Ink jet printing is provided using ultraviolet (UV) light or other curable composition or stable or other printable substance having a dye-component therein. The ink is jetted onto a substrate, the composition is cured, then heated to set the dye. Sublimation dye-based UV ink printing onto polyester is preferred.

The present invention relates to ink jet printing, and particularly useful for ink jet printing onto textiles, onto wide web, large panel and other extended area substrates, and onto other substrates on a high speed and commercial scale.
Needs have arisen for the printing of large banners, flags and signs in quantities that are not economical for many conventional printing processes. Proposals have been made to print such products from electronic source files that can be processed directly on the printing press or printing system, rather than through steps such as film image-setting and plate-making. One such process is ink-jet printing. These processes have been attempted on surfaces such as vinyl, but printing with success onto textile surfaces has been even more limited. Such processes have been slow and lack reliability. The clogging of print heads in ink jet printing has been too frequent for use in wide width and large area substrates, and the processes used have not produced acceptable printing on textile materials.
The printing of substrates that are more than several feet, or a meter, wide, referred to as the special category of xe2x80x9cwide widthxe2x80x9d printing, into which category the printing of signs and banners, office partitions, mattress ticking and most other quiltable materials would fall, is beyond many of the limitations of conventional printing methods. A number of technical problems exist that have deterred the development of the printing of wide fabrics such as mattress covers, upholstery, automobile seat cover fabrics, office partitions and other wide width substrates.
Wide width products are frequently printed in relatively small quantities. Traditional printing typically involves the creation of a plate, a mat, a screen, or some other permanent or at least tangible, physical image from which ink is transferred to the object being printed. Such images contribute a relatively high set up cost that is only economical where the number of identical copies of the product is large. At the other extreme, office printers, for example, print a single copy or a small number of copies of a given document or other item, and are currently of the type that uses no permanent, physical image transfer element, but which rather prints from a software or program controlled electronic image, which can be changed from product to product. Such printing is sometimes referred to as direct digital printing, although the process need not necessarily be literally xe2x80x9cdigitalxe2x80x9d in the sense of a set of stored discrete numerical values. Ink jet printers are a common type of such direct digital printers in use today.
Ink jet printers print by projecting drops of ink on demand onto a substrate from one or more nozzles on one or more print heads. Office printers and other narrow width ink jet printers usually dispense water based or other solvent based inks onto the substrate by heating the ink and exploding bubbles of the ink out of the nozzles. These printers are often called bubble jet printers. The ink from such printers dries by evaporation of a solvent. Sometimes additional heat is used to evaporate the solvent and dry the ink. Printing onto wide width substrates with bubble type ink jet printers, or ink jet printers that use high temperature techniques to propel the ink, suffer from limited printhead life or high mean time between failures that require downtime and servicing. The heat used to expel the ink and to cause the evaporation of the solvents, evaporation that occurs during printhead downtime, and the thermal cycling of the heads, causes these print heads to clog or otherwise fail after as little as 20 milliliters of ink is dispensed. Office printers are, for example, often designed so that the print head is replaced every time a reservoir of ink is replenished. For this reason, for larger scale ink jet printing processes, such as wide width printing of films used for outdoor advertising, signage and architectural applications, print heads that use mechanical ink propulsion techniques are more common. Such mechanical print heads include piezo or piezo-crystal print heads, which convert electrical energy into intra-crystal vibrations that cause drops of ink to be ejected from print head nozzles.
Piezo print heads are particularly useful for applying inks that dry by polymerization which can be brought about after the ink leaves the print head and is deposited onto the substrate, usually by exposure to some form of energy medium such as electromagnetic or particle radiation. Inks have been formulated for ink jet printing that can be polymerized by exposure to a radiation curing source such as a focused beam of ultra violet light (UV) or high energy beams of electrons (EB). The inks generally incorporate stabilizers which prevent premature curing due to low levels of light exposure. Therefore, the inks usually require exposure to some threshold level of energy to initiate a polymerization reaction. Unless exposed to such threshold energy levels, such inks do not polymerize and remain stable, with a low tendency to dry in the nozzles or elsewhere unless cured by adequate exposure to the energy medium.
Solvent based inks are primarily cured by evaporation of the solvents. Some solvent based inks can be cured by only air drying, while others require the application of heat to enhance the evaporation of the solvent. In some cases, heat will facilitate a chemical change or polymerization of the ink along with an evaporation of a solvent. Polymerizable inks include monomers and oligomers that polymerize, and other additives. UV curable inks polymerize when exposed to UV light at or above the threshold energy level. These UV curable ink formulations include photo-initiators which absorb light and thereby produce free radicals or cations which induce cross-linking between the unsaturation sites of the monomers, oligomers and polymers, as well as other additive components. Electron beam-cured inks do not require photo-inhibitors because the electrons are able to directly initiate cross-linking.
Heat or air curable inks that are organic solvent based or water based inks often do not have as high a color intensity as UV curable or other polymerizable inks because the pigments or dyes that produce the color are somewhat diluted by the solvent. Furthermore, organic solvents can produce an occupational hazard, requiring costly measures be taken to minimize contact of the evaporating solvents by workers and to minimize other risks such as the risks of fire. Solvent based inks, whether applied with heat or not, tend to dry out and eventually clog ink jet nozzles. In addition, solvent based inks set by forming a chemical bond with the substrate, and accordingly, their formulation is substrate material dependent. As a result, the selection of solvent based ink varies from fabric to fabric. Specific ink compositions are paired with specific fabric compositions to improve the fastness of the ink to the fabric, which results from chemical or electrostatic bonds formed between the ink and the fabric. Where the selected ink composition does not react or otherwise has an affinity with the surface of the particular fabric, the ink merely maintains a physical contact with the fabric surface and typically is easily removed by water, another solvent or abrasion. With UV and other radiant beam-curable inks such as electron beam-cured inks, the bonding between the ink and fabric is primarily mechanical and not limited to specific combinations of ink and fabric.
Polymerizable inks, particularly those cured upon exposure to a radiation or energy medium, are difficult to cure on three dimensional substrates such as the surface of a textile. While UV curable inks are capable of providing higher color intensity and do not present the hazards that many solvent based inks present and can avoid nozzle clogging, printing with UV curable ink onto textile fabric presents other problems that have not been solved in the prior art. To cure UV ink, for example, it must be possible to precisely focus a UV curing light onto the ink. UV ink, when jetted onto fabric, particularly onto highly textured fabric, is distributed at various depths over the texture of the fabric surface. Furthermore, the ink tends to soak into or wick into the fabric. As a result, the ink is present at various depths on the fabric, so that some of the ink at depths above or below the focal plane of the UV curing light evade the light needed to cause a total cure of the ink. In order to cure, UV ink must be exposed to UV light at an energy level above a curing threshold. However, increasing the intensity of the curing light beyond certain levels in order to enhance cure of the ink can burn, scorch or otherwise have destructive effects on the deposited ink or the fabric. Furthermore, ink jet printing can be carried out with different ink color dots applied in a side-by-side pattern or in a dot-on-dot (or drop-on-drop) pattern, with the dot-on-dot method being capable of producing a higher color density, but the higher density dot-on-dot pattern is even more difficult to cure when the cure is by UV light.
In addition, UV ink can be applied quickly to reduce wicking and UV ink can be developed to allow minimized wicking. Some wicking, however, can help to remove artifacts. Further, many inks developed to eliminate wicking leave a stiff paint-like layer on the surface of the fabric, giving the fabric a stiff feel or xe2x80x9cbad handxe2x80x9d. Therefore, to reduce the UV curing problem by eliminating wicking is not always desirable.
UV curing of jetted ink on fabric has been plagued by a limited cure depth that is determined by the depth of field of the focused curing UV light. When UV curable ink is jetted onto fabric, UV light may be ineffective to cure a sufficient portion of the ink. A large uncured portion of the deposited ink can cause movement of the ink or the loss of the ink over time, resulting in deterioration of the printed images. Even if a sufficient portion of the ink is cured to avoid visibly detectable effects, uncured ink at some level has the possibility of producing symptoms in some persons who contact the printed fabric. The amount of uncured monomers or ink components that can cause problems by inhalation or direct skin contact has not been officially determined, but standards exist for determining limits for components of packaging material ingested with food. For example, if more than approximately 100 parts per million (PPM) of ink from packaging material is present in food, some persons who are sensitive to the uncured monomers may suffer reactions and others may develop sensitivities to the material. Such criteria assumes that 1 square inch of packaging material makes contact with ten grams of food. Thus, to interpret this criteria, it is assumed that each PPM of ink component in packaged food is equivalent to 15.5 milligrams of ink component migrating out of each square meter of packaging material into the food. While this does not provide an exact measure of the amount of uncured ink components that might be harmful to humans, it suggests that approximately 10% of uncured ink components on items of clothing, mattress covers or other fabrics with which persons may be in contact for extended periods of time, may be unacceptable.
For the reasons stated above, UV curable inks have not been successfully used to print onto fabric where a high degree of cure is required. Heat curable or other solvent based inks that dry by evaporation can be cured on fabric. As a result, the ink jet printing of solvent based inks and heat curable or air dryable solvent based ink has been the primary process used to print on fabric. Accordingly, the advantages of UV or other radiation curable ink jet printing have not been available for printing onto fabric.
UV inks, other polymerizable inks and other stable inks are typically those that reside on the surface of the substrate. The color components of the inks are in the form of pigments suspended in a polymer or other curable matrix. When the printed substrate is washed or exposed to weather or wear, the ink coating usually fades or otherwise degrades. Inks containing dyes, on the other hand, provide color fastness because the dye dissipates into and becomes chemically or mechanically bonded to the fibers of the substrate. Such dye-based inks are particularly useful in printing on polyester substrates, where sublimation dyes effectively bond to the polyester fibers. But because such inks employing dyes as the color component have traditionally required a solvent to suspend and carry the dye to the substrate, dye-based inks have resulted in xe2x80x9cdrop-spreadxe2x80x9d, wicking of the ink, or blurring of the images that are being printed. As a result, the need to reduce this drop-spread with dye-based inks has necessitated the use of transfer processes rather than direct digital printing.
There exists a need for clog free ink-jet printing with stable inks that are completely curable, result in color fast images, with a minimum of drop spread.
Objectives of the present invention include providing ink-jet printing with stable inks, providing for the complete curing of such inks, and providing for producing color fast images with such printing, particularly with a minimum of drop spread. A further and more particular objective of the invention is to provide for the ink jet printing of dye-based inks.
One objective of the present invention is to provide an effective method and apparatus for wide width direct digital printing, and for printing onto textiles. Another objective of the invention is to effectively apply a stable curable ink onto a textile or other substrate and to effectively cure the ink on the substrate with UV or other energy, a chemical curing agent or other curing medium, and particularly doing so using ink jet printing.
A further objective of the invention is to successfully apply and effectively cure ink jetted onto textiles and other substrates in a reliable manner without a tendency of the nozzles of the heads to frequently clog. Particularly, it is an objective of the invention to print onto textile fabrics and wide width substrates with a piezo or other mechanical or electro-mechanical print head.
Another objective of the invention is to provide for the printing onto textiles and other textured or wide width substrates using a printable substance that remains stable until deposited onto the surface of the substrate, and particularly by curing the substance a sufficiently short time from when the substance contacts the substrate to freeze the substance and prevent the spreading thereof. It is a further objective of the invention to do so while providing color fastness or other advantages of dye-based inks.
A particular objective is to provide such a process for printing with UV ink or other inks that are curable by exposure to impinging energy. A particular objective of the invention is to provide for the effective curing of UV inks jetted onto textile or fabric by reducing uncured monomers and other extractable non-solvent polymerization reactants, including reactant byproducts, or components of the ink, to a level most likely to be tolerable by or acceptable to persons contacting the printed substrates.
According to the principles of the present invention, a stable ink is digitally printed onto fabric and setting of the ink is initiated after the ink is deposited onto the substrate. By a xe2x80x9cstable inkxe2x80x9d is meant one that will not begin to cure, thicken or otherwise change properties in a way that will adversely affect the ability to apply the ink to the substrate, unless and until such ink is exposed to a curing medium that is otherwise absent from its environment. Inks that begin to set or which thicken upon evaporation of a solvent are not stable as herein defined. Inks that begin to polymerize before being exposed to UV light from a particular light source or to chemical agents that are provided to contact the inks after being applied to a substrate are also not considered stable.
In the preferred embodiment, stable UV ink monomers are deposited onto the substrate and polymerization of the ink is initiated by exposure to an impinged energy beam, such as UV, EB or other such energy beam. In accordance with certain aspects of the invention, the UV exposed or otherwise polymerization initiated ink is thereafter subjected to heat to reduce the content in the ink of unpolymerized polymerizable reactants and other extractable components of the ink to low levels that are likely to be tolerable or otherwise acceptable to persons contacting the fabric.
According to embodiments of the invention, stable dye components are added to the otherwise polymerizable or stable ink or other printable colorant or substance to form a stable composition. The composition is digitally printed onto the substrate, whereupon the dye component is brought into contact with fiber surfaces in the fabric to chemically bond or form an affinity with those surfaces. Polymerization of the UV or other curable ink component is initiated by exposure to an impinged energy beam, such as UV, EB or other such energy beam. This exposure is preferably carried out upon contact of the substrate by the substance or immediately after. This effects at least a surface cure of the UV or other curable ink component, freezing the dots on the substrate surface and preventing dot spread, but generally has little effect on the dye component. Then the partially polymerized or cured printed substance is thereafter subjected to heat to complete chemical bonding of the dye or to finalize formation of its affinity to the fiber surfaces, and to reduce the unpolymerized polymerizable reactants and other extractable components of the UV or other curable component. In particular, the invention provides for an ink composition which contains, in combination with the UV ink or other inks curable by exposure to impinging energy, one or more dyes which are both reactive or have an affinity to some or all of the fiber surfaces of the fabric and are compatible with the UV or other curable ink. The UV inks or other inks curable by exposure to impinging energy are comprised of a polymerizable portion and at least one pigment, suspended in the polymerizable portion.
The ink composition incorporates a separate dye component which is combined with the UV or other impinging energy curable ink base. The base may or may not also contain pigment. The dye component of such compositions may be selected from the group including, but not limited to, dispersion dyes, reactive dyes, acid dyes, basic dyes, metallized dyes, naphthol dyes and dyes that do not require a post-treatment to either set the dye or to develop the color. Dispersion dyes are widely used for dyeing most manufactured fibers, including particularly the fibers of polyester and other synthetic textiles. Reactive dyes are anionic dyes which react with hydroxyl groups in cellulose fibers in the presence of alkali. Acid dyes are used on wool and other animal fibers, as well as certain manufactured fibers such as nylon. Basic dyes are positive-ion-carrying dyes which have a direct affinity for wool and silk. These dyes may also be used on basic-dyeable acrylics, modacrylics, nylons, and polyesters. Naphthol dyes are formed on the fiber by first treating the fiber with a phenolic compound in caustic solution and then applying a solution of a diazonium salt. the salt reacts with the phenolic compound to produce a colored azo compound. Generally, these dyes are used for cellulose fibers.
Dye based inks according to the present invention may also be applied to solid non-textile articles, as for example ceramic mugs and plates. Such articles are coated with acrylates or other polymeric substances to which dyes such as dispersion dyes can bond. With the invention, the traditional transfer printing process used for such articles can be replaced with direct digital printing with dye-based polymerizable ink.
In certain embodiments of the invention, a stable ink composition is jetted onto fabric and the set or cure of the ink is initiated by exposure to a chemical substance, energy or otherwise after it is ejected from the ink jet nozzles. In the preferred and illustrated embodiments, UV polymerizable ink is jetted onto the substrate where it is exposed to UV light for its cure. Preferably, a non-bubble jet print head such as a piezo-crystal or other mechanical ink ejection transducer is used to jet the ink. Heat may be applied to the piezo-crystal or other mechanical ink injection transducer during operation, but generally only to the extent necessary for ink viscosity reduction. With or following the exposure to the UV light, the printed fabric is subjected to heat, either in the form of a heated air stream, a heated platen or other heat source, which either extends the UV light initiated curing process, drives off uncured components of the ink, or both. Any dye component suspended in the ink is also activated and set by the heat. With a sublimation dye component the suspended dye particles are believed to sublime into molecule sized particles which are highly reflective and produce intense color. These molecules disperse into cavities in the substrate, into pores on the textile fiber surface, or elsewhere in the cured matrix of the polymerizable ink component, where they are fixed upon cooling.
Typically one or more sets of four print heads are privided on a carriage, with each of the four heads of each set configured to scan the substrate sequentially to deposit each of four colors of a CMYK color set. In a preferred embodiment, two sets of four print heads each are configured so that each set prints the same four colors in a two printhead wide strip, or alternatively, the sets are configured and controlled to print over the same area with each of eight colors.
More particularly, UV curable ink is jetted onto the substrate, and the jetted ink is exposed to UV curing light to cure the UV ink component to an extent sufficient to render the printed image substantially resistant to further wicking, which is generally about 60 to 95% polymerization depending on ink density, substrate porosity and composition, and substrate weight and thickness. Preferably, UV light curing heads are mounted on the carriage carrying the printheads across the substrate, one on each side of the heads, with the lights alternating during the bidirectional motion of the printheads to expose the ink immediately after being deposited on the substrate with light from the trailing light curing head. The light curing heads are directed onto the substrate to expose the ink immediately after it contacts the substrate to freeze the dots of ink and curtain the wicking of the ink into textile and other absorbent fabric. Then, the fabric bearing the partially cured jetted ink is heated with heated air in a heat curing oven or by contacting the substrate with a heated platen or both, at which time the UV light initiated polymerization may continue, or uncured monomers are vaporized, or both, in order to produce a printed image of UV ink that contains a reduced level of uncured monomers or other components of the ink which is likely to be tolerable by persons sensitive or potentially sensitive to such ink components. Where dye is included in the ink, the presence of heat facilitates chemical bonding or affinity formation of unreacted dye in contact with fiber surfaces in the fabric. Preferably, the uncured components of the ink are reduced to an order of magnitude of about a gram per square meter, for example, and generally not more than about 1.5 grams per square meter of uncured monomer on the fabric substrate.
In the preferred embodiments, linear servo motors are provided to drive the print heads, at least transversely, over the substrate. Linear motors are easier to tune, require little service, and have better acceleration and deceleration than belt or other drive systems. Such servos provide accuracy that enables printing to be carried out while the heads are accelerating or decelerating. Programmed compensation is made for the variable head speed by the timing of the jetting of the ink. Thus, areas of the substrate having no printing can be skipped at high speed, greatly improving the speed and efficiency of the print operation by minimizing the time during which the print head is not depositing ink on the substrate.
To the extent that a dye component is included which does not bind chemically to the fiber surfaces or form an affinity, the portion of dye which does not react with the surfaces is encapsulated within the polymerized UV ink composition to minimize migration of the dye. This encapsulation effect reduces or eliminates the need for post-treatment to remove the mobile dye from the fabric.
According to the preferred embodiment of the invention, ink is jetted onto a textile material or a highly textured fabric such as a mattress cover ticking material, preferably prior to the quilting of the fabric into a mattress cover. The ink is jetted at a dot density of about 180xc3x97256 dots per inch per color to about 300xc3x97300 dots per inch per color, though lower dot densities of from about 90xc3x97256 dots per inch or as low as about 90xc3x9790 dots per inch can be applied with acceptable resolution for certain applications. Typically, four colors of a CMYK color palette are applied, each in drops or dots of about 75 picoliters, or approximately 80 nanograms, per drop, utilizing a UV ink jet print head. A UV curing light head is provided, which moves either with the print head or independent of the print head and exposes the deposited drops of UV ink with a beam of about 300 watts per linear inch, applying about 1 joule per square centimeter. Generally, UV ink will begin to cure, at least on the surface, at low levels of energy in the range of about 20 or 30 millijoules per square centimeter. However, to effect curing in commercial operation, higher UV intensities in the range of about 1 joule per square centimeter are desired. Provided that some minimal threshold level of energy density is achieved, which can vary based on the formulation of the ink, the energy of the beam can be varied as a function of fabric speed relative to the light head and the sensitivity of the fabric to damage from the energy of the beam.
The fabric on which the jetted ink has been thereby partially UV cured is then passed through an oven where it is heated to about 300xc2x0 F. for from about 30 seconds up to about three minutes. Forced hot air may be used to apply the heat in the oven, but other heating methods such as infrared or other radiant heaters may be used. Alternatively, heated platens may be used to heat the ink bearing material, and such platens are particularly effective in bringing the material quickly up to the 300xc2x0 F. temperature. The UV energy level, oven heating temperature and oven heat time may be varied within a range of the above listed values depending on the nature of the fabric, the density, type and composition of the applied ink; and the speed of the fabric during processing relative to the UV curing light head. Thus, a higher ink density applied to the fabric will generally require more UV energy, higher oven heating temperature, longer oven heat time or a combination of these variables, to effect the necessary curing on the particular fabric. With dye-based inks, the temperature should be that most effective to set the dye, often over 350xc2x0 F., for example, at about 385xc2x0 F.
The reliability of the printing processes may be enhanced, according to certain aspects of the invention, by preconditioning the substrate, such as by precoating, shaving or singeing of the surface to be printed. Such preconditioning eliminates dust and lint that could collect on the print heads and potentially contribute to clogging of the nozzles.
The invention further provides an online printhead cleaning station for automatic cleaning of the printheads during the course of the printing process. Preferably, periodically during the course of the printing of an extended area substrate, the printhead carriage is traversed to the printhead cleaning station where ink is jetted from the heads to purge the nozzles and the heads are wiped of ink and foreign matter that might have collected on them.
The invention further provides for an ink composition which contains, in combination with the UV ink or other inks curable by exposure to impinging energy, one or more dyes which are both reactive or have an affinity to some or all of the fiber surfaces of the fabric and are compatible with the UV or other curable ink. The UV inks or other inks curable by exposure to impinging energy are comprised of a polymerizable portion and at least one pigment, suspended in the polymerizable portion.
Stable dye components can be added to the otherwise polymerizable ink to form a stable composition. The composition is digitally printed onto the substrate, whereupon the dye component is brought into contact with fiber surfaces in the fabric to chemically bond. Further, the amount of heat applied is that needed to cause reaction or form an affinity with those surfaces. Polymerization of the UV or other curable ink component is initiated by exposure to an impinged energy beam, such as UV, EB or other such energy beam. This effects at least a surface cure of the UV or other curable ink component, but generally has little effect on the dye component. Then the partially polymerized or cured ink is thereafter subjected to heat to both complete chemical bonding of the dye or finalizing formation of an affinity to the fiber surfaces and reduce the unpolymerized polymerizable reactants and other extractable components of the UV or other curable ink component to low levels that are likely to be tolerable or otherwise acceptable to persons contacting the fabric. Where such dye is included in the ink, the presence of heat facilitates chemical bonding or affinity formation of unreacted dye in contact with fiber surfaces in the fabric.
Where the ink composition incorporates a separate surface of the substrate is a function of at least the dye component which is combined with the UV or other curable ink base, the dye portion of such ink compositions may be selected from dyes that are stable and are compatible with the ink and the substrate, and are selected from the group that includes, but is not limited to, disperse dyes, reactive dyes, acid dyes, basic dyes, metallized dyes, naphthol dyes and other dyes which do not require a post-treatment to either set the dye or to develop the color. Disperse dyes are widely used for dyeing most manufactured fibers. Reactive dyes are anionic dyes which react with hydroxyl groups in cellulose fibers in the presence of alkali. Acid dyes are used on wool and other animal fibers, as well as certain manufactured fibers such as nylon. Basic dyes are positive-ion-carrying dyes which have a direct affinity for wool and silk. these dyes may also be used on basic-dyeable acrylics, modacrylics, nylons, and polyesters. Naphthol dyes are formed on the fiber by first treating the fiber with a phenolic compound in caustic solution and then applying a solution of a diazonium salt. the salt reacts with the phenolic compound to produce a colored azo compound. Generally, these dyes are used for cellulose fibers.
To the extent that a dye component is included which does not bind chemically to the fiber surfaces or form an affinity, the portion of dye which does not react with the surfaces is encapsulated within the polymerized UV ink composition to minimize migration of the dye. This encapsulation effect reduces or eliminates the need for post-treatment to remove the mobile dye from the fabric.
Further, the amount of heat needed to cause reaction or form an affinity of the dye component, when included, with the fiber surface of the fabric is a function of at least the dye component concentration, dye chemical composition, fiber composition, and fabric processing speed past or through the heat source. Generally, the upper limits for the UV or other impinging beam of energy and oven heating temperature are those values which, when applied to the specific ink and fabric, begin to damage or otherwise adversely affect the applied ink, the underlying fabric or both.
The invention has the advantage that, for different inks and using different criteria for the desired residual amount of uncured ink components remaining on the substrate, the parameters can be varied to increase or reduce the residual amount. By increasing or decreasing the intensity of energy, or using a different form of energy than UV, or by increasing or decreasing the time of exposure of the ink to the energy, the amount of remaining unpolymerized non-solvent ink components can be changed. Additionally, using higher or lower temperatures, or more or less air flow, or greater or less heating time in the post curing oven, can change the final composition of the ink on the substrate. Care, however, should be taken that the energy curing or heating process does not damage the fabric or the ink.
A further advantage of the invention is that a portion of the ink composition can be included that will combine with fiber surfaces to provide coloration which is chemically bonded or has an affinity to those surfaces. Color or wash fastness due to chemical reaction or affinity formation of the dye to fiber surfaces over at least a portion of the printed fabric is accomplished while maintaining the advantage of mechanical bonding of the UV ink component onto other portions of the fiber.
The invention makes it possible to print images on fabric with UV curable ink by providing effective curing of the ink, leaving less than a nominal 1.5 grams of uncured monomers per square meter of printed material and usually leaving only about 0.15 grams per square meter of uncured monomers. Thus, the invention provides the benefits of using UV curable ink over water and solvent based inks, including the advantages of high color saturation potential, low potential sensitivity or toxicity, and without clogging the jet nozzles and enabling the use of piezo or other high longevity print heads. Furthermore, the encapsulation effect provided by the cured UV ink substantially or completely prevents migration of non-binding dye, if included, onto other sections of the fabric, or onto other fabrics as in the case of washing the printed fabric with other items. Furthermore, the ability to print on wide width fabrics with polymerizable inks, which do not form chemical bonds with the substrates, and therefore are not material dependent, provides an advantage, particularly with fabrics such as mattress covers and other furniture and bedding products.
The invention also makes possible the digital printing of sharp, clear images with dye-based inks on surfaces where the spreading of the dots has heretofore occurred.
These and other objects of the present invention will be more readily apparent from the following detailed description of the preferred embodiments of the invention.

Method and apparatus for ink jet printing


Coin wars game systems is a coin toss game similar to a table game but played on a larger scale such as on a floor or outdoors. A board having a target or series of targets on its top side is placed on a flat surface and at least two participants toss coins at a target on the board, the target having a value graduated image, attempting to score the most points. Each participant has a card printed with instructions and commands. The participant also assumes the identity of the entity listed on the card with the given authority level, and the distance from the target that participant stands to toss the coins. The loosing participants must perform a predetermined number of repetitions of a given exercise after each round.

The following includes information that may be useful in understanding the present invention(s). It is not an admission that any of the information provided herein is prior art, or material, to the presently described or claimed inventions, or that any publication or document that is specifically or implicitly referenced is prior art.
1. Field of the Invention
The present invention relates generally to the field of games and more specifically relates to a coin tossing and exercising game.
2. Description of the Related Art
Tabletop game is a general term used to refer to board games, card games, dice games, miniatures war-games, tile-based games and other games that are normally played on a table top or other flat surface. The term is used to distinguish these types of games from sports and video games. The term is also used to distinguish role-playing games from role-playing video games, although role-playing games may not necessarily require a wide playing surface. Table games can also be divided into gambling and non-gambling categories. Table top games have been a part of American culture as well as part of other cultures for centuries. Table type games most often centered on gambling in earlier times and are still popularly employed in the gambling industry.
Families often play non-gambling type table games at family get-togethers and reunions as a tool for relaxing and bonding with other family members. Some families regularly play table games as a form of entertainment. Table games utilize a wide variety of devices, and combinations of devices, along with myriads of different rules. Some games are played on a larger scale and played on a larger area such as a floor or outside in a yard, but are still virtually a form of the table game. The thing that most all of the non-sport type games have in common is that they are more sedentary in nature though of a competitive nature. While entertaining, they may add to the health issues of average families, due to the amount of inactivity.
One of the biggest health issues of Americans in modem America is the pre-occupation with sedentary activities, compounded by high fat diets. A method of spurring families to exercise during periods of fun and enjoyment is needed for those not desiring or able to participate in the more highly physical sports activities is needed.
Various attempts have been made to solve the above-mentioned problems such as those found in U.S. Pat. Nos. 5,282,635; 2008/0116644; and 5,110,139. This prior art is representative of object tossing games. None of the above inventions and patents, taken either singly or in combination, is seen to describe the invention as claimed.
Ideally, a non-sport game should require a greater amount of movement and physical activity, and, yet, be user-friendly and would operate reliably and be manufactured at a modest expense. Thus, a need exists for a reliable coin wars game system to provide a method of entertainment and bonding while receiving exercise, and to avoid the above-mentioned problems.


A non-volatile semiconductor memory device and related method of determining a read voltage are disclosed. The non-volatile semiconductor memory device includes; a memory cell array including a plurality of memory cells, a read voltage determination unit configured to determine an optimal read voltage by comparing reference data obtained during a program operation with comparative data obtained during a subsequent read operation and changing a current read voltage to a new read voltage based on a result of the comparison, and a read voltage generation unit configured to generate the new read voltage in response to a read voltage control signal provided by the read voltage determination unit.

The inventive concept relates to semiconductor memory devices, and more particularly to a method of determining a read voltage for non-volatile semiconductor memory devices. The inventive concept also relates to memory cards and memory systems incorporating such memory devices.
Semiconductor memory devices (hereafter, "memory devices") include volatile memory devices and non-volatile memory devices. Volatile memory devices are generally characterized by fast data access write speeds, but lose stored data in the absence of applied power. In contrast, non-volatile memory devices generally provide slower data access speeds but retain stored data in the absence of applied power.
Conventional nonvolatile memory devices include phase-change random access memory (PRAM), mask read-only memory (MROM), programmable read-only memory (PROM), erasable programmable read-only memory (EPROM), and electrically erasable programmable read-only memory (EEPROM). With respect to MROM, PROM, and EPROM among nonvolatile memory devices, it is relatively difficult for users to enter (or update) data since erase and write operations cannot be freely performed. On the other hand, data may be electrically erased and written in EEPROM. Because of this ease of use, EEPROM has been increasingly used in various systems (including auxiliary data storage devices) as a data storage media for programming as well as payload data.
Within the broader class of EEPROM devices, flash EEPROM (hereinafter, "flash memory") is characterized by high integration density of memory elements and is thus very advantageous when used as a large-capacity auxiliary memory device. Accordingly, many types of flash memory are widely used in small electronic devices such as the digital camera, digital camcorder, digital music player, etc. These devices particularly benefit from the high data storage capacity, easy data access capabilities, and compact size of flash memory.
In its operation, flash memory determines whether electrons have been injected onto a floating gate via a conventionally understood phenomenon known as Fowler-Nordheim (F-N) tunneling. That is, the quantity of injected electrons on the floating gate may be interrupted as respective data states for a memory cell in flash memory (e.g., first and second logic levels for a binary memory cell). For example, during a program operation, a voltage of 15V is applied to the gate of the selected memory cell to enable F-N tunneling. As F-N tunneling proceeds and a greater quantity of electrons are injected onto the floating gate, the threshold voltage (Vth) of the memory increases. During an erase operation, a voltage of 20V is applied to the body (or semiconductor bulk) of the selected memory cell to again enable F-N tunneling. However, the flow of electrons from the floating gate during the erase operation is the reverse of the flow of electrons to the floating gate during the program operation. Accordingly, during the erase operation the threshold voltage Vth of the memory cell decreases.
Due to certain well known operating characteristics related to flash memory, the repeated execution of program and erase operations (or program/erase cycles) stresses and ultimately deteriorates the thin gate oxide film through which electrons pass during F-N tunneling. Once the gate oxide film deteriorates to a certain degree it is no longer capable of preventing the discharge, over time, of electrons injected onto the floating gate. This unintended discharge of electrical charge decreases the threshold voltage of the memory cell. Figure (FIG. 1 illustrates this life-cycle characteristic of flash memory.
FIG. 1 shows the migration of threshold voltage characteristics for a flash memory cell over its useful life (i.e., over a number of program/erase cycles). In FIG. 1, the upper graph (a) shows a memory cell threshold voltage distribution (hereafter "cell distribution") just after a successful program operation. The comparative lower graph (b) shows the cell distribution for the same flash memory cell following a period of time after programming. This drift in threshold voltage caused by a loss of stored charge through a deteriorated gate oxide film is symptomatic of a heavily worn flash memory cell (i.e., a memory cell degraded in its data storage capabilities by numerous program/erase cycles).
Referring to the graphs (a) and (b) of FIG. 1, it can be seen that the overall field of threshold voltage states (e.g., erase and P1-P7) for the flash memory cell is shifted to the left by generally reduced threshold voltage levels. Further, threshold voltage distribution broadening is apparent as respective threshold voltages become less distinct over time. Ultimately, the combined effects of shifted (reduced) threshold voltages and less distinct threshold voltages make data discrimination during a read operation to a heavily worn flash memory cell quite difficult, if not impossible.
The foregoing effects notwithstanding, a flash memory cell's threshold voltage distribution may also be shifted in the other direction (i.e., increased) by so-called coupling effects between proximate memory cells during program operations. Here again, any undesired shift (up or down) and/or broadening/narrowing of a threshold voltage distribution (collectively or individually "threshold voltage migration"), regardless of underlying cause, may result in data errors during subsequent read operations.

Non-volatile memory device, memory card and system, and method determining read voltage by comparing referenced program data with comparative read data


A method of lithography patterning includes coating a resist layer on a substrate; performing an exposing process to the resist layer using a lithography tool with a numerical aperture tuned between about 0.5 and about 0.6; baking the resist layer; thereafter performing a first developing process to the resist layer for a first period of time; and performing a second developing process to the resist layer for a second period of time.

When the semiconductor technologies are continually progressing to smaller feature sizes, a patterned resist layer is used to produce such small size features. Maintaining a desired critical dimension (CD) can be very difficult for various reasons. The current photoresist (or resist) is capable of achieving a low numerical aperture (NA), low post-exposure baking (PEB) such as 130 C, and single puddle developing. Furthermore, when the feature size is reduced in the advanced technology nodes, the resist has a thickness more than 25,000 angstrom and aspect ration of 15 or higher. The existing resist may have acceptable performance at the aspect ratio up to about 10 and cannot meet the criteria of the resist with aspect ratio 15 or higher. For example, the patterned resist in the existing technology could suffer seriously top loss and scum issues, causing rounding profile and bridging.

Single photoresist approach for high challenge photo process

Taiwan Semiconductor Manufacturing Company, Ltd.


The present invention relates to a bispecific molecule comprising at least one anti-CD38 domain and at leak one anti-PD-L1 domain, which are capable of simultaneous binding to CD38 and PD-L1 antigens, respectively.

Multiple Myeloma (MM) is the third most common haematological malignancy with 114,000 cases globally per year. Despite advances in treatment, MM remains one of the few haematological malignancies with an unmet medical need. Once patients progress through front-line therapy and have relapsed or refractory (r/r) disease, treatment options are very limited. However, in the recent years anti-MM tumor target antigens (TAA) have been developed. One anti-CD38 antibody, daratumumab, has been approved for the treatment of patients with relapsed MM and other anti-CD38 antibodies are currently in development (isatuximab and MOR-202, which is described in U.S. Pat. No. 8,263,746). However, there is a need to improve responses that are currently in the range of 30-35%. It was demonstrated that the activity of anti-CD38 antibodies may be enhanced by immunomodulatory therapeutics (e.g. lenalidomide), which stimulate the immune system of patients. Additionally it was demonstrated that one of the mechanisms of resistance of MM tumor cells to antibody therapies is associated with the increased signalling of checkpoint inhibitor pathways (e.g. PD-1/PD-L1). Therefore, there is an opportunity to enhance cytotoxicity of anti-CD38 antibodies against MM tumor cells and simultaneously activate the immune system by inhibiting checkpoint inhibitor pathways (e.g. PD-1/PD-L1).
In physiological conditions, PD-L1 plays a major role as guard against autoimmunity by down-regulating the immune system. It is expressed on immune "APC-like" cells (T cells, NK cells, macrophages, myeloid DCs, B cells, epithelial cells, vascular endothelial cells) and tumor cells. PD-L1 binds to its cognate receptors PD-1 and B7-1, and negatively regulates immune cells (T cells, NK cells, etc.), by inhibiting their proliferation and activation.
In pathological conditions, PD-L1 is highly expressed by tumor cells (>90% MM patients) and is associated with poor prognosis. Blocking antibodies targeting immune checkpoint pathways (anti-PD-1, anti-CTLA-4, anti-PD-L1, etc.) have demonstrated remarkable activity in different types of cancer (lung, melanoma etc.). Signs of efficacy have been observed in MM, however the activity of this class of promising therapeutics is still suboptimal in MM. One of the reasons could be that molecules, which possess beneficial activity/side effect profile (e.g. anti-PD-L1) require near stoichiometric blocking/saturation of their targets to elicit maximal immunostimulatory effect on T cells.
Therefore, specific targeting of anti-PD-L1 antibodies to the site of tumors (e.g. targeting CD38+ cancer cells) may help delivering anti-PD-L1 therapeutics to the site where immune stimulation is required, and may result in maximal immune cell stimulation allowing the complete blocking of PD-L1 on tumor and microenvironment cells. Such targeted immune cell activation at tumor sites may also reduce systemic activation of the immune cells, prevent adverse side effects, and permit higher dosing of therapeutic antibodies.

This patent is subject to a terminal disclaimer.


A method, according to one embodiment of the present invention, may comprise a configuration whereby a base station, which has received, from another base station, a message including information associated with the another base station, communicates with a terminal on a specific frequency band on the basis of the information associated with the another base station. Here, the specific frequency band may be: a frequency band included in a frequency band used by the another base station; or a frequency band adjacent to the frequency band used by the another base station.

Machine-to-machine (M2M) communication, machine type communication (MTC), and various devices, such as smartphones or tablet personal computers (PCs), and techniques that require a high data transfer rate have appeared and come into widespread use. This has rapidly increased the quantity of data which needs to be processed in a cellular network. In order to satisfy such rapidly increasing data throughput, various technologies such as carrier aggregation technology for efficiently using more frequency bands, cognitive ratio technology, multi-antenna technology for increasing data capacity in a restricted frequency, multi-base station (BS) cooperative technology, and the like have been developed.
As more communication devices have demanded higher communication capacity, there has been necessity of enhanced mobile broadband (eMBB) communication relative to legacy radio access technology (RAT). In addition, massive machine type communication (mMTC) for providing various services at anytime and anywhere by connecting a plurality of devices and objects to each other is one of main issues to be considered in next-generation communication. Moreover, design of a communication system considering services/UEs sensitive to reliability and latency has been proposed.
In addition, a communication system to be designed in consideration of services/UEs sensitive to reliability and latency is under discussion. Introduction of next-generation RAT has been discussed by taking into account eMBB communication, mMTC, ultra-reliable and low latency communication (URLLC), and the like.

Method for transmitting/receiving signal in wireless communication system, and device therefor


A semiconductor device is disclosed allowing detection of a connection state of a Through Silicon Via (TSV) at a wafer level. The semiconductor device includes a first line formed over a Through Silicon Via (TSV), a second line formed over the first line, and a first power line and a second power line formed over the same layer as the second line. Therefore, the semiconductor device can screen not only a chip-to-chip connection state after packaging completion, but also a connection state between the TSV and the chip at a wafer level, so that unnecessary costs and time encountered in packaging of a defective chip are reduced.

Embodiments of the present invention relate to a semiconductor device, and more particularly to technology allowing detection of a defective state of a Through Silicon Via (TSV) at a wafer level.
In order to increase an integration degree of a semiconductor device, a three-dimensional (3D) semiconductor device has recently been developed, in which a plurality of chips is stacked and packaged in a single package. The 3D semiconductor device is formed by vertically stacking two or more chips, such that it can acquire a high integration degree in the same space.
Specifically, there has recently been used a Through Silicon Via (TSV) scheme for electrically interconnecting a plurality of chips by allowing a plurality of stacked chips to be penetrated through a silicon via. The semiconductor device using the TSV allows individual chips to be vertically penetrated such that the individual chips are interconnected, so that a package area may be reduced as compared with another semiconductor device configured to interconnect a plurality of chips through a line (or wire) located at an edge.
FIG. 1 is a cross-sectional view illustrating a conventional semiconductor device.
Referring to FIG. 1, when using the TSV, a plurality of chips having the same structure is stacked so that a single semiconductor device can be configured.
The single semiconductor device may include one master chip for controlling overall operations of the semiconductor device, and a plurality of slave chips for storing data.
In accordance with the semiconductor device shown in FIG. 1, a first metal M1 is formed over a TSV, and a second metal M2 is formed over the first metal M1 through a metal contact.
A third metal M3 is formed over the second metal M2 through the metal contact.
The conventional semiconductor device forms a chip on a wafer, and performs a stacking process upon completion of a dicing process such that it forms a package.
However, the conventional semiconductor device verifies chip-to-chip TSV connection after completion of packaging, such that it is impossible to screen defective TSV connection on a wafer level.
In FIG. 1, the reference number (A) illustrates a defective interface between a TSV and a first metal M1 according to a defective TSV.
FIG. 2 illustrates the problems encountered in a TSV structure shown in FIG. 1.
In the TSV structure for use in a multi-chip package, a copper (Cu) material filled in a TSV is expanded by a subsequent heat process.
Accordingly, a crack occurs by expansion of the Cu material such that a defective interface in which a TSV is not connected to an upper metal pad, occurs as shown in (A).
If a defective part occurs in a TSV pad as shown in (A), a chip-to-chip defective connection occurs during chip stacking.
A defective TSV pad is detected when the wafer is tested such that a fabrication process must be extended to a subsequent package.
However, a defective TSV is not detected when the wafer is tested in a current TSV structure, and a failed TSV operation can be detected only after packaging.
Therefore, unnecessary costs encountered in packaging of a defective material are generated.
FIGS. 3a and 3b illustrate a defective metal line for use in the TSV structure shown in FIG. 1.
FIG. 3a is a plan view illustrating a second metal line M2 formed over a TSV.
Referring to FIG. 3a, a second metal line M2 is normally formed when a defective TSV does not occur.
On the other hand, FIG. 3b shows a defective interface encountered in a TSV.
Referring to FIG. 3b, a defective second metal line M2 formed over a TSV is unnecessarily connected to a contiguous metal line as shown in (B).
The TSV structure is required for high-speed and high-capacity DRAM operations.
A mid-level structure configured not to consume high costs without great change of an inline fabrication as in a TSV can check its own connectivity after completion of such stacking.
Therefore, when a defective TSV connection occurs in the wafer process, it is difficult for the conventional semiconductor device to screen the defective TSV connection such that unnecessary costs are consumed when packaging of a defective chip.

Semiconductor device having a wafer level through silicon via (TSV)


A failed nozzle relief (FNR) valve has a resetting mechanism that resets the valve when a filler cap is replaced over the filler cup. The FNR valve has an annular seal that surrounds a filler neck opening. The annular seal seats against a ring having at least one aperture that creates an alternative fluid flow path. During a failed nozzle shutoff condition, the annular seal separates from the ring, opening the aperture to allow fluid to flow through it. The FNR valve also has a reset lever that is pressed downward when the filler cap is replaced, thereby forcing the seal back against the ring.

Fuel vapor recirculation tubes are used in motor vehicle fuel tank filler tubes to recirculate fuel vapor during refueling from a nozzle inserted in the filler tube with a mechanical seal provided about the nozzle. The recirculated vapor provides a make-up flow below the nozzle seal to prevent the flow discharging from the nozzle from creating a vacuum in the filler tube and prematurely activating the automatic nozzle shutoff.
If the filler nozzle is working properly, the automatic nozzle shutoff mechanism will operate when the fuel tank is full. However, if the mechanism is not working properly, fuel is allowed to back up the filler tube and spill out to prompt the operator to manually shut off the nozzle.
Fuel systems typically have a "failed nozzle relief" (FNR) mechanism to protect the system from damage when it is overfilled. If the system includes a sealing member that seals against the filler nozzle to reduce vapor generation during refueling, the FNR mechanism provides an alternative flow path if the nozzle fails to shut off. This flow path is normally protected by a valve or a sealing membrane. However, the FNR mechanism needs to be reset and repositioned to a normal operating state after the failed nozzle event to close off the alternative flow path for the next normal refueling event. Resetting devices increase the complexity of the FNR mechanism and may also cause increased fuel tank pressures or fuel discharge at higher than accepted pressures.
There is a desire for a resettable FNR mechanism having a simple design and that can be easily reset by the operator.


Methods and apparatuses for detecting leakage of hydrocarbons from and preventing corrosion of underground storage tanks. Soil samples near an underground storage tank are taken and analyzed in the field, preferably using hexane as a solvent to detect the presence of hydrocarbons such as heating and waste oil. The soil-to-tank potential of the tank and the presence of water within the tank are measured and, if warranted, cathodic protection provided to the tank to prevent corrosion or further corrosion.

1. Field of the Invention (Technical Field)
The invention described and claimed herein relates generally to a method and apparatus for detecting leakage of hydrocarbons from and preventing corrosion of underground storage tanks. More particularly, the present invention relates to field methods and apparatuses for analyzing soil samples taken near an underground storage tank for the presence of hydrocarbons, for measuring the soil-to-tank potential of a tank, for detection of water in a tank, and for protecting a tank from corrosion by supplying current flow through the metal of the tank.
2. Background Art
Thousands of underground tanks storing petroleum products are located throughout the world. With each, a potential for leakage of the stored products exists, and for metal underground storage tanks, a potential for corrosion. Even though an underground storage tank may have a long-term protective coating (e.g., 30-year coating), the tank could get scratched or punctured, particularly during installation, which necessitates periodic testing for leakage.
The area around an underground storage tank must be inspected periodically to determine whether hydrocarbon leakage has occurred. The inspection process heretofore has involved taking soil samples and sending them to a laboratory for inspection. The present invention permits an on-site determination of whether a soil sample is contaminated by hydrocarbons. A laboratory need only be involved to determine the type, amount and possible source of any hydrocarbons detected.
In the prior art, soil samples are collected in the field and then sent to a laboratory for field testing. It is not known in the art to detect the presence of hydrocarbons, using an on-site field kit, with an extraction solvent.
Previously known devices exist in the art which provide for field prospecting for oil deposits by analysis of soil samples. U.S. Pat. No. 2,269,889, to Blau, entitled Process for Locating Valuable Subterranean Deposits, describes a device for locating subterranean deposits of hydrocarbons by field analysis of surface soil samples. The device detects the presence of certain byproducts of hydrocarbon consuming bacteria. A soil sample is combined with water and sodium peroxide, which produces a characteristic color change in the sample if the bacterial byproducts are present. U.S. Pat. No. 2,292,300, to Smith, entitled Photochemical Exploration Method, describes a device for prospecting for hidden petroleum deposits by laboratory analysis of the alkaline salt content of surface soil samples. Soil samples are combined with water and silver nitrate, and the tint of the resulting solution indicates the concentration of alkaline salts within the soil. Anomalies in concentrations may indicate a hydrocarbon deposit below the point or points at which the anomalous sample or samples were taken. These patents do not disclose field testing of soil surrounding underground storage tanks, nor the use of hexane in a soil sample test.
In the laboratory, testing of soil samples generally involves the use of a chlorofluorocarbon extraction solvent which is known to cause environmental problems in its depletion of the ozone layer. It is a purpose of the present invention to use solvents, such as hexane, not known to cause ozone depletion or other environmental problems.
Metal underground storage tanks should also be tested periodically to determine how corroded they are presently, as well as their potential for further corrosion. U.S. Pat. No. 2,839,722, to Marsh, entitled Method and Apparatus for Detecting Stray Current Corrosion, discloses a device for detecting stray voltage in the area of an underground storage tank which may cause the tank to corrode more rapidly. It does not disclose a method or apparatus for measuring what is generally known in the art as "soil-to-tank potential."
Underground storage tanks having a non-minimal potential for corrosion should be protected by inducing current flow through them. This type of protection is generally known in the art as "cathodic protection." U.S. Pat. No. 2,478,478, to Grebe, entitled Potential Gradient Anode for Galvanic Protection, and U.S. Pat. No. 3,168,455, to Shapiro, et al., entitled Corrosion Protection, are examples of methods and devices to reduce the cost of cathodic protection.

Detection and prevention of hydrocarbon leakage from underground storage tanks

International Lubrication and Fuel Consultants


Particular embodiments include a mission payload mounting apparatus. The mission payload apparatus includes a pressurized door plug assembly on a side of an aircraft fuselage and a strut having a first end and a second end. The strut extends from an interior of the aircraft fuselage through the pressurized door plug assembly to an exterior of the aircraft fuselage. The first end of the strut is connected to the interior of the aircraft fuselage. One or more payloads are attached to the strut.

Aircraft-based platforms are ideally suited for time-sensitive emergency, as well as routine, sensing or other electronic based search, monitoring, surveillance and response activities. For example, numerous civilian- and military-based aircraft response agencies require high resolution aerial thermal (IR), radar, ultra violet (UV), photographic, multi-spectral, hyperspectral or other sensor imagery in a timely manner. Similarly, such agencies may also require electronics intelligence (ELINT) data, communications relay, communications intelligence (COMINT) data, signals intelligence (SIGINT) data, communications jamming, satellite communications (SATCOM), satellite telemetry, electronic support measures (ESM), electronics countermeasures (ECM), anti-submarine warfare (ASW), magnetic anomaly detection (MAD), missile counter measures (MCM) pods, or other types of electronic or image sensing information pods in a timely fashion to formulate a given response.
Existing aircraft mounting methodologies for these or related C4ISR electronics and sensors are typically packaged in systems dedicated to a specific aircraft, or partially dedicated in as much that a given system can be mounted within a pod which can be moved between aircraft but still necessitates air frame modifications to accommodate wing or belly mounting pylons typical of the USAF RC-12.
As an alternative, an aircraft door compatible temporary mounting system is described in U.S. Pat. No. 5,927,648, entitled "Aircraft Based Sensing, Detection, Targeting, Communications, and Response Apparatus" issued Jul. 27, 1999 to Richard L. K. Woodland, and incorporated herein by reference. The Woodland invention is able to accommodate mounting on various aircraft without incurring any airframe modifications but is completely reliant on a mounting pallet to absorb flight induced loads which are then transferred from the torque pallet into the aircraft floor structure. The pallet mounted special mission assembly disclosed by Woodland when used in conjunction with rear loading/jettisoning cargo aircraft like a Lockheed Martin C-130 also compromises all other backend air drop operations which require use of the air deployment system (ADS) rails.
Accordingly there is an on-going, unaddressed need to achieve a flexible, rapidly-installed, roll-on, cost-effective, airborne C4ISR and special mission strut and pod mounting methodology.
Further, there is a need for such a strut and pod that permits a 360-degree field of view (FOV).
Further, there is a need for such a strut and pod that does not interfere with backend cargo air drop operations.
Still further, there is a need for such a strut and pod that provides in-flight extension and retraction of the strut and payload assemblies into the fuselage for reloading or changing sensor configurations, and provides an alternate load transfer path for externally-mounted payload systems into the primary aircraft structure without using a pallet or necessitating modifications to the host aircraft.

Aircraft based non-dedicated special mission pod mounting apparatus


For updating a basic input output system (BIOS) code stored in a non-volatile memory (NVM) included in an information handling system (IHS), a plurality of conditions permitting the updating of the BIOS stored in the NVM from a memory of the IHS are verified. The contents of the memory are preserved by disabling interrupts and disabling bus masters capable of causing a change in the contents of the memory. The BIOS stored in the NVM is updated from the memory. A user interface is provided to display status of the updating of the NVM to improve user experience. Upon completion of the updating the IHS is reset by enabling a cold reboot, thereby enabling the changes made to the BIOS to take effect.

The present disclosure relates generally to information handling systems, and more particularly to updating the basic input output system of an information handling system.
As the value and use of information continues to increase, individuals and businesses seek additional ways to acquire, process and store information. One option available to users is information handling systems. An information handling system (IHS) generally processes, compiles, stores, and/or communicates information or data for business, personal, or other purposes thereby allowing users to take advantage of the value of the information. Because technology and information handling needs and requirements vary between different users or applications, IHSs may also vary regarding what information is handled, how the information is handled, how much information is processed, stored, or communicated, and how quickly and efficiently the information may be processed, stored, or communicated. The variations in IHSs allow for IHSs to be general or configured for a specific user or specific use such as financial transaction processing, airline reservations, enterprise data storage, entertainment, and/or global communications. In addition, IHSs may include a variety of hardware and software components that may be configured to process, store, and communicate information and may include one or more computer systems, data storage systems, and networking systems.
A basic input/output system (BIOS) is generally a memory resident software program which includes instructions required to control computer peripherals such as the keyboard, display screen, disk drives, serial communications, and other functions without relying on a hard disk. The BIOS may be referred to as 'firmware' since it is typically stored in a non-volatile memory (NVM), e.g., flash memory. This ensures that the BIOS will be available to boot the system, even when there is a disk failure.
The BIOS also typically includes a SETUP code and a power-on-self-test (POST) program, both of which are well known to those skilled in the art. The SETUP code lets a user configure the computer system in a desired manner, e.g., by specifying whether certain features are enabled or disabled, and by specifying certain preferences. Computer system configuration generally refers to a process for setting, defining, and/or selecting hardware, software properties, parameters, or attributes of the system. The POST code tests and initializes various components, when the system is activated. Both the SETUP and POST codes are typically stored in NVM such as flash memory.
Presently, application software programs such as a remote BIOS update program (RBU) and/or a remote configuration interface (RCI) are available to update the BIOS either locally or remotely. The following U.S. patent describes various aspects of updating the BIOS remotely or locally, which is incorporated herein by reference: 1) U.S. Pat. No. 6,438,688 entitled 'Method And Computer For Locally And Remotely Updating A Basic Input Output System (BIOS) Utilizing One Update File'.
However, implementing a change or modification to the BIOS may be cumbersome since the BIOS code often needs to be modified depending on the limitations of a particular chipset deployed in the IHS. For example, memory initialization code may need to be modified for every chipset supported. Special BIOS code may be included to put memory circuits in self refreshing mode during the initialization. Additionally, some chipsets used in server designs may initialize memory after an internal bus reset, e.g., after a peripheral component interconnect (PCI) bus reset.
Therefore, a need exists to improve updating the NVM of an IHS. Accordingly, it would be desirable to provide for remotely or locally updating the BIOS code in manner that is independent of the limitations of a chipset, absent the disadvantages found in the prior methods discussed above.

Chipset-independent method for locally and remotely updating and configuring system BIOS


Method and systems are disclosed for increasing the number of ranks supported in a memory system. In one embodiment, a plurality of predefined subsets of memory chips on a memory module is selected. A chip select signal uniquely identifying the selected subset of memory chips is generated. The chip select signal is encoded as a multi-bit word having a bit width that is less than the number of predefined subsets of memory chips. Each bit of the encoded chip select signal is transmitted along a separate chip select line. The transmitted chip select signal is decoded to determine the identity of the selected subset of memory chips. The selected subset of memory chips identified by the decoded chip select signal are read or written.

1. Field of the Invention
The present invention relates to main memory systems for computer systems, and more specifically to supporting multiple memory ranks per channel.
2. Background of the Related Art
Memory modules, such as dual in-line memory modules (DIMMs), include one or more ranks of memory. A rank is a subset of memory chips that can be accessed on a DIMM. The number of ranks on a DIMM, or the number of ranks collectively provided on a memory channel having one or more DIMMs, is the number of independent sets of DRAMs that can be accessed for the full data bit-width of the DIMM, which is typically 64 bits plus eight optional ECC (error correcting code) bits. The main memory bus typically includes a number of read/write data lines (e.g. an I/O data path) corresponding to the data bit-width of each rank of DIMMs on the memory channel. Two ranks cannot be accessed simultaneously because each rank shares the same data path provided by the memory bus. Therefore, the main memory bus also includes chip select (CS) lines to select which rank of memory receive and respond to commands at any given moment.
In a conventional memory system, each CS line is uniquely associated with a different rank on a memory channel. A rank is accessed by activating the CS line with which it is associated. For example, a memory channel having two quad-rank DIMMs, totaling eight ranks on the memory channel, may be allocated eight CS lines on the memory bus, with each CS line designating one of the eight ranks. CS lines are usually "active low," meaning that a CS line is active at the lower of two voltages, corresponding to a binary "0." Assuming the currently active CS line is active low, the remaining CS lines are each driven "high," as a binary "1" to inactivate the other ranks on the shared bus.
To support the development of quad-rank DIMM, which currently remains in common use, the standard pinout for both DDR2 and DDR3 DIMMs include pins for four CS lines to be routed through the socket to the DIMM. A memory controller having eight CS pins can be used to control two quad-rank DIMMs per channel, with four of the CS pins designating four ranks of one DIMM and the other four CS pins designating four ranks of the other DIMM.

Encoded chip select for supporting more memory ranks

Lenovo Enterprise Solutions (Singapore) Pte. Ltd.


Some embodiments include apparatuses having a first magnet, a first stack of layers coupled to a first portion of the first magnet, a first layer coupled to a second portion of the first magnet, a second magnet, a second stack of layers coupled to a first portion of the second magnet, a second layer coupled to a second portion of the second magnet, a conductor coupled to the first stack of layers and to the second layer, and a conductive path coupled to the first portion of the first magnet and to the first portion of the second magnet, each of the first and second layers including a magnetoelectric material, each of the first and second stacks of layers providing an inverse spin orbit coupling effect.

Spintronics is the study of the intrinsic spin of the electron and its associated magnetic moment in solid-state devices. Spintronic logic may be implemented in integrated circuit devices that use a physical variable of magnetization or spin as a computation variable. Such variables can be non-volatile (e.g., preserving a computation state when the power to an integrated circuit is turned off). Non-volatile logic can improve power and computational efficiency by allowing architects to put a processor into un-powered sleep states more often, thereby reducing energy consumption. Existing spintronic logic generally suffers from high energy consumption and relatively long switching times.

Combinatorial magneto electric spin orbit logic


The present disclosure relates to a filter apparatus for filtering liquid from a gas, the apparatus having a first housing having a gas inlet and a gas outlet; a first filter media disposed in the first housing; a second filter media disposed in the housing; and a second housing forming a first collection basin disposed in the flow path between the first filter media and the second filter media, so that a path is defined for the gas flowing from the inlet, through the first filter media, past the collection basin, through the second filter media, and to the outlet. The present disclosure also relates to a method of passing a gas through a coalescing filter media and through a hydrophobic filter media.

Many patients benefit from receiving therapeutic gas (e.g., nitric oxide gas) in inspiratory breathing gas flow from a breathing circuit affiliated with a ventilator (e.g., constant flow ventilator, variable flow ventilator, high frequency ventilator, bi-level positive airway pressure ventilator or BiPAP ventilator, etc.). To provide therapeutic gas to a patient who receives breathing gas from a ventilator, the therapeutic gas may be injected into the inspiratory breathing gas flowing in the breathing circuit. This inhaled therapeutic gas is often provided via a therapeutic gas delivery system as a constant concentration, which is provided based on proportional delivery of the therapeutic gas to the breathing gas. Further, a sampling system (e.g., affiliated the therapeutic gas delivery system) may continuously draw in the inspiratory breathing gas flow to at least confirm that the desired dose of the therapeutic gas in the inspiratory breathing gas flow is being delivered to the patient. For example, a sample pump may pull in inspiratory flow (e.g., in the near vicinity of the patient) to confirm that the desired therapeutic gas concentration is in fact being delivered to the patient in need thereof.
One such therapeutic gas is inhaled nitric oxide (iNO). In many instances iNO is used as a therapeutic gas to produce vasodilatory effect on patients. When inhaled, nitric oxide (NO) acts to dilate blood vessels in the lungs, improving oxygenation of the blood and reducing pulmonary hypertension. Because of this, nitric oxide is provided in inspiratory breathing gases for patients with various pulmonary pathologies including hypoxic respiratory failure (HRF) and persistent pulmonary hypertension (PPH). The actual administration of iNO is generally carried out by its introduction into the patient as a gas along with other normal inhalation gases, for example, by introducing iNO, from an iNO delivery system, into the inspiratory flow of a patient breathing circuit affiliated with a ventilator.
Separately and/or in conjunction with iNO, patients may receive inspiratory breathing gas flow containing liquid particles (e.g., nebulized medical solutions and suspensions, moisture from humidified air, etc.) and/or other particles. Although this matter in the inspiratory breathing flow may provide additional benefit to the patient, they may contaminate the sampling system (e.g., gas analyzers) of the therapeutic gas delivery system used to confirm dosing of iNO being delivered to the patient. Unlike the mere filtering of liquids from gas, filtering these contaminates from the sampled inspiratory breathing gas flow can be substantially difficult. Filtration design complexities or difficulties may include the desire for very low internal and external leakage, very low resistance to flow, and materials compatibility such that filter materials used do not adulterate the gas sample to be analyzed. Low internal and external leakages are critical in this application, as nitric oxide (NO) is monitored in the range of 1 to 80 parts per million (ppm) and nitrogen dioxide (NO2) in the range of 1 to 5 ppm. A small external leak, for example, may dilute the sample to be analyzed, potentially rendering inaccurate sample gas analysis. A small internal leak may allow contaminant to pass through the filter, resulting in potential performance degradation of downstream pneumatic controls and/or gas analyzer sensors, also having the potential of rendering inaccurate sample gas analysis. Low filter resistance to flow is critical as this attribute relates directly to pump power requirements. Lower resistance to flow enables smaller pumps consuming less power to be used, resulting in smaller, lighter, quieter medical devices. The impact of lower power components can be compounded for devices requiring battery back-up, allowing for use of smaller batteries. Medical device pumps operating at lower sound pressure levels can be especially advantageous in settings such as the ICU, where quiet operation is critical to the clinical staff. Other competing physical attributes from User's perspective are desire for longevity (e.g., infrequent filter changes would come with larger filters) in contrast with desire for compact device (which may require smaller filters). Adding complexity, the sampled inspiratory flow is typically required throughout treatment (e.g., constant or near constantly sampling of the inspiratory flow just prior to, in the immediate vicinity of, entry into the patient) to provide real time, or near real time, confirmation of dosing during therapeutic gas delivery to the patient.
Accordingly, at times, there is a need to filter the sampled inspiratory breathing gas flow of liquid particles and/or other particles, for example, to mitigate contamination of the gas sampling system. Further, there may also be other uses for an improved apparatus and method that can effectively filter at least these, or other, contaminants from sampled inspiratory breathing gas flow being provided to a patient in need thereof.

Apparatus and method for filtering liquid particles from inspiratory gas flow of a patient breathing circuit affiliated with a ventilator and/or nitric oxide delivery system

Mallinckrodt Hospital Products IP Limited


A device for controlling an electronic four-wheel drive (E-4WD) of a vehicle includes: a first powertrain for a front wheel, where the first powertrain includes an engine, and a front wheel motor; and a second powertrain for a rear wheel, where the second powertrain includes a rear wheel motor. The device provides a rear wheel motor driving mode, a front wheel motor driving mode, a combined driving mode in which the front wheel motor and the rear wheel motor are both driven, and an engine-on mode according to driver power demand for the vehicle, such that fuel efficiency of the vehicle is improved.

The statements in this section merely provide background information related to the present disclosure and may not constitute prior art.
As it is well known, electric motors are provided as traveling driving sources in hybrid vehicles, electric vehicles, hydrogen fuel cell vehicles, and the like, and these vehicles are referred to as electrified vehicles.
As an example of a four-wheel drive (4WD) powertrain of the electrified vehicle, a powertrain in which an engine and/or a front wheel motor is connected to a front wheel and a rear wheel motor, which is smaller than the front wheel motor, is connected to a rear wheel may be applied to the electrified vehicle.
In one form, a 4WD powertrain may provide main driving sources for the vehicle by an engine and a front wheel motor, which are connected to a front wheel, and an auxiliary driving source by a rear wheel motor connected to a rear wheel. Since an optimized driving control method for vehicle traveling has not yet been established and, and the rear wheel motor remains at a level in which it is limitedly driven for driving assistance, application of a more efficient driving control method is desired.
In another form, a 4WD powertrain uses an engine connected to a front wheel as a main driving source for the vehicle traveling, and a rear wheel motor connected to a rear wheel as a secondary driving source when a loss of a driving force occurs due to operating of the engine during gear shifting of a transmission while traveling. The rear wheel motor operates to compensate for the loss of the driving force.

Device and method for controlling driving of electric four-wheel drive vehicle


[Object] To reduce a risk that a tone of a specific color component of a subject to be observed in medical operation is defective.

In recent years, medical observation devices such as endoscopes and microscopes have been widely used in medical scenes. The medical observation devices include not only a device capable of optically observing a subject but also a device that causes a display unit to electronically display an image of the subject captured by an imaging unit (camera). For example, in endoscopic surgery or microsurgery, a practitioner performs various types of operation while observing an affected part or a surgical instrument through an image that is electronically displayed. A capsule endoscope is mainly used for examination or diagnosis and captures an image of an objective organ inside a body of a subject.
In a case where a captured image is displayed for the medical operation exemplified above, a subject needs to be displayed as clearly as possible in the displayed image. However, actually, a defect of visual information called clipped whites or clipped blacks occurs in many cases due to restriction of a dynamic range of a pixel value. Patent Literature 1 proposes a mechanism that variably controls a peak position of a light distribution of illumination light emitted toward a visual field in order to prevent such clipped whites or clipped blacks and provide a natural image.

Medical image processing device, system, method, and program

Abstract: [Solution] There is provided a medical image processing device including: a signal acquisition unit configured to acquire a first specific component image signal with a first exposure for a specific color component, a second specific component image signal with a second exposure different from the first exposure for the specific color component, and two non-specific component image signals corresponding to two color components different from the specific color component; a combination unit configured to generate a specific component combination image signal by combining the first specific component image signal and the second specific component image signal by using a weight based on an intensity of the specific color component; and a color image generation unit configured to generate a color image signal on a basis of the specific component combination image signal generated by the combination unit and the two non-specific component image signals.


A method of forming a vacuum micro-chamber for encapsulating a microelectronics device in a vacuum processing chamber comprises the steps of forming a microelectronics device (14) on a substrate base (30). The next step is to cover microelectronics device (14) with an organic spacer such as photoresist in a form having a plurality of protrusions, such as a star shape form (36). The next step is to cover the organic spacer and substrate base (30) with the metal layer (24) so that the metal layer covers all of the organic spacer except for a predetermined number of access apertures (34) to the organic spacer. Next, the organic spacer is removed through access apertures (34) to cause metal layer (24) to form a shell over a vacuum chamber (20) between the microelectronics device (14) and metal layer (24). The next step is to seal vacuum chamber (20) by coating metal layer (24) and closing off access apertures (34). The method of the present invention has application to produce vacuum micro-diodes and micro-triodes, micro-mass spectrometers, micro-light bulbs, and micro-thermocouple gages, as well as numerous other applications.

Recently, the advantages of modeling and fabricating microcavity integrated vacuum tubes are receiving increasing attention by designers of electronic systems. Microcavity integrated vacuum tubes are micrometer-sized devices that employ field emission instead of thermionic emission to generate charge carriers. These vacuum tubes operate as do the conventional vacuum tubes, but are fabricated on a silicon wafer in much the same way as are conventional integrated circuits.
Thin-film methods have been designed to create device layers and microlithography has been used to pattern various layers for these purposes. Conventional methods of producing micro-cavity integrated vacuum tubes, however, use a combination of oxides and refractory metals to form the microcavity structures. There are several problems associated with this approach.
First of all, these process techniques generally use some type of wet-etch process to carve or etch out a cavity within a semiconductor substrate. The wet-etch process is messy and, following the etching, a certain amount of residue is likely to remain. Secondly, during the process, oxide fills the cavity over which a high temperature refractory metal is placed. Once the refractory metal is in place, a wet-etch process is necessary to remove the oxide from within the cavity. Removing the oxide necessitates both a wet-etch technique and the use of refractory or high temperature metals. The wet-etch technique is necessary because of the chemical properties of the oxide. The high temperature or refractory metals are necessary to resist the corrosive effects of the wet-etch techniques. The result of this wet-etch technique often is a less than fully evacuated cavity within the substrate, a partly corroded refractory metal, and the potential of wet-etch residue within the cavity. As a result, less than optimal performance of the microcavity integrated vacuum tube can be expected using this technique.
If a process existed that could avoid the use of refractory metals, oxides for the cavity filling material, and the wet-etch techniques, a significantly improved vacuum micro-chamber would result. The benefits of having a clean vacuum chamber for the production of microcavity integrated vacuum tubes and other electronic devices may, then, be seen in many applications. These applications may include nuclear reactor instrumentation, fusion reactor instrumentation, accelerator instrumentation, bore hole seismic profiling, and space power systems. Additionally, high speed sensors, communication systems, and data processing systems would likely benefit from the high speed that vacuum chamber devices such as vacuum triodes or diodes on an integrated semiconductor substrate could achieve. Consequently, there are both the need for improved processing techniques and a variety of applications for these vacuum microelectronics devices.
In essence, there is a need for a method of producing a vacuum micro-chamber for encapsulating a microelectronics device that avoids the use of oxide as the micro-chamber spacer material.
There is the need for a method of producing a vacuum micro-chamber device that permits the use of lower temperature metals such as copper, aluminum, and their alloys and, thereby, takes advantage of their manufacturing properties.
There is a further need for a method of producing a vacuum micro-chamber for encapsulating a microelectronics device that fully avoids the use of wet-etch techniques that leave residues and may not fully evacuate the vacuum micro-chamber of the chamber spacer material.

Method of forming a vacuum micro-chamber for encapsulating a microelectronics device


A cable retention device coupled at one end to a connector housing, having a tubular grip disposed at a second end for securing a cable at or near its strain-relief boot.

The rapid advance of technology continues to drive the proliferation of different types of cables and connectors. As new standards are promulgated and adopted, so new cables are designed and sold. In a typical household, it is not uncommon to find a computer, a home theater system, and assorted other electronic devices. Associated with these devices are many cable types such as USB, Firewire, UDP, HDMI, RCA, etc.
Any cable connection is susceptible to events that may dislodge it and thereby disrupt its intended purpose. Such events may also damage the cable or its socket, or potentially degrade their functionality. Furthermore, even if no damage occurs, the user must go through the hassle of reconnecting the cable. If the location of the connection is easily accessible, this may be a minor inconvenience. However, the tendency in modern design is to place cables so that they are unobtrusive or altogether hidden. Often this means that cables are connected in places that are difficult to reach, such as behind furniture or in walls or ceilings. Thus, reconnecting a dislodged cable can present quite a problem for the user.
To deal with this problem, some cable connector designs include mechanisms to help prevent their disconnection. For example, a typical serial port connection for a computer is secured by a couple of screws located adjacent to the connector. However, many cable connector types, such as USB and HDMI, do not have adequate security for preventing dislodgement or poor coupling and pin connections. These connectors are held in place by little more than the friction and rigidity of the pin-to-socket connection and connector shell portions surrounding the pins and sockets, all of which having varying and depletable degrees of inference fit.
Therefore, a need exists for a cable connector retention device to protect cables and sockets against events that may cause them to become disconnected or damaged, or cause poor pin-to-socket signal transmission.