Disclosed is a method of joining piping materials which comprises, forming at an end portion of one piping material to be joined a socket composed of a tapered portion which is diametrally enlarged gradually toward the pipe end and a maximum diameter portion extending from the tapered portion with the maximum diameter thereof, then fitting an intermediary inserting member along the internal peripheral surface of the tapered portion in the socket to be in intimate contact therewith and thereafter inserting an end portion of the other piping material thereto, further pressurizing the external peripheral of the socket with two clamping members having a lateral cross-sectional shape with the center position as the deepest portion and tapered planes of clamping action on both sides thereof in the radial direction, thereby effecting plastic deformation of the maximum diameter portion in the diameter shrinking direction. Also disclosed is a joining tool, provided with: two clamping members each having a lateral cross-sectional shape with its center position as the deepest portion, and each having tapered planes of clamping action on both sides thereof at the tip end side and an actuating lever at the base end; a connecting plate supporting the both clamping members with the tapered planes of clamping action opposed to each other freely expandably and shrinkably with rotational axes; and a pushing rod to be pressurized into between the actuating levers of the both clamping members.

This invention relates to a method of joining piping materials, which is suitable for joining two thin-walled stainless steel pipes and for joining a metallic pipe and a metallic pipe coupling.
It is well known to join piping materials such as metallic pipes, pipe couplings, etc. with a technique to thread end portions of the piping materials and screw one piping material into the other. However, such method has not been satisfactory with respect to workability, pressure resistance, airtightness, etc. The present applicant has previously invented a joining method to form a diametrically enlarged portion at an end portion of one piping material, i.e. a tapered portion, to which an annular gasket having a wedge-shaped cross-section is interposed and further an end portion of the other piping material is inserted, followed by application of pressure from the periphery to achieve plastic deformation of the diametrally enlarged portion. This is disclosed in Japanese Provisional Patent Publication No. 130729/1982. Also, according to subsequent studies by the present applicant, it has been found that more effective joining can be done by inserting a C ring as shown in Japanese Unexamined Utility Model Publication No. 75582/1986 together with the annular gasket into the diametrally enlarged portion.
In the method as mentioned above, for plastic deformation of the diametrally enlarged portion, joining the piping materials to each other was effected by approaching in the axis direction a first jaw having a lateral cross-sectional shape with the tapered planes of clamping action and a second jaw having a tapered planes of clamping action in the opposite direction thereto. Therefore, the jaws of the joining tool are required to move complicatedly, thus causing the size of the joining tool to be too large. This is particularly problematic because it is impossible to effect joining of piping materials near walls.


This invention relates to the use of late out-growth endothelial progenitor cells (L-EPCs) as a cellular substrate for the generation of Induced pluripotent stem cells (iPSCs). This may be useful in the production of patient-specific tissues for disease modelling, drug and toxicology screening, tissue replacement and delivery of gene therapy.

Nuclear reprogramming of human skin fibroblasts into induced Pluripotent Stem Cells (iPSCs) has revolutionised the field of regenerative medicine (Takahashi K et al Cell 126, 663-676 (2006); Takahashi K., et al. Cell 131, 861-872 (2007)). However, several obstacles prevent the effective translation of iPSC technology for clinical and industrial applications. These include (i) the low kinetics and efficiency with which fibroblasts can be transformed into iPSCs, hindering their high-throughput generation, (ii) the lack of readily accessible cellular substrates, with non-compromised genomes, that can be isolated from patients (Seki T., et al. (2010) Cell Stem Cell 2; 7(1):11-4; Loh Y. H. et al. (2010) Cell Stem Cell. 2; 7(1):15-9; Staerk J., et al., (2010) Cell Stem Cell. 2; 7(1):20-4) (iii) the relative genomic instability of the iPSCs generated and their genomic differences with their somatic progenitors (Hussein, S. M., et al. Nature. 471(7336):58-62 (2011); Martins-Taylor, K. et al (2011). Nat. Biotechnol. 29, 488-91; Yusa et al (2011) Nature 478, 391-4) and (iv) the inability to easily derive feeder-free iPSCs whilst maintaining their pluripotent potential, which is highly desirable for chemically defined differentiation assays, disease modelling, drug testing and development of therapeutics. In addition, it is desirable that the cellular substrate be clonally derived or capable of clonal expansion prior to reprogramming. This allows the generation of a clonal reference genome, which is essential for subsequent high resolution genetic testing such as array Comparative Genome Hybridisation (aCGH) and genome sequencing comparisons
Several improvements in the efficiency of iPSC generation have been reported since their inception, including the use of progenitor/stem cells as cellular substrates and the inclusion of chemical enhancers in reprogramming protocols, although not all have been demonstrated to work in human samples (Feng B., et al. Cell Stem Cell. 4(4):301-12 (2009)). While compounds such as methylation and deacetylation inhibitors, modified mRNA, siRNAs and vitamin C have been shown to increase the reprogramming efficiency of skin fibroblasts to varying degrees, and may prove useful in translational applications, it would be desirable to manipulate the cellular substrate for reprogramming as little as possible. Moreover, skin cells may carry mutations due to their higher exposure to external environmental conditions (Seki et al 2010; Loh et al 2010; Staerk et al 2010). In addition, for some patients, such as those on anticoagulants or those with conditions that affect wound healing (Shore E. M., et al. Nat. Genet. 38 (5): 525-7 (2006)), skin biopsies are neither practical nor desirable.
Haematopoietic stem cells derived from the bone marrow compartment have been shown to reprogram with higher efficiency than skin fibroblasts in the absence of chemical enhancers, presumably due to a more permissive epigenetic state (Okabe M., et al. Blood. 27; 114(9):1764-7 (2009); 5. Eminli S., et al. Nat. Genet. 41 (9):968-76. (2009)). However obtaining these cells routinely from patients is not trivial, requiring invasive bone marrow aspiration or blood mobilization.
The reprogramming of T-cells and myeloid cells from peripheral blood has also been demonstrated (Seki et al 2010; Loh et al 2010; Staerk et al 2010). These investigators have shown it is possible to circumvent the need for invasive procedures to generate patient specific iPSCs, as blood sampling is routine for almost all patients. However the use of these cells presents at least two major problems: (i) circulating T-cells will possess permanent rearrangements of their genomes following T-cell receptor gene recombination events, thus limiting the potential uses of the iPSC derived from them and (ii) the generation of iPSCs from blood obtained from patients with blood cell related diseases could prove difficult. For example, myeloid derived iPSCs from patients with leukaemia carrying the Philadelphia chromosome rearrangement would not be useful for developing personalised cellular therapies.
Recently, the epigenomic and genomic stability of iPSCs has been called into question (Hussein, S. M., et al. Nature. 471(7336):58-62 (2011); Gore, A., et al. Nature. 471(7336):63-7 (2011); Lister, R., et al. Nature. 471(7336):68-73 (2011)). A variety of iPSCs generated from either fibroblasts or adipose-derived stem cells, via either viral integration or non-integrative methods including episomal or mRNA based expression of the reprogramming factors, were compared at the methylome, chromosome, and exome levels to the parent lines used to generate them, along with hESCs. In summary, all the iPSC lines regardless of the parental cell type or the method used showed independent differences to their parental line, with each other and to hESCs, which were in a relative ground state of pluripotency. This is a major concern that will need to be addressed if iPSCs are to be used in cellular therapies, although with sufficient controls (e.g. repeatability across lines) this need not preclude them from development as models of specific diseases and in drug/toxicology screens, which is an especially important consideration for the pharmaceutical industry.

Cellular substrate for nuclear reprogramming


A microphone with an additional piezoelectric component for energy harvesting is provided, and includes a substrate penetrated through by a cavity, a diaphragm, and a piezoelectric conversion. The diaphragm includes a vibration portion and at least one connecting arm, and two ends of each of the at least one connecting arm are connected to the vibration portion and the substrate, respectively. The piezoelectric conversion component is disposed on one of the at least one connecting arm and configured to convert mechanical energy collected from a displacement of the diaphragm by sound to electrical energy. The piezoelectric conversion component is mounted on the diaphragm, so as to convert the mechanical energy collected from the diaphragm by the sound to the electrical energy, thereby effectively recycling the mechanical energy and avoiding a waste of energy.

With the development of wireless communication, there are increasingly more mobile phone users all over the world. The users' requirements for mobile phones are not only limited to calls, but also can provide a high-quality call effect. In particular, with the development of a mobile multimedia technology, the call quality of the mobile phones is more important. As a voice collecting device of the mobile phones, the design of the microphones of the mobile phones directly affects the call quality.

Microphone with additional piezoelectric component for energy harvesting

AAC Acoustic Technologies (Shenzhen) Co., Ltd.


A projecetile for firing in a gun barrel has a jacket and a load. A bearing leeve is mounted in the jacket and the jacket is of a different material than the bearing sleeve. A journal sleeve is mounted in the bearing sleeve to axially rotate therein. The load is mounted in the journal sleeve to rotate therewith. Thus angular rotation of the load with respect to the gun barrel is reduced.

The present invention relates to projectiles for firing in a gun barrel, and in particular, to projectiles that have rotating parts to reduce projectile spin.
For most small arms weapon systems, that is, weapon systems of caliber 40 mm or less, the gun barrels are rifled to induce a high angular spin to projectiles exiting the muzzle. Projectiles requiring spin for aerodynamic stability are called spin-stabilized projectiles. For other projectile types that do not require a high angular spin (or types that experience degraded performance when spun, e.g., fin stabilized projectiles) a "slip device" is normally mounted on the projectile body to reduce or eliminate spin induced by the rifling. This rotating device usually consists of a rotating band that is free to rotate or slip around the projectile body, thereby permitting only axial projectile motion and not rotational motion during firing. This technique has been used successfully with large caliber ammunition and in some instances with small caliber ammunition.
A serious drawback with the foregoing technique is that the "slip device," which is usually composed of a polymeric type material, is exposed to the environment and is subject to possible damage. Rough handling by soldiers and exposure to machine oils are just a few possible situations that may damage the "slip device." This situation can lead to poor performance or failure of the ammunition if sufficient damage occur to the "slip device."
Accordingly, there is a need for an arrangement to reduce the spinning of a projectile to avoid performance degradation in a way that is relatively immune to damage from handling.

Projectile with bearing sleeve and journal sleeve

The United States of America as represented by the Secreatry of the Army


A method is described for improving the erosion and abrasion wear resistance and hardness of the internal wear surfaces of structures such as nozzles, jets, ducts, chutes, powder handling tubes, valve housings, conveyors, drill bushings and the like. A substantially pure tungsten layer is chemical vapor deposited on the internal wear surface of the body of the structure followed by a chemical vapor deposited top coating comprising a mixture of tungsten and tungsten carbide. The tungsten carbide is selected from the group consisting of W.sub.2 C, W.sub.3 C, and mixtures thereof and is fine grained, non-columnar and has a substantially layered microstructure. Also described are structures formed by the method.

The internal surfaces of numerous structures are typically subjected to excessively high wear. In one example of such structures, i.e., drill bushings, the structures are used to guide drills or reamers on automated machines. Because it is critical to maintain the hole locations within specified tolerances, the structures themselves have very tight tolerances, typically 0.0002" on the inner and outer diameters and 0.0003" on concentricity between the two diameters. They are most commonly employed in the automotive and aerospace industries, but they have much wider applicability. Over 95% of the bushings sold currently are made out of 1144 carbon steel hardened to 500 to 600 kgf/mm.sup.2 by carburizing before finish machining. They undergo abrasive wear by machined metal chips that flow in the space between the drill flutes and the bushings. Thus, they must be frequently replaced which results in costly downtime. The industries have been looking for reliable alternatives that would increase the life of drill bushings while maintaining their dimensional tolerances.
Many techniques have been employed for lengthening the wear life of drill bushings. Such techniques include replacing the 1144 carbon steel bushings with cemented tungsten carbide bushings either in monolithic form or as sleeves slip-fit into steel bodies. Cemented carbide is much harder than 1144 carbon steel, with a Vickers hardness of about 2000 kgf/mm.sup.2, and provides better wear resistance. However, monolithic cemented carbide bushings are very brittle and break when misaligned drill robots hit them with the drills. Although the sleeve-type cemented carbide bushings last about four times as long as carbon steel bushings, they are about four times as expensive.
Surface hardening techniques have been used on bushings made out of either tool steel or 1144 carbon steel to improve their life. For example, case hardening have been commonly applied, but such techniques do not provide sufficient improvement in life to meet the current needs of industry. Hard coatings such as chemical vapor deposited titanium carbide and titanium nitride have also been tried with little success because of the degradation of the mechanical properties and deformation of the parts by high temperatures (.about.900.degree. C.) used during the deposition process.
The thermochemically deposited coatings described in U.S. Pat. No. 4,008,976 issued Feb. 22, 1977 to Robert A. Holzl have also been tried to prolong the life of drills and other cutting tools. Although very thin coatings described in this patent have been attempted on cutting tools and the like, such coatings have not been successful. This is true because such coatings are deposited at very high temperatures, causing degradation of the mechanical properties and deformation of the parts.
U.S. Pat. No. 4,162,345, issued July 24, 1979 to Robert A. Holzl, discloses a method for producing deposits characterized by a structure which is free of columnar grains and instead consists essentially of fine, equiaxial grains. These deposits have unusually high hardness and tensile strength. However, this patent discloses use of temperatures varying from 650.degree. C. to 1100.degree. C. which are high enough to degrade the mechanical properties and deformation (or mechanical distortion) of metallic substrates. The material of Holzl U.S. Pat. No. 4,162,345 is a hard metal alloy, consisting primarily of tungsten and carbon. X-ray diffraction analysis of the U.S. Pat. No. 4,162,345 alloy shows that the deposit is akin to tungsten but with a very finely dispersed carbide, probably in the form of WC.
U.S. Pat. No. 4,427,445, Issued Jan. 24, 1984 to Robert A. Holzl, et al. also discloses a hard fine grained material which can be produced by thermochemical deposition, but at temperatures lower than those described in the U.S. Pat. No. 4,162,345. Thus, where there are large differences in the thermal coefficients of expansion between the substrate material and the coating material, the U.S. Pat. No. 4,427,445 methodology reduces adhesion problems and problems associated with mechanical distortion, metallurgical transformation or stress relief of the substrate. The material of the U.S. Pat. No. 4,427,445 Holzl, et al. patent is a tungsten carbon alloy consisting primarily of a two phase mixture of substantially pure tungsten and an A15 structure.
U.S. Pat. No. 3,368,914, discloses a process for adherently depositing tungsten carbide of substantial thickness on steel and other metal substrates. The process involves first diffusing another metal on the surface of the substrate to relax the thermal expansion coefficient zone of the metal substrate. The carbide coating is then deposited on the diffused surface by chemical vapor deposition. The process claims it is preferable to diffuse the metal forming the carbide into the substrate. In one embodiment of the claimed process, a thin layer of tungsten is deposited on the metal surface using a temperature of 600.degree.-1000.degree. C. After coating tungsten, the temperature is increased to approximately 1000.degree.-1200.degree. C. and held there for a significant period of time to permit diffusion of tungsten into the metal. The diffused surface is then coated with tungsten carbide using WF.sub.6, CO and H.sub.2. In the alternative embodiment, a pack diffusion technique is used for achieving diffusion of tungsten into metal. Temperature ranging from 1000.degree.-1200.degree. C. is used in the pack diffusion step. The diffused metal surface is then coated with tungsten carbide. Since a temperature ranging from 1000.degree.-1200.degree. C. is used during the process, the U.S. Pat. No. 3,368,914 process is not suitable for providing erosion and abrasion wear resistance coatings on various metallic substrates without severely distorting and degrading their mechanical properties.
U.S. Pat. No. 3,389,977, discloses a method of depositing substantially pure tungsten carbide in the form of W.sub.2 C, free from any metal phase. Pure W.sub.2 C is deposited on a substrate by reacting WF.sub.6 and CO. The substrate is heated to a temperature in excess of 400.degree. C. The adherence of W.sub.2 C to steel is improved by first cleaning the surface and then depositing with a thin film of tungsten followed by W.sub.2 C using a temperature ranging from 600.degree.-1000.degree. C. Since initial deposition of tungsten is conducted at or above 600.degree. C., the U.S. Pat. No. 3,389,977 process is not suitable for providing erosion and abrasion wear resistance coating on metallic substrates without severely degrading their mechanical properties and deforming the structure. Additionally pure W.sub.2 C deposited according to the teachings of the U.S. Pat. No. 3,389,977 consists of columnar grains. The U.S. Pat. No. 3,389,977 does not describe a process for depositing W.sub.2 C coating in non-columnar and substantially layered fashion.
U.S. Pat. No. 3,574,672 discloses a process for depositing W.sub.2 C by heating a substrate to a temperature between 400.degree.-1300.degree. C. The process described in this patent is essentially the same as disclosed in U.S. Pat. No. 3,389,977.
U.S. Pat. No. 3,721,577 discloses a process for depositing refractory metal or metal carbides on ferrous and non-ferrous base materials heated to at least 1050.degree. C. The metal carbides are deposited using halide vapors of the metal along with methane and hydrogen. This process is not suitable for applications where structural tolerances are very tight.
U.S. Pat. No. 3,814,625 discloses a process for the formation of tungsten and molybdenum carbide by reacting a mixture of WF.sub.6 or MoF.sub.6. benzene, toluene or xylene and hydrogen. The process is carried out under atmospheric pressure and temperatures ranging from 400.degree.-1000.degree. C. An atomic ratio of W/C in the gaseous mixture varying from 1 to 2 is required to yield W.sub.2 C. The process also suggests that for some substrates such as mild steel, it is advantageous in providing better adhesion to deposit a layer of nickel or cobalt prior to tungsten carbide deposition. The process also claims the formation of a mixture of tungsten and tungsten carbide in the presence of large proportions of free hydrogen. The mixture of W and W.sub.2 C coating deposited according to the teaching of the U.S. Pat. No. 3,814,625 consists of columnar grains. The U.S. Pat. No. 3,814,625 does not disclosed a process for depositing a mixture of W and W.sub.2 C in non-columnar and substantially layered fashion.
British Patent 1,326,769 discloses a method for the formation of tungsten carbide by reacting a mixture of WF.sub.6, benzene. toluene or xylene and hydrogen under atmospheric pressure and temperatures ranging from 400.degree.-1000.degree. C. The process disclosed in this patent is essentially the same as disclosed in U.S. Pat. No. 3,814,625.
British Pat. No. 1,540,718 discloses a process for the formation of W.sub.3 C using a mixture of WF.sub.6, benzene, toluene or xylene and hydrogen under sub-atmospheric pressure and temperatures ranging from 350.degree.-550.degree. C. An atomic ratio of W/C in the gaseous mixture varying from 3-6 is required to yield W.sub.3C. The coating deposited according to the teaching of British Pat. No. 1,540,718 consists of columnar grains. The British Pat. No. 1,540,718 does not teach a process for depositing a non-columnar and substantially layered coating.
Although the methods of the Holzl patents cited above have been useful in producing fine-grained tungsten-carbon alloys containing mixtures of W and WC, and W and A15 structure, and the methods described in other cited patents have been successful in producing columnar W.sub.3 C or W.sub.2 C or mixtures of W and W.sub.2 C, no one has yet disclosed a method for producing extremely hard, fine-grained, non-columnar tungsten-carbon alloys with substantially layered microstructure containing mixtures of tungsten and tungsten carbide in the form of W.sub.2 C or W.sub.3 C or a mixture of W.sub.2 C and W.sub.3 C.
In co-pending U.S. application Ser. No. 07/092,809 now U.S. Pat. No. 4,874,642, issued Oct. 17, 1989, a method and coating are described comprising a non-columnar, fine grained having a substantially layered microstructure deposit of tungsten carbide in the form of W.sub.2 C, W.sub.3 C or mixtures of W.sub.2 C and W.sub.3 C in admixture with tungsten.
In co-pending U.S. application Ser. No. 07/153,738 now U.S. Pat. No. 4,855,188, issued Aug. 8, 1989 such coatings are described in which an intermediate layer of substantially pure tungsten is used between the substrate and the mixture of tungsten and tungsten carbide outer layer to confer additional erosion and abrasion wear resistance characteristics on the composite coating system.
The coatings described in the co-pending applications are generally suitable for depositing on a wide range of substrates having both exterior and interior surfaces of large dimensions and of especially large cross-sectional area. They can be applied on inside surfaces of structures having small cross-sectional area, but they are deposited non-uniformly and generally fail to meet close tolerance requirements discussed earlier. The present invention is an improvement over the co-pending applications wherein wear resistant mixtures of tungsten and tungsten carbide coating systems are applied uniformly at low temperatures over the entire internal surfaces of structures of small dimensions such as a drill bushing or the like without distorting, deforming and degrading their mechanical properties by directing the mixture of reaction gases into contact with the heated internal surface. It has been found that by directing the reaction gas mixture into contact with the heated internal surface and controlling the reaction conditions, the internal surface can be uniformly coated to meet close tolerances. Furthermore, it has been found that any alteration in tolerances can easily be adjusted by lapping or other finishing techniques. It has also been found that such coating systems can confer substantial abrasion and erosion wear characteristics on the wear surfaces of such structures.

Method for producing wear resistant internal surfaces of structures


The present application provides an axially retractable seal system positioned within a seal slot of a stationary component and adjacent to a rotating component. The axially retractable seal system may include a seal with an upper flange positioned within the seal slot and one more bristles extending towards the rotating component and a spring positioned axially between the upper flange of seal and the seal slot such that the seal is forced into a retracted position.

Brush seals are commonly used to eliminate or reduce air leakage through a gap between adjacent parts or components. For example, brush seals may be positioned about rotating components within turbine engines used for power generation and the like. Typically, the brush seals reduce the leakage between regions at different air pressures. As a specific example, a brush seal may be used to reduce air leakage through the gap (or the clearance) between a stationary component such as a stator and a rotating component such as a rotor. A brush seal may be a contact seal with a number of bristles in contact with the rotor surface. The bristles allow for a tight clearance with reduced leakage as compared to most non-contact seals such as labyrinth seals and the like.
Brush seals, however, may undergo substantial wear due to the interference between the bristles and the rotor caused by transient events during, for example, turbine startup or shutdown. During these transient events, the rotary machine may experience considerable temperature gradients, differential growth, vibrations, and other types of dynamic behavior. This wear may accumulate over a number of startup/shutdown cycles so as to reduce the leakage performance of the seal during steady state operations. Wear on the bristles generally correlates with an overall decrease in turbine efficiency and power output.
One response to such transient events has been the use of radially retractable brush seals such as variable clearance positive pressure packing ("VCPPP") seal technology and the like. Generally described, VCPPP seal technology radially retracts the brush seals during startup so as to limit wear. Such radial movement, however, generally requires large segment gaps to accommodate the radius change. These segment gaps can drive additional leakage. The brush seal ring also may have the risk of failing to close properly if contaminants and the like accumulate therein. For example, bristles at the segment ends may fall into the gap when the brush seal ring opens up.
There is thus a desire for an improved retractable seal system that eliminates or reduces the impact of transient events and the like. Such an improved system should provide overall seal system predictability, reliability, and an increased life time with reasonable costs.


A cleaning apparatus 11 includes a cleaning bath 30 for cleaning wafers W, a wafer guide 31 moving up and down to accommodate the wafers W in the cleaning bath 30, a motor 49 for moving the wafer guide 31 up and down, an absolute encoder 33 for detecting the position of the wafer guide 31, a driver 62 and a controller 63. The absolute encoder 33 detects a rotational angle of a rotating shaft 53 of the motor 49 and outputs a detection signal to the driver 62. Based on this detection signal, the driver 62 detects the position of the wafer guide 31 and further outputs the positional information of the wafer guide 31 to the controller 63. Thus, the invention provides a transferring apparatus and a substrate processing apparatus both of which allow of easy detection of the wafer guide and further facilitate their maintenance.

1. Technical Field of the Invention
This invention relates to a transferring apparatus for transferring a substrate, for example, semiconductor wafer, LCD substrate glass, etc. and also relates to a substrate processing apparatus and a substrate processing system both performing the cleaning operation etc. for these substrates.
2. Description of the Related Art
For instance, in the manufacturing process for semiconductor devices, there widely spreads a cleaning system where semiconductor wafers (will be referred xe2x80x9cwafersxe2x80x9d below) are cleaned by a cleaning liquid to remove various contamination adhering to the wafers, for example, particles, organic pollutant, metallic impurities, etc. Especially, there is widely used a cleaning system that includes a wet-type cleaning apparatus to dip wafers into the cleaning liquid for the cleaning process.
In general, the conventional cleaning apparatus is equipped with a cleaning bath fulfilling a cleaning liquid and a wafer guide for dipping the wafers into the cleaning bath. The wafer guide can move up and down between the inside of the cleaning bath and its upside along a vertical guide-Z shaft. After receipt of the wafers on the upside of the cleaning bath, the wafer guide is lowered into the cleaning bath to dip the wafers into the cleaning liquid for cleaning the wafers. The cleaning system equipped with a number of cleaning apparatuses mentioned above includes a loader/unloader part where the wafers are taken out of carriers and the wafers are accommodated into the carriers and a transferring apparatus that transfers the wafers between the loader/unloader part and the respective cleaning apparatuses. With the movement of wafer chucks along the respective cleaning apparatuses in the horizontal direction, the transferring apparatus can move the wafer chucks to the respective cleaning apparatuses. For example, after moving the wafer chucks to the upside of the cleaning bath of one cleaning apparatus, the wafer guide is elevated to carry out the delivery of the wafers.
In the cleaning system as above, it is necessary to detect the position (level) of the wafer guide in order to avoid a conflict between the wafer guide and the wafer chucks, for example. Therefore, the conventional system is provided, at respective levels along the above-mentioned guide-Z shaft, with a plurality of photoelectric sensors which detect the position of the wafer guide.
Accordingly, the conventional system has to establish a number of photoelectric sensors for every cleaning apparatuses, thereby causing the number of photoelectric sensors to be increased. Moreover, the increase in the number of photoelectric sensors is accompanied by frequent exchanges for parts and maintenance. Further, in case of the guide-Z shaft in the cleaning apparatus, every maintenance of the apparatus requires a cover etc. to be removed for completing a worker""s operation inside the apparatus, causing a troublesome operation.
Taking the above situation into consideration, an object of the present invention is to provide a transferring apparatus, a substrate processing apparatus and a substrate processing system, all of which allow of positional detection with ease and further facilitate the maintenance per se.
The first feature of the present invention resides in the provision of a transferring apparatus comprising at least two moving bodies with mutual interference potential, at least one moving body being driven by a motor; and a detection unit for detecting a position of the at least one moving body driven by the motor; wherein the detection unit includes an absolute encoder directly connected to the motor thereby to detect a revolution amount of a rotating shaft of the motor and further output a detection signal, a driver which receives the detection signal outputted from the absolute encoder thereby to output a positional information, and a controller which receives the positional information outputted from the driver thereby to judge the position of the moving body; and the controller controls in a manner that the moving bodies do not interfere with each other.
The second feature of the present invention resides in that the controller inputs an establishment for control program into the driver, while the driver controls the motor on a basis of the inputted establishment.
The third feature of the present invention resides in that the positional information outputted from the driver to the controller is identical to a sensor output which is generated by detecting whether the moving body is positioned in a predetermined area when the rotating shaft is rotating and/or stops rotating.
The fourth feature of the present invention resides in that the moving body is a substrate holder that moves while holding a substrate.
The fifth feature of the present invention resides in the provision of a substrate processing apparatus comprising: a transferring apparatus including: at least two substrate holders with mutual interference potential, at least one substrate holder being driven by a motor; and a detection unit for detecting a position of the at least one substrate holder; wherein the detection unit includes: an absolute encoder directly connected to the motor thereby to detect a revolution amount of a rotating shaft of the motor and further output a detection signal; a driver which receives the detection signal outputted from the absolute encoder thereby to output a positional information; and a controller which receives the positional information outputted from the driver thereby to judge the position of the substrate holder; wherein the controller controls in a manner that the substrate holders do not interfere with each other; and a processing bath for processing a substrate; wherein the substrate holder is movable to accommodate the substrate in the processing bath. The processing bath for processing the substrate is filled up with a processing liquid, for example, a cleaning liquid. The substrate holder can dip the substrate into the processing liquid in the processing bath because the holder is movable while holding the substrate.
The sixth feature of the present invention resides in the provision of a substrate processing apparatus which comprises:
a transferring apparatus including: at least one first substrate holder and at least one second substrate holder with mutual interference potential, the at least one first substrate holder being driven by a motor; and a detection unit for detecting a position of the at least one first substrate holder; wherein the detection unit includes: an absolute encoder directly connected to the motor thereby to detect a revolution amount of a rotating shaft of the motor and further output a detection signal; a driver which receives the detection signal outputted from the absolute encoder thereby to output a positional information; and a controller which receives the positional information outputted from the driver thereby to judge the position of the first substrate holder; wherein the controller controls in a manner that the substrate holders do not interfere with each other; and
a processing bath for processing a substrate;
wherein the first substrate holder is movable to accommodate the substrate in the processing bath, while the second substrate holder transfers the substrate thereby to give and receive the substrate to and from the first substrate holder; and
the second substrate holder is provided with drive means for moving the second substrate holder and the controller controls the drive means and the motor.
The seventh feature of the present invention resides in that the controller controls the drive means and the motor so that the first substrate holder does not collide with the second substrate holder.
The eighth feature of the present invention resides in the provision of an apparatus comprising a plurality of processing baths arranged in a horizontal direction to process a substrate therein; a plurality of first substrate holders provided for the plurality of processing baths respectively, the first substrate holders each moving between a position inside the corresponding processing bath and another position above the corresponding processing bath, in a vertical direction; a plurality of vertical movement units for moving the plurality of first substrate holders in the vertical direction; a second substrate holder which holds the substrate and moves to the horizontal direction above the plurality of processing baths; a horizontal movement unit for moving the second substrate holder in the horizontal direction; and a control unit which drives the vertical movement units and the horizontal movement unit so that the first substrate holders and the second substrate holder do not interfere with each other, thereby to move the first substrate holders and the second substrate holder.
The ninth feature of the present invention resides in that the substrate processing apparatus further comprises a plurality of position sensors which are arranged in respective positions along a horizontal movement of the second substrate holder thereby to detect various horizontal positions of the second substrate holder.
The tenth feature of the present invention resides in the provision of a transferring apparatus comprising a moving body driven by a motor, an absolute encoder directly connected to the motor and a controller for detecting a position of the moving body on a basis of a signal outputted from the absolute encoder. In this way, since the controller detects the position of the moving body on a basis of the signal outputted from the absolute encoder, it is possible to detect the position of the moving body with ease. Note, the substrate is illustrated by a substrate, such as semiconductor wafer, LCD substrate glass, etc. Besides these substrates, the substrate may be formed by any one of CD substrate, printed baseplate, ceramic substrate, etc.
The 11th. feature of the present invention resides in the provision of a transferring apparatus comprising a moving body driven by a motor and detector for detecting a position of the moving body, wherein the detector includes an absolute encoder directly connected to the motor thereby to detect a revolution amount of a rotating shaft of the motor and further output a detection signal, a driver which receives the detection signal outputted from the absolute encoder thereby to output a positional information, and a controller which receives the positional information outputted from the driver thereby to judge the position of the moving body.
Thus, in the detector, the absolute encoder detects the revolution amount of the rotating shaft of the motor thereby to output the detection signal, while e.g. the driver detects the position of the moving body on the ground of the above detection signal. Therefore, the detecting of the position of the moving body can be performed with ease. Again, the driver outputs the positional information to the controller, while the controller confirms whether e.g. the moving body is positioned as commanded. Here, as the absolute encoder outputs e.g. the absolute angle as the revolution amount of the rotating shaft, the driver can detect the position of the moving body on the ground of the output value of the detection signal. Moreover, owing to the adoption of the absolute encoder, even if e.g. a sudden power cut is caused, the position of the moving body could be memorized and therefore, there is no need to redo the initializing of the apparatus.

Transferring apparatus and substrate processing apparatus


A motor control system comprises: a motor comprising motor windings; and electric control units connected with the motor, each of the electric control units comprising an inverter. One of the electric control units comprises: a direct current (DC) bus; first switches, each of the first switches connected with a respective one of the motor windings; second switches, each of the second switches connected with the DC bus and a respective one of the motor windings; a first switch driver generating drive signals to drive the first and second switches; pull up resistors, each of the pull up resistors connected between the DC bus and a respective one of the second switches. The voltage pulled up by the pull up resistors can force the second switches to be turned on to short the motor windings in a state that the first switch driver does not generate the drive signals.

The present disclosure generally relates to a system, apparatus and method for controlling a motor. More specifically, some embodiments of the present disclosure relate to a motor control and method for selectively shorting motor winding such that braking torque can be produced by the motor.
Vehicles require a steering system to control the direction of travel. Previously, mechanical steering systems have been used. Mechanical steering systems typically include a mechanical linkage or a mechanical connection between a steering wheel and vehicle's road wheels. Thus, movement of the steering wheel causes a corresponding movement of the road wheels. Movement of such mechanical systems is often power assisted through the use of hydraulic assists or electric motors.
The mechanical steering systems are being replaced or supplemented by electrically driven steering systems, commonly known as "steer-by-wire" systems. Such steer-by-wire systems to varying extents replace, for example, the mechanical linkage between the steering wheel and the vehicle wheels with an electrically assisted actuator. The steer-by-wire system aims to eliminate physical or mechanical connection between a steering wheel and vehicle wheels by using electrically controlled motors change the direction of the vehicle wheels and to provide feedback to a driver.
It is with respect to these and other general considerations that the following embodiments have been described. Also, although relatively specific problems have been discussed, it should be understood that the embodiments should not be limited to solving the specific problems identified in the Background.

Motor control system and method for selectively shorting motor windings


A communications bus management circuit for a current probe system detects the connection of the current probe system to an instrument and the connection of a current probe to a current probe amplifier of the system. A controller generates a probe enable signal in the presence of the detected connection to the instrument that is coupled to a switching circuit. Switch elements couple the communications bus of the instrument to the communications bus of the current probe amplifier in the presence of the probe enable signal. The controller further generates a current probe present signal in the presence of the detected current probe that is also coupled to the switching element. A further switch element couples the data line of the instrument to ground via a resistive element in the presence of the current probe present signal and floats the data line when the current probe present signal is absent.

The present invention relates generally to host/slave communications and more particularly to an independently powered current probe system coupled to a measurement test instrument via a communications bus.
Current probes measure the flux field generated by the movement of electrons through a conductor. The flux field surrounding the conductor is converted to a linear voltage output that can be displayed and analyzed on a measurement test instrument, such as an oscilloscope. One type of current probe is an AC only probe. AC only probes are configured with either a solid core or a split core and are passive devices that do not require external power. AC/DC current probes generally have a split core configuration and include a Hall Effect device for producing a voltage output in response to a DC generated flux field. AC/DC current probes require a voltage source to provide power for biasing the Hall Effect device and for generating a bucking current through the coils of the current probe. An example of an AC/DC current probe system is the A6312 current probe powered by an AM503B Programmable Current Probe Amplifier and TM500 Power Module manufactured and sold by Tektronix Inc., Beaverton Oreg. The TM500 Power Module provides electrical power to the AM503B Programmable Current Probe Amplifier.
The current probe amplifier has two front panel connectors with one connector for coupling the current probe to the amplifier and the other connector for coupling the signal output of the current probe amplifier to the measurement instrument, such as an oscilloscope. The signal output connector is a BNC type connector that accepts a mating BNC type connector affixed to a coaxial cable. The other end of the coaxial cable has a BNC type connector that mates with a BNC type connector mounted on the front panel of the oscilloscope and coupled to an input signal channel of the oscilloscope. The only signal passing between the current probe amplifier and the oscilloscope is the signal output from the amplifier.
Tektronix, Inc. introduced a probe connection system for voltage measurement probes that provides voltage power and communications between the probe and the oscilloscope through a probe/oscilloscope interface connector. The interface connector includes a BNC type connector for coupling a signal under test from the probe tip to the oscilloscope. Surrounding the conventional BNC type connector on the oscilloscope are connector landing pads for coupling voltage power, offset voltage and serial data communications lines to the probe. The preferred communications is via an I2C type communications bus. The connector landing pads are connected to the probe interface by means of spring-loaded pins on the probe connector. The electrical and mechanical characteristics of the above probe connection system is described in U.S. Pat. No. 4,672,306 to Thong and U.S. Pat. No. 4,708,661 to Morland et al. and are said to exhibit Level 2 capability. U.S. Pat. No. 6,232,764 to Rettig et al. and U.S. Pat. No. 6,385,550 to Jansen et al. describe accessories, such as probes, with internal adjustments controlled by a host. These additional capabilities are implemented through the Level 2 interface and are said to exhibit Level 3 capabilities. The voltage measurement probes exhibiting Level 2 and Level 3 capabilities include a Level 2 or Level 3 coding resistor coupled to the communications bus data line and ground. The data and clock lines generally have pull-up resistors in the measurement instrument. Connecting the voltage probe to the measurement instrument produces a voltage divider network that signals the measurement instrument that a Level 2 probe has been connected. The oscilloscopes responds by reading parameter data from an EEPROM in the probe. Disconnecting the probe from the measurement instrument allows the data line to float high signaling the measurement instrument that a probe is not connected to the measurement instrument. In addition, disconnecting the voltage probe from the instrument removes the voltages for the probe.
The P6248 Differential Probe, manufactured and sold by Tektronix, Inc., provides variable attenuation levels of 1× and 10× and has Level 2 capabilities. The attenuation levels are controlled by a mechanical switch mounted on the compensation box of the probe. When the P6248 is connected to a Level 2 compatible oscilloscope, the data line is pulled down by the Level 2 coding resistor indicating to the oscilloscope that a Level 2 probe has been connected and parameter data stored in the EEPROM needs to be read. Switching the attenuator setting from one setting to the next, causes the coding resistor to be momentarily disconnected from the data line which allows the line to float high. At the same time a different EEPROM is connected to the data line matching the new attenuator setting. When the attenuator switch is completely toggled to the new setting, the coding resistor is reconnected to the data line indicating the EEPROM needs to be read. At no time during the switching of the attenuator settings is the probe disconnected from the oscilloscope and at no time is power removed from the probe.
It is desirable to provide Level 2 type probe communications between an oscilloscope and an AC/DC current probe system. However, problems arise when the current probe system is connected to a Level 2 oscilloscope and either the current probe amplifier or the oscilloscope is powered down. The powered down device will essentially ground the I2C clock and data lines, disrupting I2C communications in the other device. If the oscilloscope is powered on and the current probe amplifier is off, the oscilloscopes I2C lines will be pulled down. This is detrimental to other probes or devices attached to the oscilloscope that may share the I2C lines. Since both the clock and data lines typically have pull-up resistors in the oscilloscope, this can also bring down the voltage levels in the oscilloscope coupled to the current probe amplifier. In the other case, when the current probe amplifier is powered on and the oscilloscope is off, the current probe amplifier will be affected. Both the clock and data lines will appear to be pulled to ground by the oscilloscope, falsely indicating I2C communications. This will lock-up control functions on the front panel of the current probe amplifier. Also, any internal communications between the current probe amplifier internal microcontroller and EEPROM devices in the current probe amplifier will be impossible.
What is needed is a communications bus management circuit for a current probe system that controls the communications bus connectivity between the measurement test instrument and current probe amplifier. The communications bus management circuitry needs to detect the presence of a connected and powered measurement test instrument to the current probe amplifier. The communications bus management circuitry further needs to detect the presence and absence of the current probe connected to the current probe amplifier and provide communications to the measurement test instrument when a current probe is connected or changed on the current probe amplifier.


A safety device for shutting off the flow of gas to a gas-fired appliance in the presence of flammable vapors. The resistance of a variable resistance flammable vapor sensor is monitored by a microprocessor that controls the operation of a gas flow valve. When the measured resistance indicates the presence of a preselected concentration of flammable vapors, the gas flow valve is shut of and the ignition system cannot be energized.

The present invention generally relates to safety devices for mitigating the danger posed by the presence of flammable vapors in proximity to a gas-burning appliance and more particularly pertains to a control system that shuts down the operation of the appliance when the presence of flammable vapors is detected.
A potential hazard inherent in the operation of a gas-burning appliance is that it may cause flammable vapors to ignite that happen to collect in and around the appliance. Ignition may either be caused by the burner or pilot flame or by an electric or electronic ignitor upon being energized. This is especially problematic in for example water heaters or furnaces that are located in garages in which cars are parked where the leakage or spillage of gasoline may occur. Once a combustible mixture reaches the appliance, a fire or explosion may result.
Efforts to address this potential safety hazard have been previously directed to ensuring adequate ventilation in and around the appliance, the elevation of the appliance in an effort to distance it from flammable vapors that are denser than air, and more recently, the isolation or sealing of the burner from its surroundings. Attempts have also previously been made to adapt specialized sensors for the purpose of sounding an alarm in the event the presence of certain flammable vapors is detected. Such systems are however incapable of automatically and positively preventing the ignition of flammable vapors by a gas-fired appliance. Moreover, a gas-fired appliance that relies on an automatic ignition system poses an additional hazard as merely shutting off the supply of gas so as to extinguish the burner would not necessarily preclude ignition by an electronic or electric ignitor should it subsequently become energized.
A flammable vapor control system is needed that is able to mitigate the danger of a gas-burning appliance that employs an automatic ignition system so as positively prevent such appliance from igniting flammable vapors. Such system must be capable of reliably removing all potential ignition sources once a certain concentration of flammable vapors has been detected.
The present invention overcomes shortcomings of previously known approaches for mitigating the dangers associated with a gas-burning appliance. By employing a microprocessor that controls the operation of a gas appliance both in terms of regulating the flow of gas to the appliance as well as controlling the operation of the ignition system, a system is provided that positively precludes the ignition of flammable vapors by the appliance. The microprocessor is responsive to a sensor that is capable of detecting the presence of flammable gases. Once a sufficient concentration of flammable vapor is detected, the flow of gas to the appliance is shut off to extinguish both the burner as well as an associated pilot flame if present, and if the appliance employs a hot surface igniter or spark igniter, the ignition system is de-energized. By causing the microprocessor to respond to a concentration of flammable vapors well below a combustible concentration, a substantial margin of safety is automatically built into the system.
The system may additionally control the operation of an induced draft fan that is activated whenever the gas valve is energized and may additionally be activated during a pre-purge or post-purge cycle to clear the combustion chamber of any flammable vapors
The flammable vapor sensor is connected to the microprocessor through suitable interface circuits. The sensor changes resistance as a function of the presence of flammable vapors wherein the resistance increases along with an increase in the vapor concentration. The microprocessor measures the resistance of the sensor and the response is triggered at a preselected resistance. The system is readily adaptable to a variety of gas-fired appliances including, but not limited to, furnaces and water heater systems.
More particularly, the present invention provides for the interconnection of a flammable vapor sensor to a microprocessor having an internal analog-to-digital converter. The control will monitor the resistance of the sensor, and when it detects the presence of a preselected concentration of flammable vapors, the controller will de-energize both the gas valve and the ignition source. The controller may monitor the sensor resistance at all times or it may alternatively, only at the beginning and during an ignition cycle. Another optional feature includes the ability to lock out at a given vapor in a volatile lockout which would require the removal and subsequent re-application of power. As a further alternative, a non-volatile lockout can be employed which cannot be reset by simply removing and re-applying power. Such feature may be used in combination with the volatile lockout wherein the non-volatile lockout becomes active after resetting the volatile lockout a predetermined number of times. As a further alternative, the system may include a fuse which blows when a predetermined level of flammable vapors is sensed by the sensor.
These and other features and advantages of the present invention will become apparent from the following detailed description of a preferred embodiment which, taken in conjunction with the accompanying drawings, illustrates by way of example the principles of the invention.

The Water Heater Industry Joint Research and Development Consortium


A hybrid vehicle having a brake function includes a hybrid starter and generator (HSG) for starting an engine or generating electricity by the engine. A clutch is disposed on a route for transmitting torque of the engine to a wheel, wherein the clutch selectively transmits the torque. A motor is disposed at a rear side of the clutch on the route, wherein the motor adds torque or generates electricity. An inverter is electrically connected to the HSG and the motor, and a battery is electrically connected to the inverter, wherein the battery stores or outputs electrical energy. A controller releases the clutch, controls the motor to generate the electricity through the torque transmitted from the wheel to the motor, and controls the HSG to consume the electricity generated from the motor, if a braking demand condition is satisfied.

Generally, hybrid vehicles have a clutch, a motor, and a transmission disposed on a power delivery path formed from an internal combustion engine to a wheel; and a hybrid starter and generator (HSG) disposed on the engine to start the engine or to control a rotational speed of the engine.
The clutch performs an engine brake function, such that torque is transmitted from the wheel to the engine through the transmission, the motor, and the clutch, wherein a part of the torque generates electricity through the motor. An accurate braking force cannot be realized because the torque is transmitted through the transmission.
Further, because the motor performs charging and discharging, a regenerative braking torque changes depending on a state of charge (SOC) of a battery, which operates the motor and the HSG, thereby making it harder to realize a secure braking force.
The above information disclosed in this Background section is only for enhancement of understanding of the background of the disclosure, and therefore, it may contain information that does not form the prior art that is already known in this country to a person of ordinary skill in the art.


A backlight unit for a liquid crystal display device includes a cover bottom including a horizontal plane and sides perpendicular to the horizontal plane; guides disposed at inner surfaces of the sides of the cover bottom and each including first, second and third portions, wherein the second portion protrudes from the first portion, and the third portion protrudes from the second portion and has elasticity; a reflection sheet disposed on the first portions; a light guide plate disposed over the reflection sheet and on the second portions; an LED assembly disposed at a first side of the light guide plate; and optical sheets disposed over the light guide plate.

1. Field of the Disclosure
The present disclosure relates to a backlight unit for a liquid crystal display device, and more particularly, to a backlight unit for a liquid crystal display device that prevents a light guide plate from moving and blocks light leakage.
2. Discussion of the Related Art
Liquid crystal display (LCD) devices are widely used as monitors of notebook computers, monitors of personal computers and televisions due to excellent reproduction of moving images and a high contrast ratio. LCD devices use the optical anisotropy and polarization properties of liquid crystal molecules of a liquid crystal layer to produce an image.
An LCD device includes two substrates spaced apart from each other and facing each other as well as a liquid crystal layer interposed between the two substrates. The alignment direction of the liquid crystal molecules is controlled by varying the intensity of an electric field applied to the liquid crystal layer, thus changing the transmittance of light through the liquid crystal layer.
The LCD devices require an additional light source because the LCD devices are not self-luminescent. Therefore, a backlight unit is disposed at a rear side of a liquid crystal (LC) panel and emits light into the LC panel to display images.
Backlight units include cold cathode fluorescent lamps (CCFLs), external electrode fluorescent lamps (EEFLs), and light emitting diodes (LEDs) as a light source. Among these, LEDs have been widely used due to their small sizes, low power consumption, and high reliability.
Backlight units are in general classified as edge type or direct type according to the position of the light source with respect to an LC panel. In edge-type backlight units, a light guide plate is disposed under the LC panel, and one or a pair of lamps are disposed at one side or at each of two sides of the light guide plate. In direct-type backlight units, a plurality of lamps is disposed directly under the LC panel, and light from the lamps is directly provided to the LC panel.
The direct-type backlight units are widely used for LCD devices considering brightness as important because of the resulting limitation on the decrease in thickness of the device that is possible, while the edge-type backlight units are widely used for LCD devices considering a thickness as important such as monitors of notebooks or personal computers.
FIG. 1 is a cross-sectional view of illustrating a liquid crystal display (LCD) device including an edge-type backlight unit having LEDs as a light source according to the related art.
In FIG. 1, the related art LCD device includes a liquid crystal panel 10, an edge-type backlight unit 20, a guide panel 30, a top cover 40 and a cover bottom 50.
The liquid crystal panel 10 displays images and includes first and second substrates 12 and 14 facing and attached to each other with a liquid crystal layer (not shown) interposed therebetween. Polarizers 19a and 19b are attached at rear and front surfaces of the liquid crystal panel 10 and control the polarization of light.
The backlight unit 20 is disposed at a rear side of the liquid crystal panel 10. The backlight unit 20 includes an LED assembly 29, a reflection sheet 25, a light guide plate 23 and a plurality of optical sheets 21. The LED assembly 29 is disposed at an edge of at least one side of the guide panel 30 along a length direction. The LED assembly 29 includes a plurality of LEDs 29a emitting light and a printed circuit board (PCB) 29b on which the LEDs 29a are mounted. The reflection sheet 25 is disposed over the cover bottom 50 and is white-colored or silver-colored. The light guide plate 23 is disposed over the reflection sheet 25. The plurality of optical sheets 21 are disposed over the light guide plate 23.
Edges of the liquid crystal panel 10 and the backlight unit 20 are surrounded by the guide panel 30 having a rectangular frame shape. The top cover 40 covers edges of the front surface of the liquid crystal panel 10, and the cover bottom 50 covers a rear surface of the backlight unit 20. The top cover 40 and the cover bottom 50 are combined with the guide panel 30 to form one united body.
Various optical designs are considered to provide a surface light source from the backlight unit 20 of the LCD device to the liquid crystal panel 10. Among these, maintaining an optical gap A between the light guide plate 23 and the LED assembly 29 is a significant factor.
To do this, a guide groove (not shown) is formed at an edge of the light guide plate 23, and a stopper (not shown) corresponding to the guide groove is formed at the guide panel 30. The optical gap A is maintained by inserting the stopper into the guide groove and preventing the light guide plate 23 from being moved.
However, it is not easy to form the stopper because the guide panel 30 needs to have a thin thickness in realizing an LCD device having a thin profile, light weight and narrow bezel, which have been recently required. In addition, since the guide groove (not shown) at the edge of the light guide plate 23 is close to the active area for displaying an image, light is diffused or scattered by the guide groove (not shown) of the light guide plate 23 when the light emitted from the LEDs 29a progresses in the light guide plate 23 and is refracted and reflected toward the liquid crystal panel 10 to provide a surface light source.
That is, light leakage occurs due to the guide groove of the light guide plate 23, and an area where the guide groove is formed is shown relatively bright as compared with other areas. Thus, problems of lowering qualities of the LCD device such as decreases in brightness and image qualities are caused.

Backlight unit for liquid crystal display device


A sense amplifier enable signal generating circuit includes a dummy bit cell which is connected to a dummy word line and a dummy bit line and discharges the dummy bit line in response to a signal level of the dummy word line. The sense amplifier enable signal generating circuit further comprises a process tracking circuit which adjusts a signal level of the dummy word line in response to a signal level of the dummy bit line to adjust a discharge rate of the dummy bit line, and a sense amplifier control circuit that generates the sense amplifier enable signal responsive to the signal level of the dummy bit line. In further embodiments, the sense amplifier control circuit includes a control circuit that generates the sense amplifier enable signal responsive to an internal clock signal and a control signal. A process adjusting circuit is connected to the dummy bit line and generates the control signal responsive to a signal level on the dummy bit line and the internal clock signal.

This application claims priority from Korean Patent Application No. 2002-24484 filed on May 3, 2002 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference.
The present invention relates to semiconductor memory devices, and more particularly, to sense amplifier control circuits for memory devices.
Power supply voltages for semiconductor memory devices for use in portable systems have been increasingly lowered. However, it generally is not easy to increase the operating speed of semiconductor memory devices in such systems because of the reduced power supply voltage.
As the minimum design rule for manufacturing semiconductors has decreased, characteristics of transistors having minimum dimensions are generally more vulnerable to process variations. Delay times of internal circuits may vary with process variations and, thus, characteristics of the semiconductor devices, particularly operating speed, may deteriorate.
In a typical conventional semiconductor memory device, a bit line sense amplifier is driven by an enable signal that is generated from a sense amplifier enable signal generating circuit. The sense amplifier enable signal generating circuit typically receives an external clock signal applied from an external source and generates a sense amplifier enable signal. To perform a sensing operation after an address is applied from an external source, data stored in a memory cell (a bit cell) drives a pair of bit lines up to a predetermined level. The sense amplifier enable signal is activated. The sense amplifier enable signal generating circuit typically is configured so as to receive the external clock signal and then activate the sense amplifier enable signal after a delay of a predetermined period of time.
However, if the sense amplifier enable signal is prematurely activated (for example, when data is not fully developed on the bit lines) or delayed because of process variations, the sensing operation of the sense amplifier may be unstable or sensing speed may be reduced. Consequently, a pulse width of a word line signal for driving a pass transistor of a memory cell may have to be increased. However, this may increase power consumption. Thus, to prevent these problems from appearing in the semiconductor memory device, it is desirable that an instant when the sense amplifier enable signal is activated substantially coincides with the instant when data is fully developed to the bit lines up to a predetermined level over a range of process variations.
Conventional sense amplifier enable signal generating circuits often use an inverter delay chain or a replica technique. In a sense amplifier enable signal generating circuit that uses an inverter delay chain, a delay characteristic of the inverter delay chain and delay characteristics of a bit cell and a bit line may considerably vary with process variations. Thus, sense amplifier enable signal generating circuits that use a replica method are typically preferred.
FIG. 1 is a block diagram of a semiconductor memory device having a conventional sense amplifier enable signal generating circuit that uses a replica technique. Referring to FIG. 1, a sense amplifier enable signal generating circuit 100 using a replica technique includes a dummy discharge circuit 11, a dummy bit cell block 12, and a control circuit 13. A path for sensing data includes a part of a decoder 18, a word line WL, and a normal bit cell block 14. A path for generating a sense amplifier enable signal SAEN includes a part of the decoder 18, the dummy discharge circuit 11, a dummy bit cell block 12, and the control circuit 13.
The dummy bit cell block 12 is included in the same memory array block 200 as the bit cell block 14 and is designed so that the delay time thereof is substantially equal to the delay time of the normal bit cell block 14. The dummy bit cell block 12 includes the word line WL and a dummy bit cell 15 that is connected to a pair of dummy bit lines DBL and DBLB, and the normal bit cell block 14 includes the word line WL and a normal bit cell 16 that is connected to a pair of bit lines BL and BLB. The word line WL is connected to an output node of the decoder 18.
The pair of dummy bit lines DBL and DBLB are connected to the dummy discharge circuit 11, which discharges the dummy bit lines. The pair of dummy bit lines DBL and DBLB are connected to the control circuit 13, which generates an internal clock signal ICK from an external clock signal applied from an external source and which generates a sense amplifier enable signal SAEN in response to levels of the pair of dummy bit lines DBL and DBLB. The pair of bit lines BL and BLB are connected to a sense amplifier 17, which senses and amplifies a voltage between the pair of bit lines BL and BLB in response to the sense amplifier enable signal SAEN.
In more detail, after an address ADD is applied from an external source, the decoder 18 decodes the address ADD to activate the word line WL. As a result, data stored in the bit cell 16 is developed on the pair of bit lines BL and BLB. In response to a signal DO output from the decoder 18 and the internal clock signal ICK, the sense amplifier enable signal generating circuit 100 activates the sense amplifier enable signal SAEN after a predetermined delay time through the dummy discharge circuit 11, the dummy bit cell block 12, and the control circuit 13. The sense amplifier 17 senses and amplifies a voltage between the pair of bit lines BL and BLB in response to the activation of the sense amplifier enable signal SAEN after data stored in the bit cell 16 is developed on the pair of bit lines BL and BLB up to a predetermined level.
In order that an instant when the sense amplifier enable signal SAEN is activated substantially coincides with an instant when data is developed on the pair of bit lines BL and BLB up to a predetermined level, the replica-type sense amplifier enable signal generating circuit 100 uses the dummy bit cell block 12, which is designed so as to have substantially the same delay time as the delay time of the normal bit cell block 14. Delay factors of the dummy bit cell 15 and the pair of dummy bit lines DBL and DBLB in the dummy bit cell block 12 are substantially identical to delay factors of the bit cell 16 and the pair of bit lines DBL and DBLB in the normal bit cell block 14. Thus, the replica-type sense amplifier enable signal generating circuit 100 can be more stable in the presence of process variations than a sense amplifier enable signal generating circuit using an inverter delay chain.
However, as the minimum design rule in manufacturing semiconductors has decreased, characteristics of transistors having minimum dimensions may seriously vary according to process variation. Thus, a delay characteristic of the path for sensing data may be different from a delay characteristic of the path for generating the sense amplifier enable signal SAEN. In other words, due to the process variation, delay characteristics of the dummy bit cell block 12 and the dummy discharge circuit 11 may be different from a delay characteristic of the normal bit cell block 14. In this case, the sense amplifier enable signal SAEN may be prematurely activated, i.e., when data is not fully developed to the pair of bit lines BL and BLB, or a point of time that the sense amplifier enable signal SAEN is activated may be too delayed. As a result, the sensing operation of the sense amplifier 17 may not stably be performed or the sensing speed, i.e., the operating speed, may become slower.
If the delay characteristic of the path for sensing the data differs about 20% from the delay characteristic of the path for generating the sense amplifier enable signal SAEN, a pulse width of a signal of a word line WL for driving a pass transistor in the bit cell 16 typically may have to be increased to secure stability. However, this can lead to increased power consumption.
According to some embodiments of the present invention, a sense amplifier enable signal generating circuit for generating a sense amplifier enable signal that enables a bit line sense amplifier is provided. The sense amplifier enable signal generating circuit includes a dummy bit cell which is connected to a dummy word line and a dummy bit line and discharges the dummy bit line in response to a signal level of the dummy word line. The sense amplifier enable signal generating circuit further comprises a process tracking circuit which adjusts a signal level of the dummy word line in response to a signal level of the dummy bit line to adjust a discharge rate of the dummy bit line, and a sense amplifier control circuit that generates the sense amplifier enable signal responsive to the signal level of the dummy bit line.
In further embodiments, the sense amplifier control circuit includes a control circuit that generates the sense amplifier enable signal responsive to an internal clock signal and a control signal. A process adjusting circuit is connected to the dummy bit line and generates the control signal responsive to a signal level on the dummy bit line and the internal clock signal.
According to further embodiments of the present invention, a semiconductor memory device includes a bit cell which is connected to a word line and a pair of bit lines and which data is input to and output from through the pair of bit lines in response to a signal on the word line and a bit line sense amplifier which senses and amplifies data of the pair of bit lines in response to a sense amplifier enable signal. The memory device further includes a dummy bit cell which is connected to a dummy word line and a dummy bit line and discharges the dummy bit line in response to a signal on the dummy word line and a process tracking circuit which adjusts a signal level of the dummy word line in response to a signal level of the dummy bit line and a decoder output signal to adjust a discharge rate the dummy bit line. A control circuit generates the sense amplifier enable signal responsive to an internal clock signal and a control signal, and a process adjusting circuit is connected to the dummy bit line and generates the control signal responsive to a signal level on the dummy bit line and the internal clock signal. An address decoder decodes an address applied from an external source to activate the word line and the decoder output signal.
In further embodiments of the present invention, a sense amplifier enable signal generating circuit includes a delay circuit that is connected to a dummy word line and that produces a delayed output signal on a dummy bit line responsive to an input signal on the dummy word line. A process tracking circuit adjusts a level of the input signal in response an internal clock signal and a signal level of the output signal produced by the delay circuit to adjust a discharge rate of the output signal produced by the delay circuit. A sense amplifier control circuit produces a sense amplifier enable signal responsive to the signal level of the output signal produced by the delay circuit. The sense amplifier control circuit may further include a control circuit that generates the sense amplifier enable signal responsive to a control signal, and a process adjusting circuit that is connected to the dummy bit line and that generates the control signal responsive to a level of the output signal on the dummy bit line.

Sense amplifier enable signal generating circuits having process tracking capability and semiconductor memory devices including the same


An apparatus comprises multiple power supply switches each including a respective power Metal Oxide Semiconductor Field Effect Transistor (MOSFET) to receive a respective one of multiple power voltages ranked incrementally from a lowest priority to a highest priority, and multiple control modules each coupled to, and configured to control, a respective one of the power MOSFETs, each control module to receive all of the power voltages having higher priorities than the power voltage received at the respective power MOSFET controlled by that control module, each control module to control the respective power MOSFET so as to turn off the respective power MOSFET if any of the higher priority power voltages are present, or permit the respective power MOSFET to turn on responsive to the respective power voltage if all of the higher priority power voltages are absent.

Many systems include multiple power supplies, such as switches, wireless access points, laptops, cell phones and other battery operated devices. Existing methods for managing multiple power supplies are often inefficient or costly. For battery operated devices or devices with a fixed power range, like Power over Ethernet (PoE), efficiency is critical to supporting the available power budget, improving customer experience and safely meeting surface temperature requirements.

Efficiently managing multiple power supplies


The invention provides a stirring apparatus for stirring microorganisms such as, an alga in a culturing medium. The stirring apparatus includes one or more supporting structures. The stirring apparatus further includes a plurality of paddle units operatively connected to the one or more supporting structures. The plurality of paddle units are submerged in the culturing medium holding the microorganisms. Further, the plurality of paddle units are configured to rotate for stirring the microorganisms in the culturing medium. In response to the rotation of the plurality of paddle units, the stirring apparatus propels in the culturing medium.

Numerous methods and systems exist for cultivating microorganisms, for example, an alga. These methods include closed systems for cultivating the microorganisms. A typical closed system may be a tube-based system for holding the microorganisms along with a culturing medium. However, installation cost as well as operation cost of such tube-based systems are usually high. Further, these microorganisms may require continuous supply of sunlight for performing photosynthesis and nutrients for their growth. However, in case of tube-based systems, the sunlight may not be properly directed towards these microorganisms. Moreover, cultivation of the microorganisms involves stirring of microorganisms which is difficult to perform in such tube-based systems. Further, if the microorganisms are cultivated in a flat container such as, a flat plate bioreactor unit, efficient distribution of nutrients and sunlight to all the microorganisms present in the flat container still remains a challenge. For example, in a flat container, a large amount of microorganisms present in a bottom layer of the container may not receive enough amounts of sunlight and nutrients for their growth due to the presence of microorganisms in the upper layer of the container. Thus, the microorganisms may need to be continuously stirred for efficient distribution of nutrients and sunlight, which is manually cumbersome.
Therefore, there is a need for an apparatus for efficiently stirring the microorganisms in a culturing medium for their growth.
Skilled artisans will appreciate that elements in the figures are illustrated for simplicity and clarity and have not necessarily been drawn to scale. For example, the dimensions of some of the elements in the figures may be exaggerated relative to other elements to help to improve understanding of embodiments of the invention.

Stirring apparatus for stirring microorganisms in a culturing medium

King Abdulaziz City for Science and Technology (KACST)


A flat-screen display system is providing having a transmitting unit that includes a power supply, a display signal generating unit, a transmitter for transmission of the display signal and for transmission of the supplied power; and a receiving unit that includes a receiver for receiving the transmitted display signal and wirelessly coupling to the power supplied from the transmitter for power supply of the receiving unit, a control unit that decodes the received display signal, and a display that displays the decoded display signal.

1. Field of the Invention
This invention relates generally to electronic systems having a display and, more particularly, to flat-screen display systems. In various implementations, the invention may find application in display systems for use in vehicles.
2. Related Art
In recent years, electronic systems have become more and more sophisticated. The systems often include a display that conveys information to the user as well as allowing the user to control various functions of the electronic system. Flat-screen displays are now commonly used in many applications such as in television or computer systems to replace conventional cathode ray tubes. The flat screen display systems are generally based upon liquid crystal display technology or plasma display technology, although there are other display technologies as well. The use of flat screen displays in various electronic systems for vehicles has also increased in recent years. For example, many vehicles use navigation systems that guide the user from the user's starting position to a predetermined destination along a route selected by the system. Such navigation systems often provide information as to the proposed route of travel selected by the system as well as information about the route in the display.
One aspect that must be addressed in the design of electronic display systems is the type of communication that is to be used between components of the systems. A type of wireless communication is illustrated in transponder technology. Transponders include a transmitter and a responder, which function to receive and transmit radio signals over a prescribed frequency range. After receiving the signal, a transponder will broadcast a responsive signal at a different frequency. Transponders are used in satellite communications and they are also used for locating or identifying goods. The development of the transponder technology has been supported in particular by the radio frequency identification technology (RFID) used in a broad range of applications. The RFID technology in principle is similar to a coded identification. With RFID, electromagnetic or electrostatic coupling in the radio frequency portion of the electromagnetic spectrum is used to transmit signals. Accordingly, an RFID system includes an antenna and a transceiver that reads the radio frequency and transfers the information to a reading device, and a transponder or tag that in most cases is an integrated circuit containing the RF circuitry and the information to be transmitted.
With respect to flat-screen displays, liquid crystal displays may be made up of any number of color or monochrome pixels arrayed in front of a light source or reflector. Each pixel includes a column of liquid crystal molecules suspended between transparent electrodes and two polarizing filters, the axes of polarity of which are perpendicular to each other. By applying small electrical charges to transparent electrodes over each pixel, the molecules are twisted by electrostatic forces and this produces a twist of the light passing through the molecules to allow varying amounts of light to pass through the polarizing filters. The supply of electrical charges to the electrodes may be controlled by a printed circuit board that is electrically connected to the liquid crystal display. Electrical connection of the display to the printed circuit board may be achieved with an array of metal pins, heat seal connectors or conductive rubber connectors.
Providing a reliable connection between the display and the printed circuit board can, however, present certain problems. In some instances, mechanical or electrical contact may not be achieved during manufacturing. It is also possible that the electrical contact could be physically damaged, or that dust could interfere with the electrical connection. Furthermore, the electrical contacts of the display have to be aligned with a high accuracy to properly contact the receiving contacts of the printed circuit board to which the liquid crystal display is connected. As a consequence, the tolerances in the manufacturing process for the contact elements have to be low and this can result in the requirement for expensive manufacturing techniques.
Thus, a need exists to provide a display system in which a reliable connection between the display and the printed circuit board can be achieved in a manner allowing easy installation of the display and low manufacturing cost for the display system.


The present invention provides compositions suitable for topical administration to a mammalian subject including sodium hyaluronate and a pharmaceutically acceptable excipient. The present invention also provides methods for making and using the same.

Typically, for the treatment of skin diseases such as xerosis senilis and miliaria, adrenocortical steroid-based agents, urea-based ointments, heparinoids from animal organs, or vaselin-based ointments such as azulene ointments, have been used. However, most of these agents have undesirable side effects. For example, the adrenocortical steroid-based agents are likely to cause various side effects. The urea-based ointments sometimes cause irritation or smarting. The heparinoids from animal organs sometimes cause a contact dermatitis as a side effect. On the other hand, the vaselin-based ointments such as azulene ointments present unpleasant sticky feeling. In addition, dusts are likely to deposit on vaselin-based ointments. Thus, there have been no satisfying treatment agents for skin diseases.

This patent is subject to a terminal disclaimer.


A novel process the preparation of pentaalkylchromenes of the general formula: ##STR1## wherein R denotes a lower alkyl group having 1 to 4 C atoms and R.sub.1 denotes a phenyl group which is unsubstituted or substituted by a lower alkyl group having 1 to 4 C atoms, by halogen or by a nitro group, or an alkanoyl group having 1 to 4 C atoms. In the process, a trialkylhydroquinone is reacted with a halogenated butenol to give a substituted tetraalkyhydroquinone, which is oxidized. Then the halogen atom is substituted with a suitable nucleophile and the compound is finally cyclized to give the final product. The pentaalkylchromenes are suitable intermediates for the preparation of hypolipidaemic pharmaceuticals.

1. Field Of The Invention
The invention relates to a novel process for the preparation of pentaalkylchromenes of the general formula: ##STR2## wherein R denotes a lower alkyl group having 1 to 4 C atoms and R.sub.1 denotes a phenyl group which is unsubstituted or substituted by a lower alkyl group having 1 to 4 C atoms, by halogen or by a nitro group or an alkanoyl group having 1 to 4 C atoms, and to novel intermediates occurring in the process.
Pentaalkylchromenes, in particular tetramethylchromenes, are useful intermediates for the preparation of, for example, hypolipidaemic pharmaceuticals [J. Med. Chem., 32, (1989), 428].
2. Background Art
European Published Patent Specification No. 139,421 discloses the preparation of corresponding pentaalkylchromenes by condensation of an acetylhydroquinone with alkoxy- or aryloxyacetone derivatives and by reduction of the resultant chromanone. This synthesis has the disadvantage that even the starting materials are accessible with difficulty, and additionally further steps are necessary after the condensation in order to obtain the desired pentaalkylchromene.

Process for the preparation of substituted pentaalkylchromenes


A wire containment structure includes a container and a bag. The container includes a sidewall that at least partially defines a container receptacle. The sidewall defines a first handle aperture and a second handle aperture. The bag is configured to entirely support a wire stack. The bag is disposed at least partially within the container receptacle and comprises a body, a first handle, and a second handle. The body defines a wire receptacle. The first handle is coupled with the body and is routed through the first handle aperture. The second handle is coupled with the body and is routed through the second handle aperture.

A wire stack can be provided within a wire containment structure. The wire containment structure includes handles that facilitate lifting and/or transporting of the wire stack with the wire containment structure. In one conventional arrangement, a wire containment structure includes, a rigid outer container, such as a cardboard box. A polyethylene bag is provided within the rigid outer container and the wire stack is provided within the bag. The bag is closed over the wire stack to inhibit moisture from affecting the wire stack. A lifting strap is routed underneath the bag such that it is interposed between the rigid outer container and the bag. In this configuration, the lifting strap is not integrally formed together with the bag, but rather is provided as a separate component. The lifting strap includes two handles that are routed through opposite sidewalls of the rigid outer container to facilitate lifting of the wire containment structure and the wire stack with the handles. However, since the lifting strap is separate from the bag, the bag is prone to deterioration due to chafing from the strap. In addition, use of a lifting strap separate from the bag might require the wire containment structure to comply with certain safety and/or transportation standards which can be time consuming and costly to implement.

Wire containment structure including container and bag