A reflective optical element for use in an EUV system is disclosed. The reflective optical element includes a base body, which is produced at least partly from a substrate material. At least one cooling channel through which a cooling medium can flow is arranged in the base body. A material having a thermal conductivity of greater than 50 W/mK is provided as substrate material. The reflective optical element also includes a polishing layer, which is applied on the substrate material. The polishing layer includes an amorphous material which can be processed via polishing.

For optical applications in the extreme ultraviolet wavelength range (EUV) particularly in lithography, almost exclusively reflective optical elements are usually used, the surfaces of which desirably satisfy stringent desired properties with regard to figure and roughness. It is known from to produce such reflective optical elements from glass, for example quartz, or from glass ceramic, for example Zerodur or ULE. The surfaces of these elements are usually polished via so-called superpolishing until a microroughness of the surface is less than 0.2 nm rms.
However, these substrate materials are often suitable only to a limited extent for operation with very high thermal loads which can occur at high radiation powers. This can be all the more applicable if the optical element is configured in the form of a gathering collector mirror for an EUV radiation source. In this case, in general, the high radiation power not only has to be emitted in the EUV wavelength range, but can also result from radiation of the EUV source outside the EUV wavelength range. In these cases, a thermal conductivity of the known mirror materials is often too low to conduct away enough heat from the reflective surface, which can lead to severe heating of the mirror and to a functional disturbance as a result of bending and as a result of thermal degradation of a reflection layer of the mirror.
US 2004/051984 A1 discloses, for the purpose of improving cooling of a reflective optical element, applying a cooling medium to a surface. Stress-dictated distortions of the mirror surface are intended to be substantially reduced by this approach. In such an approach, the cooling capacity can be restricted.
US 2007/0091485 discloses a reflective optical element in the form of a mirror for use in an EUV system. The mirror includes a base body divided into two, which is produced from silicon, Zerodur, copper or Invar and which includes an upper part and a lower part. For the purpose of cooling the mirror, cooling channels are arranged in the upper part of the base body, the cooling channels being configured as so-called microchannels having a diameter of 100 μm or less. In this case, the microchannels are designed such that a laminar flow is established in the channels. This system can be complex and expensive to produce.
US 2008/0043321 A1 discloses a further reflective optical element, which is composed of a plurality of mirror segments and can be used in an EUV lithography system. US 2008/0043321 discloses a multiplicity of substrate materials from which the mirror segment can be constructed. A so-called smoothing layer and a reflection layer are applied on the mirror segment. The mirror segments are connected via bonding to form a mirror.
US 2009/0147386 A1 discloses a mirror for EUV applications which includes a base body, on which a reflective surface is arranged. The mirror furthermore includes a heat dissipation device, which is arranged on a rear side of the base body at a distance from the base body. The heat dissipation device and the base body are connected to one another via bending elements. Cooling channels through which a cooling liquid can be passed are arranged in the heat dissipation device. With the aid of the circulating cooling liquid in the cooling channels, the intention is to obtain a defined temperature distribution in the heat dissipation device.

Reflective optical element for use in an EUV system


The method of the present invention includes a first step of preparing a substrate in which a plurality of circuit boards are integrally connected to one another, each of the circuit boards having conductive patterns which include pads formed on a surface of the circuit board; a second step of electrically connecting circuit elements to the respective conductive patterns on each of the circuit boards; a third step of positioning ends of leads above the respective pads by superposing a lead frame including the plurality of leads on the substrate, and fixing the leads to the pads; and a fourth step of separating the circuit boards from the substrate in a state where the leads are fixed to the respective pads on each of the circuit boards, and thus separating the leads from the lead frame.

1. Field of the Invention
The present invention relates to a method of manufacturing a circuit device, and more particularly relates to a method of manufacturing a circuit device including leads which function as external terminals.
2. Description of the Related Art
With reference to FIG. 5, a configuration of a conventional hybrid integrated circuit device 100 will be described. This technology is described for instance in Japanese Patent Application No. Hei 5 (1993)-102645. Conductive patterns 103 are formed on a surface of a rectangular substrate 101 with an insulating layer 102 interposed therebetween. Each of circuit elements is fixed to a desired spot in a corresponding one of the conductive patterns 103 to form a predetermined electric circuit. Here, as the circuit elements, a semiconductor element 105A and a chip element 105B are respectively connected to the conductive patterns 103. Each of leads 104 is connected to a corresponding one of pads 109, which are formed in a peripheral portion of the substrate 101, and which are respectively made of the conductive patterns 103, and functions as an external terminal. A sealing resin 108 has a function of sealing the electric circuit formed on the surface of the substrate 101. The hybrid integrated circuit device 100 thus configured makes it possible to actively release heat generated from the semiconductor element 105A and the like to the outside through the substrate 101. Thus, the device has excellent heat release properties.
The hybrid integrated circuit device 100 described above is manufactured in the following manner. First, the conductive patterns 103 are patterned on the surface of the substrate 101 made of metal such as aluminum. Next, the semiconductor element 105A and the chip element 105B are fixed, and electrically connected, respectively to predetermined spots in the conductive patterns 103. Furthermore, the leads 104 are fixed to the respective pads 109 each made of the conductive pattern 103. Lastly, the sealing resin 108 is formed on the surface of the substrate 101 in a manner that the circuit elements including the semiconductor element 105A and the like are covered with the sealing resin 108.
However, the above method of manufacturing a hybrid integrated circuit device has a problem that positioning of the leads 104 is troublesome.
Specifically, details of the step of fixing the leads 104 are as follows. First, a jointing material such as solder is applied onto a surface of each of the pads 109 formed on the surface of the substrate 101. Next, a position of a tip of each of the leads 104 is aligned with the surface of a corresponding one of the pads 109. Furthermore, the solder on each of the pads 109 is melted by use of a reflow furnace or the like, and thus the leads 104 are fixed to the respective pads 109.
Accordingly, in the above step, it is necessary to position the tip of each of the leads 104 to the top of a corresponding one of the pads 109, and to hold the lead 104 at a predetermined position until the solder is melted and solidified. As a result, it takes a lot of trouble to fix the leads 104.
By using a lead frame having a plurality of leads 104 connected thereto, the leads 104 can be collectively positioned thereto. Thus, the positioning of the leads 104 can be facilitated. However, even in a case where the lead frame is used, the lead frame is required to be positioned to the substrate, and equivalent work is required to be done. For this reason, it is expensive to position the leads 104.


The present invention discloses a data scheduling register tree structure for radix-2 FFT architecture. The operation method of the proposed invention, there is no need for the Random Access Memory (RAM) to store the data; instead, shift registers with some multiplexers are enough to perform the memory operation with less hardware. There are three steps in the FFT computation such as input storage, data processing and output retrieval. The data processing step is further configured in four different operations. The number of operation mainly depends upon the size of the FFT, which is equal to log2N modes. During each operation, the DSRT changes its structure and these structures are basically MDC (Multi-path Delay Commutator) structures.

Nowadays, the size of FFT architectures used in advanced wireless communication and in signal processing applications is very large. The LTE standard uses 2K size FFT architectures and DVBT2 standard uses FFT architectures whose sizes are up to 8K. In these FFT architectures, more than 90% of the total FFT area is occupied by the memory unit. Therefore, the memory unit in the FFT architectures should be area efficient. Hence, there is need of system, which reduces the area of the memory unit.

Data scheduling register tree for radix-2 FFT architecture


The invention relates to a cable (10) that includes an outer sheath (11) defining a longitudinal cavity (12). The cable (10) also includes a plurality of elements (1) extending within the cavity. Typically, the elements are at least partially coated with a lubricant film.

It is common for a cable to include elements (e.g., subunits) that can be extracted from the cable. Typically, these elements extend side-by-side within the cable (e.g., substantially in parallel within a central cavity defined by the cable's inside wall). Generally, the elements are freely positioned within the cable so that an operator can extract them easily from the cable. In other words, the elements can freely move within the cable's central cavity.
Such cable designs are commonly used for optical-fiber telecommunications networks. By way of example, an optical-fiber cable may include elements (e.g., optical modules or buffer tubes) that are designed to be extracted from the cable in order to serve different buildings. For this purpose, an operator may create an opening in the cable to extract one or more modules that are then taken to a building that is to be served. Other modules can remain within the cable to be extracted (e.g., available to serve another building).
Such optical-fiber cables typically have an outer sheath that defines a central cavity in which optical-fiber modules may extend. Each module typically includes one or more optical fibers, usually between one and twelve optical fibers, wrapped together within the center of the module. The outer sheath is typically made of a polymer (e.g., polyethylene). The outer sheath may also include reinforcements (e.g., strength members) extending longitudinally along the axis of the cable. Such reinforcements may serve to stiffen the structure to prevent the cable from deforming excessively under the effects of temperature or an external force (e.g., from traction or compression).
When an operator in the field seeks to extract a length of an element (e.g., a module) from the cable, the length of an element that can be extracted is limited by several factors. By way of example, the packing ratio of the elements in the cable may limit the length of a module that can be extracted. The packing ratio is defined as the ratio of the sum of the cross-sectional areas of all of the elements divided by the cross-sectional area of the cavity. Other factors that can affect the length of an element that can be extracted include the coefficient of friction between two elements and the coefficient of friction between an element and the wall of the cable cavity.
By way of example, commonly owned European Patent Application Publication No. EP 1921478 A1, which is hereby incorporated by reference in its entirety, discloses a cable including modules and having a maximum packing ratio of 0.7, with the ratio preferably lying in the range of 0.3 to 0.35. The cable includes a solid lubricant (e.g., talc) placed within the cavity to reduce the coefficient of friction between two modules and the coefficient of friction between a module and the wall of the cavity. In the absence of a solid lubricant, the coefficient of friction between the modules (e.g., made of polyester based on thermoplastic elastomers or plasticized PVC) and the inner wall of the cable was high.
Nevertheless, the cable described in European Patent Application Publication No. EP 1921478 A1 has several drawbacks. For example, it requires a large amount of solid lubricant in the cavity to ensure that lubricant is present at all places between two modules. Furthermore, although the length of module that can be extracted may reach 30 meters (m), which is sufficient to enable a cable to be installed in an external duct such as a sewer, such a length is not sufficient for all kinds of applications.
Proposals have also been made to use materials such as polyester or polyamide for the modules in order to reduce their respective coefficients of friction relative to the cable. Thus, if a solid lubricant is provided in insufficient quantities or distributed with insufficient uniformity in the cavity containing the modules, the absence of solid lubricant can be at least partially mitigated so as to retain an acceptable extraction length.
The foregoing notwithstanding, prior cable designs do not allow modules to be extracted from a cable at a sufficient length for all applications (e.g., a branch connection). Indeed, prior solutions do not enable extraction lengths of more than about 30 meters, because the extraction force required becomes too great and often leads to the extracted element being damaged or broken. Accordingly, a need exists for cable designs that better facilitate module extraction.

Cable having lubricated, extractable elements


The present invention discloses a stiffness control mechanism of a variable stiffness earthquake-isolation layer adapted to structural earthquake isolation and wind resistance, which comprises an upper flange plate connected to an upper structure, a lower flange plate connected to a base structure at the bottom, a pin key provided between hollow portions of the upper and lower flange plates, with the pin key movable up and down between the hollow portions of the upper and lower flange plates and the height of the pin key greater than the distance between the upper and lower flange plates, and a control means for fixing the pin key or controlling the pin key to move downward. The stiffness control mechanism of the earthquake-isolation layer of the present invention can automatically change stiffness of the earthquake-isolation layer, both effectively wind resistant and effectively earthquake resistant.

There are two ways to resist earthquakes: One is resisting, that is increasing the strength of a structure so as to ensure the safety of the structure when the structure is under the action of an earthquake with the expected intensity (FIGS. 1 and 3); the other is relieving, that is providing an earthquake-isolation layer with very small horizontal stiffness between the main structure and the basic structure, so that the main structure is basically isolated from the earth in the horizontal direction and the earthquake energy is not easy to spread to the main structure, thus avoiding damage of the main structure (as shown in FIGS. 2 and 4, in which the earthquake-isolation layer 26 is disposed between the main structure 27 and the base structure 28). For the main structure, the smaller the horizontal stiffness of the earthquake-isolation layer, the weaker the response of the upper structure to an earthquake will be. That is, for the action on an earthquake, the smaller the horizontal stiffness of the earthquake-isolation layer, the more advantageous it will be to the upper structure (FIG. 4). In FIGS. 3 and 4, the ground moves back and forth horizontally when an earthquake occurs.
On the other hand, the structure is resistant to a wind load. And the probability of the structure encountering strong winds is much higher than encountering strong earthquakes. For structural wind resistance, providing an earthquake-isolation layer is disadvantageous, and the smaller the horizontal stiffness of the earthquake-isolation layer, the more disadvantageous it will be to the upper structure (FIGS. 5 and 6). Therefore, an earthquake-isolation structure of a common earthquake-isolation layer is adopted, with the horizontal stiffness of the earthquake-isolation layer being a trade-off between the structural earthquake isolation and wind resistance.

Variable-rigidity seismic-isolation layer rigidity control mechanism suitable for structural seismic isolation and wind resistance

ARCHITECTURAL DESIGN & RESEARCH INSTITUTE OF SOUTH CHINA UNIVERSITY OF TECHNOLOGY


A MEMS device is disclosed. The MEMS device comprises a MEMS substrate and a CMOS substrate having a front surface, a back surface and one or more metallization layers. The front surface being bonded to the MEMS substrate. The MEMS device includes one or more conductive features on the back surface of the CMOS substrate and electrical connections between the one or more metallization layers and the one or more conductive features.

Wafer-level packaging of semiconductor devices is a relatively new but widely used technology that allows semi-conductor and MEMS devices to be packaged on a wafer scale with solder balls attached directly to the die (typically through a stress-relief layer). This technology yields the smallest possible package size for any given device while at the same time reducing packaging cost by packaging an entire wafer of die in a batch process. The most common wafer-level packaging technologies (ex. Shellcase, uBGA, WAVE, and others) typically make direct contact to the CMOS wafer metallization, but cannot easily contact the top-layer of the MEMS since it is typically electrically isolated from the CMOS. In cases where the MEMS handle or cap wafer or a metal layer deposited onto the MEMS handle or cap wafer must be electrically contacted, the current wafer-level packaging technologies cannot be directly applied.
Accordingly, what is desired is a system and method which would overcome the above-identified issues. The method and system should be easy to implement, cost-effective, and adaptable to existing systems. The present invention addresses such a need.

MEMS device including an electrical interconnect through a substrate


An intermediate and mailer are provided, the mailer formed by concentrically C-folding a single sheet of paper. The narrow portion of the mailer is the front of the reply envelope, and a statement, coupon, etc., adapted to be placed into the return envelope, is connected to the return envelope by a perforation line when the mailer is opened. A vertical perforation separates the mailer into two parts, one part comprising the return envelope and statement or coupon when opened, and the other part being a six-part booklet, and including the outgoing address information which typically is visible through a window in the mailer front face. To facilitate opening, where a horizontal perf is to be torn the mailer has only a double thickness instead of a triple thickness.

It is desirable to construct mailer type business forms so that they may be made as simply as possible, yet at the same time contain as much information as possible. It is also highly desirable to have a reply envelope with many mailers. All of these desideratum are accomplished according to the invention by providing an intermediate, and then a final mailer, that is formed by eccentrically C-folding a single sheet of paper.
The mailer according to the invention is particularly advantageous because the components thereof, especially forming the return envelope portion, are disposed so that to open the mailer along the longitudinal dimension thereof, one needs only to detach at a perforation where the mailer is only two plies thick instead of three plies thick. Thus, the mailer is easy to open. As soon as the mailer is opened, the reply envelope is readily accessible, and the reply envelope is formed with a statement or coupon portion connected along one edge thereof by a perforation. Thus, one has the coupon or statement that is desirably returned in the reply envelope connected to the envelope so that it cannot get lost.
Also, according to the invention, one opens the mailer along a central vertical perforation in addition to the longitudinal perforation, the vertical perforation dividing the mailer into two parts, one part comprising the return envelope with attached statement or coupon, and the other forming a "booklet" having six parts (faces), with pages of the booklet detachable from each other. The mailer has a maximum amount of area that can be imaged with indicia that is useful, or the "booklet" part can be a coupon book or the like.
According to one aspect of the present invention, an intermediate for a mailer type business form is provided from a single sheet of paper having front and back faces, parallel top and bottom edges, and first and second parallel side edges. The intermediate comprises: First and second lines of weakness extending parallel to the top and bottom edges, and defining the sheet into first, second, and third panels, the first and second lines of weakness being positioned so that the first panel is bordered by the top edge and the first line of weakness, and is smaller than the second and third panels, which are substantially identical in size, the second panel between the first and third panels. A third line of weakness extending between the top and bottom edges parallel to the side edges and spaced a substantial distance from the side edges to define each of the panels into first and second sub-panels, the first sub-panel of each being defined by the first side edge, and the second sub-panel of each being defined by the second side edge. The first sub-panel of the first panel back face comprises reply addressee indicia imaged thereon. The first sub-panel of the third panel back face having a first non-heat seal adhesive pattern disposed thereon generally parallel to the top edge, and adjacent the second line of weakness. And, second adhesive pattern means disposed adjacent the first and second side edges, and the bottom edge, for sealing the panels together when folded into a mailer about the first and second lines of weakness.
The outgoing addressee indicia is preferably imaged on the back face of the second sub-panel of the first panel spaced a first predetermined distance from the first line of weakness, and a cutout is formed in the second sub-panel of the second panel also spaced substantially the first predetermined distance from the first line of weakness, so that when the sheet is folded into a mailer about the first and second lines of weakness, the outgoing addressee indicia is visible through the cutout.
The intermediate also comprises third and fourth adhesive patterns disposed on the back face of the first sub-panel of the third panel generally parallel to the side edges, the third adhesive pattern being adjacent but spaced from the first side edge, and the fourth adhesive pattern adjacent the third line of weakness, the third and fourth adhesive patterns cooperating with the first sub-panel front face to form a reply envelope when the sheet is folded about the first and second lines of weakness. The second adhesive pattern means preferably comprises a fifth strip of adhesive extending between the third and fourth adhesive patterns on the back face of the first sub-panel of the third panel, with a continuation thereof extending on the back face of the second sub-panel of the third panel, and sixth and seventh strips of adhesive extending on the back face of the second and third panels adjacent the first and second side edges, respectively, substantially the entire length of the second and third panel. The second adhesive pattern means and the third and fourth adhesive patterns may be heat seal, permanent adhesive, or pressure activated adhesive such as used with the "SpeediSealer.RTM." sealing device sold by Moore Business Forms, Inc., of Lake Forest, Ill. The first adhesive pattern may be rewettable adhesive, or pressure sensitive adhesive covered by a strip of release paper. Security screen indicia may be imaged on the back face of the first sub-panel of the third panel.
The intermediate may also comprise fourth and fifth lines of weakness formed in the second or third panels, respectively, parallel to, adjacent, equi-distant from and straddling the second line of weakness. The fifth line of weakness is immediately adjacent the first adhesive pattern and closer to the second line of weakness than the first adhesive pattern. The fourth and fifth lines of weakness are closer to the second line of weakness than the top edge when the first panel is folded about the first line of weakness. Outgoing addressee indicia is imaged on the front face of the second panel, adjacent, but spaced from, the second line of weakness, and outgoing return addressee indicia is imaged on the front face of the second panel adjacent the fourth line of weakness, and spaced further from the second line of weakness and the fourth line of weakness is spaced from the second line of weakness.
According to another aspect of the present invention, a mailer type business form is provided. The mailer comprises the following elements: First, second, and third plies, the first ply sandwiched between the second and third plies. The second and third plies both having a first width and first length, and the first ply having the first length but a second width, less than the first width; and each of the plies having top and bottom faces, and plies first and second side edges. The first ply has reply address indicia imaged on the top face thereof. Permanent adhesive means are disposed between the third ply top face and the first ply bottom face for forming a return envelope including a flap, the flap being formed by the third ply and extending with respect to the first ply so that no portion of the first ply overlaps the flap. Addressee-activatable adhesive is disposed on the flap top face. Aligned first and second lines of weakness are formed in the second and third plies respectively adjacent the flap, at a point wherein no portion of the first ply overlaps the lines of weakness; and a third line of weakness connects an edge of the second ply opposite the first line of weakness with an edge of the third ply. And, indicia is imaged on the bottom face of the second ply, the bottom face of the second ply in face-to-face engagement with the top face of the first ply.
The mailer may also include outgoing return addressee indicia imaged on the top face of the second ply adjacent the first line of weakness, and postage placement indicating indicia imaged on the bottom face of the third ply flat portion.
The permanent adhesive means for forming the reply envelope may comprise: A first strip of adhesive spaced a substantial distance from the first and second side edges and parallel thereto, and a second strip of adhesive adjacent, but somewhat spaced from, the first edge. It may further comprise a third strip of adhesive adjacent the second edge holding the top face of the first ply in contact with the bottom face of the second ply, a fourth strip of adhesive adjacent the second edge holding the bottom face of the first ply in contact with the rod face of the second ply, a fifth strip of adhesive closer to the first edge than the second strip for holding the top face of the first ply in contact with the bottom face of the second ply, and a sixth strip of adhesive closer to the first edge than the second strip for holding the bottom face of the first ply in contact with the top face of the second ply. Third, fourth and fifth aligned lines of weakness may also be formed in the first, second and third plies, respectively, extending parallel to the side edges, adjacent the first strip of adhesive, but closer to the second edge than the first strip of adhesive. A seventh strip of adhesive is disposed between the fifth line of weakness and the second edge for holding the bottom face of the first ply in contact with the top face of the third ply. Also, a sixth line of weakness may be formed in the first ply and extend between the third line of weakness and the second edge immediately adjacent the seventh strip of adhesive. A cutout and outgoing addressee indicia may be provided in the second and on the first plies, respectively, as described above with respect to the intermediate. Also, there may be sixth through eighth and ninth through eleventh lines of weakness extending parallel to and adjacent the first and second edges, respectively, in the first, second and third plies, respectively, for allowing ready detachment of the third through sixth strips of adhesive from the rest of the plies, to facilitate opening of the mailer.
The invention also comprises a method of opening a multi-ply mailer having a built-in return envelope, and having top, bottom and first and second side edges. The mailer has a first line of weakness extending through all plies between the top and bottom thereof spaced a substantial distance from both the first and second edges, and a second line of weakness extends between less than all plies, immediately adjacent and parallel to the top. Outgoing addressee indicia is visible from the outside of the mailer, the outgoing addressee indicia being right-side up when the top of the mailer is above the bottom. The method comprises the steps of: (a) Tearing the mailer along the first line of weakness to separate it into two components, one component including a return envelope, and to gain access to the second line of weakness. Then, (b) tearing each of the two components along the second line of weakness to gain access to the interior of the two components, including the return envelope. The mailer also preferably comprises third and fourth lines of weakness extending parallel to the first line of weakness through all plies of the mailer adjacent the first and second side edges, respectively. There is a further step (c) of, prior to step (b), tearing the mailer at the third and fourth line of weakness.
It is a primary object of the present invention to provide a versatile, easy open, mailer that may be formed by eccentrically C-folding a single sheet of paper, and an intermediate and method of opening associated therewith. This and other objects of the invention will become clear from an inspection of the detailed description of the invention and from the appended claims.


The purpose of the present invention is to inhibit a decrease in strength attribute to the interface between a simple-shape portion and a complicated-shape portion. This fiber-reinforced resin composite material comprises: a simple-shape portion formed from at least one sheet-shaped prepreg material obtained by impregnating reinforcing fibers with a resin; and a complicated-shape portion obtained by impregnating reinforcing fibers with a resin, the complicated-shape portion having been integrated with the simple-shape portion. The resin used for the prepreg material comprised the same components as the resin used for the complicated-shape portion.

A fiber-reinforced resin composite material (FRP: Fiber Reinforced Plastics) has been widely used as a fiber-reinforced resin composite material used for structural members of aircrafts, land vehicles, watercrafts and the like. Such a fiber-reinforced resin composite material include, as a simple-shape portion, an outer panel formed of a sheet(s) of a prepreg material(s) formed of a carbon fiber(s) impregnated with a resin(s), and as a complex-shape portion, a reinforcing portion formed of a fiber-reinforced resin(s) such as a beam (girder), rib, longeron and the like or a supporting member formed of a fiber-reinforced resin(s) such as a bracket or both, which reinforcing portion and supporting member are integrally provided on the interior side of the outer panel.
To efficiently integrate such a simple-shape portion and complex-shape portion, a technique to form a fiber-reinforced resin composite material by Vacuum-assisted Resin Transfer Molding (VaRTM) has been developed in recent years (see Non-Patent Document 1, for example).

Fiber-reinforced resin composite material and method for producing same


Magnetic recording apparatus for photographic still camera comprises a magnetic head mounted on a film platen to contact a magnetic coating on the film. A pressure pad on the opposite side of the film urges the film into contact with the head. The head is inclined transversely of the film to conform to the transverse film curl and is provided with angled surfaces to provide for better wrap of the film around the head and easier threading.

This invention relates to magnetic recording apparatus for cameras and more particularly, to magnetic recording apparatus for photographic still cameras.
In commonly assigned copending application Ser. No. 255,693 entitled FILM INFORMATION EXCHANGE SYSTEM USING DEDICATED MAGNETIC TRACKS ON FILM, and filed Oct. 7, 1988 in the name of Robert P. Cloutier there is disclosed a photographic film having a virtually transparent magnetic coating covering the non-emulsion side of the film and dedicated recording areas on the coating for recording information such as film type, film speed, film exposure information and information relevant to the processing and subsequent use (e.g. printing) of the film. The system thus provides for recording of information during film manufacture, reading and/or recording of information during camera use, and reading and/or recording of printed related information during photofinishing. In the aforementioned copending application it is specifically proposed that camera information be recorded in spaced tracks preferably outside the image area along the edge of the film.
Reading and writing information on a magnetic coating or stripe on photographic film in a still camera requires solutions to problems different than those encountered in other apparatus. Perhaps the most significant problem is the space limitations in a portable hand held still camera which necessarily must be as compact and light as possible to appeal to the average consumer. Perhaps equally significant, however, is the characteristics of photographic film relative to more common recording mediums such as magnetic tape. Because photographic films are stiffer than magnetic tape and have varying degrees of curl both in the longitudinal and transverse directions depending upon the base materials and number and nature of sensitizing layers and environmental conditions, they present unusual problems in reading and writing information on a magnetic coating or stripe. To provide a reliable read or write signal the magnetic head must remain in close proximity to the magnetic coating. Any disturbances such as variations in film curl can vary the relationship of the head to the coating and decrease the reliability of the signal.
Another problem unique to compact photographic still cameras is that film advance occurs in a short period of time with a limited amount of motion and does not allow the steady state conditions normally associated with magnetic recording. Recording and playback must take place during transient conditions which tend to separate the film from the recording head. For optimum magnetic recording during these conditions, the magnetic head must maintain contact (i.e. within 10 micro-inches) with the magnetic coating.
Techniques for maintaining the desired relationship of the head to a magnetic coating in other apparatus, are not practical for use in a photographic still camera particularly a compact 35 mm camera. For example, in a sound movie camera, a film having a magnetic stripe along one edge is typically moved over a drum and information is recorded by a magnetic head positioned in close proximity to the drum. The drum provides a rigid support for the film, removes film curl and assures a uniform head to film relationship. While such a fixed support such as a sound drum produces satisfactory results, the space limitations in a photographic still camera render it impractical. Also, it is not suitable for the transient conditions described above.
Also, in a still camera system, it is desirable to record information pertinent to and coincident with images because negatives are cut up in photofinishing. In sound movie cameras, recorded information is displaced from the image to achieve continuous motion of the film during recording as compared with intermittent motion during exposure.
The prior art relating to recording on photographic films thus generally teaches providing a support for the recording medium on the side opposite from the recording head and continuous motion of the recording medium to ensure reliable recording.
Commonly assigned copending application Ser. No. 254,908 filed Oct. 7, 1988 in the names of Robert P. Cloutier and Daniel M. Pagano discloses magnetic recording applications for a photographic still camera wherein a magnetic recording head mounted in a fixed position in a film platen. A pressure pad on the other side of the film urges the film into contact with the head. To avoid distortion of the film by the pad pressure during exposure, the pressure pad is retracted during exposure of the film. While this approach achieves the desired recording reliability it requires special parts for retracting the pressure pad.

Camera apparatus for magnetically recording on film


A dual ratchet pawl jacking system, device, and method are presented for raising and/or lowering a platform bearing carriage along a vertical support. The ratchet pawls alternate supporting the weight of the carriage by engaging against a series of lugs on the vertical support. A first pawl is attached to the main frame of the carriage, and a second pawl is attached to a sub-carriage assembly that slides upward and downward within the carriage frame. A hydraulic jack applies a force upon the sub-carriage, causing the sub-carriage to move within the frame. The weight of the carriage is alternately borne by each pawl as the other pawl is relocated to a new lug. A pair of triggers is used to retract the first pawl and second pawl from the support. The triggers may be enabled to facilitate lowering the carriage, or disabled to facilitate raising the carriage.

Concrete casting techniques may utilize spaced forms held in position by supports movable up a wall under construction. Concrete is poured between the forms and on top of earlier formed sections of the wall. Examples of construction using such techniques include cooling towers and smokestacks. Prior art jacking systems are primarily concerned with ascending, where the movable rig is raised until the structure is constructed, and then the rig is disassembled for removal.
In general, a dual pawl system may raise a carriage along a vertical support. Two pawls alternate supporting the weight of the carriage by engaging against a series of protruding or recessed lugs evenly spaced upon the vertical support. As a force is applied to the carriage, the weight of the carriage is alternately borne by one pawl as the other pawl is relocated to a new lug located immediately above the previous lug as the carriage is raised.
An example of a prior art ascending jacking system is shown by FIG. 1A. A platform bearing carriage 100 ascends a vertical support 170 as concrete forms are poured and installed. FIG. 1B shows a detail of the jacking system of the prior art carriage 100. Generally, a lower pawl assembly 130 and an upper pawl assembly 120 alternately support the weight of the carriage 100 upon a plurality of lugs 175 spaced along the vertical support 170 as the carriage ascends. A hydraulic jack 110 extends and retracts a plunger 115 attached to the upper pawl assembly 120. As the plunger extends, the upper pawl assembly 120 is engaged with a lug 175, bearing the weight of the carriage 100 as weight is relieved from the lower pawl assembly 130, allowing the lower pawl assembly to ascend. The spring loaded lower pawl assembly 130 retracts slightly as it passes over a lug 175, and then is forced against the vertical support 170 as the lower pawl assembly 130 clears the lug 175. Similarly, as the hydraulic jack 110 retracts the plunger 115, the lower pawl assembly 130 supports the carriage 100 as the upper pawl assembly 120 is raised.
The prior art carriage 100 is only configured to ascend the vertical support 170. A typical concrete pouring system may incorporate multiple carriages to simultaneously support and raise a number of platforms. However, ascending only jacks are not generally practical for maintenance, repair, or rebuilding of structures, for example, smokestacks and cooling towers, because they cannot easily be moved to lower positions. While some prior art jacking systems are capable of descending, they do not do so easily or automatically. In particular, descent may require manual releasing of individual supports, but it is generally impractical to release multiple supports simultaneously.
Therefore, there is a demonstrated need in the industry for a jacking system that addresses some or all of these deficiencies.


A drive assist system includes: wireless communication devices on first and second vehicles. The wireless communication device on the first vehicle includes: a distance calculation device for calculating a satellite positioning distance between the first and second vehicles; and a difference calculation device for calculating a distance difference between the satellite positioning distance and a distance to the second vehicle obtained by a ranging sensor in the first vehicle. The wireless communication device of the second vehicle includes: a distance calculation device for calculating a satellite positioning distance between the second vehicle and a third vehicle; and an inter-vehicle distance determination device for estimating an inter-vehicle distance between the second and third vehicles based on the distance difference and the satellite positioning distance calculated by the distance calculation device of the second vehicle, assuming the inter-vehicle distance is not detected by a ranging sensor in the second vehicle.

There is an adaptive cruise control (ACC) system that automatically controls an inter-vehicle distance between an own vehicle and a leading vehicle by detecting an inter-vehicle distance between the own vehicle and the leading vehicle using a ranging sensor, such as a laser radar. For example, Patent Document 1 discloses a technique of performing ACC by detecting an inter-vehicle distance between the own vehicle and the leading vehicle using a laser radar or a millimeter-wave radar.
Patent Document 1 also discloses, as a method of detecting an inter-vehicle distance between the own vehicle and one other vehicle, a method of utilizing a satellite positioning system, such as a GPS (Global Positioning System), and vehicle-to-vehicle communications as well as problems of this method. According to this method, a location of the other vehicle positioned by a receiver of the satellite positioning system installed to the other vehicle is obtained by vehicle-to-vehicle communications. Then, an inter-vehicle distance between the own vehicle and the other vehicle is obtained by calculating a distance between a location of the own vehicle positioned by a receiver of the satellite positioning system installed to the own vehicle and the location of the other vehicle obtained by vehicle-to-vehicle communications.
Patent Document 1 discloses that the method of detecting an inter-vehicle distance using the satellite positioning system and vehicle-to-vehicle communications has a problem that an error is significant in comparison with a method using a ranging sensor. The technique disclosed in Patent Document 1 therefore uses a value of an inter-vehicle distance calculated by a ranging sensor, such as a laser radar and a millimeter-wave radar, as a value of an inter-vehicle distance between the own vehicle and the leading vehicle.
Patent Document 1: JP-A-2007-280060
In comparison with the method using a satellite positioning system and vehicle-to-vehicle communications, the method of detecting an inter-vehicle distance between the own vehicle and the leading vehicle using a ranging sensor can detect an inter-vehicle distance between the own vehicle and the leading vehicle precisely. However, not all the vehicles are equipped with a ranging sensor, such as a laser radar, and the technique in the related art therefore has a problem that the technique lacks versatility.
Also, even when a vehicle is equipped with a ranging sensor, the vehicle may fail to detect an inter-vehicle distance between the own vehicle and the leading vehicle using the ranging sensor depending on cruising environments, such as a case where a probing wave from the ranging sensor misses the leading vehicle on a curve or slope. In a case where the vehicle fails to detect an inter-vehicle distance between the own vehicle and the leading vehicle using the ranging sensor, an inter-vehicle distance detected using a satellite positioning system and vehicle-to-vehicle communications may be used instead. However, as has been described above, an error is significant with the method using a satellite positioning system and vehicle-to-vehicle communications in comparison with the method using the ranging sensor. Hence, there arises a problem that detection of an inter-vehicle distance between the own vehicle and the leading vehicle becomes less accurate.

Drive assist system and wireless communication device for vehicle


A repair circuit and related method of repair are disclosed. In the repair circuit, row repair or column repair control units are selectively actuated to perform respective repair functions within a semiconductor memory device in relation to a commonly provided defective address. Both post-package defects and/or before package defects may be repaired in response to the defective address.

1. Field of the Invention
The present invention relates to semiconductor memory devices. More particularly, the present invention relates to a repair circuit and a method of repairing defects in a semiconductor memory device.
This application claims priority under 35 USC § 119 to Korean Patent Application No. 2005-117258, filed on Dec. 3, 2005, the subject matter of which is incorporated herein in its entirety by reference.
2. Description of the Related Art
A semiconductor memory device generally includes a main memory array having a plurality of memory cells, and a redundant memory array having redundant memory cells adapted for use in the repair of defective memory cells in the main array. It is preferable that all memory cells of the main memory array operate normally. However, defective memory cells are often formed within the main memory array due to variations in the manufacturing processes used to fabricate the memory cells as well as variations in electrical performance characteristics across a large number of memory cells. When a defective memory cell is identified in the main memory array, it may be replaced (or substituted) with one of the redundant memory cells. This capability ensures uniformly acceptable memory cell performance across the entire main memory array.
In general, at various stages during the lengthy sequence of fabrication processes used to manufacture a semiconductor memory device, tests are performed to determine whether or not the memory cells are operating normally. After each test, a memory cell identified as defective may be replaced with a redundant memory cell. This test, identification, and replacement procedure is typically performed while the semiconductor memory device is still in its "wafer state", i.e., before individual dies are cut from the fabrication wafer and packaged into individual device form.
There are many different types of memory cell defects, including row related defects and/or column related defects. That is, while some memory cell defects are identified in relation to a particular memory cell, memory cell defects are more commonly identified as a defective row or column. As a result, semiconductor memory devices require both a row repair circuit and a column repair circuit in order to remedy row defects and column defects, respectively.
Conventional repair techniques may be divided into before-package repair (BPR) techniques—adapted to repair identified defects in wafer state devices, and post-package repair (PPR) techniques—adapted to repair defects in a packaged devices. PPR techniques are commonly used to repair defective memory cells which remained unidentified in the wafer state, but which were subsequently identified during package level testing. Both PPR and BPR techniques require row repair and column repair circuits.
Some PPR techniques use electrical fuse circuits (e-fuses) instead of laser fuse circuits to repair defective memory cells and improve package yield for the semiconductor memory devices. E-fuse circuits offer several performance advantages, but tend to be more complicated in their layout relative to laser fuse circuits. Thus, conventional PPR techniques incorporating both the row and column repair circuits using e-fuse circuits occupy an unacceptably large layout area within the overall semiconductor memory device. This quality is at odds with continuing pressure to increase the fabrication density of memory devices.

Repair circuit and method of repairing defects in a semiconductor memory device


A hood prop member for a vehicle is provided having a support rod that has a first end configured to attach proximate a firewall of the vehicle, and a second end configured to couple proximate to a body panel of the vehicle. A prop rod having a connection end and a pivoting end is provided. The pivoting end is pivotingly attached proximate an end of the support rod. A hood attachment bracket is configured to attach to a hood of the vehicle. A storage connection point is attached to the support rod proximate an end opposite an end to which the pivoting end of the prop rod is proximately coupled. The connection end is attachable to the storage connection point in a hood-down position. The connection end is also attachable to the hood attachment bracket and configured to maintain the hood of the vehicle in a hood-raised position.

In a number of vehicles, a support member is provided that spans between the vehicle's firewall and another body portion of the vehicle, such as a fender or front grill, for example. The object of the support member is to aid in the alignment of the body portion to which it connects, and also to provide structural integrity to the vehicle's body assembly. Such support members are often rods that are relatively thin and made of relatively soft metals, thus allowing movement or "play" in the vehicle portions to which it connects. This is especially the case when the vehicle hood is in the open position, as any additional support provided by the hood when latched to the vehicle body is removed.
To exacerbate this issue, hoods tend to be relatively heavy, and are often supported by hinges that attach to a vehicle portion that relies on support provided by a support member. Therefore, when the hood is open, not only is the support provided by the hood absent, but the entire weight of the hood is redistributed to a weakly supported body portion, adding further strain to weak support members.
Custom or show vehicles are often displayed with the hood up so that show participants and judges may view the interior of the vehicle's engine compartment. Often, such events are held outside where wind may catch the large surface area of the hood and drastically increase the forces on support members, related body portions, and the hood itself. Wind gusts may thus be responsible for bending and even shearing support members, related body portions, the hood itself, etc.
Additionally, hoods generally rest on a hood prop using gravity alone to maintain the connection between the hood and the hood prop. Wind may easily jolt the hood off a standard hood prop, which results in a forceful slamming of the hood into the down position or even in the direction opposite from closing. In either case, hood separation, bending, and/or other vehicular damage may occur. Even worse, bodily injury or death may occur to nearby individuals.
The present invention provides a support member that bolsters vehicular structural integrity when in one position, yet provides a hood locking mechanism when in another position.

Vehicle hood prop member and related method


The present invention provides compositions and methods for inhibiting one or more diacylglycerol kinase (DGK) isoform in a cell in order to enhance the cytolytic activity of the cell. In one embodiment, the cells may be used in adoptive T cell transfer. For example, in some embodiments, the cell is modified to express a chimeric antigen receptor (CAR). Inhibition of DGK in T cells used in adoptive T cell transfer increases cytolytic activity of the T cells and thus may be used in the treatment of a variety of conditions, including cancer, infection, and immune disorders.

Elicitation of T-cell effector responses requires signal transduction through the T-cell antigen receptor (TCR), a protein complex that binds antigenic peptide presented by MHC, as well as through costimulatory receptors such as CD28. The effector responses generated from TCR signal transduction differ across individual T-cell subsets that are classified according to the expression of cell surface molecules (Smith-Garvin et al., 2009, Annu Rev Immunol 27:591-619). Expression of the surface molecule CD8, for instance, identifies a subset of T cells that respond to antigenic peptides presented in the binding groove of MHC class I. CD8+ T cells are responsible for the recognition and elimination of cells that express antigens derived from intracellular pathogens, such as viruses and intracellular bacteria, and also mutated or embryonic proteins generated by cells that have undergone malignant transformation. Although the extent to which CD8+ T cells are capable of controlling the development and progression of tumorigenesis remains uncertain, it is clear that deficiency of these cells increases the potential for the development of malignancy and that enhanced function of these CD8+ T cells can impart robust antitumor responses in both animal model systems and patients (Turcotte & Rosenberg, 2011, Adv Surg 45:341-60; June, 2007, J Clin Invest 117:1466-76). It is also clear in a number of models that although there may be an initial, potent CD8+ T-cell response, this response is often insufficient to fully protect from tumors (Schreiber et al., 2011, Science 331:1565-70). Mechanisms underlying this failure include (i) the lack of specific antigens with sufficient avidity for the TCR expressed by tumors, (ii) the absence of costimulatory ligands expressed by antigen-presenting cells (APC) within tumor-draining lymph nodes, and (iii) direct suppression of T-cell responses within the tumor microenvironment mediated by inhibitory secreted factors such as TGFβ, prostaglandin E (PGE)-2, or adenosine, as well as inhibitory cells, such as regulatory T cells (Quezada et al., 2011, Immunol Rev 241:104-18).
The potential for effective responses by CD8+ T cells in some instances of incurable malignancies, such as metastatic melanoma, has led to significant interest in defining ways to manipulate these cells to generate more potent responses as well as responses against a more diverse array of tumors. One promising approach has focused on engineering T cells to express chimeric antigen receptors (CAR). CARs are transmembrane fusion proteins that consist of an extracellular antibody domain capable of binding to a specific tumor antigen coupled to intracellular signaling domains from TCR and costimulatory components (Milone et al., 2009, Mol Ther 17:1453-64). In principle, CARs provide several advantages over the endogenous receptors of T cells. First, the engineered ligand-binding segment of CARs arises from an antibody, obviating the need for MHC presentation. Second, the antibody-binding component of the CAR can be chosen to be both specific and highly sensitive to antigens expressed selectively by tumor cells, increasing avidity of the T cell-tumor interaction and minimizing the potential for destruction of normal "bystander" host cells. Third, engagement of the CAR by ligand stimulates both TCR and costimulatory signaling modules, eliminating a requirement for expression of costimulatory ligands by tumor-draining APCs. CAR-expressing T cells that come into contact with tumor cells expressing the antigen of interest have been shown to develop functional responses that lead to tumor cell lysis and cytokine production.
There has been considerable success in the use of CARs in animal models (Milone et al., 2009, Mol Ther 17:1453-64; Dower et al., 2000, Nat Immunol 1:317-21), and recently, CAR-expressing T cells have been shown to be effective in patients to treat refractory chronic lymphocytic leukemias (CLL) (Chiang et al., 2007, J Clin Invest 117:1029-36; Loeser et al., 2007, J Exp Med 204:879-91). Although T cells engineered to express CARs are capable of overcoming some limitations of the endogenous immune system to combat tumors (e.g., CARs are not MHC restricted and hence will lyse tumor cells that have downregulated MHC expression), CAR-expressing T cells still lack intrinsic programming to overcome, perhaps, the most important component that limits CD8+ T-cell antitumor responses: the inhibitory tumor microenvironment.
However, there are a number of areas that appear to be important potential limitations to the success of CARs, especially for solid tumors. A major limitation is the loss of efficacy of the infused T cells. As reported by others (Ahmadzadeh et al., 2009, Blood 114:1537-1544; Whiteside, 2004, Cancer Immunol. Immunother. 53:865-878; Zippelius et al., 2004, Cancer Res. 64:2865-2873; Bronte et al., 2005, J. Exp. Med. 201:1257-1268; Prinz et al., 2012, J. Immunol. 188:5990-6000; Monu et al., 2007, Cancer Res. 67:11447-11454; Janicki et al., 2008, Cancer Res. 68:2993-3000), even when the T cells successfully traffic into tumors, in many instances, they appear to be inactivated within tumors rather rapidly. The mechanisms are not fully understood, but probably involve secreted immune-inhibitory factors such as TGFβ, PGE2, and adenosine within the tumor microenvironment, interactions with inhibitory leukocytes (i.e. T-regulatory cells and myeloid suppressor cells) and/or contact with inhibitory molecules on the surface of tumor cells.
The mechanisms of T cell inactivation are not well understood, especially in CARs, where, unlike native T cells, the signal transduction mechanisms have not been well studied. Thus, there is a need in the art to develop compositions and methods for enhancing T cell activation and killing ability during adoptive T cell transfer. The present invention satisfies this unmet need.

Inhibition of diacylglycerol kinase to augment adoptive T cell transfer

The Trustees of the University of Pennsylvania


According to the present invention, there is provided an artificial tendon-forming auxiliary instrument in which a valve cusp of a cardiac valve and a papillary muscle can be joined together with an artificial tendon through an easy procedure and the artificial tendon can be finished so as to have a desired length. According to an aspect of the present invention, an auxiliary instrument (100) is used for joining a valve cusp (210) of the cardiac valve and a papillary muscle (212) with an artificial tendon (200). A pair of end-portion support portions (20) and (21) respectively supporting the valve cusp (210) and the papillary muscle (212) is provided at both ends in a longitudinal direction. The auxiliary instrument (100) includes first and second tendon insertion ports through which the artificial tendon (200) is inserted, a tendon guide portion (30), and an instrument holding portion (40). The first and second tendon insertion ports are respectively formed in the pair of end-portion support portions (20) and (21) and have diameters greater than a diameter of the artificial tendon (200). The tendon guide portion (30) is formed so as to extend in the longitudinal direction across the first and second tendon insertion ports. The instrument holding portion (40) is formed in an intermediate portion of the tendon guide portion (30) in the longitudinal direction.

In accordance with progress in the medical technology, surgical treatment has been available for diverse spots inside a living body. For example, there is a known symptom such as mitral valve insufficiency caused due to a rheumatic disease or the like disrupting opening and closing of a valve cusp in the heart. As surgical treatment for treating such a symptom, there is a known technique called mitral valve plasty (MVP).
The structure of the heart and the MVP will be described below in detail.
The heart has the atriums and the ventricles on the right and left, in which the mitral valve, the tricuspid valve, the aortic valve, and the pulmonary arterial valve cause blood to flow in a predetermined direction and prevent the blood from flowing backward.
FIGS. 1A and 1B are schematic views of a heart 300 of a human being. For example, a mitral valve 310 is formed between a left atrium 302 and a left ventricle 304, and two valve cusps 210 protrude from the left atrium 302 toward the left ventricle 304. When the left atrium 302 contracts, the valve cusps 210 are open and a blood flow heads for the left ventricle 304. In addition, when the left ventricle 304 contracts, the valve cusps 210 are closed and the blood flow is prevented from flowing backward to the left atrium 302. Accordingly, the blood flow unilaterally heads for an aorta 320 from the left ventricle 304. A tricuspid valve 312, an aortic valve 314, and a pulmonary arterial valve 316 are respectively configured with three sets of valve cusps 210, thereby causing blood flows to respectively and unilaterally head for a right ventricle 308 from a right atrium 306, for the aorta 320 from the left ventricle 304, and for a pulmonary vein 322 from the right ventricle 308.
A normal valve cusp 210 is joined to a papillary muscle 212 positioned in front (on downstream side) of the valve cusp 210 in a blood flow direction, by tendons 214. In FIGS. 1A and 1B, in regard to the mitral valve 310 and the tricuspid valve 312, the papillary muscles 212 and the tendons 214 are illustrated. In regard to the aortic valve 314 and the pulmonary arterial valve 316, illustration thereof is omitted. The valve cusps 210 are joined to the papillary muscles 212 by the tendons 214, thereby being able to maintain a state of protruding forward (to downstream side) in the blood flow direction. When being closed, while maintaining a state where the valve cusps 210 protrude forward (to downstream side), the valve cusps 210 adhere to each other, thereby closing a cardiac valve. When the cardiac valve is closed, the papillary muscles 212 contract and tensile forces of the tendons 214 increase. Accordingly, against the pressure of the blood flow flowing backward, the protruding state of the valve cusps 210 is maintained and the valve cusps 210 have no chance to be inverted in a backward direction.
However, for example, regarding a case of the mitral valve 310, there is a symptom such as mitral valve insufficiency caused due to a rheumatic disease, tendon rupture, or the like disrupting opening and closing of the valve cusps 210. In a case of such a symptom, the tendons 214 joining the valve cusps 210 of the mitral valve 310 and the papillary muscles 212 are stretched or broken. Accordingly, even if the papillary muscles 212 contract, the valve cusps 210 are not sufficiently closed, or the valve cusps 210 are inverted toward the left atrium 302. Similarly, in regard to the aortic valve 314, the tricuspid valve 312, and the pulmonary arterial valve 316 as well, valvular insufficiency disrupting opening and closing of the valve cusps 210 has been reported.
In surgical treatment for such valvular insufficiency of the cardiac valve, a procedure (valvoplasty) of joining the valve cusps 210 and the papillary muscles 212 together is performed by using string-like artificial tendons which are artificially produced so as to copy the tendons 214. As described above, the procedure related to the mitral valve 310 is called the mitral valve plasty (MVP). The MVP is surgical treatment performed with respect to such a symptom while aiming at normalizing the operation of the valve cusps 210 by joining the valve cusps 210 and the papillary muscles 212 with the artificial tendons.
PTL 1 discloses an auxiliary device that is an instrument used in the mitral valve plasty and includes a papillary muscle contact portion which is brought into contact with a portion of a papillary muscle stitched with an artificial tendon, and a hook portion which hooks a side of the artificial tendon stitching a valve cusp. The hook portion is formed on a tip side of a rod-shaped holding portion. The papillary muscle contact portion at a distal tip of the auxiliary device, and the hook portion are provided so as to be separated from each other by a predetermined size. While the artificial tendon stitching the papillary muscle is pressed by the papillary muscle contact portion, when both ends of the artificial tendon are tied together on the hook portion, the artificial tendon can have a length matching the predetermined size. Accordingly, the papillary muscle and the valve cusp can be joined together with the artificial tendon having a desired length. In addition, PTL 1 discloses that in order to join the artificial tendon with a desired length, the auxiliary device corresponding to the length of the artificial tendon to be reconstructed is selected, and a trial corresponding to the desired length is attempted.

Artificial tendon-forming auxiliary instrument, somatometry instrument, and auxiliary instrument set


A flowchart-based programming and control system includes a computer with a processor, memory, and a display. A device is associated with a process. A flowcharting module executed by the computer generates and edits flowchart source code that contains action and decision blocks which define logic for operating the device to further the process. An external function can be called from one of the action and decision blocks during run time. The external function is executed by an external function module which receives input parameters and generates return values. The external function is preferably a dynamic link library (DLL). Since the external functions are loaded during run time only when they are needed, they do not consume system memory until they are used. The external functions provide an open architecture for the flowchart-based programming and control system and allows third parties to incorporate proprietary algorithms, complex math functions, and other application-specific functions to the flowcharting module.

The present invention relates to programming and control systems. More particularly, this invention relates to flowchart-based programming and control systems that call external functions from the flowchart.
Programming and control systems are generally used for controlling processes that involve devices such as relays, solenoids, motors, valves, switches, and other electrical and electromechanical devices. The processes that are controlled include machining, drilling, welding, spraying paint, mixing materials, assembling parts, handling materials, etc. Conventional programming and control systems generally used ladder diagrams and relay ladder logic (RLL) to control the operation of the devices associated with the processes. In practice, however, programmers tend to use a flowchart to initially define the operation of the devices in the process. Then, the programmers manually translate the flowchart into the ladder diagrams. The programmers employ the flowcharts as a first step because the flowcharts emulate human thought processes whereas the ladder diagrams do not.
Flowcharts generally include action blocks which represent an operation or action based on current input and output data. Action blocks generally have one entry point at the top and one exit point at the bottom. A branching or decision block is a diamond-shaped block which represents a branch in the control path based on the results of a decision. Branching blocks generally have one entry point at the top and two exit points at the side and the bottom. Using the action and branching blocks, a programmer creates a flowchart which controls one or more devices that are associated with a process. In contrast, some RLL controllers include over two hundred distinct instructions which are understandably difficult to remember, let alone implement. Flowcharts dramatically simplify the programming and control of the devices. One flowchart-based system is disclosed in xe2x80x9cContinuous Flowchart, Improved Data Format and Debugging System For Programming and Operation of Machinesxe2x80x9d, U.S. Pat. No. 4,852,047, which is hereby incorporated by reference.
A significant problem encountered with both flowchart-based and RLL-based programs is the integration of custom functions such as proprietary algorithms, complex mathematical calculations, and/or other application-specific functions. As a programmer, it is impossible to accommodate all of the unique applications for a programming and control system in advance. Even if it could be done, the resulting system would require too much memory and other system resources. If the proprietary algorithms and/or special functions are incorporated into the flowchart-based program, any corrections, changes, or improvements to the algorithms and/or special functions may affect the operation of the entire program.
The flowchart-based programming and control system according to the invention provides an open programming environment. The system incorporates external functions which can be called from flowchart blocks. The external functions are loaded during run time only when they are needed. Therefore, the external functions do not consume system memory until they are used. Because the external functions are stored in a separate file, a programmer can make corrections, changes, and/or improvements to the external function without affecting the operation of the flowchart-based programming and control system which calls the external function. Furthermore, because the external function may contain an external function that is used in a variety of circumstances, the programmer can reuse external function for multiple flowchart-based programming and control applications as well as non-flowchart based programs.
For a more complete understanding of the invention, its objects and advantages, reference may be had to the following specification and to the accompanying drawings.

Flowchart-based control system including external functions