A method and an arrangement for transmitting reference signals in a radio frame in a cellular communication system comprising at least one network node having a measurement bandwidth γ, which is more narrow than a full downlink bandwidth β of said network node. Subframes only carrying reference signals, which are to be transmitted from said network node may be transmitted over a temporarily reduced transmission bandwidth α, which is at least equally wide as the measurement bandwidth Y provided by the network node, and more narrow than the full downlink bandwidth β of the network node. The use of a reduced transmission bandwidth leads to that less reference signals are transmitted, and thereby transmission power will be saved.

Energy savings is an important issue in many organisations today, both for economical and environmental reasons. Many organisations have set up goals concerning how much the direct and indirect CO2 emissions should be reduced in the years to come. For organisations supplying network elements for telecommunication systems, a large part of the indirect carbon-related emissions take place in the user phase.
Further, it is desired to reduce the interference in communication systems, which may be addressed e.g. by reducing transmission power.
For example, wireless network nodes such as e.g. radio base stations or relays, consume a considerable amount of energy when transmitting information to other network elements. The Radio Unit (RU) of a base station, which performs the transmissions, uses a considerable part of the total consumed power of the base station. A RU comprises one or more transmitters, each of which in turn comprises one or more Power Amplifiers (PAs). A PA in an average base station has an output power of approximately 20 W and an efficiency level of around 20%, which means that approximately 100 W are needed in order to obtain an output power of 20 W from a PA. Considering the amount of network nodes transmitting 24 h/day, 365 days/year in a communication system, it is apparent that even small improvements in the transmission power efficiency of a network node may have a notable impact on the total amount of consumed power in a large perspective.
It is comprehensible that a great amount of energy is consumed in a network node during the busy hours of the day, when the network or cell has a high load level. However, it is perhaps not as evident that as much as up to 23.8% of the maximum power consumed in a network node during the busy hours, also is consumed during periods when the network or cell load is zero. The reason for this is that control information is transmitted by a network node also when there is no traffic load in the network or cell. The table in FIG. 16, shows an example of the percentage of user data and control signals, respectively, in an LTE (Long Term Evolution) radio frame at different traffic loads. In the example, an LTE cell with 20 MHz system bandwidth, 1 TX (transmission) antenna and 3 PDCCH (Physical Downlink Control Channel) symbols per subframe, is assumed. It can be seen in the table in FIG. 16 that at maximal traffic load, the control signalling represents 40% of the total amount of symbols per radio frame. At zero traffic load, the control signalling represents 23.8% of the total amount of symbols per radio frame, which implies that 23.8% of the total transmission power used when transmitting a subframe at maximum traffic load in the LTE network node is consumed at zero traffic load, as stated earlier.
Thus, control signalling consumes a considerable amount of energy also during periods of low to moderate traffic load. A considerable part of the amount of cells in a network will have a low to moderate traffic load during a considerable part of the time. Further, the relatively high transmission power levels during low to moderate traffic loads contribute to the interference level in the network. This leaves room for further improvements.

LTE cell specific reference signal bandwidth reduction


A solar receiver (1) for a solar-thermal power plant, comprising a receiver surface (2) facing towards the concentrated incident solar radiation (8) and including a plurality of mutually spaced absorber bodies (3), is provided with gas channels arranged between the absorber bodies (3) for supplying a gas or gaseous mixture (11) adapted to absorb solar radiation (8) to a region located in front of the receiver surface (2). In this region, the gas (11) will absorb a part of the incident solar radiation (8) and then will be sucked together with the ambient air (9) through the absorber bodies (3) to be further heated therein.

In a solar-thermal power plant, heliostats or collectors are used to focus the incident solar radiation onto a solar receiver which is commonly assembled from a large number of ceramic absorber bodies. The highly concentrated solar radiation incident on the absorber body is about 200 to 300 times stronger than the natural radiation of the sun; as a result, temperatures above 1000.degree. C. are generated in the absorber body. Due to such high temperatures, metals are not useful as materials for the absorber. Instead, use is made of highly temperature-resistent ceramics, e.g. silicon carbide or silicon silicon carbide.
Basically, two constructional designs are known for absorbers: that of a volumetric absorber and that of a direct-absorption absorber. Volumetric absorbers comprise absorber arrays made from metallic or ceramic honeycomb structures, reticulated structures or foams. The absorber arrays will absorb the solar radiation while having a fluid, e.g. ambient air in case of an open volumetric absorber, flowing therethrough. The fluid is convectively heated and supplied to a subsequent process such as a steam-turbine process. In absorbers for direct absorption, dark particles conveyed in a gas or a liquid are exposed to the solar radiation so that the particles will absorb the solar radiation and thus heat the gas or the liquid.
The source of energy of solar-thermal power plants is the radiation of the sun which, in contrast to the energy sources of conventional steam generators, is not adjustable and is subjected to continuous change depending on the position of the sun as determined by the time of day and the seasons of the year. The latter factors cause changes both in the intensity of the incident radiation and in the distribution of the incident radiation on the solar receiver. To utilize the energy in the heat-carrier medium in an optimum manner, the outlet temperature of the heat-carrier medium across the cross section of the receiver should be as constant as possible.
For this purpose, the mass flow distribution of the heat-carrier medium across the receiver surface has to be adapted corresponding to the distribution of the intensity of the incident radiation.
Usually, an active control of the mass flow distribution of the heat-carrier medium is precluded by the high temperatures possibly in excess of 1000.degree. C. and by the costs incurred. As a result, a homogeneous outlet temperature can normally be obtained only for one design point. The design point of the mass flow distribution is normally selected to obtain an energetic maximum, averaged over the year, for the respective design. This means that the design is based on an average distribution of the incident radiation. Deviations of the actual distribution of the incident radiation from the above average distribution tend to cause local overheating of parts of the receiver. In practice, such incidents lead to a decrease of the irradiation onto the solar receiver so that the plant will not be able to utilize the maximum of the potentially available concentrated solar radiation.
Known from DE 42 23 779 C1 is a solar plant comprising an absorber body adapted for suctional intake of ambient air which after intake will be convectively heated by an absorber body. The absorber body has tubular channels extending therethrough for infeed of preheated air from the rear of the absorber so that the preheated air is guided through the absorber to a region externally before the absorber body. In this region, the preheated air mixes with the ambient air and is sucked into the absorber to be further heated therein. It has been observed that the preheated air discharged from a certain number of tubes has a high discharge velocity so that a considerable part of the preheated air will flow beyond the intake region of the absorber and therefore not be available anymore for the process. As a countermeasure, baffle bodies can be arranged in front of the tube outlets for deflecting the discharged preheated air towards the absorber. Since this region of the solar plant is exposed to very high temperatures, the design and the attachment of these deflecting bodies are very complex.
It is an object of the invention to increase the efficiency of a solar receiver, particularly in that the receiver can be used over a wide range of temperatures.

Deutsches Zentrum fuer Luft- und Raumfahrt e.V.


Positioning devices for improving the fit, comfort and crash protection provided to users, particularly children, of Type II vehicle seat belt assemblies which include webbing connected to a retraction device and extending at a relatively upper end from a force diverter such as a pillar loop and secured to an anchor at a relatively lower end, with a latch plate insertable into a buckle and having a slotted opening through which the webbing slides to define a shoulder belt portion between the upper force diverter and the latch plate, and a lap belt portion between the lower anchor end and the latch plate. One disclosed positioning device includes a clamping element frictionally engagable with the shoulder belt portion and positionable immediately adjacent the latch plate so as to maintain the lap belt portion in a desired snug condition when the latch plate is inserted into the buckle by preventing sliding of the webbing through the opening in a direction which would loosen the lap belt portion, while permitting sliding of the webbing through the opening in a direction which would further tighten the lap belt portion. Another disclosed positioning device includes a shoulder belt repositioning element attached to the clamping element.

The invention relates generally to Type II vehicle seat belt assemblies which include webbing connected to a retraction device and extending at a relatively upper end from a force diverter such as a pillar loop and secured to an anchor at a relatively lower end, with a latch plate insertable into a buckle and having a slotted opening through which the webbing slides to define a shoulder belt portion between the upper force diverter and the latch plate, and a lap belt portion between the lower anchor end and the latch plate. The invention more particularly relates to positioning devices for improving the fit, comfort and crash protection provided to the user, particularly, but not limited to, children.
Conventional seat belt assemblies, which include a lap belt and a diagonally-extending shoulder strap, are designed primarily for use by adults of average size.
One of the leading causes of injury and death to smaller users of the approved Type II vehicle seat belt assemblies is the lap belt being loose or out of position across the abdomen of the user. Such improper lap belt position, on or above the iliac crest of the user, can result from several potential conditions. One potential condition is an adolescent child user moving forward along the horizontal seating surface in order to allow his or her knees to bend over the front edge of the seat. Another potential condition is the user pulling down on the shoulder belt, deliberately producing xe2x80x9cslack,xe2x80x9d allowing the shoulder belt to slide down through the slot in the lap plate, resulting in a loose or improperly fitting lap belt, shoulder belt, or both. Although this allows the user to sit in a more xe2x80x9crelaxedxe2x80x9d forward or slouched position on the seating surface, it can result in the lap belt being loose, positioned high on the abdomen, or both. Moreover, correct shoulder belt positioning is often compromised by such a xe2x80x9crelaxedxe2x80x9d seating position. In the event of an accident, the loose or improper belt position results in much higher rates of injury and death.
In addition, when the seat belt assembly is used by a child or smaller adult, the shoulder strap typically extends across the neck or face of the child because his or her upper body is not quite as long as that of a taller individual. In other words, the shoulder belt often rests too far inboard and rubs on the neck of the user. This can cause discomfort. In addition, to relieve the discomfort, children often place the shoulder belt under the arm or behind the back, such that there is no upper body restraint during an accident. Again, higher rates of injury and death can result.
A variety of shoulder belt repositioners or xe2x80x9cadjusters,xe2x80x9d particularly for use by children, have been proposed, and several have been commercially produced. Examples are disclosed in McCracken U.S. Pat. No. 5,178,439; Kornblum et al U.S. Pat. No. 5,255,940; Barr et al U.S. Pat. No. 5,265,910; Vicanti U.S. Pat. No. 5,275,468; Golder U.S. Pat. No. 5,335,957 and Zheng U.S. Pat. No. 5,421,614. Many of these shoulder strap repositioners or xe2x80x9cadjustersxe2x80x9d realize their xe2x80x9cadjustmentxe2x80x9d through some interaction with the lap belt. In particular, interaction with the lap belt tends to pull the lap belt up towards the abdomen of the user. The lap belt is free to move up, as the retraction device releases webbing which slides through the slotted opening in the latch plate.
In addition, some of the available shoulder belt xe2x80x9cadjusterxe2x80x9d products allow improper adjustment positions for the shoulder belt which could result in injury, by allowing the position of the shoulder belt to be adjusted either too far inboard, or riding on the shoulder or off the torso altogether.
It is therefore seen to be desirable to improve the protection afforded to all users of the Type II vehicle seat belt assemblies.
It is also seen to be desirable to not compromise the effectiveness of the Type II seat belt assembly.
In an exemplary embodiment of the invention a positioning device includes a clamping element frictionally engagable with the shoulder belt portion and positionable immediately adjacent the latch plate so as to maintain the lap belt portion in a desired snug condition when the latch plate is inserted into the buckle by preventing sliding of the webbing through the opening in a direction which would loosen the lap belt portion, while permitting sliding of the webbing through the opening in a direction which would further tighten the lap belt portion.
Another embodiment of the invention includes a shoulder belt repositioning element attached to the clamping element.

Positioning device for vehicle seat belt assembly


Provided is a method of fabricating a semiconductor device. An integrated circuit (IC) layout plan is obtained. The IC layout plan contains critical features and non-critical features. Locational information regarding a defect on a blank reticle is obtained. The blank reticle is a candidate reticle for being patterned with the IC layout plan. Based on the locational information regarding the defect and the IC layout plan, a determination is made that at some of the critical features will intersect with the defect if the blank reticle is patterned with the IC layout plan, regardless of whether the IC layout plan is globally manipulated or not before being patterned onto the blank reticle. In response to the determination, selected local portions of the IC layout plan are re-arranged such that none of the critical features will intersect with the defect if the blank reticle is patterned with the IC layout plan.

The semiconductor integrated circuit (IC) industry has experienced rapid growth. Technological advances in IC materials and design have produced generations of ICs where each generation has smaller and more complex circuits than the previous generation. However, these advances have increased the complexity of processing and manufacturing ICs and, for these advances to be realized, similar developments in IC processing and manufacturing are needed. In the course of integrated circuit evolution, functional density (i.e., the number of interconnected devices per chip area) has generally increased while geometry size (i.e., the smallest component (or line) that can be created using a fabrication process) has decreased.
As a part of the semiconductor fabrication, patterned photomasks or reticles (the terms photomasks and reticles are used interchangeably hereinafter) are used to pattern semiconductor features onto a wafer. A blank reticle (or a reticle blank) is used to create the patterned reticle. However, some blank reticles may contain defects, such as phase defects of an Extreme Ultraviolet (EUV) lithography mask. Without correction, these defects may cause problems in semiconductor fabrication and lead to device failures and/or low yields. As the geometry sizes for semiconductor features shrink and pattern density increases, it may be increasingly difficult to avoid these reticle defects.
Therefore, while existing methods of forming patterned reticles have been generally adequate for their intended purposes, they have not been entirely satisfactory in every aspect.

Minimizing harmful effects caused by reticle defects by re-arranging IC layout locally

Taiwan Semiconductor Manufacturing Company, Ltd.


A jerk-initiated switch includes a housing having an inner housing wall which defines an accommodation chamber therein. First and second terminals are disposed to define a switching action enabling path of a straight length that crosses the accommodation chamber. A ball member and a momentum reducing member are disposed in the accommodation chamber. When the housing is jerked, the ball member is displaceable from a first position, where the ball member is disposed to interrupt the switching action enabling path to establish a first electric switching state, to a second position, where the ball member is disposed outside the switching action enabling path to establish a second electric switching state. The momentum reducing member is configured to yield under impact from the ball member to reduce the momentum of the ball member when the ball member is displaced from the first position to the second position.

1. Field of the Invention
This invention relates to a jerk-initiated switch, more particularly to a jerk-initiated switch having a momentum reducing member which is yieldable under impact from a ball member so as to reduce the momentum of the ball member when the switch is jerked.
2. Description of the Related Art
A conventional vibration switch capable of instantly changing its switching state when jerked by a force coming from any direction generally includes a housing and a ball rollable in the housing to be displaceable when the housing is caused to quiver in an unsteady state so as to effect a change of an electric switching state. However, the ball will produce a clattering sound when it hits against the housing.


A vibration mirror is reciprocatively vibrated by an electrostatic force to reflect an incident light beam. The vibration mirror comprises a reflection means for reflecting the incident light beam; a reflection means holding substrate for holding the reflection means; a torsional rotation shaft comprising rod members rotatably supporting two ends of the reflection means holding substrate; movable electrodes formed on side faces of the reflection means holding substrate supported; a first substrate for supporting the reflection means supporting substrate via the torsional rotation shaft; first fixed electrodes formed on the first substrate so as to face the movable electrodes; a first electrically insulating and separating means formed on the first substrate to electrically insulate and separate the movable electrodes from the first fixed electrodes; and a second substrate overlaid on the first substrate with an insulating layer therebetween so as to be electrically insulated from and overlapped to adhere onto the first substrate.

1. Field of the Invention
This invention relates in general to an optical scanning device, a scanning control device for controlling the optical device, a program used by a computer for executing a scanning control, a positioning mechanism for positing the optical scanning device within an image forming device, an optical scanning unit with a plurality of optical scanning devices, and an image forming device or a read device using the optical scanning device. In particular, the invention relates to a vibration mirror used for the optical scanning device and a method for making the vibration mirror.
2. Description of the Related Art
In a conventional optical scanning device, a mirror substrate, which is formed by a thin film that is supported by two rods, is reciprocatively vibrated using the two rods as a torsional rotation axis by an electrostatic attraction between electrodes disposed at a location opposite to the mirror substrate.
In comparison with a conventional optical scanning device with rotation of polygon mirrors using motors, the described optical scanning device, which is formed with a so-called micro-machining technology, can be wholly constructed by a simple semiconductor process, and therefore, the optical scanning device can be easily made very small, the manufacturing cost can be reduced, and an uneven accuracy due to plural faces with a single reverse inclined surface does not exists. Furthermore, an effect capable of corresponding to a high speed for the reciprocation scanning can be expected. Therefore, a device, in which an image device where an optical writing is performed by a electrophotographic process to form an image, or a reading device where an optical scanning is performed to read an image is installed, is proposed and disclosed.
As the torsional vibration type optical scanning device with an electrostatic driving ability, several disclosures are known. For example, in Japanese Patent No. 2924200, the rod is made into a S shape and its rigidity is thus reduced, so that a small driving force and a large vibrational angle are obtained. Also, in the Japanese Laid Open Application No. 7-92409, the thickness of the rod is thinner than a frame substrate. In Japanese Patent No. 3011144, fixed electrodes are arranged at a location not overlapped with the vibrational direction of the mirrors.
Through etching an SOI substrate by dry etching is a widely known method to form a fundamental shape of the vibration mirror that is made by the micro-machining technology, for example, a disclosure taught by Japanese Patent Publication 2001-513223. In this method, an etching mask is formed on a first silicon substrate of the SOI substrate, and then a through etching process for the first silicon substrate is performed to shape the movable mirrors and the torsion rods. Afterwards, a region of a second substrate including the through region is removed by etching, or a region comprising the through region of the second substrate is removed by etching to form the etching mask on the first substrate of the SOI substrate, so that the first substrate is through etched to form the shapes of the movable mirrors and the torsion rods. The dry etching for the first silicon substrate usually uses high density plasma etching with an etching gas of SF6. At this time, an oxide film with a large etching ration to silicon is widely used, and a portion of the oxide film mask formed with a uniform thickness is removed by etching to form a through region. In this method, a fundamental shape can be formed by bringing out the movable mirror as the reflection means holding means and the rod profile as the torsional rotation shaft by penetrating the substrate. However, the thickness of the movable mirror made by the above manner is entirely uniform, and if the thickness of the first silicon substrate of the SOI substrate is directly used as the thickness of the movable mirror, the momentum of inertia of the movable mirror is large and the vibration angle is large, so that a large driving torque is required.
FIG. 54 is a vertical cross-sectional front view showing a conventional vibration mirror 900 and FIG. 55 is a perspective view. The vibration mirror 900 comprises a substrate 905, movable electrodes 904 disposed at the substrate 905, fixed electrodes 906 disposed opposite to the movable electrodes 904. A rotation axis composed of two rods 903a, 903b that are used to support a mirror substrate 902 having a mirror 901 thereon is formed in the substrate 905. Using the rotation axis 903 composed of the two rods 903a, 903b, and the mirror substrate 902 is reciprocatively vibrated by the electrostatic attraction between the movable electrodes 904 and the fixed electrodes 906. In this way, the mirror 901 rotates to change the reflection direction of an incident light to perform the optical scanning.
The magnitude of a vibration angle θ of the mirror substrate 902 is tiny only under the action of the electrostatic driving torque (T1) as shown in FIG. 56. The mirror substrate 902 is driven by a driving pulse that is equivalent to a mechanical resonant frequency of movable parts, i.e., a vibration state. The vibration angle θ of the mirror substrate 902 with the mirror 901 under the resonant state is expressed as θ=(Tq/I)·K, wherein Tq is an electrostatic torque acted onto the mirror substrate 902 with the mirror 901, I is an inertial moment of the mirror substrate 902 with the mirror 901, and K is a constant determined by the rotation axis 903 composed of the two rods 903a, 903b.
Namely, it is a method that when the vibration angle θ of the mirror 901 on the mirror substrate 902 gets large, the electrostatic torque Tq gets large but the inertial moment I gets small. In particular, when vibration mirror is used in an optical writing device such as a laser printer using a electrophotographic process, it is require to have a mirror on a mirror substrate, wherein the mirror has a reflection plane defined by a beam shape formed on a photosensitive surface. When the mirror face gets large, the mirror substrate also becomes large so that the inertial moment of the mirror cannot be small.
In addition, the resonant frequency f0 and the inertial moment I of the mirror substrate 902 has a relationship of f0∝Γ-1/2. The resonant frequency f0 will deviate due to processing errors of such as the thickness of the mirror substrate, the profile dimension, etc. As described, if the scanning frequency shifts away from the resonant frequency, the vibration angle of performing the optical scanning becomes small. For obtaining a desired vibration angle, the only way is to increase the driving voltage and enlarge the electrostatic torque Tq, so that there are limitations. As a result, in the optical scanning device, the scanning frequency is set according to each resonant frequency.
Accordingly, an error of about several percentages (%) with respect to the design standard occurs, and the main scanning times per unit time, i.e., the scanning, frequency is different for each case. As the scanning frequency is different, the size of the formed image in the secondary scanning direction is different. For example, if the resonant frequency is faster than the design standard, the size of the image in the secondary scanning direction becomes small because the pixel pitch in the secondary scanning direction becomes short. If the error is 1%, the size in the sub-scanning direction is shifted by one pixel as being scanned one hundred times in the main scanning direction. In particular, for an image forming device to form one image by overlapping images that are recorded by plural optical scanning devices, image degradation is a severe problem.

Vibration mirror, optical scanning device, and image forming using the same, method for making the same, and method for scanning image


In a magnetoresistance multilayer film comprising at least two magnetic layers on a substrate, with a nonmagnetic layer intervening between the magnetic layers, each interface between the magnetic layer and the nonmagnetic layer is corrugated in both X and Y directions of a substrate major surface. The corrugations of the interface are formed by providing the substrate surface with a multiplicity of asperities distributed in both X and Y directions and depositing magnetic layers and nonmagnetic layers thereon. The film shows a linear rise of MR change in an applied magnetic field within a very low range of 0 to about 40 Oe.

1. Field of the Invention
This invention relates to a magnetoresistance element for reading a magnetic field strength associated with magnetic recording media and the like as a signal, especially a magnetoresistance element capable of reading a small magnetic field change as a significant electric resistance change signal, a magnetoresistance multilayer film suitable therefor, and a method for preparing the magnetoresistance element.
2. Prior Art
Recently there are growing demands for increased sensitivity of magnetic sensors and increased density of magnetic recording. Researchers strive for the development of magnetoresistance effect type magnetic sensors (simply referred to as MR sensors, hereinafter) and magnetoresistance effect type magnetic heads (simply referred to as MR heads, hereinafter) utilizing magnetoresistance changes. Both MR sensors and MR heads are designed to detect a resistance change of a reading sensor section using a magnetic material for reading an external magnetic field signal. Since the MR sensors and MR heads produce outputs which do not depend on their speed relative to magnetic recording media, the MR sensors have the advantage of high sensitivity and the MR heads have the advantage of high outputs even in high density magnetic recording.
Conventional MR sensors based on anisotropic magnetoresistance effect using magnetic materials such as Ni.sub.0.8 FeO.sub.2 (Permalloy) and NiCo, however, are short of sensitivity as MR head material for reading ultrahigh density record of the order of several GBPI since their resistance change ratio .DELTA.R/R is as low as 2 to 5% at most.
Attention is now paid to artificial superlattices having the structure in which thin films of metal having a thickness of an atomic diameter order are periodically stacked since their behavior is different from bulk metal. One of such artificial superlattices is a magnetic multi-layer film having ferromagnetic metal thin films and anti-ferromagnetic metal thin films alternately deposited on a substrate. Heretofore known are magnetic multilayer films of iron-chromium, nickel-chromium, and iron-manganese types (see Japanese Patent Application Kokai (JP-A) No. 189906/1985). Among these, the iron-chromium (Fe/Cr) type was reported to exhibit a magnetoresistance change in excess of 40% at cryogenic temperature (4.2K) (see Phys. Rev. Lett., Vol. 61, page 2472, 1988). This artificial superlattice magnetic multilayer film, however, is not commercially applicable as such because the external magnetic field at which a maximum resistance change occurs (that is, operating magnetic field strength) is as high as ten to several tens of kilooersted (kOe). Additionally, there have been proposed artificial superlattice magnetic multilayer films of Co/Cu and Co/Ag, which require too high operating magnetic field strength.
Under these circumstances, there was proposed a ternary artificial superlattice magnetic multilayer film having two types of magnetic layers having different coercive forces deposited with a non-magnetic layer interposed therebetween and exhibiting a giant MR change due to induced ferrimagnetism. For example, Japanese Patent Application No. 78824/1991 we filed prior to the present application proposes a structure wherein a nonmagnetic layer intervenes between two adjacent magnetic thin films having different values of Hc, the respective layers having a thickness of up to 200 .ANG.. Also the following articles are known.
(a) T. Shinjo and H. Yamamoto, Journal of the Physical Society of Japan, Vol. 59 (1990), page 3061
A structure of [Co(30)/Cu(50)/NiFe(30)/Cu(50)]x15 wherein numerals in parentheses represent the thickness in angstrom of the associated layers and the numeral after x is the number of recurring units (the same applies hereinafter) produced an MR ratio of 9.9% at an applied magnetic field of 3 kOe and about 8.5% at 500 Oe.
(b) H. Yamamoto, Y. Okuyama, H. Dohnomae and T. Shinjo, Journal of Magnetism and Magnetic Materials, Vol. 99 (1991), page 243.
In addition to (a), this article discusses the results of structural analysis, changes with temperature of MR ratio and resistivity, changes with the angle of external magnetic field, a minor loop of MR curve, dependency on stacking number, dependency on Cu layer thickness, and changes of magnetization curve.
These ternary artificial superlattice magnetic multilayer films are inferior in the magnitude of MR ratio as compared with Fe/Cr, Co/Cu and Co/Ag, but show a giant MR ratio of about 10% under an applied magnetic field of less than several hundreds of oersted. The disclosure of these articles refers to only MR changes under applied magnetic fields of about several 10 to 100 Oe.
MR change curves under an applied magnetic field of 0 to 40 or 50 Oe are important for MR head materials which are used in practical ultrahigh density magnetic recording. In the above-mentioned conventional ternary artificial superlattices, however, the MR change at an applied magnetic field of 0 is not so increased and it is approximate to 0. A percent increase of MR change reaches maximum at about 60 Oe, marking an MR ratio of about 9%. That is, the MR change curve has a slow rise. Permalloy (NiFe), on the other hand, is not suitable as MR heads for reading ultrahigh density magnetic recording because a slope of MR change at zero magnetic field is approximately 0, the MR ratio remains substantially unchanged, a differential of the MR ratio is approximate to 0, and magnetic field sensitivity is low.
One measure for solving such performance problems is proposed in JP-A 318515/1994 as a "magnetoresistance element comprising a magnetoresistance film having alternately deposited ferromagnetic layers and non-ferromagnetic layers, characterized in that the interface between a ferromagnetic layer and an adjacent non-ferromagnetic layer is inclined relative to the surface of the magnetoresistance film and electric current flows through said magnetoresistance film across said interface."
The magnetoresistance element proposed in the above-cited patent reference, however, is very difficult to manufacture and thus impractical since the magnetoresistance film of multilayer structure must be manufactured in the following manner, for example.
First, using a sputtering method, cobalt (Co) layers of 15 .ANG. thick and copper (Cu) layers of 9 .ANG. thick are alternately deposited 30 cycles on an (upper) surface of a silicon substrate ready for deposition. This results in a magnetoresistance film of multilayer structure on the substrate.
Next, a film of novolak type photoresist is formed on the surface of the magnetoresistance film and the resist film is heat softened to form a tapered mask. This mask gradually decreases its thickness from the right end to the left end of the film (as viewed in the figure attached to the above-cited patent reference, the same applies hereinafter).
Subsequently, the magnetoresistance film is subject to ion milling by irradiating argon ion Ar.sup.+ from above the tapered mask. As a result, the film is removed more on the left side than on the right side. The residual film is 10 .mu.m as a whole and its thickness, which reflects the shape of the mask, decreases from the right end to the left end.
On the surface of the tapered magnetoresistance film thus obtained, an alumina (Al.sub.2 O.sub.3) film of 0.1 mm thick serving as a support is deposited by CVD and other techniques. The support is formed on the graded surface of the film (which newly becomes a first film surface) to a substantially uniform thickness.
Next, a film of novolak type photoresist is formed on the back (lower) surface of the silicon substrate, and the resist film is heat softened to form a tapered mask (not shown) as above. This mask has a cross-sectional shape which is tapered such that the thickness decreases from the left end to the right end as opposed to the mask formed on the surface (upper surface) of the silicon substrate. Both the masks have the same degree of taper.
Subsequently, the substrate and the magnetoresistance film are subject to ion milling by irradiating argon ion Ar.sup.+ from below the mask on the back surface of the substrate. As a result, the substrate is completely removed. The film is removed in a tapered shape reflecting the mask shape. The graded surface of the film thus formed newly becomes a second film surface. In this way, a magnetoresistance film having parallel first and second film surfaces and a uniform thickness is obtained in a state secured to the support.
As mentioned above, the preparation of the magnetoresistance film in the magnetoresistance element proposed in the above-cited patent reference is impractical because many steps are involved, for example, ion milling using a mask must be done two times, and difficult operation is concomitant. The magnetoresistance element proposed in the above-cited patent reference wherein the interface between a ferromagnetic layer and an adjacent non-ferromagnetic layer is inclined relative to the surface of the magnetoresistance film also has the problem that a considerable increase of a vertical component of conduction electrons at the interface is not expectable since the angle of inclination cannot be increased beyond about 30.degree. for manufacturing and other reasons.

Magnetic multilayer film, magnetoresistance element, and method for preparing magnetoresistance element


A self-loading slider supports a transducer proximate a rotating disc. The slider includes a slider body having a leading edge, a trailing edge and first and second side edges. First and second side rails are positioned along the first and second side edges, respectively. The first and second side rails form coplanar air bearing surfaces. A cross rail extends between the first and second side rails to form a negative pressure cavity between the cross rail, the trailing edge and the first and second side rails. First and second trailing edge reliefs are formed within the first and second side rails, respectively. Each relief extends into a portion of the side rail from the negative pressure cavity, at the trailing edge to form first and second rail end portions adjacent the first and second side edges. The first and second rail end portions extend the air bearing surfaces to the trailing edge of the slider.

The present invention relates to transducer head assemblies for rotating disc drives, and more particularly to negative pressure air bearing disc head sliders.
Transducer head assemblies that "fly" relative to a rotating disc are used extensively in rotating disc drives. The assemblies include an air bearing slider for carrying a magnetic transducer proximate the rotating disc. A track accessing arm positions the slider over individual data tracks on the disc surface.
A gimbal is positioned between the slider and the track accessing arm to provide a resilient connection that allows the slider to follow the topography of the disc. The gimbal includes a dimple that is in point contact with the slider. The dimple provides a pivot about which the slider can pitch and roll while following the topography of the disc.
A conventional catamaran slider includes a pair of rails that are positioned along its edges and are disposed about a recessed area to form a pair of air bearing surfaces. As the disc rotates, the disc drags air under the slider and along the air bearing surfaces in a direction approximately parallel to the tangential velocity of the disc. As the air passes beneath the side rails, the skin friction on the air bearing surfaces causes the air pressure between the disc and the air bearing surfaces to increase which creates a hydrodynamic lifting force that causes the slider to lift and fly above the disc surface.
Self-loading negative pressure air bearing sliders (NPAB) further include a cross rail which extends between the side rails and is positioned near the slider's leading edge. The cross rail forms a subambient pressure region trailing the cross rail, between the side rails. The subambient pressure region develops negative pressure that counteracts the hydrodynamic lifting force developed along the side rails. The counter action between the positive and negative forces reduces flying height sensitivity with respect to disc velocity and increases air bearing stiffness.
As disc drives become more compact for applications in smaller and more portable equipment, rotary actuators are increasingly employed for the track accessing arm. Further, the designer is motivated to use a shorter actuator pivot arm to make the disc drives even more compact. Rotary actuators cause the geometric orientation between the disc rotation tangent and the slider's center line to change as the arm moves the slider between the inside and outside data tracks on the disc. This is known as skew or skew angle. Large skew angles make flying height control more difficult.
Flying height is viewed as one of the most critical parameters of noncontact recording. As the average flying height of the slider decreases, the transducer achieves greater resolution between individual data bit locations on the disc. Therefore, it is desirable to have the transducers fly as close to the disc as possible. Flying height is preferably uniform regardless of variable flying conditions, such as tangential velocity variation from inside to outside tracks, lateral slider movement during a seek, and varying skew angles.
Transducers have been mounted on the trailing end of the side rails. Because the slider flies with a pitch angle in which the trailing edge flies at a closer distance to the disc surface than the leading edge, the transducer is as close to the disc surface as possible when positioned at the trailing edge.
Transducers have also been mounted on a small mounting pad positioned on the center line of the slider at the trailing edge. In this position, there is more room on the trailing end of the slider for fabrication of the transducer and its terminals, relative to the position in which the transducer is mounted off to the side of the trailing end, adjacent the side rails. A disadvantage of central transducer mounting is that when the slider rolls about its pivot point, the spacing of a corner of the trailing edge becomes smaller than the spacing of the transducer. This reduces the minimum flying height of the slider and causes increased risk of slider contact with the disc surface.
Slider roll may be due to several factors. The first factor is manufacturing errors in the gimbal which attaches the slider to the track accessing arm. The second factor is dynamic forces applied to the air bearing slider by the track accessing arm during track accessing. The third factor is varying skew angles of the disc rotation tangent relative to the slider center line. When the slider flies at skew with respect to the direction of air flow, unequal pressure distribution develops between the first and second side rails. This causes the slider to fly with one rail closer to the disc surface than the other rail. As a result, the probability of contact with the disc surface at this corner increases. Therefore, the reliability of the disc drive is reduced. There is a continuing effort to develop air bearing sliders that carry a transducer as close to the disc surface as possible with a constant flying height regardless of the varying flying conditions such as disc velocity and skew angle.

Air bearing slider with relieved rail ends


Method and apparatus for etching a silicide stack including etching the silicide layer at a temperature elevated from that used to etch the rest of the layers in order to accomplish anisotropic etch.

The present invention relates to silicide etch processes and apparatus generally and, in particular, to cobalt silicide etch processes and apparatus.
Since the sheet resistance of metal suicides is much lower than polysilicon, metal silicides are commonly used as a cladding on polysilicon to reduce power consumption and the RC time constant in microelectronic integrated circuits. Of all known silicides, cobalt silicide has the lowest sheet resistance and is thus the most desirable silicide for microelectronic integrated circuit use. The introduction of silicides, and particularly of cobalt silicide, for microelectronic integrated circuit fabrication has, however, been limited by the severe difficulty of etching these materials. The reason for the etch difficulty of cobalt silicide is that cobalt has no known compounds that can serve as volatile etch reaction products at temperatures below 500xc2x0 C. (Handbook of Chemistry and Physics).
Accordingly, the present invention has been developed to solve the problem of the etching of silicides and, in particular, cobalt silicide. The invention includes both a method and apparatus for accomplishing this task.
The method of processing a silicide layer which is included in a layer stack positioned on a substrate includes the steps, in any order, of performing a process which can hold the substrate at a first temperature and changing the temperature of the substrate in order to process the silicide layer at a second temperature.
A method and apparatus of the invention provides for processing a silicide layer which is included in the layer stack with another layer including the steps, in any order, of processing the silicide layer at an elevated temperature and processing another layer at a lower temperature.
More specifically, the process includes etching a layer stack including the silicide and at least one of an oxide and a polysilicon. The process includes performing the etching of the silicide at an elevated temperature and performing the etching of the other layers at lower temperatures. Such a process can occur in a single etch reactor or in two etch reactors, with the silicide etch step occurring in a different reaction than the polysilicon etch step. By such a mechanism, anisotropic etching of both the silicide and the other layers can be accomplished. Additionally such a method utilizes the rapid cooling and/or heating of the wafer in order to bring the wafer temperature to the appropriate, range for etching of the relevant layer.
In another preferred aspect of the invention, the silicide layer is etched at a temperature of 150xc2x0 C. or above while the remaining layers of the layer stack are etched at approximately 80xc2x0 C. or below.
In an aspect of the invention, the suicide layer can preferably include cobalt silicide. Other silicide layers can include tantalum silicide, titanium silicide, or molybdenum silicide. Further, the other layers can include, by way of example, an oxide layer and/or polysilicon layers.
The novel method is carried out in a novel apparatus which is designed for handling hard to process silicide films as well as for effectively handling the remaining film. Such an apparatus, preferably, has a high selectivity to oxide films. In particular, the unique apparatus includes a reactor having a tri-electrode configuration. In one embodiment, the method is carried out in such a tri-electrode reactor having first and second electrodes and a side peripheral electrode. The second electrode is provided with high and low frequency power supplies. The side peripheral electrode can alternatively be provided with a high frequency power supply. This reactor includes a chuck which can rapidly change and maintain the temperature of the wafer at advantageous levels in order to process silicide layers and, alternatively, to process other layers, including by way of example, oxide layers and polysilicon layers.
Alternatively, the silicide films can be processed in a tri-electrode reactor chamber wherein the chuck electrode is provided with low and high frequency power supplies. The side peripheral electrode can be grounded or floating. Alternatively, the side peripheral electrode can be supplied with a low frequency power supply. With such an arrangement it is again preferable that the chuck is configurated in order to be able to rapidly change the temperature of the wafer. Preferably for such an arrangement, other layers such as oxide and polysilicon layers can be processed in a separate reactor which is first described herein above with the high frequency power supply communicating with the side peripheral electrode.
It is to be understood that the above described reactors are generally considered capacitively coupled reactors and that other reactors including inductively coupled reactors can be used and be in accordance with the invention. Thus, still alternatively, the invention can be practical in an inductively coupled di-electrode or tri-electrode reactor. In one embodiment, the top inductive coil electrode would be at a high frequency and the bottom electrode associated with the chuck would be at a low frequency. Both steps of etching a silicide layer and a non-silicide layer could be performed in the same chamber. If such a inductively coupled reaction had multiple etch chambers, if desired, a silicide etch step could be performed in one chamber and a non-silicide etch step could be performed in another chamber.
Accordingly, an object of the invention includes using a unique combination of one or more of a preferred reactor configuration, wafer temperature and processing conditions to successfully meet the microelectronic integrated circuit fabrication requirements for silicides generally and cobalt silicide in particular.
The volatility problem with potential etch reaction products for cobalt makes the etchability of cobalt silicide similar in difficulty to platinum or iridium since these elements also have no known volatile reaction products at conventional etch process wafer temperatures. This invention teaches the use of the above reactor configurations, or other comparable reactors, the use of elevated wafer temperatures, the use of suitable hard mask materials, the process settings for gas chemistry, pressure, and RF power, and high speed changes in wafer temperature to etch each of the materials of a cobalt polycide stack. In particular the invention addresses the following in a variety of combinations:
1. The wafer temperature range, gas chemistry, pressure, and RF power, required to achieve high etch rate, and anisotropic etching of cobalt silicide with minimal etch rate and profile microloading.
2. The wafer temperature range to simultaneously meet all the etch requirements of both the cobalt silicide and polysilicon layers in the cobalt polycide stack.
3. The use of rapid wafer temperature changes, through a suitably designed wafer chuck to etch each layer in the cobalt polycide stack to meet all etch requirements.
4. The use of suitable hard mask materials to facilitate elevated wafer temperature etching and meet the mask requirements for etching cobalt polycide stack structures.

Cobalt silicide etch process and apparatus


An ultrasound probe (100) includes an elongate handle (102) with first and second end regions (101, 103). The probe (100) further includes first and second blade sections (104, 112). The first blade section (104) is attached to the first end region (101) and extends in a direction away from the first end region. The second blade section (112) is movably attached to the first end region (101) and extends in the same direction as the first blade section (104). The second blade section (112) is configured to move between a first position in which the second blade section (112) is next to the first blade section (104) and a second position in which the second blade section (112) is further away from the first blade section (104). The probe (100) further includes transducer array (110) affixed to the first blade section (104) opposite the first end region (101) and in between the first and second blade sections (102, 104).

Ultrasonography is an imaging technique used to visualize subcutaneous structures in a subject, for example, an internal organ, an internal muscle structure, or a fetus within a uterus. When this technique is used for a general obstetric exam, a transducer is placed on the outside of the abdomen (e.g., transadominally) of a pregnant woman and emitted sound waves penetrate through the skin, the bladder, and other subcutaneous structures. Reflected sound waves are detected and images are created based on the reflected waves, for visualization of the uterus.
One medical technique where transabdominal ultrasonography is used is in vitro fertilization (IVF), which is a process of fertilization of an egg by a sperm that takes place outside a woman's body (e.g., in a laboratory) and then the fertilized egg is implanted in the uterus. IVF is used when there is abnormal sperm or when fallopian tubes are not patent. The process includes hormonally controlling the ovulatory process, removing ova from a woman's ovaries and letting sperm fertilize them in a fluid medium.
The fertilized egg (e.g., zygote) is then transferred to the patient's uterus with the intent to establish a successful pregnancy. A general method for transfer includes using a speculum, which allows a doctor to have limited direct vision into the vaginal cavity, and inserting a catheter through the cavity until it reaches the uterus. The zygote is then placed on the uterus wall via the catheter. A transabdominal ultrasound has been used to image the uterus to verify placement of the zygote implantation.
Unfortunately, the speculum and/or other structures between the abdomen surface and the uterus may attenuate the ultrasound beam and degrade image quality, making it more difficult to verify placement. Moreover, it may be difficult to visually determine the optimal target for embryo placement, known as the maximal potential (MP) point, from outside of the uterus.


In a flash photographing system, measuring light is calculated by dividing a picture plane into a plurality of areas and adjusting a quantity of flash light on the basis of light measurement outputs obtained from the plurality of areas. The light measurement outputs are evaluated and weighted according to focusing states of the areas, and the weighting values are varied according to the kind of automatic focusing mode selected, so that a quantity of flash light can be controlled appositely to the automatic focusing mode selected.

1. Field of the Invention
This invention relates to a multi-light-control automatic focusing camera of the kind arranged to measure through a plurality of areas the reflection of light projected onto a photographed object from a flash light emitting part and to determine the quantity of flash light to be emitted from the flash light emitting part according to the reflection values thus measured.
2. Description of the Related Art
Many cameras of the light control type arranged to emit flash light from a flash-light emitting part toward a photographed object, to measure light reflected from the object and to determine the quantity of flash light to be emitted on the basis of the intensity (light quantity) of the reflected light, have been placed on the market. In most cases, the cameras of this type perform light control by using a single light measuring sensor with weight attached to the central part of the picture plane in measuring the light. An adequate quantity of exposure light is thus obtainable if the main object to be photographed is located in the central part of the picture plane and in a suitable size on the picture plane. However, in cases where the main object is not in the central part of the picture plane or it is very small as viewed on the picture plane, a proper quantity of exposure light is hardly obtainable because of an adverse effect of the background of the object on the light measuring sensor.
Meanwhile, Japanese Laid-Open Patent Application No. SHO 60-108827 has proposed a multi-light-control type camera which is arranged to divide the picture plane into a plurality of areas and to control the quantity of light to be emitted according to information obtained from a plurality of light measuring sensors. This camera solves the above-stated problem, that is, it increases the probability of obtaining a proper exposure irrespectively of the position and size of the main object.
Further, U.S. patent application Ser. No. 557,172, filed on Jul. 23, 1990, has proposed a camera which is arranged to provide distance measuring means for obtaining information on the measured distances of areas corresponding to a plurality of light measuring areas to evaluate information on the measured light of each of the light measuring areas on the basis of focus information obtained from the distance measuring means and to control the quantity of flash light to be emitted according to the result of the evaluation. That camera is capable of automatically making a proper exposure appositely to a main photographed object irrespectively of the position and the size of the main object obtained within a picture plane. However, the camera has the following shortcoming in the case where framing is changed after a distance ring of a photo-taking lens is driven to adjust the focus of the lens to a desired object through a distance measuring area within the picture plane and the adjusted focus is locked with the object in focus, the main (or desired) object might be brought out of the distance measuring area by the change of framing. Even in such a case, the camera controls the emitting quantity of flash light by evaluating light measurement information obtained mainly from some other object located in the distance measuring area. As a result, the main object which is in focus comes to deviate greatly from a proper exposure.
To solve that problem, it is conceivable to repeat the distance measuring action even after the focus is locked to evaluate the measured light values on the basis of information on the focus obtained for each distance measuring area used at the time of an exposure and to determine the emitting quantity of flash light according to the result of the evaluation. However, it is still difficult to obtain a proper exposure, either because the main object might fail to belong to any of the distance measuring areas or because the control operation of the camera in such a case becomes complex.


The invention relates to a vibration-filtering device and to a system for fixing a load on a support by means of a plurality of such devices.. The device of the invention for fixing a load on a support comprises:. a first fastening zone including fastening means for fastening the device to a support; PA0 an arcuate zone; PA0 a beam substantially parallel to the first fastening zone; PA0 a second fastening zone including fastening means for fastening a load to the device; and PA0 at least two spring blades interconnected by an elastomer layer extending through the first fastening zone and the arcuate zone; wherein: PA0 the device is a vibration-filtering device; PA0 the spring blades interconnected by an elastomer layer pass through the beam to terminate in the second fastening zone close to the fastening means but separated therefrom by respective elastomer layers, in that the spring blades are separated from one another in the first fastening zone for fastening the fastening means on a support by an elastomer layer; and PA0 the layer interconnecting the spring blades includes an elastomer having a high damping coefficient, in particular butyl rubber, in particular in the arcuate zone.

Patent EP-0 296 974, in the name of the Applicant describes resilient supports providing a large amount of clearance for protecting electronic equipment from shock, in particular in the event of a collision or of an explosion. In a variant embodiment described in that patent, the support includes an elastomer arm having a plurality of cables of composite material embedded therein and extended along one side by fastening means that form circular or elliptical arcs including two spring blades of composite material connected together by a layer of elastomer. The elastomer arm including composite cables is connected to the circular or elliptical arc-forming fastening device by a transition zone enabling thickness and width to vary continuously. The arm made of natural rubber which has a low damping coefficient is thicker and narrower than the fastening device which is made of an elastomer that has a high damping coefficient.
The resilient support of patent EP-0 296 974 does not provide effective filtering of vibration, particularly vibration at a frequency lying in the range 10 Hz to 800 Hz. The bottom spring blade is directly secured to a metal fixing support which enhances vibration propagation.
At no moment does that document describe damping vibration by shear in the layer of elastomer lying between the two spring blades made of composite material. On the contrary, the assembly constituted by the spring blades and the intermediate elastomer layer is referred to in column 14, line 39, as "a matrix-fixing composite spring". Furthermore, in column 14, lines 4 to 6, the possibility is suggested of implementing a fixing device that includes a central layer of composite material with two extreme layers of elastomer. In that variant embodiment, the shear required for damping vibration is not achieved.
Also, the blade springs extend within the resilient support of patent EP-0 296 974 only as far as the transition zone between the arms and the fastening means that form a circular arc, and that does not provide the stiffness and resonant frequency characteristics suitable for filtering vibration.
U.S. Pat. No. 4,942,075 describes a spring comprising two oval blades between which a layer of rubber is interposed. In FIG. 4 of that patent, there can be seen an embodiment in which the layer of rubber does not extend in the arcuate zones.
EP-A-0 132 048 describes a spring having mutually parallel blades between which a layer of elastomer is interposed for damping purposes. The embodiment shown in FIG. 11 of that document includes an outer layer 32 of elastomer which does not contribute to damping vibration.
Those patents do not disclose, nor do they suggest, implementing shear forces within rubber for the purpose of damping vibration.

Device for filtering vibration, and a fixing system comprising a plurality of such devices for fixing a load on a support


An access conversion technique of prediction macroblock data which is used for decoding and encoding a motion picture is provided. The access conversion method and apparatus of prediction macroblock stores prediction macroblock data output from a frame memory in a separate storage unit, and then reads the stored prediction macroblock data in an order appropriate for processing the following prediction macroblock.

The present invention relates to an access conversion technique of prediction macroblock data which is used for decoding and encoding a motion picture, and more particularly, to an access conversion method and apparatus of prediction macroblock data output from a frame memory which is stored in a separate storage unit, and then read by an order appropriate for processing the following prediction macroblock.
Motion picture coding is a technology of compressing and restoring motion picture data using motion compensation prediction, discrete cosine transformation (DCT), and variable length coding (VLC).
FIG. 1 is a block diagram of a general motion picture decoder. A variable length decoder 10 receives variable-length-coded data and decodes it via a reverse process. An inverse DCT portion 20 converts decoded data of a frequency region into video data of a spatial region. A motion compensator 30 reads a macroblock corresponding to a motion vector from video data of a previous frame stored in a frame memory 40 and adds the read macroblock to inversely discrete cosine transformed data, to thereby output motion picture data which is motion-compensated and restored.
Data compression of a motion picture is performed by DCT and VLC of a difference value between pictures. Considering movement of an inter-picture, a motion vector is found from a reference picture in units of a macroblock composed of Y of 16 pixels by 16 lines, U of 8 pixels by 8 lines and V of 8 pixels by 8 lines. Then, using a prediction macroblock of the position of the motion vector, a compression rate is enhanced, which is called a motion compensation prediction method.
In the motion compensation prediction method, prediction macroblock data is read from a frame memory, and the read prediction macroblock data is filtered via horizontal interpolation, vertical interpolation, forward prediction, and backward prediction.
However, since an order of reading prediction macroblock data from a frame memory does not match that of data which is used for a filtering process in a conventional motion picture decoding method, an access time of the prediction macroblock data is delayed.

Method and apparatus for conversion of access of prediction macroblock data for motion picture


The present invention provides a composition for controlling pests, comprising a pregelatinized starch and at least one surfactant selected from a group consisting of dialkyl sulfosuccinate type surfactant, silicone type surfactant and acetylene glycol type surfactant and, if necessary, a carrier such as mineral carrier, a surfactant other than above-mentioned surfactant, a plasticizer and other auxiliary agents. The present invention also provide a method for controlling pests, which comprises treating with the above composition.. According to the present invention, various pests can be effectively controlled. Also, in the agricultural/horticultural field, pests can be controlled without causing a phytotoxicity of crops.

As one of the methods for controlling pests, a method for capturing or exterminating pests comprising physically sticking them to an adhesive substance is known. For example, a method for killing a fly comprising sticking it to an adhesive ribbon produced by applying an adhesive on a substrate is known. A similar method for cockroaches, long-horned beetles are also known. In Japanese Patent Kokoku No. 59-23352, a method comprising forming an adhesive foam with an adhesive-organic solvent-liquefied petroleum gas and capturing a cockroach using the adhesive foam is described. In Japanese Patent Kokai (Laid-Open) No. 52-105217, a formulation for capturing rodent animals prepared by adding a thickener to a polybutene compound is described. In Japanese Patent Kokai (Laid-Open) No. 4-66502, an aerosol type adhesive composition for capturing pests (e.g. cockroach, mouse, etc.) comprising a polybutene emulsion is described.
The mode of action of these types of composition is mainly capturing pests on the compositions. Therefore, they contain a strong adhesive substance. In these cases, organic solvents are indispensable. However, these auxiliaries often caused severe phytotoxicity to plants to which the compositions were applied. Moreover, these physical pest control methods have the possibility to cause severe crop residue of adhesives and organic solvents. Therefore, a more sophisticated composition useful for physical pest control is required.
Under these circumstances, the present inventors have studied intensively to find a better composition and method for physically controlling pests. As a result, it has been discovered that a composition comprising a pregelatinized starch and a kind of a surfactant is effective for controlling pests and is extremely useful as an agricultural/horticultural agent for controlling pests.

Starch compositions and method for controlling pests


Disclosed is a monitoring and control system for an air source heat pump apparatus having a controller to control at least one operation of the heat pump apparatus, a temperature sensor to detect the temperature in a specified area at, near, and/or around the controller, and an operable component, the system including a control program to: determine the temperature based on the detected temperature of the temperature sensor; determine whether a first condition exists, the first condition including a determination that the controller is powered, but the operable component is not operating; determine whether a second condition exists, the second condition including a determination that the controller is powered, and the operable component is operating; and based at least partially on determinations (a)-(c), determine the ambient temperature at or around the heat pump apparatus.

1. Field of the Invention
The present invention relates generally to heat pumps and devices and systems that effect the temperature of the surrounding area or a chosen medium, and in particular to a monitoring and control system and method for a heat pump, preferably an air source heat pump, such as an air source heat pump used in connection with a swimming pool, aquarium, fish pond, or other body of water or liquid.
2. Description of the Related Art
Air source heat pumps have been used in various applications to remove heat from the outdoor air and move it to another fluid or heat sink for space and water heating, as well as other applications, such as process heat for industrial and commercial applications, swimming pools, agricultural aquariums, fish ponds, and the like. Such heat pumps are increasingly being utilized in applications where a cost effective heating method is required, such as in areas where the fossil fuel cost per BTU (British Thermal Unit) delivered is greater than the cost of the electricity required to move a BTU of heat from the air using a heat pump.
However, in certain low temperature air source heat pump applications where the exhaust air temperature (i.e., the air already cooled by the heat pump's evaporator) moves below the freezing point, the moisture it contained is left behind frozen on the evaporator tube. In this manner, subsequent and severe icing can occur in the heat pump and its components, which impacts and limits the ability of the heat pump to effectively extract heat from air. When the air temperature goes below the approach of the heat pump evaporator, thus causing the moisture in the air to freeze on the evaporator tubes, the frost effectively insulates the refrigerant inside from further heat transfer.
In a space heating application, where heat must be delivered to the living space in a structure, a second more-costly heat source is often required, such as fossil fuel or resistance electric heat, in order to provide space heating below the heat pump icing temperature. Where the same space heating heat pump is designed using a reversing valve to also provide air conditioning or cooling in warm temperatures, it is capable (in winter heating mode) of defrosting the evaporator or outside coil by operating temporarily in the reversed mode, and removing heat from the heated space to melt the ice on the outside coil. While this is more efficient than using more costly backup heat, at some lower air temperatures or certain applications, the cost advantage is lost, and backup heat must be used for economical reasons.
In the case of air-to-water heat pumps, such as swimming pool heaters, where this limitation is less critical and where frosting only occurs at the low end of the "swimmable" or required range of operating air temperatures, a backup source or costly reversing valve can be avoided if the heat pump's frost-free low air temperature operation is maximized. The actual air temperature at which icing occurs in any outdoor evaporator coil is a function of the tube surface temperature, the amount of moisture in the air, and the air velocity. Although any moisture present will condense below the dew point, and deposit ice or frost as the tube surface temperature is below freezing, the amount of moisture in the air determines how much frost or ice will accumulate and how fast.
In such applications, there exists a cut-off air temperature, below which icing is certain at almost any humidity, and slightly above that is an air temperature at which negligible frost will occur regardless of the humidity. The tube surface temperature will reach freezing at a range of internal refrigerant evaporating temperatures, depending on the mass flow rate of the refrigerant, as well as the size and design of the heat exchanger and the air velocity. To avoid ice formation by shutting off the heat pump as it reaches the freeze point, existing heat pumps either directly measure the tube surface temperature or the air temperature, and shut off the heat pump at an appropriate temperature above the frosting point.
While measuring the tube surface temperature appears to an effective straightforward method, it requires a sensor on the tube, which, in turn, requires wiring and electronic circuitry (or a thermostatic bulb type sensor and capillary controller), all of which significantly increase the cost of the heat pump controls and reduce it's reliability, since the additional sensor and wires (or capillary and bulb) are subject to damage from weather, rodent, insect, or human tampering. In addition, when ice does form on or around the sensor, it will affect the sensors accuracy until the ice melts, which can delay restarting the heat pump when the air temperature has risen well above the frost point, thus defeating the intended purpose of maximizing low temperature operation.
An alternate method to address this frosting issue is to indirectly monitor the refrigeration system pressure (using a pressure switch) to determine the refrigerant evaporating temperature inside the tube. The switch is set to cut-out at a pressure corresponding to a tube surface temperature that is at the freezing point.
Using a pressure switch is a less costly alternative, as most heat pumps already use one to detect loss of refrigerant, and this switch could be set to a cut-out pressure corresponding to an evaporating temperature, which produces a tube surface temperature just above freezing. Once the switch shuts the heat pump off, the suction or evaporating pressure and the condensing or discharge pressure will equalize, since the compressor has stopped pumping gas. This stabilization pressure is equal to the saturation pressure of the refrigerant gas/liquid mixture at the ambient air temperature, which will be higher than the suction pressure. Thus, the cut-out pressure of the switch must be set at the suction pressure corresponding to freezing tube surface temperatures when the heat pump is running, while the reset or cut-in pressure of the switch must be slightly above the off-cycle stabilization pressure of the heat pump when it is off and equalized, otherwise the heat pump will constantly cycle off and on.
The accuracy of the pressure switch method, and using the refrigerant pressure to determine the frost cut-out temperature, is directly dependent on assumptions regarding the calculation of the tube surface temperature, and how much the pressure measured directly reflects that value. This approach is also subject to variations due to refrigerant over- or under-charge, as well as equipment performance variations, including the tolerances on the switch cut-out pressure and cut-in pressure.
Further, currently available low-cost pressure switches depend on an internally-mounted, snap-action, dome-shaped metal disc that collapses or pops out to trigger the on and off set points. Such a design is inherently inexpensive, but also has a fairly wide built-in hysteresis, which is the difference between cut-in and cut-out pressure. This design also has a widely variable pressure trip point tolerance. These factors limit the pressure switch's ability to have a cut-out pressure close to its cut-in or reset pressure, such that once the switch turns off the heat pump, it cannot reset until a much higher suction pressure and air temperature than necessary is reached, thereby losing additional low air temperature runtime. The cut-out pressure is also a function of the air flow and the overall system design, such that a different cut-out pressure is required for each model or different size heat pump, which complicates manufacturing and design, moreover increasing the cost.
Existing Industry experience using the pressure switch method has been problematic, especially with the added variability introduced by the mandated use of a specified refrigerant blend (R410A), and its glide characteristics, which cause the saturation pressure for a given refrigerant or air temperature to be variable and unpredictable. In the past, refrigerant R22 was used and had a very predictable saturation temperature for a given refrigerant or suction pressure.
As an alternative to using a fixed pressure set point switch for each model variation, measuring the actual refrigerant pressure may eliminate the use of multiple switches with different set points, since a commonly used microcomputer controller could be programmed to use the appropriate pressure for each heat pump model and design variation. However, such an approach requires a pressure transducer and attendant electronics and wiring, which is also subject to the same damage as the temperature sensor method previously discussed. In addition, the cost of a pressure transducer is relatively high, which is why current heat pumps have not adopted their use.

Monitoring and control system for a heat pump


Devices for separating materials from a host fluid are disclosed. The devices include an acoustic chamber having an inlet and an outlet. An ultrasonic transducer and reflector create a multi-dimensional acoustic standing wave in the acoustic chamber that traps the materials and permits a continuous separation of the materials from the host fluid. The materials and the host fluid can thus be separately collected. Multiple sets of trapping lines are generated by the acoustic standing wave, and the transducer is oriented to minimize cross-sectional area for straight vertical channels between the trapping lines.

When particles are entrained or dispersed in a flowing fluid, aggregation of the particles to form larger clumps is typically due to some attraction or adhesion between the particles or the addition of a flocculating agent that aids in attracting and aggregating the particles. Attractive forces between the particles may be ionic or physical entanglement. Some flocculating agents, such as chitosan, may also be directly attractive to the particles and thus form clumps of particles in the fluid medium.
Typically, after the clumps of particles are formed in the fluid medium, a physical filtration process is utilized to separate the aggregated, agglomerated, flocculated or otherwise process-formed particle clumps. If this is a filter separation process, the physical filter media and the clumps of particles that have been separated from the fluid media are typically discarded, thus creating additional waste and increasing costs. Also, with the use of this physical filtration process, the yield of the filtrate is lessened, as some of it is used to saturate the filtering material. Further, as the filter fills up, filtration capacity is reduced, and using such filters requires periodic stopping to remove the filter and obtain the particles trapped thereon.
An example of this type of filtration is the filtering of a bioreactor to separate the cells and cell debris from the expressed products of the cells, such as monoclonal antibodies and recombinant proteins. Many times, this entails the use of a diatomaceous earth (DE) filter. The DE filters become filled quickly with the cellular waste from the bioreactor during the filtration process. This decreases the flux rate, the ability of the filter to trap materials and allow the fluid to pass through the filter, and increases the pressure differential between the material to be filtered and the post-filter material. As a result, some of the product from the bioreactor (monoclonal antibodies and recombinant proteins) is lost, thus decreasing the yield of the bioreactor. Also, any high pressure differential generated by the filter blockage can generate product damage.
Thus, methods are sought where continuous filtration may be carried out with little or no loss of the expressed monoclonal antibodies and recombinant proteins while separating most or all of the cells and cell debris that are in the bioreactor fluid. Such continuous methods would also be useful in other filtration applications such as the filtering of oil from water, components from blood, tailings from water in tailing ponds, and, generally, particles from a fluid stream and immiscible or emulsified fluids from a fluid stream.
Acoustophoresis is the separation of particles and secondary fluids from a primary or host fluid using high intensity acoustic standing waves, and without the use of membranes or physical size exclusion filters. It has been known that high intensity standing waves of sound can exert forces on particles in a fluid when there is a differential in both density and/or compressibility, otherwise known as the acoustic contrast factor. The pressure profile in a standing wave contains areas of local minimum pressure amplitudes at its nodes and local maxima at its anti-nodes. Depending on the density and compressibility of the particles, they will be trapped at the nodes or anti-nodes of the standing wave. Generally, the higher the frequency of the standing wave, the smaller the particles that can be trapped due the pressure of the standing wave.
At the MEMS scale, the conventional acoustophoresis systems rely on using half or quarter wavelength acoustic chambers, which at frequencies of a few megahertz are typically less than a millimeter in thickness, and operate at very slow flow rates (e.g., μL/min). Such systems are not scalable since they benefit from extremely low Reynolds number, laminar flow operation, and require minimal fluid dynamic optimization.
At the macro-scale, planar acoustic standing waves have been used to accomplish this separation process. However, a single planar wave tends to trap the particles or secondary fluid in a manner such that they can only be separated from the primary fluid by turning off the planar standing wave. This does not allow for continuous operation. Also, the amount of power that is needed to generate the acoustic planar standing wave tends to heat the primary fluid through waste energy.
Conventional acoustophoresis devices have thus had limited efficacy due to several factors including heat generation, use of planar standing waves, limits on fluid flow, and the inability to capture different types of materials. It would therefore be desirable to provide systems and methods of generating optimized particle clusters to improve gravity separation and collection efficiency. Improved acoustophoresis devices using improved fluid dynamics would also be desirable, so the acoustophoresis can be a continuous process.

This patent is subject to a terminal disclaimer.

Methods and apparatus for particle aggregation using acoustic standing waves