An electronic handheld device is described having an options module for providing a user with at least one option in the handheld device, each option associated with an enabling mode of operation of the handheld device. The device also includes an enabling module for implementing, in response to a particular option being selected by a user, an associated enabling mode of operation. Each enabling mode of operation makes the handheld device more accessible to a person having a corresponding disability.

Mobile communication devices, or electronic handheld devices, are becoming ubiquitous in our society. Such devices can provide telephone, email, and Internet access, resulting in ever increasing mobile communication capabilities.
While generally helping people remain connected, there is one group of persons for whom the services provided by handheld devices have lagged behind. In particular, disabled persons have limited capabilities in accessing the many features provided by handheld devices. Therefore, any system or method that can make a handheld device more accessible to disabled persons would be most welcome in the field of mobile communications.

System and method for making an electronic handheld device more accessible to a disabled person


A method for providing a user interface (UI) in an electronic device includes determining at least a starting keyword from a given target database, and associating each said starting keyword with a function of the electronic device; determining at least a linking keyword from a user profile database; creating a keyword tree from the at least a starting keyword and the at least a linking keyword, wherein the keyword tree has at least two layers, and the at least a linking keyword is placed in an upper layer relative to the at least a starting keyword; and providing the keyword tree on the electronic device for a user to browse and thereby select at least a said starting keyword by at least a said linking keyword on the keyword tree, thus starting the function.

The present invention relates to keyword-based user interfaces in an electronic device, and more particularly, to a method for producing a keyword-based user interface by automation.
In the information technology field, keywords are typically used to conduct a data search. The main advantage of keywords is that keywords carry semantic meanings comprehensible to a user. Hence, when used as search criteria, keywords yield a result which meets the user's expectations. Commercial search engines in wide use, such as Google, provide keyword search services, and thus they are not described in detail herein for the sake of brevity.
To enhance the precision of search results, the prior art, such as US Patent Application Publication 2008/0005107, discloses a way of conducting a search by a keyword tree.

Keyword-based user interface in electronic device

INTERNATIONAL BUSINESS MACHINES CORPORATION

INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE


A data processing apparatus that enables a client to identify services which can be provided under a current status of the data processing apparatus by reflecting dynamically changing status information, such as equipment information, in a WSDL file. An equipment information acquisition device 1211 acquires status information relating to the status of an image processing apparatus 100. A WSDL generator 1212 generates service description information containing information pertaining to at least one service provided by the image processing apparatus 100 and described in a predetermined language, in accordance with the status information acquired by the equipment information acquisition device 1211. The service description information is referred to by a host computer 200 to use the at least one service. A Web server 1213 transmits the service description information generated by the WSDL generator 1212 to the host computer 200.

1. Field of the Invention
The present invention relates to a data processing apparatus capable of communicating with external information processing apparatuses, a data processing method, a data processing program for implementing the method, and an image processing apparatus.
2. Description of the Related Art
Conventionally, an information processing apparatus, such as a host computer or a personal computer, has been able to obtain printer-related attribute information from a printer, determine whether or not a job can be issued based on the attribute information, and control the issuance of the job based on results of the determination (for example, Japanese Laid-Open Patent Publication (Kokai) No. 2000-137590).
At the printer, an ID is added to each of a variety of types of attribute information, and the information processing apparatus acquires and identifies the attribute information based on these IDs.
In recent years, on the Internet, web services have attracted much attention. A web service is a technology that seamlessly joins a variety of services that are dispersed on a network. Using this technology, it is possible for a program to dynamically select appropriate services without any human intervention, and as such it is widely anticipated by many industries as a technology that is capable of automatically performing a desired processing.
The data exchanged through a web service is written in XML (Extensible Markup Language). The XML data is transmitted over the network using SOAP (Simple Object Access Protocol). According to SOAP, it is stipulated that HTTP (Hyper Text Transfer Protocol) or SMTP (Simple Mail Transfer Protocol) is used in a lower layer, and SOAP can be used on the Internet as easily as web browsing and an e-mail.
Moreover, technical specifications used by web services include WSDL (Web Service Description Language). WSDL is a web service description language that describes an interface for accessing a web service. A client information processing apparatus (hereinafter "client") that uses a web service can confirm the actual connection method by referring to information described in WSDL. WSDL is standardized by W3C (World Wide Web Consortium), the technical specifications for which can be obtained from "http://www.w3.org/TR/wsdl".
By applying the web service technology to printing, a variety of hitherto unavailable advantages can be obtained. For example, with a conventional printer, the client must identify which ID corresponds to which attribute information and acquire desired attribute information by specifying a plurality of IDs. By contrast, a printer equipped with a web service enables a user to flexibly customize access to the printer print service. For example, the connection method to the printer print service is described in WSDL. Therefore, by using a conversion/interpretation program following uniform standards based on WSDL, the client can also interpret a file described in WSDL and provide a GUI (graphical user interface) has only those items required by the user, which are extracted from the file.
Moreover, WSDL can also describe job information that can be specified when a print job is input, so that, for example, it is also possible to know in advance whether or not double-sided printing is possible by referring to the WSDL-described job information.
Thus, it is expected that printers, to which the web service technology having a variety of advantages is applied, will be further developed from now onwards.
In order to apply the web service technology described above to printing, the printer itself is required to generate a WSDL-described file (hereinafter referred to as "WSDL file") and publish it on the network. However, if the WSDL file is unique to each printer, information that dynamically changes, such as status information including equipment information (installed hardware information) on the printer, cannot be reflected in the WSDL file.
Therefore, for example, in a WSDL file of a printer for which a hard disk is optional and that is shipped without a hard disk, "no hard disk" is written. Similarly, if, considering the fact that a hard disk is optional, information that is necessary to use a hard disk is written in the WSDL file, then the client will carry out operations required when the printer uses a hard disk, regardless of whether or not a hard disk is installed.
As a result, there is the drawback that the client transmits operations that cannot actually be executed, to the printer.

Data processing apparatus, data processing method, data processing program for implementing the method, and image processing apparatus


An EUV light source plasma source material handling system and method is disclosed which may comprise a droplet generator having a droplet generator plasma source material reservoir in fluid communication with a droplet formation capillary and maintained within a selected range of temperatures sufficient to keep the plasma source material in a liquid form; a plasma source material supply system having a supply reservoir in fluid communication with the droplet generator plasma source material reservoir and holding at least a replenishing amount of plasma source material in liquid form for transfer to the droplet generator plasma source material reservoir, while the droplet generator is on line; a transfer mechanism transferring liquid plasma source material from the supply reservoir to the droplet generator plasma source material reservoir, while the droplet generator is on line. The supply reservoir may comprise a solid form of the plasma source material used to periodically form from a portion of the material in solid form the material in liquid form.

It is known in the art to generate EUV light from the production of a plasma of an EUV source material which plasma may be created by a laser beam irradiating the target material at a plasma initiation site (i.e., Laser Produced Plasma, "LPP") or may be created by a discharge between electrodes forming a plasma, e.g., at a plasma focus or plasma pinch site (i.e., Discharge Produced Plasma "DPP") and with a target material delivered to such a site at the time of the discharge. Target delivery in the form of droplets of plasma source material, which may, e.g., be mass limited for better plasma generation conversion efficiency and lower debris formation, are known techniques for placing the plasma source material at the appropriate location and at the appropriate time for the formation of the plasma either by LPP or DPP. A number of problems are known to exist in the art regarding the handling of the target material, e.g., liquid metal feeding to a mechanism for the formation of target droplets either of the metal itself or a suspension, dispersion or other mixture of the target material with a liquid that is not reactive with the target material, e.g., water or alcohol for a tin metal plasma source material and a liquid plasma source material compound such as Li(CH3). The present applications relates to aspects of embodiments of methods and apparatus for dealing with such problems.
Complex liquid metal handling systems are found in certain liquid metal cooled nuclear reactors, as wall protection in experimental fusion reactors and for use with targets in high energy particle accelerators.

Method and apparatus for EUV light source target material handling


A light emitting apparatus having a light source for emitting short wavelength radiation and an optic device configured to receive the radiation emitted from the light source. A device directs at least some of the short wavelength radiation emitted from the light source into the optic device and a down conversion material receives at least some of the short wavelength radiation directed into the optic device in one spectral region and emits the radiation in another spectral region.

Solid state light emitting devices, including solid state lamps having light emitting diodes (LEDs), laser diodes (LDs), and resonant cavity LEDs (RCLEDs) are extremely useful, because they potentially offer lower fabrication costs and long term durability benefits over conventional incandescent and fluorescent lamps. Due to their long operation (burn) time and low power consumption, solid state light emitting devices frequently provide a functional cost benefit, even when their initial cost is greater than that of conventional lamps. Because large scale semiconductor manufacturing techniques may be used, many solid state lamps may be produced at extremely low cost.
In addition to applications such as indicator lights on home and consumer appliances, audio visual equipment, telecommunication devices and automotive instrument markings, LEDs have found considerable application in indoor and outdoor informational displays.
With the development of efficient LEDs that emit short wavelength (e.g., blue or ultraviolet (UV) radiation), it has become feasible to produce LEDs that generate white light through down conversion of a portion of the primary emission of the LED to longer wavelengths. Conversion of primary emissions of the LED to longer wavelengths is commonly referred to as down-conversion of the primary emission. An unconverted portion of the primary emission combines with the light of longer wavelengths to produce white light.
Phosphor conversion of a portion of the primary emission of the LED chip is attained by placing a phosphor layer in an epoxy that is used to fill the reflector cup which houses the LED chip within the LED lamp. The phosphor is in the form of a powder that is mixed into the epoxy prior to curing the epoxy. The uncured epoxy slurry containing the phosphor powder is then deposited onto the LED chip and subsequently cured.
The phosphor particles within the cured epoxy generally are randomly oriented and interspersed throughout the epoxy. A portion of the primary radiation emitted by the LED chip passes through the epoxy without impinging on the phosphor particles, and another portion of the primary radiation emitted by the LED chip impinges on the phosphor particles, causing the phosphor particles to emit longer wavelength radiation. The combination of the primary short wavelength radiation and the phosphor-emitted radiation produces white light.
Current state of the art phosphor-converted white LED (pc-LED) technology is inefficient in the visible spectrum. The light output for a single pc-white LED is below that of typical household incandescent lamps, which are approximately 10 percent efficient in the visible spectrum. An LED device having a comparable light output than that of a typical incandescent lamp necessitates a larger LED chip or a design having multiple LED chips. Moreover, a form of direct energy absorbing cooling must be incorporated to handle the temperature rise in the LED device itself. More particularly, the LED device becomes less efficient when heated to a temperature greater than 100° C., resulting in a declining return in the visible spectrum. The intrinsic phosphor conversion efficiency, for some phosphors, drops dramatically as the temperature increases above approximately 90° C. threshold. Other down conversion materials like quantum dots could start to decrease in efficiency from even lower temperatures, 25 degrees centigrade.

High-efficient light engines using light emitting diodes


An idle control system applicable to a fuel cell vehicle 1 is provided for improving the fuel efficiency. When the fuel cell vehicle is determined to be in a predetermined idle mode, the idle control system stops a compressor to thereby stop power generation of a fuel cell. In contrast, when the state of charge of the capacitor 4 falls below a predetermined value while the fuel cell vehicle is in the idle mode, the idle control system drives the compressor 8 by means of the capacitor to drive the fuel cell in order to charge the capacitor.

1. Field of the Invention
The present invention relates to an idle control system for a fuel cell vehicle, and in particular relates to an idle control system for a fuel cell vehicle, which is installed in a hybrid-type power supply provided with a fuel cell and a power storage device which is recharged by generated current from the fuel cell.
2. Description of the Related Art
Heretofore there is known a fuel cell vehicle provided with a solid polymer membrane-type fuel cell, in which the responsiveness of the output supply to each part of the vehicle is increased by providing a power storage device comprising for example a battery or a capacitor and the like, in order to supplement the output responsiveness of the fuel cell accompanying the gas supply of hydrogen gas as a fuel and air as an oxidizing gas.
As such a fuel cell vehicle there is for example one disclosed in Japanese Unexamined Patent Application, First Publication No. 2001-359204, which is provided with an idle control system which detects an idle state where it is possible to stop power generation of the fuel cell, and stops power generation of the fuel cell, and resumes power generation of the fuel cell when the state of charge of the power storage device is less than a predetermined state of charge.
However, in the conventional technology, the target amount of power generated in the case of resuming power generation of the fuel cell is set depending on the state of charge of the power storage device and the expected power consumption of the electrical load of the vehicle. Therefore, the amount of power generated by the fuel cell fluctuates depending on the state of the electrical load, and hence there is no appreciable increase in the efficiency of power generation by the fuel cell. Also, there is concern that the amount of noise generated by the air supply compressor which supplies the reaction gas air to the fuel cell, fluctuates depending on the target amount of power generated by the fuel cell.
In particular, in cases where the state of charge of the power storage device is low, and where the expected power consumption of the electrical load of the vehicle is high, the target amount of power generated by the fuel cell is increased. However, a supply of reaction gas to match to the increase of the amount of power generated by the fuel cell is necessary, and hence the power required by the air supply compressor also increases. Therefore, as the amount of power generated by the fuel cell becomes greater, the power consumed in order to drive the compressor is increased, and there have been problems with a reduction in the overall efficiency of power generation.

Idle control system for fuel cell vehicle


A container assembly for keeping food stored therein fresh. The container assembly includes a plurality of nested members each having a bowl-shaped configuration comprising exterior and interior surfaces, a base and a perimeter side wall extending upwardly around the base. The perimeter side wall terminating at an upper edge. The nested members include an outer bowl, a filter, and an inner bowl. The filter is rested inside the outer bowl. The inner bowl is rested inside the filter such that the filter is interposed between the inner and outer bowls. The inner bowl having a plurality of spaced apart holes therethrough. A lid assembly is provided for substantially covering upper opening of the outer bowl.

1. Field of the Invention
The present invention relates to food containers and more particularly pertains to a new container assembly for keeping food stored therein fresh.
2. Description of the Prior Art
The use of food containers is known in the prior art. More specifically, food containers heretofore devised and utilized are known to consist basically of familiar, expected and obvious structural configurations, notwithstanding the myriad of designs encompassed by the crowded prior art which have been developed for the fulfillment of countless objectives and requirements.
Known prior art includes U.S. Pat. Nos. 4,898,273; 4,844,263; Des. 366,989; 3,586,201; 3,037,652; and 1,584,903.
While these devices fulfill their respective, particular objectives and requirements, the aforementioned patents do not disclose a new container assembly. The inventive device includes a plurality of nested members each having a bowl-shaped configuration comprising exterior and interior surfaces, a base and a perimeter side wall extending upwardly around the base. The perimeter side wall terminating at an upper edge. The nested members include an outer bowl, a filter, and an inner bowl. The filter is rested inside the outer bowl. The inner bowl is rested inside the filter such that the filter is interposed between the inner and outer bowls. The inner bowl having a plurality of spaced apart holes therethrough. A lid assembly is provided for substantially covering upper opening of the outer bowl.
In these respects, the container assembly according to the present invention substantially departs from the conventional concepts and designs of the prior art, and in so doing provides an apparatus primarily developed for the purpose of keeping food stored therein fresh.

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A semiconductor package has a first semiconductor die mounted on a substrate. A conductive via is formed through the substrate. A first RDL is formed on a first surface of the substrate in electrical contact with the conductive via and the first semiconductor die. A second RDL is formed on a second surface of the substrate opposite the first surface of the substrate die in electrical contact with the conductive via. A second semiconductor die can be mounted on the substrate and electrically connected to the second RDL. Bonding pads are formed over the first and second surfaces of the substrate in electrical contact with the first and second RDLs, respectively. The bonding pads on opposite surfaces of the substrate are aligned. Solder bumps or bond wires can be formed on the bonding pads. The semiconductor packages can be stacked and electrically connected through the aligned bonding pads.

Semiconductor devices are found in many products in the fields of entertainment, communications, networks, computers, and household markets. Semiconductor devices are also found in military, aviation, automotive, industrial controllers, and office equipment. The semiconductor devices perform a variety of electrical functions necessary for each of these applications.
The manufacture of semiconductor devices involves formation of a wafer having a plurality of die. Each semiconductor die contains hundreds or thousands of transistors and other active and passive devices performing a variety of electrical functions. For a given wafer, each die from the wafer typically performs the same electrical function. Front-end manufacturing generally refers to formation of the semiconductor devices on the wafer. The finished wafer has an active side containing the transistors and other active and passive components. Back-end manufacturing refers to cutting or singulating the finished wafer into the individual die and then packaging the die for structural support and environmental isolation.
One goal of semiconductor manufacturing is to produce a package suitable for faster, reliable, smaller, and higher-density integrated circuits (IC) at lower cost. Flip chip packages or wafer level chip scale packages (WLCSP) are ideally suited for ICs demanding high speed, high density, and greater pin count. Flip chip style packaging involves mounting the active side of the die facedown toward a chip carrier substrate or printed circuit board (PCB). The electrical and mechanical interconnect between the active devices on the die and conduction tracks on the carrier substrate is achieved through a solder bump structure comprising a large number of conductive solder bumps or balls. The solder bumps are formed by a reflow process applied to solder material deposited on contact pads which are disposed on the semiconductor substrate. The solder bumps are then soldered to the carrier substrate. The flip chip semiconductor package provides a short electrical conduction path from the active devices on the die to the carrier substrate in order to reduce signal propagation, lower capacitance, and achieve overall better circuit performance.
In many applications, it is desirable to stack semiconductor packages for a higher level of device integration. In prior stacking arrangements, the semiconductor package interconnects have used through hole vias, solder bumps, and wire bonding. Space must be allocated to the stacking arrangement when using bond wires. Also, the bond wires are typically made with gold, which adds cost to the manufacturing process. The formation of through hole vias also adds manufacturing cost. The solder bumps for different packages are often dissimilar and proper orientation to contact pads on adjacent packages must be taken into account in the stacking design.

Semiconductor package and method of forming similar structure for top and bottom bonding pads


A pressure sensor 10 includes a casing 12 configured to be able to be filled with a fluid 16 such as a liquid or a gas, in which at least part of a surface contacting this fluid 16 is formed of a giant magnetostrictive member 18 made of a giant magnetostrictive element, and detecting means for detecting a change in magnetic permeability or an amount of remanent magnetization attributable to expansion and contraction of the giant magnetostrictive member 18 based on a pressure change of the fluid 16 filled in this casing 12. The pressure sensor 10 can detect pressure at high sensitivity and high accuracy in a short time while achieving miniaturization of a device at the same time.

A diaphragm pressure sensor configured to convert flexure (displacement) of a diaphragm pressurized by a fluid into an electric signal and to detect a pressure change based on this electric signal has been conventionally proposed as one of pressure sensors capable of detecting a pressure change of a fluid such as a liquid or a gas (see Japanese Patent Laid-Open Publication No. Hei 11-44597, for example).
However, such a diaphragm pressure sensor is configured to detect pressure by use of the flexure of the diaphragm. Accordingly, the diaphragm pressure sensor has problems that a relatively long time period is required for detection, and that it is difficult to achieve measurement at high accuracy because the displacement of the diaphragm generally shows a non-linear characteristic.
In recent years, a pressure sensor applying a magnetostrictor is drawing attention as a measure for solving these problems. The pressure sensor applying a magnetostrictor utilizes a characteristic of the magnetostrictor that causes a large change in magnetic susceptibility upon application of external stress. Such a pressure sensor is applied to the field of tire pressure detection devices (see Japanese Patent Laid-Open Publication No. Hei 11-287725), for example.
As shown in FIG. 5, a pressure sensor 1 applied to this tire pressure detection device is configured to apply a compressive force caused by internal pressure of a tire to a giant magnetostrictive material 3 via a push rod 2. Moreover, a coil 4 disposed around this giant magnetostrictive material 3 detects a change in magnetic susceptibility of the giant magnetostrictive material 3 and thereby the device measures air pressure in the tire.
However, this publicly known conventional pressure sensor 1 is configured to apply the air pressure of the tire being the measuring object to the giant magnetostrictive material 3 via the push rod 2, and therefore has problems of a difficulty to detect a small change of the air pressure, and of reduction in sensitivity and accuracy of pressure measurement.
Moreover, the giant magnetostrictive material 3 is made of a bar member, and is configured to receive the compressive force from the push rod 2 only by use of an end face in an axial direction thereof. Accordingly, there is a problem that the compressive force of this push rod 2 acts on a small area and an amount of deformation (the change in magnetic susceptibility) of the giant magnetostrictive material 3 is therefore small.

Scalable high sensitivity magnetostrictive pressure sensor


Disclosed is a seismic load transmitting system based on impact mechanism for a multi-span continuous bridge. There are impact assemblies connected to a superstructure of the bridge for colliding with movable support piers according to a longitudinal displacement of the superstructure of the bridge caused by a seismic load. The seismic load is transmitted from the superstructure of the bridge to the movable support piers. These are impact receiving assemblies installed in the movable support piers for receiving an impact force generated when the movable support piers become collided with the impact assemblies and transmitting the seismic load transferred from the superstructure of the bridge through the impact assemblies to the movable support piers. The seismic load generated in the superstructure of the bridge is transmitted not only to the fixed support piers but also to the moving support piers due to the collision between the impact assemblies and the impact receiving assemblies. The contact plate of the impact receiving assembly has a curved surface of a predetermined curvature.

1. Field of the Invention
The present invention generally relates to a seismic load transmitting system for multi-span continuous bridges, and more particularly, to a seismic load transmitting system based on impact mechanism for multi-span continuous bridges, which can improve earthquake resistance capacity of a bridge by transmitting seismic load from the superstructure not only to fixed support piers of the bridge, but also to movable support piers of the bridge.
2. Description of the Related Art
Recently, multi-span continuous bridges are widely used. In general, such a multi-span continuous bridge is designed to have a single fixed point in the longitudinal direction of the bridge. FIG. 6a shows an example of the conventional multi-span continuous bridge. In the conventional 4-span continuous bridge, a fixed support 121 is installed on a fixed support pier 120, which is located in the middle of the 4-span continuous bridge, to restrict the longitudinal movement of the 20 superstructure 100 of the bridge. Movable supports 122 are installed on movable support piers 110 and 130 to permit free longitudinal movement of the superstructure 100 of the bridge. FIG. 6b is a schematic view illustrating the deformation of the 4-span continuous bridge of FIG. 6a when a seismic load is imparted thereto. Referring to FIG. 6b, the seismic load is applied to the superstructure 100 of the bridge in the arrow direction xe2x80x9cbxe2x80x9d by an earthquake ground motion expressed in the arrow direction xe2x80x9caxe2x80x9d. The superstructure 100 of the bridge moves in the longitudinal direction of the bridge due to the seismic load. With no frictional force of the movable supports, the seismic load imparted to the superstructure 100 of the bridge would be transmitted only to the fixed support pier 120 through the fixed support 121. The fixed support pier 120 provided with the fixed support 121 would withstand the whole seismic load transmitted from the superstructure 100 of the bridge, and finally be forced to deform as shown FIG. 6b. If an excessive seismic load is applied to the fixed support pier 120, the bridge itself as well as the fixed support 121 of the fixed support pier 120 would be seriously damaged, maybe resulting in the failure of the fixed support pier 120.
Seismic isolators, i.e., lead rubber bearings, friction pendulum seismic isolation bearings, etc., are conventionally employed to reduce the seismic load transmitted from the superstructure of the bridge to the piers. It is most convenient if the conventional seismic isolators are installed between the piers and the superstructure from the beginning of the construction of the bridge.
Meanwhile, shock transmitters have been developed to transmit the seismic load not only to the fixed support piers but also to the movable support piers by the aid of high viscosity fluid. To be specific, the apparatus is characterized by a cylinder and rods connecting both ends of the cylinder to the superstructure of the bridge and to the piers. In general the cylinder is divided into two chambers by a sliding piston. The chambers are filled with fluid and connected through an orifice. It allows slow displacement under static load such as temperature load. But it provides temporary restraint under the suddenly applied dynamic load such as earthquakes. This apparatus using viscous fluid, however, should always be kept sealed so as to prevent the fluid from leaking out and the function thereof from deteriorating due to the leakage. For this, the apparatus may need measures for continuous monitoring, maintenance and repair. Further, there may be deterioration in the viscosity of the fluid with the passage of time, possibly inducing loss in efficiency of the impact transmitting apparatus and in earthquake resistance capacity of the bridge.
It is, therefore, an object of the present invention to provide a seismic load transmitting system based on impact mechanism for a multi-span continuous bridge, which can overcome the disadvantages of the conventional shock transmitters in a mechanical manner in contrast to the conventional seismic isolator.
To achieve the above object, there is provided a seismic load transmitting system based on impact mechanism for a multi-span continuous bridge, which improves its resistance capacity against earthquakes by converting the seismic load transmitted from a superstructure of the bridge into a compressive force and transmitting the same not only to fixed support piers but also to movable support piers.
To be specific, the seismic load transmitting system comprises impact assemblies (or impactors) that are connected to a superstructure of the bridge for colliding with the movable support piers according to longitudinal displacement of the superstructure of the bridge caused by the seismic load and that transmit the seismic load from the superstructure of the bridge to the movable support piers; and impact receiving assemblies (or targets) that are installed in the movable support piers for receiving impact forces generated when the movable support piers collide with the impact assemblies (or impactors) and that transmit the seismic load from the superstructure of the bridge through the impact assemblies to the movable support piers, whereby the seismic load transmitting system can improve the earthquake resistance capacity of the bridge by converting the seismic load generated in the superstructure due to the earthquake into compressive forces due to the collision between the impact assemblies and impact receiving assemblies and transmitting the seismic load to the fixed support piers but also to the movable support piers.
The seismic load transmitting system according to the present invention has also functions of distributing and transmitting impact forces generated at expansion joints of bridge superstructures owing to the causes other than earthquakes.
According to the present invention, the impact assembly includes a main body, said main body being fixed to the superstructure of the bridge at one end thereof and extending toward the impact receiving assembly at the other end thereof, an impact plate being installed at an end of the main body and facing the impact receiving assembly with a predetermined gap therebetween; and a buffer plate made of an elastic material, the buffer plate being provided in front of the end of the impact plate, for reducing impact load generated when the impact assembly is collided with the impact receiving assembly.
The impact receiving assembly may include a base plate attached to the movable support piers for fixing the impact receiving assembly to the movable support piers, a contact plate being in contact with the buffer plate during the collision between the impact assembly and the impact receiving assembly, and an impact absorbing plate being installed between the contact plate and the base pate to absorb the impact force generated during the collision between the impact assembly and the impact receiving assembly.
The impact assembly may further include a plurality of supplemental intermediate metal plates of a predetermined thickness between the impact plate and the rear of the buffer plate, and the contact plate of the impact receiving assembly has a curved surface of predetermined single or double curvature. The surface of double curvature means a curved surface that is defined by horizontal curvature and vertical curvature that can be different from each other.
In the other embodiment, the impact plate, intermediate plates and buffer plate of the impact assembly have curved surfaces of predetermined single or double curvature.
The impact receiving assembly may further comprise an impact absorbing plate being installed between the contact plate and the base plate to absorb the impact force generated during the collision between the impact assembly and impact receiving assembly.
The contact plate in the impact receiving assembly and the buffer plate in the impact assembly may have, respectively, a curved surface of single or double curvature.
The structures of the impact assembly and the impact receiving assembly can be interchanged each other to achieve the functions intended by the seismic load transmitting system of the present invention.
The impact assembly and the impact receiving assembly may be enclosed by a flexible protection hood, respectively. A shear key may be installed at the upper part of the movable support piers, and the impact receiving assemblies may be installed at both sides of the shear key.

Seismic load transmitting system based on impact mechanism for multi-span continuous bridges

Daerim Apartment 6-109, Jamwon-dong, Seocho-ku


An improved continuously variable micro control valve and an apparatus and a method employing the same for making semiconductors enable a computer to precisely set a driver of the micro control valve such that the accuracy of the control valve in reproducing a flow value for a given setting of the driver is at least 1/1000 of a maximum flow value for a relatively wide range of flow values which can be provided by the micro control valve. The relatively wide range of flow values is at least 1000 to 1 in a disclosed embodiment with a resolution sensitivity of the micro control valve being at least 1/10,000 of the full scale of the relatively wide range of flow values. The improvement in repeatability and accuracy afforded by the micro control valve can result in higher yields in semiconductor making.

Semiconductor manufacturing involves the use of process gas which is delivered from a supply of the process gas to the manufacturing tool through a system or apparatus that includes tubing, valves and a pressure regulator, for example. Increased emphasis is being placed on preserving the purity of the process gas as it travels through the delivery apparatus. Significant progress has been made by machining the surfaces in contact with the gas to a very fine finish, leaving out parts that contribute to particulate contamination such as a bias spring within the pressure regulator, and cleaning the delivery apparatus surfaces to insure a very low particle count, e.g. a small number of particles down to a size of 0.02 micron. Contamination of the process gas can adversely affect the quality of the semiconductors being made with the gas, lowering the yield from the manufacturing process.
Valves and pressure regulators for high purity applications have typically used Kel-F type fluorocarbon polymers for seats. Such plastics absorb moisture during valve and pressure regulator manufacture and release it slowly during their use in a dry gas system. Residual moisture levels required are currently less than ten parts per billion. As feature widths in semiconductors become smaller, e.g. less than 0.5 micron, the requirement for drier systems becomes increasingly important. To avoid contamination from moisture, valves and apparatus for delivering process gas for making semiconductors have been proposed which reduce moisture absorption inside the valve or apparatus by the total elimination of plastics and elastomers in contact with the gas being delivered by the valve or apparatus, as in the commonly assigned U.S. patent application Ser. Nos. 08/575,022 and 08/575,021, both filed Dec. 19, 1995 and now U.S. Pat. Nos. 5,755,428 and 5,762,086, respectively.
The accuracy, or lack thereof, with which the process gas can be supplied to the manufacturing tool can also impact the manufacturing process and yield. An improvement in repeatability and accuracy with which the process gas can be supplied to the manufacturing tool can result in higher yields from the manufacturing process. The accuracy of the control valve of a conventional mass flow controller in reproducing a flow value is typically 1/100 of a maximum flow value of a range of flow values over which the flow of gas is controlled by the controller. The resolution sensitivity with this conventional control valve is typically 1/1000 of the maximum flow value of the range of flow values. As feature widths in semiconductors become smaller, e.g. less than 0.5 micron, the need for accuracy of a control valve in reproducing a flow value becomes increasingly important.
An object of the present invention is to provide an improved micro control valve for precisely controlling the flow of gas over a relatively wide range of flow values, and an apparatus and method for making semiconductors with high purity process gas, having improved accuracy in reproducing a flow value of the process gas as compared with conventional control valves, apparatus and methods to thereby improve yields in making semiconductors.
These and other objects of the invention are attained by the improved micro control valve of the invention for precisely controlling the flow of gas over a relatively wide range of flow values. According to a disclosed, preferred embodiment of the invention, the micro control valve comprises means defining an orifice through which gas flow can be controlled, a valve cooperating with means defining an orifice, and a drive means which can be precisely set for effecting precise relative movement between the valve and the means defining an orifice for precisely controlling the flow of gas through the orifice over the relatively wide range of flow values. The means defining an orifice and the valve are configured, and the drive means effects sufficiently precise relative movement between the valve and the means defining an orifice, such that the accuracy of the control valve in reproducing a flow value for a given setting of the drive means is at least 1/1000 of a maximum flow value of the relatively wide range of flow values. That is, the repeatability of the micro control valve of the present invention is an order of magnitude better than the aforementioned conventional control valve in a mass flow controller.
The micro control valve of the invention is further characterized in that a ratio of a maximum flow value to a minimum flow value of the relatively wide range of flow values over which the flow of gas can be accurately controlled, is at least 1000 to 1. The resolution sensitivity of the micro control valve of the invention is also an order of magnitude better than the aforementioned known control valve. That is, the resolution sensitivity of the precise control of the flow gas by the micro control valve of the present invention is at least 1/10,000 of the maximum flow value of a relatively wide range of flow values over which the flow of gas is controlled by the micro control valve.
The drive means in the disclosed embodiments of the micro control valve comprise a driver which can be set to provide a precise rotational motion and a precision screw mechanism for converting the rotational motion of the driver into linear motion in a desired direction for effecting the relative movement between the valve and the means defining an orifice. A flexible coupling, rigid in torsion, is connected between the driver and the screw mechanism for coupling the rotational motion provided by the driver to the screw mechanism. This flexible coupling is preferably a zero-backlash coupling. The flexible coupling is a multiple convolution bellows in the disclosed embodiments. According to the preferred embodiment, the flexible coupling is axially displaced as it rotates for varying the flow of gas over the relatively wide range of flow values, the coupling having a relatively low spring rate to minimize a longitudinal force created by the displacement of the coupling as it rotates for varying the flow of gas. This longitudinal force is overcome by the force from a bias spring of the valve which longitudinally loads the screw mechanism in the direction of the driver to take up play in the screw mechanism for minimizing hysteresis during operation of the control valve.
The control valve further includes means for aligning the screw mechanism in the valve for providing the linear motion in the desired direction. According to the preferred embodiment, the screw mechanism is a differential screw mechanism. In a second embodiment, a single screw mechanism is employed to provide a linear motion of less than or equal to 0.020 inch per complete turn of the rotational motion input from the driver to the screw mechanism.
A flexible metal diaphragm is mounted in a valve body of the micro control valve for movement toward and away from the means defining an orifice. The valve is connected to a central portion of this diaphragm and to the linear motion output of the screw mechanism. Means are provided for clamping the flexible diaphragm at its periphery into gas sealing contact with the valve body. In the disclosed embodiments this provides metal to metal contact between the flexible metal diaphragm and the metal valve body sealing the gas passage through the valve to atmosphere to prevent contamination by inboard leakage thereby maintaining high purity of the process gas.
The orifice which is adjustably throttled by the valve is formed in an insert in the valve body in the disclosed embodiments. The annular orifice linearly extends along an axis. The valve is in the form of a tapered needle projecting from the diaphragm, the valve being elongated in a direction along the axis of the orifice and tapered at a relatively small angle to the axis. The drive means precisely moves the valve along the axis of the orifice relative to the insert for precisely controlling the flow of gas through the orifice over the relatively wide range of flow values. The diaphragm and screw mechanism are accurately aligned in the valve for providing the linear motion in the desired direction along the axis.
A method of the present invention for making semiconductors comprises providing a supply of pressurized process gas for making semiconductors, regulating the pressure of process gas from the supply of process gas and controlling the flow of the pressure regulated process gas to a processing equipment for making semiconductors, wherein the flow of the pressure regulated process gas to the processing equipment is controlled over a relatively wide range of flow values with a continuously variable micro control valve having a driver which can be precisely set, the micro control valve having an accuracy in reproducing a flow value for a given setting of the driver of at least 1/1000 of a maximum flow value of the relatively wide range of flow values. As a result, relatively high yields in semiconductor making are possible. According to the preferred embodiment of the method, the step of precisely setting the driver of the micro control valve is performed by means of a computer for controlling the process gas supplied to the processing equipment.
An apparatus of the invention for making semiconductors comprises a source of process gas used in making semiconductors, a processing equipment for making semiconductors to which the process gas is to be supplied, and a micro control valve of the present invention for precisely controlling the flow of process gas over a relatively wide range of flow values from the source of process gas to the processing equipment for making semiconductors. The micro control valve has an accuracy in reproducing a flow value for a given setting of the drive means of the control valve which is at least 1/1000 of a maximum flow value of the relatively wide range of flow values.
These and other objects, features and advantages of the present invention will become more apparent from the following detailed description of two disclosed embodiments of the present invention illustrated in the accompanying drawings.

Micro control valve and apparatus and method for making semiconductors with high purity process gas


A charging device which charges a body to be charged. At least a pair of linear electrodes is provided on a substrate so as to be close to each other. Walls are provided near the linear electrodes. Each of the walls has a height larger than a line width of each of the linear electrodes. The linear electrodes are surrounded by the walls and the substrate. The charging device alternatively includes a plurality of dielectrics and electrodes disposed along a first direction facing a drum so that the plurality of dielectrics sandwich the plurality of electrodes along a second direction perpendicular to the first direction, the dielectrics have a height larger than a height of the electrodes along the first direction, and at least two neighboring electrodes have different shapes.

The present invention relates to a charging device for used in a charger which charges a body such as a photosensitive body, transfer charger, discharger, or the like, and an electrophotographic apparatus such as a copying machine, printer, or facsimile.
Charging devices each for use in an image formation apparatus include a corona charging device, a roller charging device, a brush charging device, and a solid charging device. The corona charging device is the most popular one. The corona charging device has, however, a drawback such that it generates a very large amount of ozone. As a counter measure for this drawback, for example, Japanese laid open No. (hereafter referred to as JP-A) 9-114192 discloses a unit which reduces the ozone generating amount. In this unit, a discharge is performed by using a very thin wire of 40 to 50 microns, thereby reducing more than the half of the ozone generating amount.
JP-A-6-324556 discloses a unit in which a metal casing is arranged on three sides of a wire, a metal mesh electrode is arranged near the open side, and ozone generated from the wire is made remain to increase the probability of collision of ozone molecules, thereby reducing the amount of ozone released.
A roller charging device is disclosed in JP-A-56-91253 and is being actively examined in recent years. A brush charging device is disclosed in JP-A-55-29837 and so on. A solid charging device is disclosed in JP-A-54-53537.
JP-A-5-94077 discloses a device in which a number of discharge electrodes are arranged on an insulating member at very small intervals. JP-A-6-75457 discloses a technique where a distance between a charging device and a member on which recording is performed is set to a range of 500 to 3000 xcexcm so that ion flying distance can be shorten, thereby suppressing diffusion of ozone and to preventing adhesion of toner and the like.
JP-A-9-244350 discloses a discharging device comprising: a discharge electrode on a plate-shaped substrate; a creeping glow discharge unit arranged around the discharge electrode, and a cover which covers the whole discharging device. JPA-9-115646 discloses a method of reducing NOx by using a material of a specific work function as the material of an electrode of a plane solid discharging device.
JP-A-8-315958 discloses a solid discharging device in which a discharge electrode and a counter electrode which extend in parallel to each other on an insulating substrate are formed, a sharp edge-shaped electric field concentration part is formed at the periphery on the side facing the counter electrode of the discharge electrode, and the side facing the discharge electrode of the counter electrode is covered with an insulating film.
JP-A-11-95526 discloses a charging device in which a plurality of discharging units each can independently discharge are formed on a common substrate. Each of the discharging units comprises: a discharge electrode arranged facing a member to be charged which moves relatively, for generating charges applied to the member to be charged; and an ionization range control electrode which is arranged between the member to be charged and the discharge electrode and controls an ionization area of a discharge in an electric field between the charged member and the discharge electrode so as to be between the discharge electrode and the ionization range control electrode.
There is an ozone adsorbent for use in a charging device, which oxidizes generated ozone by a catalyst function such an activated carbon and another ozone absorbent adsorbs ozone on its surface. The social trend in recent years is that the environmental conscious has been being improved. Standards for regulating the generation amount of ozone, such as UL standard, TUV standard, and BAM standard, are set for an image formation apparatus of an electrophotographic system by a plurality of groups many countries and regions.
The corona charging device generates a very large amount of ozone.
In the techniques disclosed in JP-A-9-114192 and JPA-6-324556, the amount of ozone of at most about 50% can be reduced and it is necessary to use an ozone adsorbent or the like.
In the roller charging device, the generation of ozone can be suppressed very much. The device is consequently regarded as a promising one, but the charges on the charged body tend to be uneven. Moreover, toner contamination on the roller surface and vibration due to an AC bias to be applied occurs, and moire or the like often occurs in an image. Further, since it is a rotary member and the roller surface has to be cleaned, the number of members is large. Besides, there are inconveniences such as dielectric breakdown in a photosensitive layer of a photosensitive body as a body to be charged, which causes pin holes, vibration sound, track of a charging roller (plasticizer), permanent deformation of the roller, and the like.
In the brush charging device, stripe charging unevenness, environmental variation, low-temperature streamer discharge, white spot, photosensitive body wear, accumulation of a worn photosensitive body, coming off of a brush, melting of a brush due to abnormal discharge by a damage in the photosensitive member, and the like occur.
Since the ozone adsorber deteriorates with time, it is necessary to replace and maintain an ozone filter.
Although the solid charging device has advantages of its small size and the like, the discharge area is wide and discomfort substances such as ozone and NOx cannot be reduced as much as expected.
It is an object of the invention to provide a smaller charging device which can reduce ozone and NOx generated and diffused, uniformly charge the surface of a body to be charged, and does not produce a bad image caused by the charging device.
It is another object of the invention to provide a charging device and an electrophotographic apparatus capable of realizing reduced ozone and uniformly charging the body to be charged.
According to one aspect of the invention, at least a pair of linear electrodes is surrounded by walls and the substrate. Therefore, ozone generated and diffused and Nox can be reduced and the size of the device can be reduced.
Further, the longitudinal direction of each of the linear electrodes is in parallel with the axial direction of the charged body. Therefore, the larger amount of charges can be discharged.
Further, the longitudinal direction of each of the linear electrodes may be in parallel with the moving direction of the charged body. Therefore, the construction of an electrode can be also simplified.
Further, a plurality of pairs of the linear electrodes is arranged so that the longitudinal direction of each of the linear electrodes is oblique with respect to the moving direction of the charged body. Therefore, even when paper powders, toner particles and the like on the charged body are partially adhered to an electrode, charging by the electrode is helped by the neighboring electrode.
Further, the substrate may be arranged almost perpendicular to the charged body. Therefore, since the paper powders and toner particles on the charged body are not easily adhered, the charging can be stably controlled.
Further, the wall may be formed so as to extend in the direction except for the direction of the charged body of the line electrode. Therefore, a larger amount of ozone resides in the space sandwiched by the walls and decomposition of ozone is promoted.
Further, the pair of linear electrodes may be arranged so that their electrode faces are opposite to each other. Therefore, a larger amount of ozone resides in the space sandwiched and decomposition of ozone is promoted.
Further, the tips of the linear electrodes may have a saw-tooth shape. Therefore, by concentration of an electric line of force on the tips of the teeth of the electrodes, the efficiency of discharge increases so that charging is performed with a relatively low voltage.
According to another aspect of this invention, a first electrode forms on a first substrate, and a second electrode forms on a second substrate and faces the first electrode over an insulating wall. Discharge occurs by applying an AC voltage across the first and second electrodes. Therefore, generated ions and the like are captured in the space between the substrates and do not escape so that the density of ozone increases.
Further, a bias electrode arranged on the charged body side generates a bias electric field between the bias electrode and the charged body may be also provided. Therefore, the charging amount of the charged body can be arbitrarily controlled. Furthermore, the bias electrode may be integrally formed with the body of the charging device. Therefore, the electrode can efficiently ejects only charges of a necessary polarity among charges generated by the discharge toward the body to be charged.
According to still another aspect of this invention, in a charging device having a space as an ion generating area defined between dielectrics sandwiching electrodes, the neighboring electrodes partially have different shapes. Therefore, the area where the electric field intensity is high is formed, and discharge occurs with a low voltage.
According to still another aspect of this invention, in a charging device having a space as an ion generating part defined between dielectrics sandwiching electrodes, an electrode forms a predetermined angle with a face of each of the dielectrics sandwiching the electrode. Therefore, the area where the electric field intensity is high is formed, and discharge occurs with a low voltage.
Further, in the charging device according to still another aspects of this invention, electrodes which are bilaterally symmetrical may be lined. Therefore, the area where the electric field intensity is high is formed, and discharge occurs with a low voltage.
Further, electrodes of the same shape may be lined. Therefore, with the above structure, the area where the electric field intensity is high is formed, and discharge occurs with a low voltage.
Further, the central part in cross section of the electrode maybe recessed. Therefore, with the above structure, the area where the electric field intensity is high is formed, and discharge occurs with a low voltage.
Further, three or more electrodes may be lined. Therefore, the discharge area becomes wider.
According to still another aspect of this invention, in a charging device having a space as an ion generating area defined between dielectrics sandwiching electrodes, the neighboring electrodes have a step in an ion ejecting direction, three or more electrodes are lined, and an electrode sandwiched by electrodes via dielectrics is recessed in the ion ejecting direction from the electrodes on both sides. Therefore, the area where the electric field intensity is high is formed, and discharge occurs with a low voltage.
Further, neighboring electrodes may have a step in an ion ejecting direction, three or more electrodes may be lined, and an electrode sandwiched by electrodes via dielectrics may be recessed in the ion ejecting direction from the electrodes on both sides. Therefore, the area where the electric field intensity is high is formed, discharge occurs with a low voltage.
Further, neighboring symmetrical electrodes may be paired, each of the pair of electrodes may be sandwiched by dielectrics, and the pair of electrodes may be recessed in the ion ejecting direction from the electrodes on both sides. Therefore, the area where the electric field intensity is high is formed, discharge occurs with a low voltage.
Further, the electrodes on both sides may be closed to the pair of electrodes. Therefore, the area where the electric field intensity is high is formed, discharge occurs with a low voltage.
Further, two or more sets each having the dielectrics, the pair of electrodes, and the electrodes on both sides may be lined. Therefore, the discharge area becomes wider.
Further, a grid electrode may be provided between the ion generating area and the charged body. Therefore, the discharge potential can be certainly obtained.
According to still another aspect of this invention, an electrophotographic apparatus comprises one of the above charging devices. Therefore, an electrophotographic apparatus which produces a small amount of ozone exhaust can be realized without using and ozone filter.
Other objects and features of this invention will become apparent from the following description with reference to the accompanying drawings.

Charging device with walls surrounding the electrodes which reduce ozone emissions


A method of analyzing a software program includes compiling the software program into an intermediate representation. The method also includes finding an instruction in the intermediate representation that matches a pattern in a check pattern. The method also includes generating an instrumented intermediate representation in which the instruction is modified according to an action specified in the check pattern. The method also includes symbolically executing the instrumented intermediate representation.

Dynamic checkers are used to check for the presence of various kinds of errors in software programs, such as assertion failures or violations, memory errors, and divide-by-zero errors to name a few. Examples of popular tools with dynamic checker functionality include some memory analyzers, profilers, and coverage analyzers.
In a typical implementation, a dynamic checker analyzes a software program by executing the software program using a test suite including one or more concrete inputs. The concrete inputs are identified and provided manually by a user. To detect errors, a user has to provide concrete inputs that trigger the errors. Accordingly, it is difficult to maintain a high-quality test suite which exercises sufficiently many paths in the software program and which catches corner-case bugs.
Symbolic execution is a technique for dynamically analyzing a software program. Symbolic execution uses as input values symbolic values instead of actual data and represents values of program variables as symbolic expressions. As a result, the outputs computed by a software program that is symbolically executed are expressed as a function of the symbolic inputs. Through symbolic execution, each path within a software program may be symbolically executed.
Some dynamic checkers implement symbolic execution, and may be referred to as symbolic execution based dynamic checkers. Conventional symbolic execution based dynamic checkers have limited defect detection, such as detection of simple memory errors including null pointer errors and out-of-bound access errors. Moreover, the detectable types of defects in conventional symbolic execution based dynamic checkers are hardcoded such that users are unable to easily change the types of defects that are detected.
The subject matter claimed herein is not limited to embodiments that solve any disadvantages or that operate only in environments such as those described above. Rather, this background is only provided to illustrate one example technology area where some embodiments described herein may be practiced.

Programmable symbolic execution based dynamic checker


A signal processing device that generates an output signal from image data by using a clock corresponding to the pixels of the image data, the signal processing device includes: a delayed signal group generating unit that generates a group of delayed signals with a delay element group formed with stages of delay elements; a clock adjusting unit that generates a modulation/synchronization clock from the group of delayed signals by referring to phase data matching the clock with a predetermined phase and frequency modulation coefficient data converting the clock to a predetermined frequency; and a PWM processing unit that generates a PWM signal from the group of delayed signals by referring to the phase data, the frequency modulation coefficient data, the modulation/synchronization clock, and the image data, the PWM signal having a pulse width corresponding to the value of the image data.

Field of the Invention
The present invention relates to a signal processing device that performs signal processing with an accuracy within one clock pulse, a signal processing method, and an image forming apparatus for performing signal processing and image formation with an accuracy within one clock pulse, using a group of delayed signals generated by a delay element group delaying a clock.
Description of the Related Art
A known image forming apparatus forms an image equivalent to one line or a few lines in the main scanning direction in accordance with image data, and also forms an image equivalent to one page by repeating, in the sub scanning direction, image formation of each line in the main scanning direction.
In the image formation in the main scanning direction in accordance with image data, positioning is performed based on a clock that serves as the reference clock for the pixels to be formed, or a clock called "pixel clock" or "dot clock".
For example, an electrophotographic image forming apparatus scans with a laser beam modulated in accordance with image data in the main scanning direction, and at the same time, forms an image with the laser beam on an image bearing member rotating in the sub scanning direction. In this case, the laser beam is modulated with the image data in synchronization with the above described clock.
There is a technique for performing signal processing such as a PWM process with an accuracy within one clock pulse by generating a group of delayed signals with a delay element group delaying the clock in a number of stages, and selecting a delayed signal pulse of a desired time from the group of delayed signals.
FIG. 6 shows a specific example where a signal processing circuit 1 that performs a PWM process with an accuracy within one clock pulse is used in an image forming apparatus.
The flowchart in FIG. 7 shows operation of the signal processing circuit 1. FIG. 8 is a timing chart showing states of various kinds of signals to be processed by the signal processing circuit 1.
A clock generating unit 5 generates the reference clock (reference CLK) at a frequency suitable for forming an image of an originally intended size (step S11 in FIG. 7). Specifically, an image of an originally intended size can be formed by arranging a predetermined number of dots with PWM signals generated with the reference clock (reference CLK) used as the pixel clock.
Here, the clock frequency needs to be adjusted by several percent through adjustment of the size of the images to be formed on the front and back of a paper sheet or partial magnification of images for various kinds of distortion correction or the like. So as to adjust the position of an image on a paper sheet, the clock phase needs to be adjusted in some cases.
A frequency modulating unit 10 generates a modulation clock by minutely adjusting (changing) the frequency of the reference clock. In this case, a delay element group 12 generates a group of delayed signals by minutely delaying the phase of the reference clock (step S14 in FIG. 7). For example, the delay element group 12 delays the pulse of one cycle of the divided reference clock by approximately 1/100 stage, to generate the group of delayed signals. A selecting unit 16 selects a suitable delayed signal from the group of delayed signals, so that the modulation clock having the frequency of the reference clock changed by ±1% can be generated.
A delay amount measuring unit 13 can measure the delay time in one stage of the group of delayed signals based on how many stages of the delayed signals are equivalent to one cycle of the reference clock (step S15 in FIG. 7). In this case, the reference clock is as accurate as crystal oscillation. Accordingly, even if the delay time of the group of delayed signals changes due to temperature or time, it is possible to recognize the delay time.
Frequency modulation coefficient data indicating to what extent the reference clock is to be changed is supplied from outside (step S12 in FIG. 7), and a timing calculating unit 14 refers to the delay time measured by the delay amount measuring unit 13 with respect to one stage of the group of delayed signals, and calculates the necessary number of stages of delayed signals for changing the reference clock to a desired frequency (step S16 in FIG. 7). The selecting unit 16 selects an optimum delayed signal pulse from the group of delayed signals, and outputs the selected pulse as the modulation clock (step S17 in FIG. 7).
For example, an instruction to increase the frequency of a 50 MHz reference clock by 4% is given as the frequency modulation coefficient data. In this case, the number of stages of delayed signals to be selected from the group of delayed signals is gradually changed, so that a modulation clock of 52 MHz, which is 4% higher than 50 MHz as desired, is generated.
Here, "modulation" is not the same as modulation in communications (multiplication of carrier waves by information), but means a change in the frequency of a clock. As suitable delayed signals are selected from the group of delayed signals in generating the modulation clock, it is difficult to accurately obtain a 52 MHz modulation clock. The frequency fluctuates up and down, and a mean frequency of 52 MHz is eventually obtained.
The modulation clock is then input to a synchronizing unit 20 in the next stage. This synchronizing unit 20 has the same circuit configuration as that of the above described frequency modulating unit 10. In this synchronizing unit 20, the phase and the position of the pulse with respect to the modulation clock are changed in accordance with data supplied from outside, and a synchronization clock is generated.
In this case, a delay element group 22 generates a group of delayed signals by minutely delaying the phase of the modulation clock (step S18 in FIG. 7). For example, the delay element group 22 delays the pulse of one cycle of the reference clock by approximately 1/100 stage, to generate the group of delayed signals. A selecting unit 26 selects a suitable delayed signal from the group of delayed signals, so that the phase of the modulation clock can be changed by ±1%, and a synchronization clock synchronized with a predetermined phase can be generated. Here, the synchronization clock is generated so as to be synchronized with sensor data and phase data that are input from outside.
In this synchronizing unit 20 operating in the same manner as the frequency modulating unit 10 described above, sensor data and phase data that indicate with which phase the reference clock is to be synchronized are supplied from outside (step S12 in FIG. 7), and a timing calculating unit 24 refers to the delay time measured (step S19 in FIG. 7) by a delay amount measuring unit 23 with respect to one stage of the group of delayed signals, and calculates the necessary number of stages of delayed signals for synchronizing the modulation clock with a desired phase (step S20 in FIG. 7). The selecting unit 26 selects an optimum delayed signal pulse from the group of delayed signals, and outputs the selected pulse as the synchronization clock (step S21 in FIG. 7).
The synchronization clock is then input to a PWM processing unit 30 in the next stage. This PWM processing unit 30 has almost the same circuit configuration as those of the frequency modulating unit 10 and the synchronizing unit 20 described above. Here, a PWM signal having a pulse width in accordance with the value of image data is generated from the synchronization clock.
In this case, a delay element group 32 generates a group of delayed signals by minutely delaying the phase of the synchronization clock (step S22 in FIG. 7). For example, the delay element group 32 delays the pulse of one cycle of the reference clock by approximately 1/100 stage, to generate the group of delayed signals. A selecting unit 36 selects a suitable delayed signal from the group of delayed signals, so that a PWM signal having a leading edge and a trailing edge selected by ±1% can be generated. Here, a PWM signal is generated so as to have the pulse width corresponding to the value of image data that is input (step S13 in FIG. 7) from outside.
In the PWM processing unit 30 operating in the same manner as the frequency modulating unit 10 and the synchronizing unit 20 described above, a timing calculating unit 34 refers to the delay time measured (step S23 in FIG. 7) by a delay amount measuring unit 33 with respect to one stage of the group of delayed signals and the value of image data, and calculates the number of stages of delayed signals having the necessary edges (leading and trailing edges) for generating a PWM signal of a desired pulse width (step S24 in FIG. 7). A pulse generating unit 36 then selects an optimum delayed signal pulse from the group of delayed signals based on a result of the calculation, and generates the PWM signal (step S25 in FIG. 7).
In accordance with the pulse width of the PWM signal to be generated by the pulse generating unit 36, a dividing unit 31 is provided on the input side of the delay element group 32, and divides the synchronization clock. So as to adjust the timing of the image data to the synchronization clock at the time of the calculation by the timing calculating unit 34, a synchronizing unit 35 synchronizes the image data with the synchronization clock.
In FIG. 8, a group of delayed signals (a1) is generated from the reference clock (a0), desired delayed signals are selected, and the modulation clock (a2) is generated. Here, the reference clock is equivalent to eight pulses of the delayed signals, and the modulation clock is equivalent to seven pulses of the delayed signals. A group of delayed signals (b1) is also generated from the modulation clock (a2), desired delayed signals are selected, and the synchronization clock (b2) is generated. A group of delayed signals (c1) is further generated from the synchronization clock (b2), desired delayed signals are selected, and the PWM signal (c2) is generated. Here, the PWM signal (c2) is generated in a case where the following situation is repeated three times: pixel value=70%, position=right-adjusted, pixel value=30%, and position=left-adjusted.
Relationships between clock synchronization and image data are disclosed in JP 2001-221965 A and JP 2010-194730 A, for example.
In the example described above with reference to FIGS. 6 to 8, the clock frequency can be adjusted in accordance with adjustment of the size of the images to be formed on the front and back of a paper sheet and partial magnification of an image, and the phase of the clock for adjusting the position of an image on a paper sheet can be adjusted.
However, the timing chart shown in FIG. 8 shows an ideal state, and might differ from a state in reality (as shown in the timing chart in FIG. 9, for example).
In FIG. 9, a group of delayed signals (a1) is generated from the reference clock (a0), desired delayed signals are selected, and the modulation clock (a2) is generated.
Here, the reference clock is designed to be equivalent to eight pulses of the delayed signals, and the modulation clock is designed to be equivalent to seven pulses of the delayed signals.
However, when the modulation clock is generated through selection of desired delayed signals from the group of delayed signals, the leading edge or the trailing edge of the modulation clock can be changed only once in one pulse of the reference clock. Therefore, in the example shown in FIG. 9, the number of selected pulses vary from eight pulses to seven pulses to six pulses, for example, with the average being seven pulses.
A group of delayed signals (b1) is also generated from the modulation clock (a2), desired delayed signals are selected, and the synchronization clock (b2) is generated. A group of delayed signals (c1) is further generated from the synchronization clock (b2), desired delayed signals are selected, and the PWM signal (c2) is generated.
In FIG. 9, the group of delayed signals (a1), the group of delayed signals (b1), and the group of delayed signals (c1) are delayed signal groups that are generated independently of one another. Therefore, the pulses appear to be the same in the schematic diagram in FIG. 9, but in practice, each pulse contains an error component.
Here, the PWM signal (c2) is generated in a case where the following situation is repeated three times: pixel value=70%, position=right-adjusted, pixel value=30%, and position=left-adjusted.
At a portion d11 of the PWM signal, there is a blank portion at the portion that is right-aligned and is 70% in pixel value. This is because, where the pixel value is 70%, one clock is assumed to be seven pulses, and the start is moved to the right by two pulses. In practice, however, one clock is eight pulses, and a blank portion equivalent to one pulse is formed at the right end portion.
At a portion d12 of the PWM signal, the portion that is right-aligned and is 70% in pixel value is smaller than the originally intended size. This is because, where the pixel value is 70%, one clock is assumed to be seven pulses, and the start is moved to the right by two pulses. In practice, however, one clock is six pulses, and therefore, the one pulse at the right end portion is left out. Having been subjected to the frequency modulation, the synchronizing process, and the PWM process as described above, the PWM signals based on the same image data do not have the same pulse widths as one another. This leads to image quality deterioration.
As is apparent from FIGS. 6 and 7, in the entire apparatus, the three delay element groups positioned in series generate the respective groups of delayed signals. As a result, delay variations that occur in the respective delay element groups accumulate.
If delay variations are completely random and do not have correlation with one another, the delay variations are not multiplied (three times) by the three stages in some cases. However, the same delay element groups are used in the same environments in this case. Therefore, delay variations in the same direction accumulate, and are predicted to actually lead to a large delay variation.
Since different frequencies and different phases are used in generating the modulation clock from the reference clock, generating the synchronization clock from the modulation clock, and generating the PWM signal from the synchronization clock, the respective delay element groups need to be provided independently of one another, and cannot be integrated into one delay element group.
Specifically, in a case where a group of delayed signals generated by a delay element group delaying the clock, and signal processing is performed with an accuracy within one clock pulse in the respective stages of the clock frequency modulation, the clock synchronization, and the PWM process, delay variations of the delay elements accumulate, leading to a large error. Due to the delay variations, the pulse widths of PWM signals (or densities in an image forming apparatus) vary, and image quality deterioration is caused.
Since a delay element group is required for each function, the circuit size becomes large. In a case where minute delay times are set so as to cope with high resolution, the circuit size of each delay element group becomes large, and therefore, the problem of circuit size becomes a very serious issue.
Although image densities in an image forming apparatus have been described as a specific example, the image densities can be regarded as signal values in a signal processing device.
Any of the above mentioned patent literatures cannot solve the above problem, and do not consider the above problem as a serious issue.

Signal processing device, signal processing method, and image forming apparatus


Provided are two-dimensional autofocus methods in a synthetic aperture radar (SAR) system which include: (1) two-dimensional pulse pair product algorithm including shear PGA, eigenvector phase history (“EPH”), shear PGA/EPH); (2) two-dimensional optimization algorithms including parametric one-dimensional estimate/two-dimensional correction, parametric two dimensional estimate/two-dimensional correction, unconstrained two-dimensional nonparametric and constrained two-dimensional nonparametric methods; (3) a two-dimensional geometry filter algorithm; (4) a two-dimensional prominent point processing algorithm; (5) a one-dimensional phase estimate of higher order two dimensional phase errors; and, (6) a fast SHARP parametric autofocus algorithm.

1. Field of the Invention
The present invention relates to two-dimensional autofocus methods in a Synthetic Aperture Radar ("SAR") systems. More specifically, the present invention relates to two-dimensional autofocus methods which compensate both on and off-axis distortions in SAR signal history.
2. Discussion of Background Information
Synthetic aperture radar ("SAR") systems typically involve a single radar antenna mounted on a moving platform. Data is generally collected using an antenna having a relatively small aperture. Because the antenna is mounted on a moving platform, a series of recurring radar pulse returns from the same target may be received by the antenna at different spatial locations. These returns may then be synthesized during processing, thereby simulating the use of a much larger antenna aperture. As such, it is possible to create an image having a higher azimuth resolution than would be possible with the same antenna at a stationary position.
It is well known that phase errors often cause a SAR image to be out of focus. These phase errors may be the result of uncompensated motion between the SAR antenna and the scene being imaged, algorithm approximations, hardware limitations or propagation effects. Therefore, to improve image quality, it is desirable to remove, compensate for or correct for these phase errors.
Generally, one or more autofocus algorithms are used to remove or correct for these phase errors. The algorithms are typically computer-implemented estimations that are applied to the SAR signal history to remove or compensate for any degradation of the received signals. Previous systems have utilized autofocus methods such as mapdrift, pulse pair product (including phase gradient autofocus ("PGA"), shear PGA, eigenvector phase history and phase difference autofocus), contrast optimization and prominent point processing.
However, these previous methods are only capable of removing one-dimensional phase error. That is, only phase errors which appear as distortions of a target in the cardinal (i.e., range and azimuth) directions may be removed. While one-dimensional autofocus is sufficient for mid-resolution SAR systems where the dwell angle is relatively small, as the resolution of a SAR system increases, non-linear target distortions become more significant due to an increased dwell angle.

Methods for two-dimensional autofocus in high resolution radar systems

General Dynamics Advanced Information Systems, Inc.


A memory card with a smart card function including a flash memory unit, a data processing control unit, and a power control unit is provided. The data processing control unit is coupled to the flash memory unit. The data processing control unit controls the flash memory unit and encrypts, decrypts and stores smart card security data. The power control unit receives at least one of a first power input and a second power input. The power control unit selects the first power input or the second power input and provides the selected one to the data processing control unit according to at least one control signal. An output terminal of the power control unit is coupled to the first power input. Furthermore, a power control method and a power control circuit of the forgoing memory card are also provided.

1. Technology Field
The disclosure generally relates to a power control method and a power control circuit, and more particularly, to a power control method and a power control circuit for a memory card with a smart card function.
2. Description of Related Art
Smart cards have been broadly used along with the widespread use of e-wallet and prepayment applications. A smart card is an integrated circuit (IC) card embedded with such components as a microprocessor, a card operating system, a security module, and a memory and which allows a card holder to perform various predetermined operations. Besides the function of data storage, a smart card also offers calculation, encryption, bidirectional communication, and security functions such that data stored in the smart card can be protected. A subscriber identification module (SIM) card used in a GSM (Global System for Mobile Communications) cellular phone is one of the many applications of smart cards. Generally speaking, a smart card has very limited storage capacity due to the specification of the IC therein.
Generally speaking, a user can access data in a memory card through a card reader. Thus, in an application wherein a smart card is integrated with a memory card, data stored in the memory card and the smart card can only be read through a card reader in a contact manner. However, along with the development of near field communication (NFC), many contactless sensing techniques have been broadly applied in our daily life, such as transit fare cards and access cards, etc.
Accordingly, a memory card combined with a smart card and a contactless access function such as a Micro Secure Digital (micro SD) memory card is developed. This kind of memory card receives different power inputs when being read by a reading apparatus within a host system under different conditions. Hence, if the smart card circuit inside the memory card can not work normally when any one of different power inputs is supplied, then the application range thereof will be significantly limited.
Nothing herein should be construed as an admission of knowledge in the prior art of any portion of the disclosure. Furthermore, citation or identification of any document in this application is not an admission that such document is available as prior art to the disclosure, or that any reference forms a part of the common general knowledge in the art.

Dividing a power input and directly providing divided power to an output terminal in a power control circuit


Retainer for threaded fasteners such as the cap screws that secure the end caps of roller bearing assemblies to railroad axles. A locking plate is constrained against rotation relative to the fastener, a lock ring having a plurality of openings disposed along a circular path is placed over the head of the fastener, with the fastener being received in a non-circular central opening in the ring and thereby constrained against rotation relative to the ring, and tabs extending from the locking plate and engaging the lock ring through the openings to retain the lock ring on the fastener and prevent the lock ring and fastener from turning. In the disclosed embodiments, the ring can be placed on the fastener in different rotative positions, and the number of tab openings is either a prime number or another number that is not divisible by factors of the number of ring positions, whereby the fastener can be selectively locked in a relatively large number of different positions no more than a few degrees apart.

1. Field of Invention
This invention pertains generally to threaded fasteners and, more particularly, to a locking retainer for preventing threaded fasteners such as the cap screws which secure the end caps of roller bearing assemblies to the axles of railroad cars from working loose.
2. Related Art
Roller bearing are commonly mounted on the axles which carry the total weight of railroad cars and locomotives, with end caps retaining lubricant and holding the bearings in position on the axles. The end caps are attached to the axles by cap screws which must be tightened to the proper torque and provide adequate clamp load to ensure correct alignment and lubrication of the bearings. Otherwise, the bearings may become damaged, requiring unscheduled maintenance, and in the worst case, cause a derailment.
After the cap screws are tightened to the desired torque, tabs on current locking plates are bent against the heads of the screws to prevent them from working loose and turning. However, the screws can still work loose and turn, especially if the tabs break off or do not squarely engage the flat faces of the screw heads. Moreover, when the screws are turned to bring the flat faces into parallel alignment with the tabs, the screws may exceed the proper torque, which can lead to bearing failure and potential derailment of the train.


A method and system for determing the approximate distance from a golf ball to the golf cup on the golf-green is described. The system stores the location of the golf cup in computer memory and determines the location of a global positioning satellite receiver positioned near the golf ball. The system calculates the distance between the golf cup location and the receiver location. Preferably, the receiver includes a display of the golf hole being played, with the location of the receiver on the hole, the golf cup on the green, and the distance to the golf cup being displayed. In a preferred form the player can designate a mark on the display and find out the distance from the receiver to the mark or the distance from the mark to the golf pin. The position of the receiver is error corrected, with the error correction preferably calculated using a reference global positioning satellite receiver positioned at a known location. The known location is compared to the apparent position to calculate the error correction. The error correction is periodically transmitted and the remote receiver calculates the distance from the remote receiver to the golf cup for the hole being played using the transmitted error correction. Using an error corrected position enables distance calculation accuracy to within several meters even using global positioning satellite system "c" code with selective availability enabled. The method and system of the present invention allows the golfer to accurately select the proper club for the shot, plan a shot strategy for the hole, and to decrease playing time.

1. Field of the Invention
The present invention relates to a method and apparatus for determining the distance between a golf ball and the golf cup. In particular, the method and apparatus uses a global positioning satellite receiver positioned near the golf ball to determine the approximate location of the golf ball.
2. Description of Related Art
In the game of golf it is important to know as accurately as possible the distance between the golf ball and the golf cup on the green. It is sometimes also desirable to know the distance between the golf ball and a hazard on the hole being played. Knowing these distances allows proper club selection and allows a player to formulate a hole management plan. For example, a player that knows the ball is 110 yards from the pin would select the appropriate club for 110 yards such as a 9 iron or one of the player's wedges.
Deane Beamon and Jack Nicklaus purportedly pioneered in professional tournament play the use of books containing yardage calculations. Most PGA professionals and serious amateurs now use course yardage books to determine the distance between the ball and the golf cup or a hazard on the hole being played. Yardage books are significantly more accurate than guessing the distance based on a visual inspection.
A significant drawback to the use of yardage books is the fact that the book must be prepared prior to the round of golf. Such preparation is inconvenient for most amateur play in recreational golf. Even where a yardage book is prepared, account must be made for the location of the tee markers, the location of the golf cup on the green for the particular day, and the position on the hole being played.
There are several alternatives to yardage books for determining the distance from the ball to the golf cup. Most courses mark the hole in some form with approximate distances to the middle of the green. For example, many courses mark the sprinkler heads with distance to the green, while other courses plant trees or post a marker at the 100 or 150 yard position from the middle of the green. Some courses have buried low power location beacons along their fairways and a receiver carried by the golfer receives the nearest beacon signal and indicates the distance of the beacon.
There are several disadvantages to known techniques for distance determination on golf courses. First, they are all have varying degrees of inaccuracy. Typically the distances follow some unknown line in the fairway and are calculated for the middle of the green. Inaccuracies of more than 10 yards are common which unfortunately can be the difference between a 6 foot putt and a sand trap. Second, most known techniques slow play by requiring the player to consult his yardage book or walk around searching for a distance marker and walking off the distance from the marker to the ball. Third, most techniques do not give an indication of the distance to most, if not all, of the hazards. For example, it is important to know the distance the ball needs to travel to carry a trap or water hazard in front of the green.
Therefore, a method and apparatus which could accurately and quickly determine the distance between the ball and the golf cup on the green would contribute to lower scores and faster play. Such a method and apparatus would be particularly advantageous if it also accounted for distance between the ball and an obstacle or hazard.

Golf distance measuring system and method