A sprocket for engaging a modular belt having a plurality of belt modules with intercalated link ends connected by transverse pivot members to form hinges. The belt modules may have transverse ribs. The sprocket may be driven by a shaft. The sprocket may be an idler sprocket. The sprocket has a central opening for receiving the shaft. The body has a plurality of teeth disposed in pairs along a periphery of the body. The body has a first opening formed between adjacent pairs of teeth and extending toward the center of the sprocket to provide access to the hinge area, when the belt engages with the sprocket, for application of cleaning fluid.

Sprockets for engaging modular belts are usually made from stainless steel or plastic that is machined or molded. In food processing applications, sprockets are a particularly critical area for cleaning. It is important to be able to periodically remove the residual matters totally from the sprockets and on the rear side of the belt, in order to avoid bacteria growth and spoilage of the food processed on the belt. For this purpose sprockets have been designed with large openings to allow cleaning fluid to pass from the side and reach the critical areas to be cleaned. Such sprockets are disclosed in U.S. Pat. No. Re. 38,607. Typically, the sprocket rim and teeth are covering the hinges and hinder the fluid from reaching the hinge area for proper cleaning. Therefore the sprocket disclosed in the patent further provides pairs of teeth in a double row such that the teeth of a pair are offset. This arrangement allows better cleaning access to the rear belt side and easier release of residual matters collected on the rear belt side. But this design only partially solves the problem since the critical hinge areas are still covered by the sprocket rim to a certain extent, when engaged on the sprocket. Therefore good access to these hinges is of primary importance.
U.S. Patent Publication No. 2004/0222072 proposes to solve this problem by using a sprocket with an oblique shape as illustrated in FIGS. 3A, 3B of the publication. With this design, the teeth will laterally change their position on the rear side of the belt and regularly expose another place on the belt for better cleaning access. Although this is improving cleanability, the proposed solution is still having the shortcoming of periodically covering the hinge completely in a certain position. Another typical feature of the disclosed sprocket is the tracking on the belt by additional teeth engaging in the hinge gaps (FIG. 3B, reference no. 74). During sprocket engagement these teeth enter into the hinge gap between two links and thus push residual matter into this gap, making it again difficult to clean. Also, the drive pockets (reference 72 as shown in FIG. 3A of the publication) of the sprocket are engaging closely over the drive faces which are identical with the center cross bar on the rear side of the belt. The drive surfaces totally covered by the enclosing drive pocket are another place where residuals are physically squeezed in between thus making cleaning more difficult.
Another patent proposing a similar solution is U.S. Pat. No. 6,740,172. The patent does not disclose the drive engagement but discloses sectional sprockets used to laterally shift the engagement area periodically. Accordingly, there is a need for an improved sprocket for easy cleaning that avoids the above described shortcomings.


Epidermal growth factor (EGF) produced by an excretory recombinant approach was tested for its efficacy in treating various skin wounds. In a randomized double blind controlled study, local cream samples prepared with human EGF at a final concentration of as low as 0.02% (g/g) in topically suitable carrier were found to have an enhancing effect on the recovery of diabetes foot ulcers. This promotional effect is statistically significant and has resulted in a reduced mean healing time of over 3 weeks when compared with that of control. Both the 0.02% (g/g) and 0.04% (g/g) human EGF supplemented samples in comparison with control showed a trend of stimulatory effect when a recovery of 50% of an ulcer was considered. The EGF samples were also shown to be highly effective in promoting treatments of wounds resulting from bedsores and surgeries.

The ability of EGF to accelerate the metabolism of epithelial cells and its stimulatory effect on the healing of wounds such as skin and gastric ulcers, burns and corneal injuries suggested its potential application to the treatment of diabetes foot ulcer. However, while EGF has been shown to promote healing of corneal and burn wounds at a concentration of 10 μg/ml, EGF failed to promote epithelization in wounds of patients suffering from venous stasis ulcers at the same concentration.
Diabetic foot ulcer is a major complication of diabetes mellitus. People with diabetes mellitus may have a five to fifteen times higher risk of non-traumatic amputation compared with non-diabetes. Between 1996-1998 diabetic patients accounted for 47% of all the lower limb amputations performed in a local Hong Kong hospital. In general, although some patients can be healed with traditional methods, diabetic foot ulcers can be difficult to heal in some patients and frequently lead to amputation if complicated by infection and gangrene. Several new treatment modalities such as an oxygen chamber, platelet derived growth factor (PDGF), and various local dressings have reported various degree of success. The efficacy of such methods may be relatively low, with some of such methods requiring at least 6 months for healing.
Besides diabetic foot ulcer, bedsores and large/deep surgical wounds may be difficult to heal even under medication, probably resulting from the large areas involved. If these wounds are not treated in time, they will deteriorate and subsequently may become incurable and life threatening. Therefore, an effective medical treatment may not only help the patients recover from these skin complications, but may also lead them to a better quality of life, reduced medical care or expense, or even a prolonged life span. Unfortunately, current treatment methods may not be able to provide a relatively effective method to such large-area wounds.

Method and composition for treating skin wounds with epidermal growth factor


The present invention is directed to a method for manufacturing an SOI wafer in which the bonded SOI wafer after the delamination by the ion implantation delamination method is subjected to a rapid thermal oxidation process such that an oxide film is formed on a surface of the SOI layer, the oxide film is removed, the bonded SOI wafer is then subjected to a flattening heat treatment to flatten the surface of the SOI layer, the flattening heat treatment causing migration of silicon atoms of the surface of the SOI layer, and the bonded SOI wafer is then subjected to a sacrificial oxidation process to adjust a film thickness of the SOI layer. The method enables efficient manufacture of a high quality SOI wafer having an SOI layer with sufficiently reduced surface roughness of the SOI layer surface and fewer deep pits in the SOI layer surface.

An ion implantation delamination method (also referred to as the Smart Cut method (registered trademark)), involving bonding a bond wafer into which. ions are implanted and delaminating a portion of the bond wafer, is one of methods that has recently begun to receive attention for manufacturing a bonded SOT wafer. The ion implantation delamination method is an art (See Patent Document 1) to form a bonded wafer having a thin film (an SOI layer) over a base wafer in the following manner: An oxide film is formed on at least one of two wafers, and gas ions, such as hydrogen ions and rare gas ions, are implanted from a front surface of: one of the wafers (the bond wafer) to form a micro bubble layer (an sealed layer) in the interior of the wafer. The surface from which the ions are implanted is then brought into close contact with the other wafer (a base wafer) through the oxide film (an insulator film), and a heat treatment (a delamination heat treatment) is then performed to cleave one of the wafers (the bond wafer) along the micro bubble layer so that the bond wafer is delaminated into a thin film. A heat treatment (a bonding heat treatment) is then performed to strengthen a bond between the wafers. This method makes the cleaved surface (the delamination surface) a good mirror surface, readily manufacturing an SOI wafer having a thin film, particularly an SOI layer, with relatively high thickness uniformity.
However, in case of fabricating a bonded SOI wafer based on the ion, implantation delamination method, a damaged layer formed due to the ion implantation is present on a surface of the bonded wafer after the delamination, and surface roughness is considerable as compared with a mirror surface of a regular product level silicon wafer. Therefore, according to the ion implantation delamination method, it is necessary to remove such a damaged layer and to reduce the surface roughness.
Conventionally, mirror polishing with extremely small polishing stock removal (a stock removal of about 100 nm), referred to as touch polishing, is performed to remove the damaged layer, and others, in the final step after the bonding heat treatment.
However, when polishing including a machining element is performed with respect to the SOI layer, since the stock removal, of the polishing is not uniform, there occurs a problem that film thickness uniformity of the SOI layer achieved by implantation of hydrogen ions and delamination and others is deteriorated.
For the purpose of solving such a problem, a flattening process involving heat treatment at a high temperature has been employed to improve the surface roughness instead of the touch polishing.
For example, Patent Document 2 suggests adding a heat treatment (a rapid heating/rapid cooling heat treatment (an RTA treatment)) in a reducing atmosphere containing hydrogen without polishing a surface of an SOI layer after a delamination heat treatment (or a bonding heat treatment). Further, Patent Document 3suggests forming an oxide film on an SOI layer by a heat treatment in an oxidizing atmosphere after the delamination heat treatment (or the bonding heat treatment), then removing the oxide film, and subsequently adding a heat treatment (the rapid heating/rapid cooling heat treatment (the RTA treatment)) in a reducing atmosphere.
Furthermore, in Patent Document 4, a sacrificial oxidation treatment is performed with respect to a delaminated SOI wafer after a flattening heat treatment in an inert gas, a hydrogen gas, or a mixed gas atmosphere containing these gases, whereby flattening of a delamination surface and avoidance of OSFs can be achieved at the same time.
As described above, since the high-temperature heat treatment is carried out in place of the touch. polishing and the flattening treatment for improving the surface roughness is effected, SOI wafers each having a diameter of 300 mm and excellent film thickness uniformity that a film thickness Range (a value obtained by subtracting a minimum value from a maximum value in a radial direction) of each SOI layer is within 3 nm can be obtained in a high-volume production level by the ion implantation delamination method.
Patent Document 5 discloses a method involving performing the PTA process under a reducing atmosphere containing hydrogen (hereinafter, also referred to as the hydrogen RTA process), disclosed in Patent Document 2, and the sacrificial oxidation process before the flattening heat treatment (a heat treatment under a non-oxidizing atmosphere), disclosed in Patent Document 4, to improve the surface roughness and to suppress the generation of recessed defects.

Method for manufacturing bonded SOI wafer


Systems and methods are provided for determining a depth map and a reflectivity map from a structured light image. The depth map can be determined by capturing the structured light image and then using a triangulation method to determine a depth map based on the dots in the captured structured light image. The reflectivity map can be determined based on the depth map and based on performing additional analysis of the dots in the captured structured light image.

One of the features of machine vision systems can be the ability to recognize a scene and identify features and objects in the scene. Having an understanding of the three-dimensional shape and object reflectivity can greatly aid in the accuracy of machine vision systems. Conventional methods for recognizing a scene can include the use of two separate types of cameras. A first camera can correspond to a structured light camera that can provide a depth map for a scene. A second camera can correspond to a conventional visible light camera that is used to determine a reflectivity map. The reflectivity map can then, for example, be used for texture mapping.

Reflectivity map estimate from dot based structured light systems


For isomerising aromatic compounds containing eight carbon atoms in the presence of hydrogen, a mixture containing compounds with a boiling point of about 80.degree. C. to 135.degree. C. comprising at least one paraffin containing eight carbon atoms, at least one naphthene containing eight carbon atoms, at least benzene and at least toluene is added to the feed before introducing it into the isomerisation reactor R via line 1. These additions are made by a recycle via line 6 or by adding fresh compounds via line 11, or be a combination of fresh and recycled compounds via lines 6 and 11. Hydrogen is added via line 15.

this field has already been the subject of much study, described in particular in U.S. patents U.S. Pat. No. 3,538,173, U.S. Pat. No. 3,553,276, U.S. Pat. No. 4,128,591 and U.S. Pat. No. 4,255,606. In known processes for isomerising aromatic compounds containing eight carbon atoms, a feed which is depleted in para-xylene with respect to the thermodynamic equilibrium of the mixture and which is rich in ethylbenzene (with respect to that same mixture at thermodynamic equilibrium) is introduced into a reactor containing at least one catalyst. That feed enters the reactor where the temperature and pressure conditions are suitable for obtaining a composition of aromatic compounds containing eight carbon atoms at the outlet from that reactor which is as close as possible to the composition of that mixture at thermodynamic equilibrium. Other documents describe processes for isomerising aromatic compounds containing eight carbon atoms in which the feed to be treated is rich in xylenes and depleted in ethylbenzene. The term "depleted in para-xylene" and "rich in ethylbenzene" as used in the present description mean that the para-xylene content is substantially lower and the ethylbenzene content is substantially higher than that of a mixture at thermodynamic equilibrium, under the temperature and pressure conditions under consideration (the mixture being constituted by meta-xylene, ortho-xylene, para-xylene and ethylbenzene).
From that mixture, the para-xylene and often the ortho-xylene are separated out since they are the isomers which are sought as they are of importance, in particular to the synthetic fibre industry. The meta-xylene and possibly the ethylbenzene can then be recycled to the isomerisation reactor inlet so as to increase the production of para-xylene and ortho-xylene.
The reaction for isomerising aromatic compounds containing eight carbon atoms per molecule, however, encounters a number of problems caused by secondary reactions. Thus in addition to the principal isomerisation reaction, hydrogenation reactions are observed: hydrogenation of aromatic compounds to naphthenes, also naphthene ring opening reactions which lead to the formation of paraffins containing at most the same number of carbon atoms per molecule as the naphthenes from which they originate. Those paraffins can undergo cracking reactions which lead to the formation of light paraffins typically containing 3 to 5 carbon atoms per molecule. Aromatic compounds undergo dismutation and transalkylation reactions which, in the case of aromatic compounds containing eight carbon atoms, lead to the production of benzene, toluene, aromatic compounds containing 9 carbon atoms per molecule (for example trimethylbenzenes) and heavier aromatic compounds.
The aggregate of such secondary reactions substantially and deleteriously affects the yields of desired products.
The quantity of secondary products formed (essentially naphthenes, paraffins, benzene, toluene, and aromatic compounds containing 9 or 10 carbon atoms per molecule) depends on the nature of the catalyst and the operating conditions of the isomerisation reactor (temperature, partial pressures of hydrogen and hydrocarbons).
An examination of the prior art documents reveals that recycling certain constituents contained in the effluent from the isomerisation reactor to the inlet of that reactor to minimise the production of secondary products has been envisaged.
As an example, U.S. Pat. No. 3,553,276, U.S. Pat. No. 3,558,173 and U.S. Pat. No. 4,255,606 recommend adding certain produces to the feed to be treated to reduce the loss due to secondary products.
U.S. Pat. No. 3,553,276 describes an apparatus in which toluene is recycled such that the concentration of toluene is kept at double the concentration which would be obtained without that recycling.
U.S. Pat. No. 3,558,173 describes recycling naphthenes containing eight carbon atoms produced by hydrogenation of the corresponding aromatic compounds to the reactor inlet.
In the description of U.S. Pat. No. 4,255,606, 1% to 10% by weight with respect to the total feed of an aliphatic hydrocarbon containing at least 5 carbon atoms per molecule is introduced into the reaction zone with or without adding toluene. This addition can be effected by recycling. The hydrocarbon introduced can also be a precursor of n-pentane.

Process for isomerizing aromatic compounds containing eight carbon atoms comprising a recycle


An optic device includes a multilayer zone forming a redirection section for redirecting and transmitting photons through total internal reflection, each multilayer zone including a high index material having a first real refractive index n1 and a first absorption coefficient β1, a low index material having a second real refractive index n2 and a second absorption coefficient β2, and a grading zone disposed between the high index material and the low index material and including a grading layer having a third real refractive index n3 and a third absorption coefficient β3, wherein n1>n3>n2.

The subject matter disclosed herein generally relates to optics and, in particular, to multilayer optic devices.
Many imaging applications using photon radiation, such as x-ray radiation, require ever-increasing levels of flux. Increasing x-ray flux may be accomplished, for example, by focusing x-ray radiation emitted by an x-ray source. X-rays can be focused by reflecting an incident x-ray beam 10 from an interface 12 using total internal reflection, as shown in FIG. 1. The interface 12 can be formed between a first material medium 14, typically air, and a second material medium 16, typically a solid. In the illustration, the first material medium 14 has n14 as the real part of its refractive index, and the second material medium 16 has n16 as the real part of its refractive index. Total internal reflection can be realized if n16<n14, and if the angle the incident x-ray 10 makes with the interface 12 is smaller than the critical angle θCR specified for total internal reflection.
The critical angle θCR is determined by the refractive indices of the material media 14 and 16 and the energy of the photons in the incident x-ray beam 10. Generally, the refractive index 'n' of matter at x-ray energies can be expressed as n=1−δ+iβ where the term (1−δ) is the real part of the refractive index and the parameter β is related to the absorption coefficient of the corresponding material. At x-ray energies, the real part of the refractive index is very close to unity and is therefore usually expressed in terms of its decrement δ from unity, with δ typically on the order of 10−6 or smaller. At visible wavelengths, the critical angle θCR is largest when the difference between the real part of the refractive indices (n14−n16) or (δ16−δ14) is at a maximum for a given photon energy.
The critical angle θCR for 12.4 keV x-ray radiation incident on an aluminum mirror, for example, is less than 2.7 mrad (approximately 0.15 degree). Thus, to redirect an incident x-ray beam 10 having a beam width 'w' of five millimeters, for example, an uncoated planar aluminum mirror having an interface surface 22 length 'L' of at least 185 cm would be required, as shown in the illustration. The conventional method of selecting materials solely on the basis of the material indices of refraction produces only modest gains in reflectivity.
The current invention recognizes the need for a reflective multilayer configuration that provides for photon reflectivity at increased critical angles at ultraviolet-ray, x-ray, gamma-ray energies, and for higher gamma-ray energies than has heretofore been realized, and which provides for radiation collection over larger source solid angles than has heretofore been achieved.

Optimizing total internal reflection multilayer optics through material selection


A beam-combining laser beam source device comprising laser beam sources; collimator optical systems positioned in optical paths of laser beams radiated from the laser beam sources. Each of the collimator optical systems is constituted of a first lens section and a second lens section. Optical path adjusting elements are positioned in the optical paths of the laser beams in order to radiate the laser beams along optical paths parallel and close to one another. A support member supports the laser beam sources, the collimator optical systems, and the optical path adjusting elements. Each laser beam source and the corresponding first lens section are combined into a laser beam source unit and mounted on the support member, the positions of the laser beam source and the first lens section having been adjusted with respect to each other. The second lens section corresponding to the laser beam source unit is mounted on the support member with the position of the second lens section being adjusted with respect to the position of the laser beam source unit in a plane which is normal to the otpical axis of the laser beam source unit.

1. Field of the Invention
This invention relates to a beam-combining laser beam source device wherein laser beams produced by a plurality of laser beam sources, such as semiconductor lasers which have a low power output, are combined so as to multiply the power of the individual laser beam sources. This invention particularly relates to a beam-combining laser beam source device which is easy to assemble.
2. Description of the Prior Art
Light beam scanning apparatuses wherein a laser beam is deflected by a light deflector in order to scan a surface with the laser beam have heretofore been widely used in, for example, scanning recording apparatuses and scanning read-out apparatuses. In such light beam scanning apparatuses, it is desired that a plurality of laser beams be combined so as to obtain the laser beams having a high intensity and the laser beams having a high intensity be used as scanning light in order to, for example, increase the speed at which the information recorded on a surface to be scanned is recorded or read out. Combination of the laser beams is required particularly when semiconductor lasers are used as the laser beam sources. Specifically, a semiconductor laser has various advantages over a gas laser or the like in that the semiconductor laser is small in size, cheap, and consumes little power, and that the laser beam can be modulated directly when the drive current applied to the semiconductor laser is changed.
However, the output power of the semiconductor laser is low (20 mW to 30 mW), when the semiconductor laser is operated in order to continuously radiate the laser beam. Therefore, the semiconductor laser is not suitable for use in a light beam scanning apparatus wherein scanning light having a high energy is used, (for example, a scanning recording apparatus wherein information is recorded on a recording material which has a low sensitivity, such as a draw material-a metal film, an amorphous film, or the like).
On the other hand, when certain kinds of phosphors are exposed to radiation such as X-rays, .alpha.-rays, .beta.-rays, .gamma.-rays, cathode rays, or ultraviolet rays, they store part of the energy of the radiation. Then, when the phosphor which has been exposed to the radiation is exposed to stimulating rays such as visible light, light is emitted by the phosphor in proportion to the amount of energy stored during exposure to the radiation. A phosphor exhibiting such properties is referred to as a stimulable phosphor. In U.S. Pat. Nos. 4,258,264, 4,276,473, 4,315,318 and 4,387,428, and Japanese Unexamined Pat. Publication No. 56(1981)-11395, it has been proposed to use a stimulable phosphor in a radiation image recording and reproducing system. Specifically, a sheet provided with a layer of the stimulable phosphor (hereinafter referred to as a stimulable phosphor sheet) is first exposed to radiation which has passed through an object such as the human body, in order to store a radiation image of the object thereon, and is then scanned with stimulating rays such as a laser beam causing it to emit light in proportion to the amount of energy stored during exposure to the radiation. The light emitted by the stimulable phosphor sheet upon stimulation thereof is photoelectrically detected and converted into an electric image signal, and the image signal is used to reproduce the radiation image of the object as a visible image on a recording material such as photographic film, a display device such as a cathode ray tube (CRT), or the like.
In the aforesaid radiation image recording and reproducing system, it is desired to use a light beam scanning apparatus, wherein a semiconductor laser is used, in order to scan the stimulable phosphor sheet on which a radiation image has been stored, thereby to read out the radiation image. However, in order to quickly read out the radiation image from the stimulable phosphor sheet, it is necessary to irradiate stimulating rays which have a sufficiently high energy onto the stimulable phosphor sheet. Accordingly, it is not always possible to use a light beam scanning apparatus, wherein a semiconductor laser is used, in order to read out an image in the radiation image recording and reproducing system.
In order to obtain a scanning laser beam having a sufficiently high energy from a semiconductor laser, or the like having low power outputs, a plurality of laser beam sources may be used, and laser beams radiated from the laser beam sources may be combined so as to multiply the power of the individual laser beam sources.
In general, in order to combine the laser beams produced by a plurality of laser beam sources, the laser beams produced by the laser beam sources are collimated respectively by collimator lenses, guided along optical paths parallel and close to one another, and converged to a common spot by a converging lens. Also, in, for example, U.S. patent application No. 310,997, now U.S. Pat. No. 4,924,321, a beam-combining laser beam source device is provided with a plurality of laser beam sources and efficiently combines laser beams. The laser beam source device proposed comprises a plurality of laser beam sources, collimator optical systems positioned in optical paths of laser beams radiated from the laser beam sources, in order to collimate the laser beams, and optical path adjusting elements positioned respectively in the optical paths of the laser beams in order to radiate the laser beams along optical paths parallel and close to one another. The laser beam sources, the collimator optical systems, and the optical path adjusting elements are supported on a single member. With the proposed laser beam source device, when the laser beams radiated from the laser beam source device are caused to impinge upon a converging lens, the laser beams can be converged to a single spot at a desired position. Each of the collimator optical systems is composed of a plurality of lenses.
In order to accurately combine the laser beams in the laser beam source device described above, it is necessary to accurately adjust the positions of the lenses of the collimator optical systems of the laser beam source device with respect to the laser beam sources so that the laser beams radiated from the laser beam source device are collimated and follow predetermined optical paths which are parallel to one another. However, it is very troublesome to adjust the positions of the respective lenses with respect to the support member when the laser beam source device is assembled. Therefore, considerable time and labor are required to assemble the laser beam source device. Also, the positions of the lenses which have been adjusted when the laser beam source device is assembled deviate easily when, for example, the ambient temperature changes. Therefore, the accuracy with which the laser beams are radiated from the laser beam source device fluctuates easily with the passage of time.


Secure rights protection for broadcast mobile content techniques are described in which broadcast content may be securely provided to a mobile device. In one or more embodiments, this is accomplished by requesting and issuing of a content license via a data network based upon a subscriber identity module (SIM) of a mobile device. The license may then be utilized by the mobile device to output content received via a broadcast network.

Along with the growth of computing power available for mobile devices (such as mobile handsets, cellular phones, personal digital assistants, and so forth) there is a corresponding growth in the demand for rich content delivery to such devices. However, providers may be reluctant to provide such content without a suitable mechanism for secure right protection. Traditional secure rights techniques such as Conditional Access (CA) used for Pay-Television and Digital Right Management (OMA DRM) in the wireless industry may not be suitable for certain applications such as when mobile content is provided by broadcast content providers. For instance, wireless carriers may not supply CA cards in mobile devices to maintain perceived control over the devices. Likewise, content providers may be unwilling to adopt OMA DRM or other standards used by wireless providers due to perceived loss of profits and/or control over content delivery to the wireless providers.


The present invention relates to a plum tree and more particularly to a new and distinct variety broadly characterized by a large size, vigorous, hardy, and productive tree. Being self-unfruitful, the present variety requires cross pollination from another plum or interspecific tree that blooms during the mid to late season, such as ‘September YUMMY®’ plum tree (U.S. Plant Pat. No. 14,220). The present variety's moderate blossom density and abundant pollen production entices strong bee activity to facilitate pollination. The fruit matures under the ecological conditions described during mid to late September, with first picking on Sep. 20, 2018. The fruit is uniform, large in size, very dark red in skin color, clingstone in type, mostly yellow in flesh color, firm in texture, juicy, and outstanding in flavor.

In a continuing effort to improve the quality of shipping fruits, we, the inventors, typically hybridize a large number of peach, nectarine, plum, apricot, and cherry seedlings each year. We also grow a lesser number of open pollinated seeds of each of these fruits. The present invention relates to a new and distinct variety of plum tree, which has been denominated varietally as 'Plumcandy XVI'.
During a typical blooming season we isolate as seed parents both individual and groups of different plum and interspecific trees by covering them with screen houses. A hive of bees is placed inside each such house, and bouquets to provide pollen from different plum, apricot, and interspecific hybrid trees are placed in buckets near the trees approximately every two days for the duration of the bloom. During 2007 one such house containing 'Black Majesty' plum tree (U.S. Plant Pat. No. 19,527) was crossed by us in this manner. To pollinate this plum tree, we selected bouquets from several sources of plum trees without keeping specific written details. Upon reaching maturity the fruit from this plum tree was harvested, and the seeds were removed, cracked, stratified and germinated as a group with the label "H21". They were grown as seedlings on their own root in our greenhouse and upon reaching dormancy transplanted to a cultivated area of our experimental orchard located near Le Grand, Calif. in Merced County (San Joaquin Valley). During the summer of 2012 the claimed variety was selected by us as a single plant from the group of seedlings described above. Subsequent to origination of the present variety of plum tree, we asexually reproduced it by budding and grafting in the experimental orchard described above, and such reproduction of plant and fruit characteristics were true to the original tree in all respects. The reproduction of the variety included the use of 'Nemaguard' (unpatented) rootstock upon which the present variety was compatible and true to type.
The present variety is similar to its seed parent, 'Black Majesty' (U.S. Plant Pat. No. 19,527) plum tree, by being a medium to large tree, by being vigorous, by blooming in the mid to late season, by being self-unfruitful, by being productive and by producing fruit that is mostly globose in shape, mostly orange yellow in flesh color, very sweet, juicy, and firm, but is distinguished therefrom by producing fruit that is very dark red instead of black in skin color, that is much larger in size, and that ripens about ten days later.
The present variety is most similar to 'September YUMMY®' (U.S. Plant Pat. No. 14,220) plum tree by having a large and vigorous tree, by being self-unfruitful, by blooming in the mid to late season, by being productive, and by producing fruit that is fairly globose in shape, that is firm in texture, that is mostly red in skin color, that is mostly yellow in flesh color, and that matures in mid to late September, but is distinguished therefrom by producing fruit that is much sweeter in flavor, that is clingstone instead of semi-freestone in type, and that is larger in size.
The present variety is compared and referenced several times in this application to 'September YUMMY®' (U.S. Plant Pat. No. 14,220), including the abstract and claim. It is to be noted that "YUMMY®" is a United States Trademark, Ser. No. 75/618,722, owned by Johnny Appleseed Holdings Limited, Saint Georges Road South RD2, Hastings, New Zealand. Permission to use has been granted to the applicant by contract.


An apparatus for monitoring intraocular pressure including an implantable intraocular lens and at least one sensor apparatus responsive to intraocular pressure being affixed to the lens.

This invention relates to an apparatus and method for in situ monitoring of intraocular pressure.
The human eye contains a flexible transparent structure called the crystalline lens. The function of this structure is to focus light passing through the cornea and pupil onto the photoreceptors which form the retina Although it is termed the crystalline lens, it is composed of living tissue. Cells of the lens are arranged into fibers and it is the precise orientation of groups of these fibers which imparts to the lens its flexibility while maintaining its transparency.
In certain diseases, the arrangement of fibers in the lens becomes disrupted. When this occurs, those regions which are disrupted lose their transparency and become opaque. An opacity is termed a cataract. If a cataract involves a substantial portion of the lens, vision may become impaired. In these cases, it may be necessary to remove the lens surgically and replace it with a lens of synthetic material in order to return sight to the patient.
One of the disease conditions which can lead to cataract formation is an increase in intraocular pressure known as glaucoma. In addition to damaging the lens, an increase in intraocular pressure can damage the neural portions of the eye and lead to permanent blindness. It is possible to treat glaucoma either with drugs or surgery, but to do so successfully, it is necessary to monitor the pressure within the eye.
Typically, an ophthalmologist will measure the pressure within the eye with a tonometer. (See: Textbook of Glaucoma, M. B. Shields, Williams and Wilkins, Pub., 2nd ed, 1987 Chapt. 3, Pg. 54-55) The cornea is topically anesthetized and the tonometer probe is used to flatten cornea. The amount of pressure required to flatten the cornea to a specified amount is a function of the internal pressure in the eye. The difficulty arises that the pressure measurement so obtained is valid only for the instant the measurement was taken. Frequently repeated or continuous measurements are not feasible using this method, and an in situ device is required to monitor intraocular pressure continuously.
Some 20 years ago passive miniature endoradiosondes were developed to measure the Pressure within the eye. (cf. Miniature Passive Pressure Transensor for Implanting in the Eye, C. C. Collins, IEEE Transactions on Bio-medical Engineering, April 1967, p. 74 which is herein incorporated by reference and Intraocular Pressure Transensor Fabrication, C. C. Collins, is herein incorporated by reference) These devices are small enough to be inserted into the eye.
The device is a resonant circuit whose resonance frequency is dependent upon the pressure on the circuit. Therefore, as the pressure within the eye changes, the resonance frequency of the device changes. If the eye and its endoradiosonde are exposed to an electromagnetic field of variable frequency, absorption of energy from the field will occur when the frequency of the field matches the resonance frequency of the endoradiosonde. Therefore, by measuring this frequency, the intraocular pressure of the eye can be determined.
While this technique has been used to measure the intraocular pressure in laboratory animals, it has not been used in humans. The reason for this is that intraocular surgery is a serious procedure which cannot be justified for the implantation of a purely diagnostic device. Further, presence of a free floating sensor in the eye could itself result in further damage to the structures of the eye.
What is required then, is for the sensor to be attached within the eye in such a way that it would not damage the tissues of the eye. Glaucoma patients who require lens removal provide the ideal set of circumstances for the in situ continuous monitoring of intraocular pressure because the device can be placed at or near where the eye's crystalline lens normally would reside.

Intraocular lens pressure monitoring device


The invention relates to a direct conversion receiver for down-converting a received multi-carrier signal comprising at least a first and a second carrier signal at image carrier frequencies to a base band resulting in that the first carrier signal includes an image signal of said second carrier signal. Further, the known direct conversion receiver comprises at least a first and a second digital down-converter unit for separating the first and the second carrier signal from the down-converted multi-carrier signal after digitization. In order to make such receivers less complex and adjust them for fast time varying szenarios it is proposed to provide an error estimating unit to said receivers for calculating a compensating coefficient representing the quota and/or the phase position of the image signal of the second carrier signal being included in the first carrier signal and to remove the undesired image signal in response to said compensating coefficient.

Direct conversion receivers DCR are substantially known in the art. They typically comprise a front end unit for receiving the multi-carrier signal from the antenna and a quadrature demodulator for down-converting said received multi-carrier signal to a base band. Disadvantageously the down-converting process results in that the first carrier signal includes an image signal of said second carrier signal and vice versa.
FIG. 7 illustrates the generation of the image signals I1, I2 during a conventional quadrature demodulation process. In the left part of FIG. 7 there is shown the multi-carrier signal as received via the antenna. It comprises for example a first carrier signal C1 and a second carrier signal C2 which are both free of image signals. These carrier signals are located at a first and a second mirror carrier frequency, respectively. These mirror carrier frequencies are arranged symmetrically around a center frequency fc. In the right-hand part of FIG. 7 there are shown the carrier signals after the converting process as carried out by the quadrature demodulator. It can be seen that the down-converted first carrier signal C1 comprises an image signal 12 of the second carrier signal C2 and that said second carrier signal comprises an image signal I1 of the second carrier signal C2. These image signals are undesired because they make a reconstruction of the desired carrier signal more difficult. The difficulty of reconstruction depends on the ratio of image signal to carrier signal which itself depends on the level of impairments in the realisation of the analog quadrature demodulator (gain, phase & quadrature mismatches) as well as similar defects in the A to D converter chain.
The traditional direct conversion receiver DCR further comprises an analog/digital converter for digitizing the down-converted multi-carrier signal and at least a first and a second down-converter DDC-unit for separating the first and the second carrier signal from the digitized down-converted multi-carrier signal and for translating the separated first and second carrier signal to be centered at a predetermined frequency in the frequency plane. In the right-hand part of FIG. 7 said predetermined frequency is set to 0.
In the prior art several methods are known to reject the undesired image signals. For quadrature modulators such a method is known for example from the article "Automatic Adjustment of Quadrature Modulators" by Faulkner, Mattsson and Yates in "Electronic Letters", vol. 27 no. 3, 31st Jan. 1991. The method of image rejection disclosed in said article can substantially also be applied to quadrature demodulators. However, said method requires quite complex electronic circuits and/or a special signal for calibration. Further, the method of image rejection proposed by said article is made iteratively with the result that it can not be applied to fast-time varying scenarios, such as those encountered for example in multicarrier receivers used according to GSM standard with fast frequency hopping and uplink discontinuous transmission.
Starting from that prior art it is the object of the invention to improve a known direct conversion receiver and a method for receiving a multi-carrier signal, a computer program for carrying out said method as well as an error estimating unit and a compensator stage of such a direct conversion receiver such that image rejection can be carried out less complex and with better accuracy and stability.
This object is solved by the subject-matter of claim 1. More specifically, for the above-described direct conversion receiver this object is solved by providing an error estimating unit for calculating a compensating complex coefficient representing the quota and/or the phase position of the image signal of the second carrier signal being included in the first carrier signal and at least a first compensator stage for removing the undesired image signal from the first carrier signal in response to said compensating coefficient.


An etching liquid contains iodine, an iodine compound and alcohol as solute, and solvent such as water. The etching liquid etches a gold or gold alloy layer formed on the surface of a substrate for a semiconductor device or a liquid crystal device evenly. A plurality of gold or gold alloy columns is formed on the layer. The columns are etched scarcely by the etching liquid. The etching liquid etches the gold or gold alloy layer existing between the columns evenly. The etching liquid may further contain a surfactant.

The present invention relates to an etching liquid for etching gold or gold alloy, particularly an etching liquid which can be used for etching gold or gold alloy deposited on a substrate for a semiconductor device or a liquid crystal device.
(I) Gold and gold alloy are widely used as electrode wiring materials for semiconductor devices and liquid crystal display devices. The electrode wiring materials of gold or gold alloy can be processed finely by a wet etching method using an etching liquid.
Gold and gold alloy are conventionally wet-etched with an etching liquid such as an iodine etching liquid consisting of iodine, a salt of iodide and water; a bromine etching liquid consisting of bromine, a salt of bromide and water; and aqua regia (a mixture of nitric acid and hydrochloric acid). The iodine etching liquid is well reactable to gold and gold alloy, resulting in higher etching speed, and is easy to be handled.
A substrate having bump electrodes on which a semiconductor devices and other devices are installed consists of a base substrate of silicon, a primary metal layer formed on the silicon substrate, and a bump electrode(s) (a projecting electrode(s)) of gold or gold alloy formed on the primary metal layer. The primary metal layer has a base layer of Ti/W, Ti/N, Ti/Pt, etc. and a surface layer of gold or gold alloy formed on the base layer. The surface layer is formed so as to improve adhesion of the bump electrode to the base layer.
The substrate with the bump electrodes is produced as follows: firstly a 0.1 to 0.3 μm thick base layer is formed on the silicon substrate; a 0.1 to 1 μm thick surface layer of gold or gold alloy is formed thereon; a resist layer is plated by lithographic technique on the surface of an area of the surface layer other than that on which the bump electrode is to be formed; after that the bump electrodes are formed by depositing a gold or gold alloy layer having a predetermined thickness by a plating method on the surface of the surface layer on which the bump electrodes are to be formed. The bump electrodes project vertically toward the surface of the substrate.
Secondly, the resist layer is removed, so that the surface of the surface layer which has been covered with the resist layer is exposed to the air. The exposed surface layer is removed by wet etching, and the base layer which had been covered with the surface layer is further removed by wet etching. The above process produces the substrate having the silicone base substrate having thereon the fine bump electrodes which project in the vertical direction toward the surface of the base substrate.
The finished substrate further has the above-described metal base layer and the surface layer of gold or gold alloy between the silicon substrate and the bump electrode.
The surface layer should be equally removed by etching it and the bump electrodes should be etched as little as possible during etching the surface layer in order to form the bump electrodes with high precision in size.
However, the metal surface layer may not be removed fully when the surface layer is produced by a sputtering method according to the above-described conventional etching method. This is because as follows.
A rate of etching a sputtered gold or gold alloy layer is generally lower than that of a plated gold or gold alloy layer, which is probably due to the difference in the crystal structure of the layers. Since the surface layer of sputtered gold or gold alloy is etched at a lower etching rate than the bump electrodes of plated gold or gold alloy, the sputtered surface layer may not be removed completely and remain on the substrate as residues when the etching process is conducted such that the bump electrode is etched as little as possible.
The surface layer is especially apt to remain as residues in a portion between column-shaped bump electrodes which are arranged closed to each other, because the portion is in a valley-like shape and the etching liquid is difficult to be diffused to the bottom of the valley-like portion.
When much time is spent in etching the surface layer, the residues will disappear in the entire surface of the substrate including the valley-shaped portion. However, the etching process for a long time etches the bump electrodes in a large amount so that the bump electrodes lack the precision of the form, because the plated bump electrodes are etched at a higher rate than the sputtered surface layers.
Thus the bump electrode is not easy to be formed with high precision by the conventional etching liquid.
(II) Japanese patent publications S51-20976B, S49-123132A, S63-176483A and H6-333911A disclose an etching liquid for etching a minute electrode wiring pattern for semiconductor devices and liquid crystal display devices formed by using photolithographic technique on a substrate, which is added with an alcohol, surfactant and glycerin in order to weaken the surface tension of the etching liquid, whereby its affinity for both the gold and gold alloy and a photoresist film made of a synthetic resin can be improved, resulting in high etching accuracy.
However, none of the Japanese patent publications discloses an etching liquid added with additives such as an alcohol for etching the gold or gold alloy layer from which the photoresist has been removed.
The etching process of etching the gold or gold alloy layer with a mask of the photoresist differs from an etching process of finely processing the same type of metals on the substrate without using the mask wherein a bump electrode and a primary metal layer are etched. It should be noted that teaching of the etching liquid for the former process has not been applied to that for the latter one and no person skilled in the art would have thought to apply it to the latter.


A receiver comprises a first signal acquisition unit for acquiring a first type of signal block formatted according to a first format, wherein the first type of signal block is interleaved with a second type of signal block formatted according to a second format. The first signal acquisition unit includes one or more parameter estimation units for estimating, from received signals of the first type, one or more signal parameters related to acquisition of the first type of signal block at a respective frequency; memory to store data relating to the or each estimated parameter for the respective frequency; and a controller configured to initialize parameter estimation for subsequent received signals on a revisited frequency based upon data stored for that respective frequency.

1. Field of the Invention
The present invention relates to a signal acquisition apparatus and method and a signal transmission apparatus and method.
2. Description of the Prior Art
A number of Digital Video Broadcasting (DVB) standards have been proposed in recent times, such as DVB-T (terrestrial), DVB-T2 (2nd generation terrestrial), DVB-H (handheld, or mobile), DVB-S2 (satellite) and DVB-C2 (cable).
The different standards address different requirements specific to each kind of transmission/reception, such as terrestrial broadcasts, or broadcasts to handheld devices.
In the case of hand-held devices, both cost and power consumption are significant factors. Consequently a mobile device may only have one tuner available for receiving DVB signals.
In the case of a DVB signal adhering to a mobile standard in which the signal is intermittent and optionally also hops between different frequencies, this introduces the need to acquire the signal anew with each intermittent transmission.
Moreover, some DVB standards use orthogonal frequency division multiplexing, which requires certain information to be available to a receiver before any video data can be obtained from the remaining signal. This information is sometimes provided at the start of a transmitted data frame, for example in DVB-T2.
Consequently if a mobile device cannot acquire the DVB signal quickly enough to obtain this information, the rest of the data frame and the video information it contains remains inaccessible, resulting in reduced image quality.
Some DVB standards attempt to mitigate this problem by encoding this initial information in a robust manner that enables comparatively easy acquisition, but there is clear scope to improve upon this arrangement.

This patent is subject to a terminal disclaimer.


A building connection between a plurality of vertical wall studs made with a plurality of bridging members to brace the wall studs. The bridging members are formed with mounting sections that are received in openings of the wall studs and the mounting sections are bracketed by connecting sections that are used to join the bridging members to each other. The bridging members interface with the web of the wall studs to brace them.

The present invention relates to steel stud building wall systems and especially to apparatuses for stabilizing steel studs to prevent lateral movement and torsion in such systems.
Many buildings are constructed with steel stud wall framing. When a wall is built with any kind of stud, wood or steel, it is generally desirable to fix sequential studs relative to each other against lateral movement and torsion. In steel-stud walls, an elongated steel bridging member is typically inserted horizontally through pre-punched openings in a series of vertical studs to keep them aligned. Steel studs have excellent columnar strength when they are straight, but a significant portion of that strength is lost if the studs are twisted. Because steel studs are particularly vulnerable to torsion, the bridging members, which are typically channel-shaped, having a horizontal web and two vertical side flanges, are made to closely fit the openings in the vertical studs in order to maximize torque resistance. In additional to mechanical torque, metal studs can twist or bend in response to the heat of a fire when the drywall sheathing, which acts as a firebreak, is destroyed. When metal studs twist or bend, they lose their weight-bearing capacity, multiplying the damage caused directly by fire.
While channel-shaped bridging members closely received in the openings can help restrain the studs from twisting, some twisting can still occur and the studs can still shift or bend parallel to the wall. A variety of sheet metal brackets, beginning with a simple right angle, are used with channel-shaped bridging members to prevent this shifting or bending. These brackets can be connected to the studs and the bridging member by means of separate fasteners, interlocking sections on the bracket that engage one of the studs and the bridging member or a combination of fasteners and interlocking forms.
The prior art also includes short bridging members that span only adjacent studs and have ends tailored for fastening to the wall studs and/or to each other through extensions that are inserted through the openings in the wall studs. These bridging members are typically a fixed length. U.S. Pat. No. 6,164,028, granted to John P. Hughes teaches a system of connecting such short bridging members by forming one end of the web of each bridging member to extend through the opening in the stud and to closely receive the web of the stud on both sides, and then to attach the end of another bridging member to that extension.
The prior art also includes elongated bridging members with a series of slots that allow the bridging member to not only be inserted through the openings in the wall studs but also mate with the web of the wall studs on either side of the openings. U.S. Pat. No. 7,168,219, granted to William L. Elderson, teaches such bridging members. U.S. Pat. No. 7,168,219 also teaches a special bridging member that is designed to connect in this manner to just two side-by-side studs.
It is an object of the present invention to provide bridging members that can be installed quickly in a variety of wall environments and that can form a strong connection that resists both lateral and torsional loads.


The invention relates to a silica optical waveguide having a clad layer and a core formed from a silica material and a method of fabricating the same and provides a silica optical waveguide in which the position of a core can be easily recognized and a method of manufacturing the same. The waveguide has a lower clad layer formed from silicate glass on a silica substrate, a core formed from silicate glass on the lower clad layer, and an upper clad layer formed of silicate glass on the lower clad layer so as to embed the core. A difference of height is provided on a top surface of the upper clad layer such that a difference between reflections from the position of the core and from other positions can be recognized on the top surface of the upper clad layer.

1. Field of the Invention
The present invention relates to a silica optical waveguide having a clad layer and a core formed of a silica material and a method of fabricating the same.
2. Description of the Related Art
In general, an optical waveguide has a substrate, a clad layer formed on the substrate and a core (optical waveguide) which is embedded in the clad layer and which has a refractive index slightly higher than that of the clad layer. The clad layer is constituted by a lower clad layer disposed under the core (on the substrate side of the core) and an upper clad layer disposed above the lower clad layer so as to embed the core. Light input to the optical waveguide is confined in the core because of the difference between the refractive indices of the core and the clad layer and is propagated in the core.
In a silica optical waveguide, silicon or silica is used as a material of the substrate thereof, and the core and clad layer are made of silicate glass using a flame hydrolysis deposition (FHD) process, sputtering process, or chemical vapor deposition (CVD) process. Since the refractive index of a silicon substrate is greatly different from the refractive index of the clad layer and the core formed of silicate glass, the position of the core formed on the silicon substrate can be relatively easily recognized when observed in a direction normal to the surface of the substrate. However, when the substrate is formed of a silica material, since the refractive index of the substrate and the refractive index of the clad layer and the core are substantially equal to each other, a problem arises in that the position of the core is difficult to recognize when observed in a direction normal to the surface of the substrate. This results in another problem in that an aligning and connecting operation of input/out fiber becomes difficult to perform properly.
When the material to form the upper clad layer is deposited such that it follows the shape of the core, a step is formed on the surface of the upper clad layer because of the presence of the core. It is therefore possible to recognize the position of the core easily by taking advantage of a difference in reflection between the flat portion and the step portion.
However, when there is a narrow gap region in a waveguide layout of cores on which an upper clad layer is deposited using a CVD process so as to embed the core, the material of the upper clad layer may not be deposited at the gap to leave a void (whisker) in such a region. Methods proposed to avoid this include a method in which an upper clad layer is formed while sputter-etching the same and a method in which an upper clad layer is formed using a material having a low softening temperature and is made to flow by softening it at a high temperature to fill a void (see Patent Document 1).
Patent Document 1: Specification of U.S. Pat. No. 6,044,192
However, when the generation of a void is suppressed by softening an upper clad layer to make it flow, the surface of the upper clad layer is softened and flattened, and a step on the surface becomes gentler, which results in a problem in that it will be difficult to recognize the position of a core.
It is an object of the invention to provide a silica optical waveguide in which the position of a core thereof can be easily recognized and a method of manufacturing the same.

Silica optical waveguide and method of manufacturing the same


Methods and apparatus for recovering data from communication signals apply estimated distribution algorithms. Estimated probability distributions may be constructed to avoid deterministic values. Non-converging data elements may be resolved by performing selective local searches. Embodiments recover data from space-time-frequency block coded signals. A data receiver comprises two or more antennas and signal detectors for detecting signals received at the antennas. A data detection module constructs a fitness function based on the received set of signals and generates additional possible solution sets by an iterative process in which the fitness of possible data sequences are evaluated using the fitness function.

There are many contexts in which it is necessary to retrieve information from signals measured or received at a receiver. The measured or received signals can be corrupted by noise or interfering signals. For example, the receiver in a digital communication system must determine which symbol or which sequence of symbols has been transmitted by a transmitter on the basis of the received signals, which contain noise and/or interference. At the receiver, all of the different symbols or sequences of symbols that could possibly have been transmitted to result in the received signal can be considered to be distinct hypotheses. The receiver (or a detection module at the receiver) must choose the one of these hypotheses that is most likely or that agrees with other performance criteria. A difficulty in such signal detection is that the number of possible signals (the number of hypotheses) is so large that finding the best hypotheses can be computationally burdensome.
Multiple-input-multiple-output (MIMO) communication systems can provide significantly higher channel capacity than comparable single-input-single-output systems having comparable total transmission power and bandwidth. In wireless communications, MIMO systems have the ability to deal with multipath propagation.
The use of Space Time Block Coding (STBC) can realize increased capacity in MIMO systems and thus improve data throughput and spectral efficiency. STBC and its applications are described, for example in:    Chau Yuen et al., Quasi-orthogonal Space-time Block Code vol. 2 of Communications and Signal Processings, Imperial College Press 2007 ISBN: 978-1-86094-868-8;    Vahid Tarokh et al. Space-Time Block Coding for Wireless Communications: Performance Results, IEEE Journal on Selected Areas in Communications, Vol. 17, No. 3, March 1999 p. 451;    Sumeet Sandhu et al., Space-Time Block Codes: A Capacity Perspective, IEEE Communications Letters, Vol. 4, No. 12, December 2000 p. 384;    Hamid Jafarkhani Space-time coding: theory and practice, Cambridge University Press, 2005 ISBN 0521842913, 9780521842914;    Georgios B. Giannakis et al., Space-time coding for broadband wireless communications, Wiley-Interscience, 2006 ISBN 0471214795, 9780471214793;    Helmut Bölcskei, et al., Space-time wireless systems Cambridge University Press, 2006 ISBN 052185105X, 9780521851053;    Ezio Biglieri, et al., MIMO wireless communications, Cambridge University Press, 2007, ISBN 0521873282, 9780521873284;All of these references are hereby incorporated herein by reference.
STBC presents particular signal detecting challenges because, depending on the STBC implementation, the detector may be required to choose code words from a very large code book (which defines possible codes) for each block. Various technologies are available for detecting STBC signals. Existing technologies have various disadvantages.
The Maximum Likelihood (ML) detector provides optimal performance but requires a tremendous amount of processing at the receiver side. ML essentially involves computing a fitness function for all possible code words to find the code word that is most consistent with the received signals. ML can be undesirably costly to implement and/or slow.
A number of sub-optimal STBC detectors have been proposed. These detectors can be less computationally intensive than ML but suffer from various performance drawbacks, especially at low signal to noise ratio (SNR). Such STBC detectors include:
Zero Forcing (ZF);
Minimum Mean Square Error (MMSE),
Genetic Algorithm Detector (GAD),
Vertical Bell Laboratories Layered Space Time (V-BLAST); and
Sphere Decoder (SD).
Zero Forcing, and Minimum Mean Square Error are described, for example in H. Jafarkhani, Space-Time Coding: Theory and Practice, Cambridge University Press, 2005. A Genetic Algorithm Detector (GAD) based STBC-MIMO detector is described in Y. Du et al. Improved Multiuser Detector Employing Genetic Algorithm in a Space-Time Block Coded System, EURASIP J. of Applied Signal Processing, pp. 640-648, 2004. A drawback of GAD is that it requires several parameter values to be fine tuned to achieve good results. Also, in GAD it is difficult to predict the evolution of the population. Good blocks can be broken by the effect of crossover operators. V-BLAST is described for example in Foschini, G. J, Layered space-time architecture for wireless communication in a fading environment when using multiple antennas, Bell Lab. Tech. J., vol. 1, No. 2, pp. 41-59, 1996.
Sphere decoders are described in:    O. Damen, et al., Lattice code decoder for space-time codes, IEEE Comm. Let., vol. 4, no. 5, pp. 161-163, May 2000;    B. Hassibi et al. On the sphere decoding algorithm: Part I, the expected complexity, IEEE Transactions on Signal Processing, vol. 53, no 8, pages 2806-2818, August 2005;    B. Hassibi et al. On the sphere decoding algorithm: Part II, generalizations, second-order statistics and applications to communications", IEEE Transactions on Signal Processing, vol 53, no 8, pages 2819-2834, August 2005; and    Jalden, J. et al., On the Complexity of Sphere Decoding in Digital Communications, IEEE Transactions on Signal Processing, vol. 53, no 4, pages 1474-14844, April 2005.
A need exists for receivers and receiving methods that have low computational complexity and/or better performance than existing receivers. There is a particular need for such receivers capable of operating with acceptable performance at low SNR. There is a particular need for such receivers capable of decoding STBC signals.

EDA-based detection of communication signals


An embodiment of the invention is a client on a local area network that periodically and automatically evaluates its physical connectivity with the local area network, exercises local-network services such as DHCP, and verifies Internet connectivity and function by pinging one or more numerically specified IP addresses and by pinging one or more IP addresses specified by an FQDN (Fully Qualified Domain Name) known to the assigned DNS servers. An embodiment of the invention may include a plurality of client elements monitoring one or more networks. Functionality according to embodiments of the invention can send notices, automatically initiate action, and otherwise assist in, among other things, remote monitoring and administration of networks, and particularly wireless networks.

Wireless local area networks (WLANs) and broadband Internet connections have become commonplace in homes and small businesses. The network setup generally consists of a DSL or Cable modem and a wireless router, as illustrated in FIG. 1, Typical Home/Small Office Network Setup. A surge-protector power strip or uninterruptible power supply (UPS) may be included to reduce the likelihood of faults induced by line-voltage dropouts, brownouts, spikes and other phenomena.
High-speed Internet service is typically brought to the home via a modem, such as DSL (Digital Subscriber Line), DOCSIS (Data Over Cable Service Interface Specification), FTTH, PON, GPON or FiOS (fiber to the home, passive optical network, gigabit passive optical network, and Fiber Optic Service) or a wireless technology such as WiMax, EV-DO or HSDPA. These connection methods are also found in small businesses, which may employ T1 or T3 data service and an Integrated Access Device (IAD) for combined high-speed Internet access and multi-line telephone service. One DSLAM rack, CMTS or multiplexer will typically serve dozens to hundreds of customer-premise modems.
The customer-premise modem has grown in complexity and capability. The broadband modem was originally a simple, single-purpose device: a modulator/demodulator. It included only enough hardware and software to negotiate a connection with the service provider and translate a network-connection format such as ATM (asynchronous transfer mode) or PPP ((point to point protocol) to a computer-connection standard such as Ethernet or less commonly now, USB (universal serial bus). With increases in processing speed, reductions in power consumption, higher density RAM (generally synchronous dynamic random access memory or SDRAM) and ROM (read-only memory, generally nonvolatile "flash" memory), declining costs and growing production volume, features and functions have been added layer by layer to the modem.
A web server with multiple html or JavaScript web pages is frequently included in the modem to facilitate setup. FIG. 2, DSL Modem Web GUI Example shows web pages from the built-in web server of a typical DSL modem. The modem includes a gateway, router, DHCP server and PPPoE login and authentication. An internal clock/calendar synced via NTP (network time protocol) keeps perfect time, and automatic, scheduled checks for firmware updates occur via the Internet. To coordinate these disparate software tasks, a real-time operating system (RTOS) such as a small Linux kernel or Wind River VxWorks is typically employed. These additions have eclipsed the complexity the modem's original, acronymous functions of modulation and demodulation, and yet modem costs are so low that they are given away as incentives in service agreements and regarded as expendable by many service providers. Some cable modems include one or two full-function VoIP or voice-over-DOCSIS analog telephone adapters (ATAs) that provide the traditional BORSCHT analog telephony functions: battery feed, overvoltage protection, ringing, supervision, codec, hybrid & testing.
This broadband modem is attached to a router, typically a wireless router. The router combines the functions of Internet gateway, router, Ethernet switch, and wireless access point. The router's principal function is the distribution and sharing of a single broadband Internet connection, but it also permits sharing of files and hardware resources such as printers, mass storage and media servers. Linksys, the consumer/small-business products arm of Cisco, reports selling upwards of 100,000 wireless routers per month. WiFi access is now provided as a free service in many retail locations, and a modem and router is becoming standard fare in hotels, coffee shops, bars and restaurants.
The router has also grown in complexity: It typically includes a web server for configuration, setup and checking status, a DHCP server, an Ethernet switch, a router with port forwarding, port triggering, MAC filtering, remote management and other features. The router typically serves as the Internet gateway, and handles PPPoE or other login, functions that are frequently duplicated in the attached modem. These multiple software threads or tasks in routers generally run under a small RTOS, such as VxWorks or a kernel of Linux. Complex features that were once included in routers selling for upwards of $1,000 have migrated into $50 units. The wireless router and broadband modem are in some instances combined into a single unit.
Modems and routers have gained speed and have become user friendly as their hardware has grown complex and their software convoluted. Dozens of hardware and software engineers work together to design them. Huge blocks of RAM and ROM are included to support rapidly developed, inefficient code. Software QA managers and large groups of testers balance thoroughness against a relentless pressure to ship. Software bugs and unhandled exceptions are often discovered after a product has begun shipping, and are managed through web downloads. ESD or EMI can derail even the best of hardware and software, sometimes temporarily, sometimes permanently, depending on its intensity. The modems and routers comprising our networks mirror the complexity and reliability of the personal computers they serve: They become partially nonfunctional in ways that are most peculiar, or they become completely inoperative. Either way, they must be rebooted, typically by a Power-On Reset (POR), that is, removing power for 5 seconds or so, then restoring power. Most modems and routers also have a recessed reset button on the back that can accomplish this, but it must be used with care: pressing it for more than five seconds or so will reset the unit, but also restore all settings entered by the user to their factory defaults.
As home and small-office networks have grown in complexity, sophistication and number of users, providing their IT (information technology) support is no longer a minor responsibility. The home and small-office networks that served well with one or two users running email and surfing the web are now routing virtual private networking (VPN) traffic, Voice over Internet Protocol (VoIP) service, streaming media distribution and other applications. Network loading is higher than ever. Once a lone bookend on the shelf, the present-day home or small-office network may be distributed: part may be at home, another at the office, and third, fourth or fifth elements nestled in the air-conditioned racks of service and application providers. These small networks rival the features, functions and complexity of large-enterprise networks of five years ago. These networks comprised of multiple servers, clients, switches and routers have become more essential than the telephone. They are intricate and can be inscrutable. Troubleshooting and clearing a fault in a home or small-office network can be quite time consuming, and may require travel to two or three locations and multiple calls to tech-support lines.
Large, enterprise-level networks generally have hired handlers—trained, 24/7 IT-support professionals working full time to keep networks up and running. They monitor these networks closely, and will often fix a network glitch before its impact is widely felt. They have access to sophisticated administrative, monitoring and troubleshooting software and equipment. For remote reset and restoration, they have Ethernet-controlled, switched rack power distribution units (PDUs): power strips with individually switched, remote-controlled AC outlets. For remote access and remote reset/restore during a network outage, an independent, secondary connection such as dialup may be employed. Many homes and small offices have only as-needed or de facto IT support. Remote access and diagnostics are generally of little value or interest to the home/small-office user and are seldom used. Secondary remote access is impractical and uneconomical in homes and small offices, and is of no value when there is no one outside to use it.

Systems, devices, agents and methods for monitoring and automatic reboot and restoration of computers, local area networks, wireless access points, modems and other hardware


The present invention discloses a method including: providing a substrate; forming recessed regions adjacent to both sides of a gate on the substrate; performing an angled co-implant of a species in two steps with two different energies and two different doses into the recessed regions; forming Silicon-Germanium in the recessed regions; forming source/drain extensions adjacent to both sides of the gate with a dopant; and performing an anneal to activate the dopant.

1. Field of the Invention
The present invention relates to a field of semiconductor integrated circuit (IC) manufacturing, and more specifically, to an apparatus for and a method of forming an ultra-abrupt semiconductor junction profile.
2. Discussion of Related Art
Continual shrinking of a complementary metal-oxide-semiconductor (CMOS) integrated circuit (IC) as exemplified in the well-known Moore's Law requires a formation of an ultra-abrupt semiconductor junction. In a case of a PMOS transistor in the CMOS IC, a source/drain region and its extension must have a very high Boron concentration with an extremely abrupt Boron profile. In the analogous case of an NMOS transistor in the CMOS IC, the source/drain region and its extension must have a very high Arsenic or Phosphorus concentration with an extremely abrupt Arsenic profile.
A p+/n semiconductor junction may be formed by ion implanting a p-type dopant, such as Boron, into an n-type substrate, such as Arsenic-doped Silicon, followed by annealing the substrate at over 1,000 degrees C. The NMOS transistor requires a high anneal temperature to activate the dopant. Unfortunately, the use of such a high temperature results in a significant out-diffusion of the dopant into the substrate in the PMOS transistor.
Thus, a need exists for an apparatus of and a method of forming an ultra-abrupt semiconductor junction profile.

Ultra-abrupt semiconductor junction profile


An electrical power system for a vehicle includes an interface electrically connected to a node and a battery electrically connected to the interface. The interface includes circuit elements that permit current flow between the battery and the node when and only when the voltage of the node is below a threshold.

Vehicles generate power both to propel the vehicle and to supply various electrical loads in the vehicle. Types of power systems include a conventional powertrain including an internal-combustion engine coupled to a transmission that transfers rotational motion to wheels; an electric powertrain including batteries, an electric motor, and a transmission that transfers rotational motion to the wheels; and a hybrid powertrain including elements of the conventional powertrain and the electric powertrain. In vehicles with conventional powertrains, an alternator transforms rotational kinetic energy from the engine into electrical energy for the electrical loads. In all-electric and hybrid-electric vehicles, a DC/DC converter may convert between high-voltage electrical energy for propelling the vehicle and low-voltage energy for the electrical loads.


In analyzing a scene, a projection device may project an image onto surfaces or objects within the scene. The image may include user interface elements as well as structured light patterns for analyzing shapes of the surfaces and objects. The intensity of the reflection of the projected light may be monitored and used to derive an audio signal representing sound that occurs within the scene. The audio signal may be analyzed to detect and recognize user utterances and speech, which may be interpreted as commands.

Characterizing a scene within an environment and interacting with users within that environment may be aided by monitoring sound. Traditional microphones may be used for this purpose. In addition, microphone arrays can be used for directionality, making it possible to emphasize sounds originating from a particular direction. However, traditional techniques such as these are not always able to adequately detect and isolate sound sources.

Optical-based scene detection and audio extraction


A method for producing a semiconductor device is described. In accordance with one example embodiment, the method comprises providing a virtual DUT in the form of a behavior model of the semiconductor device and developing at least one test in a test development environment for an automatic test equipment (ATE). In this case, commands are generated by means of the test development environment, which commands are converted into test signals by means of a software interface, which test signals are fed to the virtual DUT and are processable by the latter. The software interface processes response signals of the virtual DUT and reports information dependent on the response signals back to the test development environment.

In many types of semiconductor devices, tests are necessary at the end of production (End-of-Line tests, EOL tests). Tests of this type have the aim firstly of checking the functionality of the devices (chips) produced and secondly of characterizing and possibly calibrating components contained in the devices. A test station for an EOL test usually comprises an automatic test equipment (ATE) that is able to carry out various tests fully automatically on a wafer (or on the individual chips after singulation). A test scenario comprises for example generating test signals by means of the ATE, feeding the test signals into the device under test (DUT) and detecting and evaluating the associated response signals of the DUT.
In many cases, specific test scenarios have to be developed for a particular batch of semiconductor devices. A developer usually develops suitable test sequences (a test scenario) with the aid of a real ATE and using a prototype of the devices under test (DUTs). Developing test scenarios takes up an appreciable time and can significantly prolong the time period between prototype production and delivery of the series products.

Method for producing a semiconductor device by means of computer-aided development of test scenarios


Exemplary embodiments of the present invention relate to a steering wheel arrangement for motor vehicles having a steering wheel, an airbag module held at the steering wheel and movable in the direction of the axis of the steering wheel, and an electrical contact system arranged between the steering wheel and the airbag module for the actuation of an electrical functional unit, in particular of a vehicle horn by a relative movement between the steering wheel and the air-bag module taking place in the direction of the steering wheel axis, where-in the contact system includes elongate extended electrical conductors which are attached to mutually confronting sides of the steering wheel and of the airbag module or only to the steering wheel or to the airbag module and extend in such a way that conductors spaced apart in the direction of the steering wheel axis cross at least one contact position.

Vehicles are supplied with driver side airbag modules; generally the driver side airbag module is located in the center of the steering wheel. This is also the same location where a horn-activating switch has traditionally been mounted. In addition, other inflatable cushions or airbag modules have been installed in vehicles.
Various mounting mechanisms have been used for securing airbag modules to support structures in a vehicle. Non-limiting examples of such support structures include steering wheels and vehicle instrument panels. In one known mounting mechanism, mounting bolts are passed through openings in the vehicle support structures wherein a threaded portion of the mounting bolts engages a complimentary nut or threaded portion of the airbag module.
Another mechanism for use with a driver side airbag module includes a means for providing a horn activation circuit wherein horn contact members are forced into contact in order to complete a horn activation circuit.
In addition, increasingly higher demands are being made on electrical contacts, in particular horn contacts in steering wheel units for motor vehicles. This applies in particular for so-called floating horn systems in which the airbag module serves to actuate the vehicle horn and for this purpose is fixed to the steering wheel so that it is movable in the direction of the steering wheel axis—i.e. "floatingly". The higher requirements relate in particular to the working life and the electrical operability of the contacts. Contact mechanisms electrically insulated from the steering wheel are increasingly demanded which, in the case of the horn systems which are of principal interest are also known under the catchword "isolated floating horn". In such contact mechanisms, so-called open contacts can in particular to be used such as for example contact rivets or, with higher switching demands, encapsulated microswitches.
In known steering wheel units an enormous degree of cost and complexity is sometimes used for the electrical insulation of the contacts, which considerably increases the manufacturing costs. Therefore, it is desirable to provide an apparatus and method for providing a horn contact mechanism that uses a minimal amount of components and is easy to install and manufacture.

Apparatus and method for providing a horn contact mechanism