A device for filtration of fat extracted during liposuction procedures. The device includes: a first reservoir filled with a physiological solution adapted to be suctioned by a syringe containing fat mixed with blood and anesthetic; a second reservoir, empty, intended to receive cyclically from the syringe a liquid mixture consisting of the suctioned solution, blood and anesthetic separated from the fat; and at least one filter element provided with a connection member for connection of the syringe, the filter element being connected to the first reservoir and the second reservoir through a three-way connector. A first one-way valve configured to allow passage of a flow of fluid from the first reservoir towards the connector is arranged on a branch of the connector connected to the first reservoir. A second one-way valve configured to allow passage of a flow of fluid from the connector towards the second reservoir is arranged on a branch of the connector connected to the second reservoir.

Liposuction has been introduced since the 70s of the last century. Initially it was a very invasive intervention carried out under general anesthesia in major surgery rooms. The procedure took several hours and fat in excess was sucked by way of large cannulas with a diameter ranging from 1 to 4 cm connected to a high-power suction unit. The fat was then eliminated along with large amounts of blood and anesthetic. In many cases, blood transfusions were required in the days following an intervention and many complications and deaths are reported in medical literature.
Less invasive liposuction techniques have been developed only since the 90s of the last century. The size of the cannulas has been progressively reduced up to diameters of 2-5 mm. The introduction of the tumescent anesthesia technique has allowed to carry out surgical interventions under local anesthesia. According to the tumescent technique a large volume of liquid containing a local anesthetic combined with a vasoconstrictor (adrenaline) is injected in an area to be treated. This injection reduces the pain caused to the patient during suction of fat and allows to limit bleeding, thus making liposuction easier and less dangerous.
The so-called "lipofilling" procedures have been developed over the past 20 years. These procedures exploit the sucked fat as a filler to reshape and increase of the volume of breast, gluteus and calf. Face wrinkles may also be filled and corrected, lips, cheekbones and chin may be reshaped as well.
Therefore it has become necessary to preserve the integrity of the sucked fat as much as possible. Unlike the first liposuction procedures, in fact, fat is no longer eliminated, but becomes a resource in the frame of the aesthetic procedure. The effectiveness of this resource is closely related to the survival of fat cells, i.e. adipocytes and stem cells and adipocyte precursor cells. These cells are taken from a site where they are in excess (thighs, abdomen, hips) and are grafted on a site to be reshaped (breasts, lips, etc.). The procedure is very delicate and is always accompanied by the death of a variable percentage of adipocytes. The survival rate ranges between 70%, in the better cases, and below 10%, which means failure of the lipofilling procedure.
The survival of fat cells is linked to several factors, such as their individual properties, the degree of oxidation of the tissues, the type of infiltration technique, the fact that the patient is a smoker, the trauma caused by a cannula during the sucking process, etc. The local anesthetic used to numb the surgical site is among the most important damaging factors for the adipocytes, because it has a toxic effect on the cells in the 12-24 hours subsequent to their graft into the target site. Damage is increased by the presence of erythrocytes that have an important oxidative effect if left with fat cells. In order to reduce tissue damage cannulas of a smaller size have recently been developed. These cannulas can be more easily inserted in the fatty tissue thus reducing the force to be applied. Cannulas having special patterns and shape of the holes through which fat is sucked have also been developed. An example of such cannulas is described in the Italian patent application no. 102015902323792 in the applicant's name.
During a liposuction procedure it is necessary to inject an anesthetic solution into the site from which fat has to be sucked. The anesthetic is usually injected by way of syringes.
Once made the anesthesia, suitable liposuction cannulas are mounted on the same syringes employed for this purpose and used to suck fat. The sucked fat is mixed with local anesthetic and blood. The difference in specific gravity is usually exploited as a means to separate adipocyte cells from the liquid mixture. To this aim the syringes are kept vertically manually or by way of suitable racks. Fat has a lower specific gravity and is collected in the upper part of a syringe, i.e. towards the plunger, while the liquid mixture is deposited in the lower part of the syringe, wherein an attachment member of the cannula is arranged, and can thus be eliminated.
In order to ensure survival of adipocyte cells in view of a subsequent lipofilling procedure, the fat remaining in the syringe must be processed with a washing solution, typically a physiological solution, for one or more cycles so as to purify it from residual blood and anesthetic. Blood and anesthetic are in fact toxic to adipocytes. More particularly, in each cycle a certain amount of washing solution is sucked into the syringe, which is then positioned vertically so as to allow separation of fat and liquid, the latter consisting of physiological solution, residual blood and anesthetic. The liquid deposited in the lower part of the syringe because of its higher specific gravity is then eliminated and fresh physiological solution is sucked into the syringe so as to carry out another washing and separation cycle.
A number of different containers are generally employed for the above operations, whose success is highly dependent on the manual ability of an operator. The containers must be properly prepared and organized before surgery. For example, a first container is filled with physiological or saline solution, a second container is filled with an anesthetic and a third container is used to collect the liquid to be eliminated at each cycle of the purification process. These containers are generally open and thus exposed to a possible contamination by bacteria present in an operating room.


A process for forming a high quality epitaxial compound semiconductor layer of indium gallium nitride In.sub.x Ga.sub.1-x N, (where 0<x<1) on a substrate. A first gas including indium trichloride (InCl.sub.3) and a second gas including ammonia (NH.sub.3) are introduced into a reaction chamber and heated at a first temperature. Indium nitride (InN) is grown epitaxially on the substrate by nitrogen (N.sub.2) carrier gas to form an InN buffer layer. Thereafter, a third gas including hydrogen chloride (H1) and gallium (Ga) is introduced with the first and second gases into a chamber heated at a second temperature higher than the first temperature and an epitaxial In.sub.x Ga.sub.1-x N layer is grown on the buffer layer by N.sub.2 gas. By using helium, instead of N.sub.2, as carrier gas, the In.sub.x Ga.sub.1-x N layer with more homogeneous quality is obtained. In addition, the InN buffer layer is allowed to be modified into a GaN buffer layer.

1. Field of the Invention
The present invention relates to a process for vapor phase epitaxy of a compound semiconductor, and particularly to a process for growing indium gallium nitride (In.sub.x Ga.sub.1-x N, where, 0<x<1) by vapor phase epitaxy.
2. Description of Related Art
In FIG. 1, there is shown a diagrammatic sectional view of a structure of a blue or green light emitting diode (LED) element of a type of gallium nitride (GaN) on a sapphire substrate, and such a structure is presently put on the market and described, for example, in "Nikkei Science" October 1994, page 44.
This blue or green LED element includes an epitaxial wafer comprising a sapphire substrate 11, a GaN buffer layer formed on the substrate 11, and a hexagonal GaN epitaxial layer 13 formed on the GaN buffer layer 12. The LED element further includes a clad layer 14, a light emitting layer 15, a clad layer 16 and GaN epitaxial layer 17 formed, in turn, on the wafer, and is also provided with ohmic electrodes 18 and 19. Furthermore, the GaN buffer layer 12 in the LED element is placed for decreasing defects by the differences of lattice constants between the sapphire substrate 11 and the GaN epitaxial layer 12.
In the above blue or green LED element, the substrate 11 is made of sapphire with an insulation property. When the electrodes 18 and 19 are formed on the element, it is also necessary for these electrodes to be formed on the same face side of the element. Therefore, forming the electrodes requires complex processes, for example, at least two patterning processes by photolithography and further an etching process by reactive ion etching.
Further, because hardness of sapphire is large, there is a problem that the sapphire substrates is difficult to be cut when separating into the individual elements. In an aspect of application of the LED element, furthermore, because sapphire cannot be cleaved, the element cannot be used as a laser diode which acts as an optical resonator with cleaved surfaces.
Thus, instead of sapphire with these drawbacks, conductive gallium arsenide (GaAs) is tried to be used as a substrate. Namely, it is studied for gallium nitride (GaN) to grow on a GaAs substrate by metal-organic chloride vapor phase epitaxy techniques, so-called "MOCVPE". This growth of GaN is sufficiently faster than growths by prior organometallic vapor phase epitaxy techniques, so-called "OMVPE".
Methods by MOCVPE techniques use, as raw materials, chlorides of elements in the third group of the element periodic table, and allow GaN to grow rapidly. The methods also allow growth of indium gallium nitride (InGaN) which provides an active layer of an LED element.
Further, it is desired to realize a pure blue wavelength LED element with high indium (In) mole fraction "x" of In.sub.x Ga.sub.1-x N. However, as this In mole fraction "x" increases in In.sub.x Ga.sub.1-x N, it is necessary to decrease a growth temperature on epitaxy. As a result, decreasing the temperature causes a problem that a growth rate of the epitaxy is slower.
Additionally, in "Kristall und Technik" Vol.12 No.6 (1977), pages 541 to 545, it is reported that chloride, namely indium trichloride (INCl.sub.3), is used as an In source and ammonia (NH.sub.3) is used as a nitride source, so that a hexagonal indium nitride (InN) crystal is grown on a sapphire substrate. However, the InN growth on a GaAs substrate is not examined Accordingly, cubic InN and InGaN adapted to manufacturing a laser diode are not obtained.
In the prior MOCVPE techniques that aluminium (Al), gallium (Ga) and indium (In) of elements in the third group of the element periodic table are provided as chlorides, a metal-organic raw material including one of the elements in the third group, for example, trimethylindium (TMIn: C.sub.3 H.sub.9 In) and trimethylgallium (TMGa: C.sub.3 H.sub.9 Ga), is provided together with hydrogen chloride (HCl). In the case of the former example, TMIn and HCl are composed into indium chloride (InCl) and the InCl is reacted with ammonia (NH.sub.3) gas to grow InN and InGaN grown on a substrate, for example, a GaAs substrate.
However, these MOCVPE techniques lead to a slow growth rate on the substrate and cannot reproduce a certain composition of InGaN.
On the other hand, when vapor phase epitaxy (VPE) of compound semiconductor is performed, selection of atmosphere and carrier gasses is one of important key factors that strongly affect quality of the compound semiconductor to be formed.
For example, Japanese patent Laid-open Publication No.Showa (J-PA) 49-121478 (Hitachi) discloses a VPE technique that compound semiconductor is grown by vapor phase epitaxy with an inactive gas. Hydrogen (H.sub.2) gas used before this technique has smaller specific gravity than raw material gasses and doping material gasses. The technique of Hitachi selects argon (Ar) gas which has a specific gravity close to raw material and doping material gasses, so that these raw material and doping material gasses are mixed uniformly to obtain uniformity of epitaxial layer and homogeneous impurity concentration.
Further, in Japanese patent Laid-open Publication No.Showa (JP-A) 51-126036 (Fujitsu), there is described another VPE process for growing a semiconductor crystal, which provides a carrier gas including an inactive gas with adjunctive hydrogen (H.sub.2) gas less than 0.02 at volume ratio to the inactive gas. If only H.sub.2 gas is used as a carrier gas, the H.sub.2 gas reduces quartz (SiO.sub.2) forming a wall of a reaction furnace to produce impurities of silicon (Si), and inhomogeneity of reacting gas concentration is caused chiefly by the difference of molecular weights between a raw material gas and the H.sub.2 carrier, because the furnace has a structure of a horizontal type. In this process of Fujitsu, inactive gas, such as nitrogen (N.sub.2) gas, argon (Ar) gas, etc., is used as a carrier gas for sending arsenic trichloride (AsCl.sub.3) into the furnace, so that the inactive gas does not happen to react with the material of the wall at all, and an epitaxial layer of the crystal is allowed to grow rapidly and to be homogeneous.
In the process (Fujitsu), further, since the H.sub.2 gas of a very small quantity is added adjunctively to the inactive carrier gas, crystal growth and impurity concentration are well controlled and maintained at certain levels. Namely, without the H.sub.2 gas, AsCl.sub.3 repeats thermal decomposition and recombination, according to the following reversible reactive equation (1), and as a result the crystal growth becomes remarkably unstable. But, with a very small mount of the adjunctive H.sub.2 gas, an effective reaction, according to the further following reversible equation (2), and this reaction saturates at the volume ratio 0.02 of H.sub.2 gas to the inactive gas: ##EQU1##
Furthermore, in Japanese patent Laid-open Publication No.Showa (JP-A) 58-167766 (Kogyogijutsu-in), there is described a VPE apparatus in which a raw material gas is introduced upwards from the bottom and discharged out of the top. If a raw material gas has heavier molecular weight than a carrier gas, there are problems that the raw material gas is distributed inhomogeneously in the carrier gas and thickness of a layer is also distributed inhomogeneously. In this apparatus of Kogyogijutsu-in, because a carrier gas such as nitrogen (N.sub.2) gas, argon (Ar) gas, etc., is introduced upwards from the bottom, the inhomogeneous distribution of deposited layer on a substrate is improved.

Process for vapor phase epitaxy of compound semiconductor


An imager assembly is disclosed. The imager assembly may have a camera sensor, a circuit board, an electrical contact assembly, and/or a lens assembly. The camera sensor may be operable to generate an image upon exposure to light. The electrical contact assembly may be electrically connected to the circuit board and operable to receive power therefrom. Additionally, the electrical contact assembly may comprise first and second spring contacts. The lens assembly may comprise a lens operable to gather and focus light onto the camera sensor. Further, the lens assembly may comprise a heating element. The heating element may be operable to heat the lens. Further, the heating element may comprise third and fourth contacts, where the third and fourth contacts may engage the first and second contacts, respectively. The engagement may be operable to transmit power.

Cameras for imaging are well know and commonly used on vehicles. Often, these cameras are used to capture images of scenes rearward and/or forward a vehicle on which they are disposed. Further, the image may be communicated to a display for viewing by a vehicle occupant. The conditions to which these cameras are subject often require competing features. For example, due to exposure to the vehicle exterior, the camera must be waterproof. Additionally, due to exposure to low temperatures, the camera must also have a heater to warm the lens of the camera. However, providing such features, while also having a camera that is easy and cost effective to manufacture, may be difficult. Measures taken to enhance waterproofing may interfere with providing the heater, or vice versa, especially when the camera must be easy and cost effective to manufacture. Accordingly, there is a need for an improved camera.


Testing an integrated circuit having programmable logic is described. Programmable logic is configured as a daisy-chain of registers (310-1 through 310-(N+1)) in a closed input/output loop to register a logic 1 and logic 0s. The logic states are circulated around the closed input/output loop. Operation of output blocks (210-1 through 210-N) is controlled responsive to a series of outputs (316-1 through 316-N) provided from a portion of the daisy-chain of registers (310-1 through 310-N) to selectively place an output block of output blocks (210-1 through 210-N) in an output mode responsive to the logic 1 output in the series of outputs while leaving the output blocks remaining in a non-output mode responsive to the logic 0s in the series of outputs. The output blocks (210-1 through 210-N) are commonly coupled at an output node (212) for coupling to a single test channel, as only one output block is in the output mode at a time.

Programmable logic devices ("PLDs") are a well-known type of integrated circuit that can be programmed to perform specified logic functions. One type of PLD, the field programmable gate array ("FPGA"), typically includes an array of programmable tiles. These programmable tiles can include, for example, input/output blocks ("IOBs"), configurable logic blocks ("CLBs"), dedicated random access memory blocks ("BRAMs"), multipliers, digital signal processing blocks ("DSPs"), processors, clock managers, delay lock loops ("DLLs"), and so forth. Notably, as used herein, "include" and "including" mean including without limitation.
One such FPGA, the Xilinx Virtex® FPGA, is described in detail in pages 3-75 through 3-96 of the Xilinx 2000 Data Book entitled "The Programmable Logic Data Book 2000" (hereinafter referred to as "the Xilinx Data Book"), published April, 2000, available from Xilinx, Inc., 2100 Logic Drive, San Jose, Calif. 95124. (Xilinx, Inc., owner of the copyright, has no objection to copying these and other pages referenced herein but otherwise reserves all copyright rights whatsoever.)
Another type of PLD is the Complex Programmable Logic Device ("CPLD"). A CPLD includes two or more "function blocks" connected together and to input/output ("I/O") resources by an interconnect switch matrix. Each function block of the CPLD includes a two-level AND/OR structure similar to those used in Programmable Logic Arrays ("PLAs") and Programmable Array Logic ("PAL") devices. Other PLDs are programmed by applying a processing layer, such as a metal layer, that programmably interconnects the various elements on the device. These PLDs are known as mask programmable devices. PLDs can also be implemented in other ways, for example, using fuse or antifuse technology. The terms "PLD" and "programmable logic device" include but are not limited to these exemplary devices, as well as encompassing devices that are only partially programmable.
For purposes of clarity, FPGAs are described below though other types of PLDs may be used. FPGAs may include one or more embedded microprocessors. For example, a microprocessor may be located in an area reserved for it, generally referred to as a "processor block."
As is known, FPGAs may be tested using programmed Automated Test Equipment ("ATE" or a "tester"). However, testing an FPGA may be limited by the number of available channels of a tester ("test channels"). Heretofore, FPGAs were tested by assigning one IOB to one test channel for a one-to-one correspondence between IOBs and test channels. Unfortunately, this testing method may consume all available test channels for testing an FPGA, which leaves no test channels for simultaneous testing of multiple FPGAs coupled to the same ATE.
Accordingly, it would be desirable and useful to facilitate simultaneous testing of multiple FPGAs coupled to the same ATE.


A wafer transport module interconnects a horizontal wafer handler with a vertical wafer processor and includes an evacuatable housing with a first port in communication with the horizontal wafer handler and sized to permit passage of a wafer therethrough in horizontal orientation and a second port in communication with a load/unload station of the vertical wafer processor and sized to permit passage of wafers therethrough in vertical orientation. The transport module includes a wafer holder which supports a wafer on a pedestal and rotates the pedestal and wafer about an inclined axis between horizontal orientation adjacent the first port and vertical orientation adjacent and in alignment with the second port. The wafer holder horizontally extends the vertically oriented platen and wafer from the second position through the second port to the load/unload station of the vertical processor. After wafer processing, the sequence is reversed to return the wafer to the horizontal wafer handler.

The manufacture of semiconductor substrates, or wafers, requires a vacuum environment free of contaminants. Particulate and/or dust generated during handling or processing can destroy a wafer. To reduce the susceptibility of wafers to particulate contamination, it is preferable to process wafers while they are held in vertical orientation.
Applicant's U.S. Pat. No. 4,909,695 discloses a vertical wafer processing apparatus which includes a load/unload station and a plurality of processing stations spaced equidistantly around a horizontal axis. The vertical wafer processing apparatus carrier includes at least one wafer holding ring which holds a wafer in vertical orientation, with preferably one wafer holding ring for each of the stations. To process the wafers, the carrier rotates the wafers successively, in carrousel fashion, to each of the processing stations. One processing step is performed at each station, and the process begins and ends at the load/unload station.
Another type of wafer processing apparatus includes a central horizontal wafer handling module or apparatus connected to a plurality of wafer processing modules which are connectable around the outside of the wafer handling module. The horizontal wafer handling apparatus includes a robot arm which is extendable into any of the other processing modules to transfer a wafer therein for the performance of a desired process on the wafer. With a wafer processing system of this type, versatility in processing various types of wafers is achieved and throughput is increased because the wafer robot can move each wafer into and out of one or more of the modules according to any selected processing sequence. Also, the surrounding processing modules can be changed to suit the particular types of wafer processing needed. Applicant's U.S. Pat. No. 5,154,730 discloses a sputtering module which is connectable to a horizontal wafer handling apparatus of this type.
Unfortunately, for some wafer manufacturing applications, this approach slows down throughput, because only one manufacturing step occurs in each of the modules. While additional modules can be connected to the handler module, or an additional handler module can be added, this increases the overall complexity of the system and also increases space requirements.
It is an objective of this invention to combine the contaminant-free benefits of a vertical wafer processing apparatus with the enhanced versatility in processing capability provided by a horizontal wafer handling apparatus.
It is another objective of the invention to simultaneously achieve a high degree of wafer processing versatility and wafer processing throughout with only minimum space requirements.
The above-stated objectives are met by a wafer transport module which interconnects a horizontal wafer handler with a vertical wafer processor. The wafer transport module of this invention includes a housing which houses a wafer holder and a first port in communication with the horizontal wafer handler and sized to permit passage therethrough of a wafer in horizontal orientation. The wafer transport module also includes a second port in communication with the vertical wafer processor and sized to permit passage therethrough of a wafer in vertical orientation, parallel with a wall of the housing in which the second port is formed.
The wafer holder receives wafers in horizontal orientation from a robot in the horizontal wafer handler, secures the wafer to a horizontal pedestal, rotates the wafer and pedestal about an inclined axis to vertical orientation, and then horizontally extends the vertically held wafer out of the transport module to a load/unload station of the vertical wafer processor.
Because the wafer holder used in this wafer transport module rotates about an inclined axis, one rotational movement moves the wafer from horizontal orientation adjacent the first port to vertical orientation aligned with and adjacent the second port. The wafer holder then horizontally extends the vertically held wafer through the second port and into a load/unload station for transfer to the vertical wafer processor. After wafer processing is complete, the sequence is reversed to return the wafer to the horizontal wafer handler.
This transport module effectively interconnects a horizontal wafer handler with a vertical wafer processor, while occupying only a minimal amount of space. This wafer transport module provides a marriage between a horizontal wafer processing and/or handling system and a vertical wafer processing and/or handling system, thereby enabling a wafer manufacturer to maximize wafer throughput, optimize versatility in selecting a desired sequence of processing steps and also to operate with minimal wafer susceptibility to contamination from particulate.
According to a preferred embodiment of the invention, a wafer transport module for interconnecting a horizontal wafer handling apparatus with a vertical wafer processing apparatus includes an evacuatable housing with first and second ports formed in adjacent side walls thereof. The first port communicates with a horizontal wafer handling apparatus and is sized to permit passage therethrough of a wafer in horizontal orientation. The second port communicates with a load/unload station of a vertical wafer processing apparatus, and the second port is sized to permit passage therethrough of a wafer in vertical orientation and parallel with the side wall through which the second port is formed.
The wafer transport module further includes a wafer holder with a wafer retaining pedestal. The wafer holder is mounted to an inclined turret and rotatable with respect to the turret to move the wafer holder and pedestal between horizontal orientation and vertical orientation, and vise versa. The wafer transport module also includes a piston mounted to a side wall of the housing located opposite the second port. When the wafer holder and pedestal are in vertical orientation and aligned with the second port, the piston horizontally extends and retracts the wafer holder and pedestal through the second port and into the load/unload station of the vertical wafer processing apparatus.
The wafer holder further includes a plurality of pins which are extendable outwardly from and retractable into the pedestal. The pins are carried on a plate located below the pedestal and within the wafer holder. When the pedestal is horizontal and the pins are extended, a wafer may be received on the pins through the first port via a robot arm extended therethrough from the horizontal wafer handler. As the pins retract, the wafer lowers to the pedestal until the backside surface of the wafer is supported thereon.
A plurality of clamps are located radially outside of the pedestal. The clamps move between a radially outward open position and a radially inward closed position. When in the closed position, the clamps engage the front surface of the wafer adjacent its perimeter. When the pins are extended, the clamps are in the open position.
With the wafer retained on the pedestal by the clamps and the pedestal and wafer oriented horizontally and adjacent the first port, the wafer holder may rotate about the inclined axis to move the pedestal and wafer into vertical orientation, in alignment with the second port. Thereafter, the piston horizontally extends the wafer holder, including the pedestal and the wafer retained thereon, through the second port.
Upon horizontal extension through the second port, the front surface of the wafer contacts spring-biased tabs supported by a wafer holding ring carried by the vertical wafer processing apparatus. With the wafer engaged on its front surface by the tabs, a plurality of actuators carried by the wafer holder and located radially outside of the pedestal interact with the wafer holding ring of the vertical wafer processor to rotate rollers held by the ring into engagement with the rear surface of the wafer. The rollers rotate into cutout regions in the side of the pedestal to move behind the wafer without interfering with the pedestal itself. With the wafer held in vertical orientation between the rollers and the tabs of the wafer holding ring, the clamps move radially outwardly to their open positions. The wafer holder ring has internal radially directed notches formed therein to enable the clamps to move radially outwardly without interfering with the wafer holding ring itself. The wafer holder then withdraws into the module. A gate valve may then be closed to isolate the transport module from the vertical wafer processor.
After the first wafer is transferred to the vertical wafer processor, another wafer may be obtained from the horizontal wafer handler and then transferred to the next wafer holding ring of the vertical wafer processor. This process continues until all of the wafer holding rings of the vertical wafer processor hold a wafer.
After processing of a wafer by the vertical processing apparatus is complete, the above-described sequence is reversed. First, with the already processed wafer located at the load/unload station of the vertical wafer processing apparatus, the gate valve is opened. The wafer holder then extends horizontally through the second port to a position adjacent the backside of wafer. The clamps are then radially inwardly closed into contact with the front surface of the wafer. The actuators carried by the wafer holder then rotate the rollers out of contact with the backside surface of the wafer, so that the wafer is held in vertical orientation against the pedestal by the clamps. The wafer holder then horizontally retracts through the second port and into the housing. After retraction, the wafer holder rotates the wafer and the pedestal about the inclined axis from vertical orientation to horizontal orientation and adjacent the first port. The clamps are then moved radially outwardly from the wafer. The plate then moves upwardly to extend the pins and to raise the wafer upwardly from the pedestal, thereby to enable the robot arm to retrieve the wafer back into the horizontal wafer handling apparatus.
Preferably, the timing and sequence of operation for the pins, the clamps, the actuators, rotation of the wafer holder and extension and retraction of the wafer holder are controlled by a single programmable controller. Preferably, this controller is operatively connected to a master controller which coordinates the entire sequence of wafer processing and handling operations performed by the vertical wafer processing apparatus, the wafer transport module and the horizontal wafer handling apparatus, and any other wafer handling and/or processing apparatus or modules interconnected therewith.
These and other features of the invention will be more readily understood in view of the following detailed description and the drawings.

Wafer transport module with rotatable and horizontally extendable wafer holder


Liquid crystal display panel 10 is provided with TFT and pixel electrode 19, between which interlayer insulator 17 is interposed, and with reflective section 15, in each of a matrix of pixels; having first substrate whereon the pixel electrode 19 and the TFT's electrode D electrically connect via contact hole 20 formed in the reflective section 15; second substrate whereon at least one protrusions 311 to 313 are formed on common electrode in positions corresponding to the each pixel; perpendicular alignment layers deposited on each substrate; and liquid crystal 29 with negative dielectric anisotropy disposed between substrates. In position corresponding to base of protrusion 313 provided opposite the second substrate's contact hole 20, light-blocking film 363 is formed so as to cover the base viewed from above. Thus, liquid crystal display panel is provided wherein light leakage from reflective section's contact hole and from protrusions is curbed, with high contrast and display quality.

In recent years the use of liquid crystal display devices has spread rapidly not only in information and telecommunications equipment but in ordinary electric equipment as well. Because liquid crystal display devices do not themselves emit light, use is often made of transmissive liquid crystal display devices that are equipped with a backlight. The power consumption of backlights is large, however. Accordingly, reflective liquid crystal display devices, which do not require a backlight, are employed in order to reduce power consumption, especially with portable equipment. But in dim room interiors these reflective liquid crystal display devices are hard to view, because they use external light as their light source. Over recent years therefore, especial progress has been made with development of semitransmissive liquid crystal display devices, which combine the properties of the transmissive type and the reflective type.
The liquid crystal display panel used in these semitransmissive liquid crystal display devices has, within each pixel area, a transmissive section equipped with a pixel electrode, and a reflective section equipped with both a pixel electrode and a reflecting plate. In dark places it lights a backlight and uses the transmissive sections of its pixel areas to display images, while in bright places it uses external light from the reflective sections to display images, without lighting the backlight. Thus there is no need for the backlight to be constantly lit, and consequently this panel has the merit of greatly reducing power consumption.
However, in the small-size display sections of mobile equipment, typified by mobile telephones and the like, there was previously no very large demand for the liquid crystal display panel to have a wide viewing angle, because such equipment had a limited number of users, and for related reasons. But with the increasingly functionally sophisticated mobile equipment of recent years, the demand for a wide viewing angle for the display section's liquid crystal display panel has grown rapidly. In response to such demand for a wider viewing angle for mobile equipment, efforts have been ongoing recently to develop MVA semitransmissive liquid crystal display panels to replace the TN liquid crystal display panels hitherto widely used in mobile equipment (see JP-2003-167253-A (claims, paragraphs [0050] to [0057], FIG. 1) and JP-2004-069767-A (claims, paragraphs [0044] to [0053], FIG. 1)).
The MVA semitransmissive liquid crystal display panel disclosed in JP-2004-069767-A will now be described using FIGS. 4 and 5. FIG. 4A is a perspective view illustrating the approximate structure of an MVA semitransmissive liquid crystal display panel 50, FIG. 4B is a schematic view illustrating the inclined state of the liquid crystals when an electrical field is applied to the liquid crystals of the liquid crystal layer, and FIG. 5 is a cross-sectional view along V-V in FIG. 4A.
In this semitransmissive liquid crystal display panel 50, an inclined surface or step difference 53 is provided between a reflective section 51 and a transmissive section 52, and the reflective section 51 and transmissive section 52 are connected via the step difference 53. In the pixel electrode 55 of a first substrate 54 in the semitransmissive liquid crystal display panel 50 there is formed a first open region 56, being an area where the pixel electrode 55 is not formed. This first open region 56 constitutes a first orienting/dividing structure, and is formed so as to lie on either side of the step difference 53 and to straddle the reflective section 51 and transmissive section 52. As a result, the pixel electrode 55a in the reflective section 51 and the pixel electrode 55b in the transmissive section 52 are connected to each other via a single line 57 extending in the longitudinal direction of the semitransmissive liquid crystal display panel 50.
In the opposing electrode 59 of a second substrate 58 there are formed second open regions 60a and 60b, in locations opposite the pixel electrode 55a in the reflective section 51 and the pixel electrode 55b in the transmissive section 52, respectively. These second open regions 60a, 60b constitute a second orienting/dividing structure. The second open regions 60a, 60b are formed as cross-shaped slits, and are so arranged that the center of second open area 60a is aligned with the center of pixel electrode 55a and the center of second open area 60b is aligned with the center of pixel electrode 55b.
When an electrical field is applied to the liquid crystals 61 of the liquid crystal layer in this semitransmissive liquid crystal display panel 50, since the dielectric anisotropy of the liquid crystals 61 is negative, over the first open region 56 at the step difference 53 the liquid crystals incline toward the line 57 on the opposing electrode 59 side, while over the reflective section 51 and transmissive section 52, the liquid crystals incline to the center of the opposing electrode 59's region corresponding to the reflective section 51 or to the center of the region corresponding to the transmissive section 52, as shown in FIGS. 4B and 5. Thus, in the semitransmissive liquid crystal display panel 50, the orientation directions of the liquid crystal molecules are determined, and therefore it is possible to reduce degradation of visual characteristics and deterioration of response speed.
The foregoing MVA semitransmissive liquid crystal display panel 50 is provided with a step difference 53 between the reflective section 51 and the transmissive section 52 on the first substrate 54, and, as is commonly known, is so configured that the cell gap d1 in the reflective section 51 and cell gap d2 in the transmissive section are in the relation d1=(d2)/2, thus being adjusted so that the display quality in the reflective section 51 is the same as the display quality in the transmissive section. But also well known is an MVA semitransmissive liquid crystal display panel in which the structure for such cell gap adjustment is provided on the second substrate.
There will now be described, using FIGS. 6 and 7, an example of a related art MVA semitransmissive liquid crystal display panel 70 in which a top coat layer constituting a structure for such cell gap adjustment is provided on the second substrate. FIG. 6 is a plan view of a single pixel, seen through the second substrate, of a related art semitransmissive liquid crystal display panel in which the structure for the cell gap adjustment is provided on the second substrate, while FIG. 7 is a cross-sectional view along VII-VII in FIG. 6.
In this semitransmissive liquid crystal display panel 70, multiple scan lines 72 and signal lines 73 are each formed in a matrix, either directly or with an inorganic insulator 74 interposed, over a transparent glass substrate 71 possessing insulating properties, which is the first substrate. Each area enclosed by the scan lines 72 and signal lines 73 is equivalent to one pixel; a thin film transistor (TFT, not shown in the drawings) that serves as a switching element is formed in each pixel, and the surfaces of the TFT and other items in each pixel are covered by a protective insulator 83.
Further, in the reflective section 75 there is formed, so as to cover the scan lines 72, signal lines 73, inorganic insulator 74, protective insulator 83 and other items, a portion with a finely protruded and recessed surface, while in the transmissive section 76 there is deposited an interlayer 77 made of organic insulator with a flatly-formed surface. The concavoconvex portion of the reflective section 75 is omitted in FIGS. 6 and 7. A contact hole 80 is provided in the interlayer 77 in a position corresponding to the TFT's drain electrode D, and in the reflective section 75 of each pixel there is provided above the contact hole 80 and on the surface of the interlayer 77 a reflecting plate 78 made of aluminum metal for example. On the surface of the reflecting plate 78 and the surface of the interlayer 77 of the transmissive section 76 there is formed a transparent pixel electrode 79 made of indium tin oxide (ITO) or indium zinc oxide (IZO) for example.
Further, in the reflective section 75, an auxiliary capacity line 81 is disposed beneath the interlayer 77 in the position where the reflecting plate 78 is present; also, viewed from above, the reflecting plate 78 and pixel electrode 79 do not touch the adjacent pixel's reflecting plate and pixel electrode, and moreover are formed so as to slightly overlap to the same degree the scan lines 72 and signal lines 73, in order to prevent light leakage. In the transmissive section 76, the pixel electrode 79 does not touch the adjacent pixel's pixel electrode and reflecting plate, and moreover is formed so as to slightly overlap the scan lines 72 and signal lines 73.
Also, in this semitransmissive liquid crystal display panel 70, a slit 93 for controlling the orientation of the liquid crystal molecules is provided at the boundary region between the reflective section 75 and the transmissive section 76 of the pixel electrode 79, the pixel electrode 79 being divided into a pixel electrode 79a of the reflective section 75 and a pixel electrode 79b of the transmissive section 76, and the pixel electrode 79a of the reflective section 75 and the pixel electrode 79b of the transmissive section 76 being electrically connected via a narrow portion 94. Further, a perpendicular alignment layer (not shown in the drawings) is deposited over the surface of the pixel electrode 79 so as to cover all the pixels.
Also, over the display area of a transparent glass substrate 85 possessing insulating properties, which is the second substrate, there is provided a striped color filter layer 86, formed so as to correspond to each pixel, and being of any one of the colors red (R), green (G) or blue (B). Also, since a color filter layer 86 of the same thickness is used for the reflective section 75 and for the transmissive section 76, a topcoat layer 87 of a particular thickness is provided over the reflective section 75 portion of the color filter layer 86. This top coat layer 87 is provided over the whole of the reflective section 75 and has a thickness such that the thickness of the liquid crystal layer in the reflective section 75, or what is termed the cell gap d1, is one half the cell gap d2 of the transmissive section 76; that is, so that d1=(d2)/2.
Additionally, protrusions 91 and 92 for controlling the orientation of the liquid crystals are provided on, respectively, the portion of the color filter layer 86's surface that is located in the transmissive section 76 and the portion of the top coat layer 87's surface that is located in the reflective section 75, and a common electrode and a perpendicular alignment layer (neither of which is shown in the drawings) are stacked in that order on the surfaces of the color filter layer 86, top coat layer 87 and protrusions 91, 92.
The MVA semitransmissive liquid crystal display panel 70 is completed by positioning the first and second substrates to face each other, sticking the two substrates together by providing sealing around the peripheries thereof, and filling the space therebetween with liquid crystal 89 possessing negative dielectric anisotropy. Beneath the first substrate is disposed a public-domain backlight device having a light source, light guide plate, diffuser sheet and so forth, which is not shown in the drawings.
With this MVA semitransmissive liquid crystal display panel 70, in the state where no electric field is applied between the pixel electrode 79 and the opposing electrode, the liquid crystal molecules of the liquid crystal layer are oriented so that their long axes are perpendicular to the surfaces of the pixel electrode and the opposing electrode, and consequently light is not transmitted. On the other hand, when an electric field is applied between the pixel electrode and the opposing electrode, light is transmitted. This means that the device has the features that light leakage in the transmissive section will not much affect the display quality, and furthermore, thanks to the presence of the slit 93 in the pixel electrode 79 and the protrusions 91, 92, the liquid crystal molecules will incline toward protrusion 91 or 92, so that the viewing angle will be extremely wide.
In a semitransmissive liquid crystal display panel or reflective liquid crystal display device, the contact hole 80 formed in the reflective section is of a certain size and depth because it is necessary render reliable the electrical continuity between pixel electrode 79a and the TFT's drain electrode D, which serves as a switching element, and as shown in FIG. 7, the connector hole 80 is formed with inclined surfaces. Such inclining of the contact hole 80 imparts a physical force to the liquid crystal molecules 89, which causes the liquid crystal molecules 89 to incline as shown in FIG. 8. FIG. 8 is an enlarged view illustrating conceptually the liquid crystal molecules 89 in an inclining state at the contact hole 80 portion of FIG. 7.
A particular issue is that even when the liquid crystal molecules 89 are oriented by creating an electric field between pixel electrode 79a and the common electrode, the liquid crystal molecules 89, being strongly affected by the physical force of the contact hole 80, will not incline in the desired direction, and consequently exert an adverse effect on the display, so that the display quality deteriorates. Moreover, since the contact hole 80 is formed quite literally as a hole, the orientation of the liquid crystal molecules 89 is prone to be unstable from effects due to the presence of the contact hole 80, such as irregularity in the alignment layers—which are not shown in the drawings—and what is more, since the liquid crystal molecules 89 incline obliquely at the entrance portion of the contact hole 80 even when no electrical field is applied, blockage of light at this portion is incomplete, which may result in light leakage.
Further, in the vicinity of the protrusions 91, 92 formed in the second substrate, at the top surface portions of the protrusions 91, 92 the liquid crystal molecules 89 are oriented perpendicularly relative to the second substrate, but at the side portions of the protrusions 91, 92, are, under the influence of the incline angle of the side portions, oriented so as to be inclined obliquely relative to the second substrate. As a result, there exists the problem that when no electric field is applied, leakage of light from the vicinity of these protrusions occurs and the contrast deteriorates. Such a problem arising from the protrusions in an MVA liquid crystal display panel is disclosed in JP-2005-173105-A. With the invention disclosed in JP-2005-173105-A, there is set forth the provision of light-blocking films in positions corresponding to the protrusions, with the object of improving the contrast by preventing light leakage arising from disturbance of orientation due to the presence of the protrusions. However, no consideration is given to light leakage arising from the presence of the contact hole.

Liquid crystal display panel having particular protrusion and light blocking film features


An apparatus and method for application of a line of resin along a crease line of a garment for increasing the life of the crease line. The apparatus in one embodiment allows a simultaneous application of lines of resin along respective crease lines of one or more garments to provide an increase in productivity. The apparatus and method allows the operation of a source of a pressurised fluid source used in dispensing of the resin from one or more cartridges held on mounting apparatus to be achieved by an operator's hand which, at the same time, is used to hold gripping portion on the mounting apparatus to move the cartridges and mounting apparatus with respect to the crease line to apply the resin.

The invention to which this application relates is apparatus and a method for the application of one or more lines of resin along respective crease lines in a garment such as, for example, a pair of trousers or another garment in which a crease line is commonly used.
The application of the lines of resin to allow a crease which has been formed in a garment to be retained for a greater period of time and/or number of uses of the garment is well known. The resin serves to strengthen the crease formation and hence retain the visible crease in the garment for a longer period of time. Typically, this service is provided at the time of manufacture so that when the product is sold, and purchased, the crease line is readily apparent thereby enhancing the appearance of the garment. Alternatively, or additionally, the provision of the resin along the crease line, can be part of a service such as a dry laundry service in which the customer typically pays an additional price for the application of the crease line resin once the garment has been dry cleaned, or the use of the resin is provided as a complimentary extra service.
In either use, the market for this service is large and is worldwide. It is found that the most appropriate way to apply the line of resin, is to provide a cartridge which includes a reservoir of the resin in a cavity therein or receives resin from a pump and, at one end of the cartridge, there is provided a nozzle or aperture through which the resin can be moved and, with the cartridge held in location with the crease line on the garment so as to be in contact therewith or at a spaced distance therefrom, the cartridge is moved along the crease line and the resin which is dispensed through the nozzle, is applied along the crease line. When the resin is located in a cavity in the cartridge, the cartridge includes a piston arrangement which is moved along the interior of the cavity so as to move the resin towards the nozzle in a controlled manner, thereby allowing continuous dispensation of the resin as the cartridge is moved along the crease line. The movement of the piston is typically achieved via the application of a pressurised fluid such as air which is introduced at, or adjacent to, the opposing end of the cartridge from the nozzle so that the air moves the piston, and hence resin, towards the nozzle. The air is typically provided via a supply tube from the cartridge to an air pump and, conventionally, the air pump is operated by the person who is controlling the movement of the cartridge via a foot pedal which, when operated, causes the pressurised air to be supplied to the cartridge. While this form of apparatus has been used for many years, the apparatus can be bulky in terms of the provision of the cartridge, the foot pedal or switch control arrangement and the air pump.
One aim of the present invention is to provide apparatus in a form which is easier to operate and has greater ability to be portable and take up less space and thereby allow the same to be used in locations where space is at a premium.
Typically, when the resin is being applied, the garment is located on a stand or table which has a support surface which has a groove formed therealong and the garment is positioned with respect to the support surface such that the crease in the garment lies along the groove and the resin is applied to the surface of the garment which is to lie to the interior i.e. adjacent to a person's skin, when the garment is being worn. It is important that when the resin is applied, the resin lies in the base of the crease and along the same rather than to one side of the base of the crease as, if it is applied on one side or the other, the crease tends to collapse and the final appearance of the same is counterproductive. However, if the resin lies in the base of the crease then the crease can be maintained for a significantly longer period of time in the garment.
Another problem with the conventional approach is that typically a line of resin is applied from a cartridge along one crease line at a time which therefore requires, typically, for a pair of trousers, four crease lines to be applied one after the other to a single garment and when one considers that for each crease line, the garment needs to be repositioned with respect to the support surface and the groove so that the crease line to which the resin is to be applied at that time, is positioned appropriately, then it will be appreciated that the time to apply the resin for each garment, can be relatively long.
The Applicant, in their co-pending application number PCT/GB2018/051482 has appreciated this problem of relatively slow throughput and, as a result, have developed a system which allows at least two cartridges to be provided in relation to a mounting means so that the cartridges are spaced apart and can be used simultaneously to apply first and second lines of resin along first and second crease lines so that the throughput time is halved.
The Applicant has also appreciated the need to improve the operation of the system to allow the resin to be dispensed from the nozzle of the cartridge and in the co-pending application GB1805759.6, they disclose the ability for the control of the pressurised air source to be achieved without the need for the foot pedal or switch control assembly for the air pump. As disclosed in the co-pending applications, the operator can control the pressurised fluid source via a switch which is mounted on the mounting means into which the cartridges are fitted for use so that the operator can control the pressurised fluid source using their hand and typically, the same hand as is being used to grip the mounting means and hence move the cartridge along the crease line.
A further aim of the present invention is to provide an improved method of operation of the pressurised fluid source which allows a simplified operation of the fluid source to be achieved via the operator's hand.

Apparatus and a method for the application of resin along one or more crease lines


Systems and methods for providing gaming activities, these particularly relating to gaming activities implemented in conjunction with a flexible credit arrangement. A consumer is allocated one or more entries in a gaming activity based on a level of transactable flexible credit held by that consumer. For example, the allocation of entries is increased or decreased subject to a corresponding increase or decrease in transactable flexible credit held by the consumer. In some aspects of the present invention, one or more prizes for the gaming activity are funded in whole, or in part, by way of supplementary contributions realized on the basis of consumers' participation in a flexible credit infrastructure.

The following discussion of the background art is intended to place the invention in an appropriate context and to allow the unique characteristics and advantages of it to be more fully understood. However, any discussion of the background art throughout the specification should in no way be considered as an express or implied admission that such background art is widely known or forms part of common general knowledge in the field.
Traditionally, gaming activities have relied upon a model whereby a player exchanges an entry fee for one or more entries, and does so on the basis that the entry fee is placed at risk in the sense that it will be lost should the one or more entries not be identified as winning entries. This traditional model is founded on a principle whereby entry fees are central to the funding of prizes for a gaming activity.
The present inventor has recognised alternatives to the traditional model. In particular, as discussed in PCT/AU2007/000774, it is possible to use notions of "supplementary contribution" to fund prizes without necessarily making direct use of entry fee capital. In a general sense, by engaging in predefined activities, a player is able to assist in the funding of a prize pool by way of supplementary contribution without necessarily placing any funds at risk. So as to provide a straightforward example, a lottery may be conducted whereby players submit respective entry fees, and subsequently receive full refunds of their entry fees. Notions of supplementary contribution allow a prize pool for that lottery to be funded in whole, or in part, by funds derived by the investment of the players' entry fees for a predetermined period of time. In some cases, the prize pool is funded in whole, or in part, players' supplementary contributions are funded by third parties in consideration for a benefit they receive from the players' involvement in the lottery—for example in terms of a marketing benefit.
By moving away from the traditional model of gaming, there is scope to apply gaming principles in broader contexts.

System and methods for providing gaming activities


A toy ball in accordance with this invention includes a hollow sphere with spaced apart resilient knobs extending outwardly from the sphere and an internal mechanism that causes a random motion and bouncing of the ball. A safety switch is also provided to prevent injury to a user or damage to the toy while it is disassembled.

The present invention relates generally to a toy ball having an internal motor and resilient knobs on its surface that act in combination to cause random movement and bouncing of the ball. The toy ball also contains a safety switch that prevents the motor from operating when the ball is disassembled.
A number of toy self-propelled balls have been developed and patented that include internal battery-operated motors. Other balls have incorporated resilient knobs on their outer surfaces to cause random rolling.


A linear motion device includes a housing, an extension arm, and an anti-twist safeguard. The extension arm projects from the housing and includes a securing section. The anti-twist safeguard includes at least one separate elongate anti-friction lining, which is formed with a constant cross-sectional shape. The anti-friction lining is arranged substantially without play between the housing and the securing section of the extension arm and extends transversely to a longitudinal axis. The extension arm is supported on the housing in such a way that it can move along the longitudinal axis. In the securing section, the extension arm extends parallel to the longitudinal axis with a constant external cross-sectional shape deviating from a circular shape. The anti-twist safeguard engages positively in said external cross-sectional shape, thus securing the extension arm with respect to the housing against twisting relative to the longitudinal axis.

The disclosure relates to a linear motion device having an anti-twist safeguard, comprising an elongate anti-friction lining.
EP 0 767 526 B1 has disclosed a linear motion device in the form of an electric cylinder. According to FIG. 3 of EP 0 767 526 B1, the linear motion device 10 comprises a housing 12 and an extension arm 30, which projects from the housing. In this arrangement, the housing and the extension arm are constructed in the form of a hollow cylinder, with the extension arm being accommodated in the through bore 11 of the housing and being supported in the housing in such a way that it can move along a longitudinal axis.
The extension arm can be set in motion by means of a screw drive. The screw drive comprises a threaded spindle 24, which is supported in such a way that it can rotate relative to the longitudinal axis and is provided on the outer circumferential surface thereof with helical thread flights 22. Engaging in the thread flights is a matching threaded nut 28 which, in the case under consideration, is formed integrally with the extension arm. However, the prior art also includes electric cylinders in which the threaded nut is constructed in the form of a separate nut with recirculating spherical rolling elements, the nut being connected securely to one end of the extension arm. Rotary motion can be imparted to the threaded spindle by an electric motor 20 which, in the case under consideration, is coupled directly to the threaded spindle. However, it is also possible for a transmission, e.g. a belt or gear-type transmission, to be provided between the electric motor and the threaded spindle.
An anti-twist safeguard is furthermore provided, supporting the torque which the electric motor imposes on the threaded spindle and thus preventing the extension arm from being twisted relative to the longitudinal axis with respect to the housing. For this purpose, the extension arm is equipped substantially over the entire length thereof with splines. The housing, for its part, engages positively, by means of part 36, in the splines.
Other cross-sectional shapes for the extension arm that deviate from the circular shape are also known as substitutes for the splines. In the case of the extension arm in FR 2587690 A1, for example, three flats are provided on an initially circular hollow tube.
The disadvantage of the anti-twist safeguard according to EP 0 767 526 B1 lies in the complex production of the many grooves of the splines. However, the splines have the advantage that there is a very large engagement surface overall. Moreover, this surface is aligned substantially perpendicular to the acting forces. Wear is correspondingly low. The extension arm in FR 2587690 A1, in contrast, is significantly easier to produce. However, wear minimization would require the provision of running rollers supported in rolling contact bearings to provide the positive engagement between the housing and the extension arm. This, in turn, is very complex.
It is the object of the disclosure to specify an anti-twist safeguard which is easy to produce and is furthermore subject to little wear.

Linear motion device having an anti-twist safeguard, comprising an elongate anti-friction lining


A needle bearing functioning as a rolling element comprises a uniform-diameter body part and bottom surfaces shaped in flat surfaces. A tapered reduced-diameter part and a chamfered part are interposed between the body part and the bottom surface. A gentle reduction in diameter is first made by the tapered reduced-diameter part, and then a relatively sharp reduction in diameter is made by the chamfered part. Consequently, in the needle bearings adjacent to each other, their tapered reduced-diameter parts are separated from each other.

Automobiles include a drive force transmitting mechanism, which incorporates therein a constant-velocity joint for transmitting the rotational drive force of a drive shaft from a driven shaft to axles. The drive force transmitting mechanism includes, for example, a tripod constant-velocity joint interposed between the drive shaft and the driven shaft, which is capable of transmitting rotation at a constant velocity even when an angle is formed between the drive shaft and the driven shaft.
The tripod constant-velocity joint includes an outer member comprising a shank and a tubular member. The drive shaft is coupled to the shank, and an inner member is fitted over the distal end of the driven shaft and inserted into the tubular member. The tubular member has a plurality of guide grooves defined in an inner wall surface thereof at equally spaced intervals. Each of the guide grooves is defined by a bottom surface and two side walls rising substantially perpendicularly from the bottom surface.
The inner member has an annular portion and a plurality of trunnions projecting from an outer circumferential wall of the annular portion. The trunnions are disposed in facing relation to the respective guide grooves. Substantially annular rollers are rotatably fitted over the respective trunnions, with needle bearings (rolling bodies) interposed therebetween. When the rollers are inserted respectively into the guide grooves, the drive shaft and the driven shaft become coupled to each other. Since the circumferential side walls of the rollers are held in sliding contact with the side walls of the guide grooves, the driven shaft displaces the outer member.
Ordinary needle bearings have a main portion in the form of a constant-diameter cylindrical body, and a distal end portion leading to the main portion. The distal end portion has an arcuately curved cross-sectional shape (see, for example, Patent Document 1, FIG. 6). If a flange is provided on the inner circumferential wall of each of the rollers to accommodate a needle bearing, then a machining cutter for the rollers may become quickly deteriorated, and it is not easy to accommodate the needle bearing within the roller. According to Patent Document 1, it has been proposed to make both bottom surfaces of the needle bearing flat.
Patent Document 1: Japanese Laid-Open Patent Publication No. 2004-176763


A control method includes obtaining feature data using at least one sensor, the feature data being acquired by the terminal using the at least one sensor, generating an action instruction based on the feature data and a decision-making mechanism of the terminal, and executing the action instruction. In this application, various aspects of feature data are acquired using a plurality of sensors, data analysis is performed on the feature data, and a corresponding action instruction is then generated based on a corresponding decision-making mechanism to implement interactive control.

As the virtual reality (Virtual Reality, VR) industry emerges, applications of systems for interaction between a human and a virtual scene become increasingly popular. With the spread of intelligent devices and the development of artificial intelligence technologies, future intelligent devices will definitely develop into more in-depth and extensive interactive systems.
Limited by existing sensor technologies, data sources in interactive systems are severely restricted, resulting in less realistic virtual scenes of the interactive systems. For example, only cameras are used to acquire images of eyes in VR glasses to implement line-of-sight tracking and intelligent interaction, lines of sight are inadequately estimated, and as a result the VR glasses provide undesirable experience and functions.

Control method, terminal, and system using environmental feature data and biological feature data to display a current movement picture


Provided is a technique for reducing, using a simple circuit configuration, an amplitude difference between electric signals that are input to respective optical waveguide arms. An optical modulator includes: an optical demultiplexer that splits continuous wave light as received; first and second optical waveguide arms through which the continuous wave light as split propagates; an optical phase π shifter that introduces a phase shift of π to the continuous wave light as split; an optical multiplexer combines the continuous wave light propagating through the first and second optical waveguide arms; first and second signal electrodes that respectively input the electric signals to the first and second optical waveguide arms; a junction capacitance connected in shunt to at least one of the first and second signal electrodes; and a DC voltage source that applies a DC voltage to the junction capacitance.

Field of the Invention
The present invention relates to techniques for controlling optical modulators, and more particularly, to a technique applicable to a Mach-Zehnder optical modulator.
Description of the Background Art
Optical communication systems have been growing in capacity in response to an abrupt increase in volume of data communication. Semiconductor lasers, which have been widely used as key devices of the optical communication systems, modulate phases or intensities in accordance with transmission distances of optical signals. Small devices are required in optical transmission systems for a middle-and-short distance of 100 km or less, such as metro networks (intra-city communications), and fiber-to-the-home (FTTH) networks. Accordingly, intensity-modulation lasers are widely used. Meanwhile, phase-modulation lasers, which enable both high-speed operation and long-distance transmission, are now widely used in optical transmission systems for a long distance of 100 km or more, such as core networks (inter-city communications).
An example of widely-used phase-modulation lasers is a Mach-Zehnder modulator (hereinafter referred to as MZM). A phase-modulation MZM converts an electric digital signal into an optical digital signal. The phase-modulation MZM varies a refractive index of a multi-quantum well using an electric signal to thus phase-modulate an output of continuous wave (CW) light from a semiconductor laser.
One way to achieve good optical characteristics in the MZM is to reduce an amplitude difference between electric signals that are input to two optical waveguide arms after Y-branching. This is because a large amplitude-difference lowers an optical output, drops an extinction ratio, and intensifies noise. Additionally, a small phase-shift between the electric signals, which are input to the respective optical waveguide arms, reduces signal determination errors after the transmission of the signals.
However, different optical waveguide arms have different electrode patterns before the electric signals enter the optical waveguide arms from input ends of signal electrodes, due to a limited chip-layout of an element. Unfortunately, this causes different wave optical waveguides to have different amplitudes and phases of the electric signals, which are input to the optical waveguide arms.
Adjusting an electrical length in a module substrate on which an MZM element is disposed readily reduces a phase shift between the electric signals. On the other hand, it is difficult to regulate the amplitude difference between the electric signals in response to a change in pattern of the module substrate. This is because low-loss module substrates are widely used for less loss of the electric signals. Accordingly, a well-structured element is necessary for a small amplitude difference between the electric signals in the MZM element.
An exemplary technique for reducing the amplitude difference is described in Japanese Patent Application Laid-Open No. 2014-178480 that provides an input signal adjustment region and adjusts amplitudes of electric signals that are input to two respective optical waveguide arms for equalization.
However, Japanese Patent Application Laid-Open No. 2014-178480 fails to disclose both specific structure of the input signal adjustment region and specific method of the adjustment.


A machine tool includes: a tool magazine that stores a plurality of tools; a spindle that holds one of the plurality of tools stored in the tool magazine; a glossiness measurement unit that measures glossiness of a tapered outer surface of a taper shank of each of the plurality of tools; a deterioration determination unit that determines whether or not the tapered outer surface is deteriorated on the basis of the glossiness measured by the glossiness measurement unit; and a notification unit that notifies an operator of deterioration of the tapered outer surface if it is determined by the deterioration determination unit that the tapered outer surface is deteriorated.

Conventionally, a machine tool including a tool magazine storing multiple tools and having a function of automatically changing the tool to be attached to a spindle has been known (see PTL 1 and 2, for example). PTL 1 describes that breakage of a tool is detected by comparing an image of the tool before machining and an image of the tool after machining. PTL 2 describes that it is determined whether or not a tool attached to a spindle is a normal tool having a predetermined length, and an inspection is made as to whether or not the tool is attached normally.
Additionally, an inspection device that detects gloss of an object and determines the quality of the object on the basis of the gloss has been known (see PTL 3, for example).

Machine tool, management system, and tool deterioration detection method


An electric motor and inverter assembly (100) used in an electric vehicle or a hybrid electric vehicle to drive the vehicle's wheels to rotate is disclosed. The electric motor and inverter assembly comprises: an electric motor (300), which includes a housing including a main shell (310), an end cover (320) and a connecting cover (330), wherein a cooling passage is formed in a wall of the housing such that coolant is able to flow in the cooling passage, and an end cover (320) and a connecting cover (330) are respectively connected to opposite ends of the main shell; and an inverter, which includes a housing (210) in which a power element and/or an electrical device is received, wherein the housing of the inverter contacts the connecting cover such that an interface is defined between the connecting cover and the housing of the inverter, and the coolant flowing through the cooling passage is able to contact the interface.

The present application generally relates to an electric motor integrated with an inverter.
At present, for the sake of environmental conservation, electric vehicles or hybrid electric vehicles have been widely and widely developed and used. An electric motor is used in the electric vehicle as a power supply unit. The electric motor is coupled to an inverter by which direct current from a power battery is converted into three-phase alternating current to drive the electric motor. An output shaft of the electric motor is usually coupled to a transmission device. The output shaft's rotating speed is lowered by the transmission device such that the electric vehicle's wheels can be driven to rotate.
In a conventional design of the electric vehicle, the electric motor, the inverter and the transmission device are independent from each other and usually have different housings. Therefore, when installed in the vehicle, they will occupy a large space. Moreover, it is possible that the electric motor and the inverter are separated from each other and are connected by an electrical cable and a bus-bar. Use of the long electrical cable and the bus-bar may not only increase assembling difficulty and affect maintenance, but also result in a possibility of failure. Therefore, a high degree integrated electric motor and inverter assembly is needed such that it will occupy a small space in the vehicle, and thus the assembling difficulty is decreased and the maintenance is facilitated.
Furthermore, a great amount of heat will produce when the electric motor and the inverter operate. Usually, a coolant flowing channel is provided in the housing of the electric motor such that the electric motor can be cooled down. However, under the influence of production process, the coolant flowing channel is usually not long and is provided non-uniformly around the housing such that the cooling performance of the electric motor is affected.


A patient transport apparatus. The patient transport apparatus of the present invention is articulated and sized to fit between the body and the open door of virtually all vehicles. Further, the patient transport apparatus uses a height-adjustable seat that is aligned with the vehicle seat to allow for simplified extraction of the patient from the vehicle. The height-adjustable seat lowers to just above ground height making the recovery of a fallen patient easier. A set of casters allows omni-directional travel of the patient transport apparatus for precise placement and a pair of primary motion wheels makes linear travel easier while providing a turning radius substantially approaching zero.

1. Field of Invention
The invention relates to a patient transport apparatus.
2. Description of the Related Art
Over the last thirteen years, healthcare providers have witnessed marked change in patient numbers as well as patient needs. Thirteen years ago, a patient weighing 400 pounds or more was a rarity. These patients were extraordinary cases and not an everyday assignment. Today, dealing with patients weighing 400 pounds or more is a daily way of life. At any given time, any healthcare facility is likely to have admitted at least one patient who weighs 600 pounds or more. Although healthcare providers work to provide services to heavier patients by purchasing new equipment and educating staff members; however, the reality remains that it has become increasingly difficult to simply convey patients.
While healthcare providers and healthcare equipment vendors have attempted to address this growing challenge, the currently available solutions appear insufficient when looking at the growing number of staff injuries and lost work time that is associated with conveying patients. Moving heavier patients is one significant contributor to work related injuries. A staff member may be off the schedule for weeks and even months due to such injuries. In addition to the risk to the staff members, there are concerns on the patient side as well.
A patient expects a healthcare provider to meet the patient's healthcare needs. This expectation is independent of the patient's weight. When a patient weighing 150 pounds falls down, it is expected that the healthcare provider will help them up. That same expectation is held by a patient weighing 600 pounds or more. Like the staff member, the patient also runs a risk of injury during transport as a result of being lifted, pulled, pushed, slid from, or transferred into, out of, or between conveyances. While dealing with the very real, difficult, and unfortunate problem of transporting heavier patients, the patient's dignity is often compromised. It is difficult for patients to maintain dignity when ten men are called to move them. It is not uncommon for patients apologize for being so large and so much trouble. One's dignity should not be overlooked, regardless of the weight of the patient.
One of the most problematic areas in patient transport is the loading and unloading of a patient from a vehicle. Patients arriving at a healthcare facility are often transferred from an automobile to a wheelchair so that they may be conveyed to the Emergency Department. The staff member faced with assisting a patient who weighs many times more than the staff member, and who can offer little or no help in exiting the vehicle, gains a completely new appreciation for the many phases of patient conveyance. The confines of the automobile, the obstruction of the door, and the low seat height make patient assistance a difficult task. Conditions such as these are especially likely to result in embarrassment or injury. For example, it is not uncommon to inadvertently set the patient on the ground during this type of transfer, which at best only diminishes the dignity of the patient, and embarrasses the staff member. With luck, no one is injured during this process.


This invention relates to latent thiol monomers and their use in the synthesis of polymers. In addition, this invention relates to novel polymers and graft copolymers formed with these latent thiol monomers.

"Latent thiol monomer," as used herein, is defined as a polymerizable monomer containing; at least one functional group polymerizable to form a homopolymer or copolymerizable with at least one first ethylenically unsaturated monomer to form a copolymer; and at least one protected thiol group, for example a thioester, preferably thioacetate. The term "latent" refers to the fact that the protected thiol group does not react in the homopolymerization reaction or the copolymerization reaction with the first ethylenically unsaturated monomer or monomers. After the homopolymerization or copolymerization is conducted, the protected thiol group can be deprotected, for example by a cleaving reaction, to form a thiol group pendant to the polymer chain. This thiol group so formed can then react in a second polymerization with at least one second ethylenically unsaturated monomer, to form a graft copolymer.
"Graft copolymers" as used herein, are defined as the macromolecule formed when polymer or copolymer chains are chemically attached to a polymeric backbone as side chains. Generally, in graft copolymers, the side chains are of different composition than the backbone chain. Due to the ability to chemically combine unlike polymeric segments in one molecule, graft copolymers have unique properties, making them particularly useful for their surface active properties, such as for example in stabilizing physical blends of otherwise incompatible polymeric or monomeric compounds.
The copolymer products of the present invention can be used directly in water-based emulsion coatings, elastomers, adhesives, caulks and mastics. Still further uses for these copolymers are as plastic additives for use as compatibilizers of polymer--polymer blends.


A signal probe apparatus having a probe tip, a grounding attachment, a main body portion and a connector for use with a signal measuring device. The probe tip and the grounding attachment are coupled by way of first and second signal lines to the connector for supplying signals therefrom to the signal measuring device. A plurality of circuit elements, such as resistors, are connected between the second signal line and a third line in the connector; and switch means located on the main body portion enables a predetermined circuit value, for example, the resistance between the second and third lines, to be selectively changed to a respective value which corresponds to a respective one of several predetermined functions which may be performed by the signal measuring device. The selected circuit value is detected by the signal measuring device and the corresponding function is thereafter implemented.

1. Field of the Invention
This invention relates to signal probe apparatus for use with a signal measuring device, such as an oscilloscope or the like.
2. Description of the Prior Art
In the prior art, signal probes are normally used with a signal measuring device, such as an oscilloscope, for measuring signals at desired locations in a circuit. Through the use of appropriate probe tips, these probes may be easily secured to the desired locations. Such probes may be intended for use with one or more particular oscilloscopes wherein certain considerations, such as those relating to bandwidth and to load termination between the probe and the oscilloscope, have already been taken into account. Further, resistive cabling and/or proper shielding may be designed into the probes so as to minimize the amount of stray signals which may otherwise be mixed with the desired signals to be measured and thus detected. Nevertheless, probes may insert a load into the circuit which may affect the signal to be measured. For example, when measuring relatively high frequency signals, circuit loading in the form of additional capacitance may be inserted by the probe. To minimize this additional capacitance, attenuation probes, such as a voltage sensing passive type, may be used. These probes attenuate signals by a predetermined attenuation amount, for example, 10X or 100X, and, as a result, reduce or minimize the induced additional capacitance. However, in so doing, the signal being measured is also attenuated by the same amount.
An example of an attenuation probe 10 is illustrated in FIG. 1A. As shown therein, the attenuation probe 10 generally comprises a main body 12, a cable 18, a compensation portion 20 and a connector 22. The main body 12 includes a probe tip 14, an attenuation portion 52 (FIG. 1B) and a switch 16. Further, a ground wire 11 having a ground attachment 13, for example, an alligator-type clip, is coupled to the main body 12. As is to be appreciated, in measuring high frequency signals, it may be desirable to minimize the length of the ground wire 11.
The compensation portion 20, which contains an adjustable portion 54 having an adjustable capacitor 50 (FIG. 1B) or similar device, is adapted to compensate for variations in the oscilloscope input capacitance. The probe 10, and particularly the compensation portion 20, further includes an element or elements, such as a sense resistor 24 (FIG. 1B), which is utilized to provide an indication to the oscilloscope of the amount of attenuation (i.e. the attenuation factor) associated with the probe.
To measure a signal at a desired test point, the probe tip 14 is placed on such test point and the ground clip 13 is securely attached to an acceptable ground connection. The signal from the test point is supplied from the probe tip 14 by way of a first wire or signal transmission line contained within the probe 10 through the attenuation portion 52 and the cable 18 to the adjustment portion 54 of the compensation portion 20. Similarly, ground is coupled from the ground attachment 13 through the ground wire 11 to the main body 12 and from there by way of a second (ground) line contained within the probe 10 through the cable 18 to the adjustment portion 54 of the compensation portion 20. As shown in FIG. 1B, a third signal line (commonly referred to as a sense line) is coupled to the ground line in the main body 12 through the sense resistor 24 included in the compensation portion 20 and is adapted to provide an indication or sense signal therefrom. The measured signal, ground signal and sense signal are thereafter supplied from the compensation portion 20 to the connector 22 which is adapted to mate with a corresponding connector on the oscilloscope. As a result, when the connector 22 is connected to the corresponding mating connector of the oscilloscope, the signals from the attenuation probe 10 are supplied to the oscilloscope.
In certain situations, for example, when using multiple probes which provide multiple signal displays, it may be desirable for the operator to confirm the origin of a signal currently being displayed by the oscilloscope. In these situations, the operator may press (close) the switch 16 of a probe, which is preferably a momentary-type switch, to short circuit, or by-pass, resistor 24, thereby changing the resistance between the ground line and the sense line, as hereinafter more fully described. Upon sensing such change in resistance, the oscilloscope typically displays an identification mark on its display screen, thereby providing an indication to the operator that the signal being displayed is obtained from the respective probe in which the switch 16 was pressed.
FIG. 1B illustrates a schematic diagram of the probe 10. In FIG. 1B, the probe tip 14 and the ground clip 13 correspond to terminals 26 and 28, respectively. The terminal 26 is coupled by way of the signal transmission line through the attenuation portion 52 and the adjustment portion 54 to an output terminal 30 contained within the connector 22. Similarly, the terminal 28 is coupled by way of the ground line through the adjustment portion 54 to a terminal 32 contained within the connector 22. A terminal 34, also contained within the connector 32, is coupled to the sense line which is connected to the ground line by way of the sense resistor 24. Further, the switch 16 is connected across the resistor 24 as shown in FIG. 1B, to selectively by-pass the resistor.
The attenuation portion 52 may include resistors 40 and 42 and a capacitor 44 connected as shown in FIG. 1B. The values of these components are dependent upon the amount of desired attenuation of the signal to be measured, that is, the signal applied to the probe tip (or to terminal 26). As an example, for a probe having an attenuation factor of X10 (i.e. V.sub.out =V.sub.in /10) for use with an oscilloscope having a 1 Mohm input resistance, these components may have the following values:
resistor 40:47 ohms PA1 resistor 42: 9 Mohms PA1 capacitor 44:12 pf
The adjustment portion 54 may include the adjustable capacitor 50 and resistors 46 and 48 connected as shown. The adjustable capacitor 50 may be adjusted by the operator so as to compensate for variations in the input capacitance of the oscilloscope, as previously discussed. As is to be appreciated, portions 52 and 54 may be configured differently from that shown in FIG. 1B and may be located in different locations of the probe 10. For example, the attenuation portion 52 may be located in the compensation portion 20.
The value of the resistor 24 identifies the attenuation factor associated with the probe 10. In other words, probes performing different levels of signal attenuation will have different respective resistance values for the resistor 24 so as to produce different respective values or ranges of values of a sense signal across the terminals 32 and 34 as, for example, those shown in Table 1.
TABLE 1 ______________________________________ Probe Attenuation Factor R.sub.32-34 (ohms) ______________________________________ 1 X1 >15K 2 X10 11K +/- 10% 3 X100 5.6K-6.2K +/- 10% ______________________________________
As shown therein, each of three different attenuation probes utilizes a value or range of values for the resistor 24 which is unique from the others. Further, such resistance values are sufficiently separated from one another so as to allow for component and measuring tolerances. As a result, by measuring the resistance across terminals 32 and 34 when the switch 16 is opened, the oscilloscope is provided with an indication of the amount of signal attenuation performed by the respective probe. For example, if a conventional sense, or measuring circuit in the oscilloscope detects a resistance R.sub.24 across the terminals 32 and 34 of approximately 11K ohms, this indicates that the probe being utilized has an attenuation factor of 1OX and a predetermined amount of compensation is provided for such attenuation. For example, horizontal and/or vertical sensitivity may be adjusted accordingly. On the other hand, when the switch 16 is closed (activated), the resistance across the terminals 32 and 34 is effectively a short circuit. In this situation, the sense or measuring circuit interprets such low resistance as a command to display an identification mark on the display screen, as hereinbefore discussed.
Typically, the resistance R.sub.24 across the terminals 32 and 34 is sampled by the sense or measuring circuit at a predetermined sampling rate. The sampled resistance information, in analog form, is supplied to an analog-to-digital converter contained within the oscilloscope (not shown) so as to be converted into digital form. Thereafter, the digital information signal is supplied to a processor (not shown) which processes the information in accordance with a previously stored algorithm so as to compensate for the attenuation factor.
Although the above-described probe 10 reduces capacitive loading and provides an identification signal, such probe may be cumbersome to use in taking signal measurements and particularly when different functions performable by a multi-function oscilloscope are desired. For example, consider the situation in which an operator, who is working alone, is holding a probe in each hand on two respective test points and wishes to change or activate one or more functions of the oscilloscope. In such a situation, the operator typically frees one of his or her hands, thereby interrupting the measuring of the signals, so as to adjust the appropriate knob or activate a particular switch on the oscilloscope. The prior art has failed to provide a means for remotely controlling one or more functions of an oscilloscope which is convenient for an operator to use while actively measuring signals.

Signal probe with remote control function


The invention discloses a novel use of Mullerian Inhibiting Substance (MIS) as a contraceptive agent. MIS has been found to reversably inhibit the maturation of oocytes in vitro. Additionally, the invention provides a means for restoring the fertility of females who are infertile due to abnormal production of MIS.

I. Mullerian Inhibiting Substance
Mullerian Inhibiting Substance (MIS) is a 140,000 dalton glycoprotein responsible for the regression of the Mullerian duct in a male embryo (Jost, A., Comptes Rend. Soc. Biol., 140:463-464 (1946); Jost, A., Comptes Rend. Soc. Biol., 141:135-136 (1947); Balanchard, M. G., et al., Ped. Res., 8:968-971 (1974); Donahoe, P.K., et al., Biol. Repro., 15:329-334 (1976); Donahoe, P. K., et al., J. Ped. Surg., 12:323-330 (1977); Donahoe, P. K., et al., Biol. Repro., 16:238-243 (1977)).
Mullerian Inhibiting Substance has been found to be a glycoprotein hormone. The substance is produced by fetal and neonatal Sertoli cells of the testes. MIS has been partially purified and found to be a dimeric glycoprotein of 72,000 and 74,000 daltons (Budzik, G. P., et al., In: Lash, J. W., Saxen, L., (Eds.), Developmental Mechanisms: Normal and Abnormal. N.Y., Alan R. Liss, pp. 207-223 (1985)). The purification of MIS is described in Donahoe, P. K., et al. (U.S. Pat. No. 4,510,131).
Monoclonal antibodies to MIS have been developed and found to be useful in the purification and preparation of MIS (Shima, H., et al., Hybridoma 3:201-214 (1984); Donahoe, P. K., et al., U.S. Pat. No. 4,487,833) Necklaws, E. C., et al., Endocrinology 118:791-796 (1986). Using these monoclonal antibodies, a radioimmunoassay has been developed to detect MIS (Hayashi, M., et al., J. Histochem. Cytochem., 32:649-654 (1984)). This radioimmunoassay has detected MIS in the follicular fluid of mature bovine ovaries (Vigier, B., et al., Endocrinol., 114:1315-1320 (1984), in fluid from large and small follicles of new born ovaries (Necklaws, E., et al., Endocrinol., 2:791-796 (1986), and in incubation media of bovine granulosa cells (Vigier, B., et al., supra (1984)).
MIS has been found to be cytotoxic to human ovarian cancer cells in vitro (Donahoe, P. K., et al., Science, 205:913-915 (1979)). It has also been found to be effective against this cancer in vivo (Donahoe, P. K., et al., U.S. Pat. No. 4,510,131).
The gene for MIS has been cloned and expressed in tissue culture cells; both the DNA and amino acid sequences are known (Cate, R. L. et al., Cell 45:685-698 (1986)).
II. Mammalian Embryology
The mammalian oocyte enters the first meiotic division during fetal life, but becomes arrested in late prophase (in the dictyate or diffuse diplotene stage of meiosis) before or just after birth (Beaumont, H. M., et al., Proc. R. Soc. London (Series Biological Sciences) 155:557-579 (1962). Resumption of meiosis normally does not occur until shortly before ovulation when a surge of gonadotropins prompts the resumption of meiotic maturation (Dekel, N., et al., Proc. Natl. Acad. Sci. U.S.A., 75:4369-4373 (1978). Preovulatory resumption of meiosis is characterized by: (1) the breakdown of structures known as germinal vesicle (GV), (2) the expulsion of the first polar body and (3) progress to the metaphase of the second meiotic division (Tsafriri, A., et al., J. Repro. Fertil., 64:541-551 (1982). In the rat, the period of MIS production by the ovary coincides with the period of oocyte meiotic arrest. The physiological mechanisms responsible for keeping the oocyte in the state of meiotic arrest are unknown but are not important to an understanding of the present invention. Such mechanisms are presumed to be regulated by the MIS of the present invention. It is, however, well-known that if rodent, bovine, or porcine oocytes are cultured in vitro, and subsequently isolated from follicles, they resume meiosis spontaneously (Edwards, R. G., Nature, 196:446-450 (1962); Foote, W. D., et al., Anal. Biol. Animale Bioch. Biophys. (Paris), 9:329-(1969)).
III. Inhibitors of Meiosis
Three different types of molecules have been reported to be involved in meiosis inhibition in mammalian oocytes: (1) a low-molecular weight protein fraction of follicular fluid or granulosa cells (termed "oocyte meiosis inhibitor"), (2) steroids, and (3) cAMP and other nucleotides (Downs, S. M., et al., Proc. Natl. Acad. Sci. U.S.A., 82:454-458 (1985); McGaughey, R. W., Endocrinol., 100:39-45 (1977); Dekel, N., et al., Biol. Repro., 20:191-197 (1979); and Hubbard, C. J., et al., Biol. Repro., 26:628-632 (1982)). Oocyte meiosis inhibitor is produced by granulosa cells, and is present in the Mullerian follicular fluid. Partial purification of this fluid has revealed the oocyte meiosis inhibitor to be a small polypeptide with a molecular weight of less than 6,000. Sato, E. et al., Differentiation, 26:59-62 (1984). This protein prevents the spontaneous resumption of meiosis in cultured cumulus cell-enclosed oocytes, but not in denuded oocytes. Hillensjo, T. et al., Adv. Exper. Med. Biol., 147:175-188(1982). The protein' s inhibitory effect can be overcome by Luteinizing Hormone (LH). The inhibitory effects can also be reversed by removing the factor from the culture medium (Sato, E. et al, supra).
Thus, in summary, the background art discloses that MIS, a high molecular weight glycoprotein, is produced by mammalian testes. MIS is capable of directing the regression of the Mullerian duct in a developing male embryo. In the absence of this substance, the Mullerian duct would continue its development into the female reproductive system.
Once formed in the developing embryo, the subsequent development of mammalian oocytes becomes arrested in the late prophase stage of meiosis. This inhibition of development is believed to be the result of interactions between the female reproductive system and either a low molecular weight oocyte meiosis inhibitor, steroids, or nucleotides, such as cAMP.

Use of EGF to reverse the contraceptive activity of MIS