A polishing apparatus and method has a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film such as copper film deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The polishing apparatus comprises a surface polishing mechanism comprising a polishing table having a polishing surface and a top ring for holding the substrate and pressing the substrate against the polishing surface of the polishing table to thereby polish a surface of the substrate, and an outer periphery polishing mechanism for polishing an outer peripheral portion of the substrate.

1. Field of the Invention
The present invention relates to a polishing apparatus and method for polishing a surface of a workpiece such as a semiconductor wafer, and more particularly to a polishing apparatus and method having a function of polishing a surface of a film formed on a substrate to a flat mirror finish and a function of polishing unnecessary metal film or the like, particularly copper (Cu) film, deposited on an outer peripheral portion of the substrate to remove such unnecessary metal film. The present invention also relates to an outer periphery polishing apparatus for polishing an outer peripheral portion of a substrate to remove unnecessary metal film or the like deposited on the outer peripheral portion of the substrate.
2. Description of the Related Art
Generally, aluminum or aluminum alloys have been used as a material for forming interconnects (interconnections or wiring) for a semiconductor substrate. However, in recent years, there has been a growing tendency to replace aluminum or aluminum alloys with copper having a low electric resistivity and a high electromigration resistance. Copper interconnects of this kind are generally formed by filling copper into minute trenches or via holes preformed in the surface of the substrate. As a means for filling copper into the minute trenches or via holes, there are various methods including CVD, sputtering, and plating, and in every method, copper is deposited over a substantially entire surface of the substrate, and then unnecessary copper is removed by a chemical mechanical polishing (CMP).
FIGS. 13A through 13C show successive steps of manufacturing copper interconnects in a substrate such as a semiconductor wafer. As shown in FIG. 13A, an oxide film 2 of SiO2 is deposited on a conductive layer 1a on a semiconductor substrate 1 on which semiconductor devices are formed. Then, a via hole 3 and a trench 4 for a predetermined interconnect pattern are formed in the oxide film 2 by lithography and etching. Thereafter, a barrier layer 5 of TiN or TaN or the like is formed, and then a seed layer 7 to supply electric current for electroplating is formed on the barrier layer 5 by film deposition.
Then, as shown in FIG. 13B, the entire surface of the semiconductor substrate 1 is coated with copper by electroplating to deposit a copper layer 6 on the entire surface, thus filling the via hole 3 and the trench 4 with copper. Thereafter, the copper layer 6 on the barrier layer 5 and the barrier layer 5 are removed by chemical mechanical polishing (CMP), thus making the copper layer 6 in the via hole 3 and the trench 4 lie flush with the oxide film 2. In this manner, an interconnect composed of the copper layer 6 is produced as shown in FIG. 13C.
In this case, the barrier layer 5 is formed so as to cover substantially the entire surface of the oxide film 2, and the seed layer 7 is also formed so as to cover substantially the entire surface of the barrier layer 5. Thus, in some cases, as shown in FIG. 14, a sputtering film of copper which is the seed layer 7 resides in a bevel (outer peripheral portion) of the substrate W, or copper is deposited on an edge (outer peripheral portion) inwardly of the bevel and remains unpolished (not shown in FIG. 14).
Copper can easily be diffused into an oxide film in a semiconductor fabrication process such as annealing, thus deteriorating the electric insulation of the oxide film and impairing the adhesiveness of the oxide film with a film to be subsequently deposited to possibly cause separation of the deposited film. It is therefore necessary to remove the remaining unnecessary copper completely from the substrate before at least film deposition. Furthermore, copper deposited on the outer peripheral portion of the substrate other than the circuit formation area is not only unnecessary, but may cause cross contamination in subsequent processes of delivering, storing and processing the substrate. For these reasons, it is necessary that the remaining deposited copper on the peripheral portion of the substrate be completely removed immediately after the copper film deposition process or the CMP process.
Here, the outer peripheral portion of the substrate is defined as an area including an edge and a bevel of the substrate, or either the edge or the bevel. The edge of the substrate means areas of the front and back surfaces within about 5 mm from the outer peripheral end of the substrate, and the bevel of the substrate means an area of the outer peripheral end surface and a curved portion in a cross section within 0.5 mm from the outer peripheral end of the substrate.
There has been generally known an edge polisher for polishing a bare silicon wafer, but there has heretofore been no polishing apparatus for polishing only an outer peripheral portion of a substrate having a film formed thereon.
This kind of edge polisher for polishing a bare silicon wafer generally comprises a substrate holder and a polishing member. In the embodiment shown in FIG. 15, the substrate holder 304 is composed of a robot hand 302 which extends vertically and has a holding portion 300 at a lower end thereof, and is movable in vertical and horizontal directions. The substrate W such as a silicon wafer is held by the holding portion 300 of the robot hand 302 under vacuum in such a state that the substrate W is inclined with respect to the horizontal plane and the edge of the substrate W is externally exposed. The polishing member 312 comprises a cylindrical support member 306 and a polishing cloth 308, and has a polishing surface 310 which is formed by a surface of the polishing cloth 308 affixed on a side surface of the cylindrical support member 306. With this arrangement, while the edge of the substrate W is brought into contact with the polishing surface 310, at least one of the substrate holder 304 and the support member 306 is rotated, and the substrate W is simultaneously moved up and down along the polishing surface 310 by the substrate holder 304, thereby polishing the edge of the substrate W.
When the entire surface of the edge of the substrate W is polished by this kind of edge polisher, one side of the edge of the substrate W is polished, and then the substrate W is reversed and held again by the substrate holding member 304. Thereafter, the other side of the edge of the substrate W is polished.
Therefore, if the outer peripheral portion of the substrate having a film formed thereon is polished by the edge polisher for polishing a bare silicon wafer, this polishing work is required to be performed separately at a location different from the polishing work of the surface of the substrate. Thus, this polishing work is considerably troublesome. Further, in this kind of edge polisher, the outer peripheral portion of the substrate (workpiece) is polished while the outer peripheral portion of the substrate is brought into point contact with the polishing surface at a point along a circumferential direction of the substrate, and hence the polishing rate thereof is generally low and it takes much time to complete polishing.
The present invention has been made in view of the above drawbacks. It is therefore a first object of the present invention to provide a polishing apparatus and method which can perform quickly a polishing operation of an outer peripheral portion of a workpiece such as a substrate having a film (particularly metal film) formed thereon as a series of polishing operations accompanying a primary polishing work of a surface of a substrate, and which can polish the outer peripheral portion of the workpiece efficiently.
A second object of the present invention is to provide an outer periphery polishing apparatus, for polishing an outer peripheral portion of a substrate, which can polish the outer peripheral portion of the substrate efficiently and be of compact construction.
Here, a surface of a substrate means a surface of a workpiece such as a semiconductor wafer on which a film or interconnects are formed.
According to one aspect of the present invention, there is provided a polishing apparatus for polishing a workpiece, comprising: a surface polishing mechanism for polishing a surface of the workpiece, the surface polishing mechanism comprising a polishing table having a polishing surface, and a top ring for holding the workpiece and pressing the workpiece against the polishing surface of the polishing table; and an outer periphery polishing mechanism for polishing an outer peripheral portion of the workpiece.
According to the present invention, polishing of the outer peripheral portion of the workpiece can be quickly conducted by the outer periphery polishing mechanism disposed adjacent to the polishing table as a series of processes before or after a primary polishing of a surface of the workpiece is conducted by the polishing table.
In a preferred aspect of the present invention, the top ring is constructed such that the top ring is movable in a vertical direction and a horizontal direction, and the outer periphery polishing mechanism is disposed at a position to which the top ring is movable, and has an outer periphery polishing unit having an outer periphery polishing surface for polishing the outer peripheral portion of the workpiece by contacting the outer peripheral portion of the workpiece held by the top ring.
With the above arrangement, the workpiece is held by the top ring and pressed against the polishing table to thereby conduct a primary polishing of the workpiece, and then the outer peripheral portion of the workpiece is polished by pressing the outer peripheral portion of the workpiece against the outer periphery polishing surface while the workpiece is being held by the top ring. Thereafter, the polished workpiece is transferred to a next process. Further, the outer peripheral portion of the workpiece is polished by bringing the outer peripheral portion of the workpiece into contact with the outer periphery polishing surface over an entire length along a circumferential direction of the workpiece and by rotating the workpiece and the polishing surface relatively to each other, i.e. rotating at least one of the workpiece and the polishing surface. Thus, the outer peripheral portion of the workpiece can be polished efficiently at a low pressure.
In a preferred aspect of the present invention, the outer periphery polishing unit is rotatable about its own axis, and is provided with a polishing liquid supply port around a rotational center of the outer periphery polishing unit for supplying a polishing liquid to the outer periphery polishing surface by a centrifugal force caused by the rotation of the outer periphery polishing unit.
With this arrangement, the polishing liquid can be supplied to the outer periphery polishing surface from a position below the workpiece.
In a preferred aspect of the present invention, the workpiece comprises a substrate on which copper interconnects are formed.
In this case, the polishing liquid has a polishing rate for copper which is at least ten times greater than that for an oxide film or a low-K material.
In a preferred aspect of the present invention, the outer periphery polishing surface is upwardly inclined with respect to the horizontal plane in a radially outward direction.
In this case, the inclination angle of the polishing surface can be determined on the basis or the hardness of material constituting the outer periphery polishing surface, the shape of the outer peripheral portion of the substrate, the cutting width at the outer peripheral portion, or a pressing force applied to the workpiece during polishing so that the lower half, and a portion slightly thereabove, of the outer peripheral portion of the workpiece may be brought into contact with the outer periphery polishing surface or the cutting width of the outer periphery portion of the workpiece may be freely adjusted.
According to another aspect of the present invention, there is provided a polishing method for polishing a workpiece, comprising: polishing a surface of the workpiece by pressing the surface of the workpiece against a polishing surface of a polishing table under a predetermined force; and polishing an outer peripheral portion of the workpiece before or after the polishing of the surface of the workpiece.
According to still another aspect of the present invention, there is provided an outer periphery polishing apparatus for polishing an outer peripheral portion of a substrate, comprising:
a substrate holder for holding the substrate so as to allow an outer peripheral portion of the substrate to be exposed externally; a polishing unit having a polishing surface located at a position facing the outer peripheral portion of the substrate held by the substrate holder; a rotating mechanism for rotating at least one of the substrate holder and the polishing unit; and a moving mechanism for moving at least one of the substrate holder and the polishing unit to bring the substrate holder and the polishing unit into engagement with each other and separate the substrate holder and the polishing unit from such engagement.
According to the present invention, the outer peripheral portion of the substrate is polished by bringing the outer peripheral portion of the substrate into contact with the outer periphery polishing surface over the entire length along the circumferential direction of the substrate and by rotating the substrate and the polishing surface relatively to each other. Thus, the outer peripheral portion of the substrate can be polished efficiently at a low pressure.
In a preferred aspect of the present invention, the polishing surface is upwardly inclined with respect to the plane formed by the substrate held by the substrate holder in a radially outward direction.
With this arrangement, the lower half, and a portion slightly thereabove, of the outer peripheral portion of the substrate can be brought into contact with the polishing surface, or the outer peripheral portion of the substrate can be polished at a desired cutting width. This inclination angle can be determined on the basis of the hardness of material constituting the polishing surface, the shape of the outer peripheral portion of the substrate, the cutting width at the peripheral portion, or a pressing force applied to the substrate during polishing.
The substrate holder may hold the substrate by attracting the central portion of the substrate in such a state that the surface of the substrate faces downwardly.
In a preferred aspect of the present invention, the polishing unit is rotatable about its own axis, and is provided with a polishing liquid supply port around a rotational center of the polishing unit for supplying a polishing liquid to the polishing surface by a centrifugal force caused by the rotation of the polishing unit.
Thus, the polishing liquid can be supplied to the polishing surface from a position below the substrate.
In a preferred aspect of the present invention, the substrate comprises a substrate on which copper interconnects are formed. The polishing liquid has a polishing rate for copper which is at least ten times greater than that for an oxide film or a low-K material.
In a preferred aspect of the present invention, the outer periphery polishing apparatus further comprises a pressing mechanism for pressing the outer peripheral portion of the substrate against the polishing surface of the polishing unit.
Thus, the outer peripheral portion of the substrate can be reliably pressed against the polishing surface of the polishing unit at a predetermined pressing force to thus prevent generation of a defective portion due to displacement of the substrate or random movement of the substrate.
The above and other objects, features, and advantages of the present invention will be apparent from the following description when taken in conjunction with the accompanying drawings which illustrates preferred embodiments of the present invention by way of example.


To easily adjust and change a locus of a leading end (an endless locus) of a cutter, a wire rod cutting apparatus of spring manufacturing machine has structure so that a slide may vertically slide via a connection rod by rotating a rotation shaft, and a cutter mounting oscillating arm can oscillate laterally via a sliding element by oscillating the connection rod, so that the locus thereof in the oscillating arm can be set to a predetermined shape which is endless in a front view and different between an outward and a homeward routes, by sliding the slide and oscillating the oscillating arm by actuation of the actuating apparatus and that a lateral oscillating amount of the oscillating arm can be changed by changing the position of the sliding element, to change the locus of the cutter leading end.

1. Field of the Invention
The present invention relates to a wire rod cutting apparatus of a spring manufacturing machine.
2. Description of Related Art
In conventional, the following structure has been known as this kind of wire rod cutting apparatus.
There has been known a wire rod cutting apparatus of a spring manufacturing machine for manufacturing a spring by discharging a wire rod to a wire rod processing space provided in front of a front wall of a machine casing from a final wire rod guide provided in the front wall, and applying a predetermined process to the wire rod which is discharged to the wire rod processing space or is going to be discharged to the wire rod processing space, by a tool which protrudes or is protruding to the wire rod processing space, wherein the wire rod cutting apparatus comprises a slide which is slidably provided in the front wall in such a manner as to slide in the direction (vertical direction) orthogonal to a center line of a wire rod guide, a cutter mounting oscillating arm which is provided in the slide so as to freely oscillate by a pivot shaft having an axis directed to the longitudinal direction, and further comprises an actuating apparatus which slides the slide and oscillates the cutter mounting oscillating arm, or further comprises a slide driving apparatus which slides the slide and an arm driving apparatus which oscillates the cutter mounting oscillating arm (refer to Japanese Patent Publication No. 8-15635 and Japanese Patent Publication No. 7-115101).
Such conventional wire rod cutting apparatus slides the slide and oscillates the cutter mounting oscillating arm by the actuating apparatus, or by cooperation of the slide driving apparatus and the arm driving apparatus, and thus can set a locus of a leading end of a cutter mounted to the cutter mounting oscillating arm to a predetermined shape which is different between an outward route and a homeward route and is a line symmetrical and bulgy endless in a front view (as seen from a state of normally facing to the front wall).
The conventional wire rod cutting apparatus mentioned above has the following problems.
In order to cut the wire rod without "burrs" being generated, in the cutting process of the wire rod for forming the spring, it is necessary to adjust and change the locus (to adjust a shape and shift a position of the locus) of the leading end of the cutter (the endless locus) while taking into consideration a raw material of the wire rod, a diameter of the wire rod and the like. However, there is a problem that the conventional wire rod cutting apparatus can not easily adjust and shift the locus of the leading end of the cutter.
Also, the conventional wire rod cutting apparatus having the slide driving apparatus and the arm driving apparatus has a problem that failure easily occurs because its structure is complicate.

This patent is subject to a terminal disclaimer.

Wire rod cutting apparatus of spring manufacturing machine


The disclosure is related to an ultrathin planar light source apparatus, comprising a LED light source and a light guide plate; the LED light source comprises a light emitting chip which is disposed opposite to a light incident side of the light guide plate; a polarizer parallel to the light guide plate and disposed between the light emitting chip and the light guide plate; the polarizer projects the light emitted from the light emitting chip toward the light guide plate. The disclosure controls the light emitted from the LED light source well to deflect within a certain range of angles such that the light completely enter into the light guide plate without increasing the thickness of the light guide plate.

1. Field of the Invention
The disclosure relates to a backlight display technology field, and more particularly to an ultrathin planar light source apparatus.
2. The Related Arts
Light Emitting Diode (LED) is a new type power-saving light source with high competitiveness. The trend is gradually replacing the traditional light source. LED has some advantages such that highly luminous efficiency, good light quality, high color purity, suitable voltage-controlled, low power consumption and long life span. The backlight source provides the light source for the liquid crystal display (LCD). The backlight source mainly comprises the light source, the light guide plate, the optical films and the plastic frame. The backlight source is required to have the advantages of high brightness, long life span and uniform luminance. LED is widely used because of its many advantages in LCD backlight.
Since the introduction of the concept of the ultrathin LCD, the backlight mostly adopts the edge lit illumination. Increasing the brightness and ensuring the uniformity of brightness of the panel are achieved by using the light guide plate to guide the light scattering direction. LED lamp is required to be a good fit with the light guide plate in order to allow more light to enter the light guide plate. The principle of LED light-emitting is that the PN junction is powered to emit the light by itself. The emitting angle is isotopically and uniformly scattered through 360 degrees. The emitting angle of the SMD LED is 120 degrees in general. A great loss of light is produced because the light emitting from the LED lamps does not enter the light guide plate completely.
In order to increase the light utilization efficiency, there is one technical solution in which the light incident side of the light guide plate near the LED light source is made as a wedge. It can increase the area of the light incident side to receive more light beams and increase the light utilization efficiency. This technical solution cannot apply in the ultrathin apparatus because of the increasing thickness of the light guide plate.

Shenzhen China Star Optoelectronics Technology Co., Ltd


The invention relates to an electro-optic directional coupler suitable for use as a variable optical attenuator at reduced voltages compared to those known in the prior art. The present invention has found that by careful selection of an asymmetric directional coupler geometry, the transfer function of the device can be shifted so that it has an operating point between maximum and minimum transmission. Signal electrodes driven in push pull configuration advantageously use this operating point to achieve significant reduction in operating voltages for switching to maximum or minimum transmission. Asymmetry is created in the directional coupler by forming the waveguides to have different propagation constants by a difference in waveguide width, depth, index of refraction or index profile. Asymmetry can alternatively be created by causing mechanical stress in the waveguides through the placement, number, or dimensions of the electrodes, or through asymmetric dielectric structures between the waveguides and the electrodes.

Directional couplers comprise two waveguides formed in electro-optic material such as lithium niobate, lithium tantalate or gallium arsenide for example, disposed in close proximity over a coupling length selected to enable evanescent coupling of 100% of the transmitted optical power from one waveguide to the other. An electric field created by a voltage applied through one or both waveguides alters the propagation constant of the waveguide due to the electro-optic effect of the substrate, resulting in a change in the percentage of coupling. Directional couplers are useful in optical switches, modulators and variable attenuators.
Directional couplers have been difficult to manufacture successfully for switching and related applications, in part because the manufacturing tolerances to achieve the proper coupling length and precise symmetry required have been commercially challenging, and in part because the wavelength range of the coupler has been narrower than necessary for the application. If full coupling does not occur from one waveguide to the other because the coupling length is not correct, excess optical loss is introduced and/or full extinction cannot be achieved, thus making the coupler unsuitable for many applications.
In response, asymmetric directional couplers have been developed in which the two waveguides have different propagation constants. The asymmetric directional coupler has been demonstrated to provide coupling over a broader wavelength band, for example in the article "Design and Fabrication of Broad-Band Silica-Based Optical Waveguide Couplers with Asymmetric Structure," by Akihiro Takagi et al. in IEEE Journal of Quantum Electronics, Vol. 28, No. 4, April 1992. Also reduced wavelength sensitivity has been demonstrated in an asymmetric coupler in electro-optic material disclosed in U.S. Pat. No. 6,842,569 by Suwat Thaniyavarn issued to Eospace Inc. Jan. 11, 2005. In this case a pair of electro-optic directional couplers having complementary asymmetry are used to reduce the wavelength sensitivity and relax manufacturing tolerance of 50/50 splitters in a Mach-Zehnder type switch or modulator. As taught by Thaniyavarn, asymmetry of the propagation constants of the directional couplers is achieved by voltage induced linear electro-optic effect, or by asymmetric waveguide widths. The former method allows the asymmetry to be tuned after fabrication of the coupler, whereas the latter method relies on tight control of fabrication processes to achieve a particular asymmetry.
Asymmetric directional couplers in electro-optic material are also demonstrated in a switch disclosed by Henning Bülow and Kurt Aretz in the Journal of Lightwave Technology, Vol. 7, No. 12, December 1989, entitled "Design and Realization of an Integrated Optic Switch for Crossbar Switching Arrays." In this article the authors describe an electro-optic 2×2 switch including a bent bridge waveguide coupled through two directional couplers between crossed input and output waveguides. Asymmetry introduced by a tapered directional coupler and waveguide width mismatch blocks coupling via the directional couplers in the no voltage cross state. "The phase constant of waveguide 2 is slightly higher than the phase constant of waveguide 1. Due to this detuning, minimum power transfer occurs within the couplers and nearly no power appears at port p3." Full switching voltage must be applied to both couplers to compensate for the asymmetry and permit light to pass into and out of the bent waveguide to drive the switch to the bar state. In this design the directional coupler asymmetry and taper geometry prevent unintentional coupling in the no voltage state. The transfer curve of input voltage versus coupling percentage has been shifted from a full coupling operation point at zero input volts to a zero coupling operation point at zero input volts. This switch design offers no change to the voltage required as compared to the prior art. Specifically, it is not suggested that an asymmetric design that shifts the operating point to partial coupling could be used to reduce switching voltage.
Directional couplers have advantages over other electro-optic devices since the close placement of the coupled waveguides permits an electric field to be effectively driven through both waveguides. This has been used to advantage in some prior art designs where two electrodes are positioned above the waveguides to be operated in push-pull operation and both waveguides are influenced by the same voltage equally but in opposite polarity. This configuration effectively reduces the required voltage by half. A push-pull directional coupler is disclosed in U.S. Pat. No. 4,820,009 by Suwat Thaniyavarn, issued to TRW Inc. on Apr. 11, 1989. This patent discloses a symmetrical directional coupler in which further reduction in voltage is achieved by including a passive Y-splitter in the structure to divide input light equally between the two waveguides in order to eliminate an electrical dc bias input. The Y-splitter is essential to this design. However, it is a very difficult structure to manufacture successfully. An error in the fabricated coupling length of the directional coupler will result in incomplete coupling that cannot be corrected by voltage. This means as discussed above, that full extinction would not be possible, and the dynamic range of the device would be limited.
Directional couplers are particularly interesting for the application as variable optical attenuators (VOA). In a VOA light input can be selectively attenuated to a desired output percentage, the remaining light being directed to the other output or into an attenuating medium.
One problem with prior art high-speed variable optical attenuators fabricated in lithium niobate is the large voltage that must be applied to the device. In typical operation, the attenuation remains constant for a long period of time. The high E-fields within the device resulting from the high voltages accelerate bias drift mechanisms, further increasing the maximum required voltage over the operational lifetime of the device. For example, if 20V is required to turn the VOA from minimum to maximum attenuation, and bias drift can cause a 2× increase in applied voltage in order to maintain the same attenuation, then the End-Of-Life (EOL) drive voltage can be as high as 40V, assuming the attenuation at Start-Of-Life (SOL) can be anywhere between the minimum and maximum value. If there is variability in the 2× bias drift multiplier, then even 40V of available drive voltage may be insufficient. Hence, reducing the SOL drive voltage to 10V or 5V greatly enhances the reliability of the VOA.
Bias drift mechanisms as discussed in U.S. Pat. Nos. 5,404,412 and 5,680,497 are due to mobile ions and space charge in the crystal and dielectric materials fabricated on top of the crystal.
An electro-optic directional coupler which overcomes the problems of the prior art, and which requires a reduced drive voltage remains highly desirable.

Asymmetric directional coupler having a reduced drive voltage


A moving platform for use with a camera and track assembly, and comprising a platform body having a hollow rectangular shape with five mirrored exterior sides and one open bottom side. Within and attached to the platform body is a drive wheel, an electric motor and a gear box adapted to drive the drive wheel, a non-drive wheel positioned and rotatable parallel to the drive wheel, a pair of directional wheels spaced from the drive wheel and the non-drive wheel, and a guide wheel assembly attached between the pair of directional wheels and including at least one caster wheel assembly adapted to roll within a recessed rail of a track assembly.

Motion controlled cameras as well as remote controlled camera platforms have been used for decades in the motion picture industry. More recently, with the increased popularity of amateur video, some types of equipment have been made available to amateur film makers.
A common problem found by film makers everywhere is that the camera, its platform and the cameraman himself can be reflected in the subject being filmed. Mirrors are sometimes used to reflect the surrounding environment and thus hide the camera from view. Also, the use of a remote controlled camera that eliminates the presence of a cameraman next to the camera also helps in considerably reducing the visibility in the subject being filmed. Typically, such methods of combining mirrors and remote controlled camera platforms are customized for the job and remain the purview of professional film makers. There is a need for a practical and economical way of providing such advantages to the amateur film maker market.

Remote controlled moving platform for a camera


A local coil for an imaging system includes a sheath current filter and one or more lines run through the sheath current filter.

The present embodiments relate to a sheath current filter and a local coil with a sheath current filter.
Magnetic resonance devices (MR devices) for examining objects or patients using magnetic resonance tomography are known, for example, from DE10314215B4.
In nuclear magnetic resonance tomography, high frequency (HF) coils (e.g., local coils) are used to receive alternating magnetic fields. In order to maintain a good signal-to-noise ratio, the geometry and receive profile of HF coils are optimized for different regions of the body. To obtain the highest possible signal-to-noise ratio, the local coils are positioned as closely as possible on the patient's body. Local coils are, for example, embodied as pure receiving coils (e.g., the spins are excited with a separate transmitting coil, the whole-body resonator). For patient monitoring or for importing audio or video signals (e.g., for display for the patient in a head coil), external lines are led to the patient (e.g., into a head coil).
In the transmission phase of the MRT, the E and B fields induce HF currents on the lines of the probes, headphones or visual displays. The HF currents on the supply lines are known as sheath currents. Unwanted HF currents may result in image interference and malfunctions and the endangerment of the patient. Therefore, either the supply lines have very high impedance or chokes. In the case of shielded lines, sheath current filters (SCFs), are inserted to suppress high-frequency currents on conductors. The sheath current filter and chokes represent high impedance for an HF wave and hence suppress the HF current on the line. Although high-impedance lines may be used to receive signals, the high-impedance lines are very susceptible to interference. The lines may not to be high-impedance for the transmission of videos or acoustic signals. In this case, several chokes may be inserted, for example, in each individual line to suppress HF currents. A plurality of individual lines may be combined with a common conductive shield to form one large cable. This line is wound up to form a cylindrical coil and brought to resonance with a capacitor. The high impedance of the parallel resonance prevents the propagation of a sheath current on the outer jacket of the line. Again, a plurality of sheath current filters is connected in series.

Integrated sheath current filter in a local coil


The invention relates to a process for the marking of an object surface, wherein there is arranged in contact with, or a distance away from the object surface a carrier element, featuring on its side facing the object surface at least one metal coating embedded in other layers, whereby the layers in particular form a Low-E coating system and whereby a laser beam is directed onto the coating system and by reason of the laser irradiation material is transferred from the coating system onto the object surface to be marked, adhering thereto as a matrix with metallic nano-particles, whereby the matrix is formed of the substances originally present in the layers of the coating system. The invention furthermore relates to an object with an object surface marked according to this process.

In the state of the art, marking of objects is known in a variety of forms. Known processes (DE 4126626, DE 4407547, DE 19855623) for the marking of glass utilize, for example, the creation of micro-fissures inside the glass, taking advantage of non-linear processes within the focal range of laser beams to which the glass is transparent. Such micro-fissures scatter and absorb light from the visible spectral range and are therefore visible to man. Due to the formation of local cracks, these processes weaken mechanical stability and are for this reason not advantageous, especially with very thin glass.
No such mechanical damage occurs with the method of ionic color lettering, by which thanks to a locally circumscribed heating of the glass due to the absorption of laser beams, nano-particles of gold, silver or copper are produced within the glass, lending the glass a red color (from gold and copper) or a yellow color in the case of silver. The drawback of these processes lies in the fact that they can only be employed with glass already embedded with gold, silver or copper ions in the melting process (patent disclosure DE 19841547 A1) or in which in a supplemental stage of the process prior to exposure to laser radiation, Na ions of the glass surface are substituted by way of an ion exchange with silver or copper ions from a molten salt bath in contact with the surface of the glass. In either case, the glass must in addition contain ions which when exposed to thermal action reduce the ionic gold, silver or copper to atoms, before the same are separated as nano-particles on account of their limited solubility in glass.
Patent disclosure DE 10119302 A1 describes how the supplemental process prior to exposure to laser radiation can be obviated by placing the portion of the glass surface in need of lettering during the exposure to laser radiation in contact with a silver or copper ion donor medium. In such a case, the processes required for the production of metallic nano-particles lending the color to the glass, the ion exchange and diffusion of silver or copper ions in the glass, their reduction to atoms and aggregation into nano-particles now take place almost simultaneously during the exposure to laser radiation.
Patent disclosure DE 102 50 408 A1 suggests coatings as donor media for silver ions, along with their composition, the processes for the production of such coating compositions and the coating process. The compositions described therein contain at least one silver compound soluble in an aqueous and/or organic solvent and at least one bonding agent. The application of the coating and the required rinse upon completion of the laser radiation are still a drawback, though a less weighty one compared to the complete ion exchange process phase with the molten salt bath.
Patent DE 101 62 119 describes a process wherein, save for the laser radiation, no other steps are needed to apply a durable marking onto a transparent structure. The marking is spaced away from the surface and consists in the mechanically undamaged material solely of a region with a complex refractive index altered vis-à-vis the original state and detectable by optical processes including the naked eye. The changes in the complex refractive index are produced by non-linear optic effects of excitation in elevated power density ranges within the focus of the laser beam, consisting of ultra-short pulses, using for example a Ti:Saphire laser.


A head and neck immobilization system includes a carrying bag; a rigid head, neck and shoulder support board having a curved forward pushing edge, two side mounted strap attachment slot members, a beveled leading edge, a T-shaped neck and shoulder support surface runway, and a U-shaped, hook and pile fastener covered, securing surface; a forehead securing assembly including a half-circular shaped forehead gripper, left and right elastic immobilizing straps, and metal securing clips secured to the ends of the immobilizing straps and securable to the strap attachment slot members of the support board; at least one gel filled posterior cervical spine support bag, the spine support bag including a gel filled spine support pouch, an adjustable volume support pouch adjustment reservoir, a lower hook and pile fastener material covered surface, and an upper hook and pile fastener material covered surface; and at least one elongated, cylindrical shaped around-the-helmet support, the around-the-helmet support being covered with hook and pile fastener material that is companionately securable to the hook and pile fastener material covering the U-shaped securing surface of the rigid support board.

Each year many athletes and other individuals are involved in accidents in which it is possible that head and neck injuries have resulted. Because it is impossible in some instances to detect and determine the extent of these head and neck injuries without advanced diagnostic tools such as X-rays and MRI scanning and in order to minimize further injury to persons suspected of having these types of injuries, it is standard procedure to immobilize the victim's head and neck during transportation of the victim to a diagnostic and treatment center. In many cases, improper or inadequate immobilization of the head and neck has resulted in serious injury to the victim that could possibly have been avoided by proper immobilization. It would be a benefit, therefore, to have a system for immobilizing the head and neck of an athlete or other individual suspected of sustaining a head and/or neck injury. Because these types of injuries can occur in remote locations, it would of course be a benefit to have such a system that included a carrying bag for conveniently carrying the elements of the immobilization system. Because the less movement of the head and neck regions of the individuals during the immobilization procedure the less injuries will be exacerbated during transport, it would be a benefit to have such an immobilization system that included a number of support pouches that could be positioned beneath regions of a person's neck and spine that could then be adjusted in size to fill the space between the neck and spine region of the accident victim and a rigid support board.


The present invention relates to a method for calibrating the phase of a microwave source, in which: a calibration circuit is closed, the calibration circuit comprising an injection channel connected to a measurement channel via the source to be calibrated; a test signal is injected through the source to be calibrated, the test signal being injected on the injection channel, the phase φm of the signal having passed through the source to be calibrated is measured, the phase of the signal being measured on the measurement channel, wherein: the amplitude Am of the signal having passed through the source to be calibrated is measured, the amplitude of the signal being measured on the measurement channel;

The present invention relates to a method for calibrating a microwave source. It can notably be applied to the phase calibration of the elementary sources of an array antenna.
An array antenna comprises an array of phase-controlled elementary sources, each source being connected to a radiating element. By controlling the phases of the elementary sources in a suitable manner, a plane wave can be created in a desired direction. An electronic sweep can thus be carried out, in other words the direction of the main lobe can be modified by controlling the phases of the various sources.
However, elementary sources can go out of adjustment, producing a different phase from the setpoint phase. These phase differences lead to limitations in the performance of the sweep. They can notably result in a reduction in gain of the antenna, a distortion of the main lobe, an increase in the level of the secondary lobes and a deviation of the electromagnetic axis.
A known solution is to carry out periodic calibrations of the phase of each elementary source. In order to perform a calibration of an elementary source:    a calibration circuit is closed, the calibration circuit comprising an injection channel connected to a measurement channel via the source to be calibrated;    a test signal is injected through the source to be calibrated, the test signal being injected on the injection channel,    the phase φm of the signal having passed through the source to be calibrated is measured, the phase of the signal being measured on the measurement channel.
However, microwave interference exists that causes errors in the phase measurements of each elementary source.

Method of calibrating a microwave source

Abstract: The calibration circuit is opened at the source to be calibrated; the test signal is injected on the injection channel; the phase φf and the amplitude Af of the signal present on the measurement channel is measured; a corrected phase value φc is determined, this corrected phase being the phase of a complex number Uc, calculated from two complex numbers Um and Uf, where: Um=Am·exp(i·φm) Uf=Af·exp(i·φf).


The present invention discloses a method for effectively isolating and purifying a physiological active dauer pheromone compound having the following structural formula I related to aging and stress of C. elegans, and determination of the structure of such material. First, ethanol extract is prepared by completely concentrating a liquid medium with ethanol after culturing C. elegans on a S. basal liquid medium, and then this ethanol fraction is further extracted with ethyl acetate. Then, impurities are removed from ethyl acetate extract by a silica-gel adsorption chromatography and a pheromone extract is isolated and purified by amine column chromatographic procedures using various solvents as eluent. Finally, a pheromone compound having structural formula I is completely isolated and characterized by size-exclusion HPLC.

Pheromones are defined as substances that are used for communication between individuals of the same species. Pheromones are usually obtained in the form of mixtures through multiple separation steps including organic solvent extraction and liquid column chromatography.
In early 1980s, it was reported that C. elegans can secret a type of pheromone, termed 'dauer pheromone', a constitutively secreted substance serving as an indicator of population density (Golden and Riddle 1982, Golden and Riddle 1984a, Golden and Riddle 1984c), which can induce C. elegans into dauer arrest phase when they are faced with adverse environmental conditions such as heat, lack of food, and crowdedness. Although its presence has been known for more than two decades, its structure, molecular weight and physical properties are not known yet (Riddle, D. L., Science, 218: 578–580, 1982).
According to the previous studies, pheromone secreted from C. elegans exists in extremely low concentration. Because of its potential in control of aging and stress in C. elegans, the dauer pheromone has been studied extensively. However, until now, because it was not available in a single molecule, most investigators have used the crude extracts of C. elegans that are believed to contain a dauer pheromone and other compounds as well.
Therefore, it is necessary to isolate a pure dauer pheromone from the extracts and characterize its structure for the studies of aging, stress and other cellular function of C. elegans. The dauer pheromone is likely to be detected by as yet unidentified pheromone receptor that couples to a cyclic GMP signaling pathway that includes daf-11 (Birnby et al. 2000). It has been known that the dauer pheromone of C. elegans is very stable and hydrophobic, and has chromatographic properties similar to those of hydroxylated fatty acids and bile acids.
In this article, we describe purification, identification, and molecular characterization of C. elegans-specific dauer pheromone.

Pharmacologically active isolated or purified dauer pheromone compound for controlling aging and stress and method for isolating and characterizing the same


A display device includes color display pixels, a driving circuit, and signal lines X1, X2 and X3. The driving circuit is provided with a reference gray scale signal circuit, a digital-to-analog conversion circuit and a signal supply circuit. The signal supply circuits provides signal lines X1, X2 and X3 with analog signals as video signals when reference gray scale signals are outputted in accordance with color characteristics of the pixels. The signal supply circuit also provides signal lines X1, X2 and X3 with preliminary analog video signals converted in response to the reference gray scale signals corresponding to color characteristics of other pixels when video signals are supplied to other signal lines during each horizontal scanning period.

Flat panel display devices are widely used as those for personal computers, handy information processing equipment, television receivers, etc. Recently, display devices using light-emitting elements such as organic EL (electro-luminescence) elements have attracted considerable attention and have been actively researched and developed. Organic EL display devices have the following features: (1) they do not need a rear light source that would prevent them from being made thin in thickness and light in weight, (2) they are suitable for the reproduction of moving images because of a rapid response characteristic, and (3) they can be used in cold locations because their brightness remains substantially unchanged in low temperatures.
The organic EL display devices are provided with display elements disposed in a matrix form to emit red, blue and green light. The display element consists of an anode, a cathode and a light-emitting layer. Materials for the light-emitting layer each are selected in accordance with wave lengths of the colors to be emitted.
It is necessary to drive each color in the organic EL display device in response to its light-emitting characteristics. It is known that a color can be driven by using different reference gray scale signals to match with the light emitting characteristics. Usually, a reference gray scale signal circuit is provided exclusively for every color to supply an output signal to its corresponding digital-to-analog conversion circuit.
In the display device video signals are generally written successively on a time-sharing basis for a horizontal display period. In order to carry it out successfully, the driving method has limitations with respect to display panel size, the number of pixels, integrated circuit (IC) performance, etc.

Liquid crystal display device and method of driving the same


This disclosure introduces a significant extension to the method of p-cycles for network protection. The main advance is the generalization of the p-cycle concept to protect multi-span segments of contiguous working flow, not only spans that lie on the cycle or directly straddle the p-cycle. This effectively extends the p-cycle technique to include path protection, or protection of any flow segment along a path, as well as the original span protecting use of p-cycles. It also gives an inherent means of transit flow protection against node loss. We present a capacity optimization model for the new scheme and compare it to prior p-cycle designs and other types of efficient mesh-survivable networks. Results show that path-segment-protecting p-cycles (“flow p-cycles” for short) have capacity efficiency near that of a path-restorable network without stub release. An immediate practical impact of the work is to suggest the of use flow p-cycles to protect transparent optical express flows through a regional network.

One of the most interesting recent developments in survivable network architecture is the method of p-cycles. p-Cycles, or pre-configured cycles, introduced in 1998, are in a sense like BLSR rings, but with support for the protection of straddling span failures as well as the usual protection of spans on the ring itself. The most striking property of p-cycles is that they retain ring-like switching characteristics (only two nodes do any real time switching and are fully pre-planned for each failure) but can be designed with essentially the same capacity-efficiency as a span-restorable mesh network. Recent work has even found that with joint optimization of working path routing along with p-cycle placement, overall designs can approach the ultimate theoretical efficiency levels for any known class of restorable network and having the benefit of dynamic, failure-specific, path restoration. This means p-cycle based networks can be 3 to 6 times more capacity-efficient than ring-based networks while still providing BLSR ring switching speeds. In fact for straddling span failures, the average protection path has half the number of hops of the corresponding ring, so it may even be faster on average. Since 1998, the basic theory of p-cycles as pre-configured structures in the spare capacity of a mesh network has been developed, and there have been studies on self-organization of the p-cycle sets, application of p-cycles to the MPLS/IP layer, application to DWDM networking and studies on joint optimization of working paths and spare capacity. Notably, in one study it was found that full survivability against any span cut could be achieved with as little as 39% total redundancy. This greatly motivates continuing work and practical applications of the p-cycle concept.
Concurrent work on cycle covers under the coincidentally similar name of protection cycles should not be confused with p-cycles. The fundamentally important difference is the aspect of straddling spans in p-cycles. Straddling spans on a p-cycle can each bear two units of working capacity per unit of p-cycle capacity and they require no associated protection capacity on the same spans. All forms of ring or cycle covers fundamentally involve equal (or greater) amounts of protection and working capacity on every span and at best (which is what oriented cycle double covers in accomplishes) reach a 1-to-1 ratio between these, for 100% redundancy. In contrast p-cycles, due ultimately to the effectiveness of straddling span protection aspects, yield fully restorable architectures at well under 100% redundancy.
However, all work so far on p-cycles has been done on what can be called "span-protecting" p-cycles. Each such p-cycle protects only spans that are part of itself or that directly straddle the respective p-cycle. This disclosure extends span-protecting p-cycles to path-segment protecting p-cycles and addresses the issue of mutual capacity (which is intrinsic to any path oriented or multi-commodity flow type of recovery scheme) as well as the corresponding operational complexity in coordinating which paths can access which p-cycles. By extending the concept to path-segment protecting p-cycles, protection against node loss for transient flows by the span-protecting p-cycles is also provided, while flows originating or terminating at the failed nodes cannot be restored by any network rerouting technique. A method for simplifying the task of optimizing the network is also disclosed, the method also making it easier to solve the joint optimization problem.


Using midambles, tracking delay profile creator 107 opens correlation windows in the range of 8 chips before and behind the top path and creates delay profiles within this range. From the delay profiles, path determiner 108 detects whether or not there is a new path before the top path, and, when there is a new path, determines whether or not this is its path. Based on the result of the determination at path determiner 108, when the new path is its path, frame position controller 109 sets the top path with the new path. On the other hand, when the new path is not its path, the top path set earlier is retained as is as the top path. Then, in accordance with the timing of the top path set, a received signal is demodulated. By this means, reception quality can be improved.

In IMT2000-TDD, a midamble, which is a pilot sequence, is inserted in the center of a time slot. Multiplexed signals from multiple users arrive at the receiving end, and the receiving end performs correlation operation using midambles different for each signal, thereby creating delay profiles on a per midamble basis, detecting paths and subjecting these to rake-demodulation or JD-demodulation, and acquiring the received data.
To acquire the received data on a per user basis, it is necessary to detect the timing of each user's top path in delay profiles. Now, there is processing referred to as frame tracking for tracking the frame timings. By virtue of this frame tracking processing, the top path in a delay profile is detected on a per user basis, and the received data is demodulated by adjusting the timing in accordance with the top path. Usually, tracking processing is performed using a common channel that all users share. On this common channel, a signal is multiplexed with a user signal. At the receiving end, following user-specific delay profiles, delay profiles of the common channel are created.
Now, when the receiving party moves while engaged in communication, and when, for instance, the receiving party moves out from behind a building while communicating, the receiving party is then able to receive direct waves from the base station apparatus after moving out from behind the building. Consequently, new peaks by the direct waves might appear before the peaks by the delay waves. If these peaks by the direct waves can be selected as paths and used for rake combining, the quality of the received signal after the rake combining can be improved. So, when paths such as above are detected, tracking processing is performed such that the top path is changed to a path by a direct wave.
On the other hand, a mobile apparatus receives multiplexed transmission data from multiple users. Consequently, when there is a new path before the top path, there is a possibility that the correlation operation result at a timing before the top path shows the component of another user signal using a midamble corresponding to a circulation amount as of just before.
That is, the communication schemes of IMT2000-TDD use midambles that are created on a per channel basis by cyclically shifting the basic midamble. Consequently, the correlation operation result at a timing before the top path and the correlation operation result of a channel using a midamble shift corresponding to a circulation amount as of just before may show the same component.
However, with a typical receiving apparatus, when there is a new path before the top path in a delay profile, by tracking processing, this new path is always set as the new top path. Consequently, when the new path happens to be another user's delayed wave or the like, the reception is done at wrong timings and this may disable communications.

Receiving apparatus and method of detecting top path in delay profile

Matsushita Electric Industrial Co., Ltd.


A method and associated equipment are disclosed which allow drilling at least a portion of a well and subsequently cementing casing in a single trip. The method is particularly suited for deep-water offshore operations where the drill string can be run through a section of casing leaving a bit and an under-reamer extending out below. The casing is equipped with ports through which cement can be pumped as well as an external casing packer to prevent the uncured cement in the annulus from U-tubing. Several casing sections can be run in during drilling and cemented succession using the one trip method.

When drilling offshore in deep water, particularly into zones having low formation pressure from adjacent formations with higher pressure and unstable formations, there was a serious risk of collapse of the drilled hole before casing could be inserted. In the long interval between getting the drill sting out and running in casing to tie back to existing casing in the wellbore, the collapse or unstable formations in the newly drilled area would make running casing virtually impossible. The solution that was developed was to drill down just short of the pay zone and pull out of the hole with the drill sting. The casing string that was next to be secured in the well was then suspended from the floating rig. This run of casing could be almost as long as the distance from the rig floor to the seabed. The drill string would then be run through this length of casing with the lower end having an under-reamer on top of a bit extending below the suspended casing string. A mud motor was used to rotate the lower end of the drill string, while the upper end remained fixed. The fixed portion of the drill string was secured to the casing and both advanced together downhole. Drilling into the pay zone would continue until the casing got stuck due to formation collapse around it, once the pay zone was breached. Depending on the formation characteristics of the pay zone the casing could get stuck due to borehole collapse around it as soon as a few feet after drilling into the zone. At that point the casing string was secured to the next size of casing with an external casing packer. The drill string was removed and a production string and packer were run. The last run of casing was not cemented because it couldn't be due to hole collapse around it.
It is well known that offshore deepwater rigs have very high daily rates. Accordingly, when drilling particularly in very deep water it would be advantageous to save rig time where possible.
The method of the present invention allows this to occur by making it possible to drill a portion of a well and in the same trip to cement that section of casing that is run in on the stationary portion of the drill string. In the preferred embodiment a mud motor drives an under-reamer and a bit that extend below the casing supported by the drill string. A cementing/inflation tool on the drill string engages with cementing ports in the casing to pass cement outside of the casing. The casing is secured to existing casing and the drill string is removed to complete the operation. Subsequent casing runs can be secured in the same fashion. Ultimately, a production string is secured to allow production. The process can be repeated for successive casing sizes. The process is even adaptable for use on land rigs after an initial depth is drilled, cased and cemented in the traditional manner. These and other beneficial aspects of the present invention will become more apparent to one skilled in the art from a review of the description of the preferred embodiment and the claims, which appear below.


The present invention provides a method for determining the gender of a fetus by assaying the sex hormones, evaluating the overall reducing/oxidizing (redox) activity, and/or evaluating the radical scavenging capacity of the maternal urine or other body fluid. The method can be used to determine fetal gender at any time point during pregnancy. The methods of the present invention also provide for a means for pre-conception offspring gender planning by assaying the sex hormones in urine samples, evaluating the overall reducing/oxidizing (redox) activity, and/or evaluating the radical scavenging capacity of the urine or other body fluid from a non-pregnant female. In some embodiments, the methods described herein are used to sort sperm based on an overall reducing/oxidizing environment of follicular fluids, which can then be used for intrauterine insemination.

There is a great interest in accurately determining the gender of an unborn child as early as possible. Available techniques are typically performed at late stages of a pregnancy. Ultrasound can be used to determine fetal gender after the 18th week of pregnancy. Polymerase chain reaction (PCR) amplification of Y-specific DNA sequences requires a sample of maternal blood, as well as expensive equipment. PCR can be carried out as early as the 6th week of gestation with an accuracy of only around 80%. Lagona et al. Multiple testing in fetal gender determination from maternal blood by polymerase chain reaction. Hum. Genet. 102, 6:1 (1998) Amniocentesis is performed after the 18th week of pregnancy; however, it carries a risk of miscarriage due to its invasiveness. Chorionic Villi Sampling (CVS), conducted between the 10th and 13th week of pregnancy, can also provide accurate information, but again, the procedure is invasive and requires costly equipment.
Alternatively, it is possible to determine the gender of an unborn child by assaying sex hormones. Sex hormones are steroids that play important roles in both normal growth and development. In addition, sex hormones influence the development of sex organs and maintenance of secondary sex characteristics in mammals. Testosterone, the principal male sex hormone, is primarily secreted by the testes of males and, to a much less extent, the ovaries of females. On average, an adult man produces about forty to sixty times more testosterone than an adult woman. Similarly, estrogen functions as the primary female sex hormone and is usually present at significantly higher levels in women than men. The urine from a mother carrying a male fetus is richer in testosterone when compared with the urine from a mother carrying a female fetus. This difference is probably due to the contribution of sex hormones secreted by fetal testes. Jost A. A new Look at the Mechanisms Controlling Sex Differentiation in Mammals. John Hopkins Med. J. 130: 38 (1972). Approaches based on a pregnant woman's individual sex hormone levels have been explored to determine fetal gender; however, thus far, they have not resulted in the development of any statistically reliable methods. For example, in one study, antibodies against testosterone were used in a radio-immunoassay to determine the testosterone levels in pregnant mothers' urine. The accuracy of this study with respect to determining fetal gender was low. Loewit et al. Determination of fetal sex from maternal testosterone excretion in early pregnancy. Dtsch. Med. Wschr. 99: 1656 (1974).
Urine from pregnant women has been used in various attempts to develop simple and non-invasive tests to determine fetal gender. Most of these procedures exploit simple characteristics of maternal urine such as its pH or the ability to form complexes with aluminum compounds. Consequently, these tests are usually associated with comparatively poor reliability. For example, U.S. Pat. No. 6,420,182 discloses a method for fetal gender detection by assaying the pH of maternal urine after the 12th to 14th week of pregnancy. The test is based on the hypothesis that women bearing female fetuses have acidic urine, but the accuracy of this method is only about 65%. In another assay, a colorimetric test on urine from pregnant women may be performed after the 20th week of pregnancy. U.S. Pat. No. 4,840,914. The accuracy of this test in determining fetal gender was similarly low, only about 60%.
The applicant has noted that assaying multiple sex hormones, evaluating the overall reducing/oxidizing activity, and/or evaluating radical scavenging capacity from urine sample collected near ovulation before pregnancy has significant similarity and correlation with the gender outcome after pregnancy. This suggests that biochemical environment in the uterus existing at the time of conception may be locked and maintained throughout pregnancy. Therefore, evaluation of these parameters before pregnancy would provide reliable methods for pre-conception baby gender planning, as well as provide reliable methods for determining fetal gender after pregnancy. In other words, in addition to X or Y chromosome bearing sperms, the gender of a baby is also influenced by the biochemical environment of the uterus at the time of conception.
Depending upon the processing and assay methods, the hormones which can contribute to the reducing or oxidizing activity of a urine sample are progesterone, testosterone, human chorionic gonadotropin (hCG), and estrogens. For example, estrogens can act as antioxidants, and contribute to the radical scavenging capacity of the urine. The primary hormones directly linked to fetal gender are sex hormones, namely, testosterone and estrogens. The overall reducing/oxidizing activity and/or radical scavenging capacity of the urine sample from a pregnant mother carrying a male fetus is different from that of the urine sample from a pregnant mother carrying a female fetus, thereby allowing for determination of fetal gender.
There is a continuing need to develop a simple, non-invasive and reliable method for determining the gender of an unborn child as early as possible after conception. There is also a need for pre-conception baby gender planning using a simple, non-invasive and reliable technique. Because human and other mammals have similar reproductive biology, these methods may also be of great commercial value to animal breeders.
Further, such redox based pre-conception evaluation of gender specific compatibility of an ovum, post-conception gender determination and relatively more natural sperm sorting techniques may be useful in raising the success rates of artificial fertilization techniques (ART). Current sperm sorting/separation techniques use one or more external forces, including multi-gravitational force, chemical gradient, or electronic pulse etc. Such forces may damage sperm physically or biochemically including DNA damage resulting in less successful ART. For example, Fluorescence Activated Cell Sorting (FACS) uses a cytometer in combination with DNA binding dyes and fluorescence detection. It has been used for detecting minute differences in fluorescence signals originating from a 3.8% difference in total DNA content between X and Y chromosome bearing bovine spermatozoa (G. E. Seidel {circumflex over ( )} D. Garner, Reproduction, 2002, 124,733-743). When the difference in DNA content is detected, an applied electric field sorts the droplet containing the spermatozoa into X and Y chromosome bearing bins. The system can reach up to 25,000 individual spermatozoa per second and is useful in agricultural industries. However, it is known that high shear stress and high voltage cause extensive DNA fragmentation (D. H. Triyoso & T. A. Good, J. Physiol., 1999, 515, 355-365. and M. Stacey, et al, Mutat, Res, Genet, Toxicol, Environ, Mutagen., 2003, 542, 65-75).
Furthermore, current sperm sorting is imperfect, that is, the separation results in a partially enriched fraction containing a 70/30% mixture of X/Y chromosome containing sperm, potentially resulting in the gender of the fetus being other than the parents expected/wanted.
Thus, there is an urgent need of a technique of sorting and effectively separating X and Y chromosome containing sperm, which does not involve any exposure to external physical or biochemical stress. There is also a need to use this approach on natural gender specific conception, either at home or by using intrauterine insemination or in-vitro fertilization. If the technology described herein is used in proper gender specific menstrual cycles, couples, fertile as well as less fertile, can conceive the babies of desired gender, with much higher success rate than existing rates of 10-35% offered by current ARTs.

Methods for chemotaxis / redox driven separation of X and Y chromosome bearing sperm and their insemination in gender specific menstrual cycles


A thermoelectric module includes two insulating substrates supporting a plurality of thermoelectric fingers. Each thermoelectric finger has alternating strips of n-type doped material and p-type doped material, wherein adjacent n-type doped strips and p-type doped strips are separated by and electrically coupled to conductive regions. The thermoelectric fingers run in a first direction and are spaced apart from each other. A plurality of holes in the insulating substrates are disposed between adjacent thermoelectric fingers, and area aligned with each other. A length of fabric yarn woven is in and out of substantially aligned holes in each substantially aligned set of holes.

Wearable electronics has become an increasing area of research and commercialization. Wrist-worn electronic devices can track heartrate and various levels of activity. Embedding clothing with biosensors allows for the gathering of even more comprehensive biometrics and/or environmental conditions from humans (and possibly other living things) while engaged in various activities. Many sensors have been developed that are both amenable to use on apparel, and which can communicate data wirelessly.
While wrist-worn electronic devices can include a battery for power, sensors embedded into clothing do not lend themselves well to battery power. In particular, if various wearable sensors are placed on different parts of the body, it is inconvenient to implement a battery at each location, and inconvenient to convey electricity from a central location to various dispersed sensors. While small coin cells can be used to limit bulkiness, such batteries nevertheless have a limited charge cycle that is correlated to size. A short charge cycle is disadvantageous because charging typically involves connecting the battery or batteries to an external charging device, or in some cases simply replacement of the battery.
There is a need, therefore, for a more convenient apparatus and method for providing power to wearable sensors that reduces one or more of the inconveniences associated with the use of batteries.

Integrated thermoelectric film based woven power generator


A mold assembly (10) for injection molding material including a mold base (12), a clamping plate (14) and a flexible membrane (16). The flexible membrane has a retainer portion (29) engaged within a groove (28) in the mold base, and secured in position clamped intermediate the clamping plate and mold base. The clamping plate and membrane form a mold cavity (54) having a desired configuration for forming the molding material injected into the mold assembly (10). The mold base (12) and flexible membrane (16) form a pressure cavity (56) which is supplied with fluid during the injection of molding material into the mold assembly, to support the flexible membrane (16) in the desired position.

Mold assemblies currently available for injection or pressure molding articles are typically formed from rigid materials such as steel or other metal materials. In the past, such metal mold assemblies have generally consisted of multiple plate machined or, if in large quantity, cast molds. The molds are generally pre-heated to a desired temperature, clamped or compressed within an injection molding system, and injected with the desired molding material. The injection of the molding material is typically accomplished using an injection system having an injection press.
The production of such die molds having cavities for molding desired items is a time consuming and expensive process. Manufacture of the mold itself to the desired specification, may take many weeks. Additionally, where such fixed dimension molds are used for joining two or more separate molded pieces together, problems may result. For example, where it is desired to join elongate pieces of polymer material which are generally produced by another process, such as extrusion, such pieces may have individual size variations as great as 15% or more. Consistently forming a quality joint between pieces having such different sizes may be difficult to achieve, and may result in a molded article which does not meet desired aesthetic standards.
In the past, the joint molding of separate elongate pieces has been performed using machined or cast molds having spaces formed within the mold for receiving the pieces to be joined. Such molding processes have the distinct disadvantage of obtaining molded articles having an unattractive "step offs" or discontinuous joint lines between the elongate pieces and the molded joint material. Depending on the diameter and cross-sectional configuration of the elongate pieces, a separate mold may be required for joining different size and types of pieces.
Another disadvantage of conventional mold processes is that the molded articles produced typically require additional processing to remove flash from the articles. The formation of flash, and its removal, result in further increased costs due to wasted material, and the additional process of deflashing the article, or removing the excess material, and finishing the article. An additional quality control inspection of each article may also be required, which further increases the overall labor expense of the system.


A magnetic sensor includes first through fourth GMR elements. The fixed layers of the first through fourth GMR elements have respective magnetization directions toward the X-axis positive, X-axis negative, Y-axis negative, and Y-axis positive directions. When a magnet is located at the initial position, the free layers of the first through fourth GMR elements have respective magnetization directions toward the Y-axis positive, Y-axis negative, X-axis negative, and X-axis positive directions. When the magnet is located at the initial position, the magnetization axis of the magnet passes through the centroid of the first through fourth GMR elements. The magnetic sensor detects, from the resistances of these GMR elements, changes in horizontal magnetic fields of the magnet which pass through the first through fourth GMR elements and which change in accordance with the moved position of the magnet, to thereby determine the position of the magnet.

1. Field of the Invention
The present invention relates to a magnetic sensor for a pointing device that detects the position of a magnet which is moved by an external operation force.
2. Description of the Related Art
As shown in FIG. 21, a conventionally known pointing device 100 includes a mounting substrate 101, a resin portion 102, a thin-disk-shaped magnet 103, and a magnetic sensor 110. The magnet 103 is supported above the mounting substrate 101 by means of the resin portion 102. When the magnet 103 receives no external operation force, it is located at a predetermined initial position. When the magnet 103 receives an external operation force, it moves with respect to the mounting substrate 101 in a direction parallel to a main face (X-Y plane) of the mounting substrate 101.
As shown in FIGS. 21 and 22, the magnetic sensor 110 includes a circuit board 111 and four Hall elements 112a, 112b, 112c, and 112d. The magnetic sensor 110 is fixed to the mounting substrate 101 to face the magnet 103 via the mounting substrate 101. Here, an axis which is parallel to a Z-axis direction and which passes through the centroid of the magnet 103 located at the initial position is considered to be the origin O of X and Y axes. The Hall element 112a and the Hall element 112c are disposed on the X-axis to be symmetric with respect to the Y-axis. The Hall element 112b and the Hall element 112d are disposed on the Y-axis to be symmetric with respect to the X-axis. The four Hall elements 112a, 112b, 112c, and 112d are spaced away from the origin O by the same distance.
The magnetic sensor 110 also includes a detection circuit as shown in FIG. 23. The detection circuit is formed on the circuit board 111. The detection circuit includes a differential amplifier 113a, a differential amplifier 113b, and a detection section 114. The differential amplifier 113a outputs a difference between voltages output from the Hall element 112a and the Hall element 112c. The differential amplifier 113b outputs a difference between voltages output from the Hall element 112b and the Hall element 112d. On the basis of the outputs of the differential amplifiers 113a and 113b, the detection section 114 outputs a signal which specifies the position of the magnet 103 (see, for example, Japanese Patent Application Laid-Open (kokai) No. 2003-196019).
In this pointing device 100, when the magnet 103 is located at the initial position, the respective distances between the magnet 103 and the four Hall elements 112a, 112b, 112c, and 112d are equal to one another. Therefore, the four Hall elements 112a, 112b, 112c, and 112d are equal to one another in terms of the density of magnetic flux passing therethrough in the Z-axis direction. As a result, all the Hall elements output the same voltage, so that the outputs of the differential amplifiers 113a and 113b both become zero. As a result, the detection section 114 outputs a signal indicating that the magnet 103 is located at the initial position.
Meanwhile, when the magnet 103 moves in the positive direction along the X-axis, the density of the magnetic flux passing through the Hall element 112c in the Z-axis direction becomes greater than that of the magnetic flux passing through the Hall element 112a in the Z-axis direction. Accordingly, the Hall element 112c outputs a higher voltage than does the Hall element 112a. As a result, the differential amplifier 113a outputs a positive voltage corresponding to the difference between the output voltage of the Hall element 112c and that of the Hall element 112a. The magnitude of this voltage increases as the magnet 103 approaches the Hall element 112c.
Meanwhile, the density of the magnetic flux passing through the Hall element 112b in the Z-axis direction and the density of the magnetic flux passing through the Hall element 112d in the Z-axis direction decrease by the same small amount as compared with the case where the magnet 103 is located at the initial position. Accordingly, the Hall element 112b and the Hall element 112d output the same voltage, so that the output of the differential amplifier 113b remains zero. As a result, the detection section 114 outputs a signal indicating that the magnet 103 has moved in the X-axis positive direction by a distance corresponding to the output voltage of the differential amplifier 113a. As described above, the magnetic sensor 110 is configured to detect the position of the magnet 103 by detecting the vertical component of a magnetic field generated by the magnet 103 (a magnetic field component parallel to a straight line connecting the magnetization center of one magnetic pole of the magnet 103 and the magnetization center of the other magnetic pole thereof; in this case, a magnetic field along the Z-axis direction). Notably, a straight line connecting the magnetization center of one magnetic pole of a magnet and the magnetization center of the other magnetic pole thereof will be also referred to as a "magnetization axis."
However, such a pointing device 100 has a drawback in that considerable restrictions are imposed on the size of the magnet 103, the positions of arrangement of the Hall elements 112a, 112b, 112c, and 112d, and the distances therebetween. This drawback will be described with reference to FIGS. 24 and 25, while the case where the magnet moves in the X-axis positive direction is taken as an example. FIG. 24 is a schematic view showing a state in which the magnet 103 is located at the initial position. FIG. 25 is a schematic view showing a state in which the magnet 103 has moved to a position at which the magnetization axis of the magnet 103 passes through the center of the Hall element 112c (hereinafter referred to as "detection limit position").
As can be understood from FIGS. 24 and 25, during a period in which the magnet 103 moves from the initial position shown in FIG. 24 to the detection limit position shown in FIG. 25, the density of magnetic lines of force (magnetic flux) of the vertical magnetic field passing through the Hall element 112a gradually decreases and the density of magnetic lines of force of the vertical magnetic field passing through the Hall element 112c gradually increases, as the magnet 103 moves in the X-axis positive direction.
However, when the magnet 103 reaches the vicinity of the detection limit position shown in FIG. 25, the vertical magnetic field hardly acts on the Hall element 112a. Therefore, even when the magnet 103 moves further in the X-axis positive direction beyond the detection limit position shown in FIG. 25, the output of the Hall element 112a hardly changes. Meanwhile, when the magnet 103 moves further in the X-axis positive direction beyond the detection limit position shown in FIG. 25, the density of magnetic lines of force of the vertical magnetic field passing through the Hall element 112c starts to decrease. As a result, the magnetic sensor 110 outputs the same value for both the case where the magnet is a short distance away from the detection limit position in the X-axis positive direction and the case where the magnet is a short distance away from the detection limit position in the X-axis negative direction.
Accordingly, in the conventional pointing device 100, a range along the X-axis direction in which the magnetic 103 is movable (an X-axis range in which the position of the magnet 103 is detectable) is restricted between the Hall element 112a and the Hall element 112c. Therefore, it is impossible to provide a pointing device in which the magnet 103 can be moved over a large distance. This problem can be solved by increasing the distance between the Hall element 112a and the Hall element 112c. In this case, however, the size of the magnet 103 increases, due to the necessity of applying sufficient vertical magnetic fields to the respective Hall elements, and/or the distance between the magnet 103 and the mounting substrate 101 increases. As a result, there arises a problem of an increase in the sizes of the magnetic sensor 110 and the pointing device 100.


A moveable contact connector system provides easy lead insertion, lead retention, and reliable electrical connection for implantable devices. The connector system may be used with in-line leads commonly found in such applications. Moveable contacts are provided in the connector, which contacts are placed in a first position for easy lead insertion, and in a second position for lead retention. The second position also provides a good electrical connection between the moveable connector contacts and the lead contacts. Multiple means for moving said at least one moveable contact between the first and second positions are described. A first embodiment uses a rotatable cam which is rotated to align the cam lodes with said at least one moveable contact, pushing the movable contacts against the lead contacts. The second and third embodiments use a sliding key to force said at least one moveable contact against the lead contacts.

The present invention relates to implantable electronic and electrochemical medical devices and systems, and more particularly to a movable contact locking connector system for use with such devices and systems. Such connector system provides easy lead insertion, a reliable means to retain an in-line lead in a connector and ensures effective electrical connection between lead and connector contacts. The connector system provides these features through a simple design avoiding complexity.
Implantable electronic medical devices and systems have been in use for the past 20 years or more. One of the earliest implantable medical devices to be implanted in a patient was the cardiac pacemaker. Other implantable electronic devices have included neurostimulators, i.e., electrical stimulators designed to stimulate nerves or other tissue, sensors for sensing various physiological parameters or physical status of a patient, and therapeutic-delivery devices, e.g., pumps for delivering controlled amounts of medication. In more recent years, a tiny implantable cochlear stimulator has been developed that allows patients who are profoundly deaf to experience the sensation of hearing. Other tiny implantable sensors and neuro-stimulators are under development that will enhance the ability of a patient who is a recipient of such sensors or stimulators to walk, or to see, or to experience the use of other lost or impaired body functions.
Most of the implantable medical devices and systems described above require that at least one electrical lead be connected thereto in order for the device or system to perform its intended function. Such lead typically includes a plurality of insulated conductors, or wires, through which electrical signals may be delivered or sensed. At an end distal from an implantable electronic device, each of the insulated conductors usually terminates in one or more electrodes designed to be in contact with body tissue. A Spinal Cord Stimulation (SCS) system, for example, has an electrode array adapted for insertion into the spinal column of the patient. Such electrode array typically employs a multiplicity of electrode contacts, each of which must be individually electrically connected to the pulse generator circuitry housed within an Implantable Pulse Generator (IPG). The lead associated with such spinal cord stimulator thus carries the individual conductors that electrically connect the respective electrodes, to the implantable pulse generator, thus making up the spinal cord stimulation system.
In-line leads are often chosen to connect an electrode array to an implantable electronic device. The contacts of an in-line lead are spaced-apart rings on one or more ends of the lead. An important benefit of such in-line lead is that when the lead is used with a ring type electrode array of similar diameter, the lead and array combination may be inserted into a patient""s spinal column using a large gauge needle. However, the use of a lead with such in-line male connector with a simple push-in female connector is limited by the ability to push the lead into a female connector passageway. The problem of in-line lead insertion has been addressed by U.S. Pat. No. 5,843,141 issued Dec. 1, 1998 for xe2x80x9cMedical Lead Connector System.xe2x80x9d The ""141 patent uses a tool to pull the lead end into the connector. However, the requirement to provide good electrical contact between the contacts on the lead and the contacts in the connector, and the need to provide a means for retaining the lead in the connector once inserted, work against easy insertion, and results in a requirement that the lead be sufficiently strong to resist tearing or stretching during insertion and extraction. Damaging a lead during the implanting or replacement of an implantable electronic device increases the complexity and medical risks associated with the required surgery. But, adding strengthening structure to the lead may be difficult and result in undesirable stiffening of the section of the lead where the lead exits the connector. What is therefore needed is an improved in-line connector system that allows easy insertion of an in-line lead into a connector, good retention of the lead once inserted, and reliable contact between the lead""s contacts and the connector""s contacts. Further, it is desirable that an improved in-line connector system, having these qualities, not compromise the beneficial properties which the lead would otherwise have.
The present invention addresses the above and other needs by providing a connector system with spaced-apart moveable contacts in the connector, and means for forcing the moveable connector contacts downward against spaced-apart lead contacts (for the purposes of this description, downward means toward the lead contacts, however, in actual use the connector may be arbitrarily rotated). The connector system may be integrated into the housing of an implanted device for the connection of a lead to the device. Advantageously, the connector system provides easy lead insertion, positive lead retention, and reliable electrical contact, without complexity.
In accordance with one aspect of the invention, there is provided a connector system including one or more spaced-apart moveable contacts in a connector, one or more spaced-apart lead contacts on an end of an in-line lead, and a means for applying downward force against the moveable contacts. When a lead in inserted fully into the connector passageway, the downward force causes the moveable contacts to move from a first position, wherein the moveable contacts are not pressing against the lead contacts, to a second position, wherein the moveable contacts are pressing against the lead contacts. When the movable contacts are in the second position, sufficient force is applied to the moveable contacts by the means for applying downward force, to both retain the lead in the connector, and to provide reliable electrical connection between the moveable contacts and the lead contacts.
It is also a feature of the present invention to provide a connector body made from a resilient material. One or more moveable contacts are molded into the resilient connector body so that, in the absence of force, the moveable contacts rest in a position which permits easy insertion and removal of the lead. When force is applied to the moveable contacts by the means for applying downward force, the moveable contacts press against the lead contacts, thus retaining the lead, and providing reliable electrical contact between the connector contacts and the lead contacts. When the downward force is no longer applied to the moveable contacts, the resilient nature of the connector body causes the moveable contacts to return to the first position, thus freeing the lead.
It is a further feature of the invention to provide a solid cam with solid lobes as a means for applying downward force. The cam may be rotated, and the solid lobes thereby apply force to the moveable contacts, which force results in the moveable contacts moving from the first position to the second position. A cam stop lug is provided on the cam that cooperates with a cam stop in the connector to limit the rotation of the cam. The positions of the cam lug and the cam stop are designed to allow the cam to rotate to a locked position slightly past centering the solid lobes on the moveable contacts. As the cam is rotated from an open position to a locked position, the cam solid lobe pushes down on the moveable contacts. As the cam solid lobes rotate downward and against the moveable contacts, the resisting force of the movable contacts against the cam solid lobes result in torque on the cam resisting the rotation from the open to the locked position. When the cam lobes are pointed directly down (i.e., towards the moveable contacts) the moveable contacts, the solid lobes, and the rotational axis of the cam are aligned. In this position there is no torque on the cam. When the cam is rotated slightly farther, the torque on the cam is reversed and is pushing the cam towards the locked position. A past center effect thus results that causes the cam to remain in the locked position until sufficient torque is applied to force the solid lobes past centering the solid lobes on the moveable contacts. In a preferred embodiment the cam is a straight shaft with solid lobes spaced along the shaft. In an alternative embodiment the cam is a simple wireform device.
In a first alternative embodiment of the means for applying downward force, a rod with bulged sections is inserted into the connector. When the rod is fully inserted, the bulged sections align with the moveable contacts, thus applying force to move the moveable contacts from the first position to the second position. Advantageously, the bulged sections may be radially symmetric which allows the rod to be inserted with arbitrary rotation. In a variation of this embodiment, the rod is captive with a first and second position, wherein the bulges are not aligned with the movable contacts in the first position, allowing easy lead insertion; and the bulges are aligned with the movable contacts in the second position, providing good lead retention.
In a second alternative embodiment of the means for applying downward force, a moveable actuator is captive within the connector. The actuator defines one or more bulges vertically aligned with the moveable contacts. The actuator is free to move vertically within the connector. A key is insertable into the connector through a key passageway above the actuator. When the key is inserted, a ramped surface on the bottom face of the key pushes downward against the actuator causing the actuator to move downward against the moveable contacts, and thus causing the moveable contacts to move from the first position downward to the second position.
In a third alternative embodiment of the means for applying downward force, the single actuator and moveable contacts combination is replaced by individual second actuators cooperating with each movable contact. When the key is inserted, the key""s ramped bottom surface pushes against the second actuators, thus causing the second actuators to move downward and push downward on the moveable contacts. The force of the second actuators on the moveable contacts causes the moveable contacts to move from the first position to the second position. In an alterative to this embodiment, the second actuators and moveable contacts are combined to form second movable contacts. The base of the second movable contact is resiliently molded into the connector body to allow vertical movement of the second moveable contacts and to retain the second moveable contacts in the connector body.

Movable contact locking mechanism for spinal cord stimulator lead connector