A display has circuitry (50) which generates all possible pixel drive signal levels on separate signal level lines. A buffer (54) is associated with each signal level line. The outputs of the buffers are selectably switchable onto the columns. The signal levels for each column are stored in a memory (72) and the buffers are controlled in dependence on the stored signal levels. The response of the buffers is heavily dependent on the output load, and there is a very large variation in the output load of the buffers (54), as a function of the number of columns to which the buffer output is to be provided. The buffers are controlled in dependence on stored signal levels to ensure stability of the buffers for any output load.

This invention relates to active matrix display devices, and relates in particular to the circuitry used for providing drive signals to the pixels of the display.
Active matrix display devices typically comprise an array of pixels arranged in rows and columns. Each row of pixels shares a row conductor which connects to the gates of the thin film transistors of the pixels in the row. Each column of pixels shares a column conductor, to which pixel drive signals are provided. The signal on the row conductor determines whether the transistor is turned on or off, and when the transistor is turned on, by a high voltage pulse on the row conductor, a signal from the column conductor is allowed to pass on to an area of liquid crystal material, thereby altering the light transmission characteristics of the material. An additional storage capacitor may be provided as part of the pixel configuration to enable a voltage to be maintained on the liquid crystal material even after removal of the row electrode pulse. U.S. Pat. No. 5,130,829 discloses in more detail the design of an active matrix display device.
The frame (field) period for active matrix display devices requires a row of pixels to be addressed in a short period of time, and this in turn imposes a requirement on the current driving capabilities of the transistor in order to charge or discharge the liquid crystal material to the desired voltage level. In order to meet these current requirements, the gate voltage supplied to the thin film transistor needs to fluctuate between values separated by approximately 30 volts. For example, the transistor may be turned off by applying a gate voltage of around xe2x88x9210 volts, or even lower, (with respect to the source) whereas a voltage of around 20 volts, or even higher, may be required to bias the transistor sufficiently to provide the required source-drain current to charge or discharge the liquid crystal material sufficiently rapidly.
The requirement for large voltage swings in the row conductors requires the row driver circuitry to be implemented using high voltage components.
The voltages provided on the column conductors typically vary by approximately 10 volts, which represents the difference between the drive signals required to drive the liquid crystal material between white and black states. Various drive schemes have been proposed enabling the voltage swing on the column conductors to be reduced, so that lower voltage components may be used in the column driver circuitry. In the so-called xe2x80x9ccommon electrode drive schemexe2x80x9d, the common electrode, connected to the full liquid crystal material layer, is driven to an oscillating voltage. The so-called xe2x80x9cfour-level drive schemexe2x80x9d uses more complicated row electrode waveforms in order to reduce the voltage swing on the column conductors, using capacitive coupling effects.
These drive schemes enable lower voltage components to be used for the column driver circuitry. However, there is still a significant amount of complexity and power inefficiency in the column driver circuits. Each row is addressed in turn, and during the row address period of any one row, pixel signals are provided to each column. In the past, each column would be provided with a buffer for holding a pixel in the column to a drive signal level for the full duration of the row address period. This large number of buffers results in high power consumption.
There have been proposals to provide a multiplexing scheme, in which a buffer is shared between a group of columns. The output of the buffer is switched in turn to the columns of the group. When the buffer is providing a signal to one column, it is isolated from the other columns by a switch. Multiplexing is possible because the line time of the display is significantly greater than the time required to charge a column to the required voltage. In small displays for mobile applications, the line time may be in excess of 150 xcexcs whereas the time required to charge a column is typically less than 10 xcexcs.
Once the column has been charged to the required voltage, and after the end of the application of the required voltage to the column, charge transfer takes place between the charged column capacitance and the pixel capacitance. The column capacitance may be around 30 times larger than the column capacitance, so that the charge transfer to the pixel results in only a small voltage change. However, this charge transfer enables the pixel to be charged using a short column address pulse, despite the longer time constant of the pixel (resulting from the high TFT resistance).
A problem with this multiplexing approach is that there is cross talk between the columns within the group, particularly as all but one of the columns of the group are effectively floating at any point in time, and are therefore susceptible to signal level fluctuations. During the row address period, the TFTs of all pixels in the row are switched on (and indeed this enables the charge transfer to take place between the column capacitance and the pixel), so that any signal fluctuations on the column conductors as a result of cross talk are passed onto the pixels.
The invention provides an alternative approach for reducing the number of buffers required by the column driver circuitry.
According to a first aspect of the invention, there is provided a display device comprising an array of liquid crystal pixels arranged in rows and columns, wherein each column of pixels shares a column conductor to which pixel drive signals are provided, wherein column address circuitry is provided for generating the pixel drive signals, the column address circuitry comprising circuitry for generating all possible drive signal levels on separate signal level lines and a buffer associated with each signal level line, the outputs of the buffers being selectably switchable onto the columns, wherein the column address circuitry further comprises a memory for storing the signal levels to be provided to each column, and wherein the buffers are controlled in dependence on the stored signal levels.
The invention provides an alternative approach by which a grey level generation circuit is provided with a buffer for each possible grey level output. The response of the buffers is heavily dependent on the output load, and such buffers are typically designed to be suitable for specific ranges of output loads. As a result of the large number columns in a display, there is a very large variation in the output load of the buffers, as a function of the number of columns to which the buffer output is to be provided. Therefore, the buffers are controlled in dependence on stored signal levels to ensure stability of the buffers for any output load.
In one example, a bias current to each buffer is controlled in dependence on the number of columns to which the buffer output is to be switched.
In another example, each signal level line is associated with a plurality of buffers, each of the plurality of buffers being suitable for different output loads, wherein one of the plurality of buffers is selected in dependence on the number of columns to which the buffer output is to be switched. Each signal level line may be associated with two buffers.
In another example, each buffer has a plurality of output stages, and wherein the number of output stages used is controlled in dependence on the number of columns to which the buffer output is to be switched.
In a further example, an additional buffer is provided and the additional buffer is used when the number of columns to which an individual buffer output is to be switched exceeds half the total number of columns.
These examples each provide arrangements which enable the output load required of each buffer to be used to provide control of the buffer configuration, in order to ensure stability of the buffer arrangements. The number of grey levels will typically be much smaller than the number of columns, so that the arrangement of the invention reduces the number of buffers required.
Preferably, each pixel comprises a thin film transistor switching device and a liquid crystal cell, wherein each row of pixels share a row conductor which connects to the gates of the thin film transistors of the pixels in the row, and wherein row driver circuitry provides row address signals for controlling the switching of the transistors of the pixels of the row.
According to a second aspect of the invention, there is provided a method of providing pixel drive signals to a display device comprising an array of liquid crystal pixels arranged in rows and columns, the method comprising:
generating all possible pixel drive signal levels;
providing each pixel drive signal level to an associated buffer;
storing the required pixel drive signals for a row of pixels in a memory;
calculating the required number of pixels of the row to be addressed by each drive signal;
controlling the buffers in dependence on the calculated number of pixels; and
switching the buffer outputs onto the columns during the row address period for the row to be addressed.
The step of controlling the buffers may comprise applying an appropriate bias current to the buffers, selecting between alternative buffers for each pixel drive signal level or selecting a number of output stages to be connected to each buffer.
The invention also provides column address circuitry for driving the columns of a liquid crystal display, comprising circuitry for generating all possible drive signal levels on separate signal level lines and a buffer associated with each signal level line, the outputs of the buffers being selectably switchable onto the column outputs, wherein the column address circuitry further comprises a memory for storing the signal levels to be provided to each column, and wherein the buffers are controlled in dependence on the stored signal levels.


The invention relates to a method and a plant for disinfecting at least one wooden container (10) likely to have been contaminated by microorganisms. It comprises treatment means for submitting said container to the action of an electromagnetic field, the frequency of which is between 1 MHz and 300 GHz, so as to destroy at least part of the population of microorganisms contained in said cask.

The present invention relates to a method and plant for disinfecting a wooden container likely to have been contaminated by microorganisms during its use.
The envisioned field of application is especially, but not exclusively, that of sterilizing casks intended for aging wine or casks likely to contain foodstuffs.
Generally, wine ages in a cask for a period during which the components of the wine diffuse and react with the wood of the inner wall and the deeper layers of the cask. Next, the wine is removed and deposits may remain on the inner wall of the cask. For it to be used again, in a similar or identical application, the cask must be reconditioned, in order to remove any deposits, then disinfected.
The reconditioning consists in cleaning the inner walls of the cask and then in disinfecting it in order to obtain a satisfactory sanitary condition and optimum preservation of the casks.
Usually, the inside of the casks is disinfected or sterilized by the action of steam, which may be injected under pressure and held inside for a predetermined time. Thus, the heat energy destroys the microorganisms located in the cask. However, the destruction takes place with some time lag, given the thermal inertia of the cask walls, and hampers the efficiency of the method. In order to accelerate the disinfection rate, it is possible to increase the steam pressure in the cask, but this runs the not inconsiderable risk of explosion and/or increases the thoroughness with which the inner walls of the cask are washed.
Another drawback of sterilization by steam is that it contributes to swelling the wood which absorbs the water and makes it more malleable.
One object of the present invention is to propose a method of disinfecting wood likely to have been contaminated by microorganisms while avoiding the drawbacks connected with the use of steam.
To achieve this aim, according to the invention, the method of disinfecting a wooden container likely to have been contaminated by microorganisms is characterized in that said container is subjected to the action of an electromagnetic field, the frequency of which is between 1 MHz and 300 GHz, in order to destroy at least part of the population of microorganisms contained in said cask.
The action of the electromagnetic field throughout the frequency range from 1 MHz to 300 GHz produces oscillation of the polar molecules or of the ions which, by friction, causes heating of the material. Heat transfer by conduction plays a secondary role within the substance, unlike other heating techniques, but it equalizes the temperature locally.
The frequencies used have the advantage of involving radiation whose penetration is a few centimeters while penetration of the infrared radiation, the wavelength of which is between 10xe2x88x923 m and 10xe2x88x926 m and which is commonly used to heat material, is a few millimeters. Consequently, it is possible to cause heating of the inner surface of the wall, when it is a few centimeters thick, by friction of the polar molecules or of the clusters, virtually at any point and at the same time. In this way, the microorganisms attached to the inner surface of the container wall are destroyed by the action of the radiation, which makes it possible to increase the temperature of the environment of the microorganisms.
Preferably, the wooden container is a wooden cask intended to contain alcohols or foodstuffs. These casks consist of longitudinal wooden elements hermetically fastened to each other in order to form a container having cylindrical symmetry and retained by hoops which are usually metallic, the two ends of the container being closed by flat fonts [sic]. Although the presence of the metal hoops prevents it being possible to envision treating the casks with suitable electromagnetic radiation, which would cause electric arcs detrimental to the treatment and especially local heating likely to damage the wall, it turns out that the inner surface of the cask wall heats without electric arcs appearing at the metal hoops. Thus treating wooden casks by means of suitable electromagnetic radiation leads to optimum sterilization of its inner wall, on the one hand, which is in direct contact with the liquid which it is likely to contain, and of the whole cask, on the other hand. Although a cask is a closed container, the thickness of its wall being a few centimeters, the radiation produces an effect on its inner surface.
Apart from the direct action on the microorganisms, the radiation acts on their environment and, in particular, on the water which is inevitably present in relatively large quantities on or in the wall and which is a prime example of a polar molecule. The friction of the water molecules produces an increase in the temperature also contributing to degrading the microorganisms.
According to a preferred implementational mode, the frequency of the electromagnetic field is between 865 MHz and 5850 MHz, which corresponds to microwaves.
According to a particular feature, the wooden container can be moved with respect to an electromagnetic source so that the action of said field on said container is uniform. Thus the hot spots, separated by a half wavelength, which occur when an object is irradiated, are attenuated by conduction since the container can be moved with respect to the source.
According to another particular feature, the electromagnetic source can be moved with respect to said wooden container so as to be able to treat wooden containers which are fixed or too bulky to be transported, as is for example the case for vats and barrels, and to solve the problem of homogenizing the temperature within the container.
According to a third particular feature, an electromagnetic field of 2450 MHz plus or minus 25 MHz, the power output of which is greater than 5 kW, is applied for a time at least equal to 300 s for a standard container. Thus the amount of energy applied to the wooden container is enough to destroy at least part of the population of microorganisms contained in said cask.
Another object of the present invention is to supply a plant for sterilizing or for disinfecting at least one wooden container likely to have been contaminated by microorganisms during its use. The plant comprises treatment means in order to subject said container to the action of an electromagnetic field, the frequency of which is between 1 MHz and 300 GHz, so as to destroy at least part of the population of microorganisms contained in said cask.
Advantageously, the treatment means comprise at least one electromagnetic wave generator extended by an applicator which is connected thereto capable of making said waves interact with said wooden container. The applicator consists of a slot antenna forming a wave guide in order to make the waves interact accurately on the wooden container.
Preferably, the plant comprises a plurality of electromagnetic wave generators extended by waveguides which at least partially surround said wooden container. This arrangement makes it possible to treat the wooden container from several angles simultaneously and leads to a substantially uniform application over the surfaces of the container.
According to a particular characteristic of the invention, the plant comprises electromagnetic wave generators emitting waves whose frequency is between 1 MHz and 300 GHz and having a power output at least equal to 1 kW.
These features make it possible to destroy the microorganisms since the heat energy resulting from the action of the waves exceeds a value beyond which they cannot survive.
According to another particular feature, support means are provided located close to the waveguides and capable of supporting said wooden container.
Advantageously, the support means can be moved in order to displace said wooden container with respect to the waveguides so as to homogenize the action of the waves on said container and to treat the container uniformly.
According to a particular implementational mode, the treatment means can be moved with respect to said container for uniform treatment or so that they can be transported to the user site for fixed wooden containers.

Disinfecting wooden elements in contact with foodstuffs


Heterocyclic acids and esters useful as inhibitors of mammalian blood platelet aggregation characterized by Formula I or II are disclosed. EQU HET.sub.1 --(CH.sub.2).sub.n CO.sub.2 R (I) ##STR1## Formula I compounds are those wherein n is 6-9, R is hydrogen, lower alkyl or an alkali metal ion, and HET.sub.1 is the heterocyclic radical 4,5-diphenyl-1H-imidazol-2-yl.. Formula II compounds are those wherein R.sub.1 is hydrogen, lower alkyl or an alkali metal ion, and the radical --OCH.sub.2 CO.sub.2 R is attached in the 3 or 4 ring position; and HET.sub.2 is the heterocyclic radical 4,5-diphenyl-1H-imidazol-2-yl.. Formula VIII compounds are those wherein R.sub.1 is hydrogen, lower alkyl or an alkali metal ion, and the radical --OCH.sub.2 CO.sub.2 R is attached in the 3 or 4 ring position.

This invention generally pertains to heterocyclic carbon compounds having drug and bio-affecting properties and to their preparation and use. In particular, the invention is concerned with various heterocyclic derivatives characterized by Formulas I and II, infra., which are inhibitors of blood platelet aggregation.
United States patents relating to the carboxylic acid and ester derivatives of the various heterocycles disclosed herein are as follows:
Imidazole compounds in Field of Search 514/396 and 548/342.
Furukawa, et al., U.S. Pat. No. 4,355,040 discloses imidazole-5-acetic acid derivatives having hypotensive properties of formula (1). ##STR2##
Lautenschlager, et al., U.S. Pat. No. 4,460,598 discloses triphenylimidazolyloxyalkanoic acids having antithromogenic properties of formula (2). ##STR3##
Wareing, U.S. Pat. No. 4,668,794 discloses imidazole acrolein analogs having blood cholesterol lowering properties of formula (3). ##STR4##
Bender, et al., U.S. Pat. No. 4,686,231 discloses 4,5-diaryl-2(substituted)-imidazoles having 5-lipoxygenase inhibiting properties of formula (4). ##STR5##

Imidazole carboxylic acids and esters and inhibition of blood platelet aggregation therewith


A recording apparatus including an automatic feeding mechanism for picking up one of recording media placed on a feed tray one by one and feeding the recording medium is provided. The automatic feeding mechanism includes: the feed tray on which a predetermined number of recording medium can be placed; a hopper for pushing the recording media on the feed tray toward a feed roller; and a separator located in a downstream of the hopper near the hopper. The automatic feeding mechanism picks up the recording media one by one in an order from an uppermost recording medium to a lowermost recording medium and feeds the recording medium thus picked to its downstream by an action of the feed roller and the hopper to sandwich and transfer the recording medium and a separating action of the separator. The automatic feeding mechanism can be rotated around a fulcrum of rotation so as to be foldable.

1. Field of the Invention
The present invention related to a recording apparatus including an automatic feeding mechanism that picks up one of recording media placed on a feed tray one by one. More particularly, the present invention relates to a recording apparatus including a compact automatic feeding mechanism that has a smart appearance, which is capable of preventing entering from foreign objects and being accommodated in the recording apparatus, and such an automatic feeding mechanism.
Moreover, the present invention relates to a liquid ejection apparatus such as an ink-jet recording apparatus for performing recording onto a recording medium (causing liquid to adhere to a medium) by emitting liquid such as ink from its head, and an automatic feeding mechanism used for that liquid ejection apparatus.
The liquid ejection apparatus in the present application means a recording apparatus which uses an ink-jet type recording head and achieves printing on the recording medium by emitting ink from the recording head, such as a printer, a copier and a facsimile machine, as well as an apparatus which uses a liquid ejection head corresponding to the ink-jet type recording head and emits liquid suitable for an application of the apparatus in place of the ink from the ink ejection head to a medium, thereby causing the liquid to adhere to the medium.
Examples of such a liquid ejection head include a color-material ejection head used in fabrication of color filters for a liquid crystal display or the like, an electrode-material (conductive paste) ejection head used in formation of electrodes for an organic EL display or a field emission display (FED), a biological organic material ejection head used in fabrication of bio-chips, and a sample ejection head as a precise pipette, other than the aforementioned recording head.
2. Description of the Related Art
An ink-jet recording apparatus includes an automatic feeding mechanism that includes a feed tray on which a predetermined number of sheets of paper can be stacked and a hopper that pushes up the paper on the feed tray toward a feed roller. The automatic feeding mechanism is also provided with the feed roller that rotates integrally with its rotational shaft. The automatic feeding mechanism picks up one of recording media in an order from the uppermost one to the lowermost one by using an action of nipping and transferring paper by the feed roller and the hopper and a separating action by a separation pad or a retard roller, and then feeds the recording medium thus picked to a recording position below a recording head.
Such an automatic feeding mechanism is secured to a main body of the recording apparatus, as described in Japanese Patent Application Publication (Laid-Open) No. 10-181905, for example, in such a manner that an opening for a feed operation is always provided between the recording apparatus and the automatic feeding mechanism. Thus, that automatic feeding mechanism has a problem of entering of foreign objects, such as dust or dirt. Moreover, the automatic feeding mechanism is arranged at an angle so as to protrude from the rear of the main body of the recording apparatus. Thus, provision of the automatic feeding mechanism prevents the size reduction of the recording apparatus or improvement of the appearance of the recording apparatus.

Recording apparatus including automatic feeding mechanism and automatic feeding mechanism


This foot securing device, particularly for ski boots accommodating at least one presser, comprises a grip element accessible from the outside of the boot. The grip element actuates a plate adapted to adjust the pressure exertable on the presser at the metatarsal region. This plate interacts with the presser upon the actuation of a cable winding element, activatable from the outside of the boot and adapted to tension at least one traction element affecting the presser at the foot instep region. The device thus allows the upper surface of the foot to be secured in two separate points by means of a single actuation, while allowing a separate securing adjustment at the two points.

The present invention relates to a foot securing device for a footwear, particularly for ski boots which internally contain at least one presser.
Various devices which allow the foot to be secured inside a ski boot are currently known.
Some, for example, allow only the metatarsal region to be secured by means of a lever associated with a stem having opposite threads and arranged transversely to the shell; said stem interacts with two half-pressers which are specular with respect to the longitudinal middle plane of the boot and can be moved towards or away from each other.
Devices are also known which act by compression on a pawl which interacts with a presser inside the shell.
However, even in this case the securing action is only exerted at a single point, and the structure is considerably complicated, leading to hardly negligible bulks.
A ski boot of the type described for example in DE-U-8408172.4 is also known which comprises a shell having a longitudinal slot in which a wedge-like element is slidably arranged and interacts with an also wedge-like surface provided on the upper part of the inner shoe.
However, even this known type of device has disadvantages: the pressure is difficult to adjust, as it is not easy to position the wedge-like element inside the slot.
The position it assumes is furthermore deemed unstable in view of the considerable stresses imparted while skiing U.S. Pat. No. 4620377 in the name of the same assignee (corresponding to EP-A-85106274.5, filed on 5.22.1985) assumed included herein as reference, discloses a device comprising a kinematism which interacts in two separate points spaced along the longitudinal extension of a presser arranged inside the shell, in order to at least partially solve the above problems.
Though, undoubtedly valid, said device provides, however, a common adjustment for the two points, so that their adjustment cannot be selected independently and it is furthermore impossible to maintain the presetting of the adjustment on the metatarsal region.
The device is furthermore constructively complicated.

Foot securing device for a footwear, particularly for ski boots


A wind turbine comprises a tower provided at the top with a horizontal shaft having an axis. A turbine rotor comprises turbine blades connected by a mounting arrangement to bearing members and to a rotor or a generator. Components of forces acting on the blades parallel to the axis are substantially exclusively communicated to the bearing members, for example by rigid straight members. Torque about the axis produced by the blades is communicated substantially exclusively to the rotor through a member.

Wind turbines for generating electricity are known and are being deployed in increasing numbers to provide a sustainable electricity supply. The maximum power which a wind turbine can generate is proportional to the swept area of its blades, which swept area is approximately proportional to the square of the lengths of the blades. There is a desire to increase the size of wind turbines so as to increase the maximum power which they are capable of providing and so as to reduce the cost of the supplied energy. However, linear scaling of output power cannot be achieved simply by linearly scaling the wind turbine components.
For example, if the length of each blade is doubled, the swept area is increased four-fold. However, the weight of each blade is generally proportional to the cube of the length so that the weight is increased eight-fold.
Wind turbines are known in which blades are fixed to a hub which drives a generator via a shaft connected to that hub. Examples of this arrangement are disclosed in WO 03/098034A1, DE 10311025A1, US 2006/0251516A1, EP 0058791A1 and U.S. Pat. No. 6,951,443B1.
Generators driven by axles have typically required the use of a gearbox to increase the rotary speed so as to provide more efficient generation of electricity. However, gearboxes are inconvenient in that they add to the cost, weight and servicing requirements of wind turbines. Direct drive generators have been used and examples of such arrangements are disclosed in DE 10255745A1 and U.S. Pat. No. 6,285,090B1.
WO 02/099950A1 discloses an electrical generator of this type. The wind turbine comprises a rotor whose rim is connected to a hub by tension members so as to resemble a spoked bicycle wheel. The hub is driven by an axially spaced wind turbine blade arrangement.
CA26265452A1 discloses a wind turbine with a direct drive generator. The blades of the turbine rotor are fixed to an annulus, which is connected to a hub by rods extending radially from the hub and disposed in a common plane perpendicular to the axis of rotation. The blade forces are resolved at the annulus, to which the inner ends of the blades are connected. The annulus must therefore be fabricated with sufficient strength to withstand these forces. For an annulus having a radius about the axis of rotation of the order of 12 meters and a cross-sectional diameter of the order of 3.5 meters, manufacture is relatively expensive and the annulus is of considerable weight. Transportation and assembly of the wind turbine therefore tend to be expensive.
U.S. Pat. No. 7,042,109B2 discloses various arrangements of wind turbines in which a turbine rotor drives an ironless ring-type generator directly or through a gearbox. In the arrangement shown in FIG. 3 of this document, the blades extend within a rotor hub to the hub bearings and a generator rotor is fixed to the hub. Components parallel to the axis of rotation of forces acting on the blades are communicated to the bearings and also to the generator rotor. Torque produced by the blades is transmitted to the generator rotor.
Wind turbines with the blades fixed to a hub and braced by a rope or cable arrangement are also known. In such turbines, the hub again drives a generator via an axle and typically via a gearbox. Wind turbines of this type are not suitable for relatively high power generation as the swept area cannot be increased sufficiently while maintaining the integrity of structure.
Other examples of wind turbines are disclosed in GB 1511948A1, WO 97/13979A1, U.S. Pat. No. 4,330,714A, U.S. Pat. No. 4,350,895A, WO 86/02701A1, WO 2007/135391A2, US 2005/200134A1, U.S. Pat. No. 5,118,255A, U.S. Pat. No. 2,050,129A, DE 19606359A1 and US 2008/124216A1.


Fire-resistant coating material ADINA comprising ammonium polyphosphate in the amount of 5 to 50% w/w, pentaerythritol in the amount of 6 to 33% w/w, melamine in the amount of 4 to 22% w/w, binder based on polyvinylacrylate dispersion in the amount of 10 to 16.3% w/w, plasticizer based on diisononylphthalate in the amount of 2.3 to 3.5% w/w, talc in the amount of 3 to 10% w/w, stabilizer (preservative) based on 4-chloro-3-methylphenol in the amount of 0.15 to 0.25% w/w, and water in the amount of 13.5 to 17% w/w.

Fire-resistant coating materials for technical purposes are well-known and widely used in industry. The so-called intumescent technical coatings are special coatings for special purposes. Their application shall be performed only by trained experts on the basis of fire safety specialists recommendation, wherein the exact thickness of coating has to be followed in application.
The aim of intumescent coatings with higher fire-resistance is to increase the resistance of industrial buildings against fire in case of e.g. burning of building constructions, or possibly to prolong their functionality in case of e.g. burning of electric cables. Intumescent coatings or coating materials are most commonly used in practice. During fire, the coating is getting swollen (thus creating a mechanical barrier), which process is allowed due to a component comprising phosphorus. The swelling of coating provides the industrial buildings with protection against destructive effects of fire, if possible until the time the fire can be extinguished. Therefore, the intumescent coatings can be applied only by experts trained for handling these materials, and the exact thickness of coatings on the basis previous recommendations of fire safety specialists has to be followed during their application. Also, they are sold in specialized shops.
The known coating materials usually include swelling components, film-making binding components, which provide for making the film and for adhesion to a substrate, on which the material is applied, and alternatively they can comprise various pigments and other colouring agents.
For example U.S. Pat. No. 3,654,190 discloses an intumescent coating increasing the fire resistance, comprising melamine, dipentaerythritol, a component comprising phosphorus, and chlorinated paraffin. A disadvantage of the said coating consists in its low resistance against weather conditions, as well as its cracking (destruction) during the fire.
U.S. Pat. No. 3,635,970 discloses an oil coating, comprising not only melamine pyrophosphate and dipentaerythritol, but also chlorinated paraffin as a component which suppresses burning.
U.S. Pat. No. 4,965,296 discloses a liquid intumescent coating comprising not only ammonium phosphate, diammonium phosphate, ammonium polyphosphate or potassium tripolyphosphate, or combinations thereof, but also dipentaerythritol, polyol or chlorinated paraffin, or combinations thereof, melamine resin, urea, or dicyandiamide, or combinations thereof, in the amount of 5 to 35% w/w. Its disadvantages include low resistance against weather conditions, as well as relatively low plasticity of intumescence due to a high viscosity of carbon layer, which decreases thermal-insulation properties.
Besides the above mentioned low resistance to weather conditions, most of the presently available and used fire-resistance coatings are insufficiently adhesive and thus insufficiently resistant to abrasion and also liable to mechanical damage. Moreover, they have quite a high degree of humidity absorbing.
The object of the present invention is to provide a fire-resistance coating material with eliminated undesired properties of previously known and used intumescent technical coatings.


The invention provides a method of reducing the sodium content of a water containing dissolved sodium ions, particularly a water with a sodium ion content of at least 100 ppm. Examples of such waters are effluents such as acid mine drainage and river waters. The method includes the steps of:                (i) removing sodium, calcium and magnesium ions from the water by contacting the water with a cation exchange resin/s to capture sodium, calcium and magnesium ions thereon,        (ii) treating the cation exchange resin/s of step (i) with nitric acid to produce an eluant containing sodium ions, calcium ions, magnesium ions nitrate ions and nitric acid,        (iii) adding a carbonate to the eluant to precipitate the calcium and magnesium ions as calcium and magnesium carbonates;        (iv) separating the precipitated carbonates from the eluant; and        (v) treating the eluant from step (iv) to obtain a sodium and/or potassium nitrate product.

This invention relates to water treatment.
The pollution of water is a major problem around the world. The treatment of polluted water to render it potable or better able to be used in agriculture presents a major challenge.
Water is polluted in many ways. The mining industry is responsible for significant pollution of water which must be treated before it is discharged into the river systems. One of the ways water is polluted is as a result of water seeping into old, disused mine shafts. On passage through the rock, the water dissolves sulphides present in the rock producing sulphuric acid. The water which seeps into the old, disused mine shafts contains sulphuric acid and dissolved salts and can have a pH as low as 3. The mine shafts fill with the acidic water. Underground water sources are polluted with this acidic water. The shafts eventually fill with this acidic water and then the water overflows into the above-ground water ways causing serious problems. This acidic water is known as acid mine drainage (AMD), an acidic effluent of the mining industry.
AMD can be treated by reverse osmosis. Although reverse osmosis provides a very pure water product, it also produces a brine which is waste product containing significant amounts of dissolved salts of cations such as sodium, potassium, calcium, magnesium and the like salts. The brine needs to be disposed of.
Pollution of water is not only caused by human activity. Water which falls on the mountains of South Africa is pure. However, on passage down to the coast the water contacts rock and other formations and some of the minerals contained in these formations dissolves in the water. Thus, some of the water in South African rivers contain significant quantities of dissolved salts. An example of this is the water in the Sundays river. This water contains significant quantities of dissolved sodium, chloride and sulphate ions. The Sundays river water is used to irrigate crops such as citrus orchard. The dissolved ions in the water have the effect of reducing the yields obtainable from citrus trees.


A wind driven aerodynamic manipulator is provided for imparting motion to an aerodynamic model located in a wind tunnel. The manipulator comprises a support for supporting an aerodynamic body within a wind tunnel; a first aerodynamic surface affixed to the support in such a manner as to allow motion to be imparted to the aerodynamic body by an interaction between the first aerodynamic surface and a fluid flow within the wind tunnel; and a first controller for orienting the first aerodynamic surface with respect to the fluid flow. Additionally, a multi-dimensional manipulator is also disclosed.

1. Field of the Invention
The present invention relates generally to a manipulator for aerodynamic investigations of models in a wind tunnel, and more particularly to a manipulator which allows manipulation of the model by the interaction of wind within the wind tunnel and the manipulator.
2. Description of the Prior Art
Model scale information on aerodynamic characteristics may be gathered by aeroballistic or hypervelocity range tests, outdoor free fight tests, spin tunnel experiments or dynamic experiments in wind tunnels. These tests are mainly used for visual studies of the air flow characteristics and the forces of the aircraft model. Generally, the preferred method of testing incorporates the use of a wind tunnel. A model may be either a captive model, i.e., mechanically secured to a mounting platform or support arm, or a free model.
Future aircraft designs will include the capability to maneuver under extreme conditions, where conventional aerodynamic controls are not sufficient. Such "post stall" maneuvering concepts envision finite rate, asymmetric flow interactions to improve pointing and evasion capability. Many of the new flow interactions and opportunities cannot yet be flight tested because existing aircraft technology does not permit such maneuvers to take place. Devices presently used to perform simulations of maneuvers in the wind tunnel are massive and designed for specific motions, and are unsuitable for all but the easiest of maneuvers.
This application deals mainly with captive models. Known simulators for aerodynamic investigations of captive models in a wind tunnel include a multipart support arm, the parts of which are mounted in relation to each other by means of bearings. The support arm is adjusted by a spindle transmission system, electric motors or positioning cylinders to provide motion to the captive model. Generally, these simulators are restricted to at most two degrees of freedom. The following U.S. Patents illustrate various constructions for support arms and other wind tunnel equipment which imparts motion to a model.
U.S. Pat. No. 4,688,421, by Pzsolla, discloses a rear support balance body which is utilized in a wind tunnel. The balance body is composed of an action beam and a reaction beam. The balance body is inserted between a model and a mounting for the model.
U.S. Pat. No. 4,658,635, by Pzsolla et al., discloses a simulator for aerodynamic tests in a wind tunnel. Linear cylinders are provided to generate motion of the model.
U.S. Pat. No. 4,475,385, by Farmer, discloses a model mounting system which provides motion via a tunable mounting plate.
U.S. Pat. No. 4,116,056, by Bulychev et al., discloses a mounting system for aerodynamic models which utilizes a plurality of elastic suspension lines. A hoisting mechanism is attached to the suspension lines and provides motion to the model.
U.S. Pat. No. 4,112,752, by Hafner et al., discloses an apparatus for measuring force components upon aerodynamic models. The device includes three orthogonally disposed bearing members which provide motion to the model.
U.S. Pat. No. 4,091,665, by Fletcher et al., discloses a wind tunnel reaction control model block. The block includes a plurality of thrusting nozzles which may be configured in various combinations to simulate particular thrust characteristics.
U.S. Pat. No. 4,107,986, by Jones, discloses a strain gage balance having fixed beams upon which strain gages are attached.
U.S. Pat. No. 4,074,567, by Horanoff, discloses a wind tunnel balance. This balance utilizes deflection beams to reduce the interaction between the beam and an air flow in a wind tunnel. The deflection beams do not provide any movement to a model within the wind tunnel.
U.S. Pat. No. 4,033,185, by McNally et al., discloses a wind tunnel simulator in which gas is forced through fixed passageways to interact with a tracer projectile. A motor is provided to impart motion to the projectile.
U.S. Pat. No. 3,866,467, by Horanoff, discloses a model support which utilizes a spherical air bearing and a plurality fiber optic cables associated with the air bearing for determining the relative position of the bearing and associated model.
U.S. Pat. No. 3,695,101, by Hanson, discloses a lift balance device. Static lift forces are balanced by the flow of pressurized air against a piston which slides loosely in a casing. This lift is measured by piston displacement.
U.S. Pat. No. 3,613,443, by Curry, discloses a large scale external balance which supports a model in a wind tunnel via a strut which is affixed to the floor of the wind tunnel.
U.S. Pat. No. 3,587,306, by Bryan, discloses a dampening system which is utilized in a wind tunnel.
U.S. Pat. No. 3,561,264, by Needham et al., discloses a link for connecting a model frame to a subframe which is attached to a wind tunnel floor.
U.S. Pat. No. 3,554,028, by Horanoff, discloses a pitch damping balance which utilizes a piston cylinder sliding cam mechanism to impart motion to a model mounted upon the balance.
U.S. Pat. No. 3,552,201, by Horanoff, discloses a roll moment balance. A fixed canted fin assembly is provided on the aft end of a model to impart rotational motion to the model and thus enable a roll moment to be determined.
U.S. Pat. No. 3,456,503, by Wise, discloses a free flight model launch assembly. This device utilizes a turbine for generating an initial spin on the model before launch.
U.S. Pat. No. 3,447,369, by Horanoff, discloses a model support structure which incorporates an air turbine. The air turbine is utilized to provide spin to the model.
For further information on wind tunnel design and captive model testing, please see:
"Rotary Balance Testing of Aircraft Dynamics", Report of Fluid Dynamics Panel Working Group 11, AGRAD Advisory Report No. 265; and PA1 "A Review of Techniques for Determination of Dynamic Stability Parameters in Wind Tunnels", AGRAD-LS-114, (1981).
The most obvious objective of simulating complex maneuvers is to explore the flow phenomena and forces which occur in the course of the motion. A second objective, subordinate to the first, is to turn a transient, one time maneuver into an event that can be precisely duplicated periodically. This would convert the transient flow measurement problem into periodic problem, amenable to advanced diagnostic systems which are now used in rotorcraft and compressor flows. When the rates of motion are converted from the full-scale flight environment to the equivalent rates for scale models in a wind tunnel, it is found that the rates are quite high and require large forces and moments. If the manipulator must perform these maneuvers independent of the aerodynamic forces acting on the model, a large, rigid manipulator arm is required. The aerodynamic forces and the large mass of the manipulator, even if economically feasible, becomes too massive in relation to the model and produces unacceptable flow interference in the wind tunnel. Thus, the manipulators described above would be incapable of performing these maneuvers.

Wind driven dynamic manipulator for a wind tunnel


A thin-film piezo-resonator includes a silicon substrate and a resonator assembly. The substrate is formed with a cavity or through-hole which is opened in the upper and the lower surfaces of the substrate. The resonator assembly, disposed at a location corresponding to the cavity, is composed of a first electrode contacting the upper surface of the substrate, a piezoelectric layer formed on the first electrode and a second electrode formed on the piezoelectric layer. The cavity has a side surface extending in a substantially perpendicular direction to the first surface.

1. Field of the Invention
The present invention relates to a thin-film piezoelectric resonator and a method of making the same. The present invention also relates to a band-pass filter utilizing a thin-film piezoelectric resonator (called xe2x80x9cpiezo-resonatorxe2x80x9d below).
2. Description of the Related Art
With the rapid spread of mobile telecommunications equipment such as portable telephones, small and light band-pass filters, as well as resonators needed to make such filters, are in great demand. As known in the art, thin-film piezo-resonators are suitable for producing high-power filters.
A typical thin-film piezo-resonator includes a substrate and a resonator assembly mounted on the substrate. The resonator assembly includes a piezoelectric film and a pair of thin electrodes sandwiching the piezoelectric film from above and below. The substrate is formed with a cavity below the lower electrode of the resonator assembly.
When an AC voltage is applied to the upper and the lower electrode of the piezo-resonator, the sandwiched piezoelectric film vibrates in its thickness direction (which is known as the inverse piezoelectric effect). On the other hand, by the direct piezoelectric effect, a mechanical vibration or elastic wave is converted into a corresponding electrical signal. The elastic wave is a longitudinal wave whose main displacement occurs in the thickness direction of the piezoelectric film. In such a thin-film piezo-resonator, the resonator assembly resonates when its thickness H is equal to n/2 times the wavelength of the elastic wave (where n is an integer). Supposing that the propagation velocity of the elastic wave is V (which depends on the material used), the resonance frequency F is expressed by a formula F=nV/2H. This means that a piezo-resonator having desired frequency characteristics can be obtained by adjusting the thickness H of the resonator assembly. Further, by connecting such resonators in a ladder configuration, it is possible to produce a band-pass filter which allows only those electric waves lying within a certain frequency range to pass.
In the above-described thin-film piezo-resonator, desired resonance characteristics are attained by providing a cavity or hole below the lower electrode. Techniques suitable to making such a cavity are disclosed in xe2x80x9cZnO/SiO2-DIAPHRAGM COMPOSITE RESONATOR ON A SILICON WAFERxe2x80x9d (K. NAKAMURA, ELECTRONICS LETTERS Jul. 9, 1981 Vol. 17 No. 14 p507-509), JP-A-60 (1985)-189307, JP-A-2000-69594, U.S. Pat. No. 6,060,818 and U.S. Pat. No. 5,587,620 for example.
FIG. 20 shows, in section, a thin-film piezo-resonator disclosed in the above-mentioned xe2x80x9cZnO/SiO2xe2x80x94 DIAPHRAGM COMPOSITE RESONATOR ON A SILICON WAFERxe2x80x9d. The thin-film piezo-resonator (generally indicated by reference numeral 700) includes a (100)-cut silicon substrate 710 and a resonator assembly 720 supported by the substrate 710. The resonator assembly 720 is made up of a lower electrode 721, a piezoelectric film 722, and an upper electrode 723. The silicon substrate 710 has an upper surface upon which a SiO2 film 711 is formed by thermal oxidation. The resonator assembly 720 is placed directly on the SiO2 film 711. The silicon substrate 710 is formed with a cavity 710a whose upper opening is closed by the SiO2 film 711. The cavity 710a can be produced by anisotropic etching with respect to the (100) surface of the silicon substrate. The anisotropic etching is performed from below the silicon substrate 710 with the use of KOH solution or EDP solution (ethylenediamine+pyrocatechol+water) for example.
The above anisotropic etching relies upon the fact that the etching rate with respect to the (100) surface of the substrate 710 is significantly greater than the etching rate with respect to the (111) surface. Therefore, the resonator assembly is to be provided only on the (100) surface of the substrate 710. However, such positional limitation is disadvantageous since it restricts the option of the material suitable for making the components of the resonator assembly 720, while also depriving the resonator assembly components of freedom of orientation. Another disadvantage is that the lower opening of the cavity 710a tends to be unduly large due to the nonupright side wall 710axe2x80x2 of the cavity 710a. In the illustrated arrangement, the side wall 710axe2x80x2 corresponds to the (111) surface of the substrate 710 and has an inclination of 54.7 degrees with respect to the (100) surface of the silicon substrate 710. Due to this, the cavity 710a has a large opening in the bottom surface of the silicon substrate 710. For instance, when the substrate 710 has a thickness of 300 xcexcm, the lower opening of the cavity 710a is larger than the upper opening by more than 420 xcexcm. Unfavorably, such a large opening of the cavity 710a reduces the mechanical strength of the piezo-resonator 700. In addition, it contributes to an increase in the overall size of the piezo-resonator 700. With the use of such oversize piezo-resonators, a compact band-pass filter cannot be obtained. Specifically, when the thickness of the substrate 710 is 300 xcexcm, the lower opening of the cavity 710a is larger than the upper opening by more than 420 xcexcm, as noted above. Thus, the distance between the neighboring upper openings should be more than 420 xcexcm. Further, as the distance between the adjacent upper openings increases, the length of the wiring pattern for connecting the adjacent resonator assemblies should also increase. This leads to an increase in the resistance of the wiring pattern. A greater resistance of the wiring pattern can be a major factor that prevents the improvement of the filter characteristics in a high-frequency band.
FIG. 21 shows a thin-film piezo-resonator disclosed in JP-A-60-189307. The piezo-resonator 800 includes a substrate 810, and a resonator assembly 820 which is made up of a lower electrode 821, a piezoelectric film 822, and an upper electrode 823. A cavity 830 is provided between the substrate 810 and the resonator assembly 820. According to the Japanese document, the piezo-resonator 800 is fabricated in the following manner. First, a sacrifice layer for the cavity 830 is formed in a pattern on the substrate 810. Next, a SiO2 film 840 is formed on the sacrifice layer 840 in a manner such that part of the sacrifice layer is exposed. Then, the resonator assembly 820 is provided on the SiO2 film 840. Finally, the sacrifice layer is removed by wet etching, so that the cavity 830 appears below the resonator assembly 820. According to this method, the cavity 830 is kept from becoming too large with respect to the resonator assembly 820.
In the thin-film piezo-resonator utilizing a longitudinal vibration in the thickness direction, a high-orientation piezoelectric film is required to provide excellent resonance characteristics. According to the technique disclosed in JP-A-60-189303, however, it is difficult to give a sufficiently high orientation to the piezoelectric film 822. The cavity 830 below the resonator assembly 820 has a length L15, which needs to be at least a few micron meters when a twist and oscillation displacement of the resonator assembly 820 are taken into consideration. Unfavorably, the sacrifice layer, formed to have a thickness corresponding to the length L15, has a greater surface roughness than that of the silicon substrate 810. This deteriorates the orientation of the lower electrode 821 and the piezoelectric film 822 both of which are grown on the sacrifice layer via the SiO2 film 840. As a result, it is difficult to obtain good resonance characteristics with the thin-film piezo-resonator.
FIG. 22 is a sectional view of a thin-film piezo-resonator disclosed in JP-A-2000-69594. The thin-film piezo-resonator 900 includes a silicon substrate 910, and a resonator assembly 920 made up of a lower electrode 921, a piezoelectric film 922 and an upper electrode 923. A cavity 910a is provided below the resonator assembly 920. According to this document, to make the thin-film piezo-resonator 900, the silicon substrate 910 is etched to form a recess serving as the cavity 910a. Then, a SiO2 film 930 is formed by thermal oxidation on a surface of the silicon substrate 910. Next, material is deposited in the cavity 910a to form a sacrifice layer. After the depositing, the surface of the sacrifice layer is polished and cleaned. Next, the resonator assembly 920 is formed on the sacrifice layer in a manner such that the sacrifice layer is partially exposed. Finally, the sacrifice layer is removed by wet etching.
However, the method disclosed in JP-A-2000-69594 includes a large number of steps such as the step of depositing the sacrifice layer in the cavity 910a, the step of polishing the sacrifice layer and so on. Therefore, it is difficult to manufacture the thin-film piezo-resonator at a low cost and at a high yield.
The present invention has been proposed under the circumstances described above. It is, therefore, an object of the present invention to solve or reduce the above conventional problems, and to provide a thin-film piezo-resonator suitable for miniaturization and having a highly oriented piezoelectric film, to provide a band-pass filter including this thin-film piezo-resonator, and to provide a method of making such a thin-film piezo-resonator.
According to a first aspect of the present invention, there is provided a thin-film piezo-resonator comprising: a substrate having a first surface and a second surface opposite to the first surface, the substrate being formed with a cavity that has a first opening in the first surface and a second opening in the second surface; and a resonator assembly including an exciter composed of a first electrode contacting the first surface, a piezoelectric layer on the first electrode and a second electrode on the piezoelectric layer, the assembly being disposed at a location corresponding to the cavity. The cavity includes a side surface extending in a substantially perpendicular direction to the first surface of the substrate.
In this specification, the xe2x80x9cexciterxe2x80x9d refers to the overlapping region of the first and the second electrodes (or electrode patterns) and the piezoelectric layer.
With the above arrangements, it is possible to fabricate a thin-film piezoelectric resonator that is compact and exhibits excellent resonance characteristics. The compactness results from the cavity that penetrates the substrate in a non-flaring manner, with an uniformly upright side surface. Such a cavity may be produced by dry etching such as Deep-RIE (Reactive Ion Etching), regardless of the cut condition of the substrate. With the use of such compact resonators, a compact filter can be obtained. Further, since the cut condition of the substrate does not affect the formation of the cavity, the most suitable cut surface can be realized in the substrate. The free selectability of the cut surface facilitates the forming of a highly oriented first electrode (lower electrode) thereon. This allows a highly oriented piezoelectric layer to be formed on the first electrode. Accordingly, it is possible to produce a thin-film piezo-resonator with excellent resonance characteristics.
The first electrode and the second electrode may be formed of e.g. aluminum (Al), copper (Cu), molybdenum (Mo), chromium (Cr), titanium (Ti) and platinum (Pt). The piezoelectric layer may be formed of e.g. aluminum nitride (AlN), zinc oxide (ZnO), lead zirconate titanate (PZT), and lead titanate (PbTi3). The substrate may be made of silicon.
Preferably, the first electrode may include a uniaxially oriented single-layer conductive member or uniaxially oriented multi-layer conductive member. In addition, the piezoelectric layer may also be uniaxially oriented. Preferably, the substrate may be a (111)-cut silicon substrate, so that its first and second surfaces are a (111) surface. These arrangements are preferable in providing a highly oriented piezoelectric layer.
Preferably, the first electrode may include a single conductive layer containing either one of (111)-uniaxially oriented Al and (111)-uniaxially oriented Cu. Or, the first electrode may include a stack of uniaxially oriented conductive layers including a first conductive layer held in contact with said first surface, the first conductive layer containing either one of (111)-uniaxially oriented Al and (111)-uniaxially oriented Cu. Or, the first electrode may have a two-layer structure including a first conductive layer and a second conductive layer, where the first conductive layer, held in contact with the first surface of the substrate, contains either one of (111)-uniaxially oriented Al and (111)-uniaxially oriented Cu, while the second conductive layer contains (110)-uniaxially oriented Mo.
With the above arrangement, it is possible to form a highly oriented first electrode on the (111)-cut silicon substrate.
Preferably, the piezoelectric layer may be made of either one of (002)-uniaxially oriented AlN and (002)-uniaxially oriented ZnO for high orientation.
Preferably, the resonator of the present invention may further include a cover substrate for protection of e.g. the resonator assembly. The cover substrate may be bonded to the second surface of the substrate so as to close the cavity.
Preferably, the first electrode and the piezoelectric layer may each include a portion exposed to the cavity. Such exposure is advantageous to providing the resonator with excellent resonance characteristics.
According to a second aspect of the present invention, there is provided a thin-film piezo-resonator that includes: a (111)-cut silicon substrate; a first electrode formed on the substrate and containing either one of Al and Cu; a piezoelectric layer formed on the first electrode and containing either one of AlN and ZnO; and a second electrode formed on the piezoelectric layer. The silicon substrate includes a first surface which is a (111) surface. The first electrode is held in contact with the first surface of the substrate.
According to a third aspect of the present invention, there is provided a thin-film piezo-resonator that includes: a substrate having a first surface and a second surface opposite to the first surface, the substrate being formed with a cavity that has a first opening in the first surface of the substrate; and a resonator assembly including a first electrode contacting the first surface of the substrate, a piezoelectric layer on the first electrode and a second electrode on the piezoelectric layer. The resonator assembly is disposed at a location corresponding to the cavity. Each of the first electrode and the piezoelectric layer includes a portion exposed to the cavity.
With the above arrangements, the resonator assembly exhibits better resonance characteristics than when it is isolated from the cavity. Further, when the opening of the cavity is wide enough to allow not only the first electrode but also the piezoelectric layer to be exposed, resonance characteristics such as the minimum insertion loss or attenuation pole suppression can be improved.
According to a fourth aspect of the present invention, there is provided a filter that includes: a substrate having a first surface and a second surface opposite to the first surface, where the substrate is formed with a plurality of cavities spaced from each other; a first electrode pattern held in contact with the first surface of the substrate; a piezoelectric layer on the first electrode pattern; a second electrode pattern on the piezoelectric layer; and a plurality of resonator assemblies provided by a combination of the first electrode pattern, the piezoelectric layer and the second electrode pattern, where each of the resonator assemblies corresponds in position to one of the cavities. Each of the cavities has a side surface extending in a substantially perpendicular direction to the first surface of the substrate.
Preferably, each of the cavities may include a first opening in the first surface of the substrate and a second opening in the second surface of the substrate, where the distance between adjoining first openings is no greater than 420 xcexcm.
With the above arrangement, it is possible to provide a compact filter. Further, since the connecting distance between any adjoining resonator assemblies can be short, the resistance of the wiring pattern is also reducible. Advantageously, a filter with a less resistive wiring pattern exhibits better performance in a high-frequency band.
In a conventional filter which includes a silicon substrate formed with several cavities (each corresponding in position to one of the piezoelectric resonators), the upper openings of adjoining cavities should be spaced from each other by more than 420 xcexcm (supposing that the thickness of the substrate is 300 xcexcm or more) due to the downward flare of the cavities (see FIG. 20). According to the present invention, on the other hand, the distance between adjoining first or upper openings is 420 xcexcm or smaller by forming each cavity in a manner such that its side surface extends perpendicularly to the substrate. As a result, the filter of the present invention can be smaller than a conventional filter.
Preferably, the resonator assemblies used for the filter of the present invention may include a first group of resonator assemblies connected in series and a second group of resonator assemblies connected in parallel. This makes the filter a ladder type.
Preferably, the first electrode pattern and the piezoelectric layer may be exposed to one of the cavities.
According to a fifth aspect of the present invention, there is provided a filter that includes: a substrate that has a first surface and a second surface opposite to the first surface and is formed with a plurality of cavities each including a first opening in the first surface of the substrate and a second opening in the second surface of the substrate; a first electrode pattern held in contact with the first surface of the substrate; a piezoelectric layer on the first electrode pattern; a second electrode pattern on the piezoelectric layer; and a plurality of exciters provided by the combination of the first electrode pattern, the piezoelectric layer and the second electrode pattern, where each of the exciters corresponds in position to one of the cavities. The first electrode pattern and the piezoelectric layer each include a portion exposed to one of the cavities.
In the above-mentioned aspects of the present invention, the first and the second openings of the cavity may preferably be circular or oval rather than rectangular. This is because a rectangular opening is more difficult to make than a smoothly curved opening by dry-etching, since the etching rate for the corners of the opening tends to be slower than the etching rate for the other portions. In particular, when several openings of different sizes are to be made in a single substrate, the production efficiency is significantly higher in making arcuate openings than in making rectangular openings.
As noted above, the first electrode or the piezoelectric layer may have a portion exposed to a cavity for better resonance characteristics. Preferably, these exposed portions may be made of a material which is not etched by a fluorine gas. Examples of such material are aluminum and copper. With this arrangement, the first electrode and the piezoelectric layer will not or hardly be damaged in performing Deep-RIE.
In this specification, as defined above, an xe2x80x9cexciterxe2x80x9d is the overlapping region of the first and the second electrodes (or electrode patterns) and the piezoelectric layer. More specifically, the first electrode includes a xe2x80x9cfirst exciter portionxe2x80x9d that overlaps the second electrode. Likewise, the second electrode includes a xe2x80x9csecond exciter portionxe2x80x9d that overlaps the first electrode. In symmetry, the first and the second exciter portions have the same or substantially same configuration. The exciter is the assembly of the first and the second exciter portions and a portion of the piezoelectric layer that is sandwiched between the first and the second exciter portions. Since the first and the second exciter portions are (substantially) the same in shape, the desired capacitance is precisely attained between the first and the second exciter portions. Preferably, each exciter portion as a whole or in part may be circular or oval.
In the first to fifth aspects of the present invention, the area of the first opening of a cavity may preferably be 1xcx9c2.25 times larger than the area of the above-defined first or second exciter portion. With this design, the resonator assembly can exhibit good resonance characteristics, while being prevented from suffering deformation or damage.
According to a sixth aspect of the present invention, there is provided a method of making a thin-film piezo-resonator. The method includes the steps of: preparing a substrate including a first surface and a second surface opposite to the first surface; forming a resonator assembly which includes a first electrode held in contact with the first surface of the substrate, a piezoelectric layer formed on the first electrode and a second electrode formed on the piezoelectric layer; and forming a cavity by dry-etching the substrate, where the cavity is disposed at a location corresponding to the resonator assembly, and opened in the first and the second surfaces of the substrate. The cavity includes a side surface extending in a substantially perpendicular direction to the first surface of the substrate.
According to a seventh aspect of the present invention, there is provided a method of making a thin-film piezo-resonator. The method includes the steps of: preparing a substrate including a first surface and a second surface opposite to the first surface; forming a resonator assembly which includes a first electrode held in contact with the first surface of the substrate, a piezoelectric layer formed on the first electrode and a second electrode formed on the piezoelectric layer; and forming a cavity by dry-etching the substrate, where the cavity is disposed at a location corresponding to the resonator assembly, and opened in the first and second surfaces of the substrate. The first electrode and the piezoelectric layer are caused to be partially exposed to the cavity at the cavity-forming step.
In the sixth and the seventh aspects of the present invention, the dry etching may be Deep-RIE. The method may further include the step of bonding a cover substrate to the second surface of the substrate so as to close the cavity. In the method, a groove for dividing the substrate may also be formed by etching at the cavity-forming step.
Other features and advantages of the present invention will become apparent from the detailed description given below with reference to the accompanying drawings.

Thin-film piezoelectric resonator, band-pass filter and method of making thin-film piezoelectric resonator


A sealing device including a mask for partially irradiating light and a method of manufacturing a display device using the sealing device is disclosed. The sealing device used to bond first and second substrates by interposing a sealing material at edges of the first and second substrates and by irradiating light to the sealing material comprises: a mask disposed on one side of the stage, in which a transmission portion is formed in correspondence to the formation position of the sealing member so that light can be irradiated to the sealing material; and an optical head irradiating the light to the sealing material through the transmission portion of the mask. A pattern for regulating the amount of the light irradiated to the sealing material is formed in the transmission portion of the mask.

1. Field of Technology
The present invention relates to a sealing device and a method of manufacturing a display device using the sealing device, and more particularly to a sealing device including a mask for partially irradiating light and a method of manufacturing a display device using the sealing device.
2. Discussion of Related Technology
Generally, an organic light display device includes a substrate provided a pixel region and a non-pixel region, and a container or a substrate disposed opposite to the substrate for encapsulation and adhered to the substrate by a sealant such as epoxy.
A plurality of light emitting devices connected between a scan line and a date line in the form of matrix are formed in the pixel region of the substrate, and the light emitting device includes an anode electrode and a cathode electrode, and an organic thin film layer formed between the anode electrode and the cathode electrode and having a hole transportation layer, an organic light emitting layer, and an electron transportation layer.
However, the light emitting device is vulnerable to hydrogen and oxygen since it contains an organic material and is easily oxidized by moisture in air so that the electrical and light emitting characteristic thereof are deteriorated since the cathode electrode is formed of a metal material. In order to prevent this problem, moisture penetrating from outside is removed by mounting a moisture absorbing material to a container in the form of a can or a cup of a metal material or a substrate of glass or plastic in the form of powder or by bonding the container or the substrate in the form of a film.
However, the method of mounting the moisture absorbing material in the form of powder complicates the process and increases the material and process costs, thereby increasing the thickness of the display device. So, it is difficult to apply the method to entire surface light emission. Further, the method of bonding a moisture absorbing material in the form of a film can limitedly remove moisture and has low durability and reliability, thereby making mass-production difficult.
In order to solve the above-mentioned problem, a method using a sealing material such as a frit and bonding the sealing material by irradiating laser has been used.
Korean Patent Laid-Open No. 2001-0084380 (Sep. 6, 2001) discloses a method for sealing a frit frame using laser.
Korean Patent Laid-Open No. 2002-0051153 (Jun. 28, 2002) discloses a packaging method for attaching an upper substrate and a lower substrate to a frit layer using laser.

Sealing device and method of manufacturing display device using the same


The present invention includes an apparatus and method for telemetry communication with oil-well monitoring and recording instruments located in the vicinity of the bottom of gas or oil recovery pipes. Such instruments are currently monitored using electrical cabling that is inserted into the pipes; cabling has a short life in this environment, and requires periodic replacement with the concomitant, costly shutdown of the well. Modulated reflectance, a wireless communication method that does not require signal transmission power from the telemetry package will provide a long-lived and reliable way to monitor down-hole conditions. Normal wireless technology is not practical since batteries and capacitors have to frequently be replaced or recharged, again with the well being removed from service. RF energy generated above ground can also be received, converted and stored down-hole without the use of wires, for actuating down-hole valves, as one example. Although modulated reflectance reduces or eliminates the loss of energy at the sensor package because energy is not consumed, during the transmission process, additional stored extra energy down-hole is needed.

The present invention relates generally to wireless data transmission and, more particularly, to the use of modulated-reflector technology for full-duplex, wireless communications with remote, down-hole electronics modules. The invention also relates to the wireless transmission of electrical energy for storage at remote locations
Present day oil wells are highly sophisticated, hugely expensive operations. Modern well drilling is directionally controlled and the pipe runs can reach distances of over 25,000 feet. Platforms for off-shore wells can cost $1.5 billion apiece and must be operated at the highest levels of efficiency. Determining the down-hole conditions of a well has become a critical requirement. Conditions such as temperature, pressure, water content, salinity and others must be closely monitored. For example, as a well ages, well parameters are used to make important decisions as to how to obtain the highest yield from a particular branch of a manifold as the well""s output changes composition and performance over time. Thus, telemetry from down-hole sensors has become critical to making multi-million dollar decisions.
Reliable telemetry using electrical cables is difficult in the oil-well environment since, among other problems, cables are regularly destroyed by the harsh conditions extant down hole; for example, well temperatures can be as high as 250xc2x0 C., there is continuous, substantial abrasion by sand and dirt carried by flowing gases and liquids, and the actual cable insertion process can disrupt cable continuity.
A wireless method would be a significant improvement over the use of cables, but electricity to power normal transmissions from the sensors has not been practical without the use of wires since down-hole power sources such as batteries or capacitors need to be recharged.
Accordingly, it is an object of the present invention to communicate with down-hole sensing and monitoring equipment without the use of wires.
Another object of the invention is to provide energy to down-hole electrical equipment without the use of wires.
Still another object of the present invention is to significantly reduce energy consumption in the transmission of information from down-hole sensors.
Additional objects, advantages and novel features of the invention will be set forth in part in the description which follows, and in part will become apparent to those skilled in the art upon examination of the following or may be learned by practice of the invention. The objects and advantages of the invention may be realized and attained by means of the instrumentalities and combinations particularly pointed out in the appended claims.
To achieve the foregoing and other objects, and in accordance with the purposes of the present invention, as embodied and broadly described herein, the method hereof for communicating with the distal end of an electrically conducting pipe includes the steps of: generating a radio frequency signal having a chosen frequency at the proximal end of the electrically conducting pipe such that the electrically conducting pipe radiates the signal at least in the vicinity of the distal end thereof; reflecting the radiated radio frequency signal in the vicinity of the distal end of the electrically conducting pipe such that the reflected radio frequency signal is received by the conducting pipe and transmitted to the proximal end thereof; modulating the reflected radio frequency signal in response to data received from the vicinity of the distal end of the electrically conducting pipe; and detecting the modulated, reflected signal at the proximal end of the electrically conducting pipe.
In another aspect of the present invention and in accordance with its objects and purposes the method for communicating with the distal end of an electrically conducting pipe hereof includes the steps of: generating a radio frequency signal having a chosen frequency at the proximal end of the electrically conducting pipe such that the signal remains within the electrically conducting pipe and is transmitted thereby to the distal end thereof whereafter the radio frequency signal exits the electrically conducting pipe; reflecting the radio frequency signal exiting the distal end of the electrically conducting pipe such that the reflected signal reenters the electrically conducting pipe, remains therein and is transmitted to the proximal end thereof; modulating the reflected radio frequency signal in response to data received in the vicinity of the distal end of the electrically conducting pipe; and detecting the modulated, reflected signal at the proximal end of the electrically conducting pipe.
In yet another aspect of the present invention and in accordance with its objects and purposes the method for communicating with the distal end of an electrically conducting pipe buried in the ground hereof includes the steps of: generating an electrical signal having a chosen ultra-low or extremely low frequency in the ground in the vicinity of the proximal end of the electrically conducting pipe such that the signal penetrates the ground at least to the vicinity of the buried distal end thereof; receiving the signal using the electrically conducting pipe as an antenna; modulating the impedance of the electrically conducting pipe in response to data received in the vicinity of the distal end of the electrically conducting pipe, whereby the signal received by the electrically conducting pipe is modulated; and detecting the modulated, received signal at the proximal end of the electrically conducting pipe.
In still another aspect of the present invention and in accordance with its objects and purposes the method for providing electrical energy to the distal end of an electrically conducting pipe includes the steps of: generating a radio frequency signal having a chosen frequency at the proximal end of the electrically conducting pipe such that the electrically conducting pipe radiates the signal at least in the vicinity of the distal end thereof; receiving the radio frequency signal in the vicinity of the distal end of the electrically conducting pipe; converting the radio frequency signal into dc electrical current; and storing the electrical current converted in the vicinity of the distal end of the electrically conducting pipe.
In a further aspect of the present invention and in accordance with its objects and purposes the method for providing electrical energy to the distal end of an electrically conducting pipe hereof includes the steps of: generating a radio frequency signal having a chosen frequency at the proximal end of the electrically conducting pipe such that the signal remains within the electrically conducting pipe and is conducted thereby to the distal end thereof whereafter the radio frequency signal exits the electrically conducting pipe; receiving the radio frequency signal exiting the distal end of the electrically conducting pipe; converting the received radio frequency signal into dc electrical current; and storing the electrical current in the vicinity of the distal end of the electrically conducting pipe.
In still another aspect of the present invention and in accordance with its objects and purposes the method for providing electrical energy to the distal end of an electrically conducting pipe buried in the ground hereof, includes the steps of: generating an electrical signal having a chosen ultra-low or extremely low frequency in the ground in the vicinity of the proximal end of the electrically conducting pipe such that the signal penetrates the ground to the vicinity of the buried distal end thereof; receiving the electrical signal in the vicinity of the buried distal end of the electrically conducting pipe; converting the received electrical signal into dc electric current; and storing the electrical current in the vicinity of the distal end of the electrically conducting pipe.
Benefits and advantages of the present invention include the communication with and the supply of electrical energy to down hole electronics modules without the use of wires.

The Regents of the University of California


The present invention discloses an LCD panel and a method for fabricating the same. More specifically, the LCD panel includes first and second substrates, a photo-hardening sealant between the first and second substrates, a plurality of metal lines on the first substrate, wherein the metal lines are formed of a transparent conductive film at least at portions where the metal lines cross one another, and a liquid crystal layer between the first and second substrates. It is emphasized that this abstract is provided to comply with the rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.

This application claims the benefit of the Korean Application No. P2001-10775 filed on Mar. 2, 2001, which is hereby incorporated by reference.
1. Field of the Invention
The present invention relates to a display, and more particularly, to a liquid crystal display panel and a method for fabricating the same. Although the present invention is suitable for a wide scope of applications, it is particularly suitable for improving adhesion between substrates.
2. Discussion of the Related Art
In general, a liquid crystal display (LCD) has two sheets of glass substrates and a liquid crystal layer sealed between the glass substrates, and a thin film transistor (TFT) is used as a switching device for switching a signal voltage to the liquid crystal layer.
Referring to FIG. 1, an LCD is a non-emission device provided with a lower glass substrate 1 having a TFT as a switching device formed thereon, an upper glass substrate 2 having a color filter formed thereon, and a liquid crystal 3 injected between the glass substrates 1 and 2, thereby obtaining an image by electro-optical characteristics of the liquid crystal 3. Since the LCD consumes a low power consumption and is portable, it draws a great attention as a next generation display which can replace a cathode ray tube (CRT).
More specifically, the lower glass substrate 1 has a TFT array 4, a pixel electrode 4a, and an orientation film 8 formed thereon, while the upper glass substrate 2 has a light shielding layer 5, a color filter layer 6, a common electrode 7, and the orientation film 8. The lower substrate 1 and the upper substrate 2 are bonded by a sealant 9, such as an epoxy resin. A driving circuit 11 on a PCB 10 is connected to the lower glass substrate 1 through a tape carrier package (TCP) 12 for generating and forwarding various control signals and signal voltages required for displaying an image on the LCD panel.
The sealant 9 is used for bonding and fixing the two sheets of glass substrates. In addition, it prevents external moisture from penetrating into the liquid crystal because the liquid crystal easily absorbs water. As a result, resistivity of the liquid crystal is lowered, and impurities may be formed therein when the liquid crystal is exposed to the air.
There are an inorganic sealant and an organic sealant. Although the inorganic sealant is used in the early generation LCD, the inorganic sealant is not used any longer as a liquid crystal material is developed. Among the organic sealants, there are epoxy group resins, phenol group resins, and acryl group resins, which may be sorted into two liquid types in which a main agent and a hardening agent are to be mixed in use, and one liquid type containing the main agent and the hardening agent as a single solution.
Depending on methods of hardening in the sealant, there are a thermo-hardening type, and a UV hardening type. Both types are required a strong adhesion, a high crystallinity, a good printability, and the like. Further, for accurately controlling a cell gap, a uniform spreading is necessary when the substrate is under pressing, heating, and curing processes.
The thermo-hardening resin, such as epoxy or phenol, has advantages of a high mechanical strength, a strong adhesion, and a good cross-linking. On the other hand, the UV hardening resin may be a better type in applying a larger sized device because it has a low hardening temperature, and a short hardening time period. Therefore, a thermal expansion problem may be avoided and bonding between the substrates is improved in applying to a large sized substrate.
A related art LCD panel will be explained with reference to the attached drawings. FIG. 2 illustrates a plane view of a related art LCD panel, wherein a first substrate 21 and a second substrate 21a are arranged to face into each other, and a liquid crystal layer (not shown) is formed between the first and second substrates 21 and 21a. Each of the first and second substrates 21 and 21a has an active region xe2x80x98Axe2x80x99 and a pad region xe2x80x98Pxe2x80x99 defined thereon. The first substrate 21 has a plurality of thin film transistors and pixel electrodes on the active region xe2x80x98Axe2x80x99 and a plurality of gate pads 23 and data pads 25 on the pad region xe2x80x98Pxe2x80x99. There is a UV hardening sealant 27 in the pad region xe2x80x98Pxe2x80x99 on the outside of the active region xe2x80x98Axe2x80x99, more specifically, on a pad link part PL, for bonding the first and second substrates 21 and 21a.
FIG. 3 illustrates a detailed view of an xe2x80x98Xxe2x80x99 part of FIG. 2, wherein there are a plurality of gate lines G1, G2, . . . , Gn and data lines D1, D2, . . . , Dn formed in the active region xe2x80x98Axe2x80x99 on the first substrate 21. The gate lines and the data lines cross one another, thereby defining a plurality of pixel regions each having a pixel electrode 31. There are a TFT (not shown) arranged at each crossing part of the gate lines G1, G2, . . . , Gn and the data lines D1, D2, . . . , Dn.
There are gate pads GP1, GP2, . . . , GPn and data pads DP1, DP2, . . . , DPn, connected to a driving IC, for linking driving signals and data signals applied to the gate pads GP1, GP2, . . . , GPn and the data pads DP1, DP2, . . . , DPn to the gate lines G1, G2, . . . , Gn and data lines D1, D2, . . . , Dn at the active region xe2x80x98Axe2x80x99 through gate pad links PL_g, and data pad link PL_d, respectively.
Actually, the gate pads GP1, GP2, . . . , GPn and the data pads DP1, DP2, . . . , DPn are electrically connected to the TCP and anisotropic conductive film (ACF) by a transparent conductive film 33, for receiving the driving signals and the data signals from the external driving IC. The gate pads and the data pads are connected to the TCP and the ACF via the transparent conductive film 33 having a good electrical conductivity and good adhesion because the gate pads and the data pads formed of non-transparent metal have poor adhesion to the TCP and the ACF.
The aforementioned related art LCD panel will be explained in more detail. FIG. 4 illustrates a cross-sectional view along line IVxe2x80x94IV, showing the gate pads of the LCD panel.
Referring to FIG. 4, there are the gate line G1, the gate pad GP1, and the gate pad link PL_g formed on the first substrate 21 having the active region xe2x80x98Axe2x80x99 and the pad region xe2x80x98Pxe2x80x99 defined thereon. The pad region xe2x80x98Pxe2x80x99 has a region for the gate pad GP1 and a region for the gate pad link PL_g. A gate insulating film 41 is formed on the entire surface of the first substrate 21 including the gate pad GP1. There are a protection film 43 on the gate insulating film 41 and a transparent conductive film 33 passed through the gate insulating film 41 and the protection film 43, and electrically connected to the gate pad GP1.
The gate line G1, the gate pad link PL_g, and the gate pad GP1 are formed as a unit, formed of a non-transparent metal, such as aluminum (Al), chromium (Cr), molybdenum (Mo), copper (Cu), an aluminum alloy, a bilayer of the foregoing metals, or the like.
On the second substrate 21a at the active region xe2x80x98Axe2x80x99, there are a light shielding layer 45 extended to a region for the gate pad link PL_g, a color filter layer 47 for displaying colors, and a common electrode 49 and the pixel electrodes 31 (shown in FIG. 3) for applying a voltage to the liquid crystal LC. The photo-hardening sealant 27 along the outside of the active region xe2x80x98Axe2x80x99 having the gate pad link PL_g formed thereon, for bonding the first substrate 21 and the second substrate 21a.
In the meantime, there are thin film transistors and pixel electrodes (both not shown) on the first substrate 21 at the active region. That is, at a portion where the gate line and the data line are crossed, there are a thin film transistor having a gate electrode, a gate insulating film 41 on the gate electrode, a semiconductor layer and an ohmic contact layer on the gate insulating film 41, and a source and a drain electrodes, and a pixel electrode 31 connected to the drain electrode through the protection film 43.
FIG. 5 illustrates a cross-sectional view along line Vxe2x80x94V of FIG. 3, in which reference symbol xe2x80x9cDP1xe2x80x9d denotes a data pad, xe2x80x9cD1xe2x80x9d denotes a data line, and xe2x80x9cPL_dxe2x80x9d denotes a data pad link. A detailed description of FIG. 5 will be omitted because FIG. 5 is similar to FIG. 4 except for that the data pad DP1 and the data line D1 are formed on the gate insulating film 41.
Thus, the foregoing LCD panel displays a picture as the thin film transistor is turned on/off in response to the gate signals and the data signals applied from the external driving IC to the gate lines G1, G2, . . . , Gn and the data lines D1, D2, . . . , Dn at the active region xe2x80x98Axe2x80x99 through the gate pads GP1, GP2, . . . , GPn and the data pads DP1, DP2, . . . , DPn.
However, the foregoing related art LCD panel has the following problems.
The plurality of pad links are formed of a non-transparent metal in the above-described LCD panel. Thus, when a photo-hardening sealant is applied for bonding the first substrate and the second substrate, a light shielding layer is extended to a portion of the pad link on the second substrate, so that UV light for curing the sealant is blocked by the portion. As a result, bonding of the two substrates becomes defective, and a product reliability becomes poor.
Because of the small margin of the light shielding layer and the pads, the photo-hardening sealant is used to product models for monitors only. The photo-hardening sealant should be applied to the circumference of the optical shield layer because the pads are formed of non-transparent metal. The photo-hardening sealant may be applied to large sized product monitors only. In the case of fabricating monitors, since the light shielding layer is exposed to a region for which the photo-hardening sealant is to be coated, light is directed to a color filter substrate, thereby curing the sealant. However, in the case of the notebook PC, there is no room for opening in the light shielding layer due to a small margin.
Accordingly, the present invention is directed to a liquid crystal display panel and a method for fabricating the same that substantially obviate one or more of problems due to limitations and disadvantages of the related art.
Another object of the present invention is to provide a liquid crystal display panel and a method for fabricating the same, which can solve the problem of defective bonding of the two substrates, thereby improving a product reliability.
Additional features and advantages of the invention will be set forth in the description which follows and in part will be apparent from the description, or may be learned by practice of the invention. The objectives and other advantages of the invention will be realized and attained by the structure particularly pointed out in the written description and claims hereof as well as the appended drawings.
To achieve these and other advantages and in accordance with the purpose of the present invention, as embodied and broadly described, an LCD panel includes first and second substrates, a photo-hardening sealant between the first and second substrates, a plurality of metal lines on the first substrate, wherein the metal lines are formed of a transparent conductive film at least at portions where the metal lines cross one another, and a liquid crystal layer between the first substrate and the second substrate.
In another aspect of the present invention, an LCD panel includes first and second substrates each having an active region and a pad region thereon, a photo-hardening sealant along a boundary between the active region and the pad region, a plurality of pads formed in the pad region, a plurality of lines arranged to cross one another in the active region, a plurality of pad links formed of a transparent conductive film connecting the pads and the lines, and a liquid crystal layer between the first and second substrates.
In another aspect of the present invention, a method for fabricating an LCD panel having an active region on a first substrate and first and second pad regions on a second substrate includes forming a plurality of gate lines at the active region and a plurality of gate pads at the first pad region, forming a plurality of data lines at the active region between the gate lines and the gate pads and a plurality of data pads in the second pad region, forming a plurality of pad links formed of a transparent conductive material connected between the gate lines and the gate pads, and the data lines and the data lines, and attaching the first and second substrates.
The LCD panel of the present invention is characterized in that an optical path is provided so that a light can be incident on a photo-hardening sealant applied for bonding the first and second substrates.
In realizing an embodiment, pads and pad links connecting the pads and wiring are formed of a transparent conductive material that transmits the light. Alternatively, at least a part of the pad links the photo-hardening sealant is formed of the transparent conductive material. Thus, light is permitted to pass the transparent conductive material and cure the photo-hardening sealant.
Accordingly, a product reliability is improved because the photo-hardening sealant is effectively cured, thereby improving bonding of the two substrates by eliminating defective bonding.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.

Liquid crystal display panel and method for fabricating the same