An object of the present invention is to provide a drug delivery carrier that is free from the drug leakage problem and has an easily controllable particle size, and that can be used to deliver water-soluble drugs such as genes and proteins in a wide range of applications, including delivery of water-soluble drugs that do not have high anionic properties, and also can be used as a non-viral gene vector. The invention also provides a process for production of such drug delivery carriers. The drug delivery carrier of the present invention includes a water-soluble drug double-coated with two types of inner and outer surfactants 1 and 2.

This application claims the priority of U.S. Provisional Application No. 61/224,171 filed Jul. 9, 2009, the contents of which are hereby incorporated by reference.
Liposomes and Water-in-Oil-in-Water (W/O/W) emulsions are typical known examples of water-soluble drug delivering carriers. However, these carriers are problematic because they involve drug leakage and difficulties in controlling the particle size.
Meanwhile, along with the developments in biotechnology, there have been active attempts to deliver various substances into a target cell, including peptides involved in the cellular signal transduction system, proteins having physiologically important roles in the cell, and expression genes for these products. It is often the case that the expression genes are more suited for delivery into the cell than the product proteins. The reasons for this include the simpler structure (genes do not have as large differences as proteins in overall structures and properties even when the proteins they express are different), good expectancy for lasting efficacy after the introduction into the cell, and no risk posed by the expression genes themselves, even though the expressed proteins may involve a risk or a pathogenic factor. The genes used for this purpose may be genes administered to cause expression of proteins lacking in a diseased cell, or genes that can induce cell death, such as caspase and thymidine kinase expression genes. There have been attempts to use genes themselves as drugs. It is therefore believed that the development of gene vectors having high expression efficiency (gene carriers with high gene introducibility into a cell and high expressibility) or control systems for such gene vectors have important roles in future medical developments (Non-Patent Document 1).
Administration of a gene alone into a cell produces only marginal expression efficiency. This is known to be primarily due to the high anionic properties of the cell membrane structure that includes sugar chains such as proteoglycan. The DNA molecule, as the building block of genes, is a polymer that also has anionic properties. At present, virus vectors produced by inserting or replacing a therapeutic gene into the gene sequence of viruses such as adenovirus and retrovirus represent the most efficient gene vectors. The virus vector takes advantage of the inherent characteristics of the viruses carrying their own genes into a cell, and can achieve high-efficient gene expression; however, its development is limited by safety and productivity (Non-Patent Document 2). As a countermeasure, there have been active studies to create non-viral gene vectors, as represented by, for example, cationic liposome. The commercially available Lipofectamine and Lipofectin, in particular, have become the most mainstream non-viral gene vectors, because these gene vectors have high gene introduction efficiency, and are highly useful and reproducible for many types of cells (Non-Patent Document 3). Aside from these examples, it is known that cationic polymers such as polyethyleneimine (Non-Patent Document 4) and chitosan (Non-Patent Document 5), and amino acid dendrimers (Non-Patent Document 6) also can be used for gene expression. All of these examples are based on the concept that the genes having anionic properties form a complex with the cationic molecules and break through the negatively charged cell membrane. However, these techniques, by themselves, lack serum resistance and blood stability, pose difficulties for use in vivo, and are often limited for further functionalization. There have been attempts to construct a DNA-encapsulated capsule carrier for further functionalization, as described in Non-Patent Document 7 (Multifunctional Envelope-type Nano Device; MEND), and Non-Patent Documents 8 and 9 (polymer micelle). However, these techniques all use cationic molecules for gene encapsulation, and have drawbacks that controlling the expression of the introduced gene in a cell is difficult, and that the techniques are only applicable to the encapsulation of substances having high anionic properties.

Water-soluble drug carrier and process for producing the same

Kyushu University, National University Corporation


Each transfer electrode of a charge transfer unit is made of a main electrode layer and subsidiary electrode layers formed on the side walls of the main electrode layer. The upper surfaces of the transfer electrodes are flush with each other. A charge coupled device having a practically sufficient charge transfer efficiency can be provided. If this charge coupled device is used for an image pickup apparatus, the distance between photoelectric conversion elements and micro lenses can be shortened.

A) Field of the Invention
The present invention relates to a semiconductor device having a plurality of signal lines formed on the surface of a substrate and its manufacture method, and to a solid state image pickup device fabricated in such a semiconductor device and its manufacture method.
B) Description of the Related Art
A solid state image pickup device can be fabricated by forming in one surface of a substrate a number of photoelectric conversion elements, one or two types of charge transfer units for reading charges from the photoelectric conversion elements and transferring them, and a charge detector circuit for detecting and amplifying the charges output from the charge transfer unit. Solid state image pickup devices are widely used as linear image sensors and area image sensors.
In a charge coupled device (CCD) type solid state image pickup device, charges accumulated in photodiodes are transferred through a vertical CCD (VCCD) and a horizontal CCD (HCCD). A CCD can be formed by forming a channel in the surface layer of a semiconductor substrate and disposing a plurality of electrodes (transfer electrodes) in parallel and crossing the channel on an electrically insulated film formed on the substrate. In order to improve the charge transfer efficiency of the CCD, it is desired to dispose adjacent transfer electrodes as near as possible.
In order to improve the transfer efficiency of the CCD, a so-called overlap structure is adopted. A first polysilicon layer is patterned to form first transfer electrodes. After the surfaces of the first transfer electrodes are oxidized, a second polysilicon layer is deposited and patterned to form second transfer electrodes between first transfer electrodes. In this case, in order not to form a gap between first and second transfer electrodes, the edges of the second transfer electrode are patterned to overlap the first transfer electrodes.
For recent solid state image pickup devices used as area image sensors, the integration degree of photoelectric conversion elements is made high in order to realize a high resolution and the size of each photoelectric conversion element is made correspondingly small.
In solid state image pickup devices used as area image sensors, particularly in single-plate solid state image pickup devices, a micro lens is disposed above each photoelectric conversion element via a passivation film or an organic planarizing film to improve the light convergence efficiency. Also in solid state image pickup devices used as linear image sensors, a micro lens is disposed in some cases above each photoelectric conversion element via an organic planarizing film.
A micro lens can be formed, for example, by pattering a transparent resin (inclusive of photoresist) layer into a predetermined shape by photolithography or the like, melting the transparent resin pattern by heat treatment, rounding the corners of each pattern by surface tension and cooling the pattern. A micro lens is formed from each pattern. The size of a micro lens is becoming smaller as the integration degree of photoelectric conversion elements becomes higher.
A small micro lens is likely to have a focal point higher than a desired position (a focal length shorter than a designed length). In order to set the focal point of a micro lens to a desired position, it is desired to shorten the distance between the micro lens and a corresponding photoelectric conversion element.
This distance is difficult to be shortened because each layer requires to have a predetermined thickness or more.
If a CCD has a single-layer electrode structure, i.e., if CCD transfer electrodes can be formed by patterning a single conductive film, the distance can be shortened.
If a single conductive film is patterned by photolithography to form transfer electrodes, the distance between adjacent transfer electrodes becomes relatively long. In order to obtain CCDs of a single-layer electrode structure having a practically sufficient charge transfer efficiency, it is desired to shorten the distance between adjacent transfer electrodes to about 0.2 μm or shorter.
If highly sophisticated photolithography techniques are used, the distance between adjacent transfer electrodes can be shortened to about 0.13 μm to obtain CCDs of a single-layer electrode structure having a desired charge transfer efficiency. However, high resolution patterning results in an increased manufacture cost.

Solid state image pickup device with polysilicon transfer electrodes


There are provided methods for separating iron ions from aluminum ions. For example, the methods can comprise providing a basic aqueous composition comprising said iron ions and said aluminum ions and having a pH of about 10.5 to about 13 and a temperature of about 50 ° C. to about 150 ° C.; reacting said basic aqueous composition with hematite so as to promote, catalyze and/or enhance formation of hematite and to obtain a liquid phase comprising said aluminum ions and a solid phase comprising said so-formed hematite generated with said iron ions; and separating said liquid phase from said solid phase.

Hematite has been used as a colorant for centuries. It is the most common type of naturally occurring iron oxide mineral. Examples of hematites include hematites, pyrites, and magnetites, which are respectively red-colored, yellow-colored, and black-colored. Hematites are mostly prepared as synthetic products, and thus are used in various fields as pigments having clear color tones and excellent durability, being inexpensive and having low toxicity and high stability. In particular, well-known synthetic hematite pigments include red or red brown-colored hematite particle powder (α-Fe2O3 or micaceous iron oxide (MIO)), yellow or deep brown-colored maghemite (γ-Fe2O3) particle powder, and black-colored magnetite (FeOx-Fe2O3 where 0<×<=1). Many of the processes proposed so far for preparing such products comprise at least one drawbacks such as being not cost effective, not being environmental friendly or being complicated.
There is thus a need for at least providing an alternative to the existing solutions for preparing hematites. Moreover, there would be a need for valorizing certain waste materials and at least partially convert them into hematite.

Methods for separating iron ions from aluminum ions


In a switchboard with a databus, a simple apparatus for providing electrical contact with switching devices used with electronics for communication. A switching device unit with a communication capability has an equipment mount that is used for mounting. The equipment mount includes a plurality of switching devices mounted on a standard profile rail, as well as a communication unit which is held on the equipment mount and has plug contacts through which the electrical drive for the switching devices is provided.

1. Field of the Invention
The present invention relates to switching devices in a switchboard, which can communicate with one another via a databus, or can communicate with a higher-level programmable logic controller (PLC).
2. Description of the Prior Art
Systems with switching devices, including the associated control and, possibly, measurement devices, as well as control-unit and display devices, which can be coupled via bus-compatible coupling elements to a databus, for example a two-wire bus, have been disclosed in WO-94/24647. In that publication, the normal control wiring is avoided. The databus has connected to it an interface assembly, which is connected via a serial transmission bus to a communication processor of a programmable logic controller. The interface assembly has a microprocessor with a control program which, with an appropriate configuration, allows the switchboard to be operated as an independent functional island--that is to say, a closed system. Furthermore, higher-level action on the control of the switching, control and measurement devices is possible by the communication processor, which may be located remotely. This system design relieves higher-level systems, such as the programmable logic controller, of control functions, by the communication processor, the protective function is locally decoupled and thus accelerated, and it is possible for the system switchboard to have a defined behavior in the event of failure of the transmission bus.

Switchgear unit capable of communication


A universal input/output buffer uses all digital-type components, can be included on an integrated circuit chip and operates in a mixed voltage, multi-rail, power supply environment. The input/output buffer includes a multi-stage driver section and a sequencing section. Several types of sequencing techniques are used to control a plurality of driver stages and provide a combination of multiple firing schemes. In addition, other control techniques are employed such as full and partial feedback, sequential turn on/turn off of driver stages, and controlled introduction of a small amount of "crow bar" current.

1. Field of the Invention
This invention relates to electronic signal processing and in particular to a digital input/output buffer used to buffer signals to and from logic implemented in an integrated circuit chip and an external interface system and for a mixed voltage, multi-rail, power supply environment.
2. Related Art
It is well known in the art of electronic signal processing that an input/output (IO) buffer is required when signals are transferred from logic included on an integrated circuit chip, or other electronic device, to an interface system external to the chip or electronic device. Prior art input/output buffers typically include pull-up and pull-down transistors driven by NAND and NOR gates respectively, where both the NAND and NOR gates are driven by an output enable signal and an input signal (i.e. the signal to be transferred). Furthermore, at times more than one pull-up and pull-down transistor has been used in parallel with or without an RC delay network. RC delay is provided by a series of capacitors and resistors configured in RC delay networks; the resistances and capacitances can either be lumped or layout parasitics. Such prior art buffers serving as delay elements hence use analog devices, as opposed to the digital devices generally employed by the integrated circuit chip logic and external interface systems. This limitation increases system cost and complicates fabrication With multiple pull-up/pull-down transistors, this type of design does not address the issue of multi-stage firing control, sequencing of the transistor firing, noise and short circuit current (also known as shoot through current or crowbar current). (The process of turning a transistor on is also referred to as "firing" the transistor.)
In addition, it is often desirable to use one supply voltage to operate the logic included on the integrated circuit chip and a different supply voltage for the external interface system. Consequently, it is desirable to have an input/output buffer capable of handling two different supply voltages and which can translate logic signals operating at the first supply voltage to the second supply voltage. For instance, two voltages commonly used art are 3.3 volts, which is generally considered a low noise voltage, and 5.0 volts, which is generally considered to be a noisy voltage supply. Both 3.3 volt and 5.0 volt power supplies typically include a margin of error of .+-.10%.
What is needed is an input/output buffer which uses all digital components (i.e., no resistors or capacitors) and can easily be included on the integrated circuit chip or the external interface system. "Digital components" refers here to transistors. Ideally the input/output buffer operates in a mixed voltage, multi-rail, power supply environment and provides minimal introduction of noise into the data signal. The input/output buffer should also be compatible with the PCI and VL bus electrical characteristics.

Mixed voltage, multi-rail, high drive, low noise, adjustable slew rate input/output buffer


A method of providing a seamless hands-free reader route to a destination includes receiving, at a mobile device, a route from a starting point to the destination, the route including an ordered list of access control devices. An event that triggers a start of the route is detected at the mobile device. The method also includes performing, at the mobile device, for each of the access control devices in an order of the access control devices in the ordered list: scanning for a signal from the access control device; and based on receiving the signal from the access control device, transmitting a message to the access control device, the message including a request to unlock the access control device and a credential that is authorized to unlock the access control device, the credential assigned to a user of the mobile device.

The subject matter disclosed herein generally relates to the field of access control systems, and more particularly to an apparatus and method for providing a seamless hands-free reader route to a destination.
There are many security, or access control, systems for locking and unlocking doors or portals, such as those used for ingress and egress from commercial buildings, residential buildings, and motor vehicles. Electronic security systems typically employ a credential system to determine whether an individual is authorized to unlock a particular access control device. In building complexes such as universities or office premises, seamless mobile access can be provided to controlled spaces. Seamless mobile access allows individuals who have valid mobile credentials on their mobile device to gain automatic access to a controlled space without having to reach for and click an open command from their mobile device, or present a key card to a reader on an access control device. Seamless mobile access can become a challenge when two or more access control devices, such as door locks, are adjacent each other as the strength of the signals being emitted from the access control devices can appear to be the same or nearly the same to the mobile device. In addition, individuals still have to reach for the door to open the door once it has been unlocked which can be inconvenient when carrying a lot of items.

Seamless hands-free reader route to a destination


A surround sound effect control device includes a plurality of sound signal sources each for producing a sound signal, a sound source selection signal generator for generating a sound source selection signal indicative of one sound sources, and a plurality of surround effect circuits for modifying the sound signal. A memory is provided for storing data identifying one surround effect circuit correspondingly to each of the sound sources. A first switching arrangement is provided for selecting one of the plurality of sound sources in response to the sound source selection signal, and a second switching arrangement is provided for selecting one surround effect circuit in response to the data read from the memory.

1. Field of the Invention
The present invention relates to a surround sound effect control device for selecting one of a plurality of surround sound effect circuits and, more particularly, to a surround sound effect control device for use in a television set.
2. Description of the Prior Art
Conventionally, a surround sound effect control device is provided in the audio device to allow the user to vary the reproduced sound effect according to his desire.
An example of a conventional surround effect control device is shown in FIGS. 4. Reference numeral 1 is a sound signal source selection circuit for selecting a signal source from a plurality of signal sources TV, V1, V2, and V3 by a source switch SW1 in response to the sound signal selection signal SA. The selected signal S is transmitted through a line L1. The sound sources are, for example, a television set TV, a first video cassette recorder V1, a second video cassette recorder V2, and a third video cassette recorder V3.
Reference numeral 8 is a surround effect pattern selection circuit for selecting one of a plurality of surround sound effect patterns by surround switches SW2 and SW3 switched to one of surround effect circuits 3, 4, 5, 6, and 7 in response to a surround effect selection signal SS. Surround effect circuits 3, 4, 5, 6, and 7 can modify the sound signal S from line L1 to various signal patterns of surround sound effect, such as "Dolby (Trade Mark) Surround", "Movie Surround", "Music Surround", "Monaural Surround", and "Surround-off". The modified sound signal S' is output through a line L2.
Each of surround sound effect circuits 3, 4, 5, 6 and 7 is briefly described as follows.
The dolby surround circuit 3 reproduces a sound from a sound signal including a delay between left and right sound signals.
The movie surround circuit 4 reproduces a sound by the delay of a difference signal between left and right sound signals.
The music surround circuit 5 reproduces a sound in a manner similar to that of the movie surround circuit 4, but the amount of the delay is reduced.
The monaural surround circuit 6 generates the difference signal from the original sound signal and a delayed signal thereof.
In operation, when the sound selection signal SA is input to the sound source selection circuit 1, the selection switch SW1 turns to connect one of the sound signal sources TV, V1, V2, and V3 to line L1. For example, it is assumed that the switch SW1 is turned such that the sound source V1 is connected to line L1, as depicted in FIG. 4 by the input signal SA.
When the surround effect selection signal SS is input to a surround effect pattern selection circuit 8, the surround switches SW2 and SW3 are turned to connect line L1 to one of surround effect pattern circuits 3, 4, 5, 6, and 7 and further to line L2. For example, it is assumed that the switches SW2 and SW3 are turned such that lines L1 and L2 are connected through the movie surround circuit 4 by the surround effect selection signal SS.
In this case, the sound signal S from the first video cassette recorder V1 is input to the movie surround circuit 4 in which the original sound signal S is modified to signal S'. The modified signal S', thus obtained, is further transmitted to a next stage through line L2.
However, according to the prior art surround sound effect control device, the selection of sound signal sources TV, V1, V2, and V3 and the selection of surround effect pattern circuits 3, 4, 5, 6, and 7 are performed individually, without any mutual relationship. Thus, it is necessary for the user to make two selections, one for the sound signal source and the other for surround sound effect pattern, every time when the viewing source is changed. For example, while watching a TV program which is usually served in a monaural sound, if a user switches to a video cassette recorder, associated with the sound signal source V1, it is necessary to further turn the switches SW2 and SW3 from the "Monaural Surround" to a position other than the "Monaural Surround" so that the stereo sound as usually served by the video cassette tape can be appreciated with its full performance.

Matsushita Electric Industrial Co., Ltd.


Provided herein are compositions and methods for treating cancer by increasing the inhibitory effect of cetuximab on HIF1α expression by administering cetuximab in combination with anti-angiogenic thyroid hormone analogs such as tetrac or triac.

Thyroid hormones, such as L-thyroxine (T4) and 3,5,3′-triiodo-L-thyronine (T3), and their analogs such as GC-1, DITPA, Tetrac and Triac, regulate many different physiological processes in different tissues in vertebrates. It was previously known that many of the actions of thyroid hormones are mediated by the thyroid hormone receptor ("TR"). However, a novel cell surface receptor for thyroid hormone (L-thyroxine, T4; T3) has been described on integrin αvβ3. This receptor is at or near the Arg-Gly-Asp (RGD) recognition site on the integrin. The αvβ3 receptor is not a homologue of the nuclear thyroid hormone receptor (TR), but activation of this cell surface receptor results in a number of nucleus-mediated events, including the recently-reported pro-angiogenic action of the hormone and fibroblast migration in vitro in the human dermal fibroblast monolayer model of wound-healing.
Evidence that thyroid hormone can act primarily outside the cell nucleus has come from studies of mitochondrial responses to T3 and diiodothyronine (T2), from rapid onset effects of the hormone at the cell membrane, and from actions on cytoplasmic proteins. The recent description of a plasma membrane receptor for thyroid hormone on integrin αvβ3 has provided some insight into effects of the hormone on membrane ion pumps, such as the Na+/H+ antiporter, and has led to the description of interfaces between actions initiated at the membrane thyroid hormone receptor and nuclear events that underlie important cellular or tissue processes, such as, for example, angiogenesis and proliferation of certain tumor cells.
Integrin αvβ3 binds thyroid hormone near the Arg-Gly-Asp (RGD) recognition site of the integrin protein. The RGD site is involved in the protein-protein interactions linking the integrin to extracellular matrix (ECM) proteins such as vitronectin, fibronectin and laminin. (See Plow et al., 2000. J. Biol. Chem. 275:21785-88). Also initiated at the cell surface integrin receptor is the complex process of angiogenesis, which can be monitored in either a standard chick blood vessel assay or with human endothelial cells in a sprouting assay. This hormone-dependent process requires mitogen-activated protein kinase (MAPK; extracellular regulated kinase [ERK] 1/2) activation and the elaboration of vascular growth factors, including, but not limited to basic fibroblast growth factor (bFGF; FGF2), which is the downstream mediator of thyroid hormone's effect on angiogenesis. Tetrac blocks this action of T4 and T3, as does RGD peptide and other small molecules (such as XT-199) that mimic RGD peptide(s). Thus, it is possible that desirable neovascularization can be promoted with local application of thyroid hormone analogs, for example, in wound-healing, or that undesirable angiogenesis, such as that which supports tumor growth, can be antagonized with tetrac or triac.

Combination treatment of cancer with cetuximab and tetrac


An air conditioning system comprises a heat source side unit adapted to condense and supply a fluid which can change a phase between a gas phase and a liquid phase and a plurality of user side units entirely or mostly disposed below the heat source side unit in terms of number and connected to said heat source side unit by piping so as to establish a circulation of the fluid supplied from said heat source side unit passing through said heat source side unit and said user side units by utilizing the difference in specific gravity between the liquid phase and the gas phase of said liquid so that it can provide a cooling/heating effect regardless of the floors where the user side units are installed and the power consumption rate of the system can be minimized. More specifically, the heat source side unit 1 and the user side units 4 arranged below the heat source side unit 1 are connected by way of liquid phase piping 6 and gas phase piping 7 to form a closed circuit 3 and a motor pump 10 is arranged along the liquid phase piping 6. Refrigerant R-134a is condensed in the heat source side unit 1 and sent to the user side units 4 by the motor pump 10 in the cooling mode of operation, whereas it is condensed in the user side units 4 and sent to the heat source side unit 1 by the motor pump 10 in the heating mode of operation. The number of revolutions per unit time of the motor pump is controlled modifying the number of poles of the pump or the frequency of the AC fed to the pump.

1. Field of the Invention
This invention relates to an air conditioning system and, more particularly, it relates to a system adapted to circulate a fluid which can change a phase between a gas phase and a liquid phase through a heat source side unit and a plurality of user side units more than half of which are disposed below the heat source side unit in terms of number by utilizing the difference in specific gravity between the liquid phase and the gas phase of the fluid and the discharging force of a pump arranged along a liquid phase pipe so as to make each of the user side units at least capable of cooling ambient air.
2. Background Art
FIG. 13 of the accompanying drawings schematically illustrates a known air conditioning system of the type under consideration disclosed in Japanese Patent Application Laid-Open No. 7-151359. Referring to FIG. 13, it comprises components including an exterior heat exchanger (hereinafter referred to as heat source side unit) 1 adapted to supply cold or hot water, a plurality of user side units 4 disposed at a level lower than that of the heat source side unit 1, each having a heat exchanger 5 and a flow control valves 8, a motor pump 10 and a number of switch valves 11 through 14, which components are connected by way of liquid phase piping 6 and gas phase piping 7 to form a closed circuit 3 so that a refrigerant sealed in the closed circuit 3 circulates through the heat source side unit 1 and the user side units 4 to provide the user side units 4 with a cooling/heating effect. Reference symbol S14 denotes a liquid level sensor arranged at the user side unit 1 for controlling the motor pump 10 so as to provide the user side unit 1 constantly with a given amount of refrigerant when the system is in operation.
With the known air conditioning system having a configuration as described above, assume here that the temperature of the room where one of the user side units 4 is installed is raised. If the switch valves 11 and 12 are closed whereas the switch valves 13 and 14 are opened along with the flow control valve 8 to feed the user side unit 1 with cooling water for cooling and condensing the refrigerant while the motor pump 10 is at rest, then the refrigerant condensed in the user side unit 1 falls through the liquid phase piping 6 by its own weight to flow into the heat exchanger 5 of the user side unit 4 by way of the switch valves 13 and 14 and the related flow control valve 8.
The refrigerant flown into the heat exchanger 5 absorbs heat from the air in the room by way of the pipe walls of the heat exchanger to cool the inside of the room to become evaporated and flow into the gas phase piping 7 and then to the heat source side unit 1 where the refrigerant is condensed to reduce the internal pressure so that a natural circulation is established in the system without driving the motor pump 10 to forcibly circulate the refrigerant even in summer when the power consumption level may be maximal in the local community. Thus, such a system provides a great advantage of reducing the running cost particularly when the system is in full operation.
If, on the other hand, the switch valves 11 and 14 are closed whereas the switch valves 12 and 13 are opened along with the flow control valve 8 and the motor pump 10 is driven to cool and condense the refrigerant sealed in the closed circuit 3 by the cooling effect of the heat source side unit 1, then the condensed refrigerant in the heat source side unit 1 flows down through the liquid phase piping 6 by its own weight and the discharging effect of the motor pump 10 to get into the heat exchanger 5 by way of the flow control valve 8 so that a circulation of refrigerant is forcibly established to provide a cooling effect in the room.
Thus, when the motor pump lo is driven for cooling, the system provides an advantage of supplying the heat exchanger 5 of the user side unit 4 with refrigerant at an sufficiently high rate, if the unit 4 is arranged on an upper floor located directly below the heat source side 1.
Now, assume that the temperature of the room where one of the user side units 4 is installed falls. If the switch valves 13 and 14 are closed whereas the switch valve 11 and 14 are opened along with the flow control valve 8 and the motor pump 10 is driven to supply the heat source side unit 1 with hot water and heat and evaporate the refrigerant sealed in the closed circuit 3, then the vapor of refrigerant produced in the heat source side unit 1 is made to flow into the heat exchanger 5 by way of the gas phase piping 7.
The vapor of refrigerant flown into the heat exchanger 5 emits heat into the room by way of the pipe walls of the heat exchanger 5 to raise the temperature in the room and, at the same time, become condensed before it flows into the liquid phase piping 6 and then back to the heat source side unit 1 by way of the switch valves 14 and 11 under the driving effect of the motor pump 10 to establish a circulation of refrigerant so that the user side unit 4 keeps on operating to heat the inside of the room.
With the above described known air conditioning system according to Japanese Patent Application Laid-Open No. 7-151359, while the power consumption rate and hence the running cost of the system are reduced in summer when the power consumption level may be maximal in the local community if the motor pump is held at rest to establish a natural circulation of refrigerant, the user side units may not operate effectively for cooling nor provide a satisfactory cooling effect when they are arranged at a level close to that of the heat source side unit.
If the motor pump is driven for cooling, the power consumption rate of the motor pump will become significant although the user side units that are arranged at a level close to that of the heat source side unit may be fed with refrigerant at a sufficient rate to provide a satisfactory cooling effect. It will be appreciated that the power consumption rate of the motor pump will always be significant because the motor pump has to have a large output power that can draw the refrigerant condensed in the user side units up to the heat source side unit located higher than them.
Thus, there is a need for a air conditioning system that can provide a satisfactory cooling effect and, at the same time, effectively suppress the power consumption rate even in mid summer when the power consumption level may be maximal in the local community.
Additionally, known air conditioning systems of the type under consideration are accompanied by a drawback of unsatisfactory operation that appears when the pressure of the refrigerant contained in the closed circuit drops abruptly while the system is operating for cooling because the refrigerant in the liquid phase piping starts boiling to produce bubbles and becomes unable to play its role. Another drawback of known air conditioning systems is that most of the refrigerant in the liquid state can held in the heat source side unit when the system is operating for cooling so that only an insufficient amount of refrigerant circulates through the user side units.


A modulating light having a wavelength of 400 nm to 600 nm is irradiated to a portion around hair roots at an energy of 0.01 J/cm2 to 1 J/cm2 over a time period of not more than 1 ms as a flash light such that a light absorptive component existing in a human body around the hair roots absorbs the light for modulating hair growth without causing substantial adverse effect.

Removal of hair by irradiating with light is known in the field of medicine. This involves the removal of hair by necrosis in which cells of hair roots (and hair follicles) are destroyed using a high output (class 4) laser. However, since side effects such as burns and age spots easily occur accompanying cell destruction, this procedure can only be performed by specialized physicians.
Although it would be desirable to enable hair removal and hair regeneration to be able to be easily performed at home, there is currently no such technology capable of responding to this demand. Furthermore, although there is an instrument for assisting hair growth and hair generation described in Japanese Patent Publication No. 2002-541906 that imparts microvibrations to the scalp while irradiating with light, the irradiation of light in this case is for assisting penetration of a hair tonic into the scalp that supplies nutrients to hair papilla, and the irradiation of light is not intended to act on hair growth or hair regeneration. Although Japanese Patent Publication No. 2005-519692 proposes a method for inhibiting hair growth with low-power light, adequate effects are unable to be obtained with only the technology indicated therein.

Hair growth modulating method and modulation device thereof

National University Corporation Shimane University


A method and device are provided for suppressing periodic interference signals, including a unit which is used to provide a period length for the periodic interference signal, an interference detection unit for detecting a signal corresponding to the interference signal, and a subtraction unit for subtracting the signal corresponding to the interference signal. The interference detection unit carries out multiple superpositioning of the input signal and scales the multiple superpositioned input signal depending on the period length of the interference signal in order to detect the signal corresponding to the interference signal.

The present invention relates to a method and a device for suppressing essentially periodic interference signals, and in particular to a method and a device for suppressing periodic interference in the audio frequency range, which is caused, for example, by a digital telecommunications system during the transmission of data, and acts, for example, on a mobile telecommunications terminal or an external device such as, for example, a hearing aid.
In a large number of digital telecommunications systems, data is transmitted between a mobile telecommunications terminal such as, for example, a mobile telephone, and an associated base station by way of a pulsed radio frequency signal with a predetermined carrier frequency. For what is referred to as a GSM telecommunications system (Global System for Mobile Communications), the carrier frequency is 900 MHz and a pulse frequency is approximately 217 Hz. In contrast, in the case of a Digital Enhanced Cordless Telecommunications (DECT) system the carrier frequency is 1800 MHz and the associated pulse frequency is 100 Hz. A further standard which is based on GSM is the DCS1800 standard which also operates at 1800 MHz. In digital telecommunications systems, a large number of carrier frequencies with different pulse frequencies are therefore used, for which reason the manufacturers of terminals are increasingly developing what are referred to as dual-band or triple-band terminals for implementing the various standards.
In particular, the pulsed radio frequency signal causes problems in this context. The pulsed radio frequency signal is demodulated, for example, by the nonlinear FET characteristic curve of a microphone which is present in the terminal, and in doing so gives rise to interference in the audio frequency range, some of which is clearly perceptible.
FIG. 1 shows a simplified representation over time of a signal which has been subjected to periodic interference such as is output, for example, at the output of a signal source such as, for example, a microphone, which has been subjected to interference by a pulsed radio frequency signal.
FIG. 2 shows a simplified representation over time of the associated pulsed radio frequency signal or periodic interference signal such as occurs, for example, in GSM or DECT telecommunications systems. According to FIG. 2, in the GSM standard, radio frequency pulses which contain the actual information are transmitted at a time interval T of approximately 4.7 milliseconds. In the DECT standard, this time interval T is 10 milliseconds and corresponds to a frequency of 100 Hz in contrast to 217 Hz in the case of GSM. These periodic interference signals can then act on a printed circuit board, and in particular on a signal source such as, for example, a microphone, resulting in the interference peaks represented in FIG. 1.
Conventional devices and methods for suppressing these periodic interference signals are essentially based on shielding the radio interference by way of, for example, a conductive shielding housing of the signal source or a conductive microphone housing. It is necessary to ensure here that the housing is enclosed as completely as possible. An optimum effect is usually achieved by way of a metallic shield. However, such a shield is costly and takes up a lot of space, in particular in devices such as, for example, a mobile telecommunications terminal and/or a hearing aid.
A further possible way of suppressing these periodic interference signals is to eliminate the line-bound interference by way of filtering.
In this context, interference-suppression capacitors are used which are typically mounted spatially close to the field-effect transistor (FET) of the microphone in order to attenuate the periodic radio frequency interference signal there as much as possible. The selection of the capacitor is particularly critical here since the influence of parasitic inductances increases greatly at high frequencies.
Consequently, an optimum interference suppression is achieved only with a capacitor whose impedance is minimal for the respective frequency of the interference signal. However, a disadvantage here is that such signal sources or microphones which are tuned using capacitors cost significantly more than conventional standard electret microphones. In addition, a new signal source or microphone has to be developed for each new telecommunications terminal or mobile telephone model or else each type of hearing aid, since the hardware environment such as, for example, the printed circuit board layout of the terminal or of the hearing aid, influences the properties of the interference-suppression capacitor. A further disadvantage consists in the fact that a respective interference-suppression capacitor is required for each carrier frequency so that signal sources with two interference-suppression capacitors are necessary for a dual-band device, and signal sources with even three interference-suppression capacitors are necessary for a triple-band device.
The present invention is therefore directed toward a method and a device for suppressing essentially periodic interference signals, permitting simplified and improved interference suppression.

Method and device for the suppression of periodic interference signals


A composition for removing a copper-compatible resist includes: about 0.1% to about 10% by weight of an alkylbenzenesulfonic compound; about 10% to about 99% by weight of a glycolether compound; and about 0.5% to about 5% by weight of a corrosion inhibitor.

1. Field of the Invention
The present invention relates to a composition for removing a copper (Cu)-compatible resist, and more particularly, to a composition for removing a copper-compatible resist without corrosion of copper.
2. Discussion of the Related Art
In general, a low resistance copper line is commonly used as an array line of an array substrate for a liquid crystal display (LCD) device, or in a circuit line of a semiconductor device to prevent resistance-capacitance (RC) delay. A copper layer for the copper line is formed through a chemical vapor deposition (CVD) method, an atomic layer deposition (ALD) method, an electroless deposition method, or an electroplating method as an electrochemical deposition method. The copper line is commonly formed using a photolithographic process incorporating fine pattern technology. The photolithographic process is commonly used for fabricating semiconductor devices such as large scale integrated (LSI) circuits, very large scale integrated (VLSI) circuits, and display devices including an LCD device and a plasma panel display (PDP) device.
FIG. 1 is a perspective view of a liquid crystal display device using a copper line according to the related art.
In FIG. 1, a liquid crystal display (LCD) device 11 includes an upper substrate 5, a lower substrate 10, and a liquid crystal layer 9 interposed between the upper and lower substrates 5 and 10. The upper substrate 5 includes a color filter layer 7, a black matrix 6, and a common electrode 18. The lower substrate 10 includes a pixel electrode 17 formed at a pixel region "P," a switching element "T," and an array line. Thin film transistors (TFTs) "T" as a switching element are disposed in a matrix configuration, and gate and data lines 14 and 22 are connected to each of the TFTs "T." The pixel region "P" is defined by the gate and data lines 14 and 22, and the transparent pixel electrode 17 is formed at the pixel region "P." The pixel electrode 17 and the common electrode 18 are made of a transparent conductive metal such as indium-tin-oxide (ITO) and indium-zinc-oxide (IZO). The LCD device 11 is driven by utilizing an electro-optical effect of the liquid crystal layer 9. Accordingly, the gate line 14 should be made of a low resistance material such as copper (Cu) and copper/titanium (Cu/Ti).
FIG. 2 is a schematic cross-sectional view of an array substrate for a liquid crystal display device according to the related art.
In FIG. 2, a gate electrode 30 and a gate line 14 (of FIG. 1) are formed on a substrate 10 by depositing and patterning a conductive metallic material such as aluminum (Al), chromium (Cr), molybdenum (Mo) and copper (Cu). A first insulating layer (a gate insulating layer) 32 is formed on the gate electrode 30 and the gate line 14 (of FIG. 1). An active layer 34 of intrinsic amorphous silicon (a-Si:H) and an ohmic contact layer 36 of impurity-doped amorphous silicon (n+or p+ a-Si:H) are formed on the first insulating layer 32 over the gate electrode 30. Source and drain electrodes 38 and 40 are formed on the ohmic contact layer 36 by depositing and patterning a conductive metallic material such as aluminum (Al), chromium (Cr), molybdenum (Mo) and copper (Cu). At the same time, a data line 22 connected to the source electrode 38 is formed on the first insulating layer 32. A second insulating layer (a passivation layer) 42 is formed on the source and drain electrodes 38 and 40, and the data line 22. A transparent pixel electrode 17 connected to the drain electrode 40 is formed on the second insulating layer 42.
Array lines such as the gate line 14 (of FIG. 1) and the data line 22 can be made of Cu having a low resistance. The Cu line can be used as a metal line of a semiconductor device.
FIGS. 3A to 3E are cross-sectional views showing a photolithographic process of a copper line for a liquid crystal display device or a semiconductor device according to the related art.
In FIG. 3A, a metal layer 62 is formed on a substrate 60 by depositing a metallic material for a metal line. A semiconductor substrate (a wafer) or a glass substrate can be used as the substrate 60. Next, a photoresist (PR) layer 64 of positive or negative type is formed on the metal layer 62. For example, a positive type PR layer will be illustrated in FIGS. 3A to 3E. Even though the PR layer 64 may be formed on an entire or a predetermined region of the substrate 60, the PR layer 64 is generally formed on the entire region of the substrate 60.
In FIG. 3B, a photo mask 66 having a predetermined pattern is disposed over the PR layer 64 of the substrate 60. Next, an exposure process is performed, wherein light "L" such as an ultra violet (UV) ray and an X ray is irradiated onto the photo mask 66. The photo mask 66 includes a transmitting portion "E" and a shielding portion "F," wherein the light passing through the transmitting portion "E" transforms the PR layer 64. Accordingly, the PR layer 64 includes a first portion "C" where a material property of the PR layer 64 is maintained and a second portion "D" where a material property of the PR layer 64 is transformed. Since the PR layer 64 is potentially patterned according to the photo mask 66, this pattern of the PR layer 64 is referred to as a latent image.
In FIG. 3C, the PR layer 64 (of FIG. 3B) having the latent image is developed to form a resist pattern 65 that corresponds to the photo mask 66 (of FIG. 3B). Specifically, the first portion "C" (of FIG. 3B) where the light "L" (of FIG. 3B) is not irradiated remains to cover the metal layer 62 and the second portion "D" (of FIG. 3B) where the light "L" (of FIG. 3B) is irradiated is eliminated to expose the metal layer 62.
In FIG. 3D, the metal layer 62 (of FIG. 3C) is etched using the resist pattern 65 as an etching mask, whereby a metal line 68 of a specific shape is formed on the substrate 60.
In FIG. 3E, the resist pattern 65 (of FIG. 3D) is eliminated, and the metal line 68 of the specific shape is exposed.
However, the metal line of copper may be easily corroded by conventional solvents used for removing the resist pattern. Accordingly, an advantage of the present invention is to eliminate the resist pattern 65 on the metal line 68 without corrosion of the metal line 68. Solvent compositions that include a corrosion inhibitor for preventing corrosion of copper may be used, as demonstrated by U.S. Pat. Nos. 5,417,877 and 5,556,482, which are hereby incorporated by references for all purposes as if fully set forth herein. The corrosion inhibitors include monoethanolamine (MEA) as a preferred amine. In addition, a specific amount of corrosion inhibitor is required so that a removing property of the inhibitor is not degraded.
FIG. 4 is a scanning electron microscope (SEM) image showing a corrosion state of a copper line when a solvent composition including conventional amine is used.
In FIG. 4, when a resist pattern is eliminated by using a solvent composition including conventional amine, corrosion of a copper line is not prevented. As a result, the copper line is also eliminated due to a galvanic effect, and a fragment of the copper line is laid on a glass substrate. Accordingly, reliability of the metal line is reduced due to such a defect.
Solvent compositions that include an organic acid for eliminating a resist pattern may be used, as demonstrated by U.S. Pat. No. 4,242,218, which is hereby incorporated by reference for all purposes as if fully set forth herein. A solvent composition of petroleum compound having 1–14 carbon chain classified into alkylsulfonic acid and alkylallyl is suggested. Dodecylbenzenesulfonic acid and toluenesulfonic acid are disclosed as arylsulfonic acid. However, the solvent compound having an organic acid causes severe corrosion of a copper line when a corrosion inhibitor is not added.

Composition and method for removing copper-compatible resist


A detector is provided for nuclear medicine imaging. Scintillator pixels form an axial array and a transaxial array. A first photosensor is positioned along the axial array; and a second photosensor is positioned along the transaxial array, wherein the first photosensor and the second photosensor provide dual event localization for nuclear medicine imaging.

Medical radionuclide imaging, commonly referred to as nuclear medicine, is a significant diagnostic tool that involves the use of ionizing radiation to obtain accurate imaging of an in vivo patient. Typically, one or more biologically appropriate radiopharmaceuticals are administered to a patient, as by ingestion, inhalation, or injection. Tracer amounts of these radioactive substances emanate gamma quanta while localizing at specific organs, bones, or tissues of interest within the patient's body. One or more radiation detectors (e.g., positron emission tomography (PET) detector) are then used to record the internal spatial distribution of the radiopharmaceutical as it propagates from the study area. Known applications of nuclear medicine include: analysis of kidney function, imaging blood-flow and heart function, scanning lungs for respiratory performance, identification of gallbladder blockage, bone evaluation, determining the presence and/or spread of cancer, identification of bowel bleeding, evaluating brain activity, locating the presence of infection, and measuring thyroid function and activity. Hence, accurate detection is vital in such medical applications.
In position emission tomography (PET), certain detectors utilize a scintillator array and an array of photosensors to provide event localization within the scintillator array for 2-dimensional (2-D) imaging. However, it is readily apparent that 3-D information can be very advantageous, particularly in the above medical applications. With 3-D information, parallax errors can be reduced or eliminated within enough spatial resolution in the transaxial direction.
Traditionally, a monolithic scintillator can be used to obtain 3-D information. Unfortunately, this approach has the drawback of a reduced active area due to "edge effects." That is, near edges (or corners) photons are not easily directed and can result in misinformation, thereby negatively impact imaging; notably the resolution is reduced. That is, when gamma interactions occur near the edges of monolithic scintillators, the light produced is not channeled or collected properly which can result in poor event localization. Monolithic blocks also suffer from poor event localization when the incoming gamma ray is at oblique angles to the front surface of the detector.
Based on the foregoing, there is a clear need for an improved detector for nuclear medicine imaging.

Method and apparatus for providing depth-of-interaction detection using positron emission tomography (PET)


An elevating scaffold trailer is provided for transporting burley tobacco stalks impaled on tobacco rods from the field into a curing cell and subsequently out of the curing cell. The trailer comprises an elevating device for raising tobacco rod carrying devices above the height of holding racks within the curing cell. The trailer is transported into the curing cell whereby the elevating device lowers the tobacco rod carrying device below the level of the holding racks so that the tobacco rods are transferred to the holding racks. A method for gathering and transporting burley tobacco to a curing cell is also provided. The method involves using the elevating wheeled scaffold trailer to transport cut burley tobacco stalks to the curing cell and for transferring the tobacco to holding racks within the curing cell.

The present invention relates to an Elevating Scaffold Trailer and more particularly to an apparatus and method for transporting cut burley tobacco stalks to and from a curing cell and for transferring the cut tobacco stalks to and from holding racks within the curing cell.
Burley tobacco plants grow as relatively tall stalks with the tobacco leaves growing radially out from the stalks. In the past, when the burley tobacco plant stalks are cut down, the widest portion (bottom of the stalk) of the main stem is manually skewered onto a wooden stake which has a sharpened point affixed at one end thereto. Generally, each stake is about five or six feet long, and about five or six different plants are threaded onto each stake and pushed toward the intermediate portion of the stake away from the opposite free ends of the stake. The stakes would then be carried, to wooden curing sheds.
The stakes would then be manually hung across beams or supports within the curing shed and packed fairly tightly therein. The stakes were usually stored in levels or tiers within the wooden curing shed, generally three or four tiers of tobacco stakes would be hung within any single curing shed. This is a very labor intensive operation requiring many man hours and fairly dangerous work conditions.
Previously, the tobacco stakes were either carried to the curing sheds by workers or loaded onto trailers and driven to the curing sheds. Once at the sheds, the stakes were manually transferred to the supports within the curing shed. Mechanical means, such as the tobacco stick elevator disclosed by Arnold U.S. Pat. No. 3,580,386, may have been employed to raise the tobacco sticks to their appropriate tiers within the curing shed.
Trailers with vertically adjustable frames are disclosed in the art. U.S. Pat. No. 4,618,307 to Kress et al. discloses a carrier for lifting and transporting a scrap bucket supported in a stand having a rectangular lower frame. The carrier includes a trailer which may be raised and lowered with respect to its support wheels.
Likewise, U.S. Pat. No. 3,424,489 to Hoy discloses a transport vehicle having an upper deck disposed above a lower deck. The patent discloses apparatus for lowering the rear end of the upper deck to a position from which it may be loaded in a fashion similar to and as easily as the lower deck is loaded. The front of the upper and lower decks are pivoted relative each other and the rear ends are connected through a toggle linkage.
U.S. Pat. No. 3,802,006 to Nelson et al. discloses a boat trailer including a rack arrangement that is rotatably mounted on a frame. The rack consists of a number of vertical posts having one end pivotally mounted between stringers of a frame. A pair of braces connect the post. A cable and wench are used to rotate the post and braces upward.
U.S. Pat. No. 3,542,226 to Hutton discloses a portable dolly having a vertically movable bed containing a plurality of pole conveying rollers journaled therein to assist in the loading and unloading of wire poles from the bed of the dolly. A built-in jack means may be provided for raising and lowering the bed above the frames.
U.S. Pat. No. 3,165,208 to Lewis. U.S. Pat. No. 3,262,587 to Anderson. U.S. Pat. No. 3,580,386 to Arnould et al., and U.S. Pat. No. 4,361,002 to Swetnam et al. disclose various holders for sticks used to mount tobacco stalks.


A process for making a glass product with reduced greenhouse gas emission, comprising: providing a raw material composition comprising at least one silicon dioxide or silicon dioxide-containing compound and at least one pre-reacted compound, wherein the pre-reacted compound comprises an atom of an alkaline earth metal chemically bonded to an oxygen atom, and a silicon atom chemically bonded to the oxygen atom; melting the raw material composition to produce a molten material; and forming the molten material into a glass product.

A conventional process for manufacturing a glass product such as glass fibers includes the melting of various raw materials to form molten glass. Glass fibers can then be formed from the molten glass by conventional methods. Melting the conventional raw materials typically results in the release of significant quantities of certain gases such as greenhouse gases (GHGs) into the atmosphere. For example, substantial quantities of carbonate-based raw materials such as limestone and dolomite are typically used in conventional raw material compositions to facilitate processing of the material and to impart desirable characteristics to the glass product. The melting of such carbonate-based raw materials, however, typically results in the production of significant quantities of GHGs such as carbon dioxide.
The production of GHGs can also result from other processes commonly employed in a conventional glass fiber manufacturing process. Generation of electricity for providing energy used to melt the raw materials often involves a combustion reaction that produces GHGs. In addition, fiberization of molten glass can involve a combustion reaction that produces GHGs.
It can be advantageous to reduce emissions of greenhouse gases (GHGs) to the atmosphere. It can also be beneficial to improve the energy efficiency of a glass product manufacturing process.

Composition and method of making a glass product with reduced greenhouse gas emission


Photoresist overcoat compositions are provided. The compositions comprise: a matrix polymer, an additive polymer a basic quencher and an organic solvent. The additive polymer has a lower surface energy than a surface energy of the matrix polymer, and the additive polymer is present in the overcoat composition in an amount of from 1 to 20 wt % based on total solids of the overcoat composition. The compositions have particular applicability in the semiconductor manufacturing industry for use in negative tone development processes.

The invention relates generally to the manufacture of electronic devices. More specifically, this invention relates to photoresist overcoat compositions useful in photolithographic methods which allow for the formation of fine patterns using a negative tone development process.
In the semiconductor manufacturing industry, photoresist materials are used for transferring an image to one or more underlying layers, such as metal, semiconductor and dielectric layers, disposed on a semiconductor substrate, as well as to the substrate itself. To increase the integration density of semiconductor devices and allow for the formation of structures having dimensions in the nanometer range, photoresists and photolithography processing tools having high-resolution capabilities have been and continue to be developed.
Positive-tone chemically amplified photoresists are conventionally used for high-resolution processing using a positive tone development (PTD) process. In the PTD process, exposed regions of a photoresist layer become soluble in a developer solution, typically an aqueous alkaline developer, and are removed from the substrate surface, whereas unexposed regions which are insoluble in the developer remain after development to form a positive image. To improve lithographic performance, immersion lithography tools have been developed to effectively increase the numerical aperture (NA) of the lens of the imaging device, for example, a scanner having a KrF or ArF light source. This is accomplished by use of a relatively high refractive index fluid (i.e., an immersion fluid) between the last surface of the imaging device and the upper surface of the semiconductor wafer.
Considerable effort has been made to extend the practical resolution beyond that achieved with positive tone development from both a materials and processing standpoint. One such example is the negative tone development (NTD) process. The NTD process allows for improved resolution and process window as compared with standard positive tone imaging by making use of the superior imaging quality obtained with bright field masks for printing critical dark field layers. NTD resists typically employ a resin having acid-labile (also referred to herein as acid-cleavable) groups and a photoacid generator. Exposure to actinic radiation causes the photoacid generator to form an acid which, during post-exposure baking, causes cleavage of the acid-labile groups giving rise to a polarity switch in the exposed regions. As a result, a difference in solubility characteristics is created between exposed and unexposed regions of the resist such that unexposed regions of the resist can be removed by organic solvent developers, leaving behind a pattern created by the insoluble exposed regions.
Problems in NTD processing in the form of necking of contact holes and T-topping of line and trench patterns in the developed resist patterns are known and described in U.S. Application Pub. No. US2013/0244438A1. Such problems are believed to be caused by diffusion of stray light beneath edges of the photomask opaque pattern, undesirably causing polarity-switching in those "dark" regions at the resist surface. In an effort to address this problem, the '438 publication discloses use of a photoresist overcoat that includes a basic quencher, a polymer and an organic solvent. For purposes of immersion lithography, the '438 publication further discloses that the overcoat compositions can be used to form a barrier layer for avoidance of leaching of photoresist components into the immersion fluid and to provide desirable contact angle characteristics with the immersion fluid for increased exposure scan speeds.
There is a continuing need in the art for improved photolithographic methods and photoresist overcoat compositions for the formation of fine patterns with improved contact angle characteristics between the substrate surface and immersion fluid which would allow for greater immersion scanner speeds.


Disclosed is an coating/developing apparatus and method thereof in which the processing time is shortened and the foot prints is reduced by shortening the travel distance of a wafer transfer arm. The coating/developing apparatus of the present disclosure includes, inter alia, liquid processing part (COT) that processes the substrate using a liquid, a cooling processing part (CA) provided to correspond to the liquid processing part (COT) and perform the cooling process for the substrate, a liquid processing unit (COTU) provided to correspond to the cooling processing part (CA) and equipped with a heating processing part (HP) that performs a heating processing for the substrate. The cooling processing part (CA) transfers the substrate to/from the liquid processing part (COT) and the heating processing part (HP).

In a photolithography process of a semiconductor device fabrication process, a fine resist pattern is formed by performing processes such as a hydrophobic conversion process for the surface of a semiconductor wafer (hereinafter "a substrate" or "wafer") first, and then, a coating and heating process of BARC (Bottom Anti-Reflective Coating), an exposing process, and then an developing process of a solubilization portion and removing the same.
Prior to the exposing process of the resist pattern, a series of processes are continuously performed including a coating process of BARC, a heating process (a pre-baking) to evaporate the solvent inside the applied BARC, a cooling process, a resist coating process that applies a resist to a cooled wafer, and a heating process (a pre-baking) to evaporate the solvent inside the applied resist solution. Also, after the exposing process of the resist pattern, a series of processes are performed including a heating process (a pre-baking after the exposure process), a cooling process, and an exposure process that applies an exposure solution to a cooled wafer to expose the wafer.
Recently, the foot prints of the entire coating/developing apparatus that performs a coating and developing processes of a semiconductor wafer has been increased as the wafer size becomes larger (e.g. 450 mm).
Moreover, the processing capability of wafers per unit time may be increased for a cost saving, and for this reason, multiple processing units are included in a coating/developing apparatus thereby further increasing the foot prints of the entire apparatus.
Japanese Laid-Open 2003-7795 shows an exemplary coating/developing apparatus where each processing unit is placed on both sides from the cassette side toward the exposure apparatus, and a common wafer transfer arm is provided at the center.

Coating/developing apparatus and coating/developing method


A method of applying a coating solution for forming a coating film of desired thickness. The coating solution begins to be supplied to a region centrally of a substrate. The spinning substrate is accelerated from a supplying rotational frequency to a higher, target rotational frequency before the coating solution is spread by the supplying rotational frequency to cover an entire surface of the substrate. Then, the supply of the coating solution is stopped. Subsequently, the substrate is spun with a film-forming rotational frequency lower than the target rotational frequency to form the coating film. The substrate is spun at high speed with the target rotational frequency for a variable period of time to adjust thickness of the coating film.

(1) Field of the Invention
This invention relates to methods and apparatus for applying a coating solution such as SOG (Spin On Glass, also called a silica coating material), photoresist or polyimide resin to substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays or glass substrates for optical disks (hereinafter referred to simply as substrates or as wafers). More particularly, the invention relates to a technique of supplying a coating solution to the surface of each substrate to form a coating film in a desired thickness thereon.
(2) Description of the Related Art
A conventional coating solution applying method of the type noted above will be described with reference to FIG. 1. FIG. 1 shows a principal portion of a substrate spin coating apparatus.
The illustrated apparatus includes a suction type spin chuck 10 for suction-supporting and spinning a substrate or wafer W in a substantially horizontal posture, and a supply nozzle 30 disposed substantially over the center of spin for supplying a photoresist solution R, which is a coating solution, to a surface of wafer W.
In a conventional coating solution applying method utilizing the apparatus with the above construction, rotational frequency controls are carried out as shown in the time chart of FIG. 2, for example, to form a photoresist film in a desired thickness on the surface of wafer W.
First, the spin chuck 10 is driven by a motor, not shown, to spin the wafer W at a predetermined rotational frequency R1 (e.g. 900 rpm). At a point of time t.sub.S at which the spin stabilizes, photoresist solution R begins to be delivered at a substantially constant flow rate from the supply nozzle 30. Photoresist solution R continues to be supplied to a region around the spin center of wafer W. The supply of photoresist solution R is stopped at a point of time t.sub.E which is a predetermined time after the photoresist supply starting point t.sub.S. A quantity of photoresist solution R supplied is determined such that substantially the entire surface of wafer W is covered by the photoresist solution R at the supply stopping point of time t.sub.E. Then, the rotational frequency of the spin chuck 10 is increased from rotational frequency R1 to rotational frequency R2 (e.g. 3,000 rpm). This higher rotational frequency R2 is maintained for a predetermined time. Consequently, a superfluous part of photoresist solution R supplied to the surface of wafer W is dispelled, thereby forming a photoresist film in a desired thickness on the surface of wafer W.
In order to adjust the thickness of the photoresist film, as shown in dotted lines in FIG. 2, the rotational frequency R2 may be decreased to form a thick film, or may be increased to form a thin film. The above photoresist solution supplying method in which the photoresist solution supply is started and stopped while the wafer W is spinning is called "dynamic method" in this specification.
On the other hand, a supplying method different from the dynamic method may be employed in which, as shown in parentheses in FIG. 2, the photoresist solution supply is started at a point of time (t.sub.S) when the wafer W is stationary, and stopped after rotation of the wafer W begins. This supplying method is a combination of the above dynamic method and a supplying method (hereinafter called static method) in which the photoresist solution supply is started and stopped while the wafer W is maintained stationary. Thus, this supplying method will be called "stamic method" in this specification.
The conventional photoresist solution applying method noted above has the drawbacks set forth hereunder. While these drawbacks will be described, taking the "dynamic method" for example, they are equally applicable to the "stamic method".
After supply of the photoresist solution R is started at the point of time t.sub.S in FIG. 2, the photoresist solution R supplied to a region around the center of wafer W, while retaining a substantially circular shape in plan view, spreads concentrically under the centrifugal force due to the rotational frequency R1. Subsequently, however, the photoresist solution R supplied to the region around the center of wafer W does not spread evenly in radial directions. Instead, as shown in FIG. 3, from a circular drop Ra (hereinafter referred to as core Ra) of photoresist solution R present around the spin center of wafer W, the photoresist solution R begins to flow in a plurality of rivulets (hereinafter referred to as fingers Rb) extending radially toward the edge of wafer W.
As the photoresist solution continues to be supplied in this state, the fingers Rb first extend and reach the edge of wafer W. With a further supply of photoresist solution, the fingers Rb become broader while the core Ra increases in diameter. As a result, uncovered regions between the fingers Rb become filled with the photoresist solution R, until finally the entire surface of wafer W is covered by the photoresist solution R.
In the stage of rotational frequency R1, the entire surface of wafer W is covered by the photoresist solution R exhibiting the foregoing behavior. After the fingers Rb reach the edge of wafer W, a large part of the photoresist solution R on the wafer W flows through the fingers Rb to scatter to the ambient. In order to cover the entire surface of wafer W, it is necessary to take into account the quantity of photoresist solution R scattering to the ambient after flowing through the fingers Rb, and to supply the photoresist solution R in a correspondingly increased quantity. If the photoresist solution R were supplied in an insufficient quantity, the uncovered regions between the fingers Rb would not be filled with the photoresist solution R. Even if the rotational frequency of wafer W is switched to the rotational frequency R2, it is impossible to form a photoresist film of uniform thickness.
Thus, according to the conventional coating solution applying method, a large quantity of photoresist solution R must be supplied in order to form a photoresist film of uniform thickness on the wafer W. This poses a problem of a very low efficiency of using the photoresist solution R. The photoresist solution is far more expensive than a treating solution such as a developer or a rinse used in manufacture of semiconductor devices. Thus, to improve the efficiency of using the photoresist solution through a reduction in the quantity of scattering photoresist solution is an important consideration in achieving low manufacturing costs of semiconductor devices and the like.
In addition, there has been a trend recently to use larger semiconductor wafers in the manufacture of semiconductor devices. It is urgently required to achieve a technical objective of forming photoresist films of highly uniform thickness while cutting down the consumption of photoresist solution as much as possible. Attempts are being made today to adopt large wafers 300 mm in diameter rather than 8-inch (about 200 mm) wafers, for example. Processing of wafers having such a large diameter encounters the following inconvenience besides that noted above.
When a large wafer of 300 mm diameter is processed under the rotational frequency controls according to the time chart shown in FIG. 2, a photoresist film formed on the wafer surface has a drastically reduced uniformity in thickness. When a photoresist film is formed on the wafer W in a spin, turbulent gas flows are generated adjacent the edge of the wafer W. These gas flows are more conspicuous for large diameter wafers. The turbulence results in an uneven vaporization of solvent occurring with the photoresist solution spreading from the center to the edge of the wafer W. This phenomenon is believed to be the main cause of the drastically reduced uniformity in film thickness.
The rotational frequency of the wafer W must be lowered in order to suppress the turbulent gas flows to secure a uniform film thickness. Taking the foregoing controls for example, the rotational frequency R1 should be lowered from the conventional 900 rpm to 700 rpm, and the rotational frequency R2 from the conventional 3,000 rpm to 1,500 rpm. By lowering the rotational frequencies R1 and R2 to the stated levels, turbulent flows may be suppressed to improve the uniformity in film thickness. However, naturally, the photoresist solution will be dispelled from the wafer W in a reduced quantity, resulting in an increased thickness of photoresist film formed thereon. Thus, it is difficult to form a photoresist film of desired thickness, especially a thin photoresist film.
To obtain a photoresist film of desired thickness with a high degree of uniformity in film thickness, it has been proposed to adjust the viscosity (e.g. in units of 0.1 cp) of the photoresist solution according to a desired film thickness. That is, a thin film may be formed by supplying a photoresist solution of low viscosity. With such a technique, however, there is a limitation to the adjustable range of film thickness. After all, film thickness must be adjusted by varying the levels of rotational frequencies R1 and R2. However, in the case of a large wafer, the problem of non-uniform film thickness due to turbulent gas flows inhibits major adjustments to be made to the rotational frequencies R1 and R2 over the ranges that were possible in the past. Consequently, only a small range is allowed for adjusting the thickness of photoresist film while securing a high level of uniformity in film thickness.
The proposed technique of adjusting film thickness by varying the viscosity of the photoresist solution can hardly be said a realistic method of processing large wafers. The reason is that a solvent mixing mechanism is required for mixing a photoresist solution of fixed viscosity with a solvent in a quantity corresponding to a desired film thickness, or a photoresist solution switching mechanism for selecting a photoresist solution from photoresist solutions of varied viscosity levels prepared in advance, to be supplied according to a film thickness needed. In any case, the apparatus and its controls will be extremely complicated.

Coating solution applying method and apparatus


The time it takes to recover from a system initialization failure may be reduced by determining whether to enable a recovery process immediately, or defer such a process. Sometimes it is desirable to defer a recovery process until certain interdependencies between system components are satisfied.

Initialization refers to the procedure of starting up a system and bringing the system to a point in its operation where it can begin performing its normal functions. In known distributed software applications, an overall software-based process/application may be separated into a number of software components that are distributed among a plurality of processors interconnected via a network. Each component performs some portion of the functionality of the overall software application.
For a system that consists of a single software component operating in isolation, initializing the system is a simple procedure. However, as the number of system components and their interaction increases, initialization becomes complex due to interdependencies between system components. An "interdependency" is a relationship between two or more components. When two components are interdependent, their initialization must be properly coordinated. A key challenge for a system consisting of multiple components is to initialize the system as quickly as possible while at the same time satisfying such interdependencies. For large-scale distributed systems consisting of hundreds or even thousands of components (such as those encountered in grid computing), this is especially important. A failure to appreciate the complex nature of the interdependences involved by, for example, initializing components one at a time, could result in an initialization time that takes too long to complete.
Further complicating matters is the fact that a failure may occur during initialization. Restarting an entire initialization procedure from the beginning may not be desirable because of the lengthy initialization times needed by various system components. Conversely, restarting and reinitializing only components that failed may not lead to a successfully initialized system because those components that did not fail (so-called "fault-free" components) may depend on a failed component, thus preventing initialization. For example, if a failed component is restarted, an interdependent fault-free component may need to re-establish new communication channels with the restarted component.
So-called fault tolerance techniques (e.g., rollback recovery) may be used to recover from failures that occur during initialization. In rollback recovery, each software component performs frequent periodic check pointing of its state and stores the state in a stable storage area. Upon failure of the software component, a backup software component accesses the stored state information. It is assumed that the most recent copy is correct. However, the state information may have changed since the last check pointing before the failure occurred. To overcome this problem, software components are continuously interrupted during normal operation in order to save their associated state information. Frequent periodic check pointing of software components, however, wastes time and resources, adds extra complexity to a system and imposes performance limitations. While a rollback recovery approach may be feasible in some cases, other techniques appear to be more promising.
Another technique uses characteristics unique to initialization to optimize recovery. For example, because all state information introduced into a component during initialization is either derived from hard-coded or other persistent information, such as configuration information stored in a database, or is determined from actions that take place during initialization (e.g., obtaining the handle to a communication channel involving another component), this state information can easily be recreated should the component fail. However, in some cases the recreated state information may be different from the original. Hence, preserving this state information (e.g., via checkpointing) is not required. Nonetheless, undo operations (e.g., closing a broken communication channel) are still required.
In sum, it is desirable to provide for techniques that provide for quick recovery from initialization failures.
It is also desirable to provide for techniques that take advantage of characteristics unique to initialization in order to provide for quick recovery from initialization failures.

Methods and devices for recovering from initialization failures


The invention is related to phosphorus substituted compounds with activity for treating metabolic diseases and/or disorders, e.g., diabetes and hypercholesterolemia, compositions containing such compounds, and therapeutic methods that include the administration of such compounds, as well as to processes and intermediates useful for preparing such compounds.

Improving the delivery of drugs and other agents to target cells and tissues has been the focus of considerable research for many years. Though many attempts have been made to develop effective methods for importing biologically active molecules into cells, both in vivo and in vitro, none has proved to be entirely satisfactory. Optimizing the association of the inhibitory drug with its intracellular target, while minimizing intercellular redistribution of the drug, e.g., to neighboring cells, is often difficult or inefficient.
Most agents currently administered to a patient parenterally are not targeted, resulting in systemic delivery of the agent to cells and tissues of the body where it is unnecessary, and often undesirable. This may result in adverse drug side effects, and often limits the dose of a drug (e.g., glucocorticoids and other anti-inflammatory drugs) that can be administered. By comparison, although oral administration of drugs is generally recognized as a convenient and economical method of administration, oral administration can result in either (a) uptake of the drug through the cellular and tissue barriers, e.g., blood/brain, epithelial, cell membrane, resulting in undesirable systemic distribution, or (b) temporary residence of the drug within the gastrointestinal tract. Accordingly, a major goal has been to develop methods for specifically targeting agents to cells and tissues. Benefits of such treatment includes avoiding the general physiological effects of inappropriate delivery of such agents to other cells and tissues, such as uninfected cells.
Statins lower plasma cholesterol level by decreasing hepatic cholesterol biosynthesis and by upregulating low-density lipoprotein (LDL) receptors on hepatocytes. Their side effects, such as gastrointestinal discomfort, headache, rash and elevations in serum transaminase activity (a sign of hepatotoxicity) have been the principal problems preventing their usage.
Pitavastatin (U.S. Pat. No. 5,856,336), Rosuvastatin (Crestor) (U.S. Pat. No. RE37,314 and U.S. Pat. No. 5,260,440), Pravastatin (U.S. Pat. No. 4,346,227), Fluvastatin (U.S. Pat. Nos. 5,354,772 and 4,739,073), Lovastatin and Sivastatin (mevalonate analogs; U.S. Pat. Nos. 4,231,938and 4,444,784), Cerivastatin (a substituted pyridine; U.S. Pat. No. 5,006,530) are members of the statin class of HMG-CoA reductase inhibitors used as oral treatments for hypercholesterolemia and dyslipidemia. They are structural analogs of the half-reduced intermediate of HMG-CoA and, as such, inhibit the formation of mevalonate.
Compounds such as Pitavastatin and its opened chain form are useful for inhibiting chloesterol biosynthesis and lowering blood cholesterol levels and, as such, are useful in the treatment of atherosclerosis hypercholesterolemia and hyper lipoproteinemia as described in U.S. Pat. No. 5,856,336.
Certain triaryl ethylenes are useful in the treatment of hypercholesterolemia and osteoporosis by acting as selective estrogen receptor modulators. One such derivative, Ospemifene, is described in WO01/36360.
Certain 2,6-dialkylated phenols and their derivatives are useful in the treatment of atherosclerosis and hyperlipedemia through the reduction in the expression of VCAM-1. One such derivative, AGI-1067, is described in U.S. Pat. No. 6,147,250.
Certain trans-6-[2-(3- or 4-carboxamido-substituted pyrrol-1-yl)alkyl]-4-hydroxypyran-2-ones and the corresponding ring-opened acids derived therefrom are potent inhibitors of the enzyme 3-hydroxy-3-methylglutaryl-coenzyme A reductase (HMG CoA reductase) and are thus useful hypolipidemic or hypocholesterolemic agents (U.S. Pat. No. 4,681,893). Atorvastatin, a member of the statin class of HMG-CoA reductase inhibitors, is used as an oral treatment for hypercholesterolemia and dyslipidemia. It is a structural analog of the half-reduced intermediate of HMG-CoA and, as such, inhibits the formation of mevalonate.
Compound ML-236B (U.S. Pat. No. 3,983,140) has been isolated and purified from the metabolic products of microorganisms of the genus Penicillium, especially Penicillium citrinum. It has been shown to inhibit the biosynthesis of cholesterol by enzymes or cultured cells separated from experimental animals by competing with the rate-limiting enzyme active in the biosynthesis of cholesterol, namely 3-hydroxy-3-methylglutaryl-coenzyme A reductase and, as a result, significantly reduces serum cholesterol levels of animals (Journal of Antibiotics, 29:1346 (1976)). A number of compounds structurally related to ML-236B also inhibit the biosynthesis of cholesterol. A series of new compounds, which may be prepared by the enzymatic hydroxylation of ML-236B or of derivatives thereof, possess an ability to inhibit the biosynthesis of cholesterol which is at least comparable with, and in some instances substantially exceeds, that of ML-236B itself, are described in U.S. Pat. No. 4,346,227.
Humans as well as other animal organisms need insulin, a pancreatic hormone, in order to utilize glucose. Insulin stimulates the movement of the glucose from the blood into tissue cells, especially muscular cells, and expedites the synthesis of fats as well as of proteins in practically all organs. In diabetics, the pancreas does not produce this hormone in sufficient quantity, resulting in glucose levels in the blood elevating, which causes the known symptoms of diabetes mellitus.
Specific sulfonylureas, which may be administered orally, possess a blood sugar reducing effect, especially in those cases were diabetes occurs during old age (see U.S. Pat. No. 4,146,613). Compounds such as Troglitazone and Rosiglitazone can be useful for blood-glucose lowering activity and are therefore of potential use in the treatment and/or prophylaxis of hyperglycaemia and are of particular use in the treatment of Type II diabetes. These compounds are also useful for the treatment and/or prophylaxis of other diseases including hyperlipidaemia, hypertension, and cardiovascular disease, especially atherosclerosis. In addition these compounds are considered to be useful for treating certain eating disorders, in particular the regulation of appetite and food intake in subjects suffering from disorders associated with under-eating, such as anorexia nervosa, and disorders associated with over-eating, such as obesity and anorexia bulimia. (U.S. Pat. No. 6,288,095)
MK-767 (U.S. Pat. No. 6,030,990) is a useful therapeutic agent for the treatment of type-II diabetes. Type-II diabetes is a metabolic disorder characterized by hyperglycemia as well as insulin resistance and/or impaired insulin secretion. MK-767 is a peroxisome proliferator-activated receptor (PPAR) alpha and gamma agonist. There are three isoforms of PPARs, α, β, and γ. Although they have similar insulin-like effects, these isoforms act via different mechanisms in different target tissues (Calkin, A. C. et al., Current Opinions in Investigational Drugs, 2003, 4, 4, 444). Experimental data have suggested that drugs combining both PPARα and PPARγ activation may exert a more potent hypotriglyceridemic effect than either compound alone.
Rosiglitazone (U.S. Pat. No. 5,002,953) is a useful therapeutic agent for the treatment of Type II diabetes. Rosiglitazone maleate is an oral antidiabetic agent, which acts primarily by increasing insulin sensitivity. Rosiglitazone improves glycemic control while reducing circulating insulin levels. A number of side effects are associated with rosiglitazone.
Pioglitazone (U.S. Pat. Nos. 5,356,913 and 4,687,777) is a useful therapeutic agent for the treatment of Type II diabetes. Mechanistically, pioglitazone hydrochloride decreases insulin resistance in the periphery and in the liver, resulting in increased insulin-dependent glucose disposal and decreased hepatic glucose output. Pioglitazone hydrochloride, like other thiazolidinediones, can cause fluid retention when used alone or in combination with other antidiabetic agents, including insulin.
R-483 (WO 02/080913) is a useful therapeutic agent for the treatment of Type II diabetes. R-483 is a potent agonist for the peroxisome proliferator-activated receptor-gamma (PPAR-γ).
Tesaglitazar (WO 0140171 and U.S. Pat. No. 6,531,622) is a useful therapeutic agent for the treatment of Type II diabetes. Tesaglitazar is a potent agonist for the peroxisome proliferator-activated receptor-gamma and alpha (PPAR-γ and PPAR-α). Activation of PPAR-γ nuclear hormone receptors improves insulin sensitivity. PPAR-α activation decreases serum triglycerides and increases serum HDL-cholestrol. Hypertriglyceridemia and low serum HDL-cholestrol are characteristic of both diabeticdyslipidemia and insulin resistance syndrome. A potent activator of both PPAR-α and PPAR-γ therefore, could possibly replace two classes of drugs used commonly for Type II diabetes, namely selective PPAR-γ activator such as rosiglitazone and pioglitazone and PPAR-α-activating compounds of the fibrate group, such as bezafibrate and fenofibrate.
Thus, there is a need for therapeutic agents for treating metabolic disorders having improved pharmacological properties, e.g., drugs having improved activity for treating hypercholesterolemia, dyslipidemia, hyperlipoproteinemia, osteoporosis, atherosclerosis, hyperlipedemia, hypolipidemic, hypocholesterolemic, hyperglycaemia, type II diabetes, hypertension, cardiovascular disease, atherosclerosis, eating disorders, anorexia nervosa, obesity and/or anorexia bulimia, and pharmacokinetic properties, including improved oral bioavailability, greater potency and extended effective half-life in vivo. New compounds should have fewer side effects, less complicated dosing schedules, and be orally active. In particular, there is a need for a less onerous dosage regimen, such as one pill, once per day.
Assay methods capable of determining the presence or absence of metabolic disease are of practical utility in the search for treatment as well as for diagnosing the presence of metabolic diseases.

Phosphonate analogs for treating metabolic diseases


The present invention generally relates to authenticating a user of an electronic device comprising a capacitive fingerprint sensor and an optical sensor arranged side-by-side with the capacitive fingerprint sensor. In accordance with the present invention a first image of at least a first portion of an object is acquired using the capacitive fingerprint sensor and an optical image of at least a second portion of the object is acquired using the optical sensor, the optical image and the first image being representative of neighboring portions of the object. An edge portion of the first image is matched with at least an edge portion of the optical image, where the edge portions represent the object at the border between the capacitive fingerprint sensor and the optical sensor. When there is a match, a fingerprint authentication procedure may be performed.

Various types of biometric systems are used more and more in order to provide an increased security for accessing an electronic device and at the same time keep the user convenience at an acceptable level. In particular fingerprint sensors have been successfully integrated in such devices, for example, thanks to their small form factor, high performance and user acceptance. Among the various available fingerprint sensing principles (such as capacitive, optical, thermal etc.), capacitive sensing is most commonly used, in particular in applications where size and power consumption are important.
All capacitive fingerprint sensors provide an indicative measure of the capacitance between several sensing elements and a finger placed on the surface of the fingerprint sensor. Acquisition of a fingerprint image is typically performed using a fingerprint sensor comprising a plurality of sensing elements arranged in a two-dimensional manner, and a block based technique may be applied to the fingerprint sensor for acquiring a fingerprint image, where the blocks of sensing elements are sampled sequentially.
One of the problems associated with fingerprint sensors concerns so-called spoof fingers trying to mimic a live fingerprint to thereby deceive a fingerprint sensor. If fraud by the spoof finger is successful, unauthorized access to systems may undesirably be approved or unauthorized transactions may be approved which may lead to disastrous consequences. Furthermore, a spoof finger is relatively easy to produce which may eventually lead to an increasing number of fraud attempts, in particular as fingerprint sensors become more and more common as a means for authentication.
Therefore, there is a need for improvement with regards to increasing the level of security with regard to authentication with fingerprint sensors.