding and a switching element, PA1 output terminals coupled to the secondary winding for connecting a load circuit comprising a lamp.
The invention also relates to an illumination unit.
A circuit arrangement as described in the opening paragraph is known from U.S. Pat. No. 4,342,948. The known circuit arrangement is very suitable for generating a voltage having a relatively high amplitude. In practice, it is often found for such a circuit arrangement that the voltage generated by the circuit arrangement has the shape of an attenuated AC voltage because the leakage inductance of the transformer resonates with the first capacitive element. The frequency of the attenuated AC voltage is often relatively high. Since the transport of charge carriers in the ignited lamp is relatively slow, the relatively high frequency of the attenuated AC voltage has the result that the maximum amplitude of the ignition voltage of the lamp is higher than the maximum amplitude of the attenuated AC voltage across the second capacitive element. The ignition behavior of the lamp is thereby influenced positively. A drawback of the relatively high frequency of the attenuated AC voltage is, however, that the ignition voltage is present across the lamp only for a relatively short time. The frequency of the attenuated AC voltage can be modified by modifying the dimensioning of the circuit arrangement. However, the latter would result in a relatively expensive and voluminous circuit arrangement. In practice, the relatively high frequency of the attenuated AC voltage has the result that some lamps do not ignite or only ignite after a relatively large number of attempts.

Pulse ignition apparatus for a discharge lamp


A substrate supporting apparatus and a substrate holder are prepared, the substrate supporting apparatus including an opening portion having a plurality of openings smaller than the substrate and a support portion made up of portions other than the opening portion, and the substrate holder having a housing portion which houses at least a portion of the support portion. The substrate supporting apparatus supporting the substrate is mounted on the holder in a state where at least a portion of the support portion is housed in the housing portion. Accordingly, the substrate and the substrate supporting apparatus are integrally supported by the holder in a state where the substrate directly contacts an upper surface of the holder.

1. Field of the Invention
The present invention relates to a substrate supporting apparatus, a substrate transfer apparatus and the transfer method, a method of holding the substrate, an exposure apparatus and a method of manufacturing the apparatus. More particularly, the present invention relates to a substrate supporting apparatus suitable for supporting a thin substrate to be used in the manufacturing of liquid crystal display devices or the like and the inspection process thereof, a substrate transfer apparatus for transferring the substrate integrally with the substrate supporting apparatus and the method therefor, a method for holding the substrate on a substrate holder, an exposure apparatus comprising the substrate transfer apparatus, and the method of manufacturing the exposure apparatus.
2. Description of the Related Art
Conventionally, in the process of manufacturing, for example, a liquid crystal display device (generally called a flat panel display device), a variety of apparatus for processing a large-sized substrate such as exposure apparatus or inspection apparatus have been used. In the exposure and inspection processes using these processing apparatus, a substrate exchanging apparatus (substrate exchanging system) which automatically sets a large-sized substrate (a glass plate) onto the processing apparatus and then removes it from the processing apparatus have been employed.
FIG.11 is a schematic view of the configuration of a substrate exchanging system employed in an exposure apparatus for liquid crystal display substrates, as an example. In the exchanging system shown in FIG. 11, a substrate P (hereinafter also referred to as plate P) is mounted onto a substrate holder 143 in the following method:
{circumflex over (1)} The substrate P is held from underneath by a robot arm 142 and the substrate P is transferred above the substrate holder 143.
{circumflex over (2)} In this state, a plurality of supporting bars 144 which are arranged on the substrate holder 143 for loading and unloading a substrate, are arranged via openings on the upper surface of the substrate holder 143. The support bars 144 rise above the upper surface of the substrate holder 143 to hold up the substrate P from underneath (or the robot arm 142 may be lowered to mount the substrate P on the support bars 144 that are already positioned above the upper surface of the substrate holder 143). In such cases, the support bars 144 are arranged to support the substrate P in and around the center, to prevent the substrate P from bending significantly.
{circumflex over (3)} When the support bars 144 rise a predetermined amount, the substrate P is lifted a predetermined amount from above the upper surface of the robot arm 142 by the support bars 144. The robot arm 142 then is withdrawn from underneath the substrate P so as not to contact any of the substrate P, the support bars 144, and substrate holder 143. FIG.12 shows the robot arm 142, which has completed the withdrawal from the substrate holder 143.
{circumflex over (4)} The support bars 144 are then lowered, with the substrate P being supported from underneath. The support bars 144 are lowered beneath the upper surface of the substrate holder 143, and only the substrate P is in contact with the substrate holder 143, being mounted on the upper surface. The substrate P is fixed onto the substrate holder 143 by suction through a number of suction holes (not shown) provided on the upper surface of the substrate holder 143. The suction of the substrate P performed evenly, so as to improve the smoothness (flatness) of the substrate P. The substrate holder 143 moves with the substrate P, and thus exposure for liquid crystal display substrates is performed.
The removal of the substrate P from the substrate holder 143 is performed by the reversed procedures of {circumflex over (1)}-{circumflex over (4)}.
The substrate used for manufacturing flat panel display devices is a thin glass substrate, for example, 500 mmxc3x97600 mm with a thickness of 0.7 mm. This substrate can be easily damaged, even by a significant flexure. In the conventional substrate exchanging system as described above, to load the thin substrate without any damage, it has been necessary to exchange the substrate with the lower surface being evenly supported by a plurality of supporting bars. The supporting bars were arranged in and around the center of the substrate, where they did not come into direct contact with the transfer arm.
To ensure the stability of supporting the substrate, the number of supporting bars needed to be increased. This required more holes on the substrate holder in accordance with the number of the support bars, which results in depriving the substrate holder of maintaining the flatness required to support the substrate in close contact. The supporting bars, therefore, cannot be excessively increased. An increase in the number of the supporting bars also has caused the vertical movement mechanism of the supporting bars to become complicated and large-sized, which deteriorates the position controllability of the substrate holder.
The number of supporting bars had to be limited for the reasons described above, thus creating a flexure to some extent on the substrate. The flexure has kept the overall substrate from being in total contact with, and being removed from the substrate holder simultaneously, resulting in an unfavorable phenomenon that the upper surface of the substrate holder partially wears away.
In the conventional substrate exchanging system, the robot arm had a comb-shaped cantilever structure, the comb teeth facing the movement direction, arranged so as not to interfere with the supporting bars (refer to FIG.12), the substrate being supported in and around the center to prevent damage. The supporting bars had to lift the substrate high enough to allow the robot arm to be inserted in between the substrate and the holder. With exposure apparatus for liquid crystal display substrates, however, the space between the projection optical system (reference symbol PL in FIGS. 11 and 12) and the substrate holder (generally referred to as a working distance) has become smaller as the numerical aperture of the projection optical system increased. Thus, ensuring a working distance large enough for the robot arm to be inserted has become difficult. Some exposure apparatus for liquid crystal display substrates, therefore, are obliged to perform loading and unloading after the substrate holder has been moved apart from the projection optical system. This requires a larger movement stroke for the substrate holder, increasing the time for loading and unloading the substrate, and also increasing the size of foot print (the area covered by the exposure apparatus installed).
Glass substrates are yet becoming larger and larger, and in the near future, are said to become as large as 1 mxc3x971 m. Larger substrates would obviously be a disadvantage with the conventional substrate exchanging system that has the problems described above still to be solved. Accordingly, it is an urgent task to develop a new technique to comply with the enlargement of such substrates.
The present invention was developed in view of such circumstances. A first object of the present invention is to provide a substrate supporting apparatus that can effectively prevent a substrate from being flexed, while being exchanged and transferred.
A second object of the present invention is to provide a substrate transfer apparatus which substrate holder does not require a complicated and heavy vertical movement mechanism. The transfer apparatus can also transfer a substrate safely without damaging the substrate, and without deteriorating the flatness of the substrate holder surface even when the space available on the substrate mount surface area of the substrate holder is small.
A third object of the present invention is to provide an exposure apparatus that allows the exchange of a substrate directly under the projection optical system even when the projection optical system has a large numerical aperture.
A fourth object of the present invention is to provide a substrate holding method by a substrate holder for large-sized substrates, without damaging the substrate.
According to a first aspect, the present invention is a substrate supporting apparatus to be transferred with a substrate by a transfer member, comprising a supporting portion provided with a plurality of openings smaller than the substrate, the opening with a shape geometrically closed, the supporting portion supporting the substrate.
The substrate supporting apparatus comprises a supporting portion which has a plurality of openings smaller than the substrate with a geometrically closed shape, so the supporting portion is not flexed or damaged, when affected by an external force on supporting the substrate. Thus, a decrease in the supporting force of the supporting portion caused by flexure or damage can be prevented, so that the substrate cannot be dropped so easily during transfer. In addition, the substrate supporting apparatus is structured to support the substrate surface with lines or planes on the edges or the area peripheral to the geometrically closed opening portions, instead of points. Accordingly, when the transfer member transfers or exchanges the substrate integrally with the substrate supporting apparatus, even if the substrate size becomes large, flexure and damage caused by the flexure can be effectively prevented during the transferring and exchanging.
In this case, the substrate supporting apparatus may comprise a plurality of openings. In the case of comprising a plurality of openings, at least a part of the supporting portion can be made of a plate-shaped porous member.
Various configurations may be employed as the supporting portion in the substrate supporting apparatus according to the present invention. For example, the supporting portion can be formed of combining a plurality of linear members. In this case, the supporting portion can be grid-shaped, or honeycomb-shaped.
The substrate supporting apparatus according to the present invention can further comprise a misplacement preventing portion which prevents the substrate supported by the supporting portion from being misplaced. In this case, the misplacement preventing portion may comprise a level-differential portion forming a boundary, between the supporting portion and the outer portion thereof, or stoppers arranged at a boundary between said supporting portion and the outer portion thereof.
Alternatively, the misplacement preventing portion may be arranged on said supporting portion and is a substrate holding mechanism for clasping/releasing both edges of the substrate depending on the weight of the substrate supporting apparatus. In such a case, the substrate holding mechanism can clasp the substrate and release it without utilizing external force.
In this case, the substrate holding mechanism can comprise at least one link mechanism, and an elastic member which gives force to a part of one link constituting the link mechanism on an edge of the substrate. In this case, at least one link mechanism can be arranged respectively on one edge and the other edge (on the opposite side) of the supporting portion of the substrate supporting apparatus. Then, part of the link constituting each link mechanism can be pressured toward one side or the other side of the edges of the substrate by elastic members to press the substrate from both sides thereof by the link mechanisms. Alternatively, the link mechanism can be arranged on only one edge of the supporting portion of the substrate supporting apparatus. A positioning member such as a stopper can be arranged on the other edge, so that the substrate can then be pressured from both sides, by the link mechanism and the positioning member. In either case, when the weight of the substrate supporting apparatus works on the link mechanism, it releases the pressure on the edge of the substrate against the pressuring force caused by the pressuring member of the link mechanism.
As the link mechanism described above, various link mechanisms may be employed. For example, the link mechanism can be a type of mechanism for performing the Scott Russell parallel motion. Employing such a link mechanism allows a pressuring force substantially vertical to the edge of the substrate.
In the substrate supporting apparatus according to the present invention, the transfer member, as a matter of course, can hold an area near the supporting portion of the substrate supporting apparatus to transfer the substrate supporting apparatus integrally with the substrate. The substrate supporting apparatus may further comprise at least two collar portions, which are integrally affixed to the supporting portion, the transfer member holding the supporting portion which supports the substrate. In this case, the collar portions are also a part of the supporting portion. That is, the collar portions may support the substrate instead of, or with, the supporting portion. By allowing the collar portions to support the substrate, the substrate supporting apparatus can be reduced in weight, as well as reduce the flexure of the substrate.
The substrate supporting apparatus according to the present invention can comprise spacer members, being a part of the supporting portion and disposed partially on a surface side which comes into direct contact with the substrate, the spacer members directly contacting the substrate and preventing the substrate from coming into contact with other portions of the substrate supporting apparatus. In such a case, since the spacer members prevent the substrate from being in contact with other portions, even in the case where the substrate is a glass substrate and the substrate supporting apparatus is made of metal, the substrate can be prevented from being damaged.
According to a second aspect, the present invention is a first substrate transfer apparatus for transferring a substrate, comprising a substrate supporting apparatus for supporting the substrate, a transfer member for holding and transferring the substrate supporting apparatus supporting the substrate, and a positioning mechanism, disposed between the substrate supporting apparatus and the transfer member, the mechanism setting a predetermined positional relationship between the substrate supporting apparatus and the transfer member.
The substrate transfer apparatus comprises a positioning mechanism, arranged between the substrate supporting apparatus and the transfer member, for setting a predetermined positional relationship between the two. Accordingly, a vacuuming mechanism for fixing the substrate supporting apparatus by vacuum to the transfer member, for example, a vacuum chucking and driving source is not required. Moreover, the transfer member and the substrate supporting apparatus can be set to the predetermined positional relationship.
In this case, the configuration of the substrate supporting apparatus is not specified in particular, however, for example, the substrate supporting apparatus which comprises a supporting portion provided with a plurality of openings smaller than the substrate, the opening with a shape geometrically closed, the supporting portion supporting the substrate may be employed.
In the first substrate transfer apparatus according to the present invention, the positioning mechanism includes at least two sets of positioning units, a set of positioning unit comprising a projected portion provided on one of the substrate supporting apparatus and the transfer member, and a recessed portion fitting with the projected portion provided on an other of the substrate supporting apparatus and the transfer member. In such a case, the configuration of the positioning between the substrate supporting apparatus and the transfer member can be simplified. In this case, it is preferable that the projected portion constituting each of the positioning units have a spherical surface and at least one of the recessed portions into which each of the projected portions is fitted is a conical groove, or the projected portion constituting each of the positioning units have a spherical surface and at least two of the recessed portions into which each of the projected portions are fitted are V-grooves each arranged in different directions. In the former case, the positioning units having the conical groove as a recessed portion can prevent the substrate supporting apparatus from moving in two-dimensional directions relative to the transfer member, and all the positioning units prevent the substrate supporting apparatus and the transfer apparatus from rotating. In the latter case, the two positioning units having V-grooves directed in different directions as recessed portions can prevent the substrate supporting apparatus from moving in the two-dimensional direction relative to the transfer member, as well as prevent the relative rotation of both apparatus.
The projected portions described above, having a spherical surface can be a part of a ball member.
In the first substrate transfer apparatus according to the present invention, the transfer member can be of any kind so long as it can support the substrate supporting apparatus holding the substrate and transfer them, such as a robot arm.
According to a third aspect, the present invention is a second substrate transfer apparatus for transferring a substrate, comprising a substrate supporting apparatus for supporting the substrate, a transfer member for holding and transferring the substrate supporting apparatus supporting the substrate, a substrate holder onto which the substrate supporting apparatus is mounted, and a positioning mechanism which is disposed between the substrate supporting apparatus and the substrate holder, the mechanism setting a predetermined positional relationship between the substrate supporting apparatus and the substrate holder.
The substrate transfer apparatus comprises a positioning mechanism, arranged between the substrate supporting apparatus and the substrate holder, for setting a predetermined positional relationship between the two. Accordingly, the substrate holder only requires a mechanism for vacuuming the substrate, and the substrate holder can be moved with the substrate supporting apparatus being mounted on the substrate holder, without a mechanism for vacuum chucking and fixing the substrate supporting apparatus.
In this case, the configuration of the substrate supporting apparatus is not specified in particular. However, for example, the substrate supporting apparatus which comprises a supporting portion provided with a plurality of openings smaller than the substrate, the opening with a shape geometrically closed, the supporting portion supporting the substrate, may be employed.
In the second substrate transfer apparatus according to the present invention, it is preferable that the substrate holder is provided with groove portions into which an entire contact portion of the substrate supported by the supporting apparatus is fitted deeply, the contact portion being fitted below a substrate mounting surface of the substrate holder. In such a case, when the substrate supporting apparatus which supports the substrate is mounted on the substrate holder, the substrate supporting apparatus fits into the groove portions of the substrate holder deeply, and the whole portion in contact with the substrate is positioned below the substrate mount surface of the substrate holder. Thus, the substrate can be fixed to the substrate holder by vacuum without any problem.
In the second substrate transfer apparatus according to the present invention, the positioning mechanism includes at least two sets of positioning units, a set of positioning unit comprising a projected portion provided on one of the substrate supporting apparatus and the substrate holder, and a recessed portion, fitting with the projected portion provided on an other of the substrate supporting apparatus and the substrate holder. In such a case, the configuration of the positioning between the substrate supporting apparatus and the substrate holder can be simplified. In this case, it is preferable that the projected portion constituting each of the positioning units have a spherical surface and at least one of the recessed portions into which each of the projected portions are fitted is a conical groove, or, the projected portion constituting each of the positioning units have a spherical surface and at least two of the recessed portions into which each of the projected portions are fitted are V-grooves each arranged in different directions. In the former case, the positioning units having the conical groove as a recessed portion can prevent the substrate supporting apparatus from moving in two-dimensional directions relative to the substrate holder, and all the positioning units prevent the substrate supporting apparatus and substrate holder from rotating. In the latter case, the two positioning units having V-grooves directed in different directions as recessed portions can prevent the substrate supporting apparatus from moving in the two-dimensional direction relative to the substrate holder, as well as prevent the relative rotation for both apparatus.
The projected portions having a spherical surface can be a part of a ball member.
According to a fourth aspect, the present invention is a third substrate transfer apparatus comprising a substrate holder provided with groove portions into which a supporting portion of a substrate supporting apparatus fits, a first transfer mechanism for transferring the substrate supporting apparatus supporting the substrate above the substrate holder, and a second transfer mechanism for moving relatively the substrate supporting apparatus and the substrate holder, in a direction perpendicular to a surface of the substrate holder to fit the supporting portion into the groove portions, the surface being a mounting surface of the substrate on the substrate holder.
According to this aspect, the first transfer mechanism transfers the substrate supporting apparatus integrally with the substrate, above the substrate holder. The second transfer mechanism, then, relatively moves the substrate supporting apparatus and the substrate holder in a direction perpendicular to the mounting surface of the substrate holder, thus allowing the supporting portion to fit into the groove portions. This brings the upper surface of the holder into direct contact with the substrate, therefore, allowing the substrate holder to vacuum and hold the substrate via the opening portions of the substrate supporting apparatus. In this case, a complicated and heavy vertical movement mechanism is not necessary on the substrate holder. The evenness of the holder surface can also be maintained, and even when only a narrow space is available around the substrate mount surface of the substrate holder, the substrate can be safely and swiftly transferred without being damaged.
The third substrate transfer apparatus according to the present invention can further comprise a third transfer mechanism for releasing the fitting between the supporting portion and the groove portions, and withdrawing the substrate supporting apparatus supporting the substrate from above the substrate holder. In such a case, when the substrate supporting apparatus placed on the substrate holder as described above is removed, the third transfer mechanism releases the fitting between the supporting portion and the groove portions, so that the substrate supporting apparatus holding the substrate is withdrawn from above the substrate holder. That is, according to this description, the substrate holder does not require a complicated and heavy vertical movement mechanism. The evenness of the holder surface can also be maintained, and even when only a narrow space is available around the substrate mount surface of the substrate holder, the substrate can be safely and swiftly transferred without being damaged. In addition, compared with the conventional substrate exchanging system described previously, the number of steps required to exchange the substrate can be greatly reduced, allowing the throughput to be improved from the respect of time consuming, since the time required for exchanging the substrate is reduced.
In this case, as a matter of course, the first to third transfer mechanisms may respectively have individual transfer arms for transferring supporting members, and alternatively, the first to third transfer mechanisms may have a common transfer arm for transferring the substrate supporting apparatus. In such a case, the number of parts can be reduced, allowing cost reduction.
According to a fifth aspect, the present invention is a method for holding a substrate on a substrate holder, wherein the substrate holder integrally holds the substrate and the substrate supporting apparatus, the substrate holder having a housing portion formed which houses at least a portion of the substrate supporting apparatus. In this method, the substrate holder, which has a housing portion to house at least a portion of the substrate supporting apparatus integrally holds the substrate and the substrate supporting apparatus. Therefore, sufficient stiffness is provided to the substrate supporting apparatus, preventing flexure or the like during the transfer of the substrate, while the substrate and the substrate supporting apparatus are held on the substrate holder. This allows larger substrates to be held on a substrate holder, without the substrate being damaged.
In this case, the housing portion can have groove portions to house the substrate supporting apparatus. In such a case, the substrate supporting apparatus fits into the groove portions on the substrate holder, allowing the substrate to be held in direct contact with the upper surface of the substrate holder.
In the substrate transfer method according to the present invention, the substrate can be suctioned after the substrate and the substrate supporting apparatus are integrally held by the substrate holder.
According to a sixth aspect, the present invention is a first exposure apparatus for transferring a predetermined pattern onto a substrate by exposing the substrate with an energy beam, the exposure apparatus comprising a substrate supporting apparatus for supporting the substrate, a transfer member for holding and transferring the substrate supporting apparatus supporting the substrate, a substrate holder onto which the substrate supporting apparatus is mounted, a positioning mechanism, disposed between the substrate supporting apparatus and the substrate holder, for setting a predetermined positional relationship between the substrate supporting apparatus and the substrate holder, and a substrate stage integrally moving in a predetermined direction with the substrate holder.
With the first exposure apparatus, the transfer member holds and transfers the substrate supporting apparatus supporting the substrate, and mounts the substrate supporting apparatus on the substrate holder. Once it is mounted, the positional relationship between the substrate supporting apparatus and the substrate holder is set to a predetermined positional relationship by the positioning mechanism. Then, during exposure, the substrate stage integrally moves in a predetermined direction with the substrate holder. That is, a positioning mechanism is arranged between the substrate supporting apparatus and the substrate holder for setting a predetermined positional relationship between the two, and the substrate holder, therefore, only require a mechanism for vacuuming the substrate. Even if vacuum chucking or the like to keep the substrate supporting apparatus fixed is not arranged, the substrate stage can be integrally moved with the substrate holder, and for example, can be moved integrally to expose a plurality of regions on the substrate.
In this case, the first exposure apparatus can be further comprise a mask stage for supporting a mask on which the pattern is formed, and a projection optical system for projecting an energy beam deflected from the mask onto the substrate. This means that the first exposure apparatus related to the present invention can be configured as a projection exposure apparatus.
In the first exposure apparatus according to the present invention, the substrate supporting apparatus can comprise a supporting portion provided with a plurality of openings smaller than the substrate, the opening with a shape geometrically closed, the supporting portion supporting the substrate, the supporting apparatus held by the transfer member.
According to a seventh aspect, the present invention is a second exposure apparatus for transferring a predetermined pattern onto a substrate by exposing the substrate with an energy beam, the exposure apparatus comprising a substrate holder provided with groove portions into which a supporting portion of a substrate supporting apparatus related to the present invention fits, a first transfer mechanism for transferring the substrate supporting apparatus above the substrate holder, by holding a holding portion, a second transfer mechanism for moving relatively the substrate supporting apparatus and the substrate holder, in a direction perpendicular to a surface of the substrate holder to fit the supporting portion into the groove portions, and a substrate stage integrally moving in a predetermined direction with the substrate holder.
With the second exposure apparatus, the first transfer mechanism integrally transfers the substrate supporting apparatus above the substrate holder with the substrate. Then, the second transfer mechanism relatively moves the substrate supporting apparatus and the substrate holder in a direction perpendicular to the mounting surface of the substrate holder, thus allowing the supporting portion to fit into the groove portions. Thus, the upper surface of the holder comes directly into contact with the substrate and therefore, the substrate holder can vacuum and hold the substrate via the opening portions of the substrate supporting apparatus. Then, the substrate stage is integrally moved in a predetermined direction with the substrate holder, thus performing exposure. Accordingly, a complicated and heavy vertical movement mechanism is not necessary on the substrate holder. The evenness of the holder surface can also be maintained, and even when only a narrow space is available around the substrate mount surface of the substrate holder, the substrate can be safely and swiftly transferred without being damaged.
The second exposure apparatus according to the present invention can further comprise a mask stage for supporting a mask on which the pattern is formed, and a projection optical system for projecting an energy beam deflected from the mask onto the substrate. That is, the second exposure apparatus according to the present invention can be configured as a projection exposure apparatus.
The second exposure apparatus according to the present invention can further comprise a third transfer mechanism for releasing the fitting between the supporting portion and the groove portions, and withdrawing the substrate supporting apparatus holding the substrate from above the substrate holder. In such a case, when the substrate supporting apparatus placed on the substrate holder is detached, the third transfer mechanism releases the fitting between the supporting portion and the groove portions, so that the substrate supporting apparatus holding the substrate is retracted from above the substrate holder. That is, with this exposure apparatus, even when only a narrow space is available around the substrate mount surface of the substrate holder, the substrate can be safely and swiftly transferred without being damaged. In addition, compared with the conventional substrate exchanging system described previously, the number of steps required to exchange the substrate can be greatly reduced, allowing the throughput to be improved from the respect of time consuming, since the time required for exchanging the substrate is reduced. In particular, with the projection exposure apparatus, even if the projection optical system, arranged at the side of the substrate mount surface of the substrate holder, has a large numerical aperture (N.A.), the substrate can be effectively exchanged at the position of the projection optical system. The substrate holder, therefore, does not have to be moved apart from the projection optical system to exchange the substrate and accordingly the movement stroke of the substrate holder can be reduced. This shortens the time for loading and unloading the substrate, improving the throughput, and also allows the foot print (the area covered by the exposure apparatus installed) to decrease in size.
In the second exposure apparatus according to the present invention, the first to third transfer mechanisms have a common transfer arm for transferring the substrate supporting apparatus with the substrate supporting apparatus being held. In such a case, cost can be reduced by the reduction of the number of parts.
According to an eighth aspect, the present invention is a manufacturing method for manufacturing an exposure apparatus for use in a lithographic process of manufacturing micro devices, comprising the steps of providing a substrate supporting apparatus for supporting a substrate, providing a transfer member for holding and transferring the substrate supporting apparatus supporting the substrate, providing a substrate holder onto which the substrate supporting apparatus is mounted, providing a positioning mechanism in between the substrate supporting apparatus and the substrate holder for setting a predetermined positional relationship between the substrate supporting apparatus and the substrate holder, and mounting the substrate holder onto a substrate stage moving in a predetermined direction.
With this method, the substrate supporting apparatus for supporting a substrate is prepared, and a transfer member is installed for transferring the substrate supporting apparatus together with the substrate. At this timing, the substrate stage and other various parts are incorporated into the exposure apparatus. The substrate holder is prepared and incorporated into the substrate stage. With the incorporation, the positioning mechanism is also installed between the substrate supporting apparatus and the substrate holder. Then, the parts mentioned above that are incorporated into the exposure apparatus, are combined mechanically, optically, and electrically and then adjusted. Thus, the exposure apparatus according to the present invention can be manufactured.
In this case, the method can further comprise the steps of providing a mask stage for holding a mask on which a pattern to be transferred onto the substrate is formed, and providing a projection optical system for projecting the mask pattern onto the substrate. In such a case, a projection exposure apparatus based on the step and repeat method or step and scan method, can be manufactured.
According to a ninth aspect, the present invention is a fourth substrate transfer apparatus for loading a substrate onto a substrate mount surface on which the substrate is mounted for processing, the transfer apparatus comprising a substrate supporting apparatus capable of being in a substrate supporting state, and of being in a non-supporting state by freeing the supporting state, and a loading member capable of being in an engaged state with the substrate supporting apparatus, and of being in a non-engaged state by freeing the engaged state, wherein the loading member moves to free itself from the engaged state upon loading of the substrate, while the substrate supporting apparatus moves to free itself from the supporting state in accordance with the loading member movement, and the substrate is mounted onto the substrate mount surface.
With the fourth substrate transfer apparatus, when the substrate is loaded onto the substrate mount surface, the loading member changes from the engaged state in which the loading member engages the substrate supporting apparatus in a supporting state, to the non-engaged state in which this engagement is freed. Following this operation, the substrate supporting apparatus changes from the supporting state to the non-supporting state by freeing the substrate supporting state, thereby loading the substrate onto the substrate mount surface. Accordingly, the substrate can be loaded onto the substrate mount surface without using an interim loading/unloading mechanism with the conventional supporting bars (refer to FIG. 11). The substrate can also be processed without withdrawing the substrate supporting apparatus after the substrate has been loaded on the substrate mount surface together with the substrate supporting apparatus.
The fourth substrate transfer apparatus according to the present invention may further comprise an unloading member capable of being in a engaged state with the substrate supporting apparatus, and of being in a non-engaged state by freeing the engaged state, wherein the unloading member moves from the non-engaged state to engage itself with the substrate supporting apparatus upon unloading of the substrate and further moves in a predetermined direction, while the substrate supporting apparatus moves into a supporting state supporting the substrate in accordance with the unloading member movement, the substrate being detached from the substrate mount surface. In such a case, when the substrate is unloaded from the substrate mount surface, the unloading member engages itself with the substrate supporting apparatus which is in a non-supporting state, to change from the non-engaged state to the engaged state, and thereafter moves in the predetermined direction. Then, following the movement of the unloading member, the substrate supporting apparatus changes from the non-supporting state to the supporting state in which the substrate is supported and thus the substrate can be detached from the substrate mount surface. Accordingly, the loading/unloading of the substrate onto/from the substrate mount surface, that is, to exchange the substrate without using an interim loading/unloading mechanism with the conventional supporting bars (refer to FIG. 11).
The fourth substrate transfer apparatus according to the present invention can further comprises a housing member, provided adjacent to the substrate mount surface, for housing the substrate supporting apparatus after the loading, the apparatus not engaged with the loading member. In such a case, the substrate supporting apparatus, which is in the non-engaged state, can be housed by the housing member after the substrate has been loaded onto the substrate mount surface. Accordingly, for example, in the case where the substrate mount surface is arranged on the substrate holder, the substrate holder can be moved immediately after the substrate has been loaded.
The fourth substrate transfer apparatus according to the present invention, can further comprise a misplacement preventing portion for preventing the substrate from being misplaced with the substrate supporting apparatus being in the supporting state. Alternatively, the fourth substrate transfer apparatus may further comprise a positioning mechanism capable of assuming a positioning mechanism, being in a positioning state in which the substrate is positioned in respect to the substrate supporting apparatus by pressuring at least one edge of the substrate, and can be in a non-positioned state in which the substrate is freed from the pressure, wherein the positioning mechanism moves from the positioned state to the non-positioned state upon the loading of the substrate, while the substrate is mounted onto the substrate mount surface.
In the fourth substrate transfer apparatus according to the present invention, as a matter of course, the loading member may be different from the unloading member. However, the loading member and the unloading member may be the same. In such a case, cost reduction is possible by reducing the number of parts.
According to a tenth aspect, the present invention is a fifth substrate transfer apparatus for unloading a substrate mounted on a substrate mount surface, comprising a substrate supporting apparatus capable of being in a supporting state, and of being in a non-supporting state by freeing the substrate, and an unloading member capable of being in an engaged state with the substrate supporting apparatus, and of being in a non-engaged state by freeing the engagement state, wherein the unloading member moves from the non-engaged state to engage itself with the substrate supporting apparatus upon unloading of the substrate and further moves in a predetermined direction, while the substrate supporting apparatus moves into the supporting state according to the unloading member movement, the substrate being detached from the substrate mount surface.
With the fifth substrate transfer apparatus, upon unloading the substrate from the substrate mount surface, the unloading member changes from the non-engaged state to engage itself with the substrate supporting apparatus, and then moves in a predetermined direction. Meanwhile, the substrate supporting apparatus changes from the non-supporting state to the supporting state according to the unloading member movement, to detach the substrate from the substrate mount surface. Accordingly, the unloading of the substrate from the substrate mount surface can be performed without using an interim loading/unloading mechanism with the conventional supporting bars (refer to FIG. 11).
The fifth substrate transfer apparatus according to the present invention can further comprise a housing member, provided adjacent to the substrate mount surface, for housing the substrate supporting apparatus before the unloading, the apparatus not engaged with the unloading member.
According to an eleventh aspect, the present invention is a first substrate transfer method for loading a substrate onto a substrate mount surface on which the substrate is mounted for processing, comprising the steps of preparing a substrate supporting apparatus and a loading member, transferring the substrate supporting apparatus supporting the substrate by the loading member onto the substrate mount surface, and separating the substrate supporting apparatus from the loading member after detaching the substrate from the substrate supporting apparatus, by moving the loading member in a predetermined direction.
With the first method, when the substrate is loaded onto the substrate mount surface, the loading member transfers the substrate supporting apparatus supporting the substrate onto the substrate mount surface, then the loading member moves in the predetermined direction. The substrate is thereby detached from the substrate supporting apparatus supporting the substrate and then the substrate supporting apparatus is detached from the loading member. Thus, the substrate is loaded on the substrate mount surface. Accordingly, the loading of the substrate onto the substrate mount surface can be performed without using an interim loading/unloading mechanism with the conventional supporting bars (refer to FIG. 11). In addition, processing of the substrate becomes possible without withdrawing the substrate supporting apparatus, after the substrate has been loaded on the substrate mount surface together with the substrate supporting apparatus.
The first substrate transfer method according to the present invention can further comprise the step of pressuring at least one edge of the substrate to position the substrate in respect to the substrate supporting apparatus, upon transferring the transfer supporting apparatus onto the substrate mount surface by the loading member. In such a case, the position of the substrate in respect to the substrate supporting apparatus is adjusted while the substrate is being transferred. Therefore, by placing the substrate supporting apparatus supporting the substrate at the predetermined position on the substrate mount surface, consequently, the substrate can be easily mounted at the predetermined position on the substrate mount surface. Accordingly, in the case where the substrate mount surface is arranged on the substrate holder, the positioning of the substrate after the substrate has been placed on the substrate holder is simplified, and sometimes, may not be required.
According to a twelfth aspect, the present invention is a second substrate transfer method for unloading a processed substrate from a substrate mount surface, comprising the steps of preparing a substrate supporting apparatus and an unloading member, engaging the unloading member with the substrate supporting apparatus mounted with the substrate, mounted on the substrate mount surface, and detaching the substrate from the substrate mount surface after the substrate supporting apparatus supports the substrate, by driving the unloading member into a predetermined direction.
With the second method, when the substrate is unloaded from the substrate mount surface, the unloading member engages itself with the substrate supporting apparatus that has been mounted on the substrate mount surface together with the substrate, and thereafter is driven into the predetermined direction. The substrate can thereby be detached from the substrate mount surface after the substrate has been supported by the substrate supporting apparatus. Accordingly, the unloading of the substrate from the substrate mount surface can be performed without using an interim loading/unloading mechanism with the conventional supporting bars (refer to FIG. 11).

Substrate supporting apparatus, substrate transfer apparatus and the transfer method, method of holding the substrate, exposure apparatus and the method of manufacturing the apparatus


A motor-adjustable rear-view mirror has a housing, a mirror glass assembly, at least one mirror adjustment drive that effects alignment of the mirror adjustment drive to the reinforcement plate, in which the fastening device has at least one section for transmission of electrical energy and/or electrical signals to the mirror adjustment drive.

1. Field of the Invention
The invention relates to a motor-adjustable vehicle rear-view mirror, and more particularly to an arrangement that includes a housing that contains at least one mirror glass assembly, a mirror adjustment drive and a reinforcing plate, wherein the mirror adjustment drive acting on the alignment of the mirror glass assembly is mounted to the reinforcing plate by means of a fastening device.
2. Discussion of Relevant Prior Art
Vehicle rear-view mirrors that are motor-adjustable are well known in this field. The mirror adjustment drive is electrically connected to a power supply by very varied designs.
For example, connecting leads can be soldered to the respective connecting terminals of the mirror adjustment drive. The other ends of the connecting leads are brought out of the mirror housing and are connected to the power supply by means of a connector. The necessary soldering process increases the number of time consuming work steps during the assembly of the mirror. Furthermore, when mounting of the mirror, there is a great danger that the electrical leads will be crushed during the fastening of the mirror adjustment drive to the reinforcing plate.
In another embodiment according to the state of the art, the contacts are made by means of plug connectors that are arranged on the drive. Such plug connectors at this exposed place have to be made moisture-tight, which considerably increases their volume and makes mounting additionally difficult. Furthermore, the danger still exists that cables will be crushed, and in the worst case even parted, during mounting.

Motor-adjustable vehicle rear-view mirror


Disclosed is an outside rear-view mirror for a vehicle, having a mirror base and a mirror housing which is adapted to assume a normal position for use relative to said mirror base and to rock forwardly and rearwardly and which is coupled to said mirror base by a rocker. To reduce the danger of injuries particularly of fingers, caused by a back-swinging mirror housing between said mirror housing and said mirror base, at least one spreading spring is provided one end of which abuts said mirror housing and the other end of which abuts said mirror base, and which urges said housing to a fully backward tilted position relative to said mirror base.

1. Field of the Invention
The invention refers to an outside rear-view mirror for a vehicle, having a mirror base and a mirror housing which is adapted to assume a normal position for use and to tilt forwardly or rearwardly relative to the mirror base. The mirror housing is held to the mirror base by a rocker that is mounted to the mirror housing on one end and to the mirror base at the other end thereof.
2. Description of the Related Art
German Offenlegungsschrift 32 20 893 discloses a mirror housing which when tilted returns to its normal position under the action of a strong tension spring. A stop element is provided which is adapted to hold the tilted mirror housing in a rearward end position. When the mirror housing is manually disengaged from the stop element it snaps to its normal position thereby creating the risk of trapping fingers between the strong rim of the mirror housing and the mirror base.
German Utility Model specification 80 00 783 shows an outside rearview mirror the mirror housing of which is held in a rearward end position by engagement of a pin in a detent. When such engagement is released, the mirror housing is returned to its normal position by a strong tension spring. Thereby, also a risk of injury of fingers by trapping is present.
The invention is related to the co-pending U.S. patent application Ser. No. 07/239,384.

Foldable outside rear-view mirror for vehicles


Sealing devices are disclosed in which two members are connected through a hinge for clamping and sealing engagement with gathered-together material at the end of an enclosure. The hinge facilitates installation and accurately aligns interacting parts including a projecting structure on one member with an opening in the other, interengageable locking elements on side portions of the members and sealing elements on end portions of the members. The locking elements include a shoulder on one member engageable by a shoulder on a projection on the other, the projection being engageable in one embodiment for release. Additional locking elements are positioned adjacent the hinge connection for reinforcement.

In my U.S. Pat. No. 4,128,922, issued Dec. 12, 1978, I disclose a sealing device arranged to provide an effective and reliable seal at the end of an enclosure such as a plastic bag or sausage casing. The device as disclosed in my patent avoids problems encountered with prior devices, and includes first and second members adapted to receive therebetween gathered-together material at the end of an enclosure. Such members are preferably of a plastic or other non-metallic material so as to avoid problems encountered with metal staples or clips. Locking means are provided for attaching the members together and one of the members has a projecting central portion guided within an opening in the other member, for engagement with the gathered-together material to provide a seal. Additional seals are provided by means of registering transverse projections and recesses on end portions of the two members. In addition, means are provided for guiding the locking elements and other interacting portions of the members into proper registering relationship.
There are many other disclosures of sealing devices designed for a wide variety of purposes and having many different constructions. In some devices, resilient clips are provided including portions resiliently movable apart to receive a portion of a bag or other enclosure therebetween. In others, the devices have been arranged to be deformed to clamp portions of a bag or the like between portions of the devices.
Such prior art devices, while being satisfactory for some purposes, have not been as efficient or reliable as the device disclosed in my aforementioned patent. Also, the prior art does not recognize any problems with the device as disclosed in my patent or suggest the possibility of improvements thereon.


An improved road scraper includes a second scraping device mounted at a rear end of a road scraper of a known construction having a first scraping device. Between the road scraper and the second scraping device are disposed a vertical displacement mechanism and a horizontal displacement mechanism. By the actions of these mechanisms, the second scraping device may be extended outwardly from one side of the road scraper for scraping a greater width of the road.

(a) Field of the Invention
The present invention relates generally to a road scraper, and more particularly to an improved road scraper for effectively scraping a greater width of a road.
(b) Description of the Prior Art
Existing road scrapers are largely comprised of a scraping device having a suitable width mounted at a rear end of a removable car body. The scraping device may scrape a determined width of the road with the forward movement of the car body. Such road scrapers are widely used in the field and have achieved quite satisfactory effects. However, since the width of the car body onto which the scraping device is mounted is fixed, the width of the scraping device is restricted by the fixed width of the car body. Under such restrictive conditions, the conventional road scrapers can only scrape a limited width of the road. In other words, in order to scrape a comparatively wider road, the road scraper has to run back and forth on the same road several times more, and hence the time taken to accomplish the scraping job will be prolonged. Such problems also exist if a road to be scraped is slightly wider than the width of the road scraper or the width of the road is irregular, with some areas wider or narrower.

Road scraper having vertically and horizontally displaceable auxiliary scraping device


A device for measuring and indicating the volume of the contents of a tank includes a fixed base. A spring deflectable with to the base is also provided. The spring supports at least a portion of the tank weight. A visible connector is connected to the spring such that movement of the visible indicator is coupled to movement of the spring. Thus, as the deflection in the spring changes with an increase or decrease in the tank weight, the indicator moves to reflect the change in tank weight.

Many appliances operate using liquid or gas fuel. For example, many home grills operate using liquified propane stored in pressurized tanks. A problem arises, however, because the tanks are often opaque containers. Thus, the volume stored in the tank cannot be visually discerned. While some appliances using such tanks include a pressure gauge, many do not. Thus, in a conventional appliance, there is typically no readily discernable way to determine the volume of the contents of the tank.
A number of inventions have been created to address this problem. Most use a method and device in which a spring is biased against a tilted tank. As the tank empties, the weight decreases and the spring causes the tank to tilt in the opposite direction.
One drawback of this type of system is that no indicator is given and the user is expected to understand the significance of the tilted tank. Also, this type of system is prone to inaccurate readings if the pivot around which the tank tilts sticks or otherwise cannot rotate freely. Additionally, the amount of tilt may inaccurately reflect the quantity contained in the tank if the tank is improperly positioned on the system because the amount of tilt will depend on the length of the moment arm around the pivot.


A torque split dual-clutch transmission assembly is disclosed that splits the torque generated by an engine between at least two sets of transfer gears that are selectively coupled to first and second layshafts or intermediate shafts. A first input hub is connected to the first layshaft by a first clutch and a second input hub is connected to the second layshaft by a second clutch. A first gearset is carried on the first layshaft and a second gearset is carried on the second layshaft. Each set of transfer gears receives torque from either the transmission input shaft or the first and second layshafts in response to contemporaneous engagement of the first clutch and the second clutch, which can be used during vehicle launch to split the torque applied to the first and second clutches.

This section provides background information related to the present disclosure which is not necessarily prior art.
Conventional dual-clutch transmissions (DCT) combine two manual transmissions into a single transmission assembly. Accordingly, dual-clutch transmissions provide a design alternative to conventional manual and automatic transmissions and can offer increased efficiency when properly configured for a particular vehicle. With increasing fuel costs, vehicle fuel economy has become an important design consideration in recent years contributing to a rise in the number of dual-clutch transmissions being installed in vehicles, particularly in the automotive market.
Dual-clutch transmissions typically include two layshafts, each supporting a plurality of gears. Each layshaft may also have a clutch interconnecting the layshaft with a hub and each clutch connects and disconnects each respective layshaft from the engine. One of the layshafts may include only odd numbered gears while the other layshaft may include only even numbered gears so that clutch-to-clutch power-on shifts can be accomplished in a similar manner to the shifting of a planetary automatic transmission. Accordingly, one of the layshafts may carry a first gear while the other layshaft carries a second gear and so on. The number of forward gear ratios provided thus equals a sum of the number of gears disposed along the two layshafts. Additional gear ratios thus require the addition of odd and even numbered gears to the layshafts, which contributes to a larger, heavier, costlier, and less efficient dual-clutch transmission.
During vehicle launch, conventional dual-clutch transmissions engage the first gear and the clutch that is connected to the layshaft supporting the odd numbered gears. Accordingly, all of the torque from the engine is directed through this one clutch. To reduce the noise, vibration, and harshness of the vehicle launch, some slip of this clutch is permitted until a minimum required vehicle speed is achieved and clutch lock-up torque disturbance is within pre-designated limits. This clutch slip, particularly for extended durations of time, requires an effective cooling strategy for the clutch. Where the clutch is a wet clutch, cooling is achieved by high volume fluid flow through the clutch, which may reach up to 20 liters per minute. Such coolant flow requirements lead to an increase in pump size and/or number, which increases parasitic losses and thereby decreases the efficiency of the dual-clutch transmission. Accordingly, dry clutches are typically more efficient since pump related losses can be reduced or eliminated. However, such dry clutches rely on less efficient air-cooling and repeated launches can lead to overheating of the clutch. Limiting slip time or alternating first gear launches with second gear launches (thus utilizing the clutch for the even numbered gears while the clutch for the odd numbered gears cools) has been used as a strategy to avoid structural damage to the clutch and/or transmission, but there are several drawbacks associated with these strategies. Mainly, torque jerks, slower acceleration, and increased noise, vibration, and harshness occur.


A cell exchanging apparatus which distributes cells input through a plurality of input lines to output lines by destination for output. Without stopping the operation of the cell exchanging apparatus, active and standby cell switches of the cell exchanging apparatus can be changed over. The cell exchanging apparatus comprises a first and second cell switches, input selectors for feeding input cells only to either of the first and second cell switches, and output selectors for outputting cells output from either of the first and second cell switches to an external system. When a change-over is instructed by a system change-over signal, the input selectors start to feed input cells into the cell switch in the standby mode. When detecting completion of cell output operation from the active cell switch, the output selectors select a new active cell switch. Upon detection of completion of cell output operation from the former active cell switch, a controller sends an output permission signal to the new active cell switch. Resultantly, the new active cell switch starts to output cells to the output selectors which then output the cells to an external system.

1. Field of the Invention
The present invention relates generally to asynchronous transfer mode (ATM) networks and more particularly to a cell exchanging system for relaying cells and exchanging cells at a high speed.
2. Description of the Prior Art
A number of ATM techniques and architectures have been proposed to switch voice data, video data, and other kinds of data. The ATM techniques are designed for use in a digital network such as an integrated services digital network (ISDN). ATM techniques improve the utilization efficiency of transmission in switching by statistical multiplexing of fixed length packets of the data, known as cells, on a broad band transmission line. The architectures for practicing ATM techniques include switching architectures for switching cells through the network.
FIG. 11 is a block diagram showing the change-over system of an ATM switch, which is described in Japanese Patent Lain-Open No. Hei 3-26038. The ATM switch is used to direct cells through the ATM network. As shown in FIG. 11, this ATM switch is provided with two ATM switch systems #1 and #2, which have the same structure. Redundant switch systems are provided to enhance the robustness of the network.
Identical ATM cells are input in parallel to the respective switch systems #1 and #2. These ATM cells are input in parallel to ATM switch buffers 30a and 30b of the ATM switch systems #1 and #2, and each cell is output to an external system after a delay. In order to monitor the number of cells which are stored in the ATM switch buffers 30a and 30b, ATM buffer cell counters 31a and 31b are provided. Each of the ATM buffer cell counters 31a and 32b increments its count value each time an ATM cell is input to the corresponding ATM switch buffer 30a and 30b, and decrements its count value each time an ATM cell is output from the corresponding buffer. In this way, the ATM buffer cell counters 31a and 31b always monitor the number of cells that are stored in the respective ATM switch buffers 30a and 30b.
Systems #1 and #2 are provided with respective difference detectors 33a and 33b, for comparing the count values of the ATM buffer cell counters 31a and 31b. Systems #1 and #2 are also provided with respective dummy cell markers 32a and 32b for writing dummy cells into the ATM switch buffers 30a and 30b, in accordance with the control signals sent from the difference detectors 33a and 33b.
A plurality of ATM switches are disposed at intersections (cross points) of input and output paths so as to form a crossbar type ATM exchanging apparatus.
The operation of the conventional ATM switch systems of FIG. 11 will be explained below with reference to FIGS. 12A-12C, 13A, and 13B. In FIGS. 12A-12C, 13A, and 13B, switch systems #1 (see FIG. 11) functions as the "currently used" system, whereas switch system #2 (see FIG. 11) functions as a "spare" system. In this illustrative case, each of the ATM switch buffers 30a and 30b stores the same cells "1"-"2", as shown in FIG. 12A. Accordingly, each of the ATM buffer cell counters 31a and 31b has a counter value of "4".
If ATM switch buffer 30b of switch system #2 ceases operating due to some problem, tile contents of the ATM switch buffer 30b are lost, and the count value of the ATM buffer cell counter 31b is reset to "0", as shown in FIG. 12B. Even if the ATM switch of system #1 becomes operational again, a certain amount of time must elapse before switch system #2 may assume the "currently-used" role previously served by switch system #2.
When switch system #2 assumes the "currently-used" role, difference detector 33b (FIG. 11) detects the difference between the count values of the ATM buffer cell counters 31a and 31b. Difference detector 33b causes the dummy cell marker 32b to generate dummy cells (indicated by "0" entries) which are stored in the ATM switch buffer 30b until the difference in count values is eliminated. Dummy cells are, thus, stored until there is no difference between the count values of the ATM buffer cell counters 31a an 31b, and hence the number of cells stored in the ATM switch buffer 30a equals the number of cells stored in the ATM switch buffer 30b.
For example, when cells "3"-"8" are stored in the ATM switch buffer 30a of switch system #1 and only the cell "8" is stored in the ATM switch buffer 30b of switch system #2, as shown in FIG. 12C, the difference between the numbers of cells stored in the respective switch buffers is "5". Hence, five dummy cells (indicated as "0") are generated and stored in the ATM switch buffer cell 30b. Both ATM buffer cell counters 31a and 31b then have a count value of "6".
In this state, switch system #2 begins to operate in the same way as switch system #1. FIG. 13A shows a subsequent state in which the leading four cells in buffers 30a and 30b have been output and in which four new cells have been supplied to the ATM switch buffers. FIG. 13B shows the state in which two additional cells (six cells in total) have been supplied to the ATM switch buffers 30a and 30b and the leading three cells have been removed from the buffers 30a and 30b. In the state shown in FIG. 13A, since the dummy cells remain, switch system #2 cannot function as a "spare" system. In other words, switch system #2 cannot be called upon to assume the role previously served by switch system #1. However, in the state shown in FIG. 13B, since no dummy cells remain, switch system #2 can be changed over to assume the role of system #1.
With the conventional cell exchanging system having the foregoing configuration, one control unit is shared by two switch systems so as to control which of a plurality of ATM systems for outputting cells to the same output path should output a cell. In such a case, the status of cells stored in the switch buffers are the same for the two switch systems. There is however a problem that the control units cannot be doubled.
On the other hand, when a separate control unit is provided for each of the switch systems 1 and 2, there might be a case in which the switch buffers for the ATM switch systems 1 and 2 might store different numbers of cells. In such a case, the systems 1 and 2 cannot be selected optionally.


An array substrate includes first and second gate electrodes on a substrate; a gate insulating layer on the first and second gate electrodes; first and second active layers on the gate insulating layer; an interlayer insulating layer on the first and second active layers; first to fourth ohmic contact layers respectively contacting both sides of the first active layer and both sides of the second active layer; first and second source electrodes and first and second drain electrodes respectively on the first, third, second and fourth ohmic contact layers; a data line connected to the first source electrode; a first passivation layer connected to the first gate electrode; a power line; one end and the other end of a connection electrode respectively connected to the first drain electrode and the second gate electrode; a second passivation layer; and a pixel electrode-connected to the second drain electrode.

1. Field of the Invention
The present invention relates to an array substrate and more particularly to an array substrate being capable of preventing damages on an active layer, and having an excellent property and high aperture ratio and a method of fabricating the array substrate.
2. Discussion of the Related Art
As the society has entered in earnest upon an information age, flat panel display devices, which have excellent capabilities of a thin profile, light weight and low power consumption, and so on, are introduced.
Among these devices, an active matrix type liquid crystal display (LCD) device is widely used for notebook computers, monitors, TV, and so on instead of a cathode ray tube (CRT), because of their high contrast ratio and characteristics adequate to display moving images.
On the other hand, an organic electroluminescent display (OELD) device is also widely used because their high brightness and low driving voltage. In addition, since the OELD device is a self-emission type, the OELD device produces high contrast ratio, a thin profile and a fast response time.
Both the LCD device and the OELD device require an array substrate where a thin film transistor (TFT) as a switching element in each pixel for controlling the pixel to be turned on and off. The OELD device additionally requires a driving TFT for driving an organic electroluminescent diode.
FIG. 1 is a cross-sectional view showing one pixel region of the related art array substrate. In FIG. 1, a gate electrode 15 is formed on a substrate 11 and in a driving region TrA, where a driving TFT Tr will be formed, inside a pixel region P. A gate line (not shown) connected to the gate electrode 15 is formed along a first direction. A gate insulating layer 18 is formed on the gate electrode 15 and the gate line. A semiconductor layer 28 including an active layer 22 of intrinsic amorphous silicon and an ohmic contact layer 26 of impurity-doped amorphous silicon is formed on the gate insulating layer 18 and in the driving region TrA. A source electrode 36 and a drain electrode 38 are formed on the semiconductor layer 28 and in the driving region TrA. The source electrode 36 is spaced apart from the drain electrode 38. A data line 33 connected to the source electrode 36 is formed along a second direction. The data line 33 crosses the gate line to define a pixel region P. The gate electrode 15, the gate insulating layer 18, the semiconductor layer 28, the source electrode 36 and the drain electrode 38 constitute the driving TFT Tr.
Although not shown, a switching TFT having substantially the same structure as the driving TFT Tr is formed in the pixel region P. The switching TFT is connected to the driving TFT Tr, the gate line and the data line 33.
A passivation layer 42 including a drain contact hole 45 is formed to cover the driving TFT Tr. On the passivation layer 42, a pixel electrode 50 connected to the drain electrode 38 through the drain contact hole 45 is formed. In FIG. 1, first and second patterns 27 and 23, which are respectively formed of the same material as the ohmic contact layer 26 and the active layer 22, are formed under the data line 33.
In the semiconductor layer 28 of the TFT Tr, the active layer 22 of intrinsic amorphous silicon has a difference in a thickness. Namely, the active layer 22 has a first thickness t1 at a central portion and a second thickness t2 at side portions. The first thickness t1 is different from the second thickness t2. Properties of the TFT Tr are degraded by the thickness difference in the active layer 22. The thickness difference in the active layer 22 results from a fabricating process explained with reference to FIG. 2.
FIG. 2 is a cross-sectional view illustrating a fabricating process of a semiconductor layer and source and drain electrode of the related art array substrate. For convenience of explanation, the gate electrode and the gate insulating layer under the active layer is not shown.
In FIG. 2, an intrinsic amorphous silicon layer (not shown), an impurity-doped amorphous silicon layer (not shown) and a metal layer (not shown) are sequentially formed on the substrate 11. Then, the metal layer, the impurity-doped amorphous silicon and the intrinsic amorphous silicon layer are patterned to form a metal pattern (not shown), an impurity-doped amorphous pattern (not shown) and an intrinsic amorphous silicon pattern (not shown).
Next, a center of the metal pattern is etched to form the source and drain electrodes 36 and 38 spaced apart from each other. As a result, a center of the impurity-doped amorphous silicon pattern is exposed through the source and drain electrodes 36 and 38.
A dry-etching process is performed onto the impurity-doped amorphous silicon pattern to removed the exposed impurity-doped amorphous silicon pattern using the source and drain electrodes 36 and 38 as an etching mask. As a result, the ohmic contact layer 26 is formed under the source and drain electrodes 36.
In this case, the dry-etching process is performed for a relative long time to completely remove the under the impurity-doped amorphous silicon pattern exposed through a space between the source and drain electrodes. As a result, a central portion of the active layer 22 under the removed impurity-doped amorphous silicon pattern is partially removed by the dry-etching process such that the active layer 22 has a difference in a thickness. (t1≠t2) If the dry-etching process is not performed for an enough long time, the impurity-doped amorphous silicon pattern partially remains on the active layer 22 such that properties of the TFT Tr (of FIG. 1) are seriously degraded. The thickness difference in the active layer 22 is an inevitable result of the above fabricating process for the array substrate.
In addition, since the active layer 22 is partially removed during the dry-etching process, the intrinsic amorphous silicon layer 20 for the active layer 22 should be formed to have an enough thickness above 1000 angstroms such that there are disadvantages in production costs and a fabricating time.
The TFT Tr is very important element for the array substrate. The TFT Tr is positioned in each pixel region and connected to the gate and data line such that a signal is selectively provided the pixel electrode in each pixel region through the TFT Tr. Unfortunately, since the active layer of the TFT Tr is formed of intrinsic amorphous silicon, there are some problems. For example, when light is irradiated onto the active layer or an electric field is applied to the active layer, the active layer is changed to be a metastable state such that there is a problem of a security of the TFT Tr. In addition, since mobility of carriers in a channel of the active layer is relatively low, the TFT Tr including the active layer of intrinsic amorphous silicon is not adequate to a driving element for the OELD device.
To resolve these problems, the TFT including an active layer of polycrystalline silicon, which is crystallized from intrinsic amorphous silicon by a crystallization process using a laser beam, is introduced. However, referring to FIG. 3, which is a cross-sectional view showing a TFT Tr including a semiconductor layer 55 of polycrystalline silicon for the related art array substrate, the semiconductor layer 55 includes a first region 55a and a second region 55b at both sides of the first region 55a. High concentration impurities should be doped into the second region 55b of the semiconductor layer 55. Accordingly, a doping process for the second region 55b and an implant apparatus for the doping process are required such that production costs are seriously increased. In addition, new process line is required.

Array substrate and method of fabricating the same


This invention relates to a vibrating abrasive cleaning apparatus and method which is powered by a hydraulic drive motor mounted to a square tubing fame which is housed within an enclosure that is vibrated by an eccentric shaft assembly directly coupled to the hydraulic drive motor and square tubing frame. The container assembly is mounted on the rigid square tubing frame, on one side by compression springs, on the opposite side by tension springs. The compression springs and tension springs have a different spring rate which produces better rolling of the media and therefore, faster parts circulation and cleaning. To further give flexibility to the cleaning process the hydraulic power supply is equipped with the variable volume piston pump to give infinite speed settings.

This invention relates to a new and improved vibrating abrasive cleaning apparatus and method. More specifically, this invention relates to the implementation of an improved vibrating abrasive cleaning apparatus which implements an environmentally sound and self contained solvent xe2x80x9cflushxe2x80x9d system that filters and recirculates the cleaning solvent, used to separate the sediment and debris from the articles to be cleaned, into a angularly oriented container for housing the articles, wherein the angle of the container provides for better oscillation and cleaning of the articles contained therein and ease of access. The solvent in the container passes from the container into a holding reservoir and into an improved drainage assembly. The solvent then passes through an improved filter assembly which contains a sediment filter and a triformed filter. The filtered fluid then is recirculated back into the system. This invention further relates to a new and improved square tubing frame which supports the increased oscillation and rpm""s of the eccentric shaft and weight assembly which contains additional counterweights for increased oscillation and productivity.
Many advances have been made in the field of vibratory devices used for cleaning articles. However, increased environmental concerns have lead to the awareness of employing a device or method capable of cleaning an article in a combined solid and fluid mixture, wherein the residue is not discarded and will be environmentally reprocessed through the system. Further developments in vibratory devices have lead to the concern for enhanced productivity through technological breakthroughs in the oscillation process. Consequently, the advances and developments require one of ordinary skill in the art to discern between the environmental statutory requirements, commercial desires and productivity. Conventional vibrating and abrasive cleaning apparatus have failed to address environmental concerns by dumping the waste material that is cleaned or removed from the articles. Further, conventional vibrating and abrasive cleaning apparatus have not addressed, nor met, the desired increased productivity demands made by the commercial industry.
Applicant""s disclosure on Mar. 15, 1992, further demonstrates the present invention""s improvements needed to meet the environmental and commercial concerns in the area of vibrating and abrasive cleaning apparatus. Applicant""s disclosure comprised a vibrating and abrasive cleaning apparatus for cleaning articles through oscillation, and provided a refiltration process of circulating the cleaning solvent through a series of sedimentary and triformed filters, however, failed to address productivity concerns. Specifically, applicant""s disclosure did not address the improvements as claimed and described herein such as the use of square tubing to house an angularly disposed container which provided increased stability, volumetric capacity, and better rolling of the media and solids about the container. Further, applicant""s previous disclosure did not address the improved drainage system of the present invention which incorporates a mating, interchangeable, port assembly allowing the removal of the housing and square tubing frame assembly from the drainage system. Additionally, applicant""s previous disclosure did not incorporate the addition of counterweights on the eccentric shaft assembly to improve the part rotation from 12 seconds/cycle to 8 seconds/cycle. Applicant""s previous disclosure also did not incorporate clevis pins and cotter pins used to secure all vibration tension springs.
Thus, applicant""s previous disclosure and conventional vibrating and abrasive cleaning apparatus failed to address the environmental and commercial concerns for an interchangeable and closed solvent circulation/filtration system and enhanced oscillation means for reduced cleaning time.
Consequently, it is a primary object of the applicant""s invention to provide an environmentally, self-contained, solvent circulation/filtration system incorporating an interchangeable, mating, drainage port assembly for removal from the square tubing frame and housing, and improved oscillation means.
It is a further object of the invention to provide a power source for oscillation of the eccentric shaft assembly which comprises a primary electrical motor powering a hydraulic pump for the solvent and secondary hydraulic motor for oscillation of the eccentric shaft assembly.
It is a further object of the invention to provide a secondary electrical motor as an alternative source of power for smaller vibrating and abrasive cleaning apparatus.
It is a further object of the present invention to provide a square tubing frame for increased support and stability of the housing and container during oscillation and drainage.
It is a further object of the present invention to implement clevis bolts and cotter pins instead of hexagonal nuts to secure all vibration tension springs, thus facilitating better stability during oscillation, and enhanced productivity.
It is a further object of the present invention to provide an improved oscillation means comprising a primary power source and a secondary hydraulic power source driven by the primary power source for facilitating oscillation and circulation of excess solvent and debris within the container, and an eccentric shaft assembly connected to the secondary power source and square tubing frame to further facilitate oscillation of the container on the frame.
It is a further object of the present invention to increase the number of counterweights on the eccentric shaft assembly to improve the parts per rotation of articles in the container, thus improving productivity.
It is a further object of the present invention to further enhance oscillation performance and productivity through the implementation of variable spring rates between the compression and tension springs connected between the container and the frame.
It is a further object of the present invention to provide a variable volume piston pump on the secondary power source to permit infinite speed settings.
It is a further object of the present invention to provide an improved drainage means comprising an interchangeable, mating, port assembly connected to a fluid reservoir.
It is a further object of the present invention to provide an environmentally contained solvent filtration/circulation system allowing the debris and solvent to exit the container into the solvent filtration system to separate the debris and recirculate the cleaned solvent back into the container.
It is a further object of the present invention to angularly orient the container mounted on the square tubing frame, within the housing, to further enhance productivity by enabling ease of access to the container and enhanced rotation of the articles, solvent and media about the container.
It is a further object of the present invention to implement a unitary interior liner of polyurethane for the interior lining of the container.
The above as well as additional objects, features, and advantages of the invention will become apparent in the following description.

Vibrating abrasive cleaning apparatus and method

Drilltec Patents and Technologies Co., Inc.


The invention relates to an arrangement for automatically loading a floppy disc into a floppy disc drive unit, using a positioning motor that locates a magnetic head on various tracks on the floppy disc. After the floppy disc has been partly inserted in the floppy disc drive unit, the floppy disc is grasped by a gripping element disposed on a slide. The positioning motor moves the slide at the same time as the magnetic head so that the floppy disc is drawn into the floppy disc drive unit. Then the slide is locked. To eject the floppy disc, the lock is released and, guided by the positioning motor, the slide, together with the floppy disc, is partially ejected from the floppy disc drive unit.

1. Field of the Invention
The invention concerns an arrangement for automatically loading a floppy disc into a floppy disc drive unit.
2. Description of the Prior Art
A floppy disc drive unit is known from U.S. Pat. No. 3,768,815 (fully incorporated herein by this reference) in which the floppy disc is pushed in by hand. Before insertion, the lid of the floppy disc drive unit is raised. Then the floppy disc is pushed in and the lid is closed again. Simultaneously with the closure of the lid a clamping device is operated which centers the floppy disc and through which the floppy disc is driven. A similar floppy disc drive unit is known from U.S. Pat. No. 3,678,481 (fully incorporated herein by this reference). If, with these known floppy disc drive units, the floppy disc is inserted incorrectly, the result may be damage to the floppy disc. For example, the floppy disc is damaged if it has not been inserted completely and the clamping device is operated or the lid closed.

Arrangement for automatically loading a floppy disc into a floppy disc drive unit