Disclosed herein is a cleaning solution composition for a solar cell, comprising: organic alkali compounds, water-soluble glycol ether compounds, percarbonates, organic phosphoric acids or salts thereof, and water.

1. Technical Field
The present invention relates to a cleaning solution composition for a solar cell. More specifically, the present invention relates to a cleaning solution composition for a silicon wafer used to manufacture a solar cell.
This application claims the benefit of Korean Patent Application No. 10-2009-0056543, filed on Jun. 24, 2009, which is hereby incorporated by reference in its entirety into this application.
2. Description of the Related Art
Silicon solar cells are classified into monocrystalline silicon solar batteries, polycrystalline silicon solar batteries and amorphous silicon solar batteries.
A method of manufacturing a silicon solar cell is described as follows. In the case of a monocrystalline silicon solar cell, first, a monocrystalline ingot formed by a crystal pulling method is cut into sheets. A sawing tool may be a wire saw. Subsequently, the sheets are processed to a thickness of 100˜200 μm to form a wafer. Subsequently, a p-n junction layer, electrodes, a protective film and the like are sequentially formed on the wafer, thereby completing a monocrystalline silicon solar cell. Further, in the case of a polycrystalline silicon solar cell, molten silicon prepared by casting is cooled and crystallized to form a polycrystalline silicon ingot. Subsequently, the polycrystalline silicon ingot is cut into sheets. Subsequently, the sheets are processed to a thickness of 100˜200 μm to form a wafer. Subsequently, a p-n junction layer, electrodes, a protective film and the like are sequentially formed on the wafer, thereby completing a polycrystalline silicon solar cell.
In the method of manufacturing a silicon solar cell, in order to prevent the damage of the cut surface of the ingot and to decrease the reflectance of the cut surface thereof during the sawing process, a texturing process wherein the cut surface thereof is made uneven using a basic or acidic solution may be conducted. However, during the texturing process, the cut surface of the ingot may not be uniformly textured by the sawing oil or lubricating oil used in the sawing process, organic pollutants such as fingerprints and the like, glove prints or particulate pollutants occurring during the process of being handled by a worker, and belt prints transferred from conveyor belts. When the cut surface of the ingot is not uniformly textured, the yield of manufacturing solar batteries decreases rapidly, thus decreases the processability.
Therefore, in the solar cell manufacturing industry, RCA cleaning, which is used in semiconductor cleaning, was introduced in order to solve the problems related to organic pollutants, particulate pollutants and the like. More specifically, in the solar cell manufacturing industry, only SC-1 (SPM, hydrogen peroxide: ammonia: pure water) was introduced into the initial cleaning of solar cell wafer during RCA cleaning, or RCA cleaning was directly applied to the entire texturing process. However, when SC-1 cleaning or RCA cleaning is used, it is difficult to remove pollutants that are not particles. Further, when SC-1 cleaning or RCA cleaning is used, processing costs are increased because a solar cell manufacturing process needs additional processes. Further, when SC-1 cleaning or RCA cleaning is used, it is difficult to conduct work because the process temperature is 70˜100° C.
Accordingly, various attempts to overcome the problems of SC-1 cleaning or RCA cleaning have been made. For example, Korean Unexamined Patent Application Publication No. 2007-0023954 discloses a method of cleaning a substrate using ozone water instead of hydrogen peroxide in the SC-1 solution. This method is advantageous in that the effects of removing organic pollutants can be improved because ozone water, which is an oxidant that is not harmful to the environment and is stronger than hydrogen peroxide, is used. However, this method is problematic in that the process temperature for SC-1 cleaning must be maintained constant, and an ozone generator must be additionally provided. Further, Japanese Unexamined Patent Application Publication No. H05-275405 and Japanese Unexamined Patent Application Publication No. 2003-221600 disclose a detergent solution prepared by adding a complexing agent such as a phosphonate compound or a condensed phosphate compound to an SC-1 solution or adding an ethylene oxide-added surfactant or complexing agent to the SC-1 solution. This detergent solution can remove metal particles, but cannot efficiently remove organic pollutants, particulate pollutants and pollutants attributable to equipment. Further, Korean Unexamined Patent Application Publication No. 2005-0103953 discloses a semiconductor cleaning solution composition essentially comprising quaternary ammonium hydroxide and a specific surfactant. However, the semiconductor cleaning solution composition is problematic in that the performance of removing fat or particulate pollutants is not excellent.

Cleaning solution composition for a solar cell


A linear array of solenoid actuated marker valve assemblies is contained in a housing configured as a manifold which carries marker fluid as well as nebulizing air supplies and a solvent distributing valve for use in clearing the air passages. All valve assemblies are accessible from the front surface of the device for ease of maintenance and are assembled in a manner assuring uniform and consistent valve stem travel advantageously eliminating the need for valve stem travel adjustment. The control system utilized with the valve assemblies provides both for an enhanced current input rate to the windings of the solenoid driven components, as well as an efficient and effective turn-off clamping procedure. This form of actuation of the solenoids achieves dynamically efficient and rapid turn-off and turn-on to the extent that the size of dots formed by the assembly can be provided having a broader range of diameters and these diameters can be adjusted remotely by a simple impedance variation. The features of the invention permit the application of characters at substantially enhanced production line speeds.

A widely employed industrial identification or marking technology involves the formation of characters or symbols in dot matrix fashion using discrete jets of marker fluid or ink. Conventionally, this marker ink is expressed from select ones of a linear array of nozzles in conjunction with nebulizing air to form dots at the workpiece to be marked. Such fluid expression usually is controlled by a valve needle or stem which opens from a spring biased closed position under the drive of an energized solenoid. This drive pulls the stem point or terminus an adjusted distance from a valve seat. The distance between the valve pin or stem terminus or tip and the valve seat with which it cooperates typically has been in the range of 0.002 to 0.045 inch. Because of the inductive nature of solenoid drives, this opening movement of the valve pin develops at slower rates pending current build-up in the excitation coil of the drive device. Conversely, upon turning off current to the solenoid device excitation winding, it is desirable to control the resultant inductive "spike" typically encountered. Unfortunately, such control makes it more difficult to deactivate the winding for closing purposes resulting in slower or more inefficient valve operation. Thus adjustments for dot size generally have been restricted to procedures wherein control is exerted over the extent of needle travel. Such a limited form of control has resulted in constraints over the size range of dots available to the user, smaller diameter dot imprints being difficult to achieve. Further, past performance of the solenoid actuated valves used with these devices has imposed constraints on the throughput rate or line speeds acceptable for marking device requirements.
In general, the valve stem travel is determined by the distance between the rearwardly facing surface of an armature attached with the stem and a pole piece resident within the solenoid structure. Adjustment in the field is somewhat burdensome. In this regard, the devices are taken off line and mechanical adjustments are made in combination with test procedures, whereupon the assembly is remounted at the production line.
The extent of maintenance required for the marking devices at hand depends, in part, on the environment of their use, which varies from somewhat benign to quite harsh. For instance, some applications call for the marking of nascent metal components having surface temperatures of about 1800.degree. F. Typically, highly alkaline inks formed with ceramic particle suspensions are employed for such hot environments. The sticking of valve needles or stems has been somewhat common with such hot environment systems. The environments within which the markers are employed also pose difficulties to the designer in terms of the structuring and containment of their electrical control and drive systems. In this regard, it is necessary that spark potential be eliminated which, in turn, calls for the control and minimization of terminals and the like as well as a highly reliable form of power supply and control packaging.

Marker assembly for spray marking dot matrix characters and method of fabrication thereof


A filter system for the exhaust stream of a chemical sterilizer includes a liquid trap filter directly upstream from a canister filter and proximity switch for monitoring the presence or absence of the canister filter.

1. Field
The invention relates to sterilizers of the type used in the fields of medicine, dentistry and biological sciences. It is particularly directed to the vent stream (emissions) from such sterilizers and provides an exhaust (vent) filter system of general application but of particular use with chemical vapor sterilizers.
2. State of the Art
The potential health hazards associated with the discharge of exhaust emissions from sterilizer systems and apparatus are well recognized. Chemical vapor sterilization, as widely practiced, involves the exposure of biologically contaminated articles to chemical vapors in a sterilization chamber. At the termination of the sterilization procedure, the vapors are collected and reclaimed, but traces of potentially harmful vapors and/or gases may remain in the chamber and its contents.
It has been the practice in large-scale equipment to purge the chamber of such residual vapors by directing a stream of air or other purge gas, such as nitrogen, through the chamber. The residual chemical sterilant is thereby swept from the chamber in an exhaust or vent stream. The vent stream is composed of fluids, composed primarily of gases, but often including vaporous constituents which tend to condense upon cooling. More recently, purging is practiced in smaller scale equipment as well.
Particularly in the case of smaller scale sterilization equipment, discharge of the vent stream may be directly into the interior of a room. If the room is small and poorly ventilated, the possibility exists that unacceptable levels of chemical irritants, e.g. formaldehyde, may accumulate in the room over a prolonged period. One expedient for reducing or eliminating this possibility is to filter or chemically neutralize the vent fluids prior to their discharge into the atmosphere. The presence of condensible vapors in the vent fluids interferes with such procedures. Condensation blocks filter passages and accelerates deterioration of many filter media Moreover, proper maintenance and replacement of filters, while essential, has not been reliably practiced, largely due to inadequate monitoring procedures.
There remains a need for an improved exhaust filter system for chemical and other sterilizer systems.


A method includes: acquiring a training data set including pieces of training data, each of the pieces including an image of a training target, first annotation data representing a rectangular region in the image, and second annotation data; training, based on the image and the first annotation data, an object detection model specifying a rectangular region including the training target; training, based on the image and the second annotation data, a neural network; and calculating a first index value related to a relationship of a pixel number, the trained estimation model and the calculated first index value being used in a determination process that determines, based on the calculated first index value and a second index value relationship between a pixel number in an output result and an estimation result, whether or not a target in a target image is normal.

As a scheme for detecting abnormality of a target included in an input image, a scheme for detecting abnormality with an auto-encoder has been known.
In a scheme for detecting abnormality with an auto-encoder, the auto-encoder is trained, using normal data in which a target is normal as an input, so as to reconstruct the normal data and output the decoded the normal data.
Since, even if abnormal data in which the target is abnormal is input, a trained auto-encoder decodes the abnormal data to normal data, the difference between the input-data and the output-data in this case is larger than that of cases where normal data is input.
For its ability of detecting abnormality of a target on the basis of a deviation of abnormal data from the normal data as a result of training that uses only the normal data among the normal and abnormal data, the scheme for detecting abnormality using an auto-encoder is highly versatile.
[Non-Patent Document 1] Simon Hawkins et al., "Outlier Detection Using Replicator Neural Networks", "Data Warehousing and Knowledge Discovery: 4th International Conference", Sep. 2, 2002
In the meantime, such a scheme for detecting abnormality using an auto-encoder sometimes has a difficulty in discriminating the background and noise included in the normal data from abnormality, and therefore is sometimes vulnerable to change of the background and noise.
For the above, when the above scheme for detecting abnormality in the target is applied to abnormality detection of a target, which has variations in at least of the position and the background thereof, the precision in detecting abnormality may be lowered.

Computer-readable recording medium having stored therein information processing program, method for processing information, and information processing apparatus


A new and distinct cultivar of Chrysanthemum plant named ‘DLFRADO2’, characterized by its upright plant habit; uniform growth habit; dark green-colored leaves; uniform and freely flowering habit; strong upright flowering stems; spray-type inflorescences with bright yellow-colored ray florets and vivid yellow-colored disc florets; resistance to Fusarium; relative tolerance to high temperatures; and good postproduction longevity.

The present invention relates to a new and distinct cultivar of Chrysanthemum plant, botanically known as Chrysanthemum x morifolium, typically grown as a cut flower Chrysanthemum and hereinafter referred to by the name 'DLFRADO2'.
The new Chrysanthemum plant is a product of a planned breeding program conducted by the Inventor in Maasdijk, The Netherlands. The objective of the breeding program is to create new cut flower Chrysanthemum plants with numerous attractive inflorescences.
The new Chrysanthemum plant is a naturally-occurring whole plant mutation of Chrysanthemum x morifolium 'Deliradost', not patented. The new Chrysanthemum plant was discovered and selected as a single flowering plant from within a population of plants of 'Deliradost' in a controlled greenhouse environment in Maasdijk, The Netherlands in July, 2013.
Asexual reproduction of the new Chrysanthemum plant by vegetative terminal cuttings since July, 2013 in a controlled greenhouse environment in Maasdijk has shown that the unique features of this new Chrysanthemum plant are stable and reproduced true to type in successive generations of asexual reproduction.


An idle pattern output-control circuit used in a point-to-multipoint communication based Gigabit Ethernet-passive optical network (GE-PON) is provided. In a GE-PON having an optical-line terminal (OLT), a plurality of optical-network units (ONUs) connected to each other via an optical-distribution network (ODN), a media-access controller (MAC), and a physical-coding sublayer (PCS), in which the PCS transmits idle-pattern data to a serializer/deserializer (SERDES) when there is no data to be transmitted to the OLT, an idle-pattern output-control circuit comprising a data converter for converting an idle-pattern data generated from the PCS into a low-level optical signal for subsequent transmission to the OLT, and a switching circuit for selecting data generated from the PCS for subsequent transmission to the SERDES when there is data to be transmitted and for selecting data converted by the data converter for subsequent transmission to the SERDES when there is no data to be transmitted.

1. Field of the Invention
The present invention generally relates to a passive optical network (PON) and, in particular, to a Gigabit-Ethernet controller for use in an optical-network unit (ONU) of a Gigabit Ethernet-passive optical network (GE-PON).
2. Description of the Related Art
A PON system, which is an optical-subscriber network that is based on passive devices, has an architecture made of passive-distribution devices or wavelength-division-multiplexing (WDM) devices between a subscriber-access node, such as fiber-to-the-home (FTTH) or fiber-to-the-curb (FTTC), and a network termination (NT), in which all the nodes are distributed in the form of a bus or tree structure.
An asynchronous-transfer mode (ATM)-PON is an exemplary PON system and explained in detail in the International Telecommunication Union-T (ITU-T) G983.1. The standardization on the media-access-control (MAC) technology of the ATM-PON has been completed and is readily available. This type of technology is also well disclosed in other publications—for example, in U.S. Pat. No. 5,978,374, issued on Nov. 2, 1999, entitled "Protocol for Data Communication over a Point-to-Multipoint Passive Optical Network," and Korean Patent Application No. 1999-70901, published on Sep. 15, 1999, entitled "Protocol for an Asynchronous Transfer Mode Passive Optical Network Media Access Control."
With the development of the Internet technology, many subscribers have been demanding more bandwidth for their applications. To this end, the GE-PON system, which has relatively low costs, has been developed to provide more bandwidth during the end-to-end transmission using Gigabit Ethernet. As such, the demand is growing for the GE-PON system over an ATM system; however, this system has relatively high costs, limited bandwidth, and undesirable segmentation of an Internet-protocol packet.
FIG. 1 is a general schematic block diagram of a GE-PON. As shown, an optical line terminal (OLT) 100 is connected to a plurality of optical-network units (ONUs) 104 via an optical-distribution network (ODN) 102 using an optical splitter. Here, the OLT 100 and ONUs 104 constitute the Gigabit Ethernet. The ONU 104 is typically installed at the distribution boxes within buildings or apartment blocks, or at the entrances of houses, and connected to a network of terminals (not shown). The OLT 100 receives data from a backbone network and transmits the data to the ONUs 104 via the ODN 102 or receives data from the ONU 104 using the time-division-multiplexing (TDM) protocol.
A Gigabit-Ethernet controller must be used in the ONU 104 for a point-to-point communication. Commercially available Gigabit-Ethernet controllers are shown, for example, in FIGS. 2 and 3. As shown in FIG. 2, a Gigabit-Ethernet controller 200 includes a media-access controller (MAC) 202 and a physical-coding sublayer (PCS) 204. Similarly, as shown in FIG. 3, a Gigabit-Ethernet controller 300 includes a MAC 302, a PCS 304 and a serializer/deserializer (SERDES) 306. Unlike the Gigabit-Ethernet controller shown in FIG. 3, the Gigabit-Ethernet controller depicted in FIG. 2 must have a SERDES 206 connected to the PCS 204. An optical transceiver (not shown) is connected to the SERDESs 206 and 306 and transmits an optical signal to the OLT 100 in response to data generated from the SERDESs 206 and 306 while converting an optical signal generated from the OLT 100 into electric-signal data.
During operation, if there is no data transmission, the Gigabit-Ethernet controllers 200 and 300 automatically generate idle-pattern data instead of transmitting data in the PCSs 204 and 304. The idle-pattern data alternates between the logic "0" and "1", that is "101010 . . . ." Thus, if the Gigabit-Ethernet controllers 200 and 300 are implemented in the GE-PON, data collision may occur as some ONUs may transmit the idle-pattern data while other ONUs exchange data with the OLT 100. The data collision leads to a loss of upstream data transmitted to the OLT 100.
As such, the conventional Gigabit-Ethernet controller can not be used in the GE-PON structure that is based on the point-to-multipoint communication. Accordingly, there is a need for a new Gigabit-Ethernet controller that overcomes the above-stated problems.

Idle-pattern output control circuit used in a Gigabit Ethernet-passive optical network


A vehicle trim element including a body defining the shape of an outer surface and an information display system, the trim element being able to be positioned in a first configuration and in a second configuration, wherein the display system is moved along a first direction between the first configuration and the second configuration and in that the shape of the outer surface is modified between the first configuration and the second configuration.

Such a trim element is for example intended to be integrated into a vehicle, for example a motor vehicle, more particularly in the driver's station.
Document US 2006 0131088 A1 describes a screen arranged on the front of the dashboard. The screen is movable along a horizontal direction of the dashboard. This in particular allows the driver or front passenger to move the screen to see it better.
However, in such a configuration, the surface of the dashboard facing the passenger compartment is partially hidden by the screen. More particularly here, the surface of a CD player is hidden by the screen when the latter is in the extreme position closest to the driver.
Furthermore, the screen protrudes relative to the dashboard, which is not esthetically satisfactory.

Trim element comprising a screen with two configurations and associated vehicle


A flexible carrier for carrying a plurality of containers within a plurality of corresponding container receiving apertures wherein each container receiving aperture is stretched around a perimeter of a corresponding container and positioned under a flap extending downward from the corresponding container.

Field of the Invention
This invention relates to a flexible carrier for carrying a plurality of flexible containers such as cartons in a unitized package.
Description of Prior Art
Conventional container carriers are often used to unitize a plurality of similarly sized containers, such as cans, bottles, jars and boxes and/or similar containers that require unitization. Flexible plastic ring carriers are one such conventional container carrier.
Flexible plastic ring carriers having a plurality of container receiving apertures that each engage a corresponding container may be used to unitize groups of four, six, eight, twelve or other suitable groups of containers into a convenient multipackage. Flexible ring carriers may include a handle that extend upwardly from the carrier to enable a consumer to carry the package.
Typically, flexible ring carriers are used to unitize a plurality of generally rigid containers, like cans or bottles. Flexible packaging, such as soft sided juice boxes and similar bags are generally placed into boxes or similar rigid containers. However, a need exists to unitize a plurality of such soft and/or flexible containers into a pleasing consumer package that openly displays the packages and minimizes packaging waste.


The present invention provides for trusted side-band communications between components in a computer system, so that use of the system bus may be avoided. Two components may be connected by means other than a bus (e.g., an infrared port, a wire, an unused pin, etc.), whereby these components may communicate without the use of the system bus. The non-bus communication channel may be referred to as “side-band.” The side-band channel may be used to communicate information that might identify the user's hardware (e.g., a public key) or other information that the user may not want to be easily intercepted by the public at large. Communication over the side-band channel may also be used to verify that the participants in a communication are within a defined positional relationship to each other.

Components within a computer system are typically connected to each other using a bus. A first component communicates data to a second component by writing data to the bus. A second component then receives the data by reading the bus. Conventions exist that allow a given component to determine whether the data on the bus is destined for that component or for a different component. However, the physical architecture of many such busses is such that any component can connect to the bus, and can read the data off the bus—even if the data is not destined for that component. Thus, the bus provides an opportunity for snooping or modifying data, so the bus may not be appropriate for transmitting private data in the clear.
One context in which is it may be undesirable to place data on the bus is where the data could identify the user based on a unique hardware identifier. For reasons of privacy, many users are wary of unique hardware identifiers, and resist using hardware that employs such identifiers. However, some hardware components employ unique public/private key pairs in order to engage in encrypted communication. While identifying the user is not the primary purpose of the key pair, the public key is, in fact, substantially unique to the hardware and could be used for such an identifying purpose. Since the public key must be transmitted to the entity that will use the key to encrypt information, the transmission of the key over a bus provides an opportunity for this potentially identifying information to be divulged, and thus it is desirable to transmit the key by some means other than the bus so that the key cannot easily be intercepted.
Additionally, since the bus can be read and/or written by components that have access to the world outside of the computer of which the bus is a part (e.g., the bus can be written by network cards, that can communicate with components anywhere on the Internet), it is generally not possible to determine whether data on the bus originated from inside the computer or from a remote component. Thus, the fact that a computer is communicating with a component over the bus is generally not a very good basis to conclude that the component is located in physical proximity to the computer, since the component could be located remotely and placing data on the bus through the computer's network interface.
In view of the foregoing, there is a need for a system that overcomes the drawbacks of the prior art.

Communication of information via a side-band channel, and use of same to verify positional relationship


A network load balancing apparatus has a data buffer for each communication path of a received packet's transfer destinations, calculates a first hash value using a field value contained in the packet, determines, based on the field value of the packet or the first hash value, a communication path of a transfer destination of the packet subject to external transfer control for transmission to a predetermined external server, determines, based on the first hash value, a communication path of a transfer destination of the packet to be subject to priority control, determines, based on a second hash value based on the first hash value, a communication path of a transfer destination of the packet to be subject to load balancing control, to match a preset load balancing situation of the data buffer, and transmits the packet to a data buffer corresponding to the communication path of the transfer destination.

Normally, a network configured based on Software-Defined Networking (SDN)/Network Function Virtualization (NFV) is made up of several general-purpose servers. A plurality of virtual machines (VMs) may be constructed in a general-purpose server and be used to process one application, or each VM may be used to process a plurality of applications.
Virtualized communication application software that runs on VMs in this way are known as Virtual Network Functions (VNFs). Since various VNFs can be run on a single general-purpose server, CAPEX/OPEX can be reduced compared to a conventional network configuration using dedicated apparatuses. Even among load balancing apparatuses which were generally configured by conventional dedicated hardware, apparatuses with more flexible configurations utilizing VNFs are known.
Meanwhile, as a packet transmission/reception interface of the general-purpose server, a general-purpose network adapter (Network Interface Card: NIC) is installed. In the general NIC disclosed in Non-patent Literature 1, received packets are accumulated in a data buffer, and are stored in a main memory in the server using Direct Memory Access (DMA) transfer.
Because the control method for distributing packets to the data buffer in the NIC is greatly affected by packet transfer performance and the functionalities that can be realized by the server system as a whole, the number of data buffers and the control method for distributing packets to multiple data buffers differ depending on the NIC. For example, by including a plurality of data buffers and performing load balancing control with respect to received packets, a plurality of CPU cores can perform the load balancing process to improve the throughput. In addition, by performing priority control of received packets occupying one data buffer and having a flow, packet reordering in the flow can be prevented.
In addition, in load balancing apparatuses with a configuration of a general-purpose server, a general-purpose NIC and VNFs, the predominant configuration is one wherein communication bottlenecks with the CPU are reduced using the I/O virtualization function Single-Root I/O Virtualization (SR-IOV) of the hardware of a general NIC mentioned above. However, in conventional load balancing apparatuses, since distribution of a large quantity of packets to a plurality of servers is processed by the VNFs, there is a problem in that significant packet discarding occurs when the traffic to be distributed exceeds a certain quantity, even if SR-IOV is used. This may limit the maximum amount of traffic that can be passed by the VNFs in advance.
In order to solve the above problem, apparatuses have been proposed which reduce CPU load by efficiently distributing received packets. For example, Patent Literature 1 realizes a packet distribution method in which both load balancing control and priority control of received packets are achieved. FIGS. 6 and 7 show a configuration example and an operation example of a network load balancing apparatus of Patent Literature 1.
In Patent Literature 1, priority control is realized by calculating a hash value with respect to a specific region of a received packet, comparing the calculated hash value with a hash value registered in a priority path selection table, and if the values match, transferring the received packet to a data buffer (S4-1 to S4-4) registered in the priority path selection table. On the other hand, if the calculated hash value does not match the hash value registered in the priority path selection table, the hash value is reported to a load balancing control unit 30, and the packet is transferred to a data buffer registered in a load balancing path selection table while being subjected to load balancing (S4-5 to S4-8).

Network load dispersion device and method

NIPPON TELEGRAPH AND TELEPHONE CORPORATION


An airflow testing system for an aerospace component uses a flow master with a first sealing surface, a hollow body, and a metering plate. A desired back pressure across a flow path through the aerospace component is determined, and used to form a metering outlet through the metering plate. The plate is attached to the hollow body in a fluid seal, the flow master is secured to a testing position in a fluid seal, and back pressure across the flow master is sensed while flowing air through the flow master. The difference between desired and sensed back pressure is used to evaluate the airflow testing system.

The present invention relates generally to the evaluation of aerospace component testing systems, and more particularly to a flow master used to check pressure testing systems.
Many aerospace components include air channels (e.g. for cooling) that are fabricated to strict specifications and tested during manufacture to ensure that fluid flow and differential pressure across these channels fall within expected ranges. The equipment used to this testing can suffer from wear, malfunction, and calibration drift, and must be periodically checked. In some cases, testing equipment may need to be recalibrated based on these checks.
Flow masters are example parts used to periodically check equipment and calibrations used in this testing. Conventional flow masters are ideal copies of a target workpiece (e.g. an airfoil), and separate masters are used to calibrate tests for each flow path within each part. Because flow masters are known to be ideal parts, the expected results of testing flow masters with testing equipment are known. If testing equipment returns unexpected results while "testing" master parts, this indicates that the testing equipment is miscalibrated, defective, or otherwise malfunctioning. Constructing a "perfect" master part can be expensive and labor intensive, and because flow masters are used to evaluate testing equipment regularly in most manufacturing settings.


A method for generating high power pulsed RF waveforms comprises the steps of charging a transmission line in a pulse forming network with a high-voltage and discharging the voltage on the transmission line to ground utilizing a gallium nitride photoconductive switch.

Electronic warfare involves a generation of high-power RF pulses which are incident on target radars/receivers so as to either result in jamming or to in fact cause massive malfunctions of the receiving apparatus. It has been the goal of those involved in electronic warfare to be able to put a considerable amount of energy on a target and to tailor the energy both in frequency and in pulse repetition rate to match that of the target's vulnerabilities. Target radars are now considerably more sophisticated and operate on the basis of coded signatures so as to be able to defeat jamming systems by being able to filter out indiscriminate jamming that doesn't take into account the sophistication of the target radar. Also, in communication systems, it is often times required to be able to disable these systems by the infusion of RF energy that causes these systems to malfunction.
In order to confuse or disable target receivers or electronics, be they microwave radars, or other types of communication systems, it is common to provide high power RF pulses generated by photoconductive switch-based RF generators. The present switch-based RF generators utilize silicon-based switches which are activated by pulsed lasers, the laser pulses of which serve to close the switches. The closing of the switch in general grounds a transmission line that has been charged from a high-voltage source, with the grounding of the transmission line causing a negative going RF pulse to be generated.
Thus, generation of high power pulsed RF waveforms has in the past been accomplished through the momentary grounding of a transmission line which is coupled to a high-voltage source, in which the grounding of the cable produces a negative going voltage spike that creates an RF waveform which propagates out through an antenna.
As mentioned above, this momentary grounding has been provided through silicon switch technology. The problem with such silicon technology is primarily the long carrier lifetime which limits the repetition rate and thus the frequency of the RF output as well as the ability to specifically tailor the outgoing RF waveform. Moreover, silicon technology has a limited voltage holding capability that limits output power and also offers only a limited tuning capability. Thus, photoconductive switch-based RF waveform generators based on silicon are limited to frequencies in the kilohertz pulse repetition rate range and are further restricted by the limits on the high-voltage supply.
Additionally, the silicon-based photoconductive switch RF generators are not capable of putting enough energy on a target unit, either because the RF output pulses are not powerful enough or because these systems cannot rapidly fire RF pulses on target. With silicon technology the building up of pulses to be fired in rapid succession on a target is simply not possible. For instance, it is not possible, utilizing silicon switches, to generate multiple high-power pulses in a single, rapid burst.
It will be appreciated that a single laser pulse applied to a silicon switch closes the switch for tens to hundreds of microseconds due to the long carrier lifetime associated with silicon, with the switch closure completely discharging a transmission line due to the long switch closure. Since there is no further charge in the transmission line this precludes multiple high-power RF pulses generated during the time it takes the silicon switch to recover. The result is that when one uses silicon switch technology only a single high-powered RF pulse can be generated once every 10 to 100 μs.
Further, due to the fact that only a single output pulse can be generated with silicon switching systems every 10 to 100 μs, there is no possibility to provide additional laser shots within this 10 to 100 μs silicon switch recovery time, i.e. prior to the completion of the initial transmission line discharge phase.

Generation of flexible high power pulsed waveforms

BAE Systems Information and Electronic Systems Integreation Inc.


Shears for cutting metal sheet include first and second jaws pivotably interconnected by a jaw joint. The jaws have respective cutting edges located forwardly of the jaw joint, and which are arranged to cross one another at a crossing point which moves during a cutting operation. The cutting edges are configures to cross one another at a substantially constant angle during a cutting operation. The second jaw includes an extension extending rearwardly of the jaw joint. The first jaw has a rigidly attached first gripping handle. A second gripping handle is pivotably connected to the first handle by a handle joint located rearwardly of the jaw joint. The second handle engages a surface of the extension by a sliding contact, whereby a distance between the jaw joint and the sliding contact increases during a cutting operation.

The invention pertains to metal-cutting shears.
When using metal-cutting shears to cut sheet metal, one tries usually to utilize a large part of the length of the jaws for each cut, before opening the shears to start a new cut. The force on the jaws is very local occurring just where they cross one another, i.e., the point where the metal sheet is being parted. This is in contrast with secateurs or cable cutters where the force is distributed over a greater length of the jaw, corresponding to the diameter of the branch or cable. In sheet metal cutting, the force depends on the angle between the jaw edges, i.e., a large force when the angle is small, and a smaller force when the angle is larger. In simple metal-cutting shears, the jaws are straight, and the angle between them is reduced when the jaws get closed. For such shears the force increases successively during the cut, and at the same time the force and the crossing point are moved forward to progressively greater distances from the joint, which increases the leverage. The operator must then press the handles together with a sharply increasing force, and the full length of the jaws can not be used for cutting of thick metal, which must then be cut with very many small cutting motions, all of them with the handles far apart, which is uncomfortable and tiring for the hand, and which will produce jagged edges of the metal sheet.
It is earlier known from McGary et al. U.S. Pat. No. 2,449,561 to make the upper jaw curved to make the crossing angle and the jaw force less variable. German Patent No. 42 11 591 shows both jaws slightly curved, for the same purpose, and also shows how the leverage can be made variable by not attaching the lower jaw to the upper handle, but rather letting it be moved by a cam mechanism including a roller. This means that the lower handle griped by the user's fingers will be almost immobile when cutting, while the upper handle gripped by the user's thumb and wrist will move. This causes exhaustion of the hand. The leverage is not varied in such a way that the gripping force of the fingers is fully constant. Producing variable leverage by a sliding cam action is also known from secateurs or loppers through Kishimoto U.S. Pat. No. 5,058,277, but the gripping force will decrease markedly when the handles are closed, and that design is suited for cutting branches or cables, but not sheet metal.
Shirk U.S. Pat. No. 1,533,039 shows shears where no effort has been made to keep the cutting force at the jaws constant, and where the jaws are not shaped to let both handles be held at the same side of the sheet material. Sargent U.S. Pat. No. 4,502,222 shows metal shears where both handles are on the same side of the sheet material, but no effort has been made to keep the cutting force constant, and the leverage is obtained with a four joint design. Curved jaw edges are known from Juras U.S. Pat. No. 3,572,192, but they are not shaped to ensure a constant cutting force.


This information processing method is executed by an electric light bulb light source apparatus, which includes a lighting unit, and a functional unit, the information processing method including: selecting, from any of a parent mode and a child mode, an operation mode for cooperative control with a different electric light bulb light source apparatus with respect to the functional unit, and setting the selected operation mode. In a case where the parent mode is set, the lighting unit is caused to execute a first lighting operation for the parent mode in response to a predetermined lighting control signal relating to an operation of the lighting unit, and a cooperative control signal for causing a second lighting operation for the child mode to be executed is transmitted to the different electric light bulb light source apparatus set to the child mode, the second lighting operation for the child mode being different from the first lighting operation. In a case where the child mode is set, the lighting unit is caused to execute the second lighting operation on the basis of the cooperative control signal transmitted from the different electric light bulb light source apparatus set to the parent mode.

In the past, a system in which a plurality of lighting devices are operated in cooperation with each other has been devised. For example, in a lighting control system disclosed in Patent Literature 1, wireless mutual communication is executed between the devices, and the signal level and the communication response time between them are measured. The measurement data measured by the devices is collected by a parent device, and the order of distance between the devices is set on the basis of the collected measurement data. Each of the devices executes turning on control on the basis of the order of distance set by the parent device. By such control, it is possible to automatically assign the turning on order reflecting the positional relationship between the devices. As a result, it is possible to maintain sequential turning on along a certain direction while changing the arrangement state of the lighting devices, and improve the stage effect by lighting (Paragraph [0026], [0031], [0041], and the like of the specification of Patent Literature 1).

Information processing method, information processing system, and electric light bulb light source apparatus


A system and method for efficient (e.g., economical) computing in hybrid, plug-in hybrid, and electric vehicles is disclosed. A compute manager is configured to receive and schedule compute tasks for execution on computing cores in the vehicle to increase the usage of recaptured energy that would otherwise be wasted due to battery limitations. Vehicle status information such as current battery charge level and current route may be used to determine whether compute tasks can be beneficially executed.

This background description is set forth below for the purpose of providing context only. Therefore, any aspect of this background description, to the extent that it does not otherwise qualify as prior art, is neither expressly nor impliedly admitted as prior art against the instant disclosure.
Advances in manufacturing, battery chemistry, mechanical design, and electronics engineering have enabled new classes of vehicles such as electric and hybrid cars, buses and trucks. Some of the main benefits of these vehicles include their [smaller carbon footprint] and increased efficiency relative to ICE (internal combustion engine) only vehicles. This increased efficiency is mainly attributable to their ability to be at least partially propelled by efficient electrical motors powered by rechargeable batteries.
To further decrease reliance on fossil fuel and [increase efficiency], these motors are often implemented as motor-generators that upon braking are capable of converting a part of the vehicle's kinetic energy into electrical energy that is stored in the vehicle's battery. ICE-only vehicles typically waste this kinetic energy from braking and merely heat up the vehicle's brakes.
Unfortunately, the batteries used by electric and hybrid vehicles have capacity limits due to their cost, volume and weight. Once the limited battery capacity is full, any additional kinetic energy that could be captured from braking/coasting is generally wasted. In addition to batteries and motor-generators, many newer versions of these electric and hybrid vehicles also include significant computing power in the form of multiple processing cores that can quickly process data from sensors like cameras in order to enable features like self-parking, energy management, navigation, and collision avoidance.
The batteries and processing cores contribute in part to the higher cost of these vehicles relative to ICE-only vehicles. For at least these reasons, there is a desire for a solution to increase the efficiency and utility of these new electric and hybrid vehicles during their lifecycle and improve their ability to capture and utilize energy that would otherwise be wasted.


A broad-band antenna includes in a common plane tow symmetrical parts (2,3) each including at least two interconnected conductor strands (4,5,7,8;19,20,21) powered by a double-wire line (10;22), each strand including in its portion opposite the double-wire line, a resistive load (11,12,14,15;23,24,25,26).

The present invention concerns broad band antennas and relates more particularly to antennas adapted to ultra-short high voltage pulses.
All of the broad band antennas at present available on the market are arranged to function in permanent harmonic operation and are used for various applications such as, for example, electromagnetic compatibility tests or measurements of Surface Equivalent Radar or SER. The most widely used are, among others:
horns with baffles
Log-periodic,
Vivaldi antennas,
butterfly antennas,
spirals,
biconical antennas, etc.
In spite of the great diversity of these types of antennas, the majority of them do not offer the features desired for experiments in the transient field.
In order to have a high performance with respect to time, the antennas should be naturally broad band in order to cover the spectrum range of the pulse delivered by an associated pulsed generator. They should in addition have particular qualities, appropriate to the radiation or the measurement of ultra-short pulses. It is in fact important that the antennas have a transfer function with low dispersion in frequency so that the radiated or received pulse is neither deformed nor spread. A significant distortion of the signal results in elongation of the responses with respect to time of the various targets and causes the loss of one of the main interests of the transient methods, that is to say, the possibility of separating the useful echoes from the interference paths by simple time xe2x80x9cwindowingxe2x80x9d.
Among the conventional broad band aerials at present available on the market, horns, horns with baffles and Log-periodic are the antennas most commonly used.
In the following there is given, for each of these types of antennas, the electric field radiated in the axis, when the excitation signal applied to the antenna is a Gaussian pulse, having a width at mid-height of 700 ps.
a) The horn proposed by way of example is designed by means of the code of calculation by finite differences in the transient field. The dimensions of the horn are determined so that its passband extends from 100 MHz to 1 GHz. The excitation of the guide is effected by imposing in a sectional plane a spatial distribution of the electric field according to the TEO1 mode (sinxcfx80y/a) with a: dimension of the guide along the axis y. The pulse radiated in the axis at long range has a time spread of about 80 ns; it is only really significant over 30 ns.
This type of antenna is not therefore adapted to function in transient operation. Each spectrum component is in fact emitted from a phase centre which moves within the horn, thereby in part bringing about the spread of the signal.
Moreover, the size of the antenna at these frequencies becomes very large, hence a not inconsiderable bulk and difficulties of implementation.
b) The horn with baffles has the particular feature of having a large passband (200 MHz-2 GHz) while maintaining relatively modest dimensions. The use of baffles at the exponential profile makes it possible to obtain a high gain over the whole passband. This horn was tested in an anechoic chamber at CELAR. The radiated electric field has a time spread of about 15 ns.
The pulse is in part deformed by the poor performances of the horn at low frequency. Evanescent modes are in fact excited below the cut-off frequency of the guide, thereby disturbing the radiated electric field. The baffles and the reflections at the ends of the plates may also contribute to the dispersion of the signal.
c) The Log-periodic antenna is an assembly of parallel dipoles powered by a transmission line, in such a manner that two consecutive dipoles are of opposite phase.
Each strand radiates with a maximum efficiency when the supply half wave-length is equal to its own length.
Thus, the high frequency of the antenna is limited by the dimension of the smallest strand, and the low frequency by that of the largest strand. The Log-periodic antenna has been designed by means of the code of calculation of integral equations.
The geometrical dimensions were determined so that the antenna should be directional and cover a spectrum of 100 MHz to 1 GHz. This type of antenna mainly emits a horizontal electric field, the duration of which is relatively long.
The successive resonances of the strands constituting the antenna are the origin of the dispersion that can be observed on the radiated signal.
The conventional broad band antennas are not therefore suitable for radiating an ultra-short pulse. Numerous researches have however been carried out for many years in order to design devices capable of radiating high level pulses with a minimum of distortion, but these antennas are not at present available on the market.
It therefore appeared necessary to design an antenna, simple to implement and not bulky, and above all guaranteeing correct electromagnetic performances for the two modes of operation, transient and harmonic.
The subject of the invention is a broad band antenna, characterised in that it comprises in a common plane two symmetrical parts each including at least two interconnected conductor strands powered by a double-wire line, each strand comprising in its portion opposed to the double-wire line a resistive load.
According to other features of the invention:
each symmetrical part further comprises at least one strand not connected to the other strands and including in its portion opposed to the supply line a resistive load,
each symmetrical part comprises n conductor strands, interconnected or not, and each including a resistive load at its end, n being greater than 2.

Centre National de la Recherche Scientifiques (C.N.R.S.)


A one-way valve device comprises a valve seat arranged in the neck of a container that extends transversely across the interior of the neck and defines a plurality of passage openings. A pin-like projection is formed on the valve seat and extends axially to the exit opening. An elastic seal is held on the valve seat and comprises a sleeve-like section which surrounds the projection of the valve seat with the exception of its end section which rests on the end section of the projection. Applying pressure to the contents of the container axially displaces the sleeve-like part of the seal relative to the pin-like projection, so that the contents of the container can exit. In the closed position, an annular projection of an outer cap firmly presses the sleeve-like section of the seal against the projection of the valve seat, so that no container contents can exit.

If a container has a reducible volume, it may e.g. consist of a rigid outer container and of a flexible inner pouch which after discharge of container contents contracts each time accordingly, with pressure compensating openings being provided in the outer container for pressure compensation between the rigid outer container and the inner pouch. The container, however, may also be single-walled and e.g. have the shape of a tube which is compressed for discharging the material. Further examples of a container having a reducible volume are bellows-type containers, which gradually collapse upon discharge of the flowable material, and syringes the volume of which can be reduced by advancing a syringe plunger. It goes without saying that the above enumeration is only by way of example and not complete.
If the container is not of a reducible volume, volume compensation may also be achieved during discharge of the container contents through inflowing air which should then flow through a sterile filter.
The flowable contents of the container may be liquid and then be discharged in liquid form or as a spray, or it may be a suspension, cream, gel, ointment, or another substance, optionally of high viscosity.
A one-way valve device comprising an outer cap which is seated on the container neck and has an exit opening discharges the contents of the container in partial amounts, and the discharge in doses may be distributed over a prolonged period of time.
With many applications, it is important that the filling material remaining in the container should not be impaired by contamination, for instance by microorganisms or inorganic or organic impurities. Above all in pharmaceutical materials, but also e.g. in the case of cosmetic container contents, this determines the quality and is e.g. also applicable to flowable substances to be counted among foodstuff. That is why the material volume discharged from the container must not be compensated by (unfiltered) air entering into the container if a situation is to be prevented where bacteria, dust, moisture, oxygen etc. get into contact with the remaining contents of the container. That is why in the container of the preferred type the volume must be reduced in proportion to the amount of material discharged. It must above all be ensured that no microorganisms penetrate through the container opening and contaminate the remaining contents of the container.
Of course, it is also important to ensure that no contents of the container exits independently, for example during transportation of the container.


A portable holder for securing a shaft of an item to a ground surface. The holder has a flexible base and a sleeve. The base has a center, a perimeter, a center hole disposed through the center and an upwardly projecting lip coupled to the perimeter. The base has a plurality of openings spaced around the perimeter for use with one or more stakes. The sleeve is coupled to the base and configured to receive a portion of the shaft. The sleeve has an internal bore aligned with the center hole in the base. When the shaft is received by the sleeve, the shaft passes through the bore, through the center hole, and into the ground surface. The sleeve has an inner surface and an outer surface, the inner surface having a plurality of gripping protrusions, and a plurality of securing straps coupled to the outer surface of the sleeve.

Many people get hurt every year by flying beach umbrellas that are not properly anchored in sand. Additionally, flying sun shades and other portable structures can also cause injury if they are not properly anchored. However, there are problems associated with the known beach umbrella holders.
As such, there is a need for an improved portable holder that can be used with more than just beach umbrellas, is lightweight, and easy to use.
The present invention overcomes several of the deficiencies, disadvantages and undesired parameters associated with known beach umbrella holders.


A multi-car elevator control device for controlling an operation in such a manner that a rear car can stop away from a periphery of a fire floor. The multi-car elevator control device includes a running-enabled section calculator for calculating, as a running-enabled section, a range of a floor in which a stop can be carried out to open a door without a collision with a front car which stops, a fire floor information acquiring part for acquiring fire floor information, an in-fire stop prohibition section calculator for calculating, based on the fire floor information, an in-fire stop prohibition section for prohibiting the stop of the car, and a running permission deciding part for deciding a running permission of an elevator by referring to the running-enabled section and the in-fire stop prohibition section.

In the case where a fire occurs in a building, an elevator stops a normal operation and carries out an emergency operation, that is, guides a passenger thereof to an evacuation floor. For example, Patent Document 1 describes an elevator control device in a single car elevator system in which only one car runs in a single hoistway. In the elevator control device, fire detecting means such as a fire sensor is provided on each floor in a building and stop floor selecting means collates a signal output from the fire detecting means with a signal output from priority stop floor storing means storing a priority stop floor which is previously ranked, and automatically selects the evacuation floor of the elevator, thereby controlling an elevator control panel. According to the present invention, an emergency operation which avoids a stop on a floor in which the fire occurs is automatically carried out. Thus, a smooth and safe evacuation of a passenger thereof is ensured.
In the case of a multi-car elevator system in which a plurality of cars run along a single hoistway, however, it is necessary to control an operation in such a manner that cars do not collide with each other as described in Patent Document 3, and the elevator control device in Patent Document 1 cannot be applied to the multi-car elevator system.
As an example of a fire emergency operation in the multi-car elevator system, in the case where the emergency operation in an occurrence of a disaster is carried out in the apparatus for operating an elevator described in Patent Document 2, an emergency operation for a lower car is completed and the lower car is then caused to move from an evacuation floor to a lower floor, and an emergency operation for an upper car is subsequently carried out. Consequently, it is possible to carry out a rapid emergency operation in an earthquake emergency operation and a fire emergency operation.


Positioning device adapted to dispose a strip of fabric or other similar material on an article of clothing do as to form a loop, the strips divided into a central portion and two opposite ends, the positioning device rotates at least one of the two ends of the strip in order to bring that end or ends into abutment with the central portion of the strip; and wherein guide means guide the end or ends of the strip during rotation.

The present invention refers, in general, to a positioning device for the positioning of loops and to a sewing machine comprising said device. More particularly, the present invention relates to a positioning device and to a sewing machine comprising said device, to appropriately arrange and position a loop on a garment during processing, for instance trousers.
As is known, several typologies of garments need loops, which are small fabric or leather strips through which bands, belts, strings or similar elements pass.
As represented in FIG. 1, a loop 10 is usually fixed on an article of clothing 12 by means of seams 14 of the ends 18, 20 of the strip 16 that forms the loop. In particular, in order to make the fixing more stable, the ends 18, 20 are turned towards the article of clothing 12 so that the seam 14 is stitched on the portions 22, 24 of the strip 16, these portions being superimposed on the ends 18, 20 bent. In this way, it is possible to double the portion of strip sewn on the article of clothing and the seam is made more solid.
In order to stitch said seam, the sewing machines of the prior art comprise suitable devices which allow to bend the ends 18, 20 of the strip 16 inwards and to position the strip on the fabric area on which the loop has to be formed.
In particular, once the positioning devices according to the prior art have grabbed the strip 16 acting as a loop, the positioning devices rotate both ends 18, 20 180 degrees so that both ends are arranged under the remaining part of the strip 16.
The positioning devices according to the prior art do not ensure a perfect positioning of the strip ends 18, 20 to bend so that an unwished effect is obtained as represented in FIG. 2 from which it appears how the ends 18, 20 are not perfectly hidden under the remaining part of the strip 16.

Positioning device for the positioning of loops for sewing said loops and sewing machine comprising said device


The invention relates to a method for designing color filters which improve or modify color vision of the human eye. According to the invention a desired opponent signal function to be attained is divided by a real opponent signal function characteristic of the eye color vision to be improved or modified, the negative range of the resulting function is replaced by zero, the whole function is normalized to give a spectral transmission function, and, if desired, one or more section(s) of this spectral transmission function is modified. The invention also relates to color filter means designed by the above method.

Color vision of human eye starts to proceed with the stimulation of photoreceptors (also termed as cones), which can be found on the retina and are sensitive in three different wavelength regions, i.e. in the long (I) middle (m) and short (5) regions (see Stockman, A., Sharper L. T.: "The Spectral Sensitivities of the Middle and Long Wavelength Sensitive Cones Derived from Measurements in Observers of Known Genotype"; Vision Research 40, 1711-1739 (2000)). The process continues by forwarding the signals of these cones first into bipolar and then into ganglion cells (Rodiech, R. W: "The First Steps in Seeing", p. 38-40 (Sinaver Associates, Inc., Massachusetts, USA, 1998)). The signals exiting the ganglion cells transport the chromatic information to the brain, where the further steps of color vision proceed.
The spectral sensitivities of the photoreceptors on the retina playa basic role in the appearance of parachromatism. Early attempts to correct parachromatism were based on the assumption that with color deficients some of the receptors are simply less sensitive than the normal ones, thus the sensitivities of the other receptors (with normal sensitivity) were lowered proportionally in order to try to recreate the correct ratios between the sensitivities of all of the receptors. Methods and means disclosed in published Hungarian patent application No. P9800510, in Canadian Patent No. 5,574,517 and in U.S. Pat. Nos. 4,998,817, 5,574,517, 5,617,154, 5,369,453 and 5,846,457, furthermore the use of color filters which selectively transmit less light in the wavelength region where a specified receptor is sensitive can be regarded as such attempts for correction.
Some other methods based on the use of color filters aimed only at causing a certain increase in color contrast, without attempting to attain a real improvement of color vision (see e.g. the method disclosed in U.S. Pat. No. 6,089,712). Such color filters frequently even deteriorate the vision of colors, they enable, however, color deficients to see different colors in different brightnesses. With such filters the so-called pseudoisochromatic color vision tests (such as Ishihara, Velhagen and Dvorintests) can well be "decepted", without arriving at a real improvement in color vision.
Further investigations have shown that the basic reason for congenital color deficiency is that the spectral sensitivity functions (further on: SSF) of certain photoreceptors on the retina are shifted along the wavelength axis (Nathans, J.: The Genes for Color Vision; Scientific American pp. 35-38 {February, 1989)). This recognition well explains why the theory of decreased receptor sensitivity, which proved to be erroneous, could still remain for a prolonged period of time: namely if receptor sensitivity is measured only at a given wavelength, it may well occur that, just due to the shift, a part of SSF with lower sensitivity is observed.
The method disclosed in U.S. Pat. No. 5,774,202 makes use of the above recognition, wherein it has been also taken into account that the receptor SSFs may also be of incorrect shape, i.e. color deficiency is a result of SSFs with shifted position and/or of deformed shape. The principle of the method is that a color filter should be used, the spectral transmission function (a function where the percentage of transmitted light is plotted against the wavelength of the light for a given receptor type) of which corresponds to the quotient of SSF with correct shape and position to be attained and SSF with real (shifted) position and/or of deformed shape. This solution works well until the color filter has no adverse effects on other receptors with SSFs not to be corrected. This conflict is resolved so that the light transmission of the color filter is adjusted to the function calculated as discussed above only over a certain wavelength range, and the light transmission of the filter is maintained at a constant value at wavelengths outside of this range. The weak point of this solution resides just in this latter condition, since it is rather arbitrary to select the wavelength from which light transmission must remain unchanged.
All of the solutions discussed above intervene in the process of color vision from the side of receptors, i.e. from the input side. Although it has already been known (see e.g. pages 350-353 of Rodiech's textbook cited above) that a group of ganglion cells compares the signals of the I and m receptors and, as a result, transmits to the brain opponent signals which are proportional to (l−m), whereas a further group of ganglion cells compares the signals of the s receptors with the sum of l and m signals and, as a result, transmits to the brain opponent signals which are proportional to (s−(l+m)), no attempt was made to influence the intensity changes of the opponent signals as a function of the wavelength; i.e. feedback control from output side has not been applied before to correct color vision.

Method for designing color filters which improve or modify color vision of human eye, and color filter means designed by the method


A semiconductor device includes a semiconductor substrate which has first and second principal surface regions; an insulated gate structure which is formed in the first principal surface region; a back surface region semiconductor layer which is formed in the second principal surface region and has a thickness of at most 5 μm; an outermost metal film; and a back surface electrode which is formed in the second principal surface region between the back surface region semiconductor layer and the outermost metal film and which is composed of a plurality of films which are laminated and include a stress relaxation film so that false judgment of chip quality based on leakage current measurements during manufacturing is reduced particularly when dust is present and skews leakage current measurements due to strain on the wafer and the piezoelectric effect produced.

1. Field of the Invention
The present invention relates to a semiconductor device, such as an IGBT (insulated gate bipolar transistor), a MOSFET, a diode, or the like, that has a thin back surface region diffusion layer and a back surface electrode on the back surface side of a semiconductor substrate.
2. Description of the Related Art
IGBTs are voltage driven devices exhibiting a low ON voltage and a high switching speed. IGBTs have been utilized in diverse applications ranging from industrial inverters to household appliances such as microwave ovens. There are several types of structures in IGBTs including a PT (punch through) type, a NPT (non-punch through) type, and an FS (field stop) type. In the following description, "n" represents an n conductivity type and "p" represents a p conductivity type. A PT-IGBT (punch through insulated gate bipolar transistor) is formed using an epitaxial wafer, in which an n buffer layer and an n drift layer are epitaxially grown on a p semiconductor substrate. As a result, a wafer of such a device having a withstand voltage of 600 V has a thickness, for example, which ranges from about 200 to about 300 μm.
FIG. 5 is a sectional view of an essential part of an NPT-IGBT (non-punch through type insulated gate bipolar transistor). FIG. 5 is a sectional view of one cell in an NPT-IGBT chip, the latter including a multiple of cells.
As shown in FIG. 5, a p base region 3 is selectively formed in the front surface side of an n drift layer 2, which is an n semiconductor substrate 1 composed of an FZ wafer, for example, and not a diffusion layer. An n emitter region 4 is selectively formed in the front surface side of the p base region 3. A gate electrode 6 is formed on the front surface of the substrate and stretches from one n emitter region 4 in one p base region 3 to another n emitter region 4 in another p base region 3 which is separate from the former p base region 3, as shown in FIG. 5, with interposing of a gate insulator film 5 under the gate electrode 6.
Emitter electrode 8 is in contact with both the n emitter regions 4 and the p base regions 3, and insulated from the gate electrode 6 by an interlayer insulator film 7. On the back surface of the substrate 1, a p collector layer 10 and a back surface electrode 54 are formed in which the latter is a collector electrode. The p collector layer 10 and the back surface electrode 54 make up a back surface region structure 55. The reference numeral 18 in FIG. 5 designates a front surface region structure, the numeral 21, a solder, the numeral 22, a support conductor, and the numeral 60, a chip after cutting the wafer. The thickness of the n drift layer 2 of an NPT-type IGBT is greater than that of a PT-type IGBT. On the other hand, the p collector layer 10 in the NPT-type IGBT, when formed by ion implantation from the back surface side, can be made significantly thinner than the p collector layer 10 in a PT-type IGBT, which employs a high density p semiconductor substrate for a p collector layer. Therefore, wafer thickness can be remarkably reduced as compared with a PT-type IGBT device.
Recently, in order to reduce the ON voltage and the switching loss, FS-IGBTs (field stop type insulated gate bipolar transistors) have been developed that have an n semiconductor substrate with a reduced thickness and a back surface region diffusion layer (a field stop layer and a p collector layer) with a reduced thickness.
FIG. 6 is a sectional view of an essential part of an FS-IGBT. FIG. 6 is a sectional view of one cell in an FS-IGBT chip, the latter including a multiple of cells therein. As shown in FIG. 6, the device structure in the front substrate surface side (a front surface region structure 18) is the same as the front surface region structure 18 in the NPT-type device shown in FIG. 5. In the back surface region of the substrate, a buffer layer 9 (which is called a "field stop layer 9" in an FS-IGBT) is provided between the n drift layer 2 and the p collector layer 10. In the FS-type device, since the n semiconductor substrate 1 can be made very thin, the wafer thickness is remarkably reduced as compared with a PT-type device. Furthermore, the thickness of a wafer in the FS-type device, which includes a field stop layer 9, can be reduced as compared to that of a NPT-type device.
In this FS-IGBT, the thickness of the n semiconductor substrate 1 ranges from approximately 80 μm to 100 μm in a class of devices having a withstand voltage of 600 V, from approximately 100 μm to 140 μm in a class of devices having a withstand voltage of 1,200 V. The thickness of the filed stop layer 9, which stops the spread of a depletion layer, is about 1 μm. A p collector layer 10 with a thickness of about 1 μm is formed in contact with this field stop layer 9, forming a back surface region diffusion layer 16. On the surface of this collector layer 10, a back surface electrode 54, which becomes a collector electrode, is formed. The back surface electrode 54 is formed by laminating a plurality of metal films 51, 52.
The back surface electrode 54 consists of a titanium film 51 and a nickel film 52, in the order from the side in contact with the p collector layer 10, and joined to a support conductor 22 (such as a metal base) with a solder 21. Reference numeral 55 in FIG. 6 designates a back surface region structure, and reference numeral 60 designates a chip after cutting.
The front surface region structure 18 in FIG. 5 and FIG. 6 consists of p base region 3, n emitter region 4, gate insulator film 5, gate electrode 6, interlayer insulator film 7, emitter electrode 8, and a protective film (not shown in the figures). The back surface region structure 55 consists of the back surface region diffusion layer 16 and the back surface electrode 54.
FIGS. 7(a) through 7(c) illustrate a method of manufacturing the FS-IGBT of FIG. 6. FIGS. 7(a) through 7(c) are sectional views showing steps to manufacture essential parts in the order of the manufacturing steps. The reference numeral 18 designates the front surfaced region structure 18 and the reference numeral 55 designates the back surface region structure, details of the structures thereof being omitted in the figures for simplicity and clarity.
Referring to FIG. 7(a), a front surface region structure 18 is formed in the first principal surface region of wafer 30a. The back surface 20a is ground away to thin the wafer 30a down to a thickness of 140 μm. The reference numeral 30 in FIG. 7(a) designates the wafer that has been thinned by grinding which is being worked into n semiconductor substrate 1.
Referring to FIG. 7(b), a titanium film 51, a nickel film 52 and a gold film are laminated on the p collector layer 10 (which are not shown individually in FIG. 7(b), but are shown as back surface region structure 55) on the back surface 20 of the wafer 30. A region surrounded by scribe lines 62 of the wafer 61, on which the front surface region structure 18 and the back surface region structure 55 are formed, becomes a chip 60 in region 60a for forming the chip 60.
Referring to FIG. 7(c), after forming a chip 60 having a chip size 60 as exemplified, by cutting the wafer 61 along the scribe lines 62, the gold film on the back surface of the chip 60 is joined to a support conductor 22 (a copper base, for example) with a solder 21. This gold film, after joining, is absorbed in the solder 21 and disappears.
The FS-IGBT of FIG. 6 formed in the process as described above, is subjected to measurements of gate characteristics and withstand voltage characteristics during the stage of wafer 61 shown in FIG. 7(b). The measurements made in this stage are intended to find defective chips in this early stage and transfer only good chips to for further processing steps to reduce manufacturing costs.
FIG. 8 shows an arrangement for measuring the withstand voltage characteristics in the wafer stage. The wafer 61 is positioned on a stage 35 and held by pressing the periphery of the wafer 61 with metal fittings 63. A probe 64 is pushed against the surface of the wafer 61. A voltage is applied between collector and emitter of the region 60a for forming a chip 60 in which an FS-IGBT is formed, to measure leakage current using a curve tracer (plotter) 65. The applied voltage is set at a voltage to make a depletion layer reach the n field stop layer 9.
During the measurement, if any dust 36 is present on stage 35 shown in FIG. 8, the wafer 61 is placed on the dust 36 and, when the wafer is contacted and pushed by probe 64, the wafer 61 warps. When the dust has a particle size which is large enough to badly warp the wafer 61, a crack may result and the chip 60a may be rendered defective. When the dust 36 has a smaller particle size, the n field stop layer 9 in the area placed on the dust 36 distorts from the pressure exerted by the metal fitting 63 generating strain shown generally in area "O". Then, when the depletion layer reaches the n field stop layer 9, the leakage current increases abruptly due to the piezoelectric effect, and the chip is falsely judged to be defective. In this case, however, if the measurement is repeated after removing dust 36 to thus eliminate the strain, the chip tests as a good chip. A major type of dust 36 encountered consists of fragments of silicon particles broken from the periphery of the wafer during the manufacturing process. In the case a thick n field stop layer 9, however, an increase of leakage current due to the piezoelectric effect does not occur.
FIG. 9 shows the correlation between the rate of false judgment of leakage current and the chip size. The leakage current is measured for each chip 60a in the state of a wafer 61 as shown in FIG. 8. The chip size is the size of the region 60a for forming a chip as indicated in FIG. 7b. As can be seen from FIG. 9, the rate of false judgment rapidly increases above a chip size of 8 mm square, and becomes more than 60% at 11 mm square.
A rate of false judgment in leakage current measurement of chips is defined by the expression:(A−B)/A)×100(%)wherein A is the number of defective chips determined by leakage current in the measurement on a wafer 61, and B is the number of defective chips determined by leakage current measured on the chips cut out from the places of the chips that have been judged as defective. Initially, an address number is given to every region 60a for forming a chip in the stage of a wafer 61 shown in FIG. 7b. Leakage current is measured at every region 60a for forming a chip in the state of a wafer 61 to obtain the number of defective chips A. After dividing into chips, the leakage current is measured on the chips with the address number judged as defective, to obtain the number of defective chips B. By giving the address number to the regions 60a for forming a chip, it becomes possible to obtain the number of chips that have turned out to be good after being divided into chips from the regions 60a for forming a chip which were initially classified to be defective in the stage of a wafer 61. Here, such chips are excluded in the count of chips that have turned out defective in the leakage current measurement due to clacking or breaking during the process of dividing into chips. In the leakage. current measurement performed on each chip 60, the stage 35 is placed in a dust-free state by thorough cleaning prior to contact with the chip 60. Since the stage 35 on which a chip 60 is placed has a size which is approximately the same as that of the chip 60, and is smaller than one part in several tens of the size of the stage 35 on which a wafer 61 is placed, dust 36 can be thoroughly eliminated.
Japanese Unexamined Patent Application Publication No. 2004-103919 discloses a semiconductor wafer having semiconductor devices formed in the first principal surface region (front side) of the wafer and an electrode film on the second principal surface (back side) of the semiconductor wafer, in which a metal layer is formed on the second principal surface side interposing a titanium layer there between. This structure is stated to give a semiconductor wafer that is thin as finished and hardly warped.
Japanese Unexamined Patent Application Publication No. 2003-282589 discloses a process for making a wafer in which an impurity diffusion region for forming a semiconductor device in the surface region of one side of the wafer is provided, which is ground down to a predetermined thickness from the other side of the wafer; the wafer is etched to thin down to a predetermined thickness excepting the peripheral region; an impurity-doped polysilicon film is formed on this etched surface, from which impurities are diffused to form an impurity diffusion region for a contact; and a back surface electrode is formed in contact with the polysilicon film. This document asserts that this structure avoids the strength issue typical in a thin wafer and attains a contact on the back surface electrode at a relatively low temperature. This back surface electrode consists of a titanium film, a nickel film, and a gold film in this sequence from the polysilicon film in the state of a wafer.
Japanese Unexamined Patent Application Publication No. 2001-135814 discloses a vertical type MOSFET having a Schottky junction on the back surface side, in which the Schottky junction is formed using an Al—Si alloy with a thickness of 1,500 Å and a silicon content of at least 0.5 wt %. This document asserts that this structure achieves lower losses and costs.
Japanese Unexamined Patent Application Publication No. 2005-244165 discloses a wafer prepared for making semiconductor chips in which the principal front surface and the principal back surface of the wafer are in conformity with the principal front surface and the principal back surface of the semiconductor chips, respectively, and a back surface electrode is formed on the principal back surface of the semiconductor wafer. In the condition when the back surface electrode is fixed on a support conductor, after forming a front surface electrode on the principal front surface of the semiconductor wafer, the support conductor is removed and the semiconductor wafer is cut to form semiconductor chips. This document asserts that the distortion of the semiconductor wafer for making semiconductor chips is suppressed and is minimal. The back surface electrode consists of three layers, i.e., a titanium film, a nickel film, and a gold film in this sequence from the semiconductor side.
As described above with reference to FIGS. 6 through 9, when the back surface region diffusion layer 16 is thin and dust 36 is present on the stage 35 for measuring the characteristics, the region 60a for forming a chip in the wafer 61 suffers from cracking or from false judgment of leakage current thereby lowering the proportion of good chips deemed obtained. Moreover, when the particle size of dust 36 is about 10 μm or less, the proportion of false judgment of leakage current due to piezoelectric effect increases in the region 60a for forming a chip.
The four Japanese Unexamined Patent Applications discussed in the foregoing, however, do not mention the false judgment of leakage current at the region for forming a chip in the stage of a wafer, which is a problem when the back surface region diffusion layer is thin.
It is therefore an object of the present invention to solve the above problem and provide a semiconductor device in which the false judgment of leakage current due to piezoelectric effect at the region for forming a chip in the state of a wafer scarcely occurs even when dust is present on the stage for measuring the device characteristics.

Semiconductor device with back surface electrode including a stress relaxation film

Fuji Electric Device Technology Co., Ltd.


The present invention is a method for determining the software load process. In an exemplary aspect of the present invention, a method for determining computer system software load process may start with loading computer system software on a computer. Then a marker file may be provided in the loaded computer system software. The marker file may indicate whether the loaded computer system software was loaded in a computer manufacturer's factory, loaded by a system restoration CD (SRCD), or loaded by downloading an image. When a program running on the computer abnormally terminates and the computer is able to send the marker file to a central authority, the marker file may be sent to the central authority by the computer. When a program running on the computer abnormally terminates and the computer is not able to send the marker file to a central authority, the marker file may be sent to the central authority by the computer after the computer reboots. The present invention may be applied to determining a load process for any computer software, including any system software and any application software.

Almost every computer user has experienced such a situation: s/he is working on something on the computer and suddenly the computer either stops responding ("freezes") or shows the "blue screen of death" ("crashes"). There are several indications that let a user know that a computer may be frozen. The most common is the "unresponsive" program. The program will simply not do what you tell it to do. Additionally, the program may appear "stuck" in the task bar at the bottom of the screen (it will appear to be eternally minimized, never being capable of being opened for use by a user). Alternatively, a user may see a message pop up, telling the user that a program has performed an "illegal operation" or "is no longer responding;" these are ways the computer operating system tells the user that the program has frozen. A major indication that a computer may be frozen is that the mouse "freezes" in its place, and cannot be moved about the screen any more. The "blue screen of death" is probably the most obvious indication: a computer will flash to a blue-background with white text, listing a small amount of computer code alongside an error message.
There are many reasons why a computer may freeze or completely crash, among which the system software load process may be a major reason. Those of ordinary skill in the art will understand that software is a generic term for organized collections of computer data and instructions. Software is often broken into two major categories: system software that provides the basic non-task-specific functions of the computer, and application software which is used by users to accomplish specific tasks.
The computer system software load process may be critical to understanding and resolving the issue why a computer freezes or crashes. Thus, it would be advantageous to provide a method to determine the different system software load process: whether the loaded computer system software was loaded in a computer manufacturer's factory, loaded by a system restoring CD (SRCD), or loaded by downloading an image. By communicating the system software load information back to a central authority when or after a computer crashes or freezes, the computer manufacturer may be able to use such information (e.g., by performing a statistical analysis of the data, and the like) to trace the cause of why the computer crashes or freezes and find a corresponding solution.

Method for determining software load process


Disclosed herein is a folding recliner of a seat for vehicles which is able to execute both seat folding and reclining motions using only a single lever. The folding recliner of the present invention includes a lever unit, which has a lever pin and a lever, so that, when the lever is rotated in a predetermined direction, the lever unit is rotated around a reclining shaft so that the seat back enters an unlocked state. The folding recliner further includes a first link, which has a contact part on a lower end thereof, and a second link, which is rotated around a rotating shaft, coupled to the second link, by movement of the first link. The folding recliner further includes a spring, which is coupled between the second link and a frame unit, and a cam, which is rotated around the rotating shaft and has a locking protrusion. The folding recliner further includes a latch which is rotated around a folding shaft and has a curved edge part, so that the curved edge part contacts an upper end of the cam so that the seat back maintains an unfolded locked state thereof, and a locking notch formed at a predetermined position in the outer edge of the latch so that the locking protrusion of the cam is locked to the locking notch so that the seat back maintains a folded locked state thereof.

1. Field of the Invention
The present invention relates generally to folding recliners of seats for vehicles and, more particularly, to a folding recliner of a seat for vehicles which is able to execute both seat folding and reclining motions using only a single lever, so that the size of a linking mechanism and the number of elements are reduced, and manufacturing costs thereof are reduced, and in which a latch pin and a stopper link are provided in an arm frame, so that the folding and reclining motions of the seat can be separately executed and, as well, a malfunction in folding or reclining the seat is prevented from being induced.
2. Description of the Related Art
As well known to those skilled in the art, a vehicle seat comprises a seat cushion, which supports the weight of an occupant, and a seat back, which supports the back of the occupant.
Typically, the seat back is rotatably mounted to the seat cushion by a hinge, and the angle of the seat back with respect to the seat cushion can be adjusted according to the intended purpose of the occupant. For this, the seat back should be converted between a locked state, in which the seat back is locked to the seat cushion at a desired angle, and an unlocked state, in which the seat back is rotatable with respect to the seat cushion. To maintain the seat back in any state or convert the seat back, which has been in that state, into another state, a recliner is mounted on the seat.
In particular, a folding recliner of a seat for vehicles is constructed such that a seat back, which supports the back of an occupant, may be rotated forwards and folded onto a seat cushion.
For example, the folding recliner may be applied to a vehicle, such as a 3-door vehicle or a coupe vehicle having no rear passenger doors, so that passengers may easily enter or exit the rear seats of the vehicle. As another example, the folding recliner may be applied to a recreational vehicle (RV). In this case, the folding recliner is mounted to a rear seat, so that, in normal conditions, it allows a passenger to sit on the rear seat. When it is desired to load cargo into the recreational vehicle, the folding recliner allows the seat back to be folded onto the seat cushion such that a space sufficient to load the cargo is defined in a rear portion of the vehicle.
Recently, according to development of industries and increases in leisure time and the number of people who enjoy leisure, recreational vehicles, in which relatively large numbers of people can ride, and which have space sufficient to load cargo, are gaining popularity.
In the arrangement of seats of such a recreational vehicle, first-row seats, including a driver's seat and a passenger seat, are provided at a front position in a passenger compartment. Second-row seats are provided behind the first-row seats. Third-row seats are provided between the second-row seats and a cargo loading space.
Occupants can freely get on or off the first-row seats and the second-row seats through front doors and rear doors, respectively. However, in the case of the third-row seats, because there is no separate door for allowing the occupants to get on or off the third-row seats, the occupants must get on or off the third-row seats through the rear doors. Therefore, to allow the occupants to get on or off the third-row seats through the rear doors, a seat back folding recliner is used in at least one seat of the second-row seats so that the seat can be folded.
FIG. 1 is a view showing the construction of a conventional folding recliner of a seat for vehicles. As shown in FIG. 1, the conventional folding recliner includes a mounting plate 10, which is mounted to a seat frame of the seat. A recliner latch assembly 20 is mounted to the mounting plate 10, and a seat reclining device 40, which allows the seat to enter a reclining state when a lever 31 is manipulated, is provided.
Furthermore, a quadrant 50 is mounted to an upper end of the seat reclining device 40 so as to be rotatable around a hinge pin 22. A seat back latch device 60, which is rotatable around a pivot shaft 57, is mounted to the quadrant 50.
In the seat reclining device 40, when a cam 11 is rotated by the lever 31 in a predetermined direction, lock pawl 21 and teeth 24, which have been engaged with each other, are separated from each other, thus allowing a seat back of the seat to execute a reclining motion. Furthermore, a biasing spring 12 is coupled to an end of the cam 11 such that the lock pawl 21 and the teeth 24 maintain the engaging state using the elasticity of the biasing spring 12.
The seat back latch device 60 allows the seat back to be folded forwards and includes a support plate 80 mounted to the quadrant 50 so as to be rotatable around the pivot shaft 57. Both a lever 71 and a lock cam 72, which are rotated around a pivot pin 73, are mounted to the support plate 80. The lock cam 72 is rotated by manipulation of the lever 71. Thus, when a lock pin 62, which has been placed between the lock cam 72 and a first stop surface 58 of the quadrant 50, is released from the lock cam 72, the support plate 80 is allowed to be rotated so that the seat back can be folded.
In other words, when the lever 71 is rotated upwards, the lock pin 62 is released by a cam 11 and, simultaneously, the lock pin 62 is moved upwards by a connection bracket (not shown), which is coupled to and moved upwards by the lever 71. Then, the support plate 80, that is, the seat back, is allowed to be folded forwards.
Furthermore, in the state in which the seat back is folded forwards, when the lever 71 is rotated downwards, the lock pin 62 is moved downwards and thus is locked between the lock cam 72 and a second stop surface 52 of the quadrant 50.
However, in the above-mentioned structure, in which the lock pin 62 is moved by its weight, there is a problem in that the lock pin 62 may not smoothly move due to friction between a slot and the lock pin 62. Furthermore, the lock pin 62 may fail to unlock, so that the folding motion of the seat back is not executed.
As well, in the convention folding recliner, because the seat back reclining lever 31 and the seat back folding lever 71 are provided on the same side of the seat frame, there is a problem in that malfunction in folding or reclining the seat back is caused, for example, when it is desired to fold the seat back, a user may mistakenly manipulate the reclining lever 31, or, when a reclining motion of the seat back is desired, the user may mistakenly manipulate the folding lever 71.
Moreover, because the reclining lever 31 and the folding lever 71 are provided on the same side of the seat frame, a linking mechanism, which is operated by the levers, is complicated, and the size of the folding recliner is increased. In addition, there are problems in that manufacturing cost and labor cost are increased.